BACKGROUND OF THE INVENTION This invention is in the field of solid-state memories.","Embodiments of this invention are more specifically directed to the sensing of stored data states in one-time programmable non-volatile memory.","Non-volatile solid-state read/write memory devices are commonplace in many modern electronic systems, particularly in portable electronic devices and systems.","Conventional types of non-volatile solid-state memory devices include those referred to as electrically programmable read-only memory (EPROM) devices.","Modern EPROM memory cells include one or more “floating-gate” transistors that store the data state.","In a general sense, these floating-gate transistors are “programmed” by the application of a bias that enables holes or electrons to tunnel or be injected through a thin dielectric film onto an electrically isolated transistor gate element, which is the floating gate of the transistor.","This trapped charge on the floating gate will modulate the apparent threshold voltage of the memory cell transistor, as compared with the threshold voltage with no charge trapped on the floating gate.","This difference in threshold voltage can be detected by sensing the resulting difference in source-drain conduction, under normal transistor bias conditions, between the programmed and unprogrammed states.","Some EPROM devices are “erasable” in that the trapped charge can be removed from the floating gate, for example by exposure of the memory cells to ultraviolet light (such memories referred to as “UV EPROMS”) or by application of a particular electrical bias condition that enables tunneling of the charge from the floating gate (such memories referred to as electrically-erasable or electrically-alterable, i.e., EEPROMs and EAPROMS, respectively).","“Flash” memory devices are typically realized by EEPROM memory arrays in which the erase operation is applied simultaneously to a “block” of memory cells.","Because of the convenience and efficiency of modern EPROM and EEPROM functions, it is now commonplace to embed non-volatile memory arrays within larger scale integrated circuits, such as modern complex microprocessors, digital signal processors, and other large-scale logic circuitry.","Such embedded non-volatile memories can be used as non-volatile program memory storing software routines executable by the processor, and also as non-volatile data storage.","On a smaller scale, non-volatile memory cells can realize control registers by way of which a larger scale logic circuit can be configured, or can be used to “trim” analog levels after electrical measurement.","As known in the art, “one-time programmable” (“OTP”) memories are also popular, especially in embedded non-volatile memory applications as mentioned above.","The memory cells of OTP memories are constructed similarly or identically as UV EPROM cells, and as such are not electrically erasable.","But when mounted in an opaque package, without a window through which the memory can be exposed to ultraviolet light, the UV EPROM cells may be programmed one and only one time.","In embedded applications, OTP memories are useful for storing the program code to be executed by the embedding microcontroller or microprocessor.","In any type of solid-state semiconductor memory, data path timing for the read operation is critical in the performance of the memory device.","As fundamental in the art, memory cells in conventional OTP and other solid-state memories are typically accessed by selecting a row of cells in the array according to a row address, coupling the storage device in each of those cells to a corresponding bit line to establish a voltage or current on each bit line according to the data state stored in its corresponding cell.","Sense amplifiers sense the state of the bit lines to determine the data states of the accessed cells, and these sensed data states are then latched and communicated along the output data path of the memory.","Accurate sensing of the stored memory cell state must be maintained over varying voltage and temperature conditions, variations in manufacturing parameters, and in the presence of system noise.","As known in the art, the noise margin of the read operation, which depends on timing precision in the read circuitry, in large part determines the minimum memory cell size required to provide the necessary read current and thus the memory density in bits per unit “chip” area.","This precision of the sense circuitry is due in large part to the timing at which the sense amplifiers operate to amplify and latch the data state represented by the bit line signals.","In each cycle, time must be provided to allow the accessed memory cells to develop a voltage or current on the bit lines, before the amplification and latching of those bit line levels as the data states read from the accessed cells.","On one hand, if the data are latched too early in the cycle, before the bit line signal has fully developed, the data read is vulnerable to error from noise.","On the other hand, latching the data later than is necessary for reliable sensing will unduly lengthen the read cycle time and thus limit the performance of the device.","It has been observed that the optimization of data path timing for read cycles in modern memory architectures can be quite difficult.","One conventional technique for setting the read path timing is to generate a sense amplifier enable signal from a row enable control signal that gates the word line drivers, but with a delay element such as a chain of logic inverters establishing the desired delay time following the driving of the selected word line before the sense amplifiers are enabled or sensed data are latched.","It has been observed, however, that the construction and thus the electrical characteristics of the memory cell transistors typically differ from that of the logic transistors making up the delay element.","Significant device mismatch can result which, along with localized variations in device behavior of these minimum size cell transistors, necessitates additional design margin (i.e., lengthened delay between the word line drive and the sense amplifier enable signal) to be built into the timing circuit.","This additional margin adversely impacts read cycle times.","Another conventional approach to determining sense amplifier timing in modern solid-state memories uses a “tracking” circuit based on replica, or “dummy”, memory cells that are constructed using the same transistor sizes as the cell transistors.","This approach is especially common in those memory technologies for which the replica cells can closely match the cell transistors in the main array, such as static random access memories (SRAMs).","Arslan et al., “Variation-Tolerant SRAM Sense-Amplifier Timing Using Configurable Replica Bitlines”, Custom Integrated Circuits Conference (IEEE, 2008), pp.","415-418, describes the incorporation of a replica column of memory cells implemented in or adjacent to the main memory array, in which the discharge of the replica bit line by a configurable number of dummy memory cells in that column drives the sense amplifier enable signal.","Amrutur et al., “A Replica Technique for Wordline and Sense Control in Low-Power SRAM's”, J.","Solid State Circuits, Vol.","33, No.","8 (IEEE, 1998), pp.","1208-19, describes a row of replica cells implemented in or adjacent to the main memory array, for which a dummy global word line is driven along with the global word line for the main array.","In some memory architectures, such as those used in conventional one-time-programmable (OTP) memory, the tracking circuit determines the time at which a data latch receiving the output of the sense amplifiers is enabled.","In one conventional OTP architecture, the sense amplifier responds asynchronously to the bit line levels to produce an output level that is latched into a read data latch at a point in the cycle determined by the tracking circuit.","FIG.","1 illustrates the functional architecture of a conventional OTP memory including a tracking circuit for timing the latching of the data sensed by sense amplifiers.","In this conventional architecture, the OTP bit cells are arranged as rows and columns in main array 2 , with the cells in the same row sharing a word line and those in the same column sharing a bit line BL, coupled to a corresponding one of main sense amplifiers 4 .","Control logic 5 represents timing logic circuitry that generates a word line enable signal WL_EN that gates the row decoder and word line drivers (not shown) to energize the selected word line in main array 2 in the read cycle (indicated by read enable signal READ), at the appropriate time responsive to a clock signal CLK.","In the manner discussed above, main sense amplifiers 4 asynchronously sense the state of bit lines BL and present corresponding output signals indicating the sensed data states to read data latches 6 .","In this conventional OTP architecture, read data latches 6 latch the output data D_OUT presented by main sense amplifiers 4 in response to a LATCH_DATA signal.","Tracking circuit 8 also generates a reset signal RESET to control logic 5 at this time, to allow the memory to prepare for the next cycle once the output data are latched at interval t 2 -t 1 from read data latches 6 .","According to this conventional OTP architecture, the timing of the LATCH_DATA signal is derived from a tracking circuit 8 that tracks the sensing of a data level stored at one or more replica memory cells 2 R following the energizing of the word line enable signal WL_EN.","Each replica cell 2 R is typically hard-wired to a particular data state, and is coupled to replica bit line RBL as word line enable signal WL_EN is energized.","If multiple replica cells 2 R are used, these cells 2 R are typically ganged together along one or more replica bit lines RBL to minimize the effects of local device variation.","Replica sense amplifier 4 R issues a signal to tracking circuit 8 in response to a transition at replica bit line RBL.","Tracking circuit 8 in turn generates the LATCH_DATA signal, which is (theoretically) at the time that replica sense amplifier 4 R produces a stable D_OUT state from the levels at replica bit lines RBL, plus an additional time margin to allow for variation over main array 2 .","For the reasons discussed above, the timing of this LATCH_DATA signal is critical in the overall performance of this OTP memory.","If the LATCH_DATA signal is applied to latches 6 too early in the cycle, the noise margin of the read operation is poor; if it is applied too late in the cycle, the cycle time of the memory is degraded.","It has been observed, however, that conventional tracking circuit approaches are limited in the precision with which sense amplifier or data latch timing can be attained in one-time programmable (OTP) memories.","As known in the art, the electrical behavior of OTP memory cells changes over the life of the device, for example because the charge stored at the floating gate of the bit cell transistor leaks or is otherwise weakened.","This change in behavior is typically reflected in degradation of the read performance of a programmed (i.e., “1” data state) cell over time.","Unfortunately, referring to FIG.","1 , replica OTP cells 2 R will degrade differently over time than will the average cells in main array 2 , if for no other reason because replica cells 2 R are accessed in each and every read cycle, while cells in main array 2 are accessed much less frequently, on average.","To avoid the resulting variation in read performance over time, many conventional OTP memories realize replica cells 2 R as non-programmable transistors, for example as p-channel MOS load transistors, so that the timing of the LATCH_DATA signal is invariant over the device life.","However, the use of different transistor types and arrangements for replica cells 2 R from those of the cells in main array 2 results in the tracking circuit and the actual data path exhibiting different behavior over variations in power supply voltage, temperature, and process parameters.","FIG.","2 a qualitatively illustrates the effect of variations in these parameters on the timing determination in the OTP memory of FIG.","1 .","In this example of FIG.","2 a , plot VBL BC exhibits the bit line voltage VBL BC for a “0” to “1” transition following energizing of the selected word line in main array 2 for a “best case” condition of power supply voltage, temperature, and process parameters.","As shown in FIG.","2 a, this bit line voltage VBL BC reaches a trip voltage Vtrip at a time t 0 , at which time the LATCH_DATA signal may be issued to read data latches 6 to accurately latch the output D_OUT of sense amplifiers 4 .","The “worst case” condition of voltage, temperature, and process on the development of the bit line voltage in this OTP memory is shown by plot VBL WC , which reaches the trip voltage Vtrip at a later time t 1 .","While the tracking circuit may be arranged to issue the LATCH_DATA signal at any time following worst case time t 1 , the construction of replica cells 2 R from different transistors than the memory cell devices in the main array 2 necessitates the implementation of some timing margin to account for the eventual degradation of the main array cells over system life.","Accordingly, the arrangement of replica cells 2 R, replica sense amplifier 4 R, and tracking circuit 8 in this conventional OTP memory is typically arranged so that the time at which the reference bit line voltage VRBL reaches the trip voltage Vtrip is later than the worst case time t 1 for main array 2 .","FIG.","2 a shows an example of this slower development of the reference bit line voltage VRBL, reaching trip voltage Vtrip at time t 2 .","This margin provided by the interval t 2 -t 1 directly impacts the cycle time of the memory.","FIG.","2 b illustrates the generation of a stable “1” level at the output D_OUT of sense amplifiers 4 following the issuance of the clock signal CLK to control logic 5 in this architecture.","The timing margin indicated by time interval t 2 -t 1 , after the worst case time at which the reference bit line voltage VRBL reaches the trip voltage Vtrip, accounts for degradation of the main array cells over device life.","In current-day OTP memories, this t 2 -t 1 margin can range from 30 nsec to as much as 100 nsec, depending on memory size.","This margin interval t 2 -t 1 can be a significant fraction of the overall cycle time Tcyc of the memory, and thus can affect the overall performance of the device."],[" SUMMARY Disclosed embodiments provide a timing architecture for the read data path in one-time programmable (OTP) memories in which memory cycle time is minimized.","Disclosed embodiments provide such a memory architecture in which the timing of the read data path adjusts with changes in bit cell performance over the operating life of the memory.","Disclosed embodiments provide such a memory architecture requiring minimal timing margin to account for cell degradation.","Disclosed embodiments provide such a memory architecture in which the read power consumption is reduced.","Disclosed embodiments provide such a memory architecture that can be realized by less complex circuitry than in conventional memories.","Other objects and advantages of the disclosed embodiments will be apparent to those of ordinary skill in the art having reference to the following specification together with its drawings.","According to certain embodiments, a programmable memory includes a read data path in which a transition in the data path itself is used to latch the data state sensed from an accessed memory cell.","Latch set-reset logic is provided so that, in a read operation, a transition at the output of a sense amplifier caused by a selected memory cell storing a programmed cell state, clocks a data latch to store that data state and to isolate its input from the sense amplifier.","The latch set-reset logic resets the data latch at the start of the next read cycle.","In some embodiments, a timer is provided so that the latch is reset after a time-out period in a long read cycle in which no data transition occurs."],["CROSS-REFERENCE TO RELATED APPLICATIONS This application is a divisional of and claims priority to U.S. patent application Ser.","No.","15/247,352, filed Aug. 25, 2016, which claims priority, under 35 U.S.C.","§ 119(e), of Provisional Application No.","62/269,737, filed Dec. 18, 2015, all of which are incorporated herein by this reference.","STATEMENT REGARDING FEDERALLY SPONSORED RESEARCH OR DEVELOPMENT Not applicable.","BACKGROUND OF THE INVENTION This invention is in the field of solid-state memories.","Embodiments of this invention are more specifically directed to the sensing of stored data states in one-time programmable non-volatile memory.","Non-volatile solid-state read/write memory devices are commonplace in many modern electronic systems, particularly in portable electronic devices and systems.","Conventional types of non-volatile solid-state memory devices include those referred to as electrically programmable read-only memory (EPROM) devices.","Modern EPROM memory cells include one or more “floating-gate” transistors that store the data state.","In a general sense, these floating-gate transistors are “programmed” by the application of a bias that enables holes or electrons to tunnel or be injected through a thin dielectric film onto an electrically isolated transistor gate element, which is the floating gate of the transistor.","This trapped charge on the floating gate will modulate the apparent threshold voltage of the memory cell transistor, as compared with the threshold voltage with no charge trapped on the floating gate.","This difference in threshold voltage can be detected by sensing the resulting difference in source-drain conduction, under normal transistor bias conditions, between the programmed and unprogrammed states.","Some EPROM devices are “erasable” in that the trapped charge can be removed from the floating gate, for example by exposure of the memory cells to ultraviolet light (such memories referred to as “UV EPROMS”) or by application of a particular electrical bias condition that enables tunneling of the charge from the floating gate (such memories referred to as electrically-erasable or electrically-alterable, i.e., EEPROMs and EAPROMS, respectively).","“Flash” memory devices are typically realized by EEPROM memory arrays in which the erase operation is applied simultaneously to a “block” of memory cells.","Because of the convenience and efficiency of modern EPROM and EEPROM functions, it is now commonplace to embed non-volatile memory arrays within larger scale integrated circuits, such as modern complex microprocessors, digital signal processors, and other large-scale logic circuitry.","Such embedded non-volatile memories can be used as non-volatile program memory storing software routines executable by the processor, and also as non-volatile data storage.","On a smaller scale, non-volatile memory cells can realize control registers by way of which a larger scale logic circuit can be configured, or can be used to “trim” analog levels after electrical measurement.","As known in the art, “one-time programmable” (“OTP”) memories are also popular, especially in embedded non-volatile memory applications as mentioned above.","The memory cells of OTP memories are constructed similarly or identically as UV EPROM cells, and as such are not electrically erasable.","But when mounted in an opaque package, without a window through which the memory can be exposed to ultraviolet light, the UV EPROM cells may be programmed one and only one time.","In embedded applications, OTP memories are useful for storing the program code to be executed by the embedding microcontroller or microprocessor.","In any type of solid-state semiconductor memory, data path timing for the read operation is critical in the performance of the memory device.","As fundamental in the art, memory cells in conventional OTP and other solid-state memories are typically accessed by selecting a row of cells in the array according to a row address, coupling the storage device in each of those cells to a corresponding bit line to establish a voltage or current on each bit line according to the data state stored in its corresponding cell.","Sense amplifiers sense the state of the bit lines to determine the data states of the accessed cells, and these sensed data states are then latched and communicated along the output data path of the memory.","Accurate sensing of the stored memory cell state must be maintained over varying voltage and temperature conditions, variations in manufacturing parameters, and in the presence of system noise.","As known in the art, the noise margin of the read operation, which depends on timing precision in the read circuitry, in large part determines the minimum memory cell size required to provide the necessary read current and thus the memory density in bits per unit “chip” area.","This precision of the sense circuitry is due in large part to the timing at which the sense amplifiers operate to amplify and latch the data state represented by the bit line signals.","In each cycle, time must be provided to allow the accessed memory cells to develop a voltage or current on the bit lines, before the amplification and latching of those bit line levels as the data states read from the accessed cells.","On one hand, if the data are latched too early in the cycle, before the bit line signal has fully developed, the data read is vulnerable to error from noise.","On the other hand, latching the data later than is necessary for reliable sensing will unduly lengthen the read cycle time and thus limit the performance of the device.","It has been observed that the optimization of data path timing for read cycles in modern memory architectures can be quite difficult.","One conventional technique for setting the read path timing is to generate a sense amplifier enable signal from a row enable control signal that gates the word line drivers, but with a delay element such as a chain of logic inverters establishing the desired delay time following the driving of the selected word line before the sense amplifiers are enabled or sensed data are latched.","It has been observed, however, that the construction and thus the electrical characteristics of the memory cell transistors typically differ from that of the logic transistors making up the delay element.","Significant device mismatch can result which, along with localized variations in device behavior of these minimum size cell transistors, necessitates additional design margin (i.e., lengthened delay between the word line drive and the sense amplifier enable signal) to be built into the timing circuit.","This additional margin adversely impacts read cycle times.","Another conventional approach to determining sense amplifier timing in modern solid-state memories uses a “tracking” circuit based on replica, or “dummy”, memory cells that are constructed using the same transistor sizes as the cell transistors.","This approach is especially common in those memory technologies for which the replica cells can closely match the cell transistors in the main array, such as static random access memories (SRAMs).","Arslan et al., “Variation-Tolerant SRAM Sense-Amplifier Timing Using Configurable Replica Bitlines”, Custom Integrated Circuits Conference (IEEE, 2008), pp.","415-418, describes the incorporation of a replica column of memory cells implemented in or adjacent to the main memory array, in which the discharge of the replica bit line by a configurable number of dummy memory cells in that column drives the sense amplifier enable signal.","Amrutur et al., “A Replica Technique for Wordline and Sense Control in Low-Power SRAM's”, J.","Solid State Circuits, Vol.","33, No.","8 (IEEE, 1998), pp.","1208-19, describes a row of replica cells implemented in or adjacent to the main memory array, for which a dummy global word line is driven along with the global word line for the main array.","In some memory architectures, such as those used in conventional one-time-programmable (OTP) memory, the tracking circuit determines the time at which a data latch receiving the output of the sense amplifiers is enabled.","In one conventional OTP architecture, the sense amplifier responds asynchronously to the bit line levels to produce an output level that is latched into a read data latch at a point in the cycle determined by the tracking circuit.","FIG.","1 illustrates the functional architecture of a conventional OTP memory including a tracking circuit for timing the latching of the data sensed by sense amplifiers.","In this conventional architecture, the OTP bit cells are arranged as rows and columns in main array 2, with the cells in the same row sharing a word line and those in the same column sharing a bit line BL, coupled to a corresponding one of main sense amplifiers 4.Control logic 5 represents timing logic circuitry that generates a word line enable signal WL_EN that gates the row decoder and word line drivers (not shown) to energize the selected word line in main array 2 in the read cycle (indicated by read enable signal READ), at the appropriate time responsive to a clock signal CLK.","In the manner discussed above, main sense amplifiers 4 asynchronously sense the state of bit lines BL and present corresponding output signals indicating the sensed data states to read data latches 6.In this conventional OTP architecture, read data latches 6 latch the output data D_OUT presented by main sense amplifiers 4 in response to a LATCH_DATA signal.","Tracking circuit 8 also generates a reset signal RESET to control logic 5 at this time, to allow the memory to prepare for the next cycle once the output data are latched at interval t2-t1 from read data latches 6.According to this conventional OTP architecture, the timing of the LATCH_DATA signal is derived from a tracking circuit 8 that tracks the sensing of a data level stored at one or more replica memory cells 2R following the energizing of the word line enable signal WL_EN.","Each replica cell 2R is typically hard-wired to a particular data state, and is coupled to replica bit line RBL as word line enable signal WL_EN is energized.","If multiple replica cells 2R are used, these cells 2R are typically ganged together along one or more replica bit lines RBL to minimize the effects of local device variation.","Replica sense amplifier 4R issues a signal to tracking circuit 8 in response to a transition at replica bit line RBL.","Tracking circuit 8 in turn generates the LATCH_DATA signal, which is (theoretically) at the time that replica sense amplifier 4R produces a stable D_OUT state from the levels at replica bit lines RBL, plus an additional time margin to allow for variation over main array 2.For the reasons discussed above, the timing of this LATCH_DATA signal is critical in the overall performance of this OTP memory.","If the LATCH_DATA signal is applied to latches 6 too early in the cycle, the noise margin of the read operation is poor; if it is applied too late in the cycle, the cycle time of the memory is degraded.","It has been observed, however, that conventional tracking circuit approaches are limited in the precision with which sense amplifier or data latch timing can be attained in one-time programmable (OTP) memories.","As known in the art, the electrical behavior of OTP memory cells changes over the life of the device, for example because the charge stored at the floating gate of the bit cell transistor leaks or is otherwise weakened.","This change in behavior is typically reflected in degradation of the read performance of a programmed (i.e., “1” data state) cell over time.","Unfortunately, referring to FIG.","1, replica OTP cells 2R will degrade differently over time than will the average cells in main array 2, if for no other reason because replica cells 2R are accessed in each and every read cycle, while cells in main array 2 are accessed much less frequently, on average.","To avoid the resulting variation in read performance over time, many conventional OTP memories realize replica cells 2R as non-programmable transistors, for example as p-channel MOS load transistors, so that the timing of the LATCH_DATA signal is invariant over the device life.","However, the use of different transistor types and arrangements for replica cells 2R from those of the cells in main array 2 results in the tracking circuit and the actual data path exhibiting different behavior over variations in power supply voltage, temperature, and process parameters.","FIG.","2a qualitatively illustrates the effect of variations in these parameters on the timing determination in the OTP memory of FIG.","1.In this example of FIG.","2a, plot VBLBC exhibits the bit line voltage VBLBC for a “0” to “1” transition following energizing of the selected word line in main array 2 for a “best case” condition of power supply voltage, temperature, and process parameters.","As shown in FIG.","2a, this bit line voltage VBLBC reaches a trip voltage Vtrip at a time t0, at which time the LATCH_DATA signal may be issued to read data latches 6 to accurately latch the output D_OUT of sense amplifiers 4.The “worst case” condition of voltage, temperature, and process on the development of the bit line voltage in this OTP memory is shown by plot VBLWC, which reaches the trip voltage Vtrip at a later time t1.While the tracking circuit may be arranged to issue the LATCH_DATA signal at any time following worst case time t1, the construction of replica cells 2R from different transistors than the memory cell devices in the main array 2 necessitates the implementation of some timing margin to account for the eventual degradation of the main array cells over system life.","Accordingly, the arrangement of replica cells 2R, replica sense amplifier 4R, and tracking circuit 8 in this conventional OTP memory is typically arranged so that the time at which the reference bit line voltage VRBL reaches the trip voltage Vtrip is later than the worst case time t1 for main array 2.FIG.","2a shows an example of this slower development of the reference bit line voltage VRBL, reaching trip voltage Vtrip at time t2.This margin provided by the interval t2-t1 directly impacts the cycle time of the memory.","FIG.","2b illustrates the generation of a stable “1” level at the output D_OUT of sense amplifiers 4 following the issuance of the clock signal CLK to control logic 5 in this architecture.","The timing margin indicated by time interval t2-t1, after the worst case time at which the reference bit line voltage VRBL reaches the trip voltage Vtrip, accounts for degradation of the main array cells over device life.","In current-day OTP memories, this t2-t1 margin can range from 30 nsec to as much as 100 nsec, depending on memory size.","This margin interval t2-t1 can be a significant fraction of the overall cycle time Tcyc of the memory, and thus can affect the overall performance of the device.","SUMMARY Disclosed embodiments provide a timing architecture for the read data path in one-time programmable (OTP) memories in which memory cycle time is minimized.","Disclosed embodiments provide such a memory architecture in which the timing of the read data path adjusts with changes in bit cell performance over the operating life of the memory.","Disclosed embodiments provide such a memory architecture requiring minimal timing margin to account for cell degradation.","Disclosed embodiments provide such a memory architecture in which the read power consumption is reduced.","Disclosed embodiments provide such a memory architecture that can be realized by less complex circuitry than in conventional memories.","Other objects and advantages of the disclosed embodiments will be apparent to those of ordinary skill in the art having reference to the following specification together with its drawings.","According to certain embodiments, a programmable memory includes a read data path in which a transition in the data path itself is used to latch the data state sensed from an accessed memory cell.","Latch set-reset logic is provided so that, in a read operation, a transition at the output of a sense amplifier caused by a selected memory cell storing a programmed cell state, clocks a data latch to store that data state and to isolate its input from the sense amplifier.","The latch set-reset logic resets the data latch at the start of the next read cycle.","In some embodiments, a timer is provided so that the latch is reset after a time-out period in a long read cycle in which no data transition occurs.","BRIEF DESCRIPTION OF THE DRAWING FIG.","1 is an electrical diagram, in block form, of the functional architecture of a conventional one-time programmable (OTP) memory.","FIG.","2a is a plot illustrating sense amplifier response to bit line voltage in a conventional OTP memory.","FIG.","2b is a timing diagram illustrating the sense amplifier and data latch timing in a conventional OTP memory.","FIG.","3 is an electrical diagram, in block form, of a large scale integrated circuit including an OTP memory constructed according to embodiments.","FIG.","4 is an electrical diagram, in block form, of the OTP memory in the integrated circuit of FIG.","3, constructed according to an embodiment.","FIG.","5 is an electrical diagram, in block form, of the functional architecture of the OTP memory of FIG.","4 according to that embodiment.","FIG.","6 is an electrical diagram, in block and schematic form, of the data path in the OTP memory of FIG.","5 according to that embodiment.","FIGS.","7a and 7b are electrical diagrams, in schematic form, of the sense amplifier, data latch, and logic circuitry in the OTP memory of FIG.","5 according to an embodiment.","FIG.","8 is a timing diagram illustrating the sense amplifier and data latch timing of the OTP memory of FIG.","5 according to an embodiment.","DETAILED DESCRIPTION The one or more embodiments described in this specification are implemented into a one-time programmable (OTP), electrically programmable, read only memory, such as may be implemented into a microcontroller or other large scale integrated circuits, as it is contemplated that such implementation is particularly advantageous in that context.","However, it is also contemplated that concepts of this invention may be beneficially applied to other applications, for example stand-alone OTP memory devices, as well as other memory technologies, particularly those for which tracking cells may not match the main memory cells in electrical characteristics and performance.","Accordingly, it is to be understood that the following description is provided by way of example only, and is not intended to limit the true scope of this invention as claimed.","FIG.","3 illustrates an example of large-scale integrated circuit 10 in the form of a so-called “system-on-a-chip” (“SoC”), as now popular in many electronic systems.","Integrated circuit 10 is a single-chip integrated circuit into which an entire computer architecture is realized.","As such, in this example, integrated circuit 10 includes microprocessor 12, which is connected to system bus SBUS and serves as the central processing unit of the device.","Various memory resources, including random access memory (RAM) 18 and one-time programmable read-only memory (OTP) 19, reside on system bus SBUS and are thus accessible to microprocessor 12.In this example, OTP 19 is of a type that may be erasable by exposure to ultraviolet light, namely as a UV EPROM.","In this example, if integrated circuit 10 is packaged in a conventional opaque package, OTP 19 may be programmed once after being packaged but cannot be erased.","Alternatively, as will be mentioned below, if integrated circuit 10 is packaged with a window by way of which the memory array of OTP 19 is visible, OTP 19 may serve as a UV EPROM.","Other implementations of this non-volatile memory shown in FIG.","3 as OTP 19 are contemplated, including electrically-erasable and flash implementations.","In any case, OTP 19 in FIG.","3 is contemplated to typically serve as program memory storing the program instructions executable by microprocessor 12, while RAM 18 serves as data memory.","In some cases, program instructions may reside in RAM 18 for recall and execution by microprocessor 12.Other system functions are shown in integrated circuit 10 in a generic sense, by way of system control 14 and input/output interface 17.Those skilled in the art having reference to this specification will recognize that integrated circuit 10 may include additional or alternative functions to those shown in FIG.","3, or may have its functions arranged according to a different architecture from that shown in FIG.","3.The architecture and functionality of integrated circuit 10 is thus provided only by way of example, and is not intended to limit the scope of the claims.","FIG.","4 illustrates an example of the architecture of OTP 19 according to embodiments of this invention.","While FIG.","2 illustrates OTP 19 as embedded memory within larger-scale integrated circuit 10, OTP 19 may alternatively correspond to a stand-alone memory integrated circuit.","Those skilled in the art having reference to this specification will also comprehend that the memory architecture of OTP 19 in FIG.","3 is provided by way of example only, and that the memory architecture of other embodiments may vary significantly from that shown in FIG.","3.In this example, OTP 19 includes memory array 20 containing programmable read-only memory cells arranged in rows and columns.","While a single instance of memory array 20 is shown in FIG.","3, it is to be understood that OTP 19 may include multiple memory arrays 20, each corresponding to a memory block within the address space of OTP 19.In the example shown in FIG.","3, memory array 20 includes m rows and n columns of floating-gate memory cells, each of which stores one data bit.","In these embodiments, cells in the same column share a single bit line BL[n-1:0], and cells in the same row share one of word lines WL[m-1:0].","Memory array 20 may be alternatively arranged to include multiple array blocks or sub-arrays of cells, depending on the addressing space or memory architecture.","Predecoder and control logic block 25 includes decoder logic and other control logic for controlling the access of selected cells in memory array 20.In this embodiment, predecoder and control logic block 25 receives a memory address from external to OTP 19, for example from microprocessor 12 via bus SBUS (FIG.","3), along with a clock signal CLK, and one of enable signals READ or PROG that indicates whether a read or program operation, respectively, is to be performed.","Clock signal CLK may be provided by a clock generator circuit (not shown) in integrated circuit 10, while the applicable READ and PROG signals are typically provided by the particular function in integrated circuit 10 that is accessing OTP 19 (e.g., microprocessor 12).","In a general sense, predecoder and control logic block 25 operates to at least partially decode row and column portions of the received memory address upon receiving an instance of clock signal CLK, and will control the various functions within OTP 19 to carry out the desired read or program function.","In read cycles, word line driver 24 receives, from predecoder and control logic block 25, row address signals that indicate the particular row of memory array 20 to be accessed along with the appropriate timing signal.","In response, word line driver 24 energizes the one of word lines WL[m-1:0] corresponding to the decoded row address value, which causes the cells in that corresponding row to present a voltage or current dependent on the data state stored in each of those cells to its corresponding bit line BL[n-1:0] for its column.","In the architecture of FIG.","4, column select circuit 26 is constructed essentially as a multiplexer to select one or more of bit lines BL[n-1:0] for coupling to sense amplifiers 28, in response to the column address (as may be at least partially decoded by predecoder and control logic block 25).","The number of sense amplifiers 28 typically corresponds to the width of the output data word.","Sense amplifiers 28 essentially digitize the voltage or current on the selected bit lines BL[n-1:0], and forward the result to data latches 30, for eventual buffering and presentation on data output lines Q_OUT.","As will be described in further detail below, the enabling and timing of sense amplifiers 28 and data latches 30 will be based in large part on the data transitions along the data path itself.","Write circuitry (not shown) will also be provided in OTP 19 to program selected memory cells with data presented on data input bus D_IN in the conventional manner, specifically by the selective application of the proper programming voltages to selected bit lines BL[n-1:0].","It is contemplated that this write circuitry and the programming operation may be implemented in any one of a number of conventional techniques for electrically programmable memory, as known in the art.","Other circuitry, including precharge and bias circuitry for precharging and biasing bit lines BL[n-1:0], generating programming voltages, control signals, and the like, will be included within OTP 19, as typical for electrically-programmable memories as will be understood by those skilled in the art having reference to this specification.","FIG.","5 illustrates the functional architecture of OTP 19 in connection with the timing of the latching of sensed data in its read data path.","According to these embodiments, OTP bit cells are arranged as rows and columns in main array 22, with the cells in the same row sharing a word line and the cells in the same column sharing a bit line BL in the conventional manner.","At the beginning of each read cycle, bit lines BL are initialized to a particular logic level, such as the logic level exhibited by a bit cell in its unprogrammed state.","Control logic 25 represents timing logic circuitry that, at the appropriate time in a read cycle (indicated by read enable signal READ) and responsive to a clock signal CLK, generates a word line enable signal WL_EN that in turn causes the energizing of a selected word line in main array 22.In the conventional manner, the cells in the selected row apply their data states to corresponding bit lines BL, selected ones of which are applied to corresponding sense amplifiers 28.Sense amplifiers 28 sense the levels at the selected bit lines BL, and present the sensed data states to corresponding data latches 30 on lines SA_OUT.","According to this embodiment, each data latch 30 latches the sensed data state in response to a transition at its output D_OUT (e.g., a low-to-high transition, indicating that the corresponding cell was programmed to a “1” data state).","Additionally, according to these embodiments, that same transition at the output of each data latch 30 also operates to isolate its input from its corresponding sense amplifier 28.The output data states on respective output lines D_OUT are forwarded to the destination, for example via an output buffer.","Conversely, according to these embodiments, if no transition occurs at output D_OUT (i.e., the corresponding selected memory cell in main array 22 being in its un-programmed state), data latch 30 does not latch its data state, but remains in its initialized condition.","In any case, control logic 25 resets sense amplifiers 28 and data latches 30 in advance of the next read operation, for example in response to the rising edge of clock signal CLK at the beginning of the next cycle.","In those instances in which the selected cell in a read cycle is in its unprogrammed state such that no transition at the output of sense amplifier 28 occurs, leakage current may flow from the bit cell through its sense amplifier 28.According to some of these embodiments, timer 27 is provided in OTP memory 19 to measure a time out period from the initiation of a previous cycle and, upon reaching the end of that period without a new cycle starting, to cause control logic 25 to issue a sense amplifier reset signal on line SA_RST and also a reset signal to data latch 30; this time-out ensures the resetting of those sense amplifiers 28 that did not sense a data level transition in the previous cycle, eliminating this leakage path and undesired power consumption.","As a result of this operation, the latching of data in the read data path is essentially “self-timed”, in the sense that a data transition in the data path itself clocks the latching of the output data.","No tracking circuit or replica cells are required, avoiding the timing inaccuracies in one-time programmable memories in which the replica cells either do not match the actual cells in electrical characteristics at the time of manufacture or degrade differently from the actual cells over the operating life of the device.","Indeed, the self-timing of the data path results in faster read cycle times than in the conventional memories utilizing tracking circuits, considering that the excess timing margin (t2-t1 margin in FIG.","2b) necessitated by the differences in replica cells is not needed.","The construction of OTP 19 according to an embodiment will now be described in further detail with reference to FIG.","6 for the example of four representative bit cells 32 (i.e., bit cells 320,0, 320,1, 321,0, 321,1 as shown in FIG.","6) in array 22.It is of course contemplated that many more bit cells 32 will typically be included in a given instance of array 22, as appropriate for the program code or other contents of that memory resource in integrated circuit 10.In addition, while the arrangement of FIG.","6 illustrates a single instance of sense amplifier 28 and of data latch 30 in this read data path, by way of example, it is of course contemplated that multiple sense amplifiers 28 and data latches 30 will simultaneously be operating in the same manner in those memories in which the data word width is greater than a single bit.","Those skilled in the art having reference to this specification will understand that the construction shown in FIG.","6 will be representative of that for each of the multiple instances of that circuitry.","In this embodiment, each bit cell 32j,k includes p-channel floating-gate MOS transistor 31 with its source/drain path connected in series with that of p-channel MOS select transistor 33 between a power supply voltage (e.g., the Vdd power supply voltage) and its corresponding bit line BLk.","The gate of select transistor 33 in each bit cell 32j,k receives the word line WLj for its row; in this example, because select transistor 33 is a p-channel MOS device, word line WLj will be energized when driven to a low logic level by word line drivers 24.Word line drivers 24 energize the selected word line WLj in response to the row address signals X_DEC, which have been at least partially decoded by pre-decoder 37.The data state of a given bit cell 32j,k depends on whether its floating gate transistor 31 is programmed to have charge trapped on its floating-gate electrode.","In this embodiment, the unprogrammed state of a bit cell 32j,k is that state in which its floating-gate transistor 31 is not conductive, and the programmed state is that in which sufficient electrons are trapped at the floating gate electrode to render that transistor 31 conductive upon application of sufficient source-drain voltage.","Accordingly, the state of floating-gate transistor 31 of bit cell 32j,k determines the voltage at bit line BLk when its word line WLj is energized so as to turn on select transistor 33.If cell 32j,k is programmed, conduction through transistor 31 will apply a high voltage (Vcc) to bit line BLj when word line WLj is energized and its select transistor 33 is on.","Conversely, if cell 32j,k is unprogrammed and thus non-conductive when select transistor 33 is turned on by word line WLj, the Vcc voltage will not be applied to that bit line BLj.","In this unprogrammed state, a selected bit cell 32j,k will thus not consume any power other than that resulting from leakage current; this effect is used to advantage in this embodiment.","Bit lines BLk are coupled to column select circuitry 26, which receives decoded column address signals Y_DEC from pre-decoder 37 and selects one of those bit lines BLk for application to sense amplifier 28 via line BL_OUT.","Sense amplifier 28 compares the voltage or read current at the selected bit line BL_OUT with a reference level, and presents a corresponding data state on line SA_OUT to data latch 30 as described above relative to FIG.","5.In this embodiment, data latch 30 is transparent during the sensing of the addressed memory cell 32j,k, and as such the sensed data level at line SA_OUT is communicated through data latch 30 to its output on line D_OUT.","Output buffer 38 in turn presents that data state at its output Q_OUT, for communication to the appropriate destination in integrated circuit 10.As shown in FIG.","6, predecoder and control logic 25 includes clock generator 36 that produces internal clock signals for OTP 19 from clock signal CLK.","Clock signal CLK may be produced by clock circuitry (not shown) elsewhere in integrated circuit 10.In the read circuitry of OTP 19 according to this embodiment, the internal clock signals produced by clock generator 36 include clock signal ACLK that is applied to predecoder 37 and control logic 35, and reset signal RESET applied to timer 27, both produced, for example, after suitable times following a rising edge of clock signal CLK.","As mentioned above, predecoder 37 receives the desired memory address from the requesting function in integrated circuit 10 (e.g., via bus SBUS of FIG.","3) and, in response to the clock signal ACLK from clock generator 36, at least partially decodes that memory address for use by word line drivers 24 and column select circuit 26.Timer 27 is a conventional timer circuit that, in this embodiment, measures a maximum cycle time period beginning from the reset signal RESET from clock generator 36 at the beginning of the cycle.","As will be described below in connection with its operation, OTP 19 according to these embodiments is initialized at the beginning of a read cycle, rather than at the end of the read operation as may be indicated by a tracking circuit in conventional memories.","Because the data latch timing is based on a one-way transition in the read path according to the self-timing operation, reset will not otherwise occur in read cycles in which no data transition is detected, particularly if that cycle is not soon followed by another read operation.","Accordingly, the operation of timer 27 ensures reset of sense amplifiers 28 and initialization of bit lines BL in array 22 after some specified maximum time-out period.","For example, if the nominal read cycle period of OTP 19 is on the order of 50 nsec, a suitable time-out period measured by timer 27 may be on the order of 200 nsec or longer.","Upon the expiration of the time-out period, timer 27 issues a signal EOC to control logic 35.Control logic 35 is constructed as logic circuitry that issues control signals to various circuits in the read path according to these embodiments.","As mentioned above, control logic 35 receives internal clock signal ACLK from clock generator 36, end-of-cycle signal EOC from timer 27, and the read and program control signals READ and PRGM, respectively, from microprocessor 12 or another function in integrated circuit 10, indicating the type of cycle to be performed by OTP 19.According to the embodiment of FIG.","6, control logic 35 issues an enable signal ENSAZ to latch set-reset logic 34 and to sense amplifiers 28 in response to the internal clock signal ACLK at the beginning of a read cycle (as indicated by the READ control signal); enable signal ENSAZ is also issued by control logic 35 in response to the end-of-cycle signal EOC from timer 27.According to this embodiment, and as will be described in further detail below, enable signal ENSAZ operates to reset sense amplifiers 28 and initiate reset of data latches 30.In addition to enable signal ENSAZ, line D_OUT from the output of data latch 30 is communicated to latch set-reset logic 34.As discussed above and as will be described in further detail below, latch set-reset logic 34 issues a latch signal LAT to data latch 30 in response to a transition at line D_OUT, latching that data state into data latch 30 to allow sense amplifier 28 and the remainder of the upstream circuitry can be reset for the next cycle.","As shown in FIG.","6, latch signal LAT is also applied to sense amplifier 28 to disable it responsive to the transition at line D_OUT.","FIGS.","7a and 7b illustrate the data path circuitry of OTP 19 according to the embodiment of FIG.","6 in further detail.","In FIG.","7a, a single bit cell 32j,k is illustrated for the sake of clarity; it will of course be understood that the particular bit cell 32j,k coupled to this instance of sense amplifier 28 will be the one corresponding to the decoded memory address.","As shown in FIG.","7a, bit line BLk is associated with a corresponding precharge transistor 42k having its source/drain path connected between bit line BLk and ground, and its gate receiving control signal BLDIS from control logic 35 or other appropriate circuitry in OTP 19.According to this embodiment, each bit line BLk will be initialized by its associated precharge transistor 42k to a voltage corresponding to the unprogrammed state for bit cells 32, prior to the initiation of a read operation.","As such, if the selected bit cell 32j,k for bit line BLk is in the unprogrammed state, no transition will occur at bit line BLk.","Conversely, if selected bit cell 32j,k is in its programmed state, bit line BLk will make a transition from its precharged level, in this embodiment from ground to a high voltage (e.g., approaching Vcc).","Column select transistor 26k has its source/drain path connected between bit line BLk and its associated sense amplifier 28, and receives decoded column select signal CSELk at its gate.","If bit line BLk corresponds to the column indicated by the received column address, decoded signal CSELk is energized, turning on transistor 26k to connect bit line BLk to sense amplifier 28, at sense node SN.","Sense amplifier 28 in this embodiment is essentially a current comparator, comparing the current conducted from bit line BLk to a reference current.","The reference current in sense amplifier 28 is established by reference transistor 45, which has its source/drain path connected in series with that of transistor 46 between sense node SN and ground.","The gate of reference transistor 45 receives a bias voltage NBIAS from a reference circuit elsewhere in OTP 19 or integrated circuit 10, while transistor 46 receives the latch signal LAT from latch set-reset logic 34 as will be described below.","Bias voltage NBIAS establishes the reference current conducted by transistors 45 and 46 in the read cycle, such that the voltage at sense node SN depends on whether the current from the selected cell 32j,k via bit line BLk exceeds the reference current.","For bit cell 32j,k in the unprogrammed state, bit line BLk will conduct at most a leakage current, and transistors 45 and 46 will pull sense node SN to ground.","For bit cell 32j,k in its programmed (i.e., conductive) state, the bit line current will be sufficient to overcome the smaller reference current established by reference transistor 45, and the voltage of sense node SN will rise toward Vcc.","Inverters 40a, 40b, connected in series between sense node SN and data latch 30, produce a logic level at the output SA OUT of sense amplifier 28 corresponding to the voltage at sense node SN and thus to the state of selected bit cell 32j,k.","According to this embodiment, data latch 30 includes a first pass gate 50a coupled to the output SA OUT of sense amplifier 28 and controlled by latch signal LAT from latch set-reset logic 34.Pass gate 50a may be constructed as a pair of complementary MOS transistors with their source/drain paths in parallel and receiving complementary signals at their respective gates (i.e., latch signal LAT and its complement LATZ, in this example) as known in the art, or alternatively may be a single pass transistor.","The opposite side of pass gate 50a is connected to the input of inverter 52a, which has its output connected to an input of each of inverters 52b, 52c.","Pass gate 50b connects the output of inverter 52b to the input of inverter 52a to form a latch when pass gate 50b is conductive.","In this embodiment, pass gate 50b receives complement latch signal LATZ, generated from latch signal LAT by inverter 49.As such, pass gate 50b is off when pass gate 50a is on (with latch signal LAT at a high logic level), and pass gate 50a is off when pass gate 50b is on (with latch signal LAT at a low logic level).","Latch output D_OUT at the output of inverter 52c is applied to output buffer 38 and to latch set-reset logic 34.FIG.","7b illustrates the construction of latch set-reset logic 34 according to this embodiment.","Latch set-reset logic 34 includes a pair of cross-coupled NAND gates 54a, 54b, each having an input receiving the output of the other.","The other input of NAND gate 54a receives the logical complement (via inverter 55a) of enable signal ENSAZ from control logic 35 (FIG.","6).","The other input of NAND gate 54b receives the logical complement (via inverter 55b) of latch output D_OUT.","Accordingly, latch set-reset logic 34 is operable to assert latch signal LAT in response to a high logic level at either enable signal ENSAZ or at latch output D_OUT.","Of course, latch set-reset logic 34 may be realized by other logic circuit arrangements to carry out the functions of control logic 25 according to these embodiments.","For example, in the embodiment shown in FIG.","7a, latch signal LAT from latch set-reset logic 34 is applied to the gate of transistor 46 in sense amplifier 28, simplifying the logic arrangement of this circuitry for efficient implementation.","Alternatively, control logic 25 may be arranged to disable sense amplifier 28 (e.g., by turning off its transistor 46) separately from the setting and resetting of data latch 30.It is contemplated that those skilled in the art will be readily able to realize the particular arrangement of control logic 25, including latch set-reset logic 34, in the manner desired for each specific implementation of these embodiments.","Referring now to FIG.","8, an example the operation of the read path architecture of OTP 19 according to the embodiment of FIGS.","6, 7a, and 7b in carrying out a read cycle will now be described, specifically for the case of an OTP cell 32j,k programmed to a “1” data state (i.e., having charge trapped at the floating-gate of transistor 31 to render it conductive).","As will be apparent from this description, in the previous read cycle and thus prior to the beginning of the read cycle at time t0, latch set-reset logic 34 has issued latch signal LAT at a logic low level.","In data latch 30, pass transistor 50a is thus off and pass transistor 50b is on, such that data latch 30 is retaining the previous data state D_OUT and presenting the corresponding logic level at its output D_OUT.","In this example, the read cycle begins with a rising edge of clock signal CLK applied to clock generator 36 (FIG.","6), in response to which clock generator 36 issues a trailing edge of internal clock signal ACLK to predecoder 37 and control logic 35 to initiate the cycle.","As described above relative to FIG.","7a, bit lines BLk are each precharged to ground, for example by control circuitry briefly asserting signal BLDIS to turn on transistors 42k in response to this transition of internal clock signal ACLK.","The high-to-low transition of internal clock signal ACLK also causes predecoder 37 to begin the decoding of the received row and column addresses, for example from system bus SBUS, for application to word line drivers 24 and column select circuit 26, which in turn respectively initiate the access of the selected row of cells and the selection of those bit lines BLk that are to be sensed.","In this example, the selected cell 32j,k in row j and column k is in its programmed (“1”) state, and as such will pull its selected bit line BLk to a high voltage for sensing.","In a read cycle (i.e., with read signal READ asserted) and in response to internal clock signal ACLK, control logic 35 issues a pulse of enable signal ENSAZ to sense amplifier 28 and latch set-reset logic 34.In this embodiment of the invention, this enable signal ENSAZ pulse initializes each sense node SN to a low level by turning on transistor 44 in each sense amplifier 28.In addition, as shown in FIG.","8, the rising edge of the ENSAZ pulse causes latch set-reset logic 34 to issue a rising edge of latch signal LAT to sense amplifier 28 and data latch 30 according to this embodiment.","The high level of latch signal LAT turns on transistor 46 in sense amplifier 28, allowing conduction of the reference current from sense node SN through transistor 45, under the control of bias voltage NBIAS.","In addition, latch signal LAT “resets” data latch 30 by turning on its pass gate 50a and turning off its pass gate 50b.","In this “reset” state, the previous state stored in data latch 30 is no longer latched, and the current level at sense amplifier output SA OUT passes through data latch 30 via inverters 50a, 50c.","At the end of the pulse of enable signal ENSAZ, as determined by control logic 35, transistor 44 is turned off so that sense node SN is no longer held at ground except through reference transistor 45.Accordingly, the voltage at selected bit line BLk, as determined by the data state of the selected cell 32j,k, will be reflected at sense node SN to the extent that the read current through selected cell 32j,k exceeds the reference current through transistor 45.For the “1” state, as described above, the read current will exceed the reference current, and sense node SN will be pulled up to a high level with bit line BLk.","Referring to FIG.","8, in response to bit line BLk (and thus sense node SN) reaching the trip voltage Vtrip of inverter 40a of sense amplifier 28, sense amplifier output SA OUT makes a transition to a high logic level as driven by inverter 40b.","With pass gate 50a in data latch 30 turned on (latch signal LAT being high at this time), the high logic level at sense amplifier SA OUT is reflected at latch output D_OUT following the propagation delay through inverters 52a, 52c.","Access time Tacc shown in FIG.","8 refers to the time interval between the rising edge of clock signal CLK and the low-to-high transition at latch output D_OUT.","Because data latch 30 is transparent during the sense operation, this access time Tacc essentially depends on the read current supplied by the addressed memory cell 32j,k in its “1” data state.","Buffer 38 then presents that high logic level on line Q_OUT in the data path of OTP 19.According to this embodiment, latch set-reset logic 34 terminates the pulse of latch signal LAT in response to the low-to-high transition at latch output D_OUT.","Specifically, the trailing edge of latch signal LAT “sets” data latch 30 by turning off pass gate 50a and turning on pass gate 50b, such that the output of inverter 52b is coupled to the input of inverter 52a.","The sensed “1” data state is latched into and retained by data latch 30 in this “set” state, and is no longer influenced by the level at sense amplifier output SA_OUT.","In addition, also according to this embodiment, transistor 46 in sense amplifier 28 is turned off, ending the sense operation for this cycle.","In this state, as described above, the low level of latch signal LAT maintains sense amplifier 28 off and data latch 30 de-coupled from sense amplifier SA_OUT.","Precharge transistor 42k is turned on to initialize bit line BLk in the next cycle, and as such the programmed selected cell 32j,k draws no current other than leakage current.","Data latch 30 maintains the “1” data state at data output line Q for the remainder of the cycle.","This state is maintained until the next rising edge of clock signal CLK, which starts the next cycle for OTP 19.For the case of a unprogrammed (“0”) cell 32j,k, the operation of OTP 19 is similar to that described above relative to FIG.","8, except that no transition occurs at sense amplifier output SA_OUT, and therefore no transition occurs at latch output D_OUT.","No pulse of latch signal LAT is thus generated by latch set-reset logic 34.Data latch 30 remains unlatched in this case (pass gate 50b remains off), and simply passes the low logic level at sense amplifier output SA_OUT to buffer 38 for presentation at data output Q_OUT.","Since the pulse of latch signal LAT is not terminated for this “0” data state case, transistor 46 remains on and thus sense amplifier 28 remains on for the duration of the cycle.","Any leakage current through the “0” state cell 32j,k will thus be conducted along bit line BLk and through transistors 45 and 46 to ground.","Because floating-gate transistor 33 in the selected cell 32j,k is not held off with a hard gate voltage, however, it is contemplated that some leakage current can occur from some of the cells 32 in array 22.While this leakage may not be significant over relatively short cycle times (i.e., between rising edges of clock signal CLK, shown as Tcyc in FIG.","8), the leakage power consumed can be significant in long cycle times, which can frequently occur for OTP 19 given its static nature.","For example, the last cycle in a burst read of OTP 19 can be quite long, extending from the end of one burst until the beginning of the next.","According to this embodiment, timer 27 is provided within control logic 25 to initiate a reset of sense amplifiers 28 and data latches 30, if not occurring in response to a data transition, after a maximum allowable cycle time interval elapses.","Timer 27 may be constructed in the conventional manner, for example as a countdown (or count-up) timer that advances its stored contents with each cycle of a periodic clock signal.","In the embodiment of FIG.","6, timer 27 receives a reset clock RESET from clock generator 36 in response to each rising edge of clock signal CLK.","This transition of reset clock RESET causes timer 27 to begin measuring a time interval corresponding to a maximum cycle time, for example by executing a countdown (or up-count) of clock pulses.","An example of the maximum cycle time may be on the order of 200 nsec; typical cycle times in normal operation of an OTP are typically on the order 50 nsec or less.","Typically, timer 27 will be clocked by a higher frequency clock, for example as may be generated by clock generator 36.Upon reaching the pre-programmed or selected maximum time interval, timer 27 then issues an end-of-cycle signal EOC to control logic 35, which in turn issues a pulse of enable signal ENSAZ to latch set-reset logic 34.In response to the ENSAZ pulse, as described above latch set-reset logic 34 issues a pulse of latch signal LAT, setting data latch 30 to store the “0” data state at sense amplifier output SA_OUT, and turning off sense amplifier 28 by turning off transistor 46.With sense amplifier 28 disabled in this manner, any leakage current through unprogrammed “0” cell 32j,k will be blocked by the off-state transistor 46 from communication to ground, and excess power consumption will be minimized.","Accordingly, these embodiments operate to “self-latch” the sensed data state of the selected OTP cell, at a timing corresponding to transition of the sensed data state itself.","No tracking circuit or replica cells are required for controlling the timing of the data latch, as in conventional OTP memories.","As a result, the self-timing of the data latch can essentially be as fast as the operation of the memory itself, and need not include the excessive timing margin of conventional tracking circuits that must allow for variations between the replica cells or other delay circuits with the performance of the OTP cells over the operating life of the device.","Rather, as the OTP cell performance may degrade over the operating life, the self-latching operation according to these embodiments will precisely follow any such degradation.","Referring to FIG.","2a, the cycle time Tcyc of OTP 19 according to these embodiments can be minimized, because the need to include “t2-t1 margin” as shown in FIGS.","2a and 2b is eliminated according to these embodiments.","In addition, these embodiments implement the self-latching read data path in a manner that minimizes excessive power consumption, and that can be efficiently realized, from the standpoint of chip area and circuit complexity, in modern integrated circuits.","While one or more embodiments have been described in this specification, it is of course contemplated that modifications of, and alternatives to, these embodiments, such modifications and alternatives capable of obtaining one or more the advantages and benefits of this invention, will be apparent to those of ordinary skill in the art having reference to this specification and its drawings.","It is contemplated that such modifications and alternatives are within the scope of this invention as subsequently claimed herein."]],"string":"[\n [\n \"Self-Latch Sense Timing in a One-Time-Programmable Memory Architecture\",\n \"A programmable memory including a self-latching read data path.\",\n \"A sense amplifier senses the voltage level at a bit line, the bit line communicating the data state of a selected memory cell in its associated column.\",\n \"A data latch coupled to the output of the sense amplifier passes the sensed data state.\",\n \"Set-reset logic is provided that receives the output of the data latch in the read data path and, in response to a transition of the data state in a read cycle, latches the data latch and isolates it from the sense amplifier.\",\n \"The set-reset logic resets the data latch at the start of the next read cycle.\",\n \"In some embodiments, a timer is provided so that the latch is reset after a time-out period in a long read cycle in which no data transition occurs.\"\n ],\n [\n \"1.A method of reading a data state from a programmable solid-state memory, comprising: at a beginning of a read cycle, resetting each of a plurality of bit lines to a first level; applying the data state of a selected one of a plurality of programmable memory cells to the bit line, each memory cell programmable from a first data state to a second data state, the applying of a memory cell at the second data state causing a transition to a second level at the bit line; at a sense amplifier, sensing the level at the bit line and presenting the sensed level at an output; passing the output of the sense amplifier through a data latch to an output data path; and responsive to sensing the second bit line level: setting the data latch to store the sensed data state; and isolating the data latch from the output of the sense amplifier.\",\n \"2.The method of claim 1, further comprising: starting a timer from a beginning of a read cycle; and responsive to the timer reaching a maximum cycle time, coupling the data latch to the output of the sense amplifier.\",\n \"3.The method of claim 1, wherein the data latch comprises: a storage element having an input and an output; and a first pass gate coupled between the output of the sense amplifier and the input of the storage element; wherein the step of isolating the data latch comprises opening the first pass gate.\",\n \"4.The method of claim 3, wherein the storage element of the data latch comprises: a first inverter having an input coupled to the first pass gate and an output; a second inverter having an input coupled to the output of the first inverter and an output; and a second pass gate coupled between the output of the second inverter and the input of the first inverter; and wherein the step of setting the data latch comprises closing the second pass gate.\",\n \"5.The method of claim 4, further comprising, at the beginning of a read cycle, closing the first pass gate and opening the second pass gate.\",\n \"6.The method of claim 5, further comprising: starting a timer from a beginning of a read cycle; and responsive to the timer reaching a maximum cycle time, closing the first pass gate and opening the second pass gate.\",\n \"7.The method of claim 1, wherein: the first data state corresponds to an unprogrammed memory cell state; and the second data state corresponds to a programmed memory cell state.\",\n \"8.The method of claim 1, wherein: the plurality of memory cells are arranged in rows and columns, each column of memory cells associated with a bit line; and the applying step comprises: applying the data states of memory cells in a selected row of the memory array to their associated bit lines; and coupling a selected one of a plurality of bit lines to the sense amplifier responsive to a column address.\",\n \"9.A method of reading data stored in a memory element of a memory device comprising: receiving a signal corresponding to the data stored in the memory element at an input of a sense amplifier; outputting, at an output of the sense amplifier, a sensed output signal indicating a logic state of the data stored in the memory element; operating a data latch having an input in a reset state in response to a latch signal indicating a first value to pass the sensed output signal sense amplifier to an output of the data latch, wherein the data latch has an input coupled to the output of the sense amplifier to receive the sensed output signal; and operating a data latch in a set state in response to the latch signal indicating a second value to store a data state of the sensed output signal and isolate the input of the data latch from the output of the sense amplifier.\",\n \"10.The method of claim 9, further comprising producing the sensed output signal in response to a sense amplifier enable signal.\",\n \"11.The method of claim 10, further comprising, generating the latch signal using a set-reset control circuit.\",\n \"12.The method of claim 11, wherein the set-reset control circuit has an input receiving the sense amplifier enable signal, and wherein generating the latch signal is at least partially in response to the sense amplifier enable signal.\",\n \"13.The method of claim 9, wherein the data latch is operated in the set state in response to the sensed output signal indicating the logic state of the data stored in the memory element corresponds to a programmed state.\",\n \"14.The method of claim 13, wherein the data latch is operated in the reset state in response to the sensed output signal indicating the logic state of the data stored in the memory element corresponds to an un-programmed state.\",\n \"15.The method of claim 14, wherein the programmed state has a logic value of 1 and the un-programmed state has a logic value of 0.16.The method of claim 9, wherein operating the data latch in the reset state comprises: turning off a first pass gate coupled between the input of the data latch and the output of the data latch; and turning on a second pass gate coupled between an output of the first data latch and a storage element of the data latch.\"\n ],\n [\n \" BACKGROUND OF THE INVENTION This invention is in the field of solid-state memories.\",\n \"Embodiments of this invention are more specifically directed to the sensing of stored data states in one-time programmable non-volatile memory.\",\n \"Non-volatile solid-state read/write memory devices are commonplace in many modern electronic systems, particularly in portable electronic devices and systems.\",\n \"Conventional types of non-volatile solid-state memory devices include those referred to as electrically programmable read-only memory (EPROM) devices.\",\n \"Modern EPROM memory cells include one or more “floating-gate” transistors that store the data state.\",\n \"In a general sense, these floating-gate transistors are “programmed” by the application of a bias that enables holes or electrons to tunnel or be injected through a thin dielectric film onto an electrically isolated transistor gate element, which is the floating gate of the transistor.\",\n \"This trapped charge on the floating gate will modulate the apparent threshold voltage of the memory cell transistor, as compared with the threshold voltage with no charge trapped on the floating gate.\",\n \"This difference in threshold voltage can be detected by sensing the resulting difference in source-drain conduction, under normal transistor bias conditions, between the programmed and unprogrammed states.\",\n \"Some EPROM devices are “erasable” in that the trapped charge can be removed from the floating gate, for example by exposure of the memory cells to ultraviolet light (such memories referred to as “UV EPROMS”) or by application of a particular electrical bias condition that enables tunneling of the charge from the floating gate (such memories referred to as electrically-erasable or electrically-alterable, i.e., EEPROMs and EAPROMS, respectively).\",\n \"“Flash” memory devices are typically realized by EEPROM memory arrays in which the erase operation is applied simultaneously to a “block” of memory cells.\",\n \"Because of the convenience and efficiency of modern EPROM and EEPROM functions, it is now commonplace to embed non-volatile memory arrays within larger scale integrated circuits, such as modern complex microprocessors, digital signal processors, and other large-scale logic circuitry.\",\n \"Such embedded non-volatile memories can be used as non-volatile program memory storing software routines executable by the processor, and also as non-volatile data storage.\",\n \"On a smaller scale, non-volatile memory cells can realize control registers by way of which a larger scale logic circuit can be configured, or can be used to “trim” analog levels after electrical measurement.\",\n \"As known in the art, “one-time programmable” (“OTP”) memories are also popular, especially in embedded non-volatile memory applications as mentioned above.\",\n \"The memory cells of OTP memories are constructed similarly or identically as UV EPROM cells, and as such are not electrically erasable.\",\n \"But when mounted in an opaque package, without a window through which the memory can be exposed to ultraviolet light, the UV EPROM cells may be programmed one and only one time.\",\n \"In embedded applications, OTP memories are useful for storing the program code to be executed by the embedding microcontroller or microprocessor.\",\n \"In any type of solid-state semiconductor memory, data path timing for the read operation is critical in the performance of the memory device.\",\n \"As fundamental in the art, memory cells in conventional OTP and other solid-state memories are typically accessed by selecting a row of cells in the array according to a row address, coupling the storage device in each of those cells to a corresponding bit line to establish a voltage or current on each bit line according to the data state stored in its corresponding cell.\",\n \"Sense amplifiers sense the state of the bit lines to determine the data states of the accessed cells, and these sensed data states are then latched and communicated along the output data path of the memory.\",\n \"Accurate sensing of the stored memory cell state must be maintained over varying voltage and temperature conditions, variations in manufacturing parameters, and in the presence of system noise.\",\n \"As known in the art, the noise margin of the read operation, which depends on timing precision in the read circuitry, in large part determines the minimum memory cell size required to provide the necessary read current and thus the memory density in bits per unit “chip” area.\",\n \"This precision of the sense circuitry is due in large part to the timing at which the sense amplifiers operate to amplify and latch the data state represented by the bit line signals.\",\n \"In each cycle, time must be provided to allow the accessed memory cells to develop a voltage or current on the bit lines, before the amplification and latching of those bit line levels as the data states read from the accessed cells.\",\n \"On one hand, if the data are latched too early in the cycle, before the bit line signal has fully developed, the data read is vulnerable to error from noise.\",\n \"On the other hand, latching the data later than is necessary for reliable sensing will unduly lengthen the read cycle time and thus limit the performance of the device.\",\n \"It has been observed that the optimization of data path timing for read cycles in modern memory architectures can be quite difficult.\",\n \"One conventional technique for setting the read path timing is to generate a sense amplifier enable signal from a row enable control signal that gates the word line drivers, but with a delay element such as a chain of logic inverters establishing the desired delay time following the driving of the selected word line before the sense amplifiers are enabled or sensed data are latched.\",\n \"It has been observed, however, that the construction and thus the electrical characteristics of the memory cell transistors typically differ from that of the logic transistors making up the delay element.\",\n \"Significant device mismatch can result which, along with localized variations in device behavior of these minimum size cell transistors, necessitates additional design margin (i.e., lengthened delay between the word line drive and the sense amplifier enable signal) to be built into the timing circuit.\",\n \"This additional margin adversely impacts read cycle times.\",\n \"Another conventional approach to determining sense amplifier timing in modern solid-state memories uses a “tracking” circuit based on replica, or “dummy”, memory cells that are constructed using the same transistor sizes as the cell transistors.\",\n \"This approach is especially common in those memory technologies for which the replica cells can closely match the cell transistors in the main array, such as static random access memories (SRAMs).\",\n \"Arslan et al., “Variation-Tolerant SRAM Sense-Amplifier Timing Using Configurable Replica Bitlines”, Custom Integrated Circuits Conference (IEEE, 2008), pp.\",\n \"415-418, describes the incorporation of a replica column of memory cells implemented in or adjacent to the main memory array, in which the discharge of the replica bit line by a configurable number of dummy memory cells in that column drives the sense amplifier enable signal.\",\n \"Amrutur et al., “A Replica Technique for Wordline and Sense Control in Low-Power SRAM's”, J.\",\n \"Solid State Circuits, Vol.\",\n \"33, No.\",\n \"8 (IEEE, 1998), pp.\",\n \"1208-19, describes a row of replica cells implemented in or adjacent to the main memory array, for which a dummy global word line is driven along with the global word line for the main array.\",\n \"In some memory architectures, such as those used in conventional one-time-programmable (OTP) memory, the tracking circuit determines the time at which a data latch receiving the output of the sense amplifiers is enabled.\",\n \"In one conventional OTP architecture, the sense amplifier responds asynchronously to the bit line levels to produce an output level that is latched into a read data latch at a point in the cycle determined by the tracking circuit.\",\n \"FIG.\",\n \"1 illustrates the functional architecture of a conventional OTP memory including a tracking circuit for timing the latching of the data sensed by sense amplifiers.\",\n \"In this conventional architecture, the OTP bit cells are arranged as rows and columns in main array 2 , with the cells in the same row sharing a word line and those in the same column sharing a bit line BL, coupled to a corresponding one of main sense amplifiers 4 .\",\n \"Control logic 5 represents timing logic circuitry that generates a word line enable signal WL_EN that gates the row decoder and word line drivers (not shown) to energize the selected word line in main array 2 in the read cycle (indicated by read enable signal READ), at the appropriate time responsive to a clock signal CLK.\",\n \"In the manner discussed above, main sense amplifiers 4 asynchronously sense the state of bit lines BL and present corresponding output signals indicating the sensed data states to read data latches 6 .\",\n \"In this conventional OTP architecture, read data latches 6 latch the output data D_OUT presented by main sense amplifiers 4 in response to a LATCH_DATA signal.\",\n \"Tracking circuit 8 also generates a reset signal RESET to control logic 5 at this time, to allow the memory to prepare for the next cycle once the output data are latched at interval t 2 -t 1 from read data latches 6 .\",\n \"According to this conventional OTP architecture, the timing of the LATCH_DATA signal is derived from a tracking circuit 8 that tracks the sensing of a data level stored at one or more replica memory cells 2 R following the energizing of the word line enable signal WL_EN.\",\n \"Each replica cell 2 R is typically hard-wired to a particular data state, and is coupled to replica bit line RBL as word line enable signal WL_EN is energized.\",\n \"If multiple replica cells 2 R are used, these cells 2 R are typically ganged together along one or more replica bit lines RBL to minimize the effects of local device variation.\",\n \"Replica sense amplifier 4 R issues a signal to tracking circuit 8 in response to a transition at replica bit line RBL.\",\n \"Tracking circuit 8 in turn generates the LATCH_DATA signal, which is (theoretically) at the time that replica sense amplifier 4 R produces a stable D_OUT state from the levels at replica bit lines RBL, plus an additional time margin to allow for variation over main array 2 .\",\n \"For the reasons discussed above, the timing of this LATCH_DATA signal is critical in the overall performance of this OTP memory.\",\n \"If the LATCH_DATA signal is applied to latches 6 too early in the cycle, the noise margin of the read operation is poor; if it is applied too late in the cycle, the cycle time of the memory is degraded.\",\n \"It has been observed, however, that conventional tracking circuit approaches are limited in the precision with which sense amplifier or data latch timing can be attained in one-time programmable (OTP) memories.\",\n \"As known in the art, the electrical behavior of OTP memory cells changes over the life of the device, for example because the charge stored at the floating gate of the bit cell transistor leaks or is otherwise weakened.\",\n \"This change in behavior is typically reflected in degradation of the read performance of a programmed (i.e., “1” data state) cell over time.\",\n \"Unfortunately, referring to FIG.\",\n \"1 , replica OTP cells 2 R will degrade differently over time than will the average cells in main array 2 , if for no other reason because replica cells 2 R are accessed in each and every read cycle, while cells in main array 2 are accessed much less frequently, on average.\",\n \"To avoid the resulting variation in read performance over time, many conventional OTP memories realize replica cells 2 R as non-programmable transistors, for example as p-channel MOS load transistors, so that the timing of the LATCH_DATA signal is invariant over the device life.\",\n \"However, the use of different transistor types and arrangements for replica cells 2 R from those of the cells in main array 2 results in the tracking circuit and the actual data path exhibiting different behavior over variations in power supply voltage, temperature, and process parameters.\",\n \"FIG.\",\n \"2 a qualitatively illustrates the effect of variations in these parameters on the timing determination in the OTP memory of FIG.\",\n \"1 .\",\n \"In this example of FIG.\",\n \"2 a , plot VBL BC exhibits the bit line voltage VBL BC for a “0” to “1” transition following energizing of the selected word line in main array 2 for a “best case” condition of power supply voltage, temperature, and process parameters.\",\n \"As shown in FIG.\",\n \"2 a, this bit line voltage VBL BC reaches a trip voltage Vtrip at a time t 0 , at which time the LATCH_DATA signal may be issued to read data latches 6 to accurately latch the output D_OUT of sense amplifiers 4 .\",\n \"The “worst case” condition of voltage, temperature, and process on the development of the bit line voltage in this OTP memory is shown by plot VBL WC , which reaches the trip voltage Vtrip at a later time t 1 .\",\n \"While the tracking circuit may be arranged to issue the LATCH_DATA signal at any time following worst case time t 1 , the construction of replica cells 2 R from different transistors than the memory cell devices in the main array 2 necessitates the implementation of some timing margin to account for the eventual degradation of the main array cells over system life.\",\n \"Accordingly, the arrangement of replica cells 2 R, replica sense amplifier 4 R, and tracking circuit 8 in this conventional OTP memory is typically arranged so that the time at which the reference bit line voltage VRBL reaches the trip voltage Vtrip is later than the worst case time t 1 for main array 2 .\",\n \"FIG.\",\n \"2 a shows an example of this slower development of the reference bit line voltage VRBL, reaching trip voltage Vtrip at time t 2 .\",\n \"This margin provided by the interval t 2 -t 1 directly impacts the cycle time of the memory.\",\n \"FIG.\",\n \"2 b illustrates the generation of a stable “1” level at the output D_OUT of sense amplifiers 4 following the issuance of the clock signal CLK to control logic 5 in this architecture.\",\n \"The timing margin indicated by time interval t 2 -t 1 , after the worst case time at which the reference bit line voltage VRBL reaches the trip voltage Vtrip, accounts for degradation of the main array cells over device life.\",\n \"In current-day OTP memories, this t 2 -t 1 margin can range from 30 nsec to as much as 100 nsec, depending on memory size.\",\n \"This margin interval t 2 -t 1 can be a significant fraction of the overall cycle time Tcyc of the memory, and thus can affect the overall performance of the device.\"\n ],\n [\n \" SUMMARY Disclosed embodiments provide a timing architecture for the read data path in one-time programmable (OTP) memories in which memory cycle time is minimized.\",\n \"Disclosed embodiments provide such a memory architecture in which the timing of the read data path adjusts with changes in bit cell performance over the operating life of the memory.\",\n \"Disclosed embodiments provide such a memory architecture requiring minimal timing margin to account for cell degradation.\",\n \"Disclosed embodiments provide such a memory architecture in which the read power consumption is reduced.\",\n \"Disclosed embodiments provide such a memory architecture that can be realized by less complex circuitry than in conventional memories.\",\n \"Other objects and advantages of the disclosed embodiments will be apparent to those of ordinary skill in the art having reference to the following specification together with its drawings.\",\n \"According to certain embodiments, a programmable memory includes a read data path in which a transition in the data path itself is used to latch the data state sensed from an accessed memory cell.\",\n \"Latch set-reset logic is provided so that, in a read operation, a transition at the output of a sense amplifier caused by a selected memory cell storing a programmed cell state, clocks a data latch to store that data state and to isolate its input from the sense amplifier.\",\n \"The latch set-reset logic resets the data latch at the start of the next read cycle.\",\n \"In some embodiments, a timer is provided so that the latch is reset after a time-out period in a long read cycle in which no data transition occurs.\"\n ],\n [\n \"CROSS-REFERENCE TO RELATED APPLICATIONS This application is a divisional of and claims priority to U.S. patent application Ser.\",\n \"No.\",\n \"15/247,352, filed Aug. 25, 2016, which claims priority, under 35 U.S.C.\",\n \"§ 119(e), of Provisional Application No.\",\n \"62/269,737, filed Dec. 18, 2015, all of which are incorporated herein by this reference.\",\n \"STATEMENT REGARDING FEDERALLY SPONSORED RESEARCH OR DEVELOPMENT Not applicable.\",\n \"BACKGROUND OF THE INVENTION This invention is in the field of solid-state memories.\",\n \"Embodiments of this invention are more specifically directed to the sensing of stored data states in one-time programmable non-volatile memory.\",\n \"Non-volatile solid-state read/write memory devices are commonplace in many modern electronic systems, particularly in portable electronic devices and systems.\",\n \"Conventional types of non-volatile solid-state memory devices include those referred to as electrically programmable read-only memory (EPROM) devices.\",\n \"Modern EPROM memory cells include one or more “floating-gate” transistors that store the data state.\",\n \"In a general sense, these floating-gate transistors are “programmed” by the application of a bias that enables holes or electrons to tunnel or be injected through a thin dielectric film onto an electrically isolated transistor gate element, which is the floating gate of the transistor.\",\n \"This trapped charge on the floating gate will modulate the apparent threshold voltage of the memory cell transistor, as compared with the threshold voltage with no charge trapped on the floating gate.\",\n \"This difference in threshold voltage can be detected by sensing the resulting difference in source-drain conduction, under normal transistor bias conditions, between the programmed and unprogrammed states.\",\n \"Some EPROM devices are “erasable” in that the trapped charge can be removed from the floating gate, for example by exposure of the memory cells to ultraviolet light (such memories referred to as “UV EPROMS”) or by application of a particular electrical bias condition that enables tunneling of the charge from the floating gate (such memories referred to as electrically-erasable or electrically-alterable, i.e., EEPROMs and EAPROMS, respectively).\",\n \"“Flash” memory devices are typically realized by EEPROM memory arrays in which the erase operation is applied simultaneously to a “block” of memory cells.\",\n \"Because of the convenience and efficiency of modern EPROM and EEPROM functions, it is now commonplace to embed non-volatile memory arrays within larger scale integrated circuits, such as modern complex microprocessors, digital signal processors, and other large-scale logic circuitry.\",\n \"Such embedded non-volatile memories can be used as non-volatile program memory storing software routines executable by the processor, and also as non-volatile data storage.\",\n \"On a smaller scale, non-volatile memory cells can realize control registers by way of which a larger scale logic circuit can be configured, or can be used to “trim” analog levels after electrical measurement.\",\n \"As known in the art, “one-time programmable” (“OTP”) memories are also popular, especially in embedded non-volatile memory applications as mentioned above.\",\n \"The memory cells of OTP memories are constructed similarly or identically as UV EPROM cells, and as such are not electrically erasable.\",\n \"But when mounted in an opaque package, without a window through which the memory can be exposed to ultraviolet light, the UV EPROM cells may be programmed one and only one time.\",\n \"In embedded applications, OTP memories are useful for storing the program code to be executed by the embedding microcontroller or microprocessor.\",\n \"In any type of solid-state semiconductor memory, data path timing for the read operation is critical in the performance of the memory device.\",\n \"As fundamental in the art, memory cells in conventional OTP and other solid-state memories are typically accessed by selecting a row of cells in the array according to a row address, coupling the storage device in each of those cells to a corresponding bit line to establish a voltage or current on each bit line according to the data state stored in its corresponding cell.\",\n \"Sense amplifiers sense the state of the bit lines to determine the data states of the accessed cells, and these sensed data states are then latched and communicated along the output data path of the memory.\",\n \"Accurate sensing of the stored memory cell state must be maintained over varying voltage and temperature conditions, variations in manufacturing parameters, and in the presence of system noise.\",\n \"As known in the art, the noise margin of the read operation, which depends on timing precision in the read circuitry, in large part determines the minimum memory cell size required to provide the necessary read current and thus the memory density in bits per unit “chip” area.\",\n \"This precision of the sense circuitry is due in large part to the timing at which the sense amplifiers operate to amplify and latch the data state represented by the bit line signals.\",\n \"In each cycle, time must be provided to allow the accessed memory cells to develop a voltage or current on the bit lines, before the amplification and latching of those bit line levels as the data states read from the accessed cells.\",\n \"On one hand, if the data are latched too early in the cycle, before the bit line signal has fully developed, the data read is vulnerable to error from noise.\",\n \"On the other hand, latching the data later than is necessary for reliable sensing will unduly lengthen the read cycle time and thus limit the performance of the device.\",\n \"It has been observed that the optimization of data path timing for read cycles in modern memory architectures can be quite difficult.\",\n \"One conventional technique for setting the read path timing is to generate a sense amplifier enable signal from a row enable control signal that gates the word line drivers, but with a delay element such as a chain of logic inverters establishing the desired delay time following the driving of the selected word line before the sense amplifiers are enabled or sensed data are latched.\",\n \"It has been observed, however, that the construction and thus the electrical characteristics of the memory cell transistors typically differ from that of the logic transistors making up the delay element.\",\n \"Significant device mismatch can result which, along with localized variations in device behavior of these minimum size cell transistors, necessitates additional design margin (i.e., lengthened delay between the word line drive and the sense amplifier enable signal) to be built into the timing circuit.\",\n \"This additional margin adversely impacts read cycle times.\",\n \"Another conventional approach to determining sense amplifier timing in modern solid-state memories uses a “tracking” circuit based on replica, or “dummy”, memory cells that are constructed using the same transistor sizes as the cell transistors.\",\n \"This approach is especially common in those memory technologies for which the replica cells can closely match the cell transistors in the main array, such as static random access memories (SRAMs).\",\n \"Arslan et al., “Variation-Tolerant SRAM Sense-Amplifier Timing Using Configurable Replica Bitlines”, Custom Integrated Circuits Conference (IEEE, 2008), pp.\",\n \"415-418, describes the incorporation of a replica column of memory cells implemented in or adjacent to the main memory array, in which the discharge of the replica bit line by a configurable number of dummy memory cells in that column drives the sense amplifier enable signal.\",\n \"Amrutur et al., “A Replica Technique for Wordline and Sense Control in Low-Power SRAM's”, J.\",\n \"Solid State Circuits, Vol.\",\n \"33, No.\",\n \"8 (IEEE, 1998), pp.\",\n \"1208-19, describes a row of replica cells implemented in or adjacent to the main memory array, for which a dummy global word line is driven along with the global word line for the main array.\",\n \"In some memory architectures, such as those used in conventional one-time-programmable (OTP) memory, the tracking circuit determines the time at which a data latch receiving the output of the sense amplifiers is enabled.\",\n \"In one conventional OTP architecture, the sense amplifier responds asynchronously to the bit line levels to produce an output level that is latched into a read data latch at a point in the cycle determined by the tracking circuit.\",\n \"FIG.\",\n \"1 illustrates the functional architecture of a conventional OTP memory including a tracking circuit for timing the latching of the data sensed by sense amplifiers.\",\n \"In this conventional architecture, the OTP bit cells are arranged as rows and columns in main array 2, with the cells in the same row sharing a word line and those in the same column sharing a bit line BL, coupled to a corresponding one of main sense amplifiers 4.Control logic 5 represents timing logic circuitry that generates a word line enable signal WL_EN that gates the row decoder and word line drivers (not shown) to energize the selected word line in main array 2 in the read cycle (indicated by read enable signal READ), at the appropriate time responsive to a clock signal CLK.\",\n \"In the manner discussed above, main sense amplifiers 4 asynchronously sense the state of bit lines BL and present corresponding output signals indicating the sensed data states to read data latches 6.In this conventional OTP architecture, read data latches 6 latch the output data D_OUT presented by main sense amplifiers 4 in response to a LATCH_DATA signal.\",\n \"Tracking circuit 8 also generates a reset signal RESET to control logic 5 at this time, to allow the memory to prepare for the next cycle once the output data are latched at interval t2-t1 from read data latches 6.According to this conventional OTP architecture, the timing of the LATCH_DATA signal is derived from a tracking circuit 8 that tracks the sensing of a data level stored at one or more replica memory cells 2R following the energizing of the word line enable signal WL_EN.\",\n \"Each replica cell 2R is typically hard-wired to a particular data state, and is coupled to replica bit line RBL as word line enable signal WL_EN is energized.\",\n \"If multiple replica cells 2R are used, these cells 2R are typically ganged together along one or more replica bit lines RBL to minimize the effects of local device variation.\",\n \"Replica sense amplifier 4R issues a signal to tracking circuit 8 in response to a transition at replica bit line RBL.\",\n \"Tracking circuit 8 in turn generates the LATCH_DATA signal, which is (theoretically) at the time that replica sense amplifier 4R produces a stable D_OUT state from the levels at replica bit lines RBL, plus an additional time margin to allow for variation over main array 2.For the reasons discussed above, the timing of this LATCH_DATA signal is critical in the overall performance of this OTP memory.\",\n \"If the LATCH_DATA signal is applied to latches 6 too early in the cycle, the noise margin of the read operation is poor; if it is applied too late in the cycle, the cycle time of the memory is degraded.\",\n \"It has been observed, however, that conventional tracking circuit approaches are limited in the precision with which sense amplifier or data latch timing can be attained in one-time programmable (OTP) memories.\",\n \"As known in the art, the electrical behavior of OTP memory cells changes over the life of the device, for example because the charge stored at the floating gate of the bit cell transistor leaks or is otherwise weakened.\",\n \"This change in behavior is typically reflected in degradation of the read performance of a programmed (i.e., “1” data state) cell over time.\",\n \"Unfortunately, referring to FIG.\",\n \"1, replica OTP cells 2R will degrade differently over time than will the average cells in main array 2, if for no other reason because replica cells 2R are accessed in each and every read cycle, while cells in main array 2 are accessed much less frequently, on average.\",\n \"To avoid the resulting variation in read performance over time, many conventional OTP memories realize replica cells 2R as non-programmable transistors, for example as p-channel MOS load transistors, so that the timing of the LATCH_DATA signal is invariant over the device life.\",\n \"However, the use of different transistor types and arrangements for replica cells 2R from those of the cells in main array 2 results in the tracking circuit and the actual data path exhibiting different behavior over variations in power supply voltage, temperature, and process parameters.\",\n \"FIG.\",\n \"2a qualitatively illustrates the effect of variations in these parameters on the timing determination in the OTP memory of FIG.\",\n \"1.In this example of FIG.\",\n \"2a, plot VBLBC exhibits the bit line voltage VBLBC for a “0” to “1” transition following energizing of the selected word line in main array 2 for a “best case” condition of power supply voltage, temperature, and process parameters.\",\n \"As shown in FIG.\",\n \"2a, this bit line voltage VBLBC reaches a trip voltage Vtrip at a time t0, at which time the LATCH_DATA signal may be issued to read data latches 6 to accurately latch the output D_OUT of sense amplifiers 4.The “worst case” condition of voltage, temperature, and process on the development of the bit line voltage in this OTP memory is shown by plot VBLWC, which reaches the trip voltage Vtrip at a later time t1.While the tracking circuit may be arranged to issue the LATCH_DATA signal at any time following worst case time t1, the construction of replica cells 2R from different transistors than the memory cell devices in the main array 2 necessitates the implementation of some timing margin to account for the eventual degradation of the main array cells over system life.\",\n \"Accordingly, the arrangement of replica cells 2R, replica sense amplifier 4R, and tracking circuit 8 in this conventional OTP memory is typically arranged so that the time at which the reference bit line voltage VRBL reaches the trip voltage Vtrip is later than the worst case time t1 for main array 2.FIG.\",\n \"2a shows an example of this slower development of the reference bit line voltage VRBL, reaching trip voltage Vtrip at time t2.This margin provided by the interval t2-t1 directly impacts the cycle time of the memory.\",\n \"FIG.\",\n \"2b illustrates the generation of a stable “1” level at the output D_OUT of sense amplifiers 4 following the issuance of the clock signal CLK to control logic 5 in this architecture.\",\n \"The timing margin indicated by time interval t2-t1, after the worst case time at which the reference bit line voltage VRBL reaches the trip voltage Vtrip, accounts for degradation of the main array cells over device life.\",\n \"In current-day OTP memories, this t2-t1 margin can range from 30 nsec to as much as 100 nsec, depending on memory size.\",\n \"This margin interval t2-t1 can be a significant fraction of the overall cycle time Tcyc of the memory, and thus can affect the overall performance of the device.\",\n \"SUMMARY Disclosed embodiments provide a timing architecture for the read data path in one-time programmable (OTP) memories in which memory cycle time is minimized.\",\n \"Disclosed embodiments provide such a memory architecture in which the timing of the read data path adjusts with changes in bit cell performance over the operating life of the memory.\",\n \"Disclosed embodiments provide such a memory architecture requiring minimal timing margin to account for cell degradation.\",\n \"Disclosed embodiments provide such a memory architecture in which the read power consumption is reduced.\",\n \"Disclosed embodiments provide such a memory architecture that can be realized by less complex circuitry than in conventional memories.\",\n \"Other objects and advantages of the disclosed embodiments will be apparent to those of ordinary skill in the art having reference to the following specification together with its drawings.\",\n \"According to certain embodiments, a programmable memory includes a read data path in which a transition in the data path itself is used to latch the data state sensed from an accessed memory cell.\",\n \"Latch set-reset logic is provided so that, in a read operation, a transition at the output of a sense amplifier caused by a selected memory cell storing a programmed cell state, clocks a data latch to store that data state and to isolate its input from the sense amplifier.\",\n \"The latch set-reset logic resets the data latch at the start of the next read cycle.\",\n \"In some embodiments, a timer is provided so that the latch is reset after a time-out period in a long read cycle in which no data transition occurs.\",\n \"BRIEF DESCRIPTION OF THE DRAWING FIG.\",\n \"1 is an electrical diagram, in block form, of the functional architecture of a conventional one-time programmable (OTP) memory.\",\n \"FIG.\",\n \"2a is a plot illustrating sense amplifier response to bit line voltage in a conventional OTP memory.\",\n \"FIG.\",\n \"2b is a timing diagram illustrating the sense amplifier and data latch timing in a conventional OTP memory.\",\n \"FIG.\",\n \"3 is an electrical diagram, in block form, of a large scale integrated circuit including an OTP memory constructed according to embodiments.\",\n \"FIG.\",\n \"4 is an electrical diagram, in block form, of the OTP memory in the integrated circuit of FIG.\",\n \"3, constructed according to an embodiment.\",\n \"FIG.\",\n \"5 is an electrical diagram, in block form, of the functional architecture of the OTP memory of FIG.\",\n \"4 according to that embodiment.\",\n \"FIG.\",\n \"6 is an electrical diagram, in block and schematic form, of the data path in the OTP memory of FIG.\",\n \"5 according to that embodiment.\",\n \"FIGS.\",\n \"7a and 7b are electrical diagrams, in schematic form, of the sense amplifier, data latch, and logic circuitry in the OTP memory of FIG.\",\n \"5 according to an embodiment.\",\n \"FIG.\",\n \"8 is a timing diagram illustrating the sense amplifier and data latch timing of the OTP memory of FIG.\",\n \"5 according to an embodiment.\",\n \"DETAILED DESCRIPTION The one or more embodiments described in this specification are implemented into a one-time programmable (OTP), electrically programmable, read only memory, such as may be implemented into a microcontroller or other large scale integrated circuits, as it is contemplated that such implementation is particularly advantageous in that context.\",\n \"However, it is also contemplated that concepts of this invention may be beneficially applied to other applications, for example stand-alone OTP memory devices, as well as other memory technologies, particularly those for which tracking cells may not match the main memory cells in electrical characteristics and performance.\",\n \"Accordingly, it is to be understood that the following description is provided by way of example only, and is not intended to limit the true scope of this invention as claimed.\",\n \"FIG.\",\n \"3 illustrates an example of large-scale integrated circuit 10 in the form of a so-called “system-on-a-chip” (“SoC”), as now popular in many electronic systems.\",\n \"Integrated circuit 10 is a single-chip integrated circuit into which an entire computer architecture is realized.\",\n \"As such, in this example, integrated circuit 10 includes microprocessor 12, which is connected to system bus SBUS and serves as the central processing unit of the device.\",\n \"Various memory resources, including random access memory (RAM) 18 and one-time programmable read-only memory (OTP) 19, reside on system bus SBUS and are thus accessible to microprocessor 12.In this example, OTP 19 is of a type that may be erasable by exposure to ultraviolet light, namely as a UV EPROM.\",\n \"In this example, if integrated circuit 10 is packaged in a conventional opaque package, OTP 19 may be programmed once after being packaged but cannot be erased.\",\n \"Alternatively, as will be mentioned below, if integrated circuit 10 is packaged with a window by way of which the memory array of OTP 19 is visible, OTP 19 may serve as a UV EPROM.\",\n \"Other implementations of this non-volatile memory shown in FIG.\",\n \"3 as OTP 19 are contemplated, including electrically-erasable and flash implementations.\",\n \"In any case, OTP 19 in FIG.\",\n \"3 is contemplated to typically serve as program memory storing the program instructions executable by microprocessor 12, while RAM 18 serves as data memory.\",\n \"In some cases, program instructions may reside in RAM 18 for recall and execution by microprocessor 12.Other system functions are shown in integrated circuit 10 in a generic sense, by way of system control 14 and input/output interface 17.Those skilled in the art having reference to this specification will recognize that integrated circuit 10 may include additional or alternative functions to those shown in FIG.\",\n \"3, or may have its functions arranged according to a different architecture from that shown in FIG.\",\n \"3.The architecture and functionality of integrated circuit 10 is thus provided only by way of example, and is not intended to limit the scope of the claims.\",\n \"FIG.\",\n \"4 illustrates an example of the architecture of OTP 19 according to embodiments of this invention.\",\n \"While FIG.\",\n \"2 illustrates OTP 19 as embedded memory within larger-scale integrated circuit 10, OTP 19 may alternatively correspond to a stand-alone memory integrated circuit.\",\n \"Those skilled in the art having reference to this specification will also comprehend that the memory architecture of OTP 19 in FIG.\",\n \"3 is provided by way of example only, and that the memory architecture of other embodiments may vary significantly from that shown in FIG.\",\n \"3.In this example, OTP 19 includes memory array 20 containing programmable read-only memory cells arranged in rows and columns.\",\n \"While a single instance of memory array 20 is shown in FIG.\",\n \"3, it is to be understood that OTP 19 may include multiple memory arrays 20, each corresponding to a memory block within the address space of OTP 19.In the example shown in FIG.\",\n \"3, memory array 20 includes m rows and n columns of floating-gate memory cells, each of which stores one data bit.\",\n \"In these embodiments, cells in the same column share a single bit line BL[n-1:0], and cells in the same row share one of word lines WL[m-1:0].\",\n \"Memory array 20 may be alternatively arranged to include multiple array blocks or sub-arrays of cells, depending on the addressing space or memory architecture.\",\n \"Predecoder and control logic block 25 includes decoder logic and other control logic for controlling the access of selected cells in memory array 20.In this embodiment, predecoder and control logic block 25 receives a memory address from external to OTP 19, for example from microprocessor 12 via bus SBUS (FIG.\",\n \"3), along with a clock signal CLK, and one of enable signals READ or PROG that indicates whether a read or program operation, respectively, is to be performed.\",\n \"Clock signal CLK may be provided by a clock generator circuit (not shown) in integrated circuit 10, while the applicable READ and PROG signals are typically provided by the particular function in integrated circuit 10 that is accessing OTP 19 (e.g., microprocessor 12).\",\n \"In a general sense, predecoder and control logic block 25 operates to at least partially decode row and column portions of the received memory address upon receiving an instance of clock signal CLK, and will control the various functions within OTP 19 to carry out the desired read or program function.\",\n \"In read cycles, word line driver 24 receives, from predecoder and control logic block 25, row address signals that indicate the particular row of memory array 20 to be accessed along with the appropriate timing signal.\",\n \"In response, word line driver 24 energizes the one of word lines WL[m-1:0] corresponding to the decoded row address value, which causes the cells in that corresponding row to present a voltage or current dependent on the data state stored in each of those cells to its corresponding bit line BL[n-1:0] for its column.\",\n \"In the architecture of FIG.\",\n \"4, column select circuit 26 is constructed essentially as a multiplexer to select one or more of bit lines BL[n-1:0] for coupling to sense amplifiers 28, in response to the column address (as may be at least partially decoded by predecoder and control logic block 25).\",\n \"The number of sense amplifiers 28 typically corresponds to the width of the output data word.\",\n \"Sense amplifiers 28 essentially digitize the voltage or current on the selected bit lines BL[n-1:0], and forward the result to data latches 30, for eventual buffering and presentation on data output lines Q_OUT.\",\n \"As will be described in further detail below, the enabling and timing of sense amplifiers 28 and data latches 30 will be based in large part on the data transitions along the data path itself.\",\n \"Write circuitry (not shown) will also be provided in OTP 19 to program selected memory cells with data presented on data input bus D_IN in the conventional manner, specifically by the selective application of the proper programming voltages to selected bit lines BL[n-1:0].\",\n \"It is contemplated that this write circuitry and the programming operation may be implemented in any one of a number of conventional techniques for electrically programmable memory, as known in the art.\",\n \"Other circuitry, including precharge and bias circuitry for precharging and biasing bit lines BL[n-1:0], generating programming voltages, control signals, and the like, will be included within OTP 19, as typical for electrically-programmable memories as will be understood by those skilled in the art having reference to this specification.\",\n \"FIG.\",\n \"5 illustrates the functional architecture of OTP 19 in connection with the timing of the latching of sensed data in its read data path.\",\n \"According to these embodiments, OTP bit cells are arranged as rows and columns in main array 22, with the cells in the same row sharing a word line and the cells in the same column sharing a bit line BL in the conventional manner.\",\n \"At the beginning of each read cycle, bit lines BL are initialized to a particular logic level, such as the logic level exhibited by a bit cell in its unprogrammed state.\",\n \"Control logic 25 represents timing logic circuitry that, at the appropriate time in a read cycle (indicated by read enable signal READ) and responsive to a clock signal CLK, generates a word line enable signal WL_EN that in turn causes the energizing of a selected word line in main array 22.In the conventional manner, the cells in the selected row apply their data states to corresponding bit lines BL, selected ones of which are applied to corresponding sense amplifiers 28.Sense amplifiers 28 sense the levels at the selected bit lines BL, and present the sensed data states to corresponding data latches 30 on lines SA_OUT.\",\n \"According to this embodiment, each data latch 30 latches the sensed data state in response to a transition at its output D_OUT (e.g., a low-to-high transition, indicating that the corresponding cell was programmed to a “1” data state).\",\n \"Additionally, according to these embodiments, that same transition at the output of each data latch 30 also operates to isolate its input from its corresponding sense amplifier 28.The output data states on respective output lines D_OUT are forwarded to the destination, for example via an output buffer.\",\n \"Conversely, according to these embodiments, if no transition occurs at output D_OUT (i.e., the corresponding selected memory cell in main array 22 being in its un-programmed state), data latch 30 does not latch its data state, but remains in its initialized condition.\",\n \"In any case, control logic 25 resets sense amplifiers 28 and data latches 30 in advance of the next read operation, for example in response to the rising edge of clock signal CLK at the beginning of the next cycle.\",\n \"In those instances in which the selected cell in a read cycle is in its unprogrammed state such that no transition at the output of sense amplifier 28 occurs, leakage current may flow from the bit cell through its sense amplifier 28.According to some of these embodiments, timer 27 is provided in OTP memory 19 to measure a time out period from the initiation of a previous cycle and, upon reaching the end of that period without a new cycle starting, to cause control logic 25 to issue a sense amplifier reset signal on line SA_RST and also a reset signal to data latch 30; this time-out ensures the resetting of those sense amplifiers 28 that did not sense a data level transition in the previous cycle, eliminating this leakage path and undesired power consumption.\",\n \"As a result of this operation, the latching of data in the read data path is essentially “self-timed”, in the sense that a data transition in the data path itself clocks the latching of the output data.\",\n \"No tracking circuit or replica cells are required, avoiding the timing inaccuracies in one-time programmable memories in which the replica cells either do not match the actual cells in electrical characteristics at the time of manufacture or degrade differently from the actual cells over the operating life of the device.\",\n \"Indeed, the self-timing of the data path results in faster read cycle times than in the conventional memories utilizing tracking circuits, considering that the excess timing margin (t2-t1 margin in FIG.\",\n \"2b) necessitated by the differences in replica cells is not needed.\",\n \"The construction of OTP 19 according to an embodiment will now be described in further detail with reference to FIG.\",\n \"6 for the example of four representative bit cells 32 (i.e., bit cells 320,0, 320,1, 321,0, 321,1 as shown in FIG.\",\n \"6) in array 22.It is of course contemplated that many more bit cells 32 will typically be included in a given instance of array 22, as appropriate for the program code or other contents of that memory resource in integrated circuit 10.In addition, while the arrangement of FIG.\",\n \"6 illustrates a single instance of sense amplifier 28 and of data latch 30 in this read data path, by way of example, it is of course contemplated that multiple sense amplifiers 28 and data latches 30 will simultaneously be operating in the same manner in those memories in which the data word width is greater than a single bit.\",\n \"Those skilled in the art having reference to this specification will understand that the construction shown in FIG.\",\n \"6 will be representative of that for each of the multiple instances of that circuitry.\",\n \"In this embodiment, each bit cell 32j,k includes p-channel floating-gate MOS transistor 31 with its source/drain path connected in series with that of p-channel MOS select transistor 33 between a power supply voltage (e.g., the Vdd power supply voltage) and its corresponding bit line BLk.\",\n \"The gate of select transistor 33 in each bit cell 32j,k receives the word line WLj for its row; in this example, because select transistor 33 is a p-channel MOS device, word line WLj will be energized when driven to a low logic level by word line drivers 24.Word line drivers 24 energize the selected word line WLj in response to the row address signals X_DEC, which have been at least partially decoded by pre-decoder 37.The data state of a given bit cell 32j,k depends on whether its floating gate transistor 31 is programmed to have charge trapped on its floating-gate electrode.\",\n \"In this embodiment, the unprogrammed state of a bit cell 32j,k is that state in which its floating-gate transistor 31 is not conductive, and the programmed state is that in which sufficient electrons are trapped at the floating gate electrode to render that transistor 31 conductive upon application of sufficient source-drain voltage.\",\n \"Accordingly, the state of floating-gate transistor 31 of bit cell 32j,k determines the voltage at bit line BLk when its word line WLj is energized so as to turn on select transistor 33.If cell 32j,k is programmed, conduction through transistor 31 will apply a high voltage (Vcc) to bit line BLj when word line WLj is energized and its select transistor 33 is on.\",\n \"Conversely, if cell 32j,k is unprogrammed and thus non-conductive when select transistor 33 is turned on by word line WLj, the Vcc voltage will not be applied to that bit line BLj.\",\n \"In this unprogrammed state, a selected bit cell 32j,k will thus not consume any power other than that resulting from leakage current; this effect is used to advantage in this embodiment.\",\n \"Bit lines BLk are coupled to column select circuitry 26, which receives decoded column address signals Y_DEC from pre-decoder 37 and selects one of those bit lines BLk for application to sense amplifier 28 via line BL_OUT.\",\n \"Sense amplifier 28 compares the voltage or read current at the selected bit line BL_OUT with a reference level, and presents a corresponding data state on line SA_OUT to data latch 30 as described above relative to FIG.\",\n \"5.In this embodiment, data latch 30 is transparent during the sensing of the addressed memory cell 32j,k, and as such the sensed data level at line SA_OUT is communicated through data latch 30 to its output on line D_OUT.\",\n \"Output buffer 38 in turn presents that data state at its output Q_OUT, for communication to the appropriate destination in integrated circuit 10.As shown in FIG.\",\n \"6, predecoder and control logic 25 includes clock generator 36 that produces internal clock signals for OTP 19 from clock signal CLK.\",\n \"Clock signal CLK may be produced by clock circuitry (not shown) elsewhere in integrated circuit 10.In the read circuitry of OTP 19 according to this embodiment, the internal clock signals produced by clock generator 36 include clock signal ACLK that is applied to predecoder 37 and control logic 35, and reset signal RESET applied to timer 27, both produced, for example, after suitable times following a rising edge of clock signal CLK.\",\n \"As mentioned above, predecoder 37 receives the desired memory address from the requesting function in integrated circuit 10 (e.g., via bus SBUS of FIG.\",\n \"3) and, in response to the clock signal ACLK from clock generator 36, at least partially decodes that memory address for use by word line drivers 24 and column select circuit 26.Timer 27 is a conventional timer circuit that, in this embodiment, measures a maximum cycle time period beginning from the reset signal RESET from clock generator 36 at the beginning of the cycle.\",\n \"As will be described below in connection with its operation, OTP 19 according to these embodiments is initialized at the beginning of a read cycle, rather than at the end of the read operation as may be indicated by a tracking circuit in conventional memories.\",\n \"Because the data latch timing is based on a one-way transition in the read path according to the self-timing operation, reset will not otherwise occur in read cycles in which no data transition is detected, particularly if that cycle is not soon followed by another read operation.\",\n \"Accordingly, the operation of timer 27 ensures reset of sense amplifiers 28 and initialization of bit lines BL in array 22 after some specified maximum time-out period.\",\n \"For example, if the nominal read cycle period of OTP 19 is on the order of 50 nsec, a suitable time-out period measured by timer 27 may be on the order of 200 nsec or longer.\",\n \"Upon the expiration of the time-out period, timer 27 issues a signal EOC to control logic 35.Control logic 35 is constructed as logic circuitry that issues control signals to various circuits in the read path according to these embodiments.\",\n \"As mentioned above, control logic 35 receives internal clock signal ACLK from clock generator 36, end-of-cycle signal EOC from timer 27, and the read and program control signals READ and PRGM, respectively, from microprocessor 12 or another function in integrated circuit 10, indicating the type of cycle to be performed by OTP 19.According to the embodiment of FIG.\",\n \"6, control logic 35 issues an enable signal ENSAZ to latch set-reset logic 34 and to sense amplifiers 28 in response to the internal clock signal ACLK at the beginning of a read cycle (as indicated by the READ control signal); enable signal ENSAZ is also issued by control logic 35 in response to the end-of-cycle signal EOC from timer 27.According to this embodiment, and as will be described in further detail below, enable signal ENSAZ operates to reset sense amplifiers 28 and initiate reset of data latches 30.In addition to enable signal ENSAZ, line D_OUT from the output of data latch 30 is communicated to latch set-reset logic 34.As discussed above and as will be described in further detail below, latch set-reset logic 34 issues a latch signal LAT to data latch 30 in response to a transition at line D_OUT, latching that data state into data latch 30 to allow sense amplifier 28 and the remainder of the upstream circuitry can be reset for the next cycle.\",\n \"As shown in FIG.\",\n \"6, latch signal LAT is also applied to sense amplifier 28 to disable it responsive to the transition at line D_OUT.\",\n \"FIGS.\",\n \"7a and 7b illustrate the data path circuitry of OTP 19 according to the embodiment of FIG.\",\n \"6 in further detail.\",\n \"In FIG.\",\n \"7a, a single bit cell 32j,k is illustrated for the sake of clarity; it will of course be understood that the particular bit cell 32j,k coupled to this instance of sense amplifier 28 will be the one corresponding to the decoded memory address.\",\n \"As shown in FIG.\",\n \"7a, bit line BLk is associated with a corresponding precharge transistor 42k having its source/drain path connected between bit line BLk and ground, and its gate receiving control signal BLDIS from control logic 35 or other appropriate circuitry in OTP 19.According to this embodiment, each bit line BLk will be initialized by its associated precharge transistor 42k to a voltage corresponding to the unprogrammed state for bit cells 32, prior to the initiation of a read operation.\",\n \"As such, if the selected bit cell 32j,k for bit line BLk is in the unprogrammed state, no transition will occur at bit line BLk.\",\n \"Conversely, if selected bit cell 32j,k is in its programmed state, bit line BLk will make a transition from its precharged level, in this embodiment from ground to a high voltage (e.g., approaching Vcc).\",\n \"Column select transistor 26k has its source/drain path connected between bit line BLk and its associated sense amplifier 28, and receives decoded column select signal CSELk at its gate.\",\n \"If bit line BLk corresponds to the column indicated by the received column address, decoded signal CSELk is energized, turning on transistor 26k to connect bit line BLk to sense amplifier 28, at sense node SN.\",\n \"Sense amplifier 28 in this embodiment is essentially a current comparator, comparing the current conducted from bit line BLk to a reference current.\",\n \"The reference current in sense amplifier 28 is established by reference transistor 45, which has its source/drain path connected in series with that of transistor 46 between sense node SN and ground.\",\n \"The gate of reference transistor 45 receives a bias voltage NBIAS from a reference circuit elsewhere in OTP 19 or integrated circuit 10, while transistor 46 receives the latch signal LAT from latch set-reset logic 34 as will be described below.\",\n \"Bias voltage NBIAS establishes the reference current conducted by transistors 45 and 46 in the read cycle, such that the voltage at sense node SN depends on whether the current from the selected cell 32j,k via bit line BLk exceeds the reference current.\",\n \"For bit cell 32j,k in the unprogrammed state, bit line BLk will conduct at most a leakage current, and transistors 45 and 46 will pull sense node SN to ground.\",\n \"For bit cell 32j,k in its programmed (i.e., conductive) state, the bit line current will be sufficient to overcome the smaller reference current established by reference transistor 45, and the voltage of sense node SN will rise toward Vcc.\",\n \"Inverters 40a, 40b, connected in series between sense node SN and data latch 30, produce a logic level at the output SA OUT of sense amplifier 28 corresponding to the voltage at sense node SN and thus to the state of selected bit cell 32j,k.\",\n \"According to this embodiment, data latch 30 includes a first pass gate 50a coupled to the output SA OUT of sense amplifier 28 and controlled by latch signal LAT from latch set-reset logic 34.Pass gate 50a may be constructed as a pair of complementary MOS transistors with their source/drain paths in parallel and receiving complementary signals at their respective gates (i.e., latch signal LAT and its complement LATZ, in this example) as known in the art, or alternatively may be a single pass transistor.\",\n \"The opposite side of pass gate 50a is connected to the input of inverter 52a, which has its output connected to an input of each of inverters 52b, 52c.\",\n \"Pass gate 50b connects the output of inverter 52b to the input of inverter 52a to form a latch when pass gate 50b is conductive.\",\n \"In this embodiment, pass gate 50b receives complement latch signal LATZ, generated from latch signal LAT by inverter 49.As such, pass gate 50b is off when pass gate 50a is on (with latch signal LAT at a high logic level), and pass gate 50a is off when pass gate 50b is on (with latch signal LAT at a low logic level).\",\n \"Latch output D_OUT at the output of inverter 52c is applied to output buffer 38 and to latch set-reset logic 34.FIG.\",\n \"7b illustrates the construction of latch set-reset logic 34 according to this embodiment.\",\n \"Latch set-reset logic 34 includes a pair of cross-coupled NAND gates 54a, 54b, each having an input receiving the output of the other.\",\n \"The other input of NAND gate 54a receives the logical complement (via inverter 55a) of enable signal ENSAZ from control logic 35 (FIG.\",\n \"6).\",\n \"The other input of NAND gate 54b receives the logical complement (via inverter 55b) of latch output D_OUT.\",\n \"Accordingly, latch set-reset logic 34 is operable to assert latch signal LAT in response to a high logic level at either enable signal ENSAZ or at latch output D_OUT.\",\n \"Of course, latch set-reset logic 34 may be realized by other logic circuit arrangements to carry out the functions of control logic 25 according to these embodiments.\",\n \"For example, in the embodiment shown in FIG.\",\n \"7a, latch signal LAT from latch set-reset logic 34 is applied to the gate of transistor 46 in sense amplifier 28, simplifying the logic arrangement of this circuitry for efficient implementation.\",\n \"Alternatively, control logic 25 may be arranged to disable sense amplifier 28 (e.g., by turning off its transistor 46) separately from the setting and resetting of data latch 30.It is contemplated that those skilled in the art will be readily able to realize the particular arrangement of control logic 25, including latch set-reset logic 34, in the manner desired for each specific implementation of these embodiments.\",\n \"Referring now to FIG.\",\n \"8, an example the operation of the read path architecture of OTP 19 according to the embodiment of FIGS.\",\n \"6, 7a, and 7b in carrying out a read cycle will now be described, specifically for the case of an OTP cell 32j,k programmed to a “1” data state (i.e., having charge trapped at the floating-gate of transistor 31 to render it conductive).\",\n \"As will be apparent from this description, in the previous read cycle and thus prior to the beginning of the read cycle at time t0, latch set-reset logic 34 has issued latch signal LAT at a logic low level.\",\n \"In data latch 30, pass transistor 50a is thus off and pass transistor 50b is on, such that data latch 30 is retaining the previous data state D_OUT and presenting the corresponding logic level at its output D_OUT.\",\n \"In this example, the read cycle begins with a rising edge of clock signal CLK applied to clock generator 36 (FIG.\",\n \"6), in response to which clock generator 36 issues a trailing edge of internal clock signal ACLK to predecoder 37 and control logic 35 to initiate the cycle.\",\n \"As described above relative to FIG.\",\n \"7a, bit lines BLk are each precharged to ground, for example by control circuitry briefly asserting signal BLDIS to turn on transistors 42k in response to this transition of internal clock signal ACLK.\",\n \"The high-to-low transition of internal clock signal ACLK also causes predecoder 37 to begin the decoding of the received row and column addresses, for example from system bus SBUS, for application to word line drivers 24 and column select circuit 26, which in turn respectively initiate the access of the selected row of cells and the selection of those bit lines BLk that are to be sensed.\",\n \"In this example, the selected cell 32j,k in row j and column k is in its programmed (“1”) state, and as such will pull its selected bit line BLk to a high voltage for sensing.\",\n \"In a read cycle (i.e., with read signal READ asserted) and in response to internal clock signal ACLK, control logic 35 issues a pulse of enable signal ENSAZ to sense amplifier 28 and latch set-reset logic 34.In this embodiment of the invention, this enable signal ENSAZ pulse initializes each sense node SN to a low level by turning on transistor 44 in each sense amplifier 28.In addition, as shown in FIG.\",\n \"8, the rising edge of the ENSAZ pulse causes latch set-reset logic 34 to issue a rising edge of latch signal LAT to sense amplifier 28 and data latch 30 according to this embodiment.\",\n \"The high level of latch signal LAT turns on transistor 46 in sense amplifier 28, allowing conduction of the reference current from sense node SN through transistor 45, under the control of bias voltage NBIAS.\",\n \"In addition, latch signal LAT “resets” data latch 30 by turning on its pass gate 50a and turning off its pass gate 50b.\",\n \"In this “reset” state, the previous state stored in data latch 30 is no longer latched, and the current level at sense amplifier output SA OUT passes through data latch 30 via inverters 50a, 50c.\",\n \"At the end of the pulse of enable signal ENSAZ, as determined by control logic 35, transistor 44 is turned off so that sense node SN is no longer held at ground except through reference transistor 45.Accordingly, the voltage at selected bit line BLk, as determined by the data state of the selected cell 32j,k, will be reflected at sense node SN to the extent that the read current through selected cell 32j,k exceeds the reference current through transistor 45.For the “1” state, as described above, the read current will exceed the reference current, and sense node SN will be pulled up to a high level with bit line BLk.\",\n \"Referring to FIG.\",\n \"8, in response to bit line BLk (and thus sense node SN) reaching the trip voltage Vtrip of inverter 40a of sense amplifier 28, sense amplifier output SA OUT makes a transition to a high logic level as driven by inverter 40b.\",\n \"With pass gate 50a in data latch 30 turned on (latch signal LAT being high at this time), the high logic level at sense amplifier SA OUT is reflected at latch output D_OUT following the propagation delay through inverters 52a, 52c.\",\n \"Access time Tacc shown in FIG.\",\n \"8 refers to the time interval between the rising edge of clock signal CLK and the low-to-high transition at latch output D_OUT.\",\n \"Because data latch 30 is transparent during the sense operation, this access time Tacc essentially depends on the read current supplied by the addressed memory cell 32j,k in its “1” data state.\",\n \"Buffer 38 then presents that high logic level on line Q_OUT in the data path of OTP 19.According to this embodiment, latch set-reset logic 34 terminates the pulse of latch signal LAT in response to the low-to-high transition at latch output D_OUT.\",\n \"Specifically, the trailing edge of latch signal LAT “sets” data latch 30 by turning off pass gate 50a and turning on pass gate 50b, such that the output of inverter 52b is coupled to the input of inverter 52a.\",\n \"The sensed “1” data state is latched into and retained by data latch 30 in this “set” state, and is no longer influenced by the level at sense amplifier output SA_OUT.\",\n \"In addition, also according to this embodiment, transistor 46 in sense amplifier 28 is turned off, ending the sense operation for this cycle.\",\n \"In this state, as described above, the low level of latch signal LAT maintains sense amplifier 28 off and data latch 30 de-coupled from sense amplifier SA_OUT.\",\n \"Precharge transistor 42k is turned on to initialize bit line BLk in the next cycle, and as such the programmed selected cell 32j,k draws no current other than leakage current.\",\n \"Data latch 30 maintains the “1” data state at data output line Q for the remainder of the cycle.\",\n \"This state is maintained until the next rising edge of clock signal CLK, which starts the next cycle for OTP 19.For the case of a unprogrammed (“0”) cell 32j,k, the operation of OTP 19 is similar to that described above relative to FIG.\",\n \"8, except that no transition occurs at sense amplifier output SA_OUT, and therefore no transition occurs at latch output D_OUT.\",\n \"No pulse of latch signal LAT is thus generated by latch set-reset logic 34.Data latch 30 remains unlatched in this case (pass gate 50b remains off), and simply passes the low logic level at sense amplifier output SA_OUT to buffer 38 for presentation at data output Q_OUT.\",\n \"Since the pulse of latch signal LAT is not terminated for this “0” data state case, transistor 46 remains on and thus sense amplifier 28 remains on for the duration of the cycle.\",\n \"Any leakage current through the “0” state cell 32j,k will thus be conducted along bit line BLk and through transistors 45 and 46 to ground.\",\n \"Because floating-gate transistor 33 in the selected cell 32j,k is not held off with a hard gate voltage, however, it is contemplated that some leakage current can occur from some of the cells 32 in array 22.While this leakage may not be significant over relatively short cycle times (i.e., between rising edges of clock signal CLK, shown as Tcyc in FIG.\",\n \"8), the leakage power consumed can be significant in long cycle times, which can frequently occur for OTP 19 given its static nature.\",\n \"For example, the last cycle in a burst read of OTP 19 can be quite long, extending from the end of one burst until the beginning of the next.\",\n \"According to this embodiment, timer 27 is provided within control logic 25 to initiate a reset of sense amplifiers 28 and data latches 30, if not occurring in response to a data transition, after a maximum allowable cycle time interval elapses.\",\n \"Timer 27 may be constructed in the conventional manner, for example as a countdown (or count-up) timer that advances its stored contents with each cycle of a periodic clock signal.\",\n \"In the embodiment of FIG.\",\n \"6, timer 27 receives a reset clock RESET from clock generator 36 in response to each rising edge of clock signal CLK.\",\n \"This transition of reset clock RESET causes timer 27 to begin measuring a time interval corresponding to a maximum cycle time, for example by executing a countdown (or up-count) of clock pulses.\",\n \"An example of the maximum cycle time may be on the order of 200 nsec; typical cycle times in normal operation of an OTP are typically on the order 50 nsec or less.\",\n \"Typically, timer 27 will be clocked by a higher frequency clock, for example as may be generated by clock generator 36.Upon reaching the pre-programmed or selected maximum time interval, timer 27 then issues an end-of-cycle signal EOC to control logic 35, which in turn issues a pulse of enable signal ENSAZ to latch set-reset logic 34.In response to the ENSAZ pulse, as described above latch set-reset logic 34 issues a pulse of latch signal LAT, setting data latch 30 to store the “0” data state at sense amplifier output SA_OUT, and turning off sense amplifier 28 by turning off transistor 46.With sense amplifier 28 disabled in this manner, any leakage current through unprogrammed “0” cell 32j,k will be blocked by the off-state transistor 46 from communication to ground, and excess power consumption will be minimized.\",\n \"Accordingly, these embodiments operate to “self-latch” the sensed data state of the selected OTP cell, at a timing corresponding to transition of the sensed data state itself.\",\n \"No tracking circuit or replica cells are required for controlling the timing of the data latch, as in conventional OTP memories.\",\n \"As a result, the self-timing of the data latch can essentially be as fast as the operation of the memory itself, and need not include the excessive timing margin of conventional tracking circuits that must allow for variations between the replica cells or other delay circuits with the performance of the OTP cells over the operating life of the device.\",\n \"Rather, as the OTP cell performance may degrade over the operating life, the self-latching operation according to these embodiments will precisely follow any such degradation.\",\n \"Referring to FIG.\",\n \"2a, the cycle time Tcyc of OTP 19 according to these embodiments can be minimized, because the need to include “t2-t1 margin” as shown in FIGS.\",\n \"2a and 2b is eliminated according to these embodiments.\",\n \"In addition, these embodiments implement the self-latching read data path in a manner that minimizes excessive power consumption, and that can be efficiently realized, from the standpoint of chip area and circuit complexity, in modern integrated circuits.\",\n \"While one or more embodiments have been described in this specification, it is of course contemplated that modifications of, and alternatives to, these embodiments, such modifications and alternatives capable of obtaining one or more the advantages and benefits of this invention, will be apparent to those of ordinary skill in the art having reference to this specification and its drawings.\",\n \"It is contemplated that such modifications and alternatives are within the scope of this invention as subsequently claimed herein.\"\n ]\n]"},"source":{"kind":"string","value":"Patent_15871381"}}},{"rowIdx":4493775,"cells":{"text":{"kind":"list like","value":[["GLASS SHEET FORMING AND ANNEALING SYSTEM PROVIDING EDGE STRESS CONTROL","A glass sheet forming and annealing system disclosed provides control of edge stresses by maintaining a press formed glass sheet on an annealing ring (72) below a heated upper forming mold (58) within a forming station (12) for slow cooling toward the glass strain point temperature."],["1.A system for glass sheet forming and annealing comprising: a furnace for heating a glass sheet to its forming temperature; a forming station located adjacent the furnace; a conveyor for conveying the heated glass sheet from the furnace to the forming station; the forming station having an upper forming mold which is heated and has a downwardly facing forming face, the forming station also having a lower forming mold that is movable upwardly to lift the heated glass sheet from the conveyor to the upper forming mold for pressing that provides the glass sheet with a formed shape, and a source of vacuum for drawing a vacuum at the upper forming mold to maintain the formed glass sheet on the upper forming mold as the lower mold is moved downwardly after the press forming; an annealing ring that is movable under the heated upper forming mold and the formed glass sheet supported thereon to receive the formed glass sheet upon termination of the vacuum drawn at the upper forming mold; and a controller that controls operation of the forming station, the conveyor, and the annealing ring, and after the formed glass sheet is received by the annealing ring the controller is configured to maintain the annealing ring and the formed glass sheet thereon in the forming station below the heated upper forming mold for at least three seconds prior to movement from the forming station for slow cooling of the formed glass sheet toward the strain point temperature to control edge stresses upon final cooling to ambient temperature.","2.A system for glass sheet forming and annealing as in claim 1 wherein the furnace includes a preforming end section having inclined bending rolls that preform the heated glass sheet prior to movement to the forming station for the press forming.","3.A method for glass sheet forming and annealing as in claim 1 wherein the system includes a roll conveyor having a flat plane of conveyance for conveying flat heated glass sheets to the forming station for the press forming.","4.A system for glass sheet forming and annealing as in claim 1 wherein the lower forming mold has four sides defining a ring shape and each side having a T-shaped cross section including a vertical stem and a crossbar supported on the vertical stem and having an upwardly facing forming surface, each side of the lower forming mold having a pair of electrical heating elements at lower locations below its crossbar where it is supported on its vertical stem, and the forming face of the crossbar of each side having three grooves and three electrical heating elements respectively received within the three grooves to limit heat loss from the glass sheet to control edge stresses upon final cooling to ambient temperature.","5.A system for glass sheet forming and annealing as in claim 4 wherein the lower forming mold has insulation within the interior and around the exterior of its ring shape.","6.A system for glass sheet forming and annealing as in claim 1 wherein the annealing ring includes vertically extending baffles at upstream and downstream locations relative to the direction of movement of the annealing ring from the forming station to limit cooling from air flow across the formed glass sheet during that movement.","7.A system for glass sheet forming and annealing as in claim 6 wherein the vertically extending baffles extend both upwardly and downwardly from the annealing ring.","8.A system for glass sheet forming and annealing as in claim 1 wherein the annealing ring further includes heaters and also includes insulation within its interior and around its exterior to limit heat flow from the formed glass sheet to slow its cooling.","9.A system for glass sheet forming and annealing as in claim 1 wherein the controller maintains the annealing ring and the formed glass sheet thereon in the forming station below the heated upper forming mold for at least five seconds, and for some glass sheets at least 6.5 seconds, prior to movement from the forming station for the slow cooling of the formed glass sheet toward the strain point temperature to control edge stresses upon final cooling to ambient temperature.","10.A system for glass sheet forming and annealing comprising: a furnace for heating a glass sheet to its forming temperature; the furnace including a preforming end section having inclined bending rolls for preforming the heated glass sheet with an upwardly concave shape; a forming station located adjacent the furnace; a conveyor for conveying the preformed glass sheet from the furnace to the forming station; the forming station having an upper forming mold which is heated and has a downwardly facing forming face; the forming station also having a lower forming mold that is movable upwardly to lift the preformed glass sheet from the conveyor to the upper forming mold for pressing that provides the glass sheet with a formed shape, the lower forming mold having four sides defining a ring shape and each side having a T-shaped cross section including a vertical stem and a crossbar supported on the vertical stem and having an upwardly facing forming surface, each side of the lower forming mold having a pair of electrical heating elements at lower locations below its crossbar where it is supported on its vertical stem, the forming face of the crossbar of each side having three grooves and three electrical heating elements respectively received within the three grooves to limit heat loss from the glass sheet, and the ring shape of the forming mold having insulation within its interior and around its exterior to also limit heat loss from the glass sheet; a source of vacuum for drawing a vacuum at the upper forming mold to maintain the formed glass sheet on the upper forming mold as the lower mold is moved downwardly after the press forming; an annealing ring that is movable under the heated upper forming mold and the formed glass sheet supported thereon to receive the formed glass sheet upon termination of the vacuum drawn at the upper forming mold, the annealing ring including heaters and also including upwardly and downwardly extending baffles at upstream and downstream locations relative to the direction of subsequent movement of the annealing ring from the forming station to limit cooling from air flow across the formed glass sheet during that movement, and insulation within the annealing ring and around its exterior to limit heat flow from the formed glass sheet to slow its cooling; and a controller that controls operation of the forming station, the conveyor, and the annealing ring, and that after the formed glass sheet is received by the annealing ring the controller is configured to maintain the annealing ring and the formed glass sheet thereon in the forming station below the heated upper forming mold for at least five seconds, and for some glass sheets at least 6.5 seconds, prior to movement from the forming station so as to provide the slow cooling of the formed glass sheet to the strain point temperature and thereby control edge stresses upon final cooling to ambient temperature."],[" BACKGROUND When glass sheets are heated for forming and annealing, the glass sheet peripheral edge portions have oppositely facing surfaces and an edge surface that affect cooling and resultant tensile and compressive stresses after the annealing is completed.","To meet certain manufacturing specifications for formed glass sheets that are annealed, these tensile and compressive stresses must be in a controlled range which can be difficult to achieve because of increased heating and cooling that takes place at the edge portions of the glass sheet as opposed to the central regions where there are effectively only two oppositely facing surfaces from which the glass is heated and cooled.","See U.S. Pat.","Nos.","5,385,786 Shetterly et al.","; 5,536,581 Shetterly et al.","; 5,679,124 Schnabel, Jr. et al.","; 5,865,866 Schnabel, Jr. et al.","; 6,015,619 Schnabel, Jr. et al.","; 6,543,255 Bennett et al.","; and 6,578,383 Bennett et al., the entire disclosures of which are hereby incorporated by reference."],[" SUMMARY An object of the present invention is to provide an improved system for glass sheet forming and annealing to control edge stresses.","In carrying out the above object, the system for glass sheet forming and annealing according to the invention includes a furnace for heating a glass sheet to its forming temperature, a forming station located adjacent the furnace, and a conveyor for conveying the heated glass sheet from the furnace to the forming station.","The forming station has an upper forming mold which is heated and has a downwardly facing forming face.","The forming station also has a lower forming mold that is movable upwardly to lift the heated glass sheet from the conveyor to the upper forming mold for pressing that provides the glass sheet with a formed shape, and a source of vacuum for drawing a vacuum at the upper forming mold to maintain the formed glass sheet on the upper forming mold as the lower mold is moved downwardly after the press forming.","An annealing ring of the system is movable under the heated upper forming mold and the formed glass sheet supported thereon to receive the formed glass sheet upon termination of the vacuum drawn at the upper forming mold.","A controller of the system controls operation of the forming station, the conveyor, and the annealing ring, and after the formed glass sheet is received by the annealing ring the controller is configured to maintain the annealing ring and the formed glass sheet thereon in the forming station below the heated upper forming mold for at least three seconds prior to movement from the forming station so as to provide slow cooling of the formed glass sheet toward the strain point temperature and thereby control edge stresses upon final cooling to ambient temperature.","The system is disclosed in one embodiment as having its furnace including a preforming end section having inclined bending rolls that preform the heated glass sheet prior to movement of the forming station for the press forming.","In another embodiment, the system is disclosed as including a roll conveyor having a flat plane of conveyance for conveying flat heated glass sheets to the forming station for the press forming.","As disclosed, the lower forming mold has four sides defining a ring shape and each side has a T-shaped cross section including a vertical stem and a crossbar supported on the vertical stem and having an upwardly facing forming surface.","Each side of the lower forming mold has a pair of electrical heating elements at lower locations below its crossbar where it is supported on its vertical stem, and the forming face of the crossbar of each side has three grooves and three electrical heating elements respectively received within the three grooves to limit heat loss from the glass sheet to control edge stresses upon final cooling to ambient temperature.","As disclosed, the lower forming mold has insulation within the interior and around the exterior of its ring shape.","Also, the disclosed annealing ring includes vertically extending baffles at upstream and downstream locations relative to the direction of movement of the annealing ring from the forming station to limit cooling from air flow across the formed glass sheet during that movement.","The vertically extending baffles as disclosed extend both upwardly and downwardly from the annealing ring.","The annealing ring includes heaters and also includes insulation within and around its exterior to limit heat flow from the formed glass sheet to provide its slow cooling.","The controller of the system maintains the annealing ring and the formed glass sheet thereon in the forming station below the heated upper forming mold for at least five seconds, and for some glass sheets at least 6.5 seconds, prior to movement from the forming station for the slow cooling of the formed glass sheet toward the strain point temperature to control edge stresses upon final cooling to ambient temperature."],["CROSS-REFERENCE TO RELATED APPLICATIONS This application is a divisional of U.S. patent application Ser.","No.","14/551,226 filed on Nov. 24, 2014 by Terry A. Bennett under the title GLASS SHEET FORMING AND ANNEALING PROVIDING EDGE STRESS CONTROL, the disclosure of which is hereby incorporated in its entirety by reference herein.","TECHNICAL FIELD This application discloses a glass sheet forming and annealing system that provides edge stress control.","BACKGROUND When glass sheets are heated for forming and annealing, the glass sheet peripheral edge portions have oppositely facing surfaces and an edge surface that affect cooling and resultant tensile and compressive stresses after the annealing is completed.","To meet certain manufacturing specifications for formed glass sheets that are annealed, these tensile and compressive stresses must be in a controlled range which can be difficult to achieve because of increased heating and cooling that takes place at the edge portions of the glass sheet as opposed to the central regions where there are effectively only two oppositely facing surfaces from which the glass is heated and cooled.","See U.S. Pat.","Nos.","5,385,786 Shetterly et al.","; 5,536,581 Shetterly et al.","; 5,679,124 Schnabel, Jr. et al.","; 5,865,866 Schnabel, Jr. et al.","; 6,015,619 Schnabel, Jr. et al.","; 6,543,255 Bennett et al.","; and 6,578,383 Bennett et al., the entire disclosures of which are hereby incorporated by reference.","SUMMARY An object of the present invention is to provide an improved system for glass sheet forming and annealing to control edge stresses.","In carrying out the above object, the system for glass sheet forming and annealing according to the invention includes a furnace for heating a glass sheet to its forming temperature, a forming station located adjacent the furnace, and a conveyor for conveying the heated glass sheet from the furnace to the forming station.","The forming station has an upper forming mold which is heated and has a downwardly facing forming face.","The forming station also has a lower forming mold that is movable upwardly to lift the heated glass sheet from the conveyor to the upper forming mold for pressing that provides the glass sheet with a formed shape, and a source of vacuum for drawing a vacuum at the upper forming mold to maintain the formed glass sheet on the upper forming mold as the lower mold is moved downwardly after the press forming.","An annealing ring of the system is movable under the heated upper forming mold and the formed glass sheet supported thereon to receive the formed glass sheet upon termination of the vacuum drawn at the upper forming mold.","A controller of the system controls operation of the forming station, the conveyor, and the annealing ring, and after the formed glass sheet is received by the annealing ring the controller is configured to maintain the annealing ring and the formed glass sheet thereon in the forming station below the heated upper forming mold for at least three seconds prior to movement from the forming station so as to provide slow cooling of the formed glass sheet toward the strain point temperature and thereby control edge stresses upon final cooling to ambient temperature.","The system is disclosed in one embodiment as having its furnace including a preforming end section having inclined bending rolls that preform the heated glass sheet prior to movement of the forming station for the press forming.","In another embodiment, the system is disclosed as including a roll conveyor having a flat plane of conveyance for conveying flat heated glass sheets to the forming station for the press forming.","As disclosed, the lower forming mold has four sides defining a ring shape and each side has a T-shaped cross section including a vertical stem and a crossbar supported on the vertical stem and having an upwardly facing forming surface.","Each side of the lower forming mold has a pair of electrical heating elements at lower locations below its crossbar where it is supported on its vertical stem, and the forming face of the crossbar of each side has three grooves and three electrical heating elements respectively received within the three grooves to limit heat loss from the glass sheet to control edge stresses upon final cooling to ambient temperature.","As disclosed, the lower forming mold has insulation within the interior and around the exterior of its ring shape.","Also, the disclosed annealing ring includes vertically extending baffles at upstream and downstream locations relative to the direction of movement of the annealing ring from the forming station to limit cooling from air flow across the formed glass sheet during that movement.","The vertically extending baffles as disclosed extend both upwardly and downwardly from the annealing ring.","The annealing ring includes heaters and also includes insulation within and around its exterior to limit heat flow from the formed glass sheet to provide its slow cooling.","The controller of the system maintains the annealing ring and the formed glass sheet thereon in the forming station below the heated upper forming mold for at least five seconds, and for some glass sheets at least 6.5 seconds, prior to movement from the forming station for the slow cooling of the formed glass sheet toward the strain point temperature to control edge stresses upon final cooling to ambient temperature.","BRIEF DESCRIPTION OF THE DRAWINGS FIG.","1 is a schematic side elevational view of one embodiment of a system for glass sheet forming and annealing according to the invention.","FIG.","2 is a schematic cross sectional view through the system taken along the direction of line 2-2 in FIG.","1 through a furnace preforming end section having horizontal and inclined rolls at which heated glass sheets are conveyed for initial roll forming prior to exiting the furnace in preparation for further forming.","FIG.","3 is a schematic cross sectional view taken through the system along line 3-3 in FIG.","1 at a forming station thereof to illustrate the construction of a lower press ring assembly having a press ring and also illustrating the construction of an upper forming mold, which press ring and upper forming mold are movable as disclosed by the solid and phantom line indicated positions to press form the initially roll formed glass sheet.","FIG.","4 is a schematic side elevational view similar to FIG.","1 of another embodiment of the glass sheet forming and annealing system according to the invention whose forming station forms and anneals a heated flat glass sheet received from the furnace.","FIG.","5 is a cross sectional view taken along the direction of line 5-5 in FIG.","4 to further illustrate the flat shape of the glass sheet prior to its press forming and annealing as shown by phantom line representation.","FIG.","6 is a schematic side elevational view similar to FIGS.","1 and 4 and illustrating the manner in which the formed glass sheet is released from the upper forming mold onto the annealing ring and then maintained within the forming station for a dwell time that slows cooling thereof toward the strain point temperature to provide control of the final edge stresses upon cooling to ambient temperature.","FIG.","7 is a view similar to FIG.","6 at a later stage after the formed glass sheet has been moved from the forming station to a cooling station for further cooling to the ambient temperature.","FIG.","8 is a flow chart that illustrates the steps involved in the forming and annealing with the embodiment of FIG.","1.FIG.","9 is a top plan view illustrating the lower forming mold which has a ring shape as disclosed with insulation both within its interior and around its exterior.","FIG.","10 is a cross sectional view taken through the lower forming mold along the direction of line 10-10 in FIG.","9 to illustrate the construction of heaters that maintain the glass edge portion heated during the press forming.","FIG.","11 is a top plan view of the annealing ring taken along the direction of line 11-11 in FIG.","6 to illustrate its construction including insulation within its interior and around its exterior as well as upstream and downstream baffles that after the dwell time limit cooling during movement of the glass sheet from the forming station.","FIG.","12 is a side elevational view taken along the direction of line 12-12 in FIG.","11 to further illustrate the upstream and downstream baffles.","FIG.","13 is a sectional view taken along the direction of arrows 13-13 in FIG.","11 to illustrate the construction of the annealing ring along each of its four sides.","DETAILED DESCRIPTION As required, detailed embodiments of the present invention are disclosed herein; however, it is to be understood that the disclosed embodiments are merely exemplary of the invention that may be embodied in various and alternative forms.","The figures are not necessarily to scale; some features may be exaggerated or minimized to show details of particular components.","Therefore, specific structural and functional details disclosed herein are not to be interpreted as limiting, but merely as a representative basis for teaching one skilled in the art to variously employ the present invention.","With reference to FIG.","1 of the drawings, one embodiment of the system for forming and annealing glass sheets according to the invention is generally indicated by 10.The construction and method of operation of the system will be described in an integrated manner to facilitate an understanding of different aspects of the invention.","The system 10 includes a forming and annealing station 12 and also includes a furnace 14 that has a preforming end section 16 just upstream along a direction of conveyance C from the forming and annealing station 12.Downstream from the forming and annealing station 12 along the direction of conveyance C, the system 10 is illustrated as including a final cooling station 18 to which the formed glass sheet after initial cooling in the forming and annealing station is further cooled to ambient temperature.","As illustrated by continuing reference to FIG.","1, the furnace 14 has entry and exit ends 20 and 22 and includes a heating chamber 24 (FIG.","2) having a conveyor 26 for conveying glass sheets along the direction of conveyance through the furnace from the entry end to the exit end.","The conveyor 26 on which the glass sheets are heated can be either a conventional gas hearth or a roll conveyor on which the glass sheets are conveyed during heating from ambient temperature to a sufficiently high temperature to permit bending.","The furnace exit end 22 includes the preforming end section 16 which is illustrated in FIG.","2 as having horizontally extending conveyor rolls 28 that are rotatively driven and spaced horizontally within the heating chamber along the direction of conveyance extending laterally with respect thereto to support and convey the heated glass sheets.","The preforming end section 16 also includes a pair of sets 30 of bending rolls 32, with the bending roll sets 30 spaced laterally with respect to each other within the heating chamber 24 along the direction of conveyance.","Each set of bending rolls 30 is supported and rotatively driven by a drive mechanism 34 with the bending rolls at progressively increasing inclinations along the direction of conveyance as illustrated by reference numerals 32a, 32b, 32c and 32d in FIG.","2.The conveyance of each heated glass sheet G along the direction of conveyance in cooperation with the bending rolls 32 provides bending or preforming of the heated glass sheet with an upwardly concave shape as illustrated in FIG.","2 along a direction transverse to the direction of conveyance.","With combined reference to FIGS.","1 and 3-5, the forming and annealing station 12 as previously mentioned is located externally of the furnace 14 downstream from its exit end 22 to receive the preformed glass sheets from the preforming end section 16.More specifically, the forming and annealing station 12 includes a conveyor 36 for receiving a heated glass sheet to be press bent.","The conveyor 36 includes a lower support structure 38 and a bed of a plurality of conveyor assemblies 40 specifically indicated as 40w and 40r on the support structure.","Each conveyor assembly 40, includes a horizontally extending elongated roller 41 located laterally at a central location of the conveyor.","Each conveyor assembly 40w has an upper wheel 44 for supporting and conveying upwardly formed portions of the preformed glass sheet within the press bending station.","A drive mechanism provides rotational driving of the roller 41 and rotational driving of the wheel 44 of each wheel assembly 40, specifically 40r or 40w, upon connection thereof to the lower support structure 38.For a more detailed description of the conveyor and the drive mechanism, refer to U.S. Pat.","No.","6,543,255 and United States patent application Publication No.","2011/0247367, the entire disclosures of both of which are hereby incorporated by reference.","As illustrated in FIG.","3, a lower mount of the forming and annealing station 12 is schematically illustrated at 50 and supports a lower forming mold that is disclosed as a lower press ring 52 having a concave curved shape 54 facing upwardly and being received within the conveyor 36 below the upper extremities of the horizontal rollers 41 and the wheels 44 of the conveyor assemblies 40r or 40w in a ring shape thereof where no conveyor assemblies are located.","As further illustrated in FIG.","3, an upper mount 56 of the press station 12 supports an upper forming mold 58 having a downwardly facing curved forming face 60 complementary to the upwardly curved shape 54 of the lower press ring 52.An actuator assembly collectively indicated by 62 in FIGS.","3 and 4 includes lower and upper actuators 62l and 62u that provide vertical movement of the lower press ring 52 and upper forming mold 58 between the solid and phantom line positions of FIG.","3.This vertical movement lifts the preformed glass sheet upwardly from the conveyor 36 and provides press forming of the preformed glass sheet between the lower press ring 52 and the forming face 60 of the upper forming mold 58.After the press forming, the actuators 62l and 62u respectively move the lower press ring 52 downwardly and the upper forming mold 58 upwardly.","The conveyor 36 has a curved shape transverse to the direction of conveyance along which the conveyor assemblies receive the preformed glass sheet, with the curved shape corresponding to its preformed curved shape provided by the preforming end station 16 illustrated in FIG.","2.More specifically, the support structure 38 of the conveyor 36 includes a plurality of elongated supports or rails 64 that extend along the direction of conveyance and have different elevations as shown in FIG.","3 along a direction transverse to the direction of conveyance to provide the support and curved shape of the conveyor assemblies 40r or 40w of the conveyor 36.With reference to FIGS.","4 and 5, another embodiment of the glass sheet forming and annealing system 10′ is similar to the embodiment of FIGS.","1-3 but operates to provide positioning and forming of flat glass sheets without any preforming as with the previously described embodiment.","Thus, like components thereof have the same reference numerals and same structures and much of the prior description is thus applicable except as will be noted.","The furnace 14 may have its conveyor 26 use the same horizontal conveyor rolls 28 as those of the FIG.","1-3 embodiment but without the inclined bending rolls 32 that provide the preforming, and the conveyor 36 thus has its conveyor assemblies 40 receiving a heated flat glass sheet from the furnace.","Thus, the furnace 16 may include the capability of installing or removing the inclined bending rolls depending upon which version is to be utilized.","With reference to FIGS.","1 and 4, the forming and annealing station 12 may have the lower press ring 52 and the forming face 60 of the upper press mold 58 provided with a straight shape along the direction of conveyance C or with a curved shape as shown along that direction in order to provide bending both along and transverse to the direction of conveyance.","The upper press mold 58 has its forming face 60 provided with a vacuum through vacuum holes 61 from a vacuum source 66 so as to support the bent glass sheet after the press bending.","The upper forming mold is heated by electric resistance heaters 67 that maintain the formed glass sheet hot as its annealing begins.","The upper forming mold may also have: different areas supplied with different levels of vacuum by different chambers and/or distribution tubes; and positive pressure air supplied to the forming face to provide release of glass sheets supporting thereby, see U.S. Pat.","Nos.",": 4,222,763 McMaster; 4,877,437 Nitschke.","; 5,376,158 Shetterly et al.","; 5,951,733 Clark et al.","; and 6,227,008 Shetterly et al., the entire disclosures of which are hereby incorporated by reference.","With reference to FIGS.","6 and 7, each embodiment of the forming and annealing system includes an annealing shuttle 68 having an actuator 70 and an annealing ring 72 that is moved by the actuator into the forming station 12 as shown in FIG.","6 and subsequently out of the forming station to the cooling station 18 as shown in FIG.","7.After the press forming of the glass sheet G as illustrated by the phantom line portions of FIGS.","3 and 5 of the two embodiments, the source of vacuum 66 draws a vacuum in the upper forming mold 58 at its forming face 60 and the actuator assembly 62 by its lower and upper actuators 62l and 62u respectively move the lower press ring 52 downwardly and the upper forming mold upwardly to the position shown in FIG.","6.The annealing shuttle 68 by its actuator 70 then moves the annealing ring 72 into the forming station 12 below the upper forming mold 58 whose vacuum is then terminated and positive pressure air is supplied thereto to release the formed glass sheet G from its phantom line indicated position to its solid line indicated position on the annealing ring.","Then, contrary to normal processing of press formed glass sheets which are normally immediately transferred from the forming station to the cooling station, the annealing ring 72 is maintained for a dwell time within the forming station below the heated upper forming mold 58 for at least three seconds and preferably for at least five seconds for slow cooling.","It has been found that this slow cooling as the glass sheet cools toward and to its strain point temperature advantageously controls edge stresses upon final cooling to ambient.","After the slow cooling time, the annealing shuttle 68 as is hereinafter described moves the glass sheet G on the annealing ring 72 from the forming station 12 as shown in FIG.","6 to the cooling station 18 as shown in FIG.","7 for final cooling to ambient, which will normally take place after unloading of the formed glass sheet from the annealing ring onto a cooling conveyor so the annealing ring can move back to the forming station to begin the next cycle.","The length of dwell time the annealing ring 72 must be maintained in the forming station to provide the slow cooling of the formed glass sheet to control the edge stress will vary with different glass thickness, shapes, sizes, curvatures and glass compositions, etc.","As previously stated, this dwell time must be at least three seconds and for most applications at least five seconds with at least six and one half seconds for some applications.","The processing involved provides edge stresses in a 20 mm band at the periphery of the glass with compression in the range of about 8 to 33 megapascals (≈1160 psi to ≈480 psi) and tension no greater than about 7 megapascals (≈1015 psi).","Thus for purposes of this application, “slow” cooling means processing as described which provides edge stresses in a 20 mm peripheral band of the formed glass sheet with the above range of compression and the maximum tension specified.","As illustrated in FIGS.","1, 3 and 4, 5 as well as FIGS.","6 and 7, each embodiment of the system includes a controller 74 that is configured to control operation of the forming station, the conveyor 26, and the annealing ring movement by the annealing shuttle 68 as well as controlling all of the operations described to provide the slow cooling that produces the controlled edge stresses previously described.","In FIG.","8, the illustrated flow chart describes the forming and annealing operation.","More specifically, the glass sheet is initially heated in the furnace as shown at 76.Thereafter the glass sheet is preformed as described in connection with the embodiment of FIGS.","1-3 and illustrated in step 78; however, this preforming step will of course be eliminated with the embodiment of FIGS.","4 and 5 as previously described.","The next step 80 moves the glass sheet to the forming station followed by the press forming step 82.Thereafter, the formed glass sheet is supported by vacuum on the upper mold as shown by step 84, and the annealing ring is then moved as shown by step 86 to below the upper mold and the glass sheet is released onto the annealing ring.","After the annealing ring receives the formed glass sheet, it is maintained for the dwell time during step 88 below the upper mold for slow cooling toward the strain point temperature as previously described contrary to normal practice where the glass sheet is immediately moved to the cooling station for the annealing.","Rather, the movement of the annealing ring from the forming station after the dwell time as shown by step 90 enables the formed glass sheet to have controlled edge stresses after cooling to ambient temperature as described above.","With reference to FIG.","9, the lower forming mold 52 as previously described is embodied by a press ring that has four sides, specifically downstream and upstream sides 92 and 94 and a pair of lateral sides 96.At each of these press ring sides, the press ring has a T-shaped cross section as shown in FIG.","10 including a vertical stem 98 and an upper cross bar 100 supported on the vertical stem and having an upwardly facing forming surface 102.Each side of the press ring has a pair of electrical heating elements 104 at lower locations below its cross bar 100 where it is supported on the vertical stem 98 as well as having a thermocouple 106 adjacent one of these heating elements.","A shaft 108 extends through a hole in the vertical stem and has ends that receive washers 110 secured by clips 112 to position the heating elements 104.The upwardly facing forming surface 102 has three electrical heating elements 114, 116 and 118 respectively received within grooves in the forming surface 102 along its entire length and is covered by stainless steel felt 102a covered by a thin stainless steel layer 102b that is secured by tack welds 103c to the sides of the upper cross bar 100.The two heating elements 114 and 116 are located below the glass sheet to heat the glass sheet by conduction and radiation and the one heating element 118 is located adjacent the glass sheet edge 120 to provide radiant heating of the glass during the press forming.","These heating elements 114, 116 and 118 thus limit heat loss from the glass sheet and thereby control edge stresses upon final cooling to ambient temperature.","More specifically, the increased compression in the peripheral 20 mm.","band extending inwardly from the edge 120 must be equal to adjacent tension.","With the annealing herein disclosed, that tension is distributed more away from the edge 120 than with conventional forming and annealing.","Thus there is less tension immediately adjacent the edge 120.The controller 74 as shown in FIG.","9 has control wire bundles 122 that extend from the controller 74 to the lower press ring 52 at diagonally opposite corners as shown in FIG.","9 to provide the control of the heating elements 104, 114, 116 and 118 as well as the thermocouple 106.Thus, each bundle controls those components at two adjacent sides, either the downstream or upstream side 92 or 94 and the adjacent lateral side 96.As also shown in FIG.","9, the lower press ring 52 has insulation 124 provided within its interior at each of its downstream and upstream sides 92 and 94 and at each of its two lateral sides 96 as well as having insulation 126 at the exterior of each of these sides.","This insulation also maintains the glass sheet edge 120 and the adjacent glass sheet edge portion heated during the forming so as to aid in the slow cooling.","With reference to FIGS.","11 and 12, the annealing ring 72 like the lower press ring has four sides including a downstream side 128, an upstream side 130 and two lateral sides 132.Upwardly and downwardly extending downstream and upstream baffles 134 and 136 limit cooling from air flow across the formed glass sheet during its movement from the forming station to also prevent heat loss and thereby provide slower cooling to further control the final edge stresses.","Furthermore, the annealing ring also has insulation 138 within its interior at each of its downstream and upstream sides 128 and 130 and at each of its two lateral sides 132 as well as having insulation 140 at its exterior along each of these sides to limit heat flow from the glass sheet.","The insulation 124 and 126 of the lower press ring 52 and the insulation 138 and 140 of the annealing ring 72 as well as insulation below each of these rings may be supported in the manner disclosed by Patent Application Publication US 2013/0186138, the entire disclosure of which is hereby incorporated by reference.","As shown in FIG.","13, the annealing ring 72 has each of its sides 128, 130 and 132 mounted on a mold support 142 of the shuttle 68 by a plurality of threaded adjusters 144 that control its elevation as required.","A pair of electrical resistance heating elements 146 provide heaters that extend along each of the sides and are supported by a clip 148 and a nut 150 threaded onto a stud 152 that extends downwardly from the ring 72.Electrical control wire bundles 154 extend from the controller 74 to diagonally opposite corners of the annealing ring as shown in FIG.","11 to the heating elements and to unshown thermocouples to power and control the heating.","While exemplary embodiments are described above, it is not intended that these embodiments describe all possible forms of the invention.","Rather, the words used in the specification are words of description rather than limitation, and it is understood that various changes may be made without departing from the spirit and scope of the invention.","Additionally, the features of various implementing embodiments may be combined to form further embodiments of the invention."]],"string":"[\n [\n \"GLASS SHEET FORMING AND ANNEALING SYSTEM PROVIDING EDGE STRESS CONTROL\",\n \"A glass sheet forming and annealing system disclosed provides control of edge stresses by maintaining a press formed glass sheet on an annealing ring (72) below a heated upper forming mold (58) within a forming station (12) for slow cooling toward the glass strain point temperature.\"\n ],\n [\n \"1.A system for glass sheet forming and annealing comprising: a furnace for heating a glass sheet to its forming temperature; a forming station located adjacent the furnace; a conveyor for conveying the heated glass sheet from the furnace to the forming station; the forming station having an upper forming mold which is heated and has a downwardly facing forming face, the forming station also having a lower forming mold that is movable upwardly to lift the heated glass sheet from the conveyor to the upper forming mold for pressing that provides the glass sheet with a formed shape, and a source of vacuum for drawing a vacuum at the upper forming mold to maintain the formed glass sheet on the upper forming mold as the lower mold is moved downwardly after the press forming; an annealing ring that is movable under the heated upper forming mold and the formed glass sheet supported thereon to receive the formed glass sheet upon termination of the vacuum drawn at the upper forming mold; and a controller that controls operation of the forming station, the conveyor, and the annealing ring, and after the formed glass sheet is received by the annealing ring the controller is configured to maintain the annealing ring and the formed glass sheet thereon in the forming station below the heated upper forming mold for at least three seconds prior to movement from the forming station for slow cooling of the formed glass sheet toward the strain point temperature to control edge stresses upon final cooling to ambient temperature.\",\n \"2.A system for glass sheet forming and annealing as in claim 1 wherein the furnace includes a preforming end section having inclined bending rolls that preform the heated glass sheet prior to movement to the forming station for the press forming.\",\n \"3.A method for glass sheet forming and annealing as in claim 1 wherein the system includes a roll conveyor having a flat plane of conveyance for conveying flat heated glass sheets to the forming station for the press forming.\",\n \"4.A system for glass sheet forming and annealing as in claim 1 wherein the lower forming mold has four sides defining a ring shape and each side having a T-shaped cross section including a vertical stem and a crossbar supported on the vertical stem and having an upwardly facing forming surface, each side of the lower forming mold having a pair of electrical heating elements at lower locations below its crossbar where it is supported on its vertical stem, and the forming face of the crossbar of each side having three grooves and three electrical heating elements respectively received within the three grooves to limit heat loss from the glass sheet to control edge stresses upon final cooling to ambient temperature.\",\n \"5.A system for glass sheet forming and annealing as in claim 4 wherein the lower forming mold has insulation within the interior and around the exterior of its ring shape.\",\n \"6.A system for glass sheet forming and annealing as in claim 1 wherein the annealing ring includes vertically extending baffles at upstream and downstream locations relative to the direction of movement of the annealing ring from the forming station to limit cooling from air flow across the formed glass sheet during that movement.\",\n \"7.A system for glass sheet forming and annealing as in claim 6 wherein the vertically extending baffles extend both upwardly and downwardly from the annealing ring.\",\n \"8.A system for glass sheet forming and annealing as in claim 1 wherein the annealing ring further includes heaters and also includes insulation within its interior and around its exterior to limit heat flow from the formed glass sheet to slow its cooling.\",\n \"9.A system for glass sheet forming and annealing as in claim 1 wherein the controller maintains the annealing ring and the formed glass sheet thereon in the forming station below the heated upper forming mold for at least five seconds, and for some glass sheets at least 6.5 seconds, prior to movement from the forming station for the slow cooling of the formed glass sheet toward the strain point temperature to control edge stresses upon final cooling to ambient temperature.\",\n \"10.A system for glass sheet forming and annealing comprising: a furnace for heating a glass sheet to its forming temperature; the furnace including a preforming end section having inclined bending rolls for preforming the heated glass sheet with an upwardly concave shape; a forming station located adjacent the furnace; a conveyor for conveying the preformed glass sheet from the furnace to the forming station; the forming station having an upper forming mold which is heated and has a downwardly facing forming face; the forming station also having a lower forming mold that is movable upwardly to lift the preformed glass sheet from the conveyor to the upper forming mold for pressing that provides the glass sheet with a formed shape, the lower forming mold having four sides defining a ring shape and each side having a T-shaped cross section including a vertical stem and a crossbar supported on the vertical stem and having an upwardly facing forming surface, each side of the lower forming mold having a pair of electrical heating elements at lower locations below its crossbar where it is supported on its vertical stem, the forming face of the crossbar of each side having three grooves and three electrical heating elements respectively received within the three grooves to limit heat loss from the glass sheet, and the ring shape of the forming mold having insulation within its interior and around its exterior to also limit heat loss from the glass sheet; a source of vacuum for drawing a vacuum at the upper forming mold to maintain the formed glass sheet on the upper forming mold as the lower mold is moved downwardly after the press forming; an annealing ring that is movable under the heated upper forming mold and the formed glass sheet supported thereon to receive the formed glass sheet upon termination of the vacuum drawn at the upper forming mold, the annealing ring including heaters and also including upwardly and downwardly extending baffles at upstream and downstream locations relative to the direction of subsequent movement of the annealing ring from the forming station to limit cooling from air flow across the formed glass sheet during that movement, and insulation within the annealing ring and around its exterior to limit heat flow from the formed glass sheet to slow its cooling; and a controller that controls operation of the forming station, the conveyor, and the annealing ring, and that after the formed glass sheet is received by the annealing ring the controller is configured to maintain the annealing ring and the formed glass sheet thereon in the forming station below the heated upper forming mold for at least five seconds, and for some glass sheets at least 6.5 seconds, prior to movement from the forming station so as to provide the slow cooling of the formed glass sheet to the strain point temperature and thereby control edge stresses upon final cooling to ambient temperature.\"\n ],\n [\n \" BACKGROUND When glass sheets are heated for forming and annealing, the glass sheet peripheral edge portions have oppositely facing surfaces and an edge surface that affect cooling and resultant tensile and compressive stresses after the annealing is completed.\",\n \"To meet certain manufacturing specifications for formed glass sheets that are annealed, these tensile and compressive stresses must be in a controlled range which can be difficult to achieve because of increased heating and cooling that takes place at the edge portions of the glass sheet as opposed to the central regions where there are effectively only two oppositely facing surfaces from which the glass is heated and cooled.\",\n \"See U.S. Pat.\",\n \"Nos.\",\n \"5,385,786 Shetterly et al.\",\n \"; 5,536,581 Shetterly et al.\",\n \"; 5,679,124 Schnabel, Jr. et al.\",\n \"; 5,865,866 Schnabel, Jr. et al.\",\n \"; 6,015,619 Schnabel, Jr. et al.\",\n \"; 6,543,255 Bennett et al.\",\n \"; and 6,578,383 Bennett et al., the entire disclosures of which are hereby incorporated by reference.\"\n ],\n [\n \" SUMMARY An object of the present invention is to provide an improved system for glass sheet forming and annealing to control edge stresses.\",\n \"In carrying out the above object, the system for glass sheet forming and annealing according to the invention includes a furnace for heating a glass sheet to its forming temperature, a forming station located adjacent the furnace, and a conveyor for conveying the heated glass sheet from the furnace to the forming station.\",\n \"The forming station has an upper forming mold which is heated and has a downwardly facing forming face.\",\n \"The forming station also has a lower forming mold that is movable upwardly to lift the heated glass sheet from the conveyor to the upper forming mold for pressing that provides the glass sheet with a formed shape, and a source of vacuum for drawing a vacuum at the upper forming mold to maintain the formed glass sheet on the upper forming mold as the lower mold is moved downwardly after the press forming.\",\n \"An annealing ring of the system is movable under the heated upper forming mold and the formed glass sheet supported thereon to receive the formed glass sheet upon termination of the vacuum drawn at the upper forming mold.\",\n \"A controller of the system controls operation of the forming station, the conveyor, and the annealing ring, and after the formed glass sheet is received by the annealing ring the controller is configured to maintain the annealing ring and the formed glass sheet thereon in the forming station below the heated upper forming mold for at least three seconds prior to movement from the forming station so as to provide slow cooling of the formed glass sheet toward the strain point temperature and thereby control edge stresses upon final cooling to ambient temperature.\",\n \"The system is disclosed in one embodiment as having its furnace including a preforming end section having inclined bending rolls that preform the heated glass sheet prior to movement of the forming station for the press forming.\",\n \"In another embodiment, the system is disclosed as including a roll conveyor having a flat plane of conveyance for conveying flat heated glass sheets to the forming station for the press forming.\",\n \"As disclosed, the lower forming mold has four sides defining a ring shape and each side has a T-shaped cross section including a vertical stem and a crossbar supported on the vertical stem and having an upwardly facing forming surface.\",\n \"Each side of the lower forming mold has a pair of electrical heating elements at lower locations below its crossbar where it is supported on its vertical stem, and the forming face of the crossbar of each side has three grooves and three electrical heating elements respectively received within the three grooves to limit heat loss from the glass sheet to control edge stresses upon final cooling to ambient temperature.\",\n \"As disclosed, the lower forming mold has insulation within the interior and around the exterior of its ring shape.\",\n \"Also, the disclosed annealing ring includes vertically extending baffles at upstream and downstream locations relative to the direction of movement of the annealing ring from the forming station to limit cooling from air flow across the formed glass sheet during that movement.\",\n \"The vertically extending baffles as disclosed extend both upwardly and downwardly from the annealing ring.\",\n \"The annealing ring includes heaters and also includes insulation within and around its exterior to limit heat flow from the formed glass sheet to provide its slow cooling.\",\n \"The controller of the system maintains the annealing ring and the formed glass sheet thereon in the forming station below the heated upper forming mold for at least five seconds, and for some glass sheets at least 6.5 seconds, prior to movement from the forming station for the slow cooling of the formed glass sheet toward the strain point temperature to control edge stresses upon final cooling to ambient temperature.\"\n ],\n [\n \"CROSS-REFERENCE TO RELATED APPLICATIONS This application is a divisional of U.S. patent application Ser.\",\n \"No.\",\n \"14/551,226 filed on Nov. 24, 2014 by Terry A. Bennett under the title GLASS SHEET FORMING AND ANNEALING PROVIDING EDGE STRESS CONTROL, the disclosure of which is hereby incorporated in its entirety by reference herein.\",\n \"TECHNICAL FIELD This application discloses a glass sheet forming and annealing system that provides edge stress control.\",\n \"BACKGROUND When glass sheets are heated for forming and annealing, the glass sheet peripheral edge portions have oppositely facing surfaces and an edge surface that affect cooling and resultant tensile and compressive stresses after the annealing is completed.\",\n \"To meet certain manufacturing specifications for formed glass sheets that are annealed, these tensile and compressive stresses must be in a controlled range which can be difficult to achieve because of increased heating and cooling that takes place at the edge portions of the glass sheet as opposed to the central regions where there are effectively only two oppositely facing surfaces from which the glass is heated and cooled.\",\n \"See U.S. Pat.\",\n \"Nos.\",\n \"5,385,786 Shetterly et al.\",\n \"; 5,536,581 Shetterly et al.\",\n \"; 5,679,124 Schnabel, Jr. et al.\",\n \"; 5,865,866 Schnabel, Jr. et al.\",\n \"; 6,015,619 Schnabel, Jr. et al.\",\n \"; 6,543,255 Bennett et al.\",\n \"; and 6,578,383 Bennett et al., the entire disclosures of which are hereby incorporated by reference.\",\n \"SUMMARY An object of the present invention is to provide an improved system for glass sheet forming and annealing to control edge stresses.\",\n \"In carrying out the above object, the system for glass sheet forming and annealing according to the invention includes a furnace for heating a glass sheet to its forming temperature, a forming station located adjacent the furnace, and a conveyor for conveying the heated glass sheet from the furnace to the forming station.\",\n \"The forming station has an upper forming mold which is heated and has a downwardly facing forming face.\",\n \"The forming station also has a lower forming mold that is movable upwardly to lift the heated glass sheet from the conveyor to the upper forming mold for pressing that provides the glass sheet with a formed shape, and a source of vacuum for drawing a vacuum at the upper forming mold to maintain the formed glass sheet on the upper forming mold as the lower mold is moved downwardly after the press forming.\",\n \"An annealing ring of the system is movable under the heated upper forming mold and the formed glass sheet supported thereon to receive the formed glass sheet upon termination of the vacuum drawn at the upper forming mold.\",\n \"A controller of the system controls operation of the forming station, the conveyor, and the annealing ring, and after the formed glass sheet is received by the annealing ring the controller is configured to maintain the annealing ring and the formed glass sheet thereon in the forming station below the heated upper forming mold for at least three seconds prior to movement from the forming station so as to provide slow cooling of the formed glass sheet toward the strain point temperature and thereby control edge stresses upon final cooling to ambient temperature.\",\n \"The system is disclosed in one embodiment as having its furnace including a preforming end section having inclined bending rolls that preform the heated glass sheet prior to movement of the forming station for the press forming.\",\n \"In another embodiment, the system is disclosed as including a roll conveyor having a flat plane of conveyance for conveying flat heated glass sheets to the forming station for the press forming.\",\n \"As disclosed, the lower forming mold has four sides defining a ring shape and each side has a T-shaped cross section including a vertical stem and a crossbar supported on the vertical stem and having an upwardly facing forming surface.\",\n \"Each side of the lower forming mold has a pair of electrical heating elements at lower locations below its crossbar where it is supported on its vertical stem, and the forming face of the crossbar of each side has three grooves and three electrical heating elements respectively received within the three grooves to limit heat loss from the glass sheet to control edge stresses upon final cooling to ambient temperature.\",\n \"As disclosed, the lower forming mold has insulation within the interior and around the exterior of its ring shape.\",\n \"Also, the disclosed annealing ring includes vertically extending baffles at upstream and downstream locations relative to the direction of movement of the annealing ring from the forming station to limit cooling from air flow across the formed glass sheet during that movement.\",\n \"The vertically extending baffles as disclosed extend both upwardly and downwardly from the annealing ring.\",\n \"The annealing ring includes heaters and also includes insulation within and around its exterior to limit heat flow from the formed glass sheet to provide its slow cooling.\",\n \"The controller of the system maintains the annealing ring and the formed glass sheet thereon in the forming station below the heated upper forming mold for at least five seconds, and for some glass sheets at least 6.5 seconds, prior to movement from the forming station for the slow cooling of the formed glass sheet toward the strain point temperature to control edge stresses upon final cooling to ambient temperature.\",\n \"BRIEF DESCRIPTION OF THE DRAWINGS FIG.\",\n \"1 is a schematic side elevational view of one embodiment of a system for glass sheet forming and annealing according to the invention.\",\n \"FIG.\",\n \"2 is a schematic cross sectional view through the system taken along the direction of line 2-2 in FIG.\",\n \"1 through a furnace preforming end section having horizontal and inclined rolls at which heated glass sheets are conveyed for initial roll forming prior to exiting the furnace in preparation for further forming.\",\n \"FIG.\",\n \"3 is a schematic cross sectional view taken through the system along line 3-3 in FIG.\",\n \"1 at a forming station thereof to illustrate the construction of a lower press ring assembly having a press ring and also illustrating the construction of an upper forming mold, which press ring and upper forming mold are movable as disclosed by the solid and phantom line indicated positions to press form the initially roll formed glass sheet.\",\n \"FIG.\",\n \"4 is a schematic side elevational view similar to FIG.\",\n \"1 of another embodiment of the glass sheet forming and annealing system according to the invention whose forming station forms and anneals a heated flat glass sheet received from the furnace.\",\n \"FIG.\",\n \"5 is a cross sectional view taken along the direction of line 5-5 in FIG.\",\n \"4 to further illustrate the flat shape of the glass sheet prior to its press forming and annealing as shown by phantom line representation.\",\n \"FIG.\",\n \"6 is a schematic side elevational view similar to FIGS.\",\n \"1 and 4 and illustrating the manner in which the formed glass sheet is released from the upper forming mold onto the annealing ring and then maintained within the forming station for a dwell time that slows cooling thereof toward the strain point temperature to provide control of the final edge stresses upon cooling to ambient temperature.\",\n \"FIG.\",\n \"7 is a view similar to FIG.\",\n \"6 at a later stage after the formed glass sheet has been moved from the forming station to a cooling station for further cooling to the ambient temperature.\",\n \"FIG.\",\n \"8 is a flow chart that illustrates the steps involved in the forming and annealing with the embodiment of FIG.\",\n \"1.FIG.\",\n \"9 is a top plan view illustrating the lower forming mold which has a ring shape as disclosed with insulation both within its interior and around its exterior.\",\n \"FIG.\",\n \"10 is a cross sectional view taken through the lower forming mold along the direction of line 10-10 in FIG.\",\n \"9 to illustrate the construction of heaters that maintain the glass edge portion heated during the press forming.\",\n \"FIG.\",\n \"11 is a top plan view of the annealing ring taken along the direction of line 11-11 in FIG.\",\n \"6 to illustrate its construction including insulation within its interior and around its exterior as well as upstream and downstream baffles that after the dwell time limit cooling during movement of the glass sheet from the forming station.\",\n \"FIG.\",\n \"12 is a side elevational view taken along the direction of line 12-12 in FIG.\",\n \"11 to further illustrate the upstream and downstream baffles.\",\n \"FIG.\",\n \"13 is a sectional view taken along the direction of arrows 13-13 in FIG.\",\n \"11 to illustrate the construction of the annealing ring along each of its four sides.\",\n \"DETAILED DESCRIPTION As required, detailed embodiments of the present invention are disclosed herein; however, it is to be understood that the disclosed embodiments are merely exemplary of the invention that may be embodied in various and alternative forms.\",\n \"The figures are not necessarily to scale; some features may be exaggerated or minimized to show details of particular components.\",\n \"Therefore, specific structural and functional details disclosed herein are not to be interpreted as limiting, but merely as a representative basis for teaching one skilled in the art to variously employ the present invention.\",\n \"With reference to FIG.\",\n \"1 of the drawings, one embodiment of the system for forming and annealing glass sheets according to the invention is generally indicated by 10.The construction and method of operation of the system will be described in an integrated manner to facilitate an understanding of different aspects of the invention.\",\n \"The system 10 includes a forming and annealing station 12 and also includes a furnace 14 that has a preforming end section 16 just upstream along a direction of conveyance C from the forming and annealing station 12.Downstream from the forming and annealing station 12 along the direction of conveyance C, the system 10 is illustrated as including a final cooling station 18 to which the formed glass sheet after initial cooling in the forming and annealing station is further cooled to ambient temperature.\",\n \"As illustrated by continuing reference to FIG.\",\n \"1, the furnace 14 has entry and exit ends 20 and 22 and includes a heating chamber 24 (FIG.\",\n \"2) having a conveyor 26 for conveying glass sheets along the direction of conveyance through the furnace from the entry end to the exit end.\",\n \"The conveyor 26 on which the glass sheets are heated can be either a conventional gas hearth or a roll conveyor on which the glass sheets are conveyed during heating from ambient temperature to a sufficiently high temperature to permit bending.\",\n \"The furnace exit end 22 includes the preforming end section 16 which is illustrated in FIG.\",\n \"2 as having horizontally extending conveyor rolls 28 that are rotatively driven and spaced horizontally within the heating chamber along the direction of conveyance extending laterally with respect thereto to support and convey the heated glass sheets.\",\n \"The preforming end section 16 also includes a pair of sets 30 of bending rolls 32, with the bending roll sets 30 spaced laterally with respect to each other within the heating chamber 24 along the direction of conveyance.\",\n \"Each set of bending rolls 30 is supported and rotatively driven by a drive mechanism 34 with the bending rolls at progressively increasing inclinations along the direction of conveyance as illustrated by reference numerals 32a, 32b, 32c and 32d in FIG.\",\n \"2.The conveyance of each heated glass sheet G along the direction of conveyance in cooperation with the bending rolls 32 provides bending or preforming of the heated glass sheet with an upwardly concave shape as illustrated in FIG.\",\n \"2 along a direction transverse to the direction of conveyance.\",\n \"With combined reference to FIGS.\",\n \"1 and 3-5, the forming and annealing station 12 as previously mentioned is located externally of the furnace 14 downstream from its exit end 22 to receive the preformed glass sheets from the preforming end section 16.More specifically, the forming and annealing station 12 includes a conveyor 36 for receiving a heated glass sheet to be press bent.\",\n \"The conveyor 36 includes a lower support structure 38 and a bed of a plurality of conveyor assemblies 40 specifically indicated as 40w and 40r on the support structure.\",\n \"Each conveyor assembly 40, includes a horizontally extending elongated roller 41 located laterally at a central location of the conveyor.\",\n \"Each conveyor assembly 40w has an upper wheel 44 for supporting and conveying upwardly formed portions of the preformed glass sheet within the press bending station.\",\n \"A drive mechanism provides rotational driving of the roller 41 and rotational driving of the wheel 44 of each wheel assembly 40, specifically 40r or 40w, upon connection thereof to the lower support structure 38.For a more detailed description of the conveyor and the drive mechanism, refer to U.S. Pat.\",\n \"No.\",\n \"6,543,255 and United States patent application Publication No.\",\n \"2011/0247367, the entire disclosures of both of which are hereby incorporated by reference.\",\n \"As illustrated in FIG.\",\n \"3, a lower mount of the forming and annealing station 12 is schematically illustrated at 50 and supports a lower forming mold that is disclosed as a lower press ring 52 having a concave curved shape 54 facing upwardly and being received within the conveyor 36 below the upper extremities of the horizontal rollers 41 and the wheels 44 of the conveyor assemblies 40r or 40w in a ring shape thereof where no conveyor assemblies are located.\",\n \"As further illustrated in FIG.\",\n \"3, an upper mount 56 of the press station 12 supports an upper forming mold 58 having a downwardly facing curved forming face 60 complementary to the upwardly curved shape 54 of the lower press ring 52.An actuator assembly collectively indicated by 62 in FIGS.\",\n \"3 and 4 includes lower and upper actuators 62l and 62u that provide vertical movement of the lower press ring 52 and upper forming mold 58 between the solid and phantom line positions of FIG.\",\n \"3.This vertical movement lifts the preformed glass sheet upwardly from the conveyor 36 and provides press forming of the preformed glass sheet between the lower press ring 52 and the forming face 60 of the upper forming mold 58.After the press forming, the actuators 62l and 62u respectively move the lower press ring 52 downwardly and the upper forming mold 58 upwardly.\",\n \"The conveyor 36 has a curved shape transverse to the direction of conveyance along which the conveyor assemblies receive the preformed glass sheet, with the curved shape corresponding to its preformed curved shape provided by the preforming end station 16 illustrated in FIG.\",\n \"2.More specifically, the support structure 38 of the conveyor 36 includes a plurality of elongated supports or rails 64 that extend along the direction of conveyance and have different elevations as shown in FIG.\",\n \"3 along a direction transverse to the direction of conveyance to provide the support and curved shape of the conveyor assemblies 40r or 40w of the conveyor 36.With reference to FIGS.\",\n \"4 and 5, another embodiment of the glass sheet forming and annealing system 10′ is similar to the embodiment of FIGS.\",\n \"1-3 but operates to provide positioning and forming of flat glass sheets without any preforming as with the previously described embodiment.\",\n \"Thus, like components thereof have the same reference numerals and same structures and much of the prior description is thus applicable except as will be noted.\",\n \"The furnace 14 may have its conveyor 26 use the same horizontal conveyor rolls 28 as those of the FIG.\",\n \"1-3 embodiment but without the inclined bending rolls 32 that provide the preforming, and the conveyor 36 thus has its conveyor assemblies 40 receiving a heated flat glass sheet from the furnace.\",\n \"Thus, the furnace 16 may include the capability of installing or removing the inclined bending rolls depending upon which version is to be utilized.\",\n \"With reference to FIGS.\",\n \"1 and 4, the forming and annealing station 12 may have the lower press ring 52 and the forming face 60 of the upper press mold 58 provided with a straight shape along the direction of conveyance C or with a curved shape as shown along that direction in order to provide bending both along and transverse to the direction of conveyance.\",\n \"The upper press mold 58 has its forming face 60 provided with a vacuum through vacuum holes 61 from a vacuum source 66 so as to support the bent glass sheet after the press bending.\",\n \"The upper forming mold is heated by electric resistance heaters 67 that maintain the formed glass sheet hot as its annealing begins.\",\n \"The upper forming mold may also have: different areas supplied with different levels of vacuum by different chambers and/or distribution tubes; and positive pressure air supplied to the forming face to provide release of glass sheets supporting thereby, see U.S. Pat.\",\n \"Nos.\",\n \": 4,222,763 McMaster; 4,877,437 Nitschke.\",\n \"; 5,376,158 Shetterly et al.\",\n \"; 5,951,733 Clark et al.\",\n \"; and 6,227,008 Shetterly et al., the entire disclosures of which are hereby incorporated by reference.\",\n \"With reference to FIGS.\",\n \"6 and 7, each embodiment of the forming and annealing system includes an annealing shuttle 68 having an actuator 70 and an annealing ring 72 that is moved by the actuator into the forming station 12 as shown in FIG.\",\n \"6 and subsequently out of the forming station to the cooling station 18 as shown in FIG.\",\n \"7.After the press forming of the glass sheet G as illustrated by the phantom line portions of FIGS.\",\n \"3 and 5 of the two embodiments, the source of vacuum 66 draws a vacuum in the upper forming mold 58 at its forming face 60 and the actuator assembly 62 by its lower and upper actuators 62l and 62u respectively move the lower press ring 52 downwardly and the upper forming mold upwardly to the position shown in FIG.\",\n \"6.The annealing shuttle 68 by its actuator 70 then moves the annealing ring 72 into the forming station 12 below the upper forming mold 58 whose vacuum is then terminated and positive pressure air is supplied thereto to release the formed glass sheet G from its phantom line indicated position to its solid line indicated position on the annealing ring.\",\n \"Then, contrary to normal processing of press formed glass sheets which are normally immediately transferred from the forming station to the cooling station, the annealing ring 72 is maintained for a dwell time within the forming station below the heated upper forming mold 58 for at least three seconds and preferably for at least five seconds for slow cooling.\",\n \"It has been found that this slow cooling as the glass sheet cools toward and to its strain point temperature advantageously controls edge stresses upon final cooling to ambient.\",\n \"After the slow cooling time, the annealing shuttle 68 as is hereinafter described moves the glass sheet G on the annealing ring 72 from the forming station 12 as shown in FIG.\",\n \"6 to the cooling station 18 as shown in FIG.\",\n \"7 for final cooling to ambient, which will normally take place after unloading of the formed glass sheet from the annealing ring onto a cooling conveyor so the annealing ring can move back to the forming station to begin the next cycle.\",\n \"The length of dwell time the annealing ring 72 must be maintained in the forming station to provide the slow cooling of the formed glass sheet to control the edge stress will vary with different glass thickness, shapes, sizes, curvatures and glass compositions, etc.\",\n \"As previously stated, this dwell time must be at least three seconds and for most applications at least five seconds with at least six and one half seconds for some applications.\",\n \"The processing involved provides edge stresses in a 20 mm band at the periphery of the glass with compression in the range of about 8 to 33 megapascals (≈1160 psi to ≈480 psi) and tension no greater than about 7 megapascals (≈1015 psi).\",\n \"Thus for purposes of this application, “slow” cooling means processing as described which provides edge stresses in a 20 mm peripheral band of the formed glass sheet with the above range of compression and the maximum tension specified.\",\n \"As illustrated in FIGS.\",\n \"1, 3 and 4, 5 as well as FIGS.\",\n \"6 and 7, each embodiment of the system includes a controller 74 that is configured to control operation of the forming station, the conveyor 26, and the annealing ring movement by the annealing shuttle 68 as well as controlling all of the operations described to provide the slow cooling that produces the controlled edge stresses previously described.\",\n \"In FIG.\",\n \"8, the illustrated flow chart describes the forming and annealing operation.\",\n \"More specifically, the glass sheet is initially heated in the furnace as shown at 76.Thereafter the glass sheet is preformed as described in connection with the embodiment of FIGS.\",\n \"1-3 and illustrated in step 78; however, this preforming step will of course be eliminated with the embodiment of FIGS.\",\n \"4 and 5 as previously described.\",\n \"The next step 80 moves the glass sheet to the forming station followed by the press forming step 82.Thereafter, the formed glass sheet is supported by vacuum on the upper mold as shown by step 84, and the annealing ring is then moved as shown by step 86 to below the upper mold and the glass sheet is released onto the annealing ring.\",\n \"After the annealing ring receives the formed glass sheet, it is maintained for the dwell time during step 88 below the upper mold for slow cooling toward the strain point temperature as previously described contrary to normal practice where the glass sheet is immediately moved to the cooling station for the annealing.\",\n \"Rather, the movement of the annealing ring from the forming station after the dwell time as shown by step 90 enables the formed glass sheet to have controlled edge stresses after cooling to ambient temperature as described above.\",\n \"With reference to FIG.\",\n \"9, the lower forming mold 52 as previously described is embodied by a press ring that has four sides, specifically downstream and upstream sides 92 and 94 and a pair of lateral sides 96.At each of these press ring sides, the press ring has a T-shaped cross section as shown in FIG.\",\n \"10 including a vertical stem 98 and an upper cross bar 100 supported on the vertical stem and having an upwardly facing forming surface 102.Each side of the press ring has a pair of electrical heating elements 104 at lower locations below its cross bar 100 where it is supported on the vertical stem 98 as well as having a thermocouple 106 adjacent one of these heating elements.\",\n \"A shaft 108 extends through a hole in the vertical stem and has ends that receive washers 110 secured by clips 112 to position the heating elements 104.The upwardly facing forming surface 102 has three electrical heating elements 114, 116 and 118 respectively received within grooves in the forming surface 102 along its entire length and is covered by stainless steel felt 102a covered by a thin stainless steel layer 102b that is secured by tack welds 103c to the sides of the upper cross bar 100.The two heating elements 114 and 116 are located below the glass sheet to heat the glass sheet by conduction and radiation and the one heating element 118 is located adjacent the glass sheet edge 120 to provide radiant heating of the glass during the press forming.\",\n \"These heating elements 114, 116 and 118 thus limit heat loss from the glass sheet and thereby control edge stresses upon final cooling to ambient temperature.\",\n \"More specifically, the increased compression in the peripheral 20 mm.\",\n \"band extending inwardly from the edge 120 must be equal to adjacent tension.\",\n \"With the annealing herein disclosed, that tension is distributed more away from the edge 120 than with conventional forming and annealing.\",\n \"Thus there is less tension immediately adjacent the edge 120.The controller 74 as shown in FIG.\",\n \"9 has control wire bundles 122 that extend from the controller 74 to the lower press ring 52 at diagonally opposite corners as shown in FIG.\",\n \"9 to provide the control of the heating elements 104, 114, 116 and 118 as well as the thermocouple 106.Thus, each bundle controls those components at two adjacent sides, either the downstream or upstream side 92 or 94 and the adjacent lateral side 96.As also shown in FIG.\",\n \"9, the lower press ring 52 has insulation 124 provided within its interior at each of its downstream and upstream sides 92 and 94 and at each of its two lateral sides 96 as well as having insulation 126 at the exterior of each of these sides.\",\n \"This insulation also maintains the glass sheet edge 120 and the adjacent glass sheet edge portion heated during the forming so as to aid in the slow cooling.\",\n \"With reference to FIGS.\",\n \"11 and 12, the annealing ring 72 like the lower press ring has four sides including a downstream side 128, an upstream side 130 and two lateral sides 132.Upwardly and downwardly extending downstream and upstream baffles 134 and 136 limit cooling from air flow across the formed glass sheet during its movement from the forming station to also prevent heat loss and thereby provide slower cooling to further control the final edge stresses.\",\n \"Furthermore, the annealing ring also has insulation 138 within its interior at each of its downstream and upstream sides 128 and 130 and at each of its two lateral sides 132 as well as having insulation 140 at its exterior along each of these sides to limit heat flow from the glass sheet.\",\n \"The insulation 124 and 126 of the lower press ring 52 and the insulation 138 and 140 of the annealing ring 72 as well as insulation below each of these rings may be supported in the manner disclosed by Patent Application Publication US 2013/0186138, the entire disclosure of which is hereby incorporated by reference.\",\n \"As shown in FIG.\",\n \"13, the annealing ring 72 has each of its sides 128, 130 and 132 mounted on a mold support 142 of the shuttle 68 by a plurality of threaded adjusters 144 that control its elevation as required.\",\n \"A pair of electrical resistance heating elements 146 provide heaters that extend along each of the sides and are supported by a clip 148 and a nut 150 threaded onto a stud 152 that extends downwardly from the ring 72.Electrical control wire bundles 154 extend from the controller 74 to diagonally opposite corners of the annealing ring as shown in FIG.\",\n \"11 to the heating elements and to unshown thermocouples to power and control the heating.\",\n \"While exemplary embodiments are described above, it is not intended that these embodiments describe all possible forms of the invention.\",\n \"Rather, the words used in the specification are words of description rather than limitation, and it is understood that various changes may be made without departing from the spirit and scope of the invention.\",\n \"Additionally, the features of various implementing embodiments may be combined to form further embodiments of the invention.\"\n ]\n]"},"source":{"kind":"string","value":"Patent_15871385"}}},{"rowIdx":4493776,"cells":{"text":{"kind":"list like","value":[["TUNABLE ANTENNA SYSTEMS","An electronic device has wireless communications circuitry including an adjustable antenna system coupled to a radio-frequency transceiver.","The adjustable antenna system may include one or more adjustable electrical components that are controlled by storage and processing circuitry in the electronic device.","The adjustable electrical components may include switches and components that can be adjusted between numerous different states.","The adjustable electrical components may be coupled between antenna system components such as transmission line elements, matching network elements, antenna elements and antenna feeds.","By adjusting the adjustable electrical components, the storage and processing circuitry can tune the adjustable antenna system to ensure that the adjustable antenna system covers communications bands of interest."],["1.An electronic device having a periphery, comprising: radio-frequency transceiver circuitry; an antenna having an antenna feed and ground plane structures; a transmission line path coupled between the radio-frequency transceiver circuitry and the antenna feed; peripheral conductive housing structures that run along the periphery and surround the ground plane structures, wherein the peripheral conductive housing structures include a portion that forms at least part of the antenna; storage and processing circuitry configured to generate a control signal; and an adjustable electrical component coupled to the peripheral conductive housing structures, wherein the adjustable electrical component has a control input that receives the control signal and the adjustable electrical component is configured to adjust a frequency response of the antenna based on the control signal.","2.The electronic device defined in claim 1, wherein the peripheral conductive housing structures include a dielectric-filled gap that divides the peripheral conductive housing structures.","3.The electronic device defined in claim 2, wherein the peripheral conductive housing structures include an additional dielectric-filled gap that divides the peripheral conductive housing structures.","4.The electronic device defined in claim 3, wherein the dielectric-filled gap and the additional dielectric-filled gap are formed at different sides of the electronic device.","5.The electronic device defined in claim 2, wherein the adjustable electrical component comprises first and second terminals coupled to the peripheral conductive housing structures at opposing sides of the dielectric-filled gap.","6.The electronic device defined in claim 1, wherein the adjustable electrical component comprises an adjustable electrical component selected from the group consisting of an adjustable capacitor and an adjustable inductor.","7.The electronic device defined in claim 1, wherein the antenna comprises an inverted-F antenna and the portion of the peripheral conductive housing structures that forms at least part of the antenna forms an antenna resonating element for the inverted-F antenna.","8.The electronic device defined in claim 1, wherein the electronic device has a length, a width that is less than the length, and a height that is less than the width, and the peripheral conductive housing structures extend across the height of the electronic device.","9.The electronic device defined in claim 8, wherein the peripheral conductive housing structures extend across the length and the width of the electronic device.","10.The electronic device defined in claim 1, wherein the antenna feed comprises a signal feed terminal coupled to the portion of the peripheral conductive housing structures and a ground feed terminal coupled to the ground plane structures.","11.An electronic device having a periphery and opposing first and second faces, the electronic device comprising: ground plane structures; peripheral conductive housing structures that run along the periphery of the electronic device and surround the ground plane structures; a dielectric-filled gap in the peripheral conductive housing structures that divides the peripheral conductive housing structures into first and second segments, wherein the second segment is separated from the ground plane structures by a dielectric-filled opening, the dielectric-filled gap having a first end at the dielectric-filled opening and a second end at the first face of the electronic device; and an antenna formed from at least the second segment and the ground plane structures.","12.The electronic device defined in claim 11, wherein the first segment is coupled to the ground plane structures.","13.The electronic device defined in claim 12, wherein the ground plane structures comprise a conductive housing wall on the second face of the electronic device.","14.The electronic device defined in claim 13, further comprising a display on the first face of the electronic device.","15.The electronic device defined in claim 11, further comprising: an additional dielectric-filled gap in the peripheral conductive housing structures that separates the second segment from a third segment of the peripheral conductive housing structures, the additional dielectric-filled gap having a first end at the dielectric-filled opening and a second end at the first face of the electronic device.","16.The electronic device defined in claim 11, wherein the antenna comprises an antenna feed having a first feed terminal coupled to the ground plane structures and a second feed terminal coupled to the second segment.","17.The electronic device defined in claim 11, further comprising: an adjustable electrical component coupled to the second segment; and storage and processing circuitry configured to provide a control signal to a control input of the adjustable electronic component that tunes a frequency response of the antenna.","18.An electronic device having a periphery, a length, a width that is less than the length, and a height that is less than the width, comprising: ground plane structures; peripheral conductive housing structures that surround the ground plane structures, wherein the peripheral conductive housing structures comprise a first sidewall extending across the width of the electronic device, a second sidewall extending from a first end of the first sidewall along the length of the electronic device, and a third sidewall extending from a second end of the first sidewall along the length of the electronic device; a dielectric-filled opening having a first portion extending from the second sidewall to the third sidewall and having a second portion that extends from an end of the first portion and that is interposed between the second sidewall and a portion of the ground plane structures, wherein the portion of the ground plane structures is interposed between the second portion of the dielectric-filled opening and the third sidewall; and an antenna that includes a portion of the peripheral conductive housing structures.","19.The electronic device defined in claim 18, further comprising: an adjustable electronic component that bridges the second portion of the dielectric filled opening and that is configured to tune a frequency response of the antenna.","20.The electronic device defined in claim 18, wherein the peripheral conductive housing structures extend across the height of the electronic device and include a fourth sidewall that extends between the second and third sidewalls, and the ground plane structures include an additional portion that extends from the second sidewall to the third sidewall."],[" BACKGROUND This relates generally to wireless communications circuitry, and more particularly, to electronic devices that have tunable antenna systems.","Electronic devices such as computers and handheld electronic devices are often provided with wireless communications capabilities.","For example, electronic devices may use long-range wireless communications circuitry such as cellular telephone circuitry to communicate using cellular telephone bands.","Electronic devices may use short-range wireless communications links to handle communications with nearby equipment.","For example, electronic devices may communicate using the WiFi® (IEEE 802.11) bands at 2.4 GHz and 5 GHz and the Bluetooth® band at 2.4 GHz.","To satisfy consumer demand for small form factor wireless devices, manufacturers are continually striving to implement wireless communications circuitry such as antenna components using compact structures.","However, it can be difficult to fit conventional antenna structures into small devices.","For example, antennas that are confined to small volumes often exhibit narrower operating bandwidths than antennas that are implemented in larger volumes.","If the bandwidth of an antenna becomes too small, the antenna will not be able to cover all communications bands of interest.","In view of these considerations, it would be desirable to provide improved wireless circuitry for electronic devices."],[" SUMMARY An electronic device may be provided with wireless communications circuitry including an adjustable antenna system coupled to a radio-frequency transceiver.","The adjustable antenna system may include one or more adjustable electrical components that are controlled by storage and processing circuitry in the electronic device.","By adjusting the adjustable electrical components, the storage and processing circuitry can tune the adjustable antenna system to ensure that the adjustable antenna system satisfactorily covers communications bands of interest.","The adjustable electrical components may include switches that can be placed in open or closed positions.","The adjustable electrical components may also include components that can be continuously or semicontinuously adjusted to produce various resistances, capacitances, and inductances.","Antenna system adjustments may be made to transmission line structures, matching networks, antenna resonating elements, antenna grounds, and antenna feeds.","An antenna may have portions that are formed from conductive electronic device housings.","An electronic device may have a rectangular periphery.","A conductive peripheral member such as a display bezel or housing sidewall member may surround the periphery of the housing.","One or more dielectric gaps may be interposed in the conductive peripheral member.","The adjustable electrical components may be used to bridge the gaps.","Control signals may be applied to the adjustable electrical components to adjust the size of the gap and other antenna system parameters and thereby tune the antenna system.","Further features of the invention, its nature and various advantages will be more apparent from the accompanying drawings and the following detailed description of the preferred embodiments."],["This application is a continuation of patent application Ser.","No.","14/737,394, filed Jun.","11, 2015, which is a continuation of patent application Ser.","No.","12/831,180, filed Jul.","6, 2010, now U.S. Pat.","No.","9,070,969, which is hereby incorporated by reference herein in its entirety.","This application claims the benefit of and claims priority to patent application Ser.","No.","14/737,394, filed Jun.","11, 2015 and patent application Ser.","No.","12/831,180, filed Jul.","6, 2010, now U.S. Pat.","No.","9,070,969.BACKGROUND This relates generally to wireless communications circuitry, and more particularly, to electronic devices that have tunable antenna systems.","Electronic devices such as computers and handheld electronic devices are often provided with wireless communications capabilities.","For example, electronic devices may use long-range wireless communications circuitry such as cellular telephone circuitry to communicate using cellular telephone bands.","Electronic devices may use short-range wireless communications links to handle communications with nearby equipment.","For example, electronic devices may communicate using the WiFi® (IEEE 802.11) bands at 2.4 GHz and 5 GHz and the Bluetooth® band at 2.4 GHz.","To satisfy consumer demand for small form factor wireless devices, manufacturers are continually striving to implement wireless communications circuitry such as antenna components using compact structures.","However, it can be difficult to fit conventional antenna structures into small devices.","For example, antennas that are confined to small volumes often exhibit narrower operating bandwidths than antennas that are implemented in larger volumes.","If the bandwidth of an antenna becomes too small, the antenna will not be able to cover all communications bands of interest.","In view of these considerations, it would be desirable to provide improved wireless circuitry for electronic devices.","SUMMARY An electronic device may be provided with wireless communications circuitry including an adjustable antenna system coupled to a radio-frequency transceiver.","The adjustable antenna system may include one or more adjustable electrical components that are controlled by storage and processing circuitry in the electronic device.","By adjusting the adjustable electrical components, the storage and processing circuitry can tune the adjustable antenna system to ensure that the adjustable antenna system satisfactorily covers communications bands of interest.","The adjustable electrical components may include switches that can be placed in open or closed positions.","The adjustable electrical components may also include components that can be continuously or semicontinuously adjusted to produce various resistances, capacitances, and inductances.","Antenna system adjustments may be made to transmission line structures, matching networks, antenna resonating elements, antenna grounds, and antenna feeds.","An antenna may have portions that are formed from conductive electronic device housings.","An electronic device may have a rectangular periphery.","A conductive peripheral member such as a display bezel or housing sidewall member may surround the periphery of the housing.","One or more dielectric gaps may be interposed in the conductive peripheral member.","The adjustable electrical components may be used to bridge the gaps.","Control signals may be applied to the adjustable electrical components to adjust the size of the gap and other antenna system parameters and thereby tune the antenna system.","Further features of the invention, its nature and various advantages will be more apparent from the accompanying drawings and the following detailed description of the preferred embodiments.","BRIEF DESCRIPTION OF THE DRAWINGS FIG.","1 is a perspective view of an illustrative electronic device with wireless communications circuitry in accordance with an embodiment of the present invention.","FIG.","2 is a schematic diagram of an illustrative electronic device with wireless communications circuitry in accordance with an embodiment of the present invention.","FIG.","3 is circuit diagram of illustrative wireless communications circuitry having fixed and adjustable antenna structures in an electronic device in accordance with an embodiment of the present invention.","FIG.","4 is a graph showing how antenna structures can be adjusted during operation to cover communications bands of interest in accordance with an embodiment of the present invention.","FIG.","5 is a graph showing how antenna structures can be adjusted during operation to fine tune antenna response during operation in accordance with an embodiment of the present invention.","FIG.","6 is a diagram of wireless communications circuitry in an electronic device showing how a transceiver circuit may feed an antenna using a transmission line and a matching network in accordance with an embodiment of the present invention.","FIG.","7 is a diagram of an illustrative antenna that may be used in wireless communications circuitry in an electronic device in accordance with an embodiment of the present invention.","FIG.","8 is a diagram of showing how wireless circuit components such as antenna system structures may be coupled using an adjustable electrical component in accordance with an embodiment of the present invention.","FIG.","9 is a diagram of showing how wireless circuit components such as antenna system structures may be coupled using an adjustable electrical component such as a switch in accordance with an embodiment of the present invention.","FIG.","10 is a diagram of showing how wireless circuit components such as antenna system structures may be coupled using an adjustable electrical component such as a circuit element with continuously or semicontinuously tunable electrical properties in accordance with an embodiment of the present invention.","FIG.","11 is a diagram of showing how wireless circuit components such as antenna system structures may be coupled using an adjustable electrical component such as a tunable capacitor with a continuously or semicontinuously tunable capacitance in accordance with an embodiment of the present invention.","FIG.","12 is a diagram of showing how wireless circuit components such as antenna system structures may be coupled using an adjustable electrical component such as semicontinuously a tunable electrical network with switches that provide the network with multiple selectable impedance values in accordance with an embodiment of the present invention.","FIG.","13 is a circuit diagram of an adjustable antenna system in an electronic device in accordance with an embodiment of the present invention.","FIG.","14 is a diagram of an adjustable antenna system in an electronic device showing how the antenna system may be adjusted by adjusting transmission line loading in accordance with an embodiment of the present invention.","FIG.","15 is an interior perspective view of an illustrative electronic device having a peripheral conductive member and an internal planar conductive member showing how an adjustable electrical component may bridge gaps in the peripheral conductive member in accordance with an embodiment of the present invention.","FIG.","16 is a perspective view of an interior portion of a peripheral conductive electronic device housing member showing how adjustable electrical components may be bridge gaps in the peripheral conductive member in accordance with an embodiment of the present invention.","FIG.","17 is a top view of an electronic device showing how an adjustable electrical component may be used to connect different parts of an internal planar conductive member in accordance with an embodiment of the present invention.","FIG.","18 is a diagram of an illustrative antenna in which an adjustable electrical component has been used to couple different parts of an antenna ground plane element in accordance with an embodiment of the present invention.","FIG.","19 is a diagram of an illustrative electronic device having a conductive peripheral housing member and an internal planar structure with multiple regions that have been coupled using an adjustable electrical component in accordance with an embodiment of the present invention.","FIG.","20 is a perspective view of an illustrative radio-frequency transceiver circuit that has been mounted to a rigid printed circuit board and that has been coupled to a flex circuit on which conductive antenna structures are coupled to conductive flex traces and an optional flex-mounted component by an adjustable electrical component in accordance with an embodiment of the present invention.","FIG.","21 is a diagram of an adjustable antenna system in which a component with conductive structures such as a flex circuit on which a camera or other device structure has been mounted may be coupled to portions of an antenna using adjustable electrical components in accordance with an embodiment of the present invention.","FIG.","22 is an exploded perspective view of an illustrative electronic device having components such as a radio-frequency transceiver circuit that uses an adjustable antenna system that includes conductive frame members and an adjustable electrical component in accordance with an embodiment of the present invention.","FIG.","23 is a top view of an illustrative electronic device showing how an adjustable antenna system may be formed using an adjustable electrical component that couples a conductive peripheral housing member to a conductive planar internal housing member in accordance with an embodiment of the present invention.","FIG.","24 is a flow chart of illustrative steps involved in operating an electronic device with an adjustable antenna system in accordance with an embodiment of the present invention.","DETAILED DESCRIPTION Electronic devices such as device 10 of FIG.","1 may be provided with wireless communications circuitry.","The wireless communications circuitry may be used to support wireless communications such as long-range wireless communications (e.g., communications in cellular telephone bands) and short-range communications (i.e., local area network links such as WiFi® links, Bluetooth® links, etc.).","The wireless communications circuitry may include one or more antennas.","The antennas and associated wireless communications circuits within the electronic devices may be adjustable.","Adjustable antenna systems may be tuned to adjust antenna response within a band (i.e., the antenna systems may be fine tuned).","Fine tuning may be used to ensure that signals in a desired communications band are received properly.","Adjustable antenna systems may also be tuned so that an antenna response curve that would otherwise only cover a single band or group of bands can be used to cover additional frequencies of interests (i.e., the antenna systems may be coarsely tuned to cover a different band or group of bands).","Coarse tuning may allow relatively narrow bandwidth antennas to be tuned to cover communications bands over a relatively wide range of frequencies.","Any suitable electronic devices (e.g., device 10 of FIG.","1) may be provided with adjustable antenna systems that have these types of fine and coarse tuning capabilities.","For example, adjustable antenna systems may be used in electronic devices such as desktop computers, game consoles, routers, laptop computers, computers embedded in a computer monitor or television, computers that are part of set-top boxes or other consumer electronics equipment, relatively compact electronic devices such as portable electronic devices, etc.","The use of portable electronic devices is sometimes described herein as an example.","This is, however, merely illustrative.","Adjustable antenna systems may be used in any electronic device.","Electronic devices such as illustrative electronic device 10 of FIG.","1 may be laptop computers, tablet computers, cellular telephones, media players, other handheld and portable electronic devices, smaller devices such as wrist-watch devices, pendant devices, headphone and earpiece devices, other wearable and miniature devices, or other electronic equipment.","As shown in FIG.","1, device 10 includes housing 12.Housing 12, which is sometimes referred to as a case, may be formed of materials such as plastic, glass, ceramics, carbon-fiber composites and other composites, metal, other materials, or a combination of these materials.","Device 10 may be formed using a unibody construction in which most or all of housing 12 is formed from a single structural element (e.g., a piece of machined metal or a piece of molded plastic) or may be formed from multiple housing structures (e.g., outer housing structures that have been mounted to internal frame elements or other internal housing structures).","Device 10 may, if desired, have a display such as display 14.Display 14 may, for example, be a touch screen that incorporates capacitive touch electrodes.","Display 14 may include image pixels formed from light-emitting diodes (LEDs), organic LEDs (OLEDs), plasma cells, electronic ink elements, liquid crystal display (LCD) components, or other suitable image pixel structures.","A cover glass member may cover the surface of display 14.Buttons such as button 16 may pass through openings in the cover glass.","Openings may also be formed in the cover glass of display 14 to form a speaker port such as speaker port 18.Openings in housing 12 may be used to form input-output ports, microphone ports, speaker ports, button openings, etc.","Wireless communications circuitry in device 10 may be used to form remote and local wireless links.","One or more antennas may be used during wireless communications.","Single band and multiband antennas may be used.","For example, a single band antenna may be used to handle Bluetooth® communications at 2.4 GHz (as an example).","As another example, a multiband antenna may be used to handle cellular telephone communications in multiple cellular telephone bands.","Other types of communications links may also be supported using single-band and multiband antennas.","If desired, device 10 may use multiple antennas.","Multiple antennas may, for example, be used to support an antenna diversity scheme.","With an antenna diversity scheme, control circuitry in device 10 may monitor signal quality or sensor data to determine which antenna or antennas are performing best or are otherwise desirable to use (e.g., to satisfy regulatory limits).","Based on these considerations, the control circuitry may then choose to use only a subset of the antennas or may otherwise adjust antenna use.","If, for example, a sensor or a signal quality measurement determines that one of two antennas in an antenna diversity arrangement has become blocked by an external object such as part of a human body, the control circuitry may temporarily inactivate that antenna.","Device 10 may also use multiple antennas to implement a multiple-input-multiple-output (MIMO) communications protocol.","In a MIMO scheme, each of the antennas in a system may handle an independent data stream, allowing overall data throughput to be increased.","The control circuitry in device 10 may use proximity data or other data to control operation of the multiple antennas in the MIMO setup.","For example, the control circuitry may temporarily switch from MIMO operation to a protocol that uses only a single antenna or may switch from a four-antenna MIMO scheme to a two-antenna MIMO scheme, etc.","Antennas may be located at any suitable locations in device 10.For example, one antenna may be located in an upper region such as region 22 and another antenna may be located in a lower region such as region 20.In a larger device, antennas may be located along device edges, in the center of a rear planar housing portion, in device corners, etc.","Antennas in device 10 may be used to support any communications bands of interest.","For example, device 10 may include antenna structures for supporting local area network communications (e.g., IEEE 802.11 communications at 2.4 GHz and 5 GHz for wireless local area networks), signals at 2.4 GHz such as Bluetooth® signals, voice and data cellular telephone communications (e.g., cellular signals in bands at frequencies such as 850 MHz, 900 MHz, 1800 MHz, 1900 MHz, 2100 MHz, etc.","), global positioning system (GPS) communications at 1575 MHz, signals at 60 GHz (e.g., for short-range links), etc.","Different antennas may handle different bands or a communications band or group of bands may be handled using a shared antenna.","One antenna in device 10 may, for example, be used in handling voice and data communications in one or more cellular telephone bands, whereas another antenna in device 10 may provide coverage in a first band for handling Global Positioning System (GPS) signals at 1575 MHz and a second band for handling Bluetooth® and IEEE 802.11 (wireless local area network) signals at 2.4 GHz (as examples).","Additional antennas may be provided to implement antenna diversity schemes, phased antenna arrays (e.g., at 60 GHz), additional bands, etc.","A schematic diagram showing illustrative components that may be used in device 10 of FIG.","1 is shown in FIG.","2.As shown in FIG.","2, device 10 may include storage and processing circuitry 28.Storage and processing circuitry 28 may include storage such as hard disk drive storage, nonvolatile memory (e.g., flash memory or other electrically-programmable-read-only memory configured to form a solid state drive), volatile memory (e.g., static or dynamic random-access-memory), etc.","Processing circuitry in storage and processing circuitry 28 may be used to control the operation of device 10.This processing circuitry may be based on one or more microprocessors, microcontrollers, digital signal processors, application specific integrated circuits, etc.","Storage and processing circuitry 28 may be used to run software on device 10, such as internet browsing applications, voice-over-internet-protocol (VOIP) telephone call applications, email applications, media playback applications, operating system functions, etc.","To support interactions with external equipment, storage and processing circuitry 28 may be used in implementing communications protocols.","Communications protocols that may be implemented using storage and processing circuitry 28 include internet protocols, wireless local area network protocols (e.g., IEEE 802.11 protocols—sometimes referred to as WiFi®), protocols for other short-range wireless communications links such as the Bluetooth® protocol, cellular telephone protocols, MIMO protocols, antenna diversity protocols, etc.","Antenna system tuning operations may be controlled using software stored and running on device 10 (i.e., stored and running on storage and processing circuitry 28 and/or input-output circuitry 30).","Input-output circuitry 30 may include input-output devices 32.Input-output devices 32 may be used to allow data to be supplied to device 10 and to allow data to be provided from device 10 to external devices.","Input-output devices 32 may include user interface devices, data port devices, and other input-output components.","For example, input-output devices may include touch screens, displays without touch sensor capabilities, buttons, joysticks, click wheels, scrolling wheels, touch pads, key pads, keyboards, microphones, cameras, buttons, speakers, status indicators, light sources, audio jacks and other audio port components, digital data port devices, light sensors, motion sensors (accelerometers), capacitance sensors, proximity sensors, etc.","Input-output circuitry 30 may include wireless communications circuitry 34 for communicating wirelessly with external equipment.","Wireless communications circuitry 34 may include radio-frequency (RF) transceiver circuitry formed from one or more integrated circuits, power amplifier circuitry, low-noise input amplifiers, passive RF components, one or more antennas, transmission lines, and other circuitry for handling RF wireless signals.","Wireless signals can also be sent using light (e.g., using infrared communications).","Wireless communications circuitry 34 may include radio-frequency transceiver circuitry 90 for handling various radio-frequency communications bands.","For example, circuitry 34 may include transceiver circuitry 36, 38, and 42.Transceiver circuitry 36 may handle 2.4 GHz and 5 GHz bands for WiFi® (IEEE 802.11) communications and may handle the 2.4 GHz Bluetooth® communications band.","Circuitry 34 may use cellular telephone transceiver circuitry 38 for handling wireless communications in cellular telephone bands at 850 MHz, 900 MHz, 1800 MHz, 1900 MHz, and 2100 MHz data band (as examples).","Circuitry 38 may handle voice data and non-voice data.","Wireless communications circuitry 34 can include circuitry for other short-range and long-range wireless links if desired.","For example, wireless communications circuitry 34 may include 60 GHz transceiver circuitry, circuitry for receiving television and radio signals, paging system transceivers, etc.","Wireless communications circuitry 34 may include global positioning system (GPS) receiver equipment such as GPS receiver circuitry 42 for receiving GPS signals at 1575 MHz or for handling other satellite positioning data.","In WiFi® and Bluetooth® links and other short-range wireless links, wireless signals are typically used to convey data over tens or hundreds of feet.","In cellular telephone links and other long-range links, wireless signals are typically used to convey data over thousands of feet or miles.","Wireless communications circuitry 34 may include antennas 40.Antennas 40 may be formed using any suitable antenna types.","For example, antennas 40 may include antennas with resonating elements that are formed from loop antenna structure, patch antenna structures, inverted-F antenna structures, slot antenna structures, planar inverted-F antenna structures, helical antenna structures, hybrids of these designs, etc.","Different types of antennas may be used for different bands and combinations of bands.","For example, one type of antenna may be used in forming a local wireless link antenna and another type of antenna may be used in forming a remote wireless link antenna.","With one suitable arrangement, device 10 may have antennas in regions of device 10 such as upper region 22 and lower region 20.One or more upper antennas for device 10 may be formed in region 22.One or more lower antennas for device 10 may be formed in region 20.In devices with other form factors such as laptop and tablet computers, wearable devices, computer monitors with integrated computers, etc., antennas may be located in other suitable regions (e.g., at the four corners of a rectangular device, on front and back surfaces, along edge regions of a device, in one or more arrays, etc.).","As shown in FIG.","3, transceiver circuitry 90 may be coupled to antennas 40 using transmission lines 140.Device 10 may have antennas 40 that include both fixed antenna structures (e.g., fixed antenna structures 40A) and adjustable antenna structures (e.g., adjustable antenna structures 40B).","A configuration that includes both fixed and adjustable antennas may be used, for example, when there is sufficient space available for only one broadband antenna.","In this type of arrangement, fixed antenna structures 40A may use a broadband design that covers multiple communications bands, whereas adjustable structures 40B may use a narrowband design that achieves multiband coverage through use of coarse antenna system tuning.","Other configurations may also be used.","For example, device 10 may be provided exclusively with adjustable antenna structures.","In general, any suitable number of adjustable antennas may be provided in device 10 (e.g., one adjustable antenna, two adjustable antennas, three adjustable antennas, four or more adjustable antennas, etc.).","When device 10 includes an adjustable antenna system (i.e., when antennas 40 and associated wireless circuitry 34 in device 10 is adjustable), antenna performance can be altered in real time.","For example, the resonance curve of the antenna system may be slightly altered to compensate for environmental factors such as temperature changes.","Relatively small adjustments to the frequency response of an antenna system are sometimes referred to as fine tuning adjustments or fine tuning.","If desired, the frequency response of the antenna system can be adjusted by larger amounts.","For example, the frequency response of an antenna may be altered sufficiently to cause the antenna to cover different communications bands.","A standing wave ratio (SWR) versus frequency plot for an illustrative antenna system in device 10 is shown in FIG.","4.In the FIG.","4 example, the antenna system operates in two modes.","In a first mode of operation, the antenna system is characterized by a frequency response of the type illustrated by solid line 142.As shown in FIG.","4, this frequency response allows the antenna system to cover two communications bands (i.e., a first communications band centered at frequency fa and a second communications band centered at frequency fb).","In a second mode of operation, the antenna system is characterized by a frequency response of the type illustrated by dashed line 144.When operating in the second mode of operation, the antenna system may cover one communications band at frequency fc and another communications band at frequency fd.","Frequency bands fa and fb may be, for example, 850 MHz and 900 MHz frequency bands, whereas frequency bands fc and fd may be, for example, 1900 MHz and 2100 MHz frequency bands (as examples).","During operation of device 10, device 10 can determine which communications bands are to be used and can adjust the adjustable antenna system accordingly (i.e., to cover the frequency range associated with curve 142 or to cover the frequency range associated with curve 144).","If desired, device 10 may include a fixed antenna such as the fixed antenna of FIG.","3 that covers both low bands (fa and fb) and high bands (fc and fd).","As described in connection with FIG.","4, device 10 may also have an adjustable antenna system that is adjusted between the first and second modes to selectively cover the same bands that are covered by the fixed antenna.","An illustrative fine tuning operation using an adjustable antenna system in device 10 is shown in FIG.","5.As shown in FIG.","5, the adjustable antenna system may initially exhibit a frequency response of the type shown by solid line 146.Due to changes in operating temperature or other effects, the frequency response of the antenna may need to be adjusted to ensure that signals are properly received and transmitted.","This can be accomplished by adjusting the adjustable antenna system in device 10 so that its frequency response shifts slightly to the frequency response shown by dashed line 148 (i.e., a frequency shift of Δf).","Real time adjustments such as the fine tuning adjustments of FIG.","5 and the coarse tuning adjustments of FIG.","4 may be made to ensure that device 10 performs as desired under a variety of wireless traffic and environmental scenarios.","FIG.","6 shows illustrative components that may be included in an adjustable antenna system in electronic device 10.As shown in FIG.","6, radio-frequency signals may be generated and received by radio-frequency transceiver circuitry 90.Circuitry 90 may include radio-frequency transmitters for transmitting radio-frequency signals and radio-frequency receivers for receiving radio-frequency signals.","Radio-frequency amplifier circuitry and other components (e.g., switches) may be included in transceiver circuit block 90.Adjustable antenna system 150 may include antennas 40, matching network 152, and transmission line 140.Antenna 40 may be include antenna ground structures and antenna resonating element structures such as loop antenna structures, patch antenna structures, inverted-F antenna structures, slot antenna structures, planar inverted-F antenna structures, helical antenna structures, hybrids of these designs, etc.","Transmission line 140 may be coupled to transceiver circuitry 90.Transmission line 140 may be based on a microstrip transmission line structure, a stripline transmission line structure, an edge coupled microstrip transmission line structure, an edge coupled stripline transmission line structure, transmission line structures formed on flexible printed circuits (“flex circuits”), structures formed on rigid printed circuit boards, a coaxial cable, other suitable transmission line structures, or combinations of these structures.","Matching network 152 may be used to help match the impedance of transmission line 140 to the impedance of antenna 40.Matching network 152 may include electrical components such as resistors, inductors, and capacitors, and conductive traces, pieces of metal, and other structures that have associated resistances, inductances, and capacitances.","Although shown as being interposed between transmission line 140 and antenna 40 in the example of FIG.","6, matching network components may, if desired, be interposed within transmission line 90 and/or within antenna 40.The arrangement of FIG.","6 is merely illustrative.","Antenna 40 may be fed using an antenna feed such as an antenna feed formed from positive antenna feed terminal 156 and ground antenna feed terminal 158.To provide antenna system 150 with adjustability, antenna system 150 may be provided with one or more adjustable electrical components.","These components may be incorporated into antenna 40 (including the antenna feed), matching network 152, and transmission line 140.FIG.","7 is a diagram of an illustrative antenna.","In the FIG.","7 example, antenna 40 has an inverted-F configuration.","This is, however, merely illustrative.","Antenna 40 may be formed using any suitable antenna design.","As shown in FIG.","7, antenna 40 may include an antenna ground (e.g., antenna ground element 160) and an antenna resonating element (antenna resonating element 162).","Antenna ground 160 and antenna resonating element 162 may be formed from conductive structures such as pieces of metal, metal traces on printed circuit boards, parts of an electronic device housing, conductive components, and other conductive elements in device 10.Antenna ground element 160 may be formed from one conductive structure or multiple conductive structures.","Antenna resonating element 162 may have a main resonating element branch such as branch 164 and additional branches.","Segment 166 of resonating element 162 may short arm 164 to ground 160.Transceiver 90 may be coupled to antenna feed terminals 156 and 158.Matching network components and transmission line structures are not shown in FIG.","7 to avoid over-complicating the drawing.","Antenna 40 and the other structures of antenna system 150 may be provided with adjustable electrical components such as switches and continuously and semicontinuously tunable electrical components.","For example, an adjustable electrical component may be coupled between portions of antenna resonating element arm 164 or between portions of ground plane 160 in an antenna of the type shown in FIG.","4.Adjustable electrical components may also be incorporated into matching network 152 or transmission line 140 of FIG.","6.The antenna feed for antenna 40 may be adjusted using adjustable electrical components (e.g., adjustable electrical components coupled to feed terminals).","The use of an adjustable electrical component to make adjustments to adjustable antenna system 150 is illustrated in FIG.","8.As shown in FIG.","8, adjustable antenna system 150 may include adjustable antenna system portions 150A and 150B.","Portions 150A and 150B may be antenna resonating element structures, antenna ground element structures, parasitic antenna structures (e.g., antenna structures that are near-field coupled to other antenna structures) antenna feed structures, other antenna structures, matching network structures, transmission line structures (e.g., a transmission line stub), other antenna system structures, or any combination of these structures.","Adjustable electrical component 168 may have a first terminal such as terminal 170 that is connected to antenna system portion 150A and a second terminal such as terminal 172 that is connected to antenna system portion 150B.","Adjustable electrical component 168 may be adjusted using control signals applied to control input 174 or may be implemented using a two-terminal arrangement in which control signals are applied over terminals 170 and 172.Examples of adjustable electrical components that may be used for adjustable electrical component 168 include switches, variable resistors, variable capacitors, variable inductors, and components that control multiple electrical parameters.","FIG.","9 shows how adjustable electrical component 168 may be implemented using a switch.","Switch 168 of FIG.","9 may be placed in an open state in which antenna system portion 150A is electrically isolated from antenna system portion 150B or may be placed in a closed state in which terminals 170 and 172 are shorted together so that portions 150A and 150B are electrically connected.","Switch 168 may be implemented using a gallium arsenide field-effect transistor (FET), a microelectromechanical systems (MEMs) switch, a metal-oxide-semiconductor field-effect transistor (MOSFET), a p-i-n diode, a high-electron mobility transistor (HEMT), a pseudomorphic HEMT (PHEMT), a transistor formed on a silicon-on-insulator (SOI) substrate, etc.","As shown in FIG.","10, adjustable electrical component 168 may be implemented using a component that can be placed in numerous different states (e.g., a component that is continuously variable or that is semicontinuously variable and can be placed in one of a number of different discrete states).","Component 168 may be, for example, a continuously variable capacitor, a semicontinuously adjustable capacitor that has 2-100 or more different capacitance values, a continuously variable resistor, a semicontinuously adjustable resistor that has 2-100 or more different resistance values, a continuously variable inductor, or a semicontinuously adjustable inductor that has 2-100 or more different inductance values.","FIG.","11 shows, for example, how adjustable electrical component 168 may include a continuously variable capacitor.","Semicontinuously adjustable components may be implemented using arrays of discrete components and switches configured to serve as multiplexers.","If desired, adjustable electrical component 168 may be formed from other adjustable electrical components.","As shown in FIG.","12, for example, semicontinuously adjustable electrical component 168 may be formed from an electrical network that includes inductors such as inductors L1 and L2.Switches (e.g., switches SWA and SWB in the FIG.","12 example) may be used to form desired patterns of electrical connections within the electrical network.","For example, components may be switched into or out of use or may be interconnected in different ways.","In the FIG.","12 example, the inductance that is exhibited between terminals 170 and 172 may be adjusted by opening and closing switches SWA and SWB in various patterns.","Networks with other patterns of electrical components (e.g., capacitors, resistors, inductors, and conductive and dielectric structures that have capacitance, inductance, and resistance and that serve as capacitors, resistors, and inductors), other patterns of switches or continuously or semicontinuously adjustable components may also be used in implementing adjustable electrical component 168.The example of FIG.","12 is merely illustrative.","An illustrative adjustable antenna system 150 that is based on an inverted-F antenna such as antenna 40 of FIG.","7 is shown in FIG.","13.Main resonating element arm 164 of antenna 40 may be connected to ground 160 through a short circuit path such as path 132A (if switch 176 is closed and switch 178 is open) or path 132B (if switch 176 is open and switch 178 is closed).","A feed path (see, e.g., terminals 158 and 108), and one or more optional paths such as the path formed by adjustable electrical component 120 (e.g., a switch), the path formed by element 122 (e.g., a semicontinuously or continuously adjustable component), and the path formed by adjustable electrical components 124 and 126 (e.g., a switch and a continuously adjustable component, respectively).","Optional antenna resonating element branches such as branch 130 may be coupled to antenna 40 (e.g., by connecting branch 130 to main resonating element arm 164 through adjustable electrical component 128).","Antenna 40 may be feed by transceiver 90 (i.e., transceiver circuitry such as transceiver circuitry 90 of FIG.","2).","Transmission line 140 may have paths such as positive antenna signal paths 94 and 104 and ground antenna signal paths such as paths 92 and 106 and may be used to convey radio-frequency antenna signals between transceiver 90 and antenna 40.Matching circuitry 152 may be interposed in the path between transceiver 90 and antenna 40.Matching circuitry 152 may include series-connected and shunt-connected adjustable electrical components such as components 102 and 100.One or more adjustable electrical components such as components 100 and 102 may be coupled between transmission line 140 and additional transmission line components and other electrical components.","For example, a component such as a transmission line stub (e.g., transmission line stub 140′), may be coupled to transmission line 140 via component 100.Any of the adjustable electrical components used in adjustable antenna system 150 may include transmission line structures, if desired.","Transmission line paths such as positive transmission line path 104 and ground transmission line path 106 may be used to interconnect matching circuitry 152 to the antenna feed of antenna 40.The antenna feed may have a fixed or tunable configuration.","In the example of FIG.","13, the antenna feed for antenna 40 is tunable between a first antenna feed configuration in which switch 118 (or other such adjustable electrical component) has a first position and a second antenna feed configuration in which switch 118 has a second position.","When switch 118 is in its first position, terminal 108 is connected to terminal 156A, so that terminal 156A serves as the positive antenna feed terminal for antenna 40.When switch 118 is in its second position, terminal 108 is connected to terminal 156B, so that terminal 156B serves as the positive antenna feed terminal for antenna 40.Feed terminals 156A and 156B are located at different positions along the length of main resonating element arm 164, so the impedance and therefore the frequency response of antenna 40 can be adjusted by using switch 118 to control the feed location in antenna 40.The arrangement of FIG.","13 is merely illustrative.","In general, antennas such as antenna 40 in device 10 may have tunable feeds formed from two or more feed points, tunable feeds that involve one, two, three, or more than three switches, feeds that are tuned by adjusting the ground antenna feed and/or the positive antenna feed, non-tunable feeds, etc.","By incorporating adjustable electronic components into antenna 40 (e.g., antenna resonating element 162), antenna 40 may be adjusted ad described in connection with FIGS.","4 and 5.For example, the size and shape of antenna structures such as resonating element 162 in antenna 40 can be controlled by storage and processing circuitry 28.In the FIG.","13 arrangement, adjustable electrical component 128 may be, for example, a switch with two states (e.g., an open state that electrically disconnects antenna resonating element portion 130 from antenna resonating element portion 164 and a closed state that electrically connects antenna resonating element portion 130 and antenna resonating element portion 164).","Component 128 may adjust the size and shape of the antenna resonating element and thereby adjust the frequency response of the antenna as described in connection with FIGS.","4 and 5.Additional resonating element structures and antenna structures may likewise be selectively connected and disconnected from the antenna resonating element in antenna 40 if desired.","Circuit components (e.g., resistors, inductors, and capacitors) may be interconnected with switches such as switch 128 (e.g., for impedance matching).","Antenna 40 may also be adjusted by controlling components such as adjustable components 120, 122, 124, and 126 (as examples).","The adjustable components of FIG.","13 are sometimes depicted as adjustable electronic component 168 in the other drawings.","FIG.","14 shows how adjustable antenna system 150 may include an adjustable transmission line.","Adjustable transmission line 140 may include one or more adjustable electronic components such as adjustable electronic component 168.Adjustable electronic component 168 may be used to selectively adjust the properties of transmission line 140.For example, component 168 may be used to connect transmission line stub 140′ to a main transmission line path in transmission line 140 and may be used to disconnect transmission line stub 140′ from the main transmission line path in transmission line 140.By adjusting the properties of transmission line 140, the frequency response of the antenna (i.e., adjustable antenna system 150) can be controlled as described in connection with FIGS.","4 and 5 (as examples).","FIG.","15 is an interior perspective view of electronic device 10 of FIG.","1 showing how electronic device 10 may include conductive structures such as conductive peripheral member 180.Device 10 may have a rectangular outline (periphery) when viewed from the front (i.e., when viewed from the face of device 10 that contains display 14).","Conductive peripheral member 180 may be implemented using metal or other conductive materials.","Conductive peripheral member 180 may surround substantially all of the rectangular periphery of device 10.Conductive peripheral member 180 may have the shape of a display bezel for display 14 or a trim structure for device 10 (i.e., a bezel or trim piece that runs around the upper rim on the front of device 10) or may be implemented using a flat or curved member that forms housing sidewalls that cover substantially all of the sides of housing 12 (as examples).","A gap or multiple gaps such as gaps 182 may be interposed in conductive peripheral member 180.Gaps 182 may be formed from dielectric (e.g., air, plastic, glass, ceramics, composites, other dielectrics, or combinations of these materials).","Gaps 182 may form part of the antennas in device 10 (e.g., antenna 40).","Transceiver 90 may be implemented using components such as one or more integrated circuits and other electrical components that are mounted on a substrate such as printed circuit board 194.Transmission line traces in board 194 (i.e., transmission line 140A may be coupled between transceiver 90 and radio-frequency connector 186.Connector 186 may be connected to a coaxial cable segment or other transmission line 104B.","Transmission line 104B may be coupled to a matching network (e.g., matching network 152 of FIG.","13) and an antenna feed (e.g., an antenna feed made up of antenna feed terminals 158 and 156).","The antenna feed may, for example, be coupled across one of gaps 182 or may be located elsewhere in device 10.Adjustable electrical components 168 may be included in antenna 40 to help provide adjustable antenna system 150 with adjustability.","As an example, an adjustable electrical component may bridge one of gaps 182 (e.g., by connecting one of components 168 between terminals 190 and 192 on opposing sides of a gap in peripheral conductive member 180).","Adjustable electrical components 168 may also be connected between the other conductive components in adjustable antenna system 150 (e.g., between a first terminal such as terminal 198 that is attached to peripheral conductive member 180 and a second terminal such as terminal 188 that is connected to a conductive trace in board 194 (e.g., a ground plane trace).","Devices such as device 10 of FIG.","15 may, if desired, have planar members such as illustrative planar structure 196.Structure 196 may form part of the rear housing surface (i.e., an external housing wall structure on the rear face of housing 12) or may form an internal planar member (e.g., an internal housing structure that spans the width of device 10 while creating closed or open slot-shaped openings such as dielectric-filled opening 184 at one or both ends of device 10 as shown in FIG.","15).","Structure 196 may be formed from metal (e.g., a metal plate) or other conductive structures and may, if desired, be used in forming an antenna ground plane for antenna 40.Adjustable electrical components 168 may be used to provide adjustability to the size of gaps 182 in conductive peripheral member 180.Consider, as an example, the illustrative arrangement shown in FIG.","16.As shown in FIG.","16, a peripheral conductive member in device 10 such as peripheral conductive member 180 may have multiple adjacent gaps 182.In the FIG.","16 example, peripheral conductive housing member 180 has two gaps 182 a first of which has a length (width) of G1 and a second of which has a length (width) of G2.Adjustable electrical components 168A and 168B may bridge gaps 182 (e.g., on the interior side of peripheral conductive member 180).","For example, adjustable electrical component 168A may have a first terminal that is electrically connected to portion 200 of peripheral conductive member 180 and a second terminal that is electrically connected to portion 202 of peripheral conductive member 180.Adjustable electrical component 168B may have a first terminal that is electrically connected to portion 202 of peripheral conductive member 180 and a second terminal that is electrically connected to portion 204 of peripheral conductive member 180.As with the other adjustable electrical components 168 for device 10, adjustable electrical components 168 of FIG.","16 may be implemented using switches, continuously or semicontinuously variable components such as variable capacitors, variable resistors, and variable inductors, continuously or semicontinuously adjustable circuit networks, etc.","Configurations of the type shown in FIG.","16 may be used to adjust the electrical properties of gaps 182 and/or to adjust effective gap length (i.e., to electrically adjust gap width).","As shown in FIG.","16, for example, there may be a gap length (width) G3 between the outermost (most distant) edges of gaps 182.Adjustable components 168 may be, for example, switches.","In this type of configuration, switch 168A may be opened to switch the leftmost gap 182 into use or may be closed to bypass the leftmost gap.","Switch 168B may be opened to switch the rightmost gap 182 into use or may be closed to bypass the rightmost gap.","When both switches 168A and 168B are open, antenna 40 has two gaps (of widths G1 and G2) connected in series within peripheral conductive member 180, so the gaps may be considered to have an effective width of G3.When switch 168A is closed and switch 168B is open, only the gap of width G2 is present.","When switch 168B is closed and switch 168A is open, only the gap of width G1 is present.","When both switches 168 are closed, no gap is present.","Adjustment of the states of switches 168A and 168B (e.g., by applying control signals from storage and processing circuitry 28 to switches 168) can therefore adjust the width of the gap in conductive peripheral member 180.When adjustable electrical components other than switches are used (e.g., variable capacitors, inductors, etc.)","a combination of impedance adjustments and effective gap width adjustments may be produced.","In the example of FIG.","16, adjustable electrical components 168 connect different portions of peripheral conductive member 180 to each other.","Adjustable electrical components 168 may also be used to connect other conductive portions of antenna system 150 together such as other conductive portions of housing 12.As an example, adjustable components 168 and may be used to couple together different portions of a planar structure such as structure 196 of FIG.","17.Structure 196 may be formed using all or some of a rear housing structure (e.g., a housing wall), an internal housing member, or other conductive structures.","Member 196 may, for example, have an opening such as opening 184′ of FIG.","17.Opening 184′ may be contiguous with opening 184 and may form an extension of opening 184.Opening 184 (and extension 184′) may form an opening for antenna 40 (e.g., an opening for a slot antenna, a loop antenna, a hybrid antenna, etc.).","Opening 184 may have an inner periphery P. The length of inner periphery P and other electrical properties of antenna 40 may be adjusted by adjusting electrical components 168.For example, by using switches for components 168, the size of opening 184′ and therefore the length of P may be adjusted.","If switch 168C and 168D are both open, the size of extension 184′ and length P will be maximized.","If switch 168C is open and switch 168D is closed, the size of opening 184′ will be halved (as an example).","Switch 168C (and, if desired switch 168D) may be closed to reduce the size of opening 184′ further (or even to bypass opening 184′ entirely).","Antenna 40 may exhibit a resonance peak when P is equal to about one wavelength of the radio-frequency antenna signals being handled by antenna 40.By adjusting P, the frequency response of antenna 40 can therefore be adjusted as described in connection with FIGS.","4 and 5 (i.e., by adjusting the center frequency of a slot antenna or loop antenna, etc.).","FIG.","18 shows how antenna 40 in adjustable antenna system 150 may be adjusted by providing one or more adjustable electrical components 168 between respective portions of ground plane 160.In the FIG.","18 example, ground plane 160 includes ground plane portion 160A and ground plane portion 160B.","Adjustable electrical component 168 bridges gap 206 between portions 160A and 160B.","By controlling adjustable electrical component 168, ground plane 160 can be altered (e.g., to include member 160A while member 160B is disconnected from antenna 40) or to include both members 160A and 160B (i.e., by coupling members 160A and 160B together by bridging gap 206.Component 168 may, for example, be a switch that can be opened to disconnect portion 160B from portion 160A and that can be closed to connect portions 160A and 160B together.","Component 168 may also be an adjustable component such as an adjustable capacitor, adjustable resistor, adjustable inductor, or other adjustable circuitry that can be adjusted to tune antenna 40.If desired, ground plane 160 may be implemented using a planar structure such as planar structure 196 of FIG.","19.Structure 196 may be, for example, an external housing structure (e.g., a planar rear housing wall in housing 12), an internal housing structure (e.g., an internal plate or other planer support structure), or other conductive structures.","Structure 196 may have a dielectric gap such as gap 208 that separates portions 160′ and 160″ of structure 196.Gap 208 may be bridged using adjustable electronic component 168 (e.g., a switch, a continuously adjustable component, etc.","), thereby tuning the performance of antenna 40.As shown in FIG.","20, transceiver 90 may be mounted on a substrate such as a printed circuit board and coupled to an antenna 40 on a flex circuit substrate (substrate 210) via transmission line 140.Transmission line 140 may, for example, include conductive traces in printed circuit board 194 and conductive traces in flex circuit 210.Flex circuit 210 may be formed from a sheet of polyimide or other flexible polymer sheet that serves as a printed circuit board.","Conductive traces for antenna 40 (e.g., conductive metal antenna resonating element traces such as traces 212 and 214) may be formed on the exposed outer surface of flex circuit substrate 210 or may be formed from internal conductive traces.","Adjustable electrical component 168 may bridge conductive antenna structures such as structures 212 and 214.Component 168 may be, for example, a switch that can be opened to disconnect structure 214 from structure 212 or that can be closed to connect structures 214 and 212.Structures 212 and 214 may form part of a ground plane element, part of antenna resonating element 162 (e.g., an arm such as arm 130 of FIG.","13), part of a parasitic element (e.g., an antenna element whose presence affects the frequency response of antenna system 150, but that is near-field coupled to the antenna rather than being directly fed by transmission line 140), etc.","If desired, flex circuit 210 may be used as a substrate for one or more electrical components such as component 216.Components such as component 216 may be, for example, camera modules, speaker parts, button structures, integrated circuits, connectors, or other components (e.g., components that include conductive structures that may be connected to trace 214).","These components may be mounted to flex circuit substrate 210 using parts of conductive traces 212 and 214 or using separate conductive traces.","Consider, as an example, an arrangement in which electronic device 10 includes a camera module.","The camera module (e.g., one of input-output devices 32 of FIG.","2) may be mounted to flex circuit 210.Traces in flex circuit 210 may be used to provide power and control signals to the camera module and may be used to gather data signals from the camera module.","Traces 214 and 212 may be formed on the same flex circuit as the camera module, reducing component count and saving space in device 10.Adjustable electrical component 168 may be adjusted to selectively switch into use conductive material on flex circuit 210 (e.g., traces such as traces 214 on flex circuit 210, conductive components associated with the camera module, conductive ground structures, etc.).","In this way, adjustments to adjustable electrical component 168 may be used to tune antenna 40 and adjustable antenna system 150.FIG.","21 is a diagram of adjustable antenna system 150 showing how a component such as component 218 may be coupled to antenna structures such as antenna resonating element 164 and antenna ground 160 using one or more adjustable electrical components 168.Component 218 may be, for example, a camera module (e.g., a camera module component on a flex circuit as described in connection with component 216 on flex circuit 210 of FIG.","20), a speaker, a button, a microphone, an input-output connector such as an audio jack or data connector, etc.","One or both of the adjustable electrical components may be used in controlling adjustable antenna system 150.If desired, adjustable electrical components 168 may be used to selectively couple component 218 to other adjustable antenna system structures (e.g., transmission line structures, matching circuit structures, feed structures, etc.).","FIG.","22 is a perspective view of an illustrative configuration that may be used for electronic device 10.As shown in FIG.","22, electronic device 10 may have a display such as display 14.Display 14 may include a display module 222 mounted beneath a transparent cover layer such as cover glass layer 220.Components such as transceiver 90 may be mounted within the interior of housing 12.Antenna 40 may include conductive structures such as frame members 224 and 226.Antenna 40 may also include conductive structures such as antenna resonating element structures (e.g., conductive traces on a flex circuit, etc.","), conductive structures such as ground plane elements (e.g., a ground plane formed from conductive plate 196 of FIG.","15 and overlapping conductive structures such as printed circuit boards, connectors, buttons, speakers, batteries, etc.","), and other conductive structures.","In the FIG.","22 example, frame members 224 and 226 are mounted to housing 12 using fasteners such as screws 228.If desired, other attachment mechanisms may be used to attach frame members within housing 12 (e.g., welds, adhesive, springs, engagement features such as protrusions and mating slots, etc.).","Frame members 224 and 226 may be formed from metal or other conductive materials.","Adjustable electrical component 168 may be used to control how many frame members such as members 224 and 226 are electrically connected within antenna 40 (e.g., to control the size of an antenna resonating element arm or ground plane) or may be used to control other electrical antenna properties.","This allows adjustable antenna system 150 to be tuned as described in connection with FIGS.","4 and 5.FIG.","23 shows how one or more adjustable electronic components such as adjustable electronic component 168 may be coupled between a ground plane element such as plate member 196 and a portion of peripheral conductive member 180 (e.g., a peripheral housing sidewall or bezel structure).","Adjustable component 168 of FIG.","23 may be, for example, a switch that can be placed in an open or closed position.","Portions of peripheral conductive member 180 and opposing portions of conductive structure 196 may define an opening such as opening 184 with an inner periphery.","Component 168 may bridge opening extension 184′.","Opening 184 (including extension 184′) may form a slot for a slot antenna or hybrid antenna.","The length of the inner periphery of opening 184 may be approximately equal to one wavelength at an operating frequency of interest.","Switch 168 may be closed to decrease the length of the inner periphery (to length P) or can be opened to increase the length of the inner periphery (to length P′).","Adjustments to component 168 may therefore be used to control the frequency response of antenna 40.The antenna system adjustment mechanisms described in connection with FIGS.","1-23 may, if desired, be used in any combination.","For example, antenna system adjustments may be made using any combination of transmission line adjustments, matching network adjustments, antenna adjustments, antenna feed adjustments, antenna resonating element adjustments, antenna ground adjustments, etc.","Adjustable electrical components 168 may be incorporated into any combination of the portions of antenna system 150 (e.g., to bridge ground gaps, to bridge portions of an antenna resonating element, to connect a ground plate to a peripheral conductive member in a device housing, to connect portions of a peripheral housing member together in various formations and thereby adjust the width of a dielectric gap in the peripheral housing member, to form connections between conductive antenna structures and housing frame members, to bridge any combination of these structures, etc.).","FIG.","24 is a flow chart of illustrative steps involved in operating an electronic device with an adjustable antenna system such as electronic device 10 of FIG.","1.At step 230, storage and processing circuitry 28 (FIG.","2) may be used to determine which communications bands are to be used by device 10.For example, if signals are being transmitted over a 2.4 GHz local WiFi link, storage and processing circuitry 28 may conclude that adjustable antenna system 150 will be covering (or should continue to cover) the 2.4 GHz communications band.","Wireless communications in various cellular telephone bands may also be supported.","The operations of step 230 may involve determination of the capabilities of device 10 (i.e., the capabilities of transceiver 90), the current geographic location of device 10 (e.g., the current country in which device 10 is located), current traffic being handled (e.g., determining what type of cellular traffic or local area network traffic is currently being received on a particular band), etc.","Information on currently active bands or bands that need to be covered to receive incoming data may be gathered by monitoring incoming traffic through a fixed antenna (e.g., in a system of the types shown in FIG.","3 in which some antennas are fixed and some are adjustable) or by periodically cycling an adjustable antenna system through all possible bands of interest.","Information on bands that are to be used for an upcoming activity (e.g., a data transmission activity) may be determined based on factors such as the last band used, geographic location, trial and error, look-up tables mapping device activities to required band usage, etc.","At step 232, after having determined which communications bands are to be covered by adjustable antenna system 150, storage and processing circuitry 28 may, in response, issue corresponding control signals to adjustable antenna system 150.If, for example, storage and processing circuitry 28 determines that adjustable antenna system 150 should cover the 1900 MHz band, control signals may be issued to the adjustable electrical components 168 in adjustable antenna system 150 to configure adjustable antenna system 150 to cover the 1900 MHz band (as an example).","At step 234, the adjustable electrical component(s) 168 in adjustable antenna system 150 may be controlled by the control signals that have been issued, thereby tuning adjustable antenna system 150 coarsely (e.g., to cover a desired band as described in connection with FIG.","4) and/or finely (e.g., to improve tuning accuracy within a particular communications band as described in connection with FIG.","5).","The operations of FIG.","24 (e.g., monitoring to determine which bands are of interest, determining how to adjust components 168, and issuing commands that adjust components 168 and therefore system 150) may be performed repeatedly in real time (e.g., in response to the satisfaction of appropriate trigger criteria, periodically according to a schedule, continuously, etc.).","The foregoing is merely illustrative of the principles of this invention and various modifications can be made by those skilled in the art without departing from the scope and spirit of the invention.","The foregoing embodiments may be implemented individually or in any combination."]],"string":"[\n [\n \"TUNABLE ANTENNA SYSTEMS\",\n \"An electronic device has wireless communications circuitry including an adjustable antenna system coupled to a radio-frequency transceiver.\",\n \"The adjustable antenna system may include one or more adjustable electrical components that are controlled by storage and processing circuitry in the electronic device.\",\n \"The adjustable electrical components may include switches and components that can be adjusted between numerous different states.\",\n \"The adjustable electrical components may be coupled between antenna system components such as transmission line elements, matching network elements, antenna elements and antenna feeds.\",\n \"By adjusting the adjustable electrical components, the storage and processing circuitry can tune the adjustable antenna system to ensure that the adjustable antenna system covers communications bands of interest.\"\n ],\n [\n \"1.An electronic device having a periphery, comprising: radio-frequency transceiver circuitry; an antenna having an antenna feed and ground plane structures; a transmission line path coupled between the radio-frequency transceiver circuitry and the antenna feed; peripheral conductive housing structures that run along the periphery and surround the ground plane structures, wherein the peripheral conductive housing structures include a portion that forms at least part of the antenna; storage and processing circuitry configured to generate a control signal; and an adjustable electrical component coupled to the peripheral conductive housing structures, wherein the adjustable electrical component has a control input that receives the control signal and the adjustable electrical component is configured to adjust a frequency response of the antenna based on the control signal.\",\n \"2.The electronic device defined in claim 1, wherein the peripheral conductive housing structures include a dielectric-filled gap that divides the peripheral conductive housing structures.\",\n \"3.The electronic device defined in claim 2, wherein the peripheral conductive housing structures include an additional dielectric-filled gap that divides the peripheral conductive housing structures.\",\n \"4.The electronic device defined in claim 3, wherein the dielectric-filled gap and the additional dielectric-filled gap are formed at different sides of the electronic device.\",\n \"5.The electronic device defined in claim 2, wherein the adjustable electrical component comprises first and second terminals coupled to the peripheral conductive housing structures at opposing sides of the dielectric-filled gap.\",\n \"6.The electronic device defined in claim 1, wherein the adjustable electrical component comprises an adjustable electrical component selected from the group consisting of an adjustable capacitor and an adjustable inductor.\",\n \"7.The electronic device defined in claim 1, wherein the antenna comprises an inverted-F antenna and the portion of the peripheral conductive housing structures that forms at least part of the antenna forms an antenna resonating element for the inverted-F antenna.\",\n \"8.The electronic device defined in claim 1, wherein the electronic device has a length, a width that is less than the length, and a height that is less than the width, and the peripheral conductive housing structures extend across the height of the electronic device.\",\n \"9.The electronic device defined in claim 8, wherein the peripheral conductive housing structures extend across the length and the width of the electronic device.\",\n \"10.The electronic device defined in claim 1, wherein the antenna feed comprises a signal feed terminal coupled to the portion of the peripheral conductive housing structures and a ground feed terminal coupled to the ground plane structures.\",\n \"11.An electronic device having a periphery and opposing first and second faces, the electronic device comprising: ground plane structures; peripheral conductive housing structures that run along the periphery of the electronic device and surround the ground plane structures; a dielectric-filled gap in the peripheral conductive housing structures that divides the peripheral conductive housing structures into first and second segments, wherein the second segment is separated from the ground plane structures by a dielectric-filled opening, the dielectric-filled gap having a first end at the dielectric-filled opening and a second end at the first face of the electronic device; and an antenna formed from at least the second segment and the ground plane structures.\",\n \"12.The electronic device defined in claim 11, wherein the first segment is coupled to the ground plane structures.\",\n \"13.The electronic device defined in claim 12, wherein the ground plane structures comprise a conductive housing wall on the second face of the electronic device.\",\n \"14.The electronic device defined in claim 13, further comprising a display on the first face of the electronic device.\",\n \"15.The electronic device defined in claim 11, further comprising: an additional dielectric-filled gap in the peripheral conductive housing structures that separates the second segment from a third segment of the peripheral conductive housing structures, the additional dielectric-filled gap having a first end at the dielectric-filled opening and a second end at the first face of the electronic device.\",\n \"16.The electronic device defined in claim 11, wherein the antenna comprises an antenna feed having a first feed terminal coupled to the ground plane structures and a second feed terminal coupled to the second segment.\",\n \"17.The electronic device defined in claim 11, further comprising: an adjustable electrical component coupled to the second segment; and storage and processing circuitry configured to provide a control signal to a control input of the adjustable electronic component that tunes a frequency response of the antenna.\",\n \"18.An electronic device having a periphery, a length, a width that is less than the length, and a height that is less than the width, comprising: ground plane structures; peripheral conductive housing structures that surround the ground plane structures, wherein the peripheral conductive housing structures comprise a first sidewall extending across the width of the electronic device, a second sidewall extending from a first end of the first sidewall along the length of the electronic device, and a third sidewall extending from a second end of the first sidewall along the length of the electronic device; a dielectric-filled opening having a first portion extending from the second sidewall to the third sidewall and having a second portion that extends from an end of the first portion and that is interposed between the second sidewall and a portion of the ground plane structures, wherein the portion of the ground plane structures is interposed between the second portion of the dielectric-filled opening and the third sidewall; and an antenna that includes a portion of the peripheral conductive housing structures.\",\n \"19.The electronic device defined in claim 18, further comprising: an adjustable electronic component that bridges the second portion of the dielectric filled opening and that is configured to tune a frequency response of the antenna.\",\n \"20.The electronic device defined in claim 18, wherein the peripheral conductive housing structures extend across the height of the electronic device and include a fourth sidewall that extends between the second and third sidewalls, and the ground plane structures include an additional portion that extends from the second sidewall to the third sidewall.\"\n ],\n [\n \" BACKGROUND This relates generally to wireless communications circuitry, and more particularly, to electronic devices that have tunable antenna systems.\",\n \"Electronic devices such as computers and handheld electronic devices are often provided with wireless communications capabilities.\",\n \"For example, electronic devices may use long-range wireless communications circuitry such as cellular telephone circuitry to communicate using cellular telephone bands.\",\n \"Electronic devices may use short-range wireless communications links to handle communications with nearby equipment.\",\n \"For example, electronic devices may communicate using the WiFi® (IEEE 802.11) bands at 2.4 GHz and 5 GHz and the Bluetooth® band at 2.4 GHz.\",\n \"To satisfy consumer demand for small form factor wireless devices, manufacturers are continually striving to implement wireless communications circuitry such as antenna components using compact structures.\",\n \"However, it can be difficult to fit conventional antenna structures into small devices.\",\n \"For example, antennas that are confined to small volumes often exhibit narrower operating bandwidths than antennas that are implemented in larger volumes.\",\n \"If the bandwidth of an antenna becomes too small, the antenna will not be able to cover all communications bands of interest.\",\n \"In view of these considerations, it would be desirable to provide improved wireless circuitry for electronic devices.\"\n ],\n [\n \" SUMMARY An electronic device may be provided with wireless communications circuitry including an adjustable antenna system coupled to a radio-frequency transceiver.\",\n \"The adjustable antenna system may include one or more adjustable electrical components that are controlled by storage and processing circuitry in the electronic device.\",\n \"By adjusting the adjustable electrical components, the storage and processing circuitry can tune the adjustable antenna system to ensure that the adjustable antenna system satisfactorily covers communications bands of interest.\",\n \"The adjustable electrical components may include switches that can be placed in open or closed positions.\",\n \"The adjustable electrical components may also include components that can be continuously or semicontinuously adjusted to produce various resistances, capacitances, and inductances.\",\n \"Antenna system adjustments may be made to transmission line structures, matching networks, antenna resonating elements, antenna grounds, and antenna feeds.\",\n \"An antenna may have portions that are formed from conductive electronic device housings.\",\n \"An electronic device may have a rectangular periphery.\",\n \"A conductive peripheral member such as a display bezel or housing sidewall member may surround the periphery of the housing.\",\n \"One or more dielectric gaps may be interposed in the conductive peripheral member.\",\n \"The adjustable electrical components may be used to bridge the gaps.\",\n \"Control signals may be applied to the adjustable electrical components to adjust the size of the gap and other antenna system parameters and thereby tune the antenna system.\",\n \"Further features of the invention, its nature and various advantages will be more apparent from the accompanying drawings and the following detailed description of the preferred embodiments.\"\n ],\n [\n \"This application is a continuation of patent application Ser.\",\n \"No.\",\n \"14/737,394, filed Jun.\",\n \"11, 2015, which is a continuation of patent application Ser.\",\n \"No.\",\n \"12/831,180, filed Jul.\",\n \"6, 2010, now U.S. Pat.\",\n \"No.\",\n \"9,070,969, which is hereby incorporated by reference herein in its entirety.\",\n \"This application claims the benefit of and claims priority to patent application Ser.\",\n \"No.\",\n \"14/737,394, filed Jun.\",\n \"11, 2015 and patent application Ser.\",\n \"No.\",\n \"12/831,180, filed Jul.\",\n \"6, 2010, now U.S. Pat.\",\n \"No.\",\n \"9,070,969.BACKGROUND This relates generally to wireless communications circuitry, and more particularly, to electronic devices that have tunable antenna systems.\",\n \"Electronic devices such as computers and handheld electronic devices are often provided with wireless communications capabilities.\",\n \"For example, electronic devices may use long-range wireless communications circuitry such as cellular telephone circuitry to communicate using cellular telephone bands.\",\n \"Electronic devices may use short-range wireless communications links to handle communications with nearby equipment.\",\n \"For example, electronic devices may communicate using the WiFi® (IEEE 802.11) bands at 2.4 GHz and 5 GHz and the Bluetooth® band at 2.4 GHz.\",\n \"To satisfy consumer demand for small form factor wireless devices, manufacturers are continually striving to implement wireless communications circuitry such as antenna components using compact structures.\",\n \"However, it can be difficult to fit conventional antenna structures into small devices.\",\n \"For example, antennas that are confined to small volumes often exhibit narrower operating bandwidths than antennas that are implemented in larger volumes.\",\n \"If the bandwidth of an antenna becomes too small, the antenna will not be able to cover all communications bands of interest.\",\n \"In view of these considerations, it would be desirable to provide improved wireless circuitry for electronic devices.\",\n \"SUMMARY An electronic device may be provided with wireless communications circuitry including an adjustable antenna system coupled to a radio-frequency transceiver.\",\n \"The adjustable antenna system may include one or more adjustable electrical components that are controlled by storage and processing circuitry in the electronic device.\",\n \"By adjusting the adjustable electrical components, the storage and processing circuitry can tune the adjustable antenna system to ensure that the adjustable antenna system satisfactorily covers communications bands of interest.\",\n \"The adjustable electrical components may include switches that can be placed in open or closed positions.\",\n \"The adjustable electrical components may also include components that can be continuously or semicontinuously adjusted to produce various resistances, capacitances, and inductances.\",\n \"Antenna system adjustments may be made to transmission line structures, matching networks, antenna resonating elements, antenna grounds, and antenna feeds.\",\n \"An antenna may have portions that are formed from conductive electronic device housings.\",\n \"An electronic device may have a rectangular periphery.\",\n \"A conductive peripheral member such as a display bezel or housing sidewall member may surround the periphery of the housing.\",\n \"One or more dielectric gaps may be interposed in the conductive peripheral member.\",\n \"The adjustable electrical components may be used to bridge the gaps.\",\n \"Control signals may be applied to the adjustable electrical components to adjust the size of the gap and other antenna system parameters and thereby tune the antenna system.\",\n \"Further features of the invention, its nature and various advantages will be more apparent from the accompanying drawings and the following detailed description of the preferred embodiments.\",\n \"BRIEF DESCRIPTION OF THE DRAWINGS FIG.\",\n \"1 is a perspective view of an illustrative electronic device with wireless communications circuitry in accordance with an embodiment of the present invention.\",\n \"FIG.\",\n \"2 is a schematic diagram of an illustrative electronic device with wireless communications circuitry in accordance with an embodiment of the present invention.\",\n \"FIG.\",\n \"3 is circuit diagram of illustrative wireless communications circuitry having fixed and adjustable antenna structures in an electronic device in accordance with an embodiment of the present invention.\",\n \"FIG.\",\n \"4 is a graph showing how antenna structures can be adjusted during operation to cover communications bands of interest in accordance with an embodiment of the present invention.\",\n \"FIG.\",\n \"5 is a graph showing how antenna structures can be adjusted during operation to fine tune antenna response during operation in accordance with an embodiment of the present invention.\",\n \"FIG.\",\n \"6 is a diagram of wireless communications circuitry in an electronic device showing how a transceiver circuit may feed an antenna using a transmission line and a matching network in accordance with an embodiment of the present invention.\",\n \"FIG.\",\n \"7 is a diagram of an illustrative antenna that may be used in wireless communications circuitry in an electronic device in accordance with an embodiment of the present invention.\",\n \"FIG.\",\n \"8 is a diagram of showing how wireless circuit components such as antenna system structures may be coupled using an adjustable electrical component in accordance with an embodiment of the present invention.\",\n \"FIG.\",\n \"9 is a diagram of showing how wireless circuit components such as antenna system structures may be coupled using an adjustable electrical component such as a switch in accordance with an embodiment of the present invention.\",\n \"FIG.\",\n \"10 is a diagram of showing how wireless circuit components such as antenna system structures may be coupled using an adjustable electrical component such as a circuit element with continuously or semicontinuously tunable electrical properties in accordance with an embodiment of the present invention.\",\n \"FIG.\",\n \"11 is a diagram of showing how wireless circuit components such as antenna system structures may be coupled using an adjustable electrical component such as a tunable capacitor with a continuously or semicontinuously tunable capacitance in accordance with an embodiment of the present invention.\",\n \"FIG.\",\n \"12 is a diagram of showing how wireless circuit components such as antenna system structures may be coupled using an adjustable electrical component such as semicontinuously a tunable electrical network with switches that provide the network with multiple selectable impedance values in accordance with an embodiment of the present invention.\",\n \"FIG.\",\n \"13 is a circuit diagram of an adjustable antenna system in an electronic device in accordance with an embodiment of the present invention.\",\n \"FIG.\",\n \"14 is a diagram of an adjustable antenna system in an electronic device showing how the antenna system may be adjusted by adjusting transmission line loading in accordance with an embodiment of the present invention.\",\n \"FIG.\",\n \"15 is an interior perspective view of an illustrative electronic device having a peripheral conductive member and an internal planar conductive member showing how an adjustable electrical component may bridge gaps in the peripheral conductive member in accordance with an embodiment of the present invention.\",\n \"FIG.\",\n \"16 is a perspective view of an interior portion of a peripheral conductive electronic device housing member showing how adjustable electrical components may be bridge gaps in the peripheral conductive member in accordance with an embodiment of the present invention.\",\n \"FIG.\",\n \"17 is a top view of an electronic device showing how an adjustable electrical component may be used to connect different parts of an internal planar conductive member in accordance with an embodiment of the present invention.\",\n \"FIG.\",\n \"18 is a diagram of an illustrative antenna in which an adjustable electrical component has been used to couple different parts of an antenna ground plane element in accordance with an embodiment of the present invention.\",\n \"FIG.\",\n \"19 is a diagram of an illustrative electronic device having a conductive peripheral housing member and an internal planar structure with multiple regions that have been coupled using an adjustable electrical component in accordance with an embodiment of the present invention.\",\n \"FIG.\",\n \"20 is a perspective view of an illustrative radio-frequency transceiver circuit that has been mounted to a rigid printed circuit board and that has been coupled to a flex circuit on which conductive antenna structures are coupled to conductive flex traces and an optional flex-mounted component by an adjustable electrical component in accordance with an embodiment of the present invention.\",\n \"FIG.\",\n \"21 is a diagram of an adjustable antenna system in which a component with conductive structures such as a flex circuit on which a camera or other device structure has been mounted may be coupled to portions of an antenna using adjustable electrical components in accordance with an embodiment of the present invention.\",\n \"FIG.\",\n \"22 is an exploded perspective view of an illustrative electronic device having components such as a radio-frequency transceiver circuit that uses an adjustable antenna system that includes conductive frame members and an adjustable electrical component in accordance with an embodiment of the present invention.\",\n \"FIG.\",\n \"23 is a top view of an illustrative electronic device showing how an adjustable antenna system may be formed using an adjustable electrical component that couples a conductive peripheral housing member to a conductive planar internal housing member in accordance with an embodiment of the present invention.\",\n \"FIG.\",\n \"24 is a flow chart of illustrative steps involved in operating an electronic device with an adjustable antenna system in accordance with an embodiment of the present invention.\",\n \"DETAILED DESCRIPTION Electronic devices such as device 10 of FIG.\",\n \"1 may be provided with wireless communications circuitry.\",\n \"The wireless communications circuitry may be used to support wireless communications such as long-range wireless communications (e.g., communications in cellular telephone bands) and short-range communications (i.e., local area network links such as WiFi® links, Bluetooth® links, etc.).\",\n \"The wireless communications circuitry may include one or more antennas.\",\n \"The antennas and associated wireless communications circuits within the electronic devices may be adjustable.\",\n \"Adjustable antenna systems may be tuned to adjust antenna response within a band (i.e., the antenna systems may be fine tuned).\",\n \"Fine tuning may be used to ensure that signals in a desired communications band are received properly.\",\n \"Adjustable antenna systems may also be tuned so that an antenna response curve that would otherwise only cover a single band or group of bands can be used to cover additional frequencies of interests (i.e., the antenna systems may be coarsely tuned to cover a different band or group of bands).\",\n \"Coarse tuning may allow relatively narrow bandwidth antennas to be tuned to cover communications bands over a relatively wide range of frequencies.\",\n \"Any suitable electronic devices (e.g., device 10 of FIG.\",\n \"1) may be provided with adjustable antenna systems that have these types of fine and coarse tuning capabilities.\",\n \"For example, adjustable antenna systems may be used in electronic devices such as desktop computers, game consoles, routers, laptop computers, computers embedded in a computer monitor or television, computers that are part of set-top boxes or other consumer electronics equipment, relatively compact electronic devices such as portable electronic devices, etc.\",\n \"The use of portable electronic devices is sometimes described herein as an example.\",\n \"This is, however, merely illustrative.\",\n \"Adjustable antenna systems may be used in any electronic device.\",\n \"Electronic devices such as illustrative electronic device 10 of FIG.\",\n \"1 may be laptop computers, tablet computers, cellular telephones, media players, other handheld and portable electronic devices, smaller devices such as wrist-watch devices, pendant devices, headphone and earpiece devices, other wearable and miniature devices, or other electronic equipment.\",\n \"As shown in FIG.\",\n \"1, device 10 includes housing 12.Housing 12, which is sometimes referred to as a case, may be formed of materials such as plastic, glass, ceramics, carbon-fiber composites and other composites, metal, other materials, or a combination of these materials.\",\n \"Device 10 may be formed using a unibody construction in which most or all of housing 12 is formed from a single structural element (e.g., a piece of machined metal or a piece of molded plastic) or may be formed from multiple housing structures (e.g., outer housing structures that have been mounted to internal frame elements or other internal housing structures).\",\n \"Device 10 may, if desired, have a display such as display 14.Display 14 may, for example, be a touch screen that incorporates capacitive touch electrodes.\",\n \"Display 14 may include image pixels formed from light-emitting diodes (LEDs), organic LEDs (OLEDs), plasma cells, electronic ink elements, liquid crystal display (LCD) components, or other suitable image pixel structures.\",\n \"A cover glass member may cover the surface of display 14.Buttons such as button 16 may pass through openings in the cover glass.\",\n \"Openings may also be formed in the cover glass of display 14 to form a speaker port such as speaker port 18.Openings in housing 12 may be used to form input-output ports, microphone ports, speaker ports, button openings, etc.\",\n \"Wireless communications circuitry in device 10 may be used to form remote and local wireless links.\",\n \"One or more antennas may be used during wireless communications.\",\n \"Single band and multiband antennas may be used.\",\n \"For example, a single band antenna may be used to handle Bluetooth® communications at 2.4 GHz (as an example).\",\n \"As another example, a multiband antenna may be used to handle cellular telephone communications in multiple cellular telephone bands.\",\n \"Other types of communications links may also be supported using single-band and multiband antennas.\",\n \"If desired, device 10 may use multiple antennas.\",\n \"Multiple antennas may, for example, be used to support an antenna diversity scheme.\",\n \"With an antenna diversity scheme, control circuitry in device 10 may monitor signal quality or sensor data to determine which antenna or antennas are performing best or are otherwise desirable to use (e.g., to satisfy regulatory limits).\",\n \"Based on these considerations, the control circuitry may then choose to use only a subset of the antennas or may otherwise adjust antenna use.\",\n \"If, for example, a sensor or a signal quality measurement determines that one of two antennas in an antenna diversity arrangement has become blocked by an external object such as part of a human body, the control circuitry may temporarily inactivate that antenna.\",\n \"Device 10 may also use multiple antennas to implement a multiple-input-multiple-output (MIMO) communications protocol.\",\n \"In a MIMO scheme, each of the antennas in a system may handle an independent data stream, allowing overall data throughput to be increased.\",\n \"The control circuitry in device 10 may use proximity data or other data to control operation of the multiple antennas in the MIMO setup.\",\n \"For example, the control circuitry may temporarily switch from MIMO operation to a protocol that uses only a single antenna or may switch from a four-antenna MIMO scheme to a two-antenna MIMO scheme, etc.\",\n \"Antennas may be located at any suitable locations in device 10.For example, one antenna may be located in an upper region such as region 22 and another antenna may be located in a lower region such as region 20.In a larger device, antennas may be located along device edges, in the center of a rear planar housing portion, in device corners, etc.\",\n \"Antennas in device 10 may be used to support any communications bands of interest.\",\n \"For example, device 10 may include antenna structures for supporting local area network communications (e.g., IEEE 802.11 communications at 2.4 GHz and 5 GHz for wireless local area networks), signals at 2.4 GHz such as Bluetooth® signals, voice and data cellular telephone communications (e.g., cellular signals in bands at frequencies such as 850 MHz, 900 MHz, 1800 MHz, 1900 MHz, 2100 MHz, etc.\",\n \"), global positioning system (GPS) communications at 1575 MHz, signals at 60 GHz (e.g., for short-range links), etc.\",\n \"Different antennas may handle different bands or a communications band or group of bands may be handled using a shared antenna.\",\n \"One antenna in device 10 may, for example, be used in handling voice and data communications in one or more cellular telephone bands, whereas another antenna in device 10 may provide coverage in a first band for handling Global Positioning System (GPS) signals at 1575 MHz and a second band for handling Bluetooth® and IEEE 802.11 (wireless local area network) signals at 2.4 GHz (as examples).\",\n \"Additional antennas may be provided to implement antenna diversity schemes, phased antenna arrays (e.g., at 60 GHz), additional bands, etc.\",\n \"A schematic diagram showing illustrative components that may be used in device 10 of FIG.\",\n \"1 is shown in FIG.\",\n \"2.As shown in FIG.\",\n \"2, device 10 may include storage and processing circuitry 28.Storage and processing circuitry 28 may include storage such as hard disk drive storage, nonvolatile memory (e.g., flash memory or other electrically-programmable-read-only memory configured to form a solid state drive), volatile memory (e.g., static or dynamic random-access-memory), etc.\",\n \"Processing circuitry in storage and processing circuitry 28 may be used to control the operation of device 10.This processing circuitry may be based on one or more microprocessors, microcontrollers, digital signal processors, application specific integrated circuits, etc.\",\n \"Storage and processing circuitry 28 may be used to run software on device 10, such as internet browsing applications, voice-over-internet-protocol (VOIP) telephone call applications, email applications, media playback applications, operating system functions, etc.\",\n \"To support interactions with external equipment, storage and processing circuitry 28 may be used in implementing communications protocols.\",\n \"Communications protocols that may be implemented using storage and processing circuitry 28 include internet protocols, wireless local area network protocols (e.g., IEEE 802.11 protocols—sometimes referred to as WiFi®), protocols for other short-range wireless communications links such as the Bluetooth® protocol, cellular telephone protocols, MIMO protocols, antenna diversity protocols, etc.\",\n \"Antenna system tuning operations may be controlled using software stored and running on device 10 (i.e., stored and running on storage and processing circuitry 28 and/or input-output circuitry 30).\",\n \"Input-output circuitry 30 may include input-output devices 32.Input-output devices 32 may be used to allow data to be supplied to device 10 and to allow data to be provided from device 10 to external devices.\",\n \"Input-output devices 32 may include user interface devices, data port devices, and other input-output components.\",\n \"For example, input-output devices may include touch screens, displays without touch sensor capabilities, buttons, joysticks, click wheels, scrolling wheels, touch pads, key pads, keyboards, microphones, cameras, buttons, speakers, status indicators, light sources, audio jacks and other audio port components, digital data port devices, light sensors, motion sensors (accelerometers), capacitance sensors, proximity sensors, etc.\",\n \"Input-output circuitry 30 may include wireless communications circuitry 34 for communicating wirelessly with external equipment.\",\n \"Wireless communications circuitry 34 may include radio-frequency (RF) transceiver circuitry formed from one or more integrated circuits, power amplifier circuitry, low-noise input amplifiers, passive RF components, one or more antennas, transmission lines, and other circuitry for handling RF wireless signals.\",\n \"Wireless signals can also be sent using light (e.g., using infrared communications).\",\n \"Wireless communications circuitry 34 may include radio-frequency transceiver circuitry 90 for handling various radio-frequency communications bands.\",\n \"For example, circuitry 34 may include transceiver circuitry 36, 38, and 42.Transceiver circuitry 36 may handle 2.4 GHz and 5 GHz bands for WiFi® (IEEE 802.11) communications and may handle the 2.4 GHz Bluetooth® communications band.\",\n \"Circuitry 34 may use cellular telephone transceiver circuitry 38 for handling wireless communications in cellular telephone bands at 850 MHz, 900 MHz, 1800 MHz, 1900 MHz, and 2100 MHz data band (as examples).\",\n \"Circuitry 38 may handle voice data and non-voice data.\",\n \"Wireless communications circuitry 34 can include circuitry for other short-range and long-range wireless links if desired.\",\n \"For example, wireless communications circuitry 34 may include 60 GHz transceiver circuitry, circuitry for receiving television and radio signals, paging system transceivers, etc.\",\n \"Wireless communications circuitry 34 may include global positioning system (GPS) receiver equipment such as GPS receiver circuitry 42 for receiving GPS signals at 1575 MHz or for handling other satellite positioning data.\",\n \"In WiFi® and Bluetooth® links and other short-range wireless links, wireless signals are typically used to convey data over tens or hundreds of feet.\",\n \"In cellular telephone links and other long-range links, wireless signals are typically used to convey data over thousands of feet or miles.\",\n \"Wireless communications circuitry 34 may include antennas 40.Antennas 40 may be formed using any suitable antenna types.\",\n \"For example, antennas 40 may include antennas with resonating elements that are formed from loop antenna structure, patch antenna structures, inverted-F antenna structures, slot antenna structures, planar inverted-F antenna structures, helical antenna structures, hybrids of these designs, etc.\",\n \"Different types of antennas may be used for different bands and combinations of bands.\",\n \"For example, one type of antenna may be used in forming a local wireless link antenna and another type of antenna may be used in forming a remote wireless link antenna.\",\n \"With one suitable arrangement, device 10 may have antennas in regions of device 10 such as upper region 22 and lower region 20.One or more upper antennas for device 10 may be formed in region 22.One or more lower antennas for device 10 may be formed in region 20.In devices with other form factors such as laptop and tablet computers, wearable devices, computer monitors with integrated computers, etc., antennas may be located in other suitable regions (e.g., at the four corners of a rectangular device, on front and back surfaces, along edge regions of a device, in one or more arrays, etc.).\",\n \"As shown in FIG.\",\n \"3, transceiver circuitry 90 may be coupled to antennas 40 using transmission lines 140.Device 10 may have antennas 40 that include both fixed antenna structures (e.g., fixed antenna structures 40A) and adjustable antenna structures (e.g., adjustable antenna structures 40B).\",\n \"A configuration that includes both fixed and adjustable antennas may be used, for example, when there is sufficient space available for only one broadband antenna.\",\n \"In this type of arrangement, fixed antenna structures 40A may use a broadband design that covers multiple communications bands, whereas adjustable structures 40B may use a narrowband design that achieves multiband coverage through use of coarse antenna system tuning.\",\n \"Other configurations may also be used.\",\n \"For example, device 10 may be provided exclusively with adjustable antenna structures.\",\n \"In general, any suitable number of adjustable antennas may be provided in device 10 (e.g., one adjustable antenna, two adjustable antennas, three adjustable antennas, four or more adjustable antennas, etc.).\",\n \"When device 10 includes an adjustable antenna system (i.e., when antennas 40 and associated wireless circuitry 34 in device 10 is adjustable), antenna performance can be altered in real time.\",\n \"For example, the resonance curve of the antenna system may be slightly altered to compensate for environmental factors such as temperature changes.\",\n \"Relatively small adjustments to the frequency response of an antenna system are sometimes referred to as fine tuning adjustments or fine tuning.\",\n \"If desired, the frequency response of the antenna system can be adjusted by larger amounts.\",\n \"For example, the frequency response of an antenna may be altered sufficiently to cause the antenna to cover different communications bands.\",\n \"A standing wave ratio (SWR) versus frequency plot for an illustrative antenna system in device 10 is shown in FIG.\",\n \"4.In the FIG.\",\n \"4 example, the antenna system operates in two modes.\",\n \"In a first mode of operation, the antenna system is characterized by a frequency response of the type illustrated by solid line 142.As shown in FIG.\",\n \"4, this frequency response allows the antenna system to cover two communications bands (i.e., a first communications band centered at frequency fa and a second communications band centered at frequency fb).\",\n \"In a second mode of operation, the antenna system is characterized by a frequency response of the type illustrated by dashed line 144.When operating in the second mode of operation, the antenna system may cover one communications band at frequency fc and another communications band at frequency fd.\",\n \"Frequency bands fa and fb may be, for example, 850 MHz and 900 MHz frequency bands, whereas frequency bands fc and fd may be, for example, 1900 MHz and 2100 MHz frequency bands (as examples).\",\n \"During operation of device 10, device 10 can determine which communications bands are to be used and can adjust the adjustable antenna system accordingly (i.e., to cover the frequency range associated with curve 142 or to cover the frequency range associated with curve 144).\",\n \"If desired, device 10 may include a fixed antenna such as the fixed antenna of FIG.\",\n \"3 that covers both low bands (fa and fb) and high bands (fc and fd).\",\n \"As described in connection with FIG.\",\n \"4, device 10 may also have an adjustable antenna system that is adjusted between the first and second modes to selectively cover the same bands that are covered by the fixed antenna.\",\n \"An illustrative fine tuning operation using an adjustable antenna system in device 10 is shown in FIG.\",\n \"5.As shown in FIG.\",\n \"5, the adjustable antenna system may initially exhibit a frequency response of the type shown by solid line 146.Due to changes in operating temperature or other effects, the frequency response of the antenna may need to be adjusted to ensure that signals are properly received and transmitted.\",\n \"This can be accomplished by adjusting the adjustable antenna system in device 10 so that its frequency response shifts slightly to the frequency response shown by dashed line 148 (i.e., a frequency shift of Δf).\",\n \"Real time adjustments such as the fine tuning adjustments of FIG.\",\n \"5 and the coarse tuning adjustments of FIG.\",\n \"4 may be made to ensure that device 10 performs as desired under a variety of wireless traffic and environmental scenarios.\",\n \"FIG.\",\n \"6 shows illustrative components that may be included in an adjustable antenna system in electronic device 10.As shown in FIG.\",\n \"6, radio-frequency signals may be generated and received by radio-frequency transceiver circuitry 90.Circuitry 90 may include radio-frequency transmitters for transmitting radio-frequency signals and radio-frequency receivers for receiving radio-frequency signals.\",\n \"Radio-frequency amplifier circuitry and other components (e.g., switches) may be included in transceiver circuit block 90.Adjustable antenna system 150 may include antennas 40, matching network 152, and transmission line 140.Antenna 40 may be include antenna ground structures and antenna resonating element structures such as loop antenna structures, patch antenna structures, inverted-F antenna structures, slot antenna structures, planar inverted-F antenna structures, helical antenna structures, hybrids of these designs, etc.\",\n \"Transmission line 140 may be coupled to transceiver circuitry 90.Transmission line 140 may be based on a microstrip transmission line structure, a stripline transmission line structure, an edge coupled microstrip transmission line structure, an edge coupled stripline transmission line structure, transmission line structures formed on flexible printed circuits (“flex circuits”), structures formed on rigid printed circuit boards, a coaxial cable, other suitable transmission line structures, or combinations of these structures.\",\n \"Matching network 152 may be used to help match the impedance of transmission line 140 to the impedance of antenna 40.Matching network 152 may include electrical components such as resistors, inductors, and capacitors, and conductive traces, pieces of metal, and other structures that have associated resistances, inductances, and capacitances.\",\n \"Although shown as being interposed between transmission line 140 and antenna 40 in the example of FIG.\",\n \"6, matching network components may, if desired, be interposed within transmission line 90 and/or within antenna 40.The arrangement of FIG.\",\n \"6 is merely illustrative.\",\n \"Antenna 40 may be fed using an antenna feed such as an antenna feed formed from positive antenna feed terminal 156 and ground antenna feed terminal 158.To provide antenna system 150 with adjustability, antenna system 150 may be provided with one or more adjustable electrical components.\",\n \"These components may be incorporated into antenna 40 (including the antenna feed), matching network 152, and transmission line 140.FIG.\",\n \"7 is a diagram of an illustrative antenna.\",\n \"In the FIG.\",\n \"7 example, antenna 40 has an inverted-F configuration.\",\n \"This is, however, merely illustrative.\",\n \"Antenna 40 may be formed using any suitable antenna design.\",\n \"As shown in FIG.\",\n \"7, antenna 40 may include an antenna ground (e.g., antenna ground element 160) and an antenna resonating element (antenna resonating element 162).\",\n \"Antenna ground 160 and antenna resonating element 162 may be formed from conductive structures such as pieces of metal, metal traces on printed circuit boards, parts of an electronic device housing, conductive components, and other conductive elements in device 10.Antenna ground element 160 may be formed from one conductive structure or multiple conductive structures.\",\n \"Antenna resonating element 162 may have a main resonating element branch such as branch 164 and additional branches.\",\n \"Segment 166 of resonating element 162 may short arm 164 to ground 160.Transceiver 90 may be coupled to antenna feed terminals 156 and 158.Matching network components and transmission line structures are not shown in FIG.\",\n \"7 to avoid over-complicating the drawing.\",\n \"Antenna 40 and the other structures of antenna system 150 may be provided with adjustable electrical components such as switches and continuously and semicontinuously tunable electrical components.\",\n \"For example, an adjustable electrical component may be coupled between portions of antenna resonating element arm 164 or between portions of ground plane 160 in an antenna of the type shown in FIG.\",\n \"4.Adjustable electrical components may also be incorporated into matching network 152 or transmission line 140 of FIG.\",\n \"6.The antenna feed for antenna 40 may be adjusted using adjustable electrical components (e.g., adjustable electrical components coupled to feed terminals).\",\n \"The use of an adjustable electrical component to make adjustments to adjustable antenna system 150 is illustrated in FIG.\",\n \"8.As shown in FIG.\",\n \"8, adjustable antenna system 150 may include adjustable antenna system portions 150A and 150B.\",\n \"Portions 150A and 150B may be antenna resonating element structures, antenna ground element structures, parasitic antenna structures (e.g., antenna structures that are near-field coupled to other antenna structures) antenna feed structures, other antenna structures, matching network structures, transmission line structures (e.g., a transmission line stub), other antenna system structures, or any combination of these structures.\",\n \"Adjustable electrical component 168 may have a first terminal such as terminal 170 that is connected to antenna system portion 150A and a second terminal such as terminal 172 that is connected to antenna system portion 150B.\",\n \"Adjustable electrical component 168 may be adjusted using control signals applied to control input 174 or may be implemented using a two-terminal arrangement in which control signals are applied over terminals 170 and 172.Examples of adjustable electrical components that may be used for adjustable electrical component 168 include switches, variable resistors, variable capacitors, variable inductors, and components that control multiple electrical parameters.\",\n \"FIG.\",\n \"9 shows how adjustable electrical component 168 may be implemented using a switch.\",\n \"Switch 168 of FIG.\",\n \"9 may be placed in an open state in which antenna system portion 150A is electrically isolated from antenna system portion 150B or may be placed in a closed state in which terminals 170 and 172 are shorted together so that portions 150A and 150B are electrically connected.\",\n \"Switch 168 may be implemented using a gallium arsenide field-effect transistor (FET), a microelectromechanical systems (MEMs) switch, a metal-oxide-semiconductor field-effect transistor (MOSFET), a p-i-n diode, a high-electron mobility transistor (HEMT), a pseudomorphic HEMT (PHEMT), a transistor formed on a silicon-on-insulator (SOI) substrate, etc.\",\n \"As shown in FIG.\",\n \"10, adjustable electrical component 168 may be implemented using a component that can be placed in numerous different states (e.g., a component that is continuously variable or that is semicontinuously variable and can be placed in one of a number of different discrete states).\",\n \"Component 168 may be, for example, a continuously variable capacitor, a semicontinuously adjustable capacitor that has 2-100 or more different capacitance values, a continuously variable resistor, a semicontinuously adjustable resistor that has 2-100 or more different resistance values, a continuously variable inductor, or a semicontinuously adjustable inductor that has 2-100 or more different inductance values.\",\n \"FIG.\",\n \"11 shows, for example, how adjustable electrical component 168 may include a continuously variable capacitor.\",\n \"Semicontinuously adjustable components may be implemented using arrays of discrete components and switches configured to serve as multiplexers.\",\n \"If desired, adjustable electrical component 168 may be formed from other adjustable electrical components.\",\n \"As shown in FIG.\",\n \"12, for example, semicontinuously adjustable electrical component 168 may be formed from an electrical network that includes inductors such as inductors L1 and L2.Switches (e.g., switches SWA and SWB in the FIG.\",\n \"12 example) may be used to form desired patterns of electrical connections within the electrical network.\",\n \"For example, components may be switched into or out of use or may be interconnected in different ways.\",\n \"In the FIG.\",\n \"12 example, the inductance that is exhibited between terminals 170 and 172 may be adjusted by opening and closing switches SWA and SWB in various patterns.\",\n \"Networks with other patterns of electrical components (e.g., capacitors, resistors, inductors, and conductive and dielectric structures that have capacitance, inductance, and resistance and that serve as capacitors, resistors, and inductors), other patterns of switches or continuously or semicontinuously adjustable components may also be used in implementing adjustable electrical component 168.The example of FIG.\",\n \"12 is merely illustrative.\",\n \"An illustrative adjustable antenna system 150 that is based on an inverted-F antenna such as antenna 40 of FIG.\",\n \"7 is shown in FIG.\",\n \"13.Main resonating element arm 164 of antenna 40 may be connected to ground 160 through a short circuit path such as path 132A (if switch 176 is closed and switch 178 is open) or path 132B (if switch 176 is open and switch 178 is closed).\",\n \"A feed path (see, e.g., terminals 158 and 108), and one or more optional paths such as the path formed by adjustable electrical component 120 (e.g., a switch), the path formed by element 122 (e.g., a semicontinuously or continuously adjustable component), and the path formed by adjustable electrical components 124 and 126 (e.g., a switch and a continuously adjustable component, respectively).\",\n \"Optional antenna resonating element branches such as branch 130 may be coupled to antenna 40 (e.g., by connecting branch 130 to main resonating element arm 164 through adjustable electrical component 128).\",\n \"Antenna 40 may be feed by transceiver 90 (i.e., transceiver circuitry such as transceiver circuitry 90 of FIG.\",\n \"2).\",\n \"Transmission line 140 may have paths such as positive antenna signal paths 94 and 104 and ground antenna signal paths such as paths 92 and 106 and may be used to convey radio-frequency antenna signals between transceiver 90 and antenna 40.Matching circuitry 152 may be interposed in the path between transceiver 90 and antenna 40.Matching circuitry 152 may include series-connected and shunt-connected adjustable electrical components such as components 102 and 100.One or more adjustable electrical components such as components 100 and 102 may be coupled between transmission line 140 and additional transmission line components and other electrical components.\",\n \"For example, a component such as a transmission line stub (e.g., transmission line stub 140′), may be coupled to transmission line 140 via component 100.Any of the adjustable electrical components used in adjustable antenna system 150 may include transmission line structures, if desired.\",\n \"Transmission line paths such as positive transmission line path 104 and ground transmission line path 106 may be used to interconnect matching circuitry 152 to the antenna feed of antenna 40.The antenna feed may have a fixed or tunable configuration.\",\n \"In the example of FIG.\",\n \"13, the antenna feed for antenna 40 is tunable between a first antenna feed configuration in which switch 118 (or other such adjustable electrical component) has a first position and a second antenna feed configuration in which switch 118 has a second position.\",\n \"When switch 118 is in its first position, terminal 108 is connected to terminal 156A, so that terminal 156A serves as the positive antenna feed terminal for antenna 40.When switch 118 is in its second position, terminal 108 is connected to terminal 156B, so that terminal 156B serves as the positive antenna feed terminal for antenna 40.Feed terminals 156A and 156B are located at different positions along the length of main resonating element arm 164, so the impedance and therefore the frequency response of antenna 40 can be adjusted by using switch 118 to control the feed location in antenna 40.The arrangement of FIG.\",\n \"13 is merely illustrative.\",\n \"In general, antennas such as antenna 40 in device 10 may have tunable feeds formed from two or more feed points, tunable feeds that involve one, two, three, or more than three switches, feeds that are tuned by adjusting the ground antenna feed and/or the positive antenna feed, non-tunable feeds, etc.\",\n \"By incorporating adjustable electronic components into antenna 40 (e.g., antenna resonating element 162), antenna 40 may be adjusted ad described in connection with FIGS.\",\n \"4 and 5.For example, the size and shape of antenna structures such as resonating element 162 in antenna 40 can be controlled by storage and processing circuitry 28.In the FIG.\",\n \"13 arrangement, adjustable electrical component 128 may be, for example, a switch with two states (e.g., an open state that electrically disconnects antenna resonating element portion 130 from antenna resonating element portion 164 and a closed state that electrically connects antenna resonating element portion 130 and antenna resonating element portion 164).\",\n \"Component 128 may adjust the size and shape of the antenna resonating element and thereby adjust the frequency response of the antenna as described in connection with FIGS.\",\n \"4 and 5.Additional resonating element structures and antenna structures may likewise be selectively connected and disconnected from the antenna resonating element in antenna 40 if desired.\",\n \"Circuit components (e.g., resistors, inductors, and capacitors) may be interconnected with switches such as switch 128 (e.g., for impedance matching).\",\n \"Antenna 40 may also be adjusted by controlling components such as adjustable components 120, 122, 124, and 126 (as examples).\",\n \"The adjustable components of FIG.\",\n \"13 are sometimes depicted as adjustable electronic component 168 in the other drawings.\",\n \"FIG.\",\n \"14 shows how adjustable antenna system 150 may include an adjustable transmission line.\",\n \"Adjustable transmission line 140 may include one or more adjustable electronic components such as adjustable electronic component 168.Adjustable electronic component 168 may be used to selectively adjust the properties of transmission line 140.For example, component 168 may be used to connect transmission line stub 140′ to a main transmission line path in transmission line 140 and may be used to disconnect transmission line stub 140′ from the main transmission line path in transmission line 140.By adjusting the properties of transmission line 140, the frequency response of the antenna (i.e., adjustable antenna system 150) can be controlled as described in connection with FIGS.\",\n \"4 and 5 (as examples).\",\n \"FIG.\",\n \"15 is an interior perspective view of electronic device 10 of FIG.\",\n \"1 showing how electronic device 10 may include conductive structures such as conductive peripheral member 180.Device 10 may have a rectangular outline (periphery) when viewed from the front (i.e., when viewed from the face of device 10 that contains display 14).\",\n \"Conductive peripheral member 180 may be implemented using metal or other conductive materials.\",\n \"Conductive peripheral member 180 may surround substantially all of the rectangular periphery of device 10.Conductive peripheral member 180 may have the shape of a display bezel for display 14 or a trim structure for device 10 (i.e., a bezel or trim piece that runs around the upper rim on the front of device 10) or may be implemented using a flat or curved member that forms housing sidewalls that cover substantially all of the sides of housing 12 (as examples).\",\n \"A gap or multiple gaps such as gaps 182 may be interposed in conductive peripheral member 180.Gaps 182 may be formed from dielectric (e.g., air, plastic, glass, ceramics, composites, other dielectrics, or combinations of these materials).\",\n \"Gaps 182 may form part of the antennas in device 10 (e.g., antenna 40).\",\n \"Transceiver 90 may be implemented using components such as one or more integrated circuits and other electrical components that are mounted on a substrate such as printed circuit board 194.Transmission line traces in board 194 (i.e., transmission line 140A may be coupled between transceiver 90 and radio-frequency connector 186.Connector 186 may be connected to a coaxial cable segment or other transmission line 104B.\",\n \"Transmission line 104B may be coupled to a matching network (e.g., matching network 152 of FIG.\",\n \"13) and an antenna feed (e.g., an antenna feed made up of antenna feed terminals 158 and 156).\",\n \"The antenna feed may, for example, be coupled across one of gaps 182 or may be located elsewhere in device 10.Adjustable electrical components 168 may be included in antenna 40 to help provide adjustable antenna system 150 with adjustability.\",\n \"As an example, an adjustable electrical component may bridge one of gaps 182 (e.g., by connecting one of components 168 between terminals 190 and 192 on opposing sides of a gap in peripheral conductive member 180).\",\n \"Adjustable electrical components 168 may also be connected between the other conductive components in adjustable antenna system 150 (e.g., between a first terminal such as terminal 198 that is attached to peripheral conductive member 180 and a second terminal such as terminal 188 that is connected to a conductive trace in board 194 (e.g., a ground plane trace).\",\n \"Devices such as device 10 of FIG.\",\n \"15 may, if desired, have planar members such as illustrative planar structure 196.Structure 196 may form part of the rear housing surface (i.e., an external housing wall structure on the rear face of housing 12) or may form an internal planar member (e.g., an internal housing structure that spans the width of device 10 while creating closed or open slot-shaped openings such as dielectric-filled opening 184 at one or both ends of device 10 as shown in FIG.\",\n \"15).\",\n \"Structure 196 may be formed from metal (e.g., a metal plate) or other conductive structures and may, if desired, be used in forming an antenna ground plane for antenna 40.Adjustable electrical components 168 may be used to provide adjustability to the size of gaps 182 in conductive peripheral member 180.Consider, as an example, the illustrative arrangement shown in FIG.\",\n \"16.As shown in FIG.\",\n \"16, a peripheral conductive member in device 10 such as peripheral conductive member 180 may have multiple adjacent gaps 182.In the FIG.\",\n \"16 example, peripheral conductive housing member 180 has two gaps 182 a first of which has a length (width) of G1 and a second of which has a length (width) of G2.Adjustable electrical components 168A and 168B may bridge gaps 182 (e.g., on the interior side of peripheral conductive member 180).\",\n \"For example, adjustable electrical component 168A may have a first terminal that is electrically connected to portion 200 of peripheral conductive member 180 and a second terminal that is electrically connected to portion 202 of peripheral conductive member 180.Adjustable electrical component 168B may have a first terminal that is electrically connected to portion 202 of peripheral conductive member 180 and a second terminal that is electrically connected to portion 204 of peripheral conductive member 180.As with the other adjustable electrical components 168 for device 10, adjustable electrical components 168 of FIG.\",\n \"16 may be implemented using switches, continuously or semicontinuously variable components such as variable capacitors, variable resistors, and variable inductors, continuously or semicontinuously adjustable circuit networks, etc.\",\n \"Configurations of the type shown in FIG.\",\n \"16 may be used to adjust the electrical properties of gaps 182 and/or to adjust effective gap length (i.e., to electrically adjust gap width).\",\n \"As shown in FIG.\",\n \"16, for example, there may be a gap length (width) G3 between the outermost (most distant) edges of gaps 182.Adjustable components 168 may be, for example, switches.\",\n \"In this type of configuration, switch 168A may be opened to switch the leftmost gap 182 into use or may be closed to bypass the leftmost gap.\",\n \"Switch 168B may be opened to switch the rightmost gap 182 into use or may be closed to bypass the rightmost gap.\",\n \"When both switches 168A and 168B are open, antenna 40 has two gaps (of widths G1 and G2) connected in series within peripheral conductive member 180, so the gaps may be considered to have an effective width of G3.When switch 168A is closed and switch 168B is open, only the gap of width G2 is present.\",\n \"When switch 168B is closed and switch 168A is open, only the gap of width G1 is present.\",\n \"When both switches 168 are closed, no gap is present.\",\n \"Adjustment of the states of switches 168A and 168B (e.g., by applying control signals from storage and processing circuitry 28 to switches 168) can therefore adjust the width of the gap in conductive peripheral member 180.When adjustable electrical components other than switches are used (e.g., variable capacitors, inductors, etc.)\",\n \"a combination of impedance adjustments and effective gap width adjustments may be produced.\",\n \"In the example of FIG.\",\n \"16, adjustable electrical components 168 connect different portions of peripheral conductive member 180 to each other.\",\n \"Adjustable electrical components 168 may also be used to connect other conductive portions of antenna system 150 together such as other conductive portions of housing 12.As an example, adjustable components 168 and may be used to couple together different portions of a planar structure such as structure 196 of FIG.\",\n \"17.Structure 196 may be formed using all or some of a rear housing structure (e.g., a housing wall), an internal housing member, or other conductive structures.\",\n \"Member 196 may, for example, have an opening such as opening 184′ of FIG.\",\n \"17.Opening 184′ may be contiguous with opening 184 and may form an extension of opening 184.Opening 184 (and extension 184′) may form an opening for antenna 40 (e.g., an opening for a slot antenna, a loop antenna, a hybrid antenna, etc.).\",\n \"Opening 184 may have an inner periphery P. The length of inner periphery P and other electrical properties of antenna 40 may be adjusted by adjusting electrical components 168.For example, by using switches for components 168, the size of opening 184′ and therefore the length of P may be adjusted.\",\n \"If switch 168C and 168D are both open, the size of extension 184′ and length P will be maximized.\",\n \"If switch 168C is open and switch 168D is closed, the size of opening 184′ will be halved (as an example).\",\n \"Switch 168C (and, if desired switch 168D) may be closed to reduce the size of opening 184′ further (or even to bypass opening 184′ entirely).\",\n \"Antenna 40 may exhibit a resonance peak when P is equal to about one wavelength of the radio-frequency antenna signals being handled by antenna 40.By adjusting P, the frequency response of antenna 40 can therefore be adjusted as described in connection with FIGS.\",\n \"4 and 5 (i.e., by adjusting the center frequency of a slot antenna or loop antenna, etc.).\",\n \"FIG.\",\n \"18 shows how antenna 40 in adjustable antenna system 150 may be adjusted by providing one or more adjustable electrical components 168 between respective portions of ground plane 160.In the FIG.\",\n \"18 example, ground plane 160 includes ground plane portion 160A and ground plane portion 160B.\",\n \"Adjustable electrical component 168 bridges gap 206 between portions 160A and 160B.\",\n \"By controlling adjustable electrical component 168, ground plane 160 can be altered (e.g., to include member 160A while member 160B is disconnected from antenna 40) or to include both members 160A and 160B (i.e., by coupling members 160A and 160B together by bridging gap 206.Component 168 may, for example, be a switch that can be opened to disconnect portion 160B from portion 160A and that can be closed to connect portions 160A and 160B together.\",\n \"Component 168 may also be an adjustable component such as an adjustable capacitor, adjustable resistor, adjustable inductor, or other adjustable circuitry that can be adjusted to tune antenna 40.If desired, ground plane 160 may be implemented using a planar structure such as planar structure 196 of FIG.\",\n \"19.Structure 196 may be, for example, an external housing structure (e.g., a planar rear housing wall in housing 12), an internal housing structure (e.g., an internal plate or other planer support structure), or other conductive structures.\",\n \"Structure 196 may have a dielectric gap such as gap 208 that separates portions 160′ and 160″ of structure 196.Gap 208 may be bridged using adjustable electronic component 168 (e.g., a switch, a continuously adjustable component, etc.\",\n \"), thereby tuning the performance of antenna 40.As shown in FIG.\",\n \"20, transceiver 90 may be mounted on a substrate such as a printed circuit board and coupled to an antenna 40 on a flex circuit substrate (substrate 210) via transmission line 140.Transmission line 140 may, for example, include conductive traces in printed circuit board 194 and conductive traces in flex circuit 210.Flex circuit 210 may be formed from a sheet of polyimide or other flexible polymer sheet that serves as a printed circuit board.\",\n \"Conductive traces for antenna 40 (e.g., conductive metal antenna resonating element traces such as traces 212 and 214) may be formed on the exposed outer surface of flex circuit substrate 210 or may be formed from internal conductive traces.\",\n \"Adjustable electrical component 168 may bridge conductive antenna structures such as structures 212 and 214.Component 168 may be, for example, a switch that can be opened to disconnect structure 214 from structure 212 or that can be closed to connect structures 214 and 212.Structures 212 and 214 may form part of a ground plane element, part of antenna resonating element 162 (e.g., an arm such as arm 130 of FIG.\",\n \"13), part of a parasitic element (e.g., an antenna element whose presence affects the frequency response of antenna system 150, but that is near-field coupled to the antenna rather than being directly fed by transmission line 140), etc.\",\n \"If desired, flex circuit 210 may be used as a substrate for one or more electrical components such as component 216.Components such as component 216 may be, for example, camera modules, speaker parts, button structures, integrated circuits, connectors, or other components (e.g., components that include conductive structures that may be connected to trace 214).\",\n \"These components may be mounted to flex circuit substrate 210 using parts of conductive traces 212 and 214 or using separate conductive traces.\",\n \"Consider, as an example, an arrangement in which electronic device 10 includes a camera module.\",\n \"The camera module (e.g., one of input-output devices 32 of FIG.\",\n \"2) may be mounted to flex circuit 210.Traces in flex circuit 210 may be used to provide power and control signals to the camera module and may be used to gather data signals from the camera module.\",\n \"Traces 214 and 212 may be formed on the same flex circuit as the camera module, reducing component count and saving space in device 10.Adjustable electrical component 168 may be adjusted to selectively switch into use conductive material on flex circuit 210 (e.g., traces such as traces 214 on flex circuit 210, conductive components associated with the camera module, conductive ground structures, etc.).\",\n \"In this way, adjustments to adjustable electrical component 168 may be used to tune antenna 40 and adjustable antenna system 150.FIG.\",\n \"21 is a diagram of adjustable antenna system 150 showing how a component such as component 218 may be coupled to antenna structures such as antenna resonating element 164 and antenna ground 160 using one or more adjustable electrical components 168.Component 218 may be, for example, a camera module (e.g., a camera module component on a flex circuit as described in connection with component 216 on flex circuit 210 of FIG.\",\n \"20), a speaker, a button, a microphone, an input-output connector such as an audio jack or data connector, etc.\",\n \"One or both of the adjustable electrical components may be used in controlling adjustable antenna system 150.If desired, adjustable electrical components 168 may be used to selectively couple component 218 to other adjustable antenna system structures (e.g., transmission line structures, matching circuit structures, feed structures, etc.).\",\n \"FIG.\",\n \"22 is a perspective view of an illustrative configuration that may be used for electronic device 10.As shown in FIG.\",\n \"22, electronic device 10 may have a display such as display 14.Display 14 may include a display module 222 mounted beneath a transparent cover layer such as cover glass layer 220.Components such as transceiver 90 may be mounted within the interior of housing 12.Antenna 40 may include conductive structures such as frame members 224 and 226.Antenna 40 may also include conductive structures such as antenna resonating element structures (e.g., conductive traces on a flex circuit, etc.\",\n \"), conductive structures such as ground plane elements (e.g., a ground plane formed from conductive plate 196 of FIG.\",\n \"15 and overlapping conductive structures such as printed circuit boards, connectors, buttons, speakers, batteries, etc.\",\n \"), and other conductive structures.\",\n \"In the FIG.\",\n \"22 example, frame members 224 and 226 are mounted to housing 12 using fasteners such as screws 228.If desired, other attachment mechanisms may be used to attach frame members within housing 12 (e.g., welds, adhesive, springs, engagement features such as protrusions and mating slots, etc.).\",\n \"Frame members 224 and 226 may be formed from metal or other conductive materials.\",\n \"Adjustable electrical component 168 may be used to control how many frame members such as members 224 and 226 are electrically connected within antenna 40 (e.g., to control the size of an antenna resonating element arm or ground plane) or may be used to control other electrical antenna properties.\",\n \"This allows adjustable antenna system 150 to be tuned as described in connection with FIGS.\",\n \"4 and 5.FIG.\",\n \"23 shows how one or more adjustable electronic components such as adjustable electronic component 168 may be coupled between a ground plane element such as plate member 196 and a portion of peripheral conductive member 180 (e.g., a peripheral housing sidewall or bezel structure).\",\n \"Adjustable component 168 of FIG.\",\n \"23 may be, for example, a switch that can be placed in an open or closed position.\",\n \"Portions of peripheral conductive member 180 and opposing portions of conductive structure 196 may define an opening such as opening 184 with an inner periphery.\",\n \"Component 168 may bridge opening extension 184′.\",\n \"Opening 184 (including extension 184′) may form a slot for a slot antenna or hybrid antenna.\",\n \"The length of the inner periphery of opening 184 may be approximately equal to one wavelength at an operating frequency of interest.\",\n \"Switch 168 may be closed to decrease the length of the inner periphery (to length P) or can be opened to increase the length of the inner periphery (to length P′).\",\n \"Adjustments to component 168 may therefore be used to control the frequency response of antenna 40.The antenna system adjustment mechanisms described in connection with FIGS.\",\n \"1-23 may, if desired, be used in any combination.\",\n \"For example, antenna system adjustments may be made using any combination of transmission line adjustments, matching network adjustments, antenna adjustments, antenna feed adjustments, antenna resonating element adjustments, antenna ground adjustments, etc.\",\n \"Adjustable electrical components 168 may be incorporated into any combination of the portions of antenna system 150 (e.g., to bridge ground gaps, to bridge portions of an antenna resonating element, to connect a ground plate to a peripheral conductive member in a device housing, to connect portions of a peripheral housing member together in various formations and thereby adjust the width of a dielectric gap in the peripheral housing member, to form connections between conductive antenna structures and housing frame members, to bridge any combination of these structures, etc.).\",\n \"FIG.\",\n \"24 is a flow chart of illustrative steps involved in operating an electronic device with an adjustable antenna system such as electronic device 10 of FIG.\",\n \"1.At step 230, storage and processing circuitry 28 (FIG.\",\n \"2) may be used to determine which communications bands are to be used by device 10.For example, if signals are being transmitted over a 2.4 GHz local WiFi link, storage and processing circuitry 28 may conclude that adjustable antenna system 150 will be covering (or should continue to cover) the 2.4 GHz communications band.\",\n \"Wireless communications in various cellular telephone bands may also be supported.\",\n \"The operations of step 230 may involve determination of the capabilities of device 10 (i.e., the capabilities of transceiver 90), the current geographic location of device 10 (e.g., the current country in which device 10 is located), current traffic being handled (e.g., determining what type of cellular traffic or local area network traffic is currently being received on a particular band), etc.\",\n \"Information on currently active bands or bands that need to be covered to receive incoming data may be gathered by monitoring incoming traffic through a fixed antenna (e.g., in a system of the types shown in FIG.\",\n \"3 in which some antennas are fixed and some are adjustable) or by periodically cycling an adjustable antenna system through all possible bands of interest.\",\n \"Information on bands that are to be used for an upcoming activity (e.g., a data transmission activity) may be determined based on factors such as the last band used, geographic location, trial and error, look-up tables mapping device activities to required band usage, etc.\",\n \"At step 232, after having determined which communications bands are to be covered by adjustable antenna system 150, storage and processing circuitry 28 may, in response, issue corresponding control signals to adjustable antenna system 150.If, for example, storage and processing circuitry 28 determines that adjustable antenna system 150 should cover the 1900 MHz band, control signals may be issued to the adjustable electrical components 168 in adjustable antenna system 150 to configure adjustable antenna system 150 to cover the 1900 MHz band (as an example).\",\n \"At step 234, the adjustable electrical component(s) 168 in adjustable antenna system 150 may be controlled by the control signals that have been issued, thereby tuning adjustable antenna system 150 coarsely (e.g., to cover a desired band as described in connection with FIG.\",\n \"4) and/or finely (e.g., to improve tuning accuracy within a particular communications band as described in connection with FIG.\",\n \"5).\",\n \"The operations of FIG.\",\n \"24 (e.g., monitoring to determine which bands are of interest, determining how to adjust components 168, and issuing commands that adjust components 168 and therefore system 150) may be performed repeatedly in real time (e.g., in response to the satisfaction of appropriate trigger criteria, periodically according to a schedule, continuously, etc.).\",\n \"The foregoing is merely illustrative of the principles of this invention and various modifications can be made by those skilled in the art without departing from the scope and spirit of the invention.\",\n \"The foregoing embodiments may be implemented individually or in any combination.\"\n ]\n]"},"source":{"kind":"string","value":"Patent_15871388"}}},{"rowIdx":4493777,"cells":{"text":{"kind":"list like","value":[["Bromine-Facilitated Synthesis of Fluoro-Sulfur Compounds","Described herein are methods for the bromine-facilitated synthesis of fluoro-sulfur compounds, that include SF4, SF5Cl, SF5Br and SF6.","The methods described herein generally require lower temperature and pressure, produce higher yields, require less time, do not use corrosive or costly reactants and solvents that are commonly used in the synthesis of the fluoro-sulfur compounds, and do not produce deleterious waste products when compared to previously-used methods."],["1.-17.","(canceled) 18.A method comprising: admixing a Br2 reactant, an SF4 reactant, and a CoF3 reactant, thereby initiating a reaction that produces SF6.19.The method of claim 18, wherein the reaction takes place at temperatures from about 10° C. to about 400° C. 20.The method of claim 18, wherein the reaction takes place at temperatures from about 10° C. to about 100° C. 21.The method of claim 18, wherein the SF6 is produced at a yield from about 10% to less than about 100%.","22.The method of claim 18, wherein the SF6 is produced at a yield of greater than about 50%.","23.The method of claim 18, wherein the admixing occurs at a stoichiometric ratio of about 2 CoF3 to about 1 Br2 to about 1 SF4.24.The method of claim 18, wherein the SF6 is produced at a yield of at least about 10% within about 52 hours.","25.The method of claim 18, wherein the reaction occurs in the absence of F2, SF5Cl, IF5, ClF HF, or combinations thereof.","26.The method of claim 18, wherein the SF6 is produced at a yield from about 10% to less than 100% within about 52 hours at temperatures from about 10° C. to about 400° C. 27.A method comprising: admixing a Br2 reactant, an SF4 reactant, and a metal fluoride reactant, thereby initiating a reaction that produces SF6 at temperatures from about 10° C. to about 100° C. 28.The method of claim 27, wherein admixing the Br2 reactant, the SF4 reactant, and the metal fluoride reactant takes place in a single stage.","29.The method of claim 27, wherein the metal fluoride reactant is selected from CoF3, CeF4, MnF3, PbF4, AgF2, AgF, AuF, or combinations thereof.","30.The method of claim 27, wherein the reaction proceeds at temperatures from about 10° C. to about 27° C. 31.The method of claim 27, wherein the reaction proceeds at temperatures from about 27° C. to about 100° C. 32.The method of claim 27, wherein the reaction occurs in the absence of F2, SF5Cl, IF5, ClF HF, or combinations thereof.","33.The method of claim 27, wherein the SF6 is produced at a yield from about 10% to less than 100%.","34.The method of claim 27, wherein the SF6 is produced at a yield of at least about 10% to less than 100% within about 52 hours 35.The method of claim 27, wherein the SF6 is produced at a yield from about 10% to less than 100% in less than 3 days.","36.The method of claim 27, wherein the SF6 is produced at a yield from about 50% to less than 100%.","37.The method of claim 27, wherein the metal fluoride reactant is CoF3 and the mixing occurs at a stoichiometric ratio of about 2 CoF3 to about 1 Br2 to about 1 SF4."],[" BACKGROUND OF THE INVENTION A number of fluoro-sulfur compounds have beneficial applications.","For example, sulfur tetrafluoride (SF 4 ) is a widely-used compound produced yearly at the metric ton level, which can be utilized as a deoxofluorinating reagent in converting carboxylic acids, aldehydes, some alcohols and ketones into their corresponding deoxofluorine derivatives (i.e.","R—CF 3 , R—CHF 2 , RF, RR′—CF 2 ).","SF 4 is also utilized as an etching agent in the electronics industry.","Moreover, SF 4 can be utilized as a precursor for the synthesis of other important fluorinated products such as, without limitation, pentafluorosulfur chloride (SF 5 Cl), pentafluorosulfur bromide (SF 5 Br), and sulfur hexafluoride (SF 6 ).","Sulfur hexafluoride (SF 6 ), is a compound that is produced by the thousands of metric tons each year, and its worldwide uses include: acting as a PCB replacement and an inert dielectric medium for electrical equipment, the etching of semiconductors, the casting of magnesium, the manufacture of thermal windows, a source of thrust in some rocket propulsion systems, the tracing of air flow through industrial systems, a tamponade for retinal holes of the eye and in medical imaging.","Compounds harboring fluoro-organic modifications such as R—CF 3 , R—CHF 2 , RF, RR′—CF 2 and RSF 5 , have been used in a variety of applications including fluorinated therapeutic and diagnostic drugs, pesticides, herbicides, antibiotics, perfluorinated blood substitutes, fungicides, polymer solvents, polymers, lubricants, liquid crystals, surface-active agents, high-boiling solvents, stable solvents, electrically conducting polymers and the like.","Utilizing an SF 5 group in the place of CF 3 offers many advantages.","Particularly, the SF 5 group possesses greater electronegativity than CF 3 .","Moreover, compounds containing SF 5 may be further distinguished by their outstanding chemical properties including high to extreme chemical and thermal stability, hydro- and oleophobicity, lipophilicity, high-density, reduction of shock sensitivity in explosives, low boiling point, low polarizability and low surface tension.","While SF 5 -derivatives offer these advantages, they have been difficult to synthesize.","The difficulty of obtaining such compounds is in part related to the difficulty of obtaining sufficient and affordable quantities of SF 5 Cl or SF 5 Br, which are the principal chemical reagents used to synthesize and obtain a number of organic or inorganic derivatives that bear the SF 5 -radical moiety.","SF 5 Cl, particularly, is a valuable reactant to produce SF 5 -radical bearing derivatives of (sulfur hexafluoride) SF 6 and may be reduced to disulfur decafluoride (S 2 F 10 ) with the latter being converted into pentafluorosulfur bromide (SF 5 Br).","SF 5 Cl can also be used in the synthesis of SF 6 .","It is of interest that SF 5 Cl can be particularly used in the manufacture of SF 6 by a pyrogenic route (e.g.","U.S. Pat.","No.","4,390,511), whereby a disproportionation occurs according to the following reaction: in-line-formulae description=\"In-line Formulae\" end=\"lead\"?","SF 5 Cl→½SF 6 +½SF 4 +½Cl 2 in-line-formulae description=\"In-line Formulae\" end=\"tail\"?","In this method, SF 6 is obtained that is free of S 2 F 10 , a compound believed to be highly toxic and a by-product of the manufacture of SF 6 by the reaction of sulfur with fluorine.","Accordingly, the use of SF 5 Cl can be used to produce high purity SF 6 .","Collectively, a variety of methods have been demonstrated as processes for the production of SF 6 and include U.S. Pat.","Nos.","2,883,267, 2,912,307, 3,054,661, 3,345,277, 3,399,036, 3,373,000, 4,390,511, 5,639,435 and Japanese Patent No.","7,625,497.These methods frequently employ electrochemical preparation, high reaction temperatures and pressures, and/or utilize highly-reactive and/or costly reactants that can include F 2 , SF 5 Cl, IF 5 , SF 4 , ClF and HF.","SF 5 Br is also a valuable chemical compound that has been demonstrated as a reactant for the efficient production of SF 5 -radical bearing chemicals; also known as derivatives of SF 6 .","Currently available methods of producing fluoro-sulfur compounds suffer a number of drawbacks.","The drawbacks generally include the use of excessive temperatures, electrochemical preparation, expensive and/or hazardous reactants, the requirement for numerous successive steps or long reaction times, the production of low or variable yields and/or the generation of toxic by-products.","Accordingly, there is room for improvement in the synthesis of fluoro-sulfur compounds."],[" SUMMARY OF THE INVENTION Described herein are methods for the synthesis of fluoro-sulfur compounds, more specifically SF 4 , SF 5 Cl, SF 5 Br and SF 6 .","The methods described herein generally require lower temperatures and pressure, produce high yields, in some cases require less time, do not use highly reactive oxidants or costly reactants and solvents that are commonly used in the synthesis of fluoro-sulfur compounds, and do not produce deleterious waste products when compared to previously-used methods.","One embodiment disclosed herein includes a method of producing a fluoro-sulfur compound or a compound made using the produced fluoro-sulfur compound comprising: admixing Br 2 , a metal fluoride reactant, and a sulfur reactant thereby initiating a reaction that produces a yield of the fluoro-sulfur compound of greater than about 10%.","In another embodiment, the admixing further includes Cl 2 .","In another embodiment, the reaction proceeds at temperature of about 10 to about 400° C. In another embodiment, either S 2 F 10 or BrF, BrF 3 , BrF 5 , CsBrF 4 , CsBrF 2 , acetonitrile, Dioxane, ClF, ClF 3 , NOF, HF, F 2 , (HF) n .amine, IF 5 or combinations thereof are not added to the reaction.","Embodiments disclosed herein also include methods of producing SF 4 or a compound made using the produced SF 4 .","In one embodiment the method includes admixing a sulfur reactant, a metal fluoride reactant, and a Br 2 reactant thereby initiating a reaction that produces SF 4 at a yield of greater than about 10%.","In another embodiment of producing SF 4 or a compound made using the produced SF 4 , the reaction proceeds at a temperature of about 10 to about 400° C. In another embodiment of producing SF 4 or a compound made using the produced SF 4 , the sulfur reactant is S and the metal fluoride is KF and the admixing occurs at a stoichiometric ratio of about 4KF to about 2Br 2 to about 1 S and the reaction proceeds at a temperature of about 10 to about 400° C. In another embodiment of producing SF 4 or a compound made using the produced SF 4 , the metal fluoride is an alkaline earth metal fluoride, an alkali metal fluoride, CsF, RbF, KF, BaF 2 , SrF 2 or a combination thereof and/or the sulfur reactant is S, S 2 Cl 2 , SCl 2 , S 2 Br 2 , SBr 2 or a combination thereof.","In an additional embodiment of producing SF 4 or a compound made using the produced SF 4 , the method includes admixing a sulfur reactant, a metal fluoride reactant, a Cl 2 reactant and a Br 2 reagent thereby initiating a reaction that produces SF 4 at a yield of greater than about 10%.","In another embodiment of producing SF 4 or a compound made using the produced SF 4 , the reaction proceeds at a temperature of about 10 to about 400° C. In another embodiment of producing SF 4 or a compound made using the produced SF 4 , the sulfur reactant is S and the metal fluoride is KF and the admixing occurs at a stoichiometric ratio of about 4KF to about 1 Br 2 to about 1 S to about 2Cl 2 or the sulfur reactant is SCl 2 and the metal fluoride is KF and the admixing occurs at a stoichiometric ratio of about 4KF to about 1 Br 2 to about 1 SCl 2 to about 1 Cl 2 and the reaction proceeds at a temperature of about 10 to about 400° C. In another embodiment of producing SF4 or a compound made using the produced SF 4 , the metal fluoride is an alkaline earth metal fluoride, an alkali metal fluoride, CsF, RbF, KF, BaF 2 , NaF, SrF 2 or a combination thereof and/or the sulfur reactant is S, S 2 Cl 2 , SCl 2 , S 2 Br 2 , SBr 2 or a combination thereof.","Embodiments disclosed herein also include methods of producing SF 5 Cl or a compound made using the produced SF 5 Cl.","In one embodiment the method includes admixing a Cl 2 reactant, a sulfur reactant, a metal fluoride reactant, and Br 2 reagent thereby initiating a reaction that produces the SF 5 Cl at a yield of greater than about 50%.","In another embodiment of producing SF 5 Cl or a compound made using the produced SF 5 Cl, the reaction proceeds at a temperature of about 10 to about 200° C. In another embodiment of producing SF 5 Cl or a compound made using the produced SF 5 Cl, the sulfur reactant is S and the metal fluoride is KF and the admixing occurs at a stoichiometric ratio of about 5KF to about 1 Br 2 to about 1 S to about 3Cl 2 or the sulfur reactant is SF 4 and the metal fluoride is KF and the admixing occurs at a stoichiometric ratio of about 1KF to about 1 Br 2 to about 1 SF 4 to about 1Cl 2 or the sulfur reactant is SCl 2 and the metal fluoride is KF and the admixing occurs at a stoichiometric ratio of about 5KF to about 1 Br 2 to about 1 SCl 2 to about 2Cl 2 and the reaction proceeds at a temperature of about 10 to about 200° C. In another embodiment of producing SF 5 Cl or a compound made using the produced SF 5 Cl, the metal fluoride is an alkaline earth metal fluoride, an alkali metal fluoride, CsF, RbF, KF, BaF 2 , SrF 2 or a mixture thereof and/or the sulfur reactant S, S 2 Cl 2 , SCl 2 , SF 4 or a combination thereof.","Embodiments disclosed herein also include methods of producing SF 5 Br or a compound made using the produced SF 5 Br.","In one embodiment the method includes admixing a Br 2 reactant, a sulfur reactant, and a metal fluoride reactant thereby initiating a reaction that produces SF 5 Br at a yield of greater than about 50%.","In another embodiment of producing SF 5 Br or a compound made using the produced SF 5 Br, either S 2 F 10 or BrF, BrF 3 , BrF 5 , CsBrF 4 , CsBrF 2 or mixtures thereof are not added to the reaction.","In another embodiment of producing SF 5 Br or a compound made using the produced SF 5 Br, the reaction proceeds at a temperature of about 10 to about 140° C. In another embodiment of producing SF 5 Br or a compound made using the produced SF 5 Br, the sulfur reactant is SF 4 and the metal fluoride is AgF and the admixing occurs at a stoichiometric ratio of about 1 AgF to about 1 Br 2 to about 1 SF 4 or the sulfur reactant is SF 4 and the metal fluoride is AgF 2 and the admixing occurs at a stoichiometric ratio of about 2AgF 2 to about 3 Br 2 to about 4 SF 4 and the reaction proceeds at a temperature of about 10 to about 140° C. In another embodiment of producing SF 5 Br or a compound made using the produced SF 5 Br, the metal fluoride is an alkaline earth metal fluorides, an alkali metal fluorides, AgF 2 , AgF, AuF, MnF 3 , PbF 4 , CeF 4 or a mixture thereof.","Embodiments disclosed herein also include methods of producing SF 6 or a compound made using the produced SF 6 .","In one embodiment, the method includes: admixing a Br 2 reactant, an SF 4 reactant, and a metal fluoride reactant thereby initiating a reaction that produces SF 6 at a yield of greater than about 50%.","In another embodiment of producing SF 6 or a compound made using the produced SF 6 , the reaction proceeds at a temperature of about 10 to about 400° C. In another embodiment of producing SF 6 or a compound made using the produced SF 6 , the sulfur reactant is SF 4 and the metal fluoride is CoF 3 and the admixing occurs at a stoichiometric ratio of about 2 CoF 3 to about 1 Br 2 to about 1 SF 4 and the reaction proceeds at a temperature of about 10 to about 400° C. In another embodiment of producing SF 6 or a compound made using the produced SF 6 , the metal fluoride is selected from the group consisting of an alkaline earth metal fluoride, an alkali metal fluoride, CoF 3 , MnF 3 , PbF 4 , CeF4 or a mixture thereof.","detailed-description description=\"Detailed Description\" end=\"lead\"?"],["CROSS REFERENCE TO RELATED APPLICATIONS This application is a divisional of U.S. patent application Ser.","No.","12/746,717, filed Jun.","7, 2010 and claims the benefit of U.S.","Provisional Patent Application No.","61/060,642, filed Jun.","11, 2008, U.S.","Provisional Patent Application No.","61/153,180, filed Feb. 17, 2009, U.S.","Provisional Patent Application No.","61/176,674, filed May 8, 2009, and U.S. Non-Provisional patent application Ser.","No.","12/746,717, filed Jun.","7, 2010, which is a national stage application of PCT Patent Application No.","PCT/US09/47116, filed Jun.","11, 2009, the entire disclosures of which are incorporated herein by reference.","FIELD OF THE INVENTION Disclosed herein are methods of synthesizing fluoro-sulfur compounds.","The disclosed methods use bromine to promote the synthesis of fluoro-sulfur compounds while avoiding the use excessive temperatures, electrochemical preparation, or the use of traditionally used solvents or reactants generally deemed less desirable due to toxicity, excess reactivity or cost.","BACKGROUND OF THE INVENTION A number of fluoro-sulfur compounds have beneficial applications.","For example, sulfur tetrafluoride (SF4) is a widely-used compound produced yearly at the metric ton level, which can be utilized as a deoxofluorinating reagent in converting carboxylic acids, aldehydes, some alcohols and ketones into their corresponding deoxofluorine derivatives (i.e.","R—CF3, R—CHF2, RF, RR′—CF2).","SF4 is also utilized as an etching agent in the electronics industry.","Moreover, SF4 can be utilized as a precursor for the synthesis of other important fluorinated products such as, without limitation, pentafluorosulfur chloride (SF5Cl), pentafluorosulfur bromide (SF5Br), and sulfur hexafluoride (SF6).","Sulfur hexafluoride (SF6), is a compound that is produced by the thousands of metric tons each year, and its worldwide uses include: acting as a PCB replacement and an inert dielectric medium for electrical equipment, the etching of semiconductors, the casting of magnesium, the manufacture of thermal windows, a source of thrust in some rocket propulsion systems, the tracing of air flow through industrial systems, a tamponade for retinal holes of the eye and in medical imaging.","Compounds harboring fluoro-organic modifications such as R—CF3, R—CHF2, RF, RR′—CF2 and RSF5, have been used in a variety of applications including fluorinated therapeutic and diagnostic drugs, pesticides, herbicides, antibiotics, perfluorinated blood substitutes, fungicides, polymer solvents, polymers, lubricants, liquid crystals, surface-active agents, high-boiling solvents, stable solvents, electrically conducting polymers and the like.","Utilizing an SF5 group in the place of CF3 offers many advantages.","Particularly, the SF5 group possesses greater electronegativity than CF3.Moreover, compounds containing SF5 may be further distinguished by their outstanding chemical properties including high to extreme chemical and thermal stability, hydro- and oleophobicity, lipophilicity, high-density, reduction of shock sensitivity in explosives, low boiling point, low polarizability and low surface tension.","While SF5-derivatives offer these advantages, they have been difficult to synthesize.","The difficulty of obtaining such compounds is in part related to the difficulty of obtaining sufficient and affordable quantities of SF5Cl or SF5Br, which are the principal chemical reagents used to synthesize and obtain a number of organic or inorganic derivatives that bear the SF5-radical moiety.","SF5Cl, particularly, is a valuable reactant to produce SF5-radical bearing derivatives of (sulfur hexafluoride) SF6 and may be reduced to disulfur decafluoride (S2F10) with the latter being converted into pentafluorosulfur bromide (SF5Br).","SF5Cl can also be used in the synthesis of SF6.It is of interest that SF5Cl can be particularly used in the manufacture of SF6 by a pyrogenic route (e.g.","U.S. Pat.","No.","4,390,511), whereby a disproportionation occurs according to the following reaction: SF5Cl→½SF6+½SF4+½Cl2 In this method, SF6 is obtained that is free of S2F10, a compound believed to be highly toxic and a by-product of the manufacture of SF6 by the reaction of sulfur with fluorine.","Accordingly, the use of SF5Cl can be used to produce high purity SF6.Collectively, a variety of methods have been demonstrated as processes for the production of SF6 and include U.S. Pat.","Nos.","2,883,267, 2,912,307, 3,054,661, 3,345,277, 3,399,036, 3,373,000, 4,390,511, 5,639,435 and Japanese Patent No.","7,625,497.These methods frequently employ electrochemical preparation, high reaction temperatures and pressures, and/or utilize highly-reactive and/or costly reactants that can include F2, SF5Cl, IF5, SF4, ClF and HF.","SF5Br is also a valuable chemical compound that has been demonstrated as a reactant for the efficient production of SF5-radical bearing chemicals; also known as derivatives of SF6.Currently available methods of producing fluoro-sulfur compounds suffer a number of drawbacks.","The drawbacks generally include the use of excessive temperatures, electrochemical preparation, expensive and/or hazardous reactants, the requirement for numerous successive steps or long reaction times, the production of low or variable yields and/or the generation of toxic by-products.","Accordingly, there is room for improvement in the synthesis of fluoro-sulfur compounds.","SUMMARY OF THE INVENTION Described herein are methods for the synthesis of fluoro-sulfur compounds, more specifically SF4, SF5Cl, SF5Br and SF6.The methods described herein generally require lower temperatures and pressure, produce high yields, in some cases require less time, do not use highly reactive oxidants or costly reactants and solvents that are commonly used in the synthesis of fluoro-sulfur compounds, and do not produce deleterious waste products when compared to previously-used methods.","One embodiment disclosed herein includes a method of producing a fluoro-sulfur compound or a compound made using the produced fluoro-sulfur compound comprising: admixing Br2, a metal fluoride reactant, and a sulfur reactant thereby initiating a reaction that produces a yield of the fluoro-sulfur compound of greater than about 10%.","In another embodiment, the admixing further includes Cl2.In another embodiment, the reaction proceeds at temperature of about 10 to about 400° C. In another embodiment, either S2F10 or BrF, BrF3, BrF5, CsBrF4, CsBrF2, acetonitrile, Dioxane, ClF, ClF3, NOF, HF, F2, (HF)n.amine, IF5 or combinations thereof are not added to the reaction.","Embodiments disclosed herein also include methods of producing SF4 or a compound made using the produced SF4.In one embodiment the method includes admixing a sulfur reactant, a metal fluoride reactant, and a Br2 reactant thereby initiating a reaction that produces SF4 at a yield of greater than about 10%.","In another embodiment of producing SF4 or a compound made using the produced SF4, the reaction proceeds at a temperature of about 10 to about 400° C. In another embodiment of producing SF4 or a compound made using the produced SF4, the sulfur reactant is S and the metal fluoride is KF and the admixing occurs at a stoichiometric ratio of about 4KF to about 2Br2 to about 1 S and the reaction proceeds at a temperature of about 10 to about 400° C. In another embodiment of producing SF4 or a compound made using the produced SF4, the metal fluoride is an alkaline earth metal fluoride, an alkali metal fluoride, CsF, RbF, KF, BaF2, SrF2 or a combination thereof and/or the sulfur reactant is S, S2Cl2, SCl2, S2Br2, SBr2 or a combination thereof.","In an additional embodiment of producing SF4 or a compound made using the produced SF4, the method includes admixing a sulfur reactant, a metal fluoride reactant, a Cl2 reactant and a Br2 reagent thereby initiating a reaction that produces SF4 at a yield of greater than about 10%.","In another embodiment of producing SF4 or a compound made using the produced SF4, the reaction proceeds at a temperature of about 10 to about 400° C. In another embodiment of producing SF4 or a compound made using the produced SF4, the sulfur reactant is S and the metal fluoride is KF and the admixing occurs at a stoichiometric ratio of about 4KF to about 1 Br2 to about 1 S to about 2Cl2 or the sulfur reactant is SCl2 and the metal fluoride is KF and the admixing occurs at a stoichiometric ratio of about 4KF to about 1 Br2 to about 1 SCl2 to about 1 Cl2 and the reaction proceeds at a temperature of about 10 to about 400° C. In another embodiment of producing SF4 or a compound made using the produced SF4, the metal fluoride is an alkaline earth metal fluoride, an alkali metal fluoride, CsF, RbF, KF, BaF2, NaF, SrF2 or a combination thereof and/or the sulfur reactant is S, S2Cl2, SCl2, S2Br2, SBr2 or a combination thereof.","Embodiments disclosed herein also include methods of producing SF5Cl or a compound made using the produced SF5Cl.","In one embodiment the method includes admixing a Cl2 reactant, a sulfur reactant, a metal fluoride reactant, and Br2 reagent thereby initiating a reaction that produces the SF5Cl at a yield of greater than about 50%.","In another embodiment of producing SF5Cl or a compound made using the produced SF5Cl, the reaction proceeds at a temperature of about 10 to about 200° C. In another embodiment of producing SF5Cl or a compound made using the produced SF5Cl, the sulfur reactant is S and the metal fluoride is KF and the admixing occurs at a stoichiometric ratio of about 5KF to about 1 Br2 to about 1 S to about 3Cl2 or the sulfur reactant is SF4 and the metal fluoride is KF and the admixing occurs at a stoichiometric ratio of about 1KF to about 1 Br2 to about 1 SF4 to about 1Cl2 or the sulfur reactant is SCl2 and the metal fluoride is KF and the admixing occurs at a stoichiometric ratio of about 5KF to about 1 Br2 to about 1 SCl2 to about 2Cl2 and the reaction proceeds at a temperature of about 10 to about 200° C. In another embodiment of producing SF5Cl or a compound made using the produced SF5Cl, the metal fluoride is an alkaline earth metal fluoride, an alkali metal fluoride, CsF, RbF, KF, BaF2, SrF2 or a mixture thereof and/or the sulfur reactant S, S2Cl2, SCl2, SF4 or a combination thereof.","Embodiments disclosed herein also include methods of producing SF5Br or a compound made using the produced SF5Br.","In one embodiment the method includes admixing a Br2 reactant, a sulfur reactant, and a metal fluoride reactant thereby initiating a reaction that produces SF5Br at a yield of greater than about 50%.","In another embodiment of producing SF5Br or a compound made using the produced SF5Br, either S2F10 or BrF, BrF3, BrF5, CsBrF4, CsBrF2 or mixtures thereof are not added to the reaction.","In another embodiment of producing SF5Br or a compound made using the produced SF5Br, the reaction proceeds at a temperature of about 10 to about 140° C. In another embodiment of producing SF5Br or a compound made using the produced SF5Br, the sulfur reactant is SF4 and the metal fluoride is AgF and the admixing occurs at a stoichiometric ratio of about 1 AgF to about 1 Br2 to about 1 SF4 or the sulfur reactant is SF4 and the metal fluoride is AgF2 and the admixing occurs at a stoichiometric ratio of about 2AgF2 to about 3 Br2 to about 4 SF4 and the reaction proceeds at a temperature of about 10 to about 140° C. In another embodiment of producing SF5Br or a compound made using the produced SF5Br, the metal fluoride is an alkaline earth metal fluorides, an alkali metal fluorides, AgF2, AgF, AuF, MnF3, PbF4, CeF4 or a mixture thereof.","Embodiments disclosed herein also include methods of producing SF6 or a compound made using the produced SF6.In one embodiment, the method includes: admixing a Br2 reactant, an SF4 reactant, and a metal fluoride reactant thereby initiating a reaction that produces SF6 at a yield of greater than about 50%.","In another embodiment of producing SF6 or a compound made using the produced SF6, the reaction proceeds at a temperature of about 10 to about 400° C. In another embodiment of producing SF6 or a compound made using the produced SF6, the sulfur reactant is SF4 and the metal fluoride is CoF3 and the admixing occurs at a stoichiometric ratio of about 2 CoF3 to about 1 Br2 to about 1 SF4 and the reaction proceeds at a temperature of about 10 to about 400° C. In another embodiment of producing SF6 or a compound made using the produced SF6, the metal fluoride is selected from the group consisting of an alkaline earth metal fluoride, an alkali metal fluoride, CoF3, MnF3, PbF4, CeF4 or a mixture thereof.","DETAILED DESCRIPTION OF THE INVENTION Described herein are methods for the synthesis of fluoro-sulfur compounds in the presence of Br2.In certain exemplary embodiments the fluoro-sulfur compounds are SF4, SF5Cl SF5Br and SF6.The methods disclosed herein involve the mixing of readily available and relatively inexpensive reactants.","When compared to previously-used approaches, the methods described herein generally require lower temperatures and pressure, produce high yields, require less time, do not use excessively reactive or costly reactants and solvents that are frequently utilized in the synthesis of the fluoro-sulfur compounds, do not produce deleterious waste products or one or more of the above in various combinations.","Disclosed methods of synthesizing SF4 utilize Br2 in both the presence and absence of Cl2, whereas disclosed methods of synthesizing SF5Cl utilize Br2 in the presence of Cl2.Disclosed methods of synthesizing SF4 and SF5Cl can utilize Br2 in the absence of excessive temperature and pressure, and, in certain embodiments, in the absence of acetonitrile, Dioxane, ClF, ClF3, NOF, HF, F2, (HF)n.amine and/or IF5.Disclosed methods of synthesizing SF5Br utilize Br2 and can be carried out in the absence of high reaction temperatures and pressures, and in certain embodiments, in the absence of S2F10, BrF3, BrF5, CsBrF4 and/or CsBrF2.Disclosed methods of synthesizing SF6 utilize Br2 and can be carried out in the absence of electrochemical preparation, high reaction temperatures and/or pressures, and, in certain embodiments, in the absence of F2, SF5Cl, IF5, SF4, ClF and/or HF.","As used herein “metal fluoride (MF)” encompasses a variety of mono or multivalent MFs including, without limitation, alkaline earth fluorides and alkali metal fluorides and can particularly include, without limitation, CoF3, CeF4, MnF3, PbF4, CsF, RbF, KF, BaF2, SrF2, AgF2, AgF and AuF.","As used herein, the term “about” is used to indicate that a value includes the standard deviation of error for the device or method being employed to determine the value.","In one example embodiment, the synthesis of SF4 is described.","One example synthesis reaction for SF4 can proceed as follows in reaction I: 4KF+S+2Br2→SF4+4KBr I.","In reaction I, the SF4-producing reaction can proceed at autogenous or elevated reaction pressures at ambient temperatures of about 10 to about 27° C., or at a mildly-elevated temperatures of up to about 80° C., or even at higher temperatures that are below those (about 400 to about 500° C.) which promote SF4 to disproportionate into S and SF6.Accordingly, the described methods do not require excessive temperatures or pressures or require the use of unusually reactive or costly reactants or solvents that are commonly used in the synthesis of SF4, such as, but not limited to acetonitrile, Dioxane, HF, F2, Cl2, (HF)n.amine and IF5.The described reaction I can produce yields ranging from about 57 to about 96% or greater, in a time frame of several hours to several days.","Due to the low cost of the reagents used, modifying the reaction to produce lower yields can also be commercially advantageous.","In one embodiment, yields of 10% or higher can be produced.","This reaction does not create or leave behind undesirable side products.","Only Br2, MFs and sulfur bromides that can easily be removed and discarded or recycled into subsequent production runs of SF4 or other unrelated chemical reactions, are created.","Moreover, the disclosed reaction produces little or no gases, other than SF4, making purification of the SF4 end-product a simple process.","Particularly, low boiling constituents (SF4) or excess unused Br2 can be separated by lowering the temperature and transferring into a cold trap.","This described reaction I provides a method for synthesizing SF4 employing Br2 in the absence of Cl2.The absence of Cl2 in this reaction prevents the formation of SF5Cl when SF4 is the desired SF4 end-product.","In another example embodiment, either S, Br2, or both S and Br2 can be replaced by sulfur bromides (e.g.","S2Br2, SBr2) in the production of SF4.In one embodiment, specifically relating to reaction I, S to Br2 molar ratios of greater than about 1.00:2.00 can be used.","In alternative embodiments, ratios ranging from about 1.00:0.44 to about 1.00:5.33 can also be used.","In another example embodiment, particularly useful MFs in the production of SF4 and SF5Cl include, without limitation, CsF, RbF, KF, BaF2, SrF2 or a combination thereof.","Further described herein are methods for the production of SF5Cl, and optionally SF4 (in the presence of Cl2), utilizing Br2 as a solvent and/or reactive solvent.","In the case of S as a reactant, when SF4 is the desired product, slightly more than about four equivalents of the MF can be used.","If SF5Cl is the desired product, slightly more than about five equivalents of the MF can be used.","When SF4 is used as a reactant to produce SF5Cl, an equivalent or slightly larger amount of the MF can be utilized to efficiently produce the SF5Cl.","The minimum amount of Cl2 in the reactions can easily be determined by the stoichiometry of the reaction itself.","In the present example embodiment, KF is used as the MF, however, a variety of other mono or multivalent MFs can be used.","Example synthesis reactions for SF4 and SF5Cl in the presence of Cl2 as described above proceed as follows in reactions II-IV: 4KF+S+2Cl2+(Br2)→SF4+4KCl+(Br2) II.","5KF+S+3Cl2+(Br2)→SF5Cl+5KCl+(Br2) III.","KF+SF4+Cl2+(Br2)→SF5Cl+KCl+(Br2) IV.","In reactions II-IV above, the SF5Cl- and SF4-producing reactions can proceed at autogenous or elevated reaction pressures, at ambient temperatures of about 10 to about 27° C., or at a mildly-elevated temperatures of up to about 115° C., or, even at higher temperatures that are below those which promote decomposition of SF5Cl (about 200 to about 400° C.), or cause SF4 to disproportionate into S and SF6 (about 400 to about 500° C.).","Accordingly, the described methods do not require excessive temperatures or pressures or require the use of unusually reactive or costly reactants or solvents that are commonly used in the synthesis of SF4 and SF5Cl, such as, but not limited to acetonitrile, Dioxane, ClF, ClF3, NOF, HF, F2, (HF)n.amine and IF5.The described reaction III above can produce yields of about 88 to about 95% or greater and can theoretically approach 100%, in a time frame of several hours to several weeks.","Due to the low cost of the reagents used, modifying the reaction to produce lower yields can also be commercially advantageous.","In one embodiment, yields of 50% or higher can be produced.","Other lower yields, such as yields as low as 10%, are also within the scope of embodiments disclosed herein.","This reaction does not create or leave behind undesirable side products.","Br2 can be easily separated from the reaction products and then SF5Cl and any excess Cl2 can be collected by cooling the reaction vessel to approximately −80° C. and condensing out SF5Cl and any excess Cl2 at reduced pressure.","Cl2 can be removed from the mixture by storage over elemental sulfur and the recovered sulfur chlorides can be used for a new production batch of either SF4 or SF5Cl.","One function of the chlorine in the procedure is to oxidize sulfur to sulfur chlorides (e.g.","S2Cl2, SCl2) as the predominant sulfur species, which exchange chlorine for fluorine with a fluoride.","Thus, it will not be necessary to dispose of sulfur chlorides as waste.","Collectively, the recovered Cl2 as well as the recovered sulfur chlorides and Br2, may be used in a near quantitative fashion, as outlined in the following reactions: 4KF+SCl2+Cl2+(Br2)→SF4+4KCl+(Br2) V. 5KF+SCl2+2Cl2+(Br2)→SF5Cl+5KCl+(Br2) VI.","In the SF4-producing reaction, a small amount of SF5Cl may be formed as a by-product.","In each of the reactions, the function of Br2 may be to provide an improved reaction environment with Br2 possibly acting as a solvent, a reactive solvent or with Cl2 forming BrCl from the Br2+Cl2 upon mixing.","Interestingly, it has been shown previously, that without the addition of Br2, KF+SF4+Cl2 yields, upon intense heating (about 75 to about 150° C. or about 220 to about 300° C.) only variable amounts (about 5 to about 80%) of SF5Cl (Bekker et al., Isw.","Akad.","Nauk U.S.S.R., Bull.","Ser.","Chim.","2575, 1970; U. Jonethal, R. Kuschel, K. Seppelt, J. Fl.","Chem.","88, 3, 1998).","Thus, the Br2 utilized in the present methods alleviates the requirement for excessive temperature (energy input), and also improves both the yield and the consistency of the yield, as well as the overall ease of production.","Moreover, when using S instead of SF4 as the sulfur source to produce SF5Cl, the use of Br2 alleviates both the requirement for SF4 and excessive temperature, as other methods which do not utilize Br2 (excess CsF+S+3 Cl2 at about 175° C.) do not produce meaningful amounts of SF5Cl.","The methods described herein employ the use of Br2 as a solvent or reactive solvent in the production of SF5Cl and SF4, which in turn promotes the transfer of both fluorine and chlorine into the production of the SF5Cl and SF4 end-products.","Alternatively, in the SF5Cl-producing reaction, S and Cl2 may be replaced by sulfur chlorides (e.g.","S2Cl2, SCl2) or SF4, if desired.","In both the SF5Cl- and SF4-producing reactions described herein, when there is insufficient Br2 present, the reactions are either extremely slow or do not progress at all.","Further, in both the SF5Cl- and SF4-producing reactions that utilize Cl2 as a reactant, a Br2 to S molar ratio greater than about 1:1 can be used.","Ratios of from about 1:2 to about 2:1 can also be used.","Particularly useful MFs in the production of SF5Cl and SF4 include, without limitation, CsF, RbF, KF, BaF2, SrF2 and combinations thereof.","In another example embodiment disclosed herein, the synthesis of SF5Br is described.","In the case where SF4 and Br2 are reactants, more than about 1 equivalent of a metal monofluoride (AgF) can be used or about 2 equivalents can be used in the case of a metal difluoride (AgF2).","Example synthesis reactions for SF5Br can proceed as follows: AgF+SF4+Br2→SF5Br+AgBr VII.","2AgF2+4SF4+3Br2→4SF5Br+2AgBr VIII.","These reactions can be run at ambient temperatures (about 10 to about 27° C.) or at temperatures up to those at which SF5Br begins to decompose (about 140 to about 150° C.) and at the autogenous pressures generated in closed reactor vessels.","Highly-reactive and/or costly reactants that are commonly used to synthesize SF5Br, such as, without limitation, S2F10, BrF3, BrF5, CsBrF4 and CsBrF2 are not necessary.","The described reaction can produce yields of about 75% and can theoretically approach 100%, in a time frame of several hours to several days.","Due to the low cost of the reagents used, modifying the reaction to produce lower yields can also be commercially advantageous.","In one embodiment, yields of 50% or higher can be produced.","Other lower yields, such as yields as low as 10%, are also within the scope of embodiments disclosed herein.","The reaction does not create or leave behind undesirable side products.","SF5Br and any excess Br2 can be collected by cooling the reaction vessel to approximately −78° C. and condensing out the SF5Br.","The Br2 can be easily recycled into subsequent reactions including, without limitation, the production of SF5Br, whereas AgBr can be readily reutilized in subsequent reactions including, without limitation, SF5Br reactions by reforming the metal fluoride (without limitation, AgF or AgF2).","In one example embodiment, the present SF5Br production methods can employ only SF4, a MF, for example and without limitation, AgF or AgF2, and Br2 as reactants.","Particularly useful MFs in the production of SF5Br include, without limitation, CeF4, MnF3, PbF4, AgF2, AgF, AuF or a mixture thereof.","Further, the methods described herein for producing SF5Br eliminate inefficient multi-step production protocols that are currently used.","In another example embodiment disclosed herein, the synthesis of SF6 is described.","In the case where SF4 and Br2 are reactants, more than about 2 equivalents of a MF capable of transferring about one fluorine equivalent, such as CoF3, can be used.","An example synthesis reaction for SF6 can proceed as follows: 2CoF3+SF4+(Br2)→SF6+2CoF2+(Br2) IX.","Reaction IX shown above can be run at ambient temperatures or theoretically up to temperatures at which SF4 begins to decompose (about 400 to about 500° C.), and at the autogenous pressures generated in closed reactor vessels.","Electrochemical preparation, high temperatures and pressures as well as highly-reactive and/or costly reactants (without limitation, F2, SF5Cl, IF5, SF4, ClF and HF) that are commonly used to synthesize SF6 can be avoided.","Due to the low cost of the reagents used, modifying the reaction to produce lower yields can also be commercially advantageous.","In one embodiment, yields of 50% or higher can be produced.","Other lower yields, such as yields as low as 10%, are also within the scope of embodiments disclosed herein.","In the described reaction IX, the Br2 can be easily recycled into subsequent reactions including, without limitation, the production of additional SF6, whereas CoF2 can be readily re-fluorinated to CoF3 and reutilized in subsequent SF6 reactions as well as other reactions.","In one example embodiment, the present SF6 production methods can employ only SF4, a MF, for example and without limitation, CeF4, MnF3, PbF4, AgF2, AgF, AuF and mixtures thereof as reactants.","Further, the methods described herein for producing SF6 eliminate inefficient multi-step production protocols that are currently used.","The reactions described herein for producing SF4, SF5Cl, SF5Br and SF6 can be performed at temperatures below those commonly used in the art.","In one example embodiment, the reactions are carried out at or near room (ambient) temperature (about 10 to about 27° C.).","In other embodiments, the temperature is from about 10° C. to about 27° C. (ambient), or from about 27° C. to about 115° C. Higher temperatures can theoretically be used, for example, up to about 250° C. to about 500° C. (up to temperatures at which SF4, SF5Cl and SF5Br decompose).","Additionally, lower temperatures can be used, for example down to about −10° C.; a temperature at which Br2 would solidify.","While permissible, however, these more extreme reaction temperatures are not required.","The reactions described herein for producing SF4, SF5Cl, SF5Br and SF6 can be performed at pressures below those commonly used in the art.","In one example embodiment, the reactions are carried out just above atmospheric pressure, at autogenous pressures that are estimated of only up to about 10 atms.","In other embodiments, at higher temperatures, the pressure is estimated to be from about 10 atm to about 40 atm.","Slightly higher pressures can also be used.","For example, it is estimated that up to about 100 atm could be used.","Additionally, lower pressures can be used, for example down to about 0.5 atms, or about 0.01 atms, or about 0.001 atms.","While permissible, however, these more extreme pressures are not required.","Further, in some embodiments, the reactions for producing SF4, SF5Cl, SF5Br and SF6 described herein can be carried out in one or more physical configuration that increases the reaction surface area of the solid phase reactants.","For example, the solid phase reactants can be spray-dried, finely dispersed, or otherwise subjected to commonly used methods which increase the surface area.","In some example embodiments, the reactants for producing SF4, SF5Cl, SF5Br and SF6 can be physically or mechanically agitated to aid the reactions.","For example, inversion, milling/grinding, ball-milling, stirring, rotation, and the like can be used.","Such mechanical agitation methods can minimize MFBr or MFCl formation that can mask the effective MF reaction surface area and slow the progression of desired reactions.","The methods described herein theoretically can generate SF4, SF5Cl, SF5Br and SF6 at near 100% yields.","In one example embodiment, the yield is between about 57% and about 96%.","In another embodiment the yield is about 95% In another embodiment, the yield is about 75%.","As will be understood by one of ordinary skill in the art, depending on the reactants used and the desired end-products, the conditions of the reaction and the like, the time for a reaction to be substantially complete varies.","Substantially complete means a particular reaction is within about 10% of completion, within about 5% of completion or within about 1% or less of completion.","Reaction times can be as short as about a few hours to as long as about several days or weeks.","In some embodiments, the reactions are substantially complete within less than about 30 days, less than about 17 days, less than about 14 days, less than about 6 days, less than about 4 days, less than about 3 days, less than about 2 days or less than about 1 day.","In other embodiments, the reactions are substantially complete within less than about 8 hours, less than about 4 hours or less than about 3 hours.","Reactions described herein can be modified by those skilled in the art.","As such, altering the order of adding and mixing of reactants and reagents, adjusting relative molar ratios of reactants, as well as altering reaction times, temperatures and pressures, to more precisely control specific reaction outcomes, and maximizing the ease and production of the desired end product are within the scope of the present description.","The following examples are included to demonstrate embodiments of the disclosed methods and processes.","It should be appreciated by those of ordinary skill in the art that the techniques disclosed in the examples which follow represent techniques discovered by the inventor to function well in the practice of the present disclosure, and thus can be considered to constitute preferred modes for its practice.","However, those of ordinary skill in the art should, in light of the present disclosure, appreciate that many changes can be made in the specific embodiments which are disclosed and still obtain a like or similar result.","Example 1.Formation of SF4 Anhydrous fine grain KF powder (about 5.09 g) was dried in a stainless steel 100-ml Hoke bomb tube reactor at about 150° C. to about 200° C., for about 1 hour, at high vacuum (about 0.05 to about 0.1 torr).","The reactor was allowed to cool to ambient temperature, opened, and fine-grain S powder (about 0.69 g) was added.","Cl2 (about 3.13 g) and Br2 (about 1.5 g) were then added to the reactor vessel by condensation to produce a molar ratio of S:Cl2:KF:Br2 of about 1.0:2.0:4.1:0.44.The vessel was kept at ambient temperature overnight and little or no SF5Cl and SF4 were detected from the infrared (IR) spectrum of the gaseous phase.","IR spectrometry was performed using a Model 4020 Galaxy FTIR spectrophotometer (Mattson Instruments, Madison, Wis. 53711, USA).","No change in the IR spectrum was noticed after about four more days.","More Br2 (about 5.5 g) was added to the reactor vessel by condensation to produce a new molar ratio of: S:Cl2:KF:Br2 of about 1:2.0:4.1:2.0.After about 4 days at ambient temperature, a very strong SF4-specific spectral signal was observed (e.g.","band groups centered at about 876 cm−1 and about 730 cm−1), which was accompanied by a very weak SF5Cl IR spectral signal (e.g.","band groups centered at about 909 cm−1, about 855 cm−1 and about 602 cm−1), The reaction displayed a high degree of conversion to SF4, as indicated by the IR spectrum.","This example illustrates that: 1.)","increasing the molar ratio of Br2 appears to promote the formation of SF4, and 2.)","SF4 can be efficiently synthesized within about 4 days at ambient temperatures in the reaction: 4KF+S+2Cl2+(Br2)→SF4+4KCl+(Br2).","Example 2.Formation of SF4 at an Elevated Temperature Anhydrous fine-grain KF powder (about 10.50 g) was dried in a stainless steel 100-ml Hoke bomb tube reactor at about 150° C. to 200° C., for about 1 hour, at high vacuum.","The reactor was allowed to cool to ambient temperature, opened, and fine-grain S powder (about 1.37 g) was added.","Cl2 (about 6.1 g) and Br2 (about 14.3 g) were then added to the reactor vessel by condensation to produce a molar ratio of S:Cl2:KF:Br2 of about 1.00:2.00:4.23:2.09.The vessel was then kept at a temperature of 65-70° C. for 30 days.","Initially, some SF5Cl besides SF4 was detected in the IR spectrum of the gaseous constituents of the reactor bomb tube, but it disappeared in the course of time and no SF5Cl was detected after 30 days, only SF4.","(IR spectrometry was performed).","The reactor vessel bomb tube was cooled to −78° C., and pumped on through a liquid-nitrogen cooled cold trap for two hours.","The crude product (4.6 g) was stored in a reactor vessel bomb tube over sulfur (20 g) for 20 hours to remove excess chlorine that might be present.","After cooling the sulfur-treatment vessel to −78° C., the product was collected in a cold trap (liquid nitrogen) as before.","A yellow tinge was removed by treatment with Hg.","The final mass of the recovered SF4 end product was about 4.08 g for a calculated yield of about 88% (based upon sulfur).","The final SF4 product appeared as a colorless liquid (when cold), showing the characteristic bands of SF4 in the IR spectrum.","This example illustrates that: 1.)","increasing the temperature appears to promote the formation of SF4, and 2.)","SF4, free of SF5Cl, can be efficiently synthesized in the reaction: 4KF+S+2Cl2+(Br2)→SF4+4KCl+(Br2) Example 3.Alternate Formation of SF4 in the Absence of Cl2 Anhydrous fine-grain KF (about 24.2 g) was dried in a stainless steel 300-ml Hoke bomb tube reactor at about 150° C. to about 200° C., for about 1 hour, at high vacuum.","The reactor was allowed to cool to ambient temperature, opened, and fine-grain S powder (about 3.24 g) was added.","Br2, representing a molar ratio of S to Br2 of greater than about two (about 86.4 g), was then added to the reactor vessel by condensation to produce a final molar ratio of S:KF:Br2 of about 1.00:4.10:5.30.After about 3 days at ambient temperature, a strong SF4IR spectral signal was observed and the reaction displayed a high degree of conversion to SF4.After an additional 3 days at ambient temperature, no significant change was noticed in the IR spectrum.","The final SF4 product was isolated as follows: The reaction vessel was cooled on a dry ice bath (about −78° C.) and connected via a liquid nitrogen cold trap (about −196° C.) to a vacuum pump.","After about 1.5 hours, about 11.5 grams of a light brown, presumably bromine-contaminated crude product was obtained.","To remove residual contaminants (e.g.","Br2, Sulfur Bromides), the crude product was condensed into a large glass pressure vessel containing about 10 grams of Hg to remove trace amounts of any discoloring contaminants (i.e.","e.g.","Br2).","After brief shaking at about 0° C., the product was condensed into a cold trap and obtained as a colorless liquid.","The final mass of the recovered end product was about 10.5 g for a calculated yield of about 96% (based upon sulfur).","The IR spectrum of the end product revealed a substantially pure sample of SF4, with a small contamination by SOF2 (e.g.","band groups centered at about 1340 cm−1 and about 808 cm−1 and about 750 cm−1).","This example illustrates that: SF4 can be efficiently synthesized in the absence of Cl2 within about 3 days at ambient temperatures, in the reaction: 4KF+S+2Br2→SF4+4KBr Example 4.Alternate Formation of SF4 Using Coarse-Grain KF and Agitation by Ball-Milling Anhydrous coarse grain KF (about 28.1 g) was dried in a stainless steel 300-ml Hoke bomb tube reactor containing 19, ½ inch 316 grade stainless steel balls, at about 150° C. to about 200° C., for about 1 hour, at high vacuum.","The reactor was allowed to cool to ambient temperature, opened, and fine-grain S powder (about 3.8 g) was added.","Bromine, (about 63.1 g), was then added to the reactor vessel to produce a final molar ratio of S:KF:Br2 of about 1.00:4.10:3.30.After rotating the reaction vessel for about 4 days at ambient temperature, a strong SF4 IR spectral signal was observed and the reaction displayed a high degree of conversion to SF4.The final SF4 product was isolated as follows: The reaction vessel was cooled to about −78° C. and connected via a cold trap (about −196° C.) to a vacuum pump.","After about 5 hours, about 9.8 grams of a light brown, presumably bromine-contaminated crude product was obtained.","A low temperature vacuum transfer was performed, yielding a very light brown liquid.","The final mass of the recovered SF4 end product was estimated about 7.3 g for a calculated yield of about 57% (based upon sulfur).","The IR spectrum of the end product revealed a substantially pure sample of SF4, with a small contamination by SOF2.This example illustrates that: SF4 can be efficiently synthesized in the absence of Cl2 using coarse-grain KF and ball-milling agitation within about 4 days at ambient temperatures, in the reaction: 4KF+S+2Br2→SF4+4KBr Example 5.Alternate Formation of SF4 at Elevated Temperature Anhydrous fine-grain KF (about 17.1 g) was dried in a stainless steel 300-ml Hoke bomb tube reactor at about 150° C. to about 200° C., for about 1 hour under high vacuum.","The reactor was allowed to cool to ambient temperature, opened, and fine-grain S powder (about 2.3 g) was added.","Br2 (about 36.3 g), was then added to the reactor vessel to produce a final molar ratio of S:KF:Br2 of about 1.00:4.10:3.20.The reactor vessel was heated to about 60° C. for about 3 hours and the formation SF4 product was monitored by IR spectroscopy.","The reaction vessel was cooled to about −78° C. and the SF4 product was pumped into a liquid nitrogen cold trap.","The mass of the crude SF4 product indicated about 50% chemical yield.","After recondensation of the SF4 product into the reaction vessel, it was heated for another about 2 hours at about 72° C., and another about 4 hours at about 80 to about 86° C. Isolation of the SF4 product was accomplished by cooling the reaction vessel to about −78° C. and pumping under high vacuum for about 1.5 hours into a liquid nitrogen cold trap.","Debromination was performed by brief shaking in large Carius tube containing about 20 g. of Hg at about 0° C. About 6.7 grams of purified SF4 was recovered containing a small amount of SOF2, as judged by IR spectroscopy.","The final calculated yield was about 86% (based upon sulfur).","This example illustrates that SF4 can be efficiently synthesized at mildly elevated temperature, within about 9 hours, in the reaction: 4KF+S+2Br2→SF4+4KBr Example 6.Alternate Formation of SF4 while Limiting Br2 Anhydrous fine grain KF (about 24.12 g) was dried in a stainless steel 300-ml Hoke bomb tube reactor at about 150° C. to about 200° C., for about 1 hour, at high vacuum.","The reactor was allowed to cool to ambient temperature, opened, and fine-grain S powder (about 3.16 g) was added.","Br2 (about 31.1 g), was then added to the reactor vessel to produce a final molar ratio of S:KF:Br2 of about 1.00:4.21:1.97.The reaction vessel was then cooled with liquid nitrogen and evacuated.","The reaction vessel was kept at ambient temperature for about 6 days, and then heated at about 80° C. for about 8 hours.","The reaction vessel was cooled to about −78° C. and the volatile material was pumped into a liquid nitrogen cooled cold trap until transfer apparently ceased.","The contents of the cold trap were transferred to a second cold trap, leaving a brown residue in the first cold trap.","The transferred material was condensed into a large glass pressure vessel containing about 10 grams of Hg to remove trace amounts of.","Br2.About 7.31 g of colorless product was again condensed into a liquid nitrogen cooled cold trap.","The recovered end product appeared as colorless product of about 7.31 g mass, for a calculated yield of about 70% (based upon Br2).","The IR spectrum of the end product revealed a substantially pure sample of SF4.This example illustrates that it is advantageous to use more than the required stoichiometric amount of bromine in the reaction: 4KF+S+2Br2→SF4+4KBr Example 7.Formation of SF5Cl Anhydrous fine grain CsF (about 10.95 g) was dried under high vacuum at about 100° C. in a stainless steel 300-ml Hoke bomb tube reactor, whereupon SF4 (about 9.17 g), Cl2 (about 3.20 g) and bromine (about 36.8 g) were added consecutively by vacuum condensation at liquid-nitrogen temperature (about −196° C.) to produce a molar ratio of SF4:CsF:Cl2:Br2 of about 1.00:0.85:0.53:2.71.The vessel was set aside at ambient temperature for about 5 days, and an IR spectrum of the gaseous constituents showed very strong bands or band groups corresponding to SF5Cl.","This example illustrates that SF5Cl can be efficiently synthesized within about 5 days at ambient temperatures using Cl2, Br2, and SF4, in the reaction: CsF+SF4+Cl2+(Br2)→SF5Cl+CsCl+(Br2).","Example 8.Alternate Formation of SF5Cl Using a Different Metal Fluoride KF (about 5.0 g) was dried at about 150° C. to about 200° C. in a stainless steel 100-ml Hoke bomb tube reactor, for about 1 hour, at high vacuum.","Br2 (about 9.71 g), Cl2 (about 3.54 g) and SF4 (about 4.71 g) were added to the bomb tube reactor by condensation to produce a molar ratio of: SF4:Cl2:KF:Br2 of about 1.00:1.14:1.98:1.39.The reaction appeared almost complete after about 2 days at ambient temperature, as determined from the IR spectrum (i.e.","a strong SF5Cl to SF4 IR spectral signals was observed).","The reactants were then heated for about 2 days at about 115° C., and an IR spectrum of the gaseous phase showed very little signal corresponding to SF4.This example illustrates that SF5Cl can be efficiently synthesized within about 2 to about 4 days at ambient or mildly elevated temperatures using Cl2, Br2, and SF4, in the reaction: KF+SF4+Cl2+(Br2)→SF5Cl+KCl+(Br2).","Example 9.Alternate Formation of SF5Cl Using S Instead of SF4 KF (about 15.60 g) was added to a stainless steel 300-ml Hoke bomb tube reactor and dried at about 150° C. to about 200° C., for about 1 hour, at high vacuum.","The bomb reactor was opened and fine-grain S powder (about 1.50 g) was added.","After resealing the reactor, Cl2 (about 9.03 g) and Br2 (about 8.59 g) were added by condensation to produce a molar ratio of: S:Cl2:KF:Br2 of about 1.00:2.71:5.71:1.15.The pressure reactor was kept at ambient temperature overnight and both SF5Cl and SF4 were detected from the IR spectrum.","No change in the IR spectrum was noticed after about three days.","More Cl2 was added (about 1.20 g), bringing the molar ratio to: S:Cl2:KF:Br2 of about 1.00:3.26:5.72:1.15.The reaction was occasionally monitored by IR spectroscopy.","After about two more weeks at ambient temperature, the reaction was substantially complete as judged by IR spectrometry.","This example illustrates that 1.)","compared to other SF4-producing reactions, increasing the molar ratios of Cl2 and KF promotes the production of SF5Cl over SF4 in this reaction, and 2.)","SF5Cl can be efficiently synthesized, at ambient temperatures within weeks, in the reaction: 5KF+S+3Cl2+(Br2)→SF5Cl+5KCl.","Example 10.Formation of SF5Cl KF (about 10.55 g) was dried under high vacuum in a stainless steel 100-ml Hoke bomb tube reactor and dried for about 1 hour at about 150° C. to about 200° C. The reactor was opened and fine-grain S powder (about 1.13 g) was added.","After resealing the reactor, Cl2 (about 8.15 g) and Br2 (about 7.99 g) were added by condensation to produce a stoichiometric ratio of S:Cl2:KF:Br2 of about 1.00:3.25:5.15:1.41 (reaction “A”).","A second, similar reaction was prepared utilizing about 1.58 g of fine-grain S powder and the same molar ratios of the other constituents (reaction “B”).","The reaction “A” and “B” vessels were placed at ambient temperature for about 3 days and the successful production of SF4 and SF5Cl was noted by IR spectroscopy.","Thereafter, SF4 and SF5Cl were monitored every 2 to about 3 days by IR spectroscopy, and by about day 13, it was evident that the reaction was not at completion, and that the production of SF4 and SF5Cl had slowed significantly.","The volatile components of both reaction vessels were then condensed and combined into a third vessel containing about 7.94 grams of KF.","After about 4 more days at ambient temperature, IR spectroscopy revealed that all the remaining SF4 appeared to have been consumed, leaving SF5Cl as the apparent sole product.","The final product was isolated in the following manner: 1.)","The reaction vessel was cooled to about −78° C. and connected via a cold trap (about −196° ° C.) to a vacuum pump.","After about 6 hours, about 15.5 grams of a light yellowish crude product was obtained.","To remove residual contaminants (e.g.","Cl2, Br2, Sulfur Chlorides), the crude product was kept overnight in a pressure reactor, over about 3 grams of S. The product was pumped out of this vessel, cooled to about −78° C. and connected via a cold trap (about −196° C.) to a pump and then condensed into a large cold trap containing a small amount of mercury to remove trace amounts of any discoloring contaminants (e.g.","Br2, Sulfur Chlorides).","The product was obtained as a colorless liquid.","The final mass of the recovered end product was about 13.10 g for a calculated yield of about 95% (based upon Sulfur).","The IR spectrum of the end product revealed a pure sample of SF5Cl.","This example illustrates that 1.)","Additional KF may be required to recharge the SF5Cl-producing reaction and drive it to completion or near completion.","2.)","The production of SF5Cl may be slowed by a reduction of reaction-accessible KF, perhaps due to the buildup of unreactive KCl on the exposed surfaces of the KF; which may be rectified by the addition of fresh KF, agitation of the reaction vessel, or other methods that may increase reactive surface area of the KF over the reaction time.","3.)","From the reaction: 5KF+S+3Cl2+(Br2)→SF5Cl+5KCl+(Br2) it is possible to reach complete, or substantially complete SF5Cl production within about 2 to about 3 weeks at ambient temperature, yielding substantially pure SF5Cl.","Example 11.Formation of SF5Cl KF (about 10.58 g) was dried under high vacuum for about 1 hour at about 150° C. to about 200° C., in a stainless steel 300-ml Hoke bomb tube pressure reactor.","The reactor was opened and S (about 1.1 g) was added.","After resealing the reactor, Cl2 (about 9.0 g) was added by condensation to produce a stoichiometric ratio of S:Cl2:KF of about 1.00:3.70:5.30.The reaction vessel was set aside at ambient temperature and no production of either SF4 or SF5Cl was detected by IR spectroscopy after about 30 days.","Br2 (about 7.54 g) was then added by condensation to produce a new stoichiometric ratio of S:Cl2:KF:Br2 of about 1.00:3.70:5.30:1.37.After about 3 days at ambient temperature, production of both SF4 and SF5Cl was noted by IR spectroscopy.","This example illustrates that 1.)","Although all the chemical elements required for production of SF4 and SF5Cl were present in the reaction vessel for a duration of about 30 days, no production of SF4 or SF5Cl was noted in the absence of Br2 at ambient temperature.","2.)","After the necessary components (S, Cl2, KF) of the reaction remained unreactive for 30 days, the subsequent addition of Br2, within days, promoted the efficient formation of SF4 and SF5Cl at ambient temperatures.","3.)","Br2 appears to be required for the efficient ambient temperature production of SF4 and SF5Cl from the reactants KF, S and Cl2.Example 12.Formation of SF5Br AgF (about 11.02 g) was dried under high vacuum at about 150 to about 200° C. Br2 (about 35.5 g) and SF4 (about 7.3 g) were added to a 300-ml Hoke bomb tube pressure reactor by condensation to produce a molar ratio of: SF4:AgF:Br2 of about 1.00:1.28:3.30.The reaction vessel was then placed into an about 100° C. boiling water bath and subsequently monitored by IR spectroscopy at about 2, about 6.5, about 15 and about 79 hours.","The IR spectra indicated a progressive accumulation of SF5Br (e.g.","band groups centered at about 891 cm−1 and about 854 cm−1 and about 594 cm−1), and a reduction in SF4, as exemplified by observing an increasing ratio of SF5Br to SF4 IR spectral signals over time.","The final product was isolated in the following manner: The reaction vessel was cooled to about −78° C. and connected via a cold trap (about −196° C.) to a vacuum pump.","After about 3 hours, about 9.3 grams of a light yellowish crude product was obtained in the cold trap.","The product was vacuum transferred from the cold trap to a Carius tube containing a small amount of mercury to remove trace amounts of any discoloring contaminants (e.g.","Br2).","The product was obtained as a pale straw-yellow liquid.","The final mass of the recovered end product was about 8.55 g for a calculated yield of about 75.4% (based upon SF4).","The IR spectrum of the end product revealed a substantially pure sample of SF5Br.","This example illustrates that: 1.)","SF5Br can be efficiently synthesized within about 79 hours at 100° C. in the reaction: AgF+SF4+Br2→SF5Br+AgBr Example 13.Formation of SF5Br Using an Alternate Metal Fluoride AgF2 (about 2.33 g) was dried under high vacuum at about 150 to about 200° C. in a 100-ml Hoke bomb tube pressure reactor.","Br2 (about 12.95 g) and SF4 (about 3.14 g) were added to the reactor by condensation to produce a molar ratio of: SF4: AgF2: Br2 of about 1.00:0.55:2.78.The reaction vessel was then placed at 100° C. and subsequently monitored by IR spectroscopy at about 52 hours.","The IR spectrum indicated very strong bands or band groups indicative of SF5Br, very weak bands or band groups corresponding to SF4 and SOF2 and medium-strength bands or band groups corresponding to SF6 (e.g.","medium-strength band centered at about 947 cm−1).","This example illustrates that: 1.)","SF5Br can be efficiently synthesized within about 52 hours at about 100° C. in the reaction: 2AgF2+4SF4+3Br2→4SF5Br+2AgBr Example 14.Formation of SF6 CoF3 (about 4.2 g) was dried under high vacuum at about 150 to about 200° C. in a 100-ml Hoke bomb tube pressure reactor.","Br2 (about 22.0 g) and SF4 (about 4.63 g) were added to the pressure reactor by condensation to produce a molar ratio of: SF4: CoF3: Br2 of about 1.00:0.84:3.21.The reaction vessel was then placed at about 100° C. and subsequently monitored by IR spectroscopy at about 52 hours.","The IR spectrum indicated strong bands or band groups indicative of SF6 moderate-strength bands or band groups corresponding to SF4 and weak bands or band groups corresponding to SOF2.No indication of SF5Br was evident form the IR spectrum.","This example indicates that: 1.)","SF6 can be efficiently synthesized within about 52 hours at about 100° C. in the reaction: 2CoF3+SF4+(Br2)→SF6+2CoF2+(Br2) Example 15.Comparative Example To determine if an alternate MF could efficiently replace KF as a reactant in the production of SF4, anhydrous fine-grain NaF (about 16.94 g) was dried in a stainless steel Hoke bomb tube pressure reactor at about 150° C. to about 200° C., for about 1 hour, at high vacuum.","The reactor was allowed to slowly cool to ambient temperature, opened, and sulfur (about 2.17 g) was added.","Br2 (about 29.5 g), was then added to the reactor vessel to produce a final molar ratio of S:NaF:Br2 of about 1.00:5.90:2.70.After about 2 days at ambient temperature, no SF4 was evident as measured by IR spectroscopy of the gaseous constituents removed from the reaction vessel.","The reaction vessel was then heated to about 80° C. for about 18 hours, IR spectroscopy of the gaseous constituents again revealed that no reaction products (SF4, SOF2) were present.","The reaction vessel was subsequently heated to about 155° C. for about 18 hours, IR spectroscopy of the gaseous constituents revealed very low levels SOF2 and no SF4, suggesting the formation of only traces of SF4, which were apparently hydrolyzed by the minuscule amount of water introduced into the reaction vessel.","Example 16.Comparative Example To determine if an alternate MF could efficiently replace KF as reactant in the production of SF5Cl from SF4, a 100-ml stainless steel Hoke bomb tube reactor was charged with NaF (about 10.19 g), and after drying under high vacuum as described above, the reactor was then charged with chlorine (about 4.77 g), bromine (about 11.57 g) and SF4 (about 14.61 g), consecutively, by vacuum condensation.","The molar ratio of SF4:NaF:Cl2:Br2 equaled about 1.00:1.79:1.10:1.50.The reaction was allowed to occur without agitation at ambient temperature for about 11 days, after which time no reaction was apparent from the IR spectrum.","Heating of the reaction vessel for an additional about 9 days at about 115 to about 125° C. did not result in the formation of SF5Cl, as indicated by IR spectroscopy.","Example 17.Comparative Example CuF2 (about 4.59 g) was dried for about 1 hour under high vacuum at about 150 to about 200° C. Br2 (about 18.9 g) and SF4 (about 3.21 g) were added to the pressure reactor by condensation to produce a molar ratio of: SF4: CuF2: Br2 of about 1.00:1.54:3.72.The reaction vessel was then placed at about 100° C. and subsequently monitored by IR spectroscopy at about 52 hours.","The IR spectrum indicated that no reaction had occurred.","Example 18.Comparative Example TlF (about 4.23 g) was dried under high vacuum at about 150 to about 200° C., for about 1 hour.","Br2 (about 7.6 g) and SF4 (about 1.38 g) were added to the pressure reactor by condensation to produce a molar ratio of: SF4:TlF:Br2 of about 1.00:1.49:3.86.The reaction vessel was then placed at 100° C. and subsequently monitored by IR spectroscopy at about 52 hours.","The IR spectrum indicated that no reaction had occurred.","Unless otherwise indicated, all numbers expressing quantities of ingredients, properties such as molecular weight, reaction conditions, and so forth used in the specification and claims are to be understood as being modified in all instances by the term “about.” Accordingly, unless indicated to the contrary, the numerical parameters set forth in the specification and attached claims are approximations that may vary depending upon the desired properties sought to be obtained by the present invention.","At the very least, and not as an attempt to limit the application of the doctrine of equivalents to the scope of the claims, each numerical parameter should at least be construed in light of the number of reported significant digits and by applying ordinary rounding techniques.","Notwithstanding that the numerical ranges and parameters setting forth the broad scope of the invention are approximations, the numerical values set forth in the specific examples are reported as precisely as possible.","Any numerical value, however, inherently contains certain errors necessarily resulting from the standard deviation found in their respective testing measurements.","The terms “a,” “an,” “the” and similar referents used in the context of describing the invention (especially in the context of the following claims) are to be construed to cover both the singular and the plural, unless otherwise indicated herein or clearly contradicted by context.","Recitation of ranges of values herein is merely intended to serve as a shorthand method of referring individually to each separate value falling within the range.","Unless otherwise indicated herein, each individual value is incorporated into the specification as if it were individually recited herein.","All methods described herein can be performed in any suitable order unless otherwise indicated herein or otherwise clearly contradicted by context.","The use of any and all examples, or exemplary language (e.g., “such as”) provided herein is intended merely to better illuminate the invention and does not pose a limitation on the scope of the invention otherwise claimed.","No language in the specification should be construed as indicating any non-claimed element essential to the practice of the invention.","Groupings of alternative elements or embodiments of the invention disclosed herein are not to be construed as limitations.","Each group member may be referred to and claimed individually or in any combination with other members of the group or other elements found herein.","It is anticipated that one or more members of a group may be included in, or deleted from, a group for reasons of convenience and/or patentability.","When any such inclusion or deletion occurs, the specification is deemed to contain the group as modified thus fulfilling the written description of all Markush groups used in the appended claims.","Certain embodiments of this invention are described herein, including the best mode known to the inventors for carrying out the invention.","Of course, variations on these described embodiments will become apparent to those of ordinary skill in the art upon reading the foregoing description.","The inventor expects skilled artisans to employ such variations as appropriate, and the inventors intend for the invention to be practiced otherwise than specifically described herein.","Accordingly, this invention includes all modifications and equivalents of the subject matter recited in the claims appended hereto as permitted by applicable law.","Moreover, any combination of the above-described elements in all possible variations thereof is encompassed by the invention unless otherwise indicated herein or otherwise clearly contradicted by context.","Furthermore, numerous references have been made to patents and printed publications throughout this specification.","Each of the above-cited references and printed publications are individually incorporated herein by reference in their entirety.","In closing, it is to be understood that the embodiments of the invention disclosed herein are illustrative of the principles of the present invention.","Other modifications that may be employed are within the scope of the invention.","Thus, by way of example, but not of limitation, alternative configurations of the present invention may be utilized in accordance with the teachings herein.","Accordingly, the present invention is not limited to that precisely as shown and described."]],"string":"[\n [\n \"Bromine-Facilitated Synthesis of Fluoro-Sulfur Compounds\",\n \"Described herein are methods for the bromine-facilitated synthesis of fluoro-sulfur compounds, that include SF4, SF5Cl, SF5Br and SF6.\",\n \"The methods described herein generally require lower temperature and pressure, produce higher yields, require less time, do not use corrosive or costly reactants and solvents that are commonly used in the synthesis of the fluoro-sulfur compounds, and do not produce deleterious waste products when compared to previously-used methods.\"\n ],\n [\n \"1.-17.\",\n \"(canceled) 18.A method comprising: admixing a Br2 reactant, an SF4 reactant, and a CoF3 reactant, thereby initiating a reaction that produces SF6.19.The method of claim 18, wherein the reaction takes place at temperatures from about 10° C. to about 400° C. 20.The method of claim 18, wherein the reaction takes place at temperatures from about 10° C. to about 100° C. 21.The method of claim 18, wherein the SF6 is produced at a yield from about 10% to less than about 100%.\",\n \"22.The method of claim 18, wherein the SF6 is produced at a yield of greater than about 50%.\",\n \"23.The method of claim 18, wherein the admixing occurs at a stoichiometric ratio of about 2 CoF3 to about 1 Br2 to about 1 SF4.24.The method of claim 18, wherein the SF6 is produced at a yield of at least about 10% within about 52 hours.\",\n \"25.The method of claim 18, wherein the reaction occurs in the absence of F2, SF5Cl, IF5, ClF HF, or combinations thereof.\",\n \"26.The method of claim 18, wherein the SF6 is produced at a yield from about 10% to less than 100% within about 52 hours at temperatures from about 10° C. to about 400° C. 27.A method comprising: admixing a Br2 reactant, an SF4 reactant, and a metal fluoride reactant, thereby initiating a reaction that produces SF6 at temperatures from about 10° C. to about 100° C. 28.The method of claim 27, wherein admixing the Br2 reactant, the SF4 reactant, and the metal fluoride reactant takes place in a single stage.\",\n \"29.The method of claim 27, wherein the metal fluoride reactant is selected from CoF3, CeF4, MnF3, PbF4, AgF2, AgF, AuF, or combinations thereof.\",\n \"30.The method of claim 27, wherein the reaction proceeds at temperatures from about 10° C. to about 27° C. 31.The method of claim 27, wherein the reaction proceeds at temperatures from about 27° C. to about 100° C. 32.The method of claim 27, wherein the reaction occurs in the absence of F2, SF5Cl, IF5, ClF HF, or combinations thereof.\",\n \"33.The method of claim 27, wherein the SF6 is produced at a yield from about 10% to less than 100%.\",\n \"34.The method of claim 27, wherein the SF6 is produced at a yield of at least about 10% to less than 100% within about 52 hours 35.The method of claim 27, wherein the SF6 is produced at a yield from about 10% to less than 100% in less than 3 days.\",\n \"36.The method of claim 27, wherein the SF6 is produced at a yield from about 50% to less than 100%.\",\n \"37.The method of claim 27, wherein the metal fluoride reactant is CoF3 and the mixing occurs at a stoichiometric ratio of about 2 CoF3 to about 1 Br2 to about 1 SF4.\"\n ],\n [\n \" BACKGROUND OF THE INVENTION A number of fluoro-sulfur compounds have beneficial applications.\",\n \"For example, sulfur tetrafluoride (SF 4 ) is a widely-used compound produced yearly at the metric ton level, which can be utilized as a deoxofluorinating reagent in converting carboxylic acids, aldehydes, some alcohols and ketones into their corresponding deoxofluorine derivatives (i.e.\",\n \"R—CF 3 , R—CHF 2 , RF, RR′—CF 2 ).\",\n \"SF 4 is also utilized as an etching agent in the electronics industry.\",\n \"Moreover, SF 4 can be utilized as a precursor for the synthesis of other important fluorinated products such as, without limitation, pentafluorosulfur chloride (SF 5 Cl), pentafluorosulfur bromide (SF 5 Br), and sulfur hexafluoride (SF 6 ).\",\n \"Sulfur hexafluoride (SF 6 ), is a compound that is produced by the thousands of metric tons each year, and its worldwide uses include: acting as a PCB replacement and an inert dielectric medium for electrical equipment, the etching of semiconductors, the casting of magnesium, the manufacture of thermal windows, a source of thrust in some rocket propulsion systems, the tracing of air flow through industrial systems, a tamponade for retinal holes of the eye and in medical imaging.\",\n \"Compounds harboring fluoro-organic modifications such as R—CF 3 , R—CHF 2 , RF, RR′—CF 2 and RSF 5 , have been used in a variety of applications including fluorinated therapeutic and diagnostic drugs, pesticides, herbicides, antibiotics, perfluorinated blood substitutes, fungicides, polymer solvents, polymers, lubricants, liquid crystals, surface-active agents, high-boiling solvents, stable solvents, electrically conducting polymers and the like.\",\n \"Utilizing an SF 5 group in the place of CF 3 offers many advantages.\",\n \"Particularly, the SF 5 group possesses greater electronegativity than CF 3 .\",\n \"Moreover, compounds containing SF 5 may be further distinguished by their outstanding chemical properties including high to extreme chemical and thermal stability, hydro- and oleophobicity, lipophilicity, high-density, reduction of shock sensitivity in explosives, low boiling point, low polarizability and low surface tension.\",\n \"While SF 5 -derivatives offer these advantages, they have been difficult to synthesize.\",\n \"The difficulty of obtaining such compounds is in part related to the difficulty of obtaining sufficient and affordable quantities of SF 5 Cl or SF 5 Br, which are the principal chemical reagents used to synthesize and obtain a number of organic or inorganic derivatives that bear the SF 5 -radical moiety.\",\n \"SF 5 Cl, particularly, is a valuable reactant to produce SF 5 -radical bearing derivatives of (sulfur hexafluoride) SF 6 and may be reduced to disulfur decafluoride (S 2 F 10 ) with the latter being converted into pentafluorosulfur bromide (SF 5 Br).\",\n \"SF 5 Cl can also be used in the synthesis of SF 6 .\",\n \"It is of interest that SF 5 Cl can be particularly used in the manufacture of SF 6 by a pyrogenic route (e.g.\",\n \"U.S. Pat.\",\n \"No.\",\n \"4,390,511), whereby a disproportionation occurs according to the following reaction: in-line-formulae description=\\\"In-line Formulae\\\" end=\\\"lead\\\"?\",\n \"SF 5 Cl→½SF 6 +½SF 4 +½Cl 2 in-line-formulae description=\\\"In-line Formulae\\\" end=\\\"tail\\\"?\",\n \"In this method, SF 6 is obtained that is free of S 2 F 10 , a compound believed to be highly toxic and a by-product of the manufacture of SF 6 by the reaction of sulfur with fluorine.\",\n \"Accordingly, the use of SF 5 Cl can be used to produce high purity SF 6 .\",\n \"Collectively, a variety of methods have been demonstrated as processes for the production of SF 6 and include U.S. Pat.\",\n \"Nos.\",\n \"2,883,267, 2,912,307, 3,054,661, 3,345,277, 3,399,036, 3,373,000, 4,390,511, 5,639,435 and Japanese Patent No.\",\n \"7,625,497.These methods frequently employ electrochemical preparation, high reaction temperatures and pressures, and/or utilize highly-reactive and/or costly reactants that can include F 2 , SF 5 Cl, IF 5 , SF 4 , ClF and HF.\",\n \"SF 5 Br is also a valuable chemical compound that has been demonstrated as a reactant for the efficient production of SF 5 -radical bearing chemicals; also known as derivatives of SF 6 .\",\n \"Currently available methods of producing fluoro-sulfur compounds suffer a number of drawbacks.\",\n \"The drawbacks generally include the use of excessive temperatures, electrochemical preparation, expensive and/or hazardous reactants, the requirement for numerous successive steps or long reaction times, the production of low or variable yields and/or the generation of toxic by-products.\",\n \"Accordingly, there is room for improvement in the synthesis of fluoro-sulfur compounds.\"\n ],\n [\n \" SUMMARY OF THE INVENTION Described herein are methods for the synthesis of fluoro-sulfur compounds, more specifically SF 4 , SF 5 Cl, SF 5 Br and SF 6 .\",\n \"The methods described herein generally require lower temperatures and pressure, produce high yields, in some cases require less time, do not use highly reactive oxidants or costly reactants and solvents that are commonly used in the synthesis of fluoro-sulfur compounds, and do not produce deleterious waste products when compared to previously-used methods.\",\n \"One embodiment disclosed herein includes a method of producing a fluoro-sulfur compound or a compound made using the produced fluoro-sulfur compound comprising: admixing Br 2 , a metal fluoride reactant, and a sulfur reactant thereby initiating a reaction that produces a yield of the fluoro-sulfur compound of greater than about 10%.\",\n \"In another embodiment, the admixing further includes Cl 2 .\",\n \"In another embodiment, the reaction proceeds at temperature of about 10 to about 400° C. In another embodiment, either S 2 F 10 or BrF, BrF 3 , BrF 5 , CsBrF 4 , CsBrF 2 , acetonitrile, Dioxane, ClF, ClF 3 , NOF, HF, F 2 , (HF) n .amine, IF 5 or combinations thereof are not added to the reaction.\",\n \"Embodiments disclosed herein also include methods of producing SF 4 or a compound made using the produced SF 4 .\",\n \"In one embodiment the method includes admixing a sulfur reactant, a metal fluoride reactant, and a Br 2 reactant thereby initiating a reaction that produces SF 4 at a yield of greater than about 10%.\",\n \"In another embodiment of producing SF 4 or a compound made using the produced SF 4 , the reaction proceeds at a temperature of about 10 to about 400° C. In another embodiment of producing SF 4 or a compound made using the produced SF 4 , the sulfur reactant is S and the metal fluoride is KF and the admixing occurs at a stoichiometric ratio of about 4KF to about 2Br 2 to about 1 S and the reaction proceeds at a temperature of about 10 to about 400° C. In another embodiment of producing SF 4 or a compound made using the produced SF 4 , the metal fluoride is an alkaline earth metal fluoride, an alkali metal fluoride, CsF, RbF, KF, BaF 2 , SrF 2 or a combination thereof and/or the sulfur reactant is S, S 2 Cl 2 , SCl 2 , S 2 Br 2 , SBr 2 or a combination thereof.\",\n \"In an additional embodiment of producing SF 4 or a compound made using the produced SF 4 , the method includes admixing a sulfur reactant, a metal fluoride reactant, a Cl 2 reactant and a Br 2 reagent thereby initiating a reaction that produces SF 4 at a yield of greater than about 10%.\",\n \"In another embodiment of producing SF 4 or a compound made using the produced SF 4 , the reaction proceeds at a temperature of about 10 to about 400° C. In another embodiment of producing SF 4 or a compound made using the produced SF 4 , the sulfur reactant is S and the metal fluoride is KF and the admixing occurs at a stoichiometric ratio of about 4KF to about 1 Br 2 to about 1 S to about 2Cl 2 or the sulfur reactant is SCl 2 and the metal fluoride is KF and the admixing occurs at a stoichiometric ratio of about 4KF to about 1 Br 2 to about 1 SCl 2 to about 1 Cl 2 and the reaction proceeds at a temperature of about 10 to about 400° C. In another embodiment of producing SF4 or a compound made using the produced SF 4 , the metal fluoride is an alkaline earth metal fluoride, an alkali metal fluoride, CsF, RbF, KF, BaF 2 , NaF, SrF 2 or a combination thereof and/or the sulfur reactant is S, S 2 Cl 2 , SCl 2 , S 2 Br 2 , SBr 2 or a combination thereof.\",\n \"Embodiments disclosed herein also include methods of producing SF 5 Cl or a compound made using the produced SF 5 Cl.\",\n \"In one embodiment the method includes admixing a Cl 2 reactant, a sulfur reactant, a metal fluoride reactant, and Br 2 reagent thereby initiating a reaction that produces the SF 5 Cl at a yield of greater than about 50%.\",\n \"In another embodiment of producing SF 5 Cl or a compound made using the produced SF 5 Cl, the reaction proceeds at a temperature of about 10 to about 200° C. In another embodiment of producing SF 5 Cl or a compound made using the produced SF 5 Cl, the sulfur reactant is S and the metal fluoride is KF and the admixing occurs at a stoichiometric ratio of about 5KF to about 1 Br 2 to about 1 S to about 3Cl 2 or the sulfur reactant is SF 4 and the metal fluoride is KF and the admixing occurs at a stoichiometric ratio of about 1KF to about 1 Br 2 to about 1 SF 4 to about 1Cl 2 or the sulfur reactant is SCl 2 and the metal fluoride is KF and the admixing occurs at a stoichiometric ratio of about 5KF to about 1 Br 2 to about 1 SCl 2 to about 2Cl 2 and the reaction proceeds at a temperature of about 10 to about 200° C. In another embodiment of producing SF 5 Cl or a compound made using the produced SF 5 Cl, the metal fluoride is an alkaline earth metal fluoride, an alkali metal fluoride, CsF, RbF, KF, BaF 2 , SrF 2 or a mixture thereof and/or the sulfur reactant S, S 2 Cl 2 , SCl 2 , SF 4 or a combination thereof.\",\n \"Embodiments disclosed herein also include methods of producing SF 5 Br or a compound made using the produced SF 5 Br.\",\n \"In one embodiment the method includes admixing a Br 2 reactant, a sulfur reactant, and a metal fluoride reactant thereby initiating a reaction that produces SF 5 Br at a yield of greater than about 50%.\",\n \"In another embodiment of producing SF 5 Br or a compound made using the produced SF 5 Br, either S 2 F 10 or BrF, BrF 3 , BrF 5 , CsBrF 4 , CsBrF 2 or mixtures thereof are not added to the reaction.\",\n \"In another embodiment of producing SF 5 Br or a compound made using the produced SF 5 Br, the reaction proceeds at a temperature of about 10 to about 140° C. In another embodiment of producing SF 5 Br or a compound made using the produced SF 5 Br, the sulfur reactant is SF 4 and the metal fluoride is AgF and the admixing occurs at a stoichiometric ratio of about 1 AgF to about 1 Br 2 to about 1 SF 4 or the sulfur reactant is SF 4 and the metal fluoride is AgF 2 and the admixing occurs at a stoichiometric ratio of about 2AgF 2 to about 3 Br 2 to about 4 SF 4 and the reaction proceeds at a temperature of about 10 to about 140° C. In another embodiment of producing SF 5 Br or a compound made using the produced SF 5 Br, the metal fluoride is an alkaline earth metal fluorides, an alkali metal fluorides, AgF 2 , AgF, AuF, MnF 3 , PbF 4 , CeF 4 or a mixture thereof.\",\n \"Embodiments disclosed herein also include methods of producing SF 6 or a compound made using the produced SF 6 .\",\n \"In one embodiment, the method includes: admixing a Br 2 reactant, an SF 4 reactant, and a metal fluoride reactant thereby initiating a reaction that produces SF 6 at a yield of greater than about 50%.\",\n \"In another embodiment of producing SF 6 or a compound made using the produced SF 6 , the reaction proceeds at a temperature of about 10 to about 400° C. In another embodiment of producing SF 6 or a compound made using the produced SF 6 , the sulfur reactant is SF 4 and the metal fluoride is CoF 3 and the admixing occurs at a stoichiometric ratio of about 2 CoF 3 to about 1 Br 2 to about 1 SF 4 and the reaction proceeds at a temperature of about 10 to about 400° C. In another embodiment of producing SF 6 or a compound made using the produced SF 6 , the metal fluoride is selected from the group consisting of an alkaline earth metal fluoride, an alkali metal fluoride, CoF 3 , MnF 3 , PbF 4 , CeF4 or a mixture thereof.\",\n \"detailed-description description=\\\"Detailed Description\\\" end=\\\"lead\\\"?\"\n ],\n [\n \"CROSS REFERENCE TO RELATED APPLICATIONS This application is a divisional of U.S. patent application Ser.\",\n \"No.\",\n \"12/746,717, filed Jun.\",\n \"7, 2010 and claims the benefit of U.S.\",\n \"Provisional Patent Application No.\",\n \"61/060,642, filed Jun.\",\n \"11, 2008, U.S.\",\n \"Provisional Patent Application No.\",\n \"61/153,180, filed Feb. 17, 2009, U.S.\",\n \"Provisional Patent Application No.\",\n \"61/176,674, filed May 8, 2009, and U.S. Non-Provisional patent application Ser.\",\n \"No.\",\n \"12/746,717, filed Jun.\",\n \"7, 2010, which is a national stage application of PCT Patent Application No.\",\n \"PCT/US09/47116, filed Jun.\",\n \"11, 2009, the entire disclosures of which are incorporated herein by reference.\",\n \"FIELD OF THE INVENTION Disclosed herein are methods of synthesizing fluoro-sulfur compounds.\",\n \"The disclosed methods use bromine to promote the synthesis of fluoro-sulfur compounds while avoiding the use excessive temperatures, electrochemical preparation, or the use of traditionally used solvents or reactants generally deemed less desirable due to toxicity, excess reactivity or cost.\",\n \"BACKGROUND OF THE INVENTION A number of fluoro-sulfur compounds have beneficial applications.\",\n \"For example, sulfur tetrafluoride (SF4) is a widely-used compound produced yearly at the metric ton level, which can be utilized as a deoxofluorinating reagent in converting carboxylic acids, aldehydes, some alcohols and ketones into their corresponding deoxofluorine derivatives (i.e.\",\n \"R—CF3, R—CHF2, RF, RR′—CF2).\",\n \"SF4 is also utilized as an etching agent in the electronics industry.\",\n \"Moreover, SF4 can be utilized as a precursor for the synthesis of other important fluorinated products such as, without limitation, pentafluorosulfur chloride (SF5Cl), pentafluorosulfur bromide (SF5Br), and sulfur hexafluoride (SF6).\",\n \"Sulfur hexafluoride (SF6), is a compound that is produced by the thousands of metric tons each year, and its worldwide uses include: acting as a PCB replacement and an inert dielectric medium for electrical equipment, the etching of semiconductors, the casting of magnesium, the manufacture of thermal windows, a source of thrust in some rocket propulsion systems, the tracing of air flow through industrial systems, a tamponade for retinal holes of the eye and in medical imaging.\",\n \"Compounds harboring fluoro-organic modifications such as R—CF3, R—CHF2, RF, RR′—CF2 and RSF5, have been used in a variety of applications including fluorinated therapeutic and diagnostic drugs, pesticides, herbicides, antibiotics, perfluorinated blood substitutes, fungicides, polymer solvents, polymers, lubricants, liquid crystals, surface-active agents, high-boiling solvents, stable solvents, electrically conducting polymers and the like.\",\n \"Utilizing an SF5 group in the place of CF3 offers many advantages.\",\n \"Particularly, the SF5 group possesses greater electronegativity than CF3.Moreover, compounds containing SF5 may be further distinguished by their outstanding chemical properties including high to extreme chemical and thermal stability, hydro- and oleophobicity, lipophilicity, high-density, reduction of shock sensitivity in explosives, low boiling point, low polarizability and low surface tension.\",\n \"While SF5-derivatives offer these advantages, they have been difficult to synthesize.\",\n \"The difficulty of obtaining such compounds is in part related to the difficulty of obtaining sufficient and affordable quantities of SF5Cl or SF5Br, which are the principal chemical reagents used to synthesize and obtain a number of organic or inorganic derivatives that bear the SF5-radical moiety.\",\n \"SF5Cl, particularly, is a valuable reactant to produce SF5-radical bearing derivatives of (sulfur hexafluoride) SF6 and may be reduced to disulfur decafluoride (S2F10) with the latter being converted into pentafluorosulfur bromide (SF5Br).\",\n \"SF5Cl can also be used in the synthesis of SF6.It is of interest that SF5Cl can be particularly used in the manufacture of SF6 by a pyrogenic route (e.g.\",\n \"U.S. Pat.\",\n \"No.\",\n \"4,390,511), whereby a disproportionation occurs according to the following reaction: SF5Cl→½SF6+½SF4+½Cl2 In this method, SF6 is obtained that is free of S2F10, a compound believed to be highly toxic and a by-product of the manufacture of SF6 by the reaction of sulfur with fluorine.\",\n \"Accordingly, the use of SF5Cl can be used to produce high purity SF6.Collectively, a variety of methods have been demonstrated as processes for the production of SF6 and include U.S. Pat.\",\n \"Nos.\",\n \"2,883,267, 2,912,307, 3,054,661, 3,345,277, 3,399,036, 3,373,000, 4,390,511, 5,639,435 and Japanese Patent No.\",\n \"7,625,497.These methods frequently employ electrochemical preparation, high reaction temperatures and pressures, and/or utilize highly-reactive and/or costly reactants that can include F2, SF5Cl, IF5, SF4, ClF and HF.\",\n \"SF5Br is also a valuable chemical compound that has been demonstrated as a reactant for the efficient production of SF5-radical bearing chemicals; also known as derivatives of SF6.Currently available methods of producing fluoro-sulfur compounds suffer a number of drawbacks.\",\n \"The drawbacks generally include the use of excessive temperatures, electrochemical preparation, expensive and/or hazardous reactants, the requirement for numerous successive steps or long reaction times, the production of low or variable yields and/or the generation of toxic by-products.\",\n \"Accordingly, there is room for improvement in the synthesis of fluoro-sulfur compounds.\",\n \"SUMMARY OF THE INVENTION Described herein are methods for the synthesis of fluoro-sulfur compounds, more specifically SF4, SF5Cl, SF5Br and SF6.The methods described herein generally require lower temperatures and pressure, produce high yields, in some cases require less time, do not use highly reactive oxidants or costly reactants and solvents that are commonly used in the synthesis of fluoro-sulfur compounds, and do not produce deleterious waste products when compared to previously-used methods.\",\n \"One embodiment disclosed herein includes a method of producing a fluoro-sulfur compound or a compound made using the produced fluoro-sulfur compound comprising: admixing Br2, a metal fluoride reactant, and a sulfur reactant thereby initiating a reaction that produces a yield of the fluoro-sulfur compound of greater than about 10%.\",\n \"In another embodiment, the admixing further includes Cl2.In another embodiment, the reaction proceeds at temperature of about 10 to about 400° C. In another embodiment, either S2F10 or BrF, BrF3, BrF5, CsBrF4, CsBrF2, acetonitrile, Dioxane, ClF, ClF3, NOF, HF, F2, (HF)n.amine, IF5 or combinations thereof are not added to the reaction.\",\n \"Embodiments disclosed herein also include methods of producing SF4 or a compound made using the produced SF4.In one embodiment the method includes admixing a sulfur reactant, a metal fluoride reactant, and a Br2 reactant thereby initiating a reaction that produces SF4 at a yield of greater than about 10%.\",\n \"In another embodiment of producing SF4 or a compound made using the produced SF4, the reaction proceeds at a temperature of about 10 to about 400° C. In another embodiment of producing SF4 or a compound made using the produced SF4, the sulfur reactant is S and the metal fluoride is KF and the admixing occurs at a stoichiometric ratio of about 4KF to about 2Br2 to about 1 S and the reaction proceeds at a temperature of about 10 to about 400° C. In another embodiment of producing SF4 or a compound made using the produced SF4, the metal fluoride is an alkaline earth metal fluoride, an alkali metal fluoride, CsF, RbF, KF, BaF2, SrF2 or a combination thereof and/or the sulfur reactant is S, S2Cl2, SCl2, S2Br2, SBr2 or a combination thereof.\",\n \"In an additional embodiment of producing SF4 or a compound made using the produced SF4, the method includes admixing a sulfur reactant, a metal fluoride reactant, a Cl2 reactant and a Br2 reagent thereby initiating a reaction that produces SF4 at a yield of greater than about 10%.\",\n \"In another embodiment of producing SF4 or a compound made using the produced SF4, the reaction proceeds at a temperature of about 10 to about 400° C. In another embodiment of producing SF4 or a compound made using the produced SF4, the sulfur reactant is S and the metal fluoride is KF and the admixing occurs at a stoichiometric ratio of about 4KF to about 1 Br2 to about 1 S to about 2Cl2 or the sulfur reactant is SCl2 and the metal fluoride is KF and the admixing occurs at a stoichiometric ratio of about 4KF to about 1 Br2 to about 1 SCl2 to about 1 Cl2 and the reaction proceeds at a temperature of about 10 to about 400° C. In another embodiment of producing SF4 or a compound made using the produced SF4, the metal fluoride is an alkaline earth metal fluoride, an alkali metal fluoride, CsF, RbF, KF, BaF2, NaF, SrF2 or a combination thereof and/or the sulfur reactant is S, S2Cl2, SCl2, S2Br2, SBr2 or a combination thereof.\",\n \"Embodiments disclosed herein also include methods of producing SF5Cl or a compound made using the produced SF5Cl.\",\n \"In one embodiment the method includes admixing a Cl2 reactant, a sulfur reactant, a metal fluoride reactant, and Br2 reagent thereby initiating a reaction that produces the SF5Cl at a yield of greater than about 50%.\",\n \"In another embodiment of producing SF5Cl or a compound made using the produced SF5Cl, the reaction proceeds at a temperature of about 10 to about 200° C. In another embodiment of producing SF5Cl or a compound made using the produced SF5Cl, the sulfur reactant is S and the metal fluoride is KF and the admixing occurs at a stoichiometric ratio of about 5KF to about 1 Br2 to about 1 S to about 3Cl2 or the sulfur reactant is SF4 and the metal fluoride is KF and the admixing occurs at a stoichiometric ratio of about 1KF to about 1 Br2 to about 1 SF4 to about 1Cl2 or the sulfur reactant is SCl2 and the metal fluoride is KF and the admixing occurs at a stoichiometric ratio of about 5KF to about 1 Br2 to about 1 SCl2 to about 2Cl2 and the reaction proceeds at a temperature of about 10 to about 200° C. In another embodiment of producing SF5Cl or a compound made using the produced SF5Cl, the metal fluoride is an alkaline earth metal fluoride, an alkali metal fluoride, CsF, RbF, KF, BaF2, SrF2 or a mixture thereof and/or the sulfur reactant S, S2Cl2, SCl2, SF4 or a combination thereof.\",\n \"Embodiments disclosed herein also include methods of producing SF5Br or a compound made using the produced SF5Br.\",\n \"In one embodiment the method includes admixing a Br2 reactant, a sulfur reactant, and a metal fluoride reactant thereby initiating a reaction that produces SF5Br at a yield of greater than about 50%.\",\n \"In another embodiment of producing SF5Br or a compound made using the produced SF5Br, either S2F10 or BrF, BrF3, BrF5, CsBrF4, CsBrF2 or mixtures thereof are not added to the reaction.\",\n \"In another embodiment of producing SF5Br or a compound made using the produced SF5Br, the reaction proceeds at a temperature of about 10 to about 140° C. In another embodiment of producing SF5Br or a compound made using the produced SF5Br, the sulfur reactant is SF4 and the metal fluoride is AgF and the admixing occurs at a stoichiometric ratio of about 1 AgF to about 1 Br2 to about 1 SF4 or the sulfur reactant is SF4 and the metal fluoride is AgF2 and the admixing occurs at a stoichiometric ratio of about 2AgF2 to about 3 Br2 to about 4 SF4 and the reaction proceeds at a temperature of about 10 to about 140° C. In another embodiment of producing SF5Br or a compound made using the produced SF5Br, the metal fluoride is an alkaline earth metal fluorides, an alkali metal fluorides, AgF2, AgF, AuF, MnF3, PbF4, CeF4 or a mixture thereof.\",\n \"Embodiments disclosed herein also include methods of producing SF6 or a compound made using the produced SF6.In one embodiment, the method includes: admixing a Br2 reactant, an SF4 reactant, and a metal fluoride reactant thereby initiating a reaction that produces SF6 at a yield of greater than about 50%.\",\n \"In another embodiment of producing SF6 or a compound made using the produced SF6, the reaction proceeds at a temperature of about 10 to about 400° C. In another embodiment of producing SF6 or a compound made using the produced SF6, the sulfur reactant is SF4 and the metal fluoride is CoF3 and the admixing occurs at a stoichiometric ratio of about 2 CoF3 to about 1 Br2 to about 1 SF4 and the reaction proceeds at a temperature of about 10 to about 400° C. In another embodiment of producing SF6 or a compound made using the produced SF6, the metal fluoride is selected from the group consisting of an alkaline earth metal fluoride, an alkali metal fluoride, CoF3, MnF3, PbF4, CeF4 or a mixture thereof.\",\n \"DETAILED DESCRIPTION OF THE INVENTION Described herein are methods for the synthesis of fluoro-sulfur compounds in the presence of Br2.In certain exemplary embodiments the fluoro-sulfur compounds are SF4, SF5Cl SF5Br and SF6.The methods disclosed herein involve the mixing of readily available and relatively inexpensive reactants.\",\n \"When compared to previously-used approaches, the methods described herein generally require lower temperatures and pressure, produce high yields, require less time, do not use excessively reactive or costly reactants and solvents that are frequently utilized in the synthesis of the fluoro-sulfur compounds, do not produce deleterious waste products or one or more of the above in various combinations.\",\n \"Disclosed methods of synthesizing SF4 utilize Br2 in both the presence and absence of Cl2, whereas disclosed methods of synthesizing SF5Cl utilize Br2 in the presence of Cl2.Disclosed methods of synthesizing SF4 and SF5Cl can utilize Br2 in the absence of excessive temperature and pressure, and, in certain embodiments, in the absence of acetonitrile, Dioxane, ClF, ClF3, NOF, HF, F2, (HF)n.amine and/or IF5.Disclosed methods of synthesizing SF5Br utilize Br2 and can be carried out in the absence of high reaction temperatures and pressures, and in certain embodiments, in the absence of S2F10, BrF3, BrF5, CsBrF4 and/or CsBrF2.Disclosed methods of synthesizing SF6 utilize Br2 and can be carried out in the absence of electrochemical preparation, high reaction temperatures and/or pressures, and, in certain embodiments, in the absence of F2, SF5Cl, IF5, SF4, ClF and/or HF.\",\n \"As used herein “metal fluoride (MF)” encompasses a variety of mono or multivalent MFs including, without limitation, alkaline earth fluorides and alkali metal fluorides and can particularly include, without limitation, CoF3, CeF4, MnF3, PbF4, CsF, RbF, KF, BaF2, SrF2, AgF2, AgF and AuF.\",\n \"As used herein, the term “about” is used to indicate that a value includes the standard deviation of error for the device or method being employed to determine the value.\",\n \"In one example embodiment, the synthesis of SF4 is described.\",\n \"One example synthesis reaction for SF4 can proceed as follows in reaction I: 4KF+S+2Br2→SF4+4KBr I.\",\n \"In reaction I, the SF4-producing reaction can proceed at autogenous or elevated reaction pressures at ambient temperatures of about 10 to about 27° C., or at a mildly-elevated temperatures of up to about 80° C., or even at higher temperatures that are below those (about 400 to about 500° C.) which promote SF4 to disproportionate into S and SF6.Accordingly, the described methods do not require excessive temperatures or pressures or require the use of unusually reactive or costly reactants or solvents that are commonly used in the synthesis of SF4, such as, but not limited to acetonitrile, Dioxane, HF, F2, Cl2, (HF)n.amine and IF5.The described reaction I can produce yields ranging from about 57 to about 96% or greater, in a time frame of several hours to several days.\",\n \"Due to the low cost of the reagents used, modifying the reaction to produce lower yields can also be commercially advantageous.\",\n \"In one embodiment, yields of 10% or higher can be produced.\",\n \"This reaction does not create or leave behind undesirable side products.\",\n \"Only Br2, MFs and sulfur bromides that can easily be removed and discarded or recycled into subsequent production runs of SF4 or other unrelated chemical reactions, are created.\",\n \"Moreover, the disclosed reaction produces little or no gases, other than SF4, making purification of the SF4 end-product a simple process.\",\n \"Particularly, low boiling constituents (SF4) or excess unused Br2 can be separated by lowering the temperature and transferring into a cold trap.\",\n \"This described reaction I provides a method for synthesizing SF4 employing Br2 in the absence of Cl2.The absence of Cl2 in this reaction prevents the formation of SF5Cl when SF4 is the desired SF4 end-product.\",\n \"In another example embodiment, either S, Br2, or both S and Br2 can be replaced by sulfur bromides (e.g.\",\n \"S2Br2, SBr2) in the production of SF4.In one embodiment, specifically relating to reaction I, S to Br2 molar ratios of greater than about 1.00:2.00 can be used.\",\n \"In alternative embodiments, ratios ranging from about 1.00:0.44 to about 1.00:5.33 can also be used.\",\n \"In another example embodiment, particularly useful MFs in the production of SF4 and SF5Cl include, without limitation, CsF, RbF, KF, BaF2, SrF2 or a combination thereof.\",\n \"Further described herein are methods for the production of SF5Cl, and optionally SF4 (in the presence of Cl2), utilizing Br2 as a solvent and/or reactive solvent.\",\n \"In the case of S as a reactant, when SF4 is the desired product, slightly more than about four equivalents of the MF can be used.\",\n \"If SF5Cl is the desired product, slightly more than about five equivalents of the MF can be used.\",\n \"When SF4 is used as a reactant to produce SF5Cl, an equivalent or slightly larger amount of the MF can be utilized to efficiently produce the SF5Cl.\",\n \"The minimum amount of Cl2 in the reactions can easily be determined by the stoichiometry of the reaction itself.\",\n \"In the present example embodiment, KF is used as the MF, however, a variety of other mono or multivalent MFs can be used.\",\n \"Example synthesis reactions for SF4 and SF5Cl in the presence of Cl2 as described above proceed as follows in reactions II-IV: 4KF+S+2Cl2+(Br2)→SF4+4KCl+(Br2) II.\",\n \"5KF+S+3Cl2+(Br2)→SF5Cl+5KCl+(Br2) III.\",\n \"KF+SF4+Cl2+(Br2)→SF5Cl+KCl+(Br2) IV.\",\n \"In reactions II-IV above, the SF5Cl- and SF4-producing reactions can proceed at autogenous or elevated reaction pressures, at ambient temperatures of about 10 to about 27° C., or at a mildly-elevated temperatures of up to about 115° C., or, even at higher temperatures that are below those which promote decomposition of SF5Cl (about 200 to about 400° C.), or cause SF4 to disproportionate into S and SF6 (about 400 to about 500° C.).\",\n \"Accordingly, the described methods do not require excessive temperatures or pressures or require the use of unusually reactive or costly reactants or solvents that are commonly used in the synthesis of SF4 and SF5Cl, such as, but not limited to acetonitrile, Dioxane, ClF, ClF3, NOF, HF, F2, (HF)n.amine and IF5.The described reaction III above can produce yields of about 88 to about 95% or greater and can theoretically approach 100%, in a time frame of several hours to several weeks.\",\n \"Due to the low cost of the reagents used, modifying the reaction to produce lower yields can also be commercially advantageous.\",\n \"In one embodiment, yields of 50% or higher can be produced.\",\n \"Other lower yields, such as yields as low as 10%, are also within the scope of embodiments disclosed herein.\",\n \"This reaction does not create or leave behind undesirable side products.\",\n \"Br2 can be easily separated from the reaction products and then SF5Cl and any excess Cl2 can be collected by cooling the reaction vessel to approximately −80° C. and condensing out SF5Cl and any excess Cl2 at reduced pressure.\",\n \"Cl2 can be removed from the mixture by storage over elemental sulfur and the recovered sulfur chlorides can be used for a new production batch of either SF4 or SF5Cl.\",\n \"One function of the chlorine in the procedure is to oxidize sulfur to sulfur chlorides (e.g.\",\n \"S2Cl2, SCl2) as the predominant sulfur species, which exchange chlorine for fluorine with a fluoride.\",\n \"Thus, it will not be necessary to dispose of sulfur chlorides as waste.\",\n \"Collectively, the recovered Cl2 as well as the recovered sulfur chlorides and Br2, may be used in a near quantitative fashion, as outlined in the following reactions: 4KF+SCl2+Cl2+(Br2)→SF4+4KCl+(Br2) V. 5KF+SCl2+2Cl2+(Br2)→SF5Cl+5KCl+(Br2) VI.\",\n \"In the SF4-producing reaction, a small amount of SF5Cl may be formed as a by-product.\",\n \"In each of the reactions, the function of Br2 may be to provide an improved reaction environment with Br2 possibly acting as a solvent, a reactive solvent or with Cl2 forming BrCl from the Br2+Cl2 upon mixing.\",\n \"Interestingly, it has been shown previously, that without the addition of Br2, KF+SF4+Cl2 yields, upon intense heating (about 75 to about 150° C. or about 220 to about 300° C.) only variable amounts (about 5 to about 80%) of SF5Cl (Bekker et al., Isw.\",\n \"Akad.\",\n \"Nauk U.S.S.R., Bull.\",\n \"Ser.\",\n \"Chim.\",\n \"2575, 1970; U. Jonethal, R. Kuschel, K. Seppelt, J. Fl.\",\n \"Chem.\",\n \"88, 3, 1998).\",\n \"Thus, the Br2 utilized in the present methods alleviates the requirement for excessive temperature (energy input), and also improves both the yield and the consistency of the yield, as well as the overall ease of production.\",\n \"Moreover, when using S instead of SF4 as the sulfur source to produce SF5Cl, the use of Br2 alleviates both the requirement for SF4 and excessive temperature, as other methods which do not utilize Br2 (excess CsF+S+3 Cl2 at about 175° C.) do not produce meaningful amounts of SF5Cl.\",\n \"The methods described herein employ the use of Br2 as a solvent or reactive solvent in the production of SF5Cl and SF4, which in turn promotes the transfer of both fluorine and chlorine into the production of the SF5Cl and SF4 end-products.\",\n \"Alternatively, in the SF5Cl-producing reaction, S and Cl2 may be replaced by sulfur chlorides (e.g.\",\n \"S2Cl2, SCl2) or SF4, if desired.\",\n \"In both the SF5Cl- and SF4-producing reactions described herein, when there is insufficient Br2 present, the reactions are either extremely slow or do not progress at all.\",\n \"Further, in both the SF5Cl- and SF4-producing reactions that utilize Cl2 as a reactant, a Br2 to S molar ratio greater than about 1:1 can be used.\",\n \"Ratios of from about 1:2 to about 2:1 can also be used.\",\n \"Particularly useful MFs in the production of SF5Cl and SF4 include, without limitation, CsF, RbF, KF, BaF2, SrF2 and combinations thereof.\",\n \"In another example embodiment disclosed herein, the synthesis of SF5Br is described.\",\n \"In the case where SF4 and Br2 are reactants, more than about 1 equivalent of a metal monofluoride (AgF) can be used or about 2 equivalents can be used in the case of a metal difluoride (AgF2).\",\n \"Example synthesis reactions for SF5Br can proceed as follows: AgF+SF4+Br2→SF5Br+AgBr VII.\",\n \"2AgF2+4SF4+3Br2→4SF5Br+2AgBr VIII.\",\n \"These reactions can be run at ambient temperatures (about 10 to about 27° C.) or at temperatures up to those at which SF5Br begins to decompose (about 140 to about 150° C.) and at the autogenous pressures generated in closed reactor vessels.\",\n \"Highly-reactive and/or costly reactants that are commonly used to synthesize SF5Br, such as, without limitation, S2F10, BrF3, BrF5, CsBrF4 and CsBrF2 are not necessary.\",\n \"The described reaction can produce yields of about 75% and can theoretically approach 100%, in a time frame of several hours to several days.\",\n \"Due to the low cost of the reagents used, modifying the reaction to produce lower yields can also be commercially advantageous.\",\n \"In one embodiment, yields of 50% or higher can be produced.\",\n \"Other lower yields, such as yields as low as 10%, are also within the scope of embodiments disclosed herein.\",\n \"The reaction does not create or leave behind undesirable side products.\",\n \"SF5Br and any excess Br2 can be collected by cooling the reaction vessel to approximately −78° C. and condensing out the SF5Br.\",\n \"The Br2 can be easily recycled into subsequent reactions including, without limitation, the production of SF5Br, whereas AgBr can be readily reutilized in subsequent reactions including, without limitation, SF5Br reactions by reforming the metal fluoride (without limitation, AgF or AgF2).\",\n \"In one example embodiment, the present SF5Br production methods can employ only SF4, a MF, for example and without limitation, AgF or AgF2, and Br2 as reactants.\",\n \"Particularly useful MFs in the production of SF5Br include, without limitation, CeF4, MnF3, PbF4, AgF2, AgF, AuF or a mixture thereof.\",\n \"Further, the methods described herein for producing SF5Br eliminate inefficient multi-step production protocols that are currently used.\",\n \"In another example embodiment disclosed herein, the synthesis of SF6 is described.\",\n \"In the case where SF4 and Br2 are reactants, more than about 2 equivalents of a MF capable of transferring about one fluorine equivalent, such as CoF3, can be used.\",\n \"An example synthesis reaction for SF6 can proceed as follows: 2CoF3+SF4+(Br2)→SF6+2CoF2+(Br2) IX.\",\n \"Reaction IX shown above can be run at ambient temperatures or theoretically up to temperatures at which SF4 begins to decompose (about 400 to about 500° C.), and at the autogenous pressures generated in closed reactor vessels.\",\n \"Electrochemical preparation, high temperatures and pressures as well as highly-reactive and/or costly reactants (without limitation, F2, SF5Cl, IF5, SF4, ClF and HF) that are commonly used to synthesize SF6 can be avoided.\",\n \"Due to the low cost of the reagents used, modifying the reaction to produce lower yields can also be commercially advantageous.\",\n \"In one embodiment, yields of 50% or higher can be produced.\",\n \"Other lower yields, such as yields as low as 10%, are also within the scope of embodiments disclosed herein.\",\n \"In the described reaction IX, the Br2 can be easily recycled into subsequent reactions including, without limitation, the production of additional SF6, whereas CoF2 can be readily re-fluorinated to CoF3 and reutilized in subsequent SF6 reactions as well as other reactions.\",\n \"In one example embodiment, the present SF6 production methods can employ only SF4, a MF, for example and without limitation, CeF4, MnF3, PbF4, AgF2, AgF, AuF and mixtures thereof as reactants.\",\n \"Further, the methods described herein for producing SF6 eliminate inefficient multi-step production protocols that are currently used.\",\n \"The reactions described herein for producing SF4, SF5Cl, SF5Br and SF6 can be performed at temperatures below those commonly used in the art.\",\n \"In one example embodiment, the reactions are carried out at or near room (ambient) temperature (about 10 to about 27° C.).\",\n \"In other embodiments, the temperature is from about 10° C. to about 27° C. (ambient), or from about 27° C. to about 115° C. Higher temperatures can theoretically be used, for example, up to about 250° C. to about 500° C. (up to temperatures at which SF4, SF5Cl and SF5Br decompose).\",\n \"Additionally, lower temperatures can be used, for example down to about −10° C.; a temperature at which Br2 would solidify.\",\n \"While permissible, however, these more extreme reaction temperatures are not required.\",\n \"The reactions described herein for producing SF4, SF5Cl, SF5Br and SF6 can be performed at pressures below those commonly used in the art.\",\n \"In one example embodiment, the reactions are carried out just above atmospheric pressure, at autogenous pressures that are estimated of only up to about 10 atms.\",\n \"In other embodiments, at higher temperatures, the pressure is estimated to be from about 10 atm to about 40 atm.\",\n \"Slightly higher pressures can also be used.\",\n \"For example, it is estimated that up to about 100 atm could be used.\",\n \"Additionally, lower pressures can be used, for example down to about 0.5 atms, or about 0.01 atms, or about 0.001 atms.\",\n \"While permissible, however, these more extreme pressures are not required.\",\n \"Further, in some embodiments, the reactions for producing SF4, SF5Cl, SF5Br and SF6 described herein can be carried out in one or more physical configuration that increases the reaction surface area of the solid phase reactants.\",\n \"For example, the solid phase reactants can be spray-dried, finely dispersed, or otherwise subjected to commonly used methods which increase the surface area.\",\n \"In some example embodiments, the reactants for producing SF4, SF5Cl, SF5Br and SF6 can be physically or mechanically agitated to aid the reactions.\",\n \"For example, inversion, milling/grinding, ball-milling, stirring, rotation, and the like can be used.\",\n \"Such mechanical agitation methods can minimize MFBr or MFCl formation that can mask the effective MF reaction surface area and slow the progression of desired reactions.\",\n \"The methods described herein theoretically can generate SF4, SF5Cl, SF5Br and SF6 at near 100% yields.\",\n \"In one example embodiment, the yield is between about 57% and about 96%.\",\n \"In another embodiment the yield is about 95% In another embodiment, the yield is about 75%.\",\n \"As will be understood by one of ordinary skill in the art, depending on the reactants used and the desired end-products, the conditions of the reaction and the like, the time for a reaction to be substantially complete varies.\",\n \"Substantially complete means a particular reaction is within about 10% of completion, within about 5% of completion or within about 1% or less of completion.\",\n \"Reaction times can be as short as about a few hours to as long as about several days or weeks.\",\n \"In some embodiments, the reactions are substantially complete within less than about 30 days, less than about 17 days, less than about 14 days, less than about 6 days, less than about 4 days, less than about 3 days, less than about 2 days or less than about 1 day.\",\n \"In other embodiments, the reactions are substantially complete within less than about 8 hours, less than about 4 hours or less than about 3 hours.\",\n \"Reactions described herein can be modified by those skilled in the art.\",\n \"As such, altering the order of adding and mixing of reactants and reagents, adjusting relative molar ratios of reactants, as well as altering reaction times, temperatures and pressures, to more precisely control specific reaction outcomes, and maximizing the ease and production of the desired end product are within the scope of the present description.\",\n \"The following examples are included to demonstrate embodiments of the disclosed methods and processes.\",\n \"It should be appreciated by those of ordinary skill in the art that the techniques disclosed in the examples which follow represent techniques discovered by the inventor to function well in the practice of the present disclosure, and thus can be considered to constitute preferred modes for its practice.\",\n \"However, those of ordinary skill in the art should, in light of the present disclosure, appreciate that many changes can be made in the specific embodiments which are disclosed and still obtain a like or similar result.\",\n \"Example 1.Formation of SF4 Anhydrous fine grain KF powder (about 5.09 g) was dried in a stainless steel 100-ml Hoke bomb tube reactor at about 150° C. to about 200° C., for about 1 hour, at high vacuum (about 0.05 to about 0.1 torr).\",\n \"The reactor was allowed to cool to ambient temperature, opened, and fine-grain S powder (about 0.69 g) was added.\",\n \"Cl2 (about 3.13 g) and Br2 (about 1.5 g) were then added to the reactor vessel by condensation to produce a molar ratio of S:Cl2:KF:Br2 of about 1.0:2.0:4.1:0.44.The vessel was kept at ambient temperature overnight and little or no SF5Cl and SF4 were detected from the infrared (IR) spectrum of the gaseous phase.\",\n \"IR spectrometry was performed using a Model 4020 Galaxy FTIR spectrophotometer (Mattson Instruments, Madison, Wis. 53711, USA).\",\n \"No change in the IR spectrum was noticed after about four more days.\",\n \"More Br2 (about 5.5 g) was added to the reactor vessel by condensation to produce a new molar ratio of: S:Cl2:KF:Br2 of about 1:2.0:4.1:2.0.After about 4 days at ambient temperature, a very strong SF4-specific spectral signal was observed (e.g.\",\n \"band groups centered at about 876 cm−1 and about 730 cm−1), which was accompanied by a very weak SF5Cl IR spectral signal (e.g.\",\n \"band groups centered at about 909 cm−1, about 855 cm−1 and about 602 cm−1), The reaction displayed a high degree of conversion to SF4, as indicated by the IR spectrum.\",\n \"This example illustrates that: 1.)\",\n \"increasing the molar ratio of Br2 appears to promote the formation of SF4, and 2.)\",\n \"SF4 can be efficiently synthesized within about 4 days at ambient temperatures in the reaction: 4KF+S+2Cl2+(Br2)→SF4+4KCl+(Br2).\",\n \"Example 2.Formation of SF4 at an Elevated Temperature Anhydrous fine-grain KF powder (about 10.50 g) was dried in a stainless steel 100-ml Hoke bomb tube reactor at about 150° C. to 200° C., for about 1 hour, at high vacuum.\",\n \"The reactor was allowed to cool to ambient temperature, opened, and fine-grain S powder (about 1.37 g) was added.\",\n \"Cl2 (about 6.1 g) and Br2 (about 14.3 g) were then added to the reactor vessel by condensation to produce a molar ratio of S:Cl2:KF:Br2 of about 1.00:2.00:4.23:2.09.The vessel was then kept at a temperature of 65-70° C. for 30 days.\",\n \"Initially, some SF5Cl besides SF4 was detected in the IR spectrum of the gaseous constituents of the reactor bomb tube, but it disappeared in the course of time and no SF5Cl was detected after 30 days, only SF4.\",\n \"(IR spectrometry was performed).\",\n \"The reactor vessel bomb tube was cooled to −78° C., and pumped on through a liquid-nitrogen cooled cold trap for two hours.\",\n \"The crude product (4.6 g) was stored in a reactor vessel bomb tube over sulfur (20 g) for 20 hours to remove excess chlorine that might be present.\",\n \"After cooling the sulfur-treatment vessel to −78° C., the product was collected in a cold trap (liquid nitrogen) as before.\",\n \"A yellow tinge was removed by treatment with Hg.\",\n \"The final mass of the recovered SF4 end product was about 4.08 g for a calculated yield of about 88% (based upon sulfur).\",\n \"The final SF4 product appeared as a colorless liquid (when cold), showing the characteristic bands of SF4 in the IR spectrum.\",\n \"This example illustrates that: 1.)\",\n \"increasing the temperature appears to promote the formation of SF4, and 2.)\",\n \"SF4, free of SF5Cl, can be efficiently synthesized in the reaction: 4KF+S+2Cl2+(Br2)→SF4+4KCl+(Br2) Example 3.Alternate Formation of SF4 in the Absence of Cl2 Anhydrous fine-grain KF (about 24.2 g) was dried in a stainless steel 300-ml Hoke bomb tube reactor at about 150° C. to about 200° C., for about 1 hour, at high vacuum.\",\n \"The reactor was allowed to cool to ambient temperature, opened, and fine-grain S powder (about 3.24 g) was added.\",\n \"Br2, representing a molar ratio of S to Br2 of greater than about two (about 86.4 g), was then added to the reactor vessel by condensation to produce a final molar ratio of S:KF:Br2 of about 1.00:4.10:5.30.After about 3 days at ambient temperature, a strong SF4IR spectral signal was observed and the reaction displayed a high degree of conversion to SF4.After an additional 3 days at ambient temperature, no significant change was noticed in the IR spectrum.\",\n \"The final SF4 product was isolated as follows: The reaction vessel was cooled on a dry ice bath (about −78° C.) and connected via a liquid nitrogen cold trap (about −196° C.) to a vacuum pump.\",\n \"After about 1.5 hours, about 11.5 grams of a light brown, presumably bromine-contaminated crude product was obtained.\",\n \"To remove residual contaminants (e.g.\",\n \"Br2, Sulfur Bromides), the crude product was condensed into a large glass pressure vessel containing about 10 grams of Hg to remove trace amounts of any discoloring contaminants (i.e.\",\n \"e.g.\",\n \"Br2).\",\n \"After brief shaking at about 0° C., the product was condensed into a cold trap and obtained as a colorless liquid.\",\n \"The final mass of the recovered end product was about 10.5 g for a calculated yield of about 96% (based upon sulfur).\",\n \"The IR spectrum of the end product revealed a substantially pure sample of SF4, with a small contamination by SOF2 (e.g.\",\n \"band groups centered at about 1340 cm−1 and about 808 cm−1 and about 750 cm−1).\",\n \"This example illustrates that: SF4 can be efficiently synthesized in the absence of Cl2 within about 3 days at ambient temperatures, in the reaction: 4KF+S+2Br2→SF4+4KBr Example 4.Alternate Formation of SF4 Using Coarse-Grain KF and Agitation by Ball-Milling Anhydrous coarse grain KF (about 28.1 g) was dried in a stainless steel 300-ml Hoke bomb tube reactor containing 19, ½ inch 316 grade stainless steel balls, at about 150° C. to about 200° C., for about 1 hour, at high vacuum.\",\n \"The reactor was allowed to cool to ambient temperature, opened, and fine-grain S powder (about 3.8 g) was added.\",\n \"Bromine, (about 63.1 g), was then added to the reactor vessel to produce a final molar ratio of S:KF:Br2 of about 1.00:4.10:3.30.After rotating the reaction vessel for about 4 days at ambient temperature, a strong SF4 IR spectral signal was observed and the reaction displayed a high degree of conversion to SF4.The final SF4 product was isolated as follows: The reaction vessel was cooled to about −78° C. and connected via a cold trap (about −196° C.) to a vacuum pump.\",\n \"After about 5 hours, about 9.8 grams of a light brown, presumably bromine-contaminated crude product was obtained.\",\n \"A low temperature vacuum transfer was performed, yielding a very light brown liquid.\",\n \"The final mass of the recovered SF4 end product was estimated about 7.3 g for a calculated yield of about 57% (based upon sulfur).\",\n \"The IR spectrum of the end product revealed a substantially pure sample of SF4, with a small contamination by SOF2.This example illustrates that: SF4 can be efficiently synthesized in the absence of Cl2 using coarse-grain KF and ball-milling agitation within about 4 days at ambient temperatures, in the reaction: 4KF+S+2Br2→SF4+4KBr Example 5.Alternate Formation of SF4 at Elevated Temperature Anhydrous fine-grain KF (about 17.1 g) was dried in a stainless steel 300-ml Hoke bomb tube reactor at about 150° C. to about 200° C., for about 1 hour under high vacuum.\",\n \"The reactor was allowed to cool to ambient temperature, opened, and fine-grain S powder (about 2.3 g) was added.\",\n \"Br2 (about 36.3 g), was then added to the reactor vessel to produce a final molar ratio of S:KF:Br2 of about 1.00:4.10:3.20.The reactor vessel was heated to about 60° C. for about 3 hours and the formation SF4 product was monitored by IR spectroscopy.\",\n \"The reaction vessel was cooled to about −78° C. and the SF4 product was pumped into a liquid nitrogen cold trap.\",\n \"The mass of the crude SF4 product indicated about 50% chemical yield.\",\n \"After recondensation of the SF4 product into the reaction vessel, it was heated for another about 2 hours at about 72° C., and another about 4 hours at about 80 to about 86° C. Isolation of the SF4 product was accomplished by cooling the reaction vessel to about −78° C. and pumping under high vacuum for about 1.5 hours into a liquid nitrogen cold trap.\",\n \"Debromination was performed by brief shaking in large Carius tube containing about 20 g. of Hg at about 0° C. About 6.7 grams of purified SF4 was recovered containing a small amount of SOF2, as judged by IR spectroscopy.\",\n \"The final calculated yield was about 86% (based upon sulfur).\",\n \"This example illustrates that SF4 can be efficiently synthesized at mildly elevated temperature, within about 9 hours, in the reaction: 4KF+S+2Br2→SF4+4KBr Example 6.Alternate Formation of SF4 while Limiting Br2 Anhydrous fine grain KF (about 24.12 g) was dried in a stainless steel 300-ml Hoke bomb tube reactor at about 150° C. to about 200° C., for about 1 hour, at high vacuum.\",\n \"The reactor was allowed to cool to ambient temperature, opened, and fine-grain S powder (about 3.16 g) was added.\",\n \"Br2 (about 31.1 g), was then added to the reactor vessel to produce a final molar ratio of S:KF:Br2 of about 1.00:4.21:1.97.The reaction vessel was then cooled with liquid nitrogen and evacuated.\",\n \"The reaction vessel was kept at ambient temperature for about 6 days, and then heated at about 80° C. for about 8 hours.\",\n \"The reaction vessel was cooled to about −78° C. and the volatile material was pumped into a liquid nitrogen cooled cold trap until transfer apparently ceased.\",\n \"The contents of the cold trap were transferred to a second cold trap, leaving a brown residue in the first cold trap.\",\n \"The transferred material was condensed into a large glass pressure vessel containing about 10 grams of Hg to remove trace amounts of.\",\n \"Br2.About 7.31 g of colorless product was again condensed into a liquid nitrogen cooled cold trap.\",\n \"The recovered end product appeared as colorless product of about 7.31 g mass, for a calculated yield of about 70% (based upon Br2).\",\n \"The IR spectrum of the end product revealed a substantially pure sample of SF4.This example illustrates that it is advantageous to use more than the required stoichiometric amount of bromine in the reaction: 4KF+S+2Br2→SF4+4KBr Example 7.Formation of SF5Cl Anhydrous fine grain CsF (about 10.95 g) was dried under high vacuum at about 100° C. in a stainless steel 300-ml Hoke bomb tube reactor, whereupon SF4 (about 9.17 g), Cl2 (about 3.20 g) and bromine (about 36.8 g) were added consecutively by vacuum condensation at liquid-nitrogen temperature (about −196° C.) to produce a molar ratio of SF4:CsF:Cl2:Br2 of about 1.00:0.85:0.53:2.71.The vessel was set aside at ambient temperature for about 5 days, and an IR spectrum of the gaseous constituents showed very strong bands or band groups corresponding to SF5Cl.\",\n \"This example illustrates that SF5Cl can be efficiently synthesized within about 5 days at ambient temperatures using Cl2, Br2, and SF4, in the reaction: CsF+SF4+Cl2+(Br2)→SF5Cl+CsCl+(Br2).\",\n \"Example 8.Alternate Formation of SF5Cl Using a Different Metal Fluoride KF (about 5.0 g) was dried at about 150° C. to about 200° C. in a stainless steel 100-ml Hoke bomb tube reactor, for about 1 hour, at high vacuum.\",\n \"Br2 (about 9.71 g), Cl2 (about 3.54 g) and SF4 (about 4.71 g) were added to the bomb tube reactor by condensation to produce a molar ratio of: SF4:Cl2:KF:Br2 of about 1.00:1.14:1.98:1.39.The reaction appeared almost complete after about 2 days at ambient temperature, as determined from the IR spectrum (i.e.\",\n \"a strong SF5Cl to SF4 IR spectral signals was observed).\",\n \"The reactants were then heated for about 2 days at about 115° C., and an IR spectrum of the gaseous phase showed very little signal corresponding to SF4.This example illustrates that SF5Cl can be efficiently synthesized within about 2 to about 4 days at ambient or mildly elevated temperatures using Cl2, Br2, and SF4, in the reaction: KF+SF4+Cl2+(Br2)→SF5Cl+KCl+(Br2).\",\n \"Example 9.Alternate Formation of SF5Cl Using S Instead of SF4 KF (about 15.60 g) was added to a stainless steel 300-ml Hoke bomb tube reactor and dried at about 150° C. to about 200° C., for about 1 hour, at high vacuum.\",\n \"The bomb reactor was opened and fine-grain S powder (about 1.50 g) was added.\",\n \"After resealing the reactor, Cl2 (about 9.03 g) and Br2 (about 8.59 g) were added by condensation to produce a molar ratio of: S:Cl2:KF:Br2 of about 1.00:2.71:5.71:1.15.The pressure reactor was kept at ambient temperature overnight and both SF5Cl and SF4 were detected from the IR spectrum.\",\n \"No change in the IR spectrum was noticed after about three days.\",\n \"More Cl2 was added (about 1.20 g), bringing the molar ratio to: S:Cl2:KF:Br2 of about 1.00:3.26:5.72:1.15.The reaction was occasionally monitored by IR spectroscopy.\",\n \"After about two more weeks at ambient temperature, the reaction was substantially complete as judged by IR spectrometry.\",\n \"This example illustrates that 1.)\",\n \"compared to other SF4-producing reactions, increasing the molar ratios of Cl2 and KF promotes the production of SF5Cl over SF4 in this reaction, and 2.)\",\n \"SF5Cl can be efficiently synthesized, at ambient temperatures within weeks, in the reaction: 5KF+S+3Cl2+(Br2)→SF5Cl+5KCl.\",\n \"Example 10.Formation of SF5Cl KF (about 10.55 g) was dried under high vacuum in a stainless steel 100-ml Hoke bomb tube reactor and dried for about 1 hour at about 150° C. to about 200° C. The reactor was opened and fine-grain S powder (about 1.13 g) was added.\",\n \"After resealing the reactor, Cl2 (about 8.15 g) and Br2 (about 7.99 g) were added by condensation to produce a stoichiometric ratio of S:Cl2:KF:Br2 of about 1.00:3.25:5.15:1.41 (reaction “A”).\",\n \"A second, similar reaction was prepared utilizing about 1.58 g of fine-grain S powder and the same molar ratios of the other constituents (reaction “B”).\",\n \"The reaction “A” and “B” vessels were placed at ambient temperature for about 3 days and the successful production of SF4 and SF5Cl was noted by IR spectroscopy.\",\n \"Thereafter, SF4 and SF5Cl were monitored every 2 to about 3 days by IR spectroscopy, and by about day 13, it was evident that the reaction was not at completion, and that the production of SF4 and SF5Cl had slowed significantly.\",\n \"The volatile components of both reaction vessels were then condensed and combined into a third vessel containing about 7.94 grams of KF.\",\n \"After about 4 more days at ambient temperature, IR spectroscopy revealed that all the remaining SF4 appeared to have been consumed, leaving SF5Cl as the apparent sole product.\",\n \"The final product was isolated in the following manner: 1.)\",\n \"The reaction vessel was cooled to about −78° C. and connected via a cold trap (about −196° ° C.) to a vacuum pump.\",\n \"After about 6 hours, about 15.5 grams of a light yellowish crude product was obtained.\",\n \"To remove residual contaminants (e.g.\",\n \"Cl2, Br2, Sulfur Chlorides), the crude product was kept overnight in a pressure reactor, over about 3 grams of S. The product was pumped out of this vessel, cooled to about −78° C. and connected via a cold trap (about −196° C.) to a pump and then condensed into a large cold trap containing a small amount of mercury to remove trace amounts of any discoloring contaminants (e.g.\",\n \"Br2, Sulfur Chlorides).\",\n \"The product was obtained as a colorless liquid.\",\n \"The final mass of the recovered end product was about 13.10 g for a calculated yield of about 95% (based upon Sulfur).\",\n \"The IR spectrum of the end product revealed a pure sample of SF5Cl.\",\n \"This example illustrates that 1.)\",\n \"Additional KF may be required to recharge the SF5Cl-producing reaction and drive it to completion or near completion.\",\n \"2.)\",\n \"The production of SF5Cl may be slowed by a reduction of reaction-accessible KF, perhaps due to the buildup of unreactive KCl on the exposed surfaces of the KF; which may be rectified by the addition of fresh KF, agitation of the reaction vessel, or other methods that may increase reactive surface area of the KF over the reaction time.\",\n \"3.)\",\n \"From the reaction: 5KF+S+3Cl2+(Br2)→SF5Cl+5KCl+(Br2) it is possible to reach complete, or substantially complete SF5Cl production within about 2 to about 3 weeks at ambient temperature, yielding substantially pure SF5Cl.\",\n \"Example 11.Formation of SF5Cl KF (about 10.58 g) was dried under high vacuum for about 1 hour at about 150° C. to about 200° C., in a stainless steel 300-ml Hoke bomb tube pressure reactor.\",\n \"The reactor was opened and S (about 1.1 g) was added.\",\n \"After resealing the reactor, Cl2 (about 9.0 g) was added by condensation to produce a stoichiometric ratio of S:Cl2:KF of about 1.00:3.70:5.30.The reaction vessel was set aside at ambient temperature and no production of either SF4 or SF5Cl was detected by IR spectroscopy after about 30 days.\",\n \"Br2 (about 7.54 g) was then added by condensation to produce a new stoichiometric ratio of S:Cl2:KF:Br2 of about 1.00:3.70:5.30:1.37.After about 3 days at ambient temperature, production of both SF4 and SF5Cl was noted by IR spectroscopy.\",\n \"This example illustrates that 1.)\",\n \"Although all the chemical elements required for production of SF4 and SF5Cl were present in the reaction vessel for a duration of about 30 days, no production of SF4 or SF5Cl was noted in the absence of Br2 at ambient temperature.\",\n \"2.)\",\n \"After the necessary components (S, Cl2, KF) of the reaction remained unreactive for 30 days, the subsequent addition of Br2, within days, promoted the efficient formation of SF4 and SF5Cl at ambient temperatures.\",\n \"3.)\",\n \"Br2 appears to be required for the efficient ambient temperature production of SF4 and SF5Cl from the reactants KF, S and Cl2.Example 12.Formation of SF5Br AgF (about 11.02 g) was dried under high vacuum at about 150 to about 200° C. Br2 (about 35.5 g) and SF4 (about 7.3 g) were added to a 300-ml Hoke bomb tube pressure reactor by condensation to produce a molar ratio of: SF4:AgF:Br2 of about 1.00:1.28:3.30.The reaction vessel was then placed into an about 100° C. boiling water bath and subsequently monitored by IR spectroscopy at about 2, about 6.5, about 15 and about 79 hours.\",\n \"The IR spectra indicated a progressive accumulation of SF5Br (e.g.\",\n \"band groups centered at about 891 cm−1 and about 854 cm−1 and about 594 cm−1), and a reduction in SF4, as exemplified by observing an increasing ratio of SF5Br to SF4 IR spectral signals over time.\",\n \"The final product was isolated in the following manner: The reaction vessel was cooled to about −78° C. and connected via a cold trap (about −196° C.) to a vacuum pump.\",\n \"After about 3 hours, about 9.3 grams of a light yellowish crude product was obtained in the cold trap.\",\n \"The product was vacuum transferred from the cold trap to a Carius tube containing a small amount of mercury to remove trace amounts of any discoloring contaminants (e.g.\",\n \"Br2).\",\n \"The product was obtained as a pale straw-yellow liquid.\",\n \"The final mass of the recovered end product was about 8.55 g for a calculated yield of about 75.4% (based upon SF4).\",\n \"The IR spectrum of the end product revealed a substantially pure sample of SF5Br.\",\n \"This example illustrates that: 1.)\",\n \"SF5Br can be efficiently synthesized within about 79 hours at 100° C. in the reaction: AgF+SF4+Br2→SF5Br+AgBr Example 13.Formation of SF5Br Using an Alternate Metal Fluoride AgF2 (about 2.33 g) was dried under high vacuum at about 150 to about 200° C. in a 100-ml Hoke bomb tube pressure reactor.\",\n \"Br2 (about 12.95 g) and SF4 (about 3.14 g) were added to the reactor by condensation to produce a molar ratio of: SF4: AgF2: Br2 of about 1.00:0.55:2.78.The reaction vessel was then placed at 100° C. and subsequently monitored by IR spectroscopy at about 52 hours.\",\n \"The IR spectrum indicated very strong bands or band groups indicative of SF5Br, very weak bands or band groups corresponding to SF4 and SOF2 and medium-strength bands or band groups corresponding to SF6 (e.g.\",\n \"medium-strength band centered at about 947 cm−1).\",\n \"This example illustrates that: 1.)\",\n \"SF5Br can be efficiently synthesized within about 52 hours at about 100° C. in the reaction: 2AgF2+4SF4+3Br2→4SF5Br+2AgBr Example 14.Formation of SF6 CoF3 (about 4.2 g) was dried under high vacuum at about 150 to about 200° C. in a 100-ml Hoke bomb tube pressure reactor.\",\n \"Br2 (about 22.0 g) and SF4 (about 4.63 g) were added to the pressure reactor by condensation to produce a molar ratio of: SF4: CoF3: Br2 of about 1.00:0.84:3.21.The reaction vessel was then placed at about 100° C. and subsequently monitored by IR spectroscopy at about 52 hours.\",\n \"The IR spectrum indicated strong bands or band groups indicative of SF6 moderate-strength bands or band groups corresponding to SF4 and weak bands or band groups corresponding to SOF2.No indication of SF5Br was evident form the IR spectrum.\",\n \"This example indicates that: 1.)\",\n \"SF6 can be efficiently synthesized within about 52 hours at about 100° C. in the reaction: 2CoF3+SF4+(Br2)→SF6+2CoF2+(Br2) Example 15.Comparative Example To determine if an alternate MF could efficiently replace KF as a reactant in the production of SF4, anhydrous fine-grain NaF (about 16.94 g) was dried in a stainless steel Hoke bomb tube pressure reactor at about 150° C. to about 200° C., for about 1 hour, at high vacuum.\",\n \"The reactor was allowed to slowly cool to ambient temperature, opened, and sulfur (about 2.17 g) was added.\",\n \"Br2 (about 29.5 g), was then added to the reactor vessel to produce a final molar ratio of S:NaF:Br2 of about 1.00:5.90:2.70.After about 2 days at ambient temperature, no SF4 was evident as measured by IR spectroscopy of the gaseous constituents removed from the reaction vessel.\",\n \"The reaction vessel was then heated to about 80° C. for about 18 hours, IR spectroscopy of the gaseous constituents again revealed that no reaction products (SF4, SOF2) were present.\",\n \"The reaction vessel was subsequently heated to about 155° C. for about 18 hours, IR spectroscopy of the gaseous constituents revealed very low levels SOF2 and no SF4, suggesting the formation of only traces of SF4, which were apparently hydrolyzed by the minuscule amount of water introduced into the reaction vessel.\",\n \"Example 16.Comparative Example To determine if an alternate MF could efficiently replace KF as reactant in the production of SF5Cl from SF4, a 100-ml stainless steel Hoke bomb tube reactor was charged with NaF (about 10.19 g), and after drying under high vacuum as described above, the reactor was then charged with chlorine (about 4.77 g), bromine (about 11.57 g) and SF4 (about 14.61 g), consecutively, by vacuum condensation.\",\n \"The molar ratio of SF4:NaF:Cl2:Br2 equaled about 1.00:1.79:1.10:1.50.The reaction was allowed to occur without agitation at ambient temperature for about 11 days, after which time no reaction was apparent from the IR spectrum.\",\n \"Heating of the reaction vessel for an additional about 9 days at about 115 to about 125° C. did not result in the formation of SF5Cl, as indicated by IR spectroscopy.\",\n \"Example 17.Comparative Example CuF2 (about 4.59 g) was dried for about 1 hour under high vacuum at about 150 to about 200° C. Br2 (about 18.9 g) and SF4 (about 3.21 g) were added to the pressure reactor by condensation to produce a molar ratio of: SF4: CuF2: Br2 of about 1.00:1.54:3.72.The reaction vessel was then placed at about 100° C. and subsequently monitored by IR spectroscopy at about 52 hours.\",\n \"The IR spectrum indicated that no reaction had occurred.\",\n \"Example 18.Comparative Example TlF (about 4.23 g) was dried under high vacuum at about 150 to about 200° C., for about 1 hour.\",\n \"Br2 (about 7.6 g) and SF4 (about 1.38 g) were added to the pressure reactor by condensation to produce a molar ratio of: SF4:TlF:Br2 of about 1.00:1.49:3.86.The reaction vessel was then placed at 100° C. and subsequently monitored by IR spectroscopy at about 52 hours.\",\n \"The IR spectrum indicated that no reaction had occurred.\",\n \"Unless otherwise indicated, all numbers expressing quantities of ingredients, properties such as molecular weight, reaction conditions, and so forth used in the specification and claims are to be understood as being modified in all instances by the term “about.” Accordingly, unless indicated to the contrary, the numerical parameters set forth in the specification and attached claims are approximations that may vary depending upon the desired properties sought to be obtained by the present invention.\",\n \"At the very least, and not as an attempt to limit the application of the doctrine of equivalents to the scope of the claims, each numerical parameter should at least be construed in light of the number of reported significant digits and by applying ordinary rounding techniques.\",\n \"Notwithstanding that the numerical ranges and parameters setting forth the broad scope of the invention are approximations, the numerical values set forth in the specific examples are reported as precisely as possible.\",\n \"Any numerical value, however, inherently contains certain errors necessarily resulting from the standard deviation found in their respective testing measurements.\",\n \"The terms “a,” “an,” “the” and similar referents used in the context of describing the invention (especially in the context of the following claims) are to be construed to cover both the singular and the plural, unless otherwise indicated herein or clearly contradicted by context.\",\n \"Recitation of ranges of values herein is merely intended to serve as a shorthand method of referring individually to each separate value falling within the range.\",\n \"Unless otherwise indicated herein, each individual value is incorporated into the specification as if it were individually recited herein.\",\n \"All methods described herein can be performed in any suitable order unless otherwise indicated herein or otherwise clearly contradicted by context.\",\n \"The use of any and all examples, or exemplary language (e.g., “such as”) provided herein is intended merely to better illuminate the invention and does not pose a limitation on the scope of the invention otherwise claimed.\",\n \"No language in the specification should be construed as indicating any non-claimed element essential to the practice of the invention.\",\n \"Groupings of alternative elements or embodiments of the invention disclosed herein are not to be construed as limitations.\",\n \"Each group member may be referred to and claimed individually or in any combination with other members of the group or other elements found herein.\",\n \"It is anticipated that one or more members of a group may be included in, or deleted from, a group for reasons of convenience and/or patentability.\",\n \"When any such inclusion or deletion occurs, the specification is deemed to contain the group as modified thus fulfilling the written description of all Markush groups used in the appended claims.\",\n \"Certain embodiments of this invention are described herein, including the best mode known to the inventors for carrying out the invention.\",\n \"Of course, variations on these described embodiments will become apparent to those of ordinary skill in the art upon reading the foregoing description.\",\n \"The inventor expects skilled artisans to employ such variations as appropriate, and the inventors intend for the invention to be practiced otherwise than specifically described herein.\",\n \"Accordingly, this invention includes all modifications and equivalents of the subject matter recited in the claims appended hereto as permitted by applicable law.\",\n \"Moreover, any combination of the above-described elements in all possible variations thereof is encompassed by the invention unless otherwise indicated herein or otherwise clearly contradicted by context.\",\n \"Furthermore, numerous references have been made to patents and printed publications throughout this specification.\",\n \"Each of the above-cited references and printed publications are individually incorporated herein by reference in their entirety.\",\n \"In closing, it is to be understood that the embodiments of the invention disclosed herein are illustrative of the principles of the present invention.\",\n \"Other modifications that may be employed are within the scope of the invention.\",\n \"Thus, by way of example, but not of limitation, alternative configurations of the present invention may be utilized in accordance with the teachings herein.\",\n \"Accordingly, the present invention is not limited to that precisely as shown and described.\"\n ]\n]"},"source":{"kind":"string","value":"Patent_15871389"}}},{"rowIdx":4493778,"cells":{"text":{"kind":"list like","value":[["Item and Luggage Loss Prevention System","Novel tools and techniques are provided for implementing item or luggage loss prevention, which, in some cases, is based on weight measurement.","In some embodiments, a device with a processor can be placed under a bag's handle, within an interior compartment of the bag, below or in the feet or wheels of the bag, and/or the like.","The device can allow a user to lock in a weight of the bag.","If any item is subsequently removed from (and not returned to) the bag, the device will notify the user, using one or more of audio notification, visual notification, and/or mobile device notification (e.g., via e-mail, text message, SMS, MMS, chat message, and/or the like) that the weight of the bag has changed.","In some cases, location detection devices may be implemented to allow the user to backtrack where the missing item might have been left behind."],["1.A method, comprising: receiving, with a device, a first user input from a user to lock-in a first weight supported by a car seat, wherein the first weight corresponds to an occupant in the car seat; measuring, with the device, the first weight of the occupant in the car seat, in response to receiving the first user input; storing, with the device and in a local data storage device, the measured first weight; measuring, with the device, a second weight of supported by the car seat; determining, with the device, whether the second weight matches the stored first weight; based on a determination that the second weight does not match the first weight, notifying, with the device, the user.","2.The method of claim 1 further comprising attaching the device to the car seat.","3.The method of claim 2 further comprising attaching the device to one or more handles of the car seat.","4.The method of claim 1, further comprising placing the device at a bottom portion of the car seat.","5.The method of claim 4, wherein the bottom portion includes one of under a bottom shell portion, within or on a bottom inner cushion, or between the bottom shell portion and the bottom inner cushion.","6.The method of claim 1, further comprising placing the device below one or more feet of the car seat.","7.The method of claim 1, further comprising affixing the device between the car seat and each of one or more wheel casters coupled to the car seat.","8.The method of claim 1, wherein measuring each of the first weight and the second weight comprises measuring using a weight measurement device comprising a load cell selected from a group consisting of a strain gauge load cell, a piezoelectric load cell, a capacitive load cell, a compression load cell, a compression/tension load cell, an S-beam load cell, a bending beam load cell, a platform load cell, a single point load cell, a canister load cell, and a low profile load cell.","9.The method of claim 8, further comprising: determining that the car seat is being moved by determining, with the device, that the load cell of the weight measurement device is being actuated.","10.The method of claim 1, wherein measuring each of the first weight and the second weight comprises measuring using a weight measurement device comprising a contact surface and a contact sensor, wherein the weight measurement device has a structure that causes the contact surface to be brought into contact with the contact sensor when a first portion of the weight measurement device is lifted with respect to a second portion of the weight measurement device, which is coupled to the car seat.","11.The method of claim 10, wherein the contact sensor comprises at least one of a flex sensor, a piezoelectric-based sensor, a compression-based sensor, or a spring-based sensor.","12.The method of claim 1, further comprising: determining, with a location detection device of the device, a first location of the car seat when measuring the first weight of the car seat; storing, with the device, the first location in the local data storage device; determining that the car seat is being moved by determining, with the location detection device, that a present location of the device is different from the first location of the device; and based on the determination by the location detection device that the car seat is being moved, measuring, with the device, the second weight.","13.The method of claim 12, further comprising: determining, responsive to the determination that the car seat is being moved, that the car seat is empty.","14.The method of claim 12, further comprising: determining, responsive to the determination that the car seat is being moved, that the occupant is still in the car seat.","15.The method of claim 12, further comprising determining that the car seat is being moved by determining, with the location detection device, that a present location of the device is different from the first location of the device.","16.The method of claim 1, further comprising, receiving second user input, wherein measuring a second weight of the car seat comprises measuring a second weight of the car seat in response to the second user input.","17.An apparatus, comprising: at least one processor; a weight measurement device; a user interface device; a computer readable storage medium in communication with the at least one processor, the computer readable storage medium having stored thereon computer software, the computer software comprising a set of instructions executable by the at least one processor to: receive, with the weight measurement device, a first user input from a user to lock-in a first weight supported by a car seat, wherein the first weight corresponds to an occupant in the car seat; measure, with the weight measurement device, the first weight of the occupant in the car seat, in response to receiving the first user input; store, with the weight measurement device and in a local data storage device, the measured first weight; measure, with the weight measurement device, a second weight of supported by the car seat; determine, with the weight measurement device, whether the second weight matches the stored first weight; based on a determination that the second weight does not match the first weight, notify, with the device, the user.","18.The apparatus of claim 17, wherein the set of instructions are further executable to: determine that the car seat is being moved by determining, with the weight measuring device, that the load cell of the weight measurement device is being actuated.","19.The apparatus of claim 17, further comprising a location detection device, wherein the set of instructions are further executable to: determine, with a location detection device of the device, a first location of the car seat when measuring the first weight of the car seat; store, with the device, the first location in the local data storage device; determine that the car seat is being moved by determining, with the location detection device, that a present location of the device is different from the first location of the device; and based on the determination by the location detection device that the car seat is being moved, determining whether the occupant is in the car seat.","20.A system comprising: a car seat comprising a bottom portion and seat back; a car seat monitoring device coupled to car seat, the car seat monitoring device comprising: a processor; a computer readable storage medium in communication with the processor, the computer readable storage medium having stored thereon computer software, the computer software comprising a set of instructions executable by the processor to: receive, with the weight measurement device, a first user input from a user to lock-in a first weight supported by a car seat, wherein the first weight corresponds to an occupant in the car seat; measure, with the weight measurement device, the first weight of the occupant in the car seat, in response to receiving the first user input; store, with the weight measurement device and in a local data storage device, the measured first weight; measure, with the weight measurement device, a second weight of supported by the car seat; determine, with the weight measurement device, whether the second weight matches the stored first weight; based on a determination that the second weight does not match the first weight, notify, with the device, the user."],[" BACKGROUND Airports around the world have an epidemic.","People are losing valuable items every time they go through the security checkpoint(s) at airports.","This is because one of the requirements of airport security is that travelers must remove their laptops from their bags.","Another requirement is that travelers remove phones and other metallic objects from their persons before passing through the scanners.","As a consequence, there is a natural tendency for travelers to walk away without collecting their items (including, without limitation, laptops, smart phones, tablet computers, cellular phones, media players, and/or the like).","Approximately 1.7 million people travel through U.S. airports each day.","Items are lost everywhere in the airports, including, but not limited to, on planes, in terminal gates, in lounges, and/or the like.","It is estimated that over 16,000 laptops are left at U.S. airports each year.","The laptop loss alone is estimated to be around $700 million.","Travelers' items left in airports also put a significant strain on the already over-worked security personnel such as Transportation Security Administration (“TSA”) personnel in the U.S.","It requires that such personnel retain and manage custody of such lost items.","Currently, such lost items are collected by TSA agents and held for 30 days.","After the 30-day period expires, the hard drives and/or memory are removed and the items are put on auction.","All the information in the computing devices is subsequently destroyed.","This process requires man-hours for collecting the lost items, tracking how long the lost items have been held, removing data storage drives, destroying information stored in the devices, and auctioning the items.","Third party non-governmental Lost and Found web sites have been established in an effort to help people recover their lost items.","It is unclear, however, how successful these sites are.","But, for such sites to be useful, the travelers would have to know about a particular site in order to be able to post that they have lost something at a particular airport.","It would also require that the person who has possession of the lost item(s) know about the site so that they can contact the person that lost such item(s).","In general, such web sites only serve to work on the recovery of lost items, but cannot help to prevent loss of the items in the first place.","In terms of the use of weight measurement of luggage, existing travel scales provide weighing functionality, but such devices are incapable of alerting a traveler of a change in weight (such as when an item has not been put back in the luggage, or the like).","Hence, there is a need for more robust and scalable solutions for preventing item and luggage loss."],[" BRIEF SUMMARY Various embodiments provide techniques for implementing item or luggage loss prevention, which, in some cases, is based on weight measurements.","According to some embodiments, a device containing a processor might be configured to be placed under a bag's handle.","The device might contain a small display (including, without limitation, a liquid crystal display (“LCD”), a light emitting diode (“LED”) display, an organic LED (“oLED”) display, and/or the like) and a processor.","The device might allow the user to lock in a weight of a bag.","If any item is then removed from (and not returned to) the bag, the device might notify the user (e.g., using audio notification (e.g., recorded voice notification, beeps, and/or the like), visual notification (e.g., blinking lights, flashing icons, written messages, and/or the like), and/or mobile device notification (e.g., e-mail notification, text message notification, small message service (“SMS”) notification, multi-media messaging service (“MMS”) notification, chat message notification, and/or the like) that the weight of the bag has changed (from the locked-in weight).","In some embodiments, the device might comprise an LCD display for the weight and notification, an on or off button, and one or more button(s) to store/lock-in a weight (or to change the lock-in weight) and to release or delete any locked-in or stored weights.","The tools provided by various embodiments include, without limitation, methods, systems, and/or software products.","Merely by way of example, a method might comprise one or more procedures, any or all of which might be executed by a computer system.","Correspondingly, an embodiment might provide a computer system configured with instructions to perform one or more procedures in accordance with methods provided by various other embodiments.","Similarly, a computer program might comprise a set of instructions that are executable by a computer system, or by a processor located in the computer system, to perform such operations.","In many cases, such software programs are encoded on physical, tangible, and/or non-transitory computer readable media.","Such computer readable media might include, to name but a few examples, optical media, magnetic media, and the like.","In an aspect, a method might comprise receiving, with a device, a first user input from a user to lock-in a first weight of a bag, measuring, with the device, the first weight of the bag, in response to receiving the first user input, and storing, with the device and in a local data storage device, the measured first weight of the bag, prior to the user removing one or more items from the bag.","The method might further comprise measuring, with the device, a second weight of the bag, for example, in response to second user input, in response to determining that the bag is being moved, etc.","The method, then, might include determining, with the device, whether the second weight of the bag matches the stored first weight of the bag.","The method might also comprise, based on a determination that the second weight does not match the first weight, notifying, with the device, the user.","According to some embodiments, measuring each of the first weight and the second weight might comprise measuring using a weight measurement device comprising a contact surface and a contact sensor.","The weight measurement device might have a structure that causes the contact surface to be brought into contact with the contact sensor when a first portion of the weight measurement device is lifted with respect to a second portion of the weight measurement device, which is coupled to the bag.","In some cases, the contact sensor might comprise at least one of a flex sensor, a piezoelectric-based sensor, a compression-based sensor, and/or a spring-based sensor.","In some embodiments, the device might be attached to the bag.","The bag, according to some embodiments, might comprise one or more of a purse, a handbag, a tote, a briefcase, a satchel, laptop bag, travel bag, or carry-on luggage.","In some cases, the device might be attached to one or more handles of the bag.","The device, in some instances, might be placed in an interior compartment of the bag.","In some embodiments, the device might be placed at a bottom portion of the interior compartment of the bag (ideally, below the one or more items when the one or more items are placed in the bag).","According to some embodiments, the device might be placed below one or more feet of the bag.","In some cases, the device might be affixed to a position between the bag and each of one or more wheel casters of the bag.","In alternative cases, the device might be positioned within one or more wheel casters of the bag.","In some aspects, measuring each of the first weight and the second weight might comprise measuring using a weight measurement device comprising a load cell selected from a group consisting of a strain gauge load cell, a piezoelectric load cell, a capacitive load cell, a compression load cell, a compression/tension load cell, an S-beam load cell, a bending beam load cell, a platform load cell, a single point load cell, a canister load cell, and a low profile load cell.","Determining that the bag is being moved might, in some embodiments, comprise determining, with the device, that the load cell of the weight measurement device is being actuated (which might indicate that the bag is being lifted).","In some cases, determining that the second weight does not match the first weight might comprise determining that the second weight is less than the first weight.","In some instances, determining that the second weight does not match the first weight might comprise determining that the second weight is greater than the first weight.","In either case, notifying the user might comprise reminding the user to check that the one or more items that were removed from the bag have been returned to the bag.","According to some embodiments, the method might further comprise determining, with a location detection device of the device, a first location of the device when measuring the first weight of the bag, and storing, with the device, the first location in the local data storage device.","Notifying the user might comprise sending a message containing the first location.","In some embodiments, the method might also comprise determining, with the location detection device of the device, a second location of the device when measuring the second weight of the bag, and storing, with the device, the second location in the local data storage device.","Notifying the user might comprise sending a message containing each location where a weight of the bag was measured (this might allow the user to retrace where a lost item might be located, i.e., by retracing where the item might have been removed from the bag).","In embodiments in which the device comprises a location detection device, determining that the bag is being moved might comprise determining, with the location detection device, that a present location of the device is different from the first location of the device.","In some embodiments, the method might further comprise determining, with the device, which of one or more items is missing from the bag based on a difference between the first weight and the second weight.","This might include pre-storing a plurality of weights of the bag, with and without each of the one or more items.","Notifying the user might further comprise indicating which of the one or more items might be missing based on the determination.","Merely by way of example, in some cases, notifying the user might comprise one or more of playing a recorded voice notification, emitting one or more audio tones, displaying one or more light sequences, displaying one or more icons, displaying a written message, sending an e-mail notification, sending a text message notification, sending a small message service (“SMS”) notification, sending a multi-media messaging service (“MMS”) notification, or sending a chat message notification.","In another aspect, an apparatus might comprise at least one processor, a weight measurement device, a user interface device, and a computer readable storage medium in communication with the at least one processor.","The computer readable storage medium might have stored thereon computer software.","The computer software might comprise a set of instructions that, when executed by the at least one processor, causes the apparatus to perform one or more operations.","The set of instructions might comprise instructions to receive a first user input from a user to lock-in a first weight of a bag, instructions to measure the first weight of the bag, in response to receiving the first user input, and instructions to store the measured first weight of the bag in the computer readable storage medium, prior to the user removing one or more items from the bag.","The set of instructions might further comprise instructions to determine that the bag is being moved, instructions to measure a second weight of the bag, and instructions to determine whether the second weight of the bag matches the stored first weight of the bag.","The set of instructions might also comprise instructions to, based on a determination that the second weight does not match the first weight, notify the user.","According to some embodiments, the apparatus might further comprise a location detection device (including, without limitation, a global positioning system (“GPS”), position triangulation transceivers, and/or the like).","In some cases, the apparatus might further comprise a network interface device (including, but not limited to, Bluetooth™ device, an 802.11 device, a WiFi device, a WiMax device, a WWAN device, cellular communication devices, and/or the like).","The user interface device, in some embodiments, might comprise one or more of one or more display devices, one or more audio speakers, one or more touchscreen display devices, one or more buttons, one or more switches, or one or more light emitting devices.","In yet another aspect, a method might comprise determining, with a device, that a weight of a bag has changed, and in response to such determination, notifying, with the device, that one or more items may be missing from the bag based on the determined change in weight.","Various modifications and additions can be made to the embodiments discussed without departing from the scope of the invention.","For example, while the embodiments described above refer to particular features, the scope of this invention also includes embodiments having different combination of features and embodiments that do not include all of the above described features."],["CROSS-REFERENCE TO RELATED APPLICATIONS This application is a continuation of U.S. patent application Ser.","No.","14/605,590 (the “'590 application”), filed Jan. 26, 2015 by Faisal Shah et al.","(attorney docket no.","0837.02) and titled “Item and Luggage Loss Prevention System” which claims priority to U.S. Patent Application Ser.","No.","61/943,765 (the “'765 application”), filed Feb. 24, 2014 by Faisal Shah (attorney docket no.","0562.01PR) and titled “Item and Luggage Loss Prevention System” and U.S. Patent Application Ser.","No.","62/046,690 (the “'690 application”), filed Sep. 5, 2014 by Faisal Shah et al.","(attorney docket no.","0562.02PR) and titled “Item and Luggage Loss Prevention System.” The respective disclosures of these applications/patents (which this document refers to collectively as the “Related Applications”) are incorporated herein by reference in their entirety for all purposes.","COPYRIGHT STATEMENT A portion of the disclosure of this patent document contains material that is subject to copyright protection.","The copyright owner has no objection to the facsimile reproduction by anyone of the patent document or the patent disclosure as it appears in the Patent and Trademark Office patent file or records, but otherwise reserves all copyright rights whatsoever.","FIELD The present disclosure relates, in general, to a device, system, and method for preventing loss of items or luggage, and, more particularly, to a device, system, and method for preventing loss of items or luggage based on weight measurements.","BACKGROUND Airports around the world have an epidemic.","People are losing valuable items every time they go through the security checkpoint(s) at airports.","This is because one of the requirements of airport security is that travelers must remove their laptops from their bags.","Another requirement is that travelers remove phones and other metallic objects from their persons before passing through the scanners.","As a consequence, there is a natural tendency for travelers to walk away without collecting their items (including, without limitation, laptops, smart phones, tablet computers, cellular phones, media players, and/or the like).","Approximately 1.7 million people travel through U.S. airports each day.","Items are lost everywhere in the airports, including, but not limited to, on planes, in terminal gates, in lounges, and/or the like.","It is estimated that over 16,000 laptops are left at U.S. airports each year.","The laptop loss alone is estimated to be around $700 million.","Travelers' items left in airports also put a significant strain on the already over-worked security personnel such as Transportation Security Administration (“TSA”) personnel in the U.S.","It requires that such personnel retain and manage custody of such lost items.","Currently, such lost items are collected by TSA agents and held for 30 days.","After the 30-day period expires, the hard drives and/or memory are removed and the items are put on auction.","All the information in the computing devices is subsequently destroyed.","This process requires man-hours for collecting the lost items, tracking how long the lost items have been held, removing data storage drives, destroying information stored in the devices, and auctioning the items.","Third party non-governmental Lost and Found web sites have been established in an effort to help people recover their lost items.","It is unclear, however, how successful these sites are.","But, for such sites to be useful, the travelers would have to know about a particular site in order to be able to post that they have lost something at a particular airport.","It would also require that the person who has possession of the lost item(s) know about the site so that they can contact the person that lost such item(s).","In general, such web sites only serve to work on the recovery of lost items, but cannot help to prevent loss of the items in the first place.","In terms of the use of weight measurement of luggage, existing travel scales provide weighing functionality, but such devices are incapable of alerting a traveler of a change in weight (such as when an item has not been put back in the luggage, or the like).","Hence, there is a need for more robust and scalable solutions for preventing item and luggage loss.","BRIEF SUMMARY Various embodiments provide techniques for implementing item or luggage loss prevention, which, in some cases, is based on weight measurements.","According to some embodiments, a device containing a processor might be configured to be placed under a bag's handle.","The device might contain a small display (including, without limitation, a liquid crystal display (“LCD”), a light emitting diode (“LED”) display, an organic LED (“oLED”) display, and/or the like) and a processor.","The device might allow the user to lock in a weight of a bag.","If any item is then removed from (and not returned to) the bag, the device might notify the user (e.g., using audio notification (e.g., recorded voice notification, beeps, and/or the like), visual notification (e.g., blinking lights, flashing icons, written messages, and/or the like), and/or mobile device notification (e.g., e-mail notification, text message notification, small message service (“SMS”) notification, multi-media messaging service (“MMS”) notification, chat message notification, and/or the like) that the weight of the bag has changed (from the locked-in weight).","In some embodiments, the device might comprise an LCD display for the weight and notification, an on or off button, and one or more button(s) to store/lock-in a weight (or to change the lock-in weight) and to release or delete any locked-in or stored weights.","The tools provided by various embodiments include, without limitation, methods, systems, and/or software products.","Merely by way of example, a method might comprise one or more procedures, any or all of which might be executed by a computer system.","Correspondingly, an embodiment might provide a computer system configured with instructions to perform one or more procedures in accordance with methods provided by various other embodiments.","Similarly, a computer program might comprise a set of instructions that are executable by a computer system, or by a processor located in the computer system, to perform such operations.","In many cases, such software programs are encoded on physical, tangible, and/or non-transitory computer readable media.","Such computer readable media might include, to name but a few examples, optical media, magnetic media, and the like.","In an aspect, a method might comprise receiving, with a device, a first user input from a user to lock-in a first weight of a bag, measuring, with the device, the first weight of the bag, in response to receiving the first user input, and storing, with the device and in a local data storage device, the measured first weight of the bag, prior to the user removing one or more items from the bag.","The method might further comprise measuring, with the device, a second weight of the bag, for example, in response to second user input, in response to determining that the bag is being moved, etc.","The method, then, might include determining, with the device, whether the second weight of the bag matches the stored first weight of the bag.","The method might also comprise, based on a determination that the second weight does not match the first weight, notifying, with the device, the user.","According to some embodiments, measuring each of the first weight and the second weight might comprise measuring using a weight measurement device comprising a contact surface and a contact sensor.","The weight measurement device might have a structure that causes the contact surface to be brought into contact with the contact sensor when a first portion of the weight measurement device is lifted with respect to a second portion of the weight measurement device, which is coupled to the bag.","In some cases, the contact sensor might comprise at least one of a flex sensor, a piezoelectric-based sensor, a compression-based sensor, and/or a spring-based sensor.","In some embodiments, the device might be attached to the bag.","The bag, according to some embodiments, might comprise one or more of a purse, a handbag, a tote, a briefcase, a satchel, laptop bag, travel bag, or carry-on luggage.","In some cases, the device might be attached to one or more handles of the bag.","The device, in some instances, might be placed in an interior compartment of the bag.","In some embodiments, the device might be placed at a bottom portion of the interior compartment of the bag (ideally, below the one or more items when the one or more items are placed in the bag).","According to some embodiments, the device might be placed below one or more feet of the bag.","In some cases, the device might be affixed to a position between the bag and each of one or more wheel casters of the bag.","In alternative cases, the device might be positioned within one or more wheel casters of the bag.","In some aspects, measuring each of the first weight and the second weight might comprise measuring using a weight measurement device comprising a load cell selected from a group consisting of a strain gauge load cell, a piezoelectric load cell, a capacitive load cell, a compression load cell, a compression/tension load cell, an S-beam load cell, a bending beam load cell, a platform load cell, a single point load cell, a canister load cell, and a low profile load cell.","Determining that the bag is being moved might, in some embodiments, comprise determining, with the device, that the load cell of the weight measurement device is being actuated (which might indicate that the bag is being lifted).","In some cases, determining that the second weight does not match the first weight might comprise determining that the second weight is less than the first weight.","In some instances, determining that the second weight does not match the first weight might comprise determining that the second weight is greater than the first weight.","In either case, notifying the user might comprise reminding the user to check that the one or more items that were removed from the bag have been returned to the bag.","According to some embodiments, the method might further comprise determining, with a location detection device of the device, a first location of the device when measuring the first weight of the bag, and storing, with the device, the first location in the local data storage device.","Notifying the user might comprise sending a message containing the first location.","In some embodiments, the method might also comprise determining, with the location detection device of the device, a second location of the device when measuring the second weight of the bag, and storing, with the device, the second location in the local data storage device.","Notifying the user might comprise sending a message containing each location where a weight of the bag was measured (this might allow the user to retrace where a lost item might be located, i.e., by retracing where the item might have been removed from the bag).","In embodiments in which the device comprises a location detection device, determining that the bag is being moved might comprise determining, with the location detection device, that a present location of the device is different from the first location of the device.","In some embodiments, the method might further comprise determining, with the device, which of one or more items is missing from the bag based on a difference between the first weight and the second weight.","This might include pre-storing a plurality of weights of the bag, with and without each of the one or more items.","Notifying the user might further comprise indicating which of the one or more items might be missing based on the determination.","Merely by way of example, in some cases, notifying the user might comprise one or more of playing a recorded voice notification, emitting one or more audio tones, displaying one or more light sequences, displaying one or more icons, displaying a written message, sending an e-mail notification, sending a text message notification, sending a small message service (“SMS”) notification, sending a multi-media messaging service (“MMS”) notification, or sending a chat message notification.","In another aspect, an apparatus might comprise at least one processor, a weight measurement device, a user interface device, and a computer readable storage medium in communication with the at least one processor.","The computer readable storage medium might have stored thereon computer software.","The computer software might comprise a set of instructions that, when executed by the at least one processor, causes the apparatus to perform one or more operations.","The set of instructions might comprise instructions to receive a first user input from a user to lock-in a first weight of a bag, instructions to measure the first weight of the bag, in response to receiving the first user input, and instructions to store the measured first weight of the bag in the computer readable storage medium, prior to the user removing one or more items from the bag.","The set of instructions might further comprise instructions to determine that the bag is being moved, instructions to measure a second weight of the bag, and instructions to determine whether the second weight of the bag matches the stored first weight of the bag.","The set of instructions might also comprise instructions to, based on a determination that the second weight does not match the first weight, notify the user.","According to some embodiments, the apparatus might further comprise a location detection device (including, without limitation, a global positioning system (“GPS”), position triangulation transceivers, and/or the like).","In some cases, the apparatus might further comprise a network interface device (including, but not limited to, Bluetooth™ device, an 802.11 device, a WiFi device, a WiMax device, a WWAN device, cellular communication devices, and/or the like).","The user interface device, in some embodiments, might comprise one or more of one or more display devices, one or more audio speakers, one or more touchscreen display devices, one or more buttons, one or more switches, or one or more light emitting devices.","In yet another aspect, a method might comprise determining, with a device, that a weight of a bag has changed, and in response to such determination, notifying, with the device, that one or more items may be missing from the bag based on the determined change in weight.","Various modifications and additions can be made to the embodiments discussed without departing from the scope of the invention.","For example, while the embodiments described above refer to particular features, the scope of this invention also includes embodiments having different combination of features and embodiments that do not include all of the above described features.","BRIEF DESCRIPTION OF THE DRAWINGS A further understanding of the nature and advantages of particular embodiments may be realized by reference to the remaining portions of the specification and the drawings, in which like reference numerals are used to refer to similar components.","In some instances, a sub-label is associated with a reference numeral to denote one of multiple similar components.","When reference is made to a reference numeral without specification to an existing sub-label, it is intended to refer to all such multiple similar components.","FIG.","1 is a general schematic diagram illustrating a system for implementing item or luggage loss prevention, in accordance with various embodiments.","FIGS.","2A and 2B are general block diagrams illustrating various apparatuses for implementing item or luggage loss prevention, in accordance with various embodiments.","FIGS.","3A-3F are general schematic diagrams illustrating various placement and configurations for an apparatus for implementing item or luggage loss prevention, in accordance with various embodiments.","FIGS.","4A-4F are general schematic diagrams illustrating various views and configurations of an apparatus for implementing item or luggage loss prevention, in accordance with various embodiments.","FIG.","5 is a general schematic flow diagram illustrating a method for implementing item or luggage loss prevention, in accordance with various embodiments.","FIG.","6 is a block diagram illustrating an exemplary computer architecture, in accordance with various embodiments.","FIG.","7 is a block diagram illustrating a networked system of computers, which can be used in accordance with various embodiments.","DETAILED DESCRIPTION OF CERTAIN EMBODIMENTS While various aspects and features of certain embodiments have been summarized above, the following detailed description illustrates a few exemplary embodiments in further detail to enable one of skill in the art to practice such embodiments.","The described examples are provided for illustrative purposes and are not intended to limit the scope of the invention.","In the following description, for the purposes of explanation, numerous specific details are set forth in order to provide a thorough understanding of the described embodiments.","It will be apparent to one skilled in the art, however, that other embodiments of the present invention may be practiced without some of these specific details.","In other instances, certain structures and devices are shown in block diagram form.","Several embodiments are described herein, and while various features are ascribed to different embodiments, it should be appreciated that the features described with respect to one embodiment may be incorporated with other embodiments as well.","By the same token, however, no single feature or features of any described embodiment should be considered essential to every embodiment of the invention, as other embodiments of the invention may omit such features.","Unless otherwise indicated, all numbers used herein to express quantities, dimensions, and so forth used should be understood as being modified in all instances by the term “about.” In this application, the use of the singular includes the plural unless specifically stated otherwise, and use of the terms “and” and “or” means “and/or” unless otherwise indicated.","Moreover, the use of the term “including,” as well as other forms, such as “includes” and “included,” should be considered non-exclusive.","Also, terms such as “element” or “component” encompass both elements and components comprising one unit and elements and components that comprise more than one unit, unless specifically stated otherwise.","Various embodiments provide techniques for implementing item or luggage loss prevention, which, in some cases, is based on weight measurements.","According to some embodiments, a device containing a processor might be configured to be placed under a bag's handle.","The device might contain a small display (including, without limitation, a liquid crystal display (“LCD”), a light emitting diode (“LED”) display, an organic LED (“oLED”) display, and/or the like) and a processor.","The device might allow the user to lock in a weight of a bag.","If any item is then removed from (and not returned to) the bag, the device might notify the user (e.g., using audio notification (e.g., recorded voice notification, audio tones, beeps, and/or the like), visual notification (e.g., blinking lights, flashing icons, written messages, and/or the like), and/or mobile device notification (e.g., e-mail notification, text message notification, small message service (“SMS”) notification, multi-media messaging service (“MMS”) notification, chat message notification, and/or the like) that the weight of the bag has changed (from the locked-in weight).","In some embodiments, the device might comprise an LCD display for the weight and notification, an on or off button, and one or more button(s) to store/lock-in a weight (or to change the lock-in weight) and to release or delete any locked-in or stored weights.","In operation, prior to purposefully removing an item(s) (including, without limitation, a laptop computer, a smart phone, a mobile phone, a portable gaming device, a portable media player, a tablet computer, an e-book reader, and/or the like) from a bag (including, but not limited to, a purse, a handbag, a tote, a briefcase, a satchel, laptop bag, travel bag, carry-on luggage, and/or the like), the user can lock-in a weight of the bag using the device described above.","This is applicable, for example, during security check-in at an airport terminal, during a meal in a restaurant, during a meeting, during a typical workday at the office, during school hours, and/or the like.","If the user starts to walk away without the item(s) being returned to the bag, the device will issue a notification, which may take one or more forms, including, without limitation, audio notifications (e.g., recorded voice notification, beeps, and/or the like), visual notifications (e.g., blinking lights, flashing icons, written messages, and/or the like), and/or mobile device notifications (e.g., e-mail notification, text message notification, SMS notification, MMS notification, chat message notification, and/or the like).","We now turn to the embodiments as illustrated by the drawings.","FIGS.","1-7 illustrate some of the features of the method, system, and apparatus for implementing item or luggage loss prevention, as referred to above.","The methods, systems, and apparatuses illustrated by FIGS.","1-7 refer to examples of different embodiments that include various components and steps, which can be considered alternatives or which can be used in conjunction with one another in the various embodiments.","The description of the illustrated methods, systems, and apparatuses shown in FIGS.","1-7 is provided for purposes of illustration and should not be considered to limit the scope of the different embodiments.","With reference to the figures, FIG.","1 is a general schematic diagram illustrating a system 100 for implementing item or luggage loss prevention, in accordance with various embodiments.","In FIG.","1, system 100 might comprise one or more user devices 105, a bag 110, and device 115.The one or more user devices 105 might comprise one or more tablet computers 105a, one or more smart phones 105b, one or more mobile phones 105c, or one or more portable gaming devices 105d, one or more e-book readers 105e, one or more media players 105f (such as an MP3 audio player, or the like), and/or the like.","The bag 110 might include one of a purse, a handbag, a tote, a briefcase, a satchel, laptop bag, travel bag, carry-on luggage, and/or the like.","Device 115 is an item or luggage loss prevention device as described in greater detail below with respect to FIGS.","2 and 3.System 100 might further comprise server 120 communicatively coupled to the device 115 via network 125 (which might be an access network), and in some cases via one or more telecommunications relay systems 130.The one or more telecommunications relay systems 130 might include, without limitation, one or more wireless network interfaces (e.g., wireless modems, wireless access points, and the like), one or more towers, one or more satellites, and the like.","System 100 might further comprise database 135 in communication with server 120.In some embodiments, system 100 might further comprise a plurality of user devices 140, which might include, without limitation, one or more tablet computers 140a, one or more smart phones 140b, one or more mobile phones 140c, or one or more portable gaming devices 140d, one or more e-book readers 140e, one or more media players 140f (such as an MP3 audio player, or the like), one or more desktop computers 140g, one or more laptop computers 140h, and/or the like.","In some cases, the one or more tablet computers 140a, one or more smart phones 140b, one or more mobile phones 140c, or one or more portable gaming devices 140d, one or more e-book readers 140e, one or more media players 140f might be the same as the one or more tablet computers 105a, one or more smart phones 105b, one or more mobile phones 105c, or one or more portable gaming devices 105d, one or more e-book readers 105e, one or more media players 105f.","In operation, device 115 might allow a user to lock-in a first weight of bag 110 containing the one or more user devices 105.When the user removes at least one of the one or more user devices 105 (e.g., during airport security check-in, during the work day, during a meal, during school, and/or the like), the first weight will have been stored in memory (either on the device 115 locally, or in database 135 via server 120 and network 125).","When the user moves the bag, the device 115 might determine that the bag is being moved.","In some instances, this might be accomplished by sensing, using a weight measurement device of device 115, that the bag is being lifted.","Alternatively, or additionally, the device 115 might comprise a location detection device (e.g., a GPS device, a location triangulation transceiver, and/or the like), which might be used to determine a change in location of the device 115 and/or the bag 110.Once it is determined that the bag 110 is being moved, the device 115 might measure a second weight of the bag 110, and might determine whether the second weight is different from the first weight.","If so, the device 115 might notify the user that the weight of bag 110 has changed.","Notification, in some cases, might take the form of audio notification, visual notification, and/or wireless notification.","Audio notification might include, without limitation, recorded voice notification, audio tones, beeps, and/or the like).","Visual notification might include, but is not limited to, blinking lights, flashing icons, written messages, and/or the like.","Wireless notification might include, without limitation, e-mail notification, text message notification, small message service (“SMS”) notification, multi-media messaging service (“MMS”) notification, chat message notification, and/or the like.","In the case of wireless notification, a network interface device of the device 115 might communicate with server 120 via network 125 (and, in some instances, via the one or more telecommunications relay systems 130).","The server 120 might send the e-mail, text, SMS, MMS, and/or chat notifications via network 125 (and, in some instances, via the one or more telecommunications relay systems 130) to the one or more user devices 140.Alternatively, device 115 might directly send the e-mail, text, SMS, MMS, and/or chat notifications via network 125 (and, in some instances, via the one or more telecommunications relay systems 130) to the one or more user devices 140.In some embodiments, the one or more user devices 140 might be associated with the user (or owner of bag 110), while in other cases, the one or more user devices 140 might be associated with a family member or friend (e.g., a travelling companion) of the user (or owner of bag 110).","Such preferences for sending the notification can be set up by the user on the device 115 itself and/or at the server 120 (e.g., via a user interface (such as a web user interface, or an App interface, or the like)).","In some cases, a spouse (or boyfriend or girlfriend), or a parent, of the owner of the bag 110 might set up the device 115 to notify him- or herself (and/or to notify the owner of the bag 110).","We now turn to FIGS.","2 and 3, which are directed to apparatuses 200 and/or configurations for implementing item or luggage loss prevention, in accordance with various embodiments.","In particular, FIGS.","2A and 2B (collectively, “FIG.","2”) are general block diagrams illustrating various apparatuses 200 for implementing item or luggage loss prevention, in accordance with various embodiments.","FIGS.","3A-3F (collectively, “FIG.","3”) are general schematic diagrams illustrating various placement and configurations for an apparatus for implementing item or luggage loss prevention, in accordance with various embodiments.","In FIG.","2A, apparatus 205, which corresponds to device 115 in FIG.","1 (as described in detail above), might comprise processor 210, memory 215, user interface device 220, weight measurement device 225, audio device 230, and/or display device 235.Memory 215 might store the notification preferences as well as one or more weights (or lock-in weights).","User interface device 220 might comprise one or more touchscreen display devices, one or more buttons, one or more switches, or one or more light emitting devices.","Weight measurement device 225 might comprise a load cell selected from a group consisting of a strain gauge load cell, a piezoelectric load cell, a capacitive load cell, a compression load cell, a compression/tension load cell, an S-beam load cell, a bending beam load cell, a platform load cell, a single point load cell, a canister load cell, and/or a low profile load cell.","Audio device 230 might comprise, without limitation, one or more speakers, one or more tone generation devices, and/or the like.","Display device 235 might comprise one or more light emitting devices, one or more touchscreen devices, one or more liquid crystal displays (“LCDs”), one or more light emitting diode (“LED”) displays, one or more organic LED (“oLED”) displays, and/or the like.","In FIG.","2B, another embodiment of apparatus 205 might further comprise one or more location detection devices 240 (which might include, without limitation, a GPS device, a location triangulation transceiver, and/or the like), one or more network interface devices 245 (which might include, but is not limited to, Bluetooth™ device, an 802.11 device, a WiFi device, a WiMax device, a WWAN device, cellular communication devices, and/or the like).","Apparatuses 200 might function in a manner similar to device 115 described in detail above with respect to FIG.","1.In FIG.","3, various different configurations and placement of a device 325 corresponding to device 115 or apparatus 200 are shown.","As shown in FIG.","3, bag 205 might comprise one or more handles 310, one or more feet 315, and/or one or more wheel casters 320.Although FIG.","3 shows a particular type of bag, the various embodiments are not so limited, and the bag 305 can be any suitable bag including, without limitation, a purse, a handbag, a tote, a briefcase, a satchel, laptop bag, travel bag, carry-on luggage, and/or the like.","In the embodiment of FIG.","3A, device 325 might be affixed to at least an underside of the one or more handles 310.In particular, the weight measurement device 225 (shown in FIG.","2) might be placed under the one or more handles 310.In some embodiments, some portion of the device 325 (e.g., one or more of processor 210, memory 215, user interface device 220, audio device 230, display device 235, location detection device 240, and/or network interface device 245) might be positioned above the handles 310.In such a manner, these components may be protected against damage from constant lifting.","Also, having the display device and the audio device on the upper side of the handles 310 might allow the user to better see and hear notifications through these components.","In the embodiment of FIG.","3B, device 325 might be placed at a bottom portion of an interior of the bag 305, ideally below where the one or more user devices (e.g., user devices 105 of FIG.","1) might be placed.","In the embodiment of FIG.","3C, device 325 might be affixed or attached to the bag 305 between the bag 305 and the one or more handles 310.In the embodiment of FIG.","3D, device 325 might be affixed to the bottom of the one or more feet 315, while in the embodiment of FIG.","3E, the devices 325 might be affixed or attached to the bag 305 between the bag 305 and the one or more wheel casters 320.Alternatively, as shown in the embodiment of FIG.","3F, device 325 might be part of each of the wheel casters 320, where each device 325 might be positioned between the base 320a and the body 320b of each wheel casters 320, above the wheels 320c.","In the case of embodiments shown in FIGS.","3A and 3C, weight measurements must be taken while the corresponding bags 305 are being lifted.","In the embodiment of FIG.","3B, weight measurements may be taken when the bag 305 is being lifted and when it is resting on a surface (e.g., ground, seat, table, etc.).","For the embodiments shown in FIGS.","3D-3F, weight measurements may be taken when the bags are resting on a surface (e.g., ground, seat, table, etc.).","With reference to FIGS.","4A-4F (collectively, “FIG.","4”), which are general schematic diagrams illustrating various views and configurations of an apparatus 400 for implementing item or luggage loss prevention, in accordance with various embodiments.","FIGS.","4A-4C show side views of apparatus 400, in which FIGS.","4A and 4C show partial cut-out views of portions of the apparatus 400.FIG.","4D shows a partial sectional view of portions of the apparatus 400 as seen along the direction of the A-A arrows in FIG.","4B, while FIG.","4E shows a partial sectional view of portions of the apparatus 400 as seen along the direction of the B-B arrows in FIG.","4B; in FIG.","4E, partial sectional view of contact surface 440 is shown as a small circle for ease of illustration particularly as compared with surrounding components and elements of the apparatus 400 (and not intended as an accurate sectional or partial section view of contact surface 440).","FIG.","4F shows a different embodiment of apparatus 400.In FIG.","4, dash-lines or dotted-lines might denote cut-out or partial cut-out portions.","In FIG.","4, apparatus 400 might comprise a main body portion 405 and a piston portion 410.The main body portion 405 might comprise a shell portion 415 and first attachment portion 420.The shell portion 415 might comprise a first cap portion 415a and a second cap portion 415b.","The first attachment portion 420 might attach to the first cap portion.","The second cap portion is shown in greater detail in FIGS.","4D and 4E (and is described further below).","According to some embodiments, the first attachment portion 420 might comprise one of a strap, a handle, and/or a resilient loop, each of which might be made of any suitable material including, but not limited to, metal, rubber, cloth, plastic, silicone, wood, or the like, and/or any combination of these materials.","The piston portion 410 might comprise a first attachment brace 425a, a second attachment brace 425b, a second attachment portion 430, and at least one rod 435.The first attachment brace 425a might include contact surface 440, which might comprise any suitable contact point including, but not limited to, a hemispheric contact point, a cubic contact point, a rectangular box contact point, a ball contact point, and/or the like.","In some embodiments, the second attachment portion 430 might comprise one of a strap, a handle, and/or a resilient loop, each of which might be made of any suitable material including, but not limited to, metal, rubber, cloth, plastic, silicone, wood, or the like, and/or any combination of these materials.","The apparatus 400 might further comprise a contact sensor 445, which may be either integrally formed with the second cap portion 415b or separately formed with respect to the second cap portion 415b (but later affixed to the second cap portion 415b, before assembly of the piston portion 410 within the main body portion 405).","The apparatus 400 might further comprise a sensor cable 450 and an interface device 455.The sensor cable 450 might, in some cases, communicatively couple the contact sensor 445 with the interface device 455.The processing or calculation of the weight based on the applied force (and changes in units of measurement, taring (i.e., the process of accounting for weight of the luggage and/or other components from the gross weight to measure weight of specific item(s) in the luggage), and/or the like) may be performed by a processor that is either located in the contact sensor 445 and/or the interface device 455.According to some embodiments, the contact sensor 445 might include, without limitation, at least one of a flex sensor, a piezoelectric-based sensor, a compression-based sensor, a spring-based sensor, and/or the like.","The contact surface 440 may be made of any suitable material, including, without limitation, metal, rubber, cloth, plastic, silicone, wood, or the like, and/or any combination of these materials, so long as the material does not deform so much that accurate measurement of force of contact between the contact surface 440 and the contact sensor 445 cannot be made.","In some cases, the contact surface 440 might be integrally formed with the first attachment brace 425a (and might be of the same material or different material from the material of the first attachment brace 425a).","In some instances, the contact surface 440 might be separately formed from the first attachment brace 425a (and might be of the same material or different material from the material of the first attachment brace 425a), and might be assembled with the first attachment brace 425a prior to assembly in the main body portion 405.In operation, one of the main body portion 405 or the piston portion 410 might be (removably or permanently) attached or affixed to a piece of luggage (e.g., bag 305 as shown in FIG.","3, or any other suitable type of baggage, or the like), while the other of the main body portion 405 or the piston portion 410 might be carried (i.e., manipulated) by a user.","When no force is applied (or when not fully lifted), the contact surface 440 and the contact sensor 445 might be spaced apart (as shown in FIG.","4A).","When the user-manipulated portion (i.e., one of the main body portion 405 or the piston portion 410) is lifted, however, the first attachment brace 425a (and the contact surface 440 that is attached thereto or is otherwise part thereof) might move toward the second cap portion 415b (and the contact sensor 445 that is attached thereto or is otherwise part thereof), until the contact surface 440 makes contact with the contact sensor 445 (as shown in FIG.","4C).","When the relative positions of the main body portion 405 and the piston portion 410 have stabilized (i.e., as weight of the luggage and contents therein are applied), the contact surface 440 applies a proportional amount of force to the contact sensor 445, which is measured and eventually registered as weight (in a manner similar to that described with respect to FIGS.","1-3 and 5).","The weight may, in some cases, be displayed on a display screen or display device of the interface device 455.In some embodiments, the weight might be sent wirelessly as a data packet (from the interface device 455 and/or from the contact sensor 445) to a user device (e.g., smart phone, laptop, television, and/or the like) to be displayed on a display screen of the user device.","In some embodiments, the interface device 455 might comprise one or more of a display screen to display computed/measured weight, a voice output device (e.g., a speaker or the like) to provide vocal (or simulated vocal) outputs of the computed/measured weight, buttons to allow the user to select options (e.g., to turn on/off the display, to turn on/off the vocal output device, to select unit of weight, to select options for storing weights, to send computed/measured weights or other stored values or data to another user device (including, but not limited to, a smart phone, a mobile phone, a tablet computer, a laptop computer, a desktop computer, a television, and/or the like), to a server, and/or the like)).","In some cases, such as in embodiments where the one of the main body portion 405 or the piston portion 410 is (removably or permanently) attached or affixed to the piece of luggage, the interface device 455 might comprise attachment mechanisms that allow the interface device 455 to also be (removably or permanently) attached or affixed to the piece of luggage (ideally in a manner so as to be easily viewed and/or manipulated by the user).","In some instances, the interface device 455 might be (removably or permanently) attached or affixed to some portion of the apparatus 400, including, without limitation, the first attachment portion 420, the second attachment portion 430, the first cap portion 415a, the second cap portion 415b, an exterior part of the shell portion 415, and/or the like.","In a non-limiting example, FIG.","4F shows the interface device 455 (removably or permanently) attached or affixed to an exterior portion of the first cap portion 415a (along the side of the shell portion 415).","According to some embodiments, where the interface device 455 is permanently attached or affixed to an exterior portion of the apparatus 400 (including, without limitation, the first attachment portion 420, the second attachment portion 430, the first cap portion 415a, the second cap portion 415b, an exterior part of the shell portion 415, and/or the like), the sensor cable 450 might be routed within the shell portion 415.In some embodiments, where the interface device 455 is (removably or permanently) attached or affixed to a portion of the piece of luggage, or removably attached or affixed to an exterior portion of the apparatus 400 (including, without limitation, the first attachment portion 420, the second attachment portion 430, the first cap portion 415a, the second cap portion 415b, an exterior part of the shell portion 415, and/or the like), the sensor cable 450 might be routed through slot 460 (as shown in FIG.","4B).","In some cases, the at least one rod 435 might include one of two rods (as shown in FIG.","4), three rods (not shown), four rods (not shown), or any suitable number of rods.","In some instances, the first attachment brace 425a and each of the at least one rod 435 might form a U-shaped brace (not shown), the “legs” of which might fit through the openings 465 in the second attachment brace 425b, while the “top” of the U-shaped brace might include contact surface 440.In some embodiments, the U-shaped brace might include, without limitation, one of a curved U-shaped brace, a flat U-shaped brace, or a curved W-shaped brace, and/or the like.","The curved U-shaped brace might comprise a “top” of the U-shaped brace that is curved outward toward first cap portion 415a when the U-shaped brace is installed in the main body portion 405.The flat U-shaped brace might include a “top” of the U-shaped brace that is substantially perpendicular with the “legs” of the U-shaped brace.","The curved W-shaped brace might have a “top” of the U-shaped brace that first curves outward toward the first cap portion 415a (when the U-shaped brace is installed in the main body portion 405) from each of the “legs,” then curved inward away from the first cap portion 415a and toward the second cap portion 415b to meet in the middle (the overall shape of which evokes or resembles the letter W that has curvy connections).","In some instances, the U-shaped brace might have a flat profile (i.e., instead of “rods” for legs, the “legs” might be flat rectangular pieces).","In other cases, the U-shaped brace might have circular or oval cross-sections throughout (i.e., the “legs” and/or the “top” might be cylindrical or a bent cylinder, or the like).","FIGS.","4D and 4E show partial sectional views of apparatus 400 (along the A-A and B-B directions in FIG.","4B) that show how the piston portion 410 is connected or assembled with the main body portion 405.In particular, openings 465 (two in the case of the embodiment of FIG.","4D) are shown in the second cap portion 415b.","The openings 465 (shown as being circular in FIGS.","4D and 4E) may be of whatever shape that matches with the shape of the at least one rod 435, so as to allow each of the at least one rod 435 to pass through each corresponding opening 465.The contact sensor 445, although shown as having circular cross section, can have a cross section having any suitable shape, including, but not limited to, circle, square, triangle, rectangle, any polygon, or any irregular shape, and/or the like.","Likewise, the contact surface 440, although shown as having circular cross section, can have a cross section having any suitable shape, including, but not limited to, circle, square, triangle, rectangle, any polygon, or any irregular shape, and/or the like.","In general, however, the shapes of the contact sensor 445 and the contact surface 440 are chosen to complement each other (although not necessarily having the same shape) to ensure proper mutual contact to afford accurate force/weight measurements.","In some instances, one of the first attachment portion 420 or the second attachment portion 430 might include, without limitation, a handle, strap, or bar that is configured to be held with a user's hand(s), while the other of the first attachment portion 420 or the second attachment portion 430 might include, but is not limited to, a handle, strap, or bar that is configured to be (removably or permanently) attached or affixed to a piece of luggage.","In some embodiments, the other of the first attachment portion 420 or the second attachment portion 430 (i.e., the luggage-side attachment portion) might include, without limitation, a releasable engagement device 470, which might include (but is not limited) to one of a clasp, a buckle, a carabiner, a clip, or any other suitable fastener, or the like.","The releasable engagement device 470 might be made of any suitable material including, without limitation, metal, plastic, and/or the like.","In operation, the clasp-type or buckle-type engagement devices 470 might be separable into two portions, a first portion attached or affixed to a first part of the luggage-side attachment portion and a second portion attached or affixed to a second part of the luggage-side attachment portion.","In some cases, as shown in the non-limiting example of FIG.","4F, the first part 430′ of the luggage-side portion might be longer than the second part 430″ of the luggage-side portion, with the engagement device 470 removably coupling the first part 430′ to the second part 430″.","The longer first part 430′ allows the luggage-side portion to loop about a handle or other loop-type structure on the piece of luggage, and to allow the weight of the handle or other loop-type structure on the piece of luggage to be held against the first part 430′ without the weight of the luggage pressing against (and potentially damaging) the engagement device 470.In some cases, the apparatus 400 (including each of the main body portion 405 and the piston portion 410) might be cylindrical in shape.","In other cases, the apparatus 400 (including each of the main body portion 405 and the piston portion 410) might be rectangular in shape.","While in still other cases, the apparatus 400 (including each of the main body portion 405 and the piston portion 410) might be any suitable shape.","In some embodiments, any edges and/or any corners may be made to be rounded.","Although FIG.","4 shows the contact surface 440 attached or affixed to the piston portion 410 while the contact sensor 445 is shown attached or affixed to the main body portion 405, the various embodiments are not so limited, and the contact surface 440 attached or affixed to the main body portion 405 while the contact sensor 445 is shown attached or affixed to the piston portion 410.We now turn to FIG.","5, which is a general schematic flow diagram illustrating a method 500 for implementing item or luggage loss prevention, in accordance with various embodiments.","While the techniques and procedures of the method 500 is depicted and/or described in a certain order for purposes of illustration, it should be appreciated that certain procedures may be reordered and/or omitted within the scope of various embodiments.","Moreover, while the method illustrated by FIG.","5 can be implemented by (and, in some cases, are described below with respect to) systems 100 of FIG.","1 (or components thereof), apparatus 200 of FIG.","2, apparatus 325 of FIG.","3, and/or apparatus 400 of FIG.","4, the method may also be implemented using any suitable hardware implementation.","Similarly, while system 100 (and/or components thereof) can operate according to the method illustrated by FIG.","5 (e.g., by executing instructions embodied on a computer readable medium), system 100 can also operate according to other modes of operation and/or perform other suitable procedures.","In FIG.","5, method 500 might comprise, at block 505, determining, with a device, a first user input from a user to lock-in a first weight of a bag.","Method 500 might further comprise measuring, with the device, the first weight of the bag, in response to receiving the first user input (block 510).","At block 515, method 500 might comprise storing, with the device and in a local data storage device, the measured first weight of the bag, prior to the user removing one or more items from the bag.","In some embodiments, particular where the device might comprise a location detection device (such as location detection device 240 shown in FIG.","2), method 500 might, at block 520, comprise determining, with the location detection device of the device, a first location of the device (e.g., when measuring the first weight of the bag).","At block 525, method 500 might comprise storing, with the device, the first location in the local data storage device.","Method 500 might further comprise determining, with the device, that the bag is being moved (block 530).","In some cases, this might comprise determining, with the location detection device of the device, a second location of the device when measuring the second weight of the bag (block 535), storing, with the device, the second location in the local data storage device (block 540), and determining, with the device, that the second location is different from the first location.","At block 545, method 500 might comprise measuring, with the device, a second weight of the bag.","In some cases, this second measurement might be performed in response to determining that the bag is being moved.","In other cases, the second measurement might be performed in response to another triggering event (e.g., user input requesting the weight of the bag) and/or the measurement might be performed periodically.","Method 500, at block 550, might comprise determining, with the device, whether the second weight of the bag matches the stored first weight of the bag.","In some embodiments, method 500 might comprise, at block 555, determining, with the device, which of one or more items (including, without limitation, laptops, smart phones, tablet computers, cellular phones, media players, and/or the like) is missing from the bag based on a difference between the first weight and the second weight.","This might include pre-storing a plurality of weights of the bag, with and without each of the one or more items.","Based on a determination that the second weight does not match the first weight, method 500 might comprise notifying, with the device, the user (block 560).","In some embodiments, notifying the user might comprise one or more of playing a recorded voice notification, emitting one or more audio tones, displaying one or more light sequences, displaying one or more icons, displaying a written message, sending an e-mail notification, sending a text message notification, sending a small message service (“SMS”) notification, sending a multi-media messaging service (“MMS”) notification, or sending a chat message notification.","We now turn to FIG.","6, which is a block diagram illustrating an exemplary computer architecture.","FIG.","6 provides a schematic illustration of one embodiment of a computer system 600 that can perform the methods provided by various other embodiments, as described herein, and/or can perform the functions of local computer system 115, 205, 325, or 400, or remote computer system 120, or other computer systems as described above.","It should be noted that FIG.","6 is meant only to provide a generalized illustration of various components, of which one or more, or none, of each may be utilized as appropriate.","FIG.","6, therefore, broadly illustrates how individual system elements may be implemented in a relatively separated or relatively more integrated manner.","The computer system 600 is shown comprising hardware elements that can be electrically coupled via a bus 605, or may otherwise be in communication, as appropriate.","The hardware elements may include one or more processors 610, including without limitation one or more general-purpose processors, or one or more special-purpose processors such as digital signal processing chips, graphics acceleration processors, or the like; one or more input devices 615, which can include without limitation a mouse, a keyboard, or the like; and one or more output devices 620, which can include without limitation a display device, a printer, or the like.","The computer system 600 may further include, or be in communication with, one or more storage devices 625.The one or more storage devices 625 can comprise, without limitation, local and/or network accessible storage, or can include, without limitation, a disk drive, a drive array, an optical storage device, a solid-state storage device.","The solid-state storage device can include, but is not limited to, one or more of a random access memory (“RAM”) or a read-only memory (“ROM”), which can be programmable, flash-updateable, or the like.","Such storage devices may be configured to implement any appropriate data stores, including without limitation various file systems, database structures, or the like.","The computer system 600 might also include a communications subsystem 630, which can include without limitation a modem, a network card (wireless or wired), an infra-red communication device, a wireless communication device or chipset, or the like.","The wireless communication device might include, but is not limited to, a Bluetooth™ device, an 802.11 device, a WiFi device, a WiMax device, a WWAN device, cellular communication facilities, or the like.","The communications subsystem 630 may permit data to be exchanged with a network (such as network 125, to name an example), with other computer systems, with any other devices described herein, or with any combination of network, systems, and devices.","According to some embodiments, network 125 might include a local area network (“LAN”), including without limitation a fiber network, an Ethernet network, a Token-Ring™ network, and the like; a wide-area network (“WAN”); a wireless wide area network (“WWAN”); a virtual network, such as a virtual private network (“VPN”); the Internet; an intranet; an extranet; a public switched telephone network (“PSTN”); an infra-red network; a wireless network, including without limitation a network operating under any of the IEEE 802.11 suite of protocols, the Bluetooth™ protocol, or any other wireless protocol; or any combination of these or other networks.","In many embodiments, the computer system 600 will further comprise a working memory 635, which can include a RAM or ROM device, as described above.","The computer system 600 may also comprise software elements, shown as being currently located within the working memory 635, including an operating system 640, device drivers, executable libraries, or other code.","The software elements may include one or more application programs 645, which may comprise computer programs provided by various embodiments, or may be designed to implement methods and/or configure systems provided by other embodiments, as described herein.","Merely by way of example, one or more procedures described with respect to the methods discussed above might be implemented as code or instructions executable by a computer or by a processor within a computer.","In an aspect, such code or instructions can be used to configure or adapt a general purpose computer, or other device, to perform one or more operations in accordance with the described methods.","A set of these instructions or code might be encoded and/or stored on a non-transitory computer readable storage medium, such as the storage devices 625 described above.","In some cases, the storage medium might be incorporated within a computer system, such as the system 600.In other embodiments, the storage medium might be separate from a computer system—that is, a removable medium, such as a compact disc, or the like.","In some embodiments, the storage medium might be provided in an installation package, such that the storage medium can be used to program, configure, and/or adapt a general purpose computer with the instructions/code stored thereon.","These instructions might take the form of executable code, which is executable by the computer system 600, or might take the form of source or installable code.","The source or installable code, upon compilation, installation, or both compilation and installation, on the computer system 600 might take the form of executable code.","Compilation or installation might be performed using any of a variety of generally available compilers, installation programs, compression/decompression utilities, or the like.","It will be apparent to those skilled in the art that substantial variations may be made in accordance with specific requirements.","For example, customized hardware—such as programmable logic controllers, field-programmable gate arrays, application-specific integrated circuits, or the like—might also be used.","In some cases, particular elements might be implemented in hardware, software (including portable software, such as applets, etc.","), or both.","Further, connection to other computing devices such as network input/output devices may be employed.","As mentioned above, in one aspect, some embodiments may employ a computer system, such as the computer system 600, to perform methods in accordance with various embodiments of the invention.","According to a set of embodiments, some or all of the procedures of such methods might be performed by the computer system 600 in response to processor 610 executing one or more sequences of one or more instructions.","The one or more instructions might be incorporated into the operating system 640 or other code that may be contained in the working memory 635, such as an application program 645.Such instructions may be read into the working memory 635 from another computer readable medium, such as one or more of the storage devices 625.Merely by way of example, execution of the sequences of instructions contained in the working memory 635 might cause the one or more processors 610 to perform one or more procedures of the methods described herein.","The terms “machine readable medium” and “computer readable medium,” as used herein, refer to any medium that participates in providing data that causes a machine to operate in a specific fashion.","In an embodiment implemented using the computer system 600, various computer readable media might be involved in providing instructions or code to the one or more processors 610 for execution, might be used to store and/or carry such instructions/code such as signals, or both.","In many implementations, a computer readable medium is a non-transitory, physical, or tangible storage medium.","Such a medium may take many forms, including, but not limited to, non-volatile media, volatile media, and transmission media.","Non-volatile media includes, for example, optical disks, magnetic disks, or both, such as the storage devices 625.Volatile media includes, without limitation, dynamic memory, such as the working memory 635.Transmission media includes, without limitation, coaxial cables, copper wire and fiber optics, including the wires that comprise the bus 605, as well as the various components of the communication subsystem 630, or the media by which the communications subsystem 630 provides communication with other devices.","Hence, transmission media can also take the form of waves, including without limitation radio, acoustic, or light waves, such as those generated during radio-wave and infra-red data communications.","Common forms of physical or tangible computer readable media include, for example, a floppy disk, a flexible disk, a hard disk, magnetic tape, or any other magnetic medium; a CD-ROM, DVD-ROM, or any other optical medium; punch cards, paper tape, or any other physical medium with patterns of holes; a RAM, a PROM, an EPROM, a FLASH-EPROM, or any other memory chip or cartridge; a carrier wave; or any other medium from which a computer can read instructions or code.","As noted above, a set of embodiments comprises methods and systems for implementing item or luggage loss prevention.","FIG.","7 illustrates a schematic diagram of a system 700 that can be used in accordance with one set of embodiments.","The system 700 can include one or more user computers or user devices 705.A user computer or user device 705 can be a general purpose personal computer (including, merely by way of example, desktop computers, tablet computers, laptop computers, handheld computers, and the like, running any appropriate operating system, several of which are available from vendors such as Apple, Microsoft Corp., and the like) and/or a workstation computer running any of a variety of commercially-available UNIX™ or UNIX-like operating systems.","A user computer or user device 705 can also have any of a variety of applications, including one or more applications configured to perform methods provided by various embodiments (as described above, for example), as well as one or more office applications, database client and/or server applications, and/or web browser applications.","Alternatively, a user computer or user device 705 can be any other electronic device, such as a thin-client computer, Internet-enabled mobile telephone, and/or personal digital assistant, capable of communicating via a network (e.g., the network 710 described below) and/or of displaying and navigating web pages or other types of electronic documents.","Although the exemplary system 700 is shown with two user computers or user devices 705, any number of user computers or user devices can be supported.","Certain embodiments operate in a networked environment, which can include a network 710.The network 710 can be any type of network familiar to those skilled in the art that can support data communications using any of a variety of commercially-available (and/or free or proprietary) protocols, including without limitation TCP/IP, SNA™, IPX™, AppleTalk™, and the like.","Merely by way of example, the network 710 can include a local area network (“LAN”), including without limitation a fiber network, an Ethernet network, a Token-Ring™ network and/or the like; a wide-area network (“WAN”); a wireless wide area network (“WWAN”); a virtual network, such as a virtual private network (“VPN”); the Internet; an intranet; an extranet; a public switched telephone network (“PSTN”); an infra-red network; a wireless network, including without limitation a network operating under any of the IEEE 802.11 suite of protocols, the Bluetooth™ protocol known in the art, and/or any other wireless protocol; and/or any combination of these and/or other networks.","In a particular embodiment, the network might include an access network of the service provider (e.g., an Internet service provider (“ISP”)).","In another embodiment, the network might include a core network of the service provider, and/or the Internet.","Embodiments can also include one or more server computers 715.Each of the server computers 715 may be configured with an operating system, including without limitation any of those discussed above, as well as any commercially (or freely) available server operating systems.","Each of the servers 715 may also be running one or more applications, which can be configured to provide services to one or more clients 705 and/or other servers 715.Merely by way of example, one of the servers 715 might be a data server, as described above.","The data server might include (or be in communication with) a web server, which can be used, merely by way of example, to process requests for web pages or other electronic documents from user computers 705.The web server can also run a variety of server applications, including HTTP servers, FTP servers, CGI servers, database servers, Java servers, and the like.","In some embodiments of the invention, the web server may be configured to serve web pages that can be operated within a web browser on one or more of the user computers 705 to perform methods of the invention.","The server computers 715, in some embodiments, might include one or more application servers, which can be configured with one or more applications accessible by a client running on one or more of the client computers 705 and/or other servers 715.Merely by way of example, the server(s) 715 can be one or more general purpose computers capable of executing programs or scripts in response to the user computers 705 and/or other servers 715, including without limitation web applications (which might, in some cases, be configured to perform methods provided by various embodiments).","Merely by way of example, a web application can be implemented as one or more scripts or programs written in any suitable programming language, such as Java™, C, C#™ or C++, and/or any scripting language, such as Perl, Python, or TCL, as well as combinations of any programming and/or scripting languages.","The application server(s) can also include database servers, including without limitation those commercially available from Oracle™, Microsoft™, Sybase™, IBM™ and the like, which can process requests from clients (including, depending on the configuration, dedicated database clients, API clients, web browsers, etc.)","running on a user computer or user device 705 and/or another server 715.In some embodiments, an application server can perform one or more of the processes for implementing automated cloud expansion and ordering, or the like, as described in detail above.","Data provided by an application server may be formatted as one or more web pages (comprising HTML, JavaScript, etc., for example) and/or may be forwarded to a user computer 705 via a web server (as described above, for example).","Similarly, a web server might receive web page requests and/or input data from a user computer 705 and/or forward the web page requests and/or input data to an application server.","In some cases a web server may be integrated with an application server.","In accordance with further embodiments, one or more servers 715 can function as a file server and/or can include one or more of the files (e.g., application code, data files, etc.)","necessary to implement various disclosed methods, incorporated by an application running on a user computer 705 and/or another server 715.Alternatively, as those skilled in the art will appreciate, a file server can include all necessary files, allowing such an application to be invoked remotely by a user computer or user device 705 and/or server 715.It should be noted that the functions described with respect to various servers herein (e.g., application server, database server, web server, file server, etc.)","can be performed by a single server and/or a plurality of specialized servers, depending on implementation-specific needs and parameters.","In certain embodiments, the system can include one or more databases 720.The location of the database(s) 720 is discretionary: merely by way of example, a database 720a might reside on a storage medium local to (and/or resident in) a server 715a (and/or a user computer or user device 705).","Alternatively, a database 720b can be remote from any or all of the computers 705, 715, so long as it can be in communication (e.g., via the network 710) with one or more of these.","In a particular set of embodiments, a database 720 can reside in a storage-area network (“SAN”) familiar to those skilled in the art.","(Likewise, any necessary files for performing the functions attributed to the computers 705, 715 can be stored locally on the respective computer and/or remotely, as appropriate.)","In one set of embodiments, the database 720 can be a relational database, such as an Oracle database, that is adapted to store, update, and retrieve data in response to SQL-formatted commands.","The database might be controlled and/or maintained by a database server, as described above, for example.","According to some embodiments, the system can further include device 725, which is configured to be attached to and/or placed in a bag (including, without limitation, a purse, a handbag, a tote, a briefcase, a satchel, laptop bag, travel bag, carry-on luggage, and/or the like).","In some cases, device 725 is an item or luggage loss prevention device that is weight-measurement-based, as described in detail above with respect to FIGS.","1-5.In other words, device 725 might correspond with, and might have functionalities that are similar to, devices 115, 205, 325, and 400 as described in detail with respect to FIGS.","1-4.Although the above embodiments specifically identify electronics components as items that can be tracked (by weight) to prevent loss, the various embodiments are not so limited, and other items may be similarly tracked.","Such other items might include, without limitation, eye wear, time pieces (e.g., watches, stopwatches, etc.","), jewelry, clothing (ideally, heavier articles of clothing), gifts, toiletry, personal hygiene products, and/or the like.","In some embodiments, the systems, apparatuses, and/or methods described above may be applied to child safety seats or child seats.","For example, with reference to the embodiments of FIG.","3, device 325 (or similar device) may be affixed to at least an underside of a handle of the child seat (so that when positioned from a stored position to a carrying position, relative to the body of the child seat, the device is positioned on at least the underside of the handle), not unlike the relative positioning as shown in FIG.","3A.","In some cases, some portion of the device 325 (e.g., one or more of processor 210, memory 215, user interface device 220, audio device 230, display device 235, location detection device 240, and/or network interface device 245) might be positioned above the handles, not unlike the embodiment of FIG.","3A.","In some instances, device 325 (or similar device) might be affixed or attached to the child seat between the child seat and the handle (e.g., a hinge joint or other suitable connection joint, or the like), not unlike the embodiment of FIG.","3C.","In some cases, device 325 (or similar device) might be placed at a bottom portion of a child seat—for example, between a bottom shell portion and bottom inner cushions (i.e., the part on which a baby's body may be set to rest) of the child seat, not unlike the embodiment of FIG.","3B.","Alternatively, device 325 (or similar device) might be placed below the bottom shell portion of the child seat (i.e., below the feet of the child seat, if any), not unlike the embodiment of FIG.","3D.","In some instances, if the child seat has feet or wheels, device 325 (or similar device) might be placed between the bottom shell portion of the child seat and the feet or wheels of the child seat, not unlike the embodiment of FIG.","3E, or as part of the feet or wheels of the child seat, not unlike the embodiment of FIG.","3F.","Merely by way of example, for compression-based weight sensing, such as shown in the embodiments of FIG.","3A, 3B, or 3D-3F, the device 325 (or similar device) might comprise a contact surface (e.g., contact surface 440, or the like) and a contact sensor (e.g., contact sensor 445, or the like).","The contact surface and the contact sensor are configured so as to be spaced apart when not sensing—which, in some embodiments, may be accomplished with the use of springs, gravity, or the like.","Where springs are used, the sensor might be calibrated to take into account the spring constant and other properties of the spring and/or connection configurations when calculating or measuring weight.","The contact sensor, like that in the embodiment of FIG.","4, might communicatively couple to an interface device (e.g., interface device 455) via a cable (e.g., sensor cable 450).","A processor (located either in the contact sensor or the interface device) might perform processing or calculation of the weight based on the applied force.","In some cases, the interface device might couple to a network interface device and/or location detection device, and might allow sending of notifications, alerts, or messages to user devices associated with the parents or guardians of the baby if the baby is missing, in danger, or otherwise.","The location detection might help parents or guardians in determining where the child was last in the child seat, which may help in locating a missing baby.","In some embodiments, multiple devices may be used for each child seat, e.g., to provide more nuanced weight measurements (e.g., for detecting problems or issues that the baby might encounter, as described below).","For tension-based weight sensing, such as shown in the embodiments of FIG.","3C or 4, the apparatus 400 (or similar apparatus) may be used, in a manner as described above with respect to FIGS.","3C and 4.In some cases, the child seat might have an outer shell housing and an inner shell housing.","The inner shell housing might have the cushion and the like on which the baby may be set to rest, while the outer shell housing is designed to rest on a surface (e.g., seat of a car, a table, a bed, a ground surface, or a frame for a baby stroller, and/or the like).","In some embodiments, the outer shell housing might have a lip or wall that extends upward to encompass at least a portion of an exterior lip or wall of the inner shell housing, and the child seat might comprise two or more (e.g., three or four) connection apparatuses, not unlike apparatus 400 that connects or couples the inner shell housing to the outer shell housing.","In some cases, the outer shell housing lip or wall might be vertically aligned with the at least a portion of the exterior lip or wall of the inner shell housing, although such configuration is not necessary for achieving the functionalities described herein.","In one set of embodiments, for each of the connection apparatuses, the outer shell housing might be connected to first attachment portion (e.g., first attachment portion 420 or the like), while the inner shell housing might be connected to second attachment portion (e.g., second attachment portion 430 or the like).","In this manner, the inner shell housing is almost always hanging from the outer shell housing.","The tension-based weight sensing embodiments are otherwise similar, if not identical, to the compression-based weight sensing embodiments, and descriptions of the compression-based weight sensing embodiments are similarly applicable to those of the tension-based weight sensing embodiments.","With the systems, apparatuses, and methods described above, it is made possible to ensure that a baby is not left behind, such as when absent-minded and rushed parents or guardians are packing luggage and/or other children for a trip and potentially, accidentally leaving the baby behind (thinking that the baby is securely fastened in the child seat).","This might be exacerbated by child seat covers or blankets for keeping the baby warm (such covers or blankets might obscure one's view of the presence or absence of the baby).","With the systems, apparatuses, and methods described above, it may easily be determined that the baby is absent, and, in some cases, a notification (e.g., sound notification, e-mail notification, text/chat message notification, voice recording notification, and/or the like) might alert the parents or guardians of this fact (in some cases, by sending such notification to a mobile device(s) associated with the parents or guardians).","In some instances, a proximity or motion sensor on the child seat might determine whether a parent or other persons are moving away from the child seat, and might send such information to a processor (e.g., processor 210).","In some cases, the proximity sensor might track proximity (and/or movement relative) to a mobile device(s) associated with the parents or guardians of the child.","If the processor determines that the proximity or motion sensor data indicate that a parent or other persons have moved away from the child seat by a certain (predetermined or preset) distance while the child seat is occupied by a child (e.g., by receiving weight and weight change data indicating that the child is in the child seat, etc.","), regardless of whether the child seat is in a vehicle, at home, or in some other location, then the processor might send a notification (e.g., sound notification, e-mail notification, text/chat message notification, voice recording notification, and/or the like) of such fact to the mobile device(s) associated with the parents or guardians.","In some instances, such notification can warn the parents or guardians when the child seat with the child in it has been moved away from them (either inadvertently or purposefully) by some other person.","In other embodiments, the systems, apparatuses, and methods described above might determine that the baby has somehow gotten out of the child seat, and may alert the parents or guardians of such an event (in some cases, by sending a notification to the mobile device(s) associated with the parents or guardians).","In yet other embodiments, systems, apparatuses, and methods described above might determine that something is amiss with the baby (including, but not limited to, the baby is too still for too long, the weight distribution of the baby is not normal, excess weight is detected, and/or the like), which might indicate urgent (and potentially serious or dangerous) issues have arisen with respect to the baby (e.g., the baby is either in deep sleep or not breathing, the baby is in an odd position that might harm the baby, something has fallen on the child seat and/or the baby, and/or the like).","In some cases, with the constant or near constant weight measurement, and with appropriate storage devices installed or frequent sending of weight information to an external storage device, the baby's weight can be tracked over time to give the parents, guardians, or pediatrician a record of the baby's growth.","Although applications related to babies are described above with respect to child seats, other appliances or such may also be configured to use the systems, apparatuses, and/or methods described herein.","For example, bassinets (where stationary, rocking, hanging, or the like) may be modified (or designed) to utilize the systems, apparatuses, and/or methods herein, in a manner similar to those as described above with respect to the child seats.","With such modified (or designed) bassinets, it can be determined when and if the baby has fallen out, has crawled out, has climbed out, or has been taken out, or the like.","It can also be determined if, when, and for how long the baby has not been too still for too long, or if, when, and for how long an abnormal weight distribution of the baby is detected.","It can be determined if, when, and for how long an excess weight is detected (e.g., suddenly detected).","And so on.","These and other weight-based or weight determined issues may be determined, and notifications of such may be sent to parents, guardians, and/or pediatricians (or the parents, guardians, and/or pediatricians are otherwise alerted of such issues) as necessary or desired.","As with the child seat, the baby's weight can be tracked to allow recording of the baby's growth over time.","These and other similar systems, apparatuses, and methods may be similarly applicable to pet carriers, pet mats (or mattresses) in vehicles, pet mats (or mattresses) at home, and/or the like, in order to provide similar information to pet owners about their pets.","For outdoor sports enthusiasts, similar technology may be applied to vehicle parts to alert people of missing bicycles, kayaks, canoes, rafts, snowboards, skis, trailers, and/or the like.","The various embodiments are not limited to these specific embodiments described herein, and may be applied to other situations and uses, as ordinary (or skilled) person can appreciate.","While certain features and aspects have been described with respect to exemplary embodiments, one skilled in the art will recognize that numerous modifications are possible.","For example, the methods and processes described herein may be implemented using hardware components, software components, and/or any combination thereof.","Further, while various methods and processes described herein may be described with respect to particular structural and/or functional components for ease of description, methods provided by various embodiments are not limited to any particular structural and/or functional architecture but instead can be implemented on any suitable hardware, firmware and/or software configuration.","Similarly, while certain functionality is ascribed to certain system components, unless the context dictates otherwise, this functionality can be distributed among various other system components in accordance with the several embodiments.","Moreover, while the procedures of the methods and processes described herein are described in a particular order for ease of description, unless the context dictates otherwise, various procedures may be reordered, added, and/or omitted in accordance with various embodiments.","Moreover, the procedures described with respect to one method or process may be incorporated within other described methods or processes; likewise, system components described according to a particular structural architecture and/or with respect to one system may be organized in alternative structural architectures and/or incorporated within other described systems.","Hence, while various embodiments are described with—or without—certain features for ease of description and to illustrate exemplary aspects of those embodiments, the various components and/or features described herein with respect to a particular embodiment can be substituted, added and/or subtracted from among other described embodiments, unless the context dictates otherwise.","Consequently, although several exemplary embodiments are described above, it will be appreciated that the invention is intended to cover all modifications and equivalents within the scope of the following claims."]],"string":"[\n [\n \"Item and Luggage Loss Prevention System\",\n \"Novel tools and techniques are provided for implementing item or luggage loss prevention, which, in some cases, is based on weight measurement.\",\n \"In some embodiments, a device with a processor can be placed under a bag's handle, within an interior compartment of the bag, below or in the feet or wheels of the bag, and/or the like.\",\n \"The device can allow a user to lock in a weight of the bag.\",\n \"If any item is subsequently removed from (and not returned to) the bag, the device will notify the user, using one or more of audio notification, visual notification, and/or mobile device notification (e.g., via e-mail, text message, SMS, MMS, chat message, and/or the like) that the weight of the bag has changed.\",\n \"In some cases, location detection devices may be implemented to allow the user to backtrack where the missing item might have been left behind.\"\n ],\n [\n \"1.A method, comprising: receiving, with a device, a first user input from a user to lock-in a first weight supported by a car seat, wherein the first weight corresponds to an occupant in the car seat; measuring, with the device, the first weight of the occupant in the car seat, in response to receiving the first user input; storing, with the device and in a local data storage device, the measured first weight; measuring, with the device, a second weight of supported by the car seat; determining, with the device, whether the second weight matches the stored first weight; based on a determination that the second weight does not match the first weight, notifying, with the device, the user.\",\n \"2.The method of claim 1 further comprising attaching the device to the car seat.\",\n \"3.The method of claim 2 further comprising attaching the device to one or more handles of the car seat.\",\n \"4.The method of claim 1, further comprising placing the device at a bottom portion of the car seat.\",\n \"5.The method of claim 4, wherein the bottom portion includes one of under a bottom shell portion, within or on a bottom inner cushion, or between the bottom shell portion and the bottom inner cushion.\",\n \"6.The method of claim 1, further comprising placing the device below one or more feet of the car seat.\",\n \"7.The method of claim 1, further comprising affixing the device between the car seat and each of one or more wheel casters coupled to the car seat.\",\n \"8.The method of claim 1, wherein measuring each of the first weight and the second weight comprises measuring using a weight measurement device comprising a load cell selected from a group consisting of a strain gauge load cell, a piezoelectric load cell, a capacitive load cell, a compression load cell, a compression/tension load cell, an S-beam load cell, a bending beam load cell, a platform load cell, a single point load cell, a canister load cell, and a low profile load cell.\",\n \"9.The method of claim 8, further comprising: determining that the car seat is being moved by determining, with the device, that the load cell of the weight measurement device is being actuated.\",\n \"10.The method of claim 1, wherein measuring each of the first weight and the second weight comprises measuring using a weight measurement device comprising a contact surface and a contact sensor, wherein the weight measurement device has a structure that causes the contact surface to be brought into contact with the contact sensor when a first portion of the weight measurement device is lifted with respect to a second portion of the weight measurement device, which is coupled to the car seat.\",\n \"11.The method of claim 10, wherein the contact sensor comprises at least one of a flex sensor, a piezoelectric-based sensor, a compression-based sensor, or a spring-based sensor.\",\n \"12.The method of claim 1, further comprising: determining, with a location detection device of the device, a first location of the car seat when measuring the first weight of the car seat; storing, with the device, the first location in the local data storage device; determining that the car seat is being moved by determining, with the location detection device, that a present location of the device is different from the first location of the device; and based on the determination by the location detection device that the car seat is being moved, measuring, with the device, the second weight.\",\n \"13.The method of claim 12, further comprising: determining, responsive to the determination that the car seat is being moved, that the car seat is empty.\",\n \"14.The method of claim 12, further comprising: determining, responsive to the determination that the car seat is being moved, that the occupant is still in the car seat.\",\n \"15.The method of claim 12, further comprising determining that the car seat is being moved by determining, with the location detection device, that a present location of the device is different from the first location of the device.\",\n \"16.The method of claim 1, further comprising, receiving second user input, wherein measuring a second weight of the car seat comprises measuring a second weight of the car seat in response to the second user input.\",\n \"17.An apparatus, comprising: at least one processor; a weight measurement device; a user interface device; a computer readable storage medium in communication with the at least one processor, the computer readable storage medium having stored thereon computer software, the computer software comprising a set of instructions executable by the at least one processor to: receive, with the weight measurement device, a first user input from a user to lock-in a first weight supported by a car seat, wherein the first weight corresponds to an occupant in the car seat; measure, with the weight measurement device, the first weight of the occupant in the car seat, in response to receiving the first user input; store, with the weight measurement device and in a local data storage device, the measured first weight; measure, with the weight measurement device, a second weight of supported by the car seat; determine, with the weight measurement device, whether the second weight matches the stored first weight; based on a determination that the second weight does not match the first weight, notify, with the device, the user.\",\n \"18.The apparatus of claim 17, wherein the set of instructions are further executable to: determine that the car seat is being moved by determining, with the weight measuring device, that the load cell of the weight measurement device is being actuated.\",\n \"19.The apparatus of claim 17, further comprising a location detection device, wherein the set of instructions are further executable to: determine, with a location detection device of the device, a first location of the car seat when measuring the first weight of the car seat; store, with the device, the first location in the local data storage device; determine that the car seat is being moved by determining, with the location detection device, that a present location of the device is different from the first location of the device; and based on the determination by the location detection device that the car seat is being moved, determining whether the occupant is in the car seat.\",\n \"20.A system comprising: a car seat comprising a bottom portion and seat back; a car seat monitoring device coupled to car seat, the car seat monitoring device comprising: a processor; a computer readable storage medium in communication with the processor, the computer readable storage medium having stored thereon computer software, the computer software comprising a set of instructions executable by the processor to: receive, with the weight measurement device, a first user input from a user to lock-in a first weight supported by a car seat, wherein the first weight corresponds to an occupant in the car seat; measure, with the weight measurement device, the first weight of the occupant in the car seat, in response to receiving the first user input; store, with the weight measurement device and in a local data storage device, the measured first weight; measure, with the weight measurement device, a second weight of supported by the car seat; determine, with the weight measurement device, whether the second weight matches the stored first weight; based on a determination that the second weight does not match the first weight, notify, with the device, the user.\"\n ],\n [\n \" BACKGROUND Airports around the world have an epidemic.\",\n \"People are losing valuable items every time they go through the security checkpoint(s) at airports.\",\n \"This is because one of the requirements of airport security is that travelers must remove their laptops from their bags.\",\n \"Another requirement is that travelers remove phones and other metallic objects from their persons before passing through the scanners.\",\n \"As a consequence, there is a natural tendency for travelers to walk away without collecting their items (including, without limitation, laptops, smart phones, tablet computers, cellular phones, media players, and/or the like).\",\n \"Approximately 1.7 million people travel through U.S. airports each day.\",\n \"Items are lost everywhere in the airports, including, but not limited to, on planes, in terminal gates, in lounges, and/or the like.\",\n \"It is estimated that over 16,000 laptops are left at U.S. airports each year.\",\n \"The laptop loss alone is estimated to be around $700 million.\",\n \"Travelers' items left in airports also put a significant strain on the already over-worked security personnel such as Transportation Security Administration (“TSA”) personnel in the U.S.\",\n \"It requires that such personnel retain and manage custody of such lost items.\",\n \"Currently, such lost items are collected by TSA agents and held for 30 days.\",\n \"After the 30-day period expires, the hard drives and/or memory are removed and the items are put on auction.\",\n \"All the information in the computing devices is subsequently destroyed.\",\n \"This process requires man-hours for collecting the lost items, tracking how long the lost items have been held, removing data storage drives, destroying information stored in the devices, and auctioning the items.\",\n \"Third party non-governmental Lost and Found web sites have been established in an effort to help people recover their lost items.\",\n \"It is unclear, however, how successful these sites are.\",\n \"But, for such sites to be useful, the travelers would have to know about a particular site in order to be able to post that they have lost something at a particular airport.\",\n \"It would also require that the person who has possession of the lost item(s) know about the site so that they can contact the person that lost such item(s).\",\n \"In general, such web sites only serve to work on the recovery of lost items, but cannot help to prevent loss of the items in the first place.\",\n \"In terms of the use of weight measurement of luggage, existing travel scales provide weighing functionality, but such devices are incapable of alerting a traveler of a change in weight (such as when an item has not been put back in the luggage, or the like).\",\n \"Hence, there is a need for more robust and scalable solutions for preventing item and luggage loss.\"\n ],\n [\n \" BRIEF SUMMARY Various embodiments provide techniques for implementing item or luggage loss prevention, which, in some cases, is based on weight measurements.\",\n \"According to some embodiments, a device containing a processor might be configured to be placed under a bag's handle.\",\n \"The device might contain a small display (including, without limitation, a liquid crystal display (“LCD”), a light emitting diode (“LED”) display, an organic LED (“oLED”) display, and/or the like) and a processor.\",\n \"The device might allow the user to lock in a weight of a bag.\",\n \"If any item is then removed from (and not returned to) the bag, the device might notify the user (e.g., using audio notification (e.g., recorded voice notification, beeps, and/or the like), visual notification (e.g., blinking lights, flashing icons, written messages, and/or the like), and/or mobile device notification (e.g., e-mail notification, text message notification, small message service (“SMS”) notification, multi-media messaging service (“MMS”) notification, chat message notification, and/or the like) that the weight of the bag has changed (from the locked-in weight).\",\n \"In some embodiments, the device might comprise an LCD display for the weight and notification, an on or off button, and one or more button(s) to store/lock-in a weight (or to change the lock-in weight) and to release or delete any locked-in or stored weights.\",\n \"The tools provided by various embodiments include, without limitation, methods, systems, and/or software products.\",\n \"Merely by way of example, a method might comprise one or more procedures, any or all of which might be executed by a computer system.\",\n \"Correspondingly, an embodiment might provide a computer system configured with instructions to perform one or more procedures in accordance with methods provided by various other embodiments.\",\n \"Similarly, a computer program might comprise a set of instructions that are executable by a computer system, or by a processor located in the computer system, to perform such operations.\",\n \"In many cases, such software programs are encoded on physical, tangible, and/or non-transitory computer readable media.\",\n \"Such computer readable media might include, to name but a few examples, optical media, magnetic media, and the like.\",\n \"In an aspect, a method might comprise receiving, with a device, a first user input from a user to lock-in a first weight of a bag, measuring, with the device, the first weight of the bag, in response to receiving the first user input, and storing, with the device and in a local data storage device, the measured first weight of the bag, prior to the user removing one or more items from the bag.\",\n \"The method might further comprise measuring, with the device, a second weight of the bag, for example, in response to second user input, in response to determining that the bag is being moved, etc.\",\n \"The method, then, might include determining, with the device, whether the second weight of the bag matches the stored first weight of the bag.\",\n \"The method might also comprise, based on a determination that the second weight does not match the first weight, notifying, with the device, the user.\",\n \"According to some embodiments, measuring each of the first weight and the second weight might comprise measuring using a weight measurement device comprising a contact surface and a contact sensor.\",\n \"The weight measurement device might have a structure that causes the contact surface to be brought into contact with the contact sensor when a first portion of the weight measurement device is lifted with respect to a second portion of the weight measurement device, which is coupled to the bag.\",\n \"In some cases, the contact sensor might comprise at least one of a flex sensor, a piezoelectric-based sensor, a compression-based sensor, and/or a spring-based sensor.\",\n \"In some embodiments, the device might be attached to the bag.\",\n \"The bag, according to some embodiments, might comprise one or more of a purse, a handbag, a tote, a briefcase, a satchel, laptop bag, travel bag, or carry-on luggage.\",\n \"In some cases, the device might be attached to one or more handles of the bag.\",\n \"The device, in some instances, might be placed in an interior compartment of the bag.\",\n \"In some embodiments, the device might be placed at a bottom portion of the interior compartment of the bag (ideally, below the one or more items when the one or more items are placed in the bag).\",\n \"According to some embodiments, the device might be placed below one or more feet of the bag.\",\n \"In some cases, the device might be affixed to a position between the bag and each of one or more wheel casters of the bag.\",\n \"In alternative cases, the device might be positioned within one or more wheel casters of the bag.\",\n \"In some aspects, measuring each of the first weight and the second weight might comprise measuring using a weight measurement device comprising a load cell selected from a group consisting of a strain gauge load cell, a piezoelectric load cell, a capacitive load cell, a compression load cell, a compression/tension load cell, an S-beam load cell, a bending beam load cell, a platform load cell, a single point load cell, a canister load cell, and a low profile load cell.\",\n \"Determining that the bag is being moved might, in some embodiments, comprise determining, with the device, that the load cell of the weight measurement device is being actuated (which might indicate that the bag is being lifted).\",\n \"In some cases, determining that the second weight does not match the first weight might comprise determining that the second weight is less than the first weight.\",\n \"In some instances, determining that the second weight does not match the first weight might comprise determining that the second weight is greater than the first weight.\",\n \"In either case, notifying the user might comprise reminding the user to check that the one or more items that were removed from the bag have been returned to the bag.\",\n \"According to some embodiments, the method might further comprise determining, with a location detection device of the device, a first location of the device when measuring the first weight of the bag, and storing, with the device, the first location in the local data storage device.\",\n \"Notifying the user might comprise sending a message containing the first location.\",\n \"In some embodiments, the method might also comprise determining, with the location detection device of the device, a second location of the device when measuring the second weight of the bag, and storing, with the device, the second location in the local data storage device.\",\n \"Notifying the user might comprise sending a message containing each location where a weight of the bag was measured (this might allow the user to retrace where a lost item might be located, i.e., by retracing where the item might have been removed from the bag).\",\n \"In embodiments in which the device comprises a location detection device, determining that the bag is being moved might comprise determining, with the location detection device, that a present location of the device is different from the first location of the device.\",\n \"In some embodiments, the method might further comprise determining, with the device, which of one or more items is missing from the bag based on a difference between the first weight and the second weight.\",\n \"This might include pre-storing a plurality of weights of the bag, with and without each of the one or more items.\",\n \"Notifying the user might further comprise indicating which of the one or more items might be missing based on the determination.\",\n \"Merely by way of example, in some cases, notifying the user might comprise one or more of playing a recorded voice notification, emitting one or more audio tones, displaying one or more light sequences, displaying one or more icons, displaying a written message, sending an e-mail notification, sending a text message notification, sending a small message service (“SMS”) notification, sending a multi-media messaging service (“MMS”) notification, or sending a chat message notification.\",\n \"In another aspect, an apparatus might comprise at least one processor, a weight measurement device, a user interface device, and a computer readable storage medium in communication with the at least one processor.\",\n \"The computer readable storage medium might have stored thereon computer software.\",\n \"The computer software might comprise a set of instructions that, when executed by the at least one processor, causes the apparatus to perform one or more operations.\",\n \"The set of instructions might comprise instructions to receive a first user input from a user to lock-in a first weight of a bag, instructions to measure the first weight of the bag, in response to receiving the first user input, and instructions to store the measured first weight of the bag in the computer readable storage medium, prior to the user removing one or more items from the bag.\",\n \"The set of instructions might further comprise instructions to determine that the bag is being moved, instructions to measure a second weight of the bag, and instructions to determine whether the second weight of the bag matches the stored first weight of the bag.\",\n \"The set of instructions might also comprise instructions to, based on a determination that the second weight does not match the first weight, notify the user.\",\n \"According to some embodiments, the apparatus might further comprise a location detection device (including, without limitation, a global positioning system (“GPS”), position triangulation transceivers, and/or the like).\",\n \"In some cases, the apparatus might further comprise a network interface device (including, but not limited to, Bluetooth™ device, an 802.11 device, a WiFi device, a WiMax device, a WWAN device, cellular communication devices, and/or the like).\",\n \"The user interface device, in some embodiments, might comprise one or more of one or more display devices, one or more audio speakers, one or more touchscreen display devices, one or more buttons, one or more switches, or one or more light emitting devices.\",\n \"In yet another aspect, a method might comprise determining, with a device, that a weight of a bag has changed, and in response to such determination, notifying, with the device, that one or more items may be missing from the bag based on the determined change in weight.\",\n \"Various modifications and additions can be made to the embodiments discussed without departing from the scope of the invention.\",\n \"For example, while the embodiments described above refer to particular features, the scope of this invention also includes embodiments having different combination of features and embodiments that do not include all of the above described features.\"\n ],\n [\n \"CROSS-REFERENCE TO RELATED APPLICATIONS This application is a continuation of U.S. patent application Ser.\",\n \"No.\",\n \"14/605,590 (the “'590 application”), filed Jan. 26, 2015 by Faisal Shah et al.\",\n \"(attorney docket no.\",\n \"0837.02) and titled “Item and Luggage Loss Prevention System” which claims priority to U.S. Patent Application Ser.\",\n \"No.\",\n \"61/943,765 (the “'765 application”), filed Feb. 24, 2014 by Faisal Shah (attorney docket no.\",\n \"0562.01PR) and titled “Item and Luggage Loss Prevention System” and U.S. Patent Application Ser.\",\n \"No.\",\n \"62/046,690 (the “'690 application”), filed Sep. 5, 2014 by Faisal Shah et al.\",\n \"(attorney docket no.\",\n \"0562.02PR) and titled “Item and Luggage Loss Prevention System.” The respective disclosures of these applications/patents (which this document refers to collectively as the “Related Applications”) are incorporated herein by reference in their entirety for all purposes.\",\n \"COPYRIGHT STATEMENT A portion of the disclosure of this patent document contains material that is subject to copyright protection.\",\n \"The copyright owner has no objection to the facsimile reproduction by anyone of the patent document or the patent disclosure as it appears in the Patent and Trademark Office patent file or records, but otherwise reserves all copyright rights whatsoever.\",\n \"FIELD The present disclosure relates, in general, to a device, system, and method for preventing loss of items or luggage, and, more particularly, to a device, system, and method for preventing loss of items or luggage based on weight measurements.\",\n \"BACKGROUND Airports around the world have an epidemic.\",\n \"People are losing valuable items every time they go through the security checkpoint(s) at airports.\",\n \"This is because one of the requirements of airport security is that travelers must remove their laptops from their bags.\",\n \"Another requirement is that travelers remove phones and other metallic objects from their persons before passing through the scanners.\",\n \"As a consequence, there is a natural tendency for travelers to walk away without collecting their items (including, without limitation, laptops, smart phones, tablet computers, cellular phones, media players, and/or the like).\",\n \"Approximately 1.7 million people travel through U.S. airports each day.\",\n \"Items are lost everywhere in the airports, including, but not limited to, on planes, in terminal gates, in lounges, and/or the like.\",\n \"It is estimated that over 16,000 laptops are left at U.S. airports each year.\",\n \"The laptop loss alone is estimated to be around $700 million.\",\n \"Travelers' items left in airports also put a significant strain on the already over-worked security personnel such as Transportation Security Administration (“TSA”) personnel in the U.S.\",\n \"It requires that such personnel retain and manage custody of such lost items.\",\n \"Currently, such lost items are collected by TSA agents and held for 30 days.\",\n \"After the 30-day period expires, the hard drives and/or memory are removed and the items are put on auction.\",\n \"All the information in the computing devices is subsequently destroyed.\",\n \"This process requires man-hours for collecting the lost items, tracking how long the lost items have been held, removing data storage drives, destroying information stored in the devices, and auctioning the items.\",\n \"Third party non-governmental Lost and Found web sites have been established in an effort to help people recover their lost items.\",\n \"It is unclear, however, how successful these sites are.\",\n \"But, for such sites to be useful, the travelers would have to know about a particular site in order to be able to post that they have lost something at a particular airport.\",\n \"It would also require that the person who has possession of the lost item(s) know about the site so that they can contact the person that lost such item(s).\",\n \"In general, such web sites only serve to work on the recovery of lost items, but cannot help to prevent loss of the items in the first place.\",\n \"In terms of the use of weight measurement of luggage, existing travel scales provide weighing functionality, but such devices are incapable of alerting a traveler of a change in weight (such as when an item has not been put back in the luggage, or the like).\",\n \"Hence, there is a need for more robust and scalable solutions for preventing item and luggage loss.\",\n \"BRIEF SUMMARY Various embodiments provide techniques for implementing item or luggage loss prevention, which, in some cases, is based on weight measurements.\",\n \"According to some embodiments, a device containing a processor might be configured to be placed under a bag's handle.\",\n \"The device might contain a small display (including, without limitation, a liquid crystal display (“LCD”), a light emitting diode (“LED”) display, an organic LED (“oLED”) display, and/or the like) and a processor.\",\n \"The device might allow the user to lock in a weight of a bag.\",\n \"If any item is then removed from (and not returned to) the bag, the device might notify the user (e.g., using audio notification (e.g., recorded voice notification, beeps, and/or the like), visual notification (e.g., blinking lights, flashing icons, written messages, and/or the like), and/or mobile device notification (e.g., e-mail notification, text message notification, small message service (“SMS”) notification, multi-media messaging service (“MMS”) notification, chat message notification, and/or the like) that the weight of the bag has changed (from the locked-in weight).\",\n \"In some embodiments, the device might comprise an LCD display for the weight and notification, an on or off button, and one or more button(s) to store/lock-in a weight (or to change the lock-in weight) and to release or delete any locked-in or stored weights.\",\n \"The tools provided by various embodiments include, without limitation, methods, systems, and/or software products.\",\n \"Merely by way of example, a method might comprise one or more procedures, any or all of which might be executed by a computer system.\",\n \"Correspondingly, an embodiment might provide a computer system configured with instructions to perform one or more procedures in accordance with methods provided by various other embodiments.\",\n \"Similarly, a computer program might comprise a set of instructions that are executable by a computer system, or by a processor located in the computer system, to perform such operations.\",\n \"In many cases, such software programs are encoded on physical, tangible, and/or non-transitory computer readable media.\",\n \"Such computer readable media might include, to name but a few examples, optical media, magnetic media, and the like.\",\n \"In an aspect, a method might comprise receiving, with a device, a first user input from a user to lock-in a first weight of a bag, measuring, with the device, the first weight of the bag, in response to receiving the first user input, and storing, with the device and in a local data storage device, the measured first weight of the bag, prior to the user removing one or more items from the bag.\",\n \"The method might further comprise measuring, with the device, a second weight of the bag, for example, in response to second user input, in response to determining that the bag is being moved, etc.\",\n \"The method, then, might include determining, with the device, whether the second weight of the bag matches the stored first weight of the bag.\",\n \"The method might also comprise, based on a determination that the second weight does not match the first weight, notifying, with the device, the user.\",\n \"According to some embodiments, measuring each of the first weight and the second weight might comprise measuring using a weight measurement device comprising a contact surface and a contact sensor.\",\n \"The weight measurement device might have a structure that causes the contact surface to be brought into contact with the contact sensor when a first portion of the weight measurement device is lifted with respect to a second portion of the weight measurement device, which is coupled to the bag.\",\n \"In some cases, the contact sensor might comprise at least one of a flex sensor, a piezoelectric-based sensor, a compression-based sensor, and/or a spring-based sensor.\",\n \"In some embodiments, the device might be attached to the bag.\",\n \"The bag, according to some embodiments, might comprise one or more of a purse, a handbag, a tote, a briefcase, a satchel, laptop bag, travel bag, or carry-on luggage.\",\n \"In some cases, the device might be attached to one or more handles of the bag.\",\n \"The device, in some instances, might be placed in an interior compartment of the bag.\",\n \"In some embodiments, the device might be placed at a bottom portion of the interior compartment of the bag (ideally, below the one or more items when the one or more items are placed in the bag).\",\n \"According to some embodiments, the device might be placed below one or more feet of the bag.\",\n \"In some cases, the device might be affixed to a position between the bag and each of one or more wheel casters of the bag.\",\n \"In alternative cases, the device might be positioned within one or more wheel casters of the bag.\",\n \"In some aspects, measuring each of the first weight and the second weight might comprise measuring using a weight measurement device comprising a load cell selected from a group consisting of a strain gauge load cell, a piezoelectric load cell, a capacitive load cell, a compression load cell, a compression/tension load cell, an S-beam load cell, a bending beam load cell, a platform load cell, a single point load cell, a canister load cell, and a low profile load cell.\",\n \"Determining that the bag is being moved might, in some embodiments, comprise determining, with the device, that the load cell of the weight measurement device is being actuated (which might indicate that the bag is being lifted).\",\n \"In some cases, determining that the second weight does not match the first weight might comprise determining that the second weight is less than the first weight.\",\n \"In some instances, determining that the second weight does not match the first weight might comprise determining that the second weight is greater than the first weight.\",\n \"In either case, notifying the user might comprise reminding the user to check that the one or more items that were removed from the bag have been returned to the bag.\",\n \"According to some embodiments, the method might further comprise determining, with a location detection device of the device, a first location of the device when measuring the first weight of the bag, and storing, with the device, the first location in the local data storage device.\",\n \"Notifying the user might comprise sending a message containing the first location.\",\n \"In some embodiments, the method might also comprise determining, with the location detection device of the device, a second location of the device when measuring the second weight of the bag, and storing, with the device, the second location in the local data storage device.\",\n \"Notifying the user might comprise sending a message containing each location where a weight of the bag was measured (this might allow the user to retrace where a lost item might be located, i.e., by retracing where the item might have been removed from the bag).\",\n \"In embodiments in which the device comprises a location detection device, determining that the bag is being moved might comprise determining, with the location detection device, that a present location of the device is different from the first location of the device.\",\n \"In some embodiments, the method might further comprise determining, with the device, which of one or more items is missing from the bag based on a difference between the first weight and the second weight.\",\n \"This might include pre-storing a plurality of weights of the bag, with and without each of the one or more items.\",\n \"Notifying the user might further comprise indicating which of the one or more items might be missing based on the determination.\",\n \"Merely by way of example, in some cases, notifying the user might comprise one or more of playing a recorded voice notification, emitting one or more audio tones, displaying one or more light sequences, displaying one or more icons, displaying a written message, sending an e-mail notification, sending a text message notification, sending a small message service (“SMS”) notification, sending a multi-media messaging service (“MMS”) notification, or sending a chat message notification.\",\n \"In another aspect, an apparatus might comprise at least one processor, a weight measurement device, a user interface device, and a computer readable storage medium in communication with the at least one processor.\",\n \"The computer readable storage medium might have stored thereon computer software.\",\n \"The computer software might comprise a set of instructions that, when executed by the at least one processor, causes the apparatus to perform one or more operations.\",\n \"The set of instructions might comprise instructions to receive a first user input from a user to lock-in a first weight of a bag, instructions to measure the first weight of the bag, in response to receiving the first user input, and instructions to store the measured first weight of the bag in the computer readable storage medium, prior to the user removing one or more items from the bag.\",\n \"The set of instructions might further comprise instructions to determine that the bag is being moved, instructions to measure a second weight of the bag, and instructions to determine whether the second weight of the bag matches the stored first weight of the bag.\",\n \"The set of instructions might also comprise instructions to, based on a determination that the second weight does not match the first weight, notify the user.\",\n \"According to some embodiments, the apparatus might further comprise a location detection device (including, without limitation, a global positioning system (“GPS”), position triangulation transceivers, and/or the like).\",\n \"In some cases, the apparatus might further comprise a network interface device (including, but not limited to, Bluetooth™ device, an 802.11 device, a WiFi device, a WiMax device, a WWAN device, cellular communication devices, and/or the like).\",\n \"The user interface device, in some embodiments, might comprise one or more of one or more display devices, one or more audio speakers, one or more touchscreen display devices, one or more buttons, one or more switches, or one or more light emitting devices.\",\n \"In yet another aspect, a method might comprise determining, with a device, that a weight of a bag has changed, and in response to such determination, notifying, with the device, that one or more items may be missing from the bag based on the determined change in weight.\",\n \"Various modifications and additions can be made to the embodiments discussed without departing from the scope of the invention.\",\n \"For example, while the embodiments described above refer to particular features, the scope of this invention also includes embodiments having different combination of features and embodiments that do not include all of the above described features.\",\n \"BRIEF DESCRIPTION OF THE DRAWINGS A further understanding of the nature and advantages of particular embodiments may be realized by reference to the remaining portions of the specification and the drawings, in which like reference numerals are used to refer to similar components.\",\n \"In some instances, a sub-label is associated with a reference numeral to denote one of multiple similar components.\",\n \"When reference is made to a reference numeral without specification to an existing sub-label, it is intended to refer to all such multiple similar components.\",\n \"FIG.\",\n \"1 is a general schematic diagram illustrating a system for implementing item or luggage loss prevention, in accordance with various embodiments.\",\n \"FIGS.\",\n \"2A and 2B are general block diagrams illustrating various apparatuses for implementing item or luggage loss prevention, in accordance with various embodiments.\",\n \"FIGS.\",\n \"3A-3F are general schematic diagrams illustrating various placement and configurations for an apparatus for implementing item or luggage loss prevention, in accordance with various embodiments.\",\n \"FIGS.\",\n \"4A-4F are general schematic diagrams illustrating various views and configurations of an apparatus for implementing item or luggage loss prevention, in accordance with various embodiments.\",\n \"FIG.\",\n \"5 is a general schematic flow diagram illustrating a method for implementing item or luggage loss prevention, in accordance with various embodiments.\",\n \"FIG.\",\n \"6 is a block diagram illustrating an exemplary computer architecture, in accordance with various embodiments.\",\n \"FIG.\",\n \"7 is a block diagram illustrating a networked system of computers, which can be used in accordance with various embodiments.\",\n \"DETAILED DESCRIPTION OF CERTAIN EMBODIMENTS While various aspects and features of certain embodiments have been summarized above, the following detailed description illustrates a few exemplary embodiments in further detail to enable one of skill in the art to practice such embodiments.\",\n \"The described examples are provided for illustrative purposes and are not intended to limit the scope of the invention.\",\n \"In the following description, for the purposes of explanation, numerous specific details are set forth in order to provide a thorough understanding of the described embodiments.\",\n \"It will be apparent to one skilled in the art, however, that other embodiments of the present invention may be practiced without some of these specific details.\",\n \"In other instances, certain structures and devices are shown in block diagram form.\",\n \"Several embodiments are described herein, and while various features are ascribed to different embodiments, it should be appreciated that the features described with respect to one embodiment may be incorporated with other embodiments as well.\",\n \"By the same token, however, no single feature or features of any described embodiment should be considered essential to every embodiment of the invention, as other embodiments of the invention may omit such features.\",\n \"Unless otherwise indicated, all numbers used herein to express quantities, dimensions, and so forth used should be understood as being modified in all instances by the term “about.” In this application, the use of the singular includes the plural unless specifically stated otherwise, and use of the terms “and” and “or” means “and/or” unless otherwise indicated.\",\n \"Moreover, the use of the term “including,” as well as other forms, such as “includes” and “included,” should be considered non-exclusive.\",\n \"Also, terms such as “element” or “component” encompass both elements and components comprising one unit and elements and components that comprise more than one unit, unless specifically stated otherwise.\",\n \"Various embodiments provide techniques for implementing item or luggage loss prevention, which, in some cases, is based on weight measurements.\",\n \"According to some embodiments, a device containing a processor might be configured to be placed under a bag's handle.\",\n \"The device might contain a small display (including, without limitation, a liquid crystal display (“LCD”), a light emitting diode (“LED”) display, an organic LED (“oLED”) display, and/or the like) and a processor.\",\n \"The device might allow the user to lock in a weight of a bag.\",\n \"If any item is then removed from (and not returned to) the bag, the device might notify the user (e.g., using audio notification (e.g., recorded voice notification, audio tones, beeps, and/or the like), visual notification (e.g., blinking lights, flashing icons, written messages, and/or the like), and/or mobile device notification (e.g., e-mail notification, text message notification, small message service (“SMS”) notification, multi-media messaging service (“MMS”) notification, chat message notification, and/or the like) that the weight of the bag has changed (from the locked-in weight).\",\n \"In some embodiments, the device might comprise an LCD display for the weight and notification, an on or off button, and one or more button(s) to store/lock-in a weight (or to change the lock-in weight) and to release or delete any locked-in or stored weights.\",\n \"In operation, prior to purposefully removing an item(s) (including, without limitation, a laptop computer, a smart phone, a mobile phone, a portable gaming device, a portable media player, a tablet computer, an e-book reader, and/or the like) from a bag (including, but not limited to, a purse, a handbag, a tote, a briefcase, a satchel, laptop bag, travel bag, carry-on luggage, and/or the like), the user can lock-in a weight of the bag using the device described above.\",\n \"This is applicable, for example, during security check-in at an airport terminal, during a meal in a restaurant, during a meeting, during a typical workday at the office, during school hours, and/or the like.\",\n \"If the user starts to walk away without the item(s) being returned to the bag, the device will issue a notification, which may take one or more forms, including, without limitation, audio notifications (e.g., recorded voice notification, beeps, and/or the like), visual notifications (e.g., blinking lights, flashing icons, written messages, and/or the like), and/or mobile device notifications (e.g., e-mail notification, text message notification, SMS notification, MMS notification, chat message notification, and/or the like).\",\n \"We now turn to the embodiments as illustrated by the drawings.\",\n \"FIGS.\",\n \"1-7 illustrate some of the features of the method, system, and apparatus for implementing item or luggage loss prevention, as referred to above.\",\n \"The methods, systems, and apparatuses illustrated by FIGS.\",\n \"1-7 refer to examples of different embodiments that include various components and steps, which can be considered alternatives or which can be used in conjunction with one another in the various embodiments.\",\n \"The description of the illustrated methods, systems, and apparatuses shown in FIGS.\",\n \"1-7 is provided for purposes of illustration and should not be considered to limit the scope of the different embodiments.\",\n \"With reference to the figures, FIG.\",\n \"1 is a general schematic diagram illustrating a system 100 for implementing item or luggage loss prevention, in accordance with various embodiments.\",\n \"In FIG.\",\n \"1, system 100 might comprise one or more user devices 105, a bag 110, and device 115.The one or more user devices 105 might comprise one or more tablet computers 105a, one or more smart phones 105b, one or more mobile phones 105c, or one or more portable gaming devices 105d, one or more e-book readers 105e, one or more media players 105f (such as an MP3 audio player, or the like), and/or the like.\",\n \"The bag 110 might include one of a purse, a handbag, a tote, a briefcase, a satchel, laptop bag, travel bag, carry-on luggage, and/or the like.\",\n \"Device 115 is an item or luggage loss prevention device as described in greater detail below with respect to FIGS.\",\n \"2 and 3.System 100 might further comprise server 120 communicatively coupled to the device 115 via network 125 (which might be an access network), and in some cases via one or more telecommunications relay systems 130.The one or more telecommunications relay systems 130 might include, without limitation, one or more wireless network interfaces (e.g., wireless modems, wireless access points, and the like), one or more towers, one or more satellites, and the like.\",\n \"System 100 might further comprise database 135 in communication with server 120.In some embodiments, system 100 might further comprise a plurality of user devices 140, which might include, without limitation, one or more tablet computers 140a, one or more smart phones 140b, one or more mobile phones 140c, or one or more portable gaming devices 140d, one or more e-book readers 140e, one or more media players 140f (such as an MP3 audio player, or the like), one or more desktop computers 140g, one or more laptop computers 140h, and/or the like.\",\n \"In some cases, the one or more tablet computers 140a, one or more smart phones 140b, one or more mobile phones 140c, or one or more portable gaming devices 140d, one or more e-book readers 140e, one or more media players 140f might be the same as the one or more tablet computers 105a, one or more smart phones 105b, one or more mobile phones 105c, or one or more portable gaming devices 105d, one or more e-book readers 105e, one or more media players 105f.\",\n \"In operation, device 115 might allow a user to lock-in a first weight of bag 110 containing the one or more user devices 105.When the user removes at least one of the one or more user devices 105 (e.g., during airport security check-in, during the work day, during a meal, during school, and/or the like), the first weight will have been stored in memory (either on the device 115 locally, or in database 135 via server 120 and network 125).\",\n \"When the user moves the bag, the device 115 might determine that the bag is being moved.\",\n \"In some instances, this might be accomplished by sensing, using a weight measurement device of device 115, that the bag is being lifted.\",\n \"Alternatively, or additionally, the device 115 might comprise a location detection device (e.g., a GPS device, a location triangulation transceiver, and/or the like), which might be used to determine a change in location of the device 115 and/or the bag 110.Once it is determined that the bag 110 is being moved, the device 115 might measure a second weight of the bag 110, and might determine whether the second weight is different from the first weight.\",\n \"If so, the device 115 might notify the user that the weight of bag 110 has changed.\",\n \"Notification, in some cases, might take the form of audio notification, visual notification, and/or wireless notification.\",\n \"Audio notification might include, without limitation, recorded voice notification, audio tones, beeps, and/or the like).\",\n \"Visual notification might include, but is not limited to, blinking lights, flashing icons, written messages, and/or the like.\",\n \"Wireless notification might include, without limitation, e-mail notification, text message notification, small message service (“SMS”) notification, multi-media messaging service (“MMS”) notification, chat message notification, and/or the like.\",\n \"In the case of wireless notification, a network interface device of the device 115 might communicate with server 120 via network 125 (and, in some instances, via the one or more telecommunications relay systems 130).\",\n \"The server 120 might send the e-mail, text, SMS, MMS, and/or chat notifications via network 125 (and, in some instances, via the one or more telecommunications relay systems 130) to the one or more user devices 140.Alternatively, device 115 might directly send the e-mail, text, SMS, MMS, and/or chat notifications via network 125 (and, in some instances, via the one or more telecommunications relay systems 130) to the one or more user devices 140.In some embodiments, the one or more user devices 140 might be associated with the user (or owner of bag 110), while in other cases, the one or more user devices 140 might be associated with a family member or friend (e.g., a travelling companion) of the user (or owner of bag 110).\",\n \"Such preferences for sending the notification can be set up by the user on the device 115 itself and/or at the server 120 (e.g., via a user interface (such as a web user interface, or an App interface, or the like)).\",\n \"In some cases, a spouse (or boyfriend or girlfriend), or a parent, of the owner of the bag 110 might set up the device 115 to notify him- or herself (and/or to notify the owner of the bag 110).\",\n \"We now turn to FIGS.\",\n \"2 and 3, which are directed to apparatuses 200 and/or configurations for implementing item or luggage loss prevention, in accordance with various embodiments.\",\n \"In particular, FIGS.\",\n \"2A and 2B (collectively, “FIG.\",\n \"2”) are general block diagrams illustrating various apparatuses 200 for implementing item or luggage loss prevention, in accordance with various embodiments.\",\n \"FIGS.\",\n \"3A-3F (collectively, “FIG.\",\n \"3”) are general schematic diagrams illustrating various placement and configurations for an apparatus for implementing item or luggage loss prevention, in accordance with various embodiments.\",\n \"In FIG.\",\n \"2A, apparatus 205, which corresponds to device 115 in FIG.\",\n \"1 (as described in detail above), might comprise processor 210, memory 215, user interface device 220, weight measurement device 225, audio device 230, and/or display device 235.Memory 215 might store the notification preferences as well as one or more weights (or lock-in weights).\",\n \"User interface device 220 might comprise one or more touchscreen display devices, one or more buttons, one or more switches, or one or more light emitting devices.\",\n \"Weight measurement device 225 might comprise a load cell selected from a group consisting of a strain gauge load cell, a piezoelectric load cell, a capacitive load cell, a compression load cell, a compression/tension load cell, an S-beam load cell, a bending beam load cell, a platform load cell, a single point load cell, a canister load cell, and/or a low profile load cell.\",\n \"Audio device 230 might comprise, without limitation, one or more speakers, one or more tone generation devices, and/or the like.\",\n \"Display device 235 might comprise one or more light emitting devices, one or more touchscreen devices, one or more liquid crystal displays (“LCDs”), one or more light emitting diode (“LED”) displays, one or more organic LED (“oLED”) displays, and/or the like.\",\n \"In FIG.\",\n \"2B, another embodiment of apparatus 205 might further comprise one or more location detection devices 240 (which might include, without limitation, a GPS device, a location triangulation transceiver, and/or the like), one or more network interface devices 245 (which might include, but is not limited to, Bluetooth™ device, an 802.11 device, a WiFi device, a WiMax device, a WWAN device, cellular communication devices, and/or the like).\",\n \"Apparatuses 200 might function in a manner similar to device 115 described in detail above with respect to FIG.\",\n \"1.In FIG.\",\n \"3, various different configurations and placement of a device 325 corresponding to device 115 or apparatus 200 are shown.\",\n \"As shown in FIG.\",\n \"3, bag 205 might comprise one or more handles 310, one or more feet 315, and/or one or more wheel casters 320.Although FIG.\",\n \"3 shows a particular type of bag, the various embodiments are not so limited, and the bag 305 can be any suitable bag including, without limitation, a purse, a handbag, a tote, a briefcase, a satchel, laptop bag, travel bag, carry-on luggage, and/or the like.\",\n \"In the embodiment of FIG.\",\n \"3A, device 325 might be affixed to at least an underside of the one or more handles 310.In particular, the weight measurement device 225 (shown in FIG.\",\n \"2) might be placed under the one or more handles 310.In some embodiments, some portion of the device 325 (e.g., one or more of processor 210, memory 215, user interface device 220, audio device 230, display device 235, location detection device 240, and/or network interface device 245) might be positioned above the handles 310.In such a manner, these components may be protected against damage from constant lifting.\",\n \"Also, having the display device and the audio device on the upper side of the handles 310 might allow the user to better see and hear notifications through these components.\",\n \"In the embodiment of FIG.\",\n \"3B, device 325 might be placed at a bottom portion of an interior of the bag 305, ideally below where the one or more user devices (e.g., user devices 105 of FIG.\",\n \"1) might be placed.\",\n \"In the embodiment of FIG.\",\n \"3C, device 325 might be affixed or attached to the bag 305 between the bag 305 and the one or more handles 310.In the embodiment of FIG.\",\n \"3D, device 325 might be affixed to the bottom of the one or more feet 315, while in the embodiment of FIG.\",\n \"3E, the devices 325 might be affixed or attached to the bag 305 between the bag 305 and the one or more wheel casters 320.Alternatively, as shown in the embodiment of FIG.\",\n \"3F, device 325 might be part of each of the wheel casters 320, where each device 325 might be positioned between the base 320a and the body 320b of each wheel casters 320, above the wheels 320c.\",\n \"In the case of embodiments shown in FIGS.\",\n \"3A and 3C, weight measurements must be taken while the corresponding bags 305 are being lifted.\",\n \"In the embodiment of FIG.\",\n \"3B, weight measurements may be taken when the bag 305 is being lifted and when it is resting on a surface (e.g., ground, seat, table, etc.).\",\n \"For the embodiments shown in FIGS.\",\n \"3D-3F, weight measurements may be taken when the bags are resting on a surface (e.g., ground, seat, table, etc.).\",\n \"With reference to FIGS.\",\n \"4A-4F (collectively, “FIG.\",\n \"4”), which are general schematic diagrams illustrating various views and configurations of an apparatus 400 for implementing item or luggage loss prevention, in accordance with various embodiments.\",\n \"FIGS.\",\n \"4A-4C show side views of apparatus 400, in which FIGS.\",\n \"4A and 4C show partial cut-out views of portions of the apparatus 400.FIG.\",\n \"4D shows a partial sectional view of portions of the apparatus 400 as seen along the direction of the A-A arrows in FIG.\",\n \"4B, while FIG.\",\n \"4E shows a partial sectional view of portions of the apparatus 400 as seen along the direction of the B-B arrows in FIG.\",\n \"4B; in FIG.\",\n \"4E, partial sectional view of contact surface 440 is shown as a small circle for ease of illustration particularly as compared with surrounding components and elements of the apparatus 400 (and not intended as an accurate sectional or partial section view of contact surface 440).\",\n \"FIG.\",\n \"4F shows a different embodiment of apparatus 400.In FIG.\",\n \"4, dash-lines or dotted-lines might denote cut-out or partial cut-out portions.\",\n \"In FIG.\",\n \"4, apparatus 400 might comprise a main body portion 405 and a piston portion 410.The main body portion 405 might comprise a shell portion 415 and first attachment portion 420.The shell portion 415 might comprise a first cap portion 415a and a second cap portion 415b.\",\n \"The first attachment portion 420 might attach to the first cap portion.\",\n \"The second cap portion is shown in greater detail in FIGS.\",\n \"4D and 4E (and is described further below).\",\n \"According to some embodiments, the first attachment portion 420 might comprise one of a strap, a handle, and/or a resilient loop, each of which might be made of any suitable material including, but not limited to, metal, rubber, cloth, plastic, silicone, wood, or the like, and/or any combination of these materials.\",\n \"The piston portion 410 might comprise a first attachment brace 425a, a second attachment brace 425b, a second attachment portion 430, and at least one rod 435.The first attachment brace 425a might include contact surface 440, which might comprise any suitable contact point including, but not limited to, a hemispheric contact point, a cubic contact point, a rectangular box contact point, a ball contact point, and/or the like.\",\n \"In some embodiments, the second attachment portion 430 might comprise one of a strap, a handle, and/or a resilient loop, each of which might be made of any suitable material including, but not limited to, metal, rubber, cloth, plastic, silicone, wood, or the like, and/or any combination of these materials.\",\n \"The apparatus 400 might further comprise a contact sensor 445, which may be either integrally formed with the second cap portion 415b or separately formed with respect to the second cap portion 415b (but later affixed to the second cap portion 415b, before assembly of the piston portion 410 within the main body portion 405).\",\n \"The apparatus 400 might further comprise a sensor cable 450 and an interface device 455.The sensor cable 450 might, in some cases, communicatively couple the contact sensor 445 with the interface device 455.The processing or calculation of the weight based on the applied force (and changes in units of measurement, taring (i.e., the process of accounting for weight of the luggage and/or other components from the gross weight to measure weight of specific item(s) in the luggage), and/or the like) may be performed by a processor that is either located in the contact sensor 445 and/or the interface device 455.According to some embodiments, the contact sensor 445 might include, without limitation, at least one of a flex sensor, a piezoelectric-based sensor, a compression-based sensor, a spring-based sensor, and/or the like.\",\n \"The contact surface 440 may be made of any suitable material, including, without limitation, metal, rubber, cloth, plastic, silicone, wood, or the like, and/or any combination of these materials, so long as the material does not deform so much that accurate measurement of force of contact between the contact surface 440 and the contact sensor 445 cannot be made.\",\n \"In some cases, the contact surface 440 might be integrally formed with the first attachment brace 425a (and might be of the same material or different material from the material of the first attachment brace 425a).\",\n \"In some instances, the contact surface 440 might be separately formed from the first attachment brace 425a (and might be of the same material or different material from the material of the first attachment brace 425a), and might be assembled with the first attachment brace 425a prior to assembly in the main body portion 405.In operation, one of the main body portion 405 or the piston portion 410 might be (removably or permanently) attached or affixed to a piece of luggage (e.g., bag 305 as shown in FIG.\",\n \"3, or any other suitable type of baggage, or the like), while the other of the main body portion 405 or the piston portion 410 might be carried (i.e., manipulated) by a user.\",\n \"When no force is applied (or when not fully lifted), the contact surface 440 and the contact sensor 445 might be spaced apart (as shown in FIG.\",\n \"4A).\",\n \"When the user-manipulated portion (i.e., one of the main body portion 405 or the piston portion 410) is lifted, however, the first attachment brace 425a (and the contact surface 440 that is attached thereto or is otherwise part thereof) might move toward the second cap portion 415b (and the contact sensor 445 that is attached thereto or is otherwise part thereof), until the contact surface 440 makes contact with the contact sensor 445 (as shown in FIG.\",\n \"4C).\",\n \"When the relative positions of the main body portion 405 and the piston portion 410 have stabilized (i.e., as weight of the luggage and contents therein are applied), the contact surface 440 applies a proportional amount of force to the contact sensor 445, which is measured and eventually registered as weight (in a manner similar to that described with respect to FIGS.\",\n \"1-3 and 5).\",\n \"The weight may, in some cases, be displayed on a display screen or display device of the interface device 455.In some embodiments, the weight might be sent wirelessly as a data packet (from the interface device 455 and/or from the contact sensor 445) to a user device (e.g., smart phone, laptop, television, and/or the like) to be displayed on a display screen of the user device.\",\n \"In some embodiments, the interface device 455 might comprise one or more of a display screen to display computed/measured weight, a voice output device (e.g., a speaker or the like) to provide vocal (or simulated vocal) outputs of the computed/measured weight, buttons to allow the user to select options (e.g., to turn on/off the display, to turn on/off the vocal output device, to select unit of weight, to select options for storing weights, to send computed/measured weights or other stored values or data to another user device (including, but not limited to, a smart phone, a mobile phone, a tablet computer, a laptop computer, a desktop computer, a television, and/or the like), to a server, and/or the like)).\",\n \"In some cases, such as in embodiments where the one of the main body portion 405 or the piston portion 410 is (removably or permanently) attached or affixed to the piece of luggage, the interface device 455 might comprise attachment mechanisms that allow the interface device 455 to also be (removably or permanently) attached or affixed to the piece of luggage (ideally in a manner so as to be easily viewed and/or manipulated by the user).\",\n \"In some instances, the interface device 455 might be (removably or permanently) attached or affixed to some portion of the apparatus 400, including, without limitation, the first attachment portion 420, the second attachment portion 430, the first cap portion 415a, the second cap portion 415b, an exterior part of the shell portion 415, and/or the like.\",\n \"In a non-limiting example, FIG.\",\n \"4F shows the interface device 455 (removably or permanently) attached or affixed to an exterior portion of the first cap portion 415a (along the side of the shell portion 415).\",\n \"According to some embodiments, where the interface device 455 is permanently attached or affixed to an exterior portion of the apparatus 400 (including, without limitation, the first attachment portion 420, the second attachment portion 430, the first cap portion 415a, the second cap portion 415b, an exterior part of the shell portion 415, and/or the like), the sensor cable 450 might be routed within the shell portion 415.In some embodiments, where the interface device 455 is (removably or permanently) attached or affixed to a portion of the piece of luggage, or removably attached or affixed to an exterior portion of the apparatus 400 (including, without limitation, the first attachment portion 420, the second attachment portion 430, the first cap portion 415a, the second cap portion 415b, an exterior part of the shell portion 415, and/or the like), the sensor cable 450 might be routed through slot 460 (as shown in FIG.\",\n \"4B).\",\n \"In some cases, the at least one rod 435 might include one of two rods (as shown in FIG.\",\n \"4), three rods (not shown), four rods (not shown), or any suitable number of rods.\",\n \"In some instances, the first attachment brace 425a and each of the at least one rod 435 might form a U-shaped brace (not shown), the “legs” of which might fit through the openings 465 in the second attachment brace 425b, while the “top” of the U-shaped brace might include contact surface 440.In some embodiments, the U-shaped brace might include, without limitation, one of a curved U-shaped brace, a flat U-shaped brace, or a curved W-shaped brace, and/or the like.\",\n \"The curved U-shaped brace might comprise a “top” of the U-shaped brace that is curved outward toward first cap portion 415a when the U-shaped brace is installed in the main body portion 405.The flat U-shaped brace might include a “top” of the U-shaped brace that is substantially perpendicular with the “legs” of the U-shaped brace.\",\n \"The curved W-shaped brace might have a “top” of the U-shaped brace that first curves outward toward the first cap portion 415a (when the U-shaped brace is installed in the main body portion 405) from each of the “legs,” then curved inward away from the first cap portion 415a and toward the second cap portion 415b to meet in the middle (the overall shape of which evokes or resembles the letter W that has curvy connections).\",\n \"In some instances, the U-shaped brace might have a flat profile (i.e., instead of “rods” for legs, the “legs” might be flat rectangular pieces).\",\n \"In other cases, the U-shaped brace might have circular or oval cross-sections throughout (i.e., the “legs” and/or the “top” might be cylindrical or a bent cylinder, or the like).\",\n \"FIGS.\",\n \"4D and 4E show partial sectional views of apparatus 400 (along the A-A and B-B directions in FIG.\",\n \"4B) that show how the piston portion 410 is connected or assembled with the main body portion 405.In particular, openings 465 (two in the case of the embodiment of FIG.\",\n \"4D) are shown in the second cap portion 415b.\",\n \"The openings 465 (shown as being circular in FIGS.\",\n \"4D and 4E) may be of whatever shape that matches with the shape of the at least one rod 435, so as to allow each of the at least one rod 435 to pass through each corresponding opening 465.The contact sensor 445, although shown as having circular cross section, can have a cross section having any suitable shape, including, but not limited to, circle, square, triangle, rectangle, any polygon, or any irregular shape, and/or the like.\",\n \"Likewise, the contact surface 440, although shown as having circular cross section, can have a cross section having any suitable shape, including, but not limited to, circle, square, triangle, rectangle, any polygon, or any irregular shape, and/or the like.\",\n \"In general, however, the shapes of the contact sensor 445 and the contact surface 440 are chosen to complement each other (although not necessarily having the same shape) to ensure proper mutual contact to afford accurate force/weight measurements.\",\n \"In some instances, one of the first attachment portion 420 or the second attachment portion 430 might include, without limitation, a handle, strap, or bar that is configured to be held with a user's hand(s), while the other of the first attachment portion 420 or the second attachment portion 430 might include, but is not limited to, a handle, strap, or bar that is configured to be (removably or permanently) attached or affixed to a piece of luggage.\",\n \"In some embodiments, the other of the first attachment portion 420 or the second attachment portion 430 (i.e., the luggage-side attachment portion) might include, without limitation, a releasable engagement device 470, which might include (but is not limited) to one of a clasp, a buckle, a carabiner, a clip, or any other suitable fastener, or the like.\",\n \"The releasable engagement device 470 might be made of any suitable material including, without limitation, metal, plastic, and/or the like.\",\n \"In operation, the clasp-type or buckle-type engagement devices 470 might be separable into two portions, a first portion attached or affixed to a first part of the luggage-side attachment portion and a second portion attached or affixed to a second part of the luggage-side attachment portion.\",\n \"In some cases, as shown in the non-limiting example of FIG.\",\n \"4F, the first part 430′ of the luggage-side portion might be longer than the second part 430″ of the luggage-side portion, with the engagement device 470 removably coupling the first part 430′ to the second part 430″.\",\n \"The longer first part 430′ allows the luggage-side portion to loop about a handle or other loop-type structure on the piece of luggage, and to allow the weight of the handle or other loop-type structure on the piece of luggage to be held against the first part 430′ without the weight of the luggage pressing against (and potentially damaging) the engagement device 470.In some cases, the apparatus 400 (including each of the main body portion 405 and the piston portion 410) might be cylindrical in shape.\",\n \"In other cases, the apparatus 400 (including each of the main body portion 405 and the piston portion 410) might be rectangular in shape.\",\n \"While in still other cases, the apparatus 400 (including each of the main body portion 405 and the piston portion 410) might be any suitable shape.\",\n \"In some embodiments, any edges and/or any corners may be made to be rounded.\",\n \"Although FIG.\",\n \"4 shows the contact surface 440 attached or affixed to the piston portion 410 while the contact sensor 445 is shown attached or affixed to the main body portion 405, the various embodiments are not so limited, and the contact surface 440 attached or affixed to the main body portion 405 while the contact sensor 445 is shown attached or affixed to the piston portion 410.We now turn to FIG.\",\n \"5, which is a general schematic flow diagram illustrating a method 500 for implementing item or luggage loss prevention, in accordance with various embodiments.\",\n \"While the techniques and procedures of the method 500 is depicted and/or described in a certain order for purposes of illustration, it should be appreciated that certain procedures may be reordered and/or omitted within the scope of various embodiments.\",\n \"Moreover, while the method illustrated by FIG.\",\n \"5 can be implemented by (and, in some cases, are described below with respect to) systems 100 of FIG.\",\n \"1 (or components thereof), apparatus 200 of FIG.\",\n \"2, apparatus 325 of FIG.\",\n \"3, and/or apparatus 400 of FIG.\",\n \"4, the method may also be implemented using any suitable hardware implementation.\",\n \"Similarly, while system 100 (and/or components thereof) can operate according to the method illustrated by FIG.\",\n \"5 (e.g., by executing instructions embodied on a computer readable medium), system 100 can also operate according to other modes of operation and/or perform other suitable procedures.\",\n \"In FIG.\",\n \"5, method 500 might comprise, at block 505, determining, with a device, a first user input from a user to lock-in a first weight of a bag.\",\n \"Method 500 might further comprise measuring, with the device, the first weight of the bag, in response to receiving the first user input (block 510).\",\n \"At block 515, method 500 might comprise storing, with the device and in a local data storage device, the measured first weight of the bag, prior to the user removing one or more items from the bag.\",\n \"In some embodiments, particular where the device might comprise a location detection device (such as location detection device 240 shown in FIG.\",\n \"2), method 500 might, at block 520, comprise determining, with the location detection device of the device, a first location of the device (e.g., when measuring the first weight of the bag).\",\n \"At block 525, method 500 might comprise storing, with the device, the first location in the local data storage device.\",\n \"Method 500 might further comprise determining, with the device, that the bag is being moved (block 530).\",\n \"In some cases, this might comprise determining, with the location detection device of the device, a second location of the device when measuring the second weight of the bag (block 535), storing, with the device, the second location in the local data storage device (block 540), and determining, with the device, that the second location is different from the first location.\",\n \"At block 545, method 500 might comprise measuring, with the device, a second weight of the bag.\",\n \"In some cases, this second measurement might be performed in response to determining that the bag is being moved.\",\n \"In other cases, the second measurement might be performed in response to another triggering event (e.g., user input requesting the weight of the bag) and/or the measurement might be performed periodically.\",\n \"Method 500, at block 550, might comprise determining, with the device, whether the second weight of the bag matches the stored first weight of the bag.\",\n \"In some embodiments, method 500 might comprise, at block 555, determining, with the device, which of one or more items (including, without limitation, laptops, smart phones, tablet computers, cellular phones, media players, and/or the like) is missing from the bag based on a difference between the first weight and the second weight.\",\n \"This might include pre-storing a plurality of weights of the bag, with and without each of the one or more items.\",\n \"Based on a determination that the second weight does not match the first weight, method 500 might comprise notifying, with the device, the user (block 560).\",\n \"In some embodiments, notifying the user might comprise one or more of playing a recorded voice notification, emitting one or more audio tones, displaying one or more light sequences, displaying one or more icons, displaying a written message, sending an e-mail notification, sending a text message notification, sending a small message service (“SMS”) notification, sending a multi-media messaging service (“MMS”) notification, or sending a chat message notification.\",\n \"We now turn to FIG.\",\n \"6, which is a block diagram illustrating an exemplary computer architecture.\",\n \"FIG.\",\n \"6 provides a schematic illustration of one embodiment of a computer system 600 that can perform the methods provided by various other embodiments, as described herein, and/or can perform the functions of local computer system 115, 205, 325, or 400, or remote computer system 120, or other computer systems as described above.\",\n \"It should be noted that FIG.\",\n \"6 is meant only to provide a generalized illustration of various components, of which one or more, or none, of each may be utilized as appropriate.\",\n \"FIG.\",\n \"6, therefore, broadly illustrates how individual system elements may be implemented in a relatively separated or relatively more integrated manner.\",\n \"The computer system 600 is shown comprising hardware elements that can be electrically coupled via a bus 605, or may otherwise be in communication, as appropriate.\",\n \"The hardware elements may include one or more processors 610, including without limitation one or more general-purpose processors, or one or more special-purpose processors such as digital signal processing chips, graphics acceleration processors, or the like; one or more input devices 615, which can include without limitation a mouse, a keyboard, or the like; and one or more output devices 620, which can include without limitation a display device, a printer, or the like.\",\n \"The computer system 600 may further include, or be in communication with, one or more storage devices 625.The one or more storage devices 625 can comprise, without limitation, local and/or network accessible storage, or can include, without limitation, a disk drive, a drive array, an optical storage device, a solid-state storage device.\",\n \"The solid-state storage device can include, but is not limited to, one or more of a random access memory (“RAM”) or a read-only memory (“ROM”), which can be programmable, flash-updateable, or the like.\",\n \"Such storage devices may be configured to implement any appropriate data stores, including without limitation various file systems, database structures, or the like.\",\n \"The computer system 600 might also include a communications subsystem 630, which can include without limitation a modem, a network card (wireless or wired), an infra-red communication device, a wireless communication device or chipset, or the like.\",\n \"The wireless communication device might include, but is not limited to, a Bluetooth™ device, an 802.11 device, a WiFi device, a WiMax device, a WWAN device, cellular communication facilities, or the like.\",\n \"The communications subsystem 630 may permit data to be exchanged with a network (such as network 125, to name an example), with other computer systems, with any other devices described herein, or with any combination of network, systems, and devices.\",\n \"According to some embodiments, network 125 might include a local area network (“LAN”), including without limitation a fiber network, an Ethernet network, a Token-Ring™ network, and the like; a wide-area network (“WAN”); a wireless wide area network (“WWAN”); a virtual network, such as a virtual private network (“VPN”); the Internet; an intranet; an extranet; a public switched telephone network (“PSTN”); an infra-red network; a wireless network, including without limitation a network operating under any of the IEEE 802.11 suite of protocols, the Bluetooth™ protocol, or any other wireless protocol; or any combination of these or other networks.\",\n \"In many embodiments, the computer system 600 will further comprise a working memory 635, which can include a RAM or ROM device, as described above.\",\n \"The computer system 600 may also comprise software elements, shown as being currently located within the working memory 635, including an operating system 640, device drivers, executable libraries, or other code.\",\n \"The software elements may include one or more application programs 645, which may comprise computer programs provided by various embodiments, or may be designed to implement methods and/or configure systems provided by other embodiments, as described herein.\",\n \"Merely by way of example, one or more procedures described with respect to the methods discussed above might be implemented as code or instructions executable by a computer or by a processor within a computer.\",\n \"In an aspect, such code or instructions can be used to configure or adapt a general purpose computer, or other device, to perform one or more operations in accordance with the described methods.\",\n \"A set of these instructions or code might be encoded and/or stored on a non-transitory computer readable storage medium, such as the storage devices 625 described above.\",\n \"In some cases, the storage medium might be incorporated within a computer system, such as the system 600.In other embodiments, the storage medium might be separate from a computer system—that is, a removable medium, such as a compact disc, or the like.\",\n \"In some embodiments, the storage medium might be provided in an installation package, such that the storage medium can be used to program, configure, and/or adapt a general purpose computer with the instructions/code stored thereon.\",\n \"These instructions might take the form of executable code, which is executable by the computer system 600, or might take the form of source or installable code.\",\n \"The source or installable code, upon compilation, installation, or both compilation and installation, on the computer system 600 might take the form of executable code.\",\n \"Compilation or installation might be performed using any of a variety of generally available compilers, installation programs, compression/decompression utilities, or the like.\",\n \"It will be apparent to those skilled in the art that substantial variations may be made in accordance with specific requirements.\",\n \"For example, customized hardware—such as programmable logic controllers, field-programmable gate arrays, application-specific integrated circuits, or the like—might also be used.\",\n \"In some cases, particular elements might be implemented in hardware, software (including portable software, such as applets, etc.\",\n \"), or both.\",\n \"Further, connection to other computing devices such as network input/output devices may be employed.\",\n \"As mentioned above, in one aspect, some embodiments may employ a computer system, such as the computer system 600, to perform methods in accordance with various embodiments of the invention.\",\n \"According to a set of embodiments, some or all of the procedures of such methods might be performed by the computer system 600 in response to processor 610 executing one or more sequences of one or more instructions.\",\n \"The one or more instructions might be incorporated into the operating system 640 or other code that may be contained in the working memory 635, such as an application program 645.Such instructions may be read into the working memory 635 from another computer readable medium, such as one or more of the storage devices 625.Merely by way of example, execution of the sequences of instructions contained in the working memory 635 might cause the one or more processors 610 to perform one or more procedures of the methods described herein.\",\n \"The terms “machine readable medium” and “computer readable medium,” as used herein, refer to any medium that participates in providing data that causes a machine to operate in a specific fashion.\",\n \"In an embodiment implemented using the computer system 600, various computer readable media might be involved in providing instructions or code to the one or more processors 610 for execution, might be used to store and/or carry such instructions/code such as signals, or both.\",\n \"In many implementations, a computer readable medium is a non-transitory, physical, or tangible storage medium.\",\n \"Such a medium may take many forms, including, but not limited to, non-volatile media, volatile media, and transmission media.\",\n \"Non-volatile media includes, for example, optical disks, magnetic disks, or both, such as the storage devices 625.Volatile media includes, without limitation, dynamic memory, such as the working memory 635.Transmission media includes, without limitation, coaxial cables, copper wire and fiber optics, including the wires that comprise the bus 605, as well as the various components of the communication subsystem 630, or the media by which the communications subsystem 630 provides communication with other devices.\",\n \"Hence, transmission media can also take the form of waves, including without limitation radio, acoustic, or light waves, such as those generated during radio-wave and infra-red data communications.\",\n \"Common forms of physical or tangible computer readable media include, for example, a floppy disk, a flexible disk, a hard disk, magnetic tape, or any other magnetic medium; a CD-ROM, DVD-ROM, or any other optical medium; punch cards, paper tape, or any other physical medium with patterns of holes; a RAM, a PROM, an EPROM, a FLASH-EPROM, or any other memory chip or cartridge; a carrier wave; or any other medium from which a computer can read instructions or code.\",\n \"As noted above, a set of embodiments comprises methods and systems for implementing item or luggage loss prevention.\",\n \"FIG.\",\n \"7 illustrates a schematic diagram of a system 700 that can be used in accordance with one set of embodiments.\",\n \"The system 700 can include one or more user computers or user devices 705.A user computer or user device 705 can be a general purpose personal computer (including, merely by way of example, desktop computers, tablet computers, laptop computers, handheld computers, and the like, running any appropriate operating system, several of which are available from vendors such as Apple, Microsoft Corp., and the like) and/or a workstation computer running any of a variety of commercially-available UNIX™ or UNIX-like operating systems.\",\n \"A user computer or user device 705 can also have any of a variety of applications, including one or more applications configured to perform methods provided by various embodiments (as described above, for example), as well as one or more office applications, database client and/or server applications, and/or web browser applications.\",\n \"Alternatively, a user computer or user device 705 can be any other electronic device, such as a thin-client computer, Internet-enabled mobile telephone, and/or personal digital assistant, capable of communicating via a network (e.g., the network 710 described below) and/or of displaying and navigating web pages or other types of electronic documents.\",\n \"Although the exemplary system 700 is shown with two user computers or user devices 705, any number of user computers or user devices can be supported.\",\n \"Certain embodiments operate in a networked environment, which can include a network 710.The network 710 can be any type of network familiar to those skilled in the art that can support data communications using any of a variety of commercially-available (and/or free or proprietary) protocols, including without limitation TCP/IP, SNA™, IPX™, AppleTalk™, and the like.\",\n \"Merely by way of example, the network 710 can include a local area network (“LAN”), including without limitation a fiber network, an Ethernet network, a Token-Ring™ network and/or the like; a wide-area network (“WAN”); a wireless wide area network (“WWAN”); a virtual network, such as a virtual private network (“VPN”); the Internet; an intranet; an extranet; a public switched telephone network (“PSTN”); an infra-red network; a wireless network, including without limitation a network operating under any of the IEEE 802.11 suite of protocols, the Bluetooth™ protocol known in the art, and/or any other wireless protocol; and/or any combination of these and/or other networks.\",\n \"In a particular embodiment, the network might include an access network of the service provider (e.g., an Internet service provider (“ISP”)).\",\n \"In another embodiment, the network might include a core network of the service provider, and/or the Internet.\",\n \"Embodiments can also include one or more server computers 715.Each of the server computers 715 may be configured with an operating system, including without limitation any of those discussed above, as well as any commercially (or freely) available server operating systems.\",\n \"Each of the servers 715 may also be running one or more applications, which can be configured to provide services to one or more clients 705 and/or other servers 715.Merely by way of example, one of the servers 715 might be a data server, as described above.\",\n \"The data server might include (or be in communication with) a web server, which can be used, merely by way of example, to process requests for web pages or other electronic documents from user computers 705.The web server can also run a variety of server applications, including HTTP servers, FTP servers, CGI servers, database servers, Java servers, and the like.\",\n \"In some embodiments of the invention, the web server may be configured to serve web pages that can be operated within a web browser on one or more of the user computers 705 to perform methods of the invention.\",\n \"The server computers 715, in some embodiments, might include one or more application servers, which can be configured with one or more applications accessible by a client running on one or more of the client computers 705 and/or other servers 715.Merely by way of example, the server(s) 715 can be one or more general purpose computers capable of executing programs or scripts in response to the user computers 705 and/or other servers 715, including without limitation web applications (which might, in some cases, be configured to perform methods provided by various embodiments).\",\n \"Merely by way of example, a web application can be implemented as one or more scripts or programs written in any suitable programming language, such as Java™, C, C#™ or C++, and/or any scripting language, such as Perl, Python, or TCL, as well as combinations of any programming and/or scripting languages.\",\n \"The application server(s) can also include database servers, including without limitation those commercially available from Oracle™, Microsoft™, Sybase™, IBM™ and the like, which can process requests from clients (including, depending on the configuration, dedicated database clients, API clients, web browsers, etc.)\",\n \"running on a user computer or user device 705 and/or another server 715.In some embodiments, an application server can perform one or more of the processes for implementing automated cloud expansion and ordering, or the like, as described in detail above.\",\n \"Data provided by an application server may be formatted as one or more web pages (comprising HTML, JavaScript, etc., for example) and/or may be forwarded to a user computer 705 via a web server (as described above, for example).\",\n \"Similarly, a web server might receive web page requests and/or input data from a user computer 705 and/or forward the web page requests and/or input data to an application server.\",\n \"In some cases a web server may be integrated with an application server.\",\n \"In accordance with further embodiments, one or more servers 715 can function as a file server and/or can include one or more of the files (e.g., application code, data files, etc.)\",\n \"necessary to implement various disclosed methods, incorporated by an application running on a user computer 705 and/or another server 715.Alternatively, as those skilled in the art will appreciate, a file server can include all necessary files, allowing such an application to be invoked remotely by a user computer or user device 705 and/or server 715.It should be noted that the functions described with respect to various servers herein (e.g., application server, database server, web server, file server, etc.)\",\n \"can be performed by a single server and/or a plurality of specialized servers, depending on implementation-specific needs and parameters.\",\n \"In certain embodiments, the system can include one or more databases 720.The location of the database(s) 720 is discretionary: merely by way of example, a database 720a might reside on a storage medium local to (and/or resident in) a server 715a (and/or a user computer or user device 705).\",\n \"Alternatively, a database 720b can be remote from any or all of the computers 705, 715, so long as it can be in communication (e.g., via the network 710) with one or more of these.\",\n \"In a particular set of embodiments, a database 720 can reside in a storage-area network (“SAN”) familiar to those skilled in the art.\",\n \"(Likewise, any necessary files for performing the functions attributed to the computers 705, 715 can be stored locally on the respective computer and/or remotely, as appropriate.)\",\n \"In one set of embodiments, the database 720 can be a relational database, such as an Oracle database, that is adapted to store, update, and retrieve data in response to SQL-formatted commands.\",\n \"The database might be controlled and/or maintained by a database server, as described above, for example.\",\n \"According to some embodiments, the system can further include device 725, which is configured to be attached to and/or placed in a bag (including, without limitation, a purse, a handbag, a tote, a briefcase, a satchel, laptop bag, travel bag, carry-on luggage, and/or the like).\",\n \"In some cases, device 725 is an item or luggage loss prevention device that is weight-measurement-based, as described in detail above with respect to FIGS.\",\n \"1-5.In other words, device 725 might correspond with, and might have functionalities that are similar to, devices 115, 205, 325, and 400 as described in detail with respect to FIGS.\",\n \"1-4.Although the above embodiments specifically identify electronics components as items that can be tracked (by weight) to prevent loss, the various embodiments are not so limited, and other items may be similarly tracked.\",\n \"Such other items might include, without limitation, eye wear, time pieces (e.g., watches, stopwatches, etc.\",\n \"), jewelry, clothing (ideally, heavier articles of clothing), gifts, toiletry, personal hygiene products, and/or the like.\",\n \"In some embodiments, the systems, apparatuses, and/or methods described above may be applied to child safety seats or child seats.\",\n \"For example, with reference to the embodiments of FIG.\",\n \"3, device 325 (or similar device) may be affixed to at least an underside of a handle of the child seat (so that when positioned from a stored position to a carrying position, relative to the body of the child seat, the device is positioned on at least the underside of the handle), not unlike the relative positioning as shown in FIG.\",\n \"3A.\",\n \"In some cases, some portion of the device 325 (e.g., one or more of processor 210, memory 215, user interface device 220, audio device 230, display device 235, location detection device 240, and/or network interface device 245) might be positioned above the handles, not unlike the embodiment of FIG.\",\n \"3A.\",\n \"In some instances, device 325 (or similar device) might be affixed or attached to the child seat between the child seat and the handle (e.g., a hinge joint or other suitable connection joint, or the like), not unlike the embodiment of FIG.\",\n \"3C.\",\n \"In some cases, device 325 (or similar device) might be placed at a bottom portion of a child seat—for example, between a bottom shell portion and bottom inner cushions (i.e., the part on which a baby's body may be set to rest) of the child seat, not unlike the embodiment of FIG.\",\n \"3B.\",\n \"Alternatively, device 325 (or similar device) might be placed below the bottom shell portion of the child seat (i.e., below the feet of the child seat, if any), not unlike the embodiment of FIG.\",\n \"3D.\",\n \"In some instances, if the child seat has feet or wheels, device 325 (or similar device) might be placed between the bottom shell portion of the child seat and the feet or wheels of the child seat, not unlike the embodiment of FIG.\",\n \"3E, or as part of the feet or wheels of the child seat, not unlike the embodiment of FIG.\",\n \"3F.\",\n \"Merely by way of example, for compression-based weight sensing, such as shown in the embodiments of FIG.\",\n \"3A, 3B, or 3D-3F, the device 325 (or similar device) might comprise a contact surface (e.g., contact surface 440, or the like) and a contact sensor (e.g., contact sensor 445, or the like).\",\n \"The contact surface and the contact sensor are configured so as to be spaced apart when not sensing—which, in some embodiments, may be accomplished with the use of springs, gravity, or the like.\",\n \"Where springs are used, the sensor might be calibrated to take into account the spring constant and other properties of the spring and/or connection configurations when calculating or measuring weight.\",\n \"The contact sensor, like that in the embodiment of FIG.\",\n \"4, might communicatively couple to an interface device (e.g., interface device 455) via a cable (e.g., sensor cable 450).\",\n \"A processor (located either in the contact sensor or the interface device) might perform processing or calculation of the weight based on the applied force.\",\n \"In some cases, the interface device might couple to a network interface device and/or location detection device, and might allow sending of notifications, alerts, or messages to user devices associated with the parents or guardians of the baby if the baby is missing, in danger, or otherwise.\",\n \"The location detection might help parents or guardians in determining where the child was last in the child seat, which may help in locating a missing baby.\",\n \"In some embodiments, multiple devices may be used for each child seat, e.g., to provide more nuanced weight measurements (e.g., for detecting problems or issues that the baby might encounter, as described below).\",\n \"For tension-based weight sensing, such as shown in the embodiments of FIG.\",\n \"3C or 4, the apparatus 400 (or similar apparatus) may be used, in a manner as described above with respect to FIGS.\",\n \"3C and 4.In some cases, the child seat might have an outer shell housing and an inner shell housing.\",\n \"The inner shell housing might have the cushion and the like on which the baby may be set to rest, while the outer shell housing is designed to rest on a surface (e.g., seat of a car, a table, a bed, a ground surface, or a frame for a baby stroller, and/or the like).\",\n \"In some embodiments, the outer shell housing might have a lip or wall that extends upward to encompass at least a portion of an exterior lip or wall of the inner shell housing, and the child seat might comprise two or more (e.g., three or four) connection apparatuses, not unlike apparatus 400 that connects or couples the inner shell housing to the outer shell housing.\",\n \"In some cases, the outer shell housing lip or wall might be vertically aligned with the at least a portion of the exterior lip or wall of the inner shell housing, although such configuration is not necessary for achieving the functionalities described herein.\",\n \"In one set of embodiments, for each of the connection apparatuses, the outer shell housing might be connected to first attachment portion (e.g., first attachment portion 420 or the like), while the inner shell housing might be connected to second attachment portion (e.g., second attachment portion 430 or the like).\",\n \"In this manner, the inner shell housing is almost always hanging from the outer shell housing.\",\n \"The tension-based weight sensing embodiments are otherwise similar, if not identical, to the compression-based weight sensing embodiments, and descriptions of the compression-based weight sensing embodiments are similarly applicable to those of the tension-based weight sensing embodiments.\",\n \"With the systems, apparatuses, and methods described above, it is made possible to ensure that a baby is not left behind, such as when absent-minded and rushed parents or guardians are packing luggage and/or other children for a trip and potentially, accidentally leaving the baby behind (thinking that the baby is securely fastened in the child seat).\",\n \"This might be exacerbated by child seat covers or blankets for keeping the baby warm (such covers or blankets might obscure one's view of the presence or absence of the baby).\",\n \"With the systems, apparatuses, and methods described above, it may easily be determined that the baby is absent, and, in some cases, a notification (e.g., sound notification, e-mail notification, text/chat message notification, voice recording notification, and/or the like) might alert the parents or guardians of this fact (in some cases, by sending such notification to a mobile device(s) associated with the parents or guardians).\",\n \"In some instances, a proximity or motion sensor on the child seat might determine whether a parent or other persons are moving away from the child seat, and might send such information to a processor (e.g., processor 210).\",\n \"In some cases, the proximity sensor might track proximity (and/or movement relative) to a mobile device(s) associated with the parents or guardians of the child.\",\n \"If the processor determines that the proximity or motion sensor data indicate that a parent or other persons have moved away from the child seat by a certain (predetermined or preset) distance while the child seat is occupied by a child (e.g., by receiving weight and weight change data indicating that the child is in the child seat, etc.\",\n \"), regardless of whether the child seat is in a vehicle, at home, or in some other location, then the processor might send a notification (e.g., sound notification, e-mail notification, text/chat message notification, voice recording notification, and/or the like) of such fact to the mobile device(s) associated with the parents or guardians.\",\n \"In some instances, such notification can warn the parents or guardians when the child seat with the child in it has been moved away from them (either inadvertently or purposefully) by some other person.\",\n \"In other embodiments, the systems, apparatuses, and methods described above might determine that the baby has somehow gotten out of the child seat, and may alert the parents or guardians of such an event (in some cases, by sending a notification to the mobile device(s) associated with the parents or guardians).\",\n \"In yet other embodiments, systems, apparatuses, and methods described above might determine that something is amiss with the baby (including, but not limited to, the baby is too still for too long, the weight distribution of the baby is not normal, excess weight is detected, and/or the like), which might indicate urgent (and potentially serious or dangerous) issues have arisen with respect to the baby (e.g., the baby is either in deep sleep or not breathing, the baby is in an odd position that might harm the baby, something has fallen on the child seat and/or the baby, and/or the like).\",\n \"In some cases, with the constant or near constant weight measurement, and with appropriate storage devices installed or frequent sending of weight information to an external storage device, the baby's weight can be tracked over time to give the parents, guardians, or pediatrician a record of the baby's growth.\",\n \"Although applications related to babies are described above with respect to child seats, other appliances or such may also be configured to use the systems, apparatuses, and/or methods described herein.\",\n \"For example, bassinets (where stationary, rocking, hanging, or the like) may be modified (or designed) to utilize the systems, apparatuses, and/or methods herein, in a manner similar to those as described above with respect to the child seats.\",\n \"With such modified (or designed) bassinets, it can be determined when and if the baby has fallen out, has crawled out, has climbed out, or has been taken out, or the like.\",\n \"It can also be determined if, when, and for how long the baby has not been too still for too long, or if, when, and for how long an abnormal weight distribution of the baby is detected.\",\n \"It can be determined if, when, and for how long an excess weight is detected (e.g., suddenly detected).\",\n \"And so on.\",\n \"These and other weight-based or weight determined issues may be determined, and notifications of such may be sent to parents, guardians, and/or pediatricians (or the parents, guardians, and/or pediatricians are otherwise alerted of such issues) as necessary or desired.\",\n \"As with the child seat, the baby's weight can be tracked to allow recording of the baby's growth over time.\",\n \"These and other similar systems, apparatuses, and methods may be similarly applicable to pet carriers, pet mats (or mattresses) in vehicles, pet mats (or mattresses) at home, and/or the like, in order to provide similar information to pet owners about their pets.\",\n \"For outdoor sports enthusiasts, similar technology may be applied to vehicle parts to alert people of missing bicycles, kayaks, canoes, rafts, snowboards, skis, trailers, and/or the like.\",\n \"The various embodiments are not limited to these specific embodiments described herein, and may be applied to other situations and uses, as ordinary (or skilled) person can appreciate.\",\n \"While certain features and aspects have been described with respect to exemplary embodiments, one skilled in the art will recognize that numerous modifications are possible.\",\n \"For example, the methods and processes described herein may be implemented using hardware components, software components, and/or any combination thereof.\",\n \"Further, while various methods and processes described herein may be described with respect to particular structural and/or functional components for ease of description, methods provided by various embodiments are not limited to any particular structural and/or functional architecture but instead can be implemented on any suitable hardware, firmware and/or software configuration.\",\n \"Similarly, while certain functionality is ascribed to certain system components, unless the context dictates otherwise, this functionality can be distributed among various other system components in accordance with the several embodiments.\",\n \"Moreover, while the procedures of the methods and processes described herein are described in a particular order for ease of description, unless the context dictates otherwise, various procedures may be reordered, added, and/or omitted in accordance with various embodiments.\",\n \"Moreover, the procedures described with respect to one method or process may be incorporated within other described methods or processes; likewise, system components described according to a particular structural architecture and/or with respect to one system may be organized in alternative structural architectures and/or incorporated within other described systems.\",\n \"Hence, while various embodiments are described with—or without—certain features for ease of description and to illustrate exemplary aspects of those embodiments, the various components and/or features described herein with respect to a particular embodiment can be substituted, added and/or subtracted from among other described embodiments, unless the context dictates otherwise.\",\n \"Consequently, although several exemplary embodiments are described above, it will be appreciated that the invention is intended to cover all modifications and equivalents within the scope of the following claims.\"\n ]\n]"},"source":{"kind":"string","value":"Patent_15871393"}}},{"rowIdx":4493779,"cells":{"text":{"kind":"list like","value":[["SHOOTING LONG FIBER SPANS WITH HIGH LOSS FIBER","A method of tracing a complete span of a fiber includes inferring a reference point on the fiber based on a measured length of the fiber, setting a pulse width and a measurement range based on the inferred reference point, shooting a fiber from a master unit, attached to one end of the fiber, to collect trace past the inferred reference point, shooting a fiber from a slave unit, attached to an opposite end of the fiber, to collect trace past the inferred reference point, cropping the collected traces captured by the master unit and the slave unit past the inferred reference point, inverting a slope of the trace of the slave unit using measurement loss information and combining the trace of the master unit and the trace of the slave unit, with the inverted slope, to obtain a complete and accurate trace of the fiber."],["1-6.","(canceled) 7.A method of tracing a complete span of a fiber, the method comprising: determining a reference point along an end-to-end length of the fiber, wherein the reference point is specified at a location between the ends of the fiber along the end-to-end length of the fiber; setting a pulse width and a measurement range to be greater than a distance from each end of the fiber to the reference point; shooting a fiber from a master unit, attached to one end of the fiber, to collect trace past the reference point; shooting the fiber from a slave unit, attached to an opposite end of the fiber, to collect trace past the reference point; and combining the trace of the master unit and the trace of the slave unit.","8.The method of claim 7, further comprising measuring an end-to-end length of the fiber; 9.The method of claim 7, further comprising cropping the collected traces captured by the master unit and the slave unit past the reference point.","10.The method of claim 7, further comprising inverting a slope of the trace of the slave unit using measurement loss information.","11.The method of claim 7, wherein the setting the pulse width and the measurement range comprises setting the pulse width and the measurement range to be greater than half the measured length of the fiber.","12.The method of claim 7, wherein the reference point is at a midpoint of the fiber.","13.The method of claim 7, wherein setting the pulse width and the measurement range comprises setting the pulse width and the measurement range of the master unit and the slave unit, the master unit and the slave unit respectively connected to the opposing ends of the fiber, wherein the master unit is configured to collect trace data from the one end of the fiber to a first point beyond the reference point in a first direction along the end-to-end length of the fiber, and wherein the slave unit is configured to collect trace data from the opposite end of the fiber to a second point beyond the reference point in a second opposite direction along the end-to-end length of the fiber.","14.The method of claim 7, wherein the first point beyond the reference point is determined by adding a buffer length to the reference point in the first direction, and wherein the second point beyond the reference point is determined by adding a buffer length to the reference point in the second opposite direction.","15.A method of tracing a complete span of a fiber, the method comprising: determining a reference point along an end-to-end length of the fiber, wherein the reference point is specified at a location between the ends of the fiber along the end-to-end length of the fiber; setting a pulse width and the measurement range of the master unit and the slave unit, the master unit and the slave unit respectively connected to the opposing ends of the fiber, wherein the master unit is configured to collect trace data from the one end of the fiber to a first point beyond the reference point in a first direction along the end-to-end length of the fiber, and wherein the slave unit is configured to collect trace data from the opposite end of the fiber to a second point beyond the reference point in a second opposite direction along the end-to-end length of the fiber; shooting a fiber from the master unit to collect trace past the reference point; shooting the fiber from the slave unit to collect trace past the reference point; and combining the trace of the master unit and the trace of the slave unit.","16.The method of claim 15, further comprising measuring an end-to-end length of the fiber; 17.The method of claim 15, further comprising cropping the collected traces captured by the master unit and the slave unit past the reference point.","18.The method of claim 15, further comprising inverting a slope of the trace of the slave unit using measurement loss information.","19.The method of claim 15, wherein the setting the pulse width and the measurement range comprises setting the pulse width and the measurement range to be greater than half the measured length of the fiber.","20.The method of claim 15, wherein the reference point is at a midpoint of the fiber.","21.The method of claim 15, wherein the first point beyond the reference point is determined by adding a buffer length to the reference point in the first direction, and wherein the second point beyond the reference point is determined by adding a buffer length to the reference point in the second opposite direction."],[" BACKGROUND "],[" SUMMARY Exemplary implementations of the present invention address at least the above problems and/or disadvantages and other disadvantages not described above.","Also, the present invention is not required to overcome the disadvantages described above, and an exemplary implementation of the present invention may not overcome any of the problems listed above.","According to an aspect of an exemplary embodiment, a method of tracing a complete span of a fiber includes inferring a reference point on the fiber based on a measured length of the fiber, setting a pulse width and a measurement range based on the inferred reference point, shooting a fiber from a master unit, attached to one end of the fiber, to collect trace past the inferred reference point, shooting a fiber from a stave unit, attached to an opposite end of the fiber, to collect trace past the inferred reference point, cropping the collected traces captured by the master unit and the slave unit past the inferred reference point, inverting a slope of the trace of the slave unit using measurement loss information, and combining the trace of the master unit and the trace of the Slave Unit, with the inverted slope, to obtain a complete and accurate trace of the fiber.","According to another exemplary embodiment, the pulse width and the measurement range are set to be greater than half the measured length of the fiber.","According to an aspect of another exemplary embodiment, a non-transitory computer readable recording medium storing a program used in an apparatus, including at least one processor, for tracing a complete span of a fiber, causes said at least one processor to infer a reference point on the fiber based on a measured length of the fiber, set a pulse width and a measurement range based on the inferred reference point, shoot a fiber from a master unit, attached to one end of the fiber, to collect trace past the inferred reference point, shoot a fiber from a slave unit, attached to an opposite end of the fiber, to collect trace past the inferred reference point, crop the collected traces captured by the roaster unit and the slave unit past the inferred reference point, invert a slope of the trace of the slave unit using measurement loss information, and combine the trace of the master unit and the trace of the slave unit, with the inverted slope, to obtain a complete and accurate trace of the fiber.","According to another exemplary embodiment, the program further causes the said at least one processor to set the pulse width and the measurement range to be greater than half the measured length of the fiber.","According to an as of another exemplary embodiment, an apparatus for tracing a complete span of a fiber the apparatus includes at least one memory operable to store program code, at least one processor operable to read the program code and operate as instructed by the program code, the program code including inferring code configured to cause the at least one processor to infer a reference point on the fiber based on a measured length of the fiber, setting code configured to cause the at least one processor to set a pulse width and a measurement range based on the inferred reference point, first shooting code configured to cause the at least one processor to shoot a fiber from a master unit, attached to one end of the fiber, to collect trace past the interred reference point, second shooting code configured to cause the at least one processor to shoot a fiber from a slave unit, attached to an opposite end of the fiber, to collect trace past the inferred reference point, cropping code configured to cause the at least one processor to crop the collected traces captured by the master unit and the slave unit past the inferred reference point, inverting code configured to cause the at least one processor to invert a slope of the trace of the slave unit using measurement loss information, and combining code configured to cause the at least one processor to combine the trace of the master unit and the trace of the slave unit, with the inverted slope, to obtain a complete and accurate trace of the fiber.","According to another exemplary embodiment, the setting code is further configured to cause the at least one processor to set the pulse width and the measurement range to be greater than half the measured length of the fiber."],["CROSS-REFERENCE TO RELATED APPLICATIONS This application is based upon and claims the benefit of priority from U.S.","Provisional Application No.","61/934,174, tiled Jan. 31, 2014 in the United States Patent and Trademark Office, the disclosures of which are incorporated herein in its entirety by reference.","BACKGROUND 1.Field The invention is related to event detection and mapping across the complete span of a fiber, and more particularly to measurement of the complete span distance of a fiber, measurement of complete loss across the span of the fiber, event detection and mapping across the complete span of a fiber and achieving trace showing the complete span of the fiber.","2.Related Art The background information provided herein is for the purpose of generally presenting the context of the disclosure.","Work of the presently named inventor, to the extent it is described in this background section, as well as aspects of the description that may not otherwise qualify as prior art at the time of filing, are neither expressly nor impliedly admitted as prior art against the present disclosure.","Long spans of fiber—on the order of 200 km—with splices every 5 km made up of fiber with 0.3 dB/km loss and 0.1 dB per-splice loss drives the need for over 64 dB of dynamic range.","To detect events on such a span—across the complete span an optical time-domain reflectometer (OTDR) would require 70 dB of dynamic range.","This is far beyond the capability of products in the field today.","In the current optical technology, no OTDR can shoot the complete span and measure the length of the fiber described above as it would require over 64 dB of dynamic range.","While high loss spans can be difficult to shoot, long spans in general are difficult to shoot for the same reasons as described above.","While OTDRs can shoot 200 Kilometers (km) low loss spans, the event spacing/resolution can be poor due to the wide pulse widths required to do so.","Accordingly, using shorter pulse widths on some long spans for better event location/resolution.","Use of a 20 uS pulse width gives up to a 2 km location uncertainty as well as burying any events spaced closer than 2 km apart.","Therefore, there is a need for the ability to shoot a long fiber span for measurement of complete span distance, which cannot be simply estimated, measurement of complete loss across span, event detection and mapping across complete span and for acquiring a trace showing complete span of the fiber, so that the customer has confidence the fiber has not be tampered with or modified.","SUMMARY Exemplary implementations of the present invention address at least the above problems and/or disadvantages and other disadvantages not described above.","Also, the present invention is not required to overcome the disadvantages described above, and an exemplary implementation of the present invention may not overcome any of the problems listed above.","According to an aspect of an exemplary embodiment, a method of tracing a complete span of a fiber includes inferring a reference point on the fiber based on a measured length of the fiber, setting a pulse width and a measurement range based on the inferred reference point, shooting a fiber from a master unit, attached to one end of the fiber, to collect trace past the inferred reference point, shooting a fiber from a stave unit, attached to an opposite end of the fiber, to collect trace past the inferred reference point, cropping the collected traces captured by the master unit and the slave unit past the inferred reference point, inverting a slope of the trace of the slave unit using measurement loss information, and combining the trace of the master unit and the trace of the Slave Unit, with the inverted slope, to obtain a complete and accurate trace of the fiber.","According to another exemplary embodiment, the pulse width and the measurement range are set to be greater than half the measured length of the fiber.","According to an aspect of another exemplary embodiment, a non-transitory computer readable recording medium storing a program used in an apparatus, including at least one processor, for tracing a complete span of a fiber, causes said at least one processor to infer a reference point on the fiber based on a measured length of the fiber, set a pulse width and a measurement range based on the inferred reference point, shoot a fiber from a master unit, attached to one end of the fiber, to collect trace past the inferred reference point, shoot a fiber from a slave unit, attached to an opposite end of the fiber, to collect trace past the inferred reference point, crop the collected traces captured by the roaster unit and the slave unit past the inferred reference point, invert a slope of the trace of the slave unit using measurement loss information, and combine the trace of the master unit and the trace of the slave unit, with the inverted slope, to obtain a complete and accurate trace of the fiber.","According to another exemplary embodiment, the program further causes the said at least one processor to set the pulse width and the measurement range to be greater than half the measured length of the fiber.","According to an as of another exemplary embodiment, an apparatus for tracing a complete span of a fiber the apparatus includes at least one memory operable to store program code, at least one processor operable to read the program code and operate as instructed by the program code, the program code including inferring code configured to cause the at least one processor to infer a reference point on the fiber based on a measured length of the fiber, setting code configured to cause the at least one processor to set a pulse width and a measurement range based on the inferred reference point, first shooting code configured to cause the at least one processor to shoot a fiber from a master unit, attached to one end of the fiber, to collect trace past the interred reference point, second shooting code configured to cause the at least one processor to shoot a fiber from a slave unit, attached to an opposite end of the fiber, to collect trace past the inferred reference point, cropping code configured to cause the at least one processor to crop the collected traces captured by the master unit and the slave unit past the inferred reference point, inverting code configured to cause the at least one processor to invert a slope of the trace of the slave unit using measurement loss information, and combining code configured to cause the at least one processor to combine the trace of the master unit and the trace of the slave unit, with the inverted slope, to obtain a complete and accurate trace of the fiber.","According to another exemplary embodiment, the setting code is further configured to cause the at least one processor to set the pulse width and the measurement range to be greater than half the measured length of the fiber.","BRIEF DESCRIPTION OF THE DRAWING FIG.","1 illustrates a fiber with a master and slave connected to opposite ends to determine the length of the fiber, according to an exemplary embodiment.","FIG.","2 illustrates a fiber going through a process of tracing a complete span and event detection, according to an exemplary embodiment.","FIG.","3 is a flowchart describing a method of determining the length of a fiber currently used by other OTDRs available in the market, according to another exemplary embodiment.","FIG.","4 is a flowchart describing a method of tracing a complete span and event detection in a fiber, according to another exemplary embodiment.","FIG.","5 illustrates a fiber with a master and slave connected to opposite ends to determine the length of the fiber while incorporating the errors in the time of flights of light pulses, according to an exemplary embodiment.","FIG.","6 illustrates a functional block diagram of an embodiment of an apparatus which determines a length of a fiber, traces a complete span of a fiber, and performs event detection in a fiber, according to an exemplary embodiment.","DETAILED DESCRIPTION The following detailed description is provided to assist the reader in gaining a comprehensive understanding of the methods, apparatuses and/or systems described herein.","Various changes, modifications, and equivalents of the systems, apparatuses and/or methods described herein will suggest themselves to those of ordinary skill in the art.","Descriptions of well-known functions and structures are omitted to enhance clarity and conciseness.","The terms used in the description are intended to describe embodiments only, and shall by no means be restrictive.","Unless clearly used otherwise, expressions in a singular form include a meaning of a plural form.","In the present description, an expression such as “comprising” or “including” is intended to designate a characteristic, a number, a step, an operation, an element, a part or combinations thereof, and shall not be construed to preclude any presence or possibility of one or more other characteristics, numbers, steps, operations, elements, parts or combinations thereof.","Referring to the drawings, FIG.","1 illustrates a fiber with a master and slave connected to opposite ends to determine the length of the fiber, according to an exemplary embodiment.","According to an exemplary embodiment, the two ends attached to the fiber may be made up of two units.","One may function in a master mode and the other may function in a slave mode.","The terms master mode and slave mode are merely used as exemplary embodiments and are interchangeable with main mode/remote mode and other terminology well known to one of ordinary skill in the art.","The master unit may be attached to one end of the fiber.","The slave may be attached to the opposite end of the fiber.","To measure the length of the fiber, the master unit sends a light pulse or a set of light pulses, as shown by the arrows in FIG.","1, with a time stamp encoded in the pulse train, according to exemplary embodiments.","The slave unit receives the light pulse or the set of light pulses with the encoded time stamp and rebroadcasts the pulse/pulses to the master.","If using the single light pulse method, the master calculates the time it took from firing the pulse to receiving the pulse back from the slave, thereby calculating the round-trip time.","If using the train of light pulses with the time stamp of the master encoded in the pulse train, the master subtracts the time stamp from the it's current time reference, thereby again calculating the total round-trip time.","Accordingly, the length of the fiber can be calculated using the following formula for calculating the time of flight in one direction: Time of Flight in one direction=(Calculated Round−Trip-Time in seconds)/2.Thus, the length of the fiber can be calculated using the time of flight calculation using the above formula.","The conversion to meters is based on the Fiber Index of Refraction.","Accordingly, using the above describes exemplary embodiments, an accurate length measurement of the fiber can be achieved.","FIG.","2 illustrates a fiber going through a process of tracing a complete span and event detection, according to an exemplary embodiment.","No OTDR today can shoot the complete span of a fiber.","Therefore an accurate trace cannot be created and all events cannot be detected.","With today's OTDRs, one can shoot from either side of the span; however, without having some known reference point, you cannot attach the traces from either end of the span into a single, coherent, accurate trace of the complete span of the fiber.","According to an exemplary embodiment described in FIG.","1, the Length can be accurately measured as described above.","Therefore, a known reference point can be inferred by using the mid-point of the span as the known reference point.","For example, if the span is 200 km long, then the mid-point is exactly 100 km from either end.","The Master unit sets its pulse width (PW) and measurement range to 0.5*measure length+25%((the 25% being added as buffer).","This means it sets the appropriate PW to shoot 120 km and chooses the appropriate range to measure 120 km, according to the exemplary embodiment.","Accordingly, after knowing the known reference point and performing the calculation, the Master unit shoots the fiber and collects the trace.","At some point beyond 120 km, the trace enters the noise floor.","However, the length of interest is the first 100 km which has been clearly captured and therefore, accurate event detection can be performed on it.","In the same manner, the Slave unit shoots the fiber and collects the trace.","At some point beyond 120 km, the trace enters the noise floor.","However, the length of interest is the first 100 km which has been clearly captured and therefore, accurate event detection can be performed on it.","In the exemplary embodiment of FIG.","2, if A is considered the master end of the fiber, the trace captured on the Master unit is cropped to remove anything occurring after the midpoint X.","In the same manner, the trace captured on the Slave unit B is cropped to remove anything occurring after the midpoint X.","The remaining trace of the slave end B-X is then inverted.","Specifically, by taking the measurement loss information, the slope of the trace is inverted, as shown in FIG.","2.Now a complete and accurate trace of the span is provided with complete event analysis.","Using the same analysis, the complete loss can also be determined.","FIG.","3 is a flowchart describing a method of determining the length of a fiber, according to another exemplary embodiment.","The method first includes sending a light pulse or a set of light pulses from the Master Unit at one end of the fiber to the slave unit at the opposite end of the fiber 301.Following that the master unit receives the light pulse or the set of light pulses back from the slave unit 302.Step 303 incorporated calculating the total round-trip travel time of the light pulse or the set of light pulses.","Finally, step 304 incorporates calculating the length of the fiber using the calculated total round-trip travel time, according to an exemplary embodiment.","The above described method for measuring length of the fiber is used by the T400 and C840 optical loss test sets (OLTS) and the C850 OLTS/OTDR for length measurement.","FIG.","4 is a flowchart describing a method of tracing a complete span and event detection in a fiber, according to another exemplary embodiment.","The method first includes Inferring a known reference point based on the measured length of the fiber 401.Following that a pulse width and measurement range is set based on the inferred reference point 402.Step 403 incorporated shooting a fiber from the master unit to collect trace past the inferred reference point.","Step 404 incorporates shooting a fiber from the slave unit to collect trace past the inferred reference point.","In step 405, traces captured by both the master unit and the Slave Unit are cropped past the inferred reference point.","In step 406, by taking the measurement loss information, the slope of the trace of the slave unit is inverted.","Finally, step 407 incorporates combining the traces of the master unit and the slave unit to achieve a complete and accurate trace of the fiber, according to an exemplary embodiment, as described with reference to FIG.","2 above.","FIG.","5 illustrates a fiber with a master and slave connected to opposite ends to determine the length of the fiber while incorporating the errors in the time of flights of light pulses, according to art exemplary embodiment.","As depicted in FIG.","5, the error in the time of flight for a light pulse sent from A to B will be Ea1+Eb2.Similarly, the error in the time of flight from B to A will he Eb1+Ea2.Accordingly, the total time of flight from A to B incorporating the errors can be calculated by the following formula: Time of Flight 1=Time of Flight A−B+Ea1+Eb2 Similarly, the total time of flight from B to A incorporating the errors can be calculated by the following formula: Time of Flight 2=Time of Flight B−A+Ea2+Eb1 As the time of flight from A to B is the same as the time of flight B to A, the error term can be calculated using the following formula: Time of flight 1−Time of flight 2=(Ea1+Eb2)−(Eb1+Ea2)=Eab Furthermore, the following formula uses the error term to provides us with the average time of flight: Average time of flight=(Time of flight 1+Time of flight 2−Eab)/2 FIG.","6 illustrates a functional block diagram of an embodiment of an apparatus which determines a length of a fiber, traces a complete span of a fiber, and performs event detection in a fiber, according to an exemplary embodiment.","The apparatus 601 includes a memory 603, a processor 602, and an Optics/Electronics unit 604, according to an exemplary embodiment.","An example of a processor is an ARM Xscale 806 Mhz processor.","An example of a memory is an 8 Gbit NAND flash memory.","Accordingly, the memory may store a program code/operating software which in-turn instructs the processor 602/Optics/Electronics 604 to measure the complete span distance, which cannot be simply estimated, measure the complete loss across span, perform event detection and map across complete span to acquire a trace showing complete span of the fiber, as described in FIGS.","1-5 above.","The program code/operating software can also be stored on a non-transitory computer readable medium.","The different exemplary embodiments described above provide a more accurate trace and event profile compared to a single side shot with a high power OTDR.","They further allow use of shorter PW than required to shoot a complete span and use a shorter range than required to shoot the complete span thereby providing increased resolution.","Furthermore, they allow use of a less dynamic range OTDR providing a more cost effective and practical solution.","Although certain benefits of the described embodiments are listed above, the benefits are riot limited thereto.","As mentioned above, the embodiments described above are merely exemplary and the general inventive concept should not be limited thereto.","While this specification contains many features, the features should not be construed as limitations on the scope of the disclosure or the appended claims.","Certain features described in the context of separate embodiments can also be implemented in combination.","Conversely, various features described in the context of a single embodiment can also be implemented in multiple embodiments separately or in any suitable sub-combination."]],"string":"[\n [\n \"SHOOTING LONG FIBER SPANS WITH HIGH LOSS FIBER\",\n \"A method of tracing a complete span of a fiber includes inferring a reference point on the fiber based on a measured length of the fiber, setting a pulse width and a measurement range based on the inferred reference point, shooting a fiber from a master unit, attached to one end of the fiber, to collect trace past the inferred reference point, shooting a fiber from a slave unit, attached to an opposite end of the fiber, to collect trace past the inferred reference point, cropping the collected traces captured by the master unit and the slave unit past the inferred reference point, inverting a slope of the trace of the slave unit using measurement loss information and combining the trace of the master unit and the trace of the slave unit, with the inverted slope, to obtain a complete and accurate trace of the fiber.\"\n ],\n [\n \"1-6.\",\n \"(canceled) 7.A method of tracing a complete span of a fiber, the method comprising: determining a reference point along an end-to-end length of the fiber, wherein the reference point is specified at a location between the ends of the fiber along the end-to-end length of the fiber; setting a pulse width and a measurement range to be greater than a distance from each end of the fiber to the reference point; shooting a fiber from a master unit, attached to one end of the fiber, to collect trace past the reference point; shooting the fiber from a slave unit, attached to an opposite end of the fiber, to collect trace past the reference point; and combining the trace of the master unit and the trace of the slave unit.\",\n \"8.The method of claim 7, further comprising measuring an end-to-end length of the fiber; 9.The method of claim 7, further comprising cropping the collected traces captured by the master unit and the slave unit past the reference point.\",\n \"10.The method of claim 7, further comprising inverting a slope of the trace of the slave unit using measurement loss information.\",\n \"11.The method of claim 7, wherein the setting the pulse width and the measurement range comprises setting the pulse width and the measurement range to be greater than half the measured length of the fiber.\",\n \"12.The method of claim 7, wherein the reference point is at a midpoint of the fiber.\",\n \"13.The method of claim 7, wherein setting the pulse width and the measurement range comprises setting the pulse width and the measurement range of the master unit and the slave unit, the master unit and the slave unit respectively connected to the opposing ends of the fiber, wherein the master unit is configured to collect trace data from the one end of the fiber to a first point beyond the reference point in a first direction along the end-to-end length of the fiber, and wherein the slave unit is configured to collect trace data from the opposite end of the fiber to a second point beyond the reference point in a second opposite direction along the end-to-end length of the fiber.\",\n \"14.The method of claim 7, wherein the first point beyond the reference point is determined by adding a buffer length to the reference point in the first direction, and wherein the second point beyond the reference point is determined by adding a buffer length to the reference point in the second opposite direction.\",\n \"15.A method of tracing a complete span of a fiber, the method comprising: determining a reference point along an end-to-end length of the fiber, wherein the reference point is specified at a location between the ends of the fiber along the end-to-end length of the fiber; setting a pulse width and the measurement range of the master unit and the slave unit, the master unit and the slave unit respectively connected to the opposing ends of the fiber, wherein the master unit is configured to collect trace data from the one end of the fiber to a first point beyond the reference point in a first direction along the end-to-end length of the fiber, and wherein the slave unit is configured to collect trace data from the opposite end of the fiber to a second point beyond the reference point in a second opposite direction along the end-to-end length of the fiber; shooting a fiber from the master unit to collect trace past the reference point; shooting the fiber from the slave unit to collect trace past the reference point; and combining the trace of the master unit and the trace of the slave unit.\",\n \"16.The method of claim 15, further comprising measuring an end-to-end length of the fiber; 17.The method of claim 15, further comprising cropping the collected traces captured by the master unit and the slave unit past the reference point.\",\n \"18.The method of claim 15, further comprising inverting a slope of the trace of the slave unit using measurement loss information.\",\n \"19.The method of claim 15, wherein the setting the pulse width and the measurement range comprises setting the pulse width and the measurement range to be greater than half the measured length of the fiber.\",\n \"20.The method of claim 15, wherein the reference point is at a midpoint of the fiber.\",\n \"21.The method of claim 15, wherein the first point beyond the reference point is determined by adding a buffer length to the reference point in the first direction, and wherein the second point beyond the reference point is determined by adding a buffer length to the reference point in the second opposite direction.\"\n ],\n [\n \" BACKGROUND \"\n ],\n [\n \" SUMMARY Exemplary implementations of the present invention address at least the above problems and/or disadvantages and other disadvantages not described above.\",\n \"Also, the present invention is not required to overcome the disadvantages described above, and an exemplary implementation of the present invention may not overcome any of the problems listed above.\",\n \"According to an aspect of an exemplary embodiment, a method of tracing a complete span of a fiber includes inferring a reference point on the fiber based on a measured length of the fiber, setting a pulse width and a measurement range based on the inferred reference point, shooting a fiber from a master unit, attached to one end of the fiber, to collect trace past the inferred reference point, shooting a fiber from a stave unit, attached to an opposite end of the fiber, to collect trace past the inferred reference point, cropping the collected traces captured by the master unit and the slave unit past the inferred reference point, inverting a slope of the trace of the slave unit using measurement loss information, and combining the trace of the master unit and the trace of the Slave Unit, with the inverted slope, to obtain a complete and accurate trace of the fiber.\",\n \"According to another exemplary embodiment, the pulse width and the measurement range are set to be greater than half the measured length of the fiber.\",\n \"According to an aspect of another exemplary embodiment, a non-transitory computer readable recording medium storing a program used in an apparatus, including at least one processor, for tracing a complete span of a fiber, causes said at least one processor to infer a reference point on the fiber based on a measured length of the fiber, set a pulse width and a measurement range based on the inferred reference point, shoot a fiber from a master unit, attached to one end of the fiber, to collect trace past the inferred reference point, shoot a fiber from a slave unit, attached to an opposite end of the fiber, to collect trace past the inferred reference point, crop the collected traces captured by the roaster unit and the slave unit past the inferred reference point, invert a slope of the trace of the slave unit using measurement loss information, and combine the trace of the master unit and the trace of the slave unit, with the inverted slope, to obtain a complete and accurate trace of the fiber.\",\n \"According to another exemplary embodiment, the program further causes the said at least one processor to set the pulse width and the measurement range to be greater than half the measured length of the fiber.\",\n \"According to an as of another exemplary embodiment, an apparatus for tracing a complete span of a fiber the apparatus includes at least one memory operable to store program code, at least one processor operable to read the program code and operate as instructed by the program code, the program code including inferring code configured to cause the at least one processor to infer a reference point on the fiber based on a measured length of the fiber, setting code configured to cause the at least one processor to set a pulse width and a measurement range based on the inferred reference point, first shooting code configured to cause the at least one processor to shoot a fiber from a master unit, attached to one end of the fiber, to collect trace past the interred reference point, second shooting code configured to cause the at least one processor to shoot a fiber from a slave unit, attached to an opposite end of the fiber, to collect trace past the inferred reference point, cropping code configured to cause the at least one processor to crop the collected traces captured by the master unit and the slave unit past the inferred reference point, inverting code configured to cause the at least one processor to invert a slope of the trace of the slave unit using measurement loss information, and combining code configured to cause the at least one processor to combine the trace of the master unit and the trace of the slave unit, with the inverted slope, to obtain a complete and accurate trace of the fiber.\",\n \"According to another exemplary embodiment, the setting code is further configured to cause the at least one processor to set the pulse width and the measurement range to be greater than half the measured length of the fiber.\"\n ],\n [\n \"CROSS-REFERENCE TO RELATED APPLICATIONS This application is based upon and claims the benefit of priority from U.S.\",\n \"Provisional Application No.\",\n \"61/934,174, tiled Jan. 31, 2014 in the United States Patent and Trademark Office, the disclosures of which are incorporated herein in its entirety by reference.\",\n \"BACKGROUND 1.Field The invention is related to event detection and mapping across the complete span of a fiber, and more particularly to measurement of the complete span distance of a fiber, measurement of complete loss across the span of the fiber, event detection and mapping across the complete span of a fiber and achieving trace showing the complete span of the fiber.\",\n \"2.Related Art The background information provided herein is for the purpose of generally presenting the context of the disclosure.\",\n \"Work of the presently named inventor, to the extent it is described in this background section, as well as aspects of the description that may not otherwise qualify as prior art at the time of filing, are neither expressly nor impliedly admitted as prior art against the present disclosure.\",\n \"Long spans of fiber—on the order of 200 km—with splices every 5 km made up of fiber with 0.3 dB/km loss and 0.1 dB per-splice loss drives the need for over 64 dB of dynamic range.\",\n \"To detect events on such a span—across the complete span an optical time-domain reflectometer (OTDR) would require 70 dB of dynamic range.\",\n \"This is far beyond the capability of products in the field today.\",\n \"In the current optical technology, no OTDR can shoot the complete span and measure the length of the fiber described above as it would require over 64 dB of dynamic range.\",\n \"While high loss spans can be difficult to shoot, long spans in general are difficult to shoot for the same reasons as described above.\",\n \"While OTDRs can shoot 200 Kilometers (km) low loss spans, the event spacing/resolution can be poor due to the wide pulse widths required to do so.\",\n \"Accordingly, using shorter pulse widths on some long spans for better event location/resolution.\",\n \"Use of a 20 uS pulse width gives up to a 2 km location uncertainty as well as burying any events spaced closer than 2 km apart.\",\n \"Therefore, there is a need for the ability to shoot a long fiber span for measurement of complete span distance, which cannot be simply estimated, measurement of complete loss across span, event detection and mapping across complete span and for acquiring a trace showing complete span of the fiber, so that the customer has confidence the fiber has not be tampered with or modified.\",\n \"SUMMARY Exemplary implementations of the present invention address at least the above problems and/or disadvantages and other disadvantages not described above.\",\n \"Also, the present invention is not required to overcome the disadvantages described above, and an exemplary implementation of the present invention may not overcome any of the problems listed above.\",\n \"According to an aspect of an exemplary embodiment, a method of tracing a complete span of a fiber includes inferring a reference point on the fiber based on a measured length of the fiber, setting a pulse width and a measurement range based on the inferred reference point, shooting a fiber from a master unit, attached to one end of the fiber, to collect trace past the inferred reference point, shooting a fiber from a stave unit, attached to an opposite end of the fiber, to collect trace past the inferred reference point, cropping the collected traces captured by the master unit and the slave unit past the inferred reference point, inverting a slope of the trace of the slave unit using measurement loss information, and combining the trace of the master unit and the trace of the Slave Unit, with the inverted slope, to obtain a complete and accurate trace of the fiber.\",\n \"According to another exemplary embodiment, the pulse width and the measurement range are set to be greater than half the measured length of the fiber.\",\n \"According to an aspect of another exemplary embodiment, a non-transitory computer readable recording medium storing a program used in an apparatus, including at least one processor, for tracing a complete span of a fiber, causes said at least one processor to infer a reference point on the fiber based on a measured length of the fiber, set a pulse width and a measurement range based on the inferred reference point, shoot a fiber from a master unit, attached to one end of the fiber, to collect trace past the inferred reference point, shoot a fiber from a slave unit, attached to an opposite end of the fiber, to collect trace past the inferred reference point, crop the collected traces captured by the roaster unit and the slave unit past the inferred reference point, invert a slope of the trace of the slave unit using measurement loss information, and combine the trace of the master unit and the trace of the slave unit, with the inverted slope, to obtain a complete and accurate trace of the fiber.\",\n \"According to another exemplary embodiment, the program further causes the said at least one processor to set the pulse width and the measurement range to be greater than half the measured length of the fiber.\",\n \"According to an as of another exemplary embodiment, an apparatus for tracing a complete span of a fiber the apparatus includes at least one memory operable to store program code, at least one processor operable to read the program code and operate as instructed by the program code, the program code including inferring code configured to cause the at least one processor to infer a reference point on the fiber based on a measured length of the fiber, setting code configured to cause the at least one processor to set a pulse width and a measurement range based on the inferred reference point, first shooting code configured to cause the at least one processor to shoot a fiber from a master unit, attached to one end of the fiber, to collect trace past the interred reference point, second shooting code configured to cause the at least one processor to shoot a fiber from a slave unit, attached to an opposite end of the fiber, to collect trace past the inferred reference point, cropping code configured to cause the at least one processor to crop the collected traces captured by the master unit and the slave unit past the inferred reference point, inverting code configured to cause the at least one processor to invert a slope of the trace of the slave unit using measurement loss information, and combining code configured to cause the at least one processor to combine the trace of the master unit and the trace of the slave unit, with the inverted slope, to obtain a complete and accurate trace of the fiber.\",\n \"According to another exemplary embodiment, the setting code is further configured to cause the at least one processor to set the pulse width and the measurement range to be greater than half the measured length of the fiber.\",\n \"BRIEF DESCRIPTION OF THE DRAWING FIG.\",\n \"1 illustrates a fiber with a master and slave connected to opposite ends to determine the length of the fiber, according to an exemplary embodiment.\",\n \"FIG.\",\n \"2 illustrates a fiber going through a process of tracing a complete span and event detection, according to an exemplary embodiment.\",\n \"FIG.\",\n \"3 is a flowchart describing a method of determining the length of a fiber currently used by other OTDRs available in the market, according to another exemplary embodiment.\",\n \"FIG.\",\n \"4 is a flowchart describing a method of tracing a complete span and event detection in a fiber, according to another exemplary embodiment.\",\n \"FIG.\",\n \"5 illustrates a fiber with a master and slave connected to opposite ends to determine the length of the fiber while incorporating the errors in the time of flights of light pulses, according to an exemplary embodiment.\",\n \"FIG.\",\n \"6 illustrates a functional block diagram of an embodiment of an apparatus which determines a length of a fiber, traces a complete span of a fiber, and performs event detection in a fiber, according to an exemplary embodiment.\",\n \"DETAILED DESCRIPTION The following detailed description is provided to assist the reader in gaining a comprehensive understanding of the methods, apparatuses and/or systems described herein.\",\n \"Various changes, modifications, and equivalents of the systems, apparatuses and/or methods described herein will suggest themselves to those of ordinary skill in the art.\",\n \"Descriptions of well-known functions and structures are omitted to enhance clarity and conciseness.\",\n \"The terms used in the description are intended to describe embodiments only, and shall by no means be restrictive.\",\n \"Unless clearly used otherwise, expressions in a singular form include a meaning of a plural form.\",\n \"In the present description, an expression such as “comprising” or “including” is intended to designate a characteristic, a number, a step, an operation, an element, a part or combinations thereof, and shall not be construed to preclude any presence or possibility of one or more other characteristics, numbers, steps, operations, elements, parts or combinations thereof.\",\n \"Referring to the drawings, FIG.\",\n \"1 illustrates a fiber with a master and slave connected to opposite ends to determine the length of the fiber, according to an exemplary embodiment.\",\n \"According to an exemplary embodiment, the two ends attached to the fiber may be made up of two units.\",\n \"One may function in a master mode and the other may function in a slave mode.\",\n \"The terms master mode and slave mode are merely used as exemplary embodiments and are interchangeable with main mode/remote mode and other terminology well known to one of ordinary skill in the art.\",\n \"The master unit may be attached to one end of the fiber.\",\n \"The slave may be attached to the opposite end of the fiber.\",\n \"To measure the length of the fiber, the master unit sends a light pulse or a set of light pulses, as shown by the arrows in FIG.\",\n \"1, with a time stamp encoded in the pulse train, according to exemplary embodiments.\",\n \"The slave unit receives the light pulse or the set of light pulses with the encoded time stamp and rebroadcasts the pulse/pulses to the master.\",\n \"If using the single light pulse method, the master calculates the time it took from firing the pulse to receiving the pulse back from the slave, thereby calculating the round-trip time.\",\n \"If using the train of light pulses with the time stamp of the master encoded in the pulse train, the master subtracts the time stamp from the it's current time reference, thereby again calculating the total round-trip time.\",\n \"Accordingly, the length of the fiber can be calculated using the following formula for calculating the time of flight in one direction: Time of Flight in one direction=(Calculated Round−Trip-Time in seconds)/2.Thus, the length of the fiber can be calculated using the time of flight calculation using the above formula.\",\n \"The conversion to meters is based on the Fiber Index of Refraction.\",\n \"Accordingly, using the above describes exemplary embodiments, an accurate length measurement of the fiber can be achieved.\",\n \"FIG.\",\n \"2 illustrates a fiber going through a process of tracing a complete span and event detection, according to an exemplary embodiment.\",\n \"No OTDR today can shoot the complete span of a fiber.\",\n \"Therefore an accurate trace cannot be created and all events cannot be detected.\",\n \"With today's OTDRs, one can shoot from either side of the span; however, without having some known reference point, you cannot attach the traces from either end of the span into a single, coherent, accurate trace of the complete span of the fiber.\",\n \"According to an exemplary embodiment described in FIG.\",\n \"1, the Length can be accurately measured as described above.\",\n \"Therefore, a known reference point can be inferred by using the mid-point of the span as the known reference point.\",\n \"For example, if the span is 200 km long, then the mid-point is exactly 100 km from either end.\",\n \"The Master unit sets its pulse width (PW) and measurement range to 0.5*measure length+25%((the 25% being added as buffer).\",\n \"This means it sets the appropriate PW to shoot 120 km and chooses the appropriate range to measure 120 km, according to the exemplary embodiment.\",\n \"Accordingly, after knowing the known reference point and performing the calculation, the Master unit shoots the fiber and collects the trace.\",\n \"At some point beyond 120 km, the trace enters the noise floor.\",\n \"However, the length of interest is the first 100 km which has been clearly captured and therefore, accurate event detection can be performed on it.\",\n \"In the same manner, the Slave unit shoots the fiber and collects the trace.\",\n \"At some point beyond 120 km, the trace enters the noise floor.\",\n \"However, the length of interest is the first 100 km which has been clearly captured and therefore, accurate event detection can be performed on it.\",\n \"In the exemplary embodiment of FIG.\",\n \"2, if A is considered the master end of the fiber, the trace captured on the Master unit is cropped to remove anything occurring after the midpoint X.\",\n \"In the same manner, the trace captured on the Slave unit B is cropped to remove anything occurring after the midpoint X.\",\n \"The remaining trace of the slave end B-X is then inverted.\",\n \"Specifically, by taking the measurement loss information, the slope of the trace is inverted, as shown in FIG.\",\n \"2.Now a complete and accurate trace of the span is provided with complete event analysis.\",\n \"Using the same analysis, the complete loss can also be determined.\",\n \"FIG.\",\n \"3 is a flowchart describing a method of determining the length of a fiber, according to another exemplary embodiment.\",\n \"The method first includes sending a light pulse or a set of light pulses from the Master Unit at one end of the fiber to the slave unit at the opposite end of the fiber 301.Following that the master unit receives the light pulse or the set of light pulses back from the slave unit 302.Step 303 incorporated calculating the total round-trip travel time of the light pulse or the set of light pulses.\",\n \"Finally, step 304 incorporates calculating the length of the fiber using the calculated total round-trip travel time, according to an exemplary embodiment.\",\n \"The above described method for measuring length of the fiber is used by the T400 and C840 optical loss test sets (OLTS) and the C850 OLTS/OTDR for length measurement.\",\n \"FIG.\",\n \"4 is a flowchart describing a method of tracing a complete span and event detection in a fiber, according to another exemplary embodiment.\",\n \"The method first includes Inferring a known reference point based on the measured length of the fiber 401.Following that a pulse width and measurement range is set based on the inferred reference point 402.Step 403 incorporated shooting a fiber from the master unit to collect trace past the inferred reference point.\",\n \"Step 404 incorporates shooting a fiber from the slave unit to collect trace past the inferred reference point.\",\n \"In step 405, traces captured by both the master unit and the Slave Unit are cropped past the inferred reference point.\",\n \"In step 406, by taking the measurement loss information, the slope of the trace of the slave unit is inverted.\",\n \"Finally, step 407 incorporates combining the traces of the master unit and the slave unit to achieve a complete and accurate trace of the fiber, according to an exemplary embodiment, as described with reference to FIG.\",\n \"2 above.\",\n \"FIG.\",\n \"5 illustrates a fiber with a master and slave connected to opposite ends to determine the length of the fiber while incorporating the errors in the time of flights of light pulses, according to art exemplary embodiment.\",\n \"As depicted in FIG.\",\n \"5, the error in the time of flight for a light pulse sent from A to B will be Ea1+Eb2.Similarly, the error in the time of flight from B to A will he Eb1+Ea2.Accordingly, the total time of flight from A to B incorporating the errors can be calculated by the following formula: Time of Flight 1=Time of Flight A−B+Ea1+Eb2 Similarly, the total time of flight from B to A incorporating the errors can be calculated by the following formula: Time of Flight 2=Time of Flight B−A+Ea2+Eb1 As the time of flight from A to B is the same as the time of flight B to A, the error term can be calculated using the following formula: Time of flight 1−Time of flight 2=(Ea1+Eb2)−(Eb1+Ea2)=Eab Furthermore, the following formula uses the error term to provides us with the average time of flight: Average time of flight=(Time of flight 1+Time of flight 2−Eab)/2 FIG.\",\n \"6 illustrates a functional block diagram of an embodiment of an apparatus which determines a length of a fiber, traces a complete span of a fiber, and performs event detection in a fiber, according to an exemplary embodiment.\",\n \"The apparatus 601 includes a memory 603, a processor 602, and an Optics/Electronics unit 604, according to an exemplary embodiment.\",\n \"An example of a processor is an ARM Xscale 806 Mhz processor.\",\n \"An example of a memory is an 8 Gbit NAND flash memory.\",\n \"Accordingly, the memory may store a program code/operating software which in-turn instructs the processor 602/Optics/Electronics 604 to measure the complete span distance, which cannot be simply estimated, measure the complete loss across span, perform event detection and map across complete span to acquire a trace showing complete span of the fiber, as described in FIGS.\",\n \"1-5 above.\",\n \"The program code/operating software can also be stored on a non-transitory computer readable medium.\",\n \"The different exemplary embodiments described above provide a more accurate trace and event profile compared to a single side shot with a high power OTDR.\",\n \"They further allow use of shorter PW than required to shoot a complete span and use a shorter range than required to shoot the complete span thereby providing increased resolution.\",\n \"Furthermore, they allow use of a less dynamic range OTDR providing a more cost effective and practical solution.\",\n \"Although certain benefits of the described embodiments are listed above, the benefits are riot limited thereto.\",\n \"As mentioned above, the embodiments described above are merely exemplary and the general inventive concept should not be limited thereto.\",\n \"While this specification contains many features, the features should not be construed as limitations on the scope of the disclosure or the appended claims.\",\n \"Certain features described in the context of separate embodiments can also be implemented in combination.\",\n \"Conversely, various features described in the context of a single embodiment can also be implemented in multiple embodiments separately or in any suitable sub-combination.\"\n ]\n]"},"source":{"kind":"string","value":"Patent_15871398"}}},{"rowIdx":4493780,"cells":{"text":{"kind":"list like","value":[["Catheter Connector Insert","The present invention relates to a catheter connector assembly having an insert for use during packaging, shipping, and handling of a catheter connector.","The assembly includes a catheter connector having a body with a first half axially aligned with a second half.","The first half is rotatable relative to the second half between an open position and a closed position.","The first half defines a distal end of the body and the second half defines a proximal end of the body.","A proximal end port is configured with the proximal end of the second half for mating communication with a fluid delivery device.","The insert is configured with the body when the body is in the open position such that the insert maintains the catheter connector in the open position during packaging, shipping, and handling of the catheter connector."],["1.An insert for a catheter connector for use during packaging, shipping, and handling of the catheter connector, said insert comprising: a rod-shaped member configured to fit within the catheter connector, the catheter connector having a body with a first half axially aligned with a second half, the first half rotatable relative to the second half between an open position and a closed position, the rod-shaped member configured to fit within the first and second halves when the catheter connector is in the open position such that said insert maintains the catheter connector in the open position during packaging, shipping, and handling of the catheter connector.","2.The insert of claim 1, further comprising a tab member configured with said rod-shaped member, said tab member extending outside of the catheter connector when said rod-shaped member is inserted within the first and second halves of the catheter connector, said tab member configured to assist a user with removing said insert from the catheter connector.","3.The insert of claim 1, wherein the open position comprises the first half being rotated relative to the second half at an approximately 45-degree angle.","4.The insert of claim 1, wherein said insert comprises a rigid material.","5.The insert of claim 4, wherein said rigid material comprises at least one of or a combination of the following: a plastic material, polycarbonate, polypropylene, polyurethane, polyester, epoxy resins, phenolic resins, polyvinyl chloride (PVC), or metal.","6.An insert for a catheter connector for use during packaging, shipping, and handling of the catheter connector, said insert comprising: a housing configured to fit at least partially around an exterior surface of the catheter connector, the catheter connector having a body with a first half axially aligned with a second half, the first half rotatable relative to the second half between an open position and a closed position, said housing comprising a hollow interior, said hollow interior comprising a shape corresponding to an exterior shape of the catheter connector in the open position, wherein at least a portion of the catheter connector is configured to fit within said housing when the catheter connector is in the open position such said insert maintains the catheter connector in the open position during packaging, shipping, and handling of the catheter connector.","7.The insert of claim 6, wherein the open position comprises the first half being rotated relative to the second half at an approximately 45-degree angle.","8.The insert of claim 6, wherein said insert further comprises one or more locking features configured to secure said insert at least partially around the exterior surface of the first half of the catheter connector.","9.The insert of claim 8, wherein said locking features comprise at least one of or a combination of the following: molded snaps, add-on grips, ridges, protrusions, or an adhesive.","10.The insert of claim 6, wherein said insert comprises rigid material.","11.The insert of claim 10, wherein said rigid material comprises at least one of or a combination of the following: a plastic material, polycarbonate, polypropylene, polyurethane, polyester, epoxy resins, phenolic resins, polyvinyl chloride (PVC), or metal."],[" BACKGROUND The use of catheters to deliver or withdraw fluids from a patient for various medical procedures is well known.","For example, U.S. Pat.","No.","7,959,623 describes a pain management system that uses various embodiments of infusion catheters to deliver fluid medication from a pump, through tubing, to a wound site.","With such configurations, catheter connectors are typically used to connect the catheter to various devices, such as tubing, a fluid reservoir or other fluid delivery device, and so forth.","In the system of the '623 patent, a conventional Tuohy-Borst connector is used to connect the distal end of a medical tube to the proximal end of the catheter.","In addition to Tuohy-Borst connectors, various other configurations of catheter connectors are available.","For example, Epimed International of Farmers Branch, Tex., U.S.A., manufactures a low profile twist-lock catheter connector known as the “Stingray™” connector.","This device has axially aligned halves that twist to an open position to allow insertion of the catheter in a first half, and subsequently twist to a closed position with an audible and tactile click that indicates complete engagement with the catheter.","The second half connects to a tube or other fluid delivery device for delivering fluid through the connector to the catheter.","Further, between the two halves is a molded bushing that includes an inner elastomeric tube that compresses and grips the catheter when the connector is in a closed position.","During packaging, shipping, and handling of the Stingray™ connector, as well as other connectors having a similar configuration, it is important for the connector to remain in an open position because, if the connector closes, the locking jaws will stay in the closed position and will not allow the catheter to be inserted therethrough.","More specifically, when the connector is in a closed position, the two halves push inward to squeeze the inner elastomeric tube over the catheter.","Since, the connector is typically made of a soft plastic, the molded bushing and inner elastomeric tube can lose their strength when in the closed position.","As such, even when the load is removed, the inner diameter of the elastomeric tube may be smaller, which can inhibit the catheter from being inserted easily therethrough.","Accordingly, an insert designed to keep a catheter connector, such as a Stingray™ connector, in the open position during packaging, shipping, and handling would be welcomed in the art."],[" SUMMARY OF THE INVENTION Objects and advantages of the invention will be set forth in part in the following description, or may be obvious from the description, or may be learned through practice of the invention.","In certain aspects, the present invention relates to a catheter connector assembly for use during packaging, shipping, and handling of a catheter connector.","The assembly includes a catheter connector having a body with a first half axially aligned with a second half.","The first half is rotatable relative to the second half between an open position and a closed position.","The first half defines a distal end of the body and the second half defines a proximal end of the body.","A proximal end port is configured with the proximal end of the second half for mating communication with a fluid delivery device.","An insert is configured with the body when the body is in the open position such that the insert maintains the catheter connector in the open position during packaging, shipping, and handling of the catheter connector.","In one embodiment, the insert is configured to fit within the first and second halves of the body when the first half is in the open position such that the insert maintains the catheter connector in the open position.","More specifically, in a particular embodiment, the insert may include a rod-shaped member configured to fit within the first and second halves when the first half is in the open position such that the insert maintains the catheter connector in the open position.","In addition, the insert may also include a tab member configured with the rod-shaped member.","The tab member is configured to extend outside of the catheter connector when the rod-shaped member is inserted within the first and second halves of the body.","As such, the tab member is configured to assist a user with removing the insert from the catheter connector.","In additional embodiments, the open position is defined by the first half being rotated relative to the second half at an approximately 45-degree angle.","In another embodiment, the insert may be configured to fit at least partially around an exterior surface of the body of the connector when the body is in the open position such that the insert maintains the catheter connector in the open position.","More specifically, in a particular embodiment, the insert may further include a housing having a hollow interior.","The hollow interior has a shape that corresponds to an exterior shape of the catheter connector in the open position.","Thus, at least a portion of the catheter connector is configured to fit within the housing of the insert when the catheter connector is in the open position such the insert maintains the catheter connector in the open position during packaging, shipping, and handling.","In such an embodiment, the insert may also include one or more locking features configured to secure the insert at least partially around the exterior surface of the connector.","For example, in various embodiments, the locking features may include at least one of or a combination of the following: molded snaps, add-on grips, ridges, protrusions, an adhesive, or similar.","In additional embodiments, the insert may be constructed of a rigid material.","In various embodiments, the rigid material includes at least one of or a combination of the following: a plastic material, polycarbonate, polypropylene, polyurethane, polyester, epoxy resins, phenolic resins, polyvinyl chloride (PVC), a metal, or any other rigid or semi-rigid material.","In further aspects, the present invention relates to an insert for a catheter connector for use during packaging, shipping, and handling of the catheter connector.","The insert includes a rod-shaped member configured to fit within the catheter connector.","The catheter connector has a body with a first half axially aligned with a second half.","The first half is rotatable relative to the second half between an open position and a closed position.","Thus, the rod-shaped member is configured to fit within the first and second halves when the catheter connector is in the open position such that the insert maintains the catheter connector in the open position during packaging, shipping, and handling of the catheter connector.","It should be understood that the insert may also include any of the additional features as described herein.","In still additional aspects, the present invention relates to an insert for a catheter connector for use during packaging, shipping, and handling of the catheter connector.","The insert includes a housing configured to fit at least partially around an exterior surface of the catheter connector.","Further, the catheter connector has a body with a first half axially aligned with a second half.","The first half is rotatable relative to the second half between an open position and a closed position.","The housing includes a hollow interior having a shape that corresponds to an exterior shape of the catheter connector in the open position.","Thus, at least a portion of the catheter connector is configured to fit within the housing of the insert when in the open position such the insert maintains the catheter connector in the open position during packaging, shipping, and handling of the catheter connector.","It should be understood that the insert may also include any of the additional features as described herein.","These and other features, aspects and advantages of the present invention will become better understood with reference to the following description and appended claims.","The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate embodiments of the invention and, together with the description, serve to explain the principles of the invention."],["RELATED APPLICATIONS The present application is a divisional of and claims priority to U.S. application Ser.","No.","14/279,969 filed on May 16, 2014, which is incorporated herein in its entirety by reference hereto.","FIELD OF THE INVENTION The present invention relates generally to the field of medical catheters and more particularly to inserts for catheter connectors for using during packaging, shipping, and handling.","BACKGROUND The use of catheters to deliver or withdraw fluids from a patient for various medical procedures is well known.","For example, U.S. Pat.","No.","7,959,623 describes a pain management system that uses various embodiments of infusion catheters to deliver fluid medication from a pump, through tubing, to a wound site.","With such configurations, catheter connectors are typically used to connect the catheter to various devices, such as tubing, a fluid reservoir or other fluid delivery device, and so forth.","In the system of the '623 patent, a conventional Tuohy-Borst connector is used to connect the distal end of a medical tube to the proximal end of the catheter.","In addition to Tuohy-Borst connectors, various other configurations of catheter connectors are available.","For example, Epimed International of Farmers Branch, Tex., U.S.A., manufactures a low profile twist-lock catheter connector known as the “Stingray™” connector.","This device has axially aligned halves that twist to an open position to allow insertion of the catheter in a first half, and subsequently twist to a closed position with an audible and tactile click that indicates complete engagement with the catheter.","The second half connects to a tube or other fluid delivery device for delivering fluid through the connector to the catheter.","Further, between the two halves is a molded bushing that includes an inner elastomeric tube that compresses and grips the catheter when the connector is in a closed position.","During packaging, shipping, and handling of the Stingray™ connector, as well as other connectors having a similar configuration, it is important for the connector to remain in an open position because, if the connector closes, the locking jaws will stay in the closed position and will not allow the catheter to be inserted therethrough.","More specifically, when the connector is in a closed position, the two halves push inward to squeeze the inner elastomeric tube over the catheter.","Since, the connector is typically made of a soft plastic, the molded bushing and inner elastomeric tube can lose their strength when in the closed position.","As such, even when the load is removed, the inner diameter of the elastomeric tube may be smaller, which can inhibit the catheter from being inserted easily therethrough.","Accordingly, an insert designed to keep a catheter connector, such as a Stingray™ connector, in the open position during packaging, shipping, and handling would be welcomed in the art.","SUMMARY OF THE INVENTION Objects and advantages of the invention will be set forth in part in the following description, or may be obvious from the description, or may be learned through practice of the invention.","In certain aspects, the present invention relates to a catheter connector assembly for use during packaging, shipping, and handling of a catheter connector.","The assembly includes a catheter connector having a body with a first half axially aligned with a second half.","The first half is rotatable relative to the second half between an open position and a closed position.","The first half defines a distal end of the body and the second half defines a proximal end of the body.","A proximal end port is configured with the proximal end of the second half for mating communication with a fluid delivery device.","An insert is configured with the body when the body is in the open position such that the insert maintains the catheter connector in the open position during packaging, shipping, and handling of the catheter connector.","In one embodiment, the insert is configured to fit within the first and second halves of the body when the first half is in the open position such that the insert maintains the catheter connector in the open position.","More specifically, in a particular embodiment, the insert may include a rod-shaped member configured to fit within the first and second halves when the first half is in the open position such that the insert maintains the catheter connector in the open position.","In addition, the insert may also include a tab member configured with the rod-shaped member.","The tab member is configured to extend outside of the catheter connector when the rod-shaped member is inserted within the first and second halves of the body.","As such, the tab member is configured to assist a user with removing the insert from the catheter connector.","In additional embodiments, the open position is defined by the first half being rotated relative to the second half at an approximately 45-degree angle.","In another embodiment, the insert may be configured to fit at least partially around an exterior surface of the body of the connector when the body is in the open position such that the insert maintains the catheter connector in the open position.","More specifically, in a particular embodiment, the insert may further include a housing having a hollow interior.","The hollow interior has a shape that corresponds to an exterior shape of the catheter connector in the open position.","Thus, at least a portion of the catheter connector is configured to fit within the housing of the insert when the catheter connector is in the open position such the insert maintains the catheter connector in the open position during packaging, shipping, and handling.","In such an embodiment, the insert may also include one or more locking features configured to secure the insert at least partially around the exterior surface of the connector.","For example, in various embodiments, the locking features may include at least one of or a combination of the following: molded snaps, add-on grips, ridges, protrusions, an adhesive, or similar.","In additional embodiments, the insert may be constructed of a rigid material.","In various embodiments, the rigid material includes at least one of or a combination of the following: a plastic material, polycarbonate, polypropylene, polyurethane, polyester, epoxy resins, phenolic resins, polyvinyl chloride (PVC), a metal, or any other rigid or semi-rigid material.","In further aspects, the present invention relates to an insert for a catheter connector for use during packaging, shipping, and handling of the catheter connector.","The insert includes a rod-shaped member configured to fit within the catheter connector.","The catheter connector has a body with a first half axially aligned with a second half.","The first half is rotatable relative to the second half between an open position and a closed position.","Thus, the rod-shaped member is configured to fit within the first and second halves when the catheter connector is in the open position such that the insert maintains the catheter connector in the open position during packaging, shipping, and handling of the catheter connector.","It should be understood that the insert may also include any of the additional features as described herein.","In still additional aspects, the present invention relates to an insert for a catheter connector for use during packaging, shipping, and handling of the catheter connector.","The insert includes a housing configured to fit at least partially around an exterior surface of the catheter connector.","Further, the catheter connector has a body with a first half axially aligned with a second half.","The first half is rotatable relative to the second half between an open position and a closed position.","The housing includes a hollow interior having a shape that corresponds to an exterior shape of the catheter connector in the open position.","Thus, at least a portion of the catheter connector is configured to fit within the housing of the insert when in the open position such the insert maintains the catheter connector in the open position during packaging, shipping, and handling of the catheter connector.","It should be understood that the insert may also include any of the additional features as described herein.","These and other features, aspects and advantages of the present invention will become better understood with reference to the following description and appended claims.","The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate embodiments of the invention and, together with the description, serve to explain the principles of the invention.","BRIEF DESCRIPTION OF THE DRAWINGS FIG.","1 illustrates a perspective view of one embodiment of a catheter connector of conventional construction in a closed position; FIG.","2 illustrates a perspective view of the catheter connector of FIG.","1 in an open position; FIG.","3 illustrates a perspective view of the catheter connector of FIG.","1 separated into two halves to illustrate various internal components of the connector; FIG.","4 illustrates a perspective view of one embodiment of an insert for a catheter connector in accordance with aspects of the invention; FIG.","5 illustrates a perspective view of one embodiment of the insert of FIG.","4 configured with a catheter connector in accordance with aspects of the invention; FIG.","6 illustrates a perspective view of another embodiment of an insert for a catheter connector in accordance with aspects of the invention; and FIG.","7 illustrates a perspective view of one embodiment of the insert of FIG.","6 configured with a catheter connector in accordance with aspects of the invention.","DETAILED DESCRIPTION OF THE INVENTION Reference will now be made in detail to one or more embodiments of the invention, examples of the invention, examples of which are illustrated in the drawings.","Each example and embodiment is provided by way of explanation of the invention, and is not meant as a limitation of the invention.","For example, features illustrated or described as part of one embodiment may be used with another embodiment to yield still a further embodiment.","It is intended that the invention include these and other modifications and variations as coming within the scope and spirit of the invention.","The positional terms “proximal” and “distal” are used herein to orient the various components relative to each other and to the patient.","“Distal” refers to the direction that is closest to the wound site (e.g., the distal end of the connector is the end oriented towards a catheter insertion site), and “proximal” refers to the opposite direction (e.g., the proximal end of the catheter is inserted into the distal end of the connector).","Generally, the present disclosure is directed to a catheter connector assembly having an insert that maintains a catheter connector in an open position during packaging, shipping, and handling.","More specifically, the assembly includes a catheter connector, e.g.","a Stingray™ connector, having a body with a first half axially aligned with a second half.","The first half is rotatable relative to the second half between an open position and a closed position.","The first half defines a distal end of the body and the second half defines a proximal end of the body.","A proximal end port is configured with the proximal end of the second half for mating communication with a fluid delivery device.","The insert is configured with the body when the body is in the open position such that the insert maintains the catheter connector in the open position during packaging, shipping, and handling of the catheter connector.","The present disclosure has many advantages not present in the prior art.","For example, the insert provides a simple, easy-to-use component that maintains a catheter connector in an open position during packaging, shipping, and handling.","As such, the internal components of the catheter connector are not compromised before being used for a patient.","In addition, the insert is relatively inexpensive to manufacture and can be used in conjunction with many catheter connectors, such as the Stingray™ connector as described herein.","Referring now to the drawings, FIGS.","1-3 illustrate various views of one embodiment of a catheter connector 10 that can be used in conjunction with the insert of the present disclosure.","As shown, the catheter connector 10 includes a body 16 having a proximal end 18 and distal end 20.The body 16 has a first half 22 axially aligned with a second half 24.The first half 22 defines a distal end 20 of the body 16 and the second half 24 defines a proximal end 18 of the body 16.A proximal end port 14 is configured with the proximal end 18 of the second half 24 for mating communication with a fluid delivery device (not shown).","As mentioned, the fluid delivery device may be any suitable device known in the art, such as a pump, reservoir, syringe, or the like.","Further, the proximal end port 14 may have any conventional configuration, such as a Luer-lock fitting.","The first half 22 is rotatable relative to the second half 24 between an open position (FIG.","2) and a closed position (FIG.","1).","More specifically, as shown in FIG.","3, the first half 22 may include a bushing 25 extending from an interior surface 23 thereof.","In certain embodiments, an elastomeric tube 27 may be configured within the bushing 25.Further, the second half 24 may include a corresponding cavity 29 configured to receive the bushing 25 therein.","Thus, the axially aligned halves 22, 24 of the connector 10 are configured to twist to the open position (FIG.","2) to allow insertion of a catheter through a catheter insertion hole 15 in the first half 22, and subsequently twist to a closed position (FIG.","1) with an audible and tactile click that indicates complete engagement with the catheter.","More specifically, the elastomeric tube 27 within the bushing 25 compresses and grips the catheter when the connector 10 is in the closed position (FIG.","1).","In certain embodiments, the open position is defined by the first half 22 being rotated relative to the second half 24 at an approximately 45-degree angle.","In further embodiments, the first half 22 may be rotated to any suitable angle relative to the second half 24.Referring to FIG.","4, one embodiment of an insert 26 configured to maintain the catheter connector 10 of FIGS.","1-3 in an open position during packaging, shipping, and handling is illustrated.","As shown, the insert 26 includes a rod-shaped member 28 and a tab member 30.The rod-shaped member 28 has proximal end 31 and a distal end 33.Further, the rod-shaped member 28 is shaped such that the proximal end 31 can be inserted through the catheter connector 10 when the connector 10 is in an open position.","For example, in one embodiment, the rod-shaped member 28 may have a substantially circular cross-section so as to correspond with the cross-sectional shape of a catheter.","Thus, as shown in FIG.","5, a portion of the rod-shaped member 28 may be inserted through the first and second halves 22, 24 of the catheter connector 10 through the catheter insertion hole 15 so as to maintain the connector 10 in an open position.","In addition, as shown, the tab member 30 is configured with the distal end 33 of the rod-shaped member 28 such that the tab member 30 extends outside of the distal end 20 of the catheter connector 10 when the rod-shaped member 28 is inserted within the first and second halves 22, 24 of the connector 10.Thus, the tab member 30 is configured to assist a user with removing the insert 26 from within the catheter connector 10 (e.g.","after the connector 10 has been shipping and is ready to be used with a catheter that is inserted into a patient).","Referring now to FIG.","6, another embodiment of an insert 46 configured to maintain the catheter connector 10 of FIGS.","1-3 in an open position during packaging, shipping, and handling is illustrated.","As shown, the insert 46 is configured to fit at least partially around an exterior surface of the body 16 of the connector 10 when the body 16 is in the open position such that the insert 46 maintains the catheter connector 10 in the open position.","For instance, as shown in the illustrated embodiment, the insert 46 includes a housing 32 having a hollow interior 34 that is shaped so as to correspond to an exterior shape of the catheter connector 10 when the connector 10 is in the open position.","More specifically, in certain embodiments, the housing 32 includes a plurality of compartments 38 that correspond to the rotated first and second halves 22, 24 in the open position.","Thus, as shown in FIG.","7, at least a portion of the catheter connector 10 is configured to fit within the housing 32 when the connector 10 is in the open position such that the insert 46 maintains the catheter connector 10 in the open position during packaging, shipping, and handling.","Still referring to FIGS.","6 and 7, the insert 46 may also include one or more locking features 36 configured to secure the insert 46 at least partially around the exterior surface of the body 16 of the connector 10.For example, in certain embodiments, the locking features 36 may include any one of or combination of the following: molded snaps, add-on grips, ridges, protrusions, an adhesive, or similar.","It should also be understood that the inserts 26, 46 as described herein may be constructed of any suitable material.","For example, in certain embodiments, the inserts 26, 46 may be constructed of a rigid or semi-rigid material, such as a metal or a hard plastic.","More specifically, the inserts 26, 46 may be constructed of polypropylene, polycarbonate, polyurethane, polyester, epoxy resins, phenolic resins, polyvinyl chloride (PVC), or any other suitable polymer material.","In addition, the inserts 26, 46 may be constructed of aluminum, copper, stainless steel, or any other suitable metal.","In some embodiments, the inserts 26, 46 may also be constructed of a flexible or semi-flexible material, such as a rubber material, a polymeric material, a silicone material, an elastomeric material, or similar.","More specifically, in various embodiments, the inserts 26, 46 may be constructed of polyisoprene, polyurethane, styrene butadiene, and/or any other suitable flexible material.","While the present invention has been described in connection with certain preferred embodiments it is to be understood that the subject matter encompassed by way of the present invention is not to be limited to those specific embodiments.","On the contrary, it is intended for the subject matter of the invention to include all alternatives, modifications and equivalents as can be included within the spirit and scope of the following claims."]],"string":"[\n [\n \"Catheter Connector Insert\",\n \"The present invention relates to a catheter connector assembly having an insert for use during packaging, shipping, and handling of a catheter connector.\",\n \"The assembly includes a catheter connector having a body with a first half axially aligned with a second half.\",\n \"The first half is rotatable relative to the second half between an open position and a closed position.\",\n \"The first half defines a distal end of the body and the second half defines a proximal end of the body.\",\n \"A proximal end port is configured with the proximal end of the second half for mating communication with a fluid delivery device.\",\n \"The insert is configured with the body when the body is in the open position such that the insert maintains the catheter connector in the open position during packaging, shipping, and handling of the catheter connector.\"\n ],\n [\n \"1.An insert for a catheter connector for use during packaging, shipping, and handling of the catheter connector, said insert comprising: a rod-shaped member configured to fit within the catheter connector, the catheter connector having a body with a first half axially aligned with a second half, the first half rotatable relative to the second half between an open position and a closed position, the rod-shaped member configured to fit within the first and second halves when the catheter connector is in the open position such that said insert maintains the catheter connector in the open position during packaging, shipping, and handling of the catheter connector.\",\n \"2.The insert of claim 1, further comprising a tab member configured with said rod-shaped member, said tab member extending outside of the catheter connector when said rod-shaped member is inserted within the first and second halves of the catheter connector, said tab member configured to assist a user with removing said insert from the catheter connector.\",\n \"3.The insert of claim 1, wherein the open position comprises the first half being rotated relative to the second half at an approximately 45-degree angle.\",\n \"4.The insert of claim 1, wherein said insert comprises a rigid material.\",\n \"5.The insert of claim 4, wherein said rigid material comprises at least one of or a combination of the following: a plastic material, polycarbonate, polypropylene, polyurethane, polyester, epoxy resins, phenolic resins, polyvinyl chloride (PVC), or metal.\",\n \"6.An insert for a catheter connector for use during packaging, shipping, and handling of the catheter connector, said insert comprising: a housing configured to fit at least partially around an exterior surface of the catheter connector, the catheter connector having a body with a first half axially aligned with a second half, the first half rotatable relative to the second half between an open position and a closed position, said housing comprising a hollow interior, said hollow interior comprising a shape corresponding to an exterior shape of the catheter connector in the open position, wherein at least a portion of the catheter connector is configured to fit within said housing when the catheter connector is in the open position such said insert maintains the catheter connector in the open position during packaging, shipping, and handling of the catheter connector.\",\n \"7.The insert of claim 6, wherein the open position comprises the first half being rotated relative to the second half at an approximately 45-degree angle.\",\n \"8.The insert of claim 6, wherein said insert further comprises one or more locking features configured to secure said insert at least partially around the exterior surface of the first half of the catheter connector.\",\n \"9.The insert of claim 8, wherein said locking features comprise at least one of or a combination of the following: molded snaps, add-on grips, ridges, protrusions, or an adhesive.\",\n \"10.The insert of claim 6, wherein said insert comprises rigid material.\",\n \"11.The insert of claim 10, wherein said rigid material comprises at least one of or a combination of the following: a plastic material, polycarbonate, polypropylene, polyurethane, polyester, epoxy resins, phenolic resins, polyvinyl chloride (PVC), or metal.\"\n ],\n [\n \" BACKGROUND The use of catheters to deliver or withdraw fluids from a patient for various medical procedures is well known.\",\n \"For example, U.S. Pat.\",\n \"No.\",\n \"7,959,623 describes a pain management system that uses various embodiments of infusion catheters to deliver fluid medication from a pump, through tubing, to a wound site.\",\n \"With such configurations, catheter connectors are typically used to connect the catheter to various devices, such as tubing, a fluid reservoir or other fluid delivery device, and so forth.\",\n \"In the system of the '623 patent, a conventional Tuohy-Borst connector is used to connect the distal end of a medical tube to the proximal end of the catheter.\",\n \"In addition to Tuohy-Borst connectors, various other configurations of catheter connectors are available.\",\n \"For example, Epimed International of Farmers Branch, Tex., U.S.A., manufactures a low profile twist-lock catheter connector known as the “Stingray™” connector.\",\n \"This device has axially aligned halves that twist to an open position to allow insertion of the catheter in a first half, and subsequently twist to a closed position with an audible and tactile click that indicates complete engagement with the catheter.\",\n \"The second half connects to a tube or other fluid delivery device for delivering fluid through the connector to the catheter.\",\n \"Further, between the two halves is a molded bushing that includes an inner elastomeric tube that compresses and grips the catheter when the connector is in a closed position.\",\n \"During packaging, shipping, and handling of the Stingray™ connector, as well as other connectors having a similar configuration, it is important for the connector to remain in an open position because, if the connector closes, the locking jaws will stay in the closed position and will not allow the catheter to be inserted therethrough.\",\n \"More specifically, when the connector is in a closed position, the two halves push inward to squeeze the inner elastomeric tube over the catheter.\",\n \"Since, the connector is typically made of a soft plastic, the molded bushing and inner elastomeric tube can lose their strength when in the closed position.\",\n \"As such, even when the load is removed, the inner diameter of the elastomeric tube may be smaller, which can inhibit the catheter from being inserted easily therethrough.\",\n \"Accordingly, an insert designed to keep a catheter connector, such as a Stingray™ connector, in the open position during packaging, shipping, and handling would be welcomed in the art.\"\n ],\n [\n \" SUMMARY OF THE INVENTION Objects and advantages of the invention will be set forth in part in the following description, or may be obvious from the description, or may be learned through practice of the invention.\",\n \"In certain aspects, the present invention relates to a catheter connector assembly for use during packaging, shipping, and handling of a catheter connector.\",\n \"The assembly includes a catheter connector having a body with a first half axially aligned with a second half.\",\n \"The first half is rotatable relative to the second half between an open position and a closed position.\",\n \"The first half defines a distal end of the body and the second half defines a proximal end of the body.\",\n \"A proximal end port is configured with the proximal end of the second half for mating communication with a fluid delivery device.\",\n \"An insert is configured with the body when the body is in the open position such that the insert maintains the catheter connector in the open position during packaging, shipping, and handling of the catheter connector.\",\n \"In one embodiment, the insert is configured to fit within the first and second halves of the body when the first half is in the open position such that the insert maintains the catheter connector in the open position.\",\n \"More specifically, in a particular embodiment, the insert may include a rod-shaped member configured to fit within the first and second halves when the first half is in the open position such that the insert maintains the catheter connector in the open position.\",\n \"In addition, the insert may also include a tab member configured with the rod-shaped member.\",\n \"The tab member is configured to extend outside of the catheter connector when the rod-shaped member is inserted within the first and second halves of the body.\",\n \"As such, the tab member is configured to assist a user with removing the insert from the catheter connector.\",\n \"In additional embodiments, the open position is defined by the first half being rotated relative to the second half at an approximately 45-degree angle.\",\n \"In another embodiment, the insert may be configured to fit at least partially around an exterior surface of the body of the connector when the body is in the open position such that the insert maintains the catheter connector in the open position.\",\n \"More specifically, in a particular embodiment, the insert may further include a housing having a hollow interior.\",\n \"The hollow interior has a shape that corresponds to an exterior shape of the catheter connector in the open position.\",\n \"Thus, at least a portion of the catheter connector is configured to fit within the housing of the insert when the catheter connector is in the open position such the insert maintains the catheter connector in the open position during packaging, shipping, and handling.\",\n \"In such an embodiment, the insert may also include one or more locking features configured to secure the insert at least partially around the exterior surface of the connector.\",\n \"For example, in various embodiments, the locking features may include at least one of or a combination of the following: molded snaps, add-on grips, ridges, protrusions, an adhesive, or similar.\",\n \"In additional embodiments, the insert may be constructed of a rigid material.\",\n \"In various embodiments, the rigid material includes at least one of or a combination of the following: a plastic material, polycarbonate, polypropylene, polyurethane, polyester, epoxy resins, phenolic resins, polyvinyl chloride (PVC), a metal, or any other rigid or semi-rigid material.\",\n \"In further aspects, the present invention relates to an insert for a catheter connector for use during packaging, shipping, and handling of the catheter connector.\",\n \"The insert includes a rod-shaped member configured to fit within the catheter connector.\",\n \"The catheter connector has a body with a first half axially aligned with a second half.\",\n \"The first half is rotatable relative to the second half between an open position and a closed position.\",\n \"Thus, the rod-shaped member is configured to fit within the first and second halves when the catheter connector is in the open position such that the insert maintains the catheter connector in the open position during packaging, shipping, and handling of the catheter connector.\",\n \"It should be understood that the insert may also include any of the additional features as described herein.\",\n \"In still additional aspects, the present invention relates to an insert for a catheter connector for use during packaging, shipping, and handling of the catheter connector.\",\n \"The insert includes a housing configured to fit at least partially around an exterior surface of the catheter connector.\",\n \"Further, the catheter connector has a body with a first half axially aligned with a second half.\",\n \"The first half is rotatable relative to the second half between an open position and a closed position.\",\n \"The housing includes a hollow interior having a shape that corresponds to an exterior shape of the catheter connector in the open position.\",\n \"Thus, at least a portion of the catheter connector is configured to fit within the housing of the insert when in the open position such the insert maintains the catheter connector in the open position during packaging, shipping, and handling of the catheter connector.\",\n \"It should be understood that the insert may also include any of the additional features as described herein.\",\n \"These and other features, aspects and advantages of the present invention will become better understood with reference to the following description and appended claims.\",\n \"The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate embodiments of the invention and, together with the description, serve to explain the principles of the invention.\"\n ],\n [\n \"RELATED APPLICATIONS The present application is a divisional of and claims priority to U.S. application Ser.\",\n \"No.\",\n \"14/279,969 filed on May 16, 2014, which is incorporated herein in its entirety by reference hereto.\",\n \"FIELD OF THE INVENTION The present invention relates generally to the field of medical catheters and more particularly to inserts for catheter connectors for using during packaging, shipping, and handling.\",\n \"BACKGROUND The use of catheters to deliver or withdraw fluids from a patient for various medical procedures is well known.\",\n \"For example, U.S. Pat.\",\n \"No.\",\n \"7,959,623 describes a pain management system that uses various embodiments of infusion catheters to deliver fluid medication from a pump, through tubing, to a wound site.\",\n \"With such configurations, catheter connectors are typically used to connect the catheter to various devices, such as tubing, a fluid reservoir or other fluid delivery device, and so forth.\",\n \"In the system of the '623 patent, a conventional Tuohy-Borst connector is used to connect the distal end of a medical tube to the proximal end of the catheter.\",\n \"In addition to Tuohy-Borst connectors, various other configurations of catheter connectors are available.\",\n \"For example, Epimed International of Farmers Branch, Tex., U.S.A., manufactures a low profile twist-lock catheter connector known as the “Stingray™” connector.\",\n \"This device has axially aligned halves that twist to an open position to allow insertion of the catheter in a first half, and subsequently twist to a closed position with an audible and tactile click that indicates complete engagement with the catheter.\",\n \"The second half connects to a tube or other fluid delivery device for delivering fluid through the connector to the catheter.\",\n \"Further, between the two halves is a molded bushing that includes an inner elastomeric tube that compresses and grips the catheter when the connector is in a closed position.\",\n \"During packaging, shipping, and handling of the Stingray™ connector, as well as other connectors having a similar configuration, it is important for the connector to remain in an open position because, if the connector closes, the locking jaws will stay in the closed position and will not allow the catheter to be inserted therethrough.\",\n \"More specifically, when the connector is in a closed position, the two halves push inward to squeeze the inner elastomeric tube over the catheter.\",\n \"Since, the connector is typically made of a soft plastic, the molded bushing and inner elastomeric tube can lose their strength when in the closed position.\",\n \"As such, even when the load is removed, the inner diameter of the elastomeric tube may be smaller, which can inhibit the catheter from being inserted easily therethrough.\",\n \"Accordingly, an insert designed to keep a catheter connector, such as a Stingray™ connector, in the open position during packaging, shipping, and handling would be welcomed in the art.\",\n \"SUMMARY OF THE INVENTION Objects and advantages of the invention will be set forth in part in the following description, or may be obvious from the description, or may be learned through practice of the invention.\",\n \"In certain aspects, the present invention relates to a catheter connector assembly for use during packaging, shipping, and handling of a catheter connector.\",\n \"The assembly includes a catheter connector having a body with a first half axially aligned with a second half.\",\n \"The first half is rotatable relative to the second half between an open position and a closed position.\",\n \"The first half defines a distal end of the body and the second half defines a proximal end of the body.\",\n \"A proximal end port is configured with the proximal end of the second half for mating communication with a fluid delivery device.\",\n \"An insert is configured with the body when the body is in the open position such that the insert maintains the catheter connector in the open position during packaging, shipping, and handling of the catheter connector.\",\n \"In one embodiment, the insert is configured to fit within the first and second halves of the body when the first half is in the open position such that the insert maintains the catheter connector in the open position.\",\n \"More specifically, in a particular embodiment, the insert may include a rod-shaped member configured to fit within the first and second halves when the first half is in the open position such that the insert maintains the catheter connector in the open position.\",\n \"In addition, the insert may also include a tab member configured with the rod-shaped member.\",\n \"The tab member is configured to extend outside of the catheter connector when the rod-shaped member is inserted within the first and second halves of the body.\",\n \"As such, the tab member is configured to assist a user with removing the insert from the catheter connector.\",\n \"In additional embodiments, the open position is defined by the first half being rotated relative to the second half at an approximately 45-degree angle.\",\n \"In another embodiment, the insert may be configured to fit at least partially around an exterior surface of the body of the connector when the body is in the open position such that the insert maintains the catheter connector in the open position.\",\n \"More specifically, in a particular embodiment, the insert may further include a housing having a hollow interior.\",\n \"The hollow interior has a shape that corresponds to an exterior shape of the catheter connector in the open position.\",\n \"Thus, at least a portion of the catheter connector is configured to fit within the housing of the insert when the catheter connector is in the open position such the insert maintains the catheter connector in the open position during packaging, shipping, and handling.\",\n \"In such an embodiment, the insert may also include one or more locking features configured to secure the insert at least partially around the exterior surface of the connector.\",\n \"For example, in various embodiments, the locking features may include at least one of or a combination of the following: molded snaps, add-on grips, ridges, protrusions, an adhesive, or similar.\",\n \"In additional embodiments, the insert may be constructed of a rigid material.\",\n \"In various embodiments, the rigid material includes at least one of or a combination of the following: a plastic material, polycarbonate, polypropylene, polyurethane, polyester, epoxy resins, phenolic resins, polyvinyl chloride (PVC), a metal, or any other rigid or semi-rigid material.\",\n \"In further aspects, the present invention relates to an insert for a catheter connector for use during packaging, shipping, and handling of the catheter connector.\",\n \"The insert includes a rod-shaped member configured to fit within the catheter connector.\",\n \"The catheter connector has a body with a first half axially aligned with a second half.\",\n \"The first half is rotatable relative to the second half between an open position and a closed position.\",\n \"Thus, the rod-shaped member is configured to fit within the first and second halves when the catheter connector is in the open position such that the insert maintains the catheter connector in the open position during packaging, shipping, and handling of the catheter connector.\",\n \"It should be understood that the insert may also include any of the additional features as described herein.\",\n \"In still additional aspects, the present invention relates to an insert for a catheter connector for use during packaging, shipping, and handling of the catheter connector.\",\n \"The insert includes a housing configured to fit at least partially around an exterior surface of the catheter connector.\",\n \"Further, the catheter connector has a body with a first half axially aligned with a second half.\",\n \"The first half is rotatable relative to the second half between an open position and a closed position.\",\n \"The housing includes a hollow interior having a shape that corresponds to an exterior shape of the catheter connector in the open position.\",\n \"Thus, at least a portion of the catheter connector is configured to fit within the housing of the insert when in the open position such the insert maintains the catheter connector in the open position during packaging, shipping, and handling of the catheter connector.\",\n \"It should be understood that the insert may also include any of the additional features as described herein.\",\n \"These and other features, aspects and advantages of the present invention will become better understood with reference to the following description and appended claims.\",\n \"The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate embodiments of the invention and, together with the description, serve to explain the principles of the invention.\",\n \"BRIEF DESCRIPTION OF THE DRAWINGS FIG.\",\n \"1 illustrates a perspective view of one embodiment of a catheter connector of conventional construction in a closed position; FIG.\",\n \"2 illustrates a perspective view of the catheter connector of FIG.\",\n \"1 in an open position; FIG.\",\n \"3 illustrates a perspective view of the catheter connector of FIG.\",\n \"1 separated into two halves to illustrate various internal components of the connector; FIG.\",\n \"4 illustrates a perspective view of one embodiment of an insert for a catheter connector in accordance with aspects of the invention; FIG.\",\n \"5 illustrates a perspective view of one embodiment of the insert of FIG.\",\n \"4 configured with a catheter connector in accordance with aspects of the invention; FIG.\",\n \"6 illustrates a perspective view of another embodiment of an insert for a catheter connector in accordance with aspects of the invention; and FIG.\",\n \"7 illustrates a perspective view of one embodiment of the insert of FIG.\",\n \"6 configured with a catheter connector in accordance with aspects of the invention.\",\n \"DETAILED DESCRIPTION OF THE INVENTION Reference will now be made in detail to one or more embodiments of the invention, examples of the invention, examples of which are illustrated in the drawings.\",\n \"Each example and embodiment is provided by way of explanation of the invention, and is not meant as a limitation of the invention.\",\n \"For example, features illustrated or described as part of one embodiment may be used with another embodiment to yield still a further embodiment.\",\n \"It is intended that the invention include these and other modifications and variations as coming within the scope and spirit of the invention.\",\n \"The positional terms “proximal” and “distal” are used herein to orient the various components relative to each other and to the patient.\",\n \"“Distal” refers to the direction that is closest to the wound site (e.g., the distal end of the connector is the end oriented towards a catheter insertion site), and “proximal” refers to the opposite direction (e.g., the proximal end of the catheter is inserted into the distal end of the connector).\",\n \"Generally, the present disclosure is directed to a catheter connector assembly having an insert that maintains a catheter connector in an open position during packaging, shipping, and handling.\",\n \"More specifically, the assembly includes a catheter connector, e.g.\",\n \"a Stingray™ connector, having a body with a first half axially aligned with a second half.\",\n \"The first half is rotatable relative to the second half between an open position and a closed position.\",\n \"The first half defines a distal end of the body and the second half defines a proximal end of the body.\",\n \"A proximal end port is configured with the proximal end of the second half for mating communication with a fluid delivery device.\",\n \"The insert is configured with the body when the body is in the open position such that the insert maintains the catheter connector in the open position during packaging, shipping, and handling of the catheter connector.\",\n \"The present disclosure has many advantages not present in the prior art.\",\n \"For example, the insert provides a simple, easy-to-use component that maintains a catheter connector in an open position during packaging, shipping, and handling.\",\n \"As such, the internal components of the catheter connector are not compromised before being used for a patient.\",\n \"In addition, the insert is relatively inexpensive to manufacture and can be used in conjunction with many catheter connectors, such as the Stingray™ connector as described herein.\",\n \"Referring now to the drawings, FIGS.\",\n \"1-3 illustrate various views of one embodiment of a catheter connector 10 that can be used in conjunction with the insert of the present disclosure.\",\n \"As shown, the catheter connector 10 includes a body 16 having a proximal end 18 and distal end 20.The body 16 has a first half 22 axially aligned with a second half 24.The first half 22 defines a distal end 20 of the body 16 and the second half 24 defines a proximal end 18 of the body 16.A proximal end port 14 is configured with the proximal end 18 of the second half 24 for mating communication with a fluid delivery device (not shown).\",\n \"As mentioned, the fluid delivery device may be any suitable device known in the art, such as a pump, reservoir, syringe, or the like.\",\n \"Further, the proximal end port 14 may have any conventional configuration, such as a Luer-lock fitting.\",\n \"The first half 22 is rotatable relative to the second half 24 between an open position (FIG.\",\n \"2) and a closed position (FIG.\",\n \"1).\",\n \"More specifically, as shown in FIG.\",\n \"3, the first half 22 may include a bushing 25 extending from an interior surface 23 thereof.\",\n \"In certain embodiments, an elastomeric tube 27 may be configured within the bushing 25.Further, the second half 24 may include a corresponding cavity 29 configured to receive the bushing 25 therein.\",\n \"Thus, the axially aligned halves 22, 24 of the connector 10 are configured to twist to the open position (FIG.\",\n \"2) to allow insertion of a catheter through a catheter insertion hole 15 in the first half 22, and subsequently twist to a closed position (FIG.\",\n \"1) with an audible and tactile click that indicates complete engagement with the catheter.\",\n \"More specifically, the elastomeric tube 27 within the bushing 25 compresses and grips the catheter when the connector 10 is in the closed position (FIG.\",\n \"1).\",\n \"In certain embodiments, the open position is defined by the first half 22 being rotated relative to the second half 24 at an approximately 45-degree angle.\",\n \"In further embodiments, the first half 22 may be rotated to any suitable angle relative to the second half 24.Referring to FIG.\",\n \"4, one embodiment of an insert 26 configured to maintain the catheter connector 10 of FIGS.\",\n \"1-3 in an open position during packaging, shipping, and handling is illustrated.\",\n \"As shown, the insert 26 includes a rod-shaped member 28 and a tab member 30.The rod-shaped member 28 has proximal end 31 and a distal end 33.Further, the rod-shaped member 28 is shaped such that the proximal end 31 can be inserted through the catheter connector 10 when the connector 10 is in an open position.\",\n \"For example, in one embodiment, the rod-shaped member 28 may have a substantially circular cross-section so as to correspond with the cross-sectional shape of a catheter.\",\n \"Thus, as shown in FIG.\",\n \"5, a portion of the rod-shaped member 28 may be inserted through the first and second halves 22, 24 of the catheter connector 10 through the catheter insertion hole 15 so as to maintain the connector 10 in an open position.\",\n \"In addition, as shown, the tab member 30 is configured with the distal end 33 of the rod-shaped member 28 such that the tab member 30 extends outside of the distal end 20 of the catheter connector 10 when the rod-shaped member 28 is inserted within the first and second halves 22, 24 of the connector 10.Thus, the tab member 30 is configured to assist a user with removing the insert 26 from within the catheter connector 10 (e.g.\",\n \"after the connector 10 has been shipping and is ready to be used with a catheter that is inserted into a patient).\",\n \"Referring now to FIG.\",\n \"6, another embodiment of an insert 46 configured to maintain the catheter connector 10 of FIGS.\",\n \"1-3 in an open position during packaging, shipping, and handling is illustrated.\",\n \"As shown, the insert 46 is configured to fit at least partially around an exterior surface of the body 16 of the connector 10 when the body 16 is in the open position such that the insert 46 maintains the catheter connector 10 in the open position.\",\n \"For instance, as shown in the illustrated embodiment, the insert 46 includes a housing 32 having a hollow interior 34 that is shaped so as to correspond to an exterior shape of the catheter connector 10 when the connector 10 is in the open position.\",\n \"More specifically, in certain embodiments, the housing 32 includes a plurality of compartments 38 that correspond to the rotated first and second halves 22, 24 in the open position.\",\n \"Thus, as shown in FIG.\",\n \"7, at least a portion of the catheter connector 10 is configured to fit within the housing 32 when the connector 10 is in the open position such that the insert 46 maintains the catheter connector 10 in the open position during packaging, shipping, and handling.\",\n \"Still referring to FIGS.\",\n \"6 and 7, the insert 46 may also include one or more locking features 36 configured to secure the insert 46 at least partially around the exterior surface of the body 16 of the connector 10.For example, in certain embodiments, the locking features 36 may include any one of or combination of the following: molded snaps, add-on grips, ridges, protrusions, an adhesive, or similar.\",\n \"It should also be understood that the inserts 26, 46 as described herein may be constructed of any suitable material.\",\n \"For example, in certain embodiments, the inserts 26, 46 may be constructed of a rigid or semi-rigid material, such as a metal or a hard plastic.\",\n \"More specifically, the inserts 26, 46 may be constructed of polypropylene, polycarbonate, polyurethane, polyester, epoxy resins, phenolic resins, polyvinyl chloride (PVC), or any other suitable polymer material.\",\n \"In addition, the inserts 26, 46 may be constructed of aluminum, copper, stainless steel, or any other suitable metal.\",\n \"In some embodiments, the inserts 26, 46 may also be constructed of a flexible or semi-flexible material, such as a rubber material, a polymeric material, a silicone material, an elastomeric material, or similar.\",\n \"More specifically, in various embodiments, the inserts 26, 46 may be constructed of polyisoprene, polyurethane, styrene butadiene, and/or any other suitable flexible material.\",\n \"While the present invention has been described in connection with certain preferred embodiments it is to be understood that the subject matter encompassed by way of the present invention is not to be limited to those specific embodiments.\",\n \"On the contrary, it is intended for the subject matter of the invention to include all alternatives, modifications and equivalents as can be included within the spirit and scope of the following claims.\"\n ]\n]"},"source":{"kind":"string","value":"Patent_15871406"}}},{"rowIdx":4493781,"cells":{"text":{"kind":"list like","value":[["HEAT-EXCHANGING DEVICE","The condenser of the heat-exchanging device is provided with a flow passage through which a high-pressure refrigerant flows.","The flow passage is structured by openings formed in the plurality of plates.","Inside the flow passage, an inner pipe having an outer diameter smaller than the diameter of the openings is disposed.","The part inside the flow passage but outside the inner pipe serves as a passage in which the refrigerant that has flown into the condenser flows, and the part inside the inner pipe serves as a passage in which the refrigerant that has passed through the component section flows."],["1.A heat-exchanging device comprising a plate-stacked section of a plurality of plates continuously stacked one on another, the plate-stacked section comprising: a condenser having a structure where a refrigerant passage through which a high-pressure refrigerant flows and a heat-carrier passage through which a heat carrier that absorbs heat from the high-pressure refrigerant flows are stacked one on another between a part of the plurality of plates; and a component section having a structure where the refrigerant that has passed through the condenser flows between a part of the plurality of plates or via a part of the plates, wherein, in the condenser, openings respectively disposed in the plurality of plates forms a flow passage through which the refrigerant flows, inside the flow passage, a first pipe having outer diameter smaller than a diameter of each of the openings is disposed, and the first pipe is disposed such that the refrigerant that has flown into the condenser flows inside the flow passage but outside the first pipe and the refrigerant that has passed through the component section flows inside the first pipe.","2.The heat-exchanging device according to claim 1 further comprising a second pipe which carries the high-pressure refrigerant into the condenser, wherein the first pipe and the second pipe are integrally provided.","3.The heat-exchanging device according to claim 2, wherein the component section includes an evaporator having a structure where a flow passage through which a low-pressure refrigerant flows and a flow passage through which a heat carrier that applies heat to the low-pressure refrigerant flows are stacked one on another between a part of the plurality of plates.","4.The heat-exchanging device according to claim 3, wherein, the component section includes an intermediate heat-exchanger that performs heat exchange between the high-pressure refrigerant that has passed through the condenser and the low-pressure refrigerant that has passed through the evaporator, in the evaporator, a flow passage through which the low-pressure refrigerant flows is formed by openings respectively disposed in the plurality of plates, inside the flow passage, a third pipe having an outer diameter smaller than a diameter of each of the openings is disposed, and the third pipe is disposed such that the refrigerant that has flown into the evaporator flows inside the flow passage but outside the third pipe and the refrigerant that has passed through the intermediate heat-exchanger flows inside the third pipe.","5.The heat-exchanging device according to claim 4 further comprising a fourth pipe which carries the low-pressure refrigerant into the evaporator, wherein the third pipe and the fourth pipe are integrally provided.","6.The heat-exchanging device according to claim 4 further comprising a fourth pipe which carries the low-pressure refrigerant into the evaporator, wherein the third pipe and the fourth pipe are individually provided.","7.The heat-exchanging device according to claim 1 further comprising a second pipe which carries the high-pressure refrigerant into the condenser, wherein the first pipe and the second pipe are independently provided.","8.The heat-exchanging device according to claim 1, wherein the component section includes at least one liquid tank which retains the high-pressure refrigerant between a part of the plurality of plates or via a part of the plates.","9.The heat-exchanging device according to claim 1, wherein the component section includes an intermediate heat-exchanger having a structure where a flow passage through which the high-pressure refrigerant flows and a flow passage through which a low-pressure refrigerant flows are stacked one on another between a part of the plurality of plates.","10.The heat-exchanging device according to claim 1, wherein the component section includes a subcool condenser having a structure where a flow passage through which the high-pressure refrigerant flows and a flow passage through which a heat carrier that further absorbs heat from the high-pressure refrigerant flows are stacked one on another between a part of the plurality of plates.","11.The heat-exchanging device according to claim 1, wherein the component section includes an evaporator having a structure where a flow passage through which a low-pressure refrigerant flows and a flow passage through which a heat carrier that applies heat to the low-pressure refrigerant flows are stacked one on another between a part of the plurality of plates."],[" BACKGROUND "],[" SUMMARY The heat-exchanging device of an aspect of the present disclosure has a plate-stacked section in which a plurality of plates is continuously stacked one on another.","The plate-stacked section includes a condenser and a component section.","The condenser has a structure where a refrigerant passage through which a high-pressure refrigerant flows and a heat-carrier passage through which a heat carrier that absorbs heat from the high-pressure refrigerant flows are stacked one on another between some plates of the plurality of plates.","The component section has a structure where the refrigerant that has passed through the condenser flows between some plates of the plurality of plates or via some plates.","In the condenser, openings respectively formed in the plurality of plates form a flow passage through which the refrigerant flows.","Inside the flow passage, a first pipe having an outer diameter smaller than the diameter of each of the openings is disposed.","The first pipe is disposed such that the refrigerant that has come into the condenser flows inside the flow passage but outside the first pipe and the refrigerant that has passed through the component section flows inside the first pipe.","According to the present disclosure, the heat-exchanging device formed of a plurality of plates stacked one on another enhances durability of the structure."],["CROSS-REFERENCE TO RELATED APPLICATIONS This application is a continuation of the PCT International Application No.","PCT/JP2016/003551 filed on Aug. 2, 2016, which claims the benefit of foreign priority of Japanese patent application No.","2015-155265 filed on Aug. 5, 2015, the contents all of which are incorporated herein by reference.","BACKGROUND 1.Technical Field The present disclosure relates to a heat-exchanging device.","2.Description of the Related Art A conventionally known heat-exchanging device, which is used for a heat-pump system, exchanges heat between a refrigerant and coolant.","For example, Japanese Patent Unexamined Publication No.","2013-119373 discloses a heat-exchanging device with a structure where a plate on which a refrigerant flows and a plate on which coolant flows are alternately stacked.","According to the heat-exchanging device, a plurality of components (such as a condenser, a liquid tank, and an evaporator) is formed into an integral structure, thereby eliminating piping between the components, by which the heat-exchanging device has a compact structure and is easily assembled.","SUMMARY The heat-exchanging device of an aspect of the present disclosure has a plate-stacked section in which a plurality of plates is continuously stacked one on another.","The plate-stacked section includes a condenser and a component section.","The condenser has a structure where a refrigerant passage through which a high-pressure refrigerant flows and a heat-carrier passage through which a heat carrier that absorbs heat from the high-pressure refrigerant flows are stacked one on another between some plates of the plurality of plates.","The component section has a structure where the refrigerant that has passed through the condenser flows between some plates of the plurality of plates or via some plates.","In the condenser, openings respectively formed in the plurality of plates form a flow passage through which the refrigerant flows.","Inside the flow passage, a first pipe having an outer diameter smaller than the diameter of each of the openings is disposed.","The first pipe is disposed such that the refrigerant that has come into the condenser flows inside the flow passage but outside the first pipe and the refrigerant that has passed through the component section flows inside the first pipe.","According to the present disclosure, the heat-exchanging device formed of a plurality of plates stacked one on another enhances durability of the structure.","BRIEF DESCRIPTION OF DRAWINGS FIG.","1 is a block diagram showing a structure of a heat pump system in accordance with a first exemplary embodiment.","FIG.","2 is a perspective view showing the structure of the heat-exchanging device in accordance with the first exemplary embodiment.","FIG.","3 is an exploded perspective view showing the structure of the heat-exchanging device in accordance with the first exemplary embodiment.","FIG.","4 is a schematic view illustrating an internal structure of the heat-exchanging device in accordance with the first exemplary embodiment.","FIG.","5 is a schematic view illustrating an internal structure of a heat-exchanging device in accordance with a second exemplary embodiment.","FIG.","6 is a block diagram showing a structure of a heat pump system in accordance with a third exemplary embodiment.","FIG.","7 is a schematic view illustrating an internal structure of the heat-exchanging device in accordance with the third exemplary embodiment.","FIG.","8 is a block diagram showing a structure of a heat pump system in accordance with a fourth exemplary embodiment.","FIG.","9 is a schematic view illustrating an internal structure of the heat-exchanging device in accordance with the fourth exemplary embodiment.","FIG.","10 is a schematic view illustrating an internal structure of a heat-exchanging device in accordance with a fifth exemplary embodiment.","FIG.","11 is a perspective view showing a structure of a heat-exchanging device in accordance with a sixth exemplary embodiment.","FIG.","12 is an exploded perspective view showing the structure of the heat-exchanging device in accordance with the sixth exemplary embodiment.","FIG.","13 is a schematic view showing an internal structure of the heat-exchanging device in accordance with the sixth exemplary embodiment.","FIG.","14 is a schematic view showing an internal structure of a heat-exchanging device in accordance with a seventh exemplary embodiment.","FIG.","15 is a schematic view showing an internal structure of a heat-exchanging device in accordance with an eighth exemplary embodiment.","FIG.","16 is a schematic view showing an internal structure of a heat-exchanging device in accordance with a ninth exemplary embodiment.","DETAILED DESCRIPTION OF PREFERRED EMBODIMENTS Prior to describing exemplary embodiments of the present disclosure, problems in the device of the related art are described briefly.","In the heat-exchanging device of a stacked structure formed of a plurality of plates, the following flow passages are formed: a flow passage through which a refrigerant flows in the vertically downward direction; a flow passage through which the refrigerant flows in the vertically upward direction; a flow passage through which coolant flows in the vertically downward direction; and a flow passage through which the coolant flows in the vertically upward direction.","Each of these flow passages is formed of a plurality of openings overlapped with each other and respectively formed in an end section of each plate.","However, forming a plurality of openings lowers the strength of the plates, degrading durability of the heat-exchanging device.","The present disclosure targets on enhancing the durability of a heat-exchanging device of a stacked structure formed of a plurality of plates.","Hereinafter, an exemplary embodiment of the present disclosure is described in detail with reference to accompanying drawings.","First Exemplary Embodiment Hereinafter, a first exemplary embodiment according to the present disclosure is described.","First, a structure of heat pump system 10 of the embodiment is described with reference to FIG.","1.FIG.","1 is a block diagram showing the structure of heat pump system 10 of the embodiment.","Heat pump system 10 has condenser 110, liquid tank 120 (as an example of the component section), expansion valve 20, evaporator 130, and compressor 30.In heat pump system 10 shown in FIG.","1, heat-exchanging device 100 has an all-in-one structure, having condenser 110 and liquid tank 120 integrally.","Compressor 30 is disposed on the upstream side of an inlet for the refrigerant of condenser 110.Compressor 30 compresses the refrigerant sucked from evaporator 130 to change it into a high-temperature and high-pressure refrigerant and then feeds the refrigerant to condenser 110.Condenser 110 performs heat exchange between coolant and the high-temperature and high-pressure refrigerant from compressor 30 to condense the refrigerant.","The coolant is an anti-freezing solution for transferring heat, such as LLC (Long Life Coolant).","Liquid tank 120 retains the refrigerant fed from condenser 110, performs vapor-liquid separation on the refrigerant, and controls the amount of the refrigerant.","Expansion valve 20 is disposed on the upstream side of an inlet for the refrigerant of evaporator 130.Expansion valve 20 expands the refrigerant received from liquid tank 120 to change it into a low-temperature and low-pressure refrigerant and then feeds it to evaporator 130.Evaporator 130 is disposed on the downstream side of expansion valve 20 and on the upstream side of compressor 30.Evaporator 130 performs heat exchange between the refrigerant fed from expansion valve 20 and the coolant to evaporate the refrigerant and then feeds the refrigerant to compressor 30.Heat pump system 10 has the structure above.","Next, the structure of heat-exchanging device 100 of the embodiment is described with reference to FIG.","2 through FIG.","4.FIG.","2 is a perspective view showing the structure of heat-exchanging device 100 used for heat pump system 10 shown in FIG.","1.FIG.","2 shows a cross section of pipe 3.FIG.","3 is a perspective view showing a disassembled state of a plurality of plates forming heat-exchanging device 100 of FIG.","2.FIG.","4 is a cross-sectional view showing the structure of heat-exchanging device 100 of FIG.","2.FIG.","4 also shows flowing directions of the refrigerant and the coolant in heat-exchanging device 100.Apart of each plate is omitted in FIG.","4.As shown in FIG.","2 and FIG.","3, heat-exchanging device 100 has a plate-stacked section formed of a plurality of plates continuously stacked one on another.","Each of condenser 110 and liquid tank 120 is formed of some plates of the plurality of plates of the plate-stacked section.","Specifically, condenser 110 is formed of condenser plates 111 through 113, and liquid tank 120 is formed of liquid-tank plates 121, 122.The plurality of plates above is substantially equal in dimension in the stacking direction.","That is, in heat-exchanging device 100, each of condenser plates 111 through 113 and each of liquid-tank plates 121, 122 are substantially equal in dimension in the stacking direction.","In addition, the plurality of plates above is equal in size and in outer shape.","For example, each of condenser plates 111 through 113 is equal to each of liquid-tank plates 121, 122 in profile line and dimensions orthographically projected on a plane perpendicular to the stacking direction.","In heat-exchanging device 100, as shown in FIG.","2 through FIG.","4, pipe 1 and pipe 2 are connected to condenser plate 111.Pipe 1 feeds the coolant into condenser 110 and pipe 2 discharges the coolant having undergone heat exchange in condenser 110.In heat-exchanging device 100, as shown in FIG.","2 through FIG.","4, pipe 3 is connected to condenser plate 111.Pipe 3 feeds high-temperature and high-pressure refrigerant compressed by compressor 30 into condenser 110.After heat exchange in condenser 110, the refrigerant undergoes vapor-liquid separation by liquid tank 120.Pipe 3 discharges the refrigerant after the vapor-liquid separation to expansion valve 20.As shown in FIG.","2 through FIG.","4, pipe 3 has a double-pipe structure of outer-side pipe (hereinafter, outer pipe) 31 and inner-side pipe (hereinafter, inner pipe) 32.Outer pipe 31 is connected to opening ‘d’ of condenser plate 112.Inner pipe 32 is connected to openings ‘f’ of liquid-tank plates 121.Inner pipe 32 is connected to openings ‘f’ of liquid-tank plates 121.Inner pipe 32 runs through the inside of outer pipe 31 and protrudes from a side surface of outer pipe 31.Outer pipe 31 carries high-temperature and high-pressure refrigerant compressed by compressor 30 into condenser 110.After heat exchange in condenser 110, the refrigerant undergoes vapor-liquid separation by liquid tank 120.Inner pipe 32 discharges the refrigerant after the vapor-liquid separation to expansion valve 20.Next, the structure of condenser 110 of the embodiment is described.","As shown in FIG.","3, condenser 110 has condenser plates 111 through 113 stacked one on another.","Under condenser plate 111 to which pipes 1 through 3 are connected, condenser plate 112 and condenser plate 113, which are different in shape, are alternately stacked.","Condenser plate 112 is provided with openings ‘a’ through ‘d’ at its four corners.","Bump section A is disposed around each of openings ‘b’ and ‘c’.","Condenser plate 113 is provided with openings ‘a’ through ‘d’ at its four corners.","Bump section A is disposed around each of openings ‘a’ and ‘d’.","The alternately stacked structure of condenser plates 112, 113 alternately forms, between condenser plates 111 through 113, a refrigerant passage through which a high-pressure refrigerant flows and a coolant passage through which coolant for absorbing heat from the high-pressure refrigerant flows.","The refrigerant and the coolant, without being mixed, flow through the refrigerant passage and the coolant passage, respectively.","The refrigerant and the coolant flow the refrigerant passage and the coolant passage, respectively, in opposite directions from each other.","In FIG.","3, the broken-line arrow shows the flowing direction of the refrigerant, and the solid-line arrow shows the flowing direction of the coolant.","In condenser 110, as described above, the refrigerant flows through the refrigerant passage and the coolant flows through the coolant passage, thereby the refrigerant and the coolant exchange heat therebetween, and the refrigerant is condensed.","In addition, the alternately stacked structure of condenser plates 112, 113 allows openings ‘a’ through ‘d’ to form the following flow passages.","A plurality of openings ‘b’ forms a flow passage through which the coolant coming from pipe 1 flows through condenser 110 in the vertically downward direction.","A plurality of openings ‘c’ forms a flow passage in which coolant that has passed the coolant passage flows through condenser 110 in the vertically upward direction.","After that, the coolant is discharged from pipe 2.A plurality of openings ‘a’ forms a flow passage in which refrigerant that has passed the refrigerant passage flows through condenser 110 in the vertically downward direction.","The flow passage joins a flow passage formed of openings ‘e’ of liquid tank plates 121 (which will be described later).","With the structure above, the refrigerant that has passed the refrigerant passage flows into liquid tank 120.A plurality of openings ‘d’ forms flow passage P in which the refrigerant flows through condenser 110.In flow passage P, as shown in FIG.","2, inner pipe 32 having an outer diameter smaller than the diameter of opening ‘d’ (substantially the same as the inner diameter of outer pipe 31) is disposed.","That is, flow passage P has a double-passage structure: one is the flow passage that runs inside flow passage P but outside inner pipe 32; and the other is the flow passage that runs inside inner pipe 32.The flow passage, which runs inside flow passage P but outside inner pipe 32, serves as the flow passage in which the refrigerant fed from outer pipe 31 flows through condenser 110 in the vertically downward direction.","The flow passage inside inner pipe 32 serves as the flow passage in which the refrigerant that has passed liquid tank 120 flows through condenser 110 in the vertically upward direction.","At the design phase of heat-exchanging device 100, the number of alternately stacked condenser plates 112, 113 determines the volume (efficiency in heat exchange) of condenser 110.FIG.","3 and FIG.","4 show an example where the refrigerant and the coolant flow the refrigerant passage and the coolant passage, respectively, in opposite directions from each other, but it is not limited to; the refrigerant and the coolant may flow the refrigerant passage and the coolant passage, respectively, in the same direction.","Next, the structure of liquid tank 120 of the embodiment is described.","As shown in FIG.","3, liquid tank 120 has a plurality of liquid-tank plates 121 stacked one on another.","At the bottom of liquid tank 120, liquid-tank plate 122 is disposed.","Each of the plurality of liquid-tank plates 121 is substantially equal to liquid-tank plate 122 in dimension in the stacking direction.","Each of liquid-tank plates 121, 122 and each of condenser plates 111 through 113 are substantially equal in dimension in the stacking direction.","In addition, each of the plurality of liquid-tank plates 121 is substantially equal to liquid-tank plate 122 in size and in outer shape.","Each of liquid-tank plates 121 and liquid-tank plate 122 are equal to each of condenser plates 111 through 113 in profile line and dimensions orthographically projected on a plane perpendicular to the stacking direction.","The plurality of liquid-tank plates 121 is continuously stacked together with and to be contact with the plurality of condenser plates 111 through 113.As shown in FIG.","2, liquid tank 120 is disposed under condenser 110.Between adjacent two of the plurality of liquid-tank plates 121, the refrigerant passage in which the refrigerant fed from condenser 110 flows is formed.","As shown in FIG.","3, each of liquid-tank plates 121 has openings ‘e’, ‘f’ in two of the four corners.","Opening ‘e’ is so formed that meets with the position of openings ‘a’ of condenser plates 112, 113.The diameter of opening ‘e’ is the same with that of opening ‘a’.","Opening ‘f’ is so formed that meets with the position of openings ‘d’ of condenser plates 112, 113.The diameter of opening ‘f’ is the same with the inner diameter of inner pipe 32.Openings ‘e’, ‘f’ are not formed in liquid-tank plate 122.The stacked structure of the plurality of liquid-tank plates 121 forms the following flow passages.","A plurality of openings ‘e’ forms the flow passage in which the refrigerant fed from condenser 110 flows through liquid tank 120 in the vertically downward direction.","The flow passage, as described above, joins the flow passage formed of the plurality of openings ‘a’.","A plurality of openings ‘f’ forms the flow passage in which the refrigerant that has passed liquid tank 120 (i.e., the refrigerant passage between liquid-tank plates 121) flows through liquid tank 120 in the vertically upward direction.","This flow passage joins the flow passage inside inner pipe 32, thereby the refrigerant that has passed liquid tank 120 is discharged from inner pipe 32 to expansion vale 20.At the design phase of heat-exchanging device 100, the number of alternately stacked liquid-tank plates 121 determines the volume (capacity) of liquid tank 120.Heat-exchanging device 100 is thus structured.","In heat-exchanging device 100 with the structure above, the coolant and the refrigerant flow as follows.","As shown in FIG.","4, the coolant fed from pipe 1 passes through condenser 110 and is discharged from pipe 2.As shown in FIG.","4, the refrigerant, which has flown into outer pipe 31, flows through the inside of outer pipe 31 but the outside of inner pipe 32.After passing through condenser 110 and liquid tank 120, the refrigerant flows inside inner pipe 32 and is discharged from inner pipe 32 into expansion valve 20.As described above, according to heat-exchanging device 100 of the embodiment, condenser 110 has flow passage P formed of a plurality of openings ‘d’ respectively formed in the plurality of condenser plates 111 through 113.A high-pressure refrigerant flows through flow passage P. Inside flow passage P, inner pipe 32 (as an example of the first pipe) having an outer diameter smaller than the diameter of opening ‘d’ is disposed.","Inner pipe 32 is structured such that the refrigerant that has flown into condenser 110 flows inside flow passage P but outside inner pipe 32; at the same time, the refrigerant that has passed liquid tank 120 flows inside inner pipe 32.In general, a heat-exchanging device having a condenser and a liquid tank has the following flow passages for refrigerant: a flow passage in which the refrigerant fed from the compressor flows through the condenser in the vertically downward direction; a flow passage in which the refrigerant that has passed the refrigerant passage of the condenser flows through the condenser and the liquid tank in the vertically downward direction; and a flow passage in which the refrigerant that has passed the refrigerant passage of the liquid tank flows through the condenser in the vertically upward direction.","To form the three flow passages above, each plate has to be provided with three openings.","In contrast, according to the embodiment, inner pipe 32 is disposed in flow passage P formed of openings ‘d’.","With the above structure, the refrigerant fed from the compressor flows inside flow passage P but outside inner pipe 32, and the refrigerant that has passed the refrigerant passage of the liquid tank flows inside inner pipe 32.The structure of the embodiment allows the openings, which are to be formed in each plate for forming the refrigerant passages, to be decreased to two: openings ‘a’ and ‘d’ for condenser plates 111 through 113; and openings ‘e’ and ‘f’ for liquid-tank plates 121.According to the embodiment, the openings in each plate can be decreased in number, thereby ensuring strength of the plates.","That is, the structure enhances durability of the heat-exchanging device.","As described above, the structure of the embodiment achieves decrease in number of the openings to be formed in each plate.","When each opening is disposed in the short-side direction of the plate, as shown in FIG.","2 and FIG.","3, the structure allows the plate to have a decreased length of the short side, contributing to a downsized structure of a heat-exchanging device.","Second Exemplary Embodiment A second exemplary embodiment of the present disclosure is now described.","The description of the first exemplary embodiment shows an example of a heat-exchanging device having the condenser and the liquid tank.","The heat-exchanging device may further include an evaporator.","The embodiment describes heat-exchanging device 101 having condenser 110, liquid tank 120, and evaporator 130 (as an example of the component section) in heat pump system 10 shown in FIG.","1.The structure of heat-exchanging device 101 of the embodiment is described with reference to FIG.","5.FIG.","5 is a cross-sectional view showing the structure of heat-exchanging device 101 of the embodiment.","FIG.","5 also shows a flowing direction of refrigerant and coolant in heat-exchanging device 101.Apart of each plate is omitted in FIG.","5.In FIG.","5, like parts are identified by the same reference marks as in FIG.","4, and the detailed description thereof is omitted.","As shown in FIG.","5, condenser 110 and liquid tank 120 in heat-exchanging device 101 are the same with the structure in the first exemplary embodiment.","As shown in FIG.","5, heat-exchanging device 101 has evaporator 130 under liquid tank 120.Evaporator 130 is formed of a plurality of evaporator plates 131 stacked one on another.","Evaporator plates 131 are substantially equal in dimension in the stacking direction, and they are equal in size and in outer shape.","Each of evaporator plates 131 is substantially equal to each of condenser plates 111 through 113 and each of liquid-tank plates 121, 122 in dimension in the stacking direction.","In addition, each of evaporator plates 131 is substantially equal to each of condenser plates 111 through 113 and each of liquid-tank plates 121, 122 in profile line and dimensions orthographically projected on a plane perpendicular to the stacking direction.","As shown in FIG.","5, pipe 4 and pipe 5 are connected to the lowermost one of evaporator plates 131.Pipe 4 carries the coolant into evaporator 130 and pipe 5 discharges the coolant that has undergone heat exchange in evaporator 130.Further, pipe 6 and pipe 7 are connected to the lowermost one of evaporator plates 131.Pipe 6 carries the low-temperature and low-pressure refrigerant that has been expanded at expansion valve 20 into evaporator 130.Pipe 7 discharges the refrigerant that has undergone heat exchange in evaporator 130 into compressor 30.The plurality of evaporator plates 131 is continuously stacked (with no space) under the plurality of condenser plates 111 through 113 and the plurality of liquid-tank plates 121, 122.Thus, evaporator 130 is disposed under liquid tank 120.In evaporator 130, between adjacent two of the plurality of evaporator plates 131 stacked one on another, a refrigerant passage through which a low-pressure refrigerant flows and a coolant passage through which coolant that provides the low-pressure refrigerant with heat flows are stacked one on another.","To be specific, differently-shaped evaporator plates 131 (for example, one is the same in shape with condenser plate 112, and the other is the same in shape with condenser plate 113) are alternately stacked.","This allows the refrigerant passages and the coolant passages to be alternately formed between the plurality of evaporator plates 131.By virtue of the structure, the refrigerant and the coolant, without being mixed, flow the refrigerant passage and the coolant passage, respectively.","The refrigerant and the coolant pass through the refrigerant passage and the coolant passage, respectively, in opposite directions from each other.","In evaporator 130, as described above, the refrigerant flows through the refrigerant passage and the coolant flows through the coolant passage, thereby the refrigerant and the coolant exchange heat therebetween, and the refrigerant is evaporated.","At the design phase of heat-exchanging device 101, the number of differently-shaped evaporator plates 131 alternately stacked one on another determines the volume (efficiency in heat exchange) of evaporator 130.FIG.","5 shows an example where the refrigerant and the coolant flow the refrigerant passage and the coolant passage, respectively, in opposite directions from each other, but it is not limited to; the refrigerant and the coolant may flow the refrigerant passage and the coolant passage, respectively, in the same direction.","Heat-exchanging device 101 is thus structured.","In heat-exchanging device 101 with the structure above, the coolant and the refrigerant flow as follows.","As shown in FIG.","5, the coolant fed from pipe 1 passes through condenser 110 and is discharged from pipe 2.As shown in FIG.","5, the refrigerant, which has flown into outer pipe 31, flows through the inside of outer pipe 31 but the outside of inner pipe 32.After passing through condenser 110 and liquid tank 120, the refrigerant flows through the inside of inner pipe 32 and is discharged into expansion valve 20.In addition, as shown in FIG.","5, the coolant fed from pipe 4 passes through evaporator 130 and is discharged from pipe 5.As shown in FIG.","5, the refrigerant fed from pipe 6 passes through evaporator 130 and is discharged from pipe 7 into compressor 130.Heat-exchanging device 101 of the embodiment, as described above, has condenser 110, liquid tank 120, and evaporator 130.Such structured heat-exchanging device 101 of the embodiment produces the effect similar to the structure described in the first exemplary embodiment.","Third Exemplary Embodiment A third exemplary embodiment of the present disclosure is described.","The description of the second exemplary embodiment shows an example of the heat-exchanging device including the condenser, the liquid tank, and the evaporator.","The heat-exchanging device may further include an intermediate heat-exchanger (IHX).","The embodiment describes heat-exchanging device 102 including condenser 110, liquid tank 120, evaporator 130, and intermediate heat-exchanger 140 (as an example of the component section).","First, the structure of heat pump system 10a of the embodiment is described with reference to FIG.","6.FIG.","6 is a block diagram showing the structure of heat pump system 10a of the embodiment.","In FIG.","6, like parts are identified by the same reference marks as in FIG.","1, and the detailed description thereof is omitted.","Heat pump system 10a has heat-exchanging device 102, expansion valve 20, and compressor 30.Heat-exchanging device 102 has condenser 110, liquid tank 120, evaporator 130, and intermediate heat-exchanger 140.Intermediate heat-exchanger 140 performs heat exchange between a high-temperature and high-pressure refrigerant fed from condenser 110 via liquid tank 120 (shown by the broken line) and a low-temperature and low-pressure refrigerant fed from expansion valve 20 (shown by the dashed-dotted line).","After the heat exchange in intermediate heat-exchanger 140, the refrigerant that has been fed from condenser 110 via liquid tank 120 is discharged to expansion valve 20.Meanwhile, the refrigerant that has been fed from expansion valve 20 joins with the heat-exchanged refrigerant at evaporator 130 and is sucked into compressor 30.In this way, intermediate heat-exchanger 140 performs heat exchange between the high-temperature and high-pressure refrigerant fed from condenser 110 via liquid tank 120 and the low-temperature and low-pressure refrigerant fed from expansion valve 20.Heat pump system 10a of the embodiment is thus structured.","Next, the structure of heat-exchanging device 102 of the embodiment will be described with reference to FIG.","7.FIG.","7 is a cross-sectional view showing the structure of heat-exchanging device 102 of the embodiment.","FIG.","7 also shows flowing directions of the refrigerant and the coolant in heat-exchanging device 102.Apart of each plate is omitted in FIG.","7.In FIG.","7, like parts are identified by the same reference marks as in FIG.","5, and the detailed description thereof is omitted.","The structure of FIG.","7 differs from the structure of FIG.","5 in the followings: pipe 1 for feeding the coolant (coolant-IN) is oppositely disposed from pipe 2 for discharging the coolant (coolant-OUT) and pipe 3 for feeding and discharging the refrigerant (refrigerant-IN/OUT): pipe 4 for feeding the coolant (coolant-IN) is oppositely disposed from pipe 5 for discharging the coolant (coolant-OUT); and pipe 6 for feeding the refrigerant (refrigerant-IN) is oppositely disposed from pipe 7 for discharging the refrigerant (refrigerant-OUT).","As shown in FIG.","7, heat-exchanging device 102 has intermediate heat-exchanger 140 disposed at a position lower than liquid tank 120 and higher than evaporator 130.Intermediate heat-exchanger 140 is formed of a plurality of IHX plates 141 stacked one on another.","The plurality of IHX plates 141 is substantially equal in dimension in the stacking direction and is equal in size and in outer shape.","Each of the plurality of IHX plates 141 is substantially equal to each of condenser plates 111 through 113, each of liquid-tank plates 121, and each of evaporator plates 131 in dimension in the stacking direction.","In addition, each of the plurality of IHX plates 141 is substantially equal to each of condenser plates 111 through 113, each of liquid-tank plates 121, 122, and each of evaporator plates 131 in profile line and dimensions orthographically projected on a plane perpendicular to the stacking direction.","The plurality of IHX plates 141 is continuously stacked with the plurality of condenser plates 111 through 113 and the plurality of liquid-tank plates 121, so that intermediate heat-exchanger 140 is located under liquid tank 120.Liquid tank 120 of the embodiment has no liquid-tank plate 122 shown in FIG.","3 at the bottom.","Similarly, the plurality of evaporator plates 131 is continuously stacked with the plurality of condenser plates 111 through 113, the plurality of liquid-tank plates 121, and the plurality of IHX plates 141, so that evaporator 130 is located under intermediate heat-exchanger 140.Intermediate heat-exchanger 140 is structured such that first refrigerant-passages each in which a high-pressure refrigerant fed from condenser 110 flows and second refrigerant-passages each in which a low-pressure refrigerant fed from expansion valve 20 flows are disposed between the plurality of IHX plates 141 stacked one on another.","Specifically, differently-shaped IHX plates 141 (for example, one is equal to condenser plate 112 in shape, and the other is equal to condenser plate 113 in shape) are alternately stacked, thereby the first refrigerant-passages and the second refrigerant-passages are alternately formed between the plurality of IHX plates 141.The refrigerant coming from condenser 110 and the refrigerant coming from expansion valve 20, without being mixed, pass through the first refrigerant-passage and the second refrigerant-passage, respectively.","In addition, the refrigerant coming from condenser 110 and the refrigerant coming from expansion valve 20 pass through the first refrigerant-passage and the second refrigerant-passage, respectively, in opposite directions from each other.","In intermediate heat-exchanger 140, as described above, the refrigerant fed from condenser 110 flows through the first refrigerant-passage and the refrigerant fed from expansion valve 20 flows through the second refrigerant-passage, thus the high-pressure refrigerant and the low-pressure refrigerant exchange heat therebetween.","As shown in FIG.","7, inner pipe 32 of the embodiment is connected to the opening where liquid tank 120 communicates with intermediate heat-exchanger 140 in liquid-tank plates 121.The structure allows the refrigerant that has passed the first refrigerant-passage of intermediate heat-exchanger 140 to be discharged from inner pipe 32 to expansion valve 20.Meanwhile, the refrigerant that has passed the second refrigerant-passage of intermediate heat-exchanger 140 joins the refrigerant coming from evaporator 130 and is discharged from pipe 7 to compressor 30.At the design phase of heat-exchanging device 102, the number of differently-shaped IHX plates 141 to be alternately stacked determines the volume (efficiency in heat exchange) of intermediate heat-exchanger 140.FIG.","7 shows an example where the refrigerant and the coolant flow the refrigerant passage and the coolant passage, respectively, in opposite directions from each other, but it is not limited to; the refrigerant and the coolant may flow the refrigerant passage and the coolant passage, respectively, in the same direction.","Similarly, FIG.","7 shows an example where the refrigerant from condenser 110 and the refrigerant from expansion valve 20 pass through the first refrigerant-passage and the second refrigerant-passage, respectively, in opposite directions from each other, but it is not limited to; the refrigerant from condenser 110 and the refrigerant from expansion valve 20 may pass through the first refrigerant-passage and the second refrigerant-passage, respectively, in the same direction.","Heat-exchanging deice 102 is thus structured.","In heat-exchanging device 102 with the structure above, the coolant and the refrigerant flow as follows.","As shown in FIG.","7, the coolant fed from pipe 1 passes through condenser 110 and is discharged from pipe 2.As shown in FIG.","7, the refrigerant, which has flown into outer pipe 31, flows through the inside of outer pipe 31 but the outside of inner pipe 32.After passing through condenser 110, the refrigerant branches into liquid tank 120 and intermediate heat-exchanger 140.The refrigerant that has passed intermediate heat-exchanger 140 flows through the inside of inner pipe 32 and is discharged from inner pipe 32 into expansion valve 20.Besides, as shown in FIG.","7, the coolant fed from pipe 4 passes through evaporator 130 and is discharged from pipe 5.As shown in FIG.","7, the refrigerant fed from pipe 6 branches into evaporator 130 and intermediate heat-exchanger 140.The refrigerant that has passed evaporator 130 and the refrigerant that has passed intermediate heat-exchanger 140 join again, and it is discharged from pipe 7 to compressor 30.Heat-exchanging device 102 of the embodiment, as described above, has condenser 110, liquid tank 120, evaporator 130, and intermediate heat-exchanger 140.Such structured heat-exchanging device 102 of the embodiment produces the effect similar to the structure described in the first exemplary embodiment.","Fourth Exemplary Embodiment A fourth exemplary embodiment of the present disclosure is described.","Although the third exemplary embodiment has described an example of a parallel structure where the refrigerant fed from the expansion valve branches in parallel into the intermediate heat-exchanger and the evaporator, the refrigerant from the expansion valve may flow into the intermediate heat-exchanger via the evaporator in series.","The exemplary embodiment describes heat-exchanging device 103 with such a series structure in which the refrigerant fed from the expansion valve passes through the evaporator and flows into the intermediate heat-exchanger.","First, the structure of heat pump system 10b of the embodiment is described with reference to FIG.","8.FIG.","8 is a block diagram showing the structure of heat pump system 10b of the embodiment.","In FIG.","8, like parts are identified by the same reference marks as in FIG.","6, and the detailed description thereof is omitted.","Intermediate heat-exchanger 140 performs heat exchange between a high-temperature and high-pressure refrigerant fed from condenser 110 via liquid tank 120 (shown by the broken line) and low-temperature and a low-pressure refrigerant fed from evaporator 130 (shown by the dashed-dotted line).","After the heat exchange in intermediate heat-exchanger 140, the refrigerant fed from condenser 110 via liquid tank 120 is discharged to expansion valve 20.Meanwhile, the refrigerant fed from evaporator 130 is sucked into compressor 30.In this way, intermediate heat-exchanger 140 performs heat exchange between the high-temperature and high-pressure refrigerant fed from condenser 110 and the low-temperature and low-pressure refrigerant fed from expansion valve 20.Heat pump system 10b of the embodiment is thus structured.","Next, the structure of heat-exchanging device 103 of the embodiment is described with reference to FIG.","9.FIG.","9 is a cross-sectional view showing the structure of heat-exchanging device 103 of the embodiment.","FIG.","9 also shows flowing directions of the refrigerant and the coolant in heat-exchanging device 103.Apart of each plate is omitted in FIG.","9.In FIG.","9, like parts are identified by the same reference marks as in FIG.","7, and the detailed description thereof is omitted.","As shown in FIG.","9, pipe 4 for refrigerant-IN, pipe 5 for coolant-OUT, and pipe 8 for refrigerant-IN/OUT are connected to the lowermost plate of evaporator plates 131 of evaporator 130.Like pipe 3, pipe 8 has a double-pipe structure of outer pipe 81 and inner pipe 82.The inner diameter of outer pipe 81 is greater than the outer diameter of inner pipe 82.Inner pipe 82 is connected to the openings formed in IHX plates 141.The openings connect intermediate heat-exchanger 140 with evaporator 130.Inner pipe 82 runs through the inside of outer pipe 81 and protrudes from a side surface of outer pipe 81.Outer pipe 81 carries the low-temperature and low-pressure refrigerant expanded by expansion valve 20 into evaporator 130.Inner pipe 82 discharges the refrigerant having undergone heat exchange in intermediate heat-exchanger 140 to compressor 30.As shown in FIG.","9, the part that is the inside of outer pipe 81 but is the outside of inner pipe 82 serves as a flow passage in which the refrigerant that has flown into evaporator 130 flows through evaporator 130 in the vertically upward direction.","As shown in FIG.","9, the inside of inner pipe 82 serves as a flow passage in which the refrigerant that has passed intermediate heat-exchanger 140 flows through evaporator 130 in the vertically downward direction.","Heat-exchanging device 103 is thus structured.","In heat-exchanging device 103 with the structure above, the coolant and the refrigerant flow as follows.","As shown in FIG.","9, the coolant fed from pipe 1 passes through condenser 110 and is discharged from pipe 2.As shown in FIG.","9, the refrigerant, which has flown from outer pipe 31, flows through the inside of outer pipe 31 but the outside of inner pipe 32.After passing through condenser 110, the refrigerant branches into liquid tank 120 and intermediate heat-exchanger 140.The refrigerant that has passed through intermediate heat-exchanger 140 flows through the inside of inner pipe 32 and is discharged from pipe 32 to expansion valve 20.As shown in FIG.","9, the coolant fed from pipe 4 passes through evaporator 130 and is discharged from pipe 5.As shown in FIG.","9, the refrigerant fed from outer pipe 81 runs through the inside of outer pipe 81 but the outside of inner pipe 82.After passing through evaporator 130, the refrigerant flows into intermediate heat-exchanger 140.After passing through intermediate heat-exchanger 140, the refrigerant flows through the inside of inner pipe 82 and is discharged from inner pipe 82 to compressor 130.Heat-exchanging device 103 of the embodiment, as described above, has condenser 110, liquid tank 120, evaporator 130, and intermediate heat-exchanger 140.Such structured heat-exchanging device 103 of the embodiment produces the effect similar to the structure described in the first exemplary embodiment.","Fifth Exemplary Embodiment A fifth exemplary embodiment according to the present disclosure is described.","Although the first exemplary embodiment described an example of a heat-exchanging device having a condenser and a liquid tank, the heat-exchanging device may include a subcool condenser.","The embodiment describes heat-exchanging device 104 having condenser 110, liquid tank 120, and subcool condenser 150 (as an example of the component section).","The structure of heat-exchanging device 104 of the embodiment is described with reference to FIG.","10.FIG.","10 is a cross-sectional view showing the structure of heat-exchanging device 104 of the embodiment.","FIG.","10 also shows flowing directions of the refrigerant and the coolant in heat-exchanging device 104.Apart of each plate is omitted in FIG.","10.In FIG.","10, like parts are identified by the same reference marks as in FIG.","4, and the detailed description thereof is omitted.","The structure of FIG.","10 differs from that of FIG.","4 in that pipe 1 for coolant-IN is oppositely disposed from pipe 2 for coolant-OUT and pipe 3 for refrigerant-IN/OUT.","As shown in FIG.","10, heat-exchanging device 104 has subcool condenser 150 under liquid tank 120.Subcool condenser 150 is formed of a plurality of subcool-condenser plates 151 stacked one on another.","Subcool-condenser plates 151 are substantially equal in dimension in the stacking direction and are equal in size and in outer shape.","Each of the plurality of subcool-condenser plates 151 is substantially equal to each of condenser plates 111 through 113 and each of liquid-tank plates 121 in dimensions in the stacking direction.","In addition, each of the plurality of subcool-condenser plates 151 is equal to each of condenser plates 111 through 113 and each of liquid-tank plates 121 in profile line and dimensions orthographically projected on a plane perpendicular to the stacking direction.","The plurality of subcool-condenser plates 151 is continuously stacked with the plurality of condenser plates 111 through 113 and the plurality of liquid-tank plates 121.That is, subcool condenser 150 is located under liquid tank plates 121.Liquid tank 120 of the embodiment has no liquid-tank plate 122 shown in FIG.","3 at the bottom.","In subcool condenser 150, a refrigerant passage through which the low-pressure refrigerant flows and a coolant passage through which the coolant that applies the low-pressure refrigerant with heat flows are disposed between the plurality of subcool-condenser plates 151 of the stacked structure.","Specifically, differently-shaped subcool-condenser plates 151 (for example, one is equal to condenser plate 112 in shape, and the other is equal to condenser plate 113 in shape) are alternately stacked, thereby the refrigerant passage and the coolant passage are alternately formed between the plurality of subcool-condenser plates 151.The refrigerant and the coolant, without being mixed, pass through the refrigerant passage and the refrigerant passage, respectively, in the same direction.","In subcool condenser 150, as described above, the refrigerant flows through the refrigerant passage and the coolant flows through the coolant passage, thus the refrigerant and the coolant exchange heat therebetween, and the refrigerant is further compressed.","At the design phase of heat-exchanging device 104, the number of alternately stacked subcool-condenser plates 151 of a different shape determines the volume (efficiency in heat exchange) of subcool condenser 150.FIG.","10 shows an example where the refrigerant and the coolant flow the refrigerant passage and the coolant passage, respectively, in the same direction, but it is not limited to; the refrigerant and the coolant may flow the refrigerant passage and the coolant passage, respectively, in opposite directions from each other.","Heat-exchanging device 104 of the embodiment is thus structured.","In heat-exchanging device 104 with the structure above, the coolant and the refrigerant flow as follows.","As shown in FIG.","10, the coolant fed from pipe 1 branches into condenser 110 and subcool condenser 150.The coolant that has passed through condenser 110 and the coolant that has passed through subcool condenser 150 join together and the joined coolant is discharged from pipe 2.As shown in FIG.","10, the refrigerant, which has flown from outer pipe 31, flows through the inside of outer pipe 31 but the outside of inner pipe 32.After passing through condenser 110, the refrigerant branches into liquid tank 120 and subcool condenser 150.The refrigerant that has passed through subcool condenser 150 flows through the inside of inner pipe 32 and is discharged from pipe 32.Heat-exchanging device 104 of the embodiment, as described above, has condenser 110, liquid tank 120, and subcool condenser 150.Such structured heat-exchanging device 104 of the embodiment produces the effect similar to the structure described in the first exemplary embodiment.","The descriptions above are on heat-exchanging devices 100 through 104 in which the pipe for refrigerant-IN and the pipe for refrigerant-OUT are integrally formed.","In contrast, the descriptions hereinafter are on heat-exchanging devices 200, 202, and 203 in which a pipe for refrigerant-IN and a pipe for refrigerant-OUT are individually formed.","Sixth Exemplary Embodiment A sixth exemplary embodiment of the present disclosure is described.","The structure of heat-exchanging device 200 of the embodiment is described with reference to FIG.","11 though FIG.","13.FIG.","11 is a perspective view showing the structure of heat-exchanging device 200.FIG.","11 also shows a cross section of pipe 12.FIG.","12 is a perspective view showing the state where the plurality of plates forming heat-exchanging device 200 of FIG.","11 is disassembled.","FIG.","13 is a cross-sectional view showing the structure of heat-exchanging device 200 of FIG.","11.FIG.","13 also shows flowing directions of refrigerant and coolant in heat-exchanging device 200.A part of each plate is omitted in FIG.","13.In FIGS.","11 to 13, like parts are identified by the same reference marks as in FIGS.","2 to 4, respectively, and the detailed description thereof is omitted.","As shown in FIG.","11 through FIG.","13, in heat-exchanging device 200, liquid tank 120a (as an example of the component section) and liquid tank 120b (as an example of the component section) are disposed under condenser 110.Liquid tank 120a is formed of a plurality of liquid-tank plates 121 stacked one on another.","Liquid tank 120b, which is also formed of a plurality of liquid-tank plates 121 stacked one on another, has liquid-tank plate 122 at the bottom.","As shown in FIG.","12, each of liquid-tank plates 121 that form liquid tank 120a is provided with opening ‘g’.","The diameter of opening ‘g’ is the same with that of opening ‘d’ of each of condenser plates 111 through 113.The flow passage formed by the plurality of openings ‘g’ communicates the flow passage formed by the plurality of openings A′, thereby forming flow-passage P in which refrigerant flows through condenser 110 and liquid tank 120a, as shown in FIG.","11.As shown in FIG.","11 and FIG.","12, in addition to pipe 1 for coolant-IN and pipe 2 for coolant-OUT, pipe 11 and pipe 12 are connected to condenser plate 111.The high-temperature and high-pressure refrigerant compressed by compressor 30 flows through pipe 11 into condenser 110.After performing heat exchange in condenser 110, the refrigerant undergoes vapor-liquid separation in liquid tanks 120a and 120b.","Through pipe 12, the refrigerant is discharged to expansion valve 20.In FIG.","12, a broken-line arrow shows the flowing direction of refrigerant, and a solid-line arrow shows the flowing direction of coolant.","As shown in FIG.","12, the outer diameter of pipe 12 is smaller than the diameter of openings ‘d’ and ‘g’.","As shown in FIG.","11, pipe 12 is disposed in flow passage P formed of openings ‘d’ and ‘g’.","That is, flow passage P has a double-pipe structure having a flow passage formed of the inside of flow passage P but the outside of pipe 12 and a flow passage formed of the inside of pipe 12.The flow passage that runs the inside of flow passage P but the outside of pipe 12 serves as the flow passage in which the refrigerant fed from pipe 11 flows through condenser 110 and liquid tank 120a in the vertically downward direction.","The flow passage that runs the inside of pipe 12 serves as the flow passage in which the refrigerant that has passed condenser 110 and liquid tanks 120a, 120b flows through condenser 110 and liquid tank 120 in the vertically upward direction.","Heat-exchanging device 200 is thus structured.","In heat-exchanging device 200 with the structure above, the coolant and the refrigerant flow as follows.","As shown in FIG.","13, the coolant fed from pipe 1 passes through condenser 110 and is discharged from pipe 2.As shown in FIG.","13, the refrigerant fed from pipe 11 flows through condenser 110 and then the outside of pipe 12 into liquid tank 120a.","After passing through liquid tank 120a, the refrigerant flows through liquid tank 120b and the inside of pipe 12 and is discharged from pipe 12 into expansion valve 20.As described above, according to heat-exchanging device 200 of the embodiment, condenser 110 and liquid tank 120a have flow passage P formed of openings ‘d’ and ‘g’, and high-pressure refrigerant flows therethrough.","Pipe 12 (as an example of the first pipe) is disposed inside flow passage P. The outer diameter of pipe 12 is smaller than the diameter of openings ‘d’ and ‘g’.","Pipe 12 is disposed in flow passage P so that the refrigerant that has flown into condenser 110 flows inside flow passage P but outside pipe 12; at the same time, the refrigerant that has passed through liquid tank 120b flows inside pipe 12.As described in the first exemplary embodiment, in a conventional heat-exchanging device having condenser 110 and a liquid tank, each plate has to be provided with three openings to form the flow passage for refrigerant.","In contrast, according to the embodiment, pipe 12 is disposed in flow passage P formed of openings ‘d’ and ‘g’.","The structure allows the refrigerant fed from the compressor to flow the inside of flow passage P but the outside of pipe 12 and the refrigerant that has passed through the refrigerant passage of the liquid tank to flow the inside of pipe 12.By virtue of the structure of the embodiment, the number of the openings for forming the refrigerant passages is decreased to two (i.e., opening ‘a’ and opening ‘d’ in condenser plates 111 through 113, and opening ‘e’ and opening ‘g’ or ‘f’ in liquid-tank plate 121).","According to the embodiment, the openings in each plate can be decreased in number, thereby ensuring strength of the plates.","That is, the structure enhances durability of the heat-exchanging device.","As described above, the structure of the embodiment achieves decrease in number of the openings to be formed in each plate.","When each opening is disposed in the short-side direction of the plate, as shown in FIG.","11 and FIG.","12, the structure allows the plate to have a decreased length of the short side, contributing to a downsized structure of a heat-exchanging device.","Seventh Exemplary Embodiment A seventh exemplary embodiment of the present disclosure is described with reference to FIG.","14.FIG.","14 is a cross-sectional view showing the structure of heat-exchanging device 202 of the embodiment.","As shown in FIG.","14, heat-exchanging device 202 has a structure basically the same as that of heat-exchanging device 102 (see FIG.","7) described in the third exemplary embodiment, except that condenser plate 111 has pipe 11 and pipe 12 instead of pipe 3 shown in FIG.","7.In FIG.","14, like parts are identified by the same reference marks as in FIG.","7, and the detailed description thereof is omitted.","In heat-exchanging device 202, the coolant and the refrigerant flow as follows.","As shown in FIG.","14, the coolant fed from pipe 1 passes through condenser 110 and is discharged from pipe 2.As shown in FIG.","14, the refrigerant fed from pipe 11 passes through condenser 110 and flows through the outside of pipe 12 into liquid tank 120.After passing through liquid tank 120, the refrigerant passes through intermediate heat-exchanger 140 then flows inside pipe 12 and is discharged from pipe 12 into expansion valve 20.As shown in FIG.","14, the coolant fed from pipe 4 passes through evaporator 130 and is discharged from pipe 5.As shown in FIG.","14, the refrigerant fed from pipe 6 branches into evaporator 130 and intermediate heat-exchanger 140.The refrigerant that has passed through evaporator 130 and the refrigerant that has passed through intermediate heat-exchanger 140 join again, and the joined refrigerant is discharged from pipe 7 to compressor 30.Heat-exchanging device 202 of the embodiment, as described above, has condenser 110, liquid tank 120, evaporator 130, and intermediate heat-exchanger 140.Such structured heat-exchanging device 202 of the embodiment produces the effect similar to the structure described in the sixth exemplary embodiment above.","Eighth Exemplary Embodiment An eighth exemplary embodiment of the present disclosure is described with reference to FIG.","15.FIG.","15 is a cross-sectional view showing the structure of heat-exchanging device 203 of the embodiment.","As shown in FIG.","15, heat-exchanging device 203 has a structure basically the same as that of heat-exchanging device 103 (see FIG.","9) described in the fourth exemplary embodiment, except that condenser plate 111 has pipe 11 and pipe 12 instead of pipe 3 shown in FIG.","9.In addition, the structure of FIG.","15 differs from that of FIG.","9 in that pipe 1 for coolant-IN is oppositely disposed from pipe 2 for coolant-OUT.","In FIG.","15, like parts are identified by the same reference marks as in FIG.","9, and the detailed description thereof is omitted.","In heat-exchanging device 203, the coolant and the refrigerant flow as follows.","As shown in FIG.","15, the coolant fed from pipe 1 passes through condenser 110 and is discharged from pipe 2.As shown in FIG.","15, the refrigerant fed from pipe 11 passes through condenser 110 and flows outside pipe 12 into liquid tank 120.After passing through liquid tank 120, the refrigerant passes through intermediate heat-exchanger 140 then flows inside pipe 12 and is discharged from pipe 12 into expansion valve 20.As shown in FIG.","15, the coolant fed from pipe 4 passes through evaporator 130 and is discharged from pipe 5.As shown in FIG.","15, the refrigerant that has flown from outer pipe 81 flows inside outer pipe 81 but outside inner pipe 82 and then passes through evaporator 130 into intermediate heat-exchanger 140.After passing through intermediate heat-exchanger 140, the refrigerant flows inside inner pipe 82 and is discharged from inner pipe 82 into compressor 30.Heat-exchanging device 203 of the embodiment, as described above, has condenser 110, liquid tank 120, evaporator 130, and intermediate heat-exchanger 140.Such structured heat-exchanging device 203 of the embodiment produces the effect similar to the structure described in the sixth exemplary embodiment above.","Ninth Exemplary Embodiment A ninth exemplary embodiment of the present invention is described with reference to FIG.","16.FIG.","16 is a cross-sectional view showing the structure of heat-exchanging device 204 of the embodiment.","As shown in FIG.","16, heat-exchanging device 204 has a structure basically the same as that of heat-exchanging device 104 (see FIG.","10) described in the fifth exemplary embodiment, except that condenser plate 111 has pipe 11 and pipe 12 instead of pipe 3 shown in FIG.","10.In addition, the structure of FIG.","16 differs from that of FIG.","10 in that pipe 1 for coolant-IN is oppositely disposed from pipe 2 for coolant-OUT.","In FIG.","16, like parts are identified by the same reference marks as in FIG.","10, and the detailed description thereof is omitted.","In heat-exchanging device 204, the coolant and the refrigerant flow as follows.","As shown in FIG.","16, the coolant fed from pipe 1 branches into condenser 110 and subcool condenser 150.The coolant that has passed through condenser 110 and the coolant that has passed through subcool condenser 150 join again and the joined coolant is discharged from pipe 12.As shown in FIG.","16, the refrigerant fed from pipe 11 passes through condenser 110 and flows outside pipe 12 into liquid tank 120.After passing through liquid tank 120, the refrigerant passes through subcool condenser 150 then flows inside pipe 12 and is discharged from pipe 12.Heat-exchanging device 204 of the embodiment, as described above, has condenser 110, liquid tank 120, and subcool condenser 150.Such structured heat-exchanging device 204 of the embodiment produces the effect similar to the structure described in the sixth exemplary embodiment above.","The description above is on heat-exchanging devices 200, 202, and 203 each in which the pipe for refrigerant-IN and the pipe for refrigerant-OUT are individually formed.","The structures of the first through the ninth exemplary embodiments of the present disclosure have been described so far.","However, the present disclosure is not limited to the structures described in the first through ninth exemplary embodiments above, allowing various modifications without departing from the spirit and scope of the disclosure.","Hereinafter, modification examples will be described.","For example, the plurality of plates forming the heat-exchanging device in the first through ninth exemplary embodiments may differ from each other in shape of visible outline, in size, and in dimension in the stacking direction as long as the plates are stackable.","Further, for example, the components of the heat-exchanging device described in the first through ninth exemplary embodiments (for example, condenser 110, liquid tank 120, liquid tank 120a, liquid tank 120b, evaporator 130, intermediate heat-exchanger 140, and subcool condenser 150) are not necessarily stacked in the order described in the first through ninth exemplary embodiments.","Further, for example, the first through ninth exemplary embodiments have described a positioning state where the upper section of condenser 110 is directed vertically upward, whereas each lower section of liquid tank 120, liquid tank 120b, and evaporator 130 or subcool condenser 150 is directed vertically downward.","However, the positioning state of the heat-exchanging device in use is not limited to the above.","Further, for example, the first through ninth exemplary embodiments have described an example where coolant (water) is employed for a heat carrier that exchanges heat with refrigerant, but it is not limited to; instead of coolant, oil or air may be used as the heat carrier.","Further, for example, the first through ninth exemplary embodiments have described an example where liquid tank 120, liquid tank 120a, or liquid tank 120b retain the refrigerant fed from condenser 110 by the flow passage formed of openings ‘e’, but it is not limited to.","For example, a refrigerant-retaining section may be formed by forming each of the plurality of liquid-tank plates 121 into a window-flame shape having an opening in the center.","For example, the first through ninth exemplary embodiments have described that liquid tank 120, liquid tank 120a, and liquid tank 120b have a structure of a plurality of liquid-tank plates 121 stacked one on another.","However, instead of the stacking structure of the plurality of plates, liquid tanks 120, 120a, 120b may be formed as an integrally-structured block having an accommodating space (corresponding to the refrigerant-retaining section) inside the structure.","Furthermore, seen in the stacking direction, liquid tanks 120, 120a, 120b of a block-shaped structure may differ in shape of visible outline and in size from condenser 110, evaporator 130, intermediate heat-exchanger 140, or subcool condenser 150.Further, for example, in the first through ninth exemplary embodiments, each of condenser 110, evaporator 130, intermediate heat-exchanger 140, or subcool condenser 150 may differ in shape of visible outline and in size, seen in the stacking direction, from each other.","Further, for example, the sixth through ninth exemplary embodiments have described that the inner diameter and the outer diameter of pipe 12 are smaller than those of pipe 11, but pipe 12 may be equal to pipe 11 in inner diameter and outer diameter.","Further, for example, in the third, fourth, and eighth exemplary embodiments, the pipe through which refrigerant flows into condenser 110 and the pipe through which the refrigerant is discharged after passing through condenser 110 and intermediate heat-exchanger 140 may not be formed as a double-pipe structure of outer pipe 31 and inner pipe 32.Further, for example, the fourth and eighth exemplary embodiments have described an example in which outer pipe 81 and inner pipe 82 are integrally structured.","However, they may be individually structured, like pipe 11 and pipe 12 shown in FIG.","13 through FIG.","16.The present disclosure is applicable to air-conditioning and heating equipment mountable to vehicles."]],"string":"[\n [\n \"HEAT-EXCHANGING DEVICE\",\n \"The condenser of the heat-exchanging device is provided with a flow passage through which a high-pressure refrigerant flows.\",\n \"The flow passage is structured by openings formed in the plurality of plates.\",\n \"Inside the flow passage, an inner pipe having an outer diameter smaller than the diameter of the openings is disposed.\",\n \"The part inside the flow passage but outside the inner pipe serves as a passage in which the refrigerant that has flown into the condenser flows, and the part inside the inner pipe serves as a passage in which the refrigerant that has passed through the component section flows.\"\n ],\n [\n \"1.A heat-exchanging device comprising a plate-stacked section of a plurality of plates continuously stacked one on another, the plate-stacked section comprising: a condenser having a structure where a refrigerant passage through which a high-pressure refrigerant flows and a heat-carrier passage through which a heat carrier that absorbs heat from the high-pressure refrigerant flows are stacked one on another between a part of the plurality of plates; and a component section having a structure where the refrigerant that has passed through the condenser flows between a part of the plurality of plates or via a part of the plates, wherein, in the condenser, openings respectively disposed in the plurality of plates forms a flow passage through which the refrigerant flows, inside the flow passage, a first pipe having outer diameter smaller than a diameter of each of the openings is disposed, and the first pipe is disposed such that the refrigerant that has flown into the condenser flows inside the flow passage but outside the first pipe and the refrigerant that has passed through the component section flows inside the first pipe.\",\n \"2.The heat-exchanging device according to claim 1 further comprising a second pipe which carries the high-pressure refrigerant into the condenser, wherein the first pipe and the second pipe are integrally provided.\",\n \"3.The heat-exchanging device according to claim 2, wherein the component section includes an evaporator having a structure where a flow passage through which a low-pressure refrigerant flows and a flow passage through which a heat carrier that applies heat to the low-pressure refrigerant flows are stacked one on another between a part of the plurality of plates.\",\n \"4.The heat-exchanging device according to claim 3, wherein, the component section includes an intermediate heat-exchanger that performs heat exchange between the high-pressure refrigerant that has passed through the condenser and the low-pressure refrigerant that has passed through the evaporator, in the evaporator, a flow passage through which the low-pressure refrigerant flows is formed by openings respectively disposed in the plurality of plates, inside the flow passage, a third pipe having an outer diameter smaller than a diameter of each of the openings is disposed, and the third pipe is disposed such that the refrigerant that has flown into the evaporator flows inside the flow passage but outside the third pipe and the refrigerant that has passed through the intermediate heat-exchanger flows inside the third pipe.\",\n \"5.The heat-exchanging device according to claim 4 further comprising a fourth pipe which carries the low-pressure refrigerant into the evaporator, wherein the third pipe and the fourth pipe are integrally provided.\",\n \"6.The heat-exchanging device according to claim 4 further comprising a fourth pipe which carries the low-pressure refrigerant into the evaporator, wherein the third pipe and the fourth pipe are individually provided.\",\n \"7.The heat-exchanging device according to claim 1 further comprising a second pipe which carries the high-pressure refrigerant into the condenser, wherein the first pipe and the second pipe are independently provided.\",\n \"8.The heat-exchanging device according to claim 1, wherein the component section includes at least one liquid tank which retains the high-pressure refrigerant between a part of the plurality of plates or via a part of the plates.\",\n \"9.The heat-exchanging device according to claim 1, wherein the component section includes an intermediate heat-exchanger having a structure where a flow passage through which the high-pressure refrigerant flows and a flow passage through which a low-pressure refrigerant flows are stacked one on another between a part of the plurality of plates.\",\n \"10.The heat-exchanging device according to claim 1, wherein the component section includes a subcool condenser having a structure where a flow passage through which the high-pressure refrigerant flows and a flow passage through which a heat carrier that further absorbs heat from the high-pressure refrigerant flows are stacked one on another between a part of the plurality of plates.\",\n \"11.The heat-exchanging device according to claim 1, wherein the component section includes an evaporator having a structure where a flow passage through which a low-pressure refrigerant flows and a flow passage through which a heat carrier that applies heat to the low-pressure refrigerant flows are stacked one on another between a part of the plurality of plates.\"\n ],\n [\n \" BACKGROUND \"\n ],\n [\n \" SUMMARY The heat-exchanging device of an aspect of the present disclosure has a plate-stacked section in which a plurality of plates is continuously stacked one on another.\",\n \"The plate-stacked section includes a condenser and a component section.\",\n \"The condenser has a structure where a refrigerant passage through which a high-pressure refrigerant flows and a heat-carrier passage through which a heat carrier that absorbs heat from the high-pressure refrigerant flows are stacked one on another between some plates of the plurality of plates.\",\n \"The component section has a structure where the refrigerant that has passed through the condenser flows between some plates of the plurality of plates or via some plates.\",\n \"In the condenser, openings respectively formed in the plurality of plates form a flow passage through which the refrigerant flows.\",\n \"Inside the flow passage, a first pipe having an outer diameter smaller than the diameter of each of the openings is disposed.\",\n \"The first pipe is disposed such that the refrigerant that has come into the condenser flows inside the flow passage but outside the first pipe and the refrigerant that has passed through the component section flows inside the first pipe.\",\n \"According to the present disclosure, the heat-exchanging device formed of a plurality of plates stacked one on another enhances durability of the structure.\"\n ],\n [\n \"CROSS-REFERENCE TO RELATED APPLICATIONS This application is a continuation of the PCT International Application No.\",\n \"PCT/JP2016/003551 filed on Aug. 2, 2016, which claims the benefit of foreign priority of Japanese patent application No.\",\n \"2015-155265 filed on Aug. 5, 2015, the contents all of which are incorporated herein by reference.\",\n \"BACKGROUND 1.Technical Field The present disclosure relates to a heat-exchanging device.\",\n \"2.Description of the Related Art A conventionally known heat-exchanging device, which is used for a heat-pump system, exchanges heat between a refrigerant and coolant.\",\n \"For example, Japanese Patent Unexamined Publication No.\",\n \"2013-119373 discloses a heat-exchanging device with a structure where a plate on which a refrigerant flows and a plate on which coolant flows are alternately stacked.\",\n \"According to the heat-exchanging device, a plurality of components (such as a condenser, a liquid tank, and an evaporator) is formed into an integral structure, thereby eliminating piping between the components, by which the heat-exchanging device has a compact structure and is easily assembled.\",\n \"SUMMARY The heat-exchanging device of an aspect of the present disclosure has a plate-stacked section in which a plurality of plates is continuously stacked one on another.\",\n \"The plate-stacked section includes a condenser and a component section.\",\n \"The condenser has a structure where a refrigerant passage through which a high-pressure refrigerant flows and a heat-carrier passage through which a heat carrier that absorbs heat from the high-pressure refrigerant flows are stacked one on another between some plates of the plurality of plates.\",\n \"The component section has a structure where the refrigerant that has passed through the condenser flows between some plates of the plurality of plates or via some plates.\",\n \"In the condenser, openings respectively formed in the plurality of plates form a flow passage through which the refrigerant flows.\",\n \"Inside the flow passage, a first pipe having an outer diameter smaller than the diameter of each of the openings is disposed.\",\n \"The first pipe is disposed such that the refrigerant that has come into the condenser flows inside the flow passage but outside the first pipe and the refrigerant that has passed through the component section flows inside the first pipe.\",\n \"According to the present disclosure, the heat-exchanging device formed of a plurality of plates stacked one on another enhances durability of the structure.\",\n \"BRIEF DESCRIPTION OF DRAWINGS FIG.\",\n \"1 is a block diagram showing a structure of a heat pump system in accordance with a first exemplary embodiment.\",\n \"FIG.\",\n \"2 is a perspective view showing the structure of the heat-exchanging device in accordance with the first exemplary embodiment.\",\n \"FIG.\",\n \"3 is an exploded perspective view showing the structure of the heat-exchanging device in accordance with the first exemplary embodiment.\",\n \"FIG.\",\n \"4 is a schematic view illustrating an internal structure of the heat-exchanging device in accordance with the first exemplary embodiment.\",\n \"FIG.\",\n \"5 is a schematic view illustrating an internal structure of a heat-exchanging device in accordance with a second exemplary embodiment.\",\n \"FIG.\",\n \"6 is a block diagram showing a structure of a heat pump system in accordance with a third exemplary embodiment.\",\n \"FIG.\",\n \"7 is a schematic view illustrating an internal structure of the heat-exchanging device in accordance with the third exemplary embodiment.\",\n \"FIG.\",\n \"8 is a block diagram showing a structure of a heat pump system in accordance with a fourth exemplary embodiment.\",\n \"FIG.\",\n \"9 is a schematic view illustrating an internal structure of the heat-exchanging device in accordance with the fourth exemplary embodiment.\",\n \"FIG.\",\n \"10 is a schematic view illustrating an internal structure of a heat-exchanging device in accordance with a fifth exemplary embodiment.\",\n \"FIG.\",\n \"11 is a perspective view showing a structure of a heat-exchanging device in accordance with a sixth exemplary embodiment.\",\n \"FIG.\",\n \"12 is an exploded perspective view showing the structure of the heat-exchanging device in accordance with the sixth exemplary embodiment.\",\n \"FIG.\",\n \"13 is a schematic view showing an internal structure of the heat-exchanging device in accordance with the sixth exemplary embodiment.\",\n \"FIG.\",\n \"14 is a schematic view showing an internal structure of a heat-exchanging device in accordance with a seventh exemplary embodiment.\",\n \"FIG.\",\n \"15 is a schematic view showing an internal structure of a heat-exchanging device in accordance with an eighth exemplary embodiment.\",\n \"FIG.\",\n \"16 is a schematic view showing an internal structure of a heat-exchanging device in accordance with a ninth exemplary embodiment.\",\n \"DETAILED DESCRIPTION OF PREFERRED EMBODIMENTS Prior to describing exemplary embodiments of the present disclosure, problems in the device of the related art are described briefly.\",\n \"In the heat-exchanging device of a stacked structure formed of a plurality of plates, the following flow passages are formed: a flow passage through which a refrigerant flows in the vertically downward direction; a flow passage through which the refrigerant flows in the vertically upward direction; a flow passage through which coolant flows in the vertically downward direction; and a flow passage through which the coolant flows in the vertically upward direction.\",\n \"Each of these flow passages is formed of a plurality of openings overlapped with each other and respectively formed in an end section of each plate.\",\n \"However, forming a plurality of openings lowers the strength of the plates, degrading durability of the heat-exchanging device.\",\n \"The present disclosure targets on enhancing the durability of a heat-exchanging device of a stacked structure formed of a plurality of plates.\",\n \"Hereinafter, an exemplary embodiment of the present disclosure is described in detail with reference to accompanying drawings.\",\n \"First Exemplary Embodiment Hereinafter, a first exemplary embodiment according to the present disclosure is described.\",\n \"First, a structure of heat pump system 10 of the embodiment is described with reference to FIG.\",\n \"1.FIG.\",\n \"1 is a block diagram showing the structure of heat pump system 10 of the embodiment.\",\n \"Heat pump system 10 has condenser 110, liquid tank 120 (as an example of the component section), expansion valve 20, evaporator 130, and compressor 30.In heat pump system 10 shown in FIG.\",\n \"1, heat-exchanging device 100 has an all-in-one structure, having condenser 110 and liquid tank 120 integrally.\",\n \"Compressor 30 is disposed on the upstream side of an inlet for the refrigerant of condenser 110.Compressor 30 compresses the refrigerant sucked from evaporator 130 to change it into a high-temperature and high-pressure refrigerant and then feeds the refrigerant to condenser 110.Condenser 110 performs heat exchange between coolant and the high-temperature and high-pressure refrigerant from compressor 30 to condense the refrigerant.\",\n \"The coolant is an anti-freezing solution for transferring heat, such as LLC (Long Life Coolant).\",\n \"Liquid tank 120 retains the refrigerant fed from condenser 110, performs vapor-liquid separation on the refrigerant, and controls the amount of the refrigerant.\",\n \"Expansion valve 20 is disposed on the upstream side of an inlet for the refrigerant of evaporator 130.Expansion valve 20 expands the refrigerant received from liquid tank 120 to change it into a low-temperature and low-pressure refrigerant and then feeds it to evaporator 130.Evaporator 130 is disposed on the downstream side of expansion valve 20 and on the upstream side of compressor 30.Evaporator 130 performs heat exchange between the refrigerant fed from expansion valve 20 and the coolant to evaporate the refrigerant and then feeds the refrigerant to compressor 30.Heat pump system 10 has the structure above.\",\n \"Next, the structure of heat-exchanging device 100 of the embodiment is described with reference to FIG.\",\n \"2 through FIG.\",\n \"4.FIG.\",\n \"2 is a perspective view showing the structure of heat-exchanging device 100 used for heat pump system 10 shown in FIG.\",\n \"1.FIG.\",\n \"2 shows a cross section of pipe 3.FIG.\",\n \"3 is a perspective view showing a disassembled state of a plurality of plates forming heat-exchanging device 100 of FIG.\",\n \"2.FIG.\",\n \"4 is a cross-sectional view showing the structure of heat-exchanging device 100 of FIG.\",\n \"2.FIG.\",\n \"4 also shows flowing directions of the refrigerant and the coolant in heat-exchanging device 100.Apart of each plate is omitted in FIG.\",\n \"4.As shown in FIG.\",\n \"2 and FIG.\",\n \"3, heat-exchanging device 100 has a plate-stacked section formed of a plurality of plates continuously stacked one on another.\",\n \"Each of condenser 110 and liquid tank 120 is formed of some plates of the plurality of plates of the plate-stacked section.\",\n \"Specifically, condenser 110 is formed of condenser plates 111 through 113, and liquid tank 120 is formed of liquid-tank plates 121, 122.The plurality of plates above is substantially equal in dimension in the stacking direction.\",\n \"That is, in heat-exchanging device 100, each of condenser plates 111 through 113 and each of liquid-tank plates 121, 122 are substantially equal in dimension in the stacking direction.\",\n \"In addition, the plurality of plates above is equal in size and in outer shape.\",\n \"For example, each of condenser plates 111 through 113 is equal to each of liquid-tank plates 121, 122 in profile line and dimensions orthographically projected on a plane perpendicular to the stacking direction.\",\n \"In heat-exchanging device 100, as shown in FIG.\",\n \"2 through FIG.\",\n \"4, pipe 1 and pipe 2 are connected to condenser plate 111.Pipe 1 feeds the coolant into condenser 110 and pipe 2 discharges the coolant having undergone heat exchange in condenser 110.In heat-exchanging device 100, as shown in FIG.\",\n \"2 through FIG.\",\n \"4, pipe 3 is connected to condenser plate 111.Pipe 3 feeds high-temperature and high-pressure refrigerant compressed by compressor 30 into condenser 110.After heat exchange in condenser 110, the refrigerant undergoes vapor-liquid separation by liquid tank 120.Pipe 3 discharges the refrigerant after the vapor-liquid separation to expansion valve 20.As shown in FIG.\",\n \"2 through FIG.\",\n \"4, pipe 3 has a double-pipe structure of outer-side pipe (hereinafter, outer pipe) 31 and inner-side pipe (hereinafter, inner pipe) 32.Outer pipe 31 is connected to opening ‘d’ of condenser plate 112.Inner pipe 32 is connected to openings ‘f’ of liquid-tank plates 121.Inner pipe 32 is connected to openings ‘f’ of liquid-tank plates 121.Inner pipe 32 runs through the inside of outer pipe 31 and protrudes from a side surface of outer pipe 31.Outer pipe 31 carries high-temperature and high-pressure refrigerant compressed by compressor 30 into condenser 110.After heat exchange in condenser 110, the refrigerant undergoes vapor-liquid separation by liquid tank 120.Inner pipe 32 discharges the refrigerant after the vapor-liquid separation to expansion valve 20.Next, the structure of condenser 110 of the embodiment is described.\",\n \"As shown in FIG.\",\n \"3, condenser 110 has condenser plates 111 through 113 stacked one on another.\",\n \"Under condenser plate 111 to which pipes 1 through 3 are connected, condenser plate 112 and condenser plate 113, which are different in shape, are alternately stacked.\",\n \"Condenser plate 112 is provided with openings ‘a’ through ‘d’ at its four corners.\",\n \"Bump section A is disposed around each of openings ‘b’ and ‘c’.\",\n \"Condenser plate 113 is provided with openings ‘a’ through ‘d’ at its four corners.\",\n \"Bump section A is disposed around each of openings ‘a’ and ‘d’.\",\n \"The alternately stacked structure of condenser plates 112, 113 alternately forms, between condenser plates 111 through 113, a refrigerant passage through which a high-pressure refrigerant flows and a coolant passage through which coolant for absorbing heat from the high-pressure refrigerant flows.\",\n \"The refrigerant and the coolant, without being mixed, flow through the refrigerant passage and the coolant passage, respectively.\",\n \"The refrigerant and the coolant flow the refrigerant passage and the coolant passage, respectively, in opposite directions from each other.\",\n \"In FIG.\",\n \"3, the broken-line arrow shows the flowing direction of the refrigerant, and the solid-line arrow shows the flowing direction of the coolant.\",\n \"In condenser 110, as described above, the refrigerant flows through the refrigerant passage and the coolant flows through the coolant passage, thereby the refrigerant and the coolant exchange heat therebetween, and the refrigerant is condensed.\",\n \"In addition, the alternately stacked structure of condenser plates 112, 113 allows openings ‘a’ through ‘d’ to form the following flow passages.\",\n \"A plurality of openings ‘b’ forms a flow passage through which the coolant coming from pipe 1 flows through condenser 110 in the vertically downward direction.\",\n \"A plurality of openings ‘c’ forms a flow passage in which coolant that has passed the coolant passage flows through condenser 110 in the vertically upward direction.\",\n \"After that, the coolant is discharged from pipe 2.A plurality of openings ‘a’ forms a flow passage in which refrigerant that has passed the refrigerant passage flows through condenser 110 in the vertically downward direction.\",\n \"The flow passage joins a flow passage formed of openings ‘e’ of liquid tank plates 121 (which will be described later).\",\n \"With the structure above, the refrigerant that has passed the refrigerant passage flows into liquid tank 120.A plurality of openings ‘d’ forms flow passage P in which the refrigerant flows through condenser 110.In flow passage P, as shown in FIG.\",\n \"2, inner pipe 32 having an outer diameter smaller than the diameter of opening ‘d’ (substantially the same as the inner diameter of outer pipe 31) is disposed.\",\n \"That is, flow passage P has a double-passage structure: one is the flow passage that runs inside flow passage P but outside inner pipe 32; and the other is the flow passage that runs inside inner pipe 32.The flow passage, which runs inside flow passage P but outside inner pipe 32, serves as the flow passage in which the refrigerant fed from outer pipe 31 flows through condenser 110 in the vertically downward direction.\",\n \"The flow passage inside inner pipe 32 serves as the flow passage in which the refrigerant that has passed liquid tank 120 flows through condenser 110 in the vertically upward direction.\",\n \"At the design phase of heat-exchanging device 100, the number of alternately stacked condenser plates 112, 113 determines the volume (efficiency in heat exchange) of condenser 110.FIG.\",\n \"3 and FIG.\",\n \"4 show an example where the refrigerant and the coolant flow the refrigerant passage and the coolant passage, respectively, in opposite directions from each other, but it is not limited to; the refrigerant and the coolant may flow the refrigerant passage and the coolant passage, respectively, in the same direction.\",\n \"Next, the structure of liquid tank 120 of the embodiment is described.\",\n \"As shown in FIG.\",\n \"3, liquid tank 120 has a plurality of liquid-tank plates 121 stacked one on another.\",\n \"At the bottom of liquid tank 120, liquid-tank plate 122 is disposed.\",\n \"Each of the plurality of liquid-tank plates 121 is substantially equal to liquid-tank plate 122 in dimension in the stacking direction.\",\n \"Each of liquid-tank plates 121, 122 and each of condenser plates 111 through 113 are substantially equal in dimension in the stacking direction.\",\n \"In addition, each of the plurality of liquid-tank plates 121 is substantially equal to liquid-tank plate 122 in size and in outer shape.\",\n \"Each of liquid-tank plates 121 and liquid-tank plate 122 are equal to each of condenser plates 111 through 113 in profile line and dimensions orthographically projected on a plane perpendicular to the stacking direction.\",\n \"The plurality of liquid-tank plates 121 is continuously stacked together with and to be contact with the plurality of condenser plates 111 through 113.As shown in FIG.\",\n \"2, liquid tank 120 is disposed under condenser 110.Between adjacent two of the plurality of liquid-tank plates 121, the refrigerant passage in which the refrigerant fed from condenser 110 flows is formed.\",\n \"As shown in FIG.\",\n \"3, each of liquid-tank plates 121 has openings ‘e’, ‘f’ in two of the four corners.\",\n \"Opening ‘e’ is so formed that meets with the position of openings ‘a’ of condenser plates 112, 113.The diameter of opening ‘e’ is the same with that of opening ‘a’.\",\n \"Opening ‘f’ is so formed that meets with the position of openings ‘d’ of condenser plates 112, 113.The diameter of opening ‘f’ is the same with the inner diameter of inner pipe 32.Openings ‘e’, ‘f’ are not formed in liquid-tank plate 122.The stacked structure of the plurality of liquid-tank plates 121 forms the following flow passages.\",\n \"A plurality of openings ‘e’ forms the flow passage in which the refrigerant fed from condenser 110 flows through liquid tank 120 in the vertically downward direction.\",\n \"The flow passage, as described above, joins the flow passage formed of the plurality of openings ‘a’.\",\n \"A plurality of openings ‘f’ forms the flow passage in which the refrigerant that has passed liquid tank 120 (i.e., the refrigerant passage between liquid-tank plates 121) flows through liquid tank 120 in the vertically upward direction.\",\n \"This flow passage joins the flow passage inside inner pipe 32, thereby the refrigerant that has passed liquid tank 120 is discharged from inner pipe 32 to expansion vale 20.At the design phase of heat-exchanging device 100, the number of alternately stacked liquid-tank plates 121 determines the volume (capacity) of liquid tank 120.Heat-exchanging device 100 is thus structured.\",\n \"In heat-exchanging device 100 with the structure above, the coolant and the refrigerant flow as follows.\",\n \"As shown in FIG.\",\n \"4, the coolant fed from pipe 1 passes through condenser 110 and is discharged from pipe 2.As shown in FIG.\",\n \"4, the refrigerant, which has flown into outer pipe 31, flows through the inside of outer pipe 31 but the outside of inner pipe 32.After passing through condenser 110 and liquid tank 120, the refrigerant flows inside inner pipe 32 and is discharged from inner pipe 32 into expansion valve 20.As described above, according to heat-exchanging device 100 of the embodiment, condenser 110 has flow passage P formed of a plurality of openings ‘d’ respectively formed in the plurality of condenser plates 111 through 113.A high-pressure refrigerant flows through flow passage P. Inside flow passage P, inner pipe 32 (as an example of the first pipe) having an outer diameter smaller than the diameter of opening ‘d’ is disposed.\",\n \"Inner pipe 32 is structured such that the refrigerant that has flown into condenser 110 flows inside flow passage P but outside inner pipe 32; at the same time, the refrigerant that has passed liquid tank 120 flows inside inner pipe 32.In general, a heat-exchanging device having a condenser and a liquid tank has the following flow passages for refrigerant: a flow passage in which the refrigerant fed from the compressor flows through the condenser in the vertically downward direction; a flow passage in which the refrigerant that has passed the refrigerant passage of the condenser flows through the condenser and the liquid tank in the vertically downward direction; and a flow passage in which the refrigerant that has passed the refrigerant passage of the liquid tank flows through the condenser in the vertically upward direction.\",\n \"To form the three flow passages above, each plate has to be provided with three openings.\",\n \"In contrast, according to the embodiment, inner pipe 32 is disposed in flow passage P formed of openings ‘d’.\",\n \"With the above structure, the refrigerant fed from the compressor flows inside flow passage P but outside inner pipe 32, and the refrigerant that has passed the refrigerant passage of the liquid tank flows inside inner pipe 32.The structure of the embodiment allows the openings, which are to be formed in each plate for forming the refrigerant passages, to be decreased to two: openings ‘a’ and ‘d’ for condenser plates 111 through 113; and openings ‘e’ and ‘f’ for liquid-tank plates 121.According to the embodiment, the openings in each plate can be decreased in number, thereby ensuring strength of the plates.\",\n \"That is, the structure enhances durability of the heat-exchanging device.\",\n \"As described above, the structure of the embodiment achieves decrease in number of the openings to be formed in each plate.\",\n \"When each opening is disposed in the short-side direction of the plate, as shown in FIG.\",\n \"2 and FIG.\",\n \"3, the structure allows the plate to have a decreased length of the short side, contributing to a downsized structure of a heat-exchanging device.\",\n \"Second Exemplary Embodiment A second exemplary embodiment of the present disclosure is now described.\",\n \"The description of the first exemplary embodiment shows an example of a heat-exchanging device having the condenser and the liquid tank.\",\n \"The heat-exchanging device may further include an evaporator.\",\n \"The embodiment describes heat-exchanging device 101 having condenser 110, liquid tank 120, and evaporator 130 (as an example of the component section) in heat pump system 10 shown in FIG.\",\n \"1.The structure of heat-exchanging device 101 of the embodiment is described with reference to FIG.\",\n \"5.FIG.\",\n \"5 is a cross-sectional view showing the structure of heat-exchanging device 101 of the embodiment.\",\n \"FIG.\",\n \"5 also shows a flowing direction of refrigerant and coolant in heat-exchanging device 101.Apart of each plate is omitted in FIG.\",\n \"5.In FIG.\",\n \"5, like parts are identified by the same reference marks as in FIG.\",\n \"4, and the detailed description thereof is omitted.\",\n \"As shown in FIG.\",\n \"5, condenser 110 and liquid tank 120 in heat-exchanging device 101 are the same with the structure in the first exemplary embodiment.\",\n \"As shown in FIG.\",\n \"5, heat-exchanging device 101 has evaporator 130 under liquid tank 120.Evaporator 130 is formed of a plurality of evaporator plates 131 stacked one on another.\",\n \"Evaporator plates 131 are substantially equal in dimension in the stacking direction, and they are equal in size and in outer shape.\",\n \"Each of evaporator plates 131 is substantially equal to each of condenser plates 111 through 113 and each of liquid-tank plates 121, 122 in dimension in the stacking direction.\",\n \"In addition, each of evaporator plates 131 is substantially equal to each of condenser plates 111 through 113 and each of liquid-tank plates 121, 122 in profile line and dimensions orthographically projected on a plane perpendicular to the stacking direction.\",\n \"As shown in FIG.\",\n \"5, pipe 4 and pipe 5 are connected to the lowermost one of evaporator plates 131.Pipe 4 carries the coolant into evaporator 130 and pipe 5 discharges the coolant that has undergone heat exchange in evaporator 130.Further, pipe 6 and pipe 7 are connected to the lowermost one of evaporator plates 131.Pipe 6 carries the low-temperature and low-pressure refrigerant that has been expanded at expansion valve 20 into evaporator 130.Pipe 7 discharges the refrigerant that has undergone heat exchange in evaporator 130 into compressor 30.The plurality of evaporator plates 131 is continuously stacked (with no space) under the plurality of condenser plates 111 through 113 and the plurality of liquid-tank plates 121, 122.Thus, evaporator 130 is disposed under liquid tank 120.In evaporator 130, between adjacent two of the plurality of evaporator plates 131 stacked one on another, a refrigerant passage through which a low-pressure refrigerant flows and a coolant passage through which coolant that provides the low-pressure refrigerant with heat flows are stacked one on another.\",\n \"To be specific, differently-shaped evaporator plates 131 (for example, one is the same in shape with condenser plate 112, and the other is the same in shape with condenser plate 113) are alternately stacked.\",\n \"This allows the refrigerant passages and the coolant passages to be alternately formed between the plurality of evaporator plates 131.By virtue of the structure, the refrigerant and the coolant, without being mixed, flow the refrigerant passage and the coolant passage, respectively.\",\n \"The refrigerant and the coolant pass through the refrigerant passage and the coolant passage, respectively, in opposite directions from each other.\",\n \"In evaporator 130, as described above, the refrigerant flows through the refrigerant passage and the coolant flows through the coolant passage, thereby the refrigerant and the coolant exchange heat therebetween, and the refrigerant is evaporated.\",\n \"At the design phase of heat-exchanging device 101, the number of differently-shaped evaporator plates 131 alternately stacked one on another determines the volume (efficiency in heat exchange) of evaporator 130.FIG.\",\n \"5 shows an example where the refrigerant and the coolant flow the refrigerant passage and the coolant passage, respectively, in opposite directions from each other, but it is not limited to; the refrigerant and the coolant may flow the refrigerant passage and the coolant passage, respectively, in the same direction.\",\n \"Heat-exchanging device 101 is thus structured.\",\n \"In heat-exchanging device 101 with the structure above, the coolant and the refrigerant flow as follows.\",\n \"As shown in FIG.\",\n \"5, the coolant fed from pipe 1 passes through condenser 110 and is discharged from pipe 2.As shown in FIG.\",\n \"5, the refrigerant, which has flown into outer pipe 31, flows through the inside of outer pipe 31 but the outside of inner pipe 32.After passing through condenser 110 and liquid tank 120, the refrigerant flows through the inside of inner pipe 32 and is discharged into expansion valve 20.In addition, as shown in FIG.\",\n \"5, the coolant fed from pipe 4 passes through evaporator 130 and is discharged from pipe 5.As shown in FIG.\",\n \"5, the refrigerant fed from pipe 6 passes through evaporator 130 and is discharged from pipe 7 into compressor 130.Heat-exchanging device 101 of the embodiment, as described above, has condenser 110, liquid tank 120, and evaporator 130.Such structured heat-exchanging device 101 of the embodiment produces the effect similar to the structure described in the first exemplary embodiment.\",\n \"Third Exemplary Embodiment A third exemplary embodiment of the present disclosure is described.\",\n \"The description of the second exemplary embodiment shows an example of the heat-exchanging device including the condenser, the liquid tank, and the evaporator.\",\n \"The heat-exchanging device may further include an intermediate heat-exchanger (IHX).\",\n \"The embodiment describes heat-exchanging device 102 including condenser 110, liquid tank 120, evaporator 130, and intermediate heat-exchanger 140 (as an example of the component section).\",\n \"First, the structure of heat pump system 10a of the embodiment is described with reference to FIG.\",\n \"6.FIG.\",\n \"6 is a block diagram showing the structure of heat pump system 10a of the embodiment.\",\n \"In FIG.\",\n \"6, like parts are identified by the same reference marks as in FIG.\",\n \"1, and the detailed description thereof is omitted.\",\n \"Heat pump system 10a has heat-exchanging device 102, expansion valve 20, and compressor 30.Heat-exchanging device 102 has condenser 110, liquid tank 120, evaporator 130, and intermediate heat-exchanger 140.Intermediate heat-exchanger 140 performs heat exchange between a high-temperature and high-pressure refrigerant fed from condenser 110 via liquid tank 120 (shown by the broken line) and a low-temperature and low-pressure refrigerant fed from expansion valve 20 (shown by the dashed-dotted line).\",\n \"After the heat exchange in intermediate heat-exchanger 140, the refrigerant that has been fed from condenser 110 via liquid tank 120 is discharged to expansion valve 20.Meanwhile, the refrigerant that has been fed from expansion valve 20 joins with the heat-exchanged refrigerant at evaporator 130 and is sucked into compressor 30.In this way, intermediate heat-exchanger 140 performs heat exchange between the high-temperature and high-pressure refrigerant fed from condenser 110 via liquid tank 120 and the low-temperature and low-pressure refrigerant fed from expansion valve 20.Heat pump system 10a of the embodiment is thus structured.\",\n \"Next, the structure of heat-exchanging device 102 of the embodiment will be described with reference to FIG.\",\n \"7.FIG.\",\n \"7 is a cross-sectional view showing the structure of heat-exchanging device 102 of the embodiment.\",\n \"FIG.\",\n \"7 also shows flowing directions of the refrigerant and the coolant in heat-exchanging device 102.Apart of each plate is omitted in FIG.\",\n \"7.In FIG.\",\n \"7, like parts are identified by the same reference marks as in FIG.\",\n \"5, and the detailed description thereof is omitted.\",\n \"The structure of FIG.\",\n \"7 differs from the structure of FIG.\",\n \"5 in the followings: pipe 1 for feeding the coolant (coolant-IN) is oppositely disposed from pipe 2 for discharging the coolant (coolant-OUT) and pipe 3 for feeding and discharging the refrigerant (refrigerant-IN/OUT): pipe 4 for feeding the coolant (coolant-IN) is oppositely disposed from pipe 5 for discharging the coolant (coolant-OUT); and pipe 6 for feeding the refrigerant (refrigerant-IN) is oppositely disposed from pipe 7 for discharging the refrigerant (refrigerant-OUT).\",\n \"As shown in FIG.\",\n \"7, heat-exchanging device 102 has intermediate heat-exchanger 140 disposed at a position lower than liquid tank 120 and higher than evaporator 130.Intermediate heat-exchanger 140 is formed of a plurality of IHX plates 141 stacked one on another.\",\n \"The plurality of IHX plates 141 is substantially equal in dimension in the stacking direction and is equal in size and in outer shape.\",\n \"Each of the plurality of IHX plates 141 is substantially equal to each of condenser plates 111 through 113, each of liquid-tank plates 121, and each of evaporator plates 131 in dimension in the stacking direction.\",\n \"In addition, each of the plurality of IHX plates 141 is substantially equal to each of condenser plates 111 through 113, each of liquid-tank plates 121, 122, and each of evaporator plates 131 in profile line and dimensions orthographically projected on a plane perpendicular to the stacking direction.\",\n \"The plurality of IHX plates 141 is continuously stacked with the plurality of condenser plates 111 through 113 and the plurality of liquid-tank plates 121, so that intermediate heat-exchanger 140 is located under liquid tank 120.Liquid tank 120 of the embodiment has no liquid-tank plate 122 shown in FIG.\",\n \"3 at the bottom.\",\n \"Similarly, the plurality of evaporator plates 131 is continuously stacked with the plurality of condenser plates 111 through 113, the plurality of liquid-tank plates 121, and the plurality of IHX plates 141, so that evaporator 130 is located under intermediate heat-exchanger 140.Intermediate heat-exchanger 140 is structured such that first refrigerant-passages each in which a high-pressure refrigerant fed from condenser 110 flows and second refrigerant-passages each in which a low-pressure refrigerant fed from expansion valve 20 flows are disposed between the plurality of IHX plates 141 stacked one on another.\",\n \"Specifically, differently-shaped IHX plates 141 (for example, one is equal to condenser plate 112 in shape, and the other is equal to condenser plate 113 in shape) are alternately stacked, thereby the first refrigerant-passages and the second refrigerant-passages are alternately formed between the plurality of IHX plates 141.The refrigerant coming from condenser 110 and the refrigerant coming from expansion valve 20, without being mixed, pass through the first refrigerant-passage and the second refrigerant-passage, respectively.\",\n \"In addition, the refrigerant coming from condenser 110 and the refrigerant coming from expansion valve 20 pass through the first refrigerant-passage and the second refrigerant-passage, respectively, in opposite directions from each other.\",\n \"In intermediate heat-exchanger 140, as described above, the refrigerant fed from condenser 110 flows through the first refrigerant-passage and the refrigerant fed from expansion valve 20 flows through the second refrigerant-passage, thus the high-pressure refrigerant and the low-pressure refrigerant exchange heat therebetween.\",\n \"As shown in FIG.\",\n \"7, inner pipe 32 of the embodiment is connected to the opening where liquid tank 120 communicates with intermediate heat-exchanger 140 in liquid-tank plates 121.The structure allows the refrigerant that has passed the first refrigerant-passage of intermediate heat-exchanger 140 to be discharged from inner pipe 32 to expansion valve 20.Meanwhile, the refrigerant that has passed the second refrigerant-passage of intermediate heat-exchanger 140 joins the refrigerant coming from evaporator 130 and is discharged from pipe 7 to compressor 30.At the design phase of heat-exchanging device 102, the number of differently-shaped IHX plates 141 to be alternately stacked determines the volume (efficiency in heat exchange) of intermediate heat-exchanger 140.FIG.\",\n \"7 shows an example where the refrigerant and the coolant flow the refrigerant passage and the coolant passage, respectively, in opposite directions from each other, but it is not limited to; the refrigerant and the coolant may flow the refrigerant passage and the coolant passage, respectively, in the same direction.\",\n \"Similarly, FIG.\",\n \"7 shows an example where the refrigerant from condenser 110 and the refrigerant from expansion valve 20 pass through the first refrigerant-passage and the second refrigerant-passage, respectively, in opposite directions from each other, but it is not limited to; the refrigerant from condenser 110 and the refrigerant from expansion valve 20 may pass through the first refrigerant-passage and the second refrigerant-passage, respectively, in the same direction.\",\n \"Heat-exchanging deice 102 is thus structured.\",\n \"In heat-exchanging device 102 with the structure above, the coolant and the refrigerant flow as follows.\",\n \"As shown in FIG.\",\n \"7, the coolant fed from pipe 1 passes through condenser 110 and is discharged from pipe 2.As shown in FIG.\",\n \"7, the refrigerant, which has flown into outer pipe 31, flows through the inside of outer pipe 31 but the outside of inner pipe 32.After passing through condenser 110, the refrigerant branches into liquid tank 120 and intermediate heat-exchanger 140.The refrigerant that has passed intermediate heat-exchanger 140 flows through the inside of inner pipe 32 and is discharged from inner pipe 32 into expansion valve 20.Besides, as shown in FIG.\",\n \"7, the coolant fed from pipe 4 passes through evaporator 130 and is discharged from pipe 5.As shown in FIG.\",\n \"7, the refrigerant fed from pipe 6 branches into evaporator 130 and intermediate heat-exchanger 140.The refrigerant that has passed evaporator 130 and the refrigerant that has passed intermediate heat-exchanger 140 join again, and it is discharged from pipe 7 to compressor 30.Heat-exchanging device 102 of the embodiment, as described above, has condenser 110, liquid tank 120, evaporator 130, and intermediate heat-exchanger 140.Such structured heat-exchanging device 102 of the embodiment produces the effect similar to the structure described in the first exemplary embodiment.\",\n \"Fourth Exemplary Embodiment A fourth exemplary embodiment of the present disclosure is described.\",\n \"Although the third exemplary embodiment has described an example of a parallel structure where the refrigerant fed from the expansion valve branches in parallel into the intermediate heat-exchanger and the evaporator, the refrigerant from the expansion valve may flow into the intermediate heat-exchanger via the evaporator in series.\",\n \"The exemplary embodiment describes heat-exchanging device 103 with such a series structure in which the refrigerant fed from the expansion valve passes through the evaporator and flows into the intermediate heat-exchanger.\",\n \"First, the structure of heat pump system 10b of the embodiment is described with reference to FIG.\",\n \"8.FIG.\",\n \"8 is a block diagram showing the structure of heat pump system 10b of the embodiment.\",\n \"In FIG.\",\n \"8, like parts are identified by the same reference marks as in FIG.\",\n \"6, and the detailed description thereof is omitted.\",\n \"Intermediate heat-exchanger 140 performs heat exchange between a high-temperature and high-pressure refrigerant fed from condenser 110 via liquid tank 120 (shown by the broken line) and low-temperature and a low-pressure refrigerant fed from evaporator 130 (shown by the dashed-dotted line).\",\n \"After the heat exchange in intermediate heat-exchanger 140, the refrigerant fed from condenser 110 via liquid tank 120 is discharged to expansion valve 20.Meanwhile, the refrigerant fed from evaporator 130 is sucked into compressor 30.In this way, intermediate heat-exchanger 140 performs heat exchange between the high-temperature and high-pressure refrigerant fed from condenser 110 and the low-temperature and low-pressure refrigerant fed from expansion valve 20.Heat pump system 10b of the embodiment is thus structured.\",\n \"Next, the structure of heat-exchanging device 103 of the embodiment is described with reference to FIG.\",\n \"9.FIG.\",\n \"9 is a cross-sectional view showing the structure of heat-exchanging device 103 of the embodiment.\",\n \"FIG.\",\n \"9 also shows flowing directions of the refrigerant and the coolant in heat-exchanging device 103.Apart of each plate is omitted in FIG.\",\n \"9.In FIG.\",\n \"9, like parts are identified by the same reference marks as in FIG.\",\n \"7, and the detailed description thereof is omitted.\",\n \"As shown in FIG.\",\n \"9, pipe 4 for refrigerant-IN, pipe 5 for coolant-OUT, and pipe 8 for refrigerant-IN/OUT are connected to the lowermost plate of evaporator plates 131 of evaporator 130.Like pipe 3, pipe 8 has a double-pipe structure of outer pipe 81 and inner pipe 82.The inner diameter of outer pipe 81 is greater than the outer diameter of inner pipe 82.Inner pipe 82 is connected to the openings formed in IHX plates 141.The openings connect intermediate heat-exchanger 140 with evaporator 130.Inner pipe 82 runs through the inside of outer pipe 81 and protrudes from a side surface of outer pipe 81.Outer pipe 81 carries the low-temperature and low-pressure refrigerant expanded by expansion valve 20 into evaporator 130.Inner pipe 82 discharges the refrigerant having undergone heat exchange in intermediate heat-exchanger 140 to compressor 30.As shown in FIG.\",\n \"9, the part that is the inside of outer pipe 81 but is the outside of inner pipe 82 serves as a flow passage in which the refrigerant that has flown into evaporator 130 flows through evaporator 130 in the vertically upward direction.\",\n \"As shown in FIG.\",\n \"9, the inside of inner pipe 82 serves as a flow passage in which the refrigerant that has passed intermediate heat-exchanger 140 flows through evaporator 130 in the vertically downward direction.\",\n \"Heat-exchanging device 103 is thus structured.\",\n \"In heat-exchanging device 103 with the structure above, the coolant and the refrigerant flow as follows.\",\n \"As shown in FIG.\",\n \"9, the coolant fed from pipe 1 passes through condenser 110 and is discharged from pipe 2.As shown in FIG.\",\n \"9, the refrigerant, which has flown from outer pipe 31, flows through the inside of outer pipe 31 but the outside of inner pipe 32.After passing through condenser 110, the refrigerant branches into liquid tank 120 and intermediate heat-exchanger 140.The refrigerant that has passed through intermediate heat-exchanger 140 flows through the inside of inner pipe 32 and is discharged from pipe 32 to expansion valve 20.As shown in FIG.\",\n \"9, the coolant fed from pipe 4 passes through evaporator 130 and is discharged from pipe 5.As shown in FIG.\",\n \"9, the refrigerant fed from outer pipe 81 runs through the inside of outer pipe 81 but the outside of inner pipe 82.After passing through evaporator 130, the refrigerant flows into intermediate heat-exchanger 140.After passing through intermediate heat-exchanger 140, the refrigerant flows through the inside of inner pipe 82 and is discharged from inner pipe 82 to compressor 130.Heat-exchanging device 103 of the embodiment, as described above, has condenser 110, liquid tank 120, evaporator 130, and intermediate heat-exchanger 140.Such structured heat-exchanging device 103 of the embodiment produces the effect similar to the structure described in the first exemplary embodiment.\",\n \"Fifth Exemplary Embodiment A fifth exemplary embodiment according to the present disclosure is described.\",\n \"Although the first exemplary embodiment described an example of a heat-exchanging device having a condenser and a liquid tank, the heat-exchanging device may include a subcool condenser.\",\n \"The embodiment describes heat-exchanging device 104 having condenser 110, liquid tank 120, and subcool condenser 150 (as an example of the component section).\",\n \"The structure of heat-exchanging device 104 of the embodiment is described with reference to FIG.\",\n \"10.FIG.\",\n \"10 is a cross-sectional view showing the structure of heat-exchanging device 104 of the embodiment.\",\n \"FIG.\",\n \"10 also shows flowing directions of the refrigerant and the coolant in heat-exchanging device 104.Apart of each plate is omitted in FIG.\",\n \"10.In FIG.\",\n \"10, like parts are identified by the same reference marks as in FIG.\",\n \"4, and the detailed description thereof is omitted.\",\n \"The structure of FIG.\",\n \"10 differs from that of FIG.\",\n \"4 in that pipe 1 for coolant-IN is oppositely disposed from pipe 2 for coolant-OUT and pipe 3 for refrigerant-IN/OUT.\",\n \"As shown in FIG.\",\n \"10, heat-exchanging device 104 has subcool condenser 150 under liquid tank 120.Subcool condenser 150 is formed of a plurality of subcool-condenser plates 151 stacked one on another.\",\n \"Subcool-condenser plates 151 are substantially equal in dimension in the stacking direction and are equal in size and in outer shape.\",\n \"Each of the plurality of subcool-condenser plates 151 is substantially equal to each of condenser plates 111 through 113 and each of liquid-tank plates 121 in dimensions in the stacking direction.\",\n \"In addition, each of the plurality of subcool-condenser plates 151 is equal to each of condenser plates 111 through 113 and each of liquid-tank plates 121 in profile line and dimensions orthographically projected on a plane perpendicular to the stacking direction.\",\n \"The plurality of subcool-condenser plates 151 is continuously stacked with the plurality of condenser plates 111 through 113 and the plurality of liquid-tank plates 121.That is, subcool condenser 150 is located under liquid tank plates 121.Liquid tank 120 of the embodiment has no liquid-tank plate 122 shown in FIG.\",\n \"3 at the bottom.\",\n \"In subcool condenser 150, a refrigerant passage through which the low-pressure refrigerant flows and a coolant passage through which the coolant that applies the low-pressure refrigerant with heat flows are disposed between the plurality of subcool-condenser plates 151 of the stacked structure.\",\n \"Specifically, differently-shaped subcool-condenser plates 151 (for example, one is equal to condenser plate 112 in shape, and the other is equal to condenser plate 113 in shape) are alternately stacked, thereby the refrigerant passage and the coolant passage are alternately formed between the plurality of subcool-condenser plates 151.The refrigerant and the coolant, without being mixed, pass through the refrigerant passage and the refrigerant passage, respectively, in the same direction.\",\n \"In subcool condenser 150, as described above, the refrigerant flows through the refrigerant passage and the coolant flows through the coolant passage, thus the refrigerant and the coolant exchange heat therebetween, and the refrigerant is further compressed.\",\n \"At the design phase of heat-exchanging device 104, the number of alternately stacked subcool-condenser plates 151 of a different shape determines the volume (efficiency in heat exchange) of subcool condenser 150.FIG.\",\n \"10 shows an example where the refrigerant and the coolant flow the refrigerant passage and the coolant passage, respectively, in the same direction, but it is not limited to; the refrigerant and the coolant may flow the refrigerant passage and the coolant passage, respectively, in opposite directions from each other.\",\n \"Heat-exchanging device 104 of the embodiment is thus structured.\",\n \"In heat-exchanging device 104 with the structure above, the coolant and the refrigerant flow as follows.\",\n \"As shown in FIG.\",\n \"10, the coolant fed from pipe 1 branches into condenser 110 and subcool condenser 150.The coolant that has passed through condenser 110 and the coolant that has passed through subcool condenser 150 join together and the joined coolant is discharged from pipe 2.As shown in FIG.\",\n \"10, the refrigerant, which has flown from outer pipe 31, flows through the inside of outer pipe 31 but the outside of inner pipe 32.After passing through condenser 110, the refrigerant branches into liquid tank 120 and subcool condenser 150.The refrigerant that has passed through subcool condenser 150 flows through the inside of inner pipe 32 and is discharged from pipe 32.Heat-exchanging device 104 of the embodiment, as described above, has condenser 110, liquid tank 120, and subcool condenser 150.Such structured heat-exchanging device 104 of the embodiment produces the effect similar to the structure described in the first exemplary embodiment.\",\n \"The descriptions above are on heat-exchanging devices 100 through 104 in which the pipe for refrigerant-IN and the pipe for refrigerant-OUT are integrally formed.\",\n \"In contrast, the descriptions hereinafter are on heat-exchanging devices 200, 202, and 203 in which a pipe for refrigerant-IN and a pipe for refrigerant-OUT are individually formed.\",\n \"Sixth Exemplary Embodiment A sixth exemplary embodiment of the present disclosure is described.\",\n \"The structure of heat-exchanging device 200 of the embodiment is described with reference to FIG.\",\n \"11 though FIG.\",\n \"13.FIG.\",\n \"11 is a perspective view showing the structure of heat-exchanging device 200.FIG.\",\n \"11 also shows a cross section of pipe 12.FIG.\",\n \"12 is a perspective view showing the state where the plurality of plates forming heat-exchanging device 200 of FIG.\",\n \"11 is disassembled.\",\n \"FIG.\",\n \"13 is a cross-sectional view showing the structure of heat-exchanging device 200 of FIG.\",\n \"11.FIG.\",\n \"13 also shows flowing directions of refrigerant and coolant in heat-exchanging device 200.A part of each plate is omitted in FIG.\",\n \"13.In FIGS.\",\n \"11 to 13, like parts are identified by the same reference marks as in FIGS.\",\n \"2 to 4, respectively, and the detailed description thereof is omitted.\",\n \"As shown in FIG.\",\n \"11 through FIG.\",\n \"13, in heat-exchanging device 200, liquid tank 120a (as an example of the component section) and liquid tank 120b (as an example of the component section) are disposed under condenser 110.Liquid tank 120a is formed of a plurality of liquid-tank plates 121 stacked one on another.\",\n \"Liquid tank 120b, which is also formed of a plurality of liquid-tank plates 121 stacked one on another, has liquid-tank plate 122 at the bottom.\",\n \"As shown in FIG.\",\n \"12, each of liquid-tank plates 121 that form liquid tank 120a is provided with opening ‘g’.\",\n \"The diameter of opening ‘g’ is the same with that of opening ‘d’ of each of condenser plates 111 through 113.The flow passage formed by the plurality of openings ‘g’ communicates the flow passage formed by the plurality of openings A′, thereby forming flow-passage P in which refrigerant flows through condenser 110 and liquid tank 120a, as shown in FIG.\",\n \"11.As shown in FIG.\",\n \"11 and FIG.\",\n \"12, in addition to pipe 1 for coolant-IN and pipe 2 for coolant-OUT, pipe 11 and pipe 12 are connected to condenser plate 111.The high-temperature and high-pressure refrigerant compressed by compressor 30 flows through pipe 11 into condenser 110.After performing heat exchange in condenser 110, the refrigerant undergoes vapor-liquid separation in liquid tanks 120a and 120b.\",\n \"Through pipe 12, the refrigerant is discharged to expansion valve 20.In FIG.\",\n \"12, a broken-line arrow shows the flowing direction of refrigerant, and a solid-line arrow shows the flowing direction of coolant.\",\n \"As shown in FIG.\",\n \"12, the outer diameter of pipe 12 is smaller than the diameter of openings ‘d’ and ‘g’.\",\n \"As shown in FIG.\",\n \"11, pipe 12 is disposed in flow passage P formed of openings ‘d’ and ‘g’.\",\n \"That is, flow passage P has a double-pipe structure having a flow passage formed of the inside of flow passage P but the outside of pipe 12 and a flow passage formed of the inside of pipe 12.The flow passage that runs the inside of flow passage P but the outside of pipe 12 serves as the flow passage in which the refrigerant fed from pipe 11 flows through condenser 110 and liquid tank 120a in the vertically downward direction.\",\n \"The flow passage that runs the inside of pipe 12 serves as the flow passage in which the refrigerant that has passed condenser 110 and liquid tanks 120a, 120b flows through condenser 110 and liquid tank 120 in the vertically upward direction.\",\n \"Heat-exchanging device 200 is thus structured.\",\n \"In heat-exchanging device 200 with the structure above, the coolant and the refrigerant flow as follows.\",\n \"As shown in FIG.\",\n \"13, the coolant fed from pipe 1 passes through condenser 110 and is discharged from pipe 2.As shown in FIG.\",\n \"13, the refrigerant fed from pipe 11 flows through condenser 110 and then the outside of pipe 12 into liquid tank 120a.\",\n \"After passing through liquid tank 120a, the refrigerant flows through liquid tank 120b and the inside of pipe 12 and is discharged from pipe 12 into expansion valve 20.As described above, according to heat-exchanging device 200 of the embodiment, condenser 110 and liquid tank 120a have flow passage P formed of openings ‘d’ and ‘g’, and high-pressure refrigerant flows therethrough.\",\n \"Pipe 12 (as an example of the first pipe) is disposed inside flow passage P. The outer diameter of pipe 12 is smaller than the diameter of openings ‘d’ and ‘g’.\",\n \"Pipe 12 is disposed in flow passage P so that the refrigerant that has flown into condenser 110 flows inside flow passage P but outside pipe 12; at the same time, the refrigerant that has passed through liquid tank 120b flows inside pipe 12.As described in the first exemplary embodiment, in a conventional heat-exchanging device having condenser 110 and a liquid tank, each plate has to be provided with three openings to form the flow passage for refrigerant.\",\n \"In contrast, according to the embodiment, pipe 12 is disposed in flow passage P formed of openings ‘d’ and ‘g’.\",\n \"The structure allows the refrigerant fed from the compressor to flow the inside of flow passage P but the outside of pipe 12 and the refrigerant that has passed through the refrigerant passage of the liquid tank to flow the inside of pipe 12.By virtue of the structure of the embodiment, the number of the openings for forming the refrigerant passages is decreased to two (i.e., opening ‘a’ and opening ‘d’ in condenser plates 111 through 113, and opening ‘e’ and opening ‘g’ or ‘f’ in liquid-tank plate 121).\",\n \"According to the embodiment, the openings in each plate can be decreased in number, thereby ensuring strength of the plates.\",\n \"That is, the structure enhances durability of the heat-exchanging device.\",\n \"As described above, the structure of the embodiment achieves decrease in number of the openings to be formed in each plate.\",\n \"When each opening is disposed in the short-side direction of the plate, as shown in FIG.\",\n \"11 and FIG.\",\n \"12, the structure allows the plate to have a decreased length of the short side, contributing to a downsized structure of a heat-exchanging device.\",\n \"Seventh Exemplary Embodiment A seventh exemplary embodiment of the present disclosure is described with reference to FIG.\",\n \"14.FIG.\",\n \"14 is a cross-sectional view showing the structure of heat-exchanging device 202 of the embodiment.\",\n \"As shown in FIG.\",\n \"14, heat-exchanging device 202 has a structure basically the same as that of heat-exchanging device 102 (see FIG.\",\n \"7) described in the third exemplary embodiment, except that condenser plate 111 has pipe 11 and pipe 12 instead of pipe 3 shown in FIG.\",\n \"7.In FIG.\",\n \"14, like parts are identified by the same reference marks as in FIG.\",\n \"7, and the detailed description thereof is omitted.\",\n \"In heat-exchanging device 202, the coolant and the refrigerant flow as follows.\",\n \"As shown in FIG.\",\n \"14, the coolant fed from pipe 1 passes through condenser 110 and is discharged from pipe 2.As shown in FIG.\",\n \"14, the refrigerant fed from pipe 11 passes through condenser 110 and flows through the outside of pipe 12 into liquid tank 120.After passing through liquid tank 120, the refrigerant passes through intermediate heat-exchanger 140 then flows inside pipe 12 and is discharged from pipe 12 into expansion valve 20.As shown in FIG.\",\n \"14, the coolant fed from pipe 4 passes through evaporator 130 and is discharged from pipe 5.As shown in FIG.\",\n \"14, the refrigerant fed from pipe 6 branches into evaporator 130 and intermediate heat-exchanger 140.The refrigerant that has passed through evaporator 130 and the refrigerant that has passed through intermediate heat-exchanger 140 join again, and the joined refrigerant is discharged from pipe 7 to compressor 30.Heat-exchanging device 202 of the embodiment, as described above, has condenser 110, liquid tank 120, evaporator 130, and intermediate heat-exchanger 140.Such structured heat-exchanging device 202 of the embodiment produces the effect similar to the structure described in the sixth exemplary embodiment above.\",\n \"Eighth Exemplary Embodiment An eighth exemplary embodiment of the present disclosure is described with reference to FIG.\",\n \"15.FIG.\",\n \"15 is a cross-sectional view showing the structure of heat-exchanging device 203 of the embodiment.\",\n \"As shown in FIG.\",\n \"15, heat-exchanging device 203 has a structure basically the same as that of heat-exchanging device 103 (see FIG.\",\n \"9) described in the fourth exemplary embodiment, except that condenser plate 111 has pipe 11 and pipe 12 instead of pipe 3 shown in FIG.\",\n \"9.In addition, the structure of FIG.\",\n \"15 differs from that of FIG.\",\n \"9 in that pipe 1 for coolant-IN is oppositely disposed from pipe 2 for coolant-OUT.\",\n \"In FIG.\",\n \"15, like parts are identified by the same reference marks as in FIG.\",\n \"9, and the detailed description thereof is omitted.\",\n \"In heat-exchanging device 203, the coolant and the refrigerant flow as follows.\",\n \"As shown in FIG.\",\n \"15, the coolant fed from pipe 1 passes through condenser 110 and is discharged from pipe 2.As shown in FIG.\",\n \"15, the refrigerant fed from pipe 11 passes through condenser 110 and flows outside pipe 12 into liquid tank 120.After passing through liquid tank 120, the refrigerant passes through intermediate heat-exchanger 140 then flows inside pipe 12 and is discharged from pipe 12 into expansion valve 20.As shown in FIG.\",\n \"15, the coolant fed from pipe 4 passes through evaporator 130 and is discharged from pipe 5.As shown in FIG.\",\n \"15, the refrigerant that has flown from outer pipe 81 flows inside outer pipe 81 but outside inner pipe 82 and then passes through evaporator 130 into intermediate heat-exchanger 140.After passing through intermediate heat-exchanger 140, the refrigerant flows inside inner pipe 82 and is discharged from inner pipe 82 into compressor 30.Heat-exchanging device 203 of the embodiment, as described above, has condenser 110, liquid tank 120, evaporator 130, and intermediate heat-exchanger 140.Such structured heat-exchanging device 203 of the embodiment produces the effect similar to the structure described in the sixth exemplary embodiment above.\",\n \"Ninth Exemplary Embodiment A ninth exemplary embodiment of the present invention is described with reference to FIG.\",\n \"16.FIG.\",\n \"16 is a cross-sectional view showing the structure of heat-exchanging device 204 of the embodiment.\",\n \"As shown in FIG.\",\n \"16, heat-exchanging device 204 has a structure basically the same as that of heat-exchanging device 104 (see FIG.\",\n \"10) described in the fifth exemplary embodiment, except that condenser plate 111 has pipe 11 and pipe 12 instead of pipe 3 shown in FIG.\",\n \"10.In addition, the structure of FIG.\",\n \"16 differs from that of FIG.\",\n \"10 in that pipe 1 for coolant-IN is oppositely disposed from pipe 2 for coolant-OUT.\",\n \"In FIG.\",\n \"16, like parts are identified by the same reference marks as in FIG.\",\n \"10, and the detailed description thereof is omitted.\",\n \"In heat-exchanging device 204, the coolant and the refrigerant flow as follows.\",\n \"As shown in FIG.\",\n \"16, the coolant fed from pipe 1 branches into condenser 110 and subcool condenser 150.The coolant that has passed through condenser 110 and the coolant that has passed through subcool condenser 150 join again and the joined coolant is discharged from pipe 12.As shown in FIG.\",\n \"16, the refrigerant fed from pipe 11 passes through condenser 110 and flows outside pipe 12 into liquid tank 120.After passing through liquid tank 120, the refrigerant passes through subcool condenser 150 then flows inside pipe 12 and is discharged from pipe 12.Heat-exchanging device 204 of the embodiment, as described above, has condenser 110, liquid tank 120, and subcool condenser 150.Such structured heat-exchanging device 204 of the embodiment produces the effect similar to the structure described in the sixth exemplary embodiment above.\",\n \"The description above is on heat-exchanging devices 200, 202, and 203 each in which the pipe for refrigerant-IN and the pipe for refrigerant-OUT are individually formed.\",\n \"The structures of the first through the ninth exemplary embodiments of the present disclosure have been described so far.\",\n \"However, the present disclosure is not limited to the structures described in the first through ninth exemplary embodiments above, allowing various modifications without departing from the spirit and scope of the disclosure.\",\n \"Hereinafter, modification examples will be described.\",\n \"For example, the plurality of plates forming the heat-exchanging device in the first through ninth exemplary embodiments may differ from each other in shape of visible outline, in size, and in dimension in the stacking direction as long as the plates are stackable.\",\n \"Further, for example, the components of the heat-exchanging device described in the first through ninth exemplary embodiments (for example, condenser 110, liquid tank 120, liquid tank 120a, liquid tank 120b, evaporator 130, intermediate heat-exchanger 140, and subcool condenser 150) are not necessarily stacked in the order described in the first through ninth exemplary embodiments.\",\n \"Further, for example, the first through ninth exemplary embodiments have described a positioning state where the upper section of condenser 110 is directed vertically upward, whereas each lower section of liquid tank 120, liquid tank 120b, and evaporator 130 or subcool condenser 150 is directed vertically downward.\",\n \"However, the positioning state of the heat-exchanging device in use is not limited to the above.\",\n \"Further, for example, the first through ninth exemplary embodiments have described an example where coolant (water) is employed for a heat carrier that exchanges heat with refrigerant, but it is not limited to; instead of coolant, oil or air may be used as the heat carrier.\",\n \"Further, for example, the first through ninth exemplary embodiments have described an example where liquid tank 120, liquid tank 120a, or liquid tank 120b retain the refrigerant fed from condenser 110 by the flow passage formed of openings ‘e’, but it is not limited to.\",\n \"For example, a refrigerant-retaining section may be formed by forming each of the plurality of liquid-tank plates 121 into a window-flame shape having an opening in the center.\",\n \"For example, the first through ninth exemplary embodiments have described that liquid tank 120, liquid tank 120a, and liquid tank 120b have a structure of a plurality of liquid-tank plates 121 stacked one on another.\",\n \"However, instead of the stacking structure of the plurality of plates, liquid tanks 120, 120a, 120b may be formed as an integrally-structured block having an accommodating space (corresponding to the refrigerant-retaining section) inside the structure.\",\n \"Furthermore, seen in the stacking direction, liquid tanks 120, 120a, 120b of a block-shaped structure may differ in shape of visible outline and in size from condenser 110, evaporator 130, intermediate heat-exchanger 140, or subcool condenser 150.Further, for example, in the first through ninth exemplary embodiments, each of condenser 110, evaporator 130, intermediate heat-exchanger 140, or subcool condenser 150 may differ in shape of visible outline and in size, seen in the stacking direction, from each other.\",\n \"Further, for example, the sixth through ninth exemplary embodiments have described that the inner diameter and the outer diameter of pipe 12 are smaller than those of pipe 11, but pipe 12 may be equal to pipe 11 in inner diameter and outer diameter.\",\n \"Further, for example, in the third, fourth, and eighth exemplary embodiments, the pipe through which refrigerant flows into condenser 110 and the pipe through which the refrigerant is discharged after passing through condenser 110 and intermediate heat-exchanger 140 may not be formed as a double-pipe structure of outer pipe 31 and inner pipe 32.Further, for example, the fourth and eighth exemplary embodiments have described an example in which outer pipe 81 and inner pipe 82 are integrally structured.\",\n \"However, they may be individually structured, like pipe 11 and pipe 12 shown in FIG.\",\n \"13 through FIG.\",\n \"16.The present disclosure is applicable to air-conditioning and heating equipment mountable to vehicles.\"\n ]\n]"},"source":{"kind":"string","value":"Patent_15871408"}}},{"rowIdx":4493782,"cells":{"text":{"kind":"list like","value":[["TRAILER BACKUP OFFSET DETERMINATION","A system for calibrating a backup assist system for a trailer attached to a vehicle is provided which includes a hitch sensor continuously measuring a hitch angle between the vehicle and the trailer.","A controller is configured to determine an offset of the measured hitch angle.","The controller is configured to calculate and store in memory a forward offset if no reverse offset is stored."],["1.A system for calibrating a backup assist system for a trailer attached to a vehicle, comprising: a hitch sensor continuously measuring a hitch angle between the vehicle and the trailer; and a controller configured to determine an offset of the measured hitch angle, wherein the controller is configured to calculate and store in memory a forward offset if no reverse offset is stored.","2.The system of claim 1, wherein the offset is determined between the measured hitch angle and an actual hitch angle when the actual hitch angle is substantially zero.","3.The system of claim 1, wherein the controller is further configured to not calculate a forward offset if the reverse offset is stored.","4.The system of claim 1, wherein the forward and reverse offsets are determined during a steady state condition of the vehicle and the trailer.","5.The system of claim 1, further comprising: a knob sensor continuously sensing a knob angle, wherein the knob angle is substantially zero when the vehicle and trailer are in a substantially standing state, and wherein the reverse offset is determined when the knob angle is substantially zero over a threshold time while the vehicle is driving above a threshold speed.","6.The system of claim 3 further comprising: a yaw sensor continuously sensing a yaw rate of the vehicle, wherein the yaw rate of the vehicle is substantially zero when the vehicle is steered straight, and wherein the forward and reverse offsets are determined when the angle rate is substantially zero over a threshold time while the vehicle is driving above a threshold speed.","7.The system of claim 3, wherein the controller determines an approximate distance the vehicle must travel straight to place the actual hitch angle at zero based on a length of the trailer and the measured hitch angle.","8.A system for calibrating a backup assist system for a trailer attached to a vehicle, comprising: a hitch sensor continuously measuring a hitch angle between the vehicle and the trailer; and a controller configured to determine an offset of the measured hitch angle, wherein the controller is configured to prioritize the offset determined while the vehicle and the trailer are moving reverse over the offset determined while the vehicle and the trailer are moving forward.","9.The system of claim 8, wherein the offset is determined between the measured hitch angle and an actual hitch angle when the actual hitch angle is substantially zero.","10.The system of claim 8, wherein the controller is further configured to not calculate a forward offset if the reverse offset is stored.","11.The system of claim 8, wherein the forward and reverse offsets are determined during a steady state condition of the vehicle and the trailer.","12.The system of claim 8, further comprising: a knob sensor continuously sensing a knob angle, wherein the knob angle is substantially zero when the vehicle and trailer are in a substantially standing state, and wherein the reverse offset is determined when the knob angle is substantially zero over a threshold time while the vehicle is driving above a threshold speed.","13.The system of claim 10 further comprising: a yaw sensor continuously sensing a yaw rate of the vehicle, wherein the yaw rate of the vehicle is substantially zero when the vehicle is steered straight, and wherein the forward and reverse offsets are determined when the angle rate is substantially zero over a threshold time while the vehicle is driving above a threshold speed.","14.The system of claim 10, wherein the controller determines an approximate distance the vehicle must travel straight to place the actual hitch angle at zero based on a length of the trailer and the measured hitch angle.","15.A system for calibrating a backup assist system for a trailer attached to a vehicle, comprising: a hitch sensor continuously measuring a hitch angle between the vehicle and the trailer; and a controller configured to determine an offset of the measured hitch angle, wherein the controller is configured to replace a forward offset when a reverse offset is determined.","16.The system of claim 15, wherein the controller is further configured to not calculate a forward offset if the reverse offset is stored.","17.The system of claim 15, wherein the forward and reverse offsets are determined during a steady state condition of the vehicle and the trailer.","18.The system of claim 15, further comprising: a knob sensor continuously sensing a knob angle, wherein the knob angle is substantially zero when the vehicle and trailer are in a substantially standing state, and wherein the reverse offset is determined when the knob angle is substantially zero over a threshold time while the vehicle is driving above a threshold speed.","19.The system of claim 16 further comprising: a yaw sensor continuously sensing a yaw rate of the vehicle, wherein the yaw rate of the vehicle is substantially zero when the vehicle is steered straight, and wherein the forward and reverse offsets are determined when the angle rate is substantially zero over a threshold time while the vehicle is driving above a threshold speed.","20.The system of claim 16, wherein the controller determines an approximate distance the vehicle must travel straight to place the actual hitch angle at zero based on a length of the trailer and the measured hitch angle."],[" BACKGROUND OF THE INVENTION Reversing a vehicle while towing a trailer is very challenging for many drivers.","This is particularly true for drivers that are unskilled at backing vehicles with attached trailers, which may include those that drive with a trailer on an infrequent basis (e.g., have rented a trailer, use a personal trailer on an infrequent basis, etc.).","One reason for such difficulty is that backing a vehicle with an attached trailer requires steering inputs that are opposite to normal steering when backing the vehicle without a trailer attached and/or requires braking to stabilize the vehicle-trailer combination before a jackknife condition occurs.","Another reason for such difficulty is that small errors in steering while backing a vehicle with an attached trailer are amplified thereby causing the trailer to depart from a desired path.","To assist the driver in steering a vehicle with a trailer attached, a trailer backup assist system needs to know the driver's intention.","One common assumption with known trailer backup assist systems is that a driver of a vehicle with an attached trailer wants to backup straight and the system either implicitly or explicitly assumes a zero curvature path for the vehicle-trailer combination.","Unfortunately most of the real-world use cases of backing a trailer involve a curved path and, thus, assuming a path of zero curvature would significantly limit usefulness of the system.","Some known systems assume that a path is known from a map or path planner.","To this end, some known trailer backup assist systems operate under a requirement that a trailer backup path is known before backing of the trailer commences such as, for example, from a map or a path-planning algorithm.","Undesirably, such implementations of the trailer backup assist systems are known to have a relatively complex human machine interface (HMI) device to specify the path, obstacles and/or goal of the backup maneuver.","Furthermore, such systems also require some way to determine how well the desired path is being followed and to know when the desired goal, or stopping point and orientation, has been met, using approaches such as cameras, inertial navigation, or high precision global positioning system (GPS).","These requirements lead to a relatively complex and costly system.","Another reason backing a trailer can prove to be difficult is the need to control the vehicle in a manner that limits the potential for a jackknife condition to occur.","A trailer has attained a jackknife condition when a hitch angle cannot be reduced (i.e., made less acute) while continuously backing up a trailer by application of a maximum steering input for the vehicle such as, for example, by moving steered front wheels of the vehicle to a maximum steered angle at a maximum rate of steering angle change.","In the case of the jackknife angle being achieved, the vehicle must be pulled forward to relieve the hitch angle in order to eliminate the jackknife condition and, thus, allow the hitch angle to be controlled via manipulation of the steered wheels of the vehicle.","However, in addition to the jackknife condition creating the inconvenient situation where the vehicle must be pulled forward, it can also lead to damage to the vehicle and/or trailer if certain operating conditions of the vehicle relating to its speed, engine torque, acceleration, and the like are not detected and counteracted.","For example, if the vehicle is travelling at a suitably high speed in reverse and/or subjected to a suitably high longitudinal acceleration when the jackknife condition is achieved, the relative movement of the vehicle with respect to the trailer can lead to contact between the vehicle and trailer thereby damaging the trailer and/or the vehicle."],[" SUMMARY OF THE INVENTION According to at least one feature of the present disclosure, a system for calibrating a backup assist system for a trailer attached to a vehicle is provided which includes a hitch sensor continuously measuring a hitch angle between the vehicle and the trailer.","A controller is configured to determine an offset of the measured hitch angle.","The controller is configured to calculate and store in memory a forward offset if no reverse offset is stored.","According to another feature of the present disclosure, a system for calibrating a backup assist system for a trailer attached to a vehicle is provided which includes a hitch sensor continuously measuring a hitch angle between the vehicle and the trailer.","A controller is configured to determine an offset of the measured hitch angle.","The controller is configured to prioritize the offset determined while the vehicle and the trailer are moving reverse over the offset determined while the vehicle and the trailer are moving forward.","According to a further feature of the present disclosure, a system for calibrating a backup assist system for a trailer attached to a vehicle is provided which includes a hitch sensor continuously measuring a hitch angle between the vehicle and the trailer.","A controller is configured to determine an offset of the measured hitch angle.","The controller is configured to replace a forward offset when a reverse offset is determined.","These and other aspects, objects, and features of the present invention will be understood and appreciated by those skilled in the art upon studying the following specification, claims, and appended drawings."],["CROSS-REFERENCE TO RELATED APPLICATIONS This patent application is a division of U.S. patent application Ser.","No.","14/886,668, which was filed on Oct. 19, 2015, entitled “TRAILER BACKUP OFFSETDETERMINATION”, which is a continuation-in-part of U.S. patent application Ser.","No.","14/201,130, which was filed on Mar.","7, 2014, entitled “SYSTEM AND METHOD OF CALIBRATING A TRAILER BACKUP ASSIST SYSTEM,” and issued as U.S. Pat.","No.","9,290,202 on Mar.","22, 2016, which is a continuation-in-part of U.S. patent application Ser.","No.","14/068,387, which was filed on Oct. 31, 2013, entitled “TRAILER MONITORING SYSTEM AND METHOD,” and issued as U.S. Pat.","No.","9,102,271 on Aug. 11, 2015, which is a continuation-in-part of U.S. patent application Ser.","No.","14/059,835, which was filed on Oct. 22, 2013, entitled “TRAILER BACKUP ASSIST SYSTEM,” and issued as U.S. Pat.","No.","9,248,858 on Feb. 2, 2016, which is a continuation-in-part of U.S. patent application Ser.","No.","13/443,743 which was filed on Apr.","10, 2012, entitled “DETECTION OF AND COUNTERMEASURES FOR JACKKNIFE ENABLING CONDITIONS DURING TRAILER BACKUP ASSIST,” and issued as U.S. Pat.","No.","8,825,328 on Sep. 2, 2014, which is a continuation-in-part of U.S. patent application Ser.","No.","13/336,060, which was filed on Dec. 23, 2011, entitled “TRAILER PATH CURVATURE CONTROL FOR TRAILER BACKUP ASSIST,” and issued as U.S. Pat.","No.","8,909,426 on Dec. 9, 2014, which claims benefit from U.S.","Provisional Patent Application No.","61/477,132, which was filed on Apr.","19, 2011, entitled “TRAILER BACKUP ASSIST CURVATURE CONTROL,” which have a common Applicant herewith and are being incorporated herein in their entirety by reference.","FIELD OF THE INVENTION The disclosure made herein relates generally to driver assist and active safety technologies in vehicles, and more particularly to a trailer backup assist system.","BACKGROUND OF THE INVENTION Reversing a vehicle while towing a trailer is very challenging for many drivers.","This is particularly true for drivers that are unskilled at backing vehicles with attached trailers, which may include those that drive with a trailer on an infrequent basis (e.g., have rented a trailer, use a personal trailer on an infrequent basis, etc.).","One reason for such difficulty is that backing a vehicle with an attached trailer requires steering inputs that are opposite to normal steering when backing the vehicle without a trailer attached and/or requires braking to stabilize the vehicle-trailer combination before a jackknife condition occurs.","Another reason for such difficulty is that small errors in steering while backing a vehicle with an attached trailer are amplified thereby causing the trailer to depart from a desired path.","To assist the driver in steering a vehicle with a trailer attached, a trailer backup assist system needs to know the driver's intention.","One common assumption with known trailer backup assist systems is that a driver of a vehicle with an attached trailer wants to backup straight and the system either implicitly or explicitly assumes a zero curvature path for the vehicle-trailer combination.","Unfortunately most of the real-world use cases of backing a trailer involve a curved path and, thus, assuming a path of zero curvature would significantly limit usefulness of the system.","Some known systems assume that a path is known from a map or path planner.","To this end, some known trailer backup assist systems operate under a requirement that a trailer backup path is known before backing of the trailer commences such as, for example, from a map or a path-planning algorithm.","Undesirably, such implementations of the trailer backup assist systems are known to have a relatively complex human machine interface (HMI) device to specify the path, obstacles and/or goal of the backup maneuver.","Furthermore, such systems also require some way to determine how well the desired path is being followed and to know when the desired goal, or stopping point and orientation, has been met, using approaches such as cameras, inertial navigation, or high precision global positioning system (GPS).","These requirements lead to a relatively complex and costly system.","Another reason backing a trailer can prove to be difficult is the need to control the vehicle in a manner that limits the potential for a jackknife condition to occur.","A trailer has attained a jackknife condition when a hitch angle cannot be reduced (i.e., made less acute) while continuously backing up a trailer by application of a maximum steering input for the vehicle such as, for example, by moving steered front wheels of the vehicle to a maximum steered angle at a maximum rate of steering angle change.","In the case of the jackknife angle being achieved, the vehicle must be pulled forward to relieve the hitch angle in order to eliminate the jackknife condition and, thus, allow the hitch angle to be controlled via manipulation of the steered wheels of the vehicle.","However, in addition to the jackknife condition creating the inconvenient situation where the vehicle must be pulled forward, it can also lead to damage to the vehicle and/or trailer if certain operating conditions of the vehicle relating to its speed, engine torque, acceleration, and the like are not detected and counteracted.","For example, if the vehicle is travelling at a suitably high speed in reverse and/or subjected to a suitably high longitudinal acceleration when the jackknife condition is achieved, the relative movement of the vehicle with respect to the trailer can lead to contact between the vehicle and trailer thereby damaging the trailer and/or the vehicle.","SUMMARY OF THE INVENTION According to at least one feature of the present disclosure, a system for calibrating a backup assist system for a trailer attached to a vehicle is provided which includes a hitch sensor continuously measuring a hitch angle between the vehicle and the trailer.","A controller is configured to determine an offset of the measured hitch angle.","The controller is configured to calculate and store in memory a forward offset if no reverse offset is stored.","According to another feature of the present disclosure, a system for calibrating a backup assist system for a trailer attached to a vehicle is provided which includes a hitch sensor continuously measuring a hitch angle between the vehicle and the trailer.","A controller is configured to determine an offset of the measured hitch angle.","The controller is configured to prioritize the offset determined while the vehicle and the trailer are moving reverse over the offset determined while the vehicle and the trailer are moving forward.","According to a further feature of the present disclosure, a system for calibrating a backup assist system for a trailer attached to a vehicle is provided which includes a hitch sensor continuously measuring a hitch angle between the vehicle and the trailer.","A controller is configured to determine an offset of the measured hitch angle.","The controller is configured to replace a forward offset when a reverse offset is determined.","These and other aspects, objects, and features of the present invention will be understood and appreciated by those skilled in the art upon studying the following specification, claims, and appended drawings.","BRIEF DESCRIPTION OF THE DRAWINGS In the drawings: FIG.","1 shows a vehicle-trailer combination, the vehicle being configured for performing trailer backup assist functionality in accordance with an embodiment; FIG.","2 shows one embodiment of the trailer backup steering input apparatus discussed in reference to FIG.","1; FIG.","3 shows an example of a trailer backup sequence implemented using the trailer backup steering input apparatus discussed in reference to FIG.","2; FIG.","4 shows a method for implementing trailer backup assist functionality in accordance with an embodiment; FIG.","5 is a diagrammatic view showing a kinematic model configured for providing information utilized in providing trailer backup assist functionality in accordance with one embodiment; FIG.","6 is a graph showing an example of a trailer path curvature function plot for a rotary-type trailer backup steering input apparatus configured in accordance with the disclosed subject matter; FIG.","7 is a diagrammatic view showing a relationship between hitch angle and steered angle as it relates to determining a jackknife angle for a vehicle/trailer system in reverse or backing up; FIG.","8 shows a method for implementing jackknife countermeasures functionality in accordance with an embodiment; FIG.","9 shows a human machine interface (HMI) device associated with the trailer backup assist; FIG.","10 shows a flow diagram associated with the trailer backup assist; FIG.","11 shows a flow diagram of the setup module according to one embodiment; FIG.","12 shows an example of an image displayed at the HMI device in accordance with one embodiment; FIG.","13 is a block diagram illustrating the vehicle trailer backup assist system employing a target monitor controller, according to one embodiment; FIG.","14 is a schematic diagram illustrating user placement of the target on a trailer towed by a vehicle; FIG.","15 is an enlarged view of the front portion of the trailer further illustrating the target placement zone in relation to the target sticker; FIG.","16 is a front view of a portable device having a display illustrating the overlay of a target onto a target placement zone on the trailer; FIG.","17 is a flow diagram illustrating a method of assisting a user with the placement of the target on the trailer; FIG.","18 is a flow diagram illustrating a method of monitoring placement of the target on the trailer and generating feedback alert; FIG.","19 is a schematic view of a front portion of the trailer having a target mounting system assembled thereto, according to one embodiment; FIG.","20 is an exploded view of the target mounting system and trailer shown in FIG.","19; FIG.","21 is a flow diagram illustrating an initial set up routine for monitoring the trailer connection for target changes and resetting trailer selection; FIG.","22 is a flow diagram illustrating a target moved detection routine for monitoring presence of trailer changes and resetting trailer selection; FIG.","23A is an image of the trailer showing the target in a first position; FIG.","23B is an image of the trailer showing movement of the target to a second position, according to one example; FIG.","24 is a flow diagram illustrating a trailer connection monitoring routine for monitoring trailer disconnection; FIG.","25A is an image of a tow vehicle showing a keylock hole defined in a tailgate handle assembly of the tow vehicle; FIG.","25B is an enlarged partial rear perspective view of a tailgate handle assembly defining a keylock hole; FIG.","25C is an enlarged partial front perspective view of the tailgate handle assembly showing the customary use of a keylock cylinder with the keylock hole; FIG.","25D shows the keylock cylinder mounted to the tailgate handle, according to one embodiment; FIG.","26A is a front perspective view of a light assembly, according to one embodiment; FIG.","26B is a rear perspective view of the light assembly; FIG.","26C is an exploded view of the light assembly shown in FIGS.","26A and 26B; FIG.","26D is a cross sectional view of the light assembly taken along line XXVI D-XXVI D of FIG.","26A; FIG.","27A is a light assembly mounted to the tailgate handle assembly shown in FIG.","25B, according to one embodiment; FIG.","27B is an enlarged partial front perspective view of the tailgate handle assembly equipped with the light assembly shown in FIG.","27A; FIG.","28 is a schematic diagram illustrating a supplemental vehicle lighting system being implemented in the tow vehicle shown in FIG.","25A, wherein the tow vehicle is attached to a trailer and features a trailer backup assist system employing vision based target detection; FIG.","29 is a top plan view of a trailer attached to a vehicle having a sensor system, according to one embodiment; FIG.","30 is a block diagram illustrating the trailer backup assist system employing a sensor system that has a primary sensor and a secondary sensor, according to one embodiment; FIG.","31 is a flow diagram illustrating a method for estimating an actual hitch angle of a trailer attached to a vehicle with a sensor system; FIG.","32 is an automotive vehicle having a hitch angle estimating system of the disclosed subject matter; FIG.","33 is a block diagram of a vehicle having a trailer coupled thereto and a relationship to the law of cosines; FIG.","34 is a flow chart of a method of estimating a hitch angle; FIG.","35 is a block diagram illustrating one embodiment of the trailer backup assist system having the trailer backup assist control module with a hitch angle calibration routine; FIG.","36 is a diagram that illustrates the geometry of a vehicle and a trailer overlaid with a two-dimensional x-y coordinate system that identifies variables used to calculate kinematic information of the vehicle and trailer system; FIG.","37 is a flow diagram illustrating one embodiment of the hitch angle calibration routine; FIG.","38 is a flow diagram illustrating an initiating routine that is performed prior to calculating the trailer angle offset, according to one embodiment; FIG.","39 is a flow diagram illustrating an additional embodiment of the hitch angle calibration routine; FIG.","40 is a flow diagram illustrating a method of calibrating a trailer backup assist system before determining an offset of the measured hitch angle; and FIG.","41 is a flow diagram illustrating an offset prioritization method, according to one embodiment.","DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS While various aspects of the inventive subject matter are described with reference to a particular illustrative embodiment, the inventive subject matter is not limited to such embodiments, and additional modifications, applications, and embodiments may be implemented without departing from the inventive subject matter.","In the figures, like reference numbers will be used to illustrate the same components.","Those skilled in the art will recognize that the various components set forth herein may be altered without varying from the scope of the inventive subject matter.","The disclosed subject matter is directed to providing trailer backup assist functionality in a manner that is relatively low cost and that offers an intuitive user interface.","In particular, such trailer backup assist functionality provides for controlling curvature of a path of travel of a trailer attached to a vehicle (i.e., trailer path curvature control) by allowing a driver of the vehicle to specify a desired path of the trailer by inputting a desired trailer path curvature as the backup maneuver of the vehicle and trailer progresses.","Although a control knob, a set of virtual buttons, or a touch screen can each be implemented for enabling trailer path curvature control, the disclosed subject matter is not unnecessarily limited to any particular configuration of interface through which a desired trailer path curvature is inputted.","Furthermore, in the case where a steering wheel can be mechanically decoupled from steered wheels of the vehicle, the steering wheel can also be used as an interface through which a desired trailer path curvature is inputted.","As will be discussed herein in greater detail, kinematical information of a system defined by the vehicle and the trailer are used to calculate a relationship (i.e., kinematics) between the trailer's curvature and the steering angle of the vehicle for determining steering angle changes of the vehicle for achieving the specified trailer path.","Steering commands corresponding to the steering angle changes are used for controlling a steering system of the tow vehicle (e.g., electric power assisted steering (EPAS) system) for implementing steering angle changes of steered wheels of the vehicle to achieve (e.g., to approximate) the specified path of travel of the trailer.","The trailer backup assist system automatically steers the vehicle-trailer combination as a driver uses the vehicle transmission, accelerator and brake to reverse the vehicle-trailer combination.","The driver inputs a desired trailer curvature command by using an input device such as a trailer steering knob.","Trailer backup assist functionality may be directed to implementing one or more countermeasures for limiting the potential of a jackknife condition being attained between a vehicle and a trailer being towed by the vehicle while backing up.","In certain embodiments, curvature of a path of travel of the trailer (i.e., trailer path curvature control) can be controlled by allowing a driver of the vehicle to specify a desired path of the trailer by inputting a desired trailer path curvature as the backup maneuver of the vehicle and trailer progresses.","Although a control knob, a set of virtual buttons, or a touch screen can each be implemented for enabling trailer path curvature control, the disclosed subject matter is not unnecessarily limited to any particular configuration of interface through which a desired trailer path curvature is inputted.","Furthermore, in the case where a steering wheel can be mechanically decoupled from steered wheels of the vehicle, the steering wheel can also be used as an interface through which a desired trailer path curvature is inputted.","As will be discussed herein in greater detail, kinematic information of a system defined by the vehicle and the trailer are used to calculate a relationship (i.e., kinematics) between the trailer's curvature and the steering angle of the vehicle for determining steering angle changes of the vehicle for achieving the specified trailer path.","Steering commands corresponding to the steering angle changes are used for controlling a steering system of the tow vehicle (e.g., electric power assisted steering (EPAS) system) for implementing steering angle changes of steered wheels of the vehicle to achieve (e.g., to approximate) the specified path of travel of the trailer.","Embodiments of the disclosed subject matter are directed to trailer backup assist functionality that provides for a user interface for a system that controls curvature of a path of a trailer being backed by a vehicle.","More specifically, trailer backup assist functionality configured in accordance with embodiments of the disclosed subject matter provide for such trailer path curvature control by allowing a driver of the vehicle to specify a desired path of the trailer by inputting a desired trailer path curvature as the backup maneuver of the vehicle and trailer progresses.","In response to such path of the trailer being specified by the driver, embodiments of the disclosed subject matter control a power assisted steering system (e.g., electric power assisted steering (EPAS) system) of the vehicle for implementing steering angle changes of steered wheels of the vehicle to achieve the specified trailer path.","Kinematics of the vehicle and the trailer are used to determine the steering angle changes that are required for achieving the specified trailer path.","Accordingly, embodiments of the disclosed subject matter provide for implementation of trailer backup assist functionality in a manner that is relatively simple and that enables use of an intuitive vehicle operator interface for specifying trailer path curvature control.","The disclosed subject matter, furthermore, includes embodiments directed to determining a hitch angle of trailer attached to the vehicle.","In one such embodiment, the vehicle trailer backup assist system may utilize a target placed on the trailer, allowing the trailer backup assist system to employ information acquired via image acquisition and processing of the target.","According to other embodiments, the target may be used to identify if a connected trailer has changed, trailer connection or disconnection, and other trailer related information.","The target is an identifiable visual target that can be captured in an image by the video imaging camera and detected and processed via image processing.","According to one embodiment, the target may attached to the trailer, preferably within a target placement zone, such that the camera and image processing may detect the target and its location on the trailer to determine trailer related information, such as the hitch angle between the trailer and the towing vehicle.","The trailer backup assist system may provide to the user one or more image(s) of the trailer target zone for proper placement of the target to assist with placement of the target on the trailer.","Additionally, the vehicle trailer backup assist system may monitor the target to determine if the target has been correctly placed within a desired target placement zone and provide feedback alert(s) to the user.","Further, the trailer backup assist system may monitor the trailer connection by monitoring the target to determine if the target has moved to determine whether the same trailer remains connected to the tow vehicle, and may initiate action in response thereto.","Further, the trailer backup assist system may monitor the hitch angle or the target to determine if the trailer may have been changed out (i.e., disconnected and replaced with another trailer), and may initiate action in response thereto.","The disclosed subject matter also provides a supplemental vehicle lighting system that is responsive to a trailer backup assist system.","The system includes a rear vehicle fixture defining a keylock hole customarily used in conjunction with a corresponding keylock cylinder.","A light assembly is provided in the place of a keylock cylinder and operably coupled to the keylock hole.","The light assembly includes a housing having a barrel that is concentrically aligned with the keylock hole and includes a distal end and a proximal end.","A lighting device is disposed inside the housing and operable to emit light through the barrel beginning from the proximal end.","A lens is coupled to the distal end of the barrel and is disposed to at least partially coincide with the keylock hole, wherein the lens is configured to disperse light emitted from the lighting device to illuminate a rear vehicle area.","In some embodiments of the disclosed trailer backup assist system, it can be advantageous to use information that is representative of a hitch angle between the vehicle and a trailer attached to the vehicle.","The disclosed subject matter provides embodiments directed to estimating an actual hitch angle of a trailer attached to a vehicle, as in some situations sensor information may become unavailable or may otherwise not provide an accurate measurement of the hitch angle.","A hitch angle that is not accurate may introduce a potential for inadequate or improper vehicle system control, especially when the hitch angle information is important to controlling the vehicle system, such as a trailer backup assist system or a trailer brake controller.","According to one embodiment, a sensor system for estimating an actual hitch angle of a trailer attached to a vehicle includes a primary sensor having a camera monitoring a target on the trailer to determine a measured hitch angle and a secondary sensor that monitors the trailer to determine an indicator of the actual hitch angle.","The trailer backup assist system may then operate the vehicle when the measured hitch angle correlates with the indicator of the actual hitch angle, confirming that the measured hitch angle is a generally accurate estimate of the actual hitch angle.","According to an additional embodiment of the disclosed subject matter, a system for estimating a hitch angle between a vehicle and a trailer coupled thereto has a wireless receiver on the vehicle located a predetermined distance from a trailer mount and a wireless transmitter located at an end of the trailer opposite the trailer mount.","According to one embodiment, a controller monitors power returns of a signal transmitted from the transmitter to the receiver and thereby estimates a distance between the transmitter and the receiver as a function of a path loss propagation of the transmitted signal.","The hitch angle is then estimated using the estimated distance, the predetermined distance, and a trailer length.","To further ensure the accuracy of the measured hitch angle, in additional embodiments the trailer back assist system may include a hitch angle calibration routine for determining any offset between the measured hitch angle and the actual hitch angle, based on certain vehicle and/or trailer characteristics.","In one of these embodiments, a method provides for sensing a measured hitch angle with at least one hitch angle sensor on the vehicle and sensing a steering angle of the steered wheels of the vehicle.","The method further provides for reversing the vehicle, and thereby determining an offset between the measured hitch angle and the actual hitch angle when the measured hitch angle and the steering angle are substantially consistent while the vehicle is reversing.","Another one of these embodiments provides driving the vehicle forward substantially straight above a threshold speed while sensing a yaw rate of the vehicle and sensing a measured hitch angle of the trailer.","Further, the method provides for determining an angle rate based on the measured hitch angle, and then determining an offset between the measured hitch angle and the actual hitch angle when the yaw rate and the angle rate are substantially zero.","The offset may then be used to more accurately manipulate the actual hitch angle with the trailer backup assist system.","Trailer Backup Assist System Referring to FIG.","1, an embodiment of a vehicle 100 configured for performing trailer backup assist functionality is shown.","A trailer backup assist system 105 of the vehicle 100 controls the curvature of path of travel of a trailer 110 that is attached to the vehicle 100.Such control is accomplished through interaction of a power assisted steering system 115 of the vehicle 100 and the trailer backup assist system 105.During operation of the trailer backup assist system 105 while the vehicle 100 is being reversed, a driver of the vehicle 100 is sometimes limited in the manner in which he/she can make steering inputs via a steering wheel of the vehicle 100.This is because in certain vehicles the trailer backup assist system 105 is in control of the power assisted steering system 115 and the power assisted steering system 115 is directly coupled to the steering wheel (i.e., the steering wheel of the vehicle 100 moves in concert with steered wheels of the vehicle 100).","As is discussed below in greater detail, a human machine interface (HMI) device of the backup assist system 105 is used for commanding changes in curvature of a path of the trailer 110 such as a knob, thereby decoupling such commands from being made at the steering wheel of the vehicle 100.However, some vehicles configured to provide trailer backup assist functionality in accordance with the disclosed subject matter will have the capability to selectively decouple steering movement from movement of steerable wheels of the vehicle, thereby allowing the steering wheel to be used for commanding changes in curvature of a path of a trailer during such trailer backup assist.","The trailer backup assist system 105 includes a trailer backup assist control module 120, a trailer backup steering input apparatus 125, and a hitch angle detection apparatus 130.The trailer backup assist control module 120 is connected to the trailer backup steering input apparatus 125 and the hitch angle detection apparatus 130 for allowing communication of information therebetween.","It is disclosed herein that the trailer backup steering input apparatus can be coupled to the trailer backup assist control module 120 in a wired or wireless manner.","The trailer backup assist system control module 120 is attached to a power steering assist control module 135 of the power steering assist system 115 for allowing information to be communicated therebetween.","A steering angle detection apparatus 140 of the power steering assist system 115 is connected to the power steering assist control module 135 for providing information thereto.","The trailer backup assist system is also attached to a brake system control module 145 and a powertrain control module 150 for allowing communication of information therebetween.","Jointly, the trailer backup assist system 105, the power steering assist system 115, the brake system control module 145, the powertrain control module 150, and the gear selection device (PRNDL), define a trailer backup assist architecture configured in accordance with an embodiment.","The trailer backup assist control module 120 is configured for implementing logic (i.e., instructions) for receiving information from the trailer backup steering input apparatus 125, the hitch angle detection apparatus 130, the power steering assist control module 135, the brake system control module 145, and the powertrain control module 150.The trailer backup assist control module 120 (e.g., a trailer curvature algorithm thereof) generates vehicle steering information as a function of all or a portion of the information received from the trailer backup steering input apparatus 125, the hitch angle detection apparatus 130, the power steering assist control module 135, the brake system control module 145, and the powertrain control module 150.Thereafter, the vehicle steering information is provided to the power steering assist control module 135 for affecting steering of the vehicle 100 by the power steering assist system 115 to achieve a commanded path of travel for the trailer 110.The trailer backup steering input apparatus 125 provides the trailer backup assist control module 120 with information defining the commanded path of travel of the trailer 110 to the trailer backup assist control module 120 (i.e., trailer steering information).","The trailer steering information can include information relating to a commanded change in the path of travel (e.g., a change in radius of path curvature) and information relating to an indication that the trailer is to travel along a path defined by a longitudinal centerline axis of the trailer (i.e., along a substantially straight path of travel).","As will be discussed below in detail, the trailer backup steering input apparatus 125 preferably includes a rotational control input device for allowing a driver of the vehicle 100 to interface with the trailer backup steering input apparatus 125 to command desired trailer steering actions (e.g., commanding a desired change in radius of the path of travel of the trailer and/or commanding that the trailer travel along a substantially straight path of travel as defined by a longitudinal centerline axis of the trailer).","In a preferred embodiment, the rotational control input device is a knob rotatable about a rotational axis extending through a top surface/face of the knob.","In other embodiments, the rotational control input device is a knob rotatable about a rotational axis extending substantially parallel to a top surface/face of the knob.","Some vehicles (e.g., those with active front steer) have a power steering assist system configuration that allows a steering wheel to be partially decoupled from movement of the steered wheels of such a vehicle.","Accordingly, the steering wheel can be rotated independent of the manner in which the power steering assist system of the vehicle controls the steered wheels (e.g., as commanded by vehicle steering information provided by a power steering assist system control module from a trailer backup assist system control module configured in accordance with one embodiment).","As such, in these types of vehicles where the steering wheel can be selectively decoupled from the steered wheels to allow independent operation thereof, trailer steering information of a trailer backup assist system configured in accordance with the disclosed subject matter can be provided through rotation of the steering wheel.","Accordingly, it is disclosed herein that in certain embodiments, the steering wheel is an embodiment of a rotational control input device in the context of the disclosed subject matter.","In such embodiments, the steering wheel would be biased (e.g., by an apparatus that is selectively engageable/activatable) to an at-rest position between opposing rotational ranges of motion.","The hitch angle detection apparatus 130, which operates in conjunction with a hitch angle detection component 155 of the trailer 110, provides the trailer backup assist control module 120 with information relating to an angle between the vehicle 100 and the trailer 110 (i.e., hitch angle information).","In a preferred embodiment, the hitch angle detection apparatus 130 is a camera-based apparatus such as, for example, an existing rear view camera of the vehicle 100 that images (i.e., visually monitors) a target (i.e., the hitch angle detection component 155) attached the trailer 110 as the trailer 110 is being backed by the vehicle 100.Preferably, but not necessarily, the hitch angle detection component 155 is a dedicated component (e.g., an item attached to/integral with a surface of the trailer 110 for the express purpose of being recognized by the hitch angle detection apparatus 130).","Alternatively, the hitch angle detection apparatus 130 can be a device that is physically mounted on a hitch component of the vehicle 100 and/or a mating hitch component of the trailer 110 for determining an angle between centerline longitudinal axes of the vehicle 100 and the trailer 110.The hitch angle detection apparatus 130 can be configured for detecting a jackknife enabling condition and/or related information (e.g., when a hitch angle threshold has been met).","The power steering assist control module 135 provides the trailer backup assist control module 120 with information relating to a rotational position (e.g., angle) of the steering wheel angle and/or a rotational position (e.g., turning angle(s)) of steered wheels of the vehicle 100.In certain embodiments, the trailer backup assist control module 120 can be an integrated component of the power steering assist system 115.For example, the power steering assist control module 135 can include a trailer backup assist algorithm for generating vehicle steering information as a function of all or a portion of information received from the trailer backup steering input apparatus 125, the hitch angle detection apparatus 130, the power steering assist control module 135, the brake system control module 145, and the powertrain control module 150.The brake system control module 145 provides the trailer backup assist control module 120 with information relating to vehicle speed.","Such vehicle speed information can be determined from individual wheel speeds as monitored by the brake system control module 145 or may be provided by an engine control module with signal plausibility.","Vehicle speed may also be determined from an engine control module.","In some instances, individual wheel speeds can also be used to determine a vehicle yaw rate and such yaw rate can be provided to the trailer backup assist control module 120 for use in determining the vehicle steering information.","In certain embodiments, the trailer backup assist control module 120 can provide vehicle braking information to the brake system control module 145 for allowing the trailer backup assist control module 120 to control braking of the vehicle 100 during backing of the trailer 110.For example, using the trailer backup assist control module 120 to regulate speed of the vehicle 100 during backing of the trailer 110 can reduce the potential for unacceptable trailer backup conditions.","Examples of unacceptable trailer backup conditions include, but are not limited to, a vehicle over speed condition, a high hitch angle rate, trailer angle dynamic instability, a calculated theoretical trailer jackknife condition (defined by a maximum vehicle steering angle, drawbar length, tow vehicle wheelbase and an effective trailer length), or physical contact jackknife limitation (defined by an angular displacement limit relative to the vehicle 100 and the trailer 110), and the like.","It is disclosed herein that the backup assist control module 120 can issue a signal corresponding to a notification (e.g., a warning) of an actual, impending, and/or anticipated unacceptable trailer backup condition.","The powertrain control module 150 interacts with the trailer backup assist control module 120 for regulating speed and acceleration of the vehicle 100 during backing of the trailer 110.As mentioned above, regulation of the speed of the vehicle 100 is necessary to limit the potential for unacceptable trailer backup conditions such as, for example, jackknifing and trailer angle dynamic instability.","Similar to high-speed considerations as they relate to unacceptable trailer backup conditions, high acceleration and high dynamic driver curvature requests can also lead to such unacceptable trailer backup conditions.","Steering Input Apparatus Referring now to FIG.","2, an embodiment of the trailer backup steering input apparatus 125 discussed in reference to FIG.","1 is shown.","A rotatable control element in the form of a knob 170 is coupled to a movement sensing device 175.The knob 170 is biased (e.g., by a spring return) to an at-rest position P(AR) between opposing rotational ranges of motion R(R), R(L).","A first one of the opposing rotational ranges of motion R(R) is substantially equal to a second one of the opposing rotational ranges of motion R(L), R(R).","To provide a tactile indication of an amount of rotation of the knob 170, a force that biases the knob 170 toward the at-rest position P(AR) can increase (e.g., non-linearly) as a function of the amount of rotation of the knob 170 with respect to the at-rest position P(AR).","Additionally, the knob 170 can be configured with position indicating detents such that the driver can positively feel the at-rest position P(AR) and feel the ends of the opposing rotational ranges of motion R(L), R(R) approaching (e.g., soft end stops).","The movement sensing device 175 is configured for sensing movement of the knob 170 and outputting a corresponding signal (i.e., movement sensing device signal) to the trailer assist backup input apparatus 125 shown in FIG.","1.The movement sensing device signal is generated as a function of an amount of rotation of the knob 170 with respect to the at-rest position P(AR), a rate movement of the knob 170, and/or a direction of movement of the knob 170 with respect to the at-rest position P(AR).","As will be discussed below in greater detail, the at-rest position P(AR) of the knob 170 corresponds to a movement sensing device signal indicating that the vehicle 100 should be steered such that the trailer 110 is backed along a substantially straight path (zero trailer curvature request from the driver) as defined by a centerline longitudinal axis of the trailer 110 when the knob 170 was returned to the at-rest position P(AR) and a maximum clockwise and anti-clockwise position of the knob 170 (i.e., limits of the opposing rotational ranges of motion R(R), R(L)) each correspond to a respective movement sensing device signal indicating a tightest radius of curvature (i.e., most acute trajectory) of a path of travel of the trailer 110 that is possible without the corresponding vehicle steering information causing a jackknife condition.","In this regard, the at-rest position P(AR) is a zero curvature commanding position with respect to the opposing rotational ranges of motion R(R), R(L).","It is disclosed herein that a ratio of a commanded curvature of a path of a trailer (e.g., radius of a trailer trajectory) and a corresponding amount of rotation of the knob can vary (e.g., non-linearly) over each one of the opposing rotational ranges of motion P(L), P(R) of the knob 170.It is also disclosed therein that the ratio can be a function of vehicle speed, trailer geometry, vehicle geometry, hitch geometry and/or trailer load.","Use of the knob 170 decouples trailer steering inputs from being made at a steering wheel of the vehicle 100.In use, as a driver of the vehicle 100 backs the trailer 110, the driver can turn the knob 170 to indicate a desired curvature of a path of the trailer 110 to follow and returns the knob 170 to the at-rest position P(AR) for causing the trailer 110 to be backed along a straight line.","Accordingly, in embodiments of trailer backup assist systems where the steering wheel remains physically coupled to the steerable wheels of a vehicle during backup of an attached trailer, a rotatable control element configured in accordance with the disclosed subject matter (e.g., the knob 170) provides a simple and user-friendly means of allowing a driver of a vehicle to input trailer steering commands.","It is disclosed herein that a rotational control input device configured in accordance with embodiments of the disclosed subject matter (e.g., the knob 170 and associated movement sensing device) can omit a means for being biased to an at-rest position between opposing rotational ranges of motion.","Lack of such biasing allows a current rotational position of the rotational control input device to be maintained until the rotational control input device is manually moved to a different position.","Preferably, but not necessarily, when such biasing is omitted, a means is provided for indicating that the rotational control input device is positioned in a zero curvature commanding position (e.g., at the same position as the at-rest position in embodiments where the rotational control input device is biased).","Examples of means for indicating that the rotational control input device is positioned in the zero curvature commanding position include, but are not limited to, a detent that the rotational control input device engages when in the zero curvature commanding position, a visual marking indicating that the rotational control input device is in the zero curvature commanding position, an active vibratory signal indicating that the rotational control input device is in or approaching the zero curvature commanding position, an audible message indicating that the rotational control input device is in of approaching the zero curvature commanding position, and the like.","It is also disclosed herein that embodiments of the disclosed subject matter can be configured with a control input device that is not rotational (i.e., a non-rotational control input device).","Similar to a rotational control input device configured in accordance with embodiments of the disclosed subject matter (e.g., the knob 170 and associated movement sensing device), such a non-rotational control input device is configured to selectively provide a signal causing a trailer to follow a path of travel segment that is substantially straight and to selectively provide a signal causing the trailer to follow a path of travel segment that is substantially curved.","Examples of such a non-rotational control input device include, but are not limited to, a plurality of depressible buttons (e.g., curve left, curve right, and travel straight), a touch screen on which a driver traces or otherwise inputs a curvature for path of travel commands, a button that is translatable along an axis for allowing a driver to input path of travel commands, or joystick type input and the like.","The trailer backup steering input apparatus 125 can be configured to provide various feedback information to a driver of the vehicle 100.Examples of situation that such feedback information can include, but are not limited to, a status of the trailer backup assist system 105 (e.g., active, in standby (e.g., when driving forward to reduce the hitch angle and zero hitch angle to remove bias), faulted, inactive, etc.","), that a curvature limit has been reached (i.e., maximum commanded curvature of a path of travel of the trailer 110), and/or a graphical representation of the vehicle and trailer orientation state.","To this end, the trailer backup steering input apparatus 125 can be configured to provide a tactile feedback signal (e.g., a vibration through the knob 170) as a warning if any one of a variety of conditions occur.","Examples of such conditions include, but are not limited to, the trailer 110 approaching jackknife, the trailer backup assist system 105 has had a failure, the trailer backup assist system 105 has detected a fault, the trailer backup assist system 105 or other system of the vehicle 100 has predicted a collision on the present path of travel of the trailer 110, the trailer backup system 105 has restricted a commanded curvature of a trailer's path of travel (e.g., due to excessive speed or acceleration of the vehicle 100), and the like.","Still further, it is disclosed that the trailer backup steering input apparatus 125 can use illumination (e.g., an LED 180) and/or an audible signal output (e.g., an audible output device 185 or through attached vehicle audio speakers) to provide certain feedback information (e.g., notification/warning of an unacceptable trailer backup condition).","Referring now to FIGS.","2 and 3, an example of using the trailer backup steering input apparatus 125 for dictating a curvature of a path of travel (POT) of a trailer (i.e., the trailer 110 shown in FIG.","1) while backing up the trailer with a vehicle (i.e., the vehicle 100 in FIGS.","1 and 2) is shown.","In preparation of backing the trailer 110, the driver of the vehicle 100 drives the vehicle 100 forward along a pull-thru path (PTP) to position the vehicle 100 and trailer 110 at a first backup position B1.In the first backup position B1, the vehicle 100 and trailer 110 are longitudinally aligned with each other such that a longitudinal centerline axis L1 of the vehicle 100 is aligned with (e.g., parallel with or coincidental with) a longitudinal centerline axis L2 of the trailer 110.It is disclosed herein that such alignment of the longitudinal axes L1, L2 at the onset of an instance of trailer backup functionality is not a requirement for operability of a trailer backup assist system configured in accordance with the disclosed subject matter.","After activating the trailer backup assist system 105 (e.g., before, after, or during the pull-thru sequence), the driver begins to back the trailer 110 by reversing the vehicle 100 from the first backup position B1.So long as the knob 170 of the trailer backup steering input apparatus 125 remains in the at-rest position P(AR), the trailer backup assist system 105 will steer the vehicle 100 as necessary for causing the trailer 110 to be backed along a substantially straight path of travel as defined by the longitudinal centerline axis L2 of the trailer 110 at the time when backing of the trailer 110 began.","When the trailer reaches the second backup position B2, the driver rotates the knob 170 to command the trailer 110 to be steered to the right (i.e., a knob position R(R) clockwise rotation).","Accordingly, the trailer backup assist system 105 will steer the vehicle 100 for causing the trailer 110 to be steered to the right as a function of an amount of rotation of the knob 170 with respect to the at-rest position P(AR), a rate movement of the knob 170, and/or a direction of movement of the knob 170 with respect to the at-rest position P(AR).","Similarly, the trailer 110 can be commanded to steer to the left by rotating the knob 170 to the left.","When the trailer reaches backup position B3, the driver allows the knob 170 to return to the at-rest position P(AR) thereby causing the trailer backup assist system 105 to steer the vehicle 100 as necessary for causing the trailer 110 to be backed along a substantially straight path of travel as defined by the longitudinal centerline axis L2 of the trailer 110 at the time when the knob 170 was returned to the at-rest position P(AR).","Thereafter, the trailer backup assist system 105 steers the vehicle 100 as necessary for causing the trailer 110 to be backed along this substantially straight path to the fourth backup position B4.In this regard, arcuate portions of a path of travel POT of the trailer 110 are dictated by rotation of the knob 170 and straight portions of the path of travel POT are dictated by an orientation of the centerline longitudinal axis L2 of the trailer when the knob 170 is in/returned to the at-rest position P(AR).","In order to activate the trailer backup assist system described above in FIGS.","1-3, the driver interacts with the trailer backup assist system and the trailer backup assist system interacts with the vehicle environment.","The trailer backup assist system automatically steers as the driver reverses the vehicle.","As discussed above, the driver controls the trailer trajectory by using a steering knob to input desired trailer curvature.","The trailer backup assist algorithm determines the vehicle steering angle to achieve the desired trailer curvature, and the driver controls the throttle and brake while the trailer backup assist system controls the steering.","FIG.","4 shows a method 200 for implementing trailer backup assist functionality in accordance with one embodiment.","In a preferred embodiment, the method 200 for implementing trailer backup assist functionality can be carried out using the trailer backup assist architecture discussed above in reference to the vehicle 100 and trailer 110 of FIG.","1.Accordingly, trailer steering information is provided through use of a rotational control input device (e.g., the knob 170 discussed in reference to FIG.","2).","An operation 202 is performed for receiving a trailer backup assist request.","Examples of receiving the trailer backup assist request include activating the trailer backup assist system and providing confirmation that the vehicle and trailer are ready to be backed.","After receiving a trailer backup assist request (i.e., while the vehicle is being reversed), an operation 204 is performed for receiving a trailer backup information signal.","Examples of information carried by the trailer backup information signal include, but are not limited to, information from the trailer backup steering input apparatus 125, information from the hitch angle detection apparatus 130, information from the power steering assist control module 135, information from the brake system control module 145, and information from the powertrain control module 150.It is disclosed herein that information from the trailer backup steering input apparatus 125 preferably includes trailer path curvature information characterizing a desired curvature for the path of travel of the trailer, such as provided by the trailer backup steering input apparatus 125 discussed above in reference to FIGS.","1 and 2.In this manner, the operation 204 for receiving the trailer backup information signal can include receiving trailer path curvature information characterizing the desired curvature for the path of travel of the trailer.","If the trailer backup information signal indicates that a change in curvature of the trailer's path of travel is requested (i.e., commanded via the knob 170), an operation 206 is performed for determining vehicle steering information for providing the requested change in curvature of the trailer's path of travel.","Otherwise, an operation 208 is performed for determining vehicle steering information for maintaining a current straight-line heading of the trailer (i.e., as defined by the longitudinal centerline axis of the trailer).","Thereafter, an operation 210 is performed for providing the vehicle steering information to a power steering assist system of the vehicle, followed by an operation 212 being performed for determining the trailer backup assist status.","If it is determined that trailer backup is complete, an operation 214 is performed for ending the current trailer backup assist instance.","Otherwise the method 200 returns to the operation 204 for receiving trailer backup information.","Preferably, the operation for receiving the trailer backup information signal, determining the vehicle steering information, providing the vehicle steering information, and determining the trailer backup assist status are performed in a monitoring fashion (e.g., at a high rate of speed of a digital data processing device).","Accordingly, unless it is determined that reversing of the vehicle for backing the trailer is completed (e.g., due to the vehicle having been successfully backed to a desired location during a trailer backup assist instance, the vehicle having to be pulled forward to begin another trailer backup assist instance, etc.","), the method 200 will continually be performing the operations for receiving the trailer backup information signal, determining the vehicle steering information, providing the vehicle steering information, and determining the trailer backup assist status.","It is disclosed herein that the operation 206 for determining vehicle steering information for providing the requested change in curvature of the trailer's path of travel preferably includes determining vehicle steering information as a function of trailer path curvature information contained within the trailer backup information signal.","As will be discussed below in greater detail, determining vehicle steering information can be accomplished through a low order kinematic model defined by the vehicle and the trailer.","Through such a model, a relationship between the trailer path curvature and commanded steering angles of steered wheels of the vehicle can be generated for determining steering angle changes of the steered wheels for achieving a specified trailer path curvature.","In this manner, the operation 206 for determining vehicle steering information can be configured for generating information necessary for providing trailer path curvature control in accordance with the disclosed subject matter.","In some embodiments of the disclosed subject matter, the operation 210 for providing the vehicle steering information to the power steering assist system of the vehicle causes the steering system to generate a corresponding steering command as a function of the vehicle steering information.","The steering command is interpretable by the steering system and is configured for causing the steering system to move steered wheels of the steering system for achieving a steered angle as specified by the vehicle steering information.","Alternatively, the steering command can be generated by a controller, module or computer external to the steering system (e.g., a trailer backup assist control module) and be provided to the steering system.","In parallel with performing the operations for receiving the trailer backup information signal, determining the vehicle steering information, providing the vehicle steering information, and determining the trailer backup assist status, the method 200 performs an operation 216 for monitoring the trailer backup information for determining if an unacceptable trailer backup condition exists.","Examples of such monitoring include, but are not limited to assessing a hitch angle to determine if a hitch angle threshold is exceeded, assessing a backup speed to determine if a backup speed threshold is exceeded, assessing vehicle steering angle to determine if a vehicle steering angle threshold is exceeded, assessing other operating parameters (e.g., vehicle longitudinal acceleration, throttle pedal demand rate and hitch angle rate) for determining if a respective threshold value is exceeded, and the like.","Backup speed can be determined from wheel speed information obtained from one or more wheel speed sensors of the vehicle.","If it is determined that an unacceptable trailer backup condition exists, an operation 218 is performed for causing the current path of travel of the trailer to be inhibited (e.g., stopping motion of the vehicle), followed by the operation 214 being performed for ending the current trailer backup assist instance.","It is disclosed herein that prior to and/or in conjunction with causing the current trailer path to be inhibited, one or more actions (e.g., operations) can be implemented for providing the driver with feedback (e.g., a warning) that such an unacceptable hitch angle condition is impending or approaching.","In one example, if such feedback results in the unacceptable hitch angle condition being remedied prior to achieving a critical condition, the method can continue with providing trailer backup assist functionality in accordance with operations 204-212.Otherwise, the method can proceed to operation 214 for ending the current trailer backup assist instance.","In conjunction with performing the operation 214 for ending the current trailer backup assist instance, an operation can be performed for controlling movement of the vehicle to correct or limit a jackknife condition (e.g., steering the vehicle, decelerating the vehicle, limiting magnitude and/or rate of driver requested trailer curvature input, limiting magnitude and/or rate of the steering command, and/or the like to preclude the hitch angle from being exceeded).","Curvature Control Algorithm Turning now to a discussion of a kinematic model used to calculate a relationship between a curvature of a path of travel of a trailer and the steering angle of a vehicle towing the trailer, a low order kinematic model can be desirable for a trailer backup assist system configured in accordance with some embodiments.","To achieve such a low order kinematic model, certain assumptions are made with regard to parameters associated with the vehicle/trailer system.","Examples of such assumptions include, but are not limited to, the trailer being backed by the vehicle at a relatively low speed, wheels of the vehicle and the trailer having negligible (e.g., no) slip, tires of the vehicle having negligible (e.g., no) lateral compliance, tires of the vehicle and the trailer having negligible (e.g., no) deformation, actuator dynamics of the vehicle being negligible, the vehicle and the trailer exhibiting negligible (e.g., no) roll or pitch motions.","As shown in FIG.","5, for a system defined by a vehicle 302 and a trailer 304, the kinematic model 300 is based on various parameters associated with the vehicle 302 and the trailer 304.These kinematic model parameters include: δ: steering angle at steered front wheels 306 of the vehicle 302; α: yaw angle of the vehicle 302; β: yaw angle of the trailer 304; γ: hitch angle (γ=β−α); W: wheel base of the vehicle 302; L: length between hitch point 308 and rear axle 310 of the vehicle 302; D: length between hitch point 308 and axle length 312 of the trailer 304 (axle length 312 may be an effective, or equivalent, axle length for a trailer having a multiple axle configuration; and r2: curvature radius for the trailer 304.The kinematic model 300 of FIG.","5 reveals a relationship between trailer path radius of curvature r2 at the midpoint 314 of an axle 312 of the trailer 304, steering angle δ of the steered wheels 306 of the vehicle 302, and the hitch angle γ.","As shown in the equation below, this relationship can be expressed to provide the trailer path curvature κ2 such that, if γ is given, the trailer path curvature κ2 can be controlled based on regulating the steering angle δ (where β is trailer yaw rate and η is trailer velocity).","κ 2 - 1 r 2 - β • η • - ( W + KV 2 g ) sin γ + L cos γ tan δ D ( ( W + KV 2 g ) cos γ - L sin γ tan δ ) Or, this relationship can be expressed to provide the steering angle δ as a function of trailer path curvature κ2 and hitch angle γ. δ = tan - 1 ( ( W + KV 2 g ) [ κ 2 D cos γ - sin γ ] DL κ 2 sin γ + L cos γ ) = F ( γ , κ 2 , K ) Accordingly, for a particular vehicle and trailer combination, certain kinematic model parameters (e.g., D, W and L) are constant and assumed known.","V is the vehicle longitudinal speed and g is the acceleration due to gravity.","K is a speed dependent parameter which when set to zero makes the calculation of steering angle independent of vehicle speed.","For example, vehicle-specific kinematic model parameters can be predefined in an electronic control system of a vehicle and trailer-specific kinematic model parameters can be inputted by a driver of the vehicle.","Trailer path curvature κ2 is determined from the driver input via a trailer backup steering input apparatus.","Through the use of the equation for providing steering angle, a corresponding steering command can be generated for controlling a steering system (e.g., an actuator thereof) of the vehicle.","FIG.","6 shown an example of a trailer path curvature function plot 400 for a rotary-type trailer backup steering input apparatus (e.g., the trailer backup steering input apparatus 125 discussed above in reference to FIGS.","1 and 2).","A value representing trailer path curvature (e.g., trailer path curvature κ2) is provided as an output signal from the rotary-type trailer backup steering input apparatus as a function of user input movement.","In this example, a curve 402 specifying trailer path curvature relative to user input (e.g., amount of rotation) at a rotary input device (e.g., a knob) is defined by a cubic function.","However, a skilled person will appreciate that embodiments of the disclosed subject matter are not limited to any particular function between a magnitude and/or rate of input at a trailer backup steering input apparatus (e.g., knob rotation) and a resulting trailer path curvature value.","Jackknife Detection Referring to FIG.","5, in preferred embodiments of the disclosed subject matter, it is desirable to limit the potential for the vehicle 302 and the trailer 304 to attain a jackknife angle (i.e., the vehicle/trailer system achieving a jackknife condition).","A jackknife angle γ(j) refers to a hitch angle γ that while backing cannot be overcome by the maximum steering input for a vehicle such as, for example, the steered front wheels 306 of the vehicle 302 being moved to a maximum steered angle δ at a maximum rate of steering angle change.","The jackknife angle γ(j) is a function of a maximum wheel angle for the steered wheel 306 of the vehicle 302, the wheel base W of the vehicle 302, the distance L between hitch point 308 and the rear axle 310 of the vehicle 302, and the length D between the hitch point 308 and the effective axle 312 of the trailer 304 when the trailer has multiple axles.","The effective axle 312 may be the actual axle for a single axle trailer or an effective axle location for a trailer with multiple axles.","When the hitch angle γ for the vehicle 302 and the trailer 304 achieves or exceeds the jackknife angle γ(j), the vehicle 302 must be pulled forward to reduce the hitch angle γ.","Thus, for limiting the potential for a vehicle/trailer system attaining a jackknife angle, it is preferable to control the yaw angle of the trailer while keeping the hitch angle of the vehicle/trailer system relatively small.","Referring to FIGS.","5 and 7, a steering angle limit for the steered front wheels 306 requires that the hitch angle γ cannot exceed the jackknife angle γ (j), which is also referred to as a critical hitch angle.","Thus, under the limitation that the hitch angle γ cannot exceed the jackknife angle γ (j), the jackknife angle γ (j) is the hitch angle γ that maintains a circular motion for the vehicle/trailer system when the steered wheels 306 are at a maximum steering angle δ(max).","The steering angle for circular motion with hitch angle is defined by the following equation.","tan δ max = w sin γ max D + L cos γ max Solving the above equation for hitch angle allows jackknife angle γ(j) to be determined.","This solution, which is shown in the following equation, can be used in implementing trailer backup assist functionality in accordance with the disclosed subject matter for monitoring hitch angle in relation to jackknife angle.","cos γ _ = - b ± b 2 - 4 a c 2 a where, a=L2 tan2 δ(max)+W2; b=2 LD tan2 δ(max); and c=D2 tan2 δ(max)−W2.In certain instances of backing a trailer, a jackknife enabling condition can arise based on current operating parameters of a vehicle in combination with a corresponding hitch angle.","This condition can be indicated when one or more specified vehicle operating thresholds are met while a particular hitch angle is present.","For example, although the particular hitch angle is not currently at the jackknife angle for the vehicle and attached trailer, certain vehicle operating parameters can lead to a rapid (e.g., uncontrolled) transition of the hitch angle to the jackknife angle for a current commanded trailer path curvature and/or can reduce an ability to steer the trailer away from the jackknife angle.","One reason for a jackknife enabling condition is that trailer curvature control mechanisms (e.g., those in accordance with the disclosed subject matter) generally calculate steering commands at an instantaneous point in time during backing of a trailer.","However, these calculations will typically not account for lag in the steering control system of the vehicle (e.g., lag in a steering EPAS controller).","Another reason for the jackknife enabling condition is that trailer curvature control mechanisms generally exhibit reduced steering sensitivity and/or effectiveness when the vehicle is at relatively high speeds and/or when undergoing relatively high acceleration.","Jackknife Countermeasures FIG.","8 shows a method 500 for implementing jackknife countermeasures functionality in accordance with an embodiment of the disclosed subject matter for a vehicle and attached trailer.","Trailer backup assist functionality in accordance with the disclosed subject matter can include jackknife countermeasures functionality.","Alternatively, jackknife countermeasures functionality in accordance with one embodiment can be implemented separately from other aspects of trailer backup assist functionality.","The method 500 begins when operation 502 is performed for receiving jackknife determining information characterizing a jackknife enabling condition of the vehicle-trailer combination at a particular point in time (e.g., at the point in time when the jackknife determining information was sampled).","Examples of the jackknife determining information includes, but are not limited to, information characterizing a hitch angle, information characterizing a vehicle accelerator pedal transient state, information characterizing a speed of the vehicle, information characterizing longitudinal acceleration of the vehicle, information characterizing a brake torque being applied by a brake system of the vehicle, information characterizing a powertrain torque being applied to driven wheels of the vehicle, and information characterizing the magnitude and rate of driver requested trailer curvature.","The operation 502 for receiving jackknife determining information can be the first operation in a sampling process where jackknife determining information is sampled upon initiation of an instance of implementing jackknife countermeasures functionality.","In this regard, jackknife determining information would be continually monitored such as, for example, by an electronic control unit (ECU) that carries out trailer backup assist (TBA) functionality.","As discussed above in reference to FIG.","5, a kinematic model representation of the vehicle and the trailer can be used to determine a jackknife angle for the vehicle-trailer combination.","However, the disclosed subject matter is not unnecessarily limited to any specific approach for determining the jackknife angle.","After receiving the jackknife determining information, an operation 504 is performed for assessing the jackknife determining information for determining if the vehicle-trailer combination attained the jackknife enabling condition at the particular point in time.","The objective of the operation 504 for assessing the jackknife determining information is determining if a jackknife enabling condition has been attained at the point in time defined by the jackknife determining information.","If it is determined that a jackknife enabling condition is not present at the particular point in time, the method 500 returns to the operation 502 for receiving another instance of the jackknife determining information.","If it is determined that a jackknife enabling condition is present at the particular point in time, an operation 506 is performed for determining an applicable countermeasure or countermeasures to implement.","Accordingly, in some embodiments, an applicable countermeasure will be selected dependent upon a parameter identified as being a key influencer of the jackknife enabling condition.","However, in other embodiments, an applicable countermeasure will be selected as being most able to readily alleviate the jackknife enabling condition.","In still other embodiment, a predefined countermeasure or predefined set of countermeasures may be the applicable countermeasure(s).","The objective of a countermeasure in the context of the disclosed subject matter (i.e., a jackknife reduction countermeasure) is to alleviate a jackknife enabling condition.","To this end, such a countermeasure can be configured to alleviate the jackknife enabling condition using a variety of different strategies.","In a vehicle speed sensitive countermeasure strategy, actions taken for alleviating the jackknife enabling condition can include overriding and/or limiting driver requested trailer radius of curvature (e.g., being requested via a trailer backup steering input apparatus configured in accordance with the disclosed subject matter) as a function of vehicle speed (e.g., via a lookup table correlating radius of curvature limits to vehicle speed as shown in FIG.","6).","In a countermeasure strategy where trailer curvature requests are limited as a function of speed and driver curvature command transient rates, actions taken for alleviating the jackknife enabling condition can include rate limiting trailer curvature command transients as requested by a driver above a predefined vehicle speed whereas, under the predefined vehicle speed, the as-requested trailer curvature are not rate limited.","In a torque limiting countermeasure strategy, actions taken for alleviating the jackknife enabling condition can include application of full available powertrain torque being inhibited when the jackknife enabling condition is present while the vehicle is above a predefined speed and application of full available powertrain torque being allowed when the vehicle speed is reduced below the predefined speed while in the torque inhibiting mode.","As opposed to a fixed predefined speed, the torque limiting countermeasure strategy can utilize a speed threshold that is a function of hitch angle (i.e., speed threshold inversely proportional to hitch angle acuteness).","In a driver accelerator pedal transient detection countermeasure strategy, actions taken for alleviating the jackknife enabling condition can include overriding and/or limiting driver requested trailer radius of curvature as a function of transient accelerator pedal requests (e.g., requested trailer radius of curvature limited when a large accelerator pedal transient is detected).","In a hitch angle rate sensitive countermeasure strategy, actions taken for alleviating the jackknife enabling condition can include using hitch angle rate in a predefined or calculated mapping with current hitch angle position to limit driver requested trailer radius of curvature.","Accordingly, in view of the disclosures made herein, a skilled person will appreciate that embodiments of the disclosed subject matter are not unnecessarily limited to a countermeasure strategy of any particular configuration.","As disclosed above, implementation of trailer backup assist functionality in accordance with the disclosed subject matter can utilize a kinematic model for determining steering control information, jackknife enabling conditions, and jackknife angle.","Such a kinematic model has many parameters than can influence trailer curvature control effectiveness.","Examples of these parameters include, but are not limited to, the vehicle wheelbase, understeer gradient gain, vehicle track width, maximum steer angle at the vehicle front wheels, minimum turning radius of vehicle, maximum steering rate able to be commanded by the steering system, hitch ball to trailer axle length, and vehicle rear axle to hitch ball length.","Sensitivity analysis for a given kinematic model can be used to provide an understanding (e.g., sensitivity) of the relationships between such parameters, thereby providing information necessary for improving curvature control performance and for reducing the potential for jackknife enabling conditions.","For example, through an understanding of the sensitivity of the parameters of a kinematic model, scaling factors can be used with speed dependent jackknife countermeasures to reduce jackknife potential (e.g., for special applications such as short wheelbase conditions).","Still referring to FIG.","8, after determining the applicable countermeasure(s), an operation 508 is performed for implementing the chosen jackknife countermeasure(s) and an operation 510 is performed for initiating a jackknife warning.","As discussed above in regard to countermeasure strategies, implementing the jackknife countermeasure(s) can include commanding a speed controlling system of the vehicle to transition to an altered state of operation in which a speed of the vehicle is reduced, commanding the steering control system of the vehicle to transition to an altered state of operation in which a radius of curvature of a path of the trailer is increased, command the steering control system of the vehicle to transition to an altered state of operation in which a decrease in the radius of the curvature of the path of the trailer is inhibited, commanding a brake control system of the vehicle to apply brake torque to reduce vehicle speed/inhibit vehicle acceleration, and/or commanding a powertrain control system of the vehicle to inhibit full available powertrain torque from being delivered to driven wheels of the vehicle until another jackknife enabling parameter (e.g., vehicle speed) is below a defined threshold.","In certain embodiments of the disclosed subject matter, the jackknife warning is provided to the driver using at least one vehicle control system through which the jackknife countermeasure is implemented.","Speed reduction, in addition to applying the brakes, can be accomplished by any number of means such as, for example, limiting throttle inputs (e.g., via a terrain management feature) and/or transitioning a transmission to a reverse low gear if the vehicle is equipped with a multi-range reverse gear transmission.","Examples of such system-specific warning approach include, but are not limited to, providing a warning through an accelerator pedal of the vehicle (e.g., via haptic feedback) if the countermeasure includes limiting speed of the vehicle and/or providing a warning through an input element (e.g., knob) of a trailer backup steering input apparatus of the vehicle (e.g., via haptic feedback if the countermeasure includes limiting driver requested trailer radius of curvature), through haptic seat vibration warning, through a visual warning (e.g., through a visual display apparatus of the towing vehicle) and/or through audible warnings (e.g., through an audio output apparatus of the towing vehicle), or the like.","One embodiment of utilizing warnings relating to vehicle speed as it relates to onset or presence of a jackknife enabling condition includes implementation of a dual stage warning.","For example, when a backing speed of the vehicle increases sufficiently for causing a speed of the vehicle to reach a lower (i.e., first) speed threshold during backing of the trailer, a driver of the vehicle would be provided with a first warning indication (e.g., via haptic, audible, and/or visual means as implemented by the trailer backup assist system) for informing the driver that there is the need to reduce the speed of the vehicle to alleviate or preclude the jackknife enabling condition.","If the driver does not correspondingly respond by causing a speed of the vehicle to be reduced (or not to further increase) and the vehicle continues to gain speed such that it passes a higher (i.e., a second) speed threshold, the driver of the vehicle would be provided with a second warning indication (e.g., a more severe haptic, audible, and/or visual means as implemented by the trailer backup assist system) for informing the driver that there is an immediate need to reduce the speed of the vehicle to alleviate or preclude the jackknife enabling condition.","The first and/or the second speed indication warnings can be implemented in conjunction with a respective speed limiting countermeasure measures (e.g., the trailer backup assist system causing activation of a brake system of the vehicle and/or reducing a throttle position of the vehicle).","Human Machine Interface In order to implement the control features discussed above with respect to methods described in FIG.","5 and FIG.","8, a driver must interact with the trailer backup assist system 105 to configure the system 105.The vehicle 100 is also equipped, as shown in FIG.","9, with a human machine interface (HMI) device 102 to implement trailer backup assist functionality through driver interaction with the HMI device 102.FIG.","9 shows an example of an HMI device 102 in the vehicle that a driver uses to interact with the trailer backup assist system 105.The driver is presented with multiple menus 104 (only one example menu is shown in FIG.","9) displayed by way of the HMI 102.The HMI menus 104 assist the driver through modules (shown in FIGS.","10 and 11) that setup 600, calibrate 700, and activate 800 the trailer backup assist system 105 so that control methods 200, 500 may be implemented to assist the driver with the backup of the trailer shown generally as a flow diagram in FIGS.","10 and 11, and to be discussed in greater detail later herein.","Each module is directed to particular elements, or features, which are used to configure the trailer backup assist system to accurately implement control methods 200, 500.While each module is described with reference to particular features of the disclosed subject matter, it should be noted that each module is not necessarily limited to the particular features described in the examples herein.","It is possible to rearrange the modules or to replace elements or features of a module without departing from the scope of the disclosed subject matter.","The trailer backup assist system 105 will guide a driver through the steps necessary to connect a trailer and attach a target.","The driver may activate the setup by way of the backup steering input apparatus 125, for example by turning or pushing the rotary knob, or my merely making a selection for the trailer backup assist system from a menu on the HMI device 102.Referring to FIG.","10, a driver initiates the trailer backup assist system through the trailer backup assist steering input apparatus.","In the case of a rotary knob, the driver presses or rotates the knob to initiate the trailer backup assist system.","The system will guide the driver through the steps of connecting 580 a compatible trailer 110.A compatible trailer is one that pivots at a single point relative to the vehicle and behind the rear axle of the vehicle.","Once the system is selected by either the trailer backup steering input apparatus 125 or the HMI device 102, the system will guide the driver to prepare the vehicle and vehicle trailer combination as necessary.","The vehicle 100 should be turned “on” and the vehicle 100 should be in “park” 590.In the event the vehicle 100 is on but is traveling at a speed that is greater than a predetermined limit, for example five miles per hour, the trailer backup assist system 105 will become inactive and inaccessible to the driver.","The trailer backup assist system 105 setup module 600 will not begin or will be exited 585.If the type of trailer 110 selected by the driver is a trailer 110 that is not compatible with the trailer backup assist system 105, the setup module 600 will be exited 585 or will not begin.","In the event, the trailer 110 is compatible with the trailer backup assist system 105, the setup module 600 verifies that the vehicle 100 gear shift mechanism is in “park.” Again, in the event the vehicle is not “on” and the gear shift mechanism is not on “park,” the setup module will not begin 585.Upon connection 580 of a compatible trailer 110, the vehicle 100 being “on” 590 and the vehicle 100 being in “park” 590, the HMI 102 will present a menu 104 that has a “Towing” mode option to be selected by the driver.","The driver selects “Towing” mode and a menu 104 is presented that provides a “Trailer Options” selection.","The driver then selects a “Trailer Options” mode from the “Towing” menu.","The driver is prompted to either “add a trailer” or “select a trailer” from a menu 104 presented on the HMI device and the “Setup” module 600 has begun.","For certain camera-based hitch angle detection systems, an operation 602 is performed wherein a warning menu may be presented to the driver, by way of the HMI, informing the driver that the trailer must be in a straight line, meaning there is no angle at the hitch between the vehicle and the trailer.","The warning indicates that the driver may need to take corrective action, for example, pull the vehicle forward in order to align the trailer and the vehicle as required for the setup 600.A generic or static graphic may be presented by way of the HMI 102 to assist the driver in visually recognizing the alignment between the trailer 110 and the vehicle 100 that is necessary in order to properly setup and calibrate the trailer backup assist system 105.The driver applies any corrections 603 in that the driver makes any necessary adjustment he has been alerted to and indicates, by acknowledging that corrective actions have been applied 603 and that the trailer is in line with the vehicle.","Other hitch angle detection systems may not need the driver to straighten the trailer during setup mode.","To aid the driver in the setup process, the reverse back lights, or any other supplemental lighting that may be available on the vehicle, are illuminated 604.In the event the trailer is a new trailer, one that has not been attached to the vehicle before or has not been previously stored in the trailer backup assist system, the driver is presented 606 with an option to either name the trailer or select a previously stored trailer configuration.","Naming the trailer 608 allows the trailer to be easily identified the next time it is attached to the vehicle so that the driver does not have to repeat the setup process.","The driver either enters a unique name to identify the trailer that is to be stored in the trailer backup assist system or selects a previously stored trailer configuration associated with the attached trailer.","The trailer backup assist system will not allow more than one trailer to have the same name.","Therefore, if a driver attempts to name a trailer using a name that has already been applied to a previously stored trailer configuration, the HMI will display a message to the driver indicating so and requesting the driver enter a different name for the trailer configuration.","In the case where a previously stored trailer configuration is available and selected 610 by the driver, certain steps in the setup process may be skipped.","The following discussion is directed to a first time trailer configuration for a camera-based hitch angle detection system.","The driver is instructed 612 to place a hitch angle target on the trailer that is used for calibration purposes.","A generic static image may be displayed on the HMI that provides direction to the driver as to placement of a target on the trailer that is used for hitch angle detection.","The target placement is dependent upon the type of trailer being towed and therefore, options may be presented to the driver to aid the driver in selecting an appropriate trailer type.","The static image may indicate areas that are acceptable for target placement as well as areas that are unacceptable for target placement.","The static image indicating the appropriate areas for attaching the target may be an overlay of the rear view of the trailer hitch.","Once the driver attaches the target to the trailer and indicates by way of the HMI that the target has been attached to the trailer the setup mode provides 614 visual feedback to the driver identifying that the target has been located, or acquired.","The driver acknowledges 616, by way of the HMI, that the target has been properly identified by the trailer backup assist system.","Similarly, for a previously stored trailer configuration, the trailer will already have a target placed thereon.","The trailer backup assist system will acquire the target and provide 614 visual feedback to the driver confirming acquisition of the target.","In the event the target is not acquired 614 after a predetermined amount of time lapses, the driver is notified 618 of the need to reposition the target and presented with possible corrective measures that may be taken.","Possible corrective measures may be presented to the driver such as cleaning the camera lens, cleaning the target, replacing the target if it has been damaged or faded, pulling the vehicle-trailer combination forward to improve lighting conditions around the camera and/or target, and moving the target to an acceptable location.","The driver applies the necessary corrections 603.As mentioned above, some hitch angle detection systems may not require the driver to attach a target to the trailer during set up mode.","The target and acquisition of the target are directed to camera-based hitch angle detection systems.","When the target is acquired 614 by the trailer backup assist system and the driver has acknowledged 616 the acquisition, the driver is then prompted through a series of menus to input 620 trailer measurement information that may be stored in the trailer backup assist system for a trailer configuration that is to be associated with the named trailer.","The next time the same trailer is attached to the vehicle, its unique trailer configuration will already be stored and progress through the setup module will be faster or, in some cases, may be skipped entirely.","Generic static images may be displayed at the HMI screen in order to assist the driver with the measurement information.","Visual examples, see FIG.","12, may be provided to aid the driver in identifying the location on the vehicle, the trailer or between the vehicle and trailer that the driver is being prompted to enter.","In addition, numerical limits for the driver entered measurements are set within the trailer backup assist system and may be displayed to the driver.","The driver may be warned about entered measurements that exceed the numerical limits.","Additionally, the measurement information requests that the driver is prompted to enter may be presented to the driver in the order that the measurements should be entered into the trailer backup assist system.","It should be noted that while measurement information is discussed above as being entered by the driver, various methods of entering measurement information may also be employed without departing from the scope of the disclosed subject matter.","For example, a system to automatically detect measurements using existing vehicle and trailer data including, but not limited to, vehicle speed, wheel rotation, steering wheel angle, vehicle to trailer relative angle, and a rate of change of the vehicle to hitch angle.","Examples of the measurement information may include a horizontal distance from the rear of the vehicle to the center of a hitch ball, a horizontal distance from the rear of the vehicle to a center of the target, a vertical distance from the target to the ground, and a horizontal offset of the target from a centerline of the hitch ball.","In the event the target is attached at other than the centerline of the hitch ball, then the trailer backup assist system must know which side of the vehicle the target is attached to, the passenger side or the driver side.","A menu on the HMI may be presented for the driver to indicate passenger side or driver side for the placement of the target.","The trailer backup assist system also needs to know the horizontal distance from the rear of the vehicle to a center of the axle or axles of the trailer.","The measurements may be entered in either English or metric units.","The driver is presented 622 with the option to revise any of the measurements before proceeding with the setup process.","Otherwise, the setup module 600 is complete 624 and the calibration module 700 begins.","The calibration module 700 is designed to calibrate the curvature control algorithm with the proper trailer measurements and calibrate the trailer backup assist system for any hitch angle offset that may be present.","After completing the setup module 600, the calibration module begins 700 and the driver is instructed 702 to pull the vehicle-trailer combination straight forward until a hitch angle sensor calibration is complete.","The HMI may notify 704 the driver, by way of a pop up or screen display that the vehicle-trailer combination needs to be pulled forward until calibration is complete.","When calibration is complete, the HMI may notify 704 the driver.","Any hitch angle offset value is stored 706 in memory, accessed as necessary by the curvature control algorithm, and the calibration module 700 ends 704.It should be noted that while hitch angle calibration is described above as may be requesting the driver pull forward information, various other methods of hitch angle calibration may also be employed without departing from the scope of the embodiment.","Upon completion of the setup module 600 and the calibration module 700, the activation module 800 may begin.","The activation module 800 is described with reference to FIG.","11.The activation module 800 is designed to activate automatic steering of the vehicle during trailer backup assist operations.","The driver is instructed 802 to place the vehicle in reverse.","Upon activation of the trailer backup assist system, the steering system will not accept any steering angle commands from any source other than the trailer backup assist system 804.The trailer setup 600 and calibration 700 modules must be completed and a current hitch angle must be within a predetermined operating range for the trailer backup assist system 806.The vehicle speed must also be less than a predetermined activation speed 808.In the event any one, or all, of these conditions 804, 806, 808 are not met, the driver is prompted to apply a corrective measure 810.The driver must confirm 814 that the corrective action has been taken in order for the control module to begin.","If a corrective action is taken, but the activation module deems it unacceptable, the driver will be instructed 810 to try another corrective action.","For steering systems where the steering wheel is directly coupled to the steered wheels of the vehicle, the driver cannot engage with the steering wheel during trailer backup assist.","If any steering wheel motion is obstructed, by the driver or otherwise, the trailer backup assist system will present instructions 810 to the driver to remove their hands from the steering wheel.","Activation 800 will be suspended or discontinued until the obstruction is removed.","If the vehicle speed exceeds a threshold speed or if the vehicle hitch angle is not acceptable, the driver will be prompted 810 to take corrective action.","Until corrective action is taken, accepted and acknowledged, the activation 800 and control 200, 500 modules will be interrupted.","When the driver moves the gear shift from “park” to “reverse” 802 and presses or turns a trailer backup steering input apparatus 125 a rear view camera image may appear in a display of the HMI.","If at any time during the reversing process the hitch angle becomes too large for the system to control the curvature of the trailer, the TBA will provide a warning to the driver to pull forward to reduce the hitch angle.","If at any time during the reversing process the system is unable to track the hitch angle target, the driver is presented with instructions to correct the problem.","If at any time the vehicle speed exceeds that predetermined activation speed, the driver is visually and audibly warned to stop or slow down.","When all of the conditions of the activation module are met and maintained, the control module may begin.","The control module executes the directives described above with reference to FIGS.","5 and 7.However, the activation module 800 includes a monitoring function 816 so that, if at any time during execution of the control module 200, 500 the control is interrupted, the driver is instructed to make necessary corrections.","In the event any one of the necessary corrections is not made, the control of the vehicle by way of the trailer backup assist system will end.","The driver may also intentionally end the control by exiting the system through a menu selection on the HMI or placing the vehicle in a gear setting that is other than park or reverse.","Referring now to instructions processible by a data processing device, it will be understood from the disclosures made herein that methods, processes and/or operations adapted for carrying out trailer backup assist functionality as disclosed herein are tangibly embodied by non-transitory computer readable medium having instructions thereon that are configured for carrying out such functionality.","The instructions are tangibly embodied for carrying out the method 200, 500, 600, 700 and 800 disclosed and discussed above and can be further configured for limiting the potential for a jackknife condition such as, for example, by monitoring jackknife angle through use of the equations discussed in reference to FIGS.","5 and 7 and/or by implementing jackknife countermeasures functionality discussed above in reference to FIG.","8.The instructions may be accessible by one or more data processing devices from a memory apparatus (e.g.","RAM, ROM, virtual memory, hard drive memory, etc.","), from an apparatus readable by a drive unit of a data processing system (e.g., a diskette, a compact disk, a tape cartridge, etc.)","or both.","Accordingly, embodiments of computer readable medium in accordance with the disclosed subject matter include a compact disk, a hard drive, RAM or other type of storage apparatus that has imaged thereon a computer program (i.e., instructions) configured for carrying out trailer backup assist functionality in accordance with the disclosed subject matter.","In a preferred embodiment of the disclosed subject matter, a trailer backup assist control module (e.g., the trailer backup assist control module 120 discussed above in reference to FIG.","1) comprises such a data processing device, such a non-transitory computer readable medium, and such instructions on the computer readable medium for carrying out trailer backup assist functionality (e.g., in accordance with the method 200 discussed above in reference to FIG.","2) and/or the method 500 discussed above in reference to FIG.","8 and/or the methods 600, 700 and 800 discussed above in reference to FIGS.","10 and 11.To this end, the trailer backup assist control module can comprise various signal interfaces for receiving and outputting signals.","For example, a jackknife enabling condition detector can include a device providing hitch angle information and hitch angle calculating logic of the trailer backup assist control module.","A trailer backup assist control module in the context of the disclosed subject matter can be any control module of an electronic control system that provides for trailer backup assist control functionality in accordance with the disclosed subject matter.","Furthermore, it is disclosed herein that such a control functionality can be implemented within a standalone control module (physically and logically) or can be implemented logically within two or more separate but interconnected control modules (e.g., of an electronic control system of a vehicle) In one example, trailer backup assist control module in accordance with the disclosed subject matter is implemented within a standalone controller unit that provides only trailer backup assist functionality.","In another example, trailer backup assist functionality in accordance with the disclosed subject matter is implemented within a standalone controller unit of an electronic control system of a vehicle that provides trailer backup assist functionality as well as one or more other types of system control functionality of a vehicle (e.g., anti-lock brake system functionality, steering power assist functionality, etc.).","In still another example, trailer backup assist functionality in accordance with the disclosed subject matter is implemented logically in a distributed manner whereby a plurality of control units, control modules, computers, or the like (e.g., an electronic control system) jointly carry out operations for providing such trailer backup assist functionality.","Trailer Target Placement and Monitoring The vehicle trailer backup assist system may utilize a target placed on the trailer to serve as the hitch angle detection component 155.In doing so, the trailer backup assist system may employ information acquired via image acquisition and processing of the target for use in the hitch angle detection apparatus 130, according to one embodiment.","According to other embodiments, the target may be used to identify if a connected trailer has changed, trailer connection or disconnection, and other trailer related information.","The target is an identifiable visual target that can be captured in an image by the video imaging camera and detected and processed via image processing.","According to one embodiment, the target may include an adhesive target, also referred to as a sticker, that may be adhered via adhesive on one side onto the trailer, preferably within a target placement zone, such that the camera and image processing may detect the target and its location on the trailer to determine trailer related information, such as the hitch angle between the trailer and the towing vehicle.","The trailer backup assist system may provide to the user one or more image(s) of the trailer target zone for proper placement of the target to assist with placement of the target on the trailer.","Additionally, the vehicle trailer backup assist system may monitor the target to determine if the target has been correctly placed within a desired target placement zone and provide feedback alert(s) to the user.","Further, the trailer backup assist system may monitor the trailer connection by monitoring the target to determine if the target has moved to determine whether the same trailer remains connected to the tow vehicle, and may initiate action in response thereto.","Further, the trailer backup assist system may monitor the hitch angle or the target to determine if the trailer may have been changed out (i.e., disconnected and replaced with another trailer), and may initiate action in response thereto.","Referring to FIG.","13, the vehicle trailer backup assist system 105 is shown including the hitch angle detection apparatus 130 and a target monitor controller 10 for monitoring the target, assisting with placement of the target, monitoring connection of the trailer, determining if the trailer has moved, and initiating certain actions.","The target monitor controller 10 may include a microprocessor 12 and/or other analog and/or digital circuitry for processing one or more routines.","Additionally, the target monitor controller 10 may include memory 14 for storing one or more routines including image processing routine(s) 16, a target placement assist routine 900, a target monitoring routine 920, an initial setup for target moved detection routine 940, a target moved detection routine 960, and a trailer connection monitoring routine 990.It should be appreciated that the target monitor controller 10 may be a standalone dedicated controller or may be a shared controller integrated with other control functions, such as integrated with the hitch angle detection apparatus 130, to process the images of the trailer and target and perform related functionality.","In one embodiment, the hitch angle detection apparatus 130 processes the acquired images of the target from the target monitor controller 10 and other information such as trailer length for use in determining the hitch angle between the trailer and the towing vehicle.","A camera 20 is shown as an input for providing video images to the target monitor controller 10 of the vehicle trailer backup assist system 105.The camera 20 may be a rearview camera mounted on the tow vehicle in a position and orientation to acquire images of the trailer towed by the vehicle rearward of the vehicle.","The camera 20 may include an imaging camera that generates one or more camera images of the trailer including the region where a target placement zone is expected to be located on the trailer.","The camera 20 may include a video imaging camera that repeatedly captures successive images of the trailer for processing by the target monitor controller 10.The target monitor controller 10 processes the one or more images from the camera 20 with one or more image processing routine(s) 16 to identify the target and its location on the trailer.","The target monitor controller 10 further processes the processed images in connection with one or more of routines 900, 920, 940, 960 and 990.The trailer monitor controller 10 may communicate with one or more devices including vehicle exterior alerts 24 which may include vehicle brake lights and vehicle emergency flashers for providing a visual alert and a vehicle horn for providing an audible alert.","Additionally, the trailer monitor controller may communicate with one or more vehicle human machine interfaces (HMIs) 25 including a vehicle display such as a center stack mounted navigation/entertainment display.","Further, the trailer monitor controller 10 may communicate via wireless communication 22 with one or more handheld or portable devices 26, such as one or more smartphones.","The portable device 26 may include a display 28 for displaying one or more images and other information to a user.","The portable device 26 may display one or more images of the trailer and the target location within a desired target placement zone on display 28.In addition, the portable device 26 may provide feedback information about the vehicle target connection including visual and audible alerts.","Referring to FIGS.","14-17, the placement of the target 30 onto trailer 110 using the target monitor controller 10 processing the target placement assist routine 900 is illustrated according to one exemplary embodiment.","In FIGS.","14 and 15, a tow vehicle 100 is shown towing a trailer 110.The trailer 110 has a trailer hitch connector in the form of a coupler assembly 114 connected to a vehicle hitch connector in the form of a receiver hitch and ball 15.The coupler assembly 114 latches onto the hitch ball 15 to provide a pivoting ball joint.","The trailer 110 is shown having a frame including a longitudinally extending bar or trailer tongue 112.A top horizontal surface of trailer tongue 112 is shown providing a desired target placement zone 32 for receiving the target 30.It should be appreciated that the trailer 110 may be configured in various shapes and sizes and may offer one or more other suitable target placement zones 32 for receiving the target 30.The target placement zone 32 defines the desired location for placement of the target 30.The vehicle 100 is equipped with a video imaging camera 20 shown located in an upper region of the vehicle tailgate at the rear of the vehicle 100.The video imaging camera 20 is elevated relative to the target placement zone(s) and has an imaging field of view and is located and oriented to capture one or more images of the trailer 110 including a region containing one or more desired target placement zone(s).","It should be appreciated that one or more cameras may be located at other locations on the vehicle 100 to acquire images of the trailer 110 and the target placement zone(s) 32.In order to utilize a target on a trailer that is not currently equipped with a suitable pre-existing target, a user 2 may be instructed or directed to place the target 30 onto the trailer 110 within a desired target placement zone 32 so that the camera 20 may capture one or more images of the target 30 to determine trailer related information for the trailer backup assist system, such as hitch angle information for the hitch angle detection apparatus 130.In doing so, a user 2 may be prompted by an audible or visual message on an HMI such as the vehicle HMI 25 or portable device 26 to place the target 30 on the trailer 110.The vehicle HMI 25 may include visual and/or audible outputs generating instructions for proper target placement.","To allow for efficient and proper placement of the target 30 onto the trailer 110, the trailer backup assist system employs a target placement assist method or routine 900 shown in FIG.","17 that is processed by the target monitor controller 10.The target placement assist method 900 includes step 902 in which a user may connect a portable device having an image display to communicate with the vehicle.","The user may connect the device electronically to the vehicle which can be achieved by way of a wireless protocol, according to one embodiment.","The device may be a wireless device that may communicate via Wi-Fi, BLUETOOTH® or other wireless protocol.","Alternatively, the device could be connected via a wired connection.","Next, at step 904, the user initiates the hitch angle detection system setup which requires initiating the setup procedure for the hitch angle detection system.","As part of this procedure, the user will be required to place a target onto the trailer of the vehicle within a target placement zone.","At step 906, the system generates with the camera one or more images of the towed trailer which include a region where the desired target placement zone(s) is expected to be located.","There may be more than one target placement zone and one zone may be preferred over another zone.","At step 908, the system processes the generated images and determines the desired target placement zone on the trailer.","The desired target placement zone may be determined based on camera location and orientation, desired distance of the target from the hitch connection and the physical structure of the trailer.","At step 910, the system generates a target overlay on the one or more generated images.","The target overlay is a visual indication of the desired location of the target within the target placement zone upon which the user is instructed to place the target.","The target overlay may include border lines marking the target placement zone or other identifier.","The target overlay may be shown by flashing colored (e.g., red) lines on a displayed image.","Target overlays of a plurality target placement zones may be generated and shown.","At step 912, the system communicates the one or more images and the target overlay to the vehicle's display and if connected in step 902, the user's display on the portable device by utilizing the wireless or wired connection.","Next, at step 914, the user's display on the portable device displays an image of the target placement zone indicated by the target overlay.","At step 916, the user is then prompted by an HMI to place the target on the trailer within the target placement zone with assistance from the displayed image and target overlay on the vehicle's display and/or the portable display.","One example of a displayed image on the display 28 of a portable device 26 showing an overlay of the target location for the target to be placed on the trailer is illustrated in FIG.","16.The image displayed on the display 28 includes an image of the trailer 110 as captured by the camera and further includes an overlay of the desired target placement zone 32.The user 2 may view the image on the display 28 of the portable device 28 to determine where to place the target relative to the trailer 110.In this example, the user may place the target 30 onto the target placement zone 32 as indicated by the target overlay.","Placement of the target may be achieved by adhering a target sticker onto a surface of the trailer.","As a result, the user may employ a portable device with a display, such as a phone, a tablet, or a computer to view the proper location for placement of the target on the trailer prior to and during application of the target onto the trailer.","Accordingly, the target placement assist method 900 advantageously assists the user with placement of the target 30 onto the trailer 110 in a manner that is simple to use, accurate and efficient.","The user 2 may easily transport a portable device having a display to communicate with the vehicle and view the correct placement location for the target prior to and during the target placement procedure without having to return to the vehicle or otherwise be prompted for target placement.","The trailer backup assist system 105 further includes a target monitoring method or routine for monitoring placement of the target on the trailer and providing feedback to the user as to whether the target has been placed within a proper target placement zone.","A user may place a target on the trailer in various ways.","In some situations, the user may be prompted by the TBA system via a vehicle HMI to place a target on the trailer and may be given instructions as to the location.","The user may employ the target placement assist method 900 to assist with placement of the target on the trailer.","In other situations, the user may place the target on the trailer using their best judgment or following instructions printed on the target or packaging provided therewith.","In any event, once the target is placed on the trailer, the target monitoring method 920 will monitor the location of the target relative to the trailer and provide feedback to the user as to correct or incorrect placement of the target on the trailer.","The target monitoring method 920 is illustrated in FIG.","18, according to one embodiment.","At step 922, method 920 requires attaching the trailer to the vehicle onto the ball and hitch if it is not already attached.","Next, at step 924, setup for the hitch angle detection is initiated.","At step 926, the user is prompted via an interface to place the target on the trailer.","The user may place a target on the trailer based on predefined criteria or the user's best judgment or knowledge, according to one embodiment.","The user may be instructed on where to place the target on the trailer by use of a user's manual, an instruction sheet, or other visual or audible communication of instructions, according to other embodiments.","Generally, the target should be placed in a region that is unobstructed from view by the camera and that allows for the acquisition of an image and determination of desired trailer related information, such as the hitch angle.","Depending on the trailer configuration and camera orientation and height, the target may be required to be placed within a certain region of the trailer, within a distance range from the trailer hitch connection having a minimum distance from the hitch connection, such as 7 inches (17.78 centimeters), within a range from the tow vehicle bumper, and within a range of height from the ground.","The target placement may require a location within a certain distance from a centerline of the longitudinal axis of the trailer, and may require a vertical or horizontal angle or some angle in between the vertical and horizontal positions.","According to another embodiment, the user may utilize the target placement assist method 900 to place the target on the trailer.","At step 928, the system generates one or more images of the target placement zone on the towed trailer.","The system then processes the one or more images to determine the presence of a target within a desired target placement zone at step 930.The desired target placement zone may be determined by criteria, such as distance from the trailer hitch connection formed by the coupler assembly 114, distance from a centerline of the longitudinal axis of the trailer, height of the camera relative to the trailer, and distance of the camera from the trailer.","At decision step 932, method 900 determines if the target has been detected by the processed image(s) and, if not, returns to step 926 to prompt the user via an HMI to place the target on the trailer.","If the target has been detected by the processed images, the vehicle trailer backup assist system provides a feedback alert to the user at step 934.The feedback alert may include one or more of vehicle exterior alerts including visual alerts, such as flashing the vehicle brake lights and/or flashing the vehicle emergency flashers, and/or audible alerts, such as sounding the vehicle horn.","Additionally, the feedback alerts may include providing a message via the portable device 26, providing an audible tone via the portable device 26 or a visual lighted indication via the portable device 26.Further, feedback alerts may include sending a text message or audible instructions to a user via a portable device, such as a phone or computer.","It should be appreciated that other vehicle exterior and alternative feedback alerts may be communicated to the user to indicate that proper placement of the target has been detected on the trailer.","Alternatively, the feedback alerts could be used to indicate improper placement of the target on the trailer.","Once the trailer is properly equipped with the target in the proper location, the trailer backup assist system may process information by monitoring the target to determine the hitch angle and other trailer towing related functionality.","The target 30 may include a sticker having adhesive on the bottom surface and a predetermined image pattern of a certain size and shape provided on the top surface for capture by the video camera and recognition by the image processing.","The target 30 may have a rectangular shape, according to one embodiment, and may have a camera image recognizable pattern such as the checker pattern shown.","The image processing may include known image pattern recognition routines for identifying a target pattern and its location on a trailer.","However, it should be appreciated that other target shapes, sizes and patterns may be employed.","It should further be appreciated that the target may otherwise be connected to the trailer using connectors, such as fasteners, which may connect to the trailer or to an attachment to the trailer.","It should further be appreciated that the target can be attached via magnet, glued on, painted on, or any number of other suitable means.","It should be appreciated that not all trailers are necessarily configured to provide a well-suited location for placement of a target sticker on the trailer.","Accordingly, a target location may be added to a given trailer by use of a target mounting system 40 as shown in FIGS.","19 and 20, according to one embodiment.","The target mounting system 40 is shown installed onto trailer 110 to present a target 30 that is viewable by the camera within a desired target placement zone.","The target mounting system 40 includes a vertical mounting post or bracket 44 having a plurality of bolt receiver holes 46 extending vertically to allow for a desired vertical height adjustment.","The bracket 44 may be assembled onto the trailer via holes 54 using bolts 48, washers 52 and nuts 50.The height of the bracket 44 may be adjusted depending on which holes 46 are aligned with the trailer holes 54.Mounted to the top of the bracket 44 is a target plate 42 having a top target placement zone 32 onto which the target 30 is located.","The plate 42 likewise has a plurality of holes 46 that align horizontally with the holes in the bracket 44 and may be assembled thereto via bolts 48, washers 52 and nuts 50.Accordingly, the plate 42 may be adjusted both vertically and horizontally to a desired position so as place the target 30 adjustably within a desired location so that the target is easily acquired by the camera and processed by the image processing.","It should be appreciated that assistance in mounting the target mounting system 40 along with the target 30 and verification of proper location of the target mounting system 40 and target 30 may be achieved by utilizing the target placement assist method 900 and target monitoring method 920 discussed above.","The target moved detection method includes an initial setup routine 940 and subsequent processing routine 960 for target moved detection used for prompting the entry of trailer information.","The target moved detection method determines if the location of a hitch angle target on a trailer, such as a trailer tongue, has moved and may also determine if the distance has changed.","Images of the target in a previously stored image and a newly acquired image are compared to determine if the location and/or distance to the target has changed.","The comparison may include comparing camera image pixel sizes of the images.","If either the location or the distance changes, the user is then prompted by an HMI to reenter new trailer information for subsequent processing of the trailer backup assist system.","The initial setup routine 940 is illustrated in FIG.","21.Initially, the trailer must be attached to the vehicle at step 942.At step 944, the attached trailer is setup for hitch angle tracking.","For a vision-based system, this may include applying a target sticker to the trailer, such as in the vicinity of the tongue of the trailer, so that the vehicle-based camera can detect motion of the target as the trailer maneuvers and swings around curves.","In addition, a number of parameters associated with the location of the target that are used to properly calculate the hitch angle based on the vision processing may be entered.","These parameters may include the distance of the target to the ground and the distance from the target to the bumper of the vehicle.","At step 946, the vehicle and the trailer are directed to be driven straight, which may be achieved by driving the vehicle and towed trailer in the forward direction.","This is to ensure that there is about zero hitch angle between the vehicle and trailer with the trailer in-line with the vehicle and that the image generated in subsequent steps will be taken in the same orientation and will be valid for image comparisons.","At step 948, a picture (image) of the target and trailer are acquired with the use of the camera while the vehicle and the trailer are in a straight line at a hitch angle of about zero degrees.","At step 950, the image processing performs vision processing on the image.","The vision processing may first detect a target and then compute the size and location of the target based on processing the pixels of the image.","At step 952, the image acquired in step 948 is stored in memory and the information calculated in step 950 is stored in memory.","The image and calculated information are then subsequently used to determine if the target has moved.","If the target has moved, the system may assume that the trailer may have been changed or replaced with a different trailer, and hence prompts the user via an HMI to enter trailer information.","Referring to FIG.","22, the target moved detection routine 960 is shown beginning at step 962 in which the driver is instructed to reattach to the vehicle a trailer that was previously set up and used in the initial setup routine 940.At step 964, the user is prompted by the hitch angle detection system to select the trailer that was previously setup and stored, rather than selecting a new trailer.","At step 966, the user is prompted to drive the trailer and vehicle combination forward in a straight line to achieve a hitch angle of about zero degrees.","Next, at step 968, a new image of the target and the trailer are acquired by the camera.","At step 970, vision processing is performed on the image to detect the target and compute the size and location of the target by processing the pixels of the image.","At step 972, the target location and size as calculated above are compared to the location and size of the target taken in the prior image from the initial setup.","At step 974, a determination is made to determine if the new target information is a match or within tolerance of the original target information.","If the newly acquired target is still a similar size and in the similar location on the image as compared to the prior image from the initial setup, then the target is likely to be in the same location and will allow for a proper hitch angle detection if determination of such is made in step 980.If the target has a different location or has a different size, then the target is presumed to have moved and routine 960 proceeds to step 976.Detected movement of the target may occur when the trailer is a different trailer as compared to the trailer last selected by the user.","The use of the prior selected trailer configuration may provide erroneous results for hitch angle target tracking.","As such, method 960 proceeds to step 978 to prompt the user (e.g., driver) to reselect or re-setup the trailer configuration with new target and trailer information.","Accordingly, the target moved detection routine 960 advantageously detects movement of the target which may indicate potential connection of a new trailer to the vehicle, such that the user is prompted via an HMI to select new trailer configuration information.","Additionally, the target moved routine could also detect that a target has moved due to a different sized drawbar being installed than what was installed when the trailer was initially setup.","Examples of images of the trailer and the target moved to a different position are illustrated in FIGS.","23A and 23B.","As shown in FIG.","23A, an image of the trailer and the target 30 is shown aligned on the trailer in a first position as compared to the subsequent image in FIG.","23B showing the target 30 moved to a new second closer position.","The change in location of the target may be an indication that the trailer has been changed out with a new trailer or that the target has otherwise been moved on the trailer.","When this occurs, the target move detection routine 960 requires the user to re-enter trailer configuration information so that the wrong information is not used to provide incorrect hitch angle data.","Furthermore, it is possible that the right (correct) trailer has been selected and the target is still in the same location on the trailer, but the system still indicates that the target has moved.","This could occur if the drawbar length on the vehicle has changed.","Target monitor controller 10 further processes a trailer connection monitoring routine 990 to determine whether a trailer is connected to the vehicle and whether a new trailer may have been connected.","When the trailer is disconnected from the vehicle, the target information and the hitch angle information may be unavailable for a period of time.","Accordingly, the trailer connection monitoring method 990 monitors the availability of the hitch angle data and/or the detection of the target to determine if the hitch angle data or target data is lost for a substantial period of time.","If this occurs, the driver is then prompted via an HMI to reselect the attached trailer or to re-enter trailer configuration data to ensure that the wrong trailer information is not employed.","The trailer connection monitoring routine 990 is illustrated in FIG.","24.At step 992, a trailer is connected to the vehicle.","At step 994, the trailer is setup for hitch angle detection and monitoring.","If a vision based system is employed, this may include placing a target on the trailer for the vision-based system to detect as well as entering pertinent parameters.","Alternatively, if the trailer has been previously setup for hitch angle monitoring, it may be possible to select the previously stored setup configuration for that trailer.","At step 996, once the trailer has been setup for hitch angle detection, the hitch angle detection system will continuously monitor the hitch angle or target.","At decision step 998, routine 990 determines if the hitch angle or the target has been dropped for a time period greater than X seconds.","Depending on the type of hitch angle system, the hitch angle signal may drop or become unavailable for different reason, but one potential reason is that the trailer has been disconnected from the vehicle.","A disconnected trailer may also result in the target detection being unavailable.","As such, a check is made to see how much time has expired since the hitch angle signal or target detected has been dropped.","If the hitch angle or target detection has been dropped for a time period of less than X seconds, then routine 990 returns to track the hitch angle or target at step 996.If the hitch angle or target detection has been dropped for a time period greater than X seconds, then the user is prompted via an HMI to reselect or re-setup the trailer configuration in step 1000.The time period X is set to represent a reasonable amount of time needed to swap or change-out trailers.","For example, for extremely small, lightweight trailers, it may be possible to swap trailers out in less than sixty (60) seconds, so this could be a reasonable time period.","According to one embodiment, the time period X is set for thirty (30) seconds.","While the hitch angle is monitored to determine disconnection of a trailer from the vehicle, it should be appreciated that the trailer connection monitoring routine 990 may monitor detection of the target as an alternative, such that if the target is no longer detected for X seconds, then the vehicle driver may be prompted to reselect or reconfigure the trailer.","Supplemental Vehicle Lighting System As previously described, the trailer backup assist system 105 may employ a vision based target detection system, wherein the hitch angle detection component 155 is an identifiable visual target located on a trailer attached to a towing vehicle.","The towing vehicle may be equipped with a rear view camera, which functions as the hitch angle detection apparatus 130, and is configured to image the target and process acquired image data to generate trailer related information used in a variety of applications associated with the trailer backup assist system 105.By following the previously described target placement assist method 900 and/or other suitable methods, a vision based target detection system can be readily configured for accurate target detection.","Nevertheless, there may be some circumstances that hinder target detection accuracy.","One such circumstance involves performing target detection under dark conditions when existing vehicle lights, such as taillights, provide insufficient target lighting.","While aftermarket lighting assemblies are available, such assemblies may appear unsightly and may lack the ability to be integrated with the trailer backup assist system 105.Thus, it is desired to provide a supplemental vehicle lighting system that not only cooperates with the trailer backup assist system 105, but also confers a styling advantage to vehicles in which it is featured.","As will be described in greater detail below, a supplemental vehicle lighting system is disclosed herein that utilizes an existing keylock hole of a rear vehicle closure member or other rear vehicle fixture.","For purposes of illustration, FIG.","25A exemplarily shows a tow vehicle 1005 having a rear vehicle closure member embodied as a tailgate 1010 that includes a keylock hole 1015 defined in a tailgate handle assembly 1020.As exemplarily shown in FIGS.","25B-25D, the keylock hole 1015 is customarily used in conjunction with a corresponding keylock cylinder 1025 that includes a keyhole 1030 that is accessible through the keylock hole 1015.It should be appreciated that the keylock cylinder 1025 may be supported inside the tailgate 1010 in a variety of ways.","For purposes of illustration, the keylock cylinder 1025 is shown engaged to protrusions 1035, 1038, and 1040 of the tailgate handle assembly 1020 and is secured to the tailgate handle assembly 1020 with mechanical fastener 1045.When a corresponding key is inserted into the keyhole 1030 and turned in the proper direction, a locking tab 1050 of the keylock cylinder 1025 is moved to an unlocked position to enable the tailgate 1010 to be lowered so that a rear vehicle cargo area can be accessed.","While the rear closure member has been generally described herein as a tailgate 1010, it should be appreciated that the rear closure member may also include a liftgate, a trunk lid, a swing door, a sliding door, and the like, depending on the type and/or make of the selected vehicle 1005.Likewise, it should also be appreciated that the configuration and/or location of the keylock hole 1015 and keylock cylinder 1025 may vary across vehicle types and/or makes.","Therefore, the keylock hole 1015 may be defined in other parts and/or areas of the rear vehicle closure member or in some other rear vehicle fixture altogether.","While many current vehicles are equipped with a keylock hole and a keylock cylinder, seldom is a key used to unlock a rear vehicle closure member given the proliferation of vehicles having power lock systems or other means of entry.","Thus, with respect to some vehicles, the inclusion of a keylock cylinder produces added cost and consumes space that could otherwise be used to implement other devices.","Recognizing this, a supplemental vehicle lighting system is provided herein that advantageously replaces a keylock cylinder with a light assembly operably coupled to a rear keylock hole of a selected vehicle, through which the light assembly is able to illuminate a rear vehicle area.","In so doing, little to no modification need be made to existing rear vehicle fixtures since the light assembly may be fashioned to be mounted to in the same way as the keylock cylinder.","In this manner, vehicle manufacturers can offer vehicles equipped with a light assembly without having to perform substantial retooling.","Similarly, an existing keylock cylinder may be easily swapped for a light assembly in vehicles desiring the benefits bestowed by the supplemental vehicle lighting system described herein.","Referring to FIGS.","26A-26D, a light assembly 1055 is shown according to one embodiment and includes a housing 1060 having an open top defined by an upper edge 1065.The light assembly 1055 also includes a barrel 1070 having a distal end 1075 and a proximal end 1080.A lighting device 1085 including one or more light emitting diodes (LEDs) 1087 is disposed inside the housing 1060 and is configured to emit light through the barrel 1070 beginning from the proximal end 1080.The barrel 1070 may be constructed from a reflective material to trap the emitted light inside the barrel 1070 as it propagates towards the distal end 1075 of the barrel 1070.The emitted light is then dispersed from the barrel 1070 via a lens 1090 that is coupled to the distal end 1075 of the barrel 1070.In the illustrated embodiment, the lens 1090 includes a first section 1091, a second section 1092, and an intermediate section 1093 therebetween.","The second section 1092 is configured to be inserted into the barrel 1070 through the distal end 1075 such that the intermediate section 1093 abuts against the distal end 1075 and may be adhered thereto using an adhesive.","In this arrangement, the first section 1091 is most distal to the lighting device 1085.Additionally, the first section 1091 may be curved and optically configured to disperse the emitted light in a variety of directions including a forward, upward, downward, and/or sideways direction.","As best shown in FIGS.","26C and 26D, the lighting device 1085 has an L-shaped configuration and is electrically coupled to an electrical connector 1095 provided at the bottom of the housing 1060.The lighting device 1085 includes a first end 1097 that abuts against the proximal end 1080 of the barrel 1070 and supports a heat sink board 1100 on which the LEDs 1087 are mounted.","The lighting device 1085 also includes a plug 1102 disposed at a second end having pins 1107 that plug into a corresponding socket 1109 of the electrical connector 1095.To supply power to the lighting device 1085, the electrical connector 1095 may be configured to make an electrical connection with an onboard vehicle power source or other power source.","To assist the heat sink board 1100 with heat dissipation, the light assembly 1055 may include a heat management member 1115 positioned proximate to the lighting device 1085.The heat management member 1115 may be a straight heat sink (as shown), or other heat sink type, such as, but not limited to, a pinned heat sink or a flared heat sink, and may be mounted to the upper edge 1065 of the housing 1060 via threaded fasteners 1120.Optionally, a thin plate 1122 may be provided for distributing the load of the threaded fasteners 1120.As shown in FIG.","26C, the thin plate 1122 is contiguous with the upper edge 1065 of the housing 1060 and is disposed between the upper edge 1065 of the housing 1060 and the heat management member 1115.Referring to FIGS.","27A and 27B, the light assembly 1055 is exemplarily shown mounted to the tailgate handle assembly 1020 previously shown in FIGS.","25A-25D.","The light assembly 1055 is configured to be engaged to protrusions 1035, 1038, and 1040 and is secured to the tailgate handle assembly 1020 with mechanical fastener 1045 to mirror the mounting scheme of the keylock cylinder 1025 previously shown in FIG.","25D.","In this manner, the keylock cylinder 1025 and light assembly 1055 are easily interchanged.","However, it should be appreciated that other mounting schemes may be employed for mounting the light assembly 1055 to the tailgate handle assembly 1020 or other rear vehicle fixture.","With respect to the presently illustrated embodiment, mounting of the light assembly 1055 to the tailgate handle assembly 1020 results in the intermediate section 1093 of the lens 1090 abutting against an interior surface 1125 of the tailgate handle assembly 1020.In this arrangement, the barrel 1070 is concentrically aligned with the keylock hole 1015 such that the first section 1091 of the lens 1090 at least partially coincides with the keylock hole 1015 while the tailgate handle assembly 1020 shields the rest of the light assembly 1055.Once the light assembly 1055 is secured, an electrical connection may be made between the electrical connector 1095 of the light assembly 1055 and a plug 1127 stemming from an onboard vehicle power supply or other power source such that power may be supplied to the lighting device 1085.In operation, the lighting device 1085 may be activated using a variety of means.","For example, the lighting device 1085 may be manually activated via a user input mechanism, such as a button located on a human machine interface (e.g.","HMI 102), or elsewhere in the selected vehicle.","Additionally, or alternatively, the lighting device 1085 may be automatically activated via an onboard vehicle system such as the trailer backup assist system 105 and/or other vehicle system.","For instance, when performing a backup maneuver, the trailer backup assist system 105 may activate the lighting device 1085 under dark conditions.","In another instance, the lighting device 1085 may be automatically activated during set up of the trailer backup assist system 105, as described previously in step 604 of FIG.","10.Referring to FIG.","28, a supplemental vehicle lighting system 1130 is implemented in the vehicle 1005 previously shown in FIG.","25A.","For purposes of illustration, the vehicle 1005 features the trailer backup assist system 105 and employs vision based target detection.","As shown, the vehicle 1005 is attached to a trailer 1135, which may be variously configured and may offer one or more suitable target placement zones for receiving a target 1140.In the illustrated embodiment, the target 1140 is placed on a trailer tongue 1145 of the trailer 1135 and is imaged by a rear view camera 1150 mounted in an upper region of the tailgate 1010.By virtue of its positioning in the tailgate 1010, the rear view camera 1150 is shown imaging a scene 1155 that is to the rear of the vehicle 1005 and points slightly downwards therefrom so that the target 1140 is present in the scene 1155.To assist the camera 1150 in accurately imaging the target 1140 in dark conditions, the light assembly 1055 described previously herein is mounted inside the tailgate 1010 and is operable to illuminate a rear vehicle area 1160 that includes the target 1140 and at least partially overlaps with scene 1155.With respect to the illustrated embodiment, it can be seen that the rear vehicle area 1160 can include the area behind a rear bumper 1165 of the vehicle 1005.Since the keylock hole 1015 is defined in the tailgate handle assembly 1020, the light assembly 1055 may be mounted to the tailgate handle assembly 1020 in the manner described in reference to FIG.","27A or other suitable manner.","Although the supplemental vehicle lighting system 1130 has been described herein as being featured in a tow vehicle 1005 generally embodied as a pickup truck, it should be appreciated that the supplemental vehicle lighting system 1130 may be featured in other tow and non-tow vehicles alike, which may include, but are not limited to, buses, sports utility vehicles, vans, station wagons, sedans, and coupes.","Furthermore, while the supplemental vehicle lighting system 1130 is intended for use with the trailer backup assist system 105, it should be appreciated that the vehicle lighting system 1130 may additionally, or alternatively, be adapted for use with other vehicle related applications.","For example, the additional lighting provided by the light assembly 1055 will enable a vehicle equipped with a rear view camera system to render clearer images on a display screen when it's dark outside.","This may prove especially useful when performing a backup maneuver in low visibility situations.","At the most basic level, the supplemental vehicle lighting system 1130 may simply be used as a utility light.","For example, the light assembly 1055 may be activated to aid an operator with attaching/detaching a trailer to/from a tow vehicle in low light conditions.","Secondary Hitch Angle Sensor System For the trailer backup assist system 105, as previously described, it is advantageous to use information that is representative of an angle between the vehicle and a trailer attached to the vehicle, also known as the hitch angle γ or trailer angle.","In addition to the trailer backup assist system 105, it is contemplated that other vehicle systems may utilize hitch angle information as an input to the system, whereby the hitch angle information may be manipulated by a controller or microprocessor associated with the vehicle 100.In some embodiments, a measured hitch angle γ(m) may not provide an accurate measurement of the actual hitch angle γ(a) to a requesting system, which may introduce a potential for inadequate or improper vehicle system control, especially in situations where the hitch angle information may be important to the vehicle system being controlled, such as the trailer backup assist system 105.Furthermore, as previous mentioned, the hitch angle signal may drop-out or become unavailable for different reasons, such as the hitch angle detection apparatus 130 momentarily being unable to sense the relative position of trailer 110, or more specifically, the camera 20 being unable to track the hitch angle target 30 or other hitch sensors, such as a potentiometer, magnetic, optical, or mechanical based sensors, being unable to provide a constant hitch angle measurement, which may similarly cause errors or other disruption in operating the trailer backup assist system 105.Accordingly, an accurate and consistent estimate of the actual hitch angle γ(a) is desired, including for a means to confirm the accuracy of a measured hitch angle γ(m).","Referring to FIGS.","29-31, a sensor system 1200 for estimating a hitch angle of a trailer 110 attached to a vehicle 100 is shown according to one embodiment, which includes a primary sensor 1202 having a camera 20 monitoring a target 30 on the trailer 110 to determine a measured hitch angle γ(m) and a secondary sensor 1204 that monitors the trailer 110 to determine an indicator 1206 of the actual hitch angle γ(a).","In this embodiment, the trailer backup assist system 105 operates the vehicle 100 when the measured hitch angle γ(m) correlates with the indicator 1206 of the actual hitch angle γ(a).","This and other embodiments of the sensor system 1200 are described in more detail below.","In the embodiment illustrated in FIG.","29, the vehicle 100 is a pickup truck that employs vision based target detection as the primary sensor 1202 to determine the measured hitch angle γ(m).","Accordingly, the primary sensor 1202 on the vehicle 100 includes a hitch angle detection apparatus 130 that has a camera 20 as an input for providing video images to a target monitor controller 10 of the primary sensor 1202.The camera 20 (e.g.","video imaging camera) is located proximate an upper region of the vehicle tailgate at the rear of the vehicle 100, such that the camera 20 is elevated relative to the target placement zone(s) and has an imaging field of view located and oriented to capture one or more images of the trailer 110, including a region containing one or more desired target placement zone(s) 32.It should be appreciated that the camera 20 may include one or more video imaging cameras and may be located at other locations on the vehicle 100 to acquire images of the trailer 110 and the desired target placement zone(s) 32.As also shown in FIG.","29, the tow vehicle 100 is pivotally attached to one embodiment of a trailer 110.The trailer 110 has a trailer hitch connector in the form of a coupler assembly 114 connected to a vehicle hitch connector in the form of a receiver hitch and ball 15.The coupler assembly 114 latches onto the hitch ball 15 to provide a pivoting ball joint connection 117.The trailer 110 is shown having a frame 1208 that includes a longitudinally extending bar or trailer tongue 112 that is coupled with opposing front frame members 1210 that angle laterally away from the trailer tongue 112 and extend rearward to couple with side frame members 1212 that extend longitudinally in parallel alignment and are supported by a rotatable wheel axle 1214 of the trailer 110.The forward facing surfaces of the trailer frame 1208, including the trailer tongue 112 and the front and side frame members, 1210, 1212 provide surfaces for the secondary sensor 1204 to monitor the position of the trailer 110.Again, it should be appreciated that the trailer 110 may be configured in various shapes and sizes, may include more than one axle, and may have additional or alternative surfaces for the secondary sensor 1204 (FIG.","30) to monitor.","With further reference to FIG.","29, the vehicle 100 has additional onboard proximity sensors, including but not limited to, a reverse aid system 1220, a blind spot system 1216, and a cross traffic alert system 1218.In one embodiment, the reverse aid system 1220 includes a pair of energy transducers coupled with the rear of the vehicle 100 below the vehicle tailgate on opposing sides of the pivoting ball joint connection 117 between the vehicle 100 and the trailer 110.The energy transducers of the reverse aid system 1220, in the illustrated embodiment, comprise ultrasonic sensors that are directed rearward in the general vicinity of the trailer 110 for monitoring the position of the trailer 110 by measuring a difference in return signals from the ultrasonic sensors on opposing sides of the pivoting ball joint connection 117.The difference in the return signals is used to determine the indicator 1206 (FIG.","30) of the actual hitch angle γ(a).","The indicator 1206 may be a second measured hitch angle γ(m2), which can be used to define an acceptable tolerance range of hitch angles.","The indicator 1206 may also be another conceivable type of indicator, as described in further detail herein.","The reverse aid system 1220 may include additional sensors, including other types of sensors, such as radar sensors, located at several locations at the rear of the vehicle 100, such as laterally spaced along the bumper.","The blind spot system 1216, according to one embodiment shown in FIG.","29, includes an energy transducer 1222 coupled with each of the side rear view mirrors that generate a sensor field adjacent to the sides of the vehicle 100 and rearward therefrom in the general vicinity of the trailer 110.The energy transducers 1222 of the blind spot system 1216 may be ultrasonic sensors that monitor the general position of the trailer 110 to determine an indicator 1206 of the actual hitch angle γ(a).","Accordingly, it is conceivable that the blind spot system 1216 may be used to determine when the trailer 110 is roughly centered behind the vehicle 100 or in line with the vehicle 100 when the return signals from both energy transducers 1222 are both low and/or relatively equal.","Also, the blind spot system 1216 may provide an indicator 1206 (FIG.","30) of the actual hitch angle γ(a) based on the magnitude of return signal from the respective energy transducer 1222 receiving the greater return signal.","For instance, a set of ranges of ascending magnitudes may be set to correspond with a general hitch angle (e.g.","10-20 Hz for 5 degrees, 20-30 Hz for 10 degrees, etc.)","or ranges of hitch angles (e.g.","0-40 degrees, 40-70 degrees, 70-100 degrees), such that the return signal may be an indicator 1206 (FIG.","30) of the actual hitch angle γ(a) for use with the sensor system 1200 or for use as a primary sensor 1202 in an alternative embodiment.","The cross traffic alert system 1218, as shown in FIG.","29, also incorporates energy transducers 1224 on the rear of the vehicle 100 to generate sensor fields for monitoring the general position of the trailer.","Specifically, the cross traffic alert system 1218 in the illustrated embodiment includes energy transducers 1224 comprising a pair of ultrasonic sensors directed rearward and laterally outward from the rear of the vehicle 100, such that the ultrasonic sensors may determine when the trailer 110 has reached a large hitch angle or is approaching a critical angle indicative of a jackknife condition or jackknife angle γ(j).","In addition, the secondary sensor 1204 may comprise an auxiliary hitch angle sensor 1226 (FIG.","30) attached to the trailer 110 and/or the vehicle 100, such as mechanical sensor mechanisms or other conceivable hitch angle sensors.","It is also contemplated that any of the onboard proximity sensors (FIG.","32), including, but not limited to, the reverse aid system 1220, blind spot system 1216, the cross traffic alert system 1218, and the auxiliary sensor 1226, may have an ultrasonic sensor, a radar sensor, or a combination of the two.","These secondary sensors 1204 for determining the position of the trailer 30 may also include other cameras located on the vehicle, cameras located on the trailer, or other sensing devices generally understood by one having ordinary skill in the art.","It is also conceivable that more than one onboard sensor system may be incorporated into the secondary sensor 1204, offering multiple individual sensors that contribute to the indicator 1206 of the actual hitch angle γ(a).","Referring to FIG.","30, the sensor system 1200 of the trailer backup assist system 105 (FIG.","1) has the primary sensor 1202 for determining a first measured hitch angle γ(m) and the secondary sensor 1204 for determining an indicator 1206 of the actual hitch angle γ(a), such as a second measured hitch angle γ(m2).","In one embodiment, the secondary sensor 1204 may be used in place of the primary sensor 1202 when the signal of the first measured hitch angle γ(m) becomes unavailable or unreliable, thereby using the second measured hitch angle γ(m2) in place of the first measured hitch angle γ(m).","Additionally or alternatively, the secondary sensor 1204 may be used in conjunction with the primary sensor 1202 to confirm that the first measured hitch angle γ(m) correlates with the indicator 1206 of the actual hitch angle γ(a).","In one embodiment, as described above, the primary sensor 1202 may include the hitch angle detection apparatus 130 and the target monitor controller 10 for monitoring the target 30 on trailer 110 to determine the first measured hitch angle γ(m).","The secondary sensor 1204 includes a trailer monitoring apparatus 1228 and a trailer monitoring controller 1230 for monitoring the trailer 110 to determine the indicator 1206 of the actual hitch angle γ(a).","The trailer monitoring controller 1230 may include a microprocessor 1232 and/or other analog and/or digital circuitry for processing one or more routines.","Also, the trailer monitoring controller 1230 may include memory 1234 for storing one or more routines including sensor signal processing routines 1236 and hitch angle confirmation routines 1238.It should be appreciated that the trailer monitoring controller 1230 may be a standalone dedicated controller or may be a shared controller integrated with other control functions, such as integrated with the trailer monitoring apparatus 1228 and/or the primary sensor 1202, to process the return signals of the onboard proximity sensors or other secondary sensors and perform related functionality.","The trailer monitoring controller 1230 illustrated in FIG.","30 receives and processes return signals from at least one of the camera 20, the blind spot system 1216, the reverse aid system 1220, the cross traffic alert system 1218, and the auxiliary hitch angle sensor 1226, which may include additional processing from the trailer monitoring apparatus 1228.The secondary sensor 1204 processes the return signals to determine the indicator 1206 of the actual hitch angle γ(a), such as using the reverse aid system 1220 to determine a second measured hitch angle γ(m2) as the indicator 1206 and/or using the blind spot system 1216 to determine a range of hitch angles as the indicator 1206.The hitch angle confirmation routine 1238 further processes the indicator 1206 in connection with the first measured hitch angle γ(m) to determine if the first measured hitch angle γ(m) correlates with the indicator 1206.For instance, the indicator 1206 may include the second measured hitch angle γ(m2) that defines a tolerance range of acceptable hitch angles (e.g.","+/−3 degrees of the second measured hitch angle, or a wider or narrower tolerance range), such that the first measured hitch angle γ(m) correlates with the indicator 1206 when the first measured hitch angle γ(m) is within the tolerance range.","It is contemplated that in one exemplary embodiment, the hitch angle confirmation routine 1238 may also process the first measured hitch angle γ(m) to define an average measurement thereof over an interval of time (e.g.","2 seconds, or a longer or shorter interval) to reduce instability and variance of the first measured hitch angle γ(m).","As also illustrated in FIG.","30, the sensor system 1200 may communicate with one or more devices including, the vehicle HMI 25, the vehicle exterior alerts 24, and the vehicle interior alerts 1240, which may include a blind spot indicator light 1242 that provides a visual alert.","It is contemplated that the blind spot indicator light 1242 may be on an interior or exterior of the vehicle 100, such as on or proximate a side rear view mirror, to alert the driver that the primary sensor 1202 does not correlate with the indicator 1206 of the actual hitch angle γ(a), the trailer 110 is approaching or is in a jackknife condition, or other conceivable warnings that may not be able to be displayed on the center stack screen when reversing the vehicle 100.Additional warnings that may be provided with the blind spot indicator light 1242 include overspeed warning that alerts the driver that they are approaching a speed greater than the speed configured for operating the trailer backup assist system 105, a steering override warning that alerts the driver that steering has exceeded the acceptable steering torque configured for operating the trailer backup assist system 105, or an internal fault warning that alerts the driver that the trailer backup assist system 105 has become inoperative and has to canceled out for other conceivable errors.","As previously described, the sensor system 1200 may communicate via wireless communication 22 to various types of mobile devices or via onboard communication to one or more vehicle human machine interfaces (HMIs) 25, including a vehicle display, such as a center stack mounted navigation/entertainment display.","The method for estimating the actual hitch angle γ(a) using the sensor system 1200 of the trailer backup assist system 105 is illustrated in FIG.","31 according to one embodiment.","Initially, at step 202 the system may receive an initiation request to activate the trailer backup assist system 105 for tracking the hitch angle.","Before proceeding to monitor the hitch angle, at step 1244 the system confirms that the attached trailer 110 has been calibrated and setup for operation with the trailer backup assist system 105, and if not, the calibration and setup process 600, 700 are initiated, as previously described.","Although the calibration and setup processes 600, 700 may involve gathering the kinematic information for the attached trailer 110, at step 1246, the sensor system receives this information for use with the primary and/or secondary sensors 1202, 1204, if necessary.","For instance, if a vision based target detection system is included as the primary sensor 1202, the kinematic information will provide parameters from the target setup information in addition to the input or otherwise determined dimensions of the trailer 110.The trailer kinematic information may also be used by the sensor system 1200 to modify the tolerance range of acceptable first measured hitch angles and to modify the magnitudes of sensor return signals or corresponding ranges of hitch angles.","Still referring to FIG.","31, once the trailer backup assist system 105 is generally setup and calibrated with the trailer 110 attached to the vehicle 100, at step 1248, an input is made with the input device, such as selecting the desired hitch angle between the vehicle 100 and trailer 110 by manipulating the steering input apparatus 125, as previously described.","At step 1250, the sensor system 1200 begins to monitor the trailer 110 with the primary sensor 1202 to determine the first measured hitch angle γ(m) at step 1252.In conjunction with the operation of the primary sensor, at step 1254, the secondary sensor similarly monitors the trailer 110 to determine the indicator 1206 of the actual hitch angle γ(a) at step 1256.At step 1258, the first measured hitch angle γ(m) is compared with the indicator 1206 to determine if the measured hitch angle γ(m) of the primary sensor 1202 correlates therewith, and if so, thereby reflecting a generally accurate measurement of the actual hitch angle γ(a).","If the measured hitch angle γ(m) is determined to not correlate with the indicator 1206, the user may be prompted at step 1260, such as being alerted with any of the interior or exterior alerts 1240, 24, being alerted and/or requested with the vehicle HMI to direct whether the trailer backup assist system 105 should proceed to operate the vehicle 100, and similarly being alerted and/or prompted with a mobile device via wireless communication 22, as described above.","If the measured hitch angle γ(m) of the primary sensor 1202 correlates with the indicator 1206 of the actual hitch angle γ(a), then, at step 1262, the trailer backup assist system 105 may operate to achieve the desired input made with the input device, such as steering the vehicle 100 with the power-steering assist system 115 to achieve the desired hitch angle input with the steering input apparatus 125.While the illustrated embodiment of the sensor system 1200 includes a primary sensor 1202 and a secondary sensor 1204, it should be appreciated that the sensor system 1200 may include addition sensors (tertiary sensor, quaternary sensor, etc.)","with additional corresponding indicators for confirming the accuracy of the indicator 1206 from the secondary sensor 1204 and the measured angle γ(m) from the primary sensor 1202.It is also be understood that the sensor system 1200 may additionally, or alternatively, be adapted for use with other vehicle related applications, such as trailer sway limiters or other conceivable applications relying upon the accuracy of the measured hitch angle γ(m).","Hitch Angle Estimation and Verification According to an additional embodiment for estimating the actual hitch angle, a system uses an estimated distance between a wireless receiver on the vehicle and a wireless transmitter on the trailer.","The wireless receiver on the vehicle is located at a predetermined distance from a trailer mount and the wireless transmitter on the trailer is located at an end of the trailer opposite the trailer mount.","With respect to this embodiment, the system includes a controller for monitoring power returns of a signal transmitted from the transmitter to the receiver and for estimating the distance between the transmitter and the receiver as a function of a path loss propagation of the transmitted signal.","The actual hitch angle is then estimated using the estimated distance, the predetermined distance, and a trailer length.","Referring now to FIGS.","32-34, one embodiment the system for estimating the actual hitch angle is shown to include a wireless receiver 1270 on a vehicle 100 with a trailer backup assist system 105.The wireless receiver 1270 is mounted at a known vehicle location, such as a central vehicle body position.","In the illustrated embodiment, the vehicle 100 also has a controller 1272 for receiving information from the wireless receiver 1270, which may be a single centralized vehicle controller or a combination of controllers.","The controller 1272 may be programmed to perform various functions and control various outputs and may have a memory 1274 associated therewith.","The memory 1274 may store various parameters, thresholds, patterns, tables, or maps; for example, parameters may include known, fixed vehicle measurements such as wheel base, vehicle length, trailer length and distances from known parts of the vehicle.","The controller 1272 receives information from a number of sensors on or around the vehicle 100 associated with one or more sensing systems 1276, which may include, but are not limited to, speed sensors, yaw rate sensor, lateral acceleration sensor, roll rate sensor, vertical acceleration sensor, a longitudinal acceleration sensor, a pitch rate sensor, and a steering angle position sensor.","These sensors may also be part of an inertial measurement unit that would most likely be located at the center of the vehicle body.","As shown in FIGS.","32-33, a trailer 110 may be towed behind the vehicle 100.The trailer 110 may include a tongue 112 and trailer wheels, as well as a trailer brake and electrical components such as lights.","A wiring harness 1278 may be used to couple the trailer 110 to the electrical system of the vehicle 100 and ultimately to the controller 1272.The trailer 110 is coupled to the vehicle 100, as by a hitch ball 15 or other mount on the vehicle 100, through a coupler assembly 114 located at the end of the trailer tongue 112.A distance dr defines a reference distance which is the distance between the wireless receiver 1270 on the vehicle 100 and the hitch ball 15 or other mount on the vehicle 100.This is a fixed distance and may be stored in memory 1274.The coupler assembly 114 may have a hitch angle sensor 1226 associated therewith.","Alternatively, the hitch angle sensor 1226 may be associated with the mount on the vehicle 100.The hitch angle sensor 1226 is used to determine the angle position of the trailer 110 relative to the vehicle 100.Various types of hitch angle sensors, such as resistive, inductive, ultrasonic, or capacitive type sensors may be used, in addition to other hitch angle sensor system disclosed herein.","A wireless transmitter 1280 is positioned on the trailer 110 at a known location, preferably at the end of the trailer.","This wireless transmitter 1280 is in communication with the wireless receiver 1270 that is located on the vehicle 100.The wireless receiver 1270 has been placed at a known location of the vehicle 100 such that a reference distance, dr, from the receiver 1270 to the hitch ball 15 at the rear of the vehicle 100 is known and stored in memory 1274.Examples of wireless transmitting and receiving devices that may be used are Radio Frequency Identification (RFID), Bluetooth, and the like.","As discussed above, the wireless receiver 1270 is positioned at a location on the vehicle 100 the predetermined distance, dr, from the vehicle's trailer mount or hitch ball 15.The wireless transmitter 1280 and the wireless receiver 1270 are compatible units that transmit and receive signals between the vehicle 100 and the trailer 110.The controller 1272 monitors the power returns of the transmitted signals.","By monitoring the power returns of signals sent by the transmitter to the receiver, the controller 1272 may estimate a distance, d, between the vehicle 100 and the trailer 110.The disclosed subject matter also uses a trailer length, lT.","This value may be a known value entered by the driver, stored in controller memory, or otherwise sensed, calculated or estimated.","For example, an accurate estimate of trailer length, lT, is possible using measurements of the signal transmitted from the wireless transmitter 1280 on the trailer 110 to the wireless receiver 1270 on the vehicle 100 when the hitch angle is zero.","It is also possible to estimate the trailer length when the measurements are taken while the vehicle yaw rate is zero for a predetermined period of time.","The hitch angle is thereby estimated using the trailer length, lT, and path loss propagation of a signal transmitted from the transmitter on the trailer 110 to the receiver 1270 on the vehicle 100.The hitch angle estimate may then be used as an input for control algorithms associated with a variety of vehicle systems 1281 such as trailer sway, trailer backup assist, stability control and other systems.","Alternatively, the hitch angle estimate may be used to verify, or validate, the measurement taken by a hitch angle sensor.","Referring to FIG.","33, a block diagram of a vehicle 100 and trailer 110 combination, where a hitch angle is non-zero, is shown with respect to the law of cosines: A2=B2+C2−2BC cos(a) The vehicle 100 has the trailer 110 attached thereto with the receiver 1270 located on the vehicle a predetermined reference distance, dr from the trailer hitch ball 15, which corresponds to B for the triangle reflecting the law of cosines in FIG.","33.The trailer length, lT, is shown and the transmitter 1280 is located at the end of the trailer 110.The trailer length, lT, corresponds to C in the law of cosines.","The distance, d, between the transmitter 1280 and the receiver 1270 is shown, which corresponds to A in the law of cosines.","The reference distance, dr, is a known distance that may be stored in memory 1274.The trailer length, lT, may also be a known distance that is stored in memory 1274 or it may be estimated or calculated as described later herein.","The distance, d, is calculated as described hereinafter with reference to FIG.","34.Referring to FIG.","34, a flow chart of the method 1282 for estimating a hitch angle in accordance with the disclosed subject matter is shown.","The method 1282 can be carried out using the vehicle and trailer architecture discussed above in reference to the vehicle 100 and trailer 110 for FIG.","32.Accordingly the hitch angle estimate may be supplied to any vehicle system 1281 requesting the information.","An operation 1284 is performed for requesting hitch angle estimation.","A request for hitch angle estimation may come from a vehicle control system 1281 that requires the information as an input to the control algorithm associated therewith or it may come from a control system 1281 that wants to validate or verify a hitch angle provided by a hitch angle sensor.","Examples of vehicle control systems 1281 that may request hitch angle information may be a trailer backup assist system 105, a trailer sway control system, a trailer brake control system, and a vehicle dynamic control system such as roll stability control or yaw stability control.","These are only a few examples of systems 1281 that may utilize hitch angle information as an input to a control algorithm.","An operation 1286 is performed to monitor power returns of signals transmitted from the trailer 110 to the vehicle 100.Path loss is proportional to the square of the distance between the transmitter and the receiver and power returns of signals transmitted may be used to estimate a distance between the transmitter and the receiver.","The power returns are measured, at the receiver, at predetermined time intervals and stored in controller memory over a predetermined period of time.","The power returns may be accessed by the controller for various operations and/or functions that use the values to estimate hitch angle.","An operation 1288 is performed to estimate the distance, d, between the transmitter and the receiver.","Estimating the distance, d, between the wireless transmitter and the wireless receiver 1270 is accomplished by using the, measured power returns or measured path loss of the signal being transmitted.","Path loss is proportional to the square of the distance between the transmitter and the receiver, and also to the square of the frequency of the transmitted signal.","Signal propagation may be represented by Friis transmission formula: P r ( d ) = P t G t G t λ 2 ( 4 π ) 2 d 2 L where, Pt is the transmission power in Watts, Gt and Gr are gains associated with the receiver and the transmitter respectively, λ is the wavelength, L are system losses, and d is the distance between the transmitter and the receiver.","Accordingly, transmission power decreases at a rate proportional to d2.Therefore, knowing the path loss, PL, associated with the transmitted signal will provide an estimate of the distance, d, between the transmitter and the receiver.","Path loss (PL) is represented by the following equations: PL dB = 10 log P t P r = - 10 log ( G t G t λ 2 4 π 2 d 2 L ) PL dB = - 10 log ( G t G t λ 2 ( 4 π ) 2 L ) + 10 log ( d 2 ) PL dB = - 10 log ( G t G t λ 2 ( 4 π ) 2 L ) + 20 log ( d ) Pr decreases at a rate that is proportional to d2.The power of the signal received at the receiver may be represented as: P r ( d ) = P r ( d 0 ) ( d 0 d ) 2 for d > d 0 > d r The distance, d, may be derived from this formula and represents the overall distance between the transmitter on the trailer and the receiver on the vehicle.","The distance, d0, is a known received power reference point and the distance, df, is a far-field distance.","The reference distance, dr, is known.","If the trailer length, lT is known, then an operation 1289, using the distance, d, the trailer length, lT, the known reference distance, dr, between the receiver and the trailer hitch, and the law of cosines, is performed to calculate the hitch angle.","From the law of cosines, provided above, the hitch angle is given by: a = cos - 1 [ A 2 - B 2 - C 2 - 2 BC ] An operation 1290 is performed in which the vehicle system that is requesting the information receives the hitch angle estimation.","The disclosed subject matter provides an estimate of hitch angle even when a hitch angle sensor is unavailable.","If a system relies on a hitch angle sensor, the disclosed subject matter may provide verification, as a redundant sensor, that the hitch angle sensor is operating properly.","As discussed above, the trailer length, lT, may be a known value stored in memory or it may be a value that is calculated according to the disclosed subject matter.","The trailer length may be calculated 1292 by comparing distances, d, between the transmitter and the receiver that have been estimated and stored in memory over a period of time.","A predetermined number of distance estimates may be stored in controller memory.","A comparison of the stored distances may result in a largest distance may be identified.","The largest distance estimate may be associated with a zero hitch angle.","This identified largest distance, less the known reference distance, dr will be representative of, and may be stored as, the trailer length, lT. As an alternative, the trailer length, lT, may be estimated using a yaw rate provided by a yaw rate sensor on the vehicle to determine when the trailer is a zero hitch angle.","A yaw rate sensor is typically available as part of the sensor system 1200 on the vehicle.","A zero yaw rate is an indicator that a vehicle is travelling along a straight path, i.e., the vehicle is not turning.","The fact that the yaw rate is zero alone is not adequate to identify a zero hitch angle because the vehicle may have just stopped turning even though a non-zero hitch angle exists.","However, monitoring yaw rate over time will provide confirmation that the vehicle has driven straight forward for a sufficient predetermined period of time while maintaining a zero or near zero yaw rate.","A zero yaw rate, sensed over time, provides an indication that the trailer has straightened out and it can be inferred that the hitch angle is zero at that point.","Upon verification of zero hitch angle, the operation to calculate trailer length 1292 is performed.","The estimated distance between the transmitter and the receiver when the hitch angle is zero less the predetermined distance, dr, defines the trailer length, lT.","The predetermined period of time that the yaw rate should remain at zero before the assumption that the hitch angle is zero will be associated with an actual distance the vehicle trailer combination needs to travel to ensure that the hitch angle is zero.","This may be determined through testing and stored in the controller memory.","The disclosed subject matter is advantageous in that it provides an estimate of hitch angle whether or not a hitch angle sensor is present on a vehicle.","The disclosed subject matter is even advantageous for a vehicle that has a hitch angle sensor in that it provides a method for verifying, or validating, the accuracy of a hitch angle sensed by a hitch angle sensor.","This is especially important for vehicle systems that rely critically on the value of the hitch angle being sensed, for example, trailer backup assist systems, trailer sway control systems and trailer brake control systems.","Hitch Angle Calibration As previously mentioned with reference to FIG.","10 and a driver's interaction with the human machine interface (HMI) device 102, after the trailer setup module 600 is complete at step 620, the calibration module 700, according to one embodiment, calibrates the curvature control algorithm with the proper trailer measurements and calibrates the trailer backup assist system for any hitch angle offset that may be present.","In the one embodiment, the calibration module 700 may instruct the driver to pull the vehicle-trailer combination straightforward until a hitch angle sensor calibration is complete, which may be notified to the driver via the HMI device 102.Depending on any error resulting from the trailer measurements or the potential inability of the vehicle to be pulled straight forward, additional and alternative embodiments of calibrating the trailer backup assist system are described herein.","With reference to FIG.","35, the vehicle trailer backup assist system 105 is illustrated having the trailer backup assist control module 120 in communication with the sensor system 1200 and the trailer backup steering input apparatus 125 as part of the trailer backup assist system 105.The trailer backup assist system 105 in the illustrated embodiment, receives sensor information from the one or more hitch angle sensors 1312, a vehicle yaw rate sensor 1314, and a vehicle speed sensor 1316, and may communicate with other conceivable sensors on the vehicle 100 or trailer 110.For instance, the illustrated embodiment of the trailer backup assist system 105 also communicates with the vehicle transmission controller 1318, such as receiving the presently engaged transmission gear.","Furthermore, the trailer backup assist control module 120 is also in direct communication with the power steering assist system 115, which has the power steering assist control module 135 for communicating with the steering angle detection apparatus 140 and a servo steering motor 1300, or servomotor, for operating the steered wheels 1302 of the towing vehicle 100 (FIG.","36).","The illustrated embodiment of the trailer backup assist control module 120 includes a microprocessor 1304 for processing one or more routines stored in the corresponding memory 1306 of the trailer backup assist control module 120.The memory in one embodiment includes a hitch angle calibration routine 1308 and an initiating routine 1310.It should be appreciated that the trailer backup assist control module 120 may be a standalone dedicated controller or may be a shared controller integrated with other control functions, such as integrated with the sensor system 1200, the trailer backup steering input apparatus 125, or other systems of the towing vehicle.","As shown in FIG.","36, a schematic illustration of the vehicle 100 and trailer 110 combination are overlaid with an x-y coordinate system showing kinematic variables and angles, including the steering angle δ, trailer length D, and hitch angle γ, which may be affected by the dynamics of the vehicle 100 and trailer 110 combination and representable in kinematic equations, as similarly discussed with reference to FIG.","5.Referring to FIGS.","37-38, a method is shown for estimating the actual hitch angle γ(a) between the vehicle 100 and the trailer 110, according to one embodiment.","The method provides for sensing a measured hitch angle γ(m) with at least one hitch angle sensor 1312 (FIG.","35) on the vehicle 100 and sensing a steering angle δ of the steered wheels 1302 (FIG.","36) of the vehicle 100.Further, the method provides for reversing the vehicle 100, and thereby determining an offset γ(o) between the measured hitch angle γ(m) and the actual hitch angle γ(a) when the measured hitch angle γ(m) and the steering angle δ are substantially constant while the vehicle 100 is reversing.","As defined herein, the offset γ(o) is the difference between the measured hitch angle γ(m) and the actual hitch angle γ(a).","As reflected in the diagram shown in FIG.","36, when the hitch angle γ and steering angle δ are substantially constant, the yaw rate of the vehicle 100 is also substantially constant and equal to the yaw rate of the trailer 110.This interaction is used to formulate kinematic equations that can be solved for determining the offset γ(o) between the measured hitch angle γ(m) and the actual hitch angle γ(a).","Specifically, the yaw rate of the vehicle 100, as measured by the vehicle yaw rate sensor 1314 (FIG.","35) or another conceivable onboard vehicle sensor that may be configured to sense the yaw rate, provides the following equation: d α dt = - v w tan δ Furthermore, the yaw rate of the trailer can be represented with the following equation: d β dt = v D sin γ + Lv DW cos γ tan δ where, δ is the steering angle of the front wheels D is the distance from the hitch to the trailer axle W is the vehicle wheelbase (distance between both axles) L is the distance from the vehicle rear axle and hitch γ is the hitch angle Accordingly, when the yaw rate of the vehicle 100 and the trailer 110 become equal, the actual hitch angle γ(a) will likely be constant, such that the desired hitch angle provided by the trail backup steering input apparatus 125, such as the previously described rotatable input control device shown in FIG.","2, is also constant and substantially achieved.","For example, the desired hitch angle received from the trailer backup steering input apparatus 125 may be constant when the driver attempts to reverse the trailer 110 in a straight line with the vehicle 100 (i.e.","a zero curvature command) or when the driver inputs a maximum knob angle command.","The resulting constant hitch angle results in the following equation: c=a cos γ+b sin γ This equation can be rewritten as follows: c=a√{square root over (1−sin2γ)}+b sin γ The above equation can be solved with the quadratic equation that solves for the hitch angle γ.","Thereafter, when breaking up the hitch angle γ into a measured hitch angle γ(m) and an offset angle γ(o), the equation can be rewritten as follows: γ o = arcsin bc ± a b 2 + a 2 - c 2 b 2 + a 2 - γ m γ m where , c = - 1 W tan δ b = 1 D a = L DW tan δ Accordingly, the hitch angle offset γ(o) may be determined as a function of the length D of the trailer 110, the wheelbase length W of the vehicle 100, and the distance L from a rear axle of the vehicle 100 to the trailer 110 as shown in FIG.","36, while meeting the conditions provided above to use such an equation.","Specifically, the conditions generally include that the vehicle 100 and trailer 110 are reversing and that the measured hitch angle γ(m) and the steering angle δ are substantially constant during the reversing motion for at least a threshold period of time or over a threshold distance of motion.","As illustrated in FIG.","37, the calibration module 700 processes one embodiment of the hitch angle calibration routine 1308 to provide the method according to the following steps.","At step 1320, the system receives generally fixed characteristics of the vehicle 100 and the trailer 110, including the trailer length D, the vehicle wheelbase length W, and the distance L from the vehicle's rear axle to the hitch connection.","These generally fixed characteristics are described as such because the vehicle 100 and trailer 110 dimensions can be preloaded or looked up in product specifications, and if these dimensions are not known or otherwise already determined by the system, they can be measured and input into the memory 1306 or other vehicle memory prior to operating the vehicle 100 with the trailer backup assist system 105.The hitch angle calibration routine 1308 shown in FIG.","37, also provides at step 1322, confirming that the vehicle 100 is reversing when the sensors of the sensor system 1200 are taking continuous measurements of the vehicle 100 and trailer 110 variables.","Specifically, the system may confirm that the vehicle 100 is reversing with use of directional speed sensors, the gear position of the transmission controller 1318, GPS inputs, or other conceivable indicators of vehicle 100 direction.","At step 1324, the system conducts the initiating routine 1310 to further confirm that the vehicle 100 and trailer 110 combination are in a condition to determine the offset γ(o) between the measured hitch angle γ(m) and the actual hitch angle γ(a).","As shown in FIG.","38, one embodiment of the initiating routine 1310 includes determining a compensated steering wheel angle 1326 which is an indication of the steerable road wheel angle, calculating a filtered steering wheel angle rate 1328, and then determining at step 1330 whether the filtered steering wheel angle rate is less than a maximum allowable steering angle rate for the offset calculation.","Also, the initiating routine 1310 takes the measured trailer angle γ(m) at step 1332 and calculates a filtered trailer angle rate over time at step 1334.The initiating routine then at step 1336 determines whether the filtered trailer angle rate is less than a maximum allowable trailer angle rate for determining the offset calculation.","Further, the initiating routine 1310 takes the sensed or otherwise calculated vehicle speed from step 1338 and further calculates a filtered vehicle speed at step 1340.The filtered vehicle speed is then processed at step 1342 to determine whether it is less than a maximum allowable vehicle speed for determining the offset calculation.","If the conditions of the initiating routine 1310 are met at step 1344, the trailer backup assist system 105 allows the hitch angle calibration routine 1308 to continue towards determining the offset γ(o).","The initiating routine 1310 further includes step 1420 of compensating for a knob angle, calculating a filtered knob angle rate in step 1424, and determining if the filtered knob angle rate is less than a maximum allowable knob angle rate for the offset calculation in step 1428.The maximum allowable knob angle rate may be a tunable value of between about 0 and about 10°, and in a specific example about 1°.","The maximum allowable trailer angle rate may be a tunable value of between about 0° per second and about 2° per second, and in a specific example, about 0.5° per second.","The maximum allowable steering angle rate may be a tunable value of between about 0° per second and about 10° per second, and in a specific example, about 0.5° per second.","The maximum allowable vehicle speed may be a tunable value of between about 0° km/h and about 100 km/h, and in a specific example, about 3 km/h.","With further reference to FIG.","37, when the initiating routine 1310 is complete, the hitch angle calibration routine at step 1346 determines whether the hitch angle rate and the steering angle rate are both substantially zero, or alternatively stated, whether the hitch angle and the steering angles are substantially constant.","If the hitch angle rate and the steering angle rate are both not substantially zero, the hitch angle calibration routine 1308 continues to conduct the initiating routine 1310 at step 1324 and continues to take measurements with the sensor system 1200 until the hitch angle rate and steering angle rate are substantially zero.","Once they are both substantially zero, the hitch angle calibration routine 1308 then determines the actual hitch angle at step 1348 based on the vehicle 100 and trailer 110 generally fixed characteristics, as identified in the equations above.","With the actual hitch angle γ(a), the hitch angle calibration routine 1308 may then determine the offset γ(o) between the actual hitch angle γ(a) and the measured hitch angle γ(m) at step 1350.Upon determination of the offset γ(o), the calibration module is complete and the trailer backup assist system 105 may proceed for operation.","In an additional embodiment of the hitch angle calibration routine 1308, as illustrated in FIG.","39, a method is provided for calibrating the trailer backup assist system 105 for the trailer 110 attached to the vehicle 100, which provides driving the vehicle 100 forward substantially straight above a threshold speed.","The method also provides sensing a yaw rate of the vehicle 100 and sensing a measured hitch angle γ(m) of the trailer 110.Further, the method provides for determining an angle rate based on the measured hitch angle γ(m), and then determining an offset γ(o) between the measured hitch angle γ(m) and the actual hitch angle γ(a) when the yaw rate and the angle rate are substantially zero.","In the previously described embodiment of the hitch angle calibration routine 1308 with reference to FIG.","37, the vehicle 100 is reversing and therefore such an embodiment is configured for situations when the vehicle 100 may not be able to drive forward far enough to calibrate the trailer backup assist system 105.However, when space is available to drive the vehicle 100 forward, an alternative method may be used to determine the offset γ(o) between the actual hitch angle γ(a) and the measured hitch angle γ(m) that does not rely upon the accuracy of the measured or otherwise determined trailer geometry and dimensions.","Specifically, when setting up the trailer 110 with the vehicle 100, in one embodiment, the user may be instructed to measure various dimensions of the trailer 110, including the trailer length D. The dimensions of the vehicle 100, however, may be measured with a high degree of accuracy upon assembly of the vehicle or otherwise supplied in an accurate manner to the trailer backup assist system 105, such as with a hookup table provided by the vehicle manufacture.","With reference to FIG.","39, at step 700 the trailer backup assist system 105 again begins to calibrate the system for the trailer 110 attached to the vehicle 100.At step 1352, the system receives the vehicle characteristic including the dimensions of the vehicle 100 and the operating characteristics, such as the present gear of the transmission.","Then at step 1354, the system confirms that the vehicle is driving forward while the sensors of the sensor system 1200 take measurements and other readings.","Notably, in this illustrated embodiment, the sensors utilized include a sensor for determining the vehicle yaw rate, such as an onboard yaw rate sensor 1314 or a separate sensor configured to determine the yaw rate of the vehicle.","Also, the sensors being utilized by this embodiment of the hitch angle calibration routine include at least one hitch angle sensor 1312, as previously described with reference to the sensor system 1200.Still referring to FIG.","39, at step 1356, the steered wheels 1302 of the vehicle 100 are steered straight while the vehicle 100 is traveling forward.","It is contemplated that in one embodiment the user may be instructed to steer the vehicle straight by manually controlling the steering wheel.","In an additional embodiment, the vehicle 100 may automatically steer the vehicle 100 straight using the powering steering assist system 115.More specifically, the trailer backup assist system 105 may operate the steered wheels 1302 of the vehicle 100 using the servo steering motor 1300 in conjunction with the steering angle detection apparatus 140.Once the sensor readings are being received and the vehicle is being steered straight and driving forward, the illustrated embodiment of the hitch angle calibration routine 1308 then proceeds to process an initiating routine 1310 at step 1358.The initiating routine 1310 of the present embodiment may, similar to the initiating routine illustrated in FIG.","38, calculate filtered values for the steering wheel angle rate, the hitch angle rate, and the vehicle speed.","Furthermore, these filtered values may be compared against threshold values to ensure the hitch angle calibration routine is performed when vehicle conditions are acceptable for such calculation.","Specifically, the filtered steering angle rate may be less than a maximum allowable steering angle rate, the trailer angle rate may be less than the maximum allowable trailer angle rate, and the filtered vehicle speed may be less than the maximum allowable vehicle speed, such as 10 mph, 15 mph, or other conceivable threshold speed.","When these or more or fewer conditions are met, the system may proceed to the following step of the hitch angle calibration routine.","As also illustrated in FIG.","39, at step 1360 the hitch angle calibration routine 1308 determines whether the hitch angle rate and the yaw rate are both substantially zero.","Specifically, the determination of reaching a value of substantially zero may be one or a combination of the value being within a close proximity to zero or the value being zero or substantially zero over a predetermined period of time.","It is contemplated that the increment of time may be proportional to the filtered vehicle speed, such that increasing speed of the vehicle results in decreasing the increment of time the measured hitch angle γ(m) and the steering angle must be substantially constant to determine the offset γ(o).","It is also contemplated that the offset may be determined when the measured hitch angle and the steering angle are substantially constant while the vehicle and the trailer are reversing over a threshold distance, such as a distance greater than half a circumference of a steered wheel of the vehicle or other conceivable distances.","When the system makes a determination that both values are substantially zero, the system, at step 1362 is then able to determine the actual hitch angle γ(a) based upon the vehicle characteristics.","In one embodiment, when the above conditions are met the actual hitch angle γ(a) will be zero.","However, some vehicle characteristics, such as an offset hitch location, may result in the actual hitch angle γ(a) deviating from zero with these conditions met.","At step 1364 the system then determines the offset γ(o) between the actual hitch angle γ(a) and the measured hitch angle γ(m) for purposes of operating the trailer backup assist system 105.Again, at step 704 the trailer backup assist system 105 may notify the driver that the calibration is complete and may store the hitch angle offset value in memory to be associated with the attached trailer 110.Referring now to FIG.","40, an additional embodiment of the hitch angle calibration routine 1308 is illustrated that may consider the vehicle's direction of movement or potential direction of movement before choosing a method for determining the offset γ(o) of the measured hitch angle γ(m).","The vehicle's direction of movement may be based upon the presently engaged gear of the transmission, such as drive or reverse for automatic transmissions.","The vehicle's potential direction of movement, however, may be based upon the available space in front of or behind the vehicle and trailer combination.","At step 1366, if the vehicle 100 is moving in either the forward or rearward directions, the system may determine if enough available space exists for the vehicle 100 to continue moving in such direction and complete the calibration of the trailer backup assist system 105.If enough available space is not present, the hitch angle calibration routine 1308 of the illustrated embodiment may instruct the driver to move the vehicle 100 in the opposite or an alternative direction, provided enough available space exists in such direction to complete the calibration.","Also, if the vehicle 100 is not moving, the system may determine the preferred direction of movement for the vehicle 100 and trailer 110 to move to have enough space for the vehicle 100 to complete the calibration of the trailer backup assist system 105.At step 1368 the system may instruct the driver, such as through the HMI, to drive either forward or in reverse, as determined in the previous step 1366.Based on which direction the vehicle is instructed to move, this embodiment of the hitch angle calibration routine 1308 may employ one of two alternative methods to determine the actual hitch angle γ(a) for completing the calibration.","Specifically, if the vehicle 100 is traveling forward, at step 1370, the system then proceeds to ensure that the vehicle is steered straight 1372, while sensing the yaw rate of the vehicle 1374 and sensing the hitch angle rate 1376.The sensed hitch angle γ(m) is used by the system to determine the hitch angle rate at step 1378 and then continue on to step 1380 to determine when the hitch angle rate and the yaw rate of the vehicle are substantially zero, similar to the method previously described with reference to the embodiment disclosed in FIG.","39.When the hitch angle rate and the yaw rate of the vehicle are substantially zero, at step 1380 the hitch angle calibration routine 1308 may determine the actual hitch angle γ(a) to be substantially zero, which may then be used in conjunction with the measured hitch angle γ(m) to determine the offset γ(o) at step 1382.Alternatively, if the vehicle 100 is reversing or instructed to reverse, at step 1384, once the vehicle 100 is reversing, the system proceeds to sense the steering angle δ of the vehicle 100 at step 1386 and sense the hitch angle γ(m) at step 1388 to then determine the hitch angle rate and the steering angle rate at step 1390.The steering angle δ is the angle of the road wheels that steer the vehicle.","The steering wheel angle δ may be the angle of the steering wheel for a vehicle in which the steering wheel is mechanically coupled to the road wheels.","For a steer by wire arrangement, the steering angle δ may be measured by the angle of the steerable road wheels.","At step 1392 the system determines when both the hitch angle rate and the steering angle rate are substantially zero.","When both these values are substantially zero, the hitch angle calibration routine 1308 may determine the offset γ(o) of the measured hitch angle γ(m) based upon the length D of the trailer 110, the wheelbase length W of the vehicle 100, and the distance L from the rear axle of the vehicle 100 to the trailer 110, as generally set forth in the embodiment of the hitch angle calibration routine 1308 described with reference to FIGS.","37 and 38.In the embodiment disclosed in FIG.","40, once the hitch angle offset γ(o) is determined at step 1382, the calibration routine commences at step 704 and may notify the driver, such as via the HMI or another similar notification.","The hitch angle calibration routine 1308 illustrated in FIG.","40 illustrates one embodiment for calibrating the hitch angle both in the forward direction of travel based on the hitch angle rate and yaw rate being substantially zero and in the reverse vehicle direction based on the hitch angle rate and steering angle rate being substantially zero.","However, it should be appreciated that use of the hitch angle rate, the yaw rate, and the steering angle rate is one embodiment for determining a steady state condition during which the offset calibration may be performed.","The hitch angle calibration routine 1308 determines offset of the measured hitch angle when the vehicle and trailer are in a steady state condition.","The steady state condition may be when at least one steady state indicator on the trailer and at least one steady state indicator on the vehicle are constant in either the forward or reverse vehicle direction.","When this steady state condition is met, the expected trailer angle is calculated and the difference between the expected trailer angle and the measured trailer angle is determined as the offset.","The vehicle steady state indicator may include one or more of the following: the vehicle yaw rate is constant, the steering wheel or road wheel angle is constant, or the steering wheel or road wheel angle rate is substantially zero.","The trailer steady state indicator may include one or more of the following: the trailer yaw rate is constant, or the trailer hitch angle is constant, or the trailer hitch angle rate is substantially zero.","When the curvature command is zero while the vehicle is driven in reverse, the expected trailer angle is zero, and the offset is calculated from the difference from zero to the measured angle.","However, it should be appreciated that the offset may be calculated when the curvature command is not at zero during a non-straight travel path.","Referring now to FIG.","41, although the offset γ(o) generally may be determined while the vehicle 100 is moving forward or in reverse, there may be differences in accuracy of the offset γ(o) when depending on the direction of travel of the vehicle 100.Accordingly, the offset γ(o) may be determined separately as a reverse offset γ(or) or a forward offset γ(of).","In various embodiments, the reverse offset γ(or) determined while the vehicle 100 is reversing may be more accurate than the forward offset γ(of) determined while the vehicle 100 is moving forward.","While the vehicle 100 is towing the trailer 110 in the forward direction, the natural stability of the system may lead to the calculation of the forward offset γ(of) to be less accurate than the reverse offset γ(or) which is calculated during the more sensitive motion of backing the vehicle 100 and the trailer 110.Accordingly, prioritization of the reverse offset γ(or) over the forward offset γ(of) may be desirable.","In such an instance, a prioritization method 1400 may be used to prioritize the reverse offset γ(or) over the forward offset γ(of).","The prioritization method 1400 may be run at the same time as the hitch angle calibration routine 1308 and includes several of the same steps of the hitch angle calibration routine 1308 and may be run on the same controller or a different controller than the hitch angle calibration routine 1308.The prioritization method 1400 may include steps 1366, 1384, 1382A, 1382B, 1370, 1404, 1408, and 1412.Step 1366 detects that the vehicle 100 is moving.","Determination of the movement of the vehicle 100 may be accomplished via signals from wheel count encoders, a controller area network, a parking assist controller, a vehicle electronic control unit, a gear sensor or various other controllers and modules around the vehicle 100.Next, step 1384 determines whether the vehicle 100 is reversing.","If the vehicle 100 is reversing, the method 1400 proceeds to step 1382B and if the vehicle 100 is not moving in the reverse direction, the method 1400 proceeds to step 1370 of determining if the vehicle 100 is moving in a generally forward direction.","The vehicle 100 may be determined to be moving in the forward direction using any of the signals or controllers explained above.","In the event the vehicle 100 is determined to be moving in a forward direction in step 1370, the method 1400 proceeds to step 1382A of determining the forward offset γ(of).","The forward offset γ(of) is calculated in substantially the same manner as the offset γ(o) is calculated while the vehicle 100 is traveling in the forward direction, as explained above.","Once the forward offset γ(of) is calculated, the method 1400 proceeds to step 1404 of determining if a forward offset flag has been set.","If the forward offset flag has been set (e.g., logically expressed as true), the forward offset γ(of) the method 1400 is advanced to step 1412.If the forward offset flag is not set to true, the method 1400 returns to step 1366 of detecting which direction the vehicle 100 is moving in.","Step 1412 of the method 1400 stores the forward offset γ(of) for use during the hitch angle calibration or for later use with forward and reverse movement of the vehicle 100 and trailer 110.The forward offset flag is set to true if the reverse offset γ(or) is not yet stored or if the forward offset γ(of) is stored.","It will be understood that in various embodiments, the forward offset flag may not be set to true if the forward offset γ(of) is already stored.","Returning to step 1384, if the vehicle 100 is determined to be traveling in the reverse direction, the method 1400 advances to step 1382B of determining the reverse offset γ(or).","Similarly to the forward offset γ(of), the reverse offset γ(or) is calculated as the offset γ(o) when the vehicle 100 is traveling in the reverse direction, as described above.","Once the reverse offset γ(or) is determined, the method advances to step 1408 of determining if a reverse offset flag is set to true.","If yes, the method 1400 advances to step 1412 of storing the reverse offset γ(or).","Step 1412 may store the forward or reverse offsets γ(of), γ(or) in random-access memory, or may transfer the offsets γ(of), γ(or) to non-volatile random-access memory upon the shutting down of the vehicle 100.In various embodiments, if a forward offset γ(of) is calculated and stored prior to the reverse offset γ(or), the reverse offset γ(or) may substitute, exchange or otherwise replace the forward offset γ(of).","After the storing of the reverse offset γ(or) the method 1400 may not calculate the forward offset γ(of).","In some embodiments, if the reverse offset γ(or) is calculated again and is a different value than the stored value (e.g., due to a different trailer 110 being attached to the vehicle 100 or a new asymmetry of the trailer 110 and/or vehicle 100 being present) the stored reverse offset γ(or) may be substituted, exchanged, or otherwise replaced for the new value of the reverse offset γ(or).","In various embodiments, multiple forward and reverse offsets γ(of), γ(or) may be stored, which correspond to different trailers 110 or different typical asymmetries.","It will be understood that calculations of the forward and reverse offsets γ(of), γ(or) calculated after the storing of the forward and/or reverse offsets γ(of), γ(or) may not necessarily be discarded, but may be used to enhance the accuracy of the stored value by averaging the calculations together, regardless if it is a forward or reverse offset γ(of), γ(or), or by providing more than one data point for the method 1400 or routine 1308 to work from.","Use of the prioritization method 1400 may offer several advantages.","For example, by prioritizing the reverse offset γ(or) over the forward offset γ(of), a more accurate offset may be used when backing the vehicle 100 and trailer 110.Additionally, by storing the more accurate of the offsets, future calibration maneuvers may not need to be performed until a new asymmetry is detected with the vehicle 100 and/or trailer.","It is to be understood that variations and modifications can be made on the aforementioned structure without departing from the concepts of the present invention, and further it is to be understood that such concepts are intended to be covered by the following claims unless these claims by their language expressly state otherwise."]],"string":"[\n [\n \"TRAILER BACKUP OFFSET DETERMINATION\",\n \"A system for calibrating a backup assist system for a trailer attached to a vehicle is provided which includes a hitch sensor continuously measuring a hitch angle between the vehicle and the trailer.\",\n \"A controller is configured to determine an offset of the measured hitch angle.\",\n \"The controller is configured to calculate and store in memory a forward offset if no reverse offset is stored.\"\n ],\n [\n \"1.A system for calibrating a backup assist system for a trailer attached to a vehicle, comprising: a hitch sensor continuously measuring a hitch angle between the vehicle and the trailer; and a controller configured to determine an offset of the measured hitch angle, wherein the controller is configured to calculate and store in memory a forward offset if no reverse offset is stored.\",\n \"2.The system of claim 1, wherein the offset is determined between the measured hitch angle and an actual hitch angle when the actual hitch angle is substantially zero.\",\n \"3.The system of claim 1, wherein the controller is further configured to not calculate a forward offset if the reverse offset is stored.\",\n \"4.The system of claim 1, wherein the forward and reverse offsets are determined during a steady state condition of the vehicle and the trailer.\",\n \"5.The system of claim 1, further comprising: a knob sensor continuously sensing a knob angle, wherein the knob angle is substantially zero when the vehicle and trailer are in a substantially standing state, and wherein the reverse offset is determined when the knob angle is substantially zero over a threshold time while the vehicle is driving above a threshold speed.\",\n \"6.The system of claim 3 further comprising: a yaw sensor continuously sensing a yaw rate of the vehicle, wherein the yaw rate of the vehicle is substantially zero when the vehicle is steered straight, and wherein the forward and reverse offsets are determined when the angle rate is substantially zero over a threshold time while the vehicle is driving above a threshold speed.\",\n \"7.The system of claim 3, wherein the controller determines an approximate distance the vehicle must travel straight to place the actual hitch angle at zero based on a length of the trailer and the measured hitch angle.\",\n \"8.A system for calibrating a backup assist system for a trailer attached to a vehicle, comprising: a hitch sensor continuously measuring a hitch angle between the vehicle and the trailer; and a controller configured to determine an offset of the measured hitch angle, wherein the controller is configured to prioritize the offset determined while the vehicle and the trailer are moving reverse over the offset determined while the vehicle and the trailer are moving forward.\",\n \"9.The system of claim 8, wherein the offset is determined between the measured hitch angle and an actual hitch angle when the actual hitch angle is substantially zero.\",\n \"10.The system of claim 8, wherein the controller is further configured to not calculate a forward offset if the reverse offset is stored.\",\n \"11.The system of claim 8, wherein the forward and reverse offsets are determined during a steady state condition of the vehicle and the trailer.\",\n \"12.The system of claim 8, further comprising: a knob sensor continuously sensing a knob angle, wherein the knob angle is substantially zero when the vehicle and trailer are in a substantially standing state, and wherein the reverse offset is determined when the knob angle is substantially zero over a threshold time while the vehicle is driving above a threshold speed.\",\n \"13.The system of claim 10 further comprising: a yaw sensor continuously sensing a yaw rate of the vehicle, wherein the yaw rate of the vehicle is substantially zero when the vehicle is steered straight, and wherein the forward and reverse offsets are determined when the angle rate is substantially zero over a threshold time while the vehicle is driving above a threshold speed.\",\n \"14.The system of claim 10, wherein the controller determines an approximate distance the vehicle must travel straight to place the actual hitch angle at zero based on a length of the trailer and the measured hitch angle.\",\n \"15.A system for calibrating a backup assist system for a trailer attached to a vehicle, comprising: a hitch sensor continuously measuring a hitch angle between the vehicle and the trailer; and a controller configured to determine an offset of the measured hitch angle, wherein the controller is configured to replace a forward offset when a reverse offset is determined.\",\n \"16.The system of claim 15, wherein the controller is further configured to not calculate a forward offset if the reverse offset is stored.\",\n \"17.The system of claim 15, wherein the forward and reverse offsets are determined during a steady state condition of the vehicle and the trailer.\",\n \"18.The system of claim 15, further comprising: a knob sensor continuously sensing a knob angle, wherein the knob angle is substantially zero when the vehicle and trailer are in a substantially standing state, and wherein the reverse offset is determined when the knob angle is substantially zero over a threshold time while the vehicle is driving above a threshold speed.\",\n \"19.The system of claim 16 further comprising: a yaw sensor continuously sensing a yaw rate of the vehicle, wherein the yaw rate of the vehicle is substantially zero when the vehicle is steered straight, and wherein the forward and reverse offsets are determined when the angle rate is substantially zero over a threshold time while the vehicle is driving above a threshold speed.\",\n \"20.The system of claim 16, wherein the controller determines an approximate distance the vehicle must travel straight to place the actual hitch angle at zero based on a length of the trailer and the measured hitch angle.\"\n ],\n [\n \" BACKGROUND OF THE INVENTION Reversing a vehicle while towing a trailer is very challenging for many drivers.\",\n \"This is particularly true for drivers that are unskilled at backing vehicles with attached trailers, which may include those that drive with a trailer on an infrequent basis (e.g., have rented a trailer, use a personal trailer on an infrequent basis, etc.).\",\n \"One reason for such difficulty is that backing a vehicle with an attached trailer requires steering inputs that are opposite to normal steering when backing the vehicle without a trailer attached and/or requires braking to stabilize the vehicle-trailer combination before a jackknife condition occurs.\",\n \"Another reason for such difficulty is that small errors in steering while backing a vehicle with an attached trailer are amplified thereby causing the trailer to depart from a desired path.\",\n \"To assist the driver in steering a vehicle with a trailer attached, a trailer backup assist system needs to know the driver's intention.\",\n \"One common assumption with known trailer backup assist systems is that a driver of a vehicle with an attached trailer wants to backup straight and the system either implicitly or explicitly assumes a zero curvature path for the vehicle-trailer combination.\",\n \"Unfortunately most of the real-world use cases of backing a trailer involve a curved path and, thus, assuming a path of zero curvature would significantly limit usefulness of the system.\",\n \"Some known systems assume that a path is known from a map or path planner.\",\n \"To this end, some known trailer backup assist systems operate under a requirement that a trailer backup path is known before backing of the trailer commences such as, for example, from a map or a path-planning algorithm.\",\n \"Undesirably, such implementations of the trailer backup assist systems are known to have a relatively complex human machine interface (HMI) device to specify the path, obstacles and/or goal of the backup maneuver.\",\n \"Furthermore, such systems also require some way to determine how well the desired path is being followed and to know when the desired goal, or stopping point and orientation, has been met, using approaches such as cameras, inertial navigation, or high precision global positioning system (GPS).\",\n \"These requirements lead to a relatively complex and costly system.\",\n \"Another reason backing a trailer can prove to be difficult is the need to control the vehicle in a manner that limits the potential for a jackknife condition to occur.\",\n \"A trailer has attained a jackknife condition when a hitch angle cannot be reduced (i.e., made less acute) while continuously backing up a trailer by application of a maximum steering input for the vehicle such as, for example, by moving steered front wheels of the vehicle to a maximum steered angle at a maximum rate of steering angle change.\",\n \"In the case of the jackknife angle being achieved, the vehicle must be pulled forward to relieve the hitch angle in order to eliminate the jackknife condition and, thus, allow the hitch angle to be controlled via manipulation of the steered wheels of the vehicle.\",\n \"However, in addition to the jackknife condition creating the inconvenient situation where the vehicle must be pulled forward, it can also lead to damage to the vehicle and/or trailer if certain operating conditions of the vehicle relating to its speed, engine torque, acceleration, and the like are not detected and counteracted.\",\n \"For example, if the vehicle is travelling at a suitably high speed in reverse and/or subjected to a suitably high longitudinal acceleration when the jackknife condition is achieved, the relative movement of the vehicle with respect to the trailer can lead to contact between the vehicle and trailer thereby damaging the trailer and/or the vehicle.\"\n ],\n [\n \" SUMMARY OF THE INVENTION According to at least one feature of the present disclosure, a system for calibrating a backup assist system for a trailer attached to a vehicle is provided which includes a hitch sensor continuously measuring a hitch angle between the vehicle and the trailer.\",\n \"A controller is configured to determine an offset of the measured hitch angle.\",\n \"The controller is configured to calculate and store in memory a forward offset if no reverse offset is stored.\",\n \"According to another feature of the present disclosure, a system for calibrating a backup assist system for a trailer attached to a vehicle is provided which includes a hitch sensor continuously measuring a hitch angle between the vehicle and the trailer.\",\n \"A controller is configured to determine an offset of the measured hitch angle.\",\n \"The controller is configured to prioritize the offset determined while the vehicle and the trailer are moving reverse over the offset determined while the vehicle and the trailer are moving forward.\",\n \"According to a further feature of the present disclosure, a system for calibrating a backup assist system for a trailer attached to a vehicle is provided which includes a hitch sensor continuously measuring a hitch angle between the vehicle and the trailer.\",\n \"A controller is configured to determine an offset of the measured hitch angle.\",\n \"The controller is configured to replace a forward offset when a reverse offset is determined.\",\n \"These and other aspects, objects, and features of the present invention will be understood and appreciated by those skilled in the art upon studying the following specification, claims, and appended drawings.\"\n ],\n [\n \"CROSS-REFERENCE TO RELATED APPLICATIONS This patent application is a division of U.S. patent application Ser.\",\n \"No.\",\n \"14/886,668, which was filed on Oct. 19, 2015, entitled “TRAILER BACKUP OFFSETDETERMINATION”, which is a continuation-in-part of U.S. patent application Ser.\",\n \"No.\",\n \"14/201,130, which was filed on Mar.\",\n \"7, 2014, entitled “SYSTEM AND METHOD OF CALIBRATING A TRAILER BACKUP ASSIST SYSTEM,” and issued as U.S. Pat.\",\n \"No.\",\n \"9,290,202 on Mar.\",\n \"22, 2016, which is a continuation-in-part of U.S. patent application Ser.\",\n \"No.\",\n \"14/068,387, which was filed on Oct. 31, 2013, entitled “TRAILER MONITORING SYSTEM AND METHOD,” and issued as U.S. Pat.\",\n \"No.\",\n \"9,102,271 on Aug. 11, 2015, which is a continuation-in-part of U.S. patent application Ser.\",\n \"No.\",\n \"14/059,835, which was filed on Oct. 22, 2013, entitled “TRAILER BACKUP ASSIST SYSTEM,” and issued as U.S. Pat.\",\n \"No.\",\n \"9,248,858 on Feb. 2, 2016, which is a continuation-in-part of U.S. patent application Ser.\",\n \"No.\",\n \"13/443,743 which was filed on Apr.\",\n \"10, 2012, entitled “DETECTION OF AND COUNTERMEASURES FOR JACKKNIFE ENABLING CONDITIONS DURING TRAILER BACKUP ASSIST,” and issued as U.S. Pat.\",\n \"No.\",\n \"8,825,328 on Sep. 2, 2014, which is a continuation-in-part of U.S. patent application Ser.\",\n \"No.\",\n \"13/336,060, which was filed on Dec. 23, 2011, entitled “TRAILER PATH CURVATURE CONTROL FOR TRAILER BACKUP ASSIST,” and issued as U.S. Pat.\",\n \"No.\",\n \"8,909,426 on Dec. 9, 2014, which claims benefit from U.S.\",\n \"Provisional Patent Application No.\",\n \"61/477,132, which was filed on Apr.\",\n \"19, 2011, entitled “TRAILER BACKUP ASSIST CURVATURE CONTROL,” which have a common Applicant herewith and are being incorporated herein in their entirety by reference.\",\n \"FIELD OF THE INVENTION The disclosure made herein relates generally to driver assist and active safety technologies in vehicles, and more particularly to a trailer backup assist system.\",\n \"BACKGROUND OF THE INVENTION Reversing a vehicle while towing a trailer is very challenging for many drivers.\",\n \"This is particularly true for drivers that are unskilled at backing vehicles with attached trailers, which may include those that drive with a trailer on an infrequent basis (e.g., have rented a trailer, use a personal trailer on an infrequent basis, etc.).\",\n \"One reason for such difficulty is that backing a vehicle with an attached trailer requires steering inputs that are opposite to normal steering when backing the vehicle without a trailer attached and/or requires braking to stabilize the vehicle-trailer combination before a jackknife condition occurs.\",\n \"Another reason for such difficulty is that small errors in steering while backing a vehicle with an attached trailer are amplified thereby causing the trailer to depart from a desired path.\",\n \"To assist the driver in steering a vehicle with a trailer attached, a trailer backup assist system needs to know the driver's intention.\",\n \"One common assumption with known trailer backup assist systems is that a driver of a vehicle with an attached trailer wants to backup straight and the system either implicitly or explicitly assumes a zero curvature path for the vehicle-trailer combination.\",\n \"Unfortunately most of the real-world use cases of backing a trailer involve a curved path and, thus, assuming a path of zero curvature would significantly limit usefulness of the system.\",\n \"Some known systems assume that a path is known from a map or path planner.\",\n \"To this end, some known trailer backup assist systems operate under a requirement that a trailer backup path is known before backing of the trailer commences such as, for example, from a map or a path-planning algorithm.\",\n \"Undesirably, such implementations of the trailer backup assist systems are known to have a relatively complex human machine interface (HMI) device to specify the path, obstacles and/or goal of the backup maneuver.\",\n \"Furthermore, such systems also require some way to determine how well the desired path is being followed and to know when the desired goal, or stopping point and orientation, has been met, using approaches such as cameras, inertial navigation, or high precision global positioning system (GPS).\",\n \"These requirements lead to a relatively complex and costly system.\",\n \"Another reason backing a trailer can prove to be difficult is the need to control the vehicle in a manner that limits the potential for a jackknife condition to occur.\",\n \"A trailer has attained a jackknife condition when a hitch angle cannot be reduced (i.e., made less acute) while continuously backing up a trailer by application of a maximum steering input for the vehicle such as, for example, by moving steered front wheels of the vehicle to a maximum steered angle at a maximum rate of steering angle change.\",\n \"In the case of the jackknife angle being achieved, the vehicle must be pulled forward to relieve the hitch angle in order to eliminate the jackknife condition and, thus, allow the hitch angle to be controlled via manipulation of the steered wheels of the vehicle.\",\n \"However, in addition to the jackknife condition creating the inconvenient situation where the vehicle must be pulled forward, it can also lead to damage to the vehicle and/or trailer if certain operating conditions of the vehicle relating to its speed, engine torque, acceleration, and the like are not detected and counteracted.\",\n \"For example, if the vehicle is travelling at a suitably high speed in reverse and/or subjected to a suitably high longitudinal acceleration when the jackknife condition is achieved, the relative movement of the vehicle with respect to the trailer can lead to contact between the vehicle and trailer thereby damaging the trailer and/or the vehicle.\",\n \"SUMMARY OF THE INVENTION According to at least one feature of the present disclosure, a system for calibrating a backup assist system for a trailer attached to a vehicle is provided which includes a hitch sensor continuously measuring a hitch angle between the vehicle and the trailer.\",\n \"A controller is configured to determine an offset of the measured hitch angle.\",\n \"The controller is configured to calculate and store in memory a forward offset if no reverse offset is stored.\",\n \"According to another feature of the present disclosure, a system for calibrating a backup assist system for a trailer attached to a vehicle is provided which includes a hitch sensor continuously measuring a hitch angle between the vehicle and the trailer.\",\n \"A controller is configured to determine an offset of the measured hitch angle.\",\n \"The controller is configured to prioritize the offset determined while the vehicle and the trailer are moving reverse over the offset determined while the vehicle and the trailer are moving forward.\",\n \"According to a further feature of the present disclosure, a system for calibrating a backup assist system for a trailer attached to a vehicle is provided which includes a hitch sensor continuously measuring a hitch angle between the vehicle and the trailer.\",\n \"A controller is configured to determine an offset of the measured hitch angle.\",\n \"The controller is configured to replace a forward offset when a reverse offset is determined.\",\n \"These and other aspects, objects, and features of the present invention will be understood and appreciated by those skilled in the art upon studying the following specification, claims, and appended drawings.\",\n \"BRIEF DESCRIPTION OF THE DRAWINGS In the drawings: FIG.\",\n \"1 shows a vehicle-trailer combination, the vehicle being configured for performing trailer backup assist functionality in accordance with an embodiment; FIG.\",\n \"2 shows one embodiment of the trailer backup steering input apparatus discussed in reference to FIG.\",\n \"1; FIG.\",\n \"3 shows an example of a trailer backup sequence implemented using the trailer backup steering input apparatus discussed in reference to FIG.\",\n \"2; FIG.\",\n \"4 shows a method for implementing trailer backup assist functionality in accordance with an embodiment; FIG.\",\n \"5 is a diagrammatic view showing a kinematic model configured for providing information utilized in providing trailer backup assist functionality in accordance with one embodiment; FIG.\",\n \"6 is a graph showing an example of a trailer path curvature function plot for a rotary-type trailer backup steering input apparatus configured in accordance with the disclosed subject matter; FIG.\",\n \"7 is a diagrammatic view showing a relationship between hitch angle and steered angle as it relates to determining a jackknife angle for a vehicle/trailer system in reverse or backing up; FIG.\",\n \"8 shows a method for implementing jackknife countermeasures functionality in accordance with an embodiment; FIG.\",\n \"9 shows a human machine interface (HMI) device associated with the trailer backup assist; FIG.\",\n \"10 shows a flow diagram associated with the trailer backup assist; FIG.\",\n \"11 shows a flow diagram of the setup module according to one embodiment; FIG.\",\n \"12 shows an example of an image displayed at the HMI device in accordance with one embodiment; FIG.\",\n \"13 is a block diagram illustrating the vehicle trailer backup assist system employing a target monitor controller, according to one embodiment; FIG.\",\n \"14 is a schematic diagram illustrating user placement of the target on a trailer towed by a vehicle; FIG.\",\n \"15 is an enlarged view of the front portion of the trailer further illustrating the target placement zone in relation to the target sticker; FIG.\",\n \"16 is a front view of a portable device having a display illustrating the overlay of a target onto a target placement zone on the trailer; FIG.\",\n \"17 is a flow diagram illustrating a method of assisting a user with the placement of the target on the trailer; FIG.\",\n \"18 is a flow diagram illustrating a method of monitoring placement of the target on the trailer and generating feedback alert; FIG.\",\n \"19 is a schematic view of a front portion of the trailer having a target mounting system assembled thereto, according to one embodiment; FIG.\",\n \"20 is an exploded view of the target mounting system and trailer shown in FIG.\",\n \"19; FIG.\",\n \"21 is a flow diagram illustrating an initial set up routine for monitoring the trailer connection for target changes and resetting trailer selection; FIG.\",\n \"22 is a flow diagram illustrating a target moved detection routine for monitoring presence of trailer changes and resetting trailer selection; FIG.\",\n \"23A is an image of the trailer showing the target in a first position; FIG.\",\n \"23B is an image of the trailer showing movement of the target to a second position, according to one example; FIG.\",\n \"24 is a flow diagram illustrating a trailer connection monitoring routine for monitoring trailer disconnection; FIG.\",\n \"25A is an image of a tow vehicle showing a keylock hole defined in a tailgate handle assembly of the tow vehicle; FIG.\",\n \"25B is an enlarged partial rear perspective view of a tailgate handle assembly defining a keylock hole; FIG.\",\n \"25C is an enlarged partial front perspective view of the tailgate handle assembly showing the customary use of a keylock cylinder with the keylock hole; FIG.\",\n \"25D shows the keylock cylinder mounted to the tailgate handle, according to one embodiment; FIG.\",\n \"26A is a front perspective view of a light assembly, according to one embodiment; FIG.\",\n \"26B is a rear perspective view of the light assembly; FIG.\",\n \"26C is an exploded view of the light assembly shown in FIGS.\",\n \"26A and 26B; FIG.\",\n \"26D is a cross sectional view of the light assembly taken along line XXVI D-XXVI D of FIG.\",\n \"26A; FIG.\",\n \"27A is a light assembly mounted to the tailgate handle assembly shown in FIG.\",\n \"25B, according to one embodiment; FIG.\",\n \"27B is an enlarged partial front perspective view of the tailgate handle assembly equipped with the light assembly shown in FIG.\",\n \"27A; FIG.\",\n \"28 is a schematic diagram illustrating a supplemental vehicle lighting system being implemented in the tow vehicle shown in FIG.\",\n \"25A, wherein the tow vehicle is attached to a trailer and features a trailer backup assist system employing vision based target detection; FIG.\",\n \"29 is a top plan view of a trailer attached to a vehicle having a sensor system, according to one embodiment; FIG.\",\n \"30 is a block diagram illustrating the trailer backup assist system employing a sensor system that has a primary sensor and a secondary sensor, according to one embodiment; FIG.\",\n \"31 is a flow diagram illustrating a method for estimating an actual hitch angle of a trailer attached to a vehicle with a sensor system; FIG.\",\n \"32 is an automotive vehicle having a hitch angle estimating system of the disclosed subject matter; FIG.\",\n \"33 is a block diagram of a vehicle having a trailer coupled thereto and a relationship to the law of cosines; FIG.\",\n \"34 is a flow chart of a method of estimating a hitch angle; FIG.\",\n \"35 is a block diagram illustrating one embodiment of the trailer backup assist system having the trailer backup assist control module with a hitch angle calibration routine; FIG.\",\n \"36 is a diagram that illustrates the geometry of a vehicle and a trailer overlaid with a two-dimensional x-y coordinate system that identifies variables used to calculate kinematic information of the vehicle and trailer system; FIG.\",\n \"37 is a flow diagram illustrating one embodiment of the hitch angle calibration routine; FIG.\",\n \"38 is a flow diagram illustrating an initiating routine that is performed prior to calculating the trailer angle offset, according to one embodiment; FIG.\",\n \"39 is a flow diagram illustrating an additional embodiment of the hitch angle calibration routine; FIG.\",\n \"40 is a flow diagram illustrating a method of calibrating a trailer backup assist system before determining an offset of the measured hitch angle; and FIG.\",\n \"41 is a flow diagram illustrating an offset prioritization method, according to one embodiment.\",\n \"DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS While various aspects of the inventive subject matter are described with reference to a particular illustrative embodiment, the inventive subject matter is not limited to such embodiments, and additional modifications, applications, and embodiments may be implemented without departing from the inventive subject matter.\",\n \"In the figures, like reference numbers will be used to illustrate the same components.\",\n \"Those skilled in the art will recognize that the various components set forth herein may be altered without varying from the scope of the inventive subject matter.\",\n \"The disclosed subject matter is directed to providing trailer backup assist functionality in a manner that is relatively low cost and that offers an intuitive user interface.\",\n \"In particular, such trailer backup assist functionality provides for controlling curvature of a path of travel of a trailer attached to a vehicle (i.e., trailer path curvature control) by allowing a driver of the vehicle to specify a desired path of the trailer by inputting a desired trailer path curvature as the backup maneuver of the vehicle and trailer progresses.\",\n \"Although a control knob, a set of virtual buttons, or a touch screen can each be implemented for enabling trailer path curvature control, the disclosed subject matter is not unnecessarily limited to any particular configuration of interface through which a desired trailer path curvature is inputted.\",\n \"Furthermore, in the case where a steering wheel can be mechanically decoupled from steered wheels of the vehicle, the steering wheel can also be used as an interface through which a desired trailer path curvature is inputted.\",\n \"As will be discussed herein in greater detail, kinematical information of a system defined by the vehicle and the trailer are used to calculate a relationship (i.e., kinematics) between the trailer's curvature and the steering angle of the vehicle for determining steering angle changes of the vehicle for achieving the specified trailer path.\",\n \"Steering commands corresponding to the steering angle changes are used for controlling a steering system of the tow vehicle (e.g., electric power assisted steering (EPAS) system) for implementing steering angle changes of steered wheels of the vehicle to achieve (e.g., to approximate) the specified path of travel of the trailer.\",\n \"The trailer backup assist system automatically steers the vehicle-trailer combination as a driver uses the vehicle transmission, accelerator and brake to reverse the vehicle-trailer combination.\",\n \"The driver inputs a desired trailer curvature command by using an input device such as a trailer steering knob.\",\n \"Trailer backup assist functionality may be directed to implementing one or more countermeasures for limiting the potential of a jackknife condition being attained between a vehicle and a trailer being towed by the vehicle while backing up.\",\n \"In certain embodiments, curvature of a path of travel of the trailer (i.e., trailer path curvature control) can be controlled by allowing a driver of the vehicle to specify a desired path of the trailer by inputting a desired trailer path curvature as the backup maneuver of the vehicle and trailer progresses.\",\n \"Although a control knob, a set of virtual buttons, or a touch screen can each be implemented for enabling trailer path curvature control, the disclosed subject matter is not unnecessarily limited to any particular configuration of interface through which a desired trailer path curvature is inputted.\",\n \"Furthermore, in the case where a steering wheel can be mechanically decoupled from steered wheels of the vehicle, the steering wheel can also be used as an interface through which a desired trailer path curvature is inputted.\",\n \"As will be discussed herein in greater detail, kinematic information of a system defined by the vehicle and the trailer are used to calculate a relationship (i.e., kinematics) between the trailer's curvature and the steering angle of the vehicle for determining steering angle changes of the vehicle for achieving the specified trailer path.\",\n \"Steering commands corresponding to the steering angle changes are used for controlling a steering system of the tow vehicle (e.g., electric power assisted steering (EPAS) system) for implementing steering angle changes of steered wheels of the vehicle to achieve (e.g., to approximate) the specified path of travel of the trailer.\",\n \"Embodiments of the disclosed subject matter are directed to trailer backup assist functionality that provides for a user interface for a system that controls curvature of a path of a trailer being backed by a vehicle.\",\n \"More specifically, trailer backup assist functionality configured in accordance with embodiments of the disclosed subject matter provide for such trailer path curvature control by allowing a driver of the vehicle to specify a desired path of the trailer by inputting a desired trailer path curvature as the backup maneuver of the vehicle and trailer progresses.\",\n \"In response to such path of the trailer being specified by the driver, embodiments of the disclosed subject matter control a power assisted steering system (e.g., electric power assisted steering (EPAS) system) of the vehicle for implementing steering angle changes of steered wheels of the vehicle to achieve the specified trailer path.\",\n \"Kinematics of the vehicle and the trailer are used to determine the steering angle changes that are required for achieving the specified trailer path.\",\n \"Accordingly, embodiments of the disclosed subject matter provide for implementation of trailer backup assist functionality in a manner that is relatively simple and that enables use of an intuitive vehicle operator interface for specifying trailer path curvature control.\",\n \"The disclosed subject matter, furthermore, includes embodiments directed to determining a hitch angle of trailer attached to the vehicle.\",\n \"In one such embodiment, the vehicle trailer backup assist system may utilize a target placed on the trailer, allowing the trailer backup assist system to employ information acquired via image acquisition and processing of the target.\",\n \"According to other embodiments, the target may be used to identify if a connected trailer has changed, trailer connection or disconnection, and other trailer related information.\",\n \"The target is an identifiable visual target that can be captured in an image by the video imaging camera and detected and processed via image processing.\",\n \"According to one embodiment, the target may attached to the trailer, preferably within a target placement zone, such that the camera and image processing may detect the target and its location on the trailer to determine trailer related information, such as the hitch angle between the trailer and the towing vehicle.\",\n \"The trailer backup assist system may provide to the user one or more image(s) of the trailer target zone for proper placement of the target to assist with placement of the target on the trailer.\",\n \"Additionally, the vehicle trailer backup assist system may monitor the target to determine if the target has been correctly placed within a desired target placement zone and provide feedback alert(s) to the user.\",\n \"Further, the trailer backup assist system may monitor the trailer connection by monitoring the target to determine if the target has moved to determine whether the same trailer remains connected to the tow vehicle, and may initiate action in response thereto.\",\n \"Further, the trailer backup assist system may monitor the hitch angle or the target to determine if the trailer may have been changed out (i.e., disconnected and replaced with another trailer), and may initiate action in response thereto.\",\n \"The disclosed subject matter also provides a supplemental vehicle lighting system that is responsive to a trailer backup assist system.\",\n \"The system includes a rear vehicle fixture defining a keylock hole customarily used in conjunction with a corresponding keylock cylinder.\",\n \"A light assembly is provided in the place of a keylock cylinder and operably coupled to the keylock hole.\",\n \"The light assembly includes a housing having a barrel that is concentrically aligned with the keylock hole and includes a distal end and a proximal end.\",\n \"A lighting device is disposed inside the housing and operable to emit light through the barrel beginning from the proximal end.\",\n \"A lens is coupled to the distal end of the barrel and is disposed to at least partially coincide with the keylock hole, wherein the lens is configured to disperse light emitted from the lighting device to illuminate a rear vehicle area.\",\n \"In some embodiments of the disclosed trailer backup assist system, it can be advantageous to use information that is representative of a hitch angle between the vehicle and a trailer attached to the vehicle.\",\n \"The disclosed subject matter provides embodiments directed to estimating an actual hitch angle of a trailer attached to a vehicle, as in some situations sensor information may become unavailable or may otherwise not provide an accurate measurement of the hitch angle.\",\n \"A hitch angle that is not accurate may introduce a potential for inadequate or improper vehicle system control, especially when the hitch angle information is important to controlling the vehicle system, such as a trailer backup assist system or a trailer brake controller.\",\n \"According to one embodiment, a sensor system for estimating an actual hitch angle of a trailer attached to a vehicle includes a primary sensor having a camera monitoring a target on the trailer to determine a measured hitch angle and a secondary sensor that monitors the trailer to determine an indicator of the actual hitch angle.\",\n \"The trailer backup assist system may then operate the vehicle when the measured hitch angle correlates with the indicator of the actual hitch angle, confirming that the measured hitch angle is a generally accurate estimate of the actual hitch angle.\",\n \"According to an additional embodiment of the disclosed subject matter, a system for estimating a hitch angle between a vehicle and a trailer coupled thereto has a wireless receiver on the vehicle located a predetermined distance from a trailer mount and a wireless transmitter located at an end of the trailer opposite the trailer mount.\",\n \"According to one embodiment, a controller monitors power returns of a signal transmitted from the transmitter to the receiver and thereby estimates a distance between the transmitter and the receiver as a function of a path loss propagation of the transmitted signal.\",\n \"The hitch angle is then estimated using the estimated distance, the predetermined distance, and a trailer length.\",\n \"To further ensure the accuracy of the measured hitch angle, in additional embodiments the trailer back assist system may include a hitch angle calibration routine for determining any offset between the measured hitch angle and the actual hitch angle, based on certain vehicle and/or trailer characteristics.\",\n \"In one of these embodiments, a method provides for sensing a measured hitch angle with at least one hitch angle sensor on the vehicle and sensing a steering angle of the steered wheels of the vehicle.\",\n \"The method further provides for reversing the vehicle, and thereby determining an offset between the measured hitch angle and the actual hitch angle when the measured hitch angle and the steering angle are substantially consistent while the vehicle is reversing.\",\n \"Another one of these embodiments provides driving the vehicle forward substantially straight above a threshold speed while sensing a yaw rate of the vehicle and sensing a measured hitch angle of the trailer.\",\n \"Further, the method provides for determining an angle rate based on the measured hitch angle, and then determining an offset between the measured hitch angle and the actual hitch angle when the yaw rate and the angle rate are substantially zero.\",\n \"The offset may then be used to more accurately manipulate the actual hitch angle with the trailer backup assist system.\",\n \"Trailer Backup Assist System Referring to FIG.\",\n \"1, an embodiment of a vehicle 100 configured for performing trailer backup assist functionality is shown.\",\n \"A trailer backup assist system 105 of the vehicle 100 controls the curvature of path of travel of a trailer 110 that is attached to the vehicle 100.Such control is accomplished through interaction of a power assisted steering system 115 of the vehicle 100 and the trailer backup assist system 105.During operation of the trailer backup assist system 105 while the vehicle 100 is being reversed, a driver of the vehicle 100 is sometimes limited in the manner in which he/she can make steering inputs via a steering wheel of the vehicle 100.This is because in certain vehicles the trailer backup assist system 105 is in control of the power assisted steering system 115 and the power assisted steering system 115 is directly coupled to the steering wheel (i.e., the steering wheel of the vehicle 100 moves in concert with steered wheels of the vehicle 100).\",\n \"As is discussed below in greater detail, a human machine interface (HMI) device of the backup assist system 105 is used for commanding changes in curvature of a path of the trailer 110 such as a knob, thereby decoupling such commands from being made at the steering wheel of the vehicle 100.However, some vehicles configured to provide trailer backup assist functionality in accordance with the disclosed subject matter will have the capability to selectively decouple steering movement from movement of steerable wheels of the vehicle, thereby allowing the steering wheel to be used for commanding changes in curvature of a path of a trailer during such trailer backup assist.\",\n \"The trailer backup assist system 105 includes a trailer backup assist control module 120, a trailer backup steering input apparatus 125, and a hitch angle detection apparatus 130.The trailer backup assist control module 120 is connected to the trailer backup steering input apparatus 125 and the hitch angle detection apparatus 130 for allowing communication of information therebetween.\",\n \"It is disclosed herein that the trailer backup steering input apparatus can be coupled to the trailer backup assist control module 120 in a wired or wireless manner.\",\n \"The trailer backup assist system control module 120 is attached to a power steering assist control module 135 of the power steering assist system 115 for allowing information to be communicated therebetween.\",\n \"A steering angle detection apparatus 140 of the power steering assist system 115 is connected to the power steering assist control module 135 for providing information thereto.\",\n \"The trailer backup assist system is also attached to a brake system control module 145 and a powertrain control module 150 for allowing communication of information therebetween.\",\n \"Jointly, the trailer backup assist system 105, the power steering assist system 115, the brake system control module 145, the powertrain control module 150, and the gear selection device (PRNDL), define a trailer backup assist architecture configured in accordance with an embodiment.\",\n \"The trailer backup assist control module 120 is configured for implementing logic (i.e., instructions) for receiving information from the trailer backup steering input apparatus 125, the hitch angle detection apparatus 130, the power steering assist control module 135, the brake system control module 145, and the powertrain control module 150.The trailer backup assist control module 120 (e.g., a trailer curvature algorithm thereof) generates vehicle steering information as a function of all or a portion of the information received from the trailer backup steering input apparatus 125, the hitch angle detection apparatus 130, the power steering assist control module 135, the brake system control module 145, and the powertrain control module 150.Thereafter, the vehicle steering information is provided to the power steering assist control module 135 for affecting steering of the vehicle 100 by the power steering assist system 115 to achieve a commanded path of travel for the trailer 110.The trailer backup steering input apparatus 125 provides the trailer backup assist control module 120 with information defining the commanded path of travel of the trailer 110 to the trailer backup assist control module 120 (i.e., trailer steering information).\",\n \"The trailer steering information can include information relating to a commanded change in the path of travel (e.g., a change in radius of path curvature) and information relating to an indication that the trailer is to travel along a path defined by a longitudinal centerline axis of the trailer (i.e., along a substantially straight path of travel).\",\n \"As will be discussed below in detail, the trailer backup steering input apparatus 125 preferably includes a rotational control input device for allowing a driver of the vehicle 100 to interface with the trailer backup steering input apparatus 125 to command desired trailer steering actions (e.g., commanding a desired change in radius of the path of travel of the trailer and/or commanding that the trailer travel along a substantially straight path of travel as defined by a longitudinal centerline axis of the trailer).\",\n \"In a preferred embodiment, the rotational control input device is a knob rotatable about a rotational axis extending through a top surface/face of the knob.\",\n \"In other embodiments, the rotational control input device is a knob rotatable about a rotational axis extending substantially parallel to a top surface/face of the knob.\",\n \"Some vehicles (e.g., those with active front steer) have a power steering assist system configuration that allows a steering wheel to be partially decoupled from movement of the steered wheels of such a vehicle.\",\n \"Accordingly, the steering wheel can be rotated independent of the manner in which the power steering assist system of the vehicle controls the steered wheels (e.g., as commanded by vehicle steering information provided by a power steering assist system control module from a trailer backup assist system control module configured in accordance with one embodiment).\",\n \"As such, in these types of vehicles where the steering wheel can be selectively decoupled from the steered wheels to allow independent operation thereof, trailer steering information of a trailer backup assist system configured in accordance with the disclosed subject matter can be provided through rotation of the steering wheel.\",\n \"Accordingly, it is disclosed herein that in certain embodiments, the steering wheel is an embodiment of a rotational control input device in the context of the disclosed subject matter.\",\n \"In such embodiments, the steering wheel would be biased (e.g., by an apparatus that is selectively engageable/activatable) to an at-rest position between opposing rotational ranges of motion.\",\n \"The hitch angle detection apparatus 130, which operates in conjunction with a hitch angle detection component 155 of the trailer 110, provides the trailer backup assist control module 120 with information relating to an angle between the vehicle 100 and the trailer 110 (i.e., hitch angle information).\",\n \"In a preferred embodiment, the hitch angle detection apparatus 130 is a camera-based apparatus such as, for example, an existing rear view camera of the vehicle 100 that images (i.e., visually monitors) a target (i.e., the hitch angle detection component 155) attached the trailer 110 as the trailer 110 is being backed by the vehicle 100.Preferably, but not necessarily, the hitch angle detection component 155 is a dedicated component (e.g., an item attached to/integral with a surface of the trailer 110 for the express purpose of being recognized by the hitch angle detection apparatus 130).\",\n \"Alternatively, the hitch angle detection apparatus 130 can be a device that is physically mounted on a hitch component of the vehicle 100 and/or a mating hitch component of the trailer 110 for determining an angle between centerline longitudinal axes of the vehicle 100 and the trailer 110.The hitch angle detection apparatus 130 can be configured for detecting a jackknife enabling condition and/or related information (e.g., when a hitch angle threshold has been met).\",\n \"The power steering assist control module 135 provides the trailer backup assist control module 120 with information relating to a rotational position (e.g., angle) of the steering wheel angle and/or a rotational position (e.g., turning angle(s)) of steered wheels of the vehicle 100.In certain embodiments, the trailer backup assist control module 120 can be an integrated component of the power steering assist system 115.For example, the power steering assist control module 135 can include a trailer backup assist algorithm for generating vehicle steering information as a function of all or a portion of information received from the trailer backup steering input apparatus 125, the hitch angle detection apparatus 130, the power steering assist control module 135, the brake system control module 145, and the powertrain control module 150.The brake system control module 145 provides the trailer backup assist control module 120 with information relating to vehicle speed.\",\n \"Such vehicle speed information can be determined from individual wheel speeds as monitored by the brake system control module 145 or may be provided by an engine control module with signal plausibility.\",\n \"Vehicle speed may also be determined from an engine control module.\",\n \"In some instances, individual wheel speeds can also be used to determine a vehicle yaw rate and such yaw rate can be provided to the trailer backup assist control module 120 for use in determining the vehicle steering information.\",\n \"In certain embodiments, the trailer backup assist control module 120 can provide vehicle braking information to the brake system control module 145 for allowing the trailer backup assist control module 120 to control braking of the vehicle 100 during backing of the trailer 110.For example, using the trailer backup assist control module 120 to regulate speed of the vehicle 100 during backing of the trailer 110 can reduce the potential for unacceptable trailer backup conditions.\",\n \"Examples of unacceptable trailer backup conditions include, but are not limited to, a vehicle over speed condition, a high hitch angle rate, trailer angle dynamic instability, a calculated theoretical trailer jackknife condition (defined by a maximum vehicle steering angle, drawbar length, tow vehicle wheelbase and an effective trailer length), or physical contact jackknife limitation (defined by an angular displacement limit relative to the vehicle 100 and the trailer 110), and the like.\",\n \"It is disclosed herein that the backup assist control module 120 can issue a signal corresponding to a notification (e.g., a warning) of an actual, impending, and/or anticipated unacceptable trailer backup condition.\",\n \"The powertrain control module 150 interacts with the trailer backup assist control module 120 for regulating speed and acceleration of the vehicle 100 during backing of the trailer 110.As mentioned above, regulation of the speed of the vehicle 100 is necessary to limit the potential for unacceptable trailer backup conditions such as, for example, jackknifing and trailer angle dynamic instability.\",\n \"Similar to high-speed considerations as they relate to unacceptable trailer backup conditions, high acceleration and high dynamic driver curvature requests can also lead to such unacceptable trailer backup conditions.\",\n \"Steering Input Apparatus Referring now to FIG.\",\n \"2, an embodiment of the trailer backup steering input apparatus 125 discussed in reference to FIG.\",\n \"1 is shown.\",\n \"A rotatable control element in the form of a knob 170 is coupled to a movement sensing device 175.The knob 170 is biased (e.g., by a spring return) to an at-rest position P(AR) between opposing rotational ranges of motion R(R), R(L).\",\n \"A first one of the opposing rotational ranges of motion R(R) is substantially equal to a second one of the opposing rotational ranges of motion R(L), R(R).\",\n \"To provide a tactile indication of an amount of rotation of the knob 170, a force that biases the knob 170 toward the at-rest position P(AR) can increase (e.g., non-linearly) as a function of the amount of rotation of the knob 170 with respect to the at-rest position P(AR).\",\n \"Additionally, the knob 170 can be configured with position indicating detents such that the driver can positively feel the at-rest position P(AR) and feel the ends of the opposing rotational ranges of motion R(L), R(R) approaching (e.g., soft end stops).\",\n \"The movement sensing device 175 is configured for sensing movement of the knob 170 and outputting a corresponding signal (i.e., movement sensing device signal) to the trailer assist backup input apparatus 125 shown in FIG.\",\n \"1.The movement sensing device signal is generated as a function of an amount of rotation of the knob 170 with respect to the at-rest position P(AR), a rate movement of the knob 170, and/or a direction of movement of the knob 170 with respect to the at-rest position P(AR).\",\n \"As will be discussed below in greater detail, the at-rest position P(AR) of the knob 170 corresponds to a movement sensing device signal indicating that the vehicle 100 should be steered such that the trailer 110 is backed along a substantially straight path (zero trailer curvature request from the driver) as defined by a centerline longitudinal axis of the trailer 110 when the knob 170 was returned to the at-rest position P(AR) and a maximum clockwise and anti-clockwise position of the knob 170 (i.e., limits of the opposing rotational ranges of motion R(R), R(L)) each correspond to a respective movement sensing device signal indicating a tightest radius of curvature (i.e., most acute trajectory) of a path of travel of the trailer 110 that is possible without the corresponding vehicle steering information causing a jackknife condition.\",\n \"In this regard, the at-rest position P(AR) is a zero curvature commanding position with respect to the opposing rotational ranges of motion R(R), R(L).\",\n \"It is disclosed herein that a ratio of a commanded curvature of a path of a trailer (e.g., radius of a trailer trajectory) and a corresponding amount of rotation of the knob can vary (e.g., non-linearly) over each one of the opposing rotational ranges of motion P(L), P(R) of the knob 170.It is also disclosed therein that the ratio can be a function of vehicle speed, trailer geometry, vehicle geometry, hitch geometry and/or trailer load.\",\n \"Use of the knob 170 decouples trailer steering inputs from being made at a steering wheel of the vehicle 100.In use, as a driver of the vehicle 100 backs the trailer 110, the driver can turn the knob 170 to indicate a desired curvature of a path of the trailer 110 to follow and returns the knob 170 to the at-rest position P(AR) for causing the trailer 110 to be backed along a straight line.\",\n \"Accordingly, in embodiments of trailer backup assist systems where the steering wheel remains physically coupled to the steerable wheels of a vehicle during backup of an attached trailer, a rotatable control element configured in accordance with the disclosed subject matter (e.g., the knob 170) provides a simple and user-friendly means of allowing a driver of a vehicle to input trailer steering commands.\",\n \"It is disclosed herein that a rotational control input device configured in accordance with embodiments of the disclosed subject matter (e.g., the knob 170 and associated movement sensing device) can omit a means for being biased to an at-rest position between opposing rotational ranges of motion.\",\n \"Lack of such biasing allows a current rotational position of the rotational control input device to be maintained until the rotational control input device is manually moved to a different position.\",\n \"Preferably, but not necessarily, when such biasing is omitted, a means is provided for indicating that the rotational control input device is positioned in a zero curvature commanding position (e.g., at the same position as the at-rest position in embodiments where the rotational control input device is biased).\",\n \"Examples of means for indicating that the rotational control input device is positioned in the zero curvature commanding position include, but are not limited to, a detent that the rotational control input device engages when in the zero curvature commanding position, a visual marking indicating that the rotational control input device is in the zero curvature commanding position, an active vibratory signal indicating that the rotational control input device is in or approaching the zero curvature commanding position, an audible message indicating that the rotational control input device is in of approaching the zero curvature commanding position, and the like.\",\n \"It is also disclosed herein that embodiments of the disclosed subject matter can be configured with a control input device that is not rotational (i.e., a non-rotational control input device).\",\n \"Similar to a rotational control input device configured in accordance with embodiments of the disclosed subject matter (e.g., the knob 170 and associated movement sensing device), such a non-rotational control input device is configured to selectively provide a signal causing a trailer to follow a path of travel segment that is substantially straight and to selectively provide a signal causing the trailer to follow a path of travel segment that is substantially curved.\",\n \"Examples of such a non-rotational control input device include, but are not limited to, a plurality of depressible buttons (e.g., curve left, curve right, and travel straight), a touch screen on which a driver traces or otherwise inputs a curvature for path of travel commands, a button that is translatable along an axis for allowing a driver to input path of travel commands, or joystick type input and the like.\",\n \"The trailer backup steering input apparatus 125 can be configured to provide various feedback information to a driver of the vehicle 100.Examples of situation that such feedback information can include, but are not limited to, a status of the trailer backup assist system 105 (e.g., active, in standby (e.g., when driving forward to reduce the hitch angle and zero hitch angle to remove bias), faulted, inactive, etc.\",\n \"), that a curvature limit has been reached (i.e., maximum commanded curvature of a path of travel of the trailer 110), and/or a graphical representation of the vehicle and trailer orientation state.\",\n \"To this end, the trailer backup steering input apparatus 125 can be configured to provide a tactile feedback signal (e.g., a vibration through the knob 170) as a warning if any one of a variety of conditions occur.\",\n \"Examples of such conditions include, but are not limited to, the trailer 110 approaching jackknife, the trailer backup assist system 105 has had a failure, the trailer backup assist system 105 has detected a fault, the trailer backup assist system 105 or other system of the vehicle 100 has predicted a collision on the present path of travel of the trailer 110, the trailer backup system 105 has restricted a commanded curvature of a trailer's path of travel (e.g., due to excessive speed or acceleration of the vehicle 100), and the like.\",\n \"Still further, it is disclosed that the trailer backup steering input apparatus 125 can use illumination (e.g., an LED 180) and/or an audible signal output (e.g., an audible output device 185 or through attached vehicle audio speakers) to provide certain feedback information (e.g., notification/warning of an unacceptable trailer backup condition).\",\n \"Referring now to FIGS.\",\n \"2 and 3, an example of using the trailer backup steering input apparatus 125 for dictating a curvature of a path of travel (POT) of a trailer (i.e., the trailer 110 shown in FIG.\",\n \"1) while backing up the trailer with a vehicle (i.e., the vehicle 100 in FIGS.\",\n \"1 and 2) is shown.\",\n \"In preparation of backing the trailer 110, the driver of the vehicle 100 drives the vehicle 100 forward along a pull-thru path (PTP) to position the vehicle 100 and trailer 110 at a first backup position B1.In the first backup position B1, the vehicle 100 and trailer 110 are longitudinally aligned with each other such that a longitudinal centerline axis L1 of the vehicle 100 is aligned with (e.g., parallel with or coincidental with) a longitudinal centerline axis L2 of the trailer 110.It is disclosed herein that such alignment of the longitudinal axes L1, L2 at the onset of an instance of trailer backup functionality is not a requirement for operability of a trailer backup assist system configured in accordance with the disclosed subject matter.\",\n \"After activating the trailer backup assist system 105 (e.g., before, after, or during the pull-thru sequence), the driver begins to back the trailer 110 by reversing the vehicle 100 from the first backup position B1.So long as the knob 170 of the trailer backup steering input apparatus 125 remains in the at-rest position P(AR), the trailer backup assist system 105 will steer the vehicle 100 as necessary for causing the trailer 110 to be backed along a substantially straight path of travel as defined by the longitudinal centerline axis L2 of the trailer 110 at the time when backing of the trailer 110 began.\",\n \"When the trailer reaches the second backup position B2, the driver rotates the knob 170 to command the trailer 110 to be steered to the right (i.e., a knob position R(R) clockwise rotation).\",\n \"Accordingly, the trailer backup assist system 105 will steer the vehicle 100 for causing the trailer 110 to be steered to the right as a function of an amount of rotation of the knob 170 with respect to the at-rest position P(AR), a rate movement of the knob 170, and/or a direction of movement of the knob 170 with respect to the at-rest position P(AR).\",\n \"Similarly, the trailer 110 can be commanded to steer to the left by rotating the knob 170 to the left.\",\n \"When the trailer reaches backup position B3, the driver allows the knob 170 to return to the at-rest position P(AR) thereby causing the trailer backup assist system 105 to steer the vehicle 100 as necessary for causing the trailer 110 to be backed along a substantially straight path of travel as defined by the longitudinal centerline axis L2 of the trailer 110 at the time when the knob 170 was returned to the at-rest position P(AR).\",\n \"Thereafter, the trailer backup assist system 105 steers the vehicle 100 as necessary for causing the trailer 110 to be backed along this substantially straight path to the fourth backup position B4.In this regard, arcuate portions of a path of travel POT of the trailer 110 are dictated by rotation of the knob 170 and straight portions of the path of travel POT are dictated by an orientation of the centerline longitudinal axis L2 of the trailer when the knob 170 is in/returned to the at-rest position P(AR).\",\n \"In order to activate the trailer backup assist system described above in FIGS.\",\n \"1-3, the driver interacts with the trailer backup assist system and the trailer backup assist system interacts with the vehicle environment.\",\n \"The trailer backup assist system automatically steers as the driver reverses the vehicle.\",\n \"As discussed above, the driver controls the trailer trajectory by using a steering knob to input desired trailer curvature.\",\n \"The trailer backup assist algorithm determines the vehicle steering angle to achieve the desired trailer curvature, and the driver controls the throttle and brake while the trailer backup assist system controls the steering.\",\n \"FIG.\",\n \"4 shows a method 200 for implementing trailer backup assist functionality in accordance with one embodiment.\",\n \"In a preferred embodiment, the method 200 for implementing trailer backup assist functionality can be carried out using the trailer backup assist architecture discussed above in reference to the vehicle 100 and trailer 110 of FIG.\",\n \"1.Accordingly, trailer steering information is provided through use of a rotational control input device (e.g., the knob 170 discussed in reference to FIG.\",\n \"2).\",\n \"An operation 202 is performed for receiving a trailer backup assist request.\",\n \"Examples of receiving the trailer backup assist request include activating the trailer backup assist system and providing confirmation that the vehicle and trailer are ready to be backed.\",\n \"After receiving a trailer backup assist request (i.e., while the vehicle is being reversed), an operation 204 is performed for receiving a trailer backup information signal.\",\n \"Examples of information carried by the trailer backup information signal include, but are not limited to, information from the trailer backup steering input apparatus 125, information from the hitch angle detection apparatus 130, information from the power steering assist control module 135, information from the brake system control module 145, and information from the powertrain control module 150.It is disclosed herein that information from the trailer backup steering input apparatus 125 preferably includes trailer path curvature information characterizing a desired curvature for the path of travel of the trailer, such as provided by the trailer backup steering input apparatus 125 discussed above in reference to FIGS.\",\n \"1 and 2.In this manner, the operation 204 for receiving the trailer backup information signal can include receiving trailer path curvature information characterizing the desired curvature for the path of travel of the trailer.\",\n \"If the trailer backup information signal indicates that a change in curvature of the trailer's path of travel is requested (i.e., commanded via the knob 170), an operation 206 is performed for determining vehicle steering information for providing the requested change in curvature of the trailer's path of travel.\",\n \"Otherwise, an operation 208 is performed for determining vehicle steering information for maintaining a current straight-line heading of the trailer (i.e., as defined by the longitudinal centerline axis of the trailer).\",\n \"Thereafter, an operation 210 is performed for providing the vehicle steering information to a power steering assist system of the vehicle, followed by an operation 212 being performed for determining the trailer backup assist status.\",\n \"If it is determined that trailer backup is complete, an operation 214 is performed for ending the current trailer backup assist instance.\",\n \"Otherwise the method 200 returns to the operation 204 for receiving trailer backup information.\",\n \"Preferably, the operation for receiving the trailer backup information signal, determining the vehicle steering information, providing the vehicle steering information, and determining the trailer backup assist status are performed in a monitoring fashion (e.g., at a high rate of speed of a digital data processing device).\",\n \"Accordingly, unless it is determined that reversing of the vehicle for backing the trailer is completed (e.g., due to the vehicle having been successfully backed to a desired location during a trailer backup assist instance, the vehicle having to be pulled forward to begin another trailer backup assist instance, etc.\",\n \"), the method 200 will continually be performing the operations for receiving the trailer backup information signal, determining the vehicle steering information, providing the vehicle steering information, and determining the trailer backup assist status.\",\n \"It is disclosed herein that the operation 206 for determining vehicle steering information for providing the requested change in curvature of the trailer's path of travel preferably includes determining vehicle steering information as a function of trailer path curvature information contained within the trailer backup information signal.\",\n \"As will be discussed below in greater detail, determining vehicle steering information can be accomplished through a low order kinematic model defined by the vehicle and the trailer.\",\n \"Through such a model, a relationship between the trailer path curvature and commanded steering angles of steered wheels of the vehicle can be generated for determining steering angle changes of the steered wheels for achieving a specified trailer path curvature.\",\n \"In this manner, the operation 206 for determining vehicle steering information can be configured for generating information necessary for providing trailer path curvature control in accordance with the disclosed subject matter.\",\n \"In some embodiments of the disclosed subject matter, the operation 210 for providing the vehicle steering information to the power steering assist system of the vehicle causes the steering system to generate a corresponding steering command as a function of the vehicle steering information.\",\n \"The steering command is interpretable by the steering system and is configured for causing the steering system to move steered wheels of the steering system for achieving a steered angle as specified by the vehicle steering information.\",\n \"Alternatively, the steering command can be generated by a controller, module or computer external to the steering system (e.g., a trailer backup assist control module) and be provided to the steering system.\",\n \"In parallel with performing the operations for receiving the trailer backup information signal, determining the vehicle steering information, providing the vehicle steering information, and determining the trailer backup assist status, the method 200 performs an operation 216 for monitoring the trailer backup information for determining if an unacceptable trailer backup condition exists.\",\n \"Examples of such monitoring include, but are not limited to assessing a hitch angle to determine if a hitch angle threshold is exceeded, assessing a backup speed to determine if a backup speed threshold is exceeded, assessing vehicle steering angle to determine if a vehicle steering angle threshold is exceeded, assessing other operating parameters (e.g., vehicle longitudinal acceleration, throttle pedal demand rate and hitch angle rate) for determining if a respective threshold value is exceeded, and the like.\",\n \"Backup speed can be determined from wheel speed information obtained from one or more wheel speed sensors of the vehicle.\",\n \"If it is determined that an unacceptable trailer backup condition exists, an operation 218 is performed for causing the current path of travel of the trailer to be inhibited (e.g., stopping motion of the vehicle), followed by the operation 214 being performed for ending the current trailer backup assist instance.\",\n \"It is disclosed herein that prior to and/or in conjunction with causing the current trailer path to be inhibited, one or more actions (e.g., operations) can be implemented for providing the driver with feedback (e.g., a warning) that such an unacceptable hitch angle condition is impending or approaching.\",\n \"In one example, if such feedback results in the unacceptable hitch angle condition being remedied prior to achieving a critical condition, the method can continue with providing trailer backup assist functionality in accordance with operations 204-212.Otherwise, the method can proceed to operation 214 for ending the current trailer backup assist instance.\",\n \"In conjunction with performing the operation 214 for ending the current trailer backup assist instance, an operation can be performed for controlling movement of the vehicle to correct or limit a jackknife condition (e.g., steering the vehicle, decelerating the vehicle, limiting magnitude and/or rate of driver requested trailer curvature input, limiting magnitude and/or rate of the steering command, and/or the like to preclude the hitch angle from being exceeded).\",\n \"Curvature Control Algorithm Turning now to a discussion of a kinematic model used to calculate a relationship between a curvature of a path of travel of a trailer and the steering angle of a vehicle towing the trailer, a low order kinematic model can be desirable for a trailer backup assist system configured in accordance with some embodiments.\",\n \"To achieve such a low order kinematic model, certain assumptions are made with regard to parameters associated with the vehicle/trailer system.\",\n \"Examples of such assumptions include, but are not limited to, the trailer being backed by the vehicle at a relatively low speed, wheels of the vehicle and the trailer having negligible (e.g., no) slip, tires of the vehicle having negligible (e.g., no) lateral compliance, tires of the vehicle and the trailer having negligible (e.g., no) deformation, actuator dynamics of the vehicle being negligible, the vehicle and the trailer exhibiting negligible (e.g., no) roll or pitch motions.\",\n \"As shown in FIG.\",\n \"5, for a system defined by a vehicle 302 and a trailer 304, the kinematic model 300 is based on various parameters associated with the vehicle 302 and the trailer 304.These kinematic model parameters include: δ: steering angle at steered front wheels 306 of the vehicle 302; α: yaw angle of the vehicle 302; β: yaw angle of the trailer 304; γ: hitch angle (γ=β−α); W: wheel base of the vehicle 302; L: length between hitch point 308 and rear axle 310 of the vehicle 302; D: length between hitch point 308 and axle length 312 of the trailer 304 (axle length 312 may be an effective, or equivalent, axle length for a trailer having a multiple axle configuration; and r2: curvature radius for the trailer 304.The kinematic model 300 of FIG.\",\n \"5 reveals a relationship between trailer path radius of curvature r2 at the midpoint 314 of an axle 312 of the trailer 304, steering angle δ of the steered wheels 306 of the vehicle 302, and the hitch angle γ.\",\n \"As shown in the equation below, this relationship can be expressed to provide the trailer path curvature κ2 such that, if γ is given, the trailer path curvature κ2 can be controlled based on regulating the steering angle δ (where β is trailer yaw rate and η is trailer velocity).\",\n \"κ 2 - 1 r 2 - β • η • - ( W + KV 2 g ) sin γ + L cos γ tan δ D ( ( W + KV 2 g ) cos γ - L sin γ tan δ ) Or, this relationship can be expressed to provide the steering angle δ as a function of trailer path curvature κ2 and hitch angle γ. δ = tan - 1 ( ( W + KV 2 g ) [ κ 2 D cos γ - sin γ ] DL κ 2 sin γ + L cos γ ) = F ( γ , κ 2 , K ) Accordingly, for a particular vehicle and trailer combination, certain kinematic model parameters (e.g., D, W and L) are constant and assumed known.\",\n \"V is the vehicle longitudinal speed and g is the acceleration due to gravity.\",\n \"K is a speed dependent parameter which when set to zero makes the calculation of steering angle independent of vehicle speed.\",\n \"For example, vehicle-specific kinematic model parameters can be predefined in an electronic control system of a vehicle and trailer-specific kinematic model parameters can be inputted by a driver of the vehicle.\",\n \"Trailer path curvature κ2 is determined from the driver input via a trailer backup steering input apparatus.\",\n \"Through the use of the equation for providing steering angle, a corresponding steering command can be generated for controlling a steering system (e.g., an actuator thereof) of the vehicle.\",\n \"FIG.\",\n \"6 shown an example of a trailer path curvature function plot 400 for a rotary-type trailer backup steering input apparatus (e.g., the trailer backup steering input apparatus 125 discussed above in reference to FIGS.\",\n \"1 and 2).\",\n \"A value representing trailer path curvature (e.g., trailer path curvature κ2) is provided as an output signal from the rotary-type trailer backup steering input apparatus as a function of user input movement.\",\n \"In this example, a curve 402 specifying trailer path curvature relative to user input (e.g., amount of rotation) at a rotary input device (e.g., a knob) is defined by a cubic function.\",\n \"However, a skilled person will appreciate that embodiments of the disclosed subject matter are not limited to any particular function between a magnitude and/or rate of input at a trailer backup steering input apparatus (e.g., knob rotation) and a resulting trailer path curvature value.\",\n \"Jackknife Detection Referring to FIG.\",\n \"5, in preferred embodiments of the disclosed subject matter, it is desirable to limit the potential for the vehicle 302 and the trailer 304 to attain a jackknife angle (i.e., the vehicle/trailer system achieving a jackknife condition).\",\n \"A jackknife angle γ(j) refers to a hitch angle γ that while backing cannot be overcome by the maximum steering input for a vehicle such as, for example, the steered front wheels 306 of the vehicle 302 being moved to a maximum steered angle δ at a maximum rate of steering angle change.\",\n \"The jackknife angle γ(j) is a function of a maximum wheel angle for the steered wheel 306 of the vehicle 302, the wheel base W of the vehicle 302, the distance L between hitch point 308 and the rear axle 310 of the vehicle 302, and the length D between the hitch point 308 and the effective axle 312 of the trailer 304 when the trailer has multiple axles.\",\n \"The effective axle 312 may be the actual axle for a single axle trailer or an effective axle location for a trailer with multiple axles.\",\n \"When the hitch angle γ for the vehicle 302 and the trailer 304 achieves or exceeds the jackknife angle γ(j), the vehicle 302 must be pulled forward to reduce the hitch angle γ.\",\n \"Thus, for limiting the potential for a vehicle/trailer system attaining a jackknife angle, it is preferable to control the yaw angle of the trailer while keeping the hitch angle of the vehicle/trailer system relatively small.\",\n \"Referring to FIGS.\",\n \"5 and 7, a steering angle limit for the steered front wheels 306 requires that the hitch angle γ cannot exceed the jackknife angle γ (j), which is also referred to as a critical hitch angle.\",\n \"Thus, under the limitation that the hitch angle γ cannot exceed the jackknife angle γ (j), the jackknife angle γ (j) is the hitch angle γ that maintains a circular motion for the vehicle/trailer system when the steered wheels 306 are at a maximum steering angle δ(max).\",\n \"The steering angle for circular motion with hitch angle is defined by the following equation.\",\n \"tan δ max = w sin γ max D + L cos γ max Solving the above equation for hitch angle allows jackknife angle γ(j) to be determined.\",\n \"This solution, which is shown in the following equation, can be used in implementing trailer backup assist functionality in accordance with the disclosed subject matter for monitoring hitch angle in relation to jackknife angle.\",\n \"cos γ _ = - b ± b 2 - 4 a c 2 a where, a=L2 tan2 δ(max)+W2; b=2 LD tan2 δ(max); and c=D2 tan2 δ(max)−W2.In certain instances of backing a trailer, a jackknife enabling condition can arise based on current operating parameters of a vehicle in combination with a corresponding hitch angle.\",\n \"This condition can be indicated when one or more specified vehicle operating thresholds are met while a particular hitch angle is present.\",\n \"For example, although the particular hitch angle is not currently at the jackknife angle for the vehicle and attached trailer, certain vehicle operating parameters can lead to a rapid (e.g., uncontrolled) transition of the hitch angle to the jackknife angle for a current commanded trailer path curvature and/or can reduce an ability to steer the trailer away from the jackknife angle.\",\n \"One reason for a jackknife enabling condition is that trailer curvature control mechanisms (e.g., those in accordance with the disclosed subject matter) generally calculate steering commands at an instantaneous point in time during backing of a trailer.\",\n \"However, these calculations will typically not account for lag in the steering control system of the vehicle (e.g., lag in a steering EPAS controller).\",\n \"Another reason for the jackknife enabling condition is that trailer curvature control mechanisms generally exhibit reduced steering sensitivity and/or effectiveness when the vehicle is at relatively high speeds and/or when undergoing relatively high acceleration.\",\n \"Jackknife Countermeasures FIG.\",\n \"8 shows a method 500 for implementing jackknife countermeasures functionality in accordance with an embodiment of the disclosed subject matter for a vehicle and attached trailer.\",\n \"Trailer backup assist functionality in accordance with the disclosed subject matter can include jackknife countermeasures functionality.\",\n \"Alternatively, jackknife countermeasures functionality in accordance with one embodiment can be implemented separately from other aspects of trailer backup assist functionality.\",\n \"The method 500 begins when operation 502 is performed for receiving jackknife determining information characterizing a jackknife enabling condition of the vehicle-trailer combination at a particular point in time (e.g., at the point in time when the jackknife determining information was sampled).\",\n \"Examples of the jackknife determining information includes, but are not limited to, information characterizing a hitch angle, information characterizing a vehicle accelerator pedal transient state, information characterizing a speed of the vehicle, information characterizing longitudinal acceleration of the vehicle, information characterizing a brake torque being applied by a brake system of the vehicle, information characterizing a powertrain torque being applied to driven wheels of the vehicle, and information characterizing the magnitude and rate of driver requested trailer curvature.\",\n \"The operation 502 for receiving jackknife determining information can be the first operation in a sampling process where jackknife determining information is sampled upon initiation of an instance of implementing jackknife countermeasures functionality.\",\n \"In this regard, jackknife determining information would be continually monitored such as, for example, by an electronic control unit (ECU) that carries out trailer backup assist (TBA) functionality.\",\n \"As discussed above in reference to FIG.\",\n \"5, a kinematic model representation of the vehicle and the trailer can be used to determine a jackknife angle for the vehicle-trailer combination.\",\n \"However, the disclosed subject matter is not unnecessarily limited to any specific approach for determining the jackknife angle.\",\n \"After receiving the jackknife determining information, an operation 504 is performed for assessing the jackknife determining information for determining if the vehicle-trailer combination attained the jackknife enabling condition at the particular point in time.\",\n \"The objective of the operation 504 for assessing the jackknife determining information is determining if a jackknife enabling condition has been attained at the point in time defined by the jackknife determining information.\",\n \"If it is determined that a jackknife enabling condition is not present at the particular point in time, the method 500 returns to the operation 502 for receiving another instance of the jackknife determining information.\",\n \"If it is determined that a jackknife enabling condition is present at the particular point in time, an operation 506 is performed for determining an applicable countermeasure or countermeasures to implement.\",\n \"Accordingly, in some embodiments, an applicable countermeasure will be selected dependent upon a parameter identified as being a key influencer of the jackknife enabling condition.\",\n \"However, in other embodiments, an applicable countermeasure will be selected as being most able to readily alleviate the jackknife enabling condition.\",\n \"In still other embodiment, a predefined countermeasure or predefined set of countermeasures may be the applicable countermeasure(s).\",\n \"The objective of a countermeasure in the context of the disclosed subject matter (i.e., a jackknife reduction countermeasure) is to alleviate a jackknife enabling condition.\",\n \"To this end, such a countermeasure can be configured to alleviate the jackknife enabling condition using a variety of different strategies.\",\n \"In a vehicle speed sensitive countermeasure strategy, actions taken for alleviating the jackknife enabling condition can include overriding and/or limiting driver requested trailer radius of curvature (e.g., being requested via a trailer backup steering input apparatus configured in accordance with the disclosed subject matter) as a function of vehicle speed (e.g., via a lookup table correlating radius of curvature limits to vehicle speed as shown in FIG.\",\n \"6).\",\n \"In a countermeasure strategy where trailer curvature requests are limited as a function of speed and driver curvature command transient rates, actions taken for alleviating the jackknife enabling condition can include rate limiting trailer curvature command transients as requested by a driver above a predefined vehicle speed whereas, under the predefined vehicle speed, the as-requested trailer curvature are not rate limited.\",\n \"In a torque limiting countermeasure strategy, actions taken for alleviating the jackknife enabling condition can include application of full available powertrain torque being inhibited when the jackknife enabling condition is present while the vehicle is above a predefined speed and application of full available powertrain torque being allowed when the vehicle speed is reduced below the predefined speed while in the torque inhibiting mode.\",\n \"As opposed to a fixed predefined speed, the torque limiting countermeasure strategy can utilize a speed threshold that is a function of hitch angle (i.e., speed threshold inversely proportional to hitch angle acuteness).\",\n \"In a driver accelerator pedal transient detection countermeasure strategy, actions taken for alleviating the jackknife enabling condition can include overriding and/or limiting driver requested trailer radius of curvature as a function of transient accelerator pedal requests (e.g., requested trailer radius of curvature limited when a large accelerator pedal transient is detected).\",\n \"In a hitch angle rate sensitive countermeasure strategy, actions taken for alleviating the jackknife enabling condition can include using hitch angle rate in a predefined or calculated mapping with current hitch angle position to limit driver requested trailer radius of curvature.\",\n \"Accordingly, in view of the disclosures made herein, a skilled person will appreciate that embodiments of the disclosed subject matter are not unnecessarily limited to a countermeasure strategy of any particular configuration.\",\n \"As disclosed above, implementation of trailer backup assist functionality in accordance with the disclosed subject matter can utilize a kinematic model for determining steering control information, jackknife enabling conditions, and jackknife angle.\",\n \"Such a kinematic model has many parameters than can influence trailer curvature control effectiveness.\",\n \"Examples of these parameters include, but are not limited to, the vehicle wheelbase, understeer gradient gain, vehicle track width, maximum steer angle at the vehicle front wheels, minimum turning radius of vehicle, maximum steering rate able to be commanded by the steering system, hitch ball to trailer axle length, and vehicle rear axle to hitch ball length.\",\n \"Sensitivity analysis for a given kinematic model can be used to provide an understanding (e.g., sensitivity) of the relationships between such parameters, thereby providing information necessary for improving curvature control performance and for reducing the potential for jackknife enabling conditions.\",\n \"For example, through an understanding of the sensitivity of the parameters of a kinematic model, scaling factors can be used with speed dependent jackknife countermeasures to reduce jackknife potential (e.g., for special applications such as short wheelbase conditions).\",\n \"Still referring to FIG.\",\n \"8, after determining the applicable countermeasure(s), an operation 508 is performed for implementing the chosen jackknife countermeasure(s) and an operation 510 is performed for initiating a jackknife warning.\",\n \"As discussed above in regard to countermeasure strategies, implementing the jackknife countermeasure(s) can include commanding a speed controlling system of the vehicle to transition to an altered state of operation in which a speed of the vehicle is reduced, commanding the steering control system of the vehicle to transition to an altered state of operation in which a radius of curvature of a path of the trailer is increased, command the steering control system of the vehicle to transition to an altered state of operation in which a decrease in the radius of the curvature of the path of the trailer is inhibited, commanding a brake control system of the vehicle to apply brake torque to reduce vehicle speed/inhibit vehicle acceleration, and/or commanding a powertrain control system of the vehicle to inhibit full available powertrain torque from being delivered to driven wheels of the vehicle until another jackknife enabling parameter (e.g., vehicle speed) is below a defined threshold.\",\n \"In certain embodiments of the disclosed subject matter, the jackknife warning is provided to the driver using at least one vehicle control system through which the jackknife countermeasure is implemented.\",\n \"Speed reduction, in addition to applying the brakes, can be accomplished by any number of means such as, for example, limiting throttle inputs (e.g., via a terrain management feature) and/or transitioning a transmission to a reverse low gear if the vehicle is equipped with a multi-range reverse gear transmission.\",\n \"Examples of such system-specific warning approach include, but are not limited to, providing a warning through an accelerator pedal of the vehicle (e.g., via haptic feedback) if the countermeasure includes limiting speed of the vehicle and/or providing a warning through an input element (e.g., knob) of a trailer backup steering input apparatus of the vehicle (e.g., via haptic feedback if the countermeasure includes limiting driver requested trailer radius of curvature), through haptic seat vibration warning, through a visual warning (e.g., through a visual display apparatus of the towing vehicle) and/or through audible warnings (e.g., through an audio output apparatus of the towing vehicle), or the like.\",\n \"One embodiment of utilizing warnings relating to vehicle speed as it relates to onset or presence of a jackknife enabling condition includes implementation of a dual stage warning.\",\n \"For example, when a backing speed of the vehicle increases sufficiently for causing a speed of the vehicle to reach a lower (i.e., first) speed threshold during backing of the trailer, a driver of the vehicle would be provided with a first warning indication (e.g., via haptic, audible, and/or visual means as implemented by the trailer backup assist system) for informing the driver that there is the need to reduce the speed of the vehicle to alleviate or preclude the jackknife enabling condition.\",\n \"If the driver does not correspondingly respond by causing a speed of the vehicle to be reduced (or not to further increase) and the vehicle continues to gain speed such that it passes a higher (i.e., a second) speed threshold, the driver of the vehicle would be provided with a second warning indication (e.g., a more severe haptic, audible, and/or visual means as implemented by the trailer backup assist system) for informing the driver that there is an immediate need to reduce the speed of the vehicle to alleviate or preclude the jackknife enabling condition.\",\n \"The first and/or the second speed indication warnings can be implemented in conjunction with a respective speed limiting countermeasure measures (e.g., the trailer backup assist system causing activation of a brake system of the vehicle and/or reducing a throttle position of the vehicle).\",\n \"Human Machine Interface In order to implement the control features discussed above with respect to methods described in FIG.\",\n \"5 and FIG.\",\n \"8, a driver must interact with the trailer backup assist system 105 to configure the system 105.The vehicle 100 is also equipped, as shown in FIG.\",\n \"9, with a human machine interface (HMI) device 102 to implement trailer backup assist functionality through driver interaction with the HMI device 102.FIG.\",\n \"9 shows an example of an HMI device 102 in the vehicle that a driver uses to interact with the trailer backup assist system 105.The driver is presented with multiple menus 104 (only one example menu is shown in FIG.\",\n \"9) displayed by way of the HMI 102.The HMI menus 104 assist the driver through modules (shown in FIGS.\",\n \"10 and 11) that setup 600, calibrate 700, and activate 800 the trailer backup assist system 105 so that control methods 200, 500 may be implemented to assist the driver with the backup of the trailer shown generally as a flow diagram in FIGS.\",\n \"10 and 11, and to be discussed in greater detail later herein.\",\n \"Each module is directed to particular elements, or features, which are used to configure the trailer backup assist system to accurately implement control methods 200, 500.While each module is described with reference to particular features of the disclosed subject matter, it should be noted that each module is not necessarily limited to the particular features described in the examples herein.\",\n \"It is possible to rearrange the modules or to replace elements or features of a module without departing from the scope of the disclosed subject matter.\",\n \"The trailer backup assist system 105 will guide a driver through the steps necessary to connect a trailer and attach a target.\",\n \"The driver may activate the setup by way of the backup steering input apparatus 125, for example by turning or pushing the rotary knob, or my merely making a selection for the trailer backup assist system from a menu on the HMI device 102.Referring to FIG.\",\n \"10, a driver initiates the trailer backup assist system through the trailer backup assist steering input apparatus.\",\n \"In the case of a rotary knob, the driver presses or rotates the knob to initiate the trailer backup assist system.\",\n \"The system will guide the driver through the steps of connecting 580 a compatible trailer 110.A compatible trailer is one that pivots at a single point relative to the vehicle and behind the rear axle of the vehicle.\",\n \"Once the system is selected by either the trailer backup steering input apparatus 125 or the HMI device 102, the system will guide the driver to prepare the vehicle and vehicle trailer combination as necessary.\",\n \"The vehicle 100 should be turned “on” and the vehicle 100 should be in “park” 590.In the event the vehicle 100 is on but is traveling at a speed that is greater than a predetermined limit, for example five miles per hour, the trailer backup assist system 105 will become inactive and inaccessible to the driver.\",\n \"The trailer backup assist system 105 setup module 600 will not begin or will be exited 585.If the type of trailer 110 selected by the driver is a trailer 110 that is not compatible with the trailer backup assist system 105, the setup module 600 will be exited 585 or will not begin.\",\n \"In the event, the trailer 110 is compatible with the trailer backup assist system 105, the setup module 600 verifies that the vehicle 100 gear shift mechanism is in “park.” Again, in the event the vehicle is not “on” and the gear shift mechanism is not on “park,” the setup module will not begin 585.Upon connection 580 of a compatible trailer 110, the vehicle 100 being “on” 590 and the vehicle 100 being in “park” 590, the HMI 102 will present a menu 104 that has a “Towing” mode option to be selected by the driver.\",\n \"The driver selects “Towing” mode and a menu 104 is presented that provides a “Trailer Options” selection.\",\n \"The driver then selects a “Trailer Options” mode from the “Towing” menu.\",\n \"The driver is prompted to either “add a trailer” or “select a trailer” from a menu 104 presented on the HMI device and the “Setup” module 600 has begun.\",\n \"For certain camera-based hitch angle detection systems, an operation 602 is performed wherein a warning menu may be presented to the driver, by way of the HMI, informing the driver that the trailer must be in a straight line, meaning there is no angle at the hitch between the vehicle and the trailer.\",\n \"The warning indicates that the driver may need to take corrective action, for example, pull the vehicle forward in order to align the trailer and the vehicle as required for the setup 600.A generic or static graphic may be presented by way of the HMI 102 to assist the driver in visually recognizing the alignment between the trailer 110 and the vehicle 100 that is necessary in order to properly setup and calibrate the trailer backup assist system 105.The driver applies any corrections 603 in that the driver makes any necessary adjustment he has been alerted to and indicates, by acknowledging that corrective actions have been applied 603 and that the trailer is in line with the vehicle.\",\n \"Other hitch angle detection systems may not need the driver to straighten the trailer during setup mode.\",\n \"To aid the driver in the setup process, the reverse back lights, or any other supplemental lighting that may be available on the vehicle, are illuminated 604.In the event the trailer is a new trailer, one that has not been attached to the vehicle before or has not been previously stored in the trailer backup assist system, the driver is presented 606 with an option to either name the trailer or select a previously stored trailer configuration.\",\n \"Naming the trailer 608 allows the trailer to be easily identified the next time it is attached to the vehicle so that the driver does not have to repeat the setup process.\",\n \"The driver either enters a unique name to identify the trailer that is to be stored in the trailer backup assist system or selects a previously stored trailer configuration associated with the attached trailer.\",\n \"The trailer backup assist system will not allow more than one trailer to have the same name.\",\n \"Therefore, if a driver attempts to name a trailer using a name that has already been applied to a previously stored trailer configuration, the HMI will display a message to the driver indicating so and requesting the driver enter a different name for the trailer configuration.\",\n \"In the case where a previously stored trailer configuration is available and selected 610 by the driver, certain steps in the setup process may be skipped.\",\n \"The following discussion is directed to a first time trailer configuration for a camera-based hitch angle detection system.\",\n \"The driver is instructed 612 to place a hitch angle target on the trailer that is used for calibration purposes.\",\n \"A generic static image may be displayed on the HMI that provides direction to the driver as to placement of a target on the trailer that is used for hitch angle detection.\",\n \"The target placement is dependent upon the type of trailer being towed and therefore, options may be presented to the driver to aid the driver in selecting an appropriate trailer type.\",\n \"The static image may indicate areas that are acceptable for target placement as well as areas that are unacceptable for target placement.\",\n \"The static image indicating the appropriate areas for attaching the target may be an overlay of the rear view of the trailer hitch.\",\n \"Once the driver attaches the target to the trailer and indicates by way of the HMI that the target has been attached to the trailer the setup mode provides 614 visual feedback to the driver identifying that the target has been located, or acquired.\",\n \"The driver acknowledges 616, by way of the HMI, that the target has been properly identified by the trailer backup assist system.\",\n \"Similarly, for a previously stored trailer configuration, the trailer will already have a target placed thereon.\",\n \"The trailer backup assist system will acquire the target and provide 614 visual feedback to the driver confirming acquisition of the target.\",\n \"In the event the target is not acquired 614 after a predetermined amount of time lapses, the driver is notified 618 of the need to reposition the target and presented with possible corrective measures that may be taken.\",\n \"Possible corrective measures may be presented to the driver such as cleaning the camera lens, cleaning the target, replacing the target if it has been damaged or faded, pulling the vehicle-trailer combination forward to improve lighting conditions around the camera and/or target, and moving the target to an acceptable location.\",\n \"The driver applies the necessary corrections 603.As mentioned above, some hitch angle detection systems may not require the driver to attach a target to the trailer during set up mode.\",\n \"The target and acquisition of the target are directed to camera-based hitch angle detection systems.\",\n \"When the target is acquired 614 by the trailer backup assist system and the driver has acknowledged 616 the acquisition, the driver is then prompted through a series of menus to input 620 trailer measurement information that may be stored in the trailer backup assist system for a trailer configuration that is to be associated with the named trailer.\",\n \"The next time the same trailer is attached to the vehicle, its unique trailer configuration will already be stored and progress through the setup module will be faster or, in some cases, may be skipped entirely.\",\n \"Generic static images may be displayed at the HMI screen in order to assist the driver with the measurement information.\",\n \"Visual examples, see FIG.\",\n \"12, may be provided to aid the driver in identifying the location on the vehicle, the trailer or between the vehicle and trailer that the driver is being prompted to enter.\",\n \"In addition, numerical limits for the driver entered measurements are set within the trailer backup assist system and may be displayed to the driver.\",\n \"The driver may be warned about entered measurements that exceed the numerical limits.\",\n \"Additionally, the measurement information requests that the driver is prompted to enter may be presented to the driver in the order that the measurements should be entered into the trailer backup assist system.\",\n \"It should be noted that while measurement information is discussed above as being entered by the driver, various methods of entering measurement information may also be employed without departing from the scope of the disclosed subject matter.\",\n \"For example, a system to automatically detect measurements using existing vehicle and trailer data including, but not limited to, vehicle speed, wheel rotation, steering wheel angle, vehicle to trailer relative angle, and a rate of change of the vehicle to hitch angle.\",\n \"Examples of the measurement information may include a horizontal distance from the rear of the vehicle to the center of a hitch ball, a horizontal distance from the rear of the vehicle to a center of the target, a vertical distance from the target to the ground, and a horizontal offset of the target from a centerline of the hitch ball.\",\n \"In the event the target is attached at other than the centerline of the hitch ball, then the trailer backup assist system must know which side of the vehicle the target is attached to, the passenger side or the driver side.\",\n \"A menu on the HMI may be presented for the driver to indicate passenger side or driver side for the placement of the target.\",\n \"The trailer backup assist system also needs to know the horizontal distance from the rear of the vehicle to a center of the axle or axles of the trailer.\",\n \"The measurements may be entered in either English or metric units.\",\n \"The driver is presented 622 with the option to revise any of the measurements before proceeding with the setup process.\",\n \"Otherwise, the setup module 600 is complete 624 and the calibration module 700 begins.\",\n \"The calibration module 700 is designed to calibrate the curvature control algorithm with the proper trailer measurements and calibrate the trailer backup assist system for any hitch angle offset that may be present.\",\n \"After completing the setup module 600, the calibration module begins 700 and the driver is instructed 702 to pull the vehicle-trailer combination straight forward until a hitch angle sensor calibration is complete.\",\n \"The HMI may notify 704 the driver, by way of a pop up or screen display that the vehicle-trailer combination needs to be pulled forward until calibration is complete.\",\n \"When calibration is complete, the HMI may notify 704 the driver.\",\n \"Any hitch angle offset value is stored 706 in memory, accessed as necessary by the curvature control algorithm, and the calibration module 700 ends 704.It should be noted that while hitch angle calibration is described above as may be requesting the driver pull forward information, various other methods of hitch angle calibration may also be employed without departing from the scope of the embodiment.\",\n \"Upon completion of the setup module 600 and the calibration module 700, the activation module 800 may begin.\",\n \"The activation module 800 is described with reference to FIG.\",\n \"11.The activation module 800 is designed to activate automatic steering of the vehicle during trailer backup assist operations.\",\n \"The driver is instructed 802 to place the vehicle in reverse.\",\n \"Upon activation of the trailer backup assist system, the steering system will not accept any steering angle commands from any source other than the trailer backup assist system 804.The trailer setup 600 and calibration 700 modules must be completed and a current hitch angle must be within a predetermined operating range for the trailer backup assist system 806.The vehicle speed must also be less than a predetermined activation speed 808.In the event any one, or all, of these conditions 804, 806, 808 are not met, the driver is prompted to apply a corrective measure 810.The driver must confirm 814 that the corrective action has been taken in order for the control module to begin.\",\n \"If a corrective action is taken, but the activation module deems it unacceptable, the driver will be instructed 810 to try another corrective action.\",\n \"For steering systems where the steering wheel is directly coupled to the steered wheels of the vehicle, the driver cannot engage with the steering wheel during trailer backup assist.\",\n \"If any steering wheel motion is obstructed, by the driver or otherwise, the trailer backup assist system will present instructions 810 to the driver to remove their hands from the steering wheel.\",\n \"Activation 800 will be suspended or discontinued until the obstruction is removed.\",\n \"If the vehicle speed exceeds a threshold speed or if the vehicle hitch angle is not acceptable, the driver will be prompted 810 to take corrective action.\",\n \"Until corrective action is taken, accepted and acknowledged, the activation 800 and control 200, 500 modules will be interrupted.\",\n \"When the driver moves the gear shift from “park” to “reverse” 802 and presses or turns a trailer backup steering input apparatus 125 a rear view camera image may appear in a display of the HMI.\",\n \"If at any time during the reversing process the hitch angle becomes too large for the system to control the curvature of the trailer, the TBA will provide a warning to the driver to pull forward to reduce the hitch angle.\",\n \"If at any time during the reversing process the system is unable to track the hitch angle target, the driver is presented with instructions to correct the problem.\",\n \"If at any time the vehicle speed exceeds that predetermined activation speed, the driver is visually and audibly warned to stop or slow down.\",\n \"When all of the conditions of the activation module are met and maintained, the control module may begin.\",\n \"The control module executes the directives described above with reference to FIGS.\",\n \"5 and 7.However, the activation module 800 includes a monitoring function 816 so that, if at any time during execution of the control module 200, 500 the control is interrupted, the driver is instructed to make necessary corrections.\",\n \"In the event any one of the necessary corrections is not made, the control of the vehicle by way of the trailer backup assist system will end.\",\n \"The driver may also intentionally end the control by exiting the system through a menu selection on the HMI or placing the vehicle in a gear setting that is other than park or reverse.\",\n \"Referring now to instructions processible by a data processing device, it will be understood from the disclosures made herein that methods, processes and/or operations adapted for carrying out trailer backup assist functionality as disclosed herein are tangibly embodied by non-transitory computer readable medium having instructions thereon that are configured for carrying out such functionality.\",\n \"The instructions are tangibly embodied for carrying out the method 200, 500, 600, 700 and 800 disclosed and discussed above and can be further configured for limiting the potential for a jackknife condition such as, for example, by monitoring jackknife angle through use of the equations discussed in reference to FIGS.\",\n \"5 and 7 and/or by implementing jackknife countermeasures functionality discussed above in reference to FIG.\",\n \"8.The instructions may be accessible by one or more data processing devices from a memory apparatus (e.g.\",\n \"RAM, ROM, virtual memory, hard drive memory, etc.\",\n \"), from an apparatus readable by a drive unit of a data processing system (e.g., a diskette, a compact disk, a tape cartridge, etc.)\",\n \"or both.\",\n \"Accordingly, embodiments of computer readable medium in accordance with the disclosed subject matter include a compact disk, a hard drive, RAM or other type of storage apparatus that has imaged thereon a computer program (i.e., instructions) configured for carrying out trailer backup assist functionality in accordance with the disclosed subject matter.\",\n \"In a preferred embodiment of the disclosed subject matter, a trailer backup assist control module (e.g., the trailer backup assist control module 120 discussed above in reference to FIG.\",\n \"1) comprises such a data processing device, such a non-transitory computer readable medium, and such instructions on the computer readable medium for carrying out trailer backup assist functionality (e.g., in accordance with the method 200 discussed above in reference to FIG.\",\n \"2) and/or the method 500 discussed above in reference to FIG.\",\n \"8 and/or the methods 600, 700 and 800 discussed above in reference to FIGS.\",\n \"10 and 11.To this end, the trailer backup assist control module can comprise various signal interfaces for receiving and outputting signals.\",\n \"For example, a jackknife enabling condition detector can include a device providing hitch angle information and hitch angle calculating logic of the trailer backup assist control module.\",\n \"A trailer backup assist control module in the context of the disclosed subject matter can be any control module of an electronic control system that provides for trailer backup assist control functionality in accordance with the disclosed subject matter.\",\n \"Furthermore, it is disclosed herein that such a control functionality can be implemented within a standalone control module (physically and logically) or can be implemented logically within two or more separate but interconnected control modules (e.g., of an electronic control system of a vehicle) In one example, trailer backup assist control module in accordance with the disclosed subject matter is implemented within a standalone controller unit that provides only trailer backup assist functionality.\",\n \"In another example, trailer backup assist functionality in accordance with the disclosed subject matter is implemented within a standalone controller unit of an electronic control system of a vehicle that provides trailer backup assist functionality as well as one or more other types of system control functionality of a vehicle (e.g., anti-lock brake system functionality, steering power assist functionality, etc.).\",\n \"In still another example, trailer backup assist functionality in accordance with the disclosed subject matter is implemented logically in a distributed manner whereby a plurality of control units, control modules, computers, or the like (e.g., an electronic control system) jointly carry out operations for providing such trailer backup assist functionality.\",\n \"Trailer Target Placement and Monitoring The vehicle trailer backup assist system may utilize a target placed on the trailer to serve as the hitch angle detection component 155.In doing so, the trailer backup assist system may employ information acquired via image acquisition and processing of the target for use in the hitch angle detection apparatus 130, according to one embodiment.\",\n \"According to other embodiments, the target may be used to identify if a connected trailer has changed, trailer connection or disconnection, and other trailer related information.\",\n \"The target is an identifiable visual target that can be captured in an image by the video imaging camera and detected and processed via image processing.\",\n \"According to one embodiment, the target may include an adhesive target, also referred to as a sticker, that may be adhered via adhesive on one side onto the trailer, preferably within a target placement zone, such that the camera and image processing may detect the target and its location on the trailer to determine trailer related information, such as the hitch angle between the trailer and the towing vehicle.\",\n \"The trailer backup assist system may provide to the user one or more image(s) of the trailer target zone for proper placement of the target to assist with placement of the target on the trailer.\",\n \"Additionally, the vehicle trailer backup assist system may monitor the target to determine if the target has been correctly placed within a desired target placement zone and provide feedback alert(s) to the user.\",\n \"Further, the trailer backup assist system may monitor the trailer connection by monitoring the target to determine if the target has moved to determine whether the same trailer remains connected to the tow vehicle, and may initiate action in response thereto.\",\n \"Further, the trailer backup assist system may monitor the hitch angle or the target to determine if the trailer may have been changed out (i.e., disconnected and replaced with another trailer), and may initiate action in response thereto.\",\n \"Referring to FIG.\",\n \"13, the vehicle trailer backup assist system 105 is shown including the hitch angle detection apparatus 130 and a target monitor controller 10 for monitoring the target, assisting with placement of the target, monitoring connection of the trailer, determining if the trailer has moved, and initiating certain actions.\",\n \"The target monitor controller 10 may include a microprocessor 12 and/or other analog and/or digital circuitry for processing one or more routines.\",\n \"Additionally, the target monitor controller 10 may include memory 14 for storing one or more routines including image processing routine(s) 16, a target placement assist routine 900, a target monitoring routine 920, an initial setup for target moved detection routine 940, a target moved detection routine 960, and a trailer connection monitoring routine 990.It should be appreciated that the target monitor controller 10 may be a standalone dedicated controller or may be a shared controller integrated with other control functions, such as integrated with the hitch angle detection apparatus 130, to process the images of the trailer and target and perform related functionality.\",\n \"In one embodiment, the hitch angle detection apparatus 130 processes the acquired images of the target from the target monitor controller 10 and other information such as trailer length for use in determining the hitch angle between the trailer and the towing vehicle.\",\n \"A camera 20 is shown as an input for providing video images to the target monitor controller 10 of the vehicle trailer backup assist system 105.The camera 20 may be a rearview camera mounted on the tow vehicle in a position and orientation to acquire images of the trailer towed by the vehicle rearward of the vehicle.\",\n \"The camera 20 may include an imaging camera that generates one or more camera images of the trailer including the region where a target placement zone is expected to be located on the trailer.\",\n \"The camera 20 may include a video imaging camera that repeatedly captures successive images of the trailer for processing by the target monitor controller 10.The target monitor controller 10 processes the one or more images from the camera 20 with one or more image processing routine(s) 16 to identify the target and its location on the trailer.\",\n \"The target monitor controller 10 further processes the processed images in connection with one or more of routines 900, 920, 940, 960 and 990.The trailer monitor controller 10 may communicate with one or more devices including vehicle exterior alerts 24 which may include vehicle brake lights and vehicle emergency flashers for providing a visual alert and a vehicle horn for providing an audible alert.\",\n \"Additionally, the trailer monitor controller may communicate with one or more vehicle human machine interfaces (HMIs) 25 including a vehicle display such as a center stack mounted navigation/entertainment display.\",\n \"Further, the trailer monitor controller 10 may communicate via wireless communication 22 with one or more handheld or portable devices 26, such as one or more smartphones.\",\n \"The portable device 26 may include a display 28 for displaying one or more images and other information to a user.\",\n \"The portable device 26 may display one or more images of the trailer and the target location within a desired target placement zone on display 28.In addition, the portable device 26 may provide feedback information about the vehicle target connection including visual and audible alerts.\",\n \"Referring to FIGS.\",\n \"14-17, the placement of the target 30 onto trailer 110 using the target monitor controller 10 processing the target placement assist routine 900 is illustrated according to one exemplary embodiment.\",\n \"In FIGS.\",\n \"14 and 15, a tow vehicle 100 is shown towing a trailer 110.The trailer 110 has a trailer hitch connector in the form of a coupler assembly 114 connected to a vehicle hitch connector in the form of a receiver hitch and ball 15.The coupler assembly 114 latches onto the hitch ball 15 to provide a pivoting ball joint.\",\n \"The trailer 110 is shown having a frame including a longitudinally extending bar or trailer tongue 112.A top horizontal surface of trailer tongue 112 is shown providing a desired target placement zone 32 for receiving the target 30.It should be appreciated that the trailer 110 may be configured in various shapes and sizes and may offer one or more other suitable target placement zones 32 for receiving the target 30.The target placement zone 32 defines the desired location for placement of the target 30.The vehicle 100 is equipped with a video imaging camera 20 shown located in an upper region of the vehicle tailgate at the rear of the vehicle 100.The video imaging camera 20 is elevated relative to the target placement zone(s) and has an imaging field of view and is located and oriented to capture one or more images of the trailer 110 including a region containing one or more desired target placement zone(s).\",\n \"It should be appreciated that one or more cameras may be located at other locations on the vehicle 100 to acquire images of the trailer 110 and the target placement zone(s) 32.In order to utilize a target on a trailer that is not currently equipped with a suitable pre-existing target, a user 2 may be instructed or directed to place the target 30 onto the trailer 110 within a desired target placement zone 32 so that the camera 20 may capture one or more images of the target 30 to determine trailer related information for the trailer backup assist system, such as hitch angle information for the hitch angle detection apparatus 130.In doing so, a user 2 may be prompted by an audible or visual message on an HMI such as the vehicle HMI 25 or portable device 26 to place the target 30 on the trailer 110.The vehicle HMI 25 may include visual and/or audible outputs generating instructions for proper target placement.\",\n \"To allow for efficient and proper placement of the target 30 onto the trailer 110, the trailer backup assist system employs a target placement assist method or routine 900 shown in FIG.\",\n \"17 that is processed by the target monitor controller 10.The target placement assist method 900 includes step 902 in which a user may connect a portable device having an image display to communicate with the vehicle.\",\n \"The user may connect the device electronically to the vehicle which can be achieved by way of a wireless protocol, according to one embodiment.\",\n \"The device may be a wireless device that may communicate via Wi-Fi, BLUETOOTH® or other wireless protocol.\",\n \"Alternatively, the device could be connected via a wired connection.\",\n \"Next, at step 904, the user initiates the hitch angle detection system setup which requires initiating the setup procedure for the hitch angle detection system.\",\n \"As part of this procedure, the user will be required to place a target onto the trailer of the vehicle within a target placement zone.\",\n \"At step 906, the system generates with the camera one or more images of the towed trailer which include a region where the desired target placement zone(s) is expected to be located.\",\n \"There may be more than one target placement zone and one zone may be preferred over another zone.\",\n \"At step 908, the system processes the generated images and determines the desired target placement zone on the trailer.\",\n \"The desired target placement zone may be determined based on camera location and orientation, desired distance of the target from the hitch connection and the physical structure of the trailer.\",\n \"At step 910, the system generates a target overlay on the one or more generated images.\",\n \"The target overlay is a visual indication of the desired location of the target within the target placement zone upon which the user is instructed to place the target.\",\n \"The target overlay may include border lines marking the target placement zone or other identifier.\",\n \"The target overlay may be shown by flashing colored (e.g., red) lines on a displayed image.\",\n \"Target overlays of a plurality target placement zones may be generated and shown.\",\n \"At step 912, the system communicates the one or more images and the target overlay to the vehicle's display and if connected in step 902, the user's display on the portable device by utilizing the wireless or wired connection.\",\n \"Next, at step 914, the user's display on the portable device displays an image of the target placement zone indicated by the target overlay.\",\n \"At step 916, the user is then prompted by an HMI to place the target on the trailer within the target placement zone with assistance from the displayed image and target overlay on the vehicle's display and/or the portable display.\",\n \"One example of a displayed image on the display 28 of a portable device 26 showing an overlay of the target location for the target to be placed on the trailer is illustrated in FIG.\",\n \"16.The image displayed on the display 28 includes an image of the trailer 110 as captured by the camera and further includes an overlay of the desired target placement zone 32.The user 2 may view the image on the display 28 of the portable device 28 to determine where to place the target relative to the trailer 110.In this example, the user may place the target 30 onto the target placement zone 32 as indicated by the target overlay.\",\n \"Placement of the target may be achieved by adhering a target sticker onto a surface of the trailer.\",\n \"As a result, the user may employ a portable device with a display, such as a phone, a tablet, or a computer to view the proper location for placement of the target on the trailer prior to and during application of the target onto the trailer.\",\n \"Accordingly, the target placement assist method 900 advantageously assists the user with placement of the target 30 onto the trailer 110 in a manner that is simple to use, accurate and efficient.\",\n \"The user 2 may easily transport a portable device having a display to communicate with the vehicle and view the correct placement location for the target prior to and during the target placement procedure without having to return to the vehicle or otherwise be prompted for target placement.\",\n \"The trailer backup assist system 105 further includes a target monitoring method or routine for monitoring placement of the target on the trailer and providing feedback to the user as to whether the target has been placed within a proper target placement zone.\",\n \"A user may place a target on the trailer in various ways.\",\n \"In some situations, the user may be prompted by the TBA system via a vehicle HMI to place a target on the trailer and may be given instructions as to the location.\",\n \"The user may employ the target placement assist method 900 to assist with placement of the target on the trailer.\",\n \"In other situations, the user may place the target on the trailer using their best judgment or following instructions printed on the target or packaging provided therewith.\",\n \"In any event, once the target is placed on the trailer, the target monitoring method 920 will monitor the location of the target relative to the trailer and provide feedback to the user as to correct or incorrect placement of the target on the trailer.\",\n \"The target monitoring method 920 is illustrated in FIG.\",\n \"18, according to one embodiment.\",\n \"At step 922, method 920 requires attaching the trailer to the vehicle onto the ball and hitch if it is not already attached.\",\n \"Next, at step 924, setup for the hitch angle detection is initiated.\",\n \"At step 926, the user is prompted via an interface to place the target on the trailer.\",\n \"The user may place a target on the trailer based on predefined criteria or the user's best judgment or knowledge, according to one embodiment.\",\n \"The user may be instructed on where to place the target on the trailer by use of a user's manual, an instruction sheet, or other visual or audible communication of instructions, according to other embodiments.\",\n \"Generally, the target should be placed in a region that is unobstructed from view by the camera and that allows for the acquisition of an image and determination of desired trailer related information, such as the hitch angle.\",\n \"Depending on the trailer configuration and camera orientation and height, the target may be required to be placed within a certain region of the trailer, within a distance range from the trailer hitch connection having a minimum distance from the hitch connection, such as 7 inches (17.78 centimeters), within a range from the tow vehicle bumper, and within a range of height from the ground.\",\n \"The target placement may require a location within a certain distance from a centerline of the longitudinal axis of the trailer, and may require a vertical or horizontal angle or some angle in between the vertical and horizontal positions.\",\n \"According to another embodiment, the user may utilize the target placement assist method 900 to place the target on the trailer.\",\n \"At step 928, the system generates one or more images of the target placement zone on the towed trailer.\",\n \"The system then processes the one or more images to determine the presence of a target within a desired target placement zone at step 930.The desired target placement zone may be determined by criteria, such as distance from the trailer hitch connection formed by the coupler assembly 114, distance from a centerline of the longitudinal axis of the trailer, height of the camera relative to the trailer, and distance of the camera from the trailer.\",\n \"At decision step 932, method 900 determines if the target has been detected by the processed image(s) and, if not, returns to step 926 to prompt the user via an HMI to place the target on the trailer.\",\n \"If the target has been detected by the processed images, the vehicle trailer backup assist system provides a feedback alert to the user at step 934.The feedback alert may include one or more of vehicle exterior alerts including visual alerts, such as flashing the vehicle brake lights and/or flashing the vehicle emergency flashers, and/or audible alerts, such as sounding the vehicle horn.\",\n \"Additionally, the feedback alerts may include providing a message via the portable device 26, providing an audible tone via the portable device 26 or a visual lighted indication via the portable device 26.Further, feedback alerts may include sending a text message or audible instructions to a user via a portable device, such as a phone or computer.\",\n \"It should be appreciated that other vehicle exterior and alternative feedback alerts may be communicated to the user to indicate that proper placement of the target has been detected on the trailer.\",\n \"Alternatively, the feedback alerts could be used to indicate improper placement of the target on the trailer.\",\n \"Once the trailer is properly equipped with the target in the proper location, the trailer backup assist system may process information by monitoring the target to determine the hitch angle and other trailer towing related functionality.\",\n \"The target 30 may include a sticker having adhesive on the bottom surface and a predetermined image pattern of a certain size and shape provided on the top surface for capture by the video camera and recognition by the image processing.\",\n \"The target 30 may have a rectangular shape, according to one embodiment, and may have a camera image recognizable pattern such as the checker pattern shown.\",\n \"The image processing may include known image pattern recognition routines for identifying a target pattern and its location on a trailer.\",\n \"However, it should be appreciated that other target shapes, sizes and patterns may be employed.\",\n \"It should further be appreciated that the target may otherwise be connected to the trailer using connectors, such as fasteners, which may connect to the trailer or to an attachment to the trailer.\",\n \"It should further be appreciated that the target can be attached via magnet, glued on, painted on, or any number of other suitable means.\",\n \"It should be appreciated that not all trailers are necessarily configured to provide a well-suited location for placement of a target sticker on the trailer.\",\n \"Accordingly, a target location may be added to a given trailer by use of a target mounting system 40 as shown in FIGS.\",\n \"19 and 20, according to one embodiment.\",\n \"The target mounting system 40 is shown installed onto trailer 110 to present a target 30 that is viewable by the camera within a desired target placement zone.\",\n \"The target mounting system 40 includes a vertical mounting post or bracket 44 having a plurality of bolt receiver holes 46 extending vertically to allow for a desired vertical height adjustment.\",\n \"The bracket 44 may be assembled onto the trailer via holes 54 using bolts 48, washers 52 and nuts 50.The height of the bracket 44 may be adjusted depending on which holes 46 are aligned with the trailer holes 54.Mounted to the top of the bracket 44 is a target plate 42 having a top target placement zone 32 onto which the target 30 is located.\",\n \"The plate 42 likewise has a plurality of holes 46 that align horizontally with the holes in the bracket 44 and may be assembled thereto via bolts 48, washers 52 and nuts 50.Accordingly, the plate 42 may be adjusted both vertically and horizontally to a desired position so as place the target 30 adjustably within a desired location so that the target is easily acquired by the camera and processed by the image processing.\",\n \"It should be appreciated that assistance in mounting the target mounting system 40 along with the target 30 and verification of proper location of the target mounting system 40 and target 30 may be achieved by utilizing the target placement assist method 900 and target monitoring method 920 discussed above.\",\n \"The target moved detection method includes an initial setup routine 940 and subsequent processing routine 960 for target moved detection used for prompting the entry of trailer information.\",\n \"The target moved detection method determines if the location of a hitch angle target on a trailer, such as a trailer tongue, has moved and may also determine if the distance has changed.\",\n \"Images of the target in a previously stored image and a newly acquired image are compared to determine if the location and/or distance to the target has changed.\",\n \"The comparison may include comparing camera image pixel sizes of the images.\",\n \"If either the location or the distance changes, the user is then prompted by an HMI to reenter new trailer information for subsequent processing of the trailer backup assist system.\",\n \"The initial setup routine 940 is illustrated in FIG.\",\n \"21.Initially, the trailer must be attached to the vehicle at step 942.At step 944, the attached trailer is setup for hitch angle tracking.\",\n \"For a vision-based system, this may include applying a target sticker to the trailer, such as in the vicinity of the tongue of the trailer, so that the vehicle-based camera can detect motion of the target as the trailer maneuvers and swings around curves.\",\n \"In addition, a number of parameters associated with the location of the target that are used to properly calculate the hitch angle based on the vision processing may be entered.\",\n \"These parameters may include the distance of the target to the ground and the distance from the target to the bumper of the vehicle.\",\n \"At step 946, the vehicle and the trailer are directed to be driven straight, which may be achieved by driving the vehicle and towed trailer in the forward direction.\",\n \"This is to ensure that there is about zero hitch angle between the vehicle and trailer with the trailer in-line with the vehicle and that the image generated in subsequent steps will be taken in the same orientation and will be valid for image comparisons.\",\n \"At step 948, a picture (image) of the target and trailer are acquired with the use of the camera while the vehicle and the trailer are in a straight line at a hitch angle of about zero degrees.\",\n \"At step 950, the image processing performs vision processing on the image.\",\n \"The vision processing may first detect a target and then compute the size and location of the target based on processing the pixels of the image.\",\n \"At step 952, the image acquired in step 948 is stored in memory and the information calculated in step 950 is stored in memory.\",\n \"The image and calculated information are then subsequently used to determine if the target has moved.\",\n \"If the target has moved, the system may assume that the trailer may have been changed or replaced with a different trailer, and hence prompts the user via an HMI to enter trailer information.\",\n \"Referring to FIG.\",\n \"22, the target moved detection routine 960 is shown beginning at step 962 in which the driver is instructed to reattach to the vehicle a trailer that was previously set up and used in the initial setup routine 940.At step 964, the user is prompted by the hitch angle detection system to select the trailer that was previously setup and stored, rather than selecting a new trailer.\",\n \"At step 966, the user is prompted to drive the trailer and vehicle combination forward in a straight line to achieve a hitch angle of about zero degrees.\",\n \"Next, at step 968, a new image of the target and the trailer are acquired by the camera.\",\n \"At step 970, vision processing is performed on the image to detect the target and compute the size and location of the target by processing the pixels of the image.\",\n \"At step 972, the target location and size as calculated above are compared to the location and size of the target taken in the prior image from the initial setup.\",\n \"At step 974, a determination is made to determine if the new target information is a match or within tolerance of the original target information.\",\n \"If the newly acquired target is still a similar size and in the similar location on the image as compared to the prior image from the initial setup, then the target is likely to be in the same location and will allow for a proper hitch angle detection if determination of such is made in step 980.If the target has a different location or has a different size, then the target is presumed to have moved and routine 960 proceeds to step 976.Detected movement of the target may occur when the trailer is a different trailer as compared to the trailer last selected by the user.\",\n \"The use of the prior selected trailer configuration may provide erroneous results for hitch angle target tracking.\",\n \"As such, method 960 proceeds to step 978 to prompt the user (e.g., driver) to reselect or re-setup the trailer configuration with new target and trailer information.\",\n \"Accordingly, the target moved detection routine 960 advantageously detects movement of the target which may indicate potential connection of a new trailer to the vehicle, such that the user is prompted via an HMI to select new trailer configuration information.\",\n \"Additionally, the target moved routine could also detect that a target has moved due to a different sized drawbar being installed than what was installed when the trailer was initially setup.\",\n \"Examples of images of the trailer and the target moved to a different position are illustrated in FIGS.\",\n \"23A and 23B.\",\n \"As shown in FIG.\",\n \"23A, an image of the trailer and the target 30 is shown aligned on the trailer in a first position as compared to the subsequent image in FIG.\",\n \"23B showing the target 30 moved to a new second closer position.\",\n \"The change in location of the target may be an indication that the trailer has been changed out with a new trailer or that the target has otherwise been moved on the trailer.\",\n \"When this occurs, the target move detection routine 960 requires the user to re-enter trailer configuration information so that the wrong information is not used to provide incorrect hitch angle data.\",\n \"Furthermore, it is possible that the right (correct) trailer has been selected and the target is still in the same location on the trailer, but the system still indicates that the target has moved.\",\n \"This could occur if the drawbar length on the vehicle has changed.\",\n \"Target monitor controller 10 further processes a trailer connection monitoring routine 990 to determine whether a trailer is connected to the vehicle and whether a new trailer may have been connected.\",\n \"When the trailer is disconnected from the vehicle, the target information and the hitch angle information may be unavailable for a period of time.\",\n \"Accordingly, the trailer connection monitoring method 990 monitors the availability of the hitch angle data and/or the detection of the target to determine if the hitch angle data or target data is lost for a substantial period of time.\",\n \"If this occurs, the driver is then prompted via an HMI to reselect the attached trailer or to re-enter trailer configuration data to ensure that the wrong trailer information is not employed.\",\n \"The trailer connection monitoring routine 990 is illustrated in FIG.\",\n \"24.At step 992, a trailer is connected to the vehicle.\",\n \"At step 994, the trailer is setup for hitch angle detection and monitoring.\",\n \"If a vision based system is employed, this may include placing a target on the trailer for the vision-based system to detect as well as entering pertinent parameters.\",\n \"Alternatively, if the trailer has been previously setup for hitch angle monitoring, it may be possible to select the previously stored setup configuration for that trailer.\",\n \"At step 996, once the trailer has been setup for hitch angle detection, the hitch angle detection system will continuously monitor the hitch angle or target.\",\n \"At decision step 998, routine 990 determines if the hitch angle or the target has been dropped for a time period greater than X seconds.\",\n \"Depending on the type of hitch angle system, the hitch angle signal may drop or become unavailable for different reason, but one potential reason is that the trailer has been disconnected from the vehicle.\",\n \"A disconnected trailer may also result in the target detection being unavailable.\",\n \"As such, a check is made to see how much time has expired since the hitch angle signal or target detected has been dropped.\",\n \"If the hitch angle or target detection has been dropped for a time period of less than X seconds, then routine 990 returns to track the hitch angle or target at step 996.If the hitch angle or target detection has been dropped for a time period greater than X seconds, then the user is prompted via an HMI to reselect or re-setup the trailer configuration in step 1000.The time period X is set to represent a reasonable amount of time needed to swap or change-out trailers.\",\n \"For example, for extremely small, lightweight trailers, it may be possible to swap trailers out in less than sixty (60) seconds, so this could be a reasonable time period.\",\n \"According to one embodiment, the time period X is set for thirty (30) seconds.\",\n \"While the hitch angle is monitored to determine disconnection of a trailer from the vehicle, it should be appreciated that the trailer connection monitoring routine 990 may monitor detection of the target as an alternative, such that if the target is no longer detected for X seconds, then the vehicle driver may be prompted to reselect or reconfigure the trailer.\",\n \"Supplemental Vehicle Lighting System As previously described, the trailer backup assist system 105 may employ a vision based target detection system, wherein the hitch angle detection component 155 is an identifiable visual target located on a trailer attached to a towing vehicle.\",\n \"The towing vehicle may be equipped with a rear view camera, which functions as the hitch angle detection apparatus 130, and is configured to image the target and process acquired image data to generate trailer related information used in a variety of applications associated with the trailer backup assist system 105.By following the previously described target placement assist method 900 and/or other suitable methods, a vision based target detection system can be readily configured for accurate target detection.\",\n \"Nevertheless, there may be some circumstances that hinder target detection accuracy.\",\n \"One such circumstance involves performing target detection under dark conditions when existing vehicle lights, such as taillights, provide insufficient target lighting.\",\n \"While aftermarket lighting assemblies are available, such assemblies may appear unsightly and may lack the ability to be integrated with the trailer backup assist system 105.Thus, it is desired to provide a supplemental vehicle lighting system that not only cooperates with the trailer backup assist system 105, but also confers a styling advantage to vehicles in which it is featured.\",\n \"As will be described in greater detail below, a supplemental vehicle lighting system is disclosed herein that utilizes an existing keylock hole of a rear vehicle closure member or other rear vehicle fixture.\",\n \"For purposes of illustration, FIG.\",\n \"25A exemplarily shows a tow vehicle 1005 having a rear vehicle closure member embodied as a tailgate 1010 that includes a keylock hole 1015 defined in a tailgate handle assembly 1020.As exemplarily shown in FIGS.\",\n \"25B-25D, the keylock hole 1015 is customarily used in conjunction with a corresponding keylock cylinder 1025 that includes a keyhole 1030 that is accessible through the keylock hole 1015.It should be appreciated that the keylock cylinder 1025 may be supported inside the tailgate 1010 in a variety of ways.\",\n \"For purposes of illustration, the keylock cylinder 1025 is shown engaged to protrusions 1035, 1038, and 1040 of the tailgate handle assembly 1020 and is secured to the tailgate handle assembly 1020 with mechanical fastener 1045.When a corresponding key is inserted into the keyhole 1030 and turned in the proper direction, a locking tab 1050 of the keylock cylinder 1025 is moved to an unlocked position to enable the tailgate 1010 to be lowered so that a rear vehicle cargo area can be accessed.\",\n \"While the rear closure member has been generally described herein as a tailgate 1010, it should be appreciated that the rear closure member may also include a liftgate, a trunk lid, a swing door, a sliding door, and the like, depending on the type and/or make of the selected vehicle 1005.Likewise, it should also be appreciated that the configuration and/or location of the keylock hole 1015 and keylock cylinder 1025 may vary across vehicle types and/or makes.\",\n \"Therefore, the keylock hole 1015 may be defined in other parts and/or areas of the rear vehicle closure member or in some other rear vehicle fixture altogether.\",\n \"While many current vehicles are equipped with a keylock hole and a keylock cylinder, seldom is a key used to unlock a rear vehicle closure member given the proliferation of vehicles having power lock systems or other means of entry.\",\n \"Thus, with respect to some vehicles, the inclusion of a keylock cylinder produces added cost and consumes space that could otherwise be used to implement other devices.\",\n \"Recognizing this, a supplemental vehicle lighting system is provided herein that advantageously replaces a keylock cylinder with a light assembly operably coupled to a rear keylock hole of a selected vehicle, through which the light assembly is able to illuminate a rear vehicle area.\",\n \"In so doing, little to no modification need be made to existing rear vehicle fixtures since the light assembly may be fashioned to be mounted to in the same way as the keylock cylinder.\",\n \"In this manner, vehicle manufacturers can offer vehicles equipped with a light assembly without having to perform substantial retooling.\",\n \"Similarly, an existing keylock cylinder may be easily swapped for a light assembly in vehicles desiring the benefits bestowed by the supplemental vehicle lighting system described herein.\",\n \"Referring to FIGS.\",\n \"26A-26D, a light assembly 1055 is shown according to one embodiment and includes a housing 1060 having an open top defined by an upper edge 1065.The light assembly 1055 also includes a barrel 1070 having a distal end 1075 and a proximal end 1080.A lighting device 1085 including one or more light emitting diodes (LEDs) 1087 is disposed inside the housing 1060 and is configured to emit light through the barrel 1070 beginning from the proximal end 1080.The barrel 1070 may be constructed from a reflective material to trap the emitted light inside the barrel 1070 as it propagates towards the distal end 1075 of the barrel 1070.The emitted light is then dispersed from the barrel 1070 via a lens 1090 that is coupled to the distal end 1075 of the barrel 1070.In the illustrated embodiment, the lens 1090 includes a first section 1091, a second section 1092, and an intermediate section 1093 therebetween.\",\n \"The second section 1092 is configured to be inserted into the barrel 1070 through the distal end 1075 such that the intermediate section 1093 abuts against the distal end 1075 and may be adhered thereto using an adhesive.\",\n \"In this arrangement, the first section 1091 is most distal to the lighting device 1085.Additionally, the first section 1091 may be curved and optically configured to disperse the emitted light in a variety of directions including a forward, upward, downward, and/or sideways direction.\",\n \"As best shown in FIGS.\",\n \"26C and 26D, the lighting device 1085 has an L-shaped configuration and is electrically coupled to an electrical connector 1095 provided at the bottom of the housing 1060.The lighting device 1085 includes a first end 1097 that abuts against the proximal end 1080 of the barrel 1070 and supports a heat sink board 1100 on which the LEDs 1087 are mounted.\",\n \"The lighting device 1085 also includes a plug 1102 disposed at a second end having pins 1107 that plug into a corresponding socket 1109 of the electrical connector 1095.To supply power to the lighting device 1085, the electrical connector 1095 may be configured to make an electrical connection with an onboard vehicle power source or other power source.\",\n \"To assist the heat sink board 1100 with heat dissipation, the light assembly 1055 may include a heat management member 1115 positioned proximate to the lighting device 1085.The heat management member 1115 may be a straight heat sink (as shown), or other heat sink type, such as, but not limited to, a pinned heat sink or a flared heat sink, and may be mounted to the upper edge 1065 of the housing 1060 via threaded fasteners 1120.Optionally, a thin plate 1122 may be provided for distributing the load of the threaded fasteners 1120.As shown in FIG.\",\n \"26C, the thin plate 1122 is contiguous with the upper edge 1065 of the housing 1060 and is disposed between the upper edge 1065 of the housing 1060 and the heat management member 1115.Referring to FIGS.\",\n \"27A and 27B, the light assembly 1055 is exemplarily shown mounted to the tailgate handle assembly 1020 previously shown in FIGS.\",\n \"25A-25D.\",\n \"The light assembly 1055 is configured to be engaged to protrusions 1035, 1038, and 1040 and is secured to the tailgate handle assembly 1020 with mechanical fastener 1045 to mirror the mounting scheme of the keylock cylinder 1025 previously shown in FIG.\",\n \"25D.\",\n \"In this manner, the keylock cylinder 1025 and light assembly 1055 are easily interchanged.\",\n \"However, it should be appreciated that other mounting schemes may be employed for mounting the light assembly 1055 to the tailgate handle assembly 1020 or other rear vehicle fixture.\",\n \"With respect to the presently illustrated embodiment, mounting of the light assembly 1055 to the tailgate handle assembly 1020 results in the intermediate section 1093 of the lens 1090 abutting against an interior surface 1125 of the tailgate handle assembly 1020.In this arrangement, the barrel 1070 is concentrically aligned with the keylock hole 1015 such that the first section 1091 of the lens 1090 at least partially coincides with the keylock hole 1015 while the tailgate handle assembly 1020 shields the rest of the light assembly 1055.Once the light assembly 1055 is secured, an electrical connection may be made between the electrical connector 1095 of the light assembly 1055 and a plug 1127 stemming from an onboard vehicle power supply or other power source such that power may be supplied to the lighting device 1085.In operation, the lighting device 1085 may be activated using a variety of means.\",\n \"For example, the lighting device 1085 may be manually activated via a user input mechanism, such as a button located on a human machine interface (e.g.\",\n \"HMI 102), or elsewhere in the selected vehicle.\",\n \"Additionally, or alternatively, the lighting device 1085 may be automatically activated via an onboard vehicle system such as the trailer backup assist system 105 and/or other vehicle system.\",\n \"For instance, when performing a backup maneuver, the trailer backup assist system 105 may activate the lighting device 1085 under dark conditions.\",\n \"In another instance, the lighting device 1085 may be automatically activated during set up of the trailer backup assist system 105, as described previously in step 604 of FIG.\",\n \"10.Referring to FIG.\",\n \"28, a supplemental vehicle lighting system 1130 is implemented in the vehicle 1005 previously shown in FIG.\",\n \"25A.\",\n \"For purposes of illustration, the vehicle 1005 features the trailer backup assist system 105 and employs vision based target detection.\",\n \"As shown, the vehicle 1005 is attached to a trailer 1135, which may be variously configured and may offer one or more suitable target placement zones for receiving a target 1140.In the illustrated embodiment, the target 1140 is placed on a trailer tongue 1145 of the trailer 1135 and is imaged by a rear view camera 1150 mounted in an upper region of the tailgate 1010.By virtue of its positioning in the tailgate 1010, the rear view camera 1150 is shown imaging a scene 1155 that is to the rear of the vehicle 1005 and points slightly downwards therefrom so that the target 1140 is present in the scene 1155.To assist the camera 1150 in accurately imaging the target 1140 in dark conditions, the light assembly 1055 described previously herein is mounted inside the tailgate 1010 and is operable to illuminate a rear vehicle area 1160 that includes the target 1140 and at least partially overlaps with scene 1155.With respect to the illustrated embodiment, it can be seen that the rear vehicle area 1160 can include the area behind a rear bumper 1165 of the vehicle 1005.Since the keylock hole 1015 is defined in the tailgate handle assembly 1020, the light assembly 1055 may be mounted to the tailgate handle assembly 1020 in the manner described in reference to FIG.\",\n \"27A or other suitable manner.\",\n \"Although the supplemental vehicle lighting system 1130 has been described herein as being featured in a tow vehicle 1005 generally embodied as a pickup truck, it should be appreciated that the supplemental vehicle lighting system 1130 may be featured in other tow and non-tow vehicles alike, which may include, but are not limited to, buses, sports utility vehicles, vans, station wagons, sedans, and coupes.\",\n \"Furthermore, while the supplemental vehicle lighting system 1130 is intended for use with the trailer backup assist system 105, it should be appreciated that the vehicle lighting system 1130 may additionally, or alternatively, be adapted for use with other vehicle related applications.\",\n \"For example, the additional lighting provided by the light assembly 1055 will enable a vehicle equipped with a rear view camera system to render clearer images on a display screen when it's dark outside.\",\n \"This may prove especially useful when performing a backup maneuver in low visibility situations.\",\n \"At the most basic level, the supplemental vehicle lighting system 1130 may simply be used as a utility light.\",\n \"For example, the light assembly 1055 may be activated to aid an operator with attaching/detaching a trailer to/from a tow vehicle in low light conditions.\",\n \"Secondary Hitch Angle Sensor System For the trailer backup assist system 105, as previously described, it is advantageous to use information that is representative of an angle between the vehicle and a trailer attached to the vehicle, also known as the hitch angle γ or trailer angle.\",\n \"In addition to the trailer backup assist system 105, it is contemplated that other vehicle systems may utilize hitch angle information as an input to the system, whereby the hitch angle information may be manipulated by a controller or microprocessor associated with the vehicle 100.In some embodiments, a measured hitch angle γ(m) may not provide an accurate measurement of the actual hitch angle γ(a) to a requesting system, which may introduce a potential for inadequate or improper vehicle system control, especially in situations where the hitch angle information may be important to the vehicle system being controlled, such as the trailer backup assist system 105.Furthermore, as previous mentioned, the hitch angle signal may drop-out or become unavailable for different reasons, such as the hitch angle detection apparatus 130 momentarily being unable to sense the relative position of trailer 110, or more specifically, the camera 20 being unable to track the hitch angle target 30 or other hitch sensors, such as a potentiometer, magnetic, optical, or mechanical based sensors, being unable to provide a constant hitch angle measurement, which may similarly cause errors or other disruption in operating the trailer backup assist system 105.Accordingly, an accurate and consistent estimate of the actual hitch angle γ(a) is desired, including for a means to confirm the accuracy of a measured hitch angle γ(m).\",\n \"Referring to FIGS.\",\n \"29-31, a sensor system 1200 for estimating a hitch angle of a trailer 110 attached to a vehicle 100 is shown according to one embodiment, which includes a primary sensor 1202 having a camera 20 monitoring a target 30 on the trailer 110 to determine a measured hitch angle γ(m) and a secondary sensor 1204 that monitors the trailer 110 to determine an indicator 1206 of the actual hitch angle γ(a).\",\n \"In this embodiment, the trailer backup assist system 105 operates the vehicle 100 when the measured hitch angle γ(m) correlates with the indicator 1206 of the actual hitch angle γ(a).\",\n \"This and other embodiments of the sensor system 1200 are described in more detail below.\",\n \"In the embodiment illustrated in FIG.\",\n \"29, the vehicle 100 is a pickup truck that employs vision based target detection as the primary sensor 1202 to determine the measured hitch angle γ(m).\",\n \"Accordingly, the primary sensor 1202 on the vehicle 100 includes a hitch angle detection apparatus 130 that has a camera 20 as an input for providing video images to a target monitor controller 10 of the primary sensor 1202.The camera 20 (e.g.\",\n \"video imaging camera) is located proximate an upper region of the vehicle tailgate at the rear of the vehicle 100, such that the camera 20 is elevated relative to the target placement zone(s) and has an imaging field of view located and oriented to capture one or more images of the trailer 110, including a region containing one or more desired target placement zone(s) 32.It should be appreciated that the camera 20 may include one or more video imaging cameras and may be located at other locations on the vehicle 100 to acquire images of the trailer 110 and the desired target placement zone(s) 32.As also shown in FIG.\",\n \"29, the tow vehicle 100 is pivotally attached to one embodiment of a trailer 110.The trailer 110 has a trailer hitch connector in the form of a coupler assembly 114 connected to a vehicle hitch connector in the form of a receiver hitch and ball 15.The coupler assembly 114 latches onto the hitch ball 15 to provide a pivoting ball joint connection 117.The trailer 110 is shown having a frame 1208 that includes a longitudinally extending bar or trailer tongue 112 that is coupled with opposing front frame members 1210 that angle laterally away from the trailer tongue 112 and extend rearward to couple with side frame members 1212 that extend longitudinally in parallel alignment and are supported by a rotatable wheel axle 1214 of the trailer 110.The forward facing surfaces of the trailer frame 1208, including the trailer tongue 112 and the front and side frame members, 1210, 1212 provide surfaces for the secondary sensor 1204 to monitor the position of the trailer 110.Again, it should be appreciated that the trailer 110 may be configured in various shapes and sizes, may include more than one axle, and may have additional or alternative surfaces for the secondary sensor 1204 (FIG.\",\n \"30) to monitor.\",\n \"With further reference to FIG.\",\n \"29, the vehicle 100 has additional onboard proximity sensors, including but not limited to, a reverse aid system 1220, a blind spot system 1216, and a cross traffic alert system 1218.In one embodiment, the reverse aid system 1220 includes a pair of energy transducers coupled with the rear of the vehicle 100 below the vehicle tailgate on opposing sides of the pivoting ball joint connection 117 between the vehicle 100 and the trailer 110.The energy transducers of the reverse aid system 1220, in the illustrated embodiment, comprise ultrasonic sensors that are directed rearward in the general vicinity of the trailer 110 for monitoring the position of the trailer 110 by measuring a difference in return signals from the ultrasonic sensors on opposing sides of the pivoting ball joint connection 117.The difference in the return signals is used to determine the indicator 1206 (FIG.\",\n \"30) of the actual hitch angle γ(a).\",\n \"The indicator 1206 may be a second measured hitch angle γ(m2), which can be used to define an acceptable tolerance range of hitch angles.\",\n \"The indicator 1206 may also be another conceivable type of indicator, as described in further detail herein.\",\n \"The reverse aid system 1220 may include additional sensors, including other types of sensors, such as radar sensors, located at several locations at the rear of the vehicle 100, such as laterally spaced along the bumper.\",\n \"The blind spot system 1216, according to one embodiment shown in FIG.\",\n \"29, includes an energy transducer 1222 coupled with each of the side rear view mirrors that generate a sensor field adjacent to the sides of the vehicle 100 and rearward therefrom in the general vicinity of the trailer 110.The energy transducers 1222 of the blind spot system 1216 may be ultrasonic sensors that monitor the general position of the trailer 110 to determine an indicator 1206 of the actual hitch angle γ(a).\",\n \"Accordingly, it is conceivable that the blind spot system 1216 may be used to determine when the trailer 110 is roughly centered behind the vehicle 100 or in line with the vehicle 100 when the return signals from both energy transducers 1222 are both low and/or relatively equal.\",\n \"Also, the blind spot system 1216 may provide an indicator 1206 (FIG.\",\n \"30) of the actual hitch angle γ(a) based on the magnitude of return signal from the respective energy transducer 1222 receiving the greater return signal.\",\n \"For instance, a set of ranges of ascending magnitudes may be set to correspond with a general hitch angle (e.g.\",\n \"10-20 Hz for 5 degrees, 20-30 Hz for 10 degrees, etc.)\",\n \"or ranges of hitch angles (e.g.\",\n \"0-40 degrees, 40-70 degrees, 70-100 degrees), such that the return signal may be an indicator 1206 (FIG.\",\n \"30) of the actual hitch angle γ(a) for use with the sensor system 1200 or for use as a primary sensor 1202 in an alternative embodiment.\",\n \"The cross traffic alert system 1218, as shown in FIG.\",\n \"29, also incorporates energy transducers 1224 on the rear of the vehicle 100 to generate sensor fields for monitoring the general position of the trailer.\",\n \"Specifically, the cross traffic alert system 1218 in the illustrated embodiment includes energy transducers 1224 comprising a pair of ultrasonic sensors directed rearward and laterally outward from the rear of the vehicle 100, such that the ultrasonic sensors may determine when the trailer 110 has reached a large hitch angle or is approaching a critical angle indicative of a jackknife condition or jackknife angle γ(j).\",\n \"In addition, the secondary sensor 1204 may comprise an auxiliary hitch angle sensor 1226 (FIG.\",\n \"30) attached to the trailer 110 and/or the vehicle 100, such as mechanical sensor mechanisms or other conceivable hitch angle sensors.\",\n \"It is also contemplated that any of the onboard proximity sensors (FIG.\",\n \"32), including, but not limited to, the reverse aid system 1220, blind spot system 1216, the cross traffic alert system 1218, and the auxiliary sensor 1226, may have an ultrasonic sensor, a radar sensor, or a combination of the two.\",\n \"These secondary sensors 1204 for determining the position of the trailer 30 may also include other cameras located on the vehicle, cameras located on the trailer, or other sensing devices generally understood by one having ordinary skill in the art.\",\n \"It is also conceivable that more than one onboard sensor system may be incorporated into the secondary sensor 1204, offering multiple individual sensors that contribute to the indicator 1206 of the actual hitch angle γ(a).\",\n \"Referring to FIG.\",\n \"30, the sensor system 1200 of the trailer backup assist system 105 (FIG.\",\n \"1) has the primary sensor 1202 for determining a first measured hitch angle γ(m) and the secondary sensor 1204 for determining an indicator 1206 of the actual hitch angle γ(a), such as a second measured hitch angle γ(m2).\",\n \"In one embodiment, the secondary sensor 1204 may be used in place of the primary sensor 1202 when the signal of the first measured hitch angle γ(m) becomes unavailable or unreliable, thereby using the second measured hitch angle γ(m2) in place of the first measured hitch angle γ(m).\",\n \"Additionally or alternatively, the secondary sensor 1204 may be used in conjunction with the primary sensor 1202 to confirm that the first measured hitch angle γ(m) correlates with the indicator 1206 of the actual hitch angle γ(a).\",\n \"In one embodiment, as described above, the primary sensor 1202 may include the hitch angle detection apparatus 130 and the target monitor controller 10 for monitoring the target 30 on trailer 110 to determine the first measured hitch angle γ(m).\",\n \"The secondary sensor 1204 includes a trailer monitoring apparatus 1228 and a trailer monitoring controller 1230 for monitoring the trailer 110 to determine the indicator 1206 of the actual hitch angle γ(a).\",\n \"The trailer monitoring controller 1230 may include a microprocessor 1232 and/or other analog and/or digital circuitry for processing one or more routines.\",\n \"Also, the trailer monitoring controller 1230 may include memory 1234 for storing one or more routines including sensor signal processing routines 1236 and hitch angle confirmation routines 1238.It should be appreciated that the trailer monitoring controller 1230 may be a standalone dedicated controller or may be a shared controller integrated with other control functions, such as integrated with the trailer monitoring apparatus 1228 and/or the primary sensor 1202, to process the return signals of the onboard proximity sensors or other secondary sensors and perform related functionality.\",\n \"The trailer monitoring controller 1230 illustrated in FIG.\",\n \"30 receives and processes return signals from at least one of the camera 20, the blind spot system 1216, the reverse aid system 1220, the cross traffic alert system 1218, and the auxiliary hitch angle sensor 1226, which may include additional processing from the trailer monitoring apparatus 1228.The secondary sensor 1204 processes the return signals to determine the indicator 1206 of the actual hitch angle γ(a), such as using the reverse aid system 1220 to determine a second measured hitch angle γ(m2) as the indicator 1206 and/or using the blind spot system 1216 to determine a range of hitch angles as the indicator 1206.The hitch angle confirmation routine 1238 further processes the indicator 1206 in connection with the first measured hitch angle γ(m) to determine if the first measured hitch angle γ(m) correlates with the indicator 1206.For instance, the indicator 1206 may include the second measured hitch angle γ(m2) that defines a tolerance range of acceptable hitch angles (e.g.\",\n \"+/−3 degrees of the second measured hitch angle, or a wider or narrower tolerance range), such that the first measured hitch angle γ(m) correlates with the indicator 1206 when the first measured hitch angle γ(m) is within the tolerance range.\",\n \"It is contemplated that in one exemplary embodiment, the hitch angle confirmation routine 1238 may also process the first measured hitch angle γ(m) to define an average measurement thereof over an interval of time (e.g.\",\n \"2 seconds, or a longer or shorter interval) to reduce instability and variance of the first measured hitch angle γ(m).\",\n \"As also illustrated in FIG.\",\n \"30, the sensor system 1200 may communicate with one or more devices including, the vehicle HMI 25, the vehicle exterior alerts 24, and the vehicle interior alerts 1240, which may include a blind spot indicator light 1242 that provides a visual alert.\",\n \"It is contemplated that the blind spot indicator light 1242 may be on an interior or exterior of the vehicle 100, such as on or proximate a side rear view mirror, to alert the driver that the primary sensor 1202 does not correlate with the indicator 1206 of the actual hitch angle γ(a), the trailer 110 is approaching or is in a jackknife condition, or other conceivable warnings that may not be able to be displayed on the center stack screen when reversing the vehicle 100.Additional warnings that may be provided with the blind spot indicator light 1242 include overspeed warning that alerts the driver that they are approaching a speed greater than the speed configured for operating the trailer backup assist system 105, a steering override warning that alerts the driver that steering has exceeded the acceptable steering torque configured for operating the trailer backup assist system 105, or an internal fault warning that alerts the driver that the trailer backup assist system 105 has become inoperative and has to canceled out for other conceivable errors.\",\n \"As previously described, the sensor system 1200 may communicate via wireless communication 22 to various types of mobile devices or via onboard communication to one or more vehicle human machine interfaces (HMIs) 25, including a vehicle display, such as a center stack mounted navigation/entertainment display.\",\n \"The method for estimating the actual hitch angle γ(a) using the sensor system 1200 of the trailer backup assist system 105 is illustrated in FIG.\",\n \"31 according to one embodiment.\",\n \"Initially, at step 202 the system may receive an initiation request to activate the trailer backup assist system 105 for tracking the hitch angle.\",\n \"Before proceeding to monitor the hitch angle, at step 1244 the system confirms that the attached trailer 110 has been calibrated and setup for operation with the trailer backup assist system 105, and if not, the calibration and setup process 600, 700 are initiated, as previously described.\",\n \"Although the calibration and setup processes 600, 700 may involve gathering the kinematic information for the attached trailer 110, at step 1246, the sensor system receives this information for use with the primary and/or secondary sensors 1202, 1204, if necessary.\",\n \"For instance, if a vision based target detection system is included as the primary sensor 1202, the kinematic information will provide parameters from the target setup information in addition to the input or otherwise determined dimensions of the trailer 110.The trailer kinematic information may also be used by the sensor system 1200 to modify the tolerance range of acceptable first measured hitch angles and to modify the magnitudes of sensor return signals or corresponding ranges of hitch angles.\",\n \"Still referring to FIG.\",\n \"31, once the trailer backup assist system 105 is generally setup and calibrated with the trailer 110 attached to the vehicle 100, at step 1248, an input is made with the input device, such as selecting the desired hitch angle between the vehicle 100 and trailer 110 by manipulating the steering input apparatus 125, as previously described.\",\n \"At step 1250, the sensor system 1200 begins to monitor the trailer 110 with the primary sensor 1202 to determine the first measured hitch angle γ(m) at step 1252.In conjunction with the operation of the primary sensor, at step 1254, the secondary sensor similarly monitors the trailer 110 to determine the indicator 1206 of the actual hitch angle γ(a) at step 1256.At step 1258, the first measured hitch angle γ(m) is compared with the indicator 1206 to determine if the measured hitch angle γ(m) of the primary sensor 1202 correlates therewith, and if so, thereby reflecting a generally accurate measurement of the actual hitch angle γ(a).\",\n \"If the measured hitch angle γ(m) is determined to not correlate with the indicator 1206, the user may be prompted at step 1260, such as being alerted with any of the interior or exterior alerts 1240, 24, being alerted and/or requested with the vehicle HMI to direct whether the trailer backup assist system 105 should proceed to operate the vehicle 100, and similarly being alerted and/or prompted with a mobile device via wireless communication 22, as described above.\",\n \"If the measured hitch angle γ(m) of the primary sensor 1202 correlates with the indicator 1206 of the actual hitch angle γ(a), then, at step 1262, the trailer backup assist system 105 may operate to achieve the desired input made with the input device, such as steering the vehicle 100 with the power-steering assist system 115 to achieve the desired hitch angle input with the steering input apparatus 125.While the illustrated embodiment of the sensor system 1200 includes a primary sensor 1202 and a secondary sensor 1204, it should be appreciated that the sensor system 1200 may include addition sensors (tertiary sensor, quaternary sensor, etc.)\",\n \"with additional corresponding indicators for confirming the accuracy of the indicator 1206 from the secondary sensor 1204 and the measured angle γ(m) from the primary sensor 1202.It is also be understood that the sensor system 1200 may additionally, or alternatively, be adapted for use with other vehicle related applications, such as trailer sway limiters or other conceivable applications relying upon the accuracy of the measured hitch angle γ(m).\",\n \"Hitch Angle Estimation and Verification According to an additional embodiment for estimating the actual hitch angle, a system uses an estimated distance between a wireless receiver on the vehicle and a wireless transmitter on the trailer.\",\n \"The wireless receiver on the vehicle is located at a predetermined distance from a trailer mount and the wireless transmitter on the trailer is located at an end of the trailer opposite the trailer mount.\",\n \"With respect to this embodiment, the system includes a controller for monitoring power returns of a signal transmitted from the transmitter to the receiver and for estimating the distance between the transmitter and the receiver as a function of a path loss propagation of the transmitted signal.\",\n \"The actual hitch angle is then estimated using the estimated distance, the predetermined distance, and a trailer length.\",\n \"Referring now to FIGS.\",\n \"32-34, one embodiment the system for estimating the actual hitch angle is shown to include a wireless receiver 1270 on a vehicle 100 with a trailer backup assist system 105.The wireless receiver 1270 is mounted at a known vehicle location, such as a central vehicle body position.\",\n \"In the illustrated embodiment, the vehicle 100 also has a controller 1272 for receiving information from the wireless receiver 1270, which may be a single centralized vehicle controller or a combination of controllers.\",\n \"The controller 1272 may be programmed to perform various functions and control various outputs and may have a memory 1274 associated therewith.\",\n \"The memory 1274 may store various parameters, thresholds, patterns, tables, or maps; for example, parameters may include known, fixed vehicle measurements such as wheel base, vehicle length, trailer length and distances from known parts of the vehicle.\",\n \"The controller 1272 receives information from a number of sensors on or around the vehicle 100 associated with one or more sensing systems 1276, which may include, but are not limited to, speed sensors, yaw rate sensor, lateral acceleration sensor, roll rate sensor, vertical acceleration sensor, a longitudinal acceleration sensor, a pitch rate sensor, and a steering angle position sensor.\",\n \"These sensors may also be part of an inertial measurement unit that would most likely be located at the center of the vehicle body.\",\n \"As shown in FIGS.\",\n \"32-33, a trailer 110 may be towed behind the vehicle 100.The trailer 110 may include a tongue 112 and trailer wheels, as well as a trailer brake and electrical components such as lights.\",\n \"A wiring harness 1278 may be used to couple the trailer 110 to the electrical system of the vehicle 100 and ultimately to the controller 1272.The trailer 110 is coupled to the vehicle 100, as by a hitch ball 15 or other mount on the vehicle 100, through a coupler assembly 114 located at the end of the trailer tongue 112.A distance dr defines a reference distance which is the distance between the wireless receiver 1270 on the vehicle 100 and the hitch ball 15 or other mount on the vehicle 100.This is a fixed distance and may be stored in memory 1274.The coupler assembly 114 may have a hitch angle sensor 1226 associated therewith.\",\n \"Alternatively, the hitch angle sensor 1226 may be associated with the mount on the vehicle 100.The hitch angle sensor 1226 is used to determine the angle position of the trailer 110 relative to the vehicle 100.Various types of hitch angle sensors, such as resistive, inductive, ultrasonic, or capacitive type sensors may be used, in addition to other hitch angle sensor system disclosed herein.\",\n \"A wireless transmitter 1280 is positioned on the trailer 110 at a known location, preferably at the end of the trailer.\",\n \"This wireless transmitter 1280 is in communication with the wireless receiver 1270 that is located on the vehicle 100.The wireless receiver 1270 has been placed at a known location of the vehicle 100 such that a reference distance, dr, from the receiver 1270 to the hitch ball 15 at the rear of the vehicle 100 is known and stored in memory 1274.Examples of wireless transmitting and receiving devices that may be used are Radio Frequency Identification (RFID), Bluetooth, and the like.\",\n \"As discussed above, the wireless receiver 1270 is positioned at a location on the vehicle 100 the predetermined distance, dr, from the vehicle's trailer mount or hitch ball 15.The wireless transmitter 1280 and the wireless receiver 1270 are compatible units that transmit and receive signals between the vehicle 100 and the trailer 110.The controller 1272 monitors the power returns of the transmitted signals.\",\n \"By monitoring the power returns of signals sent by the transmitter to the receiver, the controller 1272 may estimate a distance, d, between the vehicle 100 and the trailer 110.The disclosed subject matter also uses a trailer length, lT.\",\n \"This value may be a known value entered by the driver, stored in controller memory, or otherwise sensed, calculated or estimated.\",\n \"For example, an accurate estimate of trailer length, lT, is possible using measurements of the signal transmitted from the wireless transmitter 1280 on the trailer 110 to the wireless receiver 1270 on the vehicle 100 when the hitch angle is zero.\",\n \"It is also possible to estimate the trailer length when the measurements are taken while the vehicle yaw rate is zero for a predetermined period of time.\",\n \"The hitch angle is thereby estimated using the trailer length, lT, and path loss propagation of a signal transmitted from the transmitter on the trailer 110 to the receiver 1270 on the vehicle 100.The hitch angle estimate may then be used as an input for control algorithms associated with a variety of vehicle systems 1281 such as trailer sway, trailer backup assist, stability control and other systems.\",\n \"Alternatively, the hitch angle estimate may be used to verify, or validate, the measurement taken by a hitch angle sensor.\",\n \"Referring to FIG.\",\n \"33, a block diagram of a vehicle 100 and trailer 110 combination, where a hitch angle is non-zero, is shown with respect to the law of cosines: A2=B2+C2−2BC cos(a) The vehicle 100 has the trailer 110 attached thereto with the receiver 1270 located on the vehicle a predetermined reference distance, dr from the trailer hitch ball 15, which corresponds to B for the triangle reflecting the law of cosines in FIG.\",\n \"33.The trailer length, lT, is shown and the transmitter 1280 is located at the end of the trailer 110.The trailer length, lT, corresponds to C in the law of cosines.\",\n \"The distance, d, between the transmitter 1280 and the receiver 1270 is shown, which corresponds to A in the law of cosines.\",\n \"The reference distance, dr, is a known distance that may be stored in memory 1274.The trailer length, lT, may also be a known distance that is stored in memory 1274 or it may be estimated or calculated as described later herein.\",\n \"The distance, d, is calculated as described hereinafter with reference to FIG.\",\n \"34.Referring to FIG.\",\n \"34, a flow chart of the method 1282 for estimating a hitch angle in accordance with the disclosed subject matter is shown.\",\n \"The method 1282 can be carried out using the vehicle and trailer architecture discussed above in reference to the vehicle 100 and trailer 110 for FIG.\",\n \"32.Accordingly the hitch angle estimate may be supplied to any vehicle system 1281 requesting the information.\",\n \"An operation 1284 is performed for requesting hitch angle estimation.\",\n \"A request for hitch angle estimation may come from a vehicle control system 1281 that requires the information as an input to the control algorithm associated therewith or it may come from a control system 1281 that wants to validate or verify a hitch angle provided by a hitch angle sensor.\",\n \"Examples of vehicle control systems 1281 that may request hitch angle information may be a trailer backup assist system 105, a trailer sway control system, a trailer brake control system, and a vehicle dynamic control system such as roll stability control or yaw stability control.\",\n \"These are only a few examples of systems 1281 that may utilize hitch angle information as an input to a control algorithm.\",\n \"An operation 1286 is performed to monitor power returns of signals transmitted from the trailer 110 to the vehicle 100.Path loss is proportional to the square of the distance between the transmitter and the receiver and power returns of signals transmitted may be used to estimate a distance between the transmitter and the receiver.\",\n \"The power returns are measured, at the receiver, at predetermined time intervals and stored in controller memory over a predetermined period of time.\",\n \"The power returns may be accessed by the controller for various operations and/or functions that use the values to estimate hitch angle.\",\n \"An operation 1288 is performed to estimate the distance, d, between the transmitter and the receiver.\",\n \"Estimating the distance, d, between the wireless transmitter and the wireless receiver 1270 is accomplished by using the, measured power returns or measured path loss of the signal being transmitted.\",\n \"Path loss is proportional to the square of the distance between the transmitter and the receiver, and also to the square of the frequency of the transmitted signal.\",\n \"Signal propagation may be represented by Friis transmission formula: P r ( d ) = P t G t G t λ 2 ( 4 π ) 2 d 2 L where, Pt is the transmission power in Watts, Gt and Gr are gains associated with the receiver and the transmitter respectively, λ is the wavelength, L are system losses, and d is the distance between the transmitter and the receiver.\",\n \"Accordingly, transmission power decreases at a rate proportional to d2.Therefore, knowing the path loss, PL, associated with the transmitted signal will provide an estimate of the distance, d, between the transmitter and the receiver.\",\n \"Path loss (PL) is represented by the following equations: PL dB = 10 log P t P r = - 10 log ( G t G t λ 2 4 π 2 d 2 L ) PL dB = - 10 log ( G t G t λ 2 ( 4 π ) 2 L ) + 10 log ( d 2 ) PL dB = - 10 log ( G t G t λ 2 ( 4 π ) 2 L ) + 20 log ( d ) Pr decreases at a rate that is proportional to d2.The power of the signal received at the receiver may be represented as: P r ( d ) = P r ( d 0 ) ( d 0 d ) 2 for d > d 0 > d r The distance, d, may be derived from this formula and represents the overall distance between the transmitter on the trailer and the receiver on the vehicle.\",\n \"The distance, d0, is a known received power reference point and the distance, df, is a far-field distance.\",\n \"The reference distance, dr, is known.\",\n \"If the trailer length, lT is known, then an operation 1289, using the distance, d, the trailer length, lT, the known reference distance, dr, between the receiver and the trailer hitch, and the law of cosines, is performed to calculate the hitch angle.\",\n \"From the law of cosines, provided above, the hitch angle is given by: a = cos - 1 [ A 2 - B 2 - C 2 - 2 BC ] An operation 1290 is performed in which the vehicle system that is requesting the information receives the hitch angle estimation.\",\n \"The disclosed subject matter provides an estimate of hitch angle even when a hitch angle sensor is unavailable.\",\n \"If a system relies on a hitch angle sensor, the disclosed subject matter may provide verification, as a redundant sensor, that the hitch angle sensor is operating properly.\",\n \"As discussed above, the trailer length, lT, may be a known value stored in memory or it may be a value that is calculated according to the disclosed subject matter.\",\n \"The trailer length may be calculated 1292 by comparing distances, d, between the transmitter and the receiver that have been estimated and stored in memory over a period of time.\",\n \"A predetermined number of distance estimates may be stored in controller memory.\",\n \"A comparison of the stored distances may result in a largest distance may be identified.\",\n \"The largest distance estimate may be associated with a zero hitch angle.\",\n \"This identified largest distance, less the known reference distance, dr will be representative of, and may be stored as, the trailer length, lT. As an alternative, the trailer length, lT, may be estimated using a yaw rate provided by a yaw rate sensor on the vehicle to determine when the trailer is a zero hitch angle.\",\n \"A yaw rate sensor is typically available as part of the sensor system 1200 on the vehicle.\",\n \"A zero yaw rate is an indicator that a vehicle is travelling along a straight path, i.e., the vehicle is not turning.\",\n \"The fact that the yaw rate is zero alone is not adequate to identify a zero hitch angle because the vehicle may have just stopped turning even though a non-zero hitch angle exists.\",\n \"However, monitoring yaw rate over time will provide confirmation that the vehicle has driven straight forward for a sufficient predetermined period of time while maintaining a zero or near zero yaw rate.\",\n \"A zero yaw rate, sensed over time, provides an indication that the trailer has straightened out and it can be inferred that the hitch angle is zero at that point.\",\n \"Upon verification of zero hitch angle, the operation to calculate trailer length 1292 is performed.\",\n \"The estimated distance between the transmitter and the receiver when the hitch angle is zero less the predetermined distance, dr, defines the trailer length, lT.\",\n \"The predetermined period of time that the yaw rate should remain at zero before the assumption that the hitch angle is zero will be associated with an actual distance the vehicle trailer combination needs to travel to ensure that the hitch angle is zero.\",\n \"This may be determined through testing and stored in the controller memory.\",\n \"The disclosed subject matter is advantageous in that it provides an estimate of hitch angle whether or not a hitch angle sensor is present on a vehicle.\",\n \"The disclosed subject matter is even advantageous for a vehicle that has a hitch angle sensor in that it provides a method for verifying, or validating, the accuracy of a hitch angle sensed by a hitch angle sensor.\",\n \"This is especially important for vehicle systems that rely critically on the value of the hitch angle being sensed, for example, trailer backup assist systems, trailer sway control systems and trailer brake control systems.\",\n \"Hitch Angle Calibration As previously mentioned with reference to FIG.\",\n \"10 and a driver's interaction with the human machine interface (HMI) device 102, after the trailer setup module 600 is complete at step 620, the calibration module 700, according to one embodiment, calibrates the curvature control algorithm with the proper trailer measurements and calibrates the trailer backup assist system for any hitch angle offset that may be present.\",\n \"In the one embodiment, the calibration module 700 may instruct the driver to pull the vehicle-trailer combination straightforward until a hitch angle sensor calibration is complete, which may be notified to the driver via the HMI device 102.Depending on any error resulting from the trailer measurements or the potential inability of the vehicle to be pulled straight forward, additional and alternative embodiments of calibrating the trailer backup assist system are described herein.\",\n \"With reference to FIG.\",\n \"35, the vehicle trailer backup assist system 105 is illustrated having the trailer backup assist control module 120 in communication with the sensor system 1200 and the trailer backup steering input apparatus 125 as part of the trailer backup assist system 105.The trailer backup assist system 105 in the illustrated embodiment, receives sensor information from the one or more hitch angle sensors 1312, a vehicle yaw rate sensor 1314, and a vehicle speed sensor 1316, and may communicate with other conceivable sensors on the vehicle 100 or trailer 110.For instance, the illustrated embodiment of the trailer backup assist system 105 also communicates with the vehicle transmission controller 1318, such as receiving the presently engaged transmission gear.\",\n \"Furthermore, the trailer backup assist control module 120 is also in direct communication with the power steering assist system 115, which has the power steering assist control module 135 for communicating with the steering angle detection apparatus 140 and a servo steering motor 1300, or servomotor, for operating the steered wheels 1302 of the towing vehicle 100 (FIG.\",\n \"36).\",\n \"The illustrated embodiment of the trailer backup assist control module 120 includes a microprocessor 1304 for processing one or more routines stored in the corresponding memory 1306 of the trailer backup assist control module 120.The memory in one embodiment includes a hitch angle calibration routine 1308 and an initiating routine 1310.It should be appreciated that the trailer backup assist control module 120 may be a standalone dedicated controller or may be a shared controller integrated with other control functions, such as integrated with the sensor system 1200, the trailer backup steering input apparatus 125, or other systems of the towing vehicle.\",\n \"As shown in FIG.\",\n \"36, a schematic illustration of the vehicle 100 and trailer 110 combination are overlaid with an x-y coordinate system showing kinematic variables and angles, including the steering angle δ, trailer length D, and hitch angle γ, which may be affected by the dynamics of the vehicle 100 and trailer 110 combination and representable in kinematic equations, as similarly discussed with reference to FIG.\",\n \"5.Referring to FIGS.\",\n \"37-38, a method is shown for estimating the actual hitch angle γ(a) between the vehicle 100 and the trailer 110, according to one embodiment.\",\n \"The method provides for sensing a measured hitch angle γ(m) with at least one hitch angle sensor 1312 (FIG.\",\n \"35) on the vehicle 100 and sensing a steering angle δ of the steered wheels 1302 (FIG.\",\n \"36) of the vehicle 100.Further, the method provides for reversing the vehicle 100, and thereby determining an offset γ(o) between the measured hitch angle γ(m) and the actual hitch angle γ(a) when the measured hitch angle γ(m) and the steering angle δ are substantially constant while the vehicle 100 is reversing.\",\n \"As defined herein, the offset γ(o) is the difference between the measured hitch angle γ(m) and the actual hitch angle γ(a).\",\n \"As reflected in the diagram shown in FIG.\",\n \"36, when the hitch angle γ and steering angle δ are substantially constant, the yaw rate of the vehicle 100 is also substantially constant and equal to the yaw rate of the trailer 110.This interaction is used to formulate kinematic equations that can be solved for determining the offset γ(o) between the measured hitch angle γ(m) and the actual hitch angle γ(a).\",\n \"Specifically, the yaw rate of the vehicle 100, as measured by the vehicle yaw rate sensor 1314 (FIG.\",\n \"35) or another conceivable onboard vehicle sensor that may be configured to sense the yaw rate, provides the following equation: d α dt = - v w tan δ Furthermore, the yaw rate of the trailer can be represented with the following equation: d β dt = v D sin γ + Lv DW cos γ tan δ where, δ is the steering angle of the front wheels D is the distance from the hitch to the trailer axle W is the vehicle wheelbase (distance between both axles) L is the distance from the vehicle rear axle and hitch γ is the hitch angle Accordingly, when the yaw rate of the vehicle 100 and the trailer 110 become equal, the actual hitch angle γ(a) will likely be constant, such that the desired hitch angle provided by the trail backup steering input apparatus 125, such as the previously described rotatable input control device shown in FIG.\",\n \"2, is also constant and substantially achieved.\",\n \"For example, the desired hitch angle received from the trailer backup steering input apparatus 125 may be constant when the driver attempts to reverse the trailer 110 in a straight line with the vehicle 100 (i.e.\",\n \"a zero curvature command) or when the driver inputs a maximum knob angle command.\",\n \"The resulting constant hitch angle results in the following equation: c=a cos γ+b sin γ This equation can be rewritten as follows: c=a√{square root over (1−sin2γ)}+b sin γ The above equation can be solved with the quadratic equation that solves for the hitch angle γ.\",\n \"Thereafter, when breaking up the hitch angle γ into a measured hitch angle γ(m) and an offset angle γ(o), the equation can be rewritten as follows: γ o = arcsin bc ± a b 2 + a 2 - c 2 b 2 + a 2 - γ m γ m where , c = - 1 W tan δ b = 1 D a = L DW tan δ Accordingly, the hitch angle offset γ(o) may be determined as a function of the length D of the trailer 110, the wheelbase length W of the vehicle 100, and the distance L from a rear axle of the vehicle 100 to the trailer 110 as shown in FIG.\",\n \"36, while meeting the conditions provided above to use such an equation.\",\n \"Specifically, the conditions generally include that the vehicle 100 and trailer 110 are reversing and that the measured hitch angle γ(m) and the steering angle δ are substantially constant during the reversing motion for at least a threshold period of time or over a threshold distance of motion.\",\n \"As illustrated in FIG.\",\n \"37, the calibration module 700 processes one embodiment of the hitch angle calibration routine 1308 to provide the method according to the following steps.\",\n \"At step 1320, the system receives generally fixed characteristics of the vehicle 100 and the trailer 110, including the trailer length D, the vehicle wheelbase length W, and the distance L from the vehicle's rear axle to the hitch connection.\",\n \"These generally fixed characteristics are described as such because the vehicle 100 and trailer 110 dimensions can be preloaded or looked up in product specifications, and if these dimensions are not known or otherwise already determined by the system, they can be measured and input into the memory 1306 or other vehicle memory prior to operating the vehicle 100 with the trailer backup assist system 105.The hitch angle calibration routine 1308 shown in FIG.\",\n \"37, also provides at step 1322, confirming that the vehicle 100 is reversing when the sensors of the sensor system 1200 are taking continuous measurements of the vehicle 100 and trailer 110 variables.\",\n \"Specifically, the system may confirm that the vehicle 100 is reversing with use of directional speed sensors, the gear position of the transmission controller 1318, GPS inputs, or other conceivable indicators of vehicle 100 direction.\",\n \"At step 1324, the system conducts the initiating routine 1310 to further confirm that the vehicle 100 and trailer 110 combination are in a condition to determine the offset γ(o) between the measured hitch angle γ(m) and the actual hitch angle γ(a).\",\n \"As shown in FIG.\",\n \"38, one embodiment of the initiating routine 1310 includes determining a compensated steering wheel angle 1326 which is an indication of the steerable road wheel angle, calculating a filtered steering wheel angle rate 1328, and then determining at step 1330 whether the filtered steering wheel angle rate is less than a maximum allowable steering angle rate for the offset calculation.\",\n \"Also, the initiating routine 1310 takes the measured trailer angle γ(m) at step 1332 and calculates a filtered trailer angle rate over time at step 1334.The initiating routine then at step 1336 determines whether the filtered trailer angle rate is less than a maximum allowable trailer angle rate for determining the offset calculation.\",\n \"Further, the initiating routine 1310 takes the sensed or otherwise calculated vehicle speed from step 1338 and further calculates a filtered vehicle speed at step 1340.The filtered vehicle speed is then processed at step 1342 to determine whether it is less than a maximum allowable vehicle speed for determining the offset calculation.\",\n \"If the conditions of the initiating routine 1310 are met at step 1344, the trailer backup assist system 105 allows the hitch angle calibration routine 1308 to continue towards determining the offset γ(o).\",\n \"The initiating routine 1310 further includes step 1420 of compensating for a knob angle, calculating a filtered knob angle rate in step 1424, and determining if the filtered knob angle rate is less than a maximum allowable knob angle rate for the offset calculation in step 1428.The maximum allowable knob angle rate may be a tunable value of between about 0 and about 10°, and in a specific example about 1°.\",\n \"The maximum allowable trailer angle rate may be a tunable value of between about 0° per second and about 2° per second, and in a specific example, about 0.5° per second.\",\n \"The maximum allowable steering angle rate may be a tunable value of between about 0° per second and about 10° per second, and in a specific example, about 0.5° per second.\",\n \"The maximum allowable vehicle speed may be a tunable value of between about 0° km/h and about 100 km/h, and in a specific example, about 3 km/h.\",\n \"With further reference to FIG.\",\n \"37, when the initiating routine 1310 is complete, the hitch angle calibration routine at step 1346 determines whether the hitch angle rate and the steering angle rate are both substantially zero, or alternatively stated, whether the hitch angle and the steering angles are substantially constant.\",\n \"If the hitch angle rate and the steering angle rate are both not substantially zero, the hitch angle calibration routine 1308 continues to conduct the initiating routine 1310 at step 1324 and continues to take measurements with the sensor system 1200 until the hitch angle rate and steering angle rate are substantially zero.\",\n \"Once they are both substantially zero, the hitch angle calibration routine 1308 then determines the actual hitch angle at step 1348 based on the vehicle 100 and trailer 110 generally fixed characteristics, as identified in the equations above.\",\n \"With the actual hitch angle γ(a), the hitch angle calibration routine 1308 may then determine the offset γ(o) between the actual hitch angle γ(a) and the measured hitch angle γ(m) at step 1350.Upon determination of the offset γ(o), the calibration module is complete and the trailer backup assist system 105 may proceed for operation.\",\n \"In an additional embodiment of the hitch angle calibration routine 1308, as illustrated in FIG.\",\n \"39, a method is provided for calibrating the trailer backup assist system 105 for the trailer 110 attached to the vehicle 100, which provides driving the vehicle 100 forward substantially straight above a threshold speed.\",\n \"The method also provides sensing a yaw rate of the vehicle 100 and sensing a measured hitch angle γ(m) of the trailer 110.Further, the method provides for determining an angle rate based on the measured hitch angle γ(m), and then determining an offset γ(o) between the measured hitch angle γ(m) and the actual hitch angle γ(a) when the yaw rate and the angle rate are substantially zero.\",\n \"In the previously described embodiment of the hitch angle calibration routine 1308 with reference to FIG.\",\n \"37, the vehicle 100 is reversing and therefore such an embodiment is configured for situations when the vehicle 100 may not be able to drive forward far enough to calibrate the trailer backup assist system 105.However, when space is available to drive the vehicle 100 forward, an alternative method may be used to determine the offset γ(o) between the actual hitch angle γ(a) and the measured hitch angle γ(m) that does not rely upon the accuracy of the measured or otherwise determined trailer geometry and dimensions.\",\n \"Specifically, when setting up the trailer 110 with the vehicle 100, in one embodiment, the user may be instructed to measure various dimensions of the trailer 110, including the trailer length D. The dimensions of the vehicle 100, however, may be measured with a high degree of accuracy upon assembly of the vehicle or otherwise supplied in an accurate manner to the trailer backup assist system 105, such as with a hookup table provided by the vehicle manufacture.\",\n \"With reference to FIG.\",\n \"39, at step 700 the trailer backup assist system 105 again begins to calibrate the system for the trailer 110 attached to the vehicle 100.At step 1352, the system receives the vehicle characteristic including the dimensions of the vehicle 100 and the operating characteristics, such as the present gear of the transmission.\",\n \"Then at step 1354, the system confirms that the vehicle is driving forward while the sensors of the sensor system 1200 take measurements and other readings.\",\n \"Notably, in this illustrated embodiment, the sensors utilized include a sensor for determining the vehicle yaw rate, such as an onboard yaw rate sensor 1314 or a separate sensor configured to determine the yaw rate of the vehicle.\",\n \"Also, the sensors being utilized by this embodiment of the hitch angle calibration routine include at least one hitch angle sensor 1312, as previously described with reference to the sensor system 1200.Still referring to FIG.\",\n \"39, at step 1356, the steered wheels 1302 of the vehicle 100 are steered straight while the vehicle 100 is traveling forward.\",\n \"It is contemplated that in one embodiment the user may be instructed to steer the vehicle straight by manually controlling the steering wheel.\",\n \"In an additional embodiment, the vehicle 100 may automatically steer the vehicle 100 straight using the powering steering assist system 115.More specifically, the trailer backup assist system 105 may operate the steered wheels 1302 of the vehicle 100 using the servo steering motor 1300 in conjunction with the steering angle detection apparatus 140.Once the sensor readings are being received and the vehicle is being steered straight and driving forward, the illustrated embodiment of the hitch angle calibration routine 1308 then proceeds to process an initiating routine 1310 at step 1358.The initiating routine 1310 of the present embodiment may, similar to the initiating routine illustrated in FIG.\",\n \"38, calculate filtered values for the steering wheel angle rate, the hitch angle rate, and the vehicle speed.\",\n \"Furthermore, these filtered values may be compared against threshold values to ensure the hitch angle calibration routine is performed when vehicle conditions are acceptable for such calculation.\",\n \"Specifically, the filtered steering angle rate may be less than a maximum allowable steering angle rate, the trailer angle rate may be less than the maximum allowable trailer angle rate, and the filtered vehicle speed may be less than the maximum allowable vehicle speed, such as 10 mph, 15 mph, or other conceivable threshold speed.\",\n \"When these or more or fewer conditions are met, the system may proceed to the following step of the hitch angle calibration routine.\",\n \"As also illustrated in FIG.\",\n \"39, at step 1360 the hitch angle calibration routine 1308 determines whether the hitch angle rate and the yaw rate are both substantially zero.\",\n \"Specifically, the determination of reaching a value of substantially zero may be one or a combination of the value being within a close proximity to zero or the value being zero or substantially zero over a predetermined period of time.\",\n \"It is contemplated that the increment of time may be proportional to the filtered vehicle speed, such that increasing speed of the vehicle results in decreasing the increment of time the measured hitch angle γ(m) and the steering angle must be substantially constant to determine the offset γ(o).\",\n \"It is also contemplated that the offset may be determined when the measured hitch angle and the steering angle are substantially constant while the vehicle and the trailer are reversing over a threshold distance, such as a distance greater than half a circumference of a steered wheel of the vehicle or other conceivable distances.\",\n \"When the system makes a determination that both values are substantially zero, the system, at step 1362 is then able to determine the actual hitch angle γ(a) based upon the vehicle characteristics.\",\n \"In one embodiment, when the above conditions are met the actual hitch angle γ(a) will be zero.\",\n \"However, some vehicle characteristics, such as an offset hitch location, may result in the actual hitch angle γ(a) deviating from zero with these conditions met.\",\n \"At step 1364 the system then determines the offset γ(o) between the actual hitch angle γ(a) and the measured hitch angle γ(m) for purposes of operating the trailer backup assist system 105.Again, at step 704 the trailer backup assist system 105 may notify the driver that the calibration is complete and may store the hitch angle offset value in memory to be associated with the attached trailer 110.Referring now to FIG.\",\n \"40, an additional embodiment of the hitch angle calibration routine 1308 is illustrated that may consider the vehicle's direction of movement or potential direction of movement before choosing a method for determining the offset γ(o) of the measured hitch angle γ(m).\",\n \"The vehicle's direction of movement may be based upon the presently engaged gear of the transmission, such as drive or reverse for automatic transmissions.\",\n \"The vehicle's potential direction of movement, however, may be based upon the available space in front of or behind the vehicle and trailer combination.\",\n \"At step 1366, if the vehicle 100 is moving in either the forward or rearward directions, the system may determine if enough available space exists for the vehicle 100 to continue moving in such direction and complete the calibration of the trailer backup assist system 105.If enough available space is not present, the hitch angle calibration routine 1308 of the illustrated embodiment may instruct the driver to move the vehicle 100 in the opposite or an alternative direction, provided enough available space exists in such direction to complete the calibration.\",\n \"Also, if the vehicle 100 is not moving, the system may determine the preferred direction of movement for the vehicle 100 and trailer 110 to move to have enough space for the vehicle 100 to complete the calibration of the trailer backup assist system 105.At step 1368 the system may instruct the driver, such as through the HMI, to drive either forward or in reverse, as determined in the previous step 1366.Based on which direction the vehicle is instructed to move, this embodiment of the hitch angle calibration routine 1308 may employ one of two alternative methods to determine the actual hitch angle γ(a) for completing the calibration.\",\n \"Specifically, if the vehicle 100 is traveling forward, at step 1370, the system then proceeds to ensure that the vehicle is steered straight 1372, while sensing the yaw rate of the vehicle 1374 and sensing the hitch angle rate 1376.The sensed hitch angle γ(m) is used by the system to determine the hitch angle rate at step 1378 and then continue on to step 1380 to determine when the hitch angle rate and the yaw rate of the vehicle are substantially zero, similar to the method previously described with reference to the embodiment disclosed in FIG.\",\n \"39.When the hitch angle rate and the yaw rate of the vehicle are substantially zero, at step 1380 the hitch angle calibration routine 1308 may determine the actual hitch angle γ(a) to be substantially zero, which may then be used in conjunction with the measured hitch angle γ(m) to determine the offset γ(o) at step 1382.Alternatively, if the vehicle 100 is reversing or instructed to reverse, at step 1384, once the vehicle 100 is reversing, the system proceeds to sense the steering angle δ of the vehicle 100 at step 1386 and sense the hitch angle γ(m) at step 1388 to then determine the hitch angle rate and the steering angle rate at step 1390.The steering angle δ is the angle of the road wheels that steer the vehicle.\",\n \"The steering wheel angle δ may be the angle of the steering wheel for a vehicle in which the steering wheel is mechanically coupled to the road wheels.\",\n \"For a steer by wire arrangement, the steering angle δ may be measured by the angle of the steerable road wheels.\",\n \"At step 1392 the system determines when both the hitch angle rate and the steering angle rate are substantially zero.\",\n \"When both these values are substantially zero, the hitch angle calibration routine 1308 may determine the offset γ(o) of the measured hitch angle γ(m) based upon the length D of the trailer 110, the wheelbase length W of the vehicle 100, and the distance L from the rear axle of the vehicle 100 to the trailer 110, as generally set forth in the embodiment of the hitch angle calibration routine 1308 described with reference to FIGS.\",\n \"37 and 38.In the embodiment disclosed in FIG.\",\n \"40, once the hitch angle offset γ(o) is determined at step 1382, the calibration routine commences at step 704 and may notify the driver, such as via the HMI or another similar notification.\",\n \"The hitch angle calibration routine 1308 illustrated in FIG.\",\n \"40 illustrates one embodiment for calibrating the hitch angle both in the forward direction of travel based on the hitch angle rate and yaw rate being substantially zero and in the reverse vehicle direction based on the hitch angle rate and steering angle rate being substantially zero.\",\n \"However, it should be appreciated that use of the hitch angle rate, the yaw rate, and the steering angle rate is one embodiment for determining a steady state condition during which the offset calibration may be performed.\",\n \"The hitch angle calibration routine 1308 determines offset of the measured hitch angle when the vehicle and trailer are in a steady state condition.\",\n \"The steady state condition may be when at least one steady state indicator on the trailer and at least one steady state indicator on the vehicle are constant in either the forward or reverse vehicle direction.\",\n \"When this steady state condition is met, the expected trailer angle is calculated and the difference between the expected trailer angle and the measured trailer angle is determined as the offset.\",\n \"The vehicle steady state indicator may include one or more of the following: the vehicle yaw rate is constant, the steering wheel or road wheel angle is constant, or the steering wheel or road wheel angle rate is substantially zero.\",\n \"The trailer steady state indicator may include one or more of the following: the trailer yaw rate is constant, or the trailer hitch angle is constant, or the trailer hitch angle rate is substantially zero.\",\n \"When the curvature command is zero while the vehicle is driven in reverse, the expected trailer angle is zero, and the offset is calculated from the difference from zero to the measured angle.\",\n \"However, it should be appreciated that the offset may be calculated when the curvature command is not at zero during a non-straight travel path.\",\n \"Referring now to FIG.\",\n \"41, although the offset γ(o) generally may be determined while the vehicle 100 is moving forward or in reverse, there may be differences in accuracy of the offset γ(o) when depending on the direction of travel of the vehicle 100.Accordingly, the offset γ(o) may be determined separately as a reverse offset γ(or) or a forward offset γ(of).\",\n \"In various embodiments, the reverse offset γ(or) determined while the vehicle 100 is reversing may be more accurate than the forward offset γ(of) determined while the vehicle 100 is moving forward.\",\n \"While the vehicle 100 is towing the trailer 110 in the forward direction, the natural stability of the system may lead to the calculation of the forward offset γ(of) to be less accurate than the reverse offset γ(or) which is calculated during the more sensitive motion of backing the vehicle 100 and the trailer 110.Accordingly, prioritization of the reverse offset γ(or) over the forward offset γ(of) may be desirable.\",\n \"In such an instance, a prioritization method 1400 may be used to prioritize the reverse offset γ(or) over the forward offset γ(of).\",\n \"The prioritization method 1400 may be run at the same time as the hitch angle calibration routine 1308 and includes several of the same steps of the hitch angle calibration routine 1308 and may be run on the same controller or a different controller than the hitch angle calibration routine 1308.The prioritization method 1400 may include steps 1366, 1384, 1382A, 1382B, 1370, 1404, 1408, and 1412.Step 1366 detects that the vehicle 100 is moving.\",\n \"Determination of the movement of the vehicle 100 may be accomplished via signals from wheel count encoders, a controller area network, a parking assist controller, a vehicle electronic control unit, a gear sensor or various other controllers and modules around the vehicle 100.Next, step 1384 determines whether the vehicle 100 is reversing.\",\n \"If the vehicle 100 is reversing, the method 1400 proceeds to step 1382B and if the vehicle 100 is not moving in the reverse direction, the method 1400 proceeds to step 1370 of determining if the vehicle 100 is moving in a generally forward direction.\",\n \"The vehicle 100 may be determined to be moving in the forward direction using any of the signals or controllers explained above.\",\n \"In the event the vehicle 100 is determined to be moving in a forward direction in step 1370, the method 1400 proceeds to step 1382A of determining the forward offset γ(of).\",\n \"The forward offset γ(of) is calculated in substantially the same manner as the offset γ(o) is calculated while the vehicle 100 is traveling in the forward direction, as explained above.\",\n \"Once the forward offset γ(of) is calculated, the method 1400 proceeds to step 1404 of determining if a forward offset flag has been set.\",\n \"If the forward offset flag has been set (e.g., logically expressed as true), the forward offset γ(of) the method 1400 is advanced to step 1412.If the forward offset flag is not set to true, the method 1400 returns to step 1366 of detecting which direction the vehicle 100 is moving in.\",\n \"Step 1412 of the method 1400 stores the forward offset γ(of) for use during the hitch angle calibration or for later use with forward and reverse movement of the vehicle 100 and trailer 110.The forward offset flag is set to true if the reverse offset γ(or) is not yet stored or if the forward offset γ(of) is stored.\",\n \"It will be understood that in various embodiments, the forward offset flag may not be set to true if the forward offset γ(of) is already stored.\",\n \"Returning to step 1384, if the vehicle 100 is determined to be traveling in the reverse direction, the method 1400 advances to step 1382B of determining the reverse offset γ(or).\",\n \"Similarly to the forward offset γ(of), the reverse offset γ(or) is calculated as the offset γ(o) when the vehicle 100 is traveling in the reverse direction, as described above.\",\n \"Once the reverse offset γ(or) is determined, the method advances to step 1408 of determining if a reverse offset flag is set to true.\",\n \"If yes, the method 1400 advances to step 1412 of storing the reverse offset γ(or).\",\n \"Step 1412 may store the forward or reverse offsets γ(of), γ(or) in random-access memory, or may transfer the offsets γ(of), γ(or) to non-volatile random-access memory upon the shutting down of the vehicle 100.In various embodiments, if a forward offset γ(of) is calculated and stored prior to the reverse offset γ(or), the reverse offset γ(or) may substitute, exchange or otherwise replace the forward offset γ(of).\",\n \"After the storing of the reverse offset γ(or) the method 1400 may not calculate the forward offset γ(of).\",\n \"In some embodiments, if the reverse offset γ(or) is calculated again and is a different value than the stored value (e.g., due to a different trailer 110 being attached to the vehicle 100 or a new asymmetry of the trailer 110 and/or vehicle 100 being present) the stored reverse offset γ(or) may be substituted, exchanged, or otherwise replaced for the new value of the reverse offset γ(or).\",\n \"In various embodiments, multiple forward and reverse offsets γ(of), γ(or) may be stored, which correspond to different trailers 110 or different typical asymmetries.\",\n \"It will be understood that calculations of the forward and reverse offsets γ(of), γ(or) calculated after the storing of the forward and/or reverse offsets γ(of), γ(or) may not necessarily be discarded, but may be used to enhance the accuracy of the stored value by averaging the calculations together, regardless if it is a forward or reverse offset γ(of), γ(or), or by providing more than one data point for the method 1400 or routine 1308 to work from.\",\n \"Use of the prioritization method 1400 may offer several advantages.\",\n \"For example, by prioritizing the reverse offset γ(or) over the forward offset γ(of), a more accurate offset may be used when backing the vehicle 100 and trailer 110.Additionally, by storing the more accurate of the offsets, future calibration maneuvers may not need to be performed until a new asymmetry is detected with the vehicle 100 and/or trailer.\",\n \"It is to be understood that variations and modifications can be made on the aforementioned structure without departing from the concepts of the present invention, and further it is to be understood that such concepts are intended to be covered by the following claims unless these claims by their language expressly state otherwise.\"\n ]\n]"},"source":{"kind":"string","value":"Patent_15871409"}}},{"rowIdx":4493783,"cells":{"text":{"kind":"list like","value":[["BATH SHOWER WITH DISPOSABLE FILTRATION UNIT","The present invention provides a water shower filter unit to provide clean treated water substantially free from chlorine, organic contaminants, and suspended solids by the use of primary filter, secondary filter and tertiary filter.","The primary filter constructed from polymer material capable of filtering particle of 10 microns and above for eliminating suspended solid.","The primary filter further comprises of chlorine removal material for removal of chlorine and contaminants.","The secondary filter made of multiple layers of activated balls.","Tertiary filter made of magnetic energy ceramics balls and mineral stones reside in elongated, hollow internal chamber of shower head is for water activation."],["1.A water shower filter unit having: at least one water storage tank; a shower head; a first flexible hose having a first end connected to a water inlet of a first water storage tank; a second flexible hose having a first end connected to a water outlet of a second water storage tank and a second end connected to the shower head; characterized in that the at least one water storage tank further comprises: a primary filter mounted within the first water storage tank; and a secondary filter embedded within the second water storage tank.","2.The water shower filter unit according to claim 1, wherein the primary filter is constructed from polymer material of high density fabric which includes FILTRON™.","3.The water shower filter unit according to claim 1, wherein the polymer material is able to filter particle of 10 microns and above.","4.The water shower filter unit according to claim 2 wherein the primary filter is disposable.","5.The water shower filter unit according to claim 1, wherein the primary filter comprises chlorine removal material to remove chlorine and contaminants from a water source.","6.The water shower filter unit according to claim 1, wherein the shower head is affixed with a hollow filter handle having elongated internal chamber for holding a tertiary filter.","7.The water shower filter unit according to claim 6, wherein the tertiary filter is embedded within the elongated internal chamber of the hollow filter handle.","8.The water shower filter unit according to claim 6, wherein the tertiary filter is made of magnetic energy ceramics balls and mineral stones.","9.The water shower filter unit according to claim 6, wherein the shower head is hand held."],[" BACKGROUND OF ART Municipal water usually contains particles such as excessive chlorine, mud, clay, soil particle and rusty water is conveyed using steel pipes.","Untreated water supplies are being polluted by contaminants may result merely in an unpleasant odour or taste in the water or may cause severe consequences such as eyes irritation, skin rashes, and hair damage.","Therefore, water filter is used to purify the water and provide safer and raise the quality of the water supply.","One example of shower water filter is disclosed in the U.S. Pat.","No.","6,016,977 (US 977 Patent) entitled “Hand Held Shower Head and Filter Housing” having a filing date of 29 Jul.","1998 (Applicant: David K. Farley) disclosed a hand held shower head and filter assembly using non-soluble calcium sulfite for filtering contaminants from hot water passing there through at high flow rates.","As disclosed in the US 977 Patent, the hand held shower head and filter having an elongated, hollow handle.","The filter element of the US 977 Patent may have a filter media, such as non-soluble calcium sulphite, alone or combined with a copper-zinc medium therein.","Another example of shower water filter is disclosed in the U.S. Pat.","No.","6,537,455 (US 455 Patent) entitled “Elongated Hand-held Shower Head and Filter” having a grant date of 25 Mar.","2003 (Applicant: David K. Farley) disclosed a combination of hand held shower head and water filter assembly for filtering contaminants from hot water passing there through at high flow rates.","It is further provided in the US 455 Patent to provide an improved elongated combination hand held shower head and water filter having a swivel shower head attached to an elongated in line hose filter that is sized and dimensioned to it into a holding bracket in two positions.","A further example of shower water filter is disclosed in the U.S. Pat.","No.","6,096,197 (US 197 Patent) entitled “Shower Filter For Chlorine Removal and Scale Deposit Prevention” having a filing date of 11 Dec. 1997 (Applicant: Douglas E. Hughes) disclosed dual-purpose shower and bath filter to reduce chlorine in shower water through absorption, reduce or eliminate scale deposits.","The filter unit enables a single device to simultaneously prevent scale deposits from forming on plumbing and wall surfaces while also reducing or eliminating the chlorine from shower spray.","It is further disclosed in US 197 Patent that the filter cartridge accomplishes the scale reduction or prevention by treating water with a specially designed phosphate that coats scale (comprising calcium and magnesium) so that it will not stick to plumbing or wall surfaces.","Further, the filter cartridge accomplishes the reduction or elimination of chlorine in the water through the absorption capabilities of a superfine mesh powdered activated carbon, formed into a carbon block.","It is the general object of the invention to provide an improved water shower filter unit that effectively removes chlorine, organic contaminants and suspended solid from shower water through multi-layer filter which can further enhance the water quality during bathing and showering."],[" SUMMARY OF INVENTION The present invention relates to a water shower unit with disposable filtration unit.","One aspect of the invention is to provide a water shower filter unit having at least one water storage tank; a shower head; a first flexible hose having a first end connected to a water inlet of a first water storage tank; a second flexible hose having a first end connected to a water outlet of a second water storage tank and a second end connected to the shower head.","The at least one water storage tank comprises a primary filter mounted within the first water storage tank and a secondary filter embedded within the second water storage tank.","Another aspect of the invention is to provide a primary filter is constructed from polymer material of high density fabric which includes FILTRON™.","A further aspect of the invention is to provide the polymer material is able to filter particle of 10 microns and above.","Another aspect of the present invention is to provide the primary filter is disposable.","Another aspect of the invention is to provide the primary filter comprises chlorine removal material to remove chlorine and contaminants from a water source.","Another aspect of the invention is to provide the shower head is affixed with a hollow filter handle having elongated internal chamber for holding a tertiary filter.","A further aspect of the invention is to provide the tertiary filter is embedded within the elongated internal chamber of the hollow filter handle.","Yet another aspect of the invention is to provide the tertiary filter is made of magnetic energy ceramics balls and mineral stones.","Another aspect of the invention provides that the shower head is hand held.","The present invention consists of features and a combination of parts hereinafter fully described and illustrated in the accompanying drawings, it being understood that various changes in the details may be made without departing from the scope of the invention or sacrificing any of the advantages of the present invention."],["CROSS-REFERENCE This patent application is a continuation-in-part of U.S. application Ser.","No.","15/349,321 filed Nov. 11, 2016, which is incorporated herein by reference.","FIELD OF INVENTION The present invention relates to a bath shower unit with disposable filtration unit.","BACKGROUND OF ART Municipal water usually contains particles such as excessive chlorine, mud, clay, soil particle and rusty water is conveyed using steel pipes.","Untreated water supplies are being polluted by contaminants may result merely in an unpleasant odour or taste in the water or may cause severe consequences such as eyes irritation, skin rashes, and hair damage.","Therefore, water filter is used to purify the water and provide safer and raise the quality of the water supply.","One example of shower water filter is disclosed in the U.S. Pat.","No.","6,016,977 (US 977 Patent) entitled “Hand Held Shower Head and Filter Housing” having a filing date of 29 Jul.","1998 (Applicant: David K. Farley) disclosed a hand held shower head and filter assembly using non-soluble calcium sulfite for filtering contaminants from hot water passing there through at high flow rates.","As disclosed in the US 977 Patent, the hand held shower head and filter having an elongated, hollow handle.","The filter element of the US 977 Patent may have a filter media, such as non-soluble calcium sulphite, alone or combined with a copper-zinc medium therein.","Another example of shower water filter is disclosed in the U.S. Pat.","No.","6,537,455 (US 455 Patent) entitled “Elongated Hand-held Shower Head and Filter” having a grant date of 25 Mar.","2003 (Applicant: David K. Farley) disclosed a combination of hand held shower head and water filter assembly for filtering contaminants from hot water passing there through at high flow rates.","It is further provided in the US 455 Patent to provide an improved elongated combination hand held shower head and water filter having a swivel shower head attached to an elongated in line hose filter that is sized and dimensioned to it into a holding bracket in two positions.","A further example of shower water filter is disclosed in the U.S. Pat.","No.","6,096,197 (US 197 Patent) entitled “Shower Filter For Chlorine Removal and Scale Deposit Prevention” having a filing date of 11 Dec. 1997 (Applicant: Douglas E. Hughes) disclosed dual-purpose shower and bath filter to reduce chlorine in shower water through absorption, reduce or eliminate scale deposits.","The filter unit enables a single device to simultaneously prevent scale deposits from forming on plumbing and wall surfaces while also reducing or eliminating the chlorine from shower spray.","It is further disclosed in US 197 Patent that the filter cartridge accomplishes the scale reduction or prevention by treating water with a specially designed phosphate that coats scale (comprising calcium and magnesium) so that it will not stick to plumbing or wall surfaces.","Further, the filter cartridge accomplishes the reduction or elimination of chlorine in the water through the absorption capabilities of a superfine mesh powdered activated carbon, formed into a carbon block.","It is the general object of the invention to provide an improved water shower filter unit that effectively removes chlorine, organic contaminants and suspended solid from shower water through multi-layer filter which can further enhance the water quality during bathing and showering.","SUMMARY OF INVENTION The present invention relates to a water shower unit with disposable filtration unit.","One aspect of the invention is to provide a water shower filter unit having at least one water storage tank; a shower head; a first flexible hose having a first end connected to a water inlet of a first water storage tank; a second flexible hose having a first end connected to a water outlet of a second water storage tank and a second end connected to the shower head.","The at least one water storage tank comprises a primary filter mounted within the first water storage tank and a secondary filter embedded within the second water storage tank.","Another aspect of the invention is to provide a primary filter is constructed from polymer material of high density fabric which includes FILTRON™.","A further aspect of the invention is to provide the polymer material is able to filter particle of 10 microns and above.","Another aspect of the present invention is to provide the primary filter is disposable.","Another aspect of the invention is to provide the primary filter comprises chlorine removal material to remove chlorine and contaminants from a water source.","Another aspect of the invention is to provide the shower head is affixed with a hollow filter handle having elongated internal chamber for holding a tertiary filter.","A further aspect of the invention is to provide the tertiary filter is embedded within the elongated internal chamber of the hollow filter handle.","Yet another aspect of the invention is to provide the tertiary filter is made of magnetic energy ceramics balls and mineral stones.","Another aspect of the invention provides that the shower head is hand held.","The present invention consists of features and a combination of parts hereinafter fully described and illustrated in the accompanying drawings, it being understood that various changes in the details may be made without departing from the scope of the invention or sacrificing any of the advantages of the present invention.","BRIEF DESCRIPTION OF THE ACCOMPANYING DRAWING To further clarify various aspects of some embodiments of the present invention, a more particular description of the invention will be rendered by references to specific embodiments thereof, which are illustrated in the appended drawings.","It is appreciated that these drawings depict only typical embodiments of the invention and are therefore not to be considered limiting of its scope.","The invention will be described and explained with additional specificity and detail through the accompanying drawings.","FIG.","1 illustrates the exploded perspective view of the shower water filter unit.","DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS The present invention relates to a water shower unit with disposable filtration unit.","Hereinafter, this specification will describe the present invention according to the preferred embodiments.","It is to be understood that limiting the description to the preferred embodiments of the invention is merely to facilitate discussion of the present invention and it is envisioned without departing from the scope of the appended claims.","FIG.","1 illustrates a water shower filter unit of the present invention.","As illustrated in FIG.","1, the water shower filter unit comprises a housing (104), a water storage tank (108a, 108b) having a water inlet and a water outlet, a shower head (120); a first flexible hose having a first end connected to a water inlet (180a) of a first water storage tank (108a); a second flexible hose having a first end connected to a water outlet (180d) of a second water storage tank (108b) and a second end connected to the shower head (120).","The water storage tank (108a, 108b) comprises a primary filter (112) and a secondary filter (114).","The housing (104) of the water shower filter unit having a cover (102) and an interior space for enclosing at least one water storage tanks (108a, 108b).","The water storage tanks (108a, 108b) comprises a first water storage tank (108a) and a second water storage tank (108b) whereby each of the water storage tank having a water inlet (180a, 180c) and a water outlet (180b, 180d) at bottom of the water storage tank.","Each of the water storage tanks (108a, 108b) includes a tank cover (106).","The first water storage tank (108a) having a water inlet (180a) which is connected to a flexible hose (150) for receiving incoming water from the water source (i.e.","municipal water) and a water outlet (180b) connected to a central pipe of a primary filter's holder (111) to allow filtered water to flow to a water inlet (180c) of the second water storage tank (108b) through a coupling member (122).","A water outlet (180d) of the second water storage tank is connected to a central pipe (140) whereby a first end of a flexible hose is connected to the water outlet (180d) of the second water storage tank and a second end of a flexible hose is connected to a hollow filter handle (117) of a shower head.","The shower head (120) may be constructed in any conventional or known manner from any acceptable material, such as a high strength plastic or the like.","The shower head (120) is affixed to a hollow filter handle (117) having elongated internal chamber to hold a tertiary filter (116).","The hollow filter handle (117) may be used as a handle for grasping or holding the shower head (120).","The first end of a flexible hose (150) connected to the water outlet (180d) of the second water storage tank (108) and the second end of the flexible hose connected to the hollow filter handle (117) of a shower head.","The first stage of filtration is the primary filter (112).","The primary filter (112) is mounted within the first water storage tank (108a).","The primary filter (112) is made of disposable polymer material preferably high density fabric (143) which includes FILTRON™ whereby the filtration medium wrapped around a filter holder (111).","The filter holder (111) having a central pipe which allows overflow of filtered water to flow to the water inlet (180c) of the second water storage tank (108b).","The central pipe comprises of chlorine removal material to remove residual chlorine and contaminants from the municipal water source and supply.","Preferably, the polymer material of the primary filter may be selected from the group consisting of Polyester, Polyethylene (PE), Polypropylene (PP) or high density fabric (i.e.","FILTRON™) due to its ability to remove suspended solid, rust and filter off particles of 10 microns and above.","FILTRON™ filter fabric is a high density-type fabric with small pore size of 10 microns and air permeability rate of ˜20%.","Other filtration medium that can achieve this can also be used instead.","The second stage of filtration is the secondary filter (114).","The secondary filter (114) comprises of multiple layers of activated balls (145, 147) arranged within a second storage tank (108b), whereby the multiple layers of balls are divided by a spacer (130).","An end cap (132) is affixed to a top portion of a central pipe (140) to prevent the activated balls from flowing into the central pipe during the filtration process.","The balls are energy balls preferably made of ceramic (145, 147) with the presence of ceramic mineral which emits a large amount of anions and far-infrared rays.","The energy balls can treat water to produce smaller water cluster, removes bad odors, and increases dissolved oxygen in water.","The third stage of filtration is the tertiary filter.","The tertiary filter (116) contains magnetic energy ceramics balls and mineral stones held in elongated cylindrical filter cartridge which is aligned to be coaxial with longitudinal axis of the hollow filter handle (117).","The magnetic energy ceramic balls are made of mineral materials (i.e.","ferrite) and other functional materials such as silicon nitride and zirconium dioxide through high temperature sintering which combines with a permanent magnetic particulate.","The magnetic energy ceramics balls and mineral stones of the tertiary filter (116) activates the water molecules in such a way that the water changes to magnetized water upon flowing through the magnetic energy ceramic balls results in changes of physical and chemical properties of water due to electromagnetic induction in the magnetic field.","The water molecules that undergo activation treatment by magnetic field or bio-ceramic stones will transform into smaller clusters of water molecules.","Such water molecules can easily absorb by the human body and magnetized water may activate certain enzyme activity.","In use, the water flows from the water inlet (180a) at the bottom of the first water storage tank (108a) and subsequently the water flows upwards through the primary filter (112) for removal of chlorine and suspended solid.","The filtered water is then overflows within the first water storage tank (108a) causing the filtered water to flow down through the central pipe of the primary filter's holder which is connected to the water inlet (180c) of the second water storage tank (108b) through a coupling member (122).","Next, the filtered water flows upward through multiple layers of activated balls of the secondary filter (114).","The overflow of filtered water within the second water storage tank (108b) directs the filtered water to flow downwards through the central pipe (140) to a water outlet (180d) at the bottom of the second water storage tank (108b).","The filtered water is flowed through the flexible hose (150) for further filtration by tertiary filter (116) which is embedded within the hollow filter handle (117) before exiting through the shower head (120).","The present embodiments are considered as merely illustrative and not restrictive, the description to the preferred embodiments of the invention is merely to facilitate discussion of the present invention and it is envisioned without departing from the scope of the appended claims.","Unless the context requires otherwise or specifically stated to the contrary, integers, steps or elements of the invention recited herein as singular integers, steps or elements clearly encompass both singular and plural forms of the recited integers, steps or elements.","Throughout this specification, unless the context requires otherwise, the word “comprise”, or variations such as “comprises” or “comprising”, will be understood to imply the inclusion of a stated step or element or integer or group of steps or elements or integers, but not the exclusion of any other step or element or integer or group of steps, elements or integers.","Thus, in the context of this specification, the term “comprising” is used in an inclusive sense and thus should be understood as meaning “including principally, but not necessarily solely”."]],"string":"[\n [\n \"BATH SHOWER WITH DISPOSABLE FILTRATION UNIT\",\n \"The present invention provides a water shower filter unit to provide clean treated water substantially free from chlorine, organic contaminants, and suspended solids by the use of primary filter, secondary filter and tertiary filter.\",\n \"The primary filter constructed from polymer material capable of filtering particle of 10 microns and above for eliminating suspended solid.\",\n \"The primary filter further comprises of chlorine removal material for removal of chlorine and contaminants.\",\n \"The secondary filter made of multiple layers of activated balls.\",\n \"Tertiary filter made of magnetic energy ceramics balls and mineral stones reside in elongated, hollow internal chamber of shower head is for water activation.\"\n ],\n [\n \"1.A water shower filter unit having: at least one water storage tank; a shower head; a first flexible hose having a first end connected to a water inlet of a first water storage tank; a second flexible hose having a first end connected to a water outlet of a second water storage tank and a second end connected to the shower head; characterized in that the at least one water storage tank further comprises: a primary filter mounted within the first water storage tank; and a secondary filter embedded within the second water storage tank.\",\n \"2.The water shower filter unit according to claim 1, wherein the primary filter is constructed from polymer material of high density fabric which includes FILTRON™.\",\n \"3.The water shower filter unit according to claim 1, wherein the polymer material is able to filter particle of 10 microns and above.\",\n \"4.The water shower filter unit according to claim 2 wherein the primary filter is disposable.\",\n \"5.The water shower filter unit according to claim 1, wherein the primary filter comprises chlorine removal material to remove chlorine and contaminants from a water source.\",\n \"6.The water shower filter unit according to claim 1, wherein the shower head is affixed with a hollow filter handle having elongated internal chamber for holding a tertiary filter.\",\n \"7.The water shower filter unit according to claim 6, wherein the tertiary filter is embedded within the elongated internal chamber of the hollow filter handle.\",\n \"8.The water shower filter unit according to claim 6, wherein the tertiary filter is made of magnetic energy ceramics balls and mineral stones.\",\n \"9.The water shower filter unit according to claim 6, wherein the shower head is hand held.\"\n ],\n [\n \" BACKGROUND OF ART Municipal water usually contains particles such as excessive chlorine, mud, clay, soil particle and rusty water is conveyed using steel pipes.\",\n \"Untreated water supplies are being polluted by contaminants may result merely in an unpleasant odour or taste in the water or may cause severe consequences such as eyes irritation, skin rashes, and hair damage.\",\n \"Therefore, water filter is used to purify the water and provide safer and raise the quality of the water supply.\",\n \"One example of shower water filter is disclosed in the U.S. Pat.\",\n \"No.\",\n \"6,016,977 (US 977 Patent) entitled “Hand Held Shower Head and Filter Housing” having a filing date of 29 Jul.\",\n \"1998 (Applicant: David K. Farley) disclosed a hand held shower head and filter assembly using non-soluble calcium sulfite for filtering contaminants from hot water passing there through at high flow rates.\",\n \"As disclosed in the US 977 Patent, the hand held shower head and filter having an elongated, hollow handle.\",\n \"The filter element of the US 977 Patent may have a filter media, such as non-soluble calcium sulphite, alone or combined with a copper-zinc medium therein.\",\n \"Another example of shower water filter is disclosed in the U.S. Pat.\",\n \"No.\",\n \"6,537,455 (US 455 Patent) entitled “Elongated Hand-held Shower Head and Filter” having a grant date of 25 Mar.\",\n \"2003 (Applicant: David K. Farley) disclosed a combination of hand held shower head and water filter assembly for filtering contaminants from hot water passing there through at high flow rates.\",\n \"It is further provided in the US 455 Patent to provide an improved elongated combination hand held shower head and water filter having a swivel shower head attached to an elongated in line hose filter that is sized and dimensioned to it into a holding bracket in two positions.\",\n \"A further example of shower water filter is disclosed in the U.S. Pat.\",\n \"No.\",\n \"6,096,197 (US 197 Patent) entitled “Shower Filter For Chlorine Removal and Scale Deposit Prevention” having a filing date of 11 Dec. 1997 (Applicant: Douglas E. Hughes) disclosed dual-purpose shower and bath filter to reduce chlorine in shower water through absorption, reduce or eliminate scale deposits.\",\n \"The filter unit enables a single device to simultaneously prevent scale deposits from forming on plumbing and wall surfaces while also reducing or eliminating the chlorine from shower spray.\",\n \"It is further disclosed in US 197 Patent that the filter cartridge accomplishes the scale reduction or prevention by treating water with a specially designed phosphate that coats scale (comprising calcium and magnesium) so that it will not stick to plumbing or wall surfaces.\",\n \"Further, the filter cartridge accomplishes the reduction or elimination of chlorine in the water through the absorption capabilities of a superfine mesh powdered activated carbon, formed into a carbon block.\",\n \"It is the general object of the invention to provide an improved water shower filter unit that effectively removes chlorine, organic contaminants and suspended solid from shower water through multi-layer filter which can further enhance the water quality during bathing and showering.\"\n ],\n [\n \" SUMMARY OF INVENTION The present invention relates to a water shower unit with disposable filtration unit.\",\n \"One aspect of the invention is to provide a water shower filter unit having at least one water storage tank; a shower head; a first flexible hose having a first end connected to a water inlet of a first water storage tank; a second flexible hose having a first end connected to a water outlet of a second water storage tank and a second end connected to the shower head.\",\n \"The at least one water storage tank comprises a primary filter mounted within the first water storage tank and a secondary filter embedded within the second water storage tank.\",\n \"Another aspect of the invention is to provide a primary filter is constructed from polymer material of high density fabric which includes FILTRON™.\",\n \"A further aspect of the invention is to provide the polymer material is able to filter particle of 10 microns and above.\",\n \"Another aspect of the present invention is to provide the primary filter is disposable.\",\n \"Another aspect of the invention is to provide the primary filter comprises chlorine removal material to remove chlorine and contaminants from a water source.\",\n \"Another aspect of the invention is to provide the shower head is affixed with a hollow filter handle having elongated internal chamber for holding a tertiary filter.\",\n \"A further aspect of the invention is to provide the tertiary filter is embedded within the elongated internal chamber of the hollow filter handle.\",\n \"Yet another aspect of the invention is to provide the tertiary filter is made of magnetic energy ceramics balls and mineral stones.\",\n \"Another aspect of the invention provides that the shower head is hand held.\",\n \"The present invention consists of features and a combination of parts hereinafter fully described and illustrated in the accompanying drawings, it being understood that various changes in the details may be made without departing from the scope of the invention or sacrificing any of the advantages of the present invention.\"\n ],\n [\n \"CROSS-REFERENCE This patent application is a continuation-in-part of U.S. application Ser.\",\n \"No.\",\n \"15/349,321 filed Nov. 11, 2016, which is incorporated herein by reference.\",\n \"FIELD OF INVENTION The present invention relates to a bath shower unit with disposable filtration unit.\",\n \"BACKGROUND OF ART Municipal water usually contains particles such as excessive chlorine, mud, clay, soil particle and rusty water is conveyed using steel pipes.\",\n \"Untreated water supplies are being polluted by contaminants may result merely in an unpleasant odour or taste in the water or may cause severe consequences such as eyes irritation, skin rashes, and hair damage.\",\n \"Therefore, water filter is used to purify the water and provide safer and raise the quality of the water supply.\",\n \"One example of shower water filter is disclosed in the U.S. Pat.\",\n \"No.\",\n \"6,016,977 (US 977 Patent) entitled “Hand Held Shower Head and Filter Housing” having a filing date of 29 Jul.\",\n \"1998 (Applicant: David K. Farley) disclosed a hand held shower head and filter assembly using non-soluble calcium sulfite for filtering contaminants from hot water passing there through at high flow rates.\",\n \"As disclosed in the US 977 Patent, the hand held shower head and filter having an elongated, hollow handle.\",\n \"The filter element of the US 977 Patent may have a filter media, such as non-soluble calcium sulphite, alone or combined with a copper-zinc medium therein.\",\n \"Another example of shower water filter is disclosed in the U.S. Pat.\",\n \"No.\",\n \"6,537,455 (US 455 Patent) entitled “Elongated Hand-held Shower Head and Filter” having a grant date of 25 Mar.\",\n \"2003 (Applicant: David K. Farley) disclosed a combination of hand held shower head and water filter assembly for filtering contaminants from hot water passing there through at high flow rates.\",\n \"It is further provided in the US 455 Patent to provide an improved elongated combination hand held shower head and water filter having a swivel shower head attached to an elongated in line hose filter that is sized and dimensioned to it into a holding bracket in two positions.\",\n \"A further example of shower water filter is disclosed in the U.S. Pat.\",\n \"No.\",\n \"6,096,197 (US 197 Patent) entitled “Shower Filter For Chlorine Removal and Scale Deposit Prevention” having a filing date of 11 Dec. 1997 (Applicant: Douglas E. Hughes) disclosed dual-purpose shower and bath filter to reduce chlorine in shower water through absorption, reduce or eliminate scale deposits.\",\n \"The filter unit enables a single device to simultaneously prevent scale deposits from forming on plumbing and wall surfaces while also reducing or eliminating the chlorine from shower spray.\",\n \"It is further disclosed in US 197 Patent that the filter cartridge accomplishes the scale reduction or prevention by treating water with a specially designed phosphate that coats scale (comprising calcium and magnesium) so that it will not stick to plumbing or wall surfaces.\",\n \"Further, the filter cartridge accomplishes the reduction or elimination of chlorine in the water through the absorption capabilities of a superfine mesh powdered activated carbon, formed into a carbon block.\",\n \"It is the general object of the invention to provide an improved water shower filter unit that effectively removes chlorine, organic contaminants and suspended solid from shower water through multi-layer filter which can further enhance the water quality during bathing and showering.\",\n \"SUMMARY OF INVENTION The present invention relates to a water shower unit with disposable filtration unit.\",\n \"One aspect of the invention is to provide a water shower filter unit having at least one water storage tank; a shower head; a first flexible hose having a first end connected to a water inlet of a first water storage tank; a second flexible hose having a first end connected to a water outlet of a second water storage tank and a second end connected to the shower head.\",\n \"The at least one water storage tank comprises a primary filter mounted within the first water storage tank and a secondary filter embedded within the second water storage tank.\",\n \"Another aspect of the invention is to provide a primary filter is constructed from polymer material of high density fabric which includes FILTRON™.\",\n \"A further aspect of the invention is to provide the polymer material is able to filter particle of 10 microns and above.\",\n \"Another aspect of the present invention is to provide the primary filter is disposable.\",\n \"Another aspect of the invention is to provide the primary filter comprises chlorine removal material to remove chlorine and contaminants from a water source.\",\n \"Another aspect of the invention is to provide the shower head is affixed with a hollow filter handle having elongated internal chamber for holding a tertiary filter.\",\n \"A further aspect of the invention is to provide the tertiary filter is embedded within the elongated internal chamber of the hollow filter handle.\",\n \"Yet another aspect of the invention is to provide the tertiary filter is made of magnetic energy ceramics balls and mineral stones.\",\n \"Another aspect of the invention provides that the shower head is hand held.\",\n \"The present invention consists of features and a combination of parts hereinafter fully described and illustrated in the accompanying drawings, it being understood that various changes in the details may be made without departing from the scope of the invention or sacrificing any of the advantages of the present invention.\",\n \"BRIEF DESCRIPTION OF THE ACCOMPANYING DRAWING To further clarify various aspects of some embodiments of the present invention, a more particular description of the invention will be rendered by references to specific embodiments thereof, which are illustrated in the appended drawings.\",\n \"It is appreciated that these drawings depict only typical embodiments of the invention and are therefore not to be considered limiting of its scope.\",\n \"The invention will be described and explained with additional specificity and detail through the accompanying drawings.\",\n \"FIG.\",\n \"1 illustrates the exploded perspective view of the shower water filter unit.\",\n \"DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS The present invention relates to a water shower unit with disposable filtration unit.\",\n \"Hereinafter, this specification will describe the present invention according to the preferred embodiments.\",\n \"It is to be understood that limiting the description to the preferred embodiments of the invention is merely to facilitate discussion of the present invention and it is envisioned without departing from the scope of the appended claims.\",\n \"FIG.\",\n \"1 illustrates a water shower filter unit of the present invention.\",\n \"As illustrated in FIG.\",\n \"1, the water shower filter unit comprises a housing (104), a water storage tank (108a, 108b) having a water inlet and a water outlet, a shower head (120); a first flexible hose having a first end connected to a water inlet (180a) of a first water storage tank (108a); a second flexible hose having a first end connected to a water outlet (180d) of a second water storage tank (108b) and a second end connected to the shower head (120).\",\n \"The water storage tank (108a, 108b) comprises a primary filter (112) and a secondary filter (114).\",\n \"The housing (104) of the water shower filter unit having a cover (102) and an interior space for enclosing at least one water storage tanks (108a, 108b).\",\n \"The water storage tanks (108a, 108b) comprises a first water storage tank (108a) and a second water storage tank (108b) whereby each of the water storage tank having a water inlet (180a, 180c) and a water outlet (180b, 180d) at bottom of the water storage tank.\",\n \"Each of the water storage tanks (108a, 108b) includes a tank cover (106).\",\n \"The first water storage tank (108a) having a water inlet (180a) which is connected to a flexible hose (150) for receiving incoming water from the water source (i.e.\",\n \"municipal water) and a water outlet (180b) connected to a central pipe of a primary filter's holder (111) to allow filtered water to flow to a water inlet (180c) of the second water storage tank (108b) through a coupling member (122).\",\n \"A water outlet (180d) of the second water storage tank is connected to a central pipe (140) whereby a first end of a flexible hose is connected to the water outlet (180d) of the second water storage tank and a second end of a flexible hose is connected to a hollow filter handle (117) of a shower head.\",\n \"The shower head (120) may be constructed in any conventional or known manner from any acceptable material, such as a high strength plastic or the like.\",\n \"The shower head (120) is affixed to a hollow filter handle (117) having elongated internal chamber to hold a tertiary filter (116).\",\n \"The hollow filter handle (117) may be used as a handle for grasping or holding the shower head (120).\",\n \"The first end of a flexible hose (150) connected to the water outlet (180d) of the second water storage tank (108) and the second end of the flexible hose connected to the hollow filter handle (117) of a shower head.\",\n \"The first stage of filtration is the primary filter (112).\",\n \"The primary filter (112) is mounted within the first water storage tank (108a).\",\n \"The primary filter (112) is made of disposable polymer material preferably high density fabric (143) which includes FILTRON™ whereby the filtration medium wrapped around a filter holder (111).\",\n \"The filter holder (111) having a central pipe which allows overflow of filtered water to flow to the water inlet (180c) of the second water storage tank (108b).\",\n \"The central pipe comprises of chlorine removal material to remove residual chlorine and contaminants from the municipal water source and supply.\",\n \"Preferably, the polymer material of the primary filter may be selected from the group consisting of Polyester, Polyethylene (PE), Polypropylene (PP) or high density fabric (i.e.\",\n \"FILTRON™) due to its ability to remove suspended solid, rust and filter off particles of 10 microns and above.\",\n \"FILTRON™ filter fabric is a high density-type fabric with small pore size of 10 microns and air permeability rate of ˜20%.\",\n \"Other filtration medium that can achieve this can also be used instead.\",\n \"The second stage of filtration is the secondary filter (114).\",\n \"The secondary filter (114) comprises of multiple layers of activated balls (145, 147) arranged within a second storage tank (108b), whereby the multiple layers of balls are divided by a spacer (130).\",\n \"An end cap (132) is affixed to a top portion of a central pipe (140) to prevent the activated balls from flowing into the central pipe during the filtration process.\",\n \"The balls are energy balls preferably made of ceramic (145, 147) with the presence of ceramic mineral which emits a large amount of anions and far-infrared rays.\",\n \"The energy balls can treat water to produce smaller water cluster, removes bad odors, and increases dissolved oxygen in water.\",\n \"The third stage of filtration is the tertiary filter.\",\n \"The tertiary filter (116) contains magnetic energy ceramics balls and mineral stones held in elongated cylindrical filter cartridge which is aligned to be coaxial with longitudinal axis of the hollow filter handle (117).\",\n \"The magnetic energy ceramic balls are made of mineral materials (i.e.\",\n \"ferrite) and other functional materials such as silicon nitride and zirconium dioxide through high temperature sintering which combines with a permanent magnetic particulate.\",\n \"The magnetic energy ceramics balls and mineral stones of the tertiary filter (116) activates the water molecules in such a way that the water changes to magnetized water upon flowing through the magnetic energy ceramic balls results in changes of physical and chemical properties of water due to electromagnetic induction in the magnetic field.\",\n \"The water molecules that undergo activation treatment by magnetic field or bio-ceramic stones will transform into smaller clusters of water molecules.\",\n \"Such water molecules can easily absorb by the human body and magnetized water may activate certain enzyme activity.\",\n \"In use, the water flows from the water inlet (180a) at the bottom of the first water storage tank (108a) and subsequently the water flows upwards through the primary filter (112) for removal of chlorine and suspended solid.\",\n \"The filtered water is then overflows within the first water storage tank (108a) causing the filtered water to flow down through the central pipe of the primary filter's holder which is connected to the water inlet (180c) of the second water storage tank (108b) through a coupling member (122).\",\n \"Next, the filtered water flows upward through multiple layers of activated balls of the secondary filter (114).\",\n \"The overflow of filtered water within the second water storage tank (108b) directs the filtered water to flow downwards through the central pipe (140) to a water outlet (180d) at the bottom of the second water storage tank (108b).\",\n \"The filtered water is flowed through the flexible hose (150) for further filtration by tertiary filter (116) which is embedded within the hollow filter handle (117) before exiting through the shower head (120).\",\n \"The present embodiments are considered as merely illustrative and not restrictive, the description to the preferred embodiments of the invention is merely to facilitate discussion of the present invention and it is envisioned without departing from the scope of the appended claims.\",\n \"Unless the context requires otherwise or specifically stated to the contrary, integers, steps or elements of the invention recited herein as singular integers, steps or elements clearly encompass both singular and plural forms of the recited integers, steps or elements.\",\n \"Throughout this specification, unless the context requires otherwise, the word “comprise”, or variations such as “comprises” or “comprising”, will be understood to imply the inclusion of a stated step or element or integer or group of steps or elements or integers, but not the exclusion of any other step or element or integer or group of steps, elements or integers.\",\n \"Thus, in the context of this specification, the term “comprising” is used in an inclusive sense and thus should be understood as meaning “including principally, but not necessarily solely”.\"\n ]\n]"},"source":{"kind":"string","value":"Patent_15871410"}}},{"rowIdx":4493784,"cells":{"text":{"kind":"list like","value":[["VEHICULAR COMMUNICATIONS NETWORK AND METHODS OF USE AND MANUFACTURE THEREOF","Some embodiments are directed to a computer-implemented method for controlling a vehicle and includes determining a current environment of the vehicle based on a current location of the vehicle, and detecting vulnerable road users (VRUs) disposed in proximity to the vehicle based on messages communicated using a vehicular communications network.","The method includes modifying a collision warning system of the vehicle according to the current environment of the vehicle and a number of the detected VRUs."],["1.A computer-implemented method for controlling a vehicle, comprising: determining a current environment of the vehicle based on a current location of the vehicle; detecting vulnerable road users (VRUs) disposed in proximity to the vehicle based on messages communicated using a vehicular communications network; and modifying a collision warning system of the vehicle according to the current environment of the vehicle and a number of the detected VRUs.","2.The computer-implemented method of claim 1, including setting a warning mode of the collision warning system based on the current environment of the vehicle.","3.The computer-implemented method of claim 1, wherein the current environment of the vehicle is a classification of a path on which the vehicle is traveling.","4.The computer-implemented method of claim 1, wherein the current environment of the vehicle is at least one of a rural zone, a suburban zone, and an urban zone.","5.The computer-implemented method of claim 1, including sensing entity movement of the detected VRUs relevant to a path on which the vehicle is traveling, and modifying the collision warning system of the vehicle according to the entity movement.","6.The computer-implemented method of claim 1, including determining whether the number of the detected VRUs indicates high pedestrian traffic according to the current environment of the vehicle.","7.The computer-implemented method of claim 1, including determining a predetermined threshold number of VRUs for the current environment of the vehicle.","8.The computer-implemented method of claim 7, wherein the predetermined threshold number of VRUs indicates high pedestrian traffic for the current environment of the vehicle either simultaneously or over a predefined time period.","9.The computer-implemented method of claim 1, wherein upon determining the number of detected VRUs exceeds a predetermined threshold number of VRUs, modifying the collision warning system includes adjusting a frequency of alerts thereby generating the alerts less frequently.","10.The computer-implemented method of claim 1, wherein upon determining the number of detected VRUs exceeds a predetermined threshold number of VRUs, modifying the collision warning system includes changing a type of alert to display information about the VRUs on a driver vehicle interface.","11.The computer-implemented method of claim 1, including detecting a transition from the current environment to a new environment, and modifying the collision warning system of the vehicle according to the new environment.","12.A vehicle system of a vehicle traveling along a path, comprising: a geographic position component that is configured to detect vehicle location data of the vehicle; at least one transceiver operably connected for communication with a vehicular communications network, the transceiver configured to receive vehicle-to-pedestrian (V2P) signals from vulnerable road users (VRUs); a driver vehicle interface that is configured to communicate information to a vehicle operator; and a processor that is configured to: determine a current environment and a current location of the vehicle based on the vehicle location data, determine a number of VRUs disposed in proximity to the vehicle based on the V2P signals, and modify the vehicle system according to the current environment of the vehicle and the number of VRUs.","13.The vehicle system of claim 12, including at least one sensor that is configured to sense current path data relevant to current conditions of the path, wherein the current path data includes entity movement of the VRUs relevant to the path, wherein the processor is configured to determine an event pattern of entity movement of the VRUs relevant to the current location of the vehicle, and modify the vehicle system according to the event pattern.","14.The vehicle system of claim 12, wherein the current environment of the vehicle is at least one of a rural zone, a suburban zone, and an urban zone.","15.The vehicle system of claim 12, wherein the processor is configured to determine a predetermined threshold number of VRUs indicating high pedestrian traffic for the current environment of the vehicle.","16.The vehicle system of claim 15, wherein the processor is configured to modify a frequency of alerts of the vehicle system communicated by the driver vehicle interface based on the predetermined threshold number of VRUs and the determined number of VRUs.","17.A vehicular communications network for use with a vehicle configured for travel along a path, at least one source of vehicle location data, and at least one source of current path data relevant to current conditions of the path, the vehicular communications network comprising: a processor that is configured to: access the vehicle location data and the current path data; determine a current environment of the vehicle based on the vehicle location data; detect vulnerable road users (VRUs) disposed in proximity to the vehicle based on the current path data; and modify a driver vehicle interface according to the current environment of the vehicle and a number of the detected VRUs.","18.The vehicular communications network of claim 17, wherein the processor is configured to determine an event pattern of entity movement of the detected VRUs indicating a potential of the detected VRUs to move onto the path based on the current path data, and wherein the processor is configured to modify the driver vehicle interface according to the event pattern.","19.The vehicular communications network of claim 17, wherein the processor is configured to set a warning mode of a collision warning system of the vehicle based on the current environment of the vehicle.","20.The vehicular communications network of claim 17, wherein the processor is configured to modify the driver vehicle interface by adjusting a frequency of alerts provided by the driver vehicle interface as a function of the number of the detected VRUs."],[" BACKGROUND The disclosed subject matter relates to vehicular communications networks and methods of use and manufacture thereof.","In particular, some embodiments relate to methods and apparatus for generating, transmitting, and/or receiving data along a vehicular communications network relating to a vehicle's location and/or path or route of travel.","Various conditions may be relevant to a vehicle's travel along a path or route.","For example, in the context of vehicles that travel over land, such as an automobile configured for travel along a road, a vast array of circumstances may arise that can affect or otherwise be relevant to the vehicle's travel.","An entity, such as another vehicle, pedestrian, bicyclist, etc., may move to a location immediately in front of the vehicle on the road, causing the vehicle to contact the entity unless the vehicle stops, changes course, etc.","As another example, other types of circumstances may arise making it preferable to change the vehicle's path or route of travel, such as to enable the vehicle to arrive at a certain destination more safely, quickly, efficiently, etc.","Changing traffic patterns may make a vehicle's current path of travel more congested, and thus a different path may be preferable.","Vehicles may be provided with methods and apparatus for addressing the above conditions.","For example, sensors can be mounted on vehicles to detect entities currently disposed in the vehicle's immediate path of travel for the purpose of warning the vehicle's operator to take action to avoid crashing into the entity.","Vehicular operators may also utilize global positioning systems (GPSs) to determine currently effective routes of travel, and even modify these routes based on changing traffic conditions.","In other words, current conditions can be monitored for the purpose of benefitting vehicular operators."],[" SUMMARY The monitoring and use of data other than currently sensed or real time data may further benefit vehicular operators.","For example, historical data may be used to provide further guidance, such as to advise vehicular operators to change travel routes.","As one example, a certain route may be very congested at certain times and/or days of the week (such as during a weekday rush hour), making it more effective to take another (albeit longer) route that is less congested at the relevant time, day, etc.","Historical data relating to the physical conditions of certain roads, bridges, etc.","at certain times, days of the week, etc.","may also affect route selection.","Historical data may be used to select enhanced routes of travel based on safety issues that may arise at certain times of day, days of the week, times of the year, etc., such as to avoid certain roads during times of the year where treacherous conditions may exist, e.g., ice, snow, flooding, etc.","Historical data by itself may be used to determine that a trend or pattern at a certain time, day of the week, time of the year, etc., at a certain location along a vehicle's path or route is likely to occur.","As one example, pedestrians, bicyclists, etc., may tend to illegally cross a street at certain times of day (such as when a local school releases its students), or automobiles may tend to illegally fail to stop for a red light of an intersection at certain times of day (such as near the time when workers need to arrive at a local office).","This trend or pattern may be used to alert a vehicle operator of these potentially dangerous conditions if the vehicle will be traveling proximate these locations at the relevant times, etc.","However, the trend or pattern that is determined based solely on the historical data may frequently be inaccurate, and thus may result in unnecessarily alerting the vehicle operator and thus needlessly annoying or distracting the vehicle operator.","In addition, the effectiveness of historical data alone may be limited to predictable events, such as the regular closure of roads, bridges, etc., or regular traffic patterns.","However, some traffic patterns or road hazards do not follow regular or predictable schedules, and may change periodically.","It may therefore be beneficial to combine historical data with other data, or otherwise use historical data more dynamically, such as to address less predictable events.","For example, trends or patterns can be determined based on historical data collected from one or multiple sources, and the relevance of these trends or patterns can be predicted based on other types of data, such as data relating to current conditions.","It may therefore be even more beneficial to supplement the trends or patterns that are determined based on historical data with more relevant or current data.","In other words, it may be beneficial to warn a vehicle operator where both of the following occur: 1) historical data indicates that a certain trend exists that may be relevant to the vehicle's travel along the path or route; and 2) currently sensed or other data indicates an increased likelihood that the trend will occur.","For example, using data indicating the existence of an entity relevant to the trend, such as an actual bicycle or pedestrian approaching a road where bicyclists or pedestrians trend to cross illegally, or the approach of an actual automobile to an intersection where automobiles tend to fail to stop at red lights, may provide vehicular operators with even better or more effective information.","Some embodiments are therefore directed to ascertaining a potential road hazard or collision with another entity, such as a vehicle, pedestrian, or wildlife, and sharing the information within a vehicle communication network.","Some embodiments are directed to data logging of unexpected or incompliant actual or potential road hazards and scenarios into a database for integration with a vehicle collision warning system.","Embodiments include making a determination of a potential road hazard that could become a collision event, data logging potential road hazards, vehicle data, traffic and vehicle data from other vehicles and users, and environmental data external to a vehicle, predicting a road hazard based on patterns of collected data, and methods of sharing alert information with other vehicles and users in a vehicle communication network.","More particularly, some embodiments are directed to a computer-implemented method for controlling a vehicle, and includes determining a current environment of the vehicle based on a current location of the vehicle, and detecting vulnerable road users (VRUs) disposed in proximity to the vehicle based on messages communicated using a vehicular communications network.","The method includes modifying a collision warning system of the vehicle according to the current environment of the vehicle and a number of the detected VRUs.","Some other embodiments are directed to a vehicle system of a vehicle traveling along a path.","The vehicle system includes a geographic position component that is configured to detect vehicle location data of the vehicle, at least one transceiver operably connected for communication with a vehicular communications network that is configured to receive vehicle-to-pedestrian (V2P) signals from vulnerable road users (VRUs), and a driver vehicle interface that is configured to communicate information to a vehicle operator.","Further, the vehicle system includes a processor that is configured to determine a current environment and a current location of the vehicle based on the vehicle location data, and determine a number of VRUs disposed in proximity to the vehicle based on the V2P signals.","The processor is configured to modify the vehicle system according to the current environment of the vehicle and the number of VRUs.","Still other embodiments are directed to a vehicular communications network for use with a vehicle configured for travel along a path, at least one source of vehicle location data, and at least one source of current path data relevant to current conditions of the path.","The vehicular communications network includes a processor that is configured to access the vehicle location data and the current path data, determine a current environment of the vehicle based on the vehicle location data, and detect vulnerable road users (VRUs) disposed in proximity to the vehicle based on the current path data.","The processor is configured to modify a driver vehicle interface according to the current environment of the vehicle and a number of the detected VRUs."],["This application is a continuation U.S. application Ser.","No.","15/073,598 filed on Mar.","17, 2016, which is expressly incorporated herein by reference.","BACKGROUND The disclosed subject matter relates to vehicular communications networks and methods of use and manufacture thereof.","In particular, some embodiments relate to methods and apparatus for generating, transmitting, and/or receiving data along a vehicular communications network relating to a vehicle's location and/or path or route of travel.","Various conditions may be relevant to a vehicle's travel along a path or route.","For example, in the context of vehicles that travel over land, such as an automobile configured for travel along a road, a vast array of circumstances may arise that can affect or otherwise be relevant to the vehicle's travel.","An entity, such as another vehicle, pedestrian, bicyclist, etc., may move to a location immediately in front of the vehicle on the road, causing the vehicle to contact the entity unless the vehicle stops, changes course, etc.","As another example, other types of circumstances may arise making it preferable to change the vehicle's path or route of travel, such as to enable the vehicle to arrive at a certain destination more safely, quickly, efficiently, etc.","Changing traffic patterns may make a vehicle's current path of travel more congested, and thus a different path may be preferable.","Vehicles may be provided with methods and apparatus for addressing the above conditions.","For example, sensors can be mounted on vehicles to detect entities currently disposed in the vehicle's immediate path of travel for the purpose of warning the vehicle's operator to take action to avoid crashing into the entity.","Vehicular operators may also utilize global positioning systems (GPSs) to determine currently effective routes of travel, and even modify these routes based on changing traffic conditions.","In other words, current conditions can be monitored for the purpose of benefitting vehicular operators.","SUMMARY The monitoring and use of data other than currently sensed or real time data may further benefit vehicular operators.","For example, historical data may be used to provide further guidance, such as to advise vehicular operators to change travel routes.","As one example, a certain route may be very congested at certain times and/or days of the week (such as during a weekday rush hour), making it more effective to take another (albeit longer) route that is less congested at the relevant time, day, etc.","Historical data relating to the physical conditions of certain roads, bridges, etc.","at certain times, days of the week, etc.","may also affect route selection.","Historical data may be used to select enhanced routes of travel based on safety issues that may arise at certain times of day, days of the week, times of the year, etc., such as to avoid certain roads during times of the year where treacherous conditions may exist, e.g., ice, snow, flooding, etc.","Historical data by itself may be used to determine that a trend or pattern at a certain time, day of the week, time of the year, etc., at a certain location along a vehicle's path or route is likely to occur.","As one example, pedestrians, bicyclists, etc., may tend to illegally cross a street at certain times of day (such as when a local school releases its students), or automobiles may tend to illegally fail to stop for a red light of an intersection at certain times of day (such as near the time when workers need to arrive at a local office).","This trend or pattern may be used to alert a vehicle operator of these potentially dangerous conditions if the vehicle will be traveling proximate these locations at the relevant times, etc.","However, the trend or pattern that is determined based solely on the historical data may frequently be inaccurate, and thus may result in unnecessarily alerting the vehicle operator and thus needlessly annoying or distracting the vehicle operator.","In addition, the effectiveness of historical data alone may be limited to predictable events, such as the regular closure of roads, bridges, etc., or regular traffic patterns.","However, some traffic patterns or road hazards do not follow regular or predictable schedules, and may change periodically.","It may therefore be beneficial to combine historical data with other data, or otherwise use historical data more dynamically, such as to address less predictable events.","For example, trends or patterns can be determined based on historical data collected from one or multiple sources, and the relevance of these trends or patterns can be predicted based on other types of data, such as data relating to current conditions.","It may therefore be even more beneficial to supplement the trends or patterns that are determined based on historical data with more relevant or current data.","In other words, it may be beneficial to warn a vehicle operator where both of the following occur: 1) historical data indicates that a certain trend exists that may be relevant to the vehicle's travel along the path or route; and 2) currently sensed or other data indicates an increased likelihood that the trend will occur.","For example, using data indicating the existence of an entity relevant to the trend, such as an actual bicycle or pedestrian approaching a road where bicyclists or pedestrians trend to cross illegally, or the approach of an actual automobile to an intersection where automobiles tend to fail to stop at red lights, may provide vehicular operators with even better or more effective information.","Some embodiments are therefore directed to ascertaining a potential road hazard or collision with another entity, such as a vehicle, pedestrian, or wildlife, and sharing the information within a vehicle communication network.","Some embodiments are directed to data logging of unexpected or incompliant actual or potential road hazards and scenarios into a database for integration with a vehicle collision warning system.","Embodiments include making a determination of a potential road hazard that could become a collision event, data logging potential road hazards, vehicle data, traffic and vehicle data from other vehicles and users, and environmental data external to a vehicle, predicting a road hazard based on patterns of collected data, and methods of sharing alert information with other vehicles and users in a vehicle communication network.","More particularly, some embodiments are directed to a computer-implemented method for controlling a vehicle, and includes determining a current environment of the vehicle based on a current location of the vehicle, and detecting vulnerable road users (VRUs) disposed in proximity to the vehicle based on messages communicated using a vehicular communications network.","The method includes modifying a collision warning system of the vehicle according to the current environment of the vehicle and a number of the detected VRUs.","Some other embodiments are directed to a vehicle system of a vehicle traveling along a path.","The vehicle system includes a geographic position component that is configured to detect vehicle location data of the vehicle, at least one transceiver operably connected for communication with a vehicular communications network that is configured to receive vehicle-to-pedestrian (V2P) signals from vulnerable road users (VRUs), and a driver vehicle interface that is configured to communicate information to a vehicle operator.","Further, the vehicle system includes a processor that is configured to determine a current environment and a current location of the vehicle based on the vehicle location data, and determine a number of VRUs disposed in proximity to the vehicle based on the V2P signals.","The processor is configured to modify the vehicle system according to the current environment of the vehicle and the number of VRUs.","Still other embodiments are directed to a vehicular communications network for use with a vehicle configured for travel along a path, at least one source of vehicle location data, and at least one source of current path data relevant to current conditions of the path.","The vehicular communications network includes a processor that is configured to access the vehicle location data and the current path data, determine a current environment of the vehicle based on the vehicle location data, and detect vulnerable road users (VRUs) disposed in proximity to the vehicle based on the current path data.","The processor is configured to modify a driver vehicle interface according to the current environment of the vehicle and a number of the detected VRUs.","BRIEF DESCRIPTION OF THE DRAWINGS The disclosed subject matter of the present application will now be described in more detail with reference to exemplary embodiments of the apparatus and method, given by way of example, and with reference to the accompanying drawings, in which: FIG.","1 is a schematic of a traffic scenario that involves an intersection.","FIG.","2 is a schematic of a vehicle communication network according to aspects of the embodiments.","FIG.","3 is a schematic of an embodiment for a service provider of the vehicle communication network of FIG.","2.FIG.","4 is a schematic of a collision warning system of the vehicle communications network shown in FIG.","2.FIG.","5 is a schematic of vehicle systems that can be associated with the collision warning system of FIG.","4.FIG.","6 is a schematic of an exemplary design of a vehicle interior associated with the collision warning system of FIG.","4.FIG.","7 is a flowchart of an exemplary method to inform a vehicle of potential collision events in conjunction with the collision warning system of FIG.","4.FIG.","8 is a flowchart of an exemplary method to predict potential collision events and alert a vehicle in conjunction with the collision warning system of FIG.","4.FIG.","9 is a flowchart of an exemplary method for receiving and classifying new event data in conjunction with the collision warning system of FIG.","4.FIG.","10 is a functional flowchart of an exemplary method for comparing new event data with patterns of prior event data events in conjunction with the collision warning system of FIG.","4.FIG.","11 illustrates an embodiment of the collision warning system of FIG.","4 alerting a vehicle of potential collision scenarios with pedestrians.","FIG.","12 illustrates an embodiment of the collision warning system of FIG.","4 alerting a vehicle of a potential collision scenario with a bicycle.","FIG.","13 illustrates an embodiment of the collision warning system of FIG.","4 alerting a vehicle of a potential collision scenario with wildlife.","FIG.","14 is a flowchart of a method for configuring the collision warning system of FIG.","4 based on an environment.","FIG.","15 is a flowchart of a method to update event data at the collision warning system of FIG.","4 by the service provider of FIG.","3.FIG.","16 is a flowchart of an exemplary method for transmitting event data to the service provider of FIG.","3.DETAILED DESCRIPTION OF EXEMPLARY EMBODIMENTS A few inventive aspects of the disclosed embodiments are explained in detail below with reference to the various figures.","Exemplary embodiments are described to illustrate the disclosed subject matter, not to limit its scope, which is defined by the claims.","Those of ordinary skill in the art will recognize a number of equivalent variations of the various features provided in the description that follows.","I.","Overall Vehicle Communication Network Some of the disclosed embodiments relate to a vehicle communication network that is disclosed below in the context of a traffic scenario 100.This scenario may involve one or more users and vulnerable road users (VRUs).","The users can include vehicles, and the VRUs can include pedestrians, automobiles, trucks, vans, minivans, sport utility vehicles (SUVs), busses, recreational vehicles, amusement park vehicles, trams, golf carts, robotically controlled vehicles, automated drive vehicles, remote controlled vehicles, drones, motorcycles, scooters, mopeds, bicycles, ATVs, roadside units, transportable objects, trains, trams, light rail trains, boats, personal watercraft, aircraft, helicopters, or any transport related entity or infrastructure.","In fact, the various disclosed methods and apparatus are intended to be usable with any type of user and/or mode of transport that can travel along, or can be located in proximity to, any improved, unimproved, and/or unmarked path.","The disclosed vehicle communication network is intended to be implemented with any known, related art or later developed technologies.","For example, the implemented technologies can involve ad hoc networks, Dedicated Short Range Communications (DSRC) networks (including but not limited to those types of networks currently used by some transport and traffic systems, such as for automatic toll collection), wireless access in vehicular environments (WAVE), cellular networks, Wi-Fi networks, and/or any other network protocol that can provide the desired functionalities.","Some of the embodiments are disclosed below in the context of a DSRC, which is a short to medium range communications service that provides communications links with high data transfer rates with acceptable or minimal latency.","Vehicles, users, and infrastructure equipped with DSRC systems may communicate with each other, with remote DSRC compatible transceivers over a network, or with road side equipment (such as transport related infrastructure).","The range of DSRC is typically about 300 meters, with some systems having a maximum range of about 1000 meters.","DSRC in the United States typically operates in the 5.9 GHz range, from about 5.85 GHz to about 5.925 GHz, and the typical latency for DSRC is about 50 ms.","Some DSRC systems communicate with vehicles operating at 100 miles per hour or less, but embodiments are intended to cover communications with vehicles traveling at any speed.","FIG.","1 is a schematic of a traffic scenario 100 that involves an intersection 102.Various users, VRUs, and vehicle communication network components can be disposed at or proximate the disclosed intersection 102, including a vehicle 104, a remote vehicle 110, road side equipment (RSE) 112 and 116, a bicycle 120, a single pedestrian 126, a school bus 134, a group of pedestrians 138, and a motorcycle 130.However, the above users, VRUs, and components are merely provided for exemplary purposes to facilitate explanation of the disclosed vehicle communication network, and alternative or additional features may be provided.","For example, FIG.","1 also shows a bicycle lane 124 along which the bicycle 120 travels.","In addition, FIG.","1 shows a cellular network antenna 142 for use with the vehicle communication network.","The vehicle 104 can transmit, receive and/or exchange communications including data, images, messages, and other information with other vehicles and VRUs using the DSRC network, which can be implemented with DSRC compatible transceivers, such as V2X compatible transceivers.","“V2X” is used in the present disclosure to cover “vehicle-to-everything” communications, and variations of V2X designations may depend on the intended user that is transmitting V2X signals.","As shown in FIG.","1, vehicle 104 may be equipped with a vehicle to vehicle (V2V) transceiver 106 that can exchange messages and information with other users equipped with DSRC compatible transceivers.","For example, the V2V transceiver 106 can communicate with remote vehicle 110 via a V2V (vehicle to vehicle) transceiver 108, bicycle 120 via a V2B (vehicle to bicycle) transceiver 122, pedestrian 126 via a V2P (vehicle to pedestrian) transceiver 128, motorcycle 130 via a V2M (vehicle to motorcycle) transceiver 132, school bus 134 via a V2V transceiver 136, and pedestrians 138 via V2P transceivers 140.RSEs 112 and 116 are each equipped with V2I transceivers 114 and 118, respectively, which can be used to transmit information from any type of traffic infrastructure, such as traffic signals, or traffic sensors for speed or road conditions, etc.","The V2V transceiver 106 may include components for communicating various types of information between vehicle 104 and other network connected vehicles, VRUs, infrastructure, and networks.","In some embodiments, V2V transceiver 106 is intended to be used with one or more vehicle safety systems.","Examples of vehicle safety systems include, but are not limited to, collision warning systems, lane departure warning systems, integrated vehicle-based safety systems, automatic guided vehicle systems, other types of safety systems, etc.","In some embodiments, vehicle 104 may exchange information between one or more remote vehicles 110.For example, vehicle 104 V2V transceiver 106 and remote vehicle 110 V2V transceiver 108 may be configured to exchange vehicle information that can include, but is not limited to, the type of user or vehicle, navigation data, road hazard data, collision warning data, course heading data, course history data, projected course data, kinematic data, current position data, range or distance data, speed and acceleration data, location data, vehicle sensory data, vehicle subsystem data, and/or any other vehicle information.","In various embodiments, vehicle 104 may exchange information using V2X protocols with any number of vehicles, pedestrians, or any other V2X users with an operational V2X transceiver.","For example, vehicle 104, remote vehicle 110, motorcycle 130, and school bus 134 may be configured to exchange information over V2X protocols.","FIG.","2 is a schematic of a vehicle communication network 200 according to some the embodiments.","Each V2X compatible user can exchange messages with any or all other V2X compatible users.","As an example, vehicle 104 V2V transceiver 106 may exchange messages with V2V transceiver 108 installed in remote vehicle 110 and/or with V2P transceiver 128 carried by pedestrian 126.V2X messages can describe any collection or packet of information and/or data that can be transmitted over vehicle communication network 200.Messages may take the form of basic safety messages and/or may contain more information than basic safety messages, such as commands that can control another vehicle's automated driving system.","V2X messages may include any number of bytes of information or data.","Some of the embodiments are intended to include exchanging information and messages between networked vehicles and VRUs that may be useful in facilitating vehicle safety.","For example, the information may be useful for a particular vehicle in order to warn a vehicle or broadcast a warning to a group of V2X users.","Vehicle 104 includes a collision warning system (CWS) 202 that can receive and assess safety information and data.","The CWS 202 can constitute an implementation of a collision avoidance technology to assess the risk of a collision of the subject vehicle with another vehicle, pedestrian, entity, etc., and can alert a driver through visual and audible warnings.","Components of CWS 202 can exchange safety messages, warnings and alerts, and/or other useful information with V2X users via V2V transceiver 106.CWS 202 may transmit and receive information directly or indirectly to and from a service provider 212 over a wireless communication network 204.In one embodiment, vehicle 104 is connected with the service provider 212 by way of a one-to-many communication network 222.In an embodiment, the service provider 212 includes a remote server 214, a remote transmitter 216, a remote receiver 218, and a remote memory 220 that are configured to be in communication with one another.","The one-to-many communication network 222 can include systems that can send information from one source to a plurality of receivers.","Examples of one-to-many communication networks can include television, radio, satellite networks, etc.","In FIG.","2, V2V transmitter 106 can be used by the CWS 202 to receive and transmit information to and from the service provider 212 and other information providers through wireless communication network 204 and broadband network 210, such as the Internet.","In alternative embodiments, an RF transceiver 224 can be used by the CWS 202 to receive and transmit information to and from the service provider 212 through wireless communication network 204 and broadband network 210, such as the Internet.","RF transmitter 224 can include, but is not limited to, a wireless phone, a wireless modem, a Wi-Fi compatible transceiver, and/or any other device that communicates with other networks using a wireless communication network 204.V2V transmitter 106 can also receive and transmit information to and from traffic data supplier 206 and/or other information supplier 208.This information can include, but is not limited to, train schedules, high-traffic event schedules, other transport related data, etc.","Traffic data supplier 206 and other information supplier 208 can communicate with service provider 212 through network 210.In an embodiment, service provider 212 may be linked to vehicles through a network connection, such as via cellular network antenna 142 (see FIG.","1), and/or other network connection.","Further, any other wireless communication system capable of delivering data may be used such as satellite Wi-Fi, WiMAX, microwave, etc.","Service provider 212 may also be linked by a wired connection, such as broadband cable or fiber optic connections, Ethernet, DSL, ADSL, telephone modems, and/or any other wired communication system capable of delivering data.","Some of the embodiments are intended to include each V2X transceiver configured to communicate with wireless communication network 204 through cellular network antenna 142, or I2V (infrastructure-to-vehicle) network connection.","II.","Service Provider FIG.","3 is a schematic of an embodiment of service provider 212 of the vehicle communication network 200.In FIG.","3, service provider 212 may include a computer controlled service provider network 300, a forward collision warning (FCW) server 302, and a forward collision warning (FCW) database 306.FWC server 302 and FCW database 306 may communicate, through service provider network connections 304 and 308, respectively, to service provider network 300.Alternatively, this communication can be performed directly.","The service provider network 300 can be capable of communicating with one or more internal and external computer or communication networks, computer systems, or controller systems.","In some embodiments, FCW database 306 is stored on FCW server 302.However in other embodiments, FCW database 306 may be partially or fully located remote from service provider 212.FCW server 302 and FCW database 306 can include processors, memory, and instructions to operate as a computer.","FCW server 302 may interact with FCW database 306 to access collision event data and/or information, such as graphics, maps, images, videos, navigational data, or any other data that can be useful to collision warning system 202.FCW database 306 may be organized using any known, related art and/or later developed data storage method and/or structure.","FCW database 306 may include hard drives, flash drives, magnetic drives with removable storage media, such as disks or tape, or optical drives with removable storage media, such as discs, memory sticks, memory cards, embedded or discrete flash memory, and/or any other type of memory.","Event data may be transmitted to service provider 212 either wirelessly or through wired connections in any manner known or presently unknown the art, such as via transmitter/receiver 322 shown in FIG.","3.Event data may be received wirelessly via first, second, and third data providers 310, 312, 314, which can be users in vehicle communication network 200 transmitting event data.","For example, vehicle 104, remote vehicle 110, bicycle 120, pedestrian 126, and motorcycle 130 can transmit real time event data that is received and processed by FCW server 302.The embodiments are intended to also include event data provided via fourth, fifth, and sixth data providers 316, 318, 320, which may include data from commercial information providers, traffic data providers, web cams, or government agencies (such as a state or federal departments of transportation).","Fourth, fifth, and sixth data providers 316, 318, 320 can provide location and traffic information to service provider 212, such as school locations and schedules, bicycle zones, construction projects, temporary road closings, train locations and schedules, weather updates, major events, such as concerts and athletic competitions, and/or navigation map feature updates.","III.","Collision Warning System FIG.","4 is a schematic of the CWS 202 of the vehicle 104 of FIG.","2.However, the disclosed CWS 202 may be associated with other vehicles or used in other applications.","Other collision warning systems associated with some vehicles may include different elements and/or arrangements as configured to collision warning system 202, but may be configured to communicate over vehicle communication network 200 with one or more other collision warning systems 202.The CWS shown in FIG.","4 is designated with reference number 400 to clearly express the intention to also or alternatively use the system by other entities or in other applications.","The vehicle 104 may have one or more computers, such as a collision warning computer system 404 (“computer system”) containing a processor 406, a memory 408 and other components typically present in general or special purpose computers.","In some embodiments, the CWS 400 may include programmable logic circuits and/or pre-configured logic circuits for executing collision warning system functions.","The memory 408 stores information accessible by processor 406 including instructions 410 and data 412 that may be executed or otherwise used by the processor 406.The control logic (in this example, software instructions or computer program code), when executed by processor 406, causes processor 406 to perform the functions of the embodiments as described herein.","The memory 408 may be of any type capable of storing information accessible by the processor, including a computer-readable medium, or other medium that stores data that may be read with the aid of an electronic device, such as a hard-drive, flash drive, memory card, ROM, RAM, DVD or other optical disks, as well as other write-capable and read-only memories.","Systems and methods may include different combinations of the foregoing, whereby different portions of the instructions and data are stored on different types of media.","The instructions 410 may be any set of instructions to be executed directly (such as machine code) or indirectly (such as scripts) by the processor 406.For example, the instructions may be stored as computer code on the computer-readable medium.","In this regard, the terms “instructions” and “programs” may be used interchangeably herein.","The instructions may be stored in object code format for direct processing by the processor, or in any other computer language including scripts or collections of independent source code modules that are interpreted on demand or compiled in advance.","Functions, methods and routines of the instructions are explained in more detail below.","Data 412 may be retrieved, stored or modified by processor 406 in accordance with the instructions 410.For instance, although the system is not limited by any particular data structure, the data may be stored in computer registers, in a relational database as a table having a plurality of different fields and records, XML documents or flat files.","The data may also be formatted in any computer-readable format.","The data may include any information sufficient to identify the relevant information, such as numbers, descriptive text, proprietary codes, references to data stored in other areas of the same memory or different memories (including other network locations) or information that is used by a function to calculate the relevant data.","The processor 406 may be any known, related art or later developed processor.","Alternatively, the processor may be a dedicated device, such as an ASIC or DSP.","Although FIG.","4 illustrates the processor 406, memory 408, and other elements of computer system 404 as being within the same block, it will be understood by those of ordinary skill in the art that the processor 406 and memory 408 may actually include multiple processors and memories that may or may not be stored within the same physical housing.","For example, memory 408 may be a hard drive or other storage media located in a housing that is different from that of computer system 404.Accordingly, references to a processor or computer will be understood to include references to a collection of processors, computers or memories that may or may not operate in parallel.","Rather than using a single processor to perform the steps described herein, some of the components, such as steering components and deceleration components, may each have their own processor that only performs calculations related to the component's specific function.","In an alternative embodiment, the processor 406 may be located remote from the vehicle 104 and communicate with the vehicle wirelessly.","In the embodiments, some of the processes described herein are executed on a processor disposed within the vehicle 104, and others by a remote processor.","Computer system 404 may include all of the components normally used in connection with a computer, such as a central processing unit (CPU) (e.g.","processor 406), the memory 408 (e.g., RAM and internal hard drives) storing data 412 and instructions 410, such as a web browser, a display device 426 (e.g., a monitor having a screen, a small LCD touch-screen or any other electrical device that is operable to display information), user input device 424 (e.g., a mouse, keyboard, touch screen and/or microphone), as well as various sensors (e.g.","a video camera) for gathering sensor data as collision event data.","The computer system 404 can also include components not normally associated with general purpose computers, such as object detection component 428.The computer system 404 may be capable of communicating with various components of the vehicle 104.For example, computer system 404 may be in communication with the vehicle's electronic control unit (ECU) 402 and may send and receive information from the various systems of vehicle 104, for example a vehicle subsystem sensor system 430, a vehicle communication system 432, a vehicle event sensor system 434, and a vehicle navigation system 436.When engaged, computer system 404 may control some or all of these functions of vehicle 104.It will be understood that, although various systems and computer system 404 are shown within vehicle 104, these elements may be external to vehicle 104 and/or physically separated by large distances.","As indicated above, the vehicle 104 may also include the vehicle subsystem sensor system 430.The computer system 404 may communicate with sensors in one or more vehicle subsystems in order to calculate levels of potential collision risks based on speed, direction, acceleration, braking, and/or other factors.","The vehicle subsystem sensor system 430 may include, but is not limited to, engine oil/coolant sensing systems, transmission oil sensing systems, brake sensing systems, steering and control sensing systems, fuel storage sensing systems, torque sensors, and speed and acceleration/deceleration sensors, and inertia (yaw) sensor systems.","As indicated above, the vehicle 104 may also include the vehicle communication system 432.The computer system 404 may communicate with external communication apparatus for sending and receiving collision event data.","For instance, the vehicle communication system 432 includes vehicle V2V transceiver 106 that can communicate with compatible V2X transceivers in the vehicle communication network 200.As described previously in relation to FIG.","2, the vehicle communication system 432 can include the RF transceiver 224 for communicating wirelessly to service provider 212 or traffic data supplier 206 through wireless network 204.As further indicated above, the vehicle 104 may also include the vehicle event sensor system 434 for collecting event data.","Event data can include detecting the location, orientation, heading, etc., of entities external to the vehicle 104, such as other vehicles, bicycles, and motorcycles, pedestrians, obstacles in the roadway, traffic signals, signs, wildlife, trees, or any entity that can provide information to collision warning system 400.The phrases “event data” and “collision event data” can include any data related to an entity or situation, such as a vehicle, person, environmental scenario, or wildlife that is a road hazard, potential road hazard, predicted road hazard, probably road hazard, or unknown road hazard that can be a danger to a moving vehicle or other entity.","In alternative embodiments, the phrases “event data” and “collision event data” can include any data related to entities or sensed data a vehicle's environment that is useful for the collision warning system 202.A vehicle event sensor system 434 may collect sensor data from sensor apparatus including radar, lidar, sonar, cameras, V2X transceivers or any other detection devices which can record event data that can be processed by the computer system 404.Vehicle sensor systems and V2X communication systems can provide data that is processed by the computer system 404 in real-time.","In other words, the sensors may continuously update their output to reflect the environment being sensed at or over a range of time, and continuously or as-demanded to provide updated output to the computer system 404.An event pattern comparison calculator can perform statistical and predictive calculations to determine if, based on two or more users' current position data, course heading data, course history data, projected course data, kinematic data, range or distance data, speed and acceleration data, and/or location data, there is a potential risk of collision events in the real-time traffic scenario.","Examples of such collision events include, but are not limited to, motorcycle and vehicular traffic, bicycle traffic, pedestrian traffic, objects falling or felled in a roadway (such as rocks or trees), wildlife, domestic animals, flooded roads, or any other condition or environmental situation that could cause an unexpected road hazard.","Further, collision event data can include any static or dynamic data and information that are provided in prepared traffic hazard models that could be relevant to the functions of the computer system 404.Data for a potential collision event can be classified as location based, time based, scenario based, hazard or risk based, or another classification or a combination of classifications.","Event data from various sources within and external to vehicle 104 can be saved in a data logger in a vehicle collision event database 422.In addition to processing data provided by the various sensors, the computer system 404 may rely on environmental data that was obtained at a previous point in time and previous location either by vehicle 104, remote vehicle 110 or other vehicles in vehicle communication network 200, and is expected to persist regardless of the vehicle's presence in the environment.","As shown in FIG.","4, a memory 408 component for data 412 may include components for commercial collision event data 414, a collision event map component 416, an event detection component 418, the event comparison calculator (comparison calculator) and the collision event database 422.Collision event map information can be generated by collision event map component 416.Collision event map information can include maps identifying the shape and elevation of roadways, lane lines, intersections, crosswalks, bicycle lanes, school zones, speed limits, traffic signals, buildings, signs, real time traffic information, or other transport information.","For example, the map information may include one or more mapped networks of information, such as roads, lanes, intersections, and the connections between these features.","Each feature may be stored as map data, and may be associated with information, such as a geographic location, and whether or not it is linked to other related features, e.g., a stop sign may be linked to a road and an intersection, etc.","Data 412 may also include commercial collision event data 414, which can include commercially-available databases of transport data, traffic data, traffic schedules, and any other data that could be useful for the embodiments.","The event detection component 418 can include processes and instructions 410 for detecting event characteristics or information from data and information collected by the CWS 400.The event detection component can include an image recognition component that can match image and video collected from the CWS 400 with prior images and video that have been identified as related to a potential collision event.","The vehicle navigation system 436 can be interoperable with computer system 404 to provide navigation maps and information to vehicle 104.Vehicle navigation system 436 may be any type of known, related or later developed navigational system.","The phrase “navigation information” refers to any information that can be used to assist vehicle 104 in navigating a road or path.","Navigation information may include traffic data, map data, and road classification information data.","Examples of navigation information can include street addresses, street names, street or address numbers, intersection information, points of interest, parks, bodies of water, any political or geographical subdivision including town, township, province, prefecture, city, state, district, ZIP or postal code, and country.","Navigation information can also include commercial information including business and restaurant names, commercial districts, shopping centers, and parking facilities.","Navigation information can also include geographical information, including information obtained from any Global Navigational Satellite infrastructure (GNSS), including Global Positioning System or Satellite (GPS), Glonass (Russian) and/or Galileo (European).","The vehicle 104 may also include a geographic position component 438 as part of vehicle navigation system 436 for determining the geographic location of vehicle 104.For example, the geographic position component 438 may include a GPS receiver 510 (see FIG.","5) to determine the device's latitude, longitude and/or altitude position.","Other location systems, such as laser-based localization systems, inertial-aided GPS, or camera-based localization may also be used to identify the location of the vehicle.","The location of the vehicle 104 may include an absolute geographical location, such as latitude, longitude, and altitude as well as relative location information, such as location relative to other vehicles in an immediately vicinity.","A GPS receiver 510 may be used for gathering additional information associated with vehicle 104 that includes, but is not limited to, speed, location, trajectory, distance traveled, acceleration, and other dynamic vehicle information.","In alternative embodiments, the vehicle 104 may also include other features in communication with the computer system 404, such as an accelerometer, a gyroscope, or another direction/speed detection device to determine the direction and speed of the vehicle or changes thereto.","Vehicle 104 may include other apparatus for communicating, and in some cases controlling, the various components associated with vehicle subsystems.","ECU 402 may be configured to communicate with, and/or control, various components of vehicle 104.ECU 402 may communication with a vehicle subsystem 504 (shown in FIG.","5) through appropriate wired or wireless communication channels.","IV.","Vehicle Systems Associated with the Collision Warning System FIG.","5 is a schematic showing vehicle systems 500 that can be associated with the collision warning system 400 of FIG.","4.As shown in FIG.","5, ECU 402 can communicate with a data logger system 502, the vehicle subsystem 504, an automated driving system 506, a navigation system 508, a vehicle sensor system 516, the vehicle V2V transceiver 106, RF transceiver 224, a camera 522, and a laser 524.In the embodiments, data logger system 502 may communicate with ECU 402 in vehicle 104.Data logger system 502 can acquire and log data collected from any of the vehicle systems and subsystems for use by the computer system 404.Data relevant to collision warning system 202 includes, but is not limited to, navigation data, sensor data, multimedia data, such as images or video streams, audio information, scanner data, and other type of data useful for collision warning system 202.ECU 402 may communicate with a vehicle subsystem 504 through appropriate wired or wireless communication channels.","The automated driving system 506 can be in communication with ECU 402.In some embodiments, ECU 402 may be configured to control components of vehicle subsystems, for example, to activate a brake actuator prior to an imminent collision.","In other embodiments, automated driving system 506 can be configured to mechanically alert a driver of vehicle 104 of a potential collision, or assist the driver of vehicle 104 or another vehicle in communication with vehicle 104 to avoid a road hazard or potential collision.","Vehicle 104 can include navigation system 508 that is configured to be in communication with ECU 402, and perform the functions of vehicle navigation system 436.Navigation system 508 may include a navigation system display 512, and can store map and location information in a navigation database 514.Navigation system display 512 may display navigational maps and information to a user of vehicle 104 using any type of display technology known or presently unknown in the art.","Navigation system display 512 may also communicate information to a vehicle 104 user using any type of known, related art or later developed audio technology, such as by using predetermined sounds or electronically generated speech.","In an embodiment, vehicle sensor system 516 can communicate with ECU 402 and various event data sensor devices, such as sensor 518, radar system 520, camera 522, and laser 524, disposed at the interior or exterior of vehicle 104.The sensors 518, 520, 522, 524 can be located in any beneficial area of vehicle 104.The embodiments are intended to include or otherwise cover any number the sensors that can be placed at any location of vehicle 104 in any configuration.","Sensor system 516 may communicate with multiple devices that assist in collecting data including, but not limited to, sensors 518 that can collect data for vehicle speed, steering, and inertia (yaw) relative to gravity or a perpendicular plane to gravity.","Although one sensor 518 is shown in FIG.","5, it is understood that sensor 518 is a representation of one or more sensors installed within or outside of vehicle 104.Other embodiments of sensors 518 can collect proximity data using rear, front, and side proximity detection sensors 518.The vehicle sensor system 516 can include devices to detect one or more characteristics of a road hazard, such as the presence of a vehicle, pedestrian, entity, or traffic-related situation.","Characteristics can include identity, speed, direction, location, acceleration, orientation, size, etc.","Examples of sensor system detection devices include, but are not limited to, one or more cameras, radar, sonar, range finding lasers, or any detection devices that can be useful for collecting collision event data in collision event database 422 that can be processed by the computer system 404.Sensor system 516 devices can be advantageous by collecting data for identification and tracking the movement of entities such as motorcycle and vehicular traffic, bicycle traffic, pedestrian traffic, objects fallen in a roadway, such as rocks or trees, wildlife, domestic animals, or any other condition, entity, or vehicle that could provide useful data for processing as collision event data.","One or more of the radar systems 520 may be mounted on a front, rear, top, or side of vehicle 104.The radar system 520 can be beneficial by detecting the presence and movement of entities in proximity to vehicle 152, especially when an entity is within a driver's blind spot or obscured by darkness.","One or more of the cameras 522 may be mounted internal or external to vehicle 104.FIG.","5 illustrates camera 522 at a certain location of vehicle 104 that is merely exemplary.","The embodiments are intended to include or otherwise cover any number of one or more cameras 522 that can be placed in any location and/or configuration on vehicle 104 that includes, but is not limited to, a front grill, front and rear bumpers, underneath a vehicle, on a side of vehicle 104, inside vehicle 104, or on a top of vehicle 104.In some embodiments, camera 522 may rotate vertically and horizontally to provide a wide degree of coverage area.","A variety of cameras 522 may be used in the embodiments to capture still images and video images in color, infrared, black and white, in two dimensions, or in three dimensions.","The camera 522 may capture images, video, and data on any type of medium known in the art, including digital media or film.","The captured images and related data may be saved to data logger system 502 for image recognition and movement characteristics processing by computer system 404.An object detection component 428 can compare images from image recognition processing with a database of images, maps, graphics, videos, etc.","to identify entities, read text, or determine locations based on the image comparisons.","One or more of the lasers 524 may be mounted external to vehicle 104.Laser 524 can capture event data for processing by determining range and intensity of a vehicle, pedestrian, entity, etc., for processing by computer system 404.Laser 524 is capable of capturing range and intensity information of an entity, which can be used to determine the location and distance of the entity.","FIG.","5 also shows the vehicle 104 V2V transceiver 106 for communicating with other V2X compatible transceivers.","In an embodiment, V2V transceiver 106 can collect event data from other V2X transceivers that can be configured for a pedestrian, bicycle, vehicle, building, tower, billboard, traffic signal, road sign, or any transport related entity or user.","V2X transceivers can be configured to broadcast the transceiver's location, obtained from an internal GPS receiver, to any V2X transceiver within transmission range.","A display on each V2X transceiver can also display any messages, images, alerts, and warnings transmitted received by V2X users in vehicle communication network 200.A communications link between V2X transceivers may be initiated by any user.","In the embodiments, a V2X transceiver may continuously search for other V2X transceivers, such as by emitting a periodic signal that searches for a reply.","In other embodiments, a V2X transceiver may emit periodic signals searching for a reply from an in-range V2X transceiver.","If V2X transceiver replies, then a communications link may be established.","Information and data received by V2V transceiver 106 related to V2X communications can be saved to data logger system 502 and processed by computer system 404.V.","Vehicle Interior FIG.","6 is a schematic of an exemplary design of a vehicle interior 600 associated with the collision warning system 400 of FIG.","4.The vehicle interior 600 may include, for example, a dashboard 602, a steering apparatus such as a steering wheel 604, an instrument panel 606, and a center portion 608.Center portion 608 can include one or more devices associated with the interior of the vehicle, including but are not limited to: audio devices, video devices, navigation devices, as well as any other types of devices.","In addition, center portion 608 can be associated with controls for one or more systems of vehicle 104 including, but not limited to: climate control systems, radio and sound systems, and other types of systems.","The vehicle 104 may also have a display device 610 for displaying information from CWS 400, and/or other related or unrelated vehicular systems.","In some embodiments, vehicle 104 can include a driver vehicle interface 612 that may include the display device 610.Examples of display device 610 include, but are not limited to, LCDs, CRTs, ELDs, LEDs, OLEDs, or electronic paper displays each with or without a touchscreen, as well as other types of displays.","Display device 610 can include a touchscreen for use as the user input device 424 for activating or deactivating one or more vehicle collision system modes, and for enabling a user to provide information, such as navigation destination or event information, to the computer system 404.In alternative embodiments, driver vehicle interface 612 can include buttons, a keypad, or other types of input devices 424.In another embodiment, driver vehicle interface 612 can include a projection type display that is configured to project an image onto one or more surfaces of vehicle 104, such as windshield 614.Vehicle 104 may also include one or more additional display devices in various locations.","In some embodiments, display device 610 can be disposed within center portion 608.However, in other embodiments, display device 610 can be located in any portion of vehicle 104, or can be a portable device.","For example, display device 610 can be located within instrument panel 606.In addition, while display device 610 can be configured to present visual information for computer system 404, display device 610 can be shared with other devices or systems within vehicle 104 such as vehicle navigation system 436.In an example, display device 610 may display collision event information, warning alerts, informing alerts, and navigation maps to a user.","A driver vehicle interface may inform a driver with auditory warnings or alerts a predicted potential collision.","Warnings and alerts may be configured to correspond to the level of road hazard or level of potential collision risk.","For example, warnings and alerts may be classified as low, medium, high, or information.","Display device 610 can be configured to display no image when no alert or information has been issued by computer system 404.In an embodiment, display device 610 displays a default screen, such as a blank screen, when no alert is issued.","However, in embodiments where display device 610 is used for displaying information from other systems, a default screen cannot remain a blank screen with no image.","For example, in embodiments where display device 610 is shared with vehicle navigational system 436, display device 610 can continue to display maps and information received from the vehicle navigation system 436 until a warning is issued.","Likewise, once a warning has expired, display device 610 can return to displaying maps from navigation system 436.VI.","Methods of Operation FIG.","1 shows an overhead view of the traffic scenario 100.The users, locations, and other data related to potential road hazard scenarios at intersection 102 can be the subject of digital navigation maps generated by the collision event map component 416 for integration with digital navigation system 436 that can be displayed on display device 610.The intersection 102 is merely provided as an exemplary location in order to illustrate embodiments of CWS 400 and is not intended to be limiting.","The embodiments of the disclosure are intended to cover any road, highway, path, lane, course, track, navigable waterway, and paved or unpaved areas that a vehicle, bicycle, motorcycle, pedestrian, boat, train, etc.","could move on, along, or through.","Exemplary aspects of intersection 102 include two lanes in multiple directions and bicycle lane 124 that traverses only one direction.","The embodiments, however, are not limited by a number of lanes, directions, or to an intersection.","Any configuration of a road, highway, path, lane, course, track, navigable waterway, and paved or unpaved areas may be used to operate and implement the embodiments.","CWS 400 can collect collision event data at or near intersection 102 from multiple sources in vehicle 104, for example V2X signals from other vehicles and users, vehicle event sensor system 434, navigation system 508, and user input on input device 424.CWS 400 activation enables collection of new event data while vehicle 104 approaches and passes through intersection 102.Computer system 404 can process the new event data, compare the new event data from one vehicle to historical event data that the same vehicle or other vehicles collected at the same or proximate location, and generate a prediction as to whether the vehicle should be provided with information relating to a potential collision or provided an alert of a potential collision scenario.","The operations of the CWS 400 are described in conjunction with embodiments of the disclosure below.","In an embodiment, an event pattern comparison calculator (comparison calculator) 420 may be utilized by computer system 404 to compare new event data with prior event data in collision event database 422 and prior event patterns.","If the comparison calculator 420 determines the new event data meets a comparison threshold to a prior event pattern, the new event data is determined to be updated data for the prior event, and the new event data can be combined with data for a prior event pattern.","In the embodiments, the comparison calculator 420 can utilize one or more comparison models of statistical analysis to classify patterns of road hazards or potential road hazards as potential collision events.","Comparison calculator 420 can compare event data to one or more patterns including, but not limited to, statistical models, data clusters, regression analysis, or any other type of data analysis which can perform the functions of the embodiments.","Comparison calculator 420 may provide at least one weighting factor in the comparison models to weight various probabilities associated with road hazards determined from event data collected in real-time or historical event data.","The comparison calculator 420 can analyze new event data to determine a statistical match with existing, or prior, road hazard event data.","In an embodiment, the comparison calculator 420 may determine a statistical match using probabilities calculated from the data.","Comparison calculator 420 may further calculate statistical matches based on dates and times, road hazard characteristics, environmental conditions, traffic conditions, locations, entity headings, or any other condition or data analysis relevant for the embodiments.","In an embodiment, comparison calculator 420 may use a single equation that is derived using Bayes' Theorem or Bayesian Rule.","Generally, Bayes' Theorem relates the conditional and marginal probabilities of various random events.","Using a Bayesian Rule, probabilities of different events occurring may be determined given certain observed scenarios.","As a result, the probability of an event occurring generally increases as more prior information from observed scenarios is provided.","The comparison calculator 420 may use a Bayesian Rule to combine the various probabilities determined based on conditions associated with any of the ranges or patterns of event data in collision event database 422.If comparison calculator 420 determines that newly-collected event data has a statistical match to historical event data, then the comparison calculator 420 stores the new event data into collision event database 422 with the matched prior event data.","If the comparison calculator 420 determines that the new event data is not a statistical match to historical event data, new event data is stored into collision event database 422 as a single event.","Single event data in collision event database 422 can be further analyzed by the comparison calculator 420 in future statistical analysis to determine if any statistically significant matches occur with other event data obtained from the same vehicle and/or other vehicles.","While some of the embodiments are based on an application of Bayes' Theorem, other embodiments are intended to include or otherwise cover other comparison methods by the comparison calculator 420.The comparison calculator 420 may utilize fuzzy logic, neural network applications, analysis of variance (ANOVA), discriminant analysis, or any other appropriate analytical and/or statistical methods to perform data analysis.","FIG.","7 is a flowchart of an exemplary method 700 to inform a vehicle of potential collision events in association with the CWS 400.In some embodiments, warnings and alerts may be generated not only on signals from V2X signals but also on probabilities of an event analyzed by the comparison calculator 420.For example, if the vehicle 104 approaches the intersection 102, the V2V transceiver 106 should receive a V2P signal from the single pedestrian 126.However, multiple scenarios can occur where V2P signals may not be present and/or detected due to, for example, a malfunction in the V2P transceiver 128 or radio frequency interference.","However, CWS 400 may generate a low level and/or information alert regarding a predicted potential for pedestrian 126 crossing the intersection 102 based on statistical analysis of historical pedestrian data by comparison calculator 420.In FIG.","7, the method to inform a vehicle may include step 702 where a user, driver or passenger of vehicle 104 can activate a vehicle collision warning mode for the CWS 400.The method may include step 704 to determine the vehicle 104 location.","A location may be determined using geographic position component 438.After a location is determined, in step 706 the computer system 404 can search collision event database 422 for prior events in a predetermined proximity to the location of vehicle 104.If in decision 708, to determine if prior events occurred, no prior events occurred in proximity to the current vehicle 104 location, then the method proceeds to step 712 to monitor for new road hazards.","If in decision 708, to determine if prior collision events occurred, there are prior events within the predetermined proximity to vehicle 104, the method can include step 710 to inform vehicle 104 of the prior events.","The step 710 to inform vehicle 104 includes the collision event map component 416 integrating potential road hazard data from collision event database 422 into detailed maps that can be used by the computer system 404 for generating alerts as well as used by the vehicle navigation system 436 for displaying on display device 426 the locations and types of road hazards onto a digital navigation map.","FIG.","8 is a flowchart of an exemplary method 800 to predict potential collision events and alert a vehicle in conjunction with the collision warning system 212.The method illustrated in FIG.","8 can monitor for new event data in step 802 that can be a continuation of step 712, to monitor for new event data, of FIG.","7.Monitoring for road hazards using new event data can be performed automatically, manually, or a combination of automatic and manual identification of event data.","As stated previously, event data can include, but is not limited to, V2X signals, type of user or vehicle, navigation data, road hazard data, collision warning data, course heading data, course history data, projected course data, kinematic data, current position data, range or distance data, speed and acceleration data, location data, vehicle sensory data, vehicle subsystem data, or any type and quantity of data useful for processing by computer system 404.If new event data is not detected at step 804, to detect new event data, then the method returns to step 802 to continue to monitor for new event data.","If a new event, and therefore new event data, is detected in 804, the method can include step 806 to save new event data into collision event database 422.New event data may also include a new road hazard that has been identified by a vehicle or received from an external database.","However, new event data can also include a repeated entry of a road hazard by a vehicle 104 or other vehicles at or in a predetermined proximity to an event location that already exists in collision event database 422.A repeated sighting or entry of a road hazard or potential road hazard can add confidence to collision event data collected for the road hazard.","For example, an event location can be identified by geographic position component 438 and a road hazard can be recognized from camera 522.The event location and road hazard can be automatically saved into collision event database 422.In another embodiment, a driver of vehicle 104 may observe a traffic scenario, for example a school bus stop, and use input device 424 to manually save the event location into collision event database 422.While the example describes a school bus stop, it is understood that any type of event scenario, road hazard, traffic data, image, or location can be automatically or manually saved into collision event database 422.The method, therefore, can collect data for a potential road hazard and the event location, regardless of whether the event was previously identified and saved.","The method in FIG.","8 may also include decision 808 to determine if prior road hazard events occurred in a predetermined proximity to the vehicle location.","After new event data is detected in step 804, to detect new event data, the computer system 404 can search collision event database 422 for prior events in a predetermined proximity to the location of vehicle 104.In step 808, to determine if prior event occurred, no prior events occurred in proximity to the current vehicle 104 location, then the method will return at 810 to monitor for new event data.","If prior events did occur, then the method proceeds to step 812 to compare, using comparison calculator 420, new event data to prior event data for the same location from collision event database 422.Comparison of new event data to prior event data in collision event database 422 can be performed by any of the comparison or statistical models and methods described above, which include but are not limited to statistical models, data clusters, regression analysis, correlations, or any other type of appropriate data analysis technique.","In an exemplary embodiment, the new event data is compared with prior event data and patterns in collision event database 422 using Baysian Networks.","If the comparison calculator 420 determines in step 814, to determine if new event data matches a prior event data pattern, that new event data does not match a prior event data pattern, then the method may return at 816 to monitor for new event data.","If comparison calculator determines, in step 814 to determine if new event data matches a prior and/or historical event data pattern, that new event data matches and/or correlates to a prior event data pattern, then the method can include step 818 to add new event data to the matching and/or correlating prior event data in collision event database 422.Further, if the comparison calculator 420 determines, in step 814 to determine if new event data matches a prior event data pattern, that new event data matches and/or correlates to a prior and/or historical event data pattern, then the method optionally proceeds in step 820 to determine if new event data meets a condition and/or characteristic of the prior and/or historical event data.","In step 820, the new event data should meet a threshold condition and/or characteristic of event data to qualify as a potential collision risk and/or road hazard.","A condition and/or data characteristic can include, but is not limited to, a temporal component including a relevant time frame, a direction of movement and/or heading of an entity, and heading of the vehicle 104 approaching the entity, etc.","A time frame can be any time frame including, but not limited to, a time of day, a range of time within a day, a calendar day or range of days, a week or range of weeks, a month, a range of months, etc.","A time frame can also be periodic, such as an event occurring certain days of every month between certain hours of the day.","For example, if event data at intersection 102 correlates with a present location of vehicle 104 and statistical analysis of historical event data result in identifying an event occurring between the hours of 4:00 pm and 6:00 pm, and the vehicle 104 is at the location at 11:00 pm, then no conditional match occurs within the relevant time frame.","Real-time event data collected by the vehicle 104 at the event location can still be used, however, to give further confidence to the pattern of event data characteristics or conditions, e.g., that no event occurred at the location at 11:00 pm, therefore the conditional time frame of 4:00 pm-6:00 pm remains valid.","If, in step 820 to determine if new event data meets a condition, the comparison calculator 420 determines the new event data meets a condition and/or characteristic of prior and/or historical event data, then the method may include step 824 to warn vehicle 104 of a predicted potential collision event and/or road hazard.","Computer system 404 can generate an alert to a driver of vehicle 104 of the nature, location, and severity of a potential collision event using visual, audible, or mechanical indicators.","A potential collision event can be a potential road hazard in the path of, or in proximity to, the location and heading of the vehicle 104 or other vehicles or users.","The potential collision event may not generate an immediate road hazard alert to the vehicle 104, in which case an information alert may be appropriate.","For example, if the event data analysis results in a scenario, such as a bus stop, in or near the current or intended path of vehicle 104, then an information alert can be useful to warn vehicle 104 to take caution near the bus stop location.","Visual alerts and information alerts can display on display device 610 or other display devices including, but not limited to, a smart phone, a tablet computer, or any device that can be linked by wire or wirelessly to collision warning system 400.Audible alerts and information can be provided to vehicle 104 through a speaker in the display device 610 or through other devices that include, but are not limited to, a vehicle sound system, a smart phone, a tablet computer, etc.","Mechanical indicators can inform a driver of vehicle 104 through vibrations in steering wheel 604, vibrations of a brake pedal (not shown), vibrations of an accelerator pedal (not shown).","Some embodiments to warn vehicle 824 of potential road hazards and information are intended to include or otherwise cover one or more alert levels.","In the embodiments, information alerts and road hazard alerts that display on display device 610 can include, but are not limited to, one or more navigation maps, symbols, icons, graphics, colors, images, photographs, videos, text, audible information, etc.","Exemplary alert levels may include warning alerts, informing alerts, high, medium, and low alerts, proximity alerts, trajectory alerts, location alerts, or any alert method that can inform a driver of information, a potential road hazard, collision risk, etc.","In particular, informing alerts are used to inform the vehicle 104 or other users of information or data relevant to the vehicle's intended current or intended path.","Low-level hazard alerts can inform a driver of relatively low collision threats, while mid-level or high level hazard alerts can inform the vehicle 104 of medium-to-high level collision risks and/or road hazards.","Information can be provided to vehicle 104 with alerts displayed on display device 610 or audible or mechanical alerts, as described above.","After generating an alert, the method may include step 826 to save the notice of the warning to the vehicle collision event database 422 with the event data relevant to the alert.","If, in step 820 to determine if new event data meets a condition, the comparison calculator 420 determines the new event data does not meet a condition of prior and/or historical event data, then the method returns at 822 to monitor for new event data in real-time.","FIG.","9 is a flowchart of an exemplary method 900 for receiving and classifying new event data by the CWS 400.The method in FIG.","9 may include step 902 where computer system 404 can receive new event data.","New event data may be uploaded to computer system 404 from any vehicle system including the vehicle subsystem sensor system 430, the vehicle communication system 432, the vehicle event sensor system 434, the vehicle navigation system 436, and/or manually from a driver and/or passenger of vehicle 104.In step 906, classifying new event data can include the comparison calculator 420 determining event patterns 904 using any of the comparison or statistical methods described above or another known, relevant or later developed method.","In step 906, to classify new event data, the comparison calculator 420 can search and analyze historical event data in collision event database 422 to determine if prior and/or historical road hazards and/or potential collision events occurred within a predetermined proximity to the vehicle 104 location.","Comparison calculator 420 can compare current or new event data collected from vehicle 104 or other vehicles to prior and/or historical event data by any of the comparison or statistical methods described above.","If new event data is a comparative or statistical match to one or more prior event data patterns, comparison calculator 420 may then classify new event data 906 according to one or more prior event data patterns.","The method may further include step 908, where computer system 404 may store the new and/or current event data into the collision event database 422 with the matched or correlated prior and/or historical event data.","In an alternative embodiment, the exemplary method 900 for receiving and classifying new event data is performed by the service provider 212.To perform method 900 for receiving and classifying new event data, the FCW server 302 can include corresponding functionality and hardware as computer system 404.For example, at step 902 the FCW server 302 can receive new event data, determine event patterns 904, classify new event data 906, and save new event data in the FCW database 306.FIG.","10 is a functional flowchart of an exemplary method for comparing new event data with patterns of prior and/or historical event data by CWS 400.In an alternative embodiment, new event data 1000 is received by the CWS 400 as described above.","New event data 1000 may also receive commercial collision event data via commercial collision event data component 414 from transportation agencies, commercial service providers, or from other vehicles.","The method may correlate or statistically analyze new event data 1000 using an event pattern classifier 1002.The event pattern classifier 1002 can be a function of comparison calculator 420.Event pattern classifier 1002 can compare new or historical event data to one or more event patterns 1004 using comparison and/or statistical methods described above.","Alternatively, other comparison and/or statistical models can be generated, and event data matched and/or correlated to one or more of the comparison or statistical models.","Additionally, event pattern classifier 1002 can compare new event data 1000 to one or more event patterns 1004 using comparison and statistical methods described above.","In an alternative embodiment, event patterns 1004 may be generated by statistical analysis of event data according to a data characteristic such as location and/or time interval of the event.","In some embodiments, a time interval used for determining whether new event data 1000 fits one or more event patterns 1004 may be fixed.","In other embodiments, the time interval may vary.","One or more event patterns 1004 can be stored in an event pattern library in collision event database 422.If the event pattern classifier 1002 determines the new event data 1000 matches or correlates to one or more event patterns 1004, the new event data 1000 can be combined with the data associated with the one or more event patterns 1004, such as a first event pattern 1006 or a second event pattern 1008.Although two event patterns are illustrated in FIG.","10, the embodiments are intended to include, and otherwise cover, any number of event patterns.","The new event data 1000 that is associated with the first event pattern 1006 may be stored with event data for the first event pattern 1006 in a first event database 1010 that is part of the collision event database 422.Likewise, the new event data 1000 that is associated with the second event pattern 1008 may be stored with event data associated with the second event pattern 1010 a second event database 1012 that is part of collision event database 422.In an alternative embodiment, the comparing new event data 1000 with event patterns 1004 may be performed by FCW server 302.FIGS.","11-13 illustrate examples of collision event maps displayed on device 610 that are generated by collision event map component 416.The scenarios should be considered as specific embodiments and should not be considered as limiting.","Other embodiments are intended to include, or otherwise cover, any visual displays of information and maps that are useful for the functionality of the embodiments.","FIG.","11 illustrates an embodiment of the CWS 400 alerting a vehicle of potential collision scenarios with pedestrians.","FIG.","11 shows the display device 610 displaying informing alert image 1100 that is generated by collision event map component 416.Informing alert image 1100 shows some features of the intersection 102 (see FIG.","1) from a navigation perspective of vehicle 104.In the embodiment, the computer system 404 can include prior and/or historical event data that was collected in proximity to intersection 102.Entities in proximity to intersection 102 include remote vehicle 110 that is equipped with the CWS 400 and V2V transceiver 108, the single pedestrian 126 who is equipped with V2P transceiver 128, the school bus 134 that is equipped with the CWS 400 and V2V transceiver 136, the group of pedestrians 138 who are each equipped with V2P transceivers 140, and the motorcycle 130 that is equipped with the CWS 400 and V2M transceiver 132.In the scenario, school bus 134 blocks the view of the group of pedestrians from the perspective of vehicle 104.The group of pedestrians 138 is visible to remote vehicle 110 and motorcycle 130.Therefore, the group of pedestrians 138 is a potential unseen road hazard to vehicle 104.In the exemplary scenario, as vehicle 104 approaches intersection 102, computer system 404 searches prior event data for events based on the current location and heading of vehicle 104, provided by geographic position component 438.Computer system 404 can locate historical data for prior events in proximity to intersection 102.The prior event data indicates patterns of unexpected pedestrian movements across the intersection 102.The prior events have a data characteristic occurring weekdays between 3:00 pm to 6:00 pm.","The computer system 404 detects from an internal clock that the current time is 4:00 pm and the day is a weekday.","Computer system 404 therefore determines the current time falls within the time frame characteristic for the prior events.","Computer system 404 can detect V2P, V2V, and V2M signals received through vehicle 104 V2V transceiver 106.Computer system 404 can analyze and translate V2X signals as to source, location, and telemetry, and collision event map component 416 can map the signals onto informing alert image 1100.Using GPS location information from the V2X messages, computer system 404 can direct sensor system 516 to activate camera 522 to collect images of the V2X transmitting entities.","The images can be transmitted to computer system 404 for image recognition.","In some embodiments, informing alert image 1100 can display icons corresponding to a type of V2X signal received, e.g., a pedestrian icon for a V2P signal or a motorcycle icon for a V2M signal.","In an alternative embodiment, where images of V2X objects have been recognized, actual images of pedestrians, vehicles, motorcycles, etc.","could be displayed on informing alert image 1100.Based on the V2P messages from single pedestrian 126, computer system 404 can detect movement of the V2P transceiver towards the intersection 102.Comparison calculator 420 can analyze the real time data of the V2P movement and determine, based on comparisons with prior event V2P data patterns, that the pedestrian 126 has a statistical likelihood of crossing the intersection 102 in outside of crosswalks and in the current path of vehicle 104.To inform vehicle 104 of a potential collision event, computer system 404 can display an alert symbol 1102 on display device 610.To predict the nature of the potential collision event, computer system 404 can display movement of pedestrian 126 along a trajectory indicated by direction arrow 1104 towards intersection 102.To predict a potential movement of pedestrian 126, a pedestrian symbol 1106 can be displayed in front of direction arrow 1104.The outline of pedestrian symbol 1106 is a dashed line indicating symbol 1106 is only a predicted movement of pedestrian 126.The alert symbol 1102 and pedestrian symbol 1106 indicates that computer system 404 has determined there is a probability of pedestrian 126 crossing intersection 102 that can be a collision risk to vehicle 104.The determination is based on V2P signals combined with a calculated pattern of pedestrians crossing intersection 102 within the current time frame.","By displaying informing alert image 1100 with pedestrian symbol 1106, a driver can be alerted to a potential collision risk if pedestrian 126 follows the predicted pattern of travel indicated.","A second event at the intersection 102 is determined where V2P signals from V2P transceivers 140 indicate a gathering of the group of pedestrians 138 near intersection 102.Computer system 404 can analyze movement of V2P transceivers 140 although the group of pedestrians 138 is blocked from the view of vehicle 104 by school bus 134.Comparison calculator 420 can analyze the real time data of the V2P messages and determine, based on comparisons with prior event V2P data patterns, that the group of pedestrians 138 has a statistical likelihood of crossing the intersection 102 in outside of crosswalks and in the current path of vehicle 104.To inform vehicle 104 of a potential collision event, computer system 404 displays alert symbol 1102 on display device 610.To predict the nature of the potential collision event, computer system 404 displays movement of one of the group of pedestrians 138 along a trajectory indicated by direction arrow 1108 towards intersection 102.To predict a potential movement of one of the pedestrians 138, a pedestrian symbol 1110 is displayed in front of direction arrow 1108.The outline of pedestrian symbol 1110 is a dashed line indicating the pedestrian symbol 1110 is only a predicted movement of one of the pedestrians 138.The alert symbol 1102 and pedestrian symbol 1110 indicate that computer system 404 has determined there is a probability of one of the pedestrians 138 crossing intersection 102 that could be a road hazard to vehicle 104.By displaying informing alert image 1100 with pedestrian symbol 1110, a driver can be alerted to a potential road hazard if one of the group of pedestrians 138 follows the predicted pattern of travel indicated.","Computer system 404 can also inform other vehicles or entities within the vehicle communications network 200 of the potential collision risks.","Computer system 404 can broadcast the potential collision risk data from informing alert image 1100 and alert information using V2V communication protocols.","Remote vehicle 110 and motorcycle 130 can receive the V2V messages from vehicle 104 and display the informing alert image 1100 according to each vehicle's perspective and display device.","In the embodiment, computer system 404 can also collect event data regarding a school bus stop.","The event can be determined automatically from comparison calculator 404 analyzing the school bus 134 from V2V signals and/or a driver in vehicle 104 can manually enter the school bus stop event into computer system 404 via input device 424.Computer system 404 can determine to add the images, time, location, and V2X data from all events at the intersection 102 to the existing event data for intersection 102 in collision event database 422.FIG.","12 illustrates an embodiment of the CWS 400 alerting a vehicle of a potential collision scenario with a bicycle.","FIG.","12 includes display device 610 displaying informing alert image 1200 generated by collision event map component 416.Informing alert image 1200 displays some features of the intersection 102 from a navigation perspective of vehicle 104.In the embodiment, computer system 404 can include prior and/or historical event data for intersection 102.Vehicle communication network 200 users in proximity to intersection 102 include the remote vehicle 110 that is equipped with the CWS 400 and V2V transceiver 108, the bicycle 120 equipped with V2B transceiver 122, and the motorcycle 130 that is equipped with the CWS 400 and V2M transceiver 132.The bicycle 120 is traveling in bicycle lane 124 in close proximity to vehicle 104.In the scenario, as vehicle 104 approaches intersection 102, computer system 404 searches and locates historical and/or prior event data for events based on vehicle 104 location, provided by geographic position component 438.The prior event data indicates patterns of unexpected V2B movements across the intersection 102 in the path of vehicle 104.The prior events have a conditional time frame for weekdays between 5:00 pm to 7:00 pm.","The computer system 404 detects from an internal clock that the current time is 6:00 pm on a weekday and determines the current event data meets the conditional threshold for the prior events.","Computer system 404 analyzes and translates V2X signals as to source, location, and telemetry, and collision event map component 416 maps the signals onto informing alert image 1200.Using GPS location information from the V2X messages, computer system 404 can direct sensor system 516 to activate camera 522 to collect images of transmitting V2X entities.","The images can be transmitted to computer system 404 for image recognition.","In some embodiments, informing alert image 1200 can display icons corresponding to a type of V2X signal received, e.g., a motorcycle icon for a V2M signal.","In an alternative embodiment, where images of V2X entities have been recognized, actual images of pedestrians, vehicles, motorcycles, etc.","can be displayed on informing alert image 1200.Computer system 404 can detect movement of the V2B transceiver 122 towards the intersection 102.Comparison calculator 420 can analyze the real time data of the V2B movement and determines a statistical match between current event data and historical V2B data patterns that the bicycle 120 has a likelihood of crossing the intersection 102 outside of bicycle lane 124 and in the path of vehicle 104.To inform vehicle 104 of a potential collision event, computer system 404 displays an alert symbol 1206 on display device 610.To predict the nature of the potential collision event, computer system 404 displays movement of bicycle 120 along a trajectory indicated by direction arrow 1202 towards intersection 102.To predict a potential movement of bicycle 120, a bicycle symbol 1204 can be displayed in front of direction arrow 1202.The outline of bicycle symbol 1204 is a dashed line indicating that the bicycle symbol 1204 is only a predicted movement of bicycle 120.The alert symbol 1206 and bicycle symbol 1204 indicate that computer system 404 has determined a likely probability of bicycle 120 crossing intersection 102 that could be a collision risk to vehicle 104.The determination can be based on V2B signals combined with a calculated pattern of bicycles crossing intersection 102 outside of bicycle lane 124 within the current time frame.","By displaying informing alert image 1200 with bicycle symbol 1204, a driver can be alerted to a potential road hazard if bicycle 120 follows the predicted pattern of travel indicated.","FIG.","13 illustrates an embodiment of the CWS 400 alerting vehicle 104 of a potential collision scenario with wildlife.","In FIG.","13, informing alert image 1300 displays on display device 610 some features of the intersection 102 from a navigation perspective of vehicle 104.In the embodiment, the computer system 404 can include prior and/or historical event data that was collected in proximity to intersection 102.Vehicle communication network 200 users with near intersection 102 include remote vehicle 110 that is equipped with the CWS 400 and V2V transceiver 108, and motorcycle 130 that is equipped with the CWS 400 and V2M transceiver 132.As vehicle 104 approaches intersection 102, computer system 404 searches and locates prior event data for events based on vehicle 104 location, provided by geographic position component 438.The prior event data indicates patterns of unexpected wildlife movements across the intersection 102 within a time frame of 8:00 pm to 8:00 am.","The computer system 404 detects from an internal clock that the current time is 10:00 pm and determines the current event data meets the conditional data patterns.","Computer system 404 also detects V2V and V2M signals received through vehicle V2V transceiver 106.Computer system 404 analyzes and translates V2X signals as to source, location, and telemetry, and collision event map component 416 maps the signals onto informing alert image 1300.Computer system 404 receives from vehicle radar system 520 that indicate movement of an unknown entity 1302 in proximity to vehicle 104.Based on the detected movement, collision event map component 416 maps unknown entity 1302 onto informing alert image 1300.Computer system 404 can direct sensor system 516 to activate camera 522 and attempt to collect images of the unknown entity 1302.Comparison calculator 420 can analyze the current event data of the entity's movement and determine, based on comparisons with image recognition of images from camera 522, and prior event patterns, that the unknown entity 1302 has a statistical likelihood of being wildlife crossing the intersection 102 in the path of vehicle 104.To inform vehicle 104 of a potential collision event, computer system 404 displays an alert symbol 1308 on display device 610.To predict the nature of the potential collision event, computer system 404 displays movement of entity 1302 along a trajectory indicated by direction arrow 1304 towards intersection 102.To predict a potential movement of unknown entity 1302, a deer symbol 1306 can be displayed in front of direction arrow 1304.The outline of the deer symbol 1306 is a dashed line indicating a predicted path of unknown entity 1302.The alert symbol 1308 and deer symbol 1306 indicate a probability of unknown entity 1302 crossing intersection 102 that can be a road hazard to vehicle 104.The determination is based on radar signals from radar system 520 combined with one or more patterns of wildlife crossing intersection 102 within the conditional time frame.","By displaying alert symbol 1308 with deer symbol 1306, a driver of vehicle 104 can be alerted to a potential road hazard if unknown entity 1302 moves in a heading indicated by the predicted pattern of travel.","To warn other V2X users in proximity to intersection 102, computer system 404 can broadcast the potential collision event data and alerts via V2V signals that can be received and displayed by the CWS 400 in remote vehicle 110 and the CWS 400 in motorcycle 130.In the figures, although a single image is shown for each type of alert, other embodiments can include one or more images for each type of alert.","In particular, an arrow used to indicate position and heading of a road hazard or potential collision risk can be changed from a direction arrow to any type of indication of entity, movement, direction, etc.","that can help inform a driver of the potential road hazards and/or potential collision events.","In the embodiments, multiple images can distinguish between the types of alerts.","For example, an alert symbol can be used to distinguish between informing alerts and warning/hazard alerts.","Likewise, informing alerts can be associated with a different color or symbol than warning alerts.","In other embodiments, alerts can indicate multiple levels of threats of potential road hazards.","FIG.","14 is a flowchart of a method 1400 for configuring the CWS 400 based on an environment.","In some cases, a driver can have an opinion that a computer system 404 generates too many alerts, especially in a case of informing alerts about situations already known to a driver.","For example, in situations where vehicle 104 is located in an urban environment, such as business district of a city, many pedestrians similar to group of pedestrians 138 may be walking along sidewalks in proximity to vehicle 104.In such a situation, a visual or audible alert of every pedestrian in proximity to vehicle 104 can be deemed a nuisance.","It can therefore be beneficial for computer system 404 to adjust the number of alerts generated to vehicle 104 according a specific type of environment.","In the embodiments, computer system 404 can be configured to generate alerts based on different driving environments external to vehicle 104.In the embodiments, a frequency and/or type of alert can be adjusted between at least two different driving environments.","In an alternative embodiment, the frequency and/or type of alert can be adjusted between three or more different driving environments.","Some of the embodiments are intended to include driving environments that can include a road classification or a mapped boundary, such as a geographic, legal, or demographic boundary.","Examples of boundaries include urban, suburban, or rural areas or zones.","However, other embodiments for driving environments are intended to include or otherwise cover alert adjustments based on boundaries for a city, a county, a state or province, or a country, areas defined by population, areas near attractions, demographic areas, or any type of area or boundary.","Alerts can be adjusted for any type of environment or classification appropriate for the functionality of the embodiments to distinguish between the driving environments.","The first step for configuring the CWS 400 based on an environment is to activate an enhanced warning mode at step 1402.In the embodiment, a first environment mode can be selected when a configuration is a default mode of operation.","A second, or enhanced, environment mode of computer system 404 can perform automatic adjustments of alerts based on a driving environment.","In second step 1404, the computer system 404 can monitor and identify a current environment of vehicle 104.It can be beneficial for computer system 404 to interact with vehicle navigation system 436 to identify different road environments and vehicle locations.","In an embodiment, environments can be determined using functional road classification data.","Functional classification is a method used by state and federal transportation agencies to group highways, roads, and streets by the character of service they provide.","Some agencies can classify roads and highways according to urban and rural services based on specific criteria.","Some agencies may use other classifications, such as local, major and minor collector, minor arterial, and principal arterial.","In step 1404, to monitor and identify the current environment, GPS receiver 510 can determine a current location of vehicle 104, and navigation system 508 can provide computer system 404 the data resources to determine if the current road has a functional classification.","Although functional classification of roads is described, the embodiments intend to include or otherwise cover any type of region, area, zone, or road classification system that can accomplish the features and functions of the embodiments.","For example, instead of a functional classification system, the method step 1404, to monitor and identify the current environment, can use city, county, state, province, or other boundaries as environmental zones.","In an alternative embodiment, environment classification can use terrain, natural land features, natural water features, etc.","FIG.","14 can include step 1406 to determine if vehicle 104 is located in a rural zone.","If the vehicle 104 is located in a rural zone, then the method continues to step 1408 where computer system 404 can be configured to a rural warning mode.","In the rural warning mode, a predetermined threshold number of pedestrians detected from V2P signals can be automatically configured by computer system 404.The threshold may be configured to any number of pedestrians that could indicate high pedestrian traffic such that frequent V2P warnings to a driver can be deemed a nuisance in a rural environment.","The method proceeds in step 1410 to determine if the number of detected V2P signals representing pedestrians as VRUs exceed the rural warning mode threshold either simultaneously or over a predefined time period.","In the case of falling below the threshold, the computer system 404 can remain in a default rural warning mode 1412.In the case of exceeding the threshold, in step 1414 computer system 404 can automatically adjust a frequency and/or type of V2P alerts.","In an embodiment, V2P alerts can be generated less frequently than in a default rural configuration.","In an alternative embodiment, alerts are changed to an “information” alert that displays V2P information to a display device 610.The vehicle 104 may be traveling on a road and/or path that will transition from the current environment zone to a new environment zone.","Therefore, the method automatically returns to step 1404 to monitor and identify the current environment.","If computer system 404 determines at step 1406, to determine if vehicle is located in a rural zone, that vehicle 104 is not located in a rural zone, the method continues to step 1416 to determine if the vehicle 104 is in a suburban zone.","If computer system 404 determines that vehicle 104 is located in a suburban zone, then the method continues to step 1418 where computer system 404 can be configured to a suburban warning mode.","In the suburban warning mode, a predetermined threshold number of detected V2P signals can be automatically configured by the computer system 404.The threshold may be configured to any number of pedestrians that can indicate high pedestrian traffic such that frequent V2P alerts can be a nuisance to a driver.","In the embodiment, a number of pedestrians are identified by computer system 404 by their V2P signals within proximity to vehicle 104.The method determines in decision step 1420 if the number of V2P signals exceed the suburban warning mode threshold.","If the numbers of pedestrians are below the threshold, the computer system 404 maintains the suburban warning mode at step 1422.If the number of V2P signals exceed the threshold, then step 1424 can automatically adjust a frequency and/or type of warning indicator/alert to a driver either at display device 610 or with an audible indicator.","In an embodiment, computer system 404 can generate pedestrian warnings less frequently than in a default suburban configuration.","In an alternative embodiment, computer system 404 changes warnings to an “information” mode of configuration that transmits information to a driver instead of a warning or alert.","The method automatically returns to step 1404 to monitor and identify the current environment.","At step 1404, to monitor and identify the current environment, if computer system 404 determines that vehicle 104 is not in a rural environment zone or a suburban environment zone, the method continues to 1426 to determine if the vehicle 104 is located within an urban zone.","If computer system 404 determines that vehicle 104 is located within an urban zone, then the computer system 404 can be configured to an urban warning mode in step 1428.In the urban warning mode, a predetermined threshold number of V2P signals can be automatically configured by the computer system 404.The threshold may be configured to any number of V2P signals that could indicate high pedestrian traffic such that frequent V2P alerts can be deemed a nuisance.","In decision step 1430, the computer system 404 determines if the number of V2P signals exceed the urban warning mode threshold.","In the case of the number of V2P signals falling below the threshold, step 1432 may maintain the urban warning mode.","In the case of exceeding the threshold, step 1434 may automatically adjust computer system 404 to configure the frequency and/or type of warning indicator/alert to a driver.","In an embodiment, computer system 404 can adjust the alerts to less frequent or not at all.","Further, the computer system 404 can generate an “information” mode of configuration that displays V2P information on display device 610 instead of an alert.","As a final step, the method automatically returns to step 1404 to monitor and identify the environment.","FIG.","15 is a flowchart of a method 1500 to update event data at the CWS 400 by service provider 212.At predetermined times, the event data in the CWS 400 may be updated, or new event data may be downloaded due to a new subscription or new features to an old subscription for a service associated with CWS 400.The downloaded collision event data may be provided by service provider 212 or another service provider.","In some embodiments, the download may occur upon the request from vehicle 104.In other embodiments, the download may occur upon request of the service provider 212.In still other embodiments, vehicle 104 may be programmed to request, or service provider 212 may be programmed to initiate, an automatic download on a predetermined basis.","The method 1500 to update event data may include a first step 1502 where the vehicle 104 CWS 400 initiates a download of updated event data from service provider 212.Computer system 404 may initiate the download of event data by transmitting a request to FCW server 302.A second step 1504 may include the service provider 212 receives the request for the updated event data.","A third step 1506 may include the vehicle 104 sending user or vehicle credentials to the service provider 212 in order to identify CWS 400.A fourth step 1508 may include the service provider packaging the next event update.","A fifth step 1510 may include the service provider sending the event data update to computer system 404.A sixth step 1512 may include the CWS 400 receiving and updating the CWS 400 with the received event data.","FIG.","16 is a flowchart of an exemplary method 1600 for transmitting event data to the service provider 212.A first step 1602 may include the CWS 400 storing event data in the collision event database 422.A second step 1604 may include the CWS 400 transmitting the event data to the service provider 212.A third step 1606 may include the service provider 212 updating the FCW database 306 with the new event data.","A fourth step 1608 may include the service provider 212 providing the updated FCW database 306 to other vehicles using the vehicle communication network 200.The above described techniques may take the form of computer or controller implemented processes and apparatuses for practicing those methods.","The disclosure can also be embodied in the form of computer program code containing instructions embodied in tangible media, such as floppy diskettes, CD-ROMs, hard drives, or any other computer-readable storage medium, wherein, when the computer program code is loaded into and executed by a computer or controller, the computer becomes an apparatus for practicing the embodiments.","The disclosure may also be embodied in the form of computer program code or signal, for example, whether stored in a storage medium, loaded into and/or executed by a computer or controller, or transmitted over some transmission medium, such as over electrical wiring or cabling, through fiber optics, or via electromagnetic radiation, wherein, when the computer program code is loaded into and executed by a computer, the computer becomes an apparatus for practicing the embodiments.","When implemented on a general-purpose microprocessor, the computer program code segments configure the microprocessor to create specific logic circuits.","VII.","Alternative Embodiments While certain embodiments of the invention are described above, and FIGS.","1-16 disclose the best mode for practicing the various inventive aspects, it should be understood that the invention can be embodied and configured in many different ways without departing from the spirit and scope of the invention.","Exemplary embodiments are intended to include or otherwise cover any type of vehicle-to-vehicle, vehicle-to-external, or one-to-many communication network.","In other words, exemplary embodiments are intended to cover any application of a communications network between vehicles, bicycles, motorcycles, pedestrians, processors, servers, controllers, etc.","and infrastructure disclosed above.","Exemplary embodiments are intended to include or otherwise cover identification and warning for any type of event or scenario that could be a hazard to a moving vehicle 104 either on a road or off-road.","Weather patterns and forces of nature can be identified and saved as potential collision events, such as flooding roads or areas, snowy or icy roads or areas, storm-hit or windy roads or areas, including road hazards, such as fallen rocks or trees caused by forces of nature.","Exemplary embodiments are also intended to cover execution of method steps on any appropriate specialized or general purpose server, computer device, or processor in any order relative to one another.","Some of the steps in the embodiments can be omitted, as desired.","A computer architecture of the embodiments may be a general purpose computer or a special purpose computer.","A computer can be used to implement any components of the CWS 400 or the methods of the embodiments.","For example, components of computer system 404 can be implemented on a computer via its hardware, software program, firmware, or a combination thereof.","Although individual computers or servers are shown in the embodiments, the computer functions relating to computer system 404 may be implemented in a distributed fashion on a number of similar platforms, to distribute the processing and/or functional load.","Embodiments are also intended to include or otherwise cover methods of using and methods of manufacturing the collision warning system disclosed above.","The methods of manufacturing include or otherwise cover processors and computer programs implemented by processors used to design various elements of the CWS 400 above.","For example, embodiments are intended to cover processors and computer programs used to design or test the CWS 400.Exemplary embodiments are intended to cover all software or computer programs capable of enabling processors to implement the above operations, designs and determinations.","Exemplary embodiments are also intended to cover any and all currently known, related art or later developed non-transitory recording or storage mediums (such as a CD-ROM, DVD-ROM, hard drive, RAM, ROM, floppy disc, magnetic tape cassette, etc.)","that record or store such software or computer programs.","Exemplary embodiments are further intended to cover such software, computer programs, systems and/or processes provided through any other currently known, related art, or later developed medium (such as transitory mediums, carrier waves, etc.","), usable for implementing the exemplary operations disclosed above.","These computer programs can be executed in many exemplary ways, such as an application that is resident in the memory of a device or as a hosted application that is being executed on a server and communicating with the device application or browser via a number of standard protocols, such as TCP/IP, HTTP, XML, SOAP, REST, JSON and other sufficient protocols.","The disclosed computer programs can be written in exemplary programming languages that execute from memory on the device or from a hosted server, such as BASIC, COBOL, C, C++, Java, Pascal, or scripting languages such as JavaScript, Python, Ruby, PHP, Perl or other sufficient programming languages.","Embodiments are amenable to a variety of modifications and/or enhancements.","For example, although the implementation of various components described above may be embodied in a hardware device, it can also be implemented as a software-only solution, e.g., an installation on an existing server.","In addition, systems and their components as disclosed herein can be implemented as a firmware, firmware/software combination, firmware/hardware combination, or a hardware/firmware/software combination.","Some of the disclosed embodiments include or otherwise involve data transfer over a network, such as communicating various inputs over the network.","The network may include, for example, one or more of the Internet, Wide Area Networks (WANs), Local Area Networks (LANs), analog or digital wired and wireless telephone networks (e.g., a PSTN, Integrated Services Digital Network (ISDN), a cellular network, and Digital Subscriber Line (xDSL)), radio, television, cable, satellite, and/or any other delivery or tunneling mechanism for carrying data.","Network may include multiple networks or sub networks, each of which may include, for example, a wired or wireless data pathway.","The network may include a circuit-switched voice network, a packet-switched data network, or any other network able to carry electronic communications.","For example, the network may include networks based on the Internet protocol (IP) or asynchronous transfer mode (ATM), and may support voice using, for example, VoIP, Voice-over-ATM, or other comparable protocols used for voice data communications.","In one implementation, the network includes a cellular telephone network configured to enable exchange of text or SMS messages.","Examples of a network include, but are not limited to, a personal area network (PAN), a storage area network (SAN), a home area network (HAN), a campus area network (CAN), a local area network (LAN), a wide area network (WAN), a metropolitan area network (MAN), a virtual private network (VPN), an enterprise private network (EPN), Internet, a global area network (GAN), and so forth.","While the subject matter has been described in detail with reference to exemplary embodiments thereof, it will be apparent to one skilled in the art that various changes can be made, and equivalents employed, without departing from the scope of the invention."]],"string":"[\n [\n \"VEHICULAR COMMUNICATIONS NETWORK AND METHODS OF USE AND MANUFACTURE THEREOF\",\n \"Some embodiments are directed to a computer-implemented method for controlling a vehicle and includes determining a current environment of the vehicle based on a current location of the vehicle, and detecting vulnerable road users (VRUs) disposed in proximity to the vehicle based on messages communicated using a vehicular communications network.\",\n \"The method includes modifying a collision warning system of the vehicle according to the current environment of the vehicle and a number of the detected VRUs.\"\n ],\n [\n \"1.A computer-implemented method for controlling a vehicle, comprising: determining a current environment of the vehicle based on a current location of the vehicle; detecting vulnerable road users (VRUs) disposed in proximity to the vehicle based on messages communicated using a vehicular communications network; and modifying a collision warning system of the vehicle according to the current environment of the vehicle and a number of the detected VRUs.\",\n \"2.The computer-implemented method of claim 1, including setting a warning mode of the collision warning system based on the current environment of the vehicle.\",\n \"3.The computer-implemented method of claim 1, wherein the current environment of the vehicle is a classification of a path on which the vehicle is traveling.\",\n \"4.The computer-implemented method of claim 1, wherein the current environment of the vehicle is at least one of a rural zone, a suburban zone, and an urban zone.\",\n \"5.The computer-implemented method of claim 1, including sensing entity movement of the detected VRUs relevant to a path on which the vehicle is traveling, and modifying the collision warning system of the vehicle according to the entity movement.\",\n \"6.The computer-implemented method of claim 1, including determining whether the number of the detected VRUs indicates high pedestrian traffic according to the current environment of the vehicle.\",\n \"7.The computer-implemented method of claim 1, including determining a predetermined threshold number of VRUs for the current environment of the vehicle.\",\n \"8.The computer-implemented method of claim 7, wherein the predetermined threshold number of VRUs indicates high pedestrian traffic for the current environment of the vehicle either simultaneously or over a predefined time period.\",\n \"9.The computer-implemented method of claim 1, wherein upon determining the number of detected VRUs exceeds a predetermined threshold number of VRUs, modifying the collision warning system includes adjusting a frequency of alerts thereby generating the alerts less frequently.\",\n \"10.The computer-implemented method of claim 1, wherein upon determining the number of detected VRUs exceeds a predetermined threshold number of VRUs, modifying the collision warning system includes changing a type of alert to display information about the VRUs on a driver vehicle interface.\",\n \"11.The computer-implemented method of claim 1, including detecting a transition from the current environment to a new environment, and modifying the collision warning system of the vehicle according to the new environment.\",\n \"12.A vehicle system of a vehicle traveling along a path, comprising: a geographic position component that is configured to detect vehicle location data of the vehicle; at least one transceiver operably connected for communication with a vehicular communications network, the transceiver configured to receive vehicle-to-pedestrian (V2P) signals from vulnerable road users (VRUs); a driver vehicle interface that is configured to communicate information to a vehicle operator; and a processor that is configured to: determine a current environment and a current location of the vehicle based on the vehicle location data, determine a number of VRUs disposed in proximity to the vehicle based on the V2P signals, and modify the vehicle system according to the current environment of the vehicle and the number of VRUs.\",\n \"13.The vehicle system of claim 12, including at least one sensor that is configured to sense current path data relevant to current conditions of the path, wherein the current path data includes entity movement of the VRUs relevant to the path, wherein the processor is configured to determine an event pattern of entity movement of the VRUs relevant to the current location of the vehicle, and modify the vehicle system according to the event pattern.\",\n \"14.The vehicle system of claim 12, wherein the current environment of the vehicle is at least one of a rural zone, a suburban zone, and an urban zone.\",\n \"15.The vehicle system of claim 12, wherein the processor is configured to determine a predetermined threshold number of VRUs indicating high pedestrian traffic for the current environment of the vehicle.\",\n \"16.The vehicle system of claim 15, wherein the processor is configured to modify a frequency of alerts of the vehicle system communicated by the driver vehicle interface based on the predetermined threshold number of VRUs and the determined number of VRUs.\",\n \"17.A vehicular communications network for use with a vehicle configured for travel along a path, at least one source of vehicle location data, and at least one source of current path data relevant to current conditions of the path, the vehicular communications network comprising: a processor that is configured to: access the vehicle location data and the current path data; determine a current environment of the vehicle based on the vehicle location data; detect vulnerable road users (VRUs) disposed in proximity to the vehicle based on the current path data; and modify a driver vehicle interface according to the current environment of the vehicle and a number of the detected VRUs.\",\n \"18.The vehicular communications network of claim 17, wherein the processor is configured to determine an event pattern of entity movement of the detected VRUs indicating a potential of the detected VRUs to move onto the path based on the current path data, and wherein the processor is configured to modify the driver vehicle interface according to the event pattern.\",\n \"19.The vehicular communications network of claim 17, wherein the processor is configured to set a warning mode of a collision warning system of the vehicle based on the current environment of the vehicle.\",\n \"20.The vehicular communications network of claim 17, wherein the processor is configured to modify the driver vehicle interface by adjusting a frequency of alerts provided by the driver vehicle interface as a function of the number of the detected VRUs.\"\n ],\n [\n \" BACKGROUND The disclosed subject matter relates to vehicular communications networks and methods of use and manufacture thereof.\",\n \"In particular, some embodiments relate to methods and apparatus for generating, transmitting, and/or receiving data along a vehicular communications network relating to a vehicle's location and/or path or route of travel.\",\n \"Various conditions may be relevant to a vehicle's travel along a path or route.\",\n \"For example, in the context of vehicles that travel over land, such as an automobile configured for travel along a road, a vast array of circumstances may arise that can affect or otherwise be relevant to the vehicle's travel.\",\n \"An entity, such as another vehicle, pedestrian, bicyclist, etc., may move to a location immediately in front of the vehicle on the road, causing the vehicle to contact the entity unless the vehicle stops, changes course, etc.\",\n \"As another example, other types of circumstances may arise making it preferable to change the vehicle's path or route of travel, such as to enable the vehicle to arrive at a certain destination more safely, quickly, efficiently, etc.\",\n \"Changing traffic patterns may make a vehicle's current path of travel more congested, and thus a different path may be preferable.\",\n \"Vehicles may be provided with methods and apparatus for addressing the above conditions.\",\n \"For example, sensors can be mounted on vehicles to detect entities currently disposed in the vehicle's immediate path of travel for the purpose of warning the vehicle's operator to take action to avoid crashing into the entity.\",\n \"Vehicular operators may also utilize global positioning systems (GPSs) to determine currently effective routes of travel, and even modify these routes based on changing traffic conditions.\",\n \"In other words, current conditions can be monitored for the purpose of benefitting vehicular operators.\"\n ],\n [\n \" SUMMARY The monitoring and use of data other than currently sensed or real time data may further benefit vehicular operators.\",\n \"For example, historical data may be used to provide further guidance, such as to advise vehicular operators to change travel routes.\",\n \"As one example, a certain route may be very congested at certain times and/or days of the week (such as during a weekday rush hour), making it more effective to take another (albeit longer) route that is less congested at the relevant time, day, etc.\",\n \"Historical data relating to the physical conditions of certain roads, bridges, etc.\",\n \"at certain times, days of the week, etc.\",\n \"may also affect route selection.\",\n \"Historical data may be used to select enhanced routes of travel based on safety issues that may arise at certain times of day, days of the week, times of the year, etc., such as to avoid certain roads during times of the year where treacherous conditions may exist, e.g., ice, snow, flooding, etc.\",\n \"Historical data by itself may be used to determine that a trend or pattern at a certain time, day of the week, time of the year, etc., at a certain location along a vehicle's path or route is likely to occur.\",\n \"As one example, pedestrians, bicyclists, etc., may tend to illegally cross a street at certain times of day (such as when a local school releases its students), or automobiles may tend to illegally fail to stop for a red light of an intersection at certain times of day (such as near the time when workers need to arrive at a local office).\",\n \"This trend or pattern may be used to alert a vehicle operator of these potentially dangerous conditions if the vehicle will be traveling proximate these locations at the relevant times, etc.\",\n \"However, the trend or pattern that is determined based solely on the historical data may frequently be inaccurate, and thus may result in unnecessarily alerting the vehicle operator and thus needlessly annoying or distracting the vehicle operator.\",\n \"In addition, the effectiveness of historical data alone may be limited to predictable events, such as the regular closure of roads, bridges, etc., or regular traffic patterns.\",\n \"However, some traffic patterns or road hazards do not follow regular or predictable schedules, and may change periodically.\",\n \"It may therefore be beneficial to combine historical data with other data, or otherwise use historical data more dynamically, such as to address less predictable events.\",\n \"For example, trends or patterns can be determined based on historical data collected from one or multiple sources, and the relevance of these trends or patterns can be predicted based on other types of data, such as data relating to current conditions.\",\n \"It may therefore be even more beneficial to supplement the trends or patterns that are determined based on historical data with more relevant or current data.\",\n \"In other words, it may be beneficial to warn a vehicle operator where both of the following occur: 1) historical data indicates that a certain trend exists that may be relevant to the vehicle's travel along the path or route; and 2) currently sensed or other data indicates an increased likelihood that the trend will occur.\",\n \"For example, using data indicating the existence of an entity relevant to the trend, such as an actual bicycle or pedestrian approaching a road where bicyclists or pedestrians trend to cross illegally, or the approach of an actual automobile to an intersection where automobiles tend to fail to stop at red lights, may provide vehicular operators with even better or more effective information.\",\n \"Some embodiments are therefore directed to ascertaining a potential road hazard or collision with another entity, such as a vehicle, pedestrian, or wildlife, and sharing the information within a vehicle communication network.\",\n \"Some embodiments are directed to data logging of unexpected or incompliant actual or potential road hazards and scenarios into a database for integration with a vehicle collision warning system.\",\n \"Embodiments include making a determination of a potential road hazard that could become a collision event, data logging potential road hazards, vehicle data, traffic and vehicle data from other vehicles and users, and environmental data external to a vehicle, predicting a road hazard based on patterns of collected data, and methods of sharing alert information with other vehicles and users in a vehicle communication network.\",\n \"More particularly, some embodiments are directed to a computer-implemented method for controlling a vehicle, and includes determining a current environment of the vehicle based on a current location of the vehicle, and detecting vulnerable road users (VRUs) disposed in proximity to the vehicle based on messages communicated using a vehicular communications network.\",\n \"The method includes modifying a collision warning system of the vehicle according to the current environment of the vehicle and a number of the detected VRUs.\",\n \"Some other embodiments are directed to a vehicle system of a vehicle traveling along a path.\",\n \"The vehicle system includes a geographic position component that is configured to detect vehicle location data of the vehicle, at least one transceiver operably connected for communication with a vehicular communications network that is configured to receive vehicle-to-pedestrian (V2P) signals from vulnerable road users (VRUs), and a driver vehicle interface that is configured to communicate information to a vehicle operator.\",\n \"Further, the vehicle system includes a processor that is configured to determine a current environment and a current location of the vehicle based on the vehicle location data, and determine a number of VRUs disposed in proximity to the vehicle based on the V2P signals.\",\n \"The processor is configured to modify the vehicle system according to the current environment of the vehicle and the number of VRUs.\",\n \"Still other embodiments are directed to a vehicular communications network for use with a vehicle configured for travel along a path, at least one source of vehicle location data, and at least one source of current path data relevant to current conditions of the path.\",\n \"The vehicular communications network includes a processor that is configured to access the vehicle location data and the current path data, determine a current environment of the vehicle based on the vehicle location data, and detect vulnerable road users (VRUs) disposed in proximity to the vehicle based on the current path data.\",\n \"The processor is configured to modify a driver vehicle interface according to the current environment of the vehicle and a number of the detected VRUs.\"\n ],\n [\n \"This application is a continuation U.S. application Ser.\",\n \"No.\",\n \"15/073,598 filed on Mar.\",\n \"17, 2016, which is expressly incorporated herein by reference.\",\n \"BACKGROUND The disclosed subject matter relates to vehicular communications networks and methods of use and manufacture thereof.\",\n \"In particular, some embodiments relate to methods and apparatus for generating, transmitting, and/or receiving data along a vehicular communications network relating to a vehicle's location and/or path or route of travel.\",\n \"Various conditions may be relevant to a vehicle's travel along a path or route.\",\n \"For example, in the context of vehicles that travel over land, such as an automobile configured for travel along a road, a vast array of circumstances may arise that can affect or otherwise be relevant to the vehicle's travel.\",\n \"An entity, such as another vehicle, pedestrian, bicyclist, etc., may move to a location immediately in front of the vehicle on the road, causing the vehicle to contact the entity unless the vehicle stops, changes course, etc.\",\n \"As another example, other types of circumstances may arise making it preferable to change the vehicle's path or route of travel, such as to enable the vehicle to arrive at a certain destination more safely, quickly, efficiently, etc.\",\n \"Changing traffic patterns may make a vehicle's current path of travel more congested, and thus a different path may be preferable.\",\n \"Vehicles may be provided with methods and apparatus for addressing the above conditions.\",\n \"For example, sensors can be mounted on vehicles to detect entities currently disposed in the vehicle's immediate path of travel for the purpose of warning the vehicle's operator to take action to avoid crashing into the entity.\",\n \"Vehicular operators may also utilize global positioning systems (GPSs) to determine currently effective routes of travel, and even modify these routes based on changing traffic conditions.\",\n \"In other words, current conditions can be monitored for the purpose of benefitting vehicular operators.\",\n \"SUMMARY The monitoring and use of data other than currently sensed or real time data may further benefit vehicular operators.\",\n \"For example, historical data may be used to provide further guidance, such as to advise vehicular operators to change travel routes.\",\n \"As one example, a certain route may be very congested at certain times and/or days of the week (such as during a weekday rush hour), making it more effective to take another (albeit longer) route that is less congested at the relevant time, day, etc.\",\n \"Historical data relating to the physical conditions of certain roads, bridges, etc.\",\n \"at certain times, days of the week, etc.\",\n \"may also affect route selection.\",\n \"Historical data may be used to select enhanced routes of travel based on safety issues that may arise at certain times of day, days of the week, times of the year, etc., such as to avoid certain roads during times of the year where treacherous conditions may exist, e.g., ice, snow, flooding, etc.\",\n \"Historical data by itself may be used to determine that a trend or pattern at a certain time, day of the week, time of the year, etc., at a certain location along a vehicle's path or route is likely to occur.\",\n \"As one example, pedestrians, bicyclists, etc., may tend to illegally cross a street at certain times of day (such as when a local school releases its students), or automobiles may tend to illegally fail to stop for a red light of an intersection at certain times of day (such as near the time when workers need to arrive at a local office).\",\n \"This trend or pattern may be used to alert a vehicle operator of these potentially dangerous conditions if the vehicle will be traveling proximate these locations at the relevant times, etc.\",\n \"However, the trend or pattern that is determined based solely on the historical data may frequently be inaccurate, and thus may result in unnecessarily alerting the vehicle operator and thus needlessly annoying or distracting the vehicle operator.\",\n \"In addition, the effectiveness of historical data alone may be limited to predictable events, such as the regular closure of roads, bridges, etc., or regular traffic patterns.\",\n \"However, some traffic patterns or road hazards do not follow regular or predictable schedules, and may change periodically.\",\n \"It may therefore be beneficial to combine historical data with other data, or otherwise use historical data more dynamically, such as to address less predictable events.\",\n \"For example, trends or patterns can be determined based on historical data collected from one or multiple sources, and the relevance of these trends or patterns can be predicted based on other types of data, such as data relating to current conditions.\",\n \"It may therefore be even more beneficial to supplement the trends or patterns that are determined based on historical data with more relevant or current data.\",\n \"In other words, it may be beneficial to warn a vehicle operator where both of the following occur: 1) historical data indicates that a certain trend exists that may be relevant to the vehicle's travel along the path or route; and 2) currently sensed or other data indicates an increased likelihood that the trend will occur.\",\n \"For example, using data indicating the existence of an entity relevant to the trend, such as an actual bicycle or pedestrian approaching a road where bicyclists or pedestrians trend to cross illegally, or the approach of an actual automobile to an intersection where automobiles tend to fail to stop at red lights, may provide vehicular operators with even better or more effective information.\",\n \"Some embodiments are therefore directed to ascertaining a potential road hazard or collision with another entity, such as a vehicle, pedestrian, or wildlife, and sharing the information within a vehicle communication network.\",\n \"Some embodiments are directed to data logging of unexpected or incompliant actual or potential road hazards and scenarios into a database for integration with a vehicle collision warning system.\",\n \"Embodiments include making a determination of a potential road hazard that could become a collision event, data logging potential road hazards, vehicle data, traffic and vehicle data from other vehicles and users, and environmental data external to a vehicle, predicting a road hazard based on patterns of collected data, and methods of sharing alert information with other vehicles and users in a vehicle communication network.\",\n \"More particularly, some embodiments are directed to a computer-implemented method for controlling a vehicle, and includes determining a current environment of the vehicle based on a current location of the vehicle, and detecting vulnerable road users (VRUs) disposed in proximity to the vehicle based on messages communicated using a vehicular communications network.\",\n \"The method includes modifying a collision warning system of the vehicle according to the current environment of the vehicle and a number of the detected VRUs.\",\n \"Some other embodiments are directed to a vehicle system of a vehicle traveling along a path.\",\n \"The vehicle system includes a geographic position component that is configured to detect vehicle location data of the vehicle, at least one transceiver operably connected for communication with a vehicular communications network that is configured to receive vehicle-to-pedestrian (V2P) signals from vulnerable road users (VRUs), and a driver vehicle interface that is configured to communicate information to a vehicle operator.\",\n \"Further, the vehicle system includes a processor that is configured to determine a current environment and a current location of the vehicle based on the vehicle location data, and determine a number of VRUs disposed in proximity to the vehicle based on the V2P signals.\",\n \"The processor is configured to modify the vehicle system according to the current environment of the vehicle and the number of VRUs.\",\n \"Still other embodiments are directed to a vehicular communications network for use with a vehicle configured for travel along a path, at least one source of vehicle location data, and at least one source of current path data relevant to current conditions of the path.\",\n \"The vehicular communications network includes a processor that is configured to access the vehicle location data and the current path data, determine a current environment of the vehicle based on the vehicle location data, and detect vulnerable road users (VRUs) disposed in proximity to the vehicle based on the current path data.\",\n \"The processor is configured to modify a driver vehicle interface according to the current environment of the vehicle and a number of the detected VRUs.\",\n \"BRIEF DESCRIPTION OF THE DRAWINGS The disclosed subject matter of the present application will now be described in more detail with reference to exemplary embodiments of the apparatus and method, given by way of example, and with reference to the accompanying drawings, in which: FIG.\",\n \"1 is a schematic of a traffic scenario that involves an intersection.\",\n \"FIG.\",\n \"2 is a schematic of a vehicle communication network according to aspects of the embodiments.\",\n \"FIG.\",\n \"3 is a schematic of an embodiment for a service provider of the vehicle communication network of FIG.\",\n \"2.FIG.\",\n \"4 is a schematic of a collision warning system of the vehicle communications network shown in FIG.\",\n \"2.FIG.\",\n \"5 is a schematic of vehicle systems that can be associated with the collision warning system of FIG.\",\n \"4.FIG.\",\n \"6 is a schematic of an exemplary design of a vehicle interior associated with the collision warning system of FIG.\",\n \"4.FIG.\",\n \"7 is a flowchart of an exemplary method to inform a vehicle of potential collision events in conjunction with the collision warning system of FIG.\",\n \"4.FIG.\",\n \"8 is a flowchart of an exemplary method to predict potential collision events and alert a vehicle in conjunction with the collision warning system of FIG.\",\n \"4.FIG.\",\n \"9 is a flowchart of an exemplary method for receiving and classifying new event data in conjunction with the collision warning system of FIG.\",\n \"4.FIG.\",\n \"10 is a functional flowchart of an exemplary method for comparing new event data with patterns of prior event data events in conjunction with the collision warning system of FIG.\",\n \"4.FIG.\",\n \"11 illustrates an embodiment of the collision warning system of FIG.\",\n \"4 alerting a vehicle of potential collision scenarios with pedestrians.\",\n \"FIG.\",\n \"12 illustrates an embodiment of the collision warning system of FIG.\",\n \"4 alerting a vehicle of a potential collision scenario with a bicycle.\",\n \"FIG.\",\n \"13 illustrates an embodiment of the collision warning system of FIG.\",\n \"4 alerting a vehicle of a potential collision scenario with wildlife.\",\n \"FIG.\",\n \"14 is a flowchart of a method for configuring the collision warning system of FIG.\",\n \"4 based on an environment.\",\n \"FIG.\",\n \"15 is a flowchart of a method to update event data at the collision warning system of FIG.\",\n \"4 by the service provider of FIG.\",\n \"3.FIG.\",\n \"16 is a flowchart of an exemplary method for transmitting event data to the service provider of FIG.\",\n \"3.DETAILED DESCRIPTION OF EXEMPLARY EMBODIMENTS A few inventive aspects of the disclosed embodiments are explained in detail below with reference to the various figures.\",\n \"Exemplary embodiments are described to illustrate the disclosed subject matter, not to limit its scope, which is defined by the claims.\",\n \"Those of ordinary skill in the art will recognize a number of equivalent variations of the various features provided in the description that follows.\",\n \"I.\",\n \"Overall Vehicle Communication Network Some of the disclosed embodiments relate to a vehicle communication network that is disclosed below in the context of a traffic scenario 100.This scenario may involve one or more users and vulnerable road users (VRUs).\",\n \"The users can include vehicles, and the VRUs can include pedestrians, automobiles, trucks, vans, minivans, sport utility vehicles (SUVs), busses, recreational vehicles, amusement park vehicles, trams, golf carts, robotically controlled vehicles, automated drive vehicles, remote controlled vehicles, drones, motorcycles, scooters, mopeds, bicycles, ATVs, roadside units, transportable objects, trains, trams, light rail trains, boats, personal watercraft, aircraft, helicopters, or any transport related entity or infrastructure.\",\n \"In fact, the various disclosed methods and apparatus are intended to be usable with any type of user and/or mode of transport that can travel along, or can be located in proximity to, any improved, unimproved, and/or unmarked path.\",\n \"The disclosed vehicle communication network is intended to be implemented with any known, related art or later developed technologies.\",\n \"For example, the implemented technologies can involve ad hoc networks, Dedicated Short Range Communications (DSRC) networks (including but not limited to those types of networks currently used by some transport and traffic systems, such as for automatic toll collection), wireless access in vehicular environments (WAVE), cellular networks, Wi-Fi networks, and/or any other network protocol that can provide the desired functionalities.\",\n \"Some of the embodiments are disclosed below in the context of a DSRC, which is a short to medium range communications service that provides communications links with high data transfer rates with acceptable or minimal latency.\",\n \"Vehicles, users, and infrastructure equipped with DSRC systems may communicate with each other, with remote DSRC compatible transceivers over a network, or with road side equipment (such as transport related infrastructure).\",\n \"The range of DSRC is typically about 300 meters, with some systems having a maximum range of about 1000 meters.\",\n \"DSRC in the United States typically operates in the 5.9 GHz range, from about 5.85 GHz to about 5.925 GHz, and the typical latency for DSRC is about 50 ms.\",\n \"Some DSRC systems communicate with vehicles operating at 100 miles per hour or less, but embodiments are intended to cover communications with vehicles traveling at any speed.\",\n \"FIG.\",\n \"1 is a schematic of a traffic scenario 100 that involves an intersection 102.Various users, VRUs, and vehicle communication network components can be disposed at or proximate the disclosed intersection 102, including a vehicle 104, a remote vehicle 110, road side equipment (RSE) 112 and 116, a bicycle 120, a single pedestrian 126, a school bus 134, a group of pedestrians 138, and a motorcycle 130.However, the above users, VRUs, and components are merely provided for exemplary purposes to facilitate explanation of the disclosed vehicle communication network, and alternative or additional features may be provided.\",\n \"For example, FIG.\",\n \"1 also shows a bicycle lane 124 along which the bicycle 120 travels.\",\n \"In addition, FIG.\",\n \"1 shows a cellular network antenna 142 for use with the vehicle communication network.\",\n \"The vehicle 104 can transmit, receive and/or exchange communications including data, images, messages, and other information with other vehicles and VRUs using the DSRC network, which can be implemented with DSRC compatible transceivers, such as V2X compatible transceivers.\",\n \"“V2X” is used in the present disclosure to cover “vehicle-to-everything” communications, and variations of V2X designations may depend on the intended user that is transmitting V2X signals.\",\n \"As shown in FIG.\",\n \"1, vehicle 104 may be equipped with a vehicle to vehicle (V2V) transceiver 106 that can exchange messages and information with other users equipped with DSRC compatible transceivers.\",\n \"For example, the V2V transceiver 106 can communicate with remote vehicle 110 via a V2V (vehicle to vehicle) transceiver 108, bicycle 120 via a V2B (vehicle to bicycle) transceiver 122, pedestrian 126 via a V2P (vehicle to pedestrian) transceiver 128, motorcycle 130 via a V2M (vehicle to motorcycle) transceiver 132, school bus 134 via a V2V transceiver 136, and pedestrians 138 via V2P transceivers 140.RSEs 112 and 116 are each equipped with V2I transceivers 114 and 118, respectively, which can be used to transmit information from any type of traffic infrastructure, such as traffic signals, or traffic sensors for speed or road conditions, etc.\",\n \"The V2V transceiver 106 may include components for communicating various types of information between vehicle 104 and other network connected vehicles, VRUs, infrastructure, and networks.\",\n \"In some embodiments, V2V transceiver 106 is intended to be used with one or more vehicle safety systems.\",\n \"Examples of vehicle safety systems include, but are not limited to, collision warning systems, lane departure warning systems, integrated vehicle-based safety systems, automatic guided vehicle systems, other types of safety systems, etc.\",\n \"In some embodiments, vehicle 104 may exchange information between one or more remote vehicles 110.For example, vehicle 104 V2V transceiver 106 and remote vehicle 110 V2V transceiver 108 may be configured to exchange vehicle information that can include, but is not limited to, the type of user or vehicle, navigation data, road hazard data, collision warning data, course heading data, course history data, projected course data, kinematic data, current position data, range or distance data, speed and acceleration data, location data, vehicle sensory data, vehicle subsystem data, and/or any other vehicle information.\",\n \"In various embodiments, vehicle 104 may exchange information using V2X protocols with any number of vehicles, pedestrians, or any other V2X users with an operational V2X transceiver.\",\n \"For example, vehicle 104, remote vehicle 110, motorcycle 130, and school bus 134 may be configured to exchange information over V2X protocols.\",\n \"FIG.\",\n \"2 is a schematic of a vehicle communication network 200 according to some the embodiments.\",\n \"Each V2X compatible user can exchange messages with any or all other V2X compatible users.\",\n \"As an example, vehicle 104 V2V transceiver 106 may exchange messages with V2V transceiver 108 installed in remote vehicle 110 and/or with V2P transceiver 128 carried by pedestrian 126.V2X messages can describe any collection or packet of information and/or data that can be transmitted over vehicle communication network 200.Messages may take the form of basic safety messages and/or may contain more information than basic safety messages, such as commands that can control another vehicle's automated driving system.\",\n \"V2X messages may include any number of bytes of information or data.\",\n \"Some of the embodiments are intended to include exchanging information and messages between networked vehicles and VRUs that may be useful in facilitating vehicle safety.\",\n \"For example, the information may be useful for a particular vehicle in order to warn a vehicle or broadcast a warning to a group of V2X users.\",\n \"Vehicle 104 includes a collision warning system (CWS) 202 that can receive and assess safety information and data.\",\n \"The CWS 202 can constitute an implementation of a collision avoidance technology to assess the risk of a collision of the subject vehicle with another vehicle, pedestrian, entity, etc., and can alert a driver through visual and audible warnings.\",\n \"Components of CWS 202 can exchange safety messages, warnings and alerts, and/or other useful information with V2X users via V2V transceiver 106.CWS 202 may transmit and receive information directly or indirectly to and from a service provider 212 over a wireless communication network 204.In one embodiment, vehicle 104 is connected with the service provider 212 by way of a one-to-many communication network 222.In an embodiment, the service provider 212 includes a remote server 214, a remote transmitter 216, a remote receiver 218, and a remote memory 220 that are configured to be in communication with one another.\",\n \"The one-to-many communication network 222 can include systems that can send information from one source to a plurality of receivers.\",\n \"Examples of one-to-many communication networks can include television, radio, satellite networks, etc.\",\n \"In FIG.\",\n \"2, V2V transmitter 106 can be used by the CWS 202 to receive and transmit information to and from the service provider 212 and other information providers through wireless communication network 204 and broadband network 210, such as the Internet.\",\n \"In alternative embodiments, an RF transceiver 224 can be used by the CWS 202 to receive and transmit information to and from the service provider 212 through wireless communication network 204 and broadband network 210, such as the Internet.\",\n \"RF transmitter 224 can include, but is not limited to, a wireless phone, a wireless modem, a Wi-Fi compatible transceiver, and/or any other device that communicates with other networks using a wireless communication network 204.V2V transmitter 106 can also receive and transmit information to and from traffic data supplier 206 and/or other information supplier 208.This information can include, but is not limited to, train schedules, high-traffic event schedules, other transport related data, etc.\",\n \"Traffic data supplier 206 and other information supplier 208 can communicate with service provider 212 through network 210.In an embodiment, service provider 212 may be linked to vehicles through a network connection, such as via cellular network antenna 142 (see FIG.\",\n \"1), and/or other network connection.\",\n \"Further, any other wireless communication system capable of delivering data may be used such as satellite Wi-Fi, WiMAX, microwave, etc.\",\n \"Service provider 212 may also be linked by a wired connection, such as broadband cable or fiber optic connections, Ethernet, DSL, ADSL, telephone modems, and/or any other wired communication system capable of delivering data.\",\n \"Some of the embodiments are intended to include each V2X transceiver configured to communicate with wireless communication network 204 through cellular network antenna 142, or I2V (infrastructure-to-vehicle) network connection.\",\n \"II.\",\n \"Service Provider FIG.\",\n \"3 is a schematic of an embodiment of service provider 212 of the vehicle communication network 200.In FIG.\",\n \"3, service provider 212 may include a computer controlled service provider network 300, a forward collision warning (FCW) server 302, and a forward collision warning (FCW) database 306.FWC server 302 and FCW database 306 may communicate, through service provider network connections 304 and 308, respectively, to service provider network 300.Alternatively, this communication can be performed directly.\",\n \"The service provider network 300 can be capable of communicating with one or more internal and external computer or communication networks, computer systems, or controller systems.\",\n \"In some embodiments, FCW database 306 is stored on FCW server 302.However in other embodiments, FCW database 306 may be partially or fully located remote from service provider 212.FCW server 302 and FCW database 306 can include processors, memory, and instructions to operate as a computer.\",\n \"FCW server 302 may interact with FCW database 306 to access collision event data and/or information, such as graphics, maps, images, videos, navigational data, or any other data that can be useful to collision warning system 202.FCW database 306 may be organized using any known, related art and/or later developed data storage method and/or structure.\",\n \"FCW database 306 may include hard drives, flash drives, magnetic drives with removable storage media, such as disks or tape, or optical drives with removable storage media, such as discs, memory sticks, memory cards, embedded or discrete flash memory, and/or any other type of memory.\",\n \"Event data may be transmitted to service provider 212 either wirelessly or through wired connections in any manner known or presently unknown the art, such as via transmitter/receiver 322 shown in FIG.\",\n \"3.Event data may be received wirelessly via first, second, and third data providers 310, 312, 314, which can be users in vehicle communication network 200 transmitting event data.\",\n \"For example, vehicle 104, remote vehicle 110, bicycle 120, pedestrian 126, and motorcycle 130 can transmit real time event data that is received and processed by FCW server 302.The embodiments are intended to also include event data provided via fourth, fifth, and sixth data providers 316, 318, 320, which may include data from commercial information providers, traffic data providers, web cams, or government agencies (such as a state or federal departments of transportation).\",\n \"Fourth, fifth, and sixth data providers 316, 318, 320 can provide location and traffic information to service provider 212, such as school locations and schedules, bicycle zones, construction projects, temporary road closings, train locations and schedules, weather updates, major events, such as concerts and athletic competitions, and/or navigation map feature updates.\",\n \"III.\",\n \"Collision Warning System FIG.\",\n \"4 is a schematic of the CWS 202 of the vehicle 104 of FIG.\",\n \"2.However, the disclosed CWS 202 may be associated with other vehicles or used in other applications.\",\n \"Other collision warning systems associated with some vehicles may include different elements and/or arrangements as configured to collision warning system 202, but may be configured to communicate over vehicle communication network 200 with one or more other collision warning systems 202.The CWS shown in FIG.\",\n \"4 is designated with reference number 400 to clearly express the intention to also or alternatively use the system by other entities or in other applications.\",\n \"The vehicle 104 may have one or more computers, such as a collision warning computer system 404 (“computer system”) containing a processor 406, a memory 408 and other components typically present in general or special purpose computers.\",\n \"In some embodiments, the CWS 400 may include programmable logic circuits and/or pre-configured logic circuits for executing collision warning system functions.\",\n \"The memory 408 stores information accessible by processor 406 including instructions 410 and data 412 that may be executed or otherwise used by the processor 406.The control logic (in this example, software instructions or computer program code), when executed by processor 406, causes processor 406 to perform the functions of the embodiments as described herein.\",\n \"The memory 408 may be of any type capable of storing information accessible by the processor, including a computer-readable medium, or other medium that stores data that may be read with the aid of an electronic device, such as a hard-drive, flash drive, memory card, ROM, RAM, DVD or other optical disks, as well as other write-capable and read-only memories.\",\n \"Systems and methods may include different combinations of the foregoing, whereby different portions of the instructions and data are stored on different types of media.\",\n \"The instructions 410 may be any set of instructions to be executed directly (such as machine code) or indirectly (such as scripts) by the processor 406.For example, the instructions may be stored as computer code on the computer-readable medium.\",\n \"In this regard, the terms “instructions” and “programs” may be used interchangeably herein.\",\n \"The instructions may be stored in object code format for direct processing by the processor, or in any other computer language including scripts or collections of independent source code modules that are interpreted on demand or compiled in advance.\",\n \"Functions, methods and routines of the instructions are explained in more detail below.\",\n \"Data 412 may be retrieved, stored or modified by processor 406 in accordance with the instructions 410.For instance, although the system is not limited by any particular data structure, the data may be stored in computer registers, in a relational database as a table having a plurality of different fields and records, XML documents or flat files.\",\n \"The data may also be formatted in any computer-readable format.\",\n \"The data may include any information sufficient to identify the relevant information, such as numbers, descriptive text, proprietary codes, references to data stored in other areas of the same memory or different memories (including other network locations) or information that is used by a function to calculate the relevant data.\",\n \"The processor 406 may be any known, related art or later developed processor.\",\n \"Alternatively, the processor may be a dedicated device, such as an ASIC or DSP.\",\n \"Although FIG.\",\n \"4 illustrates the processor 406, memory 408, and other elements of computer system 404 as being within the same block, it will be understood by those of ordinary skill in the art that the processor 406 and memory 408 may actually include multiple processors and memories that may or may not be stored within the same physical housing.\",\n \"For example, memory 408 may be a hard drive or other storage media located in a housing that is different from that of computer system 404.Accordingly, references to a processor or computer will be understood to include references to a collection of processors, computers or memories that may or may not operate in parallel.\",\n \"Rather than using a single processor to perform the steps described herein, some of the components, such as steering components and deceleration components, may each have their own processor that only performs calculations related to the component's specific function.\",\n \"In an alternative embodiment, the processor 406 may be located remote from the vehicle 104 and communicate with the vehicle wirelessly.\",\n \"In the embodiments, some of the processes described herein are executed on a processor disposed within the vehicle 104, and others by a remote processor.\",\n \"Computer system 404 may include all of the components normally used in connection with a computer, such as a central processing unit (CPU) (e.g.\",\n \"processor 406), the memory 408 (e.g., RAM and internal hard drives) storing data 412 and instructions 410, such as a web browser, a display device 426 (e.g., a monitor having a screen, a small LCD touch-screen or any other electrical device that is operable to display information), user input device 424 (e.g., a mouse, keyboard, touch screen and/or microphone), as well as various sensors (e.g.\",\n \"a video camera) for gathering sensor data as collision event data.\",\n \"The computer system 404 can also include components not normally associated with general purpose computers, such as object detection component 428.The computer system 404 may be capable of communicating with various components of the vehicle 104.For example, computer system 404 may be in communication with the vehicle's electronic control unit (ECU) 402 and may send and receive information from the various systems of vehicle 104, for example a vehicle subsystem sensor system 430, a vehicle communication system 432, a vehicle event sensor system 434, and a vehicle navigation system 436.When engaged, computer system 404 may control some or all of these functions of vehicle 104.It will be understood that, although various systems and computer system 404 are shown within vehicle 104, these elements may be external to vehicle 104 and/or physically separated by large distances.\",\n \"As indicated above, the vehicle 104 may also include the vehicle subsystem sensor system 430.The computer system 404 may communicate with sensors in one or more vehicle subsystems in order to calculate levels of potential collision risks based on speed, direction, acceleration, braking, and/or other factors.\",\n \"The vehicle subsystem sensor system 430 may include, but is not limited to, engine oil/coolant sensing systems, transmission oil sensing systems, brake sensing systems, steering and control sensing systems, fuel storage sensing systems, torque sensors, and speed and acceleration/deceleration sensors, and inertia (yaw) sensor systems.\",\n \"As indicated above, the vehicle 104 may also include the vehicle communication system 432.The computer system 404 may communicate with external communication apparatus for sending and receiving collision event data.\",\n \"For instance, the vehicle communication system 432 includes vehicle V2V transceiver 106 that can communicate with compatible V2X transceivers in the vehicle communication network 200.As described previously in relation to FIG.\",\n \"2, the vehicle communication system 432 can include the RF transceiver 224 for communicating wirelessly to service provider 212 or traffic data supplier 206 through wireless network 204.As further indicated above, the vehicle 104 may also include the vehicle event sensor system 434 for collecting event data.\",\n \"Event data can include detecting the location, orientation, heading, etc., of entities external to the vehicle 104, such as other vehicles, bicycles, and motorcycles, pedestrians, obstacles in the roadway, traffic signals, signs, wildlife, trees, or any entity that can provide information to collision warning system 400.The phrases “event data” and “collision event data” can include any data related to an entity or situation, such as a vehicle, person, environmental scenario, or wildlife that is a road hazard, potential road hazard, predicted road hazard, probably road hazard, or unknown road hazard that can be a danger to a moving vehicle or other entity.\",\n \"In alternative embodiments, the phrases “event data” and “collision event data” can include any data related to entities or sensed data a vehicle's environment that is useful for the collision warning system 202.A vehicle event sensor system 434 may collect sensor data from sensor apparatus including radar, lidar, sonar, cameras, V2X transceivers or any other detection devices which can record event data that can be processed by the computer system 404.Vehicle sensor systems and V2X communication systems can provide data that is processed by the computer system 404 in real-time.\",\n \"In other words, the sensors may continuously update their output to reflect the environment being sensed at or over a range of time, and continuously or as-demanded to provide updated output to the computer system 404.An event pattern comparison calculator can perform statistical and predictive calculations to determine if, based on two or more users' current position data, course heading data, course history data, projected course data, kinematic data, range or distance data, speed and acceleration data, and/or location data, there is a potential risk of collision events in the real-time traffic scenario.\",\n \"Examples of such collision events include, but are not limited to, motorcycle and vehicular traffic, bicycle traffic, pedestrian traffic, objects falling or felled in a roadway (such as rocks or trees), wildlife, domestic animals, flooded roads, or any other condition or environmental situation that could cause an unexpected road hazard.\",\n \"Further, collision event data can include any static or dynamic data and information that are provided in prepared traffic hazard models that could be relevant to the functions of the computer system 404.Data for a potential collision event can be classified as location based, time based, scenario based, hazard or risk based, or another classification or a combination of classifications.\",\n \"Event data from various sources within and external to vehicle 104 can be saved in a data logger in a vehicle collision event database 422.In addition to processing data provided by the various sensors, the computer system 404 may rely on environmental data that was obtained at a previous point in time and previous location either by vehicle 104, remote vehicle 110 or other vehicles in vehicle communication network 200, and is expected to persist regardless of the vehicle's presence in the environment.\",\n \"As shown in FIG.\",\n \"4, a memory 408 component for data 412 may include components for commercial collision event data 414, a collision event map component 416, an event detection component 418, the event comparison calculator (comparison calculator) and the collision event database 422.Collision event map information can be generated by collision event map component 416.Collision event map information can include maps identifying the shape and elevation of roadways, lane lines, intersections, crosswalks, bicycle lanes, school zones, speed limits, traffic signals, buildings, signs, real time traffic information, or other transport information.\",\n \"For example, the map information may include one or more mapped networks of information, such as roads, lanes, intersections, and the connections between these features.\",\n \"Each feature may be stored as map data, and may be associated with information, such as a geographic location, and whether or not it is linked to other related features, e.g., a stop sign may be linked to a road and an intersection, etc.\",\n \"Data 412 may also include commercial collision event data 414, which can include commercially-available databases of transport data, traffic data, traffic schedules, and any other data that could be useful for the embodiments.\",\n \"The event detection component 418 can include processes and instructions 410 for detecting event characteristics or information from data and information collected by the CWS 400.The event detection component can include an image recognition component that can match image and video collected from the CWS 400 with prior images and video that have been identified as related to a potential collision event.\",\n \"The vehicle navigation system 436 can be interoperable with computer system 404 to provide navigation maps and information to vehicle 104.Vehicle navigation system 436 may be any type of known, related or later developed navigational system.\",\n \"The phrase “navigation information” refers to any information that can be used to assist vehicle 104 in navigating a road or path.\",\n \"Navigation information may include traffic data, map data, and road classification information data.\",\n \"Examples of navigation information can include street addresses, street names, street or address numbers, intersection information, points of interest, parks, bodies of water, any political or geographical subdivision including town, township, province, prefecture, city, state, district, ZIP or postal code, and country.\",\n \"Navigation information can also include commercial information including business and restaurant names, commercial districts, shopping centers, and parking facilities.\",\n \"Navigation information can also include geographical information, including information obtained from any Global Navigational Satellite infrastructure (GNSS), including Global Positioning System or Satellite (GPS), Glonass (Russian) and/or Galileo (European).\",\n \"The vehicle 104 may also include a geographic position component 438 as part of vehicle navigation system 436 for determining the geographic location of vehicle 104.For example, the geographic position component 438 may include a GPS receiver 510 (see FIG.\",\n \"5) to determine the device's latitude, longitude and/or altitude position.\",\n \"Other location systems, such as laser-based localization systems, inertial-aided GPS, or camera-based localization may also be used to identify the location of the vehicle.\",\n \"The location of the vehicle 104 may include an absolute geographical location, such as latitude, longitude, and altitude as well as relative location information, such as location relative to other vehicles in an immediately vicinity.\",\n \"A GPS receiver 510 may be used for gathering additional information associated with vehicle 104 that includes, but is not limited to, speed, location, trajectory, distance traveled, acceleration, and other dynamic vehicle information.\",\n \"In alternative embodiments, the vehicle 104 may also include other features in communication with the computer system 404, such as an accelerometer, a gyroscope, or another direction/speed detection device to determine the direction and speed of the vehicle or changes thereto.\",\n \"Vehicle 104 may include other apparatus for communicating, and in some cases controlling, the various components associated with vehicle subsystems.\",\n \"ECU 402 may be configured to communicate with, and/or control, various components of vehicle 104.ECU 402 may communication with a vehicle subsystem 504 (shown in FIG.\",\n \"5) through appropriate wired or wireless communication channels.\",\n \"IV.\",\n \"Vehicle Systems Associated with the Collision Warning System FIG.\",\n \"5 is a schematic showing vehicle systems 500 that can be associated with the collision warning system 400 of FIG.\",\n \"4.As shown in FIG.\",\n \"5, ECU 402 can communicate with a data logger system 502, the vehicle subsystem 504, an automated driving system 506, a navigation system 508, a vehicle sensor system 516, the vehicle V2V transceiver 106, RF transceiver 224, a camera 522, and a laser 524.In the embodiments, data logger system 502 may communicate with ECU 402 in vehicle 104.Data logger system 502 can acquire and log data collected from any of the vehicle systems and subsystems for use by the computer system 404.Data relevant to collision warning system 202 includes, but is not limited to, navigation data, sensor data, multimedia data, such as images or video streams, audio information, scanner data, and other type of data useful for collision warning system 202.ECU 402 may communicate with a vehicle subsystem 504 through appropriate wired or wireless communication channels.\",\n \"The automated driving system 506 can be in communication with ECU 402.In some embodiments, ECU 402 may be configured to control components of vehicle subsystems, for example, to activate a brake actuator prior to an imminent collision.\",\n \"In other embodiments, automated driving system 506 can be configured to mechanically alert a driver of vehicle 104 of a potential collision, or assist the driver of vehicle 104 or another vehicle in communication with vehicle 104 to avoid a road hazard or potential collision.\",\n \"Vehicle 104 can include navigation system 508 that is configured to be in communication with ECU 402, and perform the functions of vehicle navigation system 436.Navigation system 508 may include a navigation system display 512, and can store map and location information in a navigation database 514.Navigation system display 512 may display navigational maps and information to a user of vehicle 104 using any type of display technology known or presently unknown in the art.\",\n \"Navigation system display 512 may also communicate information to a vehicle 104 user using any type of known, related art or later developed audio technology, such as by using predetermined sounds or electronically generated speech.\",\n \"In an embodiment, vehicle sensor system 516 can communicate with ECU 402 and various event data sensor devices, such as sensor 518, radar system 520, camera 522, and laser 524, disposed at the interior or exterior of vehicle 104.The sensors 518, 520, 522, 524 can be located in any beneficial area of vehicle 104.The embodiments are intended to include or otherwise cover any number the sensors that can be placed at any location of vehicle 104 in any configuration.\",\n \"Sensor system 516 may communicate with multiple devices that assist in collecting data including, but not limited to, sensors 518 that can collect data for vehicle speed, steering, and inertia (yaw) relative to gravity or a perpendicular plane to gravity.\",\n \"Although one sensor 518 is shown in FIG.\",\n \"5, it is understood that sensor 518 is a representation of one or more sensors installed within or outside of vehicle 104.Other embodiments of sensors 518 can collect proximity data using rear, front, and side proximity detection sensors 518.The vehicle sensor system 516 can include devices to detect one or more characteristics of a road hazard, such as the presence of a vehicle, pedestrian, entity, or traffic-related situation.\",\n \"Characteristics can include identity, speed, direction, location, acceleration, orientation, size, etc.\",\n \"Examples of sensor system detection devices include, but are not limited to, one or more cameras, radar, sonar, range finding lasers, or any detection devices that can be useful for collecting collision event data in collision event database 422 that can be processed by the computer system 404.Sensor system 516 devices can be advantageous by collecting data for identification and tracking the movement of entities such as motorcycle and vehicular traffic, bicycle traffic, pedestrian traffic, objects fallen in a roadway, such as rocks or trees, wildlife, domestic animals, or any other condition, entity, or vehicle that could provide useful data for processing as collision event data.\",\n \"One or more of the radar systems 520 may be mounted on a front, rear, top, or side of vehicle 104.The radar system 520 can be beneficial by detecting the presence and movement of entities in proximity to vehicle 152, especially when an entity is within a driver's blind spot or obscured by darkness.\",\n \"One or more of the cameras 522 may be mounted internal or external to vehicle 104.FIG.\",\n \"5 illustrates camera 522 at a certain location of vehicle 104 that is merely exemplary.\",\n \"The embodiments are intended to include or otherwise cover any number of one or more cameras 522 that can be placed in any location and/or configuration on vehicle 104 that includes, but is not limited to, a front grill, front and rear bumpers, underneath a vehicle, on a side of vehicle 104, inside vehicle 104, or on a top of vehicle 104.In some embodiments, camera 522 may rotate vertically and horizontally to provide a wide degree of coverage area.\",\n \"A variety of cameras 522 may be used in the embodiments to capture still images and video images in color, infrared, black and white, in two dimensions, or in three dimensions.\",\n \"The camera 522 may capture images, video, and data on any type of medium known in the art, including digital media or film.\",\n \"The captured images and related data may be saved to data logger system 502 for image recognition and movement characteristics processing by computer system 404.An object detection component 428 can compare images from image recognition processing with a database of images, maps, graphics, videos, etc.\",\n \"to identify entities, read text, or determine locations based on the image comparisons.\",\n \"One or more of the lasers 524 may be mounted external to vehicle 104.Laser 524 can capture event data for processing by determining range and intensity of a vehicle, pedestrian, entity, etc., for processing by computer system 404.Laser 524 is capable of capturing range and intensity information of an entity, which can be used to determine the location and distance of the entity.\",\n \"FIG.\",\n \"5 also shows the vehicle 104 V2V transceiver 106 for communicating with other V2X compatible transceivers.\",\n \"In an embodiment, V2V transceiver 106 can collect event data from other V2X transceivers that can be configured for a pedestrian, bicycle, vehicle, building, tower, billboard, traffic signal, road sign, or any transport related entity or user.\",\n \"V2X transceivers can be configured to broadcast the transceiver's location, obtained from an internal GPS receiver, to any V2X transceiver within transmission range.\",\n \"A display on each V2X transceiver can also display any messages, images, alerts, and warnings transmitted received by V2X users in vehicle communication network 200.A communications link between V2X transceivers may be initiated by any user.\",\n \"In the embodiments, a V2X transceiver may continuously search for other V2X transceivers, such as by emitting a periodic signal that searches for a reply.\",\n \"In other embodiments, a V2X transceiver may emit periodic signals searching for a reply from an in-range V2X transceiver.\",\n \"If V2X transceiver replies, then a communications link may be established.\",\n \"Information and data received by V2V transceiver 106 related to V2X communications can be saved to data logger system 502 and processed by computer system 404.V.\",\n \"Vehicle Interior FIG.\",\n \"6 is a schematic of an exemplary design of a vehicle interior 600 associated with the collision warning system 400 of FIG.\",\n \"4.The vehicle interior 600 may include, for example, a dashboard 602, a steering apparatus such as a steering wheel 604, an instrument panel 606, and a center portion 608.Center portion 608 can include one or more devices associated with the interior of the vehicle, including but are not limited to: audio devices, video devices, navigation devices, as well as any other types of devices.\",\n \"In addition, center portion 608 can be associated with controls for one or more systems of vehicle 104 including, but not limited to: climate control systems, radio and sound systems, and other types of systems.\",\n \"The vehicle 104 may also have a display device 610 for displaying information from CWS 400, and/or other related or unrelated vehicular systems.\",\n \"In some embodiments, vehicle 104 can include a driver vehicle interface 612 that may include the display device 610.Examples of display device 610 include, but are not limited to, LCDs, CRTs, ELDs, LEDs, OLEDs, or electronic paper displays each with or without a touchscreen, as well as other types of displays.\",\n \"Display device 610 can include a touchscreen for use as the user input device 424 for activating or deactivating one or more vehicle collision system modes, and for enabling a user to provide information, such as navigation destination or event information, to the computer system 404.In alternative embodiments, driver vehicle interface 612 can include buttons, a keypad, or other types of input devices 424.In another embodiment, driver vehicle interface 612 can include a projection type display that is configured to project an image onto one or more surfaces of vehicle 104, such as windshield 614.Vehicle 104 may also include one or more additional display devices in various locations.\",\n \"In some embodiments, display device 610 can be disposed within center portion 608.However, in other embodiments, display device 610 can be located in any portion of vehicle 104, or can be a portable device.\",\n \"For example, display device 610 can be located within instrument panel 606.In addition, while display device 610 can be configured to present visual information for computer system 404, display device 610 can be shared with other devices or systems within vehicle 104 such as vehicle navigation system 436.In an example, display device 610 may display collision event information, warning alerts, informing alerts, and navigation maps to a user.\",\n \"A driver vehicle interface may inform a driver with auditory warnings or alerts a predicted potential collision.\",\n \"Warnings and alerts may be configured to correspond to the level of road hazard or level of potential collision risk.\",\n \"For example, warnings and alerts may be classified as low, medium, high, or information.\",\n \"Display device 610 can be configured to display no image when no alert or information has been issued by computer system 404.In an embodiment, display device 610 displays a default screen, such as a blank screen, when no alert is issued.\",\n \"However, in embodiments where display device 610 is used for displaying information from other systems, a default screen cannot remain a blank screen with no image.\",\n \"For example, in embodiments where display device 610 is shared with vehicle navigational system 436, display device 610 can continue to display maps and information received from the vehicle navigation system 436 until a warning is issued.\",\n \"Likewise, once a warning has expired, display device 610 can return to displaying maps from navigation system 436.VI.\",\n \"Methods of Operation FIG.\",\n \"1 shows an overhead view of the traffic scenario 100.The users, locations, and other data related to potential road hazard scenarios at intersection 102 can be the subject of digital navigation maps generated by the collision event map component 416 for integration with digital navigation system 436 that can be displayed on display device 610.The intersection 102 is merely provided as an exemplary location in order to illustrate embodiments of CWS 400 and is not intended to be limiting.\",\n \"The embodiments of the disclosure are intended to cover any road, highway, path, lane, course, track, navigable waterway, and paved or unpaved areas that a vehicle, bicycle, motorcycle, pedestrian, boat, train, etc.\",\n \"could move on, along, or through.\",\n \"Exemplary aspects of intersection 102 include two lanes in multiple directions and bicycle lane 124 that traverses only one direction.\",\n \"The embodiments, however, are not limited by a number of lanes, directions, or to an intersection.\",\n \"Any configuration of a road, highway, path, lane, course, track, navigable waterway, and paved or unpaved areas may be used to operate and implement the embodiments.\",\n \"CWS 400 can collect collision event data at or near intersection 102 from multiple sources in vehicle 104, for example V2X signals from other vehicles and users, vehicle event sensor system 434, navigation system 508, and user input on input device 424.CWS 400 activation enables collection of new event data while vehicle 104 approaches and passes through intersection 102.Computer system 404 can process the new event data, compare the new event data from one vehicle to historical event data that the same vehicle or other vehicles collected at the same or proximate location, and generate a prediction as to whether the vehicle should be provided with information relating to a potential collision or provided an alert of a potential collision scenario.\",\n \"The operations of the CWS 400 are described in conjunction with embodiments of the disclosure below.\",\n \"In an embodiment, an event pattern comparison calculator (comparison calculator) 420 may be utilized by computer system 404 to compare new event data with prior event data in collision event database 422 and prior event patterns.\",\n \"If the comparison calculator 420 determines the new event data meets a comparison threshold to a prior event pattern, the new event data is determined to be updated data for the prior event, and the new event data can be combined with data for a prior event pattern.\",\n \"In the embodiments, the comparison calculator 420 can utilize one or more comparison models of statistical analysis to classify patterns of road hazards or potential road hazards as potential collision events.\",\n \"Comparison calculator 420 can compare event data to one or more patterns including, but not limited to, statistical models, data clusters, regression analysis, or any other type of data analysis which can perform the functions of the embodiments.\",\n \"Comparison calculator 420 may provide at least one weighting factor in the comparison models to weight various probabilities associated with road hazards determined from event data collected in real-time or historical event data.\",\n \"The comparison calculator 420 can analyze new event data to determine a statistical match with existing, or prior, road hazard event data.\",\n \"In an embodiment, the comparison calculator 420 may determine a statistical match using probabilities calculated from the data.\",\n \"Comparison calculator 420 may further calculate statistical matches based on dates and times, road hazard characteristics, environmental conditions, traffic conditions, locations, entity headings, or any other condition or data analysis relevant for the embodiments.\",\n \"In an embodiment, comparison calculator 420 may use a single equation that is derived using Bayes' Theorem or Bayesian Rule.\",\n \"Generally, Bayes' Theorem relates the conditional and marginal probabilities of various random events.\",\n \"Using a Bayesian Rule, probabilities of different events occurring may be determined given certain observed scenarios.\",\n \"As a result, the probability of an event occurring generally increases as more prior information from observed scenarios is provided.\",\n \"The comparison calculator 420 may use a Bayesian Rule to combine the various probabilities determined based on conditions associated with any of the ranges or patterns of event data in collision event database 422.If comparison calculator 420 determines that newly-collected event data has a statistical match to historical event data, then the comparison calculator 420 stores the new event data into collision event database 422 with the matched prior event data.\",\n \"If the comparison calculator 420 determines that the new event data is not a statistical match to historical event data, new event data is stored into collision event database 422 as a single event.\",\n \"Single event data in collision event database 422 can be further analyzed by the comparison calculator 420 in future statistical analysis to determine if any statistically significant matches occur with other event data obtained from the same vehicle and/or other vehicles.\",\n \"While some of the embodiments are based on an application of Bayes' Theorem, other embodiments are intended to include or otherwise cover other comparison methods by the comparison calculator 420.The comparison calculator 420 may utilize fuzzy logic, neural network applications, analysis of variance (ANOVA), discriminant analysis, or any other appropriate analytical and/or statistical methods to perform data analysis.\",\n \"FIG.\",\n \"7 is a flowchart of an exemplary method 700 to inform a vehicle of potential collision events in association with the CWS 400.In some embodiments, warnings and alerts may be generated not only on signals from V2X signals but also on probabilities of an event analyzed by the comparison calculator 420.For example, if the vehicle 104 approaches the intersection 102, the V2V transceiver 106 should receive a V2P signal from the single pedestrian 126.However, multiple scenarios can occur where V2P signals may not be present and/or detected due to, for example, a malfunction in the V2P transceiver 128 or radio frequency interference.\",\n \"However, CWS 400 may generate a low level and/or information alert regarding a predicted potential for pedestrian 126 crossing the intersection 102 based on statistical analysis of historical pedestrian data by comparison calculator 420.In FIG.\",\n \"7, the method to inform a vehicle may include step 702 where a user, driver or passenger of vehicle 104 can activate a vehicle collision warning mode for the CWS 400.The method may include step 704 to determine the vehicle 104 location.\",\n \"A location may be determined using geographic position component 438.After a location is determined, in step 706 the computer system 404 can search collision event database 422 for prior events in a predetermined proximity to the location of vehicle 104.If in decision 708, to determine if prior events occurred, no prior events occurred in proximity to the current vehicle 104 location, then the method proceeds to step 712 to monitor for new road hazards.\",\n \"If in decision 708, to determine if prior collision events occurred, there are prior events within the predetermined proximity to vehicle 104, the method can include step 710 to inform vehicle 104 of the prior events.\",\n \"The step 710 to inform vehicle 104 includes the collision event map component 416 integrating potential road hazard data from collision event database 422 into detailed maps that can be used by the computer system 404 for generating alerts as well as used by the vehicle navigation system 436 for displaying on display device 426 the locations and types of road hazards onto a digital navigation map.\",\n \"FIG.\",\n \"8 is a flowchart of an exemplary method 800 to predict potential collision events and alert a vehicle in conjunction with the collision warning system 212.The method illustrated in FIG.\",\n \"8 can monitor for new event data in step 802 that can be a continuation of step 712, to monitor for new event data, of FIG.\",\n \"7.Monitoring for road hazards using new event data can be performed automatically, manually, or a combination of automatic and manual identification of event data.\",\n \"As stated previously, event data can include, but is not limited to, V2X signals, type of user or vehicle, navigation data, road hazard data, collision warning data, course heading data, course history data, projected course data, kinematic data, current position data, range or distance data, speed and acceleration data, location data, vehicle sensory data, vehicle subsystem data, or any type and quantity of data useful for processing by computer system 404.If new event data is not detected at step 804, to detect new event data, then the method returns to step 802 to continue to monitor for new event data.\",\n \"If a new event, and therefore new event data, is detected in 804, the method can include step 806 to save new event data into collision event database 422.New event data may also include a new road hazard that has been identified by a vehicle or received from an external database.\",\n \"However, new event data can also include a repeated entry of a road hazard by a vehicle 104 or other vehicles at or in a predetermined proximity to an event location that already exists in collision event database 422.A repeated sighting or entry of a road hazard or potential road hazard can add confidence to collision event data collected for the road hazard.\",\n \"For example, an event location can be identified by geographic position component 438 and a road hazard can be recognized from camera 522.The event location and road hazard can be automatically saved into collision event database 422.In another embodiment, a driver of vehicle 104 may observe a traffic scenario, for example a school bus stop, and use input device 424 to manually save the event location into collision event database 422.While the example describes a school bus stop, it is understood that any type of event scenario, road hazard, traffic data, image, or location can be automatically or manually saved into collision event database 422.The method, therefore, can collect data for a potential road hazard and the event location, regardless of whether the event was previously identified and saved.\",\n \"The method in FIG.\",\n \"8 may also include decision 808 to determine if prior road hazard events occurred in a predetermined proximity to the vehicle location.\",\n \"After new event data is detected in step 804, to detect new event data, the computer system 404 can search collision event database 422 for prior events in a predetermined proximity to the location of vehicle 104.In step 808, to determine if prior event occurred, no prior events occurred in proximity to the current vehicle 104 location, then the method will return at 810 to monitor for new event data.\",\n \"If prior events did occur, then the method proceeds to step 812 to compare, using comparison calculator 420, new event data to prior event data for the same location from collision event database 422.Comparison of new event data to prior event data in collision event database 422 can be performed by any of the comparison or statistical models and methods described above, which include but are not limited to statistical models, data clusters, regression analysis, correlations, or any other type of appropriate data analysis technique.\",\n \"In an exemplary embodiment, the new event data is compared with prior event data and patterns in collision event database 422 using Baysian Networks.\",\n \"If the comparison calculator 420 determines in step 814, to determine if new event data matches a prior event data pattern, that new event data does not match a prior event data pattern, then the method may return at 816 to monitor for new event data.\",\n \"If comparison calculator determines, in step 814 to determine if new event data matches a prior and/or historical event data pattern, that new event data matches and/or correlates to a prior event data pattern, then the method can include step 818 to add new event data to the matching and/or correlating prior event data in collision event database 422.Further, if the comparison calculator 420 determines, in step 814 to determine if new event data matches a prior event data pattern, that new event data matches and/or correlates to a prior and/or historical event data pattern, then the method optionally proceeds in step 820 to determine if new event data meets a condition and/or characteristic of the prior and/or historical event data.\",\n \"In step 820, the new event data should meet a threshold condition and/or characteristic of event data to qualify as a potential collision risk and/or road hazard.\",\n \"A condition and/or data characteristic can include, but is not limited to, a temporal component including a relevant time frame, a direction of movement and/or heading of an entity, and heading of the vehicle 104 approaching the entity, etc.\",\n \"A time frame can be any time frame including, but not limited to, a time of day, a range of time within a day, a calendar day or range of days, a week or range of weeks, a month, a range of months, etc.\",\n \"A time frame can also be periodic, such as an event occurring certain days of every month between certain hours of the day.\",\n \"For example, if event data at intersection 102 correlates with a present location of vehicle 104 and statistical analysis of historical event data result in identifying an event occurring between the hours of 4:00 pm and 6:00 pm, and the vehicle 104 is at the location at 11:00 pm, then no conditional match occurs within the relevant time frame.\",\n \"Real-time event data collected by the vehicle 104 at the event location can still be used, however, to give further confidence to the pattern of event data characteristics or conditions, e.g., that no event occurred at the location at 11:00 pm, therefore the conditional time frame of 4:00 pm-6:00 pm remains valid.\",\n \"If, in step 820 to determine if new event data meets a condition, the comparison calculator 420 determines the new event data meets a condition and/or characteristic of prior and/or historical event data, then the method may include step 824 to warn vehicle 104 of a predicted potential collision event and/or road hazard.\",\n \"Computer system 404 can generate an alert to a driver of vehicle 104 of the nature, location, and severity of a potential collision event using visual, audible, or mechanical indicators.\",\n \"A potential collision event can be a potential road hazard in the path of, or in proximity to, the location and heading of the vehicle 104 or other vehicles or users.\",\n \"The potential collision event may not generate an immediate road hazard alert to the vehicle 104, in which case an information alert may be appropriate.\",\n \"For example, if the event data analysis results in a scenario, such as a bus stop, in or near the current or intended path of vehicle 104, then an information alert can be useful to warn vehicle 104 to take caution near the bus stop location.\",\n \"Visual alerts and information alerts can display on display device 610 or other display devices including, but not limited to, a smart phone, a tablet computer, or any device that can be linked by wire or wirelessly to collision warning system 400.Audible alerts and information can be provided to vehicle 104 through a speaker in the display device 610 or through other devices that include, but are not limited to, a vehicle sound system, a smart phone, a tablet computer, etc.\",\n \"Mechanical indicators can inform a driver of vehicle 104 through vibrations in steering wheel 604, vibrations of a brake pedal (not shown), vibrations of an accelerator pedal (not shown).\",\n \"Some embodiments to warn vehicle 824 of potential road hazards and information are intended to include or otherwise cover one or more alert levels.\",\n \"In the embodiments, information alerts and road hazard alerts that display on display device 610 can include, but are not limited to, one or more navigation maps, symbols, icons, graphics, colors, images, photographs, videos, text, audible information, etc.\",\n \"Exemplary alert levels may include warning alerts, informing alerts, high, medium, and low alerts, proximity alerts, trajectory alerts, location alerts, or any alert method that can inform a driver of information, a potential road hazard, collision risk, etc.\",\n \"In particular, informing alerts are used to inform the vehicle 104 or other users of information or data relevant to the vehicle's intended current or intended path.\",\n \"Low-level hazard alerts can inform a driver of relatively low collision threats, while mid-level or high level hazard alerts can inform the vehicle 104 of medium-to-high level collision risks and/or road hazards.\",\n \"Information can be provided to vehicle 104 with alerts displayed on display device 610 or audible or mechanical alerts, as described above.\",\n \"After generating an alert, the method may include step 826 to save the notice of the warning to the vehicle collision event database 422 with the event data relevant to the alert.\",\n \"If, in step 820 to determine if new event data meets a condition, the comparison calculator 420 determines the new event data does not meet a condition of prior and/or historical event data, then the method returns at 822 to monitor for new event data in real-time.\",\n \"FIG.\",\n \"9 is a flowchart of an exemplary method 900 for receiving and classifying new event data by the CWS 400.The method in FIG.\",\n \"9 may include step 902 where computer system 404 can receive new event data.\",\n \"New event data may be uploaded to computer system 404 from any vehicle system including the vehicle subsystem sensor system 430, the vehicle communication system 432, the vehicle event sensor system 434, the vehicle navigation system 436, and/or manually from a driver and/or passenger of vehicle 104.In step 906, classifying new event data can include the comparison calculator 420 determining event patterns 904 using any of the comparison or statistical methods described above or another known, relevant or later developed method.\",\n \"In step 906, to classify new event data, the comparison calculator 420 can search and analyze historical event data in collision event database 422 to determine if prior and/or historical road hazards and/or potential collision events occurred within a predetermined proximity to the vehicle 104 location.\",\n \"Comparison calculator 420 can compare current or new event data collected from vehicle 104 or other vehicles to prior and/or historical event data by any of the comparison or statistical methods described above.\",\n \"If new event data is a comparative or statistical match to one or more prior event data patterns, comparison calculator 420 may then classify new event data 906 according to one or more prior event data patterns.\",\n \"The method may further include step 908, where computer system 404 may store the new and/or current event data into the collision event database 422 with the matched or correlated prior and/or historical event data.\",\n \"In an alternative embodiment, the exemplary method 900 for receiving and classifying new event data is performed by the service provider 212.To perform method 900 for receiving and classifying new event data, the FCW server 302 can include corresponding functionality and hardware as computer system 404.For example, at step 902 the FCW server 302 can receive new event data, determine event patterns 904, classify new event data 906, and save new event data in the FCW database 306.FIG.\",\n \"10 is a functional flowchart of an exemplary method for comparing new event data with patterns of prior and/or historical event data by CWS 400.In an alternative embodiment, new event data 1000 is received by the CWS 400 as described above.\",\n \"New event data 1000 may also receive commercial collision event data via commercial collision event data component 414 from transportation agencies, commercial service providers, or from other vehicles.\",\n \"The method may correlate or statistically analyze new event data 1000 using an event pattern classifier 1002.The event pattern classifier 1002 can be a function of comparison calculator 420.Event pattern classifier 1002 can compare new or historical event data to one or more event patterns 1004 using comparison and/or statistical methods described above.\",\n \"Alternatively, other comparison and/or statistical models can be generated, and event data matched and/or correlated to one or more of the comparison or statistical models.\",\n \"Additionally, event pattern classifier 1002 can compare new event data 1000 to one or more event patterns 1004 using comparison and statistical methods described above.\",\n \"In an alternative embodiment, event patterns 1004 may be generated by statistical analysis of event data according to a data characteristic such as location and/or time interval of the event.\",\n \"In some embodiments, a time interval used for determining whether new event data 1000 fits one or more event patterns 1004 may be fixed.\",\n \"In other embodiments, the time interval may vary.\",\n \"One or more event patterns 1004 can be stored in an event pattern library in collision event database 422.If the event pattern classifier 1002 determines the new event data 1000 matches or correlates to one or more event patterns 1004, the new event data 1000 can be combined with the data associated with the one or more event patterns 1004, such as a first event pattern 1006 or a second event pattern 1008.Although two event patterns are illustrated in FIG.\",\n \"10, the embodiments are intended to include, and otherwise cover, any number of event patterns.\",\n \"The new event data 1000 that is associated with the first event pattern 1006 may be stored with event data for the first event pattern 1006 in a first event database 1010 that is part of the collision event database 422.Likewise, the new event data 1000 that is associated with the second event pattern 1008 may be stored with event data associated with the second event pattern 1010 a second event database 1012 that is part of collision event database 422.In an alternative embodiment, the comparing new event data 1000 with event patterns 1004 may be performed by FCW server 302.FIGS.\",\n \"11-13 illustrate examples of collision event maps displayed on device 610 that are generated by collision event map component 416.The scenarios should be considered as specific embodiments and should not be considered as limiting.\",\n \"Other embodiments are intended to include, or otherwise cover, any visual displays of information and maps that are useful for the functionality of the embodiments.\",\n \"FIG.\",\n \"11 illustrates an embodiment of the CWS 400 alerting a vehicle of potential collision scenarios with pedestrians.\",\n \"FIG.\",\n \"11 shows the display device 610 displaying informing alert image 1100 that is generated by collision event map component 416.Informing alert image 1100 shows some features of the intersection 102 (see FIG.\",\n \"1) from a navigation perspective of vehicle 104.In the embodiment, the computer system 404 can include prior and/or historical event data that was collected in proximity to intersection 102.Entities in proximity to intersection 102 include remote vehicle 110 that is equipped with the CWS 400 and V2V transceiver 108, the single pedestrian 126 who is equipped with V2P transceiver 128, the school bus 134 that is equipped with the CWS 400 and V2V transceiver 136, the group of pedestrians 138 who are each equipped with V2P transceivers 140, and the motorcycle 130 that is equipped with the CWS 400 and V2M transceiver 132.In the scenario, school bus 134 blocks the view of the group of pedestrians from the perspective of vehicle 104.The group of pedestrians 138 is visible to remote vehicle 110 and motorcycle 130.Therefore, the group of pedestrians 138 is a potential unseen road hazard to vehicle 104.In the exemplary scenario, as vehicle 104 approaches intersection 102, computer system 404 searches prior event data for events based on the current location and heading of vehicle 104, provided by geographic position component 438.Computer system 404 can locate historical data for prior events in proximity to intersection 102.The prior event data indicates patterns of unexpected pedestrian movements across the intersection 102.The prior events have a data characteristic occurring weekdays between 3:00 pm to 6:00 pm.\",\n \"The computer system 404 detects from an internal clock that the current time is 4:00 pm and the day is a weekday.\",\n \"Computer system 404 therefore determines the current time falls within the time frame characteristic for the prior events.\",\n \"Computer system 404 can detect V2P, V2V, and V2M signals received through vehicle 104 V2V transceiver 106.Computer system 404 can analyze and translate V2X signals as to source, location, and telemetry, and collision event map component 416 can map the signals onto informing alert image 1100.Using GPS location information from the V2X messages, computer system 404 can direct sensor system 516 to activate camera 522 to collect images of the V2X transmitting entities.\",\n \"The images can be transmitted to computer system 404 for image recognition.\",\n \"In some embodiments, informing alert image 1100 can display icons corresponding to a type of V2X signal received, e.g., a pedestrian icon for a V2P signal or a motorcycle icon for a V2M signal.\",\n \"In an alternative embodiment, where images of V2X objects have been recognized, actual images of pedestrians, vehicles, motorcycles, etc.\",\n \"could be displayed on informing alert image 1100.Based on the V2P messages from single pedestrian 126, computer system 404 can detect movement of the V2P transceiver towards the intersection 102.Comparison calculator 420 can analyze the real time data of the V2P movement and determine, based on comparisons with prior event V2P data patterns, that the pedestrian 126 has a statistical likelihood of crossing the intersection 102 in outside of crosswalks and in the current path of vehicle 104.To inform vehicle 104 of a potential collision event, computer system 404 can display an alert symbol 1102 on display device 610.To predict the nature of the potential collision event, computer system 404 can display movement of pedestrian 126 along a trajectory indicated by direction arrow 1104 towards intersection 102.To predict a potential movement of pedestrian 126, a pedestrian symbol 1106 can be displayed in front of direction arrow 1104.The outline of pedestrian symbol 1106 is a dashed line indicating symbol 1106 is only a predicted movement of pedestrian 126.The alert symbol 1102 and pedestrian symbol 1106 indicates that computer system 404 has determined there is a probability of pedestrian 126 crossing intersection 102 that can be a collision risk to vehicle 104.The determination is based on V2P signals combined with a calculated pattern of pedestrians crossing intersection 102 within the current time frame.\",\n \"By displaying informing alert image 1100 with pedestrian symbol 1106, a driver can be alerted to a potential collision risk if pedestrian 126 follows the predicted pattern of travel indicated.\",\n \"A second event at the intersection 102 is determined where V2P signals from V2P transceivers 140 indicate a gathering of the group of pedestrians 138 near intersection 102.Computer system 404 can analyze movement of V2P transceivers 140 although the group of pedestrians 138 is blocked from the view of vehicle 104 by school bus 134.Comparison calculator 420 can analyze the real time data of the V2P messages and determine, based on comparisons with prior event V2P data patterns, that the group of pedestrians 138 has a statistical likelihood of crossing the intersection 102 in outside of crosswalks and in the current path of vehicle 104.To inform vehicle 104 of a potential collision event, computer system 404 displays alert symbol 1102 on display device 610.To predict the nature of the potential collision event, computer system 404 displays movement of one of the group of pedestrians 138 along a trajectory indicated by direction arrow 1108 towards intersection 102.To predict a potential movement of one of the pedestrians 138, a pedestrian symbol 1110 is displayed in front of direction arrow 1108.The outline of pedestrian symbol 1110 is a dashed line indicating the pedestrian symbol 1110 is only a predicted movement of one of the pedestrians 138.The alert symbol 1102 and pedestrian symbol 1110 indicate that computer system 404 has determined there is a probability of one of the pedestrians 138 crossing intersection 102 that could be a road hazard to vehicle 104.By displaying informing alert image 1100 with pedestrian symbol 1110, a driver can be alerted to a potential road hazard if one of the group of pedestrians 138 follows the predicted pattern of travel indicated.\",\n \"Computer system 404 can also inform other vehicles or entities within the vehicle communications network 200 of the potential collision risks.\",\n \"Computer system 404 can broadcast the potential collision risk data from informing alert image 1100 and alert information using V2V communication protocols.\",\n \"Remote vehicle 110 and motorcycle 130 can receive the V2V messages from vehicle 104 and display the informing alert image 1100 according to each vehicle's perspective and display device.\",\n \"In the embodiment, computer system 404 can also collect event data regarding a school bus stop.\",\n \"The event can be determined automatically from comparison calculator 404 analyzing the school bus 134 from V2V signals and/or a driver in vehicle 104 can manually enter the school bus stop event into computer system 404 via input device 424.Computer system 404 can determine to add the images, time, location, and V2X data from all events at the intersection 102 to the existing event data for intersection 102 in collision event database 422.FIG.\",\n \"12 illustrates an embodiment of the CWS 400 alerting a vehicle of a potential collision scenario with a bicycle.\",\n \"FIG.\",\n \"12 includes display device 610 displaying informing alert image 1200 generated by collision event map component 416.Informing alert image 1200 displays some features of the intersection 102 from a navigation perspective of vehicle 104.In the embodiment, computer system 404 can include prior and/or historical event data for intersection 102.Vehicle communication network 200 users in proximity to intersection 102 include the remote vehicle 110 that is equipped with the CWS 400 and V2V transceiver 108, the bicycle 120 equipped with V2B transceiver 122, and the motorcycle 130 that is equipped with the CWS 400 and V2M transceiver 132.The bicycle 120 is traveling in bicycle lane 124 in close proximity to vehicle 104.In the scenario, as vehicle 104 approaches intersection 102, computer system 404 searches and locates historical and/or prior event data for events based on vehicle 104 location, provided by geographic position component 438.The prior event data indicates patterns of unexpected V2B movements across the intersection 102 in the path of vehicle 104.The prior events have a conditional time frame for weekdays between 5:00 pm to 7:00 pm.\",\n \"The computer system 404 detects from an internal clock that the current time is 6:00 pm on a weekday and determines the current event data meets the conditional threshold for the prior events.\",\n \"Computer system 404 analyzes and translates V2X signals as to source, location, and telemetry, and collision event map component 416 maps the signals onto informing alert image 1200.Using GPS location information from the V2X messages, computer system 404 can direct sensor system 516 to activate camera 522 to collect images of transmitting V2X entities.\",\n \"The images can be transmitted to computer system 404 for image recognition.\",\n \"In some embodiments, informing alert image 1200 can display icons corresponding to a type of V2X signal received, e.g., a motorcycle icon for a V2M signal.\",\n \"In an alternative embodiment, where images of V2X entities have been recognized, actual images of pedestrians, vehicles, motorcycles, etc.\",\n \"can be displayed on informing alert image 1200.Computer system 404 can detect movement of the V2B transceiver 122 towards the intersection 102.Comparison calculator 420 can analyze the real time data of the V2B movement and determines a statistical match between current event data and historical V2B data patterns that the bicycle 120 has a likelihood of crossing the intersection 102 outside of bicycle lane 124 and in the path of vehicle 104.To inform vehicle 104 of a potential collision event, computer system 404 displays an alert symbol 1206 on display device 610.To predict the nature of the potential collision event, computer system 404 displays movement of bicycle 120 along a trajectory indicated by direction arrow 1202 towards intersection 102.To predict a potential movement of bicycle 120, a bicycle symbol 1204 can be displayed in front of direction arrow 1202.The outline of bicycle symbol 1204 is a dashed line indicating that the bicycle symbol 1204 is only a predicted movement of bicycle 120.The alert symbol 1206 and bicycle symbol 1204 indicate that computer system 404 has determined a likely probability of bicycle 120 crossing intersection 102 that could be a collision risk to vehicle 104.The determination can be based on V2B signals combined with a calculated pattern of bicycles crossing intersection 102 outside of bicycle lane 124 within the current time frame.\",\n \"By displaying informing alert image 1200 with bicycle symbol 1204, a driver can be alerted to a potential road hazard if bicycle 120 follows the predicted pattern of travel indicated.\",\n \"FIG.\",\n \"13 illustrates an embodiment of the CWS 400 alerting vehicle 104 of a potential collision scenario with wildlife.\",\n \"In FIG.\",\n \"13, informing alert image 1300 displays on display device 610 some features of the intersection 102 from a navigation perspective of vehicle 104.In the embodiment, the computer system 404 can include prior and/or historical event data that was collected in proximity to intersection 102.Vehicle communication network 200 users with near intersection 102 include remote vehicle 110 that is equipped with the CWS 400 and V2V transceiver 108, and motorcycle 130 that is equipped with the CWS 400 and V2M transceiver 132.As vehicle 104 approaches intersection 102, computer system 404 searches and locates prior event data for events based on vehicle 104 location, provided by geographic position component 438.The prior event data indicates patterns of unexpected wildlife movements across the intersection 102 within a time frame of 8:00 pm to 8:00 am.\",\n \"The computer system 404 detects from an internal clock that the current time is 10:00 pm and determines the current event data meets the conditional data patterns.\",\n \"Computer system 404 also detects V2V and V2M signals received through vehicle V2V transceiver 106.Computer system 404 analyzes and translates V2X signals as to source, location, and telemetry, and collision event map component 416 maps the signals onto informing alert image 1300.Computer system 404 receives from vehicle radar system 520 that indicate movement of an unknown entity 1302 in proximity to vehicle 104.Based on the detected movement, collision event map component 416 maps unknown entity 1302 onto informing alert image 1300.Computer system 404 can direct sensor system 516 to activate camera 522 and attempt to collect images of the unknown entity 1302.Comparison calculator 420 can analyze the current event data of the entity's movement and determine, based on comparisons with image recognition of images from camera 522, and prior event patterns, that the unknown entity 1302 has a statistical likelihood of being wildlife crossing the intersection 102 in the path of vehicle 104.To inform vehicle 104 of a potential collision event, computer system 404 displays an alert symbol 1308 on display device 610.To predict the nature of the potential collision event, computer system 404 displays movement of entity 1302 along a trajectory indicated by direction arrow 1304 towards intersection 102.To predict a potential movement of unknown entity 1302, a deer symbol 1306 can be displayed in front of direction arrow 1304.The outline of the deer symbol 1306 is a dashed line indicating a predicted path of unknown entity 1302.The alert symbol 1308 and deer symbol 1306 indicate a probability of unknown entity 1302 crossing intersection 102 that can be a road hazard to vehicle 104.The determination is based on radar signals from radar system 520 combined with one or more patterns of wildlife crossing intersection 102 within the conditional time frame.\",\n \"By displaying alert symbol 1308 with deer symbol 1306, a driver of vehicle 104 can be alerted to a potential road hazard if unknown entity 1302 moves in a heading indicated by the predicted pattern of travel.\",\n \"To warn other V2X users in proximity to intersection 102, computer system 404 can broadcast the potential collision event data and alerts via V2V signals that can be received and displayed by the CWS 400 in remote vehicle 110 and the CWS 400 in motorcycle 130.In the figures, although a single image is shown for each type of alert, other embodiments can include one or more images for each type of alert.\",\n \"In particular, an arrow used to indicate position and heading of a road hazard or potential collision risk can be changed from a direction arrow to any type of indication of entity, movement, direction, etc.\",\n \"that can help inform a driver of the potential road hazards and/or potential collision events.\",\n \"In the embodiments, multiple images can distinguish between the types of alerts.\",\n \"For example, an alert symbol can be used to distinguish between informing alerts and warning/hazard alerts.\",\n \"Likewise, informing alerts can be associated with a different color or symbol than warning alerts.\",\n \"In other embodiments, alerts can indicate multiple levels of threats of potential road hazards.\",\n \"FIG.\",\n \"14 is a flowchart of a method 1400 for configuring the CWS 400 based on an environment.\",\n \"In some cases, a driver can have an opinion that a computer system 404 generates too many alerts, especially in a case of informing alerts about situations already known to a driver.\",\n \"For example, in situations where vehicle 104 is located in an urban environment, such as business district of a city, many pedestrians similar to group of pedestrians 138 may be walking along sidewalks in proximity to vehicle 104.In such a situation, a visual or audible alert of every pedestrian in proximity to vehicle 104 can be deemed a nuisance.\",\n \"It can therefore be beneficial for computer system 404 to adjust the number of alerts generated to vehicle 104 according a specific type of environment.\",\n \"In the embodiments, computer system 404 can be configured to generate alerts based on different driving environments external to vehicle 104.In the embodiments, a frequency and/or type of alert can be adjusted between at least two different driving environments.\",\n \"In an alternative embodiment, the frequency and/or type of alert can be adjusted between three or more different driving environments.\",\n \"Some of the embodiments are intended to include driving environments that can include a road classification or a mapped boundary, such as a geographic, legal, or demographic boundary.\",\n \"Examples of boundaries include urban, suburban, or rural areas or zones.\",\n \"However, other embodiments for driving environments are intended to include or otherwise cover alert adjustments based on boundaries for a city, a county, a state or province, or a country, areas defined by population, areas near attractions, demographic areas, or any type of area or boundary.\",\n \"Alerts can be adjusted for any type of environment or classification appropriate for the functionality of the embodiments to distinguish between the driving environments.\",\n \"The first step for configuring the CWS 400 based on an environment is to activate an enhanced warning mode at step 1402.In the embodiment, a first environment mode can be selected when a configuration is a default mode of operation.\",\n \"A second, or enhanced, environment mode of computer system 404 can perform automatic adjustments of alerts based on a driving environment.\",\n \"In second step 1404, the computer system 404 can monitor and identify a current environment of vehicle 104.It can be beneficial for computer system 404 to interact with vehicle navigation system 436 to identify different road environments and vehicle locations.\",\n \"In an embodiment, environments can be determined using functional road classification data.\",\n \"Functional classification is a method used by state and federal transportation agencies to group highways, roads, and streets by the character of service they provide.\",\n \"Some agencies can classify roads and highways according to urban and rural services based on specific criteria.\",\n \"Some agencies may use other classifications, such as local, major and minor collector, minor arterial, and principal arterial.\",\n \"In step 1404, to monitor and identify the current environment, GPS receiver 510 can determine a current location of vehicle 104, and navigation system 508 can provide computer system 404 the data resources to determine if the current road has a functional classification.\",\n \"Although functional classification of roads is described, the embodiments intend to include or otherwise cover any type of region, area, zone, or road classification system that can accomplish the features and functions of the embodiments.\",\n \"For example, instead of a functional classification system, the method step 1404, to monitor and identify the current environment, can use city, county, state, province, or other boundaries as environmental zones.\",\n \"In an alternative embodiment, environment classification can use terrain, natural land features, natural water features, etc.\",\n \"FIG.\",\n \"14 can include step 1406 to determine if vehicle 104 is located in a rural zone.\",\n \"If the vehicle 104 is located in a rural zone, then the method continues to step 1408 where computer system 404 can be configured to a rural warning mode.\",\n \"In the rural warning mode, a predetermined threshold number of pedestrians detected from V2P signals can be automatically configured by computer system 404.The threshold may be configured to any number of pedestrians that could indicate high pedestrian traffic such that frequent V2P warnings to a driver can be deemed a nuisance in a rural environment.\",\n \"The method proceeds in step 1410 to determine if the number of detected V2P signals representing pedestrians as VRUs exceed the rural warning mode threshold either simultaneously or over a predefined time period.\",\n \"In the case of falling below the threshold, the computer system 404 can remain in a default rural warning mode 1412.In the case of exceeding the threshold, in step 1414 computer system 404 can automatically adjust a frequency and/or type of V2P alerts.\",\n \"In an embodiment, V2P alerts can be generated less frequently than in a default rural configuration.\",\n \"In an alternative embodiment, alerts are changed to an “information” alert that displays V2P information to a display device 610.The vehicle 104 may be traveling on a road and/or path that will transition from the current environment zone to a new environment zone.\",\n \"Therefore, the method automatically returns to step 1404 to monitor and identify the current environment.\",\n \"If computer system 404 determines at step 1406, to determine if vehicle is located in a rural zone, that vehicle 104 is not located in a rural zone, the method continues to step 1416 to determine if the vehicle 104 is in a suburban zone.\",\n \"If computer system 404 determines that vehicle 104 is located in a suburban zone, then the method continues to step 1418 where computer system 404 can be configured to a suburban warning mode.\",\n \"In the suburban warning mode, a predetermined threshold number of detected V2P signals can be automatically configured by the computer system 404.The threshold may be configured to any number of pedestrians that can indicate high pedestrian traffic such that frequent V2P alerts can be a nuisance to a driver.\",\n \"In the embodiment, a number of pedestrians are identified by computer system 404 by their V2P signals within proximity to vehicle 104.The method determines in decision step 1420 if the number of V2P signals exceed the suburban warning mode threshold.\",\n \"If the numbers of pedestrians are below the threshold, the computer system 404 maintains the suburban warning mode at step 1422.If the number of V2P signals exceed the threshold, then step 1424 can automatically adjust a frequency and/or type of warning indicator/alert to a driver either at display device 610 or with an audible indicator.\",\n \"In an embodiment, computer system 404 can generate pedestrian warnings less frequently than in a default suburban configuration.\",\n \"In an alternative embodiment, computer system 404 changes warnings to an “information” mode of configuration that transmits information to a driver instead of a warning or alert.\",\n \"The method automatically returns to step 1404 to monitor and identify the current environment.\",\n \"At step 1404, to monitor and identify the current environment, if computer system 404 determines that vehicle 104 is not in a rural environment zone or a suburban environment zone, the method continues to 1426 to determine if the vehicle 104 is located within an urban zone.\",\n \"If computer system 404 determines that vehicle 104 is located within an urban zone, then the computer system 404 can be configured to an urban warning mode in step 1428.In the urban warning mode, a predetermined threshold number of V2P signals can be automatically configured by the computer system 404.The threshold may be configured to any number of V2P signals that could indicate high pedestrian traffic such that frequent V2P alerts can be deemed a nuisance.\",\n \"In decision step 1430, the computer system 404 determines if the number of V2P signals exceed the urban warning mode threshold.\",\n \"In the case of the number of V2P signals falling below the threshold, step 1432 may maintain the urban warning mode.\",\n \"In the case of exceeding the threshold, step 1434 may automatically adjust computer system 404 to configure the frequency and/or type of warning indicator/alert to a driver.\",\n \"In an embodiment, computer system 404 can adjust the alerts to less frequent or not at all.\",\n \"Further, the computer system 404 can generate an “information” mode of configuration that displays V2P information on display device 610 instead of an alert.\",\n \"As a final step, the method automatically returns to step 1404 to monitor and identify the environment.\",\n \"FIG.\",\n \"15 is a flowchart of a method 1500 to update event data at the CWS 400 by service provider 212.At predetermined times, the event data in the CWS 400 may be updated, or new event data may be downloaded due to a new subscription or new features to an old subscription for a service associated with CWS 400.The downloaded collision event data may be provided by service provider 212 or another service provider.\",\n \"In some embodiments, the download may occur upon the request from vehicle 104.In other embodiments, the download may occur upon request of the service provider 212.In still other embodiments, vehicle 104 may be programmed to request, or service provider 212 may be programmed to initiate, an automatic download on a predetermined basis.\",\n \"The method 1500 to update event data may include a first step 1502 where the vehicle 104 CWS 400 initiates a download of updated event data from service provider 212.Computer system 404 may initiate the download of event data by transmitting a request to FCW server 302.A second step 1504 may include the service provider 212 receives the request for the updated event data.\",\n \"A third step 1506 may include the vehicle 104 sending user or vehicle credentials to the service provider 212 in order to identify CWS 400.A fourth step 1508 may include the service provider packaging the next event update.\",\n \"A fifth step 1510 may include the service provider sending the event data update to computer system 404.A sixth step 1512 may include the CWS 400 receiving and updating the CWS 400 with the received event data.\",\n \"FIG.\",\n \"16 is a flowchart of an exemplary method 1600 for transmitting event data to the service provider 212.A first step 1602 may include the CWS 400 storing event data in the collision event database 422.A second step 1604 may include the CWS 400 transmitting the event data to the service provider 212.A third step 1606 may include the service provider 212 updating the FCW database 306 with the new event data.\",\n \"A fourth step 1608 may include the service provider 212 providing the updated FCW database 306 to other vehicles using the vehicle communication network 200.The above described techniques may take the form of computer or controller implemented processes and apparatuses for practicing those methods.\",\n \"The disclosure can also be embodied in the form of computer program code containing instructions embodied in tangible media, such as floppy diskettes, CD-ROMs, hard drives, or any other computer-readable storage medium, wherein, when the computer program code is loaded into and executed by a computer or controller, the computer becomes an apparatus for practicing the embodiments.\",\n \"The disclosure may also be embodied in the form of computer program code or signal, for example, whether stored in a storage medium, loaded into and/or executed by a computer or controller, or transmitted over some transmission medium, such as over electrical wiring or cabling, through fiber optics, or via electromagnetic radiation, wherein, when the computer program code is loaded into and executed by a computer, the computer becomes an apparatus for practicing the embodiments.\",\n \"When implemented on a general-purpose microprocessor, the computer program code segments configure the microprocessor to create specific logic circuits.\",\n \"VII.\",\n \"Alternative Embodiments While certain embodiments of the invention are described above, and FIGS.\",\n \"1-16 disclose the best mode for practicing the various inventive aspects, it should be understood that the invention can be embodied and configured in many different ways without departing from the spirit and scope of the invention.\",\n \"Exemplary embodiments are intended to include or otherwise cover any type of vehicle-to-vehicle, vehicle-to-external, or one-to-many communication network.\",\n \"In other words, exemplary embodiments are intended to cover any application of a communications network between vehicles, bicycles, motorcycles, pedestrians, processors, servers, controllers, etc.\",\n \"and infrastructure disclosed above.\",\n \"Exemplary embodiments are intended to include or otherwise cover identification and warning for any type of event or scenario that could be a hazard to a moving vehicle 104 either on a road or off-road.\",\n \"Weather patterns and forces of nature can be identified and saved as potential collision events, such as flooding roads or areas, snowy or icy roads or areas, storm-hit or windy roads or areas, including road hazards, such as fallen rocks or trees caused by forces of nature.\",\n \"Exemplary embodiments are also intended to cover execution of method steps on any appropriate specialized or general purpose server, computer device, or processor in any order relative to one another.\",\n \"Some of the steps in the embodiments can be omitted, as desired.\",\n \"A computer architecture of the embodiments may be a general purpose computer or a special purpose computer.\",\n \"A computer can be used to implement any components of the CWS 400 or the methods of the embodiments.\",\n \"For example, components of computer system 404 can be implemented on a computer via its hardware, software program, firmware, or a combination thereof.\",\n \"Although individual computers or servers are shown in the embodiments, the computer functions relating to computer system 404 may be implemented in a distributed fashion on a number of similar platforms, to distribute the processing and/or functional load.\",\n \"Embodiments are also intended to include or otherwise cover methods of using and methods of manufacturing the collision warning system disclosed above.\",\n \"The methods of manufacturing include or otherwise cover processors and computer programs implemented by processors used to design various elements of the CWS 400 above.\",\n \"For example, embodiments are intended to cover processors and computer programs used to design or test the CWS 400.Exemplary embodiments are intended to cover all software or computer programs capable of enabling processors to implement the above operations, designs and determinations.\",\n \"Exemplary embodiments are also intended to cover any and all currently known, related art or later developed non-transitory recording or storage mediums (such as a CD-ROM, DVD-ROM, hard drive, RAM, ROM, floppy disc, magnetic tape cassette, etc.)\",\n \"that record or store such software or computer programs.\",\n \"Exemplary embodiments are further intended to cover such software, computer programs, systems and/or processes provided through any other currently known, related art, or later developed medium (such as transitory mediums, carrier waves, etc.\",\n \"), usable for implementing the exemplary operations disclosed above.\",\n \"These computer programs can be executed in many exemplary ways, such as an application that is resident in the memory of a device or as a hosted application that is being executed on a server and communicating with the device application or browser via a number of standard protocols, such as TCP/IP, HTTP, XML, SOAP, REST, JSON and other sufficient protocols.\",\n \"The disclosed computer programs can be written in exemplary programming languages that execute from memory on the device or from a hosted server, such as BASIC, COBOL, C, C++, Java, Pascal, or scripting languages such as JavaScript, Python, Ruby, PHP, Perl or other sufficient programming languages.\",\n \"Embodiments are amenable to a variety of modifications and/or enhancements.\",\n \"For example, although the implementation of various components described above may be embodied in a hardware device, it can also be implemented as a software-only solution, e.g., an installation on an existing server.\",\n \"In addition, systems and their components as disclosed herein can be implemented as a firmware, firmware/software combination, firmware/hardware combination, or a hardware/firmware/software combination.\",\n \"Some of the disclosed embodiments include or otherwise involve data transfer over a network, such as communicating various inputs over the network.\",\n \"The network may include, for example, one or more of the Internet, Wide Area Networks (WANs), Local Area Networks (LANs), analog or digital wired and wireless telephone networks (e.g., a PSTN, Integrated Services Digital Network (ISDN), a cellular network, and Digital Subscriber Line (xDSL)), radio, television, cable, satellite, and/or any other delivery or tunneling mechanism for carrying data.\",\n \"Network may include multiple networks or sub networks, each of which may include, for example, a wired or wireless data pathway.\",\n \"The network may include a circuit-switched voice network, a packet-switched data network, or any other network able to carry electronic communications.\",\n \"For example, the network may include networks based on the Internet protocol (IP) or asynchronous transfer mode (ATM), and may support voice using, for example, VoIP, Voice-over-ATM, or other comparable protocols used for voice data communications.\",\n \"In one implementation, the network includes a cellular telephone network configured to enable exchange of text or SMS messages.\",\n \"Examples of a network include, but are not limited to, a personal area network (PAN), a storage area network (SAN), a home area network (HAN), a campus area network (CAN), a local area network (LAN), a wide area network (WAN), a metropolitan area network (MAN), a virtual private network (VPN), an enterprise private network (EPN), Internet, a global area network (GAN), and so forth.\",\n \"While the subject matter has been described in detail with reference to exemplary embodiments thereof, it will be apparent to one skilled in the art that various changes can be made, and equivalents employed, without departing from the scope of the invention.\"\n ]\n]"},"source":{"kind":"string","value":"Patent_15871412"}}},{"rowIdx":4493785,"cells":{"text":{"kind":"list like","value":[["MULTI-FUNCTION POWER STRIP","Embodiments of a multi-function power strip are shown, said strip including a first endcap and a second endcap; at least one rail, said rail being adapted to engage with at least one outlet module; the rail also being engaged with a transformer module, said transformer module in electrical connection with the at least one outlet module, and adapted to receive electrical power therefrom, said transformer module further comprising a transformer adapted to transform electrical power into a plurality of voltages suitable for powering a plurality of different models of electronic accessories, and a connector forming a circuit to provide a suitable one of the plurality of voltages to an electronic accessory; and wherein the at least one outlet module and the transformer module are releasably joined together."],["1.A module connector for a multi-function power strip comprising: a module connector body with a first end and a second end, the second end being a mirror image of first end; at least one aperture provided in the first end of the module connector body and extending all the way through the module connector body to the second end; a first contact disposed within the at least one aperture at the first end of the module connector body and a second contact disposed in the at least one aperture at the second end of the module connector body, wherein the first and second contacts are electrically connected; and wherein the first and second contacts mate with blades disposed in a first module of the multi-function power strip and a second module of the multi-function power strip thereby forming an electrical connection between the adjacent first and second modules.","2.The module connector of claim 1, wherein the blades are disposed in an opening in the first module and the second module.","3.The module connector of claim 2, wherein the blades do not protrude past the side of the first module and the second module to prevent the blades from making accidental contact with persons or things which may cause an electrical shock or short circuit.","4.The module connector of claim 1, wherein the module connector is adapted to slide into an opening in the first module and the second module.","5.The module connector of claim 1, wherein at least three apertures are provided in the module connector body.","6.The module connector of claim 1, wherein the module connector body further comprises an alignment boss.","7.The module connector of claim 6, wherein the first module and the second module are both provided with alignment grooves to receive the alignment boss on the module connector body.","8.The module connector of claim 1, wherein the contacts are made from copper.","9.The module connector of claim 1, Therein the contacts are made from any material suitable for conducting electricity."],[" BRIEF DESCRIPTION OF THE DRAWINGS FIG.","1 is a top view of an embodiment of the multi-function power strip.","FIG.","2 is a top exploded view of an embodiment of the multi-function power strip.","FIG.","3 is an isometric exploded view of an embodiment of the multi-function power strip.","FIG.","4 is a block diagram showing the inter-relation of parts in an embodiment of the multi-function power strip.","FIG.","5 is a side perspective view of the module connector and module used in an embodiment of the multi-function power strip.","detailed-description description=\"Detailed Description\" end=\"lead\"?"],["CROSS-REFERENCE TO RELATED APPLICATIONS The present application is a continuation of U.S. application Ser.","No.","15/380,766 filed Dec. 15, 2016, now U.S. Pat.","No.","9,876,325, which is a continuation of U.S. application Ser.","No.","15/073,257 filed Mar.","17, 2016, now abandoned, which is a continuation of U.S. application Ser.","No.","14/856,782 filed Sep. 17, 2015, now U.S. Pat.","No.","9,300,097, which is a continuation of U.S. application Ser.","No.","14/147,314, filed Jan. 3, 2014, now U.S. Pat.","No.","9,147,982, which is a continuation of U.S. application Ser.","No.","13/110,644, filed May 18, 2011, now U.S. Pat.","No.","8,622,756, all having the same title, and all of which are incorporated herein by this reference.","BRIEF DESCRIPTION OF THE DRAWINGS FIG.","1 is a top view of an embodiment of the multi-function power strip.","FIG.","2 is a top exploded view of an embodiment of the multi-function power strip.","FIG.","3 is an isometric exploded view of an embodiment of the multi-function power strip.","FIG.","4 is a block diagram showing the inter-relation of parts in an embodiment of the multi-function power strip.","FIG.","5 is a side perspective view of the module connector and module used in an embodiment of the multi-function power strip.","DETAILED DESCRIPTION OF THE DRAWINGS Embodiments of a multi-function power strip are shown and described.","Generally, the multi-function power strip comprises a cord for connection to an electrical power source; a plurality of outlet modules in electrical connection with the cord, wherein said plurality of outlet modules are in electrical connection with each other; and a transformer module, said transformer module in electrical connection with at least one of the outlet modules, and adapted to receive electrical power therefrom, said transformer module further comprising, a transformer adapted to transform electrical power into a plurality of voltages suitable for powering a plurality of different models of electronic accessories, and a connector electrically connected to the transformer, and having a plurality of pins, each of the plurality of pins having a designated one of the plurality of voltages supplied thereto, and wherein the connector is configured to engage with a plurality of plugs, each of the plugs forming an electrical connection with a designated one of the plurality of pins and a ground pin, thereby forming a circuit to provide a suitable one of the plurality of voltages to an electronic accessory; and wherein the outlet modules and the transformer module are releasably joined together.","Thus, embodiments of the multi-function power strip are assembled by combining together and electrically connecting a number of modular components into a single assembly.","FIG.","1 shows a top view of a first embodiment of the multi-function power strip.","As can be seen in FIG.","1, multi-function power strip 100 is comprised of endcaps 101 and rail 102.Various modular components (which will be discussed in greater detail infra) are engaged with rail 102 and retained in engagement with rail 102 by end caps 101.Endcaps 101 may attach to rail 102 by means of screws or other fasteners commonly used in the art.","Alternatively, endcaps 101 may engage with rail 102 by means of a friction-fit or snap-fit, and thereby be retained in connection to the rail 102.First endcap 101a is provided with a coupler (not shown) into which a cord (not shown) can be received.","The cord (not shown) provides standard household electrical power, which one of skill in the art would appreciate can be between 110 and 240 volts, alternating current, with a frequency between 50 and 60 Hz.","The cord is received in the endcap, and the endcap is electrically connected to the first modular component in the multi-function power strip, thereby providing household electrical power to the first modular component, and all other modular components that are joined thereto.","Referring again to FIG.","1, it will be appreciated that a number of modular components are engaged with rail 102.All of the modular components are electrically connected together, and each receives electrical power from the previous component in the chain.","The structure and function of each will now be explained in greater detail.","As shown in FIG.","1, an embodiment of multi-function power strip 100 may include a switch module 110.Switch module 110 is provided with switch 111.Switch 111 may be a single pole, single throw switch.","As one of ordinary skill in the art will readily appreciate, switch 111 may be any type of switch known to the art which is capable of operating under the load conditions imposed by the transmission and handling of ordinary household electrical power, as referenced above.","Switch module 110 is electrically coupled to the first end cap 101a, and in such way it receives household electrical power from the cord (not shown) through the first endcap 101a.","Switch module 110 is also electrically coupled to the next modular component in the chain, which in FIG.","1 is fuse module 120.Electrical power flows into switch module 110, through switch 111, and out of switch module 110 into the next modular component in the chain.","An indicator light (not shown) may be provided on the housing of switch module 110, or it may be incorporated into the switch 111, as in the case of a rocker switch with light to indicate it is in the “ON” position, thereby alerting a user to the status of the power strip.","By manipulating switch 111, a user may selectively turn on and off the flow of electrical power through switch module 110 to other modular components further down the chain electrically connected to switch module 110.For this reason, switch module 110 may be provided near the beginning of the chain of modular components but it need not be.","As with all of the modular components disclosed herein, the order of the components is not critical to the operation of the multi-function power strip.","As long as the modular components are in electrical connection with each other, the order in which they are assembled is a matter of convenience to suit the nature of the area being serviced by the multi-function power strip.","Referring again to FIG.","1, the next modular component in the chain following the switch module 110 is the fuse module 120.As with all of the modular components described, fuse module 120 is electrically connected to and receives electrical power from the component in the chain before it (i.e.","in this case, the switch module).","Electrical power then passes through a fuse 121 and then flows out of fuse module 120 into the next component in the chain.","As one of ordinary skill in the art will readily appreciate, fuse 121 may be any type of fuse known to the art which is capable of operating under the load conditions imposed by the transmission and handling of ordinary household electrical power.","Alternatively, fuse 121 may be a circuit breaker, a ground fault circuit interrupter or any other device designed to protect an electrical circuit from damage caused by overload or short circuit by detecting a fault condition and interrupting continuity to discontinue electrical flow.","The fuse 121 may be completely enclosed in the housing of fuse module 120, such that it is not accessible by a user.","Alternatively, in cases where a circuit breaker or other device that must be reset by a user after a fault occurs are used, the fuse 121 may be mounted so that it protrudes from the housing of fuse module 120, so as to be accessible by a user.","Also shown in FIG.","1 is a first outlet module 130.As with all of the modular components described, first outlet module 130 is electrically connected to and receives electrical power from the component in the chain before it (i.e.","in this case, the fuse module).","The flow of electrical power is then split, and is sent both to outlet receptacles 131 and out of first outlet module 130 into the next component in the chain.","One of ordinary skill in the art will appreciate that many different configurations of outlet receptacles 131 have been developed and implemented in various countries throughout the world.","For example, Type A and Type B outlet configurations are commonly used in North America.","The Type C outlet configuration is commonly used in continental Europe.","The Type G outlet configuration is commonly used in the United Kingdom and the Type I configuration is commonly used in Australia and New Zealand.","The following outlet configurations are recognized by those of ordinary skill in the art: a Type A outlet, a Type B outlet, a Type C outlet, a Type D outlet, a Type E outlet, a Type F outlet, a Type E/F hybrid outlet, a Type G outlet, a Type H outlet, a Type I outlet, a Type J outlet, a Type K outlet, a Type L outlet, and a Type M outlet.","Outlet receptacles 131 may take the form of any of the outlet configurations recited above.","For example, in FIG.","1, the outlet configuration of first outlet module 130 is a Type G outlet.","In this way, the power strip may be adapted to function in various countries using different outlet configurations.","Within the housing of first outlet module 130 may be provided a fuse 132 in the electrical power supply line ahead of outlet receptacles 131, to protect any electrical circuits plugged into the outlet receptacles from overload or short circuit.","Fuse 132 may be used in addition to or in place of a fuse module 120.Also shown in FIG.","1 is a second outlet module 140.Second outlet module 140 is the same in all respects as first outlet module 130, except that second outlet module 140 may have a different outlet configuration than first outlet module 130.Alternatively, second outlet module 140 may have the same outlet configuration as first outlet module 130.For example, in FIG.","1, second outlet module 130 has a Type B outlet configuration, which is different than first outlet module 130, which has a Type G outlet configuration.","As with all of the modular components described, second outlet module 140 is electrically connected to and receives electrical power from the component in the chain before it (i.e.","in this case, the first outlet module).","The flow of electrical power is then split, and is sent both to outlet receptacles 141 and out of second outlet module 140 into the next component in the chain.","Although not shown, within the housing of second outlet module 140 may be provided a fuse in the electrical power supply line ahead of outlet receptacles 141, to protect any electrical circuits plugged into the outlet receptacles from overload or short circuit.","The fuse may be used in addition to or in place of a fuse module 120.The transformer module 150 is also shown in FIG.","1.As with all of the modular components described, transformer module 150 is electrically connected to and receives electrical power from the component in the chain before it (i.e.","in this case, the second outlet module).","Disposed within the transformer module is a transformer (not shown).","The transformer receives household electrical power from the previous component in the chain.","The transformer is adapted to transform the household electrical power into a plurality of voltages suitable for powering a plurality of different models of electronic accessories.","By way of example and without limitation, the transformer may be one of those supplied by the Trade Management Group Ltd. One of ordinary skill in the art will readily appreciate that any transformer capable of operating under the load conditions imposed by the transmission and handling of ordinary household electrical power and capable of producing a plurality of output voltages may be suitable for use in transformer module 150.By way of example, and without limitation, the transformer may be adapted to produce the following output voltages: 16V, 18V, 20V, 22V and 24V.","All of the preceding voltages may be provided at a current of approximately 5 A or less.","Transformer module 150 may include a primary output connection 151.Primary output connection 151 may be provided with a plurality of pins (not shown).","Each of the plurality of pins may have a designated one of the plurality of voltages produced by the transformer supplied thereto.","Additionally, a ground pin may be provided as one of the plurality of pins in the primary connector.","In use, a plurality of cords with plugs may be provided to the user.","Each of the plurality of plugs will fit into the primary output connector 151 in such a way as to form an electrical connection with a designated one of the plurality of pins and the ground pin, thereby forming a circuit to provide a suitable one of the plurality of voltages to an electronic accessory.","Each of the plurality of plugs will only fit into the primary output connector 151 in a specified way, thus each of the cords and associated plugs supplies one of the designated voltages to an electronic accessory.","The user determines which plug and cord combination to use to power a specified electronic accessory.","Transformer module 150 may also be provided with a secondary output connector 152.In addition to the voltages produced by the transformer and output to the primary output connector 151, the transformer may be adapted to produce certain secondary output voltages.","By way of example and without limitation, the secondary output voltages produced by the transformer may be: 5V, 12V, 15V, and 22V.","All of the preceding voltages may be provided at a current of approximately 5 A or less.","In a similar fashion as described above, secondary output connection 152 may be provided with a plurality of pins (not shown).","Each of the plurality of pins may have a designated one of the plurality of secondary output voltages produced by the transformer supplied thereto.","Additionally, a ground pin may be provided as one of the plurality of pins in the secondary connector.","In use, a plurality of cords with plugs may be provided to the user.","Each of the plurality of plugs will fit into the secondary output connector 152 in such a way as to form an electrical connection with a designated one of the plurality of pins and the ground pin, thereby forming a circuit to provide a suitable one of the plurality of secondary output voltages to secondary electronic accessory.","Each of the plurality of plugs will only fit into the secondary output connector 152 in a specified way, thus each of the cords and associated plugs supplies one of the designated secondary output voltages to a secondary electronic accessory.","The user determines which plug and cord combination to use to power a specified secondary electronic accessory.","Also shown in FIG.","1 is USB module 160.As with all of the modular components described, USB module 160 is electrically connected to and receives electrical power from the component in the chain before it (i.e.","in this case, the transformer module).","USB module is provided with USB ports 161, which are standard Universal Serial Bus (USB) ports.","Power may be provided to USB ports 161 in two ways.","ln a first embodiment, the transformer in transformer module 150 may produce a USB electrical power output.","By way of example and without limitation, such USB electrical power output may be a 5V 2 A power output.","The USB electrical power output is then sent from the transformer module 150 to the USB module 160 and distributed through the USB ports 161.In an alternate embodiment, a USB transformer may be provided within USB module 160.In this embodiment, the USB module receives household electrical power from the prior component in the chain (i.e.","the transformer module) and steps it down to a voltage suitable for distribution through the USB ports 161.Several other aspects of the USB module 160 will now be further explained.","Universal Serial Bus (USB) is a specification to establish communication between devices and a host controller (usually a personal computer), and can be used to connect computer peripherals to a personal computer.","USB connections can also be used with other devices such as smartphones, PDAs and video game consoles.","USB connectors supply electric power to the devices connected thereto, so devices connected by USB may not require a power source of their own.","One of ordinary skill in the art will readily appreciate that the parameters of the output from the USB ports 161 is governed by the USB standard.","The USB 2.0 standard is commonly used in many applications, and USB module 160 and the output of USB ports 161 may be selected to conform to that standard.","Alternatively, the USB 3.0 standard has recently introduced, and USB module 160 and the output of USB ports 161 may be selected to conform to that standard.","As noted above, USB connections may be used to supply power to a device or to recharge the batteries contained in a portable device.","When used for charging, the electrical power supplied to the USB ports 161 may be 5V and 0.5 A.","One of ordinary skill in the art will readily appreciate that certain electronic accessories, most notably Apple® products, require a higher charging amperage than those of devices which comply with the USB standards.","Such devices requiring higher charging amperages may require as much as 2 A for proper charging.","It should appreciated that the power supplied to all or a portion of USB ports 161 could be standard USB power or higher amperage charging power to accommodate devices which require higher charging amperages.","Additionally, it should be appreciated that charging electronic devices and providing USB power are not the only functions that the USB module 160 can perform.","USB module 160 may also serve as a USB hub.","A USB hub is a device that expands a single USB port into several so that there are more ports available to connect devices to a host system.","In such an arrangement, one of the USB ports 161a may be designated a USB hub port and may be connected via a USB cable (not shown) to a USB port on a personal computer.","USB module 160 may contain electronic circuitry required to allow USB module 160 to act as a USB hub.","Most USB hubs use one or more integrated controller (IC's), of which several designs are available from various manufacturers and are well known to persons of skill in the art.","The IC's control the flow of data between the USB hub port 161a and the remaining USB ports 161, and thereby allows the remaining USB ports 161 to act as additional USB ports connected to the personal computer connected to the USB hub.","Also shown in FIG.","1 is network module 170.Depending on the functionality implemented, network module 170 may or may not require a source of electrical power.","In an embodiment where network module 170 does require electrical power, network module 170 is electrically connected to and receives electrical power from the component in the chain before it (i.e.","in this case, the USB module).","The power received by network module 170 may be standard household electrical power, and network module 170 may contain a transformer (not shown) for stepping down the household electrical power to a voltage suitable for use in the network module.","Alternatively, the component in the chain before the network module 170 (in this case, the USB module) may transform the household electrical power into a voltage suitable for use in the network module 170 and then pass that voltage on to the network module 170.Network module 170 is provided with network ports 171.Network ports 171 may be RJ45 connectors for receiving LAN (Local Area Network) data signals.","Alternatively, network ports 171 may be RJ11 connectors for receiving telephone signals, or BNC connectors for receiving cable TV signals or other data signals.","One of ordinary skill will appreciate that network ports 171 may take the form of any connector necessary to connect the required data stream to the network module 170.Inside network module 170 is provided a fuse, circuit breaker or the like (not shown).","The fuse, circuit breaker or the like is electrically connected between first network port 171a and second network port 171b, and provides voltage and current surge protection between the two ports.","In operation, a data feed cable (not shown) is connected to first network port 171a.","A personal computer or other device may then be connected via a data cable to second network port 171b.","In the event of a voltage or current spike in the data circuit, the fuse, circuit breaker or the like provided in network module 170 will trip, thereby preventing said voltage or current spike from reaching the personal computer or other device connected to second network port 171b.","In this way, network module 170 may act as pass-through surge suppressor for LAN, telephone, CATV or other data feeds.","It should be appreciated that network module 170 may also have more advanced features.","For instance, network module 170 may function as a network switch.","A network switch serves as a controller, enabling networked devices to exchange data with each other efficiently.","Network switches are capable of inspecting data packets as they are received, determining the source and destination device of each packet, and forwarding them appropriately.","By delivering messages only to the connected device intended, a network switch conserves network bandwidth.","If network module 170 is to be configured as a network switch, electrical power may be provided to the network module 170 as described supra.","If network module 170 is to be configured as a network switch, network module 170 may be provided with more network ports than shown in FIG.","1, for example, network module 170 may be provided with four network ports.","One of the network ports may be designated a LAN input port and may be connected via a LAN cable (not shown) to a local area network.","Network module 170 may be provided with electronic circuitry required to allow network module 170 to act as a network switch.","Most network switches use one or more integrated controller (IC's), of which several designs are available from various manufacturers and are well known to persons of skill in the art.","The IC's control the flow of data between the LAN input port and the remaining network ports, and thereby allows the remaining network ports to act as additional network ports for connecting additional devices to the local area network.","The network switch electronic circuitry inside the network module 170 directs data on the LAN to the appropriate devices connected to the network ports.","Thus, the switch allows multiple devices to be connected to a single LAN connection, and provides for the accurate routing of data to the devices so connected.","FIG.","2 shows a top exploded view of an embodiment of a multi-function power strip 100.Like numbers will be used to designate components already described with respect to FIG.","1.As can be seen in FIG.","2, first endcap 101a and endcap 101 are provided, as is rail 102.Additionally, switch module 110, fuse module 120, first outlet module 130, second outlet module 140, transformer module 150, USB module 160 and network module 170 are provided.","As can be readily seen in the exploded view, all of the aforementioned modules are slidably engaged with the rail 102, and retained in engagement with the rail 102 by the endcaps 101.As has been previously pointed out, it should be appreciated that not all of the aforementioned modules need be provided in every embodiment of the power strip.","For example, only a single outlet module may be provided, or the USB and/or network modules may be left out of the configuration.","Thus, depending on the customer's desire for the functionality of the device, certain modules may be excluded from the assembly, or certain modules may be included in numbers in excess of what has been shown in FIG.","2, as in the case where a customer desires numerous outlet modules in addition to all the other modules.","It should be readily appreciated that rail 102, as an extruded part, may be cut to any length and therefore may accommodate any number of modules as requested by the customer.","The only limitation on the number of modules, and hence the overall length of rail 102 and relatedly the assembly 100 is that the maximum power that can be drawn by the combination of all of the modules in the power strip is 4000 Watts.","As long as the combined modules draw less than the aforementioned maximum power, any combination of modules, and any length of rail 102 necessary to accommodate those modules may be used.","Also shown in FIG.","2 are module connectors 210.Module connectors 210 electrically connect the various modules in the power strip assembly together.","Module connectors 210 mate with electrical contacts formed in the housings of the various modules (not shown) and thereby electrically connect two adjacent modules together.","The structure of the module connectors 210 will be explained in greater detail with reference to FIG.","5.Referring again to FIG.","2, note that certain modules do not employ module connectors 210.As shown in FIG.","2, USB module 160 and network module 170 use attached connectors 220 to electrically connect those modules to the previous component in the chain.","Attached connectors 220 have essentially the same structure as module connectors 210 with the exception being that attached connectors 220 are permanently attached to the module that they connect to the previous component in the chain.","One of ordinary skill will readily appreciate either module connectors 210 or attached connectors 220 could be used to electrically connect any or all of the modules in the power strip together, and the selection of either module connector 210 or attached connector 220 is simply a matter of preference or improvement of the manufacturability of the power strip.","FIG.","3 shows an isometric exploded view of an embodiment of the multi-function power strip 100.Like numbers will be used to designate components already described with respect to FIG.","1.As can be seen in FIG.","3, first endcap 101a and endcap 101 are provided, as is rail 102.Additionally, switch module 110, fuse module 120, first outlet module 130, second outlet module 140, transformer module 150, USB module 160 and network module 170 are provided.","FIG.","3 illustrates the manner in which the various modules engage with rail 102.As can be in FIG.","3 all of the modules are provided with tabs 310.Tabs 310 slidably engage with groove 320 in rail 102, and thereby retain the modules in the rail.","Endcaps 101 and 101a engage with the ends of rail 102, and have holes 330 provided therein for attachment means (not shown) to secure the endcaps 101, 101a to the rail 102.The modules can be slid into and out of engagement with rail easily for assembly and for disassembly in the event it becomes necessary to replace one of the modules.","FIG.","4 shows a block diagram showing the inter-relation of parts in an embodiment of the multi-function power strip.","As shown in FIG.","4, power source 400 is a standard household electrical power source and is the power input into the multi-function power strip.","The electric power may then pass through components 410 which may be an on/off switch, a circuit breaker or a fuse.","The electrical power may pass through a single one, two or all three of these components, depending on the configuration of the multi-function power strip.","Electrical power may then pass through an optional timer or occupancy sensor 420.If component 420 is a timer module, it may be a standard programmable timer that is configured to permit the flow of electrical power to components down the chain for certain periods of the day, and to block the flow of electrical power to components down the chain for certain other periods of the day.","Such timers are well known to those of skill in the art, as is their inclusion in a circuit of this type.","If component 420 is an occupancy sensor module, it may contain an occupancy sensor adapted to detect the presence of a person in the area adjacent to the power strip and to turn off electrical power to components down the chain of the power strip when a person is not present in the area adjacent to the power strip.","One of ordinary skill in the art will readily appreciate that any occupancy sensor switch suitable for use in the area around a power strip would be suitable for use as an occupancy sensor in occupancy sensor module 420.Occupancy sensor module 420 may operate by detecting infrared radiation in the area surrounding the power strip that is produced by the presence of a person.","In operation, when occupancy sensor module 420 detects the presence of a person in the area surrounding the power, it allows the flow of electrical power to modules down the chain of the power strip.","If the occupancy sensor does not detect the presence of a person in the area surrounding the power strip, it interrupts the flow of electrical power to the components down the chain.","As shown in FIG.","4, electrical power then passes into outlet modules 430, 440, 450 and 460.The dashed lines in FIG.","4 show possible routes for the electrical power, showing that it may travel through one, two, three or all four of the outlet modules, depending on the configuration of the power strip.","As shown in FIG.","4, the outlet modules are all of different configurations, outlet module 430 is a United States configuration outlet; outlet module 440 is a European configuration outlet; outlet module 450 is a United Kingdom configuration outlet; and outlet module 460 is a Chinese configuration outlet.","One of ordinary skill will appreciate that the outlet modules may all have different configurations as shown or they may all be of a single configuration, or they may be a combination of two or more configurations.","Each of the outlet modules is configured so that electrical power may be transferred to a device plugged into the outlet module, and also that electrical power is transferred to the next component in the chain.","From the last outlet module, electrical power is then flows into the transformer module 470.As discussed with respect to FIG.","1, transformer module 470 steps down household electrical power to a plurality of voltages suitable for powering electronic accessories and outputs those voltages though a multi-pinned connector adapted to mate with a plurality of plugs and thereby supply the appropriate voltages to electronic accessories.","Electrical power then flows into USB module 480.As shown in FIG.","4, transformer module 470 may step household electrical power down to a 5V 2 A output for USB module 480.Alternatively, USB module 480 may contain a transformer which transforms electrical power into a voltage suitable for use in USB module 480.In such an embodiment, household electrical power would flow from transformer module 470 to USB module 480.USB module 480 may receive data from and transmit data to a personal computer or other device in the case where USB module 480 acts as a USB hub.","USB module 480 may provide a source of power to network module 490.Network module 490 may act as a pass-through surge suppressor or network cables, phone cables or other data feeds.","Alternatively, network module 490 may act as a network switch and may receive data from and transmit data to a personal computer or other device.","FIG.","5 shows a side perspective view of the module connector and module used in an embodiment of the multi-function power strip.","Shown in FIG.","5 is a switch module 110 with tabs 310 (as described with reference to FIG.","3), however, as set forth in the description of FIG.","2, module connectors 210 can be used with any of the modules described in the various embodiments of the multi-function power strip.","Module connector 210 has a body 500 with a first end 500a.","The opposite end of body 500 (not shown) is a mirror image of first end 500a.","Body 500 of module connector 210 can be fabricated from any suitable material known in the art, for example, plastic.","Apertures 510 are provided in first end body 500a and extend all the way through the body to the opposite end (not shown).","In such a way, the body 500 has a hollow interior formed by the apertures 510.Three apertures 510 are shown in FIG.","5, however, it should be apparent to one of ordinary skill in the art that any number of apertures could be used, depending on the number of connections that must be made between the modules.","By way of example and without limitation, the three apertures shown in FIG.","5 may accommodate positive, negative and ground connections between modules.","In applications where an additional number of connections are required, as for example in cases where data or transformed voltages are also to be transferred between modules, more apertures may be provided.","Body 500 may also be provided with an alignment boss 512.Alignment boss 512 mates with alignment groove 513 on the module.","Alignment boss 512 and alignment groove 513 ensure that the module connector 210 and the module are connected in the appropriate orientation.","Disposed within the apertures 510 are contacts 511.Similar contacts (not shown) are disposed on the opposite end of body 500 (not shown).","The contacts 511 may be made from copper or any material suitable for conducting electricity.","The contacts 511 mate with and form an electrical connection with the blades 514 disposed on the module.","The contacts 511, and the similar contacts (not shown) on the opposite end of body 500 are electrically connected.","The similar contacts (not shown) on the opposite end of body 500 are likewise adapted to mate with blades (not shown) on an adjacent module.","In this way, the contacts in the module connector 210 form an electrical connection between two adjacent modules.","It, will be appreciated by those of ordinary skill in the art that, while the forgoing disclosure has been set forth in connection with particular embodiments and examples, the disclosure is not intended to be necessarily so limited, and that numerous other embodiments, examples, uses, modifications and departures from the embodiments, examples and uses described herein are intended to be encompassed by the claims attached hereto.","Various features of the disclosure are set forth in the following claims."]],"string":"[\n [\n \"MULTI-FUNCTION POWER STRIP\",\n \"Embodiments of a multi-function power strip are shown, said strip including a first endcap and a second endcap; at least one rail, said rail being adapted to engage with at least one outlet module; the rail also being engaged with a transformer module, said transformer module in electrical connection with the at least one outlet module, and adapted to receive electrical power therefrom, said transformer module further comprising a transformer adapted to transform electrical power into a plurality of voltages suitable for powering a plurality of different models of electronic accessories, and a connector forming a circuit to provide a suitable one of the plurality of voltages to an electronic accessory; and wherein the at least one outlet module and the transformer module are releasably joined together.\"\n ],\n [\n \"1.A module connector for a multi-function power strip comprising: a module connector body with a first end and a second end, the second end being a mirror image of first end; at least one aperture provided in the first end of the module connector body and extending all the way through the module connector body to the second end; a first contact disposed within the at least one aperture at the first end of the module connector body and a second contact disposed in the at least one aperture at the second end of the module connector body, wherein the first and second contacts are electrically connected; and wherein the first and second contacts mate with blades disposed in a first module of the multi-function power strip and a second module of the multi-function power strip thereby forming an electrical connection between the adjacent first and second modules.\",\n \"2.The module connector of claim 1, wherein the blades are disposed in an opening in the first module and the second module.\",\n \"3.The module connector of claim 2, wherein the blades do not protrude past the side of the first module and the second module to prevent the blades from making accidental contact with persons or things which may cause an electrical shock or short circuit.\",\n \"4.The module connector of claim 1, wherein the module connector is adapted to slide into an opening in the first module and the second module.\",\n \"5.The module connector of claim 1, wherein at least three apertures are provided in the module connector body.\",\n \"6.The module connector of claim 1, wherein the module connector body further comprises an alignment boss.\",\n \"7.The module connector of claim 6, wherein the first module and the second module are both provided with alignment grooves to receive the alignment boss on the module connector body.\",\n \"8.The module connector of claim 1, wherein the contacts are made from copper.\",\n \"9.The module connector of claim 1, Therein the contacts are made from any material suitable for conducting electricity.\"\n ],\n [\n \" BRIEF DESCRIPTION OF THE DRAWINGS FIG.\",\n \"1 is a top view of an embodiment of the multi-function power strip.\",\n \"FIG.\",\n \"2 is a top exploded view of an embodiment of the multi-function power strip.\",\n \"FIG.\",\n \"3 is an isometric exploded view of an embodiment of the multi-function power strip.\",\n \"FIG.\",\n \"4 is a block diagram showing the inter-relation of parts in an embodiment of the multi-function power strip.\",\n \"FIG.\",\n \"5 is a side perspective view of the module connector and module used in an embodiment of the multi-function power strip.\",\n \"detailed-description description=\\\"Detailed Description\\\" end=\\\"lead\\\"?\"\n ],\n [\n \"CROSS-REFERENCE TO RELATED APPLICATIONS The present application is a continuation of U.S. application Ser.\",\n \"No.\",\n \"15/380,766 filed Dec. 15, 2016, now U.S. Pat.\",\n \"No.\",\n \"9,876,325, which is a continuation of U.S. application Ser.\",\n \"No.\",\n \"15/073,257 filed Mar.\",\n \"17, 2016, now abandoned, which is a continuation of U.S. application Ser.\",\n \"No.\",\n \"14/856,782 filed Sep. 17, 2015, now U.S. Pat.\",\n \"No.\",\n \"9,300,097, which is a continuation of U.S. application Ser.\",\n \"No.\",\n \"14/147,314, filed Jan. 3, 2014, now U.S. Pat.\",\n \"No.\",\n \"9,147,982, which is a continuation of U.S. application Ser.\",\n \"No.\",\n \"13/110,644, filed May 18, 2011, now U.S. Pat.\",\n \"No.\",\n \"8,622,756, all having the same title, and all of which are incorporated herein by this reference.\",\n \"BRIEF DESCRIPTION OF THE DRAWINGS FIG.\",\n \"1 is a top view of an embodiment of the multi-function power strip.\",\n \"FIG.\",\n \"2 is a top exploded view of an embodiment of the multi-function power strip.\",\n \"FIG.\",\n \"3 is an isometric exploded view of an embodiment of the multi-function power strip.\",\n \"FIG.\",\n \"4 is a block diagram showing the inter-relation of parts in an embodiment of the multi-function power strip.\",\n \"FIG.\",\n \"5 is a side perspective view of the module connector and module used in an embodiment of the multi-function power strip.\",\n \"DETAILED DESCRIPTION OF THE DRAWINGS Embodiments of a multi-function power strip are shown and described.\",\n \"Generally, the multi-function power strip comprises a cord for connection to an electrical power source; a plurality of outlet modules in electrical connection with the cord, wherein said plurality of outlet modules are in electrical connection with each other; and a transformer module, said transformer module in electrical connection with at least one of the outlet modules, and adapted to receive electrical power therefrom, said transformer module further comprising, a transformer adapted to transform electrical power into a plurality of voltages suitable for powering a plurality of different models of electronic accessories, and a connector electrically connected to the transformer, and having a plurality of pins, each of the plurality of pins having a designated one of the plurality of voltages supplied thereto, and wherein the connector is configured to engage with a plurality of plugs, each of the plugs forming an electrical connection with a designated one of the plurality of pins and a ground pin, thereby forming a circuit to provide a suitable one of the plurality of voltages to an electronic accessory; and wherein the outlet modules and the transformer module are releasably joined together.\",\n \"Thus, embodiments of the multi-function power strip are assembled by combining together and electrically connecting a number of modular components into a single assembly.\",\n \"FIG.\",\n \"1 shows a top view of a first embodiment of the multi-function power strip.\",\n \"As can be seen in FIG.\",\n \"1, multi-function power strip 100 is comprised of endcaps 101 and rail 102.Various modular components (which will be discussed in greater detail infra) are engaged with rail 102 and retained in engagement with rail 102 by end caps 101.Endcaps 101 may attach to rail 102 by means of screws or other fasteners commonly used in the art.\",\n \"Alternatively, endcaps 101 may engage with rail 102 by means of a friction-fit or snap-fit, and thereby be retained in connection to the rail 102.First endcap 101a is provided with a coupler (not shown) into which a cord (not shown) can be received.\",\n \"The cord (not shown) provides standard household electrical power, which one of skill in the art would appreciate can be between 110 and 240 volts, alternating current, with a frequency between 50 and 60 Hz.\",\n \"The cord is received in the endcap, and the endcap is electrically connected to the first modular component in the multi-function power strip, thereby providing household electrical power to the first modular component, and all other modular components that are joined thereto.\",\n \"Referring again to FIG.\",\n \"1, it will be appreciated that a number of modular components are engaged with rail 102.All of the modular components are electrically connected together, and each receives electrical power from the previous component in the chain.\",\n \"The structure and function of each will now be explained in greater detail.\",\n \"As shown in FIG.\",\n \"1, an embodiment of multi-function power strip 100 may include a switch module 110.Switch module 110 is provided with switch 111.Switch 111 may be a single pole, single throw switch.\",\n \"As one of ordinary skill in the art will readily appreciate, switch 111 may be any type of switch known to the art which is capable of operating under the load conditions imposed by the transmission and handling of ordinary household electrical power, as referenced above.\",\n \"Switch module 110 is electrically coupled to the first end cap 101a, and in such way it receives household electrical power from the cord (not shown) through the first endcap 101a.\",\n \"Switch module 110 is also electrically coupled to the next modular component in the chain, which in FIG.\",\n \"1 is fuse module 120.Electrical power flows into switch module 110, through switch 111, and out of switch module 110 into the next modular component in the chain.\",\n \"An indicator light (not shown) may be provided on the housing of switch module 110, or it may be incorporated into the switch 111, as in the case of a rocker switch with light to indicate it is in the “ON” position, thereby alerting a user to the status of the power strip.\",\n \"By manipulating switch 111, a user may selectively turn on and off the flow of electrical power through switch module 110 to other modular components further down the chain electrically connected to switch module 110.For this reason, switch module 110 may be provided near the beginning of the chain of modular components but it need not be.\",\n \"As with all of the modular components disclosed herein, the order of the components is not critical to the operation of the multi-function power strip.\",\n \"As long as the modular components are in electrical connection with each other, the order in which they are assembled is a matter of convenience to suit the nature of the area being serviced by the multi-function power strip.\",\n \"Referring again to FIG.\",\n \"1, the next modular component in the chain following the switch module 110 is the fuse module 120.As with all of the modular components described, fuse module 120 is electrically connected to and receives electrical power from the component in the chain before it (i.e.\",\n \"in this case, the switch module).\",\n \"Electrical power then passes through a fuse 121 and then flows out of fuse module 120 into the next component in the chain.\",\n \"As one of ordinary skill in the art will readily appreciate, fuse 121 may be any type of fuse known to the art which is capable of operating under the load conditions imposed by the transmission and handling of ordinary household electrical power.\",\n \"Alternatively, fuse 121 may be a circuit breaker, a ground fault circuit interrupter or any other device designed to protect an electrical circuit from damage caused by overload or short circuit by detecting a fault condition and interrupting continuity to discontinue electrical flow.\",\n \"The fuse 121 may be completely enclosed in the housing of fuse module 120, such that it is not accessible by a user.\",\n \"Alternatively, in cases where a circuit breaker or other device that must be reset by a user after a fault occurs are used, the fuse 121 may be mounted so that it protrudes from the housing of fuse module 120, so as to be accessible by a user.\",\n \"Also shown in FIG.\",\n \"1 is a first outlet module 130.As with all of the modular components described, first outlet module 130 is electrically connected to and receives electrical power from the component in the chain before it (i.e.\",\n \"in this case, the fuse module).\",\n \"The flow of electrical power is then split, and is sent both to outlet receptacles 131 and out of first outlet module 130 into the next component in the chain.\",\n \"One of ordinary skill in the art will appreciate that many different configurations of outlet receptacles 131 have been developed and implemented in various countries throughout the world.\",\n \"For example, Type A and Type B outlet configurations are commonly used in North America.\",\n \"The Type C outlet configuration is commonly used in continental Europe.\",\n \"The Type G outlet configuration is commonly used in the United Kingdom and the Type I configuration is commonly used in Australia and New Zealand.\",\n \"The following outlet configurations are recognized by those of ordinary skill in the art: a Type A outlet, a Type B outlet, a Type C outlet, a Type D outlet, a Type E outlet, a Type F outlet, a Type E/F hybrid outlet, a Type G outlet, a Type H outlet, a Type I outlet, a Type J outlet, a Type K outlet, a Type L outlet, and a Type M outlet.\",\n \"Outlet receptacles 131 may take the form of any of the outlet configurations recited above.\",\n \"For example, in FIG.\",\n \"1, the outlet configuration of first outlet module 130 is a Type G outlet.\",\n \"In this way, the power strip may be adapted to function in various countries using different outlet configurations.\",\n \"Within the housing of first outlet module 130 may be provided a fuse 132 in the electrical power supply line ahead of outlet receptacles 131, to protect any electrical circuits plugged into the outlet receptacles from overload or short circuit.\",\n \"Fuse 132 may be used in addition to or in place of a fuse module 120.Also shown in FIG.\",\n \"1 is a second outlet module 140.Second outlet module 140 is the same in all respects as first outlet module 130, except that second outlet module 140 may have a different outlet configuration than first outlet module 130.Alternatively, second outlet module 140 may have the same outlet configuration as first outlet module 130.For example, in FIG.\",\n \"1, second outlet module 130 has a Type B outlet configuration, which is different than first outlet module 130, which has a Type G outlet configuration.\",\n \"As with all of the modular components described, second outlet module 140 is electrically connected to and receives electrical power from the component in the chain before it (i.e.\",\n \"in this case, the first outlet module).\",\n \"The flow of electrical power is then split, and is sent both to outlet receptacles 141 and out of second outlet module 140 into the next component in the chain.\",\n \"Although not shown, within the housing of second outlet module 140 may be provided a fuse in the electrical power supply line ahead of outlet receptacles 141, to protect any electrical circuits plugged into the outlet receptacles from overload or short circuit.\",\n \"The fuse may be used in addition to or in place of a fuse module 120.The transformer module 150 is also shown in FIG.\",\n \"1.As with all of the modular components described, transformer module 150 is electrically connected to and receives electrical power from the component in the chain before it (i.e.\",\n \"in this case, the second outlet module).\",\n \"Disposed within the transformer module is a transformer (not shown).\",\n \"The transformer receives household electrical power from the previous component in the chain.\",\n \"The transformer is adapted to transform the household electrical power into a plurality of voltages suitable for powering a plurality of different models of electronic accessories.\",\n \"By way of example and without limitation, the transformer may be one of those supplied by the Trade Management Group Ltd. One of ordinary skill in the art will readily appreciate that any transformer capable of operating under the load conditions imposed by the transmission and handling of ordinary household electrical power and capable of producing a plurality of output voltages may be suitable for use in transformer module 150.By way of example, and without limitation, the transformer may be adapted to produce the following output voltages: 16V, 18V, 20V, 22V and 24V.\",\n \"All of the preceding voltages may be provided at a current of approximately 5 A or less.\",\n \"Transformer module 150 may include a primary output connection 151.Primary output connection 151 may be provided with a plurality of pins (not shown).\",\n \"Each of the plurality of pins may have a designated one of the plurality of voltages produced by the transformer supplied thereto.\",\n \"Additionally, a ground pin may be provided as one of the plurality of pins in the primary connector.\",\n \"In use, a plurality of cords with plugs may be provided to the user.\",\n \"Each of the plurality of plugs will fit into the primary output connector 151 in such a way as to form an electrical connection with a designated one of the plurality of pins and the ground pin, thereby forming a circuit to provide a suitable one of the plurality of voltages to an electronic accessory.\",\n \"Each of the plurality of plugs will only fit into the primary output connector 151 in a specified way, thus each of the cords and associated plugs supplies one of the designated voltages to an electronic accessory.\",\n \"The user determines which plug and cord combination to use to power a specified electronic accessory.\",\n \"Transformer module 150 may also be provided with a secondary output connector 152.In addition to the voltages produced by the transformer and output to the primary output connector 151, the transformer may be adapted to produce certain secondary output voltages.\",\n \"By way of example and without limitation, the secondary output voltages produced by the transformer may be: 5V, 12V, 15V, and 22V.\",\n \"All of the preceding voltages may be provided at a current of approximately 5 A or less.\",\n \"In a similar fashion as described above, secondary output connection 152 may be provided with a plurality of pins (not shown).\",\n \"Each of the plurality of pins may have a designated one of the plurality of secondary output voltages produced by the transformer supplied thereto.\",\n \"Additionally, a ground pin may be provided as one of the plurality of pins in the secondary connector.\",\n \"In use, a plurality of cords with plugs may be provided to the user.\",\n \"Each of the plurality of plugs will fit into the secondary output connector 152 in such a way as to form an electrical connection with a designated one of the plurality of pins and the ground pin, thereby forming a circuit to provide a suitable one of the plurality of secondary output voltages to secondary electronic accessory.\",\n \"Each of the plurality of plugs will only fit into the secondary output connector 152 in a specified way, thus each of the cords and associated plugs supplies one of the designated secondary output voltages to a secondary electronic accessory.\",\n \"The user determines which plug and cord combination to use to power a specified secondary electronic accessory.\",\n \"Also shown in FIG.\",\n \"1 is USB module 160.As with all of the modular components described, USB module 160 is electrically connected to and receives electrical power from the component in the chain before it (i.e.\",\n \"in this case, the transformer module).\",\n \"USB module is provided with USB ports 161, which are standard Universal Serial Bus (USB) ports.\",\n \"Power may be provided to USB ports 161 in two ways.\",\n \"ln a first embodiment, the transformer in transformer module 150 may produce a USB electrical power output.\",\n \"By way of example and without limitation, such USB electrical power output may be a 5V 2 A power output.\",\n \"The USB electrical power output is then sent from the transformer module 150 to the USB module 160 and distributed through the USB ports 161.In an alternate embodiment, a USB transformer may be provided within USB module 160.In this embodiment, the USB module receives household electrical power from the prior component in the chain (i.e.\",\n \"the transformer module) and steps it down to a voltage suitable for distribution through the USB ports 161.Several other aspects of the USB module 160 will now be further explained.\",\n \"Universal Serial Bus (USB) is a specification to establish communication between devices and a host controller (usually a personal computer), and can be used to connect computer peripherals to a personal computer.\",\n \"USB connections can also be used with other devices such as smartphones, PDAs and video game consoles.\",\n \"USB connectors supply electric power to the devices connected thereto, so devices connected by USB may not require a power source of their own.\",\n \"One of ordinary skill in the art will readily appreciate that the parameters of the output from the USB ports 161 is governed by the USB standard.\",\n \"The USB 2.0 standard is commonly used in many applications, and USB module 160 and the output of USB ports 161 may be selected to conform to that standard.\",\n \"Alternatively, the USB 3.0 standard has recently introduced, and USB module 160 and the output of USB ports 161 may be selected to conform to that standard.\",\n \"As noted above, USB connections may be used to supply power to a device or to recharge the batteries contained in a portable device.\",\n \"When used for charging, the electrical power supplied to the USB ports 161 may be 5V and 0.5 A.\",\n \"One of ordinary skill in the art will readily appreciate that certain electronic accessories, most notably Apple® products, require a higher charging amperage than those of devices which comply with the USB standards.\",\n \"Such devices requiring higher charging amperages may require as much as 2 A for proper charging.\",\n \"It should appreciated that the power supplied to all or a portion of USB ports 161 could be standard USB power or higher amperage charging power to accommodate devices which require higher charging amperages.\",\n \"Additionally, it should be appreciated that charging electronic devices and providing USB power are not the only functions that the USB module 160 can perform.\",\n \"USB module 160 may also serve as a USB hub.\",\n \"A USB hub is a device that expands a single USB port into several so that there are more ports available to connect devices to a host system.\",\n \"In such an arrangement, one of the USB ports 161a may be designated a USB hub port and may be connected via a USB cable (not shown) to a USB port on a personal computer.\",\n \"USB module 160 may contain electronic circuitry required to allow USB module 160 to act as a USB hub.\",\n \"Most USB hubs use one or more integrated controller (IC's), of which several designs are available from various manufacturers and are well known to persons of skill in the art.\",\n \"The IC's control the flow of data between the USB hub port 161a and the remaining USB ports 161, and thereby allows the remaining USB ports 161 to act as additional USB ports connected to the personal computer connected to the USB hub.\",\n \"Also shown in FIG.\",\n \"1 is network module 170.Depending on the functionality implemented, network module 170 may or may not require a source of electrical power.\",\n \"In an embodiment where network module 170 does require electrical power, network module 170 is electrically connected to and receives electrical power from the component in the chain before it (i.e.\",\n \"in this case, the USB module).\",\n \"The power received by network module 170 may be standard household electrical power, and network module 170 may contain a transformer (not shown) for stepping down the household electrical power to a voltage suitable for use in the network module.\",\n \"Alternatively, the component in the chain before the network module 170 (in this case, the USB module) may transform the household electrical power into a voltage suitable for use in the network module 170 and then pass that voltage on to the network module 170.Network module 170 is provided with network ports 171.Network ports 171 may be RJ45 connectors for receiving LAN (Local Area Network) data signals.\",\n \"Alternatively, network ports 171 may be RJ11 connectors for receiving telephone signals, or BNC connectors for receiving cable TV signals or other data signals.\",\n \"One of ordinary skill will appreciate that network ports 171 may take the form of any connector necessary to connect the required data stream to the network module 170.Inside network module 170 is provided a fuse, circuit breaker or the like (not shown).\",\n \"The fuse, circuit breaker or the like is electrically connected between first network port 171a and second network port 171b, and provides voltage and current surge protection between the two ports.\",\n \"In operation, a data feed cable (not shown) is connected to first network port 171a.\",\n \"A personal computer or other device may then be connected via a data cable to second network port 171b.\",\n \"In the event of a voltage or current spike in the data circuit, the fuse, circuit breaker or the like provided in network module 170 will trip, thereby preventing said voltage or current spike from reaching the personal computer or other device connected to second network port 171b.\",\n \"In this way, network module 170 may act as pass-through surge suppressor for LAN, telephone, CATV or other data feeds.\",\n \"It should be appreciated that network module 170 may also have more advanced features.\",\n \"For instance, network module 170 may function as a network switch.\",\n \"A network switch serves as a controller, enabling networked devices to exchange data with each other efficiently.\",\n \"Network switches are capable of inspecting data packets as they are received, determining the source and destination device of each packet, and forwarding them appropriately.\",\n \"By delivering messages only to the connected device intended, a network switch conserves network bandwidth.\",\n \"If network module 170 is to be configured as a network switch, electrical power may be provided to the network module 170 as described supra.\",\n \"If network module 170 is to be configured as a network switch, network module 170 may be provided with more network ports than shown in FIG.\",\n \"1, for example, network module 170 may be provided with four network ports.\",\n \"One of the network ports may be designated a LAN input port and may be connected via a LAN cable (not shown) to a local area network.\",\n \"Network module 170 may be provided with electronic circuitry required to allow network module 170 to act as a network switch.\",\n \"Most network switches use one or more integrated controller (IC's), of which several designs are available from various manufacturers and are well known to persons of skill in the art.\",\n \"The IC's control the flow of data between the LAN input port and the remaining network ports, and thereby allows the remaining network ports to act as additional network ports for connecting additional devices to the local area network.\",\n \"The network switch electronic circuitry inside the network module 170 directs data on the LAN to the appropriate devices connected to the network ports.\",\n \"Thus, the switch allows multiple devices to be connected to a single LAN connection, and provides for the accurate routing of data to the devices so connected.\",\n \"FIG.\",\n \"2 shows a top exploded view of an embodiment of a multi-function power strip 100.Like numbers will be used to designate components already described with respect to FIG.\",\n \"1.As can be seen in FIG.\",\n \"2, first endcap 101a and endcap 101 are provided, as is rail 102.Additionally, switch module 110, fuse module 120, first outlet module 130, second outlet module 140, transformer module 150, USB module 160 and network module 170 are provided.\",\n \"As can be readily seen in the exploded view, all of the aforementioned modules are slidably engaged with the rail 102, and retained in engagement with the rail 102 by the endcaps 101.As has been previously pointed out, it should be appreciated that not all of the aforementioned modules need be provided in every embodiment of the power strip.\",\n \"For example, only a single outlet module may be provided, or the USB and/or network modules may be left out of the configuration.\",\n \"Thus, depending on the customer's desire for the functionality of the device, certain modules may be excluded from the assembly, or certain modules may be included in numbers in excess of what has been shown in FIG.\",\n \"2, as in the case where a customer desires numerous outlet modules in addition to all the other modules.\",\n \"It should be readily appreciated that rail 102, as an extruded part, may be cut to any length and therefore may accommodate any number of modules as requested by the customer.\",\n \"The only limitation on the number of modules, and hence the overall length of rail 102 and relatedly the assembly 100 is that the maximum power that can be drawn by the combination of all of the modules in the power strip is 4000 Watts.\",\n \"As long as the combined modules draw less than the aforementioned maximum power, any combination of modules, and any length of rail 102 necessary to accommodate those modules may be used.\",\n \"Also shown in FIG.\",\n \"2 are module connectors 210.Module connectors 210 electrically connect the various modules in the power strip assembly together.\",\n \"Module connectors 210 mate with electrical contacts formed in the housings of the various modules (not shown) and thereby electrically connect two adjacent modules together.\",\n \"The structure of the module connectors 210 will be explained in greater detail with reference to FIG.\",\n \"5.Referring again to FIG.\",\n \"2, note that certain modules do not employ module connectors 210.As shown in FIG.\",\n \"2, USB module 160 and network module 170 use attached connectors 220 to electrically connect those modules to the previous component in the chain.\",\n \"Attached connectors 220 have essentially the same structure as module connectors 210 with the exception being that attached connectors 220 are permanently attached to the module that they connect to the previous component in the chain.\",\n \"One of ordinary skill will readily appreciate either module connectors 210 or attached connectors 220 could be used to electrically connect any or all of the modules in the power strip together, and the selection of either module connector 210 or attached connector 220 is simply a matter of preference or improvement of the manufacturability of the power strip.\",\n \"FIG.\",\n \"3 shows an isometric exploded view of an embodiment of the multi-function power strip 100.Like numbers will be used to designate components already described with respect to FIG.\",\n \"1.As can be seen in FIG.\",\n \"3, first endcap 101a and endcap 101 are provided, as is rail 102.Additionally, switch module 110, fuse module 120, first outlet module 130, second outlet module 140, transformer module 150, USB module 160 and network module 170 are provided.\",\n \"FIG.\",\n \"3 illustrates the manner in which the various modules engage with rail 102.As can be in FIG.\",\n \"3 all of the modules are provided with tabs 310.Tabs 310 slidably engage with groove 320 in rail 102, and thereby retain the modules in the rail.\",\n \"Endcaps 101 and 101a engage with the ends of rail 102, and have holes 330 provided therein for attachment means (not shown) to secure the endcaps 101, 101a to the rail 102.The modules can be slid into and out of engagement with rail easily for assembly and for disassembly in the event it becomes necessary to replace one of the modules.\",\n \"FIG.\",\n \"4 shows a block diagram showing the inter-relation of parts in an embodiment of the multi-function power strip.\",\n \"As shown in FIG.\",\n \"4, power source 400 is a standard household electrical power source and is the power input into the multi-function power strip.\",\n \"The electric power may then pass through components 410 which may be an on/off switch, a circuit breaker or a fuse.\",\n \"The electrical power may pass through a single one, two or all three of these components, depending on the configuration of the multi-function power strip.\",\n \"Electrical power may then pass through an optional timer or occupancy sensor 420.If component 420 is a timer module, it may be a standard programmable timer that is configured to permit the flow of electrical power to components down the chain for certain periods of the day, and to block the flow of electrical power to components down the chain for certain other periods of the day.\",\n \"Such timers are well known to those of skill in the art, as is their inclusion in a circuit of this type.\",\n \"If component 420 is an occupancy sensor module, it may contain an occupancy sensor adapted to detect the presence of a person in the area adjacent to the power strip and to turn off electrical power to components down the chain of the power strip when a person is not present in the area adjacent to the power strip.\",\n \"One of ordinary skill in the art will readily appreciate that any occupancy sensor switch suitable for use in the area around a power strip would be suitable for use as an occupancy sensor in occupancy sensor module 420.Occupancy sensor module 420 may operate by detecting infrared radiation in the area surrounding the power strip that is produced by the presence of a person.\",\n \"In operation, when occupancy sensor module 420 detects the presence of a person in the area surrounding the power, it allows the flow of electrical power to modules down the chain of the power strip.\",\n \"If the occupancy sensor does not detect the presence of a person in the area surrounding the power strip, it interrupts the flow of electrical power to the components down the chain.\",\n \"As shown in FIG.\",\n \"4, electrical power then passes into outlet modules 430, 440, 450 and 460.The dashed lines in FIG.\",\n \"4 show possible routes for the electrical power, showing that it may travel through one, two, three or all four of the outlet modules, depending on the configuration of the power strip.\",\n \"As shown in FIG.\",\n \"4, the outlet modules are all of different configurations, outlet module 430 is a United States configuration outlet; outlet module 440 is a European configuration outlet; outlet module 450 is a United Kingdom configuration outlet; and outlet module 460 is a Chinese configuration outlet.\",\n \"One of ordinary skill will appreciate that the outlet modules may all have different configurations as shown or they may all be of a single configuration, or they may be a combination of two or more configurations.\",\n \"Each of the outlet modules is configured so that electrical power may be transferred to a device plugged into the outlet module, and also that electrical power is transferred to the next component in the chain.\",\n \"From the last outlet module, electrical power is then flows into the transformer module 470.As discussed with respect to FIG.\",\n \"1, transformer module 470 steps down household electrical power to a plurality of voltages suitable for powering electronic accessories and outputs those voltages though a multi-pinned connector adapted to mate with a plurality of plugs and thereby supply the appropriate voltages to electronic accessories.\",\n \"Electrical power then flows into USB module 480.As shown in FIG.\",\n \"4, transformer module 470 may step household electrical power down to a 5V 2 A output for USB module 480.Alternatively, USB module 480 may contain a transformer which transforms electrical power into a voltage suitable for use in USB module 480.In such an embodiment, household electrical power would flow from transformer module 470 to USB module 480.USB module 480 may receive data from and transmit data to a personal computer or other device in the case where USB module 480 acts as a USB hub.\",\n \"USB module 480 may provide a source of power to network module 490.Network module 490 may act as a pass-through surge suppressor or network cables, phone cables or other data feeds.\",\n \"Alternatively, network module 490 may act as a network switch and may receive data from and transmit data to a personal computer or other device.\",\n \"FIG.\",\n \"5 shows a side perspective view of the module connector and module used in an embodiment of the multi-function power strip.\",\n \"Shown in FIG.\",\n \"5 is a switch module 110 with tabs 310 (as described with reference to FIG.\",\n \"3), however, as set forth in the description of FIG.\",\n \"2, module connectors 210 can be used with any of the modules described in the various embodiments of the multi-function power strip.\",\n \"Module connector 210 has a body 500 with a first end 500a.\",\n \"The opposite end of body 500 (not shown) is a mirror image of first end 500a.\",\n \"Body 500 of module connector 210 can be fabricated from any suitable material known in the art, for example, plastic.\",\n \"Apertures 510 are provided in first end body 500a and extend all the way through the body to the opposite end (not shown).\",\n \"In such a way, the body 500 has a hollow interior formed by the apertures 510.Three apertures 510 are shown in FIG.\",\n \"5, however, it should be apparent to one of ordinary skill in the art that any number of apertures could be used, depending on the number of connections that must be made between the modules.\",\n \"By way of example and without limitation, the three apertures shown in FIG.\",\n \"5 may accommodate positive, negative and ground connections between modules.\",\n \"In applications where an additional number of connections are required, as for example in cases where data or transformed voltages are also to be transferred between modules, more apertures may be provided.\",\n \"Body 500 may also be provided with an alignment boss 512.Alignment boss 512 mates with alignment groove 513 on the module.\",\n \"Alignment boss 512 and alignment groove 513 ensure that the module connector 210 and the module are connected in the appropriate orientation.\",\n \"Disposed within the apertures 510 are contacts 511.Similar contacts (not shown) are disposed on the opposite end of body 500 (not shown).\",\n \"The contacts 511 may be made from copper or any material suitable for conducting electricity.\",\n \"The contacts 511 mate with and form an electrical connection with the blades 514 disposed on the module.\",\n \"The contacts 511, and the similar contacts (not shown) on the opposite end of body 500 are electrically connected.\",\n \"The similar contacts (not shown) on the opposite end of body 500 are likewise adapted to mate with blades (not shown) on an adjacent module.\",\n \"In this way, the contacts in the module connector 210 form an electrical connection between two adjacent modules.\",\n \"It, will be appreciated by those of ordinary skill in the art that, while the forgoing disclosure has been set forth in connection with particular embodiments and examples, the disclosure is not intended to be necessarily so limited, and that numerous other embodiments, examples, uses, modifications and departures from the embodiments, examples and uses described herein are intended to be encompassed by the claims attached hereto.\",\n \"Various features of the disclosure are set forth in the following claims.\"\n ]\n]"},"source":{"kind":"string","value":"Patent_15871413"}}},{"rowIdx":4493786,"cells":{"text":{"kind":"list like","value":[["SEMICONDUCTOR DEVICES AND METHODS OF MAKING THE SAME","In one embodiment, methods for making semiconductor devices are disclosed."],["1.A method for making a semiconductor device, the method comprising: providing a conductive substrate, the conductive substrate comprising one or more elevated regions on a first side of the conductive substrate, wherein each of the elevated regions comprises a planar surface on the first side of the conductive substrate; disposing a solder paste between at least one of the planar surfaces on the elevated regions on the conductive substrate and one or more contact pads of a semiconductor die such that each of the contacts pads has two or more linear edges that are each laterally aligned and parallel with at least one edge of the planar surfaces on the elevated regions; and reflowing the solder paste to solder at least a portion of the elevated regions to the contact pads.","2.The method of claim 1, wherein disposing the solder paste between at least one of the planar surfaces on the elevated regions on the conductive substrate and the one or more contact pads of the semiconductor die comprises disposing the solder paste between two or more planar surfaces on the elevated regions on the conductive substrate and the one or more contact pads.","3.The method of claim 1, wherein a number of the elevated regions on the first side of the conductive substrate is greater than a number of the elevated regions soldered to the contact pads of the semiconductor die.","4.The method of claim 1, wherein a number of the elevated regions on the first side of the conductive substrate is at least 10.5.The method of claim 1, wherein a number of the elevated regions on the first side of the conductive substrate is at least two, and wherein at least a portion of the elevated regions on the first side of the conductive substrate have different sizes.","6.The method of claim 1, wherein a number of the elevated regions on the first side of the conductive substrate is at least two, and wherein the elevated regions are evenly spaced along a first direction.","7.The method of claim 1, wherein providing the conductive substrate comprises providing a lead frame comprising the conductive substrate electrically coupled to a first lead.","8.The method of claim 1, wherein the elevated regions on the first side of the conductive substrate are arranged in a grid having rows and columns, each of the rows having the same number of elevated regions and each of the columns having the same number of elevated regions.","9.The method of claim 1, wherein the semiconductor die is a metal-oxide field-effect transistor (MOSFET).","10.A method for making a semiconductor device, the method comprising: providing a conductive substrate, the conductive substrate comprising a first elevated region on a first side of the conductive substrate and a second elevated region on the first side of the conductive substrate, wherein the first elevated region comprises a first planar surface on the first side of the conductive substrate, and wherein the second elevated region comprises a second planar surface on the first side of the conductive substrate; and attaching at least the first planar surface of the first elevated region to a first contact pad of a semiconductor die such that the conductive substrate is electrically coupled to the contact pad, wherein at least a portion of the second planar surface on the second elevated region is not attached to any contact pad of the semiconductor die.","11.The method of claim 10, wherein the first planar surface of the first elevated region has a first corner that is laterally aligned with a first corner of the first contact pad.","12.The method of claim 10, wherein the first planar surface of the first elevated region has different dimensions than the second planar surface of the second elevated region.","13.The method of claim 10, wherein the conductive substrate comprises at least 10 elevated regions.","14.The method of claim 10, wherein the semiconductor die is a metal-oxide field-effect transistor (MOSFET).","15.The method of claim 10, wherein the second planar surface of the second elevated region is not attached to the semiconductor die.","16.The method of claim 10, wherein only a portion of the second planar surface of the second elevated region is attached to the first contact pad of the semiconductor die, and wherein the second planar surface of the second elevated region is electrically coupled to the first contact pad of the semiconductor die.","17.The method of claim 10, wherein the first planar surface comprises a curved edge, and wherein the second planar surface has a polygonal shape.","18.The method of claim 10, wherein a first portion of the second planar surface of the second elevated region is attached to the first contact pad of the semiconductor die, and a second portion of the second planar surface of the second elevated region is attached to a second contact pad of the semiconductor die.","19.The method of claim 10, wherein the second planar surface of the second elevated region is laterally positioned away from a footprint of the semiconductor die.","20.A method for making semiconductor devices, the method comprising: providing a first conductive substrate, the first conductive substrate comprising one or more elevated regions on a first side of the first conductive substrate, wherein each of the one or more elevated regions of the first conductive substrate comprises a planar surface on the first side of the first conductive substrate; providing a second conductive substrate, the second conductive substrate comprising one or more elevated regions on a first side of the second conductive substrate, wherein each of the one or more elevated regions of the second conductive substrate comprises a planar surface on the first side of the second conductive substrate, wherein the first conductive substrate has substantially the same structure as the second conductive substrate; attaching one or more contact pads of a first semiconductor die to at least one of said one or more elevated regions on the first side of the first conductive substrate; and attaching one or more contact pads of a second semiconductor die to at least one of said one or more elevated regions on the first side of the second conductive substrate, wherein said one or more contact pads of the first semiconductor die have a different configuration than said one or more contact pads of the second semiconductor die."],[" BACKGROUND The present application relates, in general, to electronics, and more particularly, to methods of forming packaging structure for semiconductor devices.","The semiconductor industry typically utilizes various methods and structures to form packages that encapsulate a semiconductor die and provide leads for electrically connecting to the semiconductor die.","In one type of semiconductor package, the semiconductor die is mounted between a lead frame and a clip.","The lower lead frame has a continuous flat surface on which the die is mounted then a clip is used to complete the electrical circuit on the top of the die.","This configuration may provide inaccurate positioning of the semiconductor die to the lower lead frame.","In addition, the same inaccurate positioning can occur with the clip.","During mounting of both the die and clip, solder paste is typically used between the die to lead frame and clip to die.","During reflow, both the die and clip may move, drift, tilt, and/or rotate, which can lower the quality and performance of the semiconductor device.","Accordingly, it is desirable to have techniques for mounting a semiconductor die that can reduce or eliminate drifting, tilting, or rotation.","It is also desirable to have techniques for mounting different semiconductor dies using the same lead frame design."],[" BRIEF DESCRIPTION OF THE DRAWINGS Embodiments of present application will become more fully understood from the detailed description and the accompanying drawings, which are not intended to limit the scope of the present application.","FIG.","1A is a perspective view illustrating one example of a lead frame in accordance with some embodiments of the present application.","FIG.","1B is a top view one example of a lead frame in accordance with some embodiments of the present application.","FIG.","1C is a cross-sectional view of source contact pad of a lead frame in accordance with some embodiments of the present application.","FIGS.","2A and 2B are bottom and top views, respectively, illustrating one example of semiconductor die 200 in accordance with some embodiments of the present application.","FIG.","3A is a top view illustrating one example of semiconductor die 200 positioned on lead frame 100 in accordance with some embodiments of the present application.","FIG.","3B is a cross-sectional view illustrating semiconductor die 200 positioned on lead frame 100 in accordance with some embodiments of the present application.","FIG.","3C is a cross-sectional view illustrating semiconductor die 200 positioned on lead frame 100 which is orthogonal to the cross-sectional view in FIG.","3B in accordance with some embodiments of the present application.","FIG.","4 is a perspective view illustrating one example of semiconductor device 400 in accordance with some embodiments of the present application.","FIG.","5A is a bottom view showing one example of universal conductive clip 500 including a plurality of pedestals 510 that extend towards semiconductor die 520 in accordance with some embodiments of the present application.","FIG.","5B is a bottom view of one example of semiconductor die 521 soldered to universal conductive clip 500 in accordance with some embodiments of the present application.","FIG.","5C is a bottom view of one example of semiconductor die 522 soldered to universal conductive clip 500 in accordance with some embodiments of the present application.","FIG.","5D is a bottom view of one example of semiconductor die 523 soldered to universal conductive clip 500 in accordance with some embodiments of the present application.","FIG.","5E is a bottom view of one example of semiconductor die 524 soldered to universal conductive clip 500 in accordance with some embodiments of the present application.","FIG.","5F is a bottom view of one example of semiconductor die 525 soldered to universal conductive clip 500 in accordance with some embodiments of the present application.","FIG.","5G is a bottom view of one example of semiconductor die 526 soldered to universal conductive clip 500 in accordance with some embodiments of the present application.","FIG.","5H is a bottom view of one example of semiconductor die 527 soldered to universal conductive clip 500 in accordance with some embodiments of the present application.","FIG.","5I is a bottom view of one example of semiconductor die 528 soldered to universal conductive clip 500 in accordance with some embodiments of the present application.","FIG.","5J is a bottom view of one example of semiconductor die 529 soldered to universal conductive clip 500 in accordance with some embodiments of the present application.","FIG.","6 shows examples of the design considerations when configuring a universal conductive clip for family of semiconductor dies in accordance with some embodiments of the present application.","detailed-description description=\"Detailed Description\" end=\"lead\"?","For simplicity and clarity of the illustration, elements in the figures are not necessarily to scale, and the same reference numbers in different figures denote the same elements.","Additionally, descriptions and details of well-known steps and elements are omitted for simplicity of the description.","As used herein current carrying electrode means an element of a device that carries current through the device such as a source or a drain of an MOS transistor or an emitter or a collector of a bipolar transistor or a cathode or anode of a diode, and a control electrode means an element of the device that controls current through the device such as a gate of an MOS transistor or a base of a bipolar transistor.","Although the devices are explained herein as certain N-channel or P-Channel devices, or certain N-type of P-type doped regions, a person of ordinary skill in the art will appreciate that complementary devices are also possible in accordance with the present invention.","It will be appreciated by those skilled in the art that the words during, while, and when as used herein are not exact terms that mean an action takes place instantly upon an initiating action but that there may be some small but reasonable delay, such as a propagation delay, between the reaction that is initiated by the initial action.","The use of the word approximately or substantially means that a value of element has a parameter that is expected to be very close to a stated value or position.","However, as is well known in the art there are always minor variances that prevent the values or positions from being exactly as stated.","It is well established in the art that variances of up to about ten percent (10%) (and up to twenty percent (20%) for semiconductor doping concentrations) are regarded as reasonable variances from the ideal goal of exactly as described.","For clarity of the drawings, doped regions of device structures are illustrated as having generally straight line edges and precise angular corners.","However, those skilled in the art understand that due to the diffusion and activation of dopants the edges of doped regions generally may not be straight lines and the corners may not be precise angles."],["CROSS-REFERENCE TO RELATED APPLICATION This application is a continuation of U.S. application Ser.","No.","15/421,515, filed Feb. 1, 2017, which is a continuation of U.S. application Ser.","No.","15/204,117, filed Jul.","7, 2016, now U.S. Pat.","No.","9,576,883, which is a continuation of U.S. application Ser.","No.","14/729,234, filed Jun.","3, 2015, now U.S. Pat.","No.","9,397,028, which is a continuation of U.S. application Ser.","No.","13/834,612, filed Mar.","15, 2013, now U.S. Pat.","No.","9,070,721, which are hereby incorporated by reference in their entirety.","BACKGROUND The present application relates, in general, to electronics, and more particularly, to methods of forming packaging structure for semiconductor devices.","The semiconductor industry typically utilizes various methods and structures to form packages that encapsulate a semiconductor die and provide leads for electrically connecting to the semiconductor die.","In one type of semiconductor package, the semiconductor die is mounted between a lead frame and a clip.","The lower lead frame has a continuous flat surface on which the die is mounted then a clip is used to complete the electrical circuit on the top of the die.","This configuration may provide inaccurate positioning of the semiconductor die to the lower lead frame.","In addition, the same inaccurate positioning can occur with the clip.","During mounting of both the die and clip, solder paste is typically used between the die to lead frame and clip to die.","During reflow, both the die and clip may move, drift, tilt, and/or rotate, which can lower the quality and performance of the semiconductor device.","Accordingly, it is desirable to have techniques for mounting a semiconductor die that can reduce or eliminate drifting, tilting, or rotation.","It is also desirable to have techniques for mounting different semiconductor dies using the same lead frame design.","BRIEF DESCRIPTION OF THE DRAWINGS Embodiments of present application will become more fully understood from the detailed description and the accompanying drawings, which are not intended to limit the scope of the present application.","FIG.","1A is a perspective view illustrating one example of a lead frame in accordance with some embodiments of the present application.","FIG.","1B is a top view one example of a lead frame in accordance with some embodiments of the present application.","FIG.","1C is a cross-sectional view of source contact pad of a lead frame in accordance with some embodiments of the present application.","FIGS.","2A and 2B are bottom and top views, respectively, illustrating one example of semiconductor die 200 in accordance with some embodiments of the present application.","FIG.","3A is a top view illustrating one example of semiconductor die 200 positioned on lead frame 100 in accordance with some embodiments of the present application.","FIG.","3B is a cross-sectional view illustrating semiconductor die 200 positioned on lead frame 100 in accordance with some embodiments of the present application.","FIG.","3C is a cross-sectional view illustrating semiconductor die 200 positioned on lead frame 100 which is orthogonal to the cross-sectional view in FIG.","3B in accordance with some embodiments of the present application.","FIG.","4 is a perspective view illustrating one example of semiconductor device 400 in accordance with some embodiments of the present application.","FIG.","5A is a bottom view showing one example of universal conductive clip 500 including a plurality of pedestals 510 that extend towards semiconductor die 520 in accordance with some embodiments of the present application.","FIG.","5B is a bottom view of one example of semiconductor die 521 soldered to universal conductive clip 500 in accordance with some embodiments of the present application.","FIG.","5C is a bottom view of one example of semiconductor die 522 soldered to universal conductive clip 500 in accordance with some embodiments of the present application.","FIG.","5D is a bottom view of one example of semiconductor die 523 soldered to universal conductive clip 500 in accordance with some embodiments of the present application.","FIG.","5E is a bottom view of one example of semiconductor die 524 soldered to universal conductive clip 500 in accordance with some embodiments of the present application.","FIG.","5F is a bottom view of one example of semiconductor die 525 soldered to universal conductive clip 500 in accordance with some embodiments of the present application.","FIG.","5G is a bottom view of one example of semiconductor die 526 soldered to universal conductive clip 500 in accordance with some embodiments of the present application.","FIG.","5H is a bottom view of one example of semiconductor die 527 soldered to universal conductive clip 500 in accordance with some embodiments of the present application.","FIG.","5I is a bottom view of one example of semiconductor die 528 soldered to universal conductive clip 500 in accordance with some embodiments of the present application.","FIG.","5J is a bottom view of one example of semiconductor die 529 soldered to universal conductive clip 500 in accordance with some embodiments of the present application.","FIG.","6 shows examples of the design considerations when configuring a universal conductive clip for family of semiconductor dies in accordance with some embodiments of the present application.","For simplicity and clarity of the illustration, elements in the figures are not necessarily to scale, and the same reference numbers in different figures denote the same elements.","Additionally, descriptions and details of well-known steps and elements are omitted for simplicity of the description.","As used herein current carrying electrode means an element of a device that carries current through the device such as a source or a drain of an MOS transistor or an emitter or a collector of a bipolar transistor or a cathode or anode of a diode, and a control electrode means an element of the device that controls current through the device such as a gate of an MOS transistor or a base of a bipolar transistor.","Although the devices are explained herein as certain N-channel or P-Channel devices, or certain N-type of P-type doped regions, a person of ordinary skill in the art will appreciate that complementary devices are also possible in accordance with the present invention.","It will be appreciated by those skilled in the art that the words during, while, and when as used herein are not exact terms that mean an action takes place instantly upon an initiating action but that there may be some small but reasonable delay, such as a propagation delay, between the reaction that is initiated by the initial action.","The use of the word approximately or substantially means that a value of element has a parameter that is expected to be very close to a stated value or position.","However, as is well known in the art there are always minor variances that prevent the values or positions from being exactly as stated.","It is well established in the art that variances of up to about ten percent (10%) (and up to twenty percent (20%) for semiconductor doping concentrations) are regarded as reasonable variances from the ideal goal of exactly as described.","For clarity of the drawings, doped regions of device structures are illustrated as having generally straight line edges and precise angular corners.","However, those skilled in the art understand that due to the diffusion and activation of dopants the edges of doped regions generally may not be straight lines and the corners may not be precise angles.","DETAILED DESCRIPTION The following description of embodiment(s) is merely illustrative in nature and is in no way intended to limit the invention, its application, or uses.","The present application includes, among other things, a method of making a semiconductor device including: providing a conductive substrate, the conductive substrate comprising one or more elevated regions on a first side of the conductive substrate, wherein each of the elevated regions comprises a planar surface on the first side of the conductive substrate; disposing a solder paste between at least one of the planar surfaces on the elevated regions on the conductive substrate and one or more contact pads of a semiconductor die such that each of the contacts pads has three or more linear edges that are each laterally aligned and parallel with at least one edge of the planar surfaces on the elevated regions; and reflowing the solder paste to solder at least a portion of the elevated regions to the contact pads.","FIG.","1A is a perspective view illustrating one example of lead frame 100 in accordance with some embodiments of the present application.","Lead frame 100 includes source contact 110, gate contact 120, and drain contact 130.Source contact 110 includes pedestals 140 (also referred to as standoffs or elevated regions) disposed on one side of source contact 110.Lead frame 100 may be formed, for example, by etching or stamping a copper or copper-alloy sheet.","FIG.","1B is a top view of lead frame 100.It will be appreciated that during typical packaging processes, the lead frame and its various contacts (e.g., source contact 110) may be interconnected in an array of lead frames that can be singulated into individual packages during processing.","The dashed line in FIG.","1B depicts cuttings lines where lead frame 100 can be separated using standard techniques, such as dicing or punching.","FIG.","1C is a cross-sectional view of source contact pad 110 in lead frame 100.Pedestals 140 can be isolated by trenches 150 between pedestals 140.Pedestals 140 each have planar surfaces on the same side of lead frame 100.As discussed further below, the pedestals can be configured to align with contact pads on a semiconductor die.","The height of the pedestals (e.g., pedestals 140) can be, in some embodiments, at least about 30% of a thickness of the contact.","For example, the source contact may be formed from a copper sheet having a thickness of about 10 mils, and therefore the height of the pedestals can be at least about 3 mils.","In some embodiments, the pedestals can have a height of at least about 50% of a thickness of the contact.","In some embodiments, the pedestals can, in some embodiments, have a height of at least about 3 mils or at least about 5 mils.","The distance between the pedestals (e.g., the width of trenches 150) can be, in some embodiments, at least about the height of the pedestals.","In some embodiments, the distance between the pedestals can be at least about 30% of a thickness of the contact or at least about 50% of a thickness of the contact.","The distance between the pedestals can be, for example, at least about 3 mils or at least about 5 mils.","The shape of the pedestals is not particularly limited.","The top surface of the pedestals may, for example, have a polygonal surface, such as a square, a rectangle, or a triangle.","In some embodiments, the top surface of each of the pedestals can include at least one linear edge (e.g., one, two, three, four or more linear edges).","For example, as shown in FIG.","1B pedestals 140 can be rectangular having four linear edges.","The pedestals may also include at least one curved edge, for example, to accommodate an adjacent gate contact.","FIGS.","2A and 2B are bottom and top views, respectively, illustrating one example of semiconductor die 200 in accordance with some embodiments of the present application.","Semiconductor die 200 includes source contact pads 210 and gate contact pad 220 on one side.","Semiconductor die 200 also includes drain contact pad 230 on a side of semiconductor die 200 opposite source contact pads 210.Semiconductor die 200 may be configured, for example, as a MOSFET.","Source contact pads 210 can be configured so that each of the contact pads can be soldered to a pedestal on a source contact of a lead frame (e.g., pedestals 140 on source contact 110 of lead frame 100).","For example, each of source contact pads 210 may have the same shape and dimensions as a corresponding pedestal in pedestals 140 on source contact 110.Semiconductor die 200 may have the bottom surface placed over lead frame 100 such that each of source contact pads 210 align with one of pedestals 140.Similarly, gate contact pad 210 on semiconductor die 200 may align with gate contact 120 of lead frame 100.FIG.","3A shows a top view illustrating one example of semiconductor die 200 positioned on lead frame 100 in accordance with some embodiments of the present application.","Semiconductor die 200 is shown with dashed lines and is positioned over lead frame 100 so that source contact pads 210 can be aligned over pedestals 140.Each of the pedestals from pedestals 140 include four linear edges that are laterally aligned and parallel with four linear edges of each contact pad in contact pads 210.","(The right-most pedestal of pedestals 140 also includes a curved edge that is laterally aligned with a curved edge of the right-most source contact pad of source contact pads 210.)","Gate contact pad 220 is also aligned over gate contact 120.The pedestals can be soldered to the source contact pads to electrically couple source contact 110 to source contact pads 220.FIG.","3B show a cross-sectional view illustrating semiconductor die 200 positioned on lead frame 100 in accordance with some embodiments of the present application.","Solder paste 300 can be disposed between each of contact source pads 220 and pedestals 140.The solder paste may be applied such that trenches 150 are substantially free of solder paste.","For example, solder paste 300 can be selectively applied to pedestals 140 before positioning semiconductor die 200 on lead frame 100 so that solder paste 300 is sandwiched between source contact pads 210 and pedestals 140.Solder paste may similarly be disposed between gate contact pad 220 and gate contact 120.The amount of solder paste applied between the pedestals and the contact pads is not particularly limited.","Generally, the amount of solder paste applied is effective to electrically couple the contact pad to the conductive surface (e.g., the lead frame) and also effective such that the solder paste does not bridge between the pedestals during reflow.","In some embodiments, the solder paste is evenly applied as a layer to the portions of the pedestal or contact pad to be soldered during reflow.","In some embodiments, the solder paste is applied as a layer having a thickness about 0.003 inches to about 0.006 inches.","Pedestals 140 can be soldered to source contact pads 210 by heating the semiconductor die and lead frame to perform reflow.","In some embodiments, during reflow, the solder paste is maintained between the pedestals and the contact pads.","That is, the solder paste does not flow into the trenches surrounding the pedestals.","Similarly, the separate layers of solder paste disposed between each pair of contact pad and pedestal can remain spaced apart during reflow.","In other words, layers of solder paste do not flow into a trench adjacent to both of the layers such that the solder paste from separate layers contact each other.","Applicants have discovered that by soldering the pedestals to the contact pads, drifting, tilting, or rotation during reflow can be reduced or eliminated.","Without being bound to any particular theory, it is believed that, by aligning edges of the pedestals with edges of the contact pads, the solder's surface tension and wet adhesion properties during reflow can maintain the pedestals aligned with the contact pads.","This in turn limits or prevents the semiconductor die from rotating, tilting, or drifting during reflow.","Accordingly, in some embodiments, each contact pad that is soldered to a pedestal will have two or more linear edges that are each laterally aligned and parallel with a linear of edge of a pedestal that is soldered to the contact pad.","In some embodiments, each contact pad that is soldered to a pedestal will have three or more linear edges that are each laterally aligned and parallel with a linear of edge of a pedestal that is soldered to the contact pad.","In some embodiments, each contact pad that is soldered to a pedestal will have four or more linear edges that are each laterally aligned and parallel with a linear of edge of a pedestal that is soldered to the contact pad.","In some embodiments, each contact pad that is soldered to a pedestal will have two or more corners that are each laterally aligned with a corner of a pedestal that is soldered to the contact pad.","In some embodiments, each contact pad that is soldered to a pedestal will have three or more corners that are each laterally aligned with a corner of a pedestal that is soldered to the contact pad.","In some embodiments, each contact pad that is soldered to a pedestal will have four or more corners that are each laterally aligned with a corner of a pedestal that is soldered to the contact pad.","As will be discussed further below, a single contact pad may optionally be soldered to two or more pedestals (e.g., two, three, four, five, six, or more pedestals).","Thus, different linear edges of the same contact pad can be laterally aligned and parallel to edges of different pedestals.","As an example, a rectangular contact pad can be soldered to two square pedestals.","The rectangular contact pad may have two linear edges that are laterally aligned and parallel with two linear edges of the first square pedestal.","The other two linear edges of the rectangular contact pad can be laterally aligned and parallel with two linear edges of the second square pedestal.","Thus, in this specific example, all four linear edges of the rectangular contact pad are laterally aligned and parallel with linear edges found in two different pedestals.","Moreover, each of the square pedestals includes two linear edges that are not laterally aligned with a linear edge of the rectangular contact pad.","This example configuration may provide suitable adhesion to prevent drifting, tilting, or rotation during reflow.","In some embodiments, at least two contact pads are each separately soldered to two or more pedestals.","For example, a first contact pad (e.g., a source contact pad) of a semiconductor die can be soldered to a first pedestal of a contact (e.g., a source contact) on a lead frame and a second pedestal of the contact on the lead frame, and a second contact pad of the semiconductor die can be soldered to a third pedestal of the contact on the lead frame and a fourth pedestal of the contact on the lead frame.","Drain contact pad 230 on semiconductor die 200 may be electrically coupled to drain contacts 130 on lead frame 100 using various techniques.","For example, drain contact pad 230 can be wire bonded to drain contacts 130.In some embodiments, drain contact pad 230 can be electrically coupled to drain contacts 130 by a conductive clip.","The conductive clip may be soldered to both drain contact pad 230 and drain contacts 130.FIG.","3C is a cross-sectional view illustrating semiconductor die 200 positioned between lead frame 100 and conductive clip 310.The cross-sectional view in FIG.","3C is orthogonal to the cross-sectional view in FIG.","3B.","The bottom face of conductive clip 310 can be soldered to drain contact pad 230 using solder paste 320.Conductive clip 310 has a U-shaped configuration such that both ends can be soldered to drain contacts 130 in lead frame 100 using solder paste 330.By soldering conductive clip 310 to both drain contacts 130 and drain contact pad 230, drain contact 130 can be electrically coupled to drain contact pad 230.As shown in FIG.","3C, gate contact 120 can be soldered to gate contact pad 210 using solder paste 340.Gate contact 120 may be soldered to gate contact pad 210 at about the same time as performing reflow to solder source contact pad 220 to source contact 110.The conductive clip can be soldered to the contact pad (e.g., a gate contact pad) and contact on the lead frame (e.g., a gate contact) using generally the same techniques as described above.","For example, solder paste can be applied to the gate contact pad and gate contacts, and then the conductive clip can positioned to contact the solder paste before performing reflow.","The reflow for soldering the conductive clip may be performed before, after, or at about the same time as performing reflow to solder the semiconductor die to the lead frame.","As discussed above, the pedestals on the lead frame can reduce or prevent drifting, tilting, or rotation during reflow.","The pedestals may also be used to prevent or reduce drifting, tilting, or rotation when soldering any conductive substrate (e.g., a conductive clip or a lead frame) to a contact pad on a semiconductor die.","FIG.","4 is a perspective view illustrating one example of semiconductor device 400 in accordance with some embodiments of the present application.","Semiconductor device 400 can include source contact 410 soldered to conductive clip 420.Conductive clip 420 has pedestals 425 which extend from the side of conductive clip 420 that faces semiconductor die 430.Pedestals 425 can be soldered to source contact pads 435 on semiconductor die 430 such that source contact 410 is electrically coupled to source contact pads 435.As shown, four linear edges of the contact pads that are soldered to the pedestals are each laterally aligned and parallel with a linear of edge of a pedestal that is soldered to the contact pad.","The pedestals on the conductive clip may therefore reduce or prevent drifting, tilting, or rotation during reflow.","Drain contact 440 can be soldered to drain contact pads (not shown) on a side of semiconductor die 430 opposite source contact pads 435.Gate contact 450 is soldered to conductive clip 460.Gate contact pad 470 on semiconductor die 430 is also soldered to conductive clip 460 such that gate contact 470 is electrically coupled to gate contact pad 470.The pedestals on a conductive substrate (e.g., pedestals 425 on conductive clip 420) can generally have the same characteristics as discussed above with regard to pedestals on a lead frame (e.g., pedestals 140 on lead frame 100).","For example, the height of the pedestals may be about half of the thickness of the conductive clip.","As another example, the number of pedestals on the conductive substrate is not limited, and may be, for example, one or more pedestals (e.g., one, two, three, four, five, ten, fifteen, twenty, or more pedestals on the conductive substrate).","In some embodiments, at least one contact pad (e.g., one, two, three, four, or more contact pads) on the semiconductor die is soldered to two or more pedestals (e.g., two, three, four, five, or more pedestals) on the conductive substrate.","Semiconductor device 400 may generally be assembled using the same techniques as described above.","Solder paste can be applied to the drain contact and then the drain contact is soldered to the drain contact pad on the semiconductor die by performing reflow.","Solder paste may then be applied to the source contact pad, gate contact pad, source contact, and gate contact before positioning the conductive clips over the semiconductor die and lead frame.","Reflow can be performed to solder the conductive clip.","In some embodiments, the semiconductor die's contact pads are soldered to the lead frame and conductive clips at about the same time.","The semiconductor devices disclosed in the present application (e.g., semiconductor device 400) may be at least partially encapsulated in a molding material (e.g., a resin).","In some embodiments, the molding material can fill the trenches between the pedestals.","Portions of the lead frame and/or conductive clip may be exposed for electrically coupling the semiconductor die to, for example, a printed circuit board.","Some embodiments disclosed herein relate to a conductive substrate that is configured to operably couple with two or more different semiconductor die designs (e.g., two, three, four, five, or more semiconductor die designs).","Typically, each lead frame or conductive clip is customized for soldering to a specific semiconductor die design.","Thus, each semiconductor die design requires a different lead frame design that must be manufactured or stocked at manufacturing facilities.","The present application includes a universal lead frame and/or universal conductive clip that may be used with various kinds of semiconductor die designs.","This may reduce the number of different lead frames that must be manufactured or stocked at manufacturing facilities.","FIGS.","5A-J are bottom views illustrating one example of universal conductive clip 500 soldered to various semiconductor dies in accordance with some embodiments of the present application.","Referring to FIG.","5A, universal conductive clip 500 includes a plurality of pedestals 510 that extend towards semiconductor die 520.Semiconductor die 520 has contact pads 530 on one side that are each soldered to two or more pedestals of pedestals 510.The upper-left contact pad is soldered to two pedestals.","The upper-left contact pad has two linear edges that are each laterally aligned and parallel with an edge on the upper-left pedestal that is soldered to the upper-left contact pad.","The upper-left contact pad and upper-left pedestal each have curved edges that are laterally aligned.","The curved edges are shaped to accommodate contact pad 540 which can be electrically coupled to a separate conductive clip (not shown).","The upper-left contact pad is also soldered to a second pedestal below the upper-left pedestal.","Only a portion of the top surface of the second pedestal is soldered to the upper-left contact pad.","Two edges of the second pedestal are each laterally aligned and parallel with an edge of the upper-left contact pad.","During manufacturing, solder paste can be selectively applied to the top surface of the second pedestal (and any other pedestal having only a portion of the top surface soldered to a contact pad) at portions that will contact a contact pad.","Each of contact pads 530 in FIG.","5A have two or more edges that are each laterally aligned and parallel with an edge of a pedestal.","The number of pedestals soldered to each contact pad varies: the upper-left and lower-left contact pads are each soldered to two pedestals, the upper-right and lower-right contact pads are each soldered to four pedestals.","Each of the contact pads has only a portion of their surface area soldered to the pedestals.","The portions of the contact pads disposed over trenches between the pedestal can, in some embodiments, be unsoldered.","The total surface area of each contact pad that is soldered to a pedestal can be, for example, at least about 40%, at least about 50%, at least about 75%, or at least about 90%.","The total surface area of each contact pad that is soldered to a pedestal can be, for example, no more than about 100%, no more than about 95%, no more than about 90%, no more than about 80%, or no more than about 70%.","In some embodiments, the total surface area of each contact pad that is soldered to a pedestal is about 40% to about 100%, or about 50% to about 95%.","Eight of the pedestals in pedestals 510 depicted in FIG.","5A are not soldered to a contact pad.","As will be discussed further below, these unsoldered pedestals are designed for a different semiconductor die.","Four of the pedestals are laterally positioned away from the footprint of semiconductor die 520.In other words, four of the pedestals are not covered by semiconductor die 520.Another four of the pedestals are only partially covered by semiconductor die 520.FIG.","5B shows semiconductor die 521 soldered to universal conductive clip 500.Semiconductor die 521 has a different footprint and contact pad configuration relative to semiconductor die 520.However, contact pad 540 (e.g., a gate contact pad) has the same configuration in both semiconductor dies.","Each of contact pads 531 are soldered to four pedestals of pedestals 510.As shown, each of contact pads 531 have four edges that are each laterally aligned and parallel with edges on the pedestals soldered to the contact pads.","Each of the eight pedestals that are soldered have their entire top surface soldered to the contact pads.","Twelve pedestals remain unsoldered to semiconductor die 531: ten are uncovered by the footprint of semiconductor die 531, while two are partially covered by the footprint of semiconductor die 531.FIG.","5C shows semiconductor die 522 soldered to universal conductive clip 500.Semiconductor die 522 has a different footprint and contact pad configuration.","However, contact pad 540 (e.g., a gate contact pad) has the same configuration relative to semiconductor die 520.The left contact pad of contact pads 532 is soldered to two pedestals of pedestals 510.The right contact pad of contact pads 532 is soldered to four pedestals of pedestals 510.The pedestals soldered to the left contact pad have their entire top surface soldered to the left contact pad.","Two of the pedestals soldered to the right contact pad have only a portion of their top surface soldered to the right contact pad.","Two of the pedestals soldered to the right contact pad have their entire top surface soldered to the right contact pad.","Fourteen pedestals remain unsoldered to semiconductor die 522: twelve are uncovered by the footprint of semiconductor die 522, while two are partially covered by the footprint of semiconductor die 522.FIG.","5D shows semiconductor die 523 soldered to universal conductive clip 500.Semiconductor die 523 has a different footprint and contact pad configuration.","However, contact pad 540 (e.g., a gate contact pad) has the same configuration relative to semiconductor die 520.The left-most contact pad of contact pads 533 is soldered to six pedestals of pedestals 510.The pedestals soldered to the left-most contact pad have their entire top surface soldered to the left-most contact pad.","The right-most contact pad of contact pads 533 is soldered to four pedestals of pedestals 510.Two of the pedestals soldered to the right-most contact pad have their entire top surface soldered to the right-most contact pad.","Two of the pedestals soldered to the right-most contact pad have only a portion of their top surface soldered to the right-most contact pad.","Fourteen pedestals remain unsoldered to semiconductor die 523: twelve are uncovered by the footprint of semiconductor die 523, while two are partially covered by the footprint of semiconductor die 523.FIG.","5E shows semiconductor die 524 soldered to universal conductive clip 500.Semiconductor die 524 has a different footprint and contact pad configuration.","However, contact pad 540 (e.g., a gate contact pad) has the same configuration relative to semiconductor die 520.Semiconductor die 524 has two contact pads in contact pads 534 which are each soldered to four pedestals.","FIG.","5F shows semiconductor die 525 soldered to universal conductive clip 500.Semiconductor die 525 has a different footprint and contact pad configuration.","However, contact pad 540 (e.g., a gate contact pad) has the same configuration relative to semiconductor die 520.Semiconductor die 525 has three contact pads in contact pads 534.All twenty of pedestals 510 are soldered to contact pads 535.In some embodiments, semiconductor die 535 may be the largest semiconductor die that can be accommodated on universal conductive clip 500.FIG.","5G shows semiconductor die 526 soldered to universal conductive clip 500.Semiconductor die 526 has a different footprint and contact pad configuration.","However, contact pad 540 (e.g., a gate contact pad) has the same configuration relative to semiconductor die 520.Semiconductor die 526 has two contact pads in contact pads 536 which are each soldered to two pedestals.","FIG.","5H shows semiconductor die 527 soldered to universal conductive clip 500.Semiconductor die 527 has a different footprint and contact pad configuration.","However, contact pad 540 (e.g., a gate contact pad) has the same configuration relative to semiconductor die 520.Semiconductor die 527 has contact pad 537 which is soldered to three pedestals.","FIG.","5I shows semiconductor die 528 soldered to universal conductive clip 500.Semiconductor die 528 has a different footprint and contact pad configuration.","However, contact pad 540 (e.g., a gate contact pad) has the same configuration relative to semiconductor die 520.Semiconductor die 528 has two contact pads in contact pads 538: a left-most contact pad soldered to six pedestals and a right-most contact pad soldered to nine pedestals.","The left-most and right-most contact pads are both soldered to three common pedestals positioned between the contact pads.","The portions of the common pedestals between the contact pads are not soldered.","For example, solder paste may be selectively applied to only portions of the top surfaces of the common pedestals that contact the contact pads.","The portions having soldering past applied can then be soldered by performing reflow.","FIG.","5J shows semiconductor die 529 soldered to universal conductive clip 500.Semiconductor die 529 has a different footprint and contact pad configuration.","However, contact pad 540 (e.g., a gate contact pad) has the same configuration relative to semiconductor die 520.Semiconductor die 529 has three contact pads in contact pads 539.The left-most contact pad is soldered to three pedestals, the middle contact pad is soldered to six pedestals, and the right-most contact pad is soldered to six pedestals.","The configuration of the conductive clip will vary depending on the family of semiconductor dies that are desired to be attached.","The size, shape, and spacing of the pedestals can be readily modified to accommodate a family of different semiconductors.","In some embodiments, the universal conductive clip can be configured to align certain corners on the contact pads in each semiconductor die in the family.","For example, the corners on the contact pads closest to a corner of the semiconductor die may be laterally aligned with corners on the pedestals.","In some embodiments, two, three, or four of the closest corners are laterally aligned with the pedestals.","Similarly, edges of the contact pads that form a corner closest to a corner of the semiconductor die can be laterally aligned and parallel with an edge of a pedestal.","In some embodiments, two, three, or four pairs of linear edges of the contact pads that form a corner closest to a corner of the semiconductor die can be laterally aligned and parallel with an edge of a pedestal.","FIGS.","5A-J each demonstrate a configuration where four corners of the contacts pads closest to the corners of the semiconductor die are laterally aligned.","FIGS.","5A-J each demonstrate having three pairs of linear edges of the contact pads that form a corner closest to a corner of the semiconductor die that are laterally aligned and parallel with an edge of a pedestal (the corners closest to contact pad 540 are not formed by two linear edges).","FIG.","6 shows examples of the design consideration when configuring a universal conductive clip in accordance with some embodiments of the present application.","Conductive clip 600 can have first pedestal 605, second pedestal 610, third pedestal 615, and fourth pedestal 620 at the outer corners of the array of pedestals.","The positioning at outer corners can be selected to accommodate the largest contact pad footprint in the semiconductor die family.","The pedestals at the outer corners may be configured so that the outer edges are laterally aligned and parallel with contact pads (e.g., as depicted in FIG.","5F the outer corner pedestals on conductive clip 500 are soldered to contact pads 535 on semiconductor die 525 so that the outer edges are laterally aligned and parallel).","Width 625 of the left-most column of pedestals (including first pedestal 605 and fourth pedestal 620) can be based on the smallest width of a contact pad in the family.","For example, the width of the left-most column of pedestals in universal conductive clip 500 corresponds to the width of the left-most contact pads in semiconductor die 525 and semiconductor die 529.Height 630 of the upper-most row of pedestals can be based on the smallest height of a contact pad in the family.","For example, the height of the upper-most row of pedestals in universal conductive clip 500 corresponds to the height of contact pads 536 and contact pads 537 in semiconductor die 526 and semiconductor die 527, respectively.","Pitch 635 and height 640 can be determined by analyzing the intermediate-sized semiconductor dies in the family (e.g., semiconductor die 523 and the like for conductive clip 500 as depicted in FIGS.","5A-J) The universal design for the universal conductive clip described above may similarly be applied to other conductive substrates, such as a lead frame.","Thus, some embodiments disclosed herein include a universal lead frame having two or more pedestals that can accommodate different-sized semiconductor dies.","The universal lead frame may generally have the same characteristics as the universal conductive clip described above (e.g., universal conductive clip 500 as depicted in FIGS.","5A-J).","In some embodiments, a semiconductor die can be soldered to the lead frame such that at least a portion of the pedestals are not soldered to a contact pad.","In some embodiments, a semiconductor die can be soldered to the lead frame such that at least a portion of the unsoldered pedestals are not covered by the footprint of the semiconductor die.","Some embodiments disclosed herein include a kit for manufacturing semiconductor devices.","The kit can include two or more different semiconductor dies having different contact pad configurations.","The kit can include a universal conductive substrate (e.g., a universal lead frame or a universal conductive clip) that is configured to be soldered to the semiconductor dies.","The universal conductive substrate can include pedestals configured so that each of the semiconductor dies can have contact pads operably coupled to the pedestals.","As an example, the kit can include conductive clip 500 and semiconductor dies 520-529 as depicted in FIGS.","5A-J.","In some embodiments, the pedestals on the universal conductive substrate are configured so that two, three, or four of the closest corners on the contact pads (the corners on the contacts pads closest to the corners on the semiconductor die) for each of the semiconductor dies are laterally aligned with the pedestals.","In some embodiments, two, three, or four pairs of linear edges of the contact pads that form the closest corners for each of the semiconductor dies can be laterally aligned and parallel with an edge pair of a pedestal.","Some embodiments disclosed herein include a method of making a semiconductor die.","The method may be used, for example, to prepare any of the semiconductor devices disclosed in the present application (e.g., semiconductor device 400 as depicted in FIG.","4).","The method can include providing a conductive substrate (e.g., lead frame 100 as depicted in FIG.","1A).","The conductive substrate can include one or more pedestals on a first side of the conductive substrate, wherein each of the pedestals comprises a planar surface on the first side of the conductive substrate (e.g., pedestals 140 as depicted in FIG.","1A).","The method may also include disposing a solder paste between at least one of the planar surfaces on the pedestals on the conductive substrate and one or more contact pads of a semiconductor die such that each of the contacts pads has two or more linear edges that are each laterally aligned and parallel with at least one edge of the planar surfaces on the pedestals (e.g., solder paste 300 and soldering past 340 are applied as depicted in FIGS.","3B-C).","The method can also include reflowing the solder paste to solder at least a portion of the pedestals to the contact pads.","From all the foregoing one skilled in the art can determine that according to one embodiment, a semiconductor device comprises: a lead frame comprising a first contact electrically coupled to a first lead, wherein the first contact comprises one or more elevated regions on a first side of the first contact, wherein each of the elevated regions comprises a planar surface on the first side of the first contact; a semiconductor die comprising one or more first contact pads, a second contact pad, and a third contact pad, wherein the first contact pads are disposed on a first side of the semiconductor die, and wherein each of the first contact pads are soldered to at least one of the elevated regions such that each of the first contacts pads has two or more linear edges that are each laterally aligned and parallel with at least one edge of the planar surfaces on the elevated regions; a second lead electrically coupled to the second contact pad of the semiconductor die; and a third lead electrically coupled to the third contact pad of the semiconductor die.","From all the foregoing one skilled in the art can determine that according to one embodiment, a semiconductor device comprises: a lead frame comprising a first contact electrically coupled to a first lead of the semiconductor device; a conductive clip electrically coupled to a second lead on the semiconductor device, wherein the conductive clip comprises one or more elevated regions on a first side of the conductive clip, wherein each of the elevated regions comprises a planar surface on the first side of the conductive clip; and a semiconductor die comprising: a first contact pad on a first side of the semiconductor die, wherein the first contact pad is soldered to the first contact on the lead frame; one or more second contact pads on a second a side of the semiconductor die, wherein each of the second contact pads are soldered to at least one of the elevated regions on the first side of the conductive clip such that each of the second contacts pads has two or more linear edges that are each laterally aligned and parallel with at least one edge of the planar surfaces on the elevated regions; and a third contact pad on the semiconductor die, wherein the third contact pad is electrically coupled to a third lead of the semiconductor device.","From all the foregoing one skilled in the art can determine that according to one embodiment, a method of making a semiconductor device comprises: providing a conductive substrate, the conductive substrate comprising one or more elevated regions on a first side of the conductive substrate, wherein each of the elevated regions comprises a planar surface on the first side of the conductive substrate; disposing a solder paste between at least one of the planar surfaces on the elevated regions on the conductive substrate and one or more contact pads of a semiconductor die such that each of the contacts pads has two or more linear edges that are each laterally aligned and parallel with at least one edge of the planar surfaces on the elevated regions; and reflowing the solder paste to solder at least a portion of the elevated regions to the contact pads.","In view of all of the above, it is evident that a novel device and method is disclosed.","Included, among other features, are conductive substrates, such as a lead frame or conductive clip, having elevated regions that can reduce or prevent drifting, tilting, or rotation during reflow.","Furthermore, universal conductive substrates configured to be operably soldered to different semiconductor dies are disclosed.","While the subject matter of the invention is described with specific preferred embodiments and example embodiments, the foregoing drawings and descriptions thereof depict only typical embodiments of the subject matter and are not therefore to be considered to be limiting of its scope, it is evident that many alternatives and variations will be apparent to those skilled in the art.","For example, the subject matter has been described with respect to particular transistor configurations for the semiconductor die, however various different integrated circuits may also be used.","As another example, the subject matter has been described with respect to soldering contact pads to conductive substrates, however other techniques for electrically coupling the contact pads to the conductive substrate may also be used.","As the claims hereinafter reflect, inventive aspects may lie in less than all features of a single foregoing disclosed embodiment.","Thus, the hereinafter expressed claims are hereby expressly incorporated into this Detailed Description, with each claim standing on its own as a separate embodiment of an invention.","Furthermore, while some embodiments described herein include some but not other features included in other embodiments, combinations of features of different embodiments are meant to be within the scope of the invention, and form different embodiments, as would be understood by those skilled in the art."]],"string":"[\n [\n \"SEMICONDUCTOR DEVICES AND METHODS OF MAKING THE SAME\",\n \"In one embodiment, methods for making semiconductor devices are disclosed.\"\n ],\n [\n \"1.A method for making a semiconductor device, the method comprising: providing a conductive substrate, the conductive substrate comprising one or more elevated regions on a first side of the conductive substrate, wherein each of the elevated regions comprises a planar surface on the first side of the conductive substrate; disposing a solder paste between at least one of the planar surfaces on the elevated regions on the conductive substrate and one or more contact pads of a semiconductor die such that each of the contacts pads has two or more linear edges that are each laterally aligned and parallel with at least one edge of the planar surfaces on the elevated regions; and reflowing the solder paste to solder at least a portion of the elevated regions to the contact pads.\",\n \"2.The method of claim 1, wherein disposing the solder paste between at least one of the planar surfaces on the elevated regions on the conductive substrate and the one or more contact pads of the semiconductor die comprises disposing the solder paste between two or more planar surfaces on the elevated regions on the conductive substrate and the one or more contact pads.\",\n \"3.The method of claim 1, wherein a number of the elevated regions on the first side of the conductive substrate is greater than a number of the elevated regions soldered to the contact pads of the semiconductor die.\",\n \"4.The method of claim 1, wherein a number of the elevated regions on the first side of the conductive substrate is at least 10.5.The method of claim 1, wherein a number of the elevated regions on the first side of the conductive substrate is at least two, and wherein at least a portion of the elevated regions on the first side of the conductive substrate have different sizes.\",\n \"6.The method of claim 1, wherein a number of the elevated regions on the first side of the conductive substrate is at least two, and wherein the elevated regions are evenly spaced along a first direction.\",\n \"7.The method of claim 1, wherein providing the conductive substrate comprises providing a lead frame comprising the conductive substrate electrically coupled to a first lead.\",\n \"8.The method of claim 1, wherein the elevated regions on the first side of the conductive substrate are arranged in a grid having rows and columns, each of the rows having the same number of elevated regions and each of the columns having the same number of elevated regions.\",\n \"9.The method of claim 1, wherein the semiconductor die is a metal-oxide field-effect transistor (MOSFET).\",\n \"10.A method for making a semiconductor device, the method comprising: providing a conductive substrate, the conductive substrate comprising a first elevated region on a first side of the conductive substrate and a second elevated region on the first side of the conductive substrate, wherein the first elevated region comprises a first planar surface on the first side of the conductive substrate, and wherein the second elevated region comprises a second planar surface on the first side of the conductive substrate; and attaching at least the first planar surface of the first elevated region to a first contact pad of a semiconductor die such that the conductive substrate is electrically coupled to the contact pad, wherein at least a portion of the second planar surface on the second elevated region is not attached to any contact pad of the semiconductor die.\",\n \"11.The method of claim 10, wherein the first planar surface of the first elevated region has a first corner that is laterally aligned with a first corner of the first contact pad.\",\n \"12.The method of claim 10, wherein the first planar surface of the first elevated region has different dimensions than the second planar surface of the second elevated region.\",\n \"13.The method of claim 10, wherein the conductive substrate comprises at least 10 elevated regions.\",\n \"14.The method of claim 10, wherein the semiconductor die is a metal-oxide field-effect transistor (MOSFET).\",\n \"15.The method of claim 10, wherein the second planar surface of the second elevated region is not attached to the semiconductor die.\",\n \"16.The method of claim 10, wherein only a portion of the second planar surface of the second elevated region is attached to the first contact pad of the semiconductor die, and wherein the second planar surface of the second elevated region is electrically coupled to the first contact pad of the semiconductor die.\",\n \"17.The method of claim 10, wherein the first planar surface comprises a curved edge, and wherein the second planar surface has a polygonal shape.\",\n \"18.The method of claim 10, wherein a first portion of the second planar surface of the second elevated region is attached to the first contact pad of the semiconductor die, and a second portion of the second planar surface of the second elevated region is attached to a second contact pad of the semiconductor die.\",\n \"19.The method of claim 10, wherein the second planar surface of the second elevated region is laterally positioned away from a footprint of the semiconductor die.\",\n \"20.A method for making semiconductor devices, the method comprising: providing a first conductive substrate, the first conductive substrate comprising one or more elevated regions on a first side of the first conductive substrate, wherein each of the one or more elevated regions of the first conductive substrate comprises a planar surface on the first side of the first conductive substrate; providing a second conductive substrate, the second conductive substrate comprising one or more elevated regions on a first side of the second conductive substrate, wherein each of the one or more elevated regions of the second conductive substrate comprises a planar surface on the first side of the second conductive substrate, wherein the first conductive substrate has substantially the same structure as the second conductive substrate; attaching one or more contact pads of a first semiconductor die to at least one of said one or more elevated regions on the first side of the first conductive substrate; and attaching one or more contact pads of a second semiconductor die to at least one of said one or more elevated regions on the first side of the second conductive substrate, wherein said one or more contact pads of the first semiconductor die have a different configuration than said one or more contact pads of the second semiconductor die.\"\n ],\n [\n \" BACKGROUND The present application relates, in general, to electronics, and more particularly, to methods of forming packaging structure for semiconductor devices.\",\n \"The semiconductor industry typically utilizes various methods and structures to form packages that encapsulate a semiconductor die and provide leads for electrically connecting to the semiconductor die.\",\n \"In one type of semiconductor package, the semiconductor die is mounted between a lead frame and a clip.\",\n \"The lower lead frame has a continuous flat surface on which the die is mounted then a clip is used to complete the electrical circuit on the top of the die.\",\n \"This configuration may provide inaccurate positioning of the semiconductor die to the lower lead frame.\",\n \"In addition, the same inaccurate positioning can occur with the clip.\",\n \"During mounting of both the die and clip, solder paste is typically used between the die to lead frame and clip to die.\",\n \"During reflow, both the die and clip may move, drift, tilt, and/or rotate, which can lower the quality and performance of the semiconductor device.\",\n \"Accordingly, it is desirable to have techniques for mounting a semiconductor die that can reduce or eliminate drifting, tilting, or rotation.\",\n \"It is also desirable to have techniques for mounting different semiconductor dies using the same lead frame design.\"\n ],\n [\n \" BRIEF DESCRIPTION OF THE DRAWINGS Embodiments of present application will become more fully understood from the detailed description and the accompanying drawings, which are not intended to limit the scope of the present application.\",\n \"FIG.\",\n \"1A is a perspective view illustrating one example of a lead frame in accordance with some embodiments of the present application.\",\n \"FIG.\",\n \"1B is a top view one example of a lead frame in accordance with some embodiments of the present application.\",\n \"FIG.\",\n \"1C is a cross-sectional view of source contact pad of a lead frame in accordance with some embodiments of the present application.\",\n \"FIGS.\",\n \"2A and 2B are bottom and top views, respectively, illustrating one example of semiconductor die 200 in accordance with some embodiments of the present application.\",\n \"FIG.\",\n \"3A is a top view illustrating one example of semiconductor die 200 positioned on lead frame 100 in accordance with some embodiments of the present application.\",\n \"FIG.\",\n \"3B is a cross-sectional view illustrating semiconductor die 200 positioned on lead frame 100 in accordance with some embodiments of the present application.\",\n \"FIG.\",\n \"3C is a cross-sectional view illustrating semiconductor die 200 positioned on lead frame 100 which is orthogonal to the cross-sectional view in FIG.\",\n \"3B in accordance with some embodiments of the present application.\",\n \"FIG.\",\n \"4 is a perspective view illustrating one example of semiconductor device 400 in accordance with some embodiments of the present application.\",\n \"FIG.\",\n \"5A is a bottom view showing one example of universal conductive clip 500 including a plurality of pedestals 510 that extend towards semiconductor die 520 in accordance with some embodiments of the present application.\",\n \"FIG.\",\n \"5B is a bottom view of one example of semiconductor die 521 soldered to universal conductive clip 500 in accordance with some embodiments of the present application.\",\n \"FIG.\",\n \"5C is a bottom view of one example of semiconductor die 522 soldered to universal conductive clip 500 in accordance with some embodiments of the present application.\",\n \"FIG.\",\n \"5D is a bottom view of one example of semiconductor die 523 soldered to universal conductive clip 500 in accordance with some embodiments of the present application.\",\n \"FIG.\",\n \"5E is a bottom view of one example of semiconductor die 524 soldered to universal conductive clip 500 in accordance with some embodiments of the present application.\",\n \"FIG.\",\n \"5F is a bottom view of one example of semiconductor die 525 soldered to universal conductive clip 500 in accordance with some embodiments of the present application.\",\n \"FIG.\",\n \"5G is a bottom view of one example of semiconductor die 526 soldered to universal conductive clip 500 in accordance with some embodiments of the present application.\",\n \"FIG.\",\n \"5H is a bottom view of one example of semiconductor die 527 soldered to universal conductive clip 500 in accordance with some embodiments of the present application.\",\n \"FIG.\",\n \"5I is a bottom view of one example of semiconductor die 528 soldered to universal conductive clip 500 in accordance with some embodiments of the present application.\",\n \"FIG.\",\n \"5J is a bottom view of one example of semiconductor die 529 soldered to universal conductive clip 500 in accordance with some embodiments of the present application.\",\n \"FIG.\",\n \"6 shows examples of the design considerations when configuring a universal conductive clip for family of semiconductor dies in accordance with some embodiments of the present application.\",\n \"detailed-description description=\\\"Detailed Description\\\" end=\\\"lead\\\"?\",\n \"For simplicity and clarity of the illustration, elements in the figures are not necessarily to scale, and the same reference numbers in different figures denote the same elements.\",\n \"Additionally, descriptions and details of well-known steps and elements are omitted for simplicity of the description.\",\n \"As used herein current carrying electrode means an element of a device that carries current through the device such as a source or a drain of an MOS transistor or an emitter or a collector of a bipolar transistor or a cathode or anode of a diode, and a control electrode means an element of the device that controls current through the device such as a gate of an MOS transistor or a base of a bipolar transistor.\",\n \"Although the devices are explained herein as certain N-channel or P-Channel devices, or certain N-type of P-type doped regions, a person of ordinary skill in the art will appreciate that complementary devices are also possible in accordance with the present invention.\",\n \"It will be appreciated by those skilled in the art that the words during, while, and when as used herein are not exact terms that mean an action takes place instantly upon an initiating action but that there may be some small but reasonable delay, such as a propagation delay, between the reaction that is initiated by the initial action.\",\n \"The use of the word approximately or substantially means that a value of element has a parameter that is expected to be very close to a stated value or position.\",\n \"However, as is well known in the art there are always minor variances that prevent the values or positions from being exactly as stated.\",\n \"It is well established in the art that variances of up to about ten percent (10%) (and up to twenty percent (20%) for semiconductor doping concentrations) are regarded as reasonable variances from the ideal goal of exactly as described.\",\n \"For clarity of the drawings, doped regions of device structures are illustrated as having generally straight line edges and precise angular corners.\",\n \"However, those skilled in the art understand that due to the diffusion and activation of dopants the edges of doped regions generally may not be straight lines and the corners may not be precise angles.\"\n ],\n [\n \"CROSS-REFERENCE TO RELATED APPLICATION This application is a continuation of U.S. application Ser.\",\n \"No.\",\n \"15/421,515, filed Feb. 1, 2017, which is a continuation of U.S. application Ser.\",\n \"No.\",\n \"15/204,117, filed Jul.\",\n \"7, 2016, now U.S. Pat.\",\n \"No.\",\n \"9,576,883, which is a continuation of U.S. application Ser.\",\n \"No.\",\n \"14/729,234, filed Jun.\",\n \"3, 2015, now U.S. Pat.\",\n \"No.\",\n \"9,397,028, which is a continuation of U.S. application Ser.\",\n \"No.\",\n \"13/834,612, filed Mar.\",\n \"15, 2013, now U.S. Pat.\",\n \"No.\",\n \"9,070,721, which are hereby incorporated by reference in their entirety.\",\n \"BACKGROUND The present application relates, in general, to electronics, and more particularly, to methods of forming packaging structure for semiconductor devices.\",\n \"The semiconductor industry typically utilizes various methods and structures to form packages that encapsulate a semiconductor die and provide leads for electrically connecting to the semiconductor die.\",\n \"In one type of semiconductor package, the semiconductor die is mounted between a lead frame and a clip.\",\n \"The lower lead frame has a continuous flat surface on which the die is mounted then a clip is used to complete the electrical circuit on the top of the die.\",\n \"This configuration may provide inaccurate positioning of the semiconductor die to the lower lead frame.\",\n \"In addition, the same inaccurate positioning can occur with the clip.\",\n \"During mounting of both the die and clip, solder paste is typically used between the die to lead frame and clip to die.\",\n \"During reflow, both the die and clip may move, drift, tilt, and/or rotate, which can lower the quality and performance of the semiconductor device.\",\n \"Accordingly, it is desirable to have techniques for mounting a semiconductor die that can reduce or eliminate drifting, tilting, or rotation.\",\n \"It is also desirable to have techniques for mounting different semiconductor dies using the same lead frame design.\",\n \"BRIEF DESCRIPTION OF THE DRAWINGS Embodiments of present application will become more fully understood from the detailed description and the accompanying drawings, which are not intended to limit the scope of the present application.\",\n \"FIG.\",\n \"1A is a perspective view illustrating one example of a lead frame in accordance with some embodiments of the present application.\",\n \"FIG.\",\n \"1B is a top view one example of a lead frame in accordance with some embodiments of the present application.\",\n \"FIG.\",\n \"1C is a cross-sectional view of source contact pad of a lead frame in accordance with some embodiments of the present application.\",\n \"FIGS.\",\n \"2A and 2B are bottom and top views, respectively, illustrating one example of semiconductor die 200 in accordance with some embodiments of the present application.\",\n \"FIG.\",\n \"3A is a top view illustrating one example of semiconductor die 200 positioned on lead frame 100 in accordance with some embodiments of the present application.\",\n \"FIG.\",\n \"3B is a cross-sectional view illustrating semiconductor die 200 positioned on lead frame 100 in accordance with some embodiments of the present application.\",\n \"FIG.\",\n \"3C is a cross-sectional view illustrating semiconductor die 200 positioned on lead frame 100 which is orthogonal to the cross-sectional view in FIG.\",\n \"3B in accordance with some embodiments of the present application.\",\n \"FIG.\",\n \"4 is a perspective view illustrating one example of semiconductor device 400 in accordance with some embodiments of the present application.\",\n \"FIG.\",\n \"5A is a bottom view showing one example of universal conductive clip 500 including a plurality of pedestals 510 that extend towards semiconductor die 520 in accordance with some embodiments of the present application.\",\n \"FIG.\",\n \"5B is a bottom view of one example of semiconductor die 521 soldered to universal conductive clip 500 in accordance with some embodiments of the present application.\",\n \"FIG.\",\n \"5C is a bottom view of one example of semiconductor die 522 soldered to universal conductive clip 500 in accordance with some embodiments of the present application.\",\n \"FIG.\",\n \"5D is a bottom view of one example of semiconductor die 523 soldered to universal conductive clip 500 in accordance with some embodiments of the present application.\",\n \"FIG.\",\n \"5E is a bottom view of one example of semiconductor die 524 soldered to universal conductive clip 500 in accordance with some embodiments of the present application.\",\n \"FIG.\",\n \"5F is a bottom view of one example of semiconductor die 525 soldered to universal conductive clip 500 in accordance with some embodiments of the present application.\",\n \"FIG.\",\n \"5G is a bottom view of one example of semiconductor die 526 soldered to universal conductive clip 500 in accordance with some embodiments of the present application.\",\n \"FIG.\",\n \"5H is a bottom view of one example of semiconductor die 527 soldered to universal conductive clip 500 in accordance with some embodiments of the present application.\",\n \"FIG.\",\n \"5I is a bottom view of one example of semiconductor die 528 soldered to universal conductive clip 500 in accordance with some embodiments of the present application.\",\n \"FIG.\",\n \"5J is a bottom view of one example of semiconductor die 529 soldered to universal conductive clip 500 in accordance with some embodiments of the present application.\",\n \"FIG.\",\n \"6 shows examples of the design considerations when configuring a universal conductive clip for family of semiconductor dies in accordance with some embodiments of the present application.\",\n \"For simplicity and clarity of the illustration, elements in the figures are not necessarily to scale, and the same reference numbers in different figures denote the same elements.\",\n \"Additionally, descriptions and details of well-known steps and elements are omitted for simplicity of the description.\",\n \"As used herein current carrying electrode means an element of a device that carries current through the device such as a source or a drain of an MOS transistor or an emitter or a collector of a bipolar transistor or a cathode or anode of a diode, and a control electrode means an element of the device that controls current through the device such as a gate of an MOS transistor or a base of a bipolar transistor.\",\n \"Although the devices are explained herein as certain N-channel or P-Channel devices, or certain N-type of P-type doped regions, a person of ordinary skill in the art will appreciate that complementary devices are also possible in accordance with the present invention.\",\n \"It will be appreciated by those skilled in the art that the words during, while, and when as used herein are not exact terms that mean an action takes place instantly upon an initiating action but that there may be some small but reasonable delay, such as a propagation delay, between the reaction that is initiated by the initial action.\",\n \"The use of the word approximately or substantially means that a value of element has a parameter that is expected to be very close to a stated value or position.\",\n \"However, as is well known in the art there are always minor variances that prevent the values or positions from being exactly as stated.\",\n \"It is well established in the art that variances of up to about ten percent (10%) (and up to twenty percent (20%) for semiconductor doping concentrations) are regarded as reasonable variances from the ideal goal of exactly as described.\",\n \"For clarity of the drawings, doped regions of device structures are illustrated as having generally straight line edges and precise angular corners.\",\n \"However, those skilled in the art understand that due to the diffusion and activation of dopants the edges of doped regions generally may not be straight lines and the corners may not be precise angles.\",\n \"DETAILED DESCRIPTION The following description of embodiment(s) is merely illustrative in nature and is in no way intended to limit the invention, its application, or uses.\",\n \"The present application includes, among other things, a method of making a semiconductor device including: providing a conductive substrate, the conductive substrate comprising one or more elevated regions on a first side of the conductive substrate, wherein each of the elevated regions comprises a planar surface on the first side of the conductive substrate; disposing a solder paste between at least one of the planar surfaces on the elevated regions on the conductive substrate and one or more contact pads of a semiconductor die such that each of the contacts pads has three or more linear edges that are each laterally aligned and parallel with at least one edge of the planar surfaces on the elevated regions; and reflowing the solder paste to solder at least a portion of the elevated regions to the contact pads.\",\n \"FIG.\",\n \"1A is a perspective view illustrating one example of lead frame 100 in accordance with some embodiments of the present application.\",\n \"Lead frame 100 includes source contact 110, gate contact 120, and drain contact 130.Source contact 110 includes pedestals 140 (also referred to as standoffs or elevated regions) disposed on one side of source contact 110.Lead frame 100 may be formed, for example, by etching or stamping a copper or copper-alloy sheet.\",\n \"FIG.\",\n \"1B is a top view of lead frame 100.It will be appreciated that during typical packaging processes, the lead frame and its various contacts (e.g., source contact 110) may be interconnected in an array of lead frames that can be singulated into individual packages during processing.\",\n \"The dashed line in FIG.\",\n \"1B depicts cuttings lines where lead frame 100 can be separated using standard techniques, such as dicing or punching.\",\n \"FIG.\",\n \"1C is a cross-sectional view of source contact pad 110 in lead frame 100.Pedestals 140 can be isolated by trenches 150 between pedestals 140.Pedestals 140 each have planar surfaces on the same side of lead frame 100.As discussed further below, the pedestals can be configured to align with contact pads on a semiconductor die.\",\n \"The height of the pedestals (e.g., pedestals 140) can be, in some embodiments, at least about 30% of a thickness of the contact.\",\n \"For example, the source contact may be formed from a copper sheet having a thickness of about 10 mils, and therefore the height of the pedestals can be at least about 3 mils.\",\n \"In some embodiments, the pedestals can have a height of at least about 50% of a thickness of the contact.\",\n \"In some embodiments, the pedestals can, in some embodiments, have a height of at least about 3 mils or at least about 5 mils.\",\n \"The distance between the pedestals (e.g., the width of trenches 150) can be, in some embodiments, at least about the height of the pedestals.\",\n \"In some embodiments, the distance between the pedestals can be at least about 30% of a thickness of the contact or at least about 50% of a thickness of the contact.\",\n \"The distance between the pedestals can be, for example, at least about 3 mils or at least about 5 mils.\",\n \"The shape of the pedestals is not particularly limited.\",\n \"The top surface of the pedestals may, for example, have a polygonal surface, such as a square, a rectangle, or a triangle.\",\n \"In some embodiments, the top surface of each of the pedestals can include at least one linear edge (e.g., one, two, three, four or more linear edges).\",\n \"For example, as shown in FIG.\",\n \"1B pedestals 140 can be rectangular having four linear edges.\",\n \"The pedestals may also include at least one curved edge, for example, to accommodate an adjacent gate contact.\",\n \"FIGS.\",\n \"2A and 2B are bottom and top views, respectively, illustrating one example of semiconductor die 200 in accordance with some embodiments of the present application.\",\n \"Semiconductor die 200 includes source contact pads 210 and gate contact pad 220 on one side.\",\n \"Semiconductor die 200 also includes drain contact pad 230 on a side of semiconductor die 200 opposite source contact pads 210.Semiconductor die 200 may be configured, for example, as a MOSFET.\",\n \"Source contact pads 210 can be configured so that each of the contact pads can be soldered to a pedestal on a source contact of a lead frame (e.g., pedestals 140 on source contact 110 of lead frame 100).\",\n \"For example, each of source contact pads 210 may have the same shape and dimensions as a corresponding pedestal in pedestals 140 on source contact 110.Semiconductor die 200 may have the bottom surface placed over lead frame 100 such that each of source contact pads 210 align with one of pedestals 140.Similarly, gate contact pad 210 on semiconductor die 200 may align with gate contact 120 of lead frame 100.FIG.\",\n \"3A shows a top view illustrating one example of semiconductor die 200 positioned on lead frame 100 in accordance with some embodiments of the present application.\",\n \"Semiconductor die 200 is shown with dashed lines and is positioned over lead frame 100 so that source contact pads 210 can be aligned over pedestals 140.Each of the pedestals from pedestals 140 include four linear edges that are laterally aligned and parallel with four linear edges of each contact pad in contact pads 210.\",\n \"(The right-most pedestal of pedestals 140 also includes a curved edge that is laterally aligned with a curved edge of the right-most source contact pad of source contact pads 210.)\",\n \"Gate contact pad 220 is also aligned over gate contact 120.The pedestals can be soldered to the source contact pads to electrically couple source contact 110 to source contact pads 220.FIG.\",\n \"3B show a cross-sectional view illustrating semiconductor die 200 positioned on lead frame 100 in accordance with some embodiments of the present application.\",\n \"Solder paste 300 can be disposed between each of contact source pads 220 and pedestals 140.The solder paste may be applied such that trenches 150 are substantially free of solder paste.\",\n \"For example, solder paste 300 can be selectively applied to pedestals 140 before positioning semiconductor die 200 on lead frame 100 so that solder paste 300 is sandwiched between source contact pads 210 and pedestals 140.Solder paste may similarly be disposed between gate contact pad 220 and gate contact 120.The amount of solder paste applied between the pedestals and the contact pads is not particularly limited.\",\n \"Generally, the amount of solder paste applied is effective to electrically couple the contact pad to the conductive surface (e.g., the lead frame) and also effective such that the solder paste does not bridge between the pedestals during reflow.\",\n \"In some embodiments, the solder paste is evenly applied as a layer to the portions of the pedestal or contact pad to be soldered during reflow.\",\n \"In some embodiments, the solder paste is applied as a layer having a thickness about 0.003 inches to about 0.006 inches.\",\n \"Pedestals 140 can be soldered to source contact pads 210 by heating the semiconductor die and lead frame to perform reflow.\",\n \"In some embodiments, during reflow, the solder paste is maintained between the pedestals and the contact pads.\",\n \"That is, the solder paste does not flow into the trenches surrounding the pedestals.\",\n \"Similarly, the separate layers of solder paste disposed between each pair of contact pad and pedestal can remain spaced apart during reflow.\",\n \"In other words, layers of solder paste do not flow into a trench adjacent to both of the layers such that the solder paste from separate layers contact each other.\",\n \"Applicants have discovered that by soldering the pedestals to the contact pads, drifting, tilting, or rotation during reflow can be reduced or eliminated.\",\n \"Without being bound to any particular theory, it is believed that, by aligning edges of the pedestals with edges of the contact pads, the solder's surface tension and wet adhesion properties during reflow can maintain the pedestals aligned with the contact pads.\",\n \"This in turn limits or prevents the semiconductor die from rotating, tilting, or drifting during reflow.\",\n \"Accordingly, in some embodiments, each contact pad that is soldered to a pedestal will have two or more linear edges that are each laterally aligned and parallel with a linear of edge of a pedestal that is soldered to the contact pad.\",\n \"In some embodiments, each contact pad that is soldered to a pedestal will have three or more linear edges that are each laterally aligned and parallel with a linear of edge of a pedestal that is soldered to the contact pad.\",\n \"In some embodiments, each contact pad that is soldered to a pedestal will have four or more linear edges that are each laterally aligned and parallel with a linear of edge of a pedestal that is soldered to the contact pad.\",\n \"In some embodiments, each contact pad that is soldered to a pedestal will have two or more corners that are each laterally aligned with a corner of a pedestal that is soldered to the contact pad.\",\n \"In some embodiments, each contact pad that is soldered to a pedestal will have three or more corners that are each laterally aligned with a corner of a pedestal that is soldered to the contact pad.\",\n \"In some embodiments, each contact pad that is soldered to a pedestal will have four or more corners that are each laterally aligned with a corner of a pedestal that is soldered to the contact pad.\",\n \"As will be discussed further below, a single contact pad may optionally be soldered to two or more pedestals (e.g., two, three, four, five, six, or more pedestals).\",\n \"Thus, different linear edges of the same contact pad can be laterally aligned and parallel to edges of different pedestals.\",\n \"As an example, a rectangular contact pad can be soldered to two square pedestals.\",\n \"The rectangular contact pad may have two linear edges that are laterally aligned and parallel with two linear edges of the first square pedestal.\",\n \"The other two linear edges of the rectangular contact pad can be laterally aligned and parallel with two linear edges of the second square pedestal.\",\n \"Thus, in this specific example, all four linear edges of the rectangular contact pad are laterally aligned and parallel with linear edges found in two different pedestals.\",\n \"Moreover, each of the square pedestals includes two linear edges that are not laterally aligned with a linear edge of the rectangular contact pad.\",\n \"This example configuration may provide suitable adhesion to prevent drifting, tilting, or rotation during reflow.\",\n \"In some embodiments, at least two contact pads are each separately soldered to two or more pedestals.\",\n \"For example, a first contact pad (e.g., a source contact pad) of a semiconductor die can be soldered to a first pedestal of a contact (e.g., a source contact) on a lead frame and a second pedestal of the contact on the lead frame, and a second contact pad of the semiconductor die can be soldered to a third pedestal of the contact on the lead frame and a fourth pedestal of the contact on the lead frame.\",\n \"Drain contact pad 230 on semiconductor die 200 may be electrically coupled to drain contacts 130 on lead frame 100 using various techniques.\",\n \"For example, drain contact pad 230 can be wire bonded to drain contacts 130.In some embodiments, drain contact pad 230 can be electrically coupled to drain contacts 130 by a conductive clip.\",\n \"The conductive clip may be soldered to both drain contact pad 230 and drain contacts 130.FIG.\",\n \"3C is a cross-sectional view illustrating semiconductor die 200 positioned between lead frame 100 and conductive clip 310.The cross-sectional view in FIG.\",\n \"3C is orthogonal to the cross-sectional view in FIG.\",\n \"3B.\",\n \"The bottom face of conductive clip 310 can be soldered to drain contact pad 230 using solder paste 320.Conductive clip 310 has a U-shaped configuration such that both ends can be soldered to drain contacts 130 in lead frame 100 using solder paste 330.By soldering conductive clip 310 to both drain contacts 130 and drain contact pad 230, drain contact 130 can be electrically coupled to drain contact pad 230.As shown in FIG.\",\n \"3C, gate contact 120 can be soldered to gate contact pad 210 using solder paste 340.Gate contact 120 may be soldered to gate contact pad 210 at about the same time as performing reflow to solder source contact pad 220 to source contact 110.The conductive clip can be soldered to the contact pad (e.g., a gate contact pad) and contact on the lead frame (e.g., a gate contact) using generally the same techniques as described above.\",\n \"For example, solder paste can be applied to the gate contact pad and gate contacts, and then the conductive clip can positioned to contact the solder paste before performing reflow.\",\n \"The reflow for soldering the conductive clip may be performed before, after, or at about the same time as performing reflow to solder the semiconductor die to the lead frame.\",\n \"As discussed above, the pedestals on the lead frame can reduce or prevent drifting, tilting, or rotation during reflow.\",\n \"The pedestals may also be used to prevent or reduce drifting, tilting, or rotation when soldering any conductive substrate (e.g., a conductive clip or a lead frame) to a contact pad on a semiconductor die.\",\n \"FIG.\",\n \"4 is a perspective view illustrating one example of semiconductor device 400 in accordance with some embodiments of the present application.\",\n \"Semiconductor device 400 can include source contact 410 soldered to conductive clip 420.Conductive clip 420 has pedestals 425 which extend from the side of conductive clip 420 that faces semiconductor die 430.Pedestals 425 can be soldered to source contact pads 435 on semiconductor die 430 such that source contact 410 is electrically coupled to source contact pads 435.As shown, four linear edges of the contact pads that are soldered to the pedestals are each laterally aligned and parallel with a linear of edge of a pedestal that is soldered to the contact pad.\",\n \"The pedestals on the conductive clip may therefore reduce or prevent drifting, tilting, or rotation during reflow.\",\n \"Drain contact 440 can be soldered to drain contact pads (not shown) on a side of semiconductor die 430 opposite source contact pads 435.Gate contact 450 is soldered to conductive clip 460.Gate contact pad 470 on semiconductor die 430 is also soldered to conductive clip 460 such that gate contact 470 is electrically coupled to gate contact pad 470.The pedestals on a conductive substrate (e.g., pedestals 425 on conductive clip 420) can generally have the same characteristics as discussed above with regard to pedestals on a lead frame (e.g., pedestals 140 on lead frame 100).\",\n \"For example, the height of the pedestals may be about half of the thickness of the conductive clip.\",\n \"As another example, the number of pedestals on the conductive substrate is not limited, and may be, for example, one or more pedestals (e.g., one, two, three, four, five, ten, fifteen, twenty, or more pedestals on the conductive substrate).\",\n \"In some embodiments, at least one contact pad (e.g., one, two, three, four, or more contact pads) on the semiconductor die is soldered to two or more pedestals (e.g., two, three, four, five, or more pedestals) on the conductive substrate.\",\n \"Semiconductor device 400 may generally be assembled using the same techniques as described above.\",\n \"Solder paste can be applied to the drain contact and then the drain contact is soldered to the drain contact pad on the semiconductor die by performing reflow.\",\n \"Solder paste may then be applied to the source contact pad, gate contact pad, source contact, and gate contact before positioning the conductive clips over the semiconductor die and lead frame.\",\n \"Reflow can be performed to solder the conductive clip.\",\n \"In some embodiments, the semiconductor die's contact pads are soldered to the lead frame and conductive clips at about the same time.\",\n \"The semiconductor devices disclosed in the present application (e.g., semiconductor device 400) may be at least partially encapsulated in a molding material (e.g., a resin).\",\n \"In some embodiments, the molding material can fill the trenches between the pedestals.\",\n \"Portions of the lead frame and/or conductive clip may be exposed for electrically coupling the semiconductor die to, for example, a printed circuit board.\",\n \"Some embodiments disclosed herein relate to a conductive substrate that is configured to operably couple with two or more different semiconductor die designs (e.g., two, three, four, five, or more semiconductor die designs).\",\n \"Typically, each lead frame or conductive clip is customized for soldering to a specific semiconductor die design.\",\n \"Thus, each semiconductor die design requires a different lead frame design that must be manufactured or stocked at manufacturing facilities.\",\n \"The present application includes a universal lead frame and/or universal conductive clip that may be used with various kinds of semiconductor die designs.\",\n \"This may reduce the number of different lead frames that must be manufactured or stocked at manufacturing facilities.\",\n \"FIGS.\",\n \"5A-J are bottom views illustrating one example of universal conductive clip 500 soldered to various semiconductor dies in accordance with some embodiments of the present application.\",\n \"Referring to FIG.\",\n \"5A, universal conductive clip 500 includes a plurality of pedestals 510 that extend towards semiconductor die 520.Semiconductor die 520 has contact pads 530 on one side that are each soldered to two or more pedestals of pedestals 510.The upper-left contact pad is soldered to two pedestals.\",\n \"The upper-left contact pad has two linear edges that are each laterally aligned and parallel with an edge on the upper-left pedestal that is soldered to the upper-left contact pad.\",\n \"The upper-left contact pad and upper-left pedestal each have curved edges that are laterally aligned.\",\n \"The curved edges are shaped to accommodate contact pad 540 which can be electrically coupled to a separate conductive clip (not shown).\",\n \"The upper-left contact pad is also soldered to a second pedestal below the upper-left pedestal.\",\n \"Only a portion of the top surface of the second pedestal is soldered to the upper-left contact pad.\",\n \"Two edges of the second pedestal are each laterally aligned and parallel with an edge of the upper-left contact pad.\",\n \"During manufacturing, solder paste can be selectively applied to the top surface of the second pedestal (and any other pedestal having only a portion of the top surface soldered to a contact pad) at portions that will contact a contact pad.\",\n \"Each of contact pads 530 in FIG.\",\n \"5A have two or more edges that are each laterally aligned and parallel with an edge of a pedestal.\",\n \"The number of pedestals soldered to each contact pad varies: the upper-left and lower-left contact pads are each soldered to two pedestals, the upper-right and lower-right contact pads are each soldered to four pedestals.\",\n \"Each of the contact pads has only a portion of their surface area soldered to the pedestals.\",\n \"The portions of the contact pads disposed over trenches between the pedestal can, in some embodiments, be unsoldered.\",\n \"The total surface area of each contact pad that is soldered to a pedestal can be, for example, at least about 40%, at least about 50%, at least about 75%, or at least about 90%.\",\n \"The total surface area of each contact pad that is soldered to a pedestal can be, for example, no more than about 100%, no more than about 95%, no more than about 90%, no more than about 80%, or no more than about 70%.\",\n \"In some embodiments, the total surface area of each contact pad that is soldered to a pedestal is about 40% to about 100%, or about 50% to about 95%.\",\n \"Eight of the pedestals in pedestals 510 depicted in FIG.\",\n \"5A are not soldered to a contact pad.\",\n \"As will be discussed further below, these unsoldered pedestals are designed for a different semiconductor die.\",\n \"Four of the pedestals are laterally positioned away from the footprint of semiconductor die 520.In other words, four of the pedestals are not covered by semiconductor die 520.Another four of the pedestals are only partially covered by semiconductor die 520.FIG.\",\n \"5B shows semiconductor die 521 soldered to universal conductive clip 500.Semiconductor die 521 has a different footprint and contact pad configuration relative to semiconductor die 520.However, contact pad 540 (e.g., a gate contact pad) has the same configuration in both semiconductor dies.\",\n \"Each of contact pads 531 are soldered to four pedestals of pedestals 510.As shown, each of contact pads 531 have four edges that are each laterally aligned and parallel with edges on the pedestals soldered to the contact pads.\",\n \"Each of the eight pedestals that are soldered have their entire top surface soldered to the contact pads.\",\n \"Twelve pedestals remain unsoldered to semiconductor die 531: ten are uncovered by the footprint of semiconductor die 531, while two are partially covered by the footprint of semiconductor die 531.FIG.\",\n \"5C shows semiconductor die 522 soldered to universal conductive clip 500.Semiconductor die 522 has a different footprint and contact pad configuration.\",\n \"However, contact pad 540 (e.g., a gate contact pad) has the same configuration relative to semiconductor die 520.The left contact pad of contact pads 532 is soldered to two pedestals of pedestals 510.The right contact pad of contact pads 532 is soldered to four pedestals of pedestals 510.The pedestals soldered to the left contact pad have their entire top surface soldered to the left contact pad.\",\n \"Two of the pedestals soldered to the right contact pad have only a portion of their top surface soldered to the right contact pad.\",\n \"Two of the pedestals soldered to the right contact pad have their entire top surface soldered to the right contact pad.\",\n \"Fourteen pedestals remain unsoldered to semiconductor die 522: twelve are uncovered by the footprint of semiconductor die 522, while two are partially covered by the footprint of semiconductor die 522.FIG.\",\n \"5D shows semiconductor die 523 soldered to universal conductive clip 500.Semiconductor die 523 has a different footprint and contact pad configuration.\",\n \"However, contact pad 540 (e.g., a gate contact pad) has the same configuration relative to semiconductor die 520.The left-most contact pad of contact pads 533 is soldered to six pedestals of pedestals 510.The pedestals soldered to the left-most contact pad have their entire top surface soldered to the left-most contact pad.\",\n \"The right-most contact pad of contact pads 533 is soldered to four pedestals of pedestals 510.Two of the pedestals soldered to the right-most contact pad have their entire top surface soldered to the right-most contact pad.\",\n \"Two of the pedestals soldered to the right-most contact pad have only a portion of their top surface soldered to the right-most contact pad.\",\n \"Fourteen pedestals remain unsoldered to semiconductor die 523: twelve are uncovered by the footprint of semiconductor die 523, while two are partially covered by the footprint of semiconductor die 523.FIG.\",\n \"5E shows semiconductor die 524 soldered to universal conductive clip 500.Semiconductor die 524 has a different footprint and contact pad configuration.\",\n \"However, contact pad 540 (e.g., a gate contact pad) has the same configuration relative to semiconductor die 520.Semiconductor die 524 has two contact pads in contact pads 534 which are each soldered to four pedestals.\",\n \"FIG.\",\n \"5F shows semiconductor die 525 soldered to universal conductive clip 500.Semiconductor die 525 has a different footprint and contact pad configuration.\",\n \"However, contact pad 540 (e.g., a gate contact pad) has the same configuration relative to semiconductor die 520.Semiconductor die 525 has three contact pads in contact pads 534.All twenty of pedestals 510 are soldered to contact pads 535.In some embodiments, semiconductor die 535 may be the largest semiconductor die that can be accommodated on universal conductive clip 500.FIG.\",\n \"5G shows semiconductor die 526 soldered to universal conductive clip 500.Semiconductor die 526 has a different footprint and contact pad configuration.\",\n \"However, contact pad 540 (e.g., a gate contact pad) has the same configuration relative to semiconductor die 520.Semiconductor die 526 has two contact pads in contact pads 536 which are each soldered to two pedestals.\",\n \"FIG.\",\n \"5H shows semiconductor die 527 soldered to universal conductive clip 500.Semiconductor die 527 has a different footprint and contact pad configuration.\",\n \"However, contact pad 540 (e.g., a gate contact pad) has the same configuration relative to semiconductor die 520.Semiconductor die 527 has contact pad 537 which is soldered to three pedestals.\",\n \"FIG.\",\n \"5I shows semiconductor die 528 soldered to universal conductive clip 500.Semiconductor die 528 has a different footprint and contact pad configuration.\",\n \"However, contact pad 540 (e.g., a gate contact pad) has the same configuration relative to semiconductor die 520.Semiconductor die 528 has two contact pads in contact pads 538: a left-most contact pad soldered to six pedestals and a right-most contact pad soldered to nine pedestals.\",\n \"The left-most and right-most contact pads are both soldered to three common pedestals positioned between the contact pads.\",\n \"The portions of the common pedestals between the contact pads are not soldered.\",\n \"For example, solder paste may be selectively applied to only portions of the top surfaces of the common pedestals that contact the contact pads.\",\n \"The portions having soldering past applied can then be soldered by performing reflow.\",\n \"FIG.\",\n \"5J shows semiconductor die 529 soldered to universal conductive clip 500.Semiconductor die 529 has a different footprint and contact pad configuration.\",\n \"However, contact pad 540 (e.g., a gate contact pad) has the same configuration relative to semiconductor die 520.Semiconductor die 529 has three contact pads in contact pads 539.The left-most contact pad is soldered to three pedestals, the middle contact pad is soldered to six pedestals, and the right-most contact pad is soldered to six pedestals.\",\n \"The configuration of the conductive clip will vary depending on the family of semiconductor dies that are desired to be attached.\",\n \"The size, shape, and spacing of the pedestals can be readily modified to accommodate a family of different semiconductors.\",\n \"In some embodiments, the universal conductive clip can be configured to align certain corners on the contact pads in each semiconductor die in the family.\",\n \"For example, the corners on the contact pads closest to a corner of the semiconductor die may be laterally aligned with corners on the pedestals.\",\n \"In some embodiments, two, three, or four of the closest corners are laterally aligned with the pedestals.\",\n \"Similarly, edges of the contact pads that form a corner closest to a corner of the semiconductor die can be laterally aligned and parallel with an edge of a pedestal.\",\n \"In some embodiments, two, three, or four pairs of linear edges of the contact pads that form a corner closest to a corner of the semiconductor die can be laterally aligned and parallel with an edge of a pedestal.\",\n \"FIGS.\",\n \"5A-J each demonstrate a configuration where four corners of the contacts pads closest to the corners of the semiconductor die are laterally aligned.\",\n \"FIGS.\",\n \"5A-J each demonstrate having three pairs of linear edges of the contact pads that form a corner closest to a corner of the semiconductor die that are laterally aligned and parallel with an edge of a pedestal (the corners closest to contact pad 540 are not formed by two linear edges).\",\n \"FIG.\",\n \"6 shows examples of the design consideration when configuring a universal conductive clip in accordance with some embodiments of the present application.\",\n \"Conductive clip 600 can have first pedestal 605, second pedestal 610, third pedestal 615, and fourth pedestal 620 at the outer corners of the array of pedestals.\",\n \"The positioning at outer corners can be selected to accommodate the largest contact pad footprint in the semiconductor die family.\",\n \"The pedestals at the outer corners may be configured so that the outer edges are laterally aligned and parallel with contact pads (e.g., as depicted in FIG.\",\n \"5F the outer corner pedestals on conductive clip 500 are soldered to contact pads 535 on semiconductor die 525 so that the outer edges are laterally aligned and parallel).\",\n \"Width 625 of the left-most column of pedestals (including first pedestal 605 and fourth pedestal 620) can be based on the smallest width of a contact pad in the family.\",\n \"For example, the width of the left-most column of pedestals in universal conductive clip 500 corresponds to the width of the left-most contact pads in semiconductor die 525 and semiconductor die 529.Height 630 of the upper-most row of pedestals can be based on the smallest height of a contact pad in the family.\",\n \"For example, the height of the upper-most row of pedestals in universal conductive clip 500 corresponds to the height of contact pads 536 and contact pads 537 in semiconductor die 526 and semiconductor die 527, respectively.\",\n \"Pitch 635 and height 640 can be determined by analyzing the intermediate-sized semiconductor dies in the family (e.g., semiconductor die 523 and the like for conductive clip 500 as depicted in FIGS.\",\n \"5A-J) The universal design for the universal conductive clip described above may similarly be applied to other conductive substrates, such as a lead frame.\",\n \"Thus, some embodiments disclosed herein include a universal lead frame having two or more pedestals that can accommodate different-sized semiconductor dies.\",\n \"The universal lead frame may generally have the same characteristics as the universal conductive clip described above (e.g., universal conductive clip 500 as depicted in FIGS.\",\n \"5A-J).\",\n \"In some embodiments, a semiconductor die can be soldered to the lead frame such that at least a portion of the pedestals are not soldered to a contact pad.\",\n \"In some embodiments, a semiconductor die can be soldered to the lead frame such that at least a portion of the unsoldered pedestals are not covered by the footprint of the semiconductor die.\",\n \"Some embodiments disclosed herein include a kit for manufacturing semiconductor devices.\",\n \"The kit can include two or more different semiconductor dies having different contact pad configurations.\",\n \"The kit can include a universal conductive substrate (e.g., a universal lead frame or a universal conductive clip) that is configured to be soldered to the semiconductor dies.\",\n \"The universal conductive substrate can include pedestals configured so that each of the semiconductor dies can have contact pads operably coupled to the pedestals.\",\n \"As an example, the kit can include conductive clip 500 and semiconductor dies 520-529 as depicted in FIGS.\",\n \"5A-J.\",\n \"In some embodiments, the pedestals on the universal conductive substrate are configured so that two, three, or four of the closest corners on the contact pads (the corners on the contacts pads closest to the corners on the semiconductor die) for each of the semiconductor dies are laterally aligned with the pedestals.\",\n \"In some embodiments, two, three, or four pairs of linear edges of the contact pads that form the closest corners for each of the semiconductor dies can be laterally aligned and parallel with an edge pair of a pedestal.\",\n \"Some embodiments disclosed herein include a method of making a semiconductor die.\",\n \"The method may be used, for example, to prepare any of the semiconductor devices disclosed in the present application (e.g., semiconductor device 400 as depicted in FIG.\",\n \"4).\",\n \"The method can include providing a conductive substrate (e.g., lead frame 100 as depicted in FIG.\",\n \"1A).\",\n \"The conductive substrate can include one or more pedestals on a first side of the conductive substrate, wherein each of the pedestals comprises a planar surface on the first side of the conductive substrate (e.g., pedestals 140 as depicted in FIG.\",\n \"1A).\",\n \"The method may also include disposing a solder paste between at least one of the planar surfaces on the pedestals on the conductive substrate and one or more contact pads of a semiconductor die such that each of the contacts pads has two or more linear edges that are each laterally aligned and parallel with at least one edge of the planar surfaces on the pedestals (e.g., solder paste 300 and soldering past 340 are applied as depicted in FIGS.\",\n \"3B-C).\",\n \"The method can also include reflowing the solder paste to solder at least a portion of the pedestals to the contact pads.\",\n \"From all the foregoing one skilled in the art can determine that according to one embodiment, a semiconductor device comprises: a lead frame comprising a first contact electrically coupled to a first lead, wherein the first contact comprises one or more elevated regions on a first side of the first contact, wherein each of the elevated regions comprises a planar surface on the first side of the first contact; a semiconductor die comprising one or more first contact pads, a second contact pad, and a third contact pad, wherein the first contact pads are disposed on a first side of the semiconductor die, and wherein each of the first contact pads are soldered to at least one of the elevated regions such that each of the first contacts pads has two or more linear edges that are each laterally aligned and parallel with at least one edge of the planar surfaces on the elevated regions; a second lead electrically coupled to the second contact pad of the semiconductor die; and a third lead electrically coupled to the third contact pad of the semiconductor die.\",\n \"From all the foregoing one skilled in the art can determine that according to one embodiment, a semiconductor device comprises: a lead frame comprising a first contact electrically coupled to a first lead of the semiconductor device; a conductive clip electrically coupled to a second lead on the semiconductor device, wherein the conductive clip comprises one or more elevated regions on a first side of the conductive clip, wherein each of the elevated regions comprises a planar surface on the first side of the conductive clip; and a semiconductor die comprising: a first contact pad on a first side of the semiconductor die, wherein the first contact pad is soldered to the first contact on the lead frame; one or more second contact pads on a second a side of the semiconductor die, wherein each of the second contact pads are soldered to at least one of the elevated regions on the first side of the conductive clip such that each of the second contacts pads has two or more linear edges that are each laterally aligned and parallel with at least one edge of the planar surfaces on the elevated regions; and a third contact pad on the semiconductor die, wherein the third contact pad is electrically coupled to a third lead of the semiconductor device.\",\n \"From all the foregoing one skilled in the art can determine that according to one embodiment, a method of making a semiconductor device comprises: providing a conductive substrate, the conductive substrate comprising one or more elevated regions on a first side of the conductive substrate, wherein each of the elevated regions comprises a planar surface on the first side of the conductive substrate; disposing a solder paste between at least one of the planar surfaces on the elevated regions on the conductive substrate and one or more contact pads of a semiconductor die such that each of the contacts pads has two or more linear edges that are each laterally aligned and parallel with at least one edge of the planar surfaces on the elevated regions; and reflowing the solder paste to solder at least a portion of the elevated regions to the contact pads.\",\n \"In view of all of the above, it is evident that a novel device and method is disclosed.\",\n \"Included, among other features, are conductive substrates, such as a lead frame or conductive clip, having elevated regions that can reduce or prevent drifting, tilting, or rotation during reflow.\",\n \"Furthermore, universal conductive substrates configured to be operably soldered to different semiconductor dies are disclosed.\",\n \"While the subject matter of the invention is described with specific preferred embodiments and example embodiments, the foregoing drawings and descriptions thereof depict only typical embodiments of the subject matter and are not therefore to be considered to be limiting of its scope, it is evident that many alternatives and variations will be apparent to those skilled in the art.\",\n \"For example, the subject matter has been described with respect to particular transistor configurations for the semiconductor die, however various different integrated circuits may also be used.\",\n \"As another example, the subject matter has been described with respect to soldering contact pads to conductive substrates, however other techniques for electrically coupling the contact pads to the conductive substrate may also be used.\",\n \"As the claims hereinafter reflect, inventive aspects may lie in less than all features of a single foregoing disclosed embodiment.\",\n \"Thus, the hereinafter expressed claims are hereby expressly incorporated into this Detailed Description, with each claim standing on its own as a separate embodiment of an invention.\",\n \"Furthermore, while some embodiments described herein include some but not other features included in other embodiments, combinations of features of different embodiments are meant to be within the scope of the invention, and form different embodiments, as would be understood by those skilled in the art.\"\n ]\n]"},"source":{"kind":"string","value":"Patent_15871414"}}},{"rowIdx":4493787,"cells":{"text":{"kind":"list like","value":[["CONTENT DELIVERY NETWORK WITH DEEP CACHING INFRASTRUCTURE","Embodiments herein include methods and systems for use in delivering resources to a client device over a local network.","An exemplary system comprises a plurality of caching devices operable to cache resources on behalf of a plurality of content providers, and a local caching device communicatively situated between an access network and the client device, wherein the access network is communicably situated between the plurality of caching devices and the local caching device.","The local caching device is operable to retrieve a requested resource from at least one of the plurality of caching devices, deliver the requested resource to the client device over the local network, and store the requested resource for future requests by other client devices."],["1.A system comprising: a redirection server; and a plurality of caching devices situated within a wireless network, wherein the redirection server is operable to receive a request for a resource originating from a wireless client device connected to the wireless network, wherein the redirection server is further operable to select at least one of the plurality of caching devices to deliver the requested resource to the wireless client device, wherein the selected at least one caching device is operable to initiate delivery of the requested resource to the wireless client device from within the wireless network.","2.The system as recited in claim 1, wherein the plurality of caching devices are further operable to retrieve the requested resource from one or more content delivery network (CDN) caching devices communicatively coupled with the wireless network.","3.The system as recited in claim 1, wherein the step of selecting at least one of the plurality of caching devices to deliver the requested resource to the wireless client device is based on at least one of: whether a caching device has the requested resource; proximity of the caching device to the wireless client device; and wireless network conditions.","4.The system as recited in claim 1, wherein the redirection server is operable to redirect the wireless client to the at least one selected caching device for delivery of the requested resource.","5.The system as recited in claim 4, wherein the request is a Domain Name System (DNS) request.","6.The system as recited in claim 4, wherein the request is an application protocol request.","7.The system as recited in claim 6, wherein the application protocol request is a Hyper Text Transfer Protocol (HTTP) request.","8.The system as recited in claim 1, wherein the redirection server is situated within the wireless network.","9.The system as recited in claim 1, wherein at least one of the plurality of caching devices is locally proximate to the wireless client device and is operable to wirelessly delivery the requested resource to the wireless client device.","10.The system as recited in claim 9, wherein the locally proximate caching device is operable to retrieve the requested resource from one or more content delivery network (CDN) caching devices communicatively coupled with the wireless network.","11.The system as recited in claim 9, wherein the locally proximate caching device is a Wi-Fi hotspot.","12.The system as recited in claim 1, wherein at least one of the plurality of caching devices is situated within at least one of a cellular core network and a radio access network of the wireless network.","13.The system as recited in claim 1, wherein at least one of the plurality of caching devices is proximately situated with at least one of a radio network controller (RNC), a serving general packet radio service (GPRS) support node (SGSN), and a gateway GPRS support node (GGSN) of the wireless network.","14.A method comprising: at a redirection server, receiving a request for a resource originating from a wireless client device connected to a wireless network; selecting at least one caching device from a plurality of caching devices to deliver the requested resource to the wireless client device; and by the selected at least one caching device, initiating delivery of the requested resource to the wireless client device from within the wireless network.","15.The method as recited in claim 14, wherein the step of selecting at least one caching device from a plurality of caching devices to deliver the requested resource to the wireless client device is based on at least one of: whether a caching device has the requested resource; proximity of the caching device to the wireless client device; and wireless network conditions."],[" BACKGROUND Networks that are engaged to deliver electronic resources, such as videos, images, audio files, documents, software, and the like, to end users on the Internet on behalf of owners and providers of those resources (“content providers”) are commonly referred to as Content Delivery Networks (CDNs).","A primary purpose of a CDN is to distribute resources efficiently to client devices on behalf of one or more content providers, preferably via a public Internet.","Both end-users (clients) and content providers benefit from using a CDN.","By using a CDN, a content provider is able to improve the speed and reliability of content delivery to its end-users, and delivery capability without deploying additional infrastructure.","Clients benefit by being able to obtain content with fewer delays."],[" SUMMARY Embodiments herein include an example system for use in delivering resources to client devices in a local network, wherein the system comprises a plurality of caching devices operable to cache resources on behalf of a plurality of content providers, and a local caching device communicatively situated between an access network and the client device.","The access network is communicably situated between the plurality of caching devices and the local caching device.","The local caching device is operable to, in response to a request for a resource by a client device, retrieve the requested resource from at least one of the plurality of caching devices, wherein the requested resource is transmitted between the at least one plurality of caching devices and the local caching device over the access network.","The access network is further operable to deliver the requested resource to the client device over the local network and store the requested resource for future requests by other client devices.","In an example embodiment, at least one of the plurality of caching devices is part of a cluster of caching devices.","In an example embodiment, in response to the local caching device requesting the requested resource from the at least one of the plurality of caching devices, the at least one of the plurality of caching devices is operable to retrieve the requested resource from at least one of an origin server of the content provider associated with the requested resource and a peer caching device.","In an example embodiment, the local caching device is dedicated to the client device.","In an example embodiment, the local caching device is a master cache accessible by a community of local caching devices and the community of local caching devices is communicatively coupled via at least one of a shared wireless frequency and a shared powerline.","Furthermore, a second local caching device can be prompted to opt-in to join the community of local caching devices.","In an example embodiment, a proxy device operable to intercept a request for the requested resource.","In another example embodiment, the request is a Domain Name System (DNS) request and the proxy device is operable to redirect the client device to the local caching device for delivery of the requested resource over the local network.","In another example embodiment, the request is an application protocol request such as a Hyper Text Transfer Protocol (HTTP) request.","In yet another example embodiment, the proxy device is the local caching device and, in response to intercepting the request for the requested resource, the local caching device is operable to redirect the client device to a second local caching device communicatively situated between the access network and the client device.","The second local caching device is operable to, in response to the redirected request by the client device, retrieve the requested resource from at least one of the plurality of caching devices, wherein the requested resource is transmitted between the at least one plurality of caching devices and the second local caching device over the access network.","The second local caching device is also operable to deliver the requested resource to the client device over the local network and store the requested resource for future requests by other client devices.","In an example embodiment, the proxy device is operable to determine, based on certain criteria, to which of a plurality of local caching devices to redirect the client device for delivery of the requested resource.","For example, the certain criteria for each of the plurality of local caching devices can comprise availability, relative load, relative connectivity, availability, and whether a given local caching device has a copy of the requested resource.","The proxy device is operable to receive the certain criteria via a push or pull from the plurality of caching devices.","In another example embodiment, the certain criteria is locally generated at the proxy device and is based on a request history at the proxy device.","Embodiments herein include an example method for proactively loading resources on a local caching device associated with a community of local caching devices, wherein the community of local caching devices is communicatively coupled via an access network to at least one content delivery network (CDN) caching device.","The example method comprises steps for, in response to determining that a given resource meets certain popularity criteria and is not stored on the local caching device, determining whether the given resource is stored on at least one other local caching device in the community.","If so, method comprises steps for retrieving the given resource from the at least one other local caching device, wherein the at least one other local caching device has determined that the given resource meets certain popularity criteria and has retrieved the given resource from the at least one CDN caching device via the access network.","The example method further comprises steps for, in response to determining that the given resource is not stored on at least one other local caching device in the community, retrieving the given resource from the at least one CDN caching device via the access network.","The example method further comprises steps for prompting a given local caching device that is not already associated with the community of local caching devices to join the community of local caching devices, and, if the given local caching device affirmatively responds to the prompt to join the community of local caching devices, adding the given local caching device to the community of local caching devices.","In an example embodiment, the certain popularity criteria comprise a number of requests for the given resource that were received at the local caching device during a given time interval, availability of storage space on the local caching device, total capacity of the local caching device, type of storage on the local caching device, and popularity rankings of other resources stored on the local caching device.","Embodiments herein include an example system comprising a redirection server and a plurality of caching devices situated within a wireless network.","The redirection server is operable to receive a request for a resource originating from a wireless client device connected to the wireless network, wherein the redirection server is further operable to select at least one of the plurality of caching devices to deliver the requested resource to the wireless client device based on at whether a caching device has the requested resource, proximity of the caching device to the wireless client device, and wireless network conditions.","The selected at least one caching device is operable to initiate delivery of the requested resource to the wireless client device from within the wireless network.","In an example embodiment, the plurality of caching devices are operable to retrieve the requested resource from one or more content delivery network (CDN) caching devices communicatively coupled with the wireless network.","In an example embodiment, the redirection server is operable to intercept the request and determine whether to select at least one of the plurality of caching devices based on a popularity of the requested resource.","The redirection server is also operable to redirect the wireless client to the at least one selected caching device for delivery of the requested resource.","In an example embodiment, the redirection server is situated within the wireless network.","In an example embodiment, a caching device is locally proximate to the wireless client device and is operable to wirelessly delivery the requested resource to the wireless client device.","The locally proximate caching device is further operable to retrieve the requested resource from one or more content delivery network (CDN) caching devices communicatively coupled with the wireless network.","In another embodiment, the locally proximate caching device is a Wi-Fi hotspot.","In an example embodiment, a caching device is situated within a cellular core network and/or a radio access network of the wireless network.","In another embodiment, a caching device is proximately situated with at least one of a radio network controller (RNC), a serving general packet radio service (GPRS) support node (SGSN), and a gateway GPRS support node (GGSN) of the wireless network."],["RELATED APPLICATIONS This application is a continuation of and claims the benefit of priority from U.S. patent application Ser.","No.","14/537,733, filed Nov. 10, 2014, titled “Content Delivery Network with Deep Caching Infrastructure,” wherein the entire contents of which are fully incorporated by reference herein for all purposes.","Application Ser.","No.","14/537,733 is a divisional application of and claims the benefit of priority from U.S. patent application Ser.","No.","13/360,551, filed Jan. 27, 2012, titled “Content Delivery Network with Deep Caching Infrastructure,” now U.S. Pat.","No.","8,886,742, which claims priority to U.S.","Provisional Patent Application No.","61/437,544, filed Jan. 28, 2011 and U.S.","Provisional Patent Application No.","61/486,039, filed May 13, 2011, titled “Content Delivery Network with Deep Caching Infrastructure,” wherein the entire contents of each are fully incorporated by reference herein for all purposes.","BACKGROUND Networks that are engaged to deliver electronic resources, such as videos, images, audio files, documents, software, and the like, to end users on the Internet on behalf of owners and providers of those resources (“content providers”) are commonly referred to as Content Delivery Networks (CDNs).","A primary purpose of a CDN is to distribute resources efficiently to client devices on behalf of one or more content providers, preferably via a public Internet.","Both end-users (clients) and content providers benefit from using a CDN.","By using a CDN, a content provider is able to improve the speed and reliability of content delivery to its end-users, and delivery capability without deploying additional infrastructure.","Clients benefit by being able to obtain content with fewer delays.","SUMMARY Embodiments herein include an example system for use in delivering resources to client devices in a local network, wherein the system comprises a plurality of caching devices operable to cache resources on behalf of a plurality of content providers, and a local caching device communicatively situated between an access network and the client device.","The access network is communicably situated between the plurality of caching devices and the local caching device.","The local caching device is operable to, in response to a request for a resource by a client device, retrieve the requested resource from at least one of the plurality of caching devices, wherein the requested resource is transmitted between the at least one plurality of caching devices and the local caching device over the access network.","The access network is further operable to deliver the requested resource to the client device over the local network and store the requested resource for future requests by other client devices.","In an example embodiment, at least one of the plurality of caching devices is part of a cluster of caching devices.","In an example embodiment, in response to the local caching device requesting the requested resource from the at least one of the plurality of caching devices, the at least one of the plurality of caching devices is operable to retrieve the requested resource from at least one of an origin server of the content provider associated with the requested resource and a peer caching device.","In an example embodiment, the local caching device is dedicated to the client device.","In an example embodiment, the local caching device is a master cache accessible by a community of local caching devices and the community of local caching devices is communicatively coupled via at least one of a shared wireless frequency and a shared powerline.","Furthermore, a second local caching device can be prompted to opt-in to join the community of local caching devices.","In an example embodiment, a proxy device operable to intercept a request for the requested resource.","In another example embodiment, the request is a Domain Name System (DNS) request and the proxy device is operable to redirect the client device to the local caching device for delivery of the requested resource over the local network.","In another example embodiment, the request is an application protocol request such as a Hyper Text Transfer Protocol (HTTP) request.","In yet another example embodiment, the proxy device is the local caching device and, in response to intercepting the request for the requested resource, the local caching device is operable to redirect the client device to a second local caching device communicatively situated between the access network and the client device.","The second local caching device is operable to, in response to the redirected request by the client device, retrieve the requested resource from at least one of the plurality of caching devices, wherein the requested resource is transmitted between the at least one plurality of caching devices and the second local caching device over the access network.","The second local caching device is also operable to deliver the requested resource to the client device over the local network and store the requested resource for future requests by other client devices.","In an example embodiment, the proxy device is operable to determine, based on certain criteria, to which of a plurality of local caching devices to redirect the client device for delivery of the requested resource.","For example, the certain criteria for each of the plurality of local caching devices can comprise availability, relative load, relative connectivity, availability, and whether a given local caching device has a copy of the requested resource.","The proxy device is operable to receive the certain criteria via a push or pull from the plurality of caching devices.","In another example embodiment, the certain criteria is locally generated at the proxy device and is based on a request history at the proxy device.","Embodiments herein include an example method for proactively loading resources on a local caching device associated with a community of local caching devices, wherein the community of local caching devices is communicatively coupled via an access network to at least one content delivery network (CDN) caching device.","The example method comprises steps for, in response to determining that a given resource meets certain popularity criteria and is not stored on the local caching device, determining whether the given resource is stored on at least one other local caching device in the community.","If so, method comprises steps for retrieving the given resource from the at least one other local caching device, wherein the at least one other local caching device has determined that the given resource meets certain popularity criteria and has retrieved the given resource from the at least one CDN caching device via the access network.","The example method further comprises steps for, in response to determining that the given resource is not stored on at least one other local caching device in the community, retrieving the given resource from the at least one CDN caching device via the access network.","The example method further comprises steps for prompting a given local caching device that is not already associated with the community of local caching devices to join the community of local caching devices, and, if the given local caching device affirmatively responds to the prompt to join the community of local caching devices, adding the given local caching device to the community of local caching devices.","In an example embodiment, the certain popularity criteria comprise a number of requests for the given resource that were received at the local caching device during a given time interval, availability of storage space on the local caching device, total capacity of the local caching device, type of storage on the local caching device, and popularity rankings of other resources stored on the local caching device.","Embodiments herein include an example system comprising a redirection server and a plurality of caching devices situated within a wireless network.","The redirection server is operable to receive a request for a resource originating from a wireless client device connected to the wireless network, wherein the redirection server is further operable to select at least one of the plurality of caching devices to deliver the requested resource to the wireless client device based on at whether a caching device has the requested resource, proximity of the caching device to the wireless client device, and wireless network conditions.","The selected at least one caching device is operable to initiate delivery of the requested resource to the wireless client device from within the wireless network.","In an example embodiment, the plurality of caching devices are operable to retrieve the requested resource from one or more content delivery network (CDN) caching devices communicatively coupled with the wireless network.","In an example embodiment, the redirection server is operable to intercept the request and determine whether to select at least one of the plurality of caching devices based on a popularity of the requested resource.","The redirection server is also operable to redirect the wireless client to the at least one selected caching device for delivery of the requested resource.","In an example embodiment, the redirection server is situated within the wireless network.","In an example embodiment, a caching device is locally proximate to the wireless client device and is operable to wirelessly delivery the requested resource to the wireless client device.","The locally proximate caching device is further operable to retrieve the requested resource from one or more content delivery network (CDN) caching devices communicatively coupled with the wireless network.","In another embodiment, the locally proximate caching device is a Wi-Fi hotspot.","In an example embodiment, a caching device is situated within a cellular core network and/or a radio access network of the wireless network.","In another embodiment, a caching device is proximately situated with at least one of a radio network controller (RNC), a serving general packet radio service (GPRS) support node (SGSN), and a gateway GPRS support node (GGSN) of the wireless network.","BRIEF DESCRIPTION OF THE DRAWINGS Other objects, features, and characteristics of the present invention, as well as the methods of operation and functions of the related elements of structure, will become more apparent upon consideration of the following description and the appended claims with reference to the accompanying drawings, all of which form a part of this specification.","FIG.","1 illustrates an example network environment 100 suitable for implementing various embodiments disclosed herein, including a high level depiction of a content delivery network (CDN) in accordance with an embodiment of the present invention.","FIG.","2 illustrates the CDN of FIG.","1 having deep caching infrastructure in accordance with embodiments of the present invention.","FIG.","3 illustrates the CDN of FIG.","1 having deep caching infrastructure in accordance with embodiments of the present invention.","FIG.","4 illustrates an example process for retrieving a resource using the CDN of FIG.","2 in accordance with embodiments of the present invention.","FIG.","5 illustrates an example process for retrieving a resource using the CDN of FIG.","2 in accordance with embodiments of the present invention.","FIG.","6A illustrates an example process for initializing the deep caching infrastructure of FIG.","3 in accordance with embodiments of the present invention.","FIG.","6B illustrates an example process for proactively loading content in accordance with embodiments of the present invention.","FIG.","6C illustrates an example process for determining popularity in accordance with embodiments of the present invention.","FIG.","6D illustrates an example process for replicating objects in accordance with embodiments of the present invention.","FIG.","7 illustrates the CDN of FIG.","1 adapted for a wireless network in accordance with embodiments of the present invention.","FIG.","8 illustrates the CDN of FIG.","1 adapted for a wireless network in accordance with embodiments of the present invention.","FIG.","9 illustrates the CDN of FIG.","1 adapted for a wireless network in accordance with embodiments of the present invention.","FIG.","10 illustrates the CDN of FIG.","1 adapted for a wireless network in accordance with embodiments of the present invention.","DETAILED DESCRIPTION Although the present invention has been described with reference to various embodiments, it will be understood that the invention is not limited to the details thereof.","Various modifications and substitutions will occur to those of ordinary skill in the art.","Deep Caching with Access Networks FIG.","1 illustrates an example network environment 100 suitable for implementing various embodiments disclosed herein.","The example network environment 100 comprises the Internet 101 (i.e., a large and diverse public network comprising one or more interconnected asynchronous systems) communicably coupled to access networks 102, 104, and 106.Note that access networks 102, 104, and 106 can be under the control of or operated/maintained by one or more entities, such as, for example, one or more Internet Service Providers (ISPs) that provide access to the Internet 101 for consumers/end-users (e.g., residential, enterprise, etc.)","and/or content providers.","In the example network environment 100 of FIG.","1, each access network provides Internet access to several residential end-users, denoted as houses.","Network environment 100 further comprises one or more CDNs for delivery of electronic resources (e.g., video, images, music, software, games, cloud resources, etc.)","and other content from content providers to end-users across Internet 101.The one or more CDNs each have a number of CDN caches located in various strategic locations (both physical and logical) in Internet 101—e.g., CDN cache cluster 110 (DC), CDN cache cluster 112 (NYC), CDN cache cluster 114 (CHI), CDN cache cluster 116 (SEA), CDN cache cluster 118 (LA), and CDN cache cluster 120 (HOU).","At a high level, FIGS.","2 and 3 illustrate example network environments 200 and 300 suitable for implementing various embodiments disclosed herein.","These networks are used to deliver resources to clients that are communicatively connected to an access network, and each include embodiments of what are referred to interchangeably as “deep caches,” “shared caches” or “local caches,” which are intended to represent cache devices on the client-side (or subscriber-side) of the access networks.","For example, the client-side (or subscriber-side) of the access network can include cache devices that are topologically, physically, and/or logically closer to clients than an access network's Internet connection points.","Such so-called “deep caches,” “shared caches” or “local caches,” which are preferably operated by or on behalf of CDN providers, provide client devices the opportunity to retrieve resources without having to communicate with storage devices across the access networks.","More specifically, the network environment 200 in FIG.","2 represents an example of a deep cache infrastructure whereby deep caches 202, 204 and 206 are deployed outside of access networks at a relatively close proximity to the access networks' end-users/subscribers.","Likewise, the network environment 300 in FIG.","3 represents an example of a deep cache infrastructure whereby deep caches (e.g., 320a, 320b, 320c) are deployed outside of access networks at a relatively close proximity to the access networks' end-users/subscribers.","In the example configuration of FIG.","2, network environment 200 comprises Internet 101, access network 104, CDN caches (DC) 110, and CDN caches (HOU) 120.Although any number of CDNs can service and deliver content to any of the regions and houses shown in FIG.","2, assume that only a single CDN services and delivers content to the end-users/subscribers of access network 104.In network environment 200, the CDN comprises a CDN Domain Name System (DNS) 201 that resides, at least in part, within Internet 101 (and/or is communicably coupled to Internet 101) and is also communicably coupled across Internet 101 to CDN caches (DC) 110 and CDN caches (HOU) 120.CDN DNS 201 comprises one or more CDN DNS servers that are responsive to requests for content from end-users; and determines, based on several factors and parameters, at least one appropriate or suitable CDN cache for delivering the requested content to end-users.","Still referring to FIG.","2, shared caches 202, 204, and 206 are deployed on the client/subscriber-side of the access network 104.Each shared cache is shared amongst proximately located end-users (e.g., via wired access, Wi-Fi hotspot, powerlines, etc.).","In a preferred embodiment, communication amongst the clients is accomplished by way of a new technology being developed named White Space Wi-Fi (or by way of one or more of any other available and/or suitable wireless spectrums for that matter).","Access network 104 comprises a DNS 214 having one or more DNS servers.","In addition to providing conventional DNS services to end-users of access network 104, DNS 214 can interact with CDN DNS 201 in furtherance of providing CDN access to end-users of access network 104 (e.g., via redirection).","In embodiments described in FIG.","2, various functionality and techniques can be used to effectively override the need for the DNS 214 and DNS 201 in circumstances in which it is optimal for the shared caches 202, 204 and 206 to deliver a resource that is requested by a client.","FIG.","4 is a flow diagram illustrating a process for use in delivering a resource to a client in the network environment 200 in which a DNS resolver on a client (or otherwise accessible to a client) redirects the client to a shared cache 202, 204 and 206 as opposed to resolving the client to the CDN caches (e.g., 120), in accordance with embodiments of the present invention.","Such a circumstance occurs if the request (e.g., domain name or any other identifying information in the case of a proxy) meets certain “deep cache” criteria and/or thresholds.","Exemplary deep cache criteria and/or thresholds can be based on content-based characteristics such as popularity, size, type, genre, creation date, etc., and/or client-based characteristics such as client device type, connection type/speed, storage capacity/availability, etc., and/or any other distinguishing factor or characteristic (e.g., on a hostname basis for DNS requests).","If, however, a resource does not meet such criteria or thresholds, then the client engages in normal DNS resolution and is served the requested resource from either a CDN cache 120 or an origin server.","FIG.","5 is a flow diagram illustrating a similar process as in FIG.","4, but instead employs a proxy instead of a DNS resolver on a client.","For example, the proxy can be software executing on the client device or a separate device capable of performing proxy server/cache functionality.","In another embodiment, intelligent traffic management can be used to complement or supplement DNS processing.","Still referring to FIG.","2 and according to another example embodiment, each end-user (e.g., house) has access to its own domain name resolver (e.g., in conjunction with a PC, laptop, set-top box, Roku Box, smart phone, tablet, etc.).","These end-user name resolvers can be pre-populated and/or periodically/intermittently populated (via push and/or pull) with a list or mapping of specific domains that are determined to be popular, desirable, strategic, etc.","by one or more content providers, CDNs, third party entities, etc., or any combination thereof (or organically by the domain name resolver itself using, for example, historic/cached data, histograms of traffic patterns, etc.).","Additionally, end-user name resolvers can be pre-populated and/or periodically/intermittently populated (via push and/or pull) with a regular expression usable to identify specifically requested domains that are similarly determined to be popular, desirable, strategic, etc.","In this manner, content associated with popular (or desirable, strategic, etc.)","domains can be preemptively loaded (i.e., pre-fetched) into one or more shared caches so that the domain name resolver can immediately resolve the request for content to a shared cache directly connected (or indirectly connected, but in close proximity, that is, on the client-side of an access network) to the requesting end-user device.","For example, if an end-user requests content (e.g., via a web interface, set-top box, Roku℠ Box, etc.","), the associated end-user domain name resolver can determine if the domain associated with the requested content is deemed popular (e.g., by comparing with the list or mapping of domains, comparing against a regular expression, etc.)","and, if so, redirect the end-user device to request content from at least one shared cache.","Furthermore, CDN operators, content providers, etc., can employ a centralized and/or regional system to dynamically and strategically distribute such lists/mappings of domains or regular expressions to the various client devices.","Again referring to FIG.","2, another example embodiment employs one or more proxy devices 208, 210 (e.g., DNS proxies) situated between the client devices and DNS 214 of access network 104 whereby the proxies are operable to transparently intercept client requests.","Similar to the end-user name resolvers previously described, the proxies 208, 210 can be pre-populated and/or periodically/intermittently populated (via push and/or pull) with a list or mapping of specific domains that are determined to be popular, desirable, strategic, etc.","by one or more content providers, CDNs, third party entities, etc., or any combination thereof (or organically by the proxies themselves using, for example, historic/cached data, histograms of traffic patterns, etc.).","Additionally, proxies can be pre-populated and/or periodically/intermittently populated (via push and/or pull) with a regular expression usable to identify specifically requested domains that are similarly determined to be popular, desirable, strategic, etc.","In this manner, content associated with popular (or desirable, strategic, etc.)","domains can be preemptively loaded (i.e., pre-fetched) into one or more shared caches so that the proxy can redirect requests for content (e.g., via an HTTP redirect) to one or more shared caches directly connected (or indirectly connected, but in close proximity, that is, on the client-side of an access network) to the requesting end-user device.","For example, if an end-user requests content (e.g., via a web interface, set-top box, RokusM Box, etc.","), the proxy 208 or 210 can intercept that request and determine if the domain associated with the requested content is deemed popular (e.g., by comparing with the list or mapping of domains) and, if so, redirect the end-user device to request content from at least one shared cache.","Note that a proxy is not necessarily limited to analyzing the domain name associated with a request (as may be the case with a DNS device or agent) and can analyze additional information in the request's URL (e.g., at the HTTP level) such as paths, tokens, hashes, name-value pairs, etc.","Furthermore, CDN operators, content providers, etc., can employ a centralized and/or regional system to dynamically and strategically distribute such lists/mappings of domains (or paths, tokens, hashes, name-value pairs, etc.)","and/or regular expressions to the various proxies.","According to an example embodiment, the proxies and/or DNS agents/devices can extract additional information from the client request to better perform deep caching functionality (e.g., rendezvous) as described herein.","For example, a client request can contain specific information such as the client or end user IP address, in home cache IP address, master cache IP address, content classification data (e.g., title, type, encoding, etc.","), delivery protocol, and the like.","This specific information can be added to the client request by software executing on the client device, by content providers, by CDNs, or by any other suitable entity capable of modifying client requests.","It is also contemplated that one or more shared caches can perform the proxy functionality as described above.","In such a configuration, and assuming the shared cache determines that the requested resource should be served from at least one shared cache (e.g., based on popularity), the shared cache would: i) redirect the client to one or more other shared caches (e.g., if that shared cache does not have a copy or a substantial portion of the requested content and/or the other shared caches do, if network conditions favor delivery from other shared caches, etc.","); ii) “hand-off” the request to one or more other shared caches (e.g., transparently to the requesting client via Transmission Control Protocol “TCP”) so that the other shared cache(s) can take over the handling of the request and initiate delivery of the requested content in lieu of a redirect; or, iii) serve the content itself (e.g., if that shared cache has a copy or substantial portion of the requested content or can retrieve a copy of the requested resource from another CDN cache or shared cache).","Turning now to FIG.","3, the network environment 300 comprises Internet 101, access network 104, CDN caches (DC) 110, and CDN caches (HOU) 120.Although any number of CDNs can service and deliver content to any of the regions and houses shown in FIG.","3, assume that only a single CDN services and delivers content to the end-users/subscribers of access network 104.In network environment 300, the CDN comprises a CDN Domain Name System (DNS) 201 that resides, at least in part, within Internet 101 (and/or is communicably coupled to Internet 101) and is also communicably coupled across Internet 101 to CDN caches (DC) 110 and CDN caches (HOU) 120.CDN DNS 201 comprises one or more CDN DNS servers that are responsive to requests for content from end-users; and determines, based on several factors and parameters, at least one appropriate CDN cache for delivering the requested content to end-users.","Still referring to FIG.","3, the network environment 300 also comprises shared caches deployed on the client-side of the access network 104.As with FIG.","2, the shared caches shown in FIG.","3 are preferably operated by the CDN provider.","In contrast to the embodiments of FIG.","2, the shared caches reside as storage at a plurality of the client homes and are shared amongst the clients via a common network infrastructure 302, 304 and 306, such as, without limitation, wired access, Wi-Fi hotspot, powerlines, etc.","(also referred to as a “residential wireless cloud”).","In a preferred embodiment, communication amongst the clients is accomplished by way of White Space Wi-Fi or one or more of any other available and/or suitable wireless spectrums.","While shared caches 320a-320c in accordance with the embodiment of FIG.","3 are only shown at three clients, it should be appreciated that numerous clients include such shared caches 320a-320c and that an aggregate of such clients that operate shared caches (e.g., 320a and 320b) are referred to as a “community.” For example, each of common network infrastructure 302, 304 and 306 can represent such a community.","In accordance with various embodiments described herein, a shared cache 320a, 320b, 320c depicted in FIG.","3 (also referred to as an “in home cache”) can be a device situated in residential homes and on residential users' home networks.","Such a shared cache acts as a storage device for content that may be consumed by that residential user or other users that are reachable through a residential wireless cloud (e.g., common network infrastructure 302, 304, 306).","The storage within the device could be any type of storage including, for example, spinning disk, flash memory, and the like.","In addition to the storage, the shared cache has software that allows it to participate as part of a CDN with the ability to load content from the CDN and share content with other similar devices through the residential wireless cloud.","To support the exchange of data through the residential wireless cloud, the shared cache will have wireless transmission and receipt capabilities.","The shared cache can take on many forms including, for example, a standalone device that acts as an in-line cache in the home network, an end user PC with the CDN-specific software loaded thereon and at least some of the device's storage allocated to this function, or the shared cache can be integrated as a part of an in home appliance such as a television, gaming console or any other network connected devices.","FIG.","6A illustrates an example process for initializing the deep caching infrastructure of FIG.","3 in accordance with embodiments herein.","Upon initialization of a client device (e.g., boot-up, initialization of a process or application, installation of software, etc.","), the client device is prompted with an option to join a community.","For example, the prompt may be presented via a graphical user interface (GUI) to a user of the client device.","Then, if client device (e.g., via the GUI, a preconfigured setting, etc.)","returns an affirmative decision to join the community, the client device (and any in-home cache associated therewith) is added to the community.","In one embodiment, the client device (and/or its associated in-home cache) sends an “add me to the community” indication to the master cache, community-designated proxy, and/or one or more other members (e.g., shared caches, client devices, in-home caches, etc.)","of the community.","In response, the master cache, community-designated proxy, and/or one or more other members of the community update their respective community member lists to indicate inclusion of the newest member.","With regard to both network environment 200 and network environment 300, another embodiment of the present invention contemplates a capability for a shared cache deployed within an access network to preemptively (or proactively) download and store/cache (e.g., pre-fetch) content that is deemed popular (preferably occurring during off-peak hours for the access network and/or residential wireless cloud).","For example, a shared cache can receive popularity information from its CDN (or one or more content providers, third party entities, etc.)","and/or derive its own organic popularity data (e.g., using historical data such as histograms of traffic patterns, etc.)","in furtherance of preemptively downloading and storing content that has not yet been (or has been infrequently) requested from the shared cache—depending on the popularity algorithms and policies being employed and enforced.","For example, such popularity determinations may be used as a factor in connection with selection of an appropriate shared cache for a particular client.","Continuing with the example embodiment above, the in home cache sends a request (e.g., per a configured time and frequency) to a network based pro-active content loading application (e.g., predictive content engine 312).","The request to the predictive content engine 312 contains the usage and other data collected by the in home cache that would be useful in predicting content that may be requested by the end users in the home.","This request is preferably implemented using standard HTTP based protocols, although other protocols may be used as well.","In turn, the predictive content engine 312 analyzes the data sent from the in home cache and responds with a list of content that it believes the end-users at home may want to watch at a future date.","The in home cache then processes the list of content provided by the predictive content engine 312 and uses a proactive loading algorithm to determine which content in the list, if any, should be loaded.","For instance, the in home cache may have a configured set of times or network performance characteristics that specify an appropriate time for proactively loading the content.","FIG.","6B is a flow chart showing example processing steps of a proactive loading algorithm used by an in home cache.","Any number of techniques may be used to determine the popularity of a content object.","For example, popularity of an object can be determined based on the number of requests and/or the request rate.","Popular objects typically have higher request rates or higher number of requests than unpopular objects.","Popularity can also be determined by tracking the last X number of request times for an object and then using the difference between the current time and the X number of request times to calculate a running average for how often the object is requested.","Similarly, popularity can be gauged on the request rate for an object that is weighted for more recent requests for the object (which is a predictor that the object will be requested again).","As another example, an exponential decay method and an artificial neural network could be used to determine the popularity of an object.","According to an example embodiment of a popularity computation and referring to FIG.","6C, the popularity of an object is based on the request rate of the object which is computed over a sliding time window in a discrete manner.","As such, the variable I denotes the time interval over which the popularity of an object is measured.","The time interval is divided into N equal sub-intervals of duration I/N.","As will be apparent, the time interval is not required to be equally divided and may instead be divided in other manners.","Furthermore, a linked list P of size N is created for each object.","The value of N determines the quality of approximation (e.g., the smaller the value of N, the coarser the approximation).","The first element P[1] of the list records the number of requests that were received when the current time was within the first sub-interval, the second element P[2] records the number of requests that were received when the current time was within the 2nd interval, and so on.","When a new sub-interval is received, the list is rotated such that P[I] becomes P[I+1] (except for P[N] which becomes P[1]); so, for example, P[1] becomes P[2], P[2] becomes P[3], and P[N] becomes P[1].","After the rotation, the new P[1] is reset to zero.","Accordingly, only the end time of the first sub-interval needs to be recorded and compared against the current time to check if the list should be rotated.","For each new request within the sub-interval, P[1] is simply incremented by 1.In this way, the arrival time of each request need not be recorded.","In another example embodiment, the popularity of an object is simply the sum of all numbers in the list.","To make the computation more efficient, the sum of P[2]+P[3]+ .",".",".","+P[N] is stored in a register M. The popularity can then be computed by adding P[1] to M. When a rotation occurs, the new value of M becomes M+=P[1]−P[N].","Note that the popularity of an object may be queried constantly.","Thus, to avoid the extra addition involved for each such inquiry, the value of P[1] can be set to M after the rotation.","Then, the value of P[1] is the popularity of the object.","Referring to FIG.","6C, an example popularity computation algorithm may be summarized as follows.","The linked list P of size N for an object, wherein each of P[1] .",".",".","P[N] represents a time sub-interval, is initialized (at 605).","The popularity M is also initialized (at 610).","If there is a request for the object while the current time is within the current time sub-interval (at 615), then the value of P[1] is incremented by 1 (at 620).","If the current time is within a new time sub-interval (at 625), then the value of P[1] is decremented by the value of M, M is incremented by P[1]−P[N], the list P is rotated, and P[1] is set to the value of M (at 630).","Then, provided the popularity computation is continued (at 635), that is, the popularity computation is not terminated, the popularity computation algorithm repeats itself.","Furthermore, any number of techniques may be used to initiate replication of an object.","A cache server (or in home cache) might replicate an object on the first request by a client for the object.","Alternatively, the cache server (or in home cache) may be tuned to wait until a specific number or range of requests are received for the object.","In other implementations, the object may be pulled or replicated if the object is more popular (e.g., has a higher request rate) than the least popular object currently in storage.","In yet another alternative, the replicating decision can be a function of the popularity of the object, the cost of storing the object, the (available) storage capacity of the cache server (or in home cache) and/or the type of storage (e.g., spinning disk, flash memory, etc.","), the cost of pulling the object from the network (e.g., network capacity), as well as any other relevant cost factors.","Note that since the popularity of objects may change significantly with time, initiating a pull decision of an object based purely on a fixed threshold does not necessarily capture this dynamic nature of popularity.","A replication policy that compares against the least popular of replicated objects has its limitations, although the policy does not use a fixed threshold.","Consider where the storage is only half full but all the replicated objects are extremely popular.","Since only objects exceeding the least popular of the replicated objects will be replicated under this replication policy, objects with moderate popularity will be rejected despite the fact that there is plenty of storage space available and the objects are reasonably popular.","Accordingly, a replication scheme should be able to automatically adjust the replication threshold by taking into consideration the dynamic nature of popularity and the available storage capacity.","If there are more popular objects than the storage capacity allows, the replication scheme should raise the threshold.","If there is more available storage capacity, the replication scheme should decrease the threshold so that more objects can be stored.","According to an example embodiment of a replication scheme and referring to FIG.","6D, an object is replicated into storage (at 650) when the popularity P of the object is greater than the initial threshold PI (at 640) and when there is enough space in the storage to replicate the object (at 645).","If there is not enough storage to replicate the requested object, a replacement algorithm is performed in which the popularity P of the object is compared against the popularity PL of the least popular object in the storage (at 655).","If P is greater than PL, the current least popular object is added to a candidate list for removal (at 660).","If it is determined that upon removing the object(s) in the candidate list (initially only the most recent least popular object) there would be enough storage (at 670), then the object(s) in the candidate list are removed and PL is updated (at 690), and then the object is replicated into storage (at 650).","If, on the other hand, it is determined that upon removing the object(s) in the candidate list there would not be enough storage (at 670), then it is determined whether PL is PM (i.e., where PM is the current most popular object) (at 675) and, if so, PL is reset to the initial least popular object (at 685) and the operation ends without replication (i.e., there would not be enough storage if all PL through PM objects were removed).","If PL is not yet PM, then PL is updated (i.e., iterated) and the operation cycles again to step 655.Note that the candidate list mitigates the risk of removing one or more objects from storage before ever replicating an object since, as the case may be, the object may not even be replicated after performing the removal operations (e.g., because the object is larger than the overall storage capacity).","In an example embodiment, an in home cache (e.g., shared cache 320a, 320b, 320c) has the capability of collecting and storing usage data for the client devices that are requesting content from within the community or common network infrastructure to which it is connected.","For example, this data could be a record of actual content played on in home devices, information describing other internet usage occurring in the home, GPS information that provides physical location data, demographic or user preference data entered by users in the home through an interface provided by the software on the in home cache, etc.","Referring again to FIG.","3, the community of shared caches can use various techniques for request handling/processing, distributed storage, and delivery of content.","For example, in one example embodiment a particular shared cache in the community is designated as a master cache (e.g., shared cache 320a) while the other shared caches in the community function in a subordinate manner to this master cache.","The master/subordinate designations can be assigned by the CDN, content provider, and/or by the community of shared caches themselves.","Content requests originating within the community can be routed through the master cache or transparently intercepted similar to the proxy functionality previously discussed.","Upon receiving such a request, the master cache can determine whether or not the request should be serviced by one or more of the shared caches in the community (or, possibly, one or more shared caches in one or more separate communities) based on techniques previously described (e.g., popularity, filtering against domain lists/mappings or regular expressions, etc.).","Or, alternatively, the master cache can receive a request from a client device in the community that has already made such a determination via the client domain name server (i.e., wherein the client's domain name server resolved the request to the master cache).","Either way, if it is determined that the request should be serviced from within the community, the master cache can (initially or further) redirect the requesting client to one or more shared caches in the community, and/or service the request and initiate delivery of the content itself.","It should be noted that the master cache may or may not be associated with (or operated in conjunction with) a particular client or house within the community.","In other words, the master cache could be an independent or stand-alone shared cache as described above with respect to FIG.","2.It should be further noted that a community-designated proxy (e.g., proxy 310) may be substituted for the master cache in order to perform (transparent) interception and redirection of content requests that originate from within the community to other shared caches within the community.","Still further it should be noted that the functionality associated with a master cache or community-designated proxy is not necessarily limited to a single device.","As such, two or more devices within a community may share such master cache and/or proxy functionality (e.g., as a statically or dynamically designated secondary, tertiary, etc., master cache/proxy).","For example, such distributed or redundant master cache/proxy functionality can be useful for load-balancing, failover, scalability, etc.","Continuing with the example embodiment above, the master cache can monitor and maintain an awareness of the other subordinate shared servers and the content stored thereon.","For instance, the master cache can maintain a table or a mapping that includes, by way of non-limiting example, data associated with content stored on each shared cache (e.g., object names/titles, object/file sizes, partial object/file data, specific content location information such as URLs or portions thereof, etc.","), load and/or storage capacity of each shared cache, cache status information (e.g., whether or not a shared cache is functional or online), global popularity of stored content (i.e., per a CDN or content provider), local popularity of stored content (i.e., per one or more communities), and the like.","The master cache can periodically/intermittently pull this information from each subordinate shared cache and/or each shared cache can periodically/intermittently push this information to the master cache.","Having collected such community awareness information, the master cache can then use this information to redirect content requests originating within the community to the most appropriate or suitable shared cache(s) in the community.","Community awareness information can also be used in furtherance of traffic engineering techniques such as bandwidth throttling (due to the asymmetric nature of CDN traffic flows) and load shedding amongst the community of shared caches.","Note that a content request can be serviced by one or more caches that serve one or more different portions of the requested content to the requesting client (simultaneously and/or at different times).","In yet another example embodiment with reference to FIG.","3, a common addressing scheme is used to determine the most appropriate or suitable shared cache(s) in the community for servicing a request for content.","As such, each shared server in the community would be assigned a common address (e.g., IP address).","Assume, for example, that a client within the community makes a content request and it is determined that the requested content should be served from a shared cache within the community (i.e., the determination being made via the client's name server, master cache, or via a community-designated proxy, as previously discussed).","In such a case, the client's name resolver would resolve the request to the common address, or the proxy would redirect the request to the common address.","Thus, by using the common address the client would send (or broadcast) the request to each shared cache in the community and, in doing so, the client can select which shared cache(s) will ultimately serve the content (typically the first shared cache to respond with an indication that it is able and willing to service the request).","It is also contemplated that a master cache or community-designated proxy can further use this common addressing scheme on a more granular level.","For example, a master cache or community-designated proxy can associate a common address to particular content (thus assigning the common address to only those shared caches that have the particular content) such that requests will be redirected to only those shared servers that have the particular content.","In one example embodiment, a first set of shared caches in a community are designated for storing and servicing a first type of content/service, while a second set of shared caches are designated for storing and servicing a second type of content/service.","As such, the first set of shared caches could be assigned a first common address so that requests for a first type of content would be redirected (or resolved) to only the first set, while the second set of shared caches could be assigned a second common address so that requests for a second type of content would be redirected (or resolved) to only the second set, and so on.","According to yet another example embodiment, a client can issue a type of point-to-multipoint content request (e.g., per a redirect) to each shared cache in the community.","To do this, the client would be provided (e.g., by a CDN, content provider, master cache, community-designated proxy, etc.)","a list of addresses (e.g., IP addresses) of each shared cache in the community.","In this sense, the designation of the community of shared caches can be access network or ISP independent.","Note that the list can be dynamically updated and modified by whichever entity provides the list to the client.","In another example embodiment, the community of shared caches is based on one or more subnets of the access network or ISP.","In this configuration, a client can issue a content request (e.g., per a redirect) to each shard cache in the community by broadcasting the request to one or more access network or ISP subnet address.","A further embodiment contemplates the use of multicasting (e.g., IP multicasting) for content request routing/handling among a community of shared caches.","In such a configuration, each shared cache (e.g., upon going online) would register with a multicast address group associated with each of the other shared caches in the community (e.g., using Internet Group Management Protocol “IGMP”).","Thus, a client associated with a shared cache can issue a content request (e.g., per a redirect) to its multicast group to which each of the other shared caches in community have subscribed.","In an example embodiment, the master cache or community-designated proxy administers and manages the multicast groups by keeping track of which shared caches belong to the community.","Deep Caching with Wireless Networks At a high level, FIGS.","7-10 illustrate example network environments 700, 800, 900, and 1000, respectively, which are suitable for implementing various embodiments disclosed herein.","Similar to the configurations previously described, these networks are used to deliver resources to clients (also commonly referred to as user equipment “UE”) that are communicatively connected to a wireless network (examples of which are described below), and each include embodiments of what are referred to interchangeably as “deep caches,” “shared caches,” “local caches,” or “transparent caches,” (collectively referred to as “flex caches”) which are intended to represent cache devices situated within or around the wireless network.","Such so-called “flex caches,” which can be operated by or on behalf of CDN providers, wireless network providers, content providers, other third party entities, etc., and/or any combination thereof, provide client devices (or UEs) the opportunity to request and retrieve resources without having to necessarily communicate with storage devices/servers across the Internet (and/or any other wireline network to which the wireless network directly or indirectly connects).","In particular, the flex caches (and, in some example implementations, in connection with particular servers such as redirection/translation servers) provide deep caching functionality as previously described such that content can be stored/cached within the wireless network (e.g., preemptively or dynamically caching content, for example, from content providers associated with the CDN).","According to example embodiments, the flex caches can also provide transparent caching of content as the content is retrieved upstream from the CDN (or from other storage devices/servers either directly or indirectly connected to or located in the Internet).","In another example embodiment, the flex caches can pre-fetch content (e.g., when content becomes or is deemed popular or desirable), thus enabling faster and more efficient delivery of content to clients/UEs of the wireless network.","It should be noted that the wireless networks described herein are not limited to any particular wireless network configuration, standard, protocol, or generation.","For instance, wireless networks are contemplated to include second, third, or fourth generation (2G/3G/4G) mobile/cellular networks such as, for example, 3G UMTS/HSDPA/HSUPA networks (Universal Mobile Telecommunications System/High-Speed Downlink Packet Access/High-Speed Uplink Packet Access), GSM/GPRS networks (Global System for Mobile Communications/General Packet Radio Service), 4G LTE/WiMax networks (Long Term Evolution/Worldwide Interoperability for Microwave Access), CDMA networks (Code Division Multiplex Access), and the like, as well as Wi-Fi networks, satellite networks, and/or any other networks or wireless spectrums capable of directly or indirectly delivering content to wirelessly connected clients/UEs.","The embodiments described herein also contemplate integration and interoperability with future configurations, standards, protocols, and generations of wireless networks.","Turning now to FIG.","7, the example network environment 700 comprises Internet 101, CDN caches 120, at least one CDN DNS 201, cellular core network 705, and Radio Network Controller (RNC) backhaul network 710.Internet 101 is communicably coupled with cellular core network 705 via at least one Gateway GPRS Service Node (GGSN) 715, and cellular core network 705 is communicably coupled with RNC backhaul network 710 via at least one Serving GPRS Support Node (SGSN) 720.RNC backhaul network 710 is communicably coupled with one or more RNCs 725, and the RNCs 725 are communicably coupled with one or more Base Transceiver Stations (BTSs) or Node Bs 730 (the RNCs 725 and BTSs/Node Bs 730 collectively form a so-called Radio Access Network “RAN”).","Node Bs 730 are operable to wirelessly communicate with UEs 735 (e.g., clients using wireless devices such as smart phones, tablets, laptops, or any other devices suitable for wirelessly connecting to a network).","Example network environment 700 further comprises a cache hierarchy in the wireless network including zero or more flex caches 740 situated at or between GGSN 715 and SGSN 720 (e.g., within cellular core network 705), zero or more flex caches 745 situated at or between SGSN 720 and RNCs 725 (e.g., within RNC backhaul network 710), and zero or more flex caches 750 situated at or between RNCs 725 and their respective Node Bs 730.Although any number of CDNs can service and deliver content to wireless networks, it should be noted that as in the previous embodiments and figures, assume that only a single CDN services and delivers content to the clients/UEs 735 in FIGS.","7-10.Still referring to FIG.","7, and in general operation, the CDN is operable to deliver content to clients/UEs 735 via any of the flex caches in the cache hierarchy of the wireless network.","For example, and in conjunction with techniques previously described, content may be preemptively stored on any of the flex caches 740, 745, or 750, to anticipate requests for content from clients/UEs 735.Content may be stored on different caches within the hierarchy depending on the policies implemented by the CDN, content provider, and/or the wireless network provider (e.g., popularity computation algorithms and replications policies per FIGS.","6B-6D).","The policies can include factors such as, for example, content popularity, content type, content size, information associated with the client or the user equipment, transmission protocol, data format, network conditions, etc.","Example data flows (i.e., requests for content, inter-cache communications, redirection of requests, distributed storage schemes/protocols/communications, and delivery of content, etc.)","are discussed below with respect to FIGS.","8-10.FIG.","8 depicts an example network environment 800 similar to the example network environment 700 of FIG.","7, and further comprises one or more redirection/translation servers 805 situated at or between GGSN 715 and SGSN 720 (e.g., within the cellular core network 705).","Redirection/translation server 805 is configured to handle and redirect requests for content within the wireless network.","As conventional wireless networks (i.e., cellular/mobile networks) are currently not capable of (or are otherwise ineffective at) handling/processing traditional Layer 3 or higher communications (e.g., DNS name resolving, HTTP requests for content, File Transfer Protocol “FTP” or Peer-to-Peer “P2P” communications, etc.","), the redirection/translation server 805 can be used to translate requests (e.g., via decapsulation and re-encapsulation) from the wireless domain and then process those requests as if a traditional wireline network device (e.g., DNS server, CDN cache/server, proxy server, etc.)","were handling the request.","In an example embodiment, the redirect/translation server 805 is configured to transparently intercept and handle a request for content from a client/UE 735 before the request exits the wireless network (i.e., before the request is passed to the Internet for further handling/processing).","According to another example embodiment, redirection/translation server 805 is capable of redirecting sessions within the wireless network.","Using information about where or how content is stored within the CDN (i.e., either in the Internet 101 or within the cache hierarchy of the wireless network at the various flex caches), the redirection/translation server 805 can redirect a content request to a flex cache suitable for efficiently delivering content to the requesting client/UE 735.Similar to embodiments previously described, redirection/translation servers can be pre-populated and/or periodically/intermittently populated with a list or mapping of specific domains that are determined to be popular, desirable, strategic, etc.","by one or more content providers, CDNs, third party entities, etc., or any combination thereof (or by even the redirection/translation servers themselves using, for example, historic/cached data).","Note that regular expressions may be used in addition to the list or mapping of specific domains as previously described.","In this manner, content associated with popular (or desirable, strategic, etc.)","domains can be preemptively loaded into one or more flex caches so that the translation/redirection servers can redirect UE-initiated requests for content (e.g., via an HTTP redirect) to one or more flex caches.","For example, if a UE requests content, the redirection/translation server 805 can handle/process that request and determine if the domain associated with the requested content is deemed popular (e.g., by comparing with the list or mapping of domains, comparing against a regular expression, etc.)","and, if so, redirect the UE to request content from at least one flex cache.","Furthermore, CDN operators, content providers, etc., can employ a centralized and/or regional system to dynamically and strategically distribute such lists/mappings of domains (or regular expressions) to the various redirection/translation servers.","According to example embodiments, the suitability of the flex cache for delivering the content may be based on factors such as, for example, whether the flex cache already has a copy (or at least a portion) of the requested content, the proximity of the flex cache to the client/UE (physically and/or logically), network conditions within the wireless network, global or local popularity of the content, content size, content type, transmission protocol, data format, information associated with the client or user equipment, etc.","Redirect/translation server 805 can become aware of where or how content is stored within the wireless network via updates (e.g., push or pull) from the flex caches (e.g., either individually or via a hierarchical flow of information) or from the CDN devices in the Internet 101 (e.g., CDN DNS 201 or CDN caches 120).","FIG.","9 depicts an example network environment 900 similar to the example network environment 800 of FIG.","8, and further comprises one or more redirection/translation servers 905 situated at or between SGSN 720 and RNCs 725 (e.g., within the RNC backhaul network 710).","In addition to a flex cache hierarchical structure, example network environment 900 further represents a redirection/translation server hierarchical structure.","As such, redirection/translation server functionality can be utilized at various levels/tiers/depths/etc.","within the wireless network.","FIG.","9 additionally shows an on-air cache 910 in communication with a flex cache 750 associated with an RNC 725.According to an example embodiment, the on-air cache 910 serves as a sort of hotspot for UEs 735 (e.g., Wi-Fi at airports, stadiums, malls, hotels, office buildings, etc.","), wherein the on-air cache 910 can cache and serve various content in accordance with techniques described herein.","The on-air cache 910 has similar access network deep caching functionality and provides similar advantages as the shared caches and in home caches described above.","For example, in one embodiment the on-air cache 910 preemptively (or proactively) pre-fetches popular content using algorithms as previously described with respect to FIGS.","6B-6D.","In another example embodiment, UEs 735 send (e.g., broadcast) their content requests to both Node Bs 730 and on-air caches 910.If the request is serviceable by the on-air cache 910 (i.e., the on-air cache has a copy of the content or the content is deemed to be adequately popular to merit replication at the on-air cache), UEs 735 can bypass the cellular/mobile network (i.e., the request and/or content would not necessarily have to traverse most if not all of the cellular/mobile network) by having their requested content served locally via the on-air cache 910.An anycast scheme is further contemplated for request routing/handling among Node Bs 730 and on-air caches 910.Note that although the on-air cache 910 is depicted as being communicatively coupled to a flex cache 750 of an RNC 725 in this example embodiment, it is contemplated that the on-air cache 910 can also be communicatively coupled to the CDN via any other flex cache, CDN cache, or similar device over any part of a wireless and/or wireline network.","FIG.","10 depicts an example network environment 1000 that represents various data flows (e.g., data plane or content flows, control/service plane or inter-cache communications flows, etc.)","among respective flex cache hierarchical levels within the wireless network.","Although not shown in FIG.","10, assume that the example data flows (represented by the perforated lines) apply to redirection/translation server hierarchical levels within the wireless network as well.","Such data flows can include, for example, redirection of content requests, content request hand-offs among flex caches (e.g., transparent to UEs), peer requests/fills among flex caches, distribution/maintenance of CDN policies, awareness information (e.g., how or where content is stored, network conditions, etc.","), and the like.","Furthermore, Node Bs 730 may communicate with one another (e.g., peer requests/fills, distributed storage of content, etc.)","by way of a White Space Wi-Fi or one or more of any other available and/or suitable wireless spectrums.","Similar to the embodiments described with respect to FIG.","3, it is contemplated that a plurality of proximately situated flex caches (preferably in the same hierarchical tier) can form a community of shared caches having a master flex cache and subordinate flex caches.","Likewise, it is also contemplated that a plurality of proximately situated UEs (preferably associated/in communication with the same Node B 730) can form a community of shared caches having a master UE and subordinate UEs.","In such a configuration, the UEs could request, store, and serve/distribute content amongst one another (i.e., independent from the CDN or flex caches) in a similar fashion as the community of shared caches previously described.","Note that the placement/configuration of the flex caches and/or redirect/translation servers (or any device, system, module, software/executable code, etc., having functionality consistent with embodiments herein) within a wireless network is not limited to the example network environments of FIGS.","7-10, and it should be appreciated and understood that zero or more of such flex caches and/or redirection/translation servers (and/or functionality associated therewith) can be situated at/configured in any of the various logical and physical locations within a wireless, mobile, satellite, etc., network, or at any point where requests can be routed to an origin server.","It should also be appreciated and understood that the flex caches can additionally perform some or all of the functionality of the redirection/translation servers and/or CDN DNS servers as described herein.","Although the present invention has been described with reference to various embodiments, it will be understood that the invention is not limited to the details thereof.","Various modifications and substitutions will occur to those of ordinary skill in the art.","All such substitutions are intended to be embraced within the scope of the invention as defined in the appended claims."]],"string":"[\n [\n \"CONTENT DELIVERY NETWORK WITH DEEP CACHING INFRASTRUCTURE\",\n \"Embodiments herein include methods and systems for use in delivering resources to a client device over a local network.\",\n \"An exemplary system comprises a plurality of caching devices operable to cache resources on behalf of a plurality of content providers, and a local caching device communicatively situated between an access network and the client device, wherein the access network is communicably situated between the plurality of caching devices and the local caching device.\",\n \"The local caching device is operable to retrieve a requested resource from at least one of the plurality of caching devices, deliver the requested resource to the client device over the local network, and store the requested resource for future requests by other client devices.\"\n ],\n [\n \"1.A system comprising: a redirection server; and a plurality of caching devices situated within a wireless network, wherein the redirection server is operable to receive a request for a resource originating from a wireless client device connected to the wireless network, wherein the redirection server is further operable to select at least one of the plurality of caching devices to deliver the requested resource to the wireless client device, wherein the selected at least one caching device is operable to initiate delivery of the requested resource to the wireless client device from within the wireless network.\",\n \"2.The system as recited in claim 1, wherein the plurality of caching devices are further operable to retrieve the requested resource from one or more content delivery network (CDN) caching devices communicatively coupled with the wireless network.\",\n \"3.The system as recited in claim 1, wherein the step of selecting at least one of the plurality of caching devices to deliver the requested resource to the wireless client device is based on at least one of: whether a caching device has the requested resource; proximity of the caching device to the wireless client device; and wireless network conditions.\",\n \"4.The system as recited in claim 1, wherein the redirection server is operable to redirect the wireless client to the at least one selected caching device for delivery of the requested resource.\",\n \"5.The system as recited in claim 4, wherein the request is a Domain Name System (DNS) request.\",\n \"6.The system as recited in claim 4, wherein the request is an application protocol request.\",\n \"7.The system as recited in claim 6, wherein the application protocol request is a Hyper Text Transfer Protocol (HTTP) request.\",\n \"8.The system as recited in claim 1, wherein the redirection server is situated within the wireless network.\",\n \"9.The system as recited in claim 1, wherein at least one of the plurality of caching devices is locally proximate to the wireless client device and is operable to wirelessly delivery the requested resource to the wireless client device.\",\n \"10.The system as recited in claim 9, wherein the locally proximate caching device is operable to retrieve the requested resource from one or more content delivery network (CDN) caching devices communicatively coupled with the wireless network.\",\n \"11.The system as recited in claim 9, wherein the locally proximate caching device is a Wi-Fi hotspot.\",\n \"12.The system as recited in claim 1, wherein at least one of the plurality of caching devices is situated within at least one of a cellular core network and a radio access network of the wireless network.\",\n \"13.The system as recited in claim 1, wherein at least one of the plurality of caching devices is proximately situated with at least one of a radio network controller (RNC), a serving general packet radio service (GPRS) support node (SGSN), and a gateway GPRS support node (GGSN) of the wireless network.\",\n \"14.A method comprising: at a redirection server, receiving a request for a resource originating from a wireless client device connected to a wireless network; selecting at least one caching device from a plurality of caching devices to deliver the requested resource to the wireless client device; and by the selected at least one caching device, initiating delivery of the requested resource to the wireless client device from within the wireless network.\",\n \"15.The method as recited in claim 14, wherein the step of selecting at least one caching device from a plurality of caching devices to deliver the requested resource to the wireless client device is based on at least one of: whether a caching device has the requested resource; proximity of the caching device to the wireless client device; and wireless network conditions.\"\n ],\n [\n \" BACKGROUND Networks that are engaged to deliver electronic resources, such as videos, images, audio files, documents, software, and the like, to end users on the Internet on behalf of owners and providers of those resources (“content providers”) are commonly referred to as Content Delivery Networks (CDNs).\",\n \"A primary purpose of a CDN is to distribute resources efficiently to client devices on behalf of one or more content providers, preferably via a public Internet.\",\n \"Both end-users (clients) and content providers benefit from using a CDN.\",\n \"By using a CDN, a content provider is able to improve the speed and reliability of content delivery to its end-users, and delivery capability without deploying additional infrastructure.\",\n \"Clients benefit by being able to obtain content with fewer delays.\"\n ],\n [\n \" SUMMARY Embodiments herein include an example system for use in delivering resources to client devices in a local network, wherein the system comprises a plurality of caching devices operable to cache resources on behalf of a plurality of content providers, and a local caching device communicatively situated between an access network and the client device.\",\n \"The access network is communicably situated between the plurality of caching devices and the local caching device.\",\n \"The local caching device is operable to, in response to a request for a resource by a client device, retrieve the requested resource from at least one of the plurality of caching devices, wherein the requested resource is transmitted between the at least one plurality of caching devices and the local caching device over the access network.\",\n \"The access network is further operable to deliver the requested resource to the client device over the local network and store the requested resource for future requests by other client devices.\",\n \"In an example embodiment, at least one of the plurality of caching devices is part of a cluster of caching devices.\",\n \"In an example embodiment, in response to the local caching device requesting the requested resource from the at least one of the plurality of caching devices, the at least one of the plurality of caching devices is operable to retrieve the requested resource from at least one of an origin server of the content provider associated with the requested resource and a peer caching device.\",\n \"In an example embodiment, the local caching device is dedicated to the client device.\",\n \"In an example embodiment, the local caching device is a master cache accessible by a community of local caching devices and the community of local caching devices is communicatively coupled via at least one of a shared wireless frequency and a shared powerline.\",\n \"Furthermore, a second local caching device can be prompted to opt-in to join the community of local caching devices.\",\n \"In an example embodiment, a proxy device operable to intercept a request for the requested resource.\",\n \"In another example embodiment, the request is a Domain Name System (DNS) request and the proxy device is operable to redirect the client device to the local caching device for delivery of the requested resource over the local network.\",\n \"In another example embodiment, the request is an application protocol request such as a Hyper Text Transfer Protocol (HTTP) request.\",\n \"In yet another example embodiment, the proxy device is the local caching device and, in response to intercepting the request for the requested resource, the local caching device is operable to redirect the client device to a second local caching device communicatively situated between the access network and the client device.\",\n \"The second local caching device is operable to, in response to the redirected request by the client device, retrieve the requested resource from at least one of the plurality of caching devices, wherein the requested resource is transmitted between the at least one plurality of caching devices and the second local caching device over the access network.\",\n \"The second local caching device is also operable to deliver the requested resource to the client device over the local network and store the requested resource for future requests by other client devices.\",\n \"In an example embodiment, the proxy device is operable to determine, based on certain criteria, to which of a plurality of local caching devices to redirect the client device for delivery of the requested resource.\",\n \"For example, the certain criteria for each of the plurality of local caching devices can comprise availability, relative load, relative connectivity, availability, and whether a given local caching device has a copy of the requested resource.\",\n \"The proxy device is operable to receive the certain criteria via a push or pull from the plurality of caching devices.\",\n \"In another example embodiment, the certain criteria is locally generated at the proxy device and is based on a request history at the proxy device.\",\n \"Embodiments herein include an example method for proactively loading resources on a local caching device associated with a community of local caching devices, wherein the community of local caching devices is communicatively coupled via an access network to at least one content delivery network (CDN) caching device.\",\n \"The example method comprises steps for, in response to determining that a given resource meets certain popularity criteria and is not stored on the local caching device, determining whether the given resource is stored on at least one other local caching device in the community.\",\n \"If so, method comprises steps for retrieving the given resource from the at least one other local caching device, wherein the at least one other local caching device has determined that the given resource meets certain popularity criteria and has retrieved the given resource from the at least one CDN caching device via the access network.\",\n \"The example method further comprises steps for, in response to determining that the given resource is not stored on at least one other local caching device in the community, retrieving the given resource from the at least one CDN caching device via the access network.\",\n \"The example method further comprises steps for prompting a given local caching device that is not already associated with the community of local caching devices to join the community of local caching devices, and, if the given local caching device affirmatively responds to the prompt to join the community of local caching devices, adding the given local caching device to the community of local caching devices.\",\n \"In an example embodiment, the certain popularity criteria comprise a number of requests for the given resource that were received at the local caching device during a given time interval, availability of storage space on the local caching device, total capacity of the local caching device, type of storage on the local caching device, and popularity rankings of other resources stored on the local caching device.\",\n \"Embodiments herein include an example system comprising a redirection server and a plurality of caching devices situated within a wireless network.\",\n \"The redirection server is operable to receive a request for a resource originating from a wireless client device connected to the wireless network, wherein the redirection server is further operable to select at least one of the plurality of caching devices to deliver the requested resource to the wireless client device based on at whether a caching device has the requested resource, proximity of the caching device to the wireless client device, and wireless network conditions.\",\n \"The selected at least one caching device is operable to initiate delivery of the requested resource to the wireless client device from within the wireless network.\",\n \"In an example embodiment, the plurality of caching devices are operable to retrieve the requested resource from one or more content delivery network (CDN) caching devices communicatively coupled with the wireless network.\",\n \"In an example embodiment, the redirection server is operable to intercept the request and determine whether to select at least one of the plurality of caching devices based on a popularity of the requested resource.\",\n \"The redirection server is also operable to redirect the wireless client to the at least one selected caching device for delivery of the requested resource.\",\n \"In an example embodiment, the redirection server is situated within the wireless network.\",\n \"In an example embodiment, a caching device is locally proximate to the wireless client device and is operable to wirelessly delivery the requested resource to the wireless client device.\",\n \"The locally proximate caching device is further operable to retrieve the requested resource from one or more content delivery network (CDN) caching devices communicatively coupled with the wireless network.\",\n \"In another embodiment, the locally proximate caching device is a Wi-Fi hotspot.\",\n \"In an example embodiment, a caching device is situated within a cellular core network and/or a radio access network of the wireless network.\",\n \"In another embodiment, a caching device is proximately situated with at least one of a radio network controller (RNC), a serving general packet radio service (GPRS) support node (SGSN), and a gateway GPRS support node (GGSN) of the wireless network.\"\n ],\n [\n \"RELATED APPLICATIONS This application is a continuation of and claims the benefit of priority from U.S. patent application Ser.\",\n \"No.\",\n \"14/537,733, filed Nov. 10, 2014, titled “Content Delivery Network with Deep Caching Infrastructure,” wherein the entire contents of which are fully incorporated by reference herein for all purposes.\",\n \"Application Ser.\",\n \"No.\",\n \"14/537,733 is a divisional application of and claims the benefit of priority from U.S. patent application Ser.\",\n \"No.\",\n \"13/360,551, filed Jan. 27, 2012, titled “Content Delivery Network with Deep Caching Infrastructure,” now U.S. Pat.\",\n \"No.\",\n \"8,886,742, which claims priority to U.S.\",\n \"Provisional Patent Application No.\",\n \"61/437,544, filed Jan. 28, 2011 and U.S.\",\n \"Provisional Patent Application No.\",\n \"61/486,039, filed May 13, 2011, titled “Content Delivery Network with Deep Caching Infrastructure,” wherein the entire contents of each are fully incorporated by reference herein for all purposes.\",\n \"BACKGROUND Networks that are engaged to deliver electronic resources, such as videos, images, audio files, documents, software, and the like, to end users on the Internet on behalf of owners and providers of those resources (“content providers”) are commonly referred to as Content Delivery Networks (CDNs).\",\n \"A primary purpose of a CDN is to distribute resources efficiently to client devices on behalf of one or more content providers, preferably via a public Internet.\",\n \"Both end-users (clients) and content providers benefit from using a CDN.\",\n \"By using a CDN, a content provider is able to improve the speed and reliability of content delivery to its end-users, and delivery capability without deploying additional infrastructure.\",\n \"Clients benefit by being able to obtain content with fewer delays.\",\n \"SUMMARY Embodiments herein include an example system for use in delivering resources to client devices in a local network, wherein the system comprises a plurality of caching devices operable to cache resources on behalf of a plurality of content providers, and a local caching device communicatively situated between an access network and the client device.\",\n \"The access network is communicably situated between the plurality of caching devices and the local caching device.\",\n \"The local caching device is operable to, in response to a request for a resource by a client device, retrieve the requested resource from at least one of the plurality of caching devices, wherein the requested resource is transmitted between the at least one plurality of caching devices and the local caching device over the access network.\",\n \"The access network is further operable to deliver the requested resource to the client device over the local network and store the requested resource for future requests by other client devices.\",\n \"In an example embodiment, at least one of the plurality of caching devices is part of a cluster of caching devices.\",\n \"In an example embodiment, in response to the local caching device requesting the requested resource from the at least one of the plurality of caching devices, the at least one of the plurality of caching devices is operable to retrieve the requested resource from at least one of an origin server of the content provider associated with the requested resource and a peer caching device.\",\n \"In an example embodiment, the local caching device is dedicated to the client device.\",\n \"In an example embodiment, the local caching device is a master cache accessible by a community of local caching devices and the community of local caching devices is communicatively coupled via at least one of a shared wireless frequency and a shared powerline.\",\n \"Furthermore, a second local caching device can be prompted to opt-in to join the community of local caching devices.\",\n \"In an example embodiment, a proxy device operable to intercept a request for the requested resource.\",\n \"In another example embodiment, the request is a Domain Name System (DNS) request and the proxy device is operable to redirect the client device to the local caching device for delivery of the requested resource over the local network.\",\n \"In another example embodiment, the request is an application protocol request such as a Hyper Text Transfer Protocol (HTTP) request.\",\n \"In yet another example embodiment, the proxy device is the local caching device and, in response to intercepting the request for the requested resource, the local caching device is operable to redirect the client device to a second local caching device communicatively situated between the access network and the client device.\",\n \"The second local caching device is operable to, in response to the redirected request by the client device, retrieve the requested resource from at least one of the plurality of caching devices, wherein the requested resource is transmitted between the at least one plurality of caching devices and the second local caching device over the access network.\",\n \"The second local caching device is also operable to deliver the requested resource to the client device over the local network and store the requested resource for future requests by other client devices.\",\n \"In an example embodiment, the proxy device is operable to determine, based on certain criteria, to which of a plurality of local caching devices to redirect the client device for delivery of the requested resource.\",\n \"For example, the certain criteria for each of the plurality of local caching devices can comprise availability, relative load, relative connectivity, availability, and whether a given local caching device has a copy of the requested resource.\",\n \"The proxy device is operable to receive the certain criteria via a push or pull from the plurality of caching devices.\",\n \"In another example embodiment, the certain criteria is locally generated at the proxy device and is based on a request history at the proxy device.\",\n \"Embodiments herein include an example method for proactively loading resources on a local caching device associated with a community of local caching devices, wherein the community of local caching devices is communicatively coupled via an access network to at least one content delivery network (CDN) caching device.\",\n \"The example method comprises steps for, in response to determining that a given resource meets certain popularity criteria and is not stored on the local caching device, determining whether the given resource is stored on at least one other local caching device in the community.\",\n \"If so, method comprises steps for retrieving the given resource from the at least one other local caching device, wherein the at least one other local caching device has determined that the given resource meets certain popularity criteria and has retrieved the given resource from the at least one CDN caching device via the access network.\",\n \"The example method further comprises steps for, in response to determining that the given resource is not stored on at least one other local caching device in the community, retrieving the given resource from the at least one CDN caching device via the access network.\",\n \"The example method further comprises steps for prompting a given local caching device that is not already associated with the community of local caching devices to join the community of local caching devices, and, if the given local caching device affirmatively responds to the prompt to join the community of local caching devices, adding the given local caching device to the community of local caching devices.\",\n \"In an example embodiment, the certain popularity criteria comprise a number of requests for the given resource that were received at the local caching device during a given time interval, availability of storage space on the local caching device, total capacity of the local caching device, type of storage on the local caching device, and popularity rankings of other resources stored on the local caching device.\",\n \"Embodiments herein include an example system comprising a redirection server and a plurality of caching devices situated within a wireless network.\",\n \"The redirection server is operable to receive a request for a resource originating from a wireless client device connected to the wireless network, wherein the redirection server is further operable to select at least one of the plurality of caching devices to deliver the requested resource to the wireless client device based on at whether a caching device has the requested resource, proximity of the caching device to the wireless client device, and wireless network conditions.\",\n \"The selected at least one caching device is operable to initiate delivery of the requested resource to the wireless client device from within the wireless network.\",\n \"In an example embodiment, the plurality of caching devices are operable to retrieve the requested resource from one or more content delivery network (CDN) caching devices communicatively coupled with the wireless network.\",\n \"In an example embodiment, the redirection server is operable to intercept the request and determine whether to select at least one of the plurality of caching devices based on a popularity of the requested resource.\",\n \"The redirection server is also operable to redirect the wireless client to the at least one selected caching device for delivery of the requested resource.\",\n \"In an example embodiment, the redirection server is situated within the wireless network.\",\n \"In an example embodiment, a caching device is locally proximate to the wireless client device and is operable to wirelessly delivery the requested resource to the wireless client device.\",\n \"The locally proximate caching device is further operable to retrieve the requested resource from one or more content delivery network (CDN) caching devices communicatively coupled with the wireless network.\",\n \"In another embodiment, the locally proximate caching device is a Wi-Fi hotspot.\",\n \"In an example embodiment, a caching device is situated within a cellular core network and/or a radio access network of the wireless network.\",\n \"In another embodiment, a caching device is proximately situated with at least one of a radio network controller (RNC), a serving general packet radio service (GPRS) support node (SGSN), and a gateway GPRS support node (GGSN) of the wireless network.\",\n \"BRIEF DESCRIPTION OF THE DRAWINGS Other objects, features, and characteristics of the present invention, as well as the methods of operation and functions of the related elements of structure, will become more apparent upon consideration of the following description and the appended claims with reference to the accompanying drawings, all of which form a part of this specification.\",\n \"FIG.\",\n \"1 illustrates an example network environment 100 suitable for implementing various embodiments disclosed herein, including a high level depiction of a content delivery network (CDN) in accordance with an embodiment of the present invention.\",\n \"FIG.\",\n \"2 illustrates the CDN of FIG.\",\n \"1 having deep caching infrastructure in accordance with embodiments of the present invention.\",\n \"FIG.\",\n \"3 illustrates the CDN of FIG.\",\n \"1 having deep caching infrastructure in accordance with embodiments of the present invention.\",\n \"FIG.\",\n \"4 illustrates an example process for retrieving a resource using the CDN of FIG.\",\n \"2 in accordance with embodiments of the present invention.\",\n \"FIG.\",\n \"5 illustrates an example process for retrieving a resource using the CDN of FIG.\",\n \"2 in accordance with embodiments of the present invention.\",\n \"FIG.\",\n \"6A illustrates an example process for initializing the deep caching infrastructure of FIG.\",\n \"3 in accordance with embodiments of the present invention.\",\n \"FIG.\",\n \"6B illustrates an example process for proactively loading content in accordance with embodiments of the present invention.\",\n \"FIG.\",\n \"6C illustrates an example process for determining popularity in accordance with embodiments of the present invention.\",\n \"FIG.\",\n \"6D illustrates an example process for replicating objects in accordance with embodiments of the present invention.\",\n \"FIG.\",\n \"7 illustrates the CDN of FIG.\",\n \"1 adapted for a wireless network in accordance with embodiments of the present invention.\",\n \"FIG.\",\n \"8 illustrates the CDN of FIG.\",\n \"1 adapted for a wireless network in accordance with embodiments of the present invention.\",\n \"FIG.\",\n \"9 illustrates the CDN of FIG.\",\n \"1 adapted for a wireless network in accordance with embodiments of the present invention.\",\n \"FIG.\",\n \"10 illustrates the CDN of FIG.\",\n \"1 adapted for a wireless network in accordance with embodiments of the present invention.\",\n \"DETAILED DESCRIPTION Although the present invention has been described with reference to various embodiments, it will be understood that the invention is not limited to the details thereof.\",\n \"Various modifications and substitutions will occur to those of ordinary skill in the art.\",\n \"Deep Caching with Access Networks FIG.\",\n \"1 illustrates an example network environment 100 suitable for implementing various embodiments disclosed herein.\",\n \"The example network environment 100 comprises the Internet 101 (i.e., a large and diverse public network comprising one or more interconnected asynchronous systems) communicably coupled to access networks 102, 104, and 106.Note that access networks 102, 104, and 106 can be under the control of or operated/maintained by one or more entities, such as, for example, one or more Internet Service Providers (ISPs) that provide access to the Internet 101 for consumers/end-users (e.g., residential, enterprise, etc.)\",\n \"and/or content providers.\",\n \"In the example network environment 100 of FIG.\",\n \"1, each access network provides Internet access to several residential end-users, denoted as houses.\",\n \"Network environment 100 further comprises one or more CDNs for delivery of electronic resources (e.g., video, images, music, software, games, cloud resources, etc.)\",\n \"and other content from content providers to end-users across Internet 101.The one or more CDNs each have a number of CDN caches located in various strategic locations (both physical and logical) in Internet 101—e.g., CDN cache cluster 110 (DC), CDN cache cluster 112 (NYC), CDN cache cluster 114 (CHI), CDN cache cluster 116 (SEA), CDN cache cluster 118 (LA), and CDN cache cluster 120 (HOU).\",\n \"At a high level, FIGS.\",\n \"2 and 3 illustrate example network environments 200 and 300 suitable for implementing various embodiments disclosed herein.\",\n \"These networks are used to deliver resources to clients that are communicatively connected to an access network, and each include embodiments of what are referred to interchangeably as “deep caches,” “shared caches” or “local caches,” which are intended to represent cache devices on the client-side (or subscriber-side) of the access networks.\",\n \"For example, the client-side (or subscriber-side) of the access network can include cache devices that are topologically, physically, and/or logically closer to clients than an access network's Internet connection points.\",\n \"Such so-called “deep caches,” “shared caches” or “local caches,” which are preferably operated by or on behalf of CDN providers, provide client devices the opportunity to retrieve resources without having to communicate with storage devices across the access networks.\",\n \"More specifically, the network environment 200 in FIG.\",\n \"2 represents an example of a deep cache infrastructure whereby deep caches 202, 204 and 206 are deployed outside of access networks at a relatively close proximity to the access networks' end-users/subscribers.\",\n \"Likewise, the network environment 300 in FIG.\",\n \"3 represents an example of a deep cache infrastructure whereby deep caches (e.g., 320a, 320b, 320c) are deployed outside of access networks at a relatively close proximity to the access networks' end-users/subscribers.\",\n \"In the example configuration of FIG.\",\n \"2, network environment 200 comprises Internet 101, access network 104, CDN caches (DC) 110, and CDN caches (HOU) 120.Although any number of CDNs can service and deliver content to any of the regions and houses shown in FIG.\",\n \"2, assume that only a single CDN services and delivers content to the end-users/subscribers of access network 104.In network environment 200, the CDN comprises a CDN Domain Name System (DNS) 201 that resides, at least in part, within Internet 101 (and/or is communicably coupled to Internet 101) and is also communicably coupled across Internet 101 to CDN caches (DC) 110 and CDN caches (HOU) 120.CDN DNS 201 comprises one or more CDN DNS servers that are responsive to requests for content from end-users; and determines, based on several factors and parameters, at least one appropriate or suitable CDN cache for delivering the requested content to end-users.\",\n \"Still referring to FIG.\",\n \"2, shared caches 202, 204, and 206 are deployed on the client/subscriber-side of the access network 104.Each shared cache is shared amongst proximately located end-users (e.g., via wired access, Wi-Fi hotspot, powerlines, etc.).\",\n \"In a preferred embodiment, communication amongst the clients is accomplished by way of a new technology being developed named White Space Wi-Fi (or by way of one or more of any other available and/or suitable wireless spectrums for that matter).\",\n \"Access network 104 comprises a DNS 214 having one or more DNS servers.\",\n \"In addition to providing conventional DNS services to end-users of access network 104, DNS 214 can interact with CDN DNS 201 in furtherance of providing CDN access to end-users of access network 104 (e.g., via redirection).\",\n \"In embodiments described in FIG.\",\n \"2, various functionality and techniques can be used to effectively override the need for the DNS 214 and DNS 201 in circumstances in which it is optimal for the shared caches 202, 204 and 206 to deliver a resource that is requested by a client.\",\n \"FIG.\",\n \"4 is a flow diagram illustrating a process for use in delivering a resource to a client in the network environment 200 in which a DNS resolver on a client (or otherwise accessible to a client) redirects the client to a shared cache 202, 204 and 206 as opposed to resolving the client to the CDN caches (e.g., 120), in accordance with embodiments of the present invention.\",\n \"Such a circumstance occurs if the request (e.g., domain name or any other identifying information in the case of a proxy) meets certain “deep cache” criteria and/or thresholds.\",\n \"Exemplary deep cache criteria and/or thresholds can be based on content-based characteristics such as popularity, size, type, genre, creation date, etc., and/or client-based characteristics such as client device type, connection type/speed, storage capacity/availability, etc., and/or any other distinguishing factor or characteristic (e.g., on a hostname basis for DNS requests).\",\n \"If, however, a resource does not meet such criteria or thresholds, then the client engages in normal DNS resolution and is served the requested resource from either a CDN cache 120 or an origin server.\",\n \"FIG.\",\n \"5 is a flow diagram illustrating a similar process as in FIG.\",\n \"4, but instead employs a proxy instead of a DNS resolver on a client.\",\n \"For example, the proxy can be software executing on the client device or a separate device capable of performing proxy server/cache functionality.\",\n \"In another embodiment, intelligent traffic management can be used to complement or supplement DNS processing.\",\n \"Still referring to FIG.\",\n \"2 and according to another example embodiment, each end-user (e.g., house) has access to its own domain name resolver (e.g., in conjunction with a PC, laptop, set-top box, Roku Box, smart phone, tablet, etc.).\",\n \"These end-user name resolvers can be pre-populated and/or periodically/intermittently populated (via push and/or pull) with a list or mapping of specific domains that are determined to be popular, desirable, strategic, etc.\",\n \"by one or more content providers, CDNs, third party entities, etc., or any combination thereof (or organically by the domain name resolver itself using, for example, historic/cached data, histograms of traffic patterns, etc.).\",\n \"Additionally, end-user name resolvers can be pre-populated and/or periodically/intermittently populated (via push and/or pull) with a regular expression usable to identify specifically requested domains that are similarly determined to be popular, desirable, strategic, etc.\",\n \"In this manner, content associated with popular (or desirable, strategic, etc.)\",\n \"domains can be preemptively loaded (i.e., pre-fetched) into one or more shared caches so that the domain name resolver can immediately resolve the request for content to a shared cache directly connected (or indirectly connected, but in close proximity, that is, on the client-side of an access network) to the requesting end-user device.\",\n \"For example, if an end-user requests content (e.g., via a web interface, set-top box, Roku℠ Box, etc.\",\n \"), the associated end-user domain name resolver can determine if the domain associated with the requested content is deemed popular (e.g., by comparing with the list or mapping of domains, comparing against a regular expression, etc.)\",\n \"and, if so, redirect the end-user device to request content from at least one shared cache.\",\n \"Furthermore, CDN operators, content providers, etc., can employ a centralized and/or regional system to dynamically and strategically distribute such lists/mappings of domains or regular expressions to the various client devices.\",\n \"Again referring to FIG.\",\n \"2, another example embodiment employs one or more proxy devices 208, 210 (e.g., DNS proxies) situated between the client devices and DNS 214 of access network 104 whereby the proxies are operable to transparently intercept client requests.\",\n \"Similar to the end-user name resolvers previously described, the proxies 208, 210 can be pre-populated and/or periodically/intermittently populated (via push and/or pull) with a list or mapping of specific domains that are determined to be popular, desirable, strategic, etc.\",\n \"by one or more content providers, CDNs, third party entities, etc., or any combination thereof (or organically by the proxies themselves using, for example, historic/cached data, histograms of traffic patterns, etc.).\",\n \"Additionally, proxies can be pre-populated and/or periodically/intermittently populated (via push and/or pull) with a regular expression usable to identify specifically requested domains that are similarly determined to be popular, desirable, strategic, etc.\",\n \"In this manner, content associated with popular (or desirable, strategic, etc.)\",\n \"domains can be preemptively loaded (i.e., pre-fetched) into one or more shared caches so that the proxy can redirect requests for content (e.g., via an HTTP redirect) to one or more shared caches directly connected (or indirectly connected, but in close proximity, that is, on the client-side of an access network) to the requesting end-user device.\",\n \"For example, if an end-user requests content (e.g., via a web interface, set-top box, RokusM Box, etc.\",\n \"), the proxy 208 or 210 can intercept that request and determine if the domain associated with the requested content is deemed popular (e.g., by comparing with the list or mapping of domains) and, if so, redirect the end-user device to request content from at least one shared cache.\",\n \"Note that a proxy is not necessarily limited to analyzing the domain name associated with a request (as may be the case with a DNS device or agent) and can analyze additional information in the request's URL (e.g., at the HTTP level) such as paths, tokens, hashes, name-value pairs, etc.\",\n \"Furthermore, CDN operators, content providers, etc., can employ a centralized and/or regional system to dynamically and strategically distribute such lists/mappings of domains (or paths, tokens, hashes, name-value pairs, etc.)\",\n \"and/or regular expressions to the various proxies.\",\n \"According to an example embodiment, the proxies and/or DNS agents/devices can extract additional information from the client request to better perform deep caching functionality (e.g., rendezvous) as described herein.\",\n \"For example, a client request can contain specific information such as the client or end user IP address, in home cache IP address, master cache IP address, content classification data (e.g., title, type, encoding, etc.\",\n \"), delivery protocol, and the like.\",\n \"This specific information can be added to the client request by software executing on the client device, by content providers, by CDNs, or by any other suitable entity capable of modifying client requests.\",\n \"It is also contemplated that one or more shared caches can perform the proxy functionality as described above.\",\n \"In such a configuration, and assuming the shared cache determines that the requested resource should be served from at least one shared cache (e.g., based on popularity), the shared cache would: i) redirect the client to one or more other shared caches (e.g., if that shared cache does not have a copy or a substantial portion of the requested content and/or the other shared caches do, if network conditions favor delivery from other shared caches, etc.\",\n \"); ii) “hand-off” the request to one or more other shared caches (e.g., transparently to the requesting client via Transmission Control Protocol “TCP”) so that the other shared cache(s) can take over the handling of the request and initiate delivery of the requested content in lieu of a redirect; or, iii) serve the content itself (e.g., if that shared cache has a copy or substantial portion of the requested content or can retrieve a copy of the requested resource from another CDN cache or shared cache).\",\n \"Turning now to FIG.\",\n \"3, the network environment 300 comprises Internet 101, access network 104, CDN caches (DC) 110, and CDN caches (HOU) 120.Although any number of CDNs can service and deliver content to any of the regions and houses shown in FIG.\",\n \"3, assume that only a single CDN services and delivers content to the end-users/subscribers of access network 104.In network environment 300, the CDN comprises a CDN Domain Name System (DNS) 201 that resides, at least in part, within Internet 101 (and/or is communicably coupled to Internet 101) and is also communicably coupled across Internet 101 to CDN caches (DC) 110 and CDN caches (HOU) 120.CDN DNS 201 comprises one or more CDN DNS servers that are responsive to requests for content from end-users; and determines, based on several factors and parameters, at least one appropriate CDN cache for delivering the requested content to end-users.\",\n \"Still referring to FIG.\",\n \"3, the network environment 300 also comprises shared caches deployed on the client-side of the access network 104.As with FIG.\",\n \"2, the shared caches shown in FIG.\",\n \"3 are preferably operated by the CDN provider.\",\n \"In contrast to the embodiments of FIG.\",\n \"2, the shared caches reside as storage at a plurality of the client homes and are shared amongst the clients via a common network infrastructure 302, 304 and 306, such as, without limitation, wired access, Wi-Fi hotspot, powerlines, etc.\",\n \"(also referred to as a “residential wireless cloud”).\",\n \"In a preferred embodiment, communication amongst the clients is accomplished by way of White Space Wi-Fi or one or more of any other available and/or suitable wireless spectrums.\",\n \"While shared caches 320a-320c in accordance with the embodiment of FIG.\",\n \"3 are only shown at three clients, it should be appreciated that numerous clients include such shared caches 320a-320c and that an aggregate of such clients that operate shared caches (e.g., 320a and 320b) are referred to as a “community.” For example, each of common network infrastructure 302, 304 and 306 can represent such a community.\",\n \"In accordance with various embodiments described herein, a shared cache 320a, 320b, 320c depicted in FIG.\",\n \"3 (also referred to as an “in home cache”) can be a device situated in residential homes and on residential users' home networks.\",\n \"Such a shared cache acts as a storage device for content that may be consumed by that residential user or other users that are reachable through a residential wireless cloud (e.g., common network infrastructure 302, 304, 306).\",\n \"The storage within the device could be any type of storage including, for example, spinning disk, flash memory, and the like.\",\n \"In addition to the storage, the shared cache has software that allows it to participate as part of a CDN with the ability to load content from the CDN and share content with other similar devices through the residential wireless cloud.\",\n \"To support the exchange of data through the residential wireless cloud, the shared cache will have wireless transmission and receipt capabilities.\",\n \"The shared cache can take on many forms including, for example, a standalone device that acts as an in-line cache in the home network, an end user PC with the CDN-specific software loaded thereon and at least some of the device's storage allocated to this function, or the shared cache can be integrated as a part of an in home appliance such as a television, gaming console or any other network connected devices.\",\n \"FIG.\",\n \"6A illustrates an example process for initializing the deep caching infrastructure of FIG.\",\n \"3 in accordance with embodiments herein.\",\n \"Upon initialization of a client device (e.g., boot-up, initialization of a process or application, installation of software, etc.\",\n \"), the client device is prompted with an option to join a community.\",\n \"For example, the prompt may be presented via a graphical user interface (GUI) to a user of the client device.\",\n \"Then, if client device (e.g., via the GUI, a preconfigured setting, etc.)\",\n \"returns an affirmative decision to join the community, the client device (and any in-home cache associated therewith) is added to the community.\",\n \"In one embodiment, the client device (and/or its associated in-home cache) sends an “add me to the community” indication to the master cache, community-designated proxy, and/or one or more other members (e.g., shared caches, client devices, in-home caches, etc.)\",\n \"of the community.\",\n \"In response, the master cache, community-designated proxy, and/or one or more other members of the community update their respective community member lists to indicate inclusion of the newest member.\",\n \"With regard to both network environment 200 and network environment 300, another embodiment of the present invention contemplates a capability for a shared cache deployed within an access network to preemptively (or proactively) download and store/cache (e.g., pre-fetch) content that is deemed popular (preferably occurring during off-peak hours for the access network and/or residential wireless cloud).\",\n \"For example, a shared cache can receive popularity information from its CDN (or one or more content providers, third party entities, etc.)\",\n \"and/or derive its own organic popularity data (e.g., using historical data such as histograms of traffic patterns, etc.)\",\n \"in furtherance of preemptively downloading and storing content that has not yet been (or has been infrequently) requested from the shared cache—depending on the popularity algorithms and policies being employed and enforced.\",\n \"For example, such popularity determinations may be used as a factor in connection with selection of an appropriate shared cache for a particular client.\",\n \"Continuing with the example embodiment above, the in home cache sends a request (e.g., per a configured time and frequency) to a network based pro-active content loading application (e.g., predictive content engine 312).\",\n \"The request to the predictive content engine 312 contains the usage and other data collected by the in home cache that would be useful in predicting content that may be requested by the end users in the home.\",\n \"This request is preferably implemented using standard HTTP based protocols, although other protocols may be used as well.\",\n \"In turn, the predictive content engine 312 analyzes the data sent from the in home cache and responds with a list of content that it believes the end-users at home may want to watch at a future date.\",\n \"The in home cache then processes the list of content provided by the predictive content engine 312 and uses a proactive loading algorithm to determine which content in the list, if any, should be loaded.\",\n \"For instance, the in home cache may have a configured set of times or network performance characteristics that specify an appropriate time for proactively loading the content.\",\n \"FIG.\",\n \"6B is a flow chart showing example processing steps of a proactive loading algorithm used by an in home cache.\",\n \"Any number of techniques may be used to determine the popularity of a content object.\",\n \"For example, popularity of an object can be determined based on the number of requests and/or the request rate.\",\n \"Popular objects typically have higher request rates or higher number of requests than unpopular objects.\",\n \"Popularity can also be determined by tracking the last X number of request times for an object and then using the difference between the current time and the X number of request times to calculate a running average for how often the object is requested.\",\n \"Similarly, popularity can be gauged on the request rate for an object that is weighted for more recent requests for the object (which is a predictor that the object will be requested again).\",\n \"As another example, an exponential decay method and an artificial neural network could be used to determine the popularity of an object.\",\n \"According to an example embodiment of a popularity computation and referring to FIG.\",\n \"6C, the popularity of an object is based on the request rate of the object which is computed over a sliding time window in a discrete manner.\",\n \"As such, the variable I denotes the time interval over which the popularity of an object is measured.\",\n \"The time interval is divided into N equal sub-intervals of duration I/N.\",\n \"As will be apparent, the time interval is not required to be equally divided and may instead be divided in other manners.\",\n \"Furthermore, a linked list P of size N is created for each object.\",\n \"The value of N determines the quality of approximation (e.g., the smaller the value of N, the coarser the approximation).\",\n \"The first element P[1] of the list records the number of requests that were received when the current time was within the first sub-interval, the second element P[2] records the number of requests that were received when the current time was within the 2nd interval, and so on.\",\n \"When a new sub-interval is received, the list is rotated such that P[I] becomes P[I+1] (except for P[N] which becomes P[1]); so, for example, P[1] becomes P[2], P[2] becomes P[3], and P[N] becomes P[1].\",\n \"After the rotation, the new P[1] is reset to zero.\",\n \"Accordingly, only the end time of the first sub-interval needs to be recorded and compared against the current time to check if the list should be rotated.\",\n \"For each new request within the sub-interval, P[1] is simply incremented by 1.In this way, the arrival time of each request need not be recorded.\",\n \"In another example embodiment, the popularity of an object is simply the sum of all numbers in the list.\",\n \"To make the computation more efficient, the sum of P[2]+P[3]+ .\",\n \".\",\n \".\",\n \"+P[N] is stored in a register M. The popularity can then be computed by adding P[1] to M. When a rotation occurs, the new value of M becomes M+=P[1]−P[N].\",\n \"Note that the popularity of an object may be queried constantly.\",\n \"Thus, to avoid the extra addition involved for each such inquiry, the value of P[1] can be set to M after the rotation.\",\n \"Then, the value of P[1] is the popularity of the object.\",\n \"Referring to FIG.\",\n \"6C, an example popularity computation algorithm may be summarized as follows.\",\n \"The linked list P of size N for an object, wherein each of P[1] .\",\n \".\",\n \".\",\n \"P[N] represents a time sub-interval, is initialized (at 605).\",\n \"The popularity M is also initialized (at 610).\",\n \"If there is a request for the object while the current time is within the current time sub-interval (at 615), then the value of P[1] is incremented by 1 (at 620).\",\n \"If the current time is within a new time sub-interval (at 625), then the value of P[1] is decremented by the value of M, M is incremented by P[1]−P[N], the list P is rotated, and P[1] is set to the value of M (at 630).\",\n \"Then, provided the popularity computation is continued (at 635), that is, the popularity computation is not terminated, the popularity computation algorithm repeats itself.\",\n \"Furthermore, any number of techniques may be used to initiate replication of an object.\",\n \"A cache server (or in home cache) might replicate an object on the first request by a client for the object.\",\n \"Alternatively, the cache server (or in home cache) may be tuned to wait until a specific number or range of requests are received for the object.\",\n \"In other implementations, the object may be pulled or replicated if the object is more popular (e.g., has a higher request rate) than the least popular object currently in storage.\",\n \"In yet another alternative, the replicating decision can be a function of the popularity of the object, the cost of storing the object, the (available) storage capacity of the cache server (or in home cache) and/or the type of storage (e.g., spinning disk, flash memory, etc.\",\n \"), the cost of pulling the object from the network (e.g., network capacity), as well as any other relevant cost factors.\",\n \"Note that since the popularity of objects may change significantly with time, initiating a pull decision of an object based purely on a fixed threshold does not necessarily capture this dynamic nature of popularity.\",\n \"A replication policy that compares against the least popular of replicated objects has its limitations, although the policy does not use a fixed threshold.\",\n \"Consider where the storage is only half full but all the replicated objects are extremely popular.\",\n \"Since only objects exceeding the least popular of the replicated objects will be replicated under this replication policy, objects with moderate popularity will be rejected despite the fact that there is plenty of storage space available and the objects are reasonably popular.\",\n \"Accordingly, a replication scheme should be able to automatically adjust the replication threshold by taking into consideration the dynamic nature of popularity and the available storage capacity.\",\n \"If there are more popular objects than the storage capacity allows, the replication scheme should raise the threshold.\",\n \"If there is more available storage capacity, the replication scheme should decrease the threshold so that more objects can be stored.\",\n \"According to an example embodiment of a replication scheme and referring to FIG.\",\n \"6D, an object is replicated into storage (at 650) when the popularity P of the object is greater than the initial threshold PI (at 640) and when there is enough space in the storage to replicate the object (at 645).\",\n \"If there is not enough storage to replicate the requested object, a replacement algorithm is performed in which the popularity P of the object is compared against the popularity PL of the least popular object in the storage (at 655).\",\n \"If P is greater than PL, the current least popular object is added to a candidate list for removal (at 660).\",\n \"If it is determined that upon removing the object(s) in the candidate list (initially only the most recent least popular object) there would be enough storage (at 670), then the object(s) in the candidate list are removed and PL is updated (at 690), and then the object is replicated into storage (at 650).\",\n \"If, on the other hand, it is determined that upon removing the object(s) in the candidate list there would not be enough storage (at 670), then it is determined whether PL is PM (i.e., where PM is the current most popular object) (at 675) and, if so, PL is reset to the initial least popular object (at 685) and the operation ends without replication (i.e., there would not be enough storage if all PL through PM objects were removed).\",\n \"If PL is not yet PM, then PL is updated (i.e., iterated) and the operation cycles again to step 655.Note that the candidate list mitigates the risk of removing one or more objects from storage before ever replicating an object since, as the case may be, the object may not even be replicated after performing the removal operations (e.g., because the object is larger than the overall storage capacity).\",\n \"In an example embodiment, an in home cache (e.g., shared cache 320a, 320b, 320c) has the capability of collecting and storing usage data for the client devices that are requesting content from within the community or common network infrastructure to which it is connected.\",\n \"For example, this data could be a record of actual content played on in home devices, information describing other internet usage occurring in the home, GPS information that provides physical location data, demographic or user preference data entered by users in the home through an interface provided by the software on the in home cache, etc.\",\n \"Referring again to FIG.\",\n \"3, the community of shared caches can use various techniques for request handling/processing, distributed storage, and delivery of content.\",\n \"For example, in one example embodiment a particular shared cache in the community is designated as a master cache (e.g., shared cache 320a) while the other shared caches in the community function in a subordinate manner to this master cache.\",\n \"The master/subordinate designations can be assigned by the CDN, content provider, and/or by the community of shared caches themselves.\",\n \"Content requests originating within the community can be routed through the master cache or transparently intercepted similar to the proxy functionality previously discussed.\",\n \"Upon receiving such a request, the master cache can determine whether or not the request should be serviced by one or more of the shared caches in the community (or, possibly, one or more shared caches in one or more separate communities) based on techniques previously described (e.g., popularity, filtering against domain lists/mappings or regular expressions, etc.).\",\n \"Or, alternatively, the master cache can receive a request from a client device in the community that has already made such a determination via the client domain name server (i.e., wherein the client's domain name server resolved the request to the master cache).\",\n \"Either way, if it is determined that the request should be serviced from within the community, the master cache can (initially or further) redirect the requesting client to one or more shared caches in the community, and/or service the request and initiate delivery of the content itself.\",\n \"It should be noted that the master cache may or may not be associated with (or operated in conjunction with) a particular client or house within the community.\",\n \"In other words, the master cache could be an independent or stand-alone shared cache as described above with respect to FIG.\",\n \"2.It should be further noted that a community-designated proxy (e.g., proxy 310) may be substituted for the master cache in order to perform (transparent) interception and redirection of content requests that originate from within the community to other shared caches within the community.\",\n \"Still further it should be noted that the functionality associated with a master cache or community-designated proxy is not necessarily limited to a single device.\",\n \"As such, two or more devices within a community may share such master cache and/or proxy functionality (e.g., as a statically or dynamically designated secondary, tertiary, etc., master cache/proxy).\",\n \"For example, such distributed or redundant master cache/proxy functionality can be useful for load-balancing, failover, scalability, etc.\",\n \"Continuing with the example embodiment above, the master cache can monitor and maintain an awareness of the other subordinate shared servers and the content stored thereon.\",\n \"For instance, the master cache can maintain a table or a mapping that includes, by way of non-limiting example, data associated with content stored on each shared cache (e.g., object names/titles, object/file sizes, partial object/file data, specific content location information such as URLs or portions thereof, etc.\",\n \"), load and/or storage capacity of each shared cache, cache status information (e.g., whether or not a shared cache is functional or online), global popularity of stored content (i.e., per a CDN or content provider), local popularity of stored content (i.e., per one or more communities), and the like.\",\n \"The master cache can periodically/intermittently pull this information from each subordinate shared cache and/or each shared cache can periodically/intermittently push this information to the master cache.\",\n \"Having collected such community awareness information, the master cache can then use this information to redirect content requests originating within the community to the most appropriate or suitable shared cache(s) in the community.\",\n \"Community awareness information can also be used in furtherance of traffic engineering techniques such as bandwidth throttling (due to the asymmetric nature of CDN traffic flows) and load shedding amongst the community of shared caches.\",\n \"Note that a content request can be serviced by one or more caches that serve one or more different portions of the requested content to the requesting client (simultaneously and/or at different times).\",\n \"In yet another example embodiment with reference to FIG.\",\n \"3, a common addressing scheme is used to determine the most appropriate or suitable shared cache(s) in the community for servicing a request for content.\",\n \"As such, each shared server in the community would be assigned a common address (e.g., IP address).\",\n \"Assume, for example, that a client within the community makes a content request and it is determined that the requested content should be served from a shared cache within the community (i.e., the determination being made via the client's name server, master cache, or via a community-designated proxy, as previously discussed).\",\n \"In such a case, the client's name resolver would resolve the request to the common address, or the proxy would redirect the request to the common address.\",\n \"Thus, by using the common address the client would send (or broadcast) the request to each shared cache in the community and, in doing so, the client can select which shared cache(s) will ultimately serve the content (typically the first shared cache to respond with an indication that it is able and willing to service the request).\",\n \"It is also contemplated that a master cache or community-designated proxy can further use this common addressing scheme on a more granular level.\",\n \"For example, a master cache or community-designated proxy can associate a common address to particular content (thus assigning the common address to only those shared caches that have the particular content) such that requests will be redirected to only those shared servers that have the particular content.\",\n \"In one example embodiment, a first set of shared caches in a community are designated for storing and servicing a first type of content/service, while a second set of shared caches are designated for storing and servicing a second type of content/service.\",\n \"As such, the first set of shared caches could be assigned a first common address so that requests for a first type of content would be redirected (or resolved) to only the first set, while the second set of shared caches could be assigned a second common address so that requests for a second type of content would be redirected (or resolved) to only the second set, and so on.\",\n \"According to yet another example embodiment, a client can issue a type of point-to-multipoint content request (e.g., per a redirect) to each shared cache in the community.\",\n \"To do this, the client would be provided (e.g., by a CDN, content provider, master cache, community-designated proxy, etc.)\",\n \"a list of addresses (e.g., IP addresses) of each shared cache in the community.\",\n \"In this sense, the designation of the community of shared caches can be access network or ISP independent.\",\n \"Note that the list can be dynamically updated and modified by whichever entity provides the list to the client.\",\n \"In another example embodiment, the community of shared caches is based on one or more subnets of the access network or ISP.\",\n \"In this configuration, a client can issue a content request (e.g., per a redirect) to each shard cache in the community by broadcasting the request to one or more access network or ISP subnet address.\",\n \"A further embodiment contemplates the use of multicasting (e.g., IP multicasting) for content request routing/handling among a community of shared caches.\",\n \"In such a configuration, each shared cache (e.g., upon going online) would register with a multicast address group associated with each of the other shared caches in the community (e.g., using Internet Group Management Protocol “IGMP”).\",\n \"Thus, a client associated with a shared cache can issue a content request (e.g., per a redirect) to its multicast group to which each of the other shared caches in community have subscribed.\",\n \"In an example embodiment, the master cache or community-designated proxy administers and manages the multicast groups by keeping track of which shared caches belong to the community.\",\n \"Deep Caching with Wireless Networks At a high level, FIGS.\",\n \"7-10 illustrate example network environments 700, 800, 900, and 1000, respectively, which are suitable for implementing various embodiments disclosed herein.\",\n \"Similar to the configurations previously described, these networks are used to deliver resources to clients (also commonly referred to as user equipment “UE”) that are communicatively connected to a wireless network (examples of which are described below), and each include embodiments of what are referred to interchangeably as “deep caches,” “shared caches,” “local caches,” or “transparent caches,” (collectively referred to as “flex caches”) which are intended to represent cache devices situated within or around the wireless network.\",\n \"Such so-called “flex caches,” which can be operated by or on behalf of CDN providers, wireless network providers, content providers, other third party entities, etc., and/or any combination thereof, provide client devices (or UEs) the opportunity to request and retrieve resources without having to necessarily communicate with storage devices/servers across the Internet (and/or any other wireline network to which the wireless network directly or indirectly connects).\",\n \"In particular, the flex caches (and, in some example implementations, in connection with particular servers such as redirection/translation servers) provide deep caching functionality as previously described such that content can be stored/cached within the wireless network (e.g., preemptively or dynamically caching content, for example, from content providers associated with the CDN).\",\n \"According to example embodiments, the flex caches can also provide transparent caching of content as the content is retrieved upstream from the CDN (or from other storage devices/servers either directly or indirectly connected to or located in the Internet).\",\n \"In another example embodiment, the flex caches can pre-fetch content (e.g., when content becomes or is deemed popular or desirable), thus enabling faster and more efficient delivery of content to clients/UEs of the wireless network.\",\n \"It should be noted that the wireless networks described herein are not limited to any particular wireless network configuration, standard, protocol, or generation.\",\n \"For instance, wireless networks are contemplated to include second, third, or fourth generation (2G/3G/4G) mobile/cellular networks such as, for example, 3G UMTS/HSDPA/HSUPA networks (Universal Mobile Telecommunications System/High-Speed Downlink Packet Access/High-Speed Uplink Packet Access), GSM/GPRS networks (Global System for Mobile Communications/General Packet Radio Service), 4G LTE/WiMax networks (Long Term Evolution/Worldwide Interoperability for Microwave Access), CDMA networks (Code Division Multiplex Access), and the like, as well as Wi-Fi networks, satellite networks, and/or any other networks or wireless spectrums capable of directly or indirectly delivering content to wirelessly connected clients/UEs.\",\n \"The embodiments described herein also contemplate integration and interoperability with future configurations, standards, protocols, and generations of wireless networks.\",\n \"Turning now to FIG.\",\n \"7, the example network environment 700 comprises Internet 101, CDN caches 120, at least one CDN DNS 201, cellular core network 705, and Radio Network Controller (RNC) backhaul network 710.Internet 101 is communicably coupled with cellular core network 705 via at least one Gateway GPRS Service Node (GGSN) 715, and cellular core network 705 is communicably coupled with RNC backhaul network 710 via at least one Serving GPRS Support Node (SGSN) 720.RNC backhaul network 710 is communicably coupled with one or more RNCs 725, and the RNCs 725 are communicably coupled with one or more Base Transceiver Stations (BTSs) or Node Bs 730 (the RNCs 725 and BTSs/Node Bs 730 collectively form a so-called Radio Access Network “RAN”).\",\n \"Node Bs 730 are operable to wirelessly communicate with UEs 735 (e.g., clients using wireless devices such as smart phones, tablets, laptops, or any other devices suitable for wirelessly connecting to a network).\",\n \"Example network environment 700 further comprises a cache hierarchy in the wireless network including zero or more flex caches 740 situated at or between GGSN 715 and SGSN 720 (e.g., within cellular core network 705), zero or more flex caches 745 situated at or between SGSN 720 and RNCs 725 (e.g., within RNC backhaul network 710), and zero or more flex caches 750 situated at or between RNCs 725 and their respective Node Bs 730.Although any number of CDNs can service and deliver content to wireless networks, it should be noted that as in the previous embodiments and figures, assume that only a single CDN services and delivers content to the clients/UEs 735 in FIGS.\",\n \"7-10.Still referring to FIG.\",\n \"7, and in general operation, the CDN is operable to deliver content to clients/UEs 735 via any of the flex caches in the cache hierarchy of the wireless network.\",\n \"For example, and in conjunction with techniques previously described, content may be preemptively stored on any of the flex caches 740, 745, or 750, to anticipate requests for content from clients/UEs 735.Content may be stored on different caches within the hierarchy depending on the policies implemented by the CDN, content provider, and/or the wireless network provider (e.g., popularity computation algorithms and replications policies per FIGS.\",\n \"6B-6D).\",\n \"The policies can include factors such as, for example, content popularity, content type, content size, information associated with the client or the user equipment, transmission protocol, data format, network conditions, etc.\",\n \"Example data flows (i.e., requests for content, inter-cache communications, redirection of requests, distributed storage schemes/protocols/communications, and delivery of content, etc.)\",\n \"are discussed below with respect to FIGS.\",\n \"8-10.FIG.\",\n \"8 depicts an example network environment 800 similar to the example network environment 700 of FIG.\",\n \"7, and further comprises one or more redirection/translation servers 805 situated at or between GGSN 715 and SGSN 720 (e.g., within the cellular core network 705).\",\n \"Redirection/translation server 805 is configured to handle and redirect requests for content within the wireless network.\",\n \"As conventional wireless networks (i.e., cellular/mobile networks) are currently not capable of (or are otherwise ineffective at) handling/processing traditional Layer 3 or higher communications (e.g., DNS name resolving, HTTP requests for content, File Transfer Protocol “FTP” or Peer-to-Peer “P2P” communications, etc.\",\n \"), the redirection/translation server 805 can be used to translate requests (e.g., via decapsulation and re-encapsulation) from the wireless domain and then process those requests as if a traditional wireline network device (e.g., DNS server, CDN cache/server, proxy server, etc.)\",\n \"were handling the request.\",\n \"In an example embodiment, the redirect/translation server 805 is configured to transparently intercept and handle a request for content from a client/UE 735 before the request exits the wireless network (i.e., before the request is passed to the Internet for further handling/processing).\",\n \"According to another example embodiment, redirection/translation server 805 is capable of redirecting sessions within the wireless network.\",\n \"Using information about where or how content is stored within the CDN (i.e., either in the Internet 101 or within the cache hierarchy of the wireless network at the various flex caches), the redirection/translation server 805 can redirect a content request to a flex cache suitable for efficiently delivering content to the requesting client/UE 735.Similar to embodiments previously described, redirection/translation servers can be pre-populated and/or periodically/intermittently populated with a list or mapping of specific domains that are determined to be popular, desirable, strategic, etc.\",\n \"by one or more content providers, CDNs, third party entities, etc., or any combination thereof (or by even the redirection/translation servers themselves using, for example, historic/cached data).\",\n \"Note that regular expressions may be used in addition to the list or mapping of specific domains as previously described.\",\n \"In this manner, content associated with popular (or desirable, strategic, etc.)\",\n \"domains can be preemptively loaded into one or more flex caches so that the translation/redirection servers can redirect UE-initiated requests for content (e.g., via an HTTP redirect) to one or more flex caches.\",\n \"For example, if a UE requests content, the redirection/translation server 805 can handle/process that request and determine if the domain associated with the requested content is deemed popular (e.g., by comparing with the list or mapping of domains, comparing against a regular expression, etc.)\",\n \"and, if so, redirect the UE to request content from at least one flex cache.\",\n \"Furthermore, CDN operators, content providers, etc., can employ a centralized and/or regional system to dynamically and strategically distribute such lists/mappings of domains (or regular expressions) to the various redirection/translation servers.\",\n \"According to example embodiments, the suitability of the flex cache for delivering the content may be based on factors such as, for example, whether the flex cache already has a copy (or at least a portion) of the requested content, the proximity of the flex cache to the client/UE (physically and/or logically), network conditions within the wireless network, global or local popularity of the content, content size, content type, transmission protocol, data format, information associated with the client or user equipment, etc.\",\n \"Redirect/translation server 805 can become aware of where or how content is stored within the wireless network via updates (e.g., push or pull) from the flex caches (e.g., either individually or via a hierarchical flow of information) or from the CDN devices in the Internet 101 (e.g., CDN DNS 201 or CDN caches 120).\",\n \"FIG.\",\n \"9 depicts an example network environment 900 similar to the example network environment 800 of FIG.\",\n \"8, and further comprises one or more redirection/translation servers 905 situated at or between SGSN 720 and RNCs 725 (e.g., within the RNC backhaul network 710).\",\n \"In addition to a flex cache hierarchical structure, example network environment 900 further represents a redirection/translation server hierarchical structure.\",\n \"As such, redirection/translation server functionality can be utilized at various levels/tiers/depths/etc.\",\n \"within the wireless network.\",\n \"FIG.\",\n \"9 additionally shows an on-air cache 910 in communication with a flex cache 750 associated with an RNC 725.According to an example embodiment, the on-air cache 910 serves as a sort of hotspot for UEs 735 (e.g., Wi-Fi at airports, stadiums, malls, hotels, office buildings, etc.\",\n \"), wherein the on-air cache 910 can cache and serve various content in accordance with techniques described herein.\",\n \"The on-air cache 910 has similar access network deep caching functionality and provides similar advantages as the shared caches and in home caches described above.\",\n \"For example, in one embodiment the on-air cache 910 preemptively (or proactively) pre-fetches popular content using algorithms as previously described with respect to FIGS.\",\n \"6B-6D.\",\n \"In another example embodiment, UEs 735 send (e.g., broadcast) their content requests to both Node Bs 730 and on-air caches 910.If the request is serviceable by the on-air cache 910 (i.e., the on-air cache has a copy of the content or the content is deemed to be adequately popular to merit replication at the on-air cache), UEs 735 can bypass the cellular/mobile network (i.e., the request and/or content would not necessarily have to traverse most if not all of the cellular/mobile network) by having their requested content served locally via the on-air cache 910.An anycast scheme is further contemplated for request routing/handling among Node Bs 730 and on-air caches 910.Note that although the on-air cache 910 is depicted as being communicatively coupled to a flex cache 750 of an RNC 725 in this example embodiment, it is contemplated that the on-air cache 910 can also be communicatively coupled to the CDN via any other flex cache, CDN cache, or similar device over any part of a wireless and/or wireline network.\",\n \"FIG.\",\n \"10 depicts an example network environment 1000 that represents various data flows (e.g., data plane or content flows, control/service plane or inter-cache communications flows, etc.)\",\n \"among respective flex cache hierarchical levels within the wireless network.\",\n \"Although not shown in FIG.\",\n \"10, assume that the example data flows (represented by the perforated lines) apply to redirection/translation server hierarchical levels within the wireless network as well.\",\n \"Such data flows can include, for example, redirection of content requests, content request hand-offs among flex caches (e.g., transparent to UEs), peer requests/fills among flex caches, distribution/maintenance of CDN policies, awareness information (e.g., how or where content is stored, network conditions, etc.\",\n \"), and the like.\",\n \"Furthermore, Node Bs 730 may communicate with one another (e.g., peer requests/fills, distributed storage of content, etc.)\",\n \"by way of a White Space Wi-Fi or one or more of any other available and/or suitable wireless spectrums.\",\n \"Similar to the embodiments described with respect to FIG.\",\n \"3, it is contemplated that a plurality of proximately situated flex caches (preferably in the same hierarchical tier) can form a community of shared caches having a master flex cache and subordinate flex caches.\",\n \"Likewise, it is also contemplated that a plurality of proximately situated UEs (preferably associated/in communication with the same Node B 730) can form a community of shared caches having a master UE and subordinate UEs.\",\n \"In such a configuration, the UEs could request, store, and serve/distribute content amongst one another (i.e., independent from the CDN or flex caches) in a similar fashion as the community of shared caches previously described.\",\n \"Note that the placement/configuration of the flex caches and/or redirect/translation servers (or any device, system, module, software/executable code, etc., having functionality consistent with embodiments herein) within a wireless network is not limited to the example network environments of FIGS.\",\n \"7-10, and it should be appreciated and understood that zero or more of such flex caches and/or redirection/translation servers (and/or functionality associated therewith) can be situated at/configured in any of the various logical and physical locations within a wireless, mobile, satellite, etc., network, or at any point where requests can be routed to an origin server.\",\n \"It should also be appreciated and understood that the flex caches can additionally perform some or all of the functionality of the redirection/translation servers and/or CDN DNS servers as described herein.\",\n \"Although the present invention has been described with reference to various embodiments, it will be understood that the invention is not limited to the details thereof.\",\n \"Various modifications and substitutions will occur to those of ordinary skill in the art.\",\n \"All such substitutions are intended to be embraced within the scope of the invention as defined in the appended claims.\"\n ]\n]"},"source":{"kind":"string","value":"Patent_15871417"}}},{"rowIdx":4493788,"cells":{"text":{"kind":"list like","value":[["METHODS AND SYSTEMS FOR HIGH RESOLUTION MELT ANALYSIS OF A NUCLEIC ACID SEQUENCE","Described herein are methods and systems for analyzing and visualizing HRM data from a double-stranded nucleic acid.","The HRM data is generally characterized by a plurality of data points each including a signal value associated with the concentration of a double-stranded nucleic acid in a sample and a temperature value associated with a the temperature of the sample.","Embodiments of the invention analyze the HRM curves from samples using the first negative derivative of the HRM curve or a virtual standard.","The first negative derivative plot method may be used to identify the melting temperature of a homogenous double-stranded nucleic acid in a sample, as well as the presence and melting temperature of heterogeneous double-stranded nucleic acids in the sample.","Data points associated with the melting temperature are plotted on a scatter plot for analysis.","The virtual standard allows for visualization of HRM data across data sets."],["1.A method of visualizing HRM data from one or more samples wherein the HRM data is characterized by a plurality of data points each including a signal value associated with the concentration of a double-stranded nucleic acid in a sample and a temperature value associated with a the temperature of the sample, the method comprising: generating a HRM curve from the HRM data for each sample; providing a virtual standard; and plotting the differences between the HRM curve for each sample and the virtual curve.","2.A method of visualizing HRM data from one or more samples wherein the HRM data is characterized by a plurality of data points each including a signal value associated with the concentration of a double-stranded nucleic acid in a sample and a temperature value associated with a the temperature of the sample, the method comprising: generating a HRM curve from the HRM data for each sample; providing a virtual standard; plotting the first negative derivative of the HRM curve for each sample and plotting the differences between the first negative derivative plot for each sample and the virtual curve.","3.The method of claim 1 wherein the virtual standard comprises: averaging the signal across the HRM curves for each sample to result in a virtual standard curve.","4.The method of claim 3 further comprising, prior to averaging the signal values across the HRM curves for each sample, at least one of smoothing the HRM for each sample, removing exponential decay from the HRM curve for each sample; and normalizing the HRM curves for each sample to one another.","5.The method of claim 1 wherein the virtual standard comprises calculating a theoretical melting profile of a target double-stranded nucleic acid to generate the virtual standard.","6.The method of claim 1 wherein the virtual standard comprises providing a formula to calculate the virtual standard wherein the variables in the formula are adjustable to define end points of the exponential region, a maximum slope for the exponential region, inclusion of desired inflection points in the exponential region, and combinations thereof.","7.The method of claim 1 wherein the providing the virtual standard comprises providing a spline curve in a sigmoidal shape, wherein the shape of the spline curve may be altered by the user using a computer interface."],[" BACKGROUND High resolution melt (HRM) analysis allows for the detection of mutations, polymorphisms, and epigenetic differences in double-stranded nucleic acids in a sample without sequencing the nucleic acids.","Typically, for HRM analysis, a target nucleic acid sequence is amplified using the polymerase chain reaction (PCR) technique in the presence of a reporter molecule, such as a fluorescent dye, that selectively fluoresces when associated with a double-stranded nucleic acid.","It has been observed that the signal produced from monitoring the slow melt of a double-stranded nucleic acid, such as an amplified DNA sequence, follows a generally sigmoidal pattern in which the signal level decreases as a function of temperature.","The shape of the HRM curve and the melt temperature, i.e., the temperature at which the signal exhibits the greatest amount of change, is determined by the specific sequence of nucleotides composing double-stranded nucleic acid.","Samples having mixtures of double-stranded nucleic acids, such as occurs with a heterogeneous sample, or samples having one or more mutations, will exhibit changes in the shape of the HRM curve and/or a shift in the melting temperature.","Existing HRM analysis is done by use of difference plot visualization, in which the changes in signal level of a data set from a first sample is used as a baseline, and the difference from data sets from other samples to the baseline is plotted across the entire temperature range.","While this method can allow for the grouping of similar double-stranded nucleic acids, the results can be difficult to analyze, the view of the results is dependent upon the data chosen as the baseline, and automated grouping algorithms can be difficult to construct or can be confused by the baseline choice thus leading to different results.","A need for a better method of analyzing HRM data was thus identified."],[" BRIEF SUMMARY Before HRM analysis was available, the temperature resolution of instruments was not able to distinguish small changes in double-stranded nucleic acid melt temperature such as those caused by single nucleotide changes.","Even after HRM capable instruments have become available, melt temperature information has not been considered informative enough as melt temperature of a heterozygote sample may be very close to homozygote melt temperature.","However, the when melt temperature data is combined with other information such as at least one of a peak height value, a peak width value, or an area under the curve value, discrimination between the melt temperatures from double stranded nucleic acids is greatly enhanced.","Described herein are methods and systems for analyzing and visualizing HRM data from a double-stranded nucleic acid utilizing data points associated with the HRM data that includes a combination of the melt temperature and at least one of a peak height value, a peak width value and/or an area under the curve value.","The HRM data is generally characterized by a plurality of data points each including a signal value associated with the concentration of a double-stranded nucleic acid in a sample and a temperature value associated with a the temperature of the sample.","Embodiments of the invention analyze the HRM curves of samples using the first negative derivative of the HRM curve or by difference plot visualization of the HRM data using a virtual standard.","In one embodiment, the method includes generating a HRM curve from the HRM data for each sample and plotting the first negative derivative of the HRM curves.","The melt peak for each sample is identified from the first negative derivative plot for each sample and analyzed.","In an embodiment, the melt peak, which represents the melt temperature for the sample, is identified as the data point along the first negative derivative plot having the greatest distance from the x-axis.","In an alternative embodiment, a Gaussian probability function is fit to the first negative derivative plot and the melt peak is the data point along the Gaussian probability function having the greatest distance from the x-axis.","In another alternative embodiment, the Gaussian probability function is subtracted from the first negative derivative curve and a second melt peak from the subtracted data set is identified.","Additional melt peaks can be identified with additional Gaussian probability subtraction steps.","In another alternative embodiment, HRM curves from at least two samples are normalized relative to one another.","The first negative derivative is then plotted for the normalized HRM curves for each sample and the melt peaks for each sample are identified and analyzed.","In an alternative embodiment, the melt peak is identified for a first negative derivative plot and the width of the plot is calculated at a fraction of the melt peak height.","A data point having a temperature value and at least one of a width value or a peak height value is then analyzed, such as by plotting on a scatter plot.","Another aspect of the invention is directed to improved methods of visualizing HRM data for one or more samples by generating a HRM curve for each sample, providing a virtual standard, and plotting the differences between the HRM curve for each sample and the virtual curve.","An alternative embodiment further includes plotting the first negative derivative of the HRM curve and the virtual standard and then plotting the differences between the first negative plot for each sample and the virtual curve.","The virtual curve can be provided using a number of techniques.","In one embodiment, the signal values for the virtual curve are derived from the averages of the signal values for the HRM curves from the samples.","In another embodiment, the virtual curve is a derived from the theoretical melting profile of a target double-stranded nucleic acid.","In yet another embodiment, the virtual curve is calculated from a formula with variables that may be adjusted by the user.","In a further embodiment, the virtual standard includes a spline curve in a sigmoidal shape that may be altered by the user using a computer interface."],["CROSS-REFERENCE TO RELATED APPLICATIONS This application is a divisional application of U.S. patent application Ser.","No.","13/799,139 filed Mar.","13, 2013, which claims the benefit of and priority to U.S.","Provisional Application No.","61/660,581 filed Jun.","15, 2012, all of which are incorporated herein by reference.","FIELD The present invention relates generally to the analysis of double-stranded nucleic acids and, more particularly, to the high resolution melt analysis of double-stranded nucleic acids.","BACKGROUND High resolution melt (HRM) analysis allows for the detection of mutations, polymorphisms, and epigenetic differences in double-stranded nucleic acids in a sample without sequencing the nucleic acids.","Typically, for HRM analysis, a target nucleic acid sequence is amplified using the polymerase chain reaction (PCR) technique in the presence of a reporter molecule, such as a fluorescent dye, that selectively fluoresces when associated with a double-stranded nucleic acid.","It has been observed that the signal produced from monitoring the slow melt of a double-stranded nucleic acid, such as an amplified DNA sequence, follows a generally sigmoidal pattern in which the signal level decreases as a function of temperature.","The shape of the HRM curve and the melt temperature, i.e., the temperature at which the signal exhibits the greatest amount of change, is determined by the specific sequence of nucleotides composing double-stranded nucleic acid.","Samples having mixtures of double-stranded nucleic acids, such as occurs with a heterogeneous sample, or samples having one or more mutations, will exhibit changes in the shape of the HRM curve and/or a shift in the melting temperature.","Existing HRM analysis is done by use of difference plot visualization, in which the changes in signal level of a data set from a first sample is used as a baseline, and the difference from data sets from other samples to the baseline is plotted across the entire temperature range.","While this method can allow for the grouping of similar double-stranded nucleic acids, the results can be difficult to analyze, the view of the results is dependent upon the data chosen as the baseline, and automated grouping algorithms can be difficult to construct or can be confused by the baseline choice thus leading to different results.","A need for a better method of analyzing HRM data was thus identified.","BRIEF SUMMARY Before HRM analysis was available, the temperature resolution of instruments was not able to distinguish small changes in double-stranded nucleic acid melt temperature such as those caused by single nucleotide changes.","Even after HRM capable instruments have become available, melt temperature information has not been considered informative enough as melt temperature of a heterozygote sample may be very close to homozygote melt temperature.","However, the when melt temperature data is combined with other information such as at least one of a peak height value, a peak width value, or an area under the curve value, discrimination between the melt temperatures from double stranded nucleic acids is greatly enhanced.","Described herein are methods and systems for analyzing and visualizing HRM data from a double-stranded nucleic acid utilizing data points associated with the HRM data that includes a combination of the melt temperature and at least one of a peak height value, a peak width value and/or an area under the curve value.","The HRM data is generally characterized by a plurality of data points each including a signal value associated with the concentration of a double-stranded nucleic acid in a sample and a temperature value associated with a the temperature of the sample.","Embodiments of the invention analyze the HRM curves of samples using the first negative derivative of the HRM curve or by difference plot visualization of the HRM data using a virtual standard.","In one embodiment, the method includes generating a HRM curve from the HRM data for each sample and plotting the first negative derivative of the HRM curves.","The melt peak for each sample is identified from the first negative derivative plot for each sample and analyzed.","In an embodiment, the melt peak, which represents the melt temperature for the sample, is identified as the data point along the first negative derivative plot having the greatest distance from the x-axis.","In an alternative embodiment, a Gaussian probability function is fit to the first negative derivative plot and the melt peak is the data point along the Gaussian probability function having the greatest distance from the x-axis.","In another alternative embodiment, the Gaussian probability function is subtracted from the first negative derivative curve and a second melt peak from the subtracted data set is identified.","Additional melt peaks can be identified with additional Gaussian probability subtraction steps.","In another alternative embodiment, HRM curves from at least two samples are normalized relative to one another.","The first negative derivative is then plotted for the normalized HRM curves for each sample and the melt peaks for each sample are identified and analyzed.","In an alternative embodiment, the melt peak is identified for a first negative derivative plot and the width of the plot is calculated at a fraction of the melt peak height.","A data point having a temperature value and at least one of a width value or a peak height value is then analyzed, such as by plotting on a scatter plot.","Another aspect of the invention is directed to improved methods of visualizing HRM data for one or more samples by generating a HRM curve for each sample, providing a virtual standard, and plotting the differences between the HRM curve for each sample and the virtual curve.","An alternative embodiment further includes plotting the first negative derivative of the HRM curve and the virtual standard and then plotting the differences between the first negative plot for each sample and the virtual curve.","The virtual curve can be provided using a number of techniques.","In one embodiment, the signal values for the virtual curve are derived from the averages of the signal values for the HRM curves from the samples.","In another embodiment, the virtual curve is a derived from the theoretical melting profile of a target double-stranded nucleic acid.","In yet another embodiment, the virtual curve is calculated from a formula with variables that may be adjusted by the user.","In a further embodiment, the virtual standard includes a spline curve in a sigmoidal shape that may be altered by the user using a computer interface.","BRIEF DESCRIPTION OF SEVERAL VIEWS OF THE DRAWINGS The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate various embodiments of the invention and, together with a general description of the invention given above and the detailed description of the embodiments given below, serve to explain the embodiments of the invention.","FIG.","1A is a graph illustrating an exemplary HRM curve in accordance with embodiments of the invention.","FIG.","1B is a graph illustrating an exemplary plot of the first negative derivative of the HRM curve of FIG.","1A in accordance with embodiments of the invention.","FIG.","1C is a graph illustrating a first and a second Gaussian distribution curve fit to the exemplary plot of the first negative derivative of a the HRM curve of FIG.","1B in accordance with embodiments of the invention.","FIG.","1D is a scatter plot of data points derived from a first negative derivative plot in accordance with embodiments of the invention.","FIG.","2 is a flow chart illustrating a process of analyzing HRM data in accordance with embodiments of the invention.","FIG.","3 is a flow chart illustrating a process for generating a HRM curve in accordance with embodiments of the invention.","FIG.","4 is a flow chart illustrating a process of analyzing HRM data in accordance with embodiments of the invention.","FIG.","5 is a flow chart illustrating a process of analyzing HRM data in accordance with embodiments of the invention.","FIG.","6 is a flow chart illustrating a process of analyzing HRM data in accordance with embodiments of the invention.","FIG.","7 is a flow chart illustrating a process of analyzing HRM data in accordance with embodiments of the invention.","FIG.","8A is a graph illustrating a process for visualizing HRM data in accordance with embodiments of the invention.","FIG.","8B is a graph illustrating a process for visualizing HRM data on a difference plot in accordance with embodiments of the invention.","FIG.","9 is a flow chart illustrating a process for visualizing HRM data in accordance with embodiments of the invention.","FIG.","10 is a flow chart illustrating a process for visualizing HRM data in accordance with embodiments of the invention.","FIG.","11 is a flow chart illustrating a process for generating a virtual standard in accordance with embodiments of the invention.","FIG.","12 is a flow chart illustrating a process for generating a virtual standard in accordance with embodiments of the invention.","FIG.","13 is a block diagram of a computer system in accordance with embodiments of the invention.","FIG.","14A is a graph illustrating HRM curves with the exponential decay removed in accordance with embodiments of the invention.","FIG.","14B is a graph illustrating the HRM curves of FIG.","14A after being normalized in accordance with embodiments of the invention.","FIG.","14C is a graph illustrating a plot of the first negative derivative of the normalized HRM curves of FIG.","14B in accordance with embodiments of the invention.","FIG.","14D is a scatter plot of data points derived from the graph of FIG.","14C in accordance with embodiments of the invention.","FIG.","15A is a graph illustrating a plot of the first negative derivative of the HRM curves from a homogenous and heterogeneous double-stranded nucleic acid in accordance with embodiments of the invention.","FIG.","15B is a scatter plot of melt peak data points derived from the graph of FIG.","15A in accordance with embodiments of the invention.","FIG.","15C is a scatter plot of peak width data points derived from the graph of FIG.","15A in accordance with embodiments of the invention.","DETAILED DESCRIPTION Complimentary strands of nucleic acids form relatively stable double strands of nucleic acids at lower temperatures.","As the temperature of a sample containing a double-stranded nucleic acid is increased, the double-stranded nucleic acid melts into two single strands.","Similarly, as the temperature of a sample containing complimentary single strands of nucleic acid is decreased, the complimentary nucleic acids will reassociate into double-stranded nucleic acids.","The melt temperature of a double-stranded nucleic acid, i.e., the temperature at which a nucleic acid transitions between a double-stranded nucleic acid and a pair of single strands, is determined by the length and sequence of the nucleic acid strands.","Differences between two or more double-stranded nucleic acids, such as double-stranded nucleic acids amplified using polymerase chain reaction (PCR), may be inferred by observing and analyzing the high resolution melting or high resolution reassociation of the double-stranded nucleic acids over a range of temperatures.","As used herein, the terms “high resolution melting” or “high resolution melt” are understood to include both high resolution melt and high resolution reassociation.","With reference to FIG.","1A, and in accordance with embodiments of the invention, an improved method of analyzing high resolution melt (HRM) data includes analyzing data collected from the high resolution melting of a sample that includes at least one amplified double-stranded nucleic acid wherein the data is characterized by an ascending HRM curve 10.Similarly, the HRM data may be collected from the high resolution reassociation of a sample that includes complimentary single strands of a double-stranded nucleic acid.","The HRM data from high resolution reassociation data is characterized by a descending HRM curve (not shown).","The HRM curve 10 includes a temperature value along the x-axis and a signal value representative of the concentration of double-stranded nucleic acid in the sample at a given temperature value along the y-axis.","In an exemplary embodiment, the temperature value is expressed in degrees Celsius and the signal value is expressed as relative fluorescent units (RFU's).","In an exemplary embodiment, the signal value for a sample is obtained with a reporter molecule that selectively fluoresces when associated with a doubled stranded nucleic acid.","Thus, the signal value, i.e., the level of fluorescence observed in a sample, is indicative of the concentration of double-stranded nucleic acid in the sample.","Reporter molecules useful with embodiments of the invention described herein are those that selectively provide a signal, such as a fluorescent signal, when associated with a double-stranded nucleic acid.","For example, fluorescent double-stranded nucleic dyes used in real time PCR reactions may be used.","Exemplary reporter molecules include SYBR® Green I, SYBR® Gold, PicoGreen 0 (each available from Invitrogen), and LC Green®, Eva Green, Melt Doctor, SYTO®-9, SYTO®-13, SYTO®-16, SYTO®-60, SYTO®-62, SYTO®-64, SYTO®-82, POPO-3, TOTO-3, PO-PRO-3, TO-PRO-3, YO-PRO®-1, SYTOX® Orange, BEBO, BOXTO, Chromofy, as well as other reporter molecules that selectively fluoresce when associated with double-stranded nucleic acids.","In addition to the use of reporter molecules that selectively associate with double stranded nucleic acids, the reporter molecules may also be associated with fluorescent probes or primer based systems.","As used herein, the term reporter molecule is understood to include any system, molecule, probe, dye, or combination thereof that is capable of generating a signal that corresponds to the concentration of double-stranded nucleic acid in a sample at a particular temperature.","For high resolution melting, the signal value is obtained from measurements taken at predetermined increments as the temperature of the sample is slowly increased from a temperature at which substantially all of the complementary nucleic acid strands in the sample are in the double-stranded state, to a temperature at which no double-stranded nucleic acid is detectable with the reporter molecule.","For high resolution reassociation, the signal value is obtained from measurements taken at predetermined increments as the temperature of the sample is slowly decreased from a temperature at which substantially all of the complementary nucleic acid strands in the sample are in the single-stranded state, to a temperature at which substantially all of the nucleic acid is in a double-stranded state as detected with the reporter molecule.","Typically, the signal value is measured over a range of temperatures from about 60 degrees Celsius to about 95 degrees Celsius; however, the temperature range may be increased or decreased as needed to analyze a specific nucleic acid sequence.","In accordance with embodiments of the invention, the signal value is obtained as the temperature increases by fractions of a degree over at least a portion of the melting temperature range.","In an embodiment, the signal value is obtained at about every 0.1 degrees Celsius over at least a portion of the melting temperature range.","In an alternative embodiment, the signal value is obtained at about every 0.2 degrees Celsius over at least a portion of the melting temperature range.","In an alternative embodiment, the signal value may be obtained at about every 0.04 degrees Celsius to about 5.0 degrees Celsius over at least a portion of the melting temperature range.","With reference to FIG.","1A, the data obtained from HRM analysis of a double-stranded nucleic acid generally forms a sigmoid shaped curve 10 having a saturation region 12, a region of exponential melting 14, and a background region 16.The saturation region 12 is a relatively flat region typically at lower temperature values in the curve 10 and characterized by high signal values because the double-stranded nucleic acid concentration in the sample is constant because at these temperatures the concentration of double-stranded nucleic acid in the sample does not change thus there is no change in the signal generated by the reporter molecule.","In some embodiments, the double-stranded nucleic acid is saturated with reporter molecules whereas in other embodiments, the double-stranded nucleic acid is not saturated.","The region of exponential melting 14 is the central region of the curve 10 wherein the signal value generated by the reporter molecule changes in relation to exponential changes in the concentration of double-stranded nucleic acid as the double-stranded nucleic acid melts or reassociates with changes in the temperature.","The background region 16 is a relatively flat region typically at higher temperature values.","In the background region 16, the concentration of double-stranded nucleic acids in the sample is reduced to levels that the signal from the reporter molecule associated with double-stranded nucleic acids cannot overcome the background signals in the reaction chamber.","HRM curves, such as shown in FIG.","1A, are generally analyzed to determine if two or more samples include identical or different double-stranded nucleic acid sequences.","To make this determination, HRM curves from two or more samples are typically analyzed for differences between the curves from the samples.","Differences between HRM curves generated from the samples may be observed as differences in the melt temperature of the double-stranded nucleic acids from the samples, differences in the shape of the HRM curves, or differences in both the melt temperatures and the shapes of the HRM curves.","The melt temperature is the temperature at which the greatest amount of double-stranded nucleic acid melts.","For HRM curve analysis, the melt temperature is the temperature at which the absolute value of the slope in the region of exponential melting 14 is the greatest.","In contrast to routine methods of analyzing HRM data, embodiments of the invention analyze the HRM curves of samples using a plot of the first negative derivative of the HRM curves or the visualization of HRM data using a virtual standard.","Embodiments of these methods are referred to herein as the “derivative plot methods” of FIGS.","1A-7 and the “virtual standard methods” of FIGS.","8A-12.With reference to FIG.","2, the derivative plot methods generally include the generation of a HRM curve (block 20), plotting the first negative derivative of the HRM curve (block 22), identifying a melt peak of the first negative derivative plot (block 24), and analyzing the melt peak (26).","FIG.","1A illustrates an exemplary HRM curve 10.FIG.","3 illustrates an exemplary method of generating an HRM curve for analysis in accordance with embodiments of the invention.","First, a HRM curve is plotted utilizing HRM data gather from the high resolution melting or high resolution reassociation of a sample containing a double-stranded nucleic acid and a reporter molecule (block 28).","The HRM data includes a series of data points having a signal value and a temperature value.","The HRM data may be obtained from an HRM analysis system, such as one that includes a thermal cycler for heating and/or cooling the sample in a controlled manner and an optical system for obtaining signal values as the sample is heated or cooled.","With continued reference to FIG.","3, the HRM data may optionally be internally smoothed (block 30), have the exponential decay removed (block 32), or may be both internally smoothed (block 30) and have the exponential decay removed (block 32).","The internal smoothing process (block 30) may employ any process that internally removes insignificant variations in the data that are not associated with changes in the concentration of double-stranded nucleic acid.","For example, in one embodiment, the smoothing process employs a rolling average method that averages the product values for a plurality of consecutive data points from the HRM data.","In another embodiment, the data are smoothed with a Savitzky-Golay smoothing filter by fitting an nth degree polynome to a plurality of consecutive data points and calculating a smoothed product value for one or several data points with the plurality of data points.","In one embodiment, the user may optionally designate the number of data points used for the rolling average.","The exponential decay removal (block 32) process removes decreasing signal value trends that are not related to changes in the double-stranded nucleic acid concentration.","Exponential decay can be removed by known processes, such as mathematical processes that calculate the amount of decay observed in the saturation region 12 (FIG.","1A).","For example, a line segment may be fit by linear regression to a subset of data points in the saturation region.","The slope of the line segment may then be used to correct the HRM curve 10.In another example, the exponential decay is removed from the curve directly by multiplying the measured melting curve by a correction function which is exponentially dependent on the temperature.","After generating the HRM curve, the first negative derivative is plotted for the HRM curve (block 32 of FIG.","2) and the first negative derivative plot is analyzed to identify its melt peak (block 46).","FIG.","1B an exemplary first negative derivative plot 34.The first negative derivative plot 34 of a homogenous sample, i.e., a sample that mostly contains complimentary double-stranded nucleic acids, has five regions: (1) a first background region 38, (2) a ascending region 40, (3) a melt peak 36, and (4) a descending region 42, and (5) a background region 44.The first negative derivative curve of a heterogeneous sample, i.e., a sample that includes two or more different nucleic acids, will have two or more melt peaks associate with the two or more nucleic acids, but the two or more melt peaks may mask one another such that the first negative derivative curve of the heterogeneous sample also appears to have the same five regions.","The first and second background regions 38, 44 of the first negative derivative plot 34 of FIG.","1B correspond to the saturation region 12 and background region 16, respectively, of the HRM curve 10 of FIG.","1A.","The ascending region 40 and the descending region 42 of the first negative derivative plot 34 of FIG.","1B correspond to portions of the exponential melting region 14 of the HRM curve 10 of FIG.","1A.","The melt peak 36 of the first negative derivative plot 34 of FIG.","1B corresponds to the point along the exponential melting region 14 of FIG.","1A having the steepest slope, i.e., the melt temperature.","As illustrated in FIG.","1B, in an embodiment, the melt peak 36 is represented in the first negative derivative plot 34 as the data point having the greatest amplitude, i.e., the greatest distance h from the x-axis where the x-axis value is zero.","The melt peak has a height value that corresponds to the first negative derivative of the signal value and a temperature value that corresponds with the melt temperature for the sample.","The melt peaks from one or more samples may then be analyzed (block 26 of FIG.","2), as discussed in greater detail below.","In an alternative embodiment, illustrated in FIGS.","1C and 4, the melt peak 36 is identified from a Gaussian probability function 52 that is fit to the first negative derivative curve 34.A HRM curve is generated with HRM data from a sample (block 20) and the first negative derivative of the HRM curve is plotted (block 22).","A Gaussian probability function 52 is then fit to the first negative derivative curve 34 (block 54).","The peak of the first Gaussian probability function 52 is identified as the melt peak 36, i.e., the point along the function 52 having the greatest amplitude, i.e., the greatest distance h from the x-axis where the x-axis value is zero (block 56).","The melt peak data point may then be analyzed (block 58), as discussed in greater detail below.","The melt peak data point from a first sample may be compared with the melt peak(s) of one or more other samples, or compared to known standard values, to determine if the sequences of the samples are the same or different.","If the melt peaks from the one or samples are different from one another, i.e., have a different signal value, a different temperature value, or both the signal value and the temperature value are different, then the sequences of the nucleic acids in the samples are not identical.","In contrast, if the melt peaks from the sample are the same, then the sequences of the nucleic acids in the samples are likely to be the same.","Processes for analyzing the melt peaks are discussed in greater detail below.","Comparing the peak values between samples can be difficult due to variability in the peak values that is not associated with the double-stranded nucleic acids in the samples.","For example, the melt peak values can vary due to the position of the reaction well on the thermal block or due to inaccuracies in measuring the reagents used in the analysis.","In an embodiment illustrated in FIG.","5, the HRM curves from a plurality of samples are normalized before plotting the first negative derivative for each HRM curve to account for at least a portion of the variability in the melt peaks that is not associated with the double-stranded nucleic acids in the samples.","Normalizing the HRM curves results in first negative derivative plots that have identical areas under the curves.","Because the area under the curve for the normalized plots are identical, any significant difference in the melt peaks for each plot indicates a difference in the shapes of the underlying HRM curves and, correspondingly, indicates a difference in the double-stranded nucleic acids from which the HRM curves originate.","For this embodiment, HRM curves are generated from the HRM data for each sample (block 60).","The HRM curves may optionally be internally smoothed and the exponential decay removed as previously described.","The HRM curves are then normalized relative to one another (block 62, as discussed below).","The first negative derivative is plotted for each of the normalized HRM curves (block 64) and the melt peaks are identified for the first negative derivative plot from the normalized HRM curves for each sample (block 66).","The melt peaks are plotted as data points on a scatter plot (block 68).","The melts peaks for each sample may then be analyzed to determine if they are the same or different (block 70).","This method has the advantage of distinguishing melt peaks that have very similar melt temperatures, but different HRM curve shapes.","In a variation of this embodiment, a Gaussian probability function is fit to the first negative derivative plot and the melt peak is identified as the peak of the Gaussian probability function, as described above with reference to FIG.","4.HRM data may be normalized by any process that normalizes the data along the thermal axis (x-axis), the signal axis (y-axis) or along both the thermal axis and the signal axis.","For thermal axis normalization, each HRM curve is shifted on the thermal axis based its location on the thermal block as determined by the thermal characteristics of the thermal block.","For example, the detected melt temperature for each well may be multiplied by a standard adjustment multiplier that corresponds to the typical variation of that well from the mean of the block.","The signal axis may be normalized based on user defined areas of interest in the saturation region and the background regions or preliminary areas of interest in these regions may be automatically calculated.","In one embodiment, the areas of interest are identified from a first negative derivative plot of the HRM curve.","The areas of interest are the areas of the first negative derivative plot having low values that correspond to areas of the HRM curves wherein the change in slope is small.","The same area of interest is used for all curves being normalized to one another.","The average signal value in the areas of interest across all curves being normalized are averaged and set to a first normalized signal value, such as 100, for the area of interest associated with the saturation region, and a second normalized value, such as 0, for the area of interest associated with the background region.","The remaining data points are normalized to relative to the first normalized signal value and the second normalized signal value.","In addition to providing insights into the similarities and differences of HRM curves generated from different samples, the first negative derivative plot from a sample may be analyzed to identify the presence of two or more peaks in the sample, indicating that the sample includes a heterogeneous mixture of double-stranded nucleic acids.","FIGS.","1C and 6 illustrates a method in accordance with embodiments of the invention to identify two or more melt peaks indicative of two or more double-stranded nucleic acid products in the sample, such as occurs with PCR reactions using primers that amplify multiple gene products.","First, a HRM curve is generated (block 20), as discussed above and a first negative derivative of the HRM curve is plotted (block 22).","A first Gaussian probability function 52 is fit to the first negative derivative plot (block 76).","The peak of the Gaussian probability function is identified as the melt peak data point (block 78).","The first Gaussian probability function is subtracted from the first negative derivative plot 34 (block 80) and a second Gaussian probability function 82 is fit (block 84) to subtracted curve.","In one embodiment, the second Gaussian probability function 82 has a second melt peak 85 if the peak of the second Gaussian probability function 82 is significantly different from the first and second background regions 38, 40 (block 86), and the process is repeated until no further peaks are detected (block 88).","In another embodiment, the second Gaussian probability function 82 has a second melt peak 85 if the peak of the second Gaussian probability function 82 is greater than a threshold that is calculated based on the saturation and background regions 38, 40.In an embodiment, up to four melt peaks may be identified with this process.","The melt peaks are then analyzed by plotting on a scatter plot (block 90).","In another embodiment illustrated in FIG.","7, the width of the first negative derivative plot at a fraction of the peak height is calculated and used to distinguish HRM curves between samples.","For example, a HRM curve is generated from HRM data for each sample (block 94).","The HRM curve 10 may be smoothed and the exponential decay removed as shown in FIG.","1A.","The HRM curves are normalized to one another (block 96) and the first negative derivative is plotted for the normalized HRM curves for each sample (block 98).","The melt peak is identified for each sample as discussed above (block 100).","The width of the first negative derivative plot at a specified fraction of the melt peak height is calculated or measured (block 102).","In one embodiment, the width is determined at about fifty percent of the melt peak height.","In an alternative embodiment, the width is determined at an optimum fraction of the melt peak height that is selected from the range between about 15 percent and about 85 percent of the melt peak height.","The same fraction of the melt peak height is used to calculate or measure the width of the HRM curves across all samples.","In one embodiment, the width of the first negative derivative plot and the melt temperature, i.e., the temperature value from the melt peak, is plotted on a two dimensional scatter plot (block 104).","In an alternative embodiment, the signal value from the melt peak is plotted along with the width value and the temperature value in a three dimensional scatter plot (block 104).","The data points on the scatter plots are then analyzed (block 106) as discussed below.","In another embodiment, also illustrated in FIG.","7, the area under the curve (AUC) of the first negative derivative plot is calculated at a fraction of the peak height and used to distinguish HRM curves between samples.","For example, a HRM curve is generated from HRM data for each sample.","The HRM curves may be smoothed and the exponential decay removed (not shown).","The HRM curves are normalized to one another (block 96) and the first negative derivative is plotted for the normalized HRM curves for each sample (block 98).","The melt peak is identified for each sample as discussed above (block 100).","The AUC of the first negative derivative plot is calculated or measured (block 102) at a specified fraction of the melt peak height.","In one embodiment, the AUC is determined at about fifty percent of the melt peak height.","In an alternative embodiment, the AUC is determined at an optimum fraction of the melt peak height that is selected from the range between about 15 percent and about 85 percent of the melt peak height.","The same fraction of the melt peak height is used to calculate or measure the AUC of the HRM curves across all samples.","In one embodiment, the AUC of the first negative derivative plot and the melt temperature, i.e., the temperature value from the melt peak is plotted on a two dimensional scatter plot (block 104).","In an alternative embodiment, the signal value from the melt peak is plotted along with the width value or the peak value and the temperature value in a three dimensional scatter plot (block 104).","The data points on the scatter plots are then analyzed (block 106) as discussed below.","In another embodiment, a Gaussian probability function is fit to the first negative derivative data and the AUC is calculated for the Gaussian probability function.","This technique is particularly useful to discriminate data wherein there are multiple peaks contained in the data, such as HRM data obtained from a heterogeneous mixture of double-stranded nucleic acids.","In this circumstance, the total AUC will include the AUC from each of the multiple peaks.","Thus, the total AUC from a heterogeneous mixture of double-stranded nucleic acids will be greater than the AUC for data from samples having a single peak.","Regardless of how the data points are identified in the embodiments described herein, the data points 107 are plotted on a scatter plot for analysis (FIG.","1D) and the scatter plot may be displayed on a display (214 of FIG.","13).","The data points 107 may be plotted on a scatter plot by a computer or other processing system.","The scatter plot has a first axis that corresponds to the melt temperature value and at least a second axis that corresponds to one of the peak height value, peak width value, and area under the curve value.","In another embodiment, the scatter plot has a third axis that differs from the second axis and corresponds to one of the peak height value, peak width value, and area under the curve value.","The data point 107 is plotted as an individual point and multiple data points may form clusters.","In some circumstances, different clusters of melt peak data points will be apparent.","Alternatively, the clusters of melt peak data points may be further analyzed using cluster grouping algorithms that are capable of distinguishing between different clusters of data points.","Cluster algorithm analysis is particularly useful for identifying which clusters to which each melt peak data point belongs or to identify clusters that are not otherwise apparent.","Exemplary cluster analysis algorithms include circle analysis algorithms for two-dimensional scatter plots and sphere analysis algorithms for three-dimensional scatter plots.","Cluster analysis algorithms allow for much more reliable automated calling of data points than is provided by traditional difference plot analysis.","In one embodiment, each melt peak data point on the scatter plot is compared with one or more standards.","The standards include known values for one or more target sequences, such as the known values such as temperature value, height value, width value and/or area under the curve for each genotype of a heterogeneous gene.","The Euclidian distance between the melt peak data point and the one or more standards is calculated.","For samples resulting in the identification of two or more melt peaks, the distances calculated between first identified melt peak data point and the standard value is weighted more heavily than the distances calculated for each subsequent melt peak data point.","For example, if a sample yields an HRM curve that results in three melt peaks being identified from the first negative derivative plot, the distance between the first melt peak data point and a standard value receives more weight during the subsequent analysis than the distances calculated for the second melt peak data point, which is subsequently weight more heavily than the distances calculated for the third melt peak data point.","In one embodiment, a multiplier is used to weight the first peak more heavily than subsequent peaks.","For example, the first peak may be multiplied by a value of four whereas the subsequent melt peaks are multiplied by multipliers decreasing in value, such as three, two, or one.","For each data point, a ratio of the weighted distances between the closest standard and the second closest standard may be calculated.","The ratio is used to indicate confidence with which a sample may be called as being like one of the first or the second closest standard.","The ratio may be converted to a percentage efficiency between 100 percent and about 50 percent to indicate from the standard is calculated.","Another aspect of the invention is directed to visualizing HRM data utilizing a virtual standard 110 (FIG.","8A).","For this aspect, HRM curves 112, 114, 116 (FIG.","8A) are generated from HRM data for each sample (FIG.","9, block 120).","A virtual standard 110 is provided as a baseline (block 122).","The virtual standard 110 is subtracted from the HRM curves 112, 114, 116 and the difference is plotted for each sample (block 124) and FIG.","8B.","Alterations in the virtual standard can result in the visualization of greater differences between the data curves 112, 112′, 114, 114′, 116, 116′ as illustrated in FIG.","8B.","In an alternative embodiment, the first negative derivative is plotted for the virtual standard and the HRM curves (FIG.","10, block 128) and the difference between the first negative derivatives is plotted (block 130) as a difference plot, and analyzed (block 126).","As mentioned above, the virtual standard contrasts with methods in routine use wherein an HRM curve from one sample in an experiment is used as a baseline against which other samples in the experiment are compared.","Embodiments of the virtual standard are useful when comparing HRM data across experiments and even across different platforms, which contrasts with the routine methods of analyzing HRM data which do not allow for such comparisons.","The virtual standard may be generated using a number of techniques as described in the various embodiments below.","In each of the virtual standard curve embodiments, the resulting virtual standard curve can then be saved and recalled for use with other data sets.","In one embodiment illustrated in FIG.","11, the raw HRM data from two or more samples are smoothed (block 136), the exponential decay is optionally removed (block 138), and the HRM data for the samples are normalized relative to one another (block 140).","Then, the signal values that correspond to a temperature values for the normalized HRM curves across all of the samples are averaged to generate the virtual standard (block 142).","The virtual standard can be used to generate a difference plot between each of the samples as described above.","In another embodiment, the virtual standard is a theoretical standardized curve based on the theoretical melting profile of the nucleic acid sequences being analyzed.","The theoretical melting profile of a nucleic acid sequence can be based on the known parameters affecting the melt temperature of a double-stranded nucleic acid, such as the percent of each type of nucleic acid, the sequence of the nucleic acids and the length of the nucleic acid strand.","For example, Visual OMP™ Nucleic Acid software from DNA Software could be used to generate a theoretical melt profile for a sequence of nucleic acids.","In an alternative embodiment, the virtual standards are user defined using a mathematical equation.","This is done by allowing the user to define where the exponential region starts or stops, a maximum slope, the inclusion of desired inflection points and combinations thereof for an equation describing a theoretical standard curve.","For example, in an embodiment, the user may generate a virtual standard by modifying an ideal melt curve defined by the Formula 1 below by setting the maximum signal value (RFUmax), the minimum signal value (RFUmin) and the melting temperature (Tm), wherein C is the curve parameter describing the steepness of the signal change and Ti is the x-axis value.","RFU=RFUmin+RFUmax(1−1/(1+e(C(Tm-Ti))) FORMULA 1: In an another embodiment, the user may generate a virtual standard by combining two weighted, ideal melt curves, such as two ideal curves generated by Formula 1 above.","The combined curve is defined by Formula 2 below.","In this embodiment, the user may set the maximum signal value (RFUmax), the minimum signal value (RFUmin), the melting temperatures for each curve (Tm1 and T m2) and the steepness of the signal change for each curve (C1 and C2) and the weight given to each curve (W1 and W2).","RFU=RFUmin+RFUmax(1−W1/(1+e(C1(Tm1-Ti)))−w2/(1+e(C2(Tm2-Ti)))) FORMULA 2: Virtual curves based on other modifications to ideal curves may be used as well.","In an alternative embodiment, a spline curve in a sigmoidal shape similar to a typical melt curve is provided that the user then forms into a desired shape such as by using a computer interface, such as a mouse, to click control the shape of the spline.","The user controlled virtual curves allow the user to match details from one or more of the sample HRM curves.","By making portions of the virtual standard match the details seen on one or more of the HRM curves generated from the HRM data, while other portions of the virtual standard match portions of other HRM curves, the differences between the HRM curves can be made more obvious than simply picking one curve as a standard could, as was previously done.","By allowing the user or the machine to adjust the shape of the virtual standard, some HRM curves in a data set may peak in the difference plot at one temperature, while the peak for other HRM curves would be at a different temperature or be in the negative direction from the first.","Additionally, HRM curves that are distinct from those used to construct the virtual standard would exhibit different shapes distinct from the others.","The analytical processes of the invention may be embodied as a method, a computer program product that includes program code 200 to execute the method, and/or a computer system 202 configured to execute the method FIG.","13.The method includes the steps described herein and illustrated in FIGS.","1 to 12 for analyzing HRM data of a nucleic acid.","The program code 200 includes instructions executable on a computer system for carrying out the steps of the method.","In one embodiment, the program code 200 includes instructions for analyzing HRM data and in particular, code for generating and displaying on a display 214 a scatter plot that includes the data points associated with the melting temperature.","The scatter plot has a first axis for plotting the melt value for each data point and a second axis for plotting one of a peak value, a width value, or an area under the curve value for each data point.","In another embodiment, the scatter plot has a third axis for plotting a third value for each data point that is the value remaining from the peak value, the width value, and the area under the curve value.","Embodiments of the invention, whether implemented as part of an operating system 204, application, component, program code 200, object, module or sequence of instructions executed by one or more processing units 206 are referred to herein as “program code.” The program code 200 typically comprises one or more instructions that are resident at various times in various memory 202 and storage devices 208 in the computer system 200 that, when read and executed by one or more processors 204 thereof cause that computer system 200 to perform the steps necessary to execute the instructions embodied in the program code 200 embodying the various aspects of the invention.","While embodiments of the invention are described in the context of fully functioning computing systems 200, those skilled in the art will appreciate that the various embodiments of the invention are capable of being distributed as a program product on a computer readable storage medium.","The program product may embody a variety of forms.","The invention applies equally regardless of the particular type of computer readable storage medium used to actually carry out the distribution of the program code 200.Examples of appropriate computer readable storage media for the program product include, but are not limited to, non-transitory recordable type media such as volatile and nonvolatile memory devices, floppy and other removable disks, hard disk drives, USB drives, optical disks (e.g.","CD-ROM's, DVD's, Blu-Ray discs, etc.","), among others.","Any of the individual processes described above or illustrated in FIGS.","1-12 may be formed into routines, procedures, methods, modules, objects, and the like, as is well known in the art.","It should be appreciated that embodiments of the invention are not limited to the specific organization and allocation of program functionality described herein.","In addition, the systems for analyzing HRM data may further include a module for collecting the HRM data (i.e.","a HRM data generator) 210 and a module for receiving HRM data 212.The HRM data collection module may include a thermal cycler and a device for detecting the signal value, that result from HRM analysis, such as a change in fluorescence from double-stranded nucleic acid over a range of temperatures.","HRM data collection modules as known in the art may be used in accordance with the invention.","The HRM data receiving module includes components and/or program code to receive HRM data from the HRM data collection module.","Example 1 A set of samples representing two homogenous samples types and one heterogeneous mix of the two was run in a PikoReal instrument and analyzed by the melt peak method.","For this example, olfactory receptor, family 10, subfamily J, member 5 (OR10J5) amplicons having a single nucleotide polymorphism (G or A) identified as rs4656837 were amplified using a standard PCR protocol in the presence of SYBR Green.","After amplification, the samples were slowly heated and fluorescence measured at regular intervals.","As shown in FIG.","14A, HRM curves 300 were generated for 18 samples and the exponential decay removed.","The HRM curves 300 were normalized based on user identified areas of the saturation region 302 and background region 304.FIG.","14B illustrates the normalized HRM curves 304.FIG.","14C illustrates the first negative derivative plots 320 from the normalized HRM curves of FIG.","14B.","FIG.","14D illustrates a scatter plot of the melt peak data points identified from the first negative derivative plots of FIG.","14C.","Clusters 330 of data points 332 are observed near each of the three standards 334 (larger circles, S1, S2, and S3 from left to right).","These data indicate that the samples include three different mixtures of double-stranded nucleic acids.","The first group of samples is homozygous for an amplicon having the G SNP.","The second group of sample is homozygous for an amplicon having the A SNP.","The third group is a heterozygous mixture of the A and G SNP amplicons.","As shown in Table 1, below, the analytical methods described herein clearly distinguish the difference between the homozygous and heterozygous clusters of data points.","Samples 1-6 clustered nearest to standard S1 in the upper left hand quadrant of the scatter plot.","Samples 7-12 clustered to standard S2 in the central lower region of the scatter plot and samples 13-18 clustered to standard S3 in the upper right region of the scatter plot.","By plotting the peak heights on the scatter plot as a function of the melt temperature, the clusters are easily further analyzed such as by determining their Euclidean distance from the first and second closest standards, and calculating the ratio of these distances.","The ratio was then used to calculate the percentage efficiency for the sample.","TABLE 1 Dist.","to Dist to 2d closest closest Ratio of Percentage Sample No.","Melt Temp.","Peak Height stand.","stand.","D1/D2 Efficiency 1 78.48 46.22 1 (S1) 111 (S2) 0.01 99.9% 2 78.51 46.33 1.5 (S1) 112 (S2) 0.01 98.7% 3 78.52 46.32 4 (S1) 110 (S2) 0.04 96% 4 78.57 46.34 15 (S1) 107 (S2) 0.14 96.5% 5 78.48 45.34 49 (S1) 72 (S2) 0.68 59.5 6 78.54 45.46 44 (S1) 65 (S2) 0.68 59.6 7 78.70 44.72 6 (S2) 101 (S1) 0.06 94.4 8 78.71 45.02 15 (S2) 87 (S1) 0.17 85.3 9 78.71 44.34 11 (S2) 119 (S1) 0.09 91.5 10 78.72 44.28 9 (S2) 123 (S1) 0.07 93.2 11 78.75 45.22 38 (S2) 87 (S1) 0.44 69.6 12 78.79 44.72 22 (S2) 102 (S3) 0.22 82.3 13 79.11 45.82 26 (S3) 132 (S2) 0.20 83.5 14 79.74 45.53 8 (S3) 125 (S2) 0.06 94 15 79.75 45.13 8 (S3) 119 (S2) 0.07 93.8 16 79.77 45.56 10 (S3) 133 (S2) 0.08 93 17 79.78 46.14 43 (S3) 152 (S2) 0.28 98 18 79.23 46.00 39 (S3) 158 (S2) 0.25 80.2 Example 2 In this example, the peak width was plotted to further discriminate the signal values of the HRM melt curves.","When mixed populations of double-stranded nucleic acids were present in the same sample undergoing HRM analysis, they tended to make the resulting HRM curve wider, especially when the difference in the melting temperatures of the individual probes were greater.","As observed with the data presented below, this method was found to be particularly useful when analyzing multiplexed reactions.","For this example, ToxA and ToxB were amplified using a standard PCR protocol in the presence two Solaris primers and fluorescent probes for ToxA and ToxB in c. difficile.","FIG.","15A shows data from a qPCR and HRM analysis experiment wherein each probe was used by itself or in combination with the other probe.","The data demonstrate that while the ToxA+ToxB curve had a similar melting temperature to the ToxA probe by itself, it is easily distinguished by the peak height (FIG.","15B) and the peak width (FIG.","15C).","While the present invention has been illustrated by the description of specific embodiments thereof, and while the embodiments have been described in considerable detail, it is not intended to restrict or in any way limit the scope of the appended claims to such detail.","The various features discussed herein may be used alone or in any combination.","Additional advantages and modifications will readily appear to those skilled in the art.","The invention in its broader aspects is therefore not limited to the specific details, representative apparatus and methods and illustrative examples shown and described.","Accordingly, departures may be made from such details without departing from the scope or spirit of the general inventive concept."]],"string":"[\n [\n \"METHODS AND SYSTEMS FOR HIGH RESOLUTION MELT ANALYSIS OF A NUCLEIC ACID SEQUENCE\",\n \"Described herein are methods and systems for analyzing and visualizing HRM data from a double-stranded nucleic acid.\",\n \"The HRM data is generally characterized by a plurality of data points each including a signal value associated with the concentration of a double-stranded nucleic acid in a sample and a temperature value associated with a the temperature of the sample.\",\n \"Embodiments of the invention analyze the HRM curves from samples using the first negative derivative of the HRM curve or a virtual standard.\",\n \"The first negative derivative plot method may be used to identify the melting temperature of a homogenous double-stranded nucleic acid in a sample, as well as the presence and melting temperature of heterogeneous double-stranded nucleic acids in the sample.\",\n \"Data points associated with the melting temperature are plotted on a scatter plot for analysis.\",\n \"The virtual standard allows for visualization of HRM data across data sets.\"\n ],\n [\n \"1.A method of visualizing HRM data from one or more samples wherein the HRM data is characterized by a plurality of data points each including a signal value associated with the concentration of a double-stranded nucleic acid in a sample and a temperature value associated with a the temperature of the sample, the method comprising: generating a HRM curve from the HRM data for each sample; providing a virtual standard; and plotting the differences between the HRM curve for each sample and the virtual curve.\",\n \"2.A method of visualizing HRM data from one or more samples wherein the HRM data is characterized by a plurality of data points each including a signal value associated with the concentration of a double-stranded nucleic acid in a sample and a temperature value associated with a the temperature of the sample, the method comprising: generating a HRM curve from the HRM data for each sample; providing a virtual standard; plotting the first negative derivative of the HRM curve for each sample and plotting the differences between the first negative derivative plot for each sample and the virtual curve.\",\n \"3.The method of claim 1 wherein the virtual standard comprises: averaging the signal across the HRM curves for each sample to result in a virtual standard curve.\",\n \"4.The method of claim 3 further comprising, prior to averaging the signal values across the HRM curves for each sample, at least one of smoothing the HRM for each sample, removing exponential decay from the HRM curve for each sample; and normalizing the HRM curves for each sample to one another.\",\n \"5.The method of claim 1 wherein the virtual standard comprises calculating a theoretical melting profile of a target double-stranded nucleic acid to generate the virtual standard.\",\n \"6.The method of claim 1 wherein the virtual standard comprises providing a formula to calculate the virtual standard wherein the variables in the formula are adjustable to define end points of the exponential region, a maximum slope for the exponential region, inclusion of desired inflection points in the exponential region, and combinations thereof.\",\n \"7.The method of claim 1 wherein the providing the virtual standard comprises providing a spline curve in a sigmoidal shape, wherein the shape of the spline curve may be altered by the user using a computer interface.\"\n ],\n [\n \" BACKGROUND High resolution melt (HRM) analysis allows for the detection of mutations, polymorphisms, and epigenetic differences in double-stranded nucleic acids in a sample without sequencing the nucleic acids.\",\n \"Typically, for HRM analysis, a target nucleic acid sequence is amplified using the polymerase chain reaction (PCR) technique in the presence of a reporter molecule, such as a fluorescent dye, that selectively fluoresces when associated with a double-stranded nucleic acid.\",\n \"It has been observed that the signal produced from monitoring the slow melt of a double-stranded nucleic acid, such as an amplified DNA sequence, follows a generally sigmoidal pattern in which the signal level decreases as a function of temperature.\",\n \"The shape of the HRM curve and the melt temperature, i.e., the temperature at which the signal exhibits the greatest amount of change, is determined by the specific sequence of nucleotides composing double-stranded nucleic acid.\",\n \"Samples having mixtures of double-stranded nucleic acids, such as occurs with a heterogeneous sample, or samples having one or more mutations, will exhibit changes in the shape of the HRM curve and/or a shift in the melting temperature.\",\n \"Existing HRM analysis is done by use of difference plot visualization, in which the changes in signal level of a data set from a first sample is used as a baseline, and the difference from data sets from other samples to the baseline is plotted across the entire temperature range.\",\n \"While this method can allow for the grouping of similar double-stranded nucleic acids, the results can be difficult to analyze, the view of the results is dependent upon the data chosen as the baseline, and automated grouping algorithms can be difficult to construct or can be confused by the baseline choice thus leading to different results.\",\n \"A need for a better method of analyzing HRM data was thus identified.\"\n ],\n [\n \" BRIEF SUMMARY Before HRM analysis was available, the temperature resolution of instruments was not able to distinguish small changes in double-stranded nucleic acid melt temperature such as those caused by single nucleotide changes.\",\n \"Even after HRM capable instruments have become available, melt temperature information has not been considered informative enough as melt temperature of a heterozygote sample may be very close to homozygote melt temperature.\",\n \"However, the when melt temperature data is combined with other information such as at least one of a peak height value, a peak width value, or an area under the curve value, discrimination between the melt temperatures from double stranded nucleic acids is greatly enhanced.\",\n \"Described herein are methods and systems for analyzing and visualizing HRM data from a double-stranded nucleic acid utilizing data points associated with the HRM data that includes a combination of the melt temperature and at least one of a peak height value, a peak width value and/or an area under the curve value.\",\n \"The HRM data is generally characterized by a plurality of data points each including a signal value associated with the concentration of a double-stranded nucleic acid in a sample and a temperature value associated with a the temperature of the sample.\",\n \"Embodiments of the invention analyze the HRM curves of samples using the first negative derivative of the HRM curve or by difference plot visualization of the HRM data using a virtual standard.\",\n \"In one embodiment, the method includes generating a HRM curve from the HRM data for each sample and plotting the first negative derivative of the HRM curves.\",\n \"The melt peak for each sample is identified from the first negative derivative plot for each sample and analyzed.\",\n \"In an embodiment, the melt peak, which represents the melt temperature for the sample, is identified as the data point along the first negative derivative plot having the greatest distance from the x-axis.\",\n \"In an alternative embodiment, a Gaussian probability function is fit to the first negative derivative plot and the melt peak is the data point along the Gaussian probability function having the greatest distance from the x-axis.\",\n \"In another alternative embodiment, the Gaussian probability function is subtracted from the first negative derivative curve and a second melt peak from the subtracted data set is identified.\",\n \"Additional melt peaks can be identified with additional Gaussian probability subtraction steps.\",\n \"In another alternative embodiment, HRM curves from at least two samples are normalized relative to one another.\",\n \"The first negative derivative is then plotted for the normalized HRM curves for each sample and the melt peaks for each sample are identified and analyzed.\",\n \"In an alternative embodiment, the melt peak is identified for a first negative derivative plot and the width of the plot is calculated at a fraction of the melt peak height.\",\n \"A data point having a temperature value and at least one of a width value or a peak height value is then analyzed, such as by plotting on a scatter plot.\",\n \"Another aspect of the invention is directed to improved methods of visualizing HRM data for one or more samples by generating a HRM curve for each sample, providing a virtual standard, and plotting the differences between the HRM curve for each sample and the virtual curve.\",\n \"An alternative embodiment further includes plotting the first negative derivative of the HRM curve and the virtual standard and then plotting the differences between the first negative plot for each sample and the virtual curve.\",\n \"The virtual curve can be provided using a number of techniques.\",\n \"In one embodiment, the signal values for the virtual curve are derived from the averages of the signal values for the HRM curves from the samples.\",\n \"In another embodiment, the virtual curve is a derived from the theoretical melting profile of a target double-stranded nucleic acid.\",\n \"In yet another embodiment, the virtual curve is calculated from a formula with variables that may be adjusted by the user.\",\n \"In a further embodiment, the virtual standard includes a spline curve in a sigmoidal shape that may be altered by the user using a computer interface.\"\n ],\n [\n \"CROSS-REFERENCE TO RELATED APPLICATIONS This application is a divisional application of U.S. patent application Ser.\",\n \"No.\",\n \"13/799,139 filed Mar.\",\n \"13, 2013, which claims the benefit of and priority to U.S.\",\n \"Provisional Application No.\",\n \"61/660,581 filed Jun.\",\n \"15, 2012, all of which are incorporated herein by reference.\",\n \"FIELD The present invention relates generally to the analysis of double-stranded nucleic acids and, more particularly, to the high resolution melt analysis of double-stranded nucleic acids.\",\n \"BACKGROUND High resolution melt (HRM) analysis allows for the detection of mutations, polymorphisms, and epigenetic differences in double-stranded nucleic acids in a sample without sequencing the nucleic acids.\",\n \"Typically, for HRM analysis, a target nucleic acid sequence is amplified using the polymerase chain reaction (PCR) technique in the presence of a reporter molecule, such as a fluorescent dye, that selectively fluoresces when associated with a double-stranded nucleic acid.\",\n \"It has been observed that the signal produced from monitoring the slow melt of a double-stranded nucleic acid, such as an amplified DNA sequence, follows a generally sigmoidal pattern in which the signal level decreases as a function of temperature.\",\n \"The shape of the HRM curve and the melt temperature, i.e., the temperature at which the signal exhibits the greatest amount of change, is determined by the specific sequence of nucleotides composing double-stranded nucleic acid.\",\n \"Samples having mixtures of double-stranded nucleic acids, such as occurs with a heterogeneous sample, or samples having one or more mutations, will exhibit changes in the shape of the HRM curve and/or a shift in the melting temperature.\",\n \"Existing HRM analysis is done by use of difference plot visualization, in which the changes in signal level of a data set from a first sample is used as a baseline, and the difference from data sets from other samples to the baseline is plotted across the entire temperature range.\",\n \"While this method can allow for the grouping of similar double-stranded nucleic acids, the results can be difficult to analyze, the view of the results is dependent upon the data chosen as the baseline, and automated grouping algorithms can be difficult to construct or can be confused by the baseline choice thus leading to different results.\",\n \"A need for a better method of analyzing HRM data was thus identified.\",\n \"BRIEF SUMMARY Before HRM analysis was available, the temperature resolution of instruments was not able to distinguish small changes in double-stranded nucleic acid melt temperature such as those caused by single nucleotide changes.\",\n \"Even after HRM capable instruments have become available, melt temperature information has not been considered informative enough as melt temperature of a heterozygote sample may be very close to homozygote melt temperature.\",\n \"However, the when melt temperature data is combined with other information such as at least one of a peak height value, a peak width value, or an area under the curve value, discrimination between the melt temperatures from double stranded nucleic acids is greatly enhanced.\",\n \"Described herein are methods and systems for analyzing and visualizing HRM data from a double-stranded nucleic acid utilizing data points associated with the HRM data that includes a combination of the melt temperature and at least one of a peak height value, a peak width value and/or an area under the curve value.\",\n \"The HRM data is generally characterized by a plurality of data points each including a signal value associated with the concentration of a double-stranded nucleic acid in a sample and a temperature value associated with a the temperature of the sample.\",\n \"Embodiments of the invention analyze the HRM curves of samples using the first negative derivative of the HRM curve or by difference plot visualization of the HRM data using a virtual standard.\",\n \"In one embodiment, the method includes generating a HRM curve from the HRM data for each sample and plotting the first negative derivative of the HRM curves.\",\n \"The melt peak for each sample is identified from the first negative derivative plot for each sample and analyzed.\",\n \"In an embodiment, the melt peak, which represents the melt temperature for the sample, is identified as the data point along the first negative derivative plot having the greatest distance from the x-axis.\",\n \"In an alternative embodiment, a Gaussian probability function is fit to the first negative derivative plot and the melt peak is the data point along the Gaussian probability function having the greatest distance from the x-axis.\",\n \"In another alternative embodiment, the Gaussian probability function is subtracted from the first negative derivative curve and a second melt peak from the subtracted data set is identified.\",\n \"Additional melt peaks can be identified with additional Gaussian probability subtraction steps.\",\n \"In another alternative embodiment, HRM curves from at least two samples are normalized relative to one another.\",\n \"The first negative derivative is then plotted for the normalized HRM curves for each sample and the melt peaks for each sample are identified and analyzed.\",\n \"In an alternative embodiment, the melt peak is identified for a first negative derivative plot and the width of the plot is calculated at a fraction of the melt peak height.\",\n \"A data point having a temperature value and at least one of a width value or a peak height value is then analyzed, such as by plotting on a scatter plot.\",\n \"Another aspect of the invention is directed to improved methods of visualizing HRM data for one or more samples by generating a HRM curve for each sample, providing a virtual standard, and plotting the differences between the HRM curve for each sample and the virtual curve.\",\n \"An alternative embodiment further includes plotting the first negative derivative of the HRM curve and the virtual standard and then plotting the differences between the first negative plot for each sample and the virtual curve.\",\n \"The virtual curve can be provided using a number of techniques.\",\n \"In one embodiment, the signal values for the virtual curve are derived from the averages of the signal values for the HRM curves from the samples.\",\n \"In another embodiment, the virtual curve is a derived from the theoretical melting profile of a target double-stranded nucleic acid.\",\n \"In yet another embodiment, the virtual curve is calculated from a formula with variables that may be adjusted by the user.\",\n \"In a further embodiment, the virtual standard includes a spline curve in a sigmoidal shape that may be altered by the user using a computer interface.\",\n \"BRIEF DESCRIPTION OF SEVERAL VIEWS OF THE DRAWINGS The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate various embodiments of the invention and, together with a general description of the invention given above and the detailed description of the embodiments given below, serve to explain the embodiments of the invention.\",\n \"FIG.\",\n \"1A is a graph illustrating an exemplary HRM curve in accordance with embodiments of the invention.\",\n \"FIG.\",\n \"1B is a graph illustrating an exemplary plot of the first negative derivative of the HRM curve of FIG.\",\n \"1A in accordance with embodiments of the invention.\",\n \"FIG.\",\n \"1C is a graph illustrating a first and a second Gaussian distribution curve fit to the exemplary plot of the first negative derivative of a the HRM curve of FIG.\",\n \"1B in accordance with embodiments of the invention.\",\n \"FIG.\",\n \"1D is a scatter plot of data points derived from a first negative derivative plot in accordance with embodiments of the invention.\",\n \"FIG.\",\n \"2 is a flow chart illustrating a process of analyzing HRM data in accordance with embodiments of the invention.\",\n \"FIG.\",\n \"3 is a flow chart illustrating a process for generating a HRM curve in accordance with embodiments of the invention.\",\n \"FIG.\",\n \"4 is a flow chart illustrating a process of analyzing HRM data in accordance with embodiments of the invention.\",\n \"FIG.\",\n \"5 is a flow chart illustrating a process of analyzing HRM data in accordance with embodiments of the invention.\",\n \"FIG.\",\n \"6 is a flow chart illustrating a process of analyzing HRM data in accordance with embodiments of the invention.\",\n \"FIG.\",\n \"7 is a flow chart illustrating a process of analyzing HRM data in accordance with embodiments of the invention.\",\n \"FIG.\",\n \"8A is a graph illustrating a process for visualizing HRM data in accordance with embodiments of the invention.\",\n \"FIG.\",\n \"8B is a graph illustrating a process for visualizing HRM data on a difference plot in accordance with embodiments of the invention.\",\n \"FIG.\",\n \"9 is a flow chart illustrating a process for visualizing HRM data in accordance with embodiments of the invention.\",\n \"FIG.\",\n \"10 is a flow chart illustrating a process for visualizing HRM data in accordance with embodiments of the invention.\",\n \"FIG.\",\n \"11 is a flow chart illustrating a process for generating a virtual standard in accordance with embodiments of the invention.\",\n \"FIG.\",\n \"12 is a flow chart illustrating a process for generating a virtual standard in accordance with embodiments of the invention.\",\n \"FIG.\",\n \"13 is a block diagram of a computer system in accordance with embodiments of the invention.\",\n \"FIG.\",\n \"14A is a graph illustrating HRM curves with the exponential decay removed in accordance with embodiments of the invention.\",\n \"FIG.\",\n \"14B is a graph illustrating the HRM curves of FIG.\",\n \"14A after being normalized in accordance with embodiments of the invention.\",\n \"FIG.\",\n \"14C is a graph illustrating a plot of the first negative derivative of the normalized HRM curves of FIG.\",\n \"14B in accordance with embodiments of the invention.\",\n \"FIG.\",\n \"14D is a scatter plot of data points derived from the graph of FIG.\",\n \"14C in accordance with embodiments of the invention.\",\n \"FIG.\",\n \"15A is a graph illustrating a plot of the first negative derivative of the HRM curves from a homogenous and heterogeneous double-stranded nucleic acid in accordance with embodiments of the invention.\",\n \"FIG.\",\n \"15B is a scatter plot of melt peak data points derived from the graph of FIG.\",\n \"15A in accordance with embodiments of the invention.\",\n \"FIG.\",\n \"15C is a scatter plot of peak width data points derived from the graph of FIG.\",\n \"15A in accordance with embodiments of the invention.\",\n \"DETAILED DESCRIPTION Complimentary strands of nucleic acids form relatively stable double strands of nucleic acids at lower temperatures.\",\n \"As the temperature of a sample containing a double-stranded nucleic acid is increased, the double-stranded nucleic acid melts into two single strands.\",\n \"Similarly, as the temperature of a sample containing complimentary single strands of nucleic acid is decreased, the complimentary nucleic acids will reassociate into double-stranded nucleic acids.\",\n \"The melt temperature of a double-stranded nucleic acid, i.e., the temperature at which a nucleic acid transitions between a double-stranded nucleic acid and a pair of single strands, is determined by the length and sequence of the nucleic acid strands.\",\n \"Differences between two or more double-stranded nucleic acids, such as double-stranded nucleic acids amplified using polymerase chain reaction (PCR), may be inferred by observing and analyzing the high resolution melting or high resolution reassociation of the double-stranded nucleic acids over a range of temperatures.\",\n \"As used herein, the terms “high resolution melting” or “high resolution melt” are understood to include both high resolution melt and high resolution reassociation.\",\n \"With reference to FIG.\",\n \"1A, and in accordance with embodiments of the invention, an improved method of analyzing high resolution melt (HRM) data includes analyzing data collected from the high resolution melting of a sample that includes at least one amplified double-stranded nucleic acid wherein the data is characterized by an ascending HRM curve 10.Similarly, the HRM data may be collected from the high resolution reassociation of a sample that includes complimentary single strands of a double-stranded nucleic acid.\",\n \"The HRM data from high resolution reassociation data is characterized by a descending HRM curve (not shown).\",\n \"The HRM curve 10 includes a temperature value along the x-axis and a signal value representative of the concentration of double-stranded nucleic acid in the sample at a given temperature value along the y-axis.\",\n \"In an exemplary embodiment, the temperature value is expressed in degrees Celsius and the signal value is expressed as relative fluorescent units (RFU's).\",\n \"In an exemplary embodiment, the signal value for a sample is obtained with a reporter molecule that selectively fluoresces when associated with a doubled stranded nucleic acid.\",\n \"Thus, the signal value, i.e., the level of fluorescence observed in a sample, is indicative of the concentration of double-stranded nucleic acid in the sample.\",\n \"Reporter molecules useful with embodiments of the invention described herein are those that selectively provide a signal, such as a fluorescent signal, when associated with a double-stranded nucleic acid.\",\n \"For example, fluorescent double-stranded nucleic dyes used in real time PCR reactions may be used.\",\n \"Exemplary reporter molecules include SYBR® Green I, SYBR® Gold, PicoGreen 0 (each available from Invitrogen), and LC Green®, Eva Green, Melt Doctor, SYTO®-9, SYTO®-13, SYTO®-16, SYTO®-60, SYTO®-62, SYTO®-64, SYTO®-82, POPO-3, TOTO-3, PO-PRO-3, TO-PRO-3, YO-PRO®-1, SYTOX® Orange, BEBO, BOXTO, Chromofy, as well as other reporter molecules that selectively fluoresce when associated with double-stranded nucleic acids.\",\n \"In addition to the use of reporter molecules that selectively associate with double stranded nucleic acids, the reporter molecules may also be associated with fluorescent probes or primer based systems.\",\n \"As used herein, the term reporter molecule is understood to include any system, molecule, probe, dye, or combination thereof that is capable of generating a signal that corresponds to the concentration of double-stranded nucleic acid in a sample at a particular temperature.\",\n \"For high resolution melting, the signal value is obtained from measurements taken at predetermined increments as the temperature of the sample is slowly increased from a temperature at which substantially all of the complementary nucleic acid strands in the sample are in the double-stranded state, to a temperature at which no double-stranded nucleic acid is detectable with the reporter molecule.\",\n \"For high resolution reassociation, the signal value is obtained from measurements taken at predetermined increments as the temperature of the sample is slowly decreased from a temperature at which substantially all of the complementary nucleic acid strands in the sample are in the single-stranded state, to a temperature at which substantially all of the nucleic acid is in a double-stranded state as detected with the reporter molecule.\",\n \"Typically, the signal value is measured over a range of temperatures from about 60 degrees Celsius to about 95 degrees Celsius; however, the temperature range may be increased or decreased as needed to analyze a specific nucleic acid sequence.\",\n \"In accordance with embodiments of the invention, the signal value is obtained as the temperature increases by fractions of a degree over at least a portion of the melting temperature range.\",\n \"In an embodiment, the signal value is obtained at about every 0.1 degrees Celsius over at least a portion of the melting temperature range.\",\n \"In an alternative embodiment, the signal value is obtained at about every 0.2 degrees Celsius over at least a portion of the melting temperature range.\",\n \"In an alternative embodiment, the signal value may be obtained at about every 0.04 degrees Celsius to about 5.0 degrees Celsius over at least a portion of the melting temperature range.\",\n \"With reference to FIG.\",\n \"1A, the data obtained from HRM analysis of a double-stranded nucleic acid generally forms a sigmoid shaped curve 10 having a saturation region 12, a region of exponential melting 14, and a background region 16.The saturation region 12 is a relatively flat region typically at lower temperature values in the curve 10 and characterized by high signal values because the double-stranded nucleic acid concentration in the sample is constant because at these temperatures the concentration of double-stranded nucleic acid in the sample does not change thus there is no change in the signal generated by the reporter molecule.\",\n \"In some embodiments, the double-stranded nucleic acid is saturated with reporter molecules whereas in other embodiments, the double-stranded nucleic acid is not saturated.\",\n \"The region of exponential melting 14 is the central region of the curve 10 wherein the signal value generated by the reporter molecule changes in relation to exponential changes in the concentration of double-stranded nucleic acid as the double-stranded nucleic acid melts or reassociates with changes in the temperature.\",\n \"The background region 16 is a relatively flat region typically at higher temperature values.\",\n \"In the background region 16, the concentration of double-stranded nucleic acids in the sample is reduced to levels that the signal from the reporter molecule associated with double-stranded nucleic acids cannot overcome the background signals in the reaction chamber.\",\n \"HRM curves, such as shown in FIG.\",\n \"1A, are generally analyzed to determine if two or more samples include identical or different double-stranded nucleic acid sequences.\",\n \"To make this determination, HRM curves from two or more samples are typically analyzed for differences between the curves from the samples.\",\n \"Differences between HRM curves generated from the samples may be observed as differences in the melt temperature of the double-stranded nucleic acids from the samples, differences in the shape of the HRM curves, or differences in both the melt temperatures and the shapes of the HRM curves.\",\n \"The melt temperature is the temperature at which the greatest amount of double-stranded nucleic acid melts.\",\n \"For HRM curve analysis, the melt temperature is the temperature at which the absolute value of the slope in the region of exponential melting 14 is the greatest.\",\n \"In contrast to routine methods of analyzing HRM data, embodiments of the invention analyze the HRM curves of samples using a plot of the first negative derivative of the HRM curves or the visualization of HRM data using a virtual standard.\",\n \"Embodiments of these methods are referred to herein as the “derivative plot methods” of FIGS.\",\n \"1A-7 and the “virtual standard methods” of FIGS.\",\n \"8A-12.With reference to FIG.\",\n \"2, the derivative plot methods generally include the generation of a HRM curve (block 20), plotting the first negative derivative of the HRM curve (block 22), identifying a melt peak of the first negative derivative plot (block 24), and analyzing the melt peak (26).\",\n \"FIG.\",\n \"1A illustrates an exemplary HRM curve 10.FIG.\",\n \"3 illustrates an exemplary method of generating an HRM curve for analysis in accordance with embodiments of the invention.\",\n \"First, a HRM curve is plotted utilizing HRM data gather from the high resolution melting or high resolution reassociation of a sample containing a double-stranded nucleic acid and a reporter molecule (block 28).\",\n \"The HRM data includes a series of data points having a signal value and a temperature value.\",\n \"The HRM data may be obtained from an HRM analysis system, such as one that includes a thermal cycler for heating and/or cooling the sample in a controlled manner and an optical system for obtaining signal values as the sample is heated or cooled.\",\n \"With continued reference to FIG.\",\n \"3, the HRM data may optionally be internally smoothed (block 30), have the exponential decay removed (block 32), or may be both internally smoothed (block 30) and have the exponential decay removed (block 32).\",\n \"The internal smoothing process (block 30) may employ any process that internally removes insignificant variations in the data that are not associated with changes in the concentration of double-stranded nucleic acid.\",\n \"For example, in one embodiment, the smoothing process employs a rolling average method that averages the product values for a plurality of consecutive data points from the HRM data.\",\n \"In another embodiment, the data are smoothed with a Savitzky-Golay smoothing filter by fitting an nth degree polynome to a plurality of consecutive data points and calculating a smoothed product value for one or several data points with the plurality of data points.\",\n \"In one embodiment, the user may optionally designate the number of data points used for the rolling average.\",\n \"The exponential decay removal (block 32) process removes decreasing signal value trends that are not related to changes in the double-stranded nucleic acid concentration.\",\n \"Exponential decay can be removed by known processes, such as mathematical processes that calculate the amount of decay observed in the saturation region 12 (FIG.\",\n \"1A).\",\n \"For example, a line segment may be fit by linear regression to a subset of data points in the saturation region.\",\n \"The slope of the line segment may then be used to correct the HRM curve 10.In another example, the exponential decay is removed from the curve directly by multiplying the measured melting curve by a correction function which is exponentially dependent on the temperature.\",\n \"After generating the HRM curve, the first negative derivative is plotted for the HRM curve (block 32 of FIG.\",\n \"2) and the first negative derivative plot is analyzed to identify its melt peak (block 46).\",\n \"FIG.\",\n \"1B an exemplary first negative derivative plot 34.The first negative derivative plot 34 of a homogenous sample, i.e., a sample that mostly contains complimentary double-stranded nucleic acids, has five regions: (1) a first background region 38, (2) a ascending region 40, (3) a melt peak 36, and (4) a descending region 42, and (5) a background region 44.The first negative derivative curve of a heterogeneous sample, i.e., a sample that includes two or more different nucleic acids, will have two or more melt peaks associate with the two or more nucleic acids, but the two or more melt peaks may mask one another such that the first negative derivative curve of the heterogeneous sample also appears to have the same five regions.\",\n \"The first and second background regions 38, 44 of the first negative derivative plot 34 of FIG.\",\n \"1B correspond to the saturation region 12 and background region 16, respectively, of the HRM curve 10 of FIG.\",\n \"1A.\",\n \"The ascending region 40 and the descending region 42 of the first negative derivative plot 34 of FIG.\",\n \"1B correspond to portions of the exponential melting region 14 of the HRM curve 10 of FIG.\",\n \"1A.\",\n \"The melt peak 36 of the first negative derivative plot 34 of FIG.\",\n \"1B corresponds to the point along the exponential melting region 14 of FIG.\",\n \"1A having the steepest slope, i.e., the melt temperature.\",\n \"As illustrated in FIG.\",\n \"1B, in an embodiment, the melt peak 36 is represented in the first negative derivative plot 34 as the data point having the greatest amplitude, i.e., the greatest distance h from the x-axis where the x-axis value is zero.\",\n \"The melt peak has a height value that corresponds to the first negative derivative of the signal value and a temperature value that corresponds with the melt temperature for the sample.\",\n \"The melt peaks from one or more samples may then be analyzed (block 26 of FIG.\",\n \"2), as discussed in greater detail below.\",\n \"In an alternative embodiment, illustrated in FIGS.\",\n \"1C and 4, the melt peak 36 is identified from a Gaussian probability function 52 that is fit to the first negative derivative curve 34.A HRM curve is generated with HRM data from a sample (block 20) and the first negative derivative of the HRM curve is plotted (block 22).\",\n \"A Gaussian probability function 52 is then fit to the first negative derivative curve 34 (block 54).\",\n \"The peak of the first Gaussian probability function 52 is identified as the melt peak 36, i.e., the point along the function 52 having the greatest amplitude, i.e., the greatest distance h from the x-axis where the x-axis value is zero (block 56).\",\n \"The melt peak data point may then be analyzed (block 58), as discussed in greater detail below.\",\n \"The melt peak data point from a first sample may be compared with the melt peak(s) of one or more other samples, or compared to known standard values, to determine if the sequences of the samples are the same or different.\",\n \"If the melt peaks from the one or samples are different from one another, i.e., have a different signal value, a different temperature value, or both the signal value and the temperature value are different, then the sequences of the nucleic acids in the samples are not identical.\",\n \"In contrast, if the melt peaks from the sample are the same, then the sequences of the nucleic acids in the samples are likely to be the same.\",\n \"Processes for analyzing the melt peaks are discussed in greater detail below.\",\n \"Comparing the peak values between samples can be difficult due to variability in the peak values that is not associated with the double-stranded nucleic acids in the samples.\",\n \"For example, the melt peak values can vary due to the position of the reaction well on the thermal block or due to inaccuracies in measuring the reagents used in the analysis.\",\n \"In an embodiment illustrated in FIG.\",\n \"5, the HRM curves from a plurality of samples are normalized before plotting the first negative derivative for each HRM curve to account for at least a portion of the variability in the melt peaks that is not associated with the double-stranded nucleic acids in the samples.\",\n \"Normalizing the HRM curves results in first negative derivative plots that have identical areas under the curves.\",\n \"Because the area under the curve for the normalized plots are identical, any significant difference in the melt peaks for each plot indicates a difference in the shapes of the underlying HRM curves and, correspondingly, indicates a difference in the double-stranded nucleic acids from which the HRM curves originate.\",\n \"For this embodiment, HRM curves are generated from the HRM data for each sample (block 60).\",\n \"The HRM curves may optionally be internally smoothed and the exponential decay removed as previously described.\",\n \"The HRM curves are then normalized relative to one another (block 62, as discussed below).\",\n \"The first negative derivative is plotted for each of the normalized HRM curves (block 64) and the melt peaks are identified for the first negative derivative plot from the normalized HRM curves for each sample (block 66).\",\n \"The melt peaks are plotted as data points on a scatter plot (block 68).\",\n \"The melts peaks for each sample may then be analyzed to determine if they are the same or different (block 70).\",\n \"This method has the advantage of distinguishing melt peaks that have very similar melt temperatures, but different HRM curve shapes.\",\n \"In a variation of this embodiment, a Gaussian probability function is fit to the first negative derivative plot and the melt peak is identified as the peak of the Gaussian probability function, as described above with reference to FIG.\",\n \"4.HRM data may be normalized by any process that normalizes the data along the thermal axis (x-axis), the signal axis (y-axis) or along both the thermal axis and the signal axis.\",\n \"For thermal axis normalization, each HRM curve is shifted on the thermal axis based its location on the thermal block as determined by the thermal characteristics of the thermal block.\",\n \"For example, the detected melt temperature for each well may be multiplied by a standard adjustment multiplier that corresponds to the typical variation of that well from the mean of the block.\",\n \"The signal axis may be normalized based on user defined areas of interest in the saturation region and the background regions or preliminary areas of interest in these regions may be automatically calculated.\",\n \"In one embodiment, the areas of interest are identified from a first negative derivative plot of the HRM curve.\",\n \"The areas of interest are the areas of the first negative derivative plot having low values that correspond to areas of the HRM curves wherein the change in slope is small.\",\n \"The same area of interest is used for all curves being normalized to one another.\",\n \"The average signal value in the areas of interest across all curves being normalized are averaged and set to a first normalized signal value, such as 100, for the area of interest associated with the saturation region, and a second normalized value, such as 0, for the area of interest associated with the background region.\",\n \"The remaining data points are normalized to relative to the first normalized signal value and the second normalized signal value.\",\n \"In addition to providing insights into the similarities and differences of HRM curves generated from different samples, the first negative derivative plot from a sample may be analyzed to identify the presence of two or more peaks in the sample, indicating that the sample includes a heterogeneous mixture of double-stranded nucleic acids.\",\n \"FIGS.\",\n \"1C and 6 illustrates a method in accordance with embodiments of the invention to identify two or more melt peaks indicative of two or more double-stranded nucleic acid products in the sample, such as occurs with PCR reactions using primers that amplify multiple gene products.\",\n \"First, a HRM curve is generated (block 20), as discussed above and a first negative derivative of the HRM curve is plotted (block 22).\",\n \"A first Gaussian probability function 52 is fit to the first negative derivative plot (block 76).\",\n \"The peak of the Gaussian probability function is identified as the melt peak data point (block 78).\",\n \"The first Gaussian probability function is subtracted from the first negative derivative plot 34 (block 80) and a second Gaussian probability function 82 is fit (block 84) to subtracted curve.\",\n \"In one embodiment, the second Gaussian probability function 82 has a second melt peak 85 if the peak of the second Gaussian probability function 82 is significantly different from the first and second background regions 38, 40 (block 86), and the process is repeated until no further peaks are detected (block 88).\",\n \"In another embodiment, the second Gaussian probability function 82 has a second melt peak 85 if the peak of the second Gaussian probability function 82 is greater than a threshold that is calculated based on the saturation and background regions 38, 40.In an embodiment, up to four melt peaks may be identified with this process.\",\n \"The melt peaks are then analyzed by plotting on a scatter plot (block 90).\",\n \"In another embodiment illustrated in FIG.\",\n \"7, the width of the first negative derivative plot at a fraction of the peak height is calculated and used to distinguish HRM curves between samples.\",\n \"For example, a HRM curve is generated from HRM data for each sample (block 94).\",\n \"The HRM curve 10 may be smoothed and the exponential decay removed as shown in FIG.\",\n \"1A.\",\n \"The HRM curves are normalized to one another (block 96) and the first negative derivative is plotted for the normalized HRM curves for each sample (block 98).\",\n \"The melt peak is identified for each sample as discussed above (block 100).\",\n \"The width of the first negative derivative plot at a specified fraction of the melt peak height is calculated or measured (block 102).\",\n \"In one embodiment, the width is determined at about fifty percent of the melt peak height.\",\n \"In an alternative embodiment, the width is determined at an optimum fraction of the melt peak height that is selected from the range between about 15 percent and about 85 percent of the melt peak height.\",\n \"The same fraction of the melt peak height is used to calculate or measure the width of the HRM curves across all samples.\",\n \"In one embodiment, the width of the first negative derivative plot and the melt temperature, i.e., the temperature value from the melt peak, is plotted on a two dimensional scatter plot (block 104).\",\n \"In an alternative embodiment, the signal value from the melt peak is plotted along with the width value and the temperature value in a three dimensional scatter plot (block 104).\",\n \"The data points on the scatter plots are then analyzed (block 106) as discussed below.\",\n \"In another embodiment, also illustrated in FIG.\",\n \"7, the area under the curve (AUC) of the first negative derivative plot is calculated at a fraction of the peak height and used to distinguish HRM curves between samples.\",\n \"For example, a HRM curve is generated from HRM data for each sample.\",\n \"The HRM curves may be smoothed and the exponential decay removed (not shown).\",\n \"The HRM curves are normalized to one another (block 96) and the first negative derivative is plotted for the normalized HRM curves for each sample (block 98).\",\n \"The melt peak is identified for each sample as discussed above (block 100).\",\n \"The AUC of the first negative derivative plot is calculated or measured (block 102) at a specified fraction of the melt peak height.\",\n \"In one embodiment, the AUC is determined at about fifty percent of the melt peak height.\",\n \"In an alternative embodiment, the AUC is determined at an optimum fraction of the melt peak height that is selected from the range between about 15 percent and about 85 percent of the melt peak height.\",\n \"The same fraction of the melt peak height is used to calculate or measure the AUC of the HRM curves across all samples.\",\n \"In one embodiment, the AUC of the first negative derivative plot and the melt temperature, i.e., the temperature value from the melt peak is plotted on a two dimensional scatter plot (block 104).\",\n \"In an alternative embodiment, the signal value from the melt peak is plotted along with the width value or the peak value and the temperature value in a three dimensional scatter plot (block 104).\",\n \"The data points on the scatter plots are then analyzed (block 106) as discussed below.\",\n \"In another embodiment, a Gaussian probability function is fit to the first negative derivative data and the AUC is calculated for the Gaussian probability function.\",\n \"This technique is particularly useful to discriminate data wherein there are multiple peaks contained in the data, such as HRM data obtained from a heterogeneous mixture of double-stranded nucleic acids.\",\n \"In this circumstance, the total AUC will include the AUC from each of the multiple peaks.\",\n \"Thus, the total AUC from a heterogeneous mixture of double-stranded nucleic acids will be greater than the AUC for data from samples having a single peak.\",\n \"Regardless of how the data points are identified in the embodiments described herein, the data points 107 are plotted on a scatter plot for analysis (FIG.\",\n \"1D) and the scatter plot may be displayed on a display (214 of FIG.\",\n \"13).\",\n \"The data points 107 may be plotted on a scatter plot by a computer or other processing system.\",\n \"The scatter plot has a first axis that corresponds to the melt temperature value and at least a second axis that corresponds to one of the peak height value, peak width value, and area under the curve value.\",\n \"In another embodiment, the scatter plot has a third axis that differs from the second axis and corresponds to one of the peak height value, peak width value, and area under the curve value.\",\n \"The data point 107 is plotted as an individual point and multiple data points may form clusters.\",\n \"In some circumstances, different clusters of melt peak data points will be apparent.\",\n \"Alternatively, the clusters of melt peak data points may be further analyzed using cluster grouping algorithms that are capable of distinguishing between different clusters of data points.\",\n \"Cluster algorithm analysis is particularly useful for identifying which clusters to which each melt peak data point belongs or to identify clusters that are not otherwise apparent.\",\n \"Exemplary cluster analysis algorithms include circle analysis algorithms for two-dimensional scatter plots and sphere analysis algorithms for three-dimensional scatter plots.\",\n \"Cluster analysis algorithms allow for much more reliable automated calling of data points than is provided by traditional difference plot analysis.\",\n \"In one embodiment, each melt peak data point on the scatter plot is compared with one or more standards.\",\n \"The standards include known values for one or more target sequences, such as the known values such as temperature value, height value, width value and/or area under the curve for each genotype of a heterogeneous gene.\",\n \"The Euclidian distance between the melt peak data point and the one or more standards is calculated.\",\n \"For samples resulting in the identification of two or more melt peaks, the distances calculated between first identified melt peak data point and the standard value is weighted more heavily than the distances calculated for each subsequent melt peak data point.\",\n \"For example, if a sample yields an HRM curve that results in three melt peaks being identified from the first negative derivative plot, the distance between the first melt peak data point and a standard value receives more weight during the subsequent analysis than the distances calculated for the second melt peak data point, which is subsequently weight more heavily than the distances calculated for the third melt peak data point.\",\n \"In one embodiment, a multiplier is used to weight the first peak more heavily than subsequent peaks.\",\n \"For example, the first peak may be multiplied by a value of four whereas the subsequent melt peaks are multiplied by multipliers decreasing in value, such as three, two, or one.\",\n \"For each data point, a ratio of the weighted distances between the closest standard and the second closest standard may be calculated.\",\n \"The ratio is used to indicate confidence with which a sample may be called as being like one of the first or the second closest standard.\",\n \"The ratio may be converted to a percentage efficiency between 100 percent and about 50 percent to indicate from the standard is calculated.\",\n \"Another aspect of the invention is directed to visualizing HRM data utilizing a virtual standard 110 (FIG.\",\n \"8A).\",\n \"For this aspect, HRM curves 112, 114, 116 (FIG.\",\n \"8A) are generated from HRM data for each sample (FIG.\",\n \"9, block 120).\",\n \"A virtual standard 110 is provided as a baseline (block 122).\",\n \"The virtual standard 110 is subtracted from the HRM curves 112, 114, 116 and the difference is plotted for each sample (block 124) and FIG.\",\n \"8B.\",\n \"Alterations in the virtual standard can result in the visualization of greater differences between the data curves 112, 112′, 114, 114′, 116, 116′ as illustrated in FIG.\",\n \"8B.\",\n \"In an alternative embodiment, the first negative derivative is plotted for the virtual standard and the HRM curves (FIG.\",\n \"10, block 128) and the difference between the first negative derivatives is plotted (block 130) as a difference plot, and analyzed (block 126).\",\n \"As mentioned above, the virtual standard contrasts with methods in routine use wherein an HRM curve from one sample in an experiment is used as a baseline against which other samples in the experiment are compared.\",\n \"Embodiments of the virtual standard are useful when comparing HRM data across experiments and even across different platforms, which contrasts with the routine methods of analyzing HRM data which do not allow for such comparisons.\",\n \"The virtual standard may be generated using a number of techniques as described in the various embodiments below.\",\n \"In each of the virtual standard curve embodiments, the resulting virtual standard curve can then be saved and recalled for use with other data sets.\",\n \"In one embodiment illustrated in FIG.\",\n \"11, the raw HRM data from two or more samples are smoothed (block 136), the exponential decay is optionally removed (block 138), and the HRM data for the samples are normalized relative to one another (block 140).\",\n \"Then, the signal values that correspond to a temperature values for the normalized HRM curves across all of the samples are averaged to generate the virtual standard (block 142).\",\n \"The virtual standard can be used to generate a difference plot between each of the samples as described above.\",\n \"In another embodiment, the virtual standard is a theoretical standardized curve based on the theoretical melting profile of the nucleic acid sequences being analyzed.\",\n \"The theoretical melting profile of a nucleic acid sequence can be based on the known parameters affecting the melt temperature of a double-stranded nucleic acid, such as the percent of each type of nucleic acid, the sequence of the nucleic acids and the length of the nucleic acid strand.\",\n \"For example, Visual OMP™ Nucleic Acid software from DNA Software could be used to generate a theoretical melt profile for a sequence of nucleic acids.\",\n \"In an alternative embodiment, the virtual standards are user defined using a mathematical equation.\",\n \"This is done by allowing the user to define where the exponential region starts or stops, a maximum slope, the inclusion of desired inflection points and combinations thereof for an equation describing a theoretical standard curve.\",\n \"For example, in an embodiment, the user may generate a virtual standard by modifying an ideal melt curve defined by the Formula 1 below by setting the maximum signal value (RFUmax), the minimum signal value (RFUmin) and the melting temperature (Tm), wherein C is the curve parameter describing the steepness of the signal change and Ti is the x-axis value.\",\n \"RFU=RFUmin+RFUmax(1−1/(1+e(C(Tm-Ti))) FORMULA 1: In an another embodiment, the user may generate a virtual standard by combining two weighted, ideal melt curves, such as two ideal curves generated by Formula 1 above.\",\n \"The combined curve is defined by Formula 2 below.\",\n \"In this embodiment, the user may set the maximum signal value (RFUmax), the minimum signal value (RFUmin), the melting temperatures for each curve (Tm1 and T m2) and the steepness of the signal change for each curve (C1 and C2) and the weight given to each curve (W1 and W2).\",\n \"RFU=RFUmin+RFUmax(1−W1/(1+e(C1(Tm1-Ti)))−w2/(1+e(C2(Tm2-Ti)))) FORMULA 2: Virtual curves based on other modifications to ideal curves may be used as well.\",\n \"In an alternative embodiment, a spline curve in a sigmoidal shape similar to a typical melt curve is provided that the user then forms into a desired shape such as by using a computer interface, such as a mouse, to click control the shape of the spline.\",\n \"The user controlled virtual curves allow the user to match details from one or more of the sample HRM curves.\",\n \"By making portions of the virtual standard match the details seen on one or more of the HRM curves generated from the HRM data, while other portions of the virtual standard match portions of other HRM curves, the differences between the HRM curves can be made more obvious than simply picking one curve as a standard could, as was previously done.\",\n \"By allowing the user or the machine to adjust the shape of the virtual standard, some HRM curves in a data set may peak in the difference plot at one temperature, while the peak for other HRM curves would be at a different temperature or be in the negative direction from the first.\",\n \"Additionally, HRM curves that are distinct from those used to construct the virtual standard would exhibit different shapes distinct from the others.\",\n \"The analytical processes of the invention may be embodied as a method, a computer program product that includes program code 200 to execute the method, and/or a computer system 202 configured to execute the method FIG.\",\n \"13.The method includes the steps described herein and illustrated in FIGS.\",\n \"1 to 12 for analyzing HRM data of a nucleic acid.\",\n \"The program code 200 includes instructions executable on a computer system for carrying out the steps of the method.\",\n \"In one embodiment, the program code 200 includes instructions for analyzing HRM data and in particular, code for generating and displaying on a display 214 a scatter plot that includes the data points associated with the melting temperature.\",\n \"The scatter plot has a first axis for plotting the melt value for each data point and a second axis for plotting one of a peak value, a width value, or an area under the curve value for each data point.\",\n \"In another embodiment, the scatter plot has a third axis for plotting a third value for each data point that is the value remaining from the peak value, the width value, and the area under the curve value.\",\n \"Embodiments of the invention, whether implemented as part of an operating system 204, application, component, program code 200, object, module or sequence of instructions executed by one or more processing units 206 are referred to herein as “program code.” The program code 200 typically comprises one or more instructions that are resident at various times in various memory 202 and storage devices 208 in the computer system 200 that, when read and executed by one or more processors 204 thereof cause that computer system 200 to perform the steps necessary to execute the instructions embodied in the program code 200 embodying the various aspects of the invention.\",\n \"While embodiments of the invention are described in the context of fully functioning computing systems 200, those skilled in the art will appreciate that the various embodiments of the invention are capable of being distributed as a program product on a computer readable storage medium.\",\n \"The program product may embody a variety of forms.\",\n \"The invention applies equally regardless of the particular type of computer readable storage medium used to actually carry out the distribution of the program code 200.Examples of appropriate computer readable storage media for the program product include, but are not limited to, non-transitory recordable type media such as volatile and nonvolatile memory devices, floppy and other removable disks, hard disk drives, USB drives, optical disks (e.g.\",\n \"CD-ROM's, DVD's, Blu-Ray discs, etc.\",\n \"), among others.\",\n \"Any of the individual processes described above or illustrated in FIGS.\",\n \"1-12 may be formed into routines, procedures, methods, modules, objects, and the like, as is well known in the art.\",\n \"It should be appreciated that embodiments of the invention are not limited to the specific organization and allocation of program functionality described herein.\",\n \"In addition, the systems for analyzing HRM data may further include a module for collecting the HRM data (i.e.\",\n \"a HRM data generator) 210 and a module for receiving HRM data 212.The HRM data collection module may include a thermal cycler and a device for detecting the signal value, that result from HRM analysis, such as a change in fluorescence from double-stranded nucleic acid over a range of temperatures.\",\n \"HRM data collection modules as known in the art may be used in accordance with the invention.\",\n \"The HRM data receiving module includes components and/or program code to receive HRM data from the HRM data collection module.\",\n \"Example 1 A set of samples representing two homogenous samples types and one heterogeneous mix of the two was run in a PikoReal instrument and analyzed by the melt peak method.\",\n \"For this example, olfactory receptor, family 10, subfamily J, member 5 (OR10J5) amplicons having a single nucleotide polymorphism (G or A) identified as rs4656837 were amplified using a standard PCR protocol in the presence of SYBR Green.\",\n \"After amplification, the samples were slowly heated and fluorescence measured at regular intervals.\",\n \"As shown in FIG.\",\n \"14A, HRM curves 300 were generated for 18 samples and the exponential decay removed.\",\n \"The HRM curves 300 were normalized based on user identified areas of the saturation region 302 and background region 304.FIG.\",\n \"14B illustrates the normalized HRM curves 304.FIG.\",\n \"14C illustrates the first negative derivative plots 320 from the normalized HRM curves of FIG.\",\n \"14B.\",\n \"FIG.\",\n \"14D illustrates a scatter plot of the melt peak data points identified from the first negative derivative plots of FIG.\",\n \"14C.\",\n \"Clusters 330 of data points 332 are observed near each of the three standards 334 (larger circles, S1, S2, and S3 from left to right).\",\n \"These data indicate that the samples include three different mixtures of double-stranded nucleic acids.\",\n \"The first group of samples is homozygous for an amplicon having the G SNP.\",\n \"The second group of sample is homozygous for an amplicon having the A SNP.\",\n \"The third group is a heterozygous mixture of the A and G SNP amplicons.\",\n \"As shown in Table 1, below, the analytical methods described herein clearly distinguish the difference between the homozygous and heterozygous clusters of data points.\",\n \"Samples 1-6 clustered nearest to standard S1 in the upper left hand quadrant of the scatter plot.\",\n \"Samples 7-12 clustered to standard S2 in the central lower region of the scatter plot and samples 13-18 clustered to standard S3 in the upper right region of the scatter plot.\",\n \"By plotting the peak heights on the scatter plot as a function of the melt temperature, the clusters are easily further analyzed such as by determining their Euclidean distance from the first and second closest standards, and calculating the ratio of these distances.\",\n \"The ratio was then used to calculate the percentage efficiency for the sample.\",\n \"TABLE 1 Dist.\",\n \"to Dist to 2d closest closest Ratio of Percentage Sample No.\",\n \"Melt Temp.\",\n \"Peak Height stand.\",\n \"stand.\",\n \"D1/D2 Efficiency 1 78.48 46.22 1 (S1) 111 (S2) 0.01 99.9% 2 78.51 46.33 1.5 (S1) 112 (S2) 0.01 98.7% 3 78.52 46.32 4 (S1) 110 (S2) 0.04 96% 4 78.57 46.34 15 (S1) 107 (S2) 0.14 96.5% 5 78.48 45.34 49 (S1) 72 (S2) 0.68 59.5 6 78.54 45.46 44 (S1) 65 (S2) 0.68 59.6 7 78.70 44.72 6 (S2) 101 (S1) 0.06 94.4 8 78.71 45.02 15 (S2) 87 (S1) 0.17 85.3 9 78.71 44.34 11 (S2) 119 (S1) 0.09 91.5 10 78.72 44.28 9 (S2) 123 (S1) 0.07 93.2 11 78.75 45.22 38 (S2) 87 (S1) 0.44 69.6 12 78.79 44.72 22 (S2) 102 (S3) 0.22 82.3 13 79.11 45.82 26 (S3) 132 (S2) 0.20 83.5 14 79.74 45.53 8 (S3) 125 (S2) 0.06 94 15 79.75 45.13 8 (S3) 119 (S2) 0.07 93.8 16 79.77 45.56 10 (S3) 133 (S2) 0.08 93 17 79.78 46.14 43 (S3) 152 (S2) 0.28 98 18 79.23 46.00 39 (S3) 158 (S2) 0.25 80.2 Example 2 In this example, the peak width was plotted to further discriminate the signal values of the HRM melt curves.\",\n \"When mixed populations of double-stranded nucleic acids were present in the same sample undergoing HRM analysis, they tended to make the resulting HRM curve wider, especially when the difference in the melting temperatures of the individual probes were greater.\",\n \"As observed with the data presented below, this method was found to be particularly useful when analyzing multiplexed reactions.\",\n \"For this example, ToxA and ToxB were amplified using a standard PCR protocol in the presence two Solaris primers and fluorescent probes for ToxA and ToxB in c. difficile.\",\n \"FIG.\",\n \"15A shows data from a qPCR and HRM analysis experiment wherein each probe was used by itself or in combination with the other probe.\",\n \"The data demonstrate that while the ToxA+ToxB curve had a similar melting temperature to the ToxA probe by itself, it is easily distinguished by the peak height (FIG.\",\n \"15B) and the peak width (FIG.\",\n \"15C).\",\n \"While the present invention has been illustrated by the description of specific embodiments thereof, and while the embodiments have been described in considerable detail, it is not intended to restrict or in any way limit the scope of the appended claims to such detail.\",\n \"The various features discussed herein may be used alone or in any combination.\",\n \"Additional advantages and modifications will readily appear to those skilled in the art.\",\n \"The invention in its broader aspects is therefore not limited to the specific details, representative apparatus and methods and illustrative examples shown and described.\",\n \"Accordingly, departures may be made from such details without departing from the scope or spirit of the general inventive concept.\"\n ]\n]"},"source":{"kind":"string","value":"Patent_15871420"}}},{"rowIdx":4493789,"cells":{"text":{"kind":"list like","value":[["Growing III-V Compound Semiconductors from Trenches Filled with Intermediate Layers","A method of forming an integrated circuit structure includes forming an insulation layer over at least a portion of a substrate; forming a plurality of semiconductor pillars over a top surface of the insulation layer.","The plurality of semiconductor pillars is horizontally spaced apart by portions of the insulation layer.","The plurality of semiconductor pillars is allocated in a periodic pattern.","The method further includes epitaxially growing a III-V compound semiconductor film from top surfaces and sidewalls of the semiconductor pillars."],["1.A device comprising: a semiconductor substrate formed of a first semiconductor material; an isolation region over the semiconductor substrate; a first semiconductor region comprising: a first portion extending into the semiconductor substrate, wherein the first portion has a V-shaped bottom surface; a second portion in the isolation region; and a first III-V compound semiconductor region having a portion over the isolation region, wherein the first III-V compound semiconductor region contacts the first semiconductor region.","2.The device of claim 1, wherein the second portion of the first semiconductor region comprises: a lower portion formed of a first III-V compound semiconductor; and an upper portion over the lower portion, wherein the upper portion is formed of a second III-V compound semiconductor different from the first III-V compound semiconductor.","3.The device of claim 1, wherein a top end of the V-shaped bottom surface joins a top surface of the semiconductor substrate.","4.The device of claim 1, wherein the V-shaped bottom surface is lower than a top surface of the semiconductor substrate.","5.The device of claim 1, wherein the first III-V compound semiconductor region has a top surface higher than a top surface of the first semiconductor region, and the device further comprises: a patterned dielectric mask over the first III-V compound semiconductor region; and a second III-V compound semiconductor region having a portion over the patterned dielectric mask, wherein the second III-V compound semiconductor region penetrates through the patterned dielectric mask to contact the first III-V compound semiconductor region.","6.The device of claim 5, wherein the first III-V compound semiconductor region has a planar top surface, and the patterned dielectric mask contacts the planar top surface of the first III-V compound semiconductor region.","7.The device of claim 1, wherein the first semiconductor region further comprises a third portion protruding above the isolation region.","8.The device of claim 1, wherein the first semiconductor region has a V-shaped top surface.","9.The device of claim 8, wherein the V-shaped top surface has an inverted V-shape in a cross-sectional-view, and is higher than a top surface of the isolation region.","10.The device of claim 8, wherein the V-shaped top surface is lower than a top surface of the isolation region.","11.A device comprising: a substrate formed of a semiconductor material comprising a group-IV element; a first III-V compound semiconductor region, wherein a bottom portion of the first III-V compound semiconductor region extends into the substrate; an isolation region contacting a sidewall of an upper portion of the first III-V compound semiconductor region; and a second III-V compound semiconductor region over and contacting the first III-V compound semiconductor region to form a first V-shaped interface, wherein the second III-V compound semiconductor region further contacts the isolation region.","12.The device of claim 11, wherein the first III-V compound semiconductor region and the second III-V compound semiconductor region are formed of different III-V compound semiconductor materials.","13.The device of claim 11, wherein the substrate comprises a silicon substrate.","14.The device of claim 11, wherein the bottom portion of the first III-V compound semiconductor region forms a second V-shaped interface with the substrate.","15.The device of claim 14, wherein the first V-shaped interface has an inverted V-shape in a cross-sectional view, and has a top tip higher than the isolation region.","16.The device of claim 14, wherein the first V-shaped interface has a bottom tip lower than a top surface of the isolation region.","17.A device comprising: a semiconductor substrate; a dielectric isolation region overlying the semiconductor substrate; a first III-V compound semiconductor region having a bottom portion extending into the semiconductor substrate, and an upper portion in the dielectric isolation region; and a second III-V compound semiconductor region over the first III-V compound semiconductor region, wherein a bottom portion of the second III-V compound semiconductor region extends into the dielectric isolation region to contact the first III-V compound semiconductor region.","18.The device of claim 17, wherein the first III-V compound semiconductor region and the second III-V compound semiconductor region comprise different III-V compound semiconductor materials.","19.The device of claim 17, wherein the first III-V compound semiconductor region and the second III-V compound semiconductor region form a V-shaped interface in a cross-sectional view of the device.","20.The device of claim 17, wherein the first III-V compound semiconductor region and the semiconductor substrate form an additional V-shaped interface."],[" BACKGROUND Group-III group-V compound semiconductors (often referred to as III-V compound semiconductors) such as gallium nitride (GaN) and their related alloys have been under intense research in recent years due to their promising applications in electronic and optoelectronic devices.","Particular examples of potential optoelectronic devices employing III-V compound semiconductors include blue light emitting diodes and laser diodes, and ultra-violet (UV) photo-detectors.","The large bandgap and high electron saturation velocity of many III-V compound semiconductors also make them excellent candidates for applications in high temperature and high-speed power electronics.","Epitaxially grown GaN films are widely used for in the fabrication of light-emitting diodes.","Unfortunately, epitaxial GaN films must be grown on substrates other than GaN because it is extremely difficult to obtain GaN bulk crystals due to the high equilibrium pressure of nitrogen at the temperatures typically used to grow bulk crystals.","Owing to the lack of feasible bulk growth methods for GaN substrates, GaN is commonly deposited epitaxially on dissimilar substrates such as silicon, SiC and sapphire (Al 2 O 3 ).","However, the growth of GaN films on dissimilar substrates is difficult because these substrates have lattice constants and thermal expansion coefficients different than that of GaN.","If the difficulties in the growth of GaN films on silicon substrates could be overcome, silicon substrates would be attractive for GaN growth given their low cost, large diameter, high crystal and surface quality, controllable electrical conductivity, and high thermal conductivity.","The use of silicon substrates would also provide easy integration of GaN based optoelectronic devices with silicon-based electronic devices.","Additionally, due to the lacking of appropriate substrates for growing GaN films thereon, the sizes of the GaN films are limited.","The high stresses created by growing a GaN film on a dissimilar substrate may cause the substrate to bow.","This may cause several adverse effects.","Firstly, a great number of defects (dislocations) will be generated in the supposedly crystalline GaN films.","Secondly, the thicknesses of the resulting GaN film will be less uniform, causing wavelength shifts of the light emitted by the optical devices formed on the GaN films.","Thirdly, cracks may be generated in large stressed GaN films."],[" SUMMARY In accordance with one aspect of the embodiment, a method of forming an integrated circuit structure includes forming an insulation layer over at least a portion of a substrate; forming a plurality of semiconductor pillars over a top surface of the insulation layer.","The plurality of semiconductor pillars is horizontally spaced apart by portions of the insulation layer.","The plurality of semiconductor pillars is allocated in a periodic pattern.","The method further includes epitaxially growing a III-V compound semiconductor film from top surfaces and sidewalls of the semiconductor pillars.","Other embodiments are also disclosed."],["CROSS-REFERENCE TO RELATED APPLICATIONS This application is a continuation of U.S. patent application Ser.","No.","14/926,976, entitled “Growing III-V Compound Semiconductors from Trenches Filled with Intermediate Layers,” filed Oct. 29, 2015, which is a divisional of U.S. patent application Ser.","No.","14/260,713, entitled “Growing III-V Compound Semiconductors from Trenches Filled with Intermediate Layers,” filed Apr.","24, 2014, now U.S. Pat.","No.","9,209,023 issued Dec. 8, 2015, which application is a divisional of U.S. patent application Ser.","No.","12/842,221, entitled “Growing III-V Compound Semiconductors from Trenches Filled with Intermediate Layers,” filed on Jul.","23, 2010, now U.S. Pat.","No.","8,759,203 issued Jun.","24, 2014, which application claims the benefit of U.S.","Provisional Application No.","61/262,042 filed on Nov. 17, 2009, entitled “Growing III-V Compound Semiconductors from Trenches Filled with Intermediate Layers,” which applications are hereby incorporated herein by reference.","TECHNICAL FIELD This disclosure relates generally to integrated circuit manufacturing processes, and more particularly to forming group-III group-V (III-V) compound semiconductor films.","BACKGROUND Group-III group-V compound semiconductors (often referred to as III-V compound semiconductors) such as gallium nitride (GaN) and their related alloys have been under intense research in recent years due to their promising applications in electronic and optoelectronic devices.","Particular examples of potential optoelectronic devices employing III-V compound semiconductors include blue light emitting diodes and laser diodes, and ultra-violet (UV) photo-detectors.","The large bandgap and high electron saturation velocity of many III-V compound semiconductors also make them excellent candidates for applications in high temperature and high-speed power electronics.","Epitaxially grown GaN films are widely used for in the fabrication of light-emitting diodes.","Unfortunately, epitaxial GaN films must be grown on substrates other than GaN because it is extremely difficult to obtain GaN bulk crystals due to the high equilibrium pressure of nitrogen at the temperatures typically used to grow bulk crystals.","Owing to the lack of feasible bulk growth methods for GaN substrates, GaN is commonly deposited epitaxially on dissimilar substrates such as silicon, SiC and sapphire (Al2O3).","However, the growth of GaN films on dissimilar substrates is difficult because these substrates have lattice constants and thermal expansion coefficients different than that of GaN.","If the difficulties in the growth of GaN films on silicon substrates could be overcome, silicon substrates would be attractive for GaN growth given their low cost, large diameter, high crystal and surface quality, controllable electrical conductivity, and high thermal conductivity.","The use of silicon substrates would also provide easy integration of GaN based optoelectronic devices with silicon-based electronic devices.","Additionally, due to the lacking of appropriate substrates for growing GaN films thereon, the sizes of the GaN films are limited.","The high stresses created by growing a GaN film on a dissimilar substrate may cause the substrate to bow.","This may cause several adverse effects.","Firstly, a great number of defects (dislocations) will be generated in the supposedly crystalline GaN films.","Secondly, the thicknesses of the resulting GaN film will be less uniform, causing wavelength shifts of the light emitted by the optical devices formed on the GaN films.","Thirdly, cracks may be generated in large stressed GaN films.","SUMMARY In accordance with one aspect of the embodiment, a method of forming an integrated circuit structure includes forming an insulation layer over at least a portion of a substrate; forming a plurality of semiconductor pillars over a top surface of the insulation layer.","The plurality of semiconductor pillars is horizontally spaced apart by portions of the insulation layer.","The plurality of semiconductor pillars is allocated in a periodic pattern.","The method further includes epitaxially growing a III-V compound semiconductor film from top surfaces and sidewalls of the semiconductor pillars.","Other embodiments are also disclosed.","BRIEF DESCRIPTION OF THE DRAWINGS For a more complete understanding of the embodiments, and the advantages thereof, reference is now made to the following descriptions taken in conjunction with the accompanying drawings, in which: FIGS.","1A through 8 illustrate cross-sectional views, a perspective view, and a top view of intermediate stages in the manufacturing of a III-V semiconductor film in accordance with an embodiment; and FIG.","9 through 18 are cross-sectional views and a perspective view of intermediate stages in the manufacturing of III-V semiconductor films in accordance with alternative embodiments.","DETAILED DESCRIPTION OF ILLUSTRATIVE EMBODIMENTS The making and using of the embodiments of the disclosure are discussed in detail below.","It should be appreciated, however, that the embodiments provide many applicable inventive concepts that can be embodied in a wide variety of specific contexts.","The specific embodiments discussed are merely illustrative of specific ways to make and use the embodiments, and do not limit the scope of the disclosure.","A novel method for forming group-III group-V (referred to as III-V hereinafter) compound semiconductor films is provided.","Throughout the description, the term “III-V compound semiconductor” refers to compound semiconductor materials comprising at least one group-III element and one group-V element.","The term “III-N compound semiconductor” refers to a III-V compound semiconductor comprising nitrogen.","The required stages of manufacturing an illustrative embodiment are illustrated.","Those skilled in the art will recognize that other manufacturing steps may need to take place before or after the described stages in order to produce a complete device.","Throughout the various views and illustrative embodiments of the disclosure, like reference numbers are used to designate like elements.","Referring to FIG.","1A, substrate 20 is provided.","In an embodiment, substrate 20 is a bulk substrate comprising, for example, semiconductor material(s) such as silicon.","Substrate 20 may be formed of other commonly used materials such as sapphire, SiGe, SiC, Ge, or the like.","Insulation regions 22 (which may be considered as portions of an insulation layer) are formed in substrate 20.In an embodiment, the insulation regions may include shallow trench isolation (STI) region(s) 22, and hence are referred to as STI regions 22 throughout the description.","The formation process of STI regions 22 may include recessing portions of substrate 20, and filling the resulting recesses with a dielectric material, followed by a chemical mechanical polish (CMP) to remove excess dielectric material.","The remaining portions of the dielectric material form STI regions 22.In the resulting structure, substrate 20 may include portion 20_1 that is below the bottom surfaces of STI regions 22, and portions 20_2 that are between, and separated from each other by, STI regions 22.It is noted that although STI regions 22 were originally formed in substrate 20, substrate portion 20_1 may also be treated as a substrate, while STI regions 22 may be treated as being over substrate 20_1.FIG.","1B illustrates a top view of the structure shown in FIG.","1A, wherein the cross-sectional view in FIG.","1A is obtained from the plane crossing line 1A-1A in FIG.","1B.","From the top view, it is observed that substrate portions 20_2 are arranged in a periodic pattern.","In an exemplary embodiment as shown in FIG.","1B, substrate portions 20_2 are arranged as an array, in other embodiments, substrate portions 20_2 may be arranged in other patterns such as a hexagon pattern.","Distance D between neighboring substrate portions 20_2 may be less than about 5 μm, and may also be between about 20 nm and about 5 μm.","The length and/or width L of substrate portions 20_2 (which will also be the length and/or width of the resulting semiconductor re-growth regions 28 and (semiconductor) pillars 30, as shown in FIG.","5A) may be smaller than about 5 μm.","One skilled in the art will realize, however, that the dimensions recited throughout the description are merely examples, and will change if different formation technologies are used.","From the top view, substrate portions 20_2 may have the shape of square, rectangle, circle, hexagon, octagon, or the like.","Referring to FIG.","2, substrate portions 20_2 are removed partially or fully, forming recesses 26.In an embodiment as shown in FIG.","2, V-grooves may be formed at the bottom of recesses 26, so that the exposed surface of silicon substrate 20 in recesses 26 have (111) surface orientations.","In alternative embodiments, as shown with dotted lines, the bottom surfaces of recesses 26 may be substantially flat.","Next, as shown in FIG.","3, semiconductor re-growth regions 28 are epitaxially grown in recesses 26.Semiconductor re-growth regions 28 may be formed of a material having a lattice constant between the lattice constant of substrate 20 and the lattice constant of the overlying III-V semiconductor film 32 (not shown in FIG.","3, please refer to FIG.","6).","In an embodiment, semiconductor re-growth regions 28 comprise buffer regions 28_1 and top regions 28_2.Buffer regions 28_1 may be formed of AlN, low temperature GaAs, or a low temperature GaAs and a high temperature GaAs on the low temperature GaAs.","The low temperature GaAs may be epitaxially grown at a temperature lower than about 400° C., while the high temperature GaAs may be epitaxially grown at a temperature higher than about 600° C. Alternatively, buffer regions 28_1 may be formed of a low temperature GaN or AlN, which may be epitaxially grown at a temperature lower than about 850° C. Top regions 28_2 may be formed of GaN, which may be epitaxially grown at a temperature higher than about 1100° C. By growing semiconductor re-growth regions 28 in recesses 26, the threading dislocations may be blocked by the sidewalls of STI regions 22, so that fewer defects will occur in subsequently formed III-V semiconductor film 32 (FIG.","6).","Next, a CMP is performed to remove excess semiconductor re-growth regions 28.The resulting structure is shown in FIG.","4.FIG.","5A illustrates the recessing of STI regions 22.As a result, the portions of re-growth regions 28 over the top surfaces of remaining portions of STI regions 22 form pillars 30.The height H of pillars 30 may be greater than about 50 nm, or even greater than about 100 nm.","FIG.","5B illustrates a perspective view of the structure shown in FIG.","5A.","Referring to FIG.","6, III-V compound semiconductor film 32 is epitaxially grown.","In an embodiment, III-V compound semiconductor film 32 comprises GaAs, although it may also be formed of other III-V compound semiconductor materials such as GaN, InN, AlN, InP, or the like.","With III-V compound semiconductor film 32 grown from the top surface and sidewalls of pillars 30, the defect density in III-V compound semiconductor film 32 may be reduced.","A planarization (for example, a CMP) may then be performed to flatten the top surface of III-V compound semiconductor film 32.Optionally, as shown in FIG.","7, mask layer 34 is formed on III-V compound semiconductor film 32.Mask layer 34 may include a material selected from dielectric materials such as silicon nitride or silicon oxide.","Mask layer 34 may also include multi-layers of the above-discussed materials.","The applicable deposition methods for forming mask layer 34 include physical vapor deposition (PVD) and chemical vapor deposition (CVD).","Mask layer 34 is patterned so that the top surface of III-V compound semiconductor film 32 is selectively exposed through the gaps between remaining portions of mask layer 34.The patterning may be performed using a dry etch and/or a wet etch.","The remaining portions of mask layer 34 may have any pattern with controlled width and spacing, and may form parallel strips.","In other embodiments, the remaining portions of mask layer 34 may be arranged as an array or other periodic patterns, with each remaining portion having a square, a strip, or a polygon shape (in a top view).","In yet other embodiments, the remaining portions of mask layer 34 may form an interconnected grid structure, with windows therein for exposing the underlying III-V compound semiconductor film 32.The thickness T of mask layer 34 may be about 2 nm to about 6 μm.","Next, as shown in FIG.","8, an additional III-V semiconductor film 36 is grown on the exposed surface of III-V compound semiconductor film 32, for example, using epitaxial layer overgrowth (ELOG).","With the formation of mask layer 34 and the ELOG step, the defect density in III-V semiconductor film 36 is lower than in III-V compound semiconductor film 32.In an embodiment, III-V semiconductor film 36 may be formed of a same material as that of III-V compound semiconductor film 32, for example, GaN.","Alternatively, III-V semiconductor films 32 and 36 may be formed of different materials, for example, III-V compound semiconductor film 32 may be formed of GaAs, while III-V semiconductor films 36 may be formed of GaN.","In subsequent process steps, III-V semiconductor film 36 may be planarized.","Further, the underlying substrate 20 and STI regions 22 may be removed, for example, using CMP.","The resulting structure is thus a bulk III-V substrate (for example, a GaN substrate) with a low defect density.","FIGS.","9 through 11 illustrate an alternative embodiment.","Unless specified otherwise, like reference numerals in this embodiment (and subsequently discussed embodiments) represent like components in the embodiment shown in FIGS.","1A through 8.Accordingly, the process steps and applicable materials may not be repeated herein.","The initial steps of this embodiment are essentially the same as shown in FIGS.","1A through 2.Next, as shown in FIG.","9, semiconductor re-growth regions 28 are formed in the form of a single layer, with the top portions and the bottom portions formed of a same semiconductor material.","In an embodiment, semiconductor re-growth regions 28 are formed of epitaxial GaAs.","Referring to FIG.","10, STI regions 22 are recessed, so that pillars 30, which extend above the top surfaces of STI regions 22, are formed.","In subsequent steps, III-V compound semiconductor film 32 is formed, as shown in FIG.","11.Optionally, III-V semiconductor film 36 is formed.","The process steps and the materials of III-V semiconductor films 32 and 36 may be essentially the same as shown in FIGS.","7 and 8 and the respective discussion, and hence are not repeated herein.","FIGS.","12 through 14 illustrate yet another embodiment.","The initial steps of this embodiment are essentially the same as shown in FIGS.","1A through 2.Next, as shown in FIG.","12, semiconductor re-growth regions 28 are formed.","Semiconductor re-growth regions 28 may be composite regions comprising buffer regions 28_1 and top regions 28_2, as shown in FIG.","3, or regions formed of a single material, as shown in FIG.","9.In an embodiment, semiconductor re-growth regions 28 are formed of epitaxial GaAs, although other semiconductor materials such as GaN may be used.","Next, as shown in FIG.","13, an isotropic etch is performed to semiconductor re-growth regions 28, for example, using KOH, so that V-grooves 40 are formed.","The exposed surfaces of semiconductor re-growth regions 28 may have (111) surface planes.","In the embodiments in which re-growth regions 28 are formed of GaAs, the (111) surface planes may have a smaller lattice mismatch with the overlying III-V compound semiconductor film 32 (which may be formed of GaN, for example, see FIG.","14) than the flat top surfaces of semiconductor re-growth regions 28 as shown in FIG.","12.As a result, fewer defects may be generated in the subsequently formed III-V compound semiconductor film 32.Next, III-V compound semiconductor film 32 is formed, as shown in FIG.","14.Process steps as shown in FIGS.","7 and 8 may then be performed to form III-V semiconductor film 36.FIGS.","15A through 16 illustrate yet another embodiment.","The initial steps of this embodiment are essentially the same as shown in FIGS.","1A through 2.Next, as shown in FIG.","15A, semiconductor re-growth regions 28 are formed.","Semiconductor re-growth regions 28 may be composite regions comprising buffer regions 28_1 and top regions 28_2, as shown in FIG.","3, or a formed of a single layer, as shown in FIG.","9.In an embodiment, top regions 28_2 are formed of epitaxial GaN, although other materials such as GaAs may be used.","The partial pressures of process gases, temperature, and formation time may be adjusted, so that pyramids 42 are formed, wherein pyramids 42 may have bases substantially level with the top surfaces of STI regions 22.The exposed surfaces (slopes) of semiconductor re-growth regions 28 may have the (111) surface-planes.","FIG.","15B illustrates the perspective view of the structure shown in FIG.","15A.","Next, as shown in FIG.","16, III-V compound semiconductor film 32 is epitaxially grown.","III-V compound semiconductor film 32 and top regions 28_2 may be formed of a same material or different materials.","With III-V compound semiconductor film 32 grown starting from the slopes of pyramids 42, the threading dislocations in III-V compound semiconductor film 32 may bend toward, and end at, the top surfaces of STI regions 22.As a result, fewer defects will be generated in III-V compound semiconductor film 32.In the embodiment III-V compound semiconductor film 32 and top regions 28_2 are formed of a same material such as GaN, III-V compound semiconductor film 32 may be formed at a temperature higher than the temperature for forming top regions 28_2.FIGS.","17 and 18 illustrate yet another embodiment.","The initial steps of this embodiment are essentially the same as shown in FIGS.","1A and 1B.","Next, as shown in FIG.","17, STI regions 22 are recessed, so that the top portions 20_2 of substrate 20 form pillars 30.Next, III-V compound semiconductor film 32 is epitaxially grown, as shown in FIG.","18.The process steps as shown in FIGS.","7 and 8 may then be optionally performed.","In the above-discussed embodiments, by starting the growth of III-V compound semiconductor film 32 from periodic patterned semiconductor re-growth regions 28, the defect numbers in the resulting III-V compound semiconductor film 32 may be reduced.","Further, with the top surface of re-growth regions 28 being V-grooves 40 or pyramids 42, the defect numbers may be further reduced.","Although the embodiments and their advantages have been described in detail, it should be understood that various changes, substitutions and alterations can be made herein without departing from the spirit and scope of the embodiments as defined by the appended claims.","Moreover, the scope of the present application is not intended to be limited to the particular embodiments of the process, machine, manufacture, and composition of matter, means, methods and steps described in the specification.","As one of ordinary skill in the art will readily appreciate from the disclosure, processes, machines, manufacture, compositions of matter, means, methods, or steps, presently existing or later to be developed, that perform substantially the same function or achieve substantially the same result as the corresponding embodiments described herein may be utilized according to the disclosure.","Accordingly, the appended claims are intended to include within their scope such processes, machines, manufacture, compositions of matter, means, methods, or steps.","In addition, each claim constitutes a separate embodiment, and the combination of various claims and embodiments are within the scope of the disclosure."]],"string":"[\n [\n \"Growing III-V Compound Semiconductors from Trenches Filled with Intermediate Layers\",\n \"A method of forming an integrated circuit structure includes forming an insulation layer over at least a portion of a substrate; forming a plurality of semiconductor pillars over a top surface of the insulation layer.\",\n \"The plurality of semiconductor pillars is horizontally spaced apart by portions of the insulation layer.\",\n \"The plurality of semiconductor pillars is allocated in a periodic pattern.\",\n \"The method further includes epitaxially growing a III-V compound semiconductor film from top surfaces and sidewalls of the semiconductor pillars.\"\n ],\n [\n \"1.A device comprising: a semiconductor substrate formed of a first semiconductor material; an isolation region over the semiconductor substrate; a first semiconductor region comprising: a first portion extending into the semiconductor substrate, wherein the first portion has a V-shaped bottom surface; a second portion in the isolation region; and a first III-V compound semiconductor region having a portion over the isolation region, wherein the first III-V compound semiconductor region contacts the first semiconductor region.\",\n \"2.The device of claim 1, wherein the second portion of the first semiconductor region comprises: a lower portion formed of a first III-V compound semiconductor; and an upper portion over the lower portion, wherein the upper portion is formed of a second III-V compound semiconductor different from the first III-V compound semiconductor.\",\n \"3.The device of claim 1, wherein a top end of the V-shaped bottom surface joins a top surface of the semiconductor substrate.\",\n \"4.The device of claim 1, wherein the V-shaped bottom surface is lower than a top surface of the semiconductor substrate.\",\n \"5.The device of claim 1, wherein the first III-V compound semiconductor region has a top surface higher than a top surface of the first semiconductor region, and the device further comprises: a patterned dielectric mask over the first III-V compound semiconductor region; and a second III-V compound semiconductor region having a portion over the patterned dielectric mask, wherein the second III-V compound semiconductor region penetrates through the patterned dielectric mask to contact the first III-V compound semiconductor region.\",\n \"6.The device of claim 5, wherein the first III-V compound semiconductor region has a planar top surface, and the patterned dielectric mask contacts the planar top surface of the first III-V compound semiconductor region.\",\n \"7.The device of claim 1, wherein the first semiconductor region further comprises a third portion protruding above the isolation region.\",\n \"8.The device of claim 1, wherein the first semiconductor region has a V-shaped top surface.\",\n \"9.The device of claim 8, wherein the V-shaped top surface has an inverted V-shape in a cross-sectional-view, and is higher than a top surface of the isolation region.\",\n \"10.The device of claim 8, wherein the V-shaped top surface is lower than a top surface of the isolation region.\",\n \"11.A device comprising: a substrate formed of a semiconductor material comprising a group-IV element; a first III-V compound semiconductor region, wherein a bottom portion of the first III-V compound semiconductor region extends into the substrate; an isolation region contacting a sidewall of an upper portion of the first III-V compound semiconductor region; and a second III-V compound semiconductor region over and contacting the first III-V compound semiconductor region to form a first V-shaped interface, wherein the second III-V compound semiconductor region further contacts the isolation region.\",\n \"12.The device of claim 11, wherein the first III-V compound semiconductor region and the second III-V compound semiconductor region are formed of different III-V compound semiconductor materials.\",\n \"13.The device of claim 11, wherein the substrate comprises a silicon substrate.\",\n \"14.The device of claim 11, wherein the bottom portion of the first III-V compound semiconductor region forms a second V-shaped interface with the substrate.\",\n \"15.The device of claim 14, wherein the first V-shaped interface has an inverted V-shape in a cross-sectional view, and has a top tip higher than the isolation region.\",\n \"16.The device of claim 14, wherein the first V-shaped interface has a bottom tip lower than a top surface of the isolation region.\",\n \"17.A device comprising: a semiconductor substrate; a dielectric isolation region overlying the semiconductor substrate; a first III-V compound semiconductor region having a bottom portion extending into the semiconductor substrate, and an upper portion in the dielectric isolation region; and a second III-V compound semiconductor region over the first III-V compound semiconductor region, wherein a bottom portion of the second III-V compound semiconductor region extends into the dielectric isolation region to contact the first III-V compound semiconductor region.\",\n \"18.The device of claim 17, wherein the first III-V compound semiconductor region and the second III-V compound semiconductor region comprise different III-V compound semiconductor materials.\",\n \"19.The device of claim 17, wherein the first III-V compound semiconductor region and the second III-V compound semiconductor region form a V-shaped interface in a cross-sectional view of the device.\",\n \"20.The device of claim 17, wherein the first III-V compound semiconductor region and the semiconductor substrate form an additional V-shaped interface.\"\n ],\n [\n \" BACKGROUND Group-III group-V compound semiconductors (often referred to as III-V compound semiconductors) such as gallium nitride (GaN) and their related alloys have been under intense research in recent years due to their promising applications in electronic and optoelectronic devices.\",\n \"Particular examples of potential optoelectronic devices employing III-V compound semiconductors include blue light emitting diodes and laser diodes, and ultra-violet (UV) photo-detectors.\",\n \"The large bandgap and high electron saturation velocity of many III-V compound semiconductors also make them excellent candidates for applications in high temperature and high-speed power electronics.\",\n \"Epitaxially grown GaN films are widely used for in the fabrication of light-emitting diodes.\",\n \"Unfortunately, epitaxial GaN films must be grown on substrates other than GaN because it is extremely difficult to obtain GaN bulk crystals due to the high equilibrium pressure of nitrogen at the temperatures typically used to grow bulk crystals.\",\n \"Owing to the lack of feasible bulk growth methods for GaN substrates, GaN is commonly deposited epitaxially on dissimilar substrates such as silicon, SiC and sapphire (Al 2 O 3 ).\",\n \"However, the growth of GaN films on dissimilar substrates is difficult because these substrates have lattice constants and thermal expansion coefficients different than that of GaN.\",\n \"If the difficulties in the growth of GaN films on silicon substrates could be overcome, silicon substrates would be attractive for GaN growth given their low cost, large diameter, high crystal and surface quality, controllable electrical conductivity, and high thermal conductivity.\",\n \"The use of silicon substrates would also provide easy integration of GaN based optoelectronic devices with silicon-based electronic devices.\",\n \"Additionally, due to the lacking of appropriate substrates for growing GaN films thereon, the sizes of the GaN films are limited.\",\n \"The high stresses created by growing a GaN film on a dissimilar substrate may cause the substrate to bow.\",\n \"This may cause several adverse effects.\",\n \"Firstly, a great number of defects (dislocations) will be generated in the supposedly crystalline GaN films.\",\n \"Secondly, the thicknesses of the resulting GaN film will be less uniform, causing wavelength shifts of the light emitted by the optical devices formed on the GaN films.\",\n \"Thirdly, cracks may be generated in large stressed GaN films.\"\n ],\n [\n \" SUMMARY In accordance with one aspect of the embodiment, a method of forming an integrated circuit structure includes forming an insulation layer over at least a portion of a substrate; forming a plurality of semiconductor pillars over a top surface of the insulation layer.\",\n \"The plurality of semiconductor pillars is horizontally spaced apart by portions of the insulation layer.\",\n \"The plurality of semiconductor pillars is allocated in a periodic pattern.\",\n \"The method further includes epitaxially growing a III-V compound semiconductor film from top surfaces and sidewalls of the semiconductor pillars.\",\n \"Other embodiments are also disclosed.\"\n ],\n [\n \"CROSS-REFERENCE TO RELATED APPLICATIONS This application is a continuation of U.S. patent application Ser.\",\n \"No.\",\n \"14/926,976, entitled “Growing III-V Compound Semiconductors from Trenches Filled with Intermediate Layers,” filed Oct. 29, 2015, which is a divisional of U.S. patent application Ser.\",\n \"No.\",\n \"14/260,713, entitled “Growing III-V Compound Semiconductors from Trenches Filled with Intermediate Layers,” filed Apr.\",\n \"24, 2014, now U.S. Pat.\",\n \"No.\",\n \"9,209,023 issued Dec. 8, 2015, which application is a divisional of U.S. patent application Ser.\",\n \"No.\",\n \"12/842,221, entitled “Growing III-V Compound Semiconductors from Trenches Filled with Intermediate Layers,” filed on Jul.\",\n \"23, 2010, now U.S. Pat.\",\n \"No.\",\n \"8,759,203 issued Jun.\",\n \"24, 2014, which application claims the benefit of U.S.\",\n \"Provisional Application No.\",\n \"61/262,042 filed on Nov. 17, 2009, entitled “Growing III-V Compound Semiconductors from Trenches Filled with Intermediate Layers,” which applications are hereby incorporated herein by reference.\",\n \"TECHNICAL FIELD This disclosure relates generally to integrated circuit manufacturing processes, and more particularly to forming group-III group-V (III-V) compound semiconductor films.\",\n \"BACKGROUND Group-III group-V compound semiconductors (often referred to as III-V compound semiconductors) such as gallium nitride (GaN) and their related alloys have been under intense research in recent years due to their promising applications in electronic and optoelectronic devices.\",\n \"Particular examples of potential optoelectronic devices employing III-V compound semiconductors include blue light emitting diodes and laser diodes, and ultra-violet (UV) photo-detectors.\",\n \"The large bandgap and high electron saturation velocity of many III-V compound semiconductors also make them excellent candidates for applications in high temperature and high-speed power electronics.\",\n \"Epitaxially grown GaN films are widely used for in the fabrication of light-emitting diodes.\",\n \"Unfortunately, epitaxial GaN films must be grown on substrates other than GaN because it is extremely difficult to obtain GaN bulk crystals due to the high equilibrium pressure of nitrogen at the temperatures typically used to grow bulk crystals.\",\n \"Owing to the lack of feasible bulk growth methods for GaN substrates, GaN is commonly deposited epitaxially on dissimilar substrates such as silicon, SiC and sapphire (Al2O3).\",\n \"However, the growth of GaN films on dissimilar substrates is difficult because these substrates have lattice constants and thermal expansion coefficients different than that of GaN.\",\n \"If the difficulties in the growth of GaN films on silicon substrates could be overcome, silicon substrates would be attractive for GaN growth given their low cost, large diameter, high crystal and surface quality, controllable electrical conductivity, and high thermal conductivity.\",\n \"The use of silicon substrates would also provide easy integration of GaN based optoelectronic devices with silicon-based electronic devices.\",\n \"Additionally, due to the lacking of appropriate substrates for growing GaN films thereon, the sizes of the GaN films are limited.\",\n \"The high stresses created by growing a GaN film on a dissimilar substrate may cause the substrate to bow.\",\n \"This may cause several adverse effects.\",\n \"Firstly, a great number of defects (dislocations) will be generated in the supposedly crystalline GaN films.\",\n \"Secondly, the thicknesses of the resulting GaN film will be less uniform, causing wavelength shifts of the light emitted by the optical devices formed on the GaN films.\",\n \"Thirdly, cracks may be generated in large stressed GaN films.\",\n \"SUMMARY In accordance with one aspect of the embodiment, a method of forming an integrated circuit structure includes forming an insulation layer over at least a portion of a substrate; forming a plurality of semiconductor pillars over a top surface of the insulation layer.\",\n \"The plurality of semiconductor pillars is horizontally spaced apart by portions of the insulation layer.\",\n \"The plurality of semiconductor pillars is allocated in a periodic pattern.\",\n \"The method further includes epitaxially growing a III-V compound semiconductor film from top surfaces and sidewalls of the semiconductor pillars.\",\n \"Other embodiments are also disclosed.\",\n \"BRIEF DESCRIPTION OF THE DRAWINGS For a more complete understanding of the embodiments, and the advantages thereof, reference is now made to the following descriptions taken in conjunction with the accompanying drawings, in which: FIGS.\",\n \"1A through 8 illustrate cross-sectional views, a perspective view, and a top view of intermediate stages in the manufacturing of a III-V semiconductor film in accordance with an embodiment; and FIG.\",\n \"9 through 18 are cross-sectional views and a perspective view of intermediate stages in the manufacturing of III-V semiconductor films in accordance with alternative embodiments.\",\n \"DETAILED DESCRIPTION OF ILLUSTRATIVE EMBODIMENTS The making and using of the embodiments of the disclosure are discussed in detail below.\",\n \"It should be appreciated, however, that the embodiments provide many applicable inventive concepts that can be embodied in a wide variety of specific contexts.\",\n \"The specific embodiments discussed are merely illustrative of specific ways to make and use the embodiments, and do not limit the scope of the disclosure.\",\n \"A novel method for forming group-III group-V (referred to as III-V hereinafter) compound semiconductor films is provided.\",\n \"Throughout the description, the term “III-V compound semiconductor” refers to compound semiconductor materials comprising at least one group-III element and one group-V element.\",\n \"The term “III-N compound semiconductor” refers to a III-V compound semiconductor comprising nitrogen.\",\n \"The required stages of manufacturing an illustrative embodiment are illustrated.\",\n \"Those skilled in the art will recognize that other manufacturing steps may need to take place before or after the described stages in order to produce a complete device.\",\n \"Throughout the various views and illustrative embodiments of the disclosure, like reference numbers are used to designate like elements.\",\n \"Referring to FIG.\",\n \"1A, substrate 20 is provided.\",\n \"In an embodiment, substrate 20 is a bulk substrate comprising, for example, semiconductor material(s) such as silicon.\",\n \"Substrate 20 may be formed of other commonly used materials such as sapphire, SiGe, SiC, Ge, or the like.\",\n \"Insulation regions 22 (which may be considered as portions of an insulation layer) are formed in substrate 20.In an embodiment, the insulation regions may include shallow trench isolation (STI) region(s) 22, and hence are referred to as STI regions 22 throughout the description.\",\n \"The formation process of STI regions 22 may include recessing portions of substrate 20, and filling the resulting recesses with a dielectric material, followed by a chemical mechanical polish (CMP) to remove excess dielectric material.\",\n \"The remaining portions of the dielectric material form STI regions 22.In the resulting structure, substrate 20 may include portion 20_1 that is below the bottom surfaces of STI regions 22, and portions 20_2 that are between, and separated from each other by, STI regions 22.It is noted that although STI regions 22 were originally formed in substrate 20, substrate portion 20_1 may also be treated as a substrate, while STI regions 22 may be treated as being over substrate 20_1.FIG.\",\n \"1B illustrates a top view of the structure shown in FIG.\",\n \"1A, wherein the cross-sectional view in FIG.\",\n \"1A is obtained from the plane crossing line 1A-1A in FIG.\",\n \"1B.\",\n \"From the top view, it is observed that substrate portions 20_2 are arranged in a periodic pattern.\",\n \"In an exemplary embodiment as shown in FIG.\",\n \"1B, substrate portions 20_2 are arranged as an array, in other embodiments, substrate portions 20_2 may be arranged in other patterns such as a hexagon pattern.\",\n \"Distance D between neighboring substrate portions 20_2 may be less than about 5 μm, and may also be between about 20 nm and about 5 μm.\",\n \"The length and/or width L of substrate portions 20_2 (which will also be the length and/or width of the resulting semiconductor re-growth regions 28 and (semiconductor) pillars 30, as shown in FIG.\",\n \"5A) may be smaller than about 5 μm.\",\n \"One skilled in the art will realize, however, that the dimensions recited throughout the description are merely examples, and will change if different formation technologies are used.\",\n \"From the top view, substrate portions 20_2 may have the shape of square, rectangle, circle, hexagon, octagon, or the like.\",\n \"Referring to FIG.\",\n \"2, substrate portions 20_2 are removed partially or fully, forming recesses 26.In an embodiment as shown in FIG.\",\n \"2, V-grooves may be formed at the bottom of recesses 26, so that the exposed surface of silicon substrate 20 in recesses 26 have (111) surface orientations.\",\n \"In alternative embodiments, as shown with dotted lines, the bottom surfaces of recesses 26 may be substantially flat.\",\n \"Next, as shown in FIG.\",\n \"3, semiconductor re-growth regions 28 are epitaxially grown in recesses 26.Semiconductor re-growth regions 28 may be formed of a material having a lattice constant between the lattice constant of substrate 20 and the lattice constant of the overlying III-V semiconductor film 32 (not shown in FIG.\",\n \"3, please refer to FIG.\",\n \"6).\",\n \"In an embodiment, semiconductor re-growth regions 28 comprise buffer regions 28_1 and top regions 28_2.Buffer regions 28_1 may be formed of AlN, low temperature GaAs, or a low temperature GaAs and a high temperature GaAs on the low temperature GaAs.\",\n \"The low temperature GaAs may be epitaxially grown at a temperature lower than about 400° C., while the high temperature GaAs may be epitaxially grown at a temperature higher than about 600° C. Alternatively, buffer regions 28_1 may be formed of a low temperature GaN or AlN, which may be epitaxially grown at a temperature lower than about 850° C. Top regions 28_2 may be formed of GaN, which may be epitaxially grown at a temperature higher than about 1100° C. By growing semiconductor re-growth regions 28 in recesses 26, the threading dislocations may be blocked by the sidewalls of STI regions 22, so that fewer defects will occur in subsequently formed III-V semiconductor film 32 (FIG.\",\n \"6).\",\n \"Next, a CMP is performed to remove excess semiconductor re-growth regions 28.The resulting structure is shown in FIG.\",\n \"4.FIG.\",\n \"5A illustrates the recessing of STI regions 22.As a result, the portions of re-growth regions 28 over the top surfaces of remaining portions of STI regions 22 form pillars 30.The height H of pillars 30 may be greater than about 50 nm, or even greater than about 100 nm.\",\n \"FIG.\",\n \"5B illustrates a perspective view of the structure shown in FIG.\",\n \"5A.\",\n \"Referring to FIG.\",\n \"6, III-V compound semiconductor film 32 is epitaxially grown.\",\n \"In an embodiment, III-V compound semiconductor film 32 comprises GaAs, although it may also be formed of other III-V compound semiconductor materials such as GaN, InN, AlN, InP, or the like.\",\n \"With III-V compound semiconductor film 32 grown from the top surface and sidewalls of pillars 30, the defect density in III-V compound semiconductor film 32 may be reduced.\",\n \"A planarization (for example, a CMP) may then be performed to flatten the top surface of III-V compound semiconductor film 32.Optionally, as shown in FIG.\",\n \"7, mask layer 34 is formed on III-V compound semiconductor film 32.Mask layer 34 may include a material selected from dielectric materials such as silicon nitride or silicon oxide.\",\n \"Mask layer 34 may also include multi-layers of the above-discussed materials.\",\n \"The applicable deposition methods for forming mask layer 34 include physical vapor deposition (PVD) and chemical vapor deposition (CVD).\",\n \"Mask layer 34 is patterned so that the top surface of III-V compound semiconductor film 32 is selectively exposed through the gaps between remaining portions of mask layer 34.The patterning may be performed using a dry etch and/or a wet etch.\",\n \"The remaining portions of mask layer 34 may have any pattern with controlled width and spacing, and may form parallel strips.\",\n \"In other embodiments, the remaining portions of mask layer 34 may be arranged as an array or other periodic patterns, with each remaining portion having a square, a strip, or a polygon shape (in a top view).\",\n \"In yet other embodiments, the remaining portions of mask layer 34 may form an interconnected grid structure, with windows therein for exposing the underlying III-V compound semiconductor film 32.The thickness T of mask layer 34 may be about 2 nm to about 6 μm.\",\n \"Next, as shown in FIG.\",\n \"8, an additional III-V semiconductor film 36 is grown on the exposed surface of III-V compound semiconductor film 32, for example, using epitaxial layer overgrowth (ELOG).\",\n \"With the formation of mask layer 34 and the ELOG step, the defect density in III-V semiconductor film 36 is lower than in III-V compound semiconductor film 32.In an embodiment, III-V semiconductor film 36 may be formed of a same material as that of III-V compound semiconductor film 32, for example, GaN.\",\n \"Alternatively, III-V semiconductor films 32 and 36 may be formed of different materials, for example, III-V compound semiconductor film 32 may be formed of GaAs, while III-V semiconductor films 36 may be formed of GaN.\",\n \"In subsequent process steps, III-V semiconductor film 36 may be planarized.\",\n \"Further, the underlying substrate 20 and STI regions 22 may be removed, for example, using CMP.\",\n \"The resulting structure is thus a bulk III-V substrate (for example, a GaN substrate) with a low defect density.\",\n \"FIGS.\",\n \"9 through 11 illustrate an alternative embodiment.\",\n \"Unless specified otherwise, like reference numerals in this embodiment (and subsequently discussed embodiments) represent like components in the embodiment shown in FIGS.\",\n \"1A through 8.Accordingly, the process steps and applicable materials may not be repeated herein.\",\n \"The initial steps of this embodiment are essentially the same as shown in FIGS.\",\n \"1A through 2.Next, as shown in FIG.\",\n \"9, semiconductor re-growth regions 28 are formed in the form of a single layer, with the top portions and the bottom portions formed of a same semiconductor material.\",\n \"In an embodiment, semiconductor re-growth regions 28 are formed of epitaxial GaAs.\",\n \"Referring to FIG.\",\n \"10, STI regions 22 are recessed, so that pillars 30, which extend above the top surfaces of STI regions 22, are formed.\",\n \"In subsequent steps, III-V compound semiconductor film 32 is formed, as shown in FIG.\",\n \"11.Optionally, III-V semiconductor film 36 is formed.\",\n \"The process steps and the materials of III-V semiconductor films 32 and 36 may be essentially the same as shown in FIGS.\",\n \"7 and 8 and the respective discussion, and hence are not repeated herein.\",\n \"FIGS.\",\n \"12 through 14 illustrate yet another embodiment.\",\n \"The initial steps of this embodiment are essentially the same as shown in FIGS.\",\n \"1A through 2.Next, as shown in FIG.\",\n \"12, semiconductor re-growth regions 28 are formed.\",\n \"Semiconductor re-growth regions 28 may be composite regions comprising buffer regions 28_1 and top regions 28_2, as shown in FIG.\",\n \"3, or regions formed of a single material, as shown in FIG.\",\n \"9.In an embodiment, semiconductor re-growth regions 28 are formed of epitaxial GaAs, although other semiconductor materials such as GaN may be used.\",\n \"Next, as shown in FIG.\",\n \"13, an isotropic etch is performed to semiconductor re-growth regions 28, for example, using KOH, so that V-grooves 40 are formed.\",\n \"The exposed surfaces of semiconductor re-growth regions 28 may have (111) surface planes.\",\n \"In the embodiments in which re-growth regions 28 are formed of GaAs, the (111) surface planes may have a smaller lattice mismatch with the overlying III-V compound semiconductor film 32 (which may be formed of GaN, for example, see FIG.\",\n \"14) than the flat top surfaces of semiconductor re-growth regions 28 as shown in FIG.\",\n \"12.As a result, fewer defects may be generated in the subsequently formed III-V compound semiconductor film 32.Next, III-V compound semiconductor film 32 is formed, as shown in FIG.\",\n \"14.Process steps as shown in FIGS.\",\n \"7 and 8 may then be performed to form III-V semiconductor film 36.FIGS.\",\n \"15A through 16 illustrate yet another embodiment.\",\n \"The initial steps of this embodiment are essentially the same as shown in FIGS.\",\n \"1A through 2.Next, as shown in FIG.\",\n \"15A, semiconductor re-growth regions 28 are formed.\",\n \"Semiconductor re-growth regions 28 may be composite regions comprising buffer regions 28_1 and top regions 28_2, as shown in FIG.\",\n \"3, or a formed of a single layer, as shown in FIG.\",\n \"9.In an embodiment, top regions 28_2 are formed of epitaxial GaN, although other materials such as GaAs may be used.\",\n \"The partial pressures of process gases, temperature, and formation time may be adjusted, so that pyramids 42 are formed, wherein pyramids 42 may have bases substantially level with the top surfaces of STI regions 22.The exposed surfaces (slopes) of semiconductor re-growth regions 28 may have the (111) surface-planes.\",\n \"FIG.\",\n \"15B illustrates the perspective view of the structure shown in FIG.\",\n \"15A.\",\n \"Next, as shown in FIG.\",\n \"16, III-V compound semiconductor film 32 is epitaxially grown.\",\n \"III-V compound semiconductor film 32 and top regions 28_2 may be formed of a same material or different materials.\",\n \"With III-V compound semiconductor film 32 grown starting from the slopes of pyramids 42, the threading dislocations in III-V compound semiconductor film 32 may bend toward, and end at, the top surfaces of STI regions 22.As a result, fewer defects will be generated in III-V compound semiconductor film 32.In the embodiment III-V compound semiconductor film 32 and top regions 28_2 are formed of a same material such as GaN, III-V compound semiconductor film 32 may be formed at a temperature higher than the temperature for forming top regions 28_2.FIGS.\",\n \"17 and 18 illustrate yet another embodiment.\",\n \"The initial steps of this embodiment are essentially the same as shown in FIGS.\",\n \"1A and 1B.\",\n \"Next, as shown in FIG.\",\n \"17, STI regions 22 are recessed, so that the top portions 20_2 of substrate 20 form pillars 30.Next, III-V compound semiconductor film 32 is epitaxially grown, as shown in FIG.\",\n \"18.The process steps as shown in FIGS.\",\n \"7 and 8 may then be optionally performed.\",\n \"In the above-discussed embodiments, by starting the growth of III-V compound semiconductor film 32 from periodic patterned semiconductor re-growth regions 28, the defect numbers in the resulting III-V compound semiconductor film 32 may be reduced.\",\n \"Further, with the top surface of re-growth regions 28 being V-grooves 40 or pyramids 42, the defect numbers may be further reduced.\",\n \"Although the embodiments and their advantages have been described in detail, it should be understood that various changes, substitutions and alterations can be made herein without departing from the spirit and scope of the embodiments as defined by the appended claims.\",\n \"Moreover, the scope of the present application is not intended to be limited to the particular embodiments of the process, machine, manufacture, and composition of matter, means, methods and steps described in the specification.\",\n \"As one of ordinary skill in the art will readily appreciate from the disclosure, processes, machines, manufacture, compositions of matter, means, methods, or steps, presently existing or later to be developed, that perform substantially the same function or achieve substantially the same result as the corresponding embodiments described herein may be utilized according to the disclosure.\",\n \"Accordingly, the appended claims are intended to include within their scope such processes, machines, manufacture, compositions of matter, means, methods, or steps.\",\n \"In addition, each claim constitutes a separate embodiment, and the combination of various claims and embodiments are within the scope of the disclosure.\"\n ]\n]"},"source":{"kind":"string","value":"Patent_15871423"}}},{"rowIdx":4493790,"cells":{"text":{"kind":"list like","value":[["AMPLITUDE LIMITING OSCILLATION CIRCUIT","An amplitude limiting oscillation circuit (100) is disclosed.","The amplitude limiting oscillation circuit (100) includes: an oscillation circuit (110), configured to generate an oscillation signal; a pulse width modulation circuit (120), configured to generate a pulse width modulation signal according to an amplitude of the oscillation signal; a low pass filtering circuit (130), configured to convert the pulse width modulation signal into a direct current control voltage signal, where the direct current control voltage signal is configured to control a voltage controlled resistance circuit (140); and the voltage controlled resistance circuit (140), configured to change a resistance value of the voltage controlled resistance circuit (140) according to under the direct current control voltage signal, to control the amplitude of the oscillation signal.","The amplitude limiting oscillation circuit (100), may improve performance of the amplitude limiting oscillation circuit (100)."],["1.An amplitude limiting oscillation circuit, comprising: an oscillation circuit (110), configured to generate an oscillation signal; a pulse width modulation circuit (120), configured to generate a pulse width modulation signal according to an amplitude of the oscillation signal; a low pass filtering circuit (130), configured to convert the pulse width modulation signal into a direct current control voltage signal; and a voltage controlled resistance circuit (140), configured to change a resistance value of the voltage controlled resistance circuit (140) under control of the direct current control voltage signal, to control the amplitude of the oscillation signal.","2.The amplitude limiting oscillation circuit according to claim 1, wherein the oscillation circuit (110) is an LC oscillation circuit, a crystal oscillation circuit or a relaxation oscillation circuit.","3.The amplitude limiting oscillation circuit according to claim 1, wherein the pulse width modulation circuit (120) comprises a comparator, configured to generate the pulse width modulation signal by comparing an amplitude of a reference signal with the amplitude of the oscillation signal.","4.The amplitude limiting oscillation circuit according to claim 1, wherein the low pass filtering circuit (130) is a passive filter or an active filter.","5.The amplitude limiting oscillation circuit according to claim 1, wherein resistance of the voltage controlled resistance circuit (140) is linear resistance or nonlinear resistance that operates in a linear region.","6.The amplitude limiting oscillation circuit according to claim 1, wherein the voltage controlled resistance circuit (140) comprises a metal oxide semiconductor field effect transistor.","7.The amplitude limiting oscillation circuit according to claim 1, wherein the oscillation circuit (110) comprises a positive output end and a negative output end.","8.The amplitude limiting oscillation circuit according to claim 7, wherein the oscillation circuit (110) comprises: an inductor (111), and a first capacitor (112), wherein the inductor (111) and the first capacitor (112) form a resonant circuit; and a first MOS transistor (113), a second MOS transistor (114), a third MOS transistor (115), and a fourth MOS transistor (116), wherein the first MOS transistor (113), the second MOS transistor (114), the third MOS transistor (115), and the fourth MOS transistor (116) provide negative resistance for the resonant circuit, a drain electrode of the first MOS transistor (113) and a gate electrode of the second MOS transistor (114) form a positive output end of the oscillation circuit (110), and a gate electrode of the third MOS transistor (115) and a drain electrode of the fourth MOS transistor (116) form a negative output end of the oscillation circuit (110).","9.The amplitude limiting oscillation circuit according to claim 7, wherein the pulse width modulation circuit (120) comprises: a first comparator (121), wherein a positive input end of the first comparator (121) is connected to the positive output end of the oscillation circuit (110), and a negative input end of the first comparator (121) is configured to input a first reference signal; and a second comparator (122), wherein a positive input end of the second comparator (122) is connected to the negative output end of the oscillation circuit (110), and a negative input end of the second comparator (122) is configured to input a second reference signal.","10.The amplitude limiting oscillation circuit according to claim 9, wherein the low pass filtering circuit (130) comprises: a first low pass filter, comprising a first resistor (131) and a second capacitor (132), wherein an input end of the first low pass filter is connected to an output end of the first comparator (121), and an output end of the first low pass filter is connected to a gate electrode of a fifth MOS transistor (141); and a second low pass filter, comprising a second resistor (133) and a third capacitor (134), wherein an input end of the second low pass filter is connected to an output end of the second comparator (122), and an output end of the second low pass filter is connected to a gate electrode of a sixth MOS transistor (142); and the voltage controlled resistance circuit (140) comprises: the fifth MOS transistor (141), wherein a source electrode of the fifth MOS transistor (141) is connected to a power supply, and a drain electrode of the fifth MOS transistor (141) is connected to a source electrode of the first MOS transistor (113) and a source electrode of the second MOS transistor (114); and the sixth MOS transistor (142), wherein a source electrode of the sixth MOS transistor (142) is connected to ground, and a drain electrode of the sixth MOS transistor (142) is connected to a source electrode of the third MOS transistor (115) and a source electrode of the fourth MOS transistor (116).","11.The amplitude limiting oscillation circuit according to claim 7, wherein the amplitude limiting oscillation circuit further comprises: a switching circuit (150), configured to switch a connection between the positive input end or the negative output end and the pulse width modulation circuit (120).","12.The amplitude limiting oscillation circuit according to claim 11, wherein the switching circuit (150) comprises: a third comparator (151), an inverter (152), a first switch (153), a second switch (154), a third switch (155) and a fourth switch (156); wherein a positive input end of the third comparator (151) is connected to the positive output end of the oscillation circuit (110), a negative input end of the third comparator (151) is connected to the negative output end of the oscillation circuit (110), an input end of the inverter (152) is connected to an output end of the third comparator (151), an output signal of the third comparator (151) is used to control the first switch (153) and the fourth switch (156), and an output signal of the inverter (152) is used to control the second switch (154) and the third switch (155).","13.The amplitude limiting oscillation circuit according to claim 12, wherein the pulse width modulation circuit (120) comprises: a first comparator (121), wherein a positive input end of the first comparator (121) is connected to the positive output end of the oscillation circuit (110) through the first switch (153), and connected to the negative output end of the oscillation circuit (110) through the second switch (154), and a negative input end of the first comparator (121) is configured to input a first reference signal; and a second comparator (122), wherein a positive input end of the second comparator (122) is connected to the positive output end of the oscillation circuit (110) through the third switch (155), and connected to the negative output end of the oscillation circuit (110) through the fourth switch (156), and a negative input end of the second comparator (122) is configured to input a second reference signal.","14.The amplitude limiting oscillation circuit according to claim 13, wherein the low pass filtering circuit (130) comprises: a first low pass filter, comprising a first resistor (131) and a second capacitor (132), wherein an input end of the first low pass filter is connected to an output end of the first comparator (121), and an output end of the first low pass filter is connected to a gate electrode of a fifth MOS transistor (141); and a second low pass filter, comprising a second resistor (133) and a third capacitor (134), wherein an input end of the second low pass filter is connected to an output end of the second comparator (122), and an output end of the second low pass filter is connected to a gate electrode of a sixth MOS transistor (142); and the voltage controlled resistance circuit (140) comprises: the fifth MOS transistor (141), wherein a source electrode of the fifth MOS transistor (141) is connected to a power supply, and a drain electrode of the fifth MOS transistor (141) is connected to a source electrode of the first MOS transistor (113) and a source electrode of the second MOS transistor (114); and the sixth MOS transistor (142), wherein a source electrode of the sixth MOS transistor (142) is connected to ground, and a drain electrode of the sixth MOS transistor (142) is connected to a source electrode of the third MOS transistor (115) and a source electrode of the fourth MOS transistor (116)."],[" BACKGROUND If no amplitude limitation is performed on a common LC oscillation circuit, an amplitude of the oscillation circuit would eventually stabilize to a power supply voltage, and such oscillation circuit has several disadvantages as follows: 1.distortion of an oscillation waveform of the oscillation circuit occurs, and a rising edge and a falling edge thereof are dissymmetrical, such that a 1/f 3 noise inflection point of the oscillation circuit moves to a high frequency, resulting in worse low frequency phase noise; and 2.a large oscillation amplitude causes a very large current through an inductor, such that a magnetic core of the inductor is saturated, resulting in a change of an inductance value, ultimately affecting stability of a frequency.","Usually, an approach of limiting amplitude is to detect an oscillation amplitude by using an amplitude detection circuit or a peak detection circuit, and then output a control voltage to control a bias current of an oscillation circuit, so as to achieve an effect of limiting the amplitude of the oscillation circuit.","However, the approach also has several disadvantages as follows: 1.a loop gain of such approach is larger, easily resulting in instability of a control loop; 2.the control loop per se may introduce greater noise, resulting in worse phase noise of the oscillation circuit; and 3.most of the amplitude detection circuits cannot accurately control the oscillation amplitude, thereby limiting its utility.","Therefore, it becomes a technical problem to be solved urgently to improve performance of an amplitude limiting oscillation circuit."],[" SUMMARY Embodiments of the present disclosure provide an amplitude limiting oscillation circuit, and performance of the amplitude limiting oscillation circuit may be improved.","According to a first aspect, an amplitude limiting oscillation circuit is provided, including: an oscillation circuit 110 , configured to generate an oscillation signal; a pulse width modulation circuit 120 , configured to generate a pulse width modulation signal according to an amplitude of the oscillation signal; a low pass filtering circuit 130 , configured to convert the pulse width modulation signal into a direct current control voltage signal, where the direct current control voltage signal is configured to control a voltage controlled resistance circuit 140 ; and the voltage controlled resistance circuit 140 , configured to change a resistance value of the voltage controlled resistance circuit 140 under control of the direct current control voltage signal, to control the amplitude of the oscillation signal.","According to the amplitude limiting oscillation circuit of the embodiments of the present disclosure, negative feedback is performed by using a voltage controlled resistance circuit, and a control loop may not introduce extra noise; therefore, phase noise of the amplitude limiting oscillation circuit is lower, and performance of the amplitude limiting oscillation circuit is improved.","In some possible implementation manners, the oscillation circuit 110 is an LC oscillation circuit, a crystal oscillation circuit or a relaxation oscillation circuit.","In some possible implementation manners, the pulse width modulation circuit 120 includes a comparator, configured to generate the pulse width modulation signal by comparing an amplitude of a reference signal with the amplitude of the oscillation signal.","When the comparator is used, the amplitude of the amplitude limiting oscillation circuit depends on a reference voltage of the comparator, that is, a final amplitude range of the amplitude limiting oscillation circuit is very close to the reference voltage of the comparator; therefore, it is easy to control the oscillation amplitude of the amplitude limiting oscillation circuit of the embodiments of the present disclosure.","In some possible implementation manners, the low pass filtering circuit 130 is a passive filter or an active filter.","In some possible implementation manners, resistance of the voltage controlled resistance circuit 140 is linear resistance or nonlinear resistance that operates in a linear region.","In some possible implementation manners, the voltage controlled resistance circuit 140 includes a metal oxide semiconductor field effect transistor MOS.","In some possible implementation manners, the oscillation circuit 110 includes a positive output end and a negative output end.","In some possible implementation manners, the oscillation circuit 110 includes: an inductor 111 , and a first capacitor 112 , where the inductor 111 and the first capacitor 112 form a resonant circuit; and a first MOS transistor 113 , a second MOS transistor 114 , a third MOS transistor 115 , and a fourth MOS transistor 116 , where the first MOS transistor 113 , the second MOS transistor 114 , the third MOS transistor 115 , and the fourth MOS transistor 116 provide negative resistance for the resonant circuit, a drain electrode of the first MOS transistor 113 and a gate electrode of the second MOS transistor 114 form a positive output end of the oscillation circuit 110 , and a gate electrode of the third MOS transistor 115 and a drain electrode of the fourth MOS transistor 116 form a negative output end of the oscillation circuit 110 .","In some possible implementation manners, the pulse width modulation circuit 120 includes: a first comparator 121 , where a positive input end of the first comparator 121 is connected to the positive output end of the oscillation circuit 110 , and a negative input end of the first comparator 121 is configured to input a first reference signal; and a second comparator 122 , where a positive input end of the second comparator 122 is connected to the negative output end of the oscillation circuit 110 , and a negative input end of the second comparator 122 is configured to input a second reference signal.","In some possible implementation manners, the amplitude limiting oscillation circuit further includes: a switching circuit 150 , configured to switch a connection between the positive input end or the negative output end and the pulse width modulation circuit 120 .","In some possible implementation manners, the switching circuit 150 includes: a third comparator 151 , an inverter 152 , a first switch 153 , a second switch 154 , a third switch 155 and a fourth switch 156 ; where a positive input end of the third comparator 151 is connected to the positive output end of the oscillation circuit 110 , a negative input end of the third comparator 151 is connected to the negative output end of the oscillation circuit 110 , an input end of the inverter 152 is connected to an output end of the third comparator 151 , an output signal of the third comparator 151 is used to control the first switch 153 and the fourth switch 156 , and an output signal of the inverter 152 is used to control the second switch 154 and the third switch 155 .","In some possible implementation manners, the pulse width modulation circuit 120 includes: a first comparator 121 , where a positive input end of the first comparator 121 is connected to the positive output end of the oscillation circuit 110 through the first switch 153 , and connected to the negative output end of the oscillation circuit 110 through the second switch 154 , and a negative input end of the first comparator 121 is configured to input a first reference signal; and a second comparator 122 , where a positive input end of the second comparator 122 is connected to the positive output end of the oscillation circuit 110 through the third switch 155 , and connected to the negative output end of the oscillation circuit 110 through the fourth switch 156 , and a negative input end of the second comparator 122 is configured to input a second reference signal.","According to the amplitude limiting oscillation circuit of the embodiments of the present disclosure, a switching circuit is used, and an adjustable range may be expanded.","In some possible implementation manners, the low pass filtering circuit 130 includes: a first low pass filter, including a first resistor 131 and a second capacitor 132 , where an input end of the first low pass filter is connected to an output end of the first comparator 121 , and an output end of the first low pass filter is connected to a gate electrode of a fifth MOS transistor 141 ; and a second low pass filter, including a second resistor 133 and a third capacitor 134 , where an input end of the second low pass filter is connected to an output end of the second comparator 122 , and an output end of the second low pass filter is connected to a gate electrode of a sixth MOS transistor 142 ; and the voltage controlled resistance circuit 140 includes: the fifth MOS transistor 141 , where a source electrode of the fifth MOS transistor 141 is connected to a power supply, and a drain electrode of the fifth MOS transistor 141 is connected to a source electrode of the first MOS transistor 113 and a source electrode of the second MOS transistor 114 ; and the sixth MOS transistor 142 , where a source electrode of the sixth MOS transistor 142 is connected to ground, and a drain electrode of the sixth MOS transistor 142 is connected to a source electrode of the third MOS transistor 115 and a source electrode of the fourth MOS transistor 116 .","Amplitude control of the amplitude limiting oscillation circuit of the embodiments of the present disclosure is mainly based on source electrode feedback; therefore, the manner of the amplitude control does not have a problem of stability, that is, the stability of the amplitude limiting oscillation circuit of the embodiments of the present disclosure is better.","According to a second aspect, a chip is provided, and the chip includes the amplitude limiting oscillation circuit of the first aspect or the amplitude limiting oscillation circuit of any one of possible implementation manners of the first aspect."],["CROSS REFERENCE TO RELATED APPLICATIONS The present application is a continuation of international application No.","PCT/CN2016/103225, filed on Oct. 25, 2016, which is hereby incorporated by reference in its entirety.","TECHNICAL FIELD The present disclosure relates to the field of information technologies, and in particular, to an amplitude limiting oscillation circuit.","BACKGROUND If no amplitude limitation is performed on a common LC oscillation circuit, an amplitude of the oscillation circuit would eventually stabilize to a power supply voltage, and such oscillation circuit has several disadvantages as follows: 1.distortion of an oscillation waveform of the oscillation circuit occurs, and a rising edge and a falling edge thereof are dissymmetrical, such that a 1/f3 noise inflection point of the oscillation circuit moves to a high frequency, resulting in worse low frequency phase noise; and 2.a large oscillation amplitude causes a very large current through an inductor, such that a magnetic core of the inductor is saturated, resulting in a change of an inductance value, ultimately affecting stability of a frequency.","Usually, an approach of limiting amplitude is to detect an oscillation amplitude by using an amplitude detection circuit or a peak detection circuit, and then output a control voltage to control a bias current of an oscillation circuit, so as to achieve an effect of limiting the amplitude of the oscillation circuit.","However, the approach also has several disadvantages as follows: 1.a loop gain of such approach is larger, easily resulting in instability of a control loop; 2.the control loop per se may introduce greater noise, resulting in worse phase noise of the oscillation circuit; and 3.most of the amplitude detection circuits cannot accurately control the oscillation amplitude, thereby limiting its utility.","Therefore, it becomes a technical problem to be solved urgently to improve performance of an amplitude limiting oscillation circuit.","SUMMARY Embodiments of the present disclosure provide an amplitude limiting oscillation circuit, and performance of the amplitude limiting oscillation circuit may be improved.","According to a first aspect, an amplitude limiting oscillation circuit is provided, including: an oscillation circuit 110, configured to generate an oscillation signal; a pulse width modulation circuit 120, configured to generate a pulse width modulation signal according to an amplitude of the oscillation signal; a low pass filtering circuit 130, configured to convert the pulse width modulation signal into a direct current control voltage signal, where the direct current control voltage signal is configured to control a voltage controlled resistance circuit 140; and the voltage controlled resistance circuit 140, configured to change a resistance value of the voltage controlled resistance circuit 140 under control of the direct current control voltage signal, to control the amplitude of the oscillation signal.","According to the amplitude limiting oscillation circuit of the embodiments of the present disclosure, negative feedback is performed by using a voltage controlled resistance circuit, and a control loop may not introduce extra noise; therefore, phase noise of the amplitude limiting oscillation circuit is lower, and performance of the amplitude limiting oscillation circuit is improved.","In some possible implementation manners, the oscillation circuit 110 is an LC oscillation circuit, a crystal oscillation circuit or a relaxation oscillation circuit.","In some possible implementation manners, the pulse width modulation circuit 120 includes a comparator, configured to generate the pulse width modulation signal by comparing an amplitude of a reference signal with the amplitude of the oscillation signal.","When the comparator is used, the amplitude of the amplitude limiting oscillation circuit depends on a reference voltage of the comparator, that is, a final amplitude range of the amplitude limiting oscillation circuit is very close to the reference voltage of the comparator; therefore, it is easy to control the oscillation amplitude of the amplitude limiting oscillation circuit of the embodiments of the present disclosure.","In some possible implementation manners, the low pass filtering circuit 130 is a passive filter or an active filter.","In some possible implementation manners, resistance of the voltage controlled resistance circuit 140 is linear resistance or nonlinear resistance that operates in a linear region.","In some possible implementation manners, the voltage controlled resistance circuit 140 includes a metal oxide semiconductor field effect transistor MOS.","In some possible implementation manners, the oscillation circuit 110 includes a positive output end and a negative output end.","In some possible implementation manners, the oscillation circuit 110 includes: an inductor 111, and a first capacitor 112, where the inductor 111 and the first capacitor 112 form a resonant circuit; and a first MOS transistor 113, a second MOS transistor 114, a third MOS transistor 115, and a fourth MOS transistor 116, where the first MOS transistor 113, the second MOS transistor 114, the third MOS transistor 115, and the fourth MOS transistor 116 provide negative resistance for the resonant circuit, a drain electrode of the first MOS transistor 113 and a gate electrode of the second MOS transistor 114 form a positive output end of the oscillation circuit 110, and a gate electrode of the third MOS transistor 115 and a drain electrode of the fourth MOS transistor 116 form a negative output end of the oscillation circuit 110.In some possible implementation manners, the pulse width modulation circuit 120 includes: a first comparator 121, where a positive input end of the first comparator 121 is connected to the positive output end of the oscillation circuit 110, and a negative input end of the first comparator 121 is configured to input a first reference signal; and a second comparator 122, where a positive input end of the second comparator 122 is connected to the negative output end of the oscillation circuit 110, and a negative input end of the second comparator 122 is configured to input a second reference signal.","In some possible implementation manners, the amplitude limiting oscillation circuit further includes: a switching circuit 150, configured to switch a connection between the positive input end or the negative output end and the pulse width modulation circuit 120.In some possible implementation manners, the switching circuit 150 includes: a third comparator 151, an inverter 152, a first switch 153, a second switch 154, a third switch 155 and a fourth switch 156; where a positive input end of the third comparator 151 is connected to the positive output end of the oscillation circuit 110, a negative input end of the third comparator 151 is connected to the negative output end of the oscillation circuit 110, an input end of the inverter 152 is connected to an output end of the third comparator 151, an output signal of the third comparator 151 is used to control the first switch 153 and the fourth switch 156, and an output signal of the inverter 152 is used to control the second switch 154 and the third switch 155.In some possible implementation manners, the pulse width modulation circuit 120 includes: a first comparator 121, where a positive input end of the first comparator 121 is connected to the positive output end of the oscillation circuit 110 through the first switch 153, and connected to the negative output end of the oscillation circuit 110 through the second switch 154, and a negative input end of the first comparator 121 is configured to input a first reference signal; and a second comparator 122, where a positive input end of the second comparator 122 is connected to the positive output end of the oscillation circuit 110 through the third switch 155, and connected to the negative output end of the oscillation circuit 110 through the fourth switch 156, and a negative input end of the second comparator 122 is configured to input a second reference signal.","According to the amplitude limiting oscillation circuit of the embodiments of the present disclosure, a switching circuit is used, and an adjustable range may be expanded.","In some possible implementation manners, the low pass filtering circuit 130 includes: a first low pass filter, including a first resistor 131 and a second capacitor 132, where an input end of the first low pass filter is connected to an output end of the first comparator 121, and an output end of the first low pass filter is connected to a gate electrode of a fifth MOS transistor 141; and a second low pass filter, including a second resistor 133 and a third capacitor 134, where an input end of the second low pass filter is connected to an output end of the second comparator 122, and an output end of the second low pass filter is connected to a gate electrode of a sixth MOS transistor 142; and the voltage controlled resistance circuit 140 includes: the fifth MOS transistor 141, where a source electrode of the fifth MOS transistor 141 is connected to a power supply, and a drain electrode of the fifth MOS transistor 141 is connected to a source electrode of the first MOS transistor 113 and a source electrode of the second MOS transistor 114; and the sixth MOS transistor 142, where a source electrode of the sixth MOS transistor 142 is connected to ground, and a drain electrode of the sixth MOS transistor 142 is connected to a source electrode of the third MOS transistor 115 and a source electrode of the fourth MOS transistor 116.Amplitude control of the amplitude limiting oscillation circuit of the embodiments of the present disclosure is mainly based on source electrode feedback; therefore, the manner of the amplitude control does not have a problem of stability, that is, the stability of the amplitude limiting oscillation circuit of the embodiments of the present disclosure is better.","According to a second aspect, a chip is provided, and the chip includes the amplitude limiting oscillation circuit of the first aspect or the amplitude limiting oscillation circuit of any one of possible implementation manners of the first aspect.","BRIEF DESCRIPTION OF DRAWINGS To illustrate a technical solution of embodiments of the present disclosure more clearly, the accompanying drawings which are needed in the embodiments of the present disclosure are introduced briefly below.","Apparently, the accompanying drawings described below are merely some of the embodiments of the present disclosure, based on which other drawings can be obtained by persons of ordinary skill in the art without any creative effort.","FIG.","1 is a schematic diagram of an amplitude limiting oscillation circuit according to an embodiment of the present disclosure.","FIG.","2 is a schematic diagram of an amplitude limiting oscillation circuit according to another embodiment of the present disclosure.","FIG.","3 is a schematic diagram of an amplitude limiting oscillation circuit according to a further embodiment of the present disclosure.","FIG.","4 is a schematic diagram of an amplitude limiting oscillation circuit according to still another embodiment of the present disclosure.","DESCRIPTION OF EMBODIMENTS The technical solution in the embodiments of the present disclosure will be described clearly and fully below in conjunction with the drawings in the embodiments of the present disclosure, and apparently, the embodiments described are only part of embodiments of the present disclosure, not all of them.","All of the other embodiments, obtained by those of ordinary skill in the art based on the embodiments of the present disclosure without any creative effort, fall into the protection scope of the present disclosure.","FIG.","1 illustrates a schematic diagram of an amplitude limiting oscillation circuit 100 according to an embodiment of the present disclosure.","As shown in FIG.","1, the amplitude limiting oscillation circuit 110 may include an oscillation circuit 110, a pulse width modulation circuit 120, a low pass filtering circuit 130, and a voltage controlled resistance circuit 140.The oscillation circuit 110 is configured to generate an oscillation signal.","The oscillation circuit 110 may be any type of oscillation circuit, such as LC oscillation circuit, crystal oscillation circuit or relaxation oscillation circuit, and the present disclosure does not limit the type of the oscillation circuit 110.Optionally, the oscillation circuit 110 may output two oscillation signals.","Phases of the two oscillation signals are opposite.","That is, the oscillation circuit 110 may have a positive output end and a negative output end, and the positive output end and the negative output end output oscillation signals with opposite phases, respectively.","The pulse width modulation circuit 120 is configured to generate a pulse width modulation signal according to an amplitude of an oscillation signal.","Optionally, the pulse width modulation circuit 120 may include a comparator, and the comparator generates the pulse width modulation signal by comparing an amplitude of a reference signal with the amplitude of the oscillation signal.","For example, if the amplitude of the oscillation signal is larger than the amplitude of the reference signal, a high level signal is generated; and if the amplitude of the oscillation signal is lower than the amplitude of the reference signal, a low level signal is generated.","It should be understood that, the pulse width modulation circuit 120 may also be implemented by another circuit, and the present disclosure does not limit that the pulse width modulation circuit 120 is implemented only by a comparator.","The low pass filtering circuit 130 is configured to convert the pulse width modulation signal into a direct current control voltage signal, where the direct current control voltage signal is configured to control the voltage controlled resistance circuit 140.The pulse width modulation signal generated by the pulse width modulation circuit 120 is input into the low pass filtering circuit 130, and is converted into the direct current control voltage signal by the low pass filtering circuit 130; and the direct current control voltage signal is input into a voltage controlled end of the voltage controlled resistance circuit 140, so as to control a change of a resistance value of the voltage controlled resistance circuit 140.Optionally, the low pass filtering circuit 130 may be a passive filter or an active filter, and the present disclosure is not limited hereto.","The voltage controlled resistance circuit 140 is configured to change the resistance value of the voltage controlled resistance circuit 140 under control of the direct current control voltage signal, to control the amplitude of the oscillation signal.","The resistance value of the voltage controlled resistance circuit 140 is changed under the control of the direct current control voltage signal.","Optionally, resistance of the voltage controlled resistance circuit 140 may be linear resistance or nonlinear resistance that operates in a linear region.","Optionally, the voltage controlled resistance circuit 140 may include metal oxide semiconductor field effect transistor (Metal-Oxide-Semiconductor, MOS).","That is, a voltage controlled resistor may be an MOS transistor, but the present disclosure is not limited hereto, and another voltage controlled resistor may also be used.","FIG.","2 illustrates a schematic diagram of a specific implementation manner of an amplitude limiting oscillation circuit 100 according to an embodiment of the present disclosure.","It should be understood that, FIG.","2 is only an example, which does not limit the scope of the embodiment of the present disclosure.","As shown in FIG.","2, the oscillation circuit 110 in FIG.","1 may be implemented by an inductor, a capacitor and an MOS transistor.","Particularly, the oscillation circuit 110 may include an inductor 111, a first capacitor 112, a first MOS transistor 113, a second MOS transistor 114, a third MOS transistor 115, and a fourth MOS transistor 116.The inductor 111 and the first capacitor 112 form a resonant circuit.","The first MOS transistor 113, the second MOS transistor 114, the third MOS transistor 115 and the fourth MOS transistor 116 provide negative resistance for the resonant circuit.","A drain electrode of the first MOS transistor 113 and a gate electrode of the second MOS transistor 114 form a positive output end of the oscillation circuit 110, and the positive output end outputs an oscillation signal Vop; and a gate electrode of the third MOS transistor 115 and a drain electrode of the fourth MOS transistor 116 form a negative output end of the oscillation circuit 110, and the negative output end outputs an oscillation signal Von.","Optionally, when the oscillation circuit 110 includes the positive output end and the negative output end, a pulse width modulation circuit 120 may be implemented by two comparators.","Particularly, the pulse width modulation circuit 120 may include a first comparator 121 and a second comparator 122.A positive input end of the first comparator 121 is connected to the positive output end of the oscillation circuit 110, that is, the oscillation signal Vop may be input into the positive input end of the first comparator 121; and a negative input end of the first comparator 121 is configured to input a first reference signal Vrp.","A positive input end of the second comparator 122 is connected to the negative output end of the oscillation circuit 110, that is, the oscillation signal Von may be input into positive input end of the second comparator 122; and a negative input end of the second comparator 122 is configured to input a second reference signal Vrn.","Optionally, Vrp and Vrn may be adjustable direct current voltage signals.","Optionally, Vdd>Vrp>Vrn>Vgd, where Vdd is a voltage of a power supply, and Vgd is a voltage of a ground end.","The first comparator 121 compares Vop with Vrp, and outputs a positive pulse width modulation signal Vp1; and The second comparator 122 compares Von with Vrn, and outputs a negative pulse width modulation signal Vp2.Optionally, when the pulse width modulation circuit 120 includes two comparators, the low pass filtering circuit 130 may be implemented by two low pass filters.","Particularly, the low pass filtering circuit 130 may include a first low pass filter and a second low pass filter.","As shown in FIG.","2, the first low pass filter may include a first resistor 131 and a second capacitor 132, where an input end of the first low pass filter is connected to an output end of the first comparator 121, and an output end of the first low pass filter is connected to a gate electrode of a fifth MOS transistor 141.An input of the first low pass filter is Vp1, and the first low pass filter outputs a direct current control voltage signal Vp2 to the gate electrode of the fifth MOS transistor 141.The second low pass filter may include a second resistor 133 and a third capacitor 134, where an input end of the second low pass filter is connected to an output end of the second comparator 122, and an output end of the second low pass filter is connected to a gate electrode of a sixth MOS transistor 142.An input of the second low pass filter is Vn1, and the second low pass filter outputs a direct current control voltage signal Vn2 to the gate electrode of the sixth MOS transistor 142.Correspondingly, the voltage controlled resistance circuit 140 also includes two parts.","As shown in FIG.","2, the voltage controlled resistance circuit 140 may include: the fifth MOS transistor 141, where a source electrode of the fifth MOS transistor 141 is connected to the power supply Vdd, and a drain electrode of the fifth MOS transistor 141 is connected to a source electrode of the first MOS transistor 113 and a source electrode of the second MOS transistor 114; and the sixth MOS transistor 142, where a source electrode of the sixth MOS transistor 142 is connected to ground Vgd, and a drain electrode of the sixth MOS transistor 142 is connected to a source electrode of the third MOS transistor 115 and a source electrode of the fourth MOS transistor 116.The gate electrode of the fifth MOS transistor 141 and the gate electrode of the sixth MOS 142 are voltage controlled ends of the voltage controlled resistance circuit 140.An upper loop in FIG.","2 may be called as a P-type feedback loop; and a lower loop in FIG.","2 may be called as an N-type feedback loop.","The P-type feedback loop and the N-type feedback loop are completely symmetrical, and working principles of the two are similar.","Taking the P-type feedback loop as an example, when the oscillation circuit starts oscillating, an amplitude of Vop gets larger gradually, and when the amplitude is larger than Vrp, the comparator 121 outputs a high pulse; since Vop is a sine wave signal, the larger the amplitude of Vop is, the wider the width of the high pulse output by the comparator 121 is.","A direct current voltage Vp2, that is proportional to the width of the pulse, is obtained after the pulse is passed through a low pass filter.","If Vp2 is higher, equivalent resistance of the fifth MOS transistor 141 is greater.","That is, if the amplitude of the oscillation circuit becomes larger, the width of the pulse becomes wider, Vp2 increases, the resistance of the fifth MOS transistor 141 increases, negative resistance of the first MOS transistor 113 and the second MOS transistor 114 reduces due to an effect of source electrode negative feedback, and thus the output amplitude begins to decrease.","Similarly, an operating principle of the N-type feedback loop may be known.","Optionally, as shown in FIG.","3, an amplitude limiting oscillation circuit 100 may further include: a switching circuit 150, configured to switch a connection between a positive input end or a negative output end and a pulse width modulation circuit 120.When an oscillation circuit 110 includes the positive output end and the negative output end, a connection between the positive output end or the negative output end and different input ends of the pulse width modulation circuit 120 may be switched through the switching circuit 150.Optionally, as shown in FIG.","4, a switching circuit 150 may include: a third comparator 151, an inverter 152, a first switch 153, a second switch 154, a third switch 155 and a fourth switch 156.A positive input end of the third comparator 151 is connected to a positive output end of an oscillation circuit 110, a negative input end of the third comparator 151 is connected to a negative output end of the oscillation circuit 110, an input end of the inverter 152 is connected to an output end of the third comparator 151, an output signal Vsp of the third comparator 151 is used to control the first switch 153 and the fourth switch 156, and an output signal Vsn of the inverter 152 is used to control the second switch 154 and the third switch 155.In this case, optionally, a pulse width modulation circuit 120 may include: a first comparator 121, where a positive input end of the first comparator 121 is connected to the positive output end of the oscillation circuit 110 through the first switch 153, and connected to the negative output end of the oscillation circuit 110 through the second switch 154, and a negative input end of the first comparator 121 is configured to input a first reference signal Vrp; and a second comparator 122, where a positive input end of the second comparator 122 is connected to the positive output end of the oscillation circuit 110 through the third switch 155, and connected to the negative output end of the oscillation circuit 110 through the fourth switch 156, and a negative input end of the second comparator 122 is configured to input a second reference signal Vrn.","When Vop is greater than Von, Vsp is a high level, the first switch 153 and the fourth switch 156 are switched on, and the second switch 154 and the third switch 155 are switched off; the first comparator 121 compares Vop with Vrp to outputs Vp1; and the second comparator 122 compares Von with Vrn to outputs Vn1; and Vsp is a low level and Vsn is a high level, the second switch 154 and the third switch 155 are switched on, and the first switch 153 and the fourth switch 156 are switched off; the first comparator 121 compares Von with Vrp to outputs Vp1; and the second comparator 122 compares Vop with Vrn to outputs Vn1.Therefore, whether Vop is greater than Von, or Vop is less than Von, the first comparator 121 may output Vp1, and the second comparator 122 may output Vn1; that is, ranges of duty cycle of Vp1 and Vn1 may both be changed to 0˜100%.","The parts oscillation circuit, the low pass filtering circuit and the voltage controlled resistance circuit in the FIG.","4 are similar to that in FIG.","2; and for concision, they will not be described redundantly herein.","An operating principle of the amplitude limiting oscillation circuit in FIG.","4 is similar to that in FIG.","2, and the difference lies in that the adjustable range is expanded since a switching circuit is used in FIG.","4.Taking the P-type feedback loop as an example, in FIG.","2, a range of duty cycle of Vp1 is 0˜50%, a voltage range of Vp2 after filtering is 0˜0.5Vdd, and the adjustable range is relatively narrow.","However, in FIG.","4, the range of duty cycle of Vp1 is changed to 0˜100%, thereby widening the adjustable range.","According to an amplitude limiting oscillation circuit of the embodiments of the present disclosure, negative feedback is performed by using a voltage controlled resistance circuit, and a control loop may not introduce extra noise; therefore, phase noise of the amplitude limiting oscillation circuit is lower.","Further, amplitude control of the amplitude limiting oscillation circuit of the embodiments of the present disclosure is mainly based on source electrode feedback; therefore, the manner of the amplitude control does not have a problem of stability, that is, the stability of the amplitude limiting oscillation circuit of the embodiments of the present disclosure is better.","In addition, when a comparator is used, amplitude of the amplitude limiting oscillation circuit depends on a reference voltage of the comparator, that is, a final amplitude range of the amplitude limiting oscillation circuit is very close to the reference voltage of the comparator; therefore, it is easy to control the oscillation amplitude of the amplitude limiting oscillation circuit of the embodiments of the present disclosure.","Therefore, with the technical solution of the embodiments of the present disclosure, performance of an amplitude limiting oscillation circuit may be improved.","Another embodiment of the present disclosure further provides a chip, and the chip may include the amplitude limiting oscillation circuit of the foregoing embodiments of the present disclosure.","It should be understood that, the specific examples in this text is for helping those skilled in the art to better understand the embodiments of the present disclosure, rather than limiting the scope of the embodiments of the present disclosure.","Those of ordinary skill in the art may realize that, units and algorithm steps in conjunction with the various examples described by the embodiments disclosed herein can be realized by electronic hardware, computer software or the combination thereof, and in order to clearly describe the interchangeability of hardware and software, the compositions and steps of the various examples are generally described according to functions in the foregoing description.","Whether these functions are executed in hardware or software mode depends on the specific applications and design constraint conditions of the technical solution.","Those skilled may implement the described functions by using different methods for each specific application, but this implementation should not be considered to be beyond the scope of the present disclosure.","In the several embodiments provided in the present application, it should be understood that, the disclosed system, apparatus and method may be implemented in other manners.","For example, the apparatus embodiments described above are merely exemplary, e.g., the division of the units is merely a logic function division, other division manners may exist in practical implementation, for example, a plurality of units or components may be combined or integrated to another system, or some features may be omitted or not implemented.","In addition, the displayed or discussed mutual coupling or direct coupling or communication connection may be indirect coupling or communication connection via some interfaces, apparatuses or units, and may also be in electrical, mechanical or other forms.","The units described as separate parts may be or may not be separated physically, and a component displayed as a unit may be or may not be a physical unit, namely, may be located in one place, or may be distributed on a plurality of network units.","A part of or all of the units may be selected to achieve the purposes of the solution in the embodiments of the present disclosure according to actual demands.","In addition, the respective functional units in the respective embodiments of the present disclosure may be integrated in one processing unit, or the respective units singly exist physically, or two or more units are integrated in one unit.","The foregoing integrated unit may be implemented in the form of hardware, or be implemented in a form of a software functional unit.","If the integrated unit is implemented in the form of the software functional unit and is sold or used as an independent product, it may be stored in a computer readable storage medium.","Based on such understanding, the technical solution of the present disclosure substantially, or the part of the present disclosure making contribution to the prior art, or all of or part of the technical solution may be embodied in the form of a software product, and the computer software product is stored in a storage medium, which includes multiple instructions enabling computer equipment (which may be a personal computer, a server, network equipment or the like) to execute all of or part of the steps in the methods of the embodiments of the present disclosure.","The foregoing storage medium includes a variety of media capable of storing program codes, such as a USB disk, a mobile hard disk, a read-only memory (ROM, Read-Only Memory), a random access memory (RAM, Random Access Memory), a magnetic disk, an optical disk or the like.","Described above is the specific embodiments of the present disclosure only, but the protection scope of the present disclosure is not limited to this, any skilled one who is familiar with this art could readily think of various equivalent modifications or substitutions within the disclosed technical scope of the present disclosure, and these modifications or substitutions shall fall within the protection scope of the present disclosure.","Therefore, the protection scope of the present disclosure shall be defined by the claims."]],"string":"[\n [\n \"AMPLITUDE LIMITING OSCILLATION CIRCUIT\",\n \"An amplitude limiting oscillation circuit (100) is disclosed.\",\n \"The amplitude limiting oscillation circuit (100) includes: an oscillation circuit (110), configured to generate an oscillation signal; a pulse width modulation circuit (120), configured to generate a pulse width modulation signal according to an amplitude of the oscillation signal; a low pass filtering circuit (130), configured to convert the pulse width modulation signal into a direct current control voltage signal, where the direct current control voltage signal is configured to control a voltage controlled resistance circuit (140); and the voltage controlled resistance circuit (140), configured to change a resistance value of the voltage controlled resistance circuit (140) according to under the direct current control voltage signal, to control the amplitude of the oscillation signal.\",\n \"The amplitude limiting oscillation circuit (100), may improve performance of the amplitude limiting oscillation circuit (100).\"\n ],\n [\n \"1.An amplitude limiting oscillation circuit, comprising: an oscillation circuit (110), configured to generate an oscillation signal; a pulse width modulation circuit (120), configured to generate a pulse width modulation signal according to an amplitude of the oscillation signal; a low pass filtering circuit (130), configured to convert the pulse width modulation signal into a direct current control voltage signal; and a voltage controlled resistance circuit (140), configured to change a resistance value of the voltage controlled resistance circuit (140) under control of the direct current control voltage signal, to control the amplitude of the oscillation signal.\",\n \"2.The amplitude limiting oscillation circuit according to claim 1, wherein the oscillation circuit (110) is an LC oscillation circuit, a crystal oscillation circuit or a relaxation oscillation circuit.\",\n \"3.The amplitude limiting oscillation circuit according to claim 1, wherein the pulse width modulation circuit (120) comprises a comparator, configured to generate the pulse width modulation signal by comparing an amplitude of a reference signal with the amplitude of the oscillation signal.\",\n \"4.The amplitude limiting oscillation circuit according to claim 1, wherein the low pass filtering circuit (130) is a passive filter or an active filter.\",\n \"5.The amplitude limiting oscillation circuit according to claim 1, wherein resistance of the voltage controlled resistance circuit (140) is linear resistance or nonlinear resistance that operates in a linear region.\",\n \"6.The amplitude limiting oscillation circuit according to claim 1, wherein the voltage controlled resistance circuit (140) comprises a metal oxide semiconductor field effect transistor.\",\n \"7.The amplitude limiting oscillation circuit according to claim 1, wherein the oscillation circuit (110) comprises a positive output end and a negative output end.\",\n \"8.The amplitude limiting oscillation circuit according to claim 7, wherein the oscillation circuit (110) comprises: an inductor (111), and a first capacitor (112), wherein the inductor (111) and the first capacitor (112) form a resonant circuit; and a first MOS transistor (113), a second MOS transistor (114), a third MOS transistor (115), and a fourth MOS transistor (116), wherein the first MOS transistor (113), the second MOS transistor (114), the third MOS transistor (115), and the fourth MOS transistor (116) provide negative resistance for the resonant circuit, a drain electrode of the first MOS transistor (113) and a gate electrode of the second MOS transistor (114) form a positive output end of the oscillation circuit (110), and a gate electrode of the third MOS transistor (115) and a drain electrode of the fourth MOS transistor (116) form a negative output end of the oscillation circuit (110).\",\n \"9.The amplitude limiting oscillation circuit according to claim 7, wherein the pulse width modulation circuit (120) comprises: a first comparator (121), wherein a positive input end of the first comparator (121) is connected to the positive output end of the oscillation circuit (110), and a negative input end of the first comparator (121) is configured to input a first reference signal; and a second comparator (122), wherein a positive input end of the second comparator (122) is connected to the negative output end of the oscillation circuit (110), and a negative input end of the second comparator (122) is configured to input a second reference signal.\",\n \"10.The amplitude limiting oscillation circuit according to claim 9, wherein the low pass filtering circuit (130) comprises: a first low pass filter, comprising a first resistor (131) and a second capacitor (132), wherein an input end of the first low pass filter is connected to an output end of the first comparator (121), and an output end of the first low pass filter is connected to a gate electrode of a fifth MOS transistor (141); and a second low pass filter, comprising a second resistor (133) and a third capacitor (134), wherein an input end of the second low pass filter is connected to an output end of the second comparator (122), and an output end of the second low pass filter is connected to a gate electrode of a sixth MOS transistor (142); and the voltage controlled resistance circuit (140) comprises: the fifth MOS transistor (141), wherein a source electrode of the fifth MOS transistor (141) is connected to a power supply, and a drain electrode of the fifth MOS transistor (141) is connected to a source electrode of the first MOS transistor (113) and a source electrode of the second MOS transistor (114); and the sixth MOS transistor (142), wherein a source electrode of the sixth MOS transistor (142) is connected to ground, and a drain electrode of the sixth MOS transistor (142) is connected to a source electrode of the third MOS transistor (115) and a source electrode of the fourth MOS transistor (116).\",\n \"11.The amplitude limiting oscillation circuit according to claim 7, wherein the amplitude limiting oscillation circuit further comprises: a switching circuit (150), configured to switch a connection between the positive input end or the negative output end and the pulse width modulation circuit (120).\",\n \"12.The amplitude limiting oscillation circuit according to claim 11, wherein the switching circuit (150) comprises: a third comparator (151), an inverter (152), a first switch (153), a second switch (154), a third switch (155) and a fourth switch (156); wherein a positive input end of the third comparator (151) is connected to the positive output end of the oscillation circuit (110), a negative input end of the third comparator (151) is connected to the negative output end of the oscillation circuit (110), an input end of the inverter (152) is connected to an output end of the third comparator (151), an output signal of the third comparator (151) is used to control the first switch (153) and the fourth switch (156), and an output signal of the inverter (152) is used to control the second switch (154) and the third switch (155).\",\n \"13.The amplitude limiting oscillation circuit according to claim 12, wherein the pulse width modulation circuit (120) comprises: a first comparator (121), wherein a positive input end of the first comparator (121) is connected to the positive output end of the oscillation circuit (110) through the first switch (153), and connected to the negative output end of the oscillation circuit (110) through the second switch (154), and a negative input end of the first comparator (121) is configured to input a first reference signal; and a second comparator (122), wherein a positive input end of the second comparator (122) is connected to the positive output end of the oscillation circuit (110) through the third switch (155), and connected to the negative output end of the oscillation circuit (110) through the fourth switch (156), and a negative input end of the second comparator (122) is configured to input a second reference signal.\",\n \"14.The amplitude limiting oscillation circuit according to claim 13, wherein the low pass filtering circuit (130) comprises: a first low pass filter, comprising a first resistor (131) and a second capacitor (132), wherein an input end of the first low pass filter is connected to an output end of the first comparator (121), and an output end of the first low pass filter is connected to a gate electrode of a fifth MOS transistor (141); and a second low pass filter, comprising a second resistor (133) and a third capacitor (134), wherein an input end of the second low pass filter is connected to an output end of the second comparator (122), and an output end of the second low pass filter is connected to a gate electrode of a sixth MOS transistor (142); and the voltage controlled resistance circuit (140) comprises: the fifth MOS transistor (141), wherein a source electrode of the fifth MOS transistor (141) is connected to a power supply, and a drain electrode of the fifth MOS transistor (141) is connected to a source electrode of the first MOS transistor (113) and a source electrode of the second MOS transistor (114); and the sixth MOS transistor (142), wherein a source electrode of the sixth MOS transistor (142) is connected to ground, and a drain electrode of the sixth MOS transistor (142) is connected to a source electrode of the third MOS transistor (115) and a source electrode of the fourth MOS transistor (116).\"\n ],\n [\n \" BACKGROUND If no amplitude limitation is performed on a common LC oscillation circuit, an amplitude of the oscillation circuit would eventually stabilize to a power supply voltage, and such oscillation circuit has several disadvantages as follows: 1.distortion of an oscillation waveform of the oscillation circuit occurs, and a rising edge and a falling edge thereof are dissymmetrical, such that a 1/f 3 noise inflection point of the oscillation circuit moves to a high frequency, resulting in worse low frequency phase noise; and 2.a large oscillation amplitude causes a very large current through an inductor, such that a magnetic core of the inductor is saturated, resulting in a change of an inductance value, ultimately affecting stability of a frequency.\",\n \"Usually, an approach of limiting amplitude is to detect an oscillation amplitude by using an amplitude detection circuit or a peak detection circuit, and then output a control voltage to control a bias current of an oscillation circuit, so as to achieve an effect of limiting the amplitude of the oscillation circuit.\",\n \"However, the approach also has several disadvantages as follows: 1.a loop gain of such approach is larger, easily resulting in instability of a control loop; 2.the control loop per se may introduce greater noise, resulting in worse phase noise of the oscillation circuit; and 3.most of the amplitude detection circuits cannot accurately control the oscillation amplitude, thereby limiting its utility.\",\n \"Therefore, it becomes a technical problem to be solved urgently to improve performance of an amplitude limiting oscillation circuit.\"\n ],\n [\n \" SUMMARY Embodiments of the present disclosure provide an amplitude limiting oscillation circuit, and performance of the amplitude limiting oscillation circuit may be improved.\",\n \"According to a first aspect, an amplitude limiting oscillation circuit is provided, including: an oscillation circuit 110 , configured to generate an oscillation signal; a pulse width modulation circuit 120 , configured to generate a pulse width modulation signal according to an amplitude of the oscillation signal; a low pass filtering circuit 130 , configured to convert the pulse width modulation signal into a direct current control voltage signal, where the direct current control voltage signal is configured to control a voltage controlled resistance circuit 140 ; and the voltage controlled resistance circuit 140 , configured to change a resistance value of the voltage controlled resistance circuit 140 under control of the direct current control voltage signal, to control the amplitude of the oscillation signal.\",\n \"According to the amplitude limiting oscillation circuit of the embodiments of the present disclosure, negative feedback is performed by using a voltage controlled resistance circuit, and a control loop may not introduce extra noise; therefore, phase noise of the amplitude limiting oscillation circuit is lower, and performance of the amplitude limiting oscillation circuit is improved.\",\n \"In some possible implementation manners, the oscillation circuit 110 is an LC oscillation circuit, a crystal oscillation circuit or a relaxation oscillation circuit.\",\n \"In some possible implementation manners, the pulse width modulation circuit 120 includes a comparator, configured to generate the pulse width modulation signal by comparing an amplitude of a reference signal with the amplitude of the oscillation signal.\",\n \"When the comparator is used, the amplitude of the amplitude limiting oscillation circuit depends on a reference voltage of the comparator, that is, a final amplitude range of the amplitude limiting oscillation circuit is very close to the reference voltage of the comparator; therefore, it is easy to control the oscillation amplitude of the amplitude limiting oscillation circuit of the embodiments of the present disclosure.\",\n \"In some possible implementation manners, the low pass filtering circuit 130 is a passive filter or an active filter.\",\n \"In some possible implementation manners, resistance of the voltage controlled resistance circuit 140 is linear resistance or nonlinear resistance that operates in a linear region.\",\n \"In some possible implementation manners, the voltage controlled resistance circuit 140 includes a metal oxide semiconductor field effect transistor MOS.\",\n \"In some possible implementation manners, the oscillation circuit 110 includes a positive output end and a negative output end.\",\n \"In some possible implementation manners, the oscillation circuit 110 includes: an inductor 111 , and a first capacitor 112 , where the inductor 111 and the first capacitor 112 form a resonant circuit; and a first MOS transistor 113 , a second MOS transistor 114 , a third MOS transistor 115 , and a fourth MOS transistor 116 , where the first MOS transistor 113 , the second MOS transistor 114 , the third MOS transistor 115 , and the fourth MOS transistor 116 provide negative resistance for the resonant circuit, a drain electrode of the first MOS transistor 113 and a gate electrode of the second MOS transistor 114 form a positive output end of the oscillation circuit 110 , and a gate electrode of the third MOS transistor 115 and a drain electrode of the fourth MOS transistor 116 form a negative output end of the oscillation circuit 110 .\",\n \"In some possible implementation manners, the pulse width modulation circuit 120 includes: a first comparator 121 , where a positive input end of the first comparator 121 is connected to the positive output end of the oscillation circuit 110 , and a negative input end of the first comparator 121 is configured to input a first reference signal; and a second comparator 122 , where a positive input end of the second comparator 122 is connected to the negative output end of the oscillation circuit 110 , and a negative input end of the second comparator 122 is configured to input a second reference signal.\",\n \"In some possible implementation manners, the amplitude limiting oscillation circuit further includes: a switching circuit 150 , configured to switch a connection between the positive input end or the negative output end and the pulse width modulation circuit 120 .\",\n \"In some possible implementation manners, the switching circuit 150 includes: a third comparator 151 , an inverter 152 , a first switch 153 , a second switch 154 , a third switch 155 and a fourth switch 156 ; where a positive input end of the third comparator 151 is connected to the positive output end of the oscillation circuit 110 , a negative input end of the third comparator 151 is connected to the negative output end of the oscillation circuit 110 , an input end of the inverter 152 is connected to an output end of the third comparator 151 , an output signal of the third comparator 151 is used to control the first switch 153 and the fourth switch 156 , and an output signal of the inverter 152 is used to control the second switch 154 and the third switch 155 .\",\n \"In some possible implementation manners, the pulse width modulation circuit 120 includes: a first comparator 121 , where a positive input end of the first comparator 121 is connected to the positive output end of the oscillation circuit 110 through the first switch 153 , and connected to the negative output end of the oscillation circuit 110 through the second switch 154 , and a negative input end of the first comparator 121 is configured to input a first reference signal; and a second comparator 122 , where a positive input end of the second comparator 122 is connected to the positive output end of the oscillation circuit 110 through the third switch 155 , and connected to the negative output end of the oscillation circuit 110 through the fourth switch 156 , and a negative input end of the second comparator 122 is configured to input a second reference signal.\",\n \"According to the amplitude limiting oscillation circuit of the embodiments of the present disclosure, a switching circuit is used, and an adjustable range may be expanded.\",\n \"In some possible implementation manners, the low pass filtering circuit 130 includes: a first low pass filter, including a first resistor 131 and a second capacitor 132 , where an input end of the first low pass filter is connected to an output end of the first comparator 121 , and an output end of the first low pass filter is connected to a gate electrode of a fifth MOS transistor 141 ; and a second low pass filter, including a second resistor 133 and a third capacitor 134 , where an input end of the second low pass filter is connected to an output end of the second comparator 122 , and an output end of the second low pass filter is connected to a gate electrode of a sixth MOS transistor 142 ; and the voltage controlled resistance circuit 140 includes: the fifth MOS transistor 141 , where a source electrode of the fifth MOS transistor 141 is connected to a power supply, and a drain electrode of the fifth MOS transistor 141 is connected to a source electrode of the first MOS transistor 113 and a source electrode of the second MOS transistor 114 ; and the sixth MOS transistor 142 , where a source electrode of the sixth MOS transistor 142 is connected to ground, and a drain electrode of the sixth MOS transistor 142 is connected to a source electrode of the third MOS transistor 115 and a source electrode of the fourth MOS transistor 116 .\",\n \"Amplitude control of the amplitude limiting oscillation circuit of the embodiments of the present disclosure is mainly based on source electrode feedback; therefore, the manner of the amplitude control does not have a problem of stability, that is, the stability of the amplitude limiting oscillation circuit of the embodiments of the present disclosure is better.\",\n \"According to a second aspect, a chip is provided, and the chip includes the amplitude limiting oscillation circuit of the first aspect or the amplitude limiting oscillation circuit of any one of possible implementation manners of the first aspect.\"\n ],\n [\n \"CROSS REFERENCE TO RELATED APPLICATIONS The present application is a continuation of international application No.\",\n \"PCT/CN2016/103225, filed on Oct. 25, 2016, which is hereby incorporated by reference in its entirety.\",\n \"TECHNICAL FIELD The present disclosure relates to the field of information technologies, and in particular, to an amplitude limiting oscillation circuit.\",\n \"BACKGROUND If no amplitude limitation is performed on a common LC oscillation circuit, an amplitude of the oscillation circuit would eventually stabilize to a power supply voltage, and such oscillation circuit has several disadvantages as follows: 1.distortion of an oscillation waveform of the oscillation circuit occurs, and a rising edge and a falling edge thereof are dissymmetrical, such that a 1/f3 noise inflection point of the oscillation circuit moves to a high frequency, resulting in worse low frequency phase noise; and 2.a large oscillation amplitude causes a very large current through an inductor, such that a magnetic core of the inductor is saturated, resulting in a change of an inductance value, ultimately affecting stability of a frequency.\",\n \"Usually, an approach of limiting amplitude is to detect an oscillation amplitude by using an amplitude detection circuit or a peak detection circuit, and then output a control voltage to control a bias current of an oscillation circuit, so as to achieve an effect of limiting the amplitude of the oscillation circuit.\",\n \"However, the approach also has several disadvantages as follows: 1.a loop gain of such approach is larger, easily resulting in instability of a control loop; 2.the control loop per se may introduce greater noise, resulting in worse phase noise of the oscillation circuit; and 3.most of the amplitude detection circuits cannot accurately control the oscillation amplitude, thereby limiting its utility.\",\n \"Therefore, it becomes a technical problem to be solved urgently to improve performance of an amplitude limiting oscillation circuit.\",\n \"SUMMARY Embodiments of the present disclosure provide an amplitude limiting oscillation circuit, and performance of the amplitude limiting oscillation circuit may be improved.\",\n \"According to a first aspect, an amplitude limiting oscillation circuit is provided, including: an oscillation circuit 110, configured to generate an oscillation signal; a pulse width modulation circuit 120, configured to generate a pulse width modulation signal according to an amplitude of the oscillation signal; a low pass filtering circuit 130, configured to convert the pulse width modulation signal into a direct current control voltage signal, where the direct current control voltage signal is configured to control a voltage controlled resistance circuit 140; and the voltage controlled resistance circuit 140, configured to change a resistance value of the voltage controlled resistance circuit 140 under control of the direct current control voltage signal, to control the amplitude of the oscillation signal.\",\n \"According to the amplitude limiting oscillation circuit of the embodiments of the present disclosure, negative feedback is performed by using a voltage controlled resistance circuit, and a control loop may not introduce extra noise; therefore, phase noise of the amplitude limiting oscillation circuit is lower, and performance of the amplitude limiting oscillation circuit is improved.\",\n \"In some possible implementation manners, the oscillation circuit 110 is an LC oscillation circuit, a crystal oscillation circuit or a relaxation oscillation circuit.\",\n \"In some possible implementation manners, the pulse width modulation circuit 120 includes a comparator, configured to generate the pulse width modulation signal by comparing an amplitude of a reference signal with the amplitude of the oscillation signal.\",\n \"When the comparator is used, the amplitude of the amplitude limiting oscillation circuit depends on a reference voltage of the comparator, that is, a final amplitude range of the amplitude limiting oscillation circuit is very close to the reference voltage of the comparator; therefore, it is easy to control the oscillation amplitude of the amplitude limiting oscillation circuit of the embodiments of the present disclosure.\",\n \"In some possible implementation manners, the low pass filtering circuit 130 is a passive filter or an active filter.\",\n \"In some possible implementation manners, resistance of the voltage controlled resistance circuit 140 is linear resistance or nonlinear resistance that operates in a linear region.\",\n \"In some possible implementation manners, the voltage controlled resistance circuit 140 includes a metal oxide semiconductor field effect transistor MOS.\",\n \"In some possible implementation manners, the oscillation circuit 110 includes a positive output end and a negative output end.\",\n \"In some possible implementation manners, the oscillation circuit 110 includes: an inductor 111, and a first capacitor 112, where the inductor 111 and the first capacitor 112 form a resonant circuit; and a first MOS transistor 113, a second MOS transistor 114, a third MOS transistor 115, and a fourth MOS transistor 116, where the first MOS transistor 113, the second MOS transistor 114, the third MOS transistor 115, and the fourth MOS transistor 116 provide negative resistance for the resonant circuit, a drain electrode of the first MOS transistor 113 and a gate electrode of the second MOS transistor 114 form a positive output end of the oscillation circuit 110, and a gate electrode of the third MOS transistor 115 and a drain electrode of the fourth MOS transistor 116 form a negative output end of the oscillation circuit 110.In some possible implementation manners, the pulse width modulation circuit 120 includes: a first comparator 121, where a positive input end of the first comparator 121 is connected to the positive output end of the oscillation circuit 110, and a negative input end of the first comparator 121 is configured to input a first reference signal; and a second comparator 122, where a positive input end of the second comparator 122 is connected to the negative output end of the oscillation circuit 110, and a negative input end of the second comparator 122 is configured to input a second reference signal.\",\n \"In some possible implementation manners, the amplitude limiting oscillation circuit further includes: a switching circuit 150, configured to switch a connection between the positive input end or the negative output end and the pulse width modulation circuit 120.In some possible implementation manners, the switching circuit 150 includes: a third comparator 151, an inverter 152, a first switch 153, a second switch 154, a third switch 155 and a fourth switch 156; where a positive input end of the third comparator 151 is connected to the positive output end of the oscillation circuit 110, a negative input end of the third comparator 151 is connected to the negative output end of the oscillation circuit 110, an input end of the inverter 152 is connected to an output end of the third comparator 151, an output signal of the third comparator 151 is used to control the first switch 153 and the fourth switch 156, and an output signal of the inverter 152 is used to control the second switch 154 and the third switch 155.In some possible implementation manners, the pulse width modulation circuit 120 includes: a first comparator 121, where a positive input end of the first comparator 121 is connected to the positive output end of the oscillation circuit 110 through the first switch 153, and connected to the negative output end of the oscillation circuit 110 through the second switch 154, and a negative input end of the first comparator 121 is configured to input a first reference signal; and a second comparator 122, where a positive input end of the second comparator 122 is connected to the positive output end of the oscillation circuit 110 through the third switch 155, and connected to the negative output end of the oscillation circuit 110 through the fourth switch 156, and a negative input end of the second comparator 122 is configured to input a second reference signal.\",\n \"According to the amplitude limiting oscillation circuit of the embodiments of the present disclosure, a switching circuit is used, and an adjustable range may be expanded.\",\n \"In some possible implementation manners, the low pass filtering circuit 130 includes: a first low pass filter, including a first resistor 131 and a second capacitor 132, where an input end of the first low pass filter is connected to an output end of the first comparator 121, and an output end of the first low pass filter is connected to a gate electrode of a fifth MOS transistor 141; and a second low pass filter, including a second resistor 133 and a third capacitor 134, where an input end of the second low pass filter is connected to an output end of the second comparator 122, and an output end of the second low pass filter is connected to a gate electrode of a sixth MOS transistor 142; and the voltage controlled resistance circuit 140 includes: the fifth MOS transistor 141, where a source electrode of the fifth MOS transistor 141 is connected to a power supply, and a drain electrode of the fifth MOS transistor 141 is connected to a source electrode of the first MOS transistor 113 and a source electrode of the second MOS transistor 114; and the sixth MOS transistor 142, where a source electrode of the sixth MOS transistor 142 is connected to ground, and a drain electrode of the sixth MOS transistor 142 is connected to a source electrode of the third MOS transistor 115 and a source electrode of the fourth MOS transistor 116.Amplitude control of the amplitude limiting oscillation circuit of the embodiments of the present disclosure is mainly based on source electrode feedback; therefore, the manner of the amplitude control does not have a problem of stability, that is, the stability of the amplitude limiting oscillation circuit of the embodiments of the present disclosure is better.\",\n \"According to a second aspect, a chip is provided, and the chip includes the amplitude limiting oscillation circuit of the first aspect or the amplitude limiting oscillation circuit of any one of possible implementation manners of the first aspect.\",\n \"BRIEF DESCRIPTION OF DRAWINGS To illustrate a technical solution of embodiments of the present disclosure more clearly, the accompanying drawings which are needed in the embodiments of the present disclosure are introduced briefly below.\",\n \"Apparently, the accompanying drawings described below are merely some of the embodiments of the present disclosure, based on which other drawings can be obtained by persons of ordinary skill in the art without any creative effort.\",\n \"FIG.\",\n \"1 is a schematic diagram of an amplitude limiting oscillation circuit according to an embodiment of the present disclosure.\",\n \"FIG.\",\n \"2 is a schematic diagram of an amplitude limiting oscillation circuit according to another embodiment of the present disclosure.\",\n \"FIG.\",\n \"3 is a schematic diagram of an amplitude limiting oscillation circuit according to a further embodiment of the present disclosure.\",\n \"FIG.\",\n \"4 is a schematic diagram of an amplitude limiting oscillation circuit according to still another embodiment of the present disclosure.\",\n \"DESCRIPTION OF EMBODIMENTS The technical solution in the embodiments of the present disclosure will be described clearly and fully below in conjunction with the drawings in the embodiments of the present disclosure, and apparently, the embodiments described are only part of embodiments of the present disclosure, not all of them.\",\n \"All of the other embodiments, obtained by those of ordinary skill in the art based on the embodiments of the present disclosure without any creative effort, fall into the protection scope of the present disclosure.\",\n \"FIG.\",\n \"1 illustrates a schematic diagram of an amplitude limiting oscillation circuit 100 according to an embodiment of the present disclosure.\",\n \"As shown in FIG.\",\n \"1, the amplitude limiting oscillation circuit 110 may include an oscillation circuit 110, a pulse width modulation circuit 120, a low pass filtering circuit 130, and a voltage controlled resistance circuit 140.The oscillation circuit 110 is configured to generate an oscillation signal.\",\n \"The oscillation circuit 110 may be any type of oscillation circuit, such as LC oscillation circuit, crystal oscillation circuit or relaxation oscillation circuit, and the present disclosure does not limit the type of the oscillation circuit 110.Optionally, the oscillation circuit 110 may output two oscillation signals.\",\n \"Phases of the two oscillation signals are opposite.\",\n \"That is, the oscillation circuit 110 may have a positive output end and a negative output end, and the positive output end and the negative output end output oscillation signals with opposite phases, respectively.\",\n \"The pulse width modulation circuit 120 is configured to generate a pulse width modulation signal according to an amplitude of an oscillation signal.\",\n \"Optionally, the pulse width modulation circuit 120 may include a comparator, and the comparator generates the pulse width modulation signal by comparing an amplitude of a reference signal with the amplitude of the oscillation signal.\",\n \"For example, if the amplitude of the oscillation signal is larger than the amplitude of the reference signal, a high level signal is generated; and if the amplitude of the oscillation signal is lower than the amplitude of the reference signal, a low level signal is generated.\",\n \"It should be understood that, the pulse width modulation circuit 120 may also be implemented by another circuit, and the present disclosure does not limit that the pulse width modulation circuit 120 is implemented only by a comparator.\",\n \"The low pass filtering circuit 130 is configured to convert the pulse width modulation signal into a direct current control voltage signal, where the direct current control voltage signal is configured to control the voltage controlled resistance circuit 140.The pulse width modulation signal generated by the pulse width modulation circuit 120 is input into the low pass filtering circuit 130, and is converted into the direct current control voltage signal by the low pass filtering circuit 130; and the direct current control voltage signal is input into a voltage controlled end of the voltage controlled resistance circuit 140, so as to control a change of a resistance value of the voltage controlled resistance circuit 140.Optionally, the low pass filtering circuit 130 may be a passive filter or an active filter, and the present disclosure is not limited hereto.\",\n \"The voltage controlled resistance circuit 140 is configured to change the resistance value of the voltage controlled resistance circuit 140 under control of the direct current control voltage signal, to control the amplitude of the oscillation signal.\",\n \"The resistance value of the voltage controlled resistance circuit 140 is changed under the control of the direct current control voltage signal.\",\n \"Optionally, resistance of the voltage controlled resistance circuit 140 may be linear resistance or nonlinear resistance that operates in a linear region.\",\n \"Optionally, the voltage controlled resistance circuit 140 may include metal oxide semiconductor field effect transistor (Metal-Oxide-Semiconductor, MOS).\",\n \"That is, a voltage controlled resistor may be an MOS transistor, but the present disclosure is not limited hereto, and another voltage controlled resistor may also be used.\",\n \"FIG.\",\n \"2 illustrates a schematic diagram of a specific implementation manner of an amplitude limiting oscillation circuit 100 according to an embodiment of the present disclosure.\",\n \"It should be understood that, FIG.\",\n \"2 is only an example, which does not limit the scope of the embodiment of the present disclosure.\",\n \"As shown in FIG.\",\n \"2, the oscillation circuit 110 in FIG.\",\n \"1 may be implemented by an inductor, a capacitor and an MOS transistor.\",\n \"Particularly, the oscillation circuit 110 may include an inductor 111, a first capacitor 112, a first MOS transistor 113, a second MOS transistor 114, a third MOS transistor 115, and a fourth MOS transistor 116.The inductor 111 and the first capacitor 112 form a resonant circuit.\",\n \"The first MOS transistor 113, the second MOS transistor 114, the third MOS transistor 115 and the fourth MOS transistor 116 provide negative resistance for the resonant circuit.\",\n \"A drain electrode of the first MOS transistor 113 and a gate electrode of the second MOS transistor 114 form a positive output end of the oscillation circuit 110, and the positive output end outputs an oscillation signal Vop; and a gate electrode of the third MOS transistor 115 and a drain electrode of the fourth MOS transistor 116 form a negative output end of the oscillation circuit 110, and the negative output end outputs an oscillation signal Von.\",\n \"Optionally, when the oscillation circuit 110 includes the positive output end and the negative output end, a pulse width modulation circuit 120 may be implemented by two comparators.\",\n \"Particularly, the pulse width modulation circuit 120 may include a first comparator 121 and a second comparator 122.A positive input end of the first comparator 121 is connected to the positive output end of the oscillation circuit 110, that is, the oscillation signal Vop may be input into the positive input end of the first comparator 121; and a negative input end of the first comparator 121 is configured to input a first reference signal Vrp.\",\n \"A positive input end of the second comparator 122 is connected to the negative output end of the oscillation circuit 110, that is, the oscillation signal Von may be input into positive input end of the second comparator 122; and a negative input end of the second comparator 122 is configured to input a second reference signal Vrn.\",\n \"Optionally, Vrp and Vrn may be adjustable direct current voltage signals.\",\n \"Optionally, Vdd>Vrp>Vrn>Vgd, where Vdd is a voltage of a power supply, and Vgd is a voltage of a ground end.\",\n \"The first comparator 121 compares Vop with Vrp, and outputs a positive pulse width modulation signal Vp1; and The second comparator 122 compares Von with Vrn, and outputs a negative pulse width modulation signal Vp2.Optionally, when the pulse width modulation circuit 120 includes two comparators, the low pass filtering circuit 130 may be implemented by two low pass filters.\",\n \"Particularly, the low pass filtering circuit 130 may include a first low pass filter and a second low pass filter.\",\n \"As shown in FIG.\",\n \"2, the first low pass filter may include a first resistor 131 and a second capacitor 132, where an input end of the first low pass filter is connected to an output end of the first comparator 121, and an output end of the first low pass filter is connected to a gate electrode of a fifth MOS transistor 141.An input of the first low pass filter is Vp1, and the first low pass filter outputs a direct current control voltage signal Vp2 to the gate electrode of the fifth MOS transistor 141.The second low pass filter may include a second resistor 133 and a third capacitor 134, where an input end of the second low pass filter is connected to an output end of the second comparator 122, and an output end of the second low pass filter is connected to a gate electrode of a sixth MOS transistor 142.An input of the second low pass filter is Vn1, and the second low pass filter outputs a direct current control voltage signal Vn2 to the gate electrode of the sixth MOS transistor 142.Correspondingly, the voltage controlled resistance circuit 140 also includes two parts.\",\n \"As shown in FIG.\",\n \"2, the voltage controlled resistance circuit 140 may include: the fifth MOS transistor 141, where a source electrode of the fifth MOS transistor 141 is connected to the power supply Vdd, and a drain electrode of the fifth MOS transistor 141 is connected to a source electrode of the first MOS transistor 113 and a source electrode of the second MOS transistor 114; and the sixth MOS transistor 142, where a source electrode of the sixth MOS transistor 142 is connected to ground Vgd, and a drain electrode of the sixth MOS transistor 142 is connected to a source electrode of the third MOS transistor 115 and a source electrode of the fourth MOS transistor 116.The gate electrode of the fifth MOS transistor 141 and the gate electrode of the sixth MOS 142 are voltage controlled ends of the voltage controlled resistance circuit 140.An upper loop in FIG.\",\n \"2 may be called as a P-type feedback loop; and a lower loop in FIG.\",\n \"2 may be called as an N-type feedback loop.\",\n \"The P-type feedback loop and the N-type feedback loop are completely symmetrical, and working principles of the two are similar.\",\n \"Taking the P-type feedback loop as an example, when the oscillation circuit starts oscillating, an amplitude of Vop gets larger gradually, and when the amplitude is larger than Vrp, the comparator 121 outputs a high pulse; since Vop is a sine wave signal, the larger the amplitude of Vop is, the wider the width of the high pulse output by the comparator 121 is.\",\n \"A direct current voltage Vp2, that is proportional to the width of the pulse, is obtained after the pulse is passed through a low pass filter.\",\n \"If Vp2 is higher, equivalent resistance of the fifth MOS transistor 141 is greater.\",\n \"That is, if the amplitude of the oscillation circuit becomes larger, the width of the pulse becomes wider, Vp2 increases, the resistance of the fifth MOS transistor 141 increases, negative resistance of the first MOS transistor 113 and the second MOS transistor 114 reduces due to an effect of source electrode negative feedback, and thus the output amplitude begins to decrease.\",\n \"Similarly, an operating principle of the N-type feedback loop may be known.\",\n \"Optionally, as shown in FIG.\",\n \"3, an amplitude limiting oscillation circuit 100 may further include: a switching circuit 150, configured to switch a connection between a positive input end or a negative output end and a pulse width modulation circuit 120.When an oscillation circuit 110 includes the positive output end and the negative output end, a connection between the positive output end or the negative output end and different input ends of the pulse width modulation circuit 120 may be switched through the switching circuit 150.Optionally, as shown in FIG.\",\n \"4, a switching circuit 150 may include: a third comparator 151, an inverter 152, a first switch 153, a second switch 154, a third switch 155 and a fourth switch 156.A positive input end of the third comparator 151 is connected to a positive output end of an oscillation circuit 110, a negative input end of the third comparator 151 is connected to a negative output end of the oscillation circuit 110, an input end of the inverter 152 is connected to an output end of the third comparator 151, an output signal Vsp of the third comparator 151 is used to control the first switch 153 and the fourth switch 156, and an output signal Vsn of the inverter 152 is used to control the second switch 154 and the third switch 155.In this case, optionally, a pulse width modulation circuit 120 may include: a first comparator 121, where a positive input end of the first comparator 121 is connected to the positive output end of the oscillation circuit 110 through the first switch 153, and connected to the negative output end of the oscillation circuit 110 through the second switch 154, and a negative input end of the first comparator 121 is configured to input a first reference signal Vrp; and a second comparator 122, where a positive input end of the second comparator 122 is connected to the positive output end of the oscillation circuit 110 through the third switch 155, and connected to the negative output end of the oscillation circuit 110 through the fourth switch 156, and a negative input end of the second comparator 122 is configured to input a second reference signal Vrn.\",\n \"When Vop is greater than Von, Vsp is a high level, the first switch 153 and the fourth switch 156 are switched on, and the second switch 154 and the third switch 155 are switched off; the first comparator 121 compares Vop with Vrp to outputs Vp1; and the second comparator 122 compares Von with Vrn to outputs Vn1; and Vsp is a low level and Vsn is a high level, the second switch 154 and the third switch 155 are switched on, and the first switch 153 and the fourth switch 156 are switched off; the first comparator 121 compares Von with Vrp to outputs Vp1; and the second comparator 122 compares Vop with Vrn to outputs Vn1.Therefore, whether Vop is greater than Von, or Vop is less than Von, the first comparator 121 may output Vp1, and the second comparator 122 may output Vn1; that is, ranges of duty cycle of Vp1 and Vn1 may both be changed to 0˜100%.\",\n \"The parts oscillation circuit, the low pass filtering circuit and the voltage controlled resistance circuit in the FIG.\",\n \"4 are similar to that in FIG.\",\n \"2; and for concision, they will not be described redundantly herein.\",\n \"An operating principle of the amplitude limiting oscillation circuit in FIG.\",\n \"4 is similar to that in FIG.\",\n \"2, and the difference lies in that the adjustable range is expanded since a switching circuit is used in FIG.\",\n \"4.Taking the P-type feedback loop as an example, in FIG.\",\n \"2, a range of duty cycle of Vp1 is 0˜50%, a voltage range of Vp2 after filtering is 0˜0.5Vdd, and the adjustable range is relatively narrow.\",\n \"However, in FIG.\",\n \"4, the range of duty cycle of Vp1 is changed to 0˜100%, thereby widening the adjustable range.\",\n \"According to an amplitude limiting oscillation circuit of the embodiments of the present disclosure, negative feedback is performed by using a voltage controlled resistance circuit, and a control loop may not introduce extra noise; therefore, phase noise of the amplitude limiting oscillation circuit is lower.\",\n \"Further, amplitude control of the amplitude limiting oscillation circuit of the embodiments of the present disclosure is mainly based on source electrode feedback; therefore, the manner of the amplitude control does not have a problem of stability, that is, the stability of the amplitude limiting oscillation circuit of the embodiments of the present disclosure is better.\",\n \"In addition, when a comparator is used, amplitude of the amplitude limiting oscillation circuit depends on a reference voltage of the comparator, that is, a final amplitude range of the amplitude limiting oscillation circuit is very close to the reference voltage of the comparator; therefore, it is easy to control the oscillation amplitude of the amplitude limiting oscillation circuit of the embodiments of the present disclosure.\",\n \"Therefore, with the technical solution of the embodiments of the present disclosure, performance of an amplitude limiting oscillation circuit may be improved.\",\n \"Another embodiment of the present disclosure further provides a chip, and the chip may include the amplitude limiting oscillation circuit of the foregoing embodiments of the present disclosure.\",\n \"It should be understood that, the specific examples in this text is for helping those skilled in the art to better understand the embodiments of the present disclosure, rather than limiting the scope of the embodiments of the present disclosure.\",\n \"Those of ordinary skill in the art may realize that, units and algorithm steps in conjunction with the various examples described by the embodiments disclosed herein can be realized by electronic hardware, computer software or the combination thereof, and in order to clearly describe the interchangeability of hardware and software, the compositions and steps of the various examples are generally described according to functions in the foregoing description.\",\n \"Whether these functions are executed in hardware or software mode depends on the specific applications and design constraint conditions of the technical solution.\",\n \"Those skilled may implement the described functions by using different methods for each specific application, but this implementation should not be considered to be beyond the scope of the present disclosure.\",\n \"In the several embodiments provided in the present application, it should be understood that, the disclosed system, apparatus and method may be implemented in other manners.\",\n \"For example, the apparatus embodiments described above are merely exemplary, e.g., the division of the units is merely a logic function division, other division manners may exist in practical implementation, for example, a plurality of units or components may be combined or integrated to another system, or some features may be omitted or not implemented.\",\n \"In addition, the displayed or discussed mutual coupling or direct coupling or communication connection may be indirect coupling or communication connection via some interfaces, apparatuses or units, and may also be in electrical, mechanical or other forms.\",\n \"The units described as separate parts may be or may not be separated physically, and a component displayed as a unit may be or may not be a physical unit, namely, may be located in one place, or may be distributed on a plurality of network units.\",\n \"A part of or all of the units may be selected to achieve the purposes of the solution in the embodiments of the present disclosure according to actual demands.\",\n \"In addition, the respective functional units in the respective embodiments of the present disclosure may be integrated in one processing unit, or the respective units singly exist physically, or two or more units are integrated in one unit.\",\n \"The foregoing integrated unit may be implemented in the form of hardware, or be implemented in a form of a software functional unit.\",\n \"If the integrated unit is implemented in the form of the software functional unit and is sold or used as an independent product, it may be stored in a computer readable storage medium.\",\n \"Based on such understanding, the technical solution of the present disclosure substantially, or the part of the present disclosure making contribution to the prior art, or all of or part of the technical solution may be embodied in the form of a software product, and the computer software product is stored in a storage medium, which includes multiple instructions enabling computer equipment (which may be a personal computer, a server, network equipment or the like) to execute all of or part of the steps in the methods of the embodiments of the present disclosure.\",\n \"The foregoing storage medium includes a variety of media capable of storing program codes, such as a USB disk, a mobile hard disk, a read-only memory (ROM, Read-Only Memory), a random access memory (RAM, Random Access Memory), a magnetic disk, an optical disk or the like.\",\n \"Described above is the specific embodiments of the present disclosure only, but the protection scope of the present disclosure is not limited to this, any skilled one who is familiar with this art could readily think of various equivalent modifications or substitutions within the disclosed technical scope of the present disclosure, and these modifications or substitutions shall fall within the protection scope of the present disclosure.\",\n \"Therefore, the protection scope of the present disclosure shall be defined by the claims.\"\n ]\n]"},"source":{"kind":"string","value":"Patent_15871427"}}},{"rowIdx":4493791,"cells":{"text":{"kind":"list like","value":[["Tissue Adjustment Implant","Tissue adjustment implants useful for adjusting a position of tissue in a patient are described.","In an embodiment, a tissue adjustment implant includes a main body having a series of outwardly-extending projections.","The tissue adjustment implants can be used in a variety of treatments, such as in the treatment of Obstructive Sleep Apnea and snoring."],["1.A tissue adjustment implant, comprising: a main body extending along a lengthwise axis and having first and second opposing ends, first and second opposing sides, first and second opposing surfaces, and a first width extending from the first side to the second side orthogonally to the longitudinal axis and through the longitudinal midpoint; a first anchor portion disposed on the first end, the first anchor portion having a second width extending orthogonally to the longitudinal axis, the second width being greater than the first width; and a series of projections disposed on the first side, each projection of the series of projections extending away from the second end and the longitudinal axis of the main body.","2.The tissue adjustment implant of claim 1, further comprising a throat portion that transitions from the first width to the second width.","3.The tissue adjustment implant of claim 1, wherein the second side contains no projections.","4.The tissue adjustment implant of claim 1, wherein the first anchor portion defines an arrowhead having a first arrowhead side oriented at an angle to a second arrowhead side.","5.The tissue adjustment implant of claim 4, wherein the angle is an acute angle.","6.The tissue adjustment implant of claim 4, wherein the acute angle comprises an angle between about 35 degrees and about 90 degrees.","7.The tissue adjustment implant of claim 4, wherein the acute angle comprises an angle between about 45 degrees and about 90 degrees.","8.The tissue adjustment implant of claim 4, wherein the acute angle comprises an angle of about 45 degrees.","9.The tissue adjustment implant of claim 4, wherein the acute angle comprises an angle of 45 degrees.","10.The tissue adjustment implant of claim 4, wherein the angle is an obtuse angle.","11.The tissue adjustment implant of claim 4, wherein the angle is a right angle.","12.The tissue adjustment implant of claim 4, wherein the arrowhead defines a terminal point; and wherein the terminal point comprises a rounded point.","13.The tissue adjustment implant of claim 1, wherein at least one projection of the series of projections comprises a wing-shaped member having a base and an end, the base having a base width that extends parallel to the longitudinal axis of the main body and the end having an end width that extends parallel to the longitudinal axis of the main body; and wherein the base width is greater than the end width.","14.The tissue adjustment implant of claim 1, wherein each projection of the series of projections comprises a wing-shaped member having a base and an end, the base having a base width that extends parallel to the longitudinal axis of the main body and the end having an end width that extends parallel to the longitudinal axis of the main body and that is less than the base width.","15.The tissue adjustment implant of claim 1, wherein said issue adjustment implant comprises a bioremodelable material.","16.The tissue adjustment implant of claim 15, wherein the bioremodelable material comprises an extracellular matrix (ECM) material.","17.The tissue adjustment implant of claim 16, wherein the extracellular matrix material comprises small intestine submucosa (SIS).","18.The tissue adjustment implant of claim 1, wherein said tissue adjustment implant comprises an integral, multi-laminate construct comprising layers of small intestine submucosa (SIS).","19.A tissue adjustment implant, comprising: a main body extending along a lengthwise axis and having first and second opposing ends, first and second opposing sides, first and second opposing surfaces, and a first width extending from the first side to the second side orthogonally to the longitudinal axis and through the longitudinal midpoint; a first anchor portion disposed on the first end, the first anchor portion defining an arrowhead having a first arrowhead side oriented at an angle to a second arrowhead side and having a second width extending orthogonally to the longitudinal axis; a throat portion that transitions from the first width to the second width; and a series of projections disposed on the first side, each projection of the series of projections extending away from the second end and the longitudinal axis of the main body.","20.A tissue adjustment implant, comprising: a main body extending along a lengthwise axis and having first and second opposing ends, first and second opposing sides, first and second opposing surfaces, and a first width extending from the first side to the second side orthogonally to the longitudinal axis and through the longitudinal midpoint; a first anchor portion disposed on the first end, the first anchor portion defining an arrowhead having a first arrowhead side oriented at an acute angle to a second arrowhead side and having a second width extending orthogonally to the longitudinal axis; a throat portion that transitions from the first width to the second width; and a series of projections disposed only on the first side, each projection of the series of projections extending away from the second end and the longitudinal axis of the main body and comprising a wing-shaped member having a base and an end, the base having a base width that extends parallel to the longitudinal axis of the main body and the end having an end width that extends parallel to the longitudinal axis of the main body and that is less than the base width."],[" BACKGROUND It is sometimes necessary or desirable to secure a tissue or portion of a tissue within the body of an animal, such as a human, in a manner that temporarily or permanently adjusts a position or orientation of the tissue or portion of a tissue.","For example, in the treatment of Obstructive Sleep Apnea (OSA), it may be desirable to adjust the position of one or more tissues or portions of tissue, such as the soft palate.","OSA is a clinical disorder in which a partial or complete collapse of soft tissue occurs in the airway during sleep.","This leads to a blockage of the airway and impaired breathing during sleep.","Mild OSA can lead to fatigue, reduced alertness following sleep, and a general reduction in productivity for the affected individual.","Severe OSA can lead to sleep deprivation, hypoxemia, and depression.","The art provides various options for the treatment of OSA.","Continuous Positive Airway Pressure (CPAP) machines, which supply positive air pressure through a facemask and into the airway during sleep, are used most frequently.","The positive air pressure maintains an open airway to prevent apnea and snoring.","While these machines are generally considered effective, they are bulky, noisy, and cumbersome to use.","Furthermore, use of these machines can be socially awkward for some individuals.","Oral appliances that force the jaw forward to maintain an open airway can also be used.","These devices are generally considered to be not as effective as CPAP machines, and can be uncomfortable to use.","Furthermore, these devices are frequently ejected from the mouth during sleep, reducing their effectiveness over the entire course of a sleeping period.","Invasive surgical procedures can also be used to treat OSA.","Various techniques have been described, including uvulopalatopharyngoplasty (UPPP), maxillomandibular advancement (MMA), and even tracheostomy.","Surgical procedures are generally considered to have limited and potentially short-lived effectiveness.","Furthermore, many of the procedures require hospitalization and the use of general anesthesia.","As a result, these procedures are generally reserved for severe cases of OSA.","The AIRvance™ System from Medtronic, formerly known as the Repose System, provides a surgical-based tongue suspension procedure that can be performed with or without an adjunct hyoid suspension procedure.","These suspension procedures require a surgical incision and dissection of the neck below the mandible.","Following implantation of one or more necessary bone screws, sutures are lashed around the tongue and/or hyoid bone and secured with surgical knots.","While these procedures offer less complicated solutions than the surgical procedures above, they still require surgical intervention and suffer from the drawbacks associated with surgical procedures.","Furthermore, over time, the sutures used to suspend the tongue and/or hyoid bone may weaken or even snap, which may limit the effectiveness of the treatment over time.","Lastly, the use of sutures in these procedures necessitates the use of specialized knotting and securement techniques to complete the procedure, which adds an additional opportunity for error and failure in the device and the procedure.","Considering the disadvantages of the various available treatment options described above, a need exists for improved devices for adjustment of tissue within the body.","Furthermore, a need exists for additional options, including implantable medical devices, for the treatment of OSA."],["RELATED APPLICATION This application is a continuation of U.S. patent application Ser.","No.","14/449,195, filed on Aug. 1, 2014 and which claims the benefit of U.S.","Provisional Application No.","61/861,089, filed on Aug. 1, 2013.The disclosure of each of these related applications is hereby incorporated into this disclosure in its entirety.","FIELD The disclosure relates generally to the field of implantable medical devices.","Particular embodiments relate to tissue adjustment implants.","BACKGROUND It is sometimes necessary or desirable to secure a tissue or portion of a tissue within the body of an animal, such as a human, in a manner that temporarily or permanently adjusts a position or orientation of the tissue or portion of a tissue.","For example, in the treatment of Obstructive Sleep Apnea (OSA), it may be desirable to adjust the position of one or more tissues or portions of tissue, such as the soft palate.","OSA is a clinical disorder in which a partial or complete collapse of soft tissue occurs in the airway during sleep.","This leads to a blockage of the airway and impaired breathing during sleep.","Mild OSA can lead to fatigue, reduced alertness following sleep, and a general reduction in productivity for the affected individual.","Severe OSA can lead to sleep deprivation, hypoxemia, and depression.","The art provides various options for the treatment of OSA.","Continuous Positive Airway Pressure (CPAP) machines, which supply positive air pressure through a facemask and into the airway during sleep, are used most frequently.","The positive air pressure maintains an open airway to prevent apnea and snoring.","While these machines are generally considered effective, they are bulky, noisy, and cumbersome to use.","Furthermore, use of these machines can be socially awkward for some individuals.","Oral appliances that force the jaw forward to maintain an open airway can also be used.","These devices are generally considered to be not as effective as CPAP machines, and can be uncomfortable to use.","Furthermore, these devices are frequently ejected from the mouth during sleep, reducing their effectiveness over the entire course of a sleeping period.","Invasive surgical procedures can also be used to treat OSA.","Various techniques have been described, including uvulopalatopharyngoplasty (UPPP), maxillomandibular advancement (MMA), and even tracheostomy.","Surgical procedures are generally considered to have limited and potentially short-lived effectiveness.","Furthermore, many of the procedures require hospitalization and the use of general anesthesia.","As a result, these procedures are generally reserved for severe cases of OSA.","The AIRvance™ System from Medtronic, formerly known as the Repose System, provides a surgical-based tongue suspension procedure that can be performed with or without an adjunct hyoid suspension procedure.","These suspension procedures require a surgical incision and dissection of the neck below the mandible.","Following implantation of one or more necessary bone screws, sutures are lashed around the tongue and/or hyoid bone and secured with surgical knots.","While these procedures offer less complicated solutions than the surgical procedures above, they still require surgical intervention and suffer from the drawbacks associated with surgical procedures.","Furthermore, over time, the sutures used to suspend the tongue and/or hyoid bone may weaken or even snap, which may limit the effectiveness of the treatment over time.","Lastly, the use of sutures in these procedures necessitates the use of specialized knotting and securement techniques to complete the procedure, which adds an additional opportunity for error and failure in the device and the procedure.","Considering the disadvantages of the various available treatment options described above, a need exists for improved devices for adjustment of tissue within the body.","Furthermore, a need exists for additional options, including implantable medical devices, for the treatment of OSA.","DESCRIPTION OF FIGURES FIG.","1 is a perspective view of an embodiment of a tissue adjustment implant.","FIG.","2 is a perspective view of another embodiment of a tissue adjustment implant.","FIG.","2A is a magnified view of area I indicated in FIG.","2.FIG.","3A is a perspective view of another embodiment of a tissue adjustment implant.","FIG.","3B is a perspective view of another embodiment of a tissue adjustment implant.","FIG.","3C is a perspective view of another embodiment of a tissue adjustment implant.","FIG.","3D is a perspective view of another embodiment of a tissue adjustment implant.","FIG.","3E is a perspective view of another embodiment of a tissue adjustment implant.","FIG.","3F is a perspective view of a projection member isolated from the implant illustrated in FIG.","3E.","FIG.","4A is a perspective view of another embodiment of a tissue adjustment implant.","FIG.","4B is a perspective view of another embodiment of a tissue adjustment implant.","FIG.","4C is a perspective view of another embodiment of a tissue adjustment implant.","FIG.","4D is a perspective view of another embodiment of a tissue adjustment implant.","FIG.","4E is a perspective view of another embodiment of a tissue adjustment implant.","FIG.","5 is a schematic of an oral cavity of a patient within which two tissue adjustment implants have been placed.","FIG.","6 is a top view of another embodiment of a tissue adjustment implant.","FIG.","6A is an elevation view of the tissue adjustment implant illustrated in FIG.","6.FIG.","6B is another elevation view of the tissue adjustment implant illustrated in FIG.","6.FIG.","7 is a top view of another embodiment of a tissue adjustment implant.","FIG.","8 is an elevation view of a delivery device for implanting a tissue adjustment implant.","FIG.","9 is a magnified view of area II illustrated in FIG.","8.FIG.","10 is a sectional view of the cannula of the delivery device illustrated in FIG.","9, taken along line 10-10.FIG.","11 is a sectional view of the cannula of the delivery device illustrated in FIG.","9, taken along line 11-11.FIG.","12 is a partial top view of the delivery device illustrated in FIG.","9.A tissue adjustment implant is loaded in the cannula of the delivery device.","FIG.","13 is a schematic of an oral cavity of a patient within which two tissue adjustment implants have been placed.","DESCRIPTION OF EMBODIMENTS The following detailed description and the appended drawings describe and illustrate various example embodiments.","The description and illustration of these examples are provided to enable one skilled in the art to make and use a tissue adjustment implant.","They are not intended to limit the scope of the claims in any manner.","FIG.","1 illustrates an example of a tissue adjustment implant 10.The tissue adjustment implant 10 has a main body 12 comprising a substantially flat member extending from a first end 14 to an opposing second end 16 and having first 18 and second 20 opposing sides.","The main body 12 has a first 22 or upper surface and an opposing second 24 or lower surface.","The main body 12 has a lengthwise axis 26 and a transverse axis 28 that orthogonally intersects the lengthwise axis 26 at a longitudinal midpoint 30 disposed on the lengthwise axis 26.A first anchor portion 32 extends along the lengthwise axis 26 of the main body 12 from a point on the lengthwise axis 26 between the longitudinal midpoint 30 and the first end 14 to the first end 14.Similarly, a second anchor portion 34 extends along the lengthwise axis 26 of the main body 12 from a point on the lengthwise axis 26 between the longitudinal midpoint 30 and the second end 16 to the second end 16.A middle portion 36 extends along the lengthwise axis 26 of the main body 12 across the longitudinal midpoint 30 from an end of the first anchor portion 32 to an end of the second anchor portion 34.The first anchor portion 32 defines a first series of projections 38.Similarly, the second anchor portion 34 defines a second series of projections 40.Each of the first 38 and second 40 series of projections includes a series of projections that extend outwardly from the respective side 18, 20 of the main body 12, away from the longitudinal axis 26.The middle portion 36 is free of outwardly extending projections.","As used herein, the term “projection” refers to an outwardly-directed member or portion of a member that extends away from a surface of another member or another portion of a member.","An individual projection can have any suitable shape, including regular and irregular shapes, symmetrical and asymmetrical shapes, and any other suitable shape.","The term “series of projections” refers to two or more individual projections.","A series of projections includes multiple projections having the same shape, size and or/configurations, a series of projections having different sizes, shapes and configurations, a series of projections spaced at regular intervals, such as a toothed surface, a series of projections spaced at different intervals, and a series of projections spaced at irregular intervals.","The illustrated embodiment includes a series of projections extending away from each side 18, 20 of the main body in each series of projections 38, 40.It is understood, though, that any suitable number of projections can extend away from each side 18, 20 of the main body 12 in a series of projections, including one projection, two projections, three projections, or more.","Indeed, the number of projections that extend away from a side 18, 20 in a series of projections need only be at least one projection.","Furthermore, it is noted that a series of projections can include one or more projections that extend away from only one of the sides 18, 20 of the main body 12 or away from both of the sides 18, 20 of the main body 12.In the illustrated embodiment, each projection 42 of the first series of projections 38 is substantially triangular in shape and extends away from the longitudinal axis 26 and away from the first end 14 of the main body 12 toward the transverse axis 28.Similarly, each projection 44 of the second series of projections 40 is substantially triangular in shape and extends away from the longitudinal axis 26 and away from the first end 14 of the main body 12 toward the transverse axis 28.In the illustrated embodiment, a projection 46 of the first series of projections 38 that is farthest from the longitudinal midpoint 30 has a side 48 that is continuous with the first end 14 of the main body 12.Similarly, a projection 50 of the second series of projections 40 that is farthest from the longitudinal midpoint 30 has a side 52 that is continuous with the second end 16 of the main body 12.Inclusion of the opposing series of projections 38, 40 is considered advantageous at least because each series 38, 40 provides an anchor at an end of the tissue adjustment implant 10 that is opposite an end of the implant that is first inserted into the tissue.","Once the tissue adjustment implant 10 is then passed through the tissue, the series of projections at the opposite end are able to engage the tissue and, upon the application of additional force on the tissue engaging implant, such as tension, the position of the tissue can be adjusted, such as by lifting or otherwise moving the tissue, as described more fully below.","As an example, described in greater detail below, the tissue adjustment implant can be used to engage and adjust the position of the soft palate of a patient, such as in the treatment of Obstructive Sleep Apnea.","In the illustrated embodiment, the first 22 and second 24 surfaces of the main body 12 are substantially flat.","It is noted, though, that it may be advantages to include one or more bumps, projections or other surface modifications on one or both of the surfaces 22, 24.Inclusion of such modifications may improve the handling of the tissue adjustment implant 10 during use.","FIGS.","2 and 2A illustrate another tissue adjustment implant 110.In this embodiment, the tissue adjustment implant 110 comprises a main body 112 comprising a substantially flat member extending from a first end 114 to an opposing second end 116 and having first 118 and second 120 opposing sides.","The main body 112 has a first 122 or upper surface and an opposing second 124 or lower surface.","The main body 112 has a lengthwise axis 126 and a transverse axis 128 that orthogonally intersects the lengthwise axis 126 at a longitudinal midpoint 130 disposed on the lengthwise axis 126.An anchor portion 136 extends along the lengthwise axis 126 of the main body 112 across the longitudinal midpoint 130.A first end portion 132 extends from an end of the first anchor portion 132 to the first end 114 of the main body 112.A second end portion 134 extends from the opposite end of the anchor portion 132 to the second end 116 of the main body 112.In this embodiment, the anchor portion 136 defines a first series of projections 138 and a second series of projections 140.Each of the first 138 and second 140 series of projections includes a series of projections that extend outwardly from the respective side 118, 120 of the main body 112, away from the longitudinal axis 126.The first 132 and second 134 end portions are free of outwardly extending projections.","As best illustrated in FIG.","2A, each projection 142 of the first 138 and second 140 series of projections is a wing-shaped member that extends radially outward from a side 120 of the main body 112.The wing-shaped member has a relatively wide base 160 that lies along a hypothetical extension of the side 120 and a relatively narrow end 162 that lies on hypothetical line that is parallel to the side 120.As best illustrated in FIG.","2, each projection 142 of the first 138 and second 140 series or projections extends away from the respective side 118, 120 and away from the first end 114 of the main body.","In the illustrated embodiment, as best illustrated in FIG.","2A, each projection 142 of the first 138 and second 140 series of projections extends away from the respective side 118, 120 of the main body at an angle such that an obtuse angle a is formed on the side of the projection 142 that is closest the first end 114 of the main body 112 and such that an acute angle β is formed on the side of the projection 142 that is closest the second end 116 of the main body 112.While any suitable configuration can be used for the projections 142, this configuration facilitates placement and anchoring.","In this embodiment, the main body 112 defines a series of openings 164 positioned along the lengthwise axis 126.Each opening of the series of openings 164 extends through the thickness of the main body 112 from the first surface 122 to the second surface 124.As such, each opening defines a passageway that extends through the main body 112.In this embodiment, as best illustrated in FIG.","2, the series of openings 164 extends along the entire anchor portion 136 of the main body 112.It is noted that any opening in the series of openings 164 can have one or more dimensions that differ from the same dimension or dimensions of another opening in the series of openings 164 while also have one or more dimension that is the same or substantially similar to the same dimension or dimensions of the other openings of the series of openings 164.For example, each opening of the series of openings 164 may have a rectangular shape, with one or more opening having a length and width that differ from the length and width of one or more other rectangular-shaped openings.","Also, while the illustrated embodiment includes a series of openings 164, it is noted that any suitable number of openings can be included in a tissue adjustment implant according to a particular embodiment, including zero, one, two, three, or any other suitable number of openings.","Inclusion of one or more openings facilitates anchoring of a tissue adjustment implant following implantation.","In this embodiment, a lead 170 is attached to the first end 114 of the main body.","The lead 170 provides a leading structure that can be used to form an opening in and/or introduce the tissue adjustment implant into tissue.","As such, the lead 170 advantageously includes a portion that can cut into tissue.","For example, in the illustrated embodiment, the lead 170 comprises a needle 172 secured to a suture 174 that is attached to the main body 112 near the first end 114.It is noted, though, that any suitable lead structure can be used, including a cutting edge or point that is disposed in the first end of a main body of tissue adjustment implant.","In this embodiment, a plug 180 is disposed on the second end 116 of the main body 112.The plug 180 has a width 182 that is greater than a width 184 of the main body 112 measured from one side 118 to the other 120.In the illustrated embodiment, the plug 180 is a separate member that has been attached to the main body, such as by an adhesive or through mechanical attachment.","It is noted, though, that in other embodiments the plug can be integrally formed with the main body.","Inclusion of a plug on an end of the main body facilitates implantation of a tissue adjustment implant because it provides a mechanical stop that impedes further passage of the tissue adjustment implant into the tissue once the plug has reached the point of entry into the tissue, such as an opening through which the remainder of the tissue adjustment implant has been passed.","Also, by providing a mechanical stop that impedes further passage of the tissue adjustment implant, the inclusion of a plug facilitates the adjustment function of the tissue adjustment implant.","For example, once the plug has reached the point of entry into the tissue, a continued pulling on the tissue adjustment implant, such as a continued pulling on lead attached to the first end of the main body or on the first end of the main body itself, will produce a pulling force on the tissue surrounding the plug at the point of entry.","This can be used to lift, move or otherwise adjust the position of the tissue within the body through the application of a simple pulling force on the tissue adjustment implant.","Each of FIGS.","3A, 3B, 3C, 3D, and 3E illustrates a tissue adjustment implant that includes an alternative structure for a series of projections.","FIG.","3A illustrates a tissue adjustment implant 210 that includes a flat main body 212 into which a series of projections 290 has been formed by cutting through the thickness of the main body 212.This forms projections that can extend outward from one 222 or the other 224 surfaces of the main body 212.Any suitable technique can be used to form the projections in this manner, including die cutting and laser cutting techniques.","The specific technique selected for a particular embodiment with depend on various considerations, including the material of the main body and the size and configuration of the projections.","Laser cutting is a suitable technique for forming projections in a main body that comprises a flat sheet, such as a flat sheet of small intestine submucosa.","Additional projections extend radially outward from the sides 218, 220 of the main body 212.Any suitable angle, length, shape and configuration can be used for the projections.","FIG.","3B illustrates a tissue adjustment implant 310 that has projections that are similar in shape to those of the tissue adjustment implant 210 illustrated in FIG.","3A, but that are relatively larger.","In this embodiment, a series of projections 390 has been formed by cutting through the thickness of the main body 312.This forms projections that can extend outward from one 322 or the other 324 surfaces of the main body 312.Additional projections extend radially outward from the sides 318, 320 of the main body 312.FIG.","3C illustrates a tissue adjustment implant 410 that includes a substantially round, elongate main body 412.A series of projections 490 has been formed by cutting into the main body 412 at an angle to form a wedge-shaped projection.","Each projection of the series of projections has been pulled slightly away from the main body 412.FIG.","3D illustrates a tissue adjustment implant 510 that includes a series of projections 590 that is integrally formed with the main body 512.Each projection of the series of projections comprises a substantially circular-shaped body.","In this embodiment, along with other embodiments in which the projections are integrally formed with the main body, the projections can be formed during the process of forming the main body, such as in a molding technique.","FIG.","3E illustrates a tissue adjustment implant 610 in which a series of separate projection-defining members 690 have been passed over a main body 612.FIG.","3F illustrates a single projection-defining member 690 isolated from the tissue adjustment implant.","As best illustrated in that Figure, each projection-defining member 690 defines outwardly-extending projections 692 and an opening 694.The tissue adjustment implant 610 is formed by passing the main body 612 through the opening 694 of each of a series of projection-defining members 690.Once disposed on the main body 612, the projection-defining members can be rotated about its lengthwise axis to place the projections in an offsetting relationship with respect to each other.","While a series of projection-defining members 690 is illustrated, it is noted that any suitable number can be used, including one, two, three or any suitable number.","Also, while the illustrated projection-defining members 690 are star-shaped, any suitable shape, size and configuration can be used, including any configuration that provides the desired outwardly-extending projections.","It is noted that, while not illustrated in the Figures, any of the tissue adjustment implants illustrated in FIGS.","3A, 3B, 3C, 3D and 3E can include any suitable lead attached to the main body, as described above, as well as any suitable plug, as described above and below.","If included, the plug can have any suitable size, shape and configuration.","Indeed, the plug in a tissue adjustment implant according to a particular embodiment need only have sufficient structure to provide the desired mechanical stop, as described above.","Each of FIGS.","4A, 4B, 4C, 4D, and 4E illustrates a tissue adjustment implant that includes an example structure for a plug.","FIG.","4A illustrates a tissue adjustment implant 710 that includes a plug 780 that is integrally formed with the main body 712 of the tissue adjustment implant 710.In this embodiment, the plug 780 has a stopper configuration, with a base 782, an end 784, and a frustoconical wall 786 that extends between the base 782 and end 784.The base 782 and end 784 are flat and parallel with each other.","FIG.","4B illustrates a tissue adjustment implant 810 that includes a plug 880 that comprises a separate element that has been attached to the main body 812 of the tissue adjustment implant 810.In this embodiment, the plug 880 has a rounded button configuration, with a base 882 and a rounded end 884 that meets the base 882 at outer edge 886 of the base 882.The plug 880 can be attached to the main body 812 by forming an opening 888 in a section of material, such as excess material from the forming of the main body 812, and placing an end 816 of the main body into the opening 888.An adhesive or other suitable agent for securing the plug 880 to the main body 812, can be added to the connection, such as in the opening 882, around an interface between the plug 880 and main body 812, or both.","FIG.","4C illustrates a tissue adjustment implant 910 that includes a plug 980 that is integrally formed with the main body 912 of the tissue adjustment implant.","In this embodiment, the plug 980 has a flattened button configuration, with a base 982 and a rounded end 984 that meets the base 982 at a point that is radially inward from the outer edge 986 of the base 982.This forms a circumferential shoulder 988 that extends around the plug 980 slightly inward from the outer edge 986 of the base 982.The plug 980 can be formed with the main body 912 by including a partial spherical or other rounded chamber, adjacent a chamber of appropriate size and configuration for forming the base 982, in the forming of the main body 912.FIG.","4D illustrates a tissue adjustment implant 1010 that includes a main body 1012 formed of multiple sheets 1082, 1084 of material that have been attached to each other.","In this embodiment, the plug 1080 comprises an end portion 1086 of the first 1082 sheet and an end portion 1088 of the second 1084 sheet that have been separated from each other and coated with a stiffening or other suitable agent, such as PLGA, to maintain their separated position.","In the illustrated embodiment, the end portions 1086, 1088 have been positioned at orthogonal angles to the longitudinal axis of the main body 1012, but it is noted that any suitable angle can be used, including a substantially orthogonal angle, an obtuse angle, and an acute angle.","Also, it is noted that, while described as having been separated from each other after the sheets 1082, 1084 have been attached to each other, the end portions 1086, 1088 can also be positioned as described prior to other portions of the sheets 1082, 1084 being attached to each other.","Lastly, while described as first 1082 and second 1084 sheets, one or both of the sheets can comprise a group of two or more sheets, such as a series of sheets.","FIG.","4E illustrates a tissue adjustment implant 1110 that includes a plug 1180 that comprises a simple knot tied an end portion 1182 of the main body 1112.Thus, even if a tissue adjustment implant according to a particular embodiment doesn't initially include a plug, a user can form a plug at or near the time of use, if desired.","FIGS.","6, 6A and 6B illustrate another example of a tissue adjustment implant 1200.The tissue adjustment implant 1200 has a main body 1212 comprising a substantially flat member extending from a first end 1214 to an opposing second end 1216 and having first 1218 and second 1220 opposing sides.","The main body 1212 has a first 1222 or upper surface and an opposing second 1224 or lower surface.","The main body 1212 has a lengthwise axis 1226 and a transverse axis 1228 that orthogonally intersects the lengthwise axis 1226 at a longitudinal midpoint 1230 disposed on the lengthwise axis 1226.A first anchor portion 1232 is disposed on the first end 1214 of the main body 1212 and defines an arrowhead 1280 having a terminal point 1282.First 1284 and second 1286 sides of the arrowhead 1280 are oriented at angle 1288 with respect to each other.","In contrast to some of the examples described above, the second end 1216 in the example embodiment does not include a plug or other terminal structure, although inclusion of a plug or other suitable structure may be desirable in certain embodiments.","A series of projections 1238 extends from one side 1218 of the main body 1210.The other side 1220 is substantially flat and contains no projections.","Thus, in this embodiment, projections extend from only one side of the main body 1210.Also, each of the projections in the series of projections 1238 extends away from the main body 1210, away from the second end 1216.Also, the first 1284 and second 1286 sides of the arrowhead 1280 extend away from the main body 1210 and away from the first end 1214.The main body 1210 includes a throat portion 1290 that transitions from the width of the base of the arrowhead 1280 to the width of the main body 1210, taken from the first side 1218 to the second side 1220.The inventors have determined that inclusion of the throat portion 1290 provides desirable loading and implantation properties.","The inventors have determined that the inclusion of the arrowhead 1280 and the series of projections 1238 on one side 1218 on the tissue adjustment implant 1200 provides desirable anchoring characteristics while maintaining a low profile structure that facilitates implantation and retention.","The tissue adjustment implant 1200 can be formed as an integral unit that defines the main body, series of projections, first anchor portion, and throat portion.","In these embodiments, an integral unit formed as a multi-laminate construct, as described below, is considered advantageous.","Alternatively, the tissue adjustment implant 1200 can be formed as separate portions that are attached or otherwise secured to each other.","For example, a main body can be formed with the projections, and an anchor portion, such as an anchor portion that defines an arrowhead, can be attached or otherwise secured to an end of the main body to form a tissue adjustment implant.","FIG.","7 illustrates an alternate tissue adjustment implant 1200′.","The tissue adjustment implant 1210′ according to this embodiment is the same as the tissue adjustment implant 1200 described above and illustrated in FIGS.","6, 6A, and 6B, except as detailed below.","Thus, the tissue adjustment implant 1200′ has a main body 1212′ comprising a substantially flat member extending from a first end 1214′ to an opposing second end 1216′ and having first 1218′ and second 1220′ opposing sides.","The main body 1212′ has a first 1222′ or upper surface and an opposing second 1224′ or lower surface.","The main body 1212′ has a lengthwise axis 1226′ and a transverse axis 1228′ that orthogonally intersects the lengthwise axis 1226′ at a longitudinal midpoint 1230′ disposed on the lengthwise axis 1226′.","A first anchor portion 1232′ is disposed on the first end 1214′ of the main body 1212′ and defines an arrowhead 1280′ having a terminal point 1282′.","A series of projections 1238′ extends from one side 1218′ of the main body 1210′.","The other side 1220′ is substantially flat and contains no projections.","Thus, in this embodiment, projections extend from only one side of the main body 1210′.","Also, each of the projections in the series of projections 1238′ extends away from the main body 1210′, away from the second end 1216′.","Also, the first 1284′ and second 1286′ sides of the arrowhead 1280′ extend away from the main body 1210′ and away from the first end 1214′.","The main body 1210′ includes a throat portion 1290′ that transitions from the width of the base of the arrowhead 1280′ to the width of the main body 1210′, taken from the first side 1218′ to the second side 1220′.","In this embodiment, the terminal point 1282′ of the arrowhead 1280′ is a rounded point.","Also in this embodiment, the first 1284′ and second 1286′ sides of the arrowhead 1280′ are oriented at angle 1288′ with respect to each other.","The angle 1288′ of this embodiment is relatively broad, or obtuse, as compared to the angle 1288 in the embodiment illustrated in FIGS.","6, 6A, and 6B.","In a tissue adjustment implant according to a particular embodiment that includes an anchor portion that defines an arrowhead, the sides of the arrowhead can be oriented with respect to each other at any suitable angle.","A skilled artisan will be able to determine a suitable angle for a tissue adjustment implant according to a particular embodiment based on various considerations, including the nature of the tissue within which the tissue adjustment implant is intended to be used, the material forming the tissue adjustment implant, and other considerations.","The inventors have determined that an acute angle, such as angle 1288 illustrated in FIG.","6, facilitates initial passage of the tissue adjustment implant 1280 into tissue during implantation, but provides a relatively low degree of anchoring or resistance to reverse movement following implantation.","In contrast, the inventors have determined that an obtuse angle, such as angle 1288′ illustrated in FIG.","7, requires additional force to accomplish the initial passage of the tissue adjustment implant 1280′ into tissue during implantation, but provides a relatively high degree of anchoring or resistance to reverse movement following implantation.","Based on these considerations, the a skilled artisan will be able to select a suitable angle for inclusion in a tissue adjustment implant according to a particular embodiment.","Examples of suitable angles include an acute angle and an obtuse angle.","Acute angles between about 15 degrees and about 90 degrees are also considered suitable.","Acute angles between about 35 degrees and about 90 degrees are also considered suitable.","Acute angles between about 45 degrees and about 90 degrees are also considered suitable.","Acute angles between about 55 degrees and about 90 degrees are also considered suitable.","Acute angles between about 65 degrees and about 90 degrees are also considered suitable.","Acute angles between about 75 degrees and about 90 degrees are also considered suitable.","Acute angles between about 85 degrees and about 90 degrees are also considered suitable.","The inventors have determined that an acute angle of about 45 degrees provides a desirable balance between the force required to achieve initial passage of a tissue adjustment implant into tissue during implantation and the degree of anchoring or resistance to reverse movement following implantation.","Furthermore, the inventors have determined that an acute angle of 45 degrees provides a desirable balance between the force required to achieve initial passage of a tissue adjustment implant into tissue during implantation and the degree of anchoring or resistance to reverse movement following implantation.","Obtuse angles between about 90 degrees and about 105 degrees are also considered suitable.","Obtuse angles between about 90 degrees and about 115 degrees are also considered suitable.","Obtuse angles between about 90 degrees and about 125 degrees are also considered suitable.","Obtuse angles between about 90 degrees and about 135 degrees are also considered suitable.","Obtuse angles between about 90 degrees and about 145 degrees are also considered suitable.","Obtuse angles between about 90 degrees and about 155 degrees are also considered suitable.","Obtuse angles between about 90 degrees and about 165 degrees are also considered suitable.","The inventors have determined that an obtuse angle of about 135 degrees provides a desirable balance between the force required to achieve initial passage of a tissue adjustment implant into tissue during implantation and the degree of anchoring or resistance to reverse movement following implantation.","Furthermore, the inventors have determined that an obtuse angle of 135 degrees provides a desirable balance between the force required to achieve initial passage of a tissue adjustment implant into tissue during implantation and the degree of anchoring or resistance to reverse movement following implantation.","A right angle is also considered suitable.","The inventors have determined that an angle of about 90 degrees is suitable.","Furthermore, the inventors have determined that an angle of 90 degrees is suitable.","FIGS.","8, 9, 10, and 11 illustrate an example delivery device 1300 suitable for implanting a tissue adjustment implant in a tissue of a patient, such as the soft palate of a human being.","The delivery device 1300 comprises a main body 1310 defining a handle 1312 that can be gripped by a user.","The main body also defines a barrel 1314 that extends away from the handle 1312.A cannula 1350 is disposed in the distal end 1316 of the main body 1310 such that the cannula 1350 extends away from the main body 1310.In the illustrated embodiment, the cannula 1350 defines a bend 1352 such that a first portion 1354 of the cannula 1350 extends substantially along an axis of the barrel 1314 and a second portion 1356 of the cannula 1350 extends away from the axis of the barrel 1314.The second portion 1356 of the cannula 1350 defines a notch 1358.As best illustrated in FIG.","9, the notch 1358 provides an oblique opening to the lumen 1360 of the cannula 1350.As best illustrated in FIG.","10, a partial circumferential wall 1362 of the cannula 1350 exists in the notch 1358, which a full circumferential wall 1364 of the cannula 1350 exists in the portion of the cannula 1350 disposed axially inward from the notch 1358.Also, as best illustrated in FIG.","9, the notch 1358 defines a distal tip 1366 suitable for forming an initial puncture opening in tissue during an implantation procedure.","FIG.","12 illustrates the cannula 1350 of delivery device 1300 and the tissue adjustment implant 1200 of FIG.","6 disposed within the lumen 1360 of the cannula 1350.As illustrated in the figure, the tissue adjustment implant 1200 is positioned within the cannula 1350 such that the terminal point 1282 of the arrowhead 1280 of the tissue adjustment implant 1200 is disposed within the notch and axially inward from the distal tip 1366 of the cannula 1350.A portion of each of the sides 1284, 1286 of the arrowhead 1280 of the tissue adjustment implant extend laterally outward from the cannula 1350.With this configuration, the tissue adjustment implant can be implanted by pushing the cannula 1350, by applying force to the handle of the delivery device, for example, such that the distal tip 1366 punctures the tissue into which the tissue adjustment implant is to be implanted.","By continuing to apply force in this manner, the portions of the sides 1284, 1286 of the arrowhead are forced into the tunnel formed by the cannula 1350.Once the tissue adjustment implant 1200 has been advanced into the tissue to a desirable or suitable distance, the cannula 1350 can be retracted by applying a reverse force on the handle of the delivery device.","As this is performed, the sides 1284, 1286 of the arrowhead will engage the tissue and anchor the tissue adjustment implant 1200 in place, allowing the cannula 1350, and the delivery device, to be retracted while leaving the tissue adjustment implant in place.","The tissue adjustment implants can be formed of any suitable material or materials, and a skilled artisan will be able to select an appropriate material or materials for a tissue adjustment implant according to a particular embodiment based on various considerations, including the tissue with which the tissue adjustment implant is intended to be used, the technique by which the tissue adjustment implant will be implanted, and other considerations.","Both synthetic and natural materials are considered suitable.","Examples of suitable synthetic materials include polymeric materials, such as polyethylene, polypropylene and other flexible polymeric materials.","Examples of suitable natural materials include tissue and tissue-derived materials.","The inventors have determined that tissue adjustment implants formed of bioremodelable materials are particularly well-suited for implantation within and adjustment of various tissues in human and other animals at least because of the ability of such materials to remodel and become incorporated into adjacent tissues over time.","These materials can provide a scaffold onto which cellular in-growth can occur, eventually allowing the material to remodel into a structure of host cells, which aids in the effectiveness of the tissue adjustment implant as a long-term support of the tissue being secured.","Particular advantage can be provided by tissue adjustment implants that incorporate a remodelable collagenous material.","Such remodelable collagenous materials, whether reconstituted or naturally-derived, can be provided, for example, by collagenous materials isolated from a warm-blooded vertebrate, especially a mammal.","Such isolated collagenous material can be processed so as to have remodelable, angiogenic properties and promote cellular invasion and ingrowth.","Remodelable materials may be used in this context to stimulate ingrowth of adjacent tissues into an implanted construct such that the remodelable material gradually breaks down and becomes replaced by new patient tissue so as to generate a new, remodeled tissue structure.","Such materials are considered suitable for use in the main body, projections, and plug portions of tissue adjustment implants.","Suitable remodelable materials can be provided by collagenous extracellular matrix (ECM) materials possessing biotropic properties.","For example, suitable collagenous materials include ECM materials such as those comprising submucosa, renal capsule membrane, dermal collagen, dura mater, pericardium, fascia lata, serosa, peritoneum or basement membrane layers, including liver basement membrane.","Suitable submucosa materials for these purposes include, for instance, intestinal submucosa including small intestinal submucosa, stomach submucosa, urinary bladder submucosa, and uterine submucosa.","Collagenous matrices comprising submucosa (potentially along with other associated tissues) useful in the present invention can be obtained by harvesting such tissue sources and delaminating the submucosa-containing matrix from smooth muscle layers, mucosal layers, and/or other layers occurring in the tissue source.","For additional information as to some of the materials useful in the tissue adjustment implants, and their isolation and treatment, reference can be made, for example, to U.S. Pat.","Nos.","4,902,508, 5,554,389, 5,993,844, 6,206,931, and 6,099,567.Remodelable ECM tissue materials harvested as intact sheets from a mammalian source and processed to remove cellular debris advantageously retain at least a portion of and potentially all of the native collagen microarchitecture of the source extracellular matrix.","This matrix of collagen fibers provides a scaffold to facilitate and support tissue ingrowth, particularly in bioactive ECM implant materials, such as porcine small intestinal submucosa or SIS (Surgisis® Biodesign™, Cook Medical, Bloomington Ind.","), that are processed to retain an effective level of growth factors and other bioactive constituents from the source tissue.","In this regard, when a tissue adjustment implant incorporates this sort of material, cells will invade the remodelable material upon implantation eventually leading to the generation of a newly-remodeled, functional tissue structure.","Submucosa-containing or other ECM tissue used in the tissue adjustment implants is preferably highly purified, for example, as described in U.S. Pat.","No.","6,206,931 to Cook et al.","Thus, preferred ECM material will exhibit an endotoxin level of less than about 12 endotoxin units (EU) per gram, more preferably less than about 5 EU per gram, and most preferably less than about 1 EU per gram.","As additional preferences, the submucosa or other ECM material may have a bioburden of less than about 1 colony forming units (CFU) per gram, more preferably less than about 0.5 CFU per gram.","Fungus levels are desirably similarly low, for example less than about 1 CFU per gram, more preferably less than about 0.5 CFU per gram.","Nucleic acid levels are preferably less than about 5 μg/mg, more preferably less than about 2 μg/mg, and virus levels are preferably less than about 50 plaque forming units (PFU) per gram, more preferably less than about 5 PFU per gram.","These and additional properties of submucosa or other ECM tissue taught in U.S. Pat.","No.","6,206,931 may be characteristic of any ECM tissue used in the inventive tissue adjustment implants.","A typical layer thickness for an as-isolated submucosa or other ECM tissue layer used in the invention ranges from about 50 to about 250 microns when fully hydrated, more typically from about 50 to about 200 microns when fully hydrated, although isolated layers having other thicknesses may also be obtained and used.","These layer thicknesses may vary with the type and age of the animal used as the tissue source.","As well, these layer thicknesses may vary with the source of the tissue obtained from the animal source.","In a dry state, a typical layer thickness for an as-isolated submucosa or other ECM tissue layer used in the invention ranges from about 30 to about 160 microns when fully dry, more typically from about 30 to about 130 microns when fully dry.","Suitable bioactive agents may include one or more bioactive agents native to the source of the ECM tissue material.","For example, a submucosa or other remodelable ECM tissue material may retain one or more growth factors such as but not limited to basic fibroblast growth factor (FGF-2), transforming growth factor beta (TGF-beta), epidermal growth factor (EGF), cartilage derived growth factor (CDGF), and/or platelet derived growth factor (PDGF).","As well, submucosa or other ECM materials when used in the invention may retain other native bioactive agents such as but not limited to proteins, glycoproteins, proteoglycans, and glycosaminoglycans.","For example, ECM materials may include heparin, heparin sulfate, hyaluronic acid, fibronectin, cytokines, and the like.","Thus, generally speaking, a submucosa or other ECM material may retain one or more bioactive components that induce, directly or indirectly, a cellular response such as a change in cell morphology, proliferation, growth, protein or gene expression.","Submucosa-containing or other ECM materials used in a tissue adjustment implant can be derived from any suitable organ or other tissue source, usually sources containing connective tissues.","The ECM materials processed for use in the inventive tissue adjustment implants will typically include abundant collagen, most commonly being constituted at least about 80% by weight collagen on a dry weight basis.","Such naturally-derived ECM materials will for the most part include collagen fibers that are non-randomly oriented, for instance occurring as generally uniaxial or multi-axial but regularly oriented fibers.","When processed to retain native bioactive factors, the ECM material can retain these factors interspersed as solids between, upon and/or within the collagen fibers.","Particularly desirable naturally-derived ECM materials for use in the invention will include significant amounts of such interspersed, non-collagenous solids that are readily ascertainable under light microscopic examination with appropriate staining.","Such non-collagenous solids can constitute a significant percentage of the dry weight of the ECM material in certain inventive embodiments, for example at least about 1%, at least about 3%, and at least about 5% by weight in various embodiments of the invention.","The submucosa-containing or other ECM material used in the inventive tissue adjustment implants may also exhibit an angiogenic character and thus be effective to induce angiogenesis in a host engrafted with the material.","In this regard, angiogenesis is the process through which the body makes new blood vessels to generate increased blood supply to tissues.","Thus, angiogenic materials, when contacted with host tissues, promote or encourage the formation of new blood vessels into the materials.","Methods for measuring in vivo angiogenesis in response to biomaterial implantation have recently been developed.","For example, one such method uses a subcutaneous implant model to determine the angiogenic character of a material.","See, C. Heeschen et al., Nature Medicine 7 (2001), No.","7, 833-839.When combined with a fluorescence microangiography technique, this model can provide both quantitative and qualitative measures of angiogenesis into biomaterials.","C. Johnson et al., Circulation Research 94 (2004), No.","2, 262-268.Further, in addition or as an alternative to the inclusion of such native bioactive components, non-native bioactive components such as those synthetically produced by recombinant technology or other methods (e.g., genetic material such as DNA), may be incorporated into an ECM material used in an inventive tissue adjustment implant.","These non-native bioactive components may be naturally-derived or recombinantly produced proteins that correspond to those natively occurring in an ECM tissue, but perhaps of a different species.","These non-native bioactive components may also be drug substances.","Illustrative drug substances that may be added to materials include, for example, anti-clotting agents, e.g.","heparin, antibiotics, anti-inflammatory agents, thrombus-promoting substances such as blood clotting factors, e.g., thrombin, fibrinogen, and the like, and anti-proliferative agents, e.g.","taxol derivatives such as paclitaxel.","Such non-native bioactive components can be incorporated into and/or onto ECM material in any suitable manner, for example, by surface treatment (e.g., spraying) and/or impregnation (e.g., soaking), to name a few.","Also, these substances may be applied to the ECM material in a premanufacturing step, immediately prior to the procedure (e.g., by soaking the material in a solution containing a suitable antibiotic such as cefazolin), or during or after engraftment of the material in the patient.","Inventive devices can incorporate xenograft material (i.e., cross-species material, such as tissue material from a non-human donor to a human recipient), allograft material (i.e., interspecies material, with tissue material from a donor of the same species as the recipient), and/or autograft material (i.e., where the donor and the recipient are the same individual).","Further, any exogenous bioactive substances incorporated into an ECM material may be from the same species of animal from which the ECM material was derived (e.g.","autologous or allogeneic relative to the ECM material) or may be from a different species from the ECM material source (xenogeneic relative to the ECM material).","In certain embodiments, ECM material will be xenogeneic relative to the patient receiving the graft, and any added exogenous material(s) will be from the same species (e.g.","autologous or allogeneic) as the patient receiving the graft.","Illustratively, human patients may be treated with xenogeneic ECM materials (e.g.","porcine-, bovine- or ovine-derived) that have been modified with exogenous human material(s) as described herein, those exogenous materials being naturally derived and/or recombinantly produced.","The inventors have determined that SIS is particularly well-suited for use in the tissue adjustment implant devices described herein at least because of its well-characterized nature and ready availability.","Furthermore, the inventors have determined that vacuum-pressed SIS provides a particularly advantageous material from which to form tissue adjustment implant devices that include one or more pluralities of projections, such as the tissue adjustment implants described and illustrated herein.","Lyophilized SIS can also be used, and may be advantageous for tissue adjustment implants in which a relatively quicker remodeling time is desired.","Radiopaque SIS can also be used, and may be advantageous for tissue adjustment implants for which enhanced visualization characteristics are desired.","The inventors have determined that a tissue adjustment implant having a main body formed of multiple layers laminated together provides a particularly advantageous structure.","Thus, the main body can comprise a multilaminate construct.","In these embodiments, any suitable number of layers can be used, and a skilled artisan will be able to select an appropriate number of layers for a particular tissue adjustment implant based on various considerations, including the intended use of the tissue adjustment implant and nature of the tissue intended to be supported by the tissue adjustment implant.","The inventors have determined that a tissue adjustment implant having a main body formed of between 4 and 12 layers of an ECM material, such as SIS, provides a particularly advantageous structure for tissue adjustment implants intended for use in supporting the soft palate of a patient, such as in methods of treating Obstructive Sleep Apnea (OSA).","A main body formed of between 6 and 10 layers of an ECM material, such as SIS, is also considered particularly advantageous.","A main body formed of 8 layers of an ECM material, such as SIS, is also considered particularly advantageous.","A main body formed of up to 60 layers of an ECM material, such as SIS, is also considered particularly advantageous.","In these embodiments, the layers can be assembled together in any suitable manner and using any suitable technique or process.","For multilaminate SIS constructs, the inventors have determined that vacuum-pressing of multiple layers of SIS provides a suitable laminate structure for use as a tissue adjustment implant as described herein.","The layers in the multilaminate construct can be vacuum-pressed prior to assembly into the multilaminate construct.","Alternatively, the multilaminate construct can be vacuum-pressed after assembly of the layers.","Also alternatively, the layers can be vacuum-pressed prior to assembly and the assembly can be vacuum-pressed after assembly.","The inventors have determined that use of vacuum-pressed SIS provides desirable durability and profile characteristics.","When using a vacuum-pressed layers of an ECM material, such as SIS, any suitable number of vacuum-pressed layers can be used.","The inventors have determined that a tissue adjustment implant having a main body formed of between 4 and 60 layers provides a particularly advantageous structure for tissue adjustment implants intended for use in supporting the soft palate of a patient, such as in methods of treating OSA.","A main body formed of between 10 and 50 layers is also considered particularly advantageous.","A main body formed of between 20 and 40 layers is also considered particularly advantageous.","A main body formed of between 25 and 35 layers is also considered particularly advantageous.","A main body formed of about 30 layers is also considered particularly advantageous.","The inventors have determined that a tissue adjustment implant comprising a multilaminate construct comprised of 30 layers of vacuum-pressed SIS provides a suitable structure for use in methods of treating OSA.","The inventors have determined that a hybrid structure may provide a desirable balance between desired overall rigidity for the tissue adjustment implant and relative remodeling time.","In this embodiment, a middle portion of the tissue adjustment implant is formed of lyophilized SIS, which provides a relatively quicker remodeling time, and the perimeter sections, including the ribbed portions, are formed of vacuum-pressed SIS, which provides a relatively high degree of overall rigidity.","The middle portion in this embodiment is expected to remodel relatively quickly following implantation, enhancing the securement of the tissue adjustment implant.","An opposite structure is also considered suitable and may be advantageous in certain circumstances.","A hybrid structure in which a mesh is embedded inside an SIS or other composition or between layers of SIS or of other material is also considered suitable.","For example, a polymeric mesh, such as a mesh formed of polypropylene, can be disposed between layers of SIS during formation of the tissue adjustment implant.","In these embodiments, the polymeric mesh will remain in the body following completion of remodeling by the SIS, which may enhance the overall anchoring of the supported tissue over time.","A bioabsorable mesh, such as a mesh formed of polyglycolic acid or other bioabsorbable material, can also be included in the tissue adjustment implant in this manner and may be advantageous where supplemental support is desired that lasts beyond the remodeling time for the SIS, but that does not have the permanency associated with a polypropylene or other polymeric mesh.","Examples of suitable structural arrangements of polymer and remodelable layers can be found in United States Patent Application Publication No.","2011/0166673 to Patel et al., for QUILTED IMPLANTABLE GRAFT, the entire contents of which are hereby incorporated into this disclosure.","A tissue adjustment implant, or portions thereof, can also be coated with particular materials to provide a desired property or properties.","For example, the inventors have determined that coating a tissue adjustment implant with poly(lactic-co-glycolic acid) (PLGA) provides a desirable stiffening effect to the implant while also providing an agent that promotes an inflammatory response in tissue within which the tissue adjustment implant has been placed.","In tissue adjustment implants that comprise a multilaminate construct, as describe above, a coating can be applied between layers during fabrication.","For example, PLGA can be applied to or embedded within one, two, a plurality of, or all of the layers when making a main body that comprise a multilaminate construct.","The tissue adjustment implants are implanted by forming an opening in a target tissue, passing the first end of the tissue adjustment implant through the opening and into the tissue until the plug contacts the tissue surrounding the opening.","If desired, additional pulling force can be applied to the first end to lift or otherwise adjust the position of the tissue through interaction with the plug.","Once a desired position is achieved, a portion of the tissue adjustment implant, such as a portion near the first end of the tissue adjustment implant, can be sutured to the tissue.","This is beneficial for maintaining the adjusted position of the tissue.","After passing the first end of the tissue adjustment implant through the opening in the tissue and into the tissue, the first end of the tissue adjustment implant, or a lead attached to it, can be manipulated to exit the tissue, either through an existing opening or by forming an opening, at a point at a distance from the opening through with the tissue adjustment implant entered the tissue.","This is particularly advantageous for tissue adjustment implants that include a lead, such as a needle and suture attached to a first end of the tissue adjustment implant.","Also, if desired, the tissue adjustment implant can be trimmed of excess main body such that the remainder of the tissue adjustment implant is flush or substantially flush with the opening through which the tissue adjustment implant exits the tissue.","If this is performed, it is advantageously performed after the tissue adjustment implant is secured to the tissue, if performed, such that any desired adjusted position of the tissue is maintained after the trimming is completed.","The tissue adjustment implants are particularly well-suited for adjusting the position of the soft palate of a patient, such as a human being.","Such an adjustment may be beneficial in the treatment of Obstructive Sleep Apnea (OSA).","FIG.","5 illustrates a schematic of an oral cavity 1300 of a patient within which first 1310a and second 1310b tissue adjustment implants have been placed.","In this example, each of the tissue adjustment implants 1310a, 1310b comprises a tissue adjustment implant according to the embodiment illustrated in FIGS.","2 and 2A.","The first tissue adjustment implant 1310a has been implanted in the soft palate 1350 on a first side of the uvula 1352 and the second tissue adjustment implant 1310b has been implanted in the soft palate 1350 on a second, opposite side of the uvula 1352.Each tissue adjustment implant 1310a, 1310b has been implanted as described above, such that the respective plugs 1380a, 1380b have been buried just beneath the surface of the tissue of the soft palate 1350.Each tissue adjustment implant 1301a, 1301b was pulled taught after the respective plugs 1310a, 1310b had reached that position to achieve a desired lifting of the rear portion 1352 of the soft palate.","Subsequently, the leads (not illustrated in FIG.","5) were cut and removed from the tissue adjustment implants and the respective first ends 1314a, 1314b of the tissue adjustment implants 1310a, 1310b were sutured to the tissue of the soft palate 1350 to maintain the adjusted position of the soft palate 1350.In FIG.","5, the tissue adjustment implants 1310a, 1310b, were implanted by passing the tissue adjustment implants 1310a, 1310b through an opening made in the tissue toward the rear of the oral cavity 1300 and advancing them toward the front of the oral cavity 1300.While another approach can be used, this approach is suitable for tissue adjustment implants having a plug on their distal end, such as tissue adjustment implants 1310a, 1310b.","FIG.","13 illustrates another schematic of an oral cavity 1400 of a patient within which first 1410a and second 1410b tissue adjustment implants have been placed.","In this example, each of the tissue adjustment implants 1410a, 1410b comprises a tissue adjustment implant according to the embodiment illustrated in FIGS.","6, 6A and 6B.","The first tissue adjustment implant 1410a has been implanted in the soft palate 1450 on a first side of the uvula 1452 and the second tissue adjustment implant 1410b has been implanted in the soft palate 1450 on a second, opposite side of the uvula 1452.Each tissue adjustment implant 1410a, 1410b has been implanted as described above with respect to the delivery device illustrated in FIGS.","8 through 12.In FIG.","13, the tissue adjustment implants 1410a, 1410b, were implanted by passing the tissue adjustment implants 1410a, 1410b through an opening made in the tissue toward the front of the oral cavity 1400 and advancing them toward the rear of the oral cavity 1400.While another approach can be used, this approach is suitable for tissue adjustment implants that lack a plug on their distal end and/or that have an anchor portion, such as the arrowhead on each of tissue adjustment implants 1410a, 1410b, on their proximal end, such as tissue adjustment implants 1410a, 1410b.","Those with ordinary skill in the art will appreciate that various modifications and alternatives for the described and illustrated embodiments can be developed in light of the overall teachings of the disclosure.","Accordingly, the particular arrangements disclosed are intended to be illustrative only and not limiting as to the scope of the invention, which is to be given the full breadth of the appended claims and any and all equivalents thereof."]],"string":"[\n [\n \"Tissue Adjustment Implant\",\n \"Tissue adjustment implants useful for adjusting a position of tissue in a patient are described.\",\n \"In an embodiment, a tissue adjustment implant includes a main body having a series of outwardly-extending projections.\",\n \"The tissue adjustment implants can be used in a variety of treatments, such as in the treatment of Obstructive Sleep Apnea and snoring.\"\n ],\n [\n \"1.A tissue adjustment implant, comprising: a main body extending along a lengthwise axis and having first and second opposing ends, first and second opposing sides, first and second opposing surfaces, and a first width extending from the first side to the second side orthogonally to the longitudinal axis and through the longitudinal midpoint; a first anchor portion disposed on the first end, the first anchor portion having a second width extending orthogonally to the longitudinal axis, the second width being greater than the first width; and a series of projections disposed on the first side, each projection of the series of projections extending away from the second end and the longitudinal axis of the main body.\",\n \"2.The tissue adjustment implant of claim 1, further comprising a throat portion that transitions from the first width to the second width.\",\n \"3.The tissue adjustment implant of claim 1, wherein the second side contains no projections.\",\n \"4.The tissue adjustment implant of claim 1, wherein the first anchor portion defines an arrowhead having a first arrowhead side oriented at an angle to a second arrowhead side.\",\n \"5.The tissue adjustment implant of claim 4, wherein the angle is an acute angle.\",\n \"6.The tissue adjustment implant of claim 4, wherein the acute angle comprises an angle between about 35 degrees and about 90 degrees.\",\n \"7.The tissue adjustment implant of claim 4, wherein the acute angle comprises an angle between about 45 degrees and about 90 degrees.\",\n \"8.The tissue adjustment implant of claim 4, wherein the acute angle comprises an angle of about 45 degrees.\",\n \"9.The tissue adjustment implant of claim 4, wherein the acute angle comprises an angle of 45 degrees.\",\n \"10.The tissue adjustment implant of claim 4, wherein the angle is an obtuse angle.\",\n \"11.The tissue adjustment implant of claim 4, wherein the angle is a right angle.\",\n \"12.The tissue adjustment implant of claim 4, wherein the arrowhead defines a terminal point; and wherein the terminal point comprises a rounded point.\",\n \"13.The tissue adjustment implant of claim 1, wherein at least one projection of the series of projections comprises a wing-shaped member having a base and an end, the base having a base width that extends parallel to the longitudinal axis of the main body and the end having an end width that extends parallel to the longitudinal axis of the main body; and wherein the base width is greater than the end width.\",\n \"14.The tissue adjustment implant of claim 1, wherein each projection of the series of projections comprises a wing-shaped member having a base and an end, the base having a base width that extends parallel to the longitudinal axis of the main body and the end having an end width that extends parallel to the longitudinal axis of the main body and that is less than the base width.\",\n \"15.The tissue adjustment implant of claim 1, wherein said issue adjustment implant comprises a bioremodelable material.\",\n \"16.The tissue adjustment implant of claim 15, wherein the bioremodelable material comprises an extracellular matrix (ECM) material.\",\n \"17.The tissue adjustment implant of claim 16, wherein the extracellular matrix material comprises small intestine submucosa (SIS).\",\n \"18.The tissue adjustment implant of claim 1, wherein said tissue adjustment implant comprises an integral, multi-laminate construct comprising layers of small intestine submucosa (SIS).\",\n \"19.A tissue adjustment implant, comprising: a main body extending along a lengthwise axis and having first and second opposing ends, first and second opposing sides, first and second opposing surfaces, and a first width extending from the first side to the second side orthogonally to the longitudinal axis and through the longitudinal midpoint; a first anchor portion disposed on the first end, the first anchor portion defining an arrowhead having a first arrowhead side oriented at an angle to a second arrowhead side and having a second width extending orthogonally to the longitudinal axis; a throat portion that transitions from the first width to the second width; and a series of projections disposed on the first side, each projection of the series of projections extending away from the second end and the longitudinal axis of the main body.\",\n \"20.A tissue adjustment implant, comprising: a main body extending along a lengthwise axis and having first and second opposing ends, first and second opposing sides, first and second opposing surfaces, and a first width extending from the first side to the second side orthogonally to the longitudinal axis and through the longitudinal midpoint; a first anchor portion disposed on the first end, the first anchor portion defining an arrowhead having a first arrowhead side oriented at an acute angle to a second arrowhead side and having a second width extending orthogonally to the longitudinal axis; a throat portion that transitions from the first width to the second width; and a series of projections disposed only on the first side, each projection of the series of projections extending away from the second end and the longitudinal axis of the main body and comprising a wing-shaped member having a base and an end, the base having a base width that extends parallel to the longitudinal axis of the main body and the end having an end width that extends parallel to the longitudinal axis of the main body and that is less than the base width.\"\n ],\n [\n \" BACKGROUND It is sometimes necessary or desirable to secure a tissue or portion of a tissue within the body of an animal, such as a human, in a manner that temporarily or permanently adjusts a position or orientation of the tissue or portion of a tissue.\",\n \"For example, in the treatment of Obstructive Sleep Apnea (OSA), it may be desirable to adjust the position of one or more tissues or portions of tissue, such as the soft palate.\",\n \"OSA is a clinical disorder in which a partial or complete collapse of soft tissue occurs in the airway during sleep.\",\n \"This leads to a blockage of the airway and impaired breathing during sleep.\",\n \"Mild OSA can lead to fatigue, reduced alertness following sleep, and a general reduction in productivity for the affected individual.\",\n \"Severe OSA can lead to sleep deprivation, hypoxemia, and depression.\",\n \"The art provides various options for the treatment of OSA.\",\n \"Continuous Positive Airway Pressure (CPAP) machines, which supply positive air pressure through a facemask and into the airway during sleep, are used most frequently.\",\n \"The positive air pressure maintains an open airway to prevent apnea and snoring.\",\n \"While these machines are generally considered effective, they are bulky, noisy, and cumbersome to use.\",\n \"Furthermore, use of these machines can be socially awkward for some individuals.\",\n \"Oral appliances that force the jaw forward to maintain an open airway can also be used.\",\n \"These devices are generally considered to be not as effective as CPAP machines, and can be uncomfortable to use.\",\n \"Furthermore, these devices are frequently ejected from the mouth during sleep, reducing their effectiveness over the entire course of a sleeping period.\",\n \"Invasive surgical procedures can also be used to treat OSA.\",\n \"Various techniques have been described, including uvulopalatopharyngoplasty (UPPP), maxillomandibular advancement (MMA), and even tracheostomy.\",\n \"Surgical procedures are generally considered to have limited and potentially short-lived effectiveness.\",\n \"Furthermore, many of the procedures require hospitalization and the use of general anesthesia.\",\n \"As a result, these procedures are generally reserved for severe cases of OSA.\",\n \"The AIRvance™ System from Medtronic, formerly known as the Repose System, provides a surgical-based tongue suspension procedure that can be performed with or without an adjunct hyoid suspension procedure.\",\n \"These suspension procedures require a surgical incision and dissection of the neck below the mandible.\",\n \"Following implantation of one or more necessary bone screws, sutures are lashed around the tongue and/or hyoid bone and secured with surgical knots.\",\n \"While these procedures offer less complicated solutions than the surgical procedures above, they still require surgical intervention and suffer from the drawbacks associated with surgical procedures.\",\n \"Furthermore, over time, the sutures used to suspend the tongue and/or hyoid bone may weaken or even snap, which may limit the effectiveness of the treatment over time.\",\n \"Lastly, the use of sutures in these procedures necessitates the use of specialized knotting and securement techniques to complete the procedure, which adds an additional opportunity for error and failure in the device and the procedure.\",\n \"Considering the disadvantages of the various available treatment options described above, a need exists for improved devices for adjustment of tissue within the body.\",\n \"Furthermore, a need exists for additional options, including implantable medical devices, for the treatment of OSA.\"\n ],\n [\n \"RELATED APPLICATION This application is a continuation of U.S. patent application Ser.\",\n \"No.\",\n \"14/449,195, filed on Aug. 1, 2014 and which claims the benefit of U.S.\",\n \"Provisional Application No.\",\n \"61/861,089, filed on Aug. 1, 2013.The disclosure of each of these related applications is hereby incorporated into this disclosure in its entirety.\",\n \"FIELD The disclosure relates generally to the field of implantable medical devices.\",\n \"Particular embodiments relate to tissue adjustment implants.\",\n \"BACKGROUND It is sometimes necessary or desirable to secure a tissue or portion of a tissue within the body of an animal, such as a human, in a manner that temporarily or permanently adjusts a position or orientation of the tissue or portion of a tissue.\",\n \"For example, in the treatment of Obstructive Sleep Apnea (OSA), it may be desirable to adjust the position of one or more tissues or portions of tissue, such as the soft palate.\",\n \"OSA is a clinical disorder in which a partial or complete collapse of soft tissue occurs in the airway during sleep.\",\n \"This leads to a blockage of the airway and impaired breathing during sleep.\",\n \"Mild OSA can lead to fatigue, reduced alertness following sleep, and a general reduction in productivity for the affected individual.\",\n \"Severe OSA can lead to sleep deprivation, hypoxemia, and depression.\",\n \"The art provides various options for the treatment of OSA.\",\n \"Continuous Positive Airway Pressure (CPAP) machines, which supply positive air pressure through a facemask and into the airway during sleep, are used most frequently.\",\n \"The positive air pressure maintains an open airway to prevent apnea and snoring.\",\n \"While these machines are generally considered effective, they are bulky, noisy, and cumbersome to use.\",\n \"Furthermore, use of these machines can be socially awkward for some individuals.\",\n \"Oral appliances that force the jaw forward to maintain an open airway can also be used.\",\n \"These devices are generally considered to be not as effective as CPAP machines, and can be uncomfortable to use.\",\n \"Furthermore, these devices are frequently ejected from the mouth during sleep, reducing their effectiveness over the entire course of a sleeping period.\",\n \"Invasive surgical procedures can also be used to treat OSA.\",\n \"Various techniques have been described, including uvulopalatopharyngoplasty (UPPP), maxillomandibular advancement (MMA), and even tracheostomy.\",\n \"Surgical procedures are generally considered to have limited and potentially short-lived effectiveness.\",\n \"Furthermore, many of the procedures require hospitalization and the use of general anesthesia.\",\n \"As a result, these procedures are generally reserved for severe cases of OSA.\",\n \"The AIRvance™ System from Medtronic, formerly known as the Repose System, provides a surgical-based tongue suspension procedure that can be performed with or without an adjunct hyoid suspension procedure.\",\n \"These suspension procedures require a surgical incision and dissection of the neck below the mandible.\",\n \"Following implantation of one or more necessary bone screws, sutures are lashed around the tongue and/or hyoid bone and secured with surgical knots.\",\n \"While these procedures offer less complicated solutions than the surgical procedures above, they still require surgical intervention and suffer from the drawbacks associated with surgical procedures.\",\n \"Furthermore, over time, the sutures used to suspend the tongue and/or hyoid bone may weaken or even snap, which may limit the effectiveness of the treatment over time.\",\n \"Lastly, the use of sutures in these procedures necessitates the use of specialized knotting and securement techniques to complete the procedure, which adds an additional opportunity for error and failure in the device and the procedure.\",\n \"Considering the disadvantages of the various available treatment options described above, a need exists for improved devices for adjustment of tissue within the body.\",\n \"Furthermore, a need exists for additional options, including implantable medical devices, for the treatment of OSA.\",\n \"DESCRIPTION OF FIGURES FIG.\",\n \"1 is a perspective view of an embodiment of a tissue adjustment implant.\",\n \"FIG.\",\n \"2 is a perspective view of another embodiment of a tissue adjustment implant.\",\n \"FIG.\",\n \"2A is a magnified view of area I indicated in FIG.\",\n \"2.FIG.\",\n \"3A is a perspective view of another embodiment of a tissue adjustment implant.\",\n \"FIG.\",\n \"3B is a perspective view of another embodiment of a tissue adjustment implant.\",\n \"FIG.\",\n \"3C is a perspective view of another embodiment of a tissue adjustment implant.\",\n \"FIG.\",\n \"3D is a perspective view of another embodiment of a tissue adjustment implant.\",\n \"FIG.\",\n \"3E is a perspective view of another embodiment of a tissue adjustment implant.\",\n \"FIG.\",\n \"3F is a perspective view of a projection member isolated from the implant illustrated in FIG.\",\n \"3E.\",\n \"FIG.\",\n \"4A is a perspective view of another embodiment of a tissue adjustment implant.\",\n \"FIG.\",\n \"4B is a perspective view of another embodiment of a tissue adjustment implant.\",\n \"FIG.\",\n \"4C is a perspective view of another embodiment of a tissue adjustment implant.\",\n \"FIG.\",\n \"4D is a perspective view of another embodiment of a tissue adjustment implant.\",\n \"FIG.\",\n \"4E is a perspective view of another embodiment of a tissue adjustment implant.\",\n \"FIG.\",\n \"5 is a schematic of an oral cavity of a patient within which two tissue adjustment implants have been placed.\",\n \"FIG.\",\n \"6 is a top view of another embodiment of a tissue adjustment implant.\",\n \"FIG.\",\n \"6A is an elevation view of the tissue adjustment implant illustrated in FIG.\",\n \"6.FIG.\",\n \"6B is another elevation view of the tissue adjustment implant illustrated in FIG.\",\n \"6.FIG.\",\n \"7 is a top view of another embodiment of a tissue adjustment implant.\",\n \"FIG.\",\n \"8 is an elevation view of a delivery device for implanting a tissue adjustment implant.\",\n \"FIG.\",\n \"9 is a magnified view of area II illustrated in FIG.\",\n \"8.FIG.\",\n \"10 is a sectional view of the cannula of the delivery device illustrated in FIG.\",\n \"9, taken along line 10-10.FIG.\",\n \"11 is a sectional view of the cannula of the delivery device illustrated in FIG.\",\n \"9, taken along line 11-11.FIG.\",\n \"12 is a partial top view of the delivery device illustrated in FIG.\",\n \"9.A tissue adjustment implant is loaded in the cannula of the delivery device.\",\n \"FIG.\",\n \"13 is a schematic of an oral cavity of a patient within which two tissue adjustment implants have been placed.\",\n \"DESCRIPTION OF EMBODIMENTS The following detailed description and the appended drawings describe and illustrate various example embodiments.\",\n \"The description and illustration of these examples are provided to enable one skilled in the art to make and use a tissue adjustment implant.\",\n \"They are not intended to limit the scope of the claims in any manner.\",\n \"FIG.\",\n \"1 illustrates an example of a tissue adjustment implant 10.The tissue adjustment implant 10 has a main body 12 comprising a substantially flat member extending from a first end 14 to an opposing second end 16 and having first 18 and second 20 opposing sides.\",\n \"The main body 12 has a first 22 or upper surface and an opposing second 24 or lower surface.\",\n \"The main body 12 has a lengthwise axis 26 and a transverse axis 28 that orthogonally intersects the lengthwise axis 26 at a longitudinal midpoint 30 disposed on the lengthwise axis 26.A first anchor portion 32 extends along the lengthwise axis 26 of the main body 12 from a point on the lengthwise axis 26 between the longitudinal midpoint 30 and the first end 14 to the first end 14.Similarly, a second anchor portion 34 extends along the lengthwise axis 26 of the main body 12 from a point on the lengthwise axis 26 between the longitudinal midpoint 30 and the second end 16 to the second end 16.A middle portion 36 extends along the lengthwise axis 26 of the main body 12 across the longitudinal midpoint 30 from an end of the first anchor portion 32 to an end of the second anchor portion 34.The first anchor portion 32 defines a first series of projections 38.Similarly, the second anchor portion 34 defines a second series of projections 40.Each of the first 38 and second 40 series of projections includes a series of projections that extend outwardly from the respective side 18, 20 of the main body 12, away from the longitudinal axis 26.The middle portion 36 is free of outwardly extending projections.\",\n \"As used herein, the term “projection” refers to an outwardly-directed member or portion of a member that extends away from a surface of another member or another portion of a member.\",\n \"An individual projection can have any suitable shape, including regular and irregular shapes, symmetrical and asymmetrical shapes, and any other suitable shape.\",\n \"The term “series of projections” refers to two or more individual projections.\",\n \"A series of projections includes multiple projections having the same shape, size and or/configurations, a series of projections having different sizes, shapes and configurations, a series of projections spaced at regular intervals, such as a toothed surface, a series of projections spaced at different intervals, and a series of projections spaced at irregular intervals.\",\n \"The illustrated embodiment includes a series of projections extending away from each side 18, 20 of the main body in each series of projections 38, 40.It is understood, though, that any suitable number of projections can extend away from each side 18, 20 of the main body 12 in a series of projections, including one projection, two projections, three projections, or more.\",\n \"Indeed, the number of projections that extend away from a side 18, 20 in a series of projections need only be at least one projection.\",\n \"Furthermore, it is noted that a series of projections can include one or more projections that extend away from only one of the sides 18, 20 of the main body 12 or away from both of the sides 18, 20 of the main body 12.In the illustrated embodiment, each projection 42 of the first series of projections 38 is substantially triangular in shape and extends away from the longitudinal axis 26 and away from the first end 14 of the main body 12 toward the transverse axis 28.Similarly, each projection 44 of the second series of projections 40 is substantially triangular in shape and extends away from the longitudinal axis 26 and away from the first end 14 of the main body 12 toward the transverse axis 28.In the illustrated embodiment, a projection 46 of the first series of projections 38 that is farthest from the longitudinal midpoint 30 has a side 48 that is continuous with the first end 14 of the main body 12.Similarly, a projection 50 of the second series of projections 40 that is farthest from the longitudinal midpoint 30 has a side 52 that is continuous with the second end 16 of the main body 12.Inclusion of the opposing series of projections 38, 40 is considered advantageous at least because each series 38, 40 provides an anchor at an end of the tissue adjustment implant 10 that is opposite an end of the implant that is first inserted into the tissue.\",\n \"Once the tissue adjustment implant 10 is then passed through the tissue, the series of projections at the opposite end are able to engage the tissue and, upon the application of additional force on the tissue engaging implant, such as tension, the position of the tissue can be adjusted, such as by lifting or otherwise moving the tissue, as described more fully below.\",\n \"As an example, described in greater detail below, the tissue adjustment implant can be used to engage and adjust the position of the soft palate of a patient, such as in the treatment of Obstructive Sleep Apnea.\",\n \"In the illustrated embodiment, the first 22 and second 24 surfaces of the main body 12 are substantially flat.\",\n \"It is noted, though, that it may be advantages to include one or more bumps, projections or other surface modifications on one or both of the surfaces 22, 24.Inclusion of such modifications may improve the handling of the tissue adjustment implant 10 during use.\",\n \"FIGS.\",\n \"2 and 2A illustrate another tissue adjustment implant 110.In this embodiment, the tissue adjustment implant 110 comprises a main body 112 comprising a substantially flat member extending from a first end 114 to an opposing second end 116 and having first 118 and second 120 opposing sides.\",\n \"The main body 112 has a first 122 or upper surface and an opposing second 124 or lower surface.\",\n \"The main body 112 has a lengthwise axis 126 and a transverse axis 128 that orthogonally intersects the lengthwise axis 126 at a longitudinal midpoint 130 disposed on the lengthwise axis 126.An anchor portion 136 extends along the lengthwise axis 126 of the main body 112 across the longitudinal midpoint 130.A first end portion 132 extends from an end of the first anchor portion 132 to the first end 114 of the main body 112.A second end portion 134 extends from the opposite end of the anchor portion 132 to the second end 116 of the main body 112.In this embodiment, the anchor portion 136 defines a first series of projections 138 and a second series of projections 140.Each of the first 138 and second 140 series of projections includes a series of projections that extend outwardly from the respective side 118, 120 of the main body 112, away from the longitudinal axis 126.The first 132 and second 134 end portions are free of outwardly extending projections.\",\n \"As best illustrated in FIG.\",\n \"2A, each projection 142 of the first 138 and second 140 series of projections is a wing-shaped member that extends radially outward from a side 120 of the main body 112.The wing-shaped member has a relatively wide base 160 that lies along a hypothetical extension of the side 120 and a relatively narrow end 162 that lies on hypothetical line that is parallel to the side 120.As best illustrated in FIG.\",\n \"2, each projection 142 of the first 138 and second 140 series or projections extends away from the respective side 118, 120 and away from the first end 114 of the main body.\",\n \"In the illustrated embodiment, as best illustrated in FIG.\",\n \"2A, each projection 142 of the first 138 and second 140 series of projections extends away from the respective side 118, 120 of the main body at an angle such that an obtuse angle a is formed on the side of the projection 142 that is closest the first end 114 of the main body 112 and such that an acute angle β is formed on the side of the projection 142 that is closest the second end 116 of the main body 112.While any suitable configuration can be used for the projections 142, this configuration facilitates placement and anchoring.\",\n \"In this embodiment, the main body 112 defines a series of openings 164 positioned along the lengthwise axis 126.Each opening of the series of openings 164 extends through the thickness of the main body 112 from the first surface 122 to the second surface 124.As such, each opening defines a passageway that extends through the main body 112.In this embodiment, as best illustrated in FIG.\",\n \"2, the series of openings 164 extends along the entire anchor portion 136 of the main body 112.It is noted that any opening in the series of openings 164 can have one or more dimensions that differ from the same dimension or dimensions of another opening in the series of openings 164 while also have one or more dimension that is the same or substantially similar to the same dimension or dimensions of the other openings of the series of openings 164.For example, each opening of the series of openings 164 may have a rectangular shape, with one or more opening having a length and width that differ from the length and width of one or more other rectangular-shaped openings.\",\n \"Also, while the illustrated embodiment includes a series of openings 164, it is noted that any suitable number of openings can be included in a tissue adjustment implant according to a particular embodiment, including zero, one, two, three, or any other suitable number of openings.\",\n \"Inclusion of one or more openings facilitates anchoring of a tissue adjustment implant following implantation.\",\n \"In this embodiment, a lead 170 is attached to the first end 114 of the main body.\",\n \"The lead 170 provides a leading structure that can be used to form an opening in and/or introduce the tissue adjustment implant into tissue.\",\n \"As such, the lead 170 advantageously includes a portion that can cut into tissue.\",\n \"For example, in the illustrated embodiment, the lead 170 comprises a needle 172 secured to a suture 174 that is attached to the main body 112 near the first end 114.It is noted, though, that any suitable lead structure can be used, including a cutting edge or point that is disposed in the first end of a main body of tissue adjustment implant.\",\n \"In this embodiment, a plug 180 is disposed on the second end 116 of the main body 112.The plug 180 has a width 182 that is greater than a width 184 of the main body 112 measured from one side 118 to the other 120.In the illustrated embodiment, the plug 180 is a separate member that has been attached to the main body, such as by an adhesive or through mechanical attachment.\",\n \"It is noted, though, that in other embodiments the plug can be integrally formed with the main body.\",\n \"Inclusion of a plug on an end of the main body facilitates implantation of a tissue adjustment implant because it provides a mechanical stop that impedes further passage of the tissue adjustment implant into the tissue once the plug has reached the point of entry into the tissue, such as an opening through which the remainder of the tissue adjustment implant has been passed.\",\n \"Also, by providing a mechanical stop that impedes further passage of the tissue adjustment implant, the inclusion of a plug facilitates the adjustment function of the tissue adjustment implant.\",\n \"For example, once the plug has reached the point of entry into the tissue, a continued pulling on the tissue adjustment implant, such as a continued pulling on lead attached to the first end of the main body or on the first end of the main body itself, will produce a pulling force on the tissue surrounding the plug at the point of entry.\",\n \"This can be used to lift, move or otherwise adjust the position of the tissue within the body through the application of a simple pulling force on the tissue adjustment implant.\",\n \"Each of FIGS.\",\n \"3A, 3B, 3C, 3D, and 3E illustrates a tissue adjustment implant that includes an alternative structure for a series of projections.\",\n \"FIG.\",\n \"3A illustrates a tissue adjustment implant 210 that includes a flat main body 212 into which a series of projections 290 has been formed by cutting through the thickness of the main body 212.This forms projections that can extend outward from one 222 or the other 224 surfaces of the main body 212.Any suitable technique can be used to form the projections in this manner, including die cutting and laser cutting techniques.\",\n \"The specific technique selected for a particular embodiment with depend on various considerations, including the material of the main body and the size and configuration of the projections.\",\n \"Laser cutting is a suitable technique for forming projections in a main body that comprises a flat sheet, such as a flat sheet of small intestine submucosa.\",\n \"Additional projections extend radially outward from the sides 218, 220 of the main body 212.Any suitable angle, length, shape and configuration can be used for the projections.\",\n \"FIG.\",\n \"3B illustrates a tissue adjustment implant 310 that has projections that are similar in shape to those of the tissue adjustment implant 210 illustrated in FIG.\",\n \"3A, but that are relatively larger.\",\n \"In this embodiment, a series of projections 390 has been formed by cutting through the thickness of the main body 312.This forms projections that can extend outward from one 322 or the other 324 surfaces of the main body 312.Additional projections extend radially outward from the sides 318, 320 of the main body 312.FIG.\",\n \"3C illustrates a tissue adjustment implant 410 that includes a substantially round, elongate main body 412.A series of projections 490 has been formed by cutting into the main body 412 at an angle to form a wedge-shaped projection.\",\n \"Each projection of the series of projections has been pulled slightly away from the main body 412.FIG.\",\n \"3D illustrates a tissue adjustment implant 510 that includes a series of projections 590 that is integrally formed with the main body 512.Each projection of the series of projections comprises a substantially circular-shaped body.\",\n \"In this embodiment, along with other embodiments in which the projections are integrally formed with the main body, the projections can be formed during the process of forming the main body, such as in a molding technique.\",\n \"FIG.\",\n \"3E illustrates a tissue adjustment implant 610 in which a series of separate projection-defining members 690 have been passed over a main body 612.FIG.\",\n \"3F illustrates a single projection-defining member 690 isolated from the tissue adjustment implant.\",\n \"As best illustrated in that Figure, each projection-defining member 690 defines outwardly-extending projections 692 and an opening 694.The tissue adjustment implant 610 is formed by passing the main body 612 through the opening 694 of each of a series of projection-defining members 690.Once disposed on the main body 612, the projection-defining members can be rotated about its lengthwise axis to place the projections in an offsetting relationship with respect to each other.\",\n \"While a series of projection-defining members 690 is illustrated, it is noted that any suitable number can be used, including one, two, three or any suitable number.\",\n \"Also, while the illustrated projection-defining members 690 are star-shaped, any suitable shape, size and configuration can be used, including any configuration that provides the desired outwardly-extending projections.\",\n \"It is noted that, while not illustrated in the Figures, any of the tissue adjustment implants illustrated in FIGS.\",\n \"3A, 3B, 3C, 3D and 3E can include any suitable lead attached to the main body, as described above, as well as any suitable plug, as described above and below.\",\n \"If included, the plug can have any suitable size, shape and configuration.\",\n \"Indeed, the plug in a tissue adjustment implant according to a particular embodiment need only have sufficient structure to provide the desired mechanical stop, as described above.\",\n \"Each of FIGS.\",\n \"4A, 4B, 4C, 4D, and 4E illustrates a tissue adjustment implant that includes an example structure for a plug.\",\n \"FIG.\",\n \"4A illustrates a tissue adjustment implant 710 that includes a plug 780 that is integrally formed with the main body 712 of the tissue adjustment implant 710.In this embodiment, the plug 780 has a stopper configuration, with a base 782, an end 784, and a frustoconical wall 786 that extends between the base 782 and end 784.The base 782 and end 784 are flat and parallel with each other.\",\n \"FIG.\",\n \"4B illustrates a tissue adjustment implant 810 that includes a plug 880 that comprises a separate element that has been attached to the main body 812 of the tissue adjustment implant 810.In this embodiment, the plug 880 has a rounded button configuration, with a base 882 and a rounded end 884 that meets the base 882 at outer edge 886 of the base 882.The plug 880 can be attached to the main body 812 by forming an opening 888 in a section of material, such as excess material from the forming of the main body 812, and placing an end 816 of the main body into the opening 888.An adhesive or other suitable agent for securing the plug 880 to the main body 812, can be added to the connection, such as in the opening 882, around an interface between the plug 880 and main body 812, or both.\",\n \"FIG.\",\n \"4C illustrates a tissue adjustment implant 910 that includes a plug 980 that is integrally formed with the main body 912 of the tissue adjustment implant.\",\n \"In this embodiment, the plug 980 has a flattened button configuration, with a base 982 and a rounded end 984 that meets the base 982 at a point that is radially inward from the outer edge 986 of the base 982.This forms a circumferential shoulder 988 that extends around the plug 980 slightly inward from the outer edge 986 of the base 982.The plug 980 can be formed with the main body 912 by including a partial spherical or other rounded chamber, adjacent a chamber of appropriate size and configuration for forming the base 982, in the forming of the main body 912.FIG.\",\n \"4D illustrates a tissue adjustment implant 1010 that includes a main body 1012 formed of multiple sheets 1082, 1084 of material that have been attached to each other.\",\n \"In this embodiment, the plug 1080 comprises an end portion 1086 of the first 1082 sheet and an end portion 1088 of the second 1084 sheet that have been separated from each other and coated with a stiffening or other suitable agent, such as PLGA, to maintain their separated position.\",\n \"In the illustrated embodiment, the end portions 1086, 1088 have been positioned at orthogonal angles to the longitudinal axis of the main body 1012, but it is noted that any suitable angle can be used, including a substantially orthogonal angle, an obtuse angle, and an acute angle.\",\n \"Also, it is noted that, while described as having been separated from each other after the sheets 1082, 1084 have been attached to each other, the end portions 1086, 1088 can also be positioned as described prior to other portions of the sheets 1082, 1084 being attached to each other.\",\n \"Lastly, while described as first 1082 and second 1084 sheets, one or both of the sheets can comprise a group of two or more sheets, such as a series of sheets.\",\n \"FIG.\",\n \"4E illustrates a tissue adjustment implant 1110 that includes a plug 1180 that comprises a simple knot tied an end portion 1182 of the main body 1112.Thus, even if a tissue adjustment implant according to a particular embodiment doesn't initially include a plug, a user can form a plug at or near the time of use, if desired.\",\n \"FIGS.\",\n \"6, 6A and 6B illustrate another example of a tissue adjustment implant 1200.The tissue adjustment implant 1200 has a main body 1212 comprising a substantially flat member extending from a first end 1214 to an opposing second end 1216 and having first 1218 and second 1220 opposing sides.\",\n \"The main body 1212 has a first 1222 or upper surface and an opposing second 1224 or lower surface.\",\n \"The main body 1212 has a lengthwise axis 1226 and a transverse axis 1228 that orthogonally intersects the lengthwise axis 1226 at a longitudinal midpoint 1230 disposed on the lengthwise axis 1226.A first anchor portion 1232 is disposed on the first end 1214 of the main body 1212 and defines an arrowhead 1280 having a terminal point 1282.First 1284 and second 1286 sides of the arrowhead 1280 are oriented at angle 1288 with respect to each other.\",\n \"In contrast to some of the examples described above, the second end 1216 in the example embodiment does not include a plug or other terminal structure, although inclusion of a plug or other suitable structure may be desirable in certain embodiments.\",\n \"A series of projections 1238 extends from one side 1218 of the main body 1210.The other side 1220 is substantially flat and contains no projections.\",\n \"Thus, in this embodiment, projections extend from only one side of the main body 1210.Also, each of the projections in the series of projections 1238 extends away from the main body 1210, away from the second end 1216.Also, the first 1284 and second 1286 sides of the arrowhead 1280 extend away from the main body 1210 and away from the first end 1214.The main body 1210 includes a throat portion 1290 that transitions from the width of the base of the arrowhead 1280 to the width of the main body 1210, taken from the first side 1218 to the second side 1220.The inventors have determined that inclusion of the throat portion 1290 provides desirable loading and implantation properties.\",\n \"The inventors have determined that the inclusion of the arrowhead 1280 and the series of projections 1238 on one side 1218 on the tissue adjustment implant 1200 provides desirable anchoring characteristics while maintaining a low profile structure that facilitates implantation and retention.\",\n \"The tissue adjustment implant 1200 can be formed as an integral unit that defines the main body, series of projections, first anchor portion, and throat portion.\",\n \"In these embodiments, an integral unit formed as a multi-laminate construct, as described below, is considered advantageous.\",\n \"Alternatively, the tissue adjustment implant 1200 can be formed as separate portions that are attached or otherwise secured to each other.\",\n \"For example, a main body can be formed with the projections, and an anchor portion, such as an anchor portion that defines an arrowhead, can be attached or otherwise secured to an end of the main body to form a tissue adjustment implant.\",\n \"FIG.\",\n \"7 illustrates an alternate tissue adjustment implant 1200′.\",\n \"The tissue adjustment implant 1210′ according to this embodiment is the same as the tissue adjustment implant 1200 described above and illustrated in FIGS.\",\n \"6, 6A, and 6B, except as detailed below.\",\n \"Thus, the tissue adjustment implant 1200′ has a main body 1212′ comprising a substantially flat member extending from a first end 1214′ to an opposing second end 1216′ and having first 1218′ and second 1220′ opposing sides.\",\n \"The main body 1212′ has a first 1222′ or upper surface and an opposing second 1224′ or lower surface.\",\n \"The main body 1212′ has a lengthwise axis 1226′ and a transverse axis 1228′ that orthogonally intersects the lengthwise axis 1226′ at a longitudinal midpoint 1230′ disposed on the lengthwise axis 1226′.\",\n \"A first anchor portion 1232′ is disposed on the first end 1214′ of the main body 1212′ and defines an arrowhead 1280′ having a terminal point 1282′.\",\n \"A series of projections 1238′ extends from one side 1218′ of the main body 1210′.\",\n \"The other side 1220′ is substantially flat and contains no projections.\",\n \"Thus, in this embodiment, projections extend from only one side of the main body 1210′.\",\n \"Also, each of the projections in the series of projections 1238′ extends away from the main body 1210′, away from the second end 1216′.\",\n \"Also, the first 1284′ and second 1286′ sides of the arrowhead 1280′ extend away from the main body 1210′ and away from the first end 1214′.\",\n \"The main body 1210′ includes a throat portion 1290′ that transitions from the width of the base of the arrowhead 1280′ to the width of the main body 1210′, taken from the first side 1218′ to the second side 1220′.\",\n \"In this embodiment, the terminal point 1282′ of the arrowhead 1280′ is a rounded point.\",\n \"Also in this embodiment, the first 1284′ and second 1286′ sides of the arrowhead 1280′ are oriented at angle 1288′ with respect to each other.\",\n \"The angle 1288′ of this embodiment is relatively broad, or obtuse, as compared to the angle 1288 in the embodiment illustrated in FIGS.\",\n \"6, 6A, and 6B.\",\n \"In a tissue adjustment implant according to a particular embodiment that includes an anchor portion that defines an arrowhead, the sides of the arrowhead can be oriented with respect to each other at any suitable angle.\",\n \"A skilled artisan will be able to determine a suitable angle for a tissue adjustment implant according to a particular embodiment based on various considerations, including the nature of the tissue within which the tissue adjustment implant is intended to be used, the material forming the tissue adjustment implant, and other considerations.\",\n \"The inventors have determined that an acute angle, such as angle 1288 illustrated in FIG.\",\n \"6, facilitates initial passage of the tissue adjustment implant 1280 into tissue during implantation, but provides a relatively low degree of anchoring or resistance to reverse movement following implantation.\",\n \"In contrast, the inventors have determined that an obtuse angle, such as angle 1288′ illustrated in FIG.\",\n \"7, requires additional force to accomplish the initial passage of the tissue adjustment implant 1280′ into tissue during implantation, but provides a relatively high degree of anchoring or resistance to reverse movement following implantation.\",\n \"Based on these considerations, the a skilled artisan will be able to select a suitable angle for inclusion in a tissue adjustment implant according to a particular embodiment.\",\n \"Examples of suitable angles include an acute angle and an obtuse angle.\",\n \"Acute angles between about 15 degrees and about 90 degrees are also considered suitable.\",\n \"Acute angles between about 35 degrees and about 90 degrees are also considered suitable.\",\n \"Acute angles between about 45 degrees and about 90 degrees are also considered suitable.\",\n \"Acute angles between about 55 degrees and about 90 degrees are also considered suitable.\",\n \"Acute angles between about 65 degrees and about 90 degrees are also considered suitable.\",\n \"Acute angles between about 75 degrees and about 90 degrees are also considered suitable.\",\n \"Acute angles between about 85 degrees and about 90 degrees are also considered suitable.\",\n \"The inventors have determined that an acute angle of about 45 degrees provides a desirable balance between the force required to achieve initial passage of a tissue adjustment implant into tissue during implantation and the degree of anchoring or resistance to reverse movement following implantation.\",\n \"Furthermore, the inventors have determined that an acute angle of 45 degrees provides a desirable balance between the force required to achieve initial passage of a tissue adjustment implant into tissue during implantation and the degree of anchoring or resistance to reverse movement following implantation.\",\n \"Obtuse angles between about 90 degrees and about 105 degrees are also considered suitable.\",\n \"Obtuse angles between about 90 degrees and about 115 degrees are also considered suitable.\",\n \"Obtuse angles between about 90 degrees and about 125 degrees are also considered suitable.\",\n \"Obtuse angles between about 90 degrees and about 135 degrees are also considered suitable.\",\n \"Obtuse angles between about 90 degrees and about 145 degrees are also considered suitable.\",\n \"Obtuse angles between about 90 degrees and about 155 degrees are also considered suitable.\",\n \"Obtuse angles between about 90 degrees and about 165 degrees are also considered suitable.\",\n \"The inventors have determined that an obtuse angle of about 135 degrees provides a desirable balance between the force required to achieve initial passage of a tissue adjustment implant into tissue during implantation and the degree of anchoring or resistance to reverse movement following implantation.\",\n \"Furthermore, the inventors have determined that an obtuse angle of 135 degrees provides a desirable balance between the force required to achieve initial passage of a tissue adjustment implant into tissue during implantation and the degree of anchoring or resistance to reverse movement following implantation.\",\n \"A right angle is also considered suitable.\",\n \"The inventors have determined that an angle of about 90 degrees is suitable.\",\n \"Furthermore, the inventors have determined that an angle of 90 degrees is suitable.\",\n \"FIGS.\",\n \"8, 9, 10, and 11 illustrate an example delivery device 1300 suitable for implanting a tissue adjustment implant in a tissue of a patient, such as the soft palate of a human being.\",\n \"The delivery device 1300 comprises a main body 1310 defining a handle 1312 that can be gripped by a user.\",\n \"The main body also defines a barrel 1314 that extends away from the handle 1312.A cannula 1350 is disposed in the distal end 1316 of the main body 1310 such that the cannula 1350 extends away from the main body 1310.In the illustrated embodiment, the cannula 1350 defines a bend 1352 such that a first portion 1354 of the cannula 1350 extends substantially along an axis of the barrel 1314 and a second portion 1356 of the cannula 1350 extends away from the axis of the barrel 1314.The second portion 1356 of the cannula 1350 defines a notch 1358.As best illustrated in FIG.\",\n \"9, the notch 1358 provides an oblique opening to the lumen 1360 of the cannula 1350.As best illustrated in FIG.\",\n \"10, a partial circumferential wall 1362 of the cannula 1350 exists in the notch 1358, which a full circumferential wall 1364 of the cannula 1350 exists in the portion of the cannula 1350 disposed axially inward from the notch 1358.Also, as best illustrated in FIG.\",\n \"9, the notch 1358 defines a distal tip 1366 suitable for forming an initial puncture opening in tissue during an implantation procedure.\",\n \"FIG.\",\n \"12 illustrates the cannula 1350 of delivery device 1300 and the tissue adjustment implant 1200 of FIG.\",\n \"6 disposed within the lumen 1360 of the cannula 1350.As illustrated in the figure, the tissue adjustment implant 1200 is positioned within the cannula 1350 such that the terminal point 1282 of the arrowhead 1280 of the tissue adjustment implant 1200 is disposed within the notch and axially inward from the distal tip 1366 of the cannula 1350.A portion of each of the sides 1284, 1286 of the arrowhead 1280 of the tissue adjustment implant extend laterally outward from the cannula 1350.With this configuration, the tissue adjustment implant can be implanted by pushing the cannula 1350, by applying force to the handle of the delivery device, for example, such that the distal tip 1366 punctures the tissue into which the tissue adjustment implant is to be implanted.\",\n \"By continuing to apply force in this manner, the portions of the sides 1284, 1286 of the arrowhead are forced into the tunnel formed by the cannula 1350.Once the tissue adjustment implant 1200 has been advanced into the tissue to a desirable or suitable distance, the cannula 1350 can be retracted by applying a reverse force on the handle of the delivery device.\",\n \"As this is performed, the sides 1284, 1286 of the arrowhead will engage the tissue and anchor the tissue adjustment implant 1200 in place, allowing the cannula 1350, and the delivery device, to be retracted while leaving the tissue adjustment implant in place.\",\n \"The tissue adjustment implants can be formed of any suitable material or materials, and a skilled artisan will be able to select an appropriate material or materials for a tissue adjustment implant according to a particular embodiment based on various considerations, including the tissue with which the tissue adjustment implant is intended to be used, the technique by which the tissue adjustment implant will be implanted, and other considerations.\",\n \"Both synthetic and natural materials are considered suitable.\",\n \"Examples of suitable synthetic materials include polymeric materials, such as polyethylene, polypropylene and other flexible polymeric materials.\",\n \"Examples of suitable natural materials include tissue and tissue-derived materials.\",\n \"The inventors have determined that tissue adjustment implants formed of bioremodelable materials are particularly well-suited for implantation within and adjustment of various tissues in human and other animals at least because of the ability of such materials to remodel and become incorporated into adjacent tissues over time.\",\n \"These materials can provide a scaffold onto which cellular in-growth can occur, eventually allowing the material to remodel into a structure of host cells, which aids in the effectiveness of the tissue adjustment implant as a long-term support of the tissue being secured.\",\n \"Particular advantage can be provided by tissue adjustment implants that incorporate a remodelable collagenous material.\",\n \"Such remodelable collagenous materials, whether reconstituted or naturally-derived, can be provided, for example, by collagenous materials isolated from a warm-blooded vertebrate, especially a mammal.\",\n \"Such isolated collagenous material can be processed so as to have remodelable, angiogenic properties and promote cellular invasion and ingrowth.\",\n \"Remodelable materials may be used in this context to stimulate ingrowth of adjacent tissues into an implanted construct such that the remodelable material gradually breaks down and becomes replaced by new patient tissue so as to generate a new, remodeled tissue structure.\",\n \"Such materials are considered suitable for use in the main body, projections, and plug portions of tissue adjustment implants.\",\n \"Suitable remodelable materials can be provided by collagenous extracellular matrix (ECM) materials possessing biotropic properties.\",\n \"For example, suitable collagenous materials include ECM materials such as those comprising submucosa, renal capsule membrane, dermal collagen, dura mater, pericardium, fascia lata, serosa, peritoneum or basement membrane layers, including liver basement membrane.\",\n \"Suitable submucosa materials for these purposes include, for instance, intestinal submucosa including small intestinal submucosa, stomach submucosa, urinary bladder submucosa, and uterine submucosa.\",\n \"Collagenous matrices comprising submucosa (potentially along with other associated tissues) useful in the present invention can be obtained by harvesting such tissue sources and delaminating the submucosa-containing matrix from smooth muscle layers, mucosal layers, and/or other layers occurring in the tissue source.\",\n \"For additional information as to some of the materials useful in the tissue adjustment implants, and their isolation and treatment, reference can be made, for example, to U.S. Pat.\",\n \"Nos.\",\n \"4,902,508, 5,554,389, 5,993,844, 6,206,931, and 6,099,567.Remodelable ECM tissue materials harvested as intact sheets from a mammalian source and processed to remove cellular debris advantageously retain at least a portion of and potentially all of the native collagen microarchitecture of the source extracellular matrix.\",\n \"This matrix of collagen fibers provides a scaffold to facilitate and support tissue ingrowth, particularly in bioactive ECM implant materials, such as porcine small intestinal submucosa or SIS (Surgisis® Biodesign™, Cook Medical, Bloomington Ind.\",\n \"), that are processed to retain an effective level of growth factors and other bioactive constituents from the source tissue.\",\n \"In this regard, when a tissue adjustment implant incorporates this sort of material, cells will invade the remodelable material upon implantation eventually leading to the generation of a newly-remodeled, functional tissue structure.\",\n \"Submucosa-containing or other ECM tissue used in the tissue adjustment implants is preferably highly purified, for example, as described in U.S. Pat.\",\n \"No.\",\n \"6,206,931 to Cook et al.\",\n \"Thus, preferred ECM material will exhibit an endotoxin level of less than about 12 endotoxin units (EU) per gram, more preferably less than about 5 EU per gram, and most preferably less than about 1 EU per gram.\",\n \"As additional preferences, the submucosa or other ECM material may have a bioburden of less than about 1 colony forming units (CFU) per gram, more preferably less than about 0.5 CFU per gram.\",\n \"Fungus levels are desirably similarly low, for example less than about 1 CFU per gram, more preferably less than about 0.5 CFU per gram.\",\n \"Nucleic acid levels are preferably less than about 5 μg/mg, more preferably less than about 2 μg/mg, and virus levels are preferably less than about 50 plaque forming units (PFU) per gram, more preferably less than about 5 PFU per gram.\",\n \"These and additional properties of submucosa or other ECM tissue taught in U.S. Pat.\",\n \"No.\",\n \"6,206,931 may be characteristic of any ECM tissue used in the inventive tissue adjustment implants.\",\n \"A typical layer thickness for an as-isolated submucosa or other ECM tissue layer used in the invention ranges from about 50 to about 250 microns when fully hydrated, more typically from about 50 to about 200 microns when fully hydrated, although isolated layers having other thicknesses may also be obtained and used.\",\n \"These layer thicknesses may vary with the type and age of the animal used as the tissue source.\",\n \"As well, these layer thicknesses may vary with the source of the tissue obtained from the animal source.\",\n \"In a dry state, a typical layer thickness for an as-isolated submucosa or other ECM tissue layer used in the invention ranges from about 30 to about 160 microns when fully dry, more typically from about 30 to about 130 microns when fully dry.\",\n \"Suitable bioactive agents may include one or more bioactive agents native to the source of the ECM tissue material.\",\n \"For example, a submucosa or other remodelable ECM tissue material may retain one or more growth factors such as but not limited to basic fibroblast growth factor (FGF-2), transforming growth factor beta (TGF-beta), epidermal growth factor (EGF), cartilage derived growth factor (CDGF), and/or platelet derived growth factor (PDGF).\",\n \"As well, submucosa or other ECM materials when used in the invention may retain other native bioactive agents such as but not limited to proteins, glycoproteins, proteoglycans, and glycosaminoglycans.\",\n \"For example, ECM materials may include heparin, heparin sulfate, hyaluronic acid, fibronectin, cytokines, and the like.\",\n \"Thus, generally speaking, a submucosa or other ECM material may retain one or more bioactive components that induce, directly or indirectly, a cellular response such as a change in cell morphology, proliferation, growth, protein or gene expression.\",\n \"Submucosa-containing or other ECM materials used in a tissue adjustment implant can be derived from any suitable organ or other tissue source, usually sources containing connective tissues.\",\n \"The ECM materials processed for use in the inventive tissue adjustment implants will typically include abundant collagen, most commonly being constituted at least about 80% by weight collagen on a dry weight basis.\",\n \"Such naturally-derived ECM materials will for the most part include collagen fibers that are non-randomly oriented, for instance occurring as generally uniaxial or multi-axial but regularly oriented fibers.\",\n \"When processed to retain native bioactive factors, the ECM material can retain these factors interspersed as solids between, upon and/or within the collagen fibers.\",\n \"Particularly desirable naturally-derived ECM materials for use in the invention will include significant amounts of such interspersed, non-collagenous solids that are readily ascertainable under light microscopic examination with appropriate staining.\",\n \"Such non-collagenous solids can constitute a significant percentage of the dry weight of the ECM material in certain inventive embodiments, for example at least about 1%, at least about 3%, and at least about 5% by weight in various embodiments of the invention.\",\n \"The submucosa-containing or other ECM material used in the inventive tissue adjustment implants may also exhibit an angiogenic character and thus be effective to induce angiogenesis in a host engrafted with the material.\",\n \"In this regard, angiogenesis is the process through which the body makes new blood vessels to generate increased blood supply to tissues.\",\n \"Thus, angiogenic materials, when contacted with host tissues, promote or encourage the formation of new blood vessels into the materials.\",\n \"Methods for measuring in vivo angiogenesis in response to biomaterial implantation have recently been developed.\",\n \"For example, one such method uses a subcutaneous implant model to determine the angiogenic character of a material.\",\n \"See, C. Heeschen et al., Nature Medicine 7 (2001), No.\",\n \"7, 833-839.When combined with a fluorescence microangiography technique, this model can provide both quantitative and qualitative measures of angiogenesis into biomaterials.\",\n \"C. Johnson et al., Circulation Research 94 (2004), No.\",\n \"2, 262-268.Further, in addition or as an alternative to the inclusion of such native bioactive components, non-native bioactive components such as those synthetically produced by recombinant technology or other methods (e.g., genetic material such as DNA), may be incorporated into an ECM material used in an inventive tissue adjustment implant.\",\n \"These non-native bioactive components may be naturally-derived or recombinantly produced proteins that correspond to those natively occurring in an ECM tissue, but perhaps of a different species.\",\n \"These non-native bioactive components may also be drug substances.\",\n \"Illustrative drug substances that may be added to materials include, for example, anti-clotting agents, e.g.\",\n \"heparin, antibiotics, anti-inflammatory agents, thrombus-promoting substances such as blood clotting factors, e.g., thrombin, fibrinogen, and the like, and anti-proliferative agents, e.g.\",\n \"taxol derivatives such as paclitaxel.\",\n \"Such non-native bioactive components can be incorporated into and/or onto ECM material in any suitable manner, for example, by surface treatment (e.g., spraying) and/or impregnation (e.g., soaking), to name a few.\",\n \"Also, these substances may be applied to the ECM material in a premanufacturing step, immediately prior to the procedure (e.g., by soaking the material in a solution containing a suitable antibiotic such as cefazolin), or during or after engraftment of the material in the patient.\",\n \"Inventive devices can incorporate xenograft material (i.e., cross-species material, such as tissue material from a non-human donor to a human recipient), allograft material (i.e., interspecies material, with tissue material from a donor of the same species as the recipient), and/or autograft material (i.e., where the donor and the recipient are the same individual).\",\n \"Further, any exogenous bioactive substances incorporated into an ECM material may be from the same species of animal from which the ECM material was derived (e.g.\",\n \"autologous or allogeneic relative to the ECM material) or may be from a different species from the ECM material source (xenogeneic relative to the ECM material).\",\n \"In certain embodiments, ECM material will be xenogeneic relative to the patient receiving the graft, and any added exogenous material(s) will be from the same species (e.g.\",\n \"autologous or allogeneic) as the patient receiving the graft.\",\n \"Illustratively, human patients may be treated with xenogeneic ECM materials (e.g.\",\n \"porcine-, bovine- or ovine-derived) that have been modified with exogenous human material(s) as described herein, those exogenous materials being naturally derived and/or recombinantly produced.\",\n \"The inventors have determined that SIS is particularly well-suited for use in the tissue adjustment implant devices described herein at least because of its well-characterized nature and ready availability.\",\n \"Furthermore, the inventors have determined that vacuum-pressed SIS provides a particularly advantageous material from which to form tissue adjustment implant devices that include one or more pluralities of projections, such as the tissue adjustment implants described and illustrated herein.\",\n \"Lyophilized SIS can also be used, and may be advantageous for tissue adjustment implants in which a relatively quicker remodeling time is desired.\",\n \"Radiopaque SIS can also be used, and may be advantageous for tissue adjustment implants for which enhanced visualization characteristics are desired.\",\n \"The inventors have determined that a tissue adjustment implant having a main body formed of multiple layers laminated together provides a particularly advantageous structure.\",\n \"Thus, the main body can comprise a multilaminate construct.\",\n \"In these embodiments, any suitable number of layers can be used, and a skilled artisan will be able to select an appropriate number of layers for a particular tissue adjustment implant based on various considerations, including the intended use of the tissue adjustment implant and nature of the tissue intended to be supported by the tissue adjustment implant.\",\n \"The inventors have determined that a tissue adjustment implant having a main body formed of between 4 and 12 layers of an ECM material, such as SIS, provides a particularly advantageous structure for tissue adjustment implants intended for use in supporting the soft palate of a patient, such as in methods of treating Obstructive Sleep Apnea (OSA).\",\n \"A main body formed of between 6 and 10 layers of an ECM material, such as SIS, is also considered particularly advantageous.\",\n \"A main body formed of 8 layers of an ECM material, such as SIS, is also considered particularly advantageous.\",\n \"A main body formed of up to 60 layers of an ECM material, such as SIS, is also considered particularly advantageous.\",\n \"In these embodiments, the layers can be assembled together in any suitable manner and using any suitable technique or process.\",\n \"For multilaminate SIS constructs, the inventors have determined that vacuum-pressing of multiple layers of SIS provides a suitable laminate structure for use as a tissue adjustment implant as described herein.\",\n \"The layers in the multilaminate construct can be vacuum-pressed prior to assembly into the multilaminate construct.\",\n \"Alternatively, the multilaminate construct can be vacuum-pressed after assembly of the layers.\",\n \"Also alternatively, the layers can be vacuum-pressed prior to assembly and the assembly can be vacuum-pressed after assembly.\",\n \"The inventors have determined that use of vacuum-pressed SIS provides desirable durability and profile characteristics.\",\n \"When using a vacuum-pressed layers of an ECM material, such as SIS, any suitable number of vacuum-pressed layers can be used.\",\n \"The inventors have determined that a tissue adjustment implant having a main body formed of between 4 and 60 layers provides a particularly advantageous structure for tissue adjustment implants intended for use in supporting the soft palate of a patient, such as in methods of treating OSA.\",\n \"A main body formed of between 10 and 50 layers is also considered particularly advantageous.\",\n \"A main body formed of between 20 and 40 layers is also considered particularly advantageous.\",\n \"A main body formed of between 25 and 35 layers is also considered particularly advantageous.\",\n \"A main body formed of about 30 layers is also considered particularly advantageous.\",\n \"The inventors have determined that a tissue adjustment implant comprising a multilaminate construct comprised of 30 layers of vacuum-pressed SIS provides a suitable structure for use in methods of treating OSA.\",\n \"The inventors have determined that a hybrid structure may provide a desirable balance between desired overall rigidity for the tissue adjustment implant and relative remodeling time.\",\n \"In this embodiment, a middle portion of the tissue adjustment implant is formed of lyophilized SIS, which provides a relatively quicker remodeling time, and the perimeter sections, including the ribbed portions, are formed of vacuum-pressed SIS, which provides a relatively high degree of overall rigidity.\",\n \"The middle portion in this embodiment is expected to remodel relatively quickly following implantation, enhancing the securement of the tissue adjustment implant.\",\n \"An opposite structure is also considered suitable and may be advantageous in certain circumstances.\",\n \"A hybrid structure in which a mesh is embedded inside an SIS or other composition or between layers of SIS or of other material is also considered suitable.\",\n \"For example, a polymeric mesh, such as a mesh formed of polypropylene, can be disposed between layers of SIS during formation of the tissue adjustment implant.\",\n \"In these embodiments, the polymeric mesh will remain in the body following completion of remodeling by the SIS, which may enhance the overall anchoring of the supported tissue over time.\",\n \"A bioabsorable mesh, such as a mesh formed of polyglycolic acid or other bioabsorbable material, can also be included in the tissue adjustment implant in this manner and may be advantageous where supplemental support is desired that lasts beyond the remodeling time for the SIS, but that does not have the permanency associated with a polypropylene or other polymeric mesh.\",\n \"Examples of suitable structural arrangements of polymer and remodelable layers can be found in United States Patent Application Publication No.\",\n \"2011/0166673 to Patel et al., for QUILTED IMPLANTABLE GRAFT, the entire contents of which are hereby incorporated into this disclosure.\",\n \"A tissue adjustment implant, or portions thereof, can also be coated with particular materials to provide a desired property or properties.\",\n \"For example, the inventors have determined that coating a tissue adjustment implant with poly(lactic-co-glycolic acid) (PLGA) provides a desirable stiffening effect to the implant while also providing an agent that promotes an inflammatory response in tissue within which the tissue adjustment implant has been placed.\",\n \"In tissue adjustment implants that comprise a multilaminate construct, as describe above, a coating can be applied between layers during fabrication.\",\n \"For example, PLGA can be applied to or embedded within one, two, a plurality of, or all of the layers when making a main body that comprise a multilaminate construct.\",\n \"The tissue adjustment implants are implanted by forming an opening in a target tissue, passing the first end of the tissue adjustment implant through the opening and into the tissue until the plug contacts the tissue surrounding the opening.\",\n \"If desired, additional pulling force can be applied to the first end to lift or otherwise adjust the position of the tissue through interaction with the plug.\",\n \"Once a desired position is achieved, a portion of the tissue adjustment implant, such as a portion near the first end of the tissue adjustment implant, can be sutured to the tissue.\",\n \"This is beneficial for maintaining the adjusted position of the tissue.\",\n \"After passing the first end of the tissue adjustment implant through the opening in the tissue and into the tissue, the first end of the tissue adjustment implant, or a lead attached to it, can be manipulated to exit the tissue, either through an existing opening or by forming an opening, at a point at a distance from the opening through with the tissue adjustment implant entered the tissue.\",\n \"This is particularly advantageous for tissue adjustment implants that include a lead, such as a needle and suture attached to a first end of the tissue adjustment implant.\",\n \"Also, if desired, the tissue adjustment implant can be trimmed of excess main body such that the remainder of the tissue adjustment implant is flush or substantially flush with the opening through which the tissue adjustment implant exits the tissue.\",\n \"If this is performed, it is advantageously performed after the tissue adjustment implant is secured to the tissue, if performed, such that any desired adjusted position of the tissue is maintained after the trimming is completed.\",\n \"The tissue adjustment implants are particularly well-suited for adjusting the position of the soft palate of a patient, such as a human being.\",\n \"Such an adjustment may be beneficial in the treatment of Obstructive Sleep Apnea (OSA).\",\n \"FIG.\",\n \"5 illustrates a schematic of an oral cavity 1300 of a patient within which first 1310a and second 1310b tissue adjustment implants have been placed.\",\n \"In this example, each of the tissue adjustment implants 1310a, 1310b comprises a tissue adjustment implant according to the embodiment illustrated in FIGS.\",\n \"2 and 2A.\",\n \"The first tissue adjustment implant 1310a has been implanted in the soft palate 1350 on a first side of the uvula 1352 and the second tissue adjustment implant 1310b has been implanted in the soft palate 1350 on a second, opposite side of the uvula 1352.Each tissue adjustment implant 1310a, 1310b has been implanted as described above, such that the respective plugs 1380a, 1380b have been buried just beneath the surface of the tissue of the soft palate 1350.Each tissue adjustment implant 1301a, 1301b was pulled taught after the respective plugs 1310a, 1310b had reached that position to achieve a desired lifting of the rear portion 1352 of the soft palate.\",\n \"Subsequently, the leads (not illustrated in FIG.\",\n \"5) were cut and removed from the tissue adjustment implants and the respective first ends 1314a, 1314b of the tissue adjustment implants 1310a, 1310b were sutured to the tissue of the soft palate 1350 to maintain the adjusted position of the soft palate 1350.In FIG.\",\n \"5, the tissue adjustment implants 1310a, 1310b, were implanted by passing the tissue adjustment implants 1310a, 1310b through an opening made in the tissue toward the rear of the oral cavity 1300 and advancing them toward the front of the oral cavity 1300.While another approach can be used, this approach is suitable for tissue adjustment implants having a plug on their distal end, such as tissue adjustment implants 1310a, 1310b.\",\n \"FIG.\",\n \"13 illustrates another schematic of an oral cavity 1400 of a patient within which first 1410a and second 1410b tissue adjustment implants have been placed.\",\n \"In this example, each of the tissue adjustment implants 1410a, 1410b comprises a tissue adjustment implant according to the embodiment illustrated in FIGS.\",\n \"6, 6A and 6B.\",\n \"The first tissue adjustment implant 1410a has been implanted in the soft palate 1450 on a first side of the uvula 1452 and the second tissue adjustment implant 1410b has been implanted in the soft palate 1450 on a second, opposite side of the uvula 1452.Each tissue adjustment implant 1410a, 1410b has been implanted as described above with respect to the delivery device illustrated in FIGS.\",\n \"8 through 12.In FIG.\",\n \"13, the tissue adjustment implants 1410a, 1410b, were implanted by passing the tissue adjustment implants 1410a, 1410b through an opening made in the tissue toward the front of the oral cavity 1400 and advancing them toward the rear of the oral cavity 1400.While another approach can be used, this approach is suitable for tissue adjustment implants that lack a plug on their distal end and/or that have an anchor portion, such as the arrowhead on each of tissue adjustment implants 1410a, 1410b, on their proximal end, such as tissue adjustment implants 1410a, 1410b.\",\n \"Those with ordinary skill in the art will appreciate that various modifications and alternatives for the described and illustrated embodiments can be developed in light of the overall teachings of the disclosure.\",\n \"Accordingly, the particular arrangements disclosed are intended to be illustrative only and not limiting as to the scope of the invention, which is to be given the full breadth of the appended claims and any and all equivalents thereof.\"\n ]\n]"},"source":{"kind":"string","value":"Patent_15871435"}}},{"rowIdx":4493792,"cells":{"text":{"kind":"list like","value":[["MODULAR ARRAY OF VERTICALLY INTEGRATED SUPERCONDUCTING QUBIT DEVICES FOR SCALABLE QUANTUM COMPUTING","A technique relates to an assembly for a quantum computing device.","A quantum bus plane includes a first set of recesses.","A readout plane includes a second set of recesses.","A block is positioned to hold the readout plane opposite the quantum bus plane, such that the first set of recesses opposes the second set of recesses.","A plurality of qubit chips are included where each has a first end positioned in the first set of recesses and has a second end positioned in the second set of recesses."],["1.An assembly for a quantum computing device comprising: a housing configured as an enclosure having a bottom part, a top part, and a block, the block connecting the top and bottom parts; a quantum bus plane including a first set of recesses; a readout plane including a second set of recesses, wherein the block is configured to position the readout plane opposite the quantum bus plane, such that the first set of recesses opposes the second set of recesses; and a plurality of qubit chips each having a first end positioned in the first set of recesses and having a second end positioned in the second set of recesses.","2.The assembly of claim 1, wherein the housing includes a readout plane housing slot through which the readout plane extends.","3.The assembly of claim 2, wherein the readout plane extends through the readout plane housing slot to connect to a circuit board, the circuit board connecting to a plurality of connectors.","4.The assembly of claim 1, further comprising a pushing mechanism configured to apply pressure to the readout plane.","5.The assembly of claim 4, wherein the pushing mechanism is configured such that the pressure applied to the readout plane forces the plurality of qubit chips to the quantum bus plane.","6.The assembly of claim 4, wherein the pushing mechanism comprises a pusher block positioned on top of the readout plane.","7.The assembly of claim 6, wherein the pushing mechanism comprises a spring mechanism pressing downward against the pusher block.","8.The assembly of claim 7, wherein the top part of the housing is configured to apply a compression force to the spring mechanism from above.","9.The assembly of claim 1, wherein the plurality of qubit chips extend vertically in a lengthwise direction by being positioned in both the first set of recesses and the second set of recesses.","10.The assembly of claim 1, wherein the first set of recesses secures the first end of the plurality of qubit chips in the readout plane.","11.The assembly of claim 1, wherein the second set of recesses secures the second end of the plurality of qubit chips in the quantum bus plane.","12.The assembly of claim 1, wherein the first end of the plurality of qubit chips is opposite the second end.","13.The assembly of claim 1, wherein the quantum bus plane comprises a substrate with interconnect wiring on top of the substrate.","14.The assembly of claim 13, wherein the interconnect wiring connects the plurality of qubit chips via a plurality of coupling bus resonators.","15.The assembly of claim 1, wherein the readout plane comprises a substrate with fan-out wiring on top of the substrate.","16.The assembly of claim 15, where the fan-out wiring individually connects each of the plurality of qubit chips to a circuit board.","17.The assembly of claim 16, wherein the circuit board individually connects each of the plurality of qubit chips to a plurality of connectors in a one-to-one relationship.","18.The assembly of claim 1, wherein the block is configured to receive a first assembly comb and a second assembly comb to form an intersection, the intersection of the first and second assembly combs forming a plurality of slots for individually accepting the plurality of qubit chips.","19.The assembly of claim 18, wherein the plurality of slots mechanically holds the plurality of qubit chips in a vertical position.","20.The assembly of claim 1, wherein the block is made of a superconducting material."],[" BACKGROUND The present invention relates to quantum computing, and more specifically, to a modular array of vertically integrated superconducting qubit devices for scalable quantum computing.","In one approach called circuit quantum electrodynamics, quantum computing employs active superconducting devices called qubits to manipulate and store quantum information, and resonators (e.g., as a two-dimensional (2D) planar waveguide or as a three-dimensional (3D) microwave cavity) to read out and facilitate interaction among qubits.","Each superconducting qubit comprises one or more Josephson junctions shunted by capacitors in parallel with the junctions.","The qubits are capacitively coupled to 2D or 3D microwave cavities.","The energy associated with the qubit resides in the electromagnetic fields around the Josephson junction and especially in the vicinity of relatively larger shunt capacitance structures.","To date, a major focus has been on improving lifetimes of the qubits in order to allow calculations (i.e., manipulation and readout) to take place before the information is lost to decoherence of the qubits.","Currently, superconducting qubit coherence times can be as high as 100 microseconds, and efforts are being made to increase the coherence times.","One area of research with respect to increasing coherence times is focused on eliminating lossy materials from areas of relatively high electromagnetic field energy density such as in the vicinity of sharp corners and edges of the thin films of which the qubits are comprised.","Such materials in proximity to the qubit can include imperfections that support defects known as two-level systems (TLSs)."],[" SUMMARY According to one embodiment, an assembly for a quantum computing device is provided.","The assembly includes a quantum bus plane including a first set of recesses, a readout plane including a second set of recesses, and a block positioned to hold the readout plane opposite the quantum bus plane, such that the first set of recesses opposes the second set of recesses.","Also, the assembly includes a plurality of qubit chips where each has a first end positioned in the first set of recesses and has a second end positioned in the second set of recesses.","According to one embodiment, an assembly for a quantum computing device is provided.","The assembly includes a housing configured as an enclosure having a bottom part, a top part, and a block, in which the block connects the top and bottom parts.","The assembly includes a quantum bus plane including a first set of recesses, and a readout plane including a second set of recesses.","The block is configured to position the readout plane opposite the quantum bus plane, such that the first set of recesses opposes the second set of recesses.","Also, the assembly includes a plurality of qubit chips where each has a first end positioned in the first set of recesses and has a second end positioned in the second set of recesses.","According to one embodiment, a method of configuring an assembly for a quantum computing device is provided.","The method includes providing a housing configured as an enclosure having a bottom part, a top part, and a block, in which the block connects the top and bottom parts.","The method includes providing a readout plane having a first set of recesses and a quantum bus plane having a second set of recesses, and assembling the readout plane opposite the quantum bus plane in a block, such that the first set of recesses opposes the second set of recesses.","Also, the method includes installing a plurality of qubit chips in the block, where each of the plurality of qubit chips has a first end positioned in the first set of recesses and has a second end positioned in the second set of recesses.","In one or more embodiments, the plurality of qubit chips extends vertically in a lengthwise direction by being positioned in both the first set of recesses and the second set of recesses.","The first set of recesses holds the first end of the plurality of qubit chips in the readout plane, and the second set of recesses holds the second end of the plurality of qubit chips in the quantum bus plane.","In one or more embodiments, the first end of the plurality of qubit chips is opposite the second end.","In one or more embodiments, the block is made of a superconducting material.","In one or more embodiments, the quantum bus plane comprises a substrate with interconnect wiring on top of the substrate, and the interconnect wiring connects the plurality of qubit chips via a plurality of coupling bus resonators.","In one or more embodiments, the readout plane comprises a substrate with fan-out wiring on top of the substrate, and the fan-out wiring individually connects each of the plurality of qubit chips to a circuit board.","The circuit board individually connects each of the plurality of qubit chips to a plurality of connectors in a one-to-one relationship.","In one or more embodiments, the block is configured to receive a first assembly comb and a second assembly comb to form an intersection, and the intersection of the first and second assembly combs forms a plurality of slots for individually accepting the plurality of qubit chips.","The plurality of slots mechanically holds the plurality of qubit chips in a vertical position.","Additional features and advantages are realized through the techniques of the present invention.","Other embodiments and aspects of the invention are described in detail herein and are considered a part of the claimed invention.","For a better understanding of the invention with the advantages and the features, refer to the description and to the drawings."],["DOMESTIC PRIORITY This application is a divisional application of and claims priority from U.S. patent application Ser.","No.","15/175,454, filed on Jun.","7, 2016, entitled “MODULAR ARRAY OF VERTICALLY INTEGRATED SUPERCONDUCTING QUBIT DEVICES FOR SCALABLE QUANTUM COMPUTING”, which is a divisional application of and claims priority from U.S. patent application Ser.","No.","14/737,707, filed on Jun.","12, 2015, entitled “MODULAR ARRAY OF VERTICALLY INTEGRATED SUPERCONDUCTING QUBIT DEVICES FOR SCALABLE QUANTUM COMPUTING”, the entire contents of which are incorporated herein by reference.","BACKGROUND The present invention relates to quantum computing, and more specifically, to a modular array of vertically integrated superconducting qubit devices for scalable quantum computing.","In one approach called circuit quantum electrodynamics, quantum computing employs active superconducting devices called qubits to manipulate and store quantum information, and resonators (e.g., as a two-dimensional (2D) planar waveguide or as a three-dimensional (3D) microwave cavity) to read out and facilitate interaction among qubits.","Each superconducting qubit comprises one or more Josephson junctions shunted by capacitors in parallel with the junctions.","The qubits are capacitively coupled to 2D or 3D microwave cavities.","The energy associated with the qubit resides in the electromagnetic fields around the Josephson junction and especially in the vicinity of relatively larger shunt capacitance structures.","To date, a major focus has been on improving lifetimes of the qubits in order to allow calculations (i.e., manipulation and readout) to take place before the information is lost to decoherence of the qubits.","Currently, superconducting qubit coherence times can be as high as 100 microseconds, and efforts are being made to increase the coherence times.","One area of research with respect to increasing coherence times is focused on eliminating lossy materials from areas of relatively high electromagnetic field energy density such as in the vicinity of sharp corners and edges of the thin films of which the qubits are comprised.","Such materials in proximity to the qubit can include imperfections that support defects known as two-level systems (TLSs).","SUMMARY According to one embodiment, an assembly for a quantum computing device is provided.","The assembly includes a quantum bus plane including a first set of recesses, a readout plane including a second set of recesses, and a block positioned to hold the readout plane opposite the quantum bus plane, such that the first set of recesses opposes the second set of recesses.","Also, the assembly includes a plurality of qubit chips where each has a first end positioned in the first set of recesses and has a second end positioned in the second set of recesses.","According to one embodiment, an assembly for a quantum computing device is provided.","The assembly includes a housing configured as an enclosure having a bottom part, a top part, and a block, in which the block connects the top and bottom parts.","The assembly includes a quantum bus plane including a first set of recesses, and a readout plane including a second set of recesses.","The block is configured to position the readout plane opposite the quantum bus plane, such that the first set of recesses opposes the second set of recesses.","Also, the assembly includes a plurality of qubit chips where each has a first end positioned in the first set of recesses and has a second end positioned in the second set of recesses.","According to one embodiment, a method of configuring an assembly for a quantum computing device is provided.","The method includes providing a housing configured as an enclosure having a bottom part, a top part, and a block, in which the block connects the top and bottom parts.","The method includes providing a readout plane having a first set of recesses and a quantum bus plane having a second set of recesses, and assembling the readout plane opposite the quantum bus plane in a block, such that the first set of recesses opposes the second set of recesses.","Also, the method includes installing a plurality of qubit chips in the block, where each of the plurality of qubit chips has a first end positioned in the first set of recesses and has a second end positioned in the second set of recesses.","In one or more embodiments, the plurality of qubit chips extends vertically in a lengthwise direction by being positioned in both the first set of recesses and the second set of recesses.","The first set of recesses holds the first end of the plurality of qubit chips in the readout plane, and the second set of recesses holds the second end of the plurality of qubit chips in the quantum bus plane.","In one or more embodiments, the first end of the plurality of qubit chips is opposite the second end.","In one or more embodiments, the block is made of a superconducting material.","In one or more embodiments, the quantum bus plane comprises a substrate with interconnect wiring on top of the substrate, and the interconnect wiring connects the plurality of qubit chips via a plurality of coupling bus resonators.","In one or more embodiments, the readout plane comprises a substrate with fan-out wiring on top of the substrate, and the fan-out wiring individually connects each of the plurality of qubit chips to a circuit board.","The circuit board individually connects each of the plurality of qubit chips to a plurality of connectors in a one-to-one relationship.","In one or more embodiments, the block is configured to receive a first assembly comb and a second assembly comb to form an intersection, and the intersection of the first and second assembly combs forms a plurality of slots for individually accepting the plurality of qubit chips.","The plurality of slots mechanically holds the plurality of qubit chips in a vertical position.","Additional features and advantages are realized through the techniques of the present invention.","Other embodiments and aspects of the invention are described in detail herein and are considered a part of the claimed invention.","For a better understanding of the invention with the advantages and the features, refer to the description and to the drawings.","BRIEF DESCRIPTION OF THE DRAWINGS The subject matter which is regarded as the invention is particularly pointed out and distinctly claimed in the claims at the conclusion of the specification.","The forgoing and other features, and advantages of the invention are apparent from the following detailed description taken in conjunction with the accompanying drawings in which: FIG.","1 is a schematic illustrating a transparent view of part of the modular array of vertically integrated superconducting qubit chips according to an embodiment; FIG.","2 is a schematic illustrating a quantum bus plane design according to an embodiment; FIG.","3 is a schematic illustrating the readout plane in an inverted view according to an embodiment; FIG.","4 is a schematic of an example qubit chip according to an embodiment.","FIGS.","5A through 5F illustrate an assembly and packaging technique for the modular array of vertically integrated superconducting qubit chips according to an embodiment, in which: FIG.","5A is a schematic of an assembly illustrating assembly combs for a block; FIG.","5B is a schematic of the assembly illustrating the assembly combs in place to form slots for orienting the superconducting qubit chips; FIG.","5C is a schematic of the assembly illustrating the installation of the superconducting qubit chips in the slots formed by the assembly combs; FIG.","5D is a schematic of the assembly illustrating installation of the readout plane in the block; FIG.","5E is a schematic of the assembly illustrating a view underneath the block; FIG.","5F is a schematic of the assembly illustrating that a pusher block applies pressure to hold the superconducting qubit chips in place; FIG.","6 is a method of configuring an assembly according to an embodiment; and FIG.","7 is a method of configuring an assembly according to an embodiment.","DETAILED DESCRIPTION Superconducting Josephson-junction based qubits are promising candidates for fault-tolerant quantum computing.","As a solid-state technology, it has always held the potential of simpler scalability via existing integration techniques.","Superconducting circuit and device fabrication can leverage well-known lithographic methods which can lead to quantum integrated processors with a high density of qubits.","Furthermore, superconducting qubits operate in the microwave frequency regime, allowing for all-electrical control of the qubits and other elements which might be in the system.","The other elements may include microwave resonators, active filters, quantum-limited amplifiers, etc.","A state-of-the-art fault-tolerant quantum computing architecture which has gathered interest recently is the surface code.","In the surface code, qubits are arranged in a lattice with only the nearest neighbor interactions required.","For superconducting qubits, the surface code is an attractive path forward as defining multiple qubits in a nearest-neighbor lattice.","Moreover, the error thresholds which are required for the surface code are within reach for superconducting qubits with the current levels of coherence.","One particular physical proposal in the state-of-the-art for realizing the surface code with superconducting qubits is the skew-symmetric layout.","In this lattice, each superconducting qubit is coupled to two separate linking bus resonators.","The coupling of superconducting qubits with microwave resonators is known as circuit quantum electrodynamics (cQED).","The microwave resonators are typically defined as planar stripline resonators but can also be modes within three-dimensional (3D) waveguide cavities.","Although it may appear simple to design a large lattice of many superconducting qubits and stripline resonators lithographically, getting every resonator mode and every qubit to work as desired together is a challenge.","For example, crosstalk between resonators and superconducting qubits as well as undesired spurious modes can result in stray couplings between quantum objects.","Crosstalk is defined here as any unwanted coupling of microwave signals between qubit or resonator channels, other than those desired and defined by wiring.","Furthermore, although it may appear easy to optimize parameters for a single qubit and a single cavity mode, once these individual qubits are re-arranged in a larger network and all defined on the same chip, their (collective) behavior can change and can be difficult to then debug.","According to embodiments discussed herein, a vertically integrated multi-chip architecture is provided, with discrete superconducting chip pieces comprised of superconducting qubits and their readout resonators.","The superconducting qubits, along with their readout resonators, are then all arranged to mate in a matrix sandwiched by two larger carrier chips.","These two larger carrier chips serve two purposes: one purpose is to integrate multiple resonator quantum buses to couple the superconducting qubits together (thereby coupling quantum information between qubits), and the other purpose permits physical connections via fan-out wiring to explicit microwave controls.","This embodiment realizes a scalable architecture for quantum computation using well-established technology, while obviating challenging silicon integration techniques, such as thru-silicon-vias (TSVs) and multi-level lithography.","There are two physically different methods for implementing superconducting quantum processors via the circuit quantum electrodynamics (cQED) architecture, which are a 2D planar lithographic method and a 3D waveguide cavity method.","The quantum processor refers to the entirety of the assembled components.","2D Planar Integration: The integration of qubits and resonators for 2D cQED is started via depositing superconducting films on silicon or sapphire substrates.","Some typical superconducting films used are niobium (Nb), aluminum (Al), titanium nitride (TiN), and niobium nitride (NbN).","Resonators (including readout resonators) are commonly defined in these superconducting films using coplanar waveguides, microstrips, coplanar striplines, or lumped element inductors and capacitors.","Subsequently, superconducting qubits with Josephson junctions, such as the transmons, phase-qubits, or flux-qubits are also lithographically patterned via either electron-beam or optical lithography.","Scaling up to larger quantum processors in this scheme requires a larger and larger chip to accommodate more resonators for coupling, more qubits, and more readout resonators.","Using this 2D integration technique, processors up to 9 qubits have been devised in a linear chain, and 8 qubits in a latticed architecture.","As the number of qubits in the 2D processor scales up, input-output (I/O) becomes increasingly challenging.","In order to avoid crosstalk and integrate appropriate fan-out, technologies such as 3D integrated flip-chips, air-bridge crossovers, thru-silicon vias, and multi-layer lithography are required.","As more and more of these different fabrication processes are required to scale up to larger quantum processors, the potential influence and degradation on the superconducting qubits increases rapidly.","Therefore using these advanced fabrication techniques can lead to many different sources of decoherence in the qubits.","For some of these processes, it could be necessary to perform them after Josephson junctions are lithographically defined.","The impact and losses on Josephson junction based superconducting qubits after these processing steps are then a particular concern as to whether high coherence can continue to be preserved.","Accordingly, this makes full-scale integration of a large system having a large number of qubits challenging.","Embodiments include various features: 1) An array of vertical superconducting qubit chips is mounted to a silicon quantum bus plane and mounted to a separate qubit addressing and readout plane.","2) A quantum bus (QB) plane lithographically is defined on silicon which permits the coupling of quantum information among individual vertical superconducting qubit chips.","3) A readout (RO) plane couples each superconducting qubit chip's readout resonator to an integrated microwave bandwidth transmission line which follows onto a flexible circuit board thus connecting each superconducting qubit chip's readout resonator a coaxial connector for input/output (I/O).","4) Vertical superconducting qubit chips each contain a single superconducting qubit (also referred to as a tunnel junction, such as a Josephson junction) and on-chip readout resonator, designed in a way to effectively couple to the quantum bus plane and the readout plane.","Each individual vertical superconducting qubit chip is designed to have a specific lithographically-defined coupling capacitance between the tunnel junction to the quantum bus plane on one end and between the readout resonator and the addressing transmission line of the readout plane on the other end.","5) All silicon elements are retained within a well-thermalized metal housing (e.g., copper) which provides mechanical support, alignment, and thermal contact.","According to embodiments, the technique discussed herein is an approach for assembling the modular array of superconducting qubit chips into a scalable quantum processor, commensurate with latticed architectures for quantum error correction, such as the surface code.","Now turning to the figures, FIG.","1 is a schematic illustrating a transparent view of part of the modular array of vertically integrated superconducting qubit devices according to an embodiment.","FIG.","1 shows a quantum bus plane 100, a readout plane 102, and superconducting vertical qubit chips 101.The superconducting vertical qubit chips 101 are also referred to as qubit dies, qubits, etc.","The readout plane 102 and the quantum bus plane 100 sandwich the qubit chips 101 in between.","FIG.","2 is a schematic illustrating a quantum bus plane design of the quantum bus plane 100 according to an embodiment.","The quantum bus plane design illustrates a surface code example.","The quantum bus plane 100 may be made of a semiconductor material as the substrate, such as, e.g., silicon, sapphire, etc.","The semiconductor material has interconnect wiring 202 deposited on top of the semiconductor material.","The interconnect wiring 202 is made of a superconducting material.","Superconducting material may be defined as a material that can conduct electricity or transport electrons from one atom to another with no resistance when the superconducting material has reached “critical temperature” (Tc), or the temperature at which the material becomes superconductive.","Conducting electricity or transporting electrons from one atom to another with no resistance means that no heat, sound, or any other form of energy would be released from the material as understood by one skilled in the art.","The quantum bus plane 100 connects each individual qubit chip 101 via interconnect wiring 202.The interconnect wiring 202 connects (e.g., capacitively) to each superconducting qubit chip 101 installed in the quantum bus plane 100.The interconnect wiring 202 includes coupling bus resonators 205 positioned between each superconducting vertical qubit chip 101.Particularly, superconducting vertical qubit chips 101 are configured to couple together through the coupling bus resonators 205.To assist with securing and positioning superconducting vertical qubit chips 101 on the quantum bus plane 100, the quantum bus plane 100 includes etched recesses 201 at the locations to insert each of the superconducting vertical qubit chips 101.The etched recesses 201 are pockets that individually fit the superconducting vertical qubit chips 101 into specific locations in the quantum bus plane 100.The etched recesses 201 in the quantum bus plane 100 help to define accurate capacitive coupling between the qubit chips 101 and the interconnect wiring 202.The etched recesses 201 determine how deeply the vertical qubit chips 101 sit into the quantum buss plane 100 and thus determine the vertical separation between the capacitor pads on the qubit chip 101 and those on the quantum buss plane 100.The etched recesses 201 are etched into the semiconductor substrate of the quantum bus plane 100.Accurate vertical separation of these coupling pads is a prerequisite for achieving a precise coupling capacitance value.","The coupling capacitor pad 404 is shown in FIG.","4 and the quantum bus plane 100 has coupling pad 250 in front of each etched recess 201.For the sake of clarity and so as not to obscure FIG.","2, only two superconducting vertical qubit chips 101 are shown in FIG.","2 although it is understood that each row, e.g., rows 1-4, are filled with superconducting vertical qubit chips 101.One superconducting vertical qubit chip 101 is shown as a code superconducting vertical qubit chip in row 1, and the other superconducting vertical qubit chip 101 is a syndrome superconducting vertical qubit chip in row 2.In one implementation, each row may be filled with the same type of superconducting vertical qubit chip 101.For example, row 1 may be filled with code superconducting vertical qubit chips 101, while row 2 is filled with syndrome superconducting vertical qubit chips 101.Row 3 may be filled with code superconducting vertical qubit chips 101, while row 4 is filled with syndrome superconducting vertical qubit chips 101.Although only 4 rows are shown for the sake of illustration, it is contemplated that M numerous rows may be included on the quantum bus plane 100, where M is the last row.","A code qubit stores quantum information for operation of the quantum processor.","A syndrome qubit measures and extracts any errors in the system without corrupting the information present in the code qubit.","These terms are commonly applied when discussing “surface code error correction.” According to an embodiment, FIG.","3 is a schematic illustrating the readout plane 102 in an inverted view.","FIG.","3 shows the backside of the readout plane 102, and the backside faces the quantum bus plane 100 (not shown in FIG.","3).","The readout plane 102 may be made of a semiconductor material as the substrate, such as, e.g., silicon, sapphire, etc.","The semiconductor material has fan-out wiring 302 deposited on top of the semiconductor material.","The fan-out wiring 302 may be made of a superconducting material.","The readout plane 102 includes etched recesses 301 at locations to insert each of the superconducting vertical qubit chips 101.Each etched recess 301 is a pocket that individually fits a single superconducting vertical qubit chip 101 into a specific location in the readout plane 102, analogous to the etched recesses 201 in the quantum bus plane 100 in FIG.","2.The etched recesses 301 in the readout plane 102 capacitively connect the superconducting vertical qubit chips 101 to the fan-out wiring 302 via the capacitor pads defined on the upper end of the vertical qubit chip 101 and on the readout plane 102.At the upper end, the vertical qubit chip 101 has coupling capacitor pad 401 as shown in FIG.","4, while the readout plane 102 has a coupling pad 350 in front of each etched recesses 301.The fan-out wiring 302 has transmission lines 320.Each transmission line 320 individually connects to a single superconducting vertical qubit chip 101 in a one-to-one relationship.","The etched recesses 301 serve both a mechanical purpose and an electrical purpose.","Mechanically, the etched recesses 301 serve as a slot/pocket to insert each superconducting vertical qubit chip 101.Electrically, the etched recesses 301 align each superconducting vertical qubit chip 101 to an individual transmission line 320 of the fan-out wiring 302.The fan-out wiring 302 individually couples to each superconducting vertical qubit chip 101.Also, the fan-out wiring 302 individually connects each superconducting vertical qubit chip 101 to a flexible circuit board 303.The fan-out wiring 302 does not affect quantum information on the superconducting vertical qubit chips 101.The fan-out wiring 302 connects the superconducting vertical qubit chips 101 to the outside environment (e.g., the 50 ohm (Ω) environment).","The flexible circuit board 303 individually connects each superconducting vertical qubit chip 101 to an individual connector 304 via the fan-out wiring 302.Although the flexible circuit board 303 is shown as one implementation, it is contemplated that other type of circuit boards or electrical connections may be utilized.","The connectors 304 individually connect the superconducting vertical qubit chips 101 to external electronics (not shown).","The connectors 304 may be microwave connectors in which microwave signals may be input and qubit states can be read.","Each connector 304 has a one-to-one relationship to a single superconducting vertical qubit chip 101 on the readout plane 102, such that each superconducting vertical qubit chip 101 is individually addressable through a single connector 304, through the flexible circuit board 303, through the fan-out wiring 302, a particular transmission line 320, and through an individual etched recess 301.In one implementation, the connectors 304 may coaxial cable connectors configured to connect to coaxial cables.","Although not shown so as not to obscure FIG.","3, it is understood that conductive wiring runs through the flexible circuit board 303 and that wiring connects the flexible circuit board 303 to each respective connector 304 as understood by one skilled in the art.","The conductive wiring of the flexible circuit board 303 may be made of superconducting or normal material.","FIG.","4 is a schematic of an example superconducting vertical qubit chip 101 according to an embodiment.","Various details of the superconducting vertical qubit chips 101 are shown in FIG.","4.The superconducting vertical qubit chips 101 may have a substrate made of a semiconductor material, such as, e.g., silicon, sapphire, etc.","Each qubit chip 101 is an integrated circuit.","Conductive material is deposited and patterned on the substrate of the superconducting vertical qubit chips 101 to form the integrated circuit.","The superconducting vertical qubit chips 101 are not a monolithic wafer.","Rather, the superconducting vertical qubit chips 101 are formed from a wafer (substrate) diced into individual qubit dies.","Each diced superconducting vertical qubit chip 101 includes a coupling capacitor pad 401.The coupling capacitor pad 401 is a capacitor that capacitively couples each superconducting vertical qubit chip 101 to the readout plane 102 via the fan-out wiring 302, when the superconducting vertical qubit chip 101 is inserted in its etched recess 201.Accordingly, on one end of the superconducting vertical qubit chip 101, that end is electrically connected to the readout plane 102 through the coupling capacitor pad 401 and coupling pad 350 on the readout plane 102.It is noted that, for coupling capacitor pads 401 and 350 and coupling capacitor pads 404 and 250, the coupling capacitors may be defined by metal pads that are at right angles to each other, with a well-defined vertical separation.","The two types of coupling capacitors are quantum buss plane to lower side of qubit chip, and upper side of vertical qubit chip to readout plane.","It should be understood that two metal surfaces (pads in this case) at right angles to each other, separated by some distance, define a capacitor.","Embodiments exploit this fact to permit accurate coupling between circuit elements without resorting to wire bonds across right angle connections.","Additionally, each superconducting vertical qubit chip 101 includes coupling capacitor pads 404.The coupling capacitor pads 404 form a capacitor, and between the two coupling capacitor pads 404 is a tunnel junction 403 (sometimes called the qubit), such as, e.g., a Josephson junction.","The coupling capacitor pads 404 form a capacitor that capacitively couples to the quantum bus plane 100 via the interconnecting wiring 202.Accordingly, on the opposite end to the coupling capacitor pad 401, the opposite end is electrically connected to the quantum bus plane 100 through the coupling capacitor pads 404.The superconducting vertical qubit chip 101 includes readout resonator 402.The readout resonator 402 is configured with a resonance frequency designed to read the state of the qubit tunnel junction 403.The readout resonator 402 is positioned between the coupling capacitor pad 401 and the coupling capacitor pads 404.The readout resonator 402 is formed of conductive material that connects the coupling capacitor pad 401 and the coupling capacitor pads 404.The conductive material is a superconducting material, which forms the circuit.","The superconducting vertical qubit chip 101 includes a ground plane 405 surrounding the circuit of the coupling capacitor pad 401, the coupling capacitor pads 404, and the readout resonator 402.The material of the substrate separates the ground plane 405 from the circuit.","According to an embodiment, an assembly and packaging technique for the modular array of vertically integrated superconducting qubit chips 101 is discussed below in FIGS.","5A, 5B, 5C, 5D, 5E, and 5F.","FIG.","5A illustrates part of an assembly 500.The assembly 500 has a copper block 502.The copper block 502 includes a readout plane slot 503.The readout plane 102 is to be inserted into the readout plane slot 503 as discussed further below.","Although a copper block 502 is illustrated, the block 502 may be made of other materials.","The block 502 can be constructed of a variety of materials provided they give high thermal conductivity.","Examples other than copper include brass, sapphire, silicon, silver, aluminum, and/or niobium.","Assembly combs 520A and 520B are utilized to orient alignment of the superconducting vertical qubit chips 101 for assembly with the readout plane 102 (in the etched recesses 201) and quantum bus plane 100 (in the etched recesses 301) within the copper block 502.Both assembly combs 520A and 520B have teeth with predefined spacing.","For example, the assembly comb 520A has teeth 525A and the assembly comb 520B has teeth 525B.","In one implementation, the spacing of the teeth 525A is larger than the spacing of the teeth 525B, and the spacing of the teeth 525A and 525B is based on accommodating the cross-section size of the superconducting vertical qubit chips 101.The copper block 502 includes assembly slots 501A and 501B.","The assembly comb 520A is inserted into the assembly slot 501A, and the assembly comb 520B is inserted into the assembly slot 501B.","One assembly slot is positioned higher than the other assembly slot such that the assembly combs 520A and 520B define the desired alignment slots where they cross over and under each other but do not interfere with each other when inserted into their respective assembly slots 501A and 501B.","FIG.","5B is a schematic of the assembly 500 showing the assembly combs 520A and 520B in place within the copper block 502 according to an embodiment.","Slots 525 are formed by the intersection of the assembly combs 520A and 520B while in the copper block 502.The slots 525 are utilized to orient the superconducting vertical qubit chip 101.In particular, the slots 525 are formed by the spacing of the teeth 525A and 525B such that the slots 525 can accommodate the size of the superconducting vertical qubit chips 101.In one implementation, the spacing of the slots 525 may be about 5 millimeters (mm) in the x-axis and may be about 5 mm in the y-axis.","In one implementation, each superconducting vertical qubit chip 101 may have approximate dimensions of 8 mm tall by 2 mm wide by 0.7 mm thick.","Also, to accommodate the size of the superconducting vertical qubit chips 101, the etched recesses 201 and 301 may be about 0.7 mm in the x-axis and about 2 mm in the y-axis.","The etched recessed 201 and 301 may have a depth of about 0.35 mm in the z-axis.","FIG.","5C is a schematic of the assembly 500 showing an abbreviated view inside the copper block 502 (not shown) which is part of a housing 550 (shown in FIG.","5F) according to an embodiment.","In FIG.","5C, the abbreviated view omits certain elements in order to simplify the assembly 500 for better understanding.","The walls of the housing copper block 502 are removed, and only a copper base 530 of the housing 550 is shown.","The quantum bus plane 100 is attached to and/or positioned on the copper base 530.The intersecting assembly combs 520A and 520B are in place (within the copper block 502) forming the slots 525.Aligned through the slots 525, a few example superconducting vertical qubit chips 101 are installed into (the etched recesses 201 in) the quantum bus plane 100.The slots 525 directly align to individual etched recesses 201 below and provide a guide during installation of the superconducting vertical qubit chips 101.FIG.","5D is a schematic of the assembly 500 showing a transparent view into the copper block 502 according to an embodiment.","FIG.","5D shows the readout plane 102 installed into the copper block 502 and extending outside of the copper block 502 through readout plane housing slot 585.In one implementation, the quantum bus plane 100 fits into the bottom of the copper block 502.In another implementation, the copper block 502 may sit on top of the quantum bus plane 100.The superconducting vertical qubit chips 101 are sandwiched between the readout plane 102 and the quantum bus plane 100, and the ends of the superconducting vertical qubit chips 101 fit into the etched recesses 201 and 301 of the quantum bus plane 100 and readout plane 102, respectively.","For simplicity and ease of understanding, only a few superconducting vertical qubit chips 101 are shown in FIG.","5D.","Also, so as not to obscure FIG.","5D, the assembly combs 520A and 520B are not shown in this figure.","A board clamp 555 holds and attaches to portion of the readout plane 102 extending outside of the housing.","The board clamp 555 holds and attaches the readout plane 102 to the flexible circuit board 303.Outside of the housing 550, the connectors 304 are on a rigid circuit board 330 and connected to the flexible circuit board 303.The circuit board 330 comprises circuits (not shown) individually connecting each connector 304 to an individual circuit within the flexible circuit board 303, as understood by one skilled in the art.","FIG.","5E is a schematic of the assembly 500 showing a view underneath the housing 500 according to an embodiment.","The copper base 530 of the housing is removed.","FIG.","5E allows the bottom of the quantum bus plane 100 to be viewed.","FIG.","5E also shows that wire bonds 578 connect the readout plane 102 to the board clamp 555.These wire bonds 578 create an electrical connection between the fan-out wiring 302 on the readout plane 102 and the conductors (of whatever type) on the flexible circuit board 303.Although it possible to mechanically bond the flexible circuit board 303 directly to the silicon readout plane 102, those two items, however, have extremely different thermal expansion coefficients which may cause the connections to break over time.","Wire bonds 578 being flexible permit long-term reliability over many thermal cycles.","In one implementation, the two readout planes are to be made of the same material so any dimensional changes from thermal expansion are the same for both planes.","FIG.","5F is a schematic of the assembly 500 according to an embodiment.","FIG.","5F shows that a pusher block 570 pushes the readout plane 102 firmly against the superconducting vertical qubit chips 101.The pusher block 570 is spring loaded.","The constant pressure of the pusher block 570 ensures that the superconducting vertical qubit chips 101 stay in the etched recesses 201 and 301.The force of the pusher block 570 is caused by a spring mechanism 575 attached to a top cap 582 of the housing 550.As can be seen in FIG.","5F, the housing 550 is an enclosure.","The housing 550 may be made of copper, silver, brass, silicon, sapphire, aluminum, and/or niobium.","The housing 550 includes the copper block 502, the copper base 530, the pusher block 570, and the top cap 582.In one implementation, the assembly combs 520A and 520B may remain in the copper block 502 after the superconducting vertical qubit chips 101 have been installed (i.e., inserted into the etched recesses 201 and 301 of the quantum bus and readout planes 100 and 102, respectively).","In another implementation, the assembly combs 520A and 520B may be removed from the copper block 502 after installing the superconducting vertical qubit chips 101, such that the assembly combs 520A and 520B are not in the housing 550.For ease of understanding, sub-headings are provided below.","The sub-headings are meant for explanation purposes and not limitation.","Standardized Fabrication of Elements: Each of the discussed silicon elements, such as, e.g., the quantum bus plane 100, superconducting vertical qubit chips 101, and readout plane 102, use well-established lithographic technology that is time tested in the superconducting qubit community and thus understood by one skilled in the art.","In one embodiment, the materials are standardized to niobium for the resonator and transmission line elements; the materials are aluminum and native aluminum oxide for the qubit junction fabrication (i.e., the qubit tunnel junction 403) via standard double-angle evaporation.","All lithography may be performed on high-resistivity silicon wafers with established loss parameters appropriate for qubit technology, as understood by one skilled in the art.","The readout resonator 402 is in on the vertical qubit chip 101, and transmission line elements are any other wiring on the quantum buss plane 100, the qubit chip 101, and the readout plane 102.In one implementation, the readout resonators 402 may be of a different material than the wiring.","In another implementation, the readout resonators 402 and wiring may be fabricated from a variety of all the same materials.","In yet another implementation, the readout resonators 402 and various different portions of the wiring may be fabricated from a variety of different materials for each sub-category of function.","Complete assembly of a scalable quantum processor with N qubits (i.e., N qubit chips 101) is achieved without resorting to any multi-level lithography, inserted ground planes, cross-overs, or thru-silicon-vias (TSVs).","Using current standard lithographic techniques, embodiments allow the straightforward integration of N=100 to 1000 superconducting vertical qubit chips 101, taking up a space roughly the size of a deck of playing cards (e.g., 2.5×3.5 inches or 64×89 mm).","Design of Individual Qubit Chips and Coupling Capacitance Choices: From electromagnetic simulations for reasonable parameters of qubit tunnel junctions 403, readout resonators 402, and quantum bus planes 100, it is possible to achieve the desired precise coupling capacitance values with the geometry described herein.","Each individual superconducting vertical qubit chip 101 contains a capacitor (i.e., coupling capacitor 404) that couples signal to the quantum bus traces (i.e., interconnect wiring 202) on the quantum bus plane 100.The capacitor (coupling capacitor 404) provides coupling that is appropriate for a specific universal two-qubit entangling gate.","The capacitor is formed by an electrode on the lower end of the vertical qubit chip 101 which couples to electrodes on the quantum buss plane 100.The approximate range in this implementation for the capacitor value is around 7 to 5 femto Farads.","The interconnection between the superconducting vertical qubit chip 101 and the etched recesses 201 (pocket) in the quantum bus plane 100 is designed to minimize stray coupling between the qubit signals and ground plane 405.On the other end of the superconducting vertical qubit chip 101, the interconnection with the readout plane 102 creates a specific capacitance between the readout resonator 402 and the control transmission line 320 (of the fan-out wiring 302) such that the readout resonator 402 has a well-defined quality factor and permits a high fidelity readout.","This capacitor (i.e., coupling capacitor pad 401) is formed by an electrode on the superconducting vertical qubit chip 101 (qubit die) which couples to an electrode (a portion of the control transmission line 320) on the readout plane 102.The approximate value of this capacitor in this implementation is around 5 to 7 femto Farads, for example.","Each superconducting vertical qubit chip 101 is metalized on the backside with superconductor material to control stray coupling and other electric fields within the processor housing 550.The backside of the superconducting vertical qubit chip 101 is opposite the circuit of the coupling capacitor pad 401, the coupling capacitor pads 404, and the readout resonator 402 on the front side.","Note that all capacitor values and uncertainty are determined by lithographic feature sizes and depth of etches.","These values are easily changed and provide for sufficient accuracy for the circuit tolerances required for embodiments.","Design of Quantum Bus Plane: The fabrication process of the quantum bus plane 100 can begin with standard 2D integration techniques.","In one implementation, niobium is electro-sputtered onto a silicon substrate 590.Multiple masks, having the quantum bus designs and having the etched recesses 201 (pockets) where qubit chips 101 are to be mounted, may be used for reactive ion etching (RIE) of the niobium.","The quantum bus design mask defines the coupling bus resonators 205 which couple quantum information among the superconducting vertical qubit chips 101.The pocket mask (for making the etched recesses 201) defines the locations to etch down into the silicon for the individual superconducting vertical qubit chips 101 to be mounted.","The process for the pocket mask etch may be similar to most 3D integration schemes, except in this case the sputtered niobium is used as a hardmask to first define the pockets (i.e., etched recesses 201).","Definition of the pocket (i.e., etched recess 201) in the silicon substrate 590 can be achieved using a deep silicon dry etch process, reactive ion etching (RIE), or a wet chemistry (tetramethyl ammonium hydroxide (TMAH)).","The pockets (i.e., etched recesses 201) of the quantum bus plane 100 are arranged in a grid structure where successive rows are offset, one corresponding to superconducting vertical code qubit chips, and the other row corresponding to superconducting vertical syndrome qubits chips 101 for error detection via measurement.","Each qubit chip pocket (i.e., etched recess 201) is arranged to couple to two coupling bus resonators 205 defined on the quantum bus plane 100 in one implementation.","Note that this arrangement is not the only way to realize the surface code, as one can also couple either three or four coupling bus resonators 205 to a single superconducting vertical qubit chip 101 in another implementation.","Location accuracy of the qubit chip pockets (etched recesses 201 (including etched recesses 301 in readout plane 102) is determined by the lithography and depth accuracy as determined by the etch time.","The pockets are formed with a chamfered or bell-mouthed opening to allow easy insertion of each superconducting vertical qubit chip 101 (qubit die).","Depending on results from scaling to larger N (i.e., a larger amount of superconducting vertical qubit chips 101), the quantum bus plane 100 may be admissible to more integration techniques such as TSVs for chip-mode reduction.","The nuance here is that no Josephson junctions (qubits) 403 need to be defined in this quantum bus plane 100, so there would be minimal effect on qubit coherence with further integration of the quantum bus plane 100.Design of Readout Plane: The readout plane 102 starts off similar to the quantum bus plane 100, with niobium conductors etched lithographically on a silicon substrate 595.Co-planar transmission lines 320 are patterned on the readout plane 102 in a fan-out configuration (i.e., fan-out wiring 302) so as to bring external signals into and out of each superconducting vertical qubit chip 101.These transmission lines 320 are defined in a coplanar waveguide, and support 50Ω microwave driving of both readout and qubit control signals.","All these transmission lines 320 meander through the readout plane 102 terminating on one edge in wire bond pads 370.The wire bond pads 370 are on the extreme right end of the fan-out wiring 302.Similar to the quantum bus plane, pockets (i.e., etched recesses 301) in the readout plane 102 are likewise defined via deep etching into the silicon substrate 595 of the readout plane 102, in corresponding locations as the etched recesses 201 in the quantum bus plane 100 so as to accept the mounting of the individual superconducting vertical qubit chips 101.These pockets (i.e., etched recesses 301) may be chamfered or otherwise bell-mouthed for ease of assembly and locating of structure.","The microwave signals for control and readout are carried off the readout plane 102 via wire bonds 578 to the flexible circuit board 303 which conducts to other transmission lines embedded in a separate rigid circuit board 330 populated with connectors 304 leading to external components.","Ground Planes in Quantum Bus Plane and Readout Plane Pockets: After etching qubit chip pockets (etched recesses 201, 301) in both the quantum bus and readout planes 100 and 102 respectively, these pockets (etched recesses 201, 301) are coated with niobium via sputtering to form continuous ground plane.","These ground planes are designed to mate to the ground planes 405 that exist on the extreme ends of each superconducting vertical qubit chip 101 to form a continuous electrostatic ground between the quantum bus and readout planes 100 and 102, respectively; the continuous electrostatic ground between the quantum bus and readout planes 100 and 102 (respectively) serves to (1) further isolate each qubit site (i.e., locations of etched recesses 201, 301) from spurious modes, (2) isolate each qubit site (i.e., locations of etched recesses 201, 301) from adjacent qubit superconducting vertical qubit chips 101, and (3) eliminate unwanted cross-talk coupling between superconducting vertical qubit chips 101.Assembly of Modular Array Elements: 1.Each individual superconducting vertical qubit chip 101 is located by an etched recess 201 formed in the quantum bus plane 100 and an etched recess 301 formed the readout plane 102.In one implementation, the etched recesses 201, 301 are accurately formed in the silicon substrates 590, 595 using a standard wet etch process.","2.Each individual superconducting vertical qubit chip 101 is chosen for desirable electrical characteristics such as transition frequency.","In some cases the syndrome qubits might be more strongly coupled to the readout wiring to enhance signal-to-noise.","This would reduce coherence times on the syndrome qubits which does not in any way degrade the quantum information in the code qubits.","3.A pair of crossed assembly combs 520A and 520B is mounted to the outer housing of the copper block 502 in order to temporarily provide alignment for the superconducting vertical qubit chips 101 (as shown in FIG.","5A).","The assembly combs 520A and 520B create a series of alignment slots 525 (as shown in FIG.","5B) to orient the superconducting vertical qubit chips 101 which are inserted vertically from above.","The superconducting vertical qubit chips 101 key into the etched recesses 201 in the quantum bus plane 100 (as shown in 5C) and are thereby (automatically) oriented to key into the corresponding etched recesses 301 in the readout plane 102 (as shown in FIG.","5D).","The readout plane 102 is inserted from the side via readout plane slot 503.FIG.","5E depicts the assembly 500 from below and shows the assembled components with the assembly combs 520A and 520B omitted.","Once assembled, the vertical organization of the superconducting vertical qubit chips 101 constrained (and sandwiched) between the two silicon quantum bus and readout planes 100 and 102 (respectively) is maintained with pressure applied by the pusher block 570.The pusher block 570 is spring-loaded from above via the springs 575 pressed down by the top cap 582 (as shown in FIG.","5F).","Expandable, Scalable and Replaceable Array: The figures associated with embodiments show a fourteen qubit chip array but the number of superconducting vertical qubit chips 101 can be expanded to any arbitrary number (N).","All that is required is that the quantum bus plane 100 should be enlarged and the niobium wiring be replicated at all qubit sites (i.e., locations at the etched recesses 201 to accommodate superconducting vertical qubit chips 101) as needed.","The readout plane 102 can support many signal transmission lines 320 interleaved between each qubit site (i.e., locations at the etched recesses 301 to accommodate superconducting vertical qubit chips 101) to bring the signals to one edge and may require integration of dielectric cross-overs to reduce crosstalk if desired.","Moreover, the further integration of the readout plane 102 and quantum bus planes 100 is a minimal issue as it will neither directly affect the qubit chip fabrication process nor the qubit coherence performance.","According to embodiments, the assembly 500 includes the desirable feature that each superconducting vertical qubit chip 101 may be hand-selected for the correct electrical characteristics; any member of the array of superconducting vertical qubit chips 101 may be individually replaced at any time if the qubit chip's performance degrades for any reason during operation.","Replacement of the superconducting vertical qubit chip 101 can be accomplished without removing wire bonds 578 and/or without having to unsolder any components.","Embodiments provide a clear separation of fabrication processing steps and avoid the need for all N qubit and circuit parameters to meet specification on a single superconducting vertical qubit chip 101.Qubit chips 101 from multiple different fabrication runs can be combined in this type of quantum processor so that parameters such as transition frequency may be easily tailored without having to achieve a full range of accurate parameters on one silicon wafer in just one fabrication run.","Individual qubit chips 101 may be chosen from various different fabrication runs (wafers) and combined in the processor assembly.","As understood by one skilled in the art, microwave signals are applied to the qubit chip 101 via the readout lines to excite it into a defined state.","After some later time the state of the qubits can be then read out by interrogating them at some other microwave frequency, again via the readout lines.","FIG.","6 is a method 600 of configuring an assembly 500 for a quantum computing device according to an embodiment.","Reference can be made to the figures discussed herein.","At block 605, the quantum bus plane 100 having a first set of recesses 201 are provided, as depicted in FIG.","2.At block 610, the quantum bus plane 100 is positioned in the block 502, on top of the copper base 530, as seen in FIG.","5D.","The alignment combs 520A and 520B are installed in the copper block 502 and fixed in place, creating a series of precisely aligned slots 535 to accept the qubit chips 101, as seen in FIG.","5B.","At block 615, a plurality of superconducting vertical qubit chips 101 are placed/installed in the block 502, each of the plurality of qubit chips 101 has a first end positioned in the first set of recesses 201 (as shown in FIG.","5C).","The plurality of qubit chips 101 extend vertically in a lengthwise direction by being positioned in the first set of recesses 201 and in the slots 525 created by the alignment combs.","The set of recesses 201 holds the lower end of the plurality of qubit chips 101 in the quantum bus plane 100.The first end of the plurality of qubit chips 101 is opposite the second end.","At block 620, the readout plane 102 with its recesses 301 is then installed into the copper block 502 such that the recesses 301 in the readout plane 102 are positioned to accept the upper end (i.e., second end) of the plurality of all the qubit chips 101 which have been aligned by the slots 525 created by both alignment combs 520A, 520B.","The readout plane 102 thus drops down over the ends of the qubit dies 101 a distance equal to the depth of the recesses in the readout plane 301 and the precise mechanical alignment of all the electrical circuit elements is achieved in all three axes simultaneously.","At this point the alignment combs 520A and 520B may either be left in place or may be removed.","The quantum bus plane 100 comprises a substrate 590 with interconnect wiring 202 on top of the substrate 590, and the interconnect wiring 202 connects the plurality of qubit chips 101 via a plurality of coupling bus resonators 205.The readout plane 102 comprises a substrate 595 with fan-out wiring 302 on top of the substrate 595, and the fan-out wiring 302 individually connects each of the plurality of qubit chips 101 to a circuit board 330.The circuit board 330 individually connects each of the plurality of qubit chips 101 to a plurality of connectors 304 in a one-to-one relationship.","The block 502 is configured to receive a first assembly comb 520A and a second assembly comb 520B to form an intersection, and the intersection of the first and second assembly combs 520A, 520B form a plurality of slots 525 for individually accepting the plurality of qubit chips 101.The plurality of slots 525 mechanically holds the plurality of qubit chips 101 in a vertical position.","FIG.","7 is a method 700 of configuring an assembly 500 for a quantum computing device according to an embodiment.","Reference can be made to the figures discussed herein.","At block 705, the following parts are assembled: copper base 530 and copper block 502.At block 710 the quantum buss plane 100 is installed into the copper block 502 such that the quantum buss plane 100 rests on top of the copper base 530, and the quantum bus plane 100 has a set of recesses 201 (the readout plane 102 has a different set of recesses 301).","Then, the assembly combs 520A and 520B are installed and fixed into the copper block 502 thereby creating alignment slots 525.At block 715, a plurality of qubit chips 101 are installed in the block 502, where each of the plurality of qubit chips 101 has a first end positioned in the first set of recesses 201 using the alignment slots 525 created by the assembly combs 520A, 520B to guide the qubit chips 101 into the correct locations.","The housing 550 includes a readout plane housing slot 585.At block 720, the readout plane 102 is installed into the slot 585 and the recesses 301 in the readout plane 102 accept the upper ends (i.e., second end) of the plurality of all the qubit chips 101 which have been put in the correct locations by the alignment combs 520A, 520B such that the readout plane 102 drops over all of them (qubit chips 101) simultaneously.","The bell-mouthed nature of the recesses 301 in the readout plane 102 assists in the final locating of the ends of the qubit dies 101 into the recesses 301.The readout plane 102 extends through the readout plane housing slot 585 to connect to the circuit board 330, and the circuit board 330 connects to a plurality of connectors 304.The housing 550 includes a pushing mechanism configured to apply pressure to the readout plane 102, and the pressure applied to the readout plane 102 forces the plurality of qubit chips 101 to the quantum bus plane 100.The pushing mechanism comprises: a pusher block 570 positioned on top of the readout plane 102, and a spring mechanism 575 pressing downward against the pusher block 570.The top part (top cap 582) of the housing 550 applying a compression force to the spring mechanism 575 from above.","It will be noted that various microelectronic device fabrication methods may be utilized to fabricate the components/elements discussed herein as understood by one skilled in the art.","In semiconductor device fabrication, the various processing steps fall into four general categories: deposition, removal, patterning, and modification of electrical properties.","Deposition is any process that grows, coats, or otherwise transfers a material onto the wafer.","Available technologies include physical vapor deposition (PVD), chemical vapor deposition (CVD), electrochemical deposition (ECD), molecular beam epitaxy (MBE) and more recently, atomic layer deposition (ALD) among others.","Removal is any process that removes material from the wafer: examples include etch processes (either wet or dry), and chemical-mechanical planarization (CMP), etc.","Patterning is the shaping or altering of deposited materials, and is generally referred to as lithography.","For example, in conventional lithography, the wafer is coated with a chemical called a photoresist; then, a machine called a stepper focuses, aligns, and moves a mask, exposing select portions of the wafer below to short wavelength light; the exposed regions are washed away by a developer solution.","After etching or other processing, the remaining photoresist is removed.","Patterning also includes electron-beam lithography.","Modification of electrical properties may include doping, such as doping transistor sources and drains, generally by diffusion and/or by ion implantation.","These doping processes are followed by furnace annealing or by rapid thermal annealing (RTA).","Annealing serves to activate the implanted dopants.","The flowchart and block diagrams in the Figures illustrate the architecture, functionality, and operation of possible implementations of systems, methods, and computer program products according to various embodiments of the present invention.","In this regard, each block in the flowchart or block diagrams may represent a module, segment, or portion of instructions, which comprises one or more executable instructions for implementing the specified logical function(s).","In some alternative implementations, the functions noted in the block may occur out of the order noted in the figures.","For example, two blocks shown in succession may, in fact, be executed substantially concurrently, or the blocks may sometimes be executed in the reverse order, depending upon the functionality involved.","It will also be noted that each block of the block diagrams and/or flowchart illustration, and combinations of blocks in the block diagrams and/or flowchart illustration, can be implemented by special purpose hardware-based systems that perform the specified functions or acts or carry out combinations of special purpose hardware and computer instructions."]],"string":"[\n [\n \"MODULAR ARRAY OF VERTICALLY INTEGRATED SUPERCONDUCTING QUBIT DEVICES FOR SCALABLE QUANTUM COMPUTING\",\n \"A technique relates to an assembly for a quantum computing device.\",\n \"A quantum bus plane includes a first set of recesses.\",\n \"A readout plane includes a second set of recesses.\",\n \"A block is positioned to hold the readout plane opposite the quantum bus plane, such that the first set of recesses opposes the second set of recesses.\",\n \"A plurality of qubit chips are included where each has a first end positioned in the first set of recesses and has a second end positioned in the second set of recesses.\"\n ],\n [\n \"1.An assembly for a quantum computing device comprising: a housing configured as an enclosure having a bottom part, a top part, and a block, the block connecting the top and bottom parts; a quantum bus plane including a first set of recesses; a readout plane including a second set of recesses, wherein the block is configured to position the readout plane opposite the quantum bus plane, such that the first set of recesses opposes the second set of recesses; and a plurality of qubit chips each having a first end positioned in the first set of recesses and having a second end positioned in the second set of recesses.\",\n \"2.The assembly of claim 1, wherein the housing includes a readout plane housing slot through which the readout plane extends.\",\n \"3.The assembly of claim 2, wherein the readout plane extends through the readout plane housing slot to connect to a circuit board, the circuit board connecting to a plurality of connectors.\",\n \"4.The assembly of claim 1, further comprising a pushing mechanism configured to apply pressure to the readout plane.\",\n \"5.The assembly of claim 4, wherein the pushing mechanism is configured such that the pressure applied to the readout plane forces the plurality of qubit chips to the quantum bus plane.\",\n \"6.The assembly of claim 4, wherein the pushing mechanism comprises a pusher block positioned on top of the readout plane.\",\n \"7.The assembly of claim 6, wherein the pushing mechanism comprises a spring mechanism pressing downward against the pusher block.\",\n \"8.The assembly of claim 7, wherein the top part of the housing is configured to apply a compression force to the spring mechanism from above.\",\n \"9.The assembly of claim 1, wherein the plurality of qubit chips extend vertically in a lengthwise direction by being positioned in both the first set of recesses and the second set of recesses.\",\n \"10.The assembly of claim 1, wherein the first set of recesses secures the first end of the plurality of qubit chips in the readout plane.\",\n \"11.The assembly of claim 1, wherein the second set of recesses secures the second end of the plurality of qubit chips in the quantum bus plane.\",\n \"12.The assembly of claim 1, wherein the first end of the plurality of qubit chips is opposite the second end.\",\n \"13.The assembly of claim 1, wherein the quantum bus plane comprises a substrate with interconnect wiring on top of the substrate.\",\n \"14.The assembly of claim 13, wherein the interconnect wiring connects the plurality of qubit chips via a plurality of coupling bus resonators.\",\n \"15.The assembly of claim 1, wherein the readout plane comprises a substrate with fan-out wiring on top of the substrate.\",\n \"16.The assembly of claim 15, where the fan-out wiring individually connects each of the plurality of qubit chips to a circuit board.\",\n \"17.The assembly of claim 16, wherein the circuit board individually connects each of the plurality of qubit chips to a plurality of connectors in a one-to-one relationship.\",\n \"18.The assembly of claim 1, wherein the block is configured to receive a first assembly comb and a second assembly comb to form an intersection, the intersection of the first and second assembly combs forming a plurality of slots for individually accepting the plurality of qubit chips.\",\n \"19.The assembly of claim 18, wherein the plurality of slots mechanically holds the plurality of qubit chips in a vertical position.\",\n \"20.The assembly of claim 1, wherein the block is made of a superconducting material.\"\n ],\n [\n \" BACKGROUND The present invention relates to quantum computing, and more specifically, to a modular array of vertically integrated superconducting qubit devices for scalable quantum computing.\",\n \"In one approach called circuit quantum electrodynamics, quantum computing employs active superconducting devices called qubits to manipulate and store quantum information, and resonators (e.g., as a two-dimensional (2D) planar waveguide or as a three-dimensional (3D) microwave cavity) to read out and facilitate interaction among qubits.\",\n \"Each superconducting qubit comprises one or more Josephson junctions shunted by capacitors in parallel with the junctions.\",\n \"The qubits are capacitively coupled to 2D or 3D microwave cavities.\",\n \"The energy associated with the qubit resides in the electromagnetic fields around the Josephson junction and especially in the vicinity of relatively larger shunt capacitance structures.\",\n \"To date, a major focus has been on improving lifetimes of the qubits in order to allow calculations (i.e., manipulation and readout) to take place before the information is lost to decoherence of the qubits.\",\n \"Currently, superconducting qubit coherence times can be as high as 100 microseconds, and efforts are being made to increase the coherence times.\",\n \"One area of research with respect to increasing coherence times is focused on eliminating lossy materials from areas of relatively high electromagnetic field energy density such as in the vicinity of sharp corners and edges of the thin films of which the qubits are comprised.\",\n \"Such materials in proximity to the qubit can include imperfections that support defects known as two-level systems (TLSs).\"\n ],\n [\n \" SUMMARY According to one embodiment, an assembly for a quantum computing device is provided.\",\n \"The assembly includes a quantum bus plane including a first set of recesses, a readout plane including a second set of recesses, and a block positioned to hold the readout plane opposite the quantum bus plane, such that the first set of recesses opposes the second set of recesses.\",\n \"Also, the assembly includes a plurality of qubit chips where each has a first end positioned in the first set of recesses and has a second end positioned in the second set of recesses.\",\n \"According to one embodiment, an assembly for a quantum computing device is provided.\",\n \"The assembly includes a housing configured as an enclosure having a bottom part, a top part, and a block, in which the block connects the top and bottom parts.\",\n \"The assembly includes a quantum bus plane including a first set of recesses, and a readout plane including a second set of recesses.\",\n \"The block is configured to position the readout plane opposite the quantum bus plane, such that the first set of recesses opposes the second set of recesses.\",\n \"Also, the assembly includes a plurality of qubit chips where each has a first end positioned in the first set of recesses and has a second end positioned in the second set of recesses.\",\n \"According to one embodiment, a method of configuring an assembly for a quantum computing device is provided.\",\n \"The method includes providing a housing configured as an enclosure having a bottom part, a top part, and a block, in which the block connects the top and bottom parts.\",\n \"The method includes providing a readout plane having a first set of recesses and a quantum bus plane having a second set of recesses, and assembling the readout plane opposite the quantum bus plane in a block, such that the first set of recesses opposes the second set of recesses.\",\n \"Also, the method includes installing a plurality of qubit chips in the block, where each of the plurality of qubit chips has a first end positioned in the first set of recesses and has a second end positioned in the second set of recesses.\",\n \"In one or more embodiments, the plurality of qubit chips extends vertically in a lengthwise direction by being positioned in both the first set of recesses and the second set of recesses.\",\n \"The first set of recesses holds the first end of the plurality of qubit chips in the readout plane, and the second set of recesses holds the second end of the plurality of qubit chips in the quantum bus plane.\",\n \"In one or more embodiments, the first end of the plurality of qubit chips is opposite the second end.\",\n \"In one or more embodiments, the block is made of a superconducting material.\",\n \"In one or more embodiments, the quantum bus plane comprises a substrate with interconnect wiring on top of the substrate, and the interconnect wiring connects the plurality of qubit chips via a plurality of coupling bus resonators.\",\n \"In one or more embodiments, the readout plane comprises a substrate with fan-out wiring on top of the substrate, and the fan-out wiring individually connects each of the plurality of qubit chips to a circuit board.\",\n \"The circuit board individually connects each of the plurality of qubit chips to a plurality of connectors in a one-to-one relationship.\",\n \"In one or more embodiments, the block is configured to receive a first assembly comb and a second assembly comb to form an intersection, and the intersection of the first and second assembly combs forms a plurality of slots for individually accepting the plurality of qubit chips.\",\n \"The plurality of slots mechanically holds the plurality of qubit chips in a vertical position.\",\n \"Additional features and advantages are realized through the techniques of the present invention.\",\n \"Other embodiments and aspects of the invention are described in detail herein and are considered a part of the claimed invention.\",\n \"For a better understanding of the invention with the advantages and the features, refer to the description and to the drawings.\"\n ],\n [\n \"DOMESTIC PRIORITY This application is a divisional application of and claims priority from U.S. patent application Ser.\",\n \"No.\",\n \"15/175,454, filed on Jun.\",\n \"7, 2016, entitled “MODULAR ARRAY OF VERTICALLY INTEGRATED SUPERCONDUCTING QUBIT DEVICES FOR SCALABLE QUANTUM COMPUTING”, which is a divisional application of and claims priority from U.S. patent application Ser.\",\n \"No.\",\n \"14/737,707, filed on Jun.\",\n \"12, 2015, entitled “MODULAR ARRAY OF VERTICALLY INTEGRATED SUPERCONDUCTING QUBIT DEVICES FOR SCALABLE QUANTUM COMPUTING”, the entire contents of which are incorporated herein by reference.\",\n \"BACKGROUND The present invention relates to quantum computing, and more specifically, to a modular array of vertically integrated superconducting qubit devices for scalable quantum computing.\",\n \"In one approach called circuit quantum electrodynamics, quantum computing employs active superconducting devices called qubits to manipulate and store quantum information, and resonators (e.g., as a two-dimensional (2D) planar waveguide or as a three-dimensional (3D) microwave cavity) to read out and facilitate interaction among qubits.\",\n \"Each superconducting qubit comprises one or more Josephson junctions shunted by capacitors in parallel with the junctions.\",\n \"The qubits are capacitively coupled to 2D or 3D microwave cavities.\",\n \"The energy associated with the qubit resides in the electromagnetic fields around the Josephson junction and especially in the vicinity of relatively larger shunt capacitance structures.\",\n \"To date, a major focus has been on improving lifetimes of the qubits in order to allow calculations (i.e., manipulation and readout) to take place before the information is lost to decoherence of the qubits.\",\n \"Currently, superconducting qubit coherence times can be as high as 100 microseconds, and efforts are being made to increase the coherence times.\",\n \"One area of research with respect to increasing coherence times is focused on eliminating lossy materials from areas of relatively high electromagnetic field energy density such as in the vicinity of sharp corners and edges of the thin films of which the qubits are comprised.\",\n \"Such materials in proximity to the qubit can include imperfections that support defects known as two-level systems (TLSs).\",\n \"SUMMARY According to one embodiment, an assembly for a quantum computing device is provided.\",\n \"The assembly includes a quantum bus plane including a first set of recesses, a readout plane including a second set of recesses, and a block positioned to hold the readout plane opposite the quantum bus plane, such that the first set of recesses opposes the second set of recesses.\",\n \"Also, the assembly includes a plurality of qubit chips where each has a first end positioned in the first set of recesses and has a second end positioned in the second set of recesses.\",\n \"According to one embodiment, an assembly for a quantum computing device is provided.\",\n \"The assembly includes a housing configured as an enclosure having a bottom part, a top part, and a block, in which the block connects the top and bottom parts.\",\n \"The assembly includes a quantum bus plane including a first set of recesses, and a readout plane including a second set of recesses.\",\n \"The block is configured to position the readout plane opposite the quantum bus plane, such that the first set of recesses opposes the second set of recesses.\",\n \"Also, the assembly includes a plurality of qubit chips where each has a first end positioned in the first set of recesses and has a second end positioned in the second set of recesses.\",\n \"According to one embodiment, a method of configuring an assembly for a quantum computing device is provided.\",\n \"The method includes providing a housing configured as an enclosure having a bottom part, a top part, and a block, in which the block connects the top and bottom parts.\",\n \"The method includes providing a readout plane having a first set of recesses and a quantum bus plane having a second set of recesses, and assembling the readout plane opposite the quantum bus plane in a block, such that the first set of recesses opposes the second set of recesses.\",\n \"Also, the method includes installing a plurality of qubit chips in the block, where each of the plurality of qubit chips has a first end positioned in the first set of recesses and has a second end positioned in the second set of recesses.\",\n \"In one or more embodiments, the plurality of qubit chips extends vertically in a lengthwise direction by being positioned in both the first set of recesses and the second set of recesses.\",\n \"The first set of recesses holds the first end of the plurality of qubit chips in the readout plane, and the second set of recesses holds the second end of the plurality of qubit chips in the quantum bus plane.\",\n \"In one or more embodiments, the first end of the plurality of qubit chips is opposite the second end.\",\n \"In one or more embodiments, the block is made of a superconducting material.\",\n \"In one or more embodiments, the quantum bus plane comprises a substrate with interconnect wiring on top of the substrate, and the interconnect wiring connects the plurality of qubit chips via a plurality of coupling bus resonators.\",\n \"In one or more embodiments, the readout plane comprises a substrate with fan-out wiring on top of the substrate, and the fan-out wiring individually connects each of the plurality of qubit chips to a circuit board.\",\n \"The circuit board individually connects each of the plurality of qubit chips to a plurality of connectors in a one-to-one relationship.\",\n \"In one or more embodiments, the block is configured to receive a first assembly comb and a second assembly comb to form an intersection, and the intersection of the first and second assembly combs forms a plurality of slots for individually accepting the plurality of qubit chips.\",\n \"The plurality of slots mechanically holds the plurality of qubit chips in a vertical position.\",\n \"Additional features and advantages are realized through the techniques of the present invention.\",\n \"Other embodiments and aspects of the invention are described in detail herein and are considered a part of the claimed invention.\",\n \"For a better understanding of the invention with the advantages and the features, refer to the description and to the drawings.\",\n \"BRIEF DESCRIPTION OF THE DRAWINGS The subject matter which is regarded as the invention is particularly pointed out and distinctly claimed in the claims at the conclusion of the specification.\",\n \"The forgoing and other features, and advantages of the invention are apparent from the following detailed description taken in conjunction with the accompanying drawings in which: FIG.\",\n \"1 is a schematic illustrating a transparent view of part of the modular array of vertically integrated superconducting qubit chips according to an embodiment; FIG.\",\n \"2 is a schematic illustrating a quantum bus plane design according to an embodiment; FIG.\",\n \"3 is a schematic illustrating the readout plane in an inverted view according to an embodiment; FIG.\",\n \"4 is a schematic of an example qubit chip according to an embodiment.\",\n \"FIGS.\",\n \"5A through 5F illustrate an assembly and packaging technique for the modular array of vertically integrated superconducting qubit chips according to an embodiment, in which: FIG.\",\n \"5A is a schematic of an assembly illustrating assembly combs for a block; FIG.\",\n \"5B is a schematic of the assembly illustrating the assembly combs in place to form slots for orienting the superconducting qubit chips; FIG.\",\n \"5C is a schematic of the assembly illustrating the installation of the superconducting qubit chips in the slots formed by the assembly combs; FIG.\",\n \"5D is a schematic of the assembly illustrating installation of the readout plane in the block; FIG.\",\n \"5E is a schematic of the assembly illustrating a view underneath the block; FIG.\",\n \"5F is a schematic of the assembly illustrating that a pusher block applies pressure to hold the superconducting qubit chips in place; FIG.\",\n \"6 is a method of configuring an assembly according to an embodiment; and FIG.\",\n \"7 is a method of configuring an assembly according to an embodiment.\",\n \"DETAILED DESCRIPTION Superconducting Josephson-junction based qubits are promising candidates for fault-tolerant quantum computing.\",\n \"As a solid-state technology, it has always held the potential of simpler scalability via existing integration techniques.\",\n \"Superconducting circuit and device fabrication can leverage well-known lithographic methods which can lead to quantum integrated processors with a high density of qubits.\",\n \"Furthermore, superconducting qubits operate in the microwave frequency regime, allowing for all-electrical control of the qubits and other elements which might be in the system.\",\n \"The other elements may include microwave resonators, active filters, quantum-limited amplifiers, etc.\",\n \"A state-of-the-art fault-tolerant quantum computing architecture which has gathered interest recently is the surface code.\",\n \"In the surface code, qubits are arranged in a lattice with only the nearest neighbor interactions required.\",\n \"For superconducting qubits, the surface code is an attractive path forward as defining multiple qubits in a nearest-neighbor lattice.\",\n \"Moreover, the error thresholds which are required for the surface code are within reach for superconducting qubits with the current levels of coherence.\",\n \"One particular physical proposal in the state-of-the-art for realizing the surface code with superconducting qubits is the skew-symmetric layout.\",\n \"In this lattice, each superconducting qubit is coupled to two separate linking bus resonators.\",\n \"The coupling of superconducting qubits with microwave resonators is known as circuit quantum electrodynamics (cQED).\",\n \"The microwave resonators are typically defined as planar stripline resonators but can also be modes within three-dimensional (3D) waveguide cavities.\",\n \"Although it may appear simple to design a large lattice of many superconducting qubits and stripline resonators lithographically, getting every resonator mode and every qubit to work as desired together is a challenge.\",\n \"For example, crosstalk between resonators and superconducting qubits as well as undesired spurious modes can result in stray couplings between quantum objects.\",\n \"Crosstalk is defined here as any unwanted coupling of microwave signals between qubit or resonator channels, other than those desired and defined by wiring.\",\n \"Furthermore, although it may appear easy to optimize parameters for a single qubit and a single cavity mode, once these individual qubits are re-arranged in a larger network and all defined on the same chip, their (collective) behavior can change and can be difficult to then debug.\",\n \"According to embodiments discussed herein, a vertically integrated multi-chip architecture is provided, with discrete superconducting chip pieces comprised of superconducting qubits and their readout resonators.\",\n \"The superconducting qubits, along with their readout resonators, are then all arranged to mate in a matrix sandwiched by two larger carrier chips.\",\n \"These two larger carrier chips serve two purposes: one purpose is to integrate multiple resonator quantum buses to couple the superconducting qubits together (thereby coupling quantum information between qubits), and the other purpose permits physical connections via fan-out wiring to explicit microwave controls.\",\n \"This embodiment realizes a scalable architecture for quantum computation using well-established technology, while obviating challenging silicon integration techniques, such as thru-silicon-vias (TSVs) and multi-level lithography.\",\n \"There are two physically different methods for implementing superconducting quantum processors via the circuit quantum electrodynamics (cQED) architecture, which are a 2D planar lithographic method and a 3D waveguide cavity method.\",\n \"The quantum processor refers to the entirety of the assembled components.\",\n \"2D Planar Integration: The integration of qubits and resonators for 2D cQED is started via depositing superconducting films on silicon or sapphire substrates.\",\n \"Some typical superconducting films used are niobium (Nb), aluminum (Al), titanium nitride (TiN), and niobium nitride (NbN).\",\n \"Resonators (including readout resonators) are commonly defined in these superconducting films using coplanar waveguides, microstrips, coplanar striplines, or lumped element inductors and capacitors.\",\n \"Subsequently, superconducting qubits with Josephson junctions, such as the transmons, phase-qubits, or flux-qubits are also lithographically patterned via either electron-beam or optical lithography.\",\n \"Scaling up to larger quantum processors in this scheme requires a larger and larger chip to accommodate more resonators for coupling, more qubits, and more readout resonators.\",\n \"Using this 2D integration technique, processors up to 9 qubits have been devised in a linear chain, and 8 qubits in a latticed architecture.\",\n \"As the number of qubits in the 2D processor scales up, input-output (I/O) becomes increasingly challenging.\",\n \"In order to avoid crosstalk and integrate appropriate fan-out, technologies such as 3D integrated flip-chips, air-bridge crossovers, thru-silicon vias, and multi-layer lithography are required.\",\n \"As more and more of these different fabrication processes are required to scale up to larger quantum processors, the potential influence and degradation on the superconducting qubits increases rapidly.\",\n \"Therefore using these advanced fabrication techniques can lead to many different sources of decoherence in the qubits.\",\n \"For some of these processes, it could be necessary to perform them after Josephson junctions are lithographically defined.\",\n \"The impact and losses on Josephson junction based superconducting qubits after these processing steps are then a particular concern as to whether high coherence can continue to be preserved.\",\n \"Accordingly, this makes full-scale integration of a large system having a large number of qubits challenging.\",\n \"Embodiments include various features: 1) An array of vertical superconducting qubit chips is mounted to a silicon quantum bus plane and mounted to a separate qubit addressing and readout plane.\",\n \"2) A quantum bus (QB) plane lithographically is defined on silicon which permits the coupling of quantum information among individual vertical superconducting qubit chips.\",\n \"3) A readout (RO) plane couples each superconducting qubit chip's readout resonator to an integrated microwave bandwidth transmission line which follows onto a flexible circuit board thus connecting each superconducting qubit chip's readout resonator a coaxial connector for input/output (I/O).\",\n \"4) Vertical superconducting qubit chips each contain a single superconducting qubit (also referred to as a tunnel junction, such as a Josephson junction) and on-chip readout resonator, designed in a way to effectively couple to the quantum bus plane and the readout plane.\",\n \"Each individual vertical superconducting qubit chip is designed to have a specific lithographically-defined coupling capacitance between the tunnel junction to the quantum bus plane on one end and between the readout resonator and the addressing transmission line of the readout plane on the other end.\",\n \"5) All silicon elements are retained within a well-thermalized metal housing (e.g., copper) which provides mechanical support, alignment, and thermal contact.\",\n \"According to embodiments, the technique discussed herein is an approach for assembling the modular array of superconducting qubit chips into a scalable quantum processor, commensurate with latticed architectures for quantum error correction, such as the surface code.\",\n \"Now turning to the figures, FIG.\",\n \"1 is a schematic illustrating a transparent view of part of the modular array of vertically integrated superconducting qubit devices according to an embodiment.\",\n \"FIG.\",\n \"1 shows a quantum bus plane 100, a readout plane 102, and superconducting vertical qubit chips 101.The superconducting vertical qubit chips 101 are also referred to as qubit dies, qubits, etc.\",\n \"The readout plane 102 and the quantum bus plane 100 sandwich the qubit chips 101 in between.\",\n \"FIG.\",\n \"2 is a schematic illustrating a quantum bus plane design of the quantum bus plane 100 according to an embodiment.\",\n \"The quantum bus plane design illustrates a surface code example.\",\n \"The quantum bus plane 100 may be made of a semiconductor material as the substrate, such as, e.g., silicon, sapphire, etc.\",\n \"The semiconductor material has interconnect wiring 202 deposited on top of the semiconductor material.\",\n \"The interconnect wiring 202 is made of a superconducting material.\",\n \"Superconducting material may be defined as a material that can conduct electricity or transport electrons from one atom to another with no resistance when the superconducting material has reached “critical temperature” (Tc), or the temperature at which the material becomes superconductive.\",\n \"Conducting electricity or transporting electrons from one atom to another with no resistance means that no heat, sound, or any other form of energy would be released from the material as understood by one skilled in the art.\",\n \"The quantum bus plane 100 connects each individual qubit chip 101 via interconnect wiring 202.The interconnect wiring 202 connects (e.g., capacitively) to each superconducting qubit chip 101 installed in the quantum bus plane 100.The interconnect wiring 202 includes coupling bus resonators 205 positioned between each superconducting vertical qubit chip 101.Particularly, superconducting vertical qubit chips 101 are configured to couple together through the coupling bus resonators 205.To assist with securing and positioning superconducting vertical qubit chips 101 on the quantum bus plane 100, the quantum bus plane 100 includes etched recesses 201 at the locations to insert each of the superconducting vertical qubit chips 101.The etched recesses 201 are pockets that individually fit the superconducting vertical qubit chips 101 into specific locations in the quantum bus plane 100.The etched recesses 201 in the quantum bus plane 100 help to define accurate capacitive coupling between the qubit chips 101 and the interconnect wiring 202.The etched recesses 201 determine how deeply the vertical qubit chips 101 sit into the quantum buss plane 100 and thus determine the vertical separation between the capacitor pads on the qubit chip 101 and those on the quantum buss plane 100.The etched recesses 201 are etched into the semiconductor substrate of the quantum bus plane 100.Accurate vertical separation of these coupling pads is a prerequisite for achieving a precise coupling capacitance value.\",\n \"The coupling capacitor pad 404 is shown in FIG.\",\n \"4 and the quantum bus plane 100 has coupling pad 250 in front of each etched recess 201.For the sake of clarity and so as not to obscure FIG.\",\n \"2, only two superconducting vertical qubit chips 101 are shown in FIG.\",\n \"2 although it is understood that each row, e.g., rows 1-4, are filled with superconducting vertical qubit chips 101.One superconducting vertical qubit chip 101 is shown as a code superconducting vertical qubit chip in row 1, and the other superconducting vertical qubit chip 101 is a syndrome superconducting vertical qubit chip in row 2.In one implementation, each row may be filled with the same type of superconducting vertical qubit chip 101.For example, row 1 may be filled with code superconducting vertical qubit chips 101, while row 2 is filled with syndrome superconducting vertical qubit chips 101.Row 3 may be filled with code superconducting vertical qubit chips 101, while row 4 is filled with syndrome superconducting vertical qubit chips 101.Although only 4 rows are shown for the sake of illustration, it is contemplated that M numerous rows may be included on the quantum bus plane 100, where M is the last row.\",\n \"A code qubit stores quantum information for operation of the quantum processor.\",\n \"A syndrome qubit measures and extracts any errors in the system without corrupting the information present in the code qubit.\",\n \"These terms are commonly applied when discussing “surface code error correction.” According to an embodiment, FIG.\",\n \"3 is a schematic illustrating the readout plane 102 in an inverted view.\",\n \"FIG.\",\n \"3 shows the backside of the readout plane 102, and the backside faces the quantum bus plane 100 (not shown in FIG.\",\n \"3).\",\n \"The readout plane 102 may be made of a semiconductor material as the substrate, such as, e.g., silicon, sapphire, etc.\",\n \"The semiconductor material has fan-out wiring 302 deposited on top of the semiconductor material.\",\n \"The fan-out wiring 302 may be made of a superconducting material.\",\n \"The readout plane 102 includes etched recesses 301 at locations to insert each of the superconducting vertical qubit chips 101.Each etched recess 301 is a pocket that individually fits a single superconducting vertical qubit chip 101 into a specific location in the readout plane 102, analogous to the etched recesses 201 in the quantum bus plane 100 in FIG.\",\n \"2.The etched recesses 301 in the readout plane 102 capacitively connect the superconducting vertical qubit chips 101 to the fan-out wiring 302 via the capacitor pads defined on the upper end of the vertical qubit chip 101 and on the readout plane 102.At the upper end, the vertical qubit chip 101 has coupling capacitor pad 401 as shown in FIG.\",\n \"4, while the readout plane 102 has a coupling pad 350 in front of each etched recesses 301.The fan-out wiring 302 has transmission lines 320.Each transmission line 320 individually connects to a single superconducting vertical qubit chip 101 in a one-to-one relationship.\",\n \"The etched recesses 301 serve both a mechanical purpose and an electrical purpose.\",\n \"Mechanically, the etched recesses 301 serve as a slot/pocket to insert each superconducting vertical qubit chip 101.Electrically, the etched recesses 301 align each superconducting vertical qubit chip 101 to an individual transmission line 320 of the fan-out wiring 302.The fan-out wiring 302 individually couples to each superconducting vertical qubit chip 101.Also, the fan-out wiring 302 individually connects each superconducting vertical qubit chip 101 to a flexible circuit board 303.The fan-out wiring 302 does not affect quantum information on the superconducting vertical qubit chips 101.The fan-out wiring 302 connects the superconducting vertical qubit chips 101 to the outside environment (e.g., the 50 ohm (Ω) environment).\",\n \"The flexible circuit board 303 individually connects each superconducting vertical qubit chip 101 to an individual connector 304 via the fan-out wiring 302.Although the flexible circuit board 303 is shown as one implementation, it is contemplated that other type of circuit boards or electrical connections may be utilized.\",\n \"The connectors 304 individually connect the superconducting vertical qubit chips 101 to external electronics (not shown).\",\n \"The connectors 304 may be microwave connectors in which microwave signals may be input and qubit states can be read.\",\n \"Each connector 304 has a one-to-one relationship to a single superconducting vertical qubit chip 101 on the readout plane 102, such that each superconducting vertical qubit chip 101 is individually addressable through a single connector 304, through the flexible circuit board 303, through the fan-out wiring 302, a particular transmission line 320, and through an individual etched recess 301.In one implementation, the connectors 304 may coaxial cable connectors configured to connect to coaxial cables.\",\n \"Although not shown so as not to obscure FIG.\",\n \"3, it is understood that conductive wiring runs through the flexible circuit board 303 and that wiring connects the flexible circuit board 303 to each respective connector 304 as understood by one skilled in the art.\",\n \"The conductive wiring of the flexible circuit board 303 may be made of superconducting or normal material.\",\n \"FIG.\",\n \"4 is a schematic of an example superconducting vertical qubit chip 101 according to an embodiment.\",\n \"Various details of the superconducting vertical qubit chips 101 are shown in FIG.\",\n \"4.The superconducting vertical qubit chips 101 may have a substrate made of a semiconductor material, such as, e.g., silicon, sapphire, etc.\",\n \"Each qubit chip 101 is an integrated circuit.\",\n \"Conductive material is deposited and patterned on the substrate of the superconducting vertical qubit chips 101 to form the integrated circuit.\",\n \"The superconducting vertical qubit chips 101 are not a monolithic wafer.\",\n \"Rather, the superconducting vertical qubit chips 101 are formed from a wafer (substrate) diced into individual qubit dies.\",\n \"Each diced superconducting vertical qubit chip 101 includes a coupling capacitor pad 401.The coupling capacitor pad 401 is a capacitor that capacitively couples each superconducting vertical qubit chip 101 to the readout plane 102 via the fan-out wiring 302, when the superconducting vertical qubit chip 101 is inserted in its etched recess 201.Accordingly, on one end of the superconducting vertical qubit chip 101, that end is electrically connected to the readout plane 102 through the coupling capacitor pad 401 and coupling pad 350 on the readout plane 102.It is noted that, for coupling capacitor pads 401 and 350 and coupling capacitor pads 404 and 250, the coupling capacitors may be defined by metal pads that are at right angles to each other, with a well-defined vertical separation.\",\n \"The two types of coupling capacitors are quantum buss plane to lower side of qubit chip, and upper side of vertical qubit chip to readout plane.\",\n \"It should be understood that two metal surfaces (pads in this case) at right angles to each other, separated by some distance, define a capacitor.\",\n \"Embodiments exploit this fact to permit accurate coupling between circuit elements without resorting to wire bonds across right angle connections.\",\n \"Additionally, each superconducting vertical qubit chip 101 includes coupling capacitor pads 404.The coupling capacitor pads 404 form a capacitor, and between the two coupling capacitor pads 404 is a tunnel junction 403 (sometimes called the qubit), such as, e.g., a Josephson junction.\",\n \"The coupling capacitor pads 404 form a capacitor that capacitively couples to the quantum bus plane 100 via the interconnecting wiring 202.Accordingly, on the opposite end to the coupling capacitor pad 401, the opposite end is electrically connected to the quantum bus plane 100 through the coupling capacitor pads 404.The superconducting vertical qubit chip 101 includes readout resonator 402.The readout resonator 402 is configured with a resonance frequency designed to read the state of the qubit tunnel junction 403.The readout resonator 402 is positioned between the coupling capacitor pad 401 and the coupling capacitor pads 404.The readout resonator 402 is formed of conductive material that connects the coupling capacitor pad 401 and the coupling capacitor pads 404.The conductive material is a superconducting material, which forms the circuit.\",\n \"The superconducting vertical qubit chip 101 includes a ground plane 405 surrounding the circuit of the coupling capacitor pad 401, the coupling capacitor pads 404, and the readout resonator 402.The material of the substrate separates the ground plane 405 from the circuit.\",\n \"According to an embodiment, an assembly and packaging technique for the modular array of vertically integrated superconducting qubit chips 101 is discussed below in FIGS.\",\n \"5A, 5B, 5C, 5D, 5E, and 5F.\",\n \"FIG.\",\n \"5A illustrates part of an assembly 500.The assembly 500 has a copper block 502.The copper block 502 includes a readout plane slot 503.The readout plane 102 is to be inserted into the readout plane slot 503 as discussed further below.\",\n \"Although a copper block 502 is illustrated, the block 502 may be made of other materials.\",\n \"The block 502 can be constructed of a variety of materials provided they give high thermal conductivity.\",\n \"Examples other than copper include brass, sapphire, silicon, silver, aluminum, and/or niobium.\",\n \"Assembly combs 520A and 520B are utilized to orient alignment of the superconducting vertical qubit chips 101 for assembly with the readout plane 102 (in the etched recesses 201) and quantum bus plane 100 (in the etched recesses 301) within the copper block 502.Both assembly combs 520A and 520B have teeth with predefined spacing.\",\n \"For example, the assembly comb 520A has teeth 525A and the assembly comb 520B has teeth 525B.\",\n \"In one implementation, the spacing of the teeth 525A is larger than the spacing of the teeth 525B, and the spacing of the teeth 525A and 525B is based on accommodating the cross-section size of the superconducting vertical qubit chips 101.The copper block 502 includes assembly slots 501A and 501B.\",\n \"The assembly comb 520A is inserted into the assembly slot 501A, and the assembly comb 520B is inserted into the assembly slot 501B.\",\n \"One assembly slot is positioned higher than the other assembly slot such that the assembly combs 520A and 520B define the desired alignment slots where they cross over and under each other but do not interfere with each other when inserted into their respective assembly slots 501A and 501B.\",\n \"FIG.\",\n \"5B is a schematic of the assembly 500 showing the assembly combs 520A and 520B in place within the copper block 502 according to an embodiment.\",\n \"Slots 525 are formed by the intersection of the assembly combs 520A and 520B while in the copper block 502.The slots 525 are utilized to orient the superconducting vertical qubit chip 101.In particular, the slots 525 are formed by the spacing of the teeth 525A and 525B such that the slots 525 can accommodate the size of the superconducting vertical qubit chips 101.In one implementation, the spacing of the slots 525 may be about 5 millimeters (mm) in the x-axis and may be about 5 mm in the y-axis.\",\n \"In one implementation, each superconducting vertical qubit chip 101 may have approximate dimensions of 8 mm tall by 2 mm wide by 0.7 mm thick.\",\n \"Also, to accommodate the size of the superconducting vertical qubit chips 101, the etched recesses 201 and 301 may be about 0.7 mm in the x-axis and about 2 mm in the y-axis.\",\n \"The etched recessed 201 and 301 may have a depth of about 0.35 mm in the z-axis.\",\n \"FIG.\",\n \"5C is a schematic of the assembly 500 showing an abbreviated view inside the copper block 502 (not shown) which is part of a housing 550 (shown in FIG.\",\n \"5F) according to an embodiment.\",\n \"In FIG.\",\n \"5C, the abbreviated view omits certain elements in order to simplify the assembly 500 for better understanding.\",\n \"The walls of the housing copper block 502 are removed, and only a copper base 530 of the housing 550 is shown.\",\n \"The quantum bus plane 100 is attached to and/or positioned on the copper base 530.The intersecting assembly combs 520A and 520B are in place (within the copper block 502) forming the slots 525.Aligned through the slots 525, a few example superconducting vertical qubit chips 101 are installed into (the etched recesses 201 in) the quantum bus plane 100.The slots 525 directly align to individual etched recesses 201 below and provide a guide during installation of the superconducting vertical qubit chips 101.FIG.\",\n \"5D is a schematic of the assembly 500 showing a transparent view into the copper block 502 according to an embodiment.\",\n \"FIG.\",\n \"5D shows the readout plane 102 installed into the copper block 502 and extending outside of the copper block 502 through readout plane housing slot 585.In one implementation, the quantum bus plane 100 fits into the bottom of the copper block 502.In another implementation, the copper block 502 may sit on top of the quantum bus plane 100.The superconducting vertical qubit chips 101 are sandwiched between the readout plane 102 and the quantum bus plane 100, and the ends of the superconducting vertical qubit chips 101 fit into the etched recesses 201 and 301 of the quantum bus plane 100 and readout plane 102, respectively.\",\n \"For simplicity and ease of understanding, only a few superconducting vertical qubit chips 101 are shown in FIG.\",\n \"5D.\",\n \"Also, so as not to obscure FIG.\",\n \"5D, the assembly combs 520A and 520B are not shown in this figure.\",\n \"A board clamp 555 holds and attaches to portion of the readout plane 102 extending outside of the housing.\",\n \"The board clamp 555 holds and attaches the readout plane 102 to the flexible circuit board 303.Outside of the housing 550, the connectors 304 are on a rigid circuit board 330 and connected to the flexible circuit board 303.The circuit board 330 comprises circuits (not shown) individually connecting each connector 304 to an individual circuit within the flexible circuit board 303, as understood by one skilled in the art.\",\n \"FIG.\",\n \"5E is a schematic of the assembly 500 showing a view underneath the housing 500 according to an embodiment.\",\n \"The copper base 530 of the housing is removed.\",\n \"FIG.\",\n \"5E allows the bottom of the quantum bus plane 100 to be viewed.\",\n \"FIG.\",\n \"5E also shows that wire bonds 578 connect the readout plane 102 to the board clamp 555.These wire bonds 578 create an electrical connection between the fan-out wiring 302 on the readout plane 102 and the conductors (of whatever type) on the flexible circuit board 303.Although it possible to mechanically bond the flexible circuit board 303 directly to the silicon readout plane 102, those two items, however, have extremely different thermal expansion coefficients which may cause the connections to break over time.\",\n \"Wire bonds 578 being flexible permit long-term reliability over many thermal cycles.\",\n \"In one implementation, the two readout planes are to be made of the same material so any dimensional changes from thermal expansion are the same for both planes.\",\n \"FIG.\",\n \"5F is a schematic of the assembly 500 according to an embodiment.\",\n \"FIG.\",\n \"5F shows that a pusher block 570 pushes the readout plane 102 firmly against the superconducting vertical qubit chips 101.The pusher block 570 is spring loaded.\",\n \"The constant pressure of the pusher block 570 ensures that the superconducting vertical qubit chips 101 stay in the etched recesses 201 and 301.The force of the pusher block 570 is caused by a spring mechanism 575 attached to a top cap 582 of the housing 550.As can be seen in FIG.\",\n \"5F, the housing 550 is an enclosure.\",\n \"The housing 550 may be made of copper, silver, brass, silicon, sapphire, aluminum, and/or niobium.\",\n \"The housing 550 includes the copper block 502, the copper base 530, the pusher block 570, and the top cap 582.In one implementation, the assembly combs 520A and 520B may remain in the copper block 502 after the superconducting vertical qubit chips 101 have been installed (i.e., inserted into the etched recesses 201 and 301 of the quantum bus and readout planes 100 and 102, respectively).\",\n \"In another implementation, the assembly combs 520A and 520B may be removed from the copper block 502 after installing the superconducting vertical qubit chips 101, such that the assembly combs 520A and 520B are not in the housing 550.For ease of understanding, sub-headings are provided below.\",\n \"The sub-headings are meant for explanation purposes and not limitation.\",\n \"Standardized Fabrication of Elements: Each of the discussed silicon elements, such as, e.g., the quantum bus plane 100, superconducting vertical qubit chips 101, and readout plane 102, use well-established lithographic technology that is time tested in the superconducting qubit community and thus understood by one skilled in the art.\",\n \"In one embodiment, the materials are standardized to niobium for the resonator and transmission line elements; the materials are aluminum and native aluminum oxide for the qubit junction fabrication (i.e., the qubit tunnel junction 403) via standard double-angle evaporation.\",\n \"All lithography may be performed on high-resistivity silicon wafers with established loss parameters appropriate for qubit technology, as understood by one skilled in the art.\",\n \"The readout resonator 402 is in on the vertical qubit chip 101, and transmission line elements are any other wiring on the quantum buss plane 100, the qubit chip 101, and the readout plane 102.In one implementation, the readout resonators 402 may be of a different material than the wiring.\",\n \"In another implementation, the readout resonators 402 and wiring may be fabricated from a variety of all the same materials.\",\n \"In yet another implementation, the readout resonators 402 and various different portions of the wiring may be fabricated from a variety of different materials for each sub-category of function.\",\n \"Complete assembly of a scalable quantum processor with N qubits (i.e., N qubit chips 101) is achieved without resorting to any multi-level lithography, inserted ground planes, cross-overs, or thru-silicon-vias (TSVs).\",\n \"Using current standard lithographic techniques, embodiments allow the straightforward integration of N=100 to 1000 superconducting vertical qubit chips 101, taking up a space roughly the size of a deck of playing cards (e.g., 2.5×3.5 inches or 64×89 mm).\",\n \"Design of Individual Qubit Chips and Coupling Capacitance Choices: From electromagnetic simulations for reasonable parameters of qubit tunnel junctions 403, readout resonators 402, and quantum bus planes 100, it is possible to achieve the desired precise coupling capacitance values with the geometry described herein.\",\n \"Each individual superconducting vertical qubit chip 101 contains a capacitor (i.e., coupling capacitor 404) that couples signal to the quantum bus traces (i.e., interconnect wiring 202) on the quantum bus plane 100.The capacitor (coupling capacitor 404) provides coupling that is appropriate for a specific universal two-qubit entangling gate.\",\n \"The capacitor is formed by an electrode on the lower end of the vertical qubit chip 101 which couples to electrodes on the quantum buss plane 100.The approximate range in this implementation for the capacitor value is around 7 to 5 femto Farads.\",\n \"The interconnection between the superconducting vertical qubit chip 101 and the etched recesses 201 (pocket) in the quantum bus plane 100 is designed to minimize stray coupling between the qubit signals and ground plane 405.On the other end of the superconducting vertical qubit chip 101, the interconnection with the readout plane 102 creates a specific capacitance between the readout resonator 402 and the control transmission line 320 (of the fan-out wiring 302) such that the readout resonator 402 has a well-defined quality factor and permits a high fidelity readout.\",\n \"This capacitor (i.e., coupling capacitor pad 401) is formed by an electrode on the superconducting vertical qubit chip 101 (qubit die) which couples to an electrode (a portion of the control transmission line 320) on the readout plane 102.The approximate value of this capacitor in this implementation is around 5 to 7 femto Farads, for example.\",\n \"Each superconducting vertical qubit chip 101 is metalized on the backside with superconductor material to control stray coupling and other electric fields within the processor housing 550.The backside of the superconducting vertical qubit chip 101 is opposite the circuit of the coupling capacitor pad 401, the coupling capacitor pads 404, and the readout resonator 402 on the front side.\",\n \"Note that all capacitor values and uncertainty are determined by lithographic feature sizes and depth of etches.\",\n \"These values are easily changed and provide for sufficient accuracy for the circuit tolerances required for embodiments.\",\n \"Design of Quantum Bus Plane: The fabrication process of the quantum bus plane 100 can begin with standard 2D integration techniques.\",\n \"In one implementation, niobium is electro-sputtered onto a silicon substrate 590.Multiple masks, having the quantum bus designs and having the etched recesses 201 (pockets) where qubit chips 101 are to be mounted, may be used for reactive ion etching (RIE) of the niobium.\",\n \"The quantum bus design mask defines the coupling bus resonators 205 which couple quantum information among the superconducting vertical qubit chips 101.The pocket mask (for making the etched recesses 201) defines the locations to etch down into the silicon for the individual superconducting vertical qubit chips 101 to be mounted.\",\n \"The process for the pocket mask etch may be similar to most 3D integration schemes, except in this case the sputtered niobium is used as a hardmask to first define the pockets (i.e., etched recesses 201).\",\n \"Definition of the pocket (i.e., etched recess 201) in the silicon substrate 590 can be achieved using a deep silicon dry etch process, reactive ion etching (RIE), or a wet chemistry (tetramethyl ammonium hydroxide (TMAH)).\",\n \"The pockets (i.e., etched recesses 201) of the quantum bus plane 100 are arranged in a grid structure where successive rows are offset, one corresponding to superconducting vertical code qubit chips, and the other row corresponding to superconducting vertical syndrome qubits chips 101 for error detection via measurement.\",\n \"Each qubit chip pocket (i.e., etched recess 201) is arranged to couple to two coupling bus resonators 205 defined on the quantum bus plane 100 in one implementation.\",\n \"Note that this arrangement is not the only way to realize the surface code, as one can also couple either three or four coupling bus resonators 205 to a single superconducting vertical qubit chip 101 in another implementation.\",\n \"Location accuracy of the qubit chip pockets (etched recesses 201 (including etched recesses 301 in readout plane 102) is determined by the lithography and depth accuracy as determined by the etch time.\",\n \"The pockets are formed with a chamfered or bell-mouthed opening to allow easy insertion of each superconducting vertical qubit chip 101 (qubit die).\",\n \"Depending on results from scaling to larger N (i.e., a larger amount of superconducting vertical qubit chips 101), the quantum bus plane 100 may be admissible to more integration techniques such as TSVs for chip-mode reduction.\",\n \"The nuance here is that no Josephson junctions (qubits) 403 need to be defined in this quantum bus plane 100, so there would be minimal effect on qubit coherence with further integration of the quantum bus plane 100.Design of Readout Plane: The readout plane 102 starts off similar to the quantum bus plane 100, with niobium conductors etched lithographically on a silicon substrate 595.Co-planar transmission lines 320 are patterned on the readout plane 102 in a fan-out configuration (i.e., fan-out wiring 302) so as to bring external signals into and out of each superconducting vertical qubit chip 101.These transmission lines 320 are defined in a coplanar waveguide, and support 50Ω microwave driving of both readout and qubit control signals.\",\n \"All these transmission lines 320 meander through the readout plane 102 terminating on one edge in wire bond pads 370.The wire bond pads 370 are on the extreme right end of the fan-out wiring 302.Similar to the quantum bus plane, pockets (i.e., etched recesses 301) in the readout plane 102 are likewise defined via deep etching into the silicon substrate 595 of the readout plane 102, in corresponding locations as the etched recesses 201 in the quantum bus plane 100 so as to accept the mounting of the individual superconducting vertical qubit chips 101.These pockets (i.e., etched recesses 301) may be chamfered or otherwise bell-mouthed for ease of assembly and locating of structure.\",\n \"The microwave signals for control and readout are carried off the readout plane 102 via wire bonds 578 to the flexible circuit board 303 which conducts to other transmission lines embedded in a separate rigid circuit board 330 populated with connectors 304 leading to external components.\",\n \"Ground Planes in Quantum Bus Plane and Readout Plane Pockets: After etching qubit chip pockets (etched recesses 201, 301) in both the quantum bus and readout planes 100 and 102 respectively, these pockets (etched recesses 201, 301) are coated with niobium via sputtering to form continuous ground plane.\",\n \"These ground planes are designed to mate to the ground planes 405 that exist on the extreme ends of each superconducting vertical qubit chip 101 to form a continuous electrostatic ground between the quantum bus and readout planes 100 and 102, respectively; the continuous electrostatic ground between the quantum bus and readout planes 100 and 102 (respectively) serves to (1) further isolate each qubit site (i.e., locations of etched recesses 201, 301) from spurious modes, (2) isolate each qubit site (i.e., locations of etched recesses 201, 301) from adjacent qubit superconducting vertical qubit chips 101, and (3) eliminate unwanted cross-talk coupling between superconducting vertical qubit chips 101.Assembly of Modular Array Elements: 1.Each individual superconducting vertical qubit chip 101 is located by an etched recess 201 formed in the quantum bus plane 100 and an etched recess 301 formed the readout plane 102.In one implementation, the etched recesses 201, 301 are accurately formed in the silicon substrates 590, 595 using a standard wet etch process.\",\n \"2.Each individual superconducting vertical qubit chip 101 is chosen for desirable electrical characteristics such as transition frequency.\",\n \"In some cases the syndrome qubits might be more strongly coupled to the readout wiring to enhance signal-to-noise.\",\n \"This would reduce coherence times on the syndrome qubits which does not in any way degrade the quantum information in the code qubits.\",\n \"3.A pair of crossed assembly combs 520A and 520B is mounted to the outer housing of the copper block 502 in order to temporarily provide alignment for the superconducting vertical qubit chips 101 (as shown in FIG.\",\n \"5A).\",\n \"The assembly combs 520A and 520B create a series of alignment slots 525 (as shown in FIG.\",\n \"5B) to orient the superconducting vertical qubit chips 101 which are inserted vertically from above.\",\n \"The superconducting vertical qubit chips 101 key into the etched recesses 201 in the quantum bus plane 100 (as shown in 5C) and are thereby (automatically) oriented to key into the corresponding etched recesses 301 in the readout plane 102 (as shown in FIG.\",\n \"5D).\",\n \"The readout plane 102 is inserted from the side via readout plane slot 503.FIG.\",\n \"5E depicts the assembly 500 from below and shows the assembled components with the assembly combs 520A and 520B omitted.\",\n \"Once assembled, the vertical organization of the superconducting vertical qubit chips 101 constrained (and sandwiched) between the two silicon quantum bus and readout planes 100 and 102 (respectively) is maintained with pressure applied by the pusher block 570.The pusher block 570 is spring-loaded from above via the springs 575 pressed down by the top cap 582 (as shown in FIG.\",\n \"5F).\",\n \"Expandable, Scalable and Replaceable Array: The figures associated with embodiments show a fourteen qubit chip array but the number of superconducting vertical qubit chips 101 can be expanded to any arbitrary number (N).\",\n \"All that is required is that the quantum bus plane 100 should be enlarged and the niobium wiring be replicated at all qubit sites (i.e., locations at the etched recesses 201 to accommodate superconducting vertical qubit chips 101) as needed.\",\n \"The readout plane 102 can support many signal transmission lines 320 interleaved between each qubit site (i.e., locations at the etched recesses 301 to accommodate superconducting vertical qubit chips 101) to bring the signals to one edge and may require integration of dielectric cross-overs to reduce crosstalk if desired.\",\n \"Moreover, the further integration of the readout plane 102 and quantum bus planes 100 is a minimal issue as it will neither directly affect the qubit chip fabrication process nor the qubit coherence performance.\",\n \"According to embodiments, the assembly 500 includes the desirable feature that each superconducting vertical qubit chip 101 may be hand-selected for the correct electrical characteristics; any member of the array of superconducting vertical qubit chips 101 may be individually replaced at any time if the qubit chip's performance degrades for any reason during operation.\",\n \"Replacement of the superconducting vertical qubit chip 101 can be accomplished without removing wire bonds 578 and/or without having to unsolder any components.\",\n \"Embodiments provide a clear separation of fabrication processing steps and avoid the need for all N qubit and circuit parameters to meet specification on a single superconducting vertical qubit chip 101.Qubit chips 101 from multiple different fabrication runs can be combined in this type of quantum processor so that parameters such as transition frequency may be easily tailored without having to achieve a full range of accurate parameters on one silicon wafer in just one fabrication run.\",\n \"Individual qubit chips 101 may be chosen from various different fabrication runs (wafers) and combined in the processor assembly.\",\n \"As understood by one skilled in the art, microwave signals are applied to the qubit chip 101 via the readout lines to excite it into a defined state.\",\n \"After some later time the state of the qubits can be then read out by interrogating them at some other microwave frequency, again via the readout lines.\",\n \"FIG.\",\n \"6 is a method 600 of configuring an assembly 500 for a quantum computing device according to an embodiment.\",\n \"Reference can be made to the figures discussed herein.\",\n \"At block 605, the quantum bus plane 100 having a first set of recesses 201 are provided, as depicted in FIG.\",\n \"2.At block 610, the quantum bus plane 100 is positioned in the block 502, on top of the copper base 530, as seen in FIG.\",\n \"5D.\",\n \"The alignment combs 520A and 520B are installed in the copper block 502 and fixed in place, creating a series of precisely aligned slots 535 to accept the qubit chips 101, as seen in FIG.\",\n \"5B.\",\n \"At block 615, a plurality of superconducting vertical qubit chips 101 are placed/installed in the block 502, each of the plurality of qubit chips 101 has a first end positioned in the first set of recesses 201 (as shown in FIG.\",\n \"5C).\",\n \"The plurality of qubit chips 101 extend vertically in a lengthwise direction by being positioned in the first set of recesses 201 and in the slots 525 created by the alignment combs.\",\n \"The set of recesses 201 holds the lower end of the plurality of qubit chips 101 in the quantum bus plane 100.The first end of the plurality of qubit chips 101 is opposite the second end.\",\n \"At block 620, the readout plane 102 with its recesses 301 is then installed into the copper block 502 such that the recesses 301 in the readout plane 102 are positioned to accept the upper end (i.e., second end) of the plurality of all the qubit chips 101 which have been aligned by the slots 525 created by both alignment combs 520A, 520B.\",\n \"The readout plane 102 thus drops down over the ends of the qubit dies 101 a distance equal to the depth of the recesses in the readout plane 301 and the precise mechanical alignment of all the electrical circuit elements is achieved in all three axes simultaneously.\",\n \"At this point the alignment combs 520A and 520B may either be left in place or may be removed.\",\n \"The quantum bus plane 100 comprises a substrate 590 with interconnect wiring 202 on top of the substrate 590, and the interconnect wiring 202 connects the plurality of qubit chips 101 via a plurality of coupling bus resonators 205.The readout plane 102 comprises a substrate 595 with fan-out wiring 302 on top of the substrate 595, and the fan-out wiring 302 individually connects each of the plurality of qubit chips 101 to a circuit board 330.The circuit board 330 individually connects each of the plurality of qubit chips 101 to a plurality of connectors 304 in a one-to-one relationship.\",\n \"The block 502 is configured to receive a first assembly comb 520A and a second assembly comb 520B to form an intersection, and the intersection of the first and second assembly combs 520A, 520B form a plurality of slots 525 for individually accepting the plurality of qubit chips 101.The plurality of slots 525 mechanically holds the plurality of qubit chips 101 in a vertical position.\",\n \"FIG.\",\n \"7 is a method 700 of configuring an assembly 500 for a quantum computing device according to an embodiment.\",\n \"Reference can be made to the figures discussed herein.\",\n \"At block 705, the following parts are assembled: copper base 530 and copper block 502.At block 710 the quantum buss plane 100 is installed into the copper block 502 such that the quantum buss plane 100 rests on top of the copper base 530, and the quantum bus plane 100 has a set of recesses 201 (the readout plane 102 has a different set of recesses 301).\",\n \"Then, the assembly combs 520A and 520B are installed and fixed into the copper block 502 thereby creating alignment slots 525.At block 715, a plurality of qubit chips 101 are installed in the block 502, where each of the plurality of qubit chips 101 has a first end positioned in the first set of recesses 201 using the alignment slots 525 created by the assembly combs 520A, 520B to guide the qubit chips 101 into the correct locations.\",\n \"The housing 550 includes a readout plane housing slot 585.At block 720, the readout plane 102 is installed into the slot 585 and the recesses 301 in the readout plane 102 accept the upper ends (i.e., second end) of the plurality of all the qubit chips 101 which have been put in the correct locations by the alignment combs 520A, 520B such that the readout plane 102 drops over all of them (qubit chips 101) simultaneously.\",\n \"The bell-mouthed nature of the recesses 301 in the readout plane 102 assists in the final locating of the ends of the qubit dies 101 into the recesses 301.The readout plane 102 extends through the readout plane housing slot 585 to connect to the circuit board 330, and the circuit board 330 connects to a plurality of connectors 304.The housing 550 includes a pushing mechanism configured to apply pressure to the readout plane 102, and the pressure applied to the readout plane 102 forces the plurality of qubit chips 101 to the quantum bus plane 100.The pushing mechanism comprises: a pusher block 570 positioned on top of the readout plane 102, and a spring mechanism 575 pressing downward against the pusher block 570.The top part (top cap 582) of the housing 550 applying a compression force to the spring mechanism 575 from above.\",\n \"It will be noted that various microelectronic device fabrication methods may be utilized to fabricate the components/elements discussed herein as understood by one skilled in the art.\",\n \"In semiconductor device fabrication, the various processing steps fall into four general categories: deposition, removal, patterning, and modification of electrical properties.\",\n \"Deposition is any process that grows, coats, or otherwise transfers a material onto the wafer.\",\n \"Available technologies include physical vapor deposition (PVD), chemical vapor deposition (CVD), electrochemical deposition (ECD), molecular beam epitaxy (MBE) and more recently, atomic layer deposition (ALD) among others.\",\n \"Removal is any process that removes material from the wafer: examples include etch processes (either wet or dry), and chemical-mechanical planarization (CMP), etc.\",\n \"Patterning is the shaping or altering of deposited materials, and is generally referred to as lithography.\",\n \"For example, in conventional lithography, the wafer is coated with a chemical called a photoresist; then, a machine called a stepper focuses, aligns, and moves a mask, exposing select portions of the wafer below to short wavelength light; the exposed regions are washed away by a developer solution.\",\n \"After etching or other processing, the remaining photoresist is removed.\",\n \"Patterning also includes electron-beam lithography.\",\n \"Modification of electrical properties may include doping, such as doping transistor sources and drains, generally by diffusion and/or by ion implantation.\",\n \"These doping processes are followed by furnace annealing or by rapid thermal annealing (RTA).\",\n \"Annealing serves to activate the implanted dopants.\",\n \"The flowchart and block diagrams in the Figures illustrate the architecture, functionality, and operation of possible implementations of systems, methods, and computer program products according to various embodiments of the present invention.\",\n \"In this regard, each block in the flowchart or block diagrams may represent a module, segment, or portion of instructions, which comprises one or more executable instructions for implementing the specified logical function(s).\",\n \"In some alternative implementations, the functions noted in the block may occur out of the order noted in the figures.\",\n \"For example, two blocks shown in succession may, in fact, be executed substantially concurrently, or the blocks may sometimes be executed in the reverse order, depending upon the functionality involved.\",\n \"It will also be noted that each block of the block diagrams and/or flowchart illustration, and combinations of blocks in the block diagrams and/or flowchart illustration, can be implemented by special purpose hardware-based systems that perform the specified functions or acts or carry out combinations of special purpose hardware and computer instructions.\"\n ]\n]"},"source":{"kind":"string","value":"Patent_15871436"}}},{"rowIdx":4493793,"cells":{"text":{"kind":"list like","value":[["GRAPHICAL USER INTERFACE FOR TISSUE BIOPSY SYSTEM","A screen providing a graphical user interface (GUI) for a tissue biopsy system includes a circular area and a plurality of GUI areas of variable size located in the circular area.","The plurality of GUI areas includes a first GUI area, a second GUI area, and a third GUI area.","The first GUI area is configured to represent a first region of the target site from which at least one tissue specimen has been separated from tissue at the target site by a tissue cutting member.","The second GUI area is configured to represent a second region from which the tissue cutting member may separate one or more additional tissue specimens from tissue at the target site.","The third GUI area is configured to represent a third region in which the tissue cutting member is deployed to separate a tissue specimen from tissue at the target site."],["1-41.","(canceled) 42.A screen providing a graphical user interface (GUI) for a tissue biopsy system having a tissue cutting member adapted for cutting one or more tissue specimens from tissue at a target site within a patient, the screen having the graphical user interface comprising: a circular area; and a plurality of GUI areas of variable size located in the circular area, the plurality of GUI areas including: a. a first GUI area configured to represent a first region of the target site from which at least one tissue specimen has been separated from tissue at the target site by the tissue cutting member, the first GUI area having a plurality of portions, wherein at least one portion of the plurality of portions is a curvy band portion; b. a second GUI area, visually distinguishable from the first GUI area, configured to represent a second region from which the tissue cutting member may separate one or more additional tissue specimens from tissue at the target site; and c. a third GUI area, visually distinguishable from the first and second GUI areas, configured to represent a third region in which the tissue cutting member is deployed to separate a tissue specimen from tissue at the target site.","43.The screen having the graphical user interface of claim 42, wherein the first GUI area includes a curvy band portion radially spaced from an arcuate fan-shaped portion.","44.The screen having the graphical user interface of claim 42, wherein the circular area defines a circumferential line, the first GUI area having a first curvy band portion adjacent to the circumferential line and a second curvy band portion radially separated from the first curvy band portion.","45.The screen having the graphical user interface of claim 44, wherein the first GUI area has a circular portion, and the second curvy band portion being interposed between the first curvy band portion and the circular portion.","46.The screen having the graphical user interface of claim 44, wherein the first GUI area has an arcuate fan-shaped portion, and the second curvy band portion being interposed between the first curvy band portion and the arcuate fan-shaped portion.","47.The screen having the graphical user interface of claim 42, wherein the circular area defines a circumferential line, the first GUI area having a curvy band portion adjacent to the circumferential line and a ring portion radially separated from the curvy band portion.","48.The screen having the graphical user interface of claim 47, wherein the first GUI area has a circular portion, and the ring portion being interposed between the curvy band portion and the circular portion.","49.The screen having the graphical user interface of claim 42, wherein the circular area defines a circumferential line, the first GUI area having a first curvy band portion adjacent to the circumferential line and the third GUI area having a second curvy band portion adjacent to the circumferential line.","50.The screen having the graphical user interface of claim 49, wherein the first GUI area includes a first arcuate fan-shaped portion radially spaced from the first curvy band portion and the third GUI area includes a second arcuate fan-shaped portion radially spaced from the second curvy band portion.","51.The screen having the graphical user interface of claim 42, wherein the circular area defines a circumferential line, the first GUI area having a first curvy band portion adjacent to the circumferential line and a ring portion radially separated from the first curvy band portion, and the third GUI area having a second curvy band portion adjacent to the circumferential line and radially separated from the ring portion of the first GUI area.","52.The graphical user interface of claim 51, wherein the first GUI area has a circular portion, and the ring portion being interposed between the first curvy band portion and the circular portion."],[" BACKGROUND OF THE INVENTION In diagnosing and treating certain medical conditions, such as potentially cancerous tumors, it is usually desirable to perform a biopsy, in which a specimen of the suspicious tissue is removed for pathological examination and analysis.","In many instances, the suspicious tissue is located in a subcutaneous site, such as inside a human breast.","To minimize surgical intrusion into the patient's body, it is desirable to be able to insert a small instrument into the patient's body to access the targeted site and to extract the biopsy specimen therefrom.","Electrosurgical techniques have been used in a variety of biopsy procedures.","In electrosurgery, high frequency electrical energy is typically applied to patient tissue through an active electrode, the electrical circuit being completed by a return electrode in contact with the patient's tissue.","Electrical energy flowing through the tissue from the active electrode is effective to ablate tissue near the active electrode, forming an opening in the tissue and so allowing insertion of the instrument into a patient's body.","A return electrode may be placed on the exterior of the patient's body or may be incorporated into the device itself.","The return electrode is typically attached to the patient at a point remote from where the primary or active electrode contacts the tissue.","Conventionally, when an electrosurgical biopsy instrument inserts into a patient's body, it's cutting end cannot be readily seen from outside.","This makes it difficult for a surgeon to find out where the electrosurgical biopsy instrument is, in a biopsy operation.","Thus, it is desirable to have a display device visually showing the location of the electrosurgical biopsy instrument with respect to the patient's body in biopsy operation."],[" SUMMARY OF THE INVENTION The invention is directed to a graphical user interface for a tissue biopsy system having a tissue cutting member adapted for cutting one or more tissue specimens from tissue at a target site within a patient.","In one embodiment, the graphical user interface includes at least a first GUI area and a second GUI area.","The first GUI area represents a first region of the target site from which the tissue cutting member has separated one or more tissue specimens.","The second GUI area, visually distinguishable from the first GUI area, represents a second region from which the tissue cutting member may separate one or more additional tissue specimens from tissue at the target site."],["RELATED APPLICATIONS This application is based on Provisional Application Ser.","No.","60/631,338, filed on Nov. 29, 2004, and claims priority therefrom.","The provisional application is incorporated by reference herein in its entirety.","FIELD OF THE INVENTION The present invention relates generally to tissue removing devices such as biopsy devices.","More specifically, it is directed to a graphical user interface (GUI) used in conjunction with the tissue removing devices.","BACKGROUND OF THE INVENTION In diagnosing and treating certain medical conditions, such as potentially cancerous tumors, it is usually desirable to perform a biopsy, in which a specimen of the suspicious tissue is removed for pathological examination and analysis.","In many instances, the suspicious tissue is located in a subcutaneous site, such as inside a human breast.","To minimize surgical intrusion into the patient's body, it is desirable to be able to insert a small instrument into the patient's body to access the targeted site and to extract the biopsy specimen therefrom.","Electrosurgical techniques have been used in a variety of biopsy procedures.","In electrosurgery, high frequency electrical energy is typically applied to patient tissue through an active electrode, the electrical circuit being completed by a return electrode in contact with the patient's tissue.","Electrical energy flowing through the tissue from the active electrode is effective to ablate tissue near the active electrode, forming an opening in the tissue and so allowing insertion of the instrument into a patient's body.","A return electrode may be placed on the exterior of the patient's body or may be incorporated into the device itself.","The return electrode is typically attached to the patient at a point remote from where the primary or active electrode contacts the tissue.","Conventionally, when an electrosurgical biopsy instrument inserts into a patient's body, it's cutting end cannot be readily seen from outside.","This makes it difficult for a surgeon to find out where the electrosurgical biopsy instrument is, in a biopsy operation.","Thus, it is desirable to have a display device visually showing the location of the electrosurgical biopsy instrument with respect to the patient's body in biopsy operation.","SUMMARY OF THE INVENTION The invention is directed to a graphical user interface for a tissue biopsy system having a tissue cutting member adapted for cutting one or more tissue specimens from tissue at a target site within a patient.","In one embodiment, the graphical user interface includes at least a first GUI area and a second GUI area.","The first GUI area represents a first region of the target site from which the tissue cutting member has separated one or more tissue specimens.","The second GUI area, visually distinguishable from the first GUI area, represents a second region from which the tissue cutting member may separate one or more additional tissue specimens from tissue at the target site.","BRIEF DESCRIPTION OF THE DRAWINGS FIG.","1 is an exploded view of the elongated tissue biopsy system embodying features of the invention.","FIG.","2 is a perspective view of the embodiment shown in FIG.","1 in an assembled condition without a housing cover for the probe component.","FIG.","3 is a side elevational view of the tissue biopsy device shown in the FIG.","2.FIG.","4A is a longitudinal cross-section of the probe shown in FIG.","3 taken along the lines 4-4 with the tissue cutting element in a withdrawn position.","FIG.","4B is a longitudinal cross-section of the probe shown in FIG.","3 taken along the lines 4-4 with the tissue cutting element in a forward or closed position.","FIG.","5 is a transverse cross-sectional view of the probe shown in FIG.","4B taken along the lines 5-5.FIG.","6 is a perspective view of the underside of the probe shown in FIG.","1.FIG.","7 is an enlarged perspective view of the distal end of the driver unit shown in FIG.","1.FIG.","8 is an enlarged perspective view of the distal end of the probe housing illustrating a marker element which depicts the orientation of the aperture in the tubular section of the biopsy device.","FIG.","9 is a perspective view of the tissue biopsy system shown in FIG.","1 assembled and mounted on a stereotactic frame.","FIG.","10 is a perspective view of the underside of the driver shown in FIG.","1.FIG.","11 is an elevational view of a marker delivery device with a flared guide on the distal end of the shaft which facilitates guiding the distal tip of a marker delivery device into the interior of the proximal end of the tissue cutter.","FIG.","12 is a longitudinal cross-sectional view of the distal end of the marker delivery device and flared guide disposed within the tissue collection component shown in FIG.","1.FIG.","13 is a longitudinal cross sectional view of the proximal end of the marker delivery device with the flared guide at the proximal end of the shaft and with the shaft deployed within the inner lumen of the tissue cutter.","FIG.","14 illustrates a screen providing information with respect to an operation of the tissue biopsy system.","FIGS.","15A through 15E illustrate a number of alternative circular graphical user interfaces, each having a first GUI area and second GUI area representing various parts of a target site within a patient from which one or more tissue specimens haven been or may be separated from tissue.","FIGS.","16A through 16E illustrate a number of alternative polygonal graphical user interfaces, each having a first GUI area and second GUI area representing various parts of a target site within a patient from which one or more tissue specimens haven been or may be separated from tissue.","FIGS.","17A through 17E illustrate a number of alternative circular graphical user interfaces, each having a first, second and third GUI area representing various parts of a target site within a patient from which one or more tissue specimens haven been or may be separated or in which the tissue cutting element is deployed.","FIGS.","18A through 18E illustrate a number of alternative polygonal graphical user interfaces, each having a first, second and third GUI area representing various parts of a target site within a patient from which one or more tissue specimens haven been or may be separated, or in which the tissue cutting element is deployed.","DETAILED DESCRIPTION OF EMBODIMENTS OF THE INVENTION FIGS.","1-3 illustrate a biopsy system 10 embodying features of the invention which includes a disposable probe component 11, a driver component 12 and specimen collector 13.The probe component 11 generally includes an elongated distal shaft 14 having a tubular section or cannula 15 with a tissue penetrating tip 16 on the distal end thereof and an open, tissue receiving aperture 17.The probe component 11 also includes a probe housing 18 with a housing cover 19 which is configured to interfit with the driver component 12.A tissue cutter 20 is slidably disposed within the probe and has a distal cutting surface 21 which severs tissue which extends through the tissue receiving aperture 17.Details of the probe component 11 are further shown in FIGS.","4A and 4B.","The probe housing 18 has a mechanical system for rotating the housing and the tubular section 15 secured thereto to control the angular position of the tissue receiving aperture 17 and for moving the tissue cutter 20 slidably disposed within the probe component 11.The mechanical system of the driver component 12 has first driving gear 22 that is configured to engage the probe gear 23 and rotate the probe housing 18 so as to adjust the orientation of aperture 17 in the distal extremity of the tubular section 15.The probe gear 23 is secured to the rotating connector body 24 by adhesive 25.The proximal extremity of the tubular section 15 is secured to the rotating connector body 24 by adhesive 26.An end cap 27 retains the connector body 24 within the probe housing 18.Rotation of the probe gear 23 rotates the connector body 24 and the attached tubular section 15.The rotation is preferably controlled so that the tubular section 15 rotates in discrete steps about the longitudinal axis 28 to adjust the angular orientation of the aperture 17 about the longitudinal axis.","Preferably these discrete orientations may be provided in increments of 30° which can be readily indicated by arrow 29 at the distal end of the probe housing 18 as shown in FIG.","8.The second driving gear 30 is configured to drive the tissue cutter 20 longitudinally.","The driving gear 30 engages probe gear 31 which drives cutter traverse nut 32 and cutter screw 33 threadably connected to the cutter traverse nut.","The distal end of the cutter screw 33 is provided with a recess 34 which receives the rib 35 of the cutter shuttle 36.The cutter shuttle 36 is secured to the tissue cutter 20 by adhesive 37.The probe gear 31 is secured to the cutter traverse nut 32 by adhesive 38.Rotation of the probe gear 31 adjusts the relative axial position of the cutter screw 33 with respect to the cutter traverse nut 32 which is secured to the cutter shuttle 36.Longitudinal movement of the tissue cutter 20 follows the longitudinal movement of the cutter shuttle 36 resulting from the movement of cutter screw 33.The length of the tissue receiving aperture 17, and as a result the length of the specimen, can be controlled by adjusting the initial longitudinal position of the distal end of the tissue cutter 20 within the aperture, before cutting.","The third driving gear 40 is configured to rotate or oscillate the tissue cutter 20 as the cutter moves along the longitudinal axis 28 to facilitate the cutting action of the cutting surface 21 on the distal end of the cutter.","The third driving gear 40 engages probe gear 41 which is secured to cutter oscillation shaft 42 by adhesive 43.The probe gear 41 may be oscillated back and forth about the longitudinal axis 28 or rotated continuously in a single direction about the longitudinal axis, or both depending upon the desired rotational movement of the tissue cutter.","A biased valve assembly 44 is provided in the distal end of the probe housing 18 to ensure sealing when a vacuum is developed within the interior 45 of the tissue cutter 20 while providing an atmospheric vent 46 between the interior surface 47 of the tubular section 15 and the exterior surface 48 of the tissue cutter 20.The valve assembly 44 includes a spring 49, valve body 50 and a valve collar 51 which is secured to the proximal end of the tubular section 15 by adhesive 52.The proximal end of the valve spring 49 rests against the shoulder 53 provided in the exterior of the valve body 50.A biased cutter shaft seal 54 slidably engages the exterior 48 of the tissue cutter 20.The tissue specimen collector 13 is secured to the proximal end of the housing of probe component 11 and has an interior 55 in fluid communication with the inner lumen 56 extending within the tissue cutter 20 and has a removable proximal wall 57 of specimen receiving cartridge 58 which gives access to the interior 55 and any tissue specimens which may have been drawn therein.","A vacuum is generated within the interior 55 to draw tissue specimens through the inner lumen 45 into the interior 55.Tubular member 59 has a distal end which is in fluid communication with the interior 55 of the tissue specimen collector 13 and has a proximal end (not shown) which is configured to be connected to a vacuum source.","Application of a vacuum within the tubular member 59 aids in pulling tissue into the interior 17 of the tubular section 15 and transfer of the severed tissue specimen through the inner lumen 45 of the tissue cutter 20 to the specimen cartridge 58.The driver 12 has a housing 60 with an upper concave surface 61 which is configured to receive the lower surface 62 of the probe housing 18.Three partially exposed driving gears 22, 30 and 40 are provided on the proximal end of the driver 12 which are configured to engage the probe gears 23, 31 and 41 respectively.","The drive 12 is provided with three separately operating drive motors (not shown) which drive the drive gears 22, 30 and 40.The separate drive motors (not shown) are connected to and the operation thereof controlled by a control module, such as described in copending application Ser.","No.","10/847,699, filed on May 17, 2004.The control module controls the motors which move the individual drive gears 22, 30 and 40.The gear 22 engages gear 23 in the probe 11 to control the rotation of the probe housing 18 and the location and orientation of the tissue receiving aperture 17.The drive gear 30 engages probe gear 31 to control the longitudinal position and motion of the tissue cutter 20 along the longitudinal axis 28.Drive gear 40 engages probe gear 41 to control the oscillation or rotation of the tissue cutter 20 about the longitudinal axis 28.As shown in FIG.","7, the front face of the driver component 12 is provided with light sources 66 and 67 and a manually activatable switch 68 to activate the light sources and enable the physician and other operating personnel to better view the operating site on the patient.","Other manual switches, e.g.","a foot activated switch, may be employed.","Alternatively, the light sources may be automatically activated when the probe component 11 is installed on the driver 12 or other events such as when electrical power is turned on.","The driver component 12 may have a battery pack for the light sources 66 and 67.The penetrating distal tip 16 may have a variety of tip shapes.","A particularly suitable distal tip shape is described in co-pending provisional application Ser.","No.","60/532,277, filed on Dec. 23, 2003.Alternatively, the distal tip may be provided with an arcuate RF electrode such as disclosed in U.S. Pat.","No.","6,261,241, and U.S. Pat.","No.","6,471,700, both assigned to the present assignee.","The separate driver component 12 allows the entire probe unit to be disposable.","The drive gears of the drive component 12 control the motion of the tissue cutting member 20 for cutting and the motion of the tubular section 15 to orient the aperture 17.Other means (not shown) may provide mechanical and electrical power, vacuum, and control to the probe device.","Examples of replaceable snap-in type probe units are disclosed in Burbank et al., U.S. patent application Ser.","No.","10/179,933, “Apparatus and Methods for Accessing a Body Site” hereby incorporated by reference in its entirety.","Drive units such as that described in WO 02/069808 (which corresponds to co-pending U.S. application Ser.","No.","09/707,022, filed Nov. 6, 2000 and U.S. application Ser.","No.","09/864,021, filed May 23, 2001), which are assigned to the present assignee, may be readily modified by those skilled in the art to accommodate the movement of the cutting member 20.The distal end of the probe component 11 is advanced within the patient with the tissue cutter 20 in a forward or closed position (FIG.","4B), until the aperture 17 of the tubular section 15 is located in a desired location for taking a tissue specimen.","The tissue cutter 20 is then withdrawn proximally to an open position to open the aperture 17.The withdrawal of the tissue cutter can be used to control the length of the aperture which is opened in order to control the length of the specimen which is severed.","A vacuum is applied to the interior 45 of the tissue cutter 20 to draw tissue at the site into the inner lumen of the tubular section 15 through the aperture 17.The tissue cutter 20 is then driven distally by rotation of probe gear 30 and rotated or oscillated by drive gear 40 engaging probe gear 41 to sever the aspirated tissue from the supporting tissue at the target site with the tissue cutting surface 21.The vacuum within the interior of the tissue cutter 20 causes the tissue specimen to be drawn through the inner lumen 45 of the tissue cutter 20 and into the cartridge 58 of specimen collector 13 shown in FIG.","2.Positive pressure or even ambient conditions distal to the tissue specimen can facilitate tissue passing through the interior 45 of tissue cutter 20.If another tissue specimen is desired, the tubular section 15 may be rotated by the drive gear 22 engaging the probe gear 23 in one or more steps to repeat obtaining another tissue specimen in the same manner without otherwise moving the probe component 11.Typically, a first tissue specimen is obtained with the aperture 17 of the probe 11 in the 12 o-clock position, the second at the 3 o-clock position, the third at the 9 o-clock position and the fourth at the 6 o-clock position.","The location of the second and third specimens may be reversed.","The position of the aperture 17 may be indicated by a marker arrow 29 at the end cap 27 so that the physician or other operating personnel can readily determine what the orientation of the aperture 17 within the patient.","The biopsy system 10 may be hand held for some biopsy procedures or the system may be mounted on a stereotactic mounting stage 80 as shown in FIG.","9.A shoe 81 is slidably mounted to a rail 82 of a Fisher stage.","The mounting member 83 is secured to the shoe 81 by a threaded post (not shown) secured to thumbwheel 84.As shown in FIG.","10, the bottom surface 85 of the driver component 12 is configured to conform at least in part to the upper surface of the mounting member 83.The sampling and vacuum switches 86 and 87 respectively on the driver component 12 are actuated by the optional sampling and vacuum actuating elements 88 and 89 on the mounting member 83.Alternatively, sampling and vacuum may be actuated with a foot pedal.","As shown in FIG.","10, the driver component has an operator dial 90 which when turned opens a threaded hole 91 for receiving a threaded post (not shown) secured to the thumbwheel 84 and the locating pin holes 92 and 93 which receive the complementary posts (not shown) in the mounting member 83.As mentioned above, positive pressure or even ambient conditions will aid in passing the severed tissue specimen through the inner lumen 45 of tissue cutter 20 into the cartridge 58 of specimen collector 13.As shown in FIGS.","4A and 4B venting valve can provide ambient pressure behind the tissue specimen in the cutter interior 45 from the interior of the tubular section 15.The valve body 50 is opened for atmospheric venting when the tissue cutter 20 is in the forward position upon the completion of severing the specimen from the tissue site.","However, when the tissue cutter 20 is pulled back proximally the valve spring 49 urges the valve body 50 back to a closed position.","While the tissue cutter 20 is shown with a tissue cutting surface 21 which is perpendicular to the longitudinal axis 28, the tissue cutting surface may be at an angle or even parallel to the longitudinal axis as described in co-pending application Ser.","No.","10/642,406, filed Aug. 15, 2003.The distal cutting edge 21 of the tissue cutter 20 may initially be located proximal to the aperture 17 to provide a full aperture for receiving tissue or it can be initially located within the aperture 17 in order to control the length of the specimen.","The cutting action of tissue cutter 20 preferably continues until the beveled cutting surface 21 has completely traversed the aperture 17 to ensure that the tissue drawn through the aperture is completely severed from supporting tissue at the biopsy site.","A vacuum may be applied to aspirate the severed tissue specimen through the inner lumen of the tissue cutter 20 to the cartridge in the specimen collector at the proximal end of the biopsy device.","Positive pressure or access to ambient conditions may be provided in the distal end of the tubular section to aid in the specimen transfer.","After the removable wall 57 of the specimen receiving cartridge 58 is removed and the specimens therein removed, it is frequently desirable to deliver one or more markers to the target site from which the specimens have been removed.","Such marker delivery devices are shown in co-pending application Ser.","No.","10/753,694, filed on Jan. 7, 2004 and co-pending application Ser.","No.","10/444,770, filed May 23, 2003.However, the distal ends of these marker delivery devices are very small and they can be difficult to insert into the proximal end of the tissue cutter 20 which is just slightly larger to accommodate the marker delivery shaft.","FIG.","11 illustrates a marker delivery device 100 which is particularly suitable to facilitate the introduction of the distal end of the shaft 101 into the inner lumen 45 of the tissue cutter 20 and the advancement therein.","As indicated into the inner lumen 45 of the tissue cutter 20 to eject one or more markers through the aperture 17 in the tubular section 15 before the biopsy device 10 is removed from the patient.","As shown in FIG.","12, to aid in the insertion of the small diameter distal tip 101 of a marker delivery device 100 into the slightly larger inner lumen 45 of the tubular cutter 20 at its proximal end, the distal tip is preferably provided with an outwardly flared guide 102 which is slidably mounted on the shaft 103 of the marker delivery device 100.The proximal end of the tubular cutter 20, the flared guide 102 and/or the distal tip 101 may be provided with mating guide elements which orient the marker delivery device so that one or more markers are discharged through the aperture 17 when the pusher element slidably disposed within the delivery device is urged distally to press at least one marker body out the discharge opening in the distal portion of the elongated shaft of the marker delivery device.","The delivery of markers to the target site after specimen removal, while the distal end of the biopsy device is still at the biopsy site, ensures that the markers are properly position at the biopsy site.","While the slidably mounted, flared proximal guide 102 is described with respect to being disposed on the shaft 103 of marker delivery device 101, the flared guide 102 has wide application within a variety of biopsy and other devices where one small diameter tubular member is to be inserted into a slightly larger, but still small diameter second tubular member.","The elongated probe component 11 of the biopsy system 10 has a length of about 3 to about 20 cm, preferably, about 5 to about 13 cm, and more specifically, about 8 to about 9 cm for breast biopsy use.","To assist in properly locating the probe 11 during advancement thereof into a patient's body, the distal extremity of the tubular section may be provided with a marker at a desirable location that provide enhanced visualization by eye, by ultrasound, by X-ray, MRI or other imaging or visualization means.","Manual palpation may also be employed.","An echogenic polymer coating that increases contrast resolution in ultrasound imaging devices (such as ECHOCOAT™ by STS Biopolymers, of Henrietta, N.Y.) is suitable for ultrasonic visualization.","Radiopaque markers may be made with, for example, stainless steel, platinum, gold, iridium, tantalum, tungsten, silver, rhodium, nickel, bismuth, other radiopaque metals, alloys and oxides of these metals.","In addition, the surfaces of the device in contact with tissue or other components of the device may be provided with a suitable lubricious coating such as a hydrophilic material or a fluoropolymer.","The tubular section and the tissue cutter are preferably formed of a surgical grade stainless steel.","However, other high strength materials such as MP35N, other cobalt-chromium alloys, NiTi alloys, ceramics, glasses, and high strength polymeric materials or combinations thereof may be suitable.","A patient's skin usually must be breached in order to gain access to a body site where a tissue specimen is to be obtained.","A scalpel or other surgical instrument may be used to make an initial incision in the skin.","After the specimens have been taken, the biopsy device may be removed from the patient.","The entire device may be removed; however, in some embodiments, the cartridge 58 may be removed from the system 10 and a delivery cannula may be inserted through the inner lumen of the cutter 20 to deliver markers to the biopsy site through the aperture 17.In addition, it will be readily appreciated that other types of instruments may be inserted into the tissue site through the tissue cutter in addition to or in place of the instruments described above.","Moreover, therapeutic or diagnostic agents may be delivered through the tissue cutter 20 or the tubular section 15.FIG.","14 illustrates a screen 104 providing certain useful information with respect to an operation of the tissue biopsy system, according to one embodiment of the present invention.","The screen 104 can be provided by any type of displays, such as liquid crystal displays (LCD's), cathode ray tube (CRT) monitors and plasma displays.","The displays can be used in association with a control module that controls electrosurgical instruments, such as the biopsy system in FIG.","1.For example, the screen 104 can be provided a CM3000 Display used in association with a CM3000 Control Module by SenoRx, Inc.","The screen 104 provides a first textual message 106 showing various states of operation for the biopsy system.","For example, the states of operation may include an initialization, calibration, closed, opening, sampling, indexing, indexing error, tool failure, vacuum failure, and tool exit state.","These states represent various stages of preparing the biopsy system, taking a tissue specimen from a patient with the biopsy system, and errors occurred during the preparing and taking processes.","A second textual message 108 on the screen 104 details the status of the particular state shown by the first textual message 106.For example, on the screen 104, the second textual message 108 tells a user to wait for the completion of an opening state, in which the biopsy system performs an open stroke.","At the bottom of the screen 104 are indicators 110 for indicating certain events or conditions.","For example, when the indicator 110 that labeled as VAC is on, it tells that a vacuum system is currently running.","The screen 104 further provides a graphical user interface 112 that represents various parts of a target site within a patient from which one or more tissue specimens have been taken or may be taken.","The graphical user interface 112 may further represent an angular position of the tissue cutting member 20 shown in FIG.","2.Since the tissue cutting member 20 positions its cutting tip in a target site of a patient's body in a rotational movement, the graphical user interface 112 is designed based on a circular shape.","However, it is noteworthy that other shapes capable of representing the angular positions of the tissue cutting member 20 can also be used as the basic shapes for the graphical user interface 112.For example, the graphical user interface 112 may be designed based on a polygonal shape.","Various designs for the graphical user interface 112 will be described in the following paragraphs.","FIGS.","15A through 15E illustrate various alternatives of the graphical user interface 112 in FIG.","14, according to one embodiment of the present invention.","In this embodiment, the graphical user interface 112 includes a first GUI area representing a first region of a target site from which at least one tissue specimen has been separated from tissue at the target site by the tissue cutting member.","The graphical user interface 112 further includes a second GUI area, visually distinguishable from the first GUI area, representing a second region from which the tissue cutting member may separate one or more additional tissue specimens from tissue at the target site.","The first and second GUI areas are marked with colors or patterns distinguishable from one another.","They visualize the part of the tissue at the target site that has been cut, and the rest of the tissue that may be cut by the biopsy system.","This helps a surgeon to better understand the progress of a biopsy operation.","FIG.","15A shows a first alternative of a graphical user interface 114 according to the embodiment.","The first GUI area 116 and second GUI area 118 are arranged within a circle.","The first GUI area 116 is of a fan shape, and the circle unoccupied by the first GUI area 116 represents the second GUI area 118.In this figure, a smaller angular portion of the tissue at the target site has been cut, while a larger angular portion of the tissue may be cut in a later process of operation.","FIG.","15B shows a second alternative of a graphical user interface 120 according to the embodiment.","The shaded part represents the first GUI area 122, and the unshaded part represents the second GUI area 124.The first GUI area 122 includes a first portion 126 of a fan shape at the centric point of the circular shaped graphical user interface 120.The arm of the first portion 126 is smaller than the radius of the graphical user interface 120.The first GUI area 122 further includes a second portion 128 that is shaped as a curvy band in alignment with an arc of the first portion 126.The angle of first portion 126 represents the angular portion of the tissue that has been cut.","FIG.","15C shows a third alternative of a graphical user interface 130 according to the embodiment.","The shaded part represents the first GUI area 132, and the unshaded part represents the second GUI area 134.The first GUI area includes a first portion 136 of a circular shape, and a second portion 138 shaped as a curvy band adjacent to a circumferential line of the first portion 136.The two side lines of the second portion 138 define an angle that represents the angular portion of the tissue that has been cut.","FIG.","15D shows a fourth alternative of a graphical user interface 140 according to the embodiment.","The shaded part represents the first GUI area 142, and the unshaded part represents the second GUI area 144.The first GUI area 142 includes a first portion 145 of a circular shape, a second portion 146 shaped as a curvy band adjacent to a circumferential line of the first portion, and a third portion 147 shaped as a curvy band in alignment with an outer peripheral line of the second portion 146.The side lines of the second portion 146 or the third portion 147 define an angle that represents the angular portion of the tissue that has been cut.","FIG.","15E shows a fifth alternative of a graphical user interface 150 according to the embodiment.","The shaded part represents the first GUI area 152, and the unshaded part represents the second GUI area 154.The first GUI area includes a first portion 155 of a circular shape, a second portion 156 of a ring shape surrounding the first portion 155, and a third portion 157 shaped as a curvy band adjacent to a circumferential line of the second portion 156.The side lines of the third portion 157 define an angle representing the angular portion of the tissue that has been cut.","FIGS.","16A through 16E show another set of alternatives of the graphical user interface 112 in FIG.","14 according to the embodiment of the present invention.","FIG.","16A shows a first alternative of a graphical user interface 160.The first GUI area 162 and second GUI area 164 are arranged within a regular polygon.","The first GUI area 162 is a divisional portion of the regular polygon with an angle defined at a geometrical center thereof.","The reset of the regular polygon unoccupied by the first GUI area 162 represents the second GUI area 164.As discussed above, the first GUI area 162 represents an angular portion of the tissue at the target site that has been cut, while the second GUI area 164 represent the portion of the tissue that may be cut in a later operation process.","FIG.","16B shows a second alternative of a graphical user interface 170 according to the embodiment.","The shaded part represents the first GUI area 172, and the unshaded part represents the second GUI area 174.The first GUI area 172 includes a first portion 176 of a polygonal shape with an angle defined at a geometrical center of the regular polygon 179.The first GUI area 174 further includes a second portion 178 shaped as a polygonal band along a peripheral line of the regular polygon 179, in alignment with the first portion 176.The angle of first portion 176 represents the angular portion of the tissue that has been cut.","FIG.","16C shows a third alternative of a graphical user interface 180 according to the embodiment.","The shaded part represents the first GUI area 182, and the unshaded part represents the second GUI area 184.The first GUI area 182 includes a first portion 186 of a polygonal shape having a geometrical center the same as that of the regular polygon 189.The first GUI area 180 further includes a second portion 188 shaped as a polygonal band along a peripheral line of the regular polygon 189, adjacent to an outer peripheral line of the first portion 186.The two side lines of the second portion 188 define an angle representing the angular portion of the tissue that has been cut.","FIG.","16D shows a fourth alternative of a graphical user interface 190 according to the embodiment.","The shaded part represents the first GUI area 192, and the unshaded part represents the second GUI area 194.The first GUI area 192 includes a first portion 195, second portion 196 and third portion 197.The first portion 195 is of a polygonal shape having a geometrical center the same as that of the regular polygon 198.The second portion 196 is shaped as a polygonal band adjacent to an outer peripheral line of the first portion 195.The third portion 197 is shaped as a polygonal band along a peripheral line of the regular polygon 198, in alignment with an outer peripheral line of the second portion 196.The two side lines of the second portion 196 or the third portion 197 define an angle representing the angular portion of the tissue that has been cut.","FIG.","16E shows a fifth alternative of a graphical user interface 200 according to the embodiment.","The shaded part represents the first GUI area 202, and the unshaded part represents the second GUI area 204.The first GUI area 202 includes a first portion 205, second portion 206 and third portion 207.The first portion 205 is of a polygonal shape having a geometrical center the same as that of the regular polygon 208.The second portion 206 is shaped as a polygonal ring surrounding the first portion 205.The third portion 207 is shaped as a polygonal band along a peripheral line of the regular polygon 208, adjacent to an outer peripheral line of the second portion 206.The two side lines of the third portion 207 define an angle representing the angular portion of the tissue that has been cut.","In the above embodiment, while none of the various graphical user interfaces shows a current angular position of the tissue cutting member, it can be known by an external indicator 29 shown in FIG.","8.FIGS.","17A through 17E illustrate various alternatives of the graphical user interface 112 in FIG.","14, according to another embodiment of the present invention.","In this embodiment, the graphical user interface 112 includes a first, second and third GUI areas.","The first GUI area represents a first region of a target site from which at least one tissue specimen has been separated from tissue at the target site by the tissue cutting member.","The second GUI area, visually distinguishable from the first GUI area, represents a second region from which the tissue cutting member may separate one or more additional tissue specimens from tissue at the target site.","The third GUI area, visually distinguishable from the first and second GUI areas, represents a third region in which the tissue cutting member is deployed to separate a tissue specimen from tissue at the target site.","The first, second and third GUI areas are marked with colors or patterns distinguishable from each other.","They visualize the part of the tissue at the target site that has been cut, the rest of the tissue that may be cut, and the angular position where the cutting member is at.","This helps a surgeon to better understand the progress of a biopsy operation.","FIG.","17A shows a first alternative of a graphical user interface 210 according to the embodiment.","The first GUI area 202, second GUI area 204 and third GUI area 206 are arranged within a circle 208.The first GUI area 202 and the third GUI area 206 are of a fan shape.","The circle unoccupied by the first GUI area 202 and third GUI area 206 represent the second GUI area 118.FIG.","17B shows a second alternative of a graphical user interface 220 according to the embodiment.","The graphical user interfere face 220 differs from that in FIG.","15B in having a third GUI area 222, which includes a first portion 223 and second portion 224.The first portion 223 of the third GUI area 222 is of a fan shape concentric with a first portion 225 of the first GUI area 226.The second portion 224 of the third GUI area 222 is shaped as a curvy band in alignment with an arc of the first portion 223 of the third GUI area 222.FIG.","17C shows a third alternative of a graphical user interface 230 according to the embodiment.","The graphical user interfere face 230 differs from that in FIG.","15C in having a third GUI area 232, which is shaped as a curvy band adjacent to the circumferential line of a first portion 234 of the first GUI area 236.FIG.","17D shows a fourth alternative of a graphical user interface 240 according to the embodiment.","The graphical user interfere face 240 differs from that in FIG.","15D in having a third GUI area 242, which includes a first portion 243 and second portion 244.The first portion 243 of the third GUI area 242 is shaped as a curvy band adjacent to the circumferential line of a first portion 245 of the first GUI area 246.The second portion 244 of the third GUI area 242 is also shaped as a curvy band in alignment with an outer peripheral line of the second portion 242.FIG.","17E shows a fifth alternative of a graphical user interface 250 according to the embodiment.","The graphical user interfere face 250 differs from that in FIG.","15E in having a third GUI area 252, which is shaped as a curvy band adjacent to the circumferential line of a ring 254 of the first GUI area 256.FIGS.","18A through 18E show another set of alternatives of the graphical user interface 112 in FIG.","14 according to the embodiment of the present invention.","FIG.","18A shows a first alternative of a graphical user interface 260.The graphical user interface 260 differs from that in FIG.","16A in having a third GUI area 262, which is a divisional portion of the regular polygon 264 with an angle defined at a geometrical center the regular polygon 265.FIG.","18B shows a second alternative of a graphical user interface 270.The graphical user interface 270 differs from that in FIG.","16B in having a third GUI area 272, which includes a first portion 273 and a second portion 274.The first portion 273 of the third GUI area 272 is of a polygonal shape with an angle defined at the geometrical center of the regular polygon 275.The second portion 274 of the third GUI area 272 is shaped as a polygonal band along the peripheral line of the regular polygon 275, in alignment with an outer peripheral line of the first portion 273.FIG.","18C shows a third alternative of a graphical user interface 280.The graphical user interface 280 differs from that in FIG.","16C in having a third GUI area 282, which is shaped as a polygonal band along a peripheral line of the regular polygon 284.FIG.","18D shows a fourth alternative of a graphical user interface 290.The graphical user interface 290 differs from that in FIG.","16D in having a third GUI area 292, which includes a first portion 293 and a second portion 294.The first portion 293 of the third GUI area 292 is shaped as a polygonal band adjacent to an outer peripheral line of an inner polygon 296.The second portion 294 of the third GUI area 292 is shaped as a polygonal band along the peripheral line of the regular polygon 295, adjacent to an outer peripheral line of the first portion 293.FIG.","18E shows a fifth alternative of a graphical user interface 300.The graphical user interface 300 differs from that in FIG.","16E in having a third GUI area 302, which is shaped as a polygonal band along a peripheral line of the regular polygon 304, adjacent to a polygonal ring 306.As discussed above, the first, second and third GUI areas visualize the part of the tissue at the target site that has been cut, the rest of the tissue that may be cut, and the current angular position where the tissue cutting member is at.","This helps a surgeon to better understand the progress of a biopsy operation.","While particular forms of the invention have been illustrated and described herein, it will be apparent that various modifications and improvements can be made to the invention.","For example, while the various embodiments of the invention have been described herein in terms of a biopsy device, it should be apparent that the devices and methods of utilizing the device may be employed to remove tissue for purposes other than for biopsy, i.e.","for treatment or other diagnoses.","Other modifications include, for example, a tissue cutter slidably mounted around the tubular section of the probe component rather than within the tubular section.","Moreover, individual features of embodiments of the invention may be shown in some drawings and not in others, but those skilled in the art will recognize that individual features of one embodiment of the invention can be combined with any or all the features of another embodiment.","Accordingly, it is not intended that the invention be limited to the specific embodiments illustrated.","It is therefore intended that this invention to be defined by the scope of the appended claims as broadly as the prior art will permit.","Terms such a “element”, “member”, “device”, “section”, “portion”, “component”, “means”, “step” and words of similar import, when used herein, shall not be construed as invoking the provisions of 35 U.S.C.","§ 112(6) unless the following claims expressly use the term “means” followed by a particular function without specific structure or the term “step” followed by a particular function without specific action.","All patents and patent applications referred to above are hereby incorporated by reference in their entirety."]],"string":"[\n [\n \"GRAPHICAL USER INTERFACE FOR TISSUE BIOPSY SYSTEM\",\n \"A screen providing a graphical user interface (GUI) for a tissue biopsy system includes a circular area and a plurality of GUI areas of variable size located in the circular area.\",\n \"The plurality of GUI areas includes a first GUI area, a second GUI area, and a third GUI area.\",\n \"The first GUI area is configured to represent a first region of the target site from which at least one tissue specimen has been separated from tissue at the target site by a tissue cutting member.\",\n \"The second GUI area is configured to represent a second region from which the tissue cutting member may separate one or more additional tissue specimens from tissue at the target site.\",\n \"The third GUI area is configured to represent a third region in which the tissue cutting member is deployed to separate a tissue specimen from tissue at the target site.\"\n ],\n [\n \"1-41.\",\n \"(canceled) 42.A screen providing a graphical user interface (GUI) for a tissue biopsy system having a tissue cutting member adapted for cutting one or more tissue specimens from tissue at a target site within a patient, the screen having the graphical user interface comprising: a circular area; and a plurality of GUI areas of variable size located in the circular area, the plurality of GUI areas including: a. a first GUI area configured to represent a first region of the target site from which at least one tissue specimen has been separated from tissue at the target site by the tissue cutting member, the first GUI area having a plurality of portions, wherein at least one portion of the plurality of portions is a curvy band portion; b. a second GUI area, visually distinguishable from the first GUI area, configured to represent a second region from which the tissue cutting member may separate one or more additional tissue specimens from tissue at the target site; and c. a third GUI area, visually distinguishable from the first and second GUI areas, configured to represent a third region in which the tissue cutting member is deployed to separate a tissue specimen from tissue at the target site.\",\n \"43.The screen having the graphical user interface of claim 42, wherein the first GUI area includes a curvy band portion radially spaced from an arcuate fan-shaped portion.\",\n \"44.The screen having the graphical user interface of claim 42, wherein the circular area defines a circumferential line, the first GUI area having a first curvy band portion adjacent to the circumferential line and a second curvy band portion radially separated from the first curvy band portion.\",\n \"45.The screen having the graphical user interface of claim 44, wherein the first GUI area has a circular portion, and the second curvy band portion being interposed between the first curvy band portion and the circular portion.\",\n \"46.The screen having the graphical user interface of claim 44, wherein the first GUI area has an arcuate fan-shaped portion, and the second curvy band portion being interposed between the first curvy band portion and the arcuate fan-shaped portion.\",\n \"47.The screen having the graphical user interface of claim 42, wherein the circular area defines a circumferential line, the first GUI area having a curvy band portion adjacent to the circumferential line and a ring portion radially separated from the curvy band portion.\",\n \"48.The screen having the graphical user interface of claim 47, wherein the first GUI area has a circular portion, and the ring portion being interposed between the curvy band portion and the circular portion.\",\n \"49.The screen having the graphical user interface of claim 42, wherein the circular area defines a circumferential line, the first GUI area having a first curvy band portion adjacent to the circumferential line and the third GUI area having a second curvy band portion adjacent to the circumferential line.\",\n \"50.The screen having the graphical user interface of claim 49, wherein the first GUI area includes a first arcuate fan-shaped portion radially spaced from the first curvy band portion and the third GUI area includes a second arcuate fan-shaped portion radially spaced from the second curvy band portion.\",\n \"51.The screen having the graphical user interface of claim 42, wherein the circular area defines a circumferential line, the first GUI area having a first curvy band portion adjacent to the circumferential line and a ring portion radially separated from the first curvy band portion, and the third GUI area having a second curvy band portion adjacent to the circumferential line and radially separated from the ring portion of the first GUI area.\",\n \"52.The graphical user interface of claim 51, wherein the first GUI area has a circular portion, and the ring portion being interposed between the first curvy band portion and the circular portion.\"\n ],\n [\n \" BACKGROUND OF THE INVENTION In diagnosing and treating certain medical conditions, such as potentially cancerous tumors, it is usually desirable to perform a biopsy, in which a specimen of the suspicious tissue is removed for pathological examination and analysis.\",\n \"In many instances, the suspicious tissue is located in a subcutaneous site, such as inside a human breast.\",\n \"To minimize surgical intrusion into the patient's body, it is desirable to be able to insert a small instrument into the patient's body to access the targeted site and to extract the biopsy specimen therefrom.\",\n \"Electrosurgical techniques have been used in a variety of biopsy procedures.\",\n \"In electrosurgery, high frequency electrical energy is typically applied to patient tissue through an active electrode, the electrical circuit being completed by a return electrode in contact with the patient's tissue.\",\n \"Electrical energy flowing through the tissue from the active electrode is effective to ablate tissue near the active electrode, forming an opening in the tissue and so allowing insertion of the instrument into a patient's body.\",\n \"A return electrode may be placed on the exterior of the patient's body or may be incorporated into the device itself.\",\n \"The return electrode is typically attached to the patient at a point remote from where the primary or active electrode contacts the tissue.\",\n \"Conventionally, when an electrosurgical biopsy instrument inserts into a patient's body, it's cutting end cannot be readily seen from outside.\",\n \"This makes it difficult for a surgeon to find out where the electrosurgical biopsy instrument is, in a biopsy operation.\",\n \"Thus, it is desirable to have a display device visually showing the location of the electrosurgical biopsy instrument with respect to the patient's body in biopsy operation.\"\n ],\n [\n \" SUMMARY OF THE INVENTION The invention is directed to a graphical user interface for a tissue biopsy system having a tissue cutting member adapted for cutting one or more tissue specimens from tissue at a target site within a patient.\",\n \"In one embodiment, the graphical user interface includes at least a first GUI area and a second GUI area.\",\n \"The first GUI area represents a first region of the target site from which the tissue cutting member has separated one or more tissue specimens.\",\n \"The second GUI area, visually distinguishable from the first GUI area, represents a second region from which the tissue cutting member may separate one or more additional tissue specimens from tissue at the target site.\"\n ],\n [\n \"RELATED APPLICATIONS This application is based on Provisional Application Ser.\",\n \"No.\",\n \"60/631,338, filed on Nov. 29, 2004, and claims priority therefrom.\",\n \"The provisional application is incorporated by reference herein in its entirety.\",\n \"FIELD OF THE INVENTION The present invention relates generally to tissue removing devices such as biopsy devices.\",\n \"More specifically, it is directed to a graphical user interface (GUI) used in conjunction with the tissue removing devices.\",\n \"BACKGROUND OF THE INVENTION In diagnosing and treating certain medical conditions, such as potentially cancerous tumors, it is usually desirable to perform a biopsy, in which a specimen of the suspicious tissue is removed for pathological examination and analysis.\",\n \"In many instances, the suspicious tissue is located in a subcutaneous site, such as inside a human breast.\",\n \"To minimize surgical intrusion into the patient's body, it is desirable to be able to insert a small instrument into the patient's body to access the targeted site and to extract the biopsy specimen therefrom.\",\n \"Electrosurgical techniques have been used in a variety of biopsy procedures.\",\n \"In electrosurgery, high frequency electrical energy is typically applied to patient tissue through an active electrode, the electrical circuit being completed by a return electrode in contact with the patient's tissue.\",\n \"Electrical energy flowing through the tissue from the active electrode is effective to ablate tissue near the active electrode, forming an opening in the tissue and so allowing insertion of the instrument into a patient's body.\",\n \"A return electrode may be placed on the exterior of the patient's body or may be incorporated into the device itself.\",\n \"The return electrode is typically attached to the patient at a point remote from where the primary or active electrode contacts the tissue.\",\n \"Conventionally, when an electrosurgical biopsy instrument inserts into a patient's body, it's cutting end cannot be readily seen from outside.\",\n \"This makes it difficult for a surgeon to find out where the electrosurgical biopsy instrument is, in a biopsy operation.\",\n \"Thus, it is desirable to have a display device visually showing the location of the electrosurgical biopsy instrument with respect to the patient's body in biopsy operation.\",\n \"SUMMARY OF THE INVENTION The invention is directed to a graphical user interface for a tissue biopsy system having a tissue cutting member adapted for cutting one or more tissue specimens from tissue at a target site within a patient.\",\n \"In one embodiment, the graphical user interface includes at least a first GUI area and a second GUI area.\",\n \"The first GUI area represents a first region of the target site from which the tissue cutting member has separated one or more tissue specimens.\",\n \"The second GUI area, visually distinguishable from the first GUI area, represents a second region from which the tissue cutting member may separate one or more additional tissue specimens from tissue at the target site.\",\n \"BRIEF DESCRIPTION OF THE DRAWINGS FIG.\",\n \"1 is an exploded view of the elongated tissue biopsy system embodying features of the invention.\",\n \"FIG.\",\n \"2 is a perspective view of the embodiment shown in FIG.\",\n \"1 in an assembled condition without a housing cover for the probe component.\",\n \"FIG.\",\n \"3 is a side elevational view of the tissue biopsy device shown in the FIG.\",\n \"2.FIG.\",\n \"4A is a longitudinal cross-section of the probe shown in FIG.\",\n \"3 taken along the lines 4-4 with the tissue cutting element in a withdrawn position.\",\n \"FIG.\",\n \"4B is a longitudinal cross-section of the probe shown in FIG.\",\n \"3 taken along the lines 4-4 with the tissue cutting element in a forward or closed position.\",\n \"FIG.\",\n \"5 is a transverse cross-sectional view of the probe shown in FIG.\",\n \"4B taken along the lines 5-5.FIG.\",\n \"6 is a perspective view of the underside of the probe shown in FIG.\",\n \"1.FIG.\",\n \"7 is an enlarged perspective view of the distal end of the driver unit shown in FIG.\",\n \"1.FIG.\",\n \"8 is an enlarged perspective view of the distal end of the probe housing illustrating a marker element which depicts the orientation of the aperture in the tubular section of the biopsy device.\",\n \"FIG.\",\n \"9 is a perspective view of the tissue biopsy system shown in FIG.\",\n \"1 assembled and mounted on a stereotactic frame.\",\n \"FIG.\",\n \"10 is a perspective view of the underside of the driver shown in FIG.\",\n \"1.FIG.\",\n \"11 is an elevational view of a marker delivery device with a flared guide on the distal end of the shaft which facilitates guiding the distal tip of a marker delivery device into the interior of the proximal end of the tissue cutter.\",\n \"FIG.\",\n \"12 is a longitudinal cross-sectional view of the distal end of the marker delivery device and flared guide disposed within the tissue collection component shown in FIG.\",\n \"1.FIG.\",\n \"13 is a longitudinal cross sectional view of the proximal end of the marker delivery device with the flared guide at the proximal end of the shaft and with the shaft deployed within the inner lumen of the tissue cutter.\",\n \"FIG.\",\n \"14 illustrates a screen providing information with respect to an operation of the tissue biopsy system.\",\n \"FIGS.\",\n \"15A through 15E illustrate a number of alternative circular graphical user interfaces, each having a first GUI area and second GUI area representing various parts of a target site within a patient from which one or more tissue specimens haven been or may be separated from tissue.\",\n \"FIGS.\",\n \"16A through 16E illustrate a number of alternative polygonal graphical user interfaces, each having a first GUI area and second GUI area representing various parts of a target site within a patient from which one or more tissue specimens haven been or may be separated from tissue.\",\n \"FIGS.\",\n \"17A through 17E illustrate a number of alternative circular graphical user interfaces, each having a first, second and third GUI area representing various parts of a target site within a patient from which one or more tissue specimens haven been or may be separated or in which the tissue cutting element is deployed.\",\n \"FIGS.\",\n \"18A through 18E illustrate a number of alternative polygonal graphical user interfaces, each having a first, second and third GUI area representing various parts of a target site within a patient from which one or more tissue specimens haven been or may be separated, or in which the tissue cutting element is deployed.\",\n \"DETAILED DESCRIPTION OF EMBODIMENTS OF THE INVENTION FIGS.\",\n \"1-3 illustrate a biopsy system 10 embodying features of the invention which includes a disposable probe component 11, a driver component 12 and specimen collector 13.The probe component 11 generally includes an elongated distal shaft 14 having a tubular section or cannula 15 with a tissue penetrating tip 16 on the distal end thereof and an open, tissue receiving aperture 17.The probe component 11 also includes a probe housing 18 with a housing cover 19 which is configured to interfit with the driver component 12.A tissue cutter 20 is slidably disposed within the probe and has a distal cutting surface 21 which severs tissue which extends through the tissue receiving aperture 17.Details of the probe component 11 are further shown in FIGS.\",\n \"4A and 4B.\",\n \"The probe housing 18 has a mechanical system for rotating the housing and the tubular section 15 secured thereto to control the angular position of the tissue receiving aperture 17 and for moving the tissue cutter 20 slidably disposed within the probe component 11.The mechanical system of the driver component 12 has first driving gear 22 that is configured to engage the probe gear 23 and rotate the probe housing 18 so as to adjust the orientation of aperture 17 in the distal extremity of the tubular section 15.The probe gear 23 is secured to the rotating connector body 24 by adhesive 25.The proximal extremity of the tubular section 15 is secured to the rotating connector body 24 by adhesive 26.An end cap 27 retains the connector body 24 within the probe housing 18.Rotation of the probe gear 23 rotates the connector body 24 and the attached tubular section 15.The rotation is preferably controlled so that the tubular section 15 rotates in discrete steps about the longitudinal axis 28 to adjust the angular orientation of the aperture 17 about the longitudinal axis.\",\n \"Preferably these discrete orientations may be provided in increments of 30° which can be readily indicated by arrow 29 at the distal end of the probe housing 18 as shown in FIG.\",\n \"8.The second driving gear 30 is configured to drive the tissue cutter 20 longitudinally.\",\n \"The driving gear 30 engages probe gear 31 which drives cutter traverse nut 32 and cutter screw 33 threadably connected to the cutter traverse nut.\",\n \"The distal end of the cutter screw 33 is provided with a recess 34 which receives the rib 35 of the cutter shuttle 36.The cutter shuttle 36 is secured to the tissue cutter 20 by adhesive 37.The probe gear 31 is secured to the cutter traverse nut 32 by adhesive 38.Rotation of the probe gear 31 adjusts the relative axial position of the cutter screw 33 with respect to the cutter traverse nut 32 which is secured to the cutter shuttle 36.Longitudinal movement of the tissue cutter 20 follows the longitudinal movement of the cutter shuttle 36 resulting from the movement of cutter screw 33.The length of the tissue receiving aperture 17, and as a result the length of the specimen, can be controlled by adjusting the initial longitudinal position of the distal end of the tissue cutter 20 within the aperture, before cutting.\",\n \"The third driving gear 40 is configured to rotate or oscillate the tissue cutter 20 as the cutter moves along the longitudinal axis 28 to facilitate the cutting action of the cutting surface 21 on the distal end of the cutter.\",\n \"The third driving gear 40 engages probe gear 41 which is secured to cutter oscillation shaft 42 by adhesive 43.The probe gear 41 may be oscillated back and forth about the longitudinal axis 28 or rotated continuously in a single direction about the longitudinal axis, or both depending upon the desired rotational movement of the tissue cutter.\",\n \"A biased valve assembly 44 is provided in the distal end of the probe housing 18 to ensure sealing when a vacuum is developed within the interior 45 of the tissue cutter 20 while providing an atmospheric vent 46 between the interior surface 47 of the tubular section 15 and the exterior surface 48 of the tissue cutter 20.The valve assembly 44 includes a spring 49, valve body 50 and a valve collar 51 which is secured to the proximal end of the tubular section 15 by adhesive 52.The proximal end of the valve spring 49 rests against the shoulder 53 provided in the exterior of the valve body 50.A biased cutter shaft seal 54 slidably engages the exterior 48 of the tissue cutter 20.The tissue specimen collector 13 is secured to the proximal end of the housing of probe component 11 and has an interior 55 in fluid communication with the inner lumen 56 extending within the tissue cutter 20 and has a removable proximal wall 57 of specimen receiving cartridge 58 which gives access to the interior 55 and any tissue specimens which may have been drawn therein.\",\n \"A vacuum is generated within the interior 55 to draw tissue specimens through the inner lumen 45 into the interior 55.Tubular member 59 has a distal end which is in fluid communication with the interior 55 of the tissue specimen collector 13 and has a proximal end (not shown) which is configured to be connected to a vacuum source.\",\n \"Application of a vacuum within the tubular member 59 aids in pulling tissue into the interior 17 of the tubular section 15 and transfer of the severed tissue specimen through the inner lumen 45 of the tissue cutter 20 to the specimen cartridge 58.The driver 12 has a housing 60 with an upper concave surface 61 which is configured to receive the lower surface 62 of the probe housing 18.Three partially exposed driving gears 22, 30 and 40 are provided on the proximal end of the driver 12 which are configured to engage the probe gears 23, 31 and 41 respectively.\",\n \"The drive 12 is provided with three separately operating drive motors (not shown) which drive the drive gears 22, 30 and 40.The separate drive motors (not shown) are connected to and the operation thereof controlled by a control module, such as described in copending application Ser.\",\n \"No.\",\n \"10/847,699, filed on May 17, 2004.The control module controls the motors which move the individual drive gears 22, 30 and 40.The gear 22 engages gear 23 in the probe 11 to control the rotation of the probe housing 18 and the location and orientation of the tissue receiving aperture 17.The drive gear 30 engages probe gear 31 to control the longitudinal position and motion of the tissue cutter 20 along the longitudinal axis 28.Drive gear 40 engages probe gear 41 to control the oscillation or rotation of the tissue cutter 20 about the longitudinal axis 28.As shown in FIG.\",\n \"7, the front face of the driver component 12 is provided with light sources 66 and 67 and a manually activatable switch 68 to activate the light sources and enable the physician and other operating personnel to better view the operating site on the patient.\",\n \"Other manual switches, e.g.\",\n \"a foot activated switch, may be employed.\",\n \"Alternatively, the light sources may be automatically activated when the probe component 11 is installed on the driver 12 or other events such as when electrical power is turned on.\",\n \"The driver component 12 may have a battery pack for the light sources 66 and 67.The penetrating distal tip 16 may have a variety of tip shapes.\",\n \"A particularly suitable distal tip shape is described in co-pending provisional application Ser.\",\n \"No.\",\n \"60/532,277, filed on Dec. 23, 2003.Alternatively, the distal tip may be provided with an arcuate RF electrode such as disclosed in U.S. Pat.\",\n \"No.\",\n \"6,261,241, and U.S. Pat.\",\n \"No.\",\n \"6,471,700, both assigned to the present assignee.\",\n \"The separate driver component 12 allows the entire probe unit to be disposable.\",\n \"The drive gears of the drive component 12 control the motion of the tissue cutting member 20 for cutting and the motion of the tubular section 15 to orient the aperture 17.Other means (not shown) may provide mechanical and electrical power, vacuum, and control to the probe device.\",\n \"Examples of replaceable snap-in type probe units are disclosed in Burbank et al., U.S. patent application Ser.\",\n \"No.\",\n \"10/179,933, “Apparatus and Methods for Accessing a Body Site” hereby incorporated by reference in its entirety.\",\n \"Drive units such as that described in WO 02/069808 (which corresponds to co-pending U.S. application Ser.\",\n \"No.\",\n \"09/707,022, filed Nov. 6, 2000 and U.S. application Ser.\",\n \"No.\",\n \"09/864,021, filed May 23, 2001), which are assigned to the present assignee, may be readily modified by those skilled in the art to accommodate the movement of the cutting member 20.The distal end of the probe component 11 is advanced within the patient with the tissue cutter 20 in a forward or closed position (FIG.\",\n \"4B), until the aperture 17 of the tubular section 15 is located in a desired location for taking a tissue specimen.\",\n \"The tissue cutter 20 is then withdrawn proximally to an open position to open the aperture 17.The withdrawal of the tissue cutter can be used to control the length of the aperture which is opened in order to control the length of the specimen which is severed.\",\n \"A vacuum is applied to the interior 45 of the tissue cutter 20 to draw tissue at the site into the inner lumen of the tubular section 15 through the aperture 17.The tissue cutter 20 is then driven distally by rotation of probe gear 30 and rotated or oscillated by drive gear 40 engaging probe gear 41 to sever the aspirated tissue from the supporting tissue at the target site with the tissue cutting surface 21.The vacuum within the interior of the tissue cutter 20 causes the tissue specimen to be drawn through the inner lumen 45 of the tissue cutter 20 and into the cartridge 58 of specimen collector 13 shown in FIG.\",\n \"2.Positive pressure or even ambient conditions distal to the tissue specimen can facilitate tissue passing through the interior 45 of tissue cutter 20.If another tissue specimen is desired, the tubular section 15 may be rotated by the drive gear 22 engaging the probe gear 23 in one or more steps to repeat obtaining another tissue specimen in the same manner without otherwise moving the probe component 11.Typically, a first tissue specimen is obtained with the aperture 17 of the probe 11 in the 12 o-clock position, the second at the 3 o-clock position, the third at the 9 o-clock position and the fourth at the 6 o-clock position.\",\n \"The location of the second and third specimens may be reversed.\",\n \"The position of the aperture 17 may be indicated by a marker arrow 29 at the end cap 27 so that the physician or other operating personnel can readily determine what the orientation of the aperture 17 within the patient.\",\n \"The biopsy system 10 may be hand held for some biopsy procedures or the system may be mounted on a stereotactic mounting stage 80 as shown in FIG.\",\n \"9.A shoe 81 is slidably mounted to a rail 82 of a Fisher stage.\",\n \"The mounting member 83 is secured to the shoe 81 by a threaded post (not shown) secured to thumbwheel 84.As shown in FIG.\",\n \"10, the bottom surface 85 of the driver component 12 is configured to conform at least in part to the upper surface of the mounting member 83.The sampling and vacuum switches 86 and 87 respectively on the driver component 12 are actuated by the optional sampling and vacuum actuating elements 88 and 89 on the mounting member 83.Alternatively, sampling and vacuum may be actuated with a foot pedal.\",\n \"As shown in FIG.\",\n \"10, the driver component has an operator dial 90 which when turned opens a threaded hole 91 for receiving a threaded post (not shown) secured to the thumbwheel 84 and the locating pin holes 92 and 93 which receive the complementary posts (not shown) in the mounting member 83.As mentioned above, positive pressure or even ambient conditions will aid in passing the severed tissue specimen through the inner lumen 45 of tissue cutter 20 into the cartridge 58 of specimen collector 13.As shown in FIGS.\",\n \"4A and 4B venting valve can provide ambient pressure behind the tissue specimen in the cutter interior 45 from the interior of the tubular section 15.The valve body 50 is opened for atmospheric venting when the tissue cutter 20 is in the forward position upon the completion of severing the specimen from the tissue site.\",\n \"However, when the tissue cutter 20 is pulled back proximally the valve spring 49 urges the valve body 50 back to a closed position.\",\n \"While the tissue cutter 20 is shown with a tissue cutting surface 21 which is perpendicular to the longitudinal axis 28, the tissue cutting surface may be at an angle or even parallel to the longitudinal axis as described in co-pending application Ser.\",\n \"No.\",\n \"10/642,406, filed Aug. 15, 2003.The distal cutting edge 21 of the tissue cutter 20 may initially be located proximal to the aperture 17 to provide a full aperture for receiving tissue or it can be initially located within the aperture 17 in order to control the length of the specimen.\",\n \"The cutting action of tissue cutter 20 preferably continues until the beveled cutting surface 21 has completely traversed the aperture 17 to ensure that the tissue drawn through the aperture is completely severed from supporting tissue at the biopsy site.\",\n \"A vacuum may be applied to aspirate the severed tissue specimen through the inner lumen of the tissue cutter 20 to the cartridge in the specimen collector at the proximal end of the biopsy device.\",\n \"Positive pressure or access to ambient conditions may be provided in the distal end of the tubular section to aid in the specimen transfer.\",\n \"After the removable wall 57 of the specimen receiving cartridge 58 is removed and the specimens therein removed, it is frequently desirable to deliver one or more markers to the target site from which the specimens have been removed.\",\n \"Such marker delivery devices are shown in co-pending application Ser.\",\n \"No.\",\n \"10/753,694, filed on Jan. 7, 2004 and co-pending application Ser.\",\n \"No.\",\n \"10/444,770, filed May 23, 2003.However, the distal ends of these marker delivery devices are very small and they can be difficult to insert into the proximal end of the tissue cutter 20 which is just slightly larger to accommodate the marker delivery shaft.\",\n \"FIG.\",\n \"11 illustrates a marker delivery device 100 which is particularly suitable to facilitate the introduction of the distal end of the shaft 101 into the inner lumen 45 of the tissue cutter 20 and the advancement therein.\",\n \"As indicated into the inner lumen 45 of the tissue cutter 20 to eject one or more markers through the aperture 17 in the tubular section 15 before the biopsy device 10 is removed from the patient.\",\n \"As shown in FIG.\",\n \"12, to aid in the insertion of the small diameter distal tip 101 of a marker delivery device 100 into the slightly larger inner lumen 45 of the tubular cutter 20 at its proximal end, the distal tip is preferably provided with an outwardly flared guide 102 which is slidably mounted on the shaft 103 of the marker delivery device 100.The proximal end of the tubular cutter 20, the flared guide 102 and/or the distal tip 101 may be provided with mating guide elements which orient the marker delivery device so that one or more markers are discharged through the aperture 17 when the pusher element slidably disposed within the delivery device is urged distally to press at least one marker body out the discharge opening in the distal portion of the elongated shaft of the marker delivery device.\",\n \"The delivery of markers to the target site after specimen removal, while the distal end of the biopsy device is still at the biopsy site, ensures that the markers are properly position at the biopsy site.\",\n \"While the slidably mounted, flared proximal guide 102 is described with respect to being disposed on the shaft 103 of marker delivery device 101, the flared guide 102 has wide application within a variety of biopsy and other devices where one small diameter tubular member is to be inserted into a slightly larger, but still small diameter second tubular member.\",\n \"The elongated probe component 11 of the biopsy system 10 has a length of about 3 to about 20 cm, preferably, about 5 to about 13 cm, and more specifically, about 8 to about 9 cm for breast biopsy use.\",\n \"To assist in properly locating the probe 11 during advancement thereof into a patient's body, the distal extremity of the tubular section may be provided with a marker at a desirable location that provide enhanced visualization by eye, by ultrasound, by X-ray, MRI or other imaging or visualization means.\",\n \"Manual palpation may also be employed.\",\n \"An echogenic polymer coating that increases contrast resolution in ultrasound imaging devices (such as ECHOCOAT™ by STS Biopolymers, of Henrietta, N.Y.) is suitable for ultrasonic visualization.\",\n \"Radiopaque markers may be made with, for example, stainless steel, platinum, gold, iridium, tantalum, tungsten, silver, rhodium, nickel, bismuth, other radiopaque metals, alloys and oxides of these metals.\",\n \"In addition, the surfaces of the device in contact with tissue or other components of the device may be provided with a suitable lubricious coating such as a hydrophilic material or a fluoropolymer.\",\n \"The tubular section and the tissue cutter are preferably formed of a surgical grade stainless steel.\",\n \"However, other high strength materials such as MP35N, other cobalt-chromium alloys, NiTi alloys, ceramics, glasses, and high strength polymeric materials or combinations thereof may be suitable.\",\n \"A patient's skin usually must be breached in order to gain access to a body site where a tissue specimen is to be obtained.\",\n \"A scalpel or other surgical instrument may be used to make an initial incision in the skin.\",\n \"After the specimens have been taken, the biopsy device may be removed from the patient.\",\n \"The entire device may be removed; however, in some embodiments, the cartridge 58 may be removed from the system 10 and a delivery cannula may be inserted through the inner lumen of the cutter 20 to deliver markers to the biopsy site through the aperture 17.In addition, it will be readily appreciated that other types of instruments may be inserted into the tissue site through the tissue cutter in addition to or in place of the instruments described above.\",\n \"Moreover, therapeutic or diagnostic agents may be delivered through the tissue cutter 20 or the tubular section 15.FIG.\",\n \"14 illustrates a screen 104 providing certain useful information with respect to an operation of the tissue biopsy system, according to one embodiment of the present invention.\",\n \"The screen 104 can be provided by any type of displays, such as liquid crystal displays (LCD's), cathode ray tube (CRT) monitors and plasma displays.\",\n \"The displays can be used in association with a control module that controls electrosurgical instruments, such as the biopsy system in FIG.\",\n \"1.For example, the screen 104 can be provided a CM3000 Display used in association with a CM3000 Control Module by SenoRx, Inc.\",\n \"The screen 104 provides a first textual message 106 showing various states of operation for the biopsy system.\",\n \"For example, the states of operation may include an initialization, calibration, closed, opening, sampling, indexing, indexing error, tool failure, vacuum failure, and tool exit state.\",\n \"These states represent various stages of preparing the biopsy system, taking a tissue specimen from a patient with the biopsy system, and errors occurred during the preparing and taking processes.\",\n \"A second textual message 108 on the screen 104 details the status of the particular state shown by the first textual message 106.For example, on the screen 104, the second textual message 108 tells a user to wait for the completion of an opening state, in which the biopsy system performs an open stroke.\",\n \"At the bottom of the screen 104 are indicators 110 for indicating certain events or conditions.\",\n \"For example, when the indicator 110 that labeled as VAC is on, it tells that a vacuum system is currently running.\",\n \"The screen 104 further provides a graphical user interface 112 that represents various parts of a target site within a patient from which one or more tissue specimens have been taken or may be taken.\",\n \"The graphical user interface 112 may further represent an angular position of the tissue cutting member 20 shown in FIG.\",\n \"2.Since the tissue cutting member 20 positions its cutting tip in a target site of a patient's body in a rotational movement, the graphical user interface 112 is designed based on a circular shape.\",\n \"However, it is noteworthy that other shapes capable of representing the angular positions of the tissue cutting member 20 can also be used as the basic shapes for the graphical user interface 112.For example, the graphical user interface 112 may be designed based on a polygonal shape.\",\n \"Various designs for the graphical user interface 112 will be described in the following paragraphs.\",\n \"FIGS.\",\n \"15A through 15E illustrate various alternatives of the graphical user interface 112 in FIG.\",\n \"14, according to one embodiment of the present invention.\",\n \"In this embodiment, the graphical user interface 112 includes a first GUI area representing a first region of a target site from which at least one tissue specimen has been separated from tissue at the target site by the tissue cutting member.\",\n \"The graphical user interface 112 further includes a second GUI area, visually distinguishable from the first GUI area, representing a second region from which the tissue cutting member may separate one or more additional tissue specimens from tissue at the target site.\",\n \"The first and second GUI areas are marked with colors or patterns distinguishable from one another.\",\n \"They visualize the part of the tissue at the target site that has been cut, and the rest of the tissue that may be cut by the biopsy system.\",\n \"This helps a surgeon to better understand the progress of a biopsy operation.\",\n \"FIG.\",\n \"15A shows a first alternative of a graphical user interface 114 according to the embodiment.\",\n \"The first GUI area 116 and second GUI area 118 are arranged within a circle.\",\n \"The first GUI area 116 is of a fan shape, and the circle unoccupied by the first GUI area 116 represents the second GUI area 118.In this figure, a smaller angular portion of the tissue at the target site has been cut, while a larger angular portion of the tissue may be cut in a later process of operation.\",\n \"FIG.\",\n \"15B shows a second alternative of a graphical user interface 120 according to the embodiment.\",\n \"The shaded part represents the first GUI area 122, and the unshaded part represents the second GUI area 124.The first GUI area 122 includes a first portion 126 of a fan shape at the centric point of the circular shaped graphical user interface 120.The arm of the first portion 126 is smaller than the radius of the graphical user interface 120.The first GUI area 122 further includes a second portion 128 that is shaped as a curvy band in alignment with an arc of the first portion 126.The angle of first portion 126 represents the angular portion of the tissue that has been cut.\",\n \"FIG.\",\n \"15C shows a third alternative of a graphical user interface 130 according to the embodiment.\",\n \"The shaded part represents the first GUI area 132, and the unshaded part represents the second GUI area 134.The first GUI area includes a first portion 136 of a circular shape, and a second portion 138 shaped as a curvy band adjacent to a circumferential line of the first portion 136.The two side lines of the second portion 138 define an angle that represents the angular portion of the tissue that has been cut.\",\n \"FIG.\",\n \"15D shows a fourth alternative of a graphical user interface 140 according to the embodiment.\",\n \"The shaded part represents the first GUI area 142, and the unshaded part represents the second GUI area 144.The first GUI area 142 includes a first portion 145 of a circular shape, a second portion 146 shaped as a curvy band adjacent to a circumferential line of the first portion, and a third portion 147 shaped as a curvy band in alignment with an outer peripheral line of the second portion 146.The side lines of the second portion 146 or the third portion 147 define an angle that represents the angular portion of the tissue that has been cut.\",\n \"FIG.\",\n \"15E shows a fifth alternative of a graphical user interface 150 according to the embodiment.\",\n \"The shaded part represents the first GUI area 152, and the unshaded part represents the second GUI area 154.The first GUI area includes a first portion 155 of a circular shape, a second portion 156 of a ring shape surrounding the first portion 155, and a third portion 157 shaped as a curvy band adjacent to a circumferential line of the second portion 156.The side lines of the third portion 157 define an angle representing the angular portion of the tissue that has been cut.\",\n \"FIGS.\",\n \"16A through 16E show another set of alternatives of the graphical user interface 112 in FIG.\",\n \"14 according to the embodiment of the present invention.\",\n \"FIG.\",\n \"16A shows a first alternative of a graphical user interface 160.The first GUI area 162 and second GUI area 164 are arranged within a regular polygon.\",\n \"The first GUI area 162 is a divisional portion of the regular polygon with an angle defined at a geometrical center thereof.\",\n \"The reset of the regular polygon unoccupied by the first GUI area 162 represents the second GUI area 164.As discussed above, the first GUI area 162 represents an angular portion of the tissue at the target site that has been cut, while the second GUI area 164 represent the portion of the tissue that may be cut in a later operation process.\",\n \"FIG.\",\n \"16B shows a second alternative of a graphical user interface 170 according to the embodiment.\",\n \"The shaded part represents the first GUI area 172, and the unshaded part represents the second GUI area 174.The first GUI area 172 includes a first portion 176 of a polygonal shape with an angle defined at a geometrical center of the regular polygon 179.The first GUI area 174 further includes a second portion 178 shaped as a polygonal band along a peripheral line of the regular polygon 179, in alignment with the first portion 176.The angle of first portion 176 represents the angular portion of the tissue that has been cut.\",\n \"FIG.\",\n \"16C shows a third alternative of a graphical user interface 180 according to the embodiment.\",\n \"The shaded part represents the first GUI area 182, and the unshaded part represents the second GUI area 184.The first GUI area 182 includes a first portion 186 of a polygonal shape having a geometrical center the same as that of the regular polygon 189.The first GUI area 180 further includes a second portion 188 shaped as a polygonal band along a peripheral line of the regular polygon 189, adjacent to an outer peripheral line of the first portion 186.The two side lines of the second portion 188 define an angle representing the angular portion of the tissue that has been cut.\",\n \"FIG.\",\n \"16D shows a fourth alternative of a graphical user interface 190 according to the embodiment.\",\n \"The shaded part represents the first GUI area 192, and the unshaded part represents the second GUI area 194.The first GUI area 192 includes a first portion 195, second portion 196 and third portion 197.The first portion 195 is of a polygonal shape having a geometrical center the same as that of the regular polygon 198.The second portion 196 is shaped as a polygonal band adjacent to an outer peripheral line of the first portion 195.The third portion 197 is shaped as a polygonal band along a peripheral line of the regular polygon 198, in alignment with an outer peripheral line of the second portion 196.The two side lines of the second portion 196 or the third portion 197 define an angle representing the angular portion of the tissue that has been cut.\",\n \"FIG.\",\n \"16E shows a fifth alternative of a graphical user interface 200 according to the embodiment.\",\n \"The shaded part represents the first GUI area 202, and the unshaded part represents the second GUI area 204.The first GUI area 202 includes a first portion 205, second portion 206 and third portion 207.The first portion 205 is of a polygonal shape having a geometrical center the same as that of the regular polygon 208.The second portion 206 is shaped as a polygonal ring surrounding the first portion 205.The third portion 207 is shaped as a polygonal band along a peripheral line of the regular polygon 208, adjacent to an outer peripheral line of the second portion 206.The two side lines of the third portion 207 define an angle representing the angular portion of the tissue that has been cut.\",\n \"In the above embodiment, while none of the various graphical user interfaces shows a current angular position of the tissue cutting member, it can be known by an external indicator 29 shown in FIG.\",\n \"8.FIGS.\",\n \"17A through 17E illustrate various alternatives of the graphical user interface 112 in FIG.\",\n \"14, according to another embodiment of the present invention.\",\n \"In this embodiment, the graphical user interface 112 includes a first, second and third GUI areas.\",\n \"The first GUI area represents a first region of a target site from which at least one tissue specimen has been separated from tissue at the target site by the tissue cutting member.\",\n \"The second GUI area, visually distinguishable from the first GUI area, represents a second region from which the tissue cutting member may separate one or more additional tissue specimens from tissue at the target site.\",\n \"The third GUI area, visually distinguishable from the first and second GUI areas, represents a third region in which the tissue cutting member is deployed to separate a tissue specimen from tissue at the target site.\",\n \"The first, second and third GUI areas are marked with colors or patterns distinguishable from each other.\",\n \"They visualize the part of the tissue at the target site that has been cut, the rest of the tissue that may be cut, and the angular position where the cutting member is at.\",\n \"This helps a surgeon to better understand the progress of a biopsy operation.\",\n \"FIG.\",\n \"17A shows a first alternative of a graphical user interface 210 according to the embodiment.\",\n \"The first GUI area 202, second GUI area 204 and third GUI area 206 are arranged within a circle 208.The first GUI area 202 and the third GUI area 206 are of a fan shape.\",\n \"The circle unoccupied by the first GUI area 202 and third GUI area 206 represent the second GUI area 118.FIG.\",\n \"17B shows a second alternative of a graphical user interface 220 according to the embodiment.\",\n \"The graphical user interfere face 220 differs from that in FIG.\",\n \"15B in having a third GUI area 222, which includes a first portion 223 and second portion 224.The first portion 223 of the third GUI area 222 is of a fan shape concentric with a first portion 225 of the first GUI area 226.The second portion 224 of the third GUI area 222 is shaped as a curvy band in alignment with an arc of the first portion 223 of the third GUI area 222.FIG.\",\n \"17C shows a third alternative of a graphical user interface 230 according to the embodiment.\",\n \"The graphical user interfere face 230 differs from that in FIG.\",\n \"15C in having a third GUI area 232, which is shaped as a curvy band adjacent to the circumferential line of a first portion 234 of the first GUI area 236.FIG.\",\n \"17D shows a fourth alternative of a graphical user interface 240 according to the embodiment.\",\n \"The graphical user interfere face 240 differs from that in FIG.\",\n \"15D in having a third GUI area 242, which includes a first portion 243 and second portion 244.The first portion 243 of the third GUI area 242 is shaped as a curvy band adjacent to the circumferential line of a first portion 245 of the first GUI area 246.The second portion 244 of the third GUI area 242 is also shaped as a curvy band in alignment with an outer peripheral line of the second portion 242.FIG.\",\n \"17E shows a fifth alternative of a graphical user interface 250 according to the embodiment.\",\n \"The graphical user interfere face 250 differs from that in FIG.\",\n \"15E in having a third GUI area 252, which is shaped as a curvy band adjacent to the circumferential line of a ring 254 of the first GUI area 256.FIGS.\",\n \"18A through 18E show another set of alternatives of the graphical user interface 112 in FIG.\",\n \"14 according to the embodiment of the present invention.\",\n \"FIG.\",\n \"18A shows a first alternative of a graphical user interface 260.The graphical user interface 260 differs from that in FIG.\",\n \"16A in having a third GUI area 262, which is a divisional portion of the regular polygon 264 with an angle defined at a geometrical center the regular polygon 265.FIG.\",\n \"18B shows a second alternative of a graphical user interface 270.The graphical user interface 270 differs from that in FIG.\",\n \"16B in having a third GUI area 272, which includes a first portion 273 and a second portion 274.The first portion 273 of the third GUI area 272 is of a polygonal shape with an angle defined at the geometrical center of the regular polygon 275.The second portion 274 of the third GUI area 272 is shaped as a polygonal band along the peripheral line of the regular polygon 275, in alignment with an outer peripheral line of the first portion 273.FIG.\",\n \"18C shows a third alternative of a graphical user interface 280.The graphical user interface 280 differs from that in FIG.\",\n \"16C in having a third GUI area 282, which is shaped as a polygonal band along a peripheral line of the regular polygon 284.FIG.\",\n \"18D shows a fourth alternative of a graphical user interface 290.The graphical user interface 290 differs from that in FIG.\",\n \"16D in having a third GUI area 292, which includes a first portion 293 and a second portion 294.The first portion 293 of the third GUI area 292 is shaped as a polygonal band adjacent to an outer peripheral line of an inner polygon 296.The second portion 294 of the third GUI area 292 is shaped as a polygonal band along the peripheral line of the regular polygon 295, adjacent to an outer peripheral line of the first portion 293.FIG.\",\n \"18E shows a fifth alternative of a graphical user interface 300.The graphical user interface 300 differs from that in FIG.\",\n \"16E in having a third GUI area 302, which is shaped as a polygonal band along a peripheral line of the regular polygon 304, adjacent to a polygonal ring 306.As discussed above, the first, second and third GUI areas visualize the part of the tissue at the target site that has been cut, the rest of the tissue that may be cut, and the current angular position where the tissue cutting member is at.\",\n \"This helps a surgeon to better understand the progress of a biopsy operation.\",\n \"While particular forms of the invention have been illustrated and described herein, it will be apparent that various modifications and improvements can be made to the invention.\",\n \"For example, while the various embodiments of the invention have been described herein in terms of a biopsy device, it should be apparent that the devices and methods of utilizing the device may be employed to remove tissue for purposes other than for biopsy, i.e.\",\n \"for treatment or other diagnoses.\",\n \"Other modifications include, for example, a tissue cutter slidably mounted around the tubular section of the probe component rather than within the tubular section.\",\n \"Moreover, individual features of embodiments of the invention may be shown in some drawings and not in others, but those skilled in the art will recognize that individual features of one embodiment of the invention can be combined with any or all the features of another embodiment.\",\n \"Accordingly, it is not intended that the invention be limited to the specific embodiments illustrated.\",\n \"It is therefore intended that this invention to be defined by the scope of the appended claims as broadly as the prior art will permit.\",\n \"Terms such a “element”, “member”, “device”, “section”, “portion”, “component”, “means”, “step” and words of similar import, when used herein, shall not be construed as invoking the provisions of 35 U.S.C.\",\n \"§ 112(6) unless the following claims expressly use the term “means” followed by a particular function without specific structure or the term “step” followed by a particular function without specific action.\",\n \"All patents and patent applications referred to above are hereby incorporated by reference in their entirety.\"\n ]\n]"},"source":{"kind":"string","value":"Patent_15871441"}}},{"rowIdx":4493794,"cells":{"text":{"kind":"list like","value":[["MODULAR ARRAY OF VERTICALLY INTEGRATED SUPERCONDUCTING QUBIT DEVICES FOR SCALABLE QUANTUM COMPUTING","A technique relates to an assembly for a quantum computing device.","A quantum bus plane includes a first set of recesses.","A readout plane includes a second set of recesses.","A block is positioned to hold the readout plane opposite the quantum bus plane, such that the first set of recesses opposes the second set of recesses.","A plurality of qubit chips are included where each has a first end positioned in the first set of recesses and has a second end positioned in the second set of recesses."],["1.A quantum device, comprising: a first structure including a first set of couplings; a second structure including a second set of couplings; and at least one qubit chip coupled to the first set of couplings and the second set of couplings.","2.The quantum device of claim 1, wherein the first structure comprises a circuit.","3.The quantum device of claim 2, wherein the circuit is configured to couple at least two qubit chips.","4.The quantum device of claim 2, wherein the circuit comprises at least one coupling resonator.","5.The quantum device of claim 1, wherein the second structure comprises a circuit.","6.The quantum device of claim 5, wherein the circuit comprises transmission lines configured to couple to qubit chips.","7.The quantum device of claim 6, wherein the transmission lines are configured to couple the qubits chips to connectors.","8.The quantum device of claim 1, wherein the at least one qubit chip is positioned to the first and second structures for communication.","9.The quantum device of claim 1, wherein the at least one qubit chip comprises a superconducting qubit.","10.The quantum device of claim 1, wherein the at least one qubit chip comprises a readout resonator.","11.A quantum device, comprising: a quantum bus plane including a first set of couplings; a readout plane including a second set of couplings; and qubit chips positioned to the first set of couplings and positioned to the second set of couplings.","12.The quantum device of claim 11, wherein the qubit chips extend to the quantum bus plane and the readout plane.","13.The quantum device of claim 11, wherein the first set of couplings is configured to receive the qubit chips in the readout plane; and wherein the second set of couplings is configured to receive the qubit chips in the quantum bus plane.","14.The quantum device of claim 11, wherein the quantum bus plane comprises a substrate with interconnect wiring, the interconnect wiring connecting the qubit chips via coupling bus resonators.","15.The quantum device of claim 11, wherein the readout plane comprises a substrate with fan-out wiring, the fan-out wiring individually connecting each of the qubit chips to a circuit board.","16.The quantum device of claim 15, wherein the circuit board individually connects each of the qubit chips to connectors in a one-to-one relationship.","17.A quantum device comprising: a first coupling; a second coupling; and a qubit chip coupled to the first coupling and the second coupling, the qubit chip comprising a superconducting qubit and a readout resonator.","18.The quantum device of claim 17, wherein the first coupling is formed on a first structure comprising a first circuit.","19.The quantum device of claim 18, wherein the second coupling is formed on a second structure comprising a second circuit.","20.The quantum device of claim 19, wherein the first structure opposes the second structure so as to position the qubit chip."],[" BACKGROUND The present invention relates to quantum computing, and more specifically, to a modular array of vertically integrated superconducting qubit devices for scalable quantum computing.","In one approach called circuit quantum electrodynamics, quantum computing employs active superconducting devices called qubits to manipulate and store quantum information, and resonators (e.g., as a two-dimensional (2D) planar waveguide or as a three-dimensional (3D) microwave cavity) to read out and facilitate interaction among qubits.","Each superconducting qubit comprises one or more Josephson junctions shunted by capacitors in parallel with the junctions.","The qubits are capacitively coupled to 2D or 3D microwave cavities.","The energy associated with the qubit resides in the electromagnetic fields around the Josephson junction and especially in the vicinity of relatively larger shunt capacitance structures.","To date, a major focus has been on improving lifetimes of the qubits in order to allow calculations (i.e., manipulation and readout) to take place before the information is lost to decoherence of the qubits.","Currently, superconducting qubit coherence times can be as high as 100 microseconds, and efforts are being made to increase the coherence times.","One area of research with respect to increasing coherence times is focused on eliminating lossy materials from areas of relatively high electromagnetic field energy density such as in the vicinity of sharp corners and edges of the thin films of which the qubits are comprised.","Such materials in proximity to the qubit can include imperfections that support defects known as two-level systems (TLSs)."],[" SUMMARY According to one embodiment, an assembly for a quantum computing device is provided.","The assembly includes a quantum bus plane including a first set of recesses, a readout plane including a second set of recesses, and a block positioned to hold the readout plane opposite the quantum bus plane, such that the first set of recesses opposes the second set of recesses.","Also, the assembly includes a plurality of qubit chips where each has a first end positioned in the first set of recesses and has a second end positioned in the second set of recesses.","According to one embodiment, an assembly for a quantum computing device is provided.","The assembly includes a housing configured as an enclosure having a bottom part, a top part, and a block, in which the block connects the top and bottom parts.","The assembly includes a quantum bus plane including a first set of recesses, and a readout plane including a second set of recesses.","The block is configured to position the readout plane opposite the quantum bus plane, such that the first set of recesses opposes the second set of recesses.","Also, the assembly includes a plurality of qubit chips where each has a first end positioned in the first set of recesses and has a second end positioned in the second set of recesses.","According to one embodiment, a method of configuring an assembly for a quantum computing device is provided.","The method includes providing a housing configured as an enclosure having a bottom part, a top part, and a block, in which the block connects the top and bottom parts.","The method includes providing a readout plane having a first set of recesses and a quantum bus plane having a second set of recesses, and assembling the readout plane opposite the quantum bus plane in a block, such that the first set of recesses opposes the second set of recesses.","Also, the method includes installing a plurality of qubit chips in the block, where each of the plurality of qubit chips has a first end positioned in the first set of recesses and has a second end positioned in the second set of recesses.","In one or more embodiments, the plurality of qubit chips extends vertically in a lengthwise direction by being positioned in both the first set of recesses and the second set of recesses.","The first set of recesses holds the first end of the plurality of qubit chips in the readout plane, and the second set of recesses holds the second end of the plurality of qubit chips in the quantum bus plane.","In one or more embodiments, the first end of the plurality of qubit chips is opposite the second end.","In one or more embodiments, the block is made of a superconducting material.","In one or more embodiments, the quantum bus plane comprises a substrate with interconnect wiring on top of the substrate, and the interconnect wiring connects the plurality of qubit chips via a plurality of coupling bus resonators.","In one or more embodiments, the readout plane comprises a substrate with fan-out wiring on top of the substrate, and the fan-out wiring individually connects each of the plurality of qubit chips to a circuit board.","The circuit board individually connects each of the plurality of qubit chips to a plurality of connectors in a one-to-one relationship.","In one or more embodiments, the block is configured to receive a first assembly comb and a second assembly comb to form an intersection, and the intersection of the first and second assembly combs forms a plurality of slots for individually accepting the plurality of qubit chips.","The plurality of slots mechanically holds the plurality of qubit chips in a vertical position.","Additional features and advantages are realized through the techniques of the present invention.","Other embodiments and aspects of the invention are described in detail herein and are considered a part of the claimed invention.","For a better understanding of the invention with the advantages and the features, refer to the description and to the drawings."],["DOMESTIC PRIORITY This application is a continuation application of and claims priority from U.S. patent application Ser.","No.","15/175,454, filed on Jun.","7, 2016, entitled “MODULAR ARRAY OF VERTICALLY INTEGRATED SUPERCONDUCTING QUBIT DEVICES FOR SCALABLE QUANTUM COMPUTING”, which is a divisional application of and claims priority from U.S. patent application Ser.","No.","14/737,707, filed on Jun.","12, 2015, entitled “MODULAR ARRAY OF VERTICALLY INTEGRATED SUPERCONDUCTING QUBIT DEVICES FOR SCALABLE QUANTUM COMPUTING”, the entire contents of which are incorporated herein by reference.","BACKGROUND The present invention relates to quantum computing, and more specifically, to a modular array of vertically integrated superconducting qubit devices for scalable quantum computing.","In one approach called circuit quantum electrodynamics, quantum computing employs active superconducting devices called qubits to manipulate and store quantum information, and resonators (e.g., as a two-dimensional (2D) planar waveguide or as a three-dimensional (3D) microwave cavity) to read out and facilitate interaction among qubits.","Each superconducting qubit comprises one or more Josephson junctions shunted by capacitors in parallel with the junctions.","The qubits are capacitively coupled to 2D or 3D microwave cavities.","The energy associated with the qubit resides in the electromagnetic fields around the Josephson junction and especially in the vicinity of relatively larger shunt capacitance structures.","To date, a major focus has been on improving lifetimes of the qubits in order to allow calculations (i.e., manipulation and readout) to take place before the information is lost to decoherence of the qubits.","Currently, superconducting qubit coherence times can be as high as 100 microseconds, and efforts are being made to increase the coherence times.","One area of research with respect to increasing coherence times is focused on eliminating lossy materials from areas of relatively high electromagnetic field energy density such as in the vicinity of sharp corners and edges of the thin films of which the qubits are comprised.","Such materials in proximity to the qubit can include imperfections that support defects known as two-level systems (TLSs).","SUMMARY According to one embodiment, an assembly for a quantum computing device is provided.","The assembly includes a quantum bus plane including a first set of recesses, a readout plane including a second set of recesses, and a block positioned to hold the readout plane opposite the quantum bus plane, such that the first set of recesses opposes the second set of recesses.","Also, the assembly includes a plurality of qubit chips where each has a first end positioned in the first set of recesses and has a second end positioned in the second set of recesses.","According to one embodiment, an assembly for a quantum computing device is provided.","The assembly includes a housing configured as an enclosure having a bottom part, a top part, and a block, in which the block connects the top and bottom parts.","The assembly includes a quantum bus plane including a first set of recesses, and a readout plane including a second set of recesses.","The block is configured to position the readout plane opposite the quantum bus plane, such that the first set of recesses opposes the second set of recesses.","Also, the assembly includes a plurality of qubit chips where each has a first end positioned in the first set of recesses and has a second end positioned in the second set of recesses.","According to one embodiment, a method of configuring an assembly for a quantum computing device is provided.","The method includes providing a housing configured as an enclosure having a bottom part, a top part, and a block, in which the block connects the top and bottom parts.","The method includes providing a readout plane having a first set of recesses and a quantum bus plane having a second set of recesses, and assembling the readout plane opposite the quantum bus plane in a block, such that the first set of recesses opposes the second set of recesses.","Also, the method includes installing a plurality of qubit chips in the block, where each of the plurality of qubit chips has a first end positioned in the first set of recesses and has a second end positioned in the second set of recesses.","In one or more embodiments, the plurality of qubit chips extends vertically in a lengthwise direction by being positioned in both the first set of recesses and the second set of recesses.","The first set of recesses holds the first end of the plurality of qubit chips in the readout plane, and the second set of recesses holds the second end of the plurality of qubit chips in the quantum bus plane.","In one or more embodiments, the first end of the plurality of qubit chips is opposite the second end.","In one or more embodiments, the block is made of a superconducting material.","In one or more embodiments, the quantum bus plane comprises a substrate with interconnect wiring on top of the substrate, and the interconnect wiring connects the plurality of qubit chips via a plurality of coupling bus resonators.","In one or more embodiments, the readout plane comprises a substrate with fan-out wiring on top of the substrate, and the fan-out wiring individually connects each of the plurality of qubit chips to a circuit board.","The circuit board individually connects each of the plurality of qubit chips to a plurality of connectors in a one-to-one relationship.","In one or more embodiments, the block is configured to receive a first assembly comb and a second assembly comb to form an intersection, and the intersection of the first and second assembly combs forms a plurality of slots for individually accepting the plurality of qubit chips.","The plurality of slots mechanically holds the plurality of qubit chips in a vertical position.","Additional features and advantages are realized through the techniques of the present invention.","Other embodiments and aspects of the invention are described in detail herein and are considered a part of the claimed invention.","For a better understanding of the invention with the advantages and the features, refer to the description and to the drawings.","BRIEF DESCRIPTION OF THE DRAWINGS The subject matter which is regarded as the invention is particularly pointed out and distinctly claimed in the claims at the conclusion of the specification.","The forgoing and other features, and advantages of the invention are apparent from the following detailed description taken in conjunction with the accompanying drawings in which: FIG.","1 is a schematic illustrating a transparent view of part of the modular array of vertically integrated superconducting qubit chips according to an embodiment; FIG.","2 is a schematic illustrating a quantum bus plane design according to an embodiment; FIG.","3 is a schematic illustrating the readout plane in an inverted view according to an embodiment; FIG.","4 is a schematic of an example qubit chip according to an embodiment.","FIGS.","5A through 5F illustrate an assembly and packaging technique for the modular array of vertically integrated superconducting qubit chips according to an embodiment, in which: FIG.","5A is a schematic of an assembly illustrating assembly combs for a block; FIG.","5B is a schematic of the assembly illustrating the assembly combs in place to form slots for orienting the superconducting qubit chips; FIG.","5C is a schematic of the assembly illustrating the installation of the superconducting qubit chips in the slots formed by the assembly combs; FIG.","5D is a schematic of the assembly illustrating installation of the readout plane in the block; FIG.","5E is a schematic of the assembly illustrating a view underneath the block; FIG.","5F is a schematic of the assembly illustrating that a pusher block applies pressure to hold the superconducting qubit chips in place; FIG.","6 is a method of configuring an assembly according to an embodiment; and FIG.","7 is a method of configuring an assembly according to an embodiment.","DETAILED DESCRIPTION Superconducting Josephson-junction based qubits are promising candidates for fault-tolerant quantum computing.","As a solid-state technology, it has always held the potential of simpler scalability via existing integration techniques.","Superconducting circuit and device fabrication can leverage well-known lithographic methods which can lead to quantum integrated processors with a high density of qubits.","Furthermore, superconducting qubits operate in the microwave frequency regime, allowing for all-electrical control of the qubits and other elements which might be in the system.","The other elements may include microwave resonators, active filters, quantum-limited amplifiers, etc.","A state-of-the-art fault-tolerant quantum computing architecture which has gathered interest recently is the surface code.","In the surface code, qubits are arranged in a lattice with only the nearest neighbor interactions required.","For superconducting qubits, the surface code is an attractive path forward as defining multiple qubits in a nearest-neighbor lattice.","Moreover, the error thresholds which are required for the surface code are within reach for superconducting qubits with the current levels of coherence.","One particular physical proposal in the state-of-the-art for realizing the surface code with superconducting qubits is the skew-symmetric layout.","In this lattice, each superconducting qubit is coupled to two separate linking bus resonators.","The coupling of superconducting qubits with microwave resonators is known as circuit quantum electrodynamics (cQED).","The microwave resonators are typically defined as planar stripline resonators but can also be modes within three-dimensional (3D) waveguide cavities.","Although it may appear simple to design a large lattice of many superconducting qubits and stripline resonators lithographically, getting every resonator mode and every qubit to work as desired together is a challenge.","For example, crosstalk between resonators and superconducting qubits as well as undesired spurious modes can result in stray couplings between quantum objects.","Crosstalk is defined here as any unwanted coupling of microwave signals between qubit or resonator channels, other than those desired and defined by wiring.","Furthermore, although it may appear easy to optimize parameters for a single qubit and a single cavity mode, once these individual qubits are re-arranged in a larger network and all defined on the same chip, their (collective) behavior can change and can be difficult to then debug.","According to embodiments discussed herein, a vertically integrated multi-chip architecture is provided, with discrete superconducting chip pieces comprised of superconducting qubits and their readout resonators.","The superconducting qubits, along with their readout resonators, are then all arranged to mate in a matrix sandwiched by two larger carrier chips.","These two larger carrier chips serve two purposes: one purpose is to integrate multiple resonator quantum buses to couple the superconducting qubits together (thereby coupling quantum information between qubits), and the other purpose permits physical connections via fan-out wiring to explicit microwave controls.","This embodiment realizes a scalable architecture for quantum computation using well-established technology, while obviating challenging silicon integration techniques, such as thru-silicon-vias (TSVs) and multi-level lithography.","There are two physically different methods for implementing superconducting quantum processors via the circuit quantum electrodynamics (cQED) architecture, which are a 2D planar lithographic method and a 3D waveguide cavity method.","The quantum processor refers to the entirety of the assembled components.","2D Planar Integration: The integration of qubits and resonators for 2D cQED is started via depositing superconducting films on silicon or sapphire substrates.","Some typical superconducting films used are niobium (Nb), aluminum (Al), titanium nitride (TiN), and niobium nitride (NbN).","Resonators (including readout resonators) are commonly defined in these superconducting films using coplanar waveguides, microstrips, coplanar striplines, or lumped element inductors and capacitors.","Subsequently, superconducting qubits with Josephson junctions, such as the transmons, phase-qubits, or flux-qubits are also lithographically patterned via either electron-beam or optical lithography.","Scaling up to larger quantum processors in this scheme requires a larger and larger chip to accommodate more resonators for coupling, more qubits, and more readout resonators.","Using this 2D integration technique, processors up to 9 qubits have been devised in a linear chain, and 8 qubits in a latticed architecture.","As the number of qubits in the 2D processor scales up, input-output (I/O) becomes increasingly challenging.","In order to avoid crosstalk and integrate appropriate fan-out, technologies such as 3D integrated flip-chips, air-bridge crossovers, thru-silicon vias, and multi-layer lithography are required.","As more and more of these different fabrication processes are required to scale up to larger quantum processors, the potential influence and degradation on the superconducting qubits increases rapidly.","Therefore using these advanced fabrication techniques can lead to many different sources of decoherence in the qubits.","For some of these processes, it could be necessary to perform them after Josephson junctions are lithographically defined.","The impact and losses on Josephson junction based superconducting qubits after these processing steps are then a particular concern as to whether high coherence can continue to be preserved.","Accordingly, this makes full-scale integration of a large system having a large number of qubits challenging.","Embodiments include various features: 1) An array of vertical superconducting qubit chips is mounted to a silicon quantum bus plane and mounted to a separate qubit addressing and readout plane.","2) A quantum bus (QB) plane lithographically is defined on silicon which permits the coupling of quantum information among individual vertical superconducting qubit chips.","3) A readout (RO) plane couples each superconducting qubit chip's readout resonator to an integrated microwave bandwidth transmission line which follows onto a flexible circuit board thus connecting each superconducting qubit chip's readout resonator a coaxial connector for input/output (I/O).","4) Vertical superconducting qubit chips each contain a single superconducting qubit (also referred to as a tunnel junction, such as a Josephson junction) and on-chip readout resonator, designed in a way to effectively couple to the quantum bus plane and the readout plane.","Each individual vertical superconducting qubit chip is designed to have a specific lithographically-defined coupling capacitance between the tunnel junction to the quantum bus plane on one end and between the readout resonator and the addressing transmission line of the readout plane on the other end.","5) All silicon elements are retained within a well-thermalized metal housing (e.g., copper) which provides mechanical support, alignment, and thermal contact.","According to embodiments, the technique discussed herein is an approach for assembling the modular array of superconducting qubit chips into a scalable quantum processor, commensurate with latticed architectures for quantum error correction, such as the surface code.","Now turning to the figures, FIG.","1 is a schematic illustrating a transparent view of part of the modular array of vertically integrated superconducting qubit devices according to an embodiment.","FIG.","1 shows a quantum bus plane 100, a readout plane 102, and superconducting vertical qubit chips 101.The superconducting vertical qubit chips 101 are also referred to as qubit dies, qubits, etc.","The readout plane 102 and the quantum bus plane 100 sandwich the qubit chips 101 in between.","FIG.","2 is a schematic illustrating a quantum bus plane design of the quantum bus plane 100 according to an embodiment.","The quantum bus plane design illustrates a surface code example.","The quantum bus plane 100 may be made of a semiconductor material as the substrate, such as, e.g., silicon, sapphire, etc.","The semiconductor material has interconnect wiring 202 deposited on top of the semiconductor material.","The interconnect wiring 202 is made of a superconducting material.","Superconducting material may be defined as a material that can conduct electricity or transport electrons from one atom to another with no resistance when the superconducting material has reached “critical temperature” (Tc), or the temperature at which the material becomes superconductive.","Conducting electricity or transporting electrons from one atom to another with no resistance means that no heat, sound, or any other form of energy would be released from the material as understood by one skilled in the art.","The quantum bus plane 100 connects each individual qubit chip 101 via interconnect wiring 202.The interconnect wiring 202 connects (e.g., capacitively) to each superconducting qubit chip 101 installed in the quantum bus plane 100.The interconnect wiring 202 includes coupling bus resonators 205 positioned between each superconducting vertical qubit chip 101.Particularly, superconducting vertical qubit chips 101 are configured to couple together through the coupling bus resonators 205.To assist with securing and positioning superconducting vertical qubit chips 101 on the quantum bus plane 100, the quantum bus plane 100 includes etched recesses 201 at the locations to insert each of the superconducting vertical qubit chips 101.The etched recesses 201 are pockets that individually fit the superconducting vertical qubit chips 101 into specific locations in the quantum bus plane 100.The etched recesses 201 in the quantum bus plane 100 help to define accurate capacitive coupling between the qubit chips 101 and the interconnect wiring 202.The etched recesses 201 determine how deeply the vertical qubit chips 101 sit into the quantum buss plane 100 and thus determine the vertical separation between the capacitor pads on the qubit chip 101 and those on the quantum buss plane 100.The etched recesses 201 are etched into the semiconductor substrate of the quantum bus plane 100.Accurate vertical separation of these coupling pads is a prerequisite for achieving a precise coupling capacitance value.","The coupling capacitor pad 404 is shown in FIG.","4 and the quantum bus plane 100 has coupling pad 250 in front of each etched recess 201.For the sake of clarity and so as not to obscure FIG.","2, only two superconducting vertical qubit chips 101 are shown in FIG.","2 although it is understood that each row, e.g., rows 1-4, are filled with superconducting vertical qubit chips 101.One superconducting vertical qubit chip 101 is shown as a code superconducting vertical qubit chip in row 1, and the other superconducting vertical qubit chip 101 is a syndrome superconducting vertical qubit chip in row 2.In one implementation, each row may be filled with the same type of superconducting vertical qubit chip 101.For example, row 1 may be filled with code superconducting vertical qubit chips 101, while row 2 is filled with syndrome superconducting vertical qubit chips 101.Row 3 may be filled with code superconducting vertical qubit chips 101, while row 4 is filled with syndrome superconducting vertical qubit chips 101.Although only 4 rows are shown for the sake of illustration, it is contemplated that M numerous rows may be included on the quantum bus plane 100, where M is the last row.","A code qubit stores quantum information for operation of the quantum processor.","A syndrome qubit measures and extracts any errors in the system without corrupting the information present in the code qubit.","These terms are commonly applied when discussing “surface code error correction.” According to an embodiment, FIG.","3 is a schematic illustrating the readout plane 102 in an inverted view.","FIG.","3 shows the backside of the readout plane 102, and the backside faces the quantum bus plane 100 (not shown in FIG.","3).","The readout plane 102 may be made of a semiconductor material as the substrate, such as, e.g., silicon, sapphire, etc.","The semiconductor material has fan-out wiring 302 deposited on top of the semiconductor material.","The fan-out wiring 302 may be made of a superconducting material.","The readout plane 102 includes etched recesses 301 at locations to insert each of the superconducting vertical qubit chips 101.Each etched recess 301 is a pocket that individually fits a single superconducting vertical qubit chip 101 into a specific location in the readout plane 102, analogous to the etched recesses 201 in the quantum bus plane 100 in FIG.","2.The etched recesses 301 in the readout plane 102 capacitively connect the superconducting vertical qubit chips 101 to the fan-out wiring 302 via the capacitor pads defined on the upper end of the vertical qubit chip 101 and on the readout plane 102.At the upper end, the vertical qubit chip 101 has coupling capacitor pad 401 as shown in FIG.","4, while the readout plane 102 has a coupling pad 350 in front of each etched recesses 301.The fan-out wiring 302 has transmission lines 320.Each transmission line 320 individually connects to a single superconducting vertical qubit chip 101 in a one-to-one relationship.","The etched recesses 301 serve both a mechanical purpose and an electrical purpose.","Mechanically, the etched recesses 301 serve as a slot/pocket to insert each superconducting vertical qubit chip 101.Electrically, the etched recesses 301 align each superconducting vertical qubit chip 101 to an individual transmission line 320 of the fan-out wiring 302.The fan-out wiring 302 individually couples to each superconducting vertical qubit chip 101.Also, the fan-out wiring 302 individually connects each superconducting vertical qubit chip 101 to a flexible circuit board 303.The fan-out wiring 302 does not affect quantum information on the superconducting vertical qubit chips 101.The fan-out wiring 302 connects the superconducting vertical qubit chips 101 to the outside environment (e.g., the 50 ohm (Ω) environment).","The flexible circuit board 303 individually connects each superconducting vertical qubit chip 101 to an individual connector 304 via the fan-out wiring 302.Although the flexible circuit board 303 is shown as one implementation, it is contemplated that other type of circuit boards or electrical connections may be utilized.","The connectors 304 individually connect the superconducting vertical qubit chips 101 to external electronics (not shown).","The connectors 304 may be microwave connectors in which microwave signals may be input and qubit states can be read.","Each connector 304 has a one-to-one relationship to a single superconducting vertical qubit chip 101 on the readout plane 102, such that each superconducting vertical qubit chip 101 is individually addressable through a single connector 304, through the flexible circuit board 303, through the fan-out wiring 302, a particular transmission line 320, and through an individual etched recess 301.In one implementation, the connectors 304 may coaxial cable connectors configured to connect to coaxial cables.","Although not shown so as not to obscure FIG.","3, it is understood that conductive wiring runs through the flexible circuit board 303 and that wiring connects the flexible circuit board 303 to each respective connector 304 as understood by one skilled in the art.","The conductive wiring of the flexible circuit board 303 may be made of superconducting or normal material.","FIG.","4 is a schematic of an example superconducting vertical qubit chip 101 according to an embodiment.","Various details of the superconducting vertical qubit chips 101 are shown in FIG.","4.The superconducting vertical qubit chips 101 may have a substrate made of a semiconductor material, such as, e.g., silicon, sapphire, etc.","Each qubit chip 101 is an integrated circuit.","Conductive material is deposited and patterned on the substrate of the superconducting vertical qubit chips 101 to form the integrated circuit.","The superconducting vertical qubit chips 101 are not a monolithic wafer.","Rather, the superconducting vertical qubit chips 101 are formed from a wafer (substrate) diced into individual qubit dies.","Each diced superconducting vertical qubit chip 101 includes a coupling capacitor pad 401.The coupling capacitor pad 401 is a capacitor that capacitively couples each superconducting vertical qubit chip 101 to the readout plane 102 via the fan-out wiring 302, when the superconducting vertical qubit chip 101 is inserted in its etched recess 201.Accordingly, on one end of the superconducting vertical qubit chip 101, that end is electrically connected to the readout plane 102 through the coupling capacitor pad 401 and coupling pad 350 on the readout plane 102.It is noted that, for coupling capacitor pads 401 and 350 and coupling capacitor pads 404 and 250, the coupling capacitors may be defined by metal pads that are at right angles to each other, with a well-defined vertical separation.","The two types of coupling capacitors are quantum buss plane to lower side of qubit chip, and upper side of vertical qubit chip to readout plane.","It should be understood that two metal surfaces (pads in this case) at right angles to each other, separated by some distance, define a capacitor.","Embodiments exploit this fact to permit accurate coupling between circuit elements without resorting to wire bonds across right angle connections.","Additionally, each superconducting vertical qubit chip 101 includes coupling capacitor pads 404.The coupling capacitor pads 404 form a capacitor, and between the two coupling capacitor pads 404 is a tunnel junction 403 (sometimes called the qubit), such as, e.g., a Josephson junction.","The coupling capacitor pads 404 form a capacitor that capacitively couples to the quantum bus plane 100 via the interconnecting wiring 202.Accordingly, on the opposite end to the coupling capacitor pad 401, the opposite end is electrically connected to the quantum bus plane 100 through the coupling capacitor pads 404.The superconducting vertical qubit chip 101 includes readout resonator 402.The readout resonator 402 is configured with a resonance frequency designed to read the state of the qubit tunnel junction 403.The readout resonator 402 is positioned between the coupling capacitor pad 401 and the coupling capacitor pads 404.The readout resonator 402 is formed of conductive material that connects the coupling capacitor pad 401 and the coupling capacitor pads 404.The conductive material is a superconducting material, which forms the circuit.","The superconducting vertical qubit chip 101 includes a ground plane 405 surrounding the circuit of the coupling capacitor pad 401, the coupling capacitor pads 404, and the readout resonator 402.The material of the substrate separates the ground plane 405 from the circuit.","According to an embodiment, an assembly and packaging technique for the modular array of vertically integrated superconducting qubit chips 101 is discussed below in FIGS.","5A, 5B, 5C, 5D, 5E, and 5F.","FIG.","5A illustrates part of an assembly 500.The assembly 500 has a copper block 502.The copper block 502 includes a readout plane slot 503.The readout plane 102 is to be inserted into the readout plane slot 503 as discussed further below.","Although a copper block 502 is illustrated, the block 502 may be made of other materials.","The block 502 can be constructed of a variety of materials provided they give high thermal conductivity.","Examples other than copper include brass, sapphire, silicon, silver, aluminum, and/or niobium.","Assembly combs 520A and 520B are utilized to orient alignment of the superconducting vertical qubit chips 101 for assembly with the readout plane 102 (in the etched recesses 201) and quantum bus plane 100 (in the etched recesses 301) within the copper block 502.Both assembly combs 520A and 520B have teeth with predefined spacing.","For example, the assembly comb 520A has teeth 525A and the assembly comb 520B has teeth 525B.","In one implementation, the spacing of the teeth 525A is larger than the spacing of the teeth 525B, and the spacing of the teeth 525A and 525B is based on accommodating the cross-section size of the superconducting vertical qubit chips 101.The copper block 502 includes assembly slots 501A and 501B.","The assembly comb 520A is inserted into the assembly slot 501A, and the assembly comb 520B is inserted into the assembly slot 501B.","One assembly slot is positioned higher than the other assembly slot such that the assembly combs 520A and 520B define the desired alignment slots where they cross over and under each other but do not interfere with each other when inserted into their respective assembly slots 501A and 501B.","FIG.","5B is a schematic of the assembly 500 showing the assembly combs 520A and 520B in place within the copper block 502 according to an embodiment.","Slots 525 are formed by the intersection of the assembly combs 520A and 520B while in the copper block 502.The slots 525 are utilized to orient the superconducting vertical qubit chip 101.In particular, the slots 525 are formed by the spacing of the teeth 525A and 525B such that the slots 525 can accommodate the size of the superconducting vertical qubit chips 101.In one implementation, the spacing of the slots 525 may be about 5 millimeters (mm) in the x-axis and may be about 5 mm in the y-axis.","In one implementation, each superconducting vertical qubit chip 101 may have approximate dimensions of 8 mm tall by 2 mm wide by 0.7 mm thick.","Also, to accommodate the size of the superconducting vertical qubit chips 101, the etched recesses 201 and 301 may be about 0.7 mm in the x-axis and about 2 mm in the y-axis.","The etched recessed 201 and 301 may have a depth of about 0.35 mm in the z-axis.","FIG.","5C is a schematic of the assembly 500 showing an abbreviated view inside the copper block 502 (not shown) which is part of a housing 550 (shown in FIG.","5F) according to an embodiment.","In FIG.","5C, the abbreviated view omits certain elements in order to simplify the assembly 500 for better understanding.","The walls of the housing copper block 502 are removed, and only a copper base 530 of the housing 550 is shown.","The quantum bus plane 100 is attached to and/or positioned on the copper base 530.The intersecting assembly combs 520A and 520B are in place (within the copper block 502) forming the slots 525.Aligned through the slots 525, a few example superconducting vertical qubit chips 101 are installed into (the etched recesses 201 in) the quantum bus plane 100.The slots 525 directly align to individual etched recesses 201 below and provide a guide during installation of the superconducting vertical qubit chips 101.FIG.","5D is a schematic of the assembly 500 showing a transparent view into the copper block 502 according to an embodiment.","FIG.","5D shows the readout plane 102 installed into the copper block 502 and extending outside of the copper block 502 through readout plane housing slot 585.In one implementation, the quantum bus plane 100 fits into the bottom of the copper block 502.In another implementation, the copper block 502 may sit on top of the quantum bus plane 100.The superconducting vertical qubit chips 101 are sandwiched between the readout plane 102 and the quantum bus plane 100, and the ends of the superconducting vertical qubit chips 101 fit into the etched recesses 201 and 301 of the quantum bus plane 100 and readout plane 102, respectively.","For simplicity and ease of understanding, only a few superconducting vertical qubit chips 101 are shown in FIG.","5D.","Also, so as not to obscure FIG.","5D, the assembly combs 520A and 520B are not shown in this figure.","A board clamp 555 holds and attaches to portion of the readout plane 102 extending outside of the housing.","The board clamp 555 holds and attaches the readout plane 102 to the flexible circuit board 303.Outside of the housing 550, the connectors 304 are on a rigid circuit board 330 and connected to the flexible circuit board 303.The circuit board 330 comprises circuits (not shown) individually connecting each connector 304 to an individual circuit within the flexible circuit board 303, as understood by one skilled in the art.","FIG.","5E is a schematic of the assembly 500 showing a view underneath the housing 500 according to an embodiment.","The copper base 530 of the housing is removed.","FIG.","5E allows the bottom of the quantum bus plane 100 to be viewed.","FIG.","5E also shows that wire bonds 578 connect the readout plane 102 to the board clamp 555.These wire bonds 578 create an electrical connection between the fan-out wiring 302 on the readout plane 102 and the conductors (of whatever type) on the flexible circuit board 303.Although it possible to mechanically bond the flexible circuit board 303 directly to the silicon readout plane 102, those two items, however, have extremely different thermal expansion coefficients which may cause the connections to break over time.","Wire bonds 578 being flexible permit long-term reliability over many thermal cycles.","In one implementation, the two readout planes are to be made of the same material so any dimensional changes from thermal expansion are the same for both planes.","FIG.","5F is a schematic of the assembly 500 according to an embodiment.","FIG.","5F shows that a pusher block 570 pushes the readout plane 102 firmly against the superconducting vertical qubit chips 101.The pusher block 570 is spring loaded.","The constant pressure of the pusher block 570 ensures that the superconducting vertical qubit chips 101 stay in the etched recesses 201 and 301.The force of the pusher block 570 is caused by a spring mechanism 575 attached to a top cap 582 of the housing 550.As can be seen in FIG.","5F, the housing 550 is an enclosure.","The housing 550 may be made of copper, silver, brass, silicon, sapphire, aluminum, and/or niobium.","The housing 550 includes the copper block 502, the copper base 530, the pusher block 570, and the top cap 582.In one implementation, the assembly combs 520A and 520B may remain in the copper block 502 after the superconducting vertical qubit chips 101 have been installed (i.e., inserted into the etched recesses 201 and 301 of the quantum bus and readout planes 100 and 102, respectively).","In another implementation, the assembly combs 520A and 520B may be removed from the copper block 502 after installing the superconducting vertical qubit chips 101, such that the assembly combs 520A and 520B are not in the housing 550.For ease of understanding, sub-headings are provided below.","The sub-headings are meant for explanation purposes and not limitation.","Standardized Fabrication of Elements: Each of the discussed silicon elements, such as, e.g., the quantum bus plane 100, superconducting vertical qubit chips 101, and readout plane 102, use well-established lithographic technology that is time tested in the superconducting qubit community and thus understood by one skilled in the art.","In one embodiment, the materials are standardized to niobium for the resonator and transmission line elements; the materials are aluminum and native aluminum oxide for the qubit junction fabrication (i.e., the qubit tunnel junction 403) via standard double-angle evaporation.","All lithography may be performed on high-resistivity silicon wafers with established loss parameters appropriate for qubit technology, as understood by one skilled in the art.","The readout resonator 402 is in on the vertical qubit chip 101, and transmission line elements are any other wiring on the quantum buss plane 100, the qubit chip 101, and the readout plane 102.In one implementation, the readout resonators 402 may be of a different material than the wiring.","In another implementation, the readout resonators 402 and wiring may be fabricated from a variety of all the same materials.","In yet another implementation, the readout resonators 402 and various different portions of the wiring may be fabricated from a variety of different materials for each sub-category of function.","Complete assembly of a scalable quantum processor with N qubits (i.e., N qubit chips 101) is achieved without resorting to any multi-level lithography, inserted ground planes, cross-overs, or thru-silicon-vias (TSVs).","Using current standard lithographic techniques, embodiments allow the straightforward integration of N=100 to 1000 superconducting vertical qubit chips 101, taking up a space roughly the size of a deck of playing cards (e.g., 2.5×3.5 inches or 64×89 mm).","Design of Individual Qubit Chips and Coupling Capacitance Choices: From electromagnetic simulations for reasonable parameters of qubit tunnel junctions 403, readout resonators 402, and quantum bus planes 100, it is possible to achieve the desired precise coupling capacitance values with the geometry described herein.","Each individual superconducting vertical qubit chip 101 contains a capacitor (i.e., coupling capacitor 404) that couples signal to the quantum bus traces (i.e., interconnect wiring 202) on the quantum bus plane 100.The capacitor (coupling capacitor 404) provides coupling that is appropriate for a specific universal two-qubit entangling gate.","The capacitor is formed by an electrode on the lower end of the vertical qubit chip 101 which couples to electrodes on the quantum buss plane 100.The approximate range in this implementation for the capacitor value is around 7 to 5 femto Farads.","The interconnection between the superconducting vertical qubit chip 101 and the etched recesses 201 (pocket) in the quantum bus plane 100 is designed to minimize stray coupling between the qubit signals and ground plane 405.On the other end of the superconducting vertical qubit chip 101, the interconnection with the readout plane 102 creates a specific capacitance between the readout resonator 402 and the control transmission line 320 (of the fan-out wiring 302) such that the readout resonator 402 has a well-defined quality factor and permits a high fidelity readout.","This capacitor (i.e., coupling capacitor pad 401) is formed by an electrode on the superconducting vertical qubit chip 101 (qubit die) which couples to an electrode (a portion of the control transmission line 320) on the readout plane 102.The approximate value of this capacitor in this implementation is around 5 to 7 femto Farads, for example.","Each superconducting vertical qubit chip 101 is metalized on the backside with superconductor material to control stray coupling and other electric fields within the processor housing 550.The backside of the superconducting vertical qubit chip 101 is opposite the circuit of the coupling capacitor pad 401, the coupling capacitor pads 404, and the readout resonator 402 on the front side.","Note that all capacitor values and uncertainty are determined by lithographic feature sizes and depth of etches.","These values are easily changed and provide for sufficient accuracy for the circuit tolerances required for embodiments.","Design of Quantum Bus Plane: The fabrication process of the quantum bus plane 100 can begin with standard 2D integration techniques.","In one implementation, niobium is electro-sputtered onto a silicon substrate 590.Multiple masks, having the quantum bus designs and having the etched recesses 201 (pockets) where qubit chips 101 are to be mounted, may be used for reactive ion etching (RIE) of the niobium.","The quantum bus design mask defines the coupling bus resonators 205 which couple quantum information among the superconducting vertical qubit chips 101.The pocket mask (for making the etched recesses 201) defines the locations to etch down into the silicon for the individual superconducting vertical qubit chips 101 to be mounted.","The process for the pocket mask etch may be similar to most 3D integration schemes, except in this case the sputtered niobium is used as a hardmask to first define the pockets (i.e., etched recesses 201).","Definition of the pocket (i.e., etched recess 201) in the silicon substrate 590 can be achieved using a deep silicon dry etch process, reactive ion etching (RIE), or a wet chemistry (tetramethyl ammonium hydroxide (TMAH)).","The pockets (i.e., etched recesses 201) of the quantum bus plane 100 are arranged in a grid structure where successive rows are offset, one corresponding to superconducting vertical code qubit chips, and the other row corresponding to superconducting vertical syndrome qubits chips 101 for error detection via measurement.","Each qubit chip pocket (i.e., etched recess 201) is arranged to couple to two coupling bus resonators 205 defined on the quantum bus plane 100 in one implementation.","Note that this arrangement is not the only way to realize the surface code, as one can also couple either three or four coupling bus resonators 205 to a single superconducting vertical qubit chip 101 in another implementation.","Location accuracy of the qubit chip pockets (etched recesses 201 (including etched recesses 301 in readout plane 102) is determined by the lithography and depth accuracy as determined by the etch time.","The pockets are formed with a chamfered or bell-mouthed opening to allow easy insertion of each superconducting vertical qubit chip 101 (qubit die).","Depending on results from scaling to larger N (i.e., a larger amount of superconducting vertical qubit chips 101), the quantum bus plane 100 may be admissible to more integration techniques such as TSVs for chip-mode reduction.","The nuance here is that no Josephson junctions (qubits) 403 need to be defined in this quantum bus plane 100, so there would be minimal effect on qubit coherence with further integration of the quantum bus plane 100.Design of Readout Plane: The readout plane 102 starts off similar to the quantum bus plane 100, with niobium conductors etched lithographically on a silicon substrate 595.Co-planar transmission lines 320 are patterned on the readout plane 102 in a fan-out configuration (i.e., fan-out wiring 302) so as to bring external signals into and out of each superconducting vertical qubit chip 101.These transmission lines 320 are defined in a coplanar waveguide, and support 50Ω microwave driving of both readout and qubit control signals.","All these transmission lines 320 meander through the readout plane 102 terminating on one edge in wire bond pads 370.The wire bond pads 370 are on the extreme right end of the fan-out wiring 302.Similar to the quantum bus plane, pockets (i.e., etched recesses 301) in the readout plane 102 are likewise defined via deep etching into the silicon substrate 595 of the readout plane 102, in corresponding locations as the etched recesses 201 in the quantum bus plane 100 so as to accept the mounting of the individual superconducting vertical qubit chips 101.These pockets (i.e., etched recesses 301) may be chamfered or otherwise bell-mouthed for ease of assembly and locating of structure.","The microwave signals for control and readout are carried off the readout plane 102 via wire bonds 578 to the flexible circuit board 303 which conducts to other transmission lines embedded in a separate rigid circuit board 330 populated with connectors 304 leading to external components.","Ground Planes in Quantum Bus Plane and Readout Plane Pockets: After etching qubit chip pockets (etched recesses 201, 301) in both the quantum bus and readout planes 100 and 102 respectively, these pockets (etched recesses 201, 301) are coated with niobium via sputtering to form continuous ground plane.","These ground planes are designed to mate to the ground planes 405 that exist on the extreme ends of each superconducting vertical qubit chip 101 to form a continuous electrostatic ground between the quantum bus and readout planes 100 and 102, respectively; the continuous electrostatic ground between the quantum bus and readout planes 100 and 102 (respectively) serves to (1) further isolate each qubit site (i.e., locations of etched recesses 201, 301) from spurious modes, (2) isolate each qubit site (i.e., locations of etched recesses 201, 301) from adjacent qubit superconducting vertical qubit chips 101, and (3) eliminate unwanted cross-talk coupling between superconducting vertical qubit chips 101.Assembly of Modular Array Elements: 1.Each individual superconducting vertical qubit chip 101 is located by an etched recess 201 formed in the quantum bus plane 100 and an etched recess 301 formed the readout plane 102.In one implementation, the etched recesses 201, 301 are accurately formed in the silicon substrates 590, 595 using a standard wet etch process.","2.Each individual superconducting vertical qubit chip 101 is chosen for desirable electrical characteristics such as transition frequency.","In some cases the syndrome qubits might be more strongly coupled to the readout wiring to enhance signal-to-noise.","This would reduce coherence times on the syndrome qubits which does not in any way degrade the quantum information in the code qubits.","3.A pair of crossed assembly combs 520A and 520B is mounted to the outer housing of the copper block 502 in order to temporarily provide alignment for the superconducting vertical qubit chips 101 (as shown in FIG.","5A).","The assembly combs 520A and 520B create a series of alignment slots 525 (as shown in FIG.","5B) to orient the superconducting vertical qubit chips 101 which are inserted vertically from above.","The superconducting vertical qubit chips 101 key into the etched recesses 201 in the quantum bus plane 100 (as shown in 5C) and are thereby (automatically) oriented to key into the corresponding etched recesses 301 in the readout plane 102 (as shown in FIG.","5D).","The readout plane 102 is inserted from the side via readout plane slot 503.FIG.","5E depicts the assembly 500 from below and shows the assembled components with the assembly combs 520A and 520B omitted.","Once assembled, the vertical organization of the superconducting vertical qubit chips 101 constrained (and sandwiched) between the two silicon quantum bus and readout planes 100 and 102 (respectively) is maintained with pressure applied by the pusher block 570.The pusher block 570 is spring-loaded from above via the springs 575 pressed down by the top cap 582 (as shown in FIG.","5F).","Expandable, Scalable and Replaceable Array: The figures associated with embodiments show a fourteen qubit chip array but the number of superconducting vertical qubit chips 101 can be expanded to any arbitrary number (N).","All that is required is that the quantum bus plane 100 should be enlarged and the niobium wiring be replicated at all qubit sites (i.e., locations at the etched recesses 201 to accommodate superconducting vertical qubit chips 101) as needed.","The readout plane 102 can support many signal transmission lines 320 interleaved between each qubit site (i.e., locations at the etched recesses 301 to accommodate superconducting vertical qubit chips 101) to bring the signals to one edge and may require integration of dielectric cross-overs to reduce crosstalk if desired.","Moreover, the further integration of the readout plane 102 and quantum bus planes 100 is a minimal issue as it will neither directly affect the qubit chip fabrication process nor the qubit coherence performance.","According to embodiments, the assembly 500 includes the desirable feature that each superconducting vertical qubit chip 101 may be hand-selected for the correct electrical characteristics; any member of the array of superconducting vertical qubit chips 101 may be individually replaced at any time if the qubit chip's performance degrades for any reason during operation.","Replacement of the superconducting vertical qubit chip 101 can be accomplished without removing wire bonds 578 and/or without having to unsolder any components.","Embodiments provide a clear separation of fabrication processing steps and avoid the need for all N qubit and circuit parameters to meet specification on a single superconducting vertical qubit chip 101.Qubit chips 101 from multiple different fabrication runs can be combined in this type of quantum processor so that parameters such as transition frequency may be easily tailored without having to achieve a full range of accurate parameters on one silicon wafer in just one fabrication run.","Individual qubit chips 101 may be chosen from various different fabrication runs (wafers) and combined in the processor assembly.","As understood by one skilled in the art, microwave signals are applied to the qubit chip 101 via the readout lines to excite it into a defined state.","After some later time the state of the qubits can be then read out by interrogating them at some other microwave frequency, again via the readout lines.","FIG.","6 is a method 600 of configuring an assembly 500 for a quantum computing device according to an embodiment.","Reference can be made to the figures discussed herein.","At block 605, the quantum bus plane 100 having a first set of recesses 201 are provided, as depicted in FIG.","2.At block 610, the quantum bus plane 100 is positioned in the block 502, on top of the copper base 530, as seen in FIG.","5D.","The alignment combs 520A and 520B are installed in the copper block 502 and fixed in place, creating a series of precisely aligned slots 535 to accept the qubit chips 101, as seen in FIG.","5B.","At block 615, a plurality of superconducting vertical qubit chips 101 are placed/installed in the block 502, each of the plurality of qubit chips 101 has a first end positioned in the first set of recesses 201 (as shown in FIG.","5C).","The plurality of qubit chips 101 extend vertically in a lengthwise direction by being positioned in the first set of recesses 201 and in the slots 525 created by the alignment combs.","The set of recesses 201 holds the lower end of the plurality of qubit chips 101 in the quantum bus plane 100.The first end of the plurality of qubit chips 101 is opposite the second end.","At block 620, the readout plane 102 with its recesses 301 is then installed into the copper block 502 such that the recesses 301 in the readout plane 102 are positioned to accept the upper end (i.e., second end) of the plurality of all the qubit chips 101 which have been aligned by the slots 525 created by both alignment combs 520A, 520B.","The readout plane 102 thus drops down over the ends of the qubit dies 101 a distance equal to the depth of the recesses in the readout plane 301 and the precise mechanical alignment of all the electrical circuit elements is achieved in all three axes simultaneously.","At this point the alignment combs 520A and 520B may either be left in place or may be removed.","The quantum bus plane 100 comprises a substrate 590 with interconnect wiring 202 on top of the substrate 590, and the interconnect wiring 202 connects the plurality of qubit chips 101 via a plurality of coupling bus resonators 205.The readout plane 102 comprises a substrate 595 with fan-out wiring 302 on top of the substrate 595, and the fan-out wiring 302 individually connects each of the plurality of qubit chips 101 to a circuit board 330.The circuit board 330 individually connects each of the plurality of qubit chips 101 to a plurality of connectors 304 in a one-to-one relationship.","The block 502 is configured to receive a first assembly comb 520A and a second assembly comb 520B to form an intersection, and the intersection of the first and second assembly combs 520A, 520B form a plurality of slots 525 for individually accepting the plurality of qubit chips 101.The plurality of slots 525 mechanically holds the plurality of qubit chips 101 in a vertical position.","FIG.","7 is a method 700 of configuring an assembly 500 for a quantum computing device according to an embodiment.","Reference can be made to the figures discussed herein.","At block 705, the following parts are assembled: copper base 530 and copper block 502.At block 710 the quantum buss plane 100 is installed into the copper block 502 such that the quantum buss plane 100 rests on top of the copper base 530, and the quantum bus plane 100 has a set of recesses 201 (the readout plane 102 has a different set of recesses 301).","Then, the assembly combs 520A and 520B are installed and fixed into the copper block 502 thereby creating alignment slots 525.At block 715, a plurality of qubit chips 101 are installed in the block 502, where each of the plurality of qubit chips 101 has a first end positioned in the first set of recesses 201 using the alignment slots 525 created by the assembly combs 520A, 520B to guide the qubit chips 101 into the correct locations.","The housing 550 includes a readout plane housing slot 585.At block 720, the readout plane 102 is installed into the slot 585 and the recesses 301 in the readout plane 102 accept the upper ends (i.e., second end) of the plurality of all the qubit chips 101 which have been put in the correct locations by the alignment combs 520A, 520B such that the readout plane 102 drops over all of them (qubit chips 101) simultaneously.","The bell-mouthed nature of the recesses 301 in the readout plane 102 assists in the final locating of the ends of the qubit dies 101 into the recesses 301.The readout plane 102 extends through the readout plane housing slot 585 to connect to the circuit board 330, and the circuit board 330 connects to a plurality of connectors 304.The housing 550 includes a pushing mechanism configured to apply pressure to the readout plane 102, and the pressure applied to the readout plane 102 forces the plurality of qubit chips 101 to the quantum bus plane 100.The pushing mechanism comprises: a pusher block 570 positioned on top of the readout plane 102, and a spring mechanism 575 pressing downward against the pusher block 570.The top part (top cap 582) of the housing 550 applying a compression force to the spring mechanism 575 from above.","It will be noted that various microelectronic device fabrication methods may be utilized to fabricate the components/elements discussed herein as understood by one skilled in the art.","In semiconductor device fabrication, the various processing steps fall into four general categories: deposition, removal, patterning, and modification of electrical properties.","Deposition is any process that grows, coats, or otherwise transfers a material onto the wafer.","Available technologies include physical vapor deposition (PVD), chemical vapor deposition (CVD), electrochemical deposition (ECD), molecular beam epitaxy (MBE) and more recently, atomic layer deposition (ALD) among others.","Removal is any process that removes material from the wafer: examples include etch processes (either wet or dry), and chemical-mechanical planarization (CMP), etc.","Patterning is the shaping or altering of deposited materials, and is generally referred to as lithography.","For example, in conventional lithography, the wafer is coated with a chemical called a photoresist; then, a machine called a stepper focuses, aligns, and moves a mask, exposing select portions of the wafer below to short wavelength light; the exposed regions are washed away by a developer solution.","After etching or other processing, the remaining photoresist is removed.","Patterning also includes electron-beam lithography.","Modification of electrical properties may include doping, such as doping transistor sources and drains, generally by diffusion and/or by ion implantation.","These doping processes are followed by furnace annealing or by rapid thermal annealing (RTA).","Annealing serves to activate the implanted dopants.","The flowchart and block diagrams in the Figures illustrate the architecture, functionality, and operation of possible implementations of systems, methods, and computer program products according to various embodiments of the present invention.","In this regard, each block in the flowchart or block diagrams may represent a module, segment, or portion of instructions, which comprises one or more executable instructions for implementing the specified logical function(s).","In some alternative implementations, the functions noted in the block may occur out of the order noted in the figures.","For example, two blocks shown in succession may, in fact, be executed substantially concurrently, or the blocks may sometimes be executed in the reverse order, depending upon the functionality involved.","It will also be noted that each block of the block diagrams and/or flowchart illustration, and combinations of blocks in the block diagrams and/or flowchart illustration, can be implemented by special purpose hardware-based systems that perform the specified functions or acts or carry out combinations of special purpose hardware and computer instructions."]],"string":"[\n [\n \"MODULAR ARRAY OF VERTICALLY INTEGRATED SUPERCONDUCTING QUBIT DEVICES FOR SCALABLE QUANTUM COMPUTING\",\n \"A technique relates to an assembly for a quantum computing device.\",\n \"A quantum bus plane includes a first set of recesses.\",\n \"A readout plane includes a second set of recesses.\",\n \"A block is positioned to hold the readout plane opposite the quantum bus plane, such that the first set of recesses opposes the second set of recesses.\",\n \"A plurality of qubit chips are included where each has a first end positioned in the first set of recesses and has a second end positioned in the second set of recesses.\"\n ],\n [\n \"1.A quantum device, comprising: a first structure including a first set of couplings; a second structure including a second set of couplings; and at least one qubit chip coupled to the first set of couplings and the second set of couplings.\",\n \"2.The quantum device of claim 1, wherein the first structure comprises a circuit.\",\n \"3.The quantum device of claim 2, wherein the circuit is configured to couple at least two qubit chips.\",\n \"4.The quantum device of claim 2, wherein the circuit comprises at least one coupling resonator.\",\n \"5.The quantum device of claim 1, wherein the second structure comprises a circuit.\",\n \"6.The quantum device of claim 5, wherein the circuit comprises transmission lines configured to couple to qubit chips.\",\n \"7.The quantum device of claim 6, wherein the transmission lines are configured to couple the qubits chips to connectors.\",\n \"8.The quantum device of claim 1, wherein the at least one qubit chip is positioned to the first and second structures for communication.\",\n \"9.The quantum device of claim 1, wherein the at least one qubit chip comprises a superconducting qubit.\",\n \"10.The quantum device of claim 1, wherein the at least one qubit chip comprises a readout resonator.\",\n \"11.A quantum device, comprising: a quantum bus plane including a first set of couplings; a readout plane including a second set of couplings; and qubit chips positioned to the first set of couplings and positioned to the second set of couplings.\",\n \"12.The quantum device of claim 11, wherein the qubit chips extend to the quantum bus plane and the readout plane.\",\n \"13.The quantum device of claim 11, wherein the first set of couplings is configured to receive the qubit chips in the readout plane; and wherein the second set of couplings is configured to receive the qubit chips in the quantum bus plane.\",\n \"14.The quantum device of claim 11, wherein the quantum bus plane comprises a substrate with interconnect wiring, the interconnect wiring connecting the qubit chips via coupling bus resonators.\",\n \"15.The quantum device of claim 11, wherein the readout plane comprises a substrate with fan-out wiring, the fan-out wiring individually connecting each of the qubit chips to a circuit board.\",\n \"16.The quantum device of claim 15, wherein the circuit board individually connects each of the qubit chips to connectors in a one-to-one relationship.\",\n \"17.A quantum device comprising: a first coupling; a second coupling; and a qubit chip coupled to the first coupling and the second coupling, the qubit chip comprising a superconducting qubit and a readout resonator.\",\n \"18.The quantum device of claim 17, wherein the first coupling is formed on a first structure comprising a first circuit.\",\n \"19.The quantum device of claim 18, wherein the second coupling is formed on a second structure comprising a second circuit.\",\n \"20.The quantum device of claim 19, wherein the first structure opposes the second structure so as to position the qubit chip.\"\n ],\n [\n \" BACKGROUND The present invention relates to quantum computing, and more specifically, to a modular array of vertically integrated superconducting qubit devices for scalable quantum computing.\",\n \"In one approach called circuit quantum electrodynamics, quantum computing employs active superconducting devices called qubits to manipulate and store quantum information, and resonators (e.g., as a two-dimensional (2D) planar waveguide or as a three-dimensional (3D) microwave cavity) to read out and facilitate interaction among qubits.\",\n \"Each superconducting qubit comprises one or more Josephson junctions shunted by capacitors in parallel with the junctions.\",\n \"The qubits are capacitively coupled to 2D or 3D microwave cavities.\",\n \"The energy associated with the qubit resides in the electromagnetic fields around the Josephson junction and especially in the vicinity of relatively larger shunt capacitance structures.\",\n \"To date, a major focus has been on improving lifetimes of the qubits in order to allow calculations (i.e., manipulation and readout) to take place before the information is lost to decoherence of the qubits.\",\n \"Currently, superconducting qubit coherence times can be as high as 100 microseconds, and efforts are being made to increase the coherence times.\",\n \"One area of research with respect to increasing coherence times is focused on eliminating lossy materials from areas of relatively high electromagnetic field energy density such as in the vicinity of sharp corners and edges of the thin films of which the qubits are comprised.\",\n \"Such materials in proximity to the qubit can include imperfections that support defects known as two-level systems (TLSs).\"\n ],\n [\n \" SUMMARY According to one embodiment, an assembly for a quantum computing device is provided.\",\n \"The assembly includes a quantum bus plane including a first set of recesses, a readout plane including a second set of recesses, and a block positioned to hold the readout plane opposite the quantum bus plane, such that the first set of recesses opposes the second set of recesses.\",\n \"Also, the assembly includes a plurality of qubit chips where each has a first end positioned in the first set of recesses and has a second end positioned in the second set of recesses.\",\n \"According to one embodiment, an assembly for a quantum computing device is provided.\",\n \"The assembly includes a housing configured as an enclosure having a bottom part, a top part, and a block, in which the block connects the top and bottom parts.\",\n \"The assembly includes a quantum bus plane including a first set of recesses, and a readout plane including a second set of recesses.\",\n \"The block is configured to position the readout plane opposite the quantum bus plane, such that the first set of recesses opposes the second set of recesses.\",\n \"Also, the assembly includes a plurality of qubit chips where each has a first end positioned in the first set of recesses and has a second end positioned in the second set of recesses.\",\n \"According to one embodiment, a method of configuring an assembly for a quantum computing device is provided.\",\n \"The method includes providing a housing configured as an enclosure having a bottom part, a top part, and a block, in which the block connects the top and bottom parts.\",\n \"The method includes providing a readout plane having a first set of recesses and a quantum bus plane having a second set of recesses, and assembling the readout plane opposite the quantum bus plane in a block, such that the first set of recesses opposes the second set of recesses.\",\n \"Also, the method includes installing a plurality of qubit chips in the block, where each of the plurality of qubit chips has a first end positioned in the first set of recesses and has a second end positioned in the second set of recesses.\",\n \"In one or more embodiments, the plurality of qubit chips extends vertically in a lengthwise direction by being positioned in both the first set of recesses and the second set of recesses.\",\n \"The first set of recesses holds the first end of the plurality of qubit chips in the readout plane, and the second set of recesses holds the second end of the plurality of qubit chips in the quantum bus plane.\",\n \"In one or more embodiments, the first end of the plurality of qubit chips is opposite the second end.\",\n \"In one or more embodiments, the block is made of a superconducting material.\",\n \"In one or more embodiments, the quantum bus plane comprises a substrate with interconnect wiring on top of the substrate, and the interconnect wiring connects the plurality of qubit chips via a plurality of coupling bus resonators.\",\n \"In one or more embodiments, the readout plane comprises a substrate with fan-out wiring on top of the substrate, and the fan-out wiring individually connects each of the plurality of qubit chips to a circuit board.\",\n \"The circuit board individually connects each of the plurality of qubit chips to a plurality of connectors in a one-to-one relationship.\",\n \"In one or more embodiments, the block is configured to receive a first assembly comb and a second assembly comb to form an intersection, and the intersection of the first and second assembly combs forms a plurality of slots for individually accepting the plurality of qubit chips.\",\n \"The plurality of slots mechanically holds the plurality of qubit chips in a vertical position.\",\n \"Additional features and advantages are realized through the techniques of the present invention.\",\n \"Other embodiments and aspects of the invention are described in detail herein and are considered a part of the claimed invention.\",\n \"For a better understanding of the invention with the advantages and the features, refer to the description and to the drawings.\"\n ],\n [\n \"DOMESTIC PRIORITY This application is a continuation application of and claims priority from U.S. patent application Ser.\",\n \"No.\",\n \"15/175,454, filed on Jun.\",\n \"7, 2016, entitled “MODULAR ARRAY OF VERTICALLY INTEGRATED SUPERCONDUCTING QUBIT DEVICES FOR SCALABLE QUANTUM COMPUTING”, which is a divisional application of and claims priority from U.S. patent application Ser.\",\n \"No.\",\n \"14/737,707, filed on Jun.\",\n \"12, 2015, entitled “MODULAR ARRAY OF VERTICALLY INTEGRATED SUPERCONDUCTING QUBIT DEVICES FOR SCALABLE QUANTUM COMPUTING”, the entire contents of which are incorporated herein by reference.\",\n \"BACKGROUND The present invention relates to quantum computing, and more specifically, to a modular array of vertically integrated superconducting qubit devices for scalable quantum computing.\",\n \"In one approach called circuit quantum electrodynamics, quantum computing employs active superconducting devices called qubits to manipulate and store quantum information, and resonators (e.g., as a two-dimensional (2D) planar waveguide or as a three-dimensional (3D) microwave cavity) to read out and facilitate interaction among qubits.\",\n \"Each superconducting qubit comprises one or more Josephson junctions shunted by capacitors in parallel with the junctions.\",\n \"The qubits are capacitively coupled to 2D or 3D microwave cavities.\",\n \"The energy associated with the qubit resides in the electromagnetic fields around the Josephson junction and especially in the vicinity of relatively larger shunt capacitance structures.\",\n \"To date, a major focus has been on improving lifetimes of the qubits in order to allow calculations (i.e., manipulation and readout) to take place before the information is lost to decoherence of the qubits.\",\n \"Currently, superconducting qubit coherence times can be as high as 100 microseconds, and efforts are being made to increase the coherence times.\",\n \"One area of research with respect to increasing coherence times is focused on eliminating lossy materials from areas of relatively high electromagnetic field energy density such as in the vicinity of sharp corners and edges of the thin films of which the qubits are comprised.\",\n \"Such materials in proximity to the qubit can include imperfections that support defects known as two-level systems (TLSs).\",\n \"SUMMARY According to one embodiment, an assembly for a quantum computing device is provided.\",\n \"The assembly includes a quantum bus plane including a first set of recesses, a readout plane including a second set of recesses, and a block positioned to hold the readout plane opposite the quantum bus plane, such that the first set of recesses opposes the second set of recesses.\",\n \"Also, the assembly includes a plurality of qubit chips where each has a first end positioned in the first set of recesses and has a second end positioned in the second set of recesses.\",\n \"According to one embodiment, an assembly for a quantum computing device is provided.\",\n \"The assembly includes a housing configured as an enclosure having a bottom part, a top part, and a block, in which the block connects the top and bottom parts.\",\n \"The assembly includes a quantum bus plane including a first set of recesses, and a readout plane including a second set of recesses.\",\n \"The block is configured to position the readout plane opposite the quantum bus plane, such that the first set of recesses opposes the second set of recesses.\",\n \"Also, the assembly includes a plurality of qubit chips where each has a first end positioned in the first set of recesses and has a second end positioned in the second set of recesses.\",\n \"According to one embodiment, a method of configuring an assembly for a quantum computing device is provided.\",\n \"The method includes providing a housing configured as an enclosure having a bottom part, a top part, and a block, in which the block connects the top and bottom parts.\",\n \"The method includes providing a readout plane having a first set of recesses and a quantum bus plane having a second set of recesses, and assembling the readout plane opposite the quantum bus plane in a block, such that the first set of recesses opposes the second set of recesses.\",\n \"Also, the method includes installing a plurality of qubit chips in the block, where each of the plurality of qubit chips has a first end positioned in the first set of recesses and has a second end positioned in the second set of recesses.\",\n \"In one or more embodiments, the plurality of qubit chips extends vertically in a lengthwise direction by being positioned in both the first set of recesses and the second set of recesses.\",\n \"The first set of recesses holds the first end of the plurality of qubit chips in the readout plane, and the second set of recesses holds the second end of the plurality of qubit chips in the quantum bus plane.\",\n \"In one or more embodiments, the first end of the plurality of qubit chips is opposite the second end.\",\n \"In one or more embodiments, the block is made of a superconducting material.\",\n \"In one or more embodiments, the quantum bus plane comprises a substrate with interconnect wiring on top of the substrate, and the interconnect wiring connects the plurality of qubit chips via a plurality of coupling bus resonators.\",\n \"In one or more embodiments, the readout plane comprises a substrate with fan-out wiring on top of the substrate, and the fan-out wiring individually connects each of the plurality of qubit chips to a circuit board.\",\n \"The circuit board individually connects each of the plurality of qubit chips to a plurality of connectors in a one-to-one relationship.\",\n \"In one or more embodiments, the block is configured to receive a first assembly comb and a second assembly comb to form an intersection, and the intersection of the first and second assembly combs forms a plurality of slots for individually accepting the plurality of qubit chips.\",\n \"The plurality of slots mechanically holds the plurality of qubit chips in a vertical position.\",\n \"Additional features and advantages are realized through the techniques of the present invention.\",\n \"Other embodiments and aspects of the invention are described in detail herein and are considered a part of the claimed invention.\",\n \"For a better understanding of the invention with the advantages and the features, refer to the description and to the drawings.\",\n \"BRIEF DESCRIPTION OF THE DRAWINGS The subject matter which is regarded as the invention is particularly pointed out and distinctly claimed in the claims at the conclusion of the specification.\",\n \"The forgoing and other features, and advantages of the invention are apparent from the following detailed description taken in conjunction with the accompanying drawings in which: FIG.\",\n \"1 is a schematic illustrating a transparent view of part of the modular array of vertically integrated superconducting qubit chips according to an embodiment; FIG.\",\n \"2 is a schematic illustrating a quantum bus plane design according to an embodiment; FIG.\",\n \"3 is a schematic illustrating the readout plane in an inverted view according to an embodiment; FIG.\",\n \"4 is a schematic of an example qubit chip according to an embodiment.\",\n \"FIGS.\",\n \"5A through 5F illustrate an assembly and packaging technique for the modular array of vertically integrated superconducting qubit chips according to an embodiment, in which: FIG.\",\n \"5A is a schematic of an assembly illustrating assembly combs for a block; FIG.\",\n \"5B is a schematic of the assembly illustrating the assembly combs in place to form slots for orienting the superconducting qubit chips; FIG.\",\n \"5C is a schematic of the assembly illustrating the installation of the superconducting qubit chips in the slots formed by the assembly combs; FIG.\",\n \"5D is a schematic of the assembly illustrating installation of the readout plane in the block; FIG.\",\n \"5E is a schematic of the assembly illustrating a view underneath the block; FIG.\",\n \"5F is a schematic of the assembly illustrating that a pusher block applies pressure to hold the superconducting qubit chips in place; FIG.\",\n \"6 is a method of configuring an assembly according to an embodiment; and FIG.\",\n \"7 is a method of configuring an assembly according to an embodiment.\",\n \"DETAILED DESCRIPTION Superconducting Josephson-junction based qubits are promising candidates for fault-tolerant quantum computing.\",\n \"As a solid-state technology, it has always held the potential of simpler scalability via existing integration techniques.\",\n \"Superconducting circuit and device fabrication can leverage well-known lithographic methods which can lead to quantum integrated processors with a high density of qubits.\",\n \"Furthermore, superconducting qubits operate in the microwave frequency regime, allowing for all-electrical control of the qubits and other elements which might be in the system.\",\n \"The other elements may include microwave resonators, active filters, quantum-limited amplifiers, etc.\",\n \"A state-of-the-art fault-tolerant quantum computing architecture which has gathered interest recently is the surface code.\",\n \"In the surface code, qubits are arranged in a lattice with only the nearest neighbor interactions required.\",\n \"For superconducting qubits, the surface code is an attractive path forward as defining multiple qubits in a nearest-neighbor lattice.\",\n \"Moreover, the error thresholds which are required for the surface code are within reach for superconducting qubits with the current levels of coherence.\",\n \"One particular physical proposal in the state-of-the-art for realizing the surface code with superconducting qubits is the skew-symmetric layout.\",\n \"In this lattice, each superconducting qubit is coupled to two separate linking bus resonators.\",\n \"The coupling of superconducting qubits with microwave resonators is known as circuit quantum electrodynamics (cQED).\",\n \"The microwave resonators are typically defined as planar stripline resonators but can also be modes within three-dimensional (3D) waveguide cavities.\",\n \"Although it may appear simple to design a large lattice of many superconducting qubits and stripline resonators lithographically, getting every resonator mode and every qubit to work as desired together is a challenge.\",\n \"For example, crosstalk between resonators and superconducting qubits as well as undesired spurious modes can result in stray couplings between quantum objects.\",\n \"Crosstalk is defined here as any unwanted coupling of microwave signals between qubit or resonator channels, other than those desired and defined by wiring.\",\n \"Furthermore, although it may appear easy to optimize parameters for a single qubit and a single cavity mode, once these individual qubits are re-arranged in a larger network and all defined on the same chip, their (collective) behavior can change and can be difficult to then debug.\",\n \"According to embodiments discussed herein, a vertically integrated multi-chip architecture is provided, with discrete superconducting chip pieces comprised of superconducting qubits and their readout resonators.\",\n \"The superconducting qubits, along with their readout resonators, are then all arranged to mate in a matrix sandwiched by two larger carrier chips.\",\n \"These two larger carrier chips serve two purposes: one purpose is to integrate multiple resonator quantum buses to couple the superconducting qubits together (thereby coupling quantum information between qubits), and the other purpose permits physical connections via fan-out wiring to explicit microwave controls.\",\n \"This embodiment realizes a scalable architecture for quantum computation using well-established technology, while obviating challenging silicon integration techniques, such as thru-silicon-vias (TSVs) and multi-level lithography.\",\n \"There are two physically different methods for implementing superconducting quantum processors via the circuit quantum electrodynamics (cQED) architecture, which are a 2D planar lithographic method and a 3D waveguide cavity method.\",\n \"The quantum processor refers to the entirety of the assembled components.\",\n \"2D Planar Integration: The integration of qubits and resonators for 2D cQED is started via depositing superconducting films on silicon or sapphire substrates.\",\n \"Some typical superconducting films used are niobium (Nb), aluminum (Al), titanium nitride (TiN), and niobium nitride (NbN).\",\n \"Resonators (including readout resonators) are commonly defined in these superconducting films using coplanar waveguides, microstrips, coplanar striplines, or lumped element inductors and capacitors.\",\n \"Subsequently, superconducting qubits with Josephson junctions, such as the transmons, phase-qubits, or flux-qubits are also lithographically patterned via either electron-beam or optical lithography.\",\n \"Scaling up to larger quantum processors in this scheme requires a larger and larger chip to accommodate more resonators for coupling, more qubits, and more readout resonators.\",\n \"Using this 2D integration technique, processors up to 9 qubits have been devised in a linear chain, and 8 qubits in a latticed architecture.\",\n \"As the number of qubits in the 2D processor scales up, input-output (I/O) becomes increasingly challenging.\",\n \"In order to avoid crosstalk and integrate appropriate fan-out, technologies such as 3D integrated flip-chips, air-bridge crossovers, thru-silicon vias, and multi-layer lithography are required.\",\n \"As more and more of these different fabrication processes are required to scale up to larger quantum processors, the potential influence and degradation on the superconducting qubits increases rapidly.\",\n \"Therefore using these advanced fabrication techniques can lead to many different sources of decoherence in the qubits.\",\n \"For some of these processes, it could be necessary to perform them after Josephson junctions are lithographically defined.\",\n \"The impact and losses on Josephson junction based superconducting qubits after these processing steps are then a particular concern as to whether high coherence can continue to be preserved.\",\n \"Accordingly, this makes full-scale integration of a large system having a large number of qubits challenging.\",\n \"Embodiments include various features: 1) An array of vertical superconducting qubit chips is mounted to a silicon quantum bus plane and mounted to a separate qubit addressing and readout plane.\",\n \"2) A quantum bus (QB) plane lithographically is defined on silicon which permits the coupling of quantum information among individual vertical superconducting qubit chips.\",\n \"3) A readout (RO) plane couples each superconducting qubit chip's readout resonator to an integrated microwave bandwidth transmission line which follows onto a flexible circuit board thus connecting each superconducting qubit chip's readout resonator a coaxial connector for input/output (I/O).\",\n \"4) Vertical superconducting qubit chips each contain a single superconducting qubit (also referred to as a tunnel junction, such as a Josephson junction) and on-chip readout resonator, designed in a way to effectively couple to the quantum bus plane and the readout plane.\",\n \"Each individual vertical superconducting qubit chip is designed to have a specific lithographically-defined coupling capacitance between the tunnel junction to the quantum bus plane on one end and between the readout resonator and the addressing transmission line of the readout plane on the other end.\",\n \"5) All silicon elements are retained within a well-thermalized metal housing (e.g., copper) which provides mechanical support, alignment, and thermal contact.\",\n \"According to embodiments, the technique discussed herein is an approach for assembling the modular array of superconducting qubit chips into a scalable quantum processor, commensurate with latticed architectures for quantum error correction, such as the surface code.\",\n \"Now turning to the figures, FIG.\",\n \"1 is a schematic illustrating a transparent view of part of the modular array of vertically integrated superconducting qubit devices according to an embodiment.\",\n \"FIG.\",\n \"1 shows a quantum bus plane 100, a readout plane 102, and superconducting vertical qubit chips 101.The superconducting vertical qubit chips 101 are also referred to as qubit dies, qubits, etc.\",\n \"The readout plane 102 and the quantum bus plane 100 sandwich the qubit chips 101 in between.\",\n \"FIG.\",\n \"2 is a schematic illustrating a quantum bus plane design of the quantum bus plane 100 according to an embodiment.\",\n \"The quantum bus plane design illustrates a surface code example.\",\n \"The quantum bus plane 100 may be made of a semiconductor material as the substrate, such as, e.g., silicon, sapphire, etc.\",\n \"The semiconductor material has interconnect wiring 202 deposited on top of the semiconductor material.\",\n \"The interconnect wiring 202 is made of a superconducting material.\",\n \"Superconducting material may be defined as a material that can conduct electricity or transport electrons from one atom to another with no resistance when the superconducting material has reached “critical temperature” (Tc), or the temperature at which the material becomes superconductive.\",\n \"Conducting electricity or transporting electrons from one atom to another with no resistance means that no heat, sound, or any other form of energy would be released from the material as understood by one skilled in the art.\",\n \"The quantum bus plane 100 connects each individual qubit chip 101 via interconnect wiring 202.The interconnect wiring 202 connects (e.g., capacitively) to each superconducting qubit chip 101 installed in the quantum bus plane 100.The interconnect wiring 202 includes coupling bus resonators 205 positioned between each superconducting vertical qubit chip 101.Particularly, superconducting vertical qubit chips 101 are configured to couple together through the coupling bus resonators 205.To assist with securing and positioning superconducting vertical qubit chips 101 on the quantum bus plane 100, the quantum bus plane 100 includes etched recesses 201 at the locations to insert each of the superconducting vertical qubit chips 101.The etched recesses 201 are pockets that individually fit the superconducting vertical qubit chips 101 into specific locations in the quantum bus plane 100.The etched recesses 201 in the quantum bus plane 100 help to define accurate capacitive coupling between the qubit chips 101 and the interconnect wiring 202.The etched recesses 201 determine how deeply the vertical qubit chips 101 sit into the quantum buss plane 100 and thus determine the vertical separation between the capacitor pads on the qubit chip 101 and those on the quantum buss plane 100.The etched recesses 201 are etched into the semiconductor substrate of the quantum bus plane 100.Accurate vertical separation of these coupling pads is a prerequisite for achieving a precise coupling capacitance value.\",\n \"The coupling capacitor pad 404 is shown in FIG.\",\n \"4 and the quantum bus plane 100 has coupling pad 250 in front of each etched recess 201.For the sake of clarity and so as not to obscure FIG.\",\n \"2, only two superconducting vertical qubit chips 101 are shown in FIG.\",\n \"2 although it is understood that each row, e.g., rows 1-4, are filled with superconducting vertical qubit chips 101.One superconducting vertical qubit chip 101 is shown as a code superconducting vertical qubit chip in row 1, and the other superconducting vertical qubit chip 101 is a syndrome superconducting vertical qubit chip in row 2.In one implementation, each row may be filled with the same type of superconducting vertical qubit chip 101.For example, row 1 may be filled with code superconducting vertical qubit chips 101, while row 2 is filled with syndrome superconducting vertical qubit chips 101.Row 3 may be filled with code superconducting vertical qubit chips 101, while row 4 is filled with syndrome superconducting vertical qubit chips 101.Although only 4 rows are shown for the sake of illustration, it is contemplated that M numerous rows may be included on the quantum bus plane 100, where M is the last row.\",\n \"A code qubit stores quantum information for operation of the quantum processor.\",\n \"A syndrome qubit measures and extracts any errors in the system without corrupting the information present in the code qubit.\",\n \"These terms are commonly applied when discussing “surface code error correction.” According to an embodiment, FIG.\",\n \"3 is a schematic illustrating the readout plane 102 in an inverted view.\",\n \"FIG.\",\n \"3 shows the backside of the readout plane 102, and the backside faces the quantum bus plane 100 (not shown in FIG.\",\n \"3).\",\n \"The readout plane 102 may be made of a semiconductor material as the substrate, such as, e.g., silicon, sapphire, etc.\",\n \"The semiconductor material has fan-out wiring 302 deposited on top of the semiconductor material.\",\n \"The fan-out wiring 302 may be made of a superconducting material.\",\n \"The readout plane 102 includes etched recesses 301 at locations to insert each of the superconducting vertical qubit chips 101.Each etched recess 301 is a pocket that individually fits a single superconducting vertical qubit chip 101 into a specific location in the readout plane 102, analogous to the etched recesses 201 in the quantum bus plane 100 in FIG.\",\n \"2.The etched recesses 301 in the readout plane 102 capacitively connect the superconducting vertical qubit chips 101 to the fan-out wiring 302 via the capacitor pads defined on the upper end of the vertical qubit chip 101 and on the readout plane 102.At the upper end, the vertical qubit chip 101 has coupling capacitor pad 401 as shown in FIG.\",\n \"4, while the readout plane 102 has a coupling pad 350 in front of each etched recesses 301.The fan-out wiring 302 has transmission lines 320.Each transmission line 320 individually connects to a single superconducting vertical qubit chip 101 in a one-to-one relationship.\",\n \"The etched recesses 301 serve both a mechanical purpose and an electrical purpose.\",\n \"Mechanically, the etched recesses 301 serve as a slot/pocket to insert each superconducting vertical qubit chip 101.Electrically, the etched recesses 301 align each superconducting vertical qubit chip 101 to an individual transmission line 320 of the fan-out wiring 302.The fan-out wiring 302 individually couples to each superconducting vertical qubit chip 101.Also, the fan-out wiring 302 individually connects each superconducting vertical qubit chip 101 to a flexible circuit board 303.The fan-out wiring 302 does not affect quantum information on the superconducting vertical qubit chips 101.The fan-out wiring 302 connects the superconducting vertical qubit chips 101 to the outside environment (e.g., the 50 ohm (Ω) environment).\",\n \"The flexible circuit board 303 individually connects each superconducting vertical qubit chip 101 to an individual connector 304 via the fan-out wiring 302.Although the flexible circuit board 303 is shown as one implementation, it is contemplated that other type of circuit boards or electrical connections may be utilized.\",\n \"The connectors 304 individually connect the superconducting vertical qubit chips 101 to external electronics (not shown).\",\n \"The connectors 304 may be microwave connectors in which microwave signals may be input and qubit states can be read.\",\n \"Each connector 304 has a one-to-one relationship to a single superconducting vertical qubit chip 101 on the readout plane 102, such that each superconducting vertical qubit chip 101 is individually addressable through a single connector 304, through the flexible circuit board 303, through the fan-out wiring 302, a particular transmission line 320, and through an individual etched recess 301.In one implementation, the connectors 304 may coaxial cable connectors configured to connect to coaxial cables.\",\n \"Although not shown so as not to obscure FIG.\",\n \"3, it is understood that conductive wiring runs through the flexible circuit board 303 and that wiring connects the flexible circuit board 303 to each respective connector 304 as understood by one skilled in the art.\",\n \"The conductive wiring of the flexible circuit board 303 may be made of superconducting or normal material.\",\n \"FIG.\",\n \"4 is a schematic of an example superconducting vertical qubit chip 101 according to an embodiment.\",\n \"Various details of the superconducting vertical qubit chips 101 are shown in FIG.\",\n \"4.The superconducting vertical qubit chips 101 may have a substrate made of a semiconductor material, such as, e.g., silicon, sapphire, etc.\",\n \"Each qubit chip 101 is an integrated circuit.\",\n \"Conductive material is deposited and patterned on the substrate of the superconducting vertical qubit chips 101 to form the integrated circuit.\",\n \"The superconducting vertical qubit chips 101 are not a monolithic wafer.\",\n \"Rather, the superconducting vertical qubit chips 101 are formed from a wafer (substrate) diced into individual qubit dies.\",\n \"Each diced superconducting vertical qubit chip 101 includes a coupling capacitor pad 401.The coupling capacitor pad 401 is a capacitor that capacitively couples each superconducting vertical qubit chip 101 to the readout plane 102 via the fan-out wiring 302, when the superconducting vertical qubit chip 101 is inserted in its etched recess 201.Accordingly, on one end of the superconducting vertical qubit chip 101, that end is electrically connected to the readout plane 102 through the coupling capacitor pad 401 and coupling pad 350 on the readout plane 102.It is noted that, for coupling capacitor pads 401 and 350 and coupling capacitor pads 404 and 250, the coupling capacitors may be defined by metal pads that are at right angles to each other, with a well-defined vertical separation.\",\n \"The two types of coupling capacitors are quantum buss plane to lower side of qubit chip, and upper side of vertical qubit chip to readout plane.\",\n \"It should be understood that two metal surfaces (pads in this case) at right angles to each other, separated by some distance, define a capacitor.\",\n \"Embodiments exploit this fact to permit accurate coupling between circuit elements without resorting to wire bonds across right angle connections.\",\n \"Additionally, each superconducting vertical qubit chip 101 includes coupling capacitor pads 404.The coupling capacitor pads 404 form a capacitor, and between the two coupling capacitor pads 404 is a tunnel junction 403 (sometimes called the qubit), such as, e.g., a Josephson junction.\",\n \"The coupling capacitor pads 404 form a capacitor that capacitively couples to the quantum bus plane 100 via the interconnecting wiring 202.Accordingly, on the opposite end to the coupling capacitor pad 401, the opposite end is electrically connected to the quantum bus plane 100 through the coupling capacitor pads 404.The superconducting vertical qubit chip 101 includes readout resonator 402.The readout resonator 402 is configured with a resonance frequency designed to read the state of the qubit tunnel junction 403.The readout resonator 402 is positioned between the coupling capacitor pad 401 and the coupling capacitor pads 404.The readout resonator 402 is formed of conductive material that connects the coupling capacitor pad 401 and the coupling capacitor pads 404.The conductive material is a superconducting material, which forms the circuit.\",\n \"The superconducting vertical qubit chip 101 includes a ground plane 405 surrounding the circuit of the coupling capacitor pad 401, the coupling capacitor pads 404, and the readout resonator 402.The material of the substrate separates the ground plane 405 from the circuit.\",\n \"According to an embodiment, an assembly and packaging technique for the modular array of vertically integrated superconducting qubit chips 101 is discussed below in FIGS.\",\n \"5A, 5B, 5C, 5D, 5E, and 5F.\",\n \"FIG.\",\n \"5A illustrates part of an assembly 500.The assembly 500 has a copper block 502.The copper block 502 includes a readout plane slot 503.The readout plane 102 is to be inserted into the readout plane slot 503 as discussed further below.\",\n \"Although a copper block 502 is illustrated, the block 502 may be made of other materials.\",\n \"The block 502 can be constructed of a variety of materials provided they give high thermal conductivity.\",\n \"Examples other than copper include brass, sapphire, silicon, silver, aluminum, and/or niobium.\",\n \"Assembly combs 520A and 520B are utilized to orient alignment of the superconducting vertical qubit chips 101 for assembly with the readout plane 102 (in the etched recesses 201) and quantum bus plane 100 (in the etched recesses 301) within the copper block 502.Both assembly combs 520A and 520B have teeth with predefined spacing.\",\n \"For example, the assembly comb 520A has teeth 525A and the assembly comb 520B has teeth 525B.\",\n \"In one implementation, the spacing of the teeth 525A is larger than the spacing of the teeth 525B, and the spacing of the teeth 525A and 525B is based on accommodating the cross-section size of the superconducting vertical qubit chips 101.The copper block 502 includes assembly slots 501A and 501B.\",\n \"The assembly comb 520A is inserted into the assembly slot 501A, and the assembly comb 520B is inserted into the assembly slot 501B.\",\n \"One assembly slot is positioned higher than the other assembly slot such that the assembly combs 520A and 520B define the desired alignment slots where they cross over and under each other but do not interfere with each other when inserted into their respective assembly slots 501A and 501B.\",\n \"FIG.\",\n \"5B is a schematic of the assembly 500 showing the assembly combs 520A and 520B in place within the copper block 502 according to an embodiment.\",\n \"Slots 525 are formed by the intersection of the assembly combs 520A and 520B while in the copper block 502.The slots 525 are utilized to orient the superconducting vertical qubit chip 101.In particular, the slots 525 are formed by the spacing of the teeth 525A and 525B such that the slots 525 can accommodate the size of the superconducting vertical qubit chips 101.In one implementation, the spacing of the slots 525 may be about 5 millimeters (mm) in the x-axis and may be about 5 mm in the y-axis.\",\n \"In one implementation, each superconducting vertical qubit chip 101 may have approximate dimensions of 8 mm tall by 2 mm wide by 0.7 mm thick.\",\n \"Also, to accommodate the size of the superconducting vertical qubit chips 101, the etched recesses 201 and 301 may be about 0.7 mm in the x-axis and about 2 mm in the y-axis.\",\n \"The etched recessed 201 and 301 may have a depth of about 0.35 mm in the z-axis.\",\n \"FIG.\",\n \"5C is a schematic of the assembly 500 showing an abbreviated view inside the copper block 502 (not shown) which is part of a housing 550 (shown in FIG.\",\n \"5F) according to an embodiment.\",\n \"In FIG.\",\n \"5C, the abbreviated view omits certain elements in order to simplify the assembly 500 for better understanding.\",\n \"The walls of the housing copper block 502 are removed, and only a copper base 530 of the housing 550 is shown.\",\n \"The quantum bus plane 100 is attached to and/or positioned on the copper base 530.The intersecting assembly combs 520A and 520B are in place (within the copper block 502) forming the slots 525.Aligned through the slots 525, a few example superconducting vertical qubit chips 101 are installed into (the etched recesses 201 in) the quantum bus plane 100.The slots 525 directly align to individual etched recesses 201 below and provide a guide during installation of the superconducting vertical qubit chips 101.FIG.\",\n \"5D is a schematic of the assembly 500 showing a transparent view into the copper block 502 according to an embodiment.\",\n \"FIG.\",\n \"5D shows the readout plane 102 installed into the copper block 502 and extending outside of the copper block 502 through readout plane housing slot 585.In one implementation, the quantum bus plane 100 fits into the bottom of the copper block 502.In another implementation, the copper block 502 may sit on top of the quantum bus plane 100.The superconducting vertical qubit chips 101 are sandwiched between the readout plane 102 and the quantum bus plane 100, and the ends of the superconducting vertical qubit chips 101 fit into the etched recesses 201 and 301 of the quantum bus plane 100 and readout plane 102, respectively.\",\n \"For simplicity and ease of understanding, only a few superconducting vertical qubit chips 101 are shown in FIG.\",\n \"5D.\",\n \"Also, so as not to obscure FIG.\",\n \"5D, the assembly combs 520A and 520B are not shown in this figure.\",\n \"A board clamp 555 holds and attaches to portion of the readout plane 102 extending outside of the housing.\",\n \"The board clamp 555 holds and attaches the readout plane 102 to the flexible circuit board 303.Outside of the housing 550, the connectors 304 are on a rigid circuit board 330 and connected to the flexible circuit board 303.The circuit board 330 comprises circuits (not shown) individually connecting each connector 304 to an individual circuit within the flexible circuit board 303, as understood by one skilled in the art.\",\n \"FIG.\",\n \"5E is a schematic of the assembly 500 showing a view underneath the housing 500 according to an embodiment.\",\n \"The copper base 530 of the housing is removed.\",\n \"FIG.\",\n \"5E allows the bottom of the quantum bus plane 100 to be viewed.\",\n \"FIG.\",\n \"5E also shows that wire bonds 578 connect the readout plane 102 to the board clamp 555.These wire bonds 578 create an electrical connection between the fan-out wiring 302 on the readout plane 102 and the conductors (of whatever type) on the flexible circuit board 303.Although it possible to mechanically bond the flexible circuit board 303 directly to the silicon readout plane 102, those two items, however, have extremely different thermal expansion coefficients which may cause the connections to break over time.\",\n \"Wire bonds 578 being flexible permit long-term reliability over many thermal cycles.\",\n \"In one implementation, the two readout planes are to be made of the same material so any dimensional changes from thermal expansion are the same for both planes.\",\n \"FIG.\",\n \"5F is a schematic of the assembly 500 according to an embodiment.\",\n \"FIG.\",\n \"5F shows that a pusher block 570 pushes the readout plane 102 firmly against the superconducting vertical qubit chips 101.The pusher block 570 is spring loaded.\",\n \"The constant pressure of the pusher block 570 ensures that the superconducting vertical qubit chips 101 stay in the etched recesses 201 and 301.The force of the pusher block 570 is caused by a spring mechanism 575 attached to a top cap 582 of the housing 550.As can be seen in FIG.\",\n \"5F, the housing 550 is an enclosure.\",\n \"The housing 550 may be made of copper, silver, brass, silicon, sapphire, aluminum, and/or niobium.\",\n \"The housing 550 includes the copper block 502, the copper base 530, the pusher block 570, and the top cap 582.In one implementation, the assembly combs 520A and 520B may remain in the copper block 502 after the superconducting vertical qubit chips 101 have been installed (i.e., inserted into the etched recesses 201 and 301 of the quantum bus and readout planes 100 and 102, respectively).\",\n \"In another implementation, the assembly combs 520A and 520B may be removed from the copper block 502 after installing the superconducting vertical qubit chips 101, such that the assembly combs 520A and 520B are not in the housing 550.For ease of understanding, sub-headings are provided below.\",\n \"The sub-headings are meant for explanation purposes and not limitation.\",\n \"Standardized Fabrication of Elements: Each of the discussed silicon elements, such as, e.g., the quantum bus plane 100, superconducting vertical qubit chips 101, and readout plane 102, use well-established lithographic technology that is time tested in the superconducting qubit community and thus understood by one skilled in the art.\",\n \"In one embodiment, the materials are standardized to niobium for the resonator and transmission line elements; the materials are aluminum and native aluminum oxide for the qubit junction fabrication (i.e., the qubit tunnel junction 403) via standard double-angle evaporation.\",\n \"All lithography may be performed on high-resistivity silicon wafers with established loss parameters appropriate for qubit technology, as understood by one skilled in the art.\",\n \"The readout resonator 402 is in on the vertical qubit chip 101, and transmission line elements are any other wiring on the quantum buss plane 100, the qubit chip 101, and the readout plane 102.In one implementation, the readout resonators 402 may be of a different material than the wiring.\",\n \"In another implementation, the readout resonators 402 and wiring may be fabricated from a variety of all the same materials.\",\n \"In yet another implementation, the readout resonators 402 and various different portions of the wiring may be fabricated from a variety of different materials for each sub-category of function.\",\n \"Complete assembly of a scalable quantum processor with N qubits (i.e., N qubit chips 101) is achieved without resorting to any multi-level lithography, inserted ground planes, cross-overs, or thru-silicon-vias (TSVs).\",\n \"Using current standard lithographic techniques, embodiments allow the straightforward integration of N=100 to 1000 superconducting vertical qubit chips 101, taking up a space roughly the size of a deck of playing cards (e.g., 2.5×3.5 inches or 64×89 mm).\",\n \"Design of Individual Qubit Chips and Coupling Capacitance Choices: From electromagnetic simulations for reasonable parameters of qubit tunnel junctions 403, readout resonators 402, and quantum bus planes 100, it is possible to achieve the desired precise coupling capacitance values with the geometry described herein.\",\n \"Each individual superconducting vertical qubit chip 101 contains a capacitor (i.e., coupling capacitor 404) that couples signal to the quantum bus traces (i.e., interconnect wiring 202) on the quantum bus plane 100.The capacitor (coupling capacitor 404) provides coupling that is appropriate for a specific universal two-qubit entangling gate.\",\n \"The capacitor is formed by an electrode on the lower end of the vertical qubit chip 101 which couples to electrodes on the quantum buss plane 100.The approximate range in this implementation for the capacitor value is around 7 to 5 femto Farads.\",\n \"The interconnection between the superconducting vertical qubit chip 101 and the etched recesses 201 (pocket) in the quantum bus plane 100 is designed to minimize stray coupling between the qubit signals and ground plane 405.On the other end of the superconducting vertical qubit chip 101, the interconnection with the readout plane 102 creates a specific capacitance between the readout resonator 402 and the control transmission line 320 (of the fan-out wiring 302) such that the readout resonator 402 has a well-defined quality factor and permits a high fidelity readout.\",\n \"This capacitor (i.e., coupling capacitor pad 401) is formed by an electrode on the superconducting vertical qubit chip 101 (qubit die) which couples to an electrode (a portion of the control transmission line 320) on the readout plane 102.The approximate value of this capacitor in this implementation is around 5 to 7 femto Farads, for example.\",\n \"Each superconducting vertical qubit chip 101 is metalized on the backside with superconductor material to control stray coupling and other electric fields within the processor housing 550.The backside of the superconducting vertical qubit chip 101 is opposite the circuit of the coupling capacitor pad 401, the coupling capacitor pads 404, and the readout resonator 402 on the front side.\",\n \"Note that all capacitor values and uncertainty are determined by lithographic feature sizes and depth of etches.\",\n \"These values are easily changed and provide for sufficient accuracy for the circuit tolerances required for embodiments.\",\n \"Design of Quantum Bus Plane: The fabrication process of the quantum bus plane 100 can begin with standard 2D integration techniques.\",\n \"In one implementation, niobium is electro-sputtered onto a silicon substrate 590.Multiple masks, having the quantum bus designs and having the etched recesses 201 (pockets) where qubit chips 101 are to be mounted, may be used for reactive ion etching (RIE) of the niobium.\",\n \"The quantum bus design mask defines the coupling bus resonators 205 which couple quantum information among the superconducting vertical qubit chips 101.The pocket mask (for making the etched recesses 201) defines the locations to etch down into the silicon for the individual superconducting vertical qubit chips 101 to be mounted.\",\n \"The process for the pocket mask etch may be similar to most 3D integration schemes, except in this case the sputtered niobium is used as a hardmask to first define the pockets (i.e., etched recesses 201).\",\n \"Definition of the pocket (i.e., etched recess 201) in the silicon substrate 590 can be achieved using a deep silicon dry etch process, reactive ion etching (RIE), or a wet chemistry (tetramethyl ammonium hydroxide (TMAH)).\",\n \"The pockets (i.e., etched recesses 201) of the quantum bus plane 100 are arranged in a grid structure where successive rows are offset, one corresponding to superconducting vertical code qubit chips, and the other row corresponding to superconducting vertical syndrome qubits chips 101 for error detection via measurement.\",\n \"Each qubit chip pocket (i.e., etched recess 201) is arranged to couple to two coupling bus resonators 205 defined on the quantum bus plane 100 in one implementation.\",\n \"Note that this arrangement is not the only way to realize the surface code, as one can also couple either three or four coupling bus resonators 205 to a single superconducting vertical qubit chip 101 in another implementation.\",\n \"Location accuracy of the qubit chip pockets (etched recesses 201 (including etched recesses 301 in readout plane 102) is determined by the lithography and depth accuracy as determined by the etch time.\",\n \"The pockets are formed with a chamfered or bell-mouthed opening to allow easy insertion of each superconducting vertical qubit chip 101 (qubit die).\",\n \"Depending on results from scaling to larger N (i.e., a larger amount of superconducting vertical qubit chips 101), the quantum bus plane 100 may be admissible to more integration techniques such as TSVs for chip-mode reduction.\",\n \"The nuance here is that no Josephson junctions (qubits) 403 need to be defined in this quantum bus plane 100, so there would be minimal effect on qubit coherence with further integration of the quantum bus plane 100.Design of Readout Plane: The readout plane 102 starts off similar to the quantum bus plane 100, with niobium conductors etched lithographically on a silicon substrate 595.Co-planar transmission lines 320 are patterned on the readout plane 102 in a fan-out configuration (i.e., fan-out wiring 302) so as to bring external signals into and out of each superconducting vertical qubit chip 101.These transmission lines 320 are defined in a coplanar waveguide, and support 50Ω microwave driving of both readout and qubit control signals.\",\n \"All these transmission lines 320 meander through the readout plane 102 terminating on one edge in wire bond pads 370.The wire bond pads 370 are on the extreme right end of the fan-out wiring 302.Similar to the quantum bus plane, pockets (i.e., etched recesses 301) in the readout plane 102 are likewise defined via deep etching into the silicon substrate 595 of the readout plane 102, in corresponding locations as the etched recesses 201 in the quantum bus plane 100 so as to accept the mounting of the individual superconducting vertical qubit chips 101.These pockets (i.e., etched recesses 301) may be chamfered or otherwise bell-mouthed for ease of assembly and locating of structure.\",\n \"The microwave signals for control and readout are carried off the readout plane 102 via wire bonds 578 to the flexible circuit board 303 which conducts to other transmission lines embedded in a separate rigid circuit board 330 populated with connectors 304 leading to external components.\",\n \"Ground Planes in Quantum Bus Plane and Readout Plane Pockets: After etching qubit chip pockets (etched recesses 201, 301) in both the quantum bus and readout planes 100 and 102 respectively, these pockets (etched recesses 201, 301) are coated with niobium via sputtering to form continuous ground plane.\",\n \"These ground planes are designed to mate to the ground planes 405 that exist on the extreme ends of each superconducting vertical qubit chip 101 to form a continuous electrostatic ground between the quantum bus and readout planes 100 and 102, respectively; the continuous electrostatic ground between the quantum bus and readout planes 100 and 102 (respectively) serves to (1) further isolate each qubit site (i.e., locations of etched recesses 201, 301) from spurious modes, (2) isolate each qubit site (i.e., locations of etched recesses 201, 301) from adjacent qubit superconducting vertical qubit chips 101, and (3) eliminate unwanted cross-talk coupling between superconducting vertical qubit chips 101.Assembly of Modular Array Elements: 1.Each individual superconducting vertical qubit chip 101 is located by an etched recess 201 formed in the quantum bus plane 100 and an etched recess 301 formed the readout plane 102.In one implementation, the etched recesses 201, 301 are accurately formed in the silicon substrates 590, 595 using a standard wet etch process.\",\n \"2.Each individual superconducting vertical qubit chip 101 is chosen for desirable electrical characteristics such as transition frequency.\",\n \"In some cases the syndrome qubits might be more strongly coupled to the readout wiring to enhance signal-to-noise.\",\n \"This would reduce coherence times on the syndrome qubits which does not in any way degrade the quantum information in the code qubits.\",\n \"3.A pair of crossed assembly combs 520A and 520B is mounted to the outer housing of the copper block 502 in order to temporarily provide alignment for the superconducting vertical qubit chips 101 (as shown in FIG.\",\n \"5A).\",\n \"The assembly combs 520A and 520B create a series of alignment slots 525 (as shown in FIG.\",\n \"5B) to orient the superconducting vertical qubit chips 101 which are inserted vertically from above.\",\n \"The superconducting vertical qubit chips 101 key into the etched recesses 201 in the quantum bus plane 100 (as shown in 5C) and are thereby (automatically) oriented to key into the corresponding etched recesses 301 in the readout plane 102 (as shown in FIG.\",\n \"5D).\",\n \"The readout plane 102 is inserted from the side via readout plane slot 503.FIG.\",\n \"5E depicts the assembly 500 from below and shows the assembled components with the assembly combs 520A and 520B omitted.\",\n \"Once assembled, the vertical organization of the superconducting vertical qubit chips 101 constrained (and sandwiched) between the two silicon quantum bus and readout planes 100 and 102 (respectively) is maintained with pressure applied by the pusher block 570.The pusher block 570 is spring-loaded from above via the springs 575 pressed down by the top cap 582 (as shown in FIG.\",\n \"5F).\",\n \"Expandable, Scalable and Replaceable Array: The figures associated with embodiments show a fourteen qubit chip array but the number of superconducting vertical qubit chips 101 can be expanded to any arbitrary number (N).\",\n \"All that is required is that the quantum bus plane 100 should be enlarged and the niobium wiring be replicated at all qubit sites (i.e., locations at the etched recesses 201 to accommodate superconducting vertical qubit chips 101) as needed.\",\n \"The readout plane 102 can support many signal transmission lines 320 interleaved between each qubit site (i.e., locations at the etched recesses 301 to accommodate superconducting vertical qubit chips 101) to bring the signals to one edge and may require integration of dielectric cross-overs to reduce crosstalk if desired.\",\n \"Moreover, the further integration of the readout plane 102 and quantum bus planes 100 is a minimal issue as it will neither directly affect the qubit chip fabrication process nor the qubit coherence performance.\",\n \"According to embodiments, the assembly 500 includes the desirable feature that each superconducting vertical qubit chip 101 may be hand-selected for the correct electrical characteristics; any member of the array of superconducting vertical qubit chips 101 may be individually replaced at any time if the qubit chip's performance degrades for any reason during operation.\",\n \"Replacement of the superconducting vertical qubit chip 101 can be accomplished without removing wire bonds 578 and/or without having to unsolder any components.\",\n \"Embodiments provide a clear separation of fabrication processing steps and avoid the need for all N qubit and circuit parameters to meet specification on a single superconducting vertical qubit chip 101.Qubit chips 101 from multiple different fabrication runs can be combined in this type of quantum processor so that parameters such as transition frequency may be easily tailored without having to achieve a full range of accurate parameters on one silicon wafer in just one fabrication run.\",\n \"Individual qubit chips 101 may be chosen from various different fabrication runs (wafers) and combined in the processor assembly.\",\n \"As understood by one skilled in the art, microwave signals are applied to the qubit chip 101 via the readout lines to excite it into a defined state.\",\n \"After some later time the state of the qubits can be then read out by interrogating them at some other microwave frequency, again via the readout lines.\",\n \"FIG.\",\n \"6 is a method 600 of configuring an assembly 500 for a quantum computing device according to an embodiment.\",\n \"Reference can be made to the figures discussed herein.\",\n \"At block 605, the quantum bus plane 100 having a first set of recesses 201 are provided, as depicted in FIG.\",\n \"2.At block 610, the quantum bus plane 100 is positioned in the block 502, on top of the copper base 530, as seen in FIG.\",\n \"5D.\",\n \"The alignment combs 520A and 520B are installed in the copper block 502 and fixed in place, creating a series of precisely aligned slots 535 to accept the qubit chips 101, as seen in FIG.\",\n \"5B.\",\n \"At block 615, a plurality of superconducting vertical qubit chips 101 are placed/installed in the block 502, each of the plurality of qubit chips 101 has a first end positioned in the first set of recesses 201 (as shown in FIG.\",\n \"5C).\",\n \"The plurality of qubit chips 101 extend vertically in a lengthwise direction by being positioned in the first set of recesses 201 and in the slots 525 created by the alignment combs.\",\n \"The set of recesses 201 holds the lower end of the plurality of qubit chips 101 in the quantum bus plane 100.The first end of the plurality of qubit chips 101 is opposite the second end.\",\n \"At block 620, the readout plane 102 with its recesses 301 is then installed into the copper block 502 such that the recesses 301 in the readout plane 102 are positioned to accept the upper end (i.e., second end) of the plurality of all the qubit chips 101 which have been aligned by the slots 525 created by both alignment combs 520A, 520B.\",\n \"The readout plane 102 thus drops down over the ends of the qubit dies 101 a distance equal to the depth of the recesses in the readout plane 301 and the precise mechanical alignment of all the electrical circuit elements is achieved in all three axes simultaneously.\",\n \"At this point the alignment combs 520A and 520B may either be left in place or may be removed.\",\n \"The quantum bus plane 100 comprises a substrate 590 with interconnect wiring 202 on top of the substrate 590, and the interconnect wiring 202 connects the plurality of qubit chips 101 via a plurality of coupling bus resonators 205.The readout plane 102 comprises a substrate 595 with fan-out wiring 302 on top of the substrate 595, and the fan-out wiring 302 individually connects each of the plurality of qubit chips 101 to a circuit board 330.The circuit board 330 individually connects each of the plurality of qubit chips 101 to a plurality of connectors 304 in a one-to-one relationship.\",\n \"The block 502 is configured to receive a first assembly comb 520A and a second assembly comb 520B to form an intersection, and the intersection of the first and second assembly combs 520A, 520B form a plurality of slots 525 for individually accepting the plurality of qubit chips 101.The plurality of slots 525 mechanically holds the plurality of qubit chips 101 in a vertical position.\",\n \"FIG.\",\n \"7 is a method 700 of configuring an assembly 500 for a quantum computing device according to an embodiment.\",\n \"Reference can be made to the figures discussed herein.\",\n \"At block 705, the following parts are assembled: copper base 530 and copper block 502.At block 710 the quantum buss plane 100 is installed into the copper block 502 such that the quantum buss plane 100 rests on top of the copper base 530, and the quantum bus plane 100 has a set of recesses 201 (the readout plane 102 has a different set of recesses 301).\",\n \"Then, the assembly combs 520A and 520B are installed and fixed into the copper block 502 thereby creating alignment slots 525.At block 715, a plurality of qubit chips 101 are installed in the block 502, where each of the plurality of qubit chips 101 has a first end positioned in the first set of recesses 201 using the alignment slots 525 created by the assembly combs 520A, 520B to guide the qubit chips 101 into the correct locations.\",\n \"The housing 550 includes a readout plane housing slot 585.At block 720, the readout plane 102 is installed into the slot 585 and the recesses 301 in the readout plane 102 accept the upper ends (i.e., second end) of the plurality of all the qubit chips 101 which have been put in the correct locations by the alignment combs 520A, 520B such that the readout plane 102 drops over all of them (qubit chips 101) simultaneously.\",\n \"The bell-mouthed nature of the recesses 301 in the readout plane 102 assists in the final locating of the ends of the qubit dies 101 into the recesses 301.The readout plane 102 extends through the readout plane housing slot 585 to connect to the circuit board 330, and the circuit board 330 connects to a plurality of connectors 304.The housing 550 includes a pushing mechanism configured to apply pressure to the readout plane 102, and the pressure applied to the readout plane 102 forces the plurality of qubit chips 101 to the quantum bus plane 100.The pushing mechanism comprises: a pusher block 570 positioned on top of the readout plane 102, and a spring mechanism 575 pressing downward against the pusher block 570.The top part (top cap 582) of the housing 550 applying a compression force to the spring mechanism 575 from above.\",\n \"It will be noted that various microelectronic device fabrication methods may be utilized to fabricate the components/elements discussed herein as understood by one skilled in the art.\",\n \"In semiconductor device fabrication, the various processing steps fall into four general categories: deposition, removal, patterning, and modification of electrical properties.\",\n \"Deposition is any process that grows, coats, or otherwise transfers a material onto the wafer.\",\n \"Available technologies include physical vapor deposition (PVD), chemical vapor deposition (CVD), electrochemical deposition (ECD), molecular beam epitaxy (MBE) and more recently, atomic layer deposition (ALD) among others.\",\n \"Removal is any process that removes material from the wafer: examples include etch processes (either wet or dry), and chemical-mechanical planarization (CMP), etc.\",\n \"Patterning is the shaping or altering of deposited materials, and is generally referred to as lithography.\",\n \"For example, in conventional lithography, the wafer is coated with a chemical called a photoresist; then, a machine called a stepper focuses, aligns, and moves a mask, exposing select portions of the wafer below to short wavelength light; the exposed regions are washed away by a developer solution.\",\n \"After etching or other processing, the remaining photoresist is removed.\",\n \"Patterning also includes electron-beam lithography.\",\n \"Modification of electrical properties may include doping, such as doping transistor sources and drains, generally by diffusion and/or by ion implantation.\",\n \"These doping processes are followed by furnace annealing or by rapid thermal annealing (RTA).\",\n \"Annealing serves to activate the implanted dopants.\",\n \"The flowchart and block diagrams in the Figures illustrate the architecture, functionality, and operation of possible implementations of systems, methods, and computer program products according to various embodiments of the present invention.\",\n \"In this regard, each block in the flowchart or block diagrams may represent a module, segment, or portion of instructions, which comprises one or more executable instructions for implementing the specified logical function(s).\",\n \"In some alternative implementations, the functions noted in the block may occur out of the order noted in the figures.\",\n \"For example, two blocks shown in succession may, in fact, be executed substantially concurrently, or the blocks may sometimes be executed in the reverse order, depending upon the functionality involved.\",\n \"It will also be noted that each block of the block diagrams and/or flowchart illustration, and combinations of blocks in the block diagrams and/or flowchart illustration, can be implemented by special purpose hardware-based systems that perform the specified functions or acts or carry out combinations of special purpose hardware and computer instructions.\"\n ]\n]"},"source":{"kind":"string","value":"Patent_15871443"}}},{"rowIdx":4493795,"cells":{"text":{"kind":"list like","value":[["Methods and Apparatus for Superpixel Modulation","In illustrative implementations, a set of separate modulation signals simultaneously modulates a plurality of pixels in a superpixel by a set of separate modulation signals, such that each pixel in the superpixel is modulated by a modulation signal that causes sensitivity of the pixel to vary over time.","Each superpixel comprises multiple pixels.","In some implementations, the sensitivity of a pixel to incident light is controlled by storage modulation or by light modulation.","In some implementations, this invention is used for 3D scanning, i.e., for detection of the 3D position of points in a scene."],["1.A method comprising modulating, by a set of signals, a group of imaging pixels, wherein: (a) the modulating comprises, for each respective imaging pixel, modulating sensitivity of the respective imaging pixel to light incident on the respective imaging pixel, in such a way that the sensitivity varies over time during the modulating; (b) the group of imaging pixels consists of pixel sets, each imaging pixel being a member of one or more of the pixel sets; (c) the imaging pixels are located in imaging superpixels; (d) each imaging superpixel includes at least one imaging pixel from each of the pixel sets; (e) each respective signal, in the set of signals, modulates only one pixel set and thus modulates at least one imaging pixel in each of the imaging superpixels; and (f) each signal, in the set of signals, is different than the other signals in the set of signals.","2.The method of claim 1, wherein the modulating by each of the signals occurs simultaneously.","3.The method of claim 1, wherein each imaging pixel is a member of only one of the pixel sets.","4.The method of claim 1, wherein each imaging superpixel includes only one imaging pixel of each pixel set, respectively.","5.The method of claim 1, wherein: (a) each signal, in the set of signals, undergoes a temporal sequence of states; and (b) the frequency at which the states change is different for each signal in the set of signals.","6.The method of claim 1, wherein: (a) each signal, in the set of signals, undergoes a temporal sequence of states; and (b) different permutations of the states of the signals exist at different times during a temporal period, each permutation of the states, respectively, during the period representing a permutation of digits of a code.","7.The method of claim 1, wherein the method further comprises, for each respective imaging pixel: (a) at multiple times during a temporal period, transferring electric charge from a photodiode of the respective imaging pixel to a first storage device; (b) at multiple other times during the period, discharging accumulated electrical charge from the photodiode without measuring the accumulated electrical charge; and (c) throughout the period, not transferring electrical charge from the photodiode to any storage device other than the first storage device.","8.The method of claim 1, wherein the method further comprises, for each respective imaging pixel, transferring, at multiple times during a read-out frame, electric charge from a photodiode of the respective imaging pixel to a set of storage devices, one storage device at a time.","9.The method of claim 1, wherein: (a) each signal, in the set of signals, undergoes a temporal sequence of states; and (b) the method further comprises (i) illuminating a scene, in such a way that where intensity of light incident on the scene is greatest changes during a temporal period, and (ii) calculating, based on a permutation, a time at which intensity of light incident on a specific imaging superpixel is greatest during the period, the permutation being a permutation of states of the signals that occurs when intensity of light incident on the specific imaging superpixel is greatest during the period.","10.The method of claim 9, further comprising calculating, based on the time, 3D position of a point in the scene, which point in the scene corresponds to the specific imaging superpixel.","11.An apparatus comprising: (a) a group of imaging pixels; and (b) one or more signal generators; wherein (i) the group of imaging pixels consists of pixel sets, each imaging pixel being a member of one or more of the pixel sets, (ii) the imaging pixels are spatially arranged as, and comprise, imaging superpixels, (iii) each imaging superpixel includes at least one imaging pixel from each of the pixel sets, and (iv) the one or more signal generators are configured to output a set of signals that cause the group of imaging pixels to undergo modulation, in such a way that (A) each signal, in the set of signals, is different than the other signals in the set of signals, (B) the modulation comprises, for each respective imaging pixel, modulating sensitivity of the respective imaging pixel to light incident on the respective imaging pixel, in such a way that the sensitivity varies over time during the modulation, and (C) each respective signal, in the set of signals, modulates only one pixel set and thus modulates at least one imaging pixel in each of the imaging superpixels.","12.The apparatus of claim 11, wherein the signal generator is configured to output each of the signals simultaneously.","13.The apparatus of claim 11, wherein each imaging pixel is a member of only one of the pixel sets.","14.The apparatus of claim 11, wherein each imaging superpixel includes only one imaging pixel of each pixel set, respectively.","15.The apparatus of claim 11, wherein an imaging pixel, in the group of imaging pixels, comprises a CMOS pixel.","16.The apparatus of claim 11, wherein an imaging pixel, in the group of imaging pixels, comprises a CCD pixel.","17.The apparatus of claim 11, wherein: (a) each imaging pixel, respectively, includes a photodiode and a first storage device; and (b) the apparatus is configured to cause the photodiode (a) at multiple times during a temporal period, to transfer electric charge to the first storage device; (b) at multiple other times during the period, to discharge accumulated electrical charge without the accumulated electrical charge being measured; and (c) throughout the period, to not transfer electrical charge to any storage device other than the first storage device.","18.The apparatus of claim 11, wherein: (a) each imaging pixel, respectively, includes a photodiode and a set of storage devices; and (b) the apparatus is configured to cause the photodiode to transfer, at multiple times during a read-out frame, electric charge to the set of storage devices, one storage device at a time.","19.The apparatus of claim 11, wherein (a) the one or more signal generators are configured to output the set of signals in such a way that each signal, in the set of signals, undergoes a temporal sequence of states; and (b) the apparatus further comprises: (i) a light source configured to illuminate a scene, in such a way that where intensity of light incident on the scene is greatest changes during a temporal period, and (ii) a computer that is programmed to calculate, based on a permutation, a time at which intensity of light incident on a specific imaging superpixel is greatest during the period, the permutation being a permutation of states of the signals that occurs when intensity of light incident on the specific imaging superpixel is greatest during the period.","20.The apparatus of claim 19, wherein the computer is programmed to calculate, based on the time, 3D position of a point in the scene, which point in the scene corresponds to the specific imaging superpixel."],[" FIELD OF THE TECHNOLOGY The present invention relates generally to superpixel modulation."],[" SUMMARY In exemplary implementations of this invention, a light sensor includes superpixels.","Each superpixel comprises multiple pixels, such that each pixel in the superpixel is a horizontal, vertical or diagonal neighbor of at least one other pixel in the superpixel.","The pixels of the light sensor also include pixel sets.","Each pixel set comprises multiple pixels to which a single modulation signal is applied.","In many cases, the pixels of a given pixel set are not horizontal, vertical or diagonal neighbors of each other.","Each of the pixel sets is modulated by a separate modulation signal.","Each superpixel includes at least one pixel from each of the pixel sets.","Thus, different pixels in each superpixel are separately modulated.","For example, in some cases: (1) a light sensor includes n pixel sets; (2) each superpixel in the light sensor has n pixels, such that each pixel in the superpixel is an element of a different pixel set; and (3) n separate modulation signals are simultaneously applied to the pixels in the light sensor, one separate modulation signal per pixel set.","In this example, for each superpixel, n separate modulation signals are simultaneously applied to the n pixels of the superpixel, one modulation signal per pixel, In illustrative implementations, the n separate modulations signals together comprise an n-bit binary code, such as n-bit binary gray code.","Each of the modulation signals corresponds to a bit of the code.","For example, in some cases: (1) each superpixel has n pixels; (2) n separate modulation signals are applied to the n pixels, one modulation signal per pixel; (3) together the n modulations signals comprise an 9-bit binary gray code; and (4) each of the n modulation signals corresponds to a bit of the code.","All 2 n permutations of the n-bit code are applied during each camera frame.","Thus, each camera frame is divided into 2 n time intervals (timeslots).","Each permutation of the code corresponds to a unique timeslot during a single camera frame.","In illustrative implementations, a set of separate modulation signals simultaneously modulate a plurality of pixels in a superpixel, such that each pixel in the superpixel is modulated by a modulation signal that causes sensitivity of the pixel to vary over time.","In some implementations, this invention is used for 3D scanning, i.e., for detection of the 3D position of points in a scene.","In some cases, the 3D scanning is implemented as follows: A rotating mirror causes a plane of laser light to sweep across a scene during each camera frame.","Because the mirror rotates, the angle of the plane of laser light varies as a function of time during each sweep.","The mirror is at a particular angle when the plane of laser light hits the point in the scene from which light directly reflects to that pixel.","At this particular angle of the plane of laser light, the incident light intensity for that pixel reaches a maximum for that frame.","The modulation pattern affects the pixel's response to incident light, and thereby uniquely identifies (i) the timeslot during which the maximum intensity of incident light strikes the pixel and (ii) the angle of the plane of laser light during this timeslot.","A computer uses the timeslot to access a lookup table to determine the 3D position of the scene point.","The lookup table is computed for each pixel by triangulation, during earlier calibration.","Specifically, in some cases, the image sensor, rotational axis of the rotating mirror, and pixel ray for the superpixel are fixed relative to each other.","The pixel ray is the half-line along which light must travel in order to reach the center of the superpixel.","A computer calculates the angle of the plane of laser light for a given superpixel, based on the timeslot at which incident light for the given superpixel reaches a maximum.","The 3D scene point that reflects light to the given superpixel is positioned at the intersection of (i) the pixel ray for the given superpixel and (ii) the plane of laser light.","A computer calculates the 3D coordinates of this intersection by triangulation, based on the known position of the superpixel, pixel ray for the superpixel, and light source and based on the computed angle of the plane of laser light.","An advantage of the present invention is that, in illustrative implementations, all n modulation signals that comprise an n-bit code are recorded by an n-pixel superpixel during a single frame of a camera.","In contrast, during conventional time-multiplexed structured illumination: (a) light source is modulated by one modulation signal during each frame; and (b) the n separate modulation signals that comprise the n-bit code are applied during n separate frames of the camera, one modulation signal per frame.","Thus, in illustrative implementations, this invention captures in a single camera frame the same type of data as is captured during multiple camera frames with time-multiplexed structured illumination.","Capturing all of the data in a single frame (in illustrative implementations of the present invention) rather than in multiple frames (as in conventional time-multiplexed structured illumination) has the desirable effect of reducing distortion and artifacts in 3D sensing that are caused by motion.","In some implementations of this invention, the sensitivity of a pixel to incident light is controlled by storage modulation.","Storage modulation is achieved by using either a single storage device per pixel, or by using multiple storage devices per pixel.","In single storage cases, each pixel transfers charge to only one storage device during the exposure time of a single camera frame.","The storage device receives charge only from that pixel, and not from any other pixels, during the exposure time of a single camera frame.","Modulation signals cause a photodiode in each pixel to transfer charge to the single storage device multiple times during a single camera frame, and to drain charge, without saving it for later readout, at multiple other times during the same camera frame.","In multiple storage cases, each pixel transfers charge to multiple storage device during the exposure time of a single camera frame.","These multiple storage device receive charge only from that pixel, and not from any other pixels, during the exposure time of a single camera frame.","Modulation signals cause a photodiode in each pixel to transfer charge to transfer charge to different storage devices, out of the multiple storage devices, at multiple times during the exposure time of a single camera frame, or to drain charge, without saving it for later readout, at multiple other times during the same camera frame.","In some implementations of this invention, pixel modulation occurs by light modulation.","In light modulation implementations, the system includes an SLM (spatial light modulator) that is either transmissive or reflective.","The SLM selectively attenuates light from a scene, thereby selectively controlling the intensity of light incident on a pixel.","For example, in some cases: (a) a reflective SLM selectively reflects light from the scene, causing different sets of pixels in a superpixel to receive reflected light from the scene at different times during a single camera exposure; and (b) the reflective SLM comprises a DMD (digital micromirror device) or a reflective LCOS (liquid crystal on silicon) device.","For example, in other cases: (a) light passing through a transmissive SLM is selectively attenuated by the SLM, causing different sets of pixels in a superpixel to receive light from the scene at different times during a single camera exposure; and (b) the transmissive SLM comprises an LCD (liquid crystal device) or ferromagnetic shutters.","The description of the present invention in the Summary and Abstract sections hereof is just a summary.","It is intended only to give a general introduction to some illustrative implementations of this invention.","It does not describe all of the details of this invention.","This invention may be implemented in many other ways.","Likewise, the description of this invention in the Field of the Technology section is not limiting; instead it identifies, in a general, non-exclusive manner, a field of technology to which exemplary implementations of this invention generally relate."],["RELATED APPLICATIONS This application is a continuation of U.S. application Ser.","No.","15/115,270, which was the National Stage of International Application No.","PCT/IB2015/051551 filed Mar.","3, 2015, which claims the benefit of U.S.","Provisional Application No.","61/947,282, filed Mar.","3, 2014 (the “Provisional Application”).","FIELD OF THE TECHNOLOGY The present invention relates generally to superpixel modulation.","SUMMARY In exemplary implementations of this invention, a light sensor includes superpixels.","Each superpixel comprises multiple pixels, such that each pixel in the superpixel is a horizontal, vertical or diagonal neighbor of at least one other pixel in the superpixel.","The pixels of the light sensor also include pixel sets.","Each pixel set comprises multiple pixels to which a single modulation signal is applied.","In many cases, the pixels of a given pixel set are not horizontal, vertical or diagonal neighbors of each other.","Each of the pixel sets is modulated by a separate modulation signal.","Each superpixel includes at least one pixel from each of the pixel sets.","Thus, different pixels in each superpixel are separately modulated.","For example, in some cases: (1) a light sensor includes n pixel sets; (2) each superpixel in the light sensor has n pixels, such that each pixel in the superpixel is an element of a different pixel set; and (3) n separate modulation signals are simultaneously applied to the pixels in the light sensor, one separate modulation signal per pixel set.","In this example, for each superpixel, n separate modulation signals are simultaneously applied to the n pixels of the superpixel, one modulation signal per pixel, In illustrative implementations, the n separate modulations signals together comprise an n-bit binary code, such as n-bit binary gray code.","Each of the modulation signals corresponds to a bit of the code.","For example, in some cases: (1) each superpixel has n pixels; (2) n separate modulation signals are applied to the n pixels, one modulation signal per pixel; (3) together the n modulations signals comprise an 9-bit binary gray code; and (4) each of the n modulation signals corresponds to a bit of the code.","All 2n permutations of the n-bit code are applied during each camera frame.","Thus, each camera frame is divided into 2n time intervals (timeslots).","Each permutation of the code corresponds to a unique timeslot during a single camera frame.","In illustrative implementations, a set of separate modulation signals simultaneously modulate a plurality of pixels in a superpixel, such that each pixel in the superpixel is modulated by a modulation signal that causes sensitivity of the pixel to vary over time.","In some implementations, this invention is used for 3D scanning, i.e., for detection of the 3D position of points in a scene.","In some cases, the 3D scanning is implemented as follows: A rotating mirror causes a plane of laser light to sweep across a scene during each camera frame.","Because the mirror rotates, the angle of the plane of laser light varies as a function of time during each sweep.","The mirror is at a particular angle when the plane of laser light hits the point in the scene from which light directly reflects to that pixel.","At this particular angle of the plane of laser light, the incident light intensity for that pixel reaches a maximum for that frame.","The modulation pattern affects the pixel's response to incident light, and thereby uniquely identifies (i) the timeslot during which the maximum intensity of incident light strikes the pixel and (ii) the angle of the plane of laser light during this timeslot.","A computer uses the timeslot to access a lookup table to determine the 3D position of the scene point.","The lookup table is computed for each pixel by triangulation, during earlier calibration.","Specifically, in some cases, the image sensor, rotational axis of the rotating mirror, and pixel ray for the superpixel are fixed relative to each other.","The pixel ray is the half-line along which light must travel in order to reach the center of the superpixel.","A computer calculates the angle of the plane of laser light for a given superpixel, based on the timeslot at which incident light for the given superpixel reaches a maximum.","The 3D scene point that reflects light to the given superpixel is positioned at the intersection of (i) the pixel ray for the given superpixel and (ii) the plane of laser light.","A computer calculates the 3D coordinates of this intersection by triangulation, based on the known position of the superpixel, pixel ray for the superpixel, and light source and based on the computed angle of the plane of laser light.","An advantage of the present invention is that, in illustrative implementations, all n modulation signals that comprise an n-bit code are recorded by an n-pixel superpixel during a single frame of a camera.","In contrast, during conventional time-multiplexed structured illumination: (a) light source is modulated by one modulation signal during each frame; and (b) the n separate modulation signals that comprise the n-bit code are applied during n separate frames of the camera, one modulation signal per frame.","Thus, in illustrative implementations, this invention captures in a single camera frame the same type of data as is captured during multiple camera frames with time-multiplexed structured illumination.","Capturing all of the data in a single frame (in illustrative implementations of the present invention) rather than in multiple frames (as in conventional time-multiplexed structured illumination) has the desirable effect of reducing distortion and artifacts in 3D sensing that are caused by motion.","In some implementations of this invention, the sensitivity of a pixel to incident light is controlled by storage modulation.","Storage modulation is achieved by using either a single storage device per pixel, or by using multiple storage devices per pixel.","In single storage cases, each pixel transfers charge to only one storage device during the exposure time of a single camera frame.","The storage device receives charge only from that pixel, and not from any other pixels, during the exposure time of a single camera frame.","Modulation signals cause a photodiode in each pixel to transfer charge to the single storage device multiple times during a single camera frame, and to drain charge, without saving it for later readout, at multiple other times during the same camera frame.","In multiple storage cases, each pixel transfers charge to multiple storage device during the exposure time of a single camera frame.","These multiple storage device receive charge only from that pixel, and not from any other pixels, during the exposure time of a single camera frame.","Modulation signals cause a photodiode in each pixel to transfer charge to transfer charge to different storage devices, out of the multiple storage devices, at multiple times during the exposure time of a single camera frame, or to drain charge, without saving it for later readout, at multiple other times during the same camera frame.","In some implementations of this invention, pixel modulation occurs by light modulation.","In light modulation implementations, the system includes an SLM (spatial light modulator) that is either transmissive or reflective.","The SLM selectively attenuates light from a scene, thereby selectively controlling the intensity of light incident on a pixel.","For example, in some cases: (a) a reflective SLM selectively reflects light from the scene, causing different sets of pixels in a superpixel to receive reflected light from the scene at different times during a single camera exposure; and (b) the reflective SLM comprises a DMD (digital micromirror device) or a reflective LCOS (liquid crystal on silicon) device.","For example, in other cases: (a) light passing through a transmissive SLM is selectively attenuated by the SLM, causing different sets of pixels in a superpixel to receive light from the scene at different times during a single camera exposure; and (b) the transmissive SLM comprises an LCD (liquid crystal device) or ferromagnetic shutters.","The description of the present invention in the Summary and Abstract sections hereof is just a summary.","It is intended only to give a general introduction to some illustrative implementations of this invention.","It does not describe all of the details of this invention.","This invention may be implemented in many other ways.","Likewise, the description of this invention in the Field of the Technology section is not limiting; instead it identifies, in a general, non-exclusive manner, a field of technology to which exemplary implementations of this invention generally relate.","BRIEF DESCRIPTION OF THE DRAWINGS FIG.","1 is a diagram that shows a matrix of superpixels.","FIG.","2 is a diagram that shows individual pixels within superpixels.","FIG.","3 is a diagram that shows five different modulation signals that are simultaneously applied to five different pixel sets.","FIG.","4 is a conceptual diagram, illustrating how modulation signals control the response of pixels to incident light.","FIGS.","5, 7 and 9 are each a circuit schematic for a portion of a CMOS pixel, which pixel has one floating diffusion storage device.","FIGS.","6, 8 and 10 are timing diagrams for FIGS.","5, 7 and 9, respectively.","FIG.","11 is a conceptual diagram of a superpixel, in which each pixel has multiple storage devices.","FIG.","12 a circuit schematic for a portion of a CMOS pixel that has three storage devices.","FIG.","13 is a conceptual diagram of CCD pixels, in which each pixel has two storage devices.","FIG.","14 is a conceptual diagram of CCD pixels, in which each pixel has four storage devices.","FIG.","15 is a flowchart for modulation of storage using an n-ary code, such that all of the photodiode charge is stored for later readout.","FIG.","16 is a flowchart for modulation of storage using an n-ary code, such that only a portion of the photodiode charge is stored for later readout.","FIG.","17 is a flowchart for decoding an n-ary code, after storage modulation in which only a portion of the photodiode charge is stored for later readout.","FIG.","18 is a flowchart for decoding an n-ary code, after storage modulation in which all of the photodiode charge is stored for later readout.","FIG.","19 is diagram that illustrates three examples of analog modulation signals.","FIG.","20 is a conceptual diagram illustrating the use of a reflective SLM for modulating the intensity of light incident on photodiodes of pixels in a superpixel.","FIG.","21 is a ray diagram that shows a DMD selectively reflecting light from a scene at a particular time, such that reflected light is steered toward some, but not all, of the pixels in a superpixel of an image sensor.","FIG.","22 is a conceptual diagram illustrating the use of a transmissive SLM for modulating the intensity of light incident on photodiodes of pixels in a superpixel.","FIG.","23 is a ray diagram showing an LCD selectively attenuating light from a scene, such that light reaches some, but not all, of the pixels of a superpixel in an image sensor.","FIGS.","24A, 24B and 24C are each a diagram of an optical system that includes a transmissive SLM.","In FIG.","24A, the transmissive SLM is adjacent to the image sensor plane.","In FIG.","24B, an imaging lens is positioned between the transmissive SLM and the image sensor plane.","In FIG.","24C, a field lens and relay lens are positioned between the transmissive SLM and the image sensor plane.","FIG.","25 is a conceptual diagram that shows an example of prior art, time-multiplexed structured illumination.","FIG.","26 is a conceptual diagram that illustrates a moving line of light produced by controlled movement of a light source, in an illustrative implementation of this invention.","FIG.","27A is a diagram, which shows a rotating mirror that reflects a rotating line of light.","FIG.","27B is a diagram, which shows a projector that projects a moving line of light.","FIG.","27C is a diagram, which shows an array of directional light sources that, taken together, emit a moving line of light.","FIG.","28 is a block diagram of hardware components.","FIG.","29 is a diagram of a 3D scanning system.","FIG.","30 is a flowchart that shows steps in a method of 3D scanning, in which different pixel sets are separately modulated.","FIG.","31 is a flowchart that shows steps in a method of 3D scanning, in which a timeslot is calculated.","FIG.","32 is a flowchart that shows steps in a method of calibrating a 3D scanner.","FIG.","33 is a diagram that shows four examples of circles used in an optical calibration pattern.","FIG.","34 is a diagram that shows examples of use of calibration patterns.","The above Figures (except FIG.","25) show some illustrative implementations of this invention, or provide information that relates to those implementations.","However, this invention may be implemented in many other ways.","DETAILED DESCRIPTION Superpixels and Pixel Sets In illustrative implementations of this invention, a light sensor includes superpixels.","Separate modulation signals are applied to different sets of pixels in the light sensor.","As used herein, a set of pixels to which a particular modulation signal is applied is sometimes called a “modulation pixel set” or simply “pixel set”.","Each pixel set comprises multiple pixels.","Each superpixel includes at least one pixel from each of the pixel sets.","FIG.","1 is a diagram that shows a matrix of superpixels, in an illustrative implementation of this invention.","In the example shown in FIG.","1, a light sensor comprises matrix 100 of superpixels, such as superpixels 101, 102, 103, 104.The matrix 100 has r rows and c columns.","The total number of superpixels in the matrix is r*c=k.","FIG.","2 is a diagram that shows individual pixels within superpixels, in an illustrative implementation of this invention.","FIG.","2 shows four superpixels 251, 252, 253, 254 in the upper left corner of a matrix of superpixels.","Each of the four superpixels comprises 9 pixels.","For example, superpixel 251 comprises pixels 211, 212, 213, 214, 215, 216, 217, 218, 219.In the example shown in FIG.","2, there are nine pixel sets.","The pixels in the first pixel set are labeled “1”.","Likewise, the pixels in the second, third, fourth, fifth, sixth, seventh, eighth and ninth pixel sets are labeled “2”, “3”, “4′”, “5”, “6”, “7”, “8”, and “9”, respectively.","(These numerical labels are used in FIG.","2 to facilitate explanation; but in actual practice, the pixels are not labeled in this manner.)","In FIG.","2, each superpixel includes one pixel from each set.","In illustrative implementations, the pixels in each superpixel are sufficiently small and sufficiently close together that light incident on the photodiodes of the pixels in the superpixel is locally homogeneous—that is, within a single superpixel, spatial variation in intensity of incident light is not substantial.","(However, in some cases: (a) the light sensor itself includes spatial light modulators—such as an LCD—for selectively modulating the intensity of incoming light; and (b) the light incident on the photodiodes of the superpixel is locally homogeneous if the effect of the spatial light modulators is subtracted, but is not locally homogeneous if the effect of the spatial light modulators is taken into account.)","Depending on the particular implementation, the spatial distribution of pixel sets within a light sensor may vary.","In many cases, it is preferable for the pixel sets to be spatially distributed in a repeating pattern.","For example, in some cases, 9 pixel sets are used in a light sensor, and each superpixel is a 3×3 pixel square, which is an easily repeatable pattern.","For example, in FIG.","2, the following spatial pattern of 9 pixel sets occurs in superpixel 251: pixels from pixel sets 1, 2, 3 are in the top row of the superpixel, pixels for pixel sets 4, 5, 6 are in the middle row of the superpixel, and pixels for pixel sets 7, 8, 9 are in the bottom row of the superpixel.","This spatial pattern repeats in superpixels 252, 253, 254.Or, for example, in some cases, a 3-pixel superpixel in an “L” shape is used: stacking an upright “L” and a bottom-up “L” gives a rectangle and thus produces a repeatable pattern.","Depending on the particular implementation, any shape of superpixels may be used.","For example, in some cases, triangular or hexagonal superpixels are used.","In some cases, the superpixels has a linear shape, such as horizontal (e.g., [12345][12345][12345]), and vertical (e.g., [12345]T[12345]T[12345]T) However, in some cases, using a line-shaped superpixel has a disadvantage: if all “1”s are in one column; this tends in some cases to at least slightly increase the decoding error rate.","In some cases, the position of pixels from different pixel sets (within each superpixel) is rearranged from superpixel to superpixel (e.g.","using a few fixed patterns, completely randomizing the order, or using a mathematical permutation).","For example, in some implementations, the spatial distribution of pixels from different sets of pixel sets within each superpixel is randomized in design time, then the random distribution is hardwired.","For example, in some cases, randomization produces, for three line-shaped superpixels, a spatial arrangement of pixels from different pixel sets of [13452][35214][41253], rather than [12345][12345][12345].","Likewise, randomization of position of pixels from different pixel sets is applicable to any shape of superpixel, including square, rectangular, L-shaped, triangular or hexagonal.","In some cases, a multiplexer rearranges the shape or size of superpixels, such that superpixels with different sizes or shapes used at different times (e.g., for different applications, different frames, or at different times within a single frame) or at different regions within a single light sensor.","For example, in some cases, a multiplexer reconfigures different superpixel shapes, e.g., 3×3, 4×3, or another shape.","For example, in some implementations with CMOS pixels, a multiplexer is placed outside the pixel matrix area and directs separate TX/PD RST control signals to the pixels.","Likewise, in some cases, a multiplexer rearranges the position of pixels from different pixel sets within one or more of the superpixels.","As noted above, in some cases, the spatial distribution of different sets of pixels changes from frame to frame.","Alternatively, in some cases, the spatial distribution is fixed because of wiring of the pixel circuit.","In many implementations, the different sets of pixels in the imaging sensor are disjoint (i.e., no pixel belongs to more than one of the sets of pixels).","Alternatively, different sets of pixels are overlapping.","In some cases, a single pixel that is an element of two pixel sets A and B is subjected to a pixel modulation signal that comprises a superposition of the modulation signals for pixel sets A and B.","The size of the superpixel depends on the application.","If, for example, a 9 pixel superpixel is not enough for a specific application and a 16 pixel superpixel is too much, a 12 pixel superpixel (4×3 or 3×4) may be used for that specific application.","More pixel sets in a superpixel allows for more complicated coding strategies or code sharing.","For example, a modulation signal comprising 18-bit gray code may be applied to the pixels of a 6×3 pixel superpixel.","In some use scenarios, spatial compression is achieved by treating each large superpixel as if it comprises smaller superpixels, and then applying modulation signals as follows: Modulation signals corresponding to lower bits of a code are applied to only one pixel per large superpixel, but modulation signals corresponding to higher bits of the code are applied to one pixel per smaller superpixel.","For example, in some use scenarios, a 6×3 pixel superpixel is treated as if comprising two 3×3 pixel superpixels.","In these use scenarios, a modulation pattern corresponding to each of the 4 lower bits of the 11-bit gray code is applied to just one pixel in the 6×3 superpixel, while modulation patterns corresponding to each of the 7 higher bits of the 11-bit gray code are applied to one pixel in each of the 3×3 superpixels.","Spatial compression (by applying lower bits and higher bits in this manner) has many practical advantages.","For example, in some 3D depth sensing applications, this spatial compression allows for using multiple higher bit modulation signals to determine, for each large superpixel for each frame, the 3D coordinates for multiple points in a scene.","For example, in some implementations that use this spatial compression, a computer calculates 3D coordinates of four scene points, for each frame for each 6×3 superpixel.","In some cases, the actual spatial distribution of pixel sets is hardwired in a fixed pattern.","However, even then, in some cases, software is used to effectively vary the spatial distribution of pixel sets from frame to frame, by changing, from frame to frame, which bits of a modulation code are applied to which pixel set.","For example, in some cases: (a) in a first frame, software causes the x-th bit of a modulation signal to be applied to modulate pixel set x; and (b) in a second frame, software causes the x-th bit of a modulation signal to be applied to modulate pixel set y.","For example, in some use scenarios: (a) in a first frame, the modulation signal for the first bit of a code is applied to a first pixel set, the modulation signal for the second bit of the code is applied to the second pixel set, and so on, and (b) in a second frame, the first bit of a code is applied to the second pixel set, the modulation signal for the second bit of the code is applied to the third pixel set, and so on.","Thus, in this approach, the permutation of assignments (from code bits to pixel sets) varies from frame to frame.","In some cases, the same permutation of assignments (of code bits to pixel sets) is used in all frames.","In other cases, different permutations of assignments (of code bits to pixel sets) are applied in different frames in a fixed order.","In yet other cases, a different random permutation of assignments (of code bits to pixel sets) is used in each frame.","Here is a non-limiting example of varying the permutation of assignments (of code bits to pixel sets).","For a 5-bit code, there are 5!","(factorial) different permutations of assignments of code bits to pixel sets.","Different permutations are used in different frames.","For example, (a) in a first frame, a first permutation is used, which maps bit 1 to pixel set 1, bit 2 to pixel set 2, bit 3 to pixel set 3, bit 4 to pixel set 4, and bit 5 to pixel set 5; and (b) in a second frame, a second permutation is used, which maps bit 1 to pixel set 4, bit 2 to pixel set 2, bit 3 to pixel set 5, bit 4 to pixel set 3, and bit 5 to pixel set 1.In illustrative implementations, each superpixel comprises multiple imaging pixels.","Each pixel in the superpixel is a horizontal, vertical or diagonal neighbor of at least one other pixel in the superpixel.","In the example shown in FIG.","2, pixel 215 has only two vertical neighbors (pixels 212, 217), only two horizontal neighbors (pixels 214, 216), and only four diagonal neighbors (pixels 211, 213, 217, 219).","In many cases, the pixels of a given pixel set are not horizontal, vertical or diagonal neighbors of each other.","For example, in FIG.","2, pixels 216 and 226 are each members of the sixth pixel set.","None of the neighboring pixels (i.e.","horizontal, vertical or diagonal neighbors) of pixel 216 is a member of the sixth pixel set.","Likewise, none of the neighboring pixels (i.e.","horizontal, vertical or diagonal neighbors) of pixel 226 is a member of the sixth pixel set.","Modulation Signals FIG.","3 is a diagram that shows five different modulation signals that are simultaneously applied to five different pixel sets during a single frame.","In FIG.","3, the five signals 311, 312, 313, 314, 315 together comprise a binary 5-bit gray code.","The code is binary because each component of the code has only two allowed values.","In FIG.","3, the two allowed values are called “open” and “closed”.","However, the two allowed values may be called by any name, such as on and off, high and low, or 0 and 1.In FIG.","3, each of the five modulation signals 311, 312, 313, 314, 315 corresponds to a bit of a 5-bit gray code.","The 5-bit gray code has 25 (i.e., 32) permutations of open and closed states of the 5 component signals.","In FIG.","3, all 25 (i.e., 32) permutations of open and closed states of the 5 component signals are applied to the pixel sets, during a single frame of the camera.","For a 5-bit code (such as that shown in FIG.","3), a single frame of the camera has 25 (i.e., 32) subintervals, which are sometimes called “timeslots”.","Each timeslot corresponds to a single permutation of the code.","For example, during timeslot 321 in FIG.","3, the permutation is signal 315 closed, signal 314 closed, signal 313 open, signal 312 open and signal 311 closed.","In contrast, during timeslot 323 in FIG.","3, the permutation is signal 315 open, signal 314 open, signal 313 open, signal 312 open and signal 311 closed.","In FIG.","3, a unique permutation (of binary states of the 5 component signals of the 5-bit gray code) exists for each of the 32 timeslots.","Thus, each permutation (of states of the 5 component signals of the 5-bit gray code) is effectively a “timestamp” that uniquely identifies a timeslot within a frame.","In some implementations of this invention, a 9-bit binary gray code is used.","The nine bits of this code are represented by 9 modulation signals.","The 9-bit code has 29 (i.e., 512) permutations of open and closed states of the 9 modulation signals.","All 512 permutations are applied to pixels in each frame of the camera.","Thus, for this 9-bit code, each frame has 512 subintervals, sometimes called timeslots.","A unique permutation of the 9-bit code (and thus of the open and closed states of the 9 modulation signals) exists for each of the 512 timeslots.","In some cases in which a 9-bit code is used: (a) there are nine pixel sets; (b) the 9 modulation signals are applied to the 9 pixel sets, one signal per pixel set; and (c) each superpixel has 9 pixels, one pixel per pixel sets.","Thus, the 9 modulation signals are applied to the 9 pixels in a superpixel, one signal per pixel.","Gray codes are robust against noise, which is advantageous.","Depending on the particular implementation of this invention, the modulation signals are either (a) continuous time (analog), (b) discrete-time, or (c) digital (discrete in both amplitude and time).","For example, in many examples of this invention, digital modulation signals are used.","In that case, the amplitude of the modulation signal is treated as being in one of two binary states (e.g., 0 or 1), and the signal changes only at discrete time intervals.","Alternatively, modulation signals are treated as continuous in amplitude.","For example, in some cases, a computer normalizes the range of continuous values to an interval [0,1].","In that case, for example, a value of 0.241 may mean that 24.1% of electrons are moved to storage.","There is no limitation of when the signal change can occur in time.","In some implementations, the signal changes continuously in time.","In some cases, analog modulation signals are used, which are treated as continuous in both amplitude and time.","In some implementations, the modulation signals are non-periodic.","An example of such an aperiodic signal is 00110010101101000011010, which does not have one specific frequency or phase.","In other cases, the modulation signals are periodic.","Or, in some cases, a periodic signal such as 01010101010101 is applied to a first pixel set, and a second periodic or aperiodic signal (e.g., periodic signal 10000100001000) is applied to a second pixel set.","In some cases, the frequency, phase, or amplitude of the modulation signal for a pixel set changes over the duration of one frame.","In other cases, the frequency, phase, or amplitude of the modulation signal for a pixel set is constant within each single frame, but changes from frame to frame.","In illustrative implementations, each modulation signal is applied to only one pixel in each superpixel.","Alternatively, a single modulation signal is applied to multiple pixels within a single superpixel.","In illustrative implementations: (a) all pixels which belong to the same pixel set have the same modulation signal; and (b) different pixel sets receive different modulation signals.","Each pixel set receives its own, separate generated pixel modulation signal.","In many use scenarios, the amplitude of each modulation signal varies as a function of time during a single frame.","However, in other use scenarios: (a) the amplitude or phase of a modulation signal is constant over time within a single frame, where the constant is different for different pixel sets, or (b) the amplitude or phase of a modulation signal is the same constant for different pixel sets.","In other words, this invention is not limited to signals that change over time or that are different among different sets of pixels.","In some cases, the modulation functions for pixel sets changes frame to frame.","Depending on the particular implementation, the manner in which the modulation signals are physically implemented may vary.","For example, in some cases, the pixels are CMOS imaging pixels, an electrical modulation signal causes a charge transfer (TX) transistor to transfer charge from a photodiode to a storage device (e.g., floating diffusion).","In some cases: (a) each pixel has only one photodiode and more than more than one TX transistor; (b) more than one storage device (e.g., floating diffusion) is dedicated to only that pixel; and (c) each of the TX transistors in that pixel controls transfer to a different storage device.","In other cases, an electrical modulation signal causes electrodes to vary the position of mirrors in a DMD (digital micromirror device) by electrostatic attraction, thereby causing the DMD to selectively reflect light towards some pixels in the image sensor plane, and to reflect light away from some other pixels in the image sensor plane.","In other cases, an electrical modulation signal causes the properties of an SLM (spatial light modulator), such that the SLM selectively attenuates light before it reaches the image sensor plane.","Physical implementation of modulation signals is discussed in more detail below.","Effect of Modulation In some implementations, a modulation signal controls the response of a pixel to incident light.","FIG.","4 is a conceptual diagram, illustrating how modulation signals control the response of pixels to incident light.","In FIG.","4, plot 400 is a plot of Ix,y(t) 401 versus time.","Ix,y(t) is the intensity of light incident on the x, yth superpixel (i.e., the superpixel which has coordinates x, y on the sensor plane) as a function of time.","The time interval shown in plot 400 is a complete camera frame, from the start of the frame to the end of the frame.","(i.e., tframe_start to tframe_end).","The intensity of incident light due to ambient background illumination has a constant amplitude of a (402).","A small peak of intensity occurs at time 404 due to interreflections from the scene.","The highest peak of intensity 406 occurs at time thit.","For example, in some cases: (a) a line of laser light sweeps across the scene during each frame, and (b) the sweeping line of laser light reaches a point in the scene and reflects, such that the reflected light reaches the light sensor at time thit.","In FIG.","4, modulation functions G1(t) to Gn(t) 403 are applied to the n pixel sets in the superpixel, one modulation function per pixel set.","In the example shown in FIG.","4: (a) n=5; (b) a 5-bit gray code is employed; (c) G1(t) to Gn(t) are the five signals that comprise the 5-bit gray code, one signal per bit of the code, as illustrated in FIG.","3.In FIG.","4, vi(t) is a value for the ith pixel set in the superpixel.","Specifically, vi(t) is equal to the integral of the product of Ix,y(t) and Gi(t) (the ith modulation function).","This integral vi(t) is equal to the area of dark region under the curve in plots 408, 410, 412.In plots 408, 410, 412, the curve that defines the top of the dark region is equal to the product of the product of Ix,y(t) and Gi(t).","In plot 408, modulation signal G1(t) is signal 315 shown in FIG.","3.During the first half of the frame (shown in the left side of plot 408), signal 315 is closed (i.e., equal to 0), and thus the product of Ix,y(t) and G1(t) is equal to zero, and there is no dark region under the curve.","During the second half of the frame (shown in the right side of plot 408), signal 315 is open (i.e., equal to 1), and the product of Ix,y(t) and G1(t) is equal to Ix,y(t), and there is a dark region under the curve.","In plot 410, modulation signal G2(t) is signal 314 shown in FIG.","3.During the first and fourth quarters of the frame, signal 314 is closed (i.e., equal to 0), and thus the product of Ix,y(t) and G2(t) is equal to zero, and there is no dark region under the curve.","During the second and third quarters of the frame, signal 314 is open (i.e., equal to 1), and the product of Ix,y(t) and G2(t) is equal to of Ix,y(t), and there is a dark region under the curve.","In plot 412, modulation signal Gn(t) is G5(t), which is signal 311 shown in FIG.","3.The frame is divided into 32 timeslots.","During timeslots in which signal 311 is closed (i.e., equal to 0), the product of Ix,y(t) and G5(t) is equal to zero, and there is no dark region under the curve.","During timeslots in which signal 311 is open (i.e., equal to 1), and the product of Ix,y(t) and G5(t) is equal to of Ix,y(t), and there is a dark region under the curve.","In FIG.","4, the incident light function is identical for each of the pixel sets of the superpixel (that is, Ix,y(t) is the same for all of the pixels in a superpixel, due to their close proximity).","However separate modulation signals G1(t) to Gn(t) are applied to the n pixel sets in the superpixel.","Thus, each of the pixel sets in the superpixel receives a separate modulation signal.","A computer calculates vi(t) (the integral of the product of Ix,y(t) and Gi(t)) for each pixel set in the superpixel 405.For example, a computer calculates v1(t) for the first pixel set which received modulation signal G1(t), and calculates v2(t) for the second pixel set which received modulation signal G2(t), et cetera.","A computer also calculates a threshold 413.In some cases, the threshold 413 is equal to (max vi−min vi)/2, where i=1, 2, .",".",".",", n, and max vi is the maximum vi(t) for all the pixels in the superpixel, and min vi is the minumum vi(t) for all the pixels in the superpixel.","A computer then calculates code Cx,y 409 for the x, yth superpixel (i.e., the superpixel which has coordinates x, y on the sensor plane).","Code Cx,y has the same number of bits as the number of pixel sets in the superpixel.","A computer sets the ith bit of code Cx,y to 1 if the vi(t) is greater than the threshold; otherwise the computer sets the ith bit of code Cx,y to 0.In the example shown in FIG.","4, the computer: (a) sets the first bit of code Cx,y to 1 because vi(t) is greater than the threshold; (b) sets the nth (in this example, the 5th) bit of code Cx,y to 0 because vn(t) is less than the threshold.","Each permutation of code Cx,y corresponds to a unique timeslot (time interval) within a single frame.","This unique timeslot is the timeslot within which time thit occurred.","Thus, each permutation of code Cx,y is effectively a timestamp that uniquely identifies a timeslot (time interval) within a single camera frame, such that incident light striking the pixel reached its maximum peak during this timeslot.","In some 3D depth-sensing implementations of this invention, a galvanometer mirror rotates, causing a plane of laser light to sweep across a scene during each camera frame.","The angle of the mirror (and thus the angle of the plane of laser light) is a function of time within the frame.","Thus, each permutation of code Cx,y corresponds to a unique timeslot (time interval) within a single camera frame, which in turn corresponds to a unique angle of the plane of laser light.","411.A computer uses this angle, and other factors determined during calibration, to compute the 3D position of the scene point that reflected the laser light to the superpixel.","The computer stores, for each superpixel and each angle, the 3D position of the corresponding scene point.","During subsequent operation of a depth sensor, a computer calculates a permutation of code Cx,y for each superpixel, as described above, and then uses the lookup table to compute the 3D position of the scene point that corresponds to that scene point.","In some implementations, each pixel stores charge to only one storage device, which storage device is dedicated to that pixel and does not store charge for any other pixels.","(Such an implementation is sometimes herein called “single storage device implementation”, and is also sometimes herein called a “partial illumination implementation”, because less than all of the incident illumination is measured.)","In the example shown in FIG.","4, each pixel stores charge to only one storage device, which storage device is dedicated to that pixel and does not store charge for any other pixels.","Thus, FIG.","4 illustrates a single storage device implementation.","In single storage device implementations, for each camera frame, the total photodiode charge measured by each pixel in the ith pixel set in a superpixel is equal to the value of vi(t) at the end of the frame (i.e., is equal to vi(tframe_end).","This value, in turn, depends on the modulation function Gn(t) that is applied to the ith pixel set.","Thus, the modulation function Gi(t) determines the response of the pixels in the ith pixel set to incident light.","(In most cases, each superpixel includes only one pixel from each pixel set.","In those cases, the ith pixel set is simply the ith pixel.)","In some single storage implementations in which a binary code is applied to the pixels, each pixel is turned “off” and “on” many times during the duration of a single camera frame.","In many implementations, a pixel is neither “on” during an entire frame, nor “off” during an entire frame.","(Putting a pixel with only a single storage device to constant “off” during an entire frame would cause the pixel not to measure any light during the frame.","Putting a pixel with only a single storage bin to constant “on” for the whole frame duration would cause the pixel to measure light normally during the entire frame.)","In case of the analog modulation, the response for the light measurement ranges from completely “off” to completely “on”, and this signal varies during the camera frame duration.","In cases where each pixel has multiple storage devices, the modulation signals also control the response of the pixel to incident light, as discussed below.","Modulation of Storage In some implementations, modulation signals control storage of charge in a CMOS pixel.","FIGS.","5, 7 and 9 show three examples of CMOS circuits, in illustrative implementations of this invention.","FIGS.","5, 7 and 9 are each a circuit schematic for a portion of a CMOS pixel.","The CMOS pixel has one floating diffusion storage device.","COL means column selector 507.FD means floating diffusion 509.The floating diffusion stores electric charge.","PD RST means photodiode reset transistor 513.ROW means row selector 511.TX means gate transistor 503 in FIGS.","5 and 7.TXi means gate transistor 523 in FIG.","9.TX ROW means row selector 505 for charge transfer.","PD RST ROW means photodiode row selector 521.RST means floating diffusion reset transistor 517.RST causes floating diffusion 509 to be reset (i.e., the charge in floating diffusion 509 to be drained) when RST is high.","SF means source follower 515.The source follower is used during the readout.","V means voltage source.","In FIGS.","5 and 6, TX causes charge to be transferred from the photodiode 501 to floating diffusion 509 when voltages at COL and TX ROW are simultaneously high.","In FIGS.","9 and 10, TXi causes charge to be transferred from the photodiode 501 to the storage FD 509 when TXi is high.","In FIGS.","7 and 8, PD RST causes photodiode 501 to be reset (that is, the charge in photodiode 501 to be drained) when COL and PD RST ROW are simultaneously high.","In FIGS.","5, 6, 9 and 10, PD RST causes photodiode 501 to be reset (that is, the charge in photodiode 501 to be drained) when PD RST is high.","In FIGS.","5, 6, 7, 8, 9 and 10, readout occurs when voltages at COL and ROW are simultaneously high.","FIGS.","6, 8 and 10 are timing diagrams for FIGS.","5, 7 and 9, respectively.","In FIGS.","6, 8 and 10, the entire exposure occurs during a single camera frame, and readout and floating diffusion reset occur after the frame.","In FIGS.","6, 8 and 10, ModExp 531 is a modulation signal that is one of the components of the n-bit code.","Certain other signals in these Figures are derived from ModExp, as discussed below.","At multiple times during the single camera frame, the then accumulated charge in photodiode 501 is transferred to floating diffusion 509 (i.e., each time that the voltages at COL and TX ROW are simultaneously high).","Also, at multiple other times during a single camera frame, the then accumulated charge in photodiode 501 is drained without being readout or measured (e.g., when PD RST is high during 551, 552, 553, 554, 555 in FIG.","6, when both PD RST ROW and COL are high during 561, 562, 563 in FIG.","8, and when PD RST is high during 571, 572, 573, 574, 575 in FIG.","10).","FIG.","11 is a conceptual diagram of a superpixel, in which each pixel has multiple storage devices.","Each pixel stores charge to multiple storage devices.","Each of these multiple storage devices is dedicated to only that pixel and does not store charge for any other pixel.","For example, pixel 1103 has a set of multiple storage devices 1125, and pixel 1105 has a non-overlapping set of multiple storage devices 1135.In the example shown in FIG.","11, light from a scene 1100 strikes the photodiode (e.g., 1107, 1109) of each pixel (e.g., 1103, 1105) in a superpixel 1101.For each pixel, modulation signals cause the then accumulated photodiode charge in the pixel to be transferred to one of the storage devices for that pixel.","Which storage device receives a particular transfer of charge is determined by the modulation signal.","For example, for pixel 1103, a modulation signal causes transfer gate 1111 to transfer charge from photodiode 1107 to storage device 1121 at some times during a single camera frame, and causes transfer gate 1113 to transfer charge from photodiode 1107 to storage device 1123 at some other times during the camera frame.","Likewise, for pixel 1105, a different modulation signal causes transfer gate 1115 to transfer charge from photodiode 1109 to storage device 1131 at some times during a single camera frame, and causes transfer gate 1117 to transfer charge from photodiode 1109 to storage device 1133 at some other times during the camera frame.","FIG.","12 is a circuit schematic for a portion of a CMOS pixel that has three floating diffusion storage devices.","In FIG.","12: COL means column selector 507.FD1 is floating diffusion 549.FD2 is floating diffusion 559.FD3 is floating diffusion 569.PD RST is photodiode reset transistor 513.In FIG.","12, PD RST causes photodiode 501 to be reset (that is, the charge in photodiode 501 to be drained) when PD RST is high.","ROW is row selector 511.RST1 is floating diffusion reset transistor 547.RST2 is floating diffusion reset transistor 557.RST3 is floating diffusion reset transistor 567.In FIG.","12: (a) RST1 causes floating diffusion 509 to be reset when RST1 is high; (b) RST2 causes floating diffusion 509 to be reset when RST2 is high; and (c) RST3 causes floating diffusion 509 to be reset when RST3 is high.","The reset causes charge in floating diffusion 509 to be drained.","SF is source follower 515.TXi1 is transfer gate 543.TXi2 is transfer gate 553.TXi3 is transfer gate 563.In FIG.","12: (a) TXi1 causes charge to be transferred from the photodiode 501 to the storage FD1 549 when TXi1 is high; (b) TXi2 causes charge to be transferred from the photodiode 501 to the storage FD2 559 when TXi2 is high; and (c) TXi3 causes charge to be transferred from the photodiode 501 to the storage FD3 569 when TXi3 is high.","In some implementations, modulation signals control storage of charge for CCD pixels.","FIG.","13 is a conceptual diagram of CCD pixels, in which each pixel has two storage devices.","During a single camera frame, for each pixel in the array, charge is transferred from the photodiode of the pixel at some times to one of the storage devices for the pixel, and at other times to the other storage device for the pixel.","For example, during a single camera frame: (a) a modulation signal causes the then accumulated photodiode charge in pixel 1312 to be transferred to a capacitive bin at position 1311 at some times, and to be transferred to a capacitive bin at position 1303 at some other times; and (b) a separate modulation signal causes the then accumulated photodiode charge in pixel 1315 to be transferred to a capacitive bin at position 1314 at some times, and to be transferred to a capacitive bin at position 1316 at some other time.","After the end of the frame, the charges are shifted down each column of the array in a conventional CCD manner.","For example, charge is read out from the capacitive bin at position 1316 at the edge of the array, then the charge in the capacitive bin at position 1315 is shifted to the capacitive bin at position 1316, then the charge in the capacitive bin at position 1314 is shifted to the capacitive bin at position 1315, then the charge in the capacitive bin at position 1313 is shifted to the capacitive bin at position 1314, then the charge in the capacitive bin at position 1312 is shifted to the capacitive bin at position 1313, then the charge in the capacitive bin at position 1311 is shifted to the capacitive bin at position 1312.Then the charge is read out again from the capacitive bin at position 1316 at the edge of the array, etc.","FIG.","14 is a conceptual diagram of CCD pixels, in which each pixel has four storage devices.","During a single camera frame, for each pixel in the array, charge is transferred from the photodiode of the pixel at some times to the first storage device for the pixel, at other times to the second storage device for the pixel, at yet other times to the third storage device for the pixel, and at yet other times to the fourth storage device for the pixel.","For example, during a single camera frame, a modulation signal causes the then accumulated photodiode charge in pixel 1411: (a) to be transferred to a capacitive bin at position 1453 at some times; (b) to be transferred to a capacitive bin at position 1455 at some other times; (c) to be transferred to a capacitive bin at position 1457 at some times; and (d) to be transferred to a capacitive bin at position 1459 at some other times.","After the end of the frame, the charges are shifted down each column of the array in a conventional CCD manner.","In a pixel with two storages, one storage is by convention considered to be the primary storage.","The “on” state of modulation of such a pixel means that the charge is transferred to the primary storage.","The “off” state of the modulation of such a pixel means that the charge is transferred to the secondary storage.","The image recovered from the primary storages is the “positive” image, accumulated during the “on” phases.","The image recovered from the secondary storages is the “negative” image, accumulated during the “off” phases.","Summing these two together gives the total image, i.e.","an image which would be captured by an ordinary (unmodulated) camera.","As used herein, a “multiple storage implementation” or “total charge implementation” means an implementation in which each pixel has multiple storage devices that receive charge only from that pixel during the exposure time of a frame.","Such an implementation is sometimes called a “total charge implementation” to emphasize that charge is not, by design, drained at some times during the frame without being measured.","1Multiple storage implementations are advantageous for at least two reasons.","First, in some multiple storage implementations, a computer calculates a dynamic threshold depending on the total illumination for a particular pixel.","For example, in some cases, instead of having a fixed threshold for deciding whether a pixel's value represents a logical 0 or logical 1 in code Cx,y (see discussion of FIG.","4), a computer compares the pixel's value to a threshold computed, for example, as 50% of the total value.","Second, in some multiple storage implementations, a computer calculates a total image for a single frame, by summing, for each pixel, the sum of the charges captured by the multiple storage devices for that pixel during that frame.","In most implementations, the modulation signals that comprise a code (such as signals 311-315 in FIG.","3) do not directly control timing within the pixel.","Instead, electronic circuitry in the image sensor, or in the camera circuitry, or in the control unit converts each modulation signal to one or more intermediate signals, which directly or indirectly control timing within each pixel or pixel set, such as the timing of (i) photodiode reset, (ii) floating diffusion reset, (iii) readout, (iv) transfer of charge from photodiode to floating diffusion or to a capacitive bin; or (v) CCD shifts, in the case of a CCD.","For example, in some implementations using CMOS pixels, the intermediate signals comprise high or low (binary values) of voltage applied to TX, TXi, TXi1, TXi2, TXi3, RST, RST1, RST2, RST3, TD ROW, PD RST, or PD RST ROW.","In some cases, changes in an intermediate signal are triggered by the rising edge, falling edge or both of the modulation signal.","In some cases, changes in an intermediate signal occur at a specified delay after the rising edge, falling edge or both of the modulation signal.","In some cases, changes in an intermediate signal are the logical complement of the modulation signal (i.e., 0 if the modulation signal is 1, or 1 if the modulation signal is 0).","In some cases, an intermediate signal that triggers transfer of charge from a photodiode to floating diffusion (i) becomes high when the modulation signal goes from high to low, stays there for a small amount of time necessary to transfer the charge, and goes low; and (ii) ignores the low-to-high transition of modulation signal.","Delayed signals are desirable in some cases when it is known that different elements of the pixel circuit have different latencies, or require different times to transfer the charge.","In some implementations, constraints imposed by the hardware implementation require that the modulation signals satisfy one or more logical conditions.","For example, in some multiple storage implementations, the following logical condition must be satisfied: at any one time, at most one modulation signal per pixel is in a state that triggers transfer of charge.","This is because if more than one transfer gate is open, the charge from photodiode splits between the storages, which is undesirable.","In some other implementations, a logical condition is that storage modulation signals add up to 1.This invention is not limited to binary coding.","As used herein, “n-ary code” means code in which the digits are expressed in base n, where n is an integer greater than 2.For example, 3-ary code is written in base 3, and is sometimes called ternary code.","In some embodiments of this invention, ternary code is used with pixels that each have two storage devices.","In that case, three values of the ternary code (“A”,“B”,“C”) signal causes the charge to be transferred into storage “A”, into storage “B”, or trashed, respectively.","In some cases: (a) each pixel has three storage devices; (b) ternary code is used; (c) instead of trashing the light in the “C” case, the charge is transferred into the third storage (“C”); and (d) A+B+C are summed to get the total amount of light.","In some implementations that employ n-ary code, each pixel has n−1 or n storages.","With n−1 storage devices per pixel, the n-ary code is recoverable.","With n storage devices per pixel, the n-ary code and total amount of light are recoverable.","In some implementations that employ n-ary code and that use n storage devices per pixel, the values 0, 1, .",".",".",", n−1 of the n-ary code cause the charge to be transferred into the 1st, 2nd, .",".",".",", nth storage, respectively.","The total illumination image is obtained by summing all values of the 1st, 2nd, .",".",".",", nth storage.","In some implementations that employ n-ary code and that use n−1 storage devices per pixel, the value 0 causes the photodiode charge to be drained, in some cases without being saved for later readout.","The values 1, .",".",".",", n−1 of the n-ary code cause the charge to be transferred into the 1st, 2nd, .",".",".",", (n−1)th storage, respectively.","In some implementations, modulation of pixel storage is controlled by an n-ary code, such that all of the photodiode charge of each pixel is stored for later readout.","FIG.","15 shows an example of this approach.","In FIG.","15, each pixel has n storage devices, and storage modulation for the kth pixel in a superpixel includes the following steps: A computer evaluates x, which is the value of the kth digit of an n-ary code of length m (Step 1501), and causes the photodiode charge in the kth pixel to be transferred to the (x+1)th storage device for the kth pixel.","(Step 1503).","For example, if x equals 0, then the pixel's photodiode charge is transferred to the first storage device for the pixel.","For example, if x equals n−1, then the pixel's photodiode charge is transferred to the nth storage device for the pixel.","If a superpixel has more than one pixel that is a member of the kth pixel set and the method shown in FIG.","15 is used, then storage modulation for each of these pixels is done simultaneously, in the manner shown in FIG.","15.In some implementations, modulation of pixel storage is controlled by an n-ary code, such that only a portion of the photodiode charge of each pixel is stored for later readout.","FIG.","16 shows an example of this approach.","In FIG.","16, each pixel has multiple (e.g., n−1) storage devices, and storage modulation for the kth pixel in a superpixel includes the following steps: A computer evaluates x, which is the value of the kth digit of a modulation code.","(Step 1601) If x equals 0, then the photodiode charge in the kth pixel is drained, and is not saved for later readout.","(Step 1603) If x is not equal to 0, then the photodiode charge in the kth pixel is transferred to the (x+1)th storage device for the kth pixel.","(Step 1605).","If a superpixel has more than one pixel that is a member of the kth pixel set and the method shown in FIG.","16 is used, then storage modulation for each of these pixels is done simultaneously, in the manner shown in FIG.","16.FIG.","17 is a flowchart for decoding n-ary code, after storage modulation in which only a portion of the photodiode charge is stored for later readout.","In FIG.","17, the code that is being decoded has m digits, and each pixel has multiple (e.g., n−1) storage devices.","Decoding for each superpixel includes the following steps: A computer sets k equal to zero (Step 1701).","A computer evaluates if k is greater than m−1.","(Step 1703) If yes, then decoding stops for that superpixel, and the computer repeats the decoding for each of the superpixels, until all of the superpixels are decoded.","(Step 1715) If no, then a computer detects the storage value (i.e., level of charge stored in a storage device) for each of the multiple storage devices of the kth pixel.","(Step 1705) A computer determines if any of these storage values exceed a threshold.","(Step 1707).","If none of these storage values exceed the threshold, then a computer sets the kth digit of the code to zero.","(Step 1709) If at least one of these storage values exceeds the threshold, then a computer: (a) determines the maximum storage value, out of these storage values (Step 1711), (b) determines that the maximum storage value is stored in the xth storage device for the kth pixel (Step 1712), (c) sets the kth digit of the code to x (Step 1713) and (d) sets k equal to k+1 (Step 1714) If a superpixel has more than one pixel that is a member of the kth pixel set, then the method in FIG.","17 is modified for that superpixel so that: (a) in Step 1705, a computer determines storage values for each of the storage devices for each of the pixels in the superpixel that are members of the kth pixel set; and (b) in Step 1707, a computer determines that the maximum storage value, out of these storage values, is stored in the xth storage device of one of these pixels.","FIG.","18 is a flowchart for decoding n-ary code, after storage modulation in which all of the photodiode charge is stored for later readout.","In FIG.","18, the code that is being decoded has m digits, and each pixel has n storage devices.","Decoding for each superpixel includes the following steps: A computer sets k equal to zero (Step 1801).","A computer evaluates if k is greater than m−1.","(Step 1803) If yes, then decoding stops for that superpixel, and the computer repeats the decoding for each of the superpixels, until all of the superpixels are decoded.","(Step 1815) If no, then a computer detects the storage value (i.e., level of charge stored in a storage device) for each of the multiple storage devices of the kth pixel.","(Step 1805) A computer: (a) determines the maximum storage value, out of these storage values (Step 1807), (b) determines that the maximum storage value is stored in the xth storage device for the kth pixel (Step 1809), (c) sets the kth digit of the code to x−1 (Step 1811), and sets k equal to k+1 (Step 1813).","If a superpixel has more than one pixel that is a member of the kth pixel set, then the method in FIG.","17 is modified for that superpixel so that: (a) in Step 1705, a computer determines storage values for each of the storage devices for each of the pixels in the superpixel that are members of the kth pixel set; and (b) in Step 1707, a computer determines that the maximum storage value, out of these storage values, is stored in the xth storage device of one of these pixels.","Analog Modulation In some cases, the modulation signals are analog signals.","In some cases, modulations signals (either digital or analog) undergo at least one change between camera frames.","FIG.","19 is diagram that illustrates three examples of analog modulation signals that change from frame to frame.","Signal 1901 is an aperiodic signal in both frame 1 and frame 2.Signal 1903 is a periodic signal that is sinusoidal in frame 1 and non-sinusoidal in frame 2.In frame 1, signal 1905 is a periodic triangle wave that is shifted upward so that the minimum value is zero.","In frame 2, signal 1905 is aperiodic.","In some cases, an analog modulation signal is negative at times, such as signal 1901 at time 1907 in FIG.","19.In some cases, a “negative” value of a modulation signal is implemented as follows: the storage is pre-charged by a fixed amount of charge.","For a negative portion of the modulation signal, a transfer gate is opened to release an amount of charge from the storage device proportional to the absolute value of the modulation signal.","During the readout phase, a computer treats the pre-charged amount as the zero value, treats an amount of charge below this value as a negative readout; and treats an amount of charge larger than the pre-charge amount as a positive readout.","Light Modulation In some implementations, modulation signals control the intensity of light incident on the photodiode of a pixel.","FIG.","20 is a conceptual diagram illustrating the use of a reflective SLM (spatial light modulator) for modulating the intensity of light incident on the photodiodes of pixels in a superpixel.","In the example shown in FIG.","20, light from a scene 2001 strikes reflective SLM 2003 and is selectively reflected, such that which of the pixels, if any, of a superpixel 2005 are illuminated by reflected light from SLM 2003 at any given time during a camera frame is controllable.","For example, which pixels, out of 2007, 2009 and 2011, are illuminated by reflected light from SLM 2003 varies during a single camera frame.","For example, in some cases, during a single camera frame: (a) at some times pixel 2007 is illuminated by reflected light from SLM 2003 but pixels 2009 and 2011 are not; and (b) at other times pixels 2007 and 2009 are illuminated by reflected light from SLM 2003 but pixel 2011 is not.","In some cases, the reflective SLM comprises a DMD (digital micromirror device) or a reflective LCOS (liquid crystal on silicon) device.","FIG.","21 is a ray diagram that shows a DMD selectively reflecting light from a scene at a particular time, such that reflected light is steered toward some, but not all, of the pixels in a superpixel of an image sensor.","In the example shown in FIG.","21, the pixels in the image sensor and pixels of the DMD array are optically aligned, such that each pixel of the DMD corresponds to a pixel of the image sensor.","The pixels in the DMD array are switched between two states, “A” and “B”.","When the mirror for a DMD pixel is in the “A” state, the mirror reflects the light to the corresponding pixel in the image sensor.","When the mirror for a DMD pixel is in the “B” state, the light is reflected in another direction.","By switching a DMD pixel between these two states, the light incident on the corresponding pixel of the image sensor is modulated, and thus the response of the pixel to the light coming from the scene is modulated.","In the example shown in FIG.","21, pixels in a DMD array 2105 are optically aligned with pixels in image sensor 2103.For example, DMD pixels 2111, 2113 and 2115 correspond to image sensor pixels 2121, 2123 and 2125, respectively.","Light from a scene 2101 is striking DMD pixels 2111, 2113 and 2115.DMD pixels 2111 and 2113 are in state “A”, such that light reflects from these pixels to image sensors 2123 and 2123, respectively.","DMD pixel 2115 is in state “B”, such that light reflects from this DMD pixel in a direction away from image sensor 2125, thus causing the reflected light not to reach image sensor pixel 2125.Image sensor pixels 2111, 2113 and 2115 are all in the same superpixel.","FIG.","22 is a conceptual diagram illustrating the use of a transmissive SLM for modulating light incident on photodiodes of pixels in a superpixel.","In the example shown in FIG.","22, light from a scene 2201 passes through transmissive SLM 2203, and is selectively attenuated, such that which of the pixels, if any, of a superpixel 2005 are illuminated by light passing through the SLM at any given time during a camera frame is controllable.","For example, which pixels, out of 2207, 2209 and 2211, are illuminated by light passing through SLM 2203 varies during a single camera frame.","For example, in some cases, during a single camera frame: (a) at some times pixel 2207 is illuminated by light passing through SLM 2203 but pixels 2209 and 2211 are not; and (b) at other times pixels 2207 and 2209 are illuminated by light passing through SLM 2203 but pixel 2011 is not.","In some cases, the transmissive SLM comprises an LCD (liquid crystal display) or an array of ferromagnetic shutters.","FIG.","23 is a ray diagram showing an LCD selectively attenuating light from a scene at a particular time, such that light passing through the LCD reaches some, but not all, of the pixels of a superpixel in an image sensor.","In the example shown in FIG.","21, the pixels in the image sensor and pixels of the LCD are optically aligned, such that each pixel of the LCD corresponds to a pixel of the image sensor.","The pixels in the LCD array are switched between two states, “on” and “off”.","When an LCD pixel is in the “on” state, light from the scene passes through the LCD pixel and travels to the corresponding pixel in the image sensor.","When an LCD pixel is in the “off” state, the LCD pixel is opaque and blocks light.","By switching an LCD pixel between these two states, the light incident on the corresponding pixel of the image sensor is modulated, and thus the response of the pixel to the light coming from the scene is modulated.","In the example shown in FIG.","23, pixels in LCD 2303 are optically aligned with pixels in image sensor 2309.For example, LCD pixels 2311, 2313, 2315 and 2317 correspond to image sensor pixels 2321, 2323, 2325 and 2327, respectively.","Light from a scene 2301 is striking LCD pixels 2311, 2313, 2315 and 2317.LCD pixels 2311, 2313, 2315 are in the “on” state, such that light passes through these LCD pixels and travels to image sensors 2321, 2323 and 2325, respectively.","LCD pixel 2317 is in the “off” state, such that LCD pixel 2317 is opaque, thus preventing light from passing through LCD pixel 2317 and traveling to image sensor pixel 2327.Image sensor pixels 2321, 2323, 2325 and 2327 are all in the same superpixel.","In FIG.","23, a camera 2307 includes a lens 2305 and the image sensor 2309.The lens bends light from the LCD 2303.Similarly, in some cases: (a) a lens is interposed between a reflective SLM (such as a DMD or reflective LCOS) and the image sensor, and (b) the lens bends light rays that travel from the reflective SLM through the lens to the reflective SLM.","FIGS.","24A, 24B and 24C are each a diagram of an optical system that includes a transmissive SLM.","In each of FIGS.","24A, 24B and 24C, the SLM selectively attenuates light, such that at different times during a single camera frame, the SLM blocks light from reaching different sets of the pixels in the image sensor.","In FIG.","24A, a transmissive SLM 2401 is adjacent to the image sensor 2405.In FIG.","24A, light travels from an object in the scene 2403 through an imaging lens 2407, then through the SLM 2401, and then to the image sensor 2405.In FIG.","24B, an imaging lens 2407 is positioned between the transmissive SLM 2401 and the image sensor 2405.In FIG.","24B, light travels from an object in the scene 2403, then through the SLM 2401, then through an imaging lens 2407, and then to the image sensor 2405.In FIG.","24C, a field lens and relay lens are positioned between the transmissive SLM 2401 and the image sensor 2405.In FIG.","24C, light travels from an object in the scene 2403, then through an imaging lens 2407, then through the SLM 2401, then through a field lens 2411, then through a relay lens 2409, and then to the image sensor 2405.In some implementations in which an SLM is used, a computer separately controls each pixel in the SLM, and thus the computer controls the size and shape of a superpixel in the image sensor.","For example, in some cases, a computer sends signals to a reflective or transmissive SLM, such that 9 pixels comprise a 3×3 pixel superpixel, or such that 12 pixels comprise a 4×3 pixel superpixel, or such that 16 pixels comprise a 4×4 pixel superpixel.","In some cases, a reflective or transmissive SLM does not have the same size or shape as the image sensor.","In those cases: (a) some pixels in the image sensor do not correspond to pixels in the SLM; and (b) light modulation is applied only to pixels in the image sensor that are aligned with pixels in the SLM.","In some cases: (a) the pixels in the SLM and camera are not precisely aligned; and (b) pixels for which the imprecision exceeds a given threshold are ignored.","The value at that position is interpolated or returned as “unknown”.","In many cases where a reflective or transmissive SLM is used, each pixel has only storage device that is dedicated to that pixel and does not receive charge from any other pixel during the exposure time of a camera frame.","Comparison to Time-Multiplexed Structured Illumination It is interesting to compare this invention to conventional time-multiplexed structured illumination.","FIG.","25 is a conceptual diagram that shows a prior art example of conventional time-multiplexed structured illumination.","In FIG.","25, the camera 2511 sensitivity is not modulated.","The laser 2503 and a Powell lens (not shown) project a plane of laser light 2505.The line of laser light 2505 sweeps across the scene during each camera frame.","The intensity of the laser light is modulated by a binary modulation pattern, causing the laser light to turn on and off repeatedly during a single sweep.","The camera captures a single frame during the sweep of the laser light across the scene.","In the image 2517 captured during this frame, the dark stripes 2533, 2535, 2537, 2539 correspond to the times during the sweep at which the laser light is turned off.","In conventional time-multiplexed structured illumination (such as that shown in FIG.","25): (a) n separate modulation signals that comprise the n-bit code are applied during n separate frames of the camera, one modulation signal per frame, to modify illumination of the scene; and (b) the sensitivity of the camera to light is not modulated.","In contrast, in illustrative implementations of this invention: (a) all n separate modulation signals that comprise an n-bit code are applied during a single frame of a camera, to separately modify the response of n pixels in each superpixel to incident light; and (b) the intensity of the light source is kept constant during the sweep of the plane of light.","In illustrative implementations, this invention captures in a single camera frame the same type of data as is captured during multiple camera frames with time-multiplexed structured illumination.","Capturing all of the data in a single frame (in illustrative implementations of the present invention) rather than in multiple frames (as in conventional time-multiplexed structured illumination) has the desirable effect of reducing distortion and artifacts in 3D sensing that are caused by motion blur.","3D Scanning In illustrative implementations, this invention is used for 3D scanning—i.e., for detection of the 3D position of points in a scene.","In illustrative implementations, a system comprises at least one camera with a modulatable image sensor, an optional ordinary camera, a control unit, a processing unit, and at least one illumination unit.","Modulation of pixels of a superpixel during a camera frame creates a specific code in the pixels of the superpixel In this system, a light source emits light, such that the position of the intersection of the light and the scene changes over time.","In illustrative implementations, the spatio-temporal characteristics of the light source are such that the spatial position of a point of the scene captured by a superpixel is computationally recoverable from the camera calibration, the relative position of the light source and the camera, and the charge values recorded by the pixels of the superpixel during a single frame of a camera.","In illustrative implementations, the spatiotemporal characteristics of the light source are such that: (a) for a given point in the scene, the time function of the intensity of direct illumination from the light source in a point of the scene exhibits only one peak; and (b) the intersection of (1) the set of the points illuminated at time t and (2) the pixel ray of the superpixel has only one solution, given constraints consisting of the field of view of the camera, light source field of view, angle of the light emitted by the light source, and the relative position of camera and the light source.","FIG.","26 is a conceptual diagram that illustrates a moving line of light produced by controlled movement of a light source (not shown in FIG.","26).","For example, in some cases the light source comprises an object that emits light, such as a laser or directional LED.","In other cases, the light source comprises a specular surface (such as a galvanometer-actuated mirror) that reflects light.","In the example shown in FIG.","26, a line of light sweeps across a scene, such that it intersects the scene at different spatial positions at times 2601, 2603, 2605, 2607, 2609.FIGS.","27A, 27B and 27D show three examples of light sources that produce a line of light that sweeps across a scene, in some implementations of this invention.","FIG.","27A is a diagram, which shows a rotating mirror that reflects a rotating line of light.","The mirror 2701 rotates about axis of rotation 2703, which axis is perpendicular to FIG.","27A.","A laser 2705 shines a laser beam through a Powell lens (not shown in FIG.","27A).","The Powell lens transforms the laser beam into a plane of laser light.","As the mirror rotates, the angle of the plane of reflected laser light varies as a function of time.","For example, at one time during the sweep, the plane of the laser light is aligned with direction 2711, and at another time during the sweep the plane of the laser light is aligned with direction 2713.FIG.","27B is a diagram, which shows a projector 2721 that projects a moving line of light.","The line of light is aligned with different directions at different times.","For example, the line of light is aligned, at different times, with directions 2723, 2725, 2727.FIG.","27C is a diagram, which shows an array of directional light sources (e.g., 2731, 2733, 2735, 2737) that, taken together, emit a moving line of light.","The line of light is aligned with different directions at different times.","For example, the line of light is aligned, at different times, with directions 2741, 2743, 2745.In illustrative implementations, 3D scanning is implemented as follows, for each superpixel: (a) n modulation signals are applied to n separate sets of pixels in a superpixel during a single camera frame, one modulation signal per pixel set, such that at least pixel in the superpixel is a member of each pixel set; (b) each modulation signal modulates the response of pixels to light from a scene, which light is incident on the pixel unit; (c) a computer determines a unique permutation of the n modulation signals, which permutation occurred at a time (the “hit time”) when the intensity of light reflected from the scene and incident on the pixel unit reached a maximum for the frame; (d) a computer uses this unique permutation to perform a first algorithm to compute 3D coordinates of a point in the scene, which point is the position in the scene from which light reflected directly to the superpixel at the hit time; and (e) the first algorithm includes computing the 3D coordinates of the point by triangulation or includes accessing values from a lookup table, which lookup table was computed by a second algorithm that includes computing 3D depth by triangulation.","In some implementations, depth-sensing is implemented as follows: The n pixels in the superpixel record n separate modulation signals during a single frame of the camera, which correspond to the n bits of an n-bit code.","A rotating mirror causes a plane of laser light to sweep across a scene during each camera frame.","A complete sweep of the laser plane of light occurs during each camera frame.","There are 2n permutations of the n-bit code, corresponding to 2n timeslots in each camera frame.","The intensity of incident light at the superpixel is highest during a single timeslot in which the laser light reflects from the scene to the superpixel.","Based on the permutation of the n modulation signals that is recorded by the superpixel at the “hit point” (when the intensity of incident light is highest), a computer determines the timeslot during which the hitpoint occurred.","This timeslot in turn uniquely identifies the angle of rotation of the plane of laser light when the hitpoint occurred.","From the angle of rotation of the plane of laser light, and from the known positions of the light source and of the pixel ray for the pixel, a computer calculates the 3D coordinates of the intersection of the pixel ray and the plane of laser light.","This intersection is located at the scene point that directly reflected the laser light to the superpixel.","This process is repeated for each scene point, yielding a cloud of computed 3D points in the scene.","In some 3D scanning implementations of this invention, one or more processors (e.g., in processing unit 2805 in FIG.","28) perform calculations that take the camera output, calibration, and other static or dynamic parameters, and produce a description of the scene, including a 3D reconstruction of the surface geometry of the scene.","In some 3D scanning implementations of this invention, binary Gray code of length 9 is used for pixel set modulation.","The illumination subsystem projects a sweeping laser line.","The 9-bit vector represents the time t (within the frame 0), where U-Resolution is the horizontal number of pixels in the image sensor, and V-Resolution is the vertical number of pixels in the image sensor.","In some cases, the image plane is a planar surface and the coordinate system consists of 2 orthogonal axes U and V. In another implementation of the invention, the image sensor is a curved surface.","Light reflects from the objects in the scene, passes through camera optics (including, in many case, a lens) and forms an image on the sensor surface.","The image captured by the image sensor has the same coordinate system as the image sensor.","The camera has a camera center and the image plane is in front of the camera center.","The perpendicular distance between camera center and image plane is equal to the focal distance) of the camera.","The line perpendicular to the image plane, which crosses the camera center is the principal axis.","The intersection of the principal axis with the image plane is called the principal point (p).","The camera coordinate system is a local Cartesian coordinate system with 3 orthonormal axes.","The origin of the coordinate system is in the camera center c. The x-axis has the same direction as the sensor's u-axis, the y-axis has the same direction as v-axis and the z-axis has the same orientation as principal axis).","Each camera subsystem has its own Camera coordinate system.","The coordinate system of the scene, the World Coordinate System, is a global coordinate system.","The coordinate transforms between any camera coordinate system and the world coordinate system are standard coordinate conversions (represented by a coordinate conversion matrix and its inverse transform).","The camera coordinate system is the same as camera subsystem coordinate system.","The coordinate conversion matrix Rt is R t = ( r 1 , 1 r 1 , 2 r 1 , 3 t 1 r 2 , 1 r 2 , 2 r 2 , 3 t 2 r 3 , 1 r 3 , 2 r 3 , 3 t 3 ) where, ri,j is rotation parameter, and ti is translation parameter.","The projection from world coordinates to image coordinates is performed as follows.","The world coordinate of a point in the scene is xh=(x, y, z, 1)T—in homogeneous coordinates.","World coordinates are converted to camera coordinate space by matrix multiplication, as follows: x=Rt*xh Point x is projected to a normalized image plane (which is located at a focal distance of 1 from the camera center).","The coordinates of Point x in the scene, as projected to the normalized image plane, are x n = ∏ * x , where ∏ = ( 1 0 0 0 0 1 0 0 0 0 1 0 ) To convert to image coordinates xi, the xn is multiplied by a Camera Matrix A (which represents camera intrinsic parameters) A = ( α x 0 x 0 0 α y y 0 0 0 1 ) x i = A * x n In some implementation of the system, a transformation E (mapping 2D homogeneous space to 2D homogeneous space) compensates (at least partially) for optical distortion of the lens system.","The image coordinate is computed as follows.","xi=A*e[Π*(Rt*xh)] Having specific location of the pixel xi, there exist a bijection between image coordinates of a point xi and a corresponding normalized coordinates xn, (coordinates on normalized image plane).","Having the normalized coordinates xn, there exists an infinite number of points, each projecting to xn on the normalized image plane.","All of these points lie on a half-line (ray).","The equation of the half line is x=c+(xn−c)*d where x is a vector of coordinates of a 3D point in space, c is a vector of a coordinates of the center of the camera (3D point), xn is a vector of normalized coordinates of the point xi and d>0 is a real number equal to the distance (parameter).","The symbol “*” is the multiplication of vector by scalar.","This relation between 2D image coordinate and the 3D half-line is called image point/coordinate re-projection.","In some alternative implementations of the invention, a more complex geometrical model is used.","In this model, the projection of a pixel into space is treated as a distribution function of possible light participation on a final pixel intensity.","In some cases, a 3D scanning system employs triangulation to determine depth and a plane of laser light to illuminate the scene.","In such a laser triangulation system, the calibration is sometimes performed as follows.","The calibration is done in iterations.","At first, the method for calibrating the camera subsystem(s) is performed as stated before.","For calibrating the surface in the space, which is lit by the laser, calibration pattern comprising of multiple circles (such as 3301, 3303, 3305, 3307) is used.","In the process, each of the camera subsystem captures images of the calibration pattern (the white areas comprise a diffuse surface with albedo near 1, the black areas comprise a diffuse surface with albedo near 0.5).","The calibration pattern is printed on a stable planar surface (e.g.","on top of glass table).","During the exposure of the camera, the mutual position of the camera subsystem(s), the laser and the calibration pattern is fixed.","At first, the camera(s) captures the image of a calibration pattern illuminated by ambient light, while the laser is off.","From this frame, for every camera, the algorithm computes the equation of plane, which corresponds (during this step of calibration) to the planar surface of the calibration pattern (This part of the process is a sub-part of the camera calibration).","The position/orientation of all elements of the system stays fixed, while camera(s) take image of the pattern lit by the laser (the laser is turned on before the second exposure).","The laser light projects image features (curve of highly illuminated points) on the captured image of the calibration pattern, which show multiple positions of the calibration pattern.","The algorithm detects these features using thresholding and finds the points of said curve with subpixel accuracy by finding the center of gravity of the intensity values in the cross-section of the said curve (a different sub-pixel strategy may be used).","For example, if the projection of the laser light in the image is a curve maintaining vertical direction, the algorithm processes the image row by row, analyzing the center of gravity of the laser light in all image rows (if there are points above the threshold).","The representation of the curve is a continuous (from a geometrical point of view) chain of 2D image coordinates.","The algorithm re-projects these coordinates into 3D, which gives a set of half-lines directing from camera center.","After that, the algorithm computes the 3D intersections of half-lines with the plane of the calibration patterns.","These 3D coordinates are stored in memory as the chain (sample), which is a 3D representation of the projection of the laser light.","The operator then changes the position of the calibration pattern (in some implementations, a robotic arm automatically changes the position of the calibration pattern), so that the new position of the calibration pattern defines a plane, that is different from all previous.","During the calibration process, the operator/robot places the calibration pattern to multiple positions to ensure homogeneous coverage of measured samples in the measurement range of the system.","After sufficient number of samples is captured (at least 2), a geometrical representation of the laser illuminated 3D surface (e.g.","ruled surface) is computed by minimizing the error (e.g.","mean square distance) of measured sample points and the geometrical representation of the surface.","Triangulation In some implementations, the system computes the 3D position of the surface points in the field of view of the camera subsystem.","For every pixel of the camera, the algorithm computes a pixel ray.","The pixel ray is the re-projection (the half-line from the camera center).","To compute the exact 3D position along the half-line, the algorithm computes d in the equation using an additional constraint.","Specifically, the additional constraint is that the plane and the half-line line going from the camera center through the pixel are never parallel, i.e.","there is always an intersection (as discussed below).","In some implementations, the distance d is computed directly and substituted into the equation.","In some implementations, the distance d is computed from triangulation principle.","The additional constraint is either a plane or second half-line where the specific point lies.","For the plane as additional constraint (the plane and the pixel's re-projection can not be parallel), the 3D point x for a specific pixel p has to satisfy 2 criteria: x=c+(xn−c)*d np·x+dp=0 where np, is a 3D normal vector of the plane, dp is the Euclidian distance between the plane and the origin of the coordinate system and symbol “·” is the dot product of two 3D vectors.","To get the exact 3D point x, the algorithm performs an algorithm to compute unknown d: d=(np·c+dp)/(np·(c−xn)) where symbol “/” is the division of real numbers.","Because the line and the plane are not parallel, it follows that (np·c−np·xn) is non-zero, and that d exists.","A computer calculates x if the d is >0.x=c+(xn−c)*(np·c+dp)/(np·(c−xn)) In some implementations, 3D position of a surface points in the scene is retrieved using laser light, camera and triangulation technique.","For example, the system shown in FIG.","28 uses laser triangulation.","Laser light emits from the illumination subsystem 2801 in form of laser line(s), laser dot(s) or different light shape (e.g.","Ruled surface in 3D).","The mutual position and orientation of every Illumination subsystem and every camera subsystem is known in any time t. In time t, the Illumination subsystem emits light on the scene 2811.For every pixel of the camera, if the laser illuminates a part of the scene that is observed by the pixel, the processing unit 2805 computes the 3D position of the illuminated part of the scene.","All points illuminated by the laser lies on a defined 3D surface in the scene.","The pixel of the camera collects light from a ray.","The 3D point lies on intersection of this ray and the surface defined by the laser.","In some cases, there is more that one such intersection and the processing unit chose the final 3D position by other regularization criteria.","In some implementations of laser triangulation, the simple equation of plane is chosen as the representation of the laser illuminated 3D surface.","In this case, the algorithm for plane fitting (based on principal components) is used.","In some implementations of laser triangulation, the mutual position and orientation of the laser and the camera does not change over time.","However, the position, and orientation of the laser source could change in time in a well controlled manner (e.g.","mechanical change in position, rotation, deflection by mirror).","In this case, the calibration is performed for fixed number of different laser source positions/orientations.","The equation of the laser illuminated surface for all other positions/orientations are computed using sufficient mathematical model and interpolation.","In many implementations of triangulation, profile inspection is performed.","In that case, the illumination subsystem comprises the laser line source.","During the measurement, the laser light illuminate single profile of the scene, the camera subsystem captures the projection of the laser light and the algorithm analyze the image with the approach used in part of calibration.","The 3D points represents a profile of the measurement.","Multiple Camera Subsystems In some implementations, the 3D scanning system includes two camera subsystems.","For each camera and each pixel, the algorithm computes time t of the light peak.","The values are stored in time images (the pixel of the images are the values of t).","The first camera subsystem is primary.","For every pixel of the primary camera, the algorithm computes the pixel re-projection.","The corresponding 3D points lies on epipolar lines in the image of the second camera.","On the time image of the second camera, the epipolar line cuts the image, which creates a 1D function of time values.","The algorithm computes any value on the epipolar line using bilinear interpolation from adjacent pixels.","The corresponding projection of the surface point lies on the epipolar line and have the same time t, as the pixel form the primary camera.","The algorithm computes the position of the value t in the 1D function (with subpixel accuracy using bilinear interpolation).","This position corresponds to pixel position on the second camera.","The algorithm re-projects the pixel position as a half-line in 3D.","The algorithm computes the 3D point as an intersection of two half-lines.","An advantage of this approach is higher robustness and accuracy, while the geometry calculations are not dependent on calibration of Illumination subsystem Alternative Implementations In some implementations of the system, the system comprises plurality of illumination subsystems.","In some implementations of this invention, the features in the scene are formed artificially by an illumination subsystem.","There are different coding strategies that create specific coding for different points in the scene.","This allows for more robust and accurate feature detection and position estimation.","In some implementations, this invention operates in multiple modes.","One such mode is a high spatial resolution mode, which uses the same modulation signal for all pixels.","The pixels from different sets are combined to produce one high spatial resolution image.","In this mode, all pixels in the imaging sensor act like one pixel set.","The ability to switch to this mode allows the scanner to select between real-time (lower resolution) mode and non-real-time (multiple sequential camera frames) high resolution mode for a more precise reconstruction.","Alternatively, this invention may be implemented as follows: An aluminum box may serve as a cover for a 3D scanning system.","Inside the box, each of the following components are placed: a camera with ability to regulate the response of its pixels (globally), a (visible) red light laser, rotating mirror, Powell lens, and electronics that drive the rotating mirror.","The Powell lens is a special kind of lens which transforms a laser dot to a line.","As the mirror rotates according to the signal from the computer, the laser line sweeps along the scene over an angle of about 30 degrees.","Instead of having multiple sets of pixels in the imaging sensor during a single frame, the scanner uses only one set of pixels and gathers multiple image frames.","This alternative embodiment is well suited to 3D scan with high spatial resolution, but is not well suited for scanning a moving object.","In some cases, a shape of illumination other than a straight line is used.","For example, in some cases: (a) the pattern is formed by a laser using a special lens (variation of Powell lens); (b) a light source projects a line to a non-flat mirror (e.g.","a spherical or parabolic mirror); or (c) the light source comprises LED lights that are arranged in a spherical, circular, elliptical, parabolic or hyperbolic shape, and that project a curved surface.","In some implementations of the system, the system operates either in realtime mode (with different pixel modulation signals), or in high-res mode.","In high-res mode, the scanning process consists of multiple exposures and laser sweeps in succession.","In every exposure, the Control units apply the modulation signals to whole image sensor.","The multiple pixel values consists of values captured in succession.","This allows to compute the time t of the light peak and appropriate 3D point for every pixel in the image sensor.","In some implementations of the invention, the system uses different coding strategies to encode the time of pixel illumination alongside Gray codes.","In a preferred embodiment, the control units creates a set of periodic sinusoidal functions with equal period and different phase shift (e.g.","4 sinusoidal functions shifted by π/2 rad each after another).","The set of modulation function (phase shifting modulation functions) is applied to appropriate number of image sets (in some cases, multiple image sets are modulated by the same function to collect more samples).","The corresponding pixel sets (and the corresponding pixels in every superpixels) are phase shifting pixels (for the simplicity of description).","The number of periods of the modulation functions increase the possible accuracy of the coding.","In general, the period of the function has to be at least 2 times longer that the time period Ts the laser line needs to swipe through the area of projection of individual pixels of the sensor.","In some implementations, the distance to measured surface does not affect time Ts.","While the time period Ts is short (due to given constraints), the received illumination (the collected pixel intensity), the values of phase shifting pixels in superpixels, encodes the phase (the position inside the period).","While the coding uses periodic function, the algorithm computes the index of period from the Gray coded pixels (the index time period Ti is shorter than the period of the used sinusoidal functions).","In some implementations, the system uses 4 sinusoidal functions shifted by π/2 rad each after another.","The values of corresponding phase shifting pixels are A0, A1, A2, A3.The algorithm computes the phase value φ using the following equation: ϕ = atan 2 ( A 0 - A 2 , A 1 - A 3 ) atan 2 ( y , x ) = { arctan y x x > 0 arctan y x + π y ≥ 0 , x < 0 arctan y x - π y < 0 , x < 0 + π 2 y > 0 , x = 0 - π 2 y < 0 , x = 0 undefined y = 0 , x = 0 The time t of the light peak is delivered as: t=PeriodIndex*Tperiod+[(φ+π)/(2*π)]*Tperiod where Tperiod is the length of the period of the sinusoidal function, and the PeriodIndex is the index of the period derived from time period Ti.","In some implementations, the system uses phase shifting modulation functions with different period.","For example, first set of phase shifting modulation signal have period of the same length as the exposure T, the second set has period of T/256.The algorithm decodes the phase value of the light peak (the time, when the laser sweeps across the projection of the individual pixel of the sensor) for both sets.","The second phase value represents accurate measurement of the time of the occurrence of the light peak (up to the period index), the first phase value represents unambiguous measurement (Because of the physical limitations of the sensor, such measurement is in the most cases less accurate, than the one from multiple periods phase shifting modulation functions), which the algorithm uses to set the right period index.","In some implementations, the system uses different modulation functions (e.g.","square waves).","In some implementations of the system, the pixels comprises multiple storages.","The modulation signals controls the allocation of the accumulated photo-electrons to different storages.","This allows for capturing multiple phase shifting values in single pixel.","Computers In exemplary implementations of this invention, one or more electronic computers (e.g.","2803, 2805) are programmed and specially adapted: (1) to control the operation of, or interface with, hardware components of an imaging system, including by modulating the transfer of charge in a pixel photodiode to one or more storage devices, and for controlling a reflective or transmissive SLM to control intensity of light incident on image sensor pixels; (2) to control the operation of, or interface with, hardware components of a 3D scanning system, including an illumination subsystem and a camera subsystem; (3) to process data captured by an image sensor; (4) to perform triangulation to reconstruct 3D surface geometry; (5) to perform calibration, including calibration of any camera or light source; (6) to output modulation signals for modifying the response of pixels to incident light; (7) to output control signals to synchronize illumination of a scene with modulation of pixels; (8) to perform any other calculation, computation, program, algorithm, computer function or computer task described or implied above, including any optimization algorithm; (9) to receive signals indicative of human input; (10) to output signals for controlling transducers for outputting information in human perceivable format; and (11) to process data, to perform computations, to execute any algorithm or software, and to control the read or write of data to and from memory devices.","The one or more computers may be in any position or positions within or outside of a 3D scanning system or imaging system.","For example, in some cases (a) at least one computer is housed in or together with other components of the system, and (b) at least one computer is remote from other components of the system.","The one or more computers are connected to each other or to other components in the system either: (a) wirelessly, (b) by wired connection, or (c) by a combination of wired and wireless connections.","In exemplary implementations, one or more computers are programmed to perform any and all calculations, computations, programs, algorithms, computer functions and computer tasks described or implied above.","For example, in some cases: (a) a machine-accessible medium has instructions encoded thereon that specify steps in a software program; and (b) the computer accesses the instructions encoded on the machine-accessible medium, in order to determine steps to execute in the program.","In exemplary implementations, the machine-accessible medium comprises a tangible non-transitory medium.","In some cases, the machine-accessible medium comprises (a) a memory unit or (b) an auxiliary memory storage device.","For example, in some cases, a control unit in a computer fetches the instructions from memory.","In illustrative implementations, one or more computers execute programs according to instructions encoded in one or more a tangible, non-transitory, computer-readable media.","For example, in some cases, these instructions comprise instructions for a computer to perform any calculation, computation, program, algorithm, computer function or computer task described or implied above.","For example, in some cases, instructions encoded in a tangible, non-transitory, computer-accessible medium comprise instructions for a computer to: (1) to control the operation of, or interface with, hardware components of an imaging system, including by modulating the transfer of charge in a pixel photodiode to one or more storage devices, and for controlling a reflective or transmissive SLM to control intensity of light incident on image sensor pixels; (2) to control the operation of, or interface with, hardware components of a 3D scanning system, including an illumination subsystem and a camera subsystem; (3) to process data captured by an image sensor; (4) to perform triangulation to reconstruct 3D surface geometry; (5) to perform calibration, including calibration of any camera or light source; (6) to output modulation signals for modifying the response of pixels to incident light; (7) to output control signals to synchronize illumination of a scene with modulation of pixels; (8) to perform any other calculation, computation, program, algorithm, computer function or computer task described or implied above, including any optimization algorithm; (9) to receive signals indicative of human input; (10) to output signals for controlling transducers for outputting information in human perceivable format; and (11) to process data, to perform computations, to execute any algorithm or software, and to control the read or write of data to and from memory devices.","Definitions The terms “a” and “an”, when modifying a noun, do not imply that only one of the noun exists.","To compute “based on” specified data means to perform a computation that takes the specified data as an input.","Here are some non-limiting examples of a “camera”: (a) an optical instrument that records images; (b) a digital camera; (c) a video camera; (d) a camera that uses photographic film or a photographic plate; (e) a light field camera; (f) an imaging system, (g) a light sensor; (h) a time-of-flight camera; (h) apparatus that includes a light sensor or an array of light sensors; and (i) apparatus for gathering data about light incident on the apparatus.","The term “camera” includes any computers that process data captured by the camera.","The term “comprise” (and grammatical variations thereof) shall be construed as if followed by “without limitation”.","If A comprises B, then A includes B and may include other things.","The term “computer” includes any computational device that performs logical and arithmetic operations.","For example, in some cases, a “computer” comprises an electronic computational device, such as an integrated circuit, a microprocessor, a mobile computing device, a laptop computer, a tablet computer, a personal computer, or a mainframe computer.","For example, in some cases, a “computer” comprises: (a) a central processing unit, (b) an ALU (arithmetic/logic unit), (c) a memory unit, and (d) a control unit that controls actions of other components of the computer so that encoded steps of a program are executed in a sequence.","For example, in some cases, the term “computer” also includes peripheral units, including an auxiliary memory storage device (e.g., a disk drive or flash memory).","However, a human is not a “computer”, as that term is used herein.","“Defined Term” means a term or phrase that is set forth in quotation marks in this Definitions section.","The term “e.g.” means for example.","The fact that an “example” or multiple examples of something are given does not imply that they are the only instances of that thing.","An example (or a group of examples) is merely a non-exhaustive and non-limiting illustration.","Unless the context clearly indicates otherwise: (1) a phrase that includes “a first” thing and “a second” thing does not imply an order of the two things (or that there are only two of the things); and (2) such a phrase is simply a way of identifying the two things, respectively, so that they each can be referred to later with specificity (e.g., by referring to “the first” thing and “the second” thing later).","For example, unless the context clearly indicates otherwise, if an equation has a first term and a second term, then the equation may (or may not) have more than two terms, and the first term may occur before or after the second term in the equation.","A phrase that includes a “third” thing, a “fourth” thing and so on shall be construed in like manner.","The term “for instance” means for example.","“Forward”, in the context of an SLM, means to reflect light from the SLM or to transmit light that passes through the SLM.","“Forwarding rate” of an SLM pixel relative to an imaging pixel means a ratio of (a) intensity of light incident on an SLM pixel and (b) intensity of light that is incident on the imaging pixel and forwarded by the SLM pixel.","In the context of a camera (or components of the camera), “front” is optically closer to the scene being imaged, and “rear” is optically farther from the scene, during normal operation of the camera.","In the context of a display device (or components of the display device), “front” is optically closer to a human viewer, and “rear” is optically farther from the viewer, when the viewer is viewing a display produced by the device during normal operation of the device.","The “front” and “rear” of a display device continue to be the front and rear, even when no viewer is present.","“Herein” means in this document, including text, specification, claims, abstract, and drawings.","“Imaging pixel” means a component of an imaging sensor, which component takes measurements of intensity of light incident on a region of the imaging sensor, such that the intensity is measured for the entire region and is not separately measured for any subregion of the region.","“Imaging superpixel” means a set of imaging pixels, such that each imaging pixel in the set is a horizontal, vertical or diagonal neighbor of another imaging pixel in the set.","As used herein: (1) “implementation” means an implementation of the present invention; (2) “embodiment” means an embodiment of the present invention; (3) “case” means an implementation of the present invention; and (4) “use scenario” means a use scenario of the present invention.","The term “include” (and grammatical variations thereof) shall be construed as if followed by “without limitation”.","“Intensity” means any measure of or related to intensity, energy or power.","For example, the “intensity” of light includes any of the following measures: irradiance, spectral irradiance, radiant energy, radiant flux, spectral power, radiant intensity, spectral intensity, radiance, spectral radiance, radiant exitance, radiant emittance, spectral radiant exitance, spectral radiant emittance, radiosity, radiant exposure or radiant energy density.","In the case of a ratio of two intensities, both of the intensities in the ratio have the same SI units.","“I/O device” means an input/output device.","For example, an I/O device includes any device for (a) receiving input from a human, (b) providing output to a human, or (c) both.","For example, an I/O device includes a user interface, graphical user interface, keyboard, mouse, touch screen, microphone, handheld controller, display screen, speaker, or projector for projecting a visual display.","Also, for example, an I/O device includes any device (e.g., button, dial, knob, slider or haptic transducer) for receiving input from, or providing output to, a human.","“Light” means electromagnetic radiation of any frequency.","For example, “light” includes, among other things, visible light and infrared light.","Likewise, any term that directly or indirectly relates to light (e.g., “imaging”) shall be construed broadly as applying to electromagnetic radiation of any frequency.","As used herein, (i) a single scalar is not a “matrix”, and (ii) one or more entries, all of which are zero (i.e., a so-called null matrix), is not a “matrix”.","The “maximum dimension” of an object means the longest Euclidian distance between any two points on the exterior surface of the object.","To “multiply” includes to multiply by an inverse.","Thus, to “multiply” includes to divide.","The term “n-ary” is defined elsewhere in this document.","Two pixels are “neighbors” if the two pixels are positioned such that (i) the two pixels are adjacent to each other in a matrix of pixels and (ii) no pixel is between the two pixels.","“Pixel set” means a set of pixels to which an identical modulation signal is applied.","The term “or” is inclusive, not exclusive.","For example A or B is true if A is true, or B is true, or both A or B are true.","Also, for example, a calculation of A or B means a calculation of A, or a calculation of B, or a calculation of A and B.","A parenthesis is simply to make text easier to read, by indicating a grouping of words.","A parenthesis does not mean that the parenthetical material is optional or can be ignored.","A “read-out frame” means a period of time that begins when an exposure of an imaging pixel to light starts and that ends when digital data is created that is indicative of charge accumulated during the exposure.","“Reflective SLM” means a device that (i) reflects light from the device, and (ii) attenuates the light, such that the amount of attenuation of a light ray incident at a point on a surface of the device depends on at least the 2D spatial position of the point on the surface.","To compute a term that “satisfies” an equation: (a) does not require that calculations involve terms, variables or operations that are in the equation itself, as long as a solution of the equation (subject to error, as described in part (b) of this sentence) is computed; and (b) includes computing a solution that differs from a correct solution of the equation by an error amount, which error amount arises from one or more of (i) rounding, (ii) other computational imprecision, including error due to modeling a continuous signal by a discrete signal or due to using an insufficiently small step size in calculations, and (iii) signal noise or other physical limitations of sensors or other physical equipment.","As used herein, the term “set” does not include a so-called empty set (i.e., a set with no elements) and does not include a set with only one element.","Mentioning a first set and a second set does not, in and of itself, create any implication regarding whether or not the first and second sets overlap (that is, intersect).","The term “signal generator” includes any signal generator, function generator, digital pattern generator, frequency generator and any other electronic device that generates repeating or non-repeating electrical signals, including either digital or analog signals.","“Some” means one or more.","A “spatial light modulator”, also called an “SLM”, means a device that (i) transmits light through the device or reflects light from the device, and (ii) attenuates the light, such that the amount of attenuation of a light ray incident at a point on a surface of the device depends on at least the 2D spatial position of the point on the surface.","A non-limiting example of changing the “sensitivity” of an imaging pixel is to change the state of a circuit so as to control which storage device, out of a set of storage devices, receives a particular electric charge, which electric charge (i) accumulated in a photodiode of the imaging pixel and (ii) will not be and has not been transferred to or from any other storage device in the set.","To say that a set of signals is “separate” means that no signal in the set is a function of any other signal in the set.","A “storage device” means any device for storing electric charge, including a capacitor, floating diffusion or capacitive bin.","“Subregion” of a first region means a part, but not all, of the first region.","As used herein, a “subset” of a set consists of less than all of the elements of the set.","“Substantially” means at least ten percent.","For example: (a) 112 is substantially larger than 100; and (b) 108 is not substantially larger than 100.To say that a thing is “substantially constant” means that the thing has a value that is always within a single range, such that: (a) the lowest value in the range is equal to a constant number minus ten percent of the constant number; and (b) the highest value in the range is equal to the constant number plus ten percent of the constant number.","The term “such as” means for example.","Spatially relative terms such as “under”, “below”, “above”, “over”, “upper”, “lower”, and the like, are used for ease of description to explain the positioning of one element relative to another.","The terms are intended to encompass different orientations of an object in addition to different orientations than those depicted in the figures.","“Transmissive SLM” means a device that (i) transmits light through the device, and (ii) attenuates the light, such that the amount of attenuation of a light ray incident at a point on a surface of the device depends on at least the 2D spatial position of the point on the surface.","A matrix may be indicated by a bold capital letter (e.g., D).","A vector may be indicated by a bold lower case letter (e.g., a).","However, the absence of these indicators does not indicate that something is not a matrix or not a vector.","Except to the extent that the context clearly requires otherwise, if steps in a method are described herein, then the method includes variations in which: (1) steps in the method occur in any order or sequence, including any order or sequence different than that described; (2) any step or steps in the method occurs more than once; (3) different steps, out of the steps in the method, occur a different number of times during the method, (4) any combination of steps in the method is done in parallel or serially; (5) any step or steps in the method is performed iteratively; (6) a given step in the method is applied to the same thing each time that the given step occurs or is applied to different things each time that the given step occurs; or (7) the method includes other steps, in addition to the steps described.","This Definitions section shall, in all cases, control over and override any other definition of the Defined Terms.","For example, the definitions of Defined Terms set forth in this Definitions section override common usage or any external dictionary.","If a given term is explicitly or implicitly defined in this document, then that definition shall be controlling, and shall override any definition of the given term arising from any source (e.g., a dictionary or common usage) that is external to this document.","If this document provides clarification regarding the meaning of a particular term, then that clarification shall, to the extent applicable, override any definition of the given term arising from any source (e.g., a dictionary or common usage) that is external to this document.","To the extent that any term or phrase is defined or clarified herein, such definition or clarification applies to any grammatical variation of such term or phrase, taking into account the difference in grammatical form.","For example, the grammatical variations include noun, verb, participle, adjective, or possessive forms, or different declensions, or different tenses.","In each case described in this paragraph, Applicant is acting as Applicant's own lexicographer.","Variations: This invention may be implemented in many different ways.","No claims are made in this section entitled “Variations”.","For example, no claims are made in paragraphs [A] to [BR] below.","Instead, this section entitled “Variations” helps to support claims.","Paragraphs [A] to [BR] below are descriptions of non-limiting examples of illustrative implementations of this invention [A] A method comprising simultaneously modulating a plurality of imaging pixels in an imaging superpixel by a set of separate modulation signals, such that each imaging pixel in the imaging superpixel is modulated by a modulation signal that causes sensitivity of the imaging pixel to vary over time.","[B] The method of paragraph [A], wherein: (a) the modulation signals each consist of a temporal sequence of modulation states; and (b) the number of times that each specific modulation state occurs, and the order in which the modulation states occur, varies from modulation signal to modulation signal.","[C] The method of paragraph [A], wherein the set of modulation signals, taken together, comprise a code, each of the modulation signals representing a digit of the code.","[D] The method of paragraph [C], wherein the code is a binary code and each of the modulations signals represents a bit of the code.","[E] The method of paragraph [C], wherein the code is a binary gray code.","[F] The method of paragraph [C], wherein the code is a 9-bit binary gray code.","[G] The method of paragraph [C], wherein the code is an n-ary code.","[H] The method of paragraph [A], wherein: (a) the modulating occurs during a readout-frame, which readout-frame includes an exposure period; and (b) each imaging pixel in the imaging superpixel includes a photodiode that, during the exposure period, transfers electric charge to only one storage device, such that at multiple times during the exposure period, electric charge is transferred from the photodiode to the storage device.","[I] The method of paragraph [H], wherein, at multiple other times during the exposure period, electric charge is drained from the photodiode, without being saved for later readout.","[J] The method of paragraph [H], wherein, during the exposure period, the storage device receives electric charge only from the photodiode.","[K] The method of paragraph [A], wherein: (a) the modulating occurs during a readout-frame, which readout-frame includes an exposure period; and (b) each imaging pixel in the imaging superpixel includes a photodiode that, at multiple times during the exposure period, transfers electric charge to a set of storage devices, such that: (i) at any given time at which a transfer of electric charge from the photodiode to a storage device occurs, electric charge is being transferred to only one of the storage devices, and electric charge is not being transferred to any other storage device, and (ii) electric charge is transferred from the photodiode to each of the storage devices during the exposure period.","[L] The method of paragraph [K], wherein, during the exposure period, the storage devices receive electric charge only from the photodiode.","[M] A method comprising simultaneously: (a) modulating a plurality of imaging pixels in an imaging superpixel by a set of separate modulation signals, such that each imaging pixel in the imaging superpixel is modulated by a modulation signal that causes sensitivity of the imaging pixel to vary over time; and (b) using one or more light sources to illuminate a scene by a pattern of light that changes over time.","[N] The method of paragraph [M], wherein: (a) the modulation signals each consist of a temporal sequence of modulation states; and (b) the number of times that each specific modulation state occurs, and the order in which the modulation states occur, varies from modulation signal to modulation signal.","[O] The method of paragraph [M], wherein the pattern of light changes in at least intensity over time.","[P] The method of paragraph [M], wherein the pattern of light changes in at least direction or position, relative to the scene, over time.","[Q] The method of paragraph [M], wherein the pattern of light changes in at least polarization over time.","[R] The method of paragraph [M], wherein the pattern of light changes in at least wavelength or electromagnetic spectrum over time.","[S] The method of paragraph [M], wherein: (a) the pattern of light sweeps across a scene, such that a point in the scene, when directly illuminated by the pattern of light, reflects light directly to the imaging superpixel; (b) the method further comprises using one or more computers to process data indicative of measurements recorded by the imaging superpixel and, based in part on the data, to calculate 3D spatial coordinates of the point.","[T] The method of paragraph [S], wherein the pattern of light comprises a plane of laser light.","[U] The method of paragraph [S], wherein the method includes using a galvanometer-actuated mirror to sweep a plane of laser light across a scene.","[V] The method of paragraph [S], wherein, when calculating 3D spatial coordinates of the point, the computer performs an algorithm that either: (a) involves triangulation; or (b) involves accessing data that was calculated by a computer using an algorithm that involves triangulation.","[W] The method of paragraph [M], wherein the set of modulation signals, taken together, comprise a code, each of the modulation signals representing a digit of the code.","[X] The method of paragraph [W], wherein the code is a binary code and each of the modulation signals represents a bit of the code.","[Y] The method of paragraph [W], wherein the code is a binary gray code.","[Z] The method of paragraph [W], wherein the code is a 9-bit binary gray code.","[AA] The method of paragraph [W], wherein at different times during each sweep of the pattern of light across the scene, the modulation signals, taken together, represent different permutations of the code.","[AB] The method of paragraph [W], wherein the modulation signals, taken together, represent each of the permutations of the code at different times during an entire sweep of the pattern of light across the scene, one permutation at a time.","[AC] The method of paragraph [W], wherein: (a) each entire sweep of the pattern of light across the scene occurs in a time period, which time period consists of a set of subintervals, the total number of subintervals being equal to the number of permutations of the code; (b) during each subinterval, the modulation signals, taken together, represent only one of the permutations of the code; (c) intensity of light incident on the imaging superpixel reaches a maximum value for the entire sweep during a specific subinterval; and (d) a computer analyzes data indicative of measurements taken by imaging pixels of the imaging superpixel and, based on that data, determines the permutation of the code represented by the modulation signals during the specific subinterval.","[AD] The method of paragraph [M], wherein: (a) the modulating occurs during a readout-frame, which readout-frame includes an exposure period; and (b) each imaging pixel in the imaging superpixel includes a photodiode that, during the exposure period, transfers electric charge to only one storage device, such that at multiple times during the exposure period, electric charge is transferred from the photodiode to the storage device.","[AE] The method of paragraph [AD], wherein, at multiple other times during the exposure period, electric charge is drained from the photodiode, without being saved for later readout.","[AF] The method of paragraph [AD], wherein, during the exposure period, the storage device receives electric charge only from the photodiode.","[AG] The method of paragraph [M], wherein: (a) the modulating occurs during a readout-frame, which readout-frame includes an exposure period; and (b) each imaging pixel in the imaging superpixel includes a photodiode that, at multiple times during the exposure period, transfers electric charge to a set of storage devices, such that: (i) at any given time at which a transfer of electric charge from the photodiode to a storage device occurs, electric charge is being transferred to only one of the storage devices, and electric charge is not being transferred to any other storage device, and (ii) electric charge is transferred from the photodiode to each of the storage devices during the exposure period.","[AH] The method of paragraph [AG], wherein, during the exposure period, the storage devices receive electric charge only from the photodiode.","[AI] A system comprising, in combination: (a) a camera, which camera includes an imaging superpixel; and (b) one or more signal generators for producing a set of separate modulation signals, such that each imaging pixel in the imaging superpixel is modulated by a modulation signal that causes sensitivity of the imaging pixel to vary over time.","[AJ] The system of paragraph [AI], wherein: (a) the modulation signals each consist of a temporal sequence of modulation states; and (b) the number of times that each specific modulation state occurs, and the order in which the modulation states occur, varies from modulation signal to modulation signal.","[AK] The system of paragraph [AI], wherein the set of modulation signals, taken together, comprise a code, each of the modulation signals representing a digit of the code.","[AL] The system of paragraph [AI], wherein the code is a binary code and each of the modulations signals represents a bit of the code.","[AM] The system of paragraph [AI], wherein the code is a binary gray code.","[AN] The system of paragraph [AI], wherein the code is a 9-bit binary gray code.","[AO] The system of paragraph [AI], wherein the code is an n-ary code.","[AP] A system comprising, in combination: (a) a camera, which camera includes an imaging superpixel; (b) one or more signal generators for producing a set of separate modulation signals, such that (i) each imaging pixel in the imaging superpixel is modulated by a modulation signal that causes sensitivity of the imaging pixel to vary over time, and (ii) a modulation signal, out of the set of modulation signals, causes each photodiode in the superpixel, at multiple times during an exposure period of a read-out frame, to transfer electric charge from the photodiode to only one storage device, which storage device does not receive electric charge from any other photodiode during the exposure period.","[AQ] A system comprising, in combination: (a) a camera, which camera includes an imaging superpixel; and (b) one or more signal generators for producing a set of separate modulation signals, such that (i) each imaging pixel in the imaging superpixel is modulated by a modulation signal that causes sensitivity of the imaging pixel to vary over time, and (ii) a modulation signal, out of the set of modulation signals, causes each photodiode in the superpixel, at multiple times during an exposure period of a read-out frame, to transfer electric charge from the photodiode to a set of storage devices, such that (1) at any given time at which a transfer of electric charge from the photodiode to a storage device occurs, electric charge is being transferred to only one of the storage devices, and electric charge is not being transferred to any other storage device, and (2) electric charge is transferred from the photodiode to each of the storage devices during the exposure period.","[AR] A system comprising, in combination: (a) a camera, which camera includes an imaging superpixel; (b) one or more light sources for illuminating a scene by a pattern of light that changes over time; and (c) one or more signal generators for producing a set of separate modulation signals, such that each imaging pixel in the imaging superpixel is modulated by a modulation signal that causes sensitivity of the imaging pixel to vary over time.","[AS] A system comprising, in combination: (a) a camera, which camera includes an imaging superpixel; (b) one or more light sources for illuminating a scene by a pattern of light that sweeps across the scene, such that a point in the scene, when directly illuminated by the pattern of light, reflects light directly to the imaging superpixel; and (c) one or more signal generators for producing a set of separate modulation signals that occur while the scene is illuminated by the pattern of light, such that each imaging pixel in the imaging superpixel is modulated by a modulation signal that causes sensitivity of the imaging pixel to vary over time; and (d) one or more computers for processing data indicative of measurements recorded by the imaging superpixel and for calculating, based on this data, 3D spatial coordinates of the point, by performing an algorithm that either (i) involves triangulation; or (ii) involves accessing data that was calculated by a computer using an algorithm that involves triangulation.","[AT] A system comprising, in combination: (a) a camera, which camera includes an imaging superpixel; and (b) one or more light sources for illuminating a scene by a pattern of light that sweeps across the scene, such that a point in the scene, when directly illuminated by the pattern of light, reflects light directly to the imaging superpixel; (c) one or more signal generators for producing a set of separate modulation signals, such that (i) each imaging pixel in the imaging superpixel is modulated by a modulation signal that causes sensitivity of the imaging pixel to vary over time; (ii) the set of modulation signals, taken together, comprise a code, each of the modulation signals representing a digit of the code.","(iii) each entire sweep of the pattern of light across the scene occurs in a time period, which time period consists of a set of subintervals, the total number of subintervals being equal to the number of permutations of the code; (iv) during each subinterval, the modulation signals, taken together, represent only one of the permutations of the code; (v) intensity of light incident on the imaging superpixel reaches a maximum value for the entire sweep during a specific subinterval; and (d) one or more computers for (i) processing data indicative of measurements recorded by the imaging superpixel, (ii) calculating the permutation of the code represented by the modulation signals during the specific subinterval, and (iii) calculating 3D spatial coordinates of the point.","[AU] A method comprising simultaneously modulating a plurality of SLM pixels in an SLM by a set of separate modulation signals, wherein: (a) the plurality of SLM pixels are optically aligned with an imaging superpixel, such that each respective SLM pixel, in one or more states of the respective SLM pixel, forwards light to an imaging pixel in the imaging superpixel; (b) each respective SLM pixel in the SLM is modulated by a modulation signal, out of the set of modulation signals, that causes a forwarding rate of the respective SLM pixel relative to a imaging pixel to vary over time; (c) the set of modulation signals, taken together, comprise a code, each of the modulation signals representing a digit of the code; (d) at any given time during the modulating, the modulation signals, taken together, represent only one of the permutations of a code; (e) the modulation signals, taken together over a time period that spans at least a portion of the modulating, comprise a temporal sequence of all of the permutations of the code.","[AV] The method of paragraph [AU], wherein the light that is forwarded comprises light reflected by the SLM.","[AW] The method of paragraph [AV], wherein the SLM comprises a digital micromirror device.","[AX] The method of paragraph [AV], wherein the SLM comprises a reflective liquid-crystal-on-silicon device.","[AY] The method of paragraph [AU], wherein the light that is forwarded comprises light that passes through the SLM.","[AZ] The system of paragraph [AY], wherein the SLM comprises a liquid crystal display device.","[BA] A system comprising (a) an SLM; and (b) a camera that includes an imaging superpixel; wherein (i) the plurality of SLM pixels are optically aligned with an imaging superpixel, such that each respective SLM pixel, in one or more states of the respective SLM pixel, forwards light to an imaging pixel in the imaging superpixel; (ii) the plurality of SLM pixels are modulated by a set of separate modulation signals, such that (1) each respective SLM pixel in the SLM is modulated by a specific modulation signal, out of the set of modulation signals, which specific modulation signal causes a forwarding rate of the respective SLM pixel relative to a imaging pixel to vary over time; (2) the set of modulation signals, taken together, comprise a code, each of the modulation signals representing a digit of the code, (3) at any given time during the modulating, the modulation signals, taken together, represent only one of the permutations of a code, and (4) the modulation signals, taken together over a time period that spans at least a portion of the modulating, comprise a temporal sequence of all of the permutations of the code; and (vi) the system also includes a signal generator for producing the set of modulation signals.","[BB] The system of paragraph [BA], wherein the light that is forwarded comprises light reflected by the SLM.","[BC] The system of paragraph [BB], wherein the SLM comprises a digital micromirror device.","[BD] The system of paragraph [BB], wherein the SLM comprises a reflective liquid-crystal-on-silicon device.","[BE] The system of paragraph [BA], wherein the light that is forwarded comprises light that passes through the SLM.","[BF] The system of paragraph [BE], wherein the SLM comprises a liquid crystal display device.","[BG] A system comprising, in combination: (a) a camera, which camera includes an imaging superpixel; and (b) one or more computers that are programmed to output a set of separate modulation signals, such that each imaging pixel in the imaging superpixel is modulated by a modulation signal that causes sensitivity of the imaging pixel to vary over time.","[BH] The system of paragraph [BG], wherein: (a) the modulation signals each consist of a temporal sequence of modulation states; and (b) the number of times that each specific modulation state occurs, and the order in which the modulation states occur, varies from modulation signal to modulation signal.","[BI] The system of paragraph [BG], wherein the set of modulation signals, taken together, comprise a code, each of the modulation signals representing a digit of the code.","[BJ] The system of paragraph [BG], wherein the code is a binary code and each of the modulations signals represents a bit of the code.","[BK] The system of paragraph [BG], wherein the code is a binary gray code.","[BL] The system of paragraph [BG], wherein the code is a 9-bit binary gray code.","[BM] The system of paragraph [BG], wherein the code is an n-ary code.","[BN] A system comprising, in combination: (a) a camera, which camera includes an imaging superpixel; (b) one or more computers that are programmed to output a set of separate modulation signals, such that (i) each imaging pixel in the imaging superpixel is modulated by a modulation signal that causes sensitivity of the imaging pixel to vary over time, and (ii) a modulation signal, out of the set of modulation signals, causes each photodiode in the superpixel, at multiple times during an exposure period of a read-out frame, to transfer electric charge from the photodiode to only one storage device, which storage device does not receive electric charge from any other photodiode during the exposure period.","[BO] A system comprising, in combination: (a) a camera, which camera includes an imaging superpixel; and (b) one or more computers that are programmed to output a set of separate modulation signals, such that (i) each imaging pixel in the imaging superpixel is modulated by a modulation signal that causes sensitivity of the imaging pixel to vary over time, and (ii) a modulation signal, out of the set of modulation signals, causes each photodiode in the superpixel, at multiple times during an exposure period of a read-out frame, to transfer electric charge from the photodiode to a set of storage devices, such that (1) at any given time at which a transfer of electric charge from the photodiode to a storage device occurs, electric charge is being transferred to only one of the storage devices, and electric charge is not being transferred to any other storage device, and (2) electric charge is transferred from the photodiode to each of the storage devices during the exposure period.","[BP] A system comprising, in combination: (a) a camera, which camera includes an imaging superpixel; (b) one or more light sources for illuminating a scene by a pattern of light that changes over time; and (c) one or more signal generators for producing a set of separate modulation signals, such that each imaging pixel in the imaging superpixel is modulated by a modulation signal that causes sensitivity of the imaging pixel to vary over time.","[BQ] A system comprising, in combination: (a) a camera, which camera includes an imaging superpixel; (b) one or more light sources for illuminating a scene by a pattern of light that sweeps across the scene, such that a point in the scene, when directly illuminated by the pattern of light, reflects light directly to the imaging superpixel; and (c) one or more computers that are programmed to output a set of separate modulation signals that occur while the scene is illuminated by the pattern of light, such that each imaging pixel in the imaging superpixel is modulated by a modulation signal that causes sensitivity of the imaging pixel to vary over time; and (d) one or more computers for processing data indicative of measurements recorded by the imaging superpixel and for calculating, based on this data, 3D spatial coordinates of the point, by performing an algorithm that either (i) involves triangulation; or (ii) involves accessing data that was calculated by a computer using an algorithm that involves triangulation.","[BR] A system comprising, in combination: (a) a camera, which camera includes an imaging superpixel; and (b) one or more light sources for illuminating a scene by a pattern of light that sweeps across the scene, such that a point in the scene, when directly illuminated by the pattern of light, reflects light directly to the imaging superpixel; (c) one or more computers that are programmed to output a set of separate modulation signals, such that (i) each imaging pixel in the imaging superpixel is modulated by a modulation signal that causes sensitivity of the imaging pixel to vary over time; (ii) the set of modulation signals, taken together, comprise a code, each of the modulation signals representing a digit of the code.","(iii) each entire sweep of the pattern of light across the scene occurs in a time period, which time period consists of a set of subintervals, the total number of subintervals being equal to the number of permutations of the code; (iv) during each subinterval, the modulation signals, taken together, represent only one of the permutations of the code; (v) intensity of light incident on the imaging superpixel reaches a maximum value for the entire sweep during a specific subinterval; and (d) one or more computers for (i) processing data indicative of measurements recorded by the imaging superpixel, (ii) calculating the permutation of the code represented by the modulation signals during the specific subinterval, and (iii) calculating 3D spatial coordinates of the point.","The above description (including without limitation any attached drawings and figures) describes illustrative implementations of the invention.","However, the invention may be implemented in other ways.","The methods and apparatus which are described above are merely illustrative applications of the principles of the invention.","Other arrangements, methods, modifications, and substitutions by one of ordinary skill in the art are therefore also within the scope of the present invention.","Numerous modifications may be made by those skilled in the art without departing from the scope of the invention.","Also, this invention includes without limitation each combination and permutation of one or more of the abovementioned implementations, embodiments and features."]],"string":"[\n [\n \"Methods and Apparatus for Superpixel Modulation\",\n \"In illustrative implementations, a set of separate modulation signals simultaneously modulates a plurality of pixels in a superpixel by a set of separate modulation signals, such that each pixel in the superpixel is modulated by a modulation signal that causes sensitivity of the pixel to vary over time.\",\n \"Each superpixel comprises multiple pixels.\",\n \"In some implementations, the sensitivity of a pixel to incident light is controlled by storage modulation or by light modulation.\",\n \"In some implementations, this invention is used for 3D scanning, i.e., for detection of the 3D position of points in a scene.\"\n ],\n [\n \"1.A method comprising modulating, by a set of signals, a group of imaging pixels, wherein: (a) the modulating comprises, for each respective imaging pixel, modulating sensitivity of the respective imaging pixel to light incident on the respective imaging pixel, in such a way that the sensitivity varies over time during the modulating; (b) the group of imaging pixels consists of pixel sets, each imaging pixel being a member of one or more of the pixel sets; (c) the imaging pixels are located in imaging superpixels; (d) each imaging superpixel includes at least one imaging pixel from each of the pixel sets; (e) each respective signal, in the set of signals, modulates only one pixel set and thus modulates at least one imaging pixel in each of the imaging superpixels; and (f) each signal, in the set of signals, is different than the other signals in the set of signals.\",\n \"2.The method of claim 1, wherein the modulating by each of the signals occurs simultaneously.\",\n \"3.The method of claim 1, wherein each imaging pixel is a member of only one of the pixel sets.\",\n \"4.The method of claim 1, wherein each imaging superpixel includes only one imaging pixel of each pixel set, respectively.\",\n \"5.The method of claim 1, wherein: (a) each signal, in the set of signals, undergoes a temporal sequence of states; and (b) the frequency at which the states change is different for each signal in the set of signals.\",\n \"6.The method of claim 1, wherein: (a) each signal, in the set of signals, undergoes a temporal sequence of states; and (b) different permutations of the states of the signals exist at different times during a temporal period, each permutation of the states, respectively, during the period representing a permutation of digits of a code.\",\n \"7.The method of claim 1, wherein the method further comprises, for each respective imaging pixel: (a) at multiple times during a temporal period, transferring electric charge from a photodiode of the respective imaging pixel to a first storage device; (b) at multiple other times during the period, discharging accumulated electrical charge from the photodiode without measuring the accumulated electrical charge; and (c) throughout the period, not transferring electrical charge from the photodiode to any storage device other than the first storage device.\",\n \"8.The method of claim 1, wherein the method further comprises, for each respective imaging pixel, transferring, at multiple times during a read-out frame, electric charge from a photodiode of the respective imaging pixel to a set of storage devices, one storage device at a time.\",\n \"9.The method of claim 1, wherein: (a) each signal, in the set of signals, undergoes a temporal sequence of states; and (b) the method further comprises (i) illuminating a scene, in such a way that where intensity of light incident on the scene is greatest changes during a temporal period, and (ii) calculating, based on a permutation, a time at which intensity of light incident on a specific imaging superpixel is greatest during the period, the permutation being a permutation of states of the signals that occurs when intensity of light incident on the specific imaging superpixel is greatest during the period.\",\n \"10.The method of claim 9, further comprising calculating, based on the time, 3D position of a point in the scene, which point in the scene corresponds to the specific imaging superpixel.\",\n \"11.An apparatus comprising: (a) a group of imaging pixels; and (b) one or more signal generators; wherein (i) the group of imaging pixels consists of pixel sets, each imaging pixel being a member of one or more of the pixel sets, (ii) the imaging pixels are spatially arranged as, and comprise, imaging superpixels, (iii) each imaging superpixel includes at least one imaging pixel from each of the pixel sets, and (iv) the one or more signal generators are configured to output a set of signals that cause the group of imaging pixels to undergo modulation, in such a way that (A) each signal, in the set of signals, is different than the other signals in the set of signals, (B) the modulation comprises, for each respective imaging pixel, modulating sensitivity of the respective imaging pixel to light incident on the respective imaging pixel, in such a way that the sensitivity varies over time during the modulation, and (C) each respective signal, in the set of signals, modulates only one pixel set and thus modulates at least one imaging pixel in each of the imaging superpixels.\",\n \"12.The apparatus of claim 11, wherein the signal generator is configured to output each of the signals simultaneously.\",\n \"13.The apparatus of claim 11, wherein each imaging pixel is a member of only one of the pixel sets.\",\n \"14.The apparatus of claim 11, wherein each imaging superpixel includes only one imaging pixel of each pixel set, respectively.\",\n \"15.The apparatus of claim 11, wherein an imaging pixel, in the group of imaging pixels, comprises a CMOS pixel.\",\n \"16.The apparatus of claim 11, wherein an imaging pixel, in the group of imaging pixels, comprises a CCD pixel.\",\n \"17.The apparatus of claim 11, wherein: (a) each imaging pixel, respectively, includes a photodiode and a first storage device; and (b) the apparatus is configured to cause the photodiode (a) at multiple times during a temporal period, to transfer electric charge to the first storage device; (b) at multiple other times during the period, to discharge accumulated electrical charge without the accumulated electrical charge being measured; and (c) throughout the period, to not transfer electrical charge to any storage device other than the first storage device.\",\n \"18.The apparatus of claim 11, wherein: (a) each imaging pixel, respectively, includes a photodiode and a set of storage devices; and (b) the apparatus is configured to cause the photodiode to transfer, at multiple times during a read-out frame, electric charge to the set of storage devices, one storage device at a time.\",\n \"19.The apparatus of claim 11, wherein (a) the one or more signal generators are configured to output the set of signals in such a way that each signal, in the set of signals, undergoes a temporal sequence of states; and (b) the apparatus further comprises: (i) a light source configured to illuminate a scene, in such a way that where intensity of light incident on the scene is greatest changes during a temporal period, and (ii) a computer that is programmed to calculate, based on a permutation, a time at which intensity of light incident on a specific imaging superpixel is greatest during the period, the permutation being a permutation of states of the signals that occurs when intensity of light incident on the specific imaging superpixel is greatest during the period.\",\n \"20.The apparatus of claim 19, wherein the computer is programmed to calculate, based on the time, 3D position of a point in the scene, which point in the scene corresponds to the specific imaging superpixel.\"\n ],\n [\n \" FIELD OF THE TECHNOLOGY The present invention relates generally to superpixel modulation.\"\n ],\n [\n \" SUMMARY In exemplary implementations of this invention, a light sensor includes superpixels.\",\n \"Each superpixel comprises multiple pixels, such that each pixel in the superpixel is a horizontal, vertical or diagonal neighbor of at least one other pixel in the superpixel.\",\n \"The pixels of the light sensor also include pixel sets.\",\n \"Each pixel set comprises multiple pixels to which a single modulation signal is applied.\",\n \"In many cases, the pixels of a given pixel set are not horizontal, vertical or diagonal neighbors of each other.\",\n \"Each of the pixel sets is modulated by a separate modulation signal.\",\n \"Each superpixel includes at least one pixel from each of the pixel sets.\",\n \"Thus, different pixels in each superpixel are separately modulated.\",\n \"For example, in some cases: (1) a light sensor includes n pixel sets; (2) each superpixel in the light sensor has n pixels, such that each pixel in the superpixel is an element of a different pixel set; and (3) n separate modulation signals are simultaneously applied to the pixels in the light sensor, one separate modulation signal per pixel set.\",\n \"In this example, for each superpixel, n separate modulation signals are simultaneously applied to the n pixels of the superpixel, one modulation signal per pixel, In illustrative implementations, the n separate modulations signals together comprise an n-bit binary code, such as n-bit binary gray code.\",\n \"Each of the modulation signals corresponds to a bit of the code.\",\n \"For example, in some cases: (1) each superpixel has n pixels; (2) n separate modulation signals are applied to the n pixels, one modulation signal per pixel; (3) together the n modulations signals comprise an 9-bit binary gray code; and (4) each of the n modulation signals corresponds to a bit of the code.\",\n \"All 2 n permutations of the n-bit code are applied during each camera frame.\",\n \"Thus, each camera frame is divided into 2 n time intervals (timeslots).\",\n \"Each permutation of the code corresponds to a unique timeslot during a single camera frame.\",\n \"In illustrative implementations, a set of separate modulation signals simultaneously modulate a plurality of pixels in a superpixel, such that each pixel in the superpixel is modulated by a modulation signal that causes sensitivity of the pixel to vary over time.\",\n \"In some implementations, this invention is used for 3D scanning, i.e., for detection of the 3D position of points in a scene.\",\n \"In some cases, the 3D scanning is implemented as follows: A rotating mirror causes a plane of laser light to sweep across a scene during each camera frame.\",\n \"Because the mirror rotates, the angle of the plane of laser light varies as a function of time during each sweep.\",\n \"The mirror is at a particular angle when the plane of laser light hits the point in the scene from which light directly reflects to that pixel.\",\n \"At this particular angle of the plane of laser light, the incident light intensity for that pixel reaches a maximum for that frame.\",\n \"The modulation pattern affects the pixel's response to incident light, and thereby uniquely identifies (i) the timeslot during which the maximum intensity of incident light strikes the pixel and (ii) the angle of the plane of laser light during this timeslot.\",\n \"A computer uses the timeslot to access a lookup table to determine the 3D position of the scene point.\",\n \"The lookup table is computed for each pixel by triangulation, during earlier calibration.\",\n \"Specifically, in some cases, the image sensor, rotational axis of the rotating mirror, and pixel ray for the superpixel are fixed relative to each other.\",\n \"The pixel ray is the half-line along which light must travel in order to reach the center of the superpixel.\",\n \"A computer calculates the angle of the plane of laser light for a given superpixel, based on the timeslot at which incident light for the given superpixel reaches a maximum.\",\n \"The 3D scene point that reflects light to the given superpixel is positioned at the intersection of (i) the pixel ray for the given superpixel and (ii) the plane of laser light.\",\n \"A computer calculates the 3D coordinates of this intersection by triangulation, based on the known position of the superpixel, pixel ray for the superpixel, and light source and based on the computed angle of the plane of laser light.\",\n \"An advantage of the present invention is that, in illustrative implementations, all n modulation signals that comprise an n-bit code are recorded by an n-pixel superpixel during a single frame of a camera.\",\n \"In contrast, during conventional time-multiplexed structured illumination: (a) light source is modulated by one modulation signal during each frame; and (b) the n separate modulation signals that comprise the n-bit code are applied during n separate frames of the camera, one modulation signal per frame.\",\n \"Thus, in illustrative implementations, this invention captures in a single camera frame the same type of data as is captured during multiple camera frames with time-multiplexed structured illumination.\",\n \"Capturing all of the data in a single frame (in illustrative implementations of the present invention) rather than in multiple frames (as in conventional time-multiplexed structured illumination) has the desirable effect of reducing distortion and artifacts in 3D sensing that are caused by motion.\",\n \"In some implementations of this invention, the sensitivity of a pixel to incident light is controlled by storage modulation.\",\n \"Storage modulation is achieved by using either a single storage device per pixel, or by using multiple storage devices per pixel.\",\n \"In single storage cases, each pixel transfers charge to only one storage device during the exposure time of a single camera frame.\",\n \"The storage device receives charge only from that pixel, and not from any other pixels, during the exposure time of a single camera frame.\",\n \"Modulation signals cause a photodiode in each pixel to transfer charge to the single storage device multiple times during a single camera frame, and to drain charge, without saving it for later readout, at multiple other times during the same camera frame.\",\n \"In multiple storage cases, each pixel transfers charge to multiple storage device during the exposure time of a single camera frame.\",\n \"These multiple storage device receive charge only from that pixel, and not from any other pixels, during the exposure time of a single camera frame.\",\n \"Modulation signals cause a photodiode in each pixel to transfer charge to transfer charge to different storage devices, out of the multiple storage devices, at multiple times during the exposure time of a single camera frame, or to drain charge, without saving it for later readout, at multiple other times during the same camera frame.\",\n \"In some implementations of this invention, pixel modulation occurs by light modulation.\",\n \"In light modulation implementations, the system includes an SLM (spatial light modulator) that is either transmissive or reflective.\",\n \"The SLM selectively attenuates light from a scene, thereby selectively controlling the intensity of light incident on a pixel.\",\n \"For example, in some cases: (a) a reflective SLM selectively reflects light from the scene, causing different sets of pixels in a superpixel to receive reflected light from the scene at different times during a single camera exposure; and (b) the reflective SLM comprises a DMD (digital micromirror device) or a reflective LCOS (liquid crystal on silicon) device.\",\n \"For example, in other cases: (a) light passing through a transmissive SLM is selectively attenuated by the SLM, causing different sets of pixels in a superpixel to receive light from the scene at different times during a single camera exposure; and (b) the transmissive SLM comprises an LCD (liquid crystal device) or ferromagnetic shutters.\",\n \"The description of the present invention in the Summary and Abstract sections hereof is just a summary.\",\n \"It is intended only to give a general introduction to some illustrative implementations of this invention.\",\n \"It does not describe all of the details of this invention.\",\n \"This invention may be implemented in many other ways.\",\n \"Likewise, the description of this invention in the Field of the Technology section is not limiting; instead it identifies, in a general, non-exclusive manner, a field of technology to which exemplary implementations of this invention generally relate.\"\n ],\n [\n \"RELATED APPLICATIONS This application is a continuation of U.S. application Ser.\",\n \"No.\",\n \"15/115,270, which was the National Stage of International Application No.\",\n \"PCT/IB2015/051551 filed Mar.\",\n \"3, 2015, which claims the benefit of U.S.\",\n \"Provisional Application No.\",\n \"61/947,282, filed Mar.\",\n \"3, 2014 (the “Provisional Application”).\",\n \"FIELD OF THE TECHNOLOGY The present invention relates generally to superpixel modulation.\",\n \"SUMMARY In exemplary implementations of this invention, a light sensor includes superpixels.\",\n \"Each superpixel comprises multiple pixels, such that each pixel in the superpixel is a horizontal, vertical or diagonal neighbor of at least one other pixel in the superpixel.\",\n \"The pixels of the light sensor also include pixel sets.\",\n \"Each pixel set comprises multiple pixels to which a single modulation signal is applied.\",\n \"In many cases, the pixels of a given pixel set are not horizontal, vertical or diagonal neighbors of each other.\",\n \"Each of the pixel sets is modulated by a separate modulation signal.\",\n \"Each superpixel includes at least one pixel from each of the pixel sets.\",\n \"Thus, different pixels in each superpixel are separately modulated.\",\n \"For example, in some cases: (1) a light sensor includes n pixel sets; (2) each superpixel in the light sensor has n pixels, such that each pixel in the superpixel is an element of a different pixel set; and (3) n separate modulation signals are simultaneously applied to the pixels in the light sensor, one separate modulation signal per pixel set.\",\n \"In this example, for each superpixel, n separate modulation signals are simultaneously applied to the n pixels of the superpixel, one modulation signal per pixel, In illustrative implementations, the n separate modulations signals together comprise an n-bit binary code, such as n-bit binary gray code.\",\n \"Each of the modulation signals corresponds to a bit of the code.\",\n \"For example, in some cases: (1) each superpixel has n pixels; (2) n separate modulation signals are applied to the n pixels, one modulation signal per pixel; (3) together the n modulations signals comprise an 9-bit binary gray code; and (4) each of the n modulation signals corresponds to a bit of the code.\",\n \"All 2n permutations of the n-bit code are applied during each camera frame.\",\n \"Thus, each camera frame is divided into 2n time intervals (timeslots).\",\n \"Each permutation of the code corresponds to a unique timeslot during a single camera frame.\",\n \"In illustrative implementations, a set of separate modulation signals simultaneously modulate a plurality of pixels in a superpixel, such that each pixel in the superpixel is modulated by a modulation signal that causes sensitivity of the pixel to vary over time.\",\n \"In some implementations, this invention is used for 3D scanning, i.e., for detection of the 3D position of points in a scene.\",\n \"In some cases, the 3D scanning is implemented as follows: A rotating mirror causes a plane of laser light to sweep across a scene during each camera frame.\",\n \"Because the mirror rotates, the angle of the plane of laser light varies as a function of time during each sweep.\",\n \"The mirror is at a particular angle when the plane of laser light hits the point in the scene from which light directly reflects to that pixel.\",\n \"At this particular angle of the plane of laser light, the incident light intensity for that pixel reaches a maximum for that frame.\",\n \"The modulation pattern affects the pixel's response to incident light, and thereby uniquely identifies (i) the timeslot during which the maximum intensity of incident light strikes the pixel and (ii) the angle of the plane of laser light during this timeslot.\",\n \"A computer uses the timeslot to access a lookup table to determine the 3D position of the scene point.\",\n \"The lookup table is computed for each pixel by triangulation, during earlier calibration.\",\n \"Specifically, in some cases, the image sensor, rotational axis of the rotating mirror, and pixel ray for the superpixel are fixed relative to each other.\",\n \"The pixel ray is the half-line along which light must travel in order to reach the center of the superpixel.\",\n \"A computer calculates the angle of the plane of laser light for a given superpixel, based on the timeslot at which incident light for the given superpixel reaches a maximum.\",\n \"The 3D scene point that reflects light to the given superpixel is positioned at the intersection of (i) the pixel ray for the given superpixel and (ii) the plane of laser light.\",\n \"A computer calculates the 3D coordinates of this intersection by triangulation, based on the known position of the superpixel, pixel ray for the superpixel, and light source and based on the computed angle of the plane of laser light.\",\n \"An advantage of the present invention is that, in illustrative implementations, all n modulation signals that comprise an n-bit code are recorded by an n-pixel superpixel during a single frame of a camera.\",\n \"In contrast, during conventional time-multiplexed structured illumination: (a) light source is modulated by one modulation signal during each frame; and (b) the n separate modulation signals that comprise the n-bit code are applied during n separate frames of the camera, one modulation signal per frame.\",\n \"Thus, in illustrative implementations, this invention captures in a single camera frame the same type of data as is captured during multiple camera frames with time-multiplexed structured illumination.\",\n \"Capturing all of the data in a single frame (in illustrative implementations of the present invention) rather than in multiple frames (as in conventional time-multiplexed structured illumination) has the desirable effect of reducing distortion and artifacts in 3D sensing that are caused by motion.\",\n \"In some implementations of this invention, the sensitivity of a pixel to incident light is controlled by storage modulation.\",\n \"Storage modulation is achieved by using either a single storage device per pixel, or by using multiple storage devices per pixel.\",\n \"In single storage cases, each pixel transfers charge to only one storage device during the exposure time of a single camera frame.\",\n \"The storage device receives charge only from that pixel, and not from any other pixels, during the exposure time of a single camera frame.\",\n \"Modulation signals cause a photodiode in each pixel to transfer charge to the single storage device multiple times during a single camera frame, and to drain charge, without saving it for later readout, at multiple other times during the same camera frame.\",\n \"In multiple storage cases, each pixel transfers charge to multiple storage device during the exposure time of a single camera frame.\",\n \"These multiple storage device receive charge only from that pixel, and not from any other pixels, during the exposure time of a single camera frame.\",\n \"Modulation signals cause a photodiode in each pixel to transfer charge to transfer charge to different storage devices, out of the multiple storage devices, at multiple times during the exposure time of a single camera frame, or to drain charge, without saving it for later readout, at multiple other times during the same camera frame.\",\n \"In some implementations of this invention, pixel modulation occurs by light modulation.\",\n \"In light modulation implementations, the system includes an SLM (spatial light modulator) that is either transmissive or reflective.\",\n \"The SLM selectively attenuates light from a scene, thereby selectively controlling the intensity of light incident on a pixel.\",\n \"For example, in some cases: (a) a reflective SLM selectively reflects light from the scene, causing different sets of pixels in a superpixel to receive reflected light from the scene at different times during a single camera exposure; and (b) the reflective SLM comprises a DMD (digital micromirror device) or a reflective LCOS (liquid crystal on silicon) device.\",\n \"For example, in other cases: (a) light passing through a transmissive SLM is selectively attenuated by the SLM, causing different sets of pixels in a superpixel to receive light from the scene at different times during a single camera exposure; and (b) the transmissive SLM comprises an LCD (liquid crystal device) or ferromagnetic shutters.\",\n \"The description of the present invention in the Summary and Abstract sections hereof is just a summary.\",\n \"It is intended only to give a general introduction to some illustrative implementations of this invention.\",\n \"It does not describe all of the details of this invention.\",\n \"This invention may be implemented in many other ways.\",\n \"Likewise, the description of this invention in the Field of the Technology section is not limiting; instead it identifies, in a general, non-exclusive manner, a field of technology to which exemplary implementations of this invention generally relate.\",\n \"BRIEF DESCRIPTION OF THE DRAWINGS FIG.\",\n \"1 is a diagram that shows a matrix of superpixels.\",\n \"FIG.\",\n \"2 is a diagram that shows individual pixels within superpixels.\",\n \"FIG.\",\n \"3 is a diagram that shows five different modulation signals that are simultaneously applied to five different pixel sets.\",\n \"FIG.\",\n \"4 is a conceptual diagram, illustrating how modulation signals control the response of pixels to incident light.\",\n \"FIGS.\",\n \"5, 7 and 9 are each a circuit schematic for a portion of a CMOS pixel, which pixel has one floating diffusion storage device.\",\n \"FIGS.\",\n \"6, 8 and 10 are timing diagrams for FIGS.\",\n \"5, 7 and 9, respectively.\",\n \"FIG.\",\n \"11 is a conceptual diagram of a superpixel, in which each pixel has multiple storage devices.\",\n \"FIG.\",\n \"12 a circuit schematic for a portion of a CMOS pixel that has three storage devices.\",\n \"FIG.\",\n \"13 is a conceptual diagram of CCD pixels, in which each pixel has two storage devices.\",\n \"FIG.\",\n \"14 is a conceptual diagram of CCD pixels, in which each pixel has four storage devices.\",\n \"FIG.\",\n \"15 is a flowchart for modulation of storage using an n-ary code, such that all of the photodiode charge is stored for later readout.\",\n \"FIG.\",\n \"16 is a flowchart for modulation of storage using an n-ary code, such that only a portion of the photodiode charge is stored for later readout.\",\n \"FIG.\",\n \"17 is a flowchart for decoding an n-ary code, after storage modulation in which only a portion of the photodiode charge is stored for later readout.\",\n \"FIG.\",\n \"18 is a flowchart for decoding an n-ary code, after storage modulation in which all of the photodiode charge is stored for later readout.\",\n \"FIG.\",\n \"19 is diagram that illustrates three examples of analog modulation signals.\",\n \"FIG.\",\n \"20 is a conceptual diagram illustrating the use of a reflective SLM for modulating the intensity of light incident on photodiodes of pixels in a superpixel.\",\n \"FIG.\",\n \"21 is a ray diagram that shows a DMD selectively reflecting light from a scene at a particular time, such that reflected light is steered toward some, but not all, of the pixels in a superpixel of an image sensor.\",\n \"FIG.\",\n \"22 is a conceptual diagram illustrating the use of a transmissive SLM for modulating the intensity of light incident on photodiodes of pixels in a superpixel.\",\n \"FIG.\",\n \"23 is a ray diagram showing an LCD selectively attenuating light from a scene, such that light reaches some, but not all, of the pixels of a superpixel in an image sensor.\",\n \"FIGS.\",\n \"24A, 24B and 24C are each a diagram of an optical system that includes a transmissive SLM.\",\n \"In FIG.\",\n \"24A, the transmissive SLM is adjacent to the image sensor plane.\",\n \"In FIG.\",\n \"24B, an imaging lens is positioned between the transmissive SLM and the image sensor plane.\",\n \"In FIG.\",\n \"24C, a field lens and relay lens are positioned between the transmissive SLM and the image sensor plane.\",\n \"FIG.\",\n \"25 is a conceptual diagram that shows an example of prior art, time-multiplexed structured illumination.\",\n \"FIG.\",\n \"26 is a conceptual diagram that illustrates a moving line of light produced by controlled movement of a light source, in an illustrative implementation of this invention.\",\n \"FIG.\",\n \"27A is a diagram, which shows a rotating mirror that reflects a rotating line of light.\",\n \"FIG.\",\n \"27B is a diagram, which shows a projector that projects a moving line of light.\",\n \"FIG.\",\n \"27C is a diagram, which shows an array of directional light sources that, taken together, emit a moving line of light.\",\n \"FIG.\",\n \"28 is a block diagram of hardware components.\",\n \"FIG.\",\n \"29 is a diagram of a 3D scanning system.\",\n \"FIG.\",\n \"30 is a flowchart that shows steps in a method of 3D scanning, in which different pixel sets are separately modulated.\",\n \"FIG.\",\n \"31 is a flowchart that shows steps in a method of 3D scanning, in which a timeslot is calculated.\",\n \"FIG.\",\n \"32 is a flowchart that shows steps in a method of calibrating a 3D scanner.\",\n \"FIG.\",\n \"33 is a diagram that shows four examples of circles used in an optical calibration pattern.\",\n \"FIG.\",\n \"34 is a diagram that shows examples of use of calibration patterns.\",\n \"The above Figures (except FIG.\",\n \"25) show some illustrative implementations of this invention, or provide information that relates to those implementations.\",\n \"However, this invention may be implemented in many other ways.\",\n \"DETAILED DESCRIPTION Superpixels and Pixel Sets In illustrative implementations of this invention, a light sensor includes superpixels.\",\n \"Separate modulation signals are applied to different sets of pixels in the light sensor.\",\n \"As used herein, a set of pixels to which a particular modulation signal is applied is sometimes called a “modulation pixel set” or simply “pixel set”.\",\n \"Each pixel set comprises multiple pixels.\",\n \"Each superpixel includes at least one pixel from each of the pixel sets.\",\n \"FIG.\",\n \"1 is a diagram that shows a matrix of superpixels, in an illustrative implementation of this invention.\",\n \"In the example shown in FIG.\",\n \"1, a light sensor comprises matrix 100 of superpixels, such as superpixels 101, 102, 103, 104.The matrix 100 has r rows and c columns.\",\n \"The total number of superpixels in the matrix is r*c=k.\",\n \"FIG.\",\n \"2 is a diagram that shows individual pixels within superpixels, in an illustrative implementation of this invention.\",\n \"FIG.\",\n \"2 shows four superpixels 251, 252, 253, 254 in the upper left corner of a matrix of superpixels.\",\n \"Each of the four superpixels comprises 9 pixels.\",\n \"For example, superpixel 251 comprises pixels 211, 212, 213, 214, 215, 216, 217, 218, 219.In the example shown in FIG.\",\n \"2, there are nine pixel sets.\",\n \"The pixels in the first pixel set are labeled “1”.\",\n \"Likewise, the pixels in the second, third, fourth, fifth, sixth, seventh, eighth and ninth pixel sets are labeled “2”, “3”, “4′”, “5”, “6”, “7”, “8”, and “9”, respectively.\",\n \"(These numerical labels are used in FIG.\",\n \"2 to facilitate explanation; but in actual practice, the pixels are not labeled in this manner.)\",\n \"In FIG.\",\n \"2, each superpixel includes one pixel from each set.\",\n \"In illustrative implementations, the pixels in each superpixel are sufficiently small and sufficiently close together that light incident on the photodiodes of the pixels in the superpixel is locally homogeneous—that is, within a single superpixel, spatial variation in intensity of incident light is not substantial.\",\n \"(However, in some cases: (a) the light sensor itself includes spatial light modulators—such as an LCD—for selectively modulating the intensity of incoming light; and (b) the light incident on the photodiodes of the superpixel is locally homogeneous if the effect of the spatial light modulators is subtracted, but is not locally homogeneous if the effect of the spatial light modulators is taken into account.)\",\n \"Depending on the particular implementation, the spatial distribution of pixel sets within a light sensor may vary.\",\n \"In many cases, it is preferable for the pixel sets to be spatially distributed in a repeating pattern.\",\n \"For example, in some cases, 9 pixel sets are used in a light sensor, and each superpixel is a 3×3 pixel square, which is an easily repeatable pattern.\",\n \"For example, in FIG.\",\n \"2, the following spatial pattern of 9 pixel sets occurs in superpixel 251: pixels from pixel sets 1, 2, 3 are in the top row of the superpixel, pixels for pixel sets 4, 5, 6 are in the middle row of the superpixel, and pixels for pixel sets 7, 8, 9 are in the bottom row of the superpixel.\",\n \"This spatial pattern repeats in superpixels 252, 253, 254.Or, for example, in some cases, a 3-pixel superpixel in an “L” shape is used: stacking an upright “L” and a bottom-up “L” gives a rectangle and thus produces a repeatable pattern.\",\n \"Depending on the particular implementation, any shape of superpixels may be used.\",\n \"For example, in some cases, triangular or hexagonal superpixels are used.\",\n \"In some cases, the superpixels has a linear shape, such as horizontal (e.g., [12345][12345][12345]), and vertical (e.g., [12345]T[12345]T[12345]T) However, in some cases, using a line-shaped superpixel has a disadvantage: if all “1”s are in one column; this tends in some cases to at least slightly increase the decoding error rate.\",\n \"In some cases, the position of pixels from different pixel sets (within each superpixel) is rearranged from superpixel to superpixel (e.g.\",\n \"using a few fixed patterns, completely randomizing the order, or using a mathematical permutation).\",\n \"For example, in some implementations, the spatial distribution of pixels from different sets of pixel sets within each superpixel is randomized in design time, then the random distribution is hardwired.\",\n \"For example, in some cases, randomization produces, for three line-shaped superpixels, a spatial arrangement of pixels from different pixel sets of [13452][35214][41253], rather than [12345][12345][12345].\",\n \"Likewise, randomization of position of pixels from different pixel sets is applicable to any shape of superpixel, including square, rectangular, L-shaped, triangular or hexagonal.\",\n \"In some cases, a multiplexer rearranges the shape or size of superpixels, such that superpixels with different sizes or shapes used at different times (e.g., for different applications, different frames, or at different times within a single frame) or at different regions within a single light sensor.\",\n \"For example, in some cases, a multiplexer reconfigures different superpixel shapes, e.g., 3×3, 4×3, or another shape.\",\n \"For example, in some implementations with CMOS pixels, a multiplexer is placed outside the pixel matrix area and directs separate TX/PD RST control signals to the pixels.\",\n \"Likewise, in some cases, a multiplexer rearranges the position of pixels from different pixel sets within one or more of the superpixels.\",\n \"As noted above, in some cases, the spatial distribution of different sets of pixels changes from frame to frame.\",\n \"Alternatively, in some cases, the spatial distribution is fixed because of wiring of the pixel circuit.\",\n \"In many implementations, the different sets of pixels in the imaging sensor are disjoint (i.e., no pixel belongs to more than one of the sets of pixels).\",\n \"Alternatively, different sets of pixels are overlapping.\",\n \"In some cases, a single pixel that is an element of two pixel sets A and B is subjected to a pixel modulation signal that comprises a superposition of the modulation signals for pixel sets A and B.\",\n \"The size of the superpixel depends on the application.\",\n \"If, for example, a 9 pixel superpixel is not enough for a specific application and a 16 pixel superpixel is too much, a 12 pixel superpixel (4×3 or 3×4) may be used for that specific application.\",\n \"More pixel sets in a superpixel allows for more complicated coding strategies or code sharing.\",\n \"For example, a modulation signal comprising 18-bit gray code may be applied to the pixels of a 6×3 pixel superpixel.\",\n \"In some use scenarios, spatial compression is achieved by treating each large superpixel as if it comprises smaller superpixels, and then applying modulation signals as follows: Modulation signals corresponding to lower bits of a code are applied to only one pixel per large superpixel, but modulation signals corresponding to higher bits of the code are applied to one pixel per smaller superpixel.\",\n \"For example, in some use scenarios, a 6×3 pixel superpixel is treated as if comprising two 3×3 pixel superpixels.\",\n \"In these use scenarios, a modulation pattern corresponding to each of the 4 lower bits of the 11-bit gray code is applied to just one pixel in the 6×3 superpixel, while modulation patterns corresponding to each of the 7 higher bits of the 11-bit gray code are applied to one pixel in each of the 3×3 superpixels.\",\n \"Spatial compression (by applying lower bits and higher bits in this manner) has many practical advantages.\",\n \"For example, in some 3D depth sensing applications, this spatial compression allows for using multiple higher bit modulation signals to determine, for each large superpixel for each frame, the 3D coordinates for multiple points in a scene.\",\n \"For example, in some implementations that use this spatial compression, a computer calculates 3D coordinates of four scene points, for each frame for each 6×3 superpixel.\",\n \"In some cases, the actual spatial distribution of pixel sets is hardwired in a fixed pattern.\",\n \"However, even then, in some cases, software is used to effectively vary the spatial distribution of pixel sets from frame to frame, by changing, from frame to frame, which bits of a modulation code are applied to which pixel set.\",\n \"For example, in some cases: (a) in a first frame, software causes the x-th bit of a modulation signal to be applied to modulate pixel set x; and (b) in a second frame, software causes the x-th bit of a modulation signal to be applied to modulate pixel set y.\",\n \"For example, in some use scenarios: (a) in a first frame, the modulation signal for the first bit of a code is applied to a first pixel set, the modulation signal for the second bit of the code is applied to the second pixel set, and so on, and (b) in a second frame, the first bit of a code is applied to the second pixel set, the modulation signal for the second bit of the code is applied to the third pixel set, and so on.\",\n \"Thus, in this approach, the permutation of assignments (from code bits to pixel sets) varies from frame to frame.\",\n \"In some cases, the same permutation of assignments (of code bits to pixel sets) is used in all frames.\",\n \"In other cases, different permutations of assignments (of code bits to pixel sets) are applied in different frames in a fixed order.\",\n \"In yet other cases, a different random permutation of assignments (of code bits to pixel sets) is used in each frame.\",\n \"Here is a non-limiting example of varying the permutation of assignments (of code bits to pixel sets).\",\n \"For a 5-bit code, there are 5!\",\n \"(factorial) different permutations of assignments of code bits to pixel sets.\",\n \"Different permutations are used in different frames.\",\n \"For example, (a) in a first frame, a first permutation is used, which maps bit 1 to pixel set 1, bit 2 to pixel set 2, bit 3 to pixel set 3, bit 4 to pixel set 4, and bit 5 to pixel set 5; and (b) in a second frame, a second permutation is used, which maps bit 1 to pixel set 4, bit 2 to pixel set 2, bit 3 to pixel set 5, bit 4 to pixel set 3, and bit 5 to pixel set 1.In illustrative implementations, each superpixel comprises multiple imaging pixels.\",\n \"Each pixel in the superpixel is a horizontal, vertical or diagonal neighbor of at least one other pixel in the superpixel.\",\n \"In the example shown in FIG.\",\n \"2, pixel 215 has only two vertical neighbors (pixels 212, 217), only two horizontal neighbors (pixels 214, 216), and only four diagonal neighbors (pixels 211, 213, 217, 219).\",\n \"In many cases, the pixels of a given pixel set are not horizontal, vertical or diagonal neighbors of each other.\",\n \"For example, in FIG.\",\n \"2, pixels 216 and 226 are each members of the sixth pixel set.\",\n \"None of the neighboring pixels (i.e.\",\n \"horizontal, vertical or diagonal neighbors) of pixel 216 is a member of the sixth pixel set.\",\n \"Likewise, none of the neighboring pixels (i.e.\",\n \"horizontal, vertical or diagonal neighbors) of pixel 226 is a member of the sixth pixel set.\",\n \"Modulation Signals FIG.\",\n \"3 is a diagram that shows five different modulation signals that are simultaneously applied to five different pixel sets during a single frame.\",\n \"In FIG.\",\n \"3, the five signals 311, 312, 313, 314, 315 together comprise a binary 5-bit gray code.\",\n \"The code is binary because each component of the code has only two allowed values.\",\n \"In FIG.\",\n \"3, the two allowed values are called “open” and “closed”.\",\n \"However, the two allowed values may be called by any name, such as on and off, high and low, or 0 and 1.In FIG.\",\n \"3, each of the five modulation signals 311, 312, 313, 314, 315 corresponds to a bit of a 5-bit gray code.\",\n \"The 5-bit gray code has 25 (i.e., 32) permutations of open and closed states of the 5 component signals.\",\n \"In FIG.\",\n \"3, all 25 (i.e., 32) permutations of open and closed states of the 5 component signals are applied to the pixel sets, during a single frame of the camera.\",\n \"For a 5-bit code (such as that shown in FIG.\",\n \"3), a single frame of the camera has 25 (i.e., 32) subintervals, which are sometimes called “timeslots”.\",\n \"Each timeslot corresponds to a single permutation of the code.\",\n \"For example, during timeslot 321 in FIG.\",\n \"3, the permutation is signal 315 closed, signal 314 closed, signal 313 open, signal 312 open and signal 311 closed.\",\n \"In contrast, during timeslot 323 in FIG.\",\n \"3, the permutation is signal 315 open, signal 314 open, signal 313 open, signal 312 open and signal 311 closed.\",\n \"In FIG.\",\n \"3, a unique permutation (of binary states of the 5 component signals of the 5-bit gray code) exists for each of the 32 timeslots.\",\n \"Thus, each permutation (of states of the 5 component signals of the 5-bit gray code) is effectively a “timestamp” that uniquely identifies a timeslot within a frame.\",\n \"In some implementations of this invention, a 9-bit binary gray code is used.\",\n \"The nine bits of this code are represented by 9 modulation signals.\",\n \"The 9-bit code has 29 (i.e., 512) permutations of open and closed states of the 9 modulation signals.\",\n \"All 512 permutations are applied to pixels in each frame of the camera.\",\n \"Thus, for this 9-bit code, each frame has 512 subintervals, sometimes called timeslots.\",\n \"A unique permutation of the 9-bit code (and thus of the open and closed states of the 9 modulation signals) exists for each of the 512 timeslots.\",\n \"In some cases in which a 9-bit code is used: (a) there are nine pixel sets; (b) the 9 modulation signals are applied to the 9 pixel sets, one signal per pixel set; and (c) each superpixel has 9 pixels, one pixel per pixel sets.\",\n \"Thus, the 9 modulation signals are applied to the 9 pixels in a superpixel, one signal per pixel.\",\n \"Gray codes are robust against noise, which is advantageous.\",\n \"Depending on the particular implementation of this invention, the modulation signals are either (a) continuous time (analog), (b) discrete-time, or (c) digital (discrete in both amplitude and time).\",\n \"For example, in many examples of this invention, digital modulation signals are used.\",\n \"In that case, the amplitude of the modulation signal is treated as being in one of two binary states (e.g., 0 or 1), and the signal changes only at discrete time intervals.\",\n \"Alternatively, modulation signals are treated as continuous in amplitude.\",\n \"For example, in some cases, a computer normalizes the range of continuous values to an interval [0,1].\",\n \"In that case, for example, a value of 0.241 may mean that 24.1% of electrons are moved to storage.\",\n \"There is no limitation of when the signal change can occur in time.\",\n \"In some implementations, the signal changes continuously in time.\",\n \"In some cases, analog modulation signals are used, which are treated as continuous in both amplitude and time.\",\n \"In some implementations, the modulation signals are non-periodic.\",\n \"An example of such an aperiodic signal is 00110010101101000011010, which does not have one specific frequency or phase.\",\n \"In other cases, the modulation signals are periodic.\",\n \"Or, in some cases, a periodic signal such as 01010101010101 is applied to a first pixel set, and a second periodic or aperiodic signal (e.g., periodic signal 10000100001000) is applied to a second pixel set.\",\n \"In some cases, the frequency, phase, or amplitude of the modulation signal for a pixel set changes over the duration of one frame.\",\n \"In other cases, the frequency, phase, or amplitude of the modulation signal for a pixel set is constant within each single frame, but changes from frame to frame.\",\n \"In illustrative implementations, each modulation signal is applied to only one pixel in each superpixel.\",\n \"Alternatively, a single modulation signal is applied to multiple pixels within a single superpixel.\",\n \"In illustrative implementations: (a) all pixels which belong to the same pixel set have the same modulation signal; and (b) different pixel sets receive different modulation signals.\",\n \"Each pixel set receives its own, separate generated pixel modulation signal.\",\n \"In many use scenarios, the amplitude of each modulation signal varies as a function of time during a single frame.\",\n \"However, in other use scenarios: (a) the amplitude or phase of a modulation signal is constant over time within a single frame, where the constant is different for different pixel sets, or (b) the amplitude or phase of a modulation signal is the same constant for different pixel sets.\",\n \"In other words, this invention is not limited to signals that change over time or that are different among different sets of pixels.\",\n \"In some cases, the modulation functions for pixel sets changes frame to frame.\",\n \"Depending on the particular implementation, the manner in which the modulation signals are physically implemented may vary.\",\n \"For example, in some cases, the pixels are CMOS imaging pixels, an electrical modulation signal causes a charge transfer (TX) transistor to transfer charge from a photodiode to a storage device (e.g., floating diffusion).\",\n \"In some cases: (a) each pixel has only one photodiode and more than more than one TX transistor; (b) more than one storage device (e.g., floating diffusion) is dedicated to only that pixel; and (c) each of the TX transistors in that pixel controls transfer to a different storage device.\",\n \"In other cases, an electrical modulation signal causes electrodes to vary the position of mirrors in a DMD (digital micromirror device) by electrostatic attraction, thereby causing the DMD to selectively reflect light towards some pixels in the image sensor plane, and to reflect light away from some other pixels in the image sensor plane.\",\n \"In other cases, an electrical modulation signal causes the properties of an SLM (spatial light modulator), such that the SLM selectively attenuates light before it reaches the image sensor plane.\",\n \"Physical implementation of modulation signals is discussed in more detail below.\",\n \"Effect of Modulation In some implementations, a modulation signal controls the response of a pixel to incident light.\",\n \"FIG.\",\n \"4 is a conceptual diagram, illustrating how modulation signals control the response of pixels to incident light.\",\n \"In FIG.\",\n \"4, plot 400 is a plot of Ix,y(t) 401 versus time.\",\n \"Ix,y(t) is the intensity of light incident on the x, yth superpixel (i.e., the superpixel which has coordinates x, y on the sensor plane) as a function of time.\",\n \"The time interval shown in plot 400 is a complete camera frame, from the start of the frame to the end of the frame.\",\n \"(i.e., tframe_start to tframe_end).\",\n \"The intensity of incident light due to ambient background illumination has a constant amplitude of a (402).\",\n \"A small peak of intensity occurs at time 404 due to interreflections from the scene.\",\n \"The highest peak of intensity 406 occurs at time thit.\",\n \"For example, in some cases: (a) a line of laser light sweeps across the scene during each frame, and (b) the sweeping line of laser light reaches a point in the scene and reflects, such that the reflected light reaches the light sensor at time thit.\",\n \"In FIG.\",\n \"4, modulation functions G1(t) to Gn(t) 403 are applied to the n pixel sets in the superpixel, one modulation function per pixel set.\",\n \"In the example shown in FIG.\",\n \"4: (a) n=5; (b) a 5-bit gray code is employed; (c) G1(t) to Gn(t) are the five signals that comprise the 5-bit gray code, one signal per bit of the code, as illustrated in FIG.\",\n \"3.In FIG.\",\n \"4, vi(t) is a value for the ith pixel set in the superpixel.\",\n \"Specifically, vi(t) is equal to the integral of the product of Ix,y(t) and Gi(t) (the ith modulation function).\",\n \"This integral vi(t) is equal to the area of dark region under the curve in plots 408, 410, 412.In plots 408, 410, 412, the curve that defines the top of the dark region is equal to the product of the product of Ix,y(t) and Gi(t).\",\n \"In plot 408, modulation signal G1(t) is signal 315 shown in FIG.\",\n \"3.During the first half of the frame (shown in the left side of plot 408), signal 315 is closed (i.e., equal to 0), and thus the product of Ix,y(t) and G1(t) is equal to zero, and there is no dark region under the curve.\",\n \"During the second half of the frame (shown in the right side of plot 408), signal 315 is open (i.e., equal to 1), and the product of Ix,y(t) and G1(t) is equal to Ix,y(t), and there is a dark region under the curve.\",\n \"In plot 410, modulation signal G2(t) is signal 314 shown in FIG.\",\n \"3.During the first and fourth quarters of the frame, signal 314 is closed (i.e., equal to 0), and thus the product of Ix,y(t) and G2(t) is equal to zero, and there is no dark region under the curve.\",\n \"During the second and third quarters of the frame, signal 314 is open (i.e., equal to 1), and the product of Ix,y(t) and G2(t) is equal to of Ix,y(t), and there is a dark region under the curve.\",\n \"In plot 412, modulation signal Gn(t) is G5(t), which is signal 311 shown in FIG.\",\n \"3.The frame is divided into 32 timeslots.\",\n \"During timeslots in which signal 311 is closed (i.e., equal to 0), the product of Ix,y(t) and G5(t) is equal to zero, and there is no dark region under the curve.\",\n \"During timeslots in which signal 311 is open (i.e., equal to 1), and the product of Ix,y(t) and G5(t) is equal to of Ix,y(t), and there is a dark region under the curve.\",\n \"In FIG.\",\n \"4, the incident light function is identical for each of the pixel sets of the superpixel (that is, Ix,y(t) is the same for all of the pixels in a superpixel, due to their close proximity).\",\n \"However separate modulation signals G1(t) to Gn(t) are applied to the n pixel sets in the superpixel.\",\n \"Thus, each of the pixel sets in the superpixel receives a separate modulation signal.\",\n \"A computer calculates vi(t) (the integral of the product of Ix,y(t) and Gi(t)) for each pixel set in the superpixel 405.For example, a computer calculates v1(t) for the first pixel set which received modulation signal G1(t), and calculates v2(t) for the second pixel set which received modulation signal G2(t), et cetera.\",\n \"A computer also calculates a threshold 413.In some cases, the threshold 413 is equal to (max vi−min vi)/2, where i=1, 2, .\",\n \".\",\n \".\",\n \", n, and max vi is the maximum vi(t) for all the pixels in the superpixel, and min vi is the minumum vi(t) for all the pixels in the superpixel.\",\n \"A computer then calculates code Cx,y 409 for the x, yth superpixel (i.e., the superpixel which has coordinates x, y on the sensor plane).\",\n \"Code Cx,y has the same number of bits as the number of pixel sets in the superpixel.\",\n \"A computer sets the ith bit of code Cx,y to 1 if the vi(t) is greater than the threshold; otherwise the computer sets the ith bit of code Cx,y to 0.In the example shown in FIG.\",\n \"4, the computer: (a) sets the first bit of code Cx,y to 1 because vi(t) is greater than the threshold; (b) sets the nth (in this example, the 5th) bit of code Cx,y to 0 because vn(t) is less than the threshold.\",\n \"Each permutation of code Cx,y corresponds to a unique timeslot (time interval) within a single frame.\",\n \"This unique timeslot is the timeslot within which time thit occurred.\",\n \"Thus, each permutation of code Cx,y is effectively a timestamp that uniquely identifies a timeslot (time interval) within a single camera frame, such that incident light striking the pixel reached its maximum peak during this timeslot.\",\n \"In some 3D depth-sensing implementations of this invention, a galvanometer mirror rotates, causing a plane of laser light to sweep across a scene during each camera frame.\",\n \"The angle of the mirror (and thus the angle of the plane of laser light) is a function of time within the frame.\",\n \"Thus, each permutation of code Cx,y corresponds to a unique timeslot (time interval) within a single camera frame, which in turn corresponds to a unique angle of the plane of laser light.\",\n \"411.A computer uses this angle, and other factors determined during calibration, to compute the 3D position of the scene point that reflected the laser light to the superpixel.\",\n \"The computer stores, for each superpixel and each angle, the 3D position of the corresponding scene point.\",\n \"During subsequent operation of a depth sensor, a computer calculates a permutation of code Cx,y for each superpixel, as described above, and then uses the lookup table to compute the 3D position of the scene point that corresponds to that scene point.\",\n \"In some implementations, each pixel stores charge to only one storage device, which storage device is dedicated to that pixel and does not store charge for any other pixels.\",\n \"(Such an implementation is sometimes herein called “single storage device implementation”, and is also sometimes herein called a “partial illumination implementation”, because less than all of the incident illumination is measured.)\",\n \"In the example shown in FIG.\",\n \"4, each pixel stores charge to only one storage device, which storage device is dedicated to that pixel and does not store charge for any other pixels.\",\n \"Thus, FIG.\",\n \"4 illustrates a single storage device implementation.\",\n \"In single storage device implementations, for each camera frame, the total photodiode charge measured by each pixel in the ith pixel set in a superpixel is equal to the value of vi(t) at the end of the frame (i.e., is equal to vi(tframe_end).\",\n \"This value, in turn, depends on the modulation function Gn(t) that is applied to the ith pixel set.\",\n \"Thus, the modulation function Gi(t) determines the response of the pixels in the ith pixel set to incident light.\",\n \"(In most cases, each superpixel includes only one pixel from each pixel set.\",\n \"In those cases, the ith pixel set is simply the ith pixel.)\",\n \"In some single storage implementations in which a binary code is applied to the pixels, each pixel is turned “off” and “on” many times during the duration of a single camera frame.\",\n \"In many implementations, a pixel is neither “on” during an entire frame, nor “off” during an entire frame.\",\n \"(Putting a pixel with only a single storage device to constant “off” during an entire frame would cause the pixel not to measure any light during the frame.\",\n \"Putting a pixel with only a single storage bin to constant “on” for the whole frame duration would cause the pixel to measure light normally during the entire frame.)\",\n \"In case of the analog modulation, the response for the light measurement ranges from completely “off” to completely “on”, and this signal varies during the camera frame duration.\",\n \"In cases where each pixel has multiple storage devices, the modulation signals also control the response of the pixel to incident light, as discussed below.\",\n \"Modulation of Storage In some implementations, modulation signals control storage of charge in a CMOS pixel.\",\n \"FIGS.\",\n \"5, 7 and 9 show three examples of CMOS circuits, in illustrative implementations of this invention.\",\n \"FIGS.\",\n \"5, 7 and 9 are each a circuit schematic for a portion of a CMOS pixel.\",\n \"The CMOS pixel has one floating diffusion storage device.\",\n \"COL means column selector 507.FD means floating diffusion 509.The floating diffusion stores electric charge.\",\n \"PD RST means photodiode reset transistor 513.ROW means row selector 511.TX means gate transistor 503 in FIGS.\",\n \"5 and 7.TXi means gate transistor 523 in FIG.\",\n \"9.TX ROW means row selector 505 for charge transfer.\",\n \"PD RST ROW means photodiode row selector 521.RST means floating diffusion reset transistor 517.RST causes floating diffusion 509 to be reset (i.e., the charge in floating diffusion 509 to be drained) when RST is high.\",\n \"SF means source follower 515.The source follower is used during the readout.\",\n \"V means voltage source.\",\n \"In FIGS.\",\n \"5 and 6, TX causes charge to be transferred from the photodiode 501 to floating diffusion 509 when voltages at COL and TX ROW are simultaneously high.\",\n \"In FIGS.\",\n \"9 and 10, TXi causes charge to be transferred from the photodiode 501 to the storage FD 509 when TXi is high.\",\n \"In FIGS.\",\n \"7 and 8, PD RST causes photodiode 501 to be reset (that is, the charge in photodiode 501 to be drained) when COL and PD RST ROW are simultaneously high.\",\n \"In FIGS.\",\n \"5, 6, 9 and 10, PD RST causes photodiode 501 to be reset (that is, the charge in photodiode 501 to be drained) when PD RST is high.\",\n \"In FIGS.\",\n \"5, 6, 7, 8, 9 and 10, readout occurs when voltages at COL and ROW are simultaneously high.\",\n \"FIGS.\",\n \"6, 8 and 10 are timing diagrams for FIGS.\",\n \"5, 7 and 9, respectively.\",\n \"In FIGS.\",\n \"6, 8 and 10, the entire exposure occurs during a single camera frame, and readout and floating diffusion reset occur after the frame.\",\n \"In FIGS.\",\n \"6, 8 and 10, ModExp 531 is a modulation signal that is one of the components of the n-bit code.\",\n \"Certain other signals in these Figures are derived from ModExp, as discussed below.\",\n \"At multiple times during the single camera frame, the then accumulated charge in photodiode 501 is transferred to floating diffusion 509 (i.e., each time that the voltages at COL and TX ROW are simultaneously high).\",\n \"Also, at multiple other times during a single camera frame, the then accumulated charge in photodiode 501 is drained without being readout or measured (e.g., when PD RST is high during 551, 552, 553, 554, 555 in FIG.\",\n \"6, when both PD RST ROW and COL are high during 561, 562, 563 in FIG.\",\n \"8, and when PD RST is high during 571, 572, 573, 574, 575 in FIG.\",\n \"10).\",\n \"FIG.\",\n \"11 is a conceptual diagram of a superpixel, in which each pixel has multiple storage devices.\",\n \"Each pixel stores charge to multiple storage devices.\",\n \"Each of these multiple storage devices is dedicated to only that pixel and does not store charge for any other pixel.\",\n \"For example, pixel 1103 has a set of multiple storage devices 1125, and pixel 1105 has a non-overlapping set of multiple storage devices 1135.In the example shown in FIG.\",\n \"11, light from a scene 1100 strikes the photodiode (e.g., 1107, 1109) of each pixel (e.g., 1103, 1105) in a superpixel 1101.For each pixel, modulation signals cause the then accumulated photodiode charge in the pixel to be transferred to one of the storage devices for that pixel.\",\n \"Which storage device receives a particular transfer of charge is determined by the modulation signal.\",\n \"For example, for pixel 1103, a modulation signal causes transfer gate 1111 to transfer charge from photodiode 1107 to storage device 1121 at some times during a single camera frame, and causes transfer gate 1113 to transfer charge from photodiode 1107 to storage device 1123 at some other times during the camera frame.\",\n \"Likewise, for pixel 1105, a different modulation signal causes transfer gate 1115 to transfer charge from photodiode 1109 to storage device 1131 at some times during a single camera frame, and causes transfer gate 1117 to transfer charge from photodiode 1109 to storage device 1133 at some other times during the camera frame.\",\n \"FIG.\",\n \"12 is a circuit schematic for a portion of a CMOS pixel that has three floating diffusion storage devices.\",\n \"In FIG.\",\n \"12: COL means column selector 507.FD1 is floating diffusion 549.FD2 is floating diffusion 559.FD3 is floating diffusion 569.PD RST is photodiode reset transistor 513.In FIG.\",\n \"12, PD RST causes photodiode 501 to be reset (that is, the charge in photodiode 501 to be drained) when PD RST is high.\",\n \"ROW is row selector 511.RST1 is floating diffusion reset transistor 547.RST2 is floating diffusion reset transistor 557.RST3 is floating diffusion reset transistor 567.In FIG.\",\n \"12: (a) RST1 causes floating diffusion 509 to be reset when RST1 is high; (b) RST2 causes floating diffusion 509 to be reset when RST2 is high; and (c) RST3 causes floating diffusion 509 to be reset when RST3 is high.\",\n \"The reset causes charge in floating diffusion 509 to be drained.\",\n \"SF is source follower 515.TXi1 is transfer gate 543.TXi2 is transfer gate 553.TXi3 is transfer gate 563.In FIG.\",\n \"12: (a) TXi1 causes charge to be transferred from the photodiode 501 to the storage FD1 549 when TXi1 is high; (b) TXi2 causes charge to be transferred from the photodiode 501 to the storage FD2 559 when TXi2 is high; and (c) TXi3 causes charge to be transferred from the photodiode 501 to the storage FD3 569 when TXi3 is high.\",\n \"In some implementations, modulation signals control storage of charge for CCD pixels.\",\n \"FIG.\",\n \"13 is a conceptual diagram of CCD pixels, in which each pixel has two storage devices.\",\n \"During a single camera frame, for each pixel in the array, charge is transferred from the photodiode of the pixel at some times to one of the storage devices for the pixel, and at other times to the other storage device for the pixel.\",\n \"For example, during a single camera frame: (a) a modulation signal causes the then accumulated photodiode charge in pixel 1312 to be transferred to a capacitive bin at position 1311 at some times, and to be transferred to a capacitive bin at position 1303 at some other times; and (b) a separate modulation signal causes the then accumulated photodiode charge in pixel 1315 to be transferred to a capacitive bin at position 1314 at some times, and to be transferred to a capacitive bin at position 1316 at some other time.\",\n \"After the end of the frame, the charges are shifted down each column of the array in a conventional CCD manner.\",\n \"For example, charge is read out from the capacitive bin at position 1316 at the edge of the array, then the charge in the capacitive bin at position 1315 is shifted to the capacitive bin at position 1316, then the charge in the capacitive bin at position 1314 is shifted to the capacitive bin at position 1315, then the charge in the capacitive bin at position 1313 is shifted to the capacitive bin at position 1314, then the charge in the capacitive bin at position 1312 is shifted to the capacitive bin at position 1313, then the charge in the capacitive bin at position 1311 is shifted to the capacitive bin at position 1312.Then the charge is read out again from the capacitive bin at position 1316 at the edge of the array, etc.\",\n \"FIG.\",\n \"14 is a conceptual diagram of CCD pixels, in which each pixel has four storage devices.\",\n \"During a single camera frame, for each pixel in the array, charge is transferred from the photodiode of the pixel at some times to the first storage device for the pixel, at other times to the second storage device for the pixel, at yet other times to the third storage device for the pixel, and at yet other times to the fourth storage device for the pixel.\",\n \"For example, during a single camera frame, a modulation signal causes the then accumulated photodiode charge in pixel 1411: (a) to be transferred to a capacitive bin at position 1453 at some times; (b) to be transferred to a capacitive bin at position 1455 at some other times; (c) to be transferred to a capacitive bin at position 1457 at some times; and (d) to be transferred to a capacitive bin at position 1459 at some other times.\",\n \"After the end of the frame, the charges are shifted down each column of the array in a conventional CCD manner.\",\n \"In a pixel with two storages, one storage is by convention considered to be the primary storage.\",\n \"The “on” state of modulation of such a pixel means that the charge is transferred to the primary storage.\",\n \"The “off” state of the modulation of such a pixel means that the charge is transferred to the secondary storage.\",\n \"The image recovered from the primary storages is the “positive” image, accumulated during the “on” phases.\",\n \"The image recovered from the secondary storages is the “negative” image, accumulated during the “off” phases.\",\n \"Summing these two together gives the total image, i.e.\",\n \"an image which would be captured by an ordinary (unmodulated) camera.\",\n \"As used herein, a “multiple storage implementation” or “total charge implementation” means an implementation in which each pixel has multiple storage devices that receive charge only from that pixel during the exposure time of a frame.\",\n \"Such an implementation is sometimes called a “total charge implementation” to emphasize that charge is not, by design, drained at some times during the frame without being measured.\",\n \"1Multiple storage implementations are advantageous for at least two reasons.\",\n \"First, in some multiple storage implementations, a computer calculates a dynamic threshold depending on the total illumination for a particular pixel.\",\n \"For example, in some cases, instead of having a fixed threshold for deciding whether a pixel's value represents a logical 0 or logical 1 in code Cx,y (see discussion of FIG.\",\n \"4), a computer compares the pixel's value to a threshold computed, for example, as 50% of the total value.\",\n \"Second, in some multiple storage implementations, a computer calculates a total image for a single frame, by summing, for each pixel, the sum of the charges captured by the multiple storage devices for that pixel during that frame.\",\n \"In most implementations, the modulation signals that comprise a code (such as signals 311-315 in FIG.\",\n \"3) do not directly control timing within the pixel.\",\n \"Instead, electronic circuitry in the image sensor, or in the camera circuitry, or in the control unit converts each modulation signal to one or more intermediate signals, which directly or indirectly control timing within each pixel or pixel set, such as the timing of (i) photodiode reset, (ii) floating diffusion reset, (iii) readout, (iv) transfer of charge from photodiode to floating diffusion or to a capacitive bin; or (v) CCD shifts, in the case of a CCD.\",\n \"For example, in some implementations using CMOS pixels, the intermediate signals comprise high or low (binary values) of voltage applied to TX, TXi, TXi1, TXi2, TXi3, RST, RST1, RST2, RST3, TD ROW, PD RST, or PD RST ROW.\",\n \"In some cases, changes in an intermediate signal are triggered by the rising edge, falling edge or both of the modulation signal.\",\n \"In some cases, changes in an intermediate signal occur at a specified delay after the rising edge, falling edge or both of the modulation signal.\",\n \"In some cases, changes in an intermediate signal are the logical complement of the modulation signal (i.e., 0 if the modulation signal is 1, or 1 if the modulation signal is 0).\",\n \"In some cases, an intermediate signal that triggers transfer of charge from a photodiode to floating diffusion (i) becomes high when the modulation signal goes from high to low, stays there for a small amount of time necessary to transfer the charge, and goes low; and (ii) ignores the low-to-high transition of modulation signal.\",\n \"Delayed signals are desirable in some cases when it is known that different elements of the pixel circuit have different latencies, or require different times to transfer the charge.\",\n \"In some implementations, constraints imposed by the hardware implementation require that the modulation signals satisfy one or more logical conditions.\",\n \"For example, in some multiple storage implementations, the following logical condition must be satisfied: at any one time, at most one modulation signal per pixel is in a state that triggers transfer of charge.\",\n \"This is because if more than one transfer gate is open, the charge from photodiode splits between the storages, which is undesirable.\",\n \"In some other implementations, a logical condition is that storage modulation signals add up to 1.This invention is not limited to binary coding.\",\n \"As used herein, “n-ary code” means code in which the digits are expressed in base n, where n is an integer greater than 2.For example, 3-ary code is written in base 3, and is sometimes called ternary code.\",\n \"In some embodiments of this invention, ternary code is used with pixels that each have two storage devices.\",\n \"In that case, three values of the ternary code (“A”,“B”,“C”) signal causes the charge to be transferred into storage “A”, into storage “B”, or trashed, respectively.\",\n \"In some cases: (a) each pixel has three storage devices; (b) ternary code is used; (c) instead of trashing the light in the “C” case, the charge is transferred into the third storage (“C”); and (d) A+B+C are summed to get the total amount of light.\",\n \"In some implementations that employ n-ary code, each pixel has n−1 or n storages.\",\n \"With n−1 storage devices per pixel, the n-ary code is recoverable.\",\n \"With n storage devices per pixel, the n-ary code and total amount of light are recoverable.\",\n \"In some implementations that employ n-ary code and that use n storage devices per pixel, the values 0, 1, .\",\n \".\",\n \".\",\n \", n−1 of the n-ary code cause the charge to be transferred into the 1st, 2nd, .\",\n \".\",\n \".\",\n \", nth storage, respectively.\",\n \"The total illumination image is obtained by summing all values of the 1st, 2nd, .\",\n \".\",\n \".\",\n \", nth storage.\",\n \"In some implementations that employ n-ary code and that use n−1 storage devices per pixel, the value 0 causes the photodiode charge to be drained, in some cases without being saved for later readout.\",\n \"The values 1, .\",\n \".\",\n \".\",\n \", n−1 of the n-ary code cause the charge to be transferred into the 1st, 2nd, .\",\n \".\",\n \".\",\n \", (n−1)th storage, respectively.\",\n \"In some implementations, modulation of pixel storage is controlled by an n-ary code, such that all of the photodiode charge of each pixel is stored for later readout.\",\n \"FIG.\",\n \"15 shows an example of this approach.\",\n \"In FIG.\",\n \"15, each pixel has n storage devices, and storage modulation for the kth pixel in a superpixel includes the following steps: A computer evaluates x, which is the value of the kth digit of an n-ary code of length m (Step 1501), and causes the photodiode charge in the kth pixel to be transferred to the (x+1)th storage device for the kth pixel.\",\n \"(Step 1503).\",\n \"For example, if x equals 0, then the pixel's photodiode charge is transferred to the first storage device for the pixel.\",\n \"For example, if x equals n−1, then the pixel's photodiode charge is transferred to the nth storage device for the pixel.\",\n \"If a superpixel has more than one pixel that is a member of the kth pixel set and the method shown in FIG.\",\n \"15 is used, then storage modulation for each of these pixels is done simultaneously, in the manner shown in FIG.\",\n \"15.In some implementations, modulation of pixel storage is controlled by an n-ary code, such that only a portion of the photodiode charge of each pixel is stored for later readout.\",\n \"FIG.\",\n \"16 shows an example of this approach.\",\n \"In FIG.\",\n \"16, each pixel has multiple (e.g., n−1) storage devices, and storage modulation for the kth pixel in a superpixel includes the following steps: A computer evaluates x, which is the value of the kth digit of a modulation code.\",\n \"(Step 1601) If x equals 0, then the photodiode charge in the kth pixel is drained, and is not saved for later readout.\",\n \"(Step 1603) If x is not equal to 0, then the photodiode charge in the kth pixel is transferred to the (x+1)th storage device for the kth pixel.\",\n \"(Step 1605).\",\n \"If a superpixel has more than one pixel that is a member of the kth pixel set and the method shown in FIG.\",\n \"16 is used, then storage modulation for each of these pixels is done simultaneously, in the manner shown in FIG.\",\n \"16.FIG.\",\n \"17 is a flowchart for decoding n-ary code, after storage modulation in which only a portion of the photodiode charge is stored for later readout.\",\n \"In FIG.\",\n \"17, the code that is being decoded has m digits, and each pixel has multiple (e.g., n−1) storage devices.\",\n \"Decoding for each superpixel includes the following steps: A computer sets k equal to zero (Step 1701).\",\n \"A computer evaluates if k is greater than m−1.\",\n \"(Step 1703) If yes, then decoding stops for that superpixel, and the computer repeats the decoding for each of the superpixels, until all of the superpixels are decoded.\",\n \"(Step 1715) If no, then a computer detects the storage value (i.e., level of charge stored in a storage device) for each of the multiple storage devices of the kth pixel.\",\n \"(Step 1705) A computer determines if any of these storage values exceed a threshold.\",\n \"(Step 1707).\",\n \"If none of these storage values exceed the threshold, then a computer sets the kth digit of the code to zero.\",\n \"(Step 1709) If at least one of these storage values exceeds the threshold, then a computer: (a) determines the maximum storage value, out of these storage values (Step 1711), (b) determines that the maximum storage value is stored in the xth storage device for the kth pixel (Step 1712), (c) sets the kth digit of the code to x (Step 1713) and (d) sets k equal to k+1 (Step 1714) If a superpixel has more than one pixel that is a member of the kth pixel set, then the method in FIG.\",\n \"17 is modified for that superpixel so that: (a) in Step 1705, a computer determines storage values for each of the storage devices for each of the pixels in the superpixel that are members of the kth pixel set; and (b) in Step 1707, a computer determines that the maximum storage value, out of these storage values, is stored in the xth storage device of one of these pixels.\",\n \"FIG.\",\n \"18 is a flowchart for decoding n-ary code, after storage modulation in which all of the photodiode charge is stored for later readout.\",\n \"In FIG.\",\n \"18, the code that is being decoded has m digits, and each pixel has n storage devices.\",\n \"Decoding for each superpixel includes the following steps: A computer sets k equal to zero (Step 1801).\",\n \"A computer evaluates if k is greater than m−1.\",\n \"(Step 1803) If yes, then decoding stops for that superpixel, and the computer repeats the decoding for each of the superpixels, until all of the superpixels are decoded.\",\n \"(Step 1815) If no, then a computer detects the storage value (i.e., level of charge stored in a storage device) for each of the multiple storage devices of the kth pixel.\",\n \"(Step 1805) A computer: (a) determines the maximum storage value, out of these storage values (Step 1807), (b) determines that the maximum storage value is stored in the xth storage device for the kth pixel (Step 1809), (c) sets the kth digit of the code to x−1 (Step 1811), and sets k equal to k+1 (Step 1813).\",\n \"If a superpixel has more than one pixel that is a member of the kth pixel set, then the method in FIG.\",\n \"17 is modified for that superpixel so that: (a) in Step 1705, a computer determines storage values for each of the storage devices for each of the pixels in the superpixel that are members of the kth pixel set; and (b) in Step 1707, a computer determines that the maximum storage value, out of these storage values, is stored in the xth storage device of one of these pixels.\",\n \"Analog Modulation In some cases, the modulation signals are analog signals.\",\n \"In some cases, modulations signals (either digital or analog) undergo at least one change between camera frames.\",\n \"FIG.\",\n \"19 is diagram that illustrates three examples of analog modulation signals that change from frame to frame.\",\n \"Signal 1901 is an aperiodic signal in both frame 1 and frame 2.Signal 1903 is a periodic signal that is sinusoidal in frame 1 and non-sinusoidal in frame 2.In frame 1, signal 1905 is a periodic triangle wave that is shifted upward so that the minimum value is zero.\",\n \"In frame 2, signal 1905 is aperiodic.\",\n \"In some cases, an analog modulation signal is negative at times, such as signal 1901 at time 1907 in FIG.\",\n \"19.In some cases, a “negative” value of a modulation signal is implemented as follows: the storage is pre-charged by a fixed amount of charge.\",\n \"For a negative portion of the modulation signal, a transfer gate is opened to release an amount of charge from the storage device proportional to the absolute value of the modulation signal.\",\n \"During the readout phase, a computer treats the pre-charged amount as the zero value, treats an amount of charge below this value as a negative readout; and treats an amount of charge larger than the pre-charge amount as a positive readout.\",\n \"Light Modulation In some implementations, modulation signals control the intensity of light incident on the photodiode of a pixel.\",\n \"FIG.\",\n \"20 is a conceptual diagram illustrating the use of a reflective SLM (spatial light modulator) for modulating the intensity of light incident on the photodiodes of pixels in a superpixel.\",\n \"In the example shown in FIG.\",\n \"20, light from a scene 2001 strikes reflective SLM 2003 and is selectively reflected, such that which of the pixels, if any, of a superpixel 2005 are illuminated by reflected light from SLM 2003 at any given time during a camera frame is controllable.\",\n \"For example, which pixels, out of 2007, 2009 and 2011, are illuminated by reflected light from SLM 2003 varies during a single camera frame.\",\n \"For example, in some cases, during a single camera frame: (a) at some times pixel 2007 is illuminated by reflected light from SLM 2003 but pixels 2009 and 2011 are not; and (b) at other times pixels 2007 and 2009 are illuminated by reflected light from SLM 2003 but pixel 2011 is not.\",\n \"In some cases, the reflective SLM comprises a DMD (digital micromirror device) or a reflective LCOS (liquid crystal on silicon) device.\",\n \"FIG.\",\n \"21 is a ray diagram that shows a DMD selectively reflecting light from a scene at a particular time, such that reflected light is steered toward some, but not all, of the pixels in a superpixel of an image sensor.\",\n \"In the example shown in FIG.\",\n \"21, the pixels in the image sensor and pixels of the DMD array are optically aligned, such that each pixel of the DMD corresponds to a pixel of the image sensor.\",\n \"The pixels in the DMD array are switched between two states, “A” and “B”.\",\n \"When the mirror for a DMD pixel is in the “A” state, the mirror reflects the light to the corresponding pixel in the image sensor.\",\n \"When the mirror for a DMD pixel is in the “B” state, the light is reflected in another direction.\",\n \"By switching a DMD pixel between these two states, the light incident on the corresponding pixel of the image sensor is modulated, and thus the response of the pixel to the light coming from the scene is modulated.\",\n \"In the example shown in FIG.\",\n \"21, pixels in a DMD array 2105 are optically aligned with pixels in image sensor 2103.For example, DMD pixels 2111, 2113 and 2115 correspond to image sensor pixels 2121, 2123 and 2125, respectively.\",\n \"Light from a scene 2101 is striking DMD pixels 2111, 2113 and 2115.DMD pixels 2111 and 2113 are in state “A”, such that light reflects from these pixels to image sensors 2123 and 2123, respectively.\",\n \"DMD pixel 2115 is in state “B”, such that light reflects from this DMD pixel in a direction away from image sensor 2125, thus causing the reflected light not to reach image sensor pixel 2125.Image sensor pixels 2111, 2113 and 2115 are all in the same superpixel.\",\n \"FIG.\",\n \"22 is a conceptual diagram illustrating the use of a transmissive SLM for modulating light incident on photodiodes of pixels in a superpixel.\",\n \"In the example shown in FIG.\",\n \"22, light from a scene 2201 passes through transmissive SLM 2203, and is selectively attenuated, such that which of the pixels, if any, of a superpixel 2005 are illuminated by light passing through the SLM at any given time during a camera frame is controllable.\",\n \"For example, which pixels, out of 2207, 2209 and 2211, are illuminated by light passing through SLM 2203 varies during a single camera frame.\",\n \"For example, in some cases, during a single camera frame: (a) at some times pixel 2207 is illuminated by light passing through SLM 2203 but pixels 2209 and 2211 are not; and (b) at other times pixels 2207 and 2209 are illuminated by light passing through SLM 2203 but pixel 2011 is not.\",\n \"In some cases, the transmissive SLM comprises an LCD (liquid crystal display) or an array of ferromagnetic shutters.\",\n \"FIG.\",\n \"23 is a ray diagram showing an LCD selectively attenuating light from a scene at a particular time, such that light passing through the LCD reaches some, but not all, of the pixels of a superpixel in an image sensor.\",\n \"In the example shown in FIG.\",\n \"21, the pixels in the image sensor and pixels of the LCD are optically aligned, such that each pixel of the LCD corresponds to a pixel of the image sensor.\",\n \"The pixels in the LCD array are switched between two states, “on” and “off”.\",\n \"When an LCD pixel is in the “on” state, light from the scene passes through the LCD pixel and travels to the corresponding pixel in the image sensor.\",\n \"When an LCD pixel is in the “off” state, the LCD pixel is opaque and blocks light.\",\n \"By switching an LCD pixel between these two states, the light incident on the corresponding pixel of the image sensor is modulated, and thus the response of the pixel to the light coming from the scene is modulated.\",\n \"In the example shown in FIG.\",\n \"23, pixels in LCD 2303 are optically aligned with pixels in image sensor 2309.For example, LCD pixels 2311, 2313, 2315 and 2317 correspond to image sensor pixels 2321, 2323, 2325 and 2327, respectively.\",\n \"Light from a scene 2301 is striking LCD pixels 2311, 2313, 2315 and 2317.LCD pixels 2311, 2313, 2315 are in the “on” state, such that light passes through these LCD pixels and travels to image sensors 2321, 2323 and 2325, respectively.\",\n \"LCD pixel 2317 is in the “off” state, such that LCD pixel 2317 is opaque, thus preventing light from passing through LCD pixel 2317 and traveling to image sensor pixel 2327.Image sensor pixels 2321, 2323, 2325 and 2327 are all in the same superpixel.\",\n \"In FIG.\",\n \"23, a camera 2307 includes a lens 2305 and the image sensor 2309.The lens bends light from the LCD 2303.Similarly, in some cases: (a) a lens is interposed between a reflective SLM (such as a DMD or reflective LCOS) and the image sensor, and (b) the lens bends light rays that travel from the reflective SLM through the lens to the reflective SLM.\",\n \"FIGS.\",\n \"24A, 24B and 24C are each a diagram of an optical system that includes a transmissive SLM.\",\n \"In each of FIGS.\",\n \"24A, 24B and 24C, the SLM selectively attenuates light, such that at different times during a single camera frame, the SLM blocks light from reaching different sets of the pixels in the image sensor.\",\n \"In FIG.\",\n \"24A, a transmissive SLM 2401 is adjacent to the image sensor 2405.In FIG.\",\n \"24A, light travels from an object in the scene 2403 through an imaging lens 2407, then through the SLM 2401, and then to the image sensor 2405.In FIG.\",\n \"24B, an imaging lens 2407 is positioned between the transmissive SLM 2401 and the image sensor 2405.In FIG.\",\n \"24B, light travels from an object in the scene 2403, then through the SLM 2401, then through an imaging lens 2407, and then to the image sensor 2405.In FIG.\",\n \"24C, a field lens and relay lens are positioned between the transmissive SLM 2401 and the image sensor 2405.In FIG.\",\n \"24C, light travels from an object in the scene 2403, then through an imaging lens 2407, then through the SLM 2401, then through a field lens 2411, then through a relay lens 2409, and then to the image sensor 2405.In some implementations in which an SLM is used, a computer separately controls each pixel in the SLM, and thus the computer controls the size and shape of a superpixel in the image sensor.\",\n \"For example, in some cases, a computer sends signals to a reflective or transmissive SLM, such that 9 pixels comprise a 3×3 pixel superpixel, or such that 12 pixels comprise a 4×3 pixel superpixel, or such that 16 pixels comprise a 4×4 pixel superpixel.\",\n \"In some cases, a reflective or transmissive SLM does not have the same size or shape as the image sensor.\",\n \"In those cases: (a) some pixels in the image sensor do not correspond to pixels in the SLM; and (b) light modulation is applied only to pixels in the image sensor that are aligned with pixels in the SLM.\",\n \"In some cases: (a) the pixels in the SLM and camera are not precisely aligned; and (b) pixels for which the imprecision exceeds a given threshold are ignored.\",\n \"The value at that position is interpolated or returned as “unknown”.\",\n \"In many cases where a reflective or transmissive SLM is used, each pixel has only storage device that is dedicated to that pixel and does not receive charge from any other pixel during the exposure time of a camera frame.\",\n \"Comparison to Time-Multiplexed Structured Illumination It is interesting to compare this invention to conventional time-multiplexed structured illumination.\",\n \"FIG.\",\n \"25 is a conceptual diagram that shows a prior art example of conventional time-multiplexed structured illumination.\",\n \"In FIG.\",\n \"25, the camera 2511 sensitivity is not modulated.\",\n \"The laser 2503 and a Powell lens (not shown) project a plane of laser light 2505.The line of laser light 2505 sweeps across the scene during each camera frame.\",\n \"The intensity of the laser light is modulated by a binary modulation pattern, causing the laser light to turn on and off repeatedly during a single sweep.\",\n \"The camera captures a single frame during the sweep of the laser light across the scene.\",\n \"In the image 2517 captured during this frame, the dark stripes 2533, 2535, 2537, 2539 correspond to the times during the sweep at which the laser light is turned off.\",\n \"In conventional time-multiplexed structured illumination (such as that shown in FIG.\",\n \"25): (a) n separate modulation signals that comprise the n-bit code are applied during n separate frames of the camera, one modulation signal per frame, to modify illumination of the scene; and (b) the sensitivity of the camera to light is not modulated.\",\n \"In contrast, in illustrative implementations of this invention: (a) all n separate modulation signals that comprise an n-bit code are applied during a single frame of a camera, to separately modify the response of n pixels in each superpixel to incident light; and (b) the intensity of the light source is kept constant during the sweep of the plane of light.\",\n \"In illustrative implementations, this invention captures in a single camera frame the same type of data as is captured during multiple camera frames with time-multiplexed structured illumination.\",\n \"Capturing all of the data in a single frame (in illustrative implementations of the present invention) rather than in multiple frames (as in conventional time-multiplexed structured illumination) has the desirable effect of reducing distortion and artifacts in 3D sensing that are caused by motion blur.\",\n \"3D Scanning In illustrative implementations, this invention is used for 3D scanning—i.e., for detection of the 3D position of points in a scene.\",\n \"In illustrative implementations, a system comprises at least one camera with a modulatable image sensor, an optional ordinary camera, a control unit, a processing unit, and at least one illumination unit.\",\n \"Modulation of pixels of a superpixel during a camera frame creates a specific code in the pixels of the superpixel In this system, a light source emits light, such that the position of the intersection of the light and the scene changes over time.\",\n \"In illustrative implementations, the spatio-temporal characteristics of the light source are such that the spatial position of a point of the scene captured by a superpixel is computationally recoverable from the camera calibration, the relative position of the light source and the camera, and the charge values recorded by the pixels of the superpixel during a single frame of a camera.\",\n \"In illustrative implementations, the spatiotemporal characteristics of the light source are such that: (a) for a given point in the scene, the time function of the intensity of direct illumination from the light source in a point of the scene exhibits only one peak; and (b) the intersection of (1) the set of the points illuminated at time t and (2) the pixel ray of the superpixel has only one solution, given constraints consisting of the field of view of the camera, light source field of view, angle of the light emitted by the light source, and the relative position of camera and the light source.\",\n \"FIG.\",\n \"26 is a conceptual diagram that illustrates a moving line of light produced by controlled movement of a light source (not shown in FIG.\",\n \"26).\",\n \"For example, in some cases the light source comprises an object that emits light, such as a laser or directional LED.\",\n \"In other cases, the light source comprises a specular surface (such as a galvanometer-actuated mirror) that reflects light.\",\n \"In the example shown in FIG.\",\n \"26, a line of light sweeps across a scene, such that it intersects the scene at different spatial positions at times 2601, 2603, 2605, 2607, 2609.FIGS.\",\n \"27A, 27B and 27D show three examples of light sources that produce a line of light that sweeps across a scene, in some implementations of this invention.\",\n \"FIG.\",\n \"27A is a diagram, which shows a rotating mirror that reflects a rotating line of light.\",\n \"The mirror 2701 rotates about axis of rotation 2703, which axis is perpendicular to FIG.\",\n \"27A.\",\n \"A laser 2705 shines a laser beam through a Powell lens (not shown in FIG.\",\n \"27A).\",\n \"The Powell lens transforms the laser beam into a plane of laser light.\",\n \"As the mirror rotates, the angle of the plane of reflected laser light varies as a function of time.\",\n \"For example, at one time during the sweep, the plane of the laser light is aligned with direction 2711, and at another time during the sweep the plane of the laser light is aligned with direction 2713.FIG.\",\n \"27B is a diagram, which shows a projector 2721 that projects a moving line of light.\",\n \"The line of light is aligned with different directions at different times.\",\n \"For example, the line of light is aligned, at different times, with directions 2723, 2725, 2727.FIG.\",\n \"27C is a diagram, which shows an array of directional light sources (e.g., 2731, 2733, 2735, 2737) that, taken together, emit a moving line of light.\",\n \"The line of light is aligned with different directions at different times.\",\n \"For example, the line of light is aligned, at different times, with directions 2741, 2743, 2745.In illustrative implementations, 3D scanning is implemented as follows, for each superpixel: (a) n modulation signals are applied to n separate sets of pixels in a superpixel during a single camera frame, one modulation signal per pixel set, such that at least pixel in the superpixel is a member of each pixel set; (b) each modulation signal modulates the response of pixels to light from a scene, which light is incident on the pixel unit; (c) a computer determines a unique permutation of the n modulation signals, which permutation occurred at a time (the “hit time”) when the intensity of light reflected from the scene and incident on the pixel unit reached a maximum for the frame; (d) a computer uses this unique permutation to perform a first algorithm to compute 3D coordinates of a point in the scene, which point is the position in the scene from which light reflected directly to the superpixel at the hit time; and (e) the first algorithm includes computing the 3D coordinates of the point by triangulation or includes accessing values from a lookup table, which lookup table was computed by a second algorithm that includes computing 3D depth by triangulation.\",\n \"In some implementations, depth-sensing is implemented as follows: The n pixels in the superpixel record n separate modulation signals during a single frame of the camera, which correspond to the n bits of an n-bit code.\",\n \"A rotating mirror causes a plane of laser light to sweep across a scene during each camera frame.\",\n \"A complete sweep of the laser plane of light occurs during each camera frame.\",\n \"There are 2n permutations of the n-bit code, corresponding to 2n timeslots in each camera frame.\",\n \"The intensity of incident light at the superpixel is highest during a single timeslot in which the laser light reflects from the scene to the superpixel.\",\n \"Based on the permutation of the n modulation signals that is recorded by the superpixel at the “hit point” (when the intensity of incident light is highest), a computer determines the timeslot during which the hitpoint occurred.\",\n \"This timeslot in turn uniquely identifies the angle of rotation of the plane of laser light when the hitpoint occurred.\",\n \"From the angle of rotation of the plane of laser light, and from the known positions of the light source and of the pixel ray for the pixel, a computer calculates the 3D coordinates of the intersection of the pixel ray and the plane of laser light.\",\n \"This intersection is located at the scene point that directly reflected the laser light to the superpixel.\",\n \"This process is repeated for each scene point, yielding a cloud of computed 3D points in the scene.\",\n \"In some 3D scanning implementations of this invention, one or more processors (e.g., in processing unit 2805 in FIG.\",\n \"28) perform calculations that take the camera output, calibration, and other static or dynamic parameters, and produce a description of the scene, including a 3D reconstruction of the surface geometry of the scene.\",\n \"In some 3D scanning implementations of this invention, binary Gray code of length 9 is used for pixel set modulation.\",\n \"The illumination subsystem projects a sweeping laser line.\",\n \"The 9-bit vector represents the time t (within the frame 0), where U-Resolution is the horizontal number of pixels in the image sensor, and V-Resolution is the vertical number of pixels in the image sensor.\",\n \"In some cases, the image plane is a planar surface and the coordinate system consists of 2 orthogonal axes U and V. In another implementation of the invention, the image sensor is a curved surface.\",\n \"Light reflects from the objects in the scene, passes through camera optics (including, in many case, a lens) and forms an image on the sensor surface.\",\n \"The image captured by the image sensor has the same coordinate system as the image sensor.\",\n \"The camera has a camera center and the image plane is in front of the camera center.\",\n \"The perpendicular distance between camera center and image plane is equal to the focal distance) of the camera.\",\n \"The line perpendicular to the image plane, which crosses the camera center is the principal axis.\",\n \"The intersection of the principal axis with the image plane is called the principal point (p).\",\n \"The camera coordinate system is a local Cartesian coordinate system with 3 orthonormal axes.\",\n \"The origin of the coordinate system is in the camera center c. The x-axis has the same direction as the sensor's u-axis, the y-axis has the same direction as v-axis and the z-axis has the same orientation as principal axis).\",\n \"Each camera subsystem has its own Camera coordinate system.\",\n \"The coordinate system of the scene, the World Coordinate System, is a global coordinate system.\",\n \"The coordinate transforms between any camera coordinate system and the world coordinate system are standard coordinate conversions (represented by a coordinate conversion matrix and its inverse transform).\",\n \"The camera coordinate system is the same as camera subsystem coordinate system.\",\n \"The coordinate conversion matrix Rt is R t = ( r 1 , 1 r 1 , 2 r 1 , 3 t 1 r 2 , 1 r 2 , 2 r 2 , 3 t 2 r 3 , 1 r 3 , 2 r 3 , 3 t 3 ) where, ri,j is rotation parameter, and ti is translation parameter.\",\n \"The projection from world coordinates to image coordinates is performed as follows.\",\n \"The world coordinate of a point in the scene is xh=(x, y, z, 1)T—in homogeneous coordinates.\",\n \"World coordinates are converted to camera coordinate space by matrix multiplication, as follows: x=Rt*xh Point x is projected to a normalized image plane (which is located at a focal distance of 1 from the camera center).\",\n \"The coordinates of Point x in the scene, as projected to the normalized image plane, are x n = ∏ * x , where ∏ = ( 1 0 0 0 0 1 0 0 0 0 1 0 ) To convert to image coordinates xi, the xn is multiplied by a Camera Matrix A (which represents camera intrinsic parameters) A = ( α x 0 x 0 0 α y y 0 0 0 1 ) x i = A * x n In some implementation of the system, a transformation E (mapping 2D homogeneous space to 2D homogeneous space) compensates (at least partially) for optical distortion of the lens system.\",\n \"The image coordinate is computed as follows.\",\n \"xi=A*e[Π*(Rt*xh)] Having specific location of the pixel xi, there exist a bijection between image coordinates of a point xi and a corresponding normalized coordinates xn, (coordinates on normalized image plane).\",\n \"Having the normalized coordinates xn, there exists an infinite number of points, each projecting to xn on the normalized image plane.\",\n \"All of these points lie on a half-line (ray).\",\n \"The equation of the half line is x=c+(xn−c)*d where x is a vector of coordinates of a 3D point in space, c is a vector of a coordinates of the center of the camera (3D point), xn is a vector of normalized coordinates of the point xi and d>0 is a real number equal to the distance (parameter).\",\n \"The symbol “*” is the multiplication of vector by scalar.\",\n \"This relation between 2D image coordinate and the 3D half-line is called image point/coordinate re-projection.\",\n \"In some alternative implementations of the invention, a more complex geometrical model is used.\",\n \"In this model, the projection of a pixel into space is treated as a distribution function of possible light participation on a final pixel intensity.\",\n \"In some cases, a 3D scanning system employs triangulation to determine depth and a plane of laser light to illuminate the scene.\",\n \"In such a laser triangulation system, the calibration is sometimes performed as follows.\",\n \"The calibration is done in iterations.\",\n \"At first, the method for calibrating the camera subsystem(s) is performed as stated before.\",\n \"For calibrating the surface in the space, which is lit by the laser, calibration pattern comprising of multiple circles (such as 3301, 3303, 3305, 3307) is used.\",\n \"In the process, each of the camera subsystem captures images of the calibration pattern (the white areas comprise a diffuse surface with albedo near 1, the black areas comprise a diffuse surface with albedo near 0.5).\",\n \"The calibration pattern is printed on a stable planar surface (e.g.\",\n \"on top of glass table).\",\n \"During the exposure of the camera, the mutual position of the camera subsystem(s), the laser and the calibration pattern is fixed.\",\n \"At first, the camera(s) captures the image of a calibration pattern illuminated by ambient light, while the laser is off.\",\n \"From this frame, for every camera, the algorithm computes the equation of plane, which corresponds (during this step of calibration) to the planar surface of the calibration pattern (This part of the process is a sub-part of the camera calibration).\",\n \"The position/orientation of all elements of the system stays fixed, while camera(s) take image of the pattern lit by the laser (the laser is turned on before the second exposure).\",\n \"The laser light projects image features (curve of highly illuminated points) on the captured image of the calibration pattern, which show multiple positions of the calibration pattern.\",\n \"The algorithm detects these features using thresholding and finds the points of said curve with subpixel accuracy by finding the center of gravity of the intensity values in the cross-section of the said curve (a different sub-pixel strategy may be used).\",\n \"For example, if the projection of the laser light in the image is a curve maintaining vertical direction, the algorithm processes the image row by row, analyzing the center of gravity of the laser light in all image rows (if there are points above the threshold).\",\n \"The representation of the curve is a continuous (from a geometrical point of view) chain of 2D image coordinates.\",\n \"The algorithm re-projects these coordinates into 3D, which gives a set of half-lines directing from camera center.\",\n \"After that, the algorithm computes the 3D intersections of half-lines with the plane of the calibration patterns.\",\n \"These 3D coordinates are stored in memory as the chain (sample), which is a 3D representation of the projection of the laser light.\",\n \"The operator then changes the position of the calibration pattern (in some implementations, a robotic arm automatically changes the position of the calibration pattern), so that the new position of the calibration pattern defines a plane, that is different from all previous.\",\n \"During the calibration process, the operator/robot places the calibration pattern to multiple positions to ensure homogeneous coverage of measured samples in the measurement range of the system.\",\n \"After sufficient number of samples is captured (at least 2), a geometrical representation of the laser illuminated 3D surface (e.g.\",\n \"ruled surface) is computed by minimizing the error (e.g.\",\n \"mean square distance) of measured sample points and the geometrical representation of the surface.\",\n \"Triangulation In some implementations, the system computes the 3D position of the surface points in the field of view of the camera subsystem.\",\n \"For every pixel of the camera, the algorithm computes a pixel ray.\",\n \"The pixel ray is the re-projection (the half-line from the camera center).\",\n \"To compute the exact 3D position along the half-line, the algorithm computes d in the equation using an additional constraint.\",\n \"Specifically, the additional constraint is that the plane and the half-line line going from the camera center through the pixel are never parallel, i.e.\",\n \"there is always an intersection (as discussed below).\",\n \"In some implementations, the distance d is computed directly and substituted into the equation.\",\n \"In some implementations, the distance d is computed from triangulation principle.\",\n \"The additional constraint is either a plane or second half-line where the specific point lies.\",\n \"For the plane as additional constraint (the plane and the pixel's re-projection can not be parallel), the 3D point x for a specific pixel p has to satisfy 2 criteria: x=c+(xn−c)*d np·x+dp=0 where np, is a 3D normal vector of the plane, dp is the Euclidian distance between the plane and the origin of the coordinate system and symbol “·” is the dot product of two 3D vectors.\",\n \"To get the exact 3D point x, the algorithm performs an algorithm to compute unknown d: d=(np·c+dp)/(np·(c−xn)) where symbol “/” is the division of real numbers.\",\n \"Because the line and the plane are not parallel, it follows that (np·c−np·xn) is non-zero, and that d exists.\",\n \"A computer calculates x if the d is >0.x=c+(xn−c)*(np·c+dp)/(np·(c−xn)) In some implementations, 3D position of a surface points in the scene is retrieved using laser light, camera and triangulation technique.\",\n \"For example, the system shown in FIG.\",\n \"28 uses laser triangulation.\",\n \"Laser light emits from the illumination subsystem 2801 in form of laser line(s), laser dot(s) or different light shape (e.g.\",\n \"Ruled surface in 3D).\",\n \"The mutual position and orientation of every Illumination subsystem and every camera subsystem is known in any time t. In time t, the Illumination subsystem emits light on the scene 2811.For every pixel of the camera, if the laser illuminates a part of the scene that is observed by the pixel, the processing unit 2805 computes the 3D position of the illuminated part of the scene.\",\n \"All points illuminated by the laser lies on a defined 3D surface in the scene.\",\n \"The pixel of the camera collects light from a ray.\",\n \"The 3D point lies on intersection of this ray and the surface defined by the laser.\",\n \"In some cases, there is more that one such intersection and the processing unit chose the final 3D position by other regularization criteria.\",\n \"In some implementations of laser triangulation, the simple equation of plane is chosen as the representation of the laser illuminated 3D surface.\",\n \"In this case, the algorithm for plane fitting (based on principal components) is used.\",\n \"In some implementations of laser triangulation, the mutual position and orientation of the laser and the camera does not change over time.\",\n \"However, the position, and orientation of the laser source could change in time in a well controlled manner (e.g.\",\n \"mechanical change in position, rotation, deflection by mirror).\",\n \"In this case, the calibration is performed for fixed number of different laser source positions/orientations.\",\n \"The equation of the laser illuminated surface for all other positions/orientations are computed using sufficient mathematical model and interpolation.\",\n \"In many implementations of triangulation, profile inspection is performed.\",\n \"In that case, the illumination subsystem comprises the laser line source.\",\n \"During the measurement, the laser light illuminate single profile of the scene, the camera subsystem captures the projection of the laser light and the algorithm analyze the image with the approach used in part of calibration.\",\n \"The 3D points represents a profile of the measurement.\",\n \"Multiple Camera Subsystems In some implementations, the 3D scanning system includes two camera subsystems.\",\n \"For each camera and each pixel, the algorithm computes time t of the light peak.\",\n \"The values are stored in time images (the pixel of the images are the values of t).\",\n \"The first camera subsystem is primary.\",\n \"For every pixel of the primary camera, the algorithm computes the pixel re-projection.\",\n \"The corresponding 3D points lies on epipolar lines in the image of the second camera.\",\n \"On the time image of the second camera, the epipolar line cuts the image, which creates a 1D function of time values.\",\n \"The algorithm computes any value on the epipolar line using bilinear interpolation from adjacent pixels.\",\n \"The corresponding projection of the surface point lies on the epipolar line and have the same time t, as the pixel form the primary camera.\",\n \"The algorithm computes the position of the value t in the 1D function (with subpixel accuracy using bilinear interpolation).\",\n \"This position corresponds to pixel position on the second camera.\",\n \"The algorithm re-projects the pixel position as a half-line in 3D.\",\n \"The algorithm computes the 3D point as an intersection of two half-lines.\",\n \"An advantage of this approach is higher robustness and accuracy, while the geometry calculations are not dependent on calibration of Illumination subsystem Alternative Implementations In some implementations of the system, the system comprises plurality of illumination subsystems.\",\n \"In some implementations of this invention, the features in the scene are formed artificially by an illumination subsystem.\",\n \"There are different coding strategies that create specific coding for different points in the scene.\",\n \"This allows for more robust and accurate feature detection and position estimation.\",\n \"In some implementations, this invention operates in multiple modes.\",\n \"One such mode is a high spatial resolution mode, which uses the same modulation signal for all pixels.\",\n \"The pixels from different sets are combined to produce one high spatial resolution image.\",\n \"In this mode, all pixels in the imaging sensor act like one pixel set.\",\n \"The ability to switch to this mode allows the scanner to select between real-time (lower resolution) mode and non-real-time (multiple sequential camera frames) high resolution mode for a more precise reconstruction.\",\n \"Alternatively, this invention may be implemented as follows: An aluminum box may serve as a cover for a 3D scanning system.\",\n \"Inside the box, each of the following components are placed: a camera with ability to regulate the response of its pixels (globally), a (visible) red light laser, rotating mirror, Powell lens, and electronics that drive the rotating mirror.\",\n \"The Powell lens is a special kind of lens which transforms a laser dot to a line.\",\n \"As the mirror rotates according to the signal from the computer, the laser line sweeps along the scene over an angle of about 30 degrees.\",\n \"Instead of having multiple sets of pixels in the imaging sensor during a single frame, the scanner uses only one set of pixels and gathers multiple image frames.\",\n \"This alternative embodiment is well suited to 3D scan with high spatial resolution, but is not well suited for scanning a moving object.\",\n \"In some cases, a shape of illumination other than a straight line is used.\",\n \"For example, in some cases: (a) the pattern is formed by a laser using a special lens (variation of Powell lens); (b) a light source projects a line to a non-flat mirror (e.g.\",\n \"a spherical or parabolic mirror); or (c) the light source comprises LED lights that are arranged in a spherical, circular, elliptical, parabolic or hyperbolic shape, and that project a curved surface.\",\n \"In some implementations of the system, the system operates either in realtime mode (with different pixel modulation signals), or in high-res mode.\",\n \"In high-res mode, the scanning process consists of multiple exposures and laser sweeps in succession.\",\n \"In every exposure, the Control units apply the modulation signals to whole image sensor.\",\n \"The multiple pixel values consists of values captured in succession.\",\n \"This allows to compute the time t of the light peak and appropriate 3D point for every pixel in the image sensor.\",\n \"In some implementations of the invention, the system uses different coding strategies to encode the time of pixel illumination alongside Gray codes.\",\n \"In a preferred embodiment, the control units creates a set of periodic sinusoidal functions with equal period and different phase shift (e.g.\",\n \"4 sinusoidal functions shifted by π/2 rad each after another).\",\n \"The set of modulation function (phase shifting modulation functions) is applied to appropriate number of image sets (in some cases, multiple image sets are modulated by the same function to collect more samples).\",\n \"The corresponding pixel sets (and the corresponding pixels in every superpixels) are phase shifting pixels (for the simplicity of description).\",\n \"The number of periods of the modulation functions increase the possible accuracy of the coding.\",\n \"In general, the period of the function has to be at least 2 times longer that the time period Ts the laser line needs to swipe through the area of projection of individual pixels of the sensor.\",\n \"In some implementations, the distance to measured surface does not affect time Ts.\",\n \"While the time period Ts is short (due to given constraints), the received illumination (the collected pixel intensity), the values of phase shifting pixels in superpixels, encodes the phase (the position inside the period).\",\n \"While the coding uses periodic function, the algorithm computes the index of period from the Gray coded pixels (the index time period Ti is shorter than the period of the used sinusoidal functions).\",\n \"In some implementations, the system uses 4 sinusoidal functions shifted by π/2 rad each after another.\",\n \"The values of corresponding phase shifting pixels are A0, A1, A2, A3.The algorithm computes the phase value φ using the following equation: ϕ = atan 2 ( A 0 - A 2 , A 1 - A 3 ) atan 2 ( y , x ) = { arctan y x x > 0 arctan y x + π y ≥ 0 , x < 0 arctan y x - π y < 0 , x < 0 + π 2 y > 0 , x = 0 - π 2 y < 0 , x = 0 undefined y = 0 , x = 0 The time t of the light peak is delivered as: t=PeriodIndex*Tperiod+[(φ+π)/(2*π)]*Tperiod where Tperiod is the length of the period of the sinusoidal function, and the PeriodIndex is the index of the period derived from time period Ti.\",\n \"In some implementations, the system uses phase shifting modulation functions with different period.\",\n \"For example, first set of phase shifting modulation signal have period of the same length as the exposure T, the second set has period of T/256.The algorithm decodes the phase value of the light peak (the time, when the laser sweeps across the projection of the individual pixel of the sensor) for both sets.\",\n \"The second phase value represents accurate measurement of the time of the occurrence of the light peak (up to the period index), the first phase value represents unambiguous measurement (Because of the physical limitations of the sensor, such measurement is in the most cases less accurate, than the one from multiple periods phase shifting modulation functions), which the algorithm uses to set the right period index.\",\n \"In some implementations, the system uses different modulation functions (e.g.\",\n \"square waves).\",\n \"In some implementations of the system, the pixels comprises multiple storages.\",\n \"The modulation signals controls the allocation of the accumulated photo-electrons to different storages.\",\n \"This allows for capturing multiple phase shifting values in single pixel.\",\n \"Computers In exemplary implementations of this invention, one or more electronic computers (e.g.\",\n \"2803, 2805) are programmed and specially adapted: (1) to control the operation of, or interface with, hardware components of an imaging system, including by modulating the transfer of charge in a pixel photodiode to one or more storage devices, and for controlling a reflective or transmissive SLM to control intensity of light incident on image sensor pixels; (2) to control the operation of, or interface with, hardware components of a 3D scanning system, including an illumination subsystem and a camera subsystem; (3) to process data captured by an image sensor; (4) to perform triangulation to reconstruct 3D surface geometry; (5) to perform calibration, including calibration of any camera or light source; (6) to output modulation signals for modifying the response of pixels to incident light; (7) to output control signals to synchronize illumination of a scene with modulation of pixels; (8) to perform any other calculation, computation, program, algorithm, computer function or computer task described or implied above, including any optimization algorithm; (9) to receive signals indicative of human input; (10) to output signals for controlling transducers for outputting information in human perceivable format; and (11) to process data, to perform computations, to execute any algorithm or software, and to control the read or write of data to and from memory devices.\",\n \"The one or more computers may be in any position or positions within or outside of a 3D scanning system or imaging system.\",\n \"For example, in some cases (a) at least one computer is housed in or together with other components of the system, and (b) at least one computer is remote from other components of the system.\",\n \"The one or more computers are connected to each other or to other components in the system either: (a) wirelessly, (b) by wired connection, or (c) by a combination of wired and wireless connections.\",\n \"In exemplary implementations, one or more computers are programmed to perform any and all calculations, computations, programs, algorithms, computer functions and computer tasks described or implied above.\",\n \"For example, in some cases: (a) a machine-accessible medium has instructions encoded thereon that specify steps in a software program; and (b) the computer accesses the instructions encoded on the machine-accessible medium, in order to determine steps to execute in the program.\",\n \"In exemplary implementations, the machine-accessible medium comprises a tangible non-transitory medium.\",\n \"In some cases, the machine-accessible medium comprises (a) a memory unit or (b) an auxiliary memory storage device.\",\n \"For example, in some cases, a control unit in a computer fetches the instructions from memory.\",\n \"In illustrative implementations, one or more computers execute programs according to instructions encoded in one or more a tangible, non-transitory, computer-readable media.\",\n \"For example, in some cases, these instructions comprise instructions for a computer to perform any calculation, computation, program, algorithm, computer function or computer task described or implied above.\",\n \"For example, in some cases, instructions encoded in a tangible, non-transitory, computer-accessible medium comprise instructions for a computer to: (1) to control the operation of, or interface with, hardware components of an imaging system, including by modulating the transfer of charge in a pixel photodiode to one or more storage devices, and for controlling a reflective or transmissive SLM to control intensity of light incident on image sensor pixels; (2) to control the operation of, or interface with, hardware components of a 3D scanning system, including an illumination subsystem and a camera subsystem; (3) to process data captured by an image sensor; (4) to perform triangulation to reconstruct 3D surface geometry; (5) to perform calibration, including calibration of any camera or light source; (6) to output modulation signals for modifying the response of pixels to incident light; (7) to output control signals to synchronize illumination of a scene with modulation of pixels; (8) to perform any other calculation, computation, program, algorithm, computer function or computer task described or implied above, including any optimization algorithm; (9) to receive signals indicative of human input; (10) to output signals for controlling transducers for outputting information in human perceivable format; and (11) to process data, to perform computations, to execute any algorithm or software, and to control the read or write of data to and from memory devices.\",\n \"Definitions The terms “a” and “an”, when modifying a noun, do not imply that only one of the noun exists.\",\n \"To compute “based on” specified data means to perform a computation that takes the specified data as an input.\",\n \"Here are some non-limiting examples of a “camera”: (a) an optical instrument that records images; (b) a digital camera; (c) a video camera; (d) a camera that uses photographic film or a photographic plate; (e) a light field camera; (f) an imaging system, (g) a light sensor; (h) a time-of-flight camera; (h) apparatus that includes a light sensor or an array of light sensors; and (i) apparatus for gathering data about light incident on the apparatus.\",\n \"The term “camera” includes any computers that process data captured by the camera.\",\n \"The term “comprise” (and grammatical variations thereof) shall be construed as if followed by “without limitation”.\",\n \"If A comprises B, then A includes B and may include other things.\",\n \"The term “computer” includes any computational device that performs logical and arithmetic operations.\",\n \"For example, in some cases, a “computer” comprises an electronic computational device, such as an integrated circuit, a microprocessor, a mobile computing device, a laptop computer, a tablet computer, a personal computer, or a mainframe computer.\",\n \"For example, in some cases, a “computer” comprises: (a) a central processing unit, (b) an ALU (arithmetic/logic unit), (c) a memory unit, and (d) a control unit that controls actions of other components of the computer so that encoded steps of a program are executed in a sequence.\",\n \"For example, in some cases, the term “computer” also includes peripheral units, including an auxiliary memory storage device (e.g., a disk drive or flash memory).\",\n \"However, a human is not a “computer”, as that term is used herein.\",\n \"“Defined Term” means a term or phrase that is set forth in quotation marks in this Definitions section.\",\n \"The term “e.g.” means for example.\",\n \"The fact that an “example” or multiple examples of something are given does not imply that they are the only instances of that thing.\",\n \"An example (or a group of examples) is merely a non-exhaustive and non-limiting illustration.\",\n \"Unless the context clearly indicates otherwise: (1) a phrase that includes “a first” thing and “a second” thing does not imply an order of the two things (or that there are only two of the things); and (2) such a phrase is simply a way of identifying the two things, respectively, so that they each can be referred to later with specificity (e.g., by referring to “the first” thing and “the second” thing later).\",\n \"For example, unless the context clearly indicates otherwise, if an equation has a first term and a second term, then the equation may (or may not) have more than two terms, and the first term may occur before or after the second term in the equation.\",\n \"A phrase that includes a “third” thing, a “fourth” thing and so on shall be construed in like manner.\",\n \"The term “for instance” means for example.\",\n \"“Forward”, in the context of an SLM, means to reflect light from the SLM or to transmit light that passes through the SLM.\",\n \"“Forwarding rate” of an SLM pixel relative to an imaging pixel means a ratio of (a) intensity of light incident on an SLM pixel and (b) intensity of light that is incident on the imaging pixel and forwarded by the SLM pixel.\",\n \"In the context of a camera (or components of the camera), “front” is optically closer to the scene being imaged, and “rear” is optically farther from the scene, during normal operation of the camera.\",\n \"In the context of a display device (or components of the display device), “front” is optically closer to a human viewer, and “rear” is optically farther from the viewer, when the viewer is viewing a display produced by the device during normal operation of the device.\",\n \"The “front” and “rear” of a display device continue to be the front and rear, even when no viewer is present.\",\n \"“Herein” means in this document, including text, specification, claims, abstract, and drawings.\",\n \"“Imaging pixel” means a component of an imaging sensor, which component takes measurements of intensity of light incident on a region of the imaging sensor, such that the intensity is measured for the entire region and is not separately measured for any subregion of the region.\",\n \"“Imaging superpixel” means a set of imaging pixels, such that each imaging pixel in the set is a horizontal, vertical or diagonal neighbor of another imaging pixel in the set.\",\n \"As used herein: (1) “implementation” means an implementation of the present invention; (2) “embodiment” means an embodiment of the present invention; (3) “case” means an implementation of the present invention; and (4) “use scenario” means a use scenario of the present invention.\",\n \"The term “include” (and grammatical variations thereof) shall be construed as if followed by “without limitation”.\",\n \"“Intensity” means any measure of or related to intensity, energy or power.\",\n \"For example, the “intensity” of light includes any of the following measures: irradiance, spectral irradiance, radiant energy, radiant flux, spectral power, radiant intensity, spectral intensity, radiance, spectral radiance, radiant exitance, radiant emittance, spectral radiant exitance, spectral radiant emittance, radiosity, radiant exposure or radiant energy density.\",\n \"In the case of a ratio of two intensities, both of the intensities in the ratio have the same SI units.\",\n \"“I/O device” means an input/output device.\",\n \"For example, an I/O device includes any device for (a) receiving input from a human, (b) providing output to a human, or (c) both.\",\n \"For example, an I/O device includes a user interface, graphical user interface, keyboard, mouse, touch screen, microphone, handheld controller, display screen, speaker, or projector for projecting a visual display.\",\n \"Also, for example, an I/O device includes any device (e.g., button, dial, knob, slider or haptic transducer) for receiving input from, or providing output to, a human.\",\n \"“Light” means electromagnetic radiation of any frequency.\",\n \"For example, “light” includes, among other things, visible light and infrared light.\",\n \"Likewise, any term that directly or indirectly relates to light (e.g., “imaging”) shall be construed broadly as applying to electromagnetic radiation of any frequency.\",\n \"As used herein, (i) a single scalar is not a “matrix”, and (ii) one or more entries, all of which are zero (i.e., a so-called null matrix), is not a “matrix”.\",\n \"The “maximum dimension” of an object means the longest Euclidian distance between any two points on the exterior surface of the object.\",\n \"To “multiply” includes to multiply by an inverse.\",\n \"Thus, to “multiply” includes to divide.\",\n \"The term “n-ary” is defined elsewhere in this document.\",\n \"Two pixels are “neighbors” if the two pixels are positioned such that (i) the two pixels are adjacent to each other in a matrix of pixels and (ii) no pixel is between the two pixels.\",\n \"“Pixel set” means a set of pixels to which an identical modulation signal is applied.\",\n \"The term “or” is inclusive, not exclusive.\",\n \"For example A or B is true if A is true, or B is true, or both A or B are true.\",\n \"Also, for example, a calculation of A or B means a calculation of A, or a calculation of B, or a calculation of A and B.\",\n \"A parenthesis is simply to make text easier to read, by indicating a grouping of words.\",\n \"A parenthesis does not mean that the parenthetical material is optional or can be ignored.\",\n \"A “read-out frame” means a period of time that begins when an exposure of an imaging pixel to light starts and that ends when digital data is created that is indicative of charge accumulated during the exposure.\",\n \"“Reflective SLM” means a device that (i) reflects light from the device, and (ii) attenuates the light, such that the amount of attenuation of a light ray incident at a point on a surface of the device depends on at least the 2D spatial position of the point on the surface.\",\n \"To compute a term that “satisfies” an equation: (a) does not require that calculations involve terms, variables or operations that are in the equation itself, as long as a solution of the equation (subject to error, as described in part (b) of this sentence) is computed; and (b) includes computing a solution that differs from a correct solution of the equation by an error amount, which error amount arises from one or more of (i) rounding, (ii) other computational imprecision, including error due to modeling a continuous signal by a discrete signal or due to using an insufficiently small step size in calculations, and (iii) signal noise or other physical limitations of sensors or other physical equipment.\",\n \"As used herein, the term “set” does not include a so-called empty set (i.e., a set with no elements) and does not include a set with only one element.\",\n \"Mentioning a first set and a second set does not, in and of itself, create any implication regarding whether or not the first and second sets overlap (that is, intersect).\",\n \"The term “signal generator” includes any signal generator, function generator, digital pattern generator, frequency generator and any other electronic device that generates repeating or non-repeating electrical signals, including either digital or analog signals.\",\n \"“Some” means one or more.\",\n \"A “spatial light modulator”, also called an “SLM”, means a device that (i) transmits light through the device or reflects light from the device, and (ii) attenuates the light, such that the amount of attenuation of a light ray incident at a point on a surface of the device depends on at least the 2D spatial position of the point on the surface.\",\n \"A non-limiting example of changing the “sensitivity” of an imaging pixel is to change the state of a circuit so as to control which storage device, out of a set of storage devices, receives a particular electric charge, which electric charge (i) accumulated in a photodiode of the imaging pixel and (ii) will not be and has not been transferred to or from any other storage device in the set.\",\n \"To say that a set of signals is “separate” means that no signal in the set is a function of any other signal in the set.\",\n \"A “storage device” means any device for storing electric charge, including a capacitor, floating diffusion or capacitive bin.\",\n \"“Subregion” of a first region means a part, but not all, of the first region.\",\n \"As used herein, a “subset” of a set consists of less than all of the elements of the set.\",\n \"“Substantially” means at least ten percent.\",\n \"For example: (a) 112 is substantially larger than 100; and (b) 108 is not substantially larger than 100.To say that a thing is “substantially constant” means that the thing has a value that is always within a single range, such that: (a) the lowest value in the range is equal to a constant number minus ten percent of the constant number; and (b) the highest value in the range is equal to the constant number plus ten percent of the constant number.\",\n \"The term “such as” means for example.\",\n \"Spatially relative terms such as “under”, “below”, “above”, “over”, “upper”, “lower”, and the like, are used for ease of description to explain the positioning of one element relative to another.\",\n \"The terms are intended to encompass different orientations of an object in addition to different orientations than those depicted in the figures.\",\n \"“Transmissive SLM” means a device that (i) transmits light through the device, and (ii) attenuates the light, such that the amount of attenuation of a light ray incident at a point on a surface of the device depends on at least the 2D spatial position of the point on the surface.\",\n \"A matrix may be indicated by a bold capital letter (e.g., D).\",\n \"A vector may be indicated by a bold lower case letter (e.g., a).\",\n \"However, the absence of these indicators does not indicate that something is not a matrix or not a vector.\",\n \"Except to the extent that the context clearly requires otherwise, if steps in a method are described herein, then the method includes variations in which: (1) steps in the method occur in any order or sequence, including any order or sequence different than that described; (2) any step or steps in the method occurs more than once; (3) different steps, out of the steps in the method, occur a different number of times during the method, (4) any combination of steps in the method is done in parallel or serially; (5) any step or steps in the method is performed iteratively; (6) a given step in the method is applied to the same thing each time that the given step occurs or is applied to different things each time that the given step occurs; or (7) the method includes other steps, in addition to the steps described.\",\n \"This Definitions section shall, in all cases, control over and override any other definition of the Defined Terms.\",\n \"For example, the definitions of Defined Terms set forth in this Definitions section override common usage or any external dictionary.\",\n \"If a given term is explicitly or implicitly defined in this document, then that definition shall be controlling, and shall override any definition of the given term arising from any source (e.g., a dictionary or common usage) that is external to this document.\",\n \"If this document provides clarification regarding the meaning of a particular term, then that clarification shall, to the extent applicable, override any definition of the given term arising from any source (e.g., a dictionary or common usage) that is external to this document.\",\n \"To the extent that any term or phrase is defined or clarified herein, such definition or clarification applies to any grammatical variation of such term or phrase, taking into account the difference in grammatical form.\",\n \"For example, the grammatical variations include noun, verb, participle, adjective, or possessive forms, or different declensions, or different tenses.\",\n \"In each case described in this paragraph, Applicant is acting as Applicant's own lexicographer.\",\n \"Variations: This invention may be implemented in many different ways.\",\n \"No claims are made in this section entitled “Variations”.\",\n \"For example, no claims are made in paragraphs [A] to [BR] below.\",\n \"Instead, this section entitled “Variations” helps to support claims.\",\n \"Paragraphs [A] to [BR] below are descriptions of non-limiting examples of illustrative implementations of this invention [A] A method comprising simultaneously modulating a plurality of imaging pixels in an imaging superpixel by a set of separate modulation signals, such that each imaging pixel in the imaging superpixel is modulated by a modulation signal that causes sensitivity of the imaging pixel to vary over time.\",\n \"[B] The method of paragraph [A], wherein: (a) the modulation signals each consist of a temporal sequence of modulation states; and (b) the number of times that each specific modulation state occurs, and the order in which the modulation states occur, varies from modulation signal to modulation signal.\",\n \"[C] The method of paragraph [A], wherein the set of modulation signals, taken together, comprise a code, each of the modulation signals representing a digit of the code.\",\n \"[D] The method of paragraph [C], wherein the code is a binary code and each of the modulations signals represents a bit of the code.\",\n \"[E] The method of paragraph [C], wherein the code is a binary gray code.\",\n \"[F] The method of paragraph [C], wherein the code is a 9-bit binary gray code.\",\n \"[G] The method of paragraph [C], wherein the code is an n-ary code.\",\n \"[H] The method of paragraph [A], wherein: (a) the modulating occurs during a readout-frame, which readout-frame includes an exposure period; and (b) each imaging pixel in the imaging superpixel includes a photodiode that, during the exposure period, transfers electric charge to only one storage device, such that at multiple times during the exposure period, electric charge is transferred from the photodiode to the storage device.\",\n \"[I] The method of paragraph [H], wherein, at multiple other times during the exposure period, electric charge is drained from the photodiode, without being saved for later readout.\",\n \"[J] The method of paragraph [H], wherein, during the exposure period, the storage device receives electric charge only from the photodiode.\",\n \"[K] The method of paragraph [A], wherein: (a) the modulating occurs during a readout-frame, which readout-frame includes an exposure period; and (b) each imaging pixel in the imaging superpixel includes a photodiode that, at multiple times during the exposure period, transfers electric charge to a set of storage devices, such that: (i) at any given time at which a transfer of electric charge from the photodiode to a storage device occurs, electric charge is being transferred to only one of the storage devices, and electric charge is not being transferred to any other storage device, and (ii) electric charge is transferred from the photodiode to each of the storage devices during the exposure period.\",\n \"[L] The method of paragraph [K], wherein, during the exposure period, the storage devices receive electric charge only from the photodiode.\",\n \"[M] A method comprising simultaneously: (a) modulating a plurality of imaging pixels in an imaging superpixel by a set of separate modulation signals, such that each imaging pixel in the imaging superpixel is modulated by a modulation signal that causes sensitivity of the imaging pixel to vary over time; and (b) using one or more light sources to illuminate a scene by a pattern of light that changes over time.\",\n \"[N] The method of paragraph [M], wherein: (a) the modulation signals each consist of a temporal sequence of modulation states; and (b) the number of times that each specific modulation state occurs, and the order in which the modulation states occur, varies from modulation signal to modulation signal.\",\n \"[O] The method of paragraph [M], wherein the pattern of light changes in at least intensity over time.\",\n \"[P] The method of paragraph [M], wherein the pattern of light changes in at least direction or position, relative to the scene, over time.\",\n \"[Q] The method of paragraph [M], wherein the pattern of light changes in at least polarization over time.\",\n \"[R] The method of paragraph [M], wherein the pattern of light changes in at least wavelength or electromagnetic spectrum over time.\",\n \"[S] The method of paragraph [M], wherein: (a) the pattern of light sweeps across a scene, such that a point in the scene, when directly illuminated by the pattern of light, reflects light directly to the imaging superpixel; (b) the method further comprises using one or more computers to process data indicative of measurements recorded by the imaging superpixel and, based in part on the data, to calculate 3D spatial coordinates of the point.\",\n \"[T] The method of paragraph [S], wherein the pattern of light comprises a plane of laser light.\",\n \"[U] The method of paragraph [S], wherein the method includes using a galvanometer-actuated mirror to sweep a plane of laser light across a scene.\",\n \"[V] The method of paragraph [S], wherein, when calculating 3D spatial coordinates of the point, the computer performs an algorithm that either: (a) involves triangulation; or (b) involves accessing data that was calculated by a computer using an algorithm that involves triangulation.\",\n \"[W] The method of paragraph [M], wherein the set of modulation signals, taken together, comprise a code, each of the modulation signals representing a digit of the code.\",\n \"[X] The method of paragraph [W], wherein the code is a binary code and each of the modulation signals represents a bit of the code.\",\n \"[Y] The method of paragraph [W], wherein the code is a binary gray code.\",\n \"[Z] The method of paragraph [W], wherein the code is a 9-bit binary gray code.\",\n \"[AA] The method of paragraph [W], wherein at different times during each sweep of the pattern of light across the scene, the modulation signals, taken together, represent different permutations of the code.\",\n \"[AB] The method of paragraph [W], wherein the modulation signals, taken together, represent each of the permutations of the code at different times during an entire sweep of the pattern of light across the scene, one permutation at a time.\",\n \"[AC] The method of paragraph [W], wherein: (a) each entire sweep of the pattern of light across the scene occurs in a time period, which time period consists of a set of subintervals, the total number of subintervals being equal to the number of permutations of the code; (b) during each subinterval, the modulation signals, taken together, represent only one of the permutations of the code; (c) intensity of light incident on the imaging superpixel reaches a maximum value for the entire sweep during a specific subinterval; and (d) a computer analyzes data indicative of measurements taken by imaging pixels of the imaging superpixel and, based on that data, determines the permutation of the code represented by the modulation signals during the specific subinterval.\",\n \"[AD] The method of paragraph [M], wherein: (a) the modulating occurs during a readout-frame, which readout-frame includes an exposure period; and (b) each imaging pixel in the imaging superpixel includes a photodiode that, during the exposure period, transfers electric charge to only one storage device, such that at multiple times during the exposure period, electric charge is transferred from the photodiode to the storage device.\",\n \"[AE] The method of paragraph [AD], wherein, at multiple other times during the exposure period, electric charge is drained from the photodiode, without being saved for later readout.\",\n \"[AF] The method of paragraph [AD], wherein, during the exposure period, the storage device receives electric charge only from the photodiode.\",\n \"[AG] The method of paragraph [M], wherein: (a) the modulating occurs during a readout-frame, which readout-frame includes an exposure period; and (b) each imaging pixel in the imaging superpixel includes a photodiode that, at multiple times during the exposure period, transfers electric charge to a set of storage devices, such that: (i) at any given time at which a transfer of electric charge from the photodiode to a storage device occurs, electric charge is being transferred to only one of the storage devices, and electric charge is not being transferred to any other storage device, and (ii) electric charge is transferred from the photodiode to each of the storage devices during the exposure period.\",\n \"[AH] The method of paragraph [AG], wherein, during the exposure period, the storage devices receive electric charge only from the photodiode.\",\n \"[AI] A system comprising, in combination: (a) a camera, which camera includes an imaging superpixel; and (b) one or more signal generators for producing a set of separate modulation signals, such that each imaging pixel in the imaging superpixel is modulated by a modulation signal that causes sensitivity of the imaging pixel to vary over time.\",\n \"[AJ] The system of paragraph [AI], wherein: (a) the modulation signals each consist of a temporal sequence of modulation states; and (b) the number of times that each specific modulation state occurs, and the order in which the modulation states occur, varies from modulation signal to modulation signal.\",\n \"[AK] The system of paragraph [AI], wherein the set of modulation signals, taken together, comprise a code, each of the modulation signals representing a digit of the code.\",\n \"[AL] The system of paragraph [AI], wherein the code is a binary code and each of the modulations signals represents a bit of the code.\",\n \"[AM] The system of paragraph [AI], wherein the code is a binary gray code.\",\n \"[AN] The system of paragraph [AI], wherein the code is a 9-bit binary gray code.\",\n \"[AO] The system of paragraph [AI], wherein the code is an n-ary code.\",\n \"[AP] A system comprising, in combination: (a) a camera, which camera includes an imaging superpixel; (b) one or more signal generators for producing a set of separate modulation signals, such that (i) each imaging pixel in the imaging superpixel is modulated by a modulation signal that causes sensitivity of the imaging pixel to vary over time, and (ii) a modulation signal, out of the set of modulation signals, causes each photodiode in the superpixel, at multiple times during an exposure period of a read-out frame, to transfer electric charge from the photodiode to only one storage device, which storage device does not receive electric charge from any other photodiode during the exposure period.\",\n \"[AQ] A system comprising, in combination: (a) a camera, which camera includes an imaging superpixel; and (b) one or more signal generators for producing a set of separate modulation signals, such that (i) each imaging pixel in the imaging superpixel is modulated by a modulation signal that causes sensitivity of the imaging pixel to vary over time, and (ii) a modulation signal, out of the set of modulation signals, causes each photodiode in the superpixel, at multiple times during an exposure period of a read-out frame, to transfer electric charge from the photodiode to a set of storage devices, such that (1) at any given time at which a transfer of electric charge from the photodiode to a storage device occurs, electric charge is being transferred to only one of the storage devices, and electric charge is not being transferred to any other storage device, and (2) electric charge is transferred from the photodiode to each of the storage devices during the exposure period.\",\n \"[AR] A system comprising, in combination: (a) a camera, which camera includes an imaging superpixel; (b) one or more light sources for illuminating a scene by a pattern of light that changes over time; and (c) one or more signal generators for producing a set of separate modulation signals, such that each imaging pixel in the imaging superpixel is modulated by a modulation signal that causes sensitivity of the imaging pixel to vary over time.\",\n \"[AS] A system comprising, in combination: (a) a camera, which camera includes an imaging superpixel; (b) one or more light sources for illuminating a scene by a pattern of light that sweeps across the scene, such that a point in the scene, when directly illuminated by the pattern of light, reflects light directly to the imaging superpixel; and (c) one or more signal generators for producing a set of separate modulation signals that occur while the scene is illuminated by the pattern of light, such that each imaging pixel in the imaging superpixel is modulated by a modulation signal that causes sensitivity of the imaging pixel to vary over time; and (d) one or more computers for processing data indicative of measurements recorded by the imaging superpixel and for calculating, based on this data, 3D spatial coordinates of the point, by performing an algorithm that either (i) involves triangulation; or (ii) involves accessing data that was calculated by a computer using an algorithm that involves triangulation.\",\n \"[AT] A system comprising, in combination: (a) a camera, which camera includes an imaging superpixel; and (b) one or more light sources for illuminating a scene by a pattern of light that sweeps across the scene, such that a point in the scene, when directly illuminated by the pattern of light, reflects light directly to the imaging superpixel; (c) one or more signal generators for producing a set of separate modulation signals, such that (i) each imaging pixel in the imaging superpixel is modulated by a modulation signal that causes sensitivity of the imaging pixel to vary over time; (ii) the set of modulation signals, taken together, comprise a code, each of the modulation signals representing a digit of the code.\",\n \"(iii) each entire sweep of the pattern of light across the scene occurs in a time period, which time period consists of a set of subintervals, the total number of subintervals being equal to the number of permutations of the code; (iv) during each subinterval, the modulation signals, taken together, represent only one of the permutations of the code; (v) intensity of light incident on the imaging superpixel reaches a maximum value for the entire sweep during a specific subinterval; and (d) one or more computers for (i) processing data indicative of measurements recorded by the imaging superpixel, (ii) calculating the permutation of the code represented by the modulation signals during the specific subinterval, and (iii) calculating 3D spatial coordinates of the point.\",\n \"[AU] A method comprising simultaneously modulating a plurality of SLM pixels in an SLM by a set of separate modulation signals, wherein: (a) the plurality of SLM pixels are optically aligned with an imaging superpixel, such that each respective SLM pixel, in one or more states of the respective SLM pixel, forwards light to an imaging pixel in the imaging superpixel; (b) each respective SLM pixel in the SLM is modulated by a modulation signal, out of the set of modulation signals, that causes a forwarding rate of the respective SLM pixel relative to a imaging pixel to vary over time; (c) the set of modulation signals, taken together, comprise a code, each of the modulation signals representing a digit of the code; (d) at any given time during the modulating, the modulation signals, taken together, represent only one of the permutations of a code; (e) the modulation signals, taken together over a time period that spans at least a portion of the modulating, comprise a temporal sequence of all of the permutations of the code.\",\n \"[AV] The method of paragraph [AU], wherein the light that is forwarded comprises light reflected by the SLM.\",\n \"[AW] The method of paragraph [AV], wherein the SLM comprises a digital micromirror device.\",\n \"[AX] The method of paragraph [AV], wherein the SLM comprises a reflective liquid-crystal-on-silicon device.\",\n \"[AY] The method of paragraph [AU], wherein the light that is forwarded comprises light that passes through the SLM.\",\n \"[AZ] The system of paragraph [AY], wherein the SLM comprises a liquid crystal display device.\",\n \"[BA] A system comprising (a) an SLM; and (b) a camera that includes an imaging superpixel; wherein (i) the plurality of SLM pixels are optically aligned with an imaging superpixel, such that each respective SLM pixel, in one or more states of the respective SLM pixel, forwards light to an imaging pixel in the imaging superpixel; (ii) the plurality of SLM pixels are modulated by a set of separate modulation signals, such that (1) each respective SLM pixel in the SLM is modulated by a specific modulation signal, out of the set of modulation signals, which specific modulation signal causes a forwarding rate of the respective SLM pixel relative to a imaging pixel to vary over time; (2) the set of modulation signals, taken together, comprise a code, each of the modulation signals representing a digit of the code, (3) at any given time during the modulating, the modulation signals, taken together, represent only one of the permutations of a code, and (4) the modulation signals, taken together over a time period that spans at least a portion of the modulating, comprise a temporal sequence of all of the permutations of the code; and (vi) the system also includes a signal generator for producing the set of modulation signals.\",\n \"[BB] The system of paragraph [BA], wherein the light that is forwarded comprises light reflected by the SLM.\",\n \"[BC] The system of paragraph [BB], wherein the SLM comprises a digital micromirror device.\",\n \"[BD] The system of paragraph [BB], wherein the SLM comprises a reflective liquid-crystal-on-silicon device.\",\n \"[BE] The system of paragraph [BA], wherein the light that is forwarded comprises light that passes through the SLM.\",\n \"[BF] The system of paragraph [BE], wherein the SLM comprises a liquid crystal display device.\",\n \"[BG] A system comprising, in combination: (a) a camera, which camera includes an imaging superpixel; and (b) one or more computers that are programmed to output a set of separate modulation signals, such that each imaging pixel in the imaging superpixel is modulated by a modulation signal that causes sensitivity of the imaging pixel to vary over time.\",\n \"[BH] The system of paragraph [BG], wherein: (a) the modulation signals each consist of a temporal sequence of modulation states; and (b) the number of times that each specific modulation state occurs, and the order in which the modulation states occur, varies from modulation signal to modulation signal.\",\n \"[BI] The system of paragraph [BG], wherein the set of modulation signals, taken together, comprise a code, each of the modulation signals representing a digit of the code.\",\n \"[BJ] The system of paragraph [BG], wherein the code is a binary code and each of the modulations signals represents a bit of the code.\",\n \"[BK] The system of paragraph [BG], wherein the code is a binary gray code.\",\n \"[BL] The system of paragraph [BG], wherein the code is a 9-bit binary gray code.\",\n \"[BM] The system of paragraph [BG], wherein the code is an n-ary code.\",\n \"[BN] A system comprising, in combination: (a) a camera, which camera includes an imaging superpixel; (b) one or more computers that are programmed to output a set of separate modulation signals, such that (i) each imaging pixel in the imaging superpixel is modulated by a modulation signal that causes sensitivity of the imaging pixel to vary over time, and (ii) a modulation signal, out of the set of modulation signals, causes each photodiode in the superpixel, at multiple times during an exposure period of a read-out frame, to transfer electric charge from the photodiode to only one storage device, which storage device does not receive electric charge from any other photodiode during the exposure period.\",\n \"[BO] A system comprising, in combination: (a) a camera, which camera includes an imaging superpixel; and (b) one or more computers that are programmed to output a set of separate modulation signals, such that (i) each imaging pixel in the imaging superpixel is modulated by a modulation signal that causes sensitivity of the imaging pixel to vary over time, and (ii) a modulation signal, out of the set of modulation signals, causes each photodiode in the superpixel, at multiple times during an exposure period of a read-out frame, to transfer electric charge from the photodiode to a set of storage devices, such that (1) at any given time at which a transfer of electric charge from the photodiode to a storage device occurs, electric charge is being transferred to only one of the storage devices, and electric charge is not being transferred to any other storage device, and (2) electric charge is transferred from the photodiode to each of the storage devices during the exposure period.\",\n \"[BP] A system comprising, in combination: (a) a camera, which camera includes an imaging superpixel; (b) one or more light sources for illuminating a scene by a pattern of light that changes over time; and (c) one or more signal generators for producing a set of separate modulation signals, such that each imaging pixel in the imaging superpixel is modulated by a modulation signal that causes sensitivity of the imaging pixel to vary over time.\",\n \"[BQ] A system comprising, in combination: (a) a camera, which camera includes an imaging superpixel; (b) one or more light sources for illuminating a scene by a pattern of light that sweeps across the scene, such that a point in the scene, when directly illuminated by the pattern of light, reflects light directly to the imaging superpixel; and (c) one or more computers that are programmed to output a set of separate modulation signals that occur while the scene is illuminated by the pattern of light, such that each imaging pixel in the imaging superpixel is modulated by a modulation signal that causes sensitivity of the imaging pixel to vary over time; and (d) one or more computers for processing data indicative of measurements recorded by the imaging superpixel and for calculating, based on this data, 3D spatial coordinates of the point, by performing an algorithm that either (i) involves triangulation; or (ii) involves accessing data that was calculated by a computer using an algorithm that involves triangulation.\",\n \"[BR] A system comprising, in combination: (a) a camera, which camera includes an imaging superpixel; and (b) one or more light sources for illuminating a scene by a pattern of light that sweeps across the scene, such that a point in the scene, when directly illuminated by the pattern of light, reflects light directly to the imaging superpixel; (c) one or more computers that are programmed to output a set of separate modulation signals, such that (i) each imaging pixel in the imaging superpixel is modulated by a modulation signal that causes sensitivity of the imaging pixel to vary over time; (ii) the set of modulation signals, taken together, comprise a code, each of the modulation signals representing a digit of the code.\",\n \"(iii) each entire sweep of the pattern of light across the scene occurs in a time period, which time period consists of a set of subintervals, the total number of subintervals being equal to the number of permutations of the code; (iv) during each subinterval, the modulation signals, taken together, represent only one of the permutations of the code; (v) intensity of light incident on the imaging superpixel reaches a maximum value for the entire sweep during a specific subinterval; and (d) one or more computers for (i) processing data indicative of measurements recorded by the imaging superpixel, (ii) calculating the permutation of the code represented by the modulation signals during the specific subinterval, and (iii) calculating 3D spatial coordinates of the point.\",\n \"The above description (including without limitation any attached drawings and figures) describes illustrative implementations of the invention.\",\n \"However, the invention may be implemented in other ways.\",\n \"The methods and apparatus which are described above are merely illustrative applications of the principles of the invention.\",\n \"Other arrangements, methods, modifications, and substitutions by one of ordinary skill in the art are therefore also within the scope of the present invention.\",\n \"Numerous modifications may be made by those skilled in the art without departing from the scope of the invention.\",\n \"Also, this invention includes without limitation each combination and permutation of one or more of the abovementioned implementations, embodiments and features.\"\n ]\n]"},"source":{"kind":"string","value":"Patent_15871444"}}},{"rowIdx":4493796,"cells":{"text":{"kind":"list like","value":[["Three-dimensional Printing System and Equipment Assembly","A three-dimensional printing system and equipment assembly for the manufacture of three-dimensionally printed articles is provided.","The equipment assembly includes a three-dimensional printing build system, an optional liquid removal system and an optional harvester system.","The build system includes a conveyor, plural build modules and at least one build station having a powder-layering system and a printing system.","The equipment assembly can be used to manufacture pharmaceutical, medical, and non-pharmaceutical/non-medical objects.","It can be used to prepare single or multiple articles."],["1-134.","(canceled) 135) A three-dimensional printing equipment assembly comprising: a circuitous or oscillating conveyor system; plural build modules comprising respective height adjustable platforms; at least one build station that forms respective one or more three-dimensionally printed articles on the plural build modules; a bed transfer system that transfers the one or more three-dimensionally printed articles away from the conveyor system; a control system that determines and specifies the location of one or more of the plural build modules relative to the conveyor system; wherein the conveyor system repeatedly conducts the plural build modules through the at least one build station.","136) The equipment assembly of claim 135 further comprising one or more build module positioning systems, one or more conveyor positioning systems or both.","137) The equipment assembly of claim 136, wherein the control system comprises a proximity sensor that specifies the location of one or more of the plural build modules relative to the conveyor system.","138) The equipment assembly of claim 137 further comprising a component that considers at least the linear speed of the conveyor or of the plural build modules when forming the respective one or more three-dimensionally printed articles.","139) The equipment assembly of claim 138 further comprising a control system that determines the location of respective ones of the plural build modules.","140) The equipment assembly of claim 139 further comprising a synchronizer that facilitates synchronization of operation of various components of the equipment assembly.","141) The equipment assembly of claim 135, wherein the control system comprises a proximity sensor that specifies the location of one or more of the plural build modules relative to the conveyor system.","142) The equipment assembly of claim 135 further comprising a component that considers at least the linear speed of the conveyor or of the plural build modules when forming the respective one or more three-dimensionally printed articles.","143) The equipment assembly of claim 135 further comprising a control system that determines the location of respective ones of the plural build modules.","144) The equipment assembly of claim 135 further comprising a synchronizer that facilitates synchronization of operation of various components of the equipment assembly.","145) The equipment assembly of claim 135 further comprising at least one of the following: a) at least one harvesting system; b) at least one liquid removal system; c) at least one packaging system; d) at least one powder recovery system for recovering, and optionally recycling, unprinted powder; e) at least one liquid detector; f) at least one inspection system; g) at least one dedusting system; or h) at least one build plate loading system.","146) A method for the preparation of three-dimensionally printed articles, the method comprising: with a conveyor system, repeatedly conveying plural build modules through at least one build station to form from build material respective one or more three-dimensionally printed articles in respective ones of the plural build modules; considering at least the linear speed of the conveyor system or of the plural build modules when forming the respective one or more three-dimensionally printed articles; determining the location of respective ones of the plural build modules and/or specifying the location of respective ones of the plural build modules relative to the conveyor system when forming the respective one or more three-dimensionally printed articles; transferring the one or more three-dimensionally printed articles away from the conveyor system; wherein: the plural build modules comprise respective height adjustable platforms; and the conveyor is a circuitous or reciprocating conveyor.","147) The method of claim 146 further comprising forming plural three-dimensionally printed incremental layers during formation of respective ones of the one or more three-dimensionally printed articles.","148) The method of claim 147, wherein the build material is powder material, and the step of forming plural three-dimensionally printed incremental layers comprises forming respective plural powder layers and binding particles of the plural powder layers according to one or more predetermined patterns.","149) The method of claim 148 further comprising charging powder onto respective ones of the plural build modules at a feed rate that takes into consideration the linear speed of the conveyor or the plural build modules.","150) The method of claim 149 further comprising creating print instructions specifying or considering one or more patterns to be printed on respective ones of the powder layers.","151) The method of claim 150, wherein the print instructions specify or consider at least the linear speed of respective ones of the plural build modules.","152) The method of claim 151, wherein the print instructions further specify or consider the intended print density of the one or more patterns to be printed.","153) The method of claim 150, wherein the print instructions further specify or consider the intended print density of the one or more patterns to be printed.","154) The method of claim 148 further comprising creating print instructions specifying or considering one or more patterns to be printed on respective ones of the powder layers.","155) The method of claim 146 further comprising at least one of the following steps: a) harvesting the one or more three-dimensionally printed articles; b) removing liquid from the one or more three-dimensionally printed articles; c) dedusting the one or more three-dimensionally printed articles; d) packaging the one or more three-dimensionally printed articles; e) recovering loose build material; f) detecting the presence, amount or concentration of liquid present in the one or more three-dimensionally printed articles; g) inspecting the one or more three-dimensionally printed articles; h) controlling one or more components of the equipment assembly with a control system comprising one or more computerized controllers, one or more computers, and one or more user interfaces for the one or more computers; i) providing printing instructions; j) providing one or more two-dimensional image files comprising pixels; k) forming plural stacked three-dimensionally printed incremental layers to form the one or more three-dimensionally printed articles; l) transferring surplus build material from one of said plural build modules to an adjacent one of said plural build modules; or m) creating print instructions specifying or considering one or more patterns to be printed."],[" BACKGROUND OF THE INVENTION Rapid prototyping describes various techniques for fabricating a three-dimensional prototype of an object from a computer model of the object.","One technique is three-dimensional printing, whereby a printer is used to fabricate the 3-D prototype from a plurality of two-dimensional layers.","In particular, a digital representation of a 3-D object is stored in a computer memory.","Computer software sections the representation of the object into a plurality of distinct 2-D layers.","Alternatively, a stream (sequential series) of instructions for each incremental layer maybe entered directly, e.g.","a series of images.","A 3-D printer then fabricates a thin layer of bound material for each 2-D image layer sectioned by the software.","Together, the layers are printed one on top of the other and adhere to each other to form the desired prototype.","Three-dimensional powder-liquid printing technology has been used to prepare articles such as pharmaceutical dosage forms, mechanical prototypes and concept models, molds for casting mechanical parts, bone growth promoting implants, electronic circuit boards, scaffolds for tissue engineering, responsive biomedical composites, tissue growth promoting implants, dental restorations, jewelry, fluid filters and other such articles.","Three-dimensional printing is a solid freeform fabrication technique/rapid-prototyping technique in which thin layers of powder are spread onto a surface and selected regions of the powder are bound together by the controlled deposition (“printing”) of a fluid.","This basic operation is repeated layer-by-layer, with each new layer formed on top of and adhered to the previously printed layer, to eventually make three-dimensional objects within a bed of unbound powder.","When the printed objects have sufficient cohesion, they may be separated from the unbound powder.","Systems and equipment assemblies for three-dimensional printing of articles are commercially available or in use by others: Massachusetts Institute of Technology Three-Dimensional Printing Laboratory (Cambridge, Mass.","), Z Corporation's 3DP and HD3DP™ systems (Burlington, Mass.","), The Ex One Company, L.L.C.","(Irwin, Pa.), Soligen (Northridge, Calif.), Specific Surface Corporation (Franklin, Mass.","), TDK Corporation (Chiba-ken, Japan), Therics L.L.C.","(Akron, Ohio, now a part of Integra Lifesciences), Phoenix Analysis & Design Technologies (Tempe, Ariz.), Stratasys, Inc.'s Dimension™ system (Eden Prairie, Minn.), Objet Geometries (Billerica, Mass.","or Rehovot, Israel), Xpress3D (Minneapolis, Minn.), and 3D Systems' Invision™ system (Valencia, Calif.).","Some systems have been described in the patent literature: U.S. Publications No.","20080281019, No.","20080277823, No.","20080275181, No.","20080269940, No.","20080269939, No.","20080259434, No.","20080241404, No.","20080231645, No.","20080229961, No.","20080211132, No.","20080192074, No.","20080187711, No.","20080180509, No.","20080138515, No.","20080124464, No.","20080121172, No.","20080121130, No.","20080118655, No.","20080110395, No.","20080105144, No.","20080068416, No.","20080062214, No.","20080042321, No.","20070289705, No.","20070259010, No.","20070252871, No.","20070195150, No.","20070188549, No.","20070187508, No.","20070182799, No.","20070182782, No.","20070168815, No.","20070146734, No.","20060268057, No.","20060268044, No.","20060230970, No.","20060141145, No.","20060127153, No.","20060111807, No.","20060110443, No.","20060099287, No.","20060077241, No.","20050054039, No.","20060035034, No.","20060030964, No.","20050247216, No.","20050204939, No.","20050197431, No.","20050179721, No.","20050104241, No.","20050069784, No.","20050061241, No.","20050059757, No.","20040265413, No.","20040262797, No.","20040252174, No.","20040243133, No.","20040225398, No.","20040187714, No.","20040183796, No.","20040145781, No.","20040145628, No.","20040145267, No.","20040143359, No.","20040141043, No.","20040141030, No.","20040141025, No.","20040141024, No.","20040118309, No.","20040112523, No.","20040056378, No.","20040012112, No.","20040005360, No.","20040005182, No.","20040004653, No.","20040004303, No.","20040003741, No.","20040003738, No.","20030207959, No.","20030198677, No.","20030143268, No.","20020125592, No.","20020114652, No.","20020079601, No.","20020064745, No.","20020033548, No.","20020015728, No.","20010028471, and No.","20010017085; U.S. Pat.","No.","5,490,962, U.S. Pat.","No.","5,204,055, U.S. Pat.","No.","5,121,329, U.S. Pat.","No.","5,127,037, U.S. Pat.","No.","5,252,264, U.S. Pat.","No.","5,340,656, U.S. Pat.","No.","5,387,380, 5,490,882, U.S. Pat.","No.","5,518,680, U.S. Pat.","No.","5,717,599, U.S. Pat.","No.","5,851,465, U.S. Pat.","No.","5,869,170, U.S. Pat.","No.","5,874,279, U.S. Pat.","No.","5,879,489, U.S. Pat.","No.","5,902,441, U.S. Pat.","No.","5,934,343, U.S. Pat.","No.","5,940,674, U.S. Pat.","No.","6,007,318, U.S. Pat.","No.","6,146,567, U.S. Pat.","No.","6,165,406, U.S. Pat.","No.","6,193,923, U.S. Pat.","No.","6,200,508, U.S. Pat.","No.","6,213,168, U.S. Pat.","No.","6,336,480, U.S. Pat.","No.","6,363,606, U.S. Pat.","No.","6,375,874, U.S. Pat.","No.","6,416,850, U.S. Pat.","No.","6,508,971, U.S. Pat.","No.","6,530,958, U.S. Pat.","No.","6,547,994, U.S. Pat.","No.","6,596,224, U.S. Pat.","No.","6,772,026, U.S. Pat.","No.","6,838,035, U.S. Pat.","No.","6,850,334, U.S. Pat.","No.","6,905,645, U.S. Pat.","No.","6,945,638, U.S. Pat.","No.","6,989,115, U.S. Pat.","No.","7,220,380, U.S. Pat.","No.","7,291,002 U.S. Pat.","No.","7,365,129, U.S. Pat.","No.","7,435,368, U.S. Pat.","No.","7,455,804, U.S. Pat.","No.","7,686,955, U.S. Pat.","No.","7,828,022, U.S. Pat.","No.","8,017,055; PCT International Publications No.","WO 00/26026, No.","WO 98/043762, No.","WO 95/034468, No.","WO 95/011007; and European Patent No.","1,631,440, which employs a cylindrical (radial or polar) coordinate-based system due to its construction.","Three-dimensional printing systems that employ radial or polar coordinate-based printing systems are disadvantageous because having each jetting position located at a different radial position requires that the surface speed of the substrate underneath each jetting position will vary.","The surface speed will be greatest for the jetting position furthest from the center of rotation.","This can be compensated for by normalizing the print density across all jetting positions by either adjusting the input images or possibly the drive frequency.","However, these methods of compensation simply cause objects printed radially to emulate each other as opposed to true replicates.","The angle of entry of the droplets into the powder bed will also vary with radial position again creating subtle differences in the objects printed at different locations.","Alignment and interleaving of multiple print heads is another disadvantage to radially printing.","Although feasible it is more complex than for Cartesian systems."],[" SUMMARY OF THE INVENTION The present invention provides a manufacturing system and equipment assembly useful for the preparation of articles by three-dimensional printing.","The system and assembly can be used for high through-put continuous, semi-continuous, or batch manufacture with minimal product loss, high efficiency, and high product reproducibility in the context of flexible article design.","The invention provides a three-dimensional printing equipment assembly comprising: a) a three-dimensional printing build system comprising: a conveyor system adapted to conduct plural build modules; plural build modules engaged with the conveyor system, wherein the build modules are adapted to receive and temporarily retain powder from a powder layering system; and at least one build station comprising: 1) at least one powder layering system adapted to form incremental powder layers within build modules; and 2) at least one printing system adapted to apply a liquid according to a predetermined pattern to incremental powder layers within build modules; wherein the conveyor system repeatedly transports the build modules from the at least one powder layering system to the at least one printing system to form a three-dimensionally printed bed comprising one or more three-dimensionally printed articles in the build modules.","In some embodiments, the three-dimensional printing equipment assembly further comprises at least one liquid removal system adapted to receive one or more three-dimensionally printed beds and to remove liquid from one or more powder layers onto which the liquid has been applied and/or from the three-dimensionally printed bed.","In some embodiments, a build module comprises an incrementally height adjustable platform adapted to receive and temporarily retain at least one incremental layer or plural stacked incremental layers of powder.","In some embodiments, a build module comprises a body comprising an upper surface with a cavity, a height adjustable build platform disposed within the cavity, height adjuster engaged with the body and the platform, and engagement means.","In some embodiments, plural build modules are removably engaged with the conveyor system.","In some embodiments, the platform is adapted to lower (recess) and/or raise by one or more increments after placement of an incremental layer of powder thereon.","The platform displacement can occur prior to or after placement of a subsequent incremental layer of powder thereon, thereby press-rolling or removing a portion of powder from a powder layer that has already been laid down.","In some embodiments, the size of an increment is predetermined.","In some embodiments, the build module comprises one or more sidewalls surrounding the build plate and being adapted to retain powder on the height adjustable platform.","In some embodiments, the build module further comprises a removable build plate disposed below the upper surface of the build module.","In some embodiments, the removable build plate is disposed above the height adjustable platform and is adapted to receive and support one or more incremental layers of powder.","In some embodiments, the removable build plate is flat, porous, perforated, textured, coated, knurled, smooth or a combination thereof.","In some embodiments, engagement means are adapted to removably engage a build module with the conveyor system.","In some embodiments, the conveyor system conducts the plural build modules along a planar circuitous path, a horizontal circuitous path, a vertical circuitous path, or a combination thereof.","In some embodiments, the conveyor system is adapted to transport plural build modules along a path in a counterclockwise direction or clockwise direction.","In some embodiments, the path of the modular conveyor system is circular, ellipsoidal, rectangular, semicircular, square, triangular, pentagonal, hexagonal, octagon, oval, polygonal, parallelogram, quadrilateral, geometric, symmetrical, asymmetrical, or equivalents thereof with rounded corners and/or edges.","In some embodiments, the modular conveyor system comprises plural conveyor modules, at least one drive motor, at least one positioning controller, and a path along which plural build modules are conducted.","In some embodiments, a conveyor module comprises a body, one or more build module engagement means, and conveyor module engagement means by way of which plural conveyor modules are adapted to engage to form a modular conveyor.","In some embodiments, the conveyor system comprises plural attachments adapted to removably retain the plural build modules.","In some embodiments, the attachment comprises plural one or more metal links with cam followers or comprises wheels, plates and/or bearings attached to a build module and mounted on a rail system upon which the build module is conducted.","In some embodiments, the conveyor system further comprises one or more positioning-controllers.","In some embodiments, the conveyor system is a continuous or discontinuous loop system.","In some embodiments, the at least one build station is incrementally height adjustable with respect to the build modules, whereby the vertical space between the build module and the build station can be adjusted by one or more increments.","In some embodiments, an incrementally height adjustable build station is adapted to raise by one or more increments after placement of a layer of powder on a build module and prior to placement of a subsequent layer of powder the build module.","In some embodiments, a change in height is achieved by changing vertical position with respect to a prior position of the platform or with respect to an absolute position of the platform relative to the build module.","In some embodiments, the build station is vertically fixed with respect to the build modules and a build platform within a build module is vertically height adjustable with respect to the build module so that the vertical distance between the build station and the build module remains the same during a print lap or print cycle.","In some embodiments, the size of the increment is the same for each incremental layer of a build cycle, is different for one or more incremental layers of a build cycle or a combination thereof.","A build cycle comprises one or more build laps or plural build laps and is defined as the sum total of build laps required to form a 3DP article.","A build lap is defined as the process of forming a printed incremental layer, i.e.","placing an incremental layer of powdered build material and depositing (printing) liquid upon it.","Accordingly, a build cycle results in the formation of plural stacked printed incremental layers that adhere to one another to together form a three-dimensionally printed article.","In some embodiments, the at least one powder layering system comprises at least one powder fill head.","In some the embodiments, the powder fill head is stationary, meaning it does not move, either longitudinally or transversely with respect to the plane of the upper surface of a build module, when applying an incremental layer of powder onto the build module.","In some embodiments, a powder fill head comprises at least one powder fill head body, at least one powder spreader, and at least one powder-height controller.","In some embodiments, a powder layering system comprises a powder fill head, at least one powder reservoir and a powder feeder tube adapted to transfer powder from the powder reservoir to the powder fill head.","In some embodiments, the powder spreader is a cylindrical roller the axis of which has or defines a radial direction of motion opposite the linear direction of motion of a build module through the powder layering system.","In some embodiments, the powder spreader is a cylindrical roller, bar, rod, plate or straight smooth edge.","In some embodiments, the powder fill head comprises a hopper or chute.","In some embodiments, the at least one printing system is adapted to apply (deposit) liquid to the powder according to a Cartesian coordinate algorithm instead of a polar (radial) coordinate algorithm (cylindrical coordinate system, circular coordinate system, or spherical coordinate system).","In some embodiments, the printing system comprises at least one print head adapted to deposit liquid onto an incremental layer of powder in a build station and at least one liquid feed system.","A print head can comprise one or more print modules or plural print modules.","In some embodiments, the invention excludes a printing system adapted to apply liquid to the powder solely according to a polar (radial) coordinate system.","In some embodiments, the invention excludes an equipment assembly or a method wherein the powder fill head moves laterally or transversely or is not stationary, with respect to a build module, while depositing an incremental powder layer.","In some embodiments, the invention excludes an equipment assembly or a method wherein the print head moves laterally or transversely or is not stationary, with respect to a build module, while applying liquid to an incremental powder layer.","In some embodiments, the at least one printing system is adapted to apply (deposit) liquid as a three-dimensional pattern of droplets or as plural two-dimensional patterns of droplets defining one or more articles.","In some embodiments, the pattern comprises droplets placed at equal spacing within one or more articles.","In some embodiments, this pattern comprises droplets placed at unequal spacing within one or more articles.","In some embodiments, this pattern comprises droplets with different spacing within different regions of an article.","In some embodiments, this pattern comprises droplets with tighter spacing (i.e., higher print density) in a region defining the exterior of an article.","In some embodiments, this pattern comprises droplets with looser spacing (i.e., lower print density) in a region interior to an article.","In some embodiments, more than one pattern is used.","In some embodiments, more than one liquid is used.","In some embodiments, the liquid comprises a pure solvent, blend of solvents, solution, suspension, colloid, emulsion, melt or a combination thereof.","In some embodiments, both the print head and the powder fill head are stationary during formation of a printed incremental layer or are stationary as otherwise described herein.","In some embodiments, the equipment assembly further comprises a bed transfer system adapted to transfer three-dimensionally printed beds, one or more at a time, away from the three-dimensional printing build system.","In some embodiments, the bed transfer system is adapted to transfer three-dimensionally printed beds to one or more liquid removal systems and/or one or more harvesting systems.","In some embodiments, the transfer system is integrated with the conveyor system, the liquid removal system or both.","In some embodiments, the liquid removal system comprises at least one dryer.","In some embodiments, the liquid removal system is adapted to process two or more build plates and their contents at a time.","In some embodiments, the liquid removal system is adapted to process two or more printed beds at a time.","In some embodiments, the liquid removal system is adapted to process two or more printed articles at a time.","In some embodiments, the three-dimensionally printed powder bed comprises loose (unbound) powder and one or more three-dimensionally printed articles prior to harvesting of the printed article(s) from the loose powder.","In some embodiments, the equipment assembly comprises one or more harvesting systems adapted to separate loose powder from the one or more three-dimensionally printed articles.","In some embodiments, the harvesting system processes printed beds already processed by the liquid removal system.","In some embodiments, the harvesting system comprises loose powder collector and three-dimensionally printed article collector.","In some embodiments, the harvesting system comprises a vibrating or orbiting surface adapted to receive the three-dimensionally printed powder bed or the three-dimensionally printed articles.","In some embodiments, the harvesting system comprises a vacuum conveyor with a screen to separate articles from loose powder.","The vibrating surface can be perforated, non-perforated, corrugated, smooth or non-smooth to permit separation of loose powder from the printed articles.","In some embodiments, the equipment assembly further comprises a dedusting system adapted to remove loose particles from printed articles that have been harvested from a printed powder bed.","A dedusting system can comprise a housing defining a dedusting region, one or more air jets, e.g.","one or more air knives, that direct pressurized air into the dedusting region, one or more surfaces or retainers in the dedusting region for temporarily retaining one or more printed articles being dedusted, and one or more outlets through which air and removed particles exit the housing or dedusting region.","In some embodiments, the equipment assembly further comprises a build plate loading system adapted to place one or more build plates on the height adjustable platform(s) of the one or more build modules.","In some embodiments, the equipment assembly further comprises one or more powder recovery systems adapted to collect powder from the one or more systems of the equipment assembly and return it to a powder reservoir.","The recovery system can comprise one or more loose powder collectors and one or more conduits for conducting loose powder from the one or more collectors to a powder reservoir.","The recovery system can further comprise: a) one or more powder mixers for mixing recovered loose powder with virgin loose powder; b) one or more pressurized air powder handling systems that facilitate transfer of loose powder from one location to another; c) one or more vacuum powder handling systems that facilitate transfer of loose powder from one location to another; d) one or more mechanical powder handling systems that transfer loose powder from one location to another; e) one or more manual powder handling systems that transfer loose powder from one location to another; or f) a combination thereof.","In some embodiments, the equipment assembly further comprises a control system comprising one or more computerized controllers, one or more computers, and one or more user interfaces for one or more computers.","In some embodiments, one or more components of the equipment assembly are computer controlled.","In some embodiments, one or more components of the three-dimensional printing build system are computer controlled.","In some embodiments, the conveyor system, the height adjustable platforms of the build modules, the at least one powder layering system and the at least one printing system are computer controlled.","In some embodiments, the equipment assembly is adapted to spread layers of powder and deposit (print) droplets of liquid in a predetermined pattern on to the layers according to instructions provided by a computerized controller.","In some embodiments, the predetermined pattern is based on one or more two-dimensional image files comprising pixels.","In some embodiments, the two-dimensional image files are structured such that certain pixels indicate dispensing of droplets, and other pixels represent no dispensing of droplets.","In some embodiments, the two-dimensional image files include different colors of pixels to indicate dispensing of different liquids, or no dispensing of liquid.","In some embodiments, the predetermined pattern for applying the liquid is the same in each incremental layer, is the same in two or more incremental layers, is different in one or more incremental layers, is different in all incremental layers, or is the same for a first group of incremental layer and the same for a second group of incremental layers but the pattern for the first group is different than the pattern for the second group.","In some embodiments, the equipment assembly further comprises one or more working surfaces, tables, gantries, enclosures, and/or platforms.","The invention also provides a three-dimensional printing equipment assembly comprising: a) a three-dimensional printing build system comprising: a conveyor system adapted to conduct plural build modules and comprising positioning-controller and plural build module engagements; plural build modules engaged with the conveyor system, wherein the build modules are adapted to receive and temporarily retain powder from a powder layering system, and wherein a build module comprises an incrementally height adjustable platform, an optional build plate disposed above the platform, and one or more sidewalls defining a cavity within which the platform the optional build plate can be disposed; at least one build station comprising: 1) at least one powder layering system adapted to form incremental powder layers within the cavity of build modules and comprising at least one powder fill head, at least one powder spreader and at least one powder reservoir; and 2) at least one printing system adapted to apply a liquid according to a predetermined pattern to incremental powder layers within build modules and comprising at least one liquid feed system and at least one print head adapted to deposit liquid according to a predetermined pattern onto incremental layers of powder in a build module; wherein the conveyor system is adapted to repeatedly transport the plural build modules from the at least one powder layering system to the at least one printing system, whereby the three-dimensional printing build system forms a three-dimensionally printed bed comprising one or more three-dimensionally printed articles, and optionally loose (unbound or only partially bound) powder that has not been printed upon; b) at least one harvesting system adapted to separate loose powder from one or more three-dimensionally printed articles in a three-dimensionally printed bed; and c) optionally, at least one liquid removal system adapted to remove liquid from one or more incremental powder layers onto which the liquid has been applied and/or from the three-dimensionally printed bed, wherein the liquid removal system is adapted to process two or more build modules at a time.","Some embodiments of the invention include those wherein: 1) at least one liquid removal system is present; 2) the equipment assembly further comprises at least one packaging system adapted to package one or more three-dimensionally printed articles; 3) the conveyor system is adapted to repeatedly transport the plural build modules, from the at least one powder layering system to the at least one printing system, in a linear manner, and not a radial manner, thereby facilitating Cartesian coordinate printing and not radial (polar coordinate) printing; 4) the equipment assembly further comprises a powder recovery system for recovering, and optionally recycling, unprinted powder; 5) the equipment assembly further comprises a liquid detector; 6) a liquid detector detects the presence of liquid in one or more printed incremental layers and/or in one or more printed articles; 7) the equipment assembly further comprises an inspection system; 8) an inspection system is a printed powder inspection system that determines the integrity of printing in one or more printed incremental layers and/or one or more printed articles and/or determines whether or not powder was properly applied in one or more incremental layers; 9) determining the integrity of printing comprises at least one of determining whether or not liquid has been correctly applied to one or more incremental layers according to one or more predetermined patterns and/or determining whether or not liquid has been correctly applied to one or more incremental layers according to a predetermined amount; 10) the inspection system is a printed article inspection system that determines whether or not one or more printed articles have the correct size, shape, weight, appearance, density, content and/or color; 11) the inspection system is a liquid application inspection system that monitors droplets of liquid applied by the print head to powder; 12) the inspection system comprises one or more cameras; and/or 13) a camera is independently selected at each occurrence from the group consisting of a visible wavelength camera, an UV wavelength camera, a near infrared wavelength camera, an x-ray camera and an infrared wavelength camera.","The invention includes all combinations of the embodiments, subembodiments and aspects disclosed herein.","Accordingly, the invention includes the embodiments and aspects specifically disclosed, broadly disclosed, or narrowly disclosed herein, as well as combinations thereof and subcombinations of the individual elements of said embodiments and aspects.","Other features, advantages and embodiments of the invention will become apparent to those skilled in the art by the following description, accompanying examples."],["CROSS-REFERENCE TO EARLIER FILED APPLICATIONS This application is a continuation of and claims the benefit of U.S. Ser.","No.","15/422,969 filed Feb. 2, 2017, which is a continuation of U.S. Ser.","No.","15/077,112 filed Mar.","22, 2016, now U.S. Pat.","No.","9,517,592, issued Dec. 13, 2016, which is a continuation of U.S. Ser.","No.","15/046,714 filed Feb. 18, 2016, now U.S. Pat.","No.","9,517,591, issued Dec. 13, 2016, which is a continuation of U.S. Ser.","No.","14/501,716 filed Sep. 30, 2014, now U.S. Pat.","No.","9,610,735 issued Apr.","4, 2017, which is a continuation of U.S. Ser.","No.","14/016,697, filed Sep. 3, 2013, now U.S. Pat.","No.","8,888,480, issued Nov. 18, 2014, which is a continuation of and claims the benefit of PCT/US2013/057466 filed Aug. 30, 2013, which claims the benefit of provisional application 61/696,839 filed Sep. 5, 2012, and the application U.S. Ser.","No.","15/422,969 is a continuation of U.S. Ser.","No.","14/501,716 filed Sep. 30, 2014, now U.S. Pat.","No.","9,610,735 issued Apr.","4, 2017, the entire disclosures of which are hereby incorporated by reference.","FIELD OF THE INVENTION The present invention concerns a manufacturing system and equipment assembly and use thereof for the preparation three-dimensional printing of articles from one or more powders and one or more liquids applied to the powder.","BACKGROUND OF THE INVENTION Rapid prototyping describes various techniques for fabricating a three-dimensional prototype of an object from a computer model of the object.","One technique is three-dimensional printing, whereby a printer is used to fabricate the 3-D prototype from a plurality of two-dimensional layers.","In particular, a digital representation of a 3-D object is stored in a computer memory.","Computer software sections the representation of the object into a plurality of distinct 2-D layers.","Alternatively, a stream (sequential series) of instructions for each incremental layer maybe entered directly, e.g.","a series of images.","A 3-D printer then fabricates a thin layer of bound material for each 2-D image layer sectioned by the software.","Together, the layers are printed one on top of the other and adhere to each other to form the desired prototype.","Three-dimensional powder-liquid printing technology has been used to prepare articles such as pharmaceutical dosage forms, mechanical prototypes and concept models, molds for casting mechanical parts, bone growth promoting implants, electronic circuit boards, scaffolds for tissue engineering, responsive biomedical composites, tissue growth promoting implants, dental restorations, jewelry, fluid filters and other such articles.","Three-dimensional printing is a solid freeform fabrication technique/rapid-prototyping technique in which thin layers of powder are spread onto a surface and selected regions of the powder are bound together by the controlled deposition (“printing”) of a fluid.","This basic operation is repeated layer-by-layer, with each new layer formed on top of and adhered to the previously printed layer, to eventually make three-dimensional objects within a bed of unbound powder.","When the printed objects have sufficient cohesion, they may be separated from the unbound powder.","Systems and equipment assemblies for three-dimensional printing of articles are commercially available or in use by others: Massachusetts Institute of Technology Three-Dimensional Printing Laboratory (Cambridge, Mass.","), Z Corporation's 3DP and HD3DP™ systems (Burlington, Mass.","), The Ex One Company, L.L.C.","(Irwin, Pa.), Soligen (Northridge, Calif.), Specific Surface Corporation (Franklin, Mass.","), TDK Corporation (Chiba-ken, Japan), Therics L.L.C.","(Akron, Ohio, now a part of Integra Lifesciences), Phoenix Analysis & Design Technologies (Tempe, Ariz.), Stratasys, Inc.'s Dimension™ system (Eden Prairie, Minn.), Objet Geometries (Billerica, Mass.","or Rehovot, Israel), Xpress3D (Minneapolis, Minn.), and 3D Systems' Invision™ system (Valencia, Calif.).","Some systems have been described in the patent literature: U.S. Publications No.","20080281019, No.","20080277823, No.","20080275181, No.","20080269940, No.","20080269939, No.","20080259434, No.","20080241404, No.","20080231645, No.","20080229961, No.","20080211132, No.","20080192074, No.","20080187711, No.","20080180509, No.","20080138515, No.","20080124464, No.","20080121172, No.","20080121130, No.","20080118655, No.","20080110395, No.","20080105144, No.","20080068416, No.","20080062214, No.","20080042321, No.","20070289705, No.","20070259010, No.","20070252871, No.","20070195150, No.","20070188549, No.","20070187508, No.","20070182799, No.","20070182782, No.","20070168815, No.","20070146734, No.","20060268057, No.","20060268044, No.","20060230970, No.","20060141145, No.","20060127153, No.","20060111807, No.","20060110443, No.","20060099287, No.","20060077241, No.","20050054039, No.","20060035034, No.","20060030964, No.","20050247216, No.","20050204939, No.","20050197431, No.","20050179721, No.","20050104241, No.","20050069784, No.","20050061241, No.","20050059757, No.","20040265413, No.","20040262797, No.","20040252174, No.","20040243133, No.","20040225398, No.","20040187714, No.","20040183796, No.","20040145781, No.","20040145628, No.","20040145267, No.","20040143359, No.","20040141043, No.","20040141030, No.","20040141025, No.","20040141024, No.","20040118309, No.","20040112523, No.","20040056378, No.","20040012112, No.","20040005360, No.","20040005182, No.","20040004653, No.","20040004303, No.","20040003741, No.","20040003738, No.","20030207959, No.","20030198677, No.","20030143268, No.","20020125592, No.","20020114652, No.","20020079601, No.","20020064745, No.","20020033548, No.","20020015728, No.","20010028471, and No.","20010017085; U.S. Pat.","No.","5,490,962, U.S. Pat.","No.","5,204,055, U.S. Pat.","No.","5,121,329, U.S. Pat.","No.","5,127,037, U.S. Pat.","No.","5,252,264, U.S. Pat.","No.","5,340,656, U.S. Pat.","No.","5,387,380, 5,490,882, U.S. Pat.","No.","5,518,680, U.S. Pat.","No.","5,717,599, U.S. Pat.","No.","5,851,465, U.S. Pat.","No.","5,869,170, U.S. Pat.","No.","5,874,279, U.S. Pat.","No.","5,879,489, U.S. Pat.","No.","5,902,441, U.S. Pat.","No.","5,934,343, U.S. Pat.","No.","5,940,674, U.S. Pat.","No.","6,007,318, U.S. Pat.","No.","6,146,567, U.S. Pat.","No.","6,165,406, U.S. Pat.","No.","6,193,923, U.S. Pat.","No.","6,200,508, U.S. Pat.","No.","6,213,168, U.S. Pat.","No.","6,336,480, U.S. Pat.","No.","6,363,606, U.S. Pat.","No.","6,375,874, U.S. Pat.","No.","6,416,850, U.S. Pat.","No.","6,508,971, U.S. Pat.","No.","6,530,958, U.S. Pat.","No.","6,547,994, U.S. Pat.","No.","6,596,224, U.S. Pat.","No.","6,772,026, U.S. Pat.","No.","6,838,035, U.S. Pat.","No.","6,850,334, U.S. Pat.","No.","6,905,645, U.S. Pat.","No.","6,945,638, U.S. Pat.","No.","6,989,115, U.S. Pat.","No.","7,220,380, U.S. Pat.","No.","7,291,002 U.S. Pat.","No.","7,365,129, U.S. Pat.","No.","7,435,368, U.S. Pat.","No.","7,455,804, U.S. Pat.","No.","7,686,955, U.S. Pat.","No.","7,828,022, U.S. Pat.","No.","8,017,055; PCT International Publications No.","WO 00/26026, No.","WO 98/043762, No.","WO 95/034468, No.","WO 95/011007; and European Patent No.","1,631,440, which employs a cylindrical (radial or polar) coordinate-based system due to its construction.","Three-dimensional printing systems that employ radial or polar coordinate-based printing systems are disadvantageous because having each jetting position located at a different radial position requires that the surface speed of the substrate underneath each jetting position will vary.","The surface speed will be greatest for the jetting position furthest from the center of rotation.","This can be compensated for by normalizing the print density across all jetting positions by either adjusting the input images or possibly the drive frequency.","However, these methods of compensation simply cause objects printed radially to emulate each other as opposed to true replicates.","The angle of entry of the droplets into the powder bed will also vary with radial position again creating subtle differences in the objects printed at different locations.","Alignment and interleaving of multiple print heads is another disadvantage to radially printing.","Although feasible it is more complex than for Cartesian systems.","SUMMARY OF THE INVENTION The present invention provides a manufacturing system and equipment assembly useful for the preparation of articles by three-dimensional printing.","The system and assembly can be used for high through-put continuous, semi-continuous, or batch manufacture with minimal product loss, high efficiency, and high product reproducibility in the context of flexible article design.","The invention provides a three-dimensional printing equipment assembly comprising: a) a three-dimensional printing build system comprising: a conveyor system adapted to conduct plural build modules; plural build modules engaged with the conveyor system, wherein the build modules are adapted to receive and temporarily retain powder from a powder layering system; and at least one build station comprising: 1) at least one powder layering system adapted to form incremental powder layers within build modules; and 2) at least one printing system adapted to apply a liquid according to a predetermined pattern to incremental powder layers within build modules; wherein the conveyor system repeatedly transports the build modules from the at least one powder layering system to the at least one printing system to form a three-dimensionally printed bed comprising one or more three-dimensionally printed articles in the build modules.","In some embodiments, the three-dimensional printing equipment assembly further comprises at least one liquid removal system adapted to receive one or more three-dimensionally printed beds and to remove liquid from one or more powder layers onto which the liquid has been applied and/or from the three-dimensionally printed bed.","In some embodiments, a build module comprises an incrementally height adjustable platform adapted to receive and temporarily retain at least one incremental layer or plural stacked incremental layers of powder.","In some embodiments, a build module comprises a body comprising an upper surface with a cavity, a height adjustable build platform disposed within the cavity, height adjuster engaged with the body and the platform, and engagement means.","In some embodiments, plural build modules are removably engaged with the conveyor system.","In some embodiments, the platform is adapted to lower (recess) and/or raise by one or more increments after placement of an incremental layer of powder thereon.","The platform displacement can occur prior to or after placement of a subsequent incremental layer of powder thereon, thereby press-rolling or removing a portion of powder from a powder layer that has already been laid down.","In some embodiments, the size of an increment is predetermined.","In some embodiments, the build module comprises one or more sidewalls surrounding the build plate and being adapted to retain powder on the height adjustable platform.","In some embodiments, the build module further comprises a removable build plate disposed below the upper surface of the build module.","In some embodiments, the removable build plate is disposed above the height adjustable platform and is adapted to receive and support one or more incremental layers of powder.","In some embodiments, the removable build plate is flat, porous, perforated, textured, coated, knurled, smooth or a combination thereof.","In some embodiments, engagement means are adapted to removably engage a build module with the conveyor system.","In some embodiments, the conveyor system conducts the plural build modules along a planar circuitous path, a horizontal circuitous path, a vertical circuitous path, or a combination thereof.","In some embodiments, the conveyor system is adapted to transport plural build modules along a path in a counterclockwise direction or clockwise direction.","In some embodiments, the path of the modular conveyor system is circular, ellipsoidal, rectangular, semicircular, square, triangular, pentagonal, hexagonal, octagon, oval, polygonal, parallelogram, quadrilateral, geometric, symmetrical, asymmetrical, or equivalents thereof with rounded corners and/or edges.","In some embodiments, the modular conveyor system comprises plural conveyor modules, at least one drive motor, at least one positioning controller, and a path along which plural build modules are conducted.","In some embodiments, a conveyor module comprises a body, one or more build module engagement means, and conveyor module engagement means by way of which plural conveyor modules are adapted to engage to form a modular conveyor.","In some embodiments, the conveyor system comprises plural attachments adapted to removably retain the plural build modules.","In some embodiments, the attachment comprises plural one or more metal links with cam followers or comprises wheels, plates and/or bearings attached to a build module and mounted on a rail system upon which the build module is conducted.","In some embodiments, the conveyor system further comprises one or more positioning-controllers.","In some embodiments, the conveyor system is a continuous or discontinuous loop system.","In some embodiments, the at least one build station is incrementally height adjustable with respect to the build modules, whereby the vertical space between the build module and the build station can be adjusted by one or more increments.","In some embodiments, an incrementally height adjustable build station is adapted to raise by one or more increments after placement of a layer of powder on a build module and prior to placement of a subsequent layer of powder the build module.","In some embodiments, a change in height is achieved by changing vertical position with respect to a prior position of the platform or with respect to an absolute position of the platform relative to the build module.","In some embodiments, the build station is vertically fixed with respect to the build modules and a build platform within a build module is vertically height adjustable with respect to the build module so that the vertical distance between the build station and the build module remains the same during a print lap or print cycle.","In some embodiments, the size of the increment is the same for each incremental layer of a build cycle, is different for one or more incremental layers of a build cycle or a combination thereof.","A build cycle comprises one or more build laps or plural build laps and is defined as the sum total of build laps required to form a 3DP article.","A build lap is defined as the process of forming a printed incremental layer, i.e.","placing an incremental layer of powdered build material and depositing (printing) liquid upon it.","Accordingly, a build cycle results in the formation of plural stacked printed incremental layers that adhere to one another to together form a three-dimensionally printed article.","In some embodiments, the at least one powder layering system comprises at least one powder fill head.","In some the embodiments, the powder fill head is stationary, meaning it does not move, either longitudinally or transversely with respect to the plane of the upper surface of a build module, when applying an incremental layer of powder onto the build module.","In some embodiments, a powder fill head comprises at least one powder fill head body, at least one powder spreader, and at least one powder-height controller.","In some embodiments, a powder layering system comprises a powder fill head, at least one powder reservoir and a powder feeder tube adapted to transfer powder from the powder reservoir to the powder fill head.","In some embodiments, the powder spreader is a cylindrical roller the axis of which has or defines a radial direction of motion opposite the linear direction of motion of a build module through the powder layering system.","In some embodiments, the powder spreader is a cylindrical roller, bar, rod, plate or straight smooth edge.","In some embodiments, the powder fill head comprises a hopper or chute.","In some embodiments, the at least one printing system is adapted to apply (deposit) liquid to the powder according to a Cartesian coordinate algorithm instead of a polar (radial) coordinate algorithm (cylindrical coordinate system, circular coordinate system, or spherical coordinate system).","In some embodiments, the printing system comprises at least one print head adapted to deposit liquid onto an incremental layer of powder in a build station and at least one liquid feed system.","A print head can comprise one or more print modules or plural print modules.","In some embodiments, the invention excludes a printing system adapted to apply liquid to the powder solely according to a polar (radial) coordinate system.","In some embodiments, the invention excludes an equipment assembly or a method wherein the powder fill head moves laterally or transversely or is not stationary, with respect to a build module, while depositing an incremental powder layer.","In some embodiments, the invention excludes an equipment assembly or a method wherein the print head moves laterally or transversely or is not stationary, with respect to a build module, while applying liquid to an incremental powder layer.","In some embodiments, the at least one printing system is adapted to apply (deposit) liquid as a three-dimensional pattern of droplets or as plural two-dimensional patterns of droplets defining one or more articles.","In some embodiments, the pattern comprises droplets placed at equal spacing within one or more articles.","In some embodiments, this pattern comprises droplets placed at unequal spacing within one or more articles.","In some embodiments, this pattern comprises droplets with different spacing within different regions of an article.","In some embodiments, this pattern comprises droplets with tighter spacing (i.e., higher print density) in a region defining the exterior of an article.","In some embodiments, this pattern comprises droplets with looser spacing (i.e., lower print density) in a region interior to an article.","In some embodiments, more than one pattern is used.","In some embodiments, more than one liquid is used.","In some embodiments, the liquid comprises a pure solvent, blend of solvents, solution, suspension, colloid, emulsion, melt or a combination thereof.","In some embodiments, both the print head and the powder fill head are stationary during formation of a printed incremental layer or are stationary as otherwise described herein.","In some embodiments, the equipment assembly further comprises a bed transfer system adapted to transfer three-dimensionally printed beds, one or more at a time, away from the three-dimensional printing build system.","In some embodiments, the bed transfer system is adapted to transfer three-dimensionally printed beds to one or more liquid removal systems and/or one or more harvesting systems.","In some embodiments, the transfer system is integrated with the conveyor system, the liquid removal system or both.","In some embodiments, the liquid removal system comprises at least one dryer.","In some embodiments, the liquid removal system is adapted to process two or more build plates and their contents at a time.","In some embodiments, the liquid removal system is adapted to process two or more printed beds at a time.","In some embodiments, the liquid removal system is adapted to process two or more printed articles at a time.","In some embodiments, the three-dimensionally printed powder bed comprises loose (unbound) powder and one or more three-dimensionally printed articles prior to harvesting of the printed article(s) from the loose powder.","In some embodiments, the equipment assembly comprises one or more harvesting systems adapted to separate loose powder from the one or more three-dimensionally printed articles.","In some embodiments, the harvesting system processes printed beds already processed by the liquid removal system.","In some embodiments, the harvesting system comprises loose powder collector and three-dimensionally printed article collector.","In some embodiments, the harvesting system comprises a vibrating or orbiting surface adapted to receive the three-dimensionally printed powder bed or the three-dimensionally printed articles.","In some embodiments, the harvesting system comprises a vacuum conveyor with a screen to separate articles from loose powder.","The vibrating surface can be perforated, non-perforated, corrugated, smooth or non-smooth to permit separation of loose powder from the printed articles.","In some embodiments, the equipment assembly further comprises a dedusting system adapted to remove loose particles from printed articles that have been harvested from a printed powder bed.","A dedusting system can comprise a housing defining a dedusting region, one or more air jets, e.g.","one or more air knives, that direct pressurized air into the dedusting region, one or more surfaces or retainers in the dedusting region for temporarily retaining one or more printed articles being dedusted, and one or more outlets through which air and removed particles exit the housing or dedusting region.","In some embodiments, the equipment assembly further comprises a build plate loading system adapted to place one or more build plates on the height adjustable platform(s) of the one or more build modules.","In some embodiments, the equipment assembly further comprises one or more powder recovery systems adapted to collect powder from the one or more systems of the equipment assembly and return it to a powder reservoir.","The recovery system can comprise one or more loose powder collectors and one or more conduits for conducting loose powder from the one or more collectors to a powder reservoir.","The recovery system can further comprise: a) one or more powder mixers for mixing recovered loose powder with virgin loose powder; b) one or more pressurized air powder handling systems that facilitate transfer of loose powder from one location to another; c) one or more vacuum powder handling systems that facilitate transfer of loose powder from one location to another; d) one or more mechanical powder handling systems that transfer loose powder from one location to another; e) one or more manual powder handling systems that transfer loose powder from one location to another; or f) a combination thereof.","In some embodiments, the equipment assembly further comprises a control system comprising one or more computerized controllers, one or more computers, and one or more user interfaces for one or more computers.","In some embodiments, one or more components of the equipment assembly are computer controlled.","In some embodiments, one or more components of the three-dimensional printing build system are computer controlled.","In some embodiments, the conveyor system, the height adjustable platforms of the build modules, the at least one powder layering system and the at least one printing system are computer controlled.","In some embodiments, the equipment assembly is adapted to spread layers of powder and deposit (print) droplets of liquid in a predetermined pattern on to the layers according to instructions provided by a computerized controller.","In some embodiments, the predetermined pattern is based on one or more two-dimensional image files comprising pixels.","In some embodiments, the two-dimensional image files are structured such that certain pixels indicate dispensing of droplets, and other pixels represent no dispensing of droplets.","In some embodiments, the two-dimensional image files include different colors of pixels to indicate dispensing of different liquids, or no dispensing of liquid.","In some embodiments, the predetermined pattern for applying the liquid is the same in each incremental layer, is the same in two or more incremental layers, is different in one or more incremental layers, is different in all incremental layers, or is the same for a first group of incremental layer and the same for a second group of incremental layers but the pattern for the first group is different than the pattern for the second group.","In some embodiments, the equipment assembly further comprises one or more working surfaces, tables, gantries, enclosures, and/or platforms.","The invention also provides a three-dimensional printing equipment assembly comprising: a) a three-dimensional printing build system comprising: a conveyor system adapted to conduct plural build modules and comprising positioning-controller and plural build module engagements; plural build modules engaged with the conveyor system, wherein the build modules are adapted to receive and temporarily retain powder from a powder layering system, and wherein a build module comprises an incrementally height adjustable platform, an optional build plate disposed above the platform, and one or more sidewalls defining a cavity within which the platform the optional build plate can be disposed; at least one build station comprising: 1) at least one powder layering system adapted to form incremental powder layers within the cavity of build modules and comprising at least one powder fill head, at least one powder spreader and at least one powder reservoir; and 2) at least one printing system adapted to apply a liquid according to a predetermined pattern to incremental powder layers within build modules and comprising at least one liquid feed system and at least one print head adapted to deposit liquid according to a predetermined pattern onto incremental layers of powder in a build module; wherein the conveyor system is adapted to repeatedly transport the plural build modules from the at least one powder layering system to the at least one printing system, whereby the three-dimensional printing build system forms a three-dimensionally printed bed comprising one or more three-dimensionally printed articles, and optionally loose (unbound or only partially bound) powder that has not been printed upon; b) at least one harvesting system adapted to separate loose powder from one or more three-dimensionally printed articles in a three-dimensionally printed bed; and c) optionally, at least one liquid removal system adapted to remove liquid from one or more incremental powder layers onto which the liquid has been applied and/or from the three-dimensionally printed bed, wherein the liquid removal system is adapted to process two or more build modules at a time.","Some embodiments of the invention include those wherein: 1) at least one liquid removal system is present; 2) the equipment assembly further comprises at least one packaging system adapted to package one or more three-dimensionally printed articles; 3) the conveyor system is adapted to repeatedly transport the plural build modules, from the at least one powder layering system to the at least one printing system, in a linear manner, and not a radial manner, thereby facilitating Cartesian coordinate printing and not radial (polar coordinate) printing; 4) the equipment assembly further comprises a powder recovery system for recovering, and optionally recycling, unprinted powder; 5) the equipment assembly further comprises a liquid detector; 6) a liquid detector detects the presence of liquid in one or more printed incremental layers and/or in one or more printed articles; 7) the equipment assembly further comprises an inspection system; 8) an inspection system is a printed powder inspection system that determines the integrity of printing in one or more printed incremental layers and/or one or more printed articles and/or determines whether or not powder was properly applied in one or more incremental layers; 9) determining the integrity of printing comprises at least one of determining whether or not liquid has been correctly applied to one or more incremental layers according to one or more predetermined patterns and/or determining whether or not liquid has been correctly applied to one or more incremental layers according to a predetermined amount; 10) the inspection system is a printed article inspection system that determines whether or not one or more printed articles have the correct size, shape, weight, appearance, density, content and/or color; 11) the inspection system is a liquid application inspection system that monitors droplets of liquid applied by the print head to powder; 12) the inspection system comprises one or more cameras; and/or 13) a camera is independently selected at each occurrence from the group consisting of a visible wavelength camera, an UV wavelength camera, a near infrared wavelength camera, an x-ray camera and an infrared wavelength camera.","The invention includes all combinations of the embodiments, subembodiments and aspects disclosed herein.","Accordingly, the invention includes the embodiments and aspects specifically disclosed, broadly disclosed, or narrowly disclosed herein, as well as combinations thereof and subcombinations of the individual elements of said embodiments and aspects.","Other features, advantages and embodiments of the invention will become apparent to those skilled in the art by the following description, accompanying examples.","BRIEF DESCRIPTION OF THE FIGURES The following figures form part of the present description and describe exemplary embodiments of the claimed invention.","These drawings are not necessarily drawn to scale, and are instead intended to illustrate the general principles of the invention as further described herein.","Although specific embodiments are described below with specific reference to the drawings provided, other embodiments are possible without deviating from the spirit and scope of the present invention.","The skilled artisan will, in light of these figures and the description herein, be able to practice the invention without undue experimentation.","FIG.","1 depicts a top plan view of an exemplary layout of a three-dimensional printing equipment assembly of the invention.","FIG.","2A depicts a front elevation view of an exemplary build module of the invention.","FIG.","2B depicts a partial perspective side view of the build module of FIG.","2A.","FIG.","2C depicts a front elevation view of three segments of a segmented or modular conveyor system.","FIG.","2D depicts a top plan view of the three segments of FIG.","2C.","FIG.","2E depicts a side elevation view of an optional exemplary aspirator.","FIG.","3A depicts a top plan view of an exemplary printing system of the invention.","FIG.","3B depicts a side elevation view of the exemplary printing system of FIG.","3A.","FIG.","3C depicts a front elevation view of the exemplary printing system of FIG.","3A.","FIG.","4 depicts a bottom perspective view of an exemplary layout of print modules in the print head of a printing system.","FIG.","5 depicts bottom plan views of alternate exemplary layouts for the print modules in different print heads.","FIG.","6 depicts alternate exemplary shapes of the build plates of the invention.","FIG.","7A depicts a top plan view of an exemplary build plate loading system of the invention.","FIG.","7B depicts a side elevation view of the exemplary build plate loading system of FIG.","7A.","FIG.","8A depicts a top plan view of an exemplary powder layering system of the invention.","FIG.","8B depicts a side elevation view of the exemplary powder layering system of FIG.","8A.","FIG.","8C depicts a front elevation view of the exemplary powder layering system of FIG.","8A.","FIG.","9 depicts a perspective view of an exemplary powder fill head of the invention.","FIG.","10A depicts a top plan view of an exemplary bed transfer system of the invention.","FIG.","10B depicts a side elevation view of the exemplary bed transfer system of FIG.","10A.","FIG.","10C depicts a partial top plan view of an alternated exemplary bed transfer system.","FIGS.","11A-11B depict partial sectional side elevation views of alternate embodiments of exemplary three-dimensional printing processes in a build module of the invention.","FIGS.","12A-12D depict top plan views of exemplary layouts of a three-dimensional printing build system of the invention.","FIG.","12E depicts a side elevation view of an exemplary layout of a three-dimensional printing build system of the invention.","FIG.","13A depicts a partial sectional side elevation view of an exemplary dryer or fluid removal system of the invention.","FIG.","13B depicts a partial sectional side elevation view of an alternate exemplary dryer or fluid removal system of the invention.","FIG.","14 depicts a side elevation view of an exemplary harvesting system of the invention.","FIG.","15 depicts a side elevation view of an exemplary packaging system of the invention.","FIG.","16 depicts a partial top plan view of an exemplary build station comprising a powder layering system and a print head.","FIGS.","17A-17D depict top plan views of various different embodiments of a print head and arrangements thereof.","FIG.","18 depicts a perspective view of a combination harvester system and deduster or dedusting system assembly.","FIGS.","19A-19C together depict an exemplary logic flow for operation of the equipment assembly of the invention.","FIG.","19A continues to FIG.","19B, which continues to FIG.","19C, which refers back to FIG.","19A.","FIG.","20 depicts an exemplary logic flow for operation of the powder layering system.","FIG.","21 depicts an exemplary logic flow for operation of the printing system.","FIG.","22 depicts an exemplary logic flow for design of a dosage form.","DETAILED DESCRIPTION OF THE INVENTION The invention provides an equipment assembly and system useful for the manufacture of articles via a three-dimensional printing process.","The assembly and system are suitable for small scale/volume, medium scale/volume and large scale/volume preparation of articles.","The three-dimensional printing process comprises forming an incremental layer of powder on a surface and subsequently printing/applying a liquid onto the layer, then repeating the steps of forming and printing a sufficient number of times to form a printed powder bed comprising one or more intended three-dimensionally printed articles and loose powder.","Any excess/undesired liquid remaining in the article(s) is removed and the loose powder is separated from the article, which is then collected.","Generally, a three-dimensional printing equipment assembly or system comprises various subsystems including one or more three-dimensional printing build systems, one or more harvesting systems, and optionally one or more liquid removal systems.","The equipment assembly can comprise one or more three-dimensional printing build systems, one or more harvesting systems, one or more liquid removal systems and optionally one or more other systems.","In some embodiments, the equipment assembly further comprises one or more (sub)systems selected from one or more build plate loading systems, one or more powder recovery systems, one or more control systems, one or more build module or conveyor positioning systems, one or more conveyor drive motors, one or more bed transfer systems, or a combination of systems thereof.","As used herein, a “three-dimensional printing build system” generally comprises a conveyor system, plural build modules, at least one build station, and optionally one or more other components.","The function of the three-dimensional printing build system is to form one or more three-dimensionally printed articles from a multilayered bed of powder in a build module.","Plural build modules are engaged with a conveyor system that is adapted to conduct the build modules along a predetermined path which passes through one or more build stations.","A build module is conducted to a powder layering system, and an incremental layer of powder is formed on the upper surface of a cavity of a build module.","The build module is then conducted to a printing system, and a liquid is applied to the incremental layer of powder according to a predetermined pattern thereby forming a partially or fully bound powder layer (a printed incremental layer).","The steps of conducting the build module, forming an incremental layer of powder and applying a liquid to the layer are considered to be a single build lap of the process.","Build laps are repeated in build modules such that a printed incremental layer from one lap adheres to a printed incremental layer from a prior or subsequent lap.","Build laps are repeated in build modules a sufficient number of times to form a three-dimensionally printed bed comprising one or more three-dimensionally printed articles and loose powder, wherein the three-dimensionally printed article comprises at least two printed incremental layers.","The liquid applied to the pattern may or may not dry sufficiently under ambient conditions between build laps; therefore, a liquid removal step can be included between build laps.","If, however, the liquid does not dry sufficiently between build laps, then an optional liquid removal step can be conducted following completion of all the build laps, i.e.","following completion of a build cycle, for an intended three-dimensionally printed article.","The conveyor system is adapted to conduct build modules through a predetermined course/path during and between build laps.","Substantially any system useful for conveying solid materials from a first location to a second location and back to the first location can be used.","In some embodiments, the conveyor system is a cyclic, linear or oscillating conveyor system.","In some embodiments, the cyclic conveyor system conducts build modules from the first location to a second location and then back to the first location.","In some embodiments, the conveyor system is a cyclic or iterative conveyor system that conducts build modules two or more times through the same build station(s).","In some embodiments, the linear conveyor system conducts build modules from a first build station to a second build station and optionally one or more other build stations.","In some embodiments, the oscillating system conducts one or more build modules through at least one build station in a first direction and then conducts the one or more build modules through the at least one build station in an opposite direction.","FIG.","1 depicts a top plan view of an exemplary three-dimensional printing equipment assembly (1) comprising a conveyor (2) adapted to conduct plural build modules (6) engaged with the conveyor system along a predetermined path through build regions in one or more build stations, respectively, comprising: a) at least one powder layering system (3) adapted to form incremental powder layers within build modules; and b) at least one printing system (4) adapted to apply a liquid according to a predetermined pattern to incremental powder layers within build modules.","The build modules are adapted to receive and temporarily retain powder from the powder layering system.","In the cyclic system depicted, the conveyor system is a continuous loop system that repeatedly transports/cycles the build modules from the at least one powder layering system to the at least one printing system to form a three-dimensionally printed bed comprising one or more three-dimensionally printed articles in the build modules.","The exemplary conveyor system (2) comprises at least one drive (12) and plural conveyor modules (2a), thereby forming a segmented or modular conveyor system.","A conveyor module is engaged with a corresponding build module and conducted along a predetermined pathway in the direction of Arrow A.","The equipment assembly in FIG.","1 is depicted finishing three-dimensional printing of a first batch of 3-D (three dimensional) articles and starting the 3-D printing of a second batch of 3-D articles.","A three-dimensionally printed bed from the end of a first build cycle is in build module (6a), and the beginning of the second batch starts with a printed incremental layer in build module (6L).","Build module (6a) includes six 3-D articles in a printed bed of powder.","As the build modules (6, 6a-6L) are conducted along the predetermined course, they pass through the bed transfer system (8), which transfers build plates containing completed three-dimensionally printed beds, one or more at a time, away from the three-dimensional printing build system.","A build module comprises a body (7a), and upper surface (7c) having a cavity with in which a height adjustable build platform (7b) is disposed.","An empty build module (6g) optionally receives a build plate (10) as it passes through the build plate loading region of an optional build plate loading system (9).","The build module (6h) is now ready to receive powder.","Build modules will pass through at least one build station comprising at least one powder layering system (3) and at least one printing system (4).","The build module (6j) is depicted passing through the powder dispensing region of a powder layering system (3).","The build module (6k) is depicted between the powder layering system (3) and the printing system (4) and in the recovery region of an optional powder recovery system (11), which pick ups loose powder from the upper surface of build modules.","The build module (6L), which is the first build module of the next build lap, is depicted passing through the printing region of the printing system (4).","A control system, comprising at least one or more computers and one or more use interfaces (5), can be used to control and integrate (coordinate) operation of the various components and systems of the equipment assembly (1).","In some embodiments, operation of each of the conveyor system, the height adjustable platforms of the build modules, the at least one powder layering system, and the at least one printing system are controlled by the control system.","In some embodiments, operation of one or more of the build plate loading system (9), optional powder recovery system (11) and bed transfer system is controlled by the control system.","An equipment assembly can further comprise a bed transfer system (8) adapted to transfer three-dimensionally printed beds, one or more at a time, away from the three-dimensional printing build system.","The exemplary bed transfer system (8) depicted is adapted to simultaneously remove two or more printed beds from respective build modules in a bed transfer region.","In some embodiments, the bed transfer system is adapted to transfer three-dimensionally printed beds and corresponding build plates (and/or build modules), one or more at a time, away from the three-dimensional printing build system.","In some embodiments, a three-dimensional printing equipment assembly comprises: a) a three-dimensional printing build system comprising: a conveyor system adapted to conduct plural build modules; plural build modules engaged with the conveyor system, wherein the build modules are adapted to receive and temporarily retain powder from a powder layering system; and at least one build station comprising: 1) at least one powder layering system adapted to form incremental powder layers within build modules temporarily disposed in a powder dispensing region of the build station; and 2) at least one printing system adapted to apply a liquid according to a predetermined pattern to incremental powder layers temporarily disposed within build modules in a printing region of the build station; wherein the conveyor system repeatedly transports the build modules from the powder dispensing region of the at least one powder layering system to the printing region of the at least one printing system to form a three-dimensionally printed bed comprising one or more three-dimensionally printed articles in the build modules; b) at least one bed transfer system adapted to transfer completed three-dimensionally printed beds, one or more at a time, away from the build region of the three-dimensional printing build system; c) at least one harvesting system adapted to separate loose powder from one or more three-dimensionally printed articles in a three-dimensionally printed bed; d) at least one control system adapted to control one or more systems of the equipment assembly; e) optionally, at least one liquid removal system; and f) optionally, at least one packaging system adapted to package one or more three-dimensionally printed articles.","A build module receives and retains powder deposited thereon by a powder layering system.","In some embodiments, the build module comprises a height adjustable platform disposed within a cavity in the upper surface of the build module, wherein the cavity is defined by sidewalls.","The height adjustable platform in combination with the sidewalls forms a cavity for the powder.","The platform can be adapted to raise or lower incrementally.","Powder is placed within the cavity and either directly or indirectly (such as by way of a build plate) onto the platform.","FIGS.","2A-2B depict an exemplary build module (15), wherein FIG.","2A is a front elevation view and FIG.","2B is a perspective side view.","The build module comprises a body (16a), a cavity (16b) in the upper surface (16d) as defined by the surrounding walls (16c), and height adjuster (19a, 19b) engaged with and adapted to raise and lower the height adjustable platform (17) disposed in the cavity.","The build module is depicted with a build plate (18) disposed above the platform, and engagement (20) by way of which it is engaged with the conveyor system.","A build module can be permanently or removably engaged with the conveyor system.","Although the body and cavity of the build module are depicted having a rectangular shape, they can be shaped as needed.","The height adjuster can comprise one or more height adjusters.","In some embodiments, the height adjuster is incrementally height adjustable thereby rendering the height adjustable platform also incrementally height adjustable.","In some embodiments, an incrementally height adjustable component or system is adapted to raise by one or more increments before and/or after placement of a layer of powder on a build module and prior to placement of a subsequent layer of powder the build module.","The height of an increment (thus the thickness of an incremental layer) can be controlled in different ways.","In some embodiments, the height adjuster is computer controlled, whereby the computer controls raising or lowering of the height adjusting means by the size of an increment and/or by the number of increments.","The size (vertical displacement) of an increment can vary from incremental layer to incremental layer, be the same from incremental layer to incremental layer or a combination thereof.","In some embodiments, the size of the increment is the same for each incremental layer (build lap) of a build cycle, is different for one or more incremental layers of a build cycle, or a combination thereof.","The size of a vertical increment can be relative to a prior initial position of the build platform or the height adjuster of the powder fill head or both.","For example, the platform is lowered within the cavity by a first increment to a first position relative to upper surface of the build module.","A printed incremental layer is formed on the platform at the first position during a first build lap.","The platform is then lowered by a second increment to a second position but relative to where it was at the first position.","Another printed incremental layer is formed on the platform while at the second position during a second build lap.","This process is repeated until completion of a build cycle.","The size of a vertical increment can be relative to one or more absolute positions of the platform in the cavity of a build module.","For example, the build module can comprise plural encoders distributed vertically within or adjacent the cavity.","The size of a first vertical increment, then, is defined by the absolute position (absolute vertical distance) of the platform with respect to a first encoder.","When the platform is lowered by a second increment to a target second vertical position, which is determined according to or defined by the absolute vertical distance of the platform with respect to a second decoder.","This type of absolute positioning can be exemplified as follows.","If the target increment is 0.50 mm below the upper surface of a build module, the platform is commanded to drop 0.50 mm.","If the next target increment is to be an additional 0.25 mm, then the platform is commanded to drop to a depth of 0.75 mm below the upper surface of the build module rather than to command it to drop by 0.25 mm relative to the initial 0.5 mm increment.","This approach is generally superior to using relative moves (0.500, then 0.250) as any minor positioning errors will be resolved or at least not accumulate.","The build plate is adapted to fit within the upper cavity of a build module and to superpose a height adjustable platform within the cavity.","The build plate receives and supports a powder bed and/or incremental powder layer(s).","In some embodiments, the removable build plate is flat, porous, perforated, textured, coated, knurled, smooth or a combination thereof.","Any regular and/or irregular geometric pattern for the arrangement of perforations can be used.","The shape of the build plate can be varied as needed.","FIG.","6 depicts build plates (40a-40h) shaped as a rectangle with rounded corners (40a), octagon (40b), cross (40c), circle (40d), hexagon (40e), pentagon (40f), half-rectangle/half-circle (40g, bullet-shaped profile), rectangle with one concave end and one convex end (40h); however, any other shape can be used.","The porosity (extent of perforation) of a build plate can be adapted as need to improve operation and manufacture.","The build plate (40a) comprises plural evenly spaced perforations.","The build plate (40b) comprises a lattice-type structure or mesh.","The build plate (400 comprises a rough surface with plural perforations.","The build plate (40g).","A build plate can be made of any material durable enough to withstand three-dimensional printing thereon.","In some embodiments, the build plate is adapted for single use or repeated use.","In some embodiments, the build plate comprises pressboard, paperboard, cardboard, cardstock, metal, rubber, plastic, silicone, Teflon (PVDF), coated metal, vinyl, nylon, polyethylene, polypropylene, thermoplastic or a combination thereof.","The optional build plate loading system is adapted to reload build plates onto the build modules engaged with the conveyor.","In some embodiments, the build plate loading system is adapted to place one or more build plates on the height adjustable platform(s) of the one or more build modules.","The build plate loading system (9) depicted in FIGS.","7A and 7B comprises a horizontally-telescopic arm (41) pivotally engaged (43) with a vertically-telescopic post (42) and a tray-loading arm (44).","The system (9) engages a build plate by a grasp comprised with the vertical tray loading arm (44).","The exemplary grasp comprises a plate (46) and an actuatable member (45) that biases/presses a build plate against the plate thereby grasping and temporarily retaining the tray.","Other grasps can be used to engage and temporarily retain the tray.","In some embodiments, the build plate loading system is a vacuum-based transfer system.","The build plate system can also be absent, in which case build plates can be loaded manually onto the build modules.","The powder-layering system (3) depicted in FIGS.","8A-8C is mounted on a support (table, frame, body, 54) and comprises at least one powder fill head (51), at least one powder reservoir (50) and at least one powder feeder tube (52) driven by a powder feeder drive (53) and adapted to transfer powder from the powder reservoir to the powder fill head.","The powder feeder tube can comprise a drive motor and screw-type shaft, e.g.","an auger or shaft with spiral blades/vanes, such as found in a Schenk feeder.","The powder-layering system forms the incremental powder layer when a build module passes through the powder dispensing region (55, also referred to as a layering region), for example in the direction of Arrow J (FIG.","8C).","In some embodiments, a powder fill head (51) depicted in FIG.","9 comprises a powder fill head body (60, box), at least one powder fill head hopper (61) and at least one powder spreader (64).","The hopper receives material from the powder feeder tube to form a temporary supply (63) of powder, which is optionally agitated by powder fill head agitator (62), which can be a powder fill head distribution plate instead.","In some embodiments, the hopper (61) is replaced with a chute (not shown, or distribution plate) having a channeled interior surface that distributes powder evenly across the width of the surface and downward onto a build module.","Powder exits the hopper (or chute which does not accumulate a substantial amount of powder) in the direction of Arrow K. In some embodiments, the powder fill head further comprises at least one powder-height controller adapted to control the relative distance between the powder spreader (64) and a surface (such as the build plate, the upper surface of the build module, the height adjustable platform, or a prior powder layer) below the powder spreader.","An optional distribution bar (or plate, not shown) can be placed between the outlet of the fill head body and the powder spreader (roller).","The distribution bar serves to better distribute powder across a layer of powder prior to being contacted by the powder spreader, whereby an incremental powder layer (65) is formed.","The powder-height controller can raise or lower the powder spreader so as increase or decrease the thickness of a layer of powder placed onto the platform or a prior layer of powder on the platform.","For example, if the platform is lowered by a first increment and the powder-height controller is raised by the same or another second increment, then the thickness of powder laid down will approximate the sum of the first and second increments.","If the platform is lowered by a first increment and the powder-height controller is lower by a second increment, then the thickness of powder laid down will approximate the difference of the first increment minus the second increment.","Alternatively, the powder spreader in combination with the powder-height controller can cooperate to compress a layer of powder that has been previously laid down.","This can be accomplished by first laying down a layer of powder having a first thickness during a first build lap, lowering the powder-height controller and powder spreader and then passing the layer of powder under the lowered powder spreader thereby compressing the layer of powder.","In some embodiments, the powder spreader is a cylindrical roller the axis of which has a radial direction of motion opposite the linear direction of motion of a build module through the powder layering system.","For example, the surface of the cylinder (64) has a linear direction (Arrow M) opposite the direction (Arrow J) of which an underlying build module (10) passes under the cylinder.","In some embodiments, the powder spreader is a cylindrical roller, bar, rod, plate or straight smooth edge.","Powder fill heads of other construction can be used.","The amount or rate of powder discharged from the powder fill head can be regulated with one or more controls.","A powder discharge feedback controller can monitor the accumulation of powder at the powder spreader as the powder is being discharged from the powder fill head and spread to form an incremental powder layer.","If the rate at which powder is released is too fast, an excessive amount of powder will accumulate at the powder spreader possibly causing it to spread the powder improperly.","The feedback controller then sends a signal thereby causing the rate of powder discharge from the powder fill head to decrease.","Conversely, if the feedback controller senses that the rate of powder discharge is too slow, it sends a signal thereby causing the rate of powder discharge to increase.","The feedback controller can employ one or more visual, laser, acoustic or mechanical sensors or a combination thereof.","FIGS.","2C-2D depict a portion of a modular (segmented) conveyor system (21) comprising plural conveyor modules (segments, links) (22) and corresponding engagement means (23) adapted to engage adjacent conveyor modules to each other.","FIG.","2C is a front elevation view, and FIG.","2D is a top plan view.","A conveyor module comprises a body (22a), female engagement means (22d), male engagement means (22c), and one or more build module engagement means (22b) adapted to removably or permanently engage build modules.","In this exemplary embodiment, adjacent segments (22) pivotally engaged by means of engagement means (23) and pin (22e) such that the segments can pivot about the axis of the pin (22e) in the direction of Arrow LX.","Although engagement means (23) is depicted as a hinge-type joint, other engagements can be used.","The equipment assembly (1) optionally comprises one or more powder recovery systems.","The powder recovery system (11) depicted in FIG.","1 and FIG.","2E is optional and is a vacuum-based system comprising a body (11a), aspirator bar (11c), vacuum source (11b), and one or more air inlets (11d, 11e) adapted to remove powder from one or more surfaces of a build module.","In some embodiments, the powder recovery system is adapted to remove loose powder from the upper surface of a build module.","The powder recovery system (11) can comprise engagement (110 by way of which it is removably or permanently engaged to a surface or support.","Additional powder recovery systems are described herein.","FIGS.","3A-3C depict an exemplary printing system (4) adapted to apply liquid to a powder in the printing region of a printing system.","FIG.","3A is a top plan view, FIG.","3B is a side elevation view and FIG.","3C is a front elevation view.","In some embodiments, the liquid is applied according to a Cartesian coordinate system instead of a polar coordinate system (radial system, cylindrical coordinate system, circular coordinate system, or spherical coordinate system).","In some embodiments, the invention excludes a printing system adapted to apply liquid to the powder according to a polar coordinate system.","An exemplary printing system comprises at least one print head (28) that deposits liquid onto an incremental layer of powder in a build module and at least one liquid feed system (28b) that conducts liquid from one or more liquid reservoirs (28c) to the at least one print head (28).","In some embodiments, the printing system comprises plural print heads, plural liquid feed systems, plural reservoirs or a combination thereof.","In some embodiments, the printing system comprises a single print head, plural liquid feed systems, and plural reservoirs.","The print head of FIG.","3B directs a stream of droplets of liquid into a printing region (29) through which build modules pass.","The exemplary system (4) comprises a frame or gantry (tracks 27a, 27b) by way of which the print head (28) can translate/move in the direction of Arrow D, which is transverse to the direction of motion of a build module during printing.","Translation of the print head can be performed manually or via computer controlled operation.","In some embodiments, the print head is stationary when applying liquid onto an incremental layer of powder, meaning that as liquid is being applied to a powder layer during a print lap, the print head (in particular the print modules) does not move in a direction which is transverse, with respect to the build plane, to the direction of motion of a build module during printing, i.e.","during the application of liquid.","Such a means of printing is different than prior systems wherein the print head (in particular the print module(s)) moves back and forth, in a direction which is transverse to the direction of motion of a build module, during printing.","A print head can comprise one or more print modules that deposit the liquid onto a layer of powder.","The print head (28) of FIG.","3C comprises four print modules that form corresponding printing regions (29a-29d).","When a print head comprises plural print modules, the arrangement/layout of the print modules can be as needed.","The print head (30) of FIG.","4 comprises plural print modules (4) arranged in plural columns with each column comprising plural print modules.","A powder can pass across the print modules in the direction of Arrow E such that print direction is transverse to the horizontal shape of the print module.","Other suitable arrangements for the print modules are depicted in FIG.","5.The print head (34) comprises a single print module.","The print head (35) comprises four print modules pared in groups (35a, 35b) of two offset horizontally from one another.","The print head (33) is somewhat similar to head (35) except that the print modules (35a, 35b) are wider horizontally and offset to a greater extent horizontally than are the print modules (33a); moreover, the print modules are horizontally offset from one another.","The print head (32) comprises two linearly and transversely offset groups (32a, 32b) of print modules.","When viewed in the direction of Arrow E, the adjacent edges of the two groups overlap (each group overlaps the dashed line).","By offsetting the print modules as depicted for module (33), the apparent overall print resolution of the print head can be increased.","The print modules can be offset in staggered, interlaced, sobered, or angled arrangements relative to the print head in order to increase overall print density/resolution.","For example, if the print resolution of each print module is 75 dpi (drops per inch), then the apparent overall print resolution of the print head (33) can be 75 dpi, 150 dpi, 225 dpi, 300 dpi, 375 dpi, 450 dpi or even higher.","If the print resolution of each print modules is 100 dpi, then the apparent overall print resolution of the print head (33) can be 100 dpi, 200 dpi, 300 dpi, 400 dpi or even higher.","In some embodiments, the print resolution of the print head is the same as or greater than the print resolution of a print module comprised within the print head.","In some embodiments, the print resolution of the print head is a multiple of the print resolution of one or more print modules comprised within the print head.","In some embodiments, the print resolution of the print head is the less than the print resolution of a print module comprised within the print head.","The arrangement of one or more print modules in the print head can be modified as needed to provide the desired printing result.","FIG.","16 depicts a partial print station comprising a powder fill head (176) and a print head (178) below which is a build module (175) moving in the direction of Arrow Q through a powder dispensing region and a printing region, respectively.","The fill head, which is disposed transverse to the direction of motion of the build module, remains transversely and longitudinally stationary (with respect to the plane defining the upper surface of the build module, even though it can move vertically toward or away from said plane) as it places an incremental layer of powder onto and across the width of a cavity of the build module.","The build module and incremental layer of unprinted powder moves in the direction of Arrow Q, whereby they pass through the printing region beneath the print module, which is disposed transverse to the direction of motion of the build module.","The print module remains transversely, longitudinally and vertically stationary with respect to the plane defining the upper surface of the build module.","The print module applies liquid onto the incremental layer of powder according to a predetermined pattern, thereby forming an incremental printed layer (180) comprising article(s) 181.The exemplary print head comprises a single print module (179; depicted in dashed line) that spans the width of a cavity of the build module.","The print head (185) depicted in FIG.","17A comprises four print modules (186) arranged in both transverse and longitudinal displacement (with respect to the direction of motion of the print head).","Together the four print modules span the width of the cavity of the build module.","The embodiment (187) of FIG.","17B differs from that of FIG.","17A in that the four print modules (188) are only transversely displaced but not longitudinally displaced.","In some embodiments, the one or more print heads is/are stationary when applying liquid onto an incremental layer, i.e.","when printing.","The one or more print heads can, in particular, be transversely and longitudinally stationary, with respect to the linear direction of motion of a build module (and thus an incremental layer of powder), when printing.","Particular embodiments include those wherein: a) the printing is performed according to a Cartesian coordinate algorithm; b) the build module moves during printing in a linear direction that is perpendicular to the disposition of the print module (and one or more print heads); c) the print head and one or more print modules are stationary when printing (when applying liquid to an incremental layer of powder) and do not move in a direction that is transverse or longitudinal with respect to the direction of motion of the build module; and/or d) printing is not performed solely according to a polar coordinate algorithm.","The three-dimensional printing system/assembly of the invention employs Cartesian coordinate based printing system and algorithms.","Unlike other systems that move the print heads transversely and/or longitudinally when printing, the print heads of the invention are substantially stationary during printing.","The term “transversely” is determined in relation to the direction of motion of a build module beneath a print head and means substantially perpendicular to the direction in which a build module is conducted through a printing area.","The term “longitudinally” is determined in relation to the direction of motion of a build module beneath a print head and means substantially parallel to the direction in which a build module is conducted through a printing area.","Application of liquid across the width of powder layer beneath a print head is accomplished by employing one or more print modules that individually or together traverse at least 75%, 80%, at least 85%, at least 90%, at least 95%, at least 97.5% or at least 99% the width of the powder layer.","In the present case, the “width” of the powder layer is determined along a direction transverse to the direction of motion of a build module beneath a print head, and the term “length” is determined along a direction parallel to the direction of motion of a build module beneath a print head.","In other words, a single print head can traverse the width or plural print heads transversely adjacent to each other can traverse the width of the powder layer.","In particular embodiments, the print head comprises plural print modules that individually do not but together do span the width of an incremental powder layer and/or of the cavity of a build module.","In some embodiments, one or more print modules together modules span at least 50%, at least 55%, at least 75%, at least 90%, at least 95%, at least 99% or all of the width of the cavity of the build module.","In particular embodiments, the build module moves in a first direction, and the print head is stationary when liquid is being applied to the incremental powder layer.","In particular embodiments, printing is performed primarily or solely according to a Cartesian coordinate algorithm.","For example, the algorithm controls application of the droplets of the printing fluid relative to the linear (non-radial, straight) direction of the conveyor such that the print head applies droplets in a direction that is parallel (longitudinal) or is perpendicular (transverse) with respect to the linear direction of motion of the conveyor.","The conveyor and corresponding build modules only move in a straight linear direction beneath the print head and build head.","An alternate embodiment of the invention is depicted in FIG.","17C, wherein the print head (189a) comprises one or more or plural print modules that do not span the width of an incremental powder layer and/or of the cavity of a build module.","This print head is either stationary when printing (when applying liquid to an incremental layer of powder) or moves transversely, with respect to the direction of motion of the build module, while applying liquid to the powder.","The print modules of the print heads (32, 33, 35, 189a, 189b of FIGS.","5 and 17C) are arranged such that the jets on multiple print heads are interleaved to increase the print density across the print bed.","For example, individual print modules having a native print density of 100 dpi are interleaved together such that four of the print heads together provide a 400 dpi print density.","In some embodiments, clusters of print modules, such as depicted in 17D, are arranged so their overall span covers only part of the width of a powder layer, such that plural print heads (each containing a cluster of print modules with interleaved jets) are required to cover the full width of the powder layer.","For example, three print heads (189b), each having a cluster of print modules which together spans only 2.5″, would need to be arranged in a horizontally offset manner in order to cover the width of a powder bed or layer that is between 5 to 7.5 inches wide.","The at least one printing system can apply liquid according to any predetermined print pattern or randomly onto an incremental layer of powder.","The pattern can be the same from incremental layer to incremental layer or can be different for one or more incremental layers of a printed article.","Generally, two adjacent print patterns will comprise at least two overlapping printed portions such that at least a portion of the printed/bound powder in one printed incremental layer will adhere (be bound) to at least a portion of the printed/bound powder of an adjacent printed incremental layer.","In this manner, plural stacked adjacent printed incremental layers adhere to each other thereby forming a three-dimensionally printed article comprising plural adjacent printed incremental layers of completely or partially bound powder.","Even though a three-dimensionally printed article can include undercuts, overhangs, cavities, holes and other such features, at least part of the printed portions of adjacent printed incremental layers must adhere to one another in order to form and fill the composite volume of the article.","The printing system employs a Cartesian coordinate-based printing algorithm when applying liquid to an incremental powder layer.","The system includes a computer and associated software that comprises one or more print jobs.","A print job includes, among other things, information on the thickness of incremental layers and the predetermined pattern to be printed on the incremental layers of a printed article.","The print job provides layer-by-layer instructions to the print head (print module(s)) about the creation and placement of droplets of liquid onto the incremental powder layer.","The print job is based upon the series of two-dimensional images (slices) that, when stacked, together form a predetermined three-dimensional image (object).","Without being held bound to a particular mechanism, a target three-dimensional article is designed, such as with a CAD program.","A virtual image of the target article is sliced virtually into plural stacked thinly-sliced images (which are referred to herein as “two-dimensional” images), wherein each two-dimensional image is actually the thickness of an incremental powder layer.","The sum total of thicknesses of the image slices equals the total “height” of a target article.","Each two-dimensional “image” is then converted into a subset of printing instructions, which together define a predetermined printing pattern for that image.","All of the subsets of printing instructions are joined together to form a final set of printing instructions that are used by the computer to control printing.","Aside from incremental layer thickness, two-dimensional shape of predetermined patterns, and shape of target article, the final set of print instructions also includes specification of or consideration of linear speed of the build module beneath the print head, rate of application of liquid to incremental powder layers, length and width of the incremental powder layer, dimensions of the cavity of a build module, incremental height adjustment of the height adjustable platform of the build module, rate of loading of powder into the powder fill head, rate of loading of powder into a build module to form an incremental layer, rate of transfer of powder from a feed reservoir to the fill head, resolution of the two dimensional image to be printed on each incremental layer, the number of applications of liquid to each incremental layer, application of one or more specific liquids to one or more specific locations of the incremental layer, starting and stopping of liquid application with respect to each build module, the number of articles to be printed, the number of build modules in the equipment assembly, the number of build modules to be printed upon, rate at which the platform of the build module moves down, timing for starting and stopping powder delivery relative to the entire build cycle, rotational speed of leveling device (roller) and other such parameters.","An equipment assembly comprises a control system comprising one or more controllers.","Without being held bound to a particular mechanism, a homing switch located at a fixed point of the conveyor (FIG.","1) provides a reference point as to the location of the “first” build module in a group of build modules.","From there, a computer is able to determine the location of the rest of the build modules in that group by knowing the size of the conveyor, the spacing of the build modules and the dimensions of the build modules.","The control system can also comprise a proximity sensor that specifies the location of one or more build modules relative to the conveyor.","The control system comprises a synchronizer that facilitates synchronization of operation of the various components of the equipment assembly.","By taking into consideration the track (linear) speed of the conveyor and the target thickness and width of an incremental layer, a computer is able to instruct the powder layering system to charge powder onto the build modules at a certain feed rate.","After part of a lap or after one or two calibration laps, the powder feed rate can be continuous.","Once a proper incremental powder layer is formed, deposition of liquid onto the incremental layer can begin.","A proximity sensor senses the leading edge of a build module and then sends instruction to the print system.","A computer controlling the print system takes into consideration a set of printing instructions (which can include among other things the target print resolution (density), the image(s) (pattern(s)) to be printed on the incremental layer, the target rate of liquid deposition, the number of liquids to be deposited, the dimension of the print head and print modules, track speed, the set of images (patterns) that are to be printed to form a target 3D printed article, target article porosity or density, or other such parameters) and the signal generated by a wheel encoder, for example, to provide a pulse that sets the print rate at which to consume the image files in the printing instructions and the resolution at which to print the image file(s).","Following completion of layering and printing per the printing instructions, a build cycle is completed.","As described herein, the powder system can comprise one or more feedback controllers that determine the proper powder feed rate into a powder feeder and into the build modules.","Likewise, the printing system can comprise one or more feedback controllers that determine the rate at which printing fluid (liquid) is being applied and/or consumed and can therefore control the liquid application rate and can also the reloading of liquid reservoir(s).","A liquid removal system, such as a dryer, can comprise one or more relative humidity controllers, temperature controllers and conveyor speed controllers.","The system is therefore capable of adjusting drying time and conditions to provide printed articles containing the desired level of moisture.","In some embodiments, one or more components of the equipment assembly are computer controlled.","A controller is independently selected at each occurrence from a computerized controller, electronic controller, mechanical controller or a combination thereof.","In some embodiments, the control system comprises one or more computerized controllers, one or more computers, one or more user interfaces for one or more computers.","In some embodiments, one or more components of the three-dimensional printing build system are computer controlled.","In some embodiments, the conveyor system, the height adjustable platforms of the build modules, the at least one powder layering system and the at least one printing system are computer controlled.","In some embodiments, the equipment assembly is adapted to spread layers of powder and print droplets of liquid in a predetermined pattern according to instructions provided by a computerized controller.","In some embodiments, the predetermined pattern is based on one or more two-dimensional image files comprising pixels.","In some embodiments, the two-dimensional image files are structured such that certain pixels indicate dispensing of droplets, and other pixels represent no dispensing of droplets.","In some embodiments, the two-dimensional image files include different colors of pixels to indicate dispensing of different liquids, or no dispensing of liquid.","FIGS.","19A-19C, depict a flow chart for operation of an exemplary embodiment of the invention.","The process is initiated, e.g.","by an operator or electronic component such as a computer.","An operator activates and checks the status of system and assembly components, which are then synchronized, after which time the system (assembly) is ready for operation.","Printing fluid and powder are loaded into their respective systems as required of the product to be three-dimensionally printed.","Build plates are loaded into build modules and a build cycle is initiated.","The level of printing fluid(s) and powder(s) are checked and when the required amount is present, conveyor operation is initiated.","Moving to FIG.","19B, the powder feed rate and transport speed (conveyor speed) for the build module is applied and a query is made to determine whether or not a build module is supposed to receive powder.","If so, the platform is lowered and a layer of powder is deposited onto the build module as it passes under the powder fill head.","If not, the build module does not receive powder.","A query is then made to determine whether or not the powder layer is supposed to receive a printed image.","If so, a two-dimensional pattern is printed onto the layer as the build module passes under the print head.","If not, the build module does not receive printing solution.","A query is made to determine whether or not all of the build modules mounted on the conveyor have been processed, i.e.","whether or not the build lap is completed or whether or not the build module is supposed to receive another layer of powder.","If not, any unprocessed build module is processed.","If all of the build modules have been processed, i.e.","the build lap is complete, a query is made to determine whether or not a build cycle is complete.","If not, one or more additional build laps are conducted.","If so, the build modules are prepared for unloading of build plates as described in FIG.","19C.","Completed build plates that bear three-dimensionally printed powder bed are unloaded and transferred to drying trays.","After a build plate has been removed from a build module, another build tray is placed in the empty build module.","After all build plates have been unloaded, a query is made according to FIG.","19A to determine whether or not additional build cycles will be conducted.","If not, the process is terminated.","If so, the next build cycle process is initiated.","FIG.","20 depicts an exemplary subroutine detailing how the platform layer increment is controlled within a build lap and a build cycle.","In this example, the layer thickness (increment) is provided by a product definition.","A cumulative thickness is calculated according to the number of powder layers already laid down.","The platform is dropped to the calculated thickness and a determination is made to confirm that it is at the correct position within a predefined tolerance.","A query is then made to determine whether or not the platform of all the build modules in a particular build lap have dropped to the correct position.","If not, the platforms are adjusted as required.","If so, a query is made to determine whether or not all layers of a build cycle are complete.","If so, the build plates are unloaded as described herein.","If not, the process of this figure is repeated for each of the build layers as needed until the build cycle is complete.","FIG.","21 describes an exemplary subroutine detailing operation of the printing system.","A build process is initiated and the necessary amount(s) of printing fluid is loaded into the reservoir(s).","A set of image files are identified and conveyor operation is begun.","During operation, the level of printing fluid(s) is monitored so that it can be replenished as needed.","When a build module passes beneath a printhead, a trigger signal is generated prompting a query to determine whether or not the build module is to receive a printed image.","If not, the trigger signal is ignored.","If so, an print image file is received and processed such that the columns of image pixels (pixels that are aligned along the axis of movement of the build module) are assigned to specific jets of the printhead.","In addition, rows of image pixels are sent to the printhead taking into consideration the linear speed of the conveyor and the intended print density of the image to be printed.","The printhead then delivers printing fluid droplets, as per the printing instructions, to the powder layer on a build module.","A query is then made to determine whether or not all build modules have been processed.","This query can be repeated for the build lap and/or build cycle level.","Upon completion of a build cycle, the process can be terminated.","If needed, the printhead can be retracted and cleaned.","FIG.","22 depicts a flow chart of an exemplary process for designing a dosage form and determining the layer thickness thereof and image files (two-dimensional printing patterns) there for.","The process can be conducted with or without a computer.","A dosage form having a specified three-dimensional structure and comprising a target dose of drug is designed.","The approximate target powder layer thickness is selected and the height of the dosage form is divided by the target incremental powder layer thickness to provide the number of powder layers required to prepare the dosage form.","Based upon the layer and its location within the dosage form, each layer is assigned as needed an initial two-dimensional pattern, i.e.","an image file, which ultimately results in a set of printing instructions employed by the printing system to create a corresponding printed increment layer.","The image file assigned to each layer can be input, or it can be retrieved from an image library.","In order to determine whether or not archived images from the image library are required, the system queries whether or not all layers have been assigned an image file as needed.","If so, the design of the dosage form is complete and the process is terminated.","If not, the system queries whether or not the image required for a specific layer exists in the image library.","If so, the image file is retrieved from the library and assigned to the respective powder layer.","The system then again queries whether or not all layers have been assigned an image file as needed and the loop of logic continues as needed until completion of design of the dosage form.","If the image file is not present in the image library, a new image file is created, optionally stored in the image library, and assigned to the respective layer, and the loop of logic continues as needed until completion of the dosage form design.","It should be understood that one or more layers might not require any image file at all, meaning that specific layer would not be printed during preparation of the dosage form.","The equipment assembly of the invention can comprise one or more bed transfer systems adapted to transfer three-dimensionally printed beds, one or more at a time, away from the three-dimensional printing build system.","FIG.","10A is a top plan view and FIG.","10B is a side elevation view of an exemplary bed transfer (unloading) system (8) comprising a frame (70), receiving platform (76), tray-loading platform (77), and bed transfer mechanism (71) moveably engaged with the frame and superposing a bed-transferring region (75).","The bed transfer mechanism (71) comprises mounts (71c) adapted to translate along tracks (72a, 72b) in the direction of Arrow N in a reciprocating manner.","The bed transfer mechanism also comprises a receptacle (71a) comprising a cavity (82) adapted to receive and temporarily retain a three-dimensionally printed bed (83) having an optional build plate (10).","In an alternate embodiment, the receptacle is a push plate or U-shaped coral (71d) comprising a receiving area adapted to receive and temporarily retain a three-dimensionally printed bed.","The receptacle (71a) reciprocates in a vertical manner in the direction of the Arrow P by means of reciprocator (71b) engaged with the receptacle (71a) and the body (71d) of the bed transfer mechanism (71).","During operation, a conveyor conducts and positions a build module (7a) beneath the receptacle (71a) and in the bed-transferring region (75) so as to align the three-dimensionally printed bed (83) and build plate with the cavity (82).","The receptacle then lowers in the direction of Arrow P an amount sufficient to retain substantially all of the three-dimensionally printed bed and build plate within the cavity.","The bed transfer mechanism (71) then slides/translates the printed bed and build plate in the direction of the Arrow N onto the receiving platform (76) and then onto a transport tray (74).","The receptacle is then raised in the direction of the Arrow P leaving the printed bed and build plate on the transport tray and translates back in the direction of Arrow N to the original position superposing a build module.","The transport tray (74) is then conducted in the direction of the Arrow B.","FIG.","10C depicts an alternate embodiment of a bed transfer system comprising a diverter (84) and a conveyor (86).","The diverter directs build modules or build plates comprising printed beds (87) from the conveyor (85) of the build system onto an adjoining conveyor (86), which optionally transfers the printed beds to a liquid removal system or other downstream processing apparatus (not shown).","The diverter can be adapted to raise and lower.","In a first position, it does not direct printed beds away from the build system and in a second position it does.","In some embodiments, the bed transfer system is adapted to transfer three-dimensionally printed beds to one or more liquid removal systems, one or more harvesting systems and/or one or more packaging systems.","In some embodiments, the transfer system is integrated with the conveyor system, the liquid removal system or both.","A liquid removal system is adapted to receive one or more build plates (containing a printed bed) and to remove liquid from one or more printed powder layers onto which the liquid has been applied and/or from the three-dimensionally printed bed.","A liquid removal system can be a process area through which one or more of the build modules are conducted.","For example, the liquid removal system in FIG.","1 can be the process area over the conveyor and excluding the region under the printing region.","Alternatively, a liquid removal system can be another process area not directly associated with the three-dimensional printing build system, such as a temporary retaining or storage area wherein three-dimensionally printed beds are placed and dried under ambient conditions.","In some embodiments, a liquid removal system is one or more dryers.","FIGS.","13A-13B depict exemplary liquid removal systems.","FIG.","13A is a partial sectional side elevation view of a dryer (130) adapted to remove or reduce the amount of liquid in a three-dimensionally printed bed (83) or article.","The dryer comprises a housing (131) within which are contained plural heating elements (137), a conveyor system (138) and one more exhaust ports (132).","The housing comprises an inlet (133) and an outlet (134) through which three-dimensionally printed beds (or articles) and their respective build plates are conducted by way of conveyors (135, 136, respectively).","During operation, the printed beds are conducted through the inlet (133) and carried by the conveyor system (138) through a predetermined path as they are exposed to the heating elements (137), which affect evaporation of liquid from the printed beds.","When the printed beds (or articles) exit the dryer, they comprise less liquid than they did when they entered the dryer.","Although not depicted in FIG.","13A, the dryer can comprise a vacuum system adapted to reduce the pressure within the dryer or air-handling system adapted to increase or otherwise control the flow of air through the dryer.","Although the path of the conveyors is depicted as “S-shaped” in FIG.","13A, the path can instead be any path desired, e.g.","U-shaped, Z-shaped, N-shaped, n-shaped, O-shaped, etc.","FIG.","13B depicts an alternate embodiment of a dryer (141) suitable as a liquid removal system.","The dryer comprises a housing (142), within which are contained plural heating elements (146) and a conveyor system (145).","The housing comprises an inlet (143) and an outlet (144) through which three-dimensionally printed beds and their respective build plates are conducted by way of the conveyor.","In some embodiments, the dryer comprises one or more covers (147) for the inlet and/or outlet.","In some embodiments, the three-dimensionally printed bed comprises loose powder and one or more three-dimensionally printed articles.","An equipment assembly of the invention can further comprise one or more harvesting systems adapted to separate loose powder from the one or more three-dimensionally printed articles.","In some embodiments, the harvester processes build plates already processed by the liquid removal system.","In some embodiments, the harvester comprises loose powder collection means and three-dimensionally printed article collection means.","In some embodiments, the harvester comprises a vibrating and/or orbiting surface adapted to receive the three-dimensionally printed bed.","In some embodiments, the harvester comprises one or more deagglomerators.","In some embodiments, the equipment assembly further comprises one or more dedusters adapted to remove loose powder from articles that have been harvested.","In some embodiments, a deduster comprises one or more air brushes.","The exemplary combination harvester and deduster system (150) depicted in side elevation view in FIG.","14 comprises a frame (151), a receiving platform having an air-dispenser (161), bed transfer mechanism (152) moveably engaged with the frame and superposing a bed transfer region, aspirator (154), deagglomerator (156), deduster (157), printed article collector (158), and powder collector (159).","The also comprises at least one air brush (161).","The bed transfer mechanism (152) comprises mounts adapted to translate along tracks (153) in the direction of Arrow N in a reciprocating manner.","The bed transfer mechanism also comprises a receptacle (167) comprising a cavity (166) adapted to receive and temporarily retain a three-dimensionally printed bed (83) having an optional build plate (10).","The receptacle (167) reciprocates in a vertical manner by means of reciprocator engaged with the receptacle and the body of the bed transfer mechanism (152).","During operation, a conveyor (155) conducts and positions a printed bed (83), build plate (10) and transport tray (74) beneath the receptacle (167) and in a bed transfer region so as to align the three-dimensionally printed bed, build plate and transport tray with the cavity (166).","The receptacle then lowers onto the transport tray an amount sufficient to retain substantially all of the three-dimensionally printed bed within the cavity.","An aspirator (154) then aspirates the printed bed (83) by way of a conduit (165) and a perforated plate in the cavity and above the bed, thereby removing a major portion of the loose powder contained within the bed while leaving behind one or more printed articles (160) within the cavity of the receptacle.","The bed transfer mechanism (152) then slides/translates the printed bed and build plate in the direction of the Arrow N over one or more airbrushes (161) adapted to direct a flow of air at the printed articles in the cavity to assist in releasing additional loose powder from the printed article(s).","The empty build plate (10) and transport tray (74) are conveyed away from the bed-transferring region.","A powder collector (159) is adapted to receive loose powder and other solid material not otherwise collected by the aspirator (154).","The bed transfer mechanism continues to move in the direction of the Arrow B until it superposes a deagglomerator (156).","The aspirator is then turned off and the printed particles fall onto of the process tray of the deagglomerator, which is adapted to remove and collect agglomerates from the printed article(s) to provide deagglomerated printed articles (162).","The bed transfer mechanism (152) then returns to its original position in preparation of loading and processing of additional printed beds.","The process tray of the deagglomerator vibrates (and/or orbits) and conducts the printed articles in the direction of Arrow B toward the deduster (157) while degglomerating the printed particles.","The deduster also comprises a vibrating process tray adapted to remove and collect dust from the deagglomerated printed articles to provide dedusted printed articles (163).","The finished printed articles (164) are conducted to a printed article collector (158).","The deduster and/or deagglomerator can further comprise solids collector for collecting loose powder and/or agglomerates.","FIG.","18 depicts an exemplary harvester system (190) and a deduster system (200).","The harvester system comprises a housing (191), a receptacle (192), a vibrating surface (193) within the receptacle and an outlet (194) for the receptacle.","A perforated build plate below a dry printed bed (loose powder and printed article) is placed on the vibrating surface.","Loose powder is dislodged from the printed bed as the surface vibrates.","The recovered loose powder falls and is collected in the receptacle, after which it is unloaded from the receptacle through the outlet.","The recovered loose powder is collected in a container (195).","Collection of the loose powder can be done manually, mechanically and/or with a vacuum system.","The deduster system (200) of FIG.","18 comprises a housing (201), receptacle (202), drawer (203), enclosure (204), one or more air jets, e.g.","air knives, (205, not depicted) within the enclosure, inlet (206, not depicted) for the enclosure, and an outlet (207) for the enclosure.","A perforated build tray having one or more printed articles that have been harvested is placed in the drawer which is subsequently pushed into the enclosure by way of the inlet, thereby forming a substantially enclosed dedusting area.","One or more air jets direct pressurized air toward the printed article(s), whereby both coarse and fine loose powder that has clung onto the printed article(s) is dislodged there from.","The loose powder falls into the receptacle and is conducted to the outlet along with the flow of air released by the air jet(s).","The dedusted printed article(s) is (are) are retrieved by opening of the drawer.","The recovered loose powder collected in a container.","Collection of the loose powder can be done manually, mechanically and/or with a vacuum system and/or air-handling system.","The deduster system and/or the harvester system can be placed within a larger enclosure (208) to minimize spreading of dust in a process area.","Loose powder, agglomerates or particulates collected during the build cycle, drying, harvesting, deagglomerating and/or dedusting can be disposed or can be blended to form recovered bulk material that can be milled (optionally) and recycled back into a feed supply of virgin unprinted bulk material.","Such a bulk material recovery system can comprise one or more vacuum systems, one or more pressurized air systems, one or more non-vacuum mechanical systems, one or more manual systems or a combination thereof for transferring bulk material from one location to another.","FIGS.","12A-12E depict exemplary generalized layouts for conveyor systems and build stations of a three-dimensional printing build system.","FIG.","12A depicts a top plan view of a three-dimensional printing build system (105) somewhat similar to the one depicted in FIG.","1.The system (105) comprises a cyclic and iterative conveyor system (110), a first build station (111), an optional second build station (115), and plural build modules.","The plural build modules are conducted through the first build station, and optionally the second build station if present, and then back through the first build station in the direction of the Arrow A.","The build station (111) comprises a powder-layering system (112) and a printing system (114).","FIG.","12B depicts a top plan view of a three-dimensional printing build system (106) comprising a linear conveyor system (118), a first build station (111), a second build station (115), and plural build modules.","The plural build modules are conducted from position X1 through the first build station to position X2 and then through the second build station to position X3 in the direction of Arrow A.","Further processing of printed articles is done downstream of the build system (106).","In some embodiments, the conveyor system is a linear conveyor system that conducts build modules from a first build station to a second build station and optionally to a third or other build station in a non-cyclic or non-iterative manner.","FIG.","12C depicts a top plan view of a linear and iterative three-dimensional printing build system (107) comprising a linear conveyor system (119), a first build station (111), an optional second build station (115), and plural build modules.","The plural build modules are conducted from position X1 through the first build station to position X2 and then through the second build station, if present, to position X3 and then, in reverse direction in the direction of Arrow AR, back through the second build station, if present, and the first build station.","A third or more other build stations can be included, and if present, the build modules are conducted through them.","FIG.","12D depicts a top plan view of a linear and iterative three-dimensional printing build system (108) comprising plural build stations (111, 115, 126, 127), plural build modules, and build module transfer means (124, 125).","Empty build modules on a conveyor (120) are transported from position Z1 to position X1.The conveyor (121) then conducts build modules consecutively from positions X1 to X2 to X3 and through the build stations (111, 115).","Build module transfer means (124) then transfer build modules in the direction of Arrow AZ from position X3 to position X4.A second conveyor then conducts build modules consecutively from positions X4 to X5 to X6 and through the build stations (126, 127, respectively).","Build module transfer means (125) then transfer build modules in the direction of Arrow AY from position X6 to position X1.This type of build lap is repeated as many times as necessary until the desired printed article is formed and unloaded from the printing build system (108) by way of the conveyor (122).","FIG.","12E depicts a side elevation view of a three-dimensional printing build system (109) somewhat similar to that of FIG.","12D.","In this embodiment, however, the conveyors (128, 129) are arranged vertically one above the other rather than side by side.","Moreover, the lower conveyor system (129) does not have a build station specifically associated with it.","As noted above, it takes plural build laps to construct a three-dimensionally printed article from a powder bed.","FIG.","11A depicts a partial cross-sectional view of a build module (90) comprising a body (91) having an upper surface (91a) and a height adjustable platform (92) having an upper surface (92a).","The hollow arrows indicate process steps, whereas the filled-in black arrows indicate direction of motion of the platform in the figure.","The build module (90) is depicted in starting position at Stage 0.In process steps A1 and A2, the platform is lowered thereby forming a cavity (93) defined by the inner surface (91b) of the build module and the upper surface of the platform.","A build plate (10) is then placed on top of the platform as depicted in Stage I.","In process step B1, a layer of powder (94) is placed in the cavity and over the build plate such that the position of upper surface (94a) of the layer substantially matches (or is at the same height of) the position of the upper surface (91a) of the build module as depicted in Stage II.","In process step C1, platform is lowered again by an increment thereby forming a new cavity (95) above the surface of the powder layer (94) as depicted in Stage III.","In process steps D1 and D2, another layer of powder is placed in the cavity and then printed upon to form one or more sections of bound powder as depicted in Stage IV.","In process step E1, the platform is lowered again and another cavity is formed above the previous layer of powder as depicted in Stage V. In process steps F1 and F2, another layer of powder is placed in the cavity and then printed upon to form one or more sections of bound powder as depicted in Stage VI.","The print pattern used in process step D2 is similar to the print pattern used in process step F2.In process step G1, the platform is lowered again as depicted in Stage VII.","In-process step H1, a layer of powder is placed in the just formed cavity over the prior layer of powder as depicted in Stage VIII thereby completing formation of a printed bed comprising loose powder (97) and plural printed articles (96).","In process step J1, the receptacle (71a) of a bed transfer means is placed above the printed bed such that the cavity of the receptacle superposes and is aligned with the printed bed as depicted in Stage IX.","In process step K1, the platform is raised such that the build plate and printed bed are disposed within the cavity as depicted in Stage X.","In process step L1, the receptacle is translated/slid in the direction of Arrow N thereby unloading the builds tray returning it to Stage 0.The print pattern used for individual print cycles can vary as needed and need not be the same for each build lap.","FIG.","11B depicts the build module of the FIG.","11A.","The process steps A1, A2, B1 and C1 in FIG.","11B are similar to those steps in FIG.","11A; however, the process of FIG.","11B includes the process step B2 whereby the first layer of powder is printed upon to form a layer comprising loose powder (100) and bound powder (101).","In process step D1, a layer of powder is placed within the cavity, and in process step D3, the layer is printed upon using a print pattern that is different than the print pattern used in process step B2 such that the cross-section of the bound powder (102) in Stage IV of FIG.","11B is different than the cross-section of the bound powder in Stage IV of FIG.","11A.","The pattern of step D3, however, overlaps with the pattern of step B2 sufficiently that the resulting printed layers adhere to one another.","The platform is lowered again according to process step E1.Powder is then layered into the cavity in process step F1 and printed upon in process step F3.Again, the print pattern used in process step F3 is different than the print pattern used in process steps D3 and B2, such that the cross-section of the bound powder (103) in stage VI comprises three different patterns, which patterns are different than those depicted in stage VI of FIG.","11A.","The pattern of step F3, however, overlaps with the pattern of step D3 sufficiently that the resulting printed layers adhere to one another.","The platform is lowered again according to process step G1 as depicted in stage VII.","In process step H1, a layer of powder is placed within the cavity, and in process step H2, the layer is printed upon using a print pattern that is different than any of the prior print patterns used such that the cross-section of the bound powder (104) in the printed bed in stage VIII comprises six different patterns, which patterns are different than those depicted in stage VIII of FIG.","11A.","The pattern of step H2, however, overlaps with the pattern of step F3 sufficiently that the resulting printed layers adhere to one another.","In process step J1, a perforated plate is placed above the printed bed and a receptacle of a bed transport means is placed above the plate as depicted in Stage X.","In process step K1, the perforated plate, printed bed and build plate are raised into the cavity of the receptacle.","In process step L1, the receptacle is translated away in the direction of Arrow N leaving behind the build module in its initial stage 0.Upon completion of the exemplary print cycle, the three-dimensionally printed bed can be further processed as described herein.","Conveyor systems useful for conducting solid articles from one location to another during manufacture include, by way of example, a modular conveyor, non-modular conveyor, continuous conveyor, contiguous conveyor, conveyor belt, cam, pallet conveyor or link conveyor.","Combinations thereof can be used.","FIG.","15 depicts a side elevation view of an exemplary packaging system (170) adapted to package one or more three-dimensionally printed articles (164).","The system comprises a hopper (171) that provides three-dimensionally printed articles which are placed onto a conveyor (173).","The articles are conducted through a packaging module (172) that places one or more articles into a package (174).","Suitable packaging systems can employs bottles, blister packs, tubes, boxes and other such containers.","The various components and systems of the equipment assembly will comprise parts made of durable materials such as metal, plastic, rubber or a combination thereof.","In some embodiments, components of the equipment assembly comprise 304 or 316 stainless steel where possible.","The powder can comprise one or more materials suitable for pharmaceutical or non-pharmaceutical use.","In some embodiments, the powder comprises one or more pharmaceutical excipients, one or more pharmaceutically active agents, or a combination thereof.","In some embodiments, the three-dimensionally printed article is a pharmaceutical dosage form, medical device, medical implant, or other such article as described.","Exemplary types of pharmaceutical excipients that can be included in a three-dimensionally printed article include, by way of example and without limitation, chelating agent, preservative, adsorbent, acidifying agent, alkalizing agent, antifoaming agent, buffering agent, colorant, electrolyte, flavorant, polishing agent, salt, stabilizer, sweetening agent, tonicity modifier, antiadherent, binder, diluent, direct compression excipient, disintegrant, glidant, lubricant, opaquant, polishing agent, plasticizer, other pharmaceutical excipient, or a combination thereof.","Exemplary types of non-pharmaceutical excipients that can be included in a three-dimensionally printed article include, by way of example and without limitation, ash, clay, ceramic, metal, polymer, biological material, plastic, inorganic material, salt, other such materials or a combination thereof.","In some embodiments, the powder comprises one or more, two or more, three or more, four or more, five or more, six or more, seven or more, eight or more, nine or more, ten or more or plural components, each component being independently selected at each occurrence.","In some embodiments, the equipment assembly comprises one or more, two or more, three or more, four or more, five or more, six or more, seven or more, eight or more, nine or more, ten or more or plural powder (or solid component) reservoirs.","Pharmaceutically active agents generally include physiologically or pharmacologically active substances that produce a systemic or localized effect or effects in animals, cells, non-humans and humans.","When an active agent is present, any such agent can be used.","Exemplary classes of active agents include, by way of example and without limitation, pesticides, herbicides, insecticides, antioxidants, plant growth instigators, sterilization agents, catalysts, chemical reagents, food products, nutrients, cosmetics, vitamins, sterility inhibitors, fertility instigators, microorganisms, flavoring agents, sweeteners, cleansing agents and other such compounds for pharmaceutical, veterinary, horticultural, household, food, culinary, agricultural, cosmetic, industrial, cleaning, confectionery and flavoring applications.","Whenever mentioned and unless otherwise specified, the term “active agent” includes all forms of the active agent including neutral, ionic, salt, basic, acidic, natural, synthetic, diastereomeric, isomeric, enantiomerically pure, racemic, hydrate, chelate, derivative, analog, optically active, optically enriched, free base, free acid, regioisomeric, amorphous, anhydrous and/or crystalline forms.","A three-dimensionally printed dosage form can comprise one, two or more different active agents.","Particular combinations of active agents can be provided.","Some combinations of active agents include: 1) a first drug from a first therapeutic class and a different second drug from the same therapeutic class; 2) a first drug from a first therapeutic class and a different second drug from a different therapeutic class; 3) a first drug having a first type of biological activity and a different second drug having about the same biological activity; 4) a first drug having a first type of biological activity and a different second drug having a different second type of biological activity.","Exemplary combinations of active agents are described herein.","The active agent can be independently selected at each occurrence from active agents such as an antibiotic agent, antihistamine agent, decongestant, anti-inflammatory agent, antiparasitic agent, antiviral agent, local anesthetic, antifungal agent, amoebicidal agent, trichomonocidal agent, analgesic agent, anti-arthritic agent, anti-asthmatic agent, anticoagulant agent, anticonvulsant agent, antidepressant agent, antidiabetic agent, antineoplastic agent, anti-psychotic agent, neuroleptic agent, antihypertensive agent, hypnotic agent, sedative agent, anxiolytic energizer agent, antiparkinson agent, muscle relaxant agent, antimalarial agent, hormonal agent, contraceptive agent, sympathomimetic agent, hypoglycemic agent, antilipemic agent, ophthalmic agent, electrolytic agent, diagnostic agent, prokinetic agent, gastric acid secretion inhibitor agent, anti-ulcerant agent, anti-flatulent agent, anti-incontinence agent, cardiovascular agent or a combination thereof.","A description of these and other classes of useful drugs and a listing of species within each class can be found in Martindale, The Extra Pharmacopoeia, 31ST Ed.","(The Pharmaceutical Press, London 1996), the disclosure of which is incorporated herein by reference in its entirety.","The above-mentioned lists should not be considered exhaustive and are merely exemplary of the many embodiments considered within the scope of the invention.","Many other active agents can be included in the powder of the invention.","The liquid applied to the powder can be a solution or suspension.","The liquid can comprise an aqueous carrier, nonaqueous carrier, organic carrier or a combination thereof.","The aqueous carrier can be water or an aqueous buffer.","The nonaqueous carrier can be an organic solvent, low molecular weight polymer, oil, silicone, other suitable material, alcohol, ethanol, methanol, propanol, isopropanol, poly(ethylene glycol), glycol, other such materials or a combination thereof.","In some embodiments, the equipment assembly comprises one or more, two or more, three or more, four or more or plural liquid reservoirs.","The liquid can be colored or non-colored.","The liquid can comprise pigment, paint, dye, tint, ink or a combination thereof.","The liquid can comprise one or more solutes dissolved therein.","The powder and/or liquid can comprise one or more binders.","The exemplary embodiments herein should not be considered exhaustive, but merely illustrative of only a few of the many embodiments contemplated by the present invention.","As used herein, the term “about” is taken to mean a value that is within ±10%, ±5% or ±1% of the indicated value.","The entire disclosures of all documents cited herein are hereby incorporated by reference in their entirety.","Example 1 The following materials and procedure are used to prepare three-dimensionally printed dosage forms that dissolve rapidly in saliva.","A powder comprising at least one pharmaceutical carrier is loaded into the powder reservoir.","A fluid comprising a liquid and at least one active ingredient is loaded into the fluid reservoir.","The equipment assembly is operated, whereby plural stacked incremental layers of printed powder are sequentially formed in build modules by repeatedly passing the build modules through one or more build stations.","Typically four to fifty incremental printed powder layers are formed and adhere to each other thereby forming a printed bed having one or more articles surrounded by or embedded in loose powder.","The printed beds are dried in a dryer.","The printed articles are separated from the loose powder with a harvester.","The printed articles are then optionally dedusted with a deduster.","The printed articles are then optionally packaged.","The above is a detailed description of particular embodiments of the invention.","It will be appreciated that, although specific embodiments of the invention have been described herein for purposes of illustration, various modifications may be made without departing from the spirit and scope of the invention.","Accordingly, the invention is not limited except as by the appended claims.","All of the embodiments disclosed and claimed herein can be made and executed without undue experimentation in light of the present disclosure."]],"string":"[\n [\n \"Three-dimensional Printing System and Equipment Assembly\",\n \"A three-dimensional printing system and equipment assembly for the manufacture of three-dimensionally printed articles is provided.\",\n \"The equipment assembly includes a three-dimensional printing build system, an optional liquid removal system and an optional harvester system.\",\n \"The build system includes a conveyor, plural build modules and at least one build station having a powder-layering system and a printing system.\",\n \"The equipment assembly can be used to manufacture pharmaceutical, medical, and non-pharmaceutical/non-medical objects.\",\n \"It can be used to prepare single or multiple articles.\"\n ],\n [\n \"1-134.\",\n \"(canceled) 135) A three-dimensional printing equipment assembly comprising: a circuitous or oscillating conveyor system; plural build modules comprising respective height adjustable platforms; at least one build station that forms respective one or more three-dimensionally printed articles on the plural build modules; a bed transfer system that transfers the one or more three-dimensionally printed articles away from the conveyor system; a control system that determines and specifies the location of one or more of the plural build modules relative to the conveyor system; wherein the conveyor system repeatedly conducts the plural build modules through the at least one build station.\",\n \"136) The equipment assembly of claim 135 further comprising one or more build module positioning systems, one or more conveyor positioning systems or both.\",\n \"137) The equipment assembly of claim 136, wherein the control system comprises a proximity sensor that specifies the location of one or more of the plural build modules relative to the conveyor system.\",\n \"138) The equipment assembly of claim 137 further comprising a component that considers at least the linear speed of the conveyor or of the plural build modules when forming the respective one or more three-dimensionally printed articles.\",\n \"139) The equipment assembly of claim 138 further comprising a control system that determines the location of respective ones of the plural build modules.\",\n \"140) The equipment assembly of claim 139 further comprising a synchronizer that facilitates synchronization of operation of various components of the equipment assembly.\",\n \"141) The equipment assembly of claim 135, wherein the control system comprises a proximity sensor that specifies the location of one or more of the plural build modules relative to the conveyor system.\",\n \"142) The equipment assembly of claim 135 further comprising a component that considers at least the linear speed of the conveyor or of the plural build modules when forming the respective one or more three-dimensionally printed articles.\",\n \"143) The equipment assembly of claim 135 further comprising a control system that determines the location of respective ones of the plural build modules.\",\n \"144) The equipment assembly of claim 135 further comprising a synchronizer that facilitates synchronization of operation of various components of the equipment assembly.\",\n \"145) The equipment assembly of claim 135 further comprising at least one of the following: a) at least one harvesting system; b) at least one liquid removal system; c) at least one packaging system; d) at least one powder recovery system for recovering, and optionally recycling, unprinted powder; e) at least one liquid detector; f) at least one inspection system; g) at least one dedusting system; or h) at least one build plate loading system.\",\n \"146) A method for the preparation of three-dimensionally printed articles, the method comprising: with a conveyor system, repeatedly conveying plural build modules through at least one build station to form from build material respective one or more three-dimensionally printed articles in respective ones of the plural build modules; considering at least the linear speed of the conveyor system or of the plural build modules when forming the respective one or more three-dimensionally printed articles; determining the location of respective ones of the plural build modules and/or specifying the location of respective ones of the plural build modules relative to the conveyor system when forming the respective one or more three-dimensionally printed articles; transferring the one or more three-dimensionally printed articles away from the conveyor system; wherein: the plural build modules comprise respective height adjustable platforms; and the conveyor is a circuitous or reciprocating conveyor.\",\n \"147) The method of claim 146 further comprising forming plural three-dimensionally printed incremental layers during formation of respective ones of the one or more three-dimensionally printed articles.\",\n \"148) The method of claim 147, wherein the build material is powder material, and the step of forming plural three-dimensionally printed incremental layers comprises forming respective plural powder layers and binding particles of the plural powder layers according to one or more predetermined patterns.\",\n \"149) The method of claim 148 further comprising charging powder onto respective ones of the plural build modules at a feed rate that takes into consideration the linear speed of the conveyor or the plural build modules.\",\n \"150) The method of claim 149 further comprising creating print instructions specifying or considering one or more patterns to be printed on respective ones of the powder layers.\",\n \"151) The method of claim 150, wherein the print instructions specify or consider at least the linear speed of respective ones of the plural build modules.\",\n \"152) The method of claim 151, wherein the print instructions further specify or consider the intended print density of the one or more patterns to be printed.\",\n \"153) The method of claim 150, wherein the print instructions further specify or consider the intended print density of the one or more patterns to be printed.\",\n \"154) The method of claim 148 further comprising creating print instructions specifying or considering one or more patterns to be printed on respective ones of the powder layers.\",\n \"155) The method of claim 146 further comprising at least one of the following steps: a) harvesting the one or more three-dimensionally printed articles; b) removing liquid from the one or more three-dimensionally printed articles; c) dedusting the one or more three-dimensionally printed articles; d) packaging the one or more three-dimensionally printed articles; e) recovering loose build material; f) detecting the presence, amount or concentration of liquid present in the one or more three-dimensionally printed articles; g) inspecting the one or more three-dimensionally printed articles; h) controlling one or more components of the equipment assembly with a control system comprising one or more computerized controllers, one or more computers, and one or more user interfaces for the one or more computers; i) providing printing instructions; j) providing one or more two-dimensional image files comprising pixels; k) forming plural stacked three-dimensionally printed incremental layers to form the one or more three-dimensionally printed articles; l) transferring surplus build material from one of said plural build modules to an adjacent one of said plural build modules; or m) creating print instructions specifying or considering one or more patterns to be printed.\"\n ],\n [\n \" BACKGROUND OF THE INVENTION Rapid prototyping describes various techniques for fabricating a three-dimensional prototype of an object from a computer model of the object.\",\n \"One technique is three-dimensional printing, whereby a printer is used to fabricate the 3-D prototype from a plurality of two-dimensional layers.\",\n \"In particular, a digital representation of a 3-D object is stored in a computer memory.\",\n \"Computer software sections the representation of the object into a plurality of distinct 2-D layers.\",\n \"Alternatively, a stream (sequential series) of instructions for each incremental layer maybe entered directly, e.g.\",\n \"a series of images.\",\n \"A 3-D printer then fabricates a thin layer of bound material for each 2-D image layer sectioned by the software.\",\n \"Together, the layers are printed one on top of the other and adhere to each other to form the desired prototype.\",\n \"Three-dimensional powder-liquid printing technology has been used to prepare articles such as pharmaceutical dosage forms, mechanical prototypes and concept models, molds for casting mechanical parts, bone growth promoting implants, electronic circuit boards, scaffolds for tissue engineering, responsive biomedical composites, tissue growth promoting implants, dental restorations, jewelry, fluid filters and other such articles.\",\n \"Three-dimensional printing is a solid freeform fabrication technique/rapid-prototyping technique in which thin layers of powder are spread onto a surface and selected regions of the powder are bound together by the controlled deposition (“printing”) of a fluid.\",\n \"This basic operation is repeated layer-by-layer, with each new layer formed on top of and adhered to the previously printed layer, to eventually make three-dimensional objects within a bed of unbound powder.\",\n \"When the printed objects have sufficient cohesion, they may be separated from the unbound powder.\",\n \"Systems and equipment assemblies for three-dimensional printing of articles are commercially available or in use by others: Massachusetts Institute of Technology Three-Dimensional Printing Laboratory (Cambridge, Mass.\",\n \"), Z Corporation's 3DP and HD3DP™ systems (Burlington, Mass.\",\n \"), The Ex One Company, L.L.C.\",\n \"(Irwin, Pa.), Soligen (Northridge, Calif.), Specific Surface Corporation (Franklin, Mass.\",\n \"), TDK Corporation (Chiba-ken, Japan), Therics L.L.C.\",\n \"(Akron, Ohio, now a part of Integra Lifesciences), Phoenix Analysis & Design Technologies (Tempe, Ariz.), Stratasys, Inc.'s Dimension™ system (Eden Prairie, Minn.), Objet Geometries (Billerica, Mass.\",\n \"or Rehovot, Israel), Xpress3D (Minneapolis, Minn.), and 3D Systems' Invision™ system (Valencia, Calif.).\",\n \"Some systems have been described in the patent literature: U.S. Publications No.\",\n \"20080281019, No.\",\n \"20080277823, No.\",\n \"20080275181, No.\",\n \"20080269940, No.\",\n \"20080269939, No.\",\n \"20080259434, No.\",\n \"20080241404, No.\",\n \"20080231645, No.\",\n \"20080229961, No.\",\n \"20080211132, No.\",\n \"20080192074, No.\",\n \"20080187711, No.\",\n \"20080180509, No.\",\n \"20080138515, No.\",\n \"20080124464, No.\",\n \"20080121172, No.\",\n \"20080121130, No.\",\n \"20080118655, No.\",\n \"20080110395, No.\",\n \"20080105144, No.\",\n \"20080068416, No.\",\n 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\"6,945,638, U.S. Pat.\",\n \"No.\",\n \"6,989,115, U.S. Pat.\",\n \"No.\",\n \"7,220,380, U.S. Pat.\",\n \"No.\",\n \"7,291,002 U.S. Pat.\",\n \"No.\",\n \"7,365,129, U.S. Pat.\",\n \"No.\",\n \"7,435,368, U.S. Pat.\",\n \"No.\",\n \"7,455,804, U.S. Pat.\",\n \"No.\",\n \"7,686,955, U.S. Pat.\",\n \"No.\",\n \"7,828,022, U.S. Pat.\",\n \"No.\",\n \"8,017,055; PCT International Publications No.\",\n \"WO 00/26026, No.\",\n \"WO 98/043762, No.\",\n \"WO 95/034468, No.\",\n \"WO 95/011007; and European Patent No.\",\n \"1,631,440, which employs a cylindrical (radial or polar) coordinate-based system due to its construction.\",\n \"Three-dimensional printing systems that employ radial or polar coordinate-based printing systems are disadvantageous because having each jetting position located at a different radial position requires that the surface speed of the substrate underneath each jetting position will vary.\",\n \"The surface speed will be greatest for the jetting position furthest from the center of rotation.\",\n \"This can be compensated for by normalizing the print density across all jetting positions by either adjusting the input images or possibly the drive frequency.\",\n \"However, these methods of compensation simply cause objects printed radially to emulate each other as opposed to true replicates.\",\n \"The angle of entry of the droplets into the powder bed will also vary with radial position again creating subtle differences in the objects printed at different locations.\",\n \"Alignment and interleaving of multiple print heads is another disadvantage to radially printing.\",\n \"Although feasible it is more complex than for Cartesian systems.\"\n ],\n [\n \" SUMMARY OF THE INVENTION The present invention provides a manufacturing system and equipment assembly useful for the preparation of articles by three-dimensional printing.\",\n \"The system and assembly can be used for high through-put continuous, semi-continuous, or batch manufacture with minimal product loss, high efficiency, and high product reproducibility in the context of flexible article design.\",\n \"The invention provides a three-dimensional printing equipment assembly comprising: a) a three-dimensional printing build system comprising: a conveyor system adapted to conduct plural build modules; plural build modules engaged with the conveyor system, wherein the build modules are adapted to receive and temporarily retain powder from a powder layering system; and at least one build station comprising: 1) at least one powder layering system adapted to form incremental powder layers within build modules; and 2) at least one printing system adapted to apply a liquid according to a predetermined pattern to incremental powder layers within build modules; wherein the conveyor system repeatedly transports the build modules from the at least one powder layering system to the at least one printing system to form a three-dimensionally printed bed comprising one or more three-dimensionally printed articles in the build modules.\",\n \"In some embodiments, the three-dimensional printing equipment assembly further comprises at least one liquid removal system adapted to receive one or more three-dimensionally printed beds and to remove liquid from one or more powder layers onto which the liquid has been applied and/or from the three-dimensionally printed bed.\",\n \"In some embodiments, a build module comprises an incrementally height adjustable platform adapted to receive and temporarily retain at least one incremental layer or plural stacked incremental layers of powder.\",\n \"In some embodiments, a build module comprises a body comprising an upper surface with a cavity, a height adjustable build platform disposed within the cavity, height adjuster engaged with the body and the platform, and engagement means.\",\n \"In some embodiments, plural build modules are removably engaged with the conveyor system.\",\n \"In some embodiments, the platform is adapted to lower (recess) and/or raise by one or more increments after placement of an incremental layer of powder thereon.\",\n \"The platform displacement can occur prior to or after placement of a subsequent incremental layer of powder thereon, thereby press-rolling or removing a portion of powder from a powder layer that has already been laid down.\",\n \"In some embodiments, the size of an increment is predetermined.\",\n \"In some embodiments, the build module comprises one or more sidewalls surrounding the build plate and being adapted to retain powder on the height adjustable platform.\",\n \"In some embodiments, the build module further comprises a removable build plate disposed below the upper surface of the build module.\",\n \"In some embodiments, the removable build plate is disposed above the height adjustable platform and is adapted to receive and support one or more incremental layers of powder.\",\n \"In some embodiments, the removable build plate is flat, porous, perforated, textured, coated, knurled, smooth or a combination thereof.\",\n \"In some embodiments, engagement means are adapted to removably engage a build module with the conveyor system.\",\n \"In some embodiments, the conveyor system conducts the plural build modules along a planar circuitous path, a horizontal circuitous path, a vertical circuitous path, or a combination thereof.\",\n \"In some embodiments, the conveyor system is adapted to transport plural build modules along a path in a counterclockwise direction or clockwise direction.\",\n \"In some embodiments, the path of the modular conveyor system is circular, ellipsoidal, rectangular, semicircular, square, triangular, pentagonal, hexagonal, octagon, oval, polygonal, parallelogram, quadrilateral, geometric, symmetrical, asymmetrical, or equivalents thereof with rounded corners and/or edges.\",\n \"In some embodiments, the modular conveyor system comprises plural conveyor modules, at least one drive motor, at least one positioning controller, and a path along which plural build modules are conducted.\",\n \"In some embodiments, a conveyor module comprises a body, one or more build module engagement means, and conveyor module engagement means by way of which plural conveyor modules are adapted to engage to form a modular conveyor.\",\n \"In some embodiments, the conveyor system comprises plural attachments adapted to removably retain the plural build modules.\",\n \"In some embodiments, the attachment comprises plural one or more metal links with cam followers or comprises wheels, plates and/or bearings attached to a build module and mounted on a rail system upon which the build module is conducted.\",\n \"In some embodiments, the conveyor system further comprises one or more positioning-controllers.\",\n \"In some embodiments, the conveyor system is a continuous or discontinuous loop system.\",\n \"In some embodiments, the at least one build station is incrementally height adjustable with respect to the build modules, whereby the vertical space between the build module and the build station can be adjusted by one or more increments.\",\n \"In some embodiments, an incrementally height adjustable build station is adapted to raise by one or more increments after placement of a layer of powder on a build module and prior to placement of a subsequent layer of powder the build module.\",\n \"In some embodiments, a change in height is achieved by changing vertical position with respect to a prior position of the platform or with respect to an absolute position of the platform relative to the build module.\",\n \"In some embodiments, the build station is vertically fixed with respect to the build modules and a build platform within a build module is vertically height adjustable with respect to the build module so that the vertical distance between the build station and the build module remains the same during a print lap or print cycle.\",\n \"In some embodiments, the size of the increment is the same for each incremental layer of a build cycle, is different for one or more incremental layers of a build cycle or a combination thereof.\",\n \"A build cycle comprises one or more build laps or plural build laps and is defined as the sum total of build laps required to form a 3DP article.\",\n \"A build lap is defined as the process of forming a printed incremental layer, i.e.\",\n \"placing an incremental layer of powdered build material and depositing (printing) liquid upon it.\",\n \"Accordingly, a build cycle results in the formation of plural stacked printed incremental layers that adhere to one another to together form a three-dimensionally printed article.\",\n \"In some embodiments, the at least one powder layering system comprises at least one powder fill head.\",\n \"In some the embodiments, the powder fill head is stationary, meaning it does not move, either longitudinally or transversely with respect to the plane of the upper surface of a build module, when applying an incremental layer of powder onto the build module.\",\n \"In some embodiments, a powder fill head comprises at least one powder fill head body, at least one powder spreader, and at least one powder-height controller.\",\n \"In some embodiments, a powder layering system comprises a powder fill head, at least one powder reservoir and a powder feeder tube adapted to transfer powder from the powder reservoir to the powder fill head.\",\n \"In some embodiments, the powder spreader is a cylindrical roller the axis of which has or defines a radial direction of motion opposite the linear direction of motion of a build module through the powder layering system.\",\n \"In some embodiments, the powder spreader is a cylindrical roller, bar, rod, plate or straight smooth edge.\",\n \"In some embodiments, the powder fill head comprises a hopper or chute.\",\n \"In some embodiments, the at least one printing system is adapted to apply (deposit) liquid to the powder according to a Cartesian coordinate algorithm instead of a polar (radial) coordinate algorithm (cylindrical coordinate system, circular coordinate system, or spherical coordinate system).\",\n \"In some embodiments, the printing system comprises at least one print head adapted to deposit liquid onto an incremental layer of powder in a build station and at least one liquid feed system.\",\n \"A print head can comprise one or more print modules or plural print modules.\",\n \"In some embodiments, the invention excludes a printing system adapted to apply liquid to the powder solely according to a polar (radial) coordinate system.\",\n \"In some embodiments, the invention excludes an equipment assembly or a method wherein the powder fill head moves laterally or transversely or is not stationary, with respect to a build module, while depositing an incremental powder layer.\",\n \"In some embodiments, the invention excludes an equipment assembly or a method wherein the print head moves laterally or transversely or is not stationary, with respect to a build module, while applying liquid to an incremental powder layer.\",\n \"In some embodiments, the at least one printing system is adapted to apply (deposit) liquid as a three-dimensional pattern of droplets or as plural two-dimensional patterns of droplets defining one or more articles.\",\n \"In some embodiments, the pattern comprises droplets placed at equal spacing within one or more articles.\",\n \"In some embodiments, this pattern comprises droplets placed at unequal spacing within one or more articles.\",\n \"In some embodiments, this pattern comprises droplets with different spacing within different regions of an article.\",\n \"In some embodiments, this pattern comprises droplets with tighter spacing (i.e., higher print density) in a region defining the exterior of an article.\",\n \"In some embodiments, this pattern comprises droplets with looser spacing (i.e., lower print density) in a region interior to an article.\",\n \"In some embodiments, more than one pattern is used.\",\n \"In some embodiments, more than one liquid is used.\",\n \"In some embodiments, the liquid comprises a pure solvent, blend of solvents, solution, suspension, colloid, emulsion, melt or a combination thereof.\",\n \"In some embodiments, both the print head and the powder fill head are stationary during formation of a printed incremental layer or are stationary as otherwise described herein.\",\n \"In some embodiments, the equipment assembly further comprises a bed transfer system adapted to transfer three-dimensionally printed beds, one or more at a time, away from the three-dimensional printing build system.\",\n \"In some embodiments, the bed transfer system is adapted to transfer three-dimensionally printed beds to one or more liquid removal systems and/or one or more harvesting systems.\",\n \"In some embodiments, the transfer system is integrated with the conveyor system, the liquid removal system or both.\",\n \"In some embodiments, the liquid removal system comprises at least one dryer.\",\n \"In some embodiments, the liquid removal system is adapted to process two or more build plates and their contents at a time.\",\n \"In some embodiments, the liquid removal system is adapted to process two or more printed beds at a time.\",\n \"In some embodiments, the liquid removal system is adapted to process two or more printed articles at a time.\",\n \"In some embodiments, the three-dimensionally printed powder bed comprises loose (unbound) powder and one or more three-dimensionally printed articles prior to harvesting of the printed article(s) from the loose powder.\",\n \"In some embodiments, the equipment assembly comprises one or more harvesting systems adapted to separate loose powder from the one or more three-dimensionally printed articles.\",\n \"In some embodiments, the harvesting system processes printed beds already processed by the liquid removal system.\",\n \"In some embodiments, the harvesting system comprises loose powder collector and three-dimensionally printed article collector.\",\n \"In some embodiments, the harvesting system comprises a vibrating or orbiting surface adapted to receive the three-dimensionally printed powder bed or the three-dimensionally printed articles.\",\n \"In some embodiments, the harvesting system comprises a vacuum conveyor with a screen to separate articles from loose powder.\",\n \"The vibrating surface can be perforated, non-perforated, corrugated, smooth or non-smooth to permit separation of loose powder from the printed articles.\",\n \"In some embodiments, the equipment assembly further comprises a dedusting system adapted to remove loose particles from printed articles that have been harvested from a printed powder bed.\",\n \"A dedusting system can comprise a housing defining a dedusting region, one or more air jets, e.g.\",\n \"one or more air knives, that direct pressurized air into the dedusting region, one or more surfaces or retainers in the dedusting region for temporarily retaining one or more printed articles being dedusted, and one or more outlets through which air and removed particles exit the housing or dedusting region.\",\n \"In some embodiments, the equipment assembly further comprises a build plate loading system adapted to place one or more build plates on the height adjustable platform(s) of the one or more build modules.\",\n \"In some embodiments, the equipment assembly further comprises one or more powder recovery systems adapted to collect powder from the one or more systems of the equipment assembly and return it to a powder reservoir.\",\n \"The recovery system can comprise one or more loose powder collectors and one or more conduits for conducting loose powder from the one or more collectors to a powder reservoir.\",\n \"The recovery system can further comprise: a) one or more powder mixers for mixing recovered loose powder with virgin loose powder; b) one or more pressurized air powder handling systems that facilitate transfer of loose powder from one location to another; c) one or more vacuum powder handling systems that facilitate transfer of loose powder from one location to another; d) one or more mechanical powder handling systems that transfer loose powder from one location to another; e) one or more manual powder handling systems that transfer loose powder from one location to another; or f) a combination thereof.\",\n \"In some embodiments, the equipment assembly further comprises a control system comprising one or more computerized controllers, one or more computers, and one or more user interfaces for one or more computers.\",\n \"In some embodiments, one or more components of the equipment assembly are computer controlled.\",\n \"In some embodiments, one or more components of the three-dimensional printing build system are computer controlled.\",\n \"In some embodiments, the conveyor system, the height adjustable platforms of the build modules, the at least one powder layering system and the at least one printing system are computer controlled.\",\n \"In some embodiments, the equipment assembly is adapted to spread layers of powder and deposit (print) droplets of liquid in a predetermined pattern on to the layers according to instructions provided by a computerized controller.\",\n \"In some embodiments, the predetermined pattern is based on one or more two-dimensional image files comprising pixels.\",\n \"In some embodiments, the two-dimensional image files are structured such that certain pixels indicate dispensing of droplets, and other pixels represent no dispensing of droplets.\",\n \"In some embodiments, the two-dimensional image files include different colors of pixels to indicate dispensing of different liquids, or no dispensing of liquid.\",\n \"In some embodiments, the predetermined pattern for applying the liquid is the same in each incremental layer, is the same in two or more incremental layers, is different in one or more incremental layers, is different in all incremental layers, or is the same for a first group of incremental layer and the same for a second group of incremental layers but the pattern for the first group is different than the pattern for the second group.\",\n \"In some embodiments, the equipment assembly further comprises one or more working surfaces, tables, gantries, enclosures, and/or platforms.\",\n \"The invention also provides a three-dimensional printing equipment assembly comprising: a) a three-dimensional printing build system comprising: a conveyor system adapted to conduct plural build modules and comprising positioning-controller and plural build module engagements; plural build modules engaged with the conveyor system, wherein the build modules are adapted to receive and temporarily retain powder from a powder layering system, and wherein a build module comprises an incrementally height adjustable platform, an optional build plate disposed above the platform, and one or more sidewalls defining a cavity within which the platform the optional build plate can be disposed; at least one build station comprising: 1) at least one powder layering system adapted to form incremental powder layers within the cavity of build modules and comprising at least one powder fill head, at least one powder spreader and at least one powder reservoir; and 2) at least one printing system adapted to apply a liquid according to a predetermined pattern to incremental powder layers within build modules and comprising at least one liquid feed system and at least one print head adapted to deposit liquid according to a predetermined pattern onto incremental layers of powder in a build module; wherein the conveyor system is adapted to repeatedly transport the plural build modules from the at least one powder layering system to the at least one printing system, whereby the three-dimensional printing build system forms a three-dimensionally printed bed comprising one or more three-dimensionally printed articles, and optionally loose (unbound or only partially bound) powder that has not been printed upon; b) at least one harvesting system adapted to separate loose powder from one or more three-dimensionally printed articles in a three-dimensionally printed bed; and c) optionally, at least one liquid removal system adapted to remove liquid from one or more incremental powder layers onto which the liquid has been applied and/or from the three-dimensionally printed bed, wherein the liquid removal system is adapted to process two or more build modules at a time.\",\n \"Some embodiments of the invention include those wherein: 1) at least one liquid removal system is present; 2) the equipment assembly further comprises at least one packaging system adapted to package one or more three-dimensionally printed articles; 3) the conveyor system is adapted to repeatedly transport the plural build modules, from the at least one powder layering system to the at least one printing system, in a linear manner, and not a radial manner, thereby facilitating Cartesian coordinate printing and not radial (polar coordinate) printing; 4) the equipment assembly further comprises a powder recovery system for recovering, and optionally recycling, unprinted powder; 5) the equipment assembly further comprises a liquid detector; 6) a liquid detector detects the presence of liquid in one or more printed incremental layers and/or in one or more printed articles; 7) the equipment assembly further comprises an inspection system; 8) an inspection system is a printed powder inspection system that determines the integrity of printing in one or more printed incremental layers and/or one or more printed articles and/or determines whether or not powder was properly applied in one or more incremental layers; 9) determining the integrity of printing comprises at least one of determining whether or not liquid has been correctly applied to one or more incremental layers according to one or more predetermined patterns and/or determining whether or not liquid has been correctly applied to one or more incremental layers according to a predetermined amount; 10) the inspection system is a printed article inspection system that determines whether or not one or more printed articles have the correct size, shape, weight, appearance, density, content and/or color; 11) the inspection system is a liquid application inspection system that monitors droplets of liquid applied by the print head to powder; 12) the inspection system comprises one or more cameras; and/or 13) a camera is independently selected at each occurrence from the group consisting of a visible wavelength camera, an UV wavelength camera, a near infrared wavelength camera, an x-ray camera and an infrared wavelength camera.\",\n \"The invention includes all combinations of the embodiments, subembodiments and aspects disclosed herein.\",\n \"Accordingly, the invention includes the embodiments and aspects specifically disclosed, broadly disclosed, or narrowly disclosed herein, as well as combinations thereof and subcombinations of the individual elements of said embodiments and aspects.\",\n \"Other features, advantages and embodiments of the invention will become apparent to those skilled in the art by the following description, accompanying examples.\"\n ],\n [\n \"CROSS-REFERENCE TO EARLIER FILED APPLICATIONS This application is a continuation of and claims the benefit of U.S. Ser.\",\n \"No.\",\n \"15/422,969 filed Feb. 2, 2017, which is a continuation of U.S. Ser.\",\n \"No.\",\n \"15/077,112 filed Mar.\",\n \"22, 2016, now U.S. Pat.\",\n \"No.\",\n \"9,517,592, issued Dec. 13, 2016, which is a continuation of U.S. Ser.\",\n \"No.\",\n \"15/046,714 filed Feb. 18, 2016, now U.S. Pat.\",\n \"No.\",\n \"9,517,591, issued Dec. 13, 2016, which is a continuation of U.S. Ser.\",\n \"No.\",\n \"14/501,716 filed Sep. 30, 2014, now U.S. Pat.\",\n \"No.\",\n \"9,610,735 issued Apr.\",\n \"4, 2017, which is a continuation of U.S. Ser.\",\n \"No.\",\n \"14/016,697, filed Sep. 3, 2013, now U.S. Pat.\",\n \"No.\",\n \"8,888,480, issued Nov. 18, 2014, which is a continuation of and claims the benefit of PCT/US2013/057466 filed Aug. 30, 2013, which claims the benefit of provisional application 61/696,839 filed Sep. 5, 2012, and the application U.S. Ser.\",\n \"No.\",\n \"15/422,969 is a continuation of U.S. Ser.\",\n \"No.\",\n \"14/501,716 filed Sep. 30, 2014, now U.S. Pat.\",\n \"No.\",\n \"9,610,735 issued Apr.\",\n \"4, 2017, the entire disclosures of which are hereby incorporated by reference.\",\n \"FIELD OF THE INVENTION The present invention concerns a manufacturing system and equipment assembly and use thereof for the preparation three-dimensional printing of articles from one or more powders and one or more liquids applied to the powder.\",\n \"BACKGROUND OF THE INVENTION Rapid prototyping describes various techniques for fabricating a three-dimensional prototype of an object from a computer model of the object.\",\n \"One technique is three-dimensional printing, whereby a printer is used to fabricate the 3-D prototype from a plurality of two-dimensional layers.\",\n \"In particular, a digital representation of a 3-D object is stored in a computer memory.\",\n \"Computer software sections the representation of the object into a plurality of distinct 2-D layers.\",\n \"Alternatively, a stream (sequential series) of instructions for each incremental layer maybe entered directly, e.g.\",\n \"a series of images.\",\n \"A 3-D printer then fabricates a thin layer of bound material for each 2-D image layer sectioned by the software.\",\n \"Together, the layers are printed one on top of the other and adhere to each other to form the desired prototype.\",\n \"Three-dimensional powder-liquid printing technology has been used to prepare articles such as pharmaceutical dosage forms, mechanical prototypes and concept models, molds for casting mechanical parts, bone growth promoting implants, electronic circuit boards, scaffolds for tissue engineering, responsive biomedical composites, tissue growth promoting implants, dental restorations, jewelry, fluid filters and other such articles.\",\n \"Three-dimensional printing is a solid freeform fabrication technique/rapid-prototyping technique in which thin layers of powder are spread onto a surface and selected regions of the powder are bound together by the controlled deposition (“printing”) of a fluid.\",\n \"This basic operation is repeated layer-by-layer, with each new layer formed on top of and adhered to the previously printed layer, to eventually make three-dimensional objects within a bed of unbound powder.\",\n \"When the printed objects have sufficient cohesion, they may be separated from the unbound powder.\",\n \"Systems and equipment assemblies for three-dimensional printing of articles are commercially available or in use by others: Massachusetts Institute of Technology Three-Dimensional Printing Laboratory (Cambridge, Mass.\",\n \"), Z Corporation's 3DP and HD3DP™ systems (Burlington, Mass.\",\n \"), The Ex One Company, L.L.C.\",\n \"(Irwin, Pa.), Soligen (Northridge, Calif.), Specific Surface Corporation (Franklin, Mass.\",\n \"), TDK Corporation (Chiba-ken, Japan), Therics L.L.C.\",\n \"(Akron, Ohio, now a part of Integra Lifesciences), Phoenix Analysis & Design Technologies (Tempe, Ariz.), Stratasys, Inc.'s Dimension™ system (Eden Prairie, Minn.), Objet Geometries (Billerica, Mass.\",\n \"or Rehovot, Israel), Xpress3D (Minneapolis, Minn.), and 3D Systems' Invision™ system (Valencia, Calif.).\",\n \"Some systems have been described in the patent literature: U.S. Publications No.\",\n \"20080281019, No.\",\n \"20080277823, No.\",\n \"20080275181, No.\",\n \"20080269940, No.\",\n \"20080269939, No.\",\n \"20080259434, No.\",\n \"20080241404, No.\",\n \"20080231645, No.\",\n \"20080229961, No.\",\n \"20080211132, No.\",\n 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disadvantageous because having each jetting position located at a different radial position requires that the surface speed of the substrate underneath each jetting position will vary.\",\n \"The surface speed will be greatest for the jetting position furthest from the center of rotation.\",\n \"This can be compensated for by normalizing the print density across all jetting positions by either adjusting the input images or possibly the drive frequency.\",\n \"However, these methods of compensation simply cause objects printed radially to emulate each other as opposed to true replicates.\",\n \"The angle of entry of the droplets into the powder bed will also vary with radial position again creating subtle differences in the objects printed at different locations.\",\n \"Alignment and interleaving of multiple print heads is another disadvantage to radially printing.\",\n \"Although feasible it is more complex than for Cartesian systems.\",\n \"SUMMARY OF THE INVENTION The present invention provides a manufacturing system and equipment assembly useful for the preparation of articles by three-dimensional printing.\",\n \"The system and assembly can be used for high through-put continuous, semi-continuous, or batch manufacture with minimal product loss, high efficiency, and high product reproducibility in the context of flexible article design.\",\n \"The invention provides a three-dimensional printing equipment assembly comprising: a) a three-dimensional printing build system comprising: a conveyor system adapted to conduct plural build modules; plural build modules engaged with the conveyor system, wherein the build modules are adapted to receive and temporarily retain powder from a powder layering system; and at least one build station comprising: 1) at least one powder layering system adapted to form incremental powder layers within build modules; and 2) at least one printing system adapted to apply a liquid according to a predetermined pattern to incremental powder layers within build modules; wherein the conveyor system repeatedly transports the build modules from the at least one powder layering system to the at least one printing system to form a three-dimensionally printed bed comprising one or more three-dimensionally printed articles in the build modules.\",\n \"In some embodiments, the three-dimensional printing equipment assembly further comprises at least one liquid removal system adapted to receive one or more three-dimensionally printed beds and to remove liquid from one or more powder layers onto which the liquid has been applied and/or from the three-dimensionally printed bed.\",\n \"In some embodiments, a build module comprises an incrementally height adjustable platform adapted to receive and temporarily retain at least one incremental layer or plural stacked incremental layers of powder.\",\n \"In some embodiments, a build module comprises a body comprising an upper surface with a cavity, a height adjustable build platform disposed within the cavity, height adjuster engaged with the body and the platform, and engagement means.\",\n \"In some embodiments, plural build modules are removably engaged with the conveyor system.\",\n \"In some embodiments, the platform is adapted to lower (recess) and/or raise by one or more increments after placement of an incremental layer of powder thereon.\",\n \"The platform displacement can occur prior to or after placement of a subsequent incremental layer of powder thereon, thereby press-rolling or removing a portion of powder from a powder layer that has already been laid down.\",\n \"In some embodiments, the size of an increment is predetermined.\",\n \"In some embodiments, the build module comprises one or more sidewalls surrounding the build plate and being adapted to retain powder on the height adjustable platform.\",\n \"In some embodiments, the build module further comprises a removable build plate disposed below the upper surface of the build module.\",\n \"In some embodiments, the removable build plate is disposed above the height adjustable platform and is adapted to receive and support one or more incremental layers of powder.\",\n \"In some embodiments, the removable build plate is flat, porous, perforated, textured, coated, knurled, smooth or a combination thereof.\",\n \"In some embodiments, engagement means are adapted to removably engage a build module with the conveyor system.\",\n \"In some embodiments, the conveyor system conducts the plural build modules along a planar circuitous path, a horizontal circuitous path, a vertical circuitous path, or a combination thereof.\",\n \"In some embodiments, the conveyor system is adapted to transport plural build modules along a path in a counterclockwise direction or clockwise direction.\",\n \"In some embodiments, the path of the modular conveyor system is circular, ellipsoidal, rectangular, semicircular, square, triangular, pentagonal, hexagonal, octagon, oval, polygonal, parallelogram, quadrilateral, geometric, symmetrical, asymmetrical, or equivalents thereof with rounded corners and/or edges.\",\n \"In some embodiments, the modular conveyor system comprises plural conveyor modules, at least one drive motor, at least one positioning controller, and a path along which plural build modules are conducted.\",\n \"In some embodiments, a conveyor module comprises a body, one or more build module engagement means, and conveyor module engagement means by way of which plural conveyor modules are adapted to engage to form a modular conveyor.\",\n \"In some embodiments, the conveyor system comprises plural attachments adapted to removably retain the plural build modules.\",\n \"In some embodiments, the attachment comprises plural one or more metal links with cam followers or comprises wheels, plates and/or bearings attached to a build module and mounted on a rail system upon which the build module is conducted.\",\n \"In some embodiments, the conveyor system further comprises one or more positioning-controllers.\",\n \"In some embodiments, the conveyor system is a continuous or discontinuous loop system.\",\n \"In some embodiments, the at least one build station is incrementally height adjustable with respect to the build modules, whereby the vertical space between the build module and the build station can be adjusted by one or more increments.\",\n \"In some embodiments, an incrementally height adjustable build station is adapted to raise by one or more increments after placement of a layer of powder on a build module and prior to placement of a subsequent layer of powder the build module.\",\n \"In some embodiments, a change in height is achieved by changing vertical position with respect to a prior position of the platform or with respect to an absolute position of the platform relative to the build module.\",\n \"In some embodiments, the build station is vertically fixed with respect to the build modules and a build platform within a build module is vertically height adjustable with respect to the build module so that the vertical distance between the build station and the build module remains the same during a print lap or print cycle.\",\n \"In some embodiments, the size of the increment is the same for each incremental layer of a build cycle, is different for one or more incremental layers of a build cycle or a combination thereof.\",\n \"A build cycle comprises one or more build laps or plural build laps and is defined as the sum total of build laps required to form a 3DP article.\",\n \"A build lap is defined as the process of forming a printed incremental layer, i.e.\",\n \"placing an incremental layer of powdered build material and depositing (printing) liquid upon it.\",\n \"Accordingly, a build cycle results in the formation of plural stacked printed incremental layers that adhere to one another to together form a three-dimensionally printed article.\",\n \"In some embodiments, the at least one powder layering system comprises at least one powder fill head.\",\n \"In some the embodiments, the powder fill head is stationary, meaning it does not move, either longitudinally or transversely with respect to the plane of the upper surface of a build module, when applying an incremental layer of powder onto the build module.\",\n \"In some embodiments, a powder fill head comprises at least one powder fill head body, at least one powder spreader, and at least one powder-height controller.\",\n \"In some embodiments, a powder layering system comprises a powder fill head, at least one powder reservoir and a powder feeder tube adapted to transfer powder from the powder reservoir to the powder fill head.\",\n \"In some embodiments, the powder spreader is a cylindrical roller the axis of which has or defines a radial direction of motion opposite the linear direction of motion of a build module through the powder layering system.\",\n \"In some embodiments, the powder spreader is a cylindrical roller, bar, rod, plate or straight smooth edge.\",\n \"In some embodiments, the powder fill head comprises a hopper or chute.\",\n \"In some embodiments, the at least one printing system is adapted to apply (deposit) liquid to the powder according to a Cartesian coordinate algorithm instead of a polar (radial) coordinate algorithm (cylindrical coordinate system, circular coordinate system, or spherical coordinate system).\",\n \"In some embodiments, the printing system comprises at least one print head adapted to deposit liquid onto an incremental layer of powder in a build station and at least one liquid feed system.\",\n \"A print head can comprise one or more print modules or plural print modules.\",\n \"In some embodiments, the invention excludes a printing system adapted to apply liquid to the powder solely according to a polar (radial) coordinate system.\",\n \"In some embodiments, the invention excludes an equipment assembly or a method wherein the powder fill head moves laterally or transversely or is not stationary, with respect to a build module, while depositing an incremental powder layer.\",\n \"In some embodiments, the invention excludes an equipment assembly or a method wherein the print head moves laterally or transversely or is not stationary, with respect to a build module, while applying liquid to an incremental powder layer.\",\n \"In some embodiments, the at least one printing system is adapted to apply (deposit) liquid as a three-dimensional pattern of droplets or as plural two-dimensional patterns of droplets defining one or more articles.\",\n \"In some embodiments, the pattern comprises droplets placed at equal spacing within one or more articles.\",\n \"In some embodiments, this pattern comprises droplets placed at unequal spacing within one or more articles.\",\n \"In some embodiments, this pattern comprises droplets with different spacing within different regions of an article.\",\n \"In some embodiments, this pattern comprises droplets with tighter spacing (i.e., higher print density) in a region defining the exterior of an article.\",\n \"In some embodiments, this pattern comprises droplets with looser spacing (i.e., lower print density) in a region interior to an article.\",\n \"In some embodiments, more than one pattern is used.\",\n \"In some embodiments, more than one liquid is used.\",\n \"In some embodiments, the liquid comprises a pure solvent, blend of solvents, solution, suspension, colloid, emulsion, melt or a combination thereof.\",\n \"In some embodiments, both the print head and the powder fill head are stationary during formation of a printed incremental layer or are stationary as otherwise described herein.\",\n \"In some embodiments, the equipment assembly further comprises a bed transfer system adapted to transfer three-dimensionally printed beds, one or more at a time, away from the three-dimensional printing build system.\",\n \"In some embodiments, the bed transfer system is adapted to transfer three-dimensionally printed beds to one or more liquid removal systems and/or one or more harvesting systems.\",\n \"In some embodiments, the transfer system is integrated with the conveyor system, the liquid removal system or both.\",\n \"In some embodiments, the liquid removal system comprises at least one dryer.\",\n \"In some embodiments, the liquid removal system is adapted to process two or more build plates and their contents at a time.\",\n \"In some embodiments, the liquid removal system is adapted to process two or more printed beds at a time.\",\n \"In some embodiments, the liquid removal system is adapted to process two or more printed articles at a time.\",\n \"In some embodiments, the three-dimensionally printed powder bed comprises loose (unbound) powder and one or more three-dimensionally printed articles prior to harvesting of the printed article(s) from the loose powder.\",\n \"In some embodiments, the equipment assembly comprises one or more harvesting systems adapted to separate loose powder from the one or more three-dimensionally printed articles.\",\n \"In some embodiments, the harvesting system processes printed beds already processed by the liquid removal system.\",\n \"In some embodiments, the harvesting system comprises loose powder collector and three-dimensionally printed article collector.\",\n \"In some embodiments, the harvesting system comprises a vibrating or orbiting surface adapted to receive the three-dimensionally printed powder bed or the three-dimensionally printed articles.\",\n \"In some embodiments, the harvesting system comprises a vacuum conveyor with a screen to separate articles from loose powder.\",\n \"The vibrating surface can be perforated, non-perforated, corrugated, smooth or non-smooth to permit separation of loose powder from the printed articles.\",\n \"In some embodiments, the equipment assembly further comprises a dedusting system adapted to remove loose particles from printed articles that have been harvested from a printed powder bed.\",\n \"A dedusting system can comprise a housing defining a dedusting region, one or more air jets, e.g.\",\n \"one or more air knives, that direct pressurized air into the dedusting region, one or more surfaces or retainers in the dedusting region for temporarily retaining one or more printed articles being dedusted, and one or more outlets through which air and removed particles exit the housing or dedusting region.\",\n \"In some embodiments, the equipment assembly further comprises a build plate loading system adapted to place one or more build plates on the height adjustable platform(s) of the one or more build modules.\",\n \"In some embodiments, the equipment assembly further comprises one or more powder recovery systems adapted to collect powder from the one or more systems of the equipment assembly and return it to a powder reservoir.\",\n \"The recovery system can comprise one or more loose powder collectors and one or more conduits for conducting loose powder from the one or more collectors to a powder reservoir.\",\n \"The recovery system can further comprise: a) one or more powder mixers for mixing recovered loose powder with virgin loose powder; b) one or more pressurized air powder handling systems that facilitate transfer of loose powder from one location to another; c) one or more vacuum powder handling systems that facilitate transfer of loose powder from one location to another; d) one or more mechanical powder handling systems that transfer loose powder from one location to another; e) one or more manual powder handling systems that transfer loose powder from one location to another; or f) a combination thereof.\",\n \"In some embodiments, the equipment assembly further comprises a control system comprising one or more computerized controllers, one or more computers, and one or more user interfaces for one or more computers.\",\n \"In some embodiments, one or more components of the equipment assembly are computer controlled.\",\n \"In some embodiments, one or more components of the three-dimensional printing build system are computer controlled.\",\n \"In some embodiments, the conveyor system, the height adjustable platforms of the build modules, the at least one powder layering system and the at least one printing system are computer controlled.\",\n \"In some embodiments, the equipment assembly is adapted to spread layers of powder and deposit (print) droplets of liquid in a predetermined pattern on to the layers according to instructions provided by a computerized controller.\",\n \"In some embodiments, the predetermined pattern is based on one or more two-dimensional image files comprising pixels.\",\n \"In some embodiments, the two-dimensional image files are structured such that certain pixels indicate dispensing of droplets, and other pixels represent no dispensing of droplets.\",\n \"In some embodiments, the two-dimensional image files include different colors of pixels to indicate dispensing of different liquids, or no dispensing of liquid.\",\n \"In some embodiments, the predetermined pattern for applying the liquid is the same in each incremental layer, is the same in two or more incremental layers, is different in one or more incremental layers, is different in all incremental layers, or is the same for a first group of incremental layer and the same for a second group of incremental layers but the pattern for the first group is different than the pattern for the second group.\",\n \"In some embodiments, the equipment assembly further comprises one or more working surfaces, tables, gantries, enclosures, and/or platforms.\",\n \"The invention also provides a three-dimensional printing equipment assembly comprising: a) a three-dimensional printing build system comprising: a conveyor system adapted to conduct plural build modules and comprising positioning-controller and plural build module engagements; plural build modules engaged with the conveyor system, wherein the build modules are adapted to receive and temporarily retain powder from a powder layering system, and wherein a build module comprises an incrementally height adjustable platform, an optional build plate disposed above the platform, and one or more sidewalls defining a cavity within which the platform the optional build plate can be disposed; at least one build station comprising: 1) at least one powder layering system adapted to form incremental powder layers within the cavity of build modules and comprising at least one powder fill head, at least one powder spreader and at least one powder reservoir; and 2) at least one printing system adapted to apply a liquid according to a predetermined pattern to incremental powder layers within build modules and comprising at least one liquid feed system and at least one print head adapted to deposit liquid according to a predetermined pattern onto incremental layers of powder in a build module; wherein the conveyor system is adapted to repeatedly transport the plural build modules from the at least one powder layering system to the at least one printing system, whereby the three-dimensional printing build system forms a three-dimensionally printed bed comprising one or more three-dimensionally printed articles, and optionally loose (unbound or only partially bound) powder that has not been printed upon; b) at least one harvesting system adapted to separate loose powder from one or more three-dimensionally printed articles in a three-dimensionally printed bed; and c) optionally, at least one liquid removal system adapted to remove liquid from one or more incremental powder layers onto which the liquid has been applied and/or from the three-dimensionally printed bed, wherein the liquid removal system is adapted to process two or more build modules at a time.\",\n \"Some embodiments of the invention include those wherein: 1) at least one liquid removal system is present; 2) the equipment assembly further comprises at least one packaging system adapted to package one or more three-dimensionally printed articles; 3) the conveyor system is adapted to repeatedly transport the plural build modules, from the at least one powder layering system to the at least one printing system, in a linear manner, and not a radial manner, thereby facilitating Cartesian coordinate printing and not radial (polar coordinate) printing; 4) the equipment assembly further comprises a powder recovery system for recovering, and optionally recycling, unprinted powder; 5) the equipment assembly further comprises a liquid detector; 6) a liquid detector detects the presence of liquid in one or more printed incremental layers and/or in one or more printed articles; 7) the equipment assembly further comprises an inspection system; 8) an inspection system is a printed powder inspection system that determines the integrity of printing in one or more printed incremental layers and/or one or more printed articles and/or determines whether or not powder was properly applied in one or more incremental layers; 9) determining the integrity of printing comprises at least one of determining whether or not liquid has been correctly applied to one or more incremental layers according to one or more predetermined patterns and/or determining whether or not liquid has been correctly applied to one or more incremental layers according to a predetermined amount; 10) the inspection system is a printed article inspection system that determines whether or not one or more printed articles have the correct size, shape, weight, appearance, density, content and/or color; 11) the inspection system is a liquid application inspection system that monitors droplets of liquid applied by the print head to powder; 12) the inspection system comprises one or more cameras; and/or 13) a camera is independently selected at each occurrence from the group consisting of a visible wavelength camera, an UV wavelength camera, a near infrared wavelength camera, an x-ray camera and an infrared wavelength camera.\",\n \"The invention includes all combinations of the embodiments, subembodiments and aspects disclosed herein.\",\n \"Accordingly, the invention includes the embodiments and aspects specifically disclosed, broadly disclosed, or narrowly disclosed herein, as well as combinations thereof and subcombinations of the individual elements of said embodiments and aspects.\",\n \"Other features, advantages and embodiments of the invention will become apparent to those skilled in the art by the following description, accompanying examples.\",\n \"BRIEF DESCRIPTION OF THE FIGURES The following figures form part of the present description and describe exemplary embodiments of the claimed invention.\",\n \"These drawings are not necessarily drawn to scale, and are instead intended to illustrate the general principles of the invention as further described herein.\",\n \"Although specific embodiments are described below with specific reference to the drawings provided, other embodiments are possible without deviating from the spirit and scope of the present invention.\",\n \"The skilled artisan will, in light of these figures and the description herein, be able to practice the invention without undue experimentation.\",\n \"FIG.\",\n \"1 depicts a top plan view of an exemplary layout of a three-dimensional printing equipment assembly of the invention.\",\n \"FIG.\",\n \"2A depicts a front elevation view of an exemplary build module of the invention.\",\n \"FIG.\",\n \"2B depicts a partial perspective side view of the build module of FIG.\",\n \"2A.\",\n \"FIG.\",\n \"2C depicts a front elevation view of three segments of a segmented or modular conveyor system.\",\n \"FIG.\",\n \"2D depicts a top plan view of the three segments of FIG.\",\n \"2C.\",\n \"FIG.\",\n \"2E depicts a side elevation view of an optional exemplary aspirator.\",\n \"FIG.\",\n \"3A depicts a top plan view of an exemplary printing system of the invention.\",\n \"FIG.\",\n \"3B depicts a side elevation view of the exemplary printing system of FIG.\",\n \"3A.\",\n \"FIG.\",\n \"3C depicts a front elevation view of the exemplary printing system of FIG.\",\n \"3A.\",\n \"FIG.\",\n \"4 depicts a bottom perspective view of an exemplary layout of print modules in the print head of a printing system.\",\n \"FIG.\",\n \"5 depicts bottom plan views of alternate exemplary layouts for the print modules in different print heads.\",\n \"FIG.\",\n \"6 depicts alternate exemplary shapes of the build plates of the invention.\",\n \"FIG.\",\n \"7A depicts a top plan view of an exemplary build plate loading system of the invention.\",\n \"FIG.\",\n \"7B depicts a side elevation view of the exemplary build plate loading system of FIG.\",\n \"7A.\",\n \"FIG.\",\n \"8A depicts a top plan view of an exemplary powder layering system of the invention.\",\n \"FIG.\",\n \"8B depicts a side elevation view of the exemplary powder layering system of FIG.\",\n \"8A.\",\n \"FIG.\",\n \"8C depicts a front elevation view of the exemplary powder layering system of FIG.\",\n \"8A.\",\n \"FIG.\",\n \"9 depicts a perspective view of an exemplary powder fill head of the invention.\",\n \"FIG.\",\n \"10A depicts a top plan view of an exemplary bed transfer system of the invention.\",\n \"FIG.\",\n \"10B depicts a side elevation view of the exemplary bed transfer system of FIG.\",\n \"10A.\",\n \"FIG.\",\n \"10C depicts a partial top plan view of an alternated exemplary bed transfer system.\",\n \"FIGS.\",\n \"11A-11B depict partial sectional side elevation views of alternate embodiments of exemplary three-dimensional printing processes in a build module of the invention.\",\n \"FIGS.\",\n \"12A-12D depict top plan views of exemplary layouts of a three-dimensional printing build system of the invention.\",\n \"FIG.\",\n \"12E depicts a side elevation view of an exemplary layout of a three-dimensional printing build system of the invention.\",\n \"FIG.\",\n \"13A depicts a partial sectional side elevation view of an exemplary dryer or fluid removal system of the invention.\",\n \"FIG.\",\n \"13B depicts a partial sectional side elevation view of an alternate exemplary dryer or fluid removal system of the invention.\",\n \"FIG.\",\n \"14 depicts a side elevation view of an exemplary harvesting system of the invention.\",\n \"FIG.\",\n \"15 depicts a side elevation view of an exemplary packaging system of the invention.\",\n \"FIG.\",\n \"16 depicts a partial top plan view of an exemplary build station comprising a powder layering system and a print head.\",\n \"FIGS.\",\n \"17A-17D depict top plan views of various different embodiments of a print head and arrangements thereof.\",\n \"FIG.\",\n \"18 depicts a perspective view of a combination harvester system and deduster or dedusting system assembly.\",\n \"FIGS.\",\n \"19A-19C together depict an exemplary logic flow for operation of the equipment assembly of the invention.\",\n \"FIG.\",\n \"19A continues to FIG.\",\n \"19B, which continues to FIG.\",\n \"19C, which refers back to FIG.\",\n \"19A.\",\n \"FIG.\",\n \"20 depicts an exemplary logic flow for operation of the powder layering system.\",\n \"FIG.\",\n \"21 depicts an exemplary logic flow for operation of the printing system.\",\n \"FIG.\",\n \"22 depicts an exemplary logic flow for design of a dosage form.\",\n \"DETAILED DESCRIPTION OF THE INVENTION The invention provides an equipment assembly and system useful for the manufacture of articles via a three-dimensional printing process.\",\n \"The assembly and system are suitable for small scale/volume, medium scale/volume and large scale/volume preparation of articles.\",\n \"The three-dimensional printing process comprises forming an incremental layer of powder on a surface and subsequently printing/applying a liquid onto the layer, then repeating the steps of forming and printing a sufficient number of times to form a printed powder bed comprising one or more intended three-dimensionally printed articles and loose powder.\",\n \"Any excess/undesired liquid remaining in the article(s) is removed and the loose powder is separated from the article, which is then collected.\",\n \"Generally, a three-dimensional printing equipment assembly or system comprises various subsystems including one or more three-dimensional printing build systems, one or more harvesting systems, and optionally one or more liquid removal systems.\",\n \"The equipment assembly can comprise one or more three-dimensional printing build systems, one or more harvesting systems, one or more liquid removal systems and optionally one or more other systems.\",\n \"In some embodiments, the equipment assembly further comprises one or more (sub)systems selected from one or more build plate loading systems, one or more powder recovery systems, one or more control systems, one or more build module or conveyor positioning systems, one or more conveyor drive motors, one or more bed transfer systems, or a combination of systems thereof.\",\n \"As used herein, a “three-dimensional printing build system” generally comprises a conveyor system, plural build modules, at least one build station, and optionally one or more other components.\",\n \"The function of the three-dimensional printing build system is to form one or more three-dimensionally printed articles from a multilayered bed of powder in a build module.\",\n \"Plural build modules are engaged with a conveyor system that is adapted to conduct the build modules along a predetermined path which passes through one or more build stations.\",\n \"A build module is conducted to a powder layering system, and an incremental layer of powder is formed on the upper surface of a cavity of a build module.\",\n \"The build module is then conducted to a printing system, and a liquid is applied to the incremental layer of powder according to a predetermined pattern thereby forming a partially or fully bound powder layer (a printed incremental layer).\",\n \"The steps of conducting the build module, forming an incremental layer of powder and applying a liquid to the layer are considered to be a single build lap of the process.\",\n \"Build laps are repeated in build modules such that a printed incremental layer from one lap adheres to a printed incremental layer from a prior or subsequent lap.\",\n \"Build laps are repeated in build modules a sufficient number of times to form a three-dimensionally printed bed comprising one or more three-dimensionally printed articles and loose powder, wherein the three-dimensionally printed article comprises at least two printed incremental layers.\",\n \"The liquid applied to the pattern may or may not dry sufficiently under ambient conditions between build laps; therefore, a liquid removal step can be included between build laps.\",\n \"If, however, the liquid does not dry sufficiently between build laps, then an optional liquid removal step can be conducted following completion of all the build laps, i.e.\",\n \"following completion of a build cycle, for an intended three-dimensionally printed article.\",\n \"The conveyor system is adapted to conduct build modules through a predetermined course/path during and between build laps.\",\n \"Substantially any system useful for conveying solid materials from a first location to a second location and back to the first location can be used.\",\n \"In some embodiments, the conveyor system is a cyclic, linear or oscillating conveyor system.\",\n \"In some embodiments, the cyclic conveyor system conducts build modules from the first location to a second location and then back to the first location.\",\n \"In some embodiments, the conveyor system is a cyclic or iterative conveyor system that conducts build modules two or more times through the same build station(s).\",\n \"In some embodiments, the linear conveyor system conducts build modules from a first build station to a second build station and optionally one or more other build stations.\",\n \"In some embodiments, the oscillating system conducts one or more build modules through at least one build station in a first direction and then conducts the one or more build modules through the at least one build station in an opposite direction.\",\n \"FIG.\",\n \"1 depicts a top plan view of an exemplary three-dimensional printing equipment assembly (1) comprising a conveyor (2) adapted to conduct plural build modules (6) engaged with the conveyor system along a predetermined path through build regions in one or more build stations, respectively, comprising: a) at least one powder layering system (3) adapted to form incremental powder layers within build modules; and b) at least one printing system (4) adapted to apply a liquid according to a predetermined pattern to incremental powder layers within build modules.\",\n \"The build modules are adapted to receive and temporarily retain powder from the powder layering system.\",\n \"In the cyclic system depicted, the conveyor system is a continuous loop system that repeatedly transports/cycles the build modules from the at least one powder layering system to the at least one printing system to form a three-dimensionally printed bed comprising one or more three-dimensionally printed articles in the build modules.\",\n \"The exemplary conveyor system (2) comprises at least one drive (12) and plural conveyor modules (2a), thereby forming a segmented or modular conveyor system.\",\n \"A conveyor module is engaged with a corresponding build module and conducted along a predetermined pathway in the direction of Arrow A.\",\n \"The equipment assembly in FIG.\",\n \"1 is depicted finishing three-dimensional printing of a first batch of 3-D (three dimensional) articles and starting the 3-D printing of a second batch of 3-D articles.\",\n \"A three-dimensionally printed bed from the end of a first build cycle is in build module (6a), and the beginning of the second batch starts with a printed incremental layer in build module (6L).\",\n \"Build module (6a) includes six 3-D articles in a printed bed of powder.\",\n \"As the build modules (6, 6a-6L) are conducted along the predetermined course, they pass through the bed transfer system (8), which transfers build plates containing completed three-dimensionally printed beds, one or more at a time, away from the three-dimensional printing build system.\",\n \"A build module comprises a body (7a), and upper surface (7c) having a cavity with in which a height adjustable build platform (7b) is disposed.\",\n \"An empty build module (6g) optionally receives a build plate (10) as it passes through the build plate loading region of an optional build plate loading system (9).\",\n \"The build module (6h) is now ready to receive powder.\",\n \"Build modules will pass through at least one build station comprising at least one powder layering system (3) and at least one printing system (4).\",\n \"The build module (6j) is depicted passing through the powder dispensing region of a powder layering system (3).\",\n \"The build module (6k) is depicted between the powder layering system (3) and the printing system (4) and in the recovery region of an optional powder recovery system (11), which pick ups loose powder from the upper surface of build modules.\",\n \"The build module (6L), which is the first build module of the next build lap, is depicted passing through the printing region of the printing system (4).\",\n \"A control system, comprising at least one or more computers and one or more use interfaces (5), can be used to control and integrate (coordinate) operation of the various components and systems of the equipment assembly (1).\",\n \"In some embodiments, operation of each of the conveyor system, the height adjustable platforms of the build modules, the at least one powder layering system, and the at least one printing system are controlled by the control system.\",\n \"In some embodiments, operation of one or more of the build plate loading system (9), optional powder recovery system (11) and bed transfer system is controlled by the control system.\",\n \"An equipment assembly can further comprise a bed transfer system (8) adapted to transfer three-dimensionally printed beds, one or more at a time, away from the three-dimensional printing build system.\",\n \"The exemplary bed transfer system (8) depicted is adapted to simultaneously remove two or more printed beds from respective build modules in a bed transfer region.\",\n \"In some embodiments, the bed transfer system is adapted to transfer three-dimensionally printed beds and corresponding build plates (and/or build modules), one or more at a time, away from the three-dimensional printing build system.\",\n \"In some embodiments, a three-dimensional printing equipment assembly comprises: a) a three-dimensional printing build system comprising: a conveyor system adapted to conduct plural build modules; plural build modules engaged with the conveyor system, wherein the build modules are adapted to receive and temporarily retain powder from a powder layering system; and at least one build station comprising: 1) at least one powder layering system adapted to form incremental powder layers within build modules temporarily disposed in a powder dispensing region of the build station; and 2) at least one printing system adapted to apply a liquid according to a predetermined pattern to incremental powder layers temporarily disposed within build modules in a printing region of the build station; wherein the conveyor system repeatedly transports the build modules from the powder dispensing region of the at least one powder layering system to the printing region of the at least one printing system to form a three-dimensionally printed bed comprising one or more three-dimensionally printed articles in the build modules; b) at least one bed transfer system adapted to transfer completed three-dimensionally printed beds, one or more at a time, away from the build region of the three-dimensional printing build system; c) at least one harvesting system adapted to separate loose powder from one or more three-dimensionally printed articles in a three-dimensionally printed bed; d) at least one control system adapted to control one or more systems of the equipment assembly; e) optionally, at least one liquid removal system; and f) optionally, at least one packaging system adapted to package one or more three-dimensionally printed articles.\",\n \"A build module receives and retains powder deposited thereon by a powder layering system.\",\n \"In some embodiments, the build module comprises a height adjustable platform disposed within a cavity in the upper surface of the build module, wherein the cavity is defined by sidewalls.\",\n \"The height adjustable platform in combination with the sidewalls forms a cavity for the powder.\",\n \"The platform can be adapted to raise or lower incrementally.\",\n \"Powder is placed within the cavity and either directly or indirectly (such as by way of a build plate) onto the platform.\",\n \"FIGS.\",\n \"2A-2B depict an exemplary build module (15), wherein FIG.\",\n \"2A is a front elevation view and FIG.\",\n \"2B is a perspective side view.\",\n \"The build module comprises a body (16a), a cavity (16b) in the upper surface (16d) as defined by the surrounding walls (16c), and height adjuster (19a, 19b) engaged with and adapted to raise and lower the height adjustable platform (17) disposed in the cavity.\",\n \"The build module is depicted with a build plate (18) disposed above the platform, and engagement (20) by way of which it is engaged with the conveyor system.\",\n \"A build module can be permanently or removably engaged with the conveyor system.\",\n \"Although the body and cavity of the build module are depicted having a rectangular shape, they can be shaped as needed.\",\n \"The height adjuster can comprise one or more height adjusters.\",\n \"In some embodiments, the height adjuster is incrementally height adjustable thereby rendering the height adjustable platform also incrementally height adjustable.\",\n \"In some embodiments, an incrementally height adjustable component or system is adapted to raise by one or more increments before and/or after placement of a layer of powder on a build module and prior to placement of a subsequent layer of powder the build module.\",\n \"The height of an increment (thus the thickness of an incremental layer) can be controlled in different ways.\",\n \"In some embodiments, the height adjuster is computer controlled, whereby the computer controls raising or lowering of the height adjusting means by the size of an increment and/or by the number of increments.\",\n \"The size (vertical displacement) of an increment can vary from incremental layer to incremental layer, be the same from incremental layer to incremental layer or a combination thereof.\",\n \"In some embodiments, the size of the increment is the same for each incremental layer (build lap) of a build cycle, is different for one or more incremental layers of a build cycle, or a combination thereof.\",\n \"The size of a vertical increment can be relative to a prior initial position of the build platform or the height adjuster of the powder fill head or both.\",\n \"For example, the platform is lowered within the cavity by a first increment to a first position relative to upper surface of the build module.\",\n \"A printed incremental layer is formed on the platform at the first position during a first build lap.\",\n \"The platform is then lowered by a second increment to a second position but relative to where it was at the first position.\",\n \"Another printed incremental layer is formed on the platform while at the second position during a second build lap.\",\n \"This process is repeated until completion of a build cycle.\",\n \"The size of a vertical increment can be relative to one or more absolute positions of the platform in the cavity of a build module.\",\n \"For example, the build module can comprise plural encoders distributed vertically within or adjacent the cavity.\",\n \"The size of a first vertical increment, then, is defined by the absolute position (absolute vertical distance) of the platform with respect to a first encoder.\",\n \"When the platform is lowered by a second increment to a target second vertical position, which is determined according to or defined by the absolute vertical distance of the platform with respect to a second decoder.\",\n \"This type of absolute positioning can be exemplified as follows.\",\n \"If the target increment is 0.50 mm below the upper surface of a build module, the platform is commanded to drop 0.50 mm.\",\n \"If the next target increment is to be an additional 0.25 mm, then the platform is commanded to drop to a depth of 0.75 mm below the upper surface of the build module rather than to command it to drop by 0.25 mm relative to the initial 0.5 mm increment.\",\n \"This approach is generally superior to using relative moves (0.500, then 0.250) as any minor positioning errors will be resolved or at least not accumulate.\",\n \"The build plate is adapted to fit within the upper cavity of a build module and to superpose a height adjustable platform within the cavity.\",\n \"The build plate receives and supports a powder bed and/or incremental powder layer(s).\",\n \"In some embodiments, the removable build plate is flat, porous, perforated, textured, coated, knurled, smooth or a combination thereof.\",\n \"Any regular and/or irregular geometric pattern for the arrangement of perforations can be used.\",\n \"The shape of the build plate can be varied as needed.\",\n \"FIG.\",\n \"6 depicts build plates (40a-40h) shaped as a rectangle with rounded corners (40a), octagon (40b), cross (40c), circle (40d), hexagon (40e), pentagon (40f), half-rectangle/half-circle (40g, bullet-shaped profile), rectangle with one concave end and one convex end (40h); however, any other shape can be used.\",\n \"The porosity (extent of perforation) of a build plate can be adapted as need to improve operation and manufacture.\",\n \"The build plate (40a) comprises plural evenly spaced perforations.\",\n \"The build plate (40b) comprises a lattice-type structure or mesh.\",\n \"The build plate (400 comprises a rough surface with plural perforations.\",\n \"The build plate (40g).\",\n \"A build plate can be made of any material durable enough to withstand three-dimensional printing thereon.\",\n \"In some embodiments, the build plate is adapted for single use or repeated use.\",\n \"In some embodiments, the build plate comprises pressboard, paperboard, cardboard, cardstock, metal, rubber, plastic, silicone, Teflon (PVDF), coated metal, vinyl, nylon, polyethylene, polypropylene, thermoplastic or a combination thereof.\",\n \"The optional build plate loading system is adapted to reload build plates onto the build modules engaged with the conveyor.\",\n \"In some embodiments, the build plate loading system is adapted to place one or more build plates on the height adjustable platform(s) of the one or more build modules.\",\n \"The build plate loading system (9) depicted in FIGS.\",\n \"7A and 7B comprises a horizontally-telescopic arm (41) pivotally engaged (43) with a vertically-telescopic post (42) and a tray-loading arm (44).\",\n \"The system (9) engages a build plate by a grasp comprised with the vertical tray loading arm (44).\",\n \"The exemplary grasp comprises a plate (46) and an actuatable member (45) that biases/presses a build plate against the plate thereby grasping and temporarily retaining the tray.\",\n \"Other grasps can be used to engage and temporarily retain the tray.\",\n \"In some embodiments, the build plate loading system is a vacuum-based transfer system.\",\n \"The build plate system can also be absent, in which case build plates can be loaded manually onto the build modules.\",\n \"The powder-layering system (3) depicted in FIGS.\",\n \"8A-8C is mounted on a support (table, frame, body, 54) and comprises at least one powder fill head (51), at least one powder reservoir (50) and at least one powder feeder tube (52) driven by a powder feeder drive (53) and adapted to transfer powder from the powder reservoir to the powder fill head.\",\n \"The powder feeder tube can comprise a drive motor and screw-type shaft, e.g.\",\n \"an auger or shaft with spiral blades/vanes, such as found in a Schenk feeder.\",\n \"The powder-layering system forms the incremental powder layer when a build module passes through the powder dispensing region (55, also referred to as a layering region), for example in the direction of Arrow J (FIG.\",\n \"8C).\",\n \"In some embodiments, a powder fill head (51) depicted in FIG.\",\n \"9 comprises a powder fill head body (60, box), at least one powder fill head hopper (61) and at least one powder spreader (64).\",\n \"The hopper receives material from the powder feeder tube to form a temporary supply (63) of powder, which is optionally agitated by powder fill head agitator (62), which can be a powder fill head distribution plate instead.\",\n \"In some embodiments, the hopper (61) is replaced with a chute (not shown, or distribution plate) having a channeled interior surface that distributes powder evenly across the width of the surface and downward onto a build module.\",\n \"Powder exits the hopper (or chute which does not accumulate a substantial amount of powder) in the direction of Arrow K. In some embodiments, the powder fill head further comprises at least one powder-height controller adapted to control the relative distance between the powder spreader (64) and a surface (such as the build plate, the upper surface of the build module, the height adjustable platform, or a prior powder layer) below the powder spreader.\",\n \"An optional distribution bar (or plate, not shown) can be placed between the outlet of the fill head body and the powder spreader (roller).\",\n \"The distribution bar serves to better distribute powder across a layer of powder prior to being contacted by the powder spreader, whereby an incremental powder layer (65) is formed.\",\n \"The powder-height controller can raise or lower the powder spreader so as increase or decrease the thickness of a layer of powder placed onto the platform or a prior layer of powder on the platform.\",\n \"For example, if the platform is lowered by a first increment and the powder-height controller is raised by the same or another second increment, then the thickness of powder laid down will approximate the sum of the first and second increments.\",\n \"If the platform is lowered by a first increment and the powder-height controller is lower by a second increment, then the thickness of powder laid down will approximate the difference of the first increment minus the second increment.\",\n \"Alternatively, the powder spreader in combination with the powder-height controller can cooperate to compress a layer of powder that has been previously laid down.\",\n \"This can be accomplished by first laying down a layer of powder having a first thickness during a first build lap, lowering the powder-height controller and powder spreader and then passing the layer of powder under the lowered powder spreader thereby compressing the layer of powder.\",\n \"In some embodiments, the powder spreader is a cylindrical roller the axis of which has a radial direction of motion opposite the linear direction of motion of a build module through the powder layering system.\",\n \"For example, the surface of the cylinder (64) has a linear direction (Arrow M) opposite the direction (Arrow J) of which an underlying build module (10) passes under the cylinder.\",\n \"In some embodiments, the powder spreader is a cylindrical roller, bar, rod, plate or straight smooth edge.\",\n \"Powder fill heads of other construction can be used.\",\n \"The amount or rate of powder discharged from the powder fill head can be regulated with one or more controls.\",\n \"A powder discharge feedback controller can monitor the accumulation of powder at the powder spreader as the powder is being discharged from the powder fill head and spread to form an incremental powder layer.\",\n \"If the rate at which powder is released is too fast, an excessive amount of powder will accumulate at the powder spreader possibly causing it to spread the powder improperly.\",\n \"The feedback controller then sends a signal thereby causing the rate of powder discharge from the powder fill head to decrease.\",\n \"Conversely, if the feedback controller senses that the rate of powder discharge is too slow, it sends a signal thereby causing the rate of powder discharge to increase.\",\n \"The feedback controller can employ one or more visual, laser, acoustic or mechanical sensors or a combination thereof.\",\n \"FIGS.\",\n \"2C-2D depict a portion of a modular (segmented) conveyor system (21) comprising plural conveyor modules (segments, links) (22) and corresponding engagement means (23) adapted to engage adjacent conveyor modules to each other.\",\n \"FIG.\",\n \"2C is a front elevation view, and FIG.\",\n \"2D is a top plan view.\",\n \"A conveyor module comprises a body (22a), female engagement means (22d), male engagement means (22c), and one or more build module engagement means (22b) adapted to removably or permanently engage build modules.\",\n \"In this exemplary embodiment, adjacent segments (22) pivotally engaged by means of engagement means (23) and pin (22e) such that the segments can pivot about the axis of the pin (22e) in the direction of Arrow LX.\",\n \"Although engagement means (23) is depicted as a hinge-type joint, other engagements can be used.\",\n \"The equipment assembly (1) optionally comprises one or more powder recovery systems.\",\n \"The powder recovery system (11) depicted in FIG.\",\n \"1 and FIG.\",\n \"2E is optional and is a vacuum-based system comprising a body (11a), aspirator bar (11c), vacuum source (11b), and one or more air inlets (11d, 11e) adapted to remove powder from one or more surfaces of a build module.\",\n \"In some embodiments, the powder recovery system is adapted to remove loose powder from the upper surface of a build module.\",\n \"The powder recovery system (11) can comprise engagement (110 by way of which it is removably or permanently engaged to a surface or support.\",\n \"Additional powder recovery systems are described herein.\",\n \"FIGS.\",\n \"3A-3C depict an exemplary printing system (4) adapted to apply liquid to a powder in the printing region of a printing system.\",\n \"FIG.\",\n \"3A is a top plan view, FIG.\",\n \"3B is a side elevation view and FIG.\",\n \"3C is a front elevation view.\",\n \"In some embodiments, the liquid is applied according to a Cartesian coordinate system instead of a polar coordinate system (radial system, cylindrical coordinate system, circular coordinate system, or spherical coordinate system).\",\n \"In some embodiments, the invention excludes a printing system adapted to apply liquid to the powder according to a polar coordinate system.\",\n \"An exemplary printing system comprises at least one print head (28) that deposits liquid onto an incremental layer of powder in a build module and at least one liquid feed system (28b) that conducts liquid from one or more liquid reservoirs (28c) to the at least one print head (28).\",\n \"In some embodiments, the printing system comprises plural print heads, plural liquid feed systems, plural reservoirs or a combination thereof.\",\n \"In some embodiments, the printing system comprises a single print head, plural liquid feed systems, and plural reservoirs.\",\n \"The print head of FIG.\",\n \"3B directs a stream of droplets of liquid into a printing region (29) through which build modules pass.\",\n \"The exemplary system (4) comprises a frame or gantry (tracks 27a, 27b) by way of which the print head (28) can translate/move in the direction of Arrow D, which is transverse to the direction of motion of a build module during printing.\",\n \"Translation of the print head can be performed manually or via computer controlled operation.\",\n \"In some embodiments, the print head is stationary when applying liquid onto an incremental layer of powder, meaning that as liquid is being applied to a powder layer during a print lap, the print head (in particular the print modules) does not move in a direction which is transverse, with respect to the build plane, to the direction of motion of a build module during printing, i.e.\",\n \"during the application of liquid.\",\n \"Such a means of printing is different than prior systems wherein the print head (in particular the print module(s)) moves back and forth, in a direction which is transverse to the direction of motion of a build module, during printing.\",\n \"A print head can comprise one or more print modules that deposit the liquid onto a layer of powder.\",\n \"The print head (28) of FIG.\",\n \"3C comprises four print modules that form corresponding printing regions (29a-29d).\",\n \"When a print head comprises plural print modules, the arrangement/layout of the print modules can be as needed.\",\n \"The print head (30) of FIG.\",\n \"4 comprises plural print modules (4) arranged in plural columns with each column comprising plural print modules.\",\n \"A powder can pass across the print modules in the direction of Arrow E such that print direction is transverse to the horizontal shape of the print module.\",\n \"Other suitable arrangements for the print modules are depicted in FIG.\",\n \"5.The print head (34) comprises a single print module.\",\n \"The print head (35) comprises four print modules pared in groups (35a, 35b) of two offset horizontally from one another.\",\n \"The print head (33) is somewhat similar to head (35) except that the print modules (35a, 35b) are wider horizontally and offset to a greater extent horizontally than are the print modules (33a); moreover, the print modules are horizontally offset from one another.\",\n \"The print head (32) comprises two linearly and transversely offset groups (32a, 32b) of print modules.\",\n \"When viewed in the direction of Arrow E, the adjacent edges of the two groups overlap (each group overlaps the dashed line).\",\n \"By offsetting the print modules as depicted for module (33), the apparent overall print resolution of the print head can be increased.\",\n \"The print modules can be offset in staggered, interlaced, sobered, or angled arrangements relative to the print head in order to increase overall print density/resolution.\",\n \"For example, if the print resolution of each print module is 75 dpi (drops per inch), then the apparent overall print resolution of the print head (33) can be 75 dpi, 150 dpi, 225 dpi, 300 dpi, 375 dpi, 450 dpi or even higher.\",\n \"If the print resolution of each print modules is 100 dpi, then the apparent overall print resolution of the print head (33) can be 100 dpi, 200 dpi, 300 dpi, 400 dpi or even higher.\",\n \"In some embodiments, the print resolution of the print head is the same as or greater than the print resolution of a print module comprised within the print head.\",\n \"In some embodiments, the print resolution of the print head is a multiple of the print resolution of one or more print modules comprised within the print head.\",\n \"In some embodiments, the print resolution of the print head is the less than the print resolution of a print module comprised within the print head.\",\n \"The arrangement of one or more print modules in the print head can be modified as needed to provide the desired printing result.\",\n \"FIG.\",\n \"16 depicts a partial print station comprising a powder fill head (176) and a print head (178) below which is a build module (175) moving in the direction of Arrow Q through a powder dispensing region and a printing region, respectively.\",\n \"The fill head, which is disposed transverse to the direction of motion of the build module, remains transversely and longitudinally stationary (with respect to the plane defining the upper surface of the build module, even though it can move vertically toward or away from said plane) as it places an incremental layer of powder onto and across the width of a cavity of the build module.\",\n \"The build module and incremental layer of unprinted powder moves in the direction of Arrow Q, whereby they pass through the printing region beneath the print module, which is disposed transverse to the direction of motion of the build module.\",\n \"The print module remains transversely, longitudinally and vertically stationary with respect to the plane defining the upper surface of the build module.\",\n \"The print module applies liquid onto the incremental layer of powder according to a predetermined pattern, thereby forming an incremental printed layer (180) comprising article(s) 181.The exemplary print head comprises a single print module (179; depicted in dashed line) that spans the width of a cavity of the build module.\",\n \"The print head (185) depicted in FIG.\",\n \"17A comprises four print modules (186) arranged in both transverse and longitudinal displacement (with respect to the direction of motion of the print head).\",\n \"Together the four print modules span the width of the cavity of the build module.\",\n \"The embodiment (187) of FIG.\",\n \"17B differs from that of FIG.\",\n \"17A in that the four print modules (188) are only transversely displaced but not longitudinally displaced.\",\n \"In some embodiments, the one or more print heads is/are stationary when applying liquid onto an incremental layer, i.e.\",\n \"when printing.\",\n \"The one or more print heads can, in particular, be transversely and longitudinally stationary, with respect to the linear direction of motion of a build module (and thus an incremental layer of powder), when printing.\",\n \"Particular embodiments include those wherein: a) the printing is performed according to a Cartesian coordinate algorithm; b) the build module moves during printing in a linear direction that is perpendicular to the disposition of the print module (and one or more print heads); c) the print head and one or more print modules are stationary when printing (when applying liquid to an incremental layer of powder) and do not move in a direction that is transverse or longitudinal with respect to the direction of motion of the build module; and/or d) printing is not performed solely according to a polar coordinate algorithm.\",\n \"The three-dimensional printing system/assembly of the invention employs Cartesian coordinate based printing system and algorithms.\",\n \"Unlike other systems that move the print heads transversely and/or longitudinally when printing, the print heads of the invention are substantially stationary during printing.\",\n \"The term “transversely” is determined in relation to the direction of motion of a build module beneath a print head and means substantially perpendicular to the direction in which a build module is conducted through a printing area.\",\n \"The term “longitudinally” is determined in relation to the direction of motion of a build module beneath a print head and means substantially parallel to the direction in which a build module is conducted through a printing area.\",\n \"Application of liquid across the width of powder layer beneath a print head is accomplished by employing one or more print modules that individually or together traverse at least 75%, 80%, at least 85%, at least 90%, at least 95%, at least 97.5% or at least 99% the width of the powder layer.\",\n \"In the present case, the “width” of the powder layer is determined along a direction transverse to the direction of motion of a build module beneath a print head, and the term “length” is determined along a direction parallel to the direction of motion of a build module beneath a print head.\",\n \"In other words, a single print head can traverse the width or plural print heads transversely adjacent to each other can traverse the width of the powder layer.\",\n \"In particular embodiments, the print head comprises plural print modules that individually do not but together do span the width of an incremental powder layer and/or of the cavity of a build module.\",\n \"In some embodiments, one or more print modules together modules span at least 50%, at least 55%, at least 75%, at least 90%, at least 95%, at least 99% or all of the width of the cavity of the build module.\",\n \"In particular embodiments, the build module moves in a first direction, and the print head is stationary when liquid is being applied to the incremental powder layer.\",\n \"In particular embodiments, printing is performed primarily or solely according to a Cartesian coordinate algorithm.\",\n \"For example, the algorithm controls application of the droplets of the printing fluid relative to the linear (non-radial, straight) direction of the conveyor such that the print head applies droplets in a direction that is parallel (longitudinal) or is perpendicular (transverse) with respect to the linear direction of motion of the conveyor.\",\n \"The conveyor and corresponding build modules only move in a straight linear direction beneath the print head and build head.\",\n \"An alternate embodiment of the invention is depicted in FIG.\",\n \"17C, wherein the print head (189a) comprises one or more or plural print modules that do not span the width of an incremental powder layer and/or of the cavity of a build module.\",\n \"This print head is either stationary when printing (when applying liquid to an incremental layer of powder) or moves transversely, with respect to the direction of motion of the build module, while applying liquid to the powder.\",\n \"The print modules of the print heads (32, 33, 35, 189a, 189b of FIGS.\",\n \"5 and 17C) are arranged such that the jets on multiple print heads are interleaved to increase the print density across the print bed.\",\n \"For example, individual print modules having a native print density of 100 dpi are interleaved together such that four of the print heads together provide a 400 dpi print density.\",\n \"In some embodiments, clusters of print modules, such as depicted in 17D, are arranged so their overall span covers only part of the width of a powder layer, such that plural print heads (each containing a cluster of print modules with interleaved jets) are required to cover the full width of the powder layer.\",\n \"For example, three print heads (189b), each having a cluster of print modules which together spans only 2.5″, would need to be arranged in a horizontally offset manner in order to cover the width of a powder bed or layer that is between 5 to 7.5 inches wide.\",\n \"The at least one printing system can apply liquid according to any predetermined print pattern or randomly onto an incremental layer of powder.\",\n \"The pattern can be the same from incremental layer to incremental layer or can be different for one or more incremental layers of a printed article.\",\n \"Generally, two adjacent print patterns will comprise at least two overlapping printed portions such that at least a portion of the printed/bound powder in one printed incremental layer will adhere (be bound) to at least a portion of the printed/bound powder of an adjacent printed incremental layer.\",\n \"In this manner, plural stacked adjacent printed incremental layers adhere to each other thereby forming a three-dimensionally printed article comprising plural adjacent printed incremental layers of completely or partially bound powder.\",\n \"Even though a three-dimensionally printed article can include undercuts, overhangs, cavities, holes and other such features, at least part of the printed portions of adjacent printed incremental layers must adhere to one another in order to form and fill the composite volume of the article.\",\n \"The printing system employs a Cartesian coordinate-based printing algorithm when applying liquid to an incremental powder layer.\",\n \"The system includes a computer and associated software that comprises one or more print jobs.\",\n \"A print job includes, among other things, information on the thickness of incremental layers and the predetermined pattern to be printed on the incremental layers of a printed article.\",\n \"The print job provides layer-by-layer instructions to the print head (print module(s)) about the creation and placement of droplets of liquid onto the incremental powder layer.\",\n \"The print job is based upon the series of two-dimensional images (slices) that, when stacked, together form a predetermined three-dimensional image (object).\",\n \"Without being held bound to a particular mechanism, a target three-dimensional article is designed, such as with a CAD program.\",\n \"A virtual image of the target article is sliced virtually into plural stacked thinly-sliced images (which are referred to herein as “two-dimensional” images), wherein each two-dimensional image is actually the thickness of an incremental powder layer.\",\n \"The sum total of thicknesses of the image slices equals the total “height” of a target article.\",\n \"Each two-dimensional “image” is then converted into a subset of printing instructions, which together define a predetermined printing pattern for that image.\",\n \"All of the subsets of printing instructions are joined together to form a final set of printing instructions that are used by the computer to control printing.\",\n \"Aside from incremental layer thickness, two-dimensional shape of predetermined patterns, and shape of target article, the final set of print instructions also includes specification of or consideration of linear speed of the build module beneath the print head, rate of application of liquid to incremental powder layers, length and width of the incremental powder layer, dimensions of the cavity of a build module, incremental height adjustment of the height adjustable platform of the build module, rate of loading of powder into the powder fill head, rate of loading of powder into a build module to form an incremental layer, rate of transfer of powder from a feed reservoir to the fill head, resolution of the two dimensional image to be printed on each incremental layer, the number of applications of liquid to each incremental layer, application of one or more specific liquids to one or more specific locations of the incremental layer, starting and stopping of liquid application with respect to each build module, the number of articles to be printed, the number of build modules in the equipment assembly, the number of build modules to be printed upon, rate at which the platform of the build module moves down, timing for starting and stopping powder delivery relative to the entire build cycle, rotational speed of leveling device (roller) and other such parameters.\",\n \"An equipment assembly comprises a control system comprising one or more controllers.\",\n \"Without being held bound to a particular mechanism, a homing switch located at a fixed point of the conveyor (FIG.\",\n \"1) provides a reference point as to the location of the “first” build module in a group of build modules.\",\n \"From there, a computer is able to determine the location of the rest of the build modules in that group by knowing the size of the conveyor, the spacing of the build modules and the dimensions of the build modules.\",\n \"The control system can also comprise a proximity sensor that specifies the location of one or more build modules relative to the conveyor.\",\n \"The control system comprises a synchronizer that facilitates synchronization of operation of the various components of the equipment assembly.\",\n \"By taking into consideration the track (linear) speed of the conveyor and the target thickness and width of an incremental layer, a computer is able to instruct the powder layering system to charge powder onto the build modules at a certain feed rate.\",\n \"After part of a lap or after one or two calibration laps, the powder feed rate can be continuous.\",\n \"Once a proper incremental powder layer is formed, deposition of liquid onto the incremental layer can begin.\",\n \"A proximity sensor senses the leading edge of a build module and then sends instruction to the print system.\",\n \"A computer controlling the print system takes into consideration a set of printing instructions (which can include among other things the target print resolution (density), the image(s) (pattern(s)) to be printed on the incremental layer, the target rate of liquid deposition, the number of liquids to be deposited, the dimension of the print head and print modules, track speed, the set of images (patterns) that are to be printed to form a target 3D printed article, target article porosity or density, or other such parameters) and the signal generated by a wheel encoder, for example, to provide a pulse that sets the print rate at which to consume the image files in the printing instructions and the resolution at which to print the image file(s).\",\n \"Following completion of layering and printing per the printing instructions, a build cycle is completed.\",\n \"As described herein, the powder system can comprise one or more feedback controllers that determine the proper powder feed rate into a powder feeder and into the build modules.\",\n \"Likewise, the printing system can comprise one or more feedback controllers that determine the rate at which printing fluid (liquid) is being applied and/or consumed and can therefore control the liquid application rate and can also the reloading of liquid reservoir(s).\",\n \"A liquid removal system, such as a dryer, can comprise one or more relative humidity controllers, temperature controllers and conveyor speed controllers.\",\n \"The system is therefore capable of adjusting drying time and conditions to provide printed articles containing the desired level of moisture.\",\n \"In some embodiments, one or more components of the equipment assembly are computer controlled.\",\n \"A controller is independently selected at each occurrence from a computerized controller, electronic controller, mechanical controller or a combination thereof.\",\n \"In some embodiments, the control system comprises one or more computerized controllers, one or more computers, one or more user interfaces for one or more computers.\",\n \"In some embodiments, one or more components of the three-dimensional printing build system are computer controlled.\",\n \"In some embodiments, the conveyor system, the height adjustable platforms of the build modules, the at least one powder layering system and the at least one printing system are computer controlled.\",\n \"In some embodiments, the equipment assembly is adapted to spread layers of powder and print droplets of liquid in a predetermined pattern according to instructions provided by a computerized controller.\",\n \"In some embodiments, the predetermined pattern is based on one or more two-dimensional image files comprising pixels.\",\n \"In some embodiments, the two-dimensional image files are structured such that certain pixels indicate dispensing of droplets, and other pixels represent no dispensing of droplets.\",\n \"In some embodiments, the two-dimensional image files include different colors of pixels to indicate dispensing of different liquids, or no dispensing of liquid.\",\n \"FIGS.\",\n \"19A-19C, depict a flow chart for operation of an exemplary embodiment of the invention.\",\n \"The process is initiated, e.g.\",\n \"by an operator or electronic component such as a computer.\",\n \"An operator activates and checks the status of system and assembly components, which are then synchronized, after which time the system (assembly) is ready for operation.\",\n \"Printing fluid and powder are loaded into their respective systems as required of the product to be three-dimensionally printed.\",\n \"Build plates are loaded into build modules and a build cycle is initiated.\",\n \"The level of printing fluid(s) and powder(s) are checked and when the required amount is present, conveyor operation is initiated.\",\n \"Moving to FIG.\",\n \"19B, the powder feed rate and transport speed (conveyor speed) for the build module is applied and a query is made to determine whether or not a build module is supposed to receive powder.\",\n \"If so, the platform is lowered and a layer of powder is deposited onto the build module as it passes under the powder fill head.\",\n \"If not, the build module does not receive powder.\",\n \"A query is then made to determine whether or not the powder layer is supposed to receive a printed image.\",\n \"If so, a two-dimensional pattern is printed onto the layer as the build module passes under the print head.\",\n \"If not, the build module does not receive printing solution.\",\n \"A query is made to determine whether or not all of the build modules mounted on the conveyor have been processed, i.e.\",\n \"whether or not the build lap is completed or whether or not the build module is supposed to receive another layer of powder.\",\n \"If not, any unprocessed build module is processed.\",\n \"If all of the build modules have been processed, i.e.\",\n \"the build lap is complete, a query is made to determine whether or not a build cycle is complete.\",\n \"If not, one or more additional build laps are conducted.\",\n \"If so, the build modules are prepared for unloading of build plates as described in FIG.\",\n \"19C.\",\n \"Completed build plates that bear three-dimensionally printed powder bed are unloaded and transferred to drying trays.\",\n \"After a build plate has been removed from a build module, another build tray is placed in the empty build module.\",\n \"After all build plates have been unloaded, a query is made according to FIG.\",\n \"19A to determine whether or not additional build cycles will be conducted.\",\n \"If not, the process is terminated.\",\n \"If so, the next build cycle process is initiated.\",\n \"FIG.\",\n \"20 depicts an exemplary subroutine detailing how the platform layer increment is controlled within a build lap and a build cycle.\",\n \"In this example, the layer thickness (increment) is provided by a product definition.\",\n \"A cumulative thickness is calculated according to the number of powder layers already laid down.\",\n \"The platform is dropped to the calculated thickness and a determination is made to confirm that it is at the correct position within a predefined tolerance.\",\n \"A query is then made to determine whether or not the platform of all the build modules in a particular build lap have dropped to the correct position.\",\n \"If not, the platforms are adjusted as required.\",\n \"If so, a query is made to determine whether or not all layers of a build cycle are complete.\",\n \"If so, the build plates are unloaded as described herein.\",\n \"If not, the process of this figure is repeated for each of the build layers as needed until the build cycle is complete.\",\n \"FIG.\",\n \"21 describes an exemplary subroutine detailing operation of the printing system.\",\n \"A build process is initiated and the necessary amount(s) of printing fluid is loaded into the reservoir(s).\",\n \"A set of image files are identified and conveyor operation is begun.\",\n \"During operation, the level of printing fluid(s) is monitored so that it can be replenished as needed.\",\n \"When a build module passes beneath a printhead, a trigger signal is generated prompting a query to determine whether or not the build module is to receive a printed image.\",\n \"If not, the trigger signal is ignored.\",\n \"If so, an print image file is received and processed such that the columns of image pixels (pixels that are aligned along the axis of movement of the build module) are assigned to specific jets of the printhead.\",\n \"In addition, rows of image pixels are sent to the printhead taking into consideration the linear speed of the conveyor and the intended print density of the image to be printed.\",\n \"The printhead then delivers printing fluid droplets, as per the printing instructions, to the powder layer on a build module.\",\n \"A query is then made to determine whether or not all build modules have been processed.\",\n \"This query can be repeated for the build lap and/or build cycle level.\",\n \"Upon completion of a build cycle, the process can be terminated.\",\n \"If needed, the printhead can be retracted and cleaned.\",\n \"FIG.\",\n \"22 depicts a flow chart of an exemplary process for designing a dosage form and determining the layer thickness thereof and image files (two-dimensional printing patterns) there for.\",\n \"The process can be conducted with or without a computer.\",\n \"A dosage form having a specified three-dimensional structure and comprising a target dose of drug is designed.\",\n \"The approximate target powder layer thickness is selected and the height of the dosage form is divided by the target incremental powder layer thickness to provide the number of powder layers required to prepare the dosage form.\",\n \"Based upon the layer and its location within the dosage form, each layer is assigned as needed an initial two-dimensional pattern, i.e.\",\n \"an image file, which ultimately results in a set of printing instructions employed by the printing system to create a corresponding printed increment layer.\",\n \"The image file assigned to each layer can be input, or it can be retrieved from an image library.\",\n \"In order to determine whether or not archived images from the image library are required, the system queries whether or not all layers have been assigned an image file as needed.\",\n \"If so, the design of the dosage form is complete and the process is terminated.\",\n \"If not, the system queries whether or not the image required for a specific layer exists in the image library.\",\n \"If so, the image file is retrieved from the library and assigned to the respective powder layer.\",\n \"The system then again queries whether or not all layers have been assigned an image file as needed and the loop of logic continues as needed until completion of design of the dosage form.\",\n \"If the image file is not present in the image library, a new image file is created, optionally stored in the image library, and assigned to the respective layer, and the loop of logic continues as needed until completion of the dosage form design.\",\n \"It should be understood that one or more layers might not require any image file at all, meaning that specific layer would not be printed during preparation of the dosage form.\",\n \"The equipment assembly of the invention can comprise one or more bed transfer systems adapted to transfer three-dimensionally printed beds, one or more at a time, away from the three-dimensional printing build system.\",\n \"FIG.\",\n \"10A is a top plan view and FIG.\",\n \"10B is a side elevation view of an exemplary bed transfer (unloading) system (8) comprising a frame (70), receiving platform (76), tray-loading platform (77), and bed transfer mechanism (71) moveably engaged with the frame and superposing a bed-transferring region (75).\",\n \"The bed transfer mechanism (71) comprises mounts (71c) adapted to translate along tracks (72a, 72b) in the direction of Arrow N in a reciprocating manner.\",\n \"The bed transfer mechanism also comprises a receptacle (71a) comprising a cavity (82) adapted to receive and temporarily retain a three-dimensionally printed bed (83) having an optional build plate (10).\",\n \"In an alternate embodiment, the receptacle is a push plate or U-shaped coral (71d) comprising a receiving area adapted to receive and temporarily retain a three-dimensionally printed bed.\",\n \"The receptacle (71a) reciprocates in a vertical manner in the direction of the Arrow P by means of reciprocator (71b) engaged with the receptacle (71a) and the body (71d) of the bed transfer mechanism (71).\",\n \"During operation, a conveyor conducts and positions a build module (7a) beneath the receptacle (71a) and in the bed-transferring region (75) so as to align the three-dimensionally printed bed (83) and build plate with the cavity (82).\",\n \"The receptacle then lowers in the direction of Arrow P an amount sufficient to retain substantially all of the three-dimensionally printed bed and build plate within the cavity.\",\n \"The bed transfer mechanism (71) then slides/translates the printed bed and build plate in the direction of the Arrow N onto the receiving platform (76) and then onto a transport tray (74).\",\n \"The receptacle is then raised in the direction of the Arrow P leaving the printed bed and build plate on the transport tray and translates back in the direction of Arrow N to the original position superposing a build module.\",\n \"The transport tray (74) is then conducted in the direction of the Arrow B.\",\n \"FIG.\",\n \"10C depicts an alternate embodiment of a bed transfer system comprising a diverter (84) and a conveyor (86).\",\n \"The diverter directs build modules or build plates comprising printed beds (87) from the conveyor (85) of the build system onto an adjoining conveyor (86), which optionally transfers the printed beds to a liquid removal system or other downstream processing apparatus (not shown).\",\n \"The diverter can be adapted to raise and lower.\",\n \"In a first position, it does not direct printed beds away from the build system and in a second position it does.\",\n \"In some embodiments, the bed transfer system is adapted to transfer three-dimensionally printed beds to one or more liquid removal systems, one or more harvesting systems and/or one or more packaging systems.\",\n \"In some embodiments, the transfer system is integrated with the conveyor system, the liquid removal system or both.\",\n \"A liquid removal system is adapted to receive one or more build plates (containing a printed bed) and to remove liquid from one or more printed powder layers onto which the liquid has been applied and/or from the three-dimensionally printed bed.\",\n \"A liquid removal system can be a process area through which one or more of the build modules are conducted.\",\n \"For example, the liquid removal system in FIG.\",\n \"1 can be the process area over the conveyor and excluding the region under the printing region.\",\n \"Alternatively, a liquid removal system can be another process area not directly associated with the three-dimensional printing build system, such as a temporary retaining or storage area wherein three-dimensionally printed beds are placed and dried under ambient conditions.\",\n \"In some embodiments, a liquid removal system is one or more dryers.\",\n \"FIGS.\",\n \"13A-13B depict exemplary liquid removal systems.\",\n \"FIG.\",\n \"13A is a partial sectional side elevation view of a dryer (130) adapted to remove or reduce the amount of liquid in a three-dimensionally printed bed (83) or article.\",\n \"The dryer comprises a housing (131) within which are contained plural heating elements (137), a conveyor system (138) and one more exhaust ports (132).\",\n \"The housing comprises an inlet (133) and an outlet (134) through which three-dimensionally printed beds (or articles) and their respective build plates are conducted by way of conveyors (135, 136, respectively).\",\n \"During operation, the printed beds are conducted through the inlet (133) and carried by the conveyor system (138) through a predetermined path as they are exposed to the heating elements (137), which affect evaporation of liquid from the printed beds.\",\n \"When the printed beds (or articles) exit the dryer, they comprise less liquid than they did when they entered the dryer.\",\n \"Although not depicted in FIG.\",\n \"13A, the dryer can comprise a vacuum system adapted to reduce the pressure within the dryer or air-handling system adapted to increase or otherwise control the flow of air through the dryer.\",\n \"Although the path of the conveyors is depicted as “S-shaped” in FIG.\",\n \"13A, the path can instead be any path desired, e.g.\",\n \"U-shaped, Z-shaped, N-shaped, n-shaped, O-shaped, etc.\",\n \"FIG.\",\n \"13B depicts an alternate embodiment of a dryer (141) suitable as a liquid removal system.\",\n \"The dryer comprises a housing (142), within which are contained plural heating elements (146) and a conveyor system (145).\",\n \"The housing comprises an inlet (143) and an outlet (144) through which three-dimensionally printed beds and their respective build plates are conducted by way of the conveyor.\",\n \"In some embodiments, the dryer comprises one or more covers (147) for the inlet and/or outlet.\",\n \"In some embodiments, the three-dimensionally printed bed comprises loose powder and one or more three-dimensionally printed articles.\",\n \"An equipment assembly of the invention can further comprise one or more harvesting systems adapted to separate loose powder from the one or more three-dimensionally printed articles.\",\n \"In some embodiments, the harvester processes build plates already processed by the liquid removal system.\",\n \"In some embodiments, the harvester comprises loose powder collection means and three-dimensionally printed article collection means.\",\n \"In some embodiments, the harvester comprises a vibrating and/or orbiting surface adapted to receive the three-dimensionally printed bed.\",\n \"In some embodiments, the harvester comprises one or more deagglomerators.\",\n \"In some embodiments, the equipment assembly further comprises one or more dedusters adapted to remove loose powder from articles that have been harvested.\",\n \"In some embodiments, a deduster comprises one or more air brushes.\",\n \"The exemplary combination harvester and deduster system (150) depicted in side elevation view in FIG.\",\n \"14 comprises a frame (151), a receiving platform having an air-dispenser (161), bed transfer mechanism (152) moveably engaged with the frame and superposing a bed transfer region, aspirator (154), deagglomerator (156), deduster (157), printed article collector (158), and powder collector (159).\",\n \"The also comprises at least one air brush (161).\",\n \"The bed transfer mechanism (152) comprises mounts adapted to translate along tracks (153) in the direction of Arrow N in a reciprocating manner.\",\n \"The bed transfer mechanism also comprises a receptacle (167) comprising a cavity (166) adapted to receive and temporarily retain a three-dimensionally printed bed (83) having an optional build plate (10).\",\n \"The receptacle (167) reciprocates in a vertical manner by means of reciprocator engaged with the receptacle and the body of the bed transfer mechanism (152).\",\n \"During operation, a conveyor (155) conducts and positions a printed bed (83), build plate (10) and transport tray (74) beneath the receptacle (167) and in a bed transfer region so as to align the three-dimensionally printed bed, build plate and transport tray with the cavity (166).\",\n \"The receptacle then lowers onto the transport tray an amount sufficient to retain substantially all of the three-dimensionally printed bed within the cavity.\",\n \"An aspirator (154) then aspirates the printed bed (83) by way of a conduit (165) and a perforated plate in the cavity and above the bed, thereby removing a major portion of the loose powder contained within the bed while leaving behind one or more printed articles (160) within the cavity of the receptacle.\",\n \"The bed transfer mechanism (152) then slides/translates the printed bed and build plate in the direction of the Arrow N over one or more airbrushes (161) adapted to direct a flow of air at the printed articles in the cavity to assist in releasing additional loose powder from the printed article(s).\",\n \"The empty build plate (10) and transport tray (74) are conveyed away from the bed-transferring region.\",\n \"A powder collector (159) is adapted to receive loose powder and other solid material not otherwise collected by the aspirator (154).\",\n \"The bed transfer mechanism continues to move in the direction of the Arrow B until it superposes a deagglomerator (156).\",\n \"The aspirator is then turned off and the printed particles fall onto of the process tray of the deagglomerator, which is adapted to remove and collect agglomerates from the printed article(s) to provide deagglomerated printed articles (162).\",\n \"The bed transfer mechanism (152) then returns to its original position in preparation of loading and processing of additional printed beds.\",\n \"The process tray of the deagglomerator vibrates (and/or orbits) and conducts the printed articles in the direction of Arrow B toward the deduster (157) while degglomerating the printed particles.\",\n \"The deduster also comprises a vibrating process tray adapted to remove and collect dust from the deagglomerated printed articles to provide dedusted printed articles (163).\",\n \"The finished printed articles (164) are conducted to a printed article collector (158).\",\n \"The deduster and/or deagglomerator can further comprise solids collector for collecting loose powder and/or agglomerates.\",\n \"FIG.\",\n \"18 depicts an exemplary harvester system (190) and a deduster system (200).\",\n \"The harvester system comprises a housing (191), a receptacle (192), a vibrating surface (193) within the receptacle and an outlet (194) for the receptacle.\",\n \"A perforated build plate below a dry printed bed (loose powder and printed article) is placed on the vibrating surface.\",\n \"Loose powder is dislodged from the printed bed as the surface vibrates.\",\n \"The recovered loose powder falls and is collected in the receptacle, after which it is unloaded from the receptacle through the outlet.\",\n \"The recovered loose powder is collected in a container (195).\",\n \"Collection of the loose powder can be done manually, mechanically and/or with a vacuum system.\",\n \"The deduster system (200) of FIG.\",\n \"18 comprises a housing (201), receptacle (202), drawer (203), enclosure (204), one or more air jets, e.g.\",\n \"air knives, (205, not depicted) within the enclosure, inlet (206, not depicted) for the enclosure, and an outlet (207) for the enclosure.\",\n \"A perforated build tray having one or more printed articles that have been harvested is placed in the drawer which is subsequently pushed into the enclosure by way of the inlet, thereby forming a substantially enclosed dedusting area.\",\n \"One or more air jets direct pressurized air toward the printed article(s), whereby both coarse and fine loose powder that has clung onto the printed article(s) is dislodged there from.\",\n \"The loose powder falls into the receptacle and is conducted to the outlet along with the flow of air released by the air jet(s).\",\n \"The dedusted printed article(s) is (are) are retrieved by opening of the drawer.\",\n \"The recovered loose powder collected in a container.\",\n \"Collection of the loose powder can be done manually, mechanically and/or with a vacuum system and/or air-handling system.\",\n \"The deduster system and/or the harvester system can be placed within a larger enclosure (208) to minimize spreading of dust in a process area.\",\n \"Loose powder, agglomerates or particulates collected during the build cycle, drying, harvesting, deagglomerating and/or dedusting can be disposed or can be blended to form recovered bulk material that can be milled (optionally) and recycled back into a feed supply of virgin unprinted bulk material.\",\n \"Such a bulk material recovery system can comprise one or more vacuum systems, one or more pressurized air systems, one or more non-vacuum mechanical systems, one or more manual systems or a combination thereof for transferring bulk material from one location to another.\",\n \"FIGS.\",\n \"12A-12E depict exemplary generalized layouts for conveyor systems and build stations of a three-dimensional printing build system.\",\n \"FIG.\",\n \"12A depicts a top plan view of a three-dimensional printing build system (105) somewhat similar to the one depicted in FIG.\",\n \"1.The system (105) comprises a cyclic and iterative conveyor system (110), a first build station (111), an optional second build station (115), and plural build modules.\",\n \"The plural build modules are conducted through the first build station, and optionally the second build station if present, and then back through the first build station in the direction of the Arrow A.\",\n \"The build station (111) comprises a powder-layering system (112) and a printing system (114).\",\n \"FIG.\",\n \"12B depicts a top plan view of a three-dimensional printing build system (106) comprising a linear conveyor system (118), a first build station (111), a second build station (115), and plural build modules.\",\n \"The plural build modules are conducted from position X1 through the first build station to position X2 and then through the second build station to position X3 in the direction of Arrow A.\",\n \"Further processing of printed articles is done downstream of the build system (106).\",\n \"In some embodiments, the conveyor system is a linear conveyor system that conducts build modules from a first build station to a second build station and optionally to a third or other build station in a non-cyclic or non-iterative manner.\",\n \"FIG.\",\n \"12C depicts a top plan view of a linear and iterative three-dimensional printing build system (107) comprising a linear conveyor system (119), a first build station (111), an optional second build station (115), and plural build modules.\",\n \"The plural build modules are conducted from position X1 through the first build station to position X2 and then through the second build station, if present, to position X3 and then, in reverse direction in the direction of Arrow AR, back through the second build station, if present, and the first build station.\",\n \"A third or more other build stations can be included, and if present, the build modules are conducted through them.\",\n \"FIG.\",\n \"12D depicts a top plan view of a linear and iterative three-dimensional printing build system (108) comprising plural build stations (111, 115, 126, 127), plural build modules, and build module transfer means (124, 125).\",\n \"Empty build modules on a conveyor (120) are transported from position Z1 to position X1.The conveyor (121) then conducts build modules consecutively from positions X1 to X2 to X3 and through the build stations (111, 115).\",\n \"Build module transfer means (124) then transfer build modules in the direction of Arrow AZ from position X3 to position X4.A second conveyor then conducts build modules consecutively from positions X4 to X5 to X6 and through the build stations (126, 127, respectively).\",\n \"Build module transfer means (125) then transfer build modules in the direction of Arrow AY from position X6 to position X1.This type of build lap is repeated as many times as necessary until the desired printed article is formed and unloaded from the printing build system (108) by way of the conveyor (122).\",\n \"FIG.\",\n \"12E depicts a side elevation view of a three-dimensional printing build system (109) somewhat similar to that of FIG.\",\n \"12D.\",\n \"In this embodiment, however, the conveyors (128, 129) are arranged vertically one above the other rather than side by side.\",\n \"Moreover, the lower conveyor system (129) does not have a build station specifically associated with it.\",\n \"As noted above, it takes plural build laps to construct a three-dimensionally printed article from a powder bed.\",\n \"FIG.\",\n \"11A depicts a partial cross-sectional view of a build module (90) comprising a body (91) having an upper surface (91a) and a height adjustable platform (92) having an upper surface (92a).\",\n \"The hollow arrows indicate process steps, whereas the filled-in black arrows indicate direction of motion of the platform in the figure.\",\n \"The build module (90) is depicted in starting position at Stage 0.In process steps A1 and A2, the platform is lowered thereby forming a cavity (93) defined by the inner surface (91b) of the build module and the upper surface of the platform.\",\n \"A build plate (10) is then placed on top of the platform as depicted in Stage I.\",\n \"In process step B1, a layer of powder (94) is placed in the cavity and over the build plate such that the position of upper surface (94a) of the layer substantially matches (or is at the same height of) the position of the upper surface (91a) of the build module as depicted in Stage II.\",\n \"In process step C1, platform is lowered again by an increment thereby forming a new cavity (95) above the surface of the powder layer (94) as depicted in Stage III.\",\n \"In process steps D1 and D2, another layer of powder is placed in the cavity and then printed upon to form one or more sections of bound powder as depicted in Stage IV.\",\n \"In process step E1, the platform is lowered again and another cavity is formed above the previous layer of powder as depicted in Stage V. In process steps F1 and F2, another layer of powder is placed in the cavity and then printed upon to form one or more sections of bound powder as depicted in Stage VI.\",\n \"The print pattern used in process step D2 is similar to the print pattern used in process step F2.In process step G1, the platform is lowered again as depicted in Stage VII.\",\n \"In-process step H1, a layer of powder is placed in the just formed cavity over the prior layer of powder as depicted in Stage VIII thereby completing formation of a printed bed comprising loose powder (97) and plural printed articles (96).\",\n \"In process step J1, the receptacle (71a) of a bed transfer means is placed above the printed bed such that the cavity of the receptacle superposes and is aligned with the printed bed as depicted in Stage IX.\",\n \"In process step K1, the platform is raised such that the build plate and printed bed are disposed within the cavity as depicted in Stage X.\",\n \"In process step L1, the receptacle is translated/slid in the direction of Arrow N thereby unloading the builds tray returning it to Stage 0.The print pattern used for individual print cycles can vary as needed and need not be the same for each build lap.\",\n \"FIG.\",\n \"11B depicts the build module of the FIG.\",\n \"11A.\",\n \"The process steps A1, A2, B1 and C1 in FIG.\",\n \"11B are similar to those steps in FIG.\",\n \"11A; however, the process of FIG.\",\n \"11B includes the process step B2 whereby the first layer of powder is printed upon to form a layer comprising loose powder (100) and bound powder (101).\",\n \"In process step D1, a layer of powder is placed within the cavity, and in process step D3, the layer is printed upon using a print pattern that is different than the print pattern used in process step B2 such that the cross-section of the bound powder (102) in Stage IV of FIG.\",\n \"11B is different than the cross-section of the bound powder in Stage IV of FIG.\",\n \"11A.\",\n \"The pattern of step D3, however, overlaps with the pattern of step B2 sufficiently that the resulting printed layers adhere to one another.\",\n \"The platform is lowered again according to process step E1.Powder is then layered into the cavity in process step F1 and printed upon in process step F3.Again, the print pattern used in process step F3 is different than the print pattern used in process steps D3 and B2, such that the cross-section of the bound powder (103) in stage VI comprises three different patterns, which patterns are different than those depicted in stage VI of FIG.\",\n \"11A.\",\n \"The pattern of step F3, however, overlaps with the pattern of step D3 sufficiently that the resulting printed layers adhere to one another.\",\n \"The platform is lowered again according to process step G1 as depicted in stage VII.\",\n \"In process step H1, a layer of powder is placed within the cavity, and in process step H2, the layer is printed upon using a print pattern that is different than any of the prior print patterns used such that the cross-section of the bound powder (104) in the printed bed in stage VIII comprises six different patterns, which patterns are different than those depicted in stage VIII of FIG.\",\n \"11A.\",\n \"The pattern of step H2, however, overlaps with the pattern of step F3 sufficiently that the resulting printed layers adhere to one another.\",\n \"In process step J1, a perforated plate is placed above the printed bed and a receptacle of a bed transport means is placed above the plate as depicted in Stage X.\",\n \"In process step K1, the perforated plate, printed bed and build plate are raised into the cavity of the receptacle.\",\n \"In process step L1, the receptacle is translated away in the direction of Arrow N leaving behind the build module in its initial stage 0.Upon completion of the exemplary print cycle, the three-dimensionally printed bed can be further processed as described herein.\",\n \"Conveyor systems useful for conducting solid articles from one location to another during manufacture include, by way of example, a modular conveyor, non-modular conveyor, continuous conveyor, contiguous conveyor, conveyor belt, cam, pallet conveyor or link conveyor.\",\n \"Combinations thereof can be used.\",\n \"FIG.\",\n \"15 depicts a side elevation view of an exemplary packaging system (170) adapted to package one or more three-dimensionally printed articles (164).\",\n \"The system comprises a hopper (171) that provides three-dimensionally printed articles which are placed onto a conveyor (173).\",\n \"The articles are conducted through a packaging module (172) that places one or more articles into a package (174).\",\n \"Suitable packaging systems can employs bottles, blister packs, tubes, boxes and other such containers.\",\n \"The various components and systems of the equipment assembly will comprise parts made of durable materials such as metal, plastic, rubber or a combination thereof.\",\n \"In some embodiments, components of the equipment assembly comprise 304 or 316 stainless steel where possible.\",\n \"The powder can comprise one or more materials suitable for pharmaceutical or non-pharmaceutical use.\",\n \"In some embodiments, the powder comprises one or more pharmaceutical excipients, one or more pharmaceutically active agents, or a combination thereof.\",\n \"In some embodiments, the three-dimensionally printed article is a pharmaceutical dosage form, medical device, medical implant, or other such article as described.\",\n \"Exemplary types of pharmaceutical excipients that can be included in a three-dimensionally printed article include, by way of example and without limitation, chelating agent, preservative, adsorbent, acidifying agent, alkalizing agent, antifoaming agent, buffering agent, colorant, electrolyte, flavorant, polishing agent, salt, stabilizer, sweetening agent, tonicity modifier, antiadherent, binder, diluent, direct compression excipient, disintegrant, glidant, lubricant, opaquant, polishing agent, plasticizer, other pharmaceutical excipient, or a combination thereof.\",\n \"Exemplary types of non-pharmaceutical excipients that can be included in a three-dimensionally printed article include, by way of example and without limitation, ash, clay, ceramic, metal, polymer, biological material, plastic, inorganic material, salt, other such materials or a combination thereof.\",\n \"In some embodiments, the powder comprises one or more, two or more, three or more, four or more, five or more, six or more, seven or more, eight or more, nine or more, ten or more or plural components, each component being independently selected at each occurrence.\",\n \"In some embodiments, the equipment assembly comprises one or more, two or more, three or more, four or more, five or more, six or more, seven or more, eight or more, nine or more, ten or more or plural powder (or solid component) reservoirs.\",\n \"Pharmaceutically active agents generally include physiologically or pharmacologically active substances that produce a systemic or localized effect or effects in animals, cells, non-humans and humans.\",\n \"When an active agent is present, any such agent can be used.\",\n \"Exemplary classes of active agents include, by way of example and without limitation, pesticides, herbicides, insecticides, antioxidants, plant growth instigators, sterilization agents, catalysts, chemical reagents, food products, nutrients, cosmetics, vitamins, sterility inhibitors, fertility instigators, microorganisms, flavoring agents, sweeteners, cleansing agents and other such compounds for pharmaceutical, veterinary, horticultural, household, food, culinary, agricultural, cosmetic, industrial, cleaning, confectionery and flavoring applications.\",\n \"Whenever mentioned and unless otherwise specified, the term “active agent” includes all forms of the active agent including neutral, ionic, salt, basic, acidic, natural, synthetic, diastereomeric, isomeric, enantiomerically pure, racemic, hydrate, chelate, derivative, analog, optically active, optically enriched, free base, free acid, regioisomeric, amorphous, anhydrous and/or crystalline forms.\",\n \"A three-dimensionally printed dosage form can comprise one, two or more different active agents.\",\n \"Particular combinations of active agents can be provided.\",\n \"Some combinations of active agents include: 1) a first drug from a first therapeutic class and a different second drug from the same therapeutic class; 2) a first drug from a first therapeutic class and a different second drug from a different therapeutic class; 3) a first drug having a first type of biological activity and a different second drug having about the same biological activity; 4) a first drug having a first type of biological activity and a different second drug having a different second type of biological activity.\",\n \"Exemplary combinations of active agents are described herein.\",\n \"The active agent can be independently selected at each occurrence from active agents such as an antibiotic agent, antihistamine agent, decongestant, anti-inflammatory agent, antiparasitic agent, antiviral agent, local anesthetic, antifungal agent, amoebicidal agent, trichomonocidal agent, analgesic agent, anti-arthritic agent, anti-asthmatic agent, anticoagulant agent, anticonvulsant agent, antidepressant agent, antidiabetic agent, antineoplastic agent, anti-psychotic agent, neuroleptic agent, antihypertensive agent, hypnotic agent, sedative agent, anxiolytic energizer agent, antiparkinson agent, muscle relaxant agent, antimalarial agent, hormonal agent, contraceptive agent, sympathomimetic agent, hypoglycemic agent, antilipemic agent, ophthalmic agent, electrolytic agent, diagnostic agent, prokinetic agent, gastric acid secretion inhibitor agent, anti-ulcerant agent, anti-flatulent agent, anti-incontinence agent, cardiovascular agent or a combination thereof.\",\n \"A description of these and other classes of useful drugs and a listing of species within each class can be found in Martindale, The Extra Pharmacopoeia, 31ST Ed.\",\n \"(The Pharmaceutical Press, London 1996), the disclosure of which is incorporated herein by reference in its entirety.\",\n \"The above-mentioned lists should not be considered exhaustive and are merely exemplary of the many embodiments considered within the scope of the invention.\",\n \"Many other active agents can be included in the powder of the invention.\",\n \"The liquid applied to the powder can be a solution or suspension.\",\n \"The liquid can comprise an aqueous carrier, nonaqueous carrier, organic carrier or a combination thereof.\",\n \"The aqueous carrier can be water or an aqueous buffer.\",\n \"The nonaqueous carrier can be an organic solvent, low molecular weight polymer, oil, silicone, other suitable material, alcohol, ethanol, methanol, propanol, isopropanol, poly(ethylene glycol), glycol, other such materials or a combination thereof.\",\n \"In some embodiments, the equipment assembly comprises one or more, two or more, three or more, four or more or plural liquid reservoirs.\",\n \"The liquid can be colored or non-colored.\",\n \"The liquid can comprise pigment, paint, dye, tint, ink or a combination thereof.\",\n \"The liquid can comprise one or more solutes dissolved therein.\",\n \"The powder and/or liquid can comprise one or more binders.\",\n \"The exemplary embodiments herein should not be considered exhaustive, but merely illustrative of only a few of the many embodiments contemplated by the present invention.\",\n \"As used herein, the term “about” is taken to mean a value that is within ±10%, ±5% or ±1% of the indicated value.\",\n \"The entire disclosures of all documents cited herein are hereby incorporated by reference in their entirety.\",\n \"Example 1 The following materials and procedure are used to prepare three-dimensionally printed dosage forms that dissolve rapidly in saliva.\",\n \"A powder comprising at least one pharmaceutical carrier is loaded into the powder reservoir.\",\n \"A fluid comprising a liquid and at least one active ingredient is loaded into the fluid reservoir.\",\n \"The equipment assembly is operated, whereby plural stacked incremental layers of printed powder are sequentially formed in build modules by repeatedly passing the build modules through one or more build stations.\",\n \"Typically four to fifty incremental printed powder layers are formed and adhere to each other thereby forming a printed bed having one or more articles surrounded by or embedded in loose powder.\",\n \"The printed beds are dried in a dryer.\",\n \"The printed articles are separated from the loose powder with a harvester.\",\n \"The printed articles are then optionally dedusted with a deduster.\",\n \"The printed articles are then optionally packaged.\",\n \"The above is a detailed description of particular embodiments of the invention.\",\n \"It will be appreciated that, although specific embodiments of the invention have been described herein for purposes of illustration, various modifications may be made without departing from the spirit and scope of the invention.\",\n \"Accordingly, the invention is not limited except as by the appended claims.\",\n \"All of the embodiments disclosed and claimed herein can be made and executed without undue experimentation in light of the present disclosure.\"\n ]\n]"},"source":{"kind":"string","value":"Patent_15871445"}}},{"rowIdx":4493797,"cells":{"text":{"kind":"list like","value":[["ELECTROPHOTOGRAPHIC IMAGE FORMING DEVICE HAVING A REPLACEABLE UNIT THAT INCLUDES AN ENGAGEMENT MEMBER FOR POSITIONING A MAGNETIC SENSOR","An electrophotographic image forming device includes a replaceable unit having a housing that includes a top, a bottom, a front, and a rear positioned between a first side and a second side of the housing.","The housing has a reservoir for storing toner.","A rotatable shaft is positioned within the reservoir and has an axis of rotation.","A magnet in the reservoir is movable in response to rotation of the shaft.","An engagement member is positioned on an exterior of the top of the housing.","The engagement member is aligned with a point in a path of movement of the magnet in the reservoir.","The engagement member has a front surface that is unobstructed to contact and push a housing in the image forming device supporting a magnetic sensor to an operating position of the magnetic sensor during insertion of the replaceable unit into the image forming device."],["1.An electrophotographic image forming device, comprising: a replaceable unit including: a housing having a top, a bottom, a front, and a rear positioned between a first side and a second side of the housing, the housing having a reservoir for storing toner; a rotatable shaft positioned within the reservoir and having an axis of rotation; a magnet in the reservoir movable in response to rotation of the shaft; and an engagement member positioned on an exterior of the top of the housing, the engagement member is aligned with a point in a path of movement of the magnet in the reservoir, the engagement member has a front surface that is unobstructed to contact and push a housing in the image forming device supporting a magnetic sensor to an operating position of the magnetic sensor during insertion of the replaceable unit into the image forming device.","2.The electrophotographic image forming device of claim 1, wherein the magnet is rotatable around the axis of rotation of the shaft in response to rotation of the shaft.","3.The electrophotographic image forming device of claim 1, wherein the engagement member is axially aligned with the magnet relative to the axis of rotation of the shaft.","4.The electrophotographic image forming device of claim 1, wherein the magnet passes in close proximity to an inner surface of the housing forming the reservoir at a location where the engagement member is positioned on the exterior of the housing.","5.The electrophotographic image forming device of claim 1, wherein the engagement member projects upward from the top of the housing.","6.The electrophotographic image forming device of claim 1, wherein the front surface of the engagement member includes a pair of front engagement surfaces spaced axially apart from each other and aligned with each other along a front-to-rear dimension of the housing.","7.The electrophotographic image forming device of claim 1, wherein the engagement member includes a pair of side engagement surfaces that face each other, the side engagement surfaces are spaced axially apart from each other and aligned with each other along a front-to-rear dimension of the housing.","8.The electrophotographic image forming device of claim 1, wherein the replaceable unit includes a ramp positioned on the exterior of the housing in front of the engagement member and leading toward the engagement member, a top surface of the ramp inclines upward as the ramp extends toward the engagement member.","9.The electrophotographic image forming device of claim 8, wherein the replaceable unit includes a planar top surface that extends rearward from a rear end of the ramp to the engagement member, the planar top surface is substantially horizontal when the toner cartridge is in its operative orientation.","10.An electrophotographic image forming device, comprising: a replaceable unit including: a housing having a top, a bottom, a front, and a rear positioned between a first side and a second side of the housing, the housing having a reservoir for storing toner; a rotatable shaft positioned within the reservoir and having an axis of rotation; a magnet connected to the shaft and rotatable around the axis of rotation in response to rotation of the shaft; and an engagement member positioned on an exterior of the top of the housing, the engagement member is axially aligned with the magnet relative to the axis of rotation of the shaft, the engagement member has a frontward facing portion that is unobstructed to contact and align a housing in the image forming device supporting a magnetic sensor during insertion of the replaceable unit into the image forming device.","11.The electrophotographic image forming device of claim 10, wherein the magnet passes in close proximity to an inner surface of the housing forming the reservoir at a location where the engagement member is positioned on the exterior of the housing.","12.The electrophotographic image forming device of claim 10, wherein the engagement member projects upward from the top of the housing.","13.The electrophotographic image forming device of claim 10, wherein the front surface of the engagement member includes a pair of front engagement surfaces spaced axially apart from each other and aligned with each other along a front-to-rear dimension of the housing.","14.The electrophotographic image forming device of claim 10, wherein the engagement member includes a pair of side engagement surfaces that face each other, the side engagement surfaces are spaced axially apart from each other and aligned with each other along a front-to-rear dimension of the housing.","15.The electrophotographic image forming device of claim 10, wherein the replaceable unit includes a ramp positioned on the exterior of the housing in front of the engagement member and leading toward the engagement member, a top surface of the ramp inclines upward as the ramp extends toward the engagement member.","16.The electrophotographic image forming device of claim 15, wherein the replaceable unit includes a planar top surface that extends rearward from a rear end of the ramp to the engagement member, the planar top surface is substantially horizontal when the toner cartridge is in its operative orientation.","17.An electrophotographic image forming device, comprising: a replaceable unit including: a housing having a top, a bottom, a front, and a rear positioned between a first side and a second side of the housing, the housing having a reservoir for storing toner; a rotatable shaft positioned within the reservoir and having an axis of rotation; a magnet in the reservoir movable in response to rotation of the shaft; and an engagement member positioned on an exterior of the top of the housing, the engagement member is configured to align a magnetic sensor in the image forming device with a point in a path of movement of the magnet in the reservoir during insertion of the replaceable unit into the image forming device."],[" BACKGROUND "],[" SUMMARY A replaceable unit for an electrophotographic image forming device according to one example embodiment includes a housing having a top, a bottom, a front, and a rear positioned between a first side and a second side of the housing.","The housing has a reservoir for storing toner.","A rotatable shaft is positioned within the reservoir and has an axis of rotation.","A magnet in the reservoir is movable in response to rotation of the shaft.","An engagement member is positioned on an exterior of the top of the housing.","The engagement member is aligned with a point in a path of movement of the magnet in the reservoir.","The engagement member has a front surface that is unobstructed to contact and push a housing in the image forming device supporting a magnetic sensor to an operating position of the magnetic sensor during insertion of the replaceable unit into the image forming device.","In some embodiments, the magnet is rotatable around the axis of rotation of the shaft in response to rotation of the shaft.","In some embodiments, the engagement member is axially aligned with the magnet relative to the axis of rotation of the shaft.","Embodiments include those where the magnet passes in close proximity to an inner surface of the housing forming the reservoir at a location where the engagement member is positioned on the exterior of the housing.","In some embodiments, the engagement member projects upward from the top of the housing.","Embodiments include those where the front surface of the engagement member includes a pair of front engagement surfaces spaced axially apart from each other and aligned with each other along a front-to-rear dimension of the housing.","Embodiments also include those where the engagement member includes a pair of side engagement surfaces that face each other and that are spaced axially apart from each other and aligned with each other along a front-to-rear dimension of the housing.","In some embodiments, a ramp is positioned on the exterior of the housing in front of the engagement member and leading toward the engagement member.","A top surface of the ramp inclines upward as the ramp extends toward the engagement member.","A planar top surface may extend rearward from a rear end of the ramp to the engagement member.","The planar top surface may be substantially horizontal when the toner cartridge is in its operative orientation.","A replaceable unit for an electrophotographic image forming device according to another example embodiment includes a housing having a top, a bottom, a front, and a rear positioned between a first side and a second side of the housing.","The housing has a reservoir for storing toner.","A rotatable shaft is positioned within the reservoir and has an axis of rotation.","A magnet is connected to the shaft and rotatable around the axis of rotation in response to rotation of the shaft.","An engagement member is positioned on an exterior of the top of the housing.","The engagement member is axially aligned with the magnet relative to the axis of rotation of the shaft.","The engagement member has a frontward facing portion that is unobstructed to contact and align a housing in the image forming device supporting a magnetic sensor during insertion of the replaceable unit into the image forming device.","A replaceable unit for an electrophotographic image forming device according to another example embodiment includes a housing having a top, a bottom, a front, and a rear positioned between a first side and a second side of the housing.","The housing has a reservoir for storing toner.","A rotatable shaft is positioned within the reservoir and has an axis of rotation.","A magnet in the reservoir is movable in response to rotation of the shaft.","An engagement member is positioned on an exterior of the top of the housing.","The engagement member is configured to align a magnetic sensor in the image forming device with a point in a path of movement of the magnet in the reservoir during insertion of the replaceable unit into the image forming device."],["CROSS REFERENCES TO RELATED APPLICATIONS This patent application is a continuation application of U.S. patent application Ser.","No.","15/408,500, filed Jan. 18, 2017, entitled “Replaceable Unit for an Electrophotographic Image Forming Device Having an Engagement Member for Positioning a Magnetic Sensor,” which is a continuation application of U.S. patent application Ser.","No.","15/202,639, filed Jul.","6, 2016, issued as U.S. Pat.","No.","9,588,462 on Mar.","7, 2017, entitled “Replaceable Unit for an Electrophotographic Image Forming Device Having an Engagement Member for Positioning a Magnetic Sensor,” which is a continuation application of U.S. patent application Ser.","No.","15/019,277, filed Feb. 9, 2016, issued as U.S. Pat.","No.","9,417,600 on Aug. 16, 2016, entitled “Replaceable Unit for an Electrophotographic Image Forming Device Having an Engagement Member for Positioning a Magnetic Sensor,” which is a continuation application of U.S. patent application Ser.","No.","14/631,146, filed Feb. 25, 2015, issued as U.S. Pat.","No.","9,291,989 on Mar.","22, 2016, entitled “Replaceable Unit for an Electrophotographic Image Forming Device Having an Engagement Member for Positioning a Magnetic Sensor.” BACKGROUND 1.Field of the Disclosure The present disclosure relates generally to image forming devices and more particularly to a replaceable unit for an electrophotographic image forming device having an engagement member for positioning a magnetic sensor.","2.Description of the Related Art During the electrophotographic printing process, an electrically charged rotating photoconductive drum is selectively exposed to a laser beam.","The areas of the photoconductive drum exposed to the laser beam are discharged creating an electrostatic latent image of a page to be printed on the photoconductive drum.","Toner particles are then electrostatically picked up by the latent image on the photoconductive drum creating a toned image on the drum.","The toned image is transferred to the print media (e.g., paper) either directly by the photoconductive drum or indirectly by an intermediate transfer member.","The toner is then fused to the media using heat and pressure to complete the print.","The image forming device's toner supply is typically stored in one or more replaceable units that have a shorter lifespan than the image forming device.","It is desired to communicate various characteristics of the replaceable unit(s) to the image forming device for proper operation.","For example, as these replaceable units run out of toner, the units must be replaced or refilled in order to continue printing.","As a result, it may be desired to communicate the amount of toner remaining in the replaceable unit(s) to the image forming device in order to warn the user that the replaceable unit is near an empty state or to prevent printing after the unit is empty in order to prevent damage to the image forming device.","It may be desired to communicate other characteristics of the replaceable unit(s) to the image forming device such as toner type, toner color, toner capacity, replaceable unit serial number, replaceable unit type, etc.","SUMMARY A replaceable unit for an electrophotographic image forming device according to one example embodiment includes a housing having a top, a bottom, a front, and a rear positioned between a first side and a second side of the housing.","The housing has a reservoir for storing toner.","A rotatable shaft is positioned within the reservoir and has an axis of rotation.","A magnet in the reservoir is movable in response to rotation of the shaft.","An engagement member is positioned on an exterior of the top of the housing.","The engagement member is aligned with a point in a path of movement of the magnet in the reservoir.","The engagement member has a front surface that is unobstructed to contact and push a housing in the image forming device supporting a magnetic sensor to an operating position of the magnetic sensor during insertion of the replaceable unit into the image forming device.","In some embodiments, the magnet is rotatable around the axis of rotation of the shaft in response to rotation of the shaft.","In some embodiments, the engagement member is axially aligned with the magnet relative to the axis of rotation of the shaft.","Embodiments include those where the magnet passes in close proximity to an inner surface of the housing forming the reservoir at a location where the engagement member is positioned on the exterior of the housing.","In some embodiments, the engagement member projects upward from the top of the housing.","Embodiments include those where the front surface of the engagement member includes a pair of front engagement surfaces spaced axially apart from each other and aligned with each other along a front-to-rear dimension of the housing.","Embodiments also include those where the engagement member includes a pair of side engagement surfaces that face each other and that are spaced axially apart from each other and aligned with each other along a front-to-rear dimension of the housing.","In some embodiments, a ramp is positioned on the exterior of the housing in front of the engagement member and leading toward the engagement member.","A top surface of the ramp inclines upward as the ramp extends toward the engagement member.","A planar top surface may extend rearward from a rear end of the ramp to the engagement member.","The planar top surface may be substantially horizontal when the toner cartridge is in its operative orientation.","A replaceable unit for an electrophotographic image forming device according to another example embodiment includes a housing having a top, a bottom, a front, and a rear positioned between a first side and a second side of the housing.","The housing has a reservoir for storing toner.","A rotatable shaft is positioned within the reservoir and has an axis of rotation.","A magnet is connected to the shaft and rotatable around the axis of rotation in response to rotation of the shaft.","An engagement member is positioned on an exterior of the top of the housing.","The engagement member is axially aligned with the magnet relative to the axis of rotation of the shaft.","The engagement member has a frontward facing portion that is unobstructed to contact and align a housing in the image forming device supporting a magnetic sensor during insertion of the replaceable unit into the image forming device.","A replaceable unit for an electrophotographic image forming device according to another example embodiment includes a housing having a top, a bottom, a front, and a rear positioned between a first side and a second side of the housing.","The housing has a reservoir for storing toner.","A rotatable shaft is positioned within the reservoir and has an axis of rotation.","A magnet in the reservoir is movable in response to rotation of the shaft.","An engagement member is positioned on an exterior of the top of the housing.","The engagement member is configured to align a magnetic sensor in the image forming device with a point in a path of movement of the magnet in the reservoir during insertion of the replaceable unit into the image forming device.","BRIEF DESCRIPTION OF THE DRAWINGS The accompanying drawings incorporated in and forming a part of the specification, illustrate several aspects of the present disclosure, and together with the description serve to explain the principles of the present disclosure.","FIG.","1 is a block diagram of an imaging system according to one example embodiment.","FIG.","2 is a perspective view of a toner cartridge and an imaging unit according to one example embodiment.","FIG.","3 is a front perspective view of the toner cartridge shown in FIG.","2.FIG.","4 is a rear perspective view of the toner cartridge shown in FIGS.","2 and 3.FIG.","5 is an exploded view of the toner cartridge shown in FIGS.","2-4 showing a reservoir for holding toner therein.","FIG.","6 is a cross-sectional side view of the toner cartridge installed in an image forming device according to one example embodiment.","FIG.","7 is a bottom perspective view of a magnetic sensor housing according to one example embodiment.","FIG.","8 is a top perspective view of the magnetic sensor housing shown in FIG.","7.FIG.","9 is a front perspective view of the toner cartridge shown in FIGS.","2-5 with a portion of a front wall of the toner cartridge removed to illustrate a portion of the reservoir according to one example embodiment.","FIG.","10 is a top plan view of an engagement member of the toner cartridge shown in FIG.","9 according to one example embodiment.","FIG.","11 is a side elevation view of the toner cartridge as it enters the image forming device.","FIG.","12 is a side elevation view of the toner cartridge inserted further into the image forming device with the toner cartridge contacting the magnetic sensor housing.","FIG.","13 is a side elevation view of the toner cartridge inserted further into the image forming device with the toner cartridge having moved the magnetic sensor housing to its final vertical position.","FIGS.","14A and 14B are a side elevation view and a top cross sectional view, respectively, of the toner cartridge inserted further into the image forming device with the engagement member of the toner cartridge approaching the magnetic sensor housing.","FIGS.","15A and 15B are a side elevation view and a top cross sectional view, respectively, of the toner cartridge inserted further into the image forming device with engagement surfaces of the engagement member of the toner cartridge contacting corresponding engagement surfaces of the magnetic sensor housing.","FIG.","16 is a side elevation view of the toner cartridge fully installed in the image forming device and the magnetic sensor housing in its operating position.","FIG.","17A is a top plan view of a first engagement member of the toner cartridge according to one example embodiment.","FIG.","17B is a top plan view of a second engagement member of the toner cartridge according to one example embodiment.","FIG.","17C is a top plan view of a third engagement member of the toner cartridge according to one example embodiment.","FIG.","17D is front perspective view of a fourth engagement member of the toner cartridge according to one example embodiment.","FIG.","18 is a perspective view of a paddle assembly of the toner cartridge according to one example embodiment.","FIGS.","19A-19C are cross-sectional side views of the toner cartridge illustrating the operation of a sensing linkage at various toner levels according to one example embodiment.","FIG.","20 is a perspective view of a paddle assembly of the toner cartridge according to another example embodiment.","DETAILED DESCRIPTION In the following description, reference is made to the accompanying drawings where like numerals represent like elements.","The embodiments are described in sufficient detail to enable those skilled in the art to practice the present disclosure.","It is to be understood that other embodiments may be utilized and that process, electrical, and mechanical changes, etc., may be made without departing from the scope of the present disclosure.","Examples merely typify possible variations.","Portions and features of some embodiments may be included in or substituted for those of others.","The following description, therefore, is not to be taken in a limiting sense and the scope of the present disclosure is defined only by the appended claims and their equivalents.","Referring now to the drawings and particularly to FIG.","1, there is shown a block diagram depiction of an imaging system 20 according to one example embodiment.","Imaging system 20 includes an image forming device 22 and a computer 24.Image forming device 22 communicates with computer 24 via a communications link 26.As used herein, the term “communications link” generally refers to any structure that facilitates electronic communication between multiple components and may operate using wired or wireless technology and may include communications over the Internet.","In the example embodiment shown in FIG.","1, image forming device 22 is a multifunction machine (sometimes referred to as an all-in-one (AIO) device) that includes a controller 28, a print engine 30, a laser scan unit (LSU) 31, an imaging unit 32, a toner cartridge 35, a user interface 36, a media feed system 38, a media input tray 39 and a scanner system 40.Image forming device 22 may communicate with computer 24 via a standard communication protocol, such as for example, universal serial bus (USB), Ethernet or IEEE 802.xx.","Image forming device 22 may be, for example, an electrophotographic printer/copier including an integrated scanner system 40 or a standalone electrophotographic printer.","Controller 28 includes a processor unit and associated electronic memory 29.The processor may include one or more integrated circuits in the form of a microprocessor or central processing unit and may be formed as one or more Application-specific integrated circuits (ASICs).","Memory 29 may be any volatile or non-volatile memory or combination thereof such as, for example, random access memory (RAM), read only memory (ROM), flash memory and/or non-volatile RAM (NVRAM).","Alternatively, memory 29 may be in the form of a separate memory (e.g., RAM, ROM, and/or NVRAM), a hard drive, a CD or DVD drive, or any memory device convenient for use with controller 28.Controller 28 may be, for example, a combined printer and scanner controller.","In the example embodiment illustrated, controller 28 communicates with print engine 30 via a communications link 50.Controller 28 communicates with imaging unit 32 and processing circuitry 44 thereon via a communications link 51.Controller 28 communicates with toner cartridge 35 and processing circuitry 45 thereon via a communications link 52.Controller 28 communicates with media feed system 38 via a communications link 53.Controller 28 communicates with scanner system 40 via a communications link 54.User interface 36 is communicatively coupled to controller 28 via a communications link 55.Processing circuitry 44, 45 may provide authentication functions, safety and operational interlocks, operating parameters and usage information related to imaging unit 32 and toner cartridge 35, respectively.","Controller 28 processes print and scan data and operates print engine 30 during printing and scanner system 40 during scanning.","Computer 24, which is optional, may be, for example, a personal computer, including electronic memory 60, such as RAM, ROM, and/or NVRAM, an input device 62, such as a keyboard and/or a mouse, and a display monitor 64.Computer 24 also includes a processor, input/output (I/O) interfaces, and may include at least one mass data storage device, such as a hard drive, a CD-ROM and/or a DVD unit (not shown).","Computer 24 may also be a device capable of communicating with image forming device 22 other than a personal computer such as, for example, a tablet computer, a smartphone, or other electronic device.","In the example embodiment illustrated, computer 24 includes in its memory a software program including program instructions that function as an imaging driver 66, e.g., printer/scanner driver software, for image forming device 22.Imaging driver 66 is in communication with controller 28 of image forming device 22 via communications link 26.Imaging driver 66 facilitates communication between image forming device 22 and computer 24.One aspect of imaging driver 66 may be, for example, to provide formatted print data to image forming device 22, and more particularly to print engine 30, to print an image.","Another aspect of imaging driver 66 may be, for example, to facilitate collection of scanned data from scanner system 40.In some circumstances, it may be desirable to operate image forming device 22 in a standalone mode.","In the standalone mode, image forming device 22 is capable of functioning without computer 24.Accordingly, all or a portion of imaging driver 66, or a similar driver, may be located in controller 28 of image forming device 22 so as to accommodate printing and/or scanning functionality when operating in the standalone mode.","Print engine 30 includes a laser scan unit (LSU) 31, toner cartridge 35, imaging unit 32, and a fuser 37, all mounted within image forming device 22.Imaging unit 32 is removably mounted in image forming device 22 and includes a developer unit 34 that houses a toner sump and a toner delivery system.","In one embodiment, the toner delivery system utilizes what is commonly referred to as a single component development system.","In this embodiment, the toner delivery system includes a toner adder roll that provides toner from the toner sump to a developer roll.","A doctor blade provides a metered uniform layer of toner on the surface of the developer roll.","In another embodiment, the toner delivery system utilizes what is commonly referred to as a dual component development system.","In this embodiment, toner in the toner sump of developer unit 34 is mixed with magnetic carrier beads.","The magnetic carrier beads may be coated with a polymeric film to provide triboelectric properties to attract toner to the carrier beads as the toner and the magnetic carrier beads are mixed in the toner sump.","In this embodiment, developer unit 34 includes a magnetic roll that attracts the magnetic carrier beads having toner thereon to the magnetic roll through the use of magnetic fields.","Imaging unit 32 also includes a cleaner unit 33 that houses a photoconductive drum and a waste toner removal system.","Toner cartridge 35 is removably mounted in imaging forming device 22 in a mating relationship with developer unit 34 of imaging unit 32.An outlet port on toner cartridge 35 communicates with an entrance port on developer unit 34 allowing toner to be periodically transferred from toner cartridge 35 to resupply the toner sump in developer unit 34.The electrophotographic printing process is well known in the art and, therefore, is described briefly herein.","During a printing operation, laser scan unit 31 creates a latent image on the photoconductive drum in cleaner unit 33.Toner is transferred from the toner sump in developer unit 34 to the latent image on the photoconductive drum by the developer roll (in the case of a single component development system) or by the magnetic roll (in the case of a dual component development system) to create a toned image.","The toned image is then transferred to a media sheet received by imaging unit 32 from media input tray 39 for printing.","Toner may be transferred directly to the media sheet by the photoconductive drum or by an intermediate transfer member that receives the toner from the photoconductive drum.","Toner remnants are removed from the photoconductive drum by the waste toner removal system.","The toner image is bonded to the media sheet in fuser 37 and then sent to an output location or to one or more finishing options such as a duplexer, a stapler or a hole-punch.","Referring now to FIG.","2, a toner cartridge 100 and an imaging unit 200 are shown according to one example embodiment.","Imaging unit 200 includes a developer unit 202 and a cleaner unit 204 mounted on a common frame 206.As discussed above, imaging unit 200 and toner cartridge 100 are each removably installed in image forming device 22.Imaging unit 200 is first slidably inserted into image forming device 22.Toner cartridge 100 is then inserted into image forming device 22 and onto frame 206 in a mating relationship with developer unit 202 of imaging unit 200 as indicated by the arrow shown in FIG.","2.This arrangement allows toner cartridge 100 to be removed and reinserted easily when replacing an empty toner cartridge 100 without having to remove imaging unit 200.Imaging unit 200 may also be readily removed as desired in order to maintain, repair or replace the components associated with developer unit 202, cleaner unit 204 or frame 206 or to clear a media jam.","With reference to FIGS.","2-5, toner cartridge 100 includes a housing 102 having an enclosed reservoir 104 (FIG.","5) for storing toner.","Housing 102 may include a top or lid 106 mounted on a base 108.Base 108 includes first and second side walls 110, 112 connected to adjoining front and rear walls 114, 116 and a bottom 117.In one embodiment, top 106 is ultrasonically welded to base 108 thereby forming enclosed reservoir 104.First and second end caps 118, 120 may be mounted to side walls 110, 112, respectively, and may include guides 122 to assist the insertion of toner cartridge 100 into image forming device 22 for mating with developer unit 202.First and second end caps 118, 120 may be snap fitted into place or attached by screws or other fasteners.","Guides 122 travel in corresponding channels within image forming device 22.Legs 124 may also be provided on bottom 117 of base 106 or end caps 118, 120 to assist with the insertion of toner cartridge 100 into image forming device 22.Legs 124 are received by frame 206 to facilitate the mating of toner cartridge 100 with developer unit 202.A handle 126 may be provided on top 106 or base 108 of toner cartridge 100 to assist with insertion and removal of toner cartridge 100 from imaging unit 200 and image forming device 22.An outlet port 128 is positioned on front wall 114 of toner cartridge 100 for exiting toner from toner cartridge 100.With reference to FIG.","5, various drive gears are housed within a space formed between end cap 118 and side wall 110.A main interface gear 130 engages with a drive system in image forming device 22 that provides torque to main interface gear 130.A paddle assembly 140 is rotatably mounted within toner reservoir 104 with first and second ends of a drive shaft 132 of paddle assembly 140 extending through aligned openings in side walls 110, 112, respectively.","A drive gear 134 is provided on the first end of drive shaft 132 that engages with main interface gear 130 either directly or via one or more intermediate gears.","Bushings may be provided on each end of drive shaft 132 where it passes through side walls 110, 112.An auger 136 having first and second ends 136a, 136b and a spiral screw flight is positioned in a channel 138 extending along the width of front wall 114 between side walls 110, 112.Channel 138 may be integrally molded as part of front wall 114 or formed as a separate component that is attached to front wall 114.Channel 138 is generally horizontal in orientation along with toner cartridge 100 when toner cartridge 100 is installed in image forming device 22.First end 136a of auger 136 extends through side wall 110 and a drive gear (not shown) is provided on first end 136a that engages with main interface gear 130 either directly or via one or more intermediate gears.","Channel 138 may include an open portion 138a and an enclosed portion 138b.","Open portion 138a is open to toner reservoir 104 and extends from side wall 110 toward second end 136b of auger 136.Enclosed portion 138b of channel 138 extends from side wall 112 and encloses an optional shutter and second end 136b of auger 136.In this embodiment, outlet port 128 is positioned at the bottom of enclosed portion 138b of channel 138 so that gravity will assist in exiting toner through outlet port 128.The shutter is movable between a closed position blocking toner from exiting outlet port 128 and an open position permitting toner to exit outlet port 128.As paddle assembly 140 rotates, it delivers toner from toner reservoir 104 into open portion 138a of channel 138.As auger 136 rotates, it delivers toner received in channel 138 into enclosed portion 138b of channel 138 where the toner passes out of outlet port 128 into a corresponding entrance port 208 in developer unit 202 (FIG.","2).","In one embodiment, entrance port 208 of developer unit 202 is surrounded by a foam seal 210 that traps residual toner and prevents toner leakage at the interface between outlet port 128 and entrance port 208.The drive system in image forming device 22 includes a drive motor and a drive transmission from the drive motor to a drive gear that mates with main interface gear 130 when toner cartridge 100 is installed in image forming device 22.The drive system in image forming device 22 may include an encoded device, such as an encoder wheel, (e.g., coupled to a shaft of the drive motor) and an associated code reader, such as an infrared sensor, to sense the motion of the encoded device.","The code reader is in communication with controller 28 in order to permit controller 28 to track the amount of rotation of main interface gear 130, auger 136 and paddle assembly 140.Although the example embodiment shown in FIGS.","2-5 includes a pair of replaceable units in the form of toner cartridge 100 and imaging unit 200, it will be appreciated that the replaceable unit(s) of the image forming device may employ any suitable configuration as desired.","For example, in one embodiment, the main toner supply for the image forming device, the developer unit, and the cleaner unit are housed in one replaceable unit.","In another embodiment, the main toner supply for the image forming device and the developer unit are provided in a first replaceable unit and the cleaner unit is provided in a second replaceable unit.","Further, although the example image forming device 22 discussed above includes one toner cartridge and corresponding imaging unit, in the case of an image forming device configured to print in color, separate replaceable units may be used for each toner color needed.","For example, in one embodiment, the image forming device includes four toner cartridges and four corresponding imaging units, each toner cartridge containing a particular toner color (e.g., black, cyan, yellow and magenta) and each imaging unit corresponding with one of the toner cartridges to permit color printing.","FIG.","6 is a cross-sectional side view of toner cartridge 100 installed in image forming device 22 according to one example embodiment.","Paddle assembly 140 includes at least one permanent magnet, such as magnets 150, 168a and 168b shown in FIG.","6, that moves within reservoir 104 in response to the rotation of drive shaft 132 and paddle assembly 140.As discussed in greater detail below, the permanent magnet(s) communicate information about toner cartridge 100 to controller 28 of image forming device 22.Image forming device 22 includes a magnetic sensor 300 positioned to detect the motion of the permanent magnet(s) during rotation of shaft 132 when toner cartridge 100 is installed in image forming device 22.Magnetic sensor 300 is in electronic communication with controller 28.In the example embodiment illustrated, magnetic sensor 300 is positioned adjacent to top 106 of housing 102.In other embodiments, magnetic sensor 300 is positioned adjacent to bottom 117, front wall 114, rear wall 116 or side wall 110 or 112.In those embodiments where magnetic sensor 300 is positioned adjacent to top 106, bottom 117, front wall 114 or rear wall 116, the magnet(s) are positioned adjacent to the inner surfaces of top 106, bottom 117, front wall 114 or rear wall 116 as shaft 132 rotates.","In those embodiments where magnetic sensor 300 is positioned adjacent to side wall 110 or 112, the magnet(s) are positioned adjacent to the inner surface of side wall 110 or 112.Magnetic sensor 300 may be any suitable device capable of detecting the presence or absence of a magnetic field.","For example, magnetic sensor 300 may be a hall-effect sensor, which is a transducer that varies its electrical output in response to a magnetic field.","Magnetic sensor 300 is supported by a housing 302 that is movable within image forming device 22.As discussed in greater detail below, housing 302 is biased toward a home position that is in the insertion path of toner cartridge 100 such that as toner cartridge 100 is installed in image forming device 22, an engagement member (not shown in FIG.","6 for clarity) on toner cartridge 100 contacts and moves housing 302 into position to detect the permanent magnet(s) in reservoir 104.The positioning of housing 302 by toner cartridge 100 upon installation of toner cartridge 100 into image forming device 22 permits the accurate positioning of magnetic sensor 300 relative to the permanent magnet(s) of each individual toner cartridge 100 installed in image forming device 22 regardless of manufacturing variations between different toner cartridges 100.If instead housing 302 is positioned at a fixed location in image forming device 22, depending on physical variations between different toner cartridges 100, magnetic sensor 300 may not be properly positioned to detect the permanent magnet(s) of a given toner cartridge 100.FIGS.","7 and 8 show housing 302 according to one example embodiment.","In this embodiment, housing 302 is positioned adjacent to top 106 of housing 102 as shown in FIG.","6.Housing 302 includes a bottom 304 that faces toward top 106 of housing 102 when toner cartridge 100 is installed in image forming device 22 and a top 306 that faces away from toner cartridge 100.As shown in FIG.","7, in the embodiment illustrated, magnetic sensor 300 is exposed on bottom 304 of housing 302 to permit detection of the permanent magnet(s) of toner cartridge 100.Housing 302 includes a rear 310 that faces toward the direction from which toner cartridge 100 is inserted into image forming device 22 and a front 308 opposite rear 310.Housing 302 also includes a pair of sides 312, 314.Housing 302 is loosely mounted to a frame 316 that is fixedly positioned in image forming device 22.Housing 302 is slidable forward and rearward within an opening 322 in frame 316 between a front end 318 of frame 316 and a rear end 320 of frame 316.Housing 302 is biased toward rear end 320 such as, for example, by one or more extension springs 324.In the embodiment illustrated, extension springs 324 are attached at one end to housing 302 and at the opposite end to rear end 320 of frame 316.Other suitable biasing members may be used such as, for example, one or more compression springs or a material having resilient properties that bias housing 302 toward rear end 320.Housing 302 is movable vertically up and down relative to frame 316 and biased downward such as, for example, by one or more compression springs.","In the embodiment illustrated, a compression spring (not shown) is positioned between housing 302 and a plunger 328 that is loosely attached to housing 302 and movable up and down relative to housing 302.A top contact surface 330 of plunger 328 is in pressed contact with the bottom side of a frame 332 (FIG.","6) of image forming device 22.Other suitable biasing members may be used such as, for example, one or more extension springs or a material having resilient properties that bias housing 302 downward.","Housing 302 is also movable side-to-side within opening 322.In the example embodiment illustrated, frame 316 includes a pair of ledges 334, 335 on opposite sides of opening 322 that run from front end 318 to rear end 320.Housing 302 includes a corresponding pair of guides 336, 337 that run along sides 312, 314 of housing 302 along a front-to-rear dimension of housing 302.The downward bias on housing 302 (e.g., the force from the compression spring on housing 302 resulting from the contact between plunger 328 and frame 332) pushes the bottom surfaces of guides 336, 337 into contact with top surfaces 334a, 335a of ledges 334, 335, respectively.","Top surfaces 334a, 335a of ledges 334, 335 also guide the front-to-rear sliding movement of housing 302 when the bottom surfaces of guides 336, 337 are in contact with top surfaces 334a, 335a of ledges 334, 335.Inner surfaces 334b, 335b of ledges 334, 335 limit the side-to-side movement of housing 302 relative to frame 316.As shown in FIG.","7, in the embodiment illustrated, housing 302 includes a tapered nose 340 at its rear 310.A bottom surface 340a of nose 340 projects further downward as bottom surface 340a extends from rear 310 toward front 308.The side surfaces 340b, 340c of nose 340 project further outward as side surfaces 340b, 340c extend from rear 310 toward front 308.Nose 340 may include a planar rear surface 340d as illustrated or a curved or pointed rear surface 340d.","In the embodiment illustrated, housing 302 also includes a pair of rearward facing engagement surfaces 342, 343.In one embodiment, engagement surfaces 342, 343 receive contact from a corresponding engagement member on toner cartridge 100 to move housing 302 to its operating position where magnetic sensor 300 is aligned with the permanent magnet(s) in reservoir 104 as discussed in greater detail below.","With reference to FIGS.","9 and 10, toner cartridge 100 is shown with a portion of front wall 114 removed in order to illustrate a portion of reservoir 104.Toner cartridge 100 includes an engagement member 190 positioned on the exterior of housing 102 to contact and move housing 302 into position for magnetic sensor 300 to detect the permanent magnet(s) in reservoir 104.In the example embodiment illustrated, engagement member 190 projects upward from top 106 of housing 102; however, engagement member 190 may be positioned in other locations on housing 102 depending on the position of magnetic sensor 300 in image forming device 22 and the position(s) of the permanent magnet(s) in reservoir 104.In the example embodiment illustrated, engagement member 190 includes a U-shaped projection; however, engagement member 190 may take any suitable form.","In one embodiment, the permanent magnet(s) in reservoir 104 are positioned to pass in close proximity to the inner surface of housing 102 at the location where engagement member 190 is positioned on the exterior of housing 102.In some embodiments where magnetic sensor 300 is positioned adjacent to bottom 117, front wall 114, rear wall 116 or side wall 110 or 112, engagement member 190 is axially aligned relative to drive shaft 132 with the permanent magnet(s), e.g., magnets 150, 168a and 168b, of paddle assembly 140.A front surface 191 of engagement member 190 is unobstructed to allow front surface 191 to directly contact housing 302 during insertion of toner cartridge 100 into image forming device 22.In the example embodiment illustrated, engagement member 190 includes a rear portion 192 that forms the bottom of the “U” shape and a pair of forward extending portions 193 that are spaced axially apart from each other and form the upper portions of the “U” shape.","In the example embodiment illustrated, front surface 191 of engagement member 190 includes a pair of front engagement surfaces 194, 195 positioned at frontmost ends of forward extending portions 193.In one embodiment, front engagement surfaces 194, 195 are aligned with each other in the front-to-rear dimension of housing 102.Engagement surfaces 194, 195 are positioned to directly contact engagement surfaces 342, 343 of housing 302 as toner cartridge 100 is inserted into image forming device 22 to move housing 302 to its operating position as discussed in greater detail below.","In the example embodiment illustrated, forward extending portions 193 include inner side surfaces 193a, 193b that face each other and are aligned with each other in the front-to-rear dimension of housing 102.Toner cartridge 100 may also include a lead-in ramp 196 positioned in front of and leading toward engagement member 190 and axially aligned relative to drive shaft 132 with the permanent magnet(s) of paddle assembly 140.The top surface of ramp 196 inclines upward as ramp 196 extends toward engagement member 190.In one embodiment, the top surface of ramp 196 is substantially planar and includes a substantially constant slope.","Toner cartridge 100 may include a planar top surface 198 that extends forward from engagement member 190 and that is axially aligned relative to drive shaft 132 with the permanent magnet(s) of paddle assembly 140.In the embodiment illustrated, ramp 196 leads to planar top surface 198, which continues rearward along top 106 of housing 102 from ramp 196 to rear portion 192 of engagement member 190.In one embodiment, planar top surface 198 is substantially horizontal when toner cartridge 100 is in its operative orientation, i.e., the orientation of toner cartridge 100 when it is fully installed in image forming device 22.FIGS.","11-16 are sequential views that illustrate the interaction between engagement member 190 of toner cartridge 100 and housing 302 of magnetic sensor 300 when toner cartridge 100 is inserted into image forming device 22.FIG.","11 shows toner cartridge 100 as it enters image forming device 22 before contacting housing 302 of magnetic sensor 300.As shown in FIG.","11, housing 302 is biased rearward against rear end 320 of opening 322 in frame 316.Housing 302 is also biased downward against top surfaces 334a, 335a of ledges 334, 335 with top contact surface 330 of plunger 328 in contact with the bottom side of frame 332 of image forming device 22.FIG.","12 shows toner cartridge 100 inserted further into image forming device 22.As toner cartridge 100 first contacts housing 302, lead-in ramp 196 of toner cartridge 100 contacts tapered bottom surface 340a of nose 340 of housing 302.As toner cartridge 100 advances, lead-in ramp 196 slides across tapered bottom surface 340a of nose 340 applying an upward force on housing 302 that overcomes the downward bias on housing 302 causing housing 302 to gradually lift upward.","As shown in FIG.","13, housing 302 reaches its final vertical position once the rear end of ramp 196 reaches the bottom 304 of housing 302.As toner cartridge 100 advances further, planar top surface 198 slides across bottom 304 of housing 302 and engagement member 190 advances toward housing 302.With reference to FIGS.","14A and 14B, as toner cartridge 100 advances further, rear 310 of housing 302 reaches engagement member 190.If housing 302 is misaligned with toner cartridge 100 in the side-to-side direction, inner side surfaces 193a, 193b of forward extending portions 193 of engagement members 190 directly contact one or both of the tapered side surfaces 340b, 340c of nose 340.The contact between inner side surfaces 193a, 193b of forward extending portions 193 of engagement members 190 and side surfaces 340b, 340c of nose 340 align housing 302 with engagement member 190 in the side-to-side direction as toner cartridge 100 advances.","FIGS.","15A and 15B show housing 302 aligned in the side-to-side direction with engagement member 190 and toner cartridge 100 advanced to the point where engagement surfaces 194, 195 have begun to contact corresponding rearward facing engagement surfaces 342, 343 of housing 302.As toner cartridge 100 advances further, the contact between bottom 304 and planar top surface 198 maintains the vertical position of housing 302 relative to toner cartridge 100 and the inner side surfaces 193a, 193b of forward extending portions 193 of engagement members 190 ensure that the side-to-side alignment of housing 302 relative to toner cartridge 100 is maintained.","As toner cartridge 100 continues to advance to its operating position, the contact between engagement surfaces 194, 195 of engagement member 190 of toner cartridge 100 and rearward facing engagement surfaces 342, 343 of housing 302 overcomes the rearward bias on housing 302 causing housing 302 to slide in opening 322 toward front end 318 of frame 316.In this manner, engagement surfaces 194, 195 of engagement member 190 push against rearward facing engagement surfaces 342, 343 of housing 302 causing housing 302 to move forward with toner cartridge 100.Housing 302 reaches its operating position with magnetic sensor 300 positioned to detect the permanent magnet(s) in reservoir 104 once toner cartridge 100 is fully installed in image forming device 22 as shown in FIG.","16.The contact between engagement surfaces 194, 195 and rearward facing engagement surfaces 342, 343 of housing 302 maintains the front-to-rear position of housing 302 relative to toner cartridge 100.When toner cartridge 100 is removed from image forming device 22, this sequence is reversed and the downward and rearward bias on housing 302 returns housing 302 to the position shown in FIG.","11.While the example embodiment illustrated in FIGS.","11-16 shows engagement member 190 of toner cartridge 100 contacting housing 302 of magnetic sensor 300 directly, in other embodiments, engagement member 190 contacts an intermediate linkage that, in turn, moves housing 302 from its home position to its operating position.","As discussed above, engagement member 190 may take many suitable forms.","FIGS.","17A-17D illustrate several additional examples.","FIG.","17A shows an engagement member 1190 that includes a pair of cylinders 1192, 1193 that project from top 106 of housing 102.Engagement member 1190 has a front surface 1191 that includes a pair of front engagement surfaces 1194, 1195 positioned to contact corresponding engagement surfaces 342, 343 of housing 302.In one embodiment, front engagement surfaces 1194, 1195 are positioned at substantially the same locations as front engagement surfaces 194, 195 of engagement member 190 discussed above.","Side surfaces 1196, 1197 of cylinders 1192, 1193 are positioned to realign housing 302 in the side-to-side direction if housing 302 is misaligned upon insertion of toner cartridge 100 into image forming device 22 similar to inner side surfaces 193a, 193b discussed above.","FIG.","17B shows an engagement member 2190 that includes a pair of generally rectangular projections 2192, 2193 from top 106 of housing 102.Engagement member 2190 has a front surface 2191 that includes a pair of front engagement surfaces 2194, 2195 positioned to contact corresponding engagement surfaces 342, 343 of housing 302.In one embodiment, front engagement surfaces 2194, 2195 are positioned at substantially the same locations as front engagement surfaces 194, 195 of engagement member 190 discussed above.","Side surfaces 2196, 2197 of rectangular projections 2192, 2193 are positioned to realign housing 302 in the side-to-side direction if housing 302 is misaligned upon insertion of toner cartridge 100 into image forming device 22 similar to inner side surfaces 193a, 193b discussed above.","FIG.","17C shows an engagement member 3190 that includes a projection 3192 from top 106 of housing 102.Engagement member 3190 has a front surface 3191 that includes a front engagement surface 3194 positioned to contact rear 310 of housing 302, which serves as an engagement surface of housing 302 in this embodiment.","In one embodiment, engagement surface 3194 is positioned at substantially the same location as rear portion 192 of engagement member 190 discussed above.","FIG.","17D shows an engagement member 4190 that includes a cutout or recess 4191 in top 106 of housing 102.A top surface of housing 302 inside of recess 4191 forms a planar top surface 4196 similar to planar top surface 196 discussed above.","A rear wall 4192 is positioned at a rearmost end of recess 4191 and may be positioned at substantially the same location as rear portion 192 of engagement member 190 discussed above.","Side walls 4197, 4198 of recess 4191 are positioned to realign housing 302 in the side-to-side direction if housing 302 is misaligned upon insertion of toner cartridge 100 into image forming device 22 similar to inner side surfaces 193a, 193b discussed above.","A front engagement surface 4194, 4195 is positioned at the front of each side wall 4196, 4197.Front engagement surfaces 4194, 4195 are positioned to contact corresponding engagement surfaces 342, 343 of housing 302.In one embodiment, front engagement surfaces 4194, 4195 are positioned at substantially the same locations as front engagement surfaces 194, 195 of engagement member 190 discussed above.","In another embodiment, rear wall 4192 is positioned to contact rear 310 of housing 302, which serves as an engagement surface of housing 302 in this embodiment.","As discussed above, paddle assembly 140 includes at least one permanent magnet that moves within reservoir 104 in response to the rotation of drive shaft 132 and that communicates information about toner cartridge 100 to controller 28 of image forming device 22.FIG.","18 shows paddle assembly 140 having permanent magnets for toner level sensing in greater detail according to one example embodiment.","In operation, shaft 132 rotates in the direction shown by arrow A in FIG.","18.Paddle assembly 140 includes a fixed paddle 141 that is fixed to shaft 132 such that fixed paddle 141 rotates with shaft 132.In one embodiment shaft 132 extends from side wall 110 to side wall 112.In the embodiment illustrated, fixed paddle 141 includes a plurality of arms 142 extending radially from shaft 132.In the example embodiment illustrated, fixed paddle 141 includes two sets 142a, 142b of arms 142.In this embodiment, in the position illustrated in FIG.","18, arms 142 of first set 142a extend from shaft 132 toward rear wall 116 and arms 142 of second set 142b extend from shaft 132 toward front wall 114.Of course these positions change as shaft 132 rotates.","The arms 142 of each set 142a, 142b are radially aligned and axially offset from each other.","The arms 142 of first set 142a are offset circumferentially by approximately 180 degrees from the arms 142 of second set 142b.","Other embodiments include one set of arms 142 or more than two sets of arms 142 extending from shaft 132.In other embodiments, arms 142 are not arranged in sets.","Further, arms 142 may extend radially or non-radially from shaft 132 in any manner desired.","Fixed paddle 141 may include a cross member 144 connected to each set 142a, 142b of arms 142.Cross members 144 may extend across all or a portion of the arms 142 of sets 142a, 142b.","Cross members 144 help arms 142 stir and mix toner in reservoir 104 as shaft 132 rotates.","A breaker bar 146 that is generally parallel to shaft 132 may be positioned radially outward from each cross member 144 and connected to the distal ends of arms 142.Breaker bars 146 are positioned in close proximity to inner surfaces of housing 102 without making contact with the inner surfaces of housing 102 to help break apart toner clumped near the inner surfaces of housing 102.Scrapers 148 may extend in a cantilevered manner from cross members 144.Scrapers 148 are formed from a flexible material such as a polyethylene terephthalate (PET) material, e.g., MYLAR® available from DuPont Teijin Films, Chester, Va., USA.","Scrapers 148 form an interference fit with the inner surfaces of top 106, front wall 114, rear wall 116 and bottom 117 to wipe toner from the inner surfaces of reservoir 104.Scrapers 148 also push toner into open portion 138a of channel 138 as shaft 132 rotates.","Specifically, as cross member 144 rotates past open portion 138a of channel 138, from bottom 117 to top 106, the interference fit between scraper 148 and the inner surface of front wall 114 causes scraper 148 to have an elastic response as the scraper 148 passes open portion 138a of channel 138 thereby flicking or pushing toner toward open portion 138a of channel 138.Additional scrapers may be provided on arms 142 at the axial ends of shaft 132 to wipe toner from the inner surfaces of side walls 110 and 112 as desired.","The arrangement of fixed paddle 141 shown in FIG.","18 is not intended to be limiting.","Fixed paddle 141 may include any suitable combination of projections, agitators, paddles, scrapers and linkages to agitate and move the toner stored in reservoir 104 as desired.","In the example embodiment illustrated, a permanent magnet 150 is rotatable with shaft 132 and detectable by a magnetic sensor as discussed in greater detail below.","In one embodiment, magnet 150 is connected to shaft 132 by fixed paddle 141.In the example embodiment illustrated, first set 142a of arms 142 includes a pair of axially spaced arms 143 positioned at one axial end of shaft 132.Arms 143 initially extend radially outward from shaft 132 and then bend opposite the operative rotational direction of shaft 132 at the distal ends of arms 143.A cross member 145 connects the distal ends of arms 143 and extends substantially parallel to shaft 132.In the example embodiment shown, magnet 150 is positioned in a finger 152 that extends outward from cross member 145 toward the inner surfaces of housing 102.Finger 152 extends in close proximity to but does not contact the inner surfaces of housing 102 so that magnet 150 is positioned in close proximity to the inner surfaces of housing 102.In one embodiment, fixed paddle 141 is composed of a non-magnetic material and magnet 150 is held by a friction fit in a cavity in finger 152.Magnet 150 may also be attached to finger 152 using an adhesive or fastener(s) so long as magnet 150 will not dislodge from finger 152 during operation of toner cartridge 100.Magnet 150 may be any suitable size and shape so as to be detectable by a magnetic sensor.","For example, magnet 150 may be a cube, a rectangular, octagonal or other form of prism, a sphere or cylinder, a thin sheet or an amorphous object.","In another embodiment, finger 152 is composed of a magnetic material such that the body of finger 152 forms the magnet 150.Magnet 150 may be composed of any suitable material such as steel, iron, nickel, etc.","While the example embodiment illustrated in FIG.","18 shows magnet 150 mounted on finger 152 of fixed paddle 141, magnet 150 may be positioned on any suitable linkage to shaft 132 such as a cross member, arm, projection, finger, agitator, paddle, etc.","of fixed paddle 141 or separate from fixed paddle 141.A sensing linkage 160 is mounted to shaft 132.Sensing linkage 160 rotates with shaft 132 but is movable to a certain degree independent of shaft 132.Sensing linkage 160 is free to rotate forward and backward on shaft 132 relative to fixed paddle 141 and to magnet 150 between a forward rotational stop and a rearward rotational stop.","Sensing linkage 160 includes a leading paddle member 162.In the embodiment illustrated, leading paddle member 162 is connected to shaft 132 by a pair of arms 164 positioned between and next to arms 143 of fixed paddle 141.Leading paddle member 162 includes a paddle surface 166 that engages the toner in reservoir 104 as discussed in greater detail below.","In the example embodiment illustrated, paddle surface 166 is substantially planar and normal to the direction of motion of sensing linkage 160 to allow paddle surface 166 to strike toner in reservoir 104.Sensing linkage 160 also includes one or more permanent magnets 168.Magnet(s) 168 are mounted on one or more magnet support(s) 170 of sensing linkage 160 that are positioned in close proximity to but do not contact the inner surfaces of housing 102.In this manner, magnet(s) 168 are positioned in close proximity to the inner surfaces of housing 102 but the inner surfaces of housing 102 do not impede the motion of sensing linkage 160.In the example embodiment illustrated, magnet support 170 is connected to shaft 132 by a pair of arms 172 positioned between and next to arms 143 of fixed paddle 141.Arms 172 are connected to arms 164.In this embodiment, in the position illustrated in FIG.","18, arms 172 extend from shaft 132 toward top 106.Of course the position of arms 172 changes as shaft 132 rotates.","In this embodiment, magnet support 170 is relatively thin in the radial dimension and extends circumferentially relative to shaft 132 between distal ends of arms 172 along the rotational path of magnet(s) 168 to minimize the drag on magnet support 170 as it passes through toner in reservoir 104.Along the operative rotational direction A of shaft 132, leading paddle member 162 is positioned ahead of magnet 150 which is positioned ahead of magnet(s) 168.In the example embodiment illustrated in FIGS.","6 and 18, two magnets 168a, 168b are mounted on magnet support 170; however, one magnet 168 (as shown in FIG.","5) or more than two magnets 168 may be used as desired.","Magnets 168a, 168b are substantially radially and axially aligned and spaced circumferentially from each other relative to shaft 132.Magnet(s) 168 are also substantially radially and axially aligned and spaced circumferentially from magnet 150 relative to shaft 132.In one embodiment, magnet support 170 is composed of a non-magnetic material and magnet(s) 168 are held by a friction fit in one or more cavities in magnetic support 170.Magnet(s) 168 may also be attached to magnet support 170 using an adhesive or fastener(s) so long as magnet(s) 168 will not dislodge from magnet support 170 during operation of toner cartridge 100.As discussed above, magnet(s) 168 may be any suitable size and shape and composed of any suitable material.","Magnet support 170 may take many different forms including an arm, projection, linkage, cross member, etc.","In some embodiments, sensing linkage 160 is biased in the operative rotational direction toward a forward rotational stop by one or more biasing members.","In the example embodiment illustrated, sensing linkage 160 is biased by an extension spring 176 connected at one end to an arm 172 of magnet support 170 and at the other end to arm 143 of fixed paddle 141.However, any suitable biasing member may be used as desired.","For example, in another embodiment, a torsion spring biases sensing linkage 160 in the operative rotational direction.","In another embodiment, a compression spring is connected at one end to an arm 164 of leading paddle member 162 and at the other end to arm 143 of fixed paddle 141.In another embodiment, sensing linkage 160 is free to fall by gravity toward its forward rotational stop as sensing linkage 160 rotates past the uppermost point of its rotational path.","In the example embodiment illustrated, the forward rotational stop includes a stop 178 that extends axially from the side of one or both of the arms 172 of magnet support 170.Stop 178 is arched and includes a leading surface 180 that contacts arm 143 of fixed paddle 141 to limit the motion of sensing linkage 160 relative to magnet 150 in the operative rotational direction.","In the example embodiment illustrated, the rearward rotational stop includes a trailing portion 182 of leading paddle member 162.Trailing portion 182 of leading paddle member 162 contacts a leading portion 184 of cross member 145 to limit the motion of sensing linkage 160 relative to magnet 150 in a direction opposite the operative rotational direction.","It will be appreciated that the forward and rearward rotational stops may take other forms as desired.","FIGS.","19A-19C depict the operation of magnets 150 and 168 at various toner levels with engagement member 190 removed from toner cartridge 100 for clarity.","FIGS.","19A-19C depict a clock face in dashed lines along the rotational path of shaft 132 and paddle assembly 140 in order to aid in the description of the operation of magnets 150 and 168.In one embodiment, the poles of magnets 150, 168 are directed toward the position of magnetic sensor 300 in order to facilitate the detection of magnets 150, 168 by magnetic sensor 300.Magnetic sensor 300 may be configured to detect one of a north pole and a south pole or both.","Where magnetic sensor 300 detects one of a north pole and a south pole, magnets 150, 168 may be positioned such that the detected pole is directed toward magnetic sensor 300.The motion of sensing linkage 160 and magnet(s) 168 relative to magnet 150 as shaft 132 rotates may be used to determine the amount of toner remaining in reservoir 104.As shaft 132 rotates, in the embodiment illustrated, fixed paddle 141 rotates with shaft 132 causing magnet 150 to pass magnetic sensor 300 at the same point during each revolution of shaft 132.On the other hand, the motion of sensing linkage 160, which is free to rotate relative to shaft 132 between its forward and rearward rotational stops, depends on the amount of toner 105 present in reservoir 104.As a result, magnet(s) 168 pass magnetic sensor 300 at different points during the revolution of shaft 132 depending on the toner level in reservoir 104.Accordingly, variation in the angular separation or offset between magnet 150, which serves as a reference point, and magnet(s) 168, which provide(s) sense points, as they pass magnetic sensor 300 may be used to determine the amount of toner remaining in reservoir 104.In an alternative embodiment, the linkage connecting magnet 150 to shaft 132, such as fixed paddle 141, is movable to a certain degree independent of shaft 132; however, it is preferred that magnet 150 passes magnetic sensor 190 in the same position relative to shaft 132 during each revolution of shaft 132 so that the position(s) of magnet(s) 168 may be consistently evaluated relative to the position of magnet 150.When toner reservoir 104 is relatively full, toner 105 present in reservoir 104 prevents sensing linkage 160 from advancing ahead of its rearward rotational stop.","Instead, sensing linkage 160 is pushed through its rotational path by fixed paddle 141 when shaft 132 rotates.","Accordingly, when toner reservoir 104 is relatively full, the amount of rotation of shaft 132 between magnet 150 passing magnetic sensor 300 and magnets 168a, 168b on sensing linkage 160 passing magnetic sensor 300 is at its maximum.","In other words, because sensing linkage 160 is at its rearward rotational stop, the angular separation from magnet 168a to magnet 150 when magnet 168a reaches magnetic sensor 300 and from magnet 168b to magnet 150 when magnet 168b reaches magnetic sensor 300 are at their maximum limits.","As the toner level in reservoir 104 decreases as shown in FIG.","19A, sensing linkage 160 is positioned forward from its rearward rotational stop as leading paddle member 162 rotates forward from the “12 o'clock” position.","Leading paddle member 162 advances ahead of the rearward rotational stop of sensing linkage 160 until paddle surface 166 contacts toner 105, which stops the advance of sensing linkage 160.In one embodiment where paddle assembly 140 includes scrapers 148, scrapers 148 are not present on cross member 144 connected to set 142b of arms 142 along the axial portion of shaft 132 spanned by leading paddle member 162 so that toner 105 is not disturbed immediately before paddle surface 166 contacts toner 105 after leading paddle member 162 rotates forward from the “12 o'clock” position.","At higher toner levels, leading paddle member 162 is stopped by toner 105 before magnets 168a, 168b reach magnetic sensor 300 such that the amount of rotation of shaft 132 between magnet 150 passing magnetic sensor 300 and magnets 168a, 168b passing magnetic sensor 300 remains at its maximum.","Sensing linkage 160 then remains generally stationary on top of (or slightly below) toner 105 until fixed paddle 141 catches up to leading paddle member 162 at the rearward rotational stop of sensing linkage 160 and fixed paddle 141 resumes pushing sensing linkage 160.With reference to FIG.","19B, as the toner level in reservoir 104 continues to decrease, at the point where leading paddle member 162 encounters toner 105 magnet 168a is detected by magnetic sensor 300.As a result, the amount of rotation of shaft 132 between magnet 150 passing magnetic sensor 300 and magnet 168a passing magnetic sensor 300 decreases.","Sensing linkage 160 then remains generally stationary on top of (or slightly below) toner 105 with magnet 168a in the sensing window of magnetic sensor 300 until fixed paddle 141 catches up to leading paddle member 162 and resumes pushing sensing linkage 160.As a result, leading paddle member 162 is stopped by toner 105 before magnet 168b reaches magnetic sensor 300 such that the amount of rotation of shaft 132 between magnet 150 passing magnetic sensor 300 and magnet 168b passing magnetic sensor 300 remains at its maximum.","With reference to FIG.","19C, as the toner level in reservoir 104 decreases even further, at the point where leading paddle member 162 encounters toner 105 magnet 168a has passed magnetic sensor 300 and magnet 168b is detected by magnetic sensor 300.As a result, the amount of rotation of shaft 132 between magnet 150 passing magnetic sensor 300 and magnets 168a and 168b passing magnetic sensor 300 are both decreased relative to their maximums.","As a result, it will be appreciated that the motion of magnets 168a, 168b relative to the motion of magnet 150 relates to the amount of toner 105 remaining in reservoir 104.In one embodiment, the initial amount of toner 105 in reservoir 104 is recorded in memory associated with processing circuitry 45 upon filling the toner cartridge 100.Accordingly, upon installing toner cartridge 100 in image forming device 22, controller 28 is able to determine the initial toner level in reservoir 104.Alternatively, each toner cartridge 100 for a particular type of image forming device 22 may be filled with the same amount of toner so that the initial toner level in reservoir 104 used by controller 28 may be a fixed value for all toner cartridges 100.Controller 28 then estimates the amount of toner remaining in reservoir 104 as toner is fed from toner cartridge to imaging unit 200 based on one or more operating conditions of image forming device 22 and/or toner cartridge 100.In one embodiment, the amount of toner 105 remaining in reservoir 104 is approximated based on an empirically derived feed rate of toner 105 from toner reservoir 104 when shaft 132 and auger 136 are rotated to deliver toner from toner cartridge 100 to imaging unit 200.In this embodiment, the estimate of the amount of toner 105 remaining is decreased based on the amount of rotation of the drive motor of image forming device 22 that provides rotational force to main interface gear 130 as determined by controller 28.In another embodiment, the estimate of the amount of toner 105 remaining is decreased based on the number of printable elements (pels) printed using the color of toner contained in toner cartridge 100 while toner cartridge 100 is installed in image forming device 22.In another embodiment, the estimate of the amount of toner 105 remaining is decreased based on the number of pages printed.","The amount of toner 105 remaining in reservoir 104 where the amount of rotation of shaft 132 that occurs between magnet 150 passing magnetic sensor 300 and each of the magnets 168 passing magnetic sensor 300 decreases may be determined empirically for a particular toner cartridge design.","As a result, each time the amount of rotation of shaft 132 between the detection of magnet 150 and the detection of one of the magnets 168 decreases from its maximum value, controller 28 may adjust the estimate of the amount of toner remaining in reservoir 104 based on the empirically determined amount of toner associated with the decrease in the amount of rotation of shaft 132 between magnet 150 passing magnetic sensor 300 and the respective magnet 168 passing magnetic sensor 300.For example, the toner level in reservoir 104 can be approximated by starting with the initial amount of toner 105 supplied in reservoir 104 and reducing the estimate of the amount of toner 105 remaining in reservoir 104 as toner 105 from reservoir 104 is consumed.","As discussed above, the estimate of the toner remaining may be decreased based on one or more conditions such as the number of rotations of the drive motor, main interface gear 130 or shaft 132, the number of pels printed, the number of pages printed, etc.","The estimated amount of toner remaining may be recalculated when the amount of rotation of shaft 132 as determined by controller 28 between magnet 150 passing magnetic sensor 300 and magnet 168a of sensing linkage 160 passing magnetic sensor 300 decreases from its maximum value.","In one embodiment, this includes replacing the estimate of the amount of toner remaining with the empirical value associated with the decrease in the amount of rotation of shaft 132 between magnet 150 passing magnetic sensor 300 and magnet 168a passing magnetic sensor 300.In another embodiment, the recalculation gives weight to both the present estimate of the amount of toner remaining and the empirical value associated with the decrease in the amount of rotation of shaft 132 between magnet 150 passing magnetic sensor 300 and magnet 168a passing magnetic sensor 300.The revised estimate of the amount of toner 105 remaining in reservoir 104 is then decreased as toner 105 from reservoir 104 is consumed using one or more conditions as discussed above.","The estimated amount of toner remaining may be recalculated again when the amount of rotation of shaft 132 as determined by controller 28 between magnet 150 passing magnetic sensor 300 and magnet 168b of sensing linkage 160 passing magnetic sensor 300 decreases from its maximum value.","As discussed above, this may include replacing the estimate of the amount of toner remaining or recalculating the estimate giving weight to both the present estimate of the amount of toner remaining and the empirical value associated with the decrease in the amount of rotation of shaft 132 between magnet 150 passing magnetic sensor 300 and magnet 168b passing magnetic sensor 300.This process may be repeated until reservoir 104 is out of toner 105.In one embodiment, the present estimate of the amount of toner 105 remaining in reservoir 104 is stored in memory associated with processing circuitry 45 of toner cartridge 100 so that the estimate travels with toner cartridge 100 in case toner cartridge 100 is removed from one image forming device 22 and installed in another image forming device 22.In this manner, the detection of the motion of magnets 168 relative to the motion of magnet 150 may serve as a correction for an estimate of the toner level in reservoir 104 based on other conditions such as an empirically derived feed rate of toner or the number of pels or pages printed as discussed above to account for variability and to correct potential error in such an estimate.","For example, an estimate of the toner level based on conditions such as an empirically derived feed rate of toner or the number of pels or pages printed may drift from the actual amount of toner 105 remaining in reservoir 104 over the life of toner cartridge 100, i.e., a difference between an estimate of the toner level and the actual toner level may tend to increase over the life of toner cartridge 100.Recalculating the estimate of the amount of toner 105 remaining based on the motion of magnet(s) 168 relative to the motion of magnet 150 helps correct this drift to provide a more accurate estimate of the amount of toner 105 remaining in reservoir 104.It will be appreciated that sensing linkage 160 may include any suitable number of magnets 168 desired depending on how many recalculations of the estimate of the amount of toner remaining are desired.","For example, sensing linkage 160 may include more than two magnets 168 spaced circumferentially from each other where recalculation of the estimated toner level is desired more frequently.","Alternatively, sensing linkage 160 may include a single magnet 168 where recalculation of the estimated toner level is desired only once, such as near the point where reservoir 104 is nearly empty.","The positions of magnets 168 relative to leading paddle member 162 may be selected in order to sense particular toner levels desired (e.g., 300 grams of toner remaining, 100 grams of toner remaining, etc.).","Further, where shaft 132 rotates at a constant speed during operation of toner cartridge 100, time differences between the detection of magnet 150 and magnet(s) 168 by magnetic sensor 300 may be used instead of the amount of rotation of shaft 132.In this embodiment, time differences greater than a predetermined threshold between the detection of magnet 150 and one or more of magnet(s) 168 may be ignored by the processor to account for shaft 132 stopping between print jobs.","Sensing linkage 160 is not limited to the shape and architecture shown in FIG.","18 and may take many shapes and sizes as desired.","The leading paddle member 162 having paddle surface 166 that engages the toner in reservoir 104 may also take many shapes and sizes as desired.","For example, in one embodiment, paddle surface 166 is angled with respect to the direction of motion of the sensing linkage 160.For example, paddle surface 166 may be V-shaped and have a front face that forms a concave portion of the V-shaped profile.","In another embodiment, paddle surface 166 includes a comb portion with a series of teeth that are spaced axially from each other to decrease the friction between the sensing linkage and the toner.","The surface area of paddle surface 166 may also vary as desired.","While the example embodiments illustrated in FIGS.","19A-19C show magnetic sensor 300 positioned at about “12 o'clock” with respect to paddle assembly 140, magnetic sensor 300 may be positioned elsewhere in the rotational path of paddle assembly 140 as desired.","For example, magnetic sensor 300 may be positioned at about “6 o'clock” with respect to paddle assembly 140 by changing the positions of magnet 150 and magnet(s) 168 relative to leading paddle member 162 by 180 degrees.","Although the example embodiments discussed above utilize a sensing linkage and a fixed linkage in the reservoir of the toner cartridge, it will be appreciated that a sensing linkage and a fixed linkage each having a magnet may be used to determine the toner level in any reservoir or sump storing toner in image forming device 22 such as, for example, a reservoir of the imaging unit or a storage area for waste toner.","Further, the configuration of permanent magnet(s) for toner level sensing is not limited to the example embodiment shown in FIGS.","18 and 19A-19C.","For example, in another embodiment, a paddle having a permanent magnet is mounted on drive shaft 132 and rotatable independent of drive shaft 132 as described in United States Published Patent Application No.","2014/0169806, which is assigned to the same assignee as the present application.","In this embodiment, the paddle is pushed through its rotational path by a driving member mounted on drive shaft 132 and free to fall ahead of the driving member subject to resistance by toner present in reservoir 104.Accordingly, it will be appreciated that the motion of the paddle (and the permanent magnet attached thereto) is dependent on the amount of toner in reservoir 104.FIG.","20 shows another example embodiment of a paddle assembly 5140.In this embodiment, the toner cartridge includes a paddle 5141 that is fixed to a shaft 5132 such that paddle 5141 rotates with shaft 5132.Paddle 5141 includes one or more permanent magnet(s) 5168 mounted on one or more magnet support(s) 5170.Magnet(s) 5168 are positioned in close proximity to but do not contact the inner surfaces of the housing of the toner cartridge as discussed above.","In the example embodiment illustrated, magnet support 5170 is connected to shaft 5132 by a pair of arms 5172.In the example embodiment illustrated, two magnets 5168 are mounted on magnet support 5170; however, more or fewer than two magnets 5168 may be used as desired.","Magnets 5168 may be oriented, shaped and mounted to shaft 5132 in various ways as discussed above.","In this embodiment, magnetic sensor 300 detects magnets 5168 as shaft 5132 rotates.","In this manner, magnetic sensor 300 may be used to detect the presence of the toner cartridge in the image forming device and to confirm that shaft 5132 is rotating properly thereby eliminating the need for additional sensors to perform these functions.","Magnetic sensor 300 may also be used to determine the speed of rotation of shaft 5132 by measuring the time difference between the detection of the first magnet and the detection of the second magnet as shaft 5132 rotates.","The arrangement of magnet(s) 5168 may communicate additional characteristics of toner cartridge 100 as desired.","For example, the number of magnets 5168 attached to shaft 5132 may indicate a characteristic of toner cartridge 100.By way of example, one magnet 5186 may indicate a toner cartridge containing black toner, two magnets 5168 may indicate a toner cartridge containing cyan toner, three magnets 5168 may indicate a toner cartridge containing yellow toner and four magnets 5168 may indicate a toner cartridge containing magenta toner.","Further, the spacing between magnets 5168 may indicate a characteristic of toner cartridge 100.For example, a first spacing between magnets 5168 (e.g., 45 degrees) may indicate a low capacity toner cartridge and a second spacing between magnets 5168 (e.g., 90 degrees) may indicate a high capacity toner cartridge.","Various other aspects of the arrangement of magnet(s) 5168 may communicate characteristics of toner cartridge 100 and various other characteristics may be encoded in magnet(s) 5168 as desired.","The foregoing description illustrates various aspects of the present disclosure.","It is not intended to be exhaustive.","Rather, it is chosen to illustrate the principles of the present disclosure and its practical application to enable one of ordinary skill in the art to utilize the present disclosure, including its various modifications that naturally follow.","All modifications and variations are contemplated within the scope of the present disclosure as determined by the appended claims.","Relatively apparent modifications include combining one or more features of various embodiments with features of other embodiments."]],"string":"[\n [\n \"ELECTROPHOTOGRAPHIC IMAGE FORMING DEVICE HAVING A REPLACEABLE UNIT THAT INCLUDES AN ENGAGEMENT MEMBER FOR POSITIONING A MAGNETIC SENSOR\",\n \"An electrophotographic image forming device includes a replaceable unit having a housing that includes a top, a bottom, a front, and a rear positioned between a first side and a second side of the housing.\",\n \"The housing has a reservoir for storing toner.\",\n \"A rotatable shaft is positioned within the reservoir and has an axis of rotation.\",\n \"A magnet in the reservoir is movable in response to rotation of the shaft.\",\n \"An engagement member is positioned on an exterior of the top of the housing.\",\n \"The engagement member is aligned with a point in a path of movement of the magnet in the reservoir.\",\n \"The engagement member has a front surface that is unobstructed to contact and push a housing in the image forming device supporting a magnetic sensor to an operating position of the magnetic sensor during insertion of the replaceable unit into the image forming device.\"\n ],\n [\n \"1.An electrophotographic image forming device, comprising: a replaceable unit including: a housing having a top, a bottom, a front, and a rear positioned between a first side and a second side of the housing, the housing having a reservoir for storing toner; a rotatable shaft positioned within the reservoir and having an axis of rotation; a magnet in the reservoir movable in response to rotation of the shaft; and an engagement member positioned on an exterior of the top of the housing, the engagement member is aligned with a point in a path of movement of the magnet in the reservoir, the engagement member has a front surface that is unobstructed to contact and push a housing in the image forming device supporting a magnetic sensor to an operating position of the magnetic sensor during insertion of the replaceable unit into the image forming device.\",\n \"2.The electrophotographic image forming device of claim 1, wherein the magnet is rotatable around the axis of rotation of the shaft in response to rotation of the shaft.\",\n \"3.The electrophotographic image forming device of claim 1, wherein the engagement member is axially aligned with the magnet relative to the axis of rotation of the shaft.\",\n \"4.The electrophotographic image forming device of claim 1, wherein the magnet passes in close proximity to an inner surface of the housing forming the reservoir at a location where the engagement member is positioned on the exterior of the housing.\",\n \"5.The electrophotographic image forming device of claim 1, wherein the engagement member projects upward from the top of the housing.\",\n \"6.The electrophotographic image forming device of claim 1, wherein the front surface of the engagement member includes a pair of front engagement surfaces spaced axially apart from each other and aligned with each other along a front-to-rear dimension of the housing.\",\n \"7.The electrophotographic image forming device of claim 1, wherein the engagement member includes a pair of side engagement surfaces that face each other, the side engagement surfaces are spaced axially apart from each other and aligned with each other along a front-to-rear dimension of the housing.\",\n \"8.The electrophotographic image forming device of claim 1, wherein the replaceable unit includes a ramp positioned on the exterior of the housing in front of the engagement member and leading toward the engagement member, a top surface of the ramp inclines upward as the ramp extends toward the engagement member.\",\n \"9.The electrophotographic image forming device of claim 8, wherein the replaceable unit includes a planar top surface that extends rearward from a rear end of the ramp to the engagement member, the planar top surface is substantially horizontal when the toner cartridge is in its operative orientation.\",\n \"10.An electrophotographic image forming device, comprising: a replaceable unit including: a housing having a top, a bottom, a front, and a rear positioned between a first side and a second side of the housing, the housing having a reservoir for storing toner; a rotatable shaft positioned within the reservoir and having an axis of rotation; a magnet connected to the shaft and rotatable around the axis of rotation in response to rotation of the shaft; and an engagement member positioned on an exterior of the top of the housing, the engagement member is axially aligned with the magnet relative to the axis of rotation of the shaft, the engagement member has a frontward facing portion that is unobstructed to contact and align a housing in the image forming device supporting a magnetic sensor during insertion of the replaceable unit into the image forming device.\",\n \"11.The electrophotographic image forming device of claim 10, wherein the magnet passes in close proximity to an inner surface of the housing forming the reservoir at a location where the engagement member is positioned on the exterior of the housing.\",\n \"12.The electrophotographic image forming device of claim 10, wherein the engagement member projects upward from the top of the housing.\",\n \"13.The electrophotographic image forming device of claim 10, wherein the front surface of the engagement member includes a pair of front engagement surfaces spaced axially apart from each other and aligned with each other along a front-to-rear dimension of the housing.\",\n \"14.The electrophotographic image forming device of claim 10, wherein the engagement member includes a pair of side engagement surfaces that face each other, the side engagement surfaces are spaced axially apart from each other and aligned with each other along a front-to-rear dimension of the housing.\",\n \"15.The electrophotographic image forming device of claim 10, wherein the replaceable unit includes a ramp positioned on the exterior of the housing in front of the engagement member and leading toward the engagement member, a top surface of the ramp inclines upward as the ramp extends toward the engagement member.\",\n \"16.The electrophotographic image forming device of claim 15, wherein the replaceable unit includes a planar top surface that extends rearward from a rear end of the ramp to the engagement member, the planar top surface is substantially horizontal when the toner cartridge is in its operative orientation.\",\n \"17.An electrophotographic image forming device, comprising: a replaceable unit including: a housing having a top, a bottom, a front, and a rear positioned between a first side and a second side of the housing, the housing having a reservoir for storing toner; a rotatable shaft positioned within the reservoir and having an axis of rotation; a magnet in the reservoir movable in response to rotation of the shaft; and an engagement member positioned on an exterior of the top of the housing, the engagement member is configured to align a magnetic sensor in the image forming device with a point in a path of movement of the magnet in the reservoir during insertion of the replaceable unit into the image forming device.\"\n ],\n [\n \" BACKGROUND \"\n ],\n [\n \" SUMMARY A replaceable unit for an electrophotographic image forming device according to one example embodiment includes a housing having a top, a bottom, a front, and a rear positioned between a first side and a second side of the housing.\",\n \"The housing has a reservoir for storing toner.\",\n \"A rotatable shaft is positioned within the reservoir and has an axis of rotation.\",\n \"A magnet in the reservoir is movable in response to rotation of the shaft.\",\n \"An engagement member is positioned on an exterior of the top of the housing.\",\n \"The engagement member is aligned with a point in a path of movement of the magnet in the reservoir.\",\n \"The engagement member has a front surface that is unobstructed to contact and push a housing in the image forming device supporting a magnetic sensor to an operating position of the magnetic sensor during insertion of the replaceable unit into the image forming device.\",\n \"In some embodiments, the magnet is rotatable around the axis of rotation of the shaft in response to rotation of the shaft.\",\n \"In some embodiments, the engagement member is axially aligned with the magnet relative to the axis of rotation of the shaft.\",\n \"Embodiments include those where the magnet passes in close proximity to an inner surface of the housing forming the reservoir at a location where the engagement member is positioned on the exterior of the housing.\",\n \"In some embodiments, the engagement member projects upward from the top of the housing.\",\n \"Embodiments include those where the front surface of the engagement member includes a pair of front engagement surfaces spaced axially apart from each other and aligned with each other along a front-to-rear dimension of the housing.\",\n \"Embodiments also include those where the engagement member includes a pair of side engagement surfaces that face each other and that are spaced axially apart from each other and aligned with each other along a front-to-rear dimension of the housing.\",\n \"In some embodiments, a ramp is positioned on the exterior of the housing in front of the engagement member and leading toward the engagement member.\",\n \"A top surface of the ramp inclines upward as the ramp extends toward the engagement member.\",\n \"A planar top surface may extend rearward from a rear end of the ramp to the engagement member.\",\n \"The planar top surface may be substantially horizontal when the toner cartridge is in its operative orientation.\",\n \"A replaceable unit for an electrophotographic image forming device according to another example embodiment includes a housing having a top, a bottom, a front, and a rear positioned between a first side and a second side of the housing.\",\n \"The housing has a reservoir for storing toner.\",\n \"A rotatable shaft is positioned within the reservoir and has an axis of rotation.\",\n \"A magnet is connected to the shaft and rotatable around the axis of rotation in response to rotation of the shaft.\",\n \"An engagement member is positioned on an exterior of the top of the housing.\",\n \"The engagement member is axially aligned with the magnet relative to the axis of rotation of the shaft.\",\n \"The engagement member has a frontward facing portion that is unobstructed to contact and align a housing in the image forming device supporting a magnetic sensor during insertion of the replaceable unit into the image forming device.\",\n \"A replaceable unit for an electrophotographic image forming device according to another example embodiment includes a housing having a top, a bottom, a front, and a rear positioned between a first side and a second side of the housing.\",\n \"The housing has a reservoir for storing toner.\",\n \"A rotatable shaft is positioned within the reservoir and has an axis of rotation.\",\n \"A magnet in the reservoir is movable in response to rotation of the shaft.\",\n \"An engagement member is positioned on an exterior of the top of the housing.\",\n \"The engagement member is configured to align a magnetic sensor in the image forming device with a point in a path of movement of the magnet in the reservoir during insertion of the replaceable unit into the image forming device.\"\n ],\n [\n \"CROSS REFERENCES TO RELATED APPLICATIONS This patent application is a continuation application of U.S. patent application Ser.\",\n \"No.\",\n \"15/408,500, filed Jan. 18, 2017, entitled “Replaceable Unit for an Electrophotographic Image Forming Device Having an Engagement Member for Positioning a Magnetic Sensor,” which is a continuation application of U.S. patent application Ser.\",\n \"No.\",\n \"15/202,639, filed Jul.\",\n \"6, 2016, issued as U.S. Pat.\",\n \"No.\",\n \"9,588,462 on Mar.\",\n \"7, 2017, entitled “Replaceable Unit for an Electrophotographic Image Forming Device Having an Engagement Member for Positioning a Magnetic Sensor,” which is a continuation application of U.S. patent application Ser.\",\n \"No.\",\n \"15/019,277, filed Feb. 9, 2016, issued as U.S. Pat.\",\n \"No.\",\n \"9,417,600 on Aug. 16, 2016, entitled “Replaceable Unit for an Electrophotographic Image Forming Device Having an Engagement Member for Positioning a Magnetic Sensor,” which is a continuation application of U.S. patent application Ser.\",\n \"No.\",\n \"14/631,146, filed Feb. 25, 2015, issued as U.S. Pat.\",\n \"No.\",\n \"9,291,989 on Mar.\",\n \"22, 2016, entitled “Replaceable Unit for an Electrophotographic Image Forming Device Having an Engagement Member for Positioning a Magnetic Sensor.” BACKGROUND 1.Field of the Disclosure The present disclosure relates generally to image forming devices and more particularly to a replaceable unit for an electrophotographic image forming device having an engagement member for positioning a magnetic sensor.\",\n \"2.Description of the Related Art During the electrophotographic printing process, an electrically charged rotating photoconductive drum is selectively exposed to a laser beam.\",\n \"The areas of the photoconductive drum exposed to the laser beam are discharged creating an electrostatic latent image of a page to be printed on the photoconductive drum.\",\n \"Toner particles are then electrostatically picked up by the latent image on the photoconductive drum creating a toned image on the drum.\",\n \"The toned image is transferred to the print media (e.g., paper) either directly by the photoconductive drum or indirectly by an intermediate transfer member.\",\n \"The toner is then fused to the media using heat and pressure to complete the print.\",\n \"The image forming device's toner supply is typically stored in one or more replaceable units that have a shorter lifespan than the image forming device.\",\n \"It is desired to communicate various characteristics of the replaceable unit(s) to the image forming device for proper operation.\",\n \"For example, as these replaceable units run out of toner, the units must be replaced or refilled in order to continue printing.\",\n \"As a result, it may be desired to communicate the amount of toner remaining in the replaceable unit(s) to the image forming device in order to warn the user that the replaceable unit is near an empty state or to prevent printing after the unit is empty in order to prevent damage to the image forming device.\",\n \"It may be desired to communicate other characteristics of the replaceable unit(s) to the image forming device such as toner type, toner color, toner capacity, replaceable unit serial number, replaceable unit type, etc.\",\n \"SUMMARY A replaceable unit for an electrophotographic image forming device according to one example embodiment includes a housing having a top, a bottom, a front, and a rear positioned between a first side and a second side of the housing.\",\n \"The housing has a reservoir for storing toner.\",\n \"A rotatable shaft is positioned within the reservoir and has an axis of rotation.\",\n \"A magnet in the reservoir is movable in response to rotation of the shaft.\",\n \"An engagement member is positioned on an exterior of the top of the housing.\",\n \"The engagement member is aligned with a point in a path of movement of the magnet in the reservoir.\",\n \"The engagement member has a front surface that is unobstructed to contact and push a housing in the image forming device supporting a magnetic sensor to an operating position of the magnetic sensor during insertion of the replaceable unit into the image forming device.\",\n \"In some embodiments, the magnet is rotatable around the axis of rotation of the shaft in response to rotation of the shaft.\",\n \"In some embodiments, the engagement member is axially aligned with the magnet relative to the axis of rotation of the shaft.\",\n \"Embodiments include those where the magnet passes in close proximity to an inner surface of the housing forming the reservoir at a location where the engagement member is positioned on the exterior of the housing.\",\n \"In some embodiments, the engagement member projects upward from the top of the housing.\",\n \"Embodiments include those where the front surface of the engagement member includes a pair of front engagement surfaces spaced axially apart from each other and aligned with each other along a front-to-rear dimension of the housing.\",\n \"Embodiments also include those where the engagement member includes a pair of side engagement surfaces that face each other and that are spaced axially apart from each other and aligned with each other along a front-to-rear dimension of the housing.\",\n \"In some embodiments, a ramp is positioned on the exterior of the housing in front of the engagement member and leading toward the engagement member.\",\n \"A top surface of the ramp inclines upward as the ramp extends toward the engagement member.\",\n \"A planar top surface may extend rearward from a rear end of the ramp to the engagement member.\",\n \"The planar top surface may be substantially horizontal when the toner cartridge is in its operative orientation.\",\n \"A replaceable unit for an electrophotographic image forming device according to another example embodiment includes a housing having a top, a bottom, a front, and a rear positioned between a first side and a second side of the housing.\",\n \"The housing has a reservoir for storing toner.\",\n \"A rotatable shaft is positioned within the reservoir and has an axis of rotation.\",\n \"A magnet is connected to the shaft and rotatable around the axis of rotation in response to rotation of the shaft.\",\n \"An engagement member is positioned on an exterior of the top of the housing.\",\n \"The engagement member is axially aligned with the magnet relative to the axis of rotation of the shaft.\",\n \"The engagement member has a frontward facing portion that is unobstructed to contact and align a housing in the image forming device supporting a magnetic sensor during insertion of the replaceable unit into the image forming device.\",\n \"A replaceable unit for an electrophotographic image forming device according to another example embodiment includes a housing having a top, a bottom, a front, and a rear positioned between a first side and a second side of the housing.\",\n \"The housing has a reservoir for storing toner.\",\n \"A rotatable shaft is positioned within the reservoir and has an axis of rotation.\",\n \"A magnet in the reservoir is movable in response to rotation of the shaft.\",\n \"An engagement member is positioned on an exterior of the top of the housing.\",\n \"The engagement member is configured to align a magnetic sensor in the image forming device with a point in a path of movement of the magnet in the reservoir during insertion of the replaceable unit into the image forming device.\",\n \"BRIEF DESCRIPTION OF THE DRAWINGS The accompanying drawings incorporated in and forming a part of the specification, illustrate several aspects of the present disclosure, and together with the description serve to explain the principles of the present disclosure.\",\n \"FIG.\",\n \"1 is a block diagram of an imaging system according to one example embodiment.\",\n \"FIG.\",\n \"2 is a perspective view of a toner cartridge and an imaging unit according to one example embodiment.\",\n \"FIG.\",\n \"3 is a front perspective view of the toner cartridge shown in FIG.\",\n \"2.FIG.\",\n \"4 is a rear perspective view of the toner cartridge shown in FIGS.\",\n \"2 and 3.FIG.\",\n \"5 is an exploded view of the toner cartridge shown in FIGS.\",\n \"2-4 showing a reservoir for holding toner therein.\",\n \"FIG.\",\n \"6 is a cross-sectional side view of the toner cartridge installed in an image forming device according to one example embodiment.\",\n \"FIG.\",\n \"7 is a bottom perspective view of a magnetic sensor housing according to one example embodiment.\",\n \"FIG.\",\n \"8 is a top perspective view of the magnetic sensor housing shown in FIG.\",\n \"7.FIG.\",\n \"9 is a front perspective view of the toner cartridge shown in FIGS.\",\n \"2-5 with a portion of a front wall of the toner cartridge removed to illustrate a portion of the reservoir according to one example embodiment.\",\n \"FIG.\",\n \"10 is a top plan view of an engagement member of the toner cartridge shown in FIG.\",\n \"9 according to one example embodiment.\",\n \"FIG.\",\n \"11 is a side elevation view of the toner cartridge as it enters the image forming device.\",\n \"FIG.\",\n \"12 is a side elevation view of the toner cartridge inserted further into the image forming device with the toner cartridge contacting the magnetic sensor housing.\",\n \"FIG.\",\n \"13 is a side elevation view of the toner cartridge inserted further into the image forming device with the toner cartridge having moved the magnetic sensor housing to its final vertical position.\",\n \"FIGS.\",\n \"14A and 14B are a side elevation view and a top cross sectional view, respectively, of the toner cartridge inserted further into the image forming device with the engagement member of the toner cartridge approaching the magnetic sensor housing.\",\n \"FIGS.\",\n \"15A and 15B are a side elevation view and a top cross sectional view, respectively, of the toner cartridge inserted further into the image forming device with engagement surfaces of the engagement member of the toner cartridge contacting corresponding engagement surfaces of the magnetic sensor housing.\",\n \"FIG.\",\n \"16 is a side elevation view of the toner cartridge fully installed in the image forming device and the magnetic sensor housing in its operating position.\",\n \"FIG.\",\n \"17A is a top plan view of a first engagement member of the toner cartridge according to one example embodiment.\",\n \"FIG.\",\n \"17B is a top plan view of a second engagement member of the toner cartridge according to one example embodiment.\",\n \"FIG.\",\n \"17C is a top plan view of a third engagement member of the toner cartridge according to one example embodiment.\",\n \"FIG.\",\n \"17D is front perspective view of a fourth engagement member of the toner cartridge according to one example embodiment.\",\n \"FIG.\",\n \"18 is a perspective view of a paddle assembly of the toner cartridge according to one example embodiment.\",\n \"FIGS.\",\n \"19A-19C are cross-sectional side views of the toner cartridge illustrating the operation of a sensing linkage at various toner levels according to one example embodiment.\",\n \"FIG.\",\n \"20 is a perspective view of a paddle assembly of the toner cartridge according to another example embodiment.\",\n \"DETAILED DESCRIPTION In the following description, reference is made to the accompanying drawings where like numerals represent like elements.\",\n \"The embodiments are described in sufficient detail to enable those skilled in the art to practice the present disclosure.\",\n \"It is to be understood that other embodiments may be utilized and that process, electrical, and mechanical changes, etc., may be made without departing from the scope of the present disclosure.\",\n \"Examples merely typify possible variations.\",\n \"Portions and features of some embodiments may be included in or substituted for those of others.\",\n \"The following description, therefore, is not to be taken in a limiting sense and the scope of the present disclosure is defined only by the appended claims and their equivalents.\",\n \"Referring now to the drawings and particularly to FIG.\",\n \"1, there is shown a block diagram depiction of an imaging system 20 according to one example embodiment.\",\n \"Imaging system 20 includes an image forming device 22 and a computer 24.Image forming device 22 communicates with computer 24 via a communications link 26.As used herein, the term “communications link” generally refers to any structure that facilitates electronic communication between multiple components and may operate using wired or wireless technology and may include communications over the Internet.\",\n \"In the example embodiment shown in FIG.\",\n \"1, image forming device 22 is a multifunction machine (sometimes referred to as an all-in-one (AIO) device) that includes a controller 28, a print engine 30, a laser scan unit (LSU) 31, an imaging unit 32, a toner cartridge 35, a user interface 36, a media feed system 38, a media input tray 39 and a scanner system 40.Image forming device 22 may communicate with computer 24 via a standard communication protocol, such as for example, universal serial bus (USB), Ethernet or IEEE 802.xx.\",\n \"Image forming device 22 may be, for example, an electrophotographic printer/copier including an integrated scanner system 40 or a standalone electrophotographic printer.\",\n \"Controller 28 includes a processor unit and associated electronic memory 29.The processor may include one or more integrated circuits in the form of a microprocessor or central processing unit and may be formed as one or more Application-specific integrated circuits (ASICs).\",\n \"Memory 29 may be any volatile or non-volatile memory or combination thereof such as, for example, random access memory (RAM), read only memory (ROM), flash memory and/or non-volatile RAM (NVRAM).\",\n \"Alternatively, memory 29 may be in the form of a separate memory (e.g., RAM, ROM, and/or NVRAM), a hard drive, a CD or DVD drive, or any memory device convenient for use with controller 28.Controller 28 may be, for example, a combined printer and scanner controller.\",\n \"In the example embodiment illustrated, controller 28 communicates with print engine 30 via a communications link 50.Controller 28 communicates with imaging unit 32 and processing circuitry 44 thereon via a communications link 51.Controller 28 communicates with toner cartridge 35 and processing circuitry 45 thereon via a communications link 52.Controller 28 communicates with media feed system 38 via a communications link 53.Controller 28 communicates with scanner system 40 via a communications link 54.User interface 36 is communicatively coupled to controller 28 via a communications link 55.Processing circuitry 44, 45 may provide authentication functions, safety and operational interlocks, operating parameters and usage information related to imaging unit 32 and toner cartridge 35, respectively.\",\n \"Controller 28 processes print and scan data and operates print engine 30 during printing and scanner system 40 during scanning.\",\n \"Computer 24, which is optional, may be, for example, a personal computer, including electronic memory 60, such as RAM, ROM, and/or NVRAM, an input device 62, such as a keyboard and/or a mouse, and a display monitor 64.Computer 24 also includes a processor, input/output (I/O) interfaces, and may include at least one mass data storage device, such as a hard drive, a CD-ROM and/or a DVD unit (not shown).\",\n \"Computer 24 may also be a device capable of communicating with image forming device 22 other than a personal computer such as, for example, a tablet computer, a smartphone, or other electronic device.\",\n \"In the example embodiment illustrated, computer 24 includes in its memory a software program including program instructions that function as an imaging driver 66, e.g., printer/scanner driver software, for image forming device 22.Imaging driver 66 is in communication with controller 28 of image forming device 22 via communications link 26.Imaging driver 66 facilitates communication between image forming device 22 and computer 24.One aspect of imaging driver 66 may be, for example, to provide formatted print data to image forming device 22, and more particularly to print engine 30, to print an image.\",\n \"Another aspect of imaging driver 66 may be, for example, to facilitate collection of scanned data from scanner system 40.In some circumstances, it may be desirable to operate image forming device 22 in a standalone mode.\",\n \"In the standalone mode, image forming device 22 is capable of functioning without computer 24.Accordingly, all or a portion of imaging driver 66, or a similar driver, may be located in controller 28 of image forming device 22 so as to accommodate printing and/or scanning functionality when operating in the standalone mode.\",\n \"Print engine 30 includes a laser scan unit (LSU) 31, toner cartridge 35, imaging unit 32, and a fuser 37, all mounted within image forming device 22.Imaging unit 32 is removably mounted in image forming device 22 and includes a developer unit 34 that houses a toner sump and a toner delivery system.\",\n \"In one embodiment, the toner delivery system utilizes what is commonly referred to as a single component development system.\",\n \"In this embodiment, the toner delivery system includes a toner adder roll that provides toner from the toner sump to a developer roll.\",\n \"A doctor blade provides a metered uniform layer of toner on the surface of the developer roll.\",\n \"In another embodiment, the toner delivery system utilizes what is commonly referred to as a dual component development system.\",\n \"In this embodiment, toner in the toner sump of developer unit 34 is mixed with magnetic carrier beads.\",\n \"The magnetic carrier beads may be coated with a polymeric film to provide triboelectric properties to attract toner to the carrier beads as the toner and the magnetic carrier beads are mixed in the toner sump.\",\n \"In this embodiment, developer unit 34 includes a magnetic roll that attracts the magnetic carrier beads having toner thereon to the magnetic roll through the use of magnetic fields.\",\n \"Imaging unit 32 also includes a cleaner unit 33 that houses a photoconductive drum and a waste toner removal system.\",\n \"Toner cartridge 35 is removably mounted in imaging forming device 22 in a mating relationship with developer unit 34 of imaging unit 32.An outlet port on toner cartridge 35 communicates with an entrance port on developer unit 34 allowing toner to be periodically transferred from toner cartridge 35 to resupply the toner sump in developer unit 34.The electrophotographic printing process is well known in the art and, therefore, is described briefly herein.\",\n \"During a printing operation, laser scan unit 31 creates a latent image on the photoconductive drum in cleaner unit 33.Toner is transferred from the toner sump in developer unit 34 to the latent image on the photoconductive drum by the developer roll (in the case of a single component development system) or by the magnetic roll (in the case of a dual component development system) to create a toned image.\",\n \"The toned image is then transferred to a media sheet received by imaging unit 32 from media input tray 39 for printing.\",\n \"Toner may be transferred directly to the media sheet by the photoconductive drum or by an intermediate transfer member that receives the toner from the photoconductive drum.\",\n \"Toner remnants are removed from the photoconductive drum by the waste toner removal system.\",\n \"The toner image is bonded to the media sheet in fuser 37 and then sent to an output location or to one or more finishing options such as a duplexer, a stapler or a hole-punch.\",\n \"Referring now to FIG.\",\n \"2, a toner cartridge 100 and an imaging unit 200 are shown according to one example embodiment.\",\n \"Imaging unit 200 includes a developer unit 202 and a cleaner unit 204 mounted on a common frame 206.As discussed above, imaging unit 200 and toner cartridge 100 are each removably installed in image forming device 22.Imaging unit 200 is first slidably inserted into image forming device 22.Toner cartridge 100 is then inserted into image forming device 22 and onto frame 206 in a mating relationship with developer unit 202 of imaging unit 200 as indicated by the arrow shown in FIG.\",\n \"2.This arrangement allows toner cartridge 100 to be removed and reinserted easily when replacing an empty toner cartridge 100 without having to remove imaging unit 200.Imaging unit 200 may also be readily removed as desired in order to maintain, repair or replace the components associated with developer unit 202, cleaner unit 204 or frame 206 or to clear a media jam.\",\n \"With reference to FIGS.\",\n \"2-5, toner cartridge 100 includes a housing 102 having an enclosed reservoir 104 (FIG.\",\n \"5) for storing toner.\",\n \"Housing 102 may include a top or lid 106 mounted on a base 108.Base 108 includes first and second side walls 110, 112 connected to adjoining front and rear walls 114, 116 and a bottom 117.In one embodiment, top 106 is ultrasonically welded to base 108 thereby forming enclosed reservoir 104.First and second end caps 118, 120 may be mounted to side walls 110, 112, respectively, and may include guides 122 to assist the insertion of toner cartridge 100 into image forming device 22 for mating with developer unit 202.First and second end caps 118, 120 may be snap fitted into place or attached by screws or other fasteners.\",\n \"Guides 122 travel in corresponding channels within image forming device 22.Legs 124 may also be provided on bottom 117 of base 106 or end caps 118, 120 to assist with the insertion of toner cartridge 100 into image forming device 22.Legs 124 are received by frame 206 to facilitate the mating of toner cartridge 100 with developer unit 202.A handle 126 may be provided on top 106 or base 108 of toner cartridge 100 to assist with insertion and removal of toner cartridge 100 from imaging unit 200 and image forming device 22.An outlet port 128 is positioned on front wall 114 of toner cartridge 100 for exiting toner from toner cartridge 100.With reference to FIG.\",\n \"5, various drive gears are housed within a space formed between end cap 118 and side wall 110.A main interface gear 130 engages with a drive system in image forming device 22 that provides torque to main interface gear 130.A paddle assembly 140 is rotatably mounted within toner reservoir 104 with first and second ends of a drive shaft 132 of paddle assembly 140 extending through aligned openings in side walls 110, 112, respectively.\",\n \"A drive gear 134 is provided on the first end of drive shaft 132 that engages with main interface gear 130 either directly or via one or more intermediate gears.\",\n \"Bushings may be provided on each end of drive shaft 132 where it passes through side walls 110, 112.An auger 136 having first and second ends 136a, 136b and a spiral screw flight is positioned in a channel 138 extending along the width of front wall 114 between side walls 110, 112.Channel 138 may be integrally molded as part of front wall 114 or formed as a separate component that is attached to front wall 114.Channel 138 is generally horizontal in orientation along with toner cartridge 100 when toner cartridge 100 is installed in image forming device 22.First end 136a of auger 136 extends through side wall 110 and a drive gear (not shown) is provided on first end 136a that engages with main interface gear 130 either directly or via one or more intermediate gears.\",\n \"Channel 138 may include an open portion 138a and an enclosed portion 138b.\",\n \"Open portion 138a is open to toner reservoir 104 and extends from side wall 110 toward second end 136b of auger 136.Enclosed portion 138b of channel 138 extends from side wall 112 and encloses an optional shutter and second end 136b of auger 136.In this embodiment, outlet port 128 is positioned at the bottom of enclosed portion 138b of channel 138 so that gravity will assist in exiting toner through outlet port 128.The shutter is movable between a closed position blocking toner from exiting outlet port 128 and an open position permitting toner to exit outlet port 128.As paddle assembly 140 rotates, it delivers toner from toner reservoir 104 into open portion 138a of channel 138.As auger 136 rotates, it delivers toner received in channel 138 into enclosed portion 138b of channel 138 where the toner passes out of outlet port 128 into a corresponding entrance port 208 in developer unit 202 (FIG.\",\n \"2).\",\n \"In one embodiment, entrance port 208 of developer unit 202 is surrounded by a foam seal 210 that traps residual toner and prevents toner leakage at the interface between outlet port 128 and entrance port 208.The drive system in image forming device 22 includes a drive motor and a drive transmission from the drive motor to a drive gear that mates with main interface gear 130 when toner cartridge 100 is installed in image forming device 22.The drive system in image forming device 22 may include an encoded device, such as an encoder wheel, (e.g., coupled to a shaft of the drive motor) and an associated code reader, such as an infrared sensor, to sense the motion of the encoded device.\",\n \"The code reader is in communication with controller 28 in order to permit controller 28 to track the amount of rotation of main interface gear 130, auger 136 and paddle assembly 140.Although the example embodiment shown in FIGS.\",\n \"2-5 includes a pair of replaceable units in the form of toner cartridge 100 and imaging unit 200, it will be appreciated that the replaceable unit(s) of the image forming device may employ any suitable configuration as desired.\",\n \"For example, in one embodiment, the main toner supply for the image forming device, the developer unit, and the cleaner unit are housed in one replaceable unit.\",\n \"In another embodiment, the main toner supply for the image forming device and the developer unit are provided in a first replaceable unit and the cleaner unit is provided in a second replaceable unit.\",\n \"Further, although the example image forming device 22 discussed above includes one toner cartridge and corresponding imaging unit, in the case of an image forming device configured to print in color, separate replaceable units may be used for each toner color needed.\",\n \"For example, in one embodiment, the image forming device includes four toner cartridges and four corresponding imaging units, each toner cartridge containing a particular toner color (e.g., black, cyan, yellow and magenta) and each imaging unit corresponding with one of the toner cartridges to permit color printing.\",\n \"FIG.\",\n \"6 is a cross-sectional side view of toner cartridge 100 installed in image forming device 22 according to one example embodiment.\",\n \"Paddle assembly 140 includes at least one permanent magnet, such as magnets 150, 168a and 168b shown in FIG.\",\n \"6, that moves within reservoir 104 in response to the rotation of drive shaft 132 and paddle assembly 140.As discussed in greater detail below, the permanent magnet(s) communicate information about toner cartridge 100 to controller 28 of image forming device 22.Image forming device 22 includes a magnetic sensor 300 positioned to detect the motion of the permanent magnet(s) during rotation of shaft 132 when toner cartridge 100 is installed in image forming device 22.Magnetic sensor 300 is in electronic communication with controller 28.In the example embodiment illustrated, magnetic sensor 300 is positioned adjacent to top 106 of housing 102.In other embodiments, magnetic sensor 300 is positioned adjacent to bottom 117, front wall 114, rear wall 116 or side wall 110 or 112.In those embodiments where magnetic sensor 300 is positioned adjacent to top 106, bottom 117, front wall 114 or rear wall 116, the magnet(s) are positioned adjacent to the inner surfaces of top 106, bottom 117, front wall 114 or rear wall 116 as shaft 132 rotates.\",\n \"In those embodiments where magnetic sensor 300 is positioned adjacent to side wall 110 or 112, the magnet(s) are positioned adjacent to the inner surface of side wall 110 or 112.Magnetic sensor 300 may be any suitable device capable of detecting the presence or absence of a magnetic field.\",\n \"For example, magnetic sensor 300 may be a hall-effect sensor, which is a transducer that varies its electrical output in response to a magnetic field.\",\n \"Magnetic sensor 300 is supported by a housing 302 that is movable within image forming device 22.As discussed in greater detail below, housing 302 is biased toward a home position that is in the insertion path of toner cartridge 100 such that as toner cartridge 100 is installed in image forming device 22, an engagement member (not shown in FIG.\",\n \"6 for clarity) on toner cartridge 100 contacts and moves housing 302 into position to detect the permanent magnet(s) in reservoir 104.The positioning of housing 302 by toner cartridge 100 upon installation of toner cartridge 100 into image forming device 22 permits the accurate positioning of magnetic sensor 300 relative to the permanent magnet(s) of each individual toner cartridge 100 installed in image forming device 22 regardless of manufacturing variations between different toner cartridges 100.If instead housing 302 is positioned at a fixed location in image forming device 22, depending on physical variations between different toner cartridges 100, magnetic sensor 300 may not be properly positioned to detect the permanent magnet(s) of a given toner cartridge 100.FIGS.\",\n \"7 and 8 show housing 302 according to one example embodiment.\",\n \"In this embodiment, housing 302 is positioned adjacent to top 106 of housing 102 as shown in FIG.\",\n \"6.Housing 302 includes a bottom 304 that faces toward top 106 of housing 102 when toner cartridge 100 is installed in image forming device 22 and a top 306 that faces away from toner cartridge 100.As shown in FIG.\",\n \"7, in the embodiment illustrated, magnetic sensor 300 is exposed on bottom 304 of housing 302 to permit detection of the permanent magnet(s) of toner cartridge 100.Housing 302 includes a rear 310 that faces toward the direction from which toner cartridge 100 is inserted into image forming device 22 and a front 308 opposite rear 310.Housing 302 also includes a pair of sides 312, 314.Housing 302 is loosely mounted to a frame 316 that is fixedly positioned in image forming device 22.Housing 302 is slidable forward and rearward within an opening 322 in frame 316 between a front end 318 of frame 316 and a rear end 320 of frame 316.Housing 302 is biased toward rear end 320 such as, for example, by one or more extension springs 324.In the embodiment illustrated, extension springs 324 are attached at one end to housing 302 and at the opposite end to rear end 320 of frame 316.Other suitable biasing members may be used such as, for example, one or more compression springs or a material having resilient properties that bias housing 302 toward rear end 320.Housing 302 is movable vertically up and down relative to frame 316 and biased downward such as, for example, by one or more compression springs.\",\n \"In the embodiment illustrated, a compression spring (not shown) is positioned between housing 302 and a plunger 328 that is loosely attached to housing 302 and movable up and down relative to housing 302.A top contact surface 330 of plunger 328 is in pressed contact with the bottom side of a frame 332 (FIG.\",\n \"6) of image forming device 22.Other suitable biasing members may be used such as, for example, one or more extension springs or a material having resilient properties that bias housing 302 downward.\",\n \"Housing 302 is also movable side-to-side within opening 322.In the example embodiment illustrated, frame 316 includes a pair of ledges 334, 335 on opposite sides of opening 322 that run from front end 318 to rear end 320.Housing 302 includes a corresponding pair of guides 336, 337 that run along sides 312, 314 of housing 302 along a front-to-rear dimension of housing 302.The downward bias on housing 302 (e.g., the force from the compression spring on housing 302 resulting from the contact between plunger 328 and frame 332) pushes the bottom surfaces of guides 336, 337 into contact with top surfaces 334a, 335a of ledges 334, 335, respectively.\",\n \"Top surfaces 334a, 335a of ledges 334, 335 also guide the front-to-rear sliding movement of housing 302 when the bottom surfaces of guides 336, 337 are in contact with top surfaces 334a, 335a of ledges 334, 335.Inner surfaces 334b, 335b of ledges 334, 335 limit the side-to-side movement of housing 302 relative to frame 316.As shown in FIG.\",\n \"7, in the embodiment illustrated, housing 302 includes a tapered nose 340 at its rear 310.A bottom surface 340a of nose 340 projects further downward as bottom surface 340a extends from rear 310 toward front 308.The side surfaces 340b, 340c of nose 340 project further outward as side surfaces 340b, 340c extend from rear 310 toward front 308.Nose 340 may include a planar rear surface 340d as illustrated or a curved or pointed rear surface 340d.\",\n \"In the embodiment illustrated, housing 302 also includes a pair of rearward facing engagement surfaces 342, 343.In one embodiment, engagement surfaces 342, 343 receive contact from a corresponding engagement member on toner cartridge 100 to move housing 302 to its operating position where magnetic sensor 300 is aligned with the permanent magnet(s) in reservoir 104 as discussed in greater detail below.\",\n \"With reference to FIGS.\",\n \"9 and 10, toner cartridge 100 is shown with a portion of front wall 114 removed in order to illustrate a portion of reservoir 104.Toner cartridge 100 includes an engagement member 190 positioned on the exterior of housing 102 to contact and move housing 302 into position for magnetic sensor 300 to detect the permanent magnet(s) in reservoir 104.In the example embodiment illustrated, engagement member 190 projects upward from top 106 of housing 102; however, engagement member 190 may be positioned in other locations on housing 102 depending on the position of magnetic sensor 300 in image forming device 22 and the position(s) of the permanent magnet(s) in reservoir 104.In the example embodiment illustrated, engagement member 190 includes a U-shaped projection; however, engagement member 190 may take any suitable form.\",\n \"In one embodiment, the permanent magnet(s) in reservoir 104 are positioned to pass in close proximity to the inner surface of housing 102 at the location where engagement member 190 is positioned on the exterior of housing 102.In some embodiments where magnetic sensor 300 is positioned adjacent to bottom 117, front wall 114, rear wall 116 or side wall 110 or 112, engagement member 190 is axially aligned relative to drive shaft 132 with the permanent magnet(s), e.g., magnets 150, 168a and 168b, of paddle assembly 140.A front surface 191 of engagement member 190 is unobstructed to allow front surface 191 to directly contact housing 302 during insertion of toner cartridge 100 into image forming device 22.In the example embodiment illustrated, engagement member 190 includes a rear portion 192 that forms the bottom of the “U” shape and a pair of forward extending portions 193 that are spaced axially apart from each other and form the upper portions of the “U” shape.\",\n \"In the example embodiment illustrated, front surface 191 of engagement member 190 includes a pair of front engagement surfaces 194, 195 positioned at frontmost ends of forward extending portions 193.In one embodiment, front engagement surfaces 194, 195 are aligned with each other in the front-to-rear dimension of housing 102.Engagement surfaces 194, 195 are positioned to directly contact engagement surfaces 342, 343 of housing 302 as toner cartridge 100 is inserted into image forming device 22 to move housing 302 to its operating position as discussed in greater detail below.\",\n \"In the example embodiment illustrated, forward extending portions 193 include inner side surfaces 193a, 193b that face each other and are aligned with each other in the front-to-rear dimension of housing 102.Toner cartridge 100 may also include a lead-in ramp 196 positioned in front of and leading toward engagement member 190 and axially aligned relative to drive shaft 132 with the permanent magnet(s) of paddle assembly 140.The top surface of ramp 196 inclines upward as ramp 196 extends toward engagement member 190.In one embodiment, the top surface of ramp 196 is substantially planar and includes a substantially constant slope.\",\n \"Toner cartridge 100 may include a planar top surface 198 that extends forward from engagement member 190 and that is axially aligned relative to drive shaft 132 with the permanent magnet(s) of paddle assembly 140.In the embodiment illustrated, ramp 196 leads to planar top surface 198, which continues rearward along top 106 of housing 102 from ramp 196 to rear portion 192 of engagement member 190.In one embodiment, planar top surface 198 is substantially horizontal when toner cartridge 100 is in its operative orientation, i.e., the orientation of toner cartridge 100 when it is fully installed in image forming device 22.FIGS.\",\n \"11-16 are sequential views that illustrate the interaction between engagement member 190 of toner cartridge 100 and housing 302 of magnetic sensor 300 when toner cartridge 100 is inserted into image forming device 22.FIG.\",\n \"11 shows toner cartridge 100 as it enters image forming device 22 before contacting housing 302 of magnetic sensor 300.As shown in FIG.\",\n \"11, housing 302 is biased rearward against rear end 320 of opening 322 in frame 316.Housing 302 is also biased downward against top surfaces 334a, 335a of ledges 334, 335 with top contact surface 330 of plunger 328 in contact with the bottom side of frame 332 of image forming device 22.FIG.\",\n \"12 shows toner cartridge 100 inserted further into image forming device 22.As toner cartridge 100 first contacts housing 302, lead-in ramp 196 of toner cartridge 100 contacts tapered bottom surface 340a of nose 340 of housing 302.As toner cartridge 100 advances, lead-in ramp 196 slides across tapered bottom surface 340a of nose 340 applying an upward force on housing 302 that overcomes the downward bias on housing 302 causing housing 302 to gradually lift upward.\",\n \"As shown in FIG.\",\n \"13, housing 302 reaches its final vertical position once the rear end of ramp 196 reaches the bottom 304 of housing 302.As toner cartridge 100 advances further, planar top surface 198 slides across bottom 304 of housing 302 and engagement member 190 advances toward housing 302.With reference to FIGS.\",\n \"14A and 14B, as toner cartridge 100 advances further, rear 310 of housing 302 reaches engagement member 190.If housing 302 is misaligned with toner cartridge 100 in the side-to-side direction, inner side surfaces 193a, 193b of forward extending portions 193 of engagement members 190 directly contact one or both of the tapered side surfaces 340b, 340c of nose 340.The contact between inner side surfaces 193a, 193b of forward extending portions 193 of engagement members 190 and side surfaces 340b, 340c of nose 340 align housing 302 with engagement member 190 in the side-to-side direction as toner cartridge 100 advances.\",\n \"FIGS.\",\n \"15A and 15B show housing 302 aligned in the side-to-side direction with engagement member 190 and toner cartridge 100 advanced to the point where engagement surfaces 194, 195 have begun to contact corresponding rearward facing engagement surfaces 342, 343 of housing 302.As toner cartridge 100 advances further, the contact between bottom 304 and planar top surface 198 maintains the vertical position of housing 302 relative to toner cartridge 100 and the inner side surfaces 193a, 193b of forward extending portions 193 of engagement members 190 ensure that the side-to-side alignment of housing 302 relative to toner cartridge 100 is maintained.\",\n \"As toner cartridge 100 continues to advance to its operating position, the contact between engagement surfaces 194, 195 of engagement member 190 of toner cartridge 100 and rearward facing engagement surfaces 342, 343 of housing 302 overcomes the rearward bias on housing 302 causing housing 302 to slide in opening 322 toward front end 318 of frame 316.In this manner, engagement surfaces 194, 195 of engagement member 190 push against rearward facing engagement surfaces 342, 343 of housing 302 causing housing 302 to move forward with toner cartridge 100.Housing 302 reaches its operating position with magnetic sensor 300 positioned to detect the permanent magnet(s) in reservoir 104 once toner cartridge 100 is fully installed in image forming device 22 as shown in FIG.\",\n \"16.The contact between engagement surfaces 194, 195 and rearward facing engagement surfaces 342, 343 of housing 302 maintains the front-to-rear position of housing 302 relative to toner cartridge 100.When toner cartridge 100 is removed from image forming device 22, this sequence is reversed and the downward and rearward bias on housing 302 returns housing 302 to the position shown in FIG.\",\n \"11.While the example embodiment illustrated in FIGS.\",\n \"11-16 shows engagement member 190 of toner cartridge 100 contacting housing 302 of magnetic sensor 300 directly, in other embodiments, engagement member 190 contacts an intermediate linkage that, in turn, moves housing 302 from its home position to its operating position.\",\n \"As discussed above, engagement member 190 may take many suitable forms.\",\n \"FIGS.\",\n \"17A-17D illustrate several additional examples.\",\n \"FIG.\",\n \"17A shows an engagement member 1190 that includes a pair of cylinders 1192, 1193 that project from top 106 of housing 102.Engagement member 1190 has a front surface 1191 that includes a pair of front engagement surfaces 1194, 1195 positioned to contact corresponding engagement surfaces 342, 343 of housing 302.In one embodiment, front engagement surfaces 1194, 1195 are positioned at substantially the same locations as front engagement surfaces 194, 195 of engagement member 190 discussed above.\",\n \"Side surfaces 1196, 1197 of cylinders 1192, 1193 are positioned to realign housing 302 in the side-to-side direction if housing 302 is misaligned upon insertion of toner cartridge 100 into image forming device 22 similar to inner side surfaces 193a, 193b discussed above.\",\n \"FIG.\",\n \"17B shows an engagement member 2190 that includes a pair of generally rectangular projections 2192, 2193 from top 106 of housing 102.Engagement member 2190 has a front surface 2191 that includes a pair of front engagement surfaces 2194, 2195 positioned to contact corresponding engagement surfaces 342, 343 of housing 302.In one embodiment, front engagement surfaces 2194, 2195 are positioned at substantially the same locations as front engagement surfaces 194, 195 of engagement member 190 discussed above.\",\n \"Side surfaces 2196, 2197 of rectangular projections 2192, 2193 are positioned to realign housing 302 in the side-to-side direction if housing 302 is misaligned upon insertion of toner cartridge 100 into image forming device 22 similar to inner side surfaces 193a, 193b discussed above.\",\n \"FIG.\",\n \"17C shows an engagement member 3190 that includes a projection 3192 from top 106 of housing 102.Engagement member 3190 has a front surface 3191 that includes a front engagement surface 3194 positioned to contact rear 310 of housing 302, which serves as an engagement surface of housing 302 in this embodiment.\",\n \"In one embodiment, engagement surface 3194 is positioned at substantially the same location as rear portion 192 of engagement member 190 discussed above.\",\n \"FIG.\",\n \"17D shows an engagement member 4190 that includes a cutout or recess 4191 in top 106 of housing 102.A top surface of housing 302 inside of recess 4191 forms a planar top surface 4196 similar to planar top surface 196 discussed above.\",\n \"A rear wall 4192 is positioned at a rearmost end of recess 4191 and may be positioned at substantially the same location as rear portion 192 of engagement member 190 discussed above.\",\n \"Side walls 4197, 4198 of recess 4191 are positioned to realign housing 302 in the side-to-side direction if housing 302 is misaligned upon insertion of toner cartridge 100 into image forming device 22 similar to inner side surfaces 193a, 193b discussed above.\",\n \"A front engagement surface 4194, 4195 is positioned at the front of each side wall 4196, 4197.Front engagement surfaces 4194, 4195 are positioned to contact corresponding engagement surfaces 342, 343 of housing 302.In one embodiment, front engagement surfaces 4194, 4195 are positioned at substantially the same locations as front engagement surfaces 194, 195 of engagement member 190 discussed above.\",\n \"In another embodiment, rear wall 4192 is positioned to contact rear 310 of housing 302, which serves as an engagement surface of housing 302 in this embodiment.\",\n \"As discussed above, paddle assembly 140 includes at least one permanent magnet that moves within reservoir 104 in response to the rotation of drive shaft 132 and that communicates information about toner cartridge 100 to controller 28 of image forming device 22.FIG.\",\n \"18 shows paddle assembly 140 having permanent magnets for toner level sensing in greater detail according to one example embodiment.\",\n \"In operation, shaft 132 rotates in the direction shown by arrow A in FIG.\",\n \"18.Paddle assembly 140 includes a fixed paddle 141 that is fixed to shaft 132 such that fixed paddle 141 rotates with shaft 132.In one embodiment shaft 132 extends from side wall 110 to side wall 112.In the embodiment illustrated, fixed paddle 141 includes a plurality of arms 142 extending radially from shaft 132.In the example embodiment illustrated, fixed paddle 141 includes two sets 142a, 142b of arms 142.In this embodiment, in the position illustrated in FIG.\",\n \"18, arms 142 of first set 142a extend from shaft 132 toward rear wall 116 and arms 142 of second set 142b extend from shaft 132 toward front wall 114.Of course these positions change as shaft 132 rotates.\",\n \"The arms 142 of each set 142a, 142b are radially aligned and axially offset from each other.\",\n \"The arms 142 of first set 142a are offset circumferentially by approximately 180 degrees from the arms 142 of second set 142b.\",\n \"Other embodiments include one set of arms 142 or more than two sets of arms 142 extending from shaft 132.In other embodiments, arms 142 are not arranged in sets.\",\n \"Further, arms 142 may extend radially or non-radially from shaft 132 in any manner desired.\",\n \"Fixed paddle 141 may include a cross member 144 connected to each set 142a, 142b of arms 142.Cross members 144 may extend across all or a portion of the arms 142 of sets 142a, 142b.\",\n \"Cross members 144 help arms 142 stir and mix toner in reservoir 104 as shaft 132 rotates.\",\n \"A breaker bar 146 that is generally parallel to shaft 132 may be positioned radially outward from each cross member 144 and connected to the distal ends of arms 142.Breaker bars 146 are positioned in close proximity to inner surfaces of housing 102 without making contact with the inner surfaces of housing 102 to help break apart toner clumped near the inner surfaces of housing 102.Scrapers 148 may extend in a cantilevered manner from cross members 144.Scrapers 148 are formed from a flexible material such as a polyethylene terephthalate (PET) material, e.g., MYLAR® available from DuPont Teijin Films, Chester, Va., USA.\",\n \"Scrapers 148 form an interference fit with the inner surfaces of top 106, front wall 114, rear wall 116 and bottom 117 to wipe toner from the inner surfaces of reservoir 104.Scrapers 148 also push toner into open portion 138a of channel 138 as shaft 132 rotates.\",\n \"Specifically, as cross member 144 rotates past open portion 138a of channel 138, from bottom 117 to top 106, the interference fit between scraper 148 and the inner surface of front wall 114 causes scraper 148 to have an elastic response as the scraper 148 passes open portion 138a of channel 138 thereby flicking or pushing toner toward open portion 138a of channel 138.Additional scrapers may be provided on arms 142 at the axial ends of shaft 132 to wipe toner from the inner surfaces of side walls 110 and 112 as desired.\",\n \"The arrangement of fixed paddle 141 shown in FIG.\",\n \"18 is not intended to be limiting.\",\n \"Fixed paddle 141 may include any suitable combination of projections, agitators, paddles, scrapers and linkages to agitate and move the toner stored in reservoir 104 as desired.\",\n \"In the example embodiment illustrated, a permanent magnet 150 is rotatable with shaft 132 and detectable by a magnetic sensor as discussed in greater detail below.\",\n \"In one embodiment, magnet 150 is connected to shaft 132 by fixed paddle 141.In the example embodiment illustrated, first set 142a of arms 142 includes a pair of axially spaced arms 143 positioned at one axial end of shaft 132.Arms 143 initially extend radially outward from shaft 132 and then bend opposite the operative rotational direction of shaft 132 at the distal ends of arms 143.A cross member 145 connects the distal ends of arms 143 and extends substantially parallel to shaft 132.In the example embodiment shown, magnet 150 is positioned in a finger 152 that extends outward from cross member 145 toward the inner surfaces of housing 102.Finger 152 extends in close proximity to but does not contact the inner surfaces of housing 102 so that magnet 150 is positioned in close proximity to the inner surfaces of housing 102.In one embodiment, fixed paddle 141 is composed of a non-magnetic material and magnet 150 is held by a friction fit in a cavity in finger 152.Magnet 150 may also be attached to finger 152 using an adhesive or fastener(s) so long as magnet 150 will not dislodge from finger 152 during operation of toner cartridge 100.Magnet 150 may be any suitable size and shape so as to be detectable by a magnetic sensor.\",\n \"For example, magnet 150 may be a cube, a rectangular, octagonal or other form of prism, a sphere or cylinder, a thin sheet or an amorphous object.\",\n \"In another embodiment, finger 152 is composed of a magnetic material such that the body of finger 152 forms the magnet 150.Magnet 150 may be composed of any suitable material such as steel, iron, nickel, etc.\",\n \"While the example embodiment illustrated in FIG.\",\n \"18 shows magnet 150 mounted on finger 152 of fixed paddle 141, magnet 150 may be positioned on any suitable linkage to shaft 132 such as a cross member, arm, projection, finger, agitator, paddle, etc.\",\n \"of fixed paddle 141 or separate from fixed paddle 141.A sensing linkage 160 is mounted to shaft 132.Sensing linkage 160 rotates with shaft 132 but is movable to a certain degree independent of shaft 132.Sensing linkage 160 is free to rotate forward and backward on shaft 132 relative to fixed paddle 141 and to magnet 150 between a forward rotational stop and a rearward rotational stop.\",\n \"Sensing linkage 160 includes a leading paddle member 162.In the embodiment illustrated, leading paddle member 162 is connected to shaft 132 by a pair of arms 164 positioned between and next to arms 143 of fixed paddle 141.Leading paddle member 162 includes a paddle surface 166 that engages the toner in reservoir 104 as discussed in greater detail below.\",\n \"In the example embodiment illustrated, paddle surface 166 is substantially planar and normal to the direction of motion of sensing linkage 160 to allow paddle surface 166 to strike toner in reservoir 104.Sensing linkage 160 also includes one or more permanent magnets 168.Magnet(s) 168 are mounted on one or more magnet support(s) 170 of sensing linkage 160 that are positioned in close proximity to but do not contact the inner surfaces of housing 102.In this manner, magnet(s) 168 are positioned in close proximity to the inner surfaces of housing 102 but the inner surfaces of housing 102 do not impede the motion of sensing linkage 160.In the example embodiment illustrated, magnet support 170 is connected to shaft 132 by a pair of arms 172 positioned between and next to arms 143 of fixed paddle 141.Arms 172 are connected to arms 164.In this embodiment, in the position illustrated in FIG.\",\n \"18, arms 172 extend from shaft 132 toward top 106.Of course the position of arms 172 changes as shaft 132 rotates.\",\n \"In this embodiment, magnet support 170 is relatively thin in the radial dimension and extends circumferentially relative to shaft 132 between distal ends of arms 172 along the rotational path of magnet(s) 168 to minimize the drag on magnet support 170 as it passes through toner in reservoir 104.Along the operative rotational direction A of shaft 132, leading paddle member 162 is positioned ahead of magnet 150 which is positioned ahead of magnet(s) 168.In the example embodiment illustrated in FIGS.\",\n \"6 and 18, two magnets 168a, 168b are mounted on magnet support 170; however, one magnet 168 (as shown in FIG.\",\n \"5) or more than two magnets 168 may be used as desired.\",\n \"Magnets 168a, 168b are substantially radially and axially aligned and spaced circumferentially from each other relative to shaft 132.Magnet(s) 168 are also substantially radially and axially aligned and spaced circumferentially from magnet 150 relative to shaft 132.In one embodiment, magnet support 170 is composed of a non-magnetic material and magnet(s) 168 are held by a friction fit in one or more cavities in magnetic support 170.Magnet(s) 168 may also be attached to magnet support 170 using an adhesive or fastener(s) so long as magnet(s) 168 will not dislodge from magnet support 170 during operation of toner cartridge 100.As discussed above, magnet(s) 168 may be any suitable size and shape and composed of any suitable material.\",\n \"Magnet support 170 may take many different forms including an arm, projection, linkage, cross member, etc.\",\n \"In some embodiments, sensing linkage 160 is biased in the operative rotational direction toward a forward rotational stop by one or more biasing members.\",\n \"In the example embodiment illustrated, sensing linkage 160 is biased by an extension spring 176 connected at one end to an arm 172 of magnet support 170 and at the other end to arm 143 of fixed paddle 141.However, any suitable biasing member may be used as desired.\",\n \"For example, in another embodiment, a torsion spring biases sensing linkage 160 in the operative rotational direction.\",\n \"In another embodiment, a compression spring is connected at one end to an arm 164 of leading paddle member 162 and at the other end to arm 143 of fixed paddle 141.In another embodiment, sensing linkage 160 is free to fall by gravity toward its forward rotational stop as sensing linkage 160 rotates past the uppermost point of its rotational path.\",\n \"In the example embodiment illustrated, the forward rotational stop includes a stop 178 that extends axially from the side of one or both of the arms 172 of magnet support 170.Stop 178 is arched and includes a leading surface 180 that contacts arm 143 of fixed paddle 141 to limit the motion of sensing linkage 160 relative to magnet 150 in the operative rotational direction.\",\n \"In the example embodiment illustrated, the rearward rotational stop includes a trailing portion 182 of leading paddle member 162.Trailing portion 182 of leading paddle member 162 contacts a leading portion 184 of cross member 145 to limit the motion of sensing linkage 160 relative to magnet 150 in a direction opposite the operative rotational direction.\",\n \"It will be appreciated that the forward and rearward rotational stops may take other forms as desired.\",\n \"FIGS.\",\n \"19A-19C depict the operation of magnets 150 and 168 at various toner levels with engagement member 190 removed from toner cartridge 100 for clarity.\",\n \"FIGS.\",\n \"19A-19C depict a clock face in dashed lines along the rotational path of shaft 132 and paddle assembly 140 in order to aid in the description of the operation of magnets 150 and 168.In one embodiment, the poles of magnets 150, 168 are directed toward the position of magnetic sensor 300 in order to facilitate the detection of magnets 150, 168 by magnetic sensor 300.Magnetic sensor 300 may be configured to detect one of a north pole and a south pole or both.\",\n \"Where magnetic sensor 300 detects one of a north pole and a south pole, magnets 150, 168 may be positioned such that the detected pole is directed toward magnetic sensor 300.The motion of sensing linkage 160 and magnet(s) 168 relative to magnet 150 as shaft 132 rotates may be used to determine the amount of toner remaining in reservoir 104.As shaft 132 rotates, in the embodiment illustrated, fixed paddle 141 rotates with shaft 132 causing magnet 150 to pass magnetic sensor 300 at the same point during each revolution of shaft 132.On the other hand, the motion of sensing linkage 160, which is free to rotate relative to shaft 132 between its forward and rearward rotational stops, depends on the amount of toner 105 present in reservoir 104.As a result, magnet(s) 168 pass magnetic sensor 300 at different points during the revolution of shaft 132 depending on the toner level in reservoir 104.Accordingly, variation in the angular separation or offset between magnet 150, which serves as a reference point, and magnet(s) 168, which provide(s) sense points, as they pass magnetic sensor 300 may be used to determine the amount of toner remaining in reservoir 104.In an alternative embodiment, the linkage connecting magnet 150 to shaft 132, such as fixed paddle 141, is movable to a certain degree independent of shaft 132; however, it is preferred that magnet 150 passes magnetic sensor 190 in the same position relative to shaft 132 during each revolution of shaft 132 so that the position(s) of magnet(s) 168 may be consistently evaluated relative to the position of magnet 150.When toner reservoir 104 is relatively full, toner 105 present in reservoir 104 prevents sensing linkage 160 from advancing ahead of its rearward rotational stop.\",\n \"Instead, sensing linkage 160 is pushed through its rotational path by fixed paddle 141 when shaft 132 rotates.\",\n \"Accordingly, when toner reservoir 104 is relatively full, the amount of rotation of shaft 132 between magnet 150 passing magnetic sensor 300 and magnets 168a, 168b on sensing linkage 160 passing magnetic sensor 300 is at its maximum.\",\n \"In other words, because sensing linkage 160 is at its rearward rotational stop, the angular separation from magnet 168a to magnet 150 when magnet 168a reaches magnetic sensor 300 and from magnet 168b to magnet 150 when magnet 168b reaches magnetic sensor 300 are at their maximum limits.\",\n \"As the toner level in reservoir 104 decreases as shown in FIG.\",\n \"19A, sensing linkage 160 is positioned forward from its rearward rotational stop as leading paddle member 162 rotates forward from the “12 o'clock” position.\",\n \"Leading paddle member 162 advances ahead of the rearward rotational stop of sensing linkage 160 until paddle surface 166 contacts toner 105, which stops the advance of sensing linkage 160.In one embodiment where paddle assembly 140 includes scrapers 148, scrapers 148 are not present on cross member 144 connected to set 142b of arms 142 along the axial portion of shaft 132 spanned by leading paddle member 162 so that toner 105 is not disturbed immediately before paddle surface 166 contacts toner 105 after leading paddle member 162 rotates forward from the “12 o'clock” position.\",\n \"At higher toner levels, leading paddle member 162 is stopped by toner 105 before magnets 168a, 168b reach magnetic sensor 300 such that the amount of rotation of shaft 132 between magnet 150 passing magnetic sensor 300 and magnets 168a, 168b passing magnetic sensor 300 remains at its maximum.\",\n \"Sensing linkage 160 then remains generally stationary on top of (or slightly below) toner 105 until fixed paddle 141 catches up to leading paddle member 162 at the rearward rotational stop of sensing linkage 160 and fixed paddle 141 resumes pushing sensing linkage 160.With reference to FIG.\",\n \"19B, as the toner level in reservoir 104 continues to decrease, at the point where leading paddle member 162 encounters toner 105 magnet 168a is detected by magnetic sensor 300.As a result, the amount of rotation of shaft 132 between magnet 150 passing magnetic sensor 300 and magnet 168a passing magnetic sensor 300 decreases.\",\n \"Sensing linkage 160 then remains generally stationary on top of (or slightly below) toner 105 with magnet 168a in the sensing window of magnetic sensor 300 until fixed paddle 141 catches up to leading paddle member 162 and resumes pushing sensing linkage 160.As a result, leading paddle member 162 is stopped by toner 105 before magnet 168b reaches magnetic sensor 300 such that the amount of rotation of shaft 132 between magnet 150 passing magnetic sensor 300 and magnet 168b passing magnetic sensor 300 remains at its maximum.\",\n \"With reference to FIG.\",\n \"19C, as the toner level in reservoir 104 decreases even further, at the point where leading paddle member 162 encounters toner 105 magnet 168a has passed magnetic sensor 300 and magnet 168b is detected by magnetic sensor 300.As a result, the amount of rotation of shaft 132 between magnet 150 passing magnetic sensor 300 and magnets 168a and 168b passing magnetic sensor 300 are both decreased relative to their maximums.\",\n \"As a result, it will be appreciated that the motion of magnets 168a, 168b relative to the motion of magnet 150 relates to the amount of toner 105 remaining in reservoir 104.In one embodiment, the initial amount of toner 105 in reservoir 104 is recorded in memory associated with processing circuitry 45 upon filling the toner cartridge 100.Accordingly, upon installing toner cartridge 100 in image forming device 22, controller 28 is able to determine the initial toner level in reservoir 104.Alternatively, each toner cartridge 100 for a particular type of image forming device 22 may be filled with the same amount of toner so that the initial toner level in reservoir 104 used by controller 28 may be a fixed value for all toner cartridges 100.Controller 28 then estimates the amount of toner remaining in reservoir 104 as toner is fed from toner cartridge to imaging unit 200 based on one or more operating conditions of image forming device 22 and/or toner cartridge 100.In one embodiment, the amount of toner 105 remaining in reservoir 104 is approximated based on an empirically derived feed rate of toner 105 from toner reservoir 104 when shaft 132 and auger 136 are rotated to deliver toner from toner cartridge 100 to imaging unit 200.In this embodiment, the estimate of the amount of toner 105 remaining is decreased based on the amount of rotation of the drive motor of image forming device 22 that provides rotational force to main interface gear 130 as determined by controller 28.In another embodiment, the estimate of the amount of toner 105 remaining is decreased based on the number of printable elements (pels) printed using the color of toner contained in toner cartridge 100 while toner cartridge 100 is installed in image forming device 22.In another embodiment, the estimate of the amount of toner 105 remaining is decreased based on the number of pages printed.\",\n \"The amount of toner 105 remaining in reservoir 104 where the amount of rotation of shaft 132 that occurs between magnet 150 passing magnetic sensor 300 and each of the magnets 168 passing magnetic sensor 300 decreases may be determined empirically for a particular toner cartridge design.\",\n \"As a result, each time the amount of rotation of shaft 132 between the detection of magnet 150 and the detection of one of the magnets 168 decreases from its maximum value, controller 28 may adjust the estimate of the amount of toner remaining in reservoir 104 based on the empirically determined amount of toner associated with the decrease in the amount of rotation of shaft 132 between magnet 150 passing magnetic sensor 300 and the respective magnet 168 passing magnetic sensor 300.For example, the toner level in reservoir 104 can be approximated by starting with the initial amount of toner 105 supplied in reservoir 104 and reducing the estimate of the amount of toner 105 remaining in reservoir 104 as toner 105 from reservoir 104 is consumed.\",\n \"As discussed above, the estimate of the toner remaining may be decreased based on one or more conditions such as the number of rotations of the drive motor, main interface gear 130 or shaft 132, the number of pels printed, the number of pages printed, etc.\",\n \"The estimated amount of toner remaining may be recalculated when the amount of rotation of shaft 132 as determined by controller 28 between magnet 150 passing magnetic sensor 300 and magnet 168a of sensing linkage 160 passing magnetic sensor 300 decreases from its maximum value.\",\n \"In one embodiment, this includes replacing the estimate of the amount of toner remaining with the empirical value associated with the decrease in the amount of rotation of shaft 132 between magnet 150 passing magnetic sensor 300 and magnet 168a passing magnetic sensor 300.In another embodiment, the recalculation gives weight to both the present estimate of the amount of toner remaining and the empirical value associated with the decrease in the amount of rotation of shaft 132 between magnet 150 passing magnetic sensor 300 and magnet 168a passing magnetic sensor 300.The revised estimate of the amount of toner 105 remaining in reservoir 104 is then decreased as toner 105 from reservoir 104 is consumed using one or more conditions as discussed above.\",\n \"The estimated amount of toner remaining may be recalculated again when the amount of rotation of shaft 132 as determined by controller 28 between magnet 150 passing magnetic sensor 300 and magnet 168b of sensing linkage 160 passing magnetic sensor 300 decreases from its maximum value.\",\n \"As discussed above, this may include replacing the estimate of the amount of toner remaining or recalculating the estimate giving weight to both the present estimate of the amount of toner remaining and the empirical value associated with the decrease in the amount of rotation of shaft 132 between magnet 150 passing magnetic sensor 300 and magnet 168b passing magnetic sensor 300.This process may be repeated until reservoir 104 is out of toner 105.In one embodiment, the present estimate of the amount of toner 105 remaining in reservoir 104 is stored in memory associated with processing circuitry 45 of toner cartridge 100 so that the estimate travels with toner cartridge 100 in case toner cartridge 100 is removed from one image forming device 22 and installed in another image forming device 22.In this manner, the detection of the motion of magnets 168 relative to the motion of magnet 150 may serve as a correction for an estimate of the toner level in reservoir 104 based on other conditions such as an empirically derived feed rate of toner or the number of pels or pages printed as discussed above to account for variability and to correct potential error in such an estimate.\",\n \"For example, an estimate of the toner level based on conditions such as an empirically derived feed rate of toner or the number of pels or pages printed may drift from the actual amount of toner 105 remaining in reservoir 104 over the life of toner cartridge 100, i.e., a difference between an estimate of the toner level and the actual toner level may tend to increase over the life of toner cartridge 100.Recalculating the estimate of the amount of toner 105 remaining based on the motion of magnet(s) 168 relative to the motion of magnet 150 helps correct this drift to provide a more accurate estimate of the amount of toner 105 remaining in reservoir 104.It will be appreciated that sensing linkage 160 may include any suitable number of magnets 168 desired depending on how many recalculations of the estimate of the amount of toner remaining are desired.\",\n \"For example, sensing linkage 160 may include more than two magnets 168 spaced circumferentially from each other where recalculation of the estimated toner level is desired more frequently.\",\n \"Alternatively, sensing linkage 160 may include a single magnet 168 where recalculation of the estimated toner level is desired only once, such as near the point where reservoir 104 is nearly empty.\",\n \"The positions of magnets 168 relative to leading paddle member 162 may be selected in order to sense particular toner levels desired (e.g., 300 grams of toner remaining, 100 grams of toner remaining, etc.).\",\n \"Further, where shaft 132 rotates at a constant speed during operation of toner cartridge 100, time differences between the detection of magnet 150 and magnet(s) 168 by magnetic sensor 300 may be used instead of the amount of rotation of shaft 132.In this embodiment, time differences greater than a predetermined threshold between the detection of magnet 150 and one or more of magnet(s) 168 may be ignored by the processor to account for shaft 132 stopping between print jobs.\",\n \"Sensing linkage 160 is not limited to the shape and architecture shown in FIG.\",\n \"18 and may take many shapes and sizes as desired.\",\n \"The leading paddle member 162 having paddle surface 166 that engages the toner in reservoir 104 may also take many shapes and sizes as desired.\",\n \"For example, in one embodiment, paddle surface 166 is angled with respect to the direction of motion of the sensing linkage 160.For example, paddle surface 166 may be V-shaped and have a front face that forms a concave portion of the V-shaped profile.\",\n \"In another embodiment, paddle surface 166 includes a comb portion with a series of teeth that are spaced axially from each other to decrease the friction between the sensing linkage and the toner.\",\n \"The surface area of paddle surface 166 may also vary as desired.\",\n \"While the example embodiments illustrated in FIGS.\",\n \"19A-19C show magnetic sensor 300 positioned at about “12 o'clock” with respect to paddle assembly 140, magnetic sensor 300 may be positioned elsewhere in the rotational path of paddle assembly 140 as desired.\",\n \"For example, magnetic sensor 300 may be positioned at about “6 o'clock” with respect to paddle assembly 140 by changing the positions of magnet 150 and magnet(s) 168 relative to leading paddle member 162 by 180 degrees.\",\n \"Although the example embodiments discussed above utilize a sensing linkage and a fixed linkage in the reservoir of the toner cartridge, it will be appreciated that a sensing linkage and a fixed linkage each having a magnet may be used to determine the toner level in any reservoir or sump storing toner in image forming device 22 such as, for example, a reservoir of the imaging unit or a storage area for waste toner.\",\n \"Further, the configuration of permanent magnet(s) for toner level sensing is not limited to the example embodiment shown in FIGS.\",\n \"18 and 19A-19C.\",\n \"For example, in another embodiment, a paddle having a permanent magnet is mounted on drive shaft 132 and rotatable independent of drive shaft 132 as described in United States Published Patent Application No.\",\n \"2014/0169806, which is assigned to the same assignee as the present application.\",\n \"In this embodiment, the paddle is pushed through its rotational path by a driving member mounted on drive shaft 132 and free to fall ahead of the driving member subject to resistance by toner present in reservoir 104.Accordingly, it will be appreciated that the motion of the paddle (and the permanent magnet attached thereto) is dependent on the amount of toner in reservoir 104.FIG.\",\n \"20 shows another example embodiment of a paddle assembly 5140.In this embodiment, the toner cartridge includes a paddle 5141 that is fixed to a shaft 5132 such that paddle 5141 rotates with shaft 5132.Paddle 5141 includes one or more permanent magnet(s) 5168 mounted on one or more magnet support(s) 5170.Magnet(s) 5168 are positioned in close proximity to but do not contact the inner surfaces of the housing of the toner cartridge as discussed above.\",\n \"In the example embodiment illustrated, magnet support 5170 is connected to shaft 5132 by a pair of arms 5172.In the example embodiment illustrated, two magnets 5168 are mounted on magnet support 5170; however, more or fewer than two magnets 5168 may be used as desired.\",\n \"Magnets 5168 may be oriented, shaped and mounted to shaft 5132 in various ways as discussed above.\",\n \"In this embodiment, magnetic sensor 300 detects magnets 5168 as shaft 5132 rotates.\",\n \"In this manner, magnetic sensor 300 may be used to detect the presence of the toner cartridge in the image forming device and to confirm that shaft 5132 is rotating properly thereby eliminating the need for additional sensors to perform these functions.\",\n \"Magnetic sensor 300 may also be used to determine the speed of rotation of shaft 5132 by measuring the time difference between the detection of the first magnet and the detection of the second magnet as shaft 5132 rotates.\",\n \"The arrangement of magnet(s) 5168 may communicate additional characteristics of toner cartridge 100 as desired.\",\n \"For example, the number of magnets 5168 attached to shaft 5132 may indicate a characteristic of toner cartridge 100.By way of example, one magnet 5186 may indicate a toner cartridge containing black toner, two magnets 5168 may indicate a toner cartridge containing cyan toner, three magnets 5168 may indicate a toner cartridge containing yellow toner and four magnets 5168 may indicate a toner cartridge containing magenta toner.\",\n \"Further, the spacing between magnets 5168 may indicate a characteristic of toner cartridge 100.For example, a first spacing between magnets 5168 (e.g., 45 degrees) may indicate a low capacity toner cartridge and a second spacing between magnets 5168 (e.g., 90 degrees) may indicate a high capacity toner cartridge.\",\n \"Various other aspects of the arrangement of magnet(s) 5168 may communicate characteristics of toner cartridge 100 and various other characteristics may be encoded in magnet(s) 5168 as desired.\",\n \"The foregoing description illustrates various aspects of the present disclosure.\",\n \"It is not intended to be exhaustive.\",\n \"Rather, it is chosen to illustrate the principles of the present disclosure and its practical application to enable one of ordinary skill in the art to utilize the present disclosure, including its various modifications that naturally follow.\",\n \"All modifications and variations are contemplated within the scope of the present disclosure as determined by the appended claims.\",\n \"Relatively apparent modifications include combining one or more features of various embodiments with features of other embodiments.\"\n ]\n]"},"source":{"kind":"string","value":"Patent_15871446"}}},{"rowIdx":4493798,"cells":{"text":{"kind":"list like","value":[["Welding Assembly and Method","A welding assembly including a current generator, a first electrode electrically coupled to the current generator, the first electrode including a first engagement surface, a second electrode electrically coupled to the current generator, the second electrode including a second engagement surface, a width-determining fixture positioned between the first electrode and the second electrode to define a welding volume having a width, and an electrically nonconductive material positioned to electrically insulate at least one of the first electrode and the second electrode from an electrical conductor outside the width."],["1.A method for welding comprising: assembling a workpiece comprising a first member and a second member, wherein said first member comprises a plurality of strands; positioning a first electrode proximate said first member; positioning a second electrode proximate said second member; clamping said workpiece between said first electrode and said second electrode; positioning said workpiece within a welding volume of a width-determining fixture, said welding volume having a width, wherein a portion of said second member extends outside of said width; positioning an electrically nonconductive material between said second electrode and said portion of said second member; and passing a welding current between said first electrode and said second electrode.","2.The method of claim 1 further comprising providing a current generator, wherein said first electrode and said second electrode are electrically coupled with said current generator.","3.The method of claim 1 wherein said assembling said workpiece further comprises positioning an auxiliary member at least partially around said first member.","4.The method of claim 1 wherein said workpiece comprises aluminum or aluminum alloy.","5.The method of claim 1 wherein said width-determining fixture is electrically isolated from said first electrode.","6.The method of claim 1 wherein said electrically nonconductive material comprises a ceramic material.","7.The method of claim 1 wherein said positioning said electrically nonconductive material comprises securing said electrically nonconductive material to said second electrode with a mechanical fastener.","8.The method of claim 1 wherein said second electrode defines a first recess and a second recess, and wherein said positioning said electrically nonconductive material comprises positioning a first portion of said electrically nonconductive material in said first recess and a second portion of said electrically nonconductive material in said second recess.","9.The method of claim 8 wherein said width-determining fixture comprises a first side stop laterally opposed from a second side stop.","10.The method of claim 9 wherein said first side stop is axially aligned with said first recess and said second side stop is axially aligned with said second recess.","11.The method of claim 9 wherein said first side stop includes a first interior surface and said second side stop includes a second interior surface, wherein said first portion includes a first inner edge and said second portion includes a second inner edge, wherein said first inner edge is axially aligned with, or laterally inward of, said first interior surface, and wherein said second inner edge is axially aligned with, or laterally inward of, said second interior surface.","12.The method of claim 8 wherein said first portion has a first portion engagement surface and said second portion has a second portion engagement surface, and wherein said first portion engagement surface and said second portion engagement surface are coplanar with an engagement surface of said second electrode.","13.The method of claim 1 wherein an axial position of said width-determining fixture is adjustable.","14.A method for welding comprising: assembling a workpiece comprising a first member and a second member, wherein said first member comprises a plurality of strands; positioning a first electrode proximate said first member; positioning a second electrode proximate said second member; positioning said workpiece within a welding volume defined by said first electrode, said second electrode, a first side stop and a second side stop, said welding volume having a width between said first side stop and said second side stop, wherein a portion of said second member extends outside of said width; clamping said workpiece between said first electrode and said second electrode; positioning an electrically nonconductive material between said second electrode and said portion of said second member; and passing a welding current between said first electrode and said second electrode.","15.The method of claim 14 wherein said first side stop and said second side stop are configured to contain hot or molten metal within said width without inhibiting clamping movement of said first electrode relative to said second electrode.","16.The method of claim 14 wherein said assembling said workpiece further comprises positioning an auxiliary member at least partially around said first member.","17.The method of claim 14 wherein said workpiece comprises aluminum or aluminum alloy.","18.The method of claim 14 wherein said width-determining fixture is electrically isolated from said first electrode.","19.The method of claim 14 wherein said electrically nonconductive material comprises a ceramic material.","20.The method of claim 14 wherein said positioning said electrically nonconductive material comprises securing said electrically nonconductive material to said second electrode with a mechanical fastener."],[" BACKGROUND Stranded metals and metal alloys (e.g., stranded cables and wires) find a wide variety of applications.","Particularly, stranded aluminum and aluminum alloys find a wide variety of applications due to their favorable combination of electrical conductivity properties and mechanical properties, including strength-to-weight ratio, low temperature (cryogenic) properties, corrosion resistance and notch toughness.","The challenge with stranded aluminum and aluminum alloys is joining (by welding) the stranded cables or wires to one another and/or to a connector.","During a welding operation (e.g., resistive welding), individual strands of the cable or wire may not consistently liquefy to form a solid welded workpiece.","For example, strands located proximate the periphery of the cable or wire may liquefy; while strands located proximate the center of the cable or wire may not liquefy sufficiently to form a suitably solid weld.","In order to sufficiently liquefy strands proximate the center of the cable or wire, the strands located proximate the periphery of the cable or wire may tend to burn and the whole welded assembly may tend to stick to the weld electrodes.","Accordingly, those skilled in the art continue with research and development efforts in the field of welding stranded metals and metal alloys."],[" SUMMARY In one embodiment, the disclosed welding assembly may include a current generator, a first electrode electrically coupled to the current generator, the first electrode including a first engagement surface, a second electrode electrically coupled to the current generator, the second electrode including a second engagement surface, a width-determining fixture positioned between the first electrode and the second electrode to define a welding volume having a width, and an electrically nonconductive material positioned to electrically insulate at least one of the first electrode and the second electrode from an electrical conductor outside the width.","In another embodiment, the disclosed welding assembly may include a current generator, a first electrode electrically coupled to the current generator, the first electrode including a first engagement surface, a second electrode electrically coupled to the current generator, the second electrode including a second engagement surface, a width-determining fixture including a first side stop laterally opposed from a second side stop, the first and second side stops defining a welding volume between the first and second electrodes, the welding volume having a width, a workpiece at least partially positioned in the welding volume and clamped between the first and second electrodes, the workpiece including at least a first member and a second member, wherein the second member is supported on the second electrode, and wherein a portion of the second member protrudes outside of the width, and an electrically nonconductive material positioned to electrically insulate the second electrode from the portion of the second member that protrudes outside of the width.","In another embodiment, also disclosed is a method for welding.","The method may include the steps of (1) providing a current generator; (2) assembling a workpiece including a first member and a second member, wherein the second member includes strands; (3) positioning a first electrode proximate (at or near) the first member, the first electrode being electrically coupled to the current generator; (4) positioning a second electrode proximate (at or near) the second member, the second electrode being electrically coupled to the current generator; (5) clamping the workpiece between the first electrode and the second electrode; (6) confining the clamped workpiece within a welding volume of a width-determining fixture, the welding volume having a width, wherein a portion of the second member extends outside of the width; (7) electrically isolating the second electrode from the portion of the second member outside of the width; and (8) passing a welding current between the electrodes.","Other embodiments of the disclosed welding assembly and method will become apparent from the following detailed description, the accompanying drawings and the appended claims."],["PRIORITY This application is a divisional of U.S. Ser.","No.","14/225,641 filed on Mar.","26, 2014, which is a continuation-in-part of U.S. Ser.","No.","14/140,362 filed on Dec. 24, 2013.The entire contents of U.S. Ser.","Nos.","14/225,641 and 14/140,362 are incorporated herein by reference.","FIELD The present disclosure is generally related to welding apparatus, systems and methods and, more particularly, to resistance welding assemblies for welding metal and metal alloy stranded cables or wires.","BACKGROUND Stranded metals and metal alloys (e.g., stranded cables and wires) find a wide variety of applications.","Particularly, stranded aluminum and aluminum alloys find a wide variety of applications due to their favorable combination of electrical conductivity properties and mechanical properties, including strength-to-weight ratio, low temperature (cryogenic) properties, corrosion resistance and notch toughness.","The challenge with stranded aluminum and aluminum alloys is joining (by welding) the stranded cables or wires to one another and/or to a connector.","During a welding operation (e.g., resistive welding), individual strands of the cable or wire may not consistently liquefy to form a solid welded workpiece.","For example, strands located proximate the periphery of the cable or wire may liquefy; while strands located proximate the center of the cable or wire may not liquefy sufficiently to form a suitably solid weld.","In order to sufficiently liquefy strands proximate the center of the cable or wire, the strands located proximate the periphery of the cable or wire may tend to burn and the whole welded assembly may tend to stick to the weld electrodes.","Accordingly, those skilled in the art continue with research and development efforts in the field of welding stranded metals and metal alloys.","SUMMARY In one embodiment, the disclosed welding assembly may include a current generator, a first electrode electrically coupled to the current generator, the first electrode including a first engagement surface, a second electrode electrically coupled to the current generator, the second electrode including a second engagement surface, a width-determining fixture positioned between the first electrode and the second electrode to define a welding volume having a width, and an electrically nonconductive material positioned to electrically insulate at least one of the first electrode and the second electrode from an electrical conductor outside the width.","In another embodiment, the disclosed welding assembly may include a current generator, a first electrode electrically coupled to the current generator, the first electrode including a first engagement surface, a second electrode electrically coupled to the current generator, the second electrode including a second engagement surface, a width-determining fixture including a first side stop laterally opposed from a second side stop, the first and second side stops defining a welding volume between the first and second electrodes, the welding volume having a width, a workpiece at least partially positioned in the welding volume and clamped between the first and second electrodes, the workpiece including at least a first member and a second member, wherein the second member is supported on the second electrode, and wherein a portion of the second member protrudes outside of the width, and an electrically nonconductive material positioned to electrically insulate the second electrode from the portion of the second member that protrudes outside of the width.","In another embodiment, also disclosed is a method for welding.","The method may include the steps of (1) providing a current generator; (2) assembling a workpiece including a first member and a second member, wherein the second member includes strands; (3) positioning a first electrode proximate (at or near) the first member, the first electrode being electrically coupled to the current generator; (4) positioning a second electrode proximate (at or near) the second member, the second electrode being electrically coupled to the current generator; (5) clamping the workpiece between the first electrode and the second electrode; (6) confining the clamped workpiece within a welding volume of a width-determining fixture, the welding volume having a width, wherein a portion of the second member extends outside of the width; (7) electrically isolating the second electrode from the portion of the second member outside of the width; and (8) passing a welding current between the electrodes.","Other embodiments of the disclosed welding assembly and method will become apparent from the following detailed description, the accompanying drawings and the appended claims.","BRIEF DESCRIPTION OF THE DRAWINGS FIG.","1 is a schematic illustration of a first embodiment of the disclosed welding assembly; FIG.","2 is a side elevational view of a second embodiment of the disclosed welding assembly; FIGS.","3, 4 and 5 are side elevational views, in section, of a workpiece being welded by the welding assembly of FIG.","2 in accordance with one implementation of the second embodiment; FIG.","6 is a side elevational view, in section, of a workpiece being welded by the welding assembly of FIG.","2 in accordance with another implementation of the second embodiment; FIG.","7 is a side elevational view, in section, of a workpiece being welded by the welding assembly of FIG.","2 in accordance with yet another implementation of the second embodiment; FIGS.","8, 9 and 10 are side elevational views, in section, of a third embodiment of the disclosed welding assembly, shown welding a workpiece; FIG.","11 is a side elevational view, in section, of a workpiece being welded by the welding assembly of FIG.","8 in accordance with another implementation of the third embodiment; FIG.","12 is a schematic illustration of a fourth embodiment of the disclosed welding assembly; FIG.","13 is a side elevational view of a fifth embodiment of the disclosed welding assembly; FIGS.","14, 15 and 16 are side elevational views, in section, of a workpiece being welded by the welding assembly of FIG.","13 in accordance with one implementation of the fifth embodiment; FIG.","17 is a side elevational view, in section, of a workpiece being welded by the welding assembly of FIG.","13 in accordance with another implementation of the fifth embodiment; FIG.","18 is a side elevational view, in section, of a sixth embodiment of the disclosed welding assembly; and FIG.","19 is one embodiment of the disclosed method for welding metal and metal alloy stranded cable.","DETAILED DESCRIPTION The following detailed description refers to the accompanying drawings, which illustrate specific embodiments of the disclosure.","Other embodiments having different structures and operations do not depart from the scope of the present disclosure.","Like reference numerals may refer to the same element or component in the different drawings.","Referring to FIGS.","1, a first embodiment of the disclosed welding assembly, generally designated 10, may include a first (e.g., upper) electrode 12, a second (e.g., lower) electrode 14 and a current generator 16.The first electrode 12 and the second electrode 14 may be located at axially opposite positions relative to the longitudinal axis A of the welding assembly 10.The first electrode 12 may be electrically coupled to the current generator 16 and may include and a first engagement surface 18.The second electrode 14 may be electrically coupled to the current generator 16 and may include a second engagement surface 22.The first engagement surface 18 and the second engagement surface 22 may include size and shape suitable to engage (e.g., contact) at least a portion of an exterior surface of a workpiece 24 (FIG.","2).","For example, the first engagement surface 18 of the first electrode 12 and the second engagement surface 22 of the second electrode 14 may be configured to solidify a plurality of metal or metal alloy strands (e.g., a metal or metal alloy stranded cable or wire) and weld the solidified strands to a metal or metal alloy connector terminal.","The current generator 16 may be any source of electrical energy capable of supplying an electric current to the first electrode 12 and the second electrode 14 to achieve resistive heating in the workpiece 24 (FIG.","2).","The current generator 16 may include appropriate circuitry for supplying electric current to the first electrode 12 and the second electrode 14, as well as controlling the magnitude and timing of the electric current being supplied to the first electrode 12 and the second electrode 14.For example, the current generator 16 may be a direct current system, an alternating current system or a stored energy current system.","In an example construction, the current generator 16 may include a first terminal 112 and a second terminal 114, the second terminal 114 having a polarity opposite of a polarity of the first terminal 112.The first electrode 12 may be electrically coupled to the first terminal 112.The second electrode 14 may be electrically coupled to the second terminal 114.At this point, those skilled in the art will appreciate that the current generator 16 may be a commercially available resistance welding machine or a component taken from a commercially available resistance welding machine.","The first electrode 12 and the second electrode 14 may be formed from any electrically conductive material.","The first electrode 12 and the second electrode 14 may be formed from a material having a thermal conductivity (e.g., either relatively high thermal conductivity or relatively low thermal conductivity) selected based upon the type weld desired, the material (e.g., aluminum or aluminum alloy) of the workpiece 24, and/or the method for welding being performed by the first electrode 12 and the second electrode 14.For example, the first electrode 12 and/or the second electrodes 14 may be formed from copper or copper alloys (e.g., Resistance Welder Manufacturers Association (“RWMA”) copper alloys Classes 1-5 or 20) when relatively high thermal conductivity is desired.","Alternatively, the first electrode 12 and/or the second electrodes 14 may be formed from refractory materials, tungsten, tungsten/copper alloys or molybdenum (e.g., RWMA Classes 10-14) when relatively low thermal conductivity is desired.","In general, a more conducting electrode material may be used when a steeper thermal gradient is desired between the first electrode 12 and the second electrode 14 and a less conducting electrode material may be used when a less steep temperature gradient is desired between the first electrode 12 and the second electrode 14.The first electrode 12 and/or the second electrode 14 may be cooled.","For example, the first electrode 12 may include one or more first fluid channels 30 defined therein or connected thereto.","The second electrode 14 may include one or more second fluid channels 32 defined therein or connected thereto.","A cooling fluid (e.g., water or ethyl glycol) may flow through the first fluid channels 30 and/or the second fluid channels 32 to remove heat from the first electrode 12 and the second electrode 14, as well as from the workpiece 24 (FIG.","2) supported by (e.g., positioned between) the first electrode 12 and the second electrode 14.Referring to FIGS.","2 and 3, in a second embodiment, the first electrode 12 may be mounted to a first support structure 44 and the second electrode 14 may be mounted to a second support structure 46.For example, the first support structure 44 and/or the second support structure 46 may be an arm or a tong.","The first support structure 44 and the second support structure 46 may be capable of approximating the first electrode 12 and a second electrode 14 to clamp the workpiece 24 between the first electrode 12 and a second electrode 14.In an example implementation, the first electrode 12 and the second electrode 14 may exert a clamping force (e.g., a welding force) to the workpiece 24 positioned there between.","For example, the first electrode 12 and the second electrode 14 may exert a clamping force of approximately between 50 pounds and 100 pounds.","In one example, the first support structure 44 may be moveable such that the first electrode 12 exerts a welding force F1 to the workpiece 24 and the second support structure 44 may be movable such that the second electrode 14 exerts an opposing welding force F2 to the workpiece 24, as illustrated in FIG.","3.As another example, the first support structure 44 may be a movable such that the first electrode 12 exerts a welding force F1 to the workpiece 24 and the second support structure 46 may be stationary (e.g., an anvil).","In an example construction, the first support structure 44 may be connected to a first drive element 48 and/or the second support structure 46 may be connected to a second drive element 50.The first drive element 48 and/or the second drive element 50 may be any mechanism suitable to move (e.g., axially translate) the first support structure 44 and/or the second support structure 44 to approximate the first electrode 12 and the second electrode 14 and exert the clamping force to the workpiece 24.For example, the first drive element 48 and/or the second drive element 50 may be a hydraulic, pneumatic, servo-drive or mechanical drive mechanism (e.g., press).","A width-determining fixture 36 may be positioned between the first electrode 12 and the second electrode 14 to define a welding volume 56 around at least a portion of the workpiece 24.The width-determining fixture 36 may at least partially enclose the workpiece 24 to prevent the flow (e.g., outward flow) of molten or hot metal 72 (FIG.","4) during resistance welding of the workpiece 24.The width-determining fixture 36 may be capable of adjusting an axial position (e.g., parallel to the direction of the clamping force) with respect to the first electrode 12 and/or the second electrode 14 to ensure sides of the welding volume 56 between the first electrode 12 and the second electrode 14 are completely enclosed.","The position of the width-determining fixture 36 with respect to the workpiece 24 may define the width W of the welded workpiece 58 (FIG.","5).","The side stops (width-determining fixtures) may also be moved out sideways when not welding and moved in when welding, instead of being moved up and down.","Such in-and-out movements may also occur through tapered fitting tooling.","In one expression, the width-determining fixture 36 may be connected to or otherwise operably engaged with the first support structure 44 and/or the first drive mechanism 48 to approximate the second electrode 14 in response to the welding force F1 (FIG.","3).","In another expression, the width-determining fixture 36 may be connected to or otherwise operably engaged with the second support structure 46 and/or the second drive mechanism 50 to approximate the first electrode 12 in response to the welding force F2 (FIG.","3), such as illustrated in FIG.","8.Referring still to FIGS.","2 and 3, the workpiece 24 may include one or more members 38, 40 intended to be joined by resistive welding.","While two members 38, 40 of the workpiece 24 are shown in FIGS.","2 and 3, those skilled in the art will appreciate that additional members may be included in the workpiece 24 without departing from the scope of the present disclosure.","The members 38, 40 of the workpiece 24 may be formed from any material capable of being joined by resistive heating.","In one realization, the members 38, 40 of the workpiece 24 may be formed from any metals or metal alloys capable of being joined by resistive heating.","For example, members 38, 40 of the workpiece 24 may be formed from aluminum or aluminum alloys.","The member (e.g., a first member) 38 may include at least two strands 42.Each strand 42 may be formed from metal or metal alloy (e.g., aluminum or aluminum alloy).","For example, the member 38 may be formed from a plurality of elongated strands 42 bundled together and having a generally circular cross-sectional shape.","As a general, non-limiting example, the member 38 may be a metal wire, cable or rope.","As a specific, non-limiting example, the member 38 may be a 25 mm2, 40 mm2 or 50 mm2 stranded wire cable.","The member 40 (e.g., a second member) may be a terminal to which the member 38 (e.g., a stranded cable or wire) is joined by welding.","For example, the member 40 may be a connector terminal suitable for connection (e.g., mechanical and/or electrical connection) to another object (e.g., an aircraft frame, a vehicle frame or an electrical junction).","The first engagement surface 18 of the first electrode 12 may be formed into an arcuate (e.g., curved) surface defining a concave recess 20 configured to make flush contact with at least a portion of the exterior surface 26 of the member 38.For example, the first engagement surface 18 may be machined as a generally semicircular shape or an inverted U shape defining a generally semicircular recess 20 configured to make flush contact with at least a portion of the exterior surface 26 (e.g., a semi-circular portion of the circumferential exterior surface) of the member 38 (e.g., a stranded cable or wire).","The second engagement surface 22 may be formed into a substantially planar surface configured to make flush contact with at least a portion of the exterior surface 34 of the member 40.For example, the second engagement surface 22 may be machined as a substantially flat shape configured to make flush contact with a substantially planar portion of the exterior surface 34 (e.g., a portion of a bottom surface) of the member 40 (e.g., a connector terminal).","Referring to FIG.","4, the curved first engagement surface 18 of the first electrode 12 may create a larger contact surface area for electrical current to pass from the first electrode 12 to the member 38 (e.g., to the plurality of strands 42) as compared to a planar engagement surface.","This larger surface area may decrease the current density at a surface of the workpiece 24 (e.g., between the curved contact surfaces 18 and 26 of the first electrode 12 and the member 38) and increase the current density proximate a center of the workpiece 24.For example, the curved first engagement surface 18 may direct (e.g., focus) the current from the first electrode 12 toward the center of the member 38, as illustrated by directional arrows 60.The current density at an opposing surface of the workpiece 24 (e.g., between planar contact surfaces 22 and 34 of the second electrode 14 and the member 40) may be higher or lower.","For example, the planar second engagement surface 20 may direct the current from the second electrode 14 through the member 40 and through the member 38, as illustrated by directional arrows 62.Thus, when a voltage is applied between the first electrode 12 and the second electrode 14 (e.g., from the current generator 16), a current flows between the first engagement surface 18 and the second engagement surface 22 through the core of the workpiece 24 along the path indicated by arrows 60 and 62.By decreasing the current density at the exterior surface 26 of the member 38 (e.g., at the exterior surfaces of the strands 42) and increasing the current density toward the center of the member 38, the heat generated proximate (e.g., at or near) the center of the member 38 may become greater than the heat generated at any location on the exterior surface 26 of the member 38 tending to more consistently melt the plurality of strands 42 throughout the member 38.Those skilled in the art will appreciate that the first engagement surface 18 and the recess 20 may be provided in various sizes (e.g., length and width), shapes (e.g., curve radius) and configurations, for example, depending upon the diameter of the member 38, the number of strands 42 and the length of the member 38 (e.g., length of a portion of the plurality of strands 42) that is to be welded (e.g., solidified).","Referring to FIGS.","3 and 4, the width-determining fixture 36 may be positioned adjacent to the first electrode 12.In one construction, the width-determining fixture 36 may include a first (e.g., left) side stop 52 and a second (e.g., right) side stop 54.The first side stop 52 may be positioned adjacent to (e.g., to the left of) the first electrode 12 and the second side stop 54 may be positioned adjacent to (e.g., to the right of) the first electrode 12 such that the first side stop 52 and the second side stop 54 are positioned to the sides (e.g., the left side and the right side) of the member 38 when the clamping force is exerted to the workpiece 24.The first side stop 52 and the second side stop 54 may formed from a material having an electrical resistance greater than that of the first electrode 12 and the second electrode 14.For example, the first side stop 52 and the second side stop 54 may be formed from a high resistance metal.","As another example, the first side stop 52 and the second side stop 54 may be formed from an electrically insulating or non-conductive material, such as ceramic.","In general, the material of the first side stop 52 and the second side stop 54 may be selected to ensure the electrical current is directed through the workpiece 24, such as indicated by directional arrows 60 and 62 (FIG.","4).","In an example embodiment, the first side stop 52 may be housed within a first sleeve 64 and the second side stop 54 may be housed within a second sleeve 66.The first sleeve 64 and the second sleeve 66 may be connected to the first support structure 44 such that the first side stop 52 and the second side stop 54 define the welding volume 56 around (e.g., to the sides of) the member 38 as the first electrode 12 approximates the second electrode 14 in response to the welding force F1 (FIG.","3).","When the first electrode 12 approaches the second electrode 14 and exerts the clamping force to the member 38 therebetween, the first side stop 52 and the second side stop 54 may engage the member 40 (e.g., connector terminal) adjacent to the member 38 (e.g., stranded cable).","As such, the welding volume 56 may be defined by the first engagement surface 22 of the first electrode 12, an interior surface 68 of the first side stop 52, an interior surface 70 of the second side stop 54 and a portion of the exterior surface 34 (e.g., a top surface) of the member 40 positioned between the first side stop 52 and the second side stop 54.The position of the first side stop 52 and the second side stop 54 with respect to the first sleeve 64 and the second sleeve 66, respectively, may automatically adjust an axial position (e.g., parallel to the direction of the welding force F1) to constantly engage the exterior surface 34 of the member 40 and contain the flow of molten metal 72 within the welding volume 56, as illustrated in FIG.","4.The first side stop 52 may be outwardly biased from within the first sleeve 64 and the second side stop 54 may be outwardly biased from within the second sleeve 66.For example, the first side stop 52 may be connected within the first sleeve 64 by a first biasing element 74 (e.g., a spring) and the second side stop 54 may be connected within the second sleeve 66 by a second biasing element 76 (e.g., a spring).","A bottom surface 84 (FIG.","2) of the first side stop 52 and the second side stop 54 may be substantially planar to make flush contact with the substantially planar exterior surface 34 of the member 40.As the first support structure 48 approximates the second support structure 46 (e.g., via the first drive element 48), the first electrode 12 may move toward and exert a welding force F1 (e.g., clamping force) upon the member 38 and the first side stop 52 and the second side stop 54 may simultaneously move toward and engage the member 40.As the first support structure 48 further approximates the second support structure 46, the welding force F1 exerted to the member 38 by the first electrode 12 and the second electrode 14 may increase as the first electrode 12 approximates the second electrode 14; however, the first side stop 52 and the second side stop 54 may be at least partially pushed into the first sleeve 64 and the second sleeve 66, respectively, to prevent damage to the member 40 while maintaining flush contact with the member 40 and containing the outward flow of the molten metal 72 (FIG.","4).","Referring to FIG.","5, the welded workpiece 58 may have a shape substantially matching the shape of the welding volume 56.For example, welded workpiece 58 may include a curved upper end 78 substantially matching the curved first engagement surface 18 of the first electrode 12, a planar first (e.g., left) side 80 substantially matching the planar first interior surface 68 of the first side stop 52 and a planar second (e.g., right) side 82 substantially matching the planar second interior surface 70 of the second side stop 54.The welded workpiece 58 may include a solidified portion of the plurality of strands 42 of the member 38 (e.g., a stranded cable) joined to the member 40 (e.g., a connector terminal) through resistive welding.","Referring to FIGS.","6 and 7, the workpiece 24 may also include an auxiliary member 84.The auxiliary member 84 may have a size and shape sufficient to at least partially surround the workpiece 24.The auxiliary member 84 may be formed from a material having the same or similar chemistry as the members 38, 40, or from a material that is compatible with the material from which the members 38, 40 are formed.","For example, when the members 38, 40 are formed from aluminum alloys, the auxiliary member 84 may be formed from an aluminum alloy or appropriate aluminum alloy filler metal.","As illustrated in FIG.","6, in one implementation, the auxiliary member 84 may be a generally semi-circular band 86 having an arcuate (e.g.","curved) body (e.g., U-shaped) of sufficient size and shape to at least partially surround (e.g., cover) the exterior surface 26 of the member 38 (e.g., a stranded cable) and ends that extend to engage the exterior surface 34 of the member 40 (e.g., a connector terminal).","As illustrated in FIG.","7, in another implementation, the auxiliary member 84 may be a generally circular band 88 having a continuous body of sufficient size and shape to completely surround (e.g., cover) the exterior surface 26 of the member 38 (e.g., a stranded cable).","The curved first engagement surface 18 of the first electrode 12 may include a sufficient shaped and size to contact at least a portion of an exterior surface 26 the auxiliary member 84 and focus electrical current toward the center of the workpiece 24 (e.g., the member 38) in a similar manner as described above and illustrated in FIG.","4.The material of the auxiliary member 84 may melt during resistance welding and combine with the molten metal 72 (FIG.","4) within the welding volume 56 to further solidify the plurality of strands 42 of the member 38 into a solid welded workpiece 58, such as illustrated in FIG.","5.The first side stop 52 and the second side stop 54 may be positioned adjacent to (e.g., to the sides of) the auxiliary member 84 when the first electrode 12 exerts welding force F1 upon the workpiece 24.Referring to FIG.","8, the workpiece 24′ may include a member 38′ intended to be solidified by resistive welding.","The member 38′ may include a plurality of strands 42′.","Each strand 42′ may be formed from metal or metal alloy (e.g., aluminum or aluminum alloy).","For example, the member 38′ may be formed from a plurality of elongated strands 42′ bundled together and having a generally circular cross-sectional shape.","As a general, non-limiting example, the member 38′ may be a metal wire, cable or rope.","As a specific, non-limiting example, the member 38′ may be a 25 mm2, 40 mm2 or 50 mm2 stranded wire cable.","While four strands 42′ of the member 38′ of the workpiece 24 are shown in FIGS.","8, 9, 10 and 11, those skilled in the art will appreciate that additional strands 42′ of the member 38′ may be included in the workpiece 24′ without departing from the scope of the present disclosure.","In accordance with a third embodiment, the second engagement surface 22′ of the second electrode 14′ may be formed into an arcuate (e.g.","curved) surface defining a concave recess 28.For example, the second engagement surface 22′ may be machined as a generally semicircular shape defining a generally semicircular recess 28.The first engagement surface 18 and the second engagement surface 22′ may include size and shape suitable to engage (e.g., contact) at least a portion of an exterior surface 26′ of the workpiece 24′ (e.g., an exterior surface of the plurality of strands 42′ of the member 38′).","For example, the first engagement surface 18 of the first electrode 12 and the second engagement surface 22′ of the second electrode 14′ may be configured to solidify the plurality of metal strands 42′ of the member 38′ (e.g., a stranded cable).","Referring to FIG.","9, the curved first engagement surface 18 of the first electrode 12 and the curved second engagement surface 22′ of the second electrode 14′ may create a larger contact surface area for electrical current to pass from the first electrode 12 and the second electrode 14′ to the member 38′ as compared to a planar engagement surface.","This larger surface area may decrease the current density at a surface of the workpiece 24′ (e.g., between the curved contact surfaces 18, 22′ and 26′ of the first electrode 12 and the second electrode 14′ and the member 38′, respectively) and increase the current density at the center of the workpiece 24′.","For example, the curved first engagement surface 18 and the curved second engagement surface 22′ may direct (e.g., focus) the current from the first electrode 12 and the second electrode 14′ toward the center of the member 38′, as illustrated by directional arrows 60′ and 62′.","The width-determining fixture 36 may be positioned adjacent to the first electrode 12 and the second electrode 14′.","In an example embodiment, the width-adjusting fixture 36 may include a first (e.g., left) side stop 52 and an opposing second (e.g., right) side stop 54 adjacent the first electrode 12 and a third (e.g., left) side stop 94 and an opposing fourth (e.g., right) side stop 96 adjacent the second electrode 14′.","The first side stop 52, the second side stop 54, the third side stop 94 and the fourth side stop 96 may be positioned to the sides (e.g., the left side and the right side) of the member 38′ to at least partially define the welding volume 56′ around (e.g., to the sides of) the member 38′ as the first electrode 12 approximates the second electrode 14′ in response to the welding force F1 and/or F2.The third side stop 94 may be housed within a third sleeve 98 and the fourth side stop 96 may be housed within a fourth sleeve 102.The third sleeve 98 and the fourth sleeve 100 may be connected to the second support structure 44.When the first electrode 12 approximates the second electrode 14′ and exert a clamping force to the member 38′ therebetween, the first side stop 52 may engage (e.g., contact) the third side stop 98 and the second side stop 54 may engage the fourth side stop 100.As such, the welding volume 56′ may be defined by the first engagement surface 22 of the first electrode 12, the interior surface 68 of the first side stop 52, an interior surface 102 of the third side stop 98, the interior surface 70 of the second side stop 54, the interior surface 104 of the fourth side stop 100 and the second engagement surface 22′ of the second electrode 14′.","The position of the first side stop 52 and the third side stop 94 with respect to the first sleeve 64 and the third sleeve 98, respectively, may automatically adjust position an axial position (e.g., parallel to the direction of the welding force F1 and F2) to constantly engage each other and contain the flow of molten metal 72′ within the welding volume 56′, as illustrated in FIG.","9.Similarly, the position of the second side stop 54 and the fourth side stop 96 may automatically adjust an axial position with respect to the second sleeve 66 and the fourth sleeve 100, respectively, to constantly engage each other and contain the flow of molten metal 72′ within the welding volume 56′.","For example, the third side stop 94 may be outwardly biased from within the third sleeve 98 and the fourth side stop 96 may be outwardly biased from within the fourth sleeve 100.In an example construction, the third side stop 94 may be connected within the third sleeve 98 by a third biasing element 108 (e.g., a spring) and the fourth side stop 96 may be connected within the fourth sleeve 100 by a fourth biasing element 110 (e.g., a spring).","Engaging surfaces of the first side stop 52 and the third side stop 94 may be substantially planar to make flush contact with each other and engaging surfaces the second side stop 54 and the fourth side stop 96 may be substantially planar to make flush contact with each other.","Referring to FIG.","10, the welded workpiece 58′ may have a shape substantially matching the shape of the welding volume 56′.","For example, welded workpiece 58′ may include a curved upper end 78′ substantially matching the curved first engagement surface 18 of the first electrode 12, a planar first (e.g., left) side 80′ substantially matching the planar interior surface 68 of the first side stop 52 and the interior surface 102 of the third side stop 94, a planar second (e.g., right) side 82′ substantially matching the planar interior surface 70 of the second side stop 54 and interior surface 104 of the fourth side stop 96 and a curved lower end 106 substantially matching the curved second engagement surface 22′ of the second electrode 14′.","For example, the welded workpiece 58′ may include a solidified portion of the plurality of strands 42′ of the member 38′ (e.g., a stranded cable).","Referring to FIG.","11, in another implementation, the workpiece 24′ may also include an auxiliary member 84′.","The auxiliary member 84′ may have a size and shape sufficient to at least partially surround the workpiece 24′.","For example, the auxiliary member 84′ may be a generally circular band 88′ having a continuous body of sufficient size and shape to completely surround (e.g., cover) the exterior surface 26′ of the member 38′ (e.g., a stranded cable) For example, the curved first engagement surface 18 of the first electrode 12 may contact at least a portion (e.g., an upper portion) of the exterior surface 26′ of the auxiliary member 84′ and the curved second engagement surface 22′ of the second electrode 14′ may contact at least a portion (e.g., a lower portion) of the exterior surface 26′ of the auxiliary member 84′ to focus electrical current toward the center of the workpiece 24′ in a similar manner as described above and illustrated in FIG.","9.Referring to FIG.","12, a fourth embodiment of the disclosed welding assembly, generally designated 200, may include a first (e.g., upper) electrode 212, a second (e.g., lower) electrode 214, a current generator 216, a width-determining fixture 236 and an electrically nonconductive material 202.The electrically nonconductive material 202 may be present in the welding assembly 200 as a first portion 206 of electrically nonconductive material 202 and a second portion 208 of electrically nonconductive material 202.With the exception of the presence of electrically nonconductive material 202, the welding assembly 200 may be configured in the same or similar manner as the welding assembly 10 shown in FIG.","1.Specifically, the first electrode 212 may include a first engagement surface 218 and optionally one or more cooling channels 230, the second electrode 214 may by axially opposed from the first electrode 212 and may include a second engagement surface 222 and optionally one or more cooling channels 232, the current generator 216 may include first and second terminals 213, 215 electrically coupled to the first and second electrodes 212, 214, and the width-determining fixture 236 may include side stops 252, 254, which may be biased out of associated sleeves 264, 266 toward the second electrode 214.The electrically nonconductive material 202 may be substantially electrically nonconductive, particularly relative to the electrical conductivity of the second electrode 214.Therefore, when the electrically nonconductive material 202 is positioned between an electrical conductor (e.g., the width-determining fixture 236 and/or the workpiece 224 (see FIG.","13)) and the second electrode 214, the electrically nonconductive material 202 may function as an electrical insulator therebetween.","Thus, when the electrically nonconductive material 202 is properly positioned relative to the second electrode 214, such as vertically below the side stops 252, 254 of the width-determining fixture 236 and sufficiently laterally outside of the side stops 252, 254, shunting of the welding current from the first electrode 212, through the width-determining fixture 236, and to the second electrode 214 (or vice versa) may be substantially inhibited (if not eliminated), thereby focusing the welding current into the workpiece 224 (FIG.","13) that is between the electrodes 212, 214 and the width-determining fixture 236.The electrically nonconductive material 202 may have a composition that renders the electrically nonconductive material 202 sufficiently hard and durable to withstand the clamping forces applied during welding.","Additionally, the composition of the electrically nonconductive material 202 may render the electrically nonconductive material 202 capable of withstanding welding temperatures without melting, decomposing or otherwise degrading.","As one general, non-limiting example, the electrically nonconductive material 202 may be (or may include) a ceramic material.","As one specific, non-limiting example, the electrically nonconductive material 202 may be (or may include) titanium nitride.","As another specific, non-limiting example, the electrically nonconductive material 202 may be (or may include) a machinable ceramic, such as MACOR® machinable glass ceramic commercially available from Corning Incorporated of Corning, N.Y.","The electrically nonconductive material 202 may have a cross-sectional thickness T sufficient to impart the required physical properties.","Depending on composition, if the cross-sectional thickness T is too thin, then the electrically nonconductive material 202 may be brittle.","For example, when the electrically nonconductive material 202 is a ceramic, a cross-sectional thickness T ranging from about 2 mm to about 10 mm or more may be sufficient for the intended purpose, and may facilitate securing the electrically nonconductive material 202 to the second electrode 214 with a mechanical fastener 294, as shown in FIG.","14.Referring to FIGS.","13-16, a fifth embodiment of the welding assembly 200 may be configured in the same or similar manner as the welding assembly 10 shown in FIGS.","2-5, with the exception of the presence of first and second portions 206,208 of electrically nonconductive material 202.With reference to FIGS.","13 and 14, the first electrode 212 may be mounted to a first support structure 244 and the second electrode 214 may be mounted to a second support structure 246.For example, the first support structure 244 and/or the second support structure 246 may be an arm or a tong.","The first support structure 244 and the second support structure 246 may be capable of approximating the first electrode 212 and a second electrode 214 along the longitudinal axis L (FIG.","13) of the welding assembly 200 to clamp the workpiece 224 between the first electrode 212 and a second electrode 214.The first electrode 212 and the second electrode 214 may exert a clamping force (e.g., a welding force) to the workpiece 224 positioned there between.","For example, the first electrode 212 and the second electrode 214 may exert a clamping force of approximately between 50 pounds and 100 pounds.","In one construction, the first support structure 244 may be moveable such that the first electrode 212 exerts a welding force F1 to the workpiece 224 and the second support structure 244 may be movable such that the second electrode 214 exerts an opposing welding force F2 to the workpiece 224, as illustrated in FIG.","14.In another construction, the first support structure 244 may be a movable such that the first electrode 212 exerts a welding force F1 to the workpiece 224 and the second support structure 246 may be stationary (e.g., an anvil).","The first support structure 244 may be connected to a first drive element 248 and/or the second support structure 246 may be connected to a second drive element 250.The first drive element 248 and/or the second drive element 250 may be any mechanism suitable to move (e.g., axially translate) the first support structure 244 and/or the second support structure 246 to approximate the first electrode 212 and the second electrode 214 and exert the clamping force to the workpiece 224.For example, the first drive element 248 and/or the second drive element 250 may be a hydraulic, pneumatic, servo-drive or mechanical drive mechanism (e.g., press).","A width-determining fixture 236 may be positioned between the first electrode 212 and the second electrode 214 to define a welding volume 256 (FIG.","14) around at least a portion of the workpiece 224.The welding volume 256 may have a width W1 (FIG.","14) defined by the width-determining fixture 236.The width-determining fixture 236 may at least partially enclose the workpiece 224 to prevent the flow (e.g., laterally outward flow) of molten or hot metal 272 (FIG.","15) during resistance welding of the workpiece 224.The width-determining fixture 236 may be capable of adjusting an axial position (see longitudinal axis L in FIG.","13) with respect to the first electrode 212 and/or the second electrode 214 to ensure sides of the welding volume 256 (FIG.","14) between the first electrode 212 and the second electrode 214 are completely enclosed regardless of the axial spacing of the electrodes 212, 214 during welding.","The position of the width-determining fixture 236 with respect to the workpiece 224 may define the width W2 of the welded workpiece 258, as shown in FIG.","16.The width-determining fixture may optionally be moved out laterally (sideways) when not welding and moved in when welding, instead of being moved up and down.","Such lateral in-and-out movements may also occur through tapered fitting tooling.","In one expression, the width-determining fixture 236 may be connected to or otherwise operably engaged with the first support structure 244 and/or the first drive mechanism 248 to approximate the second electrode 214 in response to the welding force F1 (FIG.","14).","In another expression, the width-determining fixture 236 may be connected to or otherwise operably engaged with the second support structure 246 and/or the second drive mechanism 250 to approximate the first electrode 212 in response to the welding force F2 (FIG.","14).","The workpiece 224 may include one or more members 238, 240 intended to be joined by resistive welding.","While two members 238, 240 of the workpiece 224 are shown in FIGS.","13 and 14, those skilled in the art will appreciate that additional members, such as an auxiliary member 284 (FIG.","17), may be included in the workpiece 224 without departing from the scope of the present disclosure.","The members 238, 240 of the workpiece 224 may be formed from any material capable of being joined by resistive heating.","As one general example, the members 238, 240 of the workpiece 224 may be formed from any metals or metal alloys capable of being joined by resistive heating.","As one specific example, members 238, 240 of the workpiece 224 may be formed from aluminum or aluminum alloys.","The member (e.g., a first member) 238 may include at least two strands 242.Each strand 242 may be formed from metal or metal alloy (e.g., aluminum or aluminum alloy).","For example, the member 238 may be formed from a plurality of elongated strands 242 bundled together and having a generally circular cross-sectional shape.","As a general, non-limiting example, the member 238 may be a metal wire, cable or rope.","As a specific, non-limiting example, the member 238 may be a 25 mm2, 40 mm2 or 50 mm2 stranded wire cable.","The member 240 (e.g., a second member) may be a terminal to which the member 238 (e.g., a stranded cable or wire) is joined by welding.","For example, the member 240 may be a connector terminal suitable for connection (e.g., mechanical and/or electrical connection) to another object (e.g., an aircraft frame, a vehicle frame or an electrical junction).","The first engagement surface 218 of the first electrode 212 may be formed into an arcuate (e.g., curved) surface defining a concave recess 220 (FIG.","13) configured to make flush contact with at least a portion of the exterior surface 226 of the member 238.For example, the first engagement surface 218 may be machined as a generally semicircular shape or an inverted U shape defining a generally semicircular recess 220 configured to make flush contact with at least a portion of the exterior surface 226 (e.g., a semi-circular portion of the circumferential exterior surface) of the member 238 (e.g., a stranded cable or wire).","However, various contours, including flat/planar, are contemplated for the first engagement surface 218.Referring to FIGS.","14 and 15, the width-determining fixture 236 may be positioned adjacent to the first electrode 212.In one construction, the width-determining fixture 236 may include a first (e.g., left) side stop 252 and a second (e.g., right) side stop 254 laterally opposed from the first side stop 252.The first side stop 252 may be positioned adjacent to (e.g., to the left of) the first electrode 212 and the second side stop 254 may be positioned adjacent to (e.g., to the right of) the first electrode 212 such that the first side stop 252 and the second side stop 254 are positioned to the sides (e.g., the left side and the right side) of the member 238 when the clamping force is exerted to the workpiece 224.The first side stop 252 and the second side stop 254 may be formed from a material having an electrical resistance greater than that of the first electrode 212 and the second electrode 214.For example, the first side stop 252 and the second side stop 54 may be formed from a high resistance metal.","As another example, the first side stop 252 and the second side stop 254 may be formed from an electrically insulating or non-conductive material, such as ceramic.","In general, the material of the first side stop 252 and the second side stop 254 may be selected to ensure the electrical current is directed through the workpiece 224.The first side stop 252 may be housed within a first sleeve 264 and the second side stop 254 may be housed within a second sleeve 266.The first sleeve 264 and the second sleeve 266 may be connected to the first support structure 244 such that the first side stop 252 and the second side stop 254 define the welding volume 256 around (e.g., to the sides of) the member 238 as the first electrode 212 approximates the second electrode 214 in response to the welding force F1.When the first electrode 212 approaches the second electrode 214 and exerts the clamping force to the member 238 therebetween, the first side stop 252 and the second side stop 254 may engage the member 240 (e.g., connector terminal) adjacent to the member 238 (e.g., stranded cable).","As such, the welding volume 256 may be defined by the first engagement surface 218 of the first electrode 212, an interior surface 268 of the first side stop 252, an interior surface 270 of the second side stop 254 and a portion of the exterior surface 234 (e.g., a top surface) of the member 240 positioned between the first side stop 252 and the second side stop 254.The position of the first side stop 252 and the second side stop 254 with respect to the first sleeve 264 and the second sleeve 266, respectively, may automatically adjust an axial position (see longitudinal axis L in FIG.","13) to constantly engage the exterior surface 234 of the member 240 and contain the flow of molten metal 272 (FIG.","15) within the welding volume 256.The first side stop 252 may be outwardly biased from within the first sleeve 264 and the second side stop 254 may be outwardly biased from within the second sleeve 266.For example, the first side stop 252 may be connected within the first sleeve 264 by a first biasing element 274 (e.g., a spring) and the second side stop 254 may be connected within the second sleeve 266 by a second biasing element 276 (e.g., a spring).","A bottom surface 284 (FIG.","13) of the first side stop 252 and the second side stop 254 may be substantially planar to make flush contact with the substantially planar exterior surface 234 of the member 240.As the first support structure 244 approximates the second support structure 246 (e.g., via the first drive element 248), the first electrode 212 may move toward and exert a welding force F1 (e.g., clamping force) upon the member 238 and the first side stop 252 and the second side stop 254 may simultaneously move toward and engage the member 240.As the first support structure 248 further approximates the second support structure 246, the welding force F1 exerted to the member 238 by the first electrode 212 and the second electrode 214 may increase as the first electrode 212 approximates the second electrode 214; however, the first side stop 252 and the second side stop 254 may be at least partially pushed into the first sleeve 264 and the second sleeve 266, respectively, to prevent damage to the member 240 while maintaining flush contact with the member 240 and containing the outward flow of the molten metal 272 (FIG.","15).","The second engagement surface 222 of the second electrode 214 may be a substantially planar surface configured to make substantially flush contact with at least a portion of the exterior surface 234 of the member 240.For example, the second engagement surface 222 may be machined as a substantially flat shape configured to make substantially flush contact with a substantially planar portion of the exterior surface 234 (e.g., a portion of a bottom surface) of the member 240 (e.g., a connector terminal).","However, various contours, including curved, are contemplated for the second engagement surface 222.The second engagement surface 222 of the second electrode 214 may define a first recess 290 and a second recess 292.The first portion 206 of the electrically nonconductive material 202 may be inserted into the first recess 290 and the second portion 208 of the electrically nonconductive material 202 may be inserted into the second recess 292.Therefore, the sizes and shapes of the first and second portions 206, 208 may closely correspond to the sizes and shapes of the recesses 290, 292.Optionally, mechanical fasteners 294, such as screws, pins and the like, may secure the first and second portions 206, 208 of the electrically nonconductive material 202 in the recesses 290, 292 of the second electrode 214.Other techniques for securing portions 206, 208 within corresponding recesses 290, 292, such as press fitting and adhering, are also contemplated.","The cross-sectional thicknesses of the first and second portions 206, 208 of the electrically nonconductive material 202 may closely correspond to the depth of the recesses 290, 292 such that the engagement surfaces 296, 298 of the first and second portions 206, 208 are substantially co-planar with the engagement surface 222 of the second electrode 214.Therefore, the exterior surface 234 (e.g., bottom surface) of the member 240 may make substantially flush contact with both the engagement surface 222 of the second electrode 214 and the engagement surfaces 296, 298 of the first and second portions 206, 208.The first and second portions 206, 208 of the electrically nonconductive material 202 may be positioned relative to the second electrode 214 such that only a central portion 299 of the second electrode 214 is in electrical contact with the workpiece 224.For example, each of the first and second portions 206, 208 of the electrically nonconductive material 202 may include an inner edge 302 and an outer edge 304.The inner edge 302 of each portion 206, 208 of electrically nonconductive material 202 may be substantially vertically aligned with, or laterally inward of, the interior surfaces 268, 270 of the first and second side stops 252, 254 of the width-determining fixture 236.The outer edge 304 of each portion 206, 208 of electrically nonconductive material 202 may extend laterally outside of member 240 of the workpiece 224.Thus, portions of the workpiece 224 (e.g., member 240) that are laterally outside of the width W1 (FIG.","14) of the welding volume 256 (FIG.","14) may be electrically insulated from the underlying second electrode 214 by the first and second portions 206, 208 of the electrically nonconductive material 202, thereby focusing the welding current into the welding volume 256 rather than dissipating the welding current laterally outward.","Furthermore, if the side stops 252, 254 of the width-determining fixture 236 were electrically conductive and were to extend vertically downward toward the engagement surface 222 of the second electrode (e.g., if there were no member 240 therebetween), the side stops 252, 254 would contact the first and second portions 206, 208 of the electrically nonconductive material 202 and would be electrically insulated from the second electrode 214, thereby inhibiting (if not eliminating) the formation of a shunt path through the side stops 252, 254.Referring to FIG.","16, the welded workpiece 258 may have a shape substantially matching the shape of the welding volume 256 (FIG.","14).","For example, the welded workpiece 258 may include a curved upper end 278 substantially matching the curved first engagement surface 218 of the first electrode 212, a planar first (e.g., left) side 280 substantially matching the planar first interior surface 268 of the first side stop 252 and a planar second (e.g., right) side 282 substantially matching the planar second interior surface 270 of the second side stop 254.The welded workpiece 258 may include a solidified portion of the plurality of strands 242 of the member 238 (e.g., a stranded cable) joined to the member 240 (e.g., a connector terminal) through resistive welding.","Referring to FIG.","17, the workpiece 224 may also include an auxiliary member 284.The auxiliary member 284 may have a size and shape sufficient to at least partially surround member 238.The auxiliary member 284 may be formed from a material having the same or similar chemistry as the members 238, 240, or from a material that is compatible with the material from which the members 238, 240 are formed.","For example, when the members 238, 240 are formed from aluminum alloys, the auxiliary member 284 may be formed from an aluminum alloy or appropriate aluminum alloy filler metal.","As illustrated in FIG.","17, in one implementation, the auxiliary member 284 may be a generally semi-circular band 286 having an arcuate (e.g.","curved) body (e.g., U-shaped) of sufficient size and shape to at least partially surround (e.g., cover) the exterior surface 226 of the member 238 (e.g., a stranded cable) and ends that extend to engage the exterior surface 234 of the member 240 (e.g., a connector terminal).","In other implementations, the auxiliary member 284 may have other shapes, such as circular (see FIG.","7).","Referring to FIG.","18, a sixth embodiment of the disclosed welding assembly, generally designated 400, may be configured in the same or similar manner as the welding assemblies 200 shown in FIGS.","12-17.However, rather than inserting the electrically nonconductive material 402 into recesses (see recesses 290, 292 in FIG.","14) in the second electrode 414, the electrically nonconductive material 402 may be positioned adjacent to, and laterally outside of, the second electrode 414.Therefore, the electrically nonconductive material 402 may define an engagement surface 496 (or engagement surfaces 496, 498) that supports a portion of the workpiece 424 (e.g., member 438, member 440 and/or an auxiliary member (not shown in FIG.","18)), yet electrically isolates a portion of the workpiece 424 (e.g., the portion of the workpiece outside of the width of the welding volume) from the second electrode 414.As one example, the electrically nonconductive material 402 of the welding assembly 400 may include two wing portions 406, 408 secured to laterally opposed sides 449, 451 of the second electrode 414 with mechanical fasteners 494.As another example, the electrically nonconductive material 402 of the welding assembly 400 may be a sleeve that extends (e.g., circumferentially) around the second electrode 414.Referring to FIG.","19, one embodiment of the disclosed method, generally designated 500, for welding stranded metal and metal alloys (e.g., stranded cables of wires) may begin by positioning a workpiece between a first electrode and a second electrode of a welding assembly, as shown at block 502.An auxiliary member may optionally be included in the workpiece.","As shown at block 504, the first electrode and/or the second electrode may apply a clamping force to the workpiece.","As shown at block 506, a width-determining fixture may be positioned between the first electrode and the second electrode around the workpiece to define a welding volume having a lateral width.","As shown at block 508, a welding current may be passed through the workpiece for a sufficient amount of time to raise the temperature of the workpiece to a welding temperature to liquefy the workpiece.","The welding current may be contained within the lateral width of the welding volume to focus the welding current into the workpiece.","Optionally, a cooling step may be introduced between the various steps of the method 500 or combined with the various steps of the method 500, such as combined with the current passing step 508.For example, the welded workpiece may be cooled by circulating cooling fluid through the fluid channels in the first and second electrodes while one or more of the first and second electrodes are engaged with the welded workpiece.","Although various embodiments of the disclosed welding assembly and method have been shown and described, modifications may occur to those skilled in the art upon reading the specification.","The present application includes such modifications and is limited only by the scope of the claims."]],"string":"[\n [\n \"Welding Assembly and Method\",\n \"A welding assembly including a current generator, a first electrode electrically coupled to the current generator, the first electrode including a first engagement surface, a second electrode electrically coupled to the current generator, the second electrode including a second engagement surface, a width-determining fixture positioned between the first electrode and the second electrode to define a welding volume having a width, and an electrically nonconductive material positioned to electrically insulate at least one of the first electrode and the second electrode from an electrical conductor outside the width.\"\n ],\n [\n \"1.A method for welding comprising: assembling a workpiece comprising a first member and a second member, wherein said first member comprises a plurality of strands; positioning a first electrode proximate said first member; positioning a second electrode proximate said second member; clamping said workpiece between said first electrode and said second electrode; positioning said workpiece within a welding volume of a width-determining fixture, said welding volume having a width, wherein a portion of said second member extends outside of said width; positioning an electrically nonconductive material between said second electrode and said portion of said second member; and passing a welding current between said first electrode and said second electrode.\",\n \"2.The method of claim 1 further comprising providing a current generator, wherein said first electrode and said second electrode are electrically coupled with said current generator.\",\n \"3.The method of claim 1 wherein said assembling said workpiece further comprises positioning an auxiliary member at least partially around said first member.\",\n \"4.The method of claim 1 wherein said workpiece comprises aluminum or aluminum alloy.\",\n \"5.The method of claim 1 wherein said width-determining fixture is electrically isolated from said first electrode.\",\n \"6.The method of claim 1 wherein said electrically nonconductive material comprises a ceramic material.\",\n \"7.The method of claim 1 wherein said positioning said electrically nonconductive material comprises securing said electrically nonconductive material to said second electrode with a mechanical fastener.\",\n \"8.The method of claim 1 wherein said second electrode defines a first recess and a second recess, and wherein said positioning said electrically nonconductive material comprises positioning a first portion of said electrically nonconductive material in said first recess and a second portion of said electrically nonconductive material in said second recess.\",\n \"9.The method of claim 8 wherein said width-determining fixture comprises a first side stop laterally opposed from a second side stop.\",\n \"10.The method of claim 9 wherein said first side stop is axially aligned with said first recess and said second side stop is axially aligned with said second recess.\",\n \"11.The method of claim 9 wherein said first side stop includes a first interior surface and said second side stop includes a second interior surface, wherein said first portion includes a first inner edge and said second portion includes a second inner edge, wherein said first inner edge is axially aligned with, or laterally inward of, said first interior surface, and wherein said second inner edge is axially aligned with, or laterally inward of, said second interior surface.\",\n \"12.The method of claim 8 wherein said first portion has a first portion engagement surface and said second portion has a second portion engagement surface, and wherein said first portion engagement surface and said second portion engagement surface are coplanar with an engagement surface of said second electrode.\",\n \"13.The method of claim 1 wherein an axial position of said width-determining fixture is adjustable.\",\n \"14.A method for welding comprising: assembling a workpiece comprising a first member and a second member, wherein said first member comprises a plurality of strands; positioning a first electrode proximate said first member; positioning a second electrode proximate said second member; positioning said workpiece within a welding volume defined by said first electrode, said second electrode, a first side stop and a second side stop, said welding volume having a width between said first side stop and said second side stop, wherein a portion of said second member extends outside of said width; clamping said workpiece between said first electrode and said second electrode; positioning an electrically nonconductive material between said second electrode and said portion of said second member; and passing a welding current between said first electrode and said second electrode.\",\n \"15.The method of claim 14 wherein said first side stop and said second side stop are configured to contain hot or molten metal within said width without inhibiting clamping movement of said first electrode relative to said second electrode.\",\n \"16.The method of claim 14 wherein said assembling said workpiece further comprises positioning an auxiliary member at least partially around said first member.\",\n \"17.The method of claim 14 wherein said workpiece comprises aluminum or aluminum alloy.\",\n \"18.The method of claim 14 wherein said width-determining fixture is electrically isolated from said first electrode.\",\n \"19.The method of claim 14 wherein said electrically nonconductive material comprises a ceramic material.\",\n \"20.The method of claim 14 wherein said positioning said electrically nonconductive material comprises securing said electrically nonconductive material to said second electrode with a mechanical fastener.\"\n ],\n [\n \" BACKGROUND Stranded metals and metal alloys (e.g., stranded cables and wires) find a wide variety of applications.\",\n \"Particularly, stranded aluminum and aluminum alloys find a wide variety of applications due to their favorable combination of electrical conductivity properties and mechanical properties, including strength-to-weight ratio, low temperature (cryogenic) properties, corrosion resistance and notch toughness.\",\n \"The challenge with stranded aluminum and aluminum alloys is joining (by welding) the stranded cables or wires to one another and/or to a connector.\",\n \"During a welding operation (e.g., resistive welding), individual strands of the cable or wire may not consistently liquefy to form a solid welded workpiece.\",\n \"For example, strands located proximate the periphery of the cable or wire may liquefy; while strands located proximate the center of the cable or wire may not liquefy sufficiently to form a suitably solid weld.\",\n \"In order to sufficiently liquefy strands proximate the center of the cable or wire, the strands located proximate the periphery of the cable or wire may tend to burn and the whole welded assembly may tend to stick to the weld electrodes.\",\n \"Accordingly, those skilled in the art continue with research and development efforts in the field of welding stranded metals and metal alloys.\"\n ],\n [\n \" SUMMARY In one embodiment, the disclosed welding assembly may include a current generator, a first electrode electrically coupled to the current generator, the first electrode including a first engagement surface, a second electrode electrically coupled to the current generator, the second electrode including a second engagement surface, a width-determining fixture positioned between the first electrode and the second electrode to define a welding volume having a width, and an electrically nonconductive material positioned to electrically insulate at least one of the first electrode and the second electrode from an electrical conductor outside the width.\",\n \"In another embodiment, the disclosed welding assembly may include a current generator, a first electrode electrically coupled to the current generator, the first electrode including a first engagement surface, a second electrode electrically coupled to the current generator, the second electrode including a second engagement surface, a width-determining fixture including a first side stop laterally opposed from a second side stop, the first and second side stops defining a welding volume between the first and second electrodes, the welding volume having a width, a workpiece at least partially positioned in the welding volume and clamped between the first and second electrodes, the workpiece including at least a first member and a second member, wherein the second member is supported on the second electrode, and wherein a portion of the second member protrudes outside of the width, and an electrically nonconductive material positioned to electrically insulate the second electrode from the portion of the second member that protrudes outside of the width.\",\n \"In another embodiment, also disclosed is a method for welding.\",\n \"The method may include the steps of (1) providing a current generator; (2) assembling a workpiece including a first member and a second member, wherein the second member includes strands; (3) positioning a first electrode proximate (at or near) the first member, the first electrode being electrically coupled to the current generator; (4) positioning a second electrode proximate (at or near) the second member, the second electrode being electrically coupled to the current generator; (5) clamping the workpiece between the first electrode and the second electrode; (6) confining the clamped workpiece within a welding volume of a width-determining fixture, the welding volume having a width, wherein a portion of the second member extends outside of the width; (7) electrically isolating the second electrode from the portion of the second member outside of the width; and (8) passing a welding current between the electrodes.\",\n \"Other embodiments of the disclosed welding assembly and method will become apparent from the following detailed description, the accompanying drawings and the appended claims.\"\n ],\n [\n \"PRIORITY This application is a divisional of U.S. Ser.\",\n \"No.\",\n \"14/225,641 filed on Mar.\",\n \"26, 2014, which is a continuation-in-part of U.S. Ser.\",\n \"No.\",\n \"14/140,362 filed on Dec. 24, 2013.The entire contents of U.S. Ser.\",\n \"Nos.\",\n \"14/225,641 and 14/140,362 are incorporated herein by reference.\",\n \"FIELD The present disclosure is generally related to welding apparatus, systems and methods and, more particularly, to resistance welding assemblies for welding metal and metal alloy stranded cables or wires.\",\n \"BACKGROUND Stranded metals and metal alloys (e.g., stranded cables and wires) find a wide variety of applications.\",\n \"Particularly, stranded aluminum and aluminum alloys find a wide variety of applications due to their favorable combination of electrical conductivity properties and mechanical properties, including strength-to-weight ratio, low temperature (cryogenic) properties, corrosion resistance and notch toughness.\",\n \"The challenge with stranded aluminum and aluminum alloys is joining (by welding) the stranded cables or wires to one another and/or to a connector.\",\n \"During a welding operation (e.g., resistive welding), individual strands of the cable or wire may not consistently liquefy to form a solid welded workpiece.\",\n \"For example, strands located proximate the periphery of the cable or wire may liquefy; while strands located proximate the center of the cable or wire may not liquefy sufficiently to form a suitably solid weld.\",\n \"In order to sufficiently liquefy strands proximate the center of the cable or wire, the strands located proximate the periphery of the cable or wire may tend to burn and the whole welded assembly may tend to stick to the weld electrodes.\",\n \"Accordingly, those skilled in the art continue with research and development efforts in the field of welding stranded metals and metal alloys.\",\n \"SUMMARY In one embodiment, the disclosed welding assembly may include a current generator, a first electrode electrically coupled to the current generator, the first electrode including a first engagement surface, a second electrode electrically coupled to the current generator, the second electrode including a second engagement surface, a width-determining fixture positioned between the first electrode and the second electrode to define a welding volume having a width, and an electrically nonconductive material positioned to electrically insulate at least one of the first electrode and the second electrode from an electrical conductor outside the width.\",\n \"In another embodiment, the disclosed welding assembly may include a current generator, a first electrode electrically coupled to the current generator, the first electrode including a first engagement surface, a second electrode electrically coupled to the current generator, the second electrode including a second engagement surface, a width-determining fixture including a first side stop laterally opposed from a second side stop, the first and second side stops defining a welding volume between the first and second electrodes, the welding volume having a width, a workpiece at least partially positioned in the welding volume and clamped between the first and second electrodes, the workpiece including at least a first member and a second member, wherein the second member is supported on the second electrode, and wherein a portion of the second member protrudes outside of the width, and an electrically nonconductive material positioned to electrically insulate the second electrode from the portion of the second member that protrudes outside of the width.\",\n \"In another embodiment, also disclosed is a method for welding.\",\n \"The method may include the steps of (1) providing a current generator; (2) assembling a workpiece including a first member and a second member, wherein the second member includes strands; (3) positioning a first electrode proximate (at or near) the first member, the first electrode being electrically coupled to the current generator; (4) positioning a second electrode proximate (at or near) the second member, the second electrode being electrically coupled to the current generator; (5) clamping the workpiece between the first electrode and the second electrode; (6) confining the clamped workpiece within a welding volume of a width-determining fixture, the welding volume having a width, wherein a portion of the second member extends outside of the width; (7) electrically isolating the second electrode from the portion of the second member outside of the width; and (8) passing a welding current between the electrodes.\",\n \"Other embodiments of the disclosed welding assembly and method will become apparent from the following detailed description, the accompanying drawings and the appended claims.\",\n \"BRIEF DESCRIPTION OF THE DRAWINGS FIG.\",\n \"1 is a schematic illustration of a first embodiment of the disclosed welding assembly; FIG.\",\n \"2 is a side elevational view of a second embodiment of the disclosed welding assembly; FIGS.\",\n \"3, 4 and 5 are side elevational views, in section, of a workpiece being welded by the welding assembly of FIG.\",\n \"2 in accordance with one implementation of the second embodiment; FIG.\",\n \"6 is a side elevational view, in section, of a workpiece being welded by the welding assembly of FIG.\",\n \"2 in accordance with another implementation of the second embodiment; FIG.\",\n \"7 is a side elevational view, in section, of a workpiece being welded by the welding assembly of FIG.\",\n \"2 in accordance with yet another implementation of the second embodiment; FIGS.\",\n \"8, 9 and 10 are side elevational views, in section, of a third embodiment of the disclosed welding assembly, shown welding a workpiece; FIG.\",\n \"11 is a side elevational view, in section, of a workpiece being welded by the welding assembly of FIG.\",\n \"8 in accordance with another implementation of the third embodiment; FIG.\",\n \"12 is a schematic illustration of a fourth embodiment of the disclosed welding assembly; FIG.\",\n \"13 is a side elevational view of a fifth embodiment of the disclosed welding assembly; FIGS.\",\n \"14, 15 and 16 are side elevational views, in section, of a workpiece being welded by the welding assembly of FIG.\",\n \"13 in accordance with one implementation of the fifth embodiment; FIG.\",\n \"17 is a side elevational view, in section, of a workpiece being welded by the welding assembly of FIG.\",\n \"13 in accordance with another implementation of the fifth embodiment; FIG.\",\n \"18 is a side elevational view, in section, of a sixth embodiment of the disclosed welding assembly; and FIG.\",\n \"19 is one embodiment of the disclosed method for welding metal and metal alloy stranded cable.\",\n \"DETAILED DESCRIPTION The following detailed description refers to the accompanying drawings, which illustrate specific embodiments of the disclosure.\",\n \"Other embodiments having different structures and operations do not depart from the scope of the present disclosure.\",\n \"Like reference numerals may refer to the same element or component in the different drawings.\",\n \"Referring to FIGS.\",\n \"1, a first embodiment of the disclosed welding assembly, generally designated 10, may include a first (e.g., upper) electrode 12, a second (e.g., lower) electrode 14 and a current generator 16.The first electrode 12 and the second electrode 14 may be located at axially opposite positions relative to the longitudinal axis A of the welding assembly 10.The first electrode 12 may be electrically coupled to the current generator 16 and may include and a first engagement surface 18.The second electrode 14 may be electrically coupled to the current generator 16 and may include a second engagement surface 22.The first engagement surface 18 and the second engagement surface 22 may include size and shape suitable to engage (e.g., contact) at least a portion of an exterior surface of a workpiece 24 (FIG.\",\n \"2).\",\n \"For example, the first engagement surface 18 of the first electrode 12 and the second engagement surface 22 of the second electrode 14 may be configured to solidify a plurality of metal or metal alloy strands (e.g., a metal or metal alloy stranded cable or wire) and weld the solidified strands to a metal or metal alloy connector terminal.\",\n \"The current generator 16 may be any source of electrical energy capable of supplying an electric current to the first electrode 12 and the second electrode 14 to achieve resistive heating in the workpiece 24 (FIG.\",\n \"2).\",\n \"The current generator 16 may include appropriate circuitry for supplying electric current to the first electrode 12 and the second electrode 14, as well as controlling the magnitude and timing of the electric current being supplied to the first electrode 12 and the second electrode 14.For example, the current generator 16 may be a direct current system, an alternating current system or a stored energy current system.\",\n \"In an example construction, the current generator 16 may include a first terminal 112 and a second terminal 114, the second terminal 114 having a polarity opposite of a polarity of the first terminal 112.The first electrode 12 may be electrically coupled to the first terminal 112.The second electrode 14 may be electrically coupled to the second terminal 114.At this point, those skilled in the art will appreciate that the current generator 16 may be a commercially available resistance welding machine or a component taken from a commercially available resistance welding machine.\",\n \"The first electrode 12 and the second electrode 14 may be formed from any electrically conductive material.\",\n \"The first electrode 12 and the second electrode 14 may be formed from a material having a thermal conductivity (e.g., either relatively high thermal conductivity or relatively low thermal conductivity) selected based upon the type weld desired, the material (e.g., aluminum or aluminum alloy) of the workpiece 24, and/or the method for welding being performed by the first electrode 12 and the second electrode 14.For example, the first electrode 12 and/or the second electrodes 14 may be formed from copper or copper alloys (e.g., Resistance Welder Manufacturers Association (“RWMA”) copper alloys Classes 1-5 or 20) when relatively high thermal conductivity is desired.\",\n \"Alternatively, the first electrode 12 and/or the second electrodes 14 may be formed from refractory materials, tungsten, tungsten/copper alloys or molybdenum (e.g., RWMA Classes 10-14) when relatively low thermal conductivity is desired.\",\n \"In general, a more conducting electrode material may be used when a steeper thermal gradient is desired between the first electrode 12 and the second electrode 14 and a less conducting electrode material may be used when a less steep temperature gradient is desired between the first electrode 12 and the second electrode 14.The first electrode 12 and/or the second electrode 14 may be cooled.\",\n \"For example, the first electrode 12 may include one or more first fluid channels 30 defined therein or connected thereto.\",\n \"The second electrode 14 may include one or more second fluid channels 32 defined therein or connected thereto.\",\n \"A cooling fluid (e.g., water or ethyl glycol) may flow through the first fluid channels 30 and/or the second fluid channels 32 to remove heat from the first electrode 12 and the second electrode 14, as well as from the workpiece 24 (FIG.\",\n \"2) supported by (e.g., positioned between) the first electrode 12 and the second electrode 14.Referring to FIGS.\",\n \"2 and 3, in a second embodiment, the first electrode 12 may be mounted to a first support structure 44 and the second electrode 14 may be mounted to a second support structure 46.For example, the first support structure 44 and/or the second support structure 46 may be an arm or a tong.\",\n \"The first support structure 44 and the second support structure 46 may be capable of approximating the first electrode 12 and a second electrode 14 to clamp the workpiece 24 between the first electrode 12 and a second electrode 14.In an example implementation, the first electrode 12 and the second electrode 14 may exert a clamping force (e.g., a welding force) to the workpiece 24 positioned there between.\",\n \"For example, the first electrode 12 and the second electrode 14 may exert a clamping force of approximately between 50 pounds and 100 pounds.\",\n \"In one example, the first support structure 44 may be moveable such that the first electrode 12 exerts a welding force F1 to the workpiece 24 and the second support structure 44 may be movable such that the second electrode 14 exerts an opposing welding force F2 to the workpiece 24, as illustrated in FIG.\",\n \"3.As another example, the first support structure 44 may be a movable such that the first electrode 12 exerts a welding force F1 to the workpiece 24 and the second support structure 46 may be stationary (e.g., an anvil).\",\n \"In an example construction, the first support structure 44 may be connected to a first drive element 48 and/or the second support structure 46 may be connected to a second drive element 50.The first drive element 48 and/or the second drive element 50 may be any mechanism suitable to move (e.g., axially translate) the first support structure 44 and/or the second support structure 44 to approximate the first electrode 12 and the second electrode 14 and exert the clamping force to the workpiece 24.For example, the first drive element 48 and/or the second drive element 50 may be a hydraulic, pneumatic, servo-drive or mechanical drive mechanism (e.g., press).\",\n \"A width-determining fixture 36 may be positioned between the first electrode 12 and the second electrode 14 to define a welding volume 56 around at least a portion of the workpiece 24.The width-determining fixture 36 may at least partially enclose the workpiece 24 to prevent the flow (e.g., outward flow) of molten or hot metal 72 (FIG.\",\n \"4) during resistance welding of the workpiece 24.The width-determining fixture 36 may be capable of adjusting an axial position (e.g., parallel to the direction of the clamping force) with respect to the first electrode 12 and/or the second electrode 14 to ensure sides of the welding volume 56 between the first electrode 12 and the second electrode 14 are completely enclosed.\",\n \"The position of the width-determining fixture 36 with respect to the workpiece 24 may define the width W of the welded workpiece 58 (FIG.\",\n \"5).\",\n \"The side stops (width-determining fixtures) may also be moved out sideways when not welding and moved in when welding, instead of being moved up and down.\",\n \"Such in-and-out movements may also occur through tapered fitting tooling.\",\n \"In one expression, the width-determining fixture 36 may be connected to or otherwise operably engaged with the first support structure 44 and/or the first drive mechanism 48 to approximate the second electrode 14 in response to the welding force F1 (FIG.\",\n \"3).\",\n \"In another expression, the width-determining fixture 36 may be connected to or otherwise operably engaged with the second support structure 46 and/or the second drive mechanism 50 to approximate the first electrode 12 in response to the welding force F2 (FIG.\",\n \"3), such as illustrated in FIG.\",\n \"8.Referring still to FIGS.\",\n \"2 and 3, the workpiece 24 may include one or more members 38, 40 intended to be joined by resistive welding.\",\n \"While two members 38, 40 of the workpiece 24 are shown in FIGS.\",\n \"2 and 3, those skilled in the art will appreciate that additional members may be included in the workpiece 24 without departing from the scope of the present disclosure.\",\n \"The members 38, 40 of the workpiece 24 may be formed from any material capable of being joined by resistive heating.\",\n \"In one realization, the members 38, 40 of the workpiece 24 may be formed from any metals or metal alloys capable of being joined by resistive heating.\",\n \"For example, members 38, 40 of the workpiece 24 may be formed from aluminum or aluminum alloys.\",\n \"The member (e.g., a first member) 38 may include at least two strands 42.Each strand 42 may be formed from metal or metal alloy (e.g., aluminum or aluminum alloy).\",\n \"For example, the member 38 may be formed from a plurality of elongated strands 42 bundled together and having a generally circular cross-sectional shape.\",\n \"As a general, non-limiting example, the member 38 may be a metal wire, cable or rope.\",\n \"As a specific, non-limiting example, the member 38 may be a 25 mm2, 40 mm2 or 50 mm2 stranded wire cable.\",\n \"The member 40 (e.g., a second member) may be a terminal to which the member 38 (e.g., a stranded cable or wire) is joined by welding.\",\n \"For example, the member 40 may be a connector terminal suitable for connection (e.g., mechanical and/or electrical connection) to another object (e.g., an aircraft frame, a vehicle frame or an electrical junction).\",\n \"The first engagement surface 18 of the first electrode 12 may be formed into an arcuate (e.g., curved) surface defining a concave recess 20 configured to make flush contact with at least a portion of the exterior surface 26 of the member 38.For example, the first engagement surface 18 may be machined as a generally semicircular shape or an inverted U shape defining a generally semicircular recess 20 configured to make flush contact with at least a portion of the exterior surface 26 (e.g., a semi-circular portion of the circumferential exterior surface) of the member 38 (e.g., a stranded cable or wire).\",\n \"The second engagement surface 22 may be formed into a substantially planar surface configured to make flush contact with at least a portion of the exterior surface 34 of the member 40.For example, the second engagement surface 22 may be machined as a substantially flat shape configured to make flush contact with a substantially planar portion of the exterior surface 34 (e.g., a portion of a bottom surface) of the member 40 (e.g., a connector terminal).\",\n \"Referring to FIG.\",\n \"4, the curved first engagement surface 18 of the first electrode 12 may create a larger contact surface area for electrical current to pass from the first electrode 12 to the member 38 (e.g., to the plurality of strands 42) as compared to a planar engagement surface.\",\n \"This larger surface area may decrease the current density at a surface of the workpiece 24 (e.g., between the curved contact surfaces 18 and 26 of the first electrode 12 and the member 38) and increase the current density proximate a center of the workpiece 24.For example, the curved first engagement surface 18 may direct (e.g., focus) the current from the first electrode 12 toward the center of the member 38, as illustrated by directional arrows 60.The current density at an opposing surface of the workpiece 24 (e.g., between planar contact surfaces 22 and 34 of the second electrode 14 and the member 40) may be higher or lower.\",\n \"For example, the planar second engagement surface 20 may direct the current from the second electrode 14 through the member 40 and through the member 38, as illustrated by directional arrows 62.Thus, when a voltage is applied between the first electrode 12 and the second electrode 14 (e.g., from the current generator 16), a current flows between the first engagement surface 18 and the second engagement surface 22 through the core of the workpiece 24 along the path indicated by arrows 60 and 62.By decreasing the current density at the exterior surface 26 of the member 38 (e.g., at the exterior surfaces of the strands 42) and increasing the current density toward the center of the member 38, the heat generated proximate (e.g., at or near) the center of the member 38 may become greater than the heat generated at any location on the exterior surface 26 of the member 38 tending to more consistently melt the plurality of strands 42 throughout the member 38.Those skilled in the art will appreciate that the first engagement surface 18 and the recess 20 may be provided in various sizes (e.g., length and width), shapes (e.g., curve radius) and configurations, for example, depending upon the diameter of the member 38, the number of strands 42 and the length of the member 38 (e.g., length of a portion of the plurality of strands 42) that is to be welded (e.g., solidified).\",\n \"Referring to FIGS.\",\n \"3 and 4, the width-determining fixture 36 may be positioned adjacent to the first electrode 12.In one construction, the width-determining fixture 36 may include a first (e.g., left) side stop 52 and a second (e.g., right) side stop 54.The first side stop 52 may be positioned adjacent to (e.g., to the left of) the first electrode 12 and the second side stop 54 may be positioned adjacent to (e.g., to the right of) the first electrode 12 such that the first side stop 52 and the second side stop 54 are positioned to the sides (e.g., the left side and the right side) of the member 38 when the clamping force is exerted to the workpiece 24.The first side stop 52 and the second side stop 54 may formed from a material having an electrical resistance greater than that of the first electrode 12 and the second electrode 14.For example, the first side stop 52 and the second side stop 54 may be formed from a high resistance metal.\",\n \"As another example, the first side stop 52 and the second side stop 54 may be formed from an electrically insulating or non-conductive material, such as ceramic.\",\n \"In general, the material of the first side stop 52 and the second side stop 54 may be selected to ensure the electrical current is directed through the workpiece 24, such as indicated by directional arrows 60 and 62 (FIG.\",\n \"4).\",\n \"In an example embodiment, the first side stop 52 may be housed within a first sleeve 64 and the second side stop 54 may be housed within a second sleeve 66.The first sleeve 64 and the second sleeve 66 may be connected to the first support structure 44 such that the first side stop 52 and the second side stop 54 define the welding volume 56 around (e.g., to the sides of) the member 38 as the first electrode 12 approximates the second electrode 14 in response to the welding force F1 (FIG.\",\n \"3).\",\n \"When the first electrode 12 approaches the second electrode 14 and exerts the clamping force to the member 38 therebetween, the first side stop 52 and the second side stop 54 may engage the member 40 (e.g., connector terminal) adjacent to the member 38 (e.g., stranded cable).\",\n \"As such, the welding volume 56 may be defined by the first engagement surface 22 of the first electrode 12, an interior surface 68 of the first side stop 52, an interior surface 70 of the second side stop 54 and a portion of the exterior surface 34 (e.g., a top surface) of the member 40 positioned between the first side stop 52 and the second side stop 54.The position of the first side stop 52 and the second side stop 54 with respect to the first sleeve 64 and the second sleeve 66, respectively, may automatically adjust an axial position (e.g., parallel to the direction of the welding force F1) to constantly engage the exterior surface 34 of the member 40 and contain the flow of molten metal 72 within the welding volume 56, as illustrated in FIG.\",\n \"4.The first side stop 52 may be outwardly biased from within the first sleeve 64 and the second side stop 54 may be outwardly biased from within the second sleeve 66.For example, the first side stop 52 may be connected within the first sleeve 64 by a first biasing element 74 (e.g., a spring) and the second side stop 54 may be connected within the second sleeve 66 by a second biasing element 76 (e.g., a spring).\",\n \"A bottom surface 84 (FIG.\",\n \"2) of the first side stop 52 and the second side stop 54 may be substantially planar to make flush contact with the substantially planar exterior surface 34 of the member 40.As the first support structure 48 approximates the second support structure 46 (e.g., via the first drive element 48), the first electrode 12 may move toward and exert a welding force F1 (e.g., clamping force) upon the member 38 and the first side stop 52 and the second side stop 54 may simultaneously move toward and engage the member 40.As the first support structure 48 further approximates the second support structure 46, the welding force F1 exerted to the member 38 by the first electrode 12 and the second electrode 14 may increase as the first electrode 12 approximates the second electrode 14; however, the first side stop 52 and the second side stop 54 may be at least partially pushed into the first sleeve 64 and the second sleeve 66, respectively, to prevent damage to the member 40 while maintaining flush contact with the member 40 and containing the outward flow of the molten metal 72 (FIG.\",\n \"4).\",\n \"Referring to FIG.\",\n \"5, the welded workpiece 58 may have a shape substantially matching the shape of the welding volume 56.For example, welded workpiece 58 may include a curved upper end 78 substantially matching the curved first engagement surface 18 of the first electrode 12, a planar first (e.g., left) side 80 substantially matching the planar first interior surface 68 of the first side stop 52 and a planar second (e.g., right) side 82 substantially matching the planar second interior surface 70 of the second side stop 54.The welded workpiece 58 may include a solidified portion of the plurality of strands 42 of the member 38 (e.g., a stranded cable) joined to the member 40 (e.g., a connector terminal) through resistive welding.\",\n \"Referring to FIGS.\",\n \"6 and 7, the workpiece 24 may also include an auxiliary member 84.The auxiliary member 84 may have a size and shape sufficient to at least partially surround the workpiece 24.The auxiliary member 84 may be formed from a material having the same or similar chemistry as the members 38, 40, or from a material that is compatible with the material from which the members 38, 40 are formed.\",\n \"For example, when the members 38, 40 are formed from aluminum alloys, the auxiliary member 84 may be formed from an aluminum alloy or appropriate aluminum alloy filler metal.\",\n \"As illustrated in FIG.\",\n \"6, in one implementation, the auxiliary member 84 may be a generally semi-circular band 86 having an arcuate (e.g.\",\n \"curved) body (e.g., U-shaped) of sufficient size and shape to at least partially surround (e.g., cover) the exterior surface 26 of the member 38 (e.g., a stranded cable) and ends that extend to engage the exterior surface 34 of the member 40 (e.g., a connector terminal).\",\n \"As illustrated in FIG.\",\n \"7, in another implementation, the auxiliary member 84 may be a generally circular band 88 having a continuous body of sufficient size and shape to completely surround (e.g., cover) the exterior surface 26 of the member 38 (e.g., a stranded cable).\",\n \"The curved first engagement surface 18 of the first electrode 12 may include a sufficient shaped and size to contact at least a portion of an exterior surface 26 the auxiliary member 84 and focus electrical current toward the center of the workpiece 24 (e.g., the member 38) in a similar manner as described above and illustrated in FIG.\",\n \"4.The material of the auxiliary member 84 may melt during resistance welding and combine with the molten metal 72 (FIG.\",\n \"4) within the welding volume 56 to further solidify the plurality of strands 42 of the member 38 into a solid welded workpiece 58, such as illustrated in FIG.\",\n \"5.The first side stop 52 and the second side stop 54 may be positioned adjacent to (e.g., to the sides of) the auxiliary member 84 when the first electrode 12 exerts welding force F1 upon the workpiece 24.Referring to FIG.\",\n \"8, the workpiece 24′ may include a member 38′ intended to be solidified by resistive welding.\",\n \"The member 38′ may include a plurality of strands 42′.\",\n \"Each strand 42′ may be formed from metal or metal alloy (e.g., aluminum or aluminum alloy).\",\n \"For example, the member 38′ may be formed from a plurality of elongated strands 42′ bundled together and having a generally circular cross-sectional shape.\",\n \"As a general, non-limiting example, the member 38′ may be a metal wire, cable or rope.\",\n \"As a specific, non-limiting example, the member 38′ may be a 25 mm2, 40 mm2 or 50 mm2 stranded wire cable.\",\n \"While four strands 42′ of the member 38′ of the workpiece 24 are shown in FIGS.\",\n \"8, 9, 10 and 11, those skilled in the art will appreciate that additional strands 42′ of the member 38′ may be included in the workpiece 24′ without departing from the scope of the present disclosure.\",\n \"In accordance with a third embodiment, the second engagement surface 22′ of the second electrode 14′ may be formed into an arcuate (e.g.\",\n \"curved) surface defining a concave recess 28.For example, the second engagement surface 22′ may be machined as a generally semicircular shape defining a generally semicircular recess 28.The first engagement surface 18 and the second engagement surface 22′ may include size and shape suitable to engage (e.g., contact) at least a portion of an exterior surface 26′ of the workpiece 24′ (e.g., an exterior surface of the plurality of strands 42′ of the member 38′).\",\n \"For example, the first engagement surface 18 of the first electrode 12 and the second engagement surface 22′ of the second electrode 14′ may be configured to solidify the plurality of metal strands 42′ of the member 38′ (e.g., a stranded cable).\",\n \"Referring to FIG.\",\n \"9, the curved first engagement surface 18 of the first electrode 12 and the curved second engagement surface 22′ of the second electrode 14′ may create a larger contact surface area for electrical current to pass from the first electrode 12 and the second electrode 14′ to the member 38′ as compared to a planar engagement surface.\",\n \"This larger surface area may decrease the current density at a surface of the workpiece 24′ (e.g., between the curved contact surfaces 18, 22′ and 26′ of the first electrode 12 and the second electrode 14′ and the member 38′, respectively) and increase the current density at the center of the workpiece 24′.\",\n \"For example, the curved first engagement surface 18 and the curved second engagement surface 22′ may direct (e.g., focus) the current from the first electrode 12 and the second electrode 14′ toward the center of the member 38′, as illustrated by directional arrows 60′ and 62′.\",\n \"The width-determining fixture 36 may be positioned adjacent to the first electrode 12 and the second electrode 14′.\",\n \"In an example embodiment, the width-adjusting fixture 36 may include a first (e.g., left) side stop 52 and an opposing second (e.g., right) side stop 54 adjacent the first electrode 12 and a third (e.g., left) side stop 94 and an opposing fourth (e.g., right) side stop 96 adjacent the second electrode 14′.\",\n \"The first side stop 52, the second side stop 54, the third side stop 94 and the fourth side stop 96 may be positioned to the sides (e.g., the left side and the right side) of the member 38′ to at least partially define the welding volume 56′ around (e.g., to the sides of) the member 38′ as the first electrode 12 approximates the second electrode 14′ in response to the welding force F1 and/or F2.The third side stop 94 may be housed within a third sleeve 98 and the fourth side stop 96 may be housed within a fourth sleeve 102.The third sleeve 98 and the fourth sleeve 100 may be connected to the second support structure 44.When the first electrode 12 approximates the second electrode 14′ and exert a clamping force to the member 38′ therebetween, the first side stop 52 may engage (e.g., contact) the third side stop 98 and the second side stop 54 may engage the fourth side stop 100.As such, the welding volume 56′ may be defined by the first engagement surface 22 of the first electrode 12, the interior surface 68 of the first side stop 52, an interior surface 102 of the third side stop 98, the interior surface 70 of the second side stop 54, the interior surface 104 of the fourth side stop 100 and the second engagement surface 22′ of the second electrode 14′.\",\n \"The position of the first side stop 52 and the third side stop 94 with respect to the first sleeve 64 and the third sleeve 98, respectively, may automatically adjust position an axial position (e.g., parallel to the direction of the welding force F1 and F2) to constantly engage each other and contain the flow of molten metal 72′ within the welding volume 56′, as illustrated in FIG.\",\n \"9.Similarly, the position of the second side stop 54 and the fourth side stop 96 may automatically adjust an axial position with respect to the second sleeve 66 and the fourth sleeve 100, respectively, to constantly engage each other and contain the flow of molten metal 72′ within the welding volume 56′.\",\n \"For example, the third side stop 94 may be outwardly biased from within the third sleeve 98 and the fourth side stop 96 may be outwardly biased from within the fourth sleeve 100.In an example construction, the third side stop 94 may be connected within the third sleeve 98 by a third biasing element 108 (e.g., a spring) and the fourth side stop 96 may be connected within the fourth sleeve 100 by a fourth biasing element 110 (e.g., a spring).\",\n \"Engaging surfaces of the first side stop 52 and the third side stop 94 may be substantially planar to make flush contact with each other and engaging surfaces the second side stop 54 and the fourth side stop 96 may be substantially planar to make flush contact with each other.\",\n \"Referring to FIG.\",\n \"10, the welded workpiece 58′ may have a shape substantially matching the shape of the welding volume 56′.\",\n \"For example, welded workpiece 58′ may include a curved upper end 78′ substantially matching the curved first engagement surface 18 of the first electrode 12, a planar first (e.g., left) side 80′ substantially matching the planar interior surface 68 of the first side stop 52 and the interior surface 102 of the third side stop 94, a planar second (e.g., right) side 82′ substantially matching the planar interior surface 70 of the second side stop 54 and interior surface 104 of the fourth side stop 96 and a curved lower end 106 substantially matching the curved second engagement surface 22′ of the second electrode 14′.\",\n \"For example, the welded workpiece 58′ may include a solidified portion of the plurality of strands 42′ of the member 38′ (e.g., a stranded cable).\",\n \"Referring to FIG.\",\n \"11, in another implementation, the workpiece 24′ may also include an auxiliary member 84′.\",\n \"The auxiliary member 84′ may have a size and shape sufficient to at least partially surround the workpiece 24′.\",\n \"For example, the auxiliary member 84′ may be a generally circular band 88′ having a continuous body of sufficient size and shape to completely surround (e.g., cover) the exterior surface 26′ of the member 38′ (e.g., a stranded cable) For example, the curved first engagement surface 18 of the first electrode 12 may contact at least a portion (e.g., an upper portion) of the exterior surface 26′ of the auxiliary member 84′ and the curved second engagement surface 22′ of the second electrode 14′ may contact at least a portion (e.g., a lower portion) of the exterior surface 26′ of the auxiliary member 84′ to focus electrical current toward the center of the workpiece 24′ in a similar manner as described above and illustrated in FIG.\",\n \"9.Referring to FIG.\",\n \"12, a fourth embodiment of the disclosed welding assembly, generally designated 200, may include a first (e.g., upper) electrode 212, a second (e.g., lower) electrode 214, a current generator 216, a width-determining fixture 236 and an electrically nonconductive material 202.The electrically nonconductive material 202 may be present in the welding assembly 200 as a first portion 206 of electrically nonconductive material 202 and a second portion 208 of electrically nonconductive material 202.With the exception of the presence of electrically nonconductive material 202, the welding assembly 200 may be configured in the same or similar manner as the welding assembly 10 shown in FIG.\",\n \"1.Specifically, the first electrode 212 may include a first engagement surface 218 and optionally one or more cooling channels 230, the second electrode 214 may by axially opposed from the first electrode 212 and may include a second engagement surface 222 and optionally one or more cooling channels 232, the current generator 216 may include first and second terminals 213, 215 electrically coupled to the first and second electrodes 212, 214, and the width-determining fixture 236 may include side stops 252, 254, which may be biased out of associated sleeves 264, 266 toward the second electrode 214.The electrically nonconductive material 202 may be substantially electrically nonconductive, particularly relative to the electrical conductivity of the second electrode 214.Therefore, when the electrically nonconductive material 202 is positioned between an electrical conductor (e.g., the width-determining fixture 236 and/or the workpiece 224 (see FIG.\",\n \"13)) and the second electrode 214, the electrically nonconductive material 202 may function as an electrical insulator therebetween.\",\n \"Thus, when the electrically nonconductive material 202 is properly positioned relative to the second electrode 214, such as vertically below the side stops 252, 254 of the width-determining fixture 236 and sufficiently laterally outside of the side stops 252, 254, shunting of the welding current from the first electrode 212, through the width-determining fixture 236, and to the second electrode 214 (or vice versa) may be substantially inhibited (if not eliminated), thereby focusing the welding current into the workpiece 224 (FIG.\",\n \"13) that is between the electrodes 212, 214 and the width-determining fixture 236.The electrically nonconductive material 202 may have a composition that renders the electrically nonconductive material 202 sufficiently hard and durable to withstand the clamping forces applied during welding.\",\n \"Additionally, the composition of the electrically nonconductive material 202 may render the electrically nonconductive material 202 capable of withstanding welding temperatures without melting, decomposing or otherwise degrading.\",\n \"As one general, non-limiting example, the electrically nonconductive material 202 may be (or may include) a ceramic material.\",\n \"As one specific, non-limiting example, the electrically nonconductive material 202 may be (or may include) titanium nitride.\",\n \"As another specific, non-limiting example, the electrically nonconductive material 202 may be (or may include) a machinable ceramic, such as MACOR® machinable glass ceramic commercially available from Corning Incorporated of Corning, N.Y.\",\n \"The electrically nonconductive material 202 may have a cross-sectional thickness T sufficient to impart the required physical properties.\",\n \"Depending on composition, if the cross-sectional thickness T is too thin, then the electrically nonconductive material 202 may be brittle.\",\n \"For example, when the electrically nonconductive material 202 is a ceramic, a cross-sectional thickness T ranging from about 2 mm to about 10 mm or more may be sufficient for the intended purpose, and may facilitate securing the electrically nonconductive material 202 to the second electrode 214 with a mechanical fastener 294, as shown in FIG.\",\n \"14.Referring to FIGS.\",\n \"13-16, a fifth embodiment of the welding assembly 200 may be configured in the same or similar manner as the welding assembly 10 shown in FIGS.\",\n \"2-5, with the exception of the presence of first and second portions 206,208 of electrically nonconductive material 202.With reference to FIGS.\",\n \"13 and 14, the first electrode 212 may be mounted to a first support structure 244 and the second electrode 214 may be mounted to a second support structure 246.For example, the first support structure 244 and/or the second support structure 246 may be an arm or a tong.\",\n \"The first support structure 244 and the second support structure 246 may be capable of approximating the first electrode 212 and a second electrode 214 along the longitudinal axis L (FIG.\",\n \"13) of the welding assembly 200 to clamp the workpiece 224 between the first electrode 212 and a second electrode 214.The first electrode 212 and the second electrode 214 may exert a clamping force (e.g., a welding force) to the workpiece 224 positioned there between.\",\n \"For example, the first electrode 212 and the second electrode 214 may exert a clamping force of approximately between 50 pounds and 100 pounds.\",\n \"In one construction, the first support structure 244 may be moveable such that the first electrode 212 exerts a welding force F1 to the workpiece 224 and the second support structure 244 may be movable such that the second electrode 214 exerts an opposing welding force F2 to the workpiece 224, as illustrated in FIG.\",\n \"14.In another construction, the first support structure 244 may be a movable such that the first electrode 212 exerts a welding force F1 to the workpiece 224 and the second support structure 246 may be stationary (e.g., an anvil).\",\n \"The first support structure 244 may be connected to a first drive element 248 and/or the second support structure 246 may be connected to a second drive element 250.The first drive element 248 and/or the second drive element 250 may be any mechanism suitable to move (e.g., axially translate) the first support structure 244 and/or the second support structure 246 to approximate the first electrode 212 and the second electrode 214 and exert the clamping force to the workpiece 224.For example, the first drive element 248 and/or the second drive element 250 may be a hydraulic, pneumatic, servo-drive or mechanical drive mechanism (e.g., press).\",\n \"A width-determining fixture 236 may be positioned between the first electrode 212 and the second electrode 214 to define a welding volume 256 (FIG.\",\n \"14) around at least a portion of the workpiece 224.The welding volume 256 may have a width W1 (FIG.\",\n \"14) defined by the width-determining fixture 236.The width-determining fixture 236 may at least partially enclose the workpiece 224 to prevent the flow (e.g., laterally outward flow) of molten or hot metal 272 (FIG.\",\n \"15) during resistance welding of the workpiece 224.The width-determining fixture 236 may be capable of adjusting an axial position (see longitudinal axis L in FIG.\",\n \"13) with respect to the first electrode 212 and/or the second electrode 214 to ensure sides of the welding volume 256 (FIG.\",\n \"14) between the first electrode 212 and the second electrode 214 are completely enclosed regardless of the axial spacing of the electrodes 212, 214 during welding.\",\n \"The position of the width-determining fixture 236 with respect to the workpiece 224 may define the width W2 of the welded workpiece 258, as shown in FIG.\",\n \"16.The width-determining fixture may optionally be moved out laterally (sideways) when not welding and moved in when welding, instead of being moved up and down.\",\n \"Such lateral in-and-out movements may also occur through tapered fitting tooling.\",\n \"In one expression, the width-determining fixture 236 may be connected to or otherwise operably engaged with the first support structure 244 and/or the first drive mechanism 248 to approximate the second electrode 214 in response to the welding force F1 (FIG.\",\n \"14).\",\n \"In another expression, the width-determining fixture 236 may be connected to or otherwise operably engaged with the second support structure 246 and/or the second drive mechanism 250 to approximate the first electrode 212 in response to the welding force F2 (FIG.\",\n \"14).\",\n \"The workpiece 224 may include one or more members 238, 240 intended to be joined by resistive welding.\",\n \"While two members 238, 240 of the workpiece 224 are shown in FIGS.\",\n \"13 and 14, those skilled in the art will appreciate that additional members, such as an auxiliary member 284 (FIG.\",\n \"17), may be included in the workpiece 224 without departing from the scope of the present disclosure.\",\n \"The members 238, 240 of the workpiece 224 may be formed from any material capable of being joined by resistive heating.\",\n \"As one general example, the members 238, 240 of the workpiece 224 may be formed from any metals or metal alloys capable of being joined by resistive heating.\",\n \"As one specific example, members 238, 240 of the workpiece 224 may be formed from aluminum or aluminum alloys.\",\n \"The member (e.g., a first member) 238 may include at least two strands 242.Each strand 242 may be formed from metal or metal alloy (e.g., aluminum or aluminum alloy).\",\n \"For example, the member 238 may be formed from a plurality of elongated strands 242 bundled together and having a generally circular cross-sectional shape.\",\n \"As a general, non-limiting example, the member 238 may be a metal wire, cable or rope.\",\n \"As a specific, non-limiting example, the member 238 may be a 25 mm2, 40 mm2 or 50 mm2 stranded wire cable.\",\n \"The member 240 (e.g., a second member) may be a terminal to which the member 238 (e.g., a stranded cable or wire) is joined by welding.\",\n \"For example, the member 240 may be a connector terminal suitable for connection (e.g., mechanical and/or electrical connection) to another object (e.g., an aircraft frame, a vehicle frame or an electrical junction).\",\n \"The first engagement surface 218 of the first electrode 212 may be formed into an arcuate (e.g., curved) surface defining a concave recess 220 (FIG.\",\n \"13) configured to make flush contact with at least a portion of the exterior surface 226 of the member 238.For example, the first engagement surface 218 may be machined as a generally semicircular shape or an inverted U shape defining a generally semicircular recess 220 configured to make flush contact with at least a portion of the exterior surface 226 (e.g., a semi-circular portion of the circumferential exterior surface) of the member 238 (e.g., a stranded cable or wire).\",\n \"However, various contours, including flat/planar, are contemplated for the first engagement surface 218.Referring to FIGS.\",\n \"14 and 15, the width-determining fixture 236 may be positioned adjacent to the first electrode 212.In one construction, the width-determining fixture 236 may include a first (e.g., left) side stop 252 and a second (e.g., right) side stop 254 laterally opposed from the first side stop 252.The first side stop 252 may be positioned adjacent to (e.g., to the left of) the first electrode 212 and the second side stop 254 may be positioned adjacent to (e.g., to the right of) the first electrode 212 such that the first side stop 252 and the second side stop 254 are positioned to the sides (e.g., the left side and the right side) of the member 238 when the clamping force is exerted to the workpiece 224.The first side stop 252 and the second side stop 254 may be formed from a material having an electrical resistance greater than that of the first electrode 212 and the second electrode 214.For example, the first side stop 252 and the second side stop 54 may be formed from a high resistance metal.\",\n \"As another example, the first side stop 252 and the second side stop 254 may be formed from an electrically insulating or non-conductive material, such as ceramic.\",\n \"In general, the material of the first side stop 252 and the second side stop 254 may be selected to ensure the electrical current is directed through the workpiece 224.The first side stop 252 may be housed within a first sleeve 264 and the second side stop 254 may be housed within a second sleeve 266.The first sleeve 264 and the second sleeve 266 may be connected to the first support structure 244 such that the first side stop 252 and the second side stop 254 define the welding volume 256 around (e.g., to the sides of) the member 238 as the first electrode 212 approximates the second electrode 214 in response to the welding force F1.When the first electrode 212 approaches the second electrode 214 and exerts the clamping force to the member 238 therebetween, the first side stop 252 and the second side stop 254 may engage the member 240 (e.g., connector terminal) adjacent to the member 238 (e.g., stranded cable).\",\n \"As such, the welding volume 256 may be defined by the first engagement surface 218 of the first electrode 212, an interior surface 268 of the first side stop 252, an interior surface 270 of the second side stop 254 and a portion of the exterior surface 234 (e.g., a top surface) of the member 240 positioned between the first side stop 252 and the second side stop 254.The position of the first side stop 252 and the second side stop 254 with respect to the first sleeve 264 and the second sleeve 266, respectively, may automatically adjust an axial position (see longitudinal axis L in FIG.\",\n \"13) to constantly engage the exterior surface 234 of the member 240 and contain the flow of molten metal 272 (FIG.\",\n \"15) within the welding volume 256.The first side stop 252 may be outwardly biased from within the first sleeve 264 and the second side stop 254 may be outwardly biased from within the second sleeve 266.For example, the first side stop 252 may be connected within the first sleeve 264 by a first biasing element 274 (e.g., a spring) and the second side stop 254 may be connected within the second sleeve 266 by a second biasing element 276 (e.g., a spring).\",\n \"A bottom surface 284 (FIG.\",\n \"13) of the first side stop 252 and the second side stop 254 may be substantially planar to make flush contact with the substantially planar exterior surface 234 of the member 240.As the first support structure 244 approximates the second support structure 246 (e.g., via the first drive element 248), the first electrode 212 may move toward and exert a welding force F1 (e.g., clamping force) upon the member 238 and the first side stop 252 and the second side stop 254 may simultaneously move toward and engage the member 240.As the first support structure 248 further approximates the second support structure 246, the welding force F1 exerted to the member 238 by the first electrode 212 and the second electrode 214 may increase as the first electrode 212 approximates the second electrode 214; however, the first side stop 252 and the second side stop 254 may be at least partially pushed into the first sleeve 264 and the second sleeve 266, respectively, to prevent damage to the member 240 while maintaining flush contact with the member 240 and containing the outward flow of the molten metal 272 (FIG.\",\n \"15).\",\n \"The second engagement surface 222 of the second electrode 214 may be a substantially planar surface configured to make substantially flush contact with at least a portion of the exterior surface 234 of the member 240.For example, the second engagement surface 222 may be machined as a substantially flat shape configured to make substantially flush contact with a substantially planar portion of the exterior surface 234 (e.g., a portion of a bottom surface) of the member 240 (e.g., a connector terminal).\",\n \"However, various contours, including curved, are contemplated for the second engagement surface 222.The second engagement surface 222 of the second electrode 214 may define a first recess 290 and a second recess 292.The first portion 206 of the electrically nonconductive material 202 may be inserted into the first recess 290 and the second portion 208 of the electrically nonconductive material 202 may be inserted into the second recess 292.Therefore, the sizes and shapes of the first and second portions 206, 208 may closely correspond to the sizes and shapes of the recesses 290, 292.Optionally, mechanical fasteners 294, such as screws, pins and the like, may secure the first and second portions 206, 208 of the electrically nonconductive material 202 in the recesses 290, 292 of the second electrode 214.Other techniques for securing portions 206, 208 within corresponding recesses 290, 292, such as press fitting and adhering, are also contemplated.\",\n \"The cross-sectional thicknesses of the first and second portions 206, 208 of the electrically nonconductive material 202 may closely correspond to the depth of the recesses 290, 292 such that the engagement surfaces 296, 298 of the first and second portions 206, 208 are substantially co-planar with the engagement surface 222 of the second electrode 214.Therefore, the exterior surface 234 (e.g., bottom surface) of the member 240 may make substantially flush contact with both the engagement surface 222 of the second electrode 214 and the engagement surfaces 296, 298 of the first and second portions 206, 208.The first and second portions 206, 208 of the electrically nonconductive material 202 may be positioned relative to the second electrode 214 such that only a central portion 299 of the second electrode 214 is in electrical contact with the workpiece 224.For example, each of the first and second portions 206, 208 of the electrically nonconductive material 202 may include an inner edge 302 and an outer edge 304.The inner edge 302 of each portion 206, 208 of electrically nonconductive material 202 may be substantially vertically aligned with, or laterally inward of, the interior surfaces 268, 270 of the first and second side stops 252, 254 of the width-determining fixture 236.The outer edge 304 of each portion 206, 208 of electrically nonconductive material 202 may extend laterally outside of member 240 of the workpiece 224.Thus, portions of the workpiece 224 (e.g., member 240) that are laterally outside of the width W1 (FIG.\",\n \"14) of the welding volume 256 (FIG.\",\n \"14) may be electrically insulated from the underlying second electrode 214 by the first and second portions 206, 208 of the electrically nonconductive material 202, thereby focusing the welding current into the welding volume 256 rather than dissipating the welding current laterally outward.\",\n \"Furthermore, if the side stops 252, 254 of the width-determining fixture 236 were electrically conductive and were to extend vertically downward toward the engagement surface 222 of the second electrode (e.g., if there were no member 240 therebetween), the side stops 252, 254 would contact the first and second portions 206, 208 of the electrically nonconductive material 202 and would be electrically insulated from the second electrode 214, thereby inhibiting (if not eliminating) the formation of a shunt path through the side stops 252, 254.Referring to FIG.\",\n \"16, the welded workpiece 258 may have a shape substantially matching the shape of the welding volume 256 (FIG.\",\n \"14).\",\n \"For example, the welded workpiece 258 may include a curved upper end 278 substantially matching the curved first engagement surface 218 of the first electrode 212, a planar first (e.g., left) side 280 substantially matching the planar first interior surface 268 of the first side stop 252 and a planar second (e.g., right) side 282 substantially matching the planar second interior surface 270 of the second side stop 254.The welded workpiece 258 may include a solidified portion of the plurality of strands 242 of the member 238 (e.g., a stranded cable) joined to the member 240 (e.g., a connector terminal) through resistive welding.\",\n \"Referring to FIG.\",\n \"17, the workpiece 224 may also include an auxiliary member 284.The auxiliary member 284 may have a size and shape sufficient to at least partially surround member 238.The auxiliary member 284 may be formed from a material having the same or similar chemistry as the members 238, 240, or from a material that is compatible with the material from which the members 238, 240 are formed.\",\n \"For example, when the members 238, 240 are formed from aluminum alloys, the auxiliary member 284 may be formed from an aluminum alloy or appropriate aluminum alloy filler metal.\",\n \"As illustrated in FIG.\",\n \"17, in one implementation, the auxiliary member 284 may be a generally semi-circular band 286 having an arcuate (e.g.\",\n \"curved) body (e.g., U-shaped) of sufficient size and shape to at least partially surround (e.g., cover) the exterior surface 226 of the member 238 (e.g., a stranded cable) and ends that extend to engage the exterior surface 234 of the member 240 (e.g., a connector terminal).\",\n \"In other implementations, the auxiliary member 284 may have other shapes, such as circular (see FIG.\",\n \"7).\",\n \"Referring to FIG.\",\n \"18, a sixth embodiment of the disclosed welding assembly, generally designated 400, may be configured in the same or similar manner as the welding assemblies 200 shown in FIGS.\",\n \"12-17.However, rather than inserting the electrically nonconductive material 402 into recesses (see recesses 290, 292 in FIG.\",\n \"14) in the second electrode 414, the electrically nonconductive material 402 may be positioned adjacent to, and laterally outside of, the second electrode 414.Therefore, the electrically nonconductive material 402 may define an engagement surface 496 (or engagement surfaces 496, 498) that supports a portion of the workpiece 424 (e.g., member 438, member 440 and/or an auxiliary member (not shown in FIG.\",\n \"18)), yet electrically isolates a portion of the workpiece 424 (e.g., the portion of the workpiece outside of the width of the welding volume) from the second electrode 414.As one example, the electrically nonconductive material 402 of the welding assembly 400 may include two wing portions 406, 408 secured to laterally opposed sides 449, 451 of the second electrode 414 with mechanical fasteners 494.As another example, the electrically nonconductive material 402 of the welding assembly 400 may be a sleeve that extends (e.g., circumferentially) around the second electrode 414.Referring to FIG.\",\n \"19, one embodiment of the disclosed method, generally designated 500, for welding stranded metal and metal alloys (e.g., stranded cables of wires) may begin by positioning a workpiece between a first electrode and a second electrode of a welding assembly, as shown at block 502.An auxiliary member may optionally be included in the workpiece.\",\n \"As shown at block 504, the first electrode and/or the second electrode may apply a clamping force to the workpiece.\",\n \"As shown at block 506, a width-determining fixture may be positioned between the first electrode and the second electrode around the workpiece to define a welding volume having a lateral width.\",\n \"As shown at block 508, a welding current may be passed through the workpiece for a sufficient amount of time to raise the temperature of the workpiece to a welding temperature to liquefy the workpiece.\",\n \"The welding current may be contained within the lateral width of the welding volume to focus the welding current into the workpiece.\",\n \"Optionally, a cooling step may be introduced between the various steps of the method 500 or combined with the various steps of the method 500, such as combined with the current passing step 508.For example, the welded workpiece may be cooled by circulating cooling fluid through the fluid channels in the first and second electrodes while one or more of the first and second electrodes are engaged with the welded workpiece.\",\n \"Although various embodiments of the disclosed welding assembly and method have been shown and described, modifications may occur to those skilled in the art upon reading the specification.\",\n \"The present application includes such modifications and is limited only by the scope of the claims.\"\n ]\n]"},"source":{"kind":"string","value":"Patent_15871448"}}},{"rowIdx":4493799,"cells":{"text":{"kind":"list like","value":[["SRAM Circuits with Aligned Gate Electrodes","A device includes a Static Random Access Memory (SRAM) array, and an SRAM cell edge region abutting the SRAM array.","The SRAM array and the SRAM cell edge region in combination include first gate electrodes having a uniform pitch.","A word line driver abuts the SRAM cell edge region.","The word line driver includes second gate electrodes, and the first gate electrodes have lengthwise directions aligned to lengthwise directions of respective ones of the second gate electrodes."],["1.A device comprising: a Static Random Access Memory (SRAM) array; an SRAM cell-edge region abutting the SRAM array, wherein the SRAM cell-edge region is free from transistors therein, and the SRAM array and the SRAM cell-edge region in combination comprise first gate electrodes having a uniform pitch; and a word line driver abutting the SRAM cell-edge region, wherein the word line driver comprises second gate electrodes, and the first gate electrodes have lengthwise directions aligned to lengthwise directions of respective ones of the second gate electrodes.","2.The device of claim 1, wherein pitches of the second gate electrodes are equal to the uniform pitch, and the first gate electrodes and the second gate electrodes have a same width.","3.The device of claim 1, wherein a first one of the first gate electrodes is physically connected to a second one of the second gate electrodes to form a continuous gate electrode.","4.The device of claim 1, wherein the SRAM cell-edge region comprises an edge cell free from active devices therein, and the edge cell comprises a well pickup region, and wherein the word line driver comprises a transistor therein, and a continuous gate electrode in the first gate electrodes comprises a first part in the edge cell, and a second portion as a gate electrode of the transistor.","5.The device of claim 1, wherein the first gate electrodes comprise a continuous gate electrode continuously extending from a first edge to a second edge of the SRAM cell-edge region, with the first edge and the second edge being on opposite sides of the SRAM array.","6.The device of claim 5, wherein the continuous gate electrode continuously extends into a plurality of SRAM edge cells that are in a same row of the SRAM cell-edge region.","7.The device of claim 1 further comprising an Input-Output (IO) block comprising third gate electrodes parallel to the first gate electrodes, wherein the first gate electrodes and the third gate electrodes in combination form an integral unit having the uniform pitch.","8.The device of claim 7, wherein the first gate electrodes comprise a first boundary gate electrode, the third gate electrodes comprise a second boundary gate electrode immediately neighboring the first boundary gate electrode, and the first boundary gate electrode and the second boundary gate electrode have a pitch equal to the uniform pitch.","9.The device of claim 7, wherein pitches of the third gate electrodes are equal to the uniform pitch.","10.A device comprising: a Static Random Access Memory (SRAM) array comprising a plurality of SRAM cells; an SRAM cell-edge region encircling the SRAM array; first gate electrodes extending into both the SRAM array and the SRAM cell-edge region, wherein the first gate electrodes have a uniform pitch; and an Input-Output (IO) block comprising second gate electrodes parallel to the first gate electrodes, wherein a first boundary gate electrode in the first gate electrodes and a second boundary gate electrode in the second gate electrodes have a pitch equal to the uniform pitch.","11.The device of claim 10, wherein pitches of the second gate electrodes are equal to the uniform pitch.","12.The device of claim 10, wherein the first boundary gate electrode extends from a first boundary to a second boundary of the IO block, and the first boundary and the second boundary are opposite boundaries of the IO block.","13.The device of claim 12, wherein the first boundary gate electrode is a dummy gate electrode.","14.The device of claim 10 further comprising a word line driver abutting the SRAM cell-edge region, wherein the word line driver comprises third gate electrodes, and the first gate electrodes and the third gate electrodes have a same pitch, a same width, and a same spacing.","15.The device of claim 14, wherein one of the first gate electrodes is physically connected to one of the third gate electrodes to form a continuous gate electrode.","16.The device of claim 10, wherein the first gate electrodes comprise a continuous gate electrode continuously extending from a first edge to a second edge of the SRAM cell-edge region, with the first edge and the second edge being opposite edges of the SRAM cell region.","17.A device comprising: a Static Random Access Memory (SRAM) array; an SRAM cell-edge region abutting the SRAM array; a word line driver abutting the SRAM array; and a plurality of gate electrodes parallel to each other and having a uniform pitch, wherein the plurality of gate electrodes extend into the SRAM array, the SRAM cell-edge region, and the word line driver, and wherein the plurality of gate electrodes comprises a continuous gate electrode continuously extending into the SRAM cell-edge region and the word line driver.","18.The device of claim 17, wherein portions of the plurality of gate electrodes in the SRAM array and the SRAM cell-edge region have a uniform pitch.","19.The device of claim 18, wherein pitches of the portions of the plurality of gate electrodes in the word line driver are equal to the uniform pitch.","20.The device of claim 17 further comprising an Input-Output (IO) block, with the plurality of gate electrodes comprising a portion extending into the IO block and having pitches equal to the uniform pitch."],[" BACKGROUND Static Random Access Memory (SRAM) is commonly used in integrated circuits.","SRAM cells have the advantageous feature of holding data without a need of refreshing.","SRAM cells may include different numbers of transistors, and are often accordingly referred to by the number of transistors, for example, six-transistor (6-T) SRAM, eight-transistor (8-T) SRAM, and the like.","The transistors typically form a data latch for storing a bit.","Additional transistors may be added to improve the access to the transistors.","SRAM cells are typically arranged as an array having rows and columns.","Typically, each row of the SRAM cells is connected to a word-line, which determines whether the current SRAM cell is selected or not.","Each column of the SRAM cells is connected to a bit-line (or a pair of bit-lines), which is used for storing a bit into, or read from, the SRAM cell.","SRAM array are connected to a plurality of peripheral circuits, such as word line drivers and input/output circuits such as read/write circuits, which are used for writing data into the SRAM array, and reading data out of the SRAM array."],[" BRIEF DESCRIPTION OF THE DRAWINGS Aspects of the present disclosure are best understood from the following detailed description when read with the accompanying figures.","It is noted that, in accordance with the standard practice in the industry, various features are not drawn to scale.","In fact, the dimensions of the various features may be arbitrarily increased or reduced for clarity of discussion.","FIG.","1 illustrates a schematic top view of an SRAM array, an SRAM edge cell region, an Input/output (IO) block, a word line driver, and respective gate electrodes in accordance with some embodiments.","FIG.","2 illustrates a schematic top view of an SRAM array and respective gate electrodes in accordance with some embodiments.","FIG.","3 illustrates an exemplary SRAM cell and respective gate electrodes in accordance with some embodiments.","FIG.","4 illustrates SRAM edge cells in an SRAM edge cell region and the respective gate electrodes in accordance with some embodiments.","FIG.","5 illustrates an exemplary SRAM edge cell and respective gate electrodes in accordance with some embodiments.","FIGS.","6 and 7 illustrate boundary regions between an IO block and an SRAM edge cell region in accordance with some embodiments.","FIGS.","8 and 9 illustrate boundary regions between a word line driver and an SRAM edge cell region in accordance with some embodiments.","FIG.","10 illustrates a schematic top view of an SRAM array, an IO block, a word line driver, and respective gate electrodes in accordance with some embodiments.","detailed-description description=\"Detailed Description\" end=\"lead\"?"],["PRIORITY CLAIM AND CROSS-REFERENCE This application is a continuation of U.S. patent application Ser.","No.","15/202,053, entitled “SRAM Circuits with Aligned Gate Electrodes,” filed Jul.","5, 2016, which claims the benefit of the following provisionally filed U.S. Patent application: Application Ser.","No.","62/299,247, filed Feb. 24, 2016, and entitled “SRAM & Logic Poly Fully Aligned,” which application is hereby incorporated herein by reference.","BACKGROUND Static Random Access Memory (SRAM) is commonly used in integrated circuits.","SRAM cells have the advantageous feature of holding data without a need of refreshing.","SRAM cells may include different numbers of transistors, and are often accordingly referred to by the number of transistors, for example, six-transistor (6-T) SRAM, eight-transistor (8-T) SRAM, and the like.","The transistors typically form a data latch for storing a bit.","Additional transistors may be added to improve the access to the transistors.","SRAM cells are typically arranged as an array having rows and columns.","Typically, each row of the SRAM cells is connected to a word-line, which determines whether the current SRAM cell is selected or not.","Each column of the SRAM cells is connected to a bit-line (or a pair of bit-lines), which is used for storing a bit into, or read from, the SRAM cell.","SRAM array are connected to a plurality of peripheral circuits, such as word line drivers and input/output circuits such as read/write circuits, which are used for writing data into the SRAM array, and reading data out of the SRAM array.","BRIEF DESCRIPTION OF THE DRAWINGS Aspects of the present disclosure are best understood from the following detailed description when read with the accompanying figures.","It is noted that, in accordance with the standard practice in the industry, various features are not drawn to scale.","In fact, the dimensions of the various features may be arbitrarily increased or reduced for clarity of discussion.","FIG.","1 illustrates a schematic top view of an SRAM array, an SRAM edge cell region, an Input/output (IO) block, a word line driver, and respective gate electrodes in accordance with some embodiments.","FIG.","2 illustrates a schematic top view of an SRAM array and respective gate electrodes in accordance with some embodiments.","FIG.","3 illustrates an exemplary SRAM cell and respective gate electrodes in accordance with some embodiments.","FIG.","4 illustrates SRAM edge cells in an SRAM edge cell region and the respective gate electrodes in accordance with some embodiments.","FIG.","5 illustrates an exemplary SRAM edge cell and respective gate electrodes in accordance with some embodiments.","FIGS.","6 and 7 illustrate boundary regions between an IO block and an SRAM edge cell region in accordance with some embodiments.","FIGS.","8 and 9 illustrate boundary regions between a word line driver and an SRAM edge cell region in accordance with some embodiments.","FIG.","10 illustrates a schematic top view of an SRAM array, an IO block, a word line driver, and respective gate electrodes in accordance with some embodiments.","DETAILED DESCRIPTION The following disclosure provides many different embodiments, or examples, for implementing different features of the invention.","Specific examples of components and arrangements are described below to simplify the present disclosure.","These are, of course, merely examples and are not intended to be limiting.","For example, the formation of a first feature over or on a second feature in the description that follows may include embodiments in which the first and second features are formed in direct contact, and may also include embodiments in which additional features may be formed between the first and second features, such that the first and second features may not be in direct contact.","In addition, the present disclosure may repeat reference numerals and/or letters in the various examples.","This repetition is for the purpose of simplicity and clarity and does not in itself dictate a relationship between the various embodiments and/or configurations discussed.","Further, spatially relative terms, such as “underlying,” “below,” “lower,” “overlying,” “upper” and the like, may be used herein for ease of description to describe one element or feature's relationship to another element(s) or feature(s) as illustrated in the figures.","The spatially relative terms are intended to encompass different orientations of the device in use or operation in addition to the orientation depicted in the figures.","The apparatus may be otherwise oriented (rotated 90 degrees or at other orientations) and the spatially relative descriptors used herein may likewise be interpreted accordingly.","Static Random Access Memory (SRAM) array and peripheral circuits of the SRAM array are provided in accordance with various exemplary embodiments.","Some variations of some embodiments are discussed.","Throughout the various views and illustrative embodiments, like reference numbers are used to designate like elements.","FIG.","1 illustrates a schematic top view of SRAM array 110, SRAM edge cell regions 100, Input/output (IO) block 200, and word line driver 300 in accordance with some embodiments of the present disclosure.","SRAM array 110 includes SRAM cells arranged as a plurality of rows and a plurality of columns.","More details of SRAM array 110 are provided in FIGS.","2 and 3 in accordance with some exemplary embodiments of the present disclosure.","SRAM edge cell region 100 abuts SRAM cell array 100 and include SRAM edge cells.","In accordance with some embodiments, as shown in FIG.","1, SRAM edge cell region 100 extends on all four sides (in +X, −X, +Y, and −Y directions) of SRAM array 110, and hence forms a ring-shaped region encircling SRAM array 110.The inner edges of the ring-shaped SRAM edge cell region 100 abut the respective outer edges of SRAM array 110.Accordingly, the inner edges of SRAM edge cell region 100 abut the edges of the SRAM cells 102 (FIG.","2) in SRAM array 110.In accordance with alternative embodiments, SRAM edge cell region 100 are formed on one side, two sides, or three sides of SRAM array 110 in any combination, while the remaining sides of SRAM array 110 has no SRAM edge cells abutting them.","For example, SRAM edge cell region 100 may extend on the +X and +Y sides of SRAM array 110, and not on the −X and/or −Y sides of SRAM array 110.In yet alternative embodiments, SRAM edge cell region 100 includes portions on the +X side, while there is no SRAM edge cells on the −X side, +Y side, and −Y side, of SRAM array 110.SRAM array 110 includes a plurality of SRAM cells 102 arranged as a plurality of rows and a plurality of columns, and exemplary SRAM cells 102 are schematically illustrated in FIGS.","2 and 3.SRAM edge cell region 100 may include edge cells 104 (FIGS.","4 and 5).","Edge cells 104 are sometimes referred to as strap cells 104, which include the pickup regions of p-well regions and n-well regions, and the metal lines (such as word lines, bit lines, VDD power lines, VSS power lines, etc.)","connected between SRAM cells 102 and peripheral circuits such as word line drivers 300.IO block 200, and power sources (not shown).","Referring back to FIG.","1, SRAM peripheral circuits for supporting SRAM array 110 include IO block 200 and word line driver 300.In accordance with some embodiments of the present disclosure, IO block 200 includes the circuits that are configured to read the data stored in SRAM array 110, and the circuits that are configured to write data into SRAM array 110.In accordance with some embodiments of the present disclosure, IO block 200 includes, and is not limited to, write driver(s), read sensing amplifier(s), multiplexers, and the like.","IO block 200 is electrically coupled to SRAM array 110 through metal lines that are formed in the metallization layers of the respective chips.","The metal lines include, and are not limited to, bit lines (not shown), wherein the data read from and written into SRAM array 110 are carried through the bit lines.","The bit lines may have lengthwise directions parallel to the +Y/−Y directions.","As also shown in FIG.","1, word line driver 300 is configured to provide word line signals to the word lines of SRAM array 110, so that a selected row of SRAM cells in SRAM array 110 may be selected or deselected for a read or write operation.","For example, when a specific row of SRAM array 110 is selected for a read or write operation, word line driver 300 may supply a positive voltage to the word line of the respective row in order to select the row.","Conversely, when a specific row of SRAM array 110 is not selected for the read or write operation, word line driver 300 may supply a low voltage (such as the electrical ground voltage) to the word line of the respective row in order to deselect the row.","Word line driver 300 is electrically coupled to SRAM cells in SRAM array 110 through metal lines that are formed in the metallization layers of the respective chips, wherein the metal lines include, and are not limited to, word lines (not shown).","The word lines may have lengthwise directions parallel to the +Y/−Y directions.","FIG.","1 also schematically illustrates a plurality of gate electrodes 112, 212, and 312, which include active gate electrodes of transistors and dummy gate electrodes that do not form the gate electrodes of any transistor.","In accordance with some embodiments of the present disclosure, gate electrodes 112, 212, and 312 are formed of polysilicon.","In accordance with alternative embodiments, gate electrodes 112, 212, and 312 are formed of other conductive materials such as metal or metal alloy, metal silicide, metal nitride, or the like.","Furthermore, some parts of the gate electrodes 112, 212, and 312 may be formed of polysilicon, while some other parts of the gate electrodes 112, 212, and 312 are replacement gates, wherein metals are used to replace the polysilicon.","It is appreciated that FIG.","1 illustrates the likely positions of gate electrodes 112, 212, and 312.To form functional circuits, the illustrated continuous gate electrodes 112, 212, and 312, which are illustrated as extending continuously throughout regions 100, 200, and 300, may actually be cut apart into shorter pieces.","For example, as shown in FIG.","3, gate electrodes 112 of the transistors in SRAM cell 102 have breaks therebetween, so that the gate electrodes of different transistors may be electrically decoupled from each other when needed.","Otherwise, the gate electrode of pass-gate transistor PG-1 will be undesirably connected to the gate electrodes of pull-up transistor PU-2 and pull-down transistor PD-2, and the gate electrode of pass-gate transistor PG-2 will be undesirably connected to the gate electrodes of pull-up transistor PU-1 and pull-down transistor PD-1, hence causing circuit failure.","For simplicity, in FIG.","1 and the subsequent figures, the breaks for breaking gate electrodes 112 are not illustrated, while they may exist.","Similarly, gate electrodes 212 and 312 may also be broken into shorter pieces to form functional circuits in regions 200 and 300.The gate electrodes that are broken into pieces, however, are allocated at the positions as illustrated in Figures of the present disclosure.","In the design and manufacturing process of the illustrated circuits on physical wafers, gate electrodes 112, 212, and 312 may be initially formed as long and continuous strips as illustrated in FIG.","1, and then etched (cut) into shorter pieces as needed in subsequent processes.","SRAM array 110 and SRAM edge cell region 100 have gate electrodes 112, which have a uniform pitch P1.Alternatively stated, all gate electrodes 112 of SRAM array 110 and SRAM edge cell region 100 may have an equal spacing and an equal width.","Gate electrodes 112 may have same or different lengths, and extend into various regions.","For example, some, but not all, gate electrodes 112 (such as 112′) may continuously extend from edge 100B to the opposite edge 100A of SRAM edge cell region 100, with no break therein.","Some of gate electrodes 112 may continuously (physically) extend from SRAM array 110 into SRAM edge cell region 100.Some other electrodes 112 may have breaks in regions 100 and/or 110.In addition, if some strap cells are embedded in SRAM array 110, there may also be some gate electrodes 112 (schematically illustrated as 112″ as an example) that continuously extend from the SRAM edge cell region 100 on the left side of SRAM array 110 into SRAM array 110, and further into the SRAM edge cell region 100 on the right side of SRAM array 110, with no break in gate electrodes 112″.","Clearly, those gate electrodes 112 that form the gate electrodes of the transistors in SRAM array 110 will have breaks therein.","Word line driver 300 has gate electrodes 312, which also have uniform pitch P1.The lengthwise directions of gate electrodes 312 are aligned to the respective lengthwise directions of gate electrodes 112.Furthermore, the spacings and the widths of gate electrodes 312 may also be the same as the corresponding ones of gate electrodes 112.SRAM edge cell region 100 abuts word line driver 300, with no spacing separates them from each other.","Accordingly, gate electrodes 112 and 312 may include various connecting schemes.","For example, some of gate electrodes 112 may continuously extend into word line driver 300 and hence are physically connected to the respective gate electrodes 312.Some of gate electrodes 312 may be physically connected to the gate electrodes 112 that continuously extend into SRAM edge cell 100.Some other gate electrodes 112 may be separate from the respective (aligning) gate electrodes 312 at the interface between SRAM edge cell region 100 and word line driver 300, as is shown in FIG.","8.Furthermore, some gate electrodes such 112′ are also connected to the gate electrodes 312 that extend from edge 300B to the opposite edge 300A.","Accordingly, these gate electrodes 112′ may penetrate through both regions 100 and 300.IO block 200 has gate electrodes 212, which have uniform pitch P2.In accordance with some embodiments of the present disclosure, uniform pitch P2 is equal to uniform pitch P1.In accordance with alternative embodiments, uniform pitch P2 is different from pitch P1.Also, the boundary gate electrode 112 and the boundary gate electrodes 212 that are immediately neighboring each other has a spacing equal to the spacings of gate electrodes 112 and/or the spacings of gate electrodes 212.Alternatively stated, the boundary gate electrode 112B and its immediate neighboring boundary gate electrode 212B also have the pitch (marked as P1/P2) equal to pitch P1 or pitch P2, which may be equal to, or different from, each other.","Accordingly, SRAM edge cell region 100 abuts IO block 200, with no spacing separating them from each other.","FIG.","2 illustrates an exemplary top view of SRAM array 110, which includes SRAM cells 102 arranged as a plurality of rows and columns.","FIG.","3 illustrates a part of the layout of an exemplary SRAM cell 102.It is appreciated that SRAM cells 102 may adopt many different designs, including and not limited to, six-transistor SRAM cell, eight-transistor SRAM cell, ten-transistor SRAM cell, single port SRAM cell, two port SRAM cell, dual-port SRAM cell, etc.","In accordance with some embodiments of the present disclosure, SRAM cell 102 includes pass-gate transistors PG-1 and PG-2, pull-up transistors PU-1 and PU-2, and pull-down transistors PD-1 and PD-2, wherein pull-up transistors PU-1 and PU-2 and pull-down transistors PD-1 and PD-2 are connected to form a latch storing a bit.","Gate electrodes 112 extend in the X direction, while active regions (which may be semiconductor fins) 114 extending in the Y direction.","As shown in FIG.","2, gate electrodes 112 are broken into short pieces, while the positions of the broken gate electrodes 112 are aligned to the positions of gate electrodes 112 as shown in FIG.","1, wherein all gate electrodes 112 throughout SRAM array 110 and edge cell region 100 have uniform pitch P1.Referring back to FIG.","2, SRAM cells 102 may have structures identical to each other (while some SRAM cells 102 may be mirrored/flipped from others).","The edges of SRAM array 110 are defined by the outmost edges of the edge SRAM cells.","For example, left edge 110B is defined by the left edges of the left-most SRAM cells 102, and right edge 110A is defined by the right edges of the right-most SRAM cells 102.In accordance with some exemplary embodiments of the present disclosure, the entire SRAM array 110 is occupied by SRAM cells 102, with no strap cells therein.","In accordance with alternative embodiments, strap cells are placed in SRAM array 110.The strap cells may be essentially the same as edge cell 104 as shown in FIG.","5.In accordance with some exemplary embodiments, a row of strap cells may be placed every 4 rows, 8 rows, or more rows of SRAM cells 102.The strap cells in SRAM array 110 may be used for well pickup, for running metal lines that don't fit into SRAM cells 102, which metal lines may include power mesh (such as for VDD and VSS power mesh).","FIG.","4 illustrates an exemplary top view of SRAM edge cell region 100, which includes SRAM edge cells 104 abutting (and possibly surrounding) SRAM array 110.Edge cells 104 may be used for various purposes such as forming well pickup regions for the p-well regions and n-well regions, on which the transistors of SRAM cells 102 (FIG.","2) are formed.","Edge cells 104 may not include any active device such as transistor and diode.","For example, FIG.","5 illustrates an exemplary edge cell 104, which includes well pickup regions 106 for the pickup of p-well regions (for example, the p-well region in FIG.","3), and well pickup region(s) 108 for the pickup of n-well regions.","Well pickup regions 106 and 108 are heavily doped active regions (which may be semiconductor fins).","The well pickup regions of n-well regions are heavily doped n-type regions, while the well pickup regions of p-well regions are heavily doped p-type regions.","In accordance with some embodiments, assuming the edge cell 104 shown in FIG.","5 is in a same column as the SRAM cell 102 as shown in FIG.","3, the left P-well region in FIG.","5 may be connected to the left P-well region in FIG.","3 as a continuous P-well region, and hence the well pickup region 106 (marked as 106A) is used for picking up the left P-well region of the SRAM cell 102 shown in FIG.","3.Similarly, the N-well region in FIG.","5 may be connected to the N-well region in FIG.","3 as a continuous N-well region, and hence the well pickup region 108 is used for picking up the N-well region of the SRAM cell 102 in FIG.","3.FIG.","5 also illustrates exemplary metal lines 116, which are in a metal layer.","Depending on where the edge cell 104 is located, metal lines 116 may be word lines, bit lines, VDD lines, and/or VSS lines.","The metal lines in edge cell 104 also include metal lines having lengthwise directions parallel to the X direction and metal lines (not shown) having lengthwise directions parallel to the Y direction, wherein the metal lines extending in different directions are allocated in different metal layers such as metal layer 1, metal layer 2, metal layer 3, etc..","In accordance with some embodiments of the present disclosure, some or all of SRAM edge cells 104 aligned to the same row may have the same structure (which may be aligned to the same direction or mirrored) or different structures, and some or all of SRAM edge cells 104 aligned to the same column may have the same structure (which may be aligned to the same direction or mirrored) or different structures.","FIG.","6 illustrates a top view of a boundary region of SRAM edge cell region 100 and IO block 200 in accordance with some embodiments of the present disclosure, wherein the boundary region is schematically illustrated as region 500 in FIG.","1.IO block 200 include transistor 214, which includes gate electrodes 212A and active region 214A.","Active region 216A forms the channel and the (common) source/drain regions of transistor 214.Transistor 214 includes the boundary gate electrode 212B as its gate.","Alternatively stated, transistor 214 includes the boundary gate electrode 212B that is closest to SRAM edge cells 104, with no additional gate electrode 212 between transistor 214 and edge cells 104.FIG.","7 illustrates a top view of a boundary region of SRAM edge cell region 100 and IO block 200 in accordance with some embodiments of the present disclosure, wherein the boundary region may be region 500 in FIG.","1.These embodiments are similar to the embodiments in FIG.","6, except dummy gate electrode 212B is located between transistor 214 and SRAM edge cells 104.Dummy gate electrode 212B may be considered as a part of IO block 200.In accordance with some embodiments, dummy gate electrode 212B extends all the way from edge 200A to the opposite edge 200B of IO block 200, with no break in dummy gate electrode 212B.","In accordance with some embodiments of the present disclosure, dummy gate electrode(s) 112′, which are parts of SRAM edge cells 104, also extend from edge 100A to the opposite edge 100B (FIG.","1) of SRAM edge cell region 100.In accordance with alternative embodiments, gate electrode 112′ is broken into pieces.","FIG.","8 illustrates some details of the structure shown in FIG.","1 in accordance with some embodiments, wherein gate electrodes 112 and 312 and the respective transistors are illustrated.","In accordance with some embodiments of the present disclosure, gate electrodes 112 are separated from gate electrodes 312 by space 10.Space 10 is formed by cutting the otherwise connected gate electrodes 112 and 312, and hence is sometimes referred to as cut-poly 10.Space 10 extends from edge 100C to edge 100D of SRAM edge cell region 100.It is observed that since space 10 is formed by cutting the originally interconnected gate electrodes 112 and 312, gate electrodes 112 and 312 have lengthwise directions aligned to each other, and have the same width, the same spacing, and the same pitch.","Word line driver 300 includes exemplary transistors 314A, 314B, and 314C.","Various allocation schemes of gate electrodes 312 relative to space 10 may be adopted.","For example, gate electrode 312A of transistor 314A may be spaced apart from space 10 by an additional space 14.Gate electrode 312B of transistor 314B may be spaced apart from space 10 by some discrete portions of dummy gate electrodes 312′.","Gate electrode 312C of transistor 314B, on the other hand, may extend all the way to space 10.In accordance with some embodiments of the present disclosure, in addition to space 10, space 12 may also be formed in SRAM edge cells 104, and extend in the Y direction.","Space 12 may also extend from edge 100C to edge 100D of SRAM edge cell region 100.FIG.","9 illustrates some details of the structure shown in FIG.","1 in accordance with some embodiments, wherein gate electrodes 112 and 312 and the respective transistors are illustrated.","Some gate electrodes 112 and the respective aligned gate electrodes 312 may be connected to each other with no breaking.","For example, the gate electrodes 312A of transistor 314A is connected to the respective gate electrodes 112A, wherein a break occurs inside edge cell region 100 in order to separate the gate electrode 312A from the rest of gate electrodes 112A.","On the other hand, break 320 is formed to separate the gate electrodes of transistor 314B from gate electrode portions 312D.","In accordance with some embodiments, some gate electrodes 314D and the respective connecting gate electrodes 112 form continuous gate electrodes that continuously extend from word line driver 300 all the way to SRAM array 110, as shown in FIG.","9.FIG.","10 illustrates an exemplary top view of SRAM array 110, IO block 200, and word line driver 300 in accordance with some embodiments.","These embodiments are similar to the embodiments shown in FIG.","1, except no SRAM edge cell region is formed.","Rather, SRAM array 110 abuts IO block 200 and word line driver 300.The details of gate electrodes 112, 212, and 312 are essentially the same as in the embodiments shown in FIGS.","1 through 9 (when applicable), and hence are not repeated herein.","In accordance with some embodiments, some gate electrodes 312 are continuously connected to some gate electrodes 112 (referring to FIG.","3) in SRAM cells 102.Furthermore, the boundary gate electrode 112 (neighboring IO block 200) are used to form the gate electrodes of the transistors (refer to FIG.","3) in SRAM cells.","In accordance with some embodiments, strap cells are formed between the rows and/or columns of the SRAM cells in SRAM array 110, and may be formed every repeated number of rows and/or columns.","The embodiments of the present disclosure have some advantageous features.","By abutting SRAM cell edge region 100 (or SRAM array 110) to word line driver 300 and IO block 200, the spaces between these regions, which spaces are adopted in conventional SRAM circuitry, are eliminated, and hence the chip area occupied by the entire SRAM circuity is reduced.","In addition, by forming gate electrodes in regions/circuits 100, 200, and 300 to have a uniform pitch, the pattern-loading effect in the formation of gate electrodes is reduced, resulting in an SRAM circuitry with more uniform performance.","In accordance with some embodiments of the present disclosure, a device includes an SRAM array, and an SRAM cell edge region abutting the SRAM array.","The SRAM array and the SRAM cell edge region in combination include first gate electrodes having a uniform pitch.","A word line driver abuts the SRAM cell edge region.","The word line driver includes second gate electrodes, and the first gate electrodes have lengthwise directions aligned to lengthwise directions of respective ones of the second gate electrodes.","In accordance with some embodiments of the present disclosure, a device includes an SRAM array including a plurality of SRAM cells.","An SRAM cell edge region abuts the SRAM array.","The SRAM array and the SRAM cell edge region in combination have first gate electrodes having a uniform pitch.","The first gate electrodes have a first boundary gate electrode.","An IO block includes second gate electrodes parallel to the first gate electrodes and having the uniform pitch.","The second gate electrodes include a second boundary gate electrode immediately neighboring the first boundary gate electrode, and the first boundary gate electrode and the second boundary gate electrode have a pitch equal to the uniform pitch.","In accordance with some embodiments of the present disclosure, a device includes an SRAM array including first gate electrodes having a uniform pitch.","The first gate electrodes have a first boundary gate electrode.","A word line driver abuts the SRAM cell edge region.","The word line driver includes second gate electrodes, and the first gate electrodes have lengthwise directions aligned to lengthwise directions of respective ones of the second gate electrodes.","An IO block includes third gate electrodes parallel to the first gate electrodes and having the uniform pitch.","The third gate electrodes include a second boundary gate electrode immediately neighboring the first boundary gate electrode.","A pitch of the first boundary gate electrode and the second boundary gate electrode is equal to a pitch of two neighboring ones of the first gate electrodes.","The foregoing outlines features of several embodiments so that those skilled in the art may better understand the aspects of the present disclosure.","Those skilled in the art should appreciate that they may readily use the present disclosure as a basis for designing or modifying other processes and structures for carrying out the same purposes and/or achieving the same advantages of the embodiments introduced herein.","Those skilled in the art should also realize that such equivalent constructions do not depart from the spirit and scope of the present disclosure, and that they may make various changes, substitutions, and alterations herein without departing from the spirit and scope of the present disclosure."]],"string":"[\n [\n \"SRAM Circuits with Aligned Gate Electrodes\",\n \"A device includes a Static Random Access Memory (SRAM) array, and an SRAM cell edge region abutting the SRAM array.\",\n \"The SRAM array and the SRAM cell edge region in combination include first gate electrodes having a uniform pitch.\",\n \"A word line driver abuts the SRAM cell edge region.\",\n \"The word line driver includes second gate electrodes, and the first gate electrodes have lengthwise directions aligned to lengthwise directions of respective ones of the second gate electrodes.\"\n ],\n [\n \"1.A device comprising: a Static Random Access Memory (SRAM) array; an SRAM cell-edge region abutting the SRAM array, wherein the SRAM cell-edge region is free from transistors therein, and the SRAM array and the SRAM cell-edge region in combination comprise first gate electrodes having a uniform pitch; and a word line driver abutting the SRAM cell-edge region, wherein the word line driver comprises second gate electrodes, and the first gate electrodes have lengthwise directions aligned to lengthwise directions of respective ones of the second gate electrodes.\",\n \"2.The device of claim 1, wherein pitches of the second gate electrodes are equal to the uniform pitch, and the first gate electrodes and the second gate electrodes have a same width.\",\n \"3.The device of claim 1, wherein a first one of the first gate electrodes is physically connected to a second one of the second gate electrodes to form a continuous gate electrode.\",\n \"4.The device of claim 1, wherein the SRAM cell-edge region comprises an edge cell free from active devices therein, and the edge cell comprises a well pickup region, and wherein the word line driver comprises a transistor therein, and a continuous gate electrode in the first gate electrodes comprises a first part in the edge cell, and a second portion as a gate electrode of the transistor.\",\n \"5.The device of claim 1, wherein the first gate electrodes comprise a continuous gate electrode continuously extending from a first edge to a second edge of the SRAM cell-edge region, with the first edge and the second edge being on opposite sides of the SRAM array.\",\n \"6.The device of claim 5, wherein the continuous gate electrode continuously extends into a plurality of SRAM edge cells that are in a same row of the SRAM cell-edge region.\",\n \"7.The device of claim 1 further comprising an Input-Output (IO) block comprising third gate electrodes parallel to the first gate electrodes, wherein the first gate electrodes and the third gate electrodes in combination form an integral unit having the uniform pitch.\",\n \"8.The device of claim 7, wherein the first gate electrodes comprise a first boundary gate electrode, the third gate electrodes comprise a second boundary gate electrode immediately neighboring the first boundary gate electrode, and the first boundary gate electrode and the second boundary gate electrode have a pitch equal to the uniform pitch.\",\n \"9.The device of claim 7, wherein pitches of the third gate electrodes are equal to the uniform pitch.\",\n \"10.A device comprising: a Static Random Access Memory (SRAM) array comprising a plurality of SRAM cells; an SRAM cell-edge region encircling the SRAM array; first gate electrodes extending into both the SRAM array and the SRAM cell-edge region, wherein the first gate electrodes have a uniform pitch; and an Input-Output (IO) block comprising second gate electrodes parallel to the first gate electrodes, wherein a first boundary gate electrode in the first gate electrodes and a second boundary gate electrode in the second gate electrodes have a pitch equal to the uniform pitch.\",\n \"11.The device of claim 10, wherein pitches of the second gate electrodes are equal to the uniform pitch.\",\n \"12.The device of claim 10, wherein the first boundary gate electrode extends from a first boundary to a second boundary of the IO block, and the first boundary and the second boundary are opposite boundaries of the IO block.\",\n \"13.The device of claim 12, wherein the first boundary gate electrode is a dummy gate electrode.\",\n \"14.The device of claim 10 further comprising a word line driver abutting the SRAM cell-edge region, wherein the word line driver comprises third gate electrodes, and the first gate electrodes and the third gate electrodes have a same pitch, a same width, and a same spacing.\",\n \"15.The device of claim 14, wherein one of the first gate electrodes is physically connected to one of the third gate electrodes to form a continuous gate electrode.\",\n \"16.The device of claim 10, wherein the first gate electrodes comprise a continuous gate electrode continuously extending from a first edge to a second edge of the SRAM cell-edge region, with the first edge and the second edge being opposite edges of the SRAM cell region.\",\n \"17.A device comprising: a Static Random Access Memory (SRAM) array; an SRAM cell-edge region abutting the SRAM array; a word line driver abutting the SRAM array; and a plurality of gate electrodes parallel to each other and having a uniform pitch, wherein the plurality of gate electrodes extend into the SRAM array, the SRAM cell-edge region, and the word line driver, and wherein the plurality of gate electrodes comprises a continuous gate electrode continuously extending into the SRAM cell-edge region and the word line driver.\",\n \"18.The device of claim 17, wherein portions of the plurality of gate electrodes in the SRAM array and the SRAM cell-edge region have a uniform pitch.\",\n \"19.The device of claim 18, wherein pitches of the portions of the plurality of gate electrodes in the word line driver are equal to the uniform pitch.\",\n \"20.The device of claim 17 further comprising an Input-Output (IO) block, with the plurality of gate electrodes comprising a portion extending into the IO block and having pitches equal to the uniform pitch.\"\n ],\n [\n \" BACKGROUND Static Random Access Memory (SRAM) is commonly used in integrated circuits.\",\n \"SRAM cells have the advantageous feature of holding data without a need of refreshing.\",\n \"SRAM cells may include different numbers of transistors, and are often accordingly referred to by the number of transistors, for example, six-transistor (6-T) SRAM, eight-transistor (8-T) SRAM, and the like.\",\n \"The transistors typically form a data latch for storing a bit.\",\n \"Additional transistors may be added to improve the access to the transistors.\",\n \"SRAM cells are typically arranged as an array having rows and columns.\",\n \"Typically, each row of the SRAM cells is connected to a word-line, which determines whether the current SRAM cell is selected or not.\",\n \"Each column of the SRAM cells is connected to a bit-line (or a pair of bit-lines), which is used for storing a bit into, or read from, the SRAM cell.\",\n \"SRAM array are connected to a plurality of peripheral circuits, such as word line drivers and input/output circuits such as read/write circuits, which are used for writing data into the SRAM array, and reading data out of the SRAM array.\"\n ],\n [\n \" BRIEF DESCRIPTION OF THE DRAWINGS Aspects of the present disclosure are best understood from the following detailed description when read with the accompanying figures.\",\n \"It is noted that, in accordance with the standard practice in the industry, various features are not drawn to scale.\",\n \"In fact, the dimensions of the various features may be arbitrarily increased or reduced for clarity of discussion.\",\n \"FIG.\",\n \"1 illustrates a schematic top view of an SRAM array, an SRAM edge cell region, an Input/output (IO) block, a word line driver, and respective gate electrodes in accordance with some embodiments.\",\n \"FIG.\",\n \"2 illustrates a schematic top view of an SRAM array and respective gate electrodes in accordance with some embodiments.\",\n \"FIG.\",\n \"3 illustrates an exemplary SRAM cell and respective gate electrodes in accordance with some embodiments.\",\n \"FIG.\",\n \"4 illustrates SRAM edge cells in an SRAM edge cell region and the respective gate electrodes in accordance with some embodiments.\",\n \"FIG.\",\n \"5 illustrates an exemplary SRAM edge cell and respective gate electrodes in accordance with some embodiments.\",\n \"FIGS.\",\n \"6 and 7 illustrate boundary regions between an IO block and an SRAM edge cell region in accordance with some embodiments.\",\n \"FIGS.\",\n \"8 and 9 illustrate boundary regions between a word line driver and an SRAM edge cell region in accordance with some embodiments.\",\n \"FIG.\",\n \"10 illustrates a schematic top view of an SRAM array, an IO block, a word line driver, and respective gate electrodes in accordance with some embodiments.\",\n \"detailed-description description=\\\"Detailed Description\\\" end=\\\"lead\\\"?\"\n ],\n [\n \"PRIORITY CLAIM AND CROSS-REFERENCE This application is a continuation of U.S. patent application Ser.\",\n \"No.\",\n \"15/202,053, entitled “SRAM Circuits with Aligned Gate Electrodes,” filed Jul.\",\n \"5, 2016, which claims the benefit of the following provisionally filed U.S. Patent application: Application Ser.\",\n \"No.\",\n \"62/299,247, filed Feb. 24, 2016, and entitled “SRAM & Logic Poly Fully Aligned,” which application is hereby incorporated herein by reference.\",\n \"BACKGROUND Static Random Access Memory (SRAM) is commonly used in integrated circuits.\",\n \"SRAM cells have the advantageous feature of holding data without a need of refreshing.\",\n \"SRAM cells may include different numbers of transistors, and are often accordingly referred to by the number of transistors, for example, six-transistor (6-T) SRAM, eight-transistor (8-T) SRAM, and the like.\",\n \"The transistors typically form a data latch for storing a bit.\",\n \"Additional transistors may be added to improve the access to the transistors.\",\n \"SRAM cells are typically arranged as an array having rows and columns.\",\n \"Typically, each row of the SRAM cells is connected to a word-line, which determines whether the current SRAM cell is selected or not.\",\n \"Each column of the SRAM cells is connected to a bit-line (or a pair of bit-lines), which is used for storing a bit into, or read from, the SRAM cell.\",\n \"SRAM array are connected to a plurality of peripheral circuits, such as word line drivers and input/output circuits such as read/write circuits, which are used for writing data into the SRAM array, and reading data out of the SRAM array.\",\n \"BRIEF DESCRIPTION OF THE DRAWINGS Aspects of the present disclosure are best understood from the following detailed description when read with the accompanying figures.\",\n \"It is noted that, in accordance with the standard practice in the industry, various features are not drawn to scale.\",\n \"In fact, the dimensions of the various features may be arbitrarily increased or reduced for clarity of discussion.\",\n \"FIG.\",\n \"1 illustrates a schematic top view of an SRAM array, an SRAM edge cell region, an Input/output (IO) block, a word line driver, and respective gate electrodes in accordance with some embodiments.\",\n \"FIG.\",\n \"2 illustrates a schematic top view of an SRAM array and respective gate electrodes in accordance with some embodiments.\",\n \"FIG.\",\n \"3 illustrates an exemplary SRAM cell and respective gate electrodes in accordance with some embodiments.\",\n \"FIG.\",\n \"4 illustrates SRAM edge cells in an SRAM edge cell region and the respective gate electrodes in accordance with some embodiments.\",\n \"FIG.\",\n \"5 illustrates an exemplary SRAM edge cell and respective gate electrodes in accordance with some embodiments.\",\n \"FIGS.\",\n \"6 and 7 illustrate boundary regions between an IO block and an SRAM edge cell region in accordance with some embodiments.\",\n \"FIGS.\",\n \"8 and 9 illustrate boundary regions between a word line driver and an SRAM edge cell region in accordance with some embodiments.\",\n \"FIG.\",\n \"10 illustrates a schematic top view of an SRAM array, an IO block, a word line driver, and respective gate electrodes in accordance with some embodiments.\",\n \"DETAILED DESCRIPTION The following disclosure provides many different embodiments, or examples, for implementing different features of the invention.\",\n \"Specific examples of components and arrangements are described below to simplify the present disclosure.\",\n \"These are, of course, merely examples and are not intended to be limiting.\",\n \"For example, the formation of a first feature over or on a second feature in the description that follows may include embodiments in which the first and second features are formed in direct contact, and may also include embodiments in which additional features may be formed between the first and second features, such that the first and second features may not be in direct contact.\",\n \"In addition, the present disclosure may repeat reference numerals and/or letters in the various examples.\",\n \"This repetition is for the purpose of simplicity and clarity and does not in itself dictate a relationship between the various embodiments and/or configurations discussed.\",\n \"Further, spatially relative terms, such as “underlying,” “below,” “lower,” “overlying,” “upper” and the like, may be used herein for ease of description to describe one element or feature's relationship to another element(s) or feature(s) as illustrated in the figures.\",\n \"The spatially relative terms are intended to encompass different orientations of the device in use or operation in addition to the orientation depicted in the figures.\",\n \"The apparatus may be otherwise oriented (rotated 90 degrees or at other orientations) and the spatially relative descriptors used herein may likewise be interpreted accordingly.\",\n \"Static Random Access Memory (SRAM) array and peripheral circuits of the SRAM array are provided in accordance with various exemplary embodiments.\",\n \"Some variations of some embodiments are discussed.\",\n \"Throughout the various views and illustrative embodiments, like reference numbers are used to designate like elements.\",\n \"FIG.\",\n \"1 illustrates a schematic top view of SRAM array 110, SRAM edge cell regions 100, Input/output (IO) block 200, and word line driver 300 in accordance with some embodiments of the present disclosure.\",\n \"SRAM array 110 includes SRAM cells arranged as a plurality of rows and a plurality of columns.\",\n \"More details of SRAM array 110 are provided in FIGS.\",\n \"2 and 3 in accordance with some exemplary embodiments of the present disclosure.\",\n \"SRAM edge cell region 100 abuts SRAM cell array 100 and include SRAM edge cells.\",\n \"In accordance with some embodiments, as shown in FIG.\",\n \"1, SRAM edge cell region 100 extends on all four sides (in +X, −X, +Y, and −Y directions) of SRAM array 110, and hence forms a ring-shaped region encircling SRAM array 110.The inner edges of the ring-shaped SRAM edge cell region 100 abut the respective outer edges of SRAM array 110.Accordingly, the inner edges of SRAM edge cell region 100 abut the edges of the SRAM cells 102 (FIG.\",\n \"2) in SRAM array 110.In accordance with alternative embodiments, SRAM edge cell region 100 are formed on one side, two sides, or three sides of SRAM array 110 in any combination, while the remaining sides of SRAM array 110 has no SRAM edge cells abutting them.\",\n \"For example, SRAM edge cell region 100 may extend on the +X and +Y sides of SRAM array 110, and not on the −X and/or −Y sides of SRAM array 110.In yet alternative embodiments, SRAM edge cell region 100 includes portions on the +X side, while there is no SRAM edge cells on the −X side, +Y side, and −Y side, of SRAM array 110.SRAM array 110 includes a plurality of SRAM cells 102 arranged as a plurality of rows and a plurality of columns, and exemplary SRAM cells 102 are schematically illustrated in FIGS.\",\n \"2 and 3.SRAM edge cell region 100 may include edge cells 104 (FIGS.\",\n \"4 and 5).\",\n \"Edge cells 104 are sometimes referred to as strap cells 104, which include the pickup regions of p-well regions and n-well regions, and the metal lines (such as word lines, bit lines, VDD power lines, VSS power lines, etc.)\",\n \"connected between SRAM cells 102 and peripheral circuits such as word line drivers 300.IO block 200, and power sources (not shown).\",\n \"Referring back to FIG.\",\n \"1, SRAM peripheral circuits for supporting SRAM array 110 include IO block 200 and word line driver 300.In accordance with some embodiments of the present disclosure, IO block 200 includes the circuits that are configured to read the data stored in SRAM array 110, and the circuits that are configured to write data into SRAM array 110.In accordance with some embodiments of the present disclosure, IO block 200 includes, and is not limited to, write driver(s), read sensing amplifier(s), multiplexers, and the like.\",\n \"IO block 200 is electrically coupled to SRAM array 110 through metal lines that are formed in the metallization layers of the respective chips.\",\n \"The metal lines include, and are not limited to, bit lines (not shown), wherein the data read from and written into SRAM array 110 are carried through the bit lines.\",\n \"The bit lines may have lengthwise directions parallel to the +Y/−Y directions.\",\n \"As also shown in FIG.\",\n \"1, word line driver 300 is configured to provide word line signals to the word lines of SRAM array 110, so that a selected row of SRAM cells in SRAM array 110 may be selected or deselected for a read or write operation.\",\n \"For example, when a specific row of SRAM array 110 is selected for a read or write operation, word line driver 300 may supply a positive voltage to the word line of the respective row in order to select the row.\",\n \"Conversely, when a specific row of SRAM array 110 is not selected for the read or write operation, word line driver 300 may supply a low voltage (such as the electrical ground voltage) to the word line of the respective row in order to deselect the row.\",\n \"Word line driver 300 is electrically coupled to SRAM cells in SRAM array 110 through metal lines that are formed in the metallization layers of the respective chips, wherein the metal lines include, and are not limited to, word lines (not shown).\",\n \"The word lines may have lengthwise directions parallel to the +Y/−Y directions.\",\n \"FIG.\",\n \"1 also schematically illustrates a plurality of gate electrodes 112, 212, and 312, which include active gate electrodes of transistors and dummy gate electrodes that do not form the gate electrodes of any transistor.\",\n \"In accordance with some embodiments of the present disclosure, gate electrodes 112, 212, and 312 are formed of polysilicon.\",\n \"In accordance with alternative embodiments, gate electrodes 112, 212, and 312 are formed of other conductive materials such as metal or metal alloy, metal silicide, metal nitride, or the like.\",\n \"Furthermore, some parts of the gate electrodes 112, 212, and 312 may be formed of polysilicon, while some other parts of the gate electrodes 112, 212, and 312 are replacement gates, wherein metals are used to replace the polysilicon.\",\n \"It is appreciated that FIG.\",\n \"1 illustrates the likely positions of gate electrodes 112, 212, and 312.To form functional circuits, the illustrated continuous gate electrodes 112, 212, and 312, which are illustrated as extending continuously throughout regions 100, 200, and 300, may actually be cut apart into shorter pieces.\",\n \"For example, as shown in FIG.\",\n \"3, gate electrodes 112 of the transistors in SRAM cell 102 have breaks therebetween, so that the gate electrodes of different transistors may be electrically decoupled from each other when needed.\",\n \"Otherwise, the gate electrode of pass-gate transistor PG-1 will be undesirably connected to the gate electrodes of pull-up transistor PU-2 and pull-down transistor PD-2, and the gate electrode of pass-gate transistor PG-2 will be undesirably connected to the gate electrodes of pull-up transistor PU-1 and pull-down transistor PD-1, hence causing circuit failure.\",\n \"For simplicity, in FIG.\",\n \"1 and the subsequent figures, the breaks for breaking gate electrodes 112 are not illustrated, while they may exist.\",\n \"Similarly, gate electrodes 212 and 312 may also be broken into shorter pieces to form functional circuits in regions 200 and 300.The gate electrodes that are broken into pieces, however, are allocated at the positions as illustrated in Figures of the present disclosure.\",\n \"In the design and manufacturing process of the illustrated circuits on physical wafers, gate electrodes 112, 212, and 312 may be initially formed as long and continuous strips as illustrated in FIG.\",\n \"1, and then etched (cut) into shorter pieces as needed in subsequent processes.\",\n \"SRAM array 110 and SRAM edge cell region 100 have gate electrodes 112, which have a uniform pitch P1.Alternatively stated, all gate electrodes 112 of SRAM array 110 and SRAM edge cell region 100 may have an equal spacing and an equal width.\",\n \"Gate electrodes 112 may have same or different lengths, and extend into various regions.\",\n \"For example, some, but not all, gate electrodes 112 (such as 112′) may continuously extend from edge 100B to the opposite edge 100A of SRAM edge cell region 100, with no break therein.\",\n \"Some of gate electrodes 112 may continuously (physically) extend from SRAM array 110 into SRAM edge cell region 100.Some other electrodes 112 may have breaks in regions 100 and/or 110.In addition, if some strap cells are embedded in SRAM array 110, there may also be some gate electrodes 112 (schematically illustrated as 112″ as an example) that continuously extend from the SRAM edge cell region 100 on the left side of SRAM array 110 into SRAM array 110, and further into the SRAM edge cell region 100 on the right side of SRAM array 110, with no break in gate electrodes 112″.\",\n \"Clearly, those gate electrodes 112 that form the gate electrodes of the transistors in SRAM array 110 will have breaks therein.\",\n \"Word line driver 300 has gate electrodes 312, which also have uniform pitch P1.The lengthwise directions of gate electrodes 312 are aligned to the respective lengthwise directions of gate electrodes 112.Furthermore, the spacings and the widths of gate electrodes 312 may also be the same as the corresponding ones of gate electrodes 112.SRAM edge cell region 100 abuts word line driver 300, with no spacing separates them from each other.\",\n \"Accordingly, gate electrodes 112 and 312 may include various connecting schemes.\",\n \"For example, some of gate electrodes 112 may continuously extend into word line driver 300 and hence are physically connected to the respective gate electrodes 312.Some of gate electrodes 312 may be physically connected to the gate electrodes 112 that continuously extend into SRAM edge cell 100.Some other gate electrodes 112 may be separate from the respective (aligning) gate electrodes 312 at the interface between SRAM edge cell region 100 and word line driver 300, as is shown in FIG.\",\n \"8.Furthermore, some gate electrodes such 112′ are also connected to the gate electrodes 312 that extend from edge 300B to the opposite edge 300A.\",\n \"Accordingly, these gate electrodes 112′ may penetrate through both regions 100 and 300.IO block 200 has gate electrodes 212, which have uniform pitch P2.In accordance with some embodiments of the present disclosure, uniform pitch P2 is equal to uniform pitch P1.In accordance with alternative embodiments, uniform pitch P2 is different from pitch P1.Also, the boundary gate electrode 112 and the boundary gate electrodes 212 that are immediately neighboring each other has a spacing equal to the spacings of gate electrodes 112 and/or the spacings of gate electrodes 212.Alternatively stated, the boundary gate electrode 112B and its immediate neighboring boundary gate electrode 212B also have the pitch (marked as P1/P2) equal to pitch P1 or pitch P2, which may be equal to, or different from, each other.\",\n \"Accordingly, SRAM edge cell region 100 abuts IO block 200, with no spacing separating them from each other.\",\n \"FIG.\",\n \"2 illustrates an exemplary top view of SRAM array 110, which includes SRAM cells 102 arranged as a plurality of rows and columns.\",\n \"FIG.\",\n \"3 illustrates a part of the layout of an exemplary SRAM cell 102.It is appreciated that SRAM cells 102 may adopt many different designs, including and not limited to, six-transistor SRAM cell, eight-transistor SRAM cell, ten-transistor SRAM cell, single port SRAM cell, two port SRAM cell, dual-port SRAM cell, etc.\",\n \"In accordance with some embodiments of the present disclosure, SRAM cell 102 includes pass-gate transistors PG-1 and PG-2, pull-up transistors PU-1 and PU-2, and pull-down transistors PD-1 and PD-2, wherein pull-up transistors PU-1 and PU-2 and pull-down transistors PD-1 and PD-2 are connected to form a latch storing a bit.\",\n \"Gate electrodes 112 extend in the X direction, while active regions (which may be semiconductor fins) 114 extending in the Y direction.\",\n \"As shown in FIG.\",\n \"2, gate electrodes 112 are broken into short pieces, while the positions of the broken gate electrodes 112 are aligned to the positions of gate electrodes 112 as shown in FIG.\",\n \"1, wherein all gate electrodes 112 throughout SRAM array 110 and edge cell region 100 have uniform pitch P1.Referring back to FIG.\",\n \"2, SRAM cells 102 may have structures identical to each other (while some SRAM cells 102 may be mirrored/flipped from others).\",\n \"The edges of SRAM array 110 are defined by the outmost edges of the edge SRAM cells.\",\n \"For example, left edge 110B is defined by the left edges of the left-most SRAM cells 102, and right edge 110A is defined by the right edges of the right-most SRAM cells 102.In accordance with some exemplary embodiments of the present disclosure, the entire SRAM array 110 is occupied by SRAM cells 102, with no strap cells therein.\",\n \"In accordance with alternative embodiments, strap cells are placed in SRAM array 110.The strap cells may be essentially the same as edge cell 104 as shown in FIG.\",\n \"5.In accordance with some exemplary embodiments, a row of strap cells may be placed every 4 rows, 8 rows, or more rows of SRAM cells 102.The strap cells in SRAM array 110 may be used for well pickup, for running metal lines that don't fit into SRAM cells 102, which metal lines may include power mesh (such as for VDD and VSS power mesh).\",\n \"FIG.\",\n \"4 illustrates an exemplary top view of SRAM edge cell region 100, which includes SRAM edge cells 104 abutting (and possibly surrounding) SRAM array 110.Edge cells 104 may be used for various purposes such as forming well pickup regions for the p-well regions and n-well regions, on which the transistors of SRAM cells 102 (FIG.\",\n \"2) are formed.\",\n \"Edge cells 104 may not include any active device such as transistor and diode.\",\n \"For example, FIG.\",\n \"5 illustrates an exemplary edge cell 104, which includes well pickup regions 106 for the pickup of p-well regions (for example, the p-well region in FIG.\",\n \"3), and well pickup region(s) 108 for the pickup of n-well regions.\",\n \"Well pickup regions 106 and 108 are heavily doped active regions (which may be semiconductor fins).\",\n \"The well pickup regions of n-well regions are heavily doped n-type regions, while the well pickup regions of p-well regions are heavily doped p-type regions.\",\n \"In accordance with some embodiments, assuming the edge cell 104 shown in FIG.\",\n \"5 is in a same column as the SRAM cell 102 as shown in FIG.\",\n \"3, the left P-well region in FIG.\",\n \"5 may be connected to the left P-well region in FIG.\",\n \"3 as a continuous P-well region, and hence the well pickup region 106 (marked as 106A) is used for picking up the left P-well region of the SRAM cell 102 shown in FIG.\",\n \"3.Similarly, the N-well region in FIG.\",\n \"5 may be connected to the N-well region in FIG.\",\n \"3 as a continuous N-well region, and hence the well pickup region 108 is used for picking up the N-well region of the SRAM cell 102 in FIG.\",\n \"3.FIG.\",\n \"5 also illustrates exemplary metal lines 116, which are in a metal layer.\",\n \"Depending on where the edge cell 104 is located, metal lines 116 may be word lines, bit lines, VDD lines, and/or VSS lines.\",\n \"The metal lines in edge cell 104 also include metal lines having lengthwise directions parallel to the X direction and metal lines (not shown) having lengthwise directions parallel to the Y direction, wherein the metal lines extending in different directions are allocated in different metal layers such as metal layer 1, metal layer 2, metal layer 3, etc..\",\n \"In accordance with some embodiments of the present disclosure, some or all of SRAM edge cells 104 aligned to the same row may have the same structure (which may be aligned to the same direction or mirrored) or different structures, and some or all of SRAM edge cells 104 aligned to the same column may have the same structure (which may be aligned to the same direction or mirrored) or different structures.\",\n \"FIG.\",\n \"6 illustrates a top view of a boundary region of SRAM edge cell region 100 and IO block 200 in accordance with some embodiments of the present disclosure, wherein the boundary region is schematically illustrated as region 500 in FIG.\",\n \"1.IO block 200 include transistor 214, which includes gate electrodes 212A and active region 214A.\",\n \"Active region 216A forms the channel and the (common) source/drain regions of transistor 214.Transistor 214 includes the boundary gate electrode 212B as its gate.\",\n \"Alternatively stated, transistor 214 includes the boundary gate electrode 212B that is closest to SRAM edge cells 104, with no additional gate electrode 212 between transistor 214 and edge cells 104.FIG.\",\n \"7 illustrates a top view of a boundary region of SRAM edge cell region 100 and IO block 200 in accordance with some embodiments of the present disclosure, wherein the boundary region may be region 500 in FIG.\",\n \"1.These embodiments are similar to the embodiments in FIG.\",\n \"6, except dummy gate electrode 212B is located between transistor 214 and SRAM edge cells 104.Dummy gate electrode 212B may be considered as a part of IO block 200.In accordance with some embodiments, dummy gate electrode 212B extends all the way from edge 200A to the opposite edge 200B of IO block 200, with no break in dummy gate electrode 212B.\",\n \"In accordance with some embodiments of the present disclosure, dummy gate electrode(s) 112′, which are parts of SRAM edge cells 104, also extend from edge 100A to the opposite edge 100B (FIG.\",\n \"1) of SRAM edge cell region 100.In accordance with alternative embodiments, gate electrode 112′ is broken into pieces.\",\n \"FIG.\",\n \"8 illustrates some details of the structure shown in FIG.\",\n \"1 in accordance with some embodiments, wherein gate electrodes 112 and 312 and the respective transistors are illustrated.\",\n \"In accordance with some embodiments of the present disclosure, gate electrodes 112 are separated from gate electrodes 312 by space 10.Space 10 is formed by cutting the otherwise connected gate electrodes 112 and 312, and hence is sometimes referred to as cut-poly 10.Space 10 extends from edge 100C to edge 100D of SRAM edge cell region 100.It is observed that since space 10 is formed by cutting the originally interconnected gate electrodes 112 and 312, gate electrodes 112 and 312 have lengthwise directions aligned to each other, and have the same width, the same spacing, and the same pitch.\",\n \"Word line driver 300 includes exemplary transistors 314A, 314B, and 314C.\",\n \"Various allocation schemes of gate electrodes 312 relative to space 10 may be adopted.\",\n \"For example, gate electrode 312A of transistor 314A may be spaced apart from space 10 by an additional space 14.Gate electrode 312B of transistor 314B may be spaced apart from space 10 by some discrete portions of dummy gate electrodes 312′.\",\n \"Gate electrode 312C of transistor 314B, on the other hand, may extend all the way to space 10.In accordance with some embodiments of the present disclosure, in addition to space 10, space 12 may also be formed in SRAM edge cells 104, and extend in the Y direction.\",\n \"Space 12 may also extend from edge 100C to edge 100D of SRAM edge cell region 100.FIG.\",\n \"9 illustrates some details of the structure shown in FIG.\",\n \"1 in accordance with some embodiments, wherein gate electrodes 112 and 312 and the respective transistors are illustrated.\",\n \"Some gate electrodes 112 and the respective aligned gate electrodes 312 may be connected to each other with no breaking.\",\n \"For example, the gate electrodes 312A of transistor 314A is connected to the respective gate electrodes 112A, wherein a break occurs inside edge cell region 100 in order to separate the gate electrode 312A from the rest of gate electrodes 112A.\",\n \"On the other hand, break 320 is formed to separate the gate electrodes of transistor 314B from gate electrode portions 312D.\",\n \"In accordance with some embodiments, some gate electrodes 314D and the respective connecting gate electrodes 112 form continuous gate electrodes that continuously extend from word line driver 300 all the way to SRAM array 110, as shown in FIG.\",\n \"9.FIG.\",\n \"10 illustrates an exemplary top view of SRAM array 110, IO block 200, and word line driver 300 in accordance with some embodiments.\",\n \"These embodiments are similar to the embodiments shown in FIG.\",\n \"1, except no SRAM edge cell region is formed.\",\n \"Rather, SRAM array 110 abuts IO block 200 and word line driver 300.The details of gate electrodes 112, 212, and 312 are essentially the same as in the embodiments shown in FIGS.\",\n \"1 through 9 (when applicable), and hence are not repeated herein.\",\n \"In accordance with some embodiments, some gate electrodes 312 are continuously connected to some gate electrodes 112 (referring to FIG.\",\n \"3) in SRAM cells 102.Furthermore, the boundary gate electrode 112 (neighboring IO block 200) are used to form the gate electrodes of the transistors (refer to FIG.\",\n \"3) in SRAM cells.\",\n \"In accordance with some embodiments, strap cells are formed between the rows and/or columns of the SRAM cells in SRAM array 110, and may be formed every repeated number of rows and/or columns.\",\n \"The embodiments of the present disclosure have some advantageous features.\",\n \"By abutting SRAM cell edge region 100 (or SRAM array 110) to word line driver 300 and IO block 200, the spaces between these regions, which spaces are adopted in conventional SRAM circuitry, are eliminated, and hence the chip area occupied by the entire SRAM circuity is reduced.\",\n \"In addition, by forming gate electrodes in regions/circuits 100, 200, and 300 to have a uniform pitch, the pattern-loading effect in the formation of gate electrodes is reduced, resulting in an SRAM circuitry with more uniform performance.\",\n \"In accordance with some embodiments of the present disclosure, a device includes an SRAM array, and an SRAM cell edge region abutting the SRAM array.\",\n \"The SRAM array and the SRAM cell edge region in combination include first gate electrodes having a uniform pitch.\",\n \"A word line driver abuts the SRAM cell edge region.\",\n \"The word line driver includes second gate electrodes, and the first gate electrodes have lengthwise directions aligned to lengthwise directions of respective ones of the second gate electrodes.\",\n \"In accordance with some embodiments of the present disclosure, a device includes an SRAM array including a plurality of SRAM cells.\",\n \"An SRAM cell edge region abuts the SRAM array.\",\n \"The SRAM array and the SRAM cell edge region in combination have first gate electrodes having a uniform pitch.\",\n \"The first gate electrodes have a first boundary gate electrode.\",\n \"An IO block includes second gate electrodes parallel to the first gate electrodes and having the uniform pitch.\",\n \"The second gate electrodes include a second boundary gate electrode immediately neighboring the first boundary gate electrode, and the first boundary gate electrode and the second boundary gate electrode have a pitch equal to the uniform pitch.\",\n \"In accordance with some embodiments of the present disclosure, a device includes an SRAM array including first gate electrodes having a uniform pitch.\",\n \"The first gate electrodes have a first boundary gate electrode.\",\n \"A word line driver abuts the SRAM cell edge region.\",\n \"The word line driver includes second gate electrodes, and the first gate electrodes have lengthwise directions aligned to lengthwise directions of respective ones of the second gate electrodes.\",\n \"An IO block includes third gate electrodes parallel to the first gate electrodes and having the uniform pitch.\",\n \"The third gate electrodes include a second boundary gate electrode immediately neighboring the first boundary gate electrode.\",\n \"A pitch of the first boundary gate electrode and the second boundary gate electrode is equal to a pitch of two neighboring ones of the first gate electrodes.\",\n \"The foregoing outlines features of several embodiments so that those skilled in the art may better understand the aspects of the present disclosure.\",\n \"Those skilled in the art should appreciate that they may readily use the present disclosure as a basis for designing or modifying other processes and structures for carrying out the same purposes and/or achieving the same advantages of the embodiments introduced herein.\",\n \"Those skilled in the art should also realize that such equivalent constructions do not depart from the spirit and scope of the present disclosure, and that they may make various changes, substitutions, and alterations herein without departing from the spirit and scope of the present disclosure.\"\n ]\n]"},"source":{"kind":"string","value":"Patent_15871450"}}}],"truncated":false,"partial":false},"paginationData":{"pageIndex":44937,"numItemsPerPage":100,"numTotalItems":4495096,"offset":4493700,"length":100}},"jwt":"eyJhbGciOiJFZERTQSJ9.eyJyZWFkIjp0cnVlLCJwZXJtaXNzaW9ucyI6eyJyZXBvLmNvbnRlbnQucmVhZCI6dHJ1ZX0sImlhdCI6MTc1Mzc4MjM1Niwic3ViIjoiL2RhdGFzZXRzL2hvd2V5L2h1cGQiLCJleHAiOjE3NTM3ODU5NTYsImlzcyI6Imh0dHBzOi8vaHVnZ2luZ2ZhY2UuY28ifQ.msqdGFOItDJqndiJgkP-arh3yQFDRnnJYj3eeDncLKc6n8oXOGD0pF7BaP3L4JnXmwY1aKHLfMp_Ki-paW2TCQ","displayUrls":true},"discussionsStats":{"closed":0,"open":0,"total":0},"fullWidth":true,"hasGatedAccess":true,"hasFullAccess":true,"isEmbedded":false,"savedQueries":{"community":[],"user":[]}}">
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[
[
"SEED DELIVERY APPARATUS, SYSTEMS, AND METHODS",
"A seed delivery apparatus and methods in which a seed conveyor delivers seed from a metering device to a trench in a controlled manner to maintain seed placement accuracy within the trench."
],
[
"1.A seed delivery apparatus, comprising: a seed meter configured to entrain seeds on a seed disc and to release said entrained seeds at a seed release location; and a seed conveyor assembly having an upper end disposed to receive the released seed, said seed conveyor assembly including: a seed conveyor having an inner surface and an outer surface, said inner surface having a plurality of inwardly projecting spaced teeth defining sequential belt gaps, said outer surface having a plurality of outwardly projecting spaced flights defining sequential flight gaps which receive the released seed; an upper pulley having a first set of radially arranged pulley teeth and a second set of radially arranged pulley teeth angularly offset from said first set of radially arranged pulley teeth, each of said first and second set of radially arranged pulley teeth alternatingly engaging said sequential belt gaps; and a cleaning strip disposed adjacent to said upper pulley to clean debris from said upper pulley.",
"2.The seed delivery apparatus of claim 1, wherein said first set of pulley teeth and said second set of pulley teeth are laterally offset by a rim.",
"3.The seed delivery apparatus of claim 2, wherein said inner surface of said seed conveyor includes a slot which receives said rim.",
"4.The seed delivery apparatus of claim 1, wherein said cleaning strip extends arcuately forwardly along a direction of rotation of said upper pulley.",
"5.The seed delivery apparatus of claim 1, further comprising: an agitation strip disposed to agitate seeds conveyed by said conveyor.",
"6.The seed delivery apparatus of claim 1, further comprising: a loading wheel disposed to introduce said released seeds into said flight gaps of said conveyor.",
"7.The seed delivery apparatus of claim 1 further comprising: a seed guide disposed to guide said released seeds introduced by said loading wheel into said flight gaps of said seed conveyor, wherein said seed guide includes a relief portion and an introduction portion.",
"8.The seed delivery apparatus of claim 7, wherein said relief portion is disposed radially farther from the upper pulley than the introduction portion.",
"9.The seed delivery apparatus of claim 7, wherein said relief portion extends arcuately along a path substantially parallel to the path of said flights passing said relief portion.",
"10.The seed delivery apparatus of claim 7, wherein said introduction portion urges said seeds in a direction toward said conveyor and into one of said flight gaps.",
"11.The seed delivery apparatus of claim 6, wherein said loading wheel comprises a plurality of radial fingers.",
"12.The seed delivery apparatus of claim 11, wherein said fingers have a sinusoidal configuration.",
"13.The seed delivery apparatus of claim 1, further comprising: a seed sensor configured to detect said entrained seeds before said seed release location."
],
[
"<SOH> BACKGROUND <EOH>In recent years, the agricultural industry has recognized the need to perform planting operations more quickly due to the limited time during which such planting operations are agronomically preferable or (in some growing seasons) even possible due to inclement weather.",
"However, drawing a planting implement through the field at faster speeds increases the speed of deposited seeds relative to the ground, causing seeds to roll and bounce upon landing in the trench and resulting in inconsistent plant spacing.",
"The adverse agronomic effects of poor seed placement and inconsistent plant spacing are well known in the art.",
"As such, there is a need for apparatus, systems and methods of effectively delivering seed to the trench while maintaining seed placement accuracy at both low and high implement speeds."
],
[
"<SOH> BRIEF DESCRIPTION OF THE DRAWINGS <EOH>FIG.",
"1 is a side elevation view of a prior art row unit of an agricultural row crop planter.",
"FIG.",
"2 is a side elevation view of an embodiment of a seed conveyor in cooperation with a seed disc.",
"FIG.",
"3 is a partial side elevation view of an embodiment of a seed conveyor in cooperation with a seed disc.",
"FIG.",
"4 is a partial side elevation view of an embodiment of a seed conveyor depositing seeds in a seed trench.",
"FIG.",
"5 is a schematic illustration of an embodiment of a seed conveyor control system.",
"FIG.",
"6 illustrates an embodiment of a seed conveyor control system.",
"FIG.",
"7 illustrates an embodiment of a process for controlling a seed conveyor.",
"FIG.",
"8 is a side elevation view of an embodiment of a planter row unit in cooperation with an embodiment of a seed conveyor.",
"FIG.",
"9 is a side elevation view of another embodiment of a seed conveyor.",
"FIG.",
"10 is a perspective view of the seed conveyor of FIG.",
"9 .",
"FIG.",
"11 is a perspective view of an embodiment of a pulley.",
"FIG.",
"12 is a side elevation view of the pulley of FIG.",
"11 .",
"FIG.",
"13 is a front elevation view of the pulley of FIG.",
"11 .",
"FIG.",
"14 is a side elevation view of another embodiment of a seed conveyor showing an alternative embodiment loading wheel with sinusoidal fingers.",
"FIG.",
"15 is a perspective view of the loading wheel with sinusoidal fingers of FIG.",
"14 .",
"FIG.",
"16 is an elevation view of an embodiment of a seed sensor.",
"detailed-description description=\"Detailed Description\" end=\"lead\"?"
],
[
"BACKGROUND In recent years, the agricultural industry has recognized the need to perform planting operations more quickly due to the limited time during which such planting operations are agronomically preferable or (in some growing seasons) even possible due to inclement weather.",
"However, drawing a planting implement through the field at faster speeds increases the speed of deposited seeds relative to the ground, causing seeds to roll and bounce upon landing in the trench and resulting in inconsistent plant spacing.",
"The adverse agronomic effects of poor seed placement and inconsistent plant spacing are well known in the art.",
"As such, there is a need for apparatus, systems and methods of effectively delivering seed to the trench while maintaining seed placement accuracy at both low and high implement speeds.",
"BRIEF DESCRIPTION OF THE DRAWINGS FIG.",
"1 is a side elevation view of a prior art row unit of an agricultural row crop planter.",
"FIG.",
"2 is a side elevation view of an embodiment of a seed conveyor in cooperation with a seed disc.",
"FIG.",
"3 is a partial side elevation view of an embodiment of a seed conveyor in cooperation with a seed disc.",
"FIG.",
"4 is a partial side elevation view of an embodiment of a seed conveyor depositing seeds in a seed trench.",
"FIG.",
"5 is a schematic illustration of an embodiment of a seed conveyor control system.",
"FIG.",
"6 illustrates an embodiment of a seed conveyor control system.",
"FIG.",
"7 illustrates an embodiment of a process for controlling a seed conveyor.",
"FIG.",
"8 is a side elevation view of an embodiment of a planter row unit in cooperation with an embodiment of a seed conveyor.",
"FIG.",
"9 is a side elevation view of another embodiment of a seed conveyor.",
"FIG.",
"10 is a perspective view of the seed conveyor of FIG.",
"9.FIG.",
"11 is a perspective view of an embodiment of a pulley.",
"FIG.",
"12 is a side elevation view of the pulley of FIG.",
"11.FIG.",
"13 is a front elevation view of the pulley of FIG.",
"11.FIG.",
"14 is a side elevation view of another embodiment of a seed conveyor showing an alternative embodiment loading wheel with sinusoidal fingers.",
"FIG.",
"15 is a perspective view of the loading wheel with sinusoidal fingers of FIG.",
"14.FIG.",
"16 is an elevation view of an embodiment of a seed sensor.",
"DESCRIPTION Referring now to the drawings, wherein like reference numerals designate identical or corresponding parts throughout the several views, FIG.",
"1 illustrates a side elevation view of a single row unit 10 of a conventional row crop planter such as the type disclosed in U.S. Pat.",
"No.",
"7,438,006, the disclosure of which is hereby incorporated herein in its entirety by reference.",
"As is well known in the art, the row units 10 are mounted in spaced relation along the length of a transverse toolbar 12 by a parallel linkage 14, comprised of upper and lower parallel arms 16, 18 pivotally mounted at their forward ends to the transverse toolbar 12 and at their rearward end to the row unit frame 20.The parallel linkage 14 permits each row unit 10 to move vertically independently of the toolbar 12 and the other spaced row units in order to accommodate changes in terrain or rocks or other obstructions encountered by the row unit as the planter is drawn through the field.",
"The row unit frame 20 operably supports a seed hopper 23, which may be adapted to receive seed from a bulk hopper (not shown), a seed meter 26, and a seed tube 28, as well as a seed trench or seed furrow opener assembly 30, and trench or furrow closing assembly 40.The trench opener assembly 30 comprises a pair of trench opener discs 32 and a pair of gauge wheels 34.The gauge wheels 34 are pivotally secured to the row unit frame 20 by gauge wheel arms 36.A coil spring 49 is disposed between the parallel arms 16, 18 to provide supplemental downforce to ensure that the trench opener discs 32 fully penetrate the soil to the desired depth as set by a depth adjusting member (not shown) and to provide soil compaction for proper trench formation.",
"Rather than a coil spring, supplemental downforce may be provided by actuators or other suitable means such as disclosed in U.S. Pat.",
"No.",
"6,389,999 to Duello, the entire disclosure of which is hereby incorporated herein by reference.",
"In operation, as the row unit 10 is lowered to the planting position, the opener discs 32 penetrate into the soil.",
"At the same time, the soil forces the gauge wheels 34 to pivot upwardly until the gauge wheel arms 36 abut or come into contact with the stop position previously set with the trench depth adjusting member (not shown) or until a static load balance is achieved between the vertical load of the row unit and the reaction of the soil.",
"As the planter is drawn forwardly in the direction indicated by arrow 39, the trench opener discs cut a V-shaped trench or furrow 60 into the soil while the gauge wheels 34 compact the soil to aid in formation of the V-shaped trench.",
"Individual seeds 62 from the seed hopper 23 are dispensed by the seed meter 26 into an upper opening in the seed tube 28 in uniformly spaced increments.",
"As seeds 62 fall through the seed tube 28, the seeds move downwardly and rearwardly between the trench opener discs 32 and into the bottom of the V-shaped trench 60.The trench 60 is then covered with soil and lightly compacted by the trench closing assembly 40.It should be appreciated that because seeds 62 fall freely through the seed tube 28 in the row unit 10 described above, the path of travel of the seeds and the velocity of the seeds at the exit of the seed tube are relatively unconstrained.",
"It would be preferable to constrain the path of travel of seeds 62 in order to reduce errors in spacing between seeds; i.e., placing seeds in the field at non-uniform spacing.",
"Additionally, it would be preferable to control the velocity of seeds 62 such that the seeds have a decreased horizontal velocity relative to the ground upon landing in the trench 60.A seed conveyor 100 is illustrated in FIG.",
"2.The seed conveyor 100 includes a belt 140 disposed around upper and lower pulleys 152,154 and preferably driven by the upper pulley 152; in other embodiments the seed conveyor may be driven by the lower pulley 154.The belt 140 includes flights 142.The seed conveyor 100 additionally includes a guide surface 110 disposed adjacent to the flights 142 on one side of the seed conveyor.",
"The seed conveyor 100 preferably includes a backing plate 130 disposed to maintain the position of belt 140.In operation, the seed conveyor 100 receives seeds 62 from a seed disc 51 and conveys them to an exit 164.The seed disc 51 is preferably housed in a seed meter 26 similar to that illustrated in FIG.",
"1 and rotates in a direction indicated by arrow 56 about a shaft 54 rotatably mounted in the seed meter.",
"Turning to FIG.",
"3, the seed meter 26 is preferably of the vacuum type as is known in the art, such that a vacuum source (not shown) creates a vacuum behind the seed disc 51 (as viewed in FIG.",
"3), thus creating a pressure differential across apertures 52 in the disc.",
"As the apertures 52 rotate past a pool of seeds in the location generally indicated by reference numeral 58, the pressure differential causes individual seeds 62 to become entrained on each aperture 52 such that the seeds are carried by the disc as illustrated.",
"As the apertures cross a boundary such as axis 196, preferably at approximately the 3 o'clock position of the seed disc 51, the vacuum source is substantially cut off (e.g., by termination of a vacuum seal as is known in the art) such that the seeds 62 are released from the disc as they cross axis 196.Seeds 62 preferably fall from the disc in a substantially vertical fashion along an axis 192.Guide surface 110 includes an angled portion 112, along which each seed 62 slides downward and rearward before passing between two flights 142 at a seed inlet generally indicated by reference numeral 162.Each seed 62 is then conveyed downward by seed conveyor 100.The belt 142 is preferably driven at a speed proportional to the groundspeed of the row unit 10 designated by reference “St” (FIG.",
"4).",
"For example, in some embodiments the seed conveyor 100 is driven such that the linear speed of belt 142 at the bottom of the lower pulley 154 is approximately equal to the groundspeed St. As illustrated in FIG.",
"3, each seed 62 is initially accelerated downward by the flight 142 above the seed.",
"Turning to FIG.",
"4, as each seed 62 moves downward along the seed conveyor 100, it may fall away from the flight 142 above it.",
"However, as each seed 62 nears the bottom of the seed conveyor, the flights 142 accelerate in order to travel around lower pulley 154 such that the flights 142 contact the seed and impart a rearward horizontal velocity to the seed.",
"Additionally, an angled portion 114 of the guide surface 110 guides the seed rearward, imparting a rearward horizontal velocity to the seed.",
"Thus, as the seed 62 exits the seed conveyor at a seed exit generally indicated by reference numeral 164, the seed has a downward vertical velocity component Vy and a horizontal velocity component Vx, the magnitude of which is less than the speed of travel St of the row unit 10.It should be appreciated that a smaller horizontal velocity component Vx is preferable because the seed 62 will experience less fore-aft roll as it lands in the trench 60, leading to more uniform seed placement.",
"The angled portion 114 preferably is disposed 20 degrees below horizontal.",
"Returning to FIG.",
"3, it should be appreciated that flights 142 travel faster as they travel around the upper end of upper pulley 152, e.g., above an axis 194.Additionally, the flights 142 have a substantial horizontal velocity component above axis 194.As a result, attempting to introduce seeds 62 between the flights above axis 194 may result in seeds being knocked away from the belt 140.Thus, the seed inlet 162 at which seeds 62 pass between flights 142 is preferably below the axis 194.This result is preferably accomplished by positioning of the axis 196 at which seeds are released from the disc 51 below the axis 194 and/or by configuring angled portion 112 of guide surface such that seeds 62 slide below axis 194 before entering the inlet 162.Turning to the embodiment of FIG.",
"8, a seed conveyor 100 is illustrated in cooperation with a row unit 10.The row unit 10 includes a shank portion 35.The seed conveyor 100 is mounted to the shank portion 35 by attachment ears 106,108.Conveyor Control Systems and Methods A control system 1000 for controlling and monitoring the seed conveyor 100 as well as any other seed conveyor embodiment disclosed herein is illustrated schematically in FIG.",
"5.The control system 1000 includes a planter monitor 1005.The planter monitor 1005 preferably includes a CPU and user interface, and may comprise a monitor such as that disclosed in Applicant's U.S. Pat.",
"No.",
"8,078,367.The planter monitor 1005 is preferably in electrical communication with a seed conveyor motor 1020.The seed conveyor motor 1020 is operably coupled to the seed conveyor 100 to drive the seed conveyor.",
"For example, in some embodiments the seed conveyor motor 1020 includes a driven output shaft mechanically coupled to a central shaft of the upper pulley 154 or the lower pulley 152.The seed conveyor 1020 preferably includes an encoder (e.g., a hall-effect sensor) for sensing the rotational speed of the conveyor 100.The planter monitor 1005 is preferably in electrical communication with a meter drive motor 27.The meter drive motor 27 may comprise any apparatus known in the art for driving seed meters at a desired speed such as a hydraulic drive or electric drive.",
"As an example, the meter drive motor 27 may comprise an electric motor mounted on or near the seed meter 26, the electric motor having an output shaft operably coupled to the shaft 54 of the seed meter; in such an embodiment, the meter drive motor 27 preferably includes an encoder (e.g., a hall-effect sensor) for sensing the rotational speed of meter 50.The planter monitor 1005 is also preferably in electrical communication with a speed source 1010.The speed source may comprise a GPS system, a radar speed sensor, or a wheel speed sensor.",
"The planter monitor may choose between multiple speed sources by predicting reliability as disclosed in Applicant's International Patent Publication No.",
"WO2012/015,957, incorporated herein in its entirety by reference.",
"Continuing to refer to FIG.",
"5, the planter monitor is preferably in electrical communication with one or more seed sensors adapted for mounting to the seed conveyor 100.The seed sensors may comprise one or more seed sensors.",
"The seed sensors may also be in electrical communication with the meter drive motor 27 and the seed conveyor motor 1020.FIG.",
"16 shows an embodiment of a seed sensor 1600 comprising a plurality of transmitters 1610-1, 1610-2, and 1610-3 transmitting to an associated plurality of receivers 1620-1, 1620-2, and 1620-3.To determine whether there is a seed 62 in seed aperture 52, the signals received at the plurality of receivers can be averaged.",
"Alternatively, the percent transmittance between each pair of transmitter and receiver can be measured and then weighted based on the percent transmittance and then the weighted results can be averaged.",
"This can be useful when a seed is oriented in seed aperture 52 such that the seed 62 does not obstruct all of the plurality of transmitters 1610-1, 1610-2, and 1610-3 and receivers 1620-1, 1620-2, and 1620-3 at the same time.",
"Having a plurality of sensors allows for better determination of whether there is a seed 62 in seed aperture 52.Turning to FIG.",
"6, one embodiment of a planter monitor control system 1000 is illustrated.",
"The planter monitor control system 1000 of FIG.",
"6 includes a seed sensor 550 mounted to the sidewalls of the seed conveyor 100.The meter drive motor 27 in the planter monitor control system 1000 of FIG.",
"6 comprises an electric drive.",
"The speed St of seed conveyor 100 is generally to the left along the perspective of FIG.",
"6 and has a magnitude which varies with the speed and direction of the planting implement.",
"A process 1100 for controlling the rotational speed of the seed conveyor 100 is illustrated in FIG.",
"7.At block 1102 the planter monitor 1005 obtains a speed of the planting implement from the speed source 1010.At block 1103, the planter monitor 1005 preferably obtains the current commanded planting population (i.e., the number of desired seeds planted per acre) from a memory contained within the planter monitor 1005.At block 1105, the planter monitor 1005 preferably commands a rotational speed of meter 50 based on the desired population and the current implement speed.",
"Continuing to refer to FIG.",
"7, at block 1110, the planter monitor 1005 preferably determines an operating speed of the seed conveyor 100.This step may be accomplished using a Hall-effect or other sensor adapted to measure the driving speed of the electric motor or the rotational speed of the driven shaft of the seed conveyor 100.This step may also be accomplished by measuring the time between flights 142 passing the seed sensor 550.It should be appreciated in light of the instant disclosure that step of block 1110 does not require measuring an actual operational speed but may comprise measuring a criterion related to the operational speed.",
"Continuing to refer to FIG.",
"7, at block 1500 the planter monitor 1005 preferably determines the ground speed St of the seed conveyor 100.In some embodiments, this step may be accomplished by assuming that the tractor or implement speed reported by the speed source 1010 is equal to the ground speed St of the seed conveyor 100.Such a method is accurate when the tractor and toolbar 12 are not turning, but becomes inaccurate when the tractor and toolbar 12 are turning.",
"In other embodiments the step of block 1500 may be performed more accurately by determining the local ground speed St of each conveyor 100 along the toolbar 12.Such embodiments are described herein in the section entitled “Conveyor Ground Speed Determination.” Continuing to refer to FIG.",
"7 and process 1100, at block 1117 the planter monitor 1005 preferably determines a conveyor motor speed command, e.g., using a calibration curve.",
"The calibration curve preferably relates the ground speed St to a desired operational speed So.",
"It should be appreciated in light of the instant disclosure that the calibration curve could also relate a criterion related to ground speed (such as a measured voltage or commanded voltage) to a criterion related to a desired conveyor speed (such as a measured voltage or commanded voltage).",
"Continuing to refer to FIG.",
"7 and the process 1100, at block 1120 the planter monitor 1005 preferably commands the new desired conveyor speed.",
"It should be appreciated in light of the instant disclosure that the change in conveyor speed command may be deferred until the actual conveyor speed is outside of a preferred range, e.g.",
"5%, with respect to the desired conveyor speed.",
"Turning to FIGS.",
"9-10, another embodiment of a seed conveyor assembly 900 is illustrated.",
"As with the loading conveyor embodiments disclosed in Applicant's International Patent Publication No.",
"WO2013/049198, hereby incorporated by reference herein in its entirety, loading wheels 910, 920 are driven in opposing directions in order to grasp seeds from the seed disc of the seed meter and eject the seeds between flights 932 of a conveyor 930 (e.g., an endless conveyor) housed within a housing 980.In the illustrated embodiment, the conveyor 930 comprises a flighted belt as illustrated in FIGS.",
"9-10.In other embodiments, the conveyor 930 may comprise other structure suited to convey seeds from an upper to lower position such as a brush belt having a plurality of bristles for receiving seeds.",
"FIGS.",
"9 and 10 likewise illustrate an upper pulley 950 about which the conveyor 930 is driven in operation.",
"A cleaning strip 970 is preferably disposed adjacent (e.g., directly axially adjacent) to the upper pulley 950.The cleaning strip 970 preferably extends radially outwardly from the pulley 950.The cleaning strip 970 is preferably arcuate.",
"The cleaning strip 970 preferably extends arcuately forwardly along the direction of rotation of the pulley 950 (e.g., counter-clockwise on the view of FIG.",
"9).",
"An upper end of the cleaning strip 970 is preferably adjacent to a radially outer surface of a hub portion 959 (FIG.",
"11) of the pulley 950.In operation, mud or other debris is preferably scraped from the pulley 950 by contact with the cleaning strip 970 as the pulley rotates adjacent to the cleaning strip 970.Continuing to refer to FIGS.",
"9-10, an agitation strip 960 is illustrated.",
"The agitation strip 960 is preferably substantially parallel with (and preferably substantially flush with) an interior wall 982 of the housing 980.The agitation strip 960 preferably includes a plurality of agitation elements 962 which may be arranged in rows 964 (e.g., diagonally-oriented rows as illustrated in FIG.",
"10).",
"The agitation strip 960 is preferably disposed adjacent to a portion of the conveyor 930 in which seeds are conveyed, e.g., between an entry point at which seeds are introduced by the loading wheels 910, 920 and a release point at which seeds are released from the conveyor into a planting trench.",
"The agitation strip 960 is preferably disposed adjacent to a portion of the conveyor 930 in which seeds are conveyed prior to being sensed by a seed sensor, e.g., between the entry point at which seeds are introduced by the loading wheels 910, 920 and a sensing point at which seeds are detected by a seed sensor.",
"The agitation elements 962 preferably extend toward the conveyor 930.A distal end of each agitation element 962 is preferably directly adjacent to a distal end of the passing flights 932.In operation, a seed may occasionally become trapped between the distal end of a flight 932 and an interior wall 982 of the housing 980 after being introduced into the conveyor 930.As the trapped seed is dragged along the interior wall 982, the trapped seed is preferably moved toward and across the surface of the agitation strip 960.Upon making contact with the agitation elements of the agitation strip 960, the trapped seed is preferably agitated (e.g., vibrated, moved) and dislocated from between the flight 932 and the interior wall 982.After being dislocated from between the flight and the interior wall, a partially vertically upward force between the seed and one or more agitation elements preferably urges the seed into one of the flight gaps 933 between the flights of the conveyor 930, preferably the flight gap directly vertically above the flight that had trapped the seed.",
"The agitation strip 960 preferably comprises an elastic material (e.g., rubber, polyurethane).",
"The agitation strip 960 is preferably removable, preferably without the use of tools.",
"The agitation strip 960 may be replaced with a one of a plurality of replacement agitation strips.",
"Each replacement agitation strip may differ from the other replacement agitation strips in one or more of the following criteria: (1) agitation element height, (2) agitation element shape, (3) agitation element number, (4) configuration (e.g., pattern) of agitation elements, or (5) material type or properties (e.g., elasticity).",
"Referring to FIGS.",
"9-10, a seed guide 940 is illustrated having a relief portion 942 and an introduction portion 944.The relief portion 942 is preferably disposed radially farther from the pulley 950 (and preferably farther from the conveyor 930) than the introduction portion 944.The relief portion 942 is preferably arcuate, and preferably extends arcuately along a path substantially parallel to the path of a flight 932 passing the relief portion in operation of the conveyor 930.In operation, seeds may slide along the relief portion 942 before contacting the introduction portion 944.Upon contacting the introduction portion 944, the seed is preferably translated (e.g., bumped, urged, forced) in a direction toward the conveyor 930 and is preferably introduced into a flight gap 933 by contact with the introduction portion 944.Referring to FIGS.",
"9-13, an improved upper pulley 950 is illustrated in cooperation with the conveyor 930 for driving the conveyor in operation.",
"The pulley 950 preferably includes a first set of radially arranged pulley teeth 952-1 and a second set of radially arranged pulley teeth 952-2.The pulley teeth 952-1 are preferably separated by a pitch angle B (e.g., 60 degrees).",
"The pulley teeth 952-2 are preferably separated by the same pitch angle B (e.g., 60 degrees).",
"The first set of drive teeth 952-1 and the second set of drive teeth 952-2 are preferably offset from one another by an angular offset A.",
"The angular offset A is preferably one-half of the angular pitch B (e.g., 30 degrees).",
"The first and second sets of pulley teeth are preferably laterally offset by a rim 958.In operation, the pulley teeth 952 preferably engage belt gaps 934 disposed between belt teeth 936 to drive the conveyor 930 about the pulley 950.The belt gaps 934 are preferably spaced such that sequential belt gaps 934 along the conveyor 930 are alternatingly engaged by pulley teeth 952-1 and 952-2.For example, in one embodiment the following steps may take place in chronological order during operation: a first belt gap 934 is engaged by a first pulley tooth of the pulley tooth set 952-1, then a second belt gap 934 (e.g., the next belt gap following the first belt gap) is engaged by a first pulley tooth of the pulley tooth set 952-2, then a third belt gap 934 (e.g., the next belt gap following the second belt gap) is engaged by a second pulley tooth of the pulley tooth set 952-1, then a fourth belt gap 934 (e.g., the next belt gap following third belt gap) is engaged by a second pulley tooth of the pulley tooth set 952-2, and so-on.",
"In operation, pulley gaps 954-1 and 954-2 between the two sets of pulley teeth 952-1, 952-2 are similarly alternatingly engaged (e.g., non-drivingly engaged) by belt teeth 936.In operation, the rim 958 is preferably partially received in a longitudinal slot (not shown) provided along the inner side of the conveyor 930 a laterally central position along the length of the conveyor.",
"It should be appreciated that although the pattern of belt teeth 936 and belt gaps 934 are illustrated only along the right hand side of the conveyor 930 (see FIG.",
"9), in preferred embodiments this pattern continues along the length of the conveyor.",
"FIG.",
"14 is a side elevation view of another embodiment of a seed conveyor 900A which is substantially the same as in the previous embodiment of the seed conveyor 900 shown in FIG.",
"9, except that in the embodiment of FIG.",
"14, the seed conveyor 900A utilizes a loading wheel 910A having sinusoidal shaped fingers 911 as best shown in FIG.",
"15.The sinusoidal shape of the fingers 911 allows for more compression of the fingers 911 when there are larger seeds thereby minimizing potential clogging of the loading wheel 900A.",
"The foregoing disclosure is meant to be illustrative and is not intended to be exhaustive or limited to the embodiments, systems and methods described herein.",
"Many modifications and variations will be apparent to those of ordinary skill in the art without departing from the teachings provided.",
"It is intended that the foregoing disclosure, including the claims, be interpreted to embrace all such variations and modifications."
]
] |
Patent_15871048
|
[
[
"MONOMERIC AND OLIGOMERIC RESINS FOR ONE DROP FILL SEALANT APPLICATION",
"The present invention relates to curable novel resins and prepolymers, methods of manufacture and compositions made therefrom.",
"Particularly useful applications include one drop fill sealant used in liquid crystal assembly.",
"In particular, the inventive resins and prepolymers and compositions are useful in the assembly of LCD panels."
],
[
"1.A resin comprising the structure: Wherein Q may be selected from: Wherein: R is a multivalent hydrocarbyl linker selected from linear or branched alkyls, linear or branched cycloalkyls, alkylenes, cycloalkylenes, bicycloalkylenes, tricycloalkylenes, linear or branched alkylenes, linear or branched cycloalkylenes, linear or branched alkenylenes, arylenes, aralkylenes, arylbicycloalkylenes, aryltricycloalkylenes, bicycloalkylarylenes, tricycloalkylarylenes, bisphenylenes, cycloalkylarylenes, heterocycloalkylene or heterocycloarylenes; the alkyls, cycloalkyls, alkylenes, cycloalkylenes, alkenylenes, arylenes, aralkylenes, arylbicycloalkylenes, aryltricycloalkylenes, bicycloalkylarylenes, tricycloalkylarylenes, bisphenylenes, cycloalkylarylenes, heterocycloalkylene and heterocycloarylenes can optionally contain O or S or hydroxyl group; R1 is methyl or H; X is CH2, n, n1, n2, n3 are each independently 1-10; and Y is arylene, alkylene, alkenylene, aralkylene, cycloalkylene, bicycloalkylene or tricycloalkylene.",
"2.A resin comprising the structure: Wherein: R is a multivalent hydrocarbyl linker selected from linear or branched alkyls, linear or branched cycloalkyls, alkylenes, cycloalkylenes, bicycloalkylenes, tricycloalkylenes, linear or branched alkylenes, linear or branched cycloalkylenes, linear or branched alkenylenes, arylenes, aralkylenes, arylbicycloalkylenes, aryltricycloalkylenes, bicycloalkylarylenes, tricycloalkylarylenes, bisphenylenes, cycloalkylarylenes, heterocycloalkylene or heterocycloarylenes; the alkyls, cycloalkyls, alkylenes, cycloalkylenes, alkenylenes, arylenes, aralkylenes, arylbicycloalkylenes, aryltricycloalkylenes, bicycloalkylarylenes, tricycloalkylarylenes, bisphenylenes, cycloalkylarylenes, heterocycloalkylene and heterocycloarylenes can optionally contain O, S or hydroxyl group; R1 and R2 are independently methyl or H; n1 and n2 are each independently 1-10; and X1 and X2 are independently selected from CH2, wherein n3 is 1-10, Y is arylene, alkylene, alkenylene, aralkylene, cycloalkylene, bicycloalkylene or tricycloalkylene.",
"3.A resin comprising the structure: Wherein: X1 and X2 are 3-10 membered ring groups independently selected from functionalized or unfunctionalized alicyclic groups optionally having one or more heteroatoms; n is 1-10; R is a multivalent hydrocarbyl linker selected from linear or branched alkyls, linear or branched cycloalkyls, alkylenes, cycloalkylenes, bicycloalkylenes, tricycloalkylenes, linear or branched alkylenes, linear or branched cycloalkylenes, linear or branched alkenylenes, arylenes, aralkylenes, arylbicycloalkylenes, aryltricycloalkylenes, bicycloalkylarylenes, tricycloalkylarylenes, bisphenylenes, cycloalkylarylenes, heterocycloalkylene or heterocycloarylenes; the alkyls, cycloalkyls, alkylenes, cycloalkylenes, alkenylenes, arylenes, aralkylenes, arylbicycloalkylenes, aryltricycloalkylenes, bicycloalkylarylenes, tricycloalkylarylenes, bisphenylenes, cycloalkylarylenes, heterocycloalkylene and heterocycloarylenes can optionally contain O or S or hydroxyl group; and R is linked to the ring structures containing X1 and X2 at any position; X3 is a bond linking the methacrylate group to the ring X1, or wherein n3 is 1-10; and Y is arylene, alkylene, alkenylene, aralkylene, cycloalkylene, bicycloalkylene or tricycloalkylene; with the proviso that hydroxyl group on X1 ring is adjacent to the X3 group containing (meth)acrylate, and hydroxyl group on the X2 ring is adjacent to the maleimidoalkanoyl group, respectively.",
"4.A resin comprising the structure: Wherein: X1 and X2 are 3-10 membered ring groups independently selected from functionalized or unfunctionalized alicyclic groups optionally having one or more heteroatoms; R is a multivalent hydrocarbyl linker selected from linear or branched alkyls, linear or branched cycloalkyls, alkylenes, cycloalkylenes, bicycloalkylenes, tricycloalkylenes, linear or branched alkylenes, linear or branched cycloalkylenes, linear or branched alkenylenes, arylenes, aralkylenes, arylbicycloalkylenes, aryltricycloalkylenes, bicycloalkylarylenes, tricycloalkylarylenes, bisphenylenes, cycloalkylarylenes, heterocycloalkylene or heterocycloarylenes; the alkyls, cycloalkyls, alkylenes, cycloalkylenes, alkenylenes, arylenes, aralkylenes, arylbicycloalkylenes, aryltricycloalkylenes, bicycloalkylarylenes, tricycloalkylarylenes, bisphenylenes, cycloalkylarylenes, heterocycloalkylene and heterocycloarylenes can optionally contain O or S or hydroxyl group; R may be linked to the ring structures X1 and X2 at any position, with the proviso that the hydroxyl group on X2 ring is adjacent to the maleimidoalkanoyl group; and n=1-10.5.A resin comprising the structure: Wherein: X1 and X2 are 3-10 membered ring groups independently selected from functionalized or unfunctionalized alicyclic groups optionally having one or more heteroatoms; R is a multivalent hydrocarbyl linker selected from linear or branched alkyls, linear or branched cycloalkyls, alkylenes, cycloalkylenes, bicycloalkylenes, tricycloalkylenes, linear or branched alkylenes, linear or branched cycloalkylenes, linear or branched alkenylenes, arylenes, aralkylenes, arylbicycloalkylenes, aryltricycloalkylenes, bicycloalkylarylenes, tricycloalkylarylenes, bisphenylenes, cycloalkylarylenes, heterocycloalkylene or heterocycloarylenes; the alkyls, cycloalkyls, alkylenes, cycloalkylenes, alkenylenes, arylenes, aralkylenes, arylbicycloalkylenes, aryltricycloalkylenes, bicycloalkylarylenes, tricycloalkylarylenes, bisphenylenes, cycloalkylarylenes, heterocycloalkylene and heterocycloarylenes can optionally contain O or S or hydroxyl group; R is linked to the ring structures X1 and X2 at any position; X3 and X4 may be independently a bond linking the (meth)acrylate groups to the rings X1 and X2 or wherein n3 is 1-10; and Y is arylene, alkylene, alkenylene, aralkylene, cycloalkylene, bicycloalkylene or tricycloalkylene; R1 and R2 are independently H or methyl; with the proviso that the hydroxyl group on X1 ring is adjacent to X3 group, and hydroxyl group on X2 ring is adjacent to X4 group.",
"6.A resin comprising the structure: Wherein: R1 and R2 are each independently multivalent hydrocarbyl linkers selected from linear or branched alkyls, linear or branched cycloalkyls, alkylenes, cycloalkylenes, bicycloalkylenes, tricycloalkylenes, linear or branched alkylenes, linear or branched cycloalkylenes, linear or branched alkenylenes, arylenes, aralkylenes, arylbicycloalkylenes, aryltricycloalkylenes, bicycloalkylarylenes, tricycloalkylarylenes, bisphenylenes, cycloalkylarylenes, heterocycloalkylene or heterocycloarylenes; the alkyls, cycloalkyls, alkylenes, cycloalkylenes, alkenylenes, arylenes, aralkylenes, arylbicycloalkylenes, aryltricycloalkylenes, bicycloalkylarylenes, tricycloalkylarylenes, bisphenylenes, cycloalkylarylenes, heterocycloalkylene and heterocycloarylenes can optionally contain O or S or hydroxyl group; X is backbone of a dicarboxylic acid and is selected from arylenes, alkylenes, cycloalkylenes, linear or branched alkylenes, cycloalkylenes, bicycloalkylenes, tricycloalkylenes, linear or branched alkenylenes, arylenes, aralkylenes, cycloalkylarylenes, heterocycloalkylenes or heterocycloarylene; and n is 1-10.7.A resin comprising the structure: Wherein: R1 and R2 are each independently multivalent hydrocarbyl linkers selected from linear or branched alkyls, linear or branched cycloalkyls, alkylenes, cycloalkylenes, bicycloalkylenes, tricycloalkylenes, linear or branched alkylenes, linear or branched cycloalkylenes, linear or branched alkenylenes, arylenes, aralkylenes, arylbicycloalkylenes, aryltricycloalkylenes, bicycloalkylarylenes, tricycloalkylarylenes, bisphenylenes, cycloalkylarylenes, heterocycloalkylene or heterocycloarylenes; the alkyls, cycloalkyls, alkylenes, cycloalkylenes, alkenylenes, arylenes, aralkylenes, arylbicycloalkylenes, aryltricycloalkylenes, bicycloalkylarylenes, tricycloalkylarylenes, bisphenylenes, cycloalkylarylenes, heterocycloalkylene and heterocycloarylenes can optionally contain O or S or hydroxyl group; X is backbone of a dicarboxylic acid and is selected from arylenes, alkylenes, cycloalkylenes, linear or branched alkylenes, cycloalkylenes, bicycloalkylenes, tricycloalkylenes, linear or branched alkenylenes, arylenes, aralkylenes, cycloalkylarylenes, heterocycloalkylenes or heterocycloarylene; n is 1-10; X1 and X2 are polymerizable groups and are independently selected from glycidyl or (meth)acryloyl, groups, wherein X1 and X2 may be same when they are not glycidyl groups.",
"8.A resin comprising the structure: Wherein: R is a multivalent hydrocarbyl linker selected from linear or branched alkyls, linear or branched cycloalkyls, alkylenes, cycloalkylenes, bicycloalkylenes, tricycloalkylenes, linear or branched alkylenes, linear or branched cycloalkylenes, linear or branched alkenylenes, arylenes, aralkylenes, arylbicycloalkylenes, aryltricycloalkylenes, bicycloalkylarylenes, tricycloalkylarylenes, bisphenylenes, cycloalkylarylenes, heterocycloalkylene or heterocycloarylenes; the alkyls, cycloalkyls, alkylenes, cycloalkylenes, alkenylenes, arylenes, aralkylenes, arylbicycloalkylenes, arylbicycloalkylenes, bicycloalkylarylenes, tricycloalkylarylenes, bisphenylenes, cycloalkylarylenes, heterocycloalkylene and heterocycloarylenes can optionally contain O or S or hydroxyl group; R1 is a linker group, which can be a carbonyl group; aliphatic or aromatic and may contain one or more of ester, ether, thioether or hydroxyl groups; R2 is a substituent on the aromatic ring, which can be H, halogen, alkyl, alkyl ether, thioether group; and X1 can be H or a polymerizable group selected from (meth)acryloyl and glycidyl groups.",
"9.A resin comprising the structure: Wherein: R1 can be just a bond linking the two aromatic groups; O; carbonyl; or a multivalent hydrocarbyl linker selected from linear or branched alkyls, linear or branched cycloalkyls, alkylenes, cycloalkylenes, bicycloalkylenes, tricycloalkylenes, linear or branched alkylenes, linear or branched cycloalkylenes, linear or branched alkenylenes, arylenes, aralkylenes, arylbicycloalkylenes, aryltricycloalkylenes, bicycloalkylarylenes, tricycloalkylarylenes, bisphenylenes, cycloalkylarylenes, heterocycloalkylene or heterocycloarylenes; the alkyls, cycloalkyls, alkylenes, cycloalkylenes, alkenylenes, arylenes, aralkylenes, arylbicycloalkylenes, aryltricycloalkylenes, bicycloalkylarylenes, tricycloalkylarylenes, bisphenylenes, cycloalkylarylenes, heterocycloalkylene and heterocycloarylenes can optionally contain O or S or hydroxyl group; R2 is an aliphatic or aromatic linker which may contain one or more of ester, ether, thioether, carbonate or hydroxyl groups; R3 is a substituent on the aryl group, which may be H, halogen, alkyl, alkyl ether, or thio ether group; and X is H, or a polymerizable functionality selected from a (meth)acryloyl or glycidyl group.",
"10.A resin comprising the structure Wherein: R is a multivalent hydrocarbyl linker selected from linear or branched alkyls, linear or branched cycloalkyls, alkylenes, cycloalkylenes, bicycloalkylenes, tricycloalkylenes, linear or branched alkylenes, linear or branched cycloalkylenes, linear or branched alkenylenes, arylenes, aralkylenes, arylbicycloalkylenes, aryltricycloalkylenes, bicycloalkylarylenes, tricycloalkylarylenes, bisphenylenes, cycloalkylarylenes, heterocycloalkylene or heterocycloarylenes; the alkyls, cycloalkyls, alkylenes, cycloalkylenes, alkenylenes, arylenes, aralkylenes, arylbicycloalkylenes, aryltricycloalkylenes, bicycloalkylarylenes, tricycloalkylarylenes, bisphenylenes, cycloalkylarylenes, heterocycloalkylene and heterocycloarylenes can optionally contain O, S or hydroxyl group; R1 is methyl or H; n1 and n2 are each independently 1-10; X is selected from CH2, wherein n3 is 1-10, Y is arylene, alkylene, alkenylene, aralkylene, cycloalkylene, bicycloalkylene or tricycloalkylene.",
"11.An ODF sealant composition comprising the resin of claim 1 and a material selected from the group consisting of free radical initiators, curing agents, fillers and combinations thereof.",
"12.The ODF sealant composition of claim 11 further including and a material selected from the group consisting of photoinitiators, thixotropic agents, silane coupling agents, diluents, modifiers, coloring agents, surfactants, preservatives, stabilizers, plasticizers, lubricants, defoamers, leveling agents, tougheners and combinations thereof.",
"13.An ODF sealant composition comprising the resin of claim 2 and a material selected from the group consisting of free radical initiators, curing agents, fillers and combinations thereof.",
"14.The ODF sealant composition of claim 13 further including and a material selected from the group consisting of photoinitiators, thixotropic agents, silane coupling agents, diluents, modifiers, coloring agents, surfactants, preservatives, stabilizers, plasticizers, lubricants, defoamers, leveling agents, tougheners and combinations thereof.",
"15.An ODF sealant composition comprising the resin of claim 3 and a material selected from the group consisting of free radical initiators, curing agents, fillers and combinations thereof.",
"16.The ODF sealant composition of claim 15 further including and a material selected from the group consisting of photoinitiators, thixotropic agents, silane coupling agents, diluents, modifiers, coloring agents, surfactants, preservatives, stabilizers, plasticizers, lubricants, defoamers, leveling agents, tougheners and combinations thereof.",
"17.An ODF sealant composition comprising the resin of claim 4 and a material selected from the group consisting of free radical initiators, curing agents, fillers and combinations thereof.",
"18.The ODF sealant composition of claim 17 further including and a material selected from the group consisting of photoinitiators, thixotropic agents, silane coupling agents, diluents, modifiers, coloring agents, surfactants, preservatives, stabilizers, plasticizers, lubricants, defoamers, leveling agents, tougheners and combinations thereof.",
"19.An ODF sealant composition comprising the resin of claim 5 and a material selected from the group consisting of free radical initiators, curing agents, fillers and combinations thereof.",
"20.The ODF sealant composition of claim 19 further including and a material selected from the group consisting of photoinitiators, thixotropic agents, silane coupling agents, diluents, modifiers, coloring agents, surfactants, preservatives, stabilizers, plasticizers, lubricants, defoamers, leveling agents, tougheners and combinations thereof.",
"21.An ODF sealant composition comprising the resin of claim 6 and a material selected from the group consisting of free radical initiators, curing agents, fillers and combinations thereof.",
"22.The ODF sealant composition of claim 21 further including and a material selected from the group consisting of photoinitiators, thixotropic agents, silane coupling agents, diluents, modifiers, coloring agents, surfactants, preservatives, stabilizers, plasticizers, lubricants, defoamers, leveling agents, tougheners and combinations thereof.",
"23.An ODF sealant composition comprising the resin of claim 7 and a material selected from the group consisting of free radical initiators, curing agents, fillers and combinations thereof.",
"24.The ODF sealant composition of claim 23 further including and a material selected from the group consisting of photoinitiators, thixotropic agents, silane coupling agents, diluents, modifiers, coloring agents, surfactants, preservatives, stabilizers, plasticizers, lubricants, defoamers, leveling agents, tougheners and combinations thereof.",
"25.An ODF sealant composition comprising the resin of claim 8 and a material selected from the group consisting of free radical initiators, curing agents, fillers and combinations thereof.",
"26.The ODF sealant composition of claim 25 further including and a material selected from the group consisting of photoinitiators, thixotropic agents, silane coupling agents, diluents, modifiers, coloring agents, surfactants, preservatives, stabilizers, plasticizers, lubricants, defoamers, leveling agents, tougheners and combinations thereof.",
"27.An ODF sealant composition comprising the resin of claim 9 and a material selected from the group consisting of free radical initiators, curing agents, fillers and combinations thereof.",
"28.The ODF sealant composition of claim 27 further including and a material selected from the group consisting of photoinitiators, thixotropic agents, silane coupling agents, diluents, modifiers, coloring agents, surfactants, preservatives, stabilizers, plasticizers, lubricants, defoamers, leveling agents, tougheners and combinations thereof.",
"29.An ODF sealant composition comprising the resin of claim 10 and a material selected from the group consisting of free radical initiators, curing agents, fillers and combinations thereof.",
"30.The ODF sealant composition of claim 29 further including and a material selected from the group consisting of photoinitiators, thixotropic agents, silane coupling agents, diluents, modifiers, coloring agents, surfactants, preservatives, stabilizers, plasticizers, lubricants, defoamers, leveling agents, tougheners and combinations thereof."
],
[
"<SOH> BACKGROUND <EOH>"
],
[
"<SOH> SUMMARY <EOH>The present invention relates to unique resins and ODF compositions made therefrom.",
"In one aspect of the invention there is included a resin having the structure I:"
],
[
"BACKGROUND Field The present invention relates to monomers and oligomers useful as sealants and particularly as one drop fill sealants for liquid crystal applications.",
"In particular, the present invention permits assembly of LCD panels without migration of the sealant resin into the liquid crystal or vice versa during LCD assembly and/or curing of the resin.",
"BRIEF DESCRIPTION OF RELATED TECHNOLOGY The one drop fill (“ODF”) process is becoming the mainstream process in the assembly of LCD panels in display applications, replacing the conventional vacuum injection technology to meet faster manufacturing process demands.",
"In the ODF process, first, a sealant is dispensed on an electrode-equipped substrate to form a frame of a display element, and liquid crystals are dropped inside the depicted frame.",
"In the next step of the assembly, another electrode equipped substrate is joined thereto under vacuum.",
"Then, the sealant undergoes a curing process, either by a combination of UV and thermal or by thermal only process.",
"The ODF method has a few problems in that the sealant material in the uncured state comes into contact with the liquid crystal during the assembly process.",
"This could cause reduction in electro-optical properties of the liquid crystal by resin migration into the liquid crystal or vice versa, or because of ionic impurities that may be present.",
"Hence, design of resin systems for sealant material that show good liquid crystal resistance (less contamination) along with good adhesion and moisture barrier properties has remained a challenge.",
"SUMMARY The present invention relates to unique resins and ODF compositions made therefrom.",
"In one aspect of the invention there is included a resin having the structure I: Wherein: Q may be selected from: Wherein: R is a multivalent hydrocarbyl linker selected from linear or branched alkyls, linear or branched cycloalkyls, alkylenes, cycloalkylenes, bicycloalkylenes, tricycloalkylenes, linear or branched alkylenes, linear or branched cycloalkylenes, linear or branched alkenylenes, arylenes, aralkylenes, arylbicycloalkylenes, aryltricycloalkylenes, bicycloalkylarylenes, tricycloalkylarylenes, bisphenylenes, cycloalkylarylenes, heterocycloalkylene or heterocycloarylenes; the alkyls, cycloalkyls, alkylenes, cycloalkylenes, alkenylenes, arylenes, aralkylenes, arylbicycloalkylenes, aryltricycloalkylenes, bicycloalkylarylenes, tricycloalkylarylenes, bisphenylenes, cycloalkylarylenes, heterocycloalkylene and heterocycloarylenes can optionally contain O or S or hydroxyl group; R1 is methyl or H; X is CH2, n, n1, n2, and n3 are each independently 1-10; and Y is arylene, alkylene, alkenylene, aralkylene, cycloalkylene, bicycloalkylene or tricycloalkylene.",
"In another aspect of the invention there is included a resin having the structure II: Wherein: R is a multivalent hydrocarbyl linker selected from linear or branched alkyls, linear or branched cycloalkyls, alkylenes, cycloalkylenes, bicycloalkylenes, tricycloalkylenes, linear or branched alkylenes, linear or branched cycloalkylenes, linear or branched alkenylenes, arylenes, aralkylenes, arylbicycloalkylenes, aryltricycloalkylenes, bicycloalkylarylenes, tricycloalkylarylenes, bisphenylenes, cycloalkylarylenes, heterocycloalkylene or heterocycloarylenes; the alkyls, cycloalkyls, alkylenes, cycloalkylenes, alkenylenes, arylenes, aralkylenes, arylbicycloalkylenes, aryltricycloalkylenes, bicycloalkylarylenes, tricycloalkylarylenes, bisphenylenes, cycloalkylarylenes, heterocycloalkylene and heterocycloarylenes can optionally contain O, S or hydroxyl group; R1 and R2 are independently methyl or H; n1 and n2 are each independently 1-10; and X1 and X2 are independently selected from CH2, wherein n3 is 1-10, and Y is arylene, alkylene, alkenylene, aralkylene, cycloalkylene, bicycloalkylene or tricycloalkylene.",
"In yet another aspect of the invention there is included a resin having the structure III: Wherein: X1 and X2 are 3-10 membered ring groups independently selected from functionalized or unfunctionalized alicyclic groups optionally having one or more heteroatoms; n is 1-10; R is a multivalent hydrocarbyl linker selected from linear or branched alkyls, linear or branched cycloalkyls, alkylenes, cycloalkylenes, bicycloalkylenes, tricycloalkylenes, linear or branched alkylenes, linear or branched cycloalkylenes, linear or branched alkenylenes, arylenes, aralkylenes, arylbicycloalkylenes, arylbicycloalkylenes, bicycloalkylarylenes, tricycloalkylarylenes, bisphenylenes, cycloalkylarylenes, heterocycloalkylene or heterocycloarylenes; the alkyls, cycloalkyls, alkylenes, cycloalkylenes, alkenylenes, arylenes, aralkylenes, arylbicycloalkylenes, aryltricycloalkylenes, bicycloalkylarylenes, tricycloalkylarylenes, bisphenylenes, cycloalkylarylenes, heterocycloalkylene and heterocycloarylenes can optionally contain O or S or hydroxyl group; and R is linked to the ring structures containing X1 and X2 at any position; X3 is a bond linking the methacrylate group to the ring X1, or wherein n3 is 1-10; and Y is arylene, alkylene, alkenylene, aralkylene, cycloalkylene, bicycloalkylene or tricycloalkylene; with the proviso that hydroxyl group on X1 ring is adjacent to the X3 group containing (meth)acrylate, and hydroxyl group on the X2 ring is adjacent to the maleimidoalkanoyl group, respectively.",
"In still another aspect of the invention there is included a resin having the structure IV: Wherein: X1 and X2 are 3-10 membered ring groups independently selected from functionalized or unfunctionalized alicyclic groups optionally having one or more heteroatoms; R is a multivalent hydrocarbyl linker selected from linear or branched alkyls, linear or branched cycloalkyls, alkylenes, cycloalkylenes, bicycloalkylenes, tricycloalkylenes, linear or branched alkylenes, linear or branched cycloalkylenes, linear or branched alkenylenes, arylenes, aralkylenes, arylbicycloalkylenes, aryltricycloalkylenes, bicycloalkylarylenes, tricycloalkylarylenes, bisphenylenes, cycloalkylarylenes, heterocycloalkylene or heterocycloarylenes; the alkyls, cycloalkyls, alkylenes, cycloalkylenes, alkenylenes, arylenes, aralkylenes, arylbicycloalkylenes, aryltricycloalkylenes, bicycloalkylarylenes, tricycloalkylarylenes, bisphenylenes, cycloalkylarylenes, heterocycloalkylene and heterocycloarylenes can optionally contain O or S or hydroxyl group; R may be linked to the ring structures X1 and X2 at any position, with the proviso that the hydroxyl group on X2 ring is adjacent to the maleimidoalkanoyl group; and n is 1-10.In still another aspect of the invention there is included a resin having the structure V: Wherein: X1 and X2 are 3-10 membered ring groups independently selected from functionalized or unfunctionalized alicyclic groups optionally having one or more heteroatoms; R is a multivalent hydrocarbyl linker selected from linear or branched alkyls, linear or branched cycloalkyls, alkylenes, cycloalkylenes, bicycloalkylenes, tricycloalkylenes, linear or branched alkylenes, linear or branched cycloalkylenes, linear or branched alkenylenes, arylenes, aralkylenes, arylbicycloalkylenes, aryltricycloalkylenes, bicycloalkylarylenes, tricycloalkylarylenes, bisphenylenes, cycloalkylarylenes, heterocycloalkylene or heterocycloarylenes; the alkyls, cycloalkyls, alkylenes, cycloalkylenes, alkenylenes, arylenes, aralkylenes, arylbicycloalkylenes, aryltricycloalkylenes, bicycloalkylarylenes, tricycloalkylarylenes, bisphenylenes, cycloalkylarylenes, heterocycloalkylene and heterocycloarylenes can optionally contain O or S or hydroxyl group; R is linked to the ring structures X1 and X2 at any position; X3 and X4 may be independently a bond linking the (meth)acrylate groups to the rings X1 and X2, wherein n3 is 1-10; and Y is arylene, alkylene, alkenylene, aralkylene, cycloalkylene, bicycloalkylene or tricycloalkylene; R1 and R2 are independently H or methyl; with the proviso that the hydroxyl group on X1 ring is adjacent to X3 group, and hydroxyl group on X2 ring is adjacent to X4 group.",
"In still another aspect of the invention there is included a resin having the structure VI: Wherein: R1 and R2 are each independently multivalent hydrocarbyl linkers.",
"This multivalent hydrocarbyl linker is selected from linear or branched alkyls, linear or branched cycloalkyls, alkylenes, cycloalkylenes, bicycloalkylenes, tricycloalkylenes, linear or branched alkylenes, linear or branched cycloalkylenes, linear or branched alkenylenes, arylenes, aralkylenes, arylbicycloalkylenes, aryltricycloalkylenes, bicycloalkylarylenes, tricycloalkylarylenes, bisphenylenes, cycloalkylarylenes, heterocycloalkylene or heterocycloarylenes; the alkyls, cycloalkyls, alkylenes, cycloalkylenes, alkenylenes, arylenes, aralkylenes, arylbicycloalkylenes, aryltricycloalkylenes, bicycloalkylarylenes, tricycloalkylarylenes, bisphenylenes, cycloalkylarylenes, heterocycloalkylene and heterocycloarylenes can optionally contain O or S or hydroxyl group; X is backbone of a dicarboxylic acid and is selected from arylenes, alkylenes, cycloalkylenes, linear or branched alkylenes, cycloalkylenes, bicycloalkylenes, tricycloalkylenes, linear or branched alkenylenes, arylenes, aralkylenes, cycloalkylarylenes, heterocycloalkylenes or heterocycloarylene; and n is 1-10.In still another aspect of the invention there is included a resin having the structure VII: Wherein: R1 and R2 are each independently multivalent hydrocarbyl linkers, which may be selected from linear or branched alkyls, linear or branched cycloalkyls, alkylenes, cycloalkylenes, bicycloalkylenes, tricycloalkylenes, linear or branched alkylenes, linear or branched cycloalkylenes, linear or branched alkenylenes, arylenes, aralkylenes, arylbicycloalkylenes, aryltricycloalkylenes, bicycloalkylarylenes, tricycloalkylarylenes, bisphenylenes, cycloalkylarylenes, heterocycloalkylene or heterocycloarylenes, each of optionally containing O or S or a hydroxyl group; X is backbone of a dicarboxylic acid and is selected from arylenes, alkylenes, cycloalkylenes, linear or branched alkylenes, cycloalkylenes, bicycloalkylenes, tricycloalkylenes, linear or branched alkenylenes, arylenes, aralkylenes, cycloalkylarylenes, heterocycloalkylenes or heterocycloarylene; n is 1-10; X1 and X2 are polymerizable groups and are independently selected from glycidyl or (meth)acryloyl, groups, wherein X1 and X2 may be same when they are not glycidyl groups.",
"In still another aspect of the invention there is included a resin having the structure VIII: Wherein: R is a multivalent hydrocarbyl linker selected from linear or branched alkyls, linear or branched cycloalkyls, alkylenes, cycloalkylenes, bicycloalkylenes, tricycloalkylenes, linear or branched alkylenes, linear or branched cycloalkylenes, linear or branched alkenylenes, arylenes, aralkylenes, arylbicycloalkylenes, aryltricycloalkylenes, bicycloalkylarylenes, tricycloalkylarylenes, bisphenylenes, cycloalkylarylenes, heterocycloalkylene or heterocycloarylenes, each of which optionally containing O or S or hydroxyl group; R1 is a linker group, which can be a carbonyl group; an aliphatic or aromatic and may contain one or more of ester, ether, thioether or hydroxyl groups; R2 is a substituent on the aromatic ring, which can be H, halogen, alkyl, alkyl ether, thioether group; and X1 can be H or a polymerizable group selected from (meth)acryloyl and glycidyl groups.",
"In still another aspect of the invention there is included a resin having the structure IX: Wherein: R1 can be just a bond linking the two aromatic groups; O; carbonyl; or a multivalent hydrocarbyl linker.",
"The multivalent linker may be selected from linear or branched alkyls, linear or branched cycloalkyls, alkylenes, cycloalkylenes, bicycloalkylenes, tricycloalkylenes, linear or branched alkylenes, linear or branched cycloalkylenes, linear or branched alkenylenes, arylenes, aralkylenes, arylbicycloalkylenes, aryltricycloalkylenes, bicycloalkylarylenes, tricycloalkylarylenes, bisphenylenes, cycloalkylarylenes, heterocycloalkylene or heterocycloarylenes; the alkyls, cycloalkyls, alkylenes, cycloalkylenes, alkenylenes, arylenes, aralkylenes, arylbicycloalkylenes, aryltricycloalkylenes, bicycloalkylarylenes, tricycloalkylarylenes, bisphenylenes, cycloalkylarylenes, heterocycloalkylene and heterocycloarylenes can optionally contain O or S or hydroxyl group; R2 is an aliphatic or aromatic linker which may contain one or more of ester, ether, thioether, carbonate or hydroxyl groups; R3 is a substituent on the aryl group, which may be H, halogen, alkyl, alkyl ether, or thio ether group; and X is H, or a polymerizable functionality selected from a (meth)acryloyl or glycidyl group.",
"In still another aspect of the invention there is included a resin having the structure X: Wherein: R is a multivalent hydrocarbyl linker selected from linear or branched alkyls, linear or branched cycloalkyls, alkylenes, cycloalkylenes, bicycloalkylenes, tricycloalkylenes, linear or branched alkylenes, linear or branched cycloalkylenes, linear or branched alkenylenes, arylenes, aralkylenes, arylbicycloalkylenes, aryltricycloalkylenes, bicycloalkylarylenes, tricycloalkylarylenes, bisphenylenes, cycloalkylarylenes, heterocycloalkylene or heterocycloarylenes, each of which may optionally contain O, S or hydroxyl group; R1 is methyl or H; and n1 and n2 are each independently 1-10; X is selected from CH2, wherein n3 is 1-10, and Y is arylene, alkylene, alkenylene, aralkylene, cycloalkylene, bicycloalkylene or tricycloalkylene.",
"DETAILED DESCRIPTION The polymers of the present invention are useful in a wide variety of applications including sealing, adhesion and coating.",
"One particularly desirable use is as an ODF sealant for assembling LCD panels.",
"The present invention includes a number of novel materials including resins, oligomers and polymers useful for preparing curable compositions which may be used for ODF sealants.",
"The present invention also includes novel compositions made from the disclosed resins.",
"For purposes of this invention, the term “resins” will include the aforementioned the novel materials, i.e.",
"resins, oligomers and polymers.",
"One aspect of the invention includes a curing resin composition for use as an ODF sealant, which includes resins represented by the general structural formulae shown above.",
"The glycidyl ether/ester compounds useful in synthesizing some of the inventive resins described herein is not particularly limited, and examples of the compounds available in the market include: bisphenol A type epoxy resins such as Epikote 828EL and Epikote 1004 (all manufactured by Japan Epoxy Resin Co., Ltd.); bisphenol F type epoxy resins such as Epikote 806 and Epikote 4004 (all manufactured by Japan Epoxy Resin Co., Ltd.); bisphenol S type epoxy resins such as Epiclon EXA1514 (manufactured by Dainippon Ink and Chemicals Inc.) and SE 650 manufactured by Shin A T&C; 2,2′-diallyl bisphenol A type epoxy resins such as RE-81 ONM (manufactured by Nippon Kayaku Co., Ltd.); hydrogenated bisphenol type epoxy resins such as Epiclon EXA7015 (manufactured by Dainippon Ink and Chemicals Inc.); propyleneoxide-added bisphenol A type epoxy resins such as EP-4000S (manufactured by ADEKA Corporation); resorcinol type epoxy resins such as EX-201 (manufactured by Nagase ChemteX Corporation); biphenyl type epoxy resins such as Epikote YX-4000H (manufactured by Japan Epoxy Resin Co., Ltd.); sulfide type epoxy resins such as YSLV 50TE (manufactured by Tohto Kasei Co., Ltd.); ether type epoxy resins such as YSLV 80DE (manufactured by Tohto Kasei Co., Ltd.); dicyclopentadiene type epoxy resins such as EP-4088S and EP4088L (manufactured by ADEKA Corporation); naphthalene type epoxy resins such as SE-80, SE-90, manufactured by Shin A T&C; glycidyl amine type epoxy resins such as Epikote 630 (manufactured by Japan Epoxy Resin Co., Ltd.), Epiclon 430 (manufactured by Dainippon Ink and Chemicals Inc.) and TETRAD-X (manufactured by Mitsubishi Gas Chemical Company Inc.); alkylpolyol type epoxy resins such as ZX-1542 (manufactured by Tohto Kasei Co., Ltd.), Epiclon 726 (manufactured by Dainippon Ink and Chemicals Inc.), Epolight 8OMFA (manufactured by Kyoeisha Chemical Co., Ltd.) and Denacol EX-611 (manufactured by Nagase ChemteX Corporation); rubber modified type epoxy resins such as YR-450, YR-207 (all manufactured by Tohto Kasei Co., Ltd.) and Epolead PB (manufactured by Daicel Chemical Industries, Ltd.); glycidyl ester compounds such as Denacol EX-147 (manufactured by Nagase ChemteX Corporation); bisphenol A type episulfide resins such as Epikote YL-7000 (manufactured by Japan Epoxy Resin Co., Ltd.); and others such as YDC-1312, YSLV-BOXY, YSLV-90CR (all manufactured by Tohto Kasei Co., Ltd.), XAC4151 (manufactured by Asahi Kasei Corporation), Epikote 1031, Epikote 1032 (all manufactured by Japan Epoxy Resin Co., Ltd.), EXA-7120 (manufactured by Dainippon Ink and Chemicals Inc.), TEPIC (manufactured by Nissan Chemical Industries, Ltd.).",
"Examples of the commercially available phenol novolak type epoxy compound include Epiclon N-740, N-770, N-775 (all manufactured by Dainippon Ink and Chemicals Inc.), Epikote 152, Epikote 154 (all manufactured by Japan Epoxy Resin Co., Ltd.), and the like.",
"Examples of the commercially available cresol novolak type epoxy compound include Epiclon N-660, N-665, N-670, N-673, N-680, N-695, N-665-EXP and N-672-EXP (all manufactured by Dainippon Ink and Chemicals Inc.); an example of the commercially available biphenyl novolak type epoxy compound is NC-3000P (manufactured by Nippon Kayaku Co., Ltd.); examples of the commercially available trisphenol novolak type epoxy compound include EP1032S50 and EP1032H60 (all manufactured by Japan Epoxy Resin Co., Ltd.); examples of the commercially available dicyclopentadiene novolak type epoxy compound include XD-1000-L (manufactured by Nippon Kayaku Co., Ltd.) and HP-7200 (manufactured by Dainippon Ink and Chemicals Inc.); examples of the commercially available bisphenol A type epoxy compound include Epikote 828, Epikote 834, Epikote 1001, Epikote 1004 (all manufactured by Japan Epoxy Resin Co., Ltd.), Epiclon 850, Epiclon 860 and Epiclon 4055 (all manufactured by Dainippon Ink and Chemicals Inc.); examples of the commercially available bisphenol F type epoxy compound include Epikote 807 (manufactured by Japan Epoxy Resin Co., Ltd.) and Epiclon 830 (manufactured by Dainippon Ink and Chemicals Inc.); an example of the commercially available 2,2′-diallyl bisphenol A type epoxy compound is RE-810NM (manufactured by Nippon Kayaku Co., Ltd.); an example of the commercially available hydrogenated bisphenol type epoxy compound is ST-5080 (manufactured by Tohto Kasei Co., Ltd.); examples of the commercially available polyoxypropylene bisphenol A type epoxy compound include EP-4000 and EP-4005 (all manufactured by ADEKA Corporation); and the like.",
"HP4032 and Epiclon EXA-4700 (all manufactured by Dainippon Ink and Chemicals Inc.); phenol novolak type epoxy resins such as Epiclon N-770 (manufactured by Dainippon Ink and Chemicals Inc.); orthocresol novolak type epoxy resins such as Epiclon N-670-EXP-S (manufactured by Dainippon Ink and Chemicals Inc.); dicyclopentadiene novolak type epoxy resins such as Epiclon HP7200 (manufactured by Dainippon Ink and Chemicals Inc.); biphenyl novolak type epoxy resins such as NC-3000P (manufactured by Nippon Kayaku Co., Ltd.); and naphthalene phenol novolak type epoxy resins such as ESN-165S (manufactured by Tohto Kasei Co., Ltd.).",
"Examples of the alicyclic epoxy compounds useful in synthesizing some of the inventive resins include, without limitation, polyglycidyl ethers of polyhydric alcohols having at least one alicyclic ring and cyclohexene oxide- or cyclopentene oxide containing compounds obtained by epoxidizing cyclohexene ring or cyclopentene ring-containing compounds.",
"Specific examples include hydrogenated bisphenol A diglycidyl ether, 3,4-epoxycyclohexylmethyl 3,4-epoxycyclohexanecarboxylate, 3,4-epoxy-1-methyl cyclohexyl-3,4-epoxy-1-methylcyclohexanecarboxylate, 6-methyl-3,4-epoxycyclohexylmethyl-6-methyl-3,4-epoxy-cyclohexanecarboxylate, 3,4-epoxy-3-methylcyclohexylmethyl 3,4-epoxy-3-methylcyclohexanecarboxylate, 3,4-epoxy-5-methylcylcohexylmethyl-3,4-epoxy-5-methylcyclohexanecarboxylate, 2-(3,4-epoxycyclohexyl-5,5-spiro-3,4-epoxy)cyclohexane-metadioxane, bis(3,4-epoxycyclohexylmethyl)adipate, 3,4-epoxy-6-methylcyclohexyl carboxylate, methylenebis(3,4-epoxycyclohexane), dicyclopentadiene diepoxide, ethylenebis(3,4-epoxycyclohexanecarboxylate), dioctylepoxyhexahydrophthalate, and di-2-ethylhexyl epoxyhexahydrophthalate.",
"Some of these alicyclic epoxy resins are commercially available as: UVR-6100, UVR-6105, UVR-6110, UVR-6128, and UVR-6200 (products of Dow Corporation); CELLOXIDE 2021, CELLOXIDE 2021P, CELLOXIDE 2081, CELLOXIDE 2083, CELLOXIDE 2085, CELLOXIDE 2000, CELLOXIDE 3000, CYCLMER A200, CYCLMER M100, CYCLMER M101, EPOLEAD GT-301, EPOLEAD GT-302, EPOLEAD 401, EPOLEAD 403, ETHB, and EPOLEADHD 300 (products of Daicel Chemical Industries, Ltd.); KRM-2110 and KRM-2199 (products of ADEKA Corporation).",
"In addition to the curable polymers of the present invention, ODF sealant compositions may also include a free radical initiator (thermal or UV generated) and a curing agent.",
"Curing of the ODF compositions may be by thermal or UV mechanisms or both.",
"In embodiments where an epoxide ring is present, a latent epoxy curing agent may also be employed.",
"Useful thermal free radical initiators include, for example, organic peroxides and azo compounds that are known in the art.",
"Examples include: azo free radical initiators such as AIBN (azodiisobutyronitrile), 2,T-azobis(4-methoxy-2,4-dimethyl valeronitrile), 2,2′-azobis(2,4-dimethyl valeronitrile), dimethyl 2,2′-azobis(2-ethylpropionate), 2,2′-azobis(2-methylbutyronitrile), 1,11-azobis(cyclohexane-1-carbonitrile), 2,2′-azobis[N-(2-propenyl)-2-methylpropionamide]; dialkyl peroxide free radical initiators such as 1,1-di-(butylperoxy-3,3,5-trimethyl cyclohexane); alkyl perester free radical initiators such as TBPEH (t-butyl per-2-ethylhexanoate); diacyl peroxide free radical initiators such as benzoyl peroxide; peroxy dicarbonate radical initiators such as ethyl hexyl percarbonate; ketone peroxide initiators such as methyl ethyl ketone peroxide, bis(t-butyl peroxide) diisopropylbenzene, t-butylperbenzoate, t-butyl peroxy neodecanoate, and combinations thereof.",
"Further examples of organic peroxide free radical initiators include: dilauroyl peroxide, 2,2-di(4,4-di(tert-butylperoxy)cyclohexyl)propane, di(tert-butylperoxyisopropyl) benzene, di(4-tert-butylcyclohexyl) peroxydicarbonate, dicetyl peroxydicarbonate, dimyristyl peroxydicarbonate, 2,3-dimethyl-2,3-diphenylbutane, dicumyl peroxide, dibenzoyl peroxide, diisopropyl peroxydicarbonate, tert-butyl monoperoxymaleate, 2,5-dimethyl-2,5-di(tert-butylperoxy)hexane, tert-butylperoxy 2-ethylhexyl carbonate, tert-amyl peroxy-2-ethylhexanoate, tert-amyl peroxypivalate, tert-amylperoxy 2-ethylhexyl carbonate, 2,5-dimethyl-2,5-di(2-ethylhexanoylperoxy) hexane 2,5-dimethyl-2,5-di(tert-butylperoxy) hexpe-3, di(3-methoxybutyl)peroxydicarbonate, diisobutyryl peroxide, tert-butyl peroxy-2-ethylhexanoate (Trigonox 21 S), 1,1-di(tert-butylperoxy)cyclohexane, tert-butyl peroxyneodecanoate, tert-butyl peroxypivalate, tert-butyl peroxyneoheptanoate, tert-butyl peroxydiethylacetate, 1,1-di(tert-butylperoxy)-3,3,5-trimethylcyclohexane, 3,6,9-triethyl-3,6,9-trimethyl-1,4,7-triperoxonane, di(3,5,5-trimethylhexanoyl) peroxide, tert-butyl peroxy-3,5,5-trimethyl hexanoate, 1,1,3,3-tetramethylbutyl peroxy-2-ethylhexanoate, 1,1,3,3-tetramethylbutyl peroxyneodecanoate, tert-butyl peroxy-3,5,5-trimethyl hexanoate, cumyl peroxyneodecanoate, di-tert-butyl peroxide, tert-butylperoxy isopropyl carbonate, tert-butyl peroxybenzoate, di(2-ethylhexyl) peroxydicarbonate, tert-butyl peroxyacetate, isopropylcumyl hydroperoxide, and tert-butyl cumyl peroxide.",
"Ordinarily the thermal free radical initiator with higher decomposition rate is preferred, as this can generate free radicals more easily at common cure temperature (80-130° C.) and give faster cure speed, which can reduce the contact time between liquid resin and liquid crystal, and reduce the liquid crystal contamination.",
"On the other hand, if the decomposition rate of initiator is too high, the viscosity stability at room temperature will be influenced and thereby reducing the work life of the sealant.",
"A convenient way of expressing the decomposition rate of an initiator at a specified temperature is in terms of its half-life i.e., the time required to decompose one-half of the peroxide originally present.",
"To compare reactivity of different initiators, the temperature at which each initiator has a half-life (T½) of 10 hours is used.",
"The most reactive (fastest) initiator would be the one with the lowest 10 h T½ temperature.",
"The thermal free radical initiator with 10 h T½ temperature of 30-80° C. is preferred, and the thermal free radical initiator with 10 h T½ temperature of 40-70° C. is more preferred.",
"To balance the reactivity and viscosity stability of the composition, the thermal free radical initiator used in the resin composition is in an amount of usually 0.01 to 3 parts by weight, and preferably 0.5 to 2 parts by weight, based on 100 parts by weight of the inventive resin in the curable composition of the present invention.",
"Useful UV free radical initiators include Norrish type I cleavage photoinitiators that are commercially available from CIBA and BASF.",
"These photoinitiators are used in the amount 0.1-5 wt %, more preferably in about 0.2 to 3 wt % in the formulation.",
"Examples of useful epoxy curing agent include but are not limited to the Ajicure series of hardeners available from Ajinomoto Fine-Techno Co., Inc.; the Amicure series of curing agents available from Air products and the JERCURE™ products available from Mitsubushi Chemical.",
"These curing agents or hardeners or hardeners are used in the amount of about 1% to about 50% by weight of the total composition, more preferably from about 5% to about 20% by weight of the total composition.",
"The curable composition may optionally contain, as desired, a further component capable of a photopolymerization reaction such as a vinyl ether compound.",
"In addition, the curable composition may further comprise additives, resin components and the like to improve or modify properties such as flowability, dispensing or printing property, storage property, curing property and physical property after curing.",
"Various additives may be contained in the composition as desired, for example, organic or inorganic fillers, thixotropic agents, silane coupling agents, diluents, modifiers, coloring agents such as pigments and dyes, surfactants, preservatives, stabilizers, plasticizers, lubricants, defoamers, leveling agents and the like; however it is not limited to these.",
"In particular, the composition preferably comprises an additive selected from the group consisting of organic or inorganic filler, a thixotropic agent, and a silane coupling agent.",
"These additives may be present in amounts of about 0.1% to about 50% by weight of the total composition, more preferably from about 2% to about 10% by weight of the total composition.",
"The filler may include, but is not limited to, inorganic fillers such as silica, diatomaceous earth, alumina, zinc oxide, iron oxide, magnesium oxide, tin oxide, titanium oxide, magnesium hydroxide, aluminium hydroxide, magnesium carbonate, barium sulphate, gypsum, calcium silicate, talc, glass bead, sericite activated white earth, bentonite, aluminum nitride, silicon nitride, and the like; meanwhile, organic fillers such as poly(methyl) methacrylate, poly(ethyl) methacrylate, poly(propyl) methacrylate, poly(butyl) methacrylate, butylacrylate-methacrylic acid-(methyl) methacrylate copolymer, polyacrylonitrile, polystyrene, polybutadiene, polypentadiene, polyisoprene, polyisopropylene, and the like.",
"These may be used alone or in combination.",
"These fillers may be present in amounts of about 1% to about 80%, more preferably from about 5% to about 30% by weight of the total composition.",
"The thixotropic agent may include, but is not limited to, talc, fume silica, superfine surface-treated calcium carbonate, fine particle alumina, plate-like alumina; layered compounds such as montmorillonite, spicular compounds such as aluminium borate whisker, and the like.",
"Among them, talc, fume silica and fine alumina are particularly desired.",
"These agents may be present in amounts of about 1% to about-50%, more preferably from about 1% to about 30% by weight of the total composition.",
"The silane coupling agent may include, but is not limited to, γ-minopropyltriethoxysilane, γ-mercaptopropyltrimethoxysilane, γ-methacryloxypropyltrimethoxysilane, γ-glycidoxypropyltrimethoxylsilane, and the like.",
"The curable composition according to the present invention may be obtained by mixing the aforementioned each component by means of, for example, a mixer such as a stirrer having stirring blades and a three roll mill.",
"The composition is liquid at ambient with the viscosity of 200-400 Pa·s (at 25° C.) at 1.5 s−1 shear rate, which allows for easy dispensing.",
"Also provided is a method for manufacturing a liquid crystal display having a liquid crystal layer between a first substrate and a second substrate, by means of a liquid crystal one-drop-filling process.",
"The method comprises the steps of (a) applying the curable composition described in the present invention on a sealing region at periphery of a surface of the first substrate; (b) dropping liquid crystal on a central area encircled by the sealing region of the surface of the first substrate; (c) overlaying the second substrate on the first substrate; (d) optionally performing partial curing by UV-irradiating the curable composition, and (e) performing final curing by heating the curable composition.",
"The first substrate and the second substrate used in the present invention are usually transparent glass substrates.",
"Generally, transparent electrodes, active matrix elements (such as TFT), alignment film(s), a color filter and the like are formed on at least one of the opposed faces of the two substrates.",
"These constitutions may be modified according to the type of the LCD.",
"The manufacturing method according to the present invention may be thought to be applied for any type of the LCD.",
"In step (a), the curable composition is applied on the periphery portion of the surface of the first substrate so as to lap around the substrate circumference in a frame shape.",
"The portion where the curable composition is applied in a frame shape is referred as a seal region.",
"The curable composition can be applied by a known method such as screen printing and dispensing.",
"In step (b), the liquid crystal is then dropped onto the center region surrounded by the seal region in the frame shape on the surface of the first substrate.",
"This step is preferably conducted under reduced pressure.",
"In step (c), said second substrate is then placed over said first substrate, and UV-irradiated in the step (d).",
"By the UV-irradiation, the curable composition cures partially and shows the strength at a level that displacement does not occur by handling, whereby the two substrates are temporally fixed.",
"Generally, the radiation time is preferably short, for example not longer than 5 minutes, preferably not longer than 3 minutes, more preferably not longer than 1 minute.",
"In step (e), heating the curable composition allows it to achieve the final curing strength, whereby the two substrates are finally bonded.",
"The thermal curing in the step (e) is generally heated at a temperature of 80 to 130° C., and preferably of 100 to 120° C., with the heating time of 30 mins to 3 hours, typically 1 hour.",
"By this process, the major part of the LCD panel is completed.",
"Performance Data for ODF Formulations Table I below shows inventive ODF formulations 2-7 and control formulation 1 containing commercially available Uvacure 1561, which is partially acrylated BPA diglycidyl ether.",
"Irgacure 651 is a commercially available photoinitiator; A-187 is an adhesion promoter; EH-4357S is an epoxy hardener; SO-E2 is a silica filler; TABLE 1 ODF formulations Materials 1 2 3 4 5 6 7 Uvacure 1561 66 40 40 40 40 40 40 Resin 1 26 13 13 Resin 2 26 Resin 10 13 Resin 3 13 Resin 5 26 Resin 8 26 Irgacure 651 0.6 0.6 0.6 0.6 0.6 0.6 0.6 A-187 1 1 1 1 1 1 1 SO-E2 15.95 15.95 15.95 15.95 15.95 15.95 15.95 EH-4357S 16.45 9.97 15.45 13.28 11.83 15.15 13.58 Total 100.00 93.52 99.00 96.83 95.38 98.70 97.13 VHR, LC25 (5 V, 6 95.98 94.03 93.97 94.99 95.17 95.74 95.09 Hz) Mocon 8.29 6.67 8.65 8.10 6.29 9.32 6.64 g · mil/(100 in 2 · day), 50° C./100RH Corner Strength, 8.34 9.10 9.70 8.28 8.64 8.05 8.76 N/mm, ITO to ITO glass Corner Strength 7.19 8.02 7.11 5.67 5.33 5.59 8.69 after PCT(121° C., 100% RH, 2 atm, 24 h), N/mm As indicated in Table I, several inventive formulations showed improved moisture barrier properties and adhesion (measured as corner strength) Syntheses General Procedure for Glycidyl Ether Ring Opening with (Meth)Acrylic Acid and 6-Maleimidocaproic Acid In a round bottom flask equipped with a mechanical stirrer and nitrogen inlet were taken epoxy resin and appropriate stoichiometry of methacrylic acid or 6-maleimidocaproic acid in toluene.",
"Methylhydroquinone (1000-3000 ppm) and Hycat 2000S epoxy ring opening catalyst (1 wt %) were added and the mixture stirred at 60° C. for about 24 h. After cooling to room temperature (room temperature), an appropriate amount of ethyl acetate was added and the mixture was washed twice with aqueous NaHCO3 solution and several times with deionized water.",
"After drying over anhydrous Na2SO4, the solvent was passed through a silica column.",
"Another 500 ppm of methylhydroquinone was added and the solvent evaporated to give partially or completely ring-opened epoxy-(meth)acrylate or epoxy-maleimides resins.",
"General Procedure For Chain Extension of Diglycidyl Ethers with Dicarboxylic Acid to Obtain Epoxy Terminated Oligomers and Capping with Methacrylic Acid In a multi necked flask equipped with a mechanical stirrer were taken diglycidyl ether (2 eq), dicarboxylic acid (1 eq), Hycat 2000S epoxy ring opening catalyst (1 wt %) in a mixture of toluene and tetrahydrofuran (THF) (2:1).",
"The mixture was stirred at 60° C. for 15 hrs and 70° C. for 12 hrs to give the chain extended epoxy resin, which can be capped in the same reaction pot by adding methacrylic acid.",
"After cooling to room temperature, ethyl acetate was added and the mixture washed with aqueous NaHCO3 solution twice and several times with deionized water.",
"After drying over anhydrous Na2SO4, the organic layer was passed through a silica column and the solvent evaporated to give chain extended epoxy resin.",
"The molecular weight of the oligomer obtained can be altered by changing the diglycidyl ether to dicarboxylic acid ratio.",
"Inventive Resin Syntheses Preparation of Inventive Resin 1 In a 1 L 4 necked flask equipped with a mechanical stirrer and nitrogen inlet were taken EP4088S (123.6 g, 400 mmol), methacrylic acid (86.2 g, 1000 mmol), MeHQ (100 mg, 500 ppm), Hycat 2000S (2.1 g, 1 wt %) and toluene (200 mL).",
"The mixture was stirred at 60° C. overnight.",
"After cooling to room temperature 500 mL of ethyl acetate was added and the mixture washed twice with aqueous NaHCO3 solution and several times with deionized water.",
"After drying over anhydrous Na2SO4 the solvent was passed through a silica column.",
"Another 500 ppm of MeHQ was added and the solvent evaporated to give dimethacrylate resin 1 (182 g, 87%).",
"Preparation of Inventive Resin 2 In a 500 mL 4 necked flask equipped with a mechanical stirrer and nitrogen inlet were taken EP4088S (101 g, 327 mmol) and 6-maleimidocaproic acid (96.8 g, 458 mmol), methylhydroquinone (100 mg, 500 ppm) in toluene (130 mL).",
"2 g of Hycat 2000S (1 wt %) was added and the mixture was stirred at 60° C. for about 16 h. After cooling to room temperature, ethyl acetate was added and the product washed with aqueous NaHCO3 solution twice to remove any residual maleimidocaproic acid.",
"The organic layer was then washed several times with deionized water and dried over anhydrous Na2SO4.The organic layer was then passed through a silica column and the solvent evaporated to give hybrid epoxy-maleimide resin 2 (170 g, 85%).",
"Preparation of Inventive Resin 3 In a 500 mL 4 necked flask equipped with a mechanical stirrer was taken Tactix 756 (70.6 g, 280 mmoles per epoxy) methacrylic acid (16.03 g, 186 mmol), Hycat 2000S (0.86 g, 1 wt %) and toluene (100 mL).",
"500 ppm of methylhydroquinone (40 mg) was added and the mixture stirred at 60° C. overnight.",
"After cooling to room temperature, 300 mL of ethyl acetate was added and the organic layer washed twice with aqueous NaHCO3 solution and several times with deionized water.",
"After drying over anhydrous Na2SO4, the organic layer was passed through a column containing silica gel.",
"200 mg of methylhydroquinone (2000 ppm) was added and the solvent evaporated to give the dimethacrylate resin 3 was a brown solid (62 g, 72%, loss in yield due to difficulty in taking out all of the solid material from the flask).",
"Preparation of Inventive Resin 4 In a 500 mL 4 necked flask equipped with a mechanical stirrer were taken Tactix 756 (92.5 g, 366 mmol, with respect to epoxy functionality), 6-maleimidocaproic acid (25.8 g, 122 mmol), methylhydroquinone (63 mg, 500 ppm).",
"Toluene (200 mL) was added and the mixture stirred at 60° C. until it became homogenous.",
"Hycat 2000S was added (1.26 g, 1 wt %) and the mixture stirred at the same temperature for about 16 h. After cooling to room temperature, 400 mL of ethyl acetate was added and the organic layer washed twice with aqueous NaHCO3 solution and several times with deionized water.",
"After drying over anhydrous Na2SO4, the organic layer was passed through a silica column and the solvent evaporated to give hybrid epoxy-maleimide resin 4 (92 g, 78%).",
"Preparation of Inventive Resin 5 In a 1 L 4 necked flask equipped with a mechanical stirrer were taken Bisphenol A diglycidyl ether (121 g, 355 mmol), 6-maleimidocaproic acid (105 g, 497 mmol), methylhydroquinone (110 mg, 500 ppm) in toluene (200 mL).",
"The mixture was stirred at 60° C. until it became homogenous.",
"Hycat 2000S (2.2 g, 1 wt %) was added and the mixture stirred at the same temperature overnight.",
"After cooling to room temperature 1 L of ethyl acetate was added and the organic layer washed twice with aqueous NaHCO3 solution and several times with deionized water.",
"After drying over anhydrous Na2SO4, the organic layer was passed through a silica column and the solvent evaporated to give the hybrid epoxy maleimide resin 5 (175 g, 77%).",
"Preparation of Inventive Resin 6 In a 500 mL 4 necked flask equipped with a mechanical stirrer were taken resorcinol diglycidyl ether (101 g, 454 mmol), methacrylic acid (54.8 g, 636 mmol), 3-maleimidopropanoic acid (50 g, 295 mmol), methylhydroquinone (100 mg, 500 ppm) and Hycat 2000S (2 g, 1 wt %) in toluene (200 mL) and the mixture heated at 60° C. overnight.",
"After cooling to room temperature 500 mL of ethyl acetate was added and the organic layer washed twice with aqueous NaHCO3 solution and several times with deionized water.",
"After drying over anhydrous Na2SO4, the organic layer was passed through silica column.",
"500 ppm of methylhydroquinone was added and the solvent evaporated to give RDGE hybrid maleimido-methacrylate resin 6 as a viscous liquid (165 g, 80%).",
"Preparation of Inventive Resin 7 In a 500 mL 4 necked flask equipped with a mechanical stirrer was taken resorcinol diglycidyl ether (93.2 g, 419 mmol), acrylic acid (33.2 g, 251 mmol), methacrylic acid (39.7 g, 251 mmol), methylhydroquinone (130 mg, 1000 ppm) and Hycat 2000S (1.3 g, 1 wt %) in toluene (200 mL) and the mixture was heated at 60° C. overnight.",
"After cooling to room temperature 500 mL of ethyl acetate was added and the organic layer washed twice with aqueous NaHCO3 solution and several times with deionized water, dried over anhydrous Na2SO4.The organic layer was directly passed through a column of silica gel & 500 ppm of methylhydroquinone was added and the solvent evaporated to give the hybrid acrylate-methacrylate resin 7 (123 g, 92%).",
"Preparation of Inventive Resin 8 In a 500 mL 3 necked flask equipped with a magnetic stirrer were taken EP4088S epoxy resin (133.3 g, 432 mmol), isophthalic acid (35.9 g, 216 mmol), Hycat 2000S (1.7 g, 1 wt %) in mixture of toluene (200 mL) and THF 100 mL).",
"The mixture was stirred at 60° C. for 15 h and 70° C. for 12 h. After cooling to room temperature 500 mL of ethyl acetate was added and the mixture washed with aqueous NaHCO3 solution twice and several times with deionized water.",
"After drying over anhydrous Na2SO4, the organic layer was passed through a silica column and the solvent evaporated to give chain extended EP 4088S epoxy resin 8 (132 g, 78%) as a viscous liquid.",
"The molecular weight of the chain extended resin can be altered by changing the ratio of the diacid to the diglycidyl ether.",
"Preparation of Inventive Resin 9 In a 500 mL 3 necked flask equipped with a mechanical stirrer were taken EP4088S (168 g, 545 mmol) isophthalic acid (45.33 g, 272 mmol) in a mixture of toluene (200 g) and THF (100 mL).",
"The mixture was stirred at 60° C. for 15 minutes.",
"Hycat 2000S (2.1 g, 1 wt %) was added and the mixture stirred at the same temperature until for about 12 h and at 70° C. for 8 h at which time the mixture becomes homogenous.",
"Methacrylic acid (56.3 g, 654 mmol) and additional Hycat (2.1 g, 1 wt %) were added and the mixture further stirred overnight.",
"THF was evaporated and 700 mL ethyl acetate added.",
"The organic layer washed twice times with aqueous NaHCO3 solution and several times with deionized water.",
"The organic layer was passed through a silica column and the solvent evaporated to give the methacrylate end capped chain extended DCPD oligomer (resin 9) as a highly viscous liquid (160 g, 78%) Preparation of Inventive Resin 10 In a 500 mL round bottom flask equipped with a magnetic stir bar and a nitrogen inlet were taken tris(2,3-epoxypropyl) isocyanurate (62 g, 209 mmol) and methacrylic acid (35.9 g, 418 mmol) in toluene (200 mL).",
"1000 ppm of methylhydroquinone and Hycat 2000S (1 g, 1 wt %) were added and the mixture heated at 60° C. overnight.",
"After cooling to room temperature ethyl acetate was added and the organic layer washed with saturated aqueous bicarbonate solution twice followed by deionized water several times.",
"After drying over anhydrous Na2SO4, the organic layer was passed through a silica column and the solvent evaporated.",
"This gave the epoxy dimethacrylate resin 10 as a viscous liquid (73 g, 74%).",
"Preparation of Inventive Resin 11 In a 500 mL 4 necked flask equipped with a mechanical stirrer were taken RDGE (93.4 g, 420 mmol), 6-maleimidocaproic acid (124.2 g, 588 mmol), methylhydroquinone (100 mg, 500 ppm) in toluene (200 mL) and the mixture was heated at 60° C. until it became homogenous.",
"Hycat 2000S (2.05 g, 1 wt %) was added and the mixture stirred at 60° C. overnight.",
"Next day morning, after cooling to room temperature 500 mL of ethyl acetate was added and the organic layer washed twice with aqueous NaHCO3 solution and several times with deionized water.",
"After drying over anhydrous Na2SO4 the organic layer was passed through a silica column and the solvent evaporated.",
"500 ppm of MeHQ was added and the solvent evaporated to give resin 11 as a light brown viscous liquid (158 g, 73%).",
"Preparation of Inventive Resin 12 Into a 100 mL round bottom flask was added 20.0 g of Tactix 756 (Huntsman Advanced Materials) and 20.0 g of SR833 (Sartomer).",
"This mixture was heated to 100° C. in air with stirring.",
"A homogeneous solution was obtained in about half an hour.",
"The reaction was cooled to 70° C. and 6.62 g 2-carboxyethyl acrylate (CEA) and 0.45 g 2-(dimethylamino)ethyl acrylate (DMAEA) were added.",
"The reaction continued in air for 4 h. 1H NMR indicated complete consumption of the acid.",
"The formation of adduct was further confirmed by mass spectroscopy.",
"Preparation of Inventive Resin 13 In a 1 L 4 necked flask equipped with a mechanical stirrer was taken trimellitic anhydride (154 g, 802 mmol) in a mixture of DMF (500 mL) and xylene (100 mL).",
"To this was added tricyclodecane diamine (Oxea chemicals, 78 g, 401 mmol) and the mixture stirred at room temperature until it becomes almost homogenous.",
"The mixture was heated and when the temperature reaches about 130° C., the mixture begins to reflux.",
"The mixture was refluxed for 1 h and the mixture concentrated by distilling out the solvent mixture.",
"The distillation starts around 138° C. and the pot temperature gradually increases to about 172° C. After most of the solvent has been distilled off, the mixture was poured into excess water and stirred for 2 h. It takes a while for the gel like material to solidify.",
"The resulting white precipitate was filtered off and the filter cake was washed twice with water.",
"The solid was dried to give resin 13 as a white powder (174 g, 80%).",
"Preparation of Inventive Resin 14 In a 500 ml 4 necked flask equipped with a mechanical stirrer and condenser were taken imide imide diacid resin 13 (57.5 g, 105 mmol) and glycidyl methacrylate (28.6 g, 201 mmol) in THF (150 mL).",
"Hycat 2000S (0.9 g, 1 wt %) was added and the mixture stirred at 60° C. overnight.",
"THF was evaporated and 600 mL ethyl acetate was added.",
"The organic layer was washed twice with aqueous NaHCO3 solution, several times with deionized water and passed through a silica column.",
"Another 1000 ppm of MeHQ was added and the solvent evaporated to give resin 14 as a light green solid (90%).",
"Preparation of Inventive Resin 15 4,4′-Hexaflurorisopropylidenediphthaleic anhydride (100 g, 225 mmol) was taken in a mixture of DMF (400 mL) and xylene (80 mL) in a 1 L 3 necked flask equipped with a mechanical stirrer and heating mantle.",
"Ethanolamine (31 g, 506 mmol) was added at once (slightly exothermic, as the temp rose to about 45° C.).",
"The mixture was heated to 170° C. as the reaction temperature gradually rose to about 139° C. when the azeotropic distillation started.",
"The temperature eventually rose to about 160° C. in about 30 minutes.",
"At this point, the reaction was stopped and IR indicated that the imidization reached completion.",
"After cooling, 500 mL of water was added and stirred for 30 minutes.",
"The precipitated solid was filtered off and washed several times with water and dried to give imide diol resin 15 as a light orange solid (101 g, 85%).",
"Preparation of Inventive Resin 16 In a 1 L 3 necked flask equipped with a mechanical stirrer and water condenser, were taken imide diol 15 (42 g, 79 mmol), methacrylic acid (17 g, 198 mmol), PTSA mono hydrate (1.5 g, 7.9 mmol), 4-methoxyphenol (60 mg, 1000 ppm) in toluene (300 mL).",
"The mixture was refluxed with azeotrope distillation of water for about 7 h. After cooling to room temperature, the mixture was diluted with ethyl acetate, washed with aqueous NaHCO3 solution twice, deionized water until the ionic conductivity was about 2 uS.",
"The organic layer was passed through a silica column containing a short plug of sillitin in between the silica layers.",
"Another 500 ppm pf 4-methoxyphenol was added and the solvent evaporated on rotovap to give resin 16 (43 g, 81%).",
"Preparation of Inventive Resin 17 4,4′-Oxydiphthaleic anhydride (104 g, 335 mmol) was taken in a mixture of DMF (400 mL) and xylene (100 mL) in a 1 L 3 necked flask equipped with a mechanical stirrer and heating mantle.",
"Ethanolamine (47 g, 769 mmol) was added at once (slightly exothermic, as the temp rose to about 48° C.).",
"The mixture was heated to 170° C. as the reaction temperature gradually rose to about 139° C. when the azeotropic distillation started.",
"The temperature eventually rose to about 170° C. in about 30 minutes.",
"After most of the solvent has distilled off, the mixture was cooled to room temperature 500 mL of water was added and stirred well for 30 minutes.",
"The precipitated white solid was filtered off, washed several times with water and dried to give the imide dial resin 17 as an off white solid (108 g, 81%).",
"Preparation of Inventive Resin 18 In a 1 L 3 necked flask equipped with a mechanical stirrer and water condenser, were taken imide diol 17 (38 g, 95 mmol), methacrylic acid (20.63 g, 239 mmol), PTSA mono hydrate (1.8 g, 9.5 mmol), 4-methoxyphenol (60 mg, 1000 ppm) in toluene (300 mL).",
"The mixture was refluxed with azeotrope distillation of water for about M. After cooling to room temperature, the mixture was diluted with ethyl acetate, washed with aqueous NaHCO3 solution twice, deionized water until the ionic conductivity was about 2 uS.",
"The organic layer was passed through a silica column containing a short plug of sillitin in between the silica layers.",
"Another 500 ppm pf 4-methoxyphenol was added and the solvent evaporated on rotovap to give resin 18 as a brown viscous liquid (44.1 g, 85%)."
]
] |
Patent_15871051
|
[
[
"Making a vehicle passenger aware of a sudden decrease in ride smoothness",
"Occupants of an autonomous vehicle may not always have a view of the outside environment (e.g., they may be occupied consuming digital content, or their vehicle may not have windows).",
"However, such occupants may benefit from gaining a view to the outside environment when an unexpected driving event is about to occur.",
"Such a view can increase their awareness to the event, making them less likely to be surprised, disturbed, or distressed by the event.",
"In one embodiment, an occupant of an autonomous vehicle receives a video see-through (VST) of the environment outside the vehicle when such an unexpected driving event is imminent."
],
[
"1.A system for an autonomous on-road vehicle, comprising: an autonomous-driving control system configured to generate an indication indicative of whether a Sudden Decrease in Ride Smoothness (SDRS) event is imminent; and a computer configured to: present video see through (VST) at eye level and on the foveal vision region of an occupant who travels in the vehicle, responsive to the indication indicating that an SDRS event is imminent; and present video-unrelated-to-the-VST (VUR) at eye level and on the foveal vision region of the occupant, responsive to the indication not indicating that an SDRS event is imminent.",
"2.The system of claim 1, wherein the autonomous-driving control system is configured to generate the indication based on trajectory of the vehicle and information about the road; and further comprising a camera, mounted to the vehicle, configured to take video of the environment outside the vehicle; wherein the computer is further configured to generate the VST based on the video of the environment.",
"3.The system of claim 1, wherein the autonomous-driving control system receives at least some of the information about the road from at least one of the following sources: sensors mounted to the vehicle, sensors mounted to nearby vehicles, an autonomous-driving control system used to drive a nearby vehicle, and a database comprising descriptions of obstacles in the road that are expected to cause intense movement of the vehicle.",
"4.The system of claim 1, wherein the autonomous-driving control system is configured to generate the indication based on at least one of the following configurations: (i) receive from a camera images of the road, and calculate the indication based on trajectory of the vehicle and analysis of the images, (ii) receive from a radar reflections of electromagnetic waves from the road, and calculate the indication based on trajectory of the vehicle and signal processing of the reflections, and (iii) receive a notification from a detailed road map, and calculate the indication based on trajectory of the vehicle and the notification.",
"5.The system of claim 1, further comprising a nontransparent element, coupled to the vehicle, obstructing at least 30 degrees out of the frontal horizontal unaided field of view to the outside environment of the occupant at eye level; wherein the stiffness of the nontransparent element is greater than the stiffness of a transparent glass window having the same weight.",
"6.The system of claim 1, wherein the vehicle comprises a nontransparent element fixed to the vehicle at an angle, relative to the occupant, that is covered by the field of view of the VST, and the nontransparent element features visible light transmittance (VLT) below 10% of ambient light.",
"7.The system of claim 1, wherein when presenting the VST responsive to the indication indicating that the SDRS event is imminent, the VST covers more than 50% of the VUR.",
"8.The system of claim 1, wherein when presenting the VST responsive to the indication indicating that the SDRS event is imminent, the VST is presented using images having transparency value greater than 50%.",
"9.The system of claim 1, wherein when presenting the VUR responsive to the indication not indicating that the SDRS event is imminent, the VUR is presented using images having transparency value greater than 50%.",
"10.The system of claim 1, wherein when presenting the VST responsive to the indication indicating that the SDRS event is imminent, the VST captures more than 50% of the foveal vision region of the occupant.",
"11.The system of claim 1, wherein when presenting the VUR responsive to the indication not indicating that the SDRS event is imminent, the VUR is presented on the foveal vision region of the occupant with opacity A, and the VST is presented on the foveal vision region of the occupant with opacity B, wherein A>B; whereby a normalized opacity parameter takes a value from 0.0 to 1.0, and the lower the value the more transparent the video is.",
"12.The system of claim 1, wherein when presenting the VST responsive to the indication indicating that the SDRS event is imminent, the VST is presented on the foveal vision region of the occupant with opacity A, and the VUR is presented on the foveal vision region of the occupant with opacity B, wherein A>B.",
"13.The system of claim 1, wherein the SDRS event comprises at least one of the following events: hitting a speed bump, driving over a pothole, climbing on the curb.",
"14.The system of claim 1, wherein the SDRS event comprises at least one of the following events: making a sharp turn, a hard breaking, an unusual acceleration, and starting to drive after a full stop.",
"15.The system of claim 1, wherein the SDRS event takes place at least 2 minutes after start traveling and is not directly related to the act of start traveling; in addition, the SDRS event takes place at least 2 minutes before arriving to the destination and is not directly related to the act of arriving at the destination.",
"16.The system of claim 15, wherein the SDRS event takes place at least 2 minutes before arriving at the destination and is not directly related to the act of arriving at the destination.",
"17.The system of claim 1, wherein the VST and the VUR are presented to the occupant on a virtual reality (VR) headset, and the occupant does not need to remove the VR headset in order to see the VST.",
"18.The system of claim 1, wherein the VST and the VUR are presented to the occupant on an augmented reality (AR) headset.",
"19.The system of claim 1, wherein the VST and the VUR are presented to the occupant on a screen coupled to the vehicle compartment."
],
[
"<SOH> BACKGROUND <EOH>When traveling, the occupant of an autonomous on-road vehicle may be engaged in various work- and entertainment-related activities.",
"Many of these activities typically involve viewing content on a display.",
"However, there are times in which a lack of awareness of the divining environment can lead to undesired consequences.",
"For example, if an unexpected driving event occurs, such as hitting a speed bump, making a sharp turn, or a hard breaking, this may startle the occupant.",
"Thus, there is a need for a way to make the occupants aware of certain unexpected driving events, in order to make the driving experience in autonomous on-road vehicles less distressful when such events occur."
],
[
"<SOH> SUMMARY <EOH>In some embodiments, an occupant of an autonomous on-road vehicle may have the opportunity to view video see-through (VST), which is video generated based on video of the environment outside the vehicle.",
"VST can often replace the need to look out of a window (when the vehicle has windows).",
"Some examples of scenarios in which VST may be required include a windowless vehicle, a vehicle with shaded windows having Visible Light Transmittance (VLT) below 30%, and/or when the occupant wears a VR headset.",
"While traveling in such a vehicle, the occupant may benefit from gaining a view to the outside environment when an unexpected driving event occurs.",
"By being made aware of the event, the occupant is less likely to be surprised, disturbed, and/or distressed by the unexpected event."
],
[
"CROSS-REFERENCE TO RELATED APPLICATIONS This application is a Continuation of U.S. application Ser.",
"No.",
"15/335,404, filed Oct. 26, 2016, which claims priority to U.S.",
"Provisional Patent Application No.",
"62/246,187, filed on 26 Oct. 2015, and U.S.",
"Provisional Patent Application No.",
"62/369,127, filed on 31 Jul.",
"2016.ACKNOWLEDGMENTS Gil Thieberger would like to thank his holy and beloved teacher, Lama Dvora-hla, for her extraordinary teachings and manifestation of wisdom, love, compassion and morality, and for her endless efforts, support, and skills in guiding him and others on their paths to freedom and ultimate happiness.",
"Gil would also like to thank his beloved parents for raising him exactly as they did.",
"BACKGROUND When traveling, the occupant of an autonomous on-road vehicle may be engaged in various work- and entertainment-related activities.",
"Many of these activities typically involve viewing content on a display.",
"However, there are times in which a lack of awareness of the divining environment can lead to undesired consequences.",
"For example, if an unexpected driving event occurs, such as hitting a speed bump, making a sharp turn, or a hard breaking, this may startle the occupant.",
"Thus, there is a need for a way to make the occupants aware of certain unexpected driving events, in order to make the driving experience in autonomous on-road vehicles less distressful when such events occur.",
"SUMMARY In some embodiments, an occupant of an autonomous on-road vehicle may have the opportunity to view video see-through (VST), which is video generated based on video of the environment outside the vehicle.",
"VST can often replace the need to look out of a window (when the vehicle has windows).",
"Some examples of scenarios in which VST may be required include a windowless vehicle, a vehicle with shaded windows having Visible Light Transmittance (VLT) below 30%, and/or when the occupant wears a VR headset.",
"While traveling in such a vehicle, the occupant may benefit from gaining a view to the outside environment when an unexpected driving event occurs.",
"By being made aware of the event, the occupant is less likely to be surprised, disturbed, and/or distressed by the unexpected event.",
"BRIEF DESCRIPTION OF THE DRAWINGS The embodiments are herein described by way of example only, with reference to the accompanying drawings.",
"No attempt is made to show structural details of the embodiments in more detail than is necessary for a fundamental understanding of the embodiments.",
"In the drawings: FIG.",
"1 is a schematic illustration of components of a system configured to combine video see-through (VST) with video-unrelated-to-the-VST (VUR); FIG.",
"2 illustrates an HMD tracking module that measures the position of the HMD relative to the compartment; FIG.",
"3 illustrates a vehicle in which an occupant wears an HMD; FIG.",
"4 illustrates an occupant wearing an HMD and viewing large VUR and smaller VST; FIG.",
"5a illustrates how the VST moves to the upper left when the occupant looks to the bottom right; FIG.",
"5b illustrates how the VST moves to the bottom right when the occupant looks to the upper left; FIG.",
"6 illustrates HMD-video that includes both a non-transparent VST and video that shows the hands of the occupant and the interior of the compartment; FIG.",
"7 illustrates HMD-video that includes both a partially transparent VST and video that shows the hands of the occupant and the interior of the compartment; FIG.",
"8 illustrates HMD-video that includes a VST and partially transparent video that shows the hands of the occupant and the interior of the compartment; FIG.",
"9a illustrates HMD-video that includes a VUR in full FOV, a first window comprising compartment-video (CV) and a second smaller window comprising the VST; FIG.",
"9b illustrates HMD-video that includes VUR in full FOV, a first window comprising the CV and a second partially transparent smaller window comprising the VST; FIG.",
"10a illustrates HMD-video that includes VUR in full FOV, a first window comprising VST and a second smaller window comprising zoom out of the CV; FIG.",
"10b illustrates HMD-video that includes VUR and a partially transparent CV; FIG.",
"11a illustrates a FOV of a vehicle occupant when the occupant wears an HMD that presents HMD-video; FIG.",
"11b illustrates a FOV of a vehicle occupant when the vehicle occupant does not wear an HMD that presents the video, such as when watching an autostereoscopic display; FIG.",
"11c illustrates FOV of a 3D camera that is able to capture sharp images from different focal lengths; FIG.",
"12 is a schematic illustration of components of a system configured to enable an HMD to cooperate with a window light shading module; FIG.",
"13a illustrates a first mode for a shading module where an occupant sees the outside environment through the optical see-through component; FIG.",
"13b illustrates a second mode for a shading module where the occupant sees the outside environment through a VST; FIG.",
"14 illustrates a VST over a curtain; FIG.",
"15 illustrates a light shading module that is unfurled on the inside of the compartment; FIG.",
"16 illustrates a light shading module that is unfurled on the outside of the compartment; FIG.",
"17 is a schematic illustration of components of a video system that may be used to increase awareness of an occupant of a vehicle regarding an imminent SDRS; FIG.",
"18a illustrates presenting VUR to an occupant when there is no indication that an SDRS event is imminent; FIG.",
"18b illustrates presenting VST responsive to receiving an indication that an SDRS event is imminent (a pothole); FIG.",
"18c illustrates presenting VST responsive to receiving an indication that an SDRS event is imminent (a sharp turn); FIG.",
"19a illustrates presenting VUR and VST when there is no indication that an SDRS event is imminent; FIG.",
"19b illustrates presenting a larger VST responsive to receiving an indication that an SDRS event is imminent (a road bump); FIG.",
"19c illustrates presenting a partially transparent VST responsive to receiving an indication that an SDRS event is imminent; FIG.",
"20a illustrates a smart glass shading module when there is no indication that an SDRS event is imminent; FIG.",
"20b illustrates the smart glass shading module when there is an indication that an SDRS event is imminent; FIG.",
"21a and FIG.",
"21b illustrate vehicles with an SAEDP in their compartment were an occupant uses an HMD to receive a representation of the outside environment; FIG.",
"22 illustrates a vehicle with an SAEDP in the vehicle's compartment with displays; FIG.",
"23 illustrates how an SAEDP protects the occupant in a side collision; FIG.",
"24a and FIG.",
"24b illustrate a vehicle with a motor configured to move a nontransparent SAEDP to cover a side window; FIG.",
"25a and FIG.",
"25b illustrate a vehicle with a motor configured to move a front SAEDP between first and second states; FIG.",
"26a illustrates an SAEDP mounted to the front of a vehicle at eye level of an occupant of the vehicle; FIG.",
"26b illustrates an outer SAEDP that includes two air bags; FIG.",
"27a and FIG.",
"27b illustrate a motorized external SAEDP that can move between first and second states multiple times; FIG.",
"28 illustrates a vehicle compartment in which an occupant may lay down; FIG.",
"29 illustrates a vehicle with a front mirror; FIG.",
"30a illustrates one example of a configuration of a plurality of beams located in the left side of the vehicle; FIG.",
"30b illustrates one example of a configuration of a plurality of beams located in the front of the vehicle; and FIG.",
"31a and FIG.",
"31b are schematic illustrations of computers able to realize one or more of the embodiments discussed herein.",
"DETAILED DESCRIPTION The following are definitions of various terms that may be used to describe one or more of the embodiments in this disclosure.",
"The terms “autonomous on-road vehicle” and “autonomous on-road manned vehicle” refer to cars and motorcycles designed to drive on public roadways utilizing automated driving of level 3 and above according to SAE International standard J3016 “Taxonomy and Definitions for Terms Related to On-Road Motor Vehicle Automated Driving Systems”.",
"For example, the autonomous on-road vehicle may be a level 3 vehicle, in which within known, limited environments, drivers can safely turn their attention away from driving tasks; the autonomous on-road vehicle may be a level 4 vehicle, in which the automated system can control the vehicle in all but a few environments; and/or the autonomous on-road vehicle may be a level 5 vehicle, in which no human intervention is required and the automatic system can drive to any location where it is legal to drive.",
"Herein, the terms “autonomous on-road vehicle” and “self-driving on-road vehicle” are equivalent terms that refer to the same.",
"The term “autonomous on-road vehicle” does not include trains, airplanes, boats, and armored fighting vehicles.",
"An autonomous on-road vehicle utilizes an autonomous-driving control system to drive the vehicle.",
"The disclosed embodiments may use any suitable known and/or to be invented autonomous-driving control systems.",
"The following three publications describe various autonomous-driving control systems that may be utilized with the disclosed embodiments: (i) Paden, Brian, et al.",
"“A Survey of Motion Planning and Control Techniques for Self-driving Urban Vehicles.” arXiv preprint arXiv:1604.07446 (2016); (ii) Surden, Harry, and Mary-Anne Williams.",
"“Technological Opacity, Predictability, and Self-Driving Cars.” Predictability, and Self-Driving Cars (Mar.",
"14, 2016) (2016); and (iii) Gonzalez, David, et al.",
"“A Review of Motion Planning Techniques for Automated Vehicles.” IEEE Transactions on Intelligent Transportation Systems 17.4 (2016): 1135-1145.Autonomous-driving control systems usually utilize algorithms such as machine learning, pattern recognition, neural network, machine vision, artificial intelligence, and/or probabilistic logic to calculate on the fly the probability of an imminent collision, or to calculate on the fly values that are indicative of the probability of an imminent collision (from which it is possible to estimate the probability of an imminent collision).",
"The algorithms usually receive as inputs the trajectory of the vehicle, measured locations of at least one nearby vehicle, information about the road, and/or information about environmental conditions.",
"Calculating the probability of an imminent collision is well known in the art, also for human driven vehicles, such as the anticipatory collision system disclosed in U.S. Pat.",
"No.",
"8,041,483 to Breed.",
"In order to calculate whether a Sudden Decrease in Ride Smoothness (SDRS) event is imminent, the autonomous-driving control system may compare parameters describing the state of the vehicle at time t1 with parameters describing the state of the vehicle at time t2 that is shortly after t1.If the change in one or more of the parameters reaches a threshold (such as deceleration above a certain value, change of height in the road above a certain value, and/or an angular acceleration above a certain value) then it may be determined that an SDRS event is imminent.",
"An “occupant” of a vehicle, as the term is used herein refers to a person that is in the vehicle when it drives.",
"The term “occupant” refers to a typical person having a typical shape, such as a 170 cm tall human (herein “cm” refers to centimeters).",
"An occupant may be a driver, having some responsibilities and/or control regarding the driving of the vehicle (e.g., in a vehicle that is not completely autonomous), or may be a passenger.",
"When an embodiment refers to “the occupant of the vehicle”, it may refer to one of the occupants of the vehicle.",
"Stating that a vehicle has an “occupant” should not be interpreted that the vehicle necessarily accommodates only one occupant at a time, unless that is explicitly stated, such as stating that the vehicle is “designed for a single occupant”.",
"Herein, a “seat” may be any structure designed to hold an occupant travelling in the vehicle (e.g., in a sitting and/or reclining position).",
"A “front seat” is a seat that positions an occupant it holds no farther from the front of the vehicle than any other occupants of the vehicle are positioned.",
"Herein, sitting in a seat also refers to sitting on a seat.",
"Sitting in a seat is to be interpreted in this disclosure as occupying the space corresponding the seat, even if the occupant does so by assuming a posture that does not necessarily correspond to sitting.",
"For example, in some vehicles the occupant may be reclined or lying down, and in other vehicles the occupant may be more upright, such as when leaning into the seat in a half standing half seating position similar to leaning into a Locus Seat by Focal Upright LLC.",
"The interchangeable terms “environment outside the vehicle” and “outside environment” refer to the environment outside the vehicle, which includes objects that are not inside the vehicle compartment, such as other vehicles, roads, pedestrians, trees, buildings, mountains, the sky, and outer space.",
"A sensor “mounted to the vehicle” may be connected to any relevant part of the vehicle, whether inside the vehicle, outside the vehicle, to the front, back, top, bottom, and/or to a side of the vehicle.",
"A sensor, as used herein, may also refer to a camera.",
"The term “camera” refers herein to an image-capturing device that takes images of an environment.",
"For example, the camera may be based on at least one of the following sensors: a CCD sensor, a CMOS sensor, a near infrared (NIR) sensor, an infrared sensor (IR), and a device based on active illumination such as a LiDAR.",
"The term “video” refers to a series of images that may be provided in a fixed rate, variable rates, a fixed resolution, and/or dynamic resolutions.",
"The use of a singular “camera” should be interpreted herein as “one or more cameras”.",
"Thus, when embodiments herein are described as including a camera that captures video and/or images of the outside environment in order to generate a representation of the outside environment, the representation may in fact be generated based on images and/or video taken using multiple cameras.",
"Various embodiments described herein involve providing an occupant of the vehicle with representation of the outside environment, generated by a computer and/or processor, based on video taken by a camera.",
"In some embodiments, video from a single camera (e.g., which may be positioned on the exterior of the vehicle at eye level), may be sent to presentation to the occupant by the processor and/or computer following little, if any, processing.",
"In other embodiments, video from a single camera or multiple cameras is processed in various ways, by the computer and/or processor, in order to generate the representation of the outside environment that is presented to the occupant.",
"Methods and systems for stitching live video streams from multiple cameras, stitching live video streams with database objects and/or other video sources, transforming a video stream or a stitched video stream from one point of view to another point of view (such as for generating a representation of the outside environment for an occupant at eye level, or for generating a compartment view for a person standing outside the compartment), tracking the position of an HMD relative to a compartment, and presenting rendered images that are perfectly aligned with the outside world—are all known in the art of computer graphics, video stitching, image registration, and real-time 360° imaging systems.",
"The following publications are just a few examples of reviews and references that describe various ways to perform the video stitching, image registration, tracking, and transformations, which may be utilized by the embodiments disclosed herein: (i) Wang, Xiaogang.",
"“Intelligent multi-camera video surveillance: A review.” Pattern recognition letters 34.1 (2013): 3-19.",
"(ii) Szeliski, Richard.",
"“Image alignment and stitching: A tutorial.” Foundations and Trends® in Computer Graphics and Vision 2.1 (2006): 1-104.",
"(iii) Tanimoto, Masayuki.",
"“FTV: Free-viewpoint television.” Signal Processing: Image Communication 27.6 (2012): 555-570.",
"(iv) Ernst, Johannes M., Hans-Ullrich Doehler, and Sven Schmerwitz.",
"“A concept for a virtual flight deck shown on an HMD.” SPIE Defense+Security.",
"International Society for Optics and Photonics, 2016.",
"(v) Doehler, H-U., Sven Schmerwitz, and Thomas Lueken.",
"“Visual-conformal display format for helicopter guidance.” SPIE Defense+Security.",
"International Society for Optics and Photonics, 2014.",
"(vi) Sanders-Reed, John N., Ken Bernier, and Jeff Güell “Enhanced and synthetic vision system (ESVS) flight demonstration.” SPIE Defense and Security Symposium.",
"International Society for Optics and Photonics, 2008.And (vii) Bailey, Randall E., Kevin J. Shelton, and J. J. Arthur III.",
"“Head-worn displays for NextGen.” SPIE Defense, Security, and Sensing.",
"International Society for Optics and Photonics, 2011.A video that provides “representation of the outside environment” refers to a video that enables the average occupant, who is familiar with the outside environment, to recognize the location of the vehicle in the outside environment from watching the video.",
"In one example, the average occupant is a healthy 30 years old human who is familiar with the outside environment, and the threshold for recognizing a video as a “representation of the outside environment” is at least 20 correct recognitions of the outside environment out of 30 tests.",
"Herein, sentences such as “VST that represents a view of the outside environment from the point of view of the occupant”, or “VST representation of the outside environment, which could have been seen from the point of view of the occupant” refer to a video representing at least a portion of the outside environment, with a deviation of less than ±20 degrees from the occupant's point of view of the outside environment, and zoom in the range of 30% to 300% (assuming the occupant's unaided view is at 100% zoom level).",
"The VST may be generated based on at least one of the following resources: a video of the outside environment that is taken in real-time, a video of the outside environment that was taken in the past and is played/processed according to the trajectory of the vehicle, a database of the outside environment that is utilized for rendering the VST according to the trajectory of the vehicle, and/or a video that is rendered as function of locations of physical objects identified in the outside environment using detection and ranging systems such as RADAR and/or LIDAR.",
"Moreover, the term “video see-through (VST)” covers both direct representations of the outside environment, such as a video of the outside environment, and/or enriched video of the outside environment, such as captured video and/or rendered video of the outside environment presented together with one or more layers of virtual objects, as long as more than 20% of the average vehicle occupants, who are familiar with the outside environment, would be able to determine their location in the outside environment, while the vehicle travels, without using a map, and with a margin of error below 200 meters.",
"However, it is noted that showing a map that indicates the location of the vehicle on the driving path (such as from the start to the destination) is not considered herein as equivalent to the VST, unless the map includes all of the following properties: the map shows images of the path, the images of the path capture at least 5 degrees of the occupant's FOV at eye level, and the images of the path reflect the dynamics of the vehicle and change in a similar manner to a video taken by a camera mounted to the vehicle and directed to the outside environment.",
"Herein, “field of view (FOV) of the occupant to the outside environment” refers to the part of the outside environment that is visible to the occupant of a vehicle at a particular position and orientation in space.",
"In one example, in order for an occupant-tracking module to calculate the FOV to the outside environment of an occupant sitting in a vehicle compartment, the occupant-tracking module determines the position and orientation of the occupant's head.",
"In another example, in order for an occupant-tracking module to calculate the FOV of an occupant sitting in a vehicle compartment, the occupant-tracking module utilizes an eye tracker.",
"It is noted that sentences such as “a three dimensional (3D) video see-through (VST) that represents a view of the outside environment, which could have been seen from the point of view of the occupant had the FOV not been obstructed by at least a portion of the nontransparent element” cover also just one or more portions of the FOV, and are to be interpreted as “a three dimensional (3D) video see-through (VST) that represents a view of at least a portion of the outside environment, which could have been seen from the point of view of the occupant had at least some of the FOV not been obstructed by at least a portion of the nontransparent element”.",
"The term “display” refers herein to any device that provides a human user with visual images (e.g., text, pictures, and/or video).",
"The images provided by the display may be two-dimensional or three-dimensional images.",
"Some non-limiting examples of displays that may be used in embodiments described in this disclosure include: (i) screens and/or video displays of various devices (e.g., televisions, computer monitors, tablets, smartphones, or smartwatches), (ii) headset- or helmet-mounted displays such as augmented-reality systems (e.g., HoloLens), virtual-reality systems (e.g., Oculus rift, HTC Vive, or Samsung GearVR), and mixed-reality systems (e.g., Magic Leap), and (iii) image projection systems that project images on a occupant's retina, such as: Virtual Retinal Displays (VRD) that create images by scanning low power laser light directly onto the retina, or light-field technologies that transmit light rays directly into the eye.",
"Various embodiments may include a reference to elements located at eye level.",
"The “eye level” height is determined according to an average adult occupant for whom the vehicle was designed, who sits straight and looks to the horizon.",
"Sentences in the form of “an element located at eye level of an occupant who sits in a vehicle” refer to the element and not to the occupant.",
"The occupant is used in such sentences in the context of “eye level”, and thus claims containing such sentences do not require the existence of the occupant in order to construct the claim.",
"Sentences such as “SAEDP located at eye level”, “stiff element located at eye level”, and “crumple zone located at eye level” refer to elements that are located at eye level, but may also extended to other levels, such as from sternum level to the roof level, from floor level to eye level, and/or from floor level to roof level.",
"For example, an SAEDP located at an eye level can extend from sternum level to above the occupant's head, such that at least a portion of the SAEDP is located at the eye level.",
"Herein, “normal driving” refers to typical driving conditions, which persist most of the time the vehicle is in motion.",
"During normal driving the probability of a collision is below a threshold that when reached typically involves one or more of the following actions: deployment of safety devices that are not usually deployed (e.g., inflating airbags), taking evasive action to avoid a collision, and warning occupants of the vehicle about an imminent event that may cause a Sudden Decrease in Ride Smoothness (SDRS).",
"A Shock-Absorbing Energy Dissipation Padding (SAEDP) is an element that may be used to cushion impact of a body during a collision or during SDRS events.",
"Various types of SAEDPs may be used in embodiments described herein, such as passive materials, airbags, and pneumatic pads.",
"Some examples of passive materials that may be used for the SAEDP in one or more of the disclosed embodiments include one or more of the following materials: CONFOR® foam by Trelleborg Applied Technology, Styrofoam by The Dow Chemical Company, Micro-Lattice Materials and/or Metallic Microlattices (such as by HRL Laboratories in collaboration with researchers at University of California and Caltech), non-Newtonian energy Absorbing materials (such as D30® by D30 lab, and DEFLEXION™ by Dow Corning®), Sorbothane® by Sorbothane Incorporated, and padding that includes compression cells and/or shock absorbers of the Xenith LLC type (such as described in U.S. Pat.",
"No.",
"8,950,735 and US patent application num.",
"20100186150), and materials that include rubber such as a sponge rubber.",
"The term “stiff element” refers to a material having stiffness and impact resistance equal or greater than that of glazing materials for use in motor vehicles as defined in the following two standards: (i) “American National Standard for Safety Glazing Materials for Glazing Motor Vehicles and Motor Vehicle Equipment Operating on Land Highways-Safety Standard” ANSI/SAE Z26.1-1996, and (ii) The Society of Automotive Engineers (SAE) Recommended Practice J673, revised April 1993, “Automotive Safety Glasses” (SAE J673, rev.",
"April 93).",
"The term “stiff element” in the context of low speed vehicles refers to a material having stiffness and impact resistance equal or greater than that of glazing materials for use in low speed motor vehicles as defined in Federal Motor Vehicle Safety Standard 205—Glazing Materials (FMVSS 205), from 49 CFR Ch.",
"V (10-1-04 Edition).",
"The stiff element may be transparent (such as automotive laminated glass, or automotive tempered glass) or nontransparent (such as fiber-reinforced polymer, carbon fiber reinforced polymer, steel, or aluminum).",
"Herein, a nontransparent element is defined as an element having Visible Light Transmittance (VLT) between 0% and 20%, which does not enable the occupant to recognize what lies on the other side of it.",
"For example, a thick ground glass usually allows light to pass through it but does not let the occupant recognize the objects on the other side of it, unlike plain tinted glass that usually lets the occupant recognize the objects on the other side of it, even when it features VLT below 10%.",
"The nontransparent element includes an opaque element having VLT of essentially 0% and includes a translucent element having VLT below 20%.",
"VLT is defined as the amount of incident visible light that passes through the nontransparent element, where incident light is defined as the light that strikes the nontransparent element.",
"VLT is also known as Luminous Transmittance of a lens, a light diffuser, or the like, and is defined herein as the ratio of the total transmitted light to the total incident light.",
"The common clear vehicle windshield has a VLT of approximately 85%, although US Federal Motor Vehicle Safety Standard No.",
"205 allows the VLT to be as low as 70%.",
"Sentences such as “video unrelated to the VST (VUR)” mean that an average occupant would not recognize the video as a representation of the outside environment.",
"In some embodiments, the content of the VUR does not change as function of the position of the occupant's head, which means that the point of view from which the occupant watches the VUR does not change essentially when the occupant's head moves.",
"Herein, stabilization effects, image focusing, dynamic resolution, color corrections, and insignificant changes to less than 10% of the frame as function of the position of the occupant's head—are still considered as content that does not change as function of the position of the occupant's head.",
"Examples of such content (common in the year 2016) include cinema movies, broadcast TV shows, standard web browsers, and Microsoft Office 2016 applications (such as Word, Excel and PowerPoint).",
"Herein, a “crumple zone” refers to a structure designed to slow down inertia and absorb energy from impact during a traffic collision by controlled deformation.",
"The controlled deformation absorbs some of the impact within the outer parts of the vehicle, rather than being directly transferred to the occupants, while also preventing intrusion into and/or deformation of the compartment.",
"Crumple zone may be achieved by various configurations, such as one or more of the following exemplary configurations: (i) by controlled weakening of sacrificial outer parts of the vehicle, while strengthening and increasing the stiffness of the inner parts of the vehicle, such as by using more reinforcing beams and/or higher strength steels for the compartment; (ii) by mounting composite fiber honeycomb or carbon fiber honeycomb outside the compartment; (iii) by mounting an energy absorbing foam outside the compartment; and/or (iv) by mounting an impact attenuator that dissipates impact.",
"In order to enable an occupant of a vehicle to view the outside environment, without needing to look out of a physical window, some aspects of this disclosure involve systems that combine video see-through (VST) with video-unrelated-to-the-VST (VUR).",
"In one embodiment, a system configured to combine video see-through (VST) with video-unrelated-to-the-VST (VUR) includes a head-mounted display (HMD), a camera, an HMD tracking module and a computer.",
"The HMD is configured to be worn by an occupant of a compartment of a moving vehicle and to present an HMD-video to the occupant.",
"The camera, which is mounted to the vehicle, is configured to take video of the outside environment (Vout).",
"The HMD tracking module is configured to calculate position of the HMD relative to the compartment, based on measurements of a sensor.",
"The computer is configured to receive a location of a video see-through window (VSTW) in relation to the compartment, and to calculate, based on the position of the HMD relative to the compartment, a window-location for the VSTW on the HMD-video.",
"Additionally, the computer is further configured to generate, based on the window-location and the Vout, the VST that represents a view of the outside environment from the point of view of the occupant.",
"The computer is also configured to generate the HMD-video based on combining the VUR with the VST in the window-location.",
"It is to be noted that the content of the VUR is unrelated to the video taken by the camera.",
"In one embodiment, a system configured to combine video see-through (VST) with video-unrelated-to-the-VST (VUR) includes at least the following components: a head-mounted display (HMD), such as HMD 15, a camera (e.g., camera 12), an HMD tracking module 27, and a computer 13.FIG.",
"1 provides a schematic illustration of at least some of the relationships between the components mentioned above.",
"The HMD 15 is configured to be worn by an occupant of a compartment of a moving vehicle and to present an HMD-video 16 to the occupant.",
"In one embodiment, the HMD 15 is an augmented-reality (AR) HMD.",
"In another embodiment, the HMD 15 is a virtual reality (VR) HMD.",
"Optionally, in this embodiment, the system further comprises a video camera mounted to the VR HMD, and the VST video comprises video of the compartment received from the video camera mounted to the VR HMD.",
"In yet another embodiment, the HMD 15 is a mixed reality HMD.",
"The term “Mixed Reality” (MR) as used herein involves a system that is able to combine real world data with virtual data.",
"Mixed Reality encompasses Augmented Reality and encompasses Virtual Reality that does not immerse its user 100% of the time in the virtual world.",
"Examples of mixed reality HMDs include, but are not limited to, Microsoft HoloLens HMD and MagicLeap HMD.",
"The camera 12, which is mounted to the vehicle, is configured to take video of the outside environment (Vout).",
"Optionally, the data captured by the camera comprises 3D data.",
"For example, the camera may be based on at least one of the following sensors: a CCD sensor, a CMOS sensor, a near infrared (NIR) sensor, an infrared sensor (IR), and a device based on active illumination such as a LiDAR.",
"The HMD tracking module 27 is configured to calculate position of the HMD 15 relative to the compartment, based on measurements of a sensor.",
"In different embodiments, the HMD tracking module 27 may have different configurations.",
"In one embodiment, the sensor comprises first and second Inertial Measurement Units (IMUs).",
"In this embodiment, the first IMU is physically coupled to the HMD 15 and is configured to measure a position of the HMD 15, and the second IMU is physically coupled to the compartment and is configured to measure a position of the compartment.",
"The HMD tracking module 27 is configured to calculate the position of the HMD 15 in relation to the compartment based on the measurements of the first and second IMUs.",
"In another embodiment, the sensor comprises an Inertial Measurement Unit (IMU) and a location measurement system.",
"In this embodiment, the IMU is physically coupled to the HMD 15 and is configured to measure an orientation of the HMD 15.The location measurement system is physically coupled to the compartment and is configured to measure a location of the HMD in relation to the compartment.",
"The HMD tracking module 27 is configured to calculate the position of the HMD 15 in relation to the compartment based on the measurements of the IMU and the location measurement system.",
"Optionally, the location measurement system measures the location of the HMD 15 in relation to the compartment based on at least one of the following inputs: a video received from a camera that captures the HMD 15, a video received from a stereo vision system, measurements of magnetic fields inside the compartment, wireless triangulation measurements, acoustic positioning measurements, and measurements of an indoor positioning systems.",
"FIG.",
"2 illustrates one embodiment in which the HMD tracking module 27 is physically coupled to the compartment and is configured to measure the position of the HMD relative to the compartment.",
"The HMD tracking module 27 may utilize a passive camera system, an active camera system that captures reflections of a projected grid, and/or a real-time locating systems based on microwaves and/or radio waves.",
"The computer 13 is configured to receive a location of a video see-through window (VSTW) in relation to the compartment, and to calculate, based on the position of the HMD relative to the compartment, a window-location for the VSTW on the HMD-video.",
"The computer 13 is also configured to generate, based on the window-location and the Vout, the VST that represents a view of the outside environment from the point of view of the occupant.",
"Optionally, the VST is rendered as a 3D video content.",
"Additionally, the computer 13 is further configured to generate the HMD-video 16 based on combining the VUR with the VST in the window-location.",
"The computer 13 may use various know in the art computer graphics functions and/or libraries to generate the VST, transform the VST to the occupant's point of view, render the 3D video content, and/or combine the VUR with the VST.",
"In one embodiment, the content of the VUR does not change when the occupant moves the head, and the content of the VUR is unrelated to the video taken by the camera.",
"Additionally, the content of the VUR is generated based on data that was received more than 2 seconds before the HMD-video 16 is displayed to the occupant.",
"Some examples of the VUR include a video stream of at least one of the following types of content: a recorded television show, a computer game, an e-mail, and a virtual computer desktop.",
"FIG.",
"3 illustrates one embodiment in which the occupant 14 wears an HMD 15.The HMD 15 provides video to the occupant 14 through the display of the HMD 15.The vehicle includes a camera 12 that takes video of the outside environment 11a and processes it in a manner suitable for the location of the occupant.",
"The processed video is provided to the occupant's display in the HMD 15 as a VSTW and the position of the VSTW is calculated in relation to the compartment of the vehicle and moves with the compartment.",
"While the vehicle is in motion, the VSTW change its content to represent the outside environment 11a of the vehicle.",
"Whereas the video-unrelated-to-the-VST doesn't change when the occupant moves his head.",
"The computer is configured to receive a location of a VSTW in relation to the compartment, and to calculate, based on the position of the occupant's head, a window-location for the VSTW on the video.",
"FIG.",
"4 illustrates one embodiment in which the occupant 44 wears HMD 45 and views large VUR 40 and smaller VST 41a.",
"The VUR 40 does not change when the occupant's head 44 moves.",
"The VSTW presents video of the street based on video taken by the camera that is mounted to the vehicle.",
"The location of the video-see-through window in relation to the compartment does not change when the occupant 44 moves his/her head in order to imitate a physical window that does not change its position relative to the compartment when the occupant's head moves.",
"FIG.",
"5a illustrates how, in one embodiment, the VST moves to the upper left when the occupant 44 looks to the bottom right.",
"FIG.",
"5b illustrates how the VST moves to the bottom right when the occupant 44 looks to the upper left, while the VUR moves with the head.",
"In both cases, the VUR moves with the head while the location of the VST changes according to the movement of the head relative to the compartment as measured by the HMD tracking module 27.In some embodiments, the content of the VUR may be augmented-reality content, mixed-reality content, and/or virtual-reality content rendered to correspond to the occupant's viewing direction.",
"In this embodiment, the VUR is unrelated to the video taken by the camera.",
"In one example, the VUR may include a video description of a virtual world in which the occupant may be playing a game (e.g., represented by an avatar).",
"Optionally, in this example, most of the features of the virtual world are different from the view of the outside of the vehicle (as seen from the occupant's viewing direction).",
"For example, the occupant may be driving in a city, while the virtual world displays woods, a meadow, or outer space.",
"In another example, the VUR may include augmented reality content overlaid above a view of the inside of the compartment.",
"In addition to the components described above, in some embodiments, the system may include a second camera that is mounted to the HMD and is configured to take video of the compartment (Vcomp).",
"In this embodiment, the computer is further configured to generate a compartment-video (CV), based on Vcomp and a location of a compartment-video window (CVW) in relation to the HMD-video (e.g., HMD-video 16), and to generate the HMD-video also based on the CV in the CVW, such that the HMD-video combines the VUR with the VST in the window-location and with the CV in the CVW.",
"There are various ways in which the CVW may be incorporated into the HMD-video.",
"Some examples of these approaches are illustrated in the following figures.",
"FIG.",
"6 illustrates HMD-video that includes both a non-transparent VST 55 in the window-location and a CV 56 that shows the hands of the occupant and the interior of the compartment in the CVW.",
"FIG.",
"7 illustrates HMD-video that includes both a partially transparent VST 57 in the window-location and the CV 56 that shows the hands of the occupant and the interior of the compartment in the CVW.",
"FIG.",
"8 illustrates HMD-video that includes a VST 58 and partially transparent CV 59.The figure illustrates that the occupant sees the outside environment in full field-of-view (FOV), while on top of it there is a partially transparent image (illustrated as dotted image) of the compartment and the hands of the occupant, in order to help the occupant not to hit things in the compartment.",
"FIG.",
"9a illustrates HMD-video that includes a VUR 70 in full FOV, a first window comprising the CV 71 in the CVW and a second smaller window comprising the VST 72 in the window-location.",
"FIG.",
"9b illustrates HMD-video that includes VUR 70 in full FOV, a first window comprising the CV 71 in the CVW and a second partially transparent smaller window comprising the VST 73 in the window-location.",
"FIG.",
"10a illustrates HMD-video that includes VUR 70 in full FOV, a first window comprising VST 75 in the window-location and a second smaller window comprising zoom out of the CV 76 in the CVW.",
"Optionally, the cabin view in the zoom out is smaller than in reality, and may enable the occupant to orient in the cabin.",
"Optionally, the occupant may move the CVW, as illustrated in FIG.",
"10a where the zoom out of the CV in the CVW is somewhat above its location in reality.",
"FIG.",
"10b illustrates HMD-video that includes VUR 70 and a partially transparent CV 72.Here a first occupant sees the VUR in full field-of-view (FOV), and on top of it there is a partially transparent image of the compartment and a second occupant that sits to the left of the first occupant, which may help the first occupant not to hit the second occupant.",
"There may be various ways in which the system determines the location and/or size of the VSTW.",
"In one embodiment, the VSTW is pinned to at least one of the following locations: a specific physical location and a location of an object in the compartment, such that the location of the VSTW in relation to the compartment does not change when the occupant moves his/her head with the HMD 15 as part of watching the HMD-video 16 and without commanding the VSTW to move in relation to the compartment.",
"In another embodiment, the system includes a user interface configured to receive a command from the occupant to move and/or resize the VSTW in relation to the compartment.",
"In one example, the command is issued through a voice command (e.g., saying “move VST to the bottom”).",
"In another example, the command may be issued by making a gesture, which is detected by a gesture control module in the compartment and/or on a device of the occupant (e.g., as part of the HMD).",
"Optionally, in this embodiment, the computer is further configured to: update the window-location based on the command from the occupant, and generate an updated VST based on the updated window-location and the video taken by the camera.",
"In this embodiment, the VST and the updated VST present different VSTW locations and/or dimensions in relation to the compartment.",
"Optionally, the HMD is configured not to present any part of the VST to the occupant when the window-location is not in the field of view presented to the occupant through the HMD.",
"In yet another embodiment, the system may further include a video analyzer configured to identify an Object Of Interest (OOI) in the outside environment.",
"For example, the OOI of interest may be a certain landmark (e.g., a building), a certain object (e.g., a store or a certain model of automobile), or a person.",
"In this embodiment, the computer is further configured to receive, from the video analyzer, an indication of the position of the OOI, and to track the OOI by adjusting the window-location according to the movements of the vehicle, such that the OOI is visible via the VST.",
"Optionally, the HMD is configured not to present any part of the VST to the occupant when the window-location is not in the field of view presented to the occupant through the HMD.",
"The VST that represents the view of the outside environment from the point of view of the occupant, in some embodiments, does not necessarily match the video taken by the cameras.",
"In one embodiment, the VST may utilize image enhancement techniques to compensate for outside lighting conditions, to give an occupant an experience similar to looking out through a conventional vehicle window but without the view being distorted by raindrops or dirt on the window, and/or to improve the visual impression of the outside environment e.g.",
"by showing background images which are different from those retrievable from the outside environment.",
"Additionally or alternatively, the VST may mimic the outside environment, alter the outside environment, and/or be completely different from what can be seen on the outside environment.",
"The VST may be focused on providing visual information that makes the travelling more fun.",
"The vehicle may provide different styles of the outside environment to different occupants in the vehicle, such that a first VST provided to a first occupant may mimic the outside environment, while a second VST provided to a second occupant may alter the outside environment and/or be completely different from the outside environment, optionally for comfort enhancement and/or entertainment.",
"In some embodiments, the VST is informative, and aids at least some of the occupants to determine the location of the vehicle in the environment.",
"In one embodiment, at least some of those occupants could not determine their location without the VST.",
"In one example, less than 20% of average vehicle occupants, who are familiar with the outside environment, are able to determine their real location in the outside environment by watching the VUR, without using a map, with a margin of error that is less than 100 meters, and while the vehicle travels; while more than 20% of the average vehicle occupants, who are familiar with the outside environment, are able to determine their real location in the outside environment by watching the VST, without using a map, and with a margin of error that is less than 100 meters, and while the vehicle travels.",
"FIG.",
"11a illustrates a FOV in the context of presented video and terminology used herein.",
"The vehicle occupant 200 wears an HMD 201 that presents HMD-video (such as HMD-video 16).",
"The HMD-video may be presented at a single focal plane, or at multiple focal planes, depending on the characteristics of the HMD 201 (when the occupant focuses on a certain focal plane, then his/her point of gaze is said to be on the certain focal plane).",
"In addition, the presented objects may be two-dimensional (2D) virtual objects and/or three-dimensional (3D) virtual objects that may also be referred to as holographic objects.",
"Element 204 represents the location of a nontransparent element fixed to the vehicle compartment.",
"In one example, the HMD 201 is a holographic HMD, such as Microsoft HoloLens, which can present content displayed on a series of focal planes that are separated by some distance.",
"The virtual objects may be presented before the nontransparent element (e.g., polygons 202, 203), essentially on the nontransparent element 204, and/or beyond the nontransparent element (e.g., polygons 205, 206).",
"As a result, the occupant's gaze distance may be shorter than the distance to the nontransparent element (e.g., distance to polygons 202, 203), essentially equal to the distance to the nontransparent element 204, and/or longer than the distance to the nontransparent element (e.g., distance to polygons 205, 206).",
"Polygon 207 represents a portion of the presented video at eye level of the vehicle occupant, which in one example is within ±7 degrees from the horizontal line of sight.",
"Although the figure illustrates overlapping FOVs of polygons 202, 203, 204, and 205, the HMD may show different objects, capturing different FOVs, at different focal planes.",
"In one example, the HMD may project an image throughout a portion of, or all of, a display volume.",
"Further, a single object such as a vehicle could occupy multiple volumes of space.",
"According to the terminology used herein, the nontransparent element 204 is said to be located on FOV overlapping the FOV of polygons 205 and 203 because polygons 203, 204, 205 share the same FOV.",
"FOV of polygon 206 is contained in the FOV of polygon 204, and FOV of polygon 207 intersects the FOV of polygon 204.FOV of polygon 203 is before the nontransparent element 204 and therefore may hide the nontransparent element 204 partially or entirely, especially when utilizing a multi-focal plane HMD.",
"FIG.",
"11b illustrates a FOV in the context of the presented video, where the vehicle occupant 210 does not wear an HMD that presents the video, such as when watching an autostereoscopic display.",
"The autostereoscopic display is physically located on plane 214 and the presented video may be presented at a single focal plane, or at multiple focal planes, depending on the characteristics of the autostereoscopic display.",
"In one example, the autostereoscopic display is a holographic display, such as SeeReal Technologies holographic display, where the presented video may present virtual objects before the focal plane of the autostereoscopic display (e.g., planes 212, 213), essentially on the focal plane of the autostereoscopic display 214, and/or beyond the focal plane of the autostereoscopic display (e.g., planes 215, 216).",
"As a result, the occupant's gaze distance may be shorter than the distance to the autostereoscopic display (e.g., planes 212, 213), essentially equal to the distance to the autostereoscopic display 214, and/or longer than the distance to the autostereoscopic display (e.g., planes 215, 216).",
"The term “autostereoscopic” includes technologies such as automultiscopic, glasses-free 3D, glassesless 3D, parallax barrier, integral photography, lenticular arrays, Compressive Light Field Displays, holographic display based on eye tracking, color filter pattern autostereoscopic display, volumetric display that reconstructs light field, integral imaging that uses a fly's-eye lens array, and/or High-Rank 3D (HR3D).",
"FIG.",
"11c illustrates FOV of a 3D camera that is able to capture sharp images from different focal lengths.",
"In some embodiments, the vehicle and/or the HMD utilize at least one Inertial Measurement Unit (IMU), and the system utilizes an Inertial Navigation System (INS) to compensate imperfections in the IMU measurements.",
"An INS typically has one or more secondary navigation sensors that provide direct measurements of the linear velocity, position and/or orientation of the vehicle.",
"These secondary navigation sensors could be anything from stereo vision systems, to GPS receivers, to digital magnetic compasses (DMCs) or any other type of sensor that could be used to measure linear velocity, position and/or orientation.",
"In one example, the information from these secondary navigation sensors is incorporated into the INS using an Extended Kalman Filter (EKF).",
"The EKF produces corrections that are used to adjust the initial estimations of linear velocity, position and orientation that are calculated from the imperfect IMU measurements.",
"Adding secondary navigation sensors into an INS can increase its ability to produce accurate estimations of the linear velocity, position and orientation of the vehicle over long periods of time.",
"In one embodiment, the system utilizes domain specific assumptions in order to reduce drift of an INS used to calculate the HMD spatial position in relation to the compartment.",
"More specifically, the following methods may be used to reduce or correct drift.",
"Such methods generally fall in the categories of using sensor fusion and/or domain specific assumptions.",
"(i) Sensor fusion refers to processes in which signals from two or more types of sensors are used to update and/or maintain the state of a system.",
"In the case of INS, the state generally includes the orientation, velocity and displacement of the device measured in a global frame of reference.",
"A sensor fusion algorithm may maintain this state using IMU accelerometer and gyroscope signals together with signals from additional sensors or sensor systems.",
"There are many techniques to perform sensor fusion, such as Kalman filter and particle filter.",
"One example of periodically correcting drift is to use position data from a triangulation positioning system relative to the compartment.",
"Such systems try to combine the drift free nature of positions obtained from the triangulation positioning system with the high sampling frequency of the accelerometers and gyroscopes of the IMU.",
"Roughly speaking, the accelerometer and gyroscope signals are used to ‘fill in the gaps’ between successive updates from the triangulation positioning system.",
"Another example of reducing the drift is using a vector magnetometer that measures magnetic field strength in a given direction.",
"The IMU may contain three orthogonal magnetometers in addition to the orthogonal gyroscopes and accelerometers.",
"The magnetometers measure the strength and direction of the local magnetic field, allowing the north direction to be found.",
"(ii) In some embodiments, it is possible to make domain specific assumptions about the movements of the occupant and/or the vehicle.",
"Such assumptions can be used to minimize drift.",
"One example in which domain specific assumptions may be exploited is the assumption that when the vehicle accelerates or decelerates significantly, the HMD accelerates or decelerates essentially the same as the vehicle, allowing HMD drift in velocity to be periodically corrected based on a more accurate velocity received from the autonomous-driving control system of the vehicle.",
"Another example in which domain specific assumptions may be exploited is the assumption that when the vehicle accelerates or decelerates significantly, the HMDs of two occupants travelling in the same vehicle accelerate or decelerate essentially the same, allowing HMD drifts to be periodically corrected based on comparing the readings of the two HMDs.",
"Still another example in which domain specific assumptions are exploited is the assumption that the possible movement of an HMD of a belted occupant is most of the time limited to a portion of the compartment, allowing HMD drifts to be periodically corrected based on identifying when the HMD exceeds beyond that portion of the compartment.",
"In one example, it may be desirable to adjust the position of displaying a virtual object in response to relative motion between the vehicle and the HMD so that the virtual object would appear stationary in location.",
"However, the HMD IMU may indicate that the HMD is moving even when the detected motion is a motion of the vehicle carrying the HMD.",
"In order to distinguish between motion of the HMD caused by the vehicle and motion of the HMD relative to the vehicle, non-HMD sensor data may be obtained by the HMD from sensor such as an IMU located in the vehicle and/or the GPS system of the vehicle, and the motion of the vehicle may be subtracted from the motion of the HMD in order to obtain a representation of the motion of the MID relative to the vehicle.",
"By differentiating movements of the HMD caused by the occupant motion compared to movements caused by the vehicle motion, the rendering of the virtual object may be adjusted for the relative motion between the HMD and the vehicle.",
"Using the nontransparent element, instead of a transparent glass window that provides the same FOV to the outside environment, may provide various benefits, such as: (i) reduced manufacturing cost of the vehicle compared to a similar vehicle having instead of the nontransparent element a transparent glass window that provides the same FOV to the outside environment as provided by the 3D display device, (ii) reduced weight of the vehicle compared to a similar vehicle having instead of the nontransparent element a transparent glass window that provides the same FOV to the outside environment as provided by the 3D display device, and provides the same safety level, (iii) better aerodynamic shape and lower drag for the vehicle, which results in an improved energy consumption, and (iv) improved privacy for the occupant as a result of not enabling an unauthorized person standing nearby the vehicle to see the occupant directly.",
"The term “real-depth VST window (VSTW)” is defined herein as an imaging display that shows a 3D image of an outside environment located beyond a wall that interrupts the occupant's unaided view of the outside environment.",
"The real-depth VSTW has the following characteristics: (i) the 3D image corresponds to a FOV to the outside environment beyond the wall, as would have essentially been seen by the occupant had the wall been removed; (ii) the outside environment is captured by a camera, and the rendering of the 3D image is based on images taken by the camera; and (iii) while looking via the imaging display, the occupant's point of gaze (where one is looking) is most of the time beyond the wall that interrupts the occupant's unaided view of the outside environment.",
"A possible test to determine whether “(i) the 3D image corresponds to a FOV to the outside environment beyond the wall, as would have essentially been seen by the occupant had the wall been removed” is whether an imaginary user standing beyond the wall, watching both the real-depth VSTW and the outside environment, would recognize that at least 20% of the contours of objects in the 3D image correspond to the contours of the objects seen on the outside environment.",
"Differences between the colors of the corresponding objects in the 3D image and the outside environment usually do not affect the criterion of the 20% corresponding contours, as long as the color difference does not affect the perception of the type of object.",
"For example, different skin colors to corresponding people in the 3D image and the outside environment do not violate the criterion of the 20% corresponding contours.",
"As another example, differences in the weight and/or height of corresponding objects in the 3D image and the outside environment do not violate the criterion of the 20% corresponding contours as long as the imaginary user understands that the objects correspond to the same person.",
"Sentences such as “from the FOV of the occupant” are to be interpreted as no more than 20 degrees angular deviation from the field of view of the occupant to the outside environment.",
"Zoom in/out does not affect the FOV as long as the average occupant would still recognize the rendered environment as the 3D VST.",
"For example, zoom in of up to ×4, which maintains no more than 20 degrees angular deviation from the FOV of the occupant to the outside environment, is still considered “from the FOV of the occupant”.",
"Reasonable lateral deviation essentially does not affect the FOV as long as the average occupant would still recognize the rendered environment as the 3D VST.",
"For example, displaying to the occupant the outside environment from the FOV of a camera located on the roof of the occupant's vehicle, is still considered as showing the outside environment from the occupant's FOV.",
"A possible test to determine whether “(ii) the outside environment is measured by a camera, and the images taken by the camera are used to render the 3D image” is whether the real-depth VSTW would display a different 3D VST when it does not receive the images taken by the camera.",
"For example, assuming the camera is a 3D video camera, and the 3D image is a manipulation of the images taken by the 3D video camera; then, when the real-depth VSTW does not receive the images, it cannot show the changes that are taking place in the outside environment.",
"As another example, assuming the 3D image is mainly rendered from cached data stored in a database, and the camera is used to provide the setup of objects that behave in an unknown way, such as trajectories of nearby vehicles on the road, or a gesture of a person walking beyond the wall; then, when the output of the camera is used to render the 3D image, the real-depth VSTW would represent the unknown trajectory of the nearby vehicles or the unknown gesture of the person, while when the output of the camera is not used to render the 3D image, the real-depth VSTW would not represent the unknown trajectory of the nearby vehicles or the unknown gesture of the person merely because the renderer does not have that data.",
"A possible test to determine whether “(iii) the occupant's point of gaze (where one is looking) is most of the time beyond the wall that interrupts the occupant's unaided view of the outside environment” includes the following steps: (a) use eye tracker to determine the point of gaze on a representative scenario, (b) measure the distance to the wall, and (c) determine whether the average gaze distance is longer than the distance to the wall.",
"Some aspects of this disclosure involve a system that utilizes window shading of a vehicle window in order to improve the quality of video viewed by an occupant of the vehicle who wears a head-mounted display (HMD).",
"In one embodiment, an autonomous on-road vehicle includes a system configured to enable an HMD to cooperate with a window light shading module.",
"This embodiment involves a light shading module, a camera, a processor, and the HMD.",
"The light shading module is integrated with a vehicle window and is configured to be in at least one of first and second states.",
"In the first state the Visible Light Transmittance (VLT) of the vehicle window is above 10% of ambient light entering through the window, in the second state the VLT of the vehicle window is below 50% of ambient light entering through the window, and the VLT of the vehicle window in the first state is higher than the VLT of the vehicle window in the second state.",
"The camera is fixed to the vehicle and configured to take video of the outside environment.",
"The processor is configured to generate, based on the video, a video see-through (VST) that represents the outside environment from a point of view of an occupant looking to the outside environment through at least a portion of the vehicle window.",
"The HMD comprises an optical see-through component and a display component; the HMD is configured to operate according to a first mode of operation when the occupant looks at the direction of the vehicle window and the light shading module is in the first state, and to operate according to a second mode of operation when the occupant looks at the direction of the vehicle window and the light shading module is in the second state.",
"Wherein the total intensity of the VST light, emitted by the display component and reaching the occupant's eyes, is higher in the second mode than in the first mode.",
"In one embodiment, a system configured to enable a head-mounted display (HMD) to cooperate with a window light shading module of an autonomous on-road vehicle includes at least the following elements: the HMD 62, a light shading module 61, a camera (such as camera 12), and a processor 18.FIG.",
"12 is a schematic illustration of at least some of the relationships between the system elements mentioned above.",
"The light shading module 61 is integrated with a vehicle window and is configured to be in at least one of first and second states.",
"Optionally, the light shading module 61 covers more than half of the front windshield in the second state.",
"In one embodiment, in the first state, the Visible Light Transmittance (VLT) of the vehicle window is above 10% of ambient light entering through the window, and in the second state, the VLT of the vehicle window is below 50% of ambient light entering through the window.",
"Additionally, the VLT of the vehicle window in the first state is higher than the VLT of the vehicle window in the second state.",
"In another embodiment, in the first state the VLT of the vehicle window is above 70% of ambient light entering through the window, and in the second state, the VLT of the vehicle window is below 30% of ambient light entering through the window.",
"Herein, “ambient light” in the context of a vehicle refers to visible light that is not controlled by the vehicle, such as light arriving from: the sun, lights of other vehicles, street/road lighting, and various reflections from elements such as windows.",
"In some embodiments, utilizing the light shading module 61 may improve the quality of images viewed via the HMD 62 when the light shading module 61 is in the second state.",
"Optionally, the perceived contrast of the optical see-through component is better when the light shading module is in the second state compared to when the light shading module 61 is in the first state.",
"Various types of light shading modules may be utilized in embodiments described herein.",
"In one embodiment, the light shading module 61 is a movable physical element configured to reduce the intensity of the ambient light entering into the vehicle compartment through the vehicle window.",
"Optionally, the light shading module is unfurled on the inside of the compartment in order to block at least 50% of the ambient light intensity.",
"Optionally, the light shading module is unfurled on the outside of the compartment in order to block at least 50% of the ambient light intensity.",
"FIG.",
"13a illustrates a first mode where the occupant sees the outside environment through the optical see-through component.",
"This figure illustrates the view that the occupant sees when looking outside through the window.",
"FIG.",
"13b illustrates a second mode where the occupant sees the outside environment through the VST.",
"In this example, the outside environment is a bit different, and there is also a virtual Superman floating near the tree.",
"In another embodiment, the light shading module 61 may be a curtain.",
"FIG.",
"14 illustrates a VST over a curtain.",
"FIG.",
"15 illustrates a light shading module that is unfurled on the inside of the compartment.",
"FIG.",
"16 illustrates a light shading module that is unfurled on the outside of the compartment.",
"And in yet another embodiment, the vehicle window is made of a material that is able to serve as the light shading module 61 by changing its transparency properties.",
"The camera is fixed to the vehicle, and configured to take video of the outside environment.",
"For example, the camera may be based on at least one of the following sensors: a CCD sensor, a CMOS sensor, a near infrared (NIR) sensor, an infrared sensor (IR), and a device based on active illumination such as a LiDAR.",
"The processor is configured to generate, based on the video, a video see-through (VST 19) that represents the outside environment from a point of view of an occupant looking to the outside environment through at least a portion of the vehicle window.",
"Optionally, the processor is further configured not to generate the VST 19 when the HMD 62 operates in the first mode.",
"The HMD 62 comprises an optical see-through component and a display component.",
"Optionally, the HMD 62 is configured to operate according to a first mode of operation when the occupant looks at the direction of the vehicle window and the light shading module 61 is in the first state, and to operate according to a second mode of operation when the occupant looks at the direction of the vehicle window and the light shading module 61 is in the second state.",
"The total intensity of the VST light, emitted by the display component and reaching the occupant's eyes, is higher in the second mode than in the first mode.",
"In one embodiment, in the first mode, intensity of light that reaches the occupant's eyes via the optical see-through component is higher than intensity of light from the VST that is emitted by the display component and reaches the occupant's eyes.",
"And in the second mode, the intensity of light from the environment that reaches the occupant's eyes via the optical see-through component is lower than the intensity of light from the VST that is emitted by the display component and reaches the occupant's eyes.",
"In one example, the total intensity of VST light, emitted by the display component and reaching the occupant's eyes, is at least 50% higher in the second mode than in the first mode.",
"In some embodiments, the display component may be based on a digital display that produces the virtual image (such as in Oculus rift), direct retina illumination (such as in Magic Leap), or other methods that are capable of producing the virtual image.",
"In one embodiment, the system described above optionally includes an occupant tracking module configured to calculate the point of view of the occupant based on measurements of a sensor.",
"Optionally, the occupant tracking module is the HMD tracking module 27.Optionally, in this embodiment, the processor is further configured to render the VST based on data received from the occupant tracking module.",
"Optionally, the display is a three dimensional (3D) display configured to show the occupant the VST, such that point of gaze of the occupant, while looking via the 3D display device, is most of the time beyond the location of the light shading module 61.In some embodiments, an occupant of a vehicle may have the opportunity to view video see-through (VST), which is video generated based on video of the environment outside the vehicle.",
"VST can often replace the need to look out of a window (if the vehicle has windows).",
"Some examples of scenarios in which VST may be available in a vehicle include a windowless vehicle, a vehicle with shaded windows having VLT below 30%, and/or when the occupant wears a VR headset.",
"While traveling in such a vehicle, the occupant may benefit from gaining a view to the outside environment when an unexpected driving event occurs.",
"By being made aware of the event, the occupant is less likely to be surprised, disturbed, and/or distressed by the event.",
"While traveling in a vehicle, an occupant of the vehicle may not always be aware of the environment outside and/or of what actions the vehicle is about to take (e.g., breaking, turning, or hitting a speedbump).",
"Thus, if such an event occurs without the occupant being aware that it is about to happen, this may cause the occupant to be surprised, disturbed, distressed, and even physically thrown off balance (in a case where the event involves a significant change in the balance of the physical forces on the occupant).",
"This type of event is typically referred to herein as a Sudden Decrease in Ride Smoothness (SDRS) event.",
"Some examples of SDRS events include at least one of the following events: hitting a speed bump, driving over a pothole, climbing on the curb, making a sharp turn, a hard breaking, an unusual acceleration (e.g., 0-100 km/h in less than 6 seconds), and starting to drive after a full stop.",
"In some embodiments, an SDRS event takes place at least 2 minutes after starting to travel and it is not directly related to the act of the starting to travel.",
"Additionally, the SDRS event takes place at least 2 minutes before arriving to the destination and is not directly related to the act of arriving at the destination.",
"In one example, a sentence such as “an SDRS event is imminent” refers to an SDRS event that is: (i) related to traveling in the vehicle, and (ii) expected to happen in less than 30 seconds, less than 20 seconds, less than 10 seconds, or less than 5 seconds.",
"In another example, a sentence such as “an SDRS event is imminent” may refer to an event that starts at that instant, or is about to start within less than one second.",
"The following is a description of an embodiment of a video system that may be used to increase awareness of an occupant of a vehicle regarding an imminent SDRS.",
"In one embodiment, a video system for an autonomous on-road vehicle includes at least autonomous-driving control system 65, a camera (such as camera 12), a processor (such as processor 18), and video module 66.FIG.",
"17 is a schematic illustration of at least some of the relationships between the system elements mentioned above.",
"The autonomous-driving control system 65 is configured to generate, based on trajectory of the vehicle and information about the road, an indication indicative of whether a Sudden Decrease in Ride Smoothness (SDRS) event is imminent.",
"Optionally, the autonomous-driving control system 65 receives at least some of the information about the road from at least one of the following sources: sensors mounted to the vehicle, sensors mounted to nearby vehicles, an autonomous-driving control system 65 used to drive a nearby vehicle, and a database comprising descriptions of obstacles in the road that are expected to cause intense movement of the vehicle.",
"In one example, the database comprising the descriptions of the obstacles includes one or more of the following types of data: locations of speed bumps, locations of potholes, locations of stop signs, and locations of sharp turns in the road.",
"In one embodiment, the autonomous-driving control system 65 is configured to generate the indication indicative of whether an SDRS event is imminent based on at least one of the following configurations: (i) the autonomous-driving control system 65 receives images of the road from a camera, and calculates the indication based on the vehicle trajectory and image analysis of the images, (ii) the autonomous-driving control system 65 receives from a radar reflections of electromagnetic waves from the road, and calculates the indication based on the vehicle trajectory and signal processing of the reflections, and (iii) the autonomous-driving control system 65 receives a notification from a detailed road map, and calculates the indication based on the vehicle trajectory and the notification.",
"The camera, which is mounted to the vehicle, is configured to take video of the environment outside the vehicle.",
"Optionally, the data captured by the camera comprises 3D data.",
"The processor is configured to generate a video see-through (VST) based on the video taken by the camera.",
"The video module 66 is configured to select a first mode of presentation, in which a video-unrelated-to-the-VST (VUR) is presented on the foveal vision region of the occupant, at eye level, responsive to the indication not indicating that an SDRS event is imminent.",
"The video module 66 is further configured to select a second mode of presentation, in which the VST is presented on the foveal vision region of the occupant, at eye level, responsive to the indication indicating that an SDRS event is imminent.",
"Optionally, the VST captures more than 50% of the foveal vision region of the occupant in the second mode of presentation.",
"In some embodiments, presenting video on the foveal vision region comprises presenting images with at least 50% transparency.",
"Herein, “foveal vision” refers to an angle of about 5° of the sharpest field of vision.",
"In one embodiment, in the first mode of presentation, the VUR is presented on the foveal vision region of the occupant with opacity A, and the VST is presented on the foveal vision region of the occupant with opacity B, where A>B>0.Optionally, a normalized opacity parameter takes a value from 0.0 to 1.0, and the lower the value the more transparent the video is.",
"In this embodiment, in the second mode of presentation, the VUR is presented on the foveal vision region of the occupant with opacity A′, and the VST is presented on the foveal vision region of the occupant with opacity B′, where B′>B and B′>A′.",
"In optional embodiments, one or more of the following values may be true: A′>0, B=0, and A′=0.Herein, “partially transparent” refers to opacity below one and above zero.",
"Having the VST presented when an SDRS event is imminent can make the occupant be aware and prepared for the SDRS event.",
"Thus, the occupant is less likely to be startled, distressed, and/or physically thrown off balance by the SDRS event.",
"In one example, the SDRS event involves hitting a speedbump, while the occupant views a movie.",
"About 5 seconds prior to hitting the speedbump, a partially transparent window displaying VST in which the speedbump is highlighted (e.g., flashing red) is presented on the foveal vision region of the occupant for a couple seconds (e.g., by being presented in the center of the movie).",
"This way upon hitting the speedbump, the occupant is not startled by the event.",
"In another example, the autonomous-driving control system 65 determines that a “hard breaking” is required, e.g., in order to avoid collision with a vehicle ahead that slowed unexpectedly.",
"In this example, the occupant may be working on a virtual desktop, and within 100 milliseconds of when the determination is made that the vehicle is about to rapidly deaccelerate (a “hard breaking”), the VST depicting the rear of the vehicle ahead is displayed in the center of the virtual desktop.",
"This way the occupant is immediately made aware of why the vehicle is breaking and this notification may prompt the occupant to seek a more appropriate posture for the breaking.",
"Some illustrations of utilization of the different modes of operation are given in the following figures.",
"FIG.",
"18a illustrates presenting VUR responsive to not receiving from the autonomous-driving control system 65 an indication that an SDRS event is imminent.",
"This figure has two parts, the left part shows the vehicle driving over a clean road, and the right part shows the VUR.",
"FIG.",
"18b illustrates presenting VST responsive to receiving from the autonomous-driving control system 65 an indication that an SDRS event is imminent.",
"The figure has two parts, the left part shows the vehicle about to drive over a pothole, and the right part shows a small window showing the pothole over the VUR (optionally to warn the occupant).",
"FIG.",
"18c illustrates presenting VST responsive to receiving from the autonomous-driving control system 65 an indication that an SDRS event is imminent.",
"The figure has two parts, the left part shows the vehicle about to enter a sharp turn, and on the right part shows a small window showing the sharp turn over the VUR (optionally to warn the occupant).",
"Traditional vehicles typically have a front windshield that offers occupants of the vehicle a frontal view of the outside environment.",
"However, in some embodiments, this frontal view may be provided using the VST.",
"For example, in one embodiment, the vehicle includes a nontransparent element, which is coupled to the vehicle, and obstructs at least 30 degrees out of the frontal horizontal unaided FOV to the outside environment of an occupant at eye level.",
"In one example of a standard vehicle, such as Toyota Camry model 2015, the frontal horizontal unaided FOV extends from the left door through the windshield to the right door.",
"The use of the nontransparent element improves the safety of the occupant during a collision compared to a similar vehicle having the same total weight and comprising a transparent glass window instead of the nontransparent element.",
"The nontransparent element may be coupled to the vehicle in various configurations, in embodiments described herein.",
"In one embodiment, the nontransparent element is fixed to the vehicle at an angle, relative to the occupant, that is covered by the field of view of the VST, and the nontransparent element features visible light transmittance (VLT) below 10% of ambient light.",
"Various types of displays may be utilized to present the occupant with video (e.g., the VST and/or the VUR).",
"In one embodiment, the video is presented to the occupant on a screen coupled to the vehicle compartment.",
"In one example, the screen coupled to the vehicle compartment utilizes parallax barrier technology.",
"A parallax barrier is a device located in front of an image source, such as a liquid crystal display, to allow it to show a stereoscopic image or multiscopic image without the need for the viewer to wear 3D glasses.",
"The parallax barrier includes a layer of material with a series of precision slits, allowing each eye to see a different set of pixels, thus creating a sense of depth through parallax.",
"In another embodiment, the occupant wears a head-mounted display (HMD), and the HMD is used to present the video to the occupant.",
"Optionally, the HMD is a VR headset, and as a result of presenting the VST, the occupant does not need to remove the VR headset in order to see the cause of the SDRS event.",
"In some embodiments, the video module 66 may be selective regarding indications of which SRDS events may prompt it to operate in the second mode of operation.",
"For example, if the occupant is engaged in a game, the video module 66 may refrain from presenting the VST in the foveal vision region if the vehicle is about to make a sharp turn.",
"However, it may optionally still present the VST in the foveal vision region if the SDRS event involves something that may be more forcefully felt by the occupant, such as extreme evasive maneuvering performed to avoid a collision.",
"In some embodiments, the video module 66 may determine whether to show a VST responsive to an SRDS event (in the second mode of operation) based on the level of concentration of the occupant.",
"For example, if the occupant is deeply engaged in a certain activity (e.g., in work or playing a game) above a threshold, the video module 66 may refrain from operating in the second mode for certain SDRS events that would cause the video module 66 to operate in the second mode were the occupant engaged in the certain activity below the threshold.",
"In one example, the engagement level may be based on the occupant's level of concentration, as measured by a wearable sensor (such as an EEG headset or a smartwatch) or a sensor fixed to the compartment (such as an eye tracker, a thermal camera, or a movement sensor embedded in the seat).",
"Presenting an occupant of a vehicle with video see-through (VST) of the outside environment from a point of view of the occupant can help the occupant be prepared for various events that may be considered to cause a Sudden Decrease in Ride Smoothness (SDRS events).",
"Some examples of SDRS events include the following events: hitting a speed bump, driving over a pothole, climbing on the curb, making a sharp turn, a hard breaking, an unusual acceleration (e.g., 0-100 km/h in less than 6 seconds), and starting to drive after a full stop.",
"In order for the occupant to become aware of an imminent SDRS event, the VST needs to be presented in an attention-grabbing way.",
"For example, when an SDRS event is imminent, the VST that describes the environment is brought to the center of the occupant's attention by displaying it at eye level and/or increasing the size of the VST (compared to other times when an SDRS event is not imminent).",
"The following is a description of an embodiment of a video system that may be used to increase awareness of an occupant of a vehicle regarding an imminent SDRS by making the VST more prominent for an imminent SDRS.",
"In one embodiment, a video system for an autonomous on-road vehicle includes at least the autonomous-driving control system 65, a camera, and a processor.",
"In this embodiment, the occupant is engaged, at least part of the time, in entertainment- or work-related activities, which involve presentation of video-unrelated-to-the-VST (VUR) to the occupant, for example, on a screen coupled to the compartment of the vehicle or a HMD worn by the occupant.",
"Some examples of such content (common in the year 2016) include cinema movies, broadcast TV shows, standard web browsers, and Microsoft Office 2016 applications (such as Word, Excel and PowerPoint).",
"The camera, which is mounted to the vehicle, is configured to take video of the environment outside the vehicle.",
"The processor is configured to generate, based on the video taken by the camera, a video see-through (VST) of outside environment from a point of view of an occupant of the vehicle.",
"Optionally, the occupant is in a front seat of the vehicle (such that no other occupant in the vehicle is positioned ahead of the occupant).",
"In some embodiments, the processor is configured to present video, which may include VUR and/or VST, to the occupant using different presentation modes, depending on whether an SDRS event is imminent.",
"For example, the video may be presented according to first or second modes, depending on whether an SDRS event is imminent.",
"Optionally, the VST captures in the video according to the first mode a diagonal FOV of at least 3°, 5°, or 10° of the occupant's FOV.",
"Optionally, the VST is not presented in the foveal vision region of the occupant in the video according to the first mode, while the VST is presented in the foveal vision region of the occupant in the video according to the second mode.",
"In one embodiment, responsive to an indication that is not indicative of an imminent SDRS event (generated by the autonomous-driving control system 65), the processor is configured to provide the occupant video according to the first mode.",
"In the video according to the first mode, the occupant is presented with video that comprises a video-unrelated-to-the-VST (VUR) at eye level in the direction of forward traveling.",
"Additionally, the video may comprise a video see-through (VST) of outside environment that is not presented at eye level in the direction of forward traveling.",
"Receiving an indication indicative that an SDRS event is imminent may change the way video is presented to the occupant.",
"Optionally, this change is made without receiving a command to do so from the occupant.",
"In one embodiment, responsive to the indication indicating that an SDRS event is imminent, the processor is configured to provide video to the occupant video according to the second mode.",
"In the video according to the second mode, the occupant is presented with video that comprises the VST, presented at eye level in the direction of forward traveling.",
"Optionally, if the video according to the first mode includes VST, then the size of the VST window in the video according to the second mode is larger by at least 25% relative to the size of the VST window in the video according to the first mode.",
"Optionally, the video according to the second mode includes presenting the VUR in the background (e.g., the VST is overlaid above the VUR).",
"Optionally, while providing the video according to the second mode, responsive to an updated indication that does not indicate that an SDRS event is imminent, the processor is further configured to switch back to provide the video according to the first mode to the occupant.",
"The following figures illustrate various ways in which the videos according to the first and second modes may be utilized.",
"FIG.",
"19a illustrates presenting a VUR, which is a movie showing a person skiing, responsive to not receiving from the autonomous-driving control system 65 an indication that an SDRS event is imminent.",
"This figure has two parts, the left part shows the vehicle driving over a clean road, and the right part shows the VUR with a small VST on the right.",
"FIG.",
"19b illustrates presenting a VST responsive to receiving from the autonomous-driving control system 65 an indication that an SDRS event is imminent.",
"This figure has two parts, the left part shows the vehicle about to drive over a speed bump, and the right part shows the VUR but now with a big VST on the right.",
"In this example, the big VST captures about half of the VUR and shows the speed bump.",
"FIG.",
"19c illustrates presenting a partially transparent VST responsive to receiving from the autonomous-driving control system 65 an indication that an SDRS event is imminent.",
"Here, the big VST (that captures about half of the VUR and shows the speed bump) is presented as partially transparent layer over the VUR in order to show the occupant both the VUR and the VST.",
"In one embodiment, presenting to the occupant video according to the second mode involves presenting the VUR behind the VST, and the size and location of the VUR in the video according to the second mode is essentially the same as the size and location of the VUR in the video according to the first mode.",
"Optionally, this means that there is a difference of less than 10% in the size and location of the VURs in the videos according to the first and second modes.",
"In another embodiment, the VUR is presented in a diagonal FOV of at least 10 degrees, and is not based on the video taken by the camera.",
"In some embodiments, the VUR may be unrelated to the purpose of the traveling in the vehicle.",
"For example, the VUR may include videos related to the following activities: watching cinema movies, watching TV shows, checking personal emails, playing entertainment games, and surfing in social networks.",
"In some embodiments, the occupant's field of view (FOV) to the outside environment is obstructed by a nontransparent element, and the VST represents at least a portion of the obstructed FOV.",
"Optionally, the occupant uses a VR headset and the obstruction is due to a nontransparent element belonging to the VR headset.",
"Additionally or alternatively, the obstruction may be due to the vehicle's compartment; in this case the nontransparent element may be an SAEDP, a safety beam, and/or a crumple zone at eye level, which obstruct at least 30 degrees out of the frontal horizontal unaided FOV to the outside environment of the occupant at eye level.",
"When traveling in a vehicle, an occupant of the vehicle may not always be viewing the outside environment.",
"For example, the occupant may be engaged in work- or entertainment-related activities.",
"Additionally, in some vehicles, the occupant may not have a good view of the outside environment most of the time, or even all of the time.",
"For example, the vehicle may have very few (or no) windows, or the vehicle may have a shading mechanism that reduces the light from the outside.",
"However, there are times when the occupant should be made aware of the outside environment, even though the occupant may not be actively driving the vehicle.",
"For example, the occupant may be made aware of the outside environment in order to make the occupant prepared for an event that causes a Sudden Decrease in Ride Smoothness (an SDRS event).",
"Some examples of SDRS events include the following events: hitting a speed bump, driving over a pothole, climbing on the curb, making a sharp turn, a hard breaking, an unusual acceleration (e.g., 0-100 km/h in less than 6 seconds), and starting to drive after a full stop.",
"In order for the occupant to become aware of an imminent SDRS event, in some embodiments that involve a vehicle that has a shading module that controls how much ambient light is let in, when an SDRS event is imminent the vehicle may increase the amount of light that enters via a window.",
"This additional light can give an occupant a better view of the outside environment, which can make the occupant aware and better prepared for the SDRS.",
"The following is a description of an embodiment of a system that may be used to increase awareness of an occupant of a vehicle regarding an imminent SDRS by enabling more ambient light to enter a vehicle via a window.",
"In one embodiment, a shading system for a window of an autonomous on-road vehicle includes at least the autonomous-driving control system 65, a shading module, and a processor.",
"FIG.",
"20a illustrates a smart glass shading module that operates according to an indication that an SDRS event is not imminent.",
"This figure has two parts, the left part shows the vehicle driving over a clean road, and the right part shows that the smart glass window blocks most of the ambient light (illustrated in the figure by the tree outside that is invisible to the occupant).",
"FIG.",
"20b illustrates the smart glass shading module that operates according to an indication that an SDRS event is imminent.",
"This figure has two parts, the left part shows the vehicle about to drive over a pothole, and the right part shows that the smart glass window does not block the ambient light (illustrated in the figure by the tree outside that is visible to the occupant).",
"The shading module is configured to control the amount of ambient light that enters the vehicle via the window.",
"Optionally, the window is a front-facing window (e.g., a windshield).",
"Optionally, the window is a side-facing window.",
"There are various types of shading modules that may be utilized in different embodiments.",
"In one embodiment, the shading module comprises a curtain.",
"Optionally, the curtain covers most of the area of the window.",
"Optionally, the curtain may open and close with the aid of an electromechanical device, such as a motor, based on commands issued by the processor.",
"In another embodiment, the shading module is a movable physical element configured to reduce the intensity of the ambient light entering through the vehicle window into the vehicle compartment.",
"For example, the shading module may include various forms of blinds, a shutter, or a sliding element.",
"Optionally, the shading module may be unfurled on the inside of the vehicle compartment in order to block more than 70% of the ambient light intensity.",
"Optionally, the shading module may be unfurled on the outside of the vehicle compartment in order to block more than 70% of the ambient light intensity.",
"In yet another embodiment, the shading module comprises a smart glass able to change its light transmission level.",
"Optionally, the smart glass is a vehicle window smart glass that comprises suspended particle devices (SPDs) film.",
"Smart glass window may also be known as a switchable glass, a smart window, and/or a switchable window.",
"Smart glass is glass or glazing whose light transmission properties are altered when voltage, current, light or heat is applied.",
"Examples of electrically switchable smart glass include: suspended particle devices (SPDs), electrochromic devices, transition-metal hydride electrochromics devices, modified porous nano-crystalline films, polymer dispersed liquid crystal devices, micro-blinds, and thin coating of nanocrystals embedded in glass.",
"Examples of non-electrical smart glass include: mechanical smart windows, Vistamatic®, and Sunvalve.",
"The processor is configured to command the shading module to operate in different modes based on indications generated by the autonomous-driving control system 65.In some embodiments, the processor is configured to command the shading module to operate in different modes that allow different amounts of the ambient light to enter the vehicle via the window, depending on whether an SDRS event is imminent.",
"For example, shading module may operate in first or second modes, depending on whether an SDRS event is imminent.",
"Optionally, in the first mode the shading module blocks more of the ambient light entering through the vehicle window than in the second mode.",
"Optionally, the increased ambient light in the second mode can help make the occupant more aware of the outside environment, which can enable the occupant to prepare for the SDRS event.",
"In one embodiment, responsive to an indication that no SDRS event is imminent, the processor is configured to command a shading module to operate in a first mode in which the shading module blocks more than 30% of ambient light entering through a window of the vehicle.",
"Receiving an indication indicative that an SDRS event is imminent may change the amount of ambient light that enters the vehicle via the window.",
"Optionally, this change is made without receiving a command to do so from the occupant.",
"In one embodiment, responsive to an indication that an SDRS event is imminent, the processor is configured to command the shading module to operate in the second mode in which the shading module blocks less than 90% of the ambient light entering through the vehicle window.",
"Some aspects of this disclosure include a system that can show an occupant of a vehicle and Object Of Interest (OOI) in the outside environment, which the occupant would otherwise miss (e.g., due to being engaged in work- or entertainment-related activities and/or having no direct view of the outside environment).",
"In one embodiment, a system configured to identify an Object Of Interest (OOI) in the outside environment, and to present to an occupant of an autonomous on-road vehicle a video see-through (VST) that comprises the OOI, includes at least a camera (such as camera 12), a processor (such as processor 18), and a video module (such as video module 66).",
"Different types of things may be considered an OOI in different embodiments.",
"In one embodiment, the OOI is selected from a set comprising: types of vehicles, types of scenery, and types of people.",
"Optionally, the system may include a user interface configured to present a menu that enables the occupant to select the types of OOI, which when identified, will be presented in the second mode of presentation.",
"In one example, an OOI may be any type of high-end vehicle (e.g., a Porsche).",
"In another example, an OOI may include an ocean view.",
"The camera, which is mounted to the vehicle, is configured to take video of the environment outside the vehicle.",
"Optionally, the data captured by the camera comprises 3D data.",
"The processor is configured to generate, based on the video taken by the camera, a video see-through (VST) of outside environment from a point of view of an occupant of the vehicle.",
"Optionally, the occupant is in a front seat of the vehicle (such that no other occupant in the vehicle is positioned ahead of the occupant).",
"The video module is configured to present, to the occupant, video that captures diagonal field of view (FOV) of at least 10 degrees, at eye level.",
"Optionally, the video module is further configured to select a mode of operation based on whether an indication is received that is indicative of whether video taken by the camera include the OOI.",
"Optionally, changing a mode of operation is done without an expressed command at that time by the occupant.",
"In one embodiment, when not receiving an indication that the images includes the OOI, the video module is configured to select a first mode of presentation, in which a video-unrelated-to-the-VST (VUR) is presented on the foveal vision region of the occupant.",
"And responsive to receiving the indication that the images include the OOI, the video module is further configured to select a second mode of presentation, in which the VST is presented on the foveal vision region of the occupant.",
"There are various ways in which an indication of the OOI may be generated in different embodiments.",
"In one embodiment, the system includes an image processing module configured to identify the OOI in the VST and to generate the indication.",
"Various image processing techniques and/or image identification methods known in the art may be utilized by the image processing module for this task.",
"In another embodiment, the system may include the autonomous-driving control system 65 configured to utilize a positioning system, such as GPS coordinates, to identify that the vehicle reached the OOI and to generate the indication.",
"Optionally, the occupant may define which places may be OOIs and/or what types of locations are to be considered OOIs (e.g., historical monuments, nice scenery, etc.).",
"In still another embodiment, the system may include a crowd-based module configured to identify the OOI based on feedback received from many different occupants who watched VSTs comprising the OOI.",
"Optionally, this feedback may be derived based on indications of how other occupants felt about the VST (when it depicted certain content corresponding to OOIs).",
"For example, points of interest may be determined according to affective crowd data, determine based on how other occupants felt about what they saw, and optionally find places where the crowd affective response was positive (e.g., blooming of flowers, etc.).",
"Optionally, some occupants who watched the video related to the unhindered FOV for long periods (or have a physical window) may be monitored to see when an interesting view is encountered.",
"Points of interest may involve items identified in the exterior environment using image analysis, including presenting the VST when one or more of the following happens: passing a fancy vehicle, passing someone the occupant knows, passing a vehicle accident, passing a police officer, having a sunset view, and passing an animal the occupant is interested in.",
"In one embodiment, the system may receive an indication that the occupant is feeling at least one of nauseous and claustrophobic, and consequently present the VST in order to help the occupant to confront the feeling.",
"For example, when there is a serious spike (e.g., increase in heart-rate and sweating), then the system may present the VST automatically.",
"The system may also present a “normal” interior to the occupant (e.g., natural lighting settings).",
"Optionally, when digital content is consumed (e.g., a game or a movie), the system may check whether the affective spike (e.g., increased excitement) is due to the content or due to the experience of being in the vehicle with AR or VR.",
"If it is the former case, then the system might not present the VST.",
"Some aspects of this disclosure involve an autonomous on-road vehicle that includes a nontransparent Shock-Absorbing Energy Dissipation Padding (SAEDP) that is coupled to the compartment of the vehicle and is located, during normal driving, at eye level in front of an occupant who sits in a front seat of the vehicle.",
"Additionally, the vehicle includes a stiff element that is configured to support the SAEDP and to resist deformation during collision in order to reduce compartment intrusion.",
"The stiff element is located, during normal driving, at eye level between the SAEDP and the outside environment.",
"Thus, the combination of the SAEDP and the stiff element offers the occupant an increased level of protection, e.g., in the case of a collision, compared to a vehicle in which a traditional window is in place at eye level in the front of the vehicle.",
"However, due to it being nontransparent, placing the SAEDP at eye level may obstruct the occupant's view to the outside.",
"Thus, in order to offer the occupant such a view, in some embodiments, the vehicle also includes a camera configured to take video of the outside environment in front of the occupant, and a computer configured to generate, based on the video, a representation of the outside environment in front of the occupant at eye level.",
"This representation may be provided to the occupant using various types of displays.",
"One non-limiting advantage of the vehicle described above is that it increases the safety of the occupant in the case of a collision, without prohibiting the occupant from obtaining a view of the outside environment.",
"In one embodiment, an autonomous on-road vehicle includes a compartment, which one or more occupants may occupy while traveling in the vehicle (e.g., by sitting in seats).",
"Coupled to the front of the compartment is a Shock-Absorbing Energy Dissipation Padding (SAEDP) and a stiff element that supports the SAEDP.",
"Optionally, the SAEDP is nontransparent.",
"The stiff element is located, during normal driving, at eye level between the SAEDP and the outside environment.",
"Additionally, the vehicle includes a camera (e.g., camera 142 or structure 147 that comprises multiple cameras), which is configured to take video of the outside environment in front of the occupant, and a computer (e.g., computer 143) that is configured to generate, based on the video, a representation of the outside environment in front of the occupant at eye level.",
"Optionally, the camera, and/or each of the cameras in the structure 147, may be based on at least one of the following sensors: a CCD sensor, a CMOS sensor, a near infrared (NIR) sensor, an infrared sensor (IR), and a device based on active illumination such as a LiDAR.",
"Optionally, when the camera comprises multiple cameras, the multiple cameras are directed to multiple directions around the vehicle, and the multiple cameras support generating multiple representations of the outside environment from different points of view.",
"It is to be noted that in some embodiments, the SAEDP may be fixed at its location both in normal driving and in times that are not considered to correspond to normal driving, while in other embodiments, the SAEDP may change its location during at least some of the times that do not correspond to normal driving.",
"The SAEDP is coupled to the compartment in such a way that it is located, during normal driving, at eye level in front of an occupant who sits in a front seat of the vehicle.",
"Different types of SAEDPs may be utilized in different embodiments.",
"In one embodiment, the SAEDP comprises a passive material that is less stiff than a standard automotive glass window.",
"The passive material is configured to protect the occupant's head against hitting the inner side of the vehicle compartment during a collision.",
"Optionally, the passive material has thickness greater than at least one of the following thicknesses: 1 cm, 2 cm, 5 cm, 10 cm, 15 cm, and 20 cm.",
"Optionally, the thickness of the passive material may refer to the average thickness of the SAEDP across the portion of the SAEDP at eye level.",
"Alternatively, the thickness may refer to the maximal thickness at some position of the SAEDP (which is at least one of the values mentioned above).",
"In another embodiment, the SAEDP comprises a pneumatic pad that is configured to inflate in order to protect the occupant's head against hitting the inner side of the vehicle compartment during collision.",
"In some examples, the pneumatic pads may be formed from an elastomeric material providing chambers containing air or another gas.",
"Optionally, the chambers are retained in compressed deflated condition until being inflated by the admission of gas pressure controlled by the vehicle's autonomous-driving control system that is responsible to estimate the probability and severity of an imminent collision.",
"Additionally or alternatively, the chambers may be provided with restricted passages limiting the flow out from the chambers to provide shock-absorbing energy dissipation to reduce the rebound effect.",
"U.S. Pat.",
"No.",
"5,382,051 discloses examples for pneumatic pads that can be used with some of the embodiments.",
"In yet another embodiment, the SAEDP comprises an automotive airbag, which is configured to protect the occupant's head against hitting the inner side of the vehicle compartment during collision.",
"In one example, during normal driving, the airbag is in a stowed state.",
"The airbag is coupled to an inflator configured to inflate the airbag with gas to an inflated state, upon receiving an indication indicative of a probability of an impact of the vehicle exceeding a threshold.",
"In this example, the airbag is located, when in the stowed state, at eye level in front of the occupant.",
"In some embodiments, the compartment may include a door, and the SAEDP is physically coupled to the door from the inside, such that the SAEDP moves with the door as the door opens and/or closes.",
"In some embodiments, the vehicle may include a second SAEDP coupled to the outer front of the vehicle to minimize damage to a pedestrian during a pedestrian-vehicle collision.",
"In one embodiment, the stiff element that supports the SAEDP is nontransparent.",
"In another embodiment, the stiff element may be automotive laminated glass or automotive tempered glass.",
"Optionally, the structure of the vehicle comprises a crumple zone located at eye level between the stiff element and the outside environment.",
"The representation of the outside environment is intended to provide the occupant with some details describing the outside environment.",
"In some embodiments, the representation of the outside environment is generated from the point of view of the occupant, and it represents how a view of the outside environment would look like to the occupant, had there been a transparent window at eye level instead of the SAEDP and/or the stiff element.",
"Optionally, a display is utilized to present the representation to the occupant.",
"Various types of displays may be utilized in different embodiments to present the representation of the outside environment to the occupant.",
"In one embodiment, the display is comprised in an HMD, and the vehicle further comprises a communication system configured to transmit the representation to the HMD.",
"For example, the HMD may be a virtual reality system, an augmented reality system, or a mixed-reality system.",
"In one embodiment, the display is supported by at least one of the SAEDP and the stiff element.",
"For example, the display is physically coupled to the SAEDP and/or the stiff element.",
"Optionally, the display is a flexible display.",
"For example, the flexible display may be based on at least one of the following technologies and their variants: OLED, organic thin film transistors (OTFT), electronic paper (e-paper), rollable display, and flexible AMOLED.",
"In one example, the display is flexible enough such that it does not degrade the performance of the SAEDP by more than 20% during a collision.",
"In one example, the performance of the SAEDP is measured by hitting a crash test dummy head against the SAEDP and measuring the head's deceleration using sensors embedded in the head.",
"FIG.",
"21a, FIG.",
"21b, and FIG.",
"22 illustrate various embodiments of the vehicle described above.",
"Each of the illustrated vehicles comprises a cross-section view of the vehicles, where each includes a compartment 145 for a single occupant (in FIG.",
"21b) or more (in FIG.",
"21a and FIG.",
"22).",
"In the figures, much of the compartment is covered with the SAEDP 140, which is nontransparent and comprises a soft passive material (cushiony in its nature).",
"Supporting the SAEDP 140 is a stiff element 141, which in the illustrations comprises portions of the exterior (hull) of the vehicle which may optionally be made of one or more of the following materials: fiber-reinforced polymer, carbon fiber reinforced polymer, steel, and aluminum.",
"The vehicles also include a camera (such as camera 142 and/or structure 147 that houses multiple cameras), which is positioned to capture a front view of the outside environment of the vehicle.",
"Additionally, the vehicles include a computer 143, which may be positioned in various locations in the vehicle.",
"In some embodiments, the computer may be comprised of multiple processors and/or graphics processors that may be located at various locations in the vehicle.",
"The figures illustrate various types of displays that may be utilized to present the occupant with the representation of the outside environment generated by the computer 143 based on the video taken by the camera 142.In FIG.",
"21a the representation is presented via an HMD 144, which may be, for example, a virtual reality HMD.",
"In FIG.",
"21b the representation is presented via an HMD 146, which may be, for example, a mixed-reality headset.",
"And in FIG.",
"22 the representation may be provided via one or more of the displays 150, which are coupled to the compartment.",
"It is to be noted that in the figures described above not all of the described elements appear in each figure.",
"The figures also illustrate various structural alternatives that may be implemented in different embodiments described herein.",
"For example, FIG.",
"21a illustrates a vehicle that includes window 148, which may optionally be an automotive tempered glass window, located in a location in which the head of a belted occupant is not expected to hit during collision.",
"FIG.",
"21b illustrates a vehicle that includes crumple zone 149, which is located at the front of the vehicle at eye level.",
"The figure also illustrates the structure 147 that houses multiple cameras directed to multiple directions around the vehicle.",
"In some embodiments, the representation of the outside environment may be manipulated in order to improve how the outside environment looks to the occupant.",
"Optionally, this may be done utilizing the computer.",
"In one example, manipulating the representation includes at least one of the following manipulations: converting captured video of an overcast day to video of a sunny day by preserving main items in the captured video (such as vehicles and buildings) and applying effects of a sunny day, converting unpleasant environment to a nice one, converting standard vehicles to futuristic or old fashion vehicles, and adding fans standing outside and waiving to the occupant.",
"In one embodiment, the manipulation maintains the main items in the environment, such that the occupant would still know from the manipulated representation where he/she is traveling.",
"In another embodiment, the manipulated representation maintains the main objects in the video of the outside environment, such that the main objects presented in the manipulated video essentially match the main objects that would have been seen without the manipulation.",
"In some embodiments, the vehicle compartment may include an automotive laminated glass window or automotive tempered glass window located in a location where the head of a belted occupant is not expected to hit as a result of collision while traveling in velocity of less than 50 km/h, as illustrated by the dotted rectangle 148 in FIG.",
"21a.",
"In one embodiment, the structure of the vehicle is such that a crumple zone is located at eye level between the stiff element and the outside environment.",
"Various types of vehicles may benefit from utilization of the nontransparent SAEDP supported by the stiff element and in conjunction with the camera and computer, as described above.",
"The following are some examples of different characterizations of vehicles in different embodiments.",
"In one embodiment, the vehicle weighs less than 1,500 kg without batteries, and it is designed to carry up to five occupants.",
"In another embodiment, the vehicle weighs less than 1,000 kg without batteries, and it comprises an engine that is able to sustain continuously at most 80 horsepower.",
"In yet another embodiment, the vehicle weighs less than 1,000 kg and it is designed to carry up to two occupants.",
"In still another embodiment, the vehicle weighs less than 800 kg without batteries, and it comprises an engine that is able to sustain continuously at most 60 horsepower.",
"In yet another embodiment, the vehicle weighs less than 500 kg without batteries and it comprises an engine that is able to sustain continuously at most 40 horsepower.",
"And in still another embodiment, the vehicle weighs less than 400 kg without batteries and is designed to carry up to two occupants.",
"Some aspects of this disclosure involve an autonomous on-road vehicle that includes a nontransparent Shock-Absorbing Energy Dissipation Padding (SAEDP) that is coupled to the compartment and is located, during normal driving, at eye level to the left of the occupant who sits in a front seat of the vehicle (in the left front seat when the vehicle has more than one front seat).",
"The SAEDP obstructs at least 30 degrees out of the horizontal unaided field of view (FOV) to the outside environment to the left of the occupant at eye level.",
"Additionally, the vehicle includes a stiff element that is configured to support the SAEDP and to resist deformation during collision in order to reduce compartment intrusion.",
"The stiff element is located, during normal driving, at eye level between the SAEDP and the outside environment.",
"Thus, the combination of the SAEDP and the stiff element offers the occupant an increased level of protection, e.g., in the case of a collision to the left side of the vehicle, compared to a vehicle in which a traditional window is in place at eye level on the left side of the vehicle.",
"However, due to it being nontransparent, placing the SAEDP at eye level may obstruct the occupant's view to the outside.",
"Thus, in order to offer the occupant such a view, in some embodiments, the vehicle also includes a camera configured to take video of the outside environment to the left of the occupant, and a computer, which is configured to generate, based on the video, a representation of the outside environment to the left of the occupant at eye level.",
"This representation may be provided to the occupant using various types of displays.",
"One non-limiting advantage of the vehicle described above is that it increases the safety of the occupant in the case of a side collision, without prohibiting the occupant from obtaining a side view of the outside environment.",
"In one embodiment, an autonomous on-road vehicle includes a compartment, which one or more occupants may occupy while traveling in the vehicle (e.g., by sitting in seats).",
"Coupled to the compartment is a Shock-Absorbing Energy Dissipation Padding (SAEDP) and a stiff element that supports the SAEDP.",
"Optionally, the SAEDP is nontransparent.",
"The SAEDP is located, during normal driving, at eye level to the left of the occupant who sits in a front seat of the vehicle.",
"The stiff element is located, during normal driving, at eye level between the SAEDP and the outside environment.",
"Optionally, the stiff element is nontransparent.",
"Optionally, the stiff element may be automotive laminated glass or automotive tempered glass.",
"The vehicle also includes a camera (such as camera 161) that is configured to take video of the outside environment to the left of the occupant, and a computer that is configured to generate, based on the video, a representation of the outside environment to the left of the occupant at eye level.",
"Optionally, the camera comprises multiple cameras directed to multiple directions around the vehicle, and the multiple cameras support generating multiple representations of the outside environment from different points of view.",
"FIG.",
"23 illustrates one embodiment of the autonomous on-road vehicle described above, which shows how an SAEDP protects the occupant during a collision.",
"In the figure, SAEDP 160 (which may comprise a passive material) is coupled to the stiff element 141.When another vehicle collides with the side of the vehicle, the occupants head strikes the soft SAEDP 160, instead of a glass window (which would be positioned there in many conventional vehicles).",
"The SAEDP is coupled to the compartment in such a way that it is located, during normal driving, at eye level to the left of the occupant who sits in a front seat of the vehicle.",
"Optionally, due to its location, the SAEDP obstructs at least 30 degrees out of the horizontal unaided field of view (FOV) to the outside environment to the left of the occupant at eye level.",
"Optionally, the SAEDP obstructs at least 45 degrees or at least 60 degrees out of the horizontal unaided FOV to the outside environment to the left of the occupant at eye level.",
"In one example of a standard vehicle, such as Toyota Camry model 2015, the frontal horizontal unaided FOV extends from the left door through the windshield to the right door.",
"In some embodiments, the SAEDP is fixed to the left door of the vehicle.",
"In one embodiment, the vehicle has a single seat (occupied by the occupant).",
"In another embodiment, the vehicle has two or more front seats and the occupant occupies the leftmost of the two or more front seats.",
"Different types of SAEDPs may be utilized in different embodiments.",
"In one embodiment, the SAEDP comprises a passive material, which is less stiff than a standard automotive glass window, having a thickness greater than at least one of the following thicknesses: 1 cm, 2 cm, 5 cm, 10 cm, 15 cm, and 20 cm.",
"In other embodiments, the SAEDP may include an automotive airbag or a pneumatic pad that is configured to inflate in order to protect the occupant's head against hitting the inner side of the vehicle compartment during collision.",
"In a similar fashion to how the SAEDP and stiff element are utilized to help protect the left side of the occupant, the same setup may be applied to the right side of the vehicle, in order to help protect that side.",
"Thus, in some embodiments, the vehicle may further include a second SAEDP located at eye level to the right of the occupant who sits in the front seat, and a second stiff element located at eye level between the second SAEDP and the outside environment.",
"Optionally, the second SAEDP obstructs at least 20 degrees out of the horizontal unaided FOV to the outside environment to the right of the occupant at eye level, and the computer is further configured to generate a second representation of the outside environment to the right of the occupant.",
"Some aspects of this disclosure involve an autonomous on-road vehicle that includes a nontransparent Shock-Absorbing Energy Dissipation Padding (SAEDP) that can cover a side window that enables an occupant of the vehicle to see the outside environment.",
"The side window is located at eye level of an occupant who sits in the vehicle.",
"A motor is configured to move the SAEDP over a sliding mechanism between first and second states multiple times without having to be repaired.",
"A processor is configured to receive, from an autonomous-driving control system, an indication that a probability of an imminent collision reaches a threshold, and to command the motor to move the SAEDP from the first state to the second state.",
"In the first state the SAEDP does not block the occupant's eye level view to the outside environment, and in the second state the SAEDP blocks the occupant's eye level view to the outside environment in order to protect the occupant's head against hitting the side window during collision.",
"One non-limiting advantage of the vehicle described above is that it increases the safety of the occupant in the case of a side collision.",
"In one embodiment, an autonomous on-road vehicle includes a side window 170, a nontransparent SAEDP (e.g., SAEDP 171), a motor 172, and a processor 175.The processor 175 is configured to receive, from an autonomous-driving control system (such as autonomous-driving control system 65), an indication indicating that a probability of an imminent collision reaches a threshold, and to command the motor 172 to move the SAEDP 171 from the first state to the second state.",
"In the first state the SAEDP 171 does not block the occupant's eye level view to the outside environment, and in the second state, the SAEDP 171 blocks the occupant's eye level view to the outside environment in order to protect the occupant's head against hitting the side window during collision.",
"Optionally, the processor is configured to command the motor 172 to start moving the SAEDP 171 to the second state at least 0.2 second, 0.5 second, 1 second, or 2 seconds before the expected time of the collision.",
"The motor 172 is configured to move the SAEDP 171 over a sliding mechanism 173 between first and second states multiple times without having to be repaired.",
"For example, during the same voyage, the SAEDP 171 may go up and down multiple times without a need for the occupant or anyone else to repair the SAEDP 171 and/or other components (such as motor 172 or the window 170) in order to the SAEDP 171 to be able to continue its operation correctly (i.e., continue moving up and down when needed).",
"In some examples, the motor 172 is a motor designed to move the SAEDP 171 more than twice, more than 100 times, and/or more than 10,000 times without being replaced.",
"The side window 170 is located at eye level of an occupant who sits in the vehicle, which enables the occupant to see the outside environment.",
"In one embodiment, the side window 170 is a power window.",
"In this embodiment, the power window comprises a window regulator that transfers power from a window motor 177 to the side window glass in order to move it up or down.",
"The motor 172 is coupled to an SAEDP regulator that transfers power from the motor 172 to the SAEDP 171 in order to move it up or down.",
"In this embodiment, the SAEDP regulator is located closer to the inner side of the compartment then the window regulator.",
"Optionally, the motor 172 and the window motor 177 may be of the same type or of different types.",
"In one embodiment, the SAEDP 171 comprises a passive material, which is less stiff than a standard automotive glass window, having thickness greater than at least one of the following thicknesses: 1 cm, 2 cm, 5 cm, 10 cm, 15 cm, and 20 cm.",
"Optionally, the vehicle may include a storage space in a door of the vehicle, which is configured to store the SAEDP 171 in the first state.",
"Additionally or alternatively, the vehicle may include a storage space in the roof of the vehicle, which is configured to store the SAEDP 171 in the first state.",
"Optionally, the SAEDP 171 may move upwards when switching between the first and second states, and the top of the SAEDP has a profile (such as a triangle or a quarter sphere) which reduces the risk of catching the a part of the occupant (e.g., a finger or limb) or the occupant's clothing, between the top of the SAEDP 171 and an upper frame when moving the SAEDP 171 to the second state.",
"In one embodiment, when switching the SAEDP 171 quickly between the first and second states, the SAEDP 171 is configured not to cover a range of 1 to 5 cm of the top height of the window.",
"Optionally, keeping said range unoccupied reduces the risk of catching the occupant's fingers or limb by the edge of the SAEDP 171 when moving the SAEDP 171 to the second state.",
"In some embodiments, the vehicle may include additional SAEDPs that cover additional regions of the vehicle's compartment (besides the side window 170).",
"In one example, the vehicle includes an SAEDP 176 that covers at least a portion of the roof of the vehicle.",
"In some embodiments, the vehicle includes a camera (e.g., camera 178a), which is configured to take video of the outside environment while the SAEDP 171 is in the second state.",
"Additionally, in these embodiments, the vehicle may include a computer (such as computer 13), which is configured to generate a representation of the outside environment based on the video, and a display configured to present the representation of the outside environment to the occupant.",
"The display may be physically coupled to the compartment and/or belong to an HMD.",
"Optionally, the camera is fixed to the SAEDP 171, and thus moves along with the SAEDP 171 when it is moved between the first and second states.",
"Optionally, the display is fixed to the SAEDP 171, and thus moves along with the SAEDP 171 when it is moved between the first and second states.",
"Optionally, the display is configured to show, at eye level, a representation of the outside environment when the SAEDP is in the second state.",
"In one example, the display is a flexible display.",
"In another example, the camera comprises multiple cameras directed to multiple directions around the vehicle, and the computer is configured to generate at least two different representations of the outside environment, from at least two different points of view, for two occupants who sit in the vehicle.",
"In some embodiments, in addition to raising the SAEDP 171, one or more of the displays mentioned above is utilized to present the occupant a video of the threat and the predicted trajectory that could result in the collision, in order to explain why the SAEDP 171 is being moved to the second state.",
"FIG.",
"24a and FIG.",
"24b illustrate an example of a vehicle in which the side window may be covered by an SAEDP that can move up and down.",
"The figures illustrate cross-sections of the vehicle, which show how the SAEDP 171 may move from the first state (in FIG.",
"24a) to the second state (in FIG.",
"24b).",
"The dotted line 179 indicates that the SADEP 171 does not close the entire gap over the window (e.g., in order to avoid catching the occupant's hair).",
"The figures also illustrate sliding mechanism 173, which may be utilized to guide and assist in the movement of SAEDP 171.FIG.",
"24b also illustrates camera 178a and display 178b, which are connected to a processor that generates, based on the video received from the camera, a view of the outside environment when an SAEDP (on the right side of the vehicle) is in the second state.",
"The view of the outside environment is presented to the occupant on the display 178b.",
"Camera and display on the left SAEDP 171, which correspond to camera 178a and display 178b, are not shown in the figure in order to make it clearer; however it is to be understood that such camera and display may be fitted to any relevant moving SAEDP.",
"In one embodiment, the mechanism that moves the SAEDP 171 between the first and second states (referred to as the “SAEDP mechanism”) is similar to a power window regulator that moves an automobile window up and down.",
"As with automobile power windows, the SAEDP regulator may be powered by an electric motor, which may come with the SAEDP regulator as one unit, or as a system that enables the motor or regulator to be replaced separately.",
"The SAEDP mechanism includes a control system, a motor, a gear reduction, a sliding mechanism and the SAEDP, which are usually fixed on the door, but may alternatively be fixed on the roof as disclosed below.",
"The sliding mechanism may have different architectures, such as Bowden type, double Bowden type, cable spiral, or crossed levers.",
"In a first example, the SAEDP mechanism is similar to a double Bowden power window mechanism, in which the SAEDP 171 is fixed on two supports respectively constrained along two rails.",
"The control system drives the motor that wraps two Bowden cables, which move two supports and, consequently, the SAEDP 171.A Bowden cable transmits mechanical force through the movement of an inner cable relative to an outer housing, and in the case of a DC motor, the basic operations of the motor are accomplished by reversing the polarity of its power and ground input.",
"In a second example, the SAEDP mechanism is similar to a gear-drive type power window regulator; in this case, the SAEDP mechanism includes an SAEDP motor to power the mechanism, gear drive and geared arm to move the SAEDP 171 between the first and second states, and an SAEDP holding bracket to hold the SAEDP 171.In a third example, the SAEDP mechanism is similar to a cable type power window regulator; in this case, the SAEDP regulator includes an SAEDP motor that drives a wire cable though a mechanism, a series of pulleys that guide the cable, and a regulator carriage attached to the cable and to the SAEDP 171 and slides on the regulator track.",
"One or more tracks may be mounted vertically inside the door panel that serves as a guide piece when the SAEDP 171 slides up and down.",
"Depending on the design, the setup may have one main regulator track in the center of the door, or have a track on each side of the SAEDP.",
"In a fourth example, the SAEDP regulator is similar to a scissor power window regulator; in this case, a motor operates a gear wheel that raises and lowers the SAEDP 171 by the use of a scissor action of rigid bars.",
"The motor that moves the SAEDP 171 over the sliding mechanism may be any suitable motor, such as a DC electric motor, an AC electric motor, or a pneumatic motor.",
"In one embodiment, the indication that the probability of an imminent collision reaches a threshold is received from the autonomous-driving control system 65 that calculates the probability based on the trajectory of the vehicle and information about the road.",
"Optionally, the information about the road may be received from one of more of the following sources: a sensor mounted to the vehicle, a sensor mounted on a nearby vehicle, a road map, a stationary traffic controller nearby the vehicle, and a central traffic controller that communicates with the vehicle via wireless channel.",
"In one embodiment, the processor 175 is further configured to receive an updated indication that the probability of the imminent collision does not reach a second threshold, and to command the motor to move the SAEDP to the first state.",
"In this embodiment, the second threshold denotes a probability for a collision that is equal or lower than the threshold.",
"FIG.",
"25a and FIG.",
"25b illustrate a motor configured to move a front nontransparent Shock-Absorbing Energy Dissipation Padding (SAEDP) between first and second states.",
"Some aspects of this disclosure involve an autonomous on-road vehicle that includes an outer nontransparent Shock-Absorbing Energy Dissipation Padding (SAEDP) mounted to the front side of the vehicle during normal driving, such that the SAEDP is in front of and at eye level of an occupant who sits in a front seat of the vehicle.",
"Additionally, the vehicle includes a camera that is mounted to the vehicle and is configured to take video of the outside environment in front of the occupant, and a computer configured to generate, based on the video, a representation of the outside environment at eye level for the occupant.",
"One non-limiting advantage of the vehicle described above is that it increases the safety of a pedestrian in case of a vehicle-pedestrian collision, without prohibiting the occupant of the vehicle from receiving a frontal view of the outside environment.",
"FIG.",
"26a illustrates one embodiment of an autonomous on-road vehicle that includes outer nontransparent SAEDP 190, which is mounted to the front side of the vehicle during normal driving, such that the SAEDP 190 is in front of and at eye level of an occupant who sits in a front seat of the vehicle.",
"The SAEDP 190 is less stiff than a standard automotive glass window and is designed to absorb some of the crashing energy transmitted to a pedestrian during a pedestrian-vehicle collision.",
"Additionally, the vehicle includes a camera (such as camera 142), which is mounted to the vehicle and is configured to take video of the outside environment in front of the occupant, and a computer (such as computer 143), which is configured to generate, based on the video, a representation of the outside environment at eye level for the occupant.",
"Optionally, the representation is generated from the point of view of the occupant.",
"Optionally, the vehicle includes a display configured to present the representation to the occupant.",
"For example, the display may belong to an HMD worn by the occupant.",
"In another example, the display may be coupled to the compartment of the vehicle, and may be a flexible display.",
"The SAEDP 190 may be implemented utilizing various approaches in different embodiments described herein.",
"In one embodiment, the SAEDP 190 comprises a passive material.",
"Optionally, the SAEDP 190 has thickness greater than at least one of the following thicknesses: 1 cm, 2 cm, 5 cm, 10 cm, 15 cm, and 20 cm.",
"In another embodiment, the SAEDP 190 comprises an automotive airbag configured to inflate in order to protect the pedestrian.",
"FIG.",
"26b illustrates an outer SAEDP 190 that includes two air bags 192 configured to absorb some of the crashing energy transmitted to a pedestrian during a pedestrian-vehicle collision.",
"Optionally, the airbag has a stowed condition and an inflated condition.",
"The airbag is coupled to an inflator configured to inflate the airbag with gas, and the airbag is located, in the stowed condition, at eye level in front of the occupant.",
"In this embodiment, the vehicle further includes an autonomous-driving control system, such as autonomous-driving control system 65, which is configured to calculate a probability of pedestrian-vehicle collision, based on measurements of sensors mounted to the vehicle, and to command the airbag to inflate before the pedestrian head hits the vehicle.",
"In yet another embodiment, the SAEDP 190 comprises a pneumatic pad configured to inflate in order to protect the pedestrian.",
"In this embodiment, the vehicle further includes an autonomous-driving control system, such as autonomous-driving control system 65, which is configured to calculate a probability of pedestrian-vehicle collision, based on measurements of sensors mounted to the vehicle, and to command the pneumatic pad to start inflate at least 0.5 second before the expected time of the collision in order to protect the pedestrian.",
"Optionally, the pneumatic pad is reusable, and can be used multiple times without the need to be repaired.",
"For example, the vehicle comprises a mechanism to deflate and/or stow the pneumatic pad, without requiring its repair and/or replacement.",
"Some aspects of this disclosure involve an autonomous on-road vehicle that includes a window located at eye level of an occupant who sits in a front seat of the vehicle (e.g., a windshield), a reusable nontransparent Shock-Absorbing Energy Dissipation Padding (SAEDP), a motor, and a processor.",
"The window enables the occupant to see the outside environment.",
"The motor is configured to move the SAEDP over a sliding mechanism between first and second states multiple times without having to be repaired.",
"In the first state the SAEDP does not block the occupant's eye level frontal view to the outside environment, and in the second state the SAEDP blocks the occupant's eye level frontal view to the outside environment.",
"Additionally, in the second state the SAEDP can absorb some of the crashing energy transmitted to a pedestrian during a pedestrian-vehicle collision.",
"The processor is configured to receive, from an autonomous-driving control system, an indication indicative of whether a probability of an imminent pedestrian-vehicle collision reaches a threshold.",
"Responsive to receiving an indication of an imminent collision (e.g., within less than 2 seconds), the processor is configured to command the motor to move the SAEDP from the first state to the second state.",
"One non-limiting advantage of the vehicle described above is that it increases the safety of a pedestrian in case of a vehicle-pedestrian collision, without prohibiting the occupant of the vehicle from receiving a frontal view of the outside environment during normal driving.",
"FIG.",
"27a and FIG.",
"27b illustrate a motorized external SAEDP 121 that can move between first and second states multiple times.",
"The figures illustrate how the SAEDP 121 can move from the first state (in FIG.",
"27a) to the second state (FIG.",
"27b) by having the motor 122 move the SAEDP 121 over sliding mechanism 123.Additionally, the figures illustrate optional camera 126 that is embedded in the SAEDP 121, and which may provide video to a processor configured to generate a representation of the outside environment when the SAEDP 121 is in the second state.",
"In one embodiment, an autonomous on-road vehicle includes window 120, reusable SAEDP 121, motor 122, and processor 124.The window 120, which is located at eye level of an occupant who sits in a front seat of the vehicle, and which may be a windshield, enables the occupant to see the outside environment.",
"The SAEDP 121 is reusable, i.e., it may be moved multiple times without the need to replace it or repair it after each use.",
"The SAEDP 121 may be implemented utilizing various approaches in different embodiments described herein.",
"In one embodiment, the SAEDP 121 comprises a passive material.",
"Optionally, the SAEDP 121 has thickness greater than at least one of the following thicknesses: 1 cm, 2 cm, 5 cm, 10 cm, 15 cm, and 20 cm.",
"In another embodiment, the SAEDP 121 comprises a pneumatic pad configured to inflate in order to protect the pedestrian.",
"Optionally, the pneumatic pad is reusable, and the processor 124 is configured to command the pneumatic pad to start inflate at least 0.5 second before the expected time of the pedestrian-vehicle collision.",
"The motor 122 is configured to move the SAEDP 121 over a sliding mechanism 123 between first and second states multiple times without having to be repaired.",
"In the first state the SAEDP 121 does not block the occupant's eye level frontal view to the outside environment, and in the second state the SAEDP 121 blocks the occupant's eye level frontal view to the outside environment.",
"When in the second state, the SAEDP 121 is configured to absorb some of the crashing energy transmitted to a pedestrian during a pedestrian-vehicle collision.",
"The processor 124 is configured to receive, from an autonomous-driving control system (such as autonomous-driving control system 65), an indication indicative of whether a probability of an imminent pedestrian-vehicle collision reaches a threshold.",
"Optionally, most of the time the vehicle travels, the processor 124 does not provide an indication that the probability reaches the threshold.",
"Responsive to receiving an indication of an imminent collision (e.g., within less than 2 seconds), the processor 124 is configured to command the motor 122 to move the SAEDP 121 from the first state to the second state.",
"Optionally, the processor 124 is configured to command the motor to start moving the SAEDP 121 to the second state at least 0.2 second, 0.5 second, 1 second, or 2 seconds before the pedestrian-vehicle collision in order to protect the pedestrian.",
"In one example, the vehicle includes a sensor configured to detect the distance and angle between the vehicle and a pedestrian, and the autonomous-driving control system calculates the probability of the imminent pedestrian-vehicle collision based on the data obtained from the sensor, the velocity of vehicle and the possible maneuver.",
"In one embodiment, the processor 124 is further configured to receive an updated indication that indicates the probability of the imminent pedestrian-vehicle collision does not reach a second threshold, and to command the motor 122 to move the SAEDP to the first state.",
"Optionally, the second threshold denotes a probability for a pedestrian-vehicle collision that is equal or lower than the threshold.",
"In one embodiment, the vehicle includes a camera (such as camera 126), which is configured to take video of the outside environment while the SAEDP 121 is in the second state.",
"Additionally, in this embodiment, the vehicle may further include a computer configured to generate, based on the video, a representation of the outside environment, and a display configured to present the representation of the outside environment to the occupant while the SAEDP 121 is in the second state.",
"Optionally, the camera 126 is fixed to the SAEDP 121 from the outer side, and thus moves with the SAEDP 121 when it moves between the first and second states.",
"Optionally, the display is fixed to the SAEDP 121 from the inner side, and thus also moves with the SAEDP 121 when it moves between the first and second states; the occupant can see the display via the window 120 when the SAEDP is in the second state.",
"In an alternative embodiment, the display is physically coupled to the compartment (such as a windshield that also functions as a display) and/or comprised in an HMD worn by the occupant.",
"In addition to, or instead of, moving an SAEDP when a collision is imminent, in some embodiments, an imminent collision may prompt a raise of one or more power windows in the vehicle.",
"This approach is illustrated in the following embodiment.",
"In one embodiment, a safety system for an occupant of an autonomous on-road vehicle includes an automobile power window and an autonomous-driving control system (such as autonomous-driving control system 65).",
"The autonomous-driving control system is configured to calculate probability of an imminent collision based on data received from sensors coupled to the vehicle.",
"Responsive to detecting that the probability reaches a threshold, and at least one second before the expected collision, the autonomous-driving control system commands the power window to rise.",
"In this embodiment, a raised power window provides an improved safety for the occupant of the vehicle during collision compared to a lowered power window.",
"Optionally, responsive to detecting that the probability reaches the threshold, and at least two seconds before the expected collision, the autonomous-driving control system is configured to command the power window to rise.",
"In one embodiment, the vehicle further includes an SAEDP coupled to the power window from the inside (e.g., as illustrated in FIG.",
"24a and FIG.",
"24b).",
"In one embodiment, the power window is nontransparent, and the safety system for the occupant includes a display coupled to the power window from the inside.",
"The display is configured to present to the occupant a video see-trough (VST) of the outside environment that is generated based on a video camera pointed at the outside environment.",
"In another embodiment, the power window is made of a nontransparent material, which is stronger than a standard automotive tempered glass having the same dimensions.",
"In this embodiment, the vehicle further comprises a camera configured to take video of the outside environment (such as camera 178a), and a computer configured to generate a VST to the outside environment based on the video.",
"Optionally, the camera is physically coupled to the power window, such that the camera is raised and lowered with the power window.",
"Additionally or alternatively, the camera may be coupled to an element of the vehicle that is not the power window, such that the camera does not move up and down when the power window is raised and lowered.",
"Optionally, the vehicle further includes a display coupled to the inner side of the power window, such that the display is at eye level when the power window is raised, and below eye level when the power window is lowered; the display is configured to present the VST to the occupant.",
"Optionally, the occupant wears an HMD, and the computer is configured to present the VST to the occupant on the HMD when the power window is raised, and not to present the VST to the occupant on the HMD when the power window is lowered.",
"With autonomous vehicles, it is not necessary for occupants to sit.",
"Some aspects of this disclosure involve autonomous vehicles in which an occupant of the vehicle may lay down.",
"Such a design for an autonomous vehicle has the advantage of enabling a more comfortable position for certain activities (e.g., relaxing or sleeping).",
"Additionally, such a vehicle may be built to be lower than traditional vehicles, which can offer advantages in terms of increased safety (e.g., a lower center of gravity offers better stability) and better vehicle aerodynamics.",
"In order to increase the safety of the occupant, various forms of padding may be used in the compartment of the vehicle.",
"In some embodiments, an autonomous on-road vehicle designed for lying down includes a closed compartment and a mattress, having an average thickness of at least 3 cm, which covers at least 50% of the compartment floor.",
"In the compartment, there is a nontransparent Shock-Absorbing Energy Dissipation Padding (SAEDP), having an average thickness of at least 1 cm, which covers at least 50% of the compartment side walls and at least 60% of the compartment front wall during normal driving.",
"Optionally, the SAEDP is supported by a stiff element that resists deformation during a collision in order to reduce compartment intrusion.",
"Additionally, the vehicle includes a camera configured to take video of the outside environment, a computer configured to generate a representation of the outside environment based on the video, and a display configured to present the representation to the occupant.",
"In one embodiment, an autonomous on-road vehicle designed for lying down includes a closed compartment 210, a mattress 211, an SAEDP 212 covering portions of the compartment 210, a camera (e.g., the structure 147 that houses multiple cameras), a computer (e.g., the computer 143), and a display 215.FIG.",
"28 illustrates one embodiment of a vehicle compartment 210 in which an occupant may lay down.",
"In the figure, the occupant is lying down on mattress 211, which covers the floor of the compartment 210, and is watching a movie on the display 215.The SAEDP 212 covers the front, roof, and back of the compartment 210.It is to be noted that the SAEDP 212 also covers portions of the side walls of the compartment 210, however, this is not illustrated to enable a clearer image of the embodiment.",
"The figure also includes an airbag 216, which may be inflated below the SAEDP 212 in order to protect the occupant and restrain his/her movement in the case of a collision.",
"The mattress 211 covers at least 50% of the compartment floor.",
"Optionally, the mattress 211 covers at least 80% of the compartment floor.",
"In one embodiment, the mattress 211 has an average thickness of at least 3 cm.",
"In other embodiments, the average thickness of the mattress 211 is greater than at least one of the following thicknesses: 5 cm, 7 cm, 10 cm, 20 cm, and 30 cm.",
"The SAEDP 212 is a nontransparent SAEDP, having an average thickness of at least 1 cm.",
"Optionally, the SAEDP 212 covers at least 50% of the compartment side walls and at least 60% of the compartment front wall during normal driving.",
"In one embodiment, the average thickness of the SAEDP 212 is greater than at least one of the following thicknesses: 2 cm, 3 cm, 5 cm, 10 cm, 15 cm, and 20 cm.",
"In another embodiment, the SAEDP 212 covers at least 80% of the compartment side walls and at least 80% of the compartment front wall.",
"In yet another embodiment, the SAEDP covers at least 50% of the compartment roof.",
"In still another embodiment, the mattress and the SAEDP cover essentially the entire compartment interior.",
"In addition to the SAEDP 212, in some embodiments additional measures may be employed in order to improve the safety of the occupant.",
"In one embodiment, the vehicle includes an automotive airbag configured to deploy in front of the SAEDP 212 in order to protect the occupant, in addition to the SAEDP 212, against hitting the inner side of the vehicle compartment during a collision.",
"It is noted that the meaning that the airbag deploys in front of the SAEDP is that the airbag deploys towards the inner side of the compartment.",
"Optionally, the airbag has a stowed condition and an inflated condition, and the airbag is coupled to an inflator configured to inflate the airbag with gas upon computing a predetermined impact severity.",
"The stowed airbags may be stored in various positions, such as stored essentially in the middle of the front wall, stored essentially in the middle of the rear wall, stored in the side walls (possibly two or more horizontally spaced airbags), and stored in the roof (possibly one or more airbags towards the front of the compartment and one or more airbags towards the rear of the compartment).",
"In some embodiments, various additional safety measures may be utilized to improve the safety of the occupant while traveling, such as a sleeping net and/or a safety belt, as described for example in U.S. Pat.",
"Nos.",
"5,536,042 and 5,375,879.Stiff element 213 is configured to support the SAEDP 212 and to resist deformation during a collision in order to reduce compartment intrusion.",
"Part of the stiff element 213 is located, during normal driving, at eye level between the SAEDP 212 and the outside environment.",
"Optionally, the stiff element covers, from the outside, more than 80% of the SAEDP on the compartment side walls.",
"Optionally, the vehicle also includes a crumple zone located at eye level between the stiff element 213 and the outside environment.",
"In another embodiment, the vehicle includes a pneumatic pad configured to inflate in order to protect the occupant, in addition to the SAEDP 212, against hitting the inner side of the vehicle compartment during a collision.",
"Optionally, the pneumatic pad is configured to deploy in front of the SAEDP 212 towards the inner side of the compartment.",
"Alternatively, the pneumatic pad is located between the SAEDP 212 and the stiff element 213, and is configured to deploy behind the SAEDP 212.The pneumatic pad may be mounted to various locations, such as mounted to the front wall, mounted to the rear wall, mounted to the side walls, and/or mounted to the roof.",
"The camera is configured to take video of the outside environment.",
"The computer is configured to generate a representation of the outside environment based on the video.",
"Optionally, the representation is generated from the point of view of the occupant.",
"The display 215 is configured to present the representation to the occupant.",
"In one embodiment, the display 215 is comprised in an HMD, and the vehicle further comprises a communication system configured to transmit the representation to the HMD.",
"In another embodiment, the display 215 is physically coupled to at least one of the SAEDP 212 and the stiff element 213 at eye level of the occupant.",
"Optionally, the display 215 is a flexible display.",
"For example, the display 215 may be a flexible display that is based on at least one of the following technologies and their variants: OLED, organic thin film transistors (OTFT), electronic paper (e-paper), rollable display, and flexible AMOLED.",
"Optionally, the display 215 is flexible enough such that it does not degrade the performance of the SAEDP by more than 20% during a collision.",
"Having a vehicle compartment that is designed to allow an occupant to lay down comfortably can be done using various compartment designs, which may be different from the designs used in standard vehicles, in which occupants primarily sit up.",
"In one example, the vehicle does not have an automotive seat with a backrest and safety belt, which enables the occupant to sit straight in the front two thirds of the compartment.",
"In another example, the vehicle is designed for a single occupant, and the average distance between the mattress and the compartment roof is below 80 cm.",
"In still another example, the vehicle is designed for a single occupant, and the average distance between the mattress and the compartment roof is below 70 cm.",
"In still another example, the vehicle is designed for a single occupant, and the average distance of the compartment roof from the road is less than 1 meter.",
"And in yet another example the vehicle is designed for a single occupant, and the average distance of the compartment roof from the road is less than 80 cm.",
"It is to be noted that the use of the terms “floor”, “roof”, “side walls”, and “front wall” with respect to the compartment are to be viewed in their common meaning when one considers the compartment to be a mostly convex hull in 3D, such as having a shape that resembles a cuboid.",
"Thus, for example, an occupant whose face faces forward, will see the front wall ahead, the floor when looking below, the roof when looking above, and a side wall when looking to one of the sides (left or right).",
"In embodiments that do not resemble cuboids, alternative definitions for these terms may be used based on the relative region (in 3D space) that each of the portions of the compartment occupy.",
"For example, the floor of the compartment may be considered to be any portion of the compartment which is below at least 80% of the volume of the compartment.",
"Similarly, the roof may be any portion of the compartment that is above at least 80% of the volume of the compartment.",
"The front wall may be any portion of the compartment that is ahead of at least 80% of the volume of the compartment, etc.",
"Note that using this alternative definitions, some portions of the compartment may be characterized as belonging to two different regions (e.g., the front wall and the roof).",
"Some aspects of this disclosure involve an autonomous on-road vehicle that includes a compartment having a large mirroring element located in front of an occupant who sits in a front seat of the compartment.",
"Optionally, the mirroring element has height and width exceeding 25×25 cm, such that it covers a square that is at least those dimensions.",
"Optionally, the mirroring element captures a region corresponding to at least 10×10 degrees, including a region spanning from the horizon to 10° below the horizon, of the occupant's forward field of view during normal driving.",
"Additionally, the mirroring element provides an effect of reflecting more than 25% of the light arriving from the occupant's direction.",
"In some embodiments, the vehicle has an advantage that it can increase the perceived compartment volume, which can make travelling in the vehicle more pleasurable for some people.",
"FIG.",
"29 illustrates one embodiment of a vehicle having a front mirroring element.",
"The figure illustrates how the occupant 222 can see her reflection 223 in the mirroring element 220.In one embodiment, the mirroring element 220 is located in front of an occupant who sits in a front seat of the vehicle.",
"The mirroring element 220 provides an effect of reflecting more than 25% of the light arriving from the occupant's direction.",
"Optionally, the mirroring element 220 provides an effect of reflecting more than at least one of 50%, 80%, and 90% of the light arriving from the occupant's direction.",
"Optionally, the mirroring element 220 increases the volume of the vehicle compartment as perceived by the occupant due to the reflection effect.",
"In one embodiment, the mirroring element 220 has height and width exceeding 25×25 cm, such that it covers a square that is at least those dimensions.",
"Optionally, the mirroring element 220 captures a region corresponding to at least 10×10 degrees, including a region spanning from the horizon to 10° below the horizon, of the occupant's forward field of view during normal driving.",
"Optionally, the height and width of the mirroring element 220 is above 50×40 cm, and the mirroring element captures above 30×30 degrees of the occupant's field of view, including a region spanning from the horizon to 30° below the horizon.",
"Optionally, the mirroring element 220 covers more than 25% of the area where a conventional windshield of a normal non-autonomous on-road vehicle in year 2016 is expected to be located.",
"The mirroring element 220 may be implemented in different ways, in different embodiments.",
"In one embodiment, the mirroring element 220 comprises an optical mirror that is essentially flat and perpendicular to the ground.",
"In this embodiment, most of the effect of reflecting is generated by the optical mirror.",
"In one example, an optical mirror that is essentially flat and perpendicular to the ground refers to an optical mirror having a radius of curvature greater than a meter and a deviation below ±30° from the perpendicular to the ground.",
"In another embodiment, the mirroring element 220 comprises a Fresnel type optical reflector comprising many reflecting prisms.",
"In this embodiment, the Fresnel type optical reflector is not flat, but the reflecting prisms are arranged in angles that reflect the light from the occupant such as to imitate a flat mirror.",
"In one embodiment, the mirroring element 220 comprises an electronic display that operates based on a camera 221 configured to take video of the occupant 222, and a computer 224 configured to generate a digital representation of the occupant 223 based on the video of the occupant.",
"In this case, most of the effect of reflecting is generated by light emitted by the electronic display (which is the output of the video of the occupant as generated by the computer 224).",
"Due to the close proximity between the at least one camera 221 and the occupant, it may be necessary to stitch the reflecting effect of a large area from multiple cameras that capture the occupant from different angles.",
"In one example, the camera 221 comprises first and second cameras, located to the right and left of the occupant, respectively.",
"In another example, the camera 221 comprises first and second cameras, located above the level of the occupant's nose and below the level of the occupant's collarbone, respectively, and less than 80 cm away from the occupant.",
"In still another embodiment, the effect of reflecting is achieved by a digital mirror that comprises multiple cameras embedded within the digital mirror and configured to take images of the occupant, and multiple light emitting pixels configured to emit light rays that generate the effect of reflecting.",
"In one embodiment, the mirroring element 220 comprises an electronic display, and the vehicle further includes a camera configured to take video of the outside environment in front of the occupant, and a computer configured to generate, based on the video, a representation of the outside environment in front of the occupant at eye level, for displaying on the mirroring element 220.In addition to the effect of reflecting, in some embodiments the mirroring element 220 may also be configured to operate in a second state in which it provides an effect of reflecting less than 20% of the light arriving from the occupant's direction, and to present to the occupant the representation of the outside environment.",
"Here, presenting the representation may imitate a transparent windshield to the outside environment.",
"The vehicle may also include, in some embodiments, a display configured to present to the occupant, at eye level in front of the occupant, the representation of the outside environment instead of, or in addition to, the effect of reflecting.",
"Optionally, the vehicle may include a user interface configured to enable the occupant to switch between seeing the effect of reflecting and seeing the representation of the outside environment.",
"In one example, the display is comprised in a head-mounted display (HMD).",
"In another example, the display is mechanically coupled to the compartment, and/or the mirroring element comprises the display.",
"As described above, the effect of reflecting light that comes from the direction of the occupant may be obtained, in some embodiments, utilizing an HMD.",
"The following is a more detailed example of such an embodiment.",
"In one embodiment, an autonomous on-road vehicle includes a compartment comprising a front seat, a camera, a computer, a communication module, and an HMD.",
"The camera is physically coupled to the vehicle, configured to take images of an occupant who sits in the front seat.",
"The computer is configured to generate, based on the images, a video that shows a mirror effect.",
"Herein, the “mirror effect” involves presenting the occupant with an image that is similar to an image that the occupant would see had there been an actual mirror in front of the occupant.",
"Optionally, the system enables the occupant to have control on the synthetic mirror effect, such as control on the distance between the occupant and her image, and/or control on the width of the image.",
"The communication module is configured to transmit the video to a head-mounted display (HMD) worn by the occupant, and the HMD is configured to present the video to the occupant, such that the occupant sees a representation of his or her reflection when looking forward at eye level.",
"Optionally, the HMD is selected from the group comprising: a virtual reality headset, an augmented reality headset, and mixed reality headset.",
"Optionally, the video presented to the occupant captures at least 30×30 degrees of the occupant's field of view, spanning at least from the horizon to 30° below the horizon.",
"In one embodiment, the vehicle described above further includes a second camera configured to take a second set of images of the outside environment in front of the occupant.",
"In this embodiment, the computer is further configured to generate a representation of the outside environment based on the second set of images, and the HMD is configured to present the representation of the outside environment instead of the video that shows the mirror effect or in addition to the video that shows the mirror effect.",
"In one embodiment, the vehicle described above may include multiple cameras that capture images that are utilized by the computer to generate the video that shows the mirror effect.",
"In one example, the vehicle comprises at least first and second cameras, which are located to the right and left of the occupant, respectively.",
"In another example, the vehicle comprises at least first and second cameras, located above the level of the occupant's nose and below the level of the occupant's collarbone, respectively, and which are less than 80 cm away from the occupant.",
"Some aspects of this disclosure involve utilizing one or more nontransparent side beams in order to help protect the occupant in a case of a collision.",
"The one or more side beams are stiffer than automotive laminated glass.",
"In one example, a side beam comprises a high tensile steel pipe and pressed material.",
"In another example, a side beam comprises an aluminum extruded shape.",
"In one embodiment, an autonomous on-road vehicle that weighs less than 1500 kg without batteries includes a nontransparent side beam, which is stiffer than automotive laminated glass, and is located during normal driving to the left and at eye level of an occupant who sits in a front seat.",
"The vehicle also includes a camera configured to take video of the outside environment to the left of the occupant, and a computer configured to generate for the occupant, based on the video, a representation of the outside environment to the left of the occupant at eye level.",
"Optionally, the representation is presented to the occupant using a display.",
"In one example, the display is comprised in a head-mounted display (HMD), and the vehicle further comprises a communication system configured to transmit the representation to the HMD.",
"In another example, the display is coupled to the inner side of the compartment.",
"The following is a description of an embodiment of a vehicle in which one or more side beams may be utilized to help protect the left side of a vehicle (and an occupant therein).",
"In one embodiment, an autonomous on-road vehicle includes a nontransparent side beam, a camera (e.g., the camera 161), and a computer (e.g., the computer 143).",
"Optionally, the vehicle weighs less than 1500 kg without batteries.",
"The nontransparent side beam, which is stiffer than automotive laminated glass, is located, during normal driving, at eye level to the left of an occupant who sits in a front seat of the vehicle.",
"Optionally, the side beam is at least 60 cm long and at least 1 cm wide (herein “cm” refers to centimeters).",
"In one example, the side beam comprises a high tensile steel pipe and pressed material.",
"In another example, the side beam comprises an aluminum extruded shape.",
"The camera configured to take video of the outside environment to the left of the occupant.",
"The computer is configured to generate for the occupant, based on the video, a representation of the outside environment to the left of the occupant at eye level.",
"Optionally, the representation is generated from the point of view of the occupant, and the vehicle further includes a display configured to present the representation to the occupant.",
"In one example, the display is comprised in a head-mounted display (HMD), and the vehicle further comprises a communication system configured to transmit the representation to the HMD.",
"In another example, the display is coupled to the inner side of the compartment.",
"In some embodiments, a plurality of beams, which may be similar to the side beam described above, may be located in the region of the left side of the vehicle.",
"It is to be noted that the plurality of beams may not necessarily all have the same dimensions or be made of the same exact materials.",
"Optionally, the plurality of beams may be connected in various ways in order to form a structure that can better resist compartment deforming in the case of a collision.",
"For example, in one embodiment, the vehicle includes an additional side beam that is not parallel to the side beam and crosses it to form an “X” shaped structure.",
"Herein, an “X” shaped structure refers to any structure of two nonparallel beams that cross, and the two do not necessarily form a symmetric “X” (e.g., a symmetric “X” may be obtained when the two beams are of equal length and cross at their centers).",
"This structure is illustrated in FIG.",
"30a where beams 231 and 232 cross to form an “X” shape structure.",
"It is to be noted that the beam 231 is at eye level (i.e., at least a portion of the beam 231 is at the same height as a typical occupant's eyes).",
"FIG.",
"30a illustrates one example of a configuration of a plurality of beams located in the left side of the vehicle.",
"Different designs of vehicles may benefit from utilizing one or more sides beam as described above.",
"In one embodiment, the side beam is embedded in a movable structure that changes its location with respect to the vehicle compartment.",
"For example, the side beam may be part of a left door of the vehicle.",
"In another embodiment, the side beam is embedded in the vehicle compartment itself and does not change its location with respect to the rest of the compartment.",
"For example, the side beam may be placed in a compartment wall to the left of the occupant.",
"In order to better protect the occupant from injury due to hitting the head against the side of the vehicle, in some embodiments, the vehicle may comprise a nontransparent Shock-Absorbing Energy Dissipation Padding (SAEDP) located at eye level between the side beam and the occupant.",
"The SAEDP is less stiff than a standard automotive glass window.",
"In one example, the SAEDP comprises a passive material.",
"In another example, the SAEDP includes an airbag.",
"And in still another example, the SAEDP includes a pneumatic pad.",
"Optionally, the vehicle includes a display on which the representation of the outside environment may be presented to the occupant.",
"Optionally, the display is supported by the SAEDP and/or the side beam.",
"Optionally, the display is a flexible display.",
"In a similar fashion to the utilization of beams on the left side of the vehicle, in some embodiments, one or more beams may be used to help protect the occupant's right side.",
"For example, in one embodiment, the vehicle includes a second side beam, located at eye level to the right of the occupant, and a second camera configured to take video of the outside environment to the right of the occupant.",
"In this embodiment, the computer is further configured to generate a second representation of the outside environment to the right of the occupant.",
"Some aspects of this disclosure involve utilizing one or more nontransparent beams in order to help protect the occupant in a case of a collision.",
"The one or more beams are stiffer than automotive laminated glass.",
"In one example, a nontransparent beam comprises a high tensile steel pipe and pressed material.",
"In another example, a nontransparent beam comprises an aluminum extruded shape.",
"In one embodiment, an autonomous on-road vehicle that weighs less than 1500 kg without batteries includes a nontransparent beam, which is stiffer than automotive laminated glass, and is fixed at eye level in front of an occupant who sits in a front seat of the vehicle during normal driving.",
"The vehicle also includes a camera configured to take video of the outside environment in front of the occupant, and a computer configured to generate for the occupant, based on the video, a representation of the outside environment in front of the occupant at eye level.",
"Optionally, the representation is presented to the occupant using a display.",
"In one example, the display is comprised in a head-mounted display (HMD), and the vehicle further comprises a communication system configured to transmit the representation to the HMD.",
"In another example, the display is coupled to the inner side of the compartment.",
"The following is a description of an embodiment of a vehicle in which one or more nontransparent beams may be utilized to help protect the vehicle's front (and an occupant therein).",
"In one embodiment, an autonomous on-road vehicle includes a nontransparent beam, a camera (e.g., the camera 142), and a computer (e.g., the computer 143).",
"Optionally, the vehicle weighs less than 1500 kg without batteries.",
"The nontransparent beam, which is stiffer than automotive laminated glass, is located, during normal driving, at eye level in front an occupant who sits in a front seat of the vehicle.",
"Optionally, the nontransparent beam is at least 60 cm long and at least 1 cm wide (herein “cm” refers to centimeters).",
"In one example, the nontransparent beam comprises a high tensile steel pipe and pressed material.",
"In another example, the nontransparent beam comprises an aluminum extruded shape.",
"The camera configured to take video of the outside environment in front of the occupant.",
"The computer is configured to generate for the occupant, based on the video, a representation of the outside environment in front of the occupant at eye level.",
"Optionally, the representation is generated from the point of view of the occupant, and the vehicle further includes a display configured to present the representation to the occupant.",
"In one example, the display is comprised in a head-mounted display (HMD), and the vehicle further comprises a communication system configured to transmit the representation to the HMD.",
"In another example, the display is coupled to the inner side of the compartment.",
"In some embodiments, a plurality of beams, which may be similar to the nontransparent beam described above, may be located in the front of the vehicle.",
"It is to be noted that the plurality of beams may not necessarily all have the same dimensions or be made of the same exact materials.",
"Optionally, the plurality of beams may be connected in various ways in order to form a structure that can better resist compartment deformation in the case of a collision.",
"For example, in one embodiment, the vehicle includes an additional nontransparent beam that is not parallel to the nontransparent beam and crosses it to form an “X” shaped structure.",
"This structure is illustrated in FIG.",
"30b where beams 235 and 236 cross to form an “X” shape structure.",
"Both of the beams 235 and 236 are at eye level (i.e., at least a portion of each beam is at the same height as a typical occupant's eyes).",
"FIG.",
"30b illustrates one example of a configuration of a plurality of beams located in the front of the vehicle.",
"Different designs of vehicles may benefit from utilizing one or more nontransparent beam as described above.",
"In one embodiment, the nontransparent beam is embedded in a movable structure that changes its location with respect to the vehicle compartment.",
"For example, the nontransparent beam may be part of a front door through which the occupant may enter the vehicle.",
"In another embodiment, the nontransparent beam is embedded in the vehicle compartment itself and does not change its location with respect to the rest of the compartment.",
"For example, the nontransparent beam may be placed in a compartment wall in front of the occupant.",
"In order to better protect the occupant from injury (e.g., during a collision), in some embodiments, the vehicle may comprise a nontransparent Shock-Absorbing Energy Dissipation Padding (SAEDP) located at eye level between the nontransparent beam and the occupant.",
"The SAEDP is less stiff than a standard automotive glass window.",
"In one example, the SAEDP comprises a passive material.",
"In another example, the SAEDP includes an airbag.",
"And in still another example, the SAEDP includes a pneumatic pad.",
"Optionally, the vehicle includes a display on which the representation of the outside environment may be presented to the occupant.",
"Optionally, the display is coupled to the inner side of the compartment.",
"Optionally, the display is a flexible display.",
"Various embodiments described herein include a processor and/or a computer.",
"For example, the autonomous-driving control system may be implemented using a computer and generation of a representation of the outside environment is done using a processor or a computer.",
"The following are some examples of various types of computers and/or processors that may be utilized in some of the embodiments described herein.",
"FIG.",
"31a and FIG.",
"31b are schematic illustrations of possible embodiments for computers (400, 410) that are able to realize one or more of the embodiments discussed herein.",
"The computer (400, 410) may be implemented in various ways, such as, but not limited to, a server, a client, a personal computer, a network device, a handheld device (e.g., a smartphone), and/or any other computer form capable of executing a set of computer instructions.",
"The computer 400 includes one or more of the following components: processor 401, memory 402, computer readable medium 403, user interface 404, communication interface 405, and bus 406.In one example, the processor 401 may include one or more of the following components: a general-purpose processing device, a microprocessor, a central processing unit, a complex instruction set computing (CISC) microprocessor, a reduced instruction set computing (RISC) microprocessor, a very long instruction word (VLIW) microprocessor, a special-purpose processing device, an application specific integrated circuit (ASIC), a field programmable gate array (FPGA), a digital signal processor (DSP), a distributed processing entity, and/or a network processor.",
"Continuing the example, the memory 402 may include one or more of the following memory components: CPU cache, main memory, read-only memory (ROM), dynamic random access memory (DRAM) such as synchronous DRAM (SDRAM), flash memory, static random access memory (SRAM), and/or a data storage device.",
"The processor 401 and the one or more memory components may communicate with each other via a bus, such as bus 406.The computer 410 includes one or more of the following components: processor 411, memory 412, and communication interface 413.In one example, the processor 411 may include one or more of the following components: a general-purpose processing device, a microprocessor, a central processing unit, a complex instruction set computing (CISC) microprocessor, a reduced instruction set computing (RISC) microprocessor, a very long instruction word (VLIW) microprocessor, a special-purpose processing device, an application specific integrated circuit (ASIC), a field programmable gate array (FPGA), a digital signal processor (DSP), a distributed processing entity, and/or a network processor.",
"Continuing the example, the memory 412 may include one or more of the following memory components: CPU cache, main memory, read-only memory (ROM), dynamic random access memory (DRAM) such as synchronous DRAM (SDRAM), flash memory, static random access memory (SRAM), and/or a data storage device Still continuing the examples, the communication interface (405,413) may include one or more components for connecting to one or more of the following: an inter-vehicle network, Ethernet, intranet, the Internet, a fiber communication network, a wired communication network, and/or a wireless communication network.",
"Optionally, the communication interface (405,413) is used to connect with the network 408.Additionally or alternatively, the communication interface 405 may be used to connect to other networks and/or other communication interfaces.",
"Still continuing the example, the user interface 404 may include one or more of the following components: (i) an image generation device, such as a video display, an augmented reality system, a virtual reality system, and/or a mixed reality system, (ii) an audio generation device, such as one or more speakers, (iii) an input device, such as a keyboard, a mouse, an electronic pen, a gesture based input device that may be active or passive, and/or a brain-computer interface.",
"It is to be noted that when a processor (computer) is disclosed in one embodiment, the scope of the embodiment is intended to also cover the use of multiple processors (computers).",
"Additionally, in some embodiments, a processor and/or computer disclosed in an embodiment may be part of the vehicle, while in other embodiments, the processor and/or computer may be separate of the vehicle.",
"For example, the processor and/or computer may be in a device carried by the occupant and/or remote of the vehicle (e.g., a server).",
"As used herein, references to “one embodiment” (and its variations) mean that the feature being referred to may be included in at least one embodiment of the invention.",
"Moreover, separate references to “one embodiment”, “some embodiments”, “another embodiment”, “still another embodiment”, etc., may refer to the same embodiment, may illustrate different aspects of an embodiment, and/or may refer to different embodiments.",
"Some embodiments may be described using the verb “indicating”, the adjective “indicative”, and/or using variations thereof.",
"Herein, sentences in the form of “X is indicative of Y” mean that X includes information correlated with Y, up to the case where X equals Y. Additionally, sentences in the form of “provide/receive an indication indicating whether X happened” refer herein to any indication method, including but not limited to: sending/receiving a signal when X happened and not sending/receiving a signal when X did not happen, not sending/receiving a signal when X happened and sending/receiving a signal when X did not happen, and/or sending/receiving a first signal when X happened and sending/receiving a second signal X did not happen.",
"Herein, “most” of something is defined herein as above 51% of the something (including 100% of the something).",
"A “portion” of something refers herein to 0.1% to 100% of the something (including 100% of the something).",
"Sentences of the form “a portion of an area” refer herein to 0.1% to 100% percent of the area.",
"As used herein, the terms “comprises,” “comprising,” “includes,” “including,” “has,” “having”, or any other variation thereof, indicate an open claim language that does not exclude additional limitations.",
"The “a” or “an” is employed to describe one or more, and the singular also includes the plural unless it is obvious that it is meant otherwise.",
"Certain features of some of the embodiments, which may have been, for clarity, described in the context of separate embodiments, may also be provided in various combinations in a single embodiment.",
"Conversely, various features of some of the embodiments, which may have been, for brevity, described in the context of a single embodiment, may also be provided separately or in any suitable sub-combination.",
"Embodiments described in conjunction with specific examples are presented by way of example, and not limitation.",
"Moreover, it is evident that many alternatives, modifications, and variations will be apparent to those skilled in the art.",
"It is to be understood that other embodiments may be utilized and structural changes may be made without departing from the scope of the appended claims and their equivalents."
]
] |
Patent_15871052
|
[
[
"FRAUDULENT ACTIVITY DETECTION AT A BARCODE SCANNER BY VERIFYING VISUAL SIGNATURES",
"System and method for detecting a fraudulent activity at a barcode scanner is disclosed.",
"The method issues an alert when the fraudulent activity is confirmed by comparing the visual signature of the item being transacted over the checkout terminal to the model visual signature.",
"The model visual signature is obtained by averaging the collection of visual signature of the item gathered over a period of time.",
"A human validation via a remote processor is employed to confirm the fraudulent activity verified by a computer."
],
[
"1.A method for detecting a fraudulent activity at a checkout terminal, the checkout terminal comprising a computer, the method operated via the computer, comprising the steps of: detecting an item identifier number of an item by scanning a barcode with a barcode scanner, the barcode being affixed to the item, wherein the barcode scanner is in communication with the computer; capturing an image of the item with a camera, the camera positioned to take the image of the item, the camera being in communication with the computer, wherein the image comprises the barcode and a surrounding of the barcode; obtaining a visual signature from the image, wherein the visual signature is obtained based on the barcode and an interesting point located in the surrounding of the barcode; determining a similarity between the visual signature and a model visual signature by comparing the visual signature obtained from the image to the model visual signature associated with the item identifier number, the model visual signature representing an expected visual signature of the item, wherein a plurality of model visual signatures is stored at a storage unit being accessible to the computer, each of which being associated with an item identifier number; and detecting the fraudulent activity based on the determined similarity.",
"2.The method of claim 1 wherein the barcode scanner is at least one of an optical-based scanner and a laser-based scanner, the optical-based scanner comprising the camera.",
"3.The method of claim 1 wherein the step of obtaining a visual signature from the image comprises: detecting the interesting point from the image using an interest operator, wherein the interest operator identifies the location of the interesting point relative to the barcode.",
"4.The method of claim 3 wherein the interest operator is selected from the group consisting of: a corner detector; an edge detector; and an area of high texture.",
"5.The method of claim 1 further comprising the step of: verifying the similarity against a threshold value, wherein the threshold value sets a maximum allowed difference in the similarity; and issuing an alert when the similarity exceeds the threshold value.",
"6.The method of claim 5 wherein the alert is selected from the group consisting of: displaying an alert message on a display of the checkout terminal; issuing a visual alarm; issuing an audible alarm; and halting an operation of the checkout terminal.",
"7.The method of claim 1 wherein the step of capturing an image of the item comprises: correcting the image into a canonical view, wherein the canonical view is obtained by applying a transform to compensate for an image distortion of the image.",
"8.The method of claim 7 wherein the transform is identified by comparing a size and shape of the barcode in the image to a predetermined reference size and shape of the barcode, the predetermined reference size and shape being stored at a storage unit being accessible to the computer.",
"9.The method of claim 8 wherein the size and shape of the barcode in the image is determined by at least one of: fitting a bounding box around the barcode; identifying at least two corner points of the barcode and relations between the at least two corner points; and calculating a parameter of a plane on which the barcode resides.",
"10.The method of claim 7 where in the transform is selected from the group consisting of: scale transform, rotational transform, projective transform, and barrel transform.",
"11.The method of claim 1 wherein the step of determining a similarity between the visual signature and a model visual signature comprises: collecting a group of visual signatures from the item over time; and creating a probabilistic model of the group of visual signatures to obtain the model visual signature of the item.",
"12.The method of claim 11 wherein the group of visual signatures of the item is updated by adding the obtained visual signature to the group of visual signatures.",
"13.The method of claim 1 wherein the model visual signature is a probabilistic model of a group of visual signatures obtained from the item over time, the group of visual signatures being updated by adding the obtained visual signature to the group of visual signatures if no fraudulent activity is detected based on the obtained visual signature.",
"14.A checkout system for detecting a fraudulent activity, comprising: a computer; a barcode scanner in communication with the computer, the barcode scanner positioned to detect an item identifier number of an item from a barcode, the barcode being affixed to the item; a camera in communication with the computer, the camera positioned to capture an image of the item, wherein the image comprises the barcode and a surrounding of the barcode; and the checkout system in communication with a storage unit via a network, wherein the checkout system is configured to: obtain a visual signature from the image, wherein the visual signature is obtained based on the barcode and an interesting point located in the surrounding of the barcode; determine a similarity between the visual signature and a model visual signature by comparing the visual signature obtained from the image to the model visual signature associated with the item identifier number, the model visual signature representing an expected visual signature of the item, wherein a plurality of model visual signatures is stored at a storage unit being accessible to the computer, each of which being associated with an item identifier number; and detect the fraudulent activity based on the determined similarity.",
"15.The checkout system of claim 14 wherein the barcode scanner is at least one of an optical-based scanner and a laser-based scanner, the optical-based scanner comprising the camera.",
"16.The checkout system of claim 14 further comprising an alert system, wherein the alert system issues an alert when the similarity exceeds a threshold value, wherein the threshold value sets a maximum allowed difference in the similarity.",
"17.The checkout system of claim 14 wherein the checkout system is configured to obtain the visual signature from the image by detecting the interesting point from the image using an interest operator, wherein the interest operator identifies the location of the interesting point relative to the barcode.",
"18.The checkout system of claim 14 wherein the checkout system is configured to: collect a group of visual signatures from the item over time; and create a probabilistic model of the group of visual signatures to obtain the model visual signature of the item.",
"19.The checkout system of claim 18 wherein the group of visual signatures of the item is updated by adding the obtained visual signature to the group of visual signatures.",
"20.The checkout system of claim 14 wherein the model visual signature is a probabilistic model of a group of visual signatures obtained from the item over time, the group of visual signatures being updated by adding the obtained visual signature to the group of visual signatures if no fraudulent activity is detected based on the obtained visual signature."
],
[
"<SOH> BACKGROUND <EOH>"
],
[
"<SOH> SUMMARY <EOH>The subject matter of this application may involve, in some cases, interrelated products, alternative solutions to a particular problem, and/or a plurality of different uses of a single system or article.",
"In one aspect, a method for detecting a fraudulent activity at a checkout terminal is provided.",
"The checkout terminal may comprise a computer.",
"The method may begin with the computer detecting an item identifier number of an item from the barcode with a barcode scanner, where the barcode is affixed to the item.",
"The barcode scanner may be in communication with the computer.",
"Further, the camera may capture an image of the item and be positioned to take an image of the item.",
"The camera may be in communication with the computer.",
"The image capture by the camera may comprise the barcode and a surrounding of the barcode.",
"The method may carry on by the computer obtaining a visual signature from the image.",
"Finally, the computer may determine a similarity between the visual signature and a model visual signature to verify the fraudulent activity, by comparing the visual signature obtained from the image to the model visual signature linked to the item identifier number.",
"The model visual signature may represent an expected visual signature of the item, where the model visual signature is stored at a storage unit being accessible to the computer.",
"In another aspect, a checkout terminal for detecting a fraudulent activity is provided.",
"The checkout terminal may comprise a computer, a barcode scanner, a camera, and a storage unit in communication with the checkout terminal via a network.",
"The barcode scanner may be in communication with the computer and positioned to detect an item identifier number of an item from a barcode that is affixed to the item.",
"The camera may be in communication with the computer and positioned to capture an image of the item, where the image comprises the barcode and a surrounding of the barcode.",
"The checkout terminal may be configured to obtain a visual signature from the image.",
"Further, the checkout terminal may be configured to determine a similarity between the visual signature and a model visual signature to verify the fraudulent activity, by comparing the visual signature obtained from the image to the model visual signature linked to the item identifier number.",
"The model visual signature may represent an expected visual signature of the item, where the model visual signature may be stored at the storage unit."
],
[
"CROSS-REFERENCE TO RELATED APPLICATIONS This application is a continuation utility patent application which claims the benefit to and priority from U.S. patent application Ser.",
"No.",
"14/591,883 filed on Jan. 7, 2015.BACKGROUND Field of the Invention The present invention relates generally to a security system and method to prevent fraudulent activities occurring at a checkout terminal.",
"More particularly, it relates to a method and system for detecting a fraudulent activities using a barcode scanner and a camera.",
"The present invention, in part, provides a solution to detect a fraudulent activity known as “ticket switching”.",
"Description of Related Art Retailer lose billions of dollars annually due to the theft and improper scanning of the merchandise they are selling.",
"This can occur in numerous ways, due to both employees stealing from the retailers as well as due to customers stealing.",
"Of all the methods used which result in loss to the retailer, a significant portion occurs at the checkout itself.",
"Improper scanning, “sweethearting”, leaving items unscanned in carts and shopping baskets are just some of the ways in which customers and cashiers alike contribute to inventory “shrinkage” which results in a loss for the retailer.",
"One way in particular that a cashier or a customer can engage in fraudulent activity is through a process called ticket switching.",
"Ticket switching is the process of replacing the barcode of one item with a barcode of another item of lesser value.",
"(This is enabled by means as simple as pre-printing the less expensive barcode on a sticker before entering the store.)",
"For instance, one could replace the barcode on the box of an expensive cordless drill with the barcode of an inexpensive tool.",
"Thus, when the item is rung up for sale, the less-priced item is recorded instead.",
"If it is the customer engaging in the fraud, the customer may hope that the cashier does not notice the difference.",
"Likewise, a customer could use a self-checkout register and bypass that mode of uncertainty altogether.",
"If it is the cashier engaged in the fraud, often in collusion with the customer, he or she may have various other ways of engaging in the act of ticket switching.",
"They may have barcodes ready on the side which are scanned in place of the certain expensive items.",
"For instance, in a grocery store, the cashier may wish to ring up an expensive meat item for a friend by scanning in an inexpensive item, like a can of beans, in place of the meat barcode.",
"Likewise, a cashier may stick the barcode of an inexpensive item to his or her wrist such that the wrist barcode gets scanned while the cashier moves a more expensive item (with its barcode un-viewable by the scanner) across the scanner.",
"Such fraudulent activities significantly contribute to the inventory shrinkage and subsequent loss of revenue for retailers.",
"Therefore, what is needed is a system and method that protects retailers' assets from inadvertent or deliberate loss by preventing a fraudulent activity at a barcode scanner.",
"SUMMARY The subject matter of this application may involve, in some cases, interrelated products, alternative solutions to a particular problem, and/or a plurality of different uses of a single system or article.",
"In one aspect, a method for detecting a fraudulent activity at a checkout terminal is provided.",
"The checkout terminal may comprise a computer.",
"The method may begin with the computer detecting an item identifier number of an item from the barcode with a barcode scanner, where the barcode is affixed to the item.",
"The barcode scanner may be in communication with the computer.",
"Further, the camera may capture an image of the item and be positioned to take an image of the item.",
"The camera may be in communication with the computer.",
"The image capture by the camera may comprise the barcode and a surrounding of the barcode.",
"The method may carry on by the computer obtaining a visual signature from the image.",
"Finally, the computer may determine a similarity between the visual signature and a model visual signature to verify the fraudulent activity, by comparing the visual signature obtained from the image to the model visual signature linked to the item identifier number.",
"The model visual signature may represent an expected visual signature of the item, where the model visual signature is stored at a storage unit being accessible to the computer.",
"In another aspect, a checkout terminal for detecting a fraudulent activity is provided.",
"The checkout terminal may comprise a computer, a barcode scanner, a camera, and a storage unit in communication with the checkout terminal via a network.",
"The barcode scanner may be in communication with the computer and positioned to detect an item identifier number of an item from a barcode that is affixed to the item.",
"The camera may be in communication with the computer and positioned to capture an image of the item, where the image comprises the barcode and a surrounding of the barcode.",
"The checkout terminal may be configured to obtain a visual signature from the image.",
"Further, the checkout terminal may be configured to determine a similarity between the visual signature and a model visual signature to verify the fraudulent activity, by comparing the visual signature obtained from the image to the model visual signature linked to the item identifier number.",
"The model visual signature may represent an expected visual signature of the item, where the model visual signature may be stored at the storage unit.",
"BRIEF DESCRIPTION OF THE DRAWINGS FIG.",
"1 provides an embodiment of the checkout terminal.",
"FIG.",
"2 provides a flowchart showing an embodiment of the method for detecting a fraudulent activity at the checkout terminal.",
"FIG.",
"3 provides a flowchart of an exemplary embodiment overviewing the steps involved in obtaining the model visual signature.",
"FIG.",
"4 provides an exemplary embodiment of the barcode scanner.",
"FIG.",
"5 provides examples of image distortions.",
"FIG.",
"6 provides an exemplary embodiments of correcting the scale distortion.",
"FIG.",
"7 provides an exemplary embodiments of correcting the rotational distortion.",
"FIG.",
"8 provides an exemplary embodiments of correcting the affine distortion.",
"FIG.",
"9 provides an exemplary embodiments of correcting projective distortion.",
"FIG.",
"10 provides an exemplary embodiment of the visual signature.",
"DETAILED DESCRIPTION The detailed description set forth below in connection with the appended drawings is intended as a description of presently preferred embodiments of the invention and does not represent the only forms in which the present invention may be constructed and/or utilized.",
"The description sets forth the functions and the sequence of steps for constructing and operating the invention in connection with the illustrated embodiments.",
"Generally, the present invention concerns a system and method for detecting a fraudulent activity at checkout terminal having a barcode scanner.",
"Specifically, the present invention provides a solution to detect and prevent a fraudulent activity commonly known as “ticket switching”.",
"Ticket switching is a process of replacing a barcode of an item with another barcode of another item of lesser value.",
"Often times, the barcode of an item is altered by attaching another barcode of another item to cover up the existing barcode on the item.",
"Thus ticket switching or barcode replacing still leaves other elements or features of the item intact to that item.",
"For example, packaging of the item carries various visual features such as color, shape, and characters, in addition to the barcode.",
"As such, the present invention provides a system and method that detects the fraudulent activity (for example, ticket switching) by identifying a partial or substantial change of the item's visual features.",
"The system and method provided herein may be employed to detect other similar types of fraudulent activity that may occur at the checkout terminal.",
"The change can be verified by comparing the item's visual features linked to the barcode with the item's visual features obtained during a transaction of such item at the checkout terminal.",
"Once the barcode is switched to another item, the corresponding visual features are likely to be altered, thus the present invention provides a system and method that is capable of detecting such changes by verifying the visual features of the item in question.",
"Each of the items being scanned over the checkout terminal may be severally verified by the system and method provided herein.",
"Further, the present invention provides a system and method that provides alerts once the fraudulent activity is detected at the checkout terminal.",
"The alerts may be given in many different ways which are disclosed in the following descriptions.",
"Camera contemplated herein may include, but are not limited to, DSLR, non-SLR digital cameras (e.g., but not limited to, compact digicams and SLR-like bridge digital cameras (also known as advanced digital cameras), and SLR-like interchangeable lens digital cameras), as well as video recorders (e.g., but not limited to, camcorders, analog cameras and IP cameras, and the like; a device that can provide a video feed of any duration, such as a DVR; a portable computing device having a camera, such as a tablet computer, laptop computer); and the like.",
"Storage unit contemplated herein may store data in the format including, but are not limiting to, XML, JSON, CSV, binary, over any connection type: serial, Ethernet, etc.",
"over any protocol: UDP, TCP, and the like.",
"Image contemplated herein may be any digital image format capable of being interpreted by a computer or computing device.",
"Examples of image files contemplated herein include, but are not limited to JPEG, GIF, TIFF, PNG, Bitmap, RAW, PNM, WEBP, and the like.",
"Computer contemplated herein may include, but are not limited to, desktop computers, laptop computers, tablet computers, handheld computers, smart phones and other cellular phones, and similar internet enabled mobile devices, digital cameras, a customized computing device configured to specifically carry out the methods contemplated in this disclosure, and the like.",
"Barcode contemplated herein may be of any type of machine-readable medium, including but not limited to a barcode, a QR code, two-dimensional bar code, a prescribed font, optical character recognition (OCR) characters, Radio Frequency Identification (RFID), Near-Field Communication (NFC), Bluetooth technology, alphanumeric characters, non-alphanumeric characters, symbols, facial recognition and the like.",
"Network contemplated herein may include, for example, one or more of the Internet, Wide Area Networks (WANs), Local Area Networks (LANs), analog or digital wired and wireless telephone networks (e.g., a PSTN, Integrated Services Digital Network (ISDN), a cellular network, and Digital Subscriber Line (xDSL)), radio, television, cable, satellite, and/or any other delivery or tunneling mechanism for carrying data.",
"Network may include multiple networks or sub-networks, each of which may include, for example, a wired or wireless data pathway.",
"The network may include a circuit-switched voice network, a packet-switched data network, or any other network able to carry electronic communications.",
"Examples include, but are not limited to, Picture Transfer Protocol (PTP) over Internet Protocol (IP), IP over Bluetooth, IP over WiFi, and PTP over IP networks (PTP/IP).",
"Barcode scanner contemplated herein may include, but are not limited to, a laser-based scanner, an optical-based scanner, and the like.",
"Video contemplated herein may be any data format capable of being interpreted by a computer or computing device.",
"Examples of image files contemplated herein include, but are not limited to MP4, AVI, MPG, M4V, FLV, MOV, WMV, VOB, and the like.",
"The system for detecting a fraudulent activity at a checkout terminal is provided.",
"The system may comprise a camera, a barcode scanner, a computer with one or more processors, and a storage unit accessible by the computer via a network.",
"The system may comprise one or more computers or computerized elements in communication working together to carry out the different functions of the system.",
"The invention contemplated herein further may comprise non-transitory computer readable media configured to instruct a computer or computers to carry out the steps and functions of the system and method, as described herein.",
"In one embodiment, the system may be implemented with the checkout terminal.",
"The checkout terminal for detecting a fraudulent activity may comprise a computer, a barcode scanner, a camera, and a storage unit.",
"The barcode scanner may detect an item identifier number of an item being transacted over the barcode scanner by reading the barcode affixed to the item.",
"The barcode scanner may be operable to communicate with the computer for further processing of the item identifier number.",
"The barcode scanner may be of any type capable of sensing or reading the barcode in order to scan and record items being transacted over the checkout terminal.",
"In one embodiment, the barcode scanner may be a laser-based scanner.",
"In another embodiment, the barcode scanner may be an optical-based scanner.",
"The optical-based scanner utilizes an image of the item to identify the barcode.",
"The item identifier number may be, for example, a stock keeping unit number (SKU) or product lookup number (PLU).",
"The camera may be positioned to capture an image of the item being transacted over the barcode scanner.",
"The image may be captured such that it includes the barcode and a surrounding of the barcode.",
"The camera may be operable to communicate with the computer for further processing of the captured image.",
"The camera may be further capable of recording a video or a snippet of video while the checkout terminal is operational or while the checkout terminal is scanning multiple items during the transaction of the items.",
"The snippet of video may comprise at least one image of the item.",
"For example, the snippet of video may comprise multiple images or frames showing the item viewed from various angles.",
"In one embodiment, the camera and the barcode scanner may be integrated into the optical-based scanner.",
"The optical-based scanner uses a digital imaging sensor or sensors to read barcodes in order to scan and record the item being transacted at the checkout terminal.",
"As such, the optical-based scanner comprises the camera integrated therein.",
"The checkout terminal for detecting a fraudulent activity may comprise multiple cameras situated to capture the image of the item at multiple angles.",
"For instance, the item may be affixed with multiple barcodes, in such instance, multiple cameras may work together to capture multiple images including the multiple barcodes affixed to the item.",
"In another embodiment, the camera may be positioned nearby the barcode scanner, such that detection of the barcode by the barcode scanner and image capture by the camera occur substantially at the same time.",
"In yet another embodiment, the camera may be an overhead camera which are positioned to provide a better view of the item during the transaction of the item at the checkout terminal.",
"The camera may be utilized to serve different functions, not limiting to the operational and functional embodiments disclosed herein.",
"Similarly, the camera may be employed to serve more than one function, for example, to prevent other types of fraudulent activities that happen at the checkout terminal.",
"The storage unit may be operable to communicate with the checkout terminal and its components.",
"The storage unit may receive images being taken by the camera for further verification of the fraudulent activity.",
"The storage unit also may receive item identifier numbers from the barcode scanner for further verification of the fraudulent activity.",
"In particular, the storage unit may be accessible by the computer for comparing the image of the item captured during an instance of the transaction to an image that is expected by the item identifier number of the item of that instance.",
"The steps and functions of the method for detecting a fraudulent activity utilizing the system and/or checkout terminal described above are further discussed herein.",
"Turning now to FIG.",
"1, an embodiment of the checkout terminal is provided.",
"The checkout terminal 101 comprises the barcode scanner 103 integrated with the camera 104.Further, the checkout terminal 101 comprises the computer 102 having one or more processor, and a display 105.The barcode scanner 103 and the camera 104 are in communication with the computer 102.The checkout terminal 101 is in communication with the storage unit 107 via a network 106.The display may provide a computerized user interface for an attendant to monitor the transaction at the checkout terminal.",
"In one embodiments, the display may allow input and output relating to the steps and actions of the system and method described herein.",
"In another embodiment, the display may provide access to the data storage unit 107 via the network 106.In some embodiments, a remote processor 109 may be further in communication with the checkout terminal via the network.",
"The remote processor 109 may further verify the fraudulent activity from a remote location or by employing a different method of verification.",
"The verification of the fraudulent activity identified by the computer may be necessary to be confirmed, so that a false-positive verification of the fraudulent activity can be prevented.",
"The remote processor 109, for example, may receive the image or a video from the camera for a human validation of the fraudulent activity.",
"In some embodiments, the checkout terminal 101 may be in further communication with an alert system 108.The alert system 108 may issue an alert when the fraudulent activity is confirmed by the computer.",
"In one embodiment, the alert may be a visual alarm, such as light or other visual signals.",
"In another embodiment, the alert may be an audible alarm.",
"In yet another embodiment, the alert may be an alert message presented on the display.",
"The display may be monitored by a cashier at the checkout terminal or an attendant in case the checkout terminal is a self-checkout terminal.",
"Examples of the alert message may include, but are not limited to, a text message, email, or other electronic messages.",
"In a further embodiment, the alert may be initiated by halting the operation of the checkout terminal or the self-checkout terminal.",
"Upon halting of the operation, a review of the alert may be required by the attendant.",
"The review may be conducted by the attendant physically verifying the alert.",
"The review also may be conducted by the attendant receiving a snippet of video sent to the checkout terminal or an attendant's remote processor.",
"The snippet of video may be provided by the camera which includes at least a portion of the video recording the item during the transaction relevant in time to the fraudulent activity in question, possibly up to and including the entire transaction up to that point, in order for the attendant to quickly review what has occurred to trigger the alert.",
"In a further embodiment, the snippet of video may comprise at least one image of the item.",
"For example, the snippet of video may comprise multiple images or frames showing the item viewed from various angles, making the review by the attendant easier.",
"The snippet of video also may comprise the image captured by the camera.",
"Further, the attendant may review the transaction, correct any errors, and allow the transaction to continue once the alert is resolved.",
"A method for detecting a fraudulent activity at a checkout terminal is provided.",
"The method may be employed by the system and/or the checkout terminal provided above.",
"The method for detecting a fraudulent activity may begin with detecting the item identifier number of the item being transacted over the checkout terminal with the barcode scanner.",
"The item identifier number of the item may be detected by reading the barcode affixed to the item.",
"The barcode scanner may be operable to communicate with the computer.",
"The image of the item may be captured with the camera positioned at the checkout terminal.",
"In one embodiment, the image may be captured such that it includes the barcode of the item and the surrounding of the barcode.",
"Further, the computer may obtain a visual signature from the image.",
"In one embodiment, the interesting point may be automatically chosen by the interest operator.",
"The interest operator is an image processing functions that detect interesting locations within an image.",
"In another embodiment, the visual signature may be obtained by detecting an interesting point from the image using an interest operator.",
"The interesting point may be located in the surrounding of the barcode captured in the image.",
"The visual signature may be obtained by detecting a plurality of interesting points.",
"The interest operator may be any combination of a corner detector, an edge detector, and an area of high texture.",
"These interest operator provides visual features unique to the item in addition to the barcode.",
"In yet another embodiment, the visual features may include scale-invariant feature transform (SIFT) or speeded up robust features (SURF) features, which are rotationally and scale invariant.",
"Other visual features, may include, but are not limited to, affine invariant features, histogram based approaches, image-based features (e.g.",
"image patches), and the like.",
"The computer may determine a similarity between the visual signature and a model visual signature to verify whether the item being analyzed has been fraudulently tempered.",
"The similarity may be determined by comparing the visual signature from the image to the model visual signature linked to the item or the item identifier number.",
"The model visual signature represents an expected visual signature of the item which may be accessible from the storage unit.",
"In one embodiment, the model visual signature may be obtained by collecting a group of visual signatures from the item.",
"As the item is transacted multiple times over the checkout terminal in a period of time, the visual signatures from each of the transactions of the item may be collected.",
"Once collected, a probabilistic model of the group of visual signatures may be calculated to obtain the model visual signature that can be compared against the visual signature of the item as the item is transacted post obtainment of the model visual signature.",
"In one embodiment, the probabilistic model may be a statistical model retrieved from the group of visual signatures.",
"In general, it is understood that “model” can refer to any piece of data, statistical or otherwise, that is used to compare the current instance of an item's visual signature with what is expected of that item (model visual signature).",
"As such, in some embodiments, the probabilistic model may be a nonparametric probabilistic model.",
"The nonparametric probabilistic model of the group of visual signature may be calculated to obtain the model visual signature that can be compared against the visual signature of the item as the item is transacted post obtainment of the model visual signature.",
"By way of a non-limiting example, a nonparametric probabilistic model can be constructed by collecting ten of the visual signatures from the most recent transactions of the item.",
"The similarity of a new visual signature from a subsequent item can be determined by first comparing the new visual signature to each of the ten visual signatures within the nonparametric probabilistic model.",
"As a result, ten similarities can be gathered from each of the ten comparisons.",
"The least different similarity among the ten similarities can then be used as the similarity for the subsequent item.",
"Thus, the nonparametric probabilistic model is the visual signature corresponding to the least different similarity among the ten.",
"Various other similarity measures can be applied as well, including median, mean, etc.",
"Furthermore, various approaches to collecting the models can also be employed in a nonparametric strategy.",
"In another embodiment, statistically, a probability that the visual signature is sampled from the model visual signature may be determined by using a likelihood estimate.",
"This is measured mathematically as P(D|M), probability of observing this data, D, given the model M. This constitutes a most likely, or ML, estimate.",
"This is related in many cases to taking a simple difference of the visual signature in comparison to the model visual signature.",
"In the case where the model visual signature may be just an average of the appearances of various visual signatures seen over time, and the visual signatures are image patches, this is exactly what the likelihood estimate consists of.",
"The likelihood estimate can then be compared with a threshold value.",
"It can also be compared with likelihood estimate taken from one or more of the other model visual signatures stored in the data storage unit in order to determine which model visual signature the current visual signature is most likely to have been sampled from.",
"This is related to the maximum a-posteriori estimate of the data, P ( M | D ) = P ( D | M ) P ( M ) ∑ i P ( D | M i ) P ( M i ) .",
"From this, one can see the ML estimate, P(D|M), is used in this calculation, but it is used in conjunction with calculation of the likelihood estimate taken from all the other visual signature models over which one wishes to compare it with.",
"In yet another embodiment, the probabilistic model may be obtained by taking an average of the group of visual signatures which takes an average of the appearances of various visual signatures collected over the period of time.",
"In a further embodiment, the model visual signature may be approximated according to Gaussian distribution.",
"In this embodiment, the similarity may be examined by a threshold value, where the threshold value represents a boundary of acceptable similarity range within the Gaussian distribution gathered from the group of visual signatures.",
"Thus, the threshold value may set a maximum allowed difference in the similarity.",
"A size of the group of visual signature required to obtain an accurate model visual signature may vary.",
"Similarly, the size of the group of visual signatures required to begin measuring the similarity may vary.",
"In one embodiment, the size of the group of visual signatures may be determined by a measure of variances among the collected group of visual signatures.",
"The measure of variances may represent how self-similar the collected visual signatures are as the item is transacted multiple times over the checkout terminal in a period of time.",
"If they are sufficiently similar or the measure of variance is low, then a smaller size of the group may be needed to build an effective model visual signature.",
"Likewise, if the collected visual signatures are quite dissimilar or the measure of variance is high, it may take more samples in order to build an effective model visual signature.",
"In one embodiment, the measure of variance to determine the size of the group of visual signatures can be accomplished by using online methods of learning the parameters of a Gaussian distribution, using the magnitude of the variances to determine the spread or cohesiveness of the collected group of visual signatures.",
"In another embodiment, the size of the group of visual signatures may be determined by setting a predetermined size of the group of visual signatures.",
"In this embodiment, the model visual signature is obtained and applied to measure the similarity, once the predetermined size of the group of visual signatures are collected.",
"A further maintenance of the model visual signature may be continuously undertaken as more of the visual signature of the same item is obtained over a period of time.",
"In one embodiment, the visual signature obtained, at each instance of transactions of the item over the checkout terminal, may be added to the group of visual signatures to update the model visual signature continuously.",
"This embodiment may only apply if verification of the fraudulent activity yields false, in other words, the visual signature matches the model visual signature.",
"In another embodiment, the computer may reset the group of visual signatures.",
"In case where the model visual signature is deemed inaccurate the reset may be needed.",
"In this embodiment, the computer may being to reset the group of visual signatures when a predetermined number of occasions indicating a mismatch between the visual signature and the model visual signature has been observed.",
"The reset may begin by discarding the current model visual signature and rebuilding the group of visual signatures.",
"The reset may begin to take place, while the currently active model visual signature continues to apply to determine the similarity.",
"Once an accurate and new model visual signature is obtained from the reset, the currently active model visual signature may be replaced with the one created by the reset.",
"The method for detecting a fraudulent activity may further involve the alert system.",
"When the visual signature of the item does not match the model visual signature, in other words, when the similarity determines that the visual signature is not within the acceptable similarity range, the computer may issue an alert.",
"The similarity may be verified against the threshold value.",
"The threshold value may represent represents a boundary of acceptable similarity range within the Gaussian distribution gathered from the group of visual signatures.",
"The threshold value also may be an absolute measurement of similarity which sets the maximum allowed difference against the model visual signature.",
"The method for detecting a fraudulent activity may further involve the remote processor.",
"The remote processor may further verify or preliminarily verify the fraudulent activity prior to issuing the alarm.",
"In one embodiment, the remote processor may receive the image for a human validation of the fraudulent activity.",
"Once received, the human validation may take place by a human to determine the veracity of the fraudulent activity at a remote location having access to the remote processor.",
"The result of the human validation may be sent back to the computer.",
"In another embodiment, the snippet of video may be sent to the remote processor by the computer for the human validation.",
"The snippet of video may comprise at least one image of the item.",
"For example, the snippet of video may comprise multiple images or frames showing the item viewed from various angles.",
"In yet another embodiment, the human validation may be requested to the remote processor by the computer based on a confidence score.",
"The confidence score may represent a degree of difference between the visual signature and the model visual signature.",
"The human validation can be considered an extension of the matching process itself rather than a distinct step.",
"Thus, if the optional human validation step is undertaken, then the result of that decision is taken as the ultimate result of the verification process.",
"This is particularly useful in the case in which the verification process carried by the computer as described above shows a negative match, but the human validation step shows a positive match.",
"In this case, not only is a false alert prevented, but the visual signature of such instance can then be used to update the model visual signature.",
"The method for detecting a fraudulent activity may further comprise correcting the image into a canonical view.",
"In order to facilitate the creation of the visual signature, correcting image distortions in the image may be necessary.",
"Correcting the image distortions may help to extract and compare the visual features or the interesting points within the surrounding of the barcode, by creating a uniform perspective with which to base the comparison against the model visual signature.",
"Examples of image distortions may include, but are not limited to, scale distortion, rotational distortion, projective distortion, and barrel distortion.",
"The canonical view may be obtained by applying a transform to compensate for the image distortions.",
"In one embodiment, the transform may be identified by comparing a size and shape of the barcode in the image to a predetermined reference size and shape of the barcode.",
"The predetermined reference size and shape corresponding to the identifier number may be stored at the storage unit and accessible to the computer.",
"In another embodiment, the size and shape of the barcode in the image may be determined by fitting a bounding box around the barcode within the image.",
"The bounding box need not be axis-aligned.",
"In yet another embodiment, the size and shape of the barcode in the image may be determined by identifying at least two corner points of the barcode and their relations between the two within the image.",
"In yet another embodiment, the size and shape of the barcode in the image may be determined by calculating a parameter of a plane on which the barcode resides.",
"The barcode may be affixed to the item in more than one location.",
"Item packaging often contains more than one barcodes.",
"This allows barcode scanners to scan items when the item can be in many different orientations with respect to the barcode scanner or the camera.",
"Thus, multiple model visual signature may be required to accommodate the many different orientations.",
"This may be achieved by using typical multi-modal statistical methods.",
"By way of example, if an item has two barcodes on its packaging, the model visual signature obtained will be bimodal.",
"Likewise, if it has three barcodes, the model visual signature obtained will be trimodal.",
"There are many number of methods known in the art to achieve this, including mean-shift, minimum description length, expectation maximization approaches, etc.",
"Furthermore, a number can simply be chosen for how “modal” the distribution should be.",
"For this, a simple k-means classification scheme can be used, where k is the chosen number of modes, or barcodes, on the item.",
"In many scenarios, this is often the better choice, as often times there may be multiple barcodes on the packaging, though one or two may get the majority of the scans.",
"Furthermore, selecting a value of k that is only slightly too high does not typically create poor models, as the one or two superfluous modes are simply starved out.",
"Again, these approaches to statistical modeling would be apparent to those having ordinary skill in the art.",
"FIG.",
"2 shows a flow chart of an embodiment of the method for detecting a fraudulent activity at the checkout terminal.",
"In step 201, the computer detects an item identifier number of an item.",
"Then the camera captures an image of the item 202.From the captured image, the computer further obtains a visual signature from the image 203.The visual signature obtained from step 203 is then compared with the model visual signature to determine the similarity between the visual signature and the model visual signature 204.At 205, the fraudulent activity is verified by matching the visual signature and the model visual signature.",
"If they match the computer passes 206 the item being transacted.",
"If not, the computer issues the alert 207.FIG.",
"3 shows a flow chart of an exemplary embodiment overviewing the steps involved in obtaining the model visual signature.",
"At 301, the group of visual signatures is collected by the camera and stored in the storage unit.",
"Once the group of visual signatures is collected, the computer creates the probabilistic model 302.Then, the model visual signature is obtained 303 by various methods described above.",
"The obtained model visual signature may further be updated 304 by adding additional visual signature to the group or be reset 305 if the obtained model visual signature is in accurate.",
"FIG.",
"4 illustrates an exemplary embodiment of the barcode scanner.",
"In this exemplary embodiment, the barcode scanner 103 comprises two glass panels 401 402 positioned to face the item at the bottom or the side.",
"The glass panels 401 402 can hold the camera therein to capture the image of the item as its barcode is scanned through either of the two glass panels 401 402.FIG.",
"5 shows examples of image distortions.",
"The image shown in 501 represents the canonical view of the image containing the barcode and the surrounding at its predetermined reference size and shape.",
"In this image the barcode reads from left to right.",
"As shown in 502, the image may contain the scale distortion.",
"An example of the rotational distortion is shown in 503.Lastly, example of the projective distortion is shown in 504.FIG.",
"6-9 illustrate exemplary embodiments of correcting the image into the canonical view.",
"In FIG.",
"6, the image 601 is distorted with a scale distortion.",
"To correct the scale distortion from the image, a scale transform can be applied to the image 601.At 602, the scale transform is identified by first fitting the bounding box 603 around the barcode within the image to determine the size and shape of the barcode in the image.",
"Then the size and shape of the barcode in the image is compared to the predetermined reference size and shape of the barcode corresponding to the item identifier number to calculate the scale transform.",
"The image at 604 shows the image with the scale distortion removed by applying the scale transform to the image 601.In FIG.",
"7, the image 701 is distorted with a rotational distortion.",
"To correct the rotational distortion from the image, a rotational transform can be applied to the image 701.At 702, the rotational transform is identified by first fitting the bounding box 603 around the barcode within the image to determine the size and shape of the barcode in the image.",
"Then the size and shape of the barcode in the image is compared to the predetermined reference size and shape of the barcode corresponding to the item identifier number to calculate the rotational transform.",
"The image at 703 shows the image with the rotational distortion removed by applying the rotational transform to the image 701.In FIG.",
"8, the image 801 is distorted both with a scale distortion and a rotational distortion.",
"The combination of the scale distortion and the rotational distortion results in the affine distortion.",
"To correct the affine distortion, both rotation and scale, from the image, the affine transform can be applied to the image 801.At 802, the affine transform is identified by first fitting the bounding box 603 around the barcode within the image to determine the size and shape of the barcode in the image.",
"Then the size and shape of the barcode in the image is compared to the predetermined reference size and shape of the barcode corresponding to the item identifier number to calculate the affine transform.",
"The image at 803 shows the image with the affine distortion removed by applying the affine transform to the image 801.In FIG.",
"9, the image 901 is distorted with a perspective distortion.",
"To correct the perspective distortion, the parameter of a plane on which the barcode resides on the image is calculated.",
"This process is also called ground plane rectification.",
"Once the barcode is fitted with the bounding box 603 at 902, the projective transform can be obtained by comparing the size and shape of the barcode in the image to the predetermined reference size and shape of the barcode corresponding to the item identifier number.",
"The projective transform is applied to the image at 901 to arrive at the canonical view 903.FIG.",
"10 illustrates an exemplary embodiment of the visual signature.",
"The detected barcode 1008 obtained from the image by either the camera or the optical-based scanner is identified.",
"In the surrounding of the barcode 1009, a plurality of interesting points (1001 1002 1003 1004 1005 1006 1007) are detected by the computer.",
"In this exemplary embodiment, the visual signature comprises the plurality of interesting points, the barcode, and locations of each of the plurality of interesting points relative to the barcode.",
"While several variations of the present invention have been illustrated by way of example in preferred or particular embodiments, it is apparent that further embodiments could be developed within the spirit and scope of the present invention, or the inventive concept thereof.",
"However, it is to be expressly understood that such modifications and adaptations are within the spirit and scope of the present invention, and are inclusive, but not limited to the following appended claims as set forth.",
"Those skilled in the art will readily observe that numerous modifications, applications and alterations of the device and method may be made while retaining the teachings of the present invention."
]
] |
Patent_15871053
|
[
[
"Shock-absorbing energy dissipation padding placed at eye level in an autonomous vehicle",
"A Shock-Absorbing Energy Dissipation Padding (SAEDP) is coupled to the compartment of an autonomous on-road vehicle, and is located, during normal driving, at eye level in front of an occupant who sits in a front seat of the vehicle.",
"The vehicle further includes a stiff element that supports the SAEDP and resists deformation during collision in order to reduce compartment intrusion.",
"The stiff element is located, during normal driving, at eye level between the SAEDP and the outside environment.",
"Optionally, a camera takes video of the outside environment in front of the occupant, and a computer generates for the occupant a representation of the outside environment."
],
[
"1.An autonomous on-road vehicle, comprising: a compartment; a nontransparent Shock-Absorbing Energy Dissipation Padding (SAEDP) that is coupled to the compartment and is located, during normal driving, at eye level in front of an occupant who sits in a front seat of the vehicle; and a stiff element configured to support the SAEDP.",
"2.The autonomous on-road vehicle of claim 1, wherein the SAEDP comprises a passive material, which is less stiff than a standard automotive glass window; whereby the SAEDP protects the occupant's head against hitting the inner side of the vehicle compartment during a collision.",
"3.The autonomous on-road vehicle of claim 2, wherein the passive material has thickness greater than at least one of the following thicknesses: 1 cm, 2 cm, 5 cm, 10 cm, 15 cm, and 20 cm.",
"4.The autonomous on-road vehicle of claim 1, wherein the SAEDP comprises an automotive airbag configured to protect the occupant's head against hitting the inner side of the vehicle compartment during collision; wherein during normal driving the airbag is located, at its stowed state, at eye level in front of the occupant.",
"5.The autonomous on-road vehicle of claim 1, wherein the SAEDP comprises a pneumatic pad configured to inflate in order to protect the occupant's head against hitting the inner side of the vehicle compartment during collision.",
"6.The autonomous on-road vehicle of claim 1, further comprising a second SAEDP coupled to the outer front of the vehicle to minimize damage to a pedestrian during a pedestrian-vehicle collision.",
"7.The autonomous on-road vehicle of claim 1, wherein the stiff element is nontransparent, it resists deformation during collision in order to reduce compartment intrusion, and is located, during normal driving, at eye level between the SAEDP and the outside environment.",
"8.The autonomous on-road vehicle of claim 1, wherein the stiff element is an automotive window and is located, during normal driving, at eye level between the SAEDP and the outside environment.",
"9.The autonomous on-road vehicle of claim 1, further comprising a camera configured to take video of the outside environment in front of the occupant, and a computer configured to generate, based on the video, a representation of the outside environment in front of the occupant at eye level.",
"10.The autonomous on-road vehicle of claim 9, wherein the representation is generated from the point of view of the occupant.",
"11.The autonomous on-road vehicle of claim 9, further comprising a display configured to present the representation to the occupant.",
"12.The autonomous on-road vehicle of claim 11, wherein the display is supported by at least one of the SAEDP and the stiff element, and the display is flexible enough such that it does not degrade the performance of the SAEDP by more than 20% during a collision.",
"13.The autonomous on-road vehicle of claim 9, further comprising a head-mounted display (HMD) configured to present the representation to the occupant, and a communication system configured to transmit the representation to the HMD.",
"14.The autonomous on-road vehicle of claim 9, wherein the camera comprises multiple cameras directed to multiple directions around the vehicle, and the multiple cameras support generating multiple representations of the outside environment from different points of view.",
"15.The autonomous on-road vehicle of claim 9, wherein the computer is further configured to manipulate the representation in order to improve the look of the outside environment.",
"16.The autonomous on-road vehicle of claim 15, wherein manipulating of the representation includes at least one of the following manipulations: converting captured video of a winter day to video of a sunny day by preserving main items in the captured video and applying effects of a sunny day, converting unpleasant environment to a nice one, and converting standard vehicles to futuristic or old fashion vehicles.",
"17.The autonomous on-road vehicle of claim 1, further comprising a crumple zone located at eye level between the stiff element and the outside environment.",
"18.The autonomous on-road vehicle of claim 1, wherein the vehicle weighs less than 1,000 kg and is designed to carry up to two occupants.",
"19.The autonomous on-road vehicle of claim 1, wherein the vehicle weighs less than 500 kg without batteries and comprises an engine that is able to sustain continuously at most 40 horsepower.",
"20.The autonomous on-road vehicle of claim 1, wherein the vehicle weighs less than 400 kg without batteries and is designed to carry up to two occupants."
],
[
"<SOH> BACKGROUND <EOH>Non-armored on-road vehicles, including autonomous and non-autonomous vehicles, include as part of the vehicle body one or more windows, such as a windshield, side windows, or a rear window.",
"The purpose of these windows is to offer vehicle occupants a view of the outside world.",
"However, this feature comes at a cost and there are several drawbacks to using windows in vehicles.",
"Vehicle windows are typically made of glass or other transparent stiff materials.",
"This makes most windows heavy and often expensive to manufacture.",
"In addition, windows are typically poor thermal insulators, which can greatly increase the energy demands of a vehicle's climate control systems.",
"However, one of the major drawbacks of having windows in vehicles relates to the safety risks they pose in the case of a collision.",
"Due to its stiffness, the vehicle's occupant is at a risk of being hit by the window and suffer from a head injury.",
"Additionally, in order to avoid obstruction of the view, various support structures such as beams need to be placed outside of the window area, which can weaken the vehicle's structural integrity during collision.",
"While safety systems have been developed and deployed over the years in order to address the safety shortcomings of windows, they only offer a partial redress.",
"For example, stowed airbags that deploy in the case of a collision have become a widespread safety system in many modern vehicles.",
"However, many airbag systems are designed not to deploy in the case of minor collisions, such as collisions that occur at low speeds, which can still pose a risk of major bodily harm to the vehicle's occupants (e.g., in the case of an impact with the vehicle's side).",
"Thus, there is a need for vehicles that can offer the view of the outside, which is offered by the vehicle windows, but without the shortcomings of the vehicle windows, such as the increased safety risk that windows often pose."
],
[
"<SOH> SUMMARY <EOH>Some aspects of this disclosure involve an autonomous on-road vehicle that includes a nontransparent Shock-Absorbing Energy Dissipation Padding (SAEDP) that is coupled to the compartment of the vehicle and is located, during normal driving, at eye level in front of an occupant who sits in a front seat of the vehicle.",
"Additionally, the vehicle includes a stiff element that supports the SAEDP and resists deformation during collision in order to reduce compartment intrusion.",
"The stiff element is located, during normal driving, at eye level between the SAEDP and the outside environment.",
"Thus, the combination of the SAEDP and the stiff element offers the occupant an increased level of protection in the case of a collision, compared to a vehicle in which a traditional window is in place at eye level in the front of the vehicle.",
"However, due to it being nontransparent, placing the SAEDP at eye level may obstruct the occupants view to the outside.",
"Thus, in order to offer the occupant such a view, in some embodiments, the vehicle also includes a camera configured to take video of the outside environment in front of the occupant, and a computer configured to generate, based on the video, a representation of the outside environment in front of the occupant at eye level.",
"This representation may be provided to the occupant using various types of displays.",
"One non-limiting advantage of the vehicle described above is that it increases the safety of the occupant during collision without prohibiting the occupant from obtaining a view of the outside environment."
],
[
"CROSS-REFERENCE TO RELATED APPLICATIONS This Application is a Continuation of U.S. application Ser.",
"No.",
"15/335,404, filed Oct. 26, 2016, which claims priority to U.S.",
"Provisional Patent Application No.",
"62/246,187, filed on 26 Oct. 2015, and U.S.",
"Provisional Patent Application No.",
"62/369,127, filed on 31 Jul.",
"2016.BACKGROUND Non-armored on-road vehicles, including autonomous and non-autonomous vehicles, include as part of the vehicle body one or more windows, such as a windshield, side windows, or a rear window.",
"The purpose of these windows is to offer vehicle occupants a view of the outside world.",
"However, this feature comes at a cost and there are several drawbacks to using windows in vehicles.",
"Vehicle windows are typically made of glass or other transparent stiff materials.",
"This makes most windows heavy and often expensive to manufacture.",
"In addition, windows are typically poor thermal insulators, which can greatly increase the energy demands of a vehicle's climate control systems.",
"However, one of the major drawbacks of having windows in vehicles relates to the safety risks they pose in the case of a collision.",
"Due to its stiffness, the vehicle's occupant is at a risk of being hit by the window and suffer from a head injury.",
"Additionally, in order to avoid obstruction of the view, various support structures such as beams need to be placed outside of the window area, which can weaken the vehicle's structural integrity during collision.",
"While safety systems have been developed and deployed over the years in order to address the safety shortcomings of windows, they only offer a partial redress.",
"For example, stowed airbags that deploy in the case of a collision have become a widespread safety system in many modern vehicles.",
"However, many airbag systems are designed not to deploy in the case of minor collisions, such as collisions that occur at low speeds, which can still pose a risk of major bodily harm to the vehicle's occupants (e.g., in the case of an impact with the vehicle's side).",
"Thus, there is a need for vehicles that can offer the view of the outside, which is offered by the vehicle windows, but without the shortcomings of the vehicle windows, such as the increased safety risk that windows often pose.",
"SUMMARY Some aspects of this disclosure involve an autonomous on-road vehicle that includes a nontransparent Shock-Absorbing Energy Dissipation Padding (SAEDP) that is coupled to the compartment of the vehicle and is located, during normal driving, at eye level in front of an occupant who sits in a front seat of the vehicle.",
"Additionally, the vehicle includes a stiff element that supports the SAEDP and resists deformation during collision in order to reduce compartment intrusion.",
"The stiff element is located, during normal driving, at eye level between the SAEDP and the outside environment.",
"Thus, the combination of the SAEDP and the stiff element offers the occupant an increased level of protection in the case of a collision, compared to a vehicle in which a traditional window is in place at eye level in the front of the vehicle.",
"However, due to it being nontransparent, placing the SAEDP at eye level may obstruct the occupants view to the outside.",
"Thus, in order to offer the occupant such a view, in some embodiments, the vehicle also includes a camera configured to take video of the outside environment in front of the occupant, and a computer configured to generate, based on the video, a representation of the outside environment in front of the occupant at eye level.",
"This representation may be provided to the occupant using various types of displays.",
"One non-limiting advantage of the vehicle described above is that it increases the safety of the occupant during collision without prohibiting the occupant from obtaining a view of the outside environment.",
"BRIEF DESCRIPTION OF THE DRAWINGS The embodiments are herein described by way of example only, with reference to the accompanying drawings.",
"No attempt is made to show structural details of the embodiments in more detail than is necessary for a fundamental understanding of the embodiments.",
"In the drawings: FIG.",
"1 is a schematic illustration of components of a system configured to combine video see-through (VST) with video-unrelated-to-the-VST (VUR); FIG.",
"2 illustrates an HMD tracking module that measures the position of the HMD relative to the compartment; FIG.",
"3 illustrates a vehicle in which an occupant wears an HMD; FIG.",
"4 illustrates an occupant wearing an HMD and viewing large VUR and smaller VST; FIG.",
"5a illustrates how the VST moves to the upper left when the occupant looks to the bottom right; FIG.",
"5b illustrates how the VST moves to the bottom right when the occupant looks to the upper left; FIG.",
"6 illustrates HMD-video that includes both a non-transparent VST and video that shows the hands of the occupant and the interior of the compartment; FIG.",
"7 illustrates HMD-video that includes both a partially transparent VST and video that shows the hands of the occupant and the interior of the compartment; FIG.",
"8 illustrates HMD-video that includes a VST and partially transparent video that shows the hands of the occupant and the interior of the compartment; FIG.",
"9a illustrates HMD-video that includes a VUR in full FOV, a first window comprising compartment-video (CV) and a second smaller window comprising the VST; FIG.",
"9b illustrates HMD-video that includes VUR in full FOV, a first window comprising the CV and a second partially transparent smaller window comprising the VST; FIG.",
"10a illustrates HMD-video that includes VUR in full FOV, a first window comprising VST and a second smaller window comprising zoom out of the CV; FIG.",
"10b illustrates HMD-video that includes VUR and a partially transparent CV; FIG.",
"11a illustrates a FOV of a vehicle occupant when the occupant wears an HMD that presents HMD-video; FIG.",
"11b illustrates a FOV of a vehicle occupant when the vehicle occupant does not wear an HMD that presents the video, such as when watching an autostereoscopic display; FIG.",
"11c illustrates FOV of a 3D camera that is able to capture sharp images from different focal lengths; FIG.",
"12 is a schematic illustration of components of a system configured to enable an HMD to cooperate with a window light shading module; FIG.",
"13a illustrates a first mode for a shading module where an occupant sees the outside environment through the optical see-through component; FIG.",
"13b illustrates a second mode for a shading module where the occupant sees the outside environment through a VST; FIG.",
"14 illustrates a VST over a curtain; FIG.",
"15 illustrates a light shading module that is unfurled on the inside of the compartment; FIG.",
"16 illustrates a light shading module that is unfurled on the outside of the compartment; FIG.",
"17 is a schematic illustration of components of a video system that may be used to increase awareness of an occupant of a vehicle regarding an imminent SDRS; FIG.",
"18a illustrates presenting VUR to an occupant when there is no indication that an SDRS event is imminent; FIG.",
"18b illustrates presenting VST responsive to receiving an indication that an SDRS event is imminent (a pothole); FIG.",
"18c illustrates presenting VST responsive to receiving an indication that an SDRS event is imminent (a sharp turn); FIG.",
"19a illustrates presenting VUR and VST when there is no indication that an SDRS event is imminent; FIG.",
"19b illustrates presenting a larger VST responsive to receiving an indication that an SDRS event is imminent (a road bump); FIG.",
"19c illustrates presenting a partially transparent VST responsive to receiving an indication that an SDRS event is imminent; FIG.",
"20a illustrates a smart glass shading module when there is no indication that an SDRS event is imminent; FIG.",
"20b illustrates the smart glass shading module when there is an indication that an SDRS event is imminent; FIG.",
"21a and FIG.",
"21b illustrate vehicles with an SAEDP in their compartment were an occupant uses an HMD to receive a representation of the outside environment; FIG.",
"22 illustrates a vehicle with an SAEDP in the vehicle's compartment with displays; FIG.",
"23 illustrates how an SAEDP protects the occupant in a side collision; FIG.",
"24a and FIG.",
"24b illustrate a vehicle with a motor configured to move a nontransparent SAEDP to cover a side window; FIG.",
"25a and FIG.",
"25b illustrate a vehicle with a motor configured to move a front SAEDP between first and second states; FIG.",
"26a illustrates an SAEDP mounted to the front of a vehicle at eye level of an occupant of the vehicle; FIG.",
"26b illustrates an outer SAEDP that includes two air bags; FIG.",
"27a and FIG.",
"27b illustrate a motorized external SAEDP that can move between first and second states multiple times; FIG.",
"28 illustrates a vehicle compartment in which an occupant may lay down; FIG.",
"29 illustrates a vehicle with a front mirror; FIG.",
"30a illustrates one example of a configuration of a plurality of beams located in the left side of the vehicle; FIG.",
"30b illustrates one example of a configuration of a plurality of beams located in the front of the vehicle; and FIG.",
"31a and FIG.",
"31b are schematic illustrations of computers able to realize one or more of the embodiments discussed herein.",
"DETAILED DESCRIPTION The following are definitions of various terms that may be used to describe one or more of the embodiments in this disclosure.",
"The terms “autonomous on-road vehicle” and “autonomous on-road manned vehicle” refer to cars and motorcycles designed to drive on public roadways utilizing automated driving of level 3 and above according to SAE International standard J3016 “Taxonomy and Definitions for Terms Related to On-Road Motor Vehicle Automated Driving Systems”.",
"For example, the autonomous on-road vehicle may be a level 3 vehicle, in which within known, limited environments, drivers can safely turn their attention away from driving tasks; the autonomous on-road vehicle may be a level 4 vehicle, in which the automated system can control the vehicle in all but a few environments; and/or the autonomous on-road vehicle may be a level 5 vehicle, in which no human intervention is required and the automatic system can drive to any location where it is legal to drive.",
"Herein, the terms “autonomous on-road vehicle” and “self-driving on-road vehicle” are equivalent terms that refer to the same.",
"The term “autonomous on-road vehicle” does not include trains, airplanes, boats, and armored fighting vehicles.",
"An autonomous on-road vehicle utilizes an autonomous-driving control system to drive the vehicle.",
"The disclosed embodiments may use any suitable known and/or to be invented autonomous-driving control systems.",
"The following three publications describe various autonomous-driving control systems that may be utilized with the disclosed embodiments: (i) Paden, Brian, et al.",
"“A Survey of Motion Planning and Control Techniques for Self-driving Urban Vehicles.” arXiv preprint arXiv:1604.07446 (2016); (ii) Surden, Harry, and Mary-Anne Williams.",
"“Technological Opacity, Predictability, and Self-Driving Cars.” Predictability, and Self-Driving Cars (Mar.",
"14, 2016) (2016); and (iii) Gonzalez, David, et al.",
"“A Review of Motion Planning Techniques for Automated Vehicles.” IEEE Transactions on Intelligent Transportation Systems 17.4 (2016): 1135-1145.Autonomous-driving control systems usually utilize algorithms such as machine learning, pattern recognition, neural network, machine vision, artificial intelligence, and/or probabilistic logic to calculate on the fly the probability of an imminent collision, or to calculate on the fly values that are indicative of the probability of an imminent collision (from which it is possible to estimate the probability of an imminent collision).",
"The algorithms usually receive as inputs the trajectory of the vehicle, measured locations of at least one nearby vehicle, information about the road, and/or information about environmental conditions.",
"Calculating the probability of an imminent collision is well known in the art, also for human driven vehicles, such as the anticipatory collision system disclosed in U.S. Pat.",
"No.",
"8,041,483 to Breed.",
"In order to calculate whether a Sudden Decrease in Ride Smoothness (SDRS) event is imminent, the autonomous-driving control system may compare parameters describing the state of the vehicle at time t1 with parameters describing the state of the vehicle at time t2 that is shortly after t1.If the change in one or more of the parameters reaches a threshold (such as deceleration above a certain value, change of height in the road above a certain value, and/or an angular acceleration above a certain value) then it may be determined that an SDRS event is imminent.",
"An “occupant” of a vehicle, as the term is used herein refers to a person that is in the vehicle when it drives.",
"The term “occupant” refers to a typical person having a typical shape, such as a 170 cm tall human (herein “cm” refers to centimeters).",
"An occupant may be a driver, having some responsibilities and/or control regarding the driving of the vehicle (e.g., in a vehicle that is not completely autonomous), or may be a passenger.",
"When an embodiment refers to “the occupant of the vehicle”, it may refer to one of the occupants of the vehicle.",
"Stating that a vehicle has an “occupant” should not be interpreted that the vehicle necessarily accommodates only one occupant at a time, unless that is explicitly stated, such as stating that the vehicle is “designed for a single occupant”.",
"Herein, a “seat” may be any structure designed to hold an occupant travelling in the vehicle (e.g., in a sitting and/or reclining position).",
"A “front seat” is a seat that positions an occupant it holds no farther from the front of the vehicle than any other occupants of the vehicle are positioned.",
"Herein, sitting in a seat also refers to sitting on a seat.",
"Sitting in a seat is to be interpreted in this disclosure as occupying the space corresponding the seat, even if the occupant does so by assuming a posture that does not necessarily correspond to sitting.",
"For example, in some vehicles the occupant may be reclined or lying down, and in other vehicles the occupant may be more upright, such as when leaning into the seat in a half standing half seating position similar to leaning into a Locus Seat by Focal Upright LLC.",
"The interchangeable terms “environment outside the vehicle” and “outside environment” refer to the environment outside the vehicle, which includes objects that are not inside the vehicle compartment, such as other vehicles, roads, pedestrians, trees, buildings, mountains, the sky, and outer space.",
"A sensor “mounted to the vehicle” may be connected to any relevant part of the vehicle, whether inside the vehicle, outside the vehicle, to the front, back, top, bottom, and/or to a side of the vehicle.",
"A sensor, as used herein, may also refer to a camera.",
"The term “camera” refers herein to an image-capturing device that takes images of an environment.",
"For example, the camera may be based on at least one of the following sensors: a CCD sensor, a CMOS sensor, a near infrared (NIR) sensor, an infrared sensor (IR), and a device based on active illumination such as a LiDAR.",
"The term “video” refers to a series of images that may be provided in a fixed rate, variable rates, a fixed resolution, and/or dynamic resolutions.",
"The use of a singular “camera” should be interpreted herein as “one or more cameras”.",
"Thus, when embodiments herein are described as including a camera that captures video and/or images of the outside environment in order to generate a representation of the outside environment, the representation may in fact be generated based on images and/or video taken using multiple cameras.",
"Various embodiments described herein involve providing an occupant of the vehicle with representation of the outside environment, generated by a computer and/or processor, based on video taken by a camera.",
"In some embodiments, video from a single camera (e.g., which may be positioned on the exterior of the vehicle at eye level), may be sent to presentation to the occupant by the processor and/or computer following little, if any, processing.",
"In other embodiments, video from a single camera or multiple cameras is processed in various ways, by the computer and/or processor, in order to generate the representation of the outside environment that is presented to the occupant.",
"Methods and systems for stitching live video streams from multiple cameras, stitching live video streams with database objects and/or other video sources, transforming a video stream or a stitched video stream from one point of view to another point of view (such as for generating a representation of the outside environment for an occupant at eye level, or for generating a compartment view for a person standing outside the compartment), tracking the position of an HMD relative to a compartment, and presenting rendered images that are perfectly aligned with the outside world—are all known in the art of computer graphics, video stitching, image registration, and real-time 360° imaging systems.",
"The following publications are just a few examples of reviews and references that describe various ways to perform the video stitching, image registration, tracking, and transformations, which may be utilized by the embodiments disclosed herein: (i) Wang, Xiaogang.",
"“Intelligent multi-camera video surveillance: A review.” Pattern recognition letters 34.1 (2013): 3-19.",
"(ii) Szeliski, Richard.",
"“Image alignment and stitching: A tutorial.” Foundations and Trends® in Computer Graphics and Vision 2.1 (2006): 1-104.",
"(iii) Tanimoto, Masayuki.",
"“FTV: Free-viewpoint television.” Signal Processing: Image Communication 27.6 (2012): 555-570.",
"(iv) Ernst, Johannes M., Hans-Ullrich Doehler, and Sven Schmerwitz.",
"“A concept for a virtual flight deck shown on an HMD.” SPIE Defense+ Security.",
"International Society for Optics and Photonics, 2016.",
"(v) Doehler, H-U., Sven Schmerwitz, and Thomas Lueken.",
"“Visual-conformal display format for helicopter guidance.” SPIE Defense+ Security.",
"International Society for Optics and Photonics, 2014.",
"(vi) Sanders-Reed, John N., Ken Bernier, and Jeff GUell “Enhanced and synthetic vision system (ESVS) flight demonstration.” SPIE Defense and Security Symposium.",
"International Society for Optics and Photonics, 2008.And (vii) Bailey, Randall E., Kevin J. Shelton, and J. J. Arthur III.",
"“Head-worn displays for NextGen.” SPIE Defense, Security, and Sensing.",
"International Society for Optics and Photonics, 2011.A video that provides “representation of the outside environment” refers to a video that enables the average occupant, who is familiar with the outside environment, to recognize the location of the vehicle in the outside environment from watching the video.",
"In one example, the average occupant is a healthy 30 years old human who is familiar with the outside environment, and the threshold for recognizing a video as a “representation of the outside environment” is at least 20 correct recognitions of the outside environment out of 30 tests.",
"Herein, sentences such as “VST that represents a view of the outside environment from the point of view of the occupant”, or “VST representation of the outside environment, which could have been seen from the point of view of the occupant” refer to a video representing at least a portion of the outside environment, with a deviation of less than ±20 degrees from the occupant's point of view of the outside environment, and zoom in the range of 30% to 300% (assuming the occupant's unaided view is at 100% zoom level).",
"The VST may be generated based on at least one of the following resources: a video of the outside environment that is taken in real-time, a video of the outside environment that was taken in the past and is played/processed according to the trajectory of the vehicle, a database of the outside environment that is utilized for rendering the VST according to the trajectory of the vehicle, and/or a video that is rendered as function of locations of physical objects identified in the outside environment using detection and ranging systems such as RADAR and/or LIDAR.",
"Moreover, the term “video see-through (VST)” covers both direct representations of the outside environment, such as a video of the outside environment, and/or enriched video of the outside environment, such as captured video and/or rendered video of the outside environment presented together with one or more layers of virtual objects, as long as more than 20% of the average vehicle occupants, who are familiar with the outside environment, would be able to determine their location in the outside environment, while the vehicle travels, without using a map, and with a margin of error below 200 meters.",
"However, it is noted that showing a map that indicates the location of the vehicle on the driving path (such as from the start to the destination) is not considered herein as equivalent to the VST, unless the map includes all of the following properties: the map shows images of the path, the images of the path capture at least 5 degrees of the occupant's FOV at eye level, and the images of the path reflect the dynamics of the vehicle and change in a similar manner to a video taken by a camera mounted to the vehicle and directed to the outside environment.",
"Herein, “field of view (FOV) of the occupant to the outside environment” refers to the part of the outside environment that is visible to the occupant of a vehicle at a particular position and orientation in space.",
"In one example, in order for an occupant-tracking module to calculate the FOV to the outside environment of an occupant sitting in a vehicle compartment, the occupant-tracking module determines the position and orientation of the occupant's head.",
"In another example, in order for an occupant-tracking module to calculate the FOV of an occupant sitting in a vehicle compartment, the occupant-tracking module utilizes an eye tracker.",
"It is noted that sentences such as “a three dimensional (3D) video see-through (VST) that represents a view of the outside environment, which could have been seen from the point of view of the occupant had the FOV not been obstructed by at least a portion of the nontransparent element” cover also just one or more portions of the FOV, and are to be interpreted as “a three dimensional (3D) video see-through (VST) that represents a view of at least a portion of the outside environment, which could have been seen from the point of view of the occupant had at least some of the FOV not been obstructed by at least a portion of the nontransparent element”.",
"The term “display” refers herein to any device that provides a human user with visual images (e.g., text, pictures, and/or video).",
"The images provided by the display may be two-dimensional or three-dimensional images.",
"Some non-limiting examples of displays that may be used in embodiments described in this disclosure include: (i) screens and/or video displays of various devices (e.g., televisions, computer monitors, tablets, smartphones, or smartwatches), (ii) headset- or helmet-mounted displays such as augmented-reality systems (e.g., HoloLens), virtual-reality systems (e.g., Oculus rift, HTC Vive, or Samsung GearVR), and mixed-reality systems (e.g., Magic Leap), and (iii) image projection systems that project images on a occupant's retina, such as: Virtual Retinal Displays (VRD) that create images by scanning low power laser light directly onto the retina, or light-field technologies that transmit light rays directly into the eye.",
"Various embodiments may include a reference to elements located at eye level.",
"The “eye level” height is determined according to an average adult occupant for whom the vehicle was designed, who sits straight and looks to the horizon.",
"Sentences in the form of “an element located at eye level of an occupant who sits in a vehicle” refer to the element and not to the occupant.",
"The occupant is used in such sentences in the context of “eye level”, and thus claims containing such sentences do not require the existence of the occupant in order to construct the claim.",
"Sentences such as “SAEDP located at eye level”, “stiff element located at eye level”, and “crumple zone located at eye level” refer to elements that are located at eye level, but may also extended to other levels, such as from sternum level to the roof level, from floor level to eye level, and/or from floor level to roof level.",
"For example, an SAEDP located at an eye level can extend from sternum level to above the occupant's head, such that at least a portion of the SAEDP is located at the eye level.",
"Herein, “normal driving” refers to typical driving conditions, which persist most of the time the vehicle is in motion.",
"During normal driving the probability of a collision is below a threshold that when reached typically involves one or more of the following actions: deployment of safety devices that are not usually deployed (e.g., inflating airbags), taking evasive action to avoid a collision, and warning occupants of the vehicle about an imminent event that may cause a Sudden Decrease in Ride Smoothness (SDRS).",
"A Shock-Absorbing Energy Dissipation Padding (SAEDP) is an element that may be used to cushion impact of a body during a collision or during SDRS events.",
"Various types of SAEDPs may be used in embodiments described herein, such as passive materials, airbags, and pneumatic pads.",
"Some examples of passive materials that may be used for the SAEDP in one or more of the disclosed embodiments include one or more of the following materials: CONFOR® foam by Trelleborg Applied Technology, Styrofoam by The Dow Chemical Company, Micro-Lattice Materials and/or Metallic Microlattices (such as by HRL Laboratories in collaboration with researchers at University of California and Caltech), non-Newtonian energy Absorbing materials (such as D30® by D30 lab, and DEFLEXION™ by Dow Corning®), Sorbothane® by Sorbothane Incorporated, and padding that includes compression cells and/or shock absorbers of the Xenith LLC type (such as described in U.S. Pat.",
"No.",
"8,950,735 and US patent application num.",
"20100186150), and materials that include rubber such as a sponge rubber.",
"The term “stiff element” refers to a material having stiffness and impact resistance equal or greater than that of glazing materials for use in motor vehicles as defined in the following two standards: (i) “American National Standard for Safety Glazing Materials for Glazing Motor Vehicles and Motor Vehicle Equipment Operating on Land Highways-Safety Standard” ANSI/SAE Z26.1-1996, and (ii) The Society of Automotive Engineers (SAE) Recommended Practice J673, revised April 1993, “Automotive Safety Glasses” (SAE J673, rev.",
"April 93).",
"The term “stiff element” in the context of low speed vehicles refers to a material having stiffness and impact resistance equal or greater than that of glazing materials for use in low speed motor vehicles as defined in Federal Motor Vehicle Safety Standard 205—Glazing Materials (FMVSS 205), from 49 CFR Ch.",
"V (10-1-04 Edition).",
"The stiff element may be transparent (such as automotive laminated glass, or automotive tempered glass) or nontransparent (such as fiber-reinforced polymer, carbon fiber reinforced polymer, steel, or aluminum).",
"Herein, a nontransparent element is defined as an element having Visible Light Transmittance (VLT) between 0% and 20%, which does not enable the occupant to recognize what lies on the other side of it.",
"For example, a thick ground glass usually allows light to pass through it but does not let the occupant recognize the objects on the other side of it, unlike plain tinted glass that usually lets the occupant recognize the objects on the other side of it, even when it features VLT below 10%.",
"The nontransparent element includes an opaque element having VLT of essentially 0% and includes a translucent element having VLT below 20%.",
"VLT is defined as the amount of incident visible light that passes through the nontransparent element, where incident light is defined as the light that strikes the nontransparent element.",
"VLT is also known as Luminous Transmittance of a lens, a light diffuser, or the like, and is defined herein as the ratio of the total transmitted light to the total incident light.",
"The common clear vehicle windshield has a VLT of approximately 85%, although US Federal Motor Vehicle Safety Standard No.",
"205 allows the VLT to be as low as 70%.",
"Sentences such as “video unrelated to the VST (VUR)” mean that an average occupant would not recognize the video as a representation of the outside environment.",
"In some embodiments, the content of the VUR does not change as function of the position of the occupant's head, which means that the point of view from which the occupant watches the VUR does not change essentially when the occupant's head moves.",
"Herein, stabilization effects, image focusing, dynamic resolution, color corrections, and insignificant changes to less than 10% of the frame as function of the position of the occupant's head—are still considered as content that does not change as function of the position of the occupant's head.",
"Examples of such content (common in the year 2016) include cinema movies, broadcast TV shows, standard web browsers, and Microsoft Office 2016 applications (such as Word, Excel and PowerPoint).",
"Herein, a “crumple zone” refers to a structure designed to slow down inertia and absorb energy from impact during a traffic collision by controlled deformation.",
"The controlled deformation absorbs some of the impact within the outer parts of the vehicle, rather than being directly transferred to the occupants, while also preventing intrusion into and/or deformation of the compartment.",
"Crumple zone may be achieved by various configurations, such as one or more of the following exemplary configurations: (i) by controlled weakening of sacrificial outer parts of the vehicle, while strengthening and increasing the stiffness of the inner parts of the vehicle, such as by using more reinforcing beams and/or higher strength steels for the compartment; (ii) by mounting composite fiber honeycomb or carbon fiber honeycomb outside the compartment; (iii) by mounting an energy absorbing foam outside the compartment; and/or (iv) by mounting an impact attenuator that dissipates impact.",
"In order to enable an occupant of a vehicle to view the outside environment, without needing to look out of a physical window, some aspects of this disclosure involve systems that combine video see-through (VST) with video-unrelated-to-the-VST (VUR).",
"In one embodiment, a system configured to combine video see-through (VST) with video-unrelated-to-the-VST (VUR) includes a head-mounted display (HMD), a camera, an HMD tracking module and a computer.",
"The HMD is configured to be worn by an occupant of a compartment of a moving vehicle and to present an HMD-video to the occupant.",
"The camera, which is mounted to the vehicle, is configured to take video of the outside environment (Vout).",
"The HMD tracking module is configured to calculate position of the HMD relative to the compartment, based on measurements of a sensor.",
"The computer is configured to receive a location of a video see-through window (VSTW) in relation to the compartment, and to calculate, based on the position of the HMD relative to the compartment, a window-location for the VSTW on the HMD-video.",
"Additionally, the computer is further configured to generate, based on the window-location and the Vout, the VST that represents a view of the outside environment from the point of view of the occupant.",
"The computer is also configured to generate the HMD-video based on combining the VUR with the VST in the window-location.",
"It is to be noted that the content of the VUR is unrelated to the video taken by the camera.",
"In one embodiment, a system configured to combine video see-through (VST) with video-unrelated-to-the-VST (VUR) includes at least the following components: a head-mounted display (HMD), such as HMD 15, a camera (e.g., camera 12), an HMD tracking module 27, and a computer 13.FIG.",
"1 provides a schematic illustration of at least some of the relationships between the components mentioned above.",
"The HMD 15 is configured to be worn by an occupant of a compartment of a moving vehicle and to present an HMD-video 16 to the occupant.",
"In one embodiment, the HMD 15 is an augmented-reality (AR) HMD.",
"In another embodiment, the HMD 15 is a virtual reality (VR) HMD.",
"Optionally, in this embodiment, the system further comprises a video camera mounted to the VR HMD, and the VST video comprises video of the compartment received from the video camera mounted to the VR HMD.",
"In yet another embodiment, the HMD 15 is a mixed reality HMD.",
"The term “Mixed Reality” (MR) as used herein involves a system that is able to combine real world data with virtual data.",
"Mixed Reality encompasses Augmented Reality and encompasses Virtual Reality that does not immerse its user 100% of the time in the virtual world.",
"Examples of mixed reality HMDs include, but are not limited to, Microsoft HoloLens HMD and MagicLeap HMD.",
"The camera 12, which is mounted to the vehicle, is configured to take video of the outside environment (Vout).",
"Optionally, the data captured by the camera comprises 3D data.",
"For example, the camera may be based on at least one of the following sensors: a CCD sensor, a CMOS sensor, a near infrared (NIR) sensor, an infrared sensor (IR), and a device based on active illumination such as a LiDAR.",
"The HMD tracking module 27 is configured to calculate position of the HMD 15 relative to the compartment, based on measurements of a sensor.",
"In different embodiments, the HMD tracking module 27 may have different configurations.",
"In one embodiment, the sensor comprises first and second Inertial Measurement Units (IMUs).",
"In this embodiment, the first IMU is physically coupled to the HMD 15 and is configured to measure a position of the HMD 15, and the second IMU is physically coupled to the compartment and is configured to measure a position of the compartment.",
"The HMD tracking module 27 is configured to calculate the position of the HMD 15 in relation to the compartment based on the measurements of the first and second IMUs.",
"In another embodiment, the sensor comprises an Inertial Measurement Unit (IMU) and a location measurement system.",
"In this embodiment, the IMU is physically coupled to the HMD 15 and is configured to measure an orientation of the HMD 15.The location measurement system is physically coupled to the compartment and is configured to measure a location of the HMD in relation to the compartment.",
"The HMD tracking module 27 is configured to calculate the position of the HMD 15 in relation to the compartment based on the measurements of the IMU and the location measurement system.",
"Optionally, the location measurement system measures the location of the HMD 15 in relation to the compartment based on at least one of the following inputs: a video received from a camera that captures the HMD 15, a video received from a stereo vision system, measurements of magnetic fields inside the compartment, wireless triangulation measurements, acoustic positioning measurements, and measurements of an indoor positioning systems.",
"FIG.",
"2 illustrates one embodiment in which the HMD tracking module 27 is physically coupled to the compartment and is configured to measure the position of the HMD relative to the compartment.",
"The HMD tracking module 27 may utilize a passive camera system, an active camera system that captures reflections of a projected grid, and/or a real-time locating systems based on microwaves and/or radio waves.",
"The computer 13 is configured to receive a location of a video see-through window (VSTW) in relation to the compartment, and to calculate, based on the position of the HMD relative to the compartment, a window-location for the VSTW on the HMD-video.",
"The computer 13 is also configured to generate, based on the window-location and the Vout, the VST that represents a view of the outside environment from the point of view of the occupant.",
"Optionally, the VST is rendered as a 3D video content.",
"Additionally, the computer 13 is further configured to generate the HMD-video 16 based on combining the VUR with the VST in the window-location.",
"The computer 13 may use various know in the art computer graphics functions and/or libraries to generate the VST, transform the VST to the occupant's point of view, render the 3D video content, and/or combine the VUR with the VST.",
"In one embodiment, the content of the VUR does not change when the occupant moves the head, and the content of the VUR is unrelated to the video taken by the camera.",
"Additionally, the content of the VUR is generated based on data that was received more than 2 seconds before the HMD-video 16 is displayed to the occupant.",
"Some examples of the VUR include a video stream of at least one of the following types of content: a recorded television show, a computer game, an e-mail, and a virtual computer desktop.",
"FIG.",
"3 illustrates one embodiment in which the occupant 14 wears an HMD 15.The HMD 15 provides video to the occupant 14 through the display of the HMD 15.The vehicle includes a camera 12 that takes video of the outside environment 11a and processes it in a manner suitable for the location of the occupant.",
"The processed video is provided to the occupant's display in the HMD 15 as a VSTW and the position of the VSTW is calculated in relation to the compartment of the vehicle and moves with the compartment.",
"While the vehicle is in motion, the VSTW change its content to represent the outside environment 11a of the vehicle.",
"Whereas the video-unrelated-to-the-VST doesn't change when the occupant moves his head.",
"The computer is configured to receive a location of a VSTW in relation to the compartment, and to calculate, based on the position of the occupant's head, a window-location for the VSTW on the video.",
"FIG.",
"4 illustrates one embodiment in which the occupant 44 wears HMD 45 and views large VUR 40 and smaller VST 41a.",
"The VUR 40 does not change when the occupant's head 44 moves.",
"The VSTW presents video of the street based on video taken by the camera that is mounted to the vehicle.",
"The location of the video-see-through window in relation to the compartment does not change when the occupant 44 moves his/her head in order to imitate a physical window that does not change its position relative to the compartment when the occupant's head moves.",
"FIG.",
"5a illustrates how, in one embodiment, the VST moves to the upper left when the occupant 44 looks to the bottom right.",
"FIG.",
"5b illustrates how the VST moves to the bottom right when the occupant 44 looks to the upper left, while the VUR moves with the head.",
"In both cases, the VUR moves with the head while the location of the VST changes according to the movement of the head relative to the compartment as measured by the HMD tracking module 27.In some embodiments, the content of the VUR may be augmented-reality content, mixed-reality content, and/or virtual-reality content rendered to correspond to the occupant's viewing direction.",
"In this embodiment, the VUR is unrelated to the video taken by the camera.",
"In one example, the VUR may include a video description of a virtual world in which the occupant may be playing a game (e.g., represented by an avatar).",
"Optionally, in this example, most of the features of the virtual world are different from the view of the outside of the vehicle (as seen from the occupant's viewing direction).",
"For example, the occupant may be driving in a city, while the virtual world displays woods, a meadow, or outer space.",
"In another example, the VUR may include augmented reality content overlaid above a view of the inside of the compartment.",
"In addition to the components described above, in some embodiments, the system may include a second camera that is mounted to the HMD and is configured to take video of the compartment (Vcomp).",
"In this embodiment, the computer is further configured to generate a compartment-video (CV), based on Vcomp and a location of a compartment-video window (CVW) in relation to the HMD-video (e.g., HMD-video 16), and to generate the HMD-video also based on the CV in the CVW, such that the HMD-video combines the VUR with the VST in the window-location and with the CV in the CVW.",
"There are various ways in which the CVW may be incorporated into the HMD-video.",
"Some examples of these approaches are illustrated in the following figures.",
"FIG.",
"6 illustrates HMD-video that includes both a non-transparent VST 55 in the window-location and a CV 56 that shows the hands of the occupant and the interior of the compartment in the CVW.",
"FIG.",
"7 illustrates HMD-video that includes both a partially transparent VST 57 in the window-location and the CV 56 that shows the hands of the occupant and the interior of the compartment in the CVW.",
"FIG.",
"8 illustrates HMD-video that includes a VST 58 and partially transparent CV 59.The figure illustrates that the occupant sees the outside environment in full field-of-view (FOV), while on top of it there is a partially transparent image (illustrated as dotted image) of the compartment and the hands of the occupant, in order to help the occupant not to hit things in the compartment.",
"FIG.",
"9a illustrates HMD-video that includes a VUR 70 in full FOV, a first window comprising the CV 71 in the CVW and a second smaller window comprising the VST 72 in the window-location.",
"FIG.",
"9b illustrates HMD-video that includes VUR 70 in full FOV, a first window comprising the CV 71 in the CVW and a second partially transparent smaller window comprising the VST 73 in the window-location.",
"FIG.",
"10a illustrates HMD-video that includes VUR 70 in full FOV, a first window comprising VST 75 in the window-location and a second smaller window comprising zoom out of the CV 76 in the CVW.",
"Optionally, the cabin view in the zoom out is smaller than in reality, and may enable the occupant to orient in the cabin.",
"Optionally, the occupant may move the CVW, as illustrated in FIG.",
"10a where the zoom out of the CV in the CVW is somewhat above its location in reality.",
"FIG.",
"10b illustrates HMD-video that includes VUR 70 and a partially transparent CV 72.Here a first occupant sees the VUR in full field-of-view (FOV), and on top of it there is a partially transparent image of the compartment and a second occupant that sits to the left of the first occupant, which may help the first occupant not to hit the second occupant.",
"There may be various ways in which the system determines the location and/or size of the VSTW.",
"In one embodiment, the VSTW is pinned to at least one of the following locations: a specific physical location and a location of an object in the compartment, such that the location of the VSTW in relation to the compartment does not change when the occupant moves his/her head with the HMD 15 as part of watching the HMD-video 16 and without commanding the VSTW to move in relation to the compartment.",
"In another embodiment, the system includes a user interface configured to receive a command from the occupant to move and/or resize the VSTW in relation to the compartment.",
"In one example, the command is issued through a voice command (e.g., saying “move VST to the bottom”).",
"In another example, the command may be issued by making a gesture, which is detected by a gesture control module in the compartment and/or on a device of the occupant (e.g., as part of the HMD).",
"Optionally, in this embodiment, the computer is further configured to: update the window-location based on the command from the occupant, and generate an updated VST based on the updated window-location and the video taken by the camera.",
"In this embodiment, the VST and the updated VST present different VSTW locations and/or dimensions in relation to the compartment.",
"Optionally, the HMD is configured not to present any part of the VST to the occupant when the window-location is not in the field of view presented to the occupant through the HMD.",
"In yet another embodiment, the system may further include a video analyzer configured to identify an Object Of Interest (OOI) in the outside environment.",
"For example, the OOI of interest may be a certain landmark (e.g., a building), a certain object (e.g., a store or a certain model of automobile), or a person.",
"In this embodiment, the computer is further configured to receive, from the video analyzer, an indication of the position of the OOI, and to track the OOI by adjusting the window-location according to the movements of the vehicle, such that the OOI is visible via the VST.",
"Optionally, the HMD is configured not to present any part of the VST to the occupant when the window-location is not in the field of view presented to the occupant through the HMD.",
"The VST that represents the view of the outside environment from the point of view of the occupant, in some embodiments, does not necessarily match the video taken by the cameras.",
"In one embodiment, the VST may utilize image enhancement techniques to compensate for outside lighting conditions, to give an occupant an experience similar to looking out through a conventional vehicle window but without the view being distorted by raindrops or dirt on the window, and/or to improve the visual impression of the outside environment e.g.",
"by showing background images which are different from those retrievable from the outside environment.",
"Additionally or alternatively, the VST may mimic the outside environment, alter the outside environment, and/or be completely different from what can be seen on the outside environment.",
"The VST may be focused on providing visual information that makes the travelling more fun.",
"The vehicle may provide different styles of the outside environment to different occupants in the vehicle, such that a first VST provided to a first occupant may mimic the outside environment, while a second VST provided to a second occupant may alter the outside environment and/or be completely different from the outside environment, optionally for comfort enhancement and/or entertainment.",
"In some embodiments, the VST is informative, and aids at least some of the occupants to determine the location of the vehicle in the environment.",
"In one embodiment, at least some of those occupants could not determine their location without the VST.",
"In one example, less than 20% of average vehicle occupants, who are familiar with the outside environment, are able to determine their real location in the outside environment by watching the VUR, without using a map, with a margin of error that is less than 100 meters, and while the vehicle travels; while more than 20% of the average vehicle occupants, who are familiar with the outside environment, are able to determine their real location in the outside environment by watching the VST, without using a map, and with a margin of error that is less than 100 meters, and while the vehicle travels.",
"FIG.",
"11a illustrates a FOV in the context of presented video and terminology used herein.",
"The vehicle occupant 200 wears an HMD 201 that presents HMD-video (such as HMD-video 16).",
"The HMD-video may be presented at a single focal plane, or at multiple focal planes, depending on the characteristics of the HMD 201 (when the occupant focuses on a certain focal plane, then his/her point of gaze is said to be on the certain focal plane).",
"In addition, the presented objects may be two-dimensional (2D) virtual objects and/or three-dimensional (3D) virtual objects that may also be referred to as holographic objects.",
"Element 204 represents the location of a nontransparent element fixed to the vehicle compartment.",
"In one example, the HMD 201 is a holographic HMD, such as Microsoft HoloLens, which can present content displayed on a series of focal planes that are separated by some distance.",
"The virtual objects may be presented before the nontransparent element (e.g., polygons 202, 203), essentially on the nontransparent element 204, and/or beyond the nontransparent element (e.g., polygons 205, 206).",
"As a result, the occupant's gaze distance may be shorter than the distance to the nontransparent element (e.g., distance to polygons 202, 203), essentially equal to the distance to the nontransparent element 204, and/or longer than the distance to the nontransparent element (e.g., distance to polygons 205, 206).",
"Polygon 207 represents a portion of the presented video at eye level of the vehicle occupant, which in one example is within ±7 degrees from the horizontal line of sight.",
"Although the figure illustrates overlapping FOVs of polygons 202, 203, 204, and 205, the HMD may show different objects, capturing different FOVs, at different focal planes.",
"In one example, the HMD may project an image throughout a portion of, or all of, a display volume.",
"Further, a single object such as a vehicle could occupy multiple volumes of space.",
"According to the terminology used herein, the nontransparent element 204 is said to be located on FOV overlapping the FOV of polygons 205 and 203 because polygons 203, 204, 205 share the same FOV.",
"FOV of polygon 206 is contained in the FOV of polygon 204, and FOV of polygon 207 intersects the FOV of polygon 204.FOV of polygon 203 is before the nontransparent element 204 and therefore may hide the nontransparent element 204 partially or entirely, especially when utilizing a multi-focal plane HMD.",
"FIG.",
"11b illustrates a FOV in the context of the presented video, where the vehicle occupant 210 does not wear an HMD that presents the video, such as when watching an autostereoscopic display.",
"The autostereoscopic display is physically located on plane 214 and the presented video may be presented at a single focal plane, or at multiple focal planes, depending on the characteristics of the autostereoscopic display.",
"In one example, the autostereoscopic display is a holographic display, such as SeeReal Technologies holographic display, where the presented video may present virtual objects before the focal plane of the autostereoscopic display (e.g., planes 212, 213), essentially on the focal plane of the autostereoscopic display 214, and/or beyond the focal plane of the autostereoscopic display (e.g., planes 215, 216).",
"As a result, the occupant's gaze distance may be shorter than the distance to the autostereoscopic display (e.g., planes 212, 213), essentially equal to the distance to the autostereoscopic display 214, and/or longer than the distance to the autostereoscopic display (e.g., planes 215, 216).",
"The term “autostereoscopic” includes technologies such as automultiscopic, glasses-free 3D, glassesless 3D, parallax barrier, integral photography, lenticular arrays, Compressive Light Field Displays, holographic display based on eye tracking, color filter pattern autostereoscopic display, volumetric display that reconstructs light field, integral imaging that uses a fly's-eye lens array, and/or High-Rank 3D (HR3D).",
"FIG.",
"11c illustrates FOV of a 3D camera that is able to capture sharp images from different focal lengths.",
"In some embodiments, the vehicle and/or the HMD utilize at least one Inertial Measurement Unit (IMU), and the system utilizes an Inertial Navigation System (INS) to compensate imperfections in the IMU measurements.",
"An INS typically has one or more secondary navigation sensors that provide direct measurements of the linear velocity, position and/or orientation of the vehicle.",
"These secondary navigation sensors could be anything from stereo vision systems, to GPS receivers, to digital magnetic compasses (DMCs) or any other type of sensor that could be used to measure linear velocity, position and/or orientation.",
"In one example, the information from these secondary navigation sensors is incorporated into the INS using an Extended Kalman Filter (EKF).",
"The EKF produces corrections that are used to adjust the initial estimations of linear velocity, position and orientation that are calculated from the imperfect IMU measurements.",
"Adding secondary navigation sensors into an INS can increase its ability to produce accurate estimations of the linear velocity, position and orientation of the vehicle over long periods of time.",
"In one embodiment, the system utilizes domain specific assumptions in order to reduce drift of an INS used to calculate the HMD spatial position in relation to the compartment.",
"More specifically, the following methods may be used to reduce or correct drift.",
"Such methods generally fall in the categories of using sensor fusion and/or domain specific assumptions.",
"(i) Sensor fusion refers to processes in which signals from two or more types of sensors are used to update and/or maintain the state of a system.",
"In the case of INS, the state generally includes the orientation, velocity and displacement of the device measured in a global frame of reference.",
"A sensor fusion algorithm may maintain this state using IMU accelerometer and gyroscope signals together with signals from additional sensors or sensor systems.",
"There are many techniques to perform sensor fusion, such as Kalman filter and particle filter.",
"One example of periodically correcting drift is to use position data from a triangulation positioning system relative to the compartment.",
"Such systems try to combine the drift free nature of positions obtained from the triangulation positioning system with the high sampling frequency of the accelerometers and gyroscopes of the IMU.",
"Roughly speaking, the accelerometer and gyroscope signals are used to ‘fill in the gaps’ between successive updates from the triangulation positioning system.",
"Another example of reducing the drift is using a vector magnetometer that measures magnetic field strength in a given direction.",
"The IMU may contain three orthogonal magnetometers in addition to the orthogonal gyroscopes and accelerometers.",
"The magnetometers measure the strength and direction of the local magnetic field, allowing the north direction to be found.",
"(ii) In some embodiments, it is possible to make domain specific assumptions about the movements of the occupant and/or the vehicle.",
"Such assumptions can be used to minimize drift.",
"One example in which domain specific assumptions may be exploited is the assumption that when the vehicle accelerates or decelerates significantly, the HMD accelerates or decelerates essentially the same as the vehicle, allowing HMD drift in velocity to be periodically corrected based on a more accurate velocity received from the autonomous-driving control system of the vehicle.",
"Another example in which domain specific assumptions may be exploited is the assumption that when the vehicle accelerates or decelerates significantly, the HMDs of two occupants travelling in the same vehicle accelerate or decelerate essentially the same, allowing HMD drifts to be periodically corrected based on comparing the readings of the two HMDs.",
"Still another example in which domain specific assumptions are exploited is the assumption that the possible movement of an HMD of a belted occupant is most of the time limited to a portion of the compartment, allowing HMD drifts to be periodically corrected based on identifying when the HMD exceeds beyond that portion of the compartment.",
"In one example, it may be desirable to adjust the position of displaying a virtual object in response to relative motion between the vehicle and the HMD so that the virtual object would appear stationary in location.",
"However, the HMD IMU may indicate that the HMD is moving even when the detected motion is a motion of the vehicle carrying the HMD.",
"In order to distinguish between motion of the HMD caused by the vehicle and motion of the HMD relative to the vehicle, non-HMD sensor data may be obtained by the HMD from sensor such as an IMU located in the vehicle and/or the GPS system of the vehicle, and the motion of the vehicle may be subtracted from the motion of the HMD in order to obtain a representation of the motion of the HMD relative to the vehicle.",
"By differentiating movements of the HMD caused by the occupant motion compared to movements caused by the vehicle motion, the rendering of the virtual object may be adjusted for the relative motion between the HMD and the vehicle.",
"Using the nontransparent element, instead of a transparent glass window that provides the same FOV to the outside environment, may provide various benefits, such as: (i) reduced manufacturing cost of the vehicle compared to a similar vehicle having instead of the nontransparent element a transparent glass window that provides the same FOV to the outside environment as provided by the 3D display device, (ii) reduced weight of the vehicle compared to a similar vehicle having instead of the nontransparent element a transparent glass window that provides the same FOV to the outside environment as provided by the 3D display device, and provides the same safety level, (iii) better aerodynamic shape and lower drag for the vehicle, which results in an improved energy consumption, and (iv) improved privacy for the occupant as a result of not enabling an unauthorized person standing nearby the vehicle to see the occupant directly.",
"The term “real-depth VST window (VSTW)” is defined herein as an imaging display that shows a 3D image of an outside environment located beyond a wall that interrupts the occupant's unaided view of the outside environment.",
"The real-depth VSTW has the following characteristics: (i) the 3D image corresponds to a FOV to the outside environment beyond the wall, as would have essentially been seen by the occupant had the wall been removed; (ii) the outside environment is captured by a camera, and the rendering of the 3D image is based on images taken by the camera; and (iii) while looking via the imaging display, the occupant's point of gaze (where one is looking) is most of the time beyond the wall that interrupts the occupant's unaided view of the outside environment.",
"A possible test to determine whether “(i) the 3D image corresponds to a FOV to the outside environment beyond the wall, as would have essentially been seen by the occupant had the wall been removed” is whether an imaginary user standing beyond the wall, watching both the real-depth VSTW and the outside environment, would recognize that at least 20% of the contours of objects in the 3D image correspond to the contours of the objects seen on the outside environment.",
"Differences between the colors of the corresponding objects in the 3D image and the outside environment usually do not affect the criterion of the 20% corresponding contours, as long as the color difference does not affect the perception of the type of object.",
"For example, different skin colors to corresponding people in the 3D image and the outside environment do not violate the criterion of the 20% corresponding contours.",
"As another example, differences in the weight and/or height of corresponding objects in the 3D image and the outside environment do not violate the criterion of the 20% corresponding contours as long as the imaginary user understands that the objects correspond to the same person.",
"Sentences such as “from the FOV of the occupant” are to be interpreted as no more than 20 degrees angular deviation from the field of view of the occupant to the outside environment.",
"Zoom in/out does not affect the FOV as long as the average occupant would still recognize the rendered environment as the 3D VST.",
"For example, zoom in of up to ×4, which maintains no more than 20 degrees angular deviation from the FOV of the occupant to the outside environment, is still considered “from the FOV of the occupant”.",
"Reasonable lateral deviation essentially does not affect the FOV as long as the average occupant would still recognize the rendered environment as the 3D VST.",
"For example, displaying to the occupant the outside environment from the FOV of a camera located on the roof of the occupant's vehicle, is still considered as showing the outside environment from the occupant's FOV.",
"A possible test to determine whether “(ii) the outside environment is measured by a camera, and the images taken by the camera are used to render the 3D image” is whether the real-depth VSTW would display a different 3D VST when it does not receive the images taken by the camera.",
"For example, assuming the camera is a 3D video camera, and the 3D image is a manipulation of the images taken by the 3D video camera; then, when the real-depth VSTW does not receive the images, it cannot show the changes that are taking place in the outside environment.",
"As another example, assuming the 3D image is mainly rendered from cached data stored in a database, and the camera is used to provide the setup of objects that behave in an unknown way, such as trajectories of nearby vehicles on the road, or a gesture of a person walking beyond the wall; then, when the output of the camera is used to render the 3D image, the real-depth VSTW would represent the unknown trajectory of the nearby vehicles or the unknown gesture of the person, while when the output of the camera is not used to render the 3D image, the real-depth VSTW would not represent the unknown trajectory of the nearby vehicles or the unknown gesture of the person merely because the renderer does not have that data.",
"A possible test to determine whether “(iii) the occupant's point of gaze (where one is looking) is most of the time beyond the wall that interrupts the occupant's unaided view of the outside environment” includes the following steps: (a) use eye tracker to determine the point of gaze on a representative scenario, (b) measure the distance to the wall, and (c) determine whether the average gaze distance is longer than the distance to the wall.",
"Some aspects of this disclosure involve a system that utilizes window shading of a vehicle window in order to improve the quality of video viewed by an occupant of the vehicle who wears a head-mounted display (HMD).",
"In one embodiment, an autonomous on-road vehicle includes a system configured to enable an HMD to cooperate with a window light shading module.",
"This embodiment involves a light shading module, a camera, a processor, and the HMD.",
"The light shading module is integrated with a vehicle window and is configured to be in at least one of first and second states.",
"In the first state the Visible Light Transmittance (VLT) of the vehicle window is above 10% of ambient light entering through the window, in the second state the VLT of the vehicle window is below 50% of ambient light entering through the window, and the VLT of the vehicle window in the first state is higher than the VLT of the vehicle window in the second state.",
"The camera is fixed to the vehicle and configured to take video of the outside environment.",
"The processor is configured to generate, based on the video, a video see-through (VST) that represents the outside environment from a point of view of an occupant looking to the outside environment through at least a portion of the vehicle window.",
"The HMD comprises an optical see-through component and a display component; the HMD is configured to operate according to a first mode of operation when the occupant looks at the direction of the vehicle window and the light shading module is in the first state, and to operate according to a second mode of operation when the occupant looks at the direction of the vehicle window and the light shading module is in the second state.",
"Wherein the total intensity of the VST light, emitted by the display component and reaching the occupant's eyes, is higher in the second mode than in the first mode.",
"In one embodiment, a system configured to enable a head-mounted display (HMD) to cooperate with a window light shading module of an autonomous on-road vehicle includes at least the following elements: the HMD 62, a light shading module 61, a camera (such as camera 12), and a processor 18.FIG.",
"12 is a schematic illustration of at least some of the relationships between the system elements mentioned above.",
"The light shading module 61 is integrated with a vehicle window and is configured to be in at least one of first and second states.",
"Optionally, the light shading module 61 covers more than half of the front windshield in the second state.",
"In one embodiment, in the first state, the Visible Light Transmittance (VLT) of the vehicle window is above 10% of ambient light entering through the window, and in the second state, the VLT of the vehicle window is below 50% of ambient light entering through the window.",
"Additionally, the VLT of the vehicle window in the first state is higher than the VLT of the vehicle window in the second state.",
"In another embodiment, in the first state the VLT of the vehicle window is above 70% of ambient light entering through the window, and in the second state, the VLT of the vehicle window is below 30% of ambient light entering through the window.",
"Herein, “ambient light” in the context of a vehicle refers to visible light that is not controlled by the vehicle, such as light arriving from: the sun, lights of other vehicles, street/road lighting, and various reflections from elements such as windows.",
"In some embodiments, utilizing the light shading module 61 may improve the quality of images viewed via the HMD 62 when the light shading module 61 is in the second state.",
"Optionally, the perceived contrast of the optical see-through component is better when the light shading module is in the second state compared to when the light shading module 61 is in the first state.",
"Various types of light shading modules may be utilized in embodiments described herein.",
"In one embodiment, the light shading module 61 is a movable physical element configured to reduce the intensity of the ambient light entering into the vehicle compartment through the vehicle window.",
"Optionally, the light shading module is unfurled on the inside of the compartment in order to block at least 50% of the ambient light intensity.",
"Optionally, the light shading module is unfurled on the outside of the compartment in order to block at least 50% of the ambient light intensity.",
"FIG.",
"13a illustrates a first mode where the occupant sees the outside environment through the optical see-through component.",
"This figure illustrates the view that the occupant sees when looking outside through the window.",
"FIG.",
"13b illustrates a second mode where the occupant sees the outside environment through the VST.",
"In this example, the outside environment is a bit different, and there is also a virtual Superman floating near the tree.",
"In another embodiment, the light shading module 61 may be a curtain.",
"FIG.",
"14 illustrates a VST over a curtain.",
"FIG.",
"15 illustrates a light shading module that is unfurled on the inside of the compartment.",
"FIG.",
"16 illustrates a light shading module that is unfurled on the outside of the compartment.",
"And in yet another embodiment, the vehicle window is made of a material that is able to serve as the light shading module 61 by changing its transparency properties.",
"The camera is fixed to the vehicle, and configured to take video of the outside environment.",
"For example, the camera may be based on at least one of the following sensors: a CCD sensor, a CMOS sensor, a near infrared (NIR) sensor, an infrared sensor (IR), and a device based on active illumination such as a LiDAR.",
"The processor is configured to generate, based on the video, a video see-through (VST 19) that represents the outside environment from a point of view of an occupant looking to the outside environment through at least a portion of the vehicle window.",
"Optionally, the processor is further configured not to generate the VST 19 when the HMD 62 operates in the first mode.",
"The HMD 62 comprises an optical see-through component and a display component.",
"Optionally, the HMD 62 is configured to operate according to a first mode of operation when the occupant looks at the direction of the vehicle window and the light shading module 61 is in the first state, and to operate according to a second mode of operation when the occupant looks at the direction of the vehicle window and the light shading module 61 is in the second state.",
"The total intensity of the VST light, emitted by the display component and reaching the occupant's eyes, is higher in the second mode than in the first mode.",
"In one embodiment, in the first mode, intensity of light that reaches the occupant's eyes via the optical see-through component is higher than intensity of light from the VST that is emitted by the display component and reaches the occupant's eyes.",
"And in the second mode, the intensity of light from the environment that reaches the occupant's eyes via the optical see-through component is lower than the intensity of light from the VST that is emitted by the display component and reaches the occupant's eyes.",
"In one example, the total intensity of VST light, emitted by the display component and reaching the occupant's eyes, is at least 50% higher in the second mode than in the first mode.",
"In some embodiments, the display component may be based on a digital display that produces the virtual image (such as in Oculus rift), direct retina illumination (such as in Magic Leap), or other methods that are capable of producing the virtual image.",
"In one embodiment, the system described above optionally includes an occupant tracking module configured to calculate the point of view of the occupant based on measurements of a sensor.",
"Optionally, the occupant tracking module is the HMD tracking module 27.Optionally, in this embodiment, the processor is further configured to render the VST based on data received from the occupant tracking module.",
"Optionally, the display is a three dimensional (3D) display configured to show the occupant the VST, such that point of gaze of the occupant, while looking via the 3D display device, is most of the time beyond the location of the light shading module 61.In some embodiments, an occupant of a vehicle may have the opportunity to view video see-through (VST), which is video generated based on video of the environment outside the vehicle.",
"VST can often replace the need to look out of a window (if the vehicle has windows).",
"Some examples of scenarios in which VST may be available in a vehicle include a windowless vehicle, a vehicle with shaded windows having VLT below 30%, and/or when the occupant wears a VR headset.",
"While traveling in such a vehicle, the occupant may benefit from gaining a view to the outside environment when an unexpected driving event occurs.",
"By being made aware of the event, the occupant is less likely to be surprised, disturbed, and/or distressed by the event.",
"While traveling in a vehicle, an occupant of the vehicle may not always be aware of the environment outside and/or of what actions the vehicle is about to take (e.g., breaking, turning, or hitting a speedbump).",
"Thus, if such an event occurs without the occupant being aware that it is about to happen, this may cause the occupant to be surprised, disturbed, distressed, and even physically thrown off balance (in a case where the event involves a significant change in the balance of the physical forces on the occupant).",
"This type of event is typically referred to herein as a Sudden Decrease in Ride Smoothness (SDRS) event.",
"Some examples of SDRS events include at least one of the following events: hitting a speed bump, driving over a pothole, climbing on the curb, making a sharp turn, a hard breaking, an unusual acceleration (e.g., 0-100 km/h in less than 6 seconds), and starting to drive after a full stop.",
"In some embodiments, an SDRS event takes place at least 2 minutes after starting to travel and it is not directly related to the act of the starting to travel.",
"Additionally, the SDRS event takes place at least 2 minutes before arriving to the destination and is not directly related to the act of arriving at the destination.",
"In one example, a sentence such as “an SDRS event is imminent” refers to an SDRS event that is: (i) related to traveling in the vehicle, and (ii) expected to happen in less than 30 seconds, less than 20 seconds, less than 10 seconds, or less than 5 seconds.",
"In another example, a sentence such as “an SDRS event is imminent” may refer to an event that starts at that instant, or is about to start within less than one second.",
"The following is a description of an embodiment of a video system that may be used to increase awareness of an occupant of a vehicle regarding an imminent SDRS.",
"In one embodiment, a video system for an autonomous on-road vehicle includes at least autonomous-driving control system 65, a camera (such as camera 12), a processor (such as processor 18), and video module 66.FIG.",
"17 is a schematic illustration of at least some of the relationships between the system elements mentioned above.",
"The autonomous-driving control system 65 is configured to generate, based on trajectory of the vehicle and information about the road, an indication indicative of whether a Sudden Decrease in Ride Smoothness (SDRS) event is imminent.",
"Optionally, the autonomous-driving control system 65 receives at least some of the information about the road from at least one of the following sources: sensors mounted to the vehicle, sensors mounted to nearby vehicles, an autonomous-driving control system 65 used to drive a nearby vehicle, and a database comprising descriptions of obstacles in the road that are expected to cause intense movement of the vehicle.",
"In one example, the database comprising the descriptions of the obstacles includes one or more of the following types of data: locations of speed bumps, locations of potholes, locations of stop signs, and locations of sharp turns in the road.",
"In one embodiment, the autonomous-driving control system 65 is configured to generate the indication indicative of whether an SDRS event is imminent based on at least one of the following configurations: (i) the autonomous-driving control system 65 receives images of the road from a camera, and calculates the indication based on the vehicle trajectory and image analysis of the images, (ii) the autonomous-driving control system 65 receives from a radar reflections of electromagnetic waves from the road, and calculates the indication based on the vehicle trajectory and signal processing of the reflections, and (iii) the autonomous-driving control system 65 receives a notification from a detailed road map, and calculates the indication based on the vehicle trajectory and the notification.",
"The camera, which is mounted to the vehicle, is configured to take video of the environment outside the vehicle.",
"Optionally, the data captured by the camera comprises 3D data.",
"The processor is configured to generate a video see-through (VST) based on the video taken by the camera.",
"The video module 66 is configured to select a first mode of presentation, in which a video-unrelated-to-the-VST (VUR) is presented on the foveal vision region of the occupant, at eye level, responsive to the indication not indicating that an SDRS event is imminent.",
"The video module 66 is further configured to select a second mode of presentation, in which the VST is presented on the foveal vision region of the occupant, at eye level, responsive to the indication indicating that an SDRS event is imminent.",
"Optionally, the VST captures more than 50% of the foveal vision region of the occupant in the second mode of presentation.",
"In some embodiments, presenting video on the foveal vision region comprises presenting images with at least 50% transparency.",
"Herein, “foveal vision” refers to an angle of about 5° of the sharpest field of vision.",
"In one embodiment, in the first mode of presentation, the VUR is presented on the foveal vision region of the occupant with opacity A, and the VST is presented on the foveal vision region of the occupant with opacity B, where A>B>0.Optionally, a normalized opacity parameter takes a value from 0.0 to 1.0, and the lower the value the more transparent the video is.",
"In this embodiment, in the second mode of presentation, the VUR is presented on the foveal vision region of the occupant with opacity A′, and the VST is presented on the foveal vision region of the occupant with opacity B′, where B′>B and B′>A′.",
"In optional embodiments, one or more of the following values may be true: A′>0, B=0, and A′=0.Herein, “partially transparent” refers to opacity below one and above zero.",
"Having the VST presented when an SDRS event is imminent can make the occupant be aware and prepared for the SDRS event.",
"Thus, the occupant is less likely to be startled, distressed, and/or physically thrown off balance by the SDRS event.",
"In one example, the SDRS event involves hitting a speedbump, while the occupant views a movie.",
"About 5 seconds prior to hitting the speedbump, a partially transparent window displaying VST in which the speedbump is highlighted (e.g., flashing red) is presented on the foveal vision region of the occupant for a couple seconds (e.g., by being presented in the center of the movie).",
"This way upon hitting the speedbump, the occupant is not startled by the event.",
"In another example, the autonomous-driving control system 65 determines that a “hard breaking” is required, e.g., in order to avoid collision with a vehicle ahead that slowed unexpectedly.",
"In this example, the occupant may be working on a virtual desktop, and within 100 milliseconds of when the determination is made that the vehicle is about to rapidly deaccelerate (a “hard breaking”), the VST depicting the rear of the vehicle ahead is displayed in the center of the virtual desktop.",
"This way the occupant is immediately made aware of why the vehicle is breaking and this notification may prompt the occupant to seek a more appropriate posture for the breaking.",
"Some illustrations of utilization of the different modes of operation are given in the following figures.",
"FIG.",
"18a illustrates presenting VUR responsive to not receiving from the autonomous-driving control system 65 an indication that an SDRS event is imminent.",
"This figure has two parts, the left part shows the vehicle driving over a clean road, and the right part shows the VUR.",
"FIG.",
"18b illustrates presenting VST responsive to receiving from the autonomous-driving control system 65 an indication that an SDRS event is imminent.",
"The figure has two parts, the left part shows the vehicle about to drive over a pothole, and the right part shows a small window showing the pothole over the VUR (optionally to warn the occupant).",
"FIG.",
"18c illustrates presenting VST responsive to receiving from the autonomous-driving control system 65 an indication that an SDRS event is imminent.",
"The figure has two parts, the left part shows the vehicle about to enter a sharp turn, and on the right part shows a small window showing the sharp turn over the VUR (optionally to warn the occupant).",
"Traditional vehicles typically have a front windshield that offers occupants of the vehicle a frontal view of the outside environment.",
"However, in some embodiments, this frontal view may be provided using the VST.",
"For example, in one embodiment, the vehicle includes a nontransparent element, which is coupled to the vehicle, and obstructs at least 30 degrees out of the frontal horizontal unaided FOV to the outside environment of an occupant at eye level.",
"In one example of a standard vehicle, such as Toyota Camry model 2015, the frontal horizontal unaided FOV extends from the left door through the windshield to the right door.",
"The use of the nontransparent element improves the safety of the occupant during a collision compared to a similar vehicle having the same total weight and comprising a transparent glass window instead of the nontransparent element.",
"The nontransparent element may be coupled to the vehicle in various configurations, in embodiments described herein.",
"In one embodiment, the nontransparent element is fixed to the vehicle at an angle, relative to the occupant, that is covered by the field of view of the VST, and the nontransparent element features visible light transmittance (VLT) below 10% of ambient light.",
"Various types of displays may be utilized to present the occupant with video (e.g., the VST and/or the VUR).",
"In one embodiment, the video is presented to the occupant on a screen coupled to the vehicle compartment.",
"In one example, the screen coupled to the vehicle compartment utilizes parallax barrier technology.",
"A parallax barrier is a device located in front of an image source, such as a liquid crystal display, to allow it to show a stereoscopic image or multiscopic image without the need for the viewer to wear 3D glasses.",
"The parallax barrier includes a layer of material with a series of precision slits, allowing each eye to see a different set of pixels, thus creating a sense of depth through parallax.",
"In another embodiment, the occupant wears a head-mounted display (HMD), and the HMD is used to present the video to the occupant.",
"Optionally, the HMD is a VR headset, and as a result of presenting the VST, the occupant does not need to remove the VR headset in order to see the cause of the SDRS event.",
"In some embodiments, the video module 66 may be selective regarding indications of which SRDS events may prompt it to operate in the second mode of operation.",
"For example, if the occupant is engaged in a game, the video module 66 may refrain from presenting the VST in the foveal vision region if the vehicle is about to make a sharp turn.",
"However, it may optionally still present the VST in the foveal vision region if the SDRS event involves something that may be more forcefully felt by the occupant, such as extreme evasive maneuvering performed to avoid a collision.",
"In some embodiments, the video module 66 may determine whether to show a VST responsive to an SRDS event (in the second mode of operation) based on the level of concentration of the occupant.",
"For example, if the occupant is deeply engaged in a certain activity (e.g., in work or playing a game) above a threshold, the video module 66 may refrain from operating in the second mode for certain SDRS events that would cause the video module 66 to operate in the second mode were the occupant engaged in the certain activity below the threshold.",
"In one example, the engagement level may be based on the occupant's level of concentration, as measured by a wearable sensor (such as an EEG headset or a smartwatch) or a sensor fixed to the compartment (such as an eye tracker, a thermal camera, or a movement sensor embedded in the seat).",
"Presenting an occupant of a vehicle with video see-through (VST) of the outside environment from a point of view of the occupant can help the occupant be prepared for various events that may be considered to cause a Sudden Decrease in Ride Smoothness (SDRS events).",
"Some examples of SDRS events include the following events: hitting a speed bump, driving over a pothole, climbing on the curb, making a sharp turn, a hard breaking, an unusual acceleration (e.g., 0-100 km/h in less than 6 seconds), and starting to drive after a full stop.",
"In order for the occupant to become aware of an imminent SDRS event, the VST needs to be presented in an attention-grabbing way.",
"For example, when an SDRS event is imminent, the VST that describes the environment is brought to the center of the occupant's attention by displaying it at eye level and/or increasing the size of the VST (compared to other times when an SDRS event is not imminent).",
"The following is a description of an embodiment of a video system that may be used to increase awareness of an occupant of a vehicle regarding an imminent SDRS by making the VST more prominent for an imminent SDRS.",
"In one embodiment, a video system for an autonomous on-road vehicle includes at least the autonomous-driving control system 65, a camera, and a processor.",
"In this embodiment, the occupant is engaged, at least part of the time, in entertainment- or work-related activities, which involve presentation of video-unrelated-to-the-VST (VUR) to the occupant, for example, on a screen coupled to the compartment of the vehicle or a HMD worn by the occupant.",
"Some examples of such content (common in the year 2016) include cinema movies, broadcast TV shows, standard web browsers, and Microsoft Office 2016 applications (such as Word, Excel and PowerPoint).",
"The camera, which is mounted to the vehicle, is configured to take video of the environment outside the vehicle.",
"The processor is configured to generate, based on the video taken by the camera, a video see-through (VST) of outside environment from a point of view of an occupant of the vehicle.",
"Optionally, the occupant is in a front seat of the vehicle (such that no other occupant in the vehicle is positioned ahead of the occupant).",
"In some embodiments, the processor is configured to present video, which may include VUR and/or VST, to the occupant using different presentation modes, depending on whether an SDRS event is imminent.",
"For example, the video may be presented according to first or second modes, depending on whether an SDRS event is imminent.",
"Optionally, the VST captures in the video according to the first mode a diagonal FOV of at least 3°, 5°, or 10° of the occupant's FOV.",
"Optionally, the VST is not presented in the foveal vision region of the occupant in the video according to the first mode, while the VST is presented in the foveal vision region of the occupant in the video according to the second mode.",
"In one embodiment, responsive to an indication that is not indicative of an imminent SDRS event (generated by the autonomous-driving control system 65), the processor is configured to provide the occupant video according to the first mode.",
"In the video according to the first mode, the occupant is presented with video that comprises a video-unrelated-to-the-VST (VUR) at eye level in the direction of forward traveling.",
"Additionally, the video may comprise a video see-through (VST) of outside environment that is not presented at eye level in the direction of forward traveling.",
"Receiving an indication indicative that an SDRS event is imminent may change the way video is presented to the occupant.",
"Optionally, this change is made without receiving a command to do so from the occupant.",
"In one embodiment, responsive to the indication indicating that an SDRS event is imminent, the processor is configured to provide video to the occupant video according to the second mode.",
"In the video according to the second mode, the occupant is presented with video that comprises the VST, presented at eye level in the direction of forward traveling.",
"Optionally, if the video according to the first mode includes VST, then the size of the VST window in the video according to the second mode is larger by at least 25% relative to the size of the VST window in the video according to the first mode.",
"Optionally, the video according to the second mode includes presenting the VUR in the background (e.g., the VST is overlaid above the VUR).",
"Optionally, while providing the video according to the second mode, responsive to an updated indication that does not indicate that an SDRS event is imminent, the processor is further configured to switch back to provide the video according to the first mode to the occupant.",
"The following figures illustrate various ways in which the videos according to the first and second modes may be utilized.",
"FIG.",
"19a illustrates presenting a VUR, which is a movie showing a person skiing, responsive to not receiving from the autonomous-driving control system 65 an indication that an SDRS event is imminent.",
"This figure has two parts, the left part shows the vehicle driving over a clean road, and the right part shows the VUR with a small VST on the right.",
"FIG.",
"19b illustrates presenting a VST responsive to receiving from the autonomous-driving control system 65 an indication that an SDRS event is imminent.",
"This figure has two parts, the left part shows the vehicle about to drive over a speed bump, and the right part shows the VUR but now with a big VST on the right.",
"In this example, the big VST captures about half of the VUR and shows the speed bump.",
"FIG.",
"19c illustrates presenting a partially transparent VST responsive to receiving from the autonomous-driving control system 65 an indication that an SDRS event is imminent.",
"Here, the big VST (that captures about half of the VUR and shows the speed bump) is presented as partially transparent layer over the VUR in order to show the occupant both the VUR and the VST.",
"In one embodiment, presenting to the occupant video according to the second mode involves presenting the VUR behind the VST, and the size and location of the VUR in the video according to the second mode is essentially the same as the size and location of the VUR in the video according to the first mode.",
"Optionally, this means that there is a difference of less than 10% in the size and location of the VURs in the videos according to the first and second modes.",
"In another embodiment, the VUR is presented in a diagonal FOV of at least 10 degrees, and is not based on the video taken by the camera.",
"In some embodiments, the VUR may be unrelated to the purpose of the traveling in the vehicle.",
"For example, the VUR may include videos related to the following activities: watching cinema movies, watching TV shows, checking personal emails, playing entertainment games, and surfing in social networks.",
"In some embodiments, the occupant's field of view (FOV) to the outside environment is obstructed by a nontransparent element, and the VST represents at least a portion of the obstructed FOV.",
"Optionally, the occupant uses a VR headset and the obstruction is due to a nontransparent element belonging to the VR headset.",
"Additionally or alternatively, the obstruction may be due to the vehicle's compartment; in this case the nontransparent element may be an SAEDP, a safety beam, and/or a crumple zone at eye level, which obstruct at least 30 degrees out of the frontal horizontal unaided FOV to the outside environment of the occupant at eye level.",
"When traveling in a vehicle, an occupant of the vehicle may not always be viewing the outside environment.",
"For example, the occupant may be engaged in work- or entertainment-related activities.",
"Additionally, in some vehicles, the occupant may not have a good view of the outside environment most of the time, or even all of the time.",
"For example, the vehicle may have very few (or no) windows, or the vehicle may have a shading mechanism that reduces the light from the outside.",
"However, there are times when the occupant should be made aware of the outside environment, even though the occupant may not be actively driving the vehicle.",
"For example, the occupant may be made aware of the outside environment in order to make the occupant prepared for an event that causes a Sudden Decrease in Ride Smoothness (an SDRS event).",
"Some examples of SDRS events include the following events: hitting a speed bump, driving over a pothole, climbing on the curb, making a sharp turn, a hard breaking, an unusual acceleration (e.g., 0-100 km/h in less than 6 seconds), and starting to drive after a full stop.",
"In order for the occupant to become aware of an imminent SDRS event, in some embodiments that involve a vehicle that has a shading module that controls how much ambient light is let in, when an SDRS event is imminent the vehicle may increase the amount of light that enters via a window.",
"This additional light can give an occupant a better view of the outside environment, which can make the occupant aware and better prepared for the SDRS.",
"The following is a description of an embodiment of a system that may be used to increase awareness of an occupant of a vehicle regarding an imminent SDRS by enabling more ambient light to enter a vehicle via a window.",
"In one embodiment, a shading system for a window of an autonomous on-road vehicle includes at least the autonomous-driving control system 65, a shading module, and a processor.",
"FIG.",
"20a illustrates a smart glass shading module that operates according to an indication that an SDRS event is not imminent.",
"This figure has two parts, the left part shows the vehicle driving over a clean road, and the right part shows that the smart glass window blocks most of the ambient light (illustrated in the figure by the tree outside that is invisible to the occupant).",
"FIG.",
"20b illustrates the smart glass shading module that operates according to an indication that an SDRS event is imminent.",
"This figure has two parts, the left part shows the vehicle about to drive over a pothole, and the right part shows that the smart glass window does not block the ambient light (illustrated in the figure by the tree outside that is visible to the occupant).",
"The shading module is configured to control the amount of ambient light that enters the vehicle via the window.",
"Optionally, the window is a front-facing window (e.g., a windshield).",
"Optionally, the window is a side-facing window.",
"There are various types of shading modules that may be utilized in different embodiments.",
"In one embodiment, the shading module comprises a curtain.",
"Optionally, the curtain covers most of the area of the window.",
"Optionally, the curtain may open and close with the aid of an electromechanical device, such as a motor, based on commands issued by the processor.",
"In another embodiment, the shading module is a movable physical element configured to reduce the intensity of the ambient light entering through the vehicle window into the vehicle compartment.",
"For example, the shading module may include various forms of blinds, a shutter, or a sliding element.",
"Optionally, the shading module may be unfurled on the inside of the vehicle compartment in order to block more than 70% of the ambient light intensity.",
"Optionally, the shading module may be unfurled on the outside of the vehicle compartment in order to block more than 70% of the ambient light intensity.",
"In yet another embodiment, the shading module comprises a smart glass able to change its light transmission level.",
"Optionally, the smart glass is a vehicle window smart glass that comprises suspended particle devices (SPDs) film.",
"Smart glass window may also be known as a switchable glass, a smart window, and/or a switchable window.",
"Smart glass is glass or glazing whose light transmission properties are altered when voltage, current, light or heat is applied.",
"Examples of electrically switchable smart glass include: suspended particle devices (SPDs), electrochromic devices, transition-metal hydride electrochromics devices, modified porous nano-crystalline films, polymer dispersed liquid crystal devices, micro-blinds, and thin coating of nanocrystals embedded in glass.",
"Examples of non-electrical smart glass include: mechanical smart windows, Vistamatic®, and Sunvalve.",
"The processor is configured to command the shading module to operate in different modes based on indications generated by the autonomous-driving control system 65.In some embodiments, the processor is configured to command the shading module to operate in different modes that allow different amounts of the ambient light to enter the vehicle via the window, depending on whether an SDRS event is imminent.",
"For example, shading module may operate in first or second modes, depending on whether an SDRS event is imminent.",
"Optionally, in the first mode the shading module blocks more of the ambient light entering through the vehicle window than in the second mode.",
"Optionally, the increased ambient light in the second mode can help make the occupant more aware of the outside environment, which can enable the occupant to prepare for the SDRS event.",
"In one embodiment, responsive to an indication that no SDRS event is imminent, the processor is configured to command a shading module to operate in a first mode in which the shading module blocks more than 30% of ambient light entering through a window of the vehicle.",
"Receiving an indication indicative that an SDRS event is imminent may change the amount of ambient light that enters the vehicle via the window.",
"Optionally, this change is made without receiving a command to do so from the occupant.",
"In one embodiment, responsive to an indication that an SDRS event is imminent, the processor is configured to command the shading module to operate in the second mode in which the shading module blocks less than 90% of the ambient light entering through the vehicle window.",
"Some aspects of this disclosure include a system that can show an occupant of a vehicle and Object Of Interest (OOI) in the outside environment, which the occupant would otherwise miss (e.g., due to being engaged in work- or entertainment-related activities and/or having no direct view of the outside environment).",
"In one embodiment, a system configured to identify an Object Of Interest (OOI) in the outside environment, and to present to an occupant of an autonomous on-road vehicle a video see-through (VST) that comprises the OOI, includes at least a camera (such as camera 12), a processor (such as processor 18), and a video module (such as video module 66).",
"Different types of things may be considered an OOI in different embodiments.",
"In one embodiment, the OOI is selected from a set comprising: types of vehicles, types of scenery, and types of people.",
"Optionally, the system may include a user interface configured to present a menu that enables the occupant to select the types of OOI, which when identified, will be presented in the second mode of presentation.",
"In one example, an OOI may be any type of high-end vehicle (e.g., a Porsche).",
"In another example, an OOI may include an ocean view.",
"The camera, which is mounted to the vehicle, is configured to take video of the environment outside the vehicle.",
"Optionally, the data captured by the camera comprises 3D data.",
"The processor is configured to generate, based on the video taken by the camera, a video see-through (VST) of outside environment from a point of view of an occupant of the vehicle.",
"Optionally, the occupant is in a front seat of the vehicle (such that no other occupant in the vehicle is positioned ahead of the occupant).",
"The video module is configured to present, to the occupant, video that captures diagonal field of view (FOV) of at least 10 degrees, at eye level.",
"Optionally, the video module is further configured to select a mode of operation based on whether an indication is received that is indicative of whether video taken by the camera include the OOI.",
"Optionally, changing a mode of operation is done without an expressed command at that time by the occupant.",
"In one embodiment, when not receiving an indication that the images includes the OOI, the video module is configured to select a first mode of presentation, in which a video-unrelated-to-the-VST (VUR) is presented on the foveal vision region of the occupant.",
"And responsive to receiving the indication that the images include the OOI, the video module is further configured to select a second mode of presentation, in which the VST is presented on the foveal vision region of the occupant.",
"There are various ways in which an indication of the OOI may be generated in different embodiments.",
"In one embodiment, the system includes an image processing module configured to identify the OOI in the VST and to generate the indication.",
"Various image processing techniques and/or image identification methods known in the art may be utilized by the image processing module for this task.",
"In another embodiment, the system may include the autonomous-driving control system 65 configured to utilize a positioning system, such as GPS coordinates, to identify that the vehicle reached the OOI and to generate the indication.",
"Optionally, the occupant may define which places may be OOIs and/or what types of locations are to be considered OOIs (e.g., historical monuments, nice scenery, etc.).",
"In still another embodiment, the system may include a crowd-based module configured to identify the OOI based on feedback received from many different occupants who watched VSTs comprising the OOI.",
"Optionally, this feedback may be derived based on indications of how other occupants felt about the VST (when it depicted certain content corresponding to OOIs).",
"For example, points of interest may be determined according to affective crowd data, determine based on how other occupants felt about what they saw, and optionally find places where the crowd affective response was positive (e.g., blooming of flowers, etc.).",
"Optionally, some occupants who watched the video related to the unhindered FOV for long periods (or have a physical window) may be monitored to see when an interesting view is encountered.",
"Points of interest may involve items identified in the exterior environment using image analysis, including presenting the VST when one or more of the following happens: passing a fancy vehicle, passing someone the occupant knows, passing a vehicle accident, passing a police officer, having a sunset view, and passing an animal the occupant is interested in.",
"In one embodiment, the system may receive an indication that the occupant is feeling at least one of nauseous and claustrophobic, and consequently present the VST in order to help the occupant to confront the feeling.",
"For example, when there is a serious spike (e.g., increase in heart-rate and sweating), then the system may present the VST automatically.",
"The system may also present a “normal” interior to the occupant (e.g., natural lighting settings).",
"Optionally, when digital content is consumed (e.g., a game or a movie), the system may check whether the affective spike (e.g., increased excitement) is due to the content or due to the experience of being in the vehicle with AR or VR.",
"If it is the former case, then the system might not present the VST.",
"Some aspects of this disclosure involve an autonomous on-road vehicle that includes a nontransparent Shock-Absorbing Energy Dissipation Padding (SAEDP) that is coupled to the compartment of the vehicle and is located, during normal driving, at eye level in front of an occupant who sits in a front seat of the vehicle.",
"Additionally, the vehicle includes a stiff element that is configured to support the SAEDP and to resist deformation during collision in order to reduce compartment intrusion.",
"The stiff element is located, during normal driving, at eye level between the SAEDP and the outside environment.",
"Thus, the combination of the SAEDP and the stiff element offers the occupant an increased level of protection, e.g., in the case of a collision, compared to a vehicle in which a traditional window is in place at eye level in the front of the vehicle.",
"However, due to it being nontransparent, placing the SAEDP at eye level may obstruct the occupant's view to the outside.",
"Thus, in order to offer the occupant such a view, in some embodiments, the vehicle also includes a camera configured to take video of the outside environment in front of the occupant, and a computer configured to generate, based on the video, a representation of the outside environment in front of the occupant at eye level.",
"This representation may be provided to the occupant using various types of displays.",
"One non-limiting advantage of the vehicle described above is that it increases the safety of the occupant in the case of a collision, without prohibiting the occupant from obtaining a view of the outside environment.",
"In one embodiment, an autonomous on-road vehicle includes a compartment, which one or more occupants may occupy while traveling in the vehicle (e.g., by sitting in seats).",
"Coupled to the front of the compartment is a Shock-Absorbing Energy Dissipation Padding (SAEDP) and a stiff element that supports the SAEDP.",
"Optionally, the SAEDP is nontransparent.",
"The stiff element is located, during normal driving, at eye level between the SAEDP and the outside environment.",
"Additionally, the vehicle includes a camera (e.g., camera 142 or structure 147 that comprises multiple cameras), which is configured to take video of the outside environment in front of the occupant, and a computer (e.g., computer 143) that is configured to generate, based on the video, a representation of the outside environment in front of the occupant at eye level.",
"Optionally, the camera, and/or each of the cameras in the structure 147, may be based on at least one of the following sensors: a CCD sensor, a CMOS sensor, a near infrared (NIR) sensor, an infrared sensor (IR), and a device based on active illumination such as a LiDAR.",
"Optionally, when the camera comprises multiple cameras, the multiple cameras are directed to multiple directions around the vehicle, and the multiple cameras support generating multiple representations of the outside environment from different points of view.",
"It is to be noted that in some embodiments, the SAEDP may be fixed at its location both in normal driving and in times that are not considered to correspond to normal driving, while in other embodiments, the SAEDP may change its location during at least some of the times that do not correspond to normal driving.",
"The SAEDP is coupled to the compartment in such a way that it is located, during normal driving, at eye level in front of an occupant who sits in a front seat of the vehicle.",
"Different types of SAEDPs may be utilized in different embodiments.",
"In one embodiment, the SAEDP comprises a passive material that is less stiff than a standard automotive glass window.",
"The passive material is configured to protect the occupant's head against hitting the inner side of the vehicle compartment during a collision.",
"Optionally, the passive material has thickness greater than at least one of the following thicknesses: 1 cm, 2 cm, 5 cm, 10 cm, 15 cm, and 20 cm.",
"Optionally, the thickness of the passive material may refer to the average thickness of the SAEDP across the portion of the SAEDP at eye level.",
"Alternatively, the thickness may refer to the maximal thickness at some position of the SAEDP (which is at least one of the values mentioned above).",
"In another embodiment, the SAEDP comprises a pneumatic pad that is configured to inflate in order to protect the occupant's head against hitting the inner side of the vehicle compartment during collision.",
"In some examples, the pneumatic pads may be formed from an elastomeric material providing chambers containing air or another gas.",
"Optionally, the chambers are retained in compressed deflated condition until being inflated by the admission of gas pressure controlled by the vehicle's autonomous-driving control system that is responsible to estimate the probability and severity of an imminent collision.",
"Additionally or alternatively, the chambers may be provided with restricted passages limiting the flow out from the chambers to provide shock-absorbing energy dissipation to reduce the rebound effect.",
"U.S. Pat.",
"No.",
"5,382,051 discloses examples for pneumatic pads that can be used with some of the embodiments.",
"In yet another embodiment, the SAEDP comprises an automotive airbag, which is configured to protect the occupant's head against hitting the inner side of the vehicle compartment during collision.",
"In one example, during normal driving, the airbag is in a stowed state.",
"The airbag is coupled to an inflator configured to inflate the airbag with gas to an inflated state, upon receiving an indication indicative of a probability of an impact of the vehicle exceeding a threshold.",
"In this example, the airbag is located, when in the stowed state, at eye level in front of the occupant.",
"In some embodiments, the compartment may include a door, and the SAEDP is physically coupled to the door from the inside, such that the SAEDP moves with the door as the door opens and/or closes.",
"In some embodiments, the vehicle may include a second SAEDP coupled to the outer front of the vehicle to minimize damage to a pedestrian during a pedestrian-vehicle collision.",
"In one embodiment, the stiff element that supports the SAEDP is nontransparent.",
"In another embodiment, the stiff element may be automotive laminated glass or automotive tempered glass.",
"Optionally, the structure of the vehicle comprises a crumple zone located at eye level between the stiff element and the outside environment.",
"The representation of the outside environment is intended to provide the occupant with some details describing the outside environment.",
"In some embodiments, the representation of the outside environment is generated from the point of view of the occupant, and it represents how a view of the outside environment would look like to the occupant, had there been a transparent window at eye level instead of the SAEDP and/or the stiff element.",
"Optionally, a display is utilized to present the representation to the occupant.",
"Various types of displays may be utilized in different embodiments to present the representation of the outside environment to the occupant.",
"In one embodiment, the display is comprised in an HMD, and the vehicle further comprises a communication system configured to transmit the representation to the HMD.",
"For example, the HMD may be a virtual reality system, an augmented reality system, or a mixed-reality system.",
"In one embodiment, the display is supported by at least one of the SAEDP and the stiff element.",
"For example, the display is physically coupled to the SAEDP and/or the stiff element.",
"Optionally, the display is a flexible display.",
"For example, the flexible display may be based on at least one of the following technologies and their variants: OLED, organic thin film transistors (OTFT), electronic paper (e-paper), rollable display, and flexible AMOLED.",
"In one example, the display is flexible enough such that it does not degrade the performance of the SAEDP by more than 20% during a collision.",
"In one example, the performance of the SAEDP is measured by hitting a crash test dummy head against the SAEDP and measuring the head's deceleration using sensors embedded in the head.",
"FIG.",
"21a, FIG.",
"21b, and FIG.",
"22 illustrate various embodiments of the vehicle described above.",
"Each of the illustrated vehicles comprises a cross-section view of the vehicles, where each includes a compartment 145 for a single occupant (in FIG.",
"21b) or more (in FIG.",
"21a and FIG.",
"22).",
"In the figures, much of the compartment is covered with the SAEDP 140, which is nontransparent and comprises a soft passive material (cushiony in its nature).",
"Supporting the SAEDP 140 is a stiff element 141, which in the illustrations comprises portions of the exterior (hull) of the vehicle which may optionally be made of one or more of the following materials: fiber-reinforced polymer, carbon fiber reinforced polymer, steel, and aluminum.",
"The vehicles also include a camera (such as camera 142 and/or structure 147 that houses multiple cameras), which is positioned to capture a front view of the outside environment of the vehicle.",
"Additionally, the vehicles include a computer 143, which may be positioned in various locations in the vehicle.",
"In some embodiments, the computer may be comprised of multiple processors and/or graphics processors that may be located at various locations in the vehicle.",
"The figures illustrate various types of displays that may be utilized to present the occupant with the representation of the outside environment generated by the computer 143 based on the video taken by the camera 142.In FIG.",
"21a the representation is presented via an HMD 144, which may be, for example, a virtual reality HMD.",
"In FIG.",
"21b the representation is presented via an HMD 146, which may be, for example, a mixed-reality headset.",
"And in FIG.",
"22 the representation may be provided via one or more of the displays 150, which are coupled to the compartment.",
"It is to be noted that in the figures described above not all of the described elements appear in each figure.",
"The figures also illustrate various structural alternatives that may be implemented in different embodiments described herein.",
"For example, FIG.",
"21a illustrates a vehicle that includes window 148, which may optionally be an automotive tempered glass window, located in a location in which the head of a belted occupant is not expected to hit during collision.",
"FIG.",
"21b illustrates a vehicle that includes crumple zone 149, which is located at the front of the vehicle at eye level.",
"The figure also illustrates the structure 147 that houses multiple cameras directed to multiple directions around the vehicle.",
"In some embodiments, the representation of the outside environment may be manipulated in order to improve how the outside environment looks to the occupant.",
"Optionally, this may be done utilizing the computer.",
"In one example, manipulating the representation includes at least one of the following manipulations: converting captured video of an overcast day to video of a sunny day by preserving main items in the captured video (such as vehicles and buildings) and applying effects of a sunny day, converting unpleasant environment to a nice one, converting standard vehicles to futuristic or old fashion vehicles, and adding fans standing outside and waiving to the occupant.",
"In one embodiment, the manipulation maintains the main items in the environment, such that the occupant would still know from the manipulated representation where he/she is traveling.",
"In another embodiment, the manipulated representation maintains the main objects in the video of the outside environment, such that the main objects presented in the manipulated video essentially match the main objects that would have been seen without the manipulation.",
"In some embodiments, the vehicle compartment may include an automotive laminated glass window or automotive tempered glass window located in a location where the head of a belted occupant is not expected to hit as a result of collision while traveling in velocity of less than 50 km/h, as illustrated by the dotted rectangle 148 in FIG.",
"21a.",
"In one embodiment, the structure of the vehicle is such that a crumple zone is located at eye level between the stiff element and the outside environment.",
"Various types of vehicles may benefit from utilization of the nontransparent SAEDP supported by the stiff element and in conjunction with the camera and computer, as described above.",
"The following are some examples of different characterizations of vehicles in different embodiments.",
"In one embodiment, the vehicle weighs less than 1,500 kg without batteries, and it is designed to carry up to five occupants.",
"In another embodiment, the vehicle weighs less than 1,000 kg without batteries, and it comprises an engine that is able to sustain continuously at most 80 horsepower.",
"In yet another embodiment, the vehicle weighs less than 1,000 kg and it is designed to carry up to two occupants.",
"In still another embodiment, the vehicle weighs less than 800 kg without batteries, and it comprises an engine that is able to sustain continuously at most 60 horsepower.",
"In yet another embodiment, the vehicle weighs less than 500 kg without batteries and it comprises an engine that is able to sustain continuously at most 40 horsepower.",
"And in still another embodiment, the vehicle weighs less than 400 kg without batteries and is designed to carry up to two occupants.",
"Some aspects of this disclosure involve an autonomous on-road vehicle that includes a nontransparent Shock-Absorbing Energy Dissipation Padding (SAEDP) that is coupled to the compartment and is located, during normal driving, at eye level to the left of the occupant who sits in a front seat of the vehicle (in the left front seat when the vehicle has more than one front seat).",
"The SAEDP obstructs at least 30 degrees out of the horizontal unaided field of view (FOV) to the outside environment to the left of the occupant at eye level.",
"Additionally, the vehicle includes a stiff element that is configured to support the SAEDP and to resist deformation during collision in order to reduce compartment intrusion.",
"The stiff element is located, during normal driving, at eye level between the SAEDP and the outside environment.",
"Thus, the combination of the SAEDP and the stiff element offers the occupant an increased level of protection, e.g., in the case of a collision to the left side of the vehicle, compared to a vehicle in which a traditional window is in place at eye level on the left side of the vehicle.",
"However, due to it being nontransparent, placing the SAEDP at eye level may obstruct the occupant's view to the outside.",
"Thus, in order to offer the occupant such a view, in some embodiments, the vehicle also includes a camera configured to take video of the outside environment to the left of the occupant, and a computer, which is configured to generate, based on the video, a representation of the outside environment to the left of the occupant at eye level.",
"This representation may be provided to the occupant using various types of displays.",
"One non-limiting advantage of the vehicle described above is that it increases the safety of the occupant in the case of a side collision, without prohibiting the occupant from obtaining a side view of the outside environment.",
"In one embodiment, an autonomous on-road vehicle includes a compartment, which one or more occupants may occupy while traveling in the vehicle (e.g., by sitting in seats).",
"Coupled to the compartment is a Shock-Absorbing Energy Dissipation Padding (SAEDP) and a stiff element that supports the SAEDP.",
"Optionally, the SAEDP is nontransparent.",
"The SAEDP is located, during normal driving, at eye level to the left of the occupant who sits in a front seat of the vehicle.",
"The stiff element is located, during normal driving, at eye level between the SAEDP and the outside environment.",
"Optionally, the stiff element is nontransparent.",
"Optionally, the stiff element may be automotive laminated glass or automotive tempered glass.",
"The vehicle also includes a camera (such as camera 161) that is configured to take video of the outside environment to the left of the occupant, and a computer that is configured to generate, based on the video, a representation of the outside environment to the left of the occupant at eye level.",
"Optionally, the camera comprises multiple cameras directed to multiple directions around the vehicle, and the multiple cameras support generating multiple representations of the outside environment from different points of view.",
"FIG.",
"23 illustrates one embodiment of the autonomous on-road vehicle described above, which shows how an SAEDP protects the occupant during a collision.",
"In the figure, SAEDP 160 (which may comprise a passive material) is coupled to the stiff element 141.When another vehicle collides with the side of the vehicle, the occupants head strikes the soft SAEDP 160, instead of a glass window (which would be positioned there in many conventional vehicles).",
"The SAEDP is coupled to the compartment in such a way that it is located, during normal driving, at eye level to the left of the occupant who sits in a front seat of the vehicle.",
"Optionally, due to its location, the SAEDP obstructs at least 30 degrees out of the horizontal unaided field of view (FOV) to the outside environment to the left of the occupant at eye level.",
"Optionally, the SAEDP obstructs at least 45 degrees or at least 60 degrees out of the horizontal unaided FOV to the outside environment to the left of the occupant at eye level.",
"In one example of a standard vehicle, such as Toyota Camry model 2015, the frontal horizontal unaided FOV extends from the left door through the windshield to the right door.",
"In some embodiments, the SAEDP is fixed to the left door of the vehicle.",
"In one embodiment, the vehicle has a single seat (occupied by the occupant).",
"In another embodiment, the vehicle has two or more front seats and the occupant occupies the leftmost of the two or more front seats.",
"Different types of SAEDPs may be utilized in different embodiments.",
"In one embodiment, the SAEDP comprises a passive material, which is less stiff than a standard automotive glass window, having a thickness greater than at least one of the following thicknesses: 1 cm, 2 cm, 5 cm, 10 cm, 15 cm, and 20 cm.",
"In other embodiments, the SAEDP may include an automotive airbag or a pneumatic pad that is configured to inflate in order to protect the occupant's head against hitting the inner side of the vehicle compartment during collision.",
"In a similar fashion to how the SAEDP and stiff element are utilized to help protect the left side of the occupant, the same setup may be applied to the right side of the vehicle, in order to help protect that side.",
"Thus, in some embodiments, the vehicle may further include a second SAEDP located at eye level to the right of the occupant who sits in the front seat, and a second stiff element located at eye level between the second SAEDP and the outside environment.",
"Optionally, the second SAEDP obstructs at least 20 degrees out of the horizontal unaided FOV to the outside environment to the right of the occupant at eye level, and the computer is further configured to generate a second representation of the outside environment to the right of the occupant.",
"Some aspects of this disclosure involve an autonomous on-road vehicle that includes a nontransparent Shock-Absorbing Energy Dissipation Padding (SAEDP) that can cover a side window that enables an occupant of the vehicle to see the outside environment.",
"The side window is located at eye level of an occupant who sits in the vehicle.",
"A motor is configured to move the SAEDP over a sliding mechanism between first and second states multiple times without having to be repaired.",
"A processor is configured to receive, from an autonomous-driving control system, an indication that a probability of an imminent collision reaches a threshold, and to command the motor to move the SAEDP from the first state to the second state.",
"In the first state the SAEDP does not block the occupant's eye level view to the outside environment, and in the second state the SAEDP blocks the occupant's eye level view to the outside environment in order to protect the occupant's head against hitting the side window during collision.",
"One non-limiting advantage of the vehicle described above is that it increases the safety of the occupant in the case of a side collision.",
"In one embodiment, an autonomous on-road vehicle includes a side window 170, a nontransparent SAEDP (e.g., SAEDP 171), a motor 172, and a processor 175.The processor 175 is configured to receive, from an autonomous-driving control system (such as autonomous-driving control system 65), an indication indicating that a probability of an imminent collision reaches a threshold, and to command the motor 172 to move the SAEDP 171 from the first state to the second state.",
"In the first state the SAEDP 171 does not block the occupant's eye level view to the outside environment, and in the second state, the SAEDP 171 blocks the occupant's eye level view to the outside environment in order to protect the occupant's head against hitting the side window during collision.",
"Optionally, the processor is configured to command the motor 172 to start moving the SAEDP 171 to the second state at least 0.2 second, 0.5 second, 1 second, or 2 seconds before the expected time of the collision.",
"The motor 172 is configured to move the SAEDP 171 over a sliding mechanism 173 between first and second states multiple times without having to be repaired.",
"For example, during the same voyage, the SAEDP 171 may go up and down multiple times without a need for the occupant or anyone else to repair the SAEDP 171 and/or other components (such as motor 172 or the window 170) in order to the SAEDP 171 to be able to continue its operation correctly (i.e., continue moving up and down when needed).",
"In some examples, the motor 172 is a motor designed to move the SAEDP 171 more than twice, more than 100 times, and/or more than 10,000 times without being replaced.",
"The side window 170 is located at eye level of an occupant who sits in the vehicle, which enables the occupant to see the outside environment.",
"In one embodiment, the side window 170 is a power window.",
"In this embodiment, the power window comprises a window regulator that transfers power from a window motor 177 to the side window glass in order to move it up or down.",
"The motor 172 is coupled to an SAEDP regulator that transfers power from the motor 172 to the SAEDP 171 in order to move it up or down.",
"In this embodiment, the SAEDP regulator is located closer to the inner side of the compartment then the window regulator.",
"Optionally, the motor 172 and the window motor 177 may be of the same type or of different types.",
"In one embodiment, the SAEDP 171 comprises a passive material, which is less stiff than a standard automotive glass window, having thickness greater than at least one of the following thicknesses: 1 cm, 2 cm, 5 cm, 10 cm, 15 cm, and 20 cm.",
"Optionally, the vehicle may include a storage space in a door of the vehicle, which is configured to store the SAEDP 171 in the first state.",
"Additionally or alternatively, the vehicle may include a storage space in the roof of the vehicle, which is configured to store the SAEDP 171 in the first state.",
"Optionally, the SAEDP 171 may move upwards when switching between the first and second states, and the top of the SAEDP has a profile (such as a triangle or a quarter sphere) which reduces the risk of catching the a part of the occupant (e.g., a finger or limb) or the occupant's clothing, between the top of the SAEDP 171 and an upper frame when moving the SAEDP 171 to the second state.",
"In one embodiment, when switching the SAEDP 171 quickly between the first and second states, the SAEDP 171 is configured not to cover a range of 1 to 5 cm of the top height of the window.",
"Optionally, keeping said range unoccupied reduces the risk of catching the occupant's fingers or limb by the edge of the SAEDP 171 when moving the SAEDP 171 to the second state.",
"In some embodiments, the vehicle may include additional SAEDPs that cover additional regions of the vehicle's compartment (besides the side window 170).",
"In one example, the vehicle includes an SAEDP 176 that covers at least a portion of the roof of the vehicle.",
"In some embodiments, the vehicle includes a camera (e.g., camera 178a), which is configured to take video of the outside environment while the SAEDP 171 is in the second state.",
"Additionally, in these embodiments, the vehicle may include a computer (such as computer 13), which is configured to generate a representation of the outside environment based on the video, and a display configured to present the representation of the outside environment to the occupant.",
"The display may be physically coupled to the compartment and/or belong to an HMD.",
"Optionally, the camera is fixed to the SAEDP 171, and thus moves along with the SAEDP 171 when it is moved between the first and second states.",
"Optionally, the display is fixed to the SAEDP 171, and thus moves along with the SAEDP 171 when it is moved between the first and second states.",
"Optionally, the display is configured to show, at eye level, a representation of the outside environment when the SAEDP is in the second state.",
"In one example, the display is a flexible display.",
"In another example, the camera comprises multiple cameras directed to multiple directions around the vehicle, and the computer is configured to generate at least two different representations of the outside environment, from at least two different points of view, for two occupants who sit in the vehicle.",
"In some embodiments, in addition to raising the SAEDP 171, one or more of the displays mentioned above is utilized to present the occupant a video of the threat and the predicted trajectory that could result in the collision, in order to explain why the SAEDP 171 is being moved to the second state.",
"FIG.",
"24a and FIG.",
"24b illustrate an example of a vehicle in which the side window may be covered by an SAEDP that can move up and down.",
"The figures illustrate cross-sections of the vehicle, which show how the SAEDP 171 may move from the first state (in FIG.",
"24a) to the second state (in FIG.",
"24b).",
"The dotted line 179 indicates that the SADEP 171 does not close the entire gap over the window (e.g., in order to avoid catching the occupant's hair).",
"The figures also illustrate sliding mechanism 173, which may be utilized to guide and assist in the movement of SAEDP 171.FIG.",
"24b also illustrates camera 178a and display 178b, which are connected to a processor that generates, based on the video received from the camera, a view of the outside environment when an SAEDP (on the right side of the vehicle) is in the second state.",
"The view of the outside environment is presented to the occupant on the display 178b.",
"Camera and display on the left SAEDP 171, which correspond to camera 178a and display 178b, are not shown in the figure in order to make it clearer; however it is to be understood that such camera and display may be fitted to any relevant moving SAEDP.",
"In one embodiment, the mechanism that moves the SAEDP 171 between the first and second states (referred to as the “SAEDP mechanism”) is similar to a power window regulator that moves an automobile window up and down.",
"As with automobile power windows, the SAEDP regulator may be powered by an electric motor, which may come with the SAEDP regulator as one unit, or as a system that enables the motor or regulator to be replaced separately.",
"The SAEDP mechanism includes a control system, a motor, a gear reduction, a sliding mechanism and the SAEDP, which are usually fixed on the door, but may alternatively be fixed on the roof as disclosed below.",
"The sliding mechanism may have different architectures, such as Bowden type, double Bowden type, cable spiral, or crossed levers.",
"In a first example, the SAEDP mechanism is similar to a double Bowden power window mechanism, in which the SAEDP 171 is fixed on two supports respectively constrained along two rails.",
"The control system drives the motor that wraps two Bowden cables, which move two supports and, consequently, the SAEDP 171.A Bowden cable transmits mechanical force through the movement of an inner cable relative to an outer housing, and in the case of a DC motor, the basic operations of the motor are accomplished by reversing the polarity of its power and ground input.",
"In a second example, the SAEDP mechanism is similar to a gear-drive type power window regulator; in this case, the SAEDP mechanism includes an SAEDP motor to power the mechanism, gear drive and geared arm to move the SAEDP 171 between the first and second states, and an SAEDP holding bracket to hold the SAEDP 171.In a third example, the SAEDP mechanism is similar to a cable type power window regulator; in this case, the SAEDP regulator includes an SAEDP motor that drives a wire cable though a mechanism, a series of pulleys that guide the cable, and a regulator carriage attached to the cable and to the SAEDP 171 and slides on the regulator track.",
"One or more tracks may be mounted vertically inside the door panel that serves as a guide piece when the SAEDP 171 slides up and down.",
"Depending on the design, the setup may have one main regulator track in the center of the door, or have a track on each side of the SAEDP.",
"In a fourth example, the SAEDP regulator is similar to a scissor power window regulator; in this case, a motor operates a gear wheel that raises and lowers the SAEDP 171 by the use of a scissor action of rigid bars.",
"The motor that moves the SAEDP 171 over the sliding mechanism may be any suitable motor, such as a DC electric motor, an AC electric motor, or a pneumatic motor.",
"In one embodiment, the indication that the probability of an imminent collision reaches a threshold is received from the autonomous-driving control system 65 that calculates the probability based on the trajectory of the vehicle and information about the road.",
"Optionally, the information about the road may be received from one of more of the following sources: a sensor mounted to the vehicle, a sensor mounted on a nearby vehicle, a road map, a stationary traffic controller nearby the vehicle, and a central traffic controller that communicates with the vehicle via wireless channel.",
"In one embodiment, the processor 175 is further configured to receive an updated indication that the probability of the imminent collision does not reach a second threshold, and to command the motor to move the SAEDP to the first state.",
"In this embodiment, the second threshold denotes a probability for a collision that is equal or lower than the threshold.",
"FIG.",
"25a and FIG.",
"25b illustrate a motor configured to move a front nontransparent Shock-Absorbing Energy Dissipation Padding (SAEDP) between first and second states.",
"Some aspects of this disclosure involve an autonomous on-road vehicle that includes an outer nontransparent Shock-Absorbing Energy Dissipation Padding (SAEDP) mounted to the front side of the vehicle during normal driving, such that the SAEDP is in front of and at eye level of an occupant who sits in a front seat of the vehicle.",
"Additionally, the vehicle includes a camera that is mounted to the vehicle and is configured to take video of the outside environment in front of the occupant, and a computer configured to generate, based on the video, a representation of the outside environment at eye level for the occupant.",
"One non-limiting advantage of the vehicle described above is that it increases the safety of a pedestrian in case of a vehicle-pedestrian collision, without prohibiting the occupant of the vehicle from receiving a frontal view of the outside environment.",
"FIG.",
"26a illustrates one embodiment of an autonomous on-road vehicle that includes outer nontransparent SAEDP 190, which is mounted to the front side of the vehicle during normal driving, such that the SAEDP 190 is in front of and at eye level of an occupant who sits in a front seat of the vehicle.",
"The SAEDP 190 is less stiff than a standard automotive glass window and is designed to absorb some of the crashing energy transmitted to a pedestrian during a pedestrian-vehicle collision.",
"Additionally, the vehicle includes a camera (such as camera 142), which is mounted to the vehicle and is configured to take video of the outside environment in front of the occupant, and a computer (such as computer 143), which is configured to generate, based on the video, a representation of the outside environment at eye level for the occupant.",
"Optionally, the representation is generated from the point of view of the occupant.",
"Optionally, the vehicle includes a display configured to present the representation to the occupant.",
"For example, the display may belong to an HMD worn by the occupant.",
"In another example, the display may be coupled to the compartment of the vehicle, and may be a flexible display.",
"The SAEDP 190 may be implemented utilizing various approaches in different embodiments described herein.",
"In one embodiment, the SAEDP 190 comprises a passive material.",
"Optionally, the SAEDP 190 has thickness greater than at least one of the following thicknesses: 1 cm, 2 cm, 5 cm, 10 cm, 15 cm, and 20 cm.",
"In another embodiment, the SAEDP 190 comprises an automotive airbag configured to inflate in order to protect the pedestrian.",
"FIG.",
"26b illustrates an outer SAEDP 190 that includes two air bags 192 configured to absorb some of the crashing energy transmitted to a pedestrian during a pedestrian-vehicle collision.",
"Optionally, the airbag has a stowed condition and an inflated condition.",
"The airbag is coupled to an inflator configured to inflate the airbag with gas, and the airbag is located, in the stowed condition, at eye level in front of the occupant.",
"In this embodiment, the vehicle further includes an autonomous-driving control system, such as autonomous-driving control system 65, which is configured to calculate a probability of pedestrian-vehicle collision, based on measurements of sensors mounted to the vehicle, and to command the airbag to inflate before the pedestrian head hits the vehicle.",
"In yet another embodiment, the SAEDP 190 comprises a pneumatic pad configured to inflate in order to protect the pedestrian.",
"In this embodiment, the vehicle further includes an autonomous-driving control system, such as autonomous-driving control system 65, which is configured to calculate a probability of pedestrian-vehicle collision, based on measurements of sensors mounted to the vehicle, and to command the pneumatic pad to start inflate at least 0.5 second before the expected time of the collision in order to protect the pedestrian.",
"Optionally, the pneumatic pad is reusable, and can be used multiple times without the need to be repaired.",
"For example, the vehicle comprises a mechanism to deflate and/or stow the pneumatic pad, without requiring its repair and/or replacement.",
"Some aspects of this disclosure involve an autonomous on-road vehicle that includes a window located at eye level of an occupant who sits in a front seat of the vehicle (e.g., a windshield), a reusable nontransparent Shock-Absorbing Energy Dissipation Padding (SAEDP), a motor, and a processor.",
"The window enables the occupant to see the outside environment.",
"The motor is configured to move the SAEDP over a sliding mechanism between first and second states multiple times without having to be repaired.",
"In the first state the SAEDP does not block the occupant's eye level frontal view to the outside environment, and in the second state the SAEDP blocks the occupant's eye level frontal view to the outside environment.",
"Additionally, in the second state the SAEDP can absorb some of the crashing energy transmitted to a pedestrian during a pedestrian-vehicle collision.",
"The processor is configured to receive, from an autonomous-driving control system, an indication indicative of whether a probability of an imminent pedestrian-vehicle collision reaches a threshold.",
"Responsive to receiving an indication of an imminent collision (e.g., within less than 2 seconds), the processor is configured to command the motor to move the SAEDP from the first state to the second state.",
"One non-limiting advantage of the vehicle described above is that it increases the safety of a pedestrian in case of a vehicle-pedestrian collision, without prohibiting the occupant of the vehicle from receiving a frontal view of the outside environment during normal driving.",
"FIG.",
"27a and FIG.",
"27b illustrate a motorized external SAEDP 121 that can move between first and second states multiple times.",
"The figures illustrate how the SAEDP 121 can move from the first state (in FIG.",
"27a) to the second state (FIG.",
"27b) by having the motor 122 move the SAEDP 121 over sliding mechanism 123.Additionally, the figures illustrate optional camera 126 that is embedded in the SAEDP 121, and which may provide video to a processor configured to generate a representation of the outside environment when the SAEDP 121 is in the second state.",
"In one embodiment, an autonomous on-road vehicle includes window 120, reusable SAEDP 121, motor 122, and processor 124.The window 120, which is located at eye level of an occupant who sits in a front seat of the vehicle, and which may be a windshield, enables the occupant to see the outside environment.",
"The SAEDP 121 is reusable, i.e., it may be moved multiple times without the need to replace it or repair it after each use.",
"The SAEDP 121 may be implemented utilizing various approaches in different embodiments described herein.",
"In one embodiment, the SAEDP 121 comprises a passive material.",
"Optionally, the SAEDP 121 has thickness greater than at least one of the following thicknesses: 1 cm, 2 cm, 5 cm, 10 cm, 15 cm, and 20 cm.",
"In another embodiment, the SAEDP 121 comprises a pneumatic pad configured to inflate in order to protect the pedestrian.",
"Optionally, the pneumatic pad is reusable, and the processor 124 is configured to command the pneumatic pad to start inflate at least 0.5 second before the expected time of the pedestrian-vehicle collision.",
"The motor 122 is configured to move the SAEDP 121 over a sliding mechanism 123 between first and second states multiple times without having to be repaired.",
"In the first state the SAEDP 121 does not block the occupant's eye level frontal view to the outside environment, and in the second state the SAEDP 121 blocks the occupant's eye level frontal view to the outside environment.",
"When in the second state, the SAEDP 121 is configured to absorb some of the crashing energy transmitted to a pedestrian during a pedestrian-vehicle collision.",
"The processor 124 is configured to receive, from an autonomous-driving control system (such as autonomous-driving control system 65), an indication indicative of whether a probability of an imminent pedestrian-vehicle collision reaches a threshold.",
"Optionally, most of the time the vehicle travels, the processor 124 does not provide an indication that the probability reaches the threshold.",
"Responsive to receiving an indication of an imminent collision (e.g., within less than 2 seconds), the processor 124 is configured to command the motor 122 to move the SAEDP 121 from the first state to the second state.",
"Optionally, the processor 124 is configured to command the motor to start moving the SAEDP 121 to the second state at least 0.2 second, 0.5 second, 1 second, or 2 seconds before the pedestrian-vehicle collision in order to protect the pedestrian.",
"In one example, the vehicle includes a sensor configured to detect the distance and angle between the vehicle and a pedestrian, and the autonomous-driving control system calculates the probability of the imminent pedestrian-vehicle collision based on the data obtained from the sensor, the velocity of vehicle and the possible maneuver.",
"In one embodiment, the processor 124 is further configured to receive an updated indication that indicates the probability of the imminent pedestrian-vehicle collision does not reach a second threshold, and to command the motor 122 to move the SAEDP to the first state.",
"Optionally, the second threshold denotes a probability for a pedestrian-vehicle collision that is equal or lower than the threshold.",
"In one embodiment, the vehicle includes a camera (such as camera 126), which is configured to take video of the outside environment while the SAEDP 121 is in the second state.",
"Additionally, in this embodiment, the vehicle may further include a computer configured to generate, based on the video, a representation of the outside environment, and a display configured to present the representation of the outside environment to the occupant while the SAEDP 121 is in the second state.",
"Optionally, the camera 126 is fixed to the SAEDP 121 from the outer side, and thus moves with the SAEDP 121 when it moves between the first and second states.",
"Optionally, the display is fixed to the SAEDP 121 from the inner side, and thus also moves with the SAEDP 121 when it moves between the first and second states; the occupant can see the display via the window 120 when the SAEDP is in the second state.",
"In an alternative embodiment, the display is physically coupled to the compartment (such as a windshield that also functions as a display) and/or comprised in an HMD worn by the occupant.",
"In addition to, or instead of, moving an SAEDP when a collision is imminent, in some embodiments, an imminent collision may prompt a raise of one or more power windows in the vehicle.",
"This approach is illustrated in the following embodiment.",
"In one embodiment, a safety system for an occupant of an autonomous on-road vehicle includes an automobile power window and an autonomous-driving control system (such as autonomous-driving control system 65).",
"The autonomous-driving control system is configured to calculate probability of an imminent collision based on data received from sensors coupled to the vehicle.",
"Responsive to detecting that the probability reaches a threshold, and at least one second before the expected collision, the autonomous-driving control system commands the power window to rise.",
"In this embodiment, a raised power window provides an improved safety for the occupant of the vehicle during collision compared to a lowered power window.",
"Optionally, responsive to detecting that the probability reaches the threshold, and at least two seconds before the expected collision, the autonomous-driving control system is configured to command the power window to rise.",
"In one embodiment, the vehicle further includes an SAEDP coupled to the power window from the inside (e.g., as illustrated in FIG.",
"24a and FIG.",
"24b).",
"In one embodiment, the power window is nontransparent, and the safety system for the occupant includes a display coupled to the power window from the inside.",
"The display is configured to present to the occupant a video see-trough (VST) of the outside environment that is generated based on a video camera pointed at the outside environment.",
"In another embodiment, the power window is made of a nontransparent material, which is stronger than a standard automotive tempered glass having the same dimensions.",
"In this embodiment, the vehicle further comprises a camera configured to take video of the outside environment (such as camera 178a), and a computer configured to generate a VST to the outside environment based on the video.",
"Optionally, the camera is physically coupled to the power window, such that the camera is raised and lowered with the power window.",
"Additionally or alternatively, the camera may be coupled to an element of the vehicle that is not the power window, such that the camera does not move up and down when the power window is raised and lowered.",
"Optionally, the vehicle further includes a display coupled to the inner side of the power window, such that the display is at eye level when the power window is raised, and below eye level when the power window is lowered; the display is configured to present the VST to the occupant.",
"Optionally, the occupant wears an HMD, and the computer is configured to present the VST to the occupant on the HMD when the power window is raised, and not to present the VST to the occupant on the HMD when the power window is lowered.",
"With autonomous vehicles, it is not necessary for occupants to sit.",
"Some aspects of this disclosure involve autonomous vehicles in which an occupant of the vehicle may lay down.",
"Such a design for an autonomous vehicle has the advantage of enabling a more comfortable position for certain activities (e.g., relaxing or sleeping).",
"Additionally, such a vehicle may be built to be lower than traditional vehicles, which can offer advantages in terms of increased safety (e.g., a lower center of gravity offers better stability) and better vehicle aerodynamics.",
"In order to increase the safety of the occupant, various forms of padding may be used in the compartment of the vehicle.",
"In some embodiments, an autonomous on-road vehicle designed for lying down includes a closed compartment and a mattress, having an average thickness of at least 3 cm, which covers at least 50% of the compartment floor.",
"In the compartment, there is a nontransparent Shock-Absorbing Energy Dissipation Padding (SAEDP), having an average thickness of at least 1 cm, which covers at least 50% of the compartment side walls and at least 60% of the compartment front wall during normal driving.",
"Optionally, the SAEDP is supported by a stiff element that resists deformation during a collision in order to reduce compartment intrusion.",
"Additionally, the vehicle includes a camera configured to take video of the outside environment, a computer configured to generate a representation of the outside environment based on the video, and a display configured to present the representation to the occupant.",
"In one embodiment, an autonomous on-road vehicle designed for lying down includes a closed compartment 210, a mattress 211, an SAEDP 212 covering portions of the compartment 210, a camera (e.g., the structure 147 that houses multiple cameras), a computer (e.g., the computer 143), and a display 215.FIG.",
"28 illustrates one embodiment of a vehicle compartment 210 in which an occupant may lay down.",
"In the figure, the occupant is lying down on mattress 211, which covers the floor of the compartment 210, and is watching a movie on the display 215.The SAEDP 212 covers the front, roof, and back of the compartment 210.It is to be noted that the SAEDP 212 also covers portions of the side walls of the compartment 210, however, this is not illustrated to enable a clearer image of the embodiment.",
"The figure also includes an airbag 216, which may be inflated below the SAEDP 212 in order to protect the occupant and restrain his/her movement in the case of a collision.",
"The mattress 211 covers at least 50% of the compartment floor.",
"Optionally, the mattress 211 covers at least 80% of the compartment floor.",
"In one embodiment, the mattress 211 has an average thickness of at least 3 cm.",
"In other embodiments, the average thickness of the mattress 211 is greater than at least one of the following thicknesses: 5 cm, 7 cm, 10 cm, 20 cm, and 30 cm.",
"The SAEDP 212 is a nontransparent SAEDP, having an average thickness of at least 1 cm.",
"Optionally, the SAEDP 212 covers at least 50% of the compartment side walls and at least 60% of the compartment front wall during normal driving.",
"In one embodiment, the average thickness of the SAEDP 212 is greater than at least one of the following thicknesses: 2 cm, 3 cm, 5 cm, 10 cm, 15 cm, and 20 cm.",
"In another embodiment, the SAEDP 212 covers at least 80% of the compartment side walls and at least 80% of the compartment front wall.",
"In yet another embodiment, the SAEDP covers at least 50% of the compartment roof.",
"In still another embodiment, the mattress and the SAEDP cover essentially the entire compartment interior.",
"In addition to the SAEDP 212, in some embodiments additional measures may be employed in order to improve the safety of the occupant.",
"In one embodiment, the vehicle includes an automotive airbag configured to deploy in front of the SAEDP 212 in order to protect the occupant, in addition to the SAEDP 212, against hitting the inner side of the vehicle compartment during a collision.",
"It is noted that the meaning that the airbag deploys in front of the SAEDP is that the airbag deploys towards the inner side of the compartment.",
"Optionally, the airbag has a stowed condition and an inflated condition, and the airbag is coupled to an inflator configured to inflate the airbag with gas upon computing a predetermined impact severity.",
"The stowed airbags may be stored in various positions, such as stored essentially in the middle of the front wall, stored essentially in the middle of the rear wall, stored in the side walls (possibly two or more horizontally spaced airbags), and stored in the roof (possibly one or more airbags towards the front of the compartment and one or more airbags towards the rear of the compartment).",
"In some embodiments, various additional safety measures may be utilized to improve the safety of the occupant while traveling, such as a sleeping net and/or a safety belt, as described for example in U.S. Pat.",
"Nos.",
"5,536,042 and 5,375,879.Stiff element 213 is configured to support the SAEDP 212 and to resist deformation during a collision in order to reduce compartment intrusion.",
"Part of the stiff element 213 is located, during normal driving, at eye level between the SAEDP 212 and the outside environment.",
"Optionally, the stiff element covers, from the outside, more than 80% of the SAEDP on the compartment side walls.",
"Optionally, the vehicle also includes a crumple zone located at eye level between the stiff element 213 and the outside environment.",
"In another embodiment, the vehicle includes a pneumatic pad configured to inflate in order to protect the occupant, in addition to the SAEDP 212, against hitting the inner side of the vehicle compartment during a collision.",
"Optionally, the pneumatic pad is configured to deploy in front of the SAEDP 212 towards the inner side of the compartment.",
"Alternatively, the pneumatic pad is located between the SAEDP 212 and the stiff element 213, and is configured to deploy behind the SAEDP 212.The pneumatic pad may be mounted to various locations, such as mounted to the front wall, mounted to the rear wall, mounted to the side walls, and/or mounted to the roof.",
"The camera is configured to take video of the outside environment.",
"The computer is configured to generate a representation of the outside environment based on the video.",
"Optionally, the representation is generated from the point of view of the occupant.",
"The display 215 is configured to present the representation to the occupant.",
"In one embodiment, the display 215 is comprised in an HMD, and the vehicle further comprises a communication system configured to transmit the representation to the HMD.",
"In another embodiment, the display 215 is physically coupled to at least one of the SAEDP 212 and the stiff element 213 at eye level of the occupant.",
"Optionally, the display 215 is a flexible display.",
"For example, the display 215 may be a flexible display that is based on at least one of the following technologies and their variants: OLED, organic thin film transistors (OTFT), electronic paper (e-paper), rollable display, and flexible AMOLED.",
"Optionally, the display 215 is flexible enough such that it does not degrade the performance of the SAEDP by more than 20% during a collision.",
"Having a vehicle compartment that is designed to allow an occupant to lay down comfortably can be done using various compartment designs, which may be different from the designs used in standard vehicles, in which occupants primarily sit up.",
"In one example, the vehicle does not have an automotive seat with a backrest and safety belt, which enables the occupant to sit straight in the front two thirds of the compartment.",
"In another example, the vehicle is designed for a single occupant, and the average distance between the mattress and the compartment roof is below 80 cm.",
"In still another example, the vehicle is designed for a single occupant, and the average distance between the mattress and the compartment roof is below 70 cm.",
"In still another example, the vehicle is designed for a single occupant, and the average distance of the compartment roof from the road is less than 1 meter.",
"And in yet another example the vehicle is designed for a single occupant, and the average distance of the compartment roof from the road is less than 80 cm.",
"It is to be noted that the use of the terms “floor”, “roof”, “side walls”, and “front wall” with respect to the compartment are to be viewed in their common meaning when one considers the compartment to be a mostly convex hull in 3D, such as having a shape that resembles a cuboid.",
"Thus, for example, an occupant whose face faces forward, will see the front wall ahead, the floor when looking below, the roof when looking above, and a side wall when looking to one of the sides (left or right).",
"In embodiments that do not resemble cuboids, alternative definitions for these terms may be used based on the relative region (in 3D space) that each of the portions of the compartment occupy.",
"For example, the floor of the compartment may be considered to be any portion of the compartment which is below at least 80% of the volume of the compartment.",
"Similarly, the roof may be any portion of the compartment that is above at least 80% of the volume of the compartment.",
"The front wall may be any portion of the compartment that is ahead of at least 80% of the volume of the compartment, etc.",
"Note that using this alternative definitions, some portions of the compartment may be characterized as belonging to two different regions (e.g., the front wall and the roof).",
"Some aspects of this disclosure involve an autonomous on-road vehicle that includes a compartment having a large mirroring element located in front of an occupant who sits in a front seat of the compartment.",
"Optionally, the mirroring element has height and width exceeding 25×25 cm, such that it covers a square that is at least those dimensions.",
"Optionally, the mirroring element captures a region corresponding to at least 10×10 degrees, including a region spanning from the horizon to 10° below the horizon, of the occupant's forward field of view during normal driving.",
"Additionally, the mirroring element provides an effect of reflecting more than 25% of the light arriving from the occupant's direction.",
"In some embodiments, the vehicle has an advantage that it can increase the perceived compartment volume, which can make travelling in the vehicle more pleasurable for some people.",
"FIG.",
"29 illustrates one embodiment of a vehicle having a front mirroring element.",
"The figure illustrates how the occupant 222 can see her reflection 223 in the mirroring element 220.In one embodiment, the mirroring element 220 is located in front of an occupant who sits in a front seat of the vehicle.",
"The mirroring element 220 provides an effect of reflecting more than 25% of the light arriving from the occupant's direction.",
"Optionally, the mirroring element 220 provides an effect of reflecting more than at least one of 50%, 80%, and 90% of the light arriving from the occupant's direction.",
"Optionally, the mirroring element 220 increases the volume of the vehicle compartment as perceived by the occupant due to the reflection effect.",
"In one embodiment, the mirroring element 220 has height and width exceeding 25×25 cm, such that it covers a square that is at least those dimensions.",
"Optionally, the mirroring element 220 captures a region corresponding to at least 10×10 degrees, including a region spanning from the horizon to 10° below the horizon, of the occupant's forward field of view during normal driving.",
"Optionally, the height and width of the mirroring element 220 is above 50×40 cm, and the mirroring element captures above 30×30 degrees of the occupant's field of view, including a region spanning from the horizon to 30° below the horizon.",
"Optionally, the mirroring element 220 covers more than 25% of the area where a conventional windshield of a normal non-autonomous on-road vehicle in year 2016 is expected to be located.",
"The mirroring element 220 may be implemented in different ways, in different embodiments.",
"In one embodiment, the mirroring element 220 comprises an optical mirror that is essentially flat and perpendicular to the ground.",
"In this embodiment, most of the effect of reflecting is generated by the optical mirror.",
"In one example, an optical mirror that is essentially flat and perpendicular to the ground refers to an optical mirror having a radius of curvature greater than a meter and a deviation below ±30° from the perpendicular to the ground.",
"In another embodiment, the mirroring element 220 comprises a Fresnel type optical reflector comprising many reflecting prisms.",
"In this embodiment, the Fresnel type optical reflector is not flat, but the reflecting prisms are arranged in angles that reflect the light from the occupant such as to imitate a flat mirror.",
"In one embodiment, the mirroring element 220 comprises an electronic display that operates based on a camera 221 configured to take video of the occupant 222, and a computer 224 configured to generate a digital representation of the occupant 223 based on the video of the occupant.",
"In this case, most of the effect of reflecting is generated by light emitted by the electronic display (which is the output of the video of the occupant as generated by the computer 224).",
"Due to the close proximity between the at least one camera 221 and the occupant, it may be necessary to stitch the reflecting effect of a large area from multiple cameras that capture the occupant from different angles.",
"In one example, the camera 221 comprises first and second cameras, located to the right and left of the occupant, respectively.",
"In another example, the camera 221 comprises first and second cameras, located above the level of the occupant's nose and below the level of the occupant's collarbone, respectively, and less than 80 cm away from the occupant.",
"In still another embodiment, the effect of reflecting is achieved by a digital mirror that comprises multiple cameras embedded within the digital mirror and configured to take images of the occupant, and multiple light emitting pixels configured to emit light rays that generate the effect of reflecting.",
"In one embodiment, the mirroring element 220 comprises an electronic display, and the vehicle further includes a camera configured to take video of the outside environment in front of the occupant, and a computer configured to generate, based on the video, a representation of the outside environment in front of the occupant at eye level, for displaying on the mirroring element 220.In addition to the effect of reflecting, in some embodiments the mirroring element 220 may also be configured to operate in a second state in which it provides an effect of reflecting less than 20% of the light arriving from the occupant's direction, and to present to the occupant the representation of the outside environment.",
"Here, presenting the representation may imitate a transparent windshield to the outside environment.",
"The vehicle may also include, in some embodiments, a display configured to present to the occupant, at eye level in front of the occupant, the representation of the outside environment instead of, or in addition to, the effect of reflecting.",
"Optionally, the vehicle may include a user interface configured to enable the occupant to switch between seeing the effect of reflecting and seeing the representation of the outside environment.",
"In one example, the display is comprised in a head-mounted display (HMD).",
"In another example, the display is mechanically coupled to the compartment, and/or the mirroring element comprises the display.",
"As described above, the effect of reflecting light that comes from the direction of the occupant may be obtained, in some embodiments, utilizing an HMD.",
"The following is a more detailed example of such an embodiment.",
"In one embodiment, an autonomous on-road vehicle includes a compartment comprising a front seat, a camera, a computer, a communication module, and an HMD.",
"The camera is physically coupled to the vehicle, configured to take images of an occupant who sits in the front seat.",
"The computer is configured to generate, based on the images, a video that shows a mirror effect.",
"Herein, the “mirror effect” involves presenting the occupant with an image that is similar to an image that the occupant would see had there been an actual mirror in front of the occupant.",
"Optionally, the system enables the occupant to have control on the synthetic mirror effect, such as control on the distance between the occupant and her image, and/or control on the width of the image.",
"The communication module is configured to transmit the video to a head-mounted display (HMD) worn by the occupant, and the HMD is configured to present the video to the occupant, such that the occupant sees a representation of his or her reflection when looking forward at eye level.",
"Optionally, the HMD is selected from the group comprising: a virtual reality headset, an augmented reality headset, and mixed reality headset.",
"Optionally, the video presented to the occupant captures at least 30×30 degrees of the occupant's field of view, spanning at least from the horizon to 30° below the horizon.",
"In one embodiment, the vehicle described above further includes a second camera configured to take a second set of images of the outside environment in front of the occupant.",
"In this embodiment, the computer is further configured to generate a representation of the outside environment based on the second set of images, and the HMD is configured to present the representation of the outside environment instead of the video that shows the mirror effect or in addition to the video that shows the mirror effect.",
"In one embodiment, the vehicle described above may include multiple cameras that capture images that are utilized by the computer to generate the video that shows the mirror effect.",
"In one example, the vehicle comprises at least first and second cameras, which are located to the right and left of the occupant, respectively.",
"In another example, the vehicle comprises at least first and second cameras, located above the level of the occupant's nose and below the level of the occupant's collarbone, respectively, and which are less than 80 cm away from the occupant.",
"Some aspects of this disclosure involve utilizing one or more nontransparent side beams in order to help protect the occupant in a case of a collision.",
"The one or more side beams are stiffer than automotive laminated glass.",
"In one example, a side beam comprises a high tensile steel pipe and pressed material.",
"In another example, a side beam comprises an aluminum extruded shape.",
"In one embodiment, an autonomous on-road vehicle that weighs less than 1500 kg without batteries includes a nontransparent side beam, which is stiffer than automotive laminated glass, and is located during normal driving to the left and at eye level of an occupant who sits in a front seat.",
"The vehicle also includes a camera configured to take video of the outside environment to the left of the occupant, and a computer configured to generate for the occupant, based on the video, a representation of the outside environment to the left of the occupant at eye level.",
"Optionally, the representation is presented to the occupant using a display.",
"In one example, the display is comprised in a head-mounted display (HMD), and the vehicle further comprises a communication system configured to transmit the representation to the HMD.",
"In another example, the display is coupled to the inner side of the compartment.",
"The following is a description of an embodiment of a vehicle in which one or more side beams may be utilized to help protect the left side of a vehicle (and an occupant therein).",
"In one embodiment, an autonomous on-road vehicle includes a nontransparent side beam, a camera (e.g., the camera 161), and a computer (e.g., the computer 143).",
"Optionally, the vehicle weighs less than 1500 kg without batteries.",
"The nontransparent side beam, which is stiffer than automotive laminated glass, is located, during normal driving, at eye level to the left of an occupant who sits in a front seat of the vehicle.",
"Optionally, the side beam is at least 60 cm long and at least 1 cm wide (herein “cm” refers to centimeters).",
"In one example, the side beam comprises a high tensile steel pipe and pressed material.",
"In another example, the side beam comprises an aluminum extruded shape.",
"The camera configured to take video of the outside environment to the left of the occupant.",
"The computer is configured to generate for the occupant, based on the video, a representation of the outside environment to the left of the occupant at eye level.",
"Optionally, the representation is generated from the point of view of the occupant, and the vehicle further includes a display configured to present the representation to the occupant.",
"In one example, the display is comprised in a head-mounted display (HMD), and the vehicle further comprises a communication system configured to transmit the representation to the HMD.",
"In another example, the display is coupled to the inner side of the compartment.",
"In some embodiments, a plurality of beams, which may be similar to the side beam described above, may be located in the region of the left side of the vehicle.",
"It is to be noted that the plurality of beams may not necessarily all have the same dimensions or be made of the same exact materials.",
"Optionally, the plurality of beams may be connected in various ways in order to form a structure that can better resist compartment deforming in the case of a collision.",
"For example, in one embodiment, the vehicle includes an additional side beam that is not parallel to the side beam and crosses it to form an “X” shaped structure.",
"Herein, an “X” shaped structure refers to any structure of two nonparallel beams that cross, and the two do not necessarily form a symmetric “X” (e.g., a symmetric “X” may be obtained when the two beams are of equal length and cross at their centers).",
"This structure is illustrated in FIG.",
"30a where beams 231 and 232 cross to form an “X” shape structure.",
"It is to be noted that the beam 231 is at eye level (i.e., at least a portion of the beam 231 is at the same height as a typical occupant's eyes).",
"FIG.",
"30a illustrates one example of a configuration of a plurality of beams located in the left side of the vehicle.",
"Different designs of vehicles may benefit from utilizing one or more sides beam as described above.",
"In one embodiment, the side beam is embedded in a movable structure that changes its location with respect to the vehicle compartment.",
"For example, the side beam may be part of a left door of the vehicle.",
"In another embodiment, the side beam is embedded in the vehicle compartment itself and does not change its location with respect to the rest of the compartment.",
"For example, the side beam may be placed in a compartment wall to the left of the occupant.",
"In order to better protect the occupant from injury due to hitting the head against the side of the vehicle, in some embodiments, the vehicle may comprise a nontransparent Shock-Absorbing Energy Dissipation Padding (SAEDP) located at eye level between the side beam and the occupant.",
"The SAEDP is less stiff than a standard automotive glass window.",
"In one example, the SAEDP comprises a passive material.",
"In another example, the SAEDP includes an airbag.",
"And in still another example, the SAEDP includes a pneumatic pad.",
"Optionally, the vehicle includes a display on which the representation of the outside environment may be presented to the occupant.",
"Optionally, the display is supported by the SAEDP and/or the side beam.",
"Optionally, the display is a flexible display.",
"In a similar fashion to the utilization of beams on the left side of the vehicle, in some embodiments, one or more beams may be used to help protect the occupant's right side.",
"For example, in one embodiment, the vehicle includes a second side beam, located at eye level to the right of the occupant, and a second camera configured to take video of the outside environment to the right of the occupant.",
"In this embodiment, the computer is further configured to generate a second representation of the outside environment to the right of the occupant.",
"Some aspects of this disclosure involve utilizing one or more nontransparent beams in order to help protect the occupant in a case of a collision.",
"The one or more beams are stiffer than automotive laminated glass.",
"In one example, a nontransparent beam comprises a high tensile steel pipe and pressed material.",
"In another example, a nontransparent beam comprises an aluminum extruded shape.",
"In one embodiment, an autonomous on-road vehicle that weighs less than 1500 kg without batteries includes a nontransparent beam, which is stiffer than automotive laminated glass, and is fixed at eye level in front of an occupant who sits in a front seat of the vehicle during normal driving.",
"The vehicle also includes a camera configured to take video of the outside environment in front of the occupant, and a computer configured to generate for the occupant, based on the video, a representation of the outside environment in front of the occupant at eye level.",
"Optionally, the representation is presented to the occupant using a display.",
"In one example, the display is comprised in a head-mounted display (HMD), and the vehicle further comprises a communication system configured to transmit the representation to the HMD.",
"In another example, the display is coupled to the inner side of the compartment.",
"The following is a description of an embodiment of a vehicle in which one or more nontransparent beams may be utilized to help protect the vehicle's front (and an occupant therein).",
"In one embodiment, an autonomous on-road vehicle includes a nontransparent beam, a camera (e.g., the camera 142), and a computer (e.g., the computer 143).",
"Optionally, the vehicle weighs less than 1500 kg without batteries.",
"The nontransparent beam, which is stiffer than automotive laminated glass, is located, during normal driving, at eye level in front an occupant who sits in a front seat of the vehicle.",
"Optionally, the nontransparent beam is at least 60 cm long and at least 1 cm wide (herein “cm” refers to centimeters).",
"In one example, the nontransparent beam comprises a high tensile steel pipe and pressed material.",
"In another example, the nontransparent beam comprises an aluminum extruded shape.",
"The camera configured to take video of the outside environment in front of the occupant.",
"The computer is configured to generate for the occupant, based on the video, a representation of the outside environment in front of the occupant at eye level.",
"Optionally, the representation is generated from the point of view of the occupant, and the vehicle further includes a display configured to present the representation to the occupant.",
"In one example, the display is comprised in a head-mounted display (HMD), and the vehicle further comprises a communication system configured to transmit the representation to the HMD.",
"In another example, the display is coupled to the inner side of the compartment.",
"In some embodiments, a plurality of beams, which may be similar to the nontransparent beam described above, may be located in the front of the vehicle.",
"It is to be noted that the plurality of beams may not necessarily all have the same dimensions or be made of the same exact materials.",
"Optionally, the plurality of beams may be connected in various ways in order to form a structure that can better resist compartment deformation in the case of a collision.",
"For example, in one embodiment, the vehicle includes an additional nontransparent beam that is not parallel to the nontransparent beam and crosses it to form an “X” shaped structure.",
"This structure is illustrated in FIG.",
"30b where beams 235 and 236 cross to form an “X” shape structure.",
"Both of the beams 235 and 236 are at eye level (i.e., at least a portion of each beam is at the same height as a typical occupant's eyes).",
"FIG.",
"30b illustrates one example of a configuration of a plurality of beams located in the front of the vehicle.",
"Different designs of vehicles may benefit from utilizing one or more nontransparent beam as described above.",
"In one embodiment, the nontransparent beam is embedded in a movable structure that changes its location with respect to the vehicle compartment.",
"For example, the nontransparent beam may be part of a front door through which the occupant may enter the vehicle.",
"In another embodiment, the nontransparent beam is embedded in the vehicle compartment itself and does not change its location with respect to the rest of the compartment.",
"For example, the nontransparent beam may be placed in a compartment wall in front of the occupant.",
"In order to better protect the occupant from injury (e.g., during a collision), in some embodiments, the vehicle may comprise a nontransparent Shock-Absorbing Energy Dissipation Padding (SAEDP) located at eye level between the nontransparent beam and the occupant.",
"The SAEDP is less stiff than a standard automotive glass window.",
"In one example, the SAEDP comprises a passive material.",
"In another example, the SAEDP includes an airbag.",
"And in still another example, the SAEDP includes a pneumatic pad.",
"Optionally, the vehicle includes a display on which the representation of the outside environment may be presented to the occupant.",
"Optionally, the display is coupled to the inner side of the compartment.",
"Optionally, the display is a flexible display.",
"Various embodiments described herein include a processor and/or a computer.",
"For example, the autonomous-driving control system may be implemented using a computer and generation of a representation of the outside environment is done using a processor or a computer.",
"The following are some examples of various types of computers and/or processors that may be utilized in some of the embodiments described herein.",
"FIG.",
"31a and FIG.",
"31b are schematic illustrations of possible embodiments for computers (400, 410) that are able to realize one or more of the embodiments discussed herein.",
"The computer (400, 410) may be implemented in various ways, such as, but not limited to, a server, a client, a personal computer, a network device, a handheld device (e.g., a smartphone), and/or any other computer form capable of executing a set of computer instructions.",
"The computer 400 includes one or more of the following components: processor 401, memory 402, computer readable medium 403, user interface 404, communication interface 405, and bus 406.In one example, the processor 401 may include one or more of the following components: a general-purpose processing device, a microprocessor, a central processing unit, a complex instruction set computing (CISC) microprocessor, a reduced instruction set computing (RISC) microprocessor, a very long instruction word (VLIW) microprocessor, a special-purpose processing device, an application specific integrated circuit (ASIC), a field programmable gate array (FPGA), a digital signal processor (DSP), a distributed processing entity, and/or a network processor.",
"Continuing the example, the memory 402 may include one or more of the following memory components: CPU cache, main memory, read-only memory (ROM), dynamic random access memory (DRAM) such as synchronous DRAM (SDRAM), flash memory, static random access memory (SRAM), and/or a data storage device.",
"The processor 401 and the one or more memory components may communicate with each other via a bus, such as bus 406.The computer 410 includes one or more of the following components: processor 411, memory 412, and communication interface 413.In one example, the processor 411 may include one or more of the following components: a general-purpose processing device, a microprocessor, a central processing unit, a complex instruction set computing (CISC) microprocessor, a reduced instruction set computing (RISC) microprocessor, a very long instruction word (VLIW) microprocessor, a special-purpose processing device, an application specific integrated circuit (ASIC), a field programmable gate array (FPGA), a digital signal processor (DSP), a distributed processing entity, and/or a network processor.",
"Continuing the example, the memory 412 may include one or more of the following memory components: CPU cache, main memory, read-only memory (ROM), dynamic random access memory (DRAM) such as synchronous DRAM (SDRAM), flash memory, static random access memory (SRAM), and/or a data storage device Still continuing the examples, the communication interface (405,413) may include one or more components for connecting to one or more of the following: an inter-vehicle network, Ethernet, intranet, the Internet, a fiber communication network, a wired communication network, and/or a wireless communication network.",
"Optionally, the communication interface (405,413) is used to connect with the network 408.Additionally or alternatively, the communication interface 405 may be used to connect to other networks and/or other communication interfaces.",
"Still continuing the example, the user interface 404 may include one or more of the following components: (i) an image generation device, such as a video display, an augmented reality system, a virtual reality system, and/or a mixed reality system, (ii) an audio generation device, such as one or more speakers, (iii) an input device, such as a keyboard, a mouse, an electronic pen, a gesture based input device that may be active or passive, and/or a brain-computer interface.",
"It is to be noted that when a processor (computer) is disclosed in one embodiment, the scope of the embodiment is intended to also cover the use of multiple processors (computers).",
"Additionally, in some embodiments, a processor and/or computer disclosed in an embodiment may be part of the vehicle, while in other embodiments, the processor and/or computer may be separate of the vehicle.",
"For example, the processor and/or computer may be in a device carried by the occupant and/or remote of the vehicle (e.g., a server).",
"As used herein, references to “one embodiment” (and its variations) mean that the feature being referred to may be included in at least one embodiment of the invention.",
"Moreover, separate references to “one embodiment”, “some embodiments”, “another embodiment”, “still another embodiment”, etc., may refer to the same embodiment, may illustrate different aspects of an embodiment, and/or may refer to different embodiments.",
"Some embodiments may be described using the verb “indicating”, the adjective “indicative”, and/or using variations thereof.",
"Herein, sentences in the form of “X is indicative of Y” mean that X includes information correlated with Y, up to the case where X equals Y. Additionally, sentences in the form of “provide/receive an indication indicating whether X happened” refer herein to any indication method, including but not limited to: sending/receiving a signal when X happened and not sending/receiving a signal when X did not happen, not sending/receiving a signal when X happened and sending/receiving a signal when X did not happen, and/or sending/receiving a first signal when X happened and sending/receiving a second signal X did not happen.",
"Herein, “most” of something is defined herein as above 51% of the something (including 100% of the something).",
"A “portion” of something refers herein to 0.1% to 100% of the something (including 100% of the something).",
"Sentences of the form “a portion of an area” refer herein to 0.1% to 100% percent of the area.",
"As used herein, the terms “comprises,” “comprising,” “includes,” “including,” “has,” “having”, or any other variation thereof, indicate an open claim language that does not exclude additional limitations.",
"The “a” or “an” is employed to describe one or more, and the singular also includes the plural unless it is obvious that it is meant otherwise.",
"Certain features of some of the embodiments, which may have been, for clarity, described in the context of separate embodiments, may also be provided in various combinations in a single embodiment.",
"Conversely, various features of some of the embodiments, which may have been, for brevity, described in the context of a single embodiment, may also be provided separately or in any suitable sub-combination.",
"Embodiments described in conjunction with specific examples are presented by way of example, and not limitation.",
"Moreover, it is evident that many alternatives, modifications, and variations will be apparent to those skilled in the art.",
"It is to be understood that other embodiments may be utilized and structural changes may be made without departing from the scope of the appended claims and their equivalents."
]
] |
Patent_15871054
|
[
[
"CURABLE COMPOSITIONS FOR ONE DROP FILL SEALANT APPLICATION",
"The present invention relates to bismaleimide resins and curable compositions for One Drop Fill sealant applications using such resins, particularly in liquid crystal display assembly applications.",
"The inventive compositions can be cured by a UV, thermal or a combination of UV and thermal."
],
[
"1.A resin composition comprising the structure: Wherein R is a multivalent hydrocarbyl linker selected from linear or branched alkyls, linear or branched cycloalkyls, alkylenes, cycloalkylenes, bicycloalkylenes, tricycloalkylenes, linear or branched alkylenes, linear or branched cycloalkylenes, linear or branched alkenylenes, arylenes, aralkylenes, arylbicycloalkylenes, aryltricycloalkylenes, bicycloalkylarylenes, tricycloalkylarylenes, bisphenylenes, cycloalkylarylenes, heterocycloalkylene or heterocycloarylenes; the alkyls, cycloalkyls, alkylenes, cycloalkylenes, alkenylenes, arylenes, aralkylenes, arylbicycloalkylenes, aryltricycloalkylenes, bicycloalkylarylenes, tricycloalkylarylenes, bisphenylenes, cycloalkylarylenes, heterocycloalkylene and heterocycloarylenes can optionally contain O or S or hydroxyl group; and n and n1 are each independently 1-10.2.A resin composition comprising the structure: Wherein R is a multivalent hydrocarbyl linker selected from linear or branched alkyls, linear or branched cycloalkyls, alkylenes, cycloalkylenes, bicycloalkylenes, tricycloalkylenes, linear or branched alkylenes, linear or branched cycloalkylenes, linear or branched alkenylenes, arylenes, aralkylenes, arylbicycloalkylenes, aryltricycloalkylenes, bicycloalkylarylenes, tricycloalkylarylenes, bisphenylenes, cycloalkylarylenes, heterocycloalkylene or heterocycloarylenes; the alkyls, cycloalkyls, alkylenes, cycloalkylenes, alkenylenes, arylenes, aralkylenes, arylbicycloalkylenes, aryltricycloalkylenes, bicycloalkylarylenes, tricycloalkylarylenes, bisphenylenes, cycloalkylarylenes, heterocycloalkylene and heterocycloarylenes can optionally contain O or S or hydroxyl group; and n1, n2, n3, and n4 are each independently 1-10.3.A resin composition comprising the structure: Wherein X1 and X2 are 3-10 membered rings independently selected from functionalized or unfunctionalized alicyclic groups optionally having one or more heteroatoms; n1 and n2 are each independently 1-10; R is a multivalent hydrocarbyl linker selected from linear or branched alkyls, linear or branched cycloalkyls, alkylenes, cycloalkylenes, bicycloalkylenes, tricycloalkylenes, linear or branched alkylenes, linear or branched cycloalkylenes, linear or branched alkenylenes, arylenes, aralkylenes, arylbicycloalkylenes, aryltricycloalkylenes, bicycloalkylarylenes, tricycloalkylarylenes, bisphenylenes, cycloalkylarylenes, heterocycloalkylene or heterocycloarylenes; the alkyls, cycloalkyls, alkylenes, cycloalkylenes, alkenylenes, arylenes, aralkylenes, arylbicycloalkylenes, aryltricycloalkylenes, bicycloalkylarylenes, tricycloalkylarylenes, bisphenylenes, cycloalkylarylenes, heterocycloalkylene and heterocycloarylenes can optionally contain O or S or hydroxyl group; and R is linked to the ring structures X1 and X2 at any position with a proviso that the hydroxyl groups on X1 and X2 rings are adjacent to the maleimidoalkanoyl groups.",
"4.A resin composition comprising the structure: Wherein R is a multivalent hydrocarbyl linker selected from linear or branched alkyls, linear or branched cycloalkyls, alkylenes, cycloalkylenes, bicycloalkylenes, tricycloalkylenes, linear or branched alkylenes, linear or branched cycloalkylenes, linear or branched alkenylenes, arylenes, aralkylenes, arylbicycloalkylenes, aryltricycloalkylenes, bicycloalkylarylenes, tricycloalkylarylenes, bisphenylenes, cycloalkylarylenes, heterocycloalkylene or heterocycloarylenes; the alkyls, cycloalkyls, alkylenes, cycloalkylenes, alkenylenes, arylenes, aralkylenes, arylbicycloalkylenes, aryltricycloalkylenes, bicycloalkylarylenes, tricycloalkylarylenes, bisphenylenes, cycloalkylarylenes, heterocycloalkylene and heterocycloarylenes can optionally contain O or S or hydroxyl group; R1 is a linker group, which can be a carbonyl group; aliphatic or aromatic and may contain one or more ester, ether, hydroxyl or thioether groups; R2 is a substituent on the aromatic ring, which can be H, halogen, alkyl, alkyl ether, thioether group; and X1 is selected from maleimidoalkanoyl or maleimidoaroyl group.",
"5.A resin composition comprising the structure: Wherein R1 is just a bond linking the two aromatic groups; O; carbonyl; or a multivalent hydrocarbyl linker selected from linear or branched alkyls, linear or branched cycloalkyls, alkylenes, cycloalkylenes, bicycloalkylenes, tricycloalkylenes, linear or branched alkylenes, linear or branched cycloalkylenes, linear or branched alkenylenes, arylenes, aralkylenes, arylbicycloalkylenes, aryltricycloalkylenes, bicycloalkylarylenes, tricycloalkylarylenes, bisphenylenes, cycloalkylarylenes, heterocycloalkylene or heterocycloarylenes; the alkyls, cycloalkyls, alkylenes, cycloalkylenes, alkenylenes, arylenes, aralkylenes, arylbicycloalkylenes, aryltricycloalkylenes, bicycloalkylarylenes, tricycloalkylarylenes, bisphenylenes, cycloalkylarylenes, heterocycloalkylene and heterocycloarylenes can optionally contain O or S or hydroxyl group; and R2 is an aliphatic or aromatic linker group which may contain one or more of ester, ether, hydroxyl, thioether or carbonate groups; R3 is a substituent on the aryl group, which may be H, halogen, alkyl, alkyl ether, or thio ether group; and X is a polymerizable functionality selected from maleimidoalkanoyl and maleimidoaroyl groups.",
"6.A resin composition comprising the structure Wherein R is a divalent hydrocarbyl linker selected from linear or branched alkyls, linear or branched cycloalkyls, alkylenes, cycloalkylenes, bicycloalkylenes, tricycloalkylenes, linear or branched alkylenes, linear or branched cycloalkylenes, linear or branched alkenylenes, arylenes, aralkylenes, arylbicycloalkylenes, aryltricycloalkylenes, bicycloalkylarylenes, tricycloalkylarylenes, bisphenylenes, cycloalkylarylenes, heterocycloalkylene or heterocycloarylenes; the alkyls, cycloalkyls, alkylenes, cycloalkylenes, alkenylenes, arylenes, aralkylenes, arylbicycloalkylenes, aryltricycloalkylenes, bicycloalkylarylenes, tricycloalkylarylenes, bisphenylenes, cycloalkylarylenes, heterocycloalkylene and heterocycloarylenes can optionally contain O or S or hydroxyl group; R1 and R2 are each linear or branched aliphatic groups optionally containing heteroatoms; and n is 1-10, and m and n2 are each 1-100.7.A curable One Drop Fill (ODF) sealant composition comprising the resin structure of claim 1 and a material selected from the group consisting of free radical initiators, curing agents, fillers and combinations thereof.",
"8.The ODF sealant composition of claim 7 further comprising a material selected from the group consisting of photoinitiators, thixotropic agents, silane coupling agents, diluents, coloring agents, surfactants, preservatives, stabilizers, plasticizers, lubricants, defoamers, leveling agents, tougheners and combinations thereof.",
"9.A curable One Drop Fill (ODF) sealant composition comprising the resin structure of claim 2 and a material selected from the group consisting of free radical initiators, curing agents, fillers and combinations thereof.",
"10.The ODF sealant composition of claim 9 further comprising a material selected form the group consisting of photoinitiators, thixotropic agents, silane coupling agents, diluents, coloring agents, surfactants, preservatives, stabilizers, plasticizers, lubricants, defoamers, leveling agents, tougheners and combinations thereof.",
"11.A curable One Drop Fill (ODF) sealant composition comprising the resin structure of claim 3 and a material selected from the group consisting of free radical initiators, curing agents, fillers and combinations thereof.",
"12.The ODF sealant composition of claim 11 further comprising a material selected form the group consisting of photoinitiators, thixotropic agents, silane coupling agents, diluents, coloring agents, surfactants, preservatives, stabilizers, plasticizers, lubricants, defoamers, tougheners, leveling agents and combinations thereof.",
"13.A curable One Drop Fill (ODF) sealant composition comprising the resin structure of claim 4 and a material selected from the group consisting of free radical initiators, curing agents, fillers and combinations thereof.",
"14.The ODF sealant composition of claim 13 further comprising a material selected form the group consisting of photoinitiators, thixotropic agents, silane coupling agents, diluents, coloring agents, surfactants, preservatives, stabilizers, plasticizers, lubricants, defoamers, tougheners, leveling agents and combinations thereof.",
"15.A curable One Drop Fill (ODF) sealant composition comprising the resin structure of claim 5 and a material selected from the group consisting of free radical initiators, curing agents, fillers and combinations thereof.",
"16.The ODF sealant composition of claim 15 further comprising a material selected form the group consisting of photoinitiators, thixotropic agents, silane coupling agents, diluents, coloring agents, surfactants, preservatives, stabilizers, plasticizers, lubricants, defoamers, tougheners, leveling agents and combinations thereof.",
"17.A curable One Drop Fill (ODF) sealant composition comprising the resin structure of claim 6 and a material selected from the group consisting of free radical initiators, curing agents, fillers and combinations thereof.",
"18.The ODF sealant composition of claim 17 further comprising a material selected form the group consisting of photoinitiators, thixotropic agents, silane coupling agents, diluents, coloring agents, surfactants, preservatives, stabilizers, plasticizers, lubricants, defoamers, tougheners, leveling agents and combinations thereof.",
"19.A method for manufacturing a liquid crystal display having a liquid crystal layer between a first substrate and a second substrate, comprising: (a) applying the curable composition of claim 1 on a sealing region at periphery of a surface of the first substrate; (b) dropping liquid crystal on a central area encircled by the sealing region of the surface of the first substrate; (c) overlaying the second substrate on the first substrate; (d) optionally performing partial curing by UV-irradiating the curable composition, and (e) performing final curing by heating the curable composition.",
"20.A method for manufacturing a liquid crystal display having a liquid crystal layer between a first substrate and a second substrate, comprising: (a) applying the curable composition of claim 2 on a sealing region at periphery of a surface of the first substrate; (b) dropping liquid crystal on a central area encircled by the sealing region of the surface of the first substrate; (c) overlaying the second substrate on the first substrate; (d) optionally performing partial curing by UV-irradiating the curable composition, and (e) performing final curing by heating the curable composition.",
"21.A method for manufacturing a liquid crystal display having a liquid crystal layer between a first substrate and a second substrate, comprising: (a) applying the curable composition of claim 3 on a sealing region at periphery of a surface of the first substrate; (b) dropping liquid crystal on a central area encircled by the sealing region of the surface of the first substrate; (c) overlaying the second substrate on the first substrate; (d) optionally performing partial curing by UV-irradiating the curable composition, and (e) performing final curing by heating the curable composition.",
"22.A method for manufacturing a liquid crystal display having a liquid crystal layer between a first substrate and a second substrate, comprising: (a) applying the curable composition of claim 4 on a sealing region at periphery of a surface of the first substrate; (b) dropping liquid crystal on a central area encircled by the sealing region of the surface of the first substrate; (c) overlaying the second substrate on the first substrate; (d) Optionally performing partial curing by UV-irradiating the curable composition, and (e) performing final curing by heating the curable composition.",
"23.A method for manufacturing a liquid crystal display having a liquid crystal layer between a first substrate and a second substrate, comprising: (a) applying the curable composition of claim 5 on a sealing region at periphery of a surface of the first substrate; (b) dropping liquid crystal on a central area encircled by the sealing region of the surface of the first substrate; (c) overlaying the second substrate on the first substrate; (d) optionally performing partial curing by UV-irradiating the curable composition, and (e) performing final curing by heating the curable composition.",
"24.A method for manufacturing a liquid crystal display having a liquid crystal layer between a first substrate and a second substrate, comprising: (a) applying the curable composition of claim 6 on a sealing region at periphery of a surface of the first substrate; (b) dropping liquid crystal on a central area encircled by the sealing region of the surface of the first substrate; (c) overlaying the second substrate on the first substrate; (d) optionally performing partial curing by UV-irradiating the curable composition, and (e) performing final curing by heating the curable composition"
],
[
"<SOH> BACKGROUND <EOH>"
],
[
"<SOH> SUMMARY <EOH>The present invention relates to unique resins and ODF compositions made therefrom.",
"In one aspect of the invention there is provided a resin comprising the structure I:"
],
[
"BACKGROUND Field The present invention relates to monomers and oligomers useful as sealants and particularly as one drop fill sealants for liquid crystal applications.",
"In particular, the present invention permits assembly of LCD panels without migration of the sealant resin into the liquid crystal or vice versa during LCD assembly and/or curing of the resin.",
"Brief Description of Related Technology The one drop fill (“ODF”) process is becoming the mainstream process in the assembly of LCD panels in display applications, replacing the conventional vacuum injection technology to meet faster manufacturing process demands.",
"In the ODF process, first, a sealant is dispensed on an electrode-equipped substrate to form a frame of a display element, and liquid crystals are dropped inside the depicted frame.",
"In the next step of the assembly, another electrode equipped substrate is joined thereto under vacuum.",
"Then, the sealant undergoes a curing process, either by a combination of UV and thermal or by thermal only process.",
"The ODF method has a few problems in that the sealant material in the uncured state comes into contact with the liquid crystal during the assembly process.",
"This could cause reduction in electro-optical properties of the liquid crystal by resin migration into the liquid crystal or vice versa, or because of ionic impurities that may be present.",
"Hence, design of resin systems for sealant material that show good liquid crystal resistance (less contamination) along with good adhesion and moisture barrier properties has remained a challenge.",
"SUMMARY The present invention relates to unique resins and ODF compositions made therefrom.",
"In one aspect of the invention there is provided a resin comprising the structure I: Wherein R is a multivalent hydrocarbyl linker selected from linear or branched alkyls, linear or branched cycloalkyls, alkylenes, cycloalkylenes, bicycloalkylenes, tricycloalkylenes, linear or branched alkylenes, linear or branched cycloalkylenes, linear or branched alkenylenes, arylenes, aralkylenes, arylbicycloalkylenes, aryltricycloalkylenes, bicycloalkylarylenes, tricycloalkylarylenes, bisphenylenes, cycloalkylarylenes, heterocycloalkylene or heterocycloarylenes; the alkyls, cycloalkyls, alkylenes, cycloalkylenes, alkenylenes, arylenes, aralkylenes, arylbicycloalkylenes, aryltricycloalkylenes, bicycloalkylarylenes, tricycloalkylarylenes, bisphenylenes, cycloalkylarylenes, heterocycloalkylene and heterocycloarylenes can optionally contain O or S or hydroxyl group; n and n1 are each independently 1-10.In another aspect of the invention there is included a resin having the structure II: Wherein R is a multivalent hydrocarbyl linker selected from linear or branched alkyls, linear or branched cycloalkyls, alkylenes, cycloalkylenes, bicycloalkylenes, tricycloalkylenes, linear or branched alkylenes, linear or branched cycloalkylenes, linear or branched alkenylenes, arylenes, aralkylenes, arylbicycloalkylenes, aryltricycloalkylenes, bicycloalkylarylenes, tricycloalkylarylenes, bisphenylenes, cycloalkylarylenes, heterocycloalkylene or heterocycloarylenes; the alkyls, cycloalkyls, alkylenes, cycloalkylenes, alkenylenes, arylenes, aralkylenes, arylbicycloalkylenes, aryltricycloalkylenes, bicycloalkylarylenes, tricycloalkylarylenes, bisphenylenes, cycloalkylarylenes, heterocycloalkylene and heterocycloarylenes can optionally contain O or S or hydroxyl group; and n1, n2, n3, and n4 are each independently 1-10.In yet another aspect of the invention there is included a resin having the structure III: Wherein X1 and X2 are 3-10 membered rings independently selected from functionalized or unfunctionalized alicycyclic groups optionally having one or more heteroatoms; n1 and n2 are each independently 1-10; wherein R is a multivalent hydrocarbyl linker selected from linear or branched alkyls, linear or branched cycloalkyls, alkylenes, cycloalkylenes, bicycloalkylenes, tricycloalkylenes, linear or branched alkylenes, linear or branched cycloalkylenes, linear or branched alkenylenes, arylenes, aralkylenes, arylbicycloalkylenes, aryltricycloalkylenes, bicycloalkylarylenes, ticycloalkylarylenes, bisphenylenes, cycloalkylarylenes, heterocycloalkylene or heterocycloarylenes; the alkyls, cycloalkyls, alkylenes, cycloalkylenes, alkenylenes, arylenes, aralkylenes, arylbicycloalkylenes, aryltricycloalkylenes, bicycloalkylarylenes, tricycloalkylarylenes, bisphenylenes, cycloalkylarylenes, heterocycloalkylene and heterocycloarylenes can optionally contain O or S or hydroxyl group; and R is linked to the ring structures X1 and X2 at any position with a proviso that the hydroxyl groups on X1 and X2 rings are adjacent to the maleimidoalkanoyl groups.",
"In still another aspect of the invention there is included a resin having the structure IV: Wherein R is a multivalent hydrocarbyl linker selected from linear or branched alkyls, linear or branched cycloalkyls, alkylenes, cycloalkylenes, bicycloalkylenes, tricycloalkylenes, linear or branched alkylenes, linear or branched cycloalkylenes, linear or branched alkenylenes, arylenes, aralkylenes, arylbicycloalkylenes, aryltricycloalkylenes, bicycloalkylarylenes, tricycloalkylarylenes, bisphenylenes, cycloalkylarylenes, heterocycloalkylene or heterocycloarylenes; the alkyls, cycloalkyls, alkylenes, cycloalkylenes, alkenylenes, arylenes, aralkylenes, arylbicycloalkylenes, aryltricycloalkylenes, bicycloalkylarylenes, tricycloalkylarylenes, bisphenylenes, cycloalkylarylenes, heterocycloalkylene and heterocycloarylenes can optionally contain O or S or hydroxyl group; R1 can be a carbonyl group; an aliphatic or aromatic linker and may contain one or more of ester, ether, hydroxyl or thioether groups; R2 is a substituent on the aromatic ring, which can be H, halogen, alkyl, alkyl ether, thioether group; and X1 is selected from maleimidoalkanoyl or maleimidoaroyl group.",
"In another aspect of the invention there is included a resin having the structure V: Wherein R1 can be just a bond linking the two aromatic groups; O; carbonyl; or a multivalent hydrocarbyl linker selected from linear or branched alkyls, linear or branched cycloalkyls, alkylenes, cycloalkylenes, bicycloalkylenes, tricycloalkylenes, linear or branched alkylenes, linear or branched cycloalkylenes, linear or branched alkenylenes, arylenes, aralkylenes, arylbicycloalkylenes, aryltricycloalkylenes, bicycloalkylarylenes, tricycloalkylarylenes, bisphenylenes, cycloalkylarylenes, heterocycloalkylene or heterocycloarylenes; the alkyls, cycloalkyls, alkylenes, cycloalkylenes, alkenylenes, arylenes, aralkylenes, arylbicycloalkylenes, aryltricycloalkylenes, bicycloalkylarylenes, tricycloalkylarylenes, bisphenylenes, cycloalkylarylenes, heterocycloalkylene and heterocycloarylenes can optionally contain O or S or hydroxyl group; and R2 is an aliphatic or aromatic linker group which may contain one or more of ester, ether, hydroxyl, thioether or carbonate groups; R3 is a substituent on the aryl group, which may be H, halogen, alkyl, alkyl ether, or thio ether group; and X is a polymerizable functionality selected from maleimidoalkanoyl and maleimidoaroyl groups.",
"In another aspect of the invention there is included a resin having the structure VI: Wherein R is a divalent hydrocarbyl linker selected from linear or branched alkyls, linear or branched cycloalkyls, alkylenes, cycloalkylenes, bicycloalkylenes, tricycloalkylenes, linear or branched alkylenes, linear or branched cycloalkylenes, linear or branched alkenylenes, arylenes, aralkylenes, arylbicycloalkylenes, aryltricycloalkylenes, bicycloalkylarylenes, tricycloalkylarylenes, bisphenylenes, cycloalkylarylenes, heterocycloalkylene or heterocycloarylenes; the alkyls, cycloalkyls, alkylenes, cycloalkylenes, alkenylenes, arylenes, aralkylenes, arylbicycloalkylenes, aryltricycloalkylenes, bicycloalkylarylenes, tricycloalkylarylenes, bisphenylenes, cycloalkylarylenes, heterocycloalkylene and heterocycloarylenes can optionally contain O or S or hydroxyl group; R1 and R2 are linear or branched aliphatic groups optionally containing heteroatoms; n is 1-10, and n1 and n2 are each 1-100.DETAILED DESCRIPTION The polymers of the present invention are useful in a wide variety of applications including sealing, adhesion and coating.",
"One particularly desirable use is as an ODF sealant for assembling LCD panels.",
"The present invention includes a number of novel materials including resins, oligomers and polymers useful for preparing curable compositions which may be used for ODF sealants.",
"The present invention also includes novel compositions made from the disclosed resins.",
"For purposes of this invention, the term “resins” will include the aforementioned the novel materials, i.e.",
"resins, oligomers and polymers.",
"One aspect of the invention includes a curing resin composition for use as an ODF sealant, which includes resins represented by the general structural formulae shown above.",
"The glycidyl ether/ester compounds useful in synthesizing the inventive hybrid resins described herein is not particularly limited, and examples of the epoxy compounds available in the market include: bisphenol A type epoxy resins such as Epikote 828EL and Epikote 1004 (all manufactured by Japan Epoxy Resin Co., Ltd.); bisphenol F type epoxy resins such as Epikote 806 and Epikote 4004 (all manufactured by Japan Epoxy Resin Co., Ltd.); bisphenol S type epoxy resins such as Epiclon EXA1514 (manufactured by Dainippon Ink and Chemicals Inc.) and SE 650 manufactured by Shin A T&C; 2,2′-diallyl bisphenol A type epoxy resins such as RE-81 ONM (manufactured by Nippon Kayaku Co., Ltd.); hydrogenated bisphenol type epoxy resins such as Epiclon EXA7015 (manufactured by Dainippon Ink and Chemicals Inc.); propyleneoxide-added bisphenol A type epoxy resins such as EP-4000S (manufactured by ADEKA Corporation); resorcinol type epoxy resins such as EX-201 (manufactured by Nagase ChemteX Corporation); biphenyl type epoxy resins such as Epikote YX-4000H (manufactured by Japan Epoxy Resin Co., Ltd.); sulfide type epoxy resins such as YSLV 50TE (manufactured by Tohto Kasei Co., Ltd.); ether type epoxy resins such as YSLV 80DE (manufactured by Tohto Kasei Co., Ltd.); dicyclopentadiene type epoxy resins such as EP-4088S and EP4088L (manufactured by ADEKA Corporation); naphthalene type epoxy resins such as SE-80, SE-90, manufactured by Shin A T&C; glycidyl amine type epoxy resins such as Epikote 630 (manufactured by Japan Epoxy Resin Co., Ltd.), Epiclon 430 (manufactured by Dainippon Ink and Chemicals Inc.) and TETRAD-X (manufactured by Mitsubishi Gas Chemical Company Inc.); alkylpolyol type epoxy resins such as ZX-1542 (manufactured by Tohto Kasei Co., Ltd.), Epiclon 726 (manufactured by Dainippon Ink and Chemicals Inc.), Epolight 8OMFA (manufactured by Kyoeisha Chemical Co., Ltd.) and Denacol EX-611 (manufactured by Nagase ChemteX Corporation); rubber modified type epoxy resins such as YR-450, YR-207 (all manufactured by Tohto Kasei Co., Ltd.) and Epolead PB (manufactured by Daicel Chemical Industries, Ltd.); glycidyl ester compounds such as Denacol EX-147 (manufactured by Nagase ChemteX Corporation); bisphenol A type episulfide resins such as Epikote YL-7000 (manufactured by Japan Epoxy Resin Co., Ltd.); and others such as YDC-1312, YSLV-BOXY, YSLV-90CR (all manufactured by Tohto Kasei Co., Ltd.), XAC4151 (manufactured by Asahi Kasei Corporation), Epikote 1031, Epikote 1032 (all manufactured by Japan Epoxy Resin Co., Ltd.), EXA-7120 (manufactured by Dainippon Ink and Chemicals Inc.), TEPIC (manufactured by Nissan Chemical Industries, Ltd.).",
"Examples of the commercially available phenol novolak type epoxy compound include Epiclon N-740, N-770, N-775 (all manufactured by Dainippon Ink and Chemicals Inc.), Epikote 152, Epikote 154 (all manufactured by Japan Epoxy Resin Co., Ltd.), and the like.",
"Examples of the commercially available cresol novolak type epoxy compound include Epiclon N-660, N-665, N-670, N-673, N-680, N-695, N-665-EXP and N-672-EXP (all manufactured by Dainippon Ink and Chemicals Inc.); an example of the commercially available biphenyl novolak type epoxy compound is NC-3000P (manufactured by Nippon Kayaku Co., Ltd.); examples of the commercially available trisphenol novolak type epoxy compound include EP1032S50 and EP1032H60 (all manufactured by Japan Epoxy Resin Co., Ltd.); examples of the commercially available dicyclopentadiene novolak type epoxy compound include XD-1000-L (manufactured by Nippon Kayaku Co., Ltd.) and HP-7200 (manufactured by Dainippon Ink and Chemicals Inc.); examples of the commercially available bisphenol A type epoxy compound include Epikote 828, Epikote 834, Epikote 1001, Epikote 1004 (all manufactured by Japan Epoxy Resin Co., Ltd.), Epiclon 850, Epiclon 860 and Epiclon 4055 (all manufactured by Dainippon Ink and Chemicals Inc.); examples of the commercially available bisphenol F type epoxy compound include Epikote 807 (manufactured by Japan Epoxy Resin Co., Ltd.) and Epiclon 830 (manufactured by Dainippon Ink and Chemicals Inc.); an example of the commercially available 2,2′-diallyl bisphenol A type epoxy compound is RE-81ONM (manufactured by Nippon Kayaku Co., Ltd.); an example of the commercially available hydrogenated bisphenol type epoxy compound is ST-5080 (manufactured by Tohto Kasei Co., Ltd.); examples of the commercially available polyoxypropylene bisphenol A type epoxy compound include EP-4000 and EP-4005 (all manufactured by ADEKA Corporation); and the like.",
"11P4032 and Epiclon EXA-4700 (all manufactured by Dainippon Ink and Chemicals Inc.); phenol novolak type epoxy resins such as Epiclon N-770 (manufactured by Dainippon Ink and Chemicals Inc.); orthocresol novolak type epoxy resins such as Epiclon N-670-EXP-S (manufactured by Dainippon Ink and Chemicals Inc.); dicyclopentadiene novolak type epoxy resins such as Epiclon HP7200 (manufactured by Dainippon Ink and Chemicals Inc.); biphenyl novolak type epoxy resins such as NC-3000P (manufactured by Nippon Kayaku Co., Ltd.); naphthalene phenol novolak type epoxy resins such as ESN-165S (manufactured by Tohto Kasei Co., Ltd.).",
"Examples of the alicyclic epoxy compounds useful in synthesizing the inventive resins include, without limitation, polyglycidyl ethers of polyhydric alcohols having at least one alicyclic ring and cyclohexene oxide- or cyclopentene oxide containing compounds obtained by epoxidizing cyclohexene ring or cyclopentene ring-containing compounds.",
"Specific examples include hydrogenated bisphenol A diglycidyl ether, 3,4-epoxycyclohexylmethyl 3,4-epoxycyclohexanecarboxylate, 3,4-epoxy-1-methyl cyclohexyl-3,4-epoxy-1-methylcyclohexanecarboxylate, 6-methyl-3,4-epoxycyclohexylmethyl-6-methyl-3,4-epoxycyclohexanecarboxylate, 3,4-epoxy-3-methylcyclohexylmethyl 3,4-epoxy-3-methylcyclohexanecarboxylate, 3,4-epoxy-5-methylcylcohexylmethyl-3,4-epoxy-5-methylcyclohexanecarboxylate, 2-(3,4-epoxycyclohexyl-5,5-spiro-3,4-epoxy)cyclohexane-metadioxane, bis(3,4-epoxycyclohexylmethyl)adipate, 3,4-epoxy-6-methylcyclohexyl carboxylate, methylenebis(3,4-epoxycyclohexane), dicyclopentadiene diepoxide, ethylenebis(3,4-epoxycyclohexanecarboxylate), dioctylepoxyhexahydrophthalate, and di-2-ethylhexyl epoxyhexahydrophthalate.",
"Some of the above-mentioned alicyclic epoxy resins are Commercially available in the following products: UVR-6100, UVR-6105, UVR-6110, UVR-6128, and UVR-6200 (products of Union Carbide Corporation); CELLOXIDE 2021, CELLOXIDE 2021P, CELLOXIDE 2081, CELLOXIDE 2083, CELLOXIDE 2085, CELLOXIDE 2000, CELLOXIDE 3000, CYCLMER A200, CYCLMER M100, CYCLMER M101, EPOLEAD GT-301, EPOLEAD GT-302, EPOLEAD 401, EPOLEAD 403, ETHB, and EPOLEADHD 300 (products of Daicel Chemical Industries, Ltd.); KRM-2110, and KRM-2199 (products of ADEKA Corporation).",
"In addition to the curable polymers of the present invention, ODF sealant compositions may also include a free radical initiator (thermal or UV generated) and a curing agent.",
"Curing of the ODF compositions may be by thermal or UV mechanisms or both.",
"In embodiments where an epoxide ring is present, a latent epoxy curing agent may also be employed.",
"Useful thermal free radical initiators include, for example, organic peroxides and azo compounds that are known in the art.",
"Examples include: azo free radical initiators such as AIBN (azodiisobutyronitrile), 2,2′-Azobis(4-methoxy-2,4-dimethyl valeronitrile), 2,2′-Azobis(2,4-dimethyl valeronitrile), Dimethyl 2,2′-azobis(2-ethylpropionate), 2,2′-Azobis(2-methylbutyronitrile), 1,11-Azobis(cyclohexane-1-carbonitrile), 2,2′-Azobis[N-(2-propenyl)-2-methylpropionamide]; dialkyl peroxide free radical initiators such as 1,1-di-(butylperoxy-3,3,5-trimethyl cyclohexane); alkyl perester free radical initiators such as TBPEH (t-butyl per-2-ethylhexanoate); diacyl peroxide free radical initiators such as benzoyl peroxide; peroxy dicarbonate radical initiators such as ethyl hexyl percarbonate; ketone peroxide initiators such as methyl ethyl ketone peroxide, bis(t-butyl peroxide) diisopropylbenzene, t-butylperbenzoate, t-butyl peroxy neodecanoate, and combinations thereof.",
"Further examples of organic peroxide free radical initiators include: Dilauroyl peroxide, 2,2-Di(4,4-di(tert-butylperoxy)cyclohexyl)propane, Di(tert-butylperoxyisopropyl) benzene, Di(4-tert-butylcyclohexyl) peroxydicarbonate, Dicetyl peroxydicarbonate, Dimyristyl peroxydicarbonate, 2,3-Dimethyl-2,3-diphenylbutane, Dicumyl peroxide, Dibenzoyl peroxide, Diisopropyl peroxydicarbonate, tert-Butyl monoperoxymaleate, 2,5-Dimethyl-2,5-di(tert-butylperoxy)hexane, tert-Butylperoxy 2-ethylhexyl carbonate, tert-Amyl peroxy-2-ethylhexanoate, tert-Amyl peroxypivalate, tert-Amylperoxy 2-ethylhexyl carbonate, 2,5-Dimethyl-2,5-di(2-ethylhexanoylperoxy) hexane 2,5-Dimethyl-2,5-di(tert-butylperoxy) hexpe-3, Di(3-methoxybutyl)peroxydicarbonate, Diisobutyryl peroxide, tert-Butyl peroxy-2-ethylhexanoate (Trigonox 21 S), 1,1-Di(tert-butylperoxy)cyclohexane, tert-Butyl peroxyneodecanoate, tert-Butyl peroxypivalate, tert-Butyl peroxyneoheptanoate, tert-Butyl peroxydiethylacetate, 1,1-Di(tert-butylperoxy)-3,3,5-trimethylcyclohexane, 3,6,9-Triethyl-3,6,9-trimethyl-1,4,7-triperoxonane, Di(3,5,5-trimethylhexanoyl) peroxide, tert-Butyl peroxy-3,5,5-trimethyl hexanoate, 1,1,3,3-Tetramethylbutyl peroxy-2-ethylhexanoate, 1,1,3,3-tetramethylbutyl peroxyneodecanoate, tert-Butyl peroxy-3,5,5-trimethyl hexanoate, Cumyl peroxyneodecanoate, Di-tert-butyl peroxide, tert-Butylperoxy isopropyl carbonate, tert-Butyl peroxybenzoate, Di(2-ethylhexyl) peroxydicarbonate, tert-Butyl peroxyacetate, Isopropylcumyl hydroperoxide, and tert-Butyl cumyl peroxide.",
"Normally the thermal free radical initiator with higher decomposition rate is preferred, as this can generate free radicals more easily at common cure temperature (80-130° C.) and give faster cure speed, which can reduce the contact time between liquid resin and liquid crystal, and reduce the liquid crystal contamination.",
"On the other hand, if the decomposition rate of initiator is too high, the viscosity stability at room temperature will be influenced, thereby reducing the work life of the sealant.",
"A convenient way of expressing the decomposition rate of an initiator at a specified temperature is in terms of its half-life i.e., the time required to decompose one-half of the peroxide originally present.",
"To compare reactivity of different initiators, the temperature at which each initiator has a half-life (T½) of 10 hours is used.",
"The most reactive (fastest) initiator would be the one with the lowest 10 h T½ temperature.",
"In the present invention, the thermal free radical initiator with 10 h T½ temperature of 30-80° C. is preferred, and with 10 h T½ temperature of 40-70° C. is more preferred.",
"To balance the reactivity and viscosity stability of the composition, the thermal free radical initiator used in the resin composition is in an amount of usually 0.01 to 3 parts by weight, and preferably 0.5 to 2 parts by weight, based on 100 parts by weight of the inventiveresin in the curable composition of the present invention.",
"Useful UV free radical initiators include Norrish type I cleavage photoinitiators that are commercially available from CIBA and BASF.",
"These photoinitiators are used in the amount 0.1-5 wt %, more preferably in about 0.2 to 3 wt % in the formulation.",
"Examples of useful epoxy curing agent include but are not limited to the Ajicure series of hardeners available from Ajinomoto Fine-Techno Co., Inc.; the Amicure series of curing agents available from Air products and the JERCURE™ products available from Mitsubushi Chemical.",
"These curing agents or hardeners or hardeners are used in the amount of about 1% to about 50% by weight of the total composition, more preferably from about 5% to about 20% by weight of the total composition.",
"The curable composition may optionally contain, as desired, a further component capable of a photopolymerization reaction such as a vinyl ether compound.",
"In addition, the curable composition may further comprise additives, resin components and the like to improve or modify properties such as flowability, dispensing or printing property, storage property, curing property and physical property after curing.",
"Various additives may be contained in the composition as desired, for example, organic or inorganic fillers, thixotropic agents, silane coupling agents, diluents, modifiers, coloring agents such as pigments and dyes, surfactants, preservatives, stabilizers, plasticizers, lubricants, defoamers, leveling agents and the like; however it is not limited to these.",
"In particular, the composition preferably comprises an additive selected from the group consisting of organic or inorganic filler, a thixotropic agent, and a silane coupling agent.",
"These additives may be present in amounts of about 0.1% to about 50%, more preferably from about 2% to about 10% by weight of the total composition.",
"The filler may include, but is not limited to, inorganic fillers such as silica, diatomaceous earth, alumina, zinc oxide, iron oxide, magnesium oxide, tin oxide, titanium oxide, magnesium hydroxide, aluminium hydroxide, magnesium carbonate, barium sulphate, gypsum, calcium silicate, talc, glass bead, sericite activated white earth, bentonite, aluminum nitride, silicon nitride, and the like; meanwhile, organic fillers such as poly(methyl) methacrylate, poly(ethyl) methacrylate, poly(propyl) methacrylate, poly(butyl) methacrylate, butylacrylate-methacrylic acid-(methyl) methacrylate copolymer, polyacrylonitrile, polystyrene, polybutadiene, polypentadiene, polyisoprene, polyisopropylene, and the like.",
"These may be used alone or in combination.",
"These fillers may be present in amounts of about 1% to about 80%, more preferably from about 5% to about 30% by weight of the total composition.",
"The thixotropic agent may include, but is not limited to, talc, fume silica, superfine surface-treated calcium carbonate, fine particle alumina, plate-like alumina; layered compounds such as montmorillonite, spicular compounds such as aluminium borate whisker, and the like.",
"Among them, talc, fume silica and fine alumina are particularly desired.",
"These agents may be present ion amounts of about These agents may be present in amounts of about 1% to about 50%, more preferably from 1% to about 30% by weight of the total composition.",
"The silane coupling agent may include, but is not limited to, γ-minopropyltriethoxysilane, γ-mercaptopropyltrimethoxysilane, γ-methacryloxypropyltrimethoxysilane, γ-glycidoxyp-ropyltrimethoxylsilane, and the like.",
"The curable composition according to the present invention may be obtained by mixing the aforementioned each component by means of, for example, a mixer such as a stirrer having stirring blades and a three roll mill.",
"The composition is liquid at ambient with the viscosity of 200-400 Pa·s (at 25° C.) at 1.5s-1 shear rate, which allows its easy dispensing property.",
"Also provided is a method for manufacturing a liquid crystal display having a liquid crystal layer between a first substrate and a second substrate, by means of a liquid crystal one-drop-filling process.",
"The method comprises the steps of (a) applying the curable composition described in the present invention on a sealing region at periphery of a surface of the first substrate; (b) dropping liquid crystal on a central area encircled by the sealing region of the surface of the first substrate; (c) overlaying the second substrate on the first substrate; (d) optionally performing partial curing by UV-irradiating the curable composition, and (e) performing final curing by heating the curable composition.",
"The first substrate and the second substrate used in the present invention are usually transparent glass substrates.",
"Generally, transparent electrodes, active matrix elements (such as TFT), alignment film(s), a color filter and the like are formed on at least one of the opposed faces of the two substrates.",
"These constitutions may be modified according to the type of the LCD.",
"The manufacturing method according to the present invention may be thought to be applied for any type of the LCD.",
"In step (a), the curable composition is applied on the periphery portion of the surface of the first substrate so as to lap around the substrate circumference in a frame shape.",
"The portion where the curable composition is applied in a frame shape is referred as a seal region.",
"The curable composition can be applied by a known method such as screen printing and dispensing.",
"In step (b), the liquid crystal is then dropped onto the center region surrounded by the seal region in the frame shape on the surface of the first substrate.",
"This step is preferably conducted under reduced pressure.",
"In step (c), said second substrate is then placed over said first substrate, and UV-irradiated in the step (d).",
"By the UV-irradiation, the curable composition cures partially and shows the strength at a level that displacement does not occur by handling, whereby the two substrates are temporally fixed.",
"Generally, the radiation time is preferably short, for example not longer than 5 minutes, preferably not longer than 3 minutes, more preferably not longer than 1 minute.",
"In step (e), heating the curable composition allows it to achieve the final curing strength, whereby the two substrates are finally bonded.",
"The thermal curing in the step (e) is generally heated at a temperature of 80 to 130° C., and preferably of 100 to 120° C., with the heating time of 30 mins to 3 hours, typically 1 hour.",
"By this process, the major part of the LCD panel is completed.",
"Performance Data for ODF Formulations Table I below shows inventive ODF formulations 2-4 and control formulation 1 containing commercially available Uvacure 1561, which is partially acrylated BPA diglycidyl ether.",
"Irgacure 651 is a commercially available photoinitiator; A-187 is an adhesion promoter; EH-4357S is an epoxy hardener; SO-E2 is a silica filler.",
"Several inventive formulations showed similar VHR moisture barrier values (Mocon) and improved corner strength as compared to the control formulation.",
"Formulations Materials 1 2 3 4 Uvacure 1561 66 60 60 60 Resin 1 6 Resin 2 6 Resin 3 6 Irgacure 651 0.6 0.6 0.6 0.6 A-187 1 1 1 1 SO-E2 15.95 15.95 15.95 15.95 EH-4357S 16.45 16.45 16.45 16.45 Total 100.00 100.00 100.00 100.00 VHR, LC25 (5 V, 6 Hz) 95.98 95.11 95.17 94.65 Mocon g · mil/(100 in 2 · day), 8.29 9.71 9.46 9.61 50° C./100 RH Corner Strength, N/mm, ITO to 8.34 11.67 10.44 12.08 ITO glass Corner Strength after PCT(121° 7.19 7.67 9.86 11.70 C., 100% RH, 2 atm, 24 h), N/mm"
]
] |
Patent_15871056
|
[
[
"Utilizing vehicle window shading to improve quality of augmented reality video",
"A light shading module is integrated with a vehicle window and is configured to be in different states that involve different values of Visible Light Transmittance (VLT) of the vehicle window.",
"A camera fixed to the vehicle takes video of the outside environment.",
"A computer generates a video see-through (VST) of the outside environment, which is presented to the vehicle's occupant on an augmented reality device (ARD).",
"In order to improve the image quality, the ARD operates according to different modes involving varying intensities, depending on the VLT of the window."
],
[
"1.A system comprising: a light shading module integrated with a vehicle window; the light shading module is configured to be in at least first and second states, wherein the Visible Light Transmittance (VLT) of the vehicle window in the first state is higher than the VLT in the second state; a camera, fixed to the vehicle, configured to take video of the outside environment; a computer configured to generate a video see-through (VST) based on the video; and a head-mounted display (HMD) configured to operate according to a first mode of operation when an occupant inside the vehicle looks at the direction of the vehicle window and the light shading module is in the first state, and to operate according to a second mode of operation when the occupant looks at the direction of the vehicle window and the light shading module is in the second state; wherein the total intensity of the VST light, emitted by the HMD and reaching the occupant's eyes, is higher in the second mode than in the first mode.",
"2.The system of claim 1, wherein the vehicle is an autonomous vehicle, and the light shading module covers more than half of the front windshield in the second state.",
"3.The system of claim 1, wherein in the first state the VLT is above 10% of ambient light entering through the window, in the second state the VLT is below 50% of ambient light entering through the window, and the VLT in the first state is higher than the VLT in the second state.",
"4.The system of claim 1, wherein in the first state the VLT is above 70% of ambient light entering through the window, in the second state the VLT is below 30% of ambient light entering through the window, and the VLT in the first state is higher than the VLT in the second state.",
"5.The system of claim 1, wherein the HMD comprises an optical see-through component and a display component; in the first mode the intensity of light that reaches the occupant's eyes via the optical see-through component is higher than the intensity of light from the VST that is emitted by the display component and reaches the occupant's eyes; and in the second mode, the intensity of light from the environment that reaches the occupant's eyes via the optical see-through component is lower than the intensity of light from the VST that is emitted by the display component and reaches the occupant's eyes.",
"6.The system of claim 5, wherein the perceived contrast of the optical see-through component is better when the light shading module is in the second state compared to when the light shading module is in the first state.",
"7.The system of claim 1, wherein the computer is further configured not to generate the VST when the HMD operates in the first mode.",
"8.The system of claim 1, wherein the light shading module is a movable physical element configured to reduce the intensity of the ambient light entering into the vehicle compartment through the vehicle window.",
"9.The system of claim 8, wherein the light shading module is unfurled from the inside of the compartment in order to block at least 50% of the ambient light intensity.",
"10.The system of claim 8, wherein the light shading module is unfurled from the outside of the compartment in order to block at least 50% of the ambient light intensity.",
"11.The system of claim 1, wherein the light shading module is a curtain.",
"12.The system of claim 1, wherein the vehicle window is made of a material able to change its transparency properties.",
"13.The system of claim 1, wherein the VST represents the outside environment from a point of view of the occupant while looking at the outside environment through at least a portion of the vehicle window.",
"14.The system of claim 1, further comprising an occupant tracking module configured to calculate the point of view of the occupant based on measurements of a sensor.",
"15.The system of claim 14, wherein the computer is further configured to render the VST based on data received from the occupant tracking module.",
"16.The system of claim 15, wherein the HMD comprises an optical see-through component and a display component, and the display component is a three dimensional (3D) display configured to show the occupant the VST, such that point of gaze of the occupant, while looking via the 3D display, is most of the time beyond the location of the light shading module.",
"17.The system of claim 15, wherein the HMD is an augmented reality device."
],
[
"<SOH> BACKGROUND <EOH>It has become more and more common for vehicle occupants to engage in various work- or entertainment-related activities.",
"The activities typically involve various forms of displays which the occupants view instead of looking out of the vehicle, and can offer a productive or entertaining way to pass the time spent traveling.",
"The quality of the viewing experience can be influenced by the amount of ambient light that penetrates the vehicle.",
"US patent application num.",
"20150261219 describes an autonomous mode controller configured to control the operation of shaded vehicle windows.",
"However, the operation is unrelated to watching video.",
"Thus, there is a need to be able to control ambient light levels in a vehicle in a way related to consumption of video content while in the vehicle."
],
[
"<SOH> SUMMARY <EOH>Some aspects of this disclosure involve a system that utilizes window shading of a vehicle window in order to improve the quality of video viewed by an occupant of the vehicle who wears a head-mounted display (HMD).",
"In one embodiment, an autonomous on-road vehicle includes a system configured to enable an HMD to cooperate with a window light shading module.",
"This embodiment involves a light shading module, a camera, a computer, and the HMD.",
"The light shading module is integrated with a vehicle window and is configured to be in at least first and second states.",
"In the first state the Visible Light Transmittance (VLT) of the vehicle window is above 10% of ambient light entering through the window, in the second state the VLT of the vehicle window is below 50% of ambient light entering through the window, and the VLT of the vehicle window in the first state is higher than the VLT of the vehicle window in the second state.",
"The camera is fixed to the vehicle and configured to take video of the outside environment.",
"The computer is configured to generate, based on the video, a video see-through (VST) that represents the outside environment from a point of view of an occupant looking to the outside environment through at least a portion of the vehicle window.",
"The HMD comprises an optical see-through component and a display component; the HMD is configured to operate according to a first mode of operation when the occupant looks at the direction of the vehicle window and the light shading module is in the first state, and to operate according to a second mode of operation when the occupant looks at the direction of the vehicle window and the light shading module is in the second state.",
"Wherein the total intensity of the VST light, emitted by the display component and reaching the occupant's eyes, is higher in the second mode than in the first mode."
],
[
"CROSS-REFERENCE TO RELATED APPLICATIONS This Application is a Continuation of U.S. application Ser.",
"No.",
"15/335,404, filed Oct. 26, 2016, which claims priority to U.S.",
"Provisional Patent Application No.",
"62/246,187, filed on 26 Oct. 2015, and U.S.",
"Provisional Patent Application No.",
"62/369,127, filed on 31 Jul.",
"2016.ACKNOWLEDGMENTS Gil Thieberger would like to thank his holy and beloved teacher, Lama Dvora-hla, for her extraordinary teachings and manifestation of wisdom, love, compassion and morality, and for her endless efforts, support, and skills in guiding him and others on their paths to freedom and ultimate happiness.",
"Gil would also like to thank his beloved parents for raising him exactly as they did.",
"BACKGROUND It has become more and more common for vehicle occupants to engage in various work- or entertainment-related activities.",
"The activities typically involve various forms of displays which the occupants view instead of looking out of the vehicle, and can offer a productive or entertaining way to pass the time spent traveling.",
"The quality of the viewing experience can be influenced by the amount of ambient light that penetrates the vehicle.",
"US patent application num.",
"20150261219 describes an autonomous mode controller configured to control the operation of shaded vehicle windows.",
"However, the operation is unrelated to watching video.",
"Thus, there is a need to be able to control ambient light levels in a vehicle in a way related to consumption of video content while in the vehicle.",
"SUMMARY Some aspects of this disclosure involve a system that utilizes window shading of a vehicle window in order to improve the quality of video viewed by an occupant of the vehicle who wears a head-mounted display (HMD).",
"In one embodiment, an autonomous on-road vehicle includes a system configured to enable an HMD to cooperate with a window light shading module.",
"This embodiment involves a light shading module, a camera, a computer, and the HMD.",
"The light shading module is integrated with a vehicle window and is configured to be in at least first and second states.",
"In the first state the Visible Light Transmittance (VLT) of the vehicle window is above 10% of ambient light entering through the window, in the second state the VLT of the vehicle window is below 50% of ambient light entering through the window, and the VLT of the vehicle window in the first state is higher than the VLT of the vehicle window in the second state.",
"The camera is fixed to the vehicle and configured to take video of the outside environment.",
"The computer is configured to generate, based on the video, a video see-through (VST) that represents the outside environment from a point of view of an occupant looking to the outside environment through at least a portion of the vehicle window.",
"The HMD comprises an optical see-through component and a display component; the HMD is configured to operate according to a first mode of operation when the occupant looks at the direction of the vehicle window and the light shading module is in the first state, and to operate according to a second mode of operation when the occupant looks at the direction of the vehicle window and the light shading module is in the second state.",
"Wherein the total intensity of the VST light, emitted by the display component and reaching the occupant's eyes, is higher in the second mode than in the first mode.",
"BRIEF DESCRIPTION OF THE DRAWINGS The embodiments are herein described by way of example only, with reference to the accompanying drawings.",
"No attempt is made to show structural details of the embodiments in more detail than is necessary for a fundamental understanding of the embodiments.",
"In the drawings: FIG.",
"1 is a schematic illustration of components of a system configured to combine video see-through (VST) with video-unrelated-to-the-VST (VUR); FIG.",
"2 illustrates an HMD tracking module that measures the position of the HMD relative to the compartment; FIG.",
"3 illustrates a vehicle in which an occupant wears an HMD; FIG.",
"4 illustrates an occupant wearing an HMD and viewing large VUR and smaller VST; FIG.",
"5a illustrates how the VST moves to the upper left when the occupant looks to the bottom right; FIG.",
"5b illustrates how the VST moves to the bottom right when the occupant looks to the upper left; FIG.",
"6 illustrates HMD-video that includes both a non-transparent VST and video that shows the hands of the occupant and the interior of the compartment; FIG.",
"7 illustrates HMD-video that includes both a partially transparent VST and video that shows the hands of the occupant and the interior of the compartment; FIG.",
"8 illustrates HMD-video that includes a VST and partially transparent video that shows the hands of the occupant and the interior of the compartment; FIG.",
"9a illustrates HMD-video that includes a VUR in full FOV, a first window comprising compartment-video (CV) and a second smaller window comprising the VST; FIG.",
"9b illustrates HMD-video that includes VUR in full FOV, a first window comprising the CV and a second partially transparent smaller window comprising the VST; FIG.",
"10a illustrates HMD-video that includes VUR in full FOV, a first window comprising VST and a second smaller window comprising zoom out of the CV; FIG.",
"10b illustrates HMD-video that includes VUR and a partially transparent CV; FIG.",
"11a illustrates a FOV of a vehicle occupant when the occupant wears an HMD that presents HMD-video; FIG.",
"11b illustrates a FOV of a vehicle occupant when the vehicle occupant does not wear an HMD that presents the video, such as when watching an autostereoscopic display; FIG.",
"11c illustrates FOV of a 3D camera that is able to capture sharp images from different focal lengths; FIG.",
"12 is a schematic illustration of components of a system configured to enable an HMD to cooperate with a window light shading module; FIG.",
"13a illustrates a first mode for a shading module where an occupant sees the outside environment through the optical see-through component; FIG.",
"13b illustrates a second mode for a shading module where the occupant sees the outside environment through a VST; FIG.",
"14 illustrates a VST over a curtain; FIG.",
"15 illustrates a light shading module that is unfurled on the inside of the compartment; FIG.",
"16 illustrates a light shading module that is unfurled on the outside of the compartment; FIG.",
"17 is a schematic illustration of components of a video system that may be used to increase awareness of an occupant of a vehicle regarding an imminent SDRS; FIG.",
"18a illustrates presenting VUR to an occupant when there is no indication that an SDRS event is imminent; FIG.",
"18b illustrates presenting VST responsive to receiving an indication that an SDRS event is imminent (a pothole); FIG.",
"18c illustrates presenting VST responsive to receiving an indication that an SDRS event is imminent (a sharp turn); FIG.",
"19a illustrates presenting VUR and VST when there is no indication that an SDRS event is imminent; FIG.",
"19b illustrates presenting a larger VST responsive to receiving an indication that an SDRS event is imminent (a road bump); FIG.",
"19c illustrates presenting a partially transparent VST responsive to receiving an indication that an SDRS event is imminent; FIG.",
"20a illustrates a smart glass shading module when there is no indication that an SDRS event is imminent; FIG.",
"20b illustrates the smart glass shading module when there is an indication that an SDRS event is imminent; FIG.",
"21a and FIG.",
"21b illustrate vehicles with an SAEDP in their compartment were an occupant uses an HMD to receive a representation of the outside environment; FIG.",
"22 illustrates a vehicle with an SAEDP in the vehicle's compartment with displays; FIG.",
"23 illustrates how an SAEDP protects the occupant in a side collision; FIG.",
"24a and FIG.",
"24b illustrate a vehicle with a motor configured to move a nontransparent SAEDP to cover a side window; FIG.",
"25a and FIG.",
"25b illustrate a vehicle with a motor configured to move a front SAEDP between first and second states; FIG.",
"26a illustrates an SAEDP mounted to the front of a vehicle at eye level of an occupant of the vehicle; FIG.",
"26b illustrates an outer SAEDP that includes two air bags; FIG.",
"27a and FIG.",
"27b illustrate a motorized external SAEDP that can move between first and second states multiple times; FIG.",
"28 illustrates a vehicle compartment in which an occupant may lay down; FIG.",
"29 illustrates a vehicle with a front mirror; FIG.",
"30a illustrates one example of a configuration of a plurality of beams located in the left side of the vehicle; FIG.",
"30b illustrates one example of a configuration of a plurality of beams located in the front of the vehicle; and FIG.",
"31a and FIG.",
"31b are schematic illustrations of computers able to realize one or more of the embodiments discussed herein.",
"DETAILED DESCRIPTION The following are definitions of various terms that may be used to describe one or more of the embodiments in this disclosure.",
"The terms “autonomous on-road vehicle” and “autonomous on-road manned vehicle” refer to cars and motorcycles designed to drive on public roadways utilizing automated driving of level 3 and above according to SAE International standard J3016 “Taxonomy and Definitions for Terms Related to On-Road Motor Vehicle Automated Driving Systems”.",
"For example, the autonomous on-road vehicle may be a level 3 vehicle, in which within known, limited environments, drivers can safely turn their attention away from driving tasks; the autonomous on-road vehicle may be a level 4 vehicle, in which the automated system can control the vehicle in all but a few environments; and/or the autonomous on-road vehicle may be a level 5 vehicle, in which no human intervention is required and the automatic system can drive to any location where it is legal to drive.",
"Herein, the terms “autonomous on-road vehicle” and “self-driving on-road vehicle” are equivalent terms that refer to the same.",
"The term “autonomous on-road vehicle” does not include trains, airplanes, boats, and armored fighting vehicles.",
"An autonomous on-road vehicle utilizes an autonomous-driving control system to drive the vehicle.",
"The disclosed embodiments may use any suitable known and/or to be invented autonomous-driving control systems.",
"The following three publications describe various autonomous-driving control systems that may be utilized with the disclosed embodiments: (i) Paden, Brian, et al.",
"“A Survey of Motion Planning and Control Techniques for Self-driving Urban Vehicles.” arXiv preprint arXiv:1604.07446 (2016); (ii) Surden, Harry, and Mary-Anne Williams.",
"“Technological Opacity, Predictability, and Self-Driving Cars.” Predictability, and Self-Driving Cars (Mar.",
"14, 2016) (2016); and (iii) González, David, et al.",
"“A Review of Motion Planning Techniques for Automated Vehicles.” IEEE Transactions on Intelligent Transportation Systems 17.4 (2016): 1135-1145.Autonomous-driving control systems usually utilize algorithms such as machine learning, pattern recognition, neural network, machine vision, artificial intelligence, and/or probabilistic logic to calculate on the fly the probability of an imminent collision, or to calculate on the fly values that are indicative of the probability of an imminent collision (from which it is possible to estimate the probability of an imminent collision).",
"The algorithms usually receive as inputs the trajectory of the vehicle, measured locations of at least one nearby vehicle, information about the road, and/or information about environmental conditions.",
"Calculating the probability of an imminent collision is well known in the art, also for human driven vehicles, such as the anticipatory collision system disclosed in U.S. Pat.",
"No.",
"8,041,483 to Breed.",
"In order to calculate whether a Sudden Decrease in Ride Smoothness (SDRS) event is imminent, the autonomous-driving control system may compare parameters describing the state of the vehicle at time t1 with parameters describing the state of the vehicle at time t2 that is shortly after t1.If the change in one or more of the parameters reaches a threshold (such as deceleration above a certain value, change of height in the road above a certain value, and/or an angular acceleration above a certain value) then it may be determined that an SDRS event is imminent.",
"An “occupant” of a vehicle, as the term is used herein refers to a person that is in the vehicle when it drives.",
"The term “occupant” refers to a typical person having a typical shape, such as a 170 cm tall human (herein “cm” refers to centimeters).",
"An occupant may be a driver, having some responsibilities and/or control regarding the driving of the vehicle (e.g., in a vehicle that is not completely autonomous), or may be a passenger.",
"When an embodiment refers to “the occupant of the vehicle”, it may refer to one of the occupants of the vehicle.",
"Stating that a vehicle has an “occupant” should not be interpreted that the vehicle necessarily accommodates only one occupant at a time, unless that is explicitly stated, such as stating that the vehicle is “designed for a single occupant”.",
"Herein, a “seat” may be any structure designed to hold an occupant travelling in the vehicle (e.g., in a sitting and/or reclining position).",
"A “front seat” is a seat that positions an occupant it holds no farther from the front of the vehicle than any other occupants of the vehicle are positioned.",
"Herein, sitting in a seat also refers to sitting on a seat.",
"Sitting in a seat is to be interpreted in this disclosure as occupying the space corresponding the seat, even if the occupant does so by assuming a posture that does not necessarily correspond to sitting.",
"For example, in some vehicles the occupant may be reclined or lying down, and in other vehicles the occupant may be more upright, such as when leaning into the seat in a half standing half seating position similar to leaning into a Locus Seat by Focal Upright LLC.",
"The interchangeable terms “environment outside the vehicle” and “outside environment” refer to the environment outside the vehicle, which includes objects that are not inside the vehicle compartment, such as other vehicles, roads, pedestrians, trees, buildings, mountains, the sky, and outer space.",
"A sensor “mounted to the vehicle” may be connected to any relevant part of the vehicle, whether inside the vehicle, outside the vehicle, to the front, back, top, bottom, and/or to a side of the vehicle.",
"A sensor, as used herein, may also refer to a camera.",
"The term “camera” refers herein to an image-capturing device that takes images of an environment.",
"For example, the camera may be based on at least one of the following sensors: a CCD sensor, a CMOS sensor, a near infrared (NIR) sensor, an infrared sensor (IR), and a device based on active illumination such as a LiDAR.",
"The term “video” refers to a series of images that may be provided in a fixed rate, variable rates, a fixed resolution, and/or dynamic resolutions.",
"The use of a singular “camera” should be interpreted herein as “one or more cameras”.",
"Thus, when embodiments herein are described as including a camera that captures video and/or images of the outside environment in order to generate a representation of the outside environment, the representation may in fact be generated based on images and/or video taken using multiple cameras.",
"Various embodiments described herein involve providing an occupant of the vehicle with representation of the outside environment, generated by a computer and/or processor, based on video taken by a camera.",
"In some embodiments, video from a single camera (e.g., which may be positioned on the exterior of the vehicle at eye level), may be sent to presentation to the occupant by the processor and/or computer following little, if any, processing.",
"In other embodiments, video from a single camera or multiple cameras is processed in various ways, by the computer and/or processor, in order to generate the representation of the outside environment that is presented to the occupant.",
"Methods and systems for stitching live video streams from multiple cameras, stitching live video streams with database objects and/or other video sources, transforming a video stream or a stitched video stream from one point of view to another point of view (such as for generating a representation of the outside environment for an occupant at eye level, or for generating a compartment view for a person standing outside the compartment), tracking the position of an HMD relative to a compartment, and presenting rendered images that are perfectly aligned with the outside world—are all known in the art of computer graphics, video stitching, image registration, and real-time 360° imaging systems.",
"The following publications are just a few examples of reviews and references that describe various ways to perform the video stitching, image registration, tracking, and transformations, which may be utilized by the embodiments disclosed herein: (i) Wang, Xiaogang.",
"“Intelligent multi-camera video surveillance: A review.” Pattern recognition letters 34.1 (2013): 3-19.",
"(ii) Szeliski, Richard.",
"“Image alignment and stitching: A tutorial.” Foundations and Trends® in Computer Graphics and Vision 2.1 (2006): 1-104.",
"(iii) Tanimoto, Masayuki.",
"“FTV: Free-viewpoint television.” Signal Processing: Image Communication 27.6 (2012): 555-570.",
"(iv) Ernst, Johannes M., Hans-Ullrich Doehler, and Sven Schmerwitz.",
"“A concept for a virtual flight deck shown on an HMD.” SPIE Defense+ Security.",
"International Society for Optics and Photonics, 2016.",
"(v) Doehler, H-U., Sven Schmerwitz, and Thomas Lueken.",
"“Visual-conformal display format for helicopter guidance.” SPIE Defense+ Security.",
"International Society for Optics and Photonics, 2014.",
"(vi) Sanders-Reed, John N., Ken Bernier, and Jeff GUell “Enhanced and synthetic vision system (ESVS) flight demonstration.” SPIE Defense and Security Symposium.",
"International Society for Optics and Photonics, 2008.And (vii) Bailey, Randall E., Kevin J. Shelton, and J. J. Arthur III.",
"“Head-worn displays for NextGen.” SPIE Defense, Security, and Sensing.",
"International Society for Optics and Photonics, 2011.A video that provides “representation of the outside environment” refers to a video that enables the average occupant, who is familiar with the outside environment, to recognize the location of the vehicle in the outside environment from watching the video.",
"In one example, the average occupant is a healthy 30 years old human who is familiar with the outside environment, and the threshold for recognizing a video as a “representation of the outside environment” is at least 20 correct recognitions of the outside environment out of 30 tests.",
"Herein, sentences such as “VST that represents a view of the outside environment from the point of view of the occupant”, or “VST representation of the outside environment, which could have been seen from the point of view of the occupant” refer to a video representing at least a portion of the outside environment, with a deviation of less than ±20 degrees from the occupant's point of view of the outside environment, and zoom in the range of 30% to 300% (assuming the occupant's unaided view is at 100% zoom level).",
"The VST may be generated based on at least one of the following resources: a video of the outside environment that is taken in real-time, a video of the outside environment that was taken in the past and is played/processed according to the trajectory of the vehicle, a database of the outside environment that is utilized for rendering the VST according to the trajectory of the vehicle, and/or a video that is rendered as function of locations of physical objects identified in the outside environment using detection and ranging systems such as RADAR and/or LIDAR.",
"Moreover, the term “video see-through (VST)” covers both direct representations of the outside environment, such as a video of the outside environment, and/or enriched video of the outside environment, such as captured video and/or rendered video of the outside environment presented together with one or more layers of virtual objects, as long as more than 20% of the average vehicle occupants, who are familiar with the outside environment, would be able to determine their location in the outside environment, while the vehicle travels, without using a map, and with a margin of error below 200 meters.",
"However, it is noted that showing a map that indicates the location of the vehicle on the driving path (such as from the start to the destination) is not considered herein as equivalent to the VST, unless the map includes all of the following properties: the map shows images of the path, the images of the path capture at least 5 degrees of the occupant's FOV at eye level, and the images of the path reflect the dynamics of the vehicle and change in a similar manner to a video taken by a camera mounted to the vehicle and directed to the outside environment.",
"Herein, “field of view (FOV) of the occupant to the outside environment” refers to the part of the outside environment that is visible to the occupant of a vehicle at a particular position and orientation in space.",
"In one example, in order for an occupant-tracking module to calculate the FOV to the outside environment of an occupant sitting in a vehicle compartment, the occupant-tracking module determines the position and orientation of the occupant's head.",
"In another example, in order for an occupant-tracking module to calculate the FOV of an occupant sitting in a vehicle compartment, the occupant-tracking module utilizes an eye tracker.",
"It is noted that sentences such as “a three dimensional (3D) video see-through (VST) that represents a view of the outside environment, which could have been seen from the point of view of the occupant had the FOV not been obstructed by at least a portion of the nontransparent element” cover also just one or more portions of the FOV, and are to be interpreted as “a three dimensional (3D) video see-through (VST) that represents a view of at least a portion of the outside environment, which could have been seen from the point of view of the occupant had at least some of the FOV not been obstructed by at least a portion of the nontransparent element”.",
"The term “display” refers herein to any device that provides a human user with visual images (e.g., text, pictures, and/or video).",
"The images provided by the display may be two-dimensional or three-dimensional images.",
"Some non-limiting examples of displays that may be used in embodiments described in this disclosure include: (i) screens and/or video displays of various devices (e.g., televisions, computer monitors, tablets, smartphones, or smartwatches), (ii) headset- or helmet-mounted displays such as augmented-reality systems (e.g., HoloLens), virtual-reality systems (e.g., Oculus rift, HTC Vive, or Samsung GearVR), and mixed-reality systems (e.g., Magic Leap), and (iii) image projection systems that project images on a occupant's retina, such as: Virtual Retinal Displays (VRD) that create images by scanning low power laser light directly onto the retina, or light-field technologies that transmit light rays directly into the eye.",
"Various embodiments may include a reference to elements located at eye level.",
"The “eye level” height is determined according to an average adult occupant for whom the vehicle was designed, who sits straight and looks to the horizon.",
"Sentences in the form of “an element located at eye level of an occupant who sits in a vehicle” refer to the element and not to the occupant.",
"The occupant is used in such sentences in the context of “eye level”, and thus claims containing such sentences do not require the existence of the occupant in order to construct the claim.",
"Sentences such as “SAEDP located at eye level”, “stiff element located at eye level”, and “crumple zone located at eye level” refer to elements that are located at eye level, but may also extended to other levels, such as from sternum level to the roof level, from floor level to eye level, and/or from floor level to roof level.",
"For example, an SAEDP located at an eye level can extend from sternum level to above the occupant's head, such that at least a portion of the SAEDP is located at the eye level.",
"Herein, “normal driving” refers to typical driving conditions, which persist most of the time the vehicle is in motion.",
"During normal driving the probability of a collision is below a threshold that when reached typically involves one or more of the following actions: deployment of safety devices that are not usually deployed (e.g., inflating airbags), taking evasive action to avoid a collision, and warning occupants of the vehicle about an imminent event that may cause a Sudden Decrease in Ride Smoothness (SDRS).",
"A Shock-Absorbing Energy Dissipation Padding (SAEDP) is an element that may be used to cushion impact of a body during a collision or during SDRS events.",
"Various types of SAEDPs may be used in embodiments described herein, such as passive materials, airbags, and pneumatic pads.",
"Some examples of passive materials that may be used for the SAEDP in one or more of the disclosed embodiments include one or more of the following materials: CONFOR® foam by Trelleborg Applied Technology, Styrofoam by The Dow Chemical Company, Micro-Lattice Materials and/or Metallic Microlattices (such as by HRL Laboratories in collaboration with researchers at University of California and Caltech), non-Newtonian energy Absorbing materials (such as D30® by D30 lab, and DEFLEXION™ by Dow Corning®), Sorbothane® by Sorbothane Incorporated, and padding that includes compression cells and/or shock absorbers of the Xenith LLC type (such as described in U.S. Pat.",
"No.",
"8,950,735 and US patent application num.",
"20100186150), and materials that include rubber such as a sponge rubber.",
"The term “stiff element” refers to a material having stiffness and impact resistance equal or greater than that of glazing materials for use in motor vehicles as defined in the following two standards: (i) “American National Standard for Safety Glazing Materials for Glazing Motor Vehicles and Motor Vehicle Equipment Operating on Land Highways-Safety Standard” ANSI/SAE Z26.1-1996, and (ii) The Society of Automotive Engineers (SAE) Recommended Practice J673, revised April 1993, “Automotive Safety Glasses” (SAE J673, rev.",
"April 93).",
"The term “stiff element” in the context of low speed vehicles refers to a material having stiffness and impact resistance equal or greater than that of glazing materials for use in low speed motor vehicles as defined in Federal Motor Vehicle Safety Standard 205—Glazing Materials (FMVSS 205), from 49 CFR Ch.",
"V (10-1-04 Edition).",
"The stiff element may be transparent (such as automotive laminated glass, or automotive tempered glass) or nontransparent (such as fiber-reinforced polymer, carbon fiber reinforced polymer, steel, or aluminum).",
"Herein, a nontransparent element is defined as an element having Visible Light Transmittance (VLT) between 0% and 20%, which does not enable the occupant to recognize what lies on the other side of it.",
"For example, a thick ground glass usually allows light to pass through it but does not let the occupant recognize the objects on the other side of it, unlike plain tinted glass that usually lets the occupant recognize the objects on the other side of it, even when it features VLT below 10%.",
"The nontransparent element includes an opaque element having VLT of essentially 0% and includes a translucent element having VLT below 20%.",
"VLT is defined as the amount of incident visible light that passes through the nontransparent element, where incident light is defined as the light that strikes the nontransparent element.",
"VLT is also known as Luminous Transmittance of a lens, a light diffuser, or the like, and is defined herein as the ratio of the total transmitted light to the total incident light.",
"The common clear vehicle windshield has a VLT of approximately 85%, although US Federal Motor Vehicle Safety Standard No.",
"205 allows the VLT to be as low as 70%.",
"Sentences such as “video unrelated to the VST (VUR)” mean that an average occupant would not recognize the video as a representation of the outside environment.",
"In some embodiments, the content of the VUR does not change as function of the position of the occupant's head, which means that the point of view from which the occupant watches the VUR does not change essentially when the occupant's head moves.",
"Herein, stabilization effects, image focusing, dynamic resolution, color corrections, and insignificant changes to less than 10% of the frame as function of the position of the occupant's head—are still considered as content that does not change as function of the position of the occupant's head.",
"Examples of such content (common in the year 2016) include cinema movies, broadcast TV shows, standard web browsers, and Microsoft Office 2016 applications (such as Word, Excel and PowerPoint).",
"Herein, a “crumple zone” refers to a structure designed to slow down inertia and absorb energy from impact during a traffic collision by controlled deformation.",
"The controlled deformation absorbs some of the impact within the outer parts of the vehicle, rather than being directly transferred to the occupants, while also preventing intrusion into and/or deformation of the compartment.",
"Crumple zone may be achieved by various configurations, such as one or more of the following exemplary configurations: (i) by controlled weakening of sacrificial outer parts of the vehicle, while strengthening and increasing the stiffness of the inner parts of the vehicle, such as by using more reinforcing beams and/or higher strength steels for the compartment; (ii) by mounting composite fiber honeycomb or carbon fiber honeycomb outside the compartment; (iii) by mounting an energy absorbing foam outside the compartment; and/or (iv) by mounting an impact attenuator that dissipates impact.",
"In order to enable an occupant of a vehicle to view the outside environment, without needing to look out of a physical window, some aspects of this disclosure involve systems that combine video see-through (VST) with video-unrelated-to-the-VST (VUR).",
"In one embodiment, a system configured to combine video see-through (VST) with video-unrelated-to-the-VST (VUR) includes a head-mounted display (HMD), a camera, an HMD tracking module and a computer.",
"The HMD is configured to be worn by an occupant of a compartment of a moving vehicle and to present an HMD-video to the occupant.",
"The camera, which is mounted to the vehicle, is configured to take video of the outside environment (Vout).",
"The HMD tracking module is configured to calculate position of the HMD relative to the compartment, based on measurements of a sensor.",
"The computer is configured to receive a location of a video see-through window (VSTW) in relation to the compartment, and to calculate, based on the position of the HMD relative to the compartment, a window-location for the VSTW on the HMD-video.",
"Additionally, the computer is further configured to generate, based on the window-location and the Vout, the VST that represents a view of the outside environment from the point of view of the occupant.",
"The computer is also configured to generate the HMD-video based on combining the VUR with the VST in the window-location.",
"It is to be noted that the content of the VUR is unrelated to the video taken by the camera.",
"In one embodiment, a system configured to combine video see-through (VST) with video-unrelated-to-the-VST (VUR) includes at least the following components: a head-mounted display (HMD), such as HMD 15, a camera (e.g., camera 12), an HMD tracking module 27, and a computer 13.FIG.",
"1 provides a schematic illustration of at least some of the relationships between the components mentioned above.",
"The HMD 15 is configured to be worn by an occupant of a compartment of a moving vehicle and to present an HMD-video 16 to the occupant.",
"In one embodiment, the HMD 15 is an augmented-reality (AR) HMD.",
"In another embodiment, the HMD 15 is a virtual reality (VR) HMD.",
"Optionally, in this embodiment, the system further comprises a video camera mounted to the VR HMD, and the VST video comprises video of the compartment received from the video camera mounted to the VR HMD.",
"In yet another embodiment, the HMD 15 is a mixed reality HMD.",
"The term “Mixed Reality” (MR) as used herein involves a system that is able to combine real world data with virtual data.",
"Mixed Reality encompasses Augmented Reality and encompasses Virtual Reality that does not immerse its user 100% of the time in the virtual world.",
"Examples of mixed reality HMDs include, but are not limited to, Microsoft HoloLens HMD and MagicLeap HMD.",
"The camera 12, which is mounted to the vehicle, is configured to take video of the outside environment (Vout).",
"Optionally, the data captured by the camera comprises 3D data.",
"For example, the camera may be based on at least one of the following sensors: a CCD sensor, a CMOS sensor, a near infrared (NIR) sensor, an infrared sensor (IR), and a device based on active illumination such as a LiDAR.",
"The HMD tracking module 27 is configured to calculate position of the HMD 15 relative to the compartment, based on measurements of a sensor.",
"In different embodiments, the HMD tracking module 27 may have different configurations.",
"In one embodiment, the sensor comprises first and second Inertial Measurement Units (IMUs).",
"In this embodiment, the first IMU is physically coupled to the HMD 15 and is configured to measure a position of the HMD 15, and the second IMU is physically coupled to the compartment and is configured to measure a position of the compartment.",
"The HMD tracking module 27 is configured to calculate the position of the HMD 15 in relation to the compartment based on the measurements of the first and second IMUs.",
"In another embodiment, the sensor comprises an Inertial Measurement Unit (IMU) and a location measurement system.",
"In this embodiment, the IMU is physically coupled to the HMD 15 and is configured to measure an orientation of the HMD 15.The location measurement system is physically coupled to the compartment and is configured to measure a location of the HMD in relation to the compartment.",
"The HMD tracking module 27 is configured to calculate the position of the HMD 15 in relation to the compartment based on the measurements of the IMU and the location measurement system.",
"Optionally, the location measurement system measures the location of the HMD 15 in relation to the compartment based on at least one of the following inputs: a video received from a camera that captures the HMD 15, a video received from a stereo vision system, measurements of magnetic fields inside the compartment, wireless triangulation measurements, acoustic positioning measurements, and measurements of an indoor positioning systems.",
"FIG.",
"2 illustrates one embodiment in which the HMD tracking module 27 is physically coupled to the compartment and is configured to measure the position of the HMD relative to the compartment.",
"The HMD tracking module 27 may utilize a passive camera system, an active camera system that captures reflections of a projected grid, and/or a real-time locating systems based on microwaves and/or radio waves.",
"The computer 13 is configured to receive a location of a video see-through window (VSTW) in relation to the compartment, and to calculate, based on the position of the HMD relative to the compartment, a window-location for the VSTW on the HMD-video.",
"The computer 13 is also configured to generate, based on the window-location and the Vout, the VST that represents a view of the outside environment from the point of view of the occupant.",
"Optionally, the VST is rendered as a 3D video content.",
"Additionally, the computer 13 is further configured to generate the HMD-video 16 based on combining the VUR with the VST in the window-location.",
"The computer 13 may use various know in the art computer graphics functions and/or libraries to generate the VST, transform the VST to the occupant's point of view, render the 3D video content, and/or combine the VUR with the VST.",
"In one embodiment, the content of the VUR does not change when the occupant moves the head, and the content of the VUR is unrelated to the video taken by the camera.",
"Additionally, the content of the VUR is generated based on data that was received more than 2 seconds before the HMD-video 16 is displayed to the occupant.",
"Some examples of the VUR include a video stream of at least one of the following types of content: a recorded television show, a computer game, an e-mail, and a virtual computer desktop.",
"FIG.",
"3 illustrates one embodiment in which the occupant 14 wears an HMD 15.The HMD 15 provides video to the occupant 14 through the display of the HMD 15.The vehicle includes a camera 12 that takes video of the outside environment 11a and processes it in a manner suitable for the location of the occupant.",
"The processed video is provided to the occupant's display in the HMD 15 as a VSTW and the position of the VSTW is calculated in relation to the compartment of the vehicle and moves with the compartment.",
"While the vehicle is in motion, the VSTW change its content to represent the outside environment 11a of the vehicle.",
"Whereas the video-unrelated-to-the-VST doesn't change when the occupant moves his head.",
"The computer is configured to receive a location of a VSTW in relation to the compartment, and to calculate, based on the position of the occupant's head, a window-location for the VSTW on the video.",
"FIG.",
"4 illustrates one embodiment in which the occupant 44 wears HMD 45 and views large VUR 40 and smaller VST 41a.",
"The VUR 40 does not change when the occupant's head 44 moves.",
"The VSTW presents video of the street based on video taken by the camera that is mounted to the vehicle.",
"The location of the video-see-through window in relation to the compartment does not change when the occupant 44 moves his/her head in order to imitate a physical window that does not change its position relative to the compartment when the occupant's head moves.",
"FIG.",
"5a illustrates how, in one embodiment, the VST moves to the upper left when the occupant 44 looks to the bottom right.",
"FIG.",
"5b illustrates how the VST moves to the bottom right when the occupant 44 looks to the upper left, while the VUR moves with the head.",
"In both cases, the VUR moves with the head while the location of the VST changes according to the movement of the head relative to the compartment as measured by the HMD tracking module 27.In some embodiments, the content of the VUR may be augmented-reality content, mixed-reality content, and/or virtual-reality content rendered to correspond to the occupant's viewing direction.",
"In this embodiment, the VUR is unrelated to the video taken by the camera.",
"In one example, the VUR may include a video description of a virtual world in which the occupant may be playing a game (e.g., represented by an avatar).",
"Optionally, in this example, most of the features of the virtual world are different from the view of the outside of the vehicle (as seen from the occupant's viewing direction).",
"For example, the occupant may be driving in a city, while the virtual world displays woods, a meadow, or outer space.",
"In another example, the VUR may include augmented reality content overlaid above a view of the inside of the compartment.",
"In addition to the components described above, in some embodiments, the system may include a second camera that is mounted to the HMD and is configured to take video of the compartment (Vcomp).",
"In this embodiment, the computer is further configured to generate a compartment-video (CV), based on Vcomp and a location of a compartment-video window (CVW) in relation to the HMD-video (e.g., HMD-video 16), and to generate the HMD-video also based on the CV in the CVW, such that the HMD-video combines the VUR with the VST in the window-location and with the CV in the CVW.",
"There are various ways in which the CVW may be incorporated into the HMD-video.",
"Some examples of these approaches are illustrated in the following figures.",
"FIG.",
"6 illustrates HMD-video that includes both a non-transparent VST 55 in the window-location and a CV 56 that shows the hands of the occupant and the interior of the compartment in the CVW.",
"FIG.",
"7 illustrates HMD-video that includes both a partially transparent VST 57 in the window-location and the CV 56 that shows the hands of the occupant and the interior of the compartment in the CVW.",
"FIG.",
"8 illustrates HMD-video that includes a VST 58 and partially transparent CV 59.The figure illustrates that the occupant sees the outside environment in full field-of-view (FOV), while on top of it there is a partially transparent image (illustrated as dotted image) of the compartment and the hands of the occupant, in order to help the occupant not to hit things in the compartment.",
"FIG.",
"9a illustrates HMD-video that includes a VUR 70 in full FOV, a first window comprising the CV 71 in the CVW and a second smaller window comprising the VST 72 in the window-location.",
"FIG.",
"9b illustrates HMD-video that includes VUR 70 in full FOV, a first window comprising the CV 71 in the CVW and a second partially transparent smaller window comprising the VST 73 in the window-location.",
"FIG.",
"10a illustrates HMD-video that includes VUR 70 in full FOV, a first window comprising VST 75 in the window-location and a second smaller window comprising zoom out of the CV 76 in the CVW.",
"Optionally, the cabin view in the zoom out is smaller than in reality, and may enable the occupant to orient in the cabin.",
"Optionally, the occupant may move the CVW, as illustrated in FIG.",
"10a where the zoom out of the CV in the CVW is somewhat above its location in reality.",
"FIG.",
"10b illustrates HMD-video that includes VUR 70 and a partially transparent CV 72.Here a first occupant sees the VUR in full field-of-view (FOV), and on top of it there is a partially transparent image of the compartment and a second occupant that sits to the left of the first occupant, which may help the first occupant not to hit the second occupant.",
"There may be various ways in which the system determines the location and/or size of the VSTW.",
"In one embodiment, the VSTW is pinned to at least one of the following locations: a specific physical location and a location of an object in the compartment, such that the location of the VSTW in relation to the compartment does not change when the occupant moves his/her head with the HMD 15 as part of watching the HMD-video 16 and without commanding the VSTW to move in relation to the compartment.",
"In another embodiment, the system includes a user interface configured to receive a command from the occupant to move and/or resize the VSTW in relation to the compartment.",
"In one example, the command is issued through a voice command (e.g., saying “move VST to the bottom”).",
"In another example, the command may be issued by making a gesture, which is detected by a gesture control module in the compartment and/or on a device of the occupant (e.g., as part of the HMD).",
"Optionally, in this embodiment, the computer is further configured to: update the window-location based on the command from the occupant, and generate an updated VST based on the updated window-location and the video taken by the camera.",
"In this embodiment, the VST and the updated VST present different VSTW locations and/or dimensions in relation to the compartment.",
"Optionally, the HMD is configured not to present any part of the VST to the occupant when the window-location is not in the field of view presented to the occupant through the HMD.",
"In yet another embodiment, the system may further include a video analyzer configured to identify an Object Of Interest (OOI) in the outside environment.",
"For example, the OOI of interest may be a certain landmark (e.g., a building), a certain object (e.g., a store or a certain model of automobile), or a person.",
"In this embodiment, the computer is further configured to receive, from the video analyzer, an indication of the position of the OOI, and to track the OOI by adjusting the window-location according to the movements of the vehicle, such that the OOI is visible via the VST.",
"Optionally, the HMD is configured not to present any part of the VST to the occupant when the window-location is not in the field of view presented to the occupant through the HMD.",
"The VST that represents the view of the outside environment from the point of view of the occupant, in some embodiments, does not necessarily match the video taken by the cameras.",
"In one embodiment, the VST may utilize image enhancement techniques to compensate for outside lighting conditions, to give an occupant an experience similar to looking out through a conventional vehicle window but without the view being distorted by raindrops or dirt on the window, and/or to improve the visual impression of the outside environment e.g.",
"by showing background images which are different from those retrievable from the outside environment.",
"Additionally or alternatively, the VST may mimic the outside environment, alter the outside environment, and/or be completely different from what can be seen on the outside environment.",
"The VST may be focused on providing visual information that makes the travelling more fun.",
"The vehicle may provide different styles of the outside environment to different occupants in the vehicle, such that a first VST provided to a first occupant may mimic the outside environment, while a second VST provided to a second occupant may alter the outside environment and/or be completely different from the outside environment, optionally for comfort enhancement and/or entertainment.",
"In some embodiments, the VST is informative, and aids at least some of the occupants to determine the location of the vehicle in the environment.",
"In one embodiment, at least some of those occupants could not determine their location without the VST.",
"In one example, less than 20% of average vehicle occupants, who are familiar with the outside environment, are able to determine their real location in the outside environment by watching the VUR, without using a map, with a margin of error that is less than 100 meters, and while the vehicle travels; while more than 20% of the average vehicle occupants, who are familiar with the outside environment, are able to determine their real location in the outside environment by watching the VST, without using a map, and with a margin of error that is less than 100 meters, and while the vehicle travels.",
"FIG.",
"11a illustrates a FOV in the context of presented video and terminology used herein.",
"The vehicle occupant 200 wears an HMD 201 that presents HMD-video (such as HMD-video 16).",
"The HMD-video may be presented at a single focal plane, or at multiple focal planes, depending on the characteristics of the HMD 201 (when the occupant focuses on a certain focal plane, then his/her point of gaze is said to be on the certain focal plane).",
"In addition, the presented objects may be two-dimensional (2D) virtual objects and/or three-dimensional (3D) virtual objects that may also be referred to as holographic objects.",
"Element 204 represents the location of a nontransparent element fixed to the vehicle compartment.",
"In one example, the HMD 201 is a holographic HMD, such as Microsoft HoloLens, which can present content displayed on a series of focal planes that are separated by some distance.",
"The virtual objects may be presented before the nontransparent element (e.g., polygons 202, 203), essentially on the nontransparent element 204, and/or beyond the nontransparent element (e.g., polygons 205, 206).",
"As a result, the occupant's gaze distance may be shorter than the distance to the nontransparent element (e.g., distance to polygons 202, 203), essentially equal to the distance to the nontransparent element 204, and/or longer than the distance to the nontransparent element (e.g., distance to polygons 205, 206).",
"Polygon 207 represents a portion of the presented video at eye level of the vehicle occupant, which in one example is within ±7 degrees from the horizontal line of sight.",
"Although the figure illustrates overlapping FOVs of polygons 202, 203, 204, and 205, the HMD may show different objects, capturing different FOVs, at different focal planes.",
"In one example, the HMD may project an image throughout a portion of, or all of, a display volume.",
"Further, a single object such as a vehicle could occupy multiple volumes of space.",
"According to the terminology used herein, the nontransparent element 204 is said to be located on FOV overlapping the FOV of polygons 205 and 203 because polygons 203, 204, 205 share the same FOV.",
"FOV of polygon 206 is contained in the FOV of polygon 204, and FOV of polygon 207 intersects the FOV of polygon 204.FOV of polygon 203 is before the nontransparent element 204 and therefore may hide the nontransparent element 204 partially or entirely, especially when utilizing a multi-focal plane HMD.",
"FIG.",
"11b illustrates a FOV in the context of the presented video, where the vehicle occupant 210 does not wear an HMD that presents the video, such as when watching an autostereoscopic display.",
"The autostereoscopic display is physically located on plane 214 and the presented video may be presented at a single focal plane, or at multiple focal planes, depending on the characteristics of the autostereoscopic display.",
"In one example, the autostereoscopic display is a holographic display, such as SeeReal Technologies holographic display, where the presented video may present virtual objects before the focal plane of the autostereoscopic display (e.g., planes 212, 213), essentially on the focal plane of the autostereoscopic display 214, and/or beyond the focal plane of the autostereoscopic display (e.g., planes 215, 216).",
"As a result, the occupant's gaze distance may be shorter than the distance to the autostereoscopic display (e.g., planes 212, 213), essentially equal to the distance to the autostereoscopic display 214, and/or longer than the distance to the autostereoscopic display (e.g., planes 215, 216).",
"The term “autostereoscopic” includes technologies such as automultiscopic, glasses-free 3D, glassesless 3D, parallax barrier, integral photography, lenticular arrays, Compressive Light Field Displays, holographic display based on eye tracking, color filter pattern autostereoscopic display, volumetric display that reconstructs light field, integral imaging that uses a fly's-eye lens array, and/or High-Rank 3D (HR3D).",
"FIG.",
"11c illustrates FOV of a 3D camera that is able to capture sharp images from different focal lengths.",
"In some embodiments, the vehicle and/or the HMD utilize at least one Inertial Measurement Unit (IMU), and the system utilizes an Inertial Navigation System (INS) to compensate imperfections in the IMU measurements.",
"An INS typically has one or more secondary navigation sensors that provide direct measurements of the linear velocity, position and/or orientation of the vehicle.",
"These secondary navigation sensors could be anything from stereo vision systems, to GPS receivers, to digital magnetic compasses (DMCs) or any other type of sensor that could be used to measure linear velocity, position and/or orientation.",
"In one example, the information from these secondary navigation sensors is incorporated into the INS using an Extended Kalman Filter (EKF).",
"The EKF produces corrections that are used to adjust the initial estimations of linear velocity, position and orientation that are calculated from the imperfect IMU measurements.",
"Adding secondary navigation sensors into an INS can increase its ability to produce accurate estimations of the linear velocity, position and orientation of the vehicle over long periods of time.",
"In one embodiment, the system utilizes domain specific assumptions in order to reduce drift of an INS used to calculate the HMD spatial position in relation to the compartment.",
"More specifically, the following methods may be used to reduce or correct drift.",
"Such methods generally fall in the categories of using sensor fusion and/or domain specific assumptions.",
"(i) Sensor fusion refers to processes in which signals from two or more types of sensors are used to update and/or maintain the state of a system.",
"In the case of INS, the state generally includes the orientation, velocity and displacement of the device measured in a global frame of reference.",
"A sensor fusion algorithm may maintain this state using IMU accelerometer and gyroscope signals together with signals from additional sensors or sensor systems.",
"There are many techniques to perform sensor fusion, such as Kalman filter and particle filter.",
"One example of periodically correcting drift is to use position data from a triangulation positioning system relative to the compartment.",
"Such systems try to combine the drift free nature of positions obtained from the triangulation positioning system with the high sampling frequency of the accelerometers and gyroscopes of the IMU.",
"Roughly speaking, the accelerometer and gyroscope signals are used to ‘fill in the gaps’ between successive updates from the triangulation positioning system.",
"Another example of reducing the drift is using a vector magnetometer that measures magnetic field strength in a given direction.",
"The IMU may contain three orthogonal magnetometers in addition to the orthogonal gyroscopes and accelerometers.",
"The magnetometers measure the strength and direction of the local magnetic field, allowing the north direction to be found.",
"(ii) In some embodiments, it is possible to make domain specific assumptions about the movements of the occupant and/or the vehicle.",
"Such assumptions can be used to minimize drift.",
"One example in which domain specific assumptions may be exploited is the assumption that when the vehicle accelerates or decelerates significantly, the HMD accelerates or decelerates essentially the same as the vehicle, allowing HMD drift in velocity to be periodically corrected based on a more accurate velocity received from the autonomous-driving control system of the vehicle.",
"Another example in which domain specific assumptions may be exploited is the assumption that when the vehicle accelerates or decelerates significantly, the HMDs of two occupants travelling in the same vehicle accelerate or decelerate essentially the same, allowing HMD drifts to be periodically corrected based on comparing the readings of the two HMDs.",
"Still another example in which domain specific assumptions are exploited is the assumption that the possible movement of an HMD of a belted occupant is most of the time limited to a portion of the compartment, allowing HMD drifts to be periodically corrected based on identifying when the HMD exceeds beyond that portion of the compartment.",
"In one example, it may be desirable to adjust the position of displaying a virtual object in response to relative motion between the vehicle and the HMD so that the virtual object would appear stationary in location.",
"However, the HMD IMU may indicate that the HMD is moving even when the detected motion is a motion of the vehicle carrying the HMD.",
"In order to distinguish between motion of the HMD caused by the vehicle and motion of the HMD relative to the vehicle, non-HMD sensor data may be obtained by the HMD from sensor such as an IMU located in the vehicle and/or the GPS system of the vehicle, and the motion of the vehicle may be subtracted from the motion of the HMD in order to obtain a representation of the motion of the HMD relative to the vehicle.",
"By differentiating movements of the HMD caused by the occupant motion compared to movements caused by the vehicle motion, the rendering of the virtual object may be adjusted for the relative motion between the HMD and the vehicle.",
"Using the nontransparent element, instead of a transparent glass window that provides the same FOV to the outside environment, may provide various benefits, such as: (i) reduced manufacturing cost of the vehicle compared to a similar vehicle having instead of the nontransparent element a transparent glass window that provides the same FOV to the outside environment as provided by the 3D display device, (ii) reduced weight of the vehicle compared to a similar vehicle having instead of the nontransparent element a transparent glass window that provides the same FOV to the outside environment as provided by the 3D display device, and provides the same safety level, (iii) better aerodynamic shape and lower drag for the vehicle, which results in an improved energy consumption, and (iv) improved privacy for the occupant as a result of not enabling an unauthorized person standing nearby the vehicle to see the occupant directly.",
"The term “real-depth VST window (VSTW)” is defined herein as an imaging display that shows a 3D image of an outside environment located beyond a wall that interrupts the occupant's unaided view of the outside environment.",
"The real-depth VSTW has the following characteristics: (i) the 3D image corresponds to a FOV to the outside environment beyond the wall, as would have essentially been seen by the occupant had the wall been removed; (ii) the outside environment is captured by a camera, and the rendering of the 3D image is based on images taken by the camera; and (iii) while looking via the imaging display, the occupant's point of gaze (where one is looking) is most of the time beyond the wall that interrupts the occupant's unaided view of the outside environment.",
"A possible test to determine whether “(i) the 3D image corresponds to a FOV to the outside environment beyond the wall, as would have essentially been seen by the occupant had the wall been removed” is whether an imaginary user standing beyond the wall, watching both the real-depth VSTW and the outside environment, would recognize that at least 20% of the contours of objects in the 3D image correspond to the contours of the objects seen on the outside environment.",
"Differences between the colors of the corresponding objects in the 3D image and the outside environment usually do not affect the criterion of the 20% corresponding contours, as long as the color difference does not affect the perception of the type of object.",
"For example, different skin colors to corresponding people in the 3D image and the outside environment do not violate the criterion of the 20% corresponding contours.",
"As another example, differences in the weight and/or height of corresponding objects in the 3D image and the outside environment do not violate the criterion of the 20% corresponding contours as long as the imaginary user understands that the objects correspond to the same person.",
"Sentences such as “from the FOV of the occupant” are to be interpreted as no more than 20 degrees angular deviation from the field of view of the occupant to the outside environment.",
"Zoom in/out does not affect the FOV as long as the average occupant would still recognize the rendered environment as the 3D VST.",
"For example, zoom in of up to ×4, which maintains no more than 20 degrees angular deviation from the FOV of the occupant to the outside environment, is still considered “from the FOV of the occupant”.",
"Reasonable lateral deviation essentially does not affect the FOV as long as the average occupant would still recognize the rendered environment as the 3D VST.",
"For example, displaying to the occupant the outside environment from the FOV of a camera located on the roof of the occupant's vehicle, is still considered as showing the outside environment from the occupant's FOV.",
"A possible test to determine whether “(ii) the outside environment is measured by a camera, and the images taken by the camera are used to render the 3D image” is whether the real-depth VSTW would display a different 3D VST when it does not receive the images taken by the camera.",
"For example, assuming the camera is a 3D video camera, and the 3D image is a manipulation of the images taken by the 3D video camera; then, when the real-depth VSTW does not receive the images, it cannot show the changes that are taking place in the outside environment.",
"As another example, assuming the 3D image is mainly rendered from cached data stored in a database, and the camera is used to provide the setup of objects that behave in an unknown way, such as trajectories of nearby vehicles on the road, or a gesture of a person walking beyond the wall; then, when the output of the camera is used to render the 3D image, the real-depth VSTW would represent the unknown trajectory of the nearby vehicles or the unknown gesture of the person, while when the output of the camera is not used to render the 3D image, the real-depth VSTW would not represent the unknown trajectory of the nearby vehicles or the unknown gesture of the person merely because the renderer does not have that data.",
"A possible test to determine whether “(iii) the occupant's point of gaze (where one is looking) is most of the time beyond the wall that interrupts the occupant's unaided view of the outside environment” includes the following steps: (a) use eye tracker to determine the point of gaze on a representative scenario, (b) measure the distance to the wall, and (c) determine whether the average gaze distance is longer than the distance to the wall.",
"Some aspects of this disclosure involve a system that utilizes window shading of a vehicle window in order to improve the quality of video viewed by an occupant of the vehicle who wears a head-mounted display (HMD).",
"In one embodiment, an autonomous on-road vehicle includes a system configured to enable an HMD to cooperate with a window light shading module.",
"This embodiment involves a light shading module, a camera, a processor, and the HMD.",
"The light shading module is integrated with a vehicle window and is configured to be in at least one of first and second states.",
"In the first state the Visible Light Transmittance (VLT) of the vehicle window is above 10% of ambient light entering through the window, in the second state the VLT of the vehicle window is below 50% of ambient light entering through the window, and the VLT of the vehicle window in the first state is higher than the VLT of the vehicle window in the second state.",
"The camera is fixed to the vehicle and configured to take video of the outside environment.",
"The processor is configured to generate, based on the video, a video see-through (VST) that represents the outside environment from a point of view of an occupant looking to the outside environment through at least a portion of the vehicle window.",
"The HMD comprises an optical see-through component and a display component; the HMD is configured to operate according to a first mode of operation when the occupant looks at the direction of the vehicle window and the light shading module is in the first state, and to operate according to a second mode of operation when the occupant looks at the direction of the vehicle window and the light shading module is in the second state.",
"Wherein the total intensity of the VST light, emitted by the display component and reaching the occupant's eyes, is higher in the second mode than in the first mode.",
"In one embodiment, a system configured to enable a head-mounted display (HMD) to cooperate with a window light shading module of an autonomous on-road vehicle includes at least the following elements: the HMD 62, a light shading module 61, a camera (such as camera 12), and a processor 18.FIG.",
"12 is a schematic illustration of at least some of the relationships between the system elements mentioned above.",
"The light shading module 61 is integrated with a vehicle window and is configured to be in at least one of first and second states.",
"Optionally, the light shading module 61 covers more than half of the front windshield in the second state.",
"In one embodiment, in the first state, the Visible Light Transmittance (VLT) of the vehicle window is above 10% of ambient light entering through the window, and in the second state, the VLT of the vehicle window is below 50% of ambient light entering through the window.",
"Additionally, the VLT of the vehicle window in the first state is higher than the VLT of the vehicle window in the second state.",
"In another embodiment, in the first state the VLT of the vehicle window is above 70% of ambient light entering through the window, and in the second state, the VLT of the vehicle window is below 30% of ambient light entering through the window.",
"Herein, “ambient light” in the context of a vehicle refers to visible light that is not controlled by the vehicle, such as light arriving from: the sun, lights of other vehicles, street/road lighting, and various reflections from elements such as windows.",
"In some embodiments, utilizing the light shading module 61 may improve the quality of images viewed via the HMD 62 when the light shading module 61 is in the second state.",
"Optionally, the perceived contrast of the optical see-through component is better when the light shading module is in the second state compared to when the light shading module 61 is in the first state.",
"Various types of light shading modules may be utilized in embodiments described herein.",
"In one embodiment, the light shading module 61 is a movable physical element configured to reduce the intensity of the ambient light entering into the vehicle compartment through the vehicle window.",
"Optionally, the light shading module is unfurled on the inside of the compartment in order to block at least 50% of the ambient light intensity.",
"Optionally, the light shading module is unfurled on the outside of the compartment in order to block at least 50% of the ambient light intensity.",
"FIG.",
"13a illustrates a first mode where the occupant sees the outside environment through the optical see-through component.",
"This figure illustrates the view that the occupant sees when looking outside through the window.",
"FIG.",
"13b illustrates a second mode where the occupant sees the outside environment through the VST.",
"In this example, the outside environment is a bit different, and there is also a virtual Superman floating near the tree.",
"In another embodiment, the light shading module 61 may be a curtain.",
"FIG.",
"14 illustrates a VST over a curtain.",
"FIG.",
"15 illustrates a light shading module that is unfurled on the inside of the compartment.",
"FIG.",
"16 illustrates a light shading module that is unfurled on the outside of the compartment.",
"And in yet another embodiment, the vehicle window is made of a material that is able to serve as the light shading module 61 by changing its transparency properties.",
"The camera is fixed to the vehicle, and configured to take video of the outside environment.",
"For example, the camera may be based on at least one of the following sensors: a CCD sensor, a CMOS sensor, a near infrared (NIR) sensor, an infrared sensor (IR), and a device based on active illumination such as a LiDAR.",
"The processor is configured to generate, based on the video, a video see-through (VST 19) that represents the outside environment from a point of view of an occupant looking to the outside environment through at least a portion of the vehicle window.",
"Optionally, the processor is further configured not to generate the VST 19 when the HMD 62 operates in the first mode.",
"The HMD 62 comprises an optical see-through component and a display component.",
"Optionally, the HMD 62 is configured to operate according to a first mode of operation when the occupant looks at the direction of the vehicle window and the light shading module 61 is in the first state, and to operate according to a second mode of operation when the occupant looks at the direction of the vehicle window and the light shading module 61 is in the second state.",
"The total intensity of the VST light, emitted by the display component and reaching the occupant's eyes, is higher in the second mode than in the first mode.",
"In one embodiment, in the first mode, intensity of light that reaches the occupant's eyes via the optical see-through component is higher than intensity of light from the VST that is emitted by the display component and reaches the occupant's eyes.",
"And in the second mode, the intensity of light from the environment that reaches the occupant's eyes via the optical see-through component is lower than the intensity of light from the VST that is emitted by the display component and reaches the occupant's eyes.",
"In one example, the total intensity of VST light, emitted by the display component and reaching the occupant's eyes, is at least 50% higher in the second mode than in the first mode.",
"In some embodiments, the display component may be based on a digital display that produces the virtual image (such as in Oculus rift), direct retina illumination (such as in Magic Leap), or other methods that are capable of producing the virtual image.",
"In one embodiment, the system described above optionally includes an occupant tracking module configured to calculate the point of view of the occupant based on measurements of a sensor.",
"Optionally, the occupant tracking module is the HMD tracking module 27.Optionally, in this embodiment, the processor is further configured to render the VST based on data received from the occupant tracking module.",
"Optionally, the display is a three dimensional (3D) display configured to show the occupant the VST, such that point of gaze of the occupant, while looking via the 3D display device, is most of the time beyond the location of the light shading module 61.In some embodiments, an occupant of a vehicle may have the opportunity to view video see-through (VST), which is video generated based on video of the environment outside the vehicle.",
"VST can often replace the need to look out of a window (if the vehicle has windows).",
"Some examples of scenarios in which VST may be available in a vehicle include a windowless vehicle, a vehicle with shaded windows having VLT below 30%, and/or when the occupant wears a VR headset.",
"While traveling in such a vehicle, the occupant may benefit from gaining a view to the outside environment when an unexpected driving event occurs.",
"By being made aware of the event, the occupant is less likely to be surprised, disturbed, and/or distressed by the event.",
"While traveling in a vehicle, an occupant of the vehicle may not always be aware of the environment outside and/or of what actions the vehicle is about to take (e.g., breaking, turning, or hitting a speedbump).",
"Thus, if such an event occurs without the occupant being aware that it is about to happen, this may cause the occupant to be surprised, disturbed, distressed, and even physically thrown off balance (in a case where the event involves a significant change in the balance of the physical forces on the occupant).",
"This type of event is typically referred to herein as a Sudden Decrease in Ride Smoothness (SDRS) event.",
"Some examples of SDRS events include at least one of the following events: hitting a speed bump, driving over a pothole, climbing on the curb, making a sharp turn, a hard breaking, an unusual acceleration (e.g., 0-100 km/h in less than 6 seconds), and starting to drive after a full stop.",
"In some embodiments, an SDRS event takes place at least 2 minutes after starting to travel and it is not directly related to the act of the starting to travel.",
"Additionally, the SDRS event takes place at least 2 minutes before arriving to the destination and is not directly related to the act of arriving at the destination.",
"In one example, a sentence such as “an SDRS event is imminent” refers to an SDRS event that is: (i) related to traveling in the vehicle, and (ii) expected to happen in less than 30 seconds, less than 20 seconds, less than 10 seconds, or less than 5 seconds.",
"In another example, a sentence such as “an SDRS event is imminent” may refer to an event that starts at that instant, or is about to start within less than one second.",
"The following is a description of an embodiment of a video system that may be used to increase awareness of an occupant of a vehicle regarding an imminent SDRS.",
"In one embodiment, a video system for an autonomous on-road vehicle includes at least autonomous-driving control system 65, a camera (such as camera 12), a processor (such as processor 18), and video module 66.FIG.",
"17 is a schematic illustration of at least some of the relationships between the system elements mentioned above.",
"The autonomous-driving control system 65 is configured to generate, based on trajectory of the vehicle and information about the road, an indication indicative of whether a Sudden Decrease in Ride Smoothness (SDRS) event is imminent.",
"Optionally, the autonomous-driving control system 65 receives at least some of the information about the road from at least one of the following sources: sensors mounted to the vehicle, sensors mounted to nearby vehicles, an autonomous-driving control system 65 used to drive a nearby vehicle, and a database comprising descriptions of obstacles in the road that are expected to cause intense movement of the vehicle.",
"In one example, the database comprising the descriptions of the obstacles includes one or more of the following types of data: locations of speed bumps, locations of potholes, locations of stop signs, and locations of sharp turns in the road.",
"In one embodiment, the autonomous-driving control system 65 is configured to generate the indication indicative of whether an SDRS event is imminent based on at least one of the following configurations: (i) the autonomous-driving control system 65 receives images of the road from a camera, and calculates the indication based on the vehicle trajectory and image analysis of the images, (ii) the autonomous-driving control system 65 receives from a radar reflections of electromagnetic waves from the road, and calculates the indication based on the vehicle trajectory and signal processing of the reflections, and (iii) the autonomous-driving control system 65 receives a notification from a detailed road map, and calculates the indication based on the vehicle trajectory and the notification.",
"The camera, which is mounted to the vehicle, is configured to take video of the environment outside the vehicle.",
"Optionally, the data captured by the camera comprises 3D data.",
"The processor is configured to generate a video see-through (VST) based on the video taken by the camera.",
"The video module 66 is configured to select a first mode of presentation, in which a video-unrelated-to-the-VST (VUR) is presented on the foveal vision region of the occupant, at eye level, responsive to the indication not indicating that an SDRS event is imminent.",
"The video module 66 is further configured to select a second mode of presentation, in which the VST is presented on the foveal vision region of the occupant, at eye level, responsive to the indication indicating that an SDRS event is imminent.",
"Optionally, the VST captures more than 50% of the foveal vision region of the occupant in the second mode of presentation.",
"In some embodiments, presenting video on the foveal vision region comprises presenting images with at least 50% transparency.",
"Herein, “foveal vision” refers to an angle of about 5° of the sharpest field of vision.",
"In one embodiment, in the first mode of presentation, the VUR is presented on the foveal vision region of the occupant with opacity A, and the VST is presented on the foveal vision region of the occupant with opacity B, where A>B>0.Optionally, a normalized opacity parameter takes a value from 0.0 to 1.0, and the lower the value the more transparent the video is.",
"In this embodiment, in the second mode of presentation, the VUR is presented on the foveal vision region of the occupant with opacity A′, and the VST is presented on the foveal vision region of the occupant with opacity B′, where B′>B and B′>A′.",
"In optional embodiments, one or more of the following values may be true: A′>0, B=0, and A′=0.Herein, “partially transparent” refers to opacity below one and above zero.",
"Having the VST presented when an SDRS event is imminent can make the occupant be aware and prepared for the SDRS event.",
"Thus, the occupant is less likely to be startled, distressed, and/or physically thrown off balance by the SDRS event.",
"In one example, the SDRS event involves hitting a speedbump, while the occupant views a movie.",
"About 5 seconds prior to hitting the speedbump, a partially transparent window displaying VST in which the speedbump is highlighted (e.g., flashing red) is presented on the foveal vision region of the occupant for a couple seconds (e.g., by being presented in the center of the movie).",
"This way upon hitting the speedbump, the occupant is not startled by the event.",
"In another example, the autonomous-driving control system 65 determines that a “hard breaking” is required, e.g., in order to avoid collision with a vehicle ahead that slowed unexpectedly.",
"In this example, the occupant may be working on a virtual desktop, and within 100 milliseconds of when the determination is made that the vehicle is about to rapidly deaccelerate (a “hard breaking”), the VST depicting the rear of the vehicle ahead is displayed in the center of the virtual desktop.",
"This way the occupant is immediately made aware of why the vehicle is breaking and this notification may prompt the occupant to seek a more appropriate posture for the breaking.",
"Some illustrations of utilization of the different modes of operation are given in the following figures.",
"FIG.",
"18a illustrates presenting VUR responsive to not receiving from the autonomous-driving control system 65 an indication that an SDRS event is imminent.",
"This figure has two parts, the left part shows the vehicle driving over a clean road, and the right part shows the VUR.",
"FIG.",
"18b illustrates presenting VST responsive to receiving from the autonomous-driving control system 65 an indication that an SDRS event is imminent.",
"The figure has two parts, the left part shows the vehicle about to drive over a pothole, and the right part shows a small window showing the pothole over the VUR (optionally to warn the occupant).",
"FIG.",
"18c illustrates presenting VST responsive to receiving from the autonomous-driving control system 65 an indication that an SDRS event is imminent.",
"The figure has two parts, the left part shows the vehicle about to enter a sharp turn, and on the right part shows a small window showing the sharp turn over the VUR (optionally to warn the occupant).",
"Traditional vehicles typically have a front windshield that offers occupants of the vehicle a frontal view of the outside environment.",
"However, in some embodiments, this frontal view may be provided using the VST.",
"For example, in one embodiment, the vehicle includes a nontransparent element, which is coupled to the vehicle, and obstructs at least 30 degrees out of the frontal horizontal unaided FOV to the outside environment of an occupant at eye level.",
"In one example of a standard vehicle, such as Toyota Camry model 2015, the frontal horizontal unaided FOV extends from the left door through the windshield to the right door.",
"The use of the nontransparent element improves the safety of the occupant during a collision compared to a similar vehicle having the same total weight and comprising a transparent glass window instead of the nontransparent element.",
"The nontransparent element may be coupled to the vehicle in various configurations, in embodiments described herein.",
"In one embodiment, the nontransparent element is fixed to the vehicle at an angle, relative to the occupant, that is covered by the field of view of the VST, and the nontransparent element features visible light transmittance (VLT) below 10% of ambient light.",
"Various types of displays may be utilized to present the occupant with video (e.g., the VST and/or the VUR).",
"In one embodiment, the video is presented to the occupant on a screen coupled to the vehicle compartment.",
"In one example, the screen coupled to the vehicle compartment utilizes parallax barrier technology.",
"A parallax barrier is a device located in front of an image source, such as a liquid crystal display, to allow it to show a stereoscopic image or multiscopic image without the need for the viewer to wear 3D glasses.",
"The parallax barrier includes a layer of material with a series of precision slits, allowing each eye to see a different set of pixels, thus creating a sense of depth through parallax.",
"In another embodiment, the occupant wears a head-mounted display (HMD), and the HMD is used to present the video to the occupant.",
"Optionally, the HMD is a VR headset, and as a result of presenting the VST, the occupant does not need to remove the VR headset in order to see the cause of the SDRS event.",
"In some embodiments, the video module 66 may be selective regarding indications of which SRDS events may prompt it to operate in the second mode of operation.",
"For example, if the occupant is engaged in a game, the video module 66 may refrain from presenting the VST in the foveal vision region if the vehicle is about to make a sharp turn.",
"However, it may optionally still present the VST in the foveal vision region if the SDRS event involves something that may be more forcefully felt by the occupant, such as extreme evasive maneuvering performed to avoid a collision.",
"In some embodiments, the video module 66 may determine whether to show a VST responsive to an SRDS event (in the second mode of operation) based on the level of concentration of the occupant.",
"For example, if the occupant is deeply engaged in a certain activity (e.g., in work or playing a game) above a threshold, the video module 66 may refrain from operating in the second mode for certain SDRS events that would cause the video module 66 to operate in the second mode were the occupant engaged in the certain activity below the threshold.",
"In one example, the engagement level may be based on the occupant's level of concentration, as measured by a wearable sensor (such as an EEG headset or a smartwatch) or a sensor fixed to the compartment (such as an eye tracker, a thermal camera, or a movement sensor embedded in the seat).",
"Presenting an occupant of a vehicle with video see-through (VST) of the outside environment from a point of view of the occupant can help the occupant be prepared for various events that may be considered to cause a Sudden Decrease in Ride Smoothness (SDRS events).",
"Some examples of SDRS events include the following events: hitting a speed bump, driving over a pothole, climbing on the curb, making a sharp turn, a hard breaking, an unusual acceleration (e.g., 0-100 km/h in less than 6 seconds), and starting to drive after a full stop.",
"In order for the occupant to become aware of an imminent SDRS event, the VST needs to be presented in an attention-grabbing way.",
"For example, when an SDRS event is imminent, the VST that describes the environment is brought to the center of the occupant's attention by displaying it at eye level and/or increasing the size of the VST (compared to other times when an SDRS event is not imminent).",
"The following is a description of an embodiment of a video system that may be used to increase awareness of an occupant of a vehicle regarding an imminent SDRS by making the VST more prominent for an imminent SDRS.",
"In one embodiment, a video system for an autonomous on-road vehicle includes at least the autonomous-driving control system 65, a camera, and a processor.",
"In this embodiment, the occupant is engaged, at least part of the time, in entertainment- or work-related activities, which involve presentation of video-unrelated-to-the-VST (VUR) to the occupant, for example, on a screen coupled to the compartment of the vehicle or a HMD worn by the occupant.",
"Some examples of such content (common in the year 2016) include cinema movies, broadcast TV shows, standard web browsers, and Microsoft Office 2016 applications (such as Word, Excel and PowerPoint).",
"The camera, which is mounted to the vehicle, is configured to take video of the environment outside the vehicle.",
"The processor is configured to generate, based on the video taken by the camera, a video see-through (VST) of outside environment from a point of view of an occupant of the vehicle.",
"Optionally, the occupant is in a front seat of the vehicle (such that no other occupant in the vehicle is positioned ahead of the occupant).",
"In some embodiments, the processor is configured to present video, which may include VUR and/or VST, to the occupant using different presentation modes, depending on whether an SDRS event is imminent.",
"For example, the video may be presented according to first or second modes, depending on whether an SDRS event is imminent.",
"Optionally, the VST captures in the video according to the first mode a diagonal FOV of at least 3°, 5°, or 10° of the occupant's FOV.",
"Optionally, the VST is not presented in the foveal vision region of the occupant in the video according to the first mode, while the VST is presented in the foveal vision region of the occupant in the video according to the second mode.",
"In one embodiment, responsive to an indication that is not indicative of an imminent SDRS event (generated by the autonomous-driving control system 65), the processor is configured to provide the occupant video according to the first mode.",
"In the video according to the first mode, the occupant is presented with video that comprises a video-unrelated-to-the-VST (VUR) at eye level in the direction of forward traveling.",
"Additionally, the video may comprise a video see-through (VST) of outside environment that is not presented at eye level in the direction of forward traveling.",
"Receiving an indication indicative that an SDRS event is imminent may change the way video is presented to the occupant.",
"Optionally, this change is made without receiving a command to do so from the occupant.",
"In one embodiment, responsive to the indication indicating that an SDRS event is imminent, the processor is configured to provide video to the occupant video according to the second mode.",
"In the video according to the second mode, the occupant is presented with video that comprises the VST, presented at eye level in the direction of forward traveling.",
"Optionally, if the video according to the first mode includes VST, then the size of the VST window in the video according to the second mode is larger by at least 25% relative to the size of the VST window in the video according to the first mode.",
"Optionally, the video according to the second mode includes presenting the VUR in the background (e.g., the VST is overlaid above the VUR).",
"Optionally, while providing the video according to the second mode, responsive to an updated indication that does not indicate that an SDRS event is imminent, the processor is further configured to switch back to provide the video according to the first mode to the occupant.",
"The following figures illustrate various ways in which the videos according to the first and second modes may be utilized.",
"FIG.",
"19a illustrates presenting a VUR, which is a movie showing a person skiing, responsive to not receiving from the autonomous-driving control system 65 an indication that an SDRS event is imminent.",
"This figure has two parts, the left part shows the vehicle driving over a clean road, and the right part shows the VUR with a small VST on the right.",
"FIG.",
"19b illustrates presenting a VST responsive to receiving from the autonomous-driving control system 65 an indication that an SDRS event is imminent.",
"This figure has two parts, the left part shows the vehicle about to drive over a speed bump, and the right part shows the VUR but now with a big VST on the right.",
"In this example, the big VST captures about half of the VUR and shows the speed bump.",
"FIG.",
"19c illustrates presenting a partially transparent VST responsive to receiving from the autonomous-driving control system 65 an indication that an SDRS event is imminent.",
"Here, the big VST (that captures about half of the VUR and shows the speed bump) is presented as partially transparent layer over the VUR in order to show the occupant both the VUR and the VST.",
"In one embodiment, presenting to the occupant video according to the second mode involves presenting the VUR behind the VST, and the size and location of the VUR in the video according to the second mode is essentially the same as the size and location of the VUR in the video according to the first mode.",
"Optionally, this means that there is a difference of less than 10% in the size and location of the VURs in the videos according to the first and second modes.",
"In another embodiment, the VUR is presented in a diagonal FOV of at least 10 degrees, and is not based on the video taken by the camera.",
"In some embodiments, the VUR may be unrelated to the purpose of the traveling in the vehicle.",
"For example, the VUR may include videos related to the following activities: watching cinema movies, watching TV shows, checking personal emails, playing entertainment games, and surfing in social networks.",
"In some embodiments, the occupant's field of view (FOV) to the outside environment is obstructed by a nontransparent element, and the VST represents at least a portion of the obstructed FOV.",
"Optionally, the occupant uses a VR headset and the obstruction is due to a nontransparent element belonging to the VR headset.",
"Additionally or alternatively, the obstruction may be due to the vehicle's compartment; in this case the nontransparent element may be an SAEDP, a safety beam, and/or a crumple zone at eye level, which obstruct at least 30 degrees out of the frontal horizontal unaided FOV to the outside environment of the occupant at eye level.",
"When traveling in a vehicle, an occupant of the vehicle may not always be viewing the outside environment.",
"For example, the occupant may be engaged in work- or entertainment-related activities.",
"Additionally, in some vehicles, the occupant may not have a good view of the outside environment most of the time, or even all of the time.",
"For example, the vehicle may have very few (or no) windows, or the vehicle may have a shading mechanism that reduces the light from the outside.",
"However, there are times when the occupant should be made aware of the outside environment, even though the occupant may not be actively driving the vehicle.",
"For example, the occupant may be made aware of the outside environment in order to make the occupant prepared for an event that causes a Sudden Decrease in Ride Smoothness (an SDRS event).",
"Some examples of SDRS events include the following events: hitting a speed bump, driving over a pothole, climbing on the curb, making a sharp turn, a hard breaking, an unusual acceleration (e.g., 0-100 km/h in less than 6 seconds), and starting to drive after a full stop.",
"In order for the occupant to become aware of an imminent SDRS event, in some embodiments that involve a vehicle that has a shading module that controls how much ambient light is let in, when an SDRS event is imminent the vehicle may increase the amount of light that enters via a window.",
"This additional light can give an occupant a better view of the outside environment, which can make the occupant aware and better prepared for the SDRS.",
"The following is a description of an embodiment of a system that may be used to increase awareness of an occupant of a vehicle regarding an imminent SDRS by enabling more ambient light to enter a vehicle via a window.",
"In one embodiment, a shading system for a window of an autonomous on-road vehicle includes at least the autonomous-driving control system 65, a shading module, and a processor.",
"FIG.",
"20a illustrates a smart glass shading module that operates according to an indication that an SDRS event is not imminent.",
"This figure has two parts, the left part shows the vehicle driving over a clean road, and the right part shows that the smart glass window blocks most of the ambient light (illustrated in the figure by the tree outside that is invisible to the occupant).",
"FIG.",
"20b illustrates the smart glass shading module that operates according to an indication that an SDRS event is imminent.",
"This figure has two parts, the left part shows the vehicle about to drive over a pothole, and the right part shows that the smart glass window does not block the ambient light (illustrated in the figure by the tree outside that is visible to the occupant).",
"The shading module is configured to control the amount of ambient light that enters the vehicle via the window.",
"Optionally, the window is a front-facing window (e.g., a windshield).",
"Optionally, the window is a side-facing window.",
"There are various types of shading modules that may be utilized in different embodiments.",
"In one embodiment, the shading module comprises a curtain.",
"Optionally, the curtain covers most of the area of the window.",
"Optionally, the curtain may open and close with the aid of an electromechanical device, such as a motor, based on commands issued by the processor.",
"In another embodiment, the shading module is a movable physical element configured to reduce the intensity of the ambient light entering through the vehicle window into the vehicle compartment.",
"For example, the shading module may include various forms of blinds, a shutter, or a sliding element.",
"Optionally, the shading module may be unfurled on the inside of the vehicle compartment in order to block more than 70% of the ambient light intensity.",
"Optionally, the shading module may be unfurled on the outside of the vehicle compartment in order to block more than 70% of the ambient light intensity.",
"In yet another embodiment, the shading module comprises a smart glass able to change its light transmission level.",
"Optionally, the smart glass is a vehicle window smart glass that comprises suspended particle devices (SPDs) film.",
"Smart glass window may also be known as a switchable glass, a smart window, and/or a switchable window.",
"Smart glass is glass or glazing whose light transmission properties are altered when voltage, current, light or heat is applied.",
"Examples of electrically switchable smart glass include: suspended particle devices (SPDs), electrochromic devices, transition-metal hydride electrochromics devices, modified porous nano-crystalline films, polymer dispersed liquid crystal devices, micro-blinds, and thin coating of nanocrystals embedded in glass.",
"Examples of non-electrical smart glass include: mechanical smart windows, Vistamatic®, and Sunvalve.",
"The processor is configured to command the shading module to operate in different modes based on indications generated by the autonomous-driving control system 65.In some embodiments, the processor is configured to command the shading module to operate in different modes that allow different amounts of the ambient light to enter the vehicle via the window, depending on whether an SDRS event is imminent.",
"For example, shading module may operate in first or second modes, depending on whether an SDRS event is imminent.",
"Optionally, in the first mode the shading module blocks more of the ambient light entering through the vehicle window than in the second mode.",
"Optionally, the increased ambient light in the second mode can help make the occupant more aware of the outside environment, which can enable the occupant to prepare for the SDRS event.",
"In one embodiment, responsive to an indication that no SDRS event is imminent, the processor is configured to command a shading module to operate in a first mode in which the shading module blocks more than 30% of ambient light entering through a window of the vehicle.",
"Receiving an indication indicative that an SDRS event is imminent may change the amount of ambient light that enters the vehicle via the window.",
"Optionally, this change is made without receiving a command to do so from the occupant.",
"In one embodiment, responsive to an indication that an SDRS event is imminent, the processor is configured to command the shading module to operate in the second mode in which the shading module blocks less than 90% of the ambient light entering through the vehicle window.",
"Some aspects of this disclosure include a system that can show an occupant of a vehicle and Object Of Interest (OOI) in the outside environment, which the occupant would otherwise miss (e.g., due to being engaged in work- or entertainment-related activities and/or having no direct view of the outside environment).",
"In one embodiment, a system configured to identify an Object Of Interest (OOI) in the outside environment, and to present to an occupant of an autonomous on-road vehicle a video see-through (VST) that comprises the OOI, includes at least a camera (such as camera 12), a processor (such as processor 18), and a video module (such as video module 66).",
"Different types of things may be considered an OOI in different embodiments.",
"In one embodiment, the OOI is selected from a set comprising: types of vehicles, types of scenery, and types of people.",
"Optionally, the system may include a user interface configured to present a menu that enables the occupant to select the types of OOI, which when identified, will be presented in the second mode of presentation.",
"In one example, an OOI may be any type of high-end vehicle (e.g., a Porsche).",
"In another example, an OOI may include an ocean view.",
"The camera, which is mounted to the vehicle, is configured to take video of the environment outside the vehicle.",
"Optionally, the data captured by the camera comprises 3D data.",
"The processor is configured to generate, based on the video taken by the camera, a video see-through (VST) of outside environment from a point of view of an occupant of the vehicle.",
"Optionally, the occupant is in a front seat of the vehicle (such that no other occupant in the vehicle is positioned ahead of the occupant).",
"The video module is configured to present, to the occupant, video that captures diagonal field of view (FOV) of at least 10 degrees, at eye level.",
"Optionally, the video module is further configured to select a mode of operation based on whether an indication is received that is indicative of whether video taken by the camera include the OOI.",
"Optionally, changing a mode of operation is done without an expressed command at that time by the occupant.",
"In one embodiment, when not receiving an indication that the images includes the OOI, the video module is configured to select a first mode of presentation, in which a video-unrelated-to-the-VST (VUR) is presented on the foveal vision region of the occupant.",
"And responsive to receiving the indication that the images include the OOI, the video module is further configured to select a second mode of presentation, in which the VST is presented on the foveal vision region of the occupant.",
"There are various ways in which an indication of the OOI may be generated in different embodiments.",
"In one embodiment, the system includes an image processing module configured to identify the OOI in the VST and to generate the indication.",
"Various image processing techniques and/or image identification methods known in the art may be utilized by the image processing module for this task.",
"In another embodiment, the system may include the autonomous-driving control system 65 configured to utilize a positioning system, such as GPS coordinates, to identify that the vehicle reached the OOI and to generate the indication.",
"Optionally, the occupant may define which places may be OOIs and/or what types of locations are to be considered OOIs (e.g., historical monuments, nice scenery, etc.).",
"In still another embodiment, the system may include a crowd-based module configured to identify the OOI based on feedback received from many different occupants who watched VSTs comprising the OOI.",
"Optionally, this feedback may be derived based on indications of how other occupants felt about the VST (when it depicted certain content corresponding to OOIs).",
"For example, points of interest may be determined according to affective crowd data, determine based on how other occupants felt about what they saw, and optionally find places where the crowd affective response was positive (e.g., blooming of flowers, etc.).",
"Optionally, some occupants who watched the video related to the unhindered FOV for long periods (or have a physical window) may be monitored to see when an interesting view is encountered.",
"Points of interest may involve items identified in the exterior environment using image analysis, including presenting the VST when one or more of the following happens: passing a fancy vehicle, passing someone the occupant knows, passing a vehicle accident, passing a police officer, having a sunset view, and passing an animal the occupant is interested in.",
"In one embodiment, the system may receive an indication that the occupant is feeling at least one of nauseous and claustrophobic, and consequently present the VST in order to help the occupant to confront the feeling.",
"For example, when there is a serious spike (e.g., increase in heart-rate and sweating), then the system may present the VST automatically.",
"The system may also present a “normal” interior to the occupant (e.g., natural lighting settings).",
"Optionally, when digital content is consumed (e.g., a game or a movie), the system may check whether the affective spike (e.g., increased excitement) is due to the content or due to the experience of being in the vehicle with AR or VR.",
"If it is the former case, then the system might not present the VST.",
"Some aspects of this disclosure involve an autonomous on-road vehicle that includes a nontransparent Shock-Absorbing Energy Dissipation Padding (SAEDP) that is coupled to the compartment of the vehicle and is located, during normal driving, at eye level in front of an occupant who sits in a front seat of the vehicle.",
"Additionally, the vehicle includes a stiff element that is configured to support the SAEDP and to resist deformation during collision in order to reduce compartment intrusion.",
"The stiff element is located, during normal driving, at eye level between the SAEDP and the outside environment.",
"Thus, the combination of the SAEDP and the stiff element offers the occupant an increased level of protection, e.g., in the case of a collision, compared to a vehicle in which a traditional window is in place at eye level in the front of the vehicle.",
"However, due to it being nontransparent, placing the SAEDP at eye level may obstruct the occupant's view to the outside.",
"Thus, in order to offer the occupant such a view, in some embodiments, the vehicle also includes a camera configured to take video of the outside environment in front of the occupant, and a computer configured to generate, based on the video, a representation of the outside environment in front of the occupant at eye level.",
"This representation may be provided to the occupant using various types of displays.",
"One non-limiting advantage of the vehicle described above is that it increases the safety of the occupant in the case of a collision, without prohibiting the occupant from obtaining a view of the outside environment.",
"In one embodiment, an autonomous on-road vehicle includes a compartment, which one or more occupants may occupy while traveling in the vehicle (e.g., by sitting in seats).",
"Coupled to the front of the compartment is a Shock-Absorbing Energy Dissipation Padding (SAEDP) and a stiff element that supports the SAEDP.",
"Optionally, the SAEDP is nontransparent.",
"The stiff element is located, during normal driving, at eye level between the SAEDP and the outside environment.",
"Additionally, the vehicle includes a camera (e.g., camera 142 or structure 147 that comprises multiple cameras), which is configured to take video of the outside environment in front of the occupant, and a computer (e.g., computer 143) that is configured to generate, based on the video, a representation of the outside environment in front of the occupant at eye level.",
"Optionally, the camera, and/or each of the cameras in the structure 147, may be based on at least one of the following sensors: a CCD sensor, a CMOS sensor, a near infrared (NIR) sensor, an infrared sensor (IR), and a device based on active illumination such as a LiDAR.",
"Optionally, when the camera comprises multiple cameras, the multiple cameras are directed to multiple directions around the vehicle, and the multiple cameras support generating multiple representations of the outside environment from different points of view.",
"It is to be noted that in some embodiments, the SAEDP may be fixed at its location both in normal driving and in times that are not considered to correspond to normal driving, while in other embodiments, the SAEDP may change its location during at least some of the times that do not correspond to normal driving.",
"The SAEDP is coupled to the compartment in such a way that it is located, during normal driving, at eye level in front of an occupant who sits in a front seat of the vehicle.",
"Different types of SAEDPs may be utilized in different embodiments.",
"In one embodiment, the SAEDP comprises a passive material that is less stiff than a standard automotive glass window.",
"The passive material is configured to protect the occupant's head against hitting the inner side of the vehicle compartment during a collision.",
"Optionally, the passive material has thickness greater than at least one of the following thicknesses: 1 cm, 2 cm, 5 cm, 10 cm, 15 cm, and 20 cm.",
"Optionally, the thickness of the passive material may refer to the average thickness of the SAEDP across the portion of the SAEDP at eye level.",
"Alternatively, the thickness may refer to the maximal thickness at some position of the SAEDP (which is at least one of the values mentioned above).",
"In another embodiment, the SAEDP comprises a pneumatic pad that is configured to inflate in order to protect the occupant's head against hitting the inner side of the vehicle compartment during collision.",
"In some examples, the pneumatic pads may be formed from an elastomeric material providing chambers containing air or another gas.",
"Optionally, the chambers are retained in compressed deflated condition until being inflated by the admission of gas pressure controlled by the vehicle's autonomous-driving control system that is responsible to estimate the probability and severity of an imminent collision.",
"Additionally or alternatively, the chambers may be provided with restricted passages limiting the flow out from the chambers to provide shock-absorbing energy dissipation to reduce the rebound effect.",
"U.S. Pat.",
"No.",
"5,382,051 discloses examples for pneumatic pads that can be used with some of the embodiments.",
"In yet another embodiment, the SAEDP comprises an automotive airbag, which is configured to protect the occupant's head against hitting the inner side of the vehicle compartment during collision.",
"In one example, during normal driving, the airbag is in a stowed state.",
"The airbag is coupled to an inflator configured to inflate the airbag with gas to an inflated state, upon receiving an indication indicative of a probability of an impact of the vehicle exceeding a threshold.",
"In this example, the airbag is located, when in the stowed state, at eye level in front of the occupant.",
"In some embodiments, the compartment may include a door, and the SAEDP is physically coupled to the door from the inside, such that the SAEDP moves with the door as the door opens and/or closes.",
"In some embodiments, the vehicle may include a second SAEDP coupled to the outer front of the vehicle to minimize damage to a pedestrian during a pedestrian-vehicle collision.",
"In one embodiment, the stiff element that supports the SAEDP is nontransparent.",
"In another embodiment, the stiff element may be automotive laminated glass or automotive tempered glass.",
"Optionally, the structure of the vehicle comprises a crumple zone located at eye level between the stiff element and the outside environment.",
"The representation of the outside environment is intended to provide the occupant with some details describing the outside environment.",
"In some embodiments, the representation of the outside environment is generated from the point of view of the occupant, and it represents how a view of the outside environment would look like to the occupant, had there been a transparent window at eye level instead of the SAEDP and/or the stiff element.",
"Optionally, a display is utilized to present the representation to the occupant.",
"Various types of displays may be utilized in different embodiments to present the representation of the outside environment to the occupant.",
"In one embodiment, the display is comprised in an HMD, and the vehicle further comprises a communication system configured to transmit the representation to the HMD.",
"For example, the HMD may be a virtual reality system, an augmented reality system, or a mixed-reality system.",
"In one embodiment, the display is supported by at least one of the SAEDP and the stiff element.",
"For example, the display is physically coupled to the SAEDP and/or the stiff element.",
"Optionally, the display is a flexible display.",
"For example, the flexible display may be based on at least one of the following technologies and their variants: OLED, organic thin film transistors (OTFT), electronic paper (e-paper), rollable display, and flexible AMOLED.",
"In one example, the display is flexible enough such that it does not degrade the performance of the SAEDP by more than 20% during a collision.",
"In one example, the performance of the SAEDP is measured by hitting a crash test dummy head against the SAEDP and measuring the head's deceleration using sensors embedded in the head.",
"FIG.",
"21a, FIG.",
"21b, and FIG.",
"22 illustrate various embodiments of the vehicle described above.",
"Each of the illustrated vehicles comprises a cross-section view of the vehicles, where each includes a compartment 145 for a single occupant (in FIG.",
"21b) or more (in FIG.",
"21a and FIG.",
"22).",
"In the figures, much of the compartment is covered with the SAEDP 140, which is nontransparent and comprises a soft passive material (cushiony in its nature).",
"Supporting the SAEDP 140 is a stiff element 141, which in the illustrations comprises portions of the exterior (hull) of the vehicle which may optionally be made of one or more of the following materials: fiber-reinforced polymer, carbon fiber reinforced polymer, steel, and aluminum.",
"The vehicles also include a camera (such as camera 142 and/or structure 147 that houses multiple cameras), which is positioned to capture a front view of the outside environment of the vehicle.",
"Additionally, the vehicles include a computer 143, which may be positioned in various locations in the vehicle.",
"In some embodiments, the computer may be comprised of multiple processors and/or graphics processors that may be located at various locations in the vehicle.",
"The figures illustrate various types of displays that may be utilized to present the occupant with the representation of the outside environment generated by the computer 143 based on the video taken by the camera 142.In FIG.",
"21a the representation is presented via an HMD 144, which may be, for example, a virtual reality HMD.",
"In FIG.",
"21b the representation is presented via an HMD 146, which may be, for example, a mixed-reality headset.",
"And in FIG.",
"22 the representation may be provided via one or more of the displays 150, which are coupled to the compartment.",
"It is to be noted that in the figures described above not all of the described elements appear in each figure.",
"The figures also illustrate various structural alternatives that may be implemented in different embodiments described herein.",
"For example, FIG.",
"21a illustrates a vehicle that includes window 148, which may optionally be an automotive tempered glass window, located in a location in which the head of a belted occupant is not expected to hit during collision.",
"FIG.",
"21b illustrates a vehicle that includes crumple zone 149, which is located at the front of the vehicle at eye level.",
"The figure also illustrates the structure 147 that houses multiple cameras directed to multiple directions around the vehicle.",
"In some embodiments, the representation of the outside environment may be manipulated in order to improve how the outside environment looks to the occupant.",
"Optionally, this may be done utilizing the computer.",
"In one example, manipulating the representation includes at least one of the following manipulations: converting captured video of an overcast day to video of a sunny day by preserving main items in the captured video (such as vehicles and buildings) and applying effects of a sunny day, converting unpleasant environment to a nice one, converting standard vehicles to futuristic or old fashion vehicles, and adding fans standing outside and waiving to the occupant.",
"In one embodiment, the manipulation maintains the main items in the environment, such that the occupant would still know from the manipulated representation where he/she is traveling.",
"In another embodiment, the manipulated representation maintains the main objects in the video of the outside environment, such that the main objects presented in the manipulated video essentially match the main objects that would have been seen without the manipulation.",
"In some embodiments, the vehicle compartment may include an automotive laminated glass window or automotive tempered glass window located in a location where the head of a belted occupant is not expected to hit as a result of collision while traveling in velocity of less than 50 km/h, as illustrated by the dotted rectangle 148 in FIG.",
"21a.",
"In one embodiment, the structure of the vehicle is such that a crumple zone is located at eye level between the stiff element and the outside environment.",
"Various types of vehicles may benefit from utilization of the nontransparent SAEDP supported by the stiff element and in conjunction with the camera and computer, as described above.",
"The following are some examples of different characterizations of vehicles in different embodiments.",
"In one embodiment, the vehicle weighs less than 1,500 kg without batteries, and it is designed to carry up to five occupants.",
"In another embodiment, the vehicle weighs less than 1,000 kg without batteries, and it comprises an engine that is able to sustain continuously at most 80 horsepower.",
"In yet another embodiment, the vehicle weighs less than 1,000 kg and it is designed to carry up to two occupants.",
"In still another embodiment, the vehicle weighs less than 800 kg without batteries, and it comprises an engine that is able to sustain continuously at most 60 horsepower.",
"In yet another embodiment, the vehicle weighs less than 500 kg without batteries and it comprises an engine that is able to sustain continuously at most 40 horsepower.",
"And in still another embodiment, the vehicle weighs less than 400 kg without batteries and is designed to carry up to two occupants.",
"Some aspects of this disclosure involve an autonomous on-road vehicle that includes a nontransparent Shock-Absorbing Energy Dissipation Padding (SAEDP) that is coupled to the compartment and is located, during normal driving, at eye level to the left of the occupant who sits in a front seat of the vehicle (in the left front seat when the vehicle has more than one front seat).",
"The SAEDP obstructs at least 30 degrees out of the horizontal unaided field of view (FOV) to the outside environment to the left of the occupant at eye level.",
"Additionally, the vehicle includes a stiff element that is configured to support the SAEDP and to resist deformation during collision in order to reduce compartment intrusion.",
"The stiff element is located, during normal driving, at eye level between the SAEDP and the outside environment.",
"Thus, the combination of the SAEDP and the stiff element offers the occupant an increased level of protection, e.g., in the case of a collision to the left side of the vehicle, compared to a vehicle in which a traditional window is in place at eye level on the left side of the vehicle.",
"However, due to it being nontransparent, placing the SAEDP at eye level may obstruct the occupant's view to the outside.",
"Thus, in order to offer the occupant such a view, in some embodiments, the vehicle also includes a camera configured to take video of the outside environment to the left of the occupant, and a computer, which is configured to generate, based on the video, a representation of the outside environment to the left of the occupant at eye level.",
"This representation may be provided to the occupant using various types of displays.",
"One non-limiting advantage of the vehicle described above is that it increases the safety of the occupant in the case of a side collision, without prohibiting the occupant from obtaining a side view of the outside environment.",
"In one embodiment, an autonomous on-road vehicle includes a compartment, which one or more occupants may occupy while traveling in the vehicle (e.g., by sitting in seats).",
"Coupled to the compartment is a Shock-Absorbing Energy Dissipation Padding (SAEDP) and a stiff element that supports the SAEDP.",
"Optionally, the SAEDP is nontransparent.",
"The SAEDP is located, during normal driving, at eye level to the left of the occupant who sits in a front seat of the vehicle.",
"The stiff element is located, during normal driving, at eye level between the SAEDP and the outside environment.",
"Optionally, the stiff element is nontransparent.",
"Optionally, the stiff element may be automotive laminated glass or automotive tempered glass.",
"The vehicle also includes a camera (such as camera 161) that is configured to take video of the outside environment to the left of the occupant, and a computer that is configured to generate, based on the video, a representation of the outside environment to the left of the occupant at eye level.",
"Optionally, the camera comprises multiple cameras directed to multiple directions around the vehicle, and the multiple cameras support generating multiple representations of the outside environment from different points of view.",
"FIG.",
"23 illustrates one embodiment of the autonomous on-road vehicle described above, which shows how an SAEDP protects the occupant during a collision.",
"In the figure, SAEDP 160 (which may comprise a passive material) is coupled to the stiff element 141.When another vehicle collides with the side of the vehicle, the occupants head strikes the soft SAEDP 160, instead of a glass window (which would be positioned there in many conventional vehicles).",
"The SAEDP is coupled to the compartment in such a way that it is located, during normal driving, at eye level to the left of the occupant who sits in a front seat of the vehicle.",
"Optionally, due to its location, the SAEDP obstructs at least 30 degrees out of the horizontal unaided field of view (FOV) to the outside environment to the left of the occupant at eye level.",
"Optionally, the SAEDP obstructs at least 45 degrees or at least 60 degrees out of the horizontal unaided FOV to the outside environment to the left of the occupant at eye level.",
"In one example of a standard vehicle, such as Toyota Camry model 2015, the frontal horizontal unaided FOV extends from the left door through the windshield to the right door.",
"In some embodiments, the SAEDP is fixed to the left door of the vehicle.",
"In one embodiment, the vehicle has a single seat (occupied by the occupant).",
"In another embodiment, the vehicle has two or more front seats and the occupant occupies the leftmost of the two or more front seats.",
"Different types of SAEDPs may be utilized in different embodiments.",
"In one embodiment, the SAEDP comprises a passive material, which is less stiff than a standard automotive glass window, having a thickness greater than at least one of the following thicknesses: 1 cm, 2 cm, 5 cm, 10 cm, 15 cm, and 20 cm.",
"In other embodiments, the SAEDP may include an automotive airbag or a pneumatic pad that is configured to inflate in order to protect the occupant's head against hitting the inner side of the vehicle compartment during collision.",
"In a similar fashion to how the SAEDP and stiff element are utilized to help protect the left side of the occupant, the same setup may be applied to the right side of the vehicle, in order to help protect that side.",
"Thus, in some embodiments, the vehicle may further include a second SAEDP located at eye level to the right of the occupant who sits in the front seat, and a second stiff element located at eye level between the second SAEDP and the outside environment.",
"Optionally, the second SAEDP obstructs at least 20 degrees out of the horizontal unaided FOV to the outside environment to the right of the occupant at eye level, and the computer is further configured to generate a second representation of the outside environment to the right of the occupant.",
"Some aspects of this disclosure involve an autonomous on-road vehicle that includes a nontransparent Shock-Absorbing Energy Dissipation Padding (SAEDP) that can cover a side window that enables an occupant of the vehicle to see the outside environment.",
"The side window is located at eye level of an occupant who sits in the vehicle.",
"A motor is configured to move the SAEDP over a sliding mechanism between first and second states multiple times without having to be repaired.",
"A processor is configured to receive, from an autonomous-driving control system, an indication that a probability of an imminent collision reaches a threshold, and to command the motor to move the SAEDP from the first state to the second state.",
"In the first state the SAEDP does not block the occupant's eye level view to the outside environment, and in the second state the SAEDP blocks the occupant's eye level view to the outside environment in order to protect the occupant's head against hitting the side window during collision.",
"One non-limiting advantage of the vehicle described above is that it increases the safety of the occupant in the case of a side collision.",
"In one embodiment, an autonomous on-road vehicle includes a side window 170, a nontransparent SAEDP (e.g., SAEDP 171), a motor 172, and a processor 175.The processor 175 is configured to receive, from an autonomous-driving control system (such as autonomous-driving control system 65), an indication indicating that a probability of an imminent collision reaches a threshold, and to command the motor 172 to move the SAEDP 171 from the first state to the second state.",
"In the first state the SAEDP 171 does not block the occupant's eye level view to the outside environment, and in the second state, the SAEDP 171 blocks the occupant's eye level view to the outside environment in order to protect the occupant's head against hitting the side window during collision.",
"Optionally, the processor is configured to command the motor 172 to start moving the SAEDP 171 to the second state at least 0.2 second, 0.5 second, 1 second, or 2 seconds before the expected time of the collision.",
"The motor 172 is configured to move the SAEDP 171 over a sliding mechanism 173 between first and second states multiple times without having to be repaired.",
"For example, during the same voyage, the SAEDP 171 may go up and down multiple times without a need for the occupant or anyone else to repair the SAEDP 171 and/or other components (such as motor 172 or the window 170) in order to the SAEDP 171 to be able to continue its operation correctly (i.e., continue moving up and down when needed).",
"In some examples, the motor 172 is a motor designed to move the SAEDP 171 more than twice, more than 100 times, and/or more than 10,000 times without being replaced.",
"The side window 170 is located at eye level of an occupant who sits in the vehicle, which enables the occupant to see the outside environment.",
"In one embodiment, the side window 170 is a power window.",
"In this embodiment, the power window comprises a window regulator that transfers power from a window motor 177 to the side window glass in order to move it up or down.",
"The motor 172 is coupled to an SAEDP regulator that transfers power from the motor 172 to the SAEDP 171 in order to move it up or down.",
"In this embodiment, the SAEDP regulator is located closer to the inner side of the compartment then the window regulator.",
"Optionally, the motor 172 and the window motor 177 may be of the same type or of different types.",
"In one embodiment, the SAEDP 171 comprises a passive material, which is less stiff than a standard automotive glass window, having thickness greater than at least one of the following thicknesses: 1 cm, 2 cm, 5 cm, 10 cm, 15 cm, and 20 cm.",
"Optionally, the vehicle may include a storage space in a door of the vehicle, which is configured to store the SAEDP 171 in the first state.",
"Additionally or alternatively, the vehicle may include a storage space in the roof of the vehicle, which is configured to store the SAEDP 171 in the first state.",
"Optionally, the SAEDP 171 may move upwards when switching between the first and second states, and the top of the SAEDP has a profile (such as a triangle or a quarter sphere) which reduces the risk of catching the a part of the occupant (e.g., a finger or limb) or the occupant's clothing, between the top of the SAEDP 171 and an upper frame when moving the SAEDP 171 to the second state.",
"In one embodiment, when switching the SAEDP 171 quickly between the first and second states, the SAEDP 171 is configured not to cover a range of 1 to 5 cm of the top height of the window.",
"Optionally, keeping said range unoccupied reduces the risk of catching the occupant's fingers or limb by the edge of the SAEDP 171 when moving the SAEDP 171 to the second state.",
"In some embodiments, the vehicle may include additional SAEDPs that cover additional regions of the vehicle's compartment (besides the side window 170).",
"In one example, the vehicle includes an SAEDP 176 that covers at least a portion of the roof of the vehicle.",
"In some embodiments, the vehicle includes a camera (e.g., camera 178a), which is configured to take video of the outside environment while the SAEDP 171 is in the second state.",
"Additionally, in these embodiments, the vehicle may include a computer (such as computer 13), which is configured to generate a representation of the outside environment based on the video, and a display configured to present the representation of the outside environment to the occupant.",
"The display may be physically coupled to the compartment and/or belong to an HMD.",
"Optionally, the camera is fixed to the SAEDP 171, and thus moves along with the SAEDP 171 when it is moved between the first and second states.",
"Optionally, the display is fixed to the SAEDP 171, and thus moves along with the SAEDP 171 when it is moved between the first and second states.",
"Optionally, the display is configured to show, at eye level, a representation of the outside environment when the SAEDP is in the second state.",
"In one example, the display is a flexible display.",
"In another example, the camera comprises multiple cameras directed to multiple directions around the vehicle, and the computer is configured to generate at least two different representations of the outside environment, from at least two different points of view, for two occupants who sit in the vehicle.",
"In some embodiments, in addition to raising the SAEDP 171, one or more of the displays mentioned above is utilized to present the occupant a video of the threat and the predicted trajectory that could result in the collision, in order to explain why the SAEDP 171 is being moved to the second state.",
"FIG.",
"24a and FIG.",
"24b illustrate an example of a vehicle in which the side window may be covered by an SAEDP that can move up and down.",
"The figures illustrate cross-sections of the vehicle, which show how the SAEDP 171 may move from the first state (in FIG.",
"24a) to the second state (in FIG.",
"24b).",
"The dotted line 179 indicates that the SADEP 171 does not close the entire gap over the window (e.g., in order to avoid catching the occupant's hair).",
"The figures also illustrate sliding mechanism 173, which may be utilized to guide and assist in the movement of SAEDP 171.FIG.",
"24b also illustrates camera 178a and display 178b, which are connected to a processor that generates, based on the video received from the camera, a view of the outside environment when an SAEDP (on the right side of the vehicle) is in the second state.",
"The view of the outside environment is presented to the occupant on the display 178b.",
"Camera and display on the left SAEDP 171, which correspond to camera 178a and display 178b, are not shown in the figure in order to make it clearer; however it is to be understood that such camera and display may be fitted to any relevant moving SAEDP.",
"In one embodiment, the mechanism that moves the SAEDP 171 between the first and second states (referred to as the “SAEDP mechanism”) is similar to a power window regulator that moves an automobile window up and down.",
"As with automobile power windows, the SAEDP regulator may be powered by an electric motor, which may come with the SAEDP regulator as one unit, or as a system that enables the motor or regulator to be replaced separately.",
"The SAEDP mechanism includes a control system, a motor, a gear reduction, a sliding mechanism and the SAEDP, which are usually fixed on the door, but may alternatively be fixed on the roof as disclosed below.",
"The sliding mechanism may have different architectures, such as Bowden type, double Bowden type, cable spiral, or crossed levers.",
"In a first example, the SAEDP mechanism is similar to a double Bowden power window mechanism, in which the SAEDP 171 is fixed on two supports respectively constrained along two rails.",
"The control system drives the motor that wraps two Bowden cables, which move two supports and, consequently, the SAEDP 171.A Bowden cable transmits mechanical force through the movement of an inner cable relative to an outer housing, and in the case of a DC motor, the basic operations of the motor are accomplished by reversing the polarity of its power and ground input.",
"In a second example, the SAEDP mechanism is similar to a gear-drive type power window regulator; in this case, the SAEDP mechanism includes an SAEDP motor to power the mechanism, gear drive and geared arm to move the SAEDP 171 between the first and second states, and an SAEDP holding bracket to hold the SAEDP 171.In a third example, the SAEDP mechanism is similar to a cable type power window regulator; in this case, the SAEDP regulator includes an SAEDP motor that drives a wire cable though a mechanism, a series of pulleys that guide the cable, and a regulator carriage attached to the cable and to the SAEDP 171 and slides on the regulator track.",
"One or more tracks may be mounted vertically inside the door panel that serves as a guide piece when the SAEDP 171 slides up and down.",
"Depending on the design, the setup may have one main regulator track in the center of the door, or have a track on each side of the SAEDP.",
"In a fourth example, the SAEDP regulator is similar to a scissor power window regulator; in this case, a motor operates a gear wheel that raises and lowers the SAEDP 171 by the use of a scissor action of rigid bars.",
"The motor that moves the SAEDP 171 over the sliding mechanism may be any suitable motor, such as a DC electric motor, an AC electric motor, or a pneumatic motor.",
"In one embodiment, the indication that the probability of an imminent collision reaches a threshold is received from the autonomous-driving control system 65 that calculates the probability based on the trajectory of the vehicle and information about the road.",
"Optionally, the information about the road may be received from one of more of the following sources: a sensor mounted to the vehicle, a sensor mounted on a nearby vehicle, a road map, a stationary traffic controller nearby the vehicle, and a central traffic controller that communicates with the vehicle via wireless channel.",
"In one embodiment, the processor 175 is further configured to receive an updated indication that the probability of the imminent collision does not reach a second threshold, and to command the motor to move the SAEDP to the first state.",
"In this embodiment, the second threshold denotes a probability for a collision that is equal or lower than the threshold.",
"FIG.",
"25a and FIG.",
"25b illustrate a motor configured to move a front nontransparent Shock-Absorbing Energy Dissipation Padding (SAEDP) between first and second states.",
"Some aspects of this disclosure involve an autonomous on-road vehicle that includes an outer nontransparent Shock-Absorbing Energy Dissipation Padding (SAEDP) mounted to the front side of the vehicle during normal driving, such that the SAEDP is in front of and at eye level of an occupant who sits in a front seat of the vehicle.",
"Additionally, the vehicle includes a camera that is mounted to the vehicle and is configured to take video of the outside environment in front of the occupant, and a computer configured to generate, based on the video, a representation of the outside environment at eye level for the occupant.",
"One non-limiting advantage of the vehicle described above is that it increases the safety of a pedestrian in case of a vehicle-pedestrian collision, without prohibiting the occupant of the vehicle from receiving a frontal view of the outside environment.",
"FIG.",
"26a illustrates one embodiment of an autonomous on-road vehicle that includes outer nontransparent SAEDP 190, which is mounted to the front side of the vehicle during normal driving, such that the SAEDP 190 is in front of and at eye level of an occupant who sits in a front seat of the vehicle.",
"The SAEDP 190 is less stiff than a standard automotive glass window and is designed to absorb some of the crashing energy transmitted to a pedestrian during a pedestrian-vehicle collision.",
"Additionally, the vehicle includes a camera (such as camera 142), which is mounted to the vehicle and is configured to take video of the outside environment in front of the occupant, and a computer (such as computer 143), which is configured to generate, based on the video, a representation of the outside environment at eye level for the occupant.",
"Optionally, the representation is generated from the point of view of the occupant.",
"Optionally, the vehicle includes a display configured to present the representation to the occupant.",
"For example, the display may belong to an HMD worn by the occupant.",
"In another example, the display may be coupled to the compartment of the vehicle, and may be a flexible display.",
"The SAEDP 190 may be implemented utilizing various approaches in different embodiments described herein.",
"In one embodiment, the SAEDP 190 comprises a passive material.",
"Optionally, the SAEDP 190 has thickness greater than at least one of the following thicknesses: 1 cm, 2 cm, 5 cm, 10 cm, 15 cm, and 20 cm.",
"In another embodiment, the SAEDP 190 comprises an automotive airbag configured to inflate in order to protect the pedestrian.",
"FIG.",
"26b illustrates an outer SAEDP 190 that includes two air bags 192 configured to absorb some of the crashing energy transmitted to a pedestrian during a pedestrian-vehicle collision.",
"Optionally, the airbag has a stowed condition and an inflated condition.",
"The airbag is coupled to an inflator configured to inflate the airbag with gas, and the airbag is located, in the stowed condition, at eye level in front of the occupant.",
"In this embodiment, the vehicle further includes an autonomous-driving control system, such as autonomous-driving control system 65, which is configured to calculate a probability of pedestrian-vehicle collision, based on measurements of sensors mounted to the vehicle, and to command the airbag to inflate before the pedestrian head hits the vehicle.",
"In yet another embodiment, the SAEDP 190 comprises a pneumatic pad configured to inflate in order to protect the pedestrian.",
"In this embodiment, the vehicle further includes an autonomous-driving control system, such as autonomous-driving control system 65, which is configured to calculate a probability of pedestrian-vehicle collision, based on measurements of sensors mounted to the vehicle, and to command the pneumatic pad to start inflate at least 0.5 second before the expected time of the collision in order to protect the pedestrian.",
"Optionally, the pneumatic pad is reusable, and can be used multiple times without the need to be repaired.",
"For example, the vehicle comprises a mechanism to deflate and/or stow the pneumatic pad, without requiring its repair and/or replacement.",
"Some aspects of this disclosure involve an autonomous on-road vehicle that includes a window located at eye level of an occupant who sits in a front seat of the vehicle (e.g., a windshield), a reusable nontransparent Shock-Absorbing Energy Dissipation Padding (SAEDP), a motor, and a processor.",
"The window enables the occupant to see the outside environment.",
"The motor is configured to move the SAEDP over a sliding mechanism between first and second states multiple times without having to be repaired.",
"In the first state the SAEDP does not block the occupant's eye level frontal view to the outside environment, and in the second state the SAEDP blocks the occupant's eye level frontal view to the outside environment.",
"Additionally, in the second state the SAEDP can absorb some of the crashing energy transmitted to a pedestrian during a pedestrian-vehicle collision.",
"The processor is configured to receive, from an autonomous-driving control system, an indication indicative of whether a probability of an imminent pedestrian-vehicle collision reaches a threshold.",
"Responsive to receiving an indication of an imminent collision (e.g., within less than 2 seconds), the processor is configured to command the motor to move the SAEDP from the first state to the second state.",
"One non-limiting advantage of the vehicle described above is that it increases the safety of a pedestrian in case of a vehicle-pedestrian collision, without prohibiting the occupant of the vehicle from receiving a frontal view of the outside environment during normal driving.",
"FIG.",
"27a and FIG.",
"27b illustrate a motorized external SAEDP 121 that can move between first and second states multiple times.",
"The figures illustrate how the SAEDP 121 can move from the first state (in FIG.",
"27a) to the second state (FIG.",
"27b) by having the motor 122 move the SAEDP 121 over sliding mechanism 123.Additionally, the figures illustrate optional camera 126 that is embedded in the SAEDP 121, and which may provide video to a processor configured to generate a representation of the outside environment when the SAEDP 121 is in the second state.",
"In one embodiment, an autonomous on-road vehicle includes window 120, reusable SAEDP 121, motor 122, and processor 124.The window 120, which is located at eye level of an occupant who sits in a front seat of the vehicle, and which may be a windshield, enables the occupant to see the outside environment.",
"The SAEDP 121 is reusable, i.e., it may be moved multiple times without the need to replace it or repair it after each use.",
"The SAEDP 121 may be implemented utilizing various approaches in different embodiments described herein.",
"In one embodiment, the SAEDP 121 comprises a passive material.",
"Optionally, the SAEDP 121 has thickness greater than at least one of the following thicknesses: 1 cm, 2 cm, 5 cm, 10 cm, 15 cm, and 20 cm.",
"In another embodiment, the SAEDP 121 comprises a pneumatic pad configured to inflate in order to protect the pedestrian.",
"Optionally, the pneumatic pad is reusable, and the processor 124 is configured to command the pneumatic pad to start inflate at least 0.5 second before the expected time of the pedestrian-vehicle collision.",
"The motor 122 is configured to move the SAEDP 121 over a sliding mechanism 123 between first and second states multiple times without having to be repaired.",
"In the first state the SAEDP 121 does not block the occupant's eye level frontal view to the outside environment, and in the second state the SAEDP 121 blocks the occupant's eye level frontal view to the outside environment.",
"When in the second state, the SAEDP 121 is configured to absorb some of the crashing energy transmitted to a pedestrian during a pedestrian-vehicle collision.",
"The processor 124 is configured to receive, from an autonomous-driving control system (such as autonomous-driving control system 65), an indication indicative of whether a probability of an imminent pedestrian-vehicle collision reaches a threshold.",
"Optionally, most of the time the vehicle travels, the processor 124 does not provide an indication that the probability reaches the threshold.",
"Responsive to receiving an indication of an imminent collision (e.g., within less than 2 seconds), the processor 124 is configured to command the motor 122 to move the SAEDP 121 from the first state to the second state.",
"Optionally, the processor 124 is configured to command the motor to start moving the SAEDP 121 to the second state at least 0.2 second, 0.5 second, 1 second, or 2 seconds before the pedestrian-vehicle collision in order to protect the pedestrian.",
"In one example, the vehicle includes a sensor configured to detect the distance and angle between the vehicle and a pedestrian, and the autonomous-driving control system calculates the probability of the imminent pedestrian-vehicle collision based on the data obtained from the sensor, the velocity of vehicle and the possible maneuver.",
"In one embodiment, the processor 124 is further configured to receive an updated indication that indicates the probability of the imminent pedestrian-vehicle collision does not reach a second threshold, and to command the motor 122 to move the SAEDP to the first state.",
"Optionally, the second threshold denotes a probability for a pedestrian-vehicle collision that is equal or lower than the threshold.",
"In one embodiment, the vehicle includes a camera (such as camera 126), which is configured to take video of the outside environment while the SAEDP 121 is in the second state.",
"Additionally, in this embodiment, the vehicle may further include a computer configured to generate, based on the video, a representation of the outside environment, and a display configured to present the representation of the outside environment to the occupant while the SAEDP 121 is in the second state.",
"Optionally, the camera 126 is fixed to the SAEDP 121 from the outer side, and thus moves with the SAEDP 121 when it moves between the first and second states.",
"Optionally, the display is fixed to the SAEDP 121 from the inner side, and thus also moves with the SAEDP 121 when it moves between the first and second states; the occupant can see the display via the window 120 when the SAEDP is in the second state.",
"In an alternative embodiment, the display is physically coupled to the compartment (such as a windshield that also functions as a display) and/or comprised in an HMD worn by the occupant.",
"In addition to, or instead of, moving an SAEDP when a collision is imminent, in some embodiments, an imminent collision may prompt a raise of one or more power windows in the vehicle.",
"This approach is illustrated in the following embodiment.",
"In one embodiment, a safety system for an occupant of an autonomous on-road vehicle includes an automobile power window and an autonomous-driving control system (such as autonomous-driving control system 65).",
"The autonomous-driving control system is configured to calculate probability of an imminent collision based on data received from sensors coupled to the vehicle.",
"Responsive to detecting that the probability reaches a threshold, and at least one second before the expected collision, the autonomous-driving control system commands the power window to rise.",
"In this embodiment, a raised power window provides an improved safety for the occupant of the vehicle during collision compared to a lowered power window.",
"Optionally, responsive to detecting that the probability reaches the threshold, and at least two seconds before the expected collision, the autonomous-driving control system is configured to command the power window to rise.",
"In one embodiment, the vehicle further includes an SAEDP coupled to the power window from the inside (e.g., as illustrated in FIG.",
"24a and FIG.",
"24b).",
"In one embodiment, the power window is nontransparent, and the safety system for the occupant includes a display coupled to the power window from the inside.",
"The display is configured to present to the occupant a video see-trough (VST) of the outside environment that is generated based on a video camera pointed at the outside environment.",
"In another embodiment, the power window is made of a nontransparent material, which is stronger than a standard automotive tempered glass having the same dimensions.",
"In this embodiment, the vehicle further comprises a camera configured to take video of the outside environment (such as camera 178a), and a computer configured to generate a VST to the outside environment based on the video.",
"Optionally, the camera is physically coupled to the power window, such that the camera is raised and lowered with the power window.",
"Additionally or alternatively, the camera may be coupled to an element of the vehicle that is not the power window, such that the camera does not move up and down when the power window is raised and lowered.",
"Optionally, the vehicle further includes a display coupled to the inner side of the power window, such that the display is at eye level when the power window is raised, and below eye level when the power window is lowered; the display is configured to present the VST to the occupant.",
"Optionally, the occupant wears an HMD, and the computer is configured to present the VST to the occupant on the HMD when the power window is raised, and not to present the VST to the occupant on the HMD when the power window is lowered.",
"With autonomous vehicles, it is not necessary for occupants to sit.",
"Some aspects of this disclosure involve autonomous vehicles in which an occupant of the vehicle may lay down.",
"Such a design for an autonomous vehicle has the advantage of enabling a more comfortable position for certain activities (e.g., relaxing or sleeping).",
"Additionally, such a vehicle may be built to be lower than traditional vehicles, which can offer advantages in terms of increased safety (e.g., a lower center of gravity offers better stability) and better vehicle aerodynamics.",
"In order to increase the safety of the occupant, various forms of padding may be used in the compartment of the vehicle.",
"In some embodiments, an autonomous on-road vehicle designed for lying down includes a closed compartment and a mattress, having an average thickness of at least 3 cm, which covers at least 50% of the compartment floor.",
"In the compartment, there is a nontransparent Shock-Absorbing Energy Dissipation Padding (SAEDP), having an average thickness of at least 1 cm, which covers at least 50% of the compartment side walls and at least 60% of the compartment front wall during normal driving.",
"Optionally, the SAEDP is supported by a stiff element that resists deformation during a collision in order to reduce compartment intrusion.",
"Additionally, the vehicle includes a camera configured to take video of the outside environment, a computer configured to generate a representation of the outside environment based on the video, and a display configured to present the representation to the occupant.",
"In one embodiment, an autonomous on-road vehicle designed for lying down includes a closed compartment 210, a mattress 211, an SAEDP 212 covering portions of the compartment 210, a camera (e.g., the structure 147 that houses multiple cameras), a computer (e.g., the computer 143), and a display 215.FIG.",
"28 illustrates one embodiment of a vehicle compartment 210 in which an occupant may lay down.",
"In the figure, the occupant is lying down on mattress 211, which covers the floor of the compartment 210, and is watching a movie on the display 215.The SAEDP 212 covers the front, roof, and back of the compartment 210.It is to be noted that the SAEDP 212 also covers portions of the side walls of the compartment 210, however, this is not illustrated to enable a clearer image of the embodiment.",
"The figure also includes an airbag 216, which may be inflated below the SAEDP 212 in order to protect the occupant and restrain his/her movement in the case of a collision.",
"The mattress 211 covers at least 50% of the compartment floor.",
"Optionally, the mattress 211 covers at least 80% of the compartment floor.",
"In one embodiment, the mattress 211 has an average thickness of at least 3 cm.",
"In other embodiments, the average thickness of the mattress 211 is greater than at least one of the following thicknesses: 5 cm, 7 cm, 10 cm, 20 cm, and 30 cm.",
"The SAEDP 212 is a nontransparent SAEDP, having an average thickness of at least 1 cm.",
"Optionally, the SAEDP 212 covers at least 50% of the compartment side walls and at least 60% of the compartment front wall during normal driving.",
"In one embodiment, the average thickness of the SAEDP 212 is greater than at least one of the following thicknesses: 2 cm, 3 cm, 5 cm, 10 cm, 15 cm, and 20 cm.",
"In another embodiment, the SAEDP 212 covers at least 80% of the compartment side walls and at least 80% of the compartment front wall.",
"In yet another embodiment, the SAEDP covers at least 50% of the compartment roof.",
"In still another embodiment, the mattress and the SAEDP cover essentially the entire compartment interior.",
"In addition to the SAEDP 212, in some embodiments additional measures may be employed in order to improve the safety of the occupant.",
"In one embodiment, the vehicle includes an automotive airbag configured to deploy in front of the SAEDP 212 in order to protect the occupant, in addition to the SAEDP 212, against hitting the inner side of the vehicle compartment during a collision.",
"It is noted that the meaning that the airbag deploys in front of the SAEDP is that the airbag deploys towards the inner side of the compartment.",
"Optionally, the airbag has a stowed condition and an inflated condition, and the airbag is coupled to an inflator configured to inflate the airbag with gas upon computing a predetermined impact severity.",
"The stowed airbags may be stored in various positions, such as stored essentially in the middle of the front wall, stored essentially in the middle of the rear wall, stored in the side walls (possibly two or more horizontally spaced airbags), and stored in the roof (possibly one or more airbags towards the front of the compartment and one or more airbags towards the rear of the compartment).",
"In some embodiments, various additional safety measures may be utilized to improve the safety of the occupant while traveling, such as a sleeping net and/or a safety belt, as described for example in U.S. Pat.",
"Nos.",
"5,536,042 and 5,375,879.Stiff element 213 is configured to support the SAEDP 212 and to resist deformation during a collision in order to reduce compartment intrusion.",
"Part of the stiff element 213 is located, during normal driving, at eye level between the SAEDP 212 and the outside environment.",
"Optionally, the stiff element covers, from the outside, more than 80% of the SAEDP on the compartment side walls.",
"Optionally, the vehicle also includes a crumple zone located at eye level between the stiff element 213 and the outside environment.",
"In another embodiment, the vehicle includes a pneumatic pad configured to inflate in order to protect the occupant, in addition to the SAEDP 212, against hitting the inner side of the vehicle compartment during a collision.",
"Optionally, the pneumatic pad is configured to deploy in front of the SAEDP 212 towards the inner side of the compartment.",
"Alternatively, the pneumatic pad is located between the SAEDP 212 and the stiff element 213, and is configured to deploy behind the SAEDP 212.The pneumatic pad may be mounted to various locations, such as mounted to the front wall, mounted to the rear wall, mounted to the side walls, and/or mounted to the roof.",
"The camera is configured to take video of the outside environment.",
"The computer is configured to generate a representation of the outside environment based on the video.",
"Optionally, the representation is generated from the point of view of the occupant.",
"The display 215 is configured to present the representation to the occupant.",
"In one embodiment, the display 215 is comprised in an HMD, and the vehicle further comprises a communication system configured to transmit the representation to the HMD.",
"In another embodiment, the display 215 is physically coupled to at least one of the SAEDP 212 and the stiff element 213 at eye level of the occupant.",
"Optionally, the display 215 is a flexible display.",
"For example, the display 215 may be a flexible display that is based on at least one of the following technologies and their variants: OLED, organic thin film transistors (OTFT), electronic paper (e-paper), rollable display, and flexible AMOLED.",
"Optionally, the display 215 is flexible enough such that it does not degrade the performance of the SAEDP by more than 20% during a collision.",
"Having a vehicle compartment that is designed to allow an occupant to lay down comfortably can be done using various compartment designs, which may be different from the designs used in standard vehicles, in which occupants primarily sit up.",
"In one example, the vehicle does not have an automotive seat with a backrest and safety belt, which enables the occupant to sit straight in the front two thirds of the compartment.",
"In another example, the vehicle is designed for a single occupant, and the average distance between the mattress and the compartment roof is below 80 cm.",
"In still another example, the vehicle is designed for a single occupant, and the average distance between the mattress and the compartment roof is below 70 cm.",
"In still another example, the vehicle is designed for a single occupant, and the average distance of the compartment roof from the road is less than 1 meter.",
"And in yet another example the vehicle is designed for a single occupant, and the average distance of the compartment roof from the road is less than 80 cm.",
"It is to be noted that the use of the terms “floor”, “roof”, “side walls”, and “front wall” with respect to the compartment are to be viewed in their common meaning when one considers the compartment to be a mostly convex hull in 3D, such as having a shape that resembles a cuboid.",
"Thus, for example, an occupant whose face faces forward, will see the front wall ahead, the floor when looking below, the roof when looking above, and a side wall when looking to one of the sides (left or right).",
"In embodiments that do not resemble cuboids, alternative definitions for these terms may be used based on the relative region (in 3D space) that each of the portions of the compartment occupy.",
"For example, the floor of the compartment may be considered to be any portion of the compartment which is below at least 80% of the volume of the compartment.",
"Similarly, the roof may be any portion of the compartment that is above at least 80% of the volume of the compartment.",
"The front wall may be any portion of the compartment that is ahead of at least 80% of the volume of the compartment, etc.",
"Note that using this alternative definitions, some portions of the compartment may be characterized as belonging to two different regions (e.g., the front wall and the roof).",
"Some aspects of this disclosure involve an autonomous on-road vehicle that includes a compartment having a large mirroring element located in front of an occupant who sits in a front seat of the compartment.",
"Optionally, the mirroring element has height and width exceeding 25×25 cm, such that it covers a square that is at least those dimensions.",
"Optionally, the mirroring element captures a region corresponding to at least 10×10 degrees, including a region spanning from the horizon to 10° below the horizon, of the occupant's forward field of view during normal driving.",
"Additionally, the mirroring element provides an effect of reflecting more than 25% of the light arriving from the occupant's direction.",
"In some embodiments, the vehicle has an advantage that it can increase the perceived compartment volume, which can make travelling in the vehicle more pleasurable for some people.",
"FIG.",
"29 illustrates one embodiment of a vehicle having a front mirroring element.",
"The figure illustrates how the occupant 222 can see her reflection 223 in the mirroring element 220.In one embodiment, the mirroring element 220 is located in front of an occupant who sits in a front seat of the vehicle.",
"The mirroring element 220 provides an effect of reflecting more than 25% of the light arriving from the occupant's direction.",
"Optionally, the mirroring element 220 provides an effect of reflecting more than at least one of 50%, 80%, and 90% of the light arriving from the occupant's direction.",
"Optionally, the mirroring element 220 increases the volume of the vehicle compartment as perceived by the occupant due to the reflection effect.",
"In one embodiment, the mirroring element 220 has height and width exceeding 25×25 cm, such that it covers a square that is at least those dimensions.",
"Optionally, the mirroring element 220 captures a region corresponding to at least 10×10 degrees, including a region spanning from the horizon to 10° below the horizon, of the occupant's forward field of view during normal driving.",
"Optionally, the height and width of the mirroring element 220 is above 50×40 cm, and the mirroring element captures above 30×30 degrees of the occupant's field of view, including a region spanning from the horizon to 30° below the horizon.",
"Optionally, the mirroring element 220 covers more than 25% of the area where a conventional windshield of a normal non-autonomous on-road vehicle in year 2016 is expected to be located.",
"The mirroring element 220 may be implemented in different ways, in different embodiments.",
"In one embodiment, the mirroring element 220 comprises an optical mirror that is essentially flat and perpendicular to the ground.",
"In this embodiment, most of the effect of reflecting is generated by the optical mirror.",
"In one example, an optical mirror that is essentially flat and perpendicular to the ground refers to an optical mirror having a radius of curvature greater than a meter and a deviation below ±30° from the perpendicular to the ground.",
"In another embodiment, the mirroring element 220 comprises a Fresnel type optical reflector comprising many reflecting prisms.",
"In this embodiment, the Fresnel type optical reflector is not flat, but the reflecting prisms are arranged in angles that reflect the light from the occupant such as to imitate a flat mirror.",
"In one embodiment, the mirroring element 220 comprises an electronic display that operates based on a camera 221 configured to take video of the occupant 222, and a computer 224 configured to generate a digital representation of the occupant 223 based on the video of the occupant.",
"In this case, most of the effect of reflecting is generated by light emitted by the electronic display (which is the output of the video of the occupant as generated by the computer 224).",
"Due to the close proximity between the at least one camera 221 and the occupant, it may be necessary to stitch the reflecting effect of a large area from multiple cameras that capture the occupant from different angles.",
"In one example, the camera 221 comprises first and second cameras, located to the right and left of the occupant, respectively.",
"In another example, the camera 221 comprises first and second cameras, located above the level of the occupant's nose and below the level of the occupant's collarbone, respectively, and less than 80 cm away from the occupant.",
"In still another embodiment, the effect of reflecting is achieved by a digital mirror that comprises multiple cameras embedded within the digital mirror and configured to take images of the occupant, and multiple light emitting pixels configured to emit light rays that generate the effect of reflecting.",
"In one embodiment, the mirroring element 220 comprises an electronic display, and the vehicle further includes a camera configured to take video of the outside environment in front of the occupant, and a computer configured to generate, based on the video, a representation of the outside environment in front of the occupant at eye level, for displaying on the mirroring element 220.In addition to the effect of reflecting, in some embodiments the mirroring element 220 may also be configured to operate in a second state in which it provides an effect of reflecting less than 20% of the light arriving from the occupant's direction, and to present to the occupant the representation of the outside environment.",
"Here, presenting the representation may imitate a transparent windshield to the outside environment.",
"The vehicle may also include, in some embodiments, a display configured to present to the occupant, at eye level in front of the occupant, the representation of the outside environment instead of, or in addition to, the effect of reflecting.",
"Optionally, the vehicle may include a user interface configured to enable the occupant to switch between seeing the effect of reflecting and seeing the representation of the outside environment.",
"In one example, the display is comprised in a head-mounted display (HMD).",
"In another example, the display is mechanically coupled to the compartment, and/or the mirroring element comprises the display.",
"As described above, the effect of reflecting light that comes from the direction of the occupant may be obtained, in some embodiments, utilizing an HMD.",
"The following is a more detailed example of such an embodiment.",
"In one embodiment, an autonomous on-road vehicle includes a compartment comprising a front seat, a camera, a computer, a communication module, and an HMD.",
"The camera is physically coupled to the vehicle, configured to take images of an occupant who sits in the front seat.",
"The computer is configured to generate, based on the images, a video that shows a mirror effect.",
"Herein, the “mirror effect” involves presenting the occupant with an image that is similar to an image that the occupant would see had there been an actual mirror in front of the occupant.",
"Optionally, the system enables the occupant to have control on the synthetic mirror effect, such as control on the distance between the occupant and her image, and/or control on the width of the image.",
"The communication module is configured to transmit the video to a head-mounted display (HMD) worn by the occupant, and the HMD is configured to present the video to the occupant, such that the occupant sees a representation of his or her reflection when looking forward at eye level.",
"Optionally, the HMD is selected from the group comprising: a virtual reality headset, an augmented reality headset, and mixed reality headset.",
"Optionally, the video presented to the occupant captures at least 30×30 degrees of the occupant's field of view, spanning at least from the horizon to 30° below the horizon.",
"In one embodiment, the vehicle described above further includes a second camera configured to take a second set of images of the outside environment in front of the occupant.",
"In this embodiment, the computer is further configured to generate a representation of the outside environment based on the second set of images, and the HMD is configured to present the representation of the outside environment instead of the video that shows the mirror effect or in addition to the video that shows the mirror effect.",
"In one embodiment, the vehicle described above may include multiple cameras that capture images that are utilized by the computer to generate the video that shows the mirror effect.",
"In one example, the vehicle comprises at least first and second cameras, which are located to the right and left of the occupant, respectively.",
"In another example, the vehicle comprises at least first and second cameras, located above the level of the occupant's nose and below the level of the occupant's collarbone, respectively, and which are less than 80 cm away from the occupant.",
"Some aspects of this disclosure involve utilizing one or more nontransparent side beams in order to help protect the occupant in a case of a collision.",
"The one or more side beams are stiffer than automotive laminated glass.",
"In one example, a side beam comprises a high tensile steel pipe and pressed material.",
"In another example, a side beam comprises an aluminum extruded shape.",
"In one embodiment, an autonomous on-road vehicle that weighs less than 1500 kg without batteries includes a nontransparent side beam, which is stiffer than automotive laminated glass, and is located during normal driving to the left and at eye level of an occupant who sits in a front seat.",
"The vehicle also includes a camera configured to take video of the outside environment to the left of the occupant, and a computer configured to generate for the occupant, based on the video, a representation of the outside environment to the left of the occupant at eye level.",
"Optionally, the representation is presented to the occupant using a display.",
"In one example, the display is comprised in a head-mounted display (HMD), and the vehicle further comprises a communication system configured to transmit the representation to the HMD.",
"In another example, the display is coupled to the inner side of the compartment.",
"The following is a description of an embodiment of a vehicle in which one or more side beams may be utilized to help protect the left side of a vehicle (and an occupant therein).",
"In one embodiment, an autonomous on-road vehicle includes a nontransparent side beam, a camera (e.g., the camera 161), and a computer (e.g., the computer 143).",
"Optionally, the vehicle weighs less than 1500 kg without batteries.",
"The nontransparent side beam, which is stiffer than automotive laminated glass, is located, during normal driving, at eye level to the left of an occupant who sits in a front seat of the vehicle.",
"Optionally, the side beam is at least 60 cm long and at least 1 cm wide (herein “cm” refers to centimeters).",
"In one example, the side beam comprises a high tensile steel pipe and pressed material.",
"In another example, the side beam comprises an aluminum extruded shape.",
"The camera configured to take video of the outside environment to the left of the occupant.",
"The computer is configured to generate for the occupant, based on the video, a representation of the outside environment to the left of the occupant at eye level.",
"Optionally, the representation is generated from the point of view of the occupant, and the vehicle further includes a display configured to present the representation to the occupant.",
"In one example, the display is comprised in a head-mounted display (HMD), and the vehicle further comprises a communication system configured to transmit the representation to the HMD.",
"In another example, the display is coupled to the inner side of the compartment.",
"In some embodiments, a plurality of beams, which may be similar to the side beam described above, may be located in the region of the left side of the vehicle.",
"It is to be noted that the plurality of beams may not necessarily all have the same dimensions or be made of the same exact materials.",
"Optionally, the plurality of beams may be connected in various ways in order to form a structure that can better resist compartment deforming in the case of a collision.",
"For example, in one embodiment, the vehicle includes an additional side beam that is not parallel to the side beam and crosses it to form an “X” shaped structure.",
"Herein, an “X” shaped structure refers to any structure of two nonparallel beams that cross, and the two do not necessarily form a symmetric “X” (e.g., a symmetric “X” may be obtained when the two beams are of equal length and cross at their centers).",
"This structure is illustrated in FIG.",
"30a where beams 231 and 232 cross to form an “X” shape structure.",
"It is to be noted that the beam 231 is at eye level (i.e., at least a portion of the beam 231 is at the same height as a typical occupant's eyes).",
"FIG.",
"30a illustrates one example of a configuration of a plurality of beams located in the left side of the vehicle.",
"Different designs of vehicles may benefit from utilizing one or more sides beam as described above.",
"In one embodiment, the side beam is embedded in a movable structure that changes its location with respect to the vehicle compartment.",
"For example, the side beam may be part of a left door of the vehicle.",
"In another embodiment, the side beam is embedded in the vehicle compartment itself and does not change its location with respect to the rest of the compartment.",
"For example, the side beam may be placed in a compartment wall to the left of the occupant.",
"In order to better protect the occupant from injury due to hitting the head against the side of the vehicle, in some embodiments, the vehicle may comprise a nontransparent Shock-Absorbing Energy Dissipation Padding (SAEDP) located at eye level between the side beam and the occupant.",
"The SAEDP is less stiff than a standard automotive glass window.",
"In one example, the SAEDP comprises a passive material.",
"In another example, the SAEDP includes an airbag.",
"And in still another example, the SAEDP includes a pneumatic pad.",
"Optionally, the vehicle includes a display on which the representation of the outside environment may be presented to the occupant.",
"Optionally, the display is supported by the SAEDP and/or the side beam.",
"Optionally, the display is a flexible display.",
"In a similar fashion to the utilization of beams on the left side of the vehicle, in some embodiments, one or more beams may be used to help protect the occupant's right side.",
"For example, in one embodiment, the vehicle includes a second side beam, located at eye level to the right of the occupant, and a second camera configured to take video of the outside environment to the right of the occupant.",
"In this embodiment, the computer is further configured to generate a second representation of the outside environment to the right of the occupant.",
"Some aspects of this disclosure involve utilizing one or more nontransparent beams in order to help protect the occupant in a case of a collision.",
"The one or more beams are stiffer than automotive laminated glass.",
"In one example, a nontransparent beam comprises a high tensile steel pipe and pressed material.",
"In another example, a nontransparent beam comprises an aluminum extruded shape.",
"In one embodiment, an autonomous on-road vehicle that weighs less than 1500 kg without batteries includes a nontransparent beam, which is stiffer than automotive laminated glass, and is fixed at eye level in front of an occupant who sits in a front seat of the vehicle during normal driving.",
"The vehicle also includes a camera configured to take video of the outside environment in front of the occupant, and a computer configured to generate for the occupant, based on the video, a representation of the outside environment in front of the occupant at eye level.",
"Optionally, the representation is presented to the occupant using a display.",
"In one example, the display is comprised in a head-mounted display (HMD), and the vehicle further comprises a communication system configured to transmit the representation to the HMD.",
"In another example, the display is coupled to the inner side of the compartment.",
"The following is a description of an embodiment of a vehicle in which one or more nontransparent beams may be utilized to help protect the vehicle's front (and an occupant therein).",
"In one embodiment, an autonomous on-road vehicle includes a nontransparent beam, a camera (e.g., the camera 142), and a computer (e.g., the computer 143).",
"Optionally, the vehicle weighs less than 1500 kg without batteries.",
"The nontransparent beam, which is stiffer than automotive laminated glass, is located, during normal driving, at eye level in front an occupant who sits in a front seat of the vehicle.",
"Optionally, the nontransparent beam is at least 60 cm long and at least 1 cm wide (herein “cm” refers to centimeters).",
"In one example, the nontransparent beam comprises a high tensile steel pipe and pressed material.",
"In another example, the nontransparent beam comprises an aluminum extruded shape.",
"The camera configured to take video of the outside environment in front of the occupant.",
"The computer is configured to generate for the occupant, based on the video, a representation of the outside environment in front of the occupant at eye level.",
"Optionally, the representation is generated from the point of view of the occupant, and the vehicle further includes a display configured to present the representation to the occupant.",
"In one example, the display is comprised in a head-mounted display (HMD), and the vehicle further comprises a communication system configured to transmit the representation to the HMD.",
"In another example, the display is coupled to the inner side of the compartment.",
"In some embodiments, a plurality of beams, which may be similar to the nontransparent beam described above, may be located in the front of the vehicle.",
"It is to be noted that the plurality of beams may not necessarily all have the same dimensions or be made of the same exact materials.",
"Optionally, the plurality of beams may be connected in various ways in order to form a structure that can better resist compartment deformation in the case of a collision.",
"For example, in one embodiment, the vehicle includes an additional nontransparent beam that is not parallel to the nontransparent beam and crosses it to form an “X” shaped structure.",
"This structure is illustrated in FIG.",
"30b where beams 235 and 236 cross to form an “X” shape structure.",
"Both of the beams 235 and 236 are at eye level (i.e., at least a portion of each beam is at the same height as a typical occupant's eyes).",
"FIG.",
"30b illustrates one example of a configuration of a plurality of beams located in the front of the vehicle.",
"Different designs of vehicles may benefit from utilizing one or more nontransparent beam as described above.",
"In one embodiment, the nontransparent beam is embedded in a movable structure that changes its location with respect to the vehicle compartment.",
"For example, the nontransparent beam may be part of a front door through which the occupant may enter the vehicle.",
"In another embodiment, the nontransparent beam is embedded in the vehicle compartment itself and does not change its location with respect to the rest of the compartment.",
"For example, the nontransparent beam may be placed in a compartment wall in front of the occupant.",
"In order to better protect the occupant from injury (e.g., during a collision), in some embodiments, the vehicle may comprise a nontransparent Shock-Absorbing Energy Dissipation Padding (SAEDP) located at eye level between the nontransparent beam and the occupant.",
"The SAEDP is less stiff than a standard automotive glass window.",
"In one example, the SAEDP comprises a passive material.",
"In another example, the SAEDP includes an airbag.",
"And in still another example, the SAEDP includes a pneumatic pad.",
"Optionally, the vehicle includes a display on which the representation of the outside environment may be presented to the occupant.",
"Optionally, the display is coupled to the inner side of the compartment.",
"Optionally, the display is a flexible display.",
"Various embodiments described herein include a processor and/or a computer.",
"For example, the autonomous-driving control system may be implemented using a computer and generation of a representation of the outside environment is done using a processor or a computer.",
"The following are some examples of various types of computers and/or processors that may be utilized in some of the embodiments described herein.",
"FIG.",
"31a and FIG.",
"31b are schematic illustrations of possible embodiments for computers (400, 410) that are able to realize one or more of the embodiments discussed herein.",
"The computer (400, 410) may be implemented in various ways, such as, but not limited to, a server, a client, a personal computer, a network device, a handheld device (e.g., a smartphone), and/or any other computer form capable of executing a set of computer instructions.",
"The computer 400 includes one or more of the following components: processor 401, memory 402, computer readable medium 403, user interface 404, communication interface 405, and bus 406.In one example, the processor 401 may include one or more of the following components: a general-purpose processing device, a microprocessor, a central processing unit, a complex instruction set computing (CISC) microprocessor, a reduced instruction set computing (RISC) microprocessor, a very long instruction word (VLIW) microprocessor, a special-purpose processing device, an application specific integrated circuit (ASIC), a field programmable gate array (FPGA), a digital signal processor (DSP), a distributed processing entity, and/or a network processor.",
"Continuing the example, the memory 402 may include one or more of the following memory components: CPU cache, main memory, read-only memory (ROM), dynamic random access memory (DRAM) such as synchronous DRAM (SDRAM), flash memory, static random access memory (SRAM), and/or a data storage device.",
"The processor 401 and the one or more memory components may communicate with each other via a bus, such as bus 406.The computer 410 includes one or more of the following components: processor 411, memory 412, and communication interface 413.In one example, the processor 411 may include one or more of the following components: a general-purpose processing device, a microprocessor, a central processing unit, a complex instruction set computing (CISC) microprocessor, a reduced instruction set computing (RISC) microprocessor, a very long instruction word (VLIW) microprocessor, a special-purpose processing device, an application specific integrated circuit (ASIC), a field programmable gate array (FPGA), a digital signal processor (DSP), a distributed processing entity, and/or a network processor.",
"Continuing the example, the memory 412 may include one or more of the following memory components: CPU cache, main memory, read-only memory (ROM), dynamic random access memory (DRAM) such as synchronous DRAM (SDRAM), flash memory, static random access memory (SRAM), and/or a data storage device Still continuing the examples, the communication interface (405,413) may include one or more components for connecting to one or more of the following: an inter-vehicle network, Ethernet, intranet, the Internet, a fiber communication network, a wired communication network, and/or a wireless communication network.",
"Optionally, the communication interface (405,413) is used to connect with the network 408.Additionally or alternatively, the communication interface 405 may be used to connect to other networks and/or other communication interfaces.",
"Still continuing the example, the user interface 404 may include one or more of the following components: (i) an image generation device, such as a video display, an augmented reality system, a virtual reality system, and/or a mixed reality system, (ii) an audio generation device, such as one or more speakers, (iii) an input device, such as a keyboard, a mouse, an electronic pen, a gesture based input device that may be active or passive, and/or a brain-computer interface.",
"It is to be noted that when a processor (computer) is disclosed in one embodiment, the scope of the embodiment is intended to also cover the use of multiple processors (computers).",
"Additionally, in some embodiments, a processor and/or computer disclosed in an embodiment may be part of the vehicle, while in other embodiments, the processor and/or computer may be separate of the vehicle.",
"For example, the processor and/or computer may be in a device carried by the occupant and/or remote of the vehicle (e.g., a server).",
"As used herein, references to “one embodiment” (and its variations) mean that the feature being referred to may be included in at least one embodiment of the invention.",
"Moreover, separate references to “one embodiment”, “some embodiments”, “another embodiment”, “still another embodiment”, etc., may refer to the same embodiment, may illustrate different aspects of an embodiment, and/or may refer to different embodiments.",
"Some embodiments may be described using the verb “indicating”, the adjective “indicative”, and/or using variations thereof.",
"Herein, sentences in the form of “X is indicative of Y” mean that X includes information correlated with Y, up to the case where X equals Y. Additionally, sentences in the form of “provide/receive an indication indicating whether X happened” refer herein to any indication method, including but not limited to: sending/receiving a signal when X happened and not sending/receiving a signal when X did not happen, not sending/receiving a signal when X happened and sending/receiving a signal when X did not happen, and/or sending/receiving a first signal when X happened and sending/receiving a second signal X did not happen.",
"Herein, “most” of something is defined herein as above 51% of the something (including 100% of the something).",
"A “portion” of something refers herein to 0.1% to 100% of the something (including 100% of the something).",
"Sentences of the form “a portion of an area” refer herein to 0.1% to 100% percent of the area.",
"As used herein, the terms “comprises,” “comprising,” “includes,” “including,” “has,” “having”, or any other variation thereof, indicate an open claim language that does not exclude additional limitations.",
"The “a” or “an” is employed to describe one or more, and the singular also includes the plural unless it is obvious that it is meant otherwise.",
"Certain features of some of the embodiments, which may have been, for clarity, described in the context of separate embodiments, may also be provided in various combinations in a single embodiment.",
"Conversely, various features of some of the embodiments, which may have been, for brevity, described in the context of a single embodiment, may also be provided separately or in any suitable sub-combination.",
"Embodiments described in conjunction with specific examples are presented by way of example, and not limitation.",
"Moreover, it is evident that many alternatives, modifications, and variations will be apparent to those skilled in the art.",
"It is to be understood that other embodiments may be utilized and structural changes may be made without departing from the scope of the appended claims and their equivalents."
]
] |
Patent_15871058
|
[
[
"ORGANIC ELECTROLUMINESCENT DEVICE",
"An organic electroluminescent device of which emission life may be improved.",
"The organic electroluminescent device includes an anode, an emission layer, and an anode-side hole transport layer provided between the anode and the emission layer and including an anode-side hole transport material.",
"An electron accepting material is doped in the anode-side hole transport layer.",
"An intermediate hole transport material layer is provided between the anode-side hole transport layer and the emission layer and includes an intermediate hole transport material, and an emission layer-side hole transport layer is provided between the intermediate hole transport material layer and the emission layer and adjacent to the emission layer.",
"The emission layer-side hole transport layer includes an emission layer-side hole transport material represented by the following Formula 1."
],
[
"1.An organic electroluminescent (EL) device, comprising: an anode; an emission layer; and an hole transport layer between the anode and the emission layer; wherein the hole transport layer comprises a hole transport material represented by Formula 1: wherein in Formula 1, Y is O or S; R1 to R6 are each independently hydrogen, deuterium, a halogen atom, a substituted or unsubstituted alkyl group having 1 to 15 carbon atoms, a substituted or unsubstituted silyl group, a substituted or unsubstituted aryl group having 6 to 30 carbon atoms for forming a ring, a substituted or unsubstituted heteroaryl group having 1 to 30 carbon atoms for forming a ring, or a substituted or unsubstituted aryl group or heteroaryl group formed via condensation of optional adjacent substituents; Ar1 and Ar2 are each independently a substituted or unsubstituted aryl group having 6 to 30 carbon atoms for forming a ring, and each of Ar1 and Ar2 is not a heteroaryl-containing group; L1 to L3 are each independently a direct linkage, a substituted or unsubstituted alkylene group having 1 to 15 carbon atoms, a substituted or unsubstituted aralkylene group having 7 to 30 carbon atoms, a substituted or unsubstituted arylene group having 6 to 30 carbon atoms for forming a ring, a substituted or unsubstituted heteroarylene group having 1 to 30 carbon atoms for forming a ring, or a substituted or unsubstituted divalent silyl group; m is an integer from 0 to 3, and n is an integer from 0 to 4.2.The organic EL device of claim 1, wherein the hole transport layer comprises an anode-side hole transport layer between the anode and the emission layer; an intermediate hole transport material layer between the anode-side hole transport layer and the emission layer; and an emission layer-side hole transport layer between the intermediate hole transport material layer and the emission layer.",
"3.The organic EL device of claim 2, wherein at least one of the intermediate hole transport layer or the anode-side hole transport layer comprises a compound represented by Formula 2: wherein in Formula 2, A7 to Ar9 are each independently a substituted or unsubstituted aryl group having 6 to 50 carbon atoms for forming a ring, or a substituted or unsubstituted heteroaryl group having 5 to 50 carbon atoms for forming a ring; Ar10 is hydrogen, deuterium, a halogen atom, a substituted or unsubstituted aryl group having 6 to 50 carbon atoms for forming a ring, a substituted or unsubstituted heteroaryl group having 5 to 50 carbon atoms for forming a ring, or a substituted or unsubstituted alkyl group having 1 to 50 carbon atoms; and L4 is a direct linkage, a substituted or unsubstituted arylene group having 6 to 18 carbon atoms for forming a ring, or a substituted or unsubstituted heteroarylene group having 5 to 15 carbon atoms for forming a ring.",
"4.The organic EL device of claim 2, wherein the anode-side hole transport layer comprises an anode-side hole transport material and doped with an electron accepting material, and the electron accepting material has a lowest unoccupied molecular orbital (LUMO) level within a range from about −9.0 eV to about −4.0 eV.",
"5.The organic EL device of claim 2, wherein the anode-side hole transport layer comprising an electron accepting material as a main component, and the electron accepting material has a lowest unoccupied molecular orbital (LUMO) level within a range from about −9.0 eV to about −4.0 eV 6.The organic EL device of claim 1, wherein the emission layer comprises a compound represented by Formula 3: wherein in Formula 3, Ar11 is each independently hydrogen, deuterium, a substituted or unsubstituted alkyl group having 1 to 50 carbon atoms, a substituted or unsubstituted cycloalkyl group having 3 to 50 carbon atoms for forming a ring, a substituted or unsubstituted alkoxy group having 1 to 50 carbon atoms, a substituted or unsubstituted aralkyl group having 7 to 50 carbon atoms, a substituted or unsubstituted aryloxy group having 6 to 50 carbon atoms for forming a ring, a substituted or unsubstituted arylthio group having 6 to 50 carbon atoms for forming a ring, a substituted or unsubstituted alkoxycarbonyl group having 2 to 50 carbon atoms, a substituted or unsubstituted aryl group having 6 to 50 carbon atoms for forming a ring, a substituted or unsubstituted heteroaryl group having 5 to 50 carbon atoms for forming a ring, a substituted or unsubstituted silyl group, a carboxyl group, a halogen atom, a cyano group, a nitro group, or a hydroxyl group; and o is an integer from 1 to 10."
],
[
"<SOH> BACKGROUND <EOH>The present disclosure herein relates to an organic electroluminescent device.",
"Recently, the developments of organic electroluminescent (EL) displays are being actively conducted.",
"Also, the developments of organic EL devices, which are self luminescent type emitting devices utilized in the organic EL displays, are being actively conducted.",
"As the structure of the organic EL device, a stacked structure of, for example, an anode, a hole transport layer, an emission layer, an electron transport layer and a cathode in the stated order has been utilized.",
"In such organic EL devices, holes and electrons injected from the anode and the cathode recombine in the emission layer to generate excitons.",
"The emission of light may be realized via the transition of the generated excitons to a ground state.",
"For example, in Patent Documents 1 to 4, technique on a hole transport material or a hole transport layer in an organic EL device is disclosed.",
"For example, a hole transport material utilized in a hole transport layer is disclosed in Patent Document 1.In addition, technique of adding an electron accepting material to a hole transport layer, etc., is disclosed in Patent Document 2, and technique of forming a hole transport layer of a stacked structure utilizing a plurality of layers is disclosed in Patent Documents 3 and 4."
],
[
"<SOH> SUMMARY <EOH>However, according to the techniques disclosed in Patent Documents 1 to 4, satisfactory values concerning the emission efficiency and the emission life of an organic EL device could not be obtained, and further improvement thereof is required.",
"An aspect according to one or more embodiments of the present disclosure, considering the above-described limitation, is directed toward a novel and improved organic EL device having improved emission efficiency and emission life.",
"According to an embodiment of the present disclosure, an organic EL device includes an anode; an emission layer; an anode-side hole transport layer between the anode and the emission layer, the anode-side hole transport layer including an anode-side hole transport material and doped with an electron accepting material; an intermediate hole transport material layer between the anode-side hole transport layer and the emission layer, the intermediate hole transport material layer including an intermediate hole transport material; and an emission layer-side hole transport layer between the intermediate hole transport material layer and the emission layer, the emission layer-side hole transport layer including an emission layer-side hole transport material represented by Formula 1.In Formula 1, Y is O or S; R 1 to R 6 are each independently hydrogen, deuterium, a halogen atom, a substituted or unsubstituted alkyl group having 1 to 15 carbon atoms, a substituted or unsubstituted silyl group, a substituted or unsubstituted aryl group having 6 to 30 carbon atoms for forming a ring, a substituted or unsubstitued heteroaryl group having 1 to 30 carbon atoms for forming a ring, or a substituted or unsubstituted aryl group or heteroaryl group formed via condensation of optional adjacent substituents; Ar 1 and Ar 2 are each independently a substituted or unsubstituted aryl group having 6 to 50 carbon atoms for forming a ring, or a substituted or unsubstituted heteroaryl group having 5 to 50 carbon atoms for forming a ring; L 1 to L 3 are each independently a direct linkage, a substituted or unsubstituted alkylene group having 1 to 15 carbon atoms, a substituted or unsubstituted aralkylene group having 7 to 30 carbon atoms, a substituted or unsubstituted arylene group having 6 to 30 carbon atoms for forming a ring, a substituted or unsubstituted heteroarylene group having 1 to 30 carbon atoms for forming a ring, or a substituted or unsubstituted divalent silyl group; m is an integer from 0 to 3; and n is an integer from 0 to 4.In accordance with this aspect, the emission efficiency and emission life of the organic EL device may be further increased.",
"In an embodiment, the intermediate hole transport material may be a compound represented by Formula 2.In Formula 2, Ar 7 to Ar 9 are each independently a substituted or unsubstituted aryl group having 6 to 50 carbon atoms for forming a ring, or a substituted or unsubstituted heteroaryl group having 5 to 50 carbon atoms for forming a ring; Ar 10 is hydrogen, deuterium, a halogen atom, a substituted or unsubstituted aryl group having 6 to 50 carbon atoms for forming a ring, a substituted or unsubstituted heteroaryl group having 5 to 50 carbon atoms for forming a ring, or a substituted or unsubstituted alkyl group having 1 to 50 carbon atoms; and L 4 is a direct linkage, a substituted or unsubstituted arylene group having 6 to 18 carbon atoms for forming a ring, or a substituted or unsubstituted heteroarylene group having 5 to 15 carbon atoms for forming a ring.",
"In accordance with this aspect, the emission efficiency and emission life of the organic EL device may be further increased.",
"In an embodiment, the electron accepting material may have a lowest unoccupied molecular orbital (LUMO) level within a range from about −9.0 eV to about −4.0 eV.",
"In accordance with this aspect, the emission efficiency and emission life of the organic EL device may be further increased.",
"In an embodiment, the anode-side hole transport layer may be adjacent to the anode.",
"In accordance with this aspect, the emission efficiency and emission life of the organic EL device may be further increased.",
"In an embodiment, the anode-side hole transport material may be a compound represented by Formula 2.In accordance with this aspect, the emission efficiency and emission life of the organic EL device may be further increased.",
"In an embodiment, the emission layer may include a compound represented by Formula 3.In Formula 3, Ar 11 is each independently hydrogen, deuterium, a substituted or unsubstituted alkyl group having 1 to 50 carbon atoms, a substituted or unsubstituted cycloalkyl group having 3 to 50 carbon atoms for forming a ring, a substituted or unsubstituted alkoxy group having 1 to 50 carbon atoms, a substituted or unsubstituted aralkyl group having 7 to 50 carbon atoms, a substituted or unsubstituted aryloxy group having 6 to 50 carbon atoms for forming a ring, a substituted or unsubstituted arylthio group having 6 to 50 carbon atoms for forming a ring, a substituted or unsubstituted alkoxycarbonyl group having 2 to 50 carbon atoms, a substituted or unsubstituted aryl group having 6 to 50 carbon atoms for forming a ring, a substituted or unsubstituted heteroaryl group having 5 to 50 carbon atoms for forming a ring, a substituted or unsubstituted silyl group, a carboxyl group, a halogen atom, a cyano group, a nitro group, or a hydroxyl group; and o is an integer from 1 to 10.In accordance with this aspect, the emission efficiency and emission life of the organic EL device may be further increased.",
"According to an embodiments of the present disclosure, an organic EL device includes an anode; an emission layer; an anode-side hole transport layer between the anode and the emission layer, the anode-side hole transport layer formed mainly utilizing an electron accepting material; an intermediate hole transport material layer between the anode-side hole transport layer and the emission layer, the intermediate hole transport material layer including an intermediate hole transport material; and an emission layer-side hole transport layer between the intermediate hole transport material layer and the emission layer, the emission layer-side hole transport layer adjacent to the emission layer and including an emission layer-side hole transport material represented by Formula 1.In Formula 1, Y is O or S; R 1 to R 6 are each independently hydrogen, deuterium, a halogen atom, a substituted or unsubstituted alkyl group having 1 to 15 carbon atoms, a substituted or unsubstituted silyl group, a substituted or unsubstituted aryl group having 6 to 30 carbon atoms for forming a ring, a substituted or unsubstituted heteroaryl group having 1 to 30 carbon atoms for forming a ring, or a substituted or unsubstituted aryl group or heteroaryl group formed via condensation of optional adjacent substituents; Ar 1 and Ar 2 are each independently a substituted or unsubstituted aryl group having 6 to 30 carbon atoms for forming a ring, or a substituted or unsubstituted heteroaryl group having 1 to 30 carbon atoms for forming a ring; L 1 to L 3 are each independently a direct linkage, a substituted or unsubstituted alkylene group having 1 to 15 carbon atoms, a substituted or unsubstituted aralkylene group having 7 to 30 carbon atoms, a substituted or unsubstituted arylene group having 6 to 30 carbon atoms for forming a ring, a substituted or unsubstituted heteroarylene group having 1 to 30 carbon atoms for forming a ring, or a substituted or unsubstituted divalent silyl group; m is an integer from 0 to 3; and n is an integer from 0 to 4.In accordance with this aspect, the driving voltage of the organic EL device may decrease, and the emission efficiency and emission life thereof may be increased.",
"In some embodiments, the intermediate hole transport material may be a compound represented by Formula 2.In Formula 2, Ar 7 to Ar 9 are each independently a substituted or unsubstituted aryl group having 6 to 50 carbon atoms for forming a ring, or a substituted or unsubstituted heteroaryl group having 5 to 50 carbon atoms for forming a ring; Ar 10 is hydrogen, deuterium, a halogen atom, a substituted or unsubstituted aryl group having 6 to 50 carbon atoms for forming a ring, a substituted or unsubstituted heteroaryl group having 5 to 50 carbon atoms for forming a ring, or a substituted or unsubstituted alkyl group having 1 to 50 carbon atoms; and L 4 is a direct linkage, a substituted or unsubstituted arylene group having 6 to 18 carbon atoms for forming a ring, or a substituted or unsubstituted heteroarylene group having 5 to 15 carbon atoms for forming a ring.",
"In accordance with this aspect, the driving voltage of the organic EL device may decrease, and the emission efficiency and emission life thereof may be further increased.",
"In some embodiments, the electron accepting material may have a LUMO level within a range from about −9.0 eV to about −4.0 eV.",
"In accordance with this aspect, the driving voltage of the organic EL device may decrease further, and the emission efficiency and emission life thereof may be further increased.",
"In some embodiments, the anode-side hole transport layer may be adjacent to the anode.",
"In accordance with this aspect, the driving voltage of the organic EL device may decrease further, and the emission efficiency and emission life thereof may be further increased.",
"In some embodiments, the emission layer may include a compound represented by Formula 3.In Formula 3, Ar 11 is each independently hydrogen, deuterium, a substituted or unsubstituted alkyl group having 1 to 50 carbon atoms, a substituted or unsubstituted cycloalkyl group having 3 to 50 carbon atoms for forming a ring, a substituted or unsubstituted alkoxy group having 1 to 50 carbon atoms, a substituted or unsubstituted aralkyl group having 7 to 50 carbon atoms, a substituted or unsubstituted aryloxy group having 6 to 50 carbon atoms for forming a ring, a substituted or unsubstituted arylthio group having 6 to 50 carbon atoms for forming a ring, a substituted or unsubstituted alkoxycarbonyl group having 2 to 50 carbon atoms, a substituted or unsubstituted aryl group having 6 to 50 carbon atoms for forming a ring, a substituted or unsubstituted heteroaryl group having 5 to 50 carbon atoms for forming a ring, a substituted or unsubstituted silyl group, a carboxyl group, a halogen atom, a cyano group, a nitro group, or a hydroxyl group; and o is an integer from 1 to 10.In accordance with this aspect, the driving voltage of the organic EL device may decrease further, and the emission efficiency and emission life thereof may be further increased."
],
[
"CROSS-REFERENCE TO RELATED APPLICATIONS This application is a continuation of U.S. patent application Ser.",
"No.",
"14/934,032, filed Nov. 5, 2015, which claims priority to and the benefit of Japanese Patent Application Nos.",
"2014-227110, filed on Nov. 7, 2014, and 2014-227118, filed on Nov. 7, 2014, the entire content of all of which is incorporated herein by reference.",
"BACKGROUND The present disclosure herein relates to an organic electroluminescent device.",
"Recently, the developments of organic electroluminescent (EL) displays are being actively conducted.",
"Also, the developments of organic EL devices, which are self luminescent type emitting devices utilized in the organic EL displays, are being actively conducted.",
"As the structure of the organic EL device, a stacked structure of, for example, an anode, a hole transport layer, an emission layer, an electron transport layer and a cathode in the stated order has been utilized.",
"In such organic EL devices, holes and electrons injected from the anode and the cathode recombine in the emission layer to generate excitons.",
"The emission of light may be realized via the transition of the generated excitons to a ground state.",
"For example, in Patent Documents 1 to 4, technique on a hole transport material or a hole transport layer in an organic EL device is disclosed.",
"For example, a hole transport material utilized in a hole transport layer is disclosed in Patent Document 1.In addition, technique of adding an electron accepting material to a hole transport layer, etc., is disclosed in Patent Document 2, and technique of forming a hole transport layer of a stacked structure utilizing a plurality of layers is disclosed in Patent Documents 3 and 4.PATENT DOCUMENTS (Patent Document 1) JP2002-241352 A (Patent Document 2) W02007-105906 A (Patent Document 3) KR10-2013-0007159 A (Patent Document 4) JP2011-187959 A SUMMARY However, according to the techniques disclosed in Patent Documents 1 to 4, satisfactory values concerning the emission efficiency and the emission life of an organic EL device could not be obtained, and further improvement thereof is required.",
"An aspect according to one or more embodiments of the present disclosure, considering the above-described limitation, is directed toward a novel and improved organic EL device having improved emission efficiency and emission life.",
"According to an embodiment of the present disclosure, an organic EL device includes an anode; an emission layer; an anode-side hole transport layer between the anode and the emission layer, the anode-side hole transport layer including an anode-side hole transport material and doped with an electron accepting material; an intermediate hole transport material layer between the anode-side hole transport layer and the emission layer, the intermediate hole transport material layer including an intermediate hole transport material; and an emission layer-side hole transport layer between the intermediate hole transport material layer and the emission layer, the emission layer-side hole transport layer including an emission layer-side hole transport material represented by Formula 1.In Formula 1, Y is O or S; R1 to R6 are each independently hydrogen, deuterium, a halogen atom, a substituted or unsubstituted alkyl group having 1 to 15 carbon atoms, a substituted or unsubstituted silyl group, a substituted or unsubstituted aryl group having 6 to 30 carbon atoms for forming a ring, a substituted or unsubstitued heteroaryl group having 1 to 30 carbon atoms for forming a ring, or a substituted or unsubstituted aryl group or heteroaryl group formed via condensation of optional adjacent substituents; Ar1 and Ar2 are each independently a substituted or unsubstituted aryl group having 6 to 50 carbon atoms for forming a ring, or a substituted or unsubstituted heteroaryl group having 5 to 50 carbon atoms for forming a ring; L1 to L3 are each independently a direct linkage, a substituted or unsubstituted alkylene group having 1 to 15 carbon atoms, a substituted or unsubstituted aralkylene group having 7 to 30 carbon atoms, a substituted or unsubstituted arylene group having 6 to 30 carbon atoms for forming a ring, a substituted or unsubstituted heteroarylene group having 1 to 30 carbon atoms for forming a ring, or a substituted or unsubstituted divalent silyl group; m is an integer from 0 to 3; and n is an integer from 0 to 4.In accordance with this aspect, the emission efficiency and emission life of the organic EL device may be further increased.",
"In an embodiment, the intermediate hole transport material may be a compound represented by Formula 2.In Formula 2, Ar7 to Ar9 are each independently a substituted or unsubstituted aryl group having 6 to 50 carbon atoms for forming a ring, or a substituted or unsubstituted heteroaryl group having 5 to 50 carbon atoms for forming a ring; Ar10 is hydrogen, deuterium, a halogen atom, a substituted or unsubstituted aryl group having 6 to 50 carbon atoms for forming a ring, a substituted or unsubstituted heteroaryl group having 5 to 50 carbon atoms for forming a ring, or a substituted or unsubstituted alkyl group having 1 to 50 carbon atoms; and L4 is a direct linkage, a substituted or unsubstituted arylene group having 6 to 18 carbon atoms for forming a ring, or a substituted or unsubstituted heteroarylene group having 5 to 15 carbon atoms for forming a ring.",
"In accordance with this aspect, the emission efficiency and emission life of the organic EL device may be further increased.",
"In an embodiment, the electron accepting material may have a lowest unoccupied molecular orbital (LUMO) level within a range from about −9.0 eV to about −4.0 eV.",
"In accordance with this aspect, the emission efficiency and emission life of the organic EL device may be further increased.",
"In an embodiment, the anode-side hole transport layer may be adjacent to the anode.",
"In accordance with this aspect, the emission efficiency and emission life of the organic EL device may be further increased.",
"In an embodiment, the anode-side hole transport material may be a compound represented by Formula 2.In accordance with this aspect, the emission efficiency and emission life of the organic EL device may be further increased.",
"In an embodiment, the emission layer may include a compound represented by Formula 3.In Formula 3, Ar11 is each independently hydrogen, deuterium, a substituted or unsubstituted alkyl group having 1 to 50 carbon atoms, a substituted or unsubstituted cycloalkyl group having 3 to 50 carbon atoms for forming a ring, a substituted or unsubstituted alkoxy group having 1 to 50 carbon atoms, a substituted or unsubstituted aralkyl group having 7 to 50 carbon atoms, a substituted or unsubstituted aryloxy group having 6 to 50 carbon atoms for forming a ring, a substituted or unsubstituted arylthio group having 6 to 50 carbon atoms for forming a ring, a substituted or unsubstituted alkoxycarbonyl group having 2 to 50 carbon atoms, a substituted or unsubstituted aryl group having 6 to 50 carbon atoms for forming a ring, a substituted or unsubstituted heteroaryl group having 5 to 50 carbon atoms for forming a ring, a substituted or unsubstituted silyl group, a carboxyl group, a halogen atom, a cyano group, a nitro group, or a hydroxyl group; and o is an integer from 1 to 10.In accordance with this aspect, the emission efficiency and emission life of the organic EL device may be further increased.",
"According to an embodiments of the present disclosure, an organic EL device includes an anode; an emission layer; an anode-side hole transport layer between the anode and the emission layer, the anode-side hole transport layer formed mainly utilizing an electron accepting material; an intermediate hole transport material layer between the anode-side hole transport layer and the emission layer, the intermediate hole transport material layer including an intermediate hole transport material; and an emission layer-side hole transport layer between the intermediate hole transport material layer and the emission layer, the emission layer-side hole transport layer adjacent to the emission layer and including an emission layer-side hole transport material represented by Formula 1.In Formula 1, Y is O or S; R1 to R6 are each independently hydrogen, deuterium, a halogen atom, a substituted or unsubstituted alkyl group having 1 to 15 carbon atoms, a substituted or unsubstituted silyl group, a substituted or unsubstituted aryl group having 6 to 30 carbon atoms for forming a ring, a substituted or unsubstituted heteroaryl group having 1 to 30 carbon atoms for forming a ring, or a substituted or unsubstituted aryl group or heteroaryl group formed via condensation of optional adjacent substituents; Ar1 and Ar2 are each independently a substituted or unsubstituted aryl group having 6 to 30 carbon atoms for forming a ring, or a substituted or unsubstituted heteroaryl group having 1 to 30 carbon atoms for forming a ring; L1 to L3 are each independently a direct linkage, a substituted or unsubstituted alkylene group having 1 to 15 carbon atoms, a substituted or unsubstituted aralkylene group having 7 to 30 carbon atoms, a substituted or unsubstituted arylene group having 6 to 30 carbon atoms for forming a ring, a substituted or unsubstituted heteroarylene group having 1 to 30 carbon atoms for forming a ring, or a substituted or unsubstituted divalent silyl group; m is an integer from 0 to 3; and n is an integer from 0 to 4.In accordance with this aspect, the driving voltage of the organic EL device may decrease, and the emission efficiency and emission life thereof may be increased.",
"In some embodiments, the intermediate hole transport material may be a compound represented by Formula 2.In Formula 2, Ar7 to Ar9 are each independently a substituted or unsubstituted aryl group having 6 to 50 carbon atoms for forming a ring, or a substituted or unsubstituted heteroaryl group having 5 to 50 carbon atoms for forming a ring; Ar10 is hydrogen, deuterium, a halogen atom, a substituted or unsubstituted aryl group having 6 to 50 carbon atoms for forming a ring, a substituted or unsubstituted heteroaryl group having 5 to 50 carbon atoms for forming a ring, or a substituted or unsubstituted alkyl group having 1 to 50 carbon atoms; and L4 is a direct linkage, a substituted or unsubstituted arylene group having 6 to 18 carbon atoms for forming a ring, or a substituted or unsubstituted heteroarylene group having 5 to 15 carbon atoms for forming a ring.",
"In accordance with this aspect, the driving voltage of the organic EL device may decrease, and the emission efficiency and emission life thereof may be further increased.",
"In some embodiments, the electron accepting material may have a LUMO level within a range from about −9.0 eV to about −4.0 eV.",
"In accordance with this aspect, the driving voltage of the organic EL device may decrease further, and the emission efficiency and emission life thereof may be further increased.",
"In some embodiments, the anode-side hole transport layer may be adjacent to the anode.",
"In accordance with this aspect, the driving voltage of the organic EL device may decrease further, and the emission efficiency and emission life thereof may be further increased.",
"In some embodiments, the emission layer may include a compound represented by Formula 3.In Formula 3, Ar11 is each independently hydrogen, deuterium, a substituted or unsubstituted alkyl group having 1 to 50 carbon atoms, a substituted or unsubstituted cycloalkyl group having 3 to 50 carbon atoms for forming a ring, a substituted or unsubstituted alkoxy group having 1 to 50 carbon atoms, a substituted or unsubstituted aralkyl group having 7 to 50 carbon atoms, a substituted or unsubstituted aryloxy group having 6 to 50 carbon atoms for forming a ring, a substituted or unsubstituted arylthio group having 6 to 50 carbon atoms for forming a ring, a substituted or unsubstituted alkoxycarbonyl group having 2 to 50 carbon atoms, a substituted or unsubstituted aryl group having 6 to 50 carbon atoms for forming a ring, a substituted or unsubstituted heteroaryl group having 5 to 50 carbon atoms for forming a ring, a substituted or unsubstituted silyl group, a carboxyl group, a halogen atom, a cyano group, a nitro group, or a hydroxyl group; and o is an integer from 1 to 10.In accordance with this aspect, the driving voltage of the organic EL device may decrease further, and the emission efficiency and emission life thereof may be further increased.",
"BRIEF DESCRIPTION OF THE FIGURE The accompanying drawing is included to provide a further understanding of the present disclosure, and is incorporated in and constitutes a part of this specification.",
"The drawing illustrates example embodiments of the present disclosure and, together with the description, serves to explain principles of the present disclosure.",
"The drawing is a diagram for explaining the schematic configuration of an organic EL device according to an embodiment.",
"DETAILED DESCRIPTION Example embodiments of the present disclosure will be described below in more detail with reference to the accompanying drawing.",
"In the specification and drawing, elements having substantially the same function will be designated by the same reference numerals, and repeated explanation thereof will not be provided.",
"<1-1.Configuration of Organic EL Device> (1-1-1.Whole Configuration) First, on the basis of the drawing, the whole configuration of an organic EL device 100 according to an embodiment of the present disclosure will be described.",
"As shown in the drawing, an organic EL device 100 according to an embodiment may include a substrate 110, a first electrode 120 disposed on the substrate 110, a hole transport layer 130 disposed on the first electrode 120, an emission layer 140 disposed on the hole transport layer 130, an electron transport layer 150 disposed on the emission layer 140, an electron injection layer 160 disposed on the electron transport layer 150, and a second electrode 170 disposed on the electron injection layer 160.Here, the hole transport layer 130 may be formed to have a multi-layer structure composed of a plurality of layers 131, 133 and 135.",
"(1-1-2.Configuration of substrate) The substrate 110 may be a substrate utilized in a common (e.g., an existing) organic EL device.",
"For example, the substrate 110 may be a glass substrate, a semiconductor substrate or a transparent plastic substrate.",
"(1-1-3.Configuration of First Electrode) The first electrode 120 may be, for example, an anode, and may be formed on the substrate 110 by an evaporation method, a sputtering method, etc.",
"For example, the first electrode 120 may be formed as a transmission electrode utilizing a metal, an alloy, a conductive compound, etc., having high work function.",
"The first electrode 120 may be formed utilizing, for example, indium tin oxide (In2O3—SnO2: ITO), indium zinc oxide (In2O3—ZnO: IZO), tin oxide (SnO2), zinc oxide (ZnO), etc., having good transparency and conductivity.",
"In addition, the first electrode 120 may be formed as a reflection electrode formed by stacking a transparent and conductive layer, such as magnesium (Mg), aluminum (Al), etc.",
"(1-1-4.Configuration of Hole Transport Layer) The hole transport layer 130 may include a hole transport material and have hole transporting function.",
"The hole transport layer 130 may be formed, for example, on the first electrode 120 to a layer thickness (total layer thickness in a multi-layer structure) within a range from about 10 nm to about 150 nm.",
"Here, the hole transport layer 130 of the organic EL device 100 according to an embodiment may be formed as a multi-layer by stacking from the first electrode 120, an anode-side hole transport layer 131, an intermediate hole transport material layer 133 and an emission layer-side hole transport layer 135 one by one.",
"In addition, the ratio of the thicknesses of the layers is not specifically limited.",
"(1-1-4-1.Configuration of Anode-Side Hole Transport Layer) The anode-side hole transport layer 131 may be a layer including an anode-side hole transport material and being doped with an electron accepting material.",
"For example, the anode-side hole transport layer 131 may be formed on the first electrode 120.The anode-side hole transport layer 131 may be doped with the electron accepting material, and hole injection property from the first electrode 120 may be improved.",
"Thus, in one embodiment, the anode-side hole transport layer 131 may be provided near the first electrode 120, and for example, may be provided adjacent to the first electrode 120.The anode-side hole transport material included in the anode-side hole transport layer 131 may be any suitable hole transport material.",
"Examples of the anode-side hole transport material included in the anode-side hole transport layer 131 may be 1,1-bis[(di-4-tolylamino)phenyl]cyclohexane (TAPC), a carbazole derivative (such as N-phenyl carbazole or polyvinyl carbazole), N,N′-bis(3-methylphenyl)-N,N′-diphenyl-[1,1-biphenyl]-4,4′-diamine (TPD), 4,4′,4″-tris(N-carbazolyl)triphenylamine (TCTA), N,N′-di(1-naphthyl)-N,N′-diphenylbenzidine (NPB), etc.",
"The electron accepting material included in the anode-side hole transport layer 131 may be any suitable electron accepting material.",
"However, in one embodiment, the electron accepting material doped in the anode-side hole transport layer 131 may have a LUMO level from about −9.0 eV to about —4.0 eV, and for example, the electron accepting material doped in the anode-side hole transport layer 131 may have the LUMO level from about −6.0 eV to about −4.0 eV.",
"Here, examples of the electron accepting material having the LUMO level from about −9.0 eV to about −4.0 eV may include the compounds represented by Formulae 4-1 to 4-14.In the above Formulae 4-1 to 4-14, R is hydrogen, deuterium, a halogen atom, a fluoroalkyl group having 1 to 50 carbon atoms, a cyano group, an alkoxy group having 1 to 50 carbon atoms, an alkyl group having 1 to 50 carbon atoms, an aryl group having 6 to 50 carbon atoms or a heteroaryl group having 5 to 50 carbon atoms for forming a ring.",
"Ar is a substituted with an electron withdrawing group (e.g., a substituted aryl group having 6 to 50 carbon atoms for forming a ring and substituted with an electron withdrawing group) or an unsubstituted aryl group having 6 to 50 carbon atoms for forming a ring, or a substituted or unsubstituted heteroaryl group having 5 to 50 carbon atoms for forming a ring; Y is a methine group (—CH═) or a nitrogen atom (—N═); Z is a pseudohalogen atom or a sulfur (S) atom; n is an integer of 10 and less; and X is one of the substituents represented by the following formulae X1 to X7.In the above Formulae X1 to X7, Ra is hydrogen, deuterium, a halogen atom, a fluoroalkyl group having 1 to 50 carbon atoms, a cyano group, an alkoxy group having 1 to 50 carbon atoms, an alkyl group having 1 to 50 carbon atoms, a substituted or unsubstituted aryl group having 6 to 50 carbon atoms for forming a ring, or a substituted or unsubstituted heteroaryl group having 5 to 50 carbon atoms for forming a ring.",
"Examples of the substituted or unsubstituted aryl group having 6 to 50 carbon atoms for forming a ring represented by R, Ar and Ra may include a phenyl group, a 1-naphthyl group, a 2-naphthyl group, a 1-anthryl group, a 2-anthryl group, a 9-anthryl group, a 1-phenanthryl group, a 2-phenanthryl group, a 3-phenanthryl group, a 4-phenanthryl group, a 9-phenanthryl group, a 1-naphthacenyl group, a 2-naphthacenyl group, a 9-naphthacenyl group, a 1-pyrenyl group, a 2-pyrenyl group, a 4-pyrenyl group, a 2-biphenylyl group, a 3-biphenylyl group, a 4-biphenylyl group, a p-terphenyl-4-yl group, a p-terphenyl-3-yl group, a p-terphenyl-2-yl group, an m-terphenyl-4-yl group, an m-terphenyl-3-yl group, an m-terphenyl-2-yl group, an o-tolyl group, an m-tolyl group, a p-tolyl group, a p-t-butyl phenyl group, a p-(1-2-phenylpropyl)phenyl group, a 3-methyl-2-naphthyl group, a 4-methyl-1-naphthyl group, a 4-methyl-1-anthryl group, a 4′-methyl biphenylyl group, a 4″-t-butyl-p-terphenyl-4-yl group, a fluoranthenyl group, a fluorenyl group, etc.",
"Examples of the substituted or unsubstituted heteroaryl group having 5 to 50 carbon atoms for forming a ring represented by R, Ar and Ra may include a 1-pyrrolyl group, a 2-pyrrolyl group, a 3-pyrrolyl group, a pyridinyl group, a 2-pyridinyl group, a 3-pyridinyl group, a 4-pyridinyl group, a 1-indolyl group, a 2-indolyl group, a 3-indolyl group, a 4-indolyl group, a 5-indolyl group, a 6-indolyl group, a 7-indolyl group, a 1-isoindolyl group, a 2-isoindolyl group, a 3-isoindolyl group, a 4-isoindolyl group, a 5-isoindolyl group, a 6-isoindolyl group, a 7-isoindolyl group, a 2-furyl group, a 3-furyl group, a 2-benzofuranyl group, a 3-benzofuranyl group, a 4-benzofuranyl group, a 5-benzofuranyl group, a 6-benzofuranyl group, a 7-benzofuranyl group, a 1-isobenzofuranyl group, a 3-isobenzofuranyl group, a 4-isobenzofuranyl group, a 5-isobenzofuranyl group, a 6-isobenzofuranyl group, a 7-isobenzofuranyl group, a quinolyl group, a 3-quinolyl group, a 4-quinolyl group, a 5-quinolyl group, a 6-quinolyl group, a 7-quinolyl group, an 8-quinolyl group, a 1-isoquinolyl group, a 3-isoquinolyl group, a 4-isoquinolyl group, a 5-isoquinolyl group, a 6-isoquinolyl group, a 7-isoquinolyl group, an 8-isoquinolyl group, a 2-quinoxalinyl group, a 5-quinoxalinyl group, a 6-quinoxalinyl group, a 1-carbazolyl group, a 2-carbazolyl group, a 3-carbazolyl group, a 4-carbazolyl group, a 9-carbazolyl group, a 1-phenanthridinyl group, a 2-phenanthridinyl group, a 3-phenanthridinyl group, a 4-phenanthridinyl group, a 6-phenanthridinyl group, a 7-phenanthridinyl group, an 8-phenanthridinyl group, a 9-phenanthridinyl group, a 10-phenanthridinyl group, a 1-acridinyl group, a 2-acridinyl group, a 3-acridinyl group, a 4-acridinyl group, a 9-acridinyl group, a 1,7-phenanthroline-2-yl group, a 1,7-phenanthroline-3-yl group, a 1,7-phenanthroline-4-yl group, a 1,7-phenanthroline-5-yl group, a 1,7-phenanthroline-6-yl group, a 1,7-phenanthroline-8-yl group, a 1,7-phenanthroline-9-yl group, a 1,7-phenanthroline-10-yl group, a 1,8-phenanthroline-2-yl group, a 1,8-phenanthroline-3-yl group, a 1,8-phenanthroline-4-yl group, a 1,8-phenanthroline-5-yl group, a 1,8-phenanthroline-6-yl group, a 1,8-phenanthroline-7-yl group, a 1,8-phenanthroline-9-yl group, a 1,8-phenanthroline-10-yl group, a 1,9-phenanthroline-2-yl group, a 1,9-phenanthroline-3-yl group, a 1,9-phenanthroline-4-yl group, a 1,9-phenanthroline-5-yl group, a 1,9-phenanthroline-6-yl group, a 1,9-phenanthroline-7-yl group, a 1,9-phenanthroline-8-yl group, a 1,9-phenanthroline-10-ylgroup, a 1,10-phenanthroline-2-yl group, a 1,10-phenanthroline-3-yl group, a 1,10-phenanthroline-4-yl group, a 1,10-phenanthroline-5-yl group, a 2,9-phenanthroline-1-yl group, a 2,9-phenanthroline-3-yl group, a 2,9-phenanthroline-4-yl group, a 2,9-phenanthroline-5-yl group, a 2,9-phenanthroline-6-yl group, a 2,9-phenanthroline-7-yl group, a 2,9-phenanthroline-8-yl group, a 2,9phenanthroline-10-yl group, a 2,8-phenanthroline-1-yl group, a 2,8-phenanthroline-3-yl group, a 2,8-phenanthroline-4-yl group, a 2,8-phenanthroline-5-yl group, a 2,8-phenanthroline-6-yl group, a 2,8- phenanthroline-7-yl group, a 2,8-phenanthroline-9-yl group, a 2,8-phenanthroline-10-yl group, a 2,7-phenanthroline-1-yl group, a 2,7-phenanthroline-3-yl group, a 2,7-phenanthroline-4-yl group, a 2,7-phenanthroline-5-yl group, a 2,7-phenanthroline-6-yl group, a 2,7-phenanthroline-8-yl group, a 2,7-phenanthroline-9-yl group, a 2,7-phenanthroline-l0-yl group, a 1-phenazinyl group, a 2-phenazinyl group, a 1-phenothiazinyl group, a 2-phenothiazinyl group, a 3-phenothiazinyl group, a 4-phenothiazinyl group, a 10-phenothiazinyl group, a 1-phenoxaziny group, a 2-phenoxazinyl group, a 3-phenoxazinyl group, a 4-phenoxazinyl group, a 10-phenoxazinyl group, a 2-oxazolyl group, a 4-oxazolyl group, a 5-oxazolyl group, a 2-oxadiazolyl group, a 5-oxadiazolyl group, a 3-furazanyl group, a 2-thienyl group, a 3-thienyl group, a 2-methylpyrrole-1-yl group, a 2-methylpyrrole-3-yl group, a 2-methylpyrrole-4-yl group, a 2-methylpyrrole-5-yl group, a 3-methylpyrrole-1-yl group, a 3-methylpyrrole-2-yl group, a 3-methylpyrrole-4-yl group, a 3-methylpyrrole-5-yl group, a 2-t-butylpyrrole-4-yl group, a 3-(1-2-phenylpropyl) pyrrole-1-yl group, a 2-methyl-1-indolyl group, a 4-methyl-1-indolyl group, a 2-methyl-3-indolyl group, a 4-methyl-3-indolyl group, a 2-t-butyl-1-indolyl group, a 4-t-butyl-1-indolyl group, a 2-t-butyl-3-indolyl group, a 4-t-butyl-3-indolyl group, etc.",
"Examples of the fluoroalkyl group in the substituted or unsubstituted fluoroalkyl group having 1 to 50 carbon atoms represented by R and Ra may include a perfluoroalkyl group (such as a trifluoromethyl group, a pentafluoroethyl group, a heptafluoropropyl group or a heptadecafluorooctane group), a monofluoromethyl group, a difluoromethyl group, a trifluoroethyl group, a tetrafluoropropyl group, an octafluoropentyl group, etc.",
"Examples of the substituted or unsubstituted alkyl group having 1 to 50 carbon atoms represented by R and Ra may include a methyl group, an ethyl group, a propyl group, an isopropyl group, an n-butyl group, an s-butyl group, an isobutyl group, a t-butyl group, an n-pentyl group, an n-hexyl group, an n-heptyl group, an n-octyl group, a hydroxymethyl group, a 1-hydroxyethyl group, a 2-hydroxyethyl group, a 2-hydroxyisobutyl group, a 1,2-dihydroxyethyl group, a 1,3-dihydroxyisopropyl group, a 2,3-dihydroxy-t-butyl group, a 1,2,3-trihydroxypropyl group, a chloromethyl group, a 1-chloroethyl group, a 2-chloroethyl group, a 2-chloroisobutyl group, a 1,2-dichloroethyl group, a 1,3-dichloroisopropyl group, a 2,3-dichloro-t-butyl group, a 1,2,3-trichloropropyl group, a bromomethyl group, a 1-bromoethyl group, a 2-bromoethyl group, a 2-bromoisobutyl group, a 1,2-dibromoethyl group, a 1,3-dibromoisopropyl group, a 2,3-dibromo-t-butyl group, a 1,2,3-tribromopropyl group, an iodomethyl group, a 1-iodoethyl group, a 2-iodoethyl group, a 2-iodoisobutyl group, a 1,2-diiodoethyl group, a 1,3-diiodoisopropyl group, a 2,3-diiodo-t-butyl group, a 1,2,3-triiodopropyl group, an aminomethyl group, a 1-aminoethyl group, a 2-aminoethyl group, a 2-aminoisobutyl group, a 1,2-diaminoethyl group, a 1,3-diaminoisopropyl group, a 2,3-diamino-t-butyl group, a 1,2,3-triaminopropyl group, a cyanomethyl group, a 1-cyanoethyl group, a 2-cyanoethyl group, a 2-cyanoisobutyl group, a 1,2-dicyanoethyl group, a 1,3-dicyanoisopropyl group, a 2,3-dicyano-t-butyl group, a 1,2,3-tricyanopropyl group, a nitromethyl group, a 1-nitroethyl group, a 2-nitroethyl group, a 2-nitroisobutyl group, a 1,2-dinitroethyl group, a 1,3-dinitroisopropyl group, a 2,3-dinitro-t-butyl group, a 1,2,3-trinitropropyl group, a cyclopropyl group, a cyclobutyl group, a cyclopentyl group, a cyclohexyl group, a 4-methylcyclohexyl group, a 1-adamantyl group, a 2-adamantyl group, a 1-norbornyl group, a 2-norbornyl group, etc.",
"The substituted or unsubstituted alkoxy group having 1 to 50 carbon atoms represented by R and Ra may be a group represented by —OY.",
"Examples of Y may include a methyl group, an ethyl group, a propyl group, an isopropyl group, an n-butyl group, an s-butyl group, an isobutyl group, a t-butyl group, an n-pentyl group, an n-hexyl group, an n-heptyl group, an n-octyl group, a hydroxymethyl group, a 1-hydroxyethyl group, a 2-hydroxyethyl group, a 2-hydroxyisobutyl group, a 1,2-dihydroxyethyl group, a 1,3-dihydroxyisopropyl group, a 2,3-dihydroxy-t-butyl group, a 1,2,3-trihydroxypropyl group, a chloromethyl group, a 1-chloroethyl group, a 2-chloroethyl group, a 2-chloroisobutyl group, a 1,2-dichloroethyl group, a 1,3-dichloroisopropyl group, a 2,3-dichloro-t-butyl group, a 1,2,3-trichloropropyl group, a bromomethyl group, a 1-bromoethyl group, a 2-bromoethyl group, a 2-bromoisobutyl group, a 1,2-dibromoethyl group, a 1,3-dibromoisopropyl group, a 2,3-dibromo-t-butyl group, a 1,2,3-tribromopropyl group, an iodomethyl group, a 1-iodoethyl group, a 2-iodoethyl group, a 2-iodoisobutyl group, a 1,2-diiodoethyl group, a 1,3-diiodoisopropyl group, a 2,3-diiodo-t-butyl group, a 1,2,3-triiodopropyl group, an aminomethyl group, a 1-aminoethyl group, a 2-aminoethyl group, a 2-aminoisobutyl group, a 1,2-diaminoethyl group, a 1,3-diaminoisopropyl group, a 2,3-diamino-t-butyl group, a 1,2,3-triaminopropyl group, a cyanomethyl group, a 1-cyanoethyl group, a 2-cyanoethyl group, a 2-cyanoisobutyl group, a 1,2-dicyanoethyl group, a 1,3-dicyanoisopropyl group, a 2,3-dicyano-t-butyl group, a 1,2,3-tricyanopropyl group, a nitromethyl group, a 1-nitroethyl group, a 2-nitroethyl group, a 2-nitroisobutyl group, a 1,2-dinitroethyl group, a 1,3-dinitroisopropyl group, a 2,3-dinitro-t-butyl group, a 1,2,3-trinitropropyl group, etc.",
"Examples of the halogen atom represented by R and Ra may include fluorine (F), chlorine (Cl), bromine (Br), iodine (I), etc.",
"Here, example compounds of the electron accepting material may include the following Compounds 4-15 and 4-16.For example, the LUMO level of Compound 4-15 may be about −4.40 eV, and the LUMO level of Compound 4-16 may be about −5.20 eV.",
"However, the electron accepting material is not limited to the following Compounds 4-15 and 4-16.In addition, the amount doped of the electron accepting material may be an amount capable of being doped into the anode-side hole transport layer 131, without any limitation (e.g., the amount of the electron accepting material doped into or included in the anode-side hole transport layer 131 is not particularly limited and may be any suitable amount).",
"For example, the amount doped of the electron accepting material may be from about 0.1 wt % to about 50 wt % on the basis of the total amount of the anode-side hole transport material included in the anode-side hole transport layer 131, and may be from about 0.5 wt % to about 5 wt %.",
"(1-1-4-2.Configuration of Intermediate Hole Transport Material Layer) The intermediate hole transport material layer 133 may include an intermediate hole transport material.",
"The intermediate hole transport material layer 133 may be formed, for example, on the anode-side hole transport layer 131.The intermediate hole transport material included in the intermediate hole transport material layer 133 may be any suitable hole transport material.",
"For example, the intermediate hole transport material may utilize the above-mentioned hole transport materials as the anode-side hole transport materials.",
"However, in one embodiment, the intermediate hole transport material may be a compound represented by the following Formula 2.In the above Formula 2, Ar7 to Ar9 are each independently a substituted or unsubstituted aryl group having 6 to 50 carbon atoms for forming a ring or a substituted or unsubstituted heteroaryl group having 5 to 50 carbon atoms for forming a ring; Ar10 is hydrogen, deuterium, a halogen atom, a substituted or unsubstituted aryl group having 6 to 50 carbon atoms for forming a ring, a substituted or unsubstituted heteroaryl group having 5 to 50 carbon atoms for forming a ring or a substituted or unsubstituted alkyl group having 1 to 50 carbon atoms; and L4 is a direct linkage, a substituted or unsubstituted arylene group having 6 to 18 carbon atoms for forming a ring or a substituted or unsubstituted heteroarylene group having 5 to 15 carbon atoms for forming a ring.",
"Examples of Ar7 to Ar9 may include a phenyl group, a biphenyl group, a terphenyl group, a naphthyl group, an anthryl group, a phenanthryl group, a fluorenyl group, an indenyl group, a pyrenyl group, an acetonaphthenyl group, a fluoranthenyl group, a triphenylenyl group, a pyridyl group, a furanyl group, a pyranyl group, a thienyl group, a quinolyl group, an isoquinolyl group, a benzofuranyl group, a benzothienyl group, an indolyl group, a carbazolyl group, a benzoxazolyl group, a benzothiazolyl group, a quinoxalyl group, a pyrazolyl group, a dibenzofuranyl group, a dibenzothienyl group, etc.",
"In one embodiment, examples of Ar7 to Ar9 may include the phenyl group, the biphenyl group, the terphenyl group, the fluorenyl group, the carbazolyl group, the dibenzofuranyl group, etc.",
"Examples of Ar10 may include a phenyl group, a biphenyl group, a terphenyl group, a naphthyl group, an anthryl group, a phenanthryl group, a fluorenyl group, an indenyl group, a pyrenyl group, an acetonaphthenyl group, a fluoranthenyl group, a triphenylenyl group, a pyridyl group, a furanyl group, a pyranyl group, a thienyl group, a quinolyl group, an isoquinolyl group, a benzofuranyl group, a benzothienyl group, an indolyl group, a carbazolyl group, a benzoxazolyl group, a benzothiazolyl group, a quinoxalyl group, a pyrazolyl group, a dibenzofuranyl group, a dibenzothienyl group, a methyl group, an ethyl group, a propyl group, an isopropyl group, an n-butyl group, etc.",
"In one embodiment, examples of Ar11 may include the phenyl group, the biphenyl group, the terphenyl group, the fluorenyl group, the carbazolyl group, the dibenzofuranyl group, etc.",
"Examples of L4 other than the direct linkage may include a phenylene group, a biphenylene group, a terphenylene group, a naphthylene group, an anthrylene group, a phenanthrylene group, a fluorenylene group, an indenylene group, a pyrenylene group, an acetonaphthenylene group, a fluoranthenylene group, a triphenylenylene group, a pyridylene group, a furanylene group, a pyranylene group, a thienylene group, a quinolylene group, an isoquinolylene group, a benzofuranylene group, a benzothienylene group, an indolylene group, a carbazolylene group, a benzoxazolylene group, a benzothiazolylene group, a kinokisariren group, a benzoimidazolylene group, a pyrazolylene group, a dibenzofuranylene group, a dibenzothienylene group, etc.",
"In one embodiment, L4 may include the direct linkage, the phenylene group, the biphenylene group, the terphenylene group, the fluorenylene group, the carbazolylene group or the dibenzofuranylene group.",
"Examples of the compound represented by Formula 2 may include the following Compounds 2-1 to 2-17.However, the compound represented by Formula 2 is not limited to the following Compounds 2-1 to 2-17.The intermediate hole transport material layer 133 may include the compound represented by the above Formula 2 as the intermediate hole transport material and may improve the hole transporting property of the hole transport layer 130.Thus, the emission efficiency and emission life of the organic EL device 100 may be improved.",
"In addition, the compound represented by Formula 2 may be included in the anode-side hole transport layer 131 as the anode-side hole transport material.",
"In the case that the anode-side hole transport layer 131 includes the compound represented by Formula 2 as the anode-side hole transport material, the hole transporting property of the hole transport layer 130 may be improved.",
"Thus, the emission efficiency and emission life of the organic EL device 100 may be improved.",
"(1-1-4-3.Configuration of Emission Layer-Side Hole Transport Layer) The emission layer-side hole transport layer 135 may include a compound represented by the following Formula 1.The emission layer-side hole transport layer 135 may be formed, for example, on the intermediate hole transport material layer 133, adjacent to the emission layer 140.In Formula 1, Y is O or S; R1 to R6 are each independently hydrogen, deuterium, a halogen atom, a substituted or unsubstituted alkyl group having 1 to 15 carbon atoms, a substituted or unsubstituted silyl group, a substituted or unsubstituted aryl group having 6 to 30 carbon atoms for forming a ring, a substituted or unsubstituted heteroaryl group having 1 to 30 carbon atoms for forming a ring, or a substituted or unsubstituted aryl group or heteroaryl group formed via condensation of optional adjacent substituents; Ar1 and Ar2 are each independently a substituted or unsubstituted aryl group having 6 to 30 carbon atoms for forming a ring, or a substituted or unsubstituted heteroaryl group having 1 to 30 carbon atoms for forming a ring; L1 to L3 are each independently a direct linkage, a substituted or unsubstituted alkylene group having 1 to 15 carbon atoms, a substituted or unsubstituted aralkylene group having 7 to 30 carbon atoms, a substituted or unsubstituted arylene group having 6 to 30 carbon atoms for forming a ring, a substituted or unsubstituted heteroarylene group having 1 to 30 carbon atoms for forming a ring, or a substituted or unsubstituted divalent silyl group; m is an integer from 0 to 3; and n is an integer from 0 to 4.Examples of R1 to R6 may include hydrogen, deuterium, a halogen atom, a phenyl group, a biphenyl group, a terphenyl group, a naphthyl group, an anthryl group, a phenanthryl group, a fluorenyl group, an indenyl group, a pyrenyl group, an acetonaphthenyl group, a fluoranthenyl group, a triphenylenyl group, a pyridyl group, a furanyl group, a pyranyl group, a thienyl group, a quinolyl group, an isoquinolyl group, a benzofuranyl group, a benzothienyl group, an indolyl group, a carbazolyl group, a benzoxazolyl group, a benzothiazolyl group, a quinoxalyl group, a pyrazolyl group, a dibenzofuranyl group, a dibenzothienyl group, a methyl group, an ethyl group, a propyl group, an isopropyl group, an n-butyl group, etc.",
"In one embodiment, examples of R1 and R6 may include the hydrogen atom, the halogen atom, the methyl group, the phenyl group, the biphenyl group, the fluorenyl group, the carbazolyl group, and the dibenzofuranyl group.",
"Examples of Ar1 and Ar2 may include a phenyl group, a biphenyl group, a terphenyl group, a naphthyl group, an anthryl group, a phenanthryl group, a fluorenyl group, an indenyl group, a pyrenyl group, an acetonaphthenyl group, a fluoranthenyl group, a triphenylenyl group, a pyridyl group, a furanyl group, a pyranyl group, a thienyl group, a quinolyl group, an isoquinolyl group, a benzofuranyl group, a benzothienyl group, an indolyl group, a carbazolyl group, a benzoxazolyl group, a benzothiazolyl group, a quinoxalyl group, a pyrazolyl group, a dibenzofuranyl group, a dibenzothienyl group, etc.",
"In one embodiment, examples of Ar1 and Ar2 may include the phenyl group, the biphenyl group, the terphenyl group, the fluorenyl group, the carbazolyl group, the dibenzofuranyl group, etc.",
"Examples of L1 to L3 other than the direct linkage may be a corresponding divalent substituent of the substituents illustrated in the above Ar1 and Ar2 (e.g., examples of L1 to L3 other than the direct linkage may be a corresponding divalent group of the groups listed above for Ar1 and Ar2).",
"Examples of L1 to L3 other than the direct linkage may include a phenylene group, a naphthylene group, a biphenylene group, a thienothiophenylene group and a pyridylene group.",
"In one embodiment, L1 to L3 may be the direct linkage, the phenylene group or the biphenylene group.",
"Examples of the compound represented by Formula 1 may include the following Compounds 1 to 48.However, the compound represented by Formula 1 is not limited to the following Compounds 1 to 48.The emission layer-side hole transport layer 135 may include the compound represented by the above Formula 1 as the emission layer-side hole transport material and may passivate the hole transport layer 130 from electrons not consumed in the emission layer 140.In addition, since the emission layer-side hole transport layer 135 includes the compound represented by the above Formula 1, the diffusion of energy in an excited state generated in the emission layer 140 into the hole transport layer 130 may be reduced or prevented.",
"Thus, according to this configuration, the emission layer-side hole transport layer 135 may improve the current flow durability of the hole transport layer 130.In addition, in one embodiment, the emission layer-side hole transport layer 135 may be formed near the emission layer 140, for example, the emission layer-side hole transport layer 135 may be formed adjacent to the emission layer 140 to effectively reduce or prevent the diffusion of the electrons or the energy from the emission layer 140.Since the emission layer-side hole transport layer 135 includes the compound represented by the above Formula 1, the charge balance of the whole organic EL device 100 may be controlled, and the diffusion of the electron accepting material doped into the anode-side hole transport layer 131 into the emission layer 140 may be restrained (e.g., reduced or prevented).",
"Accordingly, the emission layer-side hole transport layer 135 may improve the whole charge transport property of the hole transport layer 130.Since the emission layer-side hole transport layer 135 includes the compound represented by the above Formula 1, the charge transport property and current flow durability of the hole transport layer 130 may be improved.",
"Thus, the emission layer-side hole transport layer 135 may improve the emission efficiency and emission life of the organic EL device 100.As described above, the hole transport layer 130 including the anode-side hole transport layer 131, the intermediate hole transport material layer 133 and the emission layer-side hole transport layer 135 may improve the current flow durability and hole transport property of the organic EL device 100.Thus, the organic EL device 100 according to an embodiment may have improved emission efficiency and emission life.",
"(1-1-5.Configuration of Emission Layer) The emission layer 140 may include a host material, a dopant material as a luminescent material, etc., and emits light via fluorescence or phosphorescence.",
"The emission layer 140 may be formed, for example, on the hole transport layer 130 to a layer thickness within a range from about 10 nm to about 60 nm.",
"The host material and the dopant material included in the emission layer 140 may include any suitable host materials and dopant materials.",
"For example, the emission layer 140 may include a fluoranthene derivative, a pyrene derivative, an arylacetylene derivative, a fluorene derivative, a perylene derivative, a chrysene derivative, etc., as the host material or the dopant material.",
"In one embodiment, the emission layer 140 may include tris(8-quinolinolato)aluminum (Alq3), 4,4′-N,N′-dicarbazole-biphenyl (CBP), poly(n-vinylcarbazole) (PVK), 4,4′,4″-tris(N-carbazolyl)triphenylamine (TCTA), 1,3,5-tris(N-phenylbenzimidazole-2-yl)benzene (TPBI), 3-tert-butyl-9,10-di(naphtho-2-yl)anthracene (TBADN), distyrylarylene (DSA), 4,4′-bis(9-carbazole)-2,2′-dimethyl-biphenyl (dmCBP), bis(2,2-diphenyl vinyl)-1,1′-biphenyl (DPVBi), 1,4-bis[2-(3-N-ethylcarbazolyl)vinyl]benzene (BCzVB), 4-(di-p-tolylamino)-4′-[(di-p-tolylamino)styryl]stilbene (DPAVB), N-(4-(E)-2-(6-((E)-4-(diphenylamino)styryl)naphthalen-2-yl)vinyl)phenyl)-N-phenylbenzenamine (N-BDAVBi), 2,5,8,11-tetra-t-butylperylene (TBPe), 1,1-dipyrene, 1,4-dipyrenylbenzene, 1,4-bis(N,N-diphenylamino)pyrene, etc., as the host material or the dopant material.",
"In addition, the emission layer 140 may, in one embodiment, include a compound represented by the following Formula 3.In the above Formula 3, Ar11 is each independently (e.g., when o is two or greater, each of Ar11 is independently) hydrogen, deuterium, a substituted or unsubstituted alkyl group having 1 to 50 carbon atoms, a substituted or unsubstituted cycloalkyl group having 3 to 50 carbon atoms for forming a ring, a substituted or unsubstituted alkoxy group having 1 to 50 carbon atoms, a substituted or unsubstituted aralkyl group having 7 to 50 carbon atoms, a substituted or unsubstituted aryloxy group having 6 to 50 carbon atoms for forming a ring, a substituted or unsubstituted arylthio group having 6 to 50 carbon atoms for forming a ring, a substituted or unsubstituted alkoxycarbonyl group having 2 to 50 carbon atoms, a substituted or unsubstituted aryl group having 6 to 50 carbon atoms for forming a ring, a substituted or unsubstituted heteroaryl group having 5 to 50 carbon atoms for forming a ring, a substituted or unsubstituted silyl group, a carboxyl group, a halogen atom, a cyano group, a nitro group or a hydroxyl group; and o is an integer from 1 to 10.In addition, examples of the compound represented by Formula 3 may include the following Compounds 3-1 to 3-12.However, the compound represented by Formula 3 is not limited to the following Compounds 3-1 to 3-12.In the case that the emission layer 140 includes the compound represented by Formula 3, the anode-side hole transport layer 131 may improve the hole injection property from the first electrode 120 significantly.",
"Thus, the emission layer 140 may further improve the emission property of the organic EL device 100 by including the compound represented by Formula 3.The emission layer 140 may include the compound represented by Formula 3 as the host material or as the dopant material.",
"The emission layer 140 may be formed as an emission layer emitting light with a specific color.",
"For example, the emission layer 140 may be formed as a red emitting layer, a green emitting layer or a blue emitting layer.",
"In the case that the emission layer 140 is the blue emitting layer, suitable blue dopants may be utilized.",
"For example, perylene and the derivative thereof, and/or an iridium (Ir) complex (such as bis[2-(4,6-difluorophenyl)pyridinate]picolinate iridium(III) (Flrpic)) may be utilized as the blue dopant.",
"In the case that the emission layer 140 is the red emitting layer, suitable red dopants may be utilized.",
"For example, rubrene and the derivative thereof, 4-dicyanomethylene-2-(p-dimethylaminostyryl)-6-methyl-4H-pyrane (DCM) and the derivative thereof, an iridium complex (such as bis(1-1-phenylisoquinoline)(acetylacetonate) iridium(III) (Ir(piq)2(acac)), an osmium (Os) complex, a platinum complex, etc., may be utilized as the red dopant.",
"In the case that the emission layer 140 is the green emitting layer, suitable green dopants may be utilized.",
"For example, coumarin and the derivative thereof, an iridium complex (such as tris(2-phenylpyridine) iridium(III) (Ir(ppy)3)), etc., may be utilized.",
"(1-1-6.Configuration of Electron Transport Layer) The electron transport layer 150 is a layer including an electron transport material and having electron transporting function.",
"The electron transport layer 150 may be formed, for example, on the emission layer 140 to a layer thickness within a range from about 15 nm to about 50 nm.",
"The electron transport material included in the electron transport layer 150 may be any suitable electron transport materials.",
"Examples of the suitable electron transport material may include, tris(8-hydroxyquinolinato)aluminum (Alq3) or an electron transport material having a nitrogen-containing aromatic ring.",
"Examples of the electron transport material having a nitrogen-containing aromatic ring may include an electron transport material including a pyridine ring (such as 1,3,5-tri[(3-pyridyl)-phen-3-yl]benzene), an electron transport material including a triazine ring (such as 2,4,6-tris(3′-(pyridin-3-yl)biphenyl-2-yl)-1,3,5-triazine), an electron transport material including an imidazole derivative (such as 2-(4-(N-phenylbenzoimidazolyl-1-ylphenyl)-9,10-dinaphthylanthracene)), etc.",
"(1-1-7.Configuration of Electron Injection Layer) The electron injection layer 160 is a layer having function of easy injection of electrons from the second electrode 170.The electron injection layer 160 may be formed, for example, on the electron transport layer 150 to a layer thickness within a range from about 0.3 nm to about 9 nm.",
"The electron injection layer 160 may be formed utilizing any suitable materials that may be utilized as materials for forming the electron injection layer 160.Examples of the material for forming the electron injection layer 160 may include a Li complex (such as lithium 8-quinolinato (Liq) or lithium fluoride (LiF)), sodium chloride (NaCl), cesium fluoride (CsF), lithium oxide (Li2O), barium oxide (BaO), etc.",
"(1-1-8.Configuration of Second Electrode) The second electrode 170 may be, for example, a cathode and formed on the electron injection layer 160 utilizing an evaporation method or a sputtering method.",
"For example, the second electrode 170 may be formed as a reflection electrode utilizing a metal, an alloy, a conductive compound, etc., having low work function.",
"The second electrode 170 may be formed utilizing, a metal (such as lithium (Li), magnesium (Mg), aluminum (Al) or calcium (Ca)), or a metal mixture (such as aluminum-lithium (Al—Li), magnesium-indium (Mg—In) or magnesium-silver (Mg—Ag)).",
"In addition, the second electrode 170 may be formed as a thin film of a metal material, having a thickness of about 20 nm, or less (e.g., not greater than 20 nm) and may be formed as a transmission electrode utilizing ITO, IZO, etc.",
"(1-1-9.Modification Example of Organic EL Device) In addition, the structure of the organic EL device 100 shown in the drawing is only an illustration, and the organic EL device 100 according to an embodiment is not limited to the structure of the drawing.",
"In the organic EL device 100 according to an embodiment, some layers may be formed as a multi-layer, or another layer may be additionally formed.",
"In the organic EL device 100 according to an embodiment, at least one of the electron transport layer 150 and the electron injection layer 160 may not be provided.",
"In the organic EL device 100 according to an embodiment, a hole injection layer may be provided between the first electrode 120 and the hole transport layer 130.The hole injection layer is a layer having the function of easy injection of holes from the first electrode 120.The hole injection layer may be formed, for example, on the first electrode 120 to a layer thickness within a range from about 10 nm to about 150 nm.",
"The hole injection layer may be formed utilizing any suitable materials for forming the hole injection layer.",
"Examples of the material for forming the hole injection layer may include a triphenylamine-containing polyether ketone (TPAPEK), 4-isopropyl-4′-methyldiphenyliodonium tetrakis(pentafluorophenyl)borate (PPBI), N,N′-diphenyl-N,N′-bis-[4-(phenyl-m-tolyl-amino)-phenyl]-biphenyl-4,4′-diamine (DNTPD), a phthalocyanine compound (such as copper phthalocyanine), 4,4′,4″-tris(3-methylphenylphenylamino)triphenylamine (m-MTDATA), N,N′-di(1-naphthyl)-N,N′-diphenylbenzidine (NPB), 4,4′,4″-tris{N,N-diamino}triphenylamine (TDATA), 4,4′,4″-tris(N,N-2-naphthylphenylamino)triphenylamine (2-TNATA), polyaniline/dodecylbenzenesulfonic acid (Pani/DBSA), poly(3,4-ethylenedioxythiophene)/poly(4-styrenesulfonate) (PEDOT/PSS), polyaniline/camphorsulfonic acid (Pani/CSA) or polyaniline/poly(4-styrenesulfonate) (PANI/PSS), etc.",
"(1-1-10.Method of Manufacturing Organic EL Device) Each layer of the organic EL device 100 according to an embodiment as described above may be formed by selecting an appropriate layer forming method depending on materials utilized, such as vacuum evaporation, sputtering, or various other suitable coating methods.",
"For example, a metal layer such as the first electrode 120, the second electrode 170, or the electron injection layer 160 may be formed utilizing an evaporation method (including an electron beam evaporation method, a hot filament evaporation method and/or a vacuum evaporation method), a sputtering method, and/or a plating method (including an electroplating method and/or an electroless plating method).",
"An organic layer (such as the hole transport layer 130, the emission layer 140 or the electron transport layer 150) may be formed utilizing a physical vapor deposition (PVD) method (such as a vacuum deposition method), a printing method (such as a screen printing method or an ink jet printing method), a laser transcription method and/or a coating method (such as a spin coating method).",
"Hereinabove, an embodiment of the organic EL device 100 according to an embodiment has been explained in more detail.",
"EXAMPLES 1-2.Examples Hereinafter, organic EL devices according to example embodiments will be explained in more detail referring to examples and comparative examples.",
"The following embodiments are only for illustration, and the organic EL devices according to example embodiments are not limited thereto.",
"(1-2-1.Synthesis of Compound Represented by Formula 1) First, a synthetic method of a compound represented by Formula 1 will be explained in more detail referring to synthetic methods of Compounds 1 and 5.The following embodiments are only for illustration, and the synthetic methods of the compound represented by Formula 1 are not limited thereto.",
"(1-2-1-1.Synthesis of Compound 1) According to the following Reaction 1, Compound 1, which is the compound represented by Formula 1, was synthesized.",
"The product thus obtained was identified by measuring physical properties by means of 1HNMR and FAB-MS. (Synthesis of Compound A) Under an Ar atmosphere, 53.8 g of N-[1,1′-biphenyl]-4-yl-N-(4-bromophenyl)-[1,1′-biphenyl]-4-amine, 6.46 g of Pd(dppf)Cl2.CH2Cl2, 33.3 g of KOAc and 33.0 g of bis(pinacolato)diboron were added to a 2 L flask, followed by degassing under vacuum and stirring in a dioxane solvent at about 100° C. for about 12 hours.",
"Then, solvents were distilled from the reactant, CH2Cl2 and water were added thereto, and an organic phase was separated.",
"To the separated organic phase, magnesium sulfate (Mg2SO4) and activated clay were added, filtering with suction was performed, and the solvent was distilled.",
"The crude product thus obtained was separated by silica gel column chromatography utilizing a mixture solvent of dichloromethane and hexane, to produce 56.8 g (Yield 98%) of Compound A as a white solid (FAB-MS: C36H34BNO2, measured value 523).",
"(Synthesis of Compound B) Under an Ar atmosphere, 10.0 g of Compound A, 6.00 g of 1-iodo-3-bromobenzene, 1.54 g of Pd(PPh3)4, and 5.25 g of potassium carbonate (K2CO3) were added to a 300 mL, three necked flask, followed by heating and stirring in a mixture solvent of 450 mL of toluene and 60 mL of water at about 90° C. for about 8 hours.",
"After air cooling, water was added to the reactant, an organic phase was separated, and solvents were distilled from the separated organic phase.",
"The crude product thus obtained was separated by silica gel column chromatography utilizing a mixture solvent of dichloromethane and hexane and recrystallized utilizing a mixture solvent of toluene and hexane to produce 9.29 g (Yield 88%) of Compound B as a white solid (FAB-MS: C36H26BrN, measured value 551).",
"(Synthesis of Compound 1) Under an Ar atmosphere, 3.10 g of Compound B, 1.2 g of dibenzofuran-4-boronic acid, 0.84 g of Pd(PPh3)4, and 2.35 g of potassium carbonate (K2CO3) were added to a 500 mL, three necked flask, followed by heating and stirring in a mixture solvent of 170 mL of toluene and 80 mL of water at about 90° C. for about 8 hours.",
"After air cooling, water was added to the reactant, an organic phase was separated, and solvents were distilled from the separated organic phase.",
"The crude product thus obtained was separated by silica gel column chromatography utilizing a mixture solvent of dichloromethane and hexane and recrystallized utilizing a mixture solvent of toluene and hexane to produce 3.08 g (Yield 86%) of Compound 1 as a white solid.",
"Chemical shift values (δ) of Compound 1 by 1HNMR (300 MHz, CDCl3) were 8.11 (s, 1H), 8.00 (d, J=7.6 Hz, 1H), 7.96 (d, J=7.6 Hz, 1H), 7.87 (d, J=7.4 Hz, 1H), 7.67-7.23 (m, 29H), and the measured molecular weight of Compound 1 by FAB-MS was 639 (C48H33NO).",
"(1-2-1-2.Synthesis of Compound 5) According to the following Reaction 2, Compound 5 as the compound represented by Formula 1 was synthesized.",
"The product was identified by measuring the physical properties by 1HNMR and FAB-MS. (Synthesis of Compounds A and B) Since the synthetic method of Compounds A and B are the same as described above (1-2-1-1.Synthesis of Compound 1), explanation thereabout will not be provided again.",
"(Synthesis of Compound 5) Under an Ar atmosphere, 3.10 g of Compound B, 1.28 g of dibenzothiophene-4-boronic acid, 0.84 g of Pd(PPh3)4, and 2.35 g of potassium carbonate (K2CO3) were added to a 500 mL, three necked flask, followed by heating and stirring in a mixture solvent of 170 mL of toluene and 80 mL of water at about 90° C. for about 8 hours.",
"After air cooling, water was added to the reactant, an organic phase was separated, and solvents were distilled from the separated organic phase.",
"The crude product thus obtained was separated by silica gel column chromatography utilizing a mixture solvent of dichloromethane and hexane and recrystallized utilizing a mixture solvent of toluene and hexane to produce 2.94 g (Yield 80%) of Compound 5 as a white solid.",
"Chemical shift values (δ) of Compound 5 by 1HNMR (300 MHz, CDCl3) were 8.46-8.41 (m, 2H), 8.20 (d, 1H, J=7.80 Hz), 7.98 (d, 1H, J=7.90 Hz), 7.58-7.50 (m, 18H), 7.48-7.41 (m, 4H), 6.69-6.65 (m, 4H), and the measured molecular weight of Compound 5 by FAB-MS was 656 (C48H33NS).",
"(1-2-2.Manufacture of Organic EL Device Including Anode-Side Hole Transport Material and Anode-Side Hole Transport Layer Doped with Electron Accepting Material) An organic EL device according to an embodiment was manufactured by the following manufacturing method.",
"First, with respect to an ITO-glass substrate patterned and washed in advance, surface treatment utilizing UV-Ozone (O3) was conducted.",
"The layer thickness of an ITO layer (first electrode) on a glass substrate was about 150 nm.",
"After ozone treatment, the surface treated substrate was inserted in a glass bell jar evaporator for forming an organic layer, and an anode-side hole transport layer, an intermediate hole transport material layer, an emission layer-side hole transport layer, an emission layer and an electron transport layer were evaporated one by one with a vacuum degree of about 10−4 to about 10−5 Pa.",
"The layer thickness of each of the anode-side hole transport layer, the intermediate hole transport material layer and the emission layer-side hole transport layer was about 10 nm.",
"The layer thickness of the emission layer was about 25 nm, and the layer thickness of the electron transport layer was about 25 nm.",
"Then, the substrate was moved into a glass bell jar evaporator for forming a metal layer, and an electron injection layer and a second electrode were evaporated with a vacuum degree of about 10−4 to about 10−5 Pa.",
"The layer thickness of the electron injection layer was about 1 nm and the layer thickness of the second electrode was about 100 nm.",
"Here, the anode-side hole transport layer, the intermediate hole transport material layer and the emission layer-side hole transport layer correspond to the hole transport layer with a stacked structure.",
"The anode-side hole transport layer, the intermediate hole transport material layer and the emission layer-side hole transport layer were manufactured in examples and comparative examples utilizing the materials shown in the following Table 1.In Table 1, for example, the expression of “Compound 2-3, Compound 4-15” indicates that Compound 2-3 is the anode-side hole transport material, and Compound 4-15 is the doped electron accepting material.",
"The amount doped of the electron accepting material was about 3 wt % on the basis of the amount of the anode-side hole transport material.",
"In addition, Compounds 6-1, 6-2 and 6-3 refers to common hole transport materials represented by the following formula 12.9,10-di(1-2-naphthyl)anthracene (ADN, Compound 3-2) was utilized as the host material of the emission layer, and 2,5,8,11-tetra-t-butylperylene (TBP) was utilized as the dopant material.",
"3 wt % of the dopant material on the basis of the amount of the host material was added.",
"In addition, the electron transport layer was formed utilizing Alq3, the electron injection layer was formed utilizing LiF, and the second electrode was formed utilizing aluminum (Al).",
"(1-2-2.Evaluation Results) Then, the driving voltage and the half life of the organic EL device thus manufactured were evaluated.",
"Evaluation results are shown together in the following Table 1.The driving voltage and the emission efficiency in each example and comparative example were obtained by measuring at current density of about 10 mA/cm2.The emission life was obtained by measuring a time period for decreasing luminance to half with the initial luminance of about 1,000 cd/m2.In addition, the measurement was conducted utilizing a source meter of 2400 series of Keithley Instruments Co., a Color brightness photometer CS-200 (Konica Minolta holdings Co., Ltd., measurement angle of 1°), and a PC program LabVIEW8.2 (National instruments Co., Ltd. in Japan) in a dark room.",
"TABLE 1 Anode-side Intermediate hole hole Emission Driving Emission transport transport layer-side hole current efficiency Emission material material transport layer [V] [cd/A] life LT50 [h] Example Compound Compound Compound 1 6.1 7.6 4,000 1-1 2-3, 2-3 Compound 4-15 Example Compound Compound Compound 5 6.1 7.5 4,100 1-2 2-3, 2-3 Compound 4-15 Example Compound Compound Compound 1 6.2 7.4 3,900 1-3 2-3, 2-3 Compound 4-16 Example Compound Compound Compound 1 6.1 7.6 3,200 1-4 2-3, 2-17 Compound 4-15 Example Compound Compound Compound 1 6.5 7.5 3,200 1-5 6-2, 2-3 Compound 4-15 Example Compound Compound Compound 1 6.4 7.6 2,600 1-6 2-3, 6-3 Compound 4-15 Comparative Compound Compound 1 Compound 2-3 6.4 7.2 2,100 Example 2-3, 1-1 Compound 4-15 Comparative Compound Compound2-3 Compound 1 7.5 6.7 2,200 Example 2-3 1-2 Comparative Compound Compound Compound 6-1 6.4 7.3 2,300 Example 2-3, 2-3 1-3 Compound 4-15 Referring to Table 1, the emission efficiency was improved, and the half life was increased for Examples 1-1 to 1-6 when compared to those for Comparative Examples 1-1 to 1-3.Thus, the improvement of the emission life of the organic EL device could be realized by providing the anode-side hole transport layer, the intermediate hole transport material layer and the emission layer-side hole transport layer between the first electrode and the emission layer.",
"For example, if comparing Examples 1-1 to 1-6 with Comparative Example 1-2, the properties for Examples 1-1 to 1-6 were better.",
"In Comparative Example 1-2, the electron accepting material (Compound 4-15 or 4-16) was not doped in the anode-side hole transport layer.",
"Thus, it was found to be desirable that the electron accepting material was doped in the anode-side hole transport layer.",
"If comparing Example 1-1 with Comparative Example 1-1, the properties for Example 1-1 were better.",
"In Comparative Example 1-1, compounds included in the intermediate hole transport material layer and the emission layer-side hole transport layer were changed from those in Example 1-1.Thus, it was found to be desirable that the emission layer-side hole transport layer including the compound represented by Formula 1 was adjacent to the emission layer.",
"If comparing Example 1-1 with Comparative Example 1-3, the properties for Examples 1-1 to 1-6 were better.",
"In Comparative Example 1-3, the emission layer-side hole transport material included in the emission layer-side hole transport layer was not Compound 1 or 5 represented by Formula 1, but a common hole transport material, i.e., Compound 6-1.Thus, it was found to be desirable that the emission layer-side hole transport layer included the compound represented by Formula 1.If comparing Examples 1-1 to 1-5 with Example 1-6, the properties for Examples 1-1 to 1-5 were better.",
"In Example 1-6, the intermediate hole transport material included in the intermediate hole transport material layer was not Compound 2-3 or 2-17 represented by Formula 2 but a common hole transport material, i.e., Compound 6-3.Thus, it was found to be desirable that the intermediate hole transport material layer included the compound represented by Formula 2.If comparing Examples 1-1 to 1-4 with Example 1-5, the properties of Examples 1-1 to 1-4 were better.",
"In Example 1-5, the anode-side hole transport material included in the anode-side hole transport layer was not Compound 2-3 represented by Formula 2 but a common hole transport material, i.e., Compound 6-2.Thus, it was found to be desirable that the anode-side hole transport layer included the compound represented by Formula 2.As described above, since the anode-side hole transport layer doped with the electron accepting material, the intermediate hole transport material layer, and the emission layer-side hole transport layer including the compound represented by Formula 1 were stacked between the first electrode (anode) and the emission layer, the emission efficiency and emission life of the organic EL device were improved.",
"The results show that the hole transport layer may be passivated from electrons not consumed in the emission layer-side hole transport layer, the diffusion of energy in an excited state generated from the emission layer into the hole transport layer may be reduced or prevented, and the charge balance of a whole device may be controlled by disposing the emission layer-side hole transport layer including the compound represented by Formula 1.The results also show that the emission layer-side hole transport layer may restrain (e.g., reduce or prevent) the diffusion of the electron accepting material included in the anode-side hole transport layer provided near the first electrode (anode) into the emission layer by disposing the emission layer-side hole transport layer including the compound represented by Formula 1.<2-1.Configuration of Organic EL Device Including Anode-Side Hole Transport Layer Mainly Including Electron Accepting Material> Hereinafter, an organic EL device including an anode-side hole transport layer mainly including an electron accepting material will be explained referring to the drawing.",
"The organic EL device including the anode-side hole transport layer mainly including the electron accepting material includes the above-mentioned anode-side hole transport material and has substantially the same configuration, i.e., substantially the same configuration of a substrate, substantially the same configuration of a first electrode, substantially the same configuration of an emission layer, substantially the same configuration of an electron transport layer, substantially the same configuration of an electron injection layer, substantially the same configuration of a second electrode and substantially the same method of manufacturing an organic EL device as those of the organic EL device including the anode-side hole transport layer doped with the electron accepting material, and has a different configuration of the hole transport layer.",
"Thus, the configuration of the hole transport layer will be explained in more detail, hereinafter.",
"(2-1-1.Configuration of Hole Transport Layer) The hole transport layer 130 may include a hole transport material and have hole transporting function.",
"The hole transport layer 130 may be formed, for example, on the first electrode 120 to a layer thickness (total layer thickness of a multi-layer structure) within a range from about 10 nm to about 150 nm.",
"Here, the hole transport layer 130 of the organic EL device 100 according to an embodiment may be formed as a multi-layer by stacking from a first electrode 120, an anode-side hole transport layer 131, an intermediate hole transport material layer 133 and an emission layer-side hole transport layer 135 one by one.",
"In addition, the ratio of the thicknesses of the layers is not specifically limited.",
"(2-1-1-1.Configuration of Anode-Side Hole Transport Layer) The anode-side hole transport layer 131 may be a layer mainly including an electron accepting material.",
"For example, the anode-side hole transport layer 131 may be formed on the first electrode 120.The anode-side hole transport layer 131 is a layer formed mainly utilizing the electron accepting material, however, a material other than the electron accepting material may be included.",
"In addition, the expression that “the anode-side hole transport layer 131 may be formed mainly utilizing the electron accepting material” refers to that the anode-side hole transport layer 131 includes about 50 wt % or greater of the electron accepting material on the basis of the total amount of the anode-side hole transport layer 131.The anode-side hole transport layer 131 may be formed mainly utilizing the electron accepting material and may improve hole injection property from the first electrode 120.Thus, in one embodiment, the anode-side hole transport layer 131 may be provided near the first electrode 120, and for example, the anode-side hole transport layer 131 may be provided adjacent to the first electrode 120.The electron accepting material included in the anode-side hole transport layer 131 may be any suitable electron accepting materials.",
"However, in one embodiment, the electron accepting material included in the anode-side hole transport layer 131 may have a LUMO level within a range from about −9.0 eV to about −4.0 eV, and for example, the electron accepting material included in the anode-side hole transport layer 131 may have the LUMO level within a range from about −6.0 eV to about −4.0 eV.",
"Here, examples of the electron accepting material having the LUMO level within a range from about −9.0 eV to about −4.0 eV may include the compounds represented by the following Formulae 4-1 to 4-14.In the above Formulae 4-1 to 4-14, R is hydrogen, deuterium, a halogen atom, a fluoroalkyl group having 1 to 50 carbon atoms, a cyano group, an alkoxy group having 1 to 50 carbon atoms, an alkyl group having 1 to 50 carbon atoms, an aryl group having 6 to 50 carbon atoms or a heteroaryl group having 5 to 50 carbon atoms for forming a ring.",
"Ar is a substituted aryl group with an electron withdrawing group or an unsubstituted aryl group having 6 to 50 carbon atoms for forming a ring, or a substituted or unsubstituted heteroaryl group having 5 to 50 carbon atoms for forming a ring; Y is a methine group (—CH═) or a nitrogen atom (—N═); Z is a pseudohalogen atom or a sulfur (S) atom; n is an integer of 10 and less; and X is one of the substituents represented by the following formulae X1 to X7.In the above Formulae X1 to X7, Ra is hydrogen, deuterium, a halogen atom, a fluoroalkyl group having 1 to 50 carbon atoms, a cyano group, an alkoxy group having 1 to 50 carbon atoms, an alkyl group having 1 to 50 carbon atoms, a substituted or unsubstituted aryl group having 6 to 50 carbon atoms for forming a ring or a substituted or unsubstituted heteroaryl group having 5 to 50 carbon atoms for forming a ring.",
"Examples of the substituted or unsubstituted aryl group having 6 to 50 carbon atoms for forming a ring represented by R, Ar and Ra may include a phenyl group, a 1-naphthyl group, a 2-naphthyl group, a 1-anthryl group, a 2-anthryl group, a 9-anthryl group, a 1-phenanthryl group, a 2-phenanthryl group, a 3-phenanthryl group, a 4-phenanthryl group, a 9-phenanthryl group, a 1-naphthacenyl group, a 2-naphthacenyl group, a 9-naphthacenyl group, a 1-pyrenyl group, a 2-pyrenyl group, a 4-pyrenyl group, a 2-biphenylyl group, a 3-biphenylyl group, a 4-biphenylyl group, a p-terphenyl-4-yl group, a p-terphenyl-3-yl group, a p-terphenyl-2-yl group, an m-terphenyl-4-yl group, an m-terphenyl-3-yl group, an m-terphenyl-2-yl group, an o-tolyl group, an m-tolyl group, a p-tolyl group, a p-t-butylphenyl group, a p-(2-phenylpropyl)phenyl group, a 3-methyl-2-naphthyl group, a 4-methyl-1-naphthyl group, a 4-methyl-1-anthryl group, a 4′-methylbiphenylyl group, a 4″-t-butyl-p-terphenyl-4-yl group, a fluoranthenyl group, a fluorenyl group, etc.",
"Examples of the substituted or unsubstituted heteroaryl group having 5 to 50 carbon atoms for forming a ring represented by R, Ar and Ra may include a 1-pyrrolyl group, a 2-pyrrolyl group, a 3-pyrrolyl group, a pyridinyl group, a 2-pyridinyl group, a 3-pyridinyl group, a 4-pyridinyl group, a 1-indolyl group, a 2-indolyl group, a 3-indolyl group, a 4-indolyl group, a 5-indolyl group, a 6-indolyl group, a 7-indolyl group, a 1-isoindolyl group, a 2-isoindolyl group, a 3-isoindolyl group, a 4-isoindolyl group, a 5-isoindolyl group, a 6-isoindolyl group, a 7-isoindolyl group, a 2-furyl group, a 3-furyl group, a 2-benzofuranyl group, a 3-benzofuranyl group, a 4-benzofuranyl group, a 5-benzofuranyl group, a 6-benzofuranyl group, a 7-benzofuranyl group, a 1-isobenzofuranyl group, a 3-isobenzofuranyl group, a 4-isobenzofuranyl group, a 5-isobenzofuranyl group, a 6-isobenzofuranyl group, a 7-isobenzofuranyl group, a quinolyl group, a 3-quinolyl group, a 4-quinolyl group, a 5-quinolyl group, a 6-quinolyl group, a 7-quinolyl group, an 8-quinolyl group, a 1-isoquinolyl group, a 3-isoquinolyl group, a 4-isoquinolyl group, a 5-isoquinolyl group, a 6-isoquinolyl group, a 7-isoquinolyl group, an 8-isoquinolyl group, a 2-quinoxalinyl group, a 5-quinoxalinyl group, a 6-quinoxalinyl group, a 1-carbazolyl group, a 2-carbazolyl group, a 3-carbazolyl group, a 4-carbazolyl group, a 9-carbazolyl group, a 1-phenanthridinyl group, a 2-phenanthridinyl group, a 3-phenanthridinyl group, a 4-phenanthridinyl group, a 6-phenanthridinyl group, a 7-phenanthridinyl group, an 8-phenanthridinyl group, a 9-phenanthridinyl group, a 10-phenanthridinyl group, a 1-acridinyl group, a 2-acridinyl group, a 3-acridinyl group, a 4-acridinyl group, a 9-acridinyl group, a 1,7-phenanthroline-2-yl group, a 1,7-phenanthroline-3-yl group, a 1,7-phenanthroline-4-yl group, a 1,7-phenanthroline-5-yl group, a 1,7-phenanthroline-6-yl group, a 1,7-phenanthroline-8-yl group, a 1,7-phenanthroline-9-yl group, a 1,7-phenanthroline-10-yl group, a 1,8-phenanthroline-2-yl group, a 1,8-phenanthroline-3-yl group, a 1,8-phenanthroline-4-yl group, a 1,8-phenanthroline-5-yl group, a 1,8-phenanthroline-6-yl group, a 1,8-phenanthroline-7-yl group, a 1,8-phenanthroline-9-yl group, a 1,8phenanthroline-10-yl group, a 1,9-phenanthroline-2-yl group, a 1,9-phenanthroline-3-yl group, a 1,9-phenanthroline-4-yl group, a 1,9-phenanthroline-5-yl group, a 1,9phenanthroline-6-yl group, a 1,9-phenanthroline-7-yl group, a 1,9-phenanthroline-8-yl group, a 1,9-phenanthroline-10-ylgroup, a 1,10-phenanthroline-2-yl group, a 1,10-phenanthroline-3-yl group, a 1,10-phenanthroline-4-yl group, a 1,10-phenanthroline-5-yl group, a 2,9-phenanthroline-1-yl group, a 2,9-phenanthroline-3-yl group, a 2,9-phenanthroline-4-yl group, a 2,9-phenanthroline-5-yl group, a 2,9-phenanthroline-6-yl group, a 2,9-phenanthroline-7-yl group, a 2,9-phenanthroline-8-yl group, a 2,9-phenanthroline-10-yl group, a 2,8-phenanthroline-1-yl group, a 2,8-phenanthroline-3-yl group, a 2,8-phenanthroline-4-yl group, a 2,8-phenanthroline-5-yl group, a 2,8-phenanthroline-6-yl group, a 2,8- phenanthroline-7-yl group, a 2,8-phenanthroline-9-yl group, a 2,8-phenanthroline-10-yl group, a 2,7-phenanthroline-1-yl group, a 2,7-phenanthroline-3-yl group, a 2,7-phenanthroline-4-yl group, a 2,7-phenanthroline-5-yl group, a 2,7-phenanthroline-6-yl group, a 2,7-phenanthroline-8-yl group, a 2,7-phenanthroline-9-yl group, a 2,7-phenanthroline-l0-yl group, a 1-phenazinyl group, a 2-phenazinyl group, a 1-phenothiazinyl group, a 2-phenothiazinyl group, a 3-phenothiazinyl group, a 4-phenothiazinyl group, a 10-phenothiazinyl group, a 1-phenoxaziny group, a 2-phenoxazinyl group, a 3-phenoxazinyl group, a 4-phenoxazinyl group, a 10-phenoxazinyl group, a 2-oxazolyl group, a 4-oxazolyl group, a 5-oxazolyl group, a 2-oxadiazolyl group, a 5-oxadiazolyl group, a 3-furazanyl group, a 2-thienyl group, a 3-thienyl group, a 2-methylpyrrole-1-yl group, a 2-methylpyrrole-3-yl group, a 2-methylpyrrole-4-yl group, a 2-methylpyrrole-5-yl group, a 3-methylpyrrole-1-yl group, a 3-methylpyrrole-2-yl group, a 3-methylpyrrole-4-yl group, a 3-methylpyrrole-5-yl group, a 2-t-butylpyrrole-4-yl group, a 3-(2-phenylpropyl)pyrrole-1-yl group, a 2-methyl-1-indolylgroup, a 4-methyl-1-indolyl group, a 2-methyl-3-indolyl group, a 4-methyl-3-indolyl group, a 2-t-butyl-1-indolyl group, a 4-t-butyl-1-indolyl group, a 2-t-butyl-3-indolyl group, a 4-t-butyl-3-indolyl group, etc.",
"Examples of the substituted or unsubstituted fluoroalkyl group having 1 to 50 carbon atoms represented by R and Ra may include a perfluoroalkyl group such as a trifluoromethyl group, a pentafluoroethyl group, a heptafluoropropyl group and a heptadecafluorooctane group, a monofluoromethyl group, a difluoromethyl group, a trifluoroethyl group, a tetrafluoropropyl group, an octafluoropentyl group, etc.",
"Examples of the substituted or unsubstituted alkyl group having 1 to 50 carbon atoms represented by R and Ra may include a methyl group, an ethyl group, a propyl group, an isopropyl group, an n-butyl group, an s-butyl group, an isobutyl group, a t-butyl group, an n-pentyl group, an n-hexyl group, an n-heptyl group, an n-octyl group, a hydroxymethyl group, a 1-hydroxyethyl group, a 2-hydroxyethyl group, a 2-hydroxyisobutyl group, a 1,2-dihydroxyethyl group, a 1,3-dihydroxyisopropyl group, a 2,3-dihydroxy-t-butyl group, a 1,2,3-trihydroxypropyl group, a chloromethyl group, a 1-chloroethyl group, a 2-chloroethyl group, a 2-chloroisobutyl group, a 1,2-dichloroethyl group, a 1,3-dichloroisopropyl group, a 2,3-dichloro-t-butyl group, a 1,2,3-trichloropropyl group, a bromomethyl group, a 1-bromoethyl group, a 2-bromoethyl group, a 2-bromoisobutyl group, a 1,2-dibromoethyl group, a 1,3-dibromoisopropyl group, a 2,3-dibromo-t-butyl group, a 1,2,3-tribromopropyl group, an iodomethyl group, a 1-iodoethyl group, a 2-iodoethyl group, a 2-iodoisobutyl group, a 1,2-diiodoethyl group, a 1,3-diiodoisopropyl group, a 2,3-diiodo-t-butyl group, a 1,2,3-triiodopropyl group, an aminomethyl group, a 1-aminoethyl group, a 2-aminoethyl group, a 2-aminoisobutyl group, a 1,2-diaminoethyl group, a 1,3-diaminoisopropyl group, a 2,3-diamino-t-butyl group, a 1,2,3-triaminopropyl group, a cyanomethyl group, a 1-cyanoethyl group, a 2-cyanoethyl group, a 2-cyanoisobutyl group, a 1,2-dicyanoethyl group, a 1,3-dicyanoisopropyl group, a 2,3-dicyano-t-butyl group, a 1,2,3-tricyanopropyl group, a nitromethyl group, a 1-nitroethyl group, a 2-nitroethyl group, a 2-nitroisobutyl group, a 1,2-dinitroethyl group, a 1,3-dinitroisopropyl group, a 2,3-dinitro-t-butyl group, a 1,2,3-trinitropropyl group, a cyclopropyl group, a cyclobutyl group, a cyclopentyl group, a cyclohexyl group, a 4-methylcyclohexyl group, a 1-adamantyl group, a 2-adamantyl group, a 1-norbornyl group, a 2-norbornyl group, etc.",
"The substituted or unsubstituted alkoxy group having 1 to 50 carbon atoms represented by R and Ra may be a group represented by —OY.",
"Examples of Y may include a methyl group, an ethyl group, a propyl group, an isopropyl group, an n-butyl group, an s-butyl group, an isobutyl group, a t-butyl group, an n-pentyl group, an n-hexyl group, an n-heptyl group, an n-octyl group, a hydroxymethyl group, a 1-hydroxyethyl group, a 2-hydroxyethyl group, a 2-hydroxyisobutyl group, a 1,2-dihydroxyethyl group, a 1,3-dihydroxyisopropyl group, a 2,3-dihydroxy-t-butyl group, a 1,2,3-trihydroxypropyl group, a chloromethyl group, a 1-chloroethyl group, a 2-chloroethyl group, a 2-chloroisobutyl group, a 1,2-dichloroethyl group, a 1,3-dichloroisopropyl group, a 2,3-dichloro-t-butyl group, a 1,2,3-trichloropropyl group, a bromomethyl group, a 1-bromoethyl group, a 2-bromoethyl group, a 2-bromoisobutyl group, a 1,2-dibromoethyl group, a 1,3-dibromoisopropyl group, a 2,3-dibromo-t-butyl group, a 1,2,3-tribromopropyl group, an iodomethyl group, a 1-iodoethyl group, a 2-iodoethyl group, a 2-iodoisobutyl group, a 1,2-diiodoethyl group, a 1,3-diiodoisopropyl group, a 2,3-diiodo-t-butyl group, a 1,2,3-triiodopropyl group, an aminomethyl group, a 1-aminoethyl group, a 2-aminoethyl group, a 2-aminoisobutyl group, a 1,2-diaminoethyl group, a 1,3-diaminoisopropyl group, a 2,3-diamino-t-butyl group, a 1,2,3-triaminopropyl group, a cyanomethyl group, a 1-cyanoethyl group, a 2-cyanoethyl group, a 2-cyanoisobutyl group, a 1,2-dicyanoethyl group, a 1,3-dicyanoisopropyl group, a 2,3-dicyano-t-butyl group, a 1,2,3-tricyanopropyl group, a nitromethyl group, a 1-nitroethyl group, a 2-nitroethyl group, a 2-nitroisobutyl group, a 1,2-dinitroethyl group, a 1,3-dinitroisopropyl group, a 2,3-dinitro-t-butyl group, a 1,2,3-trinitropropyl group, etc.",
"Examples of the halogen atom represented by R and Ra may include fluorine (F), chlorine (Cl), bromine (Br), iodine (I), etc.",
"Here, example compounds of the electron accepting material may include the following Compounds 4-15 and 4-16.For example, the LUMO level of Compound 4-15 may be about −4.40 eV, and the LUMO level of Compound 4-16 may be about −5.20 eV.",
"However, the electron accepting material is not limited to the following Compounds 4-15 and 4-16.",
"(2-1-1-2.Configuration of Intermediate Hole Transport Material Layer) The intermediate hole transport material layer 133 may include an intermediate hole transport material.",
"The intermediate hole transport material layer 133 may be formed, for example, on the anode-side hole transport layer 131.The intermediate hole transport material included in the intermediate hole transport material layer 133 may be any suitable hole transport materials.",
"Examples of the intermediate hole transport material included in the intermediate hole transport material layer 133 may be TAPC, a carbazole derivative (such as N-phenyl carbazole or polyvinyl carbazole), TPD, TCTA, NPB, etc.",
"However, the intermediate hole transport material may be a compound represented by the following Formula 2.In Formula 2, Ar7 to Ar9 are each independently a substituted or unsubstituted aryl group having 6 to 50 carbon atoms for forming a ring or a substituted or unsubstituted heteroaryl group having 5 to 50 carbon atoms for forming a ring.",
"Ar10 is hydrogen, deuterium, a halogen atom, a substituted or unsubstituted aryl group having 6 to 50 carbon atoms for forming a ring, a substituted or unsubstituted heteroaryl group having 5 to 50 carbon atoms for forming a ring or a substituted or unsubstituted alkyl group having 1 to 50 carbon atoms.",
"L4 is a direct linkage, a substituted or unsubstituted arylene group having 6 to 18 carbon atoms for forming a ring or a substituted or unsubstituted heteroarylene group having 5 to 15 carbon atoms for forming a ring.",
"Examples of Ar7 to Ar9 may include a phenyl group, a biphenyl group, a terphenyl group, a naphthyl group, an anthryl group, a phenanthryl group, a fluorenyl group, an indenyl group, a pyrenyl group, an acetonaphthenyl group, a fluoranthenyl group, a triphenylenyl group, a pyridyl group, a furanyl group, a pyranyl group, a thienyl group, a quinolyl group, an isoquinolyl group, a benzofuranyl group, a benzothienyl group, an indolyl group, a carbazolyl group, a benzoxazolyl group, a benzothiazolyl group, a quinoxalyl group, a pyrazolyl group, a dibenzofuranyl group, a dibenzothienyl group, etc.",
"In one embodiment, examples of Ar7 to Ar9 may include the phenyl group, the biphenyl group, the terphenyl group, the fluorenyl group, the carbazolyl group, the dibenzofuranyl group, etc.",
"Examples of Ar10 may include a phenyl group, a biphenyl group, a terphenyl group, a naphthyl group, an anthryl group, a phenanthryl group, a fluorenyl group, an indenyl group, a pyrenyl group, an acetonaphthenyl group, a fluoranthenyl group, a triphenylenyl group, a pyridyl group, a furanyl group, a pyranyl group, a thienyl group, a quinolyl group, an isoquinolyl group, a benzofuranyl group, a benzothienyl group, an indolyl group, a carbazolyl group, a benzoxazolyl group, a benzothiazolyl group, a quinoxalyl group, a pyrazolyl group, a dibenzofuranyl group, a dibenzothienyl group, a methyl group, an ethyl group, a propyl group, an isopropyl group, an n-butyl group, etc.",
"In one embodiment, examples of Ar10 may include the phenyl group, the biphenyl group, the terphenyl group, the fluorenyl group, the carbazolyl group, the dibenzofuranyl group, etc.",
"Examples of L4 other than the direct linkage may include a phenylene group, a biphenylene group, a terphenylene group, a naphthalene group, an anthrylene group, a phenanthrylene group, a fluorenylene group, an indenylene group, a pyrenylene group, an acetonaphthenylene group, a fluoranthenylene group, a triphenylenylene group, a pyridylene group, a furanylene group, a pyranylene group, a thienylene group, a quinolylene group, an isoquinolylene group, a benzofuranylene group, a benzothienylene group, an indolylene group, a carbazolylene group, a benzoxazolylene group, a benzothiazolylene group, a kinokisariren group, a benzoimidazolylene group, a pyrazolylene group, a dibenzofuranylene group, a dibenzothienylene group, etc.",
"In one embodiment, L4 may include the direct linkage, the phenylene group, the biphenylene group, the terphenylene group, the fluorenylene group, the carbazolylene group or the dibenzofuranylene group.",
"Examples of the compound represented by Formula 2 may include the following Compounds 2-1 to 2-17.However, the compound represented by Formula 2 is not limited to the following Compounds 2-1 to 2-17.The intermediate hole transport material layer 133 may include the compound represented by the above Formula 2 as the intermediate hole transport material, and may improve the hole transporting property of the hole transport layer 130.Thus, the driving voltage of the organic EL device 100 may decrease, and the emission efficiency and emission life thereof may be increased.",
"(2-1-1-3.Configuration of Emission Layer-Side Hole Transport Layer) The emission layer-side hole transport layer 135 may include a compound represented by the following Formula 1.The emission layer-side hole transport layer 135 may be formed, for example, on the intermediate hole transport material layer 133, adjacent to the emission layer 140.In Formula 1, Y is O or S, R1 to R6 are each independently hydrogen, deuterium, a halogen atom, a substituted or unsubstituted alkyl group having 1 to 15 carbon atoms, a substituted or unsubstituted silyl group, a substituted or unsubstituted aryl group having 6 to 30 carbon atoms for forming a ring, a substituted or unsubstituted heteroaryl group having 1 to 30 carbon atoms for forming a ring, or a substituted or unsubstituted aryl group or heteroaryl group formed via condensation of optional adjacent substituents; Ar1 and Ar2 are each independently a substituted or unsubstituted aryl group having 6 to 30 carbon atoms for forming a ring, or a substituted or unsubstituted heteroaryl group having 1 to 30 carbon atoms for forming a ring; L1 to L3 are each independently a direct linkage, a substituted or unsubstituted alkylene group having 1 to 15 carbon atoms, a substituted or unsubstituted aralkylene group having 7 to 30 carbon atoms, a substituted or unsubstituted arylene group having 6 to 30 carbon atoms for forming a ring, a substituted or unsubstituted heteroarylene group having 1 to 30 carbon atoms for forming a ring, or a substituted or unsubstituted divalent silyl group; m is an integer from 0 to 3; and n is an integer from 0 to 4.Examples of R1 to R6 may include hydrogen, deuterium, a halogen atom, a phenyl group, a biphenyl group, a terphenyl group, a naphthyl group, an anthryl group, a phenanthryl group, a fluorenyl group, an indenyl group, a pyrenyl group, an acetonaphthenyl group, a fluoranthenyl group, a triphenylenyl group, a pyridyl group, a furanyl group, a pyranyl group, a thienyl group, a quinolyl group, an isoquinolyl group, a benzofuranyl group, a benzothienyl group, an indolyl group, a carbazolyl group, a benzoxazolyl group, a benzothiazolyl group, a quinoxalyl group, a pyrazolyl group, a dibenzofuranyl group, a dibenzothienyl group, a methyl group, an ethyl group, a propyl group, an isopropyl group, an n-butyl group, etc.",
"In one embodiment, examples of R1 and R6 may include the hydrogen atom, the halogen atom, the methyl group, the phenyl group, the biphenyl group, the fluorenyl group, the carbazolyl group, and the dibenzofuranyl group.",
"Examples of Ar1 and Ar2 may include a phenyl group, a biphenyl group, a terphenyl group, a naphthyl group, an anthryl group, a phenanthryl group, a fluorenyl group, an indenyl group, a pyrenyl group, an acetonaphthenyl group, a fluoranthenyl group, a triphenylenyl group, a pyridyl group, a furanyl group, a pyranyl group, a thienyl group, a quinolyl group, an isoquinolyl group, a benzofuranyl group, a benzothienyl group, an indolyl group, a carbazolyl group, a benzoxazolyl group, a benzothiazolyl group, a quinoxalyl group, a pyrazolyl group, a dibenzofuranyl group, a dibenzothienyl group, etc.",
"In one embodiment, examples of Ar1 and Ar2 may include the phenyl group, the biphenyl group, the terphenyl group, the fluorenyl group, the carbazolyl group, the dibenzofuranyl group, etc.",
"Examples of L1 to L3 other than the direct linkage may be a divalent substituent of the substituent illustrated in the above Ar1 and Ar2 (e.g., examples of L1 to L3 other than the direct linkage may be a corresponding divalent group of the groups listed above for Ar1 and Ar2).",
"In one embodiment, examples of L1 to L3 other than the direct linkage may include the phenylene group, the naphthylene group, the biphenylene group, the thienothiophenylene group and the pyridylene group.",
"L1 to L3 may include the direct linkage, the phenylene group and the biphenylene group.",
"Examples of the compound represented by Formula 1 may include the following Compounds 1 to 48.However, the compound represented by Formula 1 is not limited to the following Compounds 1 to 48.The emission layer-side hole transport layer 135 may include the compound represented by the above Formula 1 as the emission layer-side hole transport material and may passivate the hole transport layer 130 from electrons not consumed in the emission layer 140.Since the emission layer-side hole transport layer 135 includes the compound represented by Formula 1, the diffusion of energy in an excited state generated in the emission layer 140 to the hole transport layer 130 may be reduced or prevented.",
"Thus, according to this configuration, the emission layer-side hole transport layer 135 may improve the current flow durability of the hole transport layer 130.The emission layer-side hole transport layer 135 may be formed near the emission layer 140, and for example, may be formed adjacent to the emission layer 140 to effectively reduce or prevent the diffusion of the electrons or the energy from the emission layer 140.Since the emission layer-side hole transport layer 135 includes the compound represented by Formula 1, the charge balance of the whole organic EL device 100 may be controlled, and the diffusion of the electron accepting material included in the anode-side hole transport layer 131 into the emission layer 140 may be restrained (e.g., reduced or prevented).",
"Accordingly, the emission layer-side hole transport layer 135 may improve the charge transport property of the whole hole transport layer 130.Since the emission layer-side hole transport layer 135 includes the compound represented by Formula 1, the charge transport property and current flow durability of the hole transport layer 130 may be improved.",
"Thus, the emission layer-side hole transport layer 135 may decrease the driving voltage and improve the emission efficiency and emission life of the organic EL device 100.As explained above, the hole transport layer 130 including the anode-side hole transport layer 131, the intermediate hole transport material layer 133 and the emission layer-side hole transport layer 135 may improve the current flow durability and hole transport property of the organic EL device 100.Thus, the driving voltage may decrease and the emission efficiency and emission life of the organic EL device 100 may be improved.",
"2-2.Examples Hereinafter, organic EL devices according to example embodiments will be explained by referring to examples and comparative examples.",
"The following embodiments are only for illustration, and the organic EL devices according to example embodiments are not limited thereto.",
"(2-2-1.Synthesis of Compound Represented by Formula 1) First, a synthetic method of a compound represented by Formula 1 will be explained referring to synthetic methods of Compounds 1 and 5.The following embodiments are only for illustration, and the synthetic methods of the compound represented by Formula 1 are not limited thereto.",
"(2-2-1-1.Synthesis of Compound 1) According to the following Reaction 1, Compound 1 in the following Formula 13, which is the compound represented by Formula 1 was synthesized.",
"The product thus obtained was identified by measuring the physical properties thereof by means of 1 HNMR and FAB-MS. (Synthesis of Compound A) Under an Ar atmosphere, 53.8 g of N-[1,1′-biphenyl]-4-yl-N-(4-bromophenyl)-[1,1′-biphenyl]-4-amine, 6.46 g of Pd(dppf)Cl2.CH2Cl2, 33.3 g of KOAc and 33.0 g of bis(pinacolato)diboron were added to a 2 L flask, followed by degassing under vacuum and stirring in a dioxane solvent at about 100° C. for about 12 hours.",
"Then, the solvent was distilled from the reactant, CH2Cl2 and water were added thereto, and an organic phase was separated.",
"To the separated organic phase, magnesium sulfate (Mg2SO4) and activated clay were added, filtering with suction was performed, and the solvent was distilled.",
"The crude product thus obtained was separated by silica gel column chromatography utilizing a mixture solvent of dichloromethane and hexane to produce 56.8 g (Yield 98%) of Compound A as a white solid (FAB-MS: C36H34BNO2, measured value 523).",
"(Synthesis of Compound B) Under an Ar atmosphere, 10.0 g of Compound A, 6.00 g of 1-iodo-3-bromobenzene, 1.54 g of Pd(PPh3)4, and 5.25 g of potassium carbonate (K2CO3) were added to a 300 mL, three necked flask, followed by heating and stirring in a mixture solvent of 450 mL of toluene and 60 mL of water at about 90° C. for about 8 hours.",
"After air cooling, water was added to a mixture, an organic phase was separated, and the solvents were distilled from the separated organic phase.",
"The crude product thus obtained was separated by silica gel column chromatography utilizing a mixture solvent of dichloromethane and hexane and recrystallized utilizing a mixture solvent of toluene and hexane to produce 9.29 g (Yield 88%) of Compound B as a white solid (FAB-MS: C36H26BrN, measured value 551).",
"(Synthesis of Compound 1) Under an Ar atmosphere, 3.10 g of Compound B, 1.2 g of dibenzofuran-4-boronic acid, 0.84 g of Pd(PPh3)4, and 2.35 g of potassium carbonate (K2CO3) were added to a 500 mL, three necked flask, followed by heating and stirring in a mixture solvent of 170 mL of toluene and 80 mL of water at about 90° C. for about 8 hours.",
"After air cooling, water was added to the reactant, an organic phase was separated, and the solvents were distilled from the separated organic phase.",
"The crude product thus obtained was separated by silica gel column chromatography utilizing a mixture solvent of dichloromethane and hexane and recrystallized utilizing a mixture solvent of toluene and hexane to produce 3.08 g (Yield 86%) of Compound 1 as a white solid.",
"Chemical shift values (δ) of Compound 1 by 1HNMR (300 MHz, CDCl3) were 8.11 (s, 1H), 8.00 (d, J=7.6 Hz, 1H), 7.96 (d, J=7.6 Hz, 1H), 7.87 (d, J=7.4 Hz, 1H), 7.67-7.23 (m, 29H), and the measured molecular weight of Compound 1 by FAB-MS was 639 (C48H33NO).",
"(2-2-1-2.Synthesis of Compound 5) According to the following Reaction 2, Compound 5 as the compound represented by Compound 1 was synthesized.",
"The product was identified by measuring the physical properties thereof by 1HNMR and FAB-MS. (Synthesis of Compounds A and B) Since the synthetic method of Compounds A and B are substantially the same as that described above (2-2-1-1.Synthesis of Compound 1), explanation thereabout will not be repeated.",
"(Synthesis of Compound 5) Under an Ar atmosphere, 3.10 g of Compound B, 1.28 g of dibenzothiophene-4-boronic acid, 0.84 g of Pd(PPh3)4, and 2.35 g of potassium carbonate (K2CO3) were added to a 500 mL, three necked flask, followed by heating and stirring in a mixture solvent of 170 mL of toluene and 80 mL of water at about 90° C. for about 8 hours.",
"After air cooling, water was added to the reactant, an organic phase was separated, and solvents were distilled from the separated organic phase.",
"The crude product thus obtained was separated by silica gel column chromatography utilizing a mixture solvent of dichloromethane and hexane and recrystallized utilizing a mixture solvent of toluene and hexane to produce 2.94 g (Yield 80%) of Compound 5 as a white solid.",
"Chemical shift values (δ) of Compound 5 by 1HNMR (300 MHz, CDCl3) were 8.46-8.41 (m, 2H), 8.20 (d, 1H, J=7.80 Hz), 7.98 (d, 1H, J=7.90 Hz), 7.58-7.50 (m, 18H), 7.48-7.41 (m, 4H), 6.69-6.65 (m, 4H), and the measured molecular weight of Compound 5 by FAB-MS was 656 (C48H33NS).",
"(2-2-2.Manufacture of Organic EL Device Including Anode-Side Hole Transport Material Mainly Including Electron Accepting Material) An organic EL device according to an embodiment was manufactured by the following manufacturing method.",
"First, with respect to an ITO-glass substrate patterned and washed in advance, surface treatment utilizing UV-Ozone (O3) was conducted.",
"The layer thickness of an ITO layer (first electrode) on a glass substrate was about 150 nm.",
"After ozone treatment, the surface treated substrate was inserted in a glass bell jar type evaporator for forming an organic layer, and an anode-side hole transport layer, an intermediate hole transport material layer, an emission layer-side hole transport layer, an emission layer and an electron transport layer were evaporated one by one with a vacuum degree of about 10−4 to about 10−5 Pa.",
"The layer thickness of each of the anode-side hole transport layer, the intermediate hole transport material layer and the emission layer-side hole transport layer was about 10 nm.",
"The layer thickness of the emission layer was about 25 nm, and the layer thickness of the electron transport layer was about 25 nm.",
"Then, the substrate was moved into a glass bell jar evaporator for forming a metal layer, and the electron injection layer and the second electrode were evaporated with a vacuum degree of about 10−4 to about 10−5 Pa.",
"The layer thickness of the electron injection layer was about 1 nm and the layer thickness of the second electrode was about 100 nm.",
"Here, the anode-side hole transport layer, the intermediate hole transport material layer and the emission layer-side hole transport layer correspond to the hole transport layer with a stacked structure.",
"The anode-side hole transport layer, the intermediate hole transport material layer and the emission layer-side hole transport layer were manufactured in examples and comparative examples utilizing the materials shown in the following Table 2.In Table 2, Compounds 6-1 and 6-2 represented by the following formulae are referred to as common hole transport materials.",
"As the host material of the emission layer, 9,10-di(2-naphthyl)anthracene (ADN, Compound 3-2) was utilized, and as a dopant material, 2,5,8,11-tetra-t-butylperylene (TBP) was utilized.",
"3 wt % of the dopant material on the basis of the amount of the host material was added.",
"In addition, the electron transport layer was formed utilizing Alq3, the electron injection layer was formed utilizing LiF, and the second electrode was formed utilizing aluminum (Al).",
"(2-2-2.Evaluation Results) Then, the driving voltage, emission efficiency and half life of the organic EL device thus manufactured were evaluated.",
"Evaluation results are shown together in the following Table 2.The driving voltage and the emission efficiency in each example and comparative example were obtained by measuring at current density of about 10 mA/cm2.The emission life was obtained by measuring a time period for decreasing luminance to half from the initial luminance of about 1,000 cd/m2.The measurement was conducted utilizing a source meter of 2400 series of Keithley Instruments Co., a Color brightness photometer CS-200 (Konica Minolta holdings Co., Ltd., measurement angle of 1°), and a PC program LabVIEW8.2 (National instruments Co., Ltd. in Japan) in a dark room.",
"TABLE 2 Emission Anode-side Intermediate layer-side hole hole hole Driving Emission Life transport transport transport voltage efficiency LT50 layer material layer layer [V] [cd/A] (h) Example 2-1 Compound Compound Compound 1 6.3 7.6 4,100 4-15 2-3 Example 2-2 Compound Compound Compound 5 6.3 7.6 4,100 4-15 2-3 Example 2-3 Compound Compound Compound 1 6.5 7.5 3,900 4-16 2-3 Example 2-4 Compound Compound Compound 1 6.3 7.6 3,800 4-15 2-17 Example 2-5 Compound Compound Compound 1 6.4 7.6 3,200 4-15 6-2 Comparative Compound Compound 1 Compound 6.8 7.3 2,100 Example 2-1 4-15 2-3 Comparative Compound Compound Compound 1 7.9 6.9 2,100 Example 2-2 2-3 2-3 Comparative Compound Compound Compound 6.9 7.4 2,300 Example 2-3 4-15 2-3 6-1 Referring to Table 2, the driving voltage may decrease, the emission efficiency may be improved, and the emission life may be increased for Examples 2-1 to 2-5 when compared to those for Comparative Examples 2-1 to 2-3.Thus, it would be desirable that the emission life of the organic EL device may be increased by providing the anode-side hole transport layer, the intermediate hole transport material layer and the emission layer-side hole transport layer between the first electrode and the emission layer.",
"For example, if comparing Examples 2-1 to 2-5 with Comparative Example 2-3, the properties for Examples 2-1 to 2-5 were better.",
"In Comparative Example 2-3, the emission layer-side hole transport material included in the emission layer-side hole transport layer was not Compound 1 or 5 represented by Formula 1, but a common hole transport material, i.e., Compound 6-1.Thus, it would be desirable that the emission layer-side hole transport layer included the compound represented by Formula 1.If comparing Example 2-1 with Comparative Example 2-1, the properties for Example 2-1 were better.",
"In Comparative Example 2-1, compounds included in the intermediate hole transport material layer and the emission layer-side hole transport layer were changed from those utilized in Example 2-1.Thus, it would be desirable that the emission layer-side hole transport layer including the compound represented by Formula 1 was adjacent to the emission layer.",
"If comparing Examples 2-1 to 2-5 with Comparative Example 2-2, the properties for Examples 2-1 to 2-5 were better.",
"In Comparative Example 2-2, the anode-side hole transport layer did not include the electron accepting material (Compound 4-15 or 4-16) but Compound 2-3 represented by Formula 2.Thus, it would be desirable that the anode-side hole transport layer was formed mainly utilizing the electron accepting material.",
"If comparing Examples 2-1 to 2-4 with Example 2-5, the properties for Examples 2-1 to 2-4 were better.",
"In Example 2-5, the intermediate hole transport material included in the intermediate hole transport material layer was not Compound 2-3 to 2-17 represented by Formula 2 but a common hole transport material, i.e., Compound 6-2.Thus, it would be desirable that the intermediate hole transport material layer may include the compound represented by Formula 2.As described above, since an anode-side hole transport layer formed mainly utilizing an electron accepting material, an intermediate hole transport material layer and an emission layer-side hole transport layer including a compound represented by Formula 1 were stacked between a first electrode (anode) and an emission layer according to an embodiment, the driving voltage of an organic EL device may decrease, and the emission efficiency and emission life thereof may be improved.",
"By disposing the emission layer-side hole transport layer including the compound represented by Formula 1, the emission layer-side hole transport layer may passivate the hole transport layer from electrons not consumed in the emission layer, the diffusion of energy in an excited state generated in the emission layer into the hole transport may be reduced or prevented, and the charge balance of a whole device may be controlled.",
"In addition, the results show that the emission layer-side hole transport layer restrained (e.g., reduced or prevented) the diffusion of the electron accepting material included in the anode-side hole transport layer provided near the first electrode (anode) by disposing the emission layer-side hole transport layer including the compound represented by Formula 1.As described above, an anode side hole transport layer, an intermediate hole transport material layer, and an emission layer side hole transport layer are provided between an anode and an emission layer according to the present disclosure, and the emission efficiency and emission life of an organic EL device may be increased.",
"Expressions such as “at least one of,” when preceding a list of elements, modify the entire list of elements and do not modify the individual elements of the list.",
"Further, the use of “may” when describing embodiments of the inventive concept refers to “one or more embodiments of the inventive concept.” Also, the term “exemplary” is intended to refer to an example or illustration.",
"As used herein, the term “substantially,” “about,” and similar terms are used as terms of approximation and not as terms of degree, and are intended to account for the inherent deviations in measured or calculated values that would be recognized by those of ordinary skill in the art.",
"Also, any numerical range recited herein is intended to include all sub-ranges of the same numerical precision subsumed within the recited range.",
"For example, a range of “1.0 to 10.0” is intended to include all subranges between (and including) the recited minimum value of 1.0 and the recited maximum value of 10.0, that is, having a minimum value equal to or greater than 1.0 and a maximum value equal to or less than 10.0, such as, for example, 2.4 to 7.6.Any maximum numerical limitation recited herein is intended to include all lower numerical limitations subsumed therein and any minimum numerical limitation recited in this specification is intended to include all higher numerical limitations subsumed therein.",
"Accordingly, Applicant reserves the right to amend this specification, including the claims, to expressly recite any sub-range subsumed within the ranges expressly recited herein.",
"The above-disclosed subject matter is to be considered illustrative and not restrictive, and the appended claims are intended to cover all such modifications, enhancements, and other embodiments, which fall within the true spirit and scope of the present disclosure.",
"Thus, to the maximum extent allowed by law, the scope of the present disclosure is to be determined by the broadest permissible interpretation of the following claims and their equivalents, and shall not be restricted or limited by the foregoing detailed description."
]
] |
Patent_15871070
|
[
[
"FLEXIBLE DISPLAY PANEL AND MANUFACTURING METHOD THEREOF",
"A flexible display panel and a manufacturing method which is capable of removing a non-display area without damaging a display element layer, the flexible display panel includes a flexible substrate which includes a display area and a peripheral area outside of the display area, a display element layer disposed on the flexible substrate, and a neutral plane balancing layer disposed on the display element layer in the peripheral area, wherein the peripheral area of the flexible substrate in which the neutral plane balancing layer is disposed is folded towards a rear side of the display area along a first bending line, and the neutral plane balancing layer overlaps the first bending line."
],
[
"1.A flexible display panel comprising: a flexible substrate including a display area and a peripheral area outside of the display area; a wire or an organic layer disposed over the flexible substrate; a polarizer disposed over the flexible substrate; and an acryl-based resin layer disposed in the peripheral area, not disposed in the display area, and having a curvature radius which is greater than a curvature radius of the wire or the organic layer overlapping the acryl-based resin layer in a first direction perpendicular to an upper surface of the flexible substrate, wherein: the peripheral area of the flexible substrate in which the acryl-based resin layer is disposed is bent along a first bending line towards a rear side of the display area, the acryl-based resin layer overlaps the first bending line in the first direction, and a side surface of the acryl-based resin layer is in contact with a side surface of the polarizer.",
"2.The flexible display panel of claim 1, further comprising: a lower film under the flexible substrate, wherein a bottom side of the lower film includes at least one depression.",
"3.The flexible display panel of claim 2, wherein the depression has at least three sides that extend in different directions from each other in a sectional view.",
"4.The flexible display panel of claim 2, wherein the depression has at least three planes that extend in different directions from each other, and at least two edges respectively disposed between two adjacent planes of the at least three planes.",
"5.The flexible display panel of claim 2, further comprising: a display element layer comprising thin film transistors, and light emitting elements over the thin film transistors, wherein the display element is disposed between the flexible substrate and the polarizer.",
"6.The flexible display panel of claim 5, wherein the depression is for reducing stress applied to the display element when the flexible substrate is bent.",
"7.The flexible display panel of claim 1, further comprising: a barrier layer over the flexible substrate, the barrier layer comprising an inorganic insulating material; and a display element layer comprising thin film transistors, and light emitting elements over the thin film transistors, wherein the display element is disposed between the barrier layer and the polarizer.",
"8.The flexible display panel of claim 8, wherein the display element further comprises an encapsulation layer for encapsulating the light emitting elements.",
"9.The flexible display panel of claim 1, wherein a thickness of the acryl-based resin layer is from about 10 μm to about 150 μm.",
"10.A flexible display panel comprising: a flexible substrate including a display area where a plurality of pixels are disposed, and a peripheral area outside of the display area; a wire disposed over the flexible substrate and in the peripheral area; a polarizer disposed over the flexible substrate and including a portion disposed in the display area; and a first layer including a resin and disposed in the peripheral area, not disposed in the display area, the first layer overlapping the wire in a first direction perpendicular to an upper surface of the flexible substrate, wherein: the peripheral area of the flexible substrate is bent along a first bending line towards a rear side of the display area, the first layer overlaps the first bending line in the first direction, and a side surface of the first layer is in contact with a side surface of the polarizer.",
"11.The flexible display panel of claim 10, further comprising: a lower film under the flexible substrate, wherein a bottom side of the lower film includes at least one depression overlapping the first layer in the first direction.",
"12.The flexible display panel of claim 11, wherein the depression has at least three sides that extend in different directions from each other in a sectional view.",
"13.The flexible display panel of claim 10, further comprising: a barrier layer over the flexible substrate, the barrier layer comprising an inorganic insulating material; and a display element layer comprising thin film transistors, and light emitting elements over the thin film transistors, wherein the display element is disposed between the barrier layer and the polarizer.",
"14.The flexible display panel of claim 13, wherein the display element further comprises an encapsulation layer for encapsulating the light emitting elements.",
"15.The flexible display panel of claim 10, wherein a thickness of the first layer is from about 10 μm to about 150 μm.",
"16.A flexible display panel comprising: a flexible substrate including a display area where a plurality of pixels are disposed, and a peripheral area outside of the display area; a wire or an organic layer disposed over the flexible substrate and in the peripheral area; light emitting elements over the flexible substrate and in the display area; an encapsulation layer for encapsulating the light emitting elements; an insulating layer over the encapsulation layer and including a portion disposed in the display area; and an acryl-based resin layer disposed in the peripheral area, not disposed in the display area, the acryl-based resin layer overlapping the wire or the organic layer in a first direction perpendicular to an upper surface of the flexible substrate, wherein: the peripheral area of the flexible substrate is bent along a first bending line towards a rear side of the display area, the acryl-based resin layer overlaps the first bending line in the first direction, and a side surface of the acryl-based resin layer is in contact with a side surface of the insulating layer.",
"17.The flexible display panel of claim 16, further comprising: a lower film under the flexible substrate, wherein a bottom side of the lower film includes at least one depression overlapping the acryl-based resin layer in the first direction.",
"18.The flexible display panel of claim 17, wherein the depression has at least three sides that extend in different directions from each other in a sectional view.",
"19.The flexible display panel of claim 16, further comprising: a barrier layer over the flexible substrate, the barrier layer comprising an inorganic insulating material; and thin film transistors disposed between the barrier layer and the light emitting elements, wherein the insulating layer comprises an anti-reflection layer.",
"20.The flexible display panel of claim 16, wherein a thickness of the acryl-based resin layer is from about 10 μm to about 150 μm."
],
[
"<SOH> BACKGROUND <EOH>"
],
[
"<SOH> SUMMARY <EOH>In embodiments of a flexible display device, when a display panel is to be folded in order to remove a non-display area, a large amount of stress is applied to a layer of the display panel where a thin film transistor and a light emitting element are disposed, thereby damaging the display panel.",
"When the thin film transistor and the light emitting element are damaged, these elements do not properly function or the performance thereof may be deteriorated to cause problems in display quality of an image, and stress due to bending may be accumulated to cause cracks or delamination of the display element layer.",
"Embodiments of the present invention have been made in an effort to provide a flexible display panel and a manufacturing method thereof which is capable of removing a non-display area without damaging a display element layer which includes a thin film transistor and a light emitting element.",
"A flexible display panel according to an exemplary embodiment of the present invention includes a flexible substrate including a display area and a peripheral area outside of the display area, a display element layer disposed on the flexible substrate, and a neutral plane balancing layer disposed on the display element layer in the peripheral area, wherein the peripheral area of the flexible substrate in which the neutral plane balancing layer is disposed is folded towards a rear side of the display area along a first bending line, and the neutral plane balancing layer overlaps the first bending line.",
"A lower passivation film may be disposed under the flexible substrate, and a bottom side of the lower passivation film may include a plurality of grooves.",
"A thickness of the neutral plane balancing layer may be from about 10 μm to about 150 μm.",
"The neutral plane balancing layer may include an acryl or silicon-based resin.",
"The neutral plane balancing layer may further include nanoparticles or micro-particles.",
"The curvature radius of the flexible substrate folded along the first bending line may be from about 0.5 mm to about 10 mm.",
"The display element layer may include a plurality of thin film transistors, a plurality of light emitting elements, and an encapsulation layer sealing the light emitting elements.",
"The peripheral area includes a first peripheral area in which a wiring portion is disposed and a second peripheral area in which a pad area is disposed, and the neutral plane balancing layer may be formed in the second peripheral area.",
"A flexible display panel according to another exemplary embodiment of the present invention includes a flexible substrate including a display area and a peripheral area outside of the display area, a display element layer disposed on the flexible substrate, and a lower passivation film disposed under the flexible substrate, wherein a bottom side of the lower passivation film includes a plurality of grooves, and the peripheral area of the flexible substrate is folded towards a rear side of the display area along a first bending line.",
"A neutral plane balancing layer may be disposed on the display element layer of the peripheral area.",
"The neutral plane balancing layer may overlap the first bending line.",
"A part of the peripheral area folded towards the rear side of the display area may be folded outwards along a second bending line disposed outside of the first bending line.",
"A flexible display panel according to another exemplary embodiment of the present invention includes a flexible substrate which includes a display area and a peripheral area outside of the display area, and a display element layer disposed on the flexible substrate, wherein a peripheral area of the flexible substrate is folded towards a rear side of the display panel along a first bending line, and a part of the peripheral area folded towards the rear side of the display area is folded outwards along a second bending line which is disposed outside of the first bending line.",
"A lower passivation film may be disposed under the flexible substrate, and a bottom side of the lower passivation film may include a plurality of grooves.",
"A manufacturing method of a flexible display panel according to an exemplary embodiment of the present invention includes forming a display element layer by laminating a plurality of thin films on a flexible substrate which includes a display area and a peripheral area outside of the display area, forming a neutral plane balancing layer on the display element layer in the peripheral area, and folding the peripheral area of the flexible substrate where the neutral plane balancing layer is disposed towards a rear side of the display panel along a first bending line, and wherein the neutral plane balancing layer overlaps the first bending line.",
"The method further includes attaching a lower passivation film to a bottom side of the flexible substrate, and a bottom side of the lower passivation film may include a plurality of grooves.",
"A manufacturing method of a flexible display panel according to another exemplary embodiment of the present invention includes forming a display element layer on a flexible substrate which includes a display area and a peripheral area outside of the display area, attaching a lower passivation film to a bottom side of the flexible substrate, and bending the peripheral area of the flexible substrate towards a rear side of the display area along a first bending line, wherein a bottom side of the lower passivation film includes a plurality of grooves.",
"The method further includes forming a neutral plane balancing layer on the display element layer in the peripheral area.",
"The method may further includes folding a part of the peripheral area forward along a second bending line disposed outside of the first bending line before folding the peripheral area of the flexible substrate towards the rear side of the display area along the first bending line.",
"A manufacturing method of a flexible display panel according to another exemplary embodiment of the present invention includes forming a display element layer on a flexible substrate which includes a display area and a peripheral area outside of the display area, folding a part of the peripheral area forward along a first bending line crossing the peripheral area, and folding the folded peripheral area towards the rear side of the display area along a second bending line disposed inside of the first bending line.",
"According to an exemplary embodiment of the present invention, a non-display area may be removed without damaging a display element layer which includes a thin film transistor and a light emitting element."
],
[
"CROSS-REFERENCE TO RELATED APPLICATION This application is a continuation of U.S. patent application Ser.",
"No.",
"14/256,581, filed Apr.",
"18, 2014, which claims priority to and the benefit of Korean Patent Application No.",
"10-2013-0122078, filed Oct. 14, 2013, the entire content of both of which is incorporated herein by reference.",
"BACKGROUND 1.Field The present invention relates to a flexible display panel and a manufacturing method thereof.",
"More particularly, the present invention relates to a flexible display panel and a manufacturing method thereof which are capable of removing a non-display area without damaging a display element layer.",
"2.Description of the Related Art A display device such as a liquid crystal display (LCD), an organic light emitting diode (OLED) display, and an electrophoretic display include a field generating electrode and an electro-optical active layer.",
"For example, the organic light emitting diode (OLED) display includes an organic light emitting layer as the electro-optical active layer.",
"The field generating electrode is connected to a switching element such as a thin film transistor to receive a data signal, and the electro-optical active layer converts the data signal to an optical signal to display an image.",
"Among the display devices, since the organic light emitting diode (OLED) display, as a self-light emitting type, does not require an additional light source, it is advantageous in terms of power consumption, response speed and, viewing angle, and contrast ratio are excellent.",
"The organic light emitting diode (OLED) display includes a plurality of pixels such as red pixels, blue pixels, green pixels, and white pixels, and may express full colors by combining the pixels.",
"Each pixel includes an organic light emitting element, and a plurality of thin film transistors for driving the organic light emitting element.",
"The light emitting element of the organic light emitting diode (OLED) display includes a pixel electrode, a common electrode, and a light emitting layer interposed between the two electrodes.",
"One of the pixel electrode and the common electrode becomes an anode, and the other becomes a cathode.",
"An electron injected from the cathode and a hole injected from the anode are coupled with each other in the light emitting layer to form an exciton, and the exciton emits light while discharging energy.",
"The common electrode is formed throughout a plurality of pixels, and transfers a predetermined common voltage.",
"In the case of the organic light emitting diode (OLED) display, to reduce reflection of external light, a polarizing plate may be attached to an upper part of a display panel, a touch panel may be attached to the upper part of the display panel to sense external contact, or a lower passivation film may be attached to a bottom side of the display panel.",
"In cases where the display panel of the display device uses a glass substrate which is heavy and easily damaged, there is a limitation in its portability and implementation of a large-scale screen display.",
"Thus, recently, a display device which is light, strong against impact, and uses a flexible plastic substrate has been developed.",
"Meanwhile, the display panel of the display device includes a display area where a plurality of display pixels are disposed, and a peripheral area surrounding the display area.",
"The peripheral area is provided with various kinds of wires for transmitting a driving signal to a signal line connected to a thin film transistor of the display area, and various kinds of voltage pads for receiving voltages from an external source.",
"The peripheral area forms a non-display area because it does not display an image, and the display area is reduced as the non-display area increases.",
"Recently, demand for a display device having a smaller non-display area is increasing.",
"The above information disclosed in this Background section is only for enhancement of an understanding of the background of the invention and therefore it may contain information that does not form the prior art that is already known to a person of ordinary skill in the art.",
"SUMMARY In embodiments of a flexible display device, when a display panel is to be folded in order to remove a non-display area, a large amount of stress is applied to a layer of the display panel where a thin film transistor and a light emitting element are disposed, thereby damaging the display panel.",
"When the thin film transistor and the light emitting element are damaged, these elements do not properly function or the performance thereof may be deteriorated to cause problems in display quality of an image, and stress due to bending may be accumulated to cause cracks or delamination of the display element layer.",
"Embodiments of the present invention have been made in an effort to provide a flexible display panel and a manufacturing method thereof which is capable of removing a non-display area without damaging a display element layer which includes a thin film transistor and a light emitting element.",
"A flexible display panel according to an exemplary embodiment of the present invention includes a flexible substrate including a display area and a peripheral area outside of the display area, a display element layer disposed on the flexible substrate, and a neutral plane balancing layer disposed on the display element layer in the peripheral area, wherein the peripheral area of the flexible substrate in which the neutral plane balancing layer is disposed is folded towards a rear side of the display area along a first bending line, and the neutral plane balancing layer overlaps the first bending line.",
"A lower passivation film may be disposed under the flexible substrate, and a bottom side of the lower passivation film may include a plurality of grooves.",
"A thickness of the neutral plane balancing layer may be from about 10 μm to about 150 μm.",
"The neutral plane balancing layer may include an acryl or silicon-based resin.",
"The neutral plane balancing layer may further include nanoparticles or micro-particles.",
"The curvature radius of the flexible substrate folded along the first bending line may be from about 0.5 mm to about 10 mm.",
"The display element layer may include a plurality of thin film transistors, a plurality of light emitting elements, and an encapsulation layer sealing the light emitting elements.",
"The peripheral area includes a first peripheral area in which a wiring portion is disposed and a second peripheral area in which a pad area is disposed, and the neutral plane balancing layer may be formed in the second peripheral area.",
"A flexible display panel according to another exemplary embodiment of the present invention includes a flexible substrate including a display area and a peripheral area outside of the display area, a display element layer disposed on the flexible substrate, and a lower passivation film disposed under the flexible substrate, wherein a bottom side of the lower passivation film includes a plurality of grooves, and the peripheral area of the flexible substrate is folded towards a rear side of the display area along a first bending line.",
"A neutral plane balancing layer may be disposed on the display element layer of the peripheral area.",
"The neutral plane balancing layer may overlap the first bending line.",
"A part of the peripheral area folded towards the rear side of the display area may be folded outwards along a second bending line disposed outside of the first bending line.",
"A flexible display panel according to another exemplary embodiment of the present invention includes a flexible substrate which includes a display area and a peripheral area outside of the display area, and a display element layer disposed on the flexible substrate, wherein a peripheral area of the flexible substrate is folded towards a rear side of the display panel along a first bending line, and a part of the peripheral area folded towards the rear side of the display area is folded outwards along a second bending line which is disposed outside of the first bending line.",
"A lower passivation film may be disposed under the flexible substrate, and a bottom side of the lower passivation film may include a plurality of grooves.",
"A manufacturing method of a flexible display panel according to an exemplary embodiment of the present invention includes forming a display element layer by laminating a plurality of thin films on a flexible substrate which includes a display area and a peripheral area outside of the display area, forming a neutral plane balancing layer on the display element layer in the peripheral area, and folding the peripheral area of the flexible substrate where the neutral plane balancing layer is disposed towards a rear side of the display panel along a first bending line, and wherein the neutral plane balancing layer overlaps the first bending line.",
"The method further includes attaching a lower passivation film to a bottom side of the flexible substrate, and a bottom side of the lower passivation film may include a plurality of grooves.",
"A manufacturing method of a flexible display panel according to another exemplary embodiment of the present invention includes forming a display element layer on a flexible substrate which includes a display area and a peripheral area outside of the display area, attaching a lower passivation film to a bottom side of the flexible substrate, and bending the peripheral area of the flexible substrate towards a rear side of the display area along a first bending line, wherein a bottom side of the lower passivation film includes a plurality of grooves.",
"The method further includes forming a neutral plane balancing layer on the display element layer in the peripheral area.",
"The method may further includes folding a part of the peripheral area forward along a second bending line disposed outside of the first bending line before folding the peripheral area of the flexible substrate towards the rear side of the display area along the first bending line.",
"A manufacturing method of a flexible display panel according to another exemplary embodiment of the present invention includes forming a display element layer on a flexible substrate which includes a display area and a peripheral area outside of the display area, folding a part of the peripheral area forward along a first bending line crossing the peripheral area, and folding the folded peripheral area towards the rear side of the display area along a second bending line disposed inside of the first bending line.",
"According to an exemplary embodiment of the present invention, a non-display area may be removed without damaging a display element layer which includes a thin film transistor and a light emitting element.",
"BRIEF DESCRIPTION OF THE DRAWINGS FIG.",
"1 is a top plan view of a display panel before a peripheral area is folded backwards in a manufacturing process of a flexible display panel according to an exemplary embodiment of the invention.",
"FIG.",
"2 is a layout view showing a pixel of the display panel according to an exemplary embodiment of the present invention.",
"FIG.",
"3 is a cross-sectional view of the display panel of FIG.",
"2 taken along the line III-Ill.",
"FIG.",
"4A, FIG.",
"4B, and FIG.",
"4C are top plan views of the display panel before the peripheral area is folded backwards in a manufacturing process of a flexible display panel according to an exemplary embodiment of the present invention.",
"FIG.",
"5A and FIG.",
"5B are cross-sectional views of the display panel of FIG.",
"4A taken along the line V-V.",
"FIG.",
"6 is a cross-sectional view of a lower passivation film of the display panel according to an exemplary embodiment of the present invention.",
"FIG.",
"7 is a cross-sectional view showing a state in which the peripheral area of the display panel according to an exemplary embodiment of the present invention is folded backwards.",
"FIG.",
"8 is a top plan view showing a state in which the peripheral area of the display panel according to an exemplary embodiment of the present invention is folded backwards.",
"FIG.",
"9 is a cross-sectional view showing a state in which the peripheral area of the display panel according to an exemplary embodiment of the present invention is folded backwards.",
"FIG.",
"10 is a top plan view of the display panel before the peripheral area is folded backwards in a manufacturing process of a flexible display panel according to an exemplary embodiment of the invention.",
"FIG.",
"11 is a cross-sectional view of the display panel of FIG.",
"10 taken along the line XI-XI.",
"FIG.",
"12 is a cross-sectional view showing a state in which a part of the peripheral area of the display panel according to an exemplary embodiment of the present invention is folded forwards.",
"FIG.",
"13 is a cross-sectional view showing a state in which a part of the display panel of FIG.",
"12 is folded backwards.",
"FIG.",
"14 is a cross-sectional view showing a state in which a part of the peripheral area of the display panel according to an exemplary embodiment of the present invention is folded forwards.",
"FIG.",
"15 is a cross-sectional view showing a state in which a part of the display panel of FIG.",
"14 is folded backwards.",
"DETAILED DESCRIPTION The present invention will be described more fully hereinafter with reference to the accompanying drawings, in which exemplary embodiments of the invention are shown.",
"As those skilled in the art would realize, the described embodiments may be modified in various different ways, all without departing from the spirit or scope of the present invention.",
"In the drawings, the thickness of layers, films, panels, regions, etc., are exaggerated for clarity.",
"Like reference numerals designate like elements throughout the specification.",
"It will be understood that when an element such as a layer, film, region, or substrate is referred to as being “on” another element, it can be directly on the other element or intervening elements may also be present.",
"In contrast, when an element is referred to as being “directly on” another element, there are no intervening elements present.",
"First, Referring to FIG.",
"1 through FIG.",
"8, a flexible display panel and its manufacturing method according to an exemplary embodiment of the present invention will be described.",
"FIG.",
"1 is a top plan view of a display panel before a peripheral area is folded backwards in a manufacturing process of a flexible display panel according to an exemplary embodiment of the invention, FIG.",
"2 is a layout view showing a pixel of the display panel according to an exemplary embodiment of the present invention, FIG.",
"3 is a cross-sectional view of the display panel of FIG.",
"2 taken along the line II-III, FIG.",
"4A, FIG.",
"4B, and FIG.",
"4C are top plan views of the display panel before the peripheral area is folded backwards in a manufacturing process of a flexible display panel according to an exemplary embodiment of the present invention, FIG.",
"5A and FIG.",
"5B are cross-sectional views of the display panel of FIG.",
"4A taken along the line V-V, FIG.",
"6 is a cross-sectional view of a lower passivation film of the display panel according to an exemplary embodiment of the present invention, FIG.",
"7 is a cross-sectional view showing a state in which the peripheral area of the display panel according to an exemplary embodiment of the present invention is folded backwards, and FIG.",
"8 is a top plan view showing a state in which the peripheral area of the display panel according to an exemplary embodiment of the present invention is folded backwards.",
"First, referring to FIG.",
"1 through FIG.",
"3, a flexible substrate 112 is formed on a supporting substrate (not shown) made of glass or plastic.",
"When viewed on a plane, the flexible substrate 112 includes a display area DA for displaying an image and a peripheral area PA outside of the display area.",
"The supporting substrate may be various kinds of substrates which are capable of supporting the flexible substrate 112 and endure manufacturing stresses.",
"The supporting substrate will be removed on completion of the flexible display panel.",
"The flexible substrate 112 may include a flexible plastic.",
"For example, the flexible substrate 112 may include polyethylene terephthalate (PET), polyethylene naphthalate, polycarbonate, polyarylate, polyetherimide, polyether sulfone, polyimide, and the like.",
"Next, a barrier layer 111 may be formed on the flexible substrate 112.The barrier layer 111 may prevent external impurities from penetrating through the flexible substrate 112 and then permeating into a display element layer disposed thereon, and a surface of the barrier layer 111 may be smooth.",
"The barrier layer 111 may include at least one of an organic or inorganic film.",
"For example, the barrier layer 111 may include a silicon nitride (SiNx), a silicon oxide (SiOx), or a silicon oxynitride (SiOxNy).",
"The barrier layer 111 may be omitted.",
"Next, a display element layer 200 including a plurality of thin films is formed on the barrier layer 111.The display element layer 200 includes a plurality of signal lines which are disposed at the display area, and a plurality of pixels PX which are connected to the signal lines and are arranged in an approximate matrix form.",
"The signal lines may include a plurality of scanning signal lines to transmit a scanning signal, and a plurality of data lines to transmit a data signal.",
"The display element layer 200 may include wiring portions WR1 and WR2 which are disposed at the peripheral area PA, and a pad area PDA which is connected to a driving portion (not illustrated) to drive pixels PX.",
"Accordingly, the peripheral area PA includes a first peripheral area PA_a in which the wiring portions WR1 and WR2 are disposed, and a second peripheral area PA_b in which the pad area PDA is disposed.",
"The pad area PDA and wiring portions WR1 and WR2 may be connected to each other, and may be made of a conductive material.",
"The wiring portions WR1 and WR2 may be connected to a plurality of signal lines in the display area DA, and may be disposed at respective lateral sides of the display area DA.",
"The driving portion may include a scan driver (not illustrated) to transmit scanning signals or a data driver (not illustrated) to transmit data signals.",
"The driving portion may be directly mounted on the pad area PDA above the flexible substrate 112 in an IC chip form, or may be mounted on a flexible printed circuit film (not illustrated) or on a circuit board, and may be connected to the pad area PDA on the flexible substrate 112 in a tape carrier package TCP form.",
"Now, referring to FIG.",
"2 and FIG.",
"3, a structural example of a display element layer 200 of the flexible display panel will be described.",
"A plurality of first and second semiconductors 154a and 154b are formed on the barrier layer 111.The first semiconductor 154a may include a channel region (not illustrated), a source region (not illustrated), and a drain region (not illustrated) which are disposed at respective lateral sides of the channel region and are formed to be doped.",
"The second semiconductor 154b may include a channel region 152b, a source region 153b and a drain region 155b which are disposed at respective lateral sides of the channel region 152b and are formed to be doped.",
"The first and second semiconductors 154a and 154b may include amorphous silicon, polysilicon, or an oxide semiconductor.",
"A gate insulation layer 140 made of a silicon nitride (SiNx) or a silicon oxide (SiOx) is disposed on the first and second semiconductors 154a and 154b.",
"A plurality of scanning signal lines 121 including a first control electrode 124a and a plurality of gate conductors including a second control electrode 124b are formed on the gate insulation layer 140.The scanning signal lines 121 transfer scanning signals, and may extend mainly in a horizontal direction.",
"The first control electrode 124a may extend upwards from the scanning signal lines 121.The second control electrode 124b is separated from the scanning signal lines 121.Though not illustrated, the second control electrode 124b may include a storage electrode extending in a vertical direction.",
"The first control electrode 124a may overlap a part of the first semiconductor 154a, particularly the channel region, and the second control electrode 124b may overlap a part of the second semiconductor 154b, particularly the channel region 152b.",
"A first passivation layer 180a is disposed on the gate insulation layer 140 and the gate conductor.",
"The first passivation layer 180a and the gate insulation layer 140 include a contact hole 183a which exposes the source region of the first semiconductor 154a, a contact hole 185a which exposes the drain region, a contact hole 183b which exposes the source region 153b of the second semiconductor 154b, and a contact hole 185b which exposes the drain region 155b.",
"The first passivation layer 180a includes a contact hole 184 which exposes the second control electrode 124b.",
"A plurality of data conductors including a plurality of data lines 171, a plurality of driving voltage lines 172, and a plurality of data conductors which include a plurality of first output electrodes 175a and a plurality of second output electrodes 175b are formed on the first passivation layer 180a.",
"The data lines 171 transmit data signals, and may mainly extend in a vertical direction to cross the scanning signal lines 121.Each data line 171 includes a plurality of first input electrodes 173a which extend toward the first control electrode 124a.",
"The driving voltage lines 172 transfer a driving voltage, and may mainly extend in a vertical direction to cross the scanning signal lines 121.Each driving voltage line 172 includes a plurality of second input electrodes 173b which extend toward the second control electrode 124b.",
"In case the second control electrode 124b includes the storage electrode, the driving voltage lines 172 may include a part which overlaps the storage electrode.",
"The first and second output electrodes 175a and 175b are separated from each other to have an island shape, and are separated from the data lines 171 and the driving voltage lines 172.The first input electrode 173a and the first output electrode 175a face each other on the first semiconductor 154a, and the second input electrode 173b and the second output electrode 175b equally face each other on the second semiconductor 154b.",
"The first input electrode 173a and the first output electrode 175a may be respectively connected to the source region and the drain region of the first semiconductor 154a through the contact holes 183a and 185a.",
"The first output electrode 175a may be connected to the second control electrode 124b through the contact hole 184.The second input electrode 173b and the second output electrode 175b may be respectively connected to the source region 153b and the drain region 155b of the second semiconductor 154b through the contact holes 183b and 185b.",
"The first control electrode 124a, the first input electrode 173a, and the first output electrode 175a form a switching thin film transistor Qs together with the first semiconductor 154a, and the second control electrode 124b, the second input electrode 173b, and the second output electrode 175b form a driving thin film transistor Qd together with the second semiconductor 154b.",
"However, the structure of the switching transistor Qs and the driving transistor Qd is not limited thereto, and may be variously modified.",
"A second passivation layer 180b made of an inorganic insulator such as a silicon nitride or a silicon oxide may be disposed on the data conductor.",
"The second passivation layer 180b may have a smooth surface by removing steps in order to improve light emission efficiency of the organic light emitting element to be formed thereon.",
"The second passivation layer 180b may include a contact hole 185c which exposes the second output electrode 175b.",
"A plurality of pixel electrodes 191 are formed on the second passivation layer 180b.",
"The pixel electrode 191 of each pixel PX is physically and electrically connected to the second output electrode 175b through the contact hole 185c of the second passivation layer 180b.",
"The pixel electrode 191 may include a semi-transmissive conductive material or a reflective conductive material A pixel definition layer 360 (also referred to as a partition) having a plurality of openings exposing the pixel electrode 191 may be disposed on the second passivation layer 180b.",
"The openings of the pixel definition layer 360 exposing the pixel electrode 191 may define each pixel area.",
"The pixel definition layer 360 may be omitted.",
"A light emitting member 370 is positioned on the pixel definition layer 360 and the pixel electrode 191.The light emitting member 370 may include a first organic common layer 371, a plurality of light emitting layers 373, and a second organic common layer 375 which are laminated in sequence.",
"The first organic common layer 371 may include, for example, at least one of a hole injecting layer and a hole transport layer which are laminated in sequence.",
"The first organic common layer 371 may be formed all over the display area in which the pixel PX is disposed, or may be formed only in each pixel PX area.",
"The light emitting layer 373 may be disposed on the pixel electrode 191 of each corresponding pixel PX.",
"The light emitting layer 373 may be made of an organic material which uniquely emits light of the primary colors such as red, green, and blue, and may have a structure in which a plurality of organic material layers emitting light of different colors are laminated.",
"The second organic common layer 375 may include, for example, at least one of an electron transport layer and an electron injecting layer which are laminated in sequence.",
"The second organic common layer 375 may be formed all over the display area in which the pixel PX is disposed, or may be formed only in each pixel PX area.",
"The first and second organic common layers 371 and 375 are provided to improve light emitting efficiency of the light emitting layer 373, and one of the first and second organic common layers 371 and 375 may be omitted.",
"A common electrode 270 transmitting a common voltage Vss is formed on the light emitting member 370.The common electrode 270 may include a transparent conductive material.",
"For example, the common electrode 270 is made of a transparent conductive material, or may formed by thinly laminating metals such as calcium (Ca), barium (Ba), magnesium (Mg), aluminum (Al), and silver (Ag) to have a light transmitting property.",
"The pixel electrode 191, the light emitting member 370, and the common electrode 270 of each pixel PX form a light emitting diode LD, and one of the pixel electrode 191 and the common electrode 270 becomes a cathode and the other becomes an anode.",
"Further, the storage electrode driving voltage lines 172 overlapped with each other may form a storage capacitor Cst.",
"The display element layer 200 according to an exemplary embodiment of the present invention may employ a top emission method which displays an image by emitting internal light of the light emitting member 370 towards a frontal direction of the flexible substrate 112.An encapsulation layer 379 may be further formed on the common electrode 270.The encapsulation layer 379 may encapsulate the light emitting member 370 and the common electrode 270 to prevent external moisture and oxygen from permeating.",
"A top surface of the encapsulation layer 379 may be smooth.",
"The encapsulation layer 379 may include a plurality of thin film layers.",
"For example, the encapsulation layer 379 may have a multi-layered structure including at least one of an organic film and an inorganic film.",
"Thus, the display element layer 200 including the thin film transistor, the light emitting diode LD, and the encapsulation layer 379 may be completed.",
"The wiring portions WR1 and WR2 and the pad area PDA of the peripheral area PA are disposed at the same layer as the gate conductive layer or data conductive layer, and may be integrally formed when the gate conductive layer or data conductive layer is formed.",
"Referring to FIG.",
"4A to FIG.",
"5B, a neutral plane balancing layer 380 is formed in at least a part of the peripheral area PA.",
"The neutral plane balancing layer 380 is disposed above the display element layer 200.The neutral plane balancing layer 380 may be formed to at least overlap a bending line CL of the second peripheral area PA_b along which the flexible display panel is later folded.",
"For example, the neutral plane balancing layer 380 may be formed, as shown in FIG.",
"4A, all over the second peripheral area PA_b in which the pad area PDA is disposed, or may be formed, as shown in FIG.",
"4B, to overlap a bending line CL of the second peripheral area PA_b along which the flexible display panel is later folded, or may be formed, as shown in FIG.",
"4C, not only in the second peripheral area PA_b but also in at least a part of the peripheral area.",
"The neutral plane balancing layer 380 moves up the position of the neutral plane NP in which strain is virtually zero when the peripheral area PA is folded towards a rear side of the display area DA based on the bending line CL, to dispose the neutral plane NL close to the display element layer 200 or to allow a compressive stress, not a tensile stress, to be applied to the display element layer 200.Herein, the bending line CL may be a virtual border line between the display area DA and the first peripheral area PA_a, or may be disposed on the periphery of the border line.",
"The thickness T1 of the neutral plane balancing layer may be from about 10 μm to about 150 μm and an elastic coefficient may be from about 500 MPa to about 100 GPa, but they are not limited thereto, and may be dependent on design specifications of the display panel such as the thickness of the display element layer 200 and the like.",
"The neutral plane balancing layer 380 may include an acryl or a silicon-based resin, or may include a resin having fine particles.",
"The fine particles may include rubber including silica, epoxy, polymer-based nanoparticles such as an epoxy hybrid and the like, or micro-particles and the like.",
"In addition, the neutral plane balancing layer 380 may include various kinds of films including polyethylene terephthalate (PET) and the like.",
"The horizontal width D1 of the first peripheral area PA_a may be wider than that of the conventional peripheral area.",
"For example, the horizontal width D1 of the first peripheral area PA_a may be from about two to about six times larger than that of the conventional peripheral area.",
"For example, the horizontal width D1 of the first peripheral area PA_a may be wider than about 2 mm, but it is not limited thereto, and may be appropriately adjusted.",
"As such, if the horizontal width of the first peripheral area PA_a is widened, when the first peripheral area PA_a is folded toward a rear side of the display area, bending may be performed only in the first peripheral area PA_a, and the rigidity of the first peripheral area is decreased such that the first peripheral area PA_a can be easily bent.",
"Referring to FIG.",
"5A or FIG.",
"5B, an anti-reflection layer 390, which improves visibility by reducing reflection of external light, may be attached to an upper part of the display element layer 200 of the display area DA.",
"The anti-reflection layer 390 may be disposed only in the display area DA, or may be disposed to be extended to the first peripheral area PA_a together with the display area DA.",
"The anti-reflection layer 390 may include a polarizer (not illustrated) or a plurality of thin film layers (not illustrated).",
"In instances where the anti-reflection layer 390 includes a plurality of thin film layers, the plurality of thin film layers may include at least one thin metal film layer and at least one dielectric layer which are alternately laminated.",
"Next, the supporting substrate is separated from the flexible substrate 112.Next, referring to FIG.",
"5A or 5B, a lower passivation film 130 is attached to a lower part of the flexible substrate 112 after the flexible substrate 112 is separated from the supporting substrate.",
"The lower passivation film 130 may be disposed at both the display area DA and the peripheral area PA.",
"Referring to FIG.",
"5A, FIG.",
"5B, or FIG.",
"6, a bottom side of the lower passivation film 130 may have protrusions and depressions including a plurality of grooves 135.The plurality of grooves 135 may be regularly or irregularly disposed, and the grooves 135 may equally have regular or irregular shapes.",
"The grooves 135 may respectively have a triangular shape, as shown in FIG.",
"5A or 5B, or may respectively have a quadrangular shape, as shown in FIG.",
"6, such as a trapezoidal shape and the like.",
"An interval between the neighboring grooves 135 may be zero, as shown in FIG.",
"5A or 5B, or may be larger than zero, as shown in FIG.",
"6.A distance between the grooves 135 and a top surface of the lower passivation film 130 may be from about 5 μm to about 50 μm, but it is not limited thereto.",
"Moreover, the height of the grooves 135 of the lower passivation film 130 may be from about 10 μm to about 100 μm, but it is not limited thereto.",
"The lower passivation film 130 may include films such as polyethylene terephthalate (PET) and the like, and the plurality of grooves 135 may be formed by an imprinting method.",
"An adhesive layer (not illustrated) may be further disposed between the lower passivation film 130 and the flexible substrate 112.The adhesive layer may include silicon, urethane, acryl, and the like, and may further include nanoparticles made of a silicon oxide SiOx, aluminum, and the like.",
"The thickness of the adhesive layer may be from about 5 μm to about 50 μm, but it is not limited thereto.",
"When the lower passivation film 130 is attached to a bottom surface of the flexible substrate 112 and then the first peripheral area PA_a and a part of the second peripheral area PA_b disposed thereunder are bent towards a rear side of the display area along the bending line CL, stresses applied to the display element layer 200 may be reduced and bending may be easily performed.",
"Accordingly, the stress, which is a deforming force, applied to the display element layer 200 may be reduced such that damage to the display element layer (e.g., the light emitting layer) 200 including the thin film transistor, the light emitting diode LD, the encapsulation layer 379, the wiring portions WR1 and WR2, and the pad area PDA may be reduced.",
"FIG.",
"5A and FIG.",
"5B respectively illustrate a strain distribution graph G when the display panel manufactured by a manufacturing method according to an exemplary embodiment of the present invention includes the neutral plane balancing layer 380 and the lower passivation film 130.Based on the neutral plane NP, the upper part shows a tensile strain and the lower part shows a compressive strain.",
"According to an exemplary embodiment of the present invention, the neutral plane NP of the strain distribution graph G may be disposed close to the display element layer 200, as shown in FIG.",
"5A, or may be disposed in the display element layer 200, as shown in FIG.",
"5B.",
"Further, depending on the thickness T1 of the neutral plane balancing layer 380, the stress applied to the display element layer 200 may be a compressive stress.",
"Accordingly, when the first peripheral area PA_a and the part of the second peripheral area PA_b disposed thereunder are bent towards the rear side of the display area DA along the bending line CL, a tensile stress applied to the display element layer 200 including the wiring portions WR1 and WR2 and the pad area PDA may be reduced or a less damaging stress may be applied to the display element layer 200, thereby resulting in preventing the display element layer 200 from being damaged and easier bending of the first peripheral area PA_a and the part of the second peripheral area PA_b disposed thereunder.",
"Referring to FIG.",
"7, after the first peripheral area PA_a and the part of the second peripheral area PA_b disposed thereunder in the display panel which includes the neutral plane balancing layer 380 and the lower passivation film 130 are bent towards the rear side of the display area DA along the bending line CL, the first peripheral area PA_a and the part of the second peripheral area PA_b disposed thereunder at respective lateral sides of the display area DA are not virtually seen when viewed from a frontal side of the display panel.",
"In this instance, the curvature radius of a part of the display panel folded along the bending line may be from about 0.5 mm to about 10 mm.",
"Further, the entire flexible display panel may be bent with an approximate curvature radius of about 50 mm to about 400 m to form a curved display panel.",
"Thus, when viewed from the frontal side of the display panel, only the display area DA is seen, as shown in FIG.",
"8, while the peripheral area PA at respective lateral sides of the display area disappears.",
"That is, non-display area of the flexible display panel, which does not display an image, may be easily removed.",
"As described above, according to an exemplary embodiment of the present invention, attaching the lower passivation film 130 having the plurality of grooves 135 to the bottom side of the flexible substrate 112 and forming the neutral plane balancing layer 380 at the upper part of the display element layer 200 of the peripheral area PA may simultaneously result in easier bending of the peripheral area PA and preventing the display element layer 200 including the wiring portions WR1 and WR2 and the pad area PDA from being damaged.",
"FIG.",
"9 is a top plan view illustrating the non-display area of the display panel folded backward according to an exemplary embodiment of the present invention.",
"Referring to FIG.",
"9, a flexible display panel according to an exemplary embodiment of the present invention is almost the same as the flexible display panel according to the exemplary embodiment described above, but a bottom surface of the passivation film 130 attached to the lower part of the flexible substrate 112 may not have protrusions and depressions.",
"Although the lower part of the lower passivation film 130 does not have protrusions and depressions, since at least the neutral plane balancing layer 380 overlapped with the bending line CL is still formed at the upper part of the display element layer 200 of the second peripheral area PA_b, the neutral plane tensile stress applied to the display element layer 200 may be virtually reduced as the position of the neutral plane NP is disposed closer to the display element layer 200 when the first peripheral area PA_a and the part of the second peripheral area PA_b disposed thereunder are folded towards the rear side of the display area DA along the bending line CL.",
"Accordingly, the first peripheral area PA_a and the part of the second peripheral area PA_b disposed thereunder may be easily bent, and the non-display area may be easily removed from the display panel without damaging the display element layer 200 including the wiring portions WR1 and WR2 and the pad area PDA.",
"Now, together with the drawings described above, referring to FIG.",
"10 to FIG.",
"13, a manufacturing method of a flexible display panel and the flexible display panel manufactured thereby according to an exemplary embodiment of the present invention will be described.",
"The same constituent elements as the exemplary embodiments described above designate the same reference numerals, and the repeated description will be omitted.",
"FIG.",
"10 is a top plan view of the display panel before the peripheral area is folded backwards in a manufacturing process of a flexible display panel according to an exemplary embodiment of the invention, FIG.",
"11 is a cross-sectional view of the display panel of FIG.",
"10 taken along the line XI-XI, FIG.",
"12 is a cross-sectional view showing a state in which a part of the peripheral area of the display panel according to an exemplary embodiment of the present invention is folded forwards, and FIG.",
"13 is a cross-sectional view showing a state in which a part of the display panel of FIG.",
"12 is folded backwards.",
"First, referring to FIG.",
"10 and FIG.",
"11, a flexible substrate 112 is formed on a supporting substrate (not illustrated) made of glass or plastic.",
"The flexible substrate 112 includes a display area DA displaying an image and a peripheral area PA outside of the display area DA.",
"The peripheral area PA includes a first peripheral area PA_a in which the wiring portions WR1 and WR2 are disposed, and a second peripheral area in which a pad area is disposed.",
"Next, a barrier layer 111 may be formed on the flexible substrate 112.The barrier layer 111 may be omitted.",
"Next, a display element layer 200 including a plurality of thin films is formed on the barrier layer 111.The display element layer 200 includes a plurality of signal lines which are disposed in the display area, and a plurality of pixels PX which are connected thereto and are arranged in an approximate matrix form.",
"The signal line may include a plurality of scanning signal lines to transmit a scanning signal, and a plurality of data lines to transmit a data signal.",
"The display element layer 200 may include wiring portions WR1 and WR2 which are disposed in the peripheral area PA, and a pad area PDA which is connected to a driving portion (not illustrated) to drive pixel PX.",
"The pad area PDA and the wiring portions WR1 and WR2 may be connected to each other, and may be made of a conductive material.",
"The wiring portions WR1 and WR2 may be connected to a plurality of signal lines of the display area DA, and may be disposed at respective lateral sides of the display area DA.",
"The display element layer 200 may include a thin film transistor, a light emitting diode LD, and an encapsulation layer 379, and a detailed structure of the display element layer 200 may be the same as that of the exemplary embodiment described above.",
"The wiring portions WR1 and WR2 and the pad area PDA of the peripheral area PA are disposed on the same layer as a gate conductive layer or data conductive layer, and may be integrally formed when the gate conductive layer or data conductive layer is formed.",
"Next, referring to FIG.",
"11, to improve visibility by reducing reflection of external light, an anti-reflection layer 390 may be attached to an upper part of the display element layer 200 of the display area DA.",
"The anti-reflection layer 390 may be disposed only on the display area DA, or may not only be disposed on the display area but may also further extend to intrude on the first peripheral area PA_a.",
"The anti-reflection layer 390 may include a polarizer (not illustrated) or a plurality of thin film layers (not illustrated).",
"In case the anti-reflection layer 390 includes the plurality of thin film layers, the plurality of thin film layers may include at least one thin metal film layer and at least one dielectric layer which are alternately laminated.",
"Next, the supporting substrate is separated from the flexible substrate 112.A lower passivation film 130 is attached to a bottom side of the flexible substrate 112 after separating the flexible substrate 112 from the supporting substrate.",
"The lower passivation film 139 may be disposed in both the display area DA and the peripheral area PA.",
"Referring to FIG.",
"11, the bottom side of the lower passivation film 130 may have protrusions and depressions including a plurality of grooves 135.The plurality of grooves 135 may be regularly or irregularly disposed, and the grooves 135 may have regular or irregular shapes.",
"Each groove 135 may have a triangular shape, as shown in FIG.",
"11, or may have a quadrangular shape such as trapezoidal shape and the like, as shown in FIG.",
"6 described above.",
"An interval between the grooves 135 and the top side of the lower passivation film 130 may be from about 5 μm m to about 50 μm, but it is not limited thereto.",
"Moreover, the height of the grooves 135 of the passivation film 130 may be from about 10 μm to about 100 μm, but it is not limited thereto.",
"The lower passivation film 130 may include films such as polyethylene terephthalate (PET) and the like, and may be formed with the plurality of grooves 135 by an imprinting method.",
"Next, referring to FIG.",
"10 to FIG.",
"12, the first second peripheral area PA_a and an outer portion of the second peripheral area PA_b disposed thereunder in the display area including the lower passivation film 130 are folded forward along a first bending line CL1.The first bending line CL1 divides the first peripheral area PA_a into two areas, and the horizontal lengths D2 and D3 of the divided areas may be the same as or different from each other.",
"Referring to FIG.",
"12, the first peripheral area PA_a folded forward, and the part of the second peripheral area PA_b disposed thereunder does not intrude on the display area DA.",
"The curvature radius of the part folded along the first bending line CL1 may be from about 0.5 mm to about 10 mm.",
"Referring to FIG.",
"12, the first peripheral area PA_a folded forward along the first bending line CL1, and the outer portion of the part of the second peripheral area PA_b thereunder may raise the neutral plane NP by the thickness T2.That is, the outer portion of the peripheral area PA_a folded upwards along the first bending line CL1 may raise the position of the neutral plane NP such that a tensile stress applied to the display element layer 200 may be reduced or a less damaging compressive stress may be applied to the display element layer 200 when the peripheral area PA folded along the second bending line CL2 is later folded towards the rear side of the display area DA.",
"Accordingly, the first peripheral area PA_a folded upwards along the first bending line CL1 and the outer portion of the part of the second peripheral area PA_b disposed thereunder may perform the same function as the neutral plane balancing layer 380 according to the exemplary embodiment described above.",
"The first bending of the display panel along the first bending line CL1 may place the neutral plane NP higher than the position from which the lower passivation film 130 and is 120 μm away, but it is not limited thereto.",
"Next, referring to FIG.",
"10 and FIG.",
"13, the peripheral area PA folded upwards along the first bending line CL1 is folded along the second bending line CL2 towards the rear side of the display area DA such that the peripheral area PA disposed at respective lateral sides of the display area DA is not virtually seen when viewed from the frontal side thereof.",
"In this case, the curvature radius of a part of the display panel folded along the second bending line CL2 may be from about 0.5 mm to about 10 mm.",
"Herein, the bending line CL2 may virtually overlap a border line between the display area DA and the first peripheral area PA_a, or may be disposed on the periphery of the border line.",
"According to an exemplary embodiment of the present invention, since a lower surface of the lower passivation film 130 includes protrusions and depressions formed with the plurality of grooves 135, stresses applied to the display element layer 200 may be reduced and bending may be easily performed when folding the display panel along the first and second bending lines CL1 and CL2.Accordingly, a stress, which is a deformation force, applied to the display element layer 200 may be reduced, and damage to the thin film transistor, the light emitting diode LD, the encapsulation layer 379, the wiring portions WR1 and WR2, the pad area PDA may be reduced.",
"Thus, as shown in FIG.",
"8 described above, when viewed from the frontal side of the display panel, only the display area DA is seen, and the first peripheral area PA_a and the second peripheral area PA_b disposed thereunder may disappear.",
"That is, the non-display area incapable of displaying an image may be easily removed in the flexible display panel.",
"Thus, according to an exemplary embodiment of the present invention, the lower passivation film 130 formed with the plurality of grooves 135 is attached to the lower part of the flexible substrate 112, and the peripheral area PA is folded twice along the first and second bending lines CL1 and CL2, thereby resulting in easier bending of the peripheral area PA along the second bending line CL2 and simultaneously preventing the display element layer 200 including the wiring portions WR1 and WR2 and the pad area PDA from being damaged.",
"FIG.",
"14 is a cross-sectional view showing a condition in which a part of the peripheral area of the display panel according to an exemplary embodiment of the present invention is folded forwards, and FIG.",
"15 is a cross-sectional view showing a condition in which a part of the display panel of FIG.",
"14 is folded backwards.",
"Referring to FIG.",
"14, a flexible display panel according to an exemplary embodiment of the present invention is almost the same as the flexible display panel according to the exemplary embodiment illustrated in FIG.",
"10 to FIG.",
"13, but a bottom side of the passivation film 130 attached to the lower part of the flexible substrate 112 may not have protrusions and depressions.",
"Although the lower part of the lower passivation film 130 does not have protrusions and depressions, since the peripheral area is folded upwards along the first bending line CL1 and substantially raises the neutral plane NP, a tensile stress applied to the display element layer 200 may be reduced or a compressive stress may be applied thereto when the peripheral area PA is folded towards the rear side of the display area along the second bending line CL2.Accordingly, without damaging the display element layer 200, the peripheral area PA may be easily bent and the non-display area may be easily removed from the display panel.",
"When a couple of the flexible display panels according to an exemplary embodiment described above are connected together, an all-round display device capable of displaying an image at both front and rear sides may be embodied without a non-display area.",
"While this invention has been described in connection with various embodiments thereof, it is to be understood that the invention is not limited to the disclosed embodiments, but, on the contrary, is intended to cover various modifications and equivalent arrangements included within the spirit and scope of the appended claims.",
"Description of Symbols 111: barrier layer 112: flexible substrate 121: scanning signal line 124a, 124b: control electrode 130: lower passivation film 135: groove 140: gate insulation layer 154a, 154b: semiconductor 171: data line 172: driving voltage line 180a, 180b: passivation layer 183a, 183b, 184, 185a, 185b, 185c: contact hole 191: pixel electrode 270: common electrode 360: pixel definition layer 370: light emitting member 371, 375: organic common layer 373: light emitting layer 379: encapsulation layer 380: neutral plane balancing layer 390: anti-reflection layer"
]
] |
Patent_15871072
|
[
[
"DISPLAY DEVICE AND METHOD FOR MANUFACTURING THE SAME",
"A display device including a substrate including a display area and a non-display area, a common electrode line in the non-display area, and a protective layer coating at least a part of an end portion of the common electrode line."
],
[
"1.A method for manufacturing a display device, the method comprising: forming a display area and a non-display area on a substrate; forming a common electrode line in the non-display area on the substrate; and forming a protective layer covering at least a part of an end portion of the common electrode line.",
"2.The method of claim 1, wherein the forming of the display area comprises forming a thin film transistor on the substrate, and the forming of the thin film transistor comprises: forming a semiconductive layer; forming a gate electrode overlapping the semiconductive layer at least in part; forming a source electrode coupled to the semiconductive layer; and forming a drain electrode separated from the source electrode and coupled to the semiconductive layer, wherein the forming of the source and drain electrodes is performed utilizing substantially the same process as the forming of the common electrode line.",
"3.The method of claim 2, further comprising forming a planarization layer on the thin film transistor after the forming of the thin film transistor, wherein the forming of the planarization layer is performed utilizing substantially the same process as the forming of the protective layer.",
"4.The method of claim 3, wherein the forming of the planarization layer comprises: forming a material layer for the planarization layer by applying a planarization layer-forming material on the thin film transistor; selectively exposing the material layer for the planarization layer to light; and developing the exposed material layer for the planarization layer.",
"5.The method of claim 1, wherein the forming of the display area comprises forming one or more display elements, wherein the forming of the display element comprises: forming a pixel electrode on the substrate; forming a light emission layer on the pixel electrode; and forming a common electrode on the light emission layer, wherein the common electrode is coupled to the common electrode line.",
"6.The method of claim 5, wherein the forming of the pixel electrode comprises forming a common electrode coupling portion coupled to the common electrode line.",
"7.The method of claim 5, further comprising forming a pixel defining layer on the substrate after the forming of the pixel electrode and before the forming of the light emission layer.",
"8.The method of claim 1, wherein the protective layer covers one side-edge of the common electrode line.",
"9.The method of claim 1, wherein the forming of the protective layer comprises forming a first protective layer and a second protective layer separated from each other.",
"10.The method of claim 9, wherein the distance between the first and the second protective layers is in a range of about 20 μm to about 2000 μm.",
"11.The method of claim 9, wherein the forming of the protective layer comprises forming a first protective layer covering at least a part of the end portion of the common electrode line, and forming a second protective layer not covering the end portion of the common electrode line, the first and second protective layers being alternately arranged.",
"12.The method of claim 1, wherein the protective layer has a width in a range of about 20 μm to about 200 μm."
],
[
"<SOH> BACKGROUND <EOH>"
],
[
"<SOH> SUMMARY <EOH>Aspects of embodiments of the present invention are directed toward a display device including a protective layer that coats at least part of an end portion of a common electrode line.",
"Further, aspects of embodiments of the present invention are directed toward a method for manufacturing a display device including a protective layer that coats at least part of an end portion of a common electrode line.",
"According to an embodiment of the present invention, there is provided a display device including: a substrate including a display area and a non-display area; a common electrode line in the non-display area; and a protective layer coating at least a part of an end portion of the common electrode line.",
"In an embodiment, the common electrode line includes a metal.",
"In an embodiment, the display area includes at least one thin film transistor including a gate electrode, a semiconductive layer, a source electrode, and a drain electrode, and wherein the common electrode line includes substantially the same material as the source and drain electrodes.",
"In an embodiment, the protective layer overlaps with one side-edge of the common electrode line.",
"In an embodiment, a length of the protective layer is greater than or equal to a length of one side of the display area.",
"In an embodiment, the protective layer includes a first protective layer and a second protective layer that are separated from each other along a direction of the common electrode line.",
"In an embodiment, a distance between the first protective layer and the second protective layer is in a range of about 20 μm to about 2000 μm.",
"In an embodiment, the first protective layer coats at least a part of the end portion of the common electrode line located away from the display area, and the second protective layer does not coat an end portion of the common electrode line, the first and second protective layers being alternately arranged.",
"In an embodiment, the protective layer has a width in a range of about 20 μm to about 200 μm.",
"In an embodiment, the display area includes at least one display element including: a pixel electrode on the substrate; a light emission layer on the pixel electrode; and a common electrode on the light emission layer, wherein the common electrode is coupled to the common electrode line.",
"In an embodiment, display area further includes a planarization layer between the substrate and the pixel electrode, and wherein the protective layer includes substantially the same material as the planarization layer.",
"In an embodiment, the display device further includes a pixel defining layer on the planarization layer so as to define a pixel area, wherein the pixel electrode and the light emission layer are located in the pixel area.",
"In an embodiment, the display device further includes a common electrode coupling portion on the planarization layer, the common electrode coupling portion being coupled to the common electrode line.",
"In an embodiment, the common electrode coupling portion includes substantially the same material as the pixel electrode.",
"According to an embodiment of the present invention, there is provided a method for manufacturing a display device, the method including: forming a display area and a non-display area on a substrate; forming a common electrode line in the non-display area on the substrate; and forming a protective layer covering at least a part of an end portion of the common electrode line.",
"In an embodiment, the forming of the display area includes forming a thin film transistor on the substrate, and the forming of the thin film transistor includes: forming a semiconductive layer; forming a gate electrode overlapping the semiconductive layer at least in part; forming a source electrode coupled to the semiconductive layer; and forming a drain electrode separated from the source electrode and coupled to the semiconductive layer, wherein the forming of the source and drain electrodes is performed utilizing substantially the same process as the forming of the common electrode line.",
"In an embodiment, the method further includes forming a planarization layer on the thin film transistor after the forming of the thin film transistor, wherein the forming of the planarization layer is performed utilizing substantially the same process as the forming of the protective layer.",
"In an embodiment, the forming of the planarization layer includes: forming a material layer for the planarization layer by applying a planarization layer-forming material on the thin film transistor; selectively exposing the material layer for the planarization layer to light; and developing the exposed material layer for the planarization layer.",
"In an embodiment, the forming of the display area includes forming one or more display elements, wherein the forming of the display element includes: forming a pixel electrode on the substrate; forming a light emission layer on the pixel electrode; and forming a common electrode on the light emission layer, wherein the common electrode is coupled to the common electrode line.",
"In an embodiment, the forming of the pixel electrode includes forming a common electrode coupling portion coupled to the common electrode line.",
"In an embodiment, the method further includes forming a pixel defining layer on the substrate after the forming of the pixel electrode and before the forming of the light emission layer.",
"In an embodiment, the protective layer covers one side-edge of the common electrode line.",
"In an embodiment, the forming of the protective layer includes forming a first protective layer and a second protective layer separated from each other.",
"In an embodiment, the distance between the one or more protective layers is in a range of about 20 μm to about 2000 μm.",
"In an embodiment, the forming of the protective layer includes forming a first protective layer covering at least a part of the end portion of the common electrode line, and forming a second protective layer not covering the end portion of the common electrode line, the first and second protective layers being alternately arranged.",
"In an embodiment, the protective layer has a width in a range of about 20 μm to about 200 μm.",
"According to embodiments of the present invention, a display device includes a protective layer that is located on an end portion of a common electrode line.",
"Therefore, when a layer is formed in a manufacturing process of a display device, a layer-forming material may be evenly applied to form a uniform layer.",
"Further, according to embodiments of the present invention, a display device in which a protective layer is located on an end portion of a common electrode line may be manufactured.",
"The foregoing summary is illustrative only and is not intended to be in any way limiting.",
"In addition to the illustrative aspects, embodiments, and features described above, further aspects, embodiments, and features will become apparent by reference to the drawings and the following detailed description."
],
[
"CROSS-REFERENCE TO RELATED APPLICATION This application is a divisional of U.S. patent application Ser.",
"No.",
"14/688,983, filed Apr.",
"16, 2015, which claims priority to and the benefit of Korean Patent Application No.",
"10-2014-0099237, filed Aug. 1, 2014, the entire content of both of which is incorporated herein by reference.",
"BACKGROUND 1.Field Embodiments of the present invention relate to a display device and a method for manufacturing the same.",
"2.Description of the Related Art Flat panel displays such as liquid crystal displays (LCDs) and organic light-emitting diode (OLED) displays include a pair of electric field generating electrodes and an electro-optical active layer interposed therebetween.",
"A liquid crystal layer is included as the electro-optical active layer in LCDs and an organic emission layer is included as the electro-optical active layer in OLED displays.",
"At least one pixel electrode and at least one counter electrode are used to drive an electro-optical active layer.",
"The pixel electrodes are categorized according to a pixel, and the counter electrodes face the pixel electrodes.",
"The counter electrodes may be replaced with common electrodes that are located for all pixels.",
"A common electrode line is used to provide the common electrode with power.",
"The common electrode line is usually located outside a display unit where a pixel is located and it is made of a metal having low resistance in order to reduce or prevent IR-drop.",
"However, a patterning process is repeatedly performed in a manufacturing process of a display device, which results in damage to the common electrode line.",
"It is to be understood that this background of the technology section is intended to provide useful background for understanding the technology disclosed herein, and, as such, the technology background section may include ideas, concepts or recognitions that were not part of what was known or appreciated by those skilled in the pertinent art prior to corresponding effective filing dates of subject matter disclosed herein.",
"SUMMARY Aspects of embodiments of the present invention are directed toward a display device including a protective layer that coats at least part of an end portion of a common electrode line.",
"Further, aspects of embodiments of the present invention are directed toward a method for manufacturing a display device including a protective layer that coats at least part of an end portion of a common electrode line.",
"According to an embodiment of the present invention, there is provided a display device including: a substrate including a display area and a non-display area; a common electrode line in the non-display area; and a protective layer coating at least a part of an end portion of the common electrode line.",
"In an embodiment, the common electrode line includes a metal.",
"In an embodiment, the display area includes at least one thin film transistor including a gate electrode, a semiconductive layer, a source electrode, and a drain electrode, and wherein the common electrode line includes substantially the same material as the source and drain electrodes.",
"In an embodiment, the protective layer overlaps with one side-edge of the common electrode line.",
"In an embodiment, a length of the protective layer is greater than or equal to a length of one side of the display area.",
"In an embodiment, the protective layer includes a first protective layer and a second protective layer that are separated from each other along a direction of the common electrode line.",
"In an embodiment, a distance between the first protective layer and the second protective layer is in a range of about 20 μm to about 2000 μm.",
"In an embodiment, the first protective layer coats at least a part of the end portion of the common electrode line located away from the display area, and the second protective layer does not coat an end portion of the common electrode line, the first and second protective layers being alternately arranged.",
"In an embodiment, the protective layer has a width in a range of about 20 μm to about 200 μm.",
"In an embodiment, the display area includes at least one display element including: a pixel electrode on the substrate; a light emission layer on the pixel electrode; and a common electrode on the light emission layer, wherein the common electrode is coupled to the common electrode line.",
"In an embodiment, display area further includes a planarization layer between the substrate and the pixel electrode, and wherein the protective layer includes substantially the same material as the planarization layer.",
"In an embodiment, the display device further includes a pixel defining layer on the planarization layer so as to define a pixel area, wherein the pixel electrode and the light emission layer are located in the pixel area.",
"In an embodiment, the display device further includes a common electrode coupling portion on the planarization layer, the common electrode coupling portion being coupled to the common electrode line.",
"In an embodiment, the common electrode coupling portion includes substantially the same material as the pixel electrode.",
"According to an embodiment of the present invention, there is provided a method for manufacturing a display device, the method including: forming a display area and a non-display area on a substrate; forming a common electrode line in the non-display area on the substrate; and forming a protective layer covering at least a part of an end portion of the common electrode line.",
"In an embodiment, the forming of the display area includes forming a thin film transistor on the substrate, and the forming of the thin film transistor includes: forming a semiconductive layer; forming a gate electrode overlapping the semiconductive layer at least in part; forming a source electrode coupled to the semiconductive layer; and forming a drain electrode separated from the source electrode and coupled to the semiconductive layer, wherein the forming of the source and drain electrodes is performed utilizing substantially the same process as the forming of the common electrode line.",
"In an embodiment, the method further includes forming a planarization layer on the thin film transistor after the forming of the thin film transistor, wherein the forming of the planarization layer is performed utilizing substantially the same process as the forming of the protective layer.",
"In an embodiment, the forming of the planarization layer includes: forming a material layer for the planarization layer by applying a planarization layer-forming material on the thin film transistor; selectively exposing the material layer for the planarization layer to light; and developing the exposed material layer for the planarization layer.",
"In an embodiment, the forming of the display area includes forming one or more display elements, wherein the forming of the display element includes: forming a pixel electrode on the substrate; forming a light emission layer on the pixel electrode; and forming a common electrode on the light emission layer, wherein the common electrode is coupled to the common electrode line.",
"In an embodiment, the forming of the pixel electrode includes forming a common electrode coupling portion coupled to the common electrode line.",
"In an embodiment, the method further includes forming a pixel defining layer on the substrate after the forming of the pixel electrode and before the forming of the light emission layer.",
"In an embodiment, the protective layer covers one side-edge of the common electrode line.",
"In an embodiment, the forming of the protective layer includes forming a first protective layer and a second protective layer separated from each other.",
"In an embodiment, the distance between the one or more protective layers is in a range of about 20 μm to about 2000 μm.",
"In an embodiment, the forming of the protective layer includes forming a first protective layer covering at least a part of the end portion of the common electrode line, and forming a second protective layer not covering the end portion of the common electrode line, the first and second protective layers being alternately arranged.",
"In an embodiment, the protective layer has a width in a range of about 20 μm to about 200 μm.",
"According to embodiments of the present invention, a display device includes a protective layer that is located on an end portion of a common electrode line.",
"Therefore, when a layer is formed in a manufacturing process of a display device, a layer-forming material may be evenly applied to form a uniform layer.",
"Further, according to embodiments of the present invention, a display device in which a protective layer is located on an end portion of a common electrode line may be manufactured.",
"The foregoing summary is illustrative only and is not intended to be in any way limiting.",
"In addition to the illustrative aspects, embodiments, and features described above, further aspects, embodiments, and features will become apparent by reference to the drawings and the following detailed description.",
"BRIEF DESCRIPTION OF THE DRAWINGS The above and other aspects, features and other enhancements of the present invention will be more clearly understood from the following detailed description when taken in conjunction with the accompanying drawings, in which: FIG.",
"1 is a plan view illustrating a display device, according to a first example embodiment of the present invention; FIG.",
"2 is an enlarged partial view of part “A” of FIG.",
"1; FIG.",
"3 is a cross-sectional view taken along the line I-I in FIG.",
"2; FIG.",
"4 is another example of an enlarged partial view of part “A” of FIG.",
"1; FIG.",
"5 is an equivalent circuit diagram of a pixel illustrated in FIG.",
"4; FIG.",
"6 is a plan view illustrating a display device, according to a second embodiment of the present invention; FIG.",
"7 is a partial plan view illustrating a display device, according to a third embodiment of the present invention; FIG.",
"8 is a cross-sectional view illustrating a display device, according to a fourth embodiment of the present invention; FIGS.",
"9A to 91 are cross-sectional views illustrating sequential manufacturing processes of the display device, according to the first embodiment of the present invention; FIGS.",
"10A and 10B are cross-sectional views illustrating a common electrode line; FIG.",
"11 is a plan view illustrating a mother glass for manufacturing a display device; and FIG.",
"12 is a cross-sectional view illustrating application of an organic material for forming a pixel defining layer.",
"DETAILED DESCRIPTION Aspects of the present invention will be described with reference to embodiments illustrated in the drawings.",
"However, the embodiments disclosed in the drawings and the detailed description are not intended to limit the scope of the present invention.",
"The accompanying drawings are selected only to illustrate the embodiments of the present invention.",
"Each element and its shape may be schematically or exaggeratedly illustrated to help the understanding of the present invention.",
"Some elements provided for a real product may not be illustrated or may be omitted in the drawings or the description.",
"The drawings should be construed to help the understanding of the present invention.",
"Like reference numerals may refer to like elements in the specification.",
"It will be understood that, although the terms “first”, “second”, “third”, etc., may be used herein to describe various elements, components, regions, layers and/or sections, these elements, components, regions, layers and/or sections should not be limited by these terms.",
"These terms are only used to distinguish one element, component, region, layer or section from another element, component, region, layer or section.",
"Thus, a first element, component, region, layer or section discussed below could be termed a second element, component, region, layer or section, without departing from the spirit and scope of the inventive concept.",
"Spatially relative terms, such as “lower”, “upper,” and the like, may be used herein for ease of description to describe one element or feature's relationship to another element(s) or feature(s) as illustrated in the figures.",
"It will be understood that the spatially relative terms are intended to encompass different orientations of the device in use or in operation, in addition to the orientation depicted in the figures.",
"The device may be otherwise oriented (e.g., rotated 90 degrees or at other orientations) and the spatially relative descriptors used herein should be interpreted accordingly.",
"In addition, it will also be understood that when a layer is referred to as being “between” two layers, it can be the only layer between the two layers, or one or more intervening layers may also be present.",
"The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the inventive concept.",
"As used herein, the singular forms “a”, “an” and “the” are intended to include the plural forms as well, unless the context clearly indicates otherwise.",
"As used herein, the term “and/or” includes any and all combinations of one or more of the associated listed items.",
"Expressions such as “at least one of,” when preceding a list of elements, modify the entire list of elements and do not modify the individual elements of the list.",
"It will be understood that when an element or layer is referred to as being “connected to”, “coupled to”, or “adjacent to” another element or layer, it can be directly on, connected to, coupled to, or adjacent to the other element or layer, or one or more intervening elements or layers may be present.",
"When an element or layer is referred to as being “directly connected to”, “directly coupled to”, or “immediately adjacent to” another element or layer, there are no intervening elements or layers present.",
"As used herein, the term “substantially,” “about,” and similar terms are used as terms of approximation and not as terms of degree, and are intended to account for the inherent variations in measured or calculated values that would be recognized by those of ordinary skill in the art.",
"The terms “comprises,” “comprising,” “includes,” and/or “including,” when used in this specification, may specify the presence of stated features, integers, steps, operations, elements, and/or components, but do not preclude the presence or addition of one or more other features, integers, steps, operations, elements, and/or components.",
"It will be understood that when an element is referred to as being “on”, “over”, “located on”, “located over”, “deposited on”, or “deposited over” another element, it can be directly on or over the other element or intervening elements may also be present.",
"Further, the use of “may” when describing embodiments of the present invention refers to “one or more embodiments of the present invention.” Hereinafter, a first embodiment of the present invention will be described with reference to FIGS.",
"1 to 3.FIG.",
"1 is a plan view illustrating a display device, according to the first embodiment of the present invention.",
"FIG.",
"2 is an enlarged partial view of part “A” of FIG.",
"1.FIG.",
"3 is a cross-sectional view taken along the line I-I in FIG.",
"2.As illustrated in FIG.",
"1, an organic light emitting diode (OLED) display 100, according to the first embodiment, includes a substrate 110 having a display area 101 and a non-display area 102.The display area 101 of the substrate 110 may include a plurality of pixels so as to display an image.",
"A common electrode line 230 may be located in the non-display area 102.The common electrode line 230 may be spaced apart from the display area 101 and may be located along an edge of the display area 101.At least one protective layer 240 may be located on an edge portion of the common electrode line 230, which is opposite to the display area 101.Further, a sealing area 220 may be located further out (e.g., more outwards) than the common electrode line 230.The display area 101 may include an organic light emitting diode (OLED) 210 serving as a display element and thin film transistors (TFTs) 10 and 20 configured to drive the OLED 210.Referring to FIGS.",
"2 and 3, the OLED display 100, according to the first embodiment, includes a plurality of pixels that are located in the display area 101 and include switching TFTs 10, driving TFTs 20, capacitors 80, and the OLEDs 210.Herein, the term “pixel” refers to the smallest unit for displaying an image and the OLED display 100 displays an image utilizing a plurality of pixels.",
"Although FIG.",
"2 illustrates an OLED display with a 2Tr-1Cap structure, which includes two TFTs 10 and 20 and a capacitor 80 in one pixel, embodiments of the present invention are not limited thereto.",
"The OLED display, according to one embodiment, includes three or more TFTs and two or more capacitors in one pixel, and may further include conductive lines.",
"The OLED display, according to one embodiment, may have many different structures.",
"The OLED display 100 may further include a gate line 151 on the substrate 110, and a data line 171 and power line 172, which are insulated from and crossing the gate line 151.A pixel is usually defined by the gate line 151, the data line 171, and the power line 172, although, it may be differently defined.",
"For example, the pixel may be defined by a black matrix or a pixel defining layer (PDL).",
"The substrate 110 may be an insulating substrate made of glass, quartz, ceramic, plastic, or the like; however, embodiments of the present invention are not limited thereto.",
"For example, the substrate 110 may be a metal substrate made of stainless steel, or any other suitable material known to those skilled in the art.",
"A buffer layer 120 may be located on the substrate 110.The buffer layer 120 may reduce or prevent infiltration of undesirable elements such as impurities and moisture and may provide a planar surface.",
"The buffer layer 120 may be made of a suitable material for planarizing and/or preventing infiltration.",
"For example, the buffer layer 120 may include one or more of silicon nitride (SiNx), silicon oxide (SiO2), or silicon oxynitride (SiOxNy).",
"In an embodiment, the buffer layer 120 may be omitted depending on kinds and process conditions of the substrate 110.Switching and driving semiconductive layers 131 and 132 may be located on the buffer layer 120.The switching and driving semiconductive layers 131 and 132 may be made of one or more of, e.g., polycrystalline silicon, amorphous silicon, and an oxide semiconductor, such as, indium gallium zinc oxide (IGZO) and indium zinc tin oxide (IZTO).",
"For example, in the example of the driving semiconductive layer 132 illustrated in FIG.",
"3 made of polycrystalline silicon, the driving semiconductive layer 132 may include a channel area 135 that is not doped with impurities, and p+ doped source and drain areas 136 and 137 on the respective sides of the channel area 135.In this example, p-type impurities such as boron B may be used as dopant ions.",
"For example, B2H6 may be used.",
"Such impurities may vary depending on kinds of the TFTs.",
"According to the first embodiment of the present invention, a PMOS-structured TFT using the p-type impurities is utilized as the driving TFT 20; however, embodiments of the present invention are not limited thereto.",
"For example, an NMOS-structured or CMOS-structured TFT may also be used as the driving TFT 20.A gate insulating layer 140 may be located on the switching and driving semiconductive layers 131 and 132.The gate insulating layer 140 may include one or more of, for example, tetraethyl orthosilicate (TEOS), silicon nitride (SiNx), and silicon oxide (SiO2).",
"In an embodiment, the gate insulating layer 140 may have a double layer structure in which a silicon nitride layer having a thickness of about 40 nm and a TEOS layer having a thickness of about 80 nm are sequentially laminated.",
"A gate wire that includes gate electrodes 152 and 155 (e.g., switching gate electrode 152 and driving gate electrode 155) may be located on the gate insulating layer 140.The gate wire may further include a gate line 151, a first capacitor plate 158, and other conductive lines.",
"The gate electrodes 152 and 155 may be located to overlap at least part of the semiconductive layers 131 and 132, e.g., to overlap the channel area.",
"The gate electrodes 152 and 155 may substantially prevent (e.g., prevent) the channel area from being doped with impurities when the source and drain areas 136 and 137 of the semiconductive layers 131 and 132 are doped with the impurities in the process of forming the semiconductive layers 131 and 132.The gate electrodes 152 and 155 and the first capacitor plate 158 may be located on the same layer and may be made of substantially the same metal material.",
"The gate electrodes 152 and 155 and the first capacitor plate 158 may include at least one of molybdenum (Mo), chromium (Cr), and tungsten (W).",
"An interlayer insulating layer 160 configured to cover the gate electrodes 152 and 155 may be located on the gate insulating layer 140.The interlayer insulating layer 160 may be made of tetraethyl orthosilicate (TEOS), silicon nitride (SiNx), or silicon oxide (SiOx) similar to the gate insulating layer 140; however, embodiments of the present invention are not limited thereto.",
"A data wire including source electrodes 173 and 176 (e.g., switching source electrode 173 and driving source electrode 176) and drain electrodes 174 and 177 (e.g., switching drain electrode 174 and driving drain electrode 177) may be located on the interlayer insulating layer 160.The data wire may further include a data line 171, a power line 172, a second capacitor plate 178, and other conductive lines.",
"The source electrodes 173 and 176 and the drain electrodes 174 and 177 may be respectively coupled to the source area 136 and the drain area 137 of the semiconductive layers 131 and 132 through a contact opening (e.g., hole) formed in the gate insulating layer 140 and the interlayer insulating layer 160.Thus, the switching TFT 10 may include the switching semiconductive layers 131, the switching gate electrode 152, the switching source electrode 173, and the switching drain electrode 174, and the driving TFT 20 may include the driving semiconductive layer 132, the driving gate electrode 155, the driving source electrode 176, and the driving drain electrode 177.The configurations of the TFTs 10 and 20 are not limited to the above-described embodiment and may vary according to other suitable configurations understood by those of ordinary skill in the art.",
"The capacitor 80 may include the first capacitor plate 158 and the second capacitor plate 178 with the interlayer insulating layer 160 interposed therebetween.",
"The switching TFT 10 may function as a switching device that selects a pixel to perform light emission.",
"The switching gate electrode 152 may be coupled to the gate line 151.The switching source electrode 173 may be coupled to the data line 171.The switching drain electrode 174 may be spaced apart from the switching source electrode 173 and may be coupled to the first capacitor plate 158.The driving TFT 20 may apply a driving power to a pixel electrode 211 to enable a light emission layer 212 of the OLED 210 in a selected pixel to emit light.",
"The driving gate electrode 155 may be coupled to the first capacitor plate 158.The driving source electrode 176 and the second capacitor plate 178 may be coupled to the power line 172.The driving drain electrode 177 may be coupled to the pixel electrode 211 of the OLED 210 through a contact hole.",
"The switching TFT 10 may be operated by a gate voltage applied to the gate line 151, and may function to transmit a data voltage applied to the data line 171 to the driving TFT 20.A voltage equivalent to a differential between a common voltage applied to the driving TFT 20 from the power line 172 and the data voltage transmitted from the switching TFT 10 may be stored in the capacitor 80, and a current that corresponds to the voltage stored in the capacitor 80 may flow to the OLED 210 through the driving TFT 20 so that the OLED 210 may emit light.",
"On the interlayer insulating layer 160 of the non-display area 102, the common electrode line 230 may be located more inward than (e.g., inside) the sealing area 220.The common electrode line 230 may be made of substantially the same material (e.g., the same material) as the source electrodes 173 and 176 and the drain electrodes 174 and 177.The source electrodes 173 and 176, the drain electrodes 174 and 177, and the common electrode line 230 may be made of a metal material.",
"Examples of the metal material may include molybdenum (Mo), chromium (Cr), tungsten (W), aluminum (Al), and/or copper (Cu), and the metals may be used alone or in combination with each other.",
"The source electrodes 173 and 176, the drain electrodes 174 and 177, and the common electrode line 230 may have a single layer structure or a multilayer structure.",
"A planarization layer 180 may be located on the interlayer insulating layer 160 and may be configured to cover the data wire (171, 172, 173, 174, 176, 177, and 178).",
"The planarization layer 180 may serve to planarize a surface of the OLED 210 that is located on the planarization layer 180 by eliminating or reducing steps so as to increase light emission efficiency of the OLED 210.The planarization layer 180 may be made of at least one selected from a polyacrylate resin, an epoxy resin, a phenolic resin, a polyamide resin, a polyimide resin, an unsaturated polyester resin, a polyphenylenether resin, a polyphenylene sulfide resin, and benzocyclobutene (BCB).",
"Meanwhile, the protective layer 240 may coat at least part of an end portion of the common electrode line 230 adjacent to the sealing area 220.The protective layer 240 may be made of substantially the same material as the planarization layer 180 and may be formed by substantially the same process (e.g., the same process) of forming a pattern as the planarization layer 180.According to the first embodiment, the OLED display 100 includes at least two protective layers 240 that are spaced apart from each other (e.g., by a predetermined distance).",
"The protective layer 240 may be spaced apart from each other (e.g., by a predetermined distance) along a direction of the common electrode line 230.A length of the protective layer 240 and a distance between the protective layers 240 adjacent to each other are not strictly limited.",
"The length of the protective layer 240 may be measured along a direction in which the common electrode line 230 extends.",
"A width of the protective layer 240 may be measured in a direction perpendicular to the length of the protective layer 240.The distance between the protective layers 240 may refer to a distance between two neighboring protective layers 240.The length of the protective layer 240 and the distance between the protective layers 240 may be determined by considering workability of pattern and flowability of a layer-forming material along the protective layer 240.The protective layer 240 may have a length in a range of about 20 μm to about 2000 μm or greater.",
"The distance between the neighboring protective layers 240 may be in a range of about 20 μm to about 2000 μm or greater.",
"The width of the protective layer 240 may vary depending on the width of the common electrode line 230.The protective layer 240 may have a width in a range of about 20 μm to about 100 μm in consideration of the general width of the common electrode line 230, which is in a range of about 200 μm to about 300 μm.",
"The width of the protective layer 240 may also be greater than 100 μm.",
"The protective layer 240 may have substantially the same height (e.g., the same height) as the planarization layer 180; however, embodiments of the present invention are not limited thereto.",
"For example, the protective layer 240 may have a different height from the planarization layer 180.Further, the protective layer 240 may not extend to the sealing area 220.When the protective layer 240 extends to the sealing area 220, sealing properties may be reduced.",
"The pixel electrode 211 of the OLED 210 may be located on the planarization layer 180.The pixel electrode 211 may be coupled to the drain electrode 177 through a contact opening (e.g., hole) of the planarization layer 180.The pixel electrode 211 may be any one of the following types: a transmissive type, a transflective type, and a reflective type.",
"A transparent conductive oxide (TCO) may be used to form a transmissive electrode.",
"Examples of the TCO may include indium tin oxide (ITO), indium zinc oxide (IZO), zinc oxide (ZnO), and/or indium oxide (In2O3).",
"A metal such as magnesium (Mg), silver (Ag), gold (Au), calcium (Ca), lithium (Li), chromium (Cr), aluminum (Al), and copper (Cu), or alloys thereof may be used to form a transflective electrode and a reflective electrode.",
"In this case, the transflective electrode and the reflective electrode may have different thicknesses.",
"For example, the transflective electrode may have a thickness of about 200 nm or less and the reflective electrode may have a thickness of about 300 nm or greater.",
"As the thickness of the transflective electrode decreases, both light transmittance and resistance may increase.",
"Conversely, as the thickness of the transflective electrode increases, light transmittance may decrease.",
"The transflective electrode and the reflective electrode may have a multilayer structure that includes a metal layer made of a metal or an alloy thereof and a transparent conductive oxide layer laminated on the metal layer.",
"According to the kinds of materials included in the pixel electrode 211 and a common electrode 213, the OLED display 100 may be classified into three types: a top emission type; a bottom emission type; and a dual-emission type.",
"According to the first embodiment, the OLED display 100 is a top emission device.",
"That is, the OLED 210 may emit light in a direction of the common electrode 213 so as to display an image.",
"In order to improve light emission efficiency of the OLED display (e.g., top emission OLED display) 100, the pixel electrode 211 may be the reflective electrode.",
"Examples of the reflective electrode may include an electrode having a structure in which a transparent conductive oxide layer made of ITO is laminated on a metal layer made of silver (Ag).",
"The reflective electrode may also have a triple-layered structure in which silver (Ag), ITO, and silver (Ag) are sequentially laminated.",
"In the meantime, a common electrode coupling portion 231 may be located on the planarization layer 180 of the non-display area 102.The common electrode coupling portion 231 may extend from an upper portion of the planarization layer 180 to the common electrode line 230 so as to allow the common electrode line 230 to have an enlarged contact area.",
"The common electrode coupling portion 231 may have substantially the same composition (e.g., the same composition) and configuration as the pixel electrode 211 and also may be formed by substantially the same process as the pixel electrode 211.A pixel defining layer (PDL) 190 may be located on the planarization layer 180 so as to define a pixel area by exposing at least part of the pixel electrode 211.The pixel electrode 211 may be located in the pixel area defined by the PDL 190.In this case, the common electrode coupling portion 231 may be partially covered with the PDL 190 and may be partially exposed.",
"The PDL 190 may be made of a polyacrylate resin, a polyimide resin, and/or the like.",
"The light emission layer 212 may be located on the pixel electrode 211 in the pixel area and the common electrode 213 may be located on the PDL 190 and the light emission layer 212.The common electrode 213 may be in contact with the common electrode coupling portion 231, and thus it may be electrically connected to the common electrode line 230.The light emission layer 212 may include a low molecular weight organic material or a high molecular weight organic material.",
"At least one of a hole injection layer (HIL) and a hole transport layer (HTL) may be located between the pixel electrode 211 and the light emission layer 212, and at least one of an electron transport layer (ETL) and an electron injection layer (EIL) may be located between the light emission layer 212 and the common electrode 213.The common electrode 213 may be formed as a transflective layer.",
"The transflective layer used as the common electrode 213 may be made of at least one metal including magnesium (Mg), silver (Ag), calcium (Ca), lithium (Li), chromium (Cr), aluminum (Al) and copper (Cu).",
"The common electrode 213 may have a multilayer structure that includes a metal layer including at least one of magnesium (Mg), silver (Ag), calcium (Ca), lithium (Li), chromium (Cr), aluminum (Al) and copper (Cu) and a transparent conductive oxide (TCO) layer laminated on the metal layer.",
"As described above, the OLED 210 may include the pixel electrode 211, the light emission layer 212 on the pixel electrode 211, and the common electrode 213 on the light emission layer 212.Herein, the pixel electrode 211 may serve as an anode, which may be a hole injection electrode, and the common electrode 213 may serve as a cathode, which may be an electron injection electrode.",
"However, embodiments of the present invention are not limited thereto, and, for example, the pixel electrode 211 may be a cathode, and the common electrode 213 may be an anode according to a driving method of the OLED display 100.A sealing member 250 may be located on a sealing layer 225 so as to cover the driving TFT 20 and the OLED 210.A transparent insulating substrate made of glass or plastic may be utilized as the sealing member 250.The sealing member 250 may be spaced apart from the substrate 110 by the sealing layer 225 in the sealing area 220.The sealing layer 225 may be made of, for example, sealants or frits.",
"The first embodiment has been described hereinabove with reference to FIGS.",
"1 to 3; however, embodiments of the present invention are not limited thereto.",
"In one embodiment, a thin film encapsulation layer in which organic and inorganic layers are alternately laminated may be located on the OLED 210.In this embodiment, the sealing member 250 and the sealing layer 225 may be omitted.",
"Further, many different conductive lines may be located between and insulated by the sealing layer 225 and the substrate 110 so as to provide signals or power.",
"Hereinafter, another example of a pixel configuration of the display device according to the first embodiment may be described with reference to FIGS.",
"4 and 5.FIG.",
"4 is another example of an enlarged partial view of part “A” of FIG.",
"1 and shows a layout of another embodiment of a pixel included in the OLED display 100 according to the first embodiment.",
"FIG.",
"4 illustrates three pixels.",
"FIG.",
"5 is an equivalent circuit diagram of one pixel illustrated in FIG.",
"4.Each pixel illustrated in FIG.",
"4 may include a driving TFT T1, a switching TFT T2, one or more capacitors C1 and C2, a scan line SCAN[n], a data line DATA[m] (n and m being positive integers), a first power line ELVDD, a second power line ELVSS, and an OLED.",
"The pixel may also include further scan line SCAN[n−1], emission control line EM[n], initialization voltage line Vint, and TFTs T3, T4, T5, and T6 including a compensation TFT T3.Initialization voltage VIN transmitted through the initialization voltage line Vint may initialize the driving TFT T1.The switching TFT T2 may be switch-operated according to scan signals transmitted through the scan line SCAN[n].",
"For example, a gate electrode of the switching TFT T2 may be connected to the scan line SCAN[n].",
"A source electrode of the switching TFT T2 may be connected to the data line DATA[m].",
"The scan line SCAN[n] and the data line DATA[m] may be located in a direction intersecting each other.",
"A drain electrode of the switching TFT T2 may be electrically connected to a source electrode of the driving TFT T1 and the first power line ELVDD.",
"The driving TFT T1 may receive data signals according to a switching operation of the switching TFT T2 so as to transmit a driving current to the OLED.",
"A gate electrode of the driving TFT T1 may be connected to one electrode of the first capacitor C1.The other electrode of the first capacitor C1 may be connected to the first power line ELVDD.",
"The first power line ELVDD may be located parallel to the data line DATA[m].",
"A drain electrode of the driving TFT T1 may be electrically connected to an anode 211 of the OLED.",
"The second power line ELVSS may be connected to a cathode 213 of the OLED.",
"Therefore, the OLED may emit light by receiving the driving current from the driving TFT T1.The OLED may include the anode 211 that injects holes, the cathode 213 that injects electrons, and the light emission layer 212 that is located between the anode 211 and the cathode 213.Hereinafter, an operating process for the pixel illustrated in FIG.",
"4 will be described in more detail with reference to FIG.",
"5.First, while the TFT T4 is in the ON state according to scan signals transmitted through the scan line SCAN[n−1], the initialization voltage VIN may be supplied to an end of the first capacitor C1 and the gate electrode of the driving TFT T1.Next, the switching TFT T2 and the compensation TFT T3 may be turned on according to scan signals transmitted through the scan line SCAN[n].",
"While the switching TFT T2 and the compensation TFT T3 are in the ON state, a data voltage transmitted through the data line DATA[m] may be transmitted to the source electrode of the driving TFT T1, and the driving TFT T1 may be diode-connected.",
"Then, a voltage obtained by subtracting a threshold voltage of the driving TFT T1 from the data voltage may be applied to the gate electrode and the source electrode of the driving TFT T1.Next, the TFTs T5 and T6 may be turned on by emission control signals transmitted through the emission control line EM[n], and a voltage of the gate electrode of the driving TFT T1 may be boosted by an increase of the scan signals transmitted through the scan line SCAN[n].",
"While the two TFTs T5 and T6 are in the ON state, a voltage of the first power line ELVDD may be supplied to the source electrode of the driving TFT T1, and a driving current according to a gate-source voltage difference may flow to the driving TFT T1.The driving current may be transmitted to the anode of the OLED through the turned-on TFT T6.Hereinafter, a second embodiment of the present invention will be described with reference to FIG.",
"6, and in order to avoid repetitions, only differences between the first and second embodiments may be described without repeated descriptions of the components of the first embodiment.",
"According to the second embodiment, an OLED display 200 includes common electrode lines 230a and 230b on the left and right sides of the display area 101.The OLED display 200 may further include protective layers 240a and 240b configured to coat parts of the common electrode lines 230a and 230b, respectively.",
"In this case, the protective layers 240a and 240b may be as long as a length of one side of the display area 101 or may be longer than the length of one side of the display area 101.The length of the protective layers 240a and 240b may vary depending on the length of the display area 101.The protective layers 240a and 240b may cover one side-edge of the common electrode lines 230a and 230b.",
"Hereinafter, a third embodiment of the present invention will be described with reference to FIG.",
"7, and in order to avoid repetitions, only differences between the above-described embodiments and the third embodiment may be described without repeated descriptions of the components of the first embodiment.",
"FIG.",
"7 is a partial plan view illustrating an OLED display 300, according to the third embodiment of the present invention.",
"According to the third embodiment, an OLED display 300 includes a first protective layer 241 and a second protective layer 242 located in a zigzag form along the common electrode line 230.The protective layer 240 (241, 242) may coat at least part of an end portion of the common electrode line 230 adjacent to the sealing area 220.In the embodiment, the first protective layer 241 that coats an end portion of the common electrode line 230 adjacent to the sealing area 220 and the second protective layer 242 that does not coat the end portion of the common electrode line 230 may be alternately located on the common electrode line 230.The first and second protective layers 241 and 242 may have a length in a range of about 20 μm to about 2000 μm or greater respectively.",
"A distance between the first and second protective layers 241 and 242 may be in a range of about 20 μm to about 2000 μm or greater.",
"The first and second protective layers 241 and 242 may have a width in a range of about 20 μm to about 100 μm or the width may be greater than 100 μm respectively.",
"Hereinafter, a fourth embodiment of the present invention will be described with reference to FIG.",
"8, and in order to avoid repetitions, only differences between the above-described embodiments and the fourth embodiment may be described without repeated descriptions of the components of the first embodiment.",
"According to the fourth embodiment, an OLED display 400 includes a pixel defining layer (PDL) 190 that overlaps the common electrode coupling portion 231 and the common electrode line 230.The PDL 190 may have a contact opening (e.g., hole) 199 formed in a region corresponding to the common electrode coupling portion 231.The common electrode 213 and the common electrode coupling portion 231 may be coupled to each other through the contact opening (e.g., hole) 199, and thus power supplied to the common electrode line 230 may be transmitted to the common electrode 213.Hereinafter, a method for manufacturing the OLED display 100 according to the first embodiment will be described with reference to FIGS.",
"9A to 91.The method for manufacturing the OLED display 100 may include forming a display area 101 and a non-display area 102 on a substrate 110, and a common electrode line 230 and a protective layer 240 may be formed in the non-display area 102.As illustrated in FIG.",
"9A, a buffer layer 120 may be formed on the substrate 110 made of glass or plastic, a semiconductive layer 132 may be formed on the buffer layer 120, a gate insulating layer 140 may be formed on the semiconductive layer 132, a gate wire including a gate electrode 155 and a first capacitor plate 158 may be formed on the gate insulating layer 140, and an interlayer insulating layer-forming material may be applied to the gate wire so as to form a material layer 161 for an interlayer insulating layer.",
"Next, as illustrated in FIG.",
"9B, the material layer 161 for (e.g., making up) an interlayer insulating layer 160, and the gate insulating layer 140 may be partially removed to form a source contact opening (e.g., hole) 166 and a drain contact opening (e.g., hole) 167 that allows parts of source and drain areas of the semiconductive layer 132 to be exposed.",
"Next, as illustrated in FIG.",
"9C, a source electrode 176 and a drain electrode 177 that are coupled to the semiconductive layer 132 through the source contact opening (e.g., hole) 166 and the drain contact opening (e.g., hole) 167 may be formed, and a data line 171, a second capacitor plate 178, and a power line 172 may also be formed such that a data wire may be formed.",
"In addition, the common electrode line 230 may be formed on an interlayer insulating layer 160 of the non-display area 102.The common electrode line 230 may be formed of substantially the same material as the source and drain electrodes 176 and 177 by substantially the same process as the source and drain electrodes 176 and 177.Next, as illustrated in FIG.",
"9D, a planarization layer-forming material may be applied to the data wire and the common electrode line 230 so as to form a material layer 181 for a planarization layer, and then photolithography may be performed utilizing a pattern mask 810.In other words, the pattern mask 810 is utilized to perform photolithography on the material layer 181 to form the planarization layer.",
"Examples of the planarization layer-forming material may include silicon nitride (SiNx), silicon oxide (SiO2), or a photosensitive resin.",
"The pattern mask 810 may include a mask substrate 811 and a light-shielding pattern 812 on the mask substrate 811.An exposed part of the material layer 181 for a planarization layer may be removed in a developing process and a non-exposed part of the material layer 181 for a planarization layer may remain after the developing process.",
"In this case, according to the kind of the planarization layer-forming material, the exposed part may remain and the non-exposed part may be removed.",
"Next, as illustrated in FIG.",
"9E, a planarization layer 180 having a pixel contact opening (e.g., hole) 182 and the protective layer 240 may be formed through developing and curing processes.",
"The curing process may include thermal curing or photocuring.",
"The planarization layer 180 and the protective layer 240 may become stable layers through the curing process.",
"The planarization layer 180 may cover an end portion of the common electrode line 230, which is located towards the display area 101, and the protective layer 240 may cover an end portion of the common electrode line 230, which is located towards the sealing area 220.As illustrated in FIG.",
"9F, a pixel electrode 211 and a common electrode coupling portion 231 coupled to the common electrode line 230 may be formed on the planarization layer 180.The pixel electrode 211 may be coupled to the drain electrode 177 of a driving TFT 20 through the pixel contact opening (e.g., hole).",
"The common electrode coupling portion 231 may be formed of substantially the same material as the pixel electrode 211 by substantially the same process as the pixel electrode 211.In one embodiment, the pixel electrode 211 and the common electrode coupling portion 231 may be formed by a method including forming a conductor material layer by forming a metal layer on the planarization layer 180 and the common electrode line 230, and laminating a transparent conductive oxide layer on the metal layer, and patterning the conductor material layer.",
"Next, as illustrated in FIG.",
"9G, a photosensitive organic material may be applied to the entire surfaces of the pixel electrode 211, the common electrode coupling portion 231, the common electrode line 230, and the exposed planarization layer 180 so as to form an organic material layer 191 for a pixel defining layer, and then photolithography may be performed utilizing a pattern mask 820.In other words, the pattern mask 820 is utilized to perform photolithography on the material layer 191 to form the pixel defining layer.",
"Examples of the photosensitive organic material may include polyacrylate resins and polyimide resins.",
"In order to form the organic material layer 191 for a pixel defining layer, a slit nozzle may be used to apply the photosensitive organic material such as polyacrylate resins and polyimide resins.",
"The protective layer 240 may be formed on the common electrode line 230, and thus the photosensitive organic material may not be gathered in an end portion of the common electrode line 230 and may easily flow out.",
"As a result, the organic material layer 191 for a pixel defining layer may be formed in a uniform way.",
"The pattern mask 820 may include a mask substrate 821 and a light-shielding pattern 822 on the mask substrate 821.An exposed part of the organic material layer 191 for a pixel defining layer may be removed in a developing process and a non-exposed part thereof may still remain after the developing process.",
"Next, as illustrated in FIG.",
"9H, a pixel defining layer (PDL) 190 having an opening 195 may be formed through the developing process.",
"The PDL 190 may become a stable layer by thermal curing or photocuring.",
"The opening 195 of the PDL 190, which is formed on the pixel electrode 211, may correspond to a pixel area.",
"Further, the common electrode coupling portion 231 may be exposed partially.",
"Next, as illustrated in FIG.",
"9I, a light emission layer 212 may be formed on the pixel electrode 211 that is exposed through the opening 195 of the PDL 190, and a common electrode 213 may be formed on the light emission layer 212 and the PDL 190.The common electrode 213 may be in contact with the common electrode coupling portion 231.Thereafter, a sealing member 250 may be formed on the common electrode 213 such that the OLED display 100 may be manufactured as illustrated in FIG.",
"3.Hereinafter, reasons for forming the protective layer 240 may be described with reference to FIGS.",
"10A and 10B.",
"FIG.",
"10A is a cross-sectional view illustrating the common electrode line 230 on the interlayer insulating layer 160.The common electrode line 230 formed with the data wire may have a positive tapered cross-section as illustrated in FIG.",
"10A.",
"The common electrode line 230 may be formed of a metal and the planarization layer 180 may be formed only on one end portion (left side) of the common electrode line 230 (see FIG.",
"9B).",
"Meanwhile, developing may be performed in the process of forming the planarization layer 180 on the interlayer insulating layer 160 after the common electrode line 230 is formed, and developing and etching may be performed in the process of forming the pixel electrode 211 and the common electrode coupling portion 231 on the planarization layer 180.While the developing and etching are repeatedly performed, the exposed end portion (right side) of the common electrode line 230 is likely to be damaged.",
"As a result, the exposed end portion of the common electrode line 230 may have an inverse-tapered shape 239 as illustrated in FIG.",
"10B.",
"Further, in order to form the PDL 190, the photosensitive organic material may be applied to the pixel electrode 211 and the common electrode line 230.In this case, the photosensitive organic material may not be gathered in a region and may flow uniformly so as to form the smooth PDL 190.As illustrated in FIG.",
"11, in a process of manufacturing a plurality of display devices 100 utilizing one mother glass 11, the photosensitive organic material applied to the entire mother glass 11 may flow uniformly on the mother glass 11.In the case where an end portion of the common electrode line 230 has a positive tapered shape as illustrated in FIG.",
"10A, the photosensitive organic material may easily flow down a slope of the end portion of the common electrode line 230.However, when the end portion of the common electrode line 230 is damaged and thus, has an inverse-tapered shape 239 as illustrated in FIG.",
"10B, the photosensitive organic material may not easily flow down the damaged end portion of the common electrode line 230 and may be concentrated in the end portion of the common electrode line 230.Therefore, a step may occur in the organic material layer 191 for a pixel defining layer.",
"FIG.",
"12 is a cross-sectional view illustrating application of the organic material for a pixel defining layer.",
"As illustrated in FIG.",
"12, when a photosensitive organic material supplied from a nozzle 910 fails to easily flow down an end portion of the common electrode line 230, the photosensitive organic material may be accumulated in the end portion of the common electrode line 230 and the accumulated photosensitive organic material may reversely flow towards the display area 101 as marked with arrows.",
"As described above, when the photosensitive organic material is accumulated in the end portion of the common electrode line 230, a height of the photosensitive organic material, which, in some examples may be h1, may become h2 or h3.Until the height of the photosensitive organic material becomes h2 or h3, the photosensitive organic material accumulated in the end portion of the common electrode line 230 may not flow to an adjacent region, and then a step may occur in the organic material layer for a pixel defining layer.",
"Therefore, the pixel defining layer may fail to be formed to have a uniform layer thickness.",
"Accordingly, the OLED display 100 may have poor quality in light emission.",
"According to some embodiments of the present invention, when an end portion of the common electrode line 230 is coated with the protective layer 240, a photosensitive organic material may easily flow through the protective layer 240, and thus, it may be accumulated to have a suitable height in the end portion of the common electrode line 230.Consequently, a flat or smooth layer may be obtained.",
"From the foregoing, it will be appreciated that various embodiments of the present disclosure have been described herein for purposes of illustration, and that various modifications may be made without departing from the scope and spirit of the present disclosure.",
"Accordingly, the various embodiments disclosed herein are not intended to be limiting, with the true scope and spirit being indicated by the following claims, and equivalents thereof."
]
] |
Patent_15871075
|
[
[
"WINDING DEVICE",
"The present invention discloses a winding device includes a screen, a winding shaft for winding the screen, a housing portion for housing the winding shaft, and a fiber assembly that supports rotatably an end portion of the winding shaft.",
"The present invention also discloses a winding device includes a screen, a winding shaft for winding the screen, the winding shaft having an opening at an end portion, a housing portion for housing the winding shaft, a fiber assembly that is in the opening of the winding shaft, the fiber assembly having a hole along a center line direction of the winding shaft, and a support shaft that is in the hole of the fiber assembly, the support shaft supporting the fiber assembly rotatably."
],
[
"1.A winding device, comprising: a screen; a winding shaft for winding the screen; a housing portion for housing the winding shaft; and a fiber assembly that supports rotatably an end portion of the winding shaft.",
"2.The winding device according to claim 1, wherein the winding shaft includes: a body portion to which one end of the screen is fixed; and a projecting portion that protrudes in a center line direction of the winding shaft from an end face of the body portion in the center line direction, the projecting portion being supported rotatably by the fiber assembly, and the winding device further comprising: a retention structure that keeps the fiber assembly apart from the end face of the body portion.",
"3.The winding device according to claim 2, wherein the retention structure includes a wall portion arranged between the end face of the body portion and the fiber assembly in the center line direction, the wall portion having a through hole that allows the projecting portion of the winding shaft through.",
"4.The winding device according to claim 2, wherein the retention structure includes an enlarged portion on the projecting portion, the enlarged portion being arranged between the end face of the body portion and the fiber assembly in the center line direction.",
"5.The winding device according to claim 1, further comprising: a protrusion that protrudes toward the fiber assembly side from an end face of the fiber assembly in a center line direction of the winding shaft.",
"6.The winding device according to claim 5, wherein in the end face of the fiber assembly in the center line direction, a first area where the protrusion protrudes toward the fiber assembly side on a side of drawing out the screen from a center line of the winding shaft is larger than a second area where the protrusion protrudes toward the fiber assembly side on an opposite side to the side of drawing out the screen from the center line of the winding shaft.",
"7.The winding device according to claim 1, further comprising: a structure that prevents the fiber assembly from shifting outward in a center line direction of the winding shaft from the winding shaft.",
"8.A winding device, comprising: a screen; a winding shaft for winding the screen, the winding shaft having an opening at an end portion; a housing portion for housing the winding shaft; a fiber assembly that is in the opening of the winding shaft, the fiber assembly having a hole along a center line direction of the winding shaft; and a support shaft that is in the hole of the fiber assembly, the support shaft supporting the fiber assembly rotatably."
],
[
"<SOH> BACKGROUND OF THE INVENTION <EOH>"
],
[
"<SOH> BRIEF SUMMARY OF THE INVENTION <EOH>The present invention discloses a winding device capable of reducing the abnormal noise when vibration is input or when the winding shaft is rotated.",
"One aspect of the present invention provides a winding device, comprising: a screen; a winding shaft for winding the screen; a housing portion for housing the winding shaft; and a fiber assembly that supports rotatably an end portion of the winding shaft.",
"Another aspect of the present invention provides a winding device, comprising: a screen; a winding shaft for winding the screen, the winding shaft having an opening at an end portion; a housing portion for housing the winding shaft; a fiber assembly that is in the opening of the winding shaft, the fiber assembly having a hole along a center line direction of the winding shaft; and a support shaft that is in the hole of the fiber assembly, the support shaft supporting the fiber assembly rotatably."
],
[
"CROSS-REFERENCES TO RELATED APPLICATIONS This Application claims the benefit of priority and is a Continuation application of the prior International Patent Application No.",
"PCT/JP2016/068204, with an international filing date of Jun.",
"20, 2016, which designated the United States, and is related to the Japanese Patent Application No.",
"2015-148082, filed Jul.",
"27, 2015, the entire disclosures of all applications are expressly incorporated by reference in their entirety herein.",
"BACKGROUND OF THE INVENTION 1.Field of the Invention The present invention relates to a winding device installed in a vehicle cabin of an automobile or the like.",
"2.Description of Related Art A vehicle door, for example, is equipped with a sunshade device for blocking sunlight for the purpose of preventing dazzling and for protecting privacy in the vehicle.",
"In the sunshade device for the vehicle door, in many cases, a shading screen is wound and housed inside a door body when not in use.",
"When in use, the screen is drawn out upward along a window glass and the screen is held at a use position to cover the window glass by, for example, engaging a tip portion of the screen with an engagement portion of the door side.",
"The sunshade device for the vehicle door has a screen, a winding shaft and a case made of resin, for example.",
"The winding shaft is formed by inserting shaft members made of resin into both ends of a cylindrical body made of aluminum, for example.",
"The shaft member is rotatably supported by a wall portion (rotation support portion) of the case, for example.",
"Japanese Unexamined Patent Application Publication No.",
"2015-42505 discloses that the shaft member is rotatably supported by the wall portion of the case via a cap made of resin.",
"When using low-priced synthetic resins such as polypropylene for the case formed by the resin material, since the linear expansion coefficient of the case is larger than the linear expansion coefficient of alminium, it is necessary to consider variation in dimension of the case caused by change in temperature.",
"When a clearance is formed between the shaft member of the winding shaft and the rotation support portion of the case as a result of considering the variation in the dimension, abnormal noise may occur when vibration is applied to the winding device or when the winding shaft is rotated.",
"If a special material is used for the case to reduce the linear expansion coefficient, the resin material for forming the case becomes expensive.",
"Note that the above described problems can also occur in a tonneau cover device and other winding devices other than the sunshade device.",
"BRIEF SUMMARY OF THE INVENTION The present invention discloses a winding device capable of reducing the abnormal noise when vibration is input or when the winding shaft is rotated.",
"One aspect of the present invention provides a winding device, comprising: a screen; a winding shaft for winding the screen; a housing portion for housing the winding shaft; and a fiber assembly that supports rotatably an end portion of the winding shaft.",
"Another aspect of the present invention provides a winding device, comprising: a screen; a winding shaft for winding the screen, the winding shaft having an opening at an end portion; a housing portion for housing the winding shaft; a fiber assembly that is in the opening of the winding shaft, the fiber assembly having a hole along a center line direction of the winding shaft; and a support shaft that is in the hole of the fiber assembly, the support shaft supporting the fiber assembly rotatably.",
"BRIEF DESCRIPTION OF THE DRAWINGS FIG.",
"1 is a perspective view schematically showing an example of a vehicle door to which a winding device is assembled, viewed from a vehicle cabin side.",
"FIG.",
"2 is a transverse cross-sectional view schematically showing an example of the winding device.",
"FIG.",
"3A is a plan view schematically showing an example of the winding device.",
"FIG.",
"3B is a side view schematically showing an example of a housing portion in which the winding shaft is housed.",
"FIG.",
"4 is a vertical cross-sectional view schematically showing an example of the winding device.",
"FIG.",
"5 is an exploded view schematically showing an example of the winding device.",
"FIG.",
"6A is a drawing schematically showing an arrangement example of protrusions with respect to a lid portion.",
"FIGS.",
"6B to 6D are drawings schematically showing arrangement examples of the protrusions with respect to a fiber assembly.",
"FIG.",
"7A is a drawing schematically showing an example of the fiber assembly before a durability test.",
"FIGS.",
"7B and 7C are drawings schematically showing examples of the fiber assembly after the durability test.",
"FIG.",
"8 is a drawing schematically exemplifying an action of preventing slack of the screen.",
"FIG.",
"9 is a vertical cross-sectional view schematically showing an example of the winding device having a wall portion on which a protrusion is formed.",
"FIG.",
"10 is a vertical cross-sectional view schematically showing an example of the winding device having a separately formed lid.",
"FIG.",
"11 is an exploded view schematically showing an example of the winding device having the separately formed lid.",
"FIG.",
"12 is a vertical cross-sectional view schematically showing an example of the winding device having a prevention structure formed on a trim.",
"FIG.",
"13 is a vertical cross-sectional view schematically showing an example of the winding device having a projecting portion on which an enlarged portion is formed.",
"FIG.",
"14 is a vertical cross-sectional view schematically showing an example of the winding device having a fiber assembly inserted into an opening of the winding shaft.",
"FIG.",
"15 is an exploded view schematically showing an example of the winding device having the fiber assembly inserted into the opening of the winding shaft.",
"FIG.",
"16 is a vertical cross-sectional view schematically showing an example of the winding device where a protrusion for pressing an end face of the fiber assembly along an outer periphery of the fiber assembly is formed on the lid portion.",
"FIG.",
"17 is an exploded view schematically showing an example of the winding device where the protrusion for pressing the end face of the fiber assembly along the outer periphery of the fiber assembly is formed on the lid portion.",
"FIG.",
"18 is a vertical cross-sectional view schematically showing an example of the winding device.",
"FIG.",
"19 is a vertical cross-sectional view schematically showing an example where the fiber assembly is in contact with the end face of a body portion of the winding shaft.",
"DETAILED DESCRIPTION OF THE INVENTION Hereafter, embodiments of the present invention will be explained.",
"Of course, the below-described embodiments merely exemplify the present invention.",
"All features disclosed in the embodiments are not necessarily essential for the present invention to solve the problems.",
"(1) Outline of Present Technology First, with reference to FIGS.",
"1 to 19, an outline of the technology included in the present invention will be explained.",
"Note that FIGS.",
"1 to 19 are figures for schematically showing examples and therefore magnification ratios of each direction shown in the figures may be different and each of the figures may not fit together.",
"Embodiment 1 A winding device 1 concerning one embodiment of the present technology includes a screen 2, a winding shaft 3 for winding the screen 2, a housing portion 4 for housing the winding shaft 3, and a fiber assembly 5 that supports rotatably an end portion (e.g., a projecting portion 3b) of the winding shaft 3.Since the end portion (3b) of the winding shaft 3 is supported rotatably by the fiber assembly 5, vibration applied to the winding device 1 is absorbed by the fiber assembly 5 even in consideration of a variation in the dimension of the housing portion 4 due to changes in temperature.",
"Thus, abnormal noise is suppressed.",
"Accordingly, the present embodiment can suppress generation of abnormal noise when vibration is input or when the winding shaft is rotated.",
"Here, the screen is a concept including a shade, a blind, a sheet and the like.",
"The screen can be any screen as long as it blocks at least a part of transmitted light.",
"The screen is not limited to the purpose of sun shading.",
"The screen includes a screen having a mesh and a sheet without having a mesh, for example.",
"Specifically, the screen includes a sunshade, a tonneau cover and the like.",
"The fiber assembly means an object in which fibers assemble.",
"The fiber assembly can be formed only by fibers although the fiber assembly can include materials other than fibers.",
"Embodiment 2 The winding shaft 3 can include a body portion 3a to which one end (e.g., a base edge 2b) of the screen 2 is fixed, and a projecting portion 3b that protrudes in a center line direction D1 of the winding shaft 3 from an end face 3a1 of the body portion 3a in the center line direction D1, the projecting portion 3b being supported rotatably by the fiber assembly 5.Here, the end face in the center line direction means the face located at an end in the center line direction and crossing the center line direction (e.g., orthogonal face).",
"The projecting portion means a projected portion.",
"The projecting portion includes a protruded portion, an expanded (expandingly projected) portion and the like.",
"The winding device 1 can further include a retention structure 6 that keeps the fiber assembly 5 apart from the end face 3a1 of the body portion 3a.",
"Since the fiber assembly 5 that supports rotatably the projecting portion 3b of the winding shaft 3 is kept apart from the end face 3a1 of the body portion 3a of the winding shaft, the present embodiment can suppress rotational resistance caused when the fiber assembly is in contact with the end face of the body portion of the winding shaft.",
"Note that the winding device without the projecting portion is also included in the present technology.",
"Embodiment 3 The retention structure 6 can include a wall portion 61 arranged between the end face 3a1 of the body portion 3a and the fiber assembly 5 in the center line direction D1, the wall portion 61 having a formed through hole 62 that allows the projecting portion 3b of the winding shaft 3 through.",
"The above described embodiment can prevent the rotational resistance caused when the fiber assembly is in contact with the end face of the body portion of the winding shaft by a simple structure.",
"Even if the through hole on the wall portion is large enough to allow the winding shaft through, the wall portion is arranged between the end face of the body portion and the fiber assembly in the center line direction.",
"The wall portion 61 can be formed either on the housing portion 4 or on the part other than the housing portion 4.Embodiment 4 As exemplified in FIG.",
"13, the retention structure 6 can include a formed enlarged portion 65 on the projecting portion 3b, the enlarged portion 65 being arranged between the end face 3a1 of the body portion 3a and the fiber assembly 5 in the center line direction D1.The above described embodiment can prevent the rotational resistance caused when the fiber assembly touches the end face of the body portion of the winding shaft by a simple structure, the formed enlarged portion on the projecting portion.",
"The enlarged portion includes a tapered shape in which the diameter is gradually increased from the fiber assembly to the end face of the body portion, for example.",
"Embodiment 5 The winding device 1 can further include a structure (e.g., prevention structure 8) that prevents the fiber assembly 5 from shifting from the winding shaft 3 toward an outside D1o in the center line direction D1 of the winding shaft 3.The above described embodiment can prevent the fiber assembly 5 from being displaced from the winding shaft 3 toward the outside D1o in the center line direction D1.The above described structure (8) includes a lid portion (e.g., a lid portion 80 shown in FIG.",
"4) connected to a fiber assembly housing portion for housing the fiber assembly by a hinge structure, and a separately formed lid (e.g., a lid 83 shown in FIG.",
"10 and a cap 180 shown in FIG.",
"16) fitted to the fiber assembly housing portion, for example.",
"Note that the winding device without the structure (8) is also included in the present technology.",
"Embodiment 6 The winding device 1 can include a protrusion 7 that protrudes toward the fiber assembly 5 side from an end face 5a of the fiber assembly 5 in the center line direction D1 of the winding shaft 3.The protrusion includes an expanded portion, a protruded portion and the like.",
"The above described embodiment can further increase the durability since rigidity of the fiber assembly 5 is increased.",
"The protrusion 7 can be formed on the above described structure (8), the wall portion 61 on which the through hole 62 that allows the projecting portion 3b of the winding shaft 3 through is formed, or other portions.",
"Embodiment 7 As exemplified in FIGS.",
"6B and 6C, in the end face 5a of the fiber assembly 5 in the center line direction D1, an area S1 where the protrusion 7 protrudes toward the fiber assembly 5 side on a side SD1 of drawing out the screen 2 from a center line AX1 of the winding shaft 3 can be larger than an area S2 where the protrusion 7 protrudes toward the fiber assembly 5 side on an opposite side SD2 to the side SD1 of drawing out the screen 2 from the center line AX1 of the winding shaft 3.Note that the side of drawing out the screen is also referred to as a screen-drawing-out side and the opposite side to the side of drawing out the screen is also referred to as a screen-drawing-in side.",
"When the screen 2 is drawn out from the housing portion 4 repeatedly, the fiber assembly 5 tends to be more easily collapsed at the portion of the screen-drawing-out side SD1 than the portion of the screen-drawing-in side SD2.The above described embodiment can provide an easily assembled winding device while maintaining durability since the protrusion 7 protrudes toward the fiber assembly 5 at the screen-drawing-out side SD1, thus the rigidity of the fiber assembly 5 is increased at the portion of the screen-drawing-out side SD1.Note that the winding device without the protrusion is also included in the present technology.",
"Embodiment 8 As exemplified in FIGS.",
"14 and 15, a winding device 1 concerning another embodiment of the present technology includes a screen 2, a winding shaft 3 for winding the screen 2, the winding shaft 3 having an opening 3d at an end portion, a housing portion 4 for housing the winding shaft 3, a fiber assembly 5 that is in the opening 3d of the winding shaft 3, the fiber assembly 5 having a hole 51 along a center line direction D1 of the winding shaft 3, and a support shaft 9 that is in the hole 51 of the fiber assembly 5, the support shaft 9 supporting the fiber assembly 5 rotatably.",
"Since the fiber assembly 5 in the opening 3d of the winding shaft 3 is supported rotatably by the support shaft 9, vibration applied to the winding device 1 is absorbed by the fiber assembly 5 even in consideration of a variation in the dimension of the housing portion 4 due to changes in temperature.",
"Thus, abnormal noise is suppressed.",
"Accordingly, also the present embodiment can suppress generation of abnormal noise when vibration is input or when the winding shaft is rotated.",
"(2) Concrete Example of Winding Device FIG.",
"1 shows an example in which the winding device 1 is used as a sunshade device of a side door 802 of an automobile 800.In the figure, the winding device 1 is shown by breaking away an upper portion of a door trim 805.The automobile 800 shown in FIG.",
"1 is a road vehicle designed and equipped for being used on a road.",
"In addition, the automobile 800 is a passenger car having a vehicle cabin C1 formed around front sheets and rear sheets.",
"A door 802 and a pillar 803 are arranged at a side face portion of the vehicle cabin C1.The winding device 1 is assembled with the door 802 as a sunshade device.",
"The winding device includes the devices called a shade device and a blind device.",
"The winding device 1 shown in FIG.",
"1 is installed in an upper edge of the door trim 805 as an interior material of the side door.",
"The screen 2 can be drawn out from the winding device 1.The door 802 is equipped with a door panel 804, a door trim 805, a door window 806, a hook portion 810, and so on.",
"The door panel 804 is a kind of a vehicle body panel made of metal such as a steel sheet.",
"The trim 805 is an interior material attached to the vehicle cabin side of the panel 804.For the trim 805, a molded article formed by molding a resin material such as a thermoplastic resin by using injection molding or the like, and a resin material in which a skin material, such as a non-woven fabric, a woven fabric and a knitted fabric, is laminated on an interior base material can be used, for example.",
"The trim 805 shown in FIG.",
"1 is equipped with an armrest 807 having a shape enabling a passenger to rest his/her arms for maintaining a comfortable posture.",
"The winding device 1 is arranged on a back side of the trim 805 at a position upper than the armrest 807.The hook portion 810 is fixed to the panel 804 at a position upper than the window 806.In FIG.",
"1, the winding device 1 in which the screen 2 is wound around (housed in) the winding shaft 3 is schematically exemplified.",
"FIG.",
"1 also exemplifies a state that the screen 2 is drawn out upward by a two-dot chain line.",
"FIG.",
"2 is a vertical cross-sectional view schematically exemplifying the winding device 1.FIG.",
"2 shows the vertical cross section passing through the operation portion 23.FIG.",
"3A is a plan view schematically exemplifying the winding device 1.FIG.",
"3B is a side view schematically exemplifying a case 40 (example of the housing portion 4) in which the winding shaft 3 is installed.",
"FIG.",
"3B also shows a cross-sectional view showing a main part of the winding shaft 3 in an enlarged state.",
"FIG.",
"4 is a vertical cross-sectional view schematically exemplifying a main part of the winding device 1.FIG.",
"4 also shows a drawing of a wall portion 61 (example of the retention structure 6) of the case 40 viewed from the inside D1i in the center line direction D1 of the winding shaft 3 and a drawing of a lid portion 80 (example of the prevention structure 8) viewed from the outside D1o in the center line direction D1 of the winding shaft 3.In FIG.",
"4, the case 40, the trim 805 and a felt 50 (example of the fiber assembly 5) are shown by cross section.",
"Note that “inside in the center line direction” and “outside in the center line direction” are not the terms for indicating the direction but the terms for indicating the location.",
"Accordingly, for example, “toward the outside in the center line direction” means to be directed to a predetermined location located at the outside of a predetermined reference point.",
"Thus, the direction displaced from the center line direction D1 is also included.",
"FIG.",
"5 is an exploded view schematically exemplifying a main part of the winding device 1.FIG.",
"5 also shows a drawing of a cylindrical body 31 viewed from the outside D1o in the center line direction, a drawing of an end member 32 viewed from the inside D1i in the center line direction, a drawing of the end member 32 viewed from the outside D1o in the center line direction, and a drawing of the felt 50 viewed from the inside D1i in the center line direction.",
"Note that a reference sign D21 indicates a housing direction of the screen 2, a reference sign D22 indicates a drawing direction of the screen 2, a reference sign AX1 indicates a center line of the winding shaft 3, a reference sign D11 indicates a case direction directed from the trim 805 to the case 40, a reference sign D12 indicates a trim direction directed from the case 40 to the trim 805, and a reference sign DR1 indicates a winding direction of the screen 2.The housing direction D21 and the drawing direction D22 are opposite to each other.",
"For example, the housing direction D21 is approximately downward and the drawing direction D22 is approximately upward.",
"The case direction D11and the trim direction D12 are opposite to each other.",
"For example, the case direction D11 is an approximately outward direction of the width direction of the automobile 800 and the trim direction D12 is an approximately inward direction of the width direction of the automobile 800.The screen 2 is also called as a shielding sheet or a blind sheet.",
"The screen 2 blocks at least a part of transmitted light.",
"A screen body 2a of the screen 2 is made of a thin material having flexibility to be drawn out from a predetermined winding position P11 to a predetermined drawing position P12.The screen body 2a can be wound from the drawing position P12 to the winding position P11.The screen body can be a material having a mesh or a sheet-like material without having a mesh.",
"The screen body can be a cloth such as polyester woven fabric, leather using resin material, a sheet formed by molding resin material and the like.",
"The screen body can be a translucent sheet and a transparent sheet capable of blocking ultraviolet rays, for example.",
"The transmitted light includes ultraviolet rays and the like.",
"The screen body for the sunshade device is formed, for example, by cutting a soft material having a light-shielding property of approximately 50 to 90% and having flexibility into a predetermined shape.",
"The screen body is drawn out upward from the half case 40 and covers a vehicle door window from inside the vehicle cabin.",
"The winding device 1 blocks sunlight to protect occupants from dazzling, and reduces visibility from outside of the vehicle for protecting privacy and protecting against crime during parking.",
"The base edge 2b of the screen body 2a shown in FIG.",
"2 is adhered to an external surface of the cylindrical body 31 (main part of the body portion 3a) of the winding shaft 3 by a double-sided tape, for example.",
"Thus, the cylindrical body 31 fastens a base edge (one end) 2b of the screen 2.A drawing end 20 of the screen 2 shown in FIG.",
"3 has a bag-like portion and a core material 22.The core material 22, which passes through a resin-made operation portion 23, is inserted into the bag-like portion 21.The operation portion 23 is lever-like, and the screen body 2a can be easily drawn out from the housing portion 4 by pinching the operation portion 23.When the screen body 2a is drawn out, the drawn-out state of the screen body 2a can be maintained by inserting the hook portion 810 of the door side into an engagement hole 21d and hooking the drawing end 20 on the hook portion 810.The winding shaft 3 shown in FIG.",
"3B, FIG.",
"5 and other figures has a cylindrical body 31, an end member 32 and a bearing portion 38 of a wall portion 42 side.",
"The winding shaft 3 is equipped with a spring 36 (biasing mechanism 35) and can wind the screen body 2a by a force applied by the spring 36.The cylindrical body 31 is arranged in the case 40 so that the cylindrical body 31 is rotatable around the center line AX1.The base edge 2b of the screen body 2a is fastened to the cylindrical body 31 at an outer peripheral surface 31o.",
"The cylindrical body 31 may have a tubular shape such as a cylindrical shape or a bar shape such as a columnar shape.",
"The cylindrical body 31 shown in FIG.",
"3B and other figures is a long tubular member having openings at both ends.",
"A hooking portion 31c of the spring 36 is inserted in a hollow portion 31a formed along the center line AX1.The above described cylindrical body 31 is also called as a barrel or the like.",
"The end member 32 shown in FIG.",
"4 is attached to one end of the cylindrical body 31, and the bearing portion 38 is attached to the other end of the cylindrical body 31.As shown in FIG.",
"5, an inner peripheral portion 31i of the cylindrical body 31 has a noncircular cross section in the center line direction D1, and a plurality of grooves 31d is formed on the inner peripheral portion 31i along the center line direction D1.Although a metal worked article such as an extrusion molded article of aluminum is suitable for the cylindrical body 31, a molded article of synthetic resin such as an extrusion molded article of thermoplastic resin can be also used, for example.",
"The size of the cylindrical body formed in a cylindrical shape is not particularly limited.",
"For example, an inner diameter can be approximately 4 to 20 mm, and an outer diameter can be approximately 6 to 30 mm.",
"The end member 32 shown in FIG.",
"5 and other figures has a base portion 33 (a part of the body portion 3a), an inner engagement portion 34 (a part of the body portion 3a) and a projecting portion 3b that protrudes toward the outside D1o in the center line direction from the end face 3a1 of the outside D1o in the center line direction of the base portion 33.An outer peripheral surface 33o of the base portion 33 is fitted to the outer peripheral surface 31o of the cylindrical body 31.The inner engagement portion 34 is fitted in an opening 31b formed on the end portion of the cylindrical body 31.Accordingly, the cylindrical body 31, the inner engagement portion 34 and the base portion 33 are concrete examples of the body portion of the winding shaft.",
"In addition, the projecting portion 3b is a concrete example of the end portion of the winding shaft.",
"The inner engagement portion 34 shown in FIG.",
"5 is projected toward the inside D1i in the center line direction from the end face of the base portion 33 in the inside D1i in the center line direction.",
"The outer peripheral portion of the inner engagement portion 34 has a noncircular cross section in the center line direction D1, and a plurality of projected ridges 34d is formed on the outer peripheral portion along the center line direction D1.The cross-sectional shape of the outer peripheral portion of the inner engagement portion 34 in the center line direction D1 is fitted to the cross-sectional shape of the inner peripheral portion 31i of the cylindrical body 31.Since each of the projected ridges 34d of the inner engagement portion 34 projected toward the inside D1i in the center line direction from the base portion 33 enters in the grooves 31d of the cylindrical body 31, the end member 32 is attached to the cylindrical body 31 so as not to rotate relative to the cylindrical body 31.Thus, the end member 32 can be rotated around the center line AX1 together with the cylindrical body 31.The projecting portion 3b shown in FIG.",
"5 and other figures has a smaller outer diameter than an outer diameter of the base portion 33.The projecting portion 3b is inserted into the through hole 51 of the felt 50 which is the bearing portion of the wall portion 61 side.",
"Thus, the projecting portion 3b is rotatably supported by the felt 50.The projecting portion 3b may have a bar shape such as a columnar shape or a tubular shape such as a cylindrical shape.",
"For the end member 32, a molded article such as an injection molded article of synthetic resin can be used, for example.",
"For the synthetic resin, thermoplastics resins such as polyamide, polypropylene (PP), polyacetal (POM) and polybutylene terephthalate (PBT) can be used, for example.",
"Additives such as a reinforcing fiber and the like can be added to the above described resins.",
"The bearing portion 38 shown in FIG.",
"3B is arranged on the end portion opposite to the end member 32 in the long winding shaft 3.The bearing portion 38 has a projecting portion 3c fixed to the wall portion 42 which is opposite to the wall portion 61 in the long case 40.The cylindrical body 31 is fitted on the outside of the bearing portion 38.One end of the spring 36, which is a coil spring, is fixed to a fixing portion of the bearing portion 38.The other end of the spring 36 is fixed to a hooking portion 31c.",
"The hooking portion 31c is inserted into the cylindrical body 31 so as not to rotate relative to the cylindrical body 31.Thus, the hooking portion 31c can be rotated around the center line AX1 together with the cylindrical body 31.The spring 36 applies a force toward the housing direction D21 to the screen 2.In general, the winding shaft 3 having the biasing mechanism 35 is attached to the case 40 so as to apply a force to the screen 2 in the winding direction DR1 even when the screen 2 is housed in the case 40.Note that the biasing mechanism can be attached to a portion other than an inner peripheral side of the cylindrical body 31.For example, the biasing mechanism can be attached to an outer peripheral side of the cylindrical body or an outer side of the end portion in the longitudinal direction of the cylindrical body.",
"The biasing mechanism can be unitized.",
"The biasing mechanism can be an inner spring unit inserted into the cylindrical body or an outer spring unit provided outside the cylindrical body as exemplified in Japanese Unexamined Patent Application Publication No.",
"2015-42505.The biasing mechanism can be a spiral spring or an elastic member formed of elastomer or a rubber, for example.",
"Furthermore, the present technology also includes an electric type in which the screen is drawn out and wound by driving a motor or a case of manually winding the screen without having the biasing mechanism on the winding shaft, for example.",
"The half case 40 shown in FIGS.",
"2, 3A, 3B and other figures has a pair of wall portions 61, 42 formed on both end portions in the center line direction D1 of the winding shaft 3, and a side face portion 46 on which an opening portion 47 is formed.",
"The half case 40 houses the winding shaft 3.As “side face” can mean faces other than the bottom face of a rectangular column, a cylindrical column and the like, the side face portion 46 means a portion of surrounding the winding shaft 3 housed in the case 40.Consequently, the side face portion 46 includes a back portion 46a, which is a portion arranged in a longitudinal direction viewed from a user, and a bottom portion 46b, which is arranged in a vertical direction viewed from a user.",
"The half case 40 is a half-split body forming a part of the housing of the winding device 1.When the half case 40 is aligned with the trim 805, a housing space SP1 of the winding shaft 3 and the like is formed.",
"The case 40 shown in FIG.",
"2 has an outwardly extending portion 43 extended from the back portion 46a to the case direction D11.The winding device 1 has a slit 48 formed between the outwardly extending portion 43 and the trim 805 for drawing out the screen body 2a from the housing space SP1.Note that the case 40 can be unitized by being preliminarily assembled with the components such as the screen 2.The case 40 is fastened to the vehicle body by inserting a conventionally known fastening means such as a screw into a plurality of through holes 40a (shown in FIG.",
"1) formed on the unitized case 40.Thus, the winding device 1 is integrated with the vehicle body.",
"The through hole 62 for inserting the projecting portion 3b of the winding shaft 3 is formed on the wall portion 61 shown in FIGS.",
"4, 5 and other figures.",
"The wall portion 61 is arranged between the end face 3a1 of the end member 32 and the felt 50 in the center line direction D1.The through hole 62 has a size not allowing the felt 50 to pass through.",
"Consequently, the wall portion 61 prevents the felt 50 from being shifted toward the inside D1i in the center line direction and keeps the felt 50 apart from the end face 3a1 of the end member.",
"The through hole 62 shown in FIG.",
"4 and other figures is circular having an inner diameter larger than an inner diameter of the through hole 51 of the felt 50 so that the body portion 3a of the winding shaft 3 can be inserted into the through hole 62.Consequently, the winding shaft 3 can be installed on the case 40 after the body portion 3a is inserted into the through hole 62.Note that the winding shaft 3 is prevented from being shifted in the center line direction D1 by the bearing portion 38 of the wall portion 42 side so that the end face 3a1 of the end member 32 is not in contact with the felt 50.Of course, if the winding shaft 3 can be installed on the case 40 without inserting the body portion 3a into the through hole 62, the through hole 62 can have a size not allowing the body portion 3a to pass through as long as the projecting portion 3b can pass through the through hole 62.Also in this case, the wall portion 61 is not in contact with the projecting portion 3b.",
"Both the case when the through hole 62 has a size not allowing the body portion 3a to pass through and the case when the through hole 62 has a size allowing the body portion 3a to pass through are included in the configuration where the wall portion 61 is arranged between the end face 3a1 of the body portion and the felt 50 in the center line direction D1.In addition, the shape of the through hole 62 is not limited to the circular shape.",
"The through hole 62 can have an elliptical shape or a polygonal shape, for example.",
"On the outside D1o in the center line direction of the wall portion 61, a felt supporting portion (fiber assembly supporting portion) 63 for supporting the felt 50 is formed.",
"A lid portion 80 is connected to the felt supporting portion 63 via an integral hinge 81.A hook portion 82 is formed on the felt supporting portion 63 so that the hook portion 82 is inserted into a through hole 80c of the lid portion 80 to lock the lid portion 80 after the bending operation.",
"FIGS.",
"3A, 3B, 4 and 5 exemplify a resin-made case 40 in which the felt supporting portion 63, the lid portion 80, the hinge 81 and the hook portion 82 are integrally formed together with the wall portions 61, 42, the outwardly extending portion 43 and the side face portion 46.Note that the present technology includes the configuration where the case 40 is formed by combining a plurality of components.",
"For example, a part of the above described components can be formed separately from the remaining part and then assembled with the remaining part to form the case 40.The opening portion 47 shown in FIG.",
"2 and other figures is a part which is substantially covered with the trim 805 and from which the screen body 2a is drawn out.",
"For the case 40, a molded article such as an injection molded article of synthetic resin can be used, for example.",
"As the synthetic resin, general-purpose resins, which are lightweight and low-priced, can be used for the case, for example.",
"As the general-purpose resins, PP, polyethylene (PE), and a material formed by adding additives to the above materials can be used, for example.",
"The felt 50 shown in FIG.",
"5 and other figures has the through hole 51 for inserting the projecting portion 3b of the end member 32 of the winding shaft into the through hole 51.The felt 50 is formed in a cylindrical shape by assembling fibers.",
"The felt 50 rotatably supports the projecting portion 3b of the end member 32 in a state of being inserted into the felt supporting portion 63 of the case 40.The protrusions 7 formed on the lid portion 80 are inserted into an end face 50a (end face 5a of the fiber assembly) of the felt 50 on the outside D1o in the center line direction.",
"Thus, the felt 50 is compressed.",
"Note that the hole of the felt 50 is not limited to the through hole.",
"The hole can be closed at the end face 50a on the outside D1o in the center line direction.",
"For the fibers forming the felt 50, wool, fibers of the synthetic resin (inclusive of elastomers) such as polyester (e.g., polyethylene terephthalate (PET)), polyolefin and a polyamide, fibers obtained by adding an additive to the synthetic resin, rayon and combinations of the above described fibers can be used, for example.",
"The felt 50 can include a material (e.g., binder) other than the fiber.",
"A density of the felt 50 can be approximately 0.02 to 0.4 g/cm3 (preferably approximately 0.1 to 0.3 g/m3), for example.",
"In order to reduce the deformation of the felt after the screen is repeatedly drawn out and wound, it is required to increase the density of the felt.",
"In order to reduce the noise caused by friction between the projecting portion of the rotating winding shaft and the felt, it is required to reduce the density of the felt.",
"A thickness T1 of the felt 50 can be 2 to 20 mm, for example.",
"The protrusions 7 shown in FIG.",
"4 and other figures protrude toward the felt 50 side from the end face 50a of the felt 50 in the center line direction D1.FIG.",
"6A is a schematic diagram of the lid portion 80 (prevention structure 8) having a plurality of protrusions 7 viewed from the inside D1i in the center line direction.",
"The protrusions 7 are expanded in an approximately hemispherical shape toward the inside D1i in the center line direction from the inner surface (protrusion forming surface 80a) of the lid portion 80 in a state of being installed on the felt supporting portion 63.Of course, the shape of the protrusions 7 is not limited to the hemispherical shape.",
"The protrusions 7 can have a tubular shape such as a cylindrical shape and a prismatic shape, a conical shape such as a circular conical shape and a pyramidal shape or the like.",
"Since the protrusions 7 are formed on the protrusion forming surface 80a of the lid portion 80, when the lid portion 80 is installed on the felt supporting portion 63, the protrusions 7 are pushed from the end face 50a of the felt 50 into the felt 50.Thus, the felt 50 is compressed.",
"The position of the protrusions 7 is not particularly limited.",
"The protrusions 7 can be located at the position in contact with the felt supporting portion 63.From the viewpoint of suppressing rotational resistance to the projecting portion 3b, it is suitable that the protrusions 7 are located at a position where the protrusions 7 are not touch the projecting portion 3b.",
"The protrusions 7 shown in FIG.",
"6A exist from the center line AX1 to the screen-drawing-out side SD1 of the winding shaft 3 and does not exist from the center line AX1 to the screen-drawing-in side SD2.FIG.",
"6B schematically shows the arrangement of the protrusions 7 with respect to the end face 50a of the felt 50 in the center line direction D1 when the lid portion 80 shown in FIG.",
"6A is installed on the felt supporting portion 63.As shown in FIG.",
"6B, in the end face 50a of the felt, S1 indicates the area where the protrusions 7 protrude toward the felt 50 side on the screen-drawing-out side SD1 from the center line AX1 of the winding shaft 3, and S2 indicates the area where the protrusions 7 protrude toward the felt 50 side on the screen-drawing-in side SD2 from the center line AX1 of the winding shaft 3.As shown in FIG.",
"6B, S1>S2.FIG.",
"7A schematically shows an example of the felt before durability test in which the screen 2 is repeatedly drawn out and wound.",
"FIG.",
"7B schematically shows an example of the fiber assembly after the durability test in the winding device without having the protrusions 7 formed on the lid portion 80.FIG.",
"7C schematically shows an example of the fiber assembly after the durability test in the winding device having the protrusions 7 formed on the lid portion 80 as shown in FIG.",
"6A.",
"In FIGS.",
"7A to 7C, patterns formed on the fibers of the felt are omitted.",
"On the left side of FIGS.",
"7A to 7C, the felt view from the outside D1o in the center line direction is shown.",
"On the right side of FIGS.",
"7A to 7C, the left side face of the felt is shown.",
"Note that the felt 50 before the durability test had a diameter R1 of the through hole 51 of 6 mm, a thickness T1 of 5 mm, and a length L1 of 7 mm in the center line direction D1.In the durability test, the screen 2 was drawn out and wound for 20000 times.",
"As shown in FIG.",
"7B, when the protrusions 7 were not formed on the lid portion 80, the felt 50 was slightly deformed in the drawing direction D22 at the screen-drawing-out side SD1.Consequently, a diameter R2 of the through hole 51 was 7 mm, a thickness T2 was 3 mm, and a length L2 in the center line direction D1 was 10 mm.",
"Although wrinkles due to inclination of the winding shaft 3 were slightly found on the draw out screen body 2a, generation of noise was suppressed.",
"As shown in FIG.",
"7C, when the protrusions 7 were formed on the lid portion 80 at the screen-drawing-out side SD1, the deformation of the felt 50 was reduced at the screen-drawing-out side SD1.Consequently, a diameter R3 of the through hole 51 was maintained to be 7 mm, a thickness T3 was 4.8 mm (reduction was suppressed), and a length L3 in the center line direction D1 was 8 mm (increase was suppressed).",
"It is assumed that rigidity was increased because the protrusions 7 were pushed into the felt 50 and the felt 50 was compressed at the screen-drawing-out side SD1.On the other hand, since the protrusions 7 are not formed at the screen-drawing-in side SD2, the force required for pushing the protrusions 7 into the felt 50 can be reduced when installing the lid portion 80 on the felt supporting portion 63 into which the felt 50 is inserted.",
"Accordingly, the concrete example having the protrusions 7 arranged as shown in FIGS.",
"6A and 6B can provide an easily assembled winding device while further improving durability.",
"As exemplified in FIGS.",
"6C and 6D, the protrusions 7 can be arranged also at the screen-drawing-in side SD2.A plurality of protrusions 7 shown in FIG.",
"6C includes the protrusions 7a interposed between both sides SD1 and SD2.In this case, the area S2 of the protrusions 7 of the screen-drawing-in side SD2 is not 0 but is smaller than the area S1 of the screen-drawing-out side SD1.Accordingly, the concrete example having the protrusions 7 arranged as shown in FIG.",
"6C can provide an easily assembled winding device while further improving durability.",
"On the other hand, a plurality of protrusions 7 shown in FIG.",
"6D are approximately uniformly arranged on both sides SD1 and SD2, thus S1=S2.Accordingly, although the protrusions 7 should be strongly pushed into the felt 50 when installing the lid portion 80 on the felt supporting portion 63 into which the felt 50 is inserted, durability can be further improved.",
"The lid portion 80 shown in FIGS.",
"4, 5 and other figures is openable and closable around the hinge 81 with respect to the felt supporting portion 63.The lid portion 80 has a through hole 80b into which the projecting portion 3b of the winding shaft 3 is inserted and a through hole 80c into which the hook portion 82 is inserted.",
"The through hole 80b shown in FIG.",
"4 has an elliptical shape in which the long diameter is oriented in the drawing direction D22 and the housing direction D21 considering that the position of the projecting portion 3b is slightly changed in the drawing direction D22 and the housing direction D21 of the screen 2.Of course, the shape of the through hole 80b is not limited to an elliptical shape.",
"The through hole 80b can have a perfect circular shape or a polygonal shape, for example.",
"When the hook portion 82 is inserted into the through hole 80c for inserting the hook portion and the lid portion 80 is locked to the hook portion 82, the protrusion forming surface 80a prevents the felt 50 from shifting toward the outside D1o in the center line direction.",
"Since the lid portion 80 is connected to the felt supporting portion 63 via the hinge 81, a separate component for preventing the felt 50 from shifting toward the outside D1o in the center line direction is not required.",
"(3) Operations and Effects of Winding Device Concerning Concrete Example When the cylindrical body 31 is formed of aluminum and the case 40 is formed of a low-priced PP, a linear expansion coefficient of the case 40 is considerably larger than a linear expansion coefficient of the cylindrical body 31.Hence, it is necessary to design the components considering variation in the size of the components, especially the case 40, due to temperature change.",
"Further, vibration is applied from the automobile to the winding device 1 mounted on the automobile when the automobile is driven.",
"In addition, operations of drawing out the screen 2 and housing the screen 2 are repeatedly performed on the winding device 1 and the winding shaft 3 is rotated during the operations.",
"If the bearing portion of the projecting portion of the winding shaft is not the fiber assembly but made of resin or made of metal, a clearance may be generated between the projecting portion of the winding shaft and the bearing portion due to the design considering variation in the size of the components.",
"In such a case, abnormal noise may be generated when vibration is applied to the winding device or when the winding shaft is rotated.",
"If a special resin material for reducing the linear expansion coefficient is used for the case, the resin material forming the case becomes expensive.",
"Since the above described projecting portion 3b of the winding shaft 3 of the winding device 1 is rotatably supported by the felt 50, even if the design considering variation in the size of the components is adopted, vibration applied to the winding device 1 is absorbed by the felt 50.Thus, abnormal noise is suppressed.",
"Accordingly, the present concrete example can suppress the abnormal noise when vibration is input or when the winding shaft is rotated.",
"In addition, as exemplified in FIG.",
"8, the present concrete example also has an effect of preventing an edge portion 2c of the drawn out screen 2 from slacking.",
"The state ST1 of FIG.",
"8 shows that slack is formed on one of both edge portions 2c, 2d of the screen body 2a (on the edge portion 2c located on the far side from the felt 50) when assuming that the felt 50 is not elastically deformed.",
"Actually, as exemplified in the brackets of FIG.",
"8, the felt 50 has a property of elastically deforming like a spring.",
"Hence, as shown in the state ST2, the projecting portion 3b slightly shifts in the drawing direction D22, the screen body 2a is slightly wound by the winding shaft 3, and the slack of the edge portion 2c disappears (decreases).",
"As explained above, the elastically deformable felt 50 has an aligning function for adjusting the center line AX1 of the winding shaft 3.Consequently, the slack of the edge portion 2c is suppressed and appearance of the screen 2 is improved.",
"Furthermore, as exemplified in FIG.",
"18, even when the retention structure 6 for keeping the felt 50 apart from the end face 3a1 of the body portion 3a of the winding shaft is not provided, the effect of suppressing the abnormal noise can be obtained when vibration is input or when the winding shaft is rotated.",
"Further, as exemplified in FIG.",
"9, when the felt 50 shifts toward the inside D1i in the center line direction and abuts on the end face 3a1 of the body portion 3a of the winding shaft due to a repeated rotating operation of the winding shaft 3 or a thermal expansion of the components, rotational resistance is generated at the winding shaft 3.In addition, the felt 50 may enter into a clearance around the end face 3a1 and may be deformed.",
"Since the retention structure 6 shown in FIG.",
"4 and other figures is formed on the winding device 1, the rotational resistance caused when the felt 50 abuts on the end face 3a1 of the body portion 3a of the winding shaft is suppressed.",
"As a result, the deformation of the felt 50 is suppressed and the durability of the winding device is improved.",
"Furthermore, as shown in FIG.",
"4 and other figures, when the protrusions 7 are pushed into the felt 50, the felt 50 is compressed.",
"Thus, the rigidity of the felt 50 is increased.",
"Since the protrusions 7 protrude toward the felt 50 side from the end face 50a of the felt in the center line direction D1, the durability of the winding device is improved.",
"In particular, as shown in FIGS.",
"6A to 6C, in the end face 50a of the felt in the center line direction D1, when the area S1 of the protrusions 7 on the screen-drawing-out side SD1 from the center line AX1 is larger than the area S2 of the protrusions 7 on the screen-drawing-in side SD2, the force required for pushing the protrusions 7 into the felt 50 can be reduced when installing the lid portion 80.Accordingly, the concrete example having the protrusions 7 arranged as shown in FIGS.",
"6A to 6C can provide an easily assembled winding device while further improving durability.",
"(4) Variation Examples Various variation examples are conceivable for the present invention.",
"The winding device as the sunshade device can be installed on a rear window, a roof window or a front window, for example, without limited to a side window.",
"The winding device can be a tonneau cover device, for example.",
"The drawing direction of the screen can be downward and horizontally, for example, without limited to upward.",
"The position to install the winding shaft can be a case surrounding an approximately entire periphery of the winding shaft or a trim such as a door trim, without limited to the half case.",
"The positon of forming the protrusions 7 is not limited to the lid portion 80 (prevention structure 8).",
"The protrusions 7 can be formed on the retention structure 6, for example.",
"FIG.",
"9 schematically shows an example of the winding device having the wall portion 61 (retention structure 6) on which the protrusions 7 are formed.",
"In the variation examples explained below, the same reference signs are assigned to the similar components as the above described examples.",
"The explanation of such components will be omitted.",
"The protrusions 7 shown in FIG.",
"9 protrude toward the felt 50 side from an end face 50b of the felt 50 (end face 5a of the fiber assembly) in the center line direction D1.Since the protrusions 7 are formed on a wall surface 61a of the wall portion 61, when the lid portion 80 is installed on the felt supporting portion 63, the protrusions 7 are pushed from the end face 50b of the felt 50 to the felt 50.Thus, the felt 50 is compressed and the rigidity is increased.",
"Since the protrusions 7 have entered the felt 50 side from the end face 50b of the felt in the center line direction D1, the durability of the winding device is improved.",
"Of course, the protrusions 7 can be formed on both the lid portion 80 and the wall portion 61.The prevention structure 8 for preventing the felt 50 from shifting toward the outside D1o in the center line direction is not limited to the lid portion connected to the felt supporting portion 63 by a hinge structure.",
"The prevention structure 8 can be a lid, a trim and the like which are formed separately from the felt supporting portion 63.FIG.",
"10 is a vertical cross-sectional view schematically exemplifying a main part of the winding device 1 having a separately formed lid 83.FIG.",
"10 also shows the drawing of the wall portion 61 viewed from the inside D1i in the center line direction, and the drawing of the lid 83 (example of the prevention structure 8) viewed from the outside D1o in the center line direction.",
"FIG.",
"11 is an exploded view schematically exemplifying a main part of the winding device 1 having a separately formed lid 83.FIG.",
"11 also shows the drawing of the cylindrical body 31 viewed from the outside D1o in the center line direction, the drawing of the end member 32 viewed from the inside D1i in the center line direction, the drawing of the end member 32 viewed from the outside D1o in the center line direction, and the drawing of the felt 50 viewed from the inside D1i in the center line direction.",
"The lid 83 shown in FIGS.",
"10 and 11 can be attached/detached to/from the felt supporting portion 63.The protrusions 7 are formed on an inner surface 83a of the lid 83.A through hole 83b for inserting the projecting portion 3b of the winding shaft 3 is formed on the lid 83.A plurality of annular grooves 85 is formed on an inner peripheral portion 83i of the lid 83 so that each of the annular grooves 85 is formed over one round around the center line AX1.A plurality of annular projected ridges 84 is formed on an outer peripheral portion 63o of the felt supporting portion 63 shown in FIGS.",
"10 and 11 so that each of the projected ridges 84 is formed over one round around the center line AX1.When the lid 83 is installed on the felt supporting portion 63 in which the felt 50 is inserted, the lid 83 is held by the felt supporting portion 63 at a position where the projected ridges 84 are inserted into the grooves 85 after the projected ridges 84 are elastically deformed.",
"Since the plurality of projected ridges 84 and the plurality of grooves 85 are formed, the position of the lid 83 held by the felt supporting portion 63 can be changed in steps in the center line direction D1.Consequently, even when there is a variation in the density, the size and the like of the felt 50, the rigidity of the felt 50 can be appropriately uniformed.",
"The present technology includes the case where the lid 83 is held by the felt supporting portion 63 only at one position.",
"Also in such a case, the effect of suppressing the abnormal noise can be obtained when vibration is input or when the winding shaft is rotated.",
"FIG.",
"12 is a vertical cross-sectional view schematically exemplifying the winding device 1 having the prevention structure 8 formed on the door trim 805.FIG.",
"12 also shows the drawing of the wall portion 61 viewed from the inside D1i in the center line direction.",
"A protrusion 86 (example of the prevention structure 8) protruded toward the inside D1i in the center line direction is formed on the trim 805 shown in FIG.",
"12.A through hole 86b is formed on the protrusion 86 to insert the projecting portion 3b of the winding shaft 3 into the through hole 86b.",
"An end face 86a of the protrusion 86 in the inside D1i in the center line direction abuts on the end face 50a of the felt 50 at the outside D1o in the center line direction to prevent the felt 50 from shifting toward the outside D1o in the center line direction.",
"Accordingly, also the present concrete example can prevent the felt 50 from being displaced from the winding shaft 3 toward the outside D1o in the center line direction.",
"Furthermore, the retention structure 6 for keeping the felt 50 apart from the end face 3a1 of the body portion 3a of the winding shaft is not limited to the wall portion 61.The retention structure 6 can be the enlarged portion 65 formed on the projecting portion 3b, for example.",
"FIG.",
"13 is a vertical cross-sectional view schematically exemplifying the winding device 1 having the projecting portion 3b on which the enlarged portion 65 (example of the retention structure 6) is formed.",
"The enlarged portion 65 is arranged between the end face 3a1 of the body portion 3a of the winding shaft and the felt 50 in the center line direction D1 and formed on the projecting portion 3b.",
"An outer diameter of the enlarged portion 65 is larger than an inner diameter of the hole 51 of the felt 50.Hence, the felt 50 is kept apart from the end face 3a1 of the body portion 3a of the winding shaft.",
"The enlarged portion 65 shown in FIG.",
"13 has a tapered shape gradually increased in diameter from the felt 50 toward the end face 3a1 of the body portion 3a of the winding shaft.",
"Consequently, when the felt 50 is pressed toward the enlarged portion 65 in the center line direction D1, the portion of the inside D1i in the center line direction of the felt 50 is compressed and the rigidity is increased.",
"Thus, the felt 50 is kept apart from the end face 3a1 of the body portion 3a of the winding shaft.",
"The shape of the enlarged portion 65 is not limited to a tapered shape.",
"The enlarged portion 65 can be a shape increased stepwisely in diameter from the felt 50 toward the end face 3a1 of the body portion 3a of the winding shaft, for example.",
"Furthermore, the fiber assembly 5 rotated together with the winding shaft 3 can be rotatably supported by another shaft.",
"FIG.",
"14 is a vertical cross-sectional view schematically exemplifying a main part of the winding device 1 having the felt 50 inserted into the opening 3d of the end member 32.FIG.",
"14 also shows a vertical cross-sectional view of the winding shaft 3 and other components.",
"FIG.",
"15 is an exploded view schematically exemplifying a main part of the winding device 1 having the felt 50 inserted into the opening 3d of the end member 32.FIG.",
"15 also shows the drawing of the end member 32 viewed from the outside D1o in the center line direction, and the drawing of the support shaft 9 viewed from the inside D1i in the center line direction.",
"The projecting portion 3b is not provided on the end member 32 shown in FIGS.",
"14 and 15.The end member 32 has the base portion 33 and the inner engagement portion 34.The outer peripheral surface 33o of the base portion 33 is corresponded to the outer peripheral surface 31o of the cylindrical body 31.The inner engagement portion 34 is fitted into the opening 31b of the end portion of the cylindrical body 31.Accordingly, the cylindrical body 31 and the end member 32 are concrete examples of the winding shaft.",
"The base portion 33 has a recess 33a recessed from a circular opening 3d formed on the end face of the outside D1o in the center line direction toward the inside D1i in the center line direction.",
"The felt 50 inserted from the opening 3d is housed in the recess 33a and prevented from shifting toward the inside D1i in the center line direction.",
"A plurality of annular projected ridges 84 is formed on the outer peripheral surface 33o of the base portion 33.The felt 50 shown in FIGS.",
"14 and 15 has a through hole 51 along the center line direction D1.The felt 50 is rotatably supported by the support shaft 9 in a state of being housed in the recess 33a.",
"A lid 87 (example of the prevention structure 8) shown in FIGS.",
"14 and 15 can be attached/detached to/from the base portion 33 of the end member 32.A through hole 87b for inserting the support shaft 9 is formed on the lid 87.A plurality of annular grooves 85 is formed on an inner peripheral portion 87i of the lid 87 so that each of the annular grooves 85 is formed over one round around the center line AX1.When the lid 87 is installed on the base portion 33 in which the felt 50 is inserted, the lid 87 is held by the base portion 33 at a position where the projected ridges 84 are inserted into the grooves 85 after the projected ridges 84 are elastically deformed.",
"Since the plurality of projected ridges 84 and the plurality of grooves 85 are formed, the position of the lid 87 held by the base portion 33 can be changed in steps in the center line direction D1.Consequently, even when there is a variation in the density, the size and the like of the felt 50, the rigidity of the felt 50 can be appropriately uniformed.",
"Of course, the present technology includes the case where the lid 87 is held by the base portion 33 only at one position.",
"In addition, a male thread can be formed on the outer peripheral surface 33o of the base portion 33 instead of the projected ridges 84 and a female thread can be formed on the inner peripheral portion 87i of the lid 87 instead of the grooves 85.The support shaft 9 shown in FIGS.",
"14 and 15 is integrally formed with the wall portion 61 and projected from the wall 61 toward the inside D1i in the center line direction.",
"The support shaft 9 is a fixing shaft having a circular cross section so as to pass through the through hole 87b of the lid 87 and the hole 51 of the felt 50 for rotatably fixing the felt 50.The lid 87 is installed on the end member 32 in which the felt 50 is housed, the inner engagement portion 34 of the end member 32 is fitted into the opening 31b of the end portion of the cylindrical body 31, and then the support shaft 9 is inserted into the through hole 87b of the lid 87 and the hole 51 of the felt 50.Thus, the winding device 1 shown in FIG.",
"14 is assembled.",
"Since the above described felt 50 inserted into the opening 3d of the winding shaft 3 of the winding device 1 is rotatably supported by the support shaft 9, even if the design considering variation in the size of the case 40 is adopted, vibration applied to the winding device 1 is absorbed by the felt 50.Thus, abnormal noise is suppressed.",
"Accordingly, the present concrete example can also suppress the abnormal noise when vibration is input or when the winding shaft is rotated.",
"Furthermore, as exemplified in FIGS.",
"16 and 17, a protrusion 7 can be formed on the lid portion 80 for pressing the end face 5a of the fiber assembly 5 along an outer periphery 5o of the fiber assembly 5.FIG.",
"16 is a vertical cross-sectional view schematically exemplifying a main part of the winding device 1 having the above described protrusion 7.FIG.",
"16 also shows a perspective view of a separately formed cap 180 (example of the prevention structure 8 and the lid portion 80).",
"FIG.",
"17 is an exploded view schematically exemplifying a main part of the winding device 1 having a cap 180.Note that FIG.",
"17 is vertically inverted with respect to FIG.",
"16.The cap 180 shown in FIGS.",
"16 and 17 has a flange portion 181, a main annular portion 182 and an anti-come-off portion 183.The cap 180 can be attached/detached to/from the felt supporting portion 63 formed on the wall portion 61.An outer diameter of the flange portion 181 is specified so that the flange portion 181 does not enter in the felt supporting portion 63.Thus, the flange portion 181 abuts on the felt supporting portion 63 in the center line direction D1.The main annular portion 182 and the anti-come-off portion 183 are separated by slits 184, 184 so that the anti-come-off portion 183 is smaller than the main annular portion 182.The main annular portion 182 and the anti-come-off portion 183 are projected from the flange portion 181 toward the inside D1i in the center line direction D1 along an outer periphery 50o (example of the outer periphery 5o of the fiber assembly) of the felt 50.The main annular portion 182 and the anti-come-off portion 183 can be inserted into the felt supporting portion 63.In a state that the flange portion 181 abuts on the felt supporting portion 63, the tip portions of the main annular portion 182 and the anti-come-off portion 183 enter in the felt 50 side from the end face 50a of the felt 50.Namely, the main annular portion 182 and the anti-come-off portion 183 are an example of the protrusion 7 that protrudes toward the felt 50 side from the end face 50a of the felt 50.A through hole 180b is formed on the cap 180 to penetrate from the flange portion 181 to the main annular portion 182 and the anti-come-off portion 183 in the center line direction D1.An inner diameter of the through hole 180b is larger than an outer diameter of the projecting portion 3b of the winding shaft 3 and smaller than an outer diameter of the felt 50.The projecting portion 3b is inserted into the through hole 180b so as not to be in contact with the cap 180.For preventing the rotation of the cap 180, a positioning projection 182b having an approximately rectangular parallelepiped shape is formed on the main annular portion 182 so as to be protruded outward in the radial direction around the center line AX1.On the felt supporting portion 63 into which the main annular portion 182 is inserted, a positioning recess 66 having a shape corresponding to the shape of the positioning projection 182b is formed.",
"The cap 180 is installed on the felt supporting portion 63 so as not to be rotated around the center line AX1 by inserting the positioning projection 182b into the positioning recess 66.For preventing the cap 180 from coming off, a hook-shaped pawl portion 183b is formed on the anti-come-off portion 183 so as to be protruded outward in the radial direction around the center line AX1.The pawl portion 183b has a taper portion 183t having a chamfered surface at the inside D1i in the center line direction D1 and a surface approximately orthogonal to the center line AX1 at the outside D1o in the center line direction D1.On the felt supporting portion 63 into which the anti-come-off portion 183 is inserted, an engagement hole 67 is formed so that the pawl portion 183b is inserted into the engagement hole 67 in a state that the flange portion 181 abuts on the felt supporting portion 63.The anti-come-off portion 183 is elastically deformed so that the pawl portion 183b slides the inner wall of the felt supporting portion 63, and then the pawl portion 183b is inserted into the engagement hole 67.Thus, the cap 180 is installed on the felt supporting portion 63 so as not to come off toward the outside D1o in the center line direction D1.At the tip end portions of the main annular portion 182 and the anti-come-off portion 183 which are protruded from the flange portion 181, taper portions 185 having a chamfered surface are formed.",
"The taper portions 185 are formed on the inner surface of the main annular portion 182 and the anti-come-off portion 183 so as to be orientated to the center line AX1.Namely, each of the taper portions 185 has a chamfered surface which is more distant from the center line AX1 to the inside D1i as it reaches the center line direction D1.Since the taper portions 185 enter in the felt 50 side from the end face 50a of the felt 50, the rigidity of the felt 50 (especially outer peripheral portion) is increased and the durability of the winding device is particularly increased.",
"Thus, the effect of suppressing the abnormal noise can be obtained when vibration is input or when the winding shaft is rotated.",
"The winding device 1 shown in FIGS.",
"16 and 17 can be assembled as described below, for example.",
"First, an operator inserts the felt 50 into the felt supporting portion 63, and inserts the main annular portion 182 and the anti-come-off portion 183 into the felt supporting portion 63 while aligning the positioning projection 182b with the positioning recess 66.When the elastically deformed pawl portion 183b of the anti-come-off portion 183 is inserted into the engagement hole 67, the felt 50 is fixed to the felt supporting portion 63 by the cap 180 locked to the felt supporting portion 63 in a state that the felt 50 is compressed.",
"Then, the operator inserts the projecting portion 3b of the winding shaft 3 into the hole 51 of the felt 50 via the through hole 62 of the wall portion 61.Of course, the order of each process in the operation of the assembly can be arbitrarily changed.",
"(5) Conclusion As explained above, according to various embodiments, the present invention can provide a technology capable of suppressing the abnormal noise when vibration is input or when the winding shaft is rotated and so on.",
"Of course, the above-described basic operation and effect can be obtained by the art which includes only the components set forth in the independent claims and without components set forth in the dependent claims.",
"The present invention can be also implemented by replacing the features disclosed in the above-described embodiments and variation examples with each other or changing the combinations thereof, and the present invention can be also implemented by replacing the conventional features and the features disclosed in the above-described embodiments and variation examples with each other or changing the combinations thereof.",
"The present invention includes these features and the like."
]
] |
Patent_15871076
|
[
[
"CATHODE ELECTRODE MATERIAL AND LITHIUM SULFUR BATTERY USING THE SAME",
"A cathode electrode material and a lithium sulfur battery are disclosed.",
"The cathode electrode material includes a sulfur containing cathode active material, a conducting agent, and a cathode binder.",
"The cathode binder includes a polymer obtained by polymerizing a dianhydride monomer with a diamine monomer.",
"The lithium sulfur battery includes an anode electrode, an electrolyte, and a cathode electrode."
],
[
"1.A cathode electrode material comprising a sulfur containing cathode active material, a conducting agent, and a cathode binder, wherein the cathode binder comprises a polymer obtained by polymerizing a dianhydride monomer with a diamine monomer, the dianhydride monomer comprises a monomer selected from the group consisting of monomers represented by formulas I, II, III, and combinations thereof, the diamine monomer comprises a first monomer represented by formula IV, 2.The cathode electrode material of claim 1, wherein the R in formula III is selected from the group consisting of bisphenol A unit, —O—, —S—, and —CH2—.",
"3.The cathode electrode material of claim 1, wherein the dianhydride monomer is selected from the group consisting of 4,4′-(4,4′-isopropylidenediphenoxy)bis(phthalic anhydride), 2,3,3′,4′-diphenyl ether tetracarboxylic acid dianhydride, 1,2,4,5-benzenetetracarboxylic anhydride, 3,3′,4,4′-biphenyltetracarboxylic dianhydride, and combinations thereof.",
"4.The cathode electrode material of claim 1, wherein the diamine monomer further comprises a second monomer represented by formula V, 5.The cathode electrode material of claim 4, wherein the R4 in formula V is selected from the group consisting of —(CH2)n—, —O—, —S—, —CH2—O—CH2—, —CH(NH)—(CH2)n—, 6.The cathode electrode material of claim 4, wherein a molar ratio of the first monomer to the second monomer is 1:2 to 10:1.7.The cathode electrode material of claim 4, wherein a molar ratio of the first monomer to the second monomer is 1:1 to 3:1.8.The cathode electrode material of claim 1, wherein a molar ratio of the dianhydride monomer to the diamine monomer is 1:10 to 10:1.9.The cathode electrode material of claim 1, wherein a molar ratio of the dianhydride monomer to the diamine monomer is 1:2 to 4:1.10.The cathode electrode material of claim 1, wherein a molecular weight of the polymer is in a range from about 1000 to about 50000.11.The cathode electrode material of claim 1, wherein a mass percentage of the cathode binder is in a range from about 0.01% to about 50%.",
"12.The cathode electrode material of claim 1, wherein a mass percentage of the cathode binder is in a range from about 1% to about 20%.",
"13.The cathode electrode material of claim 1, wherein the sulfur containing cathode active material is at least one of elemental sulfur and sulfur based polymer.",
"14.The cathode electrode material of claim 13, wherein the sulfur based polymer is a product formed from a pyrolysis reaction, dehydrogenation and carbonation reaction, dehydration reaction, dehydrochlorination reaction, or deamination reaction of a mixture of conducting polymer and elemental sulfur.",
"15.The cathode electrode material of claim 13, wherein the sulfur based polymer is selected from the group consisting of sulfurized poly(pyridinopyridine), sulfurized polystyrene, sulfurized polyoxyethylene, sulfurized polyvinyl alcohol, sulfurized poly(vinylidene chloride), sulfurized poly(vinylidene difluoride), sulfurized polyvinylchloride, sulfurized polyvinyl fluoride, sulfurized poly(1,2-dichloroethylene), sulfurized poly(1,2-difluoroethylene), sulfurized polymethyl methacrylate, sulfurized phenolic resin, and combinations thereof.",
"14.A lithium sulfur battery comprising: an anode electrode; an electrolyte; and a cathode electrode, the cathode electrode comprising a cathode electrode material; wherein the cathode electrode material comprises a sulfur containing cathode active material, a conducting agent, and a cathode binder, the cathode binder comprises a polymer obtained by polymerizing a dianhydride monomer with a diamine monomer, the dianhydride monomer comprises a monomer selected from the group consisting of monomers represented by formulas I, II, III, and combinations thereof, the diamine monomer comprises a first monomer represented by formula IV, 15.The lithium sulfur battery of claim 14, wherein the electrolyte is a solid."
],
[
"<SOH> BACKGROUND <EOH>For a long time, people have been committed to the research and development of new energy storage systems.",
"Among them, lithium sulfur secondary batteries are considered the most attractive battery system.",
"Sulfur has the highest theoretical specific energy (2800 Wh/kg) and theoretical specific capacity (1675 Ah/kg) compared to other battery systems.",
"However, lithium sulfur batteries generate polysulfides during charge-discharge cycles.",
"The polysulfides dissolve in organic electrolytes, resulting in irreversible loss of active material and decay of capacity.",
"Moreover, with the insertion and extraction of lithium ions during the charge-discharge cycle, the sulfur cathode electrode has a volumetric expansion and contraction.",
"As cycling number increases, the cathode electrode structure collapses and the cathode electrode material spalls, causing a rapid decay of the capacity.",
"Experiments have shown that a commonly used oily binder such as polyvinylidene fluoride (PVDF) has a deteriorated cycling performance for lithium sulfur batteries.",
"An aqueous binder such as polyacrylic acid or polyacrylate is used in the lithium-sulfur battery system.",
"However, during the manufacturing of the electrode, the cathode active material, such as sulfur, is mixed with the conducting agent and the binder in a solvent to form an electrode slurry, which is coated on the surface of the current collector and then dried to remove the solvent.",
"For oily binders, volatile organic solvents can be used to make electrode slurries that are easier to dry.",
"For aqueous binder, a relatively long time is needed to thoroughly dry water in the slurry at a relatively low temperature, during which the cathode active material may be oxidized."
],
[
"<SOH> SUMMARY <EOH>A cathode electrode material comprising a sulfur containing cathode active material, a conducting agent, and a cathode binder, wherein the cathode binder comprises a polymer obtained by polymerizing a dianhydride monomer with a diamine monomer.",
"The dianhydride monomer comprises a monomer selected from the group consisting of monomers represented by formulas I, II, III, and combinations thereof.",
"The diamine monomer comprises a first monomer represented by formula IV, A lithium sulfur battery comprising an anode electrode, an electrolyte; and a cathode electrode, the cathode electrode comprising the cathode electrode material."
],
[
"CROSS-REFERENCE TO RELATED APPLICATIONS This application claims all benefits accruing under 35 U.S.C.",
"§ 119 from China Patent Application No.",
"201510422483.9, filed on Jul.",
"17, 2015 in the State Intellectual Property Office of China, the content of which is hereby incorporated by reference.",
"This application is a continuation under 35 U.S.C.",
"§ 120 of international patent application PCT/CN2016/090020 filed on Jul.",
"14, 2015, the content of which is also hereby incorporated by reference.",
"FIELD The present disclosure relates to cathode electrode materials and sulfur batteries using the same.",
"BACKGROUND For a long time, people have been committed to the research and development of new energy storage systems.",
"Among them, lithium sulfur secondary batteries are considered the most attractive battery system.",
"Sulfur has the highest theoretical specific energy (2800 Wh/kg) and theoretical specific capacity (1675 Ah/kg) compared to other battery systems.",
"However, lithium sulfur batteries generate polysulfides during charge-discharge cycles.",
"The polysulfides dissolve in organic electrolytes, resulting in irreversible loss of active material and decay of capacity.",
"Moreover, with the insertion and extraction of lithium ions during the charge-discharge cycle, the sulfur cathode electrode has a volumetric expansion and contraction.",
"As cycling number increases, the cathode electrode structure collapses and the cathode electrode material spalls, causing a rapid decay of the capacity.",
"Experiments have shown that a commonly used oily binder such as polyvinylidene fluoride (PVDF) has a deteriorated cycling performance for lithium sulfur batteries.",
"An aqueous binder such as polyacrylic acid or polyacrylate is used in the lithium-sulfur battery system.",
"However, during the manufacturing of the electrode, the cathode active material, such as sulfur, is mixed with the conducting agent and the binder in a solvent to form an electrode slurry, which is coated on the surface of the current collector and then dried to remove the solvent.",
"For oily binders, volatile organic solvents can be used to make electrode slurries that are easier to dry.",
"For aqueous binder, a relatively long time is needed to thoroughly dry water in the slurry at a relatively low temperature, during which the cathode active material may be oxidized.",
"SUMMARY A cathode electrode material comprising a sulfur containing cathode active material, a conducting agent, and a cathode binder, wherein the cathode binder comprises a polymer obtained by polymerizing a dianhydride monomer with a diamine monomer.",
"The dianhydride monomer comprises a monomer selected from the group consisting of monomers represented by formulas I, II, III, and combinations thereof.",
"The diamine monomer comprises a first monomer represented by formula IV, A lithium sulfur battery comprising an anode electrode, an electrolyte; and a cathode electrode, the cathode electrode comprising the cathode electrode material.",
"BRIEF DESCRIPTION OF THE DRAWINGS Implementations are described by way of example only with reference to the attached FIGURE.",
"The FIGURE is a graph showing cycling performances of Example 2 and Comparative Example 1 of lithium sulfur batteries.",
"DETAILED DESCRIPTION A detailed description with the above drawings is made to further illustrate the present cathode electrode materials and sulfur batteries using the same.",
"In one embodiment, a cathode binder of a sulfur containing cathode electrode material of a lithium sulfur battery is provided.",
"The cathode binder is a polymer obtained by polymerizing a dianhydride monomer with a diamine monomer.",
"The dianhydride monomer can be represented by the formulas I, II, or III below.",
"In the formula III, R is a bivalent organic substituent, which can be bisphenol A unit, —O—, —S—, or —CH2—.",
"The dianhydride monomer can comprise, but is not limited to, one or more of 4,4′-(4,4′-isopropylidenediphenoxy)bis(phthalic anhydride), 2,3,3′,4′-diphenyl ether tetracarboxylic acid dianhydride, 1,2,4,5-benzenetetracarboxylic anhydride, and 3,3′,4,4′-biphenyltetracarboxylic dianhydride.",
"The diamine monomer can at least comprise a monomer represented by formula IV.",
"In one embodiment, the diamine monomer can further comprise a monomer represented by formula V. In the formula V, R4 is a bivalent organic substituent, which can be —(CH2)n—, —O—, —S—, —CH2—O—CH2—, —CH(NH)—(CH2)n—, A molar ratio of the monomer of formula IV to the monomer of formula V can be 1:2 to 10:1, and in some embodiments can be 1:1 to 3:1.A molar ratio of all the dianhydride monomer to all the diamine monomer can be 1:10 to 10:1, and in some embodiments can be 1:2 to 4:1.A molecular weight of the cathode binder can range from about 1000 to about 50000.One embodiment of a method for making the cathode binder comprises a step of polymerizing the dianhydride monomer with the diamine monomer, which specifically can comprise: mixing the dianhydride monomer and the diamine monomer in an organic solvent to form a mixture, and heating and stirring the mixture to fully carry the reaction thereby obtaining the cathode binder.",
"The diamine monomer can be dissolved in an organic solvent to form a diamine solution.",
"A mass ratio of the diamine monomer to the organic solvent in the diamine solution can be 1:100 to 1:1, and can be 1:10 to 1:2 in some embodiments.",
"The dianhydride monomer can be dissolved in an organic solvent to form a dianhydride solution.",
"A mass ratio of the dianhydride monomer to the organic solvent in the dianhydride solution, can be 1:100 to 1:1, and can be 1:10 to 1:2 in some embodiments.",
"The organic solvent can dissolve the diamine monomer and the dianhydride monomer, such as N,N-dimethylformamide, N,N-dimethylacetamide, propylene carbonate, and N-methyl-2-pyrrolidone (NMP).",
"A pump can be used to deliver the dianhydride solution into the diamine solution at a certain speed or deliver the diamine solution into the dianhydride solution at a certain speed.",
"After the delivery, the stirring can continue for a period of time to form a complete reaction.",
"The stirring can last for about 2 hours to about 72 hours, and can last for about 12 hours to about 24 hours in some embodiments.",
"The temperature of the polymerizing can be at about 160° C. to about 200° C. During the polymerizing, a catalyst can be added.",
"The catalyst can be at least one of benzoic acid, benzenesulfonic acid, phenylacetic acid, pyridine, quinoline, pyrrole, and imidazole.",
"A mass percentage of the catalyst to a sum of the dianhydride monomer and the diamine monomer can be about 0.5% to about 5%.",
"First, the dianhydride monomer and the diamine monomer can be completely dissolved in the organic solvent, and then heated to a temperature of about 30° C. to about 60° C. at which the mixture is stirred for about 1 hour to about 10 hours, and 2 hours to 4 hours in some embodiments.",
"The catalyst is then added to the mixture followed by heating the mixture to a temperature of about 160° C. to about 200° C. at which the mixture is stirred for about 6 hours to about 48 hours, and 12 hours to 24 hours in some embodiments, to obtain the polymer.",
"After the reaction, the cathode binder can be purified by washing the obtained polymer with a cleaning solvent, and dried.",
"The catalyst and the organic solvent are soluble to the cleaning solvent, and the cathode binder is insoluble to the cleaning solvent.",
"The cleaning solvent can be water, methanol, ethanol, a mixture of methanol and water, or a mixture of ethanol and water (a concentration of the methanol or the ethanol can be 5 wt % to 99 wt %).",
"One embodiment of a cathode electrode material comprises a sulfur containing cathode active material, a conducting agent, and the above-described cathode binder, which are uniformly mixed with each other.",
"A mass percentage of the cathode binder in the cathode electrode material can be in a range from about 0.01% to about 50%, such as from about 1% to about 20%.",
"The sulfur containing cathode active material can be at least one of elemental sulfur and sulfur based polymer.",
"The sulfur based polymer is a product formed from a pyrolysis reaction, dehydrogenation and carbonation reaction, dehydration reaction, dehydrochlorination reaction, or deamination reaction of a mixture of conducting polymer and elemental sulfur.",
"The sulfur based polymer can be at least one of sulfurized poly(pyridinopyridine), sulfurized polystyrene, sulfurized polyoxyethylene, sulfurized polyvinyl alcohol, sulfurized poly(vinylidene chloride), sulfurized poly(vinylidene difluoride), sulfurized polyvinylchloride, sulfurized polyvinyl fluoride, sulfurized poly(1,2-dichloroethylene), sulfurized poly(1,2-difluoroethylene), sulfurized polymethyl methacrylate, and sulfurized phenolic resin.",
"The conducting agent can be carbonaceous materials, such as at least one of carbon black, conducting polymers, acetylene black, carbon fibers, carbon nanotubes, and graphite.",
"Since the cathode binder is oily and is soluble in an oily solvent, the cathode binder can be used in combination with an oily organic solvent commonly used in the preparation of electrode slurry of the lithium ion battery, such as N-methylpyrrolidone.",
"The oily organic solvent can be rapidly and effectively removed during the drying process of the electrode slurry to avoid an adverse effect of the drying process on the electrode and the battery performance.",
"One embodiment of a lithium sulfur battery comprises a cathode electrode, an anode electrode, and an electrolyte located between the cathode electrode and the anode electrode.",
"The cathode electrode can comprise the above-described cathode electrode material.",
"The cathode electrode can further comprise a cathode current collector.",
"The cathode electrode material can be located on a surface of the cathode current collector.",
"The anode can comprise an anode electrode material, and can further comprise an anode current collector.",
"The anode electrode material can be located on a surface of the anode current collector.",
"The anode electrode material can be lithium metal.",
"The electrolyte can be a solid electrolyte or an electrolyte liquid.",
"In one embodiment, the electrolyte is the electrolyte liquid, the lithium sulfur battery can further comprise a separator, and the anode electrode material and the cathode electrode material are opposite to each other and spaced by the separator.",
"The separator can be polyolefin microporous membrane, modified polypropylene fabric, polyethylene fabric, glass fiber fabric, superfine glass fiber paper, vinylon fabric, or composite membrane of nylon fabric, and wettable polyolefin microporous membrane composited by welding or bonding.",
"The electrolyte liquid comprises a lithium salt and a non-aqueous solvent.",
"The non-aqueous solvent can comprise at least one of cyclic carbonates, chain carbonates, cyclic ethers, chain ethers, nitriles, amides and combinations thereof, such as ethylene carbonate (EC), diethyl carbonate (DEC), propylene carbonate (PC), dimethyl carbonate (DMC), ethyl methyl carbonate (EMC), butylene carbonate, gamma-butyrolactone, gamma-valerolactone, dipropyl carbonate, N-methyl pyrrolidone (NMP), N-methylformamide, N-methylacetamide, N,N-dimethylformamide, N,N-diethylformamide, diethyl ether, acetonitrile, propionitrile, anisole, succinonitrile, adiponitrile, glutaronitrile, dimethyl sulfoxide, dimethyl sulfite, vinylene carbonate, ethyl methyl carbonate, dimethyl carbonate, diethyl carbonate, fluoroethylene carbonate, chloropropylene carbonate, acetonitrile, succinonitrile, methoxymethylsulfone, tetrahydrofuran, 2-methyltetrahydrofuran, epoxy propane, methyl acetate, ethyl acetate, propyl acetate, methyl butyrate, ethyl propionate, methyl propionate, 1,3-dioxolane, 1,2-diethoxyethane, 1,2-dimethoxyethane, and 1,2-dibutoxy.",
"The lithium salt can comprise at least one of lithium chloride (LiCl), lithium hexafluorophosphate (LiPF6), lithium tetrafluoroborate (LiBF4), lithium methanesulfonate (LiCH3SO3), lithium trifluoromethanesulfonate (LiCF3SO3), lithium hexafluoroarsenate (LiAsF6), lithium hexafluoroantimonate (LiSbF6), lithium perchlorate (LiClO4), Li[BF2(C2O4)], Li[PF2(C2O4)2], Li[N(CF3SO2)2], Li[C(CF3SO2)3], lithium bisoxalatoborate (LiBOB), and lithium bis(trifluoromethanesulphonyl)imide (LiTFSI).",
"Example 1 In molar ratio, 0.4 parts of 2,2′-bis(4-aminophenoxyphenyl)propane (BAPP), 0.6 parts of 4,4′-oxydianiline (ODA), and m-cresol as the organic solvent are added in a triple-neck flask (a solid content of the solution is about 10%), stirred at room temperature to dissolve completely.",
"1 part of 2,3,3′,4′-diphenyl ether tetracarboxylic acid dianhydride is then added and dissolved completely.",
"The solution is heated to about 50° C. and reacted for about 4 hours followed by adding 1.5 mL of benzoic acid as the catalyst.",
"Then the solution is heated to about 180° C. and reacted for about 24 hours.",
"Finally, the reaction is terminated and the solution is precipitated in methanol to obtain the cathode binder, which is a fiber shaped polymer represented by formula VI.",
"Example 2 70% of sulfur-carbon cathode electrode material, 10% of the cathode binder obtained in Example 1, and 20% of the conducting graphite by mass percent are mixed and dispersed by the NMP to form a slurry.",
"The slurry is coated on an aluminum foil and vacuum dried at about 60° C. for about 24 hours to obtain the cathode electrode.",
"The counter electrode is lithium metal.",
"The electrolyte liquid is 1 M of LiTFSI dissolved in a solvent mixture of DOL/DME=1/1 (v/v).",
"The counter electrode, the cathode electrode, and the electrolyte liquid are assembled to form a 2032 coin-type battery.",
"Example 3 75% of sulfur-carbon cathode electrode material, 5% of the cathode binder obtained in Example 1, and 20% of the conducting graphite by mass percent are mixed and dispersed by the NMP to form a slurry.",
"The slurry is coated on an aluminum foil and vacuum dried at about 60° C. for about 24 hours to obtain the cathode electrode.",
"The counter electrode is lithium metal.",
"The electrolyte liquid is 1 M of LiTFSI dissolved in a solvent mixture of DOL/DME=1/1 (v/v).",
"The counter electrode, the cathode electrode, and the electrolyte liquid are assembled to form a 2032 coin-type battery.",
"Example 4 In molar ratio, 0.4 parts of 2,2′-bis(4-aminophenoxyphenyl)propane (BAPP), 0.6 parts of 4,4′-methylenedianiline, and m-cresol as the organic solvent are added in a triple-neck flask (a solid content of the solution is about 10%), stirred at room temperature to dissolve completely.",
"1 part of 2,3,3′,4′-diphenyl ether tetracarboxylic acid dianhydride is then added and dissolved completely.",
"The solution is heated to about 50° C. and reacted for about 4 hours followed by adding 1.5 mL of benzoic acid as the catalyst.",
"Then the solution is heated to about 180° C. and reacted for about 24 hours.",
"Finally, the reaction is terminated and the solution is precipitated in methanol to obtain the cathode binder, which is a fiber shaped polymer represented by formula VII.",
"Example 5 70% of sulfur-carbon cathode electrode material, 10% of the cathode binder obtained in Example 4, and 20% of the conducting graphite by mass percent are mixed and dispersed by the NMP to form a slurry.",
"The slurry is coated on an aluminum foil and vacuum dried at about 60° C. for about 24 hours to obtain the cathode electrode.",
"The counter electrode is lithium metal.",
"The electrolyte liquid is 1 M of LiTFSI dissolved in a solvent mixture of DOL/DME=1/1 (v/v).",
"The counter electrode, the cathode electrode, and the electrolyte liquid are assembled to form a 2032 coin-type battery.",
"Comparative Example 1 70% of sulfur-carbon cathode electrode material, 10% of PVDF as the binder, and 20% of the conducting graphite by mass percent are mixed and dispersed by the NMP to form a slurry.",
"The slurry is coated on an aluminum foil and vacuum dried at about 120° C. for about 24 hours to obtain the cathode electrode.",
"The counter electrode is lithium metal.",
"The electrolyte liquid is 1 M of LiTFSI dissolved in a solvent mixture of DOL/DME=1/1 (v/v).",
"The counter electrode, the cathode electrode, and the electrolyte liquid are assembled to form a 2032 coin-type battery.",
"The above-described Examples and Comparative Example adopt the same sulfur-carbon cathode electrode material formed by mixing the elemental sulfur with the conductive carbon.",
"Cycling Performance Test of Batteries The test conditions are as follows: in the voltage range of 1V to 3V, the batteries are charged and discharged at a constant current rate (C-rate) of 0.1C.",
"Referring to the FIGURE and Table 1, the cycling performance of the lithium sulfur batteries in Example 2 and Comparative Example 1 is shown in FIG.",
"1.The discharge specific capacity of the first cycle, the discharge specific capacity at the 30th cycle, and the capacity retention at the 30th cycle of the lithium sulfur batteries in Examples 2, 3, 5, and Comparative Example 1 are shown in Table 1.It can be seen that the cycling performances of the lithium sulfur batteries using the polyimide binder is greatly improved compared with that of the lithium sulfur battery using PVDF as the binder.",
"TABLE 1 Discharge specific Discharge specific Capacity capacity (mAh/g) at capacity (mAh/g) at retention (%) 1st cycle 30th cycle at 30th cycle Example 2 1112.6 519.4 47.3% Example 3 1034.5 508.8 49.2% Example 5 1086.3 528.5 48.7% Comparative 1020.9 393.6 38.6% Example 1 Binding Force Test The binding force tests are carried out for the cathode electrodes of Examples 2, 3, 5, and Comparative Example 1, respectively.",
"Adhesive tape having a width of 20 mm±1 mm is used.",
"First, 3 to 5 outer layers of the adhesive tape are peeled off, and then more than 150 mm long of the adhesive tape is taken.",
"The adhesive tape does not contact a hand or any other object.",
"One end of the adhesive tape is adhered to the cathode electrode, and the other end of the adhesive tape is connected to a holder.",
"A roller under its own weight is rolled on the cathode electrode at a speed of about 300 mm/min back and forth over the entire length of the cathode electrode about three times.",
"The test is carried out after resting the cathode electrode in the test environment for about 20 minutes to about 40 minutes.",
"The adhesive tape is peeled from the cathode electrode by a testing machine at a speed of about 300 mm/min±10 mm/min.",
"The test results are shown in Table 2, revealing that the cathode binders of Examples 2, 3, and 5 have a stronger binding force than Comparative Example 1.TABLE 2 Sample Sample Maximum Sample Thickness/μm Width/mm load/N Example 2 58 ± 2 20 3.6 Example 3 58 ± 2 20 3.2 Example 5 58 ± 2 20 3.7 Comparative 58 ± 2 20 1.6 Example 1 Finally, it is to be understood that the above-described embodiments are intended to illustrate rather than limit the present disclosure.",
"Variations may be made to the embodiments without departing from the spirit of the present disclosure as claimed.",
"Elements associated with any of the above embodiments are envisioned to be associated with any other embodiments.",
"The above-described embodiments illustrate the scope of the present disclosure but do not restrict the scope of the present disclosure."
]
] |
Patent_15871079
|
[
[
"ORGANIC LIGHT EMITTING DISPLAY APPARATUS",
"An organic light emitting display apparatus that includes a substrate, an organic light emitting unit formed on the substrate, a reflection member disposed on a non-light emitting region of the organic light emitting unit, and a sealing member that seals the organic light emitting unit.",
"The organic light emitting display apparatus can function as a display apparatus or a mirror."
],
[
"1.An organic light emitting display apparatus comprising: a substrate; an organic light emitting unit on the substrate; a reflection member at a non-light emitting region of the organic light emitting unit; and a light absorption layer on a surface of the reflection member facing the organic light emitting unit.",
"2-35.",
"(canceled)"
],
[
"<SOH> BACKGROUND OF THE INVENTION <EOH>"
],
[
"<SOH> SUMMARY OF THE INVENTION <EOH>To address the above and/or other problems, aspects of the present invention provide an organic light emitting display apparatus that can also function as a mirror where an organic light emitting device of the organic light emitting display apparatus does not generate light.",
"One aspect of the present invention provides an organic light emitting display apparatus comprising: a substrate; an organic light emitting unit formed on the substrate; a reflection member disposed on a non-light emitting region of the organic light emitting unit; and a sealing member that seals the organic light emitting unit.",
"The sealing member may be separately disposed from the organic light emitting unit.",
"The organic light emitting display apparatus may further comprise a combining member that combines the substrate and the sealing member.",
"The combining member may be disposed along edges of the substrate.",
"The combining member may comprise spacers and a sealant.",
"The reflection member may be formed on a surface of the sealing member that faces the organic light emitting unit to correspond to the non-light emitting region of the organic light emitting unit.",
"The organic light emitting display apparatus may further comprise an optical absorption layer on a surface of the reflection member facing the organic light emitting unit.",
"The reflection member may be formed of a material that reflects light proceeding towards the reflection member from outside of the organic light emitting display apparatus.",
"The reflection member may be formed of a metal that reflects light proceeding towards the reflection member from outside of the organic light emitting display apparatus.",
"The reflection member may be formed of Al.",
"The reflection member may have a thickness of 250 Å or more.",
"Another aspect of the present invention provides an organic light emitting display apparatus comprising: a substrate; a pixel electrode formed on the substrate; a pixel defining layer that is formed on the pixel electrode and exposes a portion of the pixel electrode; an intermediate layer having a light emitting layer formed on the exposed pixel electrode; a facing electrode formed on the pixel defining layer and the intermediate layer; and a reflection member formed on the facing electrode to correspond to the pixel defining layer.",
"The reflection member may be formed of a material that reflects light proceeding towards the reflection member from outside of the organic light emitting display apparatus.",
"The reflection member may be formed of a metal that reflects light proceeding towards the reflection member from outside of the organic light emitting display apparatus.",
"The reflection member may be formed of Al.",
"The reflection member may have a thickness of 250 Å or more.",
"The pixel electrode may be a reflective electrode and the facing electrode may be a transparent electrode.",
"A third aspect of the present invention provides an organic light emitting display apparatus comprising: a substrate; a pixel electrode formed on the substrate; a pixel defining layer that is formed on the pixel electrode and exposes a portion of the pixel electrode; an intermediate layer having a light emitting layer formed on the exposed pixel electrode; a reflection member formed on the facing electrode to correspond to the pixel defining layer; and a facing electrode formed to cover the intermediate layer and the reflection member.",
"The reflection member may be formed of a material that reflects light proceeding towards the reflection member from outside of the organic light emitting display apparatus.",
"The reflection member may be formed of a metal that reflects light proceeding towards the reflection member from outside of the organic light emitting display apparatus.",
"The reflection member may be formed of Al.",
"The reflection member may have a thickness of 250 Å or more.",
"The pixel electrode may be a reflective electrode and the facing electrode may be a transparent electrode.",
"An organic light emitting display apparatus having the above structure can function both as a display apparatus and a mirror.",
"Additional aspects and/or advantages of the invention will be set forth in part in the description which follows and, in part, will be obvious from the description, or may be learned by practice of the invention."
],
[
"CROSS-REFERENCE TO RELATED APPLICATION This application claims the benefit of Korean Patent Application No.",
"2008-24906, filed Mar.",
"18, 2008 in the Korean Intellectual Property Office, the disclosure of which is incorporated herein by reference.",
"BACKGROUND OF THE INVENTION 1.Field of the Invention Aspects of the present invention relate to an organic light emitting display apparatus, and more particularly, to an organic light emitting display apparatus functioning both as a display apparatus and as a mirror.",
"2.Description of the Related Art Organic light emitting display apparatuses are emissive display apparatuses that generate light by re-combination of electrons and holes in a light emitting layer when a voltage is applied to an organic film that includes an anode, a cathode, and an organic light emitting layer interposed between the anode and the cathode.",
"Organic light emitting display apparatuses are expected to be the next generation of display apparatuses because of their advantages such as light weight, low thickness, wide viewing angle, short response time, and low power consumption as compared to cathode ray tubes or liquid crystal displays.",
"In an organic light emitting display apparatus, an organic light emitting device is disposed in a display region.",
"The organic light emitting display apparatus includes a pixel electrode and a facing electrode facing each other, and a light emitting layer interposed between the pixel electrode and the facing electrode.",
"Since the organic light emitting display apparatus is easily damaged by foreign materials such as moisture or oxygen penetrating from the outside, the organic light emitting display apparatus is sealed so that penetration of foreign materials from the outside can be prevented.",
"SUMMARY OF THE INVENTION To address the above and/or other problems, aspects of the present invention provide an organic light emitting display apparatus that can also function as a mirror where an organic light emitting device of the organic light emitting display apparatus does not generate light.",
"One aspect of the present invention provides an organic light emitting display apparatus comprising: a substrate; an organic light emitting unit formed on the substrate; a reflection member disposed on a non-light emitting region of the organic light emitting unit; and a sealing member that seals the organic light emitting unit.",
"The sealing member may be separately disposed from the organic light emitting unit.",
"The organic light emitting display apparatus may further comprise a combining member that combines the substrate and the sealing member.",
"The combining member may be disposed along edges of the substrate.",
"The combining member may comprise spacers and a sealant.",
"The reflection member may be formed on a surface of the sealing member that faces the organic light emitting unit to correspond to the non-light emitting region of the organic light emitting unit.",
"The organic light emitting display apparatus may further comprise an optical absorption layer on a surface of the reflection member facing the organic light emitting unit.",
"The reflection member may be formed of a material that reflects light proceeding towards the reflection member from outside of the organic light emitting display apparatus.",
"The reflection member may be formed of a metal that reflects light proceeding towards the reflection member from outside of the organic light emitting display apparatus.",
"The reflection member may be formed of Al.",
"The reflection member may have a thickness of 250 Å or more.",
"Another aspect of the present invention provides an organic light emitting display apparatus comprising: a substrate; a pixel electrode formed on the substrate; a pixel defining layer that is formed on the pixel electrode and exposes a portion of the pixel electrode; an intermediate layer having a light emitting layer formed on the exposed pixel electrode; a facing electrode formed on the pixel defining layer and the intermediate layer; and a reflection member formed on the facing electrode to correspond to the pixel defining layer.",
"The reflection member may be formed of a material that reflects light proceeding towards the reflection member from outside of the organic light emitting display apparatus.",
"The reflection member may be formed of a metal that reflects light proceeding towards the reflection member from outside of the organic light emitting display apparatus.",
"The reflection member may be formed of Al.",
"The reflection member may have a thickness of 250 Å or more.",
"The pixel electrode may be a reflective electrode and the facing electrode may be a transparent electrode.",
"A third aspect of the present invention provides an organic light emitting display apparatus comprising: a substrate; a pixel electrode formed on the substrate; a pixel defining layer that is formed on the pixel electrode and exposes a portion of the pixel electrode; an intermediate layer having a light emitting layer formed on the exposed pixel electrode; a reflection member formed on the facing electrode to correspond to the pixel defining layer; and a facing electrode formed to cover the intermediate layer and the reflection member.",
"The reflection member may be formed of a material that reflects light proceeding towards the reflection member from outside of the organic light emitting display apparatus.",
"The reflection member may be formed of a metal that reflects light proceeding towards the reflection member from outside of the organic light emitting display apparatus.",
"The reflection member may be formed of Al.",
"The reflection member may have a thickness of 250 Å or more.",
"The pixel electrode may be a reflective electrode and the facing electrode may be a transparent electrode.",
"An organic light emitting display apparatus having the above structure can function both as a display apparatus and a mirror.",
"Additional aspects and/or advantages of the invention will be set forth in part in the description which follows and, in part, will be obvious from the description, or may be learned by practice of the invention.",
"BRIEF DESCRIPTION OF THE DRAWINGS These and/or other aspects and advantages of the invention will become apparent and more readily appreciated from the following description of the embodiments, taken in conjunction with the accompanying drawings of which: FIG.",
"1 is a schematic cross-sectional view of an organic light emitting display apparatus according to an embodiment of the present invention; FIG.",
"2 is an enlarged cross-sectional view of portion A of FIG.",
"1; FIG.",
"3 is a schematic cross-sectional view of an organic light emitting display apparatus according to a second embodiment of the present invention; and FIG.",
"4 is a schematic cross-sectional view of an organic light emitting display apparatus according to a third embodiment of the present invention.",
"DETAILED DESCRIPTION OF THE EMBODIMENTS Reference will now be made in detail to the present embodiments of the present invention, examples of which are illustrated in the accompanying drawings, wherein like reference numerals refer to the like elements throughout.",
"The embodiments are described below in order to explain the present invention by referring to the figures.",
"Moreover, it is to be understood that where it is stated herein that one layer is “formed on” or “disposed on” a second layer, or interposed between two layers, the first layer may be formed or disposed directly on the other layers or there may be intervening layers between the first layer and the other layers.",
"Further, as used herein, the term “formed on” is used with the same meaning as “located on” or “disposed on” or “interposed” and is not meant to be limiting regarding any particular fabrication process.",
"FIG.",
"1 is a schematic cross-sectional view of an organic light emitting display apparatus 100 according to an embodiment of the present invention.",
"FIG.",
"2 is an enlarged cross-sectional view of portion A of FIG.",
"1.Referring to FIGS.",
"1 and 2, the organic light emitting display apparatus 100 includes a substrate 101, an organic light emitting unit 110, a reflection member 103, a light absorption layer 104, and a combining member 107.The substrate 101 can be formed of a material such as transparent glass, a plastic sheet, or silicon, and may be transparent as well as flexible or rigid.",
"The substrate 101 is not limited to the above materials, and can be also formed of a metal plate.",
"The organic light emitting unit 110 is formed on the substrate 101.In the case of an active matrix organic light emitting display apparatus, the organic light emitting unit 110 can include one or more organic light emitting devices 130 and thin film transistors 120.The organic light emitting devices 130 and the thin film transistors 120 will now be described.",
"As depicted in FIG.",
"2, the organic light emitting unit 110 includes a light emitting region B where the organic light emitting device 130 is formed and a non-light emitting region C where the organic light emitting device 130 is not formed.",
"The reflection member 103 can be disposed in the non-light emitting region C, which will be described later.",
"This embodiment is not limited to an active matrix organic light emitting display apparatus but can also be applied to a passive matrix organic light emitting display apparatus.",
"A sealing member 102 is disposed on an upper side of the organic light emitting unit 110 and is joined to the substrate 101.That is, as depicted in FIG.",
"1, the sealing member 102 can be disposed separately from the organic light emitting unit 110, and can be joined to the substrate 101 via the combining member 107.The sealing member 102 can be glass or a plastic, for example, an acrylic.",
"In the case of a top emission type organic light emitting display apparatus, the sealing member 102 can be formed of an electrical insulating material having high transparency with respect to light generated from the organic light emitting unit 110.The electrical insulating material can be a transparent glass such as alkali glass or non-alkali glass; a transparent polymer such as polyethylene terephthalate, polycarbonate, polyether sulfone, polyvinyl fluoride (PVF) or an acrylic; a transparent ceramic such as zirconia; or quartz.",
"The reflection member 103 can be disposed in the non-light emitting region C of the organic light emitting unit 110.In particular, in the organic light emitting display apparatus 100 depicted in FIG.",
"1, the reflection member 103 can be formed on a surface of the sealing member 102 facing the organic light emitting unit 110 so that the reflection member 103 can correspond to the non-light emitting region C of the organic light emitting unit 110.More specifically, as depicted in FIG.",
"2, the reflection member 103 can be formed on the surface of the sealing member 102 that faces the organic light emitting unit 110 so that the reflection member 103 can correspond to a pixel defining layer 112, both of which are positioned in the non-light emitting region C. The reflection member 103 can reflect light proceeding towards the organic light emitting unit 110 from outside of the organic light emitting display apparatus 100.Thus, when the organic light emitting unit 110 does not emit light, the reflection member 103 can function as a mirror by reflecting light proceeding towards the organic light emitting unit 110 from outside of the organic light emitting display apparatus 100.Also, since the reflection member 103 is disposed in the non-light emitting region C of the organic light emitting unit 110, and not in the light emitting region B, an optical path through which light emitted from the light emitting region B can be emitted to the outside of the organic light emitting display apparatus 100 can be ensured.",
"In the case of a top emission type organic light emitting display apparatus 100, since the reflection member 103 is disposed in the non-light emitting region C, the light emission surface can function not only as a display unit but also as a mirror.",
"In the case of a bottom emission type organic light emitting display apparatus, the light emission area D can function as a display unit and the non-emission surface can function as a mirror.",
"The reflection member 103 is formed of a material that can reflect light proceeding towards the reflection member 103 from outside of the organic light emitting display apparatus 100.For example, the reflection member 103 can be formed of a metal selected from the group consisting of Al, Cr, Ag, Fe, Pt and Hg.",
"Preferably, Al may be used to form the reflection member 103.When Al is used, and the reflection member 103 has a thickness greater than 250 Å, the reflectivity of visible light is 75 to 90%.",
"The light absorption layer 104 can be formed on a surface of the reflection member 103 that faces the organic light emitting unit 110.The light absorption layer 104 absorbs light emitted from the organic light emitting unit 110 and passing through the reflection member 103.The light absorption layer 104 can be a black matrix.",
"The light absorption layer 104 can be formed of a metal such as Cr or Mo having relatively low reflectivity, or can be formed of an opaque insulating material such as CrOx or MoOx.",
"The combining member 107 joins the substrate 101 with the sealing member 102.The combining member 107 can be disposed on edges of the substrate 101, and the organic light emitting unit 110 is therefore surrounded by the combining member 107.The combining member 107 can include a sealant 105 and spacers 106.The spacers 106 are fully enclosed in the sealant 105, and the spacers 106 can maintain a gap t between the substrate 101 and the sealing member 102.The gap t between the substrate 101 and the sealing member 102 can be controlled by controlling the length of the spacers 106.Also, a mura effect such as a Newton ring phenomenon that can occur between the substrate 101 and the sealing member 102 can be prevented by controlling the length of the gap t of the spacers 106.As cited above, FIG.",
"2 is an enlarged cross-sectional view of portion of A of FIG.",
"1, that is, the specific configuration of the organic light emitting unit 110.Referring to FIG.",
"2, at least one thin film transistor 120 is formed on the substrate 101 and at least one organic light emitting device 130 is formed on a corresponding thin film transistor 120.The organic light emitting device 130 can include a pixel electrode 111 electrically connected to the thin film transistor 120, a facing electrode 114 disposed on the entire surface of the substrate 101, and an intermediate layer 113 that includes at least one light emitting layer and is disposed between the pixel electrode 111 and the facing electrode 114.The thin film transistor 120 having a gate electrode 124, a source electrode 126a and a drain electrode 126b, a semiconductor layer 122, a gate insulating film 123, and an interlayer insulating layer 125 is formed on the substrate 101.Also, the shape of the thin film transistor 120 is not limited to the shape depicted in FIG.",
"2, and various thin film transistors such as an organic thin film transistor in which the semiconductor layer 122 is formed of an organic material or a silicon thin film transistor in which the semiconductor layer 122 is formed of silicon can be used.",
"If necessary, a buffer layer 121 formed of silicon oxide SiO2, silicon nitride Si3N4, or silicon oxynitride SiOxNy can further be included between the thin film transistor 120 and the substrate 101.The buffer layer 121 improves the device characteristics by preventing penetration of impurities generated from the substrate 101 into the semiconductor layer 122.The semiconductor layer 122 is formed on the buffer layer 121, and can be an amorphous silicon film or a crystalline silicon film.",
"The semiconductor layer 122 can include a source region 122a, a drain region 122c, and a channel region 122b.",
"The semiconductor layer 122 is enclosed by the gate insulating film 123.The gate electrode 124 that corresponds to the semiconductor layer 122 and the interlayer insulating layer 125 that encloses the gate electrode 124 are formed on an upper surface of the gate insulating film 123.The source electrode 126a and the drain electrode 126b respectively contact the source region 122a and the drain region 122c through contact holes (not shown in the Figures) that are formed in the gate insulating film 123 and the interlayer insulating layer 125.The organic light emitting device 130 includes the pixel electrode 111 and the facing electrode 114, that face each other, and the intermediate layer 113 that is interposed between the pixel electrode 111 and the facing electrode 114 and is formed of an organic material.",
"The intermediate layer 113 includes at least one light emitting layer, and can include a plurality of layers, which will be described later.",
"The pixel electrode 111 functions as an anode electrode, and the facing electrode 114 functions as a cathode electrode.",
"Of course, the polarity of the pixel electrode 111 and the facing electrode 114 can be designed with opposite polarity.",
"The pixel electrode 111 can be a transparent electrode or a reflective electrode.",
"If the pixel electrode 111 is a transparent electrode, the pixel electrode 111 can be formed of ITO, IZO, ZnO, or In2O3.If the pixel electrode 111 is a reflective electrode, the pixel electrode 111 can include a reflective film formed of Ag, Mg, Al, Pt, Pd, Au, Ni, Nd, Ir, Cr, or a combination or alloy of these metals and a film formed of ITO, IZO, ZnO, or In2O3 formed on the reflective film.",
"The facing electrode 114 can also be a transparent electrode or a reflective electrode.",
"If the facing electrode 114 is a transparent electrode, the facing electrode 114 can include a film deposited to face the intermediate layer 113 interposed between the pixel electrode 111 and the facing electrode 114 using Li, Ca, LiF/Ca, LiF/Al, Al, Mg, or a combination of these materials and an auxiliary electrode or a bus electrode layer (not shown in the Figures) that is formed of a material used to form the transparent electrode, such as ITO, IZO, ZnO, or In2O3, on the film.",
"If the facing electrode 114 is a reflective electrode, the facing electrode 114 can be formed by depositing Li, Ca, LiF/Ca, Al, Mg, or a combination of these materials.",
"Meanwhile, the pixel defining layer 112 is formed on an outer side of the pixel electrode 111 in order to cover the edges of the pixel electrode 111.Beside the function of defining a light emission region, the pixel defining layer 112, prevents the pixel electrode 111 and the facing electrode 114 from electrically disconnecting from each other by preventing the occurrence of an electric field concentration phenomenon at an edge portion of the pixel electrode 111 through widening the gap between the edge of the pixel electrode 111 and the facing electrode 114.Various intermediate layers 113 that include at least a light emitting layer can be included between the pixel electrode 111 and the facing electrode 114.The intermediate layer 113 can be formed of a small molecule organic material or a polymer organic material.",
"If the intermediate layer 113 is formed of a small molecule organic material, the intermediate layer can be formed in a single or a composite structure by stacking a hole injection layer (HIL), a hole transport layer (HTL), an emission layer (EML), an electron transport layer (ETL), and an electron injection layer (EIL) (the individual layers are not separately shown in the Figures).",
"An organic material that can be used to form the intermediate layer 113 includes copper phthalocyanine (CuPc), N,N′-Di(naphthalene-1-yl)-N,N′-diphenyl-benzidine (α-NPB), and tris-8-hydroxyquinoline aluminum (Alq3).",
"The small molecule organic material layers can be formed by a vacuum evaporation method using masks.",
"If the intermediate layer 113 is formed of a polymer organic material, the intermediate layer 113 can have a structure in which an HTL and an EML are included.",
"The polymer HTL can be formed of poly-(2,4)-ethylene-dihydroxy thiophene (PEDOT) and the light emitting layer can be formed of poly-phenylenevinylene (PPV) or polyfluorene.",
"The organic light emitting device 130 is electrically connected to the thin film transistor 120 formed thereunder.",
"In this case, if a planarizing film 127 covering the thin film transistor 120 is formed, the organic light emitting device 130 is disposed on the planarizing film 127, and the pixel electrode 111 of the organic light emitting device 130 is electrically connected to the thin film transistor 120 through a contact hole (not shown in the Figures) that is formed in the planarizing film 127.FIG.",
"3 is a schematic cross-sectional view of an organic light emitting display apparatus 200 according to a second embodiment of the present invention.",
"The organic light emitting display apparatus 200 of FIG.",
"3 is different from the organic light emitting display apparatus 100 of FIGS.",
"1 and 2 in that a reflection member 203 is positioned at a different location from the reflection member 103.That is, a substrate 201, an organic light emitting unit 210, a thin film transistor 220, a buffer layer 221, a semiconductor layer 222, a source region 222a, a drain region 222c, a channel region 222b, a gate electrode 224, a source electrode 226a, a drain electrode 226b, a gate insulating film 223, an interlayer insulating layer 225, a planarizing film 227, a pixel defining layer 212, an organic light emitting device 230, a pixel electrode 211, a intermediate layer 213, a facing electrode 214, and a sealing member 202 in the organic light emitting display apparatus 200 of FIG.",
"3 all are respectively identical to the substrate 101, the thin film transistor 120, the buffer layer 121, the semiconductor layer 122, the source region 122a, the drain region 122c, the channel region 122b, the gate electrode 124, the source electrode 126a, the drain electrode 126b, the gate insulating film 123, the interlayer insulating layer 125, the planarizing film 127, the pixel defining layer 112, the organic light emitting device 130, the pixel electrode 111, the intermediate layer 113, the facing electrode 114, and the sealing member 102 in the organic light emitting display apparatus 100 of FIG.",
"2, and thus, the descriptions thereof will not be repeated.",
"Referring to FIG.",
"3, the reflection member 203 is disposed in a non-light emitting region C of the organic light emitting unit 210.More specifically, the reflection member 203 can be formed on the facing electrode 214 to correspond to the pixel defining layer 212.The reflection member 203 of the organic light emitting display apparatus 200 and the reflection member 103 of the organic light emitting display apparatus 100 are both positioned in the non-light emitting region C. However, the reflection member 203 of the organic light emitting display apparatus 200 is not disposed on the sealing member 202 but on the facing electrode 214 formed on the pixel defining layer 212.In the case of the top emission type organic light emitting display apparatus 200, light generated from the organic light emitting device 230 is emitted to the outside through the sealing member 202.However, since the reflection member 203 is disposed on the facing electrode 214 formed on the pixel defining layer 212 which is not formed in a light emitting path, the optical extraction rate can be increased.",
"The reflection member 203 can be formed of a material that can reflect light proceeding towards the reflection member 203 from outside of the organic light emitting display apparatus 200, and in particular, can be formed of a metal that can reflect light.",
"For example, the reflection member 203 can be formed of Al, Cr, Ag, Fe, Pt or Hg.",
"Preferably, the metal can be Al.",
"If Al is used, the reflection member 203 has a thickness of 250 Å or greater, and the reflected percentage of visible light is 75 to 90%.",
"Since the reflection member 203 is formed of a material that can reflect light proceeding towards the reflection member 203 from outside of the organic light emitting display apparatus 200, when the organic light emitting device 230 does not emit light, the reflection member 203 can perform as a mirror by reflecting light entering from the outside.",
"In the organic light emitting display apparatus 200 having the above configuration, a single light emission face can simultaneously perform as a display and as a mirror.",
"FIG.",
"4 is a schematic cross-sectional view of an organic light emitting display apparatus 300 according to another embodiment of the present invention.",
"The organic light emitting display apparatus 300 of FIG.",
"4 is different from the organic light emitting display apparatus 100 of FIGS.",
"1 and 2 in that a reflection member 303 is positioned at a different location from the reflection member 103.That is, a substrate 301, an organic light emitting unit 310, a thin film transistor 320, a buffer layer 321, a semiconductor layer 322, a source region 322a, a drain region 322c, a channel region 322b, a gate electrode 324, a source electrode 326a, a drain electrode 326b, a gate insulating film 323, an interlayer insulating layer 325, a planarizing film 327, a pixel defining layer 312, an organic light emitting device 330, a pixel electrode 311, a intermediate layer 313, a facing electrode 314, and a sealing member 302 in the organic light emitting display apparatus 300 of FIG.",
"4 all are respectively identical to the substrate 101, the thin film transistor 120, the buffer layer 121, the semiconductor layer 122, the source region 122a, the drain region 122c, the channel region 122b, the gate electrode 124, the source electrode 126a, the drain electrode 126b, the gate insulating film 123, the interlayer insulating layer 125, the planarizing film 127, the pixel defining layer 112, the organic light emitting device 130, the pixel electrode 111, the intermediate layer 113, the facing electrode 114, and the sealing member 102 in the organic light emitting display apparatus 100 of FIG.",
"2, and thus, the descriptions thereof will not be repeated.",
"Referring to FIG.",
"4, the reflection member 303 is disposed on a non-light emitting region C. More specifically, the reflection member 303 is disposed on the pixel defining layer 312, and the facing electrode 314 can be formed to cover the intermediate layer 313 and the reflection member 303.In the case of the top emission type organic light emitting display apparatus 300, since the facing electrode 314 is a transparent electrode, although the reflection member 303 is covered by the facing electrode 314, light proceeding towards the reflection member 303 from the outside can be reflected.",
"Thus, the organic light emitting display apparatus 300 can function as a mirror where the organic light emitting device 330 does not emit light.",
"Since the reflection member 303 is not disposed on a light emitting path in the organic light emitting device 330, the optical extraction rate of the organic light emitting display apparatus 300 can be increased.",
"The reflection member 303 is formed of a material that can reflect light proceeding towards the reflection member 303 from the outside of the organic light emitting display apparatus 300, and in particular, can be formed of a metal that can reflect light.",
"For example, the reflection member 303 can be formed of Al, Cr, Ag, Fe, Pt or Hg.",
"Preferably the reflection member 303 can be formed of Al.",
"As described above, if Al is used, the reflection member 303 has a thickness of 250 Å or greater, and the reflected percentage of visible light is 75 to 90%.",
"Although a few embodiments of the present invention have been shown and described, it would be appreciated by those skilled in the art that changes may be made in this embodiment without departing from the principles and spirit of the invention, the scope of which is defined in the claims and their equivalents."
]
] |
Patent_15871084
|
[
[
"HEATER UNIT, STEERING WHEEL AND METHOD OF MANUFACTURING HEATER UNIT",
"The present invention provides a steering wheel and a heater unit used for the steering wheel that does not give discomfort to a user when operating the steering wheel.",
"A heater unit 31 is comprised of a substrate 10 made of a polymeric foam; and a cord-shaped heater 1 arranged on the substrate 10, wherein a thickness of the substrate 10 is thinner at a portion on which the cord-shaped heater 1 is arranged than other area so that the portion is formed along a shape of the cord-shaped heater 1 and the heater unit 31 is approximately flat.",
"A steering wheel, comprised of the above described heater unit; a wheel core material; and a covering material, wherein the heater unit is arranged between the wheel core material and the covering material."
],
[
"1.A heater unit, comprising: a substrate made of a polymeric foam; and a cord-shaped heater arranged on the substrate, wherein a thickness of the substrate is thinner at a portion on which the cord-shaped heater is arranged than other area so that the portion is formed along a shape of the cord-shaped heater and the heater unit is approximately flat.",
"2.The heater unit according to claim 1, wherein the thickness of the substrate is approximately constant at the portion on which the cord-shaped heater is arranged.",
"3.The heater unit according to claim 1, wherein a heat-fusing portion is formed on an outermost layer of the cord-shaped heater.",
"4.The heater unit according to claim 3, wherein the heat-fusing portion of the cord-shaped heater is melted and permeated in the polymeric foam to form a fixed portion.",
"5.The heater unit according to claim 4, wherein the thickness of the fixed portion exceeds 60% of the thickness of the substrate.",
"6.The heater unit according to claim 4, wherein the thickness of the fixed portion is approximately same as the thickness of the substrate.",
"7.The heater unit according to claim 4, wherein the width of the fixed portion exceeds three times of the width of a core material.",
"8.The heater unit according to claim 7, wherein the width of the fixed portion does not exceed five times of the width of the core material.",
"9.The heater unit according to claim 7, wherein the thickness of the fixed portion exceeds 1.3 times of the width of the core material.",
"10.The heater unit according to claim 9, wherein the thickness of the fixed portion does not exceed 2.5 times of the width of the core material.",
"11.The heater unit according to claim 1, wherein nothing other than the cord-shaped heater is arranged on the substrate at a surface on which the cord-shaped heater is arranged.",
"12.The heater unit according to claim 1, wherein the heater unit is arranged between a wheel core material and a covering material, and in the heater unit, the covering material is adhered to the substrate at a side on which the cord-shaped heater is arranged.",
"13.The heater unit according to claim 1, wherein the substrate is formed by laminating a plurality of formed bodies having different porosity, and the porosity is higher at the foamed body on which the cord-shaped heater is arranged than the porosity of the other foamed bodies.",
"14.A method of manufacturing a heater unit, the heater unit comprising: a substrate made of a polymeric foam; and a cord-shaped heater, the method comprising the steps of: arranging the cord-shaped heater on the substrate in a predetermined pattern shape; and thermally compressing the substrate by a flat plate, wherein a thickness of the substrate is thinner at a portion on which the cord-shaped heater is arranged than other area so that the portion is formed along a shape of the cord-shaped heater and the heater unit is approximately flat.",
"15.The method of manufacturing the heater unit according to claim 14, wherein the thickness of the substrate is approximately constant at the portion on which the cord-shaped heater is arranged.",
"16.The method of manufacturing the heater unit according to claim 14, wherein a heat-fusing portion is formed on an outermost layer of the cord-shaped heater, and the heat-fusing portion of the cord-shaped heater is melted and permeated in the polymeric foam to form a fixed portion.",
"17.A steering wheel, comprising: the heater unit according to claim 1; a wheel core material; and a covering material, wherein the heater unit is arranged between the wheel core material and the covering material.",
"18.The steering wheel according to claim 17, wherein a heat-fusing portion is formed on an outermost layer of the cord-shaped heater, and the heat-fusing portion of the cord-shaped heater is melted and permeated in the polymeric foam to form a fixed portion.",
"19.The steering wheel according to claim 17, wherein in the heater unit, the covering material is adhered to the substrate at a side on which the cord-shaped heater is arranged."
],
[
"<SOH> BACKGROUND OF THE INVENTION <EOH>"
],
[
"<SOH> BRIEF SUMMARY OF THE INVENTION <EOH>However, in the conventional heater units such as the above described Patent documents 1 and 2, as shown in FIG.",
"8 , a cord-shaped heater 101 is simply arranged on substrates 110 , 110 ′.",
"Therefore, thickness at a portion on which the cord-shaped heater 101 is arranged is thicker than other area.",
"Consequently, a user feels uneven thickness when gripping the steering wheel and feels uncomfortable when operating the steering wheel.",
"The present invention provides a steering wheel that does not make the user feel uncomfortable when operating the steering wheel and a heater unit used for the steering wheel.",
"A heater unit of the present invention is comprised of a substrate made of a polymeric foam; and a cord-shaped heater arranged on the substrate, wherein a thickness of the substrate is thinner at a portion on which the cord-shaped heater is arranged than other area so that the portion is formed along a shape of the cord-shaped heater and the heater unit is approximately flat.",
"In the above described cord-shaped heater, a heat-fusing portion can be formed on an outermost layer of the cord-shaped heater.",
"A steering wheel of the present invention is comprised of the above described heater unit; a wheel core material; and a covering material, wherein the heater unit is arranged between the wheel core material and the covering material.",
"In a method of manufacturing a heater unit of the present invention, the heater unit comprising: a substrate made of a polymeric foam; and a cord-shaped heater, the method comprising the steps of: arranging the cord-shaped heater on the substrate in a predetermined pattern shape; and thermally compressing the substrate by a flat plate, wherein a thickness of the substrate is thinner at a portion on which the cord-shaped heater is arranged than other area so that the portion is formed along a shape of the cord-shaped heater and the heater unit is approximately flat.",
"By using the present invention, the surface of the cord-shaped heater is approximately flat without forming unevenness.",
"Therefore, a user does not feel discomfort when operating the steering wheel."
],
[
"CROSS-REFERENCES TO RELATED APPLICATIONS This Application claims the benefit of priority and is a Continuation application of the prior International Patent Application No.",
"PCT/JP2016/070383, with an international filing date of Jul.",
"11, 2016, which designated the United States, and is related to the U.S. patent application Ser.",
"No.",
"14/820,570, filed Aug. 7, 2015, the entire disclosures of all applications are expressly incorporated by reference in their entirety herein.",
"BACKGROUND OF THE INVENTION 1.Field of the Invention The present invention relates to a steering wheel used, for example, for an automobile and a boat, and a heater unit used for heating a wheel portion of the steering wheel.",
"In particular, the present invention relates to the heater unit and the steering wheel that does not give discomfort to a user when operating the steering wheel.",
"2.Description of the Related Art Conventionally, it is proposed that the heater unit is installed on the wheel portion of the steering wheel to warm hands of a driver in a cold condition.",
"As shown in FIG.",
"3, a steering wheel 71 includes a wheel portion 72, a spoke portion 73 and a boss portion 74.The wheel portion 72 includes a wheel core material 77 and a covering material 78 formed of a synthetic resin, a textile, a leather or the like.",
"A heater unit 31 is installed between the wheel core material 77 and the covering material 78.The heater unit 31 is connected to a not illustrated lead wire passed through the spoke portion 73 and the boss portion 74 to receive power supply.",
"As the heater unit installed on the steering wheel, a cord-shaped heater arranged on a substrate in a predetermined pattern shape shown in Patent documents 1 and 2 is known.",
"Here, various foamed resin sheets, foamed rubber sheets, rubber sheets, nonwoven fabrics and woven fabrics are disclosed as the substrate.",
"[Patent document 1] Japanese Unexamined Patent Application Publication No.",
"2003-317905: Matsushita Electric Industrial Co., Ltd. [Patent document 2] Japanese Unexamined Patent Application Publication No.",
"2011-121477: KURABE INDUSTRIAL CO., LTD. BRIEF SUMMARY OF THE INVENTION However, in the conventional heater units such as the above described Patent documents 1 and 2, as shown in FIG.",
"8, a cord-shaped heater 101 is simply arranged on substrates 110, 110′.",
"Therefore, thickness at a portion on which the cord-shaped heater 101 is arranged is thicker than other area.",
"Consequently, a user feels uneven thickness when gripping the steering wheel and feels uncomfortable when operating the steering wheel.",
"The present invention provides a steering wheel that does not make the user feel uncomfortable when operating the steering wheel and a heater unit used for the steering wheel.",
"A heater unit of the present invention is comprised of a substrate made of a polymeric foam; and a cord-shaped heater arranged on the substrate, wherein a thickness of the substrate is thinner at a portion on which the cord-shaped heater is arranged than other area so that the portion is formed along a shape of the cord-shaped heater and the heater unit is approximately flat.",
"In the above described cord-shaped heater, a heat-fusing portion can be formed on an outermost layer of the cord-shaped heater.",
"A steering wheel of the present invention is comprised of the above described heater unit; a wheel core material; and a covering material, wherein the heater unit is arranged between the wheel core material and the covering material.",
"In a method of manufacturing a heater unit of the present invention, the heater unit comprising: a substrate made of a polymeric foam; and a cord-shaped heater, the method comprising the steps of: arranging the cord-shaped heater on the substrate in a predetermined pattern shape; and thermally compressing the substrate by a flat plate, wherein a thickness of the substrate is thinner at a portion on which the cord-shaped heater is arranged than other area so that the portion is formed along a shape of the cord-shaped heater and the heater unit is approximately flat.",
"By using the present invention, the surface of the cord-shaped heater is approximately flat without forming unevenness.",
"Therefore, a user does not feel discomfort when operating the steering wheel.",
"BRIEF DESCRIPTION OF THE DRAWINGS FIG.",
"1 is a plan view showing a configuration of a heater unit concerning the present invention.",
"FIG.",
"2 is a cross-sectional view showing a principal part of the heater unit concerning the present invention in an enlarged state.",
"FIG.",
"3 is a perspective view showing a state that the heater unit of the present invention is embedded in a steering wheel by partially cutting the steering wheel.",
"FIG.",
"4 is a side view showing a configuration of a cord-shaped heater used in the present invention by partly cutting the cord-shaped heater.",
"FIG.",
"5 is a side view showing a configuration of a cord-shaped heater used in the present invention by partly cutting the cord-shaped heater.",
"FIG.",
"6 is a drawing showing a configuration of a hot press-type heater manufacturing apparatus used in the present invention.",
"FIG.",
"7 is a partial perspective view showing a state that the cord-shaped heater is arranged in a predetermined pattern shape in the heater unit of the present invention.",
"FIG.",
"8 is a cross-sectional view showing a principal part of the conventional heater unit in an enlarged state.",
"FIG.",
"9 is an SEM image of a principal part of the cross-sectional view of the heater unit of the first embodiment.",
"FIG.",
"10 is a cross-sectional view showing a principal part of the heater unit of the third embodiment.",
"FIG.",
"11 is an SEM image of a principal part of the cross-sectional view of the heater unit of the third embodiment.",
"FIG.",
"12A is a drawing showing a surface appearance of the heater unit.",
"FIG.",
"12B is a drawing showing a surface appearance of the heater unit.",
"FIG.",
"12C is a drawing showing a surface appearance of the heater unit.",
"FIG.",
"13A is a drawing showing a reverse surface appearance of the heater unit.",
"FIG.",
"13B is a drawing showing a reverse surface appearance of the heater unit.",
"FIG.",
"13C is a drawing showing a reverse surface appearance of the heater unit.",
"FIG.",
"14A is a SEM image of cross-sectional views of the heater unit.",
"FIG.",
"14B is a SEM image of cross-sectional views of the heater unit.",
"FIG.",
"14C is a SEM image of cross-sectional views of the heater unit.",
"DETAILED DESCRIPTION OF THE INVENTION Hereafter, preferable embodiments of the present invention will be explained with reference to the drawings.",
"First Embodiment At first, a configuration of a cord-shaped heater 1 of the present embodiment will be explained.",
"The cord-shaped heater 1 of the present embodiment has a configuration shown in FIG.",
"5.A core wire 3 made of a bundle of an aromatic polyamide fiber having an outer diameter of 0.2 mm is provided.",
"Seven conductive wires 5a, which are formed of a tin-containing hard copper alloy wire having a strand diameter of 0.08 mm, are spirally wound at a pitch of about 1.00 mm around an outer periphery of the core wire 3 in a state of being paralleled together.",
"Thus, the cord-shaped heater 1 is configured.",
"Note that an insulating film 5b made of a polyurethane is covered on the conductive wires 5a with a thickness of approximately 0.005 mm.",
"As a heat-fusing portion 9, a polyethylene resin containing a flame retardant is extrusion-covered with a thickness of 0.25 mm on an outer periphery of the wound conductive wires 5a.",
"The cord-shaped heater 1 has a configuration described above and has a finished outer diameter of 0.9 mm.",
"Next, a configuration of a substrate 10 on which the above described cord-shaped heater 1 is arranged will be explained.",
"The substrate 10 of the first embodiment is formed of a foamed polyurethane resin having an apparent density of 0.04 g/cm3 (in accordance with JIS K7222), a hardness of 220 N (in accordance with JIS K6400-2), and a thickness of 8 mm.",
"Next, a configuration of arranging the cord-shaped heater 1 on the substrate 10 in a predetermined pattern shape and then adhering and fixing them with each other will be explained.",
"FIG.",
"6 is a drawing showing a configuration of a hot press-type heater manufacturing apparatus 13 used for thermally compressing the substrate on which the cord-shaped heater 1 is arranged.",
"A hot pressing jig 15 is prepared and a plurality of hooking mechanisms 17 is provided on the hot pressing jig 15.As shown in FIG.",
"7, the hooking mechanisms 17 have pins 19.The pins 19 are inserted from below into holes 21 bored on the hot pressing jig 15.Hooking members 23 are mounted on an upper part of the pins 19 movably in an axial direction.",
"Tips of the hooking portions 23 are needle-shaped.",
"The hooking members 23 are always biased upward by coil springs 25.As shown by a virtual line in FIG.",
"7, the cord-shaped heater 1 is arranged on one side of the substrate 10 in a predetermined pattern shape by hooking the cord-shaped heater 1 on a plurality of the hooking members 23 of the hooking mechanisms 17.As shown in FIG.",
"6, a press hot plate 27 is arranged capable of being raised and lowered above the plurality of the hooking mechanisms 17.In other words, the cord-shaped heater 1 is arranged in a predetermined pattern shape by hooking the cord-shaped heater 1 on a plurality of the hooking members 23 of the hooking mechanisms 17, and then the substrate 10 is placed on that.",
"In that state, the press hot plate 27 is lowered so as to thermally compress the cord-shaped heater 1 and the substrate 10.The hot press plate 27 should be designed to be capable of compressing the substrate 10 more than an outer diameter of the cord-shaped heater 1.Thus, the substrate 10 is compressed and fused to a heat-fusing layer 9 of the cord-shaped heater 1.As a result, the cord-shaped heater 1 and the substrate 10 are adhered and fixed.",
"Note that, when the press hot plate 27 is lowered for the thermal compression, a plurality of the hooking members 23 of the hooking mechanisms 17 is moved downward against the biasing force of the coil springs 25.After that, in the present embodiment, the substrate 10 is turned over to thermally compress the substrate 10 again from a surface on which the cord-shaped heater 1 is arranged.",
"By the above described procedures, the heater unit 31 for the steering wheel shown in FIGS.",
"1 and 2 was obtained.",
"Note that FIG.",
"2 is a cross-sectional view showing a principal part of FIG.",
"1 in an enlarged state.",
"Since the substrate 10 is compressed by a flat plate-shaped hot press plate 27, the pressure to be applied is stronger at the portion on which the cord-shaped heater 1 is arranged than other area.",
"Therefore, a thickness of the substrate 10 is thinner at the portion on which the cord-shaped heater 1 is arranged than other area so that the portion is formed along a shape of the cord-shaped heater 1.In addition, the heat-fusing layer 9 of the cord-shaped heater 1 is largely deformed by the thermal compression.",
"Thus, a thickness of the heat-fusing layer 9 is thinner at a portion with which the substrate 10 is not contacted than other area, and the cord-shaped heater 1 becomes wide and substantially flat-like shape.",
"As explained above, the heater unit 31 becomes approximately flat without forming unevenness even at the portion on which the cord-shaped heater 1 is arranged.",
"In addition, the approximately flat shape is maintained because of a shape retaining effect of the heat-fusing layer 9.Since the substrate 10 is compressed and higher in density in the heater unit 31 obtained by the above explained procedures, mechanical strength can be improved.",
"Note that a thickness of the heater unit obtained by the above explained procedures is 1.00 mm, the minimum thickness of the substrate 10 at the portion on which the cord-shaped heater 1 is arranged is 0.52 mm, and a thickness of the substrate 10 at the portion on which the cord-shaped heater 1 is not arranged is 1.00 mm.",
"FIG.",
"9 shows an SEM image of a principal part of the cross-sectional view of the heater unit 31.The heat-fusing layer 9 of the cord-shaped heater 1 is impregnated in the substrate 10 up to approximately 0.5 mm from a surface of the substrate 10.For example, at the portion on which the cord-shaped heater 1 is arranged, when unevenness cannot be recognized compared to the thickness of the surrounding portion and the difference of the thickness is within the range of approximately ±10%, the heater unit 31 can be said to be approximately flat and has a substantially constant thickness.",
"In addition, when the user does not visually and tactilely feel the unevenness, the heater unit 31 can be said to be approximately flat.",
"Concerning the heater unit 31 obtained by the embodiment described above, both ends of the cord-shaped heater 1 are drawn out to be connected with a lead wire 35.The cord-shaped heater 1, a temperature controller 39 and a not illustrated connector are connected with each other by the lead wire 35.The temperature controller is arranged on the cord-shaped heater 1 to perform temperature control of the heater unit using heat generated in the cord-shaped heater 1.A projecting portion 10f can be formed on the substrate 10.For the purpose of protecting a connecting portion of the temperature controller 39, the cord-shaped heater 1 and the lead wire 35 from damage, the connecting portion can be covered with the projecting portion 10f of the substrate.",
"From this point of view, the thermal compression can be avoided at the projecting portion 10f.",
"The cord-shaped heater 1 is connected to a not illustrated electric system of the vehicle via the above described connector.",
"The heater unit 31 configured as described above is arranged between the wheel core material 77 of the steering wheel 71 and the covering material 78 in a state shown in FIG.",
"3.Not illustrated adhesive layer is formed on the substrate 10 so as to adhere the heater unit 31 with the covering material 78 of the steering wheel.",
"It is preferred that the adhesive layer is formed by preliminarily forming an adhesive layer only made of an adhesive material on a release sheet and then transferring the adhesive layer from the release sheet to a surface of the substrate 10.By doing so, the adhesive material is prevented from entering into the substrate 10, and the adhesive layer is formed only at the surface of the substrate 10.In the embodiment of FIG.",
"3, when adhering the heater unit 31 with the covering material 78, the covering material 78 is preferred to be adhered to a side on which the cord-shaped heater 1 is not arranged rather than being adhered to a side on which the cord-shaped heater 1 is arranged.",
"By doing so, the unevenness of the cord-shaped heater 1 hardly appears to the surface of the covering material 78.The heater unit 31 obtained by the above explained procedures was installed on the steering wheel as shown in FIG.",
"3 and actually used to confirm the unevenness.",
"Ten users gripped the steering wheel and performed steering operations ten times each in the right and left directions.",
"After that, the users were asked whether or not the unevenness of the cord-shaped heater 1 was felt.",
"As a result, no user answered to feel the unevenness about the steering wheel of the embodiment.",
"Second Embodiment A foamed body formed of a foamed polyurethane resin having an apparent density of 0.04 g/cm3 (in accordance with JIS K7222), a hardness of 220 N (in accordance with JIS K6400-2), and a thickness of 6 mm is used as the substrate 10, and the code-shaped heater is arranged same as the first embodiment.",
"Thus, the heater unit shown in FIGS.",
"1 and 2 is obtained.",
"At this time, the substrate 10 is thermally compressed until a thickness of the substrate becomes 1 mm.",
"After the substrate 10 is thermally compressed, the apparent density is 0.32 g/cm3 (in accordance with JIS K7222).",
"Third Embodiment Two formed bodies formed of a foamed polyurethane resin having an apparent density of 0.04 g/cm3 (in accordance with JIS K7222), a hardness of 220 N (in accordance with JIS K6400-2), and a thickness of 4 mm are used by being laminated together as the substrate 10, and the code-shaped heater is arranged same as the other embodiments.",
"Thus, the heater unit 31 for the steering wheel shown in FIG.",
"1 and FIG.",
"10 is obtained.",
"Note that FIG.",
"10 is a cross-sectional view showing a principal part of FIG.",
"1 in an enlarged state.",
"At this time, the substrate 10 is thermally compressed until a thickness of the substrate 10 becomes 1 mm.",
"After the substrate 10 is thermally compressed, the apparent density is 0.32 g/cm3 (in accordance with JIS K7222).",
"In the third embodiment, for convenience of explanation, the foamed body arranged on a side of the cord-shaped heater 1 is referred to as a first foamed body 11, and a foamed body of the opposite side is referred to as a second foamed body 12.At this time, if the heat-fusing layer 9 is configured to be impregnated both in the first foamed body 11 and the second foamed body 12, the first foamed body 11 and the second foamed body 12 are strongly adhered with each other.",
"Thus, the first foamed body 11 and the second foamed body 12 are prevented from being separated from each other.",
"When the cord-shaped heater 1 is heat-fused, if the first foamed body 11 and the second foamed body 12 are thermally compressed sufficiently so that they are highly compressed, the first foamed body 11 and the second foamed body 12 can be fixed together without using the adhesive layer even at a portion on which the cord-shaped heater 1 is not arranged.",
"This is because non-pore portions of one formed body are entered into pore portions of another formed body, thus two formed bodies are fixed by anchor effect.",
"A peeling strength of the substrate 10, which is obtained by laminating two formed bodies as described above, was measured.",
"The peeling strength was measured by a push-pull gauge.",
"The substrate 10 was cut into a size of 25 mm×150 mm, a longitudinal end was preliminarily peeled off by 50 mm, an end portion of the first formed body 11 was fixed to the push-pull gauge, and an end portion of the second foamed body 12 was held and pulled in an opposite direction of the push-pull gauge (peeling angle: 180°) at a speed of 10 mm/s.",
"Thus, the maximum load was measured as the peeling strength.",
"As for the heater unit 31 of the third embodiment, the peeling strength between the first formed body 11 and the second foamed body 12 measured as described above was 6.2 N. This is a sufficient value for practical use.",
"It was also confirmed that the peeling off was caused by material destruction, not by interfacial peeling.",
"Also from this point of view, it was confirmed that sufficient adhesion strength was obtained.",
"As a reference, the peeling strength was measured by using a sample in which the first formed body 11 and the second foamed body 12 were adhered with each other by a double-sided adhesive tape.",
"The peeling strength was 13.7 N. The peeling strength was also measured by using another example in which the first formed body 11 and the second foamed body 12 were adhered with each other by thermally compressing them without using the cord-shaped heater so that they were highly compressed same as the third example.",
"The peeling strength was 5.0 N and the interfacial peeling occurred.",
"In the normal substrate 10 formed by one formed body, if by any chance the foamed body is cracked or ripped, the crack or the rip is enlarged and the substrate 10 is disrupted.",
"When the substrate formed by laminating a plurality of formed bodies is used, even if one of the foamed bodies is cracked or ripped, the crack or the rip is limited in one of the foamed bodies and other formed bodies are not influenced.",
"Therefore, the substrate 10 as a whole is prevented from being disrupted.",
"In addition, if the substrate 10 is formed by laminating the first foamed body 11 and the second foamed body 12, two kinds of foamed body having different properties can be used.",
"Thus, the substrate can include a multiple property.",
"For example, following variations can be considered.",
"A foamed body having high porosity can be selected for one of the formed bodies.",
"If the foamed body having high porosity is used for the side on which the cord-shaped heater 1 is arranged, the cord-shaped heater 1 is more surely entered into the foamed body.",
"Thus, an approximately flat heater unit 31 can be obtained.",
"Alternatively, it is considered that the foamed body having high porosity is used for the side on which the cord-shaped heater 1 is not arranged and another kind of resin is melted and filled to form a composite material.",
"The steering wheel in which heater unit 31 is embedded can be obtained by adhering the heater unit 31 on the wheel core material 77 and then injection molding a urethane resin or the like on that.",
"Here, if the foamed body having high porosity is used for the side on which the cord-shaped heater 1 is not arranged, the injection molded urethane resin or the like is filled in the pores of the foamed body and the heater unit 31 is surely fixed.",
"If the formed bodies having different hardness are laminated, a user hardly feels the presence of the cord-shaped heater 1 when the user touches a product in which the heater unit 31 is installed.",
"By combining various foamed bodies such as a foamed body having excellent flame retardancy, a foamed body having high tensile strength, a foamed body having excellent chemical resistance, a foamed body having excellent heat resistance, a foamed body having excellent voltage resistance, a foamed body having electromagnetic wave shielding property, a foamed body having low repulsive property, a foamed body having low-temperature brittleness and a foamed body having high thermal conductivity, additional functions can be added to the heater unit 31.If thin foamed bodies are laminated, a process of attaching other foamed bodies can be added after the cord-shaped heater is arranged on the thin foamed bodies by heat fusion.",
"Thus, defective fusion caused by an influence of heat insulation of the foamed body can be prevented.",
"In addition, a multilayer structure can be used by laminating other foamed bodies such as a third formed body.",
"In such a case, the heat-fusing layer 9 is preferred to be impregnated in pores of all foamed bodies.",
"FIG.",
"11 shows an SEM image of a principal part of the cross-sectional view of the heater unit 31 of the third embodiment.",
"In the figure, it is confirmed that the heat-fusing layer 9 is impregnated in the pores of the first foamed body 11 and the second foamed body 12.In addition, non-pore portions of the second foamed body 12 are entered into pore portions of the first foamed body 11, and non-pore portions of the first foamed body 11 are entered into pore portions of the second foamed body 12.Thus, it is confirmed that the first foamed body 11 and the second foamed body 12 are fixed with each other by anchor effect.",
"The heat-fusing layer 9 of the cord-shaped heater 1 is impregnated in the substrate 10 up to approximately 5 mm from a surface of the substrate 10.Fourth, Fifth and Sixth Embodiments Next, the fourth, fifth and sixth embodiments will be explained with reference to FIGS.",
"12A to 14C.",
"FIGS.",
"12A to 12C are drawings showing a surface appearance of the heater unit.",
"FIG.",
"12A shows the fourth embodiment, FIG.",
"12B shows the fifth embodiment, and FIG.",
"12C shows the sixth embodiment.",
"FIGS.",
"13A to 13C are drawings showing a reverse surface appearance of the heater unit.",
"FIG.",
"13A shows the fourth embodiment, FIG.",
"13B shows the fifth embodiment, and FIG.",
"13C shows the sixth embodiment.",
"FIGS.",
"14A to 14C are SEM images of cross-sectional views of the heater unit.",
"FIG.",
"14A shows the fourth embodiment, FIG.",
"14B shows the fifth embodiment, and FIG.",
"14C shows the sixth embodiment.",
"The heater unit of the fourth to sixth embodiments is formed by a cord-shaped heater and a substrate made of a polymeric foam.",
"As described above, the cord-shaped heater is formed by using a heater core made of a bundle of an aromatic polyamide fiber having an outer diameter of approximately 0.19 mm and conductive wires made of tin-copper alloy wire having a strand diameter of 0.08 mm, paralleling seven conductive wires together, and spirally winding the paralleled conductive wires around an outer periphery of the heater core with a pitch of 1.00 mm.",
"A thickness of the insulating film of the conductive wires is 0.005 mm.",
"The state of spirally winding the conductive wires around the outer periphery of the heater core is referred to as a core material.",
"A polyester-based resin compounded with a flame retardant as the heat-fusing portion 9 is extrusion-covered on an outer periphery of the core material.",
"A diameter of the core material is 0.37 mm in the forth to sixth embodiments.",
"An outer diameter of the cord-shaped heater is 0.60 mm in the fourth embodiment, 0.77 mm in the fifth embodiment, and 0.97 mm in the sixth embodiment because the thickness (amount) of the heat-fusing portion 9 is different.",
"A thickness of the heat-fusing portion is 0.115 mm in the fourth embodiment, 0.20 mm in the fifth embodiment, and 0.30 mm in the sixth embodiment.",
"In the heater unit, the heat-fusing portion 9 is formed on an outermost layer covering the core material of the heater.",
"The cord-shaped heater is arranged on the substrate 10 and then thermally compressed.",
"In the above process, the heat-fusing portion 9 of the cord-shaped heater is melted and permeated in the polymeric foam of the substrate 10.Thus, a fixed portion is formed.",
"When the heat-fusing portion 9 is melted, a range impregnated in the substrate 10, which is the polymeric foam, varies depending on the thickness (amount) of the heat-fusing portion 9.The fixed portion is a portion where the heat-fusing portion of the cord-shaped heater is permeated into the polymeric foam of the substrate 10 and fixed, since the heat-fusing portion is melted and pressed to the substrate 10.The heat-fusing portion 9 forms the fixed portion by being melted.",
"The heat-fusing portion 9 does not have to keep an original shape.",
"Since the cord-shaped heater is pressed to the substrate 10, the cord-shaped heater receives repulsive force from the substrate 10 before the cord-shaped heater is thermally compressed.",
"When the heat-fusing portion 9 is thermally compressed, a part or the whole of the heat-fusing portion 9 is melted and liquefied.",
"As a result, the melted heat-fusing portion 9 is considered to be permeated in pores of the polymeric foam from a portion contacted with the substrate 10.After the thermal compression is finished and the cord-shaped heater is cooled, the heat-fusing portion 9 is permeated into the substrate 10 in a width direction and a thickness direction of the substrate 10.The heat-fusing portion 9 is combined with the substrate 10, which is the polymeric foam, at an outermost layer.",
"Since the combined portion is formed, the cord-shaped heater is considered to be strongly adhered with the substrate 10.In addition, the cord-shaped heater is inside the fixed portion, and the fixed portion is gotten into the substrate 10.A thickness of a portion on which the cord-shaped heater is arranged does not exceed a thickness of the substrate 10 on which the cord-shaped heater is not arranged.",
"Although the thickness of the portion on which the cord-shaped heater is arranged does not exceed the thickness of the substrate 10 on which the cord-shaped heater is not arranged in the present embodiment, the portion on which the cord-shaped heater is arranged can be slightly thicker than the substrate 10 on which the cord-shaped heater is not arranged.",
"Even if the thickness is slightly thicker, it is included in the present invention as long as the user does not feel uncomfortable when operating the steering wheel.",
"In another point of view, the user may not feel uncomfortable even if the thickness is thicker than the substrate 10 or thinner than the substrate 10 depending on the hardness of the fixed portion containing the cord-shaped heater.",
"A thickness (KA) of the substrate 10, a diameter (KB) of the core material (core+wire), a width (KC) of the heat-fusing portion (fixed portion) permeated into the substrate, and a depth (KD) of the heat-fusing portion (fixed portion) permeated into the substrate are shown in the following table.",
"Fourth embodiment Fifth embodiment Sixth embodiment (KA) 0.80 0.78 0.74 (KB) 0.37 0.37 0.37 (KC) 1.43 1.57 1.80 (KD) 0.50 0.78 0.74 In order to clarify the permeated state of the heat-fusing portion permeated into the substrate, a ratio (KD/KA) between the thickness of the fixed portion and the thickness of the substrate, a ratio (KC/KB) between the width of the fixed portion and width of the core material, and a ratio (DB) between the thickness of the fixed portion and width of the core material are calculated and shown below.",
"Fourth embodiment Fifth embodiment Sixth embodiment (KD/KA) 63% 100% 100% (KC/KB) 386% 424% 486% (KD/KB) 135% 211% 200% The heater unit of the present invention is comprised of: a substrate made of a polymeric foam; and a cord-shaped heater arranged on the substrate, wherein a heat-fusing portion is formed on an outermost layer covering the core material of the heater, and the heat-fusing portion of the cord-shaped heater is melted and permeated into the polymeric foam to form a fixed portion.",
"In addition, a method of manufacturing the heater unit is characterized in that the heat-fusing portion of the cord-shaped heater is melted and permeated into the polymeric foam to form a fixed portion.",
"Furthermore, the heater unit and the method above have following features.",
"From the fourth embodiment, the thickness of the fixed portion exceeds 60% of the thickness of the substrate.",
"From the fifth and sixth embodiments, the thickness of the fixed portion is approximately same as the thickness of whole the substrate.",
"From the fourth embodiment, the width of the fixed portion exceeds three times of the width of the core material.",
"From the fifth and sixth embodiments, the width of the fixed portion does not exceed five times of the width of the core material.",
"From the fourth embodiment, the thickness of the fixed portion exceeds 1.3 times of the width of the core material.",
"From the fifth embodiment, the thickness of the fixed portion does not exceed 2.5 times of the width of the core material.",
"Of course, the above values are merely an example of the embodiment.",
"Considering a general and reasonable expectation by a person skilled in the art, same result can be expected in a range within 50% of the lower limit value to 200% of the upper limit value.",
"Preferably, a better result can be expected in a range within 75% of the lower limit value to 150% of the upper limit value.",
"More preferably, a better result can be expected in a range within 90% of the lower limit value to 110% of the upper limit value.",
"The inventors considered as follows.",
"At the present moment, the thickness of the heat-fusing portion is minimally 0.115 mm as a practically applicable size.",
"Adhesive strength increases as the heat-fusing portion is permeated deeper.",
"In case the heat-fusing portion reaches the reverse side of the substrate (KD/KA=100%), the portion reached to the reverse side may appear on the surface of the steering wheel as foreign matter.",
"Since the width and depth of the fixed portion are specified so that the core material (core and wire) can be surely fixed to the substrate, the width and depth of the fixed portion should be compared with the diameter of the core material (core and wire).",
"Although the wire is laterally wound around the heater core in the product of the present embodiment, the product can be also achieved only by twisting a plurality of wires without using the heater core.",
"Adhesive strength increases as the width of the fixed portion is wider.",
"However, if the width is too wide, it may cause discomfort.",
"In this regard, the range of approximately 300%≤KC/KB≤500% is considered to be adequate.",
"As for the depth of the fixed portion with respect to the core material (core+wire) should be KD/KB>100% so that the fixed portion does not protrude from the substrate.",
"However, if the depth is too deep, it may cause discomfort.",
"Therefore, the range approximately KD/KB≤250% is considered to be adequate.",
"As for the manufacturing method, which compresses polyurethane having an apparent density of 0.04 g/cm3 to 0.8 mm, of the fourth and fifth embodiments is as follows.",
"Conditions of Thermal Compression hot press plate 27: 215° C.±10° C. hot pressing jig 15: 230° C.±10° C. descent pressure, first time: 0.3 MPa, second time 0.5 to 1.0 MPa compression time: 25±2 seconds The condition of thermal compression may differ according to the configuration of the product.",
"For example, the condition differs when other types of material is used for the substrate and the heat-fusing portion, when the substrate having different apparent density and porosity is used, and when the thickness after the compression is changed.",
"In addition, the same product may be obtained even if the conditions other than the above are used.",
"For example, the same product may be obtained by decreasing the temperature and increasing the compression time.",
"Note that the present invention is not limited to the above described embodiments.",
"Any conventionally known cord-shaped heaters can be used as the cord-shaped heater 1.For example, a cord-shaped heater shown in Japanese Patent No.",
"4202071 can be used.",
"This cord-shaped heater is formed by winding a heat generator in which heat generating wires are paralleled around an outer periphery of a heater core, and forming an insulation layer made of an FEP and optionally a heat-fusing layer made of a polyethylene.",
"In addition, a cord-shaped heater shown in Japanese Patent Application Publication No.",
"2007-158452 can be used.",
"In this cord-shaped heater, the heater core 3 has heat shrinking property and heat-melting property.",
"In addition, a cord-shaped heater shown in Japanese Patent Application Publication No.",
"2007-158453 can be used.",
"This cord-shaped heater is formed by paralleling conductive wires in which a heat generator is covered by an insulating film.",
"In addition, a cord-shaped heater shown in Japanese Patent Application Publication No.",
"2007-134341 can be used.",
"In this cord-shaped heater, a heat generator is formed by silver containing copper alloy wire in which copper solid solution and copper silver eutectic alloy are in a fibrous state.",
"A configuration shown in FIG.",
"4 can be also considered.",
"Specifically, the cord-shaped heater 1 is formed by using a heater core 3 made of a bundle of an aromatic polyamide fiber having an outer diameter of approximately 0.2 mm and conductive wires 5a made of tin-copper alloy wire having a strand diameter of 0.08 mm, paralleling seven conductive wires 5a together, and spirally winding the paralleled conductive wires around an outer periphery of the heater core 3 with a pitch of 1.00 mm Note that the conductive wires 5a are covered by the insulating film 5b made of polyurethane with a thickness of approximately 0.005 mm.",
"The cord-shaped heater 1 has above described configuration.",
"A finishing outer diameter of the cord-shaped heater 1 is 0.38 mm.",
"The substrate 10 is not limited to the foamed polyurethane resin.",
"For example, various polymeric foams such as a foamed resin sheet made of other materials and a foamed rubber sheet can be used.",
"Materials having excellent stretchability are particularly preferred.",
"It is preferred that hardness is adjusted so that unevenness of the cord-shaped heater does not appear on the surface.",
"In order to adjust the hardness, various methods can be used.",
"For example, a foaming rate can be adjusted, pores can be closed cells and open cells, or hardness of the material can be selected according to the purpose.",
"The materials can be selected from various resins, rubbers and thermoplastic elastomers such as a polyurethane resin, a chloroprene rubber, a silicone resin, a silicone rubber, a neoprene rubber, a diene rubber, a nitrile rubber, a natural rubber, a polyethylene resin, a polypropylene resin, and an ethylene-vinyl acetate copolymer.",
"A plurality of substrates 10 can be used.",
"The plurality of substrates 10 can be laminated in layers.",
"In this case, different kinds of materials can be used each for the plurality of substrates 10.Because of this, unevenness of the cord-shaped heater hardly appears to the surface.",
"It is preferred that the adhesive layer is formed so that the adhesive material is not entered in the pores and other portions inside the substrate 10.By doing so, curing of the substrate 10 is prevented and stretchability can be maintained.",
"In addition, touch feeling can be maintained.",
"When arranging the cord-shaped heater 1 on the substrate 10, the cord-shaped heater 1 can be fixed on the substrate 10 by using various methods other than the fusion of the thermal compression.",
"For example, the cord-shaped heater 1 can be fixed on the substrate 10 by sewing.",
"When thermally compressing the substrate 10, the hot pressing jig 15 can be also heated in addition to the hot press plate 27.At this time, if the temperature is specified to be different between the hot press plate 27 and the hot pressing jig 15, compression ratio of the substrate 10 can be changed in order to change porosity.",
"Various materials can be used as the adhesive layer.",
"For example, an adhesive layer made of polymer acrylic adhesive and not using a tape substrate, or an adhesive layer having adhesive material on both sides of polypropylene film.",
"The material having flame retardancy satisfying by itself the requirements of the combustion test of the automobile interior material of FMVSS No.",
"302 is preferred because the flame retardancy of the heater unit is improved.",
"The adhesive layer is preferred to be formed only of the adhesive material so as to maintain the stretchability of the heater unit The present invention can provide the steering wheel that does not give discomfort to a user when operating the steering wheel.",
"The heater unit of the present invention is used, for example, for a steering wheel of an automobile, a boat, various transport vehicles, various farming vehicles, and various heavy equipment for engineering and construction.",
"In particular, the heater unit is suitably used for warming the wheel portion of the steering wheel.",
"Since the cord-shaped heater of the heater unit of the present invention is approximately flat without forming unevenness, the heater unit can be applied to other than the steering wheel.",
"For example, the cord-shaped heater can be applied to an electric blanket, an electric carpet, a car sheet heater, a steering heater, a toilet seat heater, a heater for antifogging mirror, a heating cooker, a heater for floor heating and a heater for clothing.",
"Note that, this invention is not limited to the above-mentioned embodiments.",
"Although it is to those skilled in the art, the following are disclosed as the one embodiment of this invention.",
"Mutually substitutable members, configurations, etc.",
"disclosed in the embodiment can be used with their combination altered appropriately.",
"Although not disclosed in the embodiment, members, configurations, etc.",
"that belong to the known technology and can be substituted with the members, the configurations, etc.",
"disclosed in the embodiment can be appropriately substituted or are used by altering their combination.",
"Although not disclosed in the embodiment, members, configurations, etc.",
"that those skilled in the art can consider as substitutions of the members, the configurations, etc.",
"disclosed in the embodiment are substituted with the above mentioned appropriately or are used by altering its combination.",
"While the invention has been particularly shown and described with respect to preferred embodiments thereof, it should be understood by those skilled in the art that the foregoing and other changes in form and detail may be made therein without departing from the sprit and scope of the invention as defined in the appended claims."
]
] |
Patent_15871087
|
[
[
"ORGANIC LIGHT EMITTING DISPLAY DEVICE AND METHOD OF MANUFACTURING THE SAME",
"An organic light emitting display device includes a substrate including a plurality of pixel regions each including a light emitting region and a transparent region, a gate electrode in the light emitting region, a first insulating interlayer covering the gate electrode and extending from the light emitting region to the transparent region, a drain electrode on the first insulating interlayer and constituting a transistor in conjunction with the gate electrode, a planarization layer covering the transistor and exposing a top surface of the first insulating interlayer in the transparent region, and a first electrode on the planarization layer."
],
[
"1.A method of manufacturing an organic light emitting display device, the method comprising: forming a first semiconductor pattern on a substrate including a plurality of pixel regions each including a light emitting region and a transparent region between the light emitting region and another light emitting region of another pixel region of the pixel regions; forming a gate insulation layer to cover the first semiconductor pattern; forming a first gate electrode on the gate insulation layer and partially overlapping the first semiconductor pattern; forming a first insulating interlayer covering the first gate electrode and extending from the light emitting region to the transparent region; forming a first drain electrode and a first source electrode above the first insulating interlayer, the first drain electrode and the first source electrode constituting a first transistor in conjunction with the first gate electrode; forming a planarization layer covering the first drain electrode and the first source electrode, the planarization layer exposing a top surface of the first insulating interlayer in the transparent region; and forming a first electrode on the planarization layer.",
"2.The method of claim 1, wherein the forming of the first gate electrode further comprises forming a first conductive pattern on the gate insulation layer.",
"3.The method of claim 2, wherein the forming of the first drain electrode and the first source electrode further comprises forming a third conductive pattern overlapping the first conductive pattern.",
"4.A method of manufacturing an organic light emitting display device, the method comprising: forming a first semiconductor pattern on a substrate including a plurality of pixel regions each including a light emitting region and a transparent region; forming a gate insulation layer to cover the first semiconductor pattern; forming a first gate electrode on the gate insulation layer and partially overlapping the first semiconductor pattern by forming a first conductive pattern on the gate insulation layer; forming a first insulating interlayer covering the first gate electrode and extending from the light emitting region to the transparent region; forming a first drain electrode and a first source electrode above the first insulating interlayer by forming a third conductive pattern overlapping the first conductive pattern, the first drain electrode and the first source electrode constituting a first transistor in conjunction with the first gate electrode; forming a planarization layer covering the first drain electrode and the first source electrode, the planarization layer exposing a top surface of the first insulating interlayer in the transparent region; forming a first electrode on the planarization layer; forming a second conductive pattern on the first insulating interlayer and overlapping the first conductive pattern; and forming second insulating interlayer patterns on the first insulating interlayer, one of the second insulating interlayer patterns covering the second conductive pattern.",
"5.The method of claim 4, wherein the forming of the second insulating interlayer patterns comprises: forming a second insulating interlayer on the first insulating interlayer using silicon nitride; and partially removing the second insulating interlayer in the light emitting region.",
"6.The method of claim 5, wherein the forming of the planarization layer comprises: forming an organic layer in the transparent region and the light emitting region, the organic layer covering the first drain electrode and the first source electrode; and partially removing the organic layer to form a first opening defined by a top surface of the first insulating interlayer and a sidewall of the organic layer."
],
[
"<SOH> BACKGROUND <EOH>"
],
[
"<SOH> SUMMARY <EOH>Aspects of embodiments of the present invention relate to an organic light emitting display device and a method of manufacturing the organic light emitting display device.",
"Further aspects are directed to an organic light emitting display device having improved sharpness and a method of manufacturing an organic light emitting display device having improved sharpness.",
"In example organic light emitting display devices and methods of manufacturing the organic light emitting display devices according to embodiments of the present invention, a gate insulation layer and a first insulating interlayer extend from a light emitting region to a transparent region so that a sidewall of the gate insulation layer and a sidewall of the first insulating interlayer are not disposed in the transparent region.",
"In further embodiments, a pixel defining layer is disposed only in the light emitting region so that a sidewall of the pixel defining layer is not disposed in the transparent region.",
"Accordingly, the sharpness of the organic light emitting display devices may be improved.",
"In an embodiment of the present invention, an organic light emitting display device is provided.",
"The organic light emitting display device includes a substrate including a plurality of pixel regions each including a light emitting region and a transparent region, a gate electrode in the light emitting region, a first insulating interlayer covering the gate electrode and extending from the light emitting region to the transparent region, a drain electrode on the first insulating interlayer and constituting a transistor in conjunction with the gate electrode, a planarization layer covering the transistor and exposing a top surface of the first insulating interlayer in the transparent region, and a first electrode on the planarization layer.",
"The organic light emitting display device may further include a pixel defining layer on the planarization layer and partially covering the first electrode.",
"The pixel defining layer may be in the light emitting region and expose the top surface of the first insulating interlayer in the transparent region.",
"The organic light emitting display device may further include second insulating interlayer patterns on the first insulating interlayer, one of the second insulating interlayer patterns being between the drain electrode and the first insulating interlayer.",
"The second insulating interlayer patterns may include a material that is different from the first insulating interlayer.",
"The organic light emitting display device may further include a first conductive pattern below the first insulating interlayer and include a material that is identical to a material of the gate electrode, a second conductive pattern on the first insulating interlayer, and a third conductive pattern above the second conductive pattern and including a material that is identical to a material of the drain electrode.",
"Another one of the second insulating interlayer patterns may be between the second conductive pattern and the third conductive pattern.",
"The second insulating interlayer patterns may include a material that has a higher dielectric constant than a material of the first insulating interlayer, and may have a thickness that is less than a thickness of the first insulating interlayer.",
"The second insulating interlayer patterns may include silicon nitride.",
"The first insulating interlayer may be a single layer including silicon oxide.",
"The second insulating interlayer patterns may be in the light emitting region and expose the transparent region.",
"The first conductive pattern, the second conductive pattern, and the first insulating interlayer therebetween may constitute a first capacitor.",
"The second conductive pattern, the third conductive pattern, and the other one of the second insulating interlayer patterns therebetween may constitute a second capacitor.",
"The first capacitor and the second capacitor may overlap each other when viewed from a direction substantially perpendicular to a top surface of the substrate.",
"The first capacitor may be a C-hold capacitor and the second capacitor may be a storage capacitor.",
"In another embodiment of the present invention, an organic light emitting display device is provided.",
"The organic light emitting display device includes a substrate including a plurality of pixel regions each including a light emitting region and a transparent region, a first gate electrode in the light emitting region, a first insulating interlayer covering the first gate electrode and extending from the light emitting region to the transparent region, a second gate electrode in the light emitting region and on the first insulating interlayer, a second insulating interlayer covering the second gate electrode and extending from the light emitting region to the transparent region, a first drain electrode on the second insulating interlayer and constituting a first transistor in conjunction with the first gate electrode, a second drain electrode on the second insulating interlayer and constituting a second transistor in conjunction with the second gate electrode, a planarization layer covering the first transistor and the second transistor, and a first electrode on the planarization layer.",
"The planarization layer exposes a top surface of the second insulating interlayer in the transparent region.",
"The organic light emitting display device may further include third insulating interlayer patterns on the second insulating interlayer, a first one of the third insulating interlayer patterns being between the first drain electrode and the second insulating interlayer, and a second one of the third insulating interlayer patterns being between the second drain electrode and the second insulating interlayer.",
"The third insulating interlayer patterns may include a material that is different from the second insulating interlayer.",
"The third insulating interlayer patterns may include silicon nitride.",
"The first insulating interlayer and the second insulating interlayer may include silicon oxide.",
"The organic light emitting display device may further include a first conductive pattern below the first insulating interlayer and including a material that is identical to a material of the first gate electrode, a second conductive pattern on the first insulating interlayer and including a material that is identical to a material of the first gate electrode, and a third conductive pattern on a third one of the third insulating interlayer patterns and including a material that is identical to a material of the first drain electrode.",
"The first conductive pattern, the second conductive pattern, and the first insulating interlayer therebetween may constitute a first capacitor.",
"The second conductive pattern, the third conductive pattern, and the second insulating interlayer therebetween may constitute a second capacitor.",
"The first capacitor and the second capacitor may overlap each other when viewed from a direction substantially perpendicular to a top surface of the substrate.",
"In yet another embodiment of the present invention, a method of manufacturing an organic light emitting display device is provided.",
"The method includes forming a first semiconductor pattern on a substrate including a plurality of pixel regions each including a light emitting region and a transparent region, forming a gate insulation layer to cover the first semiconductor pattern, forming a first gate electrode on the gate insulation layer and partially overlapping the first semiconductor pattern, forming a first insulating interlayer covering the first gate electrode and extending from the light emitting region to the transparent region, forming a first drain electrode and a first source electrode above the first insulating interlayer, forming a planarization layer covering the first drain electrode and the first source electrode, and forming a first electrode on the planarization layer.",
"The first drain electrode and the first source electrode constitute a first transistor in conjunction with the first gate electrode.",
"The planarization layer exposes a top surface of the first insulating interlayer in the transparent region.",
"The forming of the first gate electrode may further include forming a first conductive pattern on the gate insulation layer.",
"The forming of the first drain electrode and the first source electrode may further include forming a third conductive pattern overlapping the first conductive pattern.",
"The method may further include forming a second conductive pattern on the first insulating interlayer and overlapping the first conductive pattern, and forming second insulating interlayer patterns on the first insulating interlayer.",
"One of the second insulating interlayer patterns may cover the second conductive pattern.",
"The forming of the second insulating interlayer patterns may include forming a second insulating interlayer on the first insulating interlayer using silicon nitride, and partially removing the second insulating interlayer in the light emitting region.",
"The forming of the planarization layer may include forming an organic layer in the transparent region and the light emitting region, and partially removing the organic layer to form a first opening defined by a top surface of the first insulating interlayer and a sidewall of the organic layer.",
"The organic layer may cover the first drain electrode and the first source electrode.",
"In further embodiments, a first conductive pattern, a second conductive pattern, a third conductive pattern, and a fourth conductive pattern are disposed to overlap each other so that a first capacitor and a second capacitor overlap each other when viewed from a direction substantially perpendicular to a top surface of the substrate.",
"Accordingly, opening ratios of the organic light emitting display devices may increase."
],
[
"CROSS REFERENCE TO RELATED APPLICATION This application is a continuation of U.S. patent application Ser.",
"No.",
"15/438,709, filed Feb. 21, 2017, which is a divisional of U.S. patent application Ser.",
"No.",
"14/733,816, filed Jun.",
"8, 2015, now U.S. Pat.",
"No.",
"9,583,549, which claims priority to and the benefit of Korean Patent Application No.",
"10-2014-0159766, filed Nov. 17, 2014, the entire content of all of which is incorporated herein by reference.",
"BACKGROUND 1.Field Aspects of embodiments of the present invention relate to an organic light emitting display device and a method of manufacturing the organic light emitting display device.",
"2.Description of the Related Art A transparent organic light emitting display device includes a transparent region that allows light to pass through the display device and enables objects to be seen from behind the display device, such as when the display device operates in an “OFF” state.",
"For example, in the “OFF” state, the organic light emitting display device may display an image in a pixel region adjacent to the transparent region using light generated from an organic light emitting layer thereof.",
"As such, it may be desired for the organic light emitting display device to have enhanced characteristics while ensuring desired transmittance.",
"SUMMARY Aspects of embodiments of the present invention relate to an organic light emitting display device and a method of manufacturing the organic light emitting display device.",
"Further aspects are directed to an organic light emitting display device having improved sharpness and a method of manufacturing an organic light emitting display device having improved sharpness.",
"In example organic light emitting display devices and methods of manufacturing the organic light emitting display devices according to embodiments of the present invention, a gate insulation layer and a first insulating interlayer extend from a light emitting region to a transparent region so that a sidewall of the gate insulation layer and a sidewall of the first insulating interlayer are not disposed in the transparent region.",
"In further embodiments, a pixel defining layer is disposed only in the light emitting region so that a sidewall of the pixel defining layer is not disposed in the transparent region.",
"Accordingly, the sharpness of the organic light emitting display devices may be improved.",
"In an embodiment of the present invention, an organic light emitting display device is provided.",
"The organic light emitting display device includes a substrate including a plurality of pixel regions each including a light emitting region and a transparent region, a gate electrode in the light emitting region, a first insulating interlayer covering the gate electrode and extending from the light emitting region to the transparent region, a drain electrode on the first insulating interlayer and constituting a transistor in conjunction with the gate electrode, a planarization layer covering the transistor and exposing a top surface of the first insulating interlayer in the transparent region, and a first electrode on the planarization layer.",
"The organic light emitting display device may further include a pixel defining layer on the planarization layer and partially covering the first electrode.",
"The pixel defining layer may be in the light emitting region and expose the top surface of the first insulating interlayer in the transparent region.",
"The organic light emitting display device may further include second insulating interlayer patterns on the first insulating interlayer, one of the second insulating interlayer patterns being between the drain electrode and the first insulating interlayer.",
"The second insulating interlayer patterns may include a material that is different from the first insulating interlayer.",
"The organic light emitting display device may further include a first conductive pattern below the first insulating interlayer and include a material that is identical to a material of the gate electrode, a second conductive pattern on the first insulating interlayer, and a third conductive pattern above the second conductive pattern and including a material that is identical to a material of the drain electrode.",
"Another one of the second insulating interlayer patterns may be between the second conductive pattern and the third conductive pattern.",
"The second insulating interlayer patterns may include a material that has a higher dielectric constant than a material of the first insulating interlayer, and may have a thickness that is less than a thickness of the first insulating interlayer.",
"The second insulating interlayer patterns may include silicon nitride.",
"The first insulating interlayer may be a single layer including silicon oxide.",
"The second insulating interlayer patterns may be in the light emitting region and expose the transparent region.",
"The first conductive pattern, the second conductive pattern, and the first insulating interlayer therebetween may constitute a first capacitor.",
"The second conductive pattern, the third conductive pattern, and the other one of the second insulating interlayer patterns therebetween may constitute a second capacitor.",
"The first capacitor and the second capacitor may overlap each other when viewed from a direction substantially perpendicular to a top surface of the substrate.",
"The first capacitor may be a C-hold capacitor and the second capacitor may be a storage capacitor.",
"In another embodiment of the present invention, an organic light emitting display device is provided.",
"The organic light emitting display device includes a substrate including a plurality of pixel regions each including a light emitting region and a transparent region, a first gate electrode in the light emitting region, a first insulating interlayer covering the first gate electrode and extending from the light emitting region to the transparent region, a second gate electrode in the light emitting region and on the first insulating interlayer, a second insulating interlayer covering the second gate electrode and extending from the light emitting region to the transparent region, a first drain electrode on the second insulating interlayer and constituting a first transistor in conjunction with the first gate electrode, a second drain electrode on the second insulating interlayer and constituting a second transistor in conjunction with the second gate electrode, a planarization layer covering the first transistor and the second transistor, and a first electrode on the planarization layer.",
"The planarization layer exposes a top surface of the second insulating interlayer in the transparent region.",
"The organic light emitting display device may further include third insulating interlayer patterns on the second insulating interlayer, a first one of the third insulating interlayer patterns being between the first drain electrode and the second insulating interlayer, and a second one of the third insulating interlayer patterns being between the second drain electrode and the second insulating interlayer.",
"The third insulating interlayer patterns may include a material that is different from the second insulating interlayer.",
"The third insulating interlayer patterns may include silicon nitride.",
"The first insulating interlayer and the second insulating interlayer may include silicon oxide.",
"The organic light emitting display device may further include a first conductive pattern below the first insulating interlayer and including a material that is identical to a material of the first gate electrode, a second conductive pattern on the first insulating interlayer and including a material that is identical to a material of the first gate electrode, and a third conductive pattern on a third one of the third insulating interlayer patterns and including a material that is identical to a material of the first drain electrode.",
"The first conductive pattern, the second conductive pattern, and the first insulating interlayer therebetween may constitute a first capacitor.",
"The second conductive pattern, the third conductive pattern, and the second insulating interlayer therebetween may constitute a second capacitor.",
"The first capacitor and the second capacitor may overlap each other when viewed from a direction substantially perpendicular to a top surface of the substrate.",
"In yet another embodiment of the present invention, a method of manufacturing an organic light emitting display device is provided.",
"The method includes forming a first semiconductor pattern on a substrate including a plurality of pixel regions each including a light emitting region and a transparent region, forming a gate insulation layer to cover the first semiconductor pattern, forming a first gate electrode on the gate insulation layer and partially overlapping the first semiconductor pattern, forming a first insulating interlayer covering the first gate electrode and extending from the light emitting region to the transparent region, forming a first drain electrode and a first source electrode above the first insulating interlayer, forming a planarization layer covering the first drain electrode and the first source electrode, and forming a first electrode on the planarization layer.",
"The first drain electrode and the first source electrode constitute a first transistor in conjunction with the first gate electrode.",
"The planarization layer exposes a top surface of the first insulating interlayer in the transparent region.",
"The forming of the first gate electrode may further include forming a first conductive pattern on the gate insulation layer.",
"The forming of the first drain electrode and the first source electrode may further include forming a third conductive pattern overlapping the first conductive pattern.",
"The method may further include forming a second conductive pattern on the first insulating interlayer and overlapping the first conductive pattern, and forming second insulating interlayer patterns on the first insulating interlayer.",
"One of the second insulating interlayer patterns may cover the second conductive pattern.",
"The forming of the second insulating interlayer patterns may include forming a second insulating interlayer on the first insulating interlayer using silicon nitride, and partially removing the second insulating interlayer in the light emitting region.",
"The forming of the planarization layer may include forming an organic layer in the transparent region and the light emitting region, and partially removing the organic layer to form a first opening defined by a top surface of the first insulating interlayer and a sidewall of the organic layer.",
"The organic layer may cover the first drain electrode and the first source electrode.",
"In further embodiments, a first conductive pattern, a second conductive pattern, a third conductive pattern, and a fourth conductive pattern are disposed to overlap each other so that a first capacitor and a second capacitor overlap each other when viewed from a direction substantially perpendicular to a top surface of the substrate.",
"Accordingly, opening ratios of the organic light emitting display devices may increase.",
"BRIEF DESCRIPTION OF THE DRAWINGS Example embodiments of the present invention may be understood in more detail from the following description taken in conjunction with the accompanying drawings in which: FIG.",
"1 is a circuit diagram illustrating a pixel of an organic light emitting display device in accordance with an embodiment of the present invention; FIG.",
"2 is a plan view partially illustrating an organic light emitting display device in accordance with an embodiment of the present invention; FIG.",
"3 is a cross sectional view illustrating an example of the organic light emitting display device of FIG.",
"2 taken along line I-I′ in accordance with an embodiment of the present invention; FIG.",
"4 is a schematic view illustrating a test for measuring sharpness of an organic light emitting display device; FIG.",
"5 is a cross sectional view illustrating a comparable organic light emitting display device; FIG.",
"6 is a cross sectional view illustrating another comparable organic light emitting display device; FIG.",
"7 is a cross sectional view illustrating another organic light emitting display device in accordance with an embodiment of the present invention; FIGS.",
"8 to 14 are cross sectional views illustrating a method of manufacturing an organic light emitting display device in accordance with an embodiment of the present invention; and FIGS.",
"15 to 20 are cross sectional views illustrating another method of manufacturing an organic light emitting display device in accordance with an embodiment of the present invention.",
"DETAILED DESCRIPTION Example embodiments of the present invention are described more fully hereinafter with reference to the accompanying drawings.",
"The present invention may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein.",
"In the drawings, the sizes and relative sizes of layers and regions may be exaggerated for clarity.",
"It will be understood that when an element or layer is referred to as being “on,” “connected to,” or “coupled to” another element or layer, it may be directly on, connected, or coupled to the other element or layer, or intervening elements or layers may be present.",
"In contrast, when an element is referred to as being “directly on,” “directly connected to,” or “directly coupled to” another element or layer, there are no intervening elements or layers present.",
"Like or similar reference numerals refer to like or similar elements throughout.",
"As used herein, the term “and/or” includes any and all combinations of one or more of the associated listed items.",
"It will be understood that, although the terms first, second, third, etc., may be used herein to describe various elements, components, regions, layers, patterns, and/or sections, these elements, components, regions, layers, patterns, and/or sections should not be limited by these terms.",
"These terms are used primarily to distinguish one element, component, region, layer, pattern, or section from another element, component, region, layer, pattern, or section.",
"Thus, a first element, component, region, layer, pattern, or section discussed below could be termed a second element, component, region, layer, pattern, or section without departing from the teachings of the present invention.",
"Spatially relative terms, such as “beneath,” “below,” “lower,” “above,” “upper,” and the like, may be used herein for ease of description to describe one element or feature's relationship relative to another element(s) or feature(s) as illustrated in the figures.",
"It will be understood that the spatially relative terms are intended to encompass different orientations of the device in use or operation in addition to the orientation depicted in the figures.",
"For example, if the device in the figures is turned over, elements described as “below” or “beneath” other elements or features would then be oriented “above” the other elements or features.",
"Thus, the exemplary term “below” can encompass both an orientation of above and below relative to other elements or features depending on the orientation in the drawing.",
"The device may be otherwise oriented (e.g., rotated 90 degrees or at other orientations) and the spatially relative descriptors used herein interpreted accordingly.",
"The terminology used herein is intended primarily for describing particular example embodiments and is not intended to be limiting of the present invention.",
"As used herein, the singular forms “a,” “an,” and “the” are intended to include the plural forms as well, unless the context clearly indicates otherwise.",
"It will be further understood that the terms “comprises” and/or “comprising,” when used in this specification, specify the presence of stated features, integers, steps, operations, elements, and/or components, but do not preclude the presence or addition of one or more other features, integers, steps, operations, elements, components, and/or groups thereof.",
"Example embodiments are described herein with reference to cross sectional illustrations that are schematic illustrations of illustratively idealized embodiments (and intermediate structures) of the present invention.",
"As such, variations from the shapes of the illustrations as a result, for example, of manufacturing techniques and/or tolerances, are to be expected.",
"Thus, the present invention should not be construed as limited to the particular shapes of regions illustrated herein but further includes variations or deviations in shapes that result, for example, from manufacturing.",
"The regions illustrated in the figures are schematic in nature and their shapes are not necessarily intended to illustrate the actual shape of a region of a device and are not intended to limit the scope of the present invention.",
"Unless otherwise defined, all terms (including technical and scientific terms) used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs.",
"It will be further understood that terms such as those defined in commonly used dictionaries should be interpreted as having a meaning that is consistent with their meaning in the context of the relevant art and should not be interpreted in an idealized or overly formal sense unless expressly so defined herein.",
"Herein, the use of the term “may,” when describing embodiments of the present invention, refers to “one or more embodiments of the present invention.” In addition, the use of alternative language, such as “or,” when describing embodiments of the present invention, refers to “one or more embodiments of the present invention” for each corresponding item listed.",
"Hereinafter, embodiments of the present invention will be described with reference to the accompanying drawings.",
"The organic light emitting display device and/or any other relevant devices or components according to embodiments of the present invention described herein may be implemented utilizing any suitable hardware, firmware (e.g., an application-specific integrated circuit), software, or a suitable combination of software, firmware, and hardware.",
"For example, the various components of the organic light emitting display device may be formed on one integrated circuit (IC) chip or on separate IC chips.",
"Further, the various components of the organic light emitting display device may be implemented on a flexible printed circuit film, a tape carrier package (TCP), a printed circuit board (PCB), or formed on a same substrate as the organic light emitting display device.",
"Further, the various components of the organic light emitting display device may be a process or thread, running on one or more processors, in one or more computing devices, executing computer program instructions and interacting with other system components for performing the various functionalities described herein.",
"The computer program instructions are stored in a memory that may be implemented in a computing device using a standard memory device, such as, for example, a random access memory (RAM).",
"The computer program instructions may also be stored in other non-transitory computer readable media such as, for example, a CD-ROM, flash drive, or the like.",
"In addition, a person of skill in the art should recognize that the functionality of various computing devices may be combined or integrated into a single computing device, or the functionality of a particular computing device may be distributed across one or more other computing devices without departing from the scope of the present invention.",
"FIG.",
"1 is a circuit diagram illustrating a pixel of an organic light emitting display device in accordance with an embodiment of the present invention; Referring to FIG.",
"1, a scan line (for receiving a scan signal SCAN), a data line (for receiving a data signal VData), a power supply line (for transmitting a power supply voltage Vdd from a power supply source ELVDD), another power supply line (for supplying another power supply voltage Vss, such as a ground voltage, from another power supply source VSS), and another scan line (for receiving another scan signal GC) are electrically connected to a pixel circuit for driving an organic light emitting diode (OLED).",
"In other embodiments, other lines may be electrically connected to the pixel circuit depending on a structure of the pixel circuit.",
"In the embodiment of FIG.",
"1, the pixel circuit includes a first transistor T1, a second transistor T2, a third transistor T3, a storage capacitor Cst, and a C-hold capacitor Cch.",
"The pixel circuit is electrically connected to the OLED.",
"In more detail, the first transistor T1 is electrically connected to the scan line and the data line, the second transistor T2 is electrically connected to the OLED and the power supply line, and the third transistor T3 is electrically connected to the OLED, the other scan line, and the first transistor T1.Further, the storage capacitor Cst and the C-hold capacitor Cch are disposed between the first transistor T1 and the second transistor T2.The C-hold capacitor Cch may hold a voltage for driving the gate electrode of the second transistor T2 (driving transistor), while the storage capacitor Cst may store a data voltage supplied from the data line.",
"In addition, the OLED is electrically connected to the driving transistor T2 and the other power supply source VSS.",
"In the embodiment of FIG.",
"1, the first transistor T1 is a switching transistor, and the second transistor T2 is a driving transistor.",
"The pixel circuit in FIG.",
"1 is an example embodiment, and the present invention is not limited thereto.",
"In other embodiments, the pixel circuit may include additional transistors and additional capacitors.",
"FIG.",
"2 is a plan view partially illustrating an organic light emitting display device 10 in accordance with an embodiment of the present invention.",
"Referring to FIG.",
"2, the organic light emitting display device 10 includes a plurality of gate lines GL extending in a first direction and a plurality of data lines DL extending in a second direction crossing the first direction (e.g., perpendicular to the first direction).",
"The organic light emitting display device 10 may also include power lines.",
"The gate lines GL and the data lines DL cross each other to define a plurality of pixel regions P In the embodiment of FIG.",
"2, each of the pixel regions P includes a plurality of sub-pixel regions SP1, SP2, SP3.In more detail, each of the sub-pixel regions SP1, SP2, SP3 is divided into a transparent region T and one of a corresponding plurality of light emitting regions B1, B2, B3.The transparent region T may occupy a ratio in the range of about 25% to about 85% of an area of the pixel region P (such as a total area of sub-pixel regions SP1, SP2, SP3).",
"When the organic light emitting display device 10 is switched off, the organic light emitting display device 10 may be transparent enough to permit an environment behind the organic light emitting display device 10 to be viewed through the transparent region T. When the organic light emitting display device 10 is switched on, the organic light emitting display device may display images through the light emitting regions B1, B2, B3.In some embodiments, the organic light emitting display device 10 may be transparent enough to permit an environment behind the organic light emitting display device 10 to be viewed while the organic light emitting display device 10 is switched on or while the organic light emitting display device 10 is displaying images through the light emitting regions B1, B2, B3.If the transparent region T occupies a ratio below about 25% of the area of the pixel region P, the transparency of the organic light emitting display device may degrade below acceptable limits.",
"If the transparent region T occupies a ratio above about 85% of the area of the pixel region P, areas of the light emitting regions B1, B2, B3 may decrease to the point that it is hard for the organic light emitting display device 10 to adequately display images.",
"Therefore, when the transparent region T occupies a ratio in the range of about 25% to about 85% of the area of the pixel region P, the organic light emitting display device may have a desired transparency while also being able to adequately display images.",
"Further, pixel circuits may be disposed at each of the light emitting regions B1, B2, B3 of the sub pixel regions SP1, SP2, SP3, where the gate lines GL and the data lines DL cross each other.",
"The driving circuits may be, for example, similar or substantially identical to those described above with reference to FIG.",
"1.In the embodiment of FIG.",
"2, in each pixel region P, the light emitting regions include a first light emitting region B1 of the first sub pixel region SP1, a second light emitting region B2 of the second sub pixel region SP2, and a third light emitting region B3 of the third sub pixel region SP3.However, the present invention is limited thereto.",
"In other embodiments, each of the pixel regions P may include a different number of sub pixel regions, such as two sub pixel regions or four sub pixel regions.",
"In the embodiment of FIG.",
"2, an OLED disposed in the first light emitting region B1 in the first sub pixel region SP1 emits a red (R) color of light, an OLED disposed in the second light emitting region B2 in the second sub pixel region SP2 emits a green (G) color of light, and an OLED disposed in the third light emitting region B3 in the third sub pixel region SP3 emits a blue (B) color of light.",
"FIG.",
"3 is a cross sectional view illustrating an example of the organic light emitting display device 10 of FIG.",
"2 as taken along line I-I′ in accordance with an embodiment of the present invention.",
"Referring to FIG.",
"3, the organic light emitting display device 10 includes a substrate 100, transistors, capacitors, a first electrode 170, an organic layer structure 190, and a second electrode 195.The substrate 100 may include a transparent insulation substrate.",
"For example, the substrate 100 may include a glass substrate, a quartz substrate, a transparent resin substrate, etc.",
"In other embodiments, the substrate 100 may be a flexible substrate.",
"In the embodiment of FIG.",
"3, the substrate 100 is divided into a transparent region T and a light emitting region B2.Each of the pixel regions P may include a plurality of sub pixel regions, each of which may include a light emitting region, such as a second light emitting region B2, as illustrated in FIG.",
"2.In FIG.",
"3, a barrier layer 105 is disposed on the substrate 100.The barrier layer 105 may provide a flat top surface, and may prevent impurities from diffusing into the substrate 100.The barrier layer 105 may include an inorganic material, an organic material, or a stacked structure thereof.",
"The inorganic material may include, for example, silicon oxide, silicon nitride, silicon oxy nitride, aluminum oxide, aluminum nitride, titanium oxide, or titanium nitride, while the organic material may include polyimide, polyester, or acryl.",
"In other embodiments, the barrier layer 105 may have a stacked structure including at least one organic layer and at least one inorganic layer.",
"In still other embodiments, the barrier layer 105 may be omitted.",
"In FIG.",
"3, a first semiconductor pattern 110 and a second semiconductor pattern 115 are disposed on the barrier layer 105.The first and second semiconductor patterns 110 and 115 are disposed in the light emitting region B2, and are not disposed in the transparent region T. The first and second semiconductor patterns 110 and 115 may include oxide semiconductor, polysilicon, doped polysilicon, amorphous silicon, doped amorphous silicon, or the like.",
"In some embodiments, the first and second semiconductor patterns 110 and 115 may include a binary compound (ABx), a ternary compound (ABxCy), a quaternary compound (ABxCyOz), etc., which may contain indium (In), zinc (Zn), gallium (Ga), tin (Sn), titanium (Ti), aluminum (Al), hafnium (Hf), zirconium (Zr), magnesium (Mg), etc.",
"These may be used alone or in a mixture thereof.",
"For example, the first and second semiconductor patterns 110 and 115 may include a G-I-Z-O layer [(In2O3)a(Ga2O3)b(ZnO)c layer], wherein a, b, and c are each a real number satisfying a ≥0, b≥0, c>0.In the embodiment of FIG.",
"3, the first semiconductor pattern 110 includes a first source region 113, a first drain region 112, and a first channel region 111 disposed therebetween.",
"Further, the second semiconductor pattern 115 includes a second source region 118, a second drain region 117, and a second channel region 116 disposed therebetween.",
"In FIG.",
"3, a gate insulation layer 120 is disposed on the barrier layer 105 to cover the first and second semiconductor patterns 110 and 115.The gate insulation layer 120 may include, for example, silicon oxide, silicon nitride, or a high k-dielectric material.",
"In some embodiments, the gate insulation layer 120 may be a single layer including silicon oxide and having a thickness in a range of about 800 Å A to about 1200 Å.",
"In FIG.",
"3, first and second gate electrodes 122 and 124, and a first conductive pattern 126 are disposed on the gate insulation layer 120.The first gate electrode 122 overlaps the first channel region 111 of the first semiconductor pattern 110 and the second gate electrode 124 overlaps the second channel region 116 of the second semiconductor pattern 115.Further, the first conductive pattern 126 is disposed in the light emitting region B2, and is not disposed in the transparent region T. In FIG.",
"3, a first insulating interlayer 130 is disposed on the gate insulation layer 120 to cover the first and second gate electrodes 122 and 124, and the first conductive pattern 126.The first insulating interlayer 130 may include, for example, silicon oxide.",
"A second conductive pattern 132 is disposed on the first insulating interlayer 130 to overlap the first conductive pattern 126.The second conductive pattern 132 may include, for example, a metal such as aluminum (Al), copper (Cu), tungsten (W), chromium (Cr), or a conductive metal oxide such as indium tin oxide (ITO).",
"In some embodiments, the second conductive pattern 132 may have a thickness that is smaller than those of the first and second gate electrodes 122 and 124.The first conductive pattern 126, the second conductive pattern 132, and the first insulating interlayer 130 disposed therebetween may constitute a first capacitor.",
"For example, in some embodiments, the first capacitor may be the storage capacitor or the C-hold capacitor described above with reference to FIG.",
"2.In FIG.",
"3, second insulating interlayer patterns 135 are disposed on the first insulating interlayer 130.The second insulating interlayer patterns 135 are disposed to correspond to the first and second semiconductor patterns 110 and 115, and the second conductive pattern 132.In some embodiments, the second insulating interlayer patterns 135 may have a thickness that is smaller than that of the first insulating interlayer 130.In some embodiments, the second insulating interlayer patterns 135 include a material that has a higher dielectric constant than a material of the first insulating interlayer 130.The second insulating interlayer patterns 135 may include, for example, silicon nitride.",
"In FIG.",
"3, a first source electrode 142 and 152, a first drain electrode 141 and 151, a second source electrode 144 and 154, a second drain electrode 143 and 153, and third, fourth, fifth, and sixth conductive patterns 146, 156, 148, and 158 are disposed to correspond to the second insulating interlayer patterns 135.The first source electrode 142 and 152, and the first drain electrode 141 and 151 may constitute a first transistor in conjunction with the first semiconductor pattern 110 and the first gate electrode 122.The second source electrode 144 and 154 and the second drain electrode 143 and 153 may constitute a second transistor in conjunction with the second semiconductor pattern 115 and the second gate electrode 124.For example, the first transistor may be the driving transistor described above with reference to FIG.",
"2, and the second transistor may be the switching transistor described above with reference to FIG.",
"2.The first and second transistors illustrated in FIG.",
"3 have a top gate structure in which the first and second gate electrodes 122 and 124 are disposed above the first and second semiconductor patterns 110 and 115.However, the present invention is not limited thereto.",
"In other embodiments, for example, the first and second transistors may have a bottom gate structure in which the semiconductor patterns are disposed above the gate electrodes.",
"In FIG.",
"3, the third conductive pattern 146 and the fourth conductive pattern 156 are disposed on one of the second insulating interlayer patterns 135 to overlap the second conductive pattern 132.The third and fourth conductive patterns 146 and 156, the second conductive pattern 132, and the second insulating interlayer pattern 135 disposed therebetween may constitute a second capacitor.",
"When the second insulating interlayer pattern 135 includes silicon nitride, the second capacitor may have a higher capacitance than when the second insulating interlayer pattern 135 includes silicon oxide.",
"Further, the second insulating interlayer pattern 135 may have a thickness smaller than that of the first insulating interlayer 130, so that the second capacitor may have a capacitance higher than that of the first capacitor.",
"In addition, in some embodiments, the second insulating interlayer pattern 135 includes a material that has a higher dielectric constant than a material of the first insulating interlayer 130.For example, in some embodiments, the second capacitor may be the storage capacitor or the C-hold capacitor described above with reference to FIG.",
"2.For example, when the first capacitor is the C-hole capacitor, the second capacitor may be the storage capacitor.",
"In other embodiments, when the second capacitor is the storage capacitor, the first capacitor may be the C-hold capacitor.",
"In FIG.",
"3, the fifth conductive pattern 148 and the sixth conductive pattern 158 are disposed on one of the second insulating interlayer patterns 135.The fifth conductive pattern 148 and the sixth conductive pattern 158 may serve as a contact pad for the data line DL, the gate line GL, or the power line described above with reference to FIG.",
"2.In some embodiments, the second insulating interlayer patterns 135 may be disposed only where the first source electrode 142 and 152, the first drain electrode 141 and 151, the second source electrode 144 and 154, the second drain electrode 143 and 153, and the third, fourth, fifth, and sixth conductive patterns 146, 156, 148, and 158 are disposed.",
"The second insulating interlayer patterns 135 may only partially cover the light emitting region B2, so that a transparency of the organic light emitting display device may be improved from about 3% to about 5%.",
"Referring now to FIG.",
"3, a planarization layer 160 is disposed in the light emitting region B2 of the substrate 100 to cover the transistors and the capacitors.",
"Further, the planarization layer 160 is not disposed in the transparent region T. In the embodiment of FIG.",
"3, a first opening 162 is disposed in the transparent region T of the substrate 100, penetrating the planarization layer 160 to expose the first insulating interlayer 130.Further, a second opening 164 penetrates the planarization layer 160 in the light emitting region B2 to expose the sixth conductive pattern 158.In FIG.",
"3, the first opening 162 is defined by a top surface of the first insulating interlayer 130 and an exposed sidewall of the planarization layer 160.The first insulating interlayer 130 and the gate insulation layer 120 extend from the light emitting region B2 to the transparent region T. Further, a sidewall of the first insulating interlayer 130 and a sidewall of the gate insulation layer 120 are not disposed in the transparent region T, so that sharpness of the organic light emitting display device may be improved as described below with reference to FIGS.",
"3 to 7.In FIG.",
"3, the first electrode 170 is disposed on the planarization layer 160.The first electrode 170 penetrates the planarization layer 160 to be electrically connected to the first drain electrode 141 and 151.The first electrode 170 may include, for example, a transparent conductive material such as indium tin oxide (ITO), indium zinc oxide (IZO), etc.",
"In FIG.",
"3, a pixel defining layer 180 is disposed on the planarization layer 160 to partially cover the first electrode 170.The pixel defining layer 180 may include, for example, an organic material such as polyimide.",
"In the embodiment of FIG.",
"3, the pixel defining layer 180 is disposed in the pixel region P and is not disposed in the transparent region T. As such, the pixel defining layer 180 is not disposed on a bottom surface or a sidewall of the first opening 162.Accordingly, a sidewall of the pixel defining layer 180 is not disposed in the transparent region T so that sharpness of the organic light emitting display device may be improved as described with reference to FIGS.",
"3 to 7.The organic layer structure 190 may include an organic light emitting layer.",
"In some embodiments, the organic layer structure 190 may further include a hole injection layer, a hole transfer layer, an electrode injection layer, and an electrode transfer layer, or combinations thereof.",
"In FIG.",
"3, the second electrode 195 is disposed on the organic layer structure 190 and the pixel defining layer 180.The second electrode 195 may include, for example, aluminum (Al), platinum (Pt), silver (Ag), gold (Au), magnesium (Mg), chromium (Cr), tungsten (W), molybdenum (Mo), titanium (Ti), or an alloy thereof.",
"The second electrode 195 may have a relatively small thickness, so that the second electrode 195 may have a relatively high transparency.",
"In the embodiment of FIG.",
"3, the second electrode 195 is disposed in the light emitting region B2 and not in the transparent region T. In other embodiments, the second electrode 195 is disposed in the light emitting region B2 and the transparent region T. According to the embodiment of FIG.",
"3, the gate insulation layer 120 and the first insulating interlayer 130 extend from the light emitting region B2 to the transparent region T so that a sidewall of the gate insulation layer 120 and a sidewall of the first insulating interlayer 130 are not disposed in the transparent region T. Further, the pixel defining layer 180 is disposed only in the light emitting region B2 so that a sidewall of the pixel defining layer 180 is not disposed in the transparent region T. Accordingly, the sharpness of the organic light emitting display device may be improved.",
"Further, the first conductive pattern 126, the second conductive pattern 132, the third conductive pattern 146, and the fourth conductive pattern 156 are disposed to overlap each other so that the first capacitor and the second capacitor overlap each other.",
"Accordingly, an opening ratio of the organic light emitting display device may increase.",
"FIG.",
"4 is a schematic view illustrating a test for measuring sharpness of an organic light emitting display device 10.In more detail, FIG.",
"4(a) is a schematic view illustrating a test for measuring sharpness of an organic light emitting display device 10, FIG.",
"4(b) is an original image of a light source, and FIG.",
"4(c) is a penetrated image passing through the organic light emitting display device.",
"Referring to FIG.",
"4(a), light having an original image is radiated from a light source 20 to the organic light emitting display device 10.The light passing through the organic light emitting display device 10 forms a penetrated image on a surface of a target 30.In this case, a first distance (d1) between the light source 20 and the organic light emitting display device 10 may be about 0.5 m, and a second distance (d2) between the organic light emitting display device 10 and the target 30 may be about 1 m. Referring to FIG.",
"4(b), the original image has a sharp boundary line (e.g., border, perimeter) having an octagonal form.",
"Meanwhile, referring to FIG.",
"4(c), the penetrated image has a blurred boundary.",
"Since the boundary is unclear, the organic light emitting display device 10 has a lower sharpness than that of FIG.",
"4(b).",
"The sharpness of the organic light emitting display device may be quantified by the above test.",
"As a baseline, the original image has a sharpness of zero, and as the sharpness of the penetrated image gets closer to zero, the organic light emitting display device has an improved sharpness.",
"That is, a sharpness of zero represents ideal or near ideal sharpness, with the sharpness steadily degrading as the measured sharpness (blurriness) increases.",
"Table 1 shows sharpness test results of organic light emitting display devices in accordance with an example embodiment and comparable organic light emitting display devices.",
"TABLE 1 Sharpness Original image 0 Example embodiment 1 1.2 Comparable display device 1 1.6 Comparable display device 2 1.6 The organic light emitting display device in accordance with example embodiment 1 is substantially similar to that described above with reference to FIG.",
"3.The comparable organic light emitting display device 1 is substantially similar to that described below with reference to FIG.",
"5, and the comparable organic light emitting display device 2 is substantially similar to that described below with reference to FIG.",
"6.FIG.",
"5 is a cross sectional view illustrating a comparable organic light emitting display device.",
"The organic light emitting display device may be substantially similar to that described above with reference to FIG.",
"3 except for a first opening 161, a barrier layer 106, a gate insulation layer 121, and a first insulating interlayer 131.In FIG.",
"5, the first opening 161 is disposed to penetrate the planarization layer 160, the barrier layer 106, the gate insulation layer 121, and the first insulating interlayer 131.Therefore, the first opening 161 is defined by a top surface of the substrate 100 and sidewalls of the planarization layer 160, the barrier layer 106, the gate insulation layer 121, and the first insulating interlayer 131.Therefore, the transparent region T is divided into a first area where sidewalls of the barrier layer 106, the gate insulation layer 121, and the first insulating interlayer 131 are disposed and a second area where the barrier layer 106, the gate insulation layer 121, and the first insulating interlayer 131 are not disposed.",
"That is, sidewalls A of the barrier layer 106, the gate insulation layer 121, and the first insulating interlayer 131 are disposed in the transparent region T. As shown above in Table 1, sidewalls A of the barrier layer 106, the gate insulation layer 121, and the first insulating interlayer 131 may degrade sharpness of the organic light emitting display device.",
"FIG.",
"6 is a cross sectional view illustrating another comparable organic light emitting display device.",
"The organic light emitting display device is substantially similar to that described above with reference to FIG.",
"3 except for a pixel defining layer 181.In FIG.",
"6, the pixel defining layer 181 is disposed on a top surface of the planarization layer 160 and a sidewall of the first opening 163.Therefore, the transparent region T is divided into a first area where a sidewall of the pixel defining layer 181 is disposed and a second area where the pixel defining layer 181 is not disposed.",
"As such, a sidewall B of the pixel defining layer 181 is disposed in the transparent region T. As shown above in Table 1, sidewall B of the pixel defining layer 181 may degrade sharpness of the organic light emitting display device.",
"FIG.",
"7 is a cross sectional view illustrating another organic light emitting display device in accordance with an embodiment of the present invention.",
"The organic light emitting display device is substantially similar to that described above with reference to FIG.",
"3 except for a second insulating interlayer 140, third insulating interlayer patterns 138, a second gate electrode 134, and a second conductive pattern 136.In FIG.",
"7, the substrate 100 is divided into a transparent region T and a light emitting region B2 as illustrated in FIG.",
"2.A barrier layer 105 is disposed on the substrate 100.The barrier layer 105 may provide a flat top surface, and may prevent impurities from diffusing into the substrate 100.In FIG.",
"7, a first semiconductor pattern 110 and a second semiconductor pattern 115 are disposed on the barrier layer 105.In the embodiment of FIG.",
"7, the first semiconductor pattern 110 includes a first source region 113, a first drain region 112, and a first channel region 111 disposed therebetween.",
"Further, the second semiconductor pattern 115 includes a second source region 118, a second drain region 117, and a second channel region 116 disposed therebetween.",
"In FIG.",
"7, a gate insulation layer 120 is disposed on the barrier layer 105 to cover the first and second semiconductor patterns 110 and 115.A first gate electrode 122 and a first conductive pattern 126 are disposed on the gate insulation layer 120.In some embodiments, the first gate electrode 122 and the first conductive pattern 126 may have an identical thickness, and may include an identical material.",
"In FIG.",
"7, a first insulating interlayer 130 is disposed on the gate insulation layer 120 to cover the first gate electrode 122 and the first conductive pattern 126.A second gate electrode 134 and a second conductive pattern 136 are disposed on the first insulating interlayer 130.In some embodiments, the second gate electrode 134 and the second conductive pattern 136 may have an identical thickness, and may include an identical material.",
"The first conductive pattern 126, the second conductive pattern 136, and the first insulating interlayer 130 disposed therebetween may constitute a first capacitor.",
"Referring now to FIG.",
"7, a planarization layer 160 is disposed in the light emitting region B2 of the substrate 100 to cover the transistors and the capacitors.",
"The planarization layer 160 is not disposed in the transparent region T. In the embodiment of FIG.",
"7, a first opening 162 is defined by a top surface of the first insulating interlayer 130 and an exposed sidewall of the planarization layer 160.The first insulating interlayer 130 and the gate insulation layer 120 extend from the light emitting region B2 to the transparent region T. As such, a sidewall of the first insulating interlayer 130 and a sidewall of the gate insulation layer 120 are not disposed in the transparent region T, so that sharpness of the organic light emitting display device may be improved as described with reference to FIGS.",
"3 to 7.In FIG.",
"7, the first electrode 170 is disposed on the planarization layer 160.The first electrode 170 penetrates the planarization layer 160 to be electrically connected to the first drain electrode 141 and 151.A pixel defining layer 180 is disposed on the planarization layer 160 to partially cover the first electrode 170.The pixel defining layer 180 may include, for example, an organic material such as polyimide.",
"In the embodiment of FIG.",
"7, the pixel defining layer 180 is disposed in the pixel region P, and is not disposed in the transparent region T. Accordingly, the pixel defining layer 180 is not disposed on a bottom surface or a sidewall of the first opening 162.As such, a sidewall of the pixel defining layer 180 is not disposed in the transparent region T, so that sharpness of the organic light emitting display device may be improved as described with reference to FIGS.",
"3 to 7.FIGS.",
"8 to 14 are cross sectional views illustrating a method of manufacturing an organic light emitting display device in accordance with an embodiment of the present invention.",
"In more detail, FIGS.",
"8 to 14 are cross sectional views cut along line I-I′ of FIG.",
"2.Referring to FIG.",
"8, a barrier layer 105, first and second semiconductor patterns 110 and 115, and a gate insulation layer 120 are formed on a substrate 100.The substrate 100 may include a transparent insulation substrate.",
"For example, the substrate 100 may include a glass substrate, a quartz substrate, a transparent resin substrate, etc.",
"In other embodiments, the substrate 100 may be a flexible substrate.",
"In the embodiment of FIGS.",
"8 to 14, the substrate 100 is divided into a transparent region T and a light emitting region B2 as also illustrated in FIG.",
"2.In FIG.",
"8, the barrier layer 105 is formed on the substrate 100.The barrier layer 105 may provide a flat top surface, and may prevent impurities from diffusing into the substrate 100.The barrier layer 105 may be formed, for example, using an inorganic material, an organic material, or a stacked structure thereof.",
"The inorganic material may include, for example, silicon oxide, silicon nitride, silicon oxy nitride, aluminum oxide, aluminum nitride, titanium oxide, or titanium nitride, and the organic material may include, for example, polyimide, polyester, or acryl.",
"In other embodiments, the barrier layer 105 may have a stacked structure including at least one organic layer and at least one inorganic layer.",
"In still other embodiments, the barrier layer 105 may be omitted.",
"In FIG.",
"8, the first semiconductor pattern 110 and the second semiconductor pattern 115 are formed on the barrier layer 105.In more detail, a semiconductor layer may be formed on the barrier layer 105, and the semiconductor layer may be partially removed to form the first semiconductor pattern 110 and the second semiconductor pattern 115.In the embodiment of FIG.",
"8, the first and second semiconductor patterns 110 and 115 are disposed in the light emitting region B2, and are not disposed in the transparent region T. The first and second semiconductor patterns 110 and 115 may be formed, for example, using oxide semiconductor, polysilicon, doped polysilicon, amorphous silicon, doped amorphous silicon, or the like.",
"In more detail, the first and second semiconductor patterns 110 and 115 may be formed, for example, by depositing an amorphous silicon layer, and crystallizing the amorphous silicon layer.",
"In other embodiments, the first and second semiconductor patterns 110 and 115 may be formed, for example, using oxide semiconductor by a sputtering process or a chemical vapor deposition (CVD) process.",
"In FIG.",
"8, the gate insulation layer 120 is formed on the barrier layer 105 to cover the first and second semiconductor patterns 110 and 115.The gate insulation layer 120 may be formed, for example, using silicon oxide, silicon nitride, or a high k-dielectric material.",
"When the gate insulation layer 120 includes silicon oxide, an interface between the gate insulation layer 120 and the first and second semiconductor patterns 110 and 115 may be chemically stable.",
"Referring to FIG.",
"9, first and second gate electrodes 122 and 124 and a first conductive pattern 126 are formed on the gate insulation layer 120.In more detail, a first conductive layer may be formed on the gate insulation layer 120, and the first conductive layer may be partially removed to concurrently (e.g., simultaneously) form the first gate electrode 122, the second gate electrode 124, and the first conductive pattern 126.In the embodiment of FIG.",
"9, the first gate electrode 122 may partially overlap the first semiconductor pattern 110, and the second gate electrode 124 may partially overlap the second semiconductor pattern 115.Then, a first insulating interlayer 130 may be formed on the gate insulation layer 120 to cover the first and second gate electrodes 122 and 124 as well as the first conductive pattern 126 by, for example, a CVD process.",
"The first insulating interlayer 130 may be formed, for example, using silicon oxide.",
"In some embodiments, the first insulating interlayer 130 and the gate insulation layer 120 may include an identical material.",
"Impurities may be implanted into the first and second semiconductor patterns 110 and 115 by using the first and second gate electrodes 122 and 124 as an ion implantation mask.",
"As such, in FIG.",
"9, the first semiconductor pattern 110 includes a first source region 113, a first drain region 112, and a first channel region 111 disposed therebetween.",
"Further, the second semiconductor pattern 115 includes a second source region 118, a second drain region 117, and a second channel region 116 disposed therebetween.",
"Referring to FIG.",
"10, a second conductive pattern 132 is formed on the first insulating interlayer 130 to overlap the first conductive pattern 126.The second conductive pattern 132 may include a metal such as aluminum (Al), copper (Cu), tungsten (W), chromium (Cr), or a conductive metal oxide such as indium tin oxide (ITO).",
"In more detail, when the second conductive pattern 132 includes ITO, the second conductive pattern 132 may have a relatively low electrical resistance and a relatively high mechanical strength.",
"The first conductive pattern 126, the second conductive pattern 132, and the first insulating interlayer 130 disposed therebetween may constitute a first capacitor.",
"For example, in some embodiments, the first capacitor may be the storage capacitor or the C-hold capacitor described above with reference to FIG.",
"2.Referring to FIG.",
"11, second insulating interlayer patterns 135, a first source electrode 142 and 152, a first drain electrode 141 and 151, a second source electrode 144 and 154, a second drain electrode 143 and 153, and third, fourth, fifth, and sixth conductive patterns 146, 156, 148, and 158 are formed on the first insulating interlayer 130 and second conductive pattern 132.In more detail, a second insulating interlayer may be formed on the first insulating interlayer 130, and the gate insulation layer 120, the first insulating interlayer 130, and the second insulating interlayer may be partially removed to form contact holes exposing the first and second source regions 113 and 118, and the first and second drain regions 112 and 117.A second conductive layer and a third conductive layer may be sequentially formed on the second insulating interlayer to fill the contact holes.",
"Then, the second insulating interlayer, the second conductive layer, and the third conductive layer may be partially removed to concurrently (e.g., simultaneously) form the second insulating interlayer patterns 135, the first source electrode 142 and 152, the first drain electrode 141 and 151, the second source electrode 144 and 154, the second drain electrode 143 and 153, and the third, fourth, fifth, and sixth conductive patterns 146, 156, 148, and 158.For example, the second insulating interlayer may be etched during a process for etching the second conductive layer and the third conductive layer.",
"The first source electrode 142 and 152, and the first drain electrode 141 and 151 may constitute a first transistor in conjunction with the first semiconductor pattern 110 and the first gate electrode 122.In addition, the second source electrode 144 and 154 and the second drain electrode 143 and 153 may constitute a second transistor in conjunction with the second semiconductor pattern 115 and the second gate electrode 124.In some embodiments, the second insulating interlayer patterns 135 may be formed, for example, using silicon nitride.",
"During a deposition process for forming the second insulating interlayer, hydrogen atoms or hydrogen molecules may be generated in the second insulating interlayer.",
"The hydrogen atoms or hydrogen molecules may migrate into the first and second semiconductor patterns 110 and 115, so that damaged portions of the first and second semiconductor patterns 110 and 115 may be cured.",
"In some embodiments, the first source electrode 142 and 152, the first drain electrode 141 and 151, the second source electrode 144 and 154, and the second drain electrode 143 and 153 may have a multi-layer structure including different conductive materials.",
"Referring now to FIG.",
"11, the third conductive pattern 146 and the fourth conductive pattern 156 are formed on one of the second insulating interlayer patterns 135 to overlap the second conductive pattern 132.The third and fourth conductive patterns 146 and 156, the second conductive pattern 132, and one of the second insulating interlayer patterns 135 disposed therebetween may constitute a second capacitor.",
"When the second insulating interlayer pattern 135 includes silicon nitride, the second capacitor may have a higher capacitance, as compared to the case where the second insulating interlayer pattern 135 includes silicon oxide.",
"In some embodiments, the second capacitor may be the storage capacitor or the C-hold capacitor described above with reference to FIG.",
"2.In the embodiment of FIG.",
"11, the first conductive pattern 126, the second conductive pattern 132, the third conductive pattern 146, and the fourth conductive pattern 156 are disposed to overlap each other, so that the first capacitor and the second capacitor overlap each other.",
"Accordingly, an opening ratio of the organic light emitting display device may increase.",
"In FIG.",
"11, the fifth conductive pattern 148 and the sixth conductive pattern 158 are disposed on one of the second insulating interlayer patterns 135.In some embodiments, the fifth conductive pattern 148 and the sixth conductive pattern 158 may serve as a contact pad for the data line DL, the gate line GL, or the power line described above with reference to FIG.",
"2.Referring to FIG.",
"12, a planarization layer 160 is formed on the first insulating interlayer 130 to cover the transistors and capacitors.",
"The planarization layer 160 may be formed, for example, by a coating process such as a spin coating process using an organic material such as polyimide, polyester, acryl, etc.",
"The planarization layer 160 may have a substantially flat top surface.",
"The planarization layer 160 may be formed, for example, using polyimide.",
"In FIG.",
"12, the planarization layer 160 is partially removed to form a first opening 162 and a second opening 164.The first opening 162 is disposed in the transparent region T. The second opening 164 exposes the sixth conductive pattern 158 in the light emitting region B2.In the embodiment of FIG.",
"12, the first opening 162 is formed to expose a top surface of the first insulating interlayer 130 in the transparent region T. As such, the first opening 162 is defined by a top surface of the first insulating interlayer 130 and a sidewall of the exposed planarization layer 160.In FIG.",
"12, during a process for forming the first opening 162, the first insulating interlayer 130 and the gate insulation layer 120 are not removed.",
"As such, the first insulating interlayer 130 and the gate insulation layer 120 extend from the light emitting region B2 to the transparent region T. Accordingly, a sidewall of the first insulating interlayer 130 and a sidewall of the gate insulation layer 120 are not disposed in the transparent region T, so that sharpness of the organic light emitting display device may be improved as described above with reference to FIGS.",
"3 to 7.Referring to FIG.",
"13, a first electrode 170 is formed on the planarization layer 160.In more detail, the planarization layer 160 is partially removed to form a contact hole exposing the first drain electrode 151, a fourth conductive layer may be formed on the planarization layer 160 to fill the contact hole, and then the fourth conductive layer may be partially removed to form the first electrode 170.The first electrode 170 may be formed, for example, using a transparent conductive material such as indium tin oxide (ITO), indium zinc oxide (IZO), etc.",
"Referring to FIG.",
"14, a pixel defining layer 180 is formed on the planarization layer 160 to partially cover the first electrode 170.In the embodiment of FIG.",
"14, the pixel defining layer 180 is formed in the light emitting region B2, and is not formed in the transparent region T. As such, the pixel defining layer 180 is not formed on a bottom surface or a sidewall of the first opening 162.Accordingly, a sidewall of the pixel defining layer 180 is not disposed in the transparent region T, so that sharpness of the organic light emitting display device may be improved as described above with reference to FIGS.",
"3 to 7.Then, an organic layer structure including a light emitting layer and a second electrode may be formed to manufacture the organic light emitting display device.",
"FIGS.",
"15 to 20 are cross sectional views illustrating another method of manufacturing an organic light emitting display device in accordance with an embodiment of the present invention.",
"Referring to FIG.",
"15, a barrier layer 105, first and second semiconductor patterns 110 and 115, and a gate insulation layer 120 are formed on a substrate 100.Processes for forming the barrier layer 105, the first and second semiconductor patterns 110 and 115, and the gate insulation layer 120 may be, for example, substantially similar to or identical to those described above with reference to FIG.",
"9.Referring to FIG.",
"16, a first gate electrode 122 and a first conductive pattern 126 may be formed on the gate insulation layer 120.In more detail, a first conductive layer may be formed on the gate insulation layer 120, and the first conductive layer may be partially removed to concurrently (e.g., simultaneously) form the first gate electrode 122 and the first conductive pattern 126.In the embodiment of FIG.",
"16, the first gate electrode 122 partially overlaps the first semiconductor pattern 110, and the first conductive pattern 126 does not overlap the first and second semiconductor patterns 110 and 115.Then, in FIG.",
"16, a first insulating interlayer 130 is formed on the gate insulation layer 120 to cover the first gate electrode 122 and the first conductive pattern 126.The first insulating interlayer 130 may be formed, for example, using silicon oxide.",
"Impurities may be implanted into the first semiconductor pattern 110 by using the first gate electrode 122 as an ion implantation mask.",
"As such, the first semiconductor pattern 110 may include a first source region 113, a first drain region 112, and a first channel region 111 disposed therebetween.",
"Referring to FIG.",
"17, a second gate electrode 134 and a second conductive pattern 136 are formed on the first insulating interlayer 130.In more detail, a second conductive layer may be formed on the first insulating interlayer 130, and then the second conductive layer may be partially removed to concurrently (e.g., simultaneously) form the second gate electrode 134 and the second conductive pattern 136.In the embodiment of FIG.",
"17, the second gate electrode 134 partially overlaps the second semiconductor pattern 115, and the second conductive pattern 136 may overlap the first conductive pattern 126.The first conductive pattern 126, the second conductive pattern 132, and the first insulating interlayer 130 disposed therebetween may constitute a first capacitor.",
"In some embodiments, the first capacitor may be the storage capacitor or the C-hold capacitor described above with reference to FIG.",
"2.Then, in FIG.",
"17, a second insulating interlayer 140 is formed on the first insulating interlayer 130 to cover the second gate electrode 134 and the second conductive pattern 136.The second insulating interlayer 140 may include, for example, silicon oxide.",
"Further, impurities may be implanted into the second semiconductor pattern 115 by using the second gate electrode 124 as an ion implantation mask.",
"As such, the second semiconductor pattern 115 may include a second source region 118, a second drain region 117, and a second channel region 116 disposed therebetween.",
"Referring to FIG.",
"18, third insulating interlayer patterns 138, a first source electrode 142 and 152, a first drain electrode 141 and 151, a second source electrode 144 and 154, a second drain electrode 143 and 153, and third, fourth, fifth, and sixth conductive patterns 146, 156, 148, and 158 are formed on the first insulating interlayer 130.These processes may be, for example, substantially similar to those described above with reference to FIG.",
"11 (e.g., the third insulating interlayer patterns 138 of FIG.",
"18 may be formed in a substantially similar way to the second insulating interlayer patterns 135 of FIG.",
"11).",
"In some embodiments, the third insulating interlayer patterns 138 may be formed, for example, using silicon nitride.",
"During a deposition process for forming the second insulating interlayer 140, hydrogen atoms or hydrogen molecules may be generated in the second insulating interlayer 140.The hydrogen atoms or hydrogen molecules may migrate into the first and second semiconductor patterns 110 and 115, so that damaged portions of the first and second semiconductor patterns 110 and 115 may be cured.",
"Further, in FIG.",
"18, the third insulating interlayer patterns 138 are disposed where the first source electrode 142 and 152, the first drain electrode 141 and 151, the second source electrode 144 and 154, the second drain electrode 143 and 153, and the third, fourth, fifth, and sixth conductive patterns 146, 156, 148, and 158 are disposed.",
"As such, the third insulating interlayer patterns 138 may only partially cover the light emitting region B2, so that transparency of the organic light emitting display device may be improved from about 3% to about 5%.",
"Further, the first source electrode 142 and 152, and the first drain electrode 141 and 151 may constitute a first transistor in conjunction with the first semiconductor pattern 110 and the first gate electrode 122.The second source electrode 144 and 154 and the second drain electrode 143 and 153 may constitute a second transistor in conjunction with the second semiconductor pattern 115 and the second gate electrode 134.As such, a distance between the second semiconductor pattern 115 and the second gate electrode 134 may be greater than a distance between the first semiconductor pattern 110 and the first gate electrode 122.In some embodiments, the first source electrode 142 and 152, the first drain electrode 141 and 151, the second source electrode 144 and 154, and the second drain electrode 143 and 153 may have a multi-layer structure including different conductive materials.",
"Referring now to FIG.",
"18, the third conductive pattern 146 and the fourth conductive pattern 156 are formed on one of the third insulating interlayer patterns 138 to overlap the second conductive pattern 136.Therefore, the third and fourth conductive patterns 146 and 156, the second conductive pattern 136, and the third insulating interlayer pattern 138 disposed therebetween may constitute a second capacitor.",
"According to the embodiment of FIG.",
"18, the first capacitor and the second capacitor overlap each other.",
"Accordingly, an opening ratio of the organic light emitting display device may increase.",
"Referring to FIG.",
"19, a planarization layer 160 is formed on the second insulating interlayer 140 to cover the transistors and capacitors, and a first electrode 170 is formed on the planarization layer 160.These processes may be substantially similar, for example, to those described above with reference to FIGS.",
"12 and 13.In FIG.",
"19, the planarization layer 160 is partially removed to form a first opening 162 and a second opening 164.In the embodiment of FIG.",
"19, the first opening 162 is formed to expose a top surface of the second insulating interlayer 140 in the transparent region T. That is, the first opening 162 may be defined by a top surface of the second insulating interlayer 140 and a sidewall of the exposed planarization layer 160.That is, a sidewall of the second insulating interlayer 140, a sidewall of the first insulating interlayer 130, and a sidewall of the gate insulation layer 120 are not disposed in the transparent region T, so that sharpness of the organic light emitting display device may be improved as described above with reference to FIGS.",
"3 to 7.Referring to FIG.",
"20, a pixel defining layer 180 is formed on the planarization layer 160 to partially cover the first electrode 170.These processes may be substantially similar, for example, to those described above with reference to FIG.",
"14.In the embodiment of FIG.",
"20, the pixel defining layer 180 is formed in the light emitting region B2, and not formed in the transparent region T. As such, in FIG.",
"20, the pixel defining layer 180 is not formed on a bottom surface or a sidewall of the first opening 162.In FIG.",
"20, a sidewall of the pixel defining layer 180 is not disposed in the transparent region T, so that sharpness of the organic light emitting display device may be improved as described above with reference to FIGS.",
"3 to 7.Then, an organic layer structure including a light emitting layer and a second electrode may be formed to manufacture the organic light emitting display device.",
"The foregoing description is illustrative of example embodiments of the present invention, and is not to be construed as limiting thereof.",
"Although a few example embodiments have been described, those skilled in the art will readily appreciate that many modifications are possible without materially departing from the novel teachings and aspects of the present invention.",
"Accordingly, all such modifications are intended to be included within the scope of the present invention as defined in the claims that follow.",
"In the claims, means-plus-function clauses are intended to cover the structures described herein as performing the recited function and not only structural equivalents but also equivalent structures.",
"Therefore, it is to be understood that the foregoing is illustrative of example embodiments of the present invention and is not to be construed as limited to the specific embodiments disclosed, and that modifications to the disclosed embodiments, as well as other embodiments, are intended to be included within the scope of the present invention.",
"The present invention is defined by the following claims, with equivalents of the claims to be included therein."
]
] |
Patent_15871093
|
[
[
"CATHODE ELECTRODE MATERIAL AND LITHIUM SULFUR BATTERY USING THE SAME",
"A cathode electrode material and a lithium sulfur battery are disclosed.",
"The cathode electrode material includes the cathode binder.",
"The cathode binder includes a polymer obtained by polymerizing a dianhydride monomer with a diamine monomer.",
"At least one of the dianhydride monomer and the diamine monomer includes a silicon-containing monomer.",
"The lithium sulfur battery includes an anode electrode, an electrolyte, and the cathode electrode, the cathode electrode includes a sulfur containing cathode active material, a conducting agent, and the cathode binder."
],
[
"1.A cathode electrode material comprising a sulfur containing cathode active material, a conducting agent, and a cathode binder, wherein the cathode binder comprises a polymer obtained by polymerizing a dianhydride monomer with a diamine monomer, wherein at least one of the dianhydride monomer and the diamine monomer comprises a silicon-containing monomer.",
"2.The cathode electrode material of claim 1, wherein the dianhydride monomer comprises a first monomer represented by a formula I, wherein R1 is a first silicon-containing bivalent organic substituent.",
"3.The cathode electrode material of claim 2, wherein R1 is selected from the group consisting of wherein n is in a range from 1 to 6; R5, R6, R7, and R8 are independently selected from the group consisting of an alkyl group with 1 to 6 carbon atoms, an alkoxy group with 1 to 6 carbon atoms, a monovalent alicyclic group, a monovalent substituted alicyclic group, a monovalent aromatic group, a monovalent substituted aromatic group, —C(O)R, —RS(O)R, and —RNH2R, wherein R is an alkyl group with 1 to 6 carbon atoms.",
"4.The cathode electrode material of claim 2, wherein R1 is selected from the group consisting of 5.The cathode electrode material of claim 1, wherein the diamine monomer comprises a second monomer represented by a formula II, wherein R2 is a second silicon-containing bivalent organic substituent.",
"6.The cathode electrode material of claim 5, wherein R2 is selected from the group consisting of wherein n is in a range from 1 to 6; R5, R6, R7, and R8 are independently selected from the group consisting of an alkyl group with 1 to 6 carbon atoms, an alkoxy group with 1 to 6 carbon atoms, a monovalent alicyclic group, a monovalent substituted alicyclic group, a monovalent aromatic group, a monovalent substituted aromatic group, —C(O)R, —RS(O)R, and RNH2R, wherein R is an alkyl group with 1 to 6 carbon atoms.",
"7.The cathode electrode material of claim 5, wherein R2 is selected from the group consisting of 8.The cathode electrode material of claim 5, wherein the dianhydride monomer comprises a third monomer represented by formulas III, IV, or V, wherein R3 is a third bivalent organic substituent containing no silicon atom.",
"9.The cathode electrode material of claim 2, wherein the diamine monomer comprises a fourth monomer represented by a formula VI, wherein R4 is a fourth bivalent organic substituent containing no silicon atom.",
"10.The cathode electrode material of claim 1, wherein a molar ratio of a total amount of the silicon-containing monomer to a total amount of the silicon-free monomer is in a range from 1:100 to 10:1.11.The cathode electrode material of claim 1, wherein at least one of the dianhydride monomer and the diamine monomer comprises a silicon-free monomer, a molar ratio of all of the silicon-containing monomer to all of the silicon-free monomer is in a range from 1:20 to 1:1.12.The cathode electrode material of claim 1, wherein a molar ratio of all of the dianhydride monomer to all of the diamine monomer is in a range from 1:2 to 4:1.13.The cathode electrode material of claim 1, wherein a molecular weight of the polymer obtained by polymerizing the dianhydride monomer with the diamine monomer is in a range from about 10000 to about 600000.14.The cathode electrode material of claim 1, wherein the sulfur containing cathode active material is at least one of elemental sulfur and sulfur based polymer, and the sulfur based polymer is selected from the group consisting of sulfurized poly(pyridinopyridine), sulfurized polystyrene, sulfurized polyoxyethylene, sulfurized polyvinyl alcohol, sulfurized poly(vinylidene chloride), sulfurized poly(vinylidene difluoride), sulfurized polyvinylchloride, sulfurized polyvinyl fluoride, sulfurized poly(1,2-dichloroethylene), sulfurized poly(1,2-difluoroethylene), sulfurized polymethyl methacrylate, sulfurized phenolic resin, and combinations thereof.",
"15.The cathode electrode material of claim 1, wherein a mass percentage of the cathode binder is in a range from about 5% to about 20%.",
"16.A lithium sulfur battery comprising: a cathode electrode; an electrolyte; and an anode electrode, wherein the cathode electrode comprises a sulfur containing cathode active material, a conducting agent, and a cathode binder, wherein the cathode binder comprises a polymer obtained by polymerizing a dianhydride monomer with a diamine monomer, and at least one of the dianhydride monomer and the diamine monomer comprises a silicon-containing monomer."
],
[
"<SOH> BACKGROUND <EOH>For a long time, people have been committed to the research and development of new energy storage systems.",
"Among them, lithium sulfur secondary batteries are considered the most attractive battery system.",
"Sulfur has the highest theoretical specific energy (2800 Wh/kg) and theoretical specific capacity (1675 Ah/kg) compared to other battery systems.",
"However, lithium sulfur batteries generate polysulfides during charge-discharge cycles.",
"The polysulfides dissolve in organic electrolytes, resulting in irreversible loss of active material and decay of capacity.",
"Moreover, with the insertion and extraction of lithium ions during the charge-discharge cycle, the sulfur cathode electrode has a volumetric expansion and contraction.",
"As the cycling number increases, the cathode electrode structure collapses and the cathode electrode material spalls, causing a rapid decay of the capacity.",
"Experiments have shown that a commonly used oily binder such as polyvinylidene fluoride (PVDF) has a deteriorated cycling performance for lithium sulfur batteries.",
"An aqueous binder such as polyacrylic acid or polyacrylate is used in the lithium-sulfur battery system.",
"However, during the manufacturing of the electrode, the cathode active material, such as sulfur, is mixed with the conducting agent and the binder through in a solvent to form an electrode slurry, which is coated on the surface of the current collector and then dried to remove the solvent.",
"For oily binders, volatile organic solvents can be used to make electrode slurries that are easier to dry.",
"For aqueous binder, a relatively long time is needed to thoroughly dry water in the slurry at a relatively low temperature, during which the cathode active material may be oxidized."
],
[
"<SOH> SUMMARY <EOH>"
],
[
"CROSS-REFERENCE TO RELATED APPLICATIONS This application claims all benefits accruing under 35 U.S.C.",
"§ 119 from China Patent Application No.",
"201510426550.4, filed on Jul.",
"20, 2015 in the State Intellectual Property Office of China, the content of which is hereby incorporated by reference.",
"This application is a continuation under 35 U.S.C.",
"§ 120 of international patent application PCT/CN2016/090256 filed on Jul.",
"18, 2016, the content of which is also hereby incorporated by reference.",
"FIELD The present disclosure relates to cathode electrode materials and sulfur batteries using the same.",
"BACKGROUND For a long time, people have been committed to the research and development of new energy storage systems.",
"Among them, lithium sulfur secondary batteries are considered the most attractive battery system.",
"Sulfur has the highest theoretical specific energy (2800 Wh/kg) and theoretical specific capacity (1675 Ah/kg) compared to other battery systems.",
"However, lithium sulfur batteries generate polysulfides during charge-discharge cycles.",
"The polysulfides dissolve in organic electrolytes, resulting in irreversible loss of active material and decay of capacity.",
"Moreover, with the insertion and extraction of lithium ions during the charge-discharge cycle, the sulfur cathode electrode has a volumetric expansion and contraction.",
"As the cycling number increases, the cathode electrode structure collapses and the cathode electrode material spalls, causing a rapid decay of the capacity.",
"Experiments have shown that a commonly used oily binder such as polyvinylidene fluoride (PVDF) has a deteriorated cycling performance for lithium sulfur batteries.",
"An aqueous binder such as polyacrylic acid or polyacrylate is used in the lithium-sulfur battery system.",
"However, during the manufacturing of the electrode, the cathode active material, such as sulfur, is mixed with the conducting agent and the binder through in a solvent to form an electrode slurry, which is coated on the surface of the current collector and then dried to remove the solvent.",
"For oily binders, volatile organic solvents can be used to make electrode slurries that are easier to dry.",
"For aqueous binder, a relatively long time is needed to thoroughly dry water in the slurry at a relatively low temperature, during which the cathode active material may be oxidized.",
"SUMMARY BRIEF DESCRIPTION OF THE DRAWINGS Implementations are described by way of example only with reference to the attached FIGURE.",
"The FIGURE is a graph showing cycling performances of Example 5 and Comparative Example 1 of lithium sulfur batteries.",
"DETAILED DESCRIPTION A detailed description with the above drawing is made to further illustrate the present disclosure.",
"One embodiment of a cathode binder is provided.",
"The cathode binder is a polymer obtained by polymerizing a dianhydride monomer with a diamine monomer.",
"At least one of the dianhydride monomer and the diamine monomer comprises a monomer containing a silicon atom.",
"In one embodiment, the dianhydride monomer comprises the silicon-containing monomer, and the silicon containing dianhydride monomer can be represented by formula I.",
"In another embodiment, the diamine monomer comprises the silicon-containing monomer, and the silicon-containing diamine monomer can be represented by formula II.",
"R1 in formula I and R2 in formula II are both silicon-containing bivalent organic substituents, which can be independently selected from wherein n=1 to 6; R5, R6, R7, and R8 can be independently selected from an alkyl group with 1 to 6 carbon atoms, an alkoxy group with 1 to 6 carbon atoms, a monovalent alicyclic group, a monovalent substituted alicyclic group, a monovalent aromatic group, a monovalent substituted aromatic group, —C(O)R, —RS(O)R, —RNH2R, wherein R is an alkyl group with 1 to 6 carbon atoms.",
"A hydrogen atom of the monovalent alicyclic group or the monovalent aromatic group can be substituted by a halogen atom or an alkyl group with 1 to 6 carbon atoms to form the monovalent substituted alicyclic group or the monovalent substituted aromatic group.",
"The monovalent substituted aromatic group or the monovalent aromatic group can have 1 or 2 benzene rings, and in some embodiments can be a phenyl group, methyl phenyl group, or dimethyl phenyl group.",
"R5, R6, R7, and R8 can be the same or different.",
"In some embodiments, R1 in formula I and R2 in formula II can be independently selected from When the diamine monomer comprises the silicon-containing monomer, the dianhydride monomer does not need to contain silicon atom, and can be represented by formulas III, IV, or V. In formula V, R3 is a bivalent organic substituent containing no silicon atoms, which can be —(CH2)n—, —O—, —S—, —CH2—O—CH2—, wherein n=1 to 6; R5, R6, R7, and R8 can be independently selected from an H atom, an alkyl group with 1 to 6 carbon atoms, an alkoxy group with 1 to 6 carbon atoms, a monovalent alicyclic group, a monovalent substituted alicyclic group, a monovalent aromatic group, a monovalent substituted aromatic group, —C(O)R, —RS(O)R, —RNH2R, wherein R is an alkyl group with 1 to 6 carbon atoms.",
"A hydrogen atom of the monovalent alicyclic group or the monovalent aromatic group can be substituted by a halogen atom or an alkyl group with 1 to 6 carbon atoms to form the monovalent substituted alicyclic group or the monovalent substituted aromatic group.",
"The monovalent substituted aromatic group or the monovalent aromatic group can have 1 or 2 benzene rings, and in some embodiments can be a phenyl group, methyl phenyl group, or dimethyl phenyl group.",
"When the dianhydride monomer comprises the silicon-containing monomer, the diamine monomer does not need to contain a silicon atom, and comprises a monomer represented by formula VI below.",
"In formula VI, R4 is a bivalent organic substituent containing no silicon atom, which can be —(CH2)n-, —O—, —S—, —CH2—O—CH2—, —CH(NH)—(CH2)n—, wherein n=1 to 6; R5, R6, R7, and R8 can be independently selected from H atom, an alkyl group with 1 to 6 carbon atoms, an alkoxy group with 1 to 6 carbon atoms, a monovalent alicyclic group, a monovalent substituted alicyclic group, a monovalent aromatic group, and a monovalent substituted aromatic group, —C(O)R, —RS(O)R, —RNH2R, wherein R is an alkyl group with 1 to 6 carbon atoms.",
"A hydrogen atom of the monovalent alicyclic group or the monovalent aromatic group can be substituted by a halogen atom or an alkyl group with 1 to 6 carbon atoms to form the monovalent substituted alicyclic group or the monovalent substituted aromatic group.",
"The monovalent substituted aromatic group or the monovalent aromatic group can have 1 or 2 benzene rings, and in some embodiments can be a phenyl group, methyl phenyl group, or dimethyl phenyl group.",
"When the diamine monomer comprises the silicon-containing monomer, the diamine monomer can further comprise a silicon-free monomer, which can be a monomer represented by formula VI.",
"When the dianhydride monomer comprises the silicon-containing monomer, the dianhydride monomer can further comprise a silicon-free monomer, which can be a monomer represented by formula III, IV, or V. When the diamine monomer and the dianhydride monomer both comprise the silicon-containing monomers, the diamine monomer and the dianhydride monomer can further comprise a silicon-free monomer, which can be a monomer represented by formula VI and a monomer represented by formula III, IV, or V. A molar ratio of a total amount of the silicon-containing monomer (the silicon-containing diamine monomer and/or the silicon-containing dianhydride monomer) to a total amount of the silicon-free monomer (the diamine monomer containing no silicon atom and/or the dianhydride monomer containing no silicon atom) can be 1:100 to 10:1, such as 1:20 to 1:1.In one embodiment, the diamine monomer and the dianhydride monomer both only comprise the silicon-containing monomers.",
"A molar ratio of all the dianhydride monomer to all the diamine monomer can be 1:10 to 10:1, and in some embodiments can be 1:2 to 4:1.A molecular weight of the polymer obtained by polymerizing the dianhydride monomer with the diamine monomer can be in a range from about 10000 to about 600000.One embodiment of a method for making the cathode binder comprises a step of polymerizing the dianhydride monomer with the diamine monomer, which specifically can comprise: mixing the dianhydride monomer and the diamine monomer in an organic solvent to form a mixture, and heating and stirring the mixture to fully carry the reaction thereby obtaining the cathode binder.",
"The diamine monomer can be dissolved in an organic solvent to form a diamine solution.",
"A mass ratio of the diamine monomer to the organic solvent in the diamine solution can be 1:100 to 1:1, and can be 1:10 to 1:2 in some embodiments.",
"The dianhydride monomer can be dissolved in an organic solvent to form a dianhydride solution.",
"A mass ratio of the dianhydride monomer to the organic solvent in the dianhydride solution can be 1:100 to 1:1, and can be 1:10 to 1:2 in some embodiments.",
"The organic solvent can dissolve the diamine monomer and the dianhydride monomer, such as m-cresol, N,N-dimethylformamide, N,N-dimethylacetamide, propylene carbonate, and N-methyl-2-pyrrolidone (NMP).",
"A pump can be used to deliver the dianhydride solution into the diamine solution at a certain speed or deliver the diamine solution into the dianhydride solution at a certain speed.",
"After the delivery, the stirring can continue for a period of time to form a complete reaction.",
"The stirring can last for about 2 hours to about 72 hours, and can last for about 12 hours to about 24 hours in some embodiments.",
"The temperature of the polymerizing can be at about 160° C. to about 200° C. During the polymerizing, a catalyst can be added.",
"The catalyst can be at least one of benzoic acid, benzenesulfonic acid, phenylacetic acid, pyridine, quinoline, pyrrole, and imidazole.",
"A mass percentage of the catalyst to a sum of the dianhydride monomer and the diamine monomer can be about 0.5% to about 5%.",
"First, the dianhydride monomer and the diamine monomer can be completely dissolved in the organic solvent, and then heated to a temperature of about 30° C. to about 60° C. at which the mixture is stirred for about 1 hour to about 10 hours, and 2 hours to 4 hours in some embodiments.",
"The catalyst is then added to the mixture followed by heating the mixture to a temperature of about 160° C. to about 200° C. at which the mixture is stirred for about 6 hours to about 48 hours, and 12 hours to 24 hours in some embodiments, to obtain the polymer.",
"After the reaction, the cathode binder can be purified by washing the obtained polymer with a cleaning solvent, and dried.",
"The catalyst and the organic solvent are soluble to the cleaning solvent, and the cathode binder is insoluble to the cleaning solvent to form a precipitate.",
"The cleaning solvent can be water, methanol, ethanol, a mixture of methanol and water, or a mixture of ethanol and water (a concentration of the methanol or the ethanol can be 5 wt % to 99 wt %).",
"One embodiment of a cathode electrode material comprises a sulfur containing cathode active material, a conducting agent, and the above-described cathode binder, which are uniformly mixed with each other.",
"A mass percentage of the cathode binder in the cathode electrode material can be in a range from about 0.01% to about 50%, such as from about 5% to about 20%.",
"The sulfur containing cathode active material can be at least one of elemental sulfur and sulfur based polymer.",
"The sulfur based polymer is a product formed from a pyrolysis reaction, dehydrogenation and carbonation reaction, dehydration reaction, dehydrochlorination reaction, or deamination reaction of a mixture of conducting polymer and elemental sulfur.",
"The sulfur based polymer can be at least one of sulfurized poly(pyridinopyridine), sulfurized polystyrene, sulfurized polyoxyethylene, sulfurized polyvinyl alcohol, sulfurized poly(vinylidene chloride), sulfurized poly(vinylidene difluoride), sulfurized polyvinylchloride, sulfurized polyvinyl fluoride, sulfurized poly(1,2-dichloroethylene), sulfurized poly(1,2-difluoroethylene), sulfurized polymethyl methacrylate, and sulfurized phenolic resin.",
"The conducting agent can be carbonaceous materials, such as at least one of carbon black, conducting polymers, acetylene black, carbon fibers, carbon nanotubes, and graphite.",
"Since the cathode binder is oily and is soluble in an oily solvent, the cathode binder can be used in combination with an oily organic solvent commonly used in the preparation of electrode slurry of the lithium sulfur battery, such as N-methylpyrrolidone.",
"The oily organic solvent can be rapidly and effectively removed during the drying process of the electrode slurry to avoid an adverse effect of the drying process on the electrode and the battery performance.",
"One embodiment of a lithium sulfur battery comprises a cathode electrode, an anode electrode, and an electrolyte located between the cathode electrode and the anode electrode.",
"The cathode electrode can comprise the above-described cathode electrode material.",
"The cathode electrode can further comprise a cathode current collector.",
"The cathode electrode material can be located on a surface of the cathode current collector.",
"The anode can comprise an anode electrode material, and can further comprise an anode current collector.",
"The anode electrode material can be located on a surface of the anode current collector.",
"The anode electrode material can be lithium metal.",
"The electrolyte can be a solid electrolyte or an electrolyte liquid.",
"In one embodiment, the electrolyte is the electrolyte liquid, the lithium sulfur battery can further comprise a separator, and the anode electrode material and the cathode electrode material are opposite to each other and spaced by the separator.",
"In another embodiment, the electrolyte is the solid electrolyte having a film shape, and the anode electrode material and the cathode electrode material are spaced from each other by the film shaped solid electrolyte.",
"The separator can be polyolefin microporous membrane, modified polypropylene fabric, polyethylene fabric, glass fiber fabric, superfine glass fiber paper, vinylon fabric, or composite membrane of nylon fabric, and wettable polyolefin microporous membrane composited by welding or bonding.",
"The electrolyte liquid comprises a lithium salt and a non-aqueous solvent.",
"The non-aqueous solvent can comprise at least one of cyclic carbonates, chain carbonates, cyclic ethers, chain ethers, nitriles, amides and combinations thereof, such as ethylene carbonate (EC), diethyl carbonate (DEC), propylene carbonate (PC), dimethyl carbonate (DMC), ethyl methyl carbonate (EMC), butylene carbonate, gamma-butyrolactone, gamma-valerolactone, dipropyl carbonate, N-methyl pyrrolidone (NMP), N-methylformamide, N-methylacetamide, N,N-dimethylformamide, N,N-diethylformamide, diethyl ether, acetonitrile, propionitrile, anisole, succinonitrile, adiponitrile, glutaronitrile, dimethyl sulfoxide, dimethyl sulfite, vinylene carbonate, ethyl methyl carbonate, dimethyl carbonate, diethyl carbonate, fluoroethylene carbonate, chloropropylene carbonate, acetonitrile, succinonitrile, methoxymethylsulfone, tetrahydrofuran, 2-methyltetrahydrofuran, epoxy propane, methyl acetate, ethyl acetate, propyl acetate, methyl butyrate, ethyl propionate, methyl propionate, 1,3-dioxolane, 1,2-diethoxyethane, 1,2-dimethoxyethane, and 1,2-dibutoxy.",
"The lithium salt can comprise at least one of lithium chloride (LiCl), lithium hexafluorophosphate (LiPF6), lithium tetrafluoroborate (LiBF4), lithium methanesulfonate (LiCH3SO3), lithium trifluoromethanesulfonate (LiCF3SO3), lithium hexafluoroarsenate (LiAsF6), lithium hexafluoroantimonate (LiSbF6), lithium perchlorate (LiClO4), Li[BF2(C2O4)], Li[PF2(C2O4)2], Li[N(CF3SO2)2], Li[C(CF3SO2)3], lithium bisoxalatoborate (LiBOB), and lithium bis(trifluoromethanesulphonyl)imide (LiTFSI).",
"Example 1 In molar ratio, 0.4 parts of bis(4-aminophenoxy)dimethylsilane, 0.6 parts of 4,4′-oxydianiline (ODA), and m-cresol as the organic solvent are added in a triple-neck flask (a solid content of the solution is about 10%), stirred at room temperature to dissolve completely.",
"1 part of 2,3,3′,4′-diphenyl ether tetracarboxylic dianhydride is then added and dissolved completely.",
"The solution is heated to about 50° C. and reacted for about 4 hours followed by adding 1.5 mL of benzoic acid as the catalyst.",
"Then the solution is heated to about 180° C. and reacted for about 24 hours.",
"Finally, the reaction is terminated and the solution is precipitated in methanol to obtain the cathode binder, which is a fiber shaped polymer represented by formula VII.",
"Example 2 In molar ratio, 0.4 parts of bis(4-aminophenoxy)diphenylsilane, 0.6 parts of 4,4′-oxydianiline (ODA), and m-cresol as the organic solvent are added in a triple-neck flask (a solid content of the solution is about 10%), stirred at room temperature to dissolve completely.",
"1 part of 2,3,3′,4′-diphenyl ether tetracarboxylic dianhydride is then added and dissolved completely.",
"The solution is heated to about 50° C. and reacted for about 4 hours followed by adding 1.5 mL of benzoic acid as the catalyst.",
"Then the solution is heated to about 180° C. and reacted for about 24 hours.",
"Finally, the reaction is terminated and the solution is precipitated in methanol to obtain the cathode binder, which is a fiber shaped polymer represented by formula VIII.",
"Example 3 In molar ratio, 0.4 parts of bis(4-aminophenoxy)dimethylsilane, 0.6 parts of 4,4′-oxydianiline (ODA), and m-cresol as the organic solvent are added in a triple-neck flask (a solid content of the solution is about 10%), stirred at room temperature to dissolve completely.",
"1 part of bis(dimethylsilyl)benzotetracarboxylic dianhydride is then added and dissolved completely.",
"The solution is heated to about 50° C. and reacted for about 4 hours followed by adding 1.5 mL of benzoic acid as the catalyst.",
"Then the solution is heated to about 180° C. and reacted for about 24 hours.",
"Finally, the reaction is terminated and the solution is precipitated in methanol to obtain the cathode binder, which is a fiber shaped polymer represented by formula IX.",
"Example 4 In molar ratio, 0.4 parts of 2,2′-bis(4-aminophenoxyphenyl)propane (BAPP), 0.6 parts of 4,4′-oxydianiline (ODA), and m-cresol as the organic solvent are added in a triple-neck flask (a solid content of the solution is about 10%), stirred at room temperature to dissolve completely.",
"1 part of bis(dimethylsilyl)benzotetracarboxylic dianhydride is then added and dissolved completely.",
"The solution is heated to about 50° C. and reacted for about 4 hours followed by adding 1.5 mL of benzoic acid as the catalyst.",
"Then the solution is heated to about 180° C. and reacted for about 24 hours.",
"Finally, the reaction is terminated and the solution is precipitated in methanol to obtain the cathode binder, which is a fiber shaped polymer represented by formula X.",
"Example 5 70% of sulfur-carbon cathode electrode material, 10% of the cathode binder obtained in Example 1, and 20% of the conducting graphite by mass percent are mixed and dispersed by the NMP to form a slurry.",
"The slurry is coated on an aluminum foil and vacuum dried at about 60° C. for about 24 hours to obtain the cathode electrode.",
"The counter electrode is lithium metal.",
"The electrolyte liquid is 1 M of LiTFSI dissolved in a solvent mixture of DOL/DME=1/1 (v/v).",
"The counter electrode, the cathode electrode, and the electrolyte liquid are assembled to form a 2032 coin-type battery.",
"Example 6 70% of sulfur-carbon cathode electrode material, 10% of the cathode binder obtained in Example 2, and 20% of the conducting graphite by mass percent are mixed and dispersed by the NMP to form a slurry.",
"The slurry is coated on an aluminum foil and vacuum dried at about 60° C. for about 24 hours to obtain the cathode electrode.",
"The counter electrode is lithium metal.",
"The electrolyte liquid is 1 M of LiTFSI dissolved in a solvent mixture of DOL/DME=1/1 (v/v).",
"The counter electrode, the cathode electrode, and the electrolyte liquid are assembled to form a 2032 coin-type battery.",
"Comparative Example 1 70% of sulfur-carbon cathode electrode material, 10% of PVDF as the binder, and 20% of the conducting graphite by mass percent are mixed and dispersed by the NMP to form a slurry.",
"The slurry is coated on an aluminum foil and vacuum dried at about 60° C. for about 24 hours to obtain the cathode electrode.",
"The counter electrode is lithium metal.",
"The electrolyte liquid is 1 M of LiTFSI dissolved in a solvent mixture of DOL/DME=1/1 (v/v).",
"The counter electrode, the cathode electrode, and the electrolyte liquid are assembled to form a 2032 coin-type battery.",
"The above-described Examples and Comparative Example adopt the same sulfur-carbon cathode electrode material formed by mixing the elemental sulfur with the conductive carbon.",
"Cycling Performance Test of Batteries The test conditions are as follows: in the voltage range of 1 V to 3 V, the batteries are charged and discharged at a constant current rate (C-rate) of 0.1 C. Referring to the FIGURE and Table 1, the cycling performance of the lithium sulfur batteries in Example 5 and Comparative Example 1 is shown in FIG.",
"1.The discharge specific capacity of the first cycle, the discharge specific capacity at the 30th cycle, and the capacity retention at the 30th cycle of the lithium sulfur batteries in Examples 5, 6, and Comparative Example 1 are shown in Table 1.It can be seen that the cycling performances of the lithium sulfur batteries using the polyimide binder is greatly improved compared with that of the lithium sulfur battery using PVDF as the binder.",
"TABLE 1 Discharge Discharge Capacity specific capacity specific capacity retention (mAh/g) at (mAh/g) at (%) at 1st cycle 30th cycle 30th cycle Example 5 1080.3 606.8 56.2% Example 6 1105.6 635.5 57.5% Comparative 1039.0 417.5 40.2% Example 1 Binding Force Test The binding force tests are carried out for the cathode electrodes of Examples 5, 6 and Comparative Example 1, respectively.",
"Adhesive tape having a width of 20 mm±1 mm is used.",
"First, 3 to 5 outer layers of the adhesive tape are peeled off, and then more than 150 mm long of the adhesive tape is taken.",
"The adhesive tape does not contact a hand or any other object.",
"One end of the adhesive tape is adhered to the cathode electrode, and the other end of the adhesive tape is connected to a holder.",
"A roller under its own weight is rolled on the cathode electrode at a speed of about 300 mm/min back and forth over the entire length of the cathode electrode about three times.",
"The test is carried out after resting the cathode electrode in the test environment for about 20 minutes to about 40 minutes.",
"The adhesive tape is peeled from the cathode electrode by a testing machine at a speed of about 300 mm/min±10 mm/min.",
"The test results are shown in Table 2, revealing that the cathode binders of Examples 5 and 6 have a stronger binding force than Comparative Example 1.TABLE 2 Sample Sample Maximum Sample Thickness/μm Width/mm load/N Example 5 58 ± 2 20 5.2 Example 6 58 ± 2 20 5.8 Comparative 58 ± 2 20 1.8 Example 1 Finally, it is to be understood that the above-described embodiments are intended to illustrate rather than limit the present disclosure.",
"Variations may be made to the embodiments without departing from the spirit of the present disclosure as claimed.",
"Elements associated with any of the above embodiments are envisioned to be associated with any other embodiments.",
"The above-described embodiments illustrate the scope of the present disclosure but do not restrict the scope of the present disclosure."
]
] |
Patent_15871094
|
[
[
"THIN FILM ENCAPSULATION UNIT, ORGANIC LIGHT EMITTING DIODE DISPLAY INCLUDING THE SAME AND MANUFACTURING METHOD THEREOF",
"A thin film encapsulation unit including an inorganic layer, a first organic layer on the inorganic layer and including a light-blocking unit and a light-transmitting unit, and a reflection-preventing layer on the first organic layer."
],
[
"1.A thin film encapsulation unit comprising: an inorganic layer; a first organic layer on the inorganic layer and comprising a light-blocking portion and a light-transmitting portion; and a second organic layer comprising a transparent organic material, wherein the inorganic layer is located between the first organic layer and the second organic layer and does not contact the second organic layer.",
"2.The thin film encapsulation unit of claim 1, wherein the second organic layer comprises a plurality of second organic layers and the inorganic layer comprises a plurality of inorganic layers, wherein the second organic layers and the inorganic layers are iteratively layered.",
"3.The thin film encapsulation unit of claim 1, wherein the first organic layer comprises a plurality of organic layers and the inorganic layer comprises a plurality of inorganic layers, wherein the inorganic layers and the first organic layers are alternately layered.",
"4.The thin film encapsulation unit of claim 1, wherein the light-blocking portion comprises an organic material comprising a black pigment.",
"5.The thin film encapsulation unit of claim 1, further comprising a reflection-preventing layer on the first organic layer, wherein the reflection-preventing layer comprises a metal layer and a dielectric material layer.",
"6.The thin film encapsulation unit of claim 5, wherein transmittance of the reflection-preventing layer is about 30% to about 70%.",
"7.The thin film encapsulation unit of claim 5, wherein the metal layer comprises at least one of chromium, molybdenum, titanium, tungsten, or an alloy thereof.",
"8.The thin film encapsulation unit of claim 5, wherein the dielectric material layer comprises a high-refractive index layer and a low-refractive index layer, wherein the high-refractive index layer comprises a material having a refractive index of about 1.6 or higher, and wherein the low-refractive index layer comprises a material having a refractive index of less than about 1.6.9.The thin film encapsulation unit of claim 5, wherein the reflection-preventing layer comprises a first chromium layer, a first silicon oxide layer, a second chromium layer, a titanium oxide layer, and a second silicon oxide layer.",
"10.The thin film encapsulation unit of claim 1, wherein both of the light-blocking portion and the light-transmitting portion are in contact with the inorganic layer.",
"11.An organic light emitting diode display comprising: a substrate on which an organic light emitting element is disposed; an inorganic layer on the substrate and covering the organic light emitting element; a first organic layer on the inorganic layer and comprising a light-blocking portion and a light-transmitting portion; and a second organic layer comprising a transparent organic material, wherein the inorganic layer is located between the first organic layer and the second organic layer and does not contact the second organic layer.",
"12.The organic light emitting diode display of claim 11, wherein the second organic layer comprises a plurality of second organic layers and the inorganic layer comprises a plurality of inorganic layers, wherein the second organic layers and the inorganic layers are iteratively layered.",
"13.The organic light emitting diode display of claim 11, wherein the first organic layer comprises a plurality of organic layers and the inorganic layer comprises a plurality of inorganic layers, wherein the inorganic layers and the first organic layers are alternately layered.",
"14.The organic light emitting diode display of claim 11, wherein the light-blocking portion comprises an organic material comprising a black pigment.",
"15.The organic light emitting diode display of claim 11, further comprising a reflection-preventing layer on the first organic layer, wherein the reflection-preventing layer comprises a metal layer and a dielectric material layer.",
"16.The organic light emitting diode display of claim 15, wherein transmittance of the reflection-preventing layer is about 30% to about 70%.",
"17.The organic light emitting diode display of claim 15, wherein the metal layer comprises at least one of chromium, molybdenum, titanium, tungsten, or an alloy thereof.",
"18.The organic light emitting diode display of claim 15, wherein the dielectric material layer comprises a high-refractive index layer and a low-refractive index layer, wherein the high-refractive index layer comprises a material having a refractive index of about 1.6 or higher, and wherein the low-refractive index layer comprises a material having a refractive index of less than about 1.6.19.The organic light emitting diode display of claim 15, wherein the reflection-preventing layer comprises a first chromium layer, a first silicon oxide layer, a second chromium layer, a titanium oxide layer, and a second silicon oxide layer.",
"20.The organic light emitting diode display of claim 11, wherein both of the light-blocking portion and the light-transmitting portion are in contact with the inorganic layer."
],
[
"<SOH> BACKGROUND <EOH>"
],
[
"<SOH> SUMMARY <EOH>Embodiments of the present invention provide an OLED display that can improve contrast without using a circular polarizer film, can be formed slim, and can reduce production cost, and a method for manufacturing the OLED display.",
"A thin film encapsulation unit according to an exemplary embodiment includes an inorganic layer, a first organic layer on the inorganic layer and including a light-blocking unit and a light-transmitting unit, and a reflection-preventing layer on the first organic layer.",
"The thin film encapsulation unit may further include a second organic layer including a transparent material on the inorganic layer.",
"The thin film encapsulation unit may further include a plurality of second organic layers and a plurality of inorganic layers, wherein the second organic layers and the inorganic layers are iteratively layered.",
"The thin film encapsulation unit may further include a plurality of first organic layers and a plurality of inorganic layers, wherein the inorganic layers and the first organic layers are alternately layered.",
"The light-blocking unit may include an organic material including a black pigment.",
"The reflection-preventing layer may include a metal layer and a dielectric material layer.",
"Transmittance of the reflection-preventing layer may be about 30% to about 70%.",
"The metal layer may include at least one of chromium (Cr), molybdenum (Mo), titanium (Ti), tungsten (W), or an alloy thereof.",
"The dielectric material layer may include a high-refractive index layer and a low-refractive index layer, wherein the high-refractive index layer includes a material having a refractive index of about 1.6 or higher, and wherein the low-refractive index layer includes a material having a refractive index of less than about 1.6.The reflection-preventing layer may include a first chromium layer, a first silicon oxide layer, a second chromium layer, a titanium oxide layer, and a second silicon oxide layer.",
"An OLED display according to the present invention includes a substrate on which an organic light emitting element is located, an inorganic layer and an organic layer on the substrate and covering the organic light emitting element, and a reflection-preventing layer on the organic layer, wherein the organic layer includes a light-blocking unit and a light-transmitting unit.",
"The substrate may include a light-emission area where the organic light emitting element is located, and a non-light-emission area including an area other than the light-emission area, wherein the light-blocking unit of the organic layer corresponds to the non-light-emission area, and wherein the light-transmitting unit corresponds to the light-emission area.",
"The organic light emitting element may include a first electrode, an organic emission layer, and a second electrode, and the light-emission area may correspond to the organic emission layer.",
"The OLED display may further include a plurality of inorganic layers and a plurality of organic layers, wherein the inorganic layers and the organic layers are alternately layered.",
"The organic layer may further include a transparent organic layer including a transparent organic material.",
"The reflection-preventing layer may include a metal layer and a dielectric material layer.",
"Transmittance of the reflection-preventing layer may be about 30% to about 70%.",
"The metal layer may include at least one of chromium (Cr), molybdenum (Mo), titanium (Ti), tungsten (W), or an alloy thereof.",
"The dielectric material layer may include a high refractive index layer and a low refractive index layer, wherein the high refractive index layer includes a material having a refractive index of about 1.6 or higher, and wherein the low refractive index layer includes a material having a refractive index of less than about 1.6.The reflection-preventing layer may include a first chromium layer, a first silicon oxide layer, a second chromium layer, a titanium oxide layer, and a second silicon oxide layer.",
"The OLED display may further include a transistor on the substrate, an interlayer insulating layer on the transistor, a first electrode of the organic light emitting element on the interlayer insulating layer and coupled with the transistor through a contact hole, a pixel defining layer on the interlayer insulating layer and having an opening that exposes the first electrode, an organic emission layer of the organic light emitting element in the opening, and a second electrode of the organic light emitting element on the organic emission layer and the pixel defining layer, wherein the light-blocking unit has a plane pattern that is the same as that of the pixel defining layer.",
"A method for manufacturing an OLED display according to another exemplary embodiment includes forming a substrate on which an organic light emitting element is formed, forming an inorganic layer on the substrate, forming an organic layer including a light-transmitting unit and a light-blocking unit on the inorganic layer using an inkjet printing method, and forming a reflection-preventing layer on the organic layer.",
"The light-blocking unit may include an organic material that includes a black pigment, and the light-transmitting unit may include a transparent organic material.",
"The method may further include forming a transparent organic layer including a transparent organic material on the inorganic layer after forming the inorganic layer.",
"When the thin film encapsulation unit formed according to an exemplary embodiment of the present invention is used, contrast can be improved without using a thick polarization plate.",
"In addition, since the thick polarization plate is not used, the OLED display can be formed slim by reducing the thickness of the OLED display and a flexible characteristic can be improved."
],
[
"CROSS-REFERENCE TO RELATED APPLICATION This application is a continuation of U.S. Patent Application No.",
"14/954,941, filed Nov. 30, 2015, which is a continuation of U.S. patent application Ser.",
"No.",
"13/915,517, filed Jun.",
"11, 2013, now U.S. Pat.",
"No.",
"9,203,049, which claims priority to and the benefit of Korean Patent Application No.",
"10-2012-0102383, filed Sep. 14, 2012, the entire content of all of which is incorporated herein by reference.",
"BACKGROUND 1.Field The described technology relates generally to an organic light emitting diode (OLED) display.",
"2.Description of the Related Art An organic light emitting diode display includes organic light emitting elements that include a hole injection electrode, an organic emission layer, and an electron injection electrode.",
"Each organic light emitting element emits light by energy generated when excitons that are generated by combining electrons and holes in the organic emission layer fall from an exited state to a bottom state/ground state, and the organic light emitting diode display displays images by using this light emission.",
"Because the organic light emitting diode display has the characteristic of self-luminance, and therefore, unlike a liquid crystal display, a separate light source is not required, and thickness and weight of the organic light emitting diode display may be reduced.",
"Further, because the organic light emitting diode display exhibits high quality characteristics such as low power consumption, high luminance, and rapid response speed, the organic light emitting diode display receives attention as a next generation display device.",
"Such an OLED display extracts generated light by resonance, while reflection in a thin film transistor, a capacitor, a driver, and a signal line in a non-light-emission area causes deterioration of contrast.",
"Thus, a circular polarizer film is used to improve contrast.",
"The circular polarizer film includes a linear polarizer film and a phase difference film according to a method for bonding multiple films.",
"Such a circular polarizer film is attached after deposition of a thin film encapsulation of a display panel.",
"However, because the circular polarizer film may be as thick as 200 μm, the display device cannot be as slim, and production cost is increased.",
"The above information disclosed in this Background section is only for enhancement of understanding of the background of the described technology, and may therefore contain information that does not form the prior art that is already known in this country to a person of ordinary skill in the art.",
"SUMMARY Embodiments of the present invention provide an OLED display that can improve contrast without using a circular polarizer film, can be formed slim, and can reduce production cost, and a method for manufacturing the OLED display.",
"A thin film encapsulation unit according to an exemplary embodiment includes an inorganic layer, a first organic layer on the inorganic layer and including a light-blocking unit and a light-transmitting unit, and a reflection-preventing layer on the first organic layer.",
"The thin film encapsulation unit may further include a second organic layer including a transparent material on the inorganic layer.",
"The thin film encapsulation unit may further include a plurality of second organic layers and a plurality of inorganic layers, wherein the second organic layers and the inorganic layers are iteratively layered.",
"The thin film encapsulation unit may further include a plurality of first organic layers and a plurality of inorganic layers, wherein the inorganic layers and the first organic layers are alternately layered.",
"The light-blocking unit may include an organic material including a black pigment.",
"The reflection-preventing layer may include a metal layer and a dielectric material layer.",
"Transmittance of the reflection-preventing layer may be about 30% to about 70%.",
"The metal layer may include at least one of chromium (Cr), molybdenum (Mo), titanium (Ti), tungsten (W), or an alloy thereof.",
"The dielectric material layer may include a high-refractive index layer and a low-refractive index layer, wherein the high-refractive index layer includes a material having a refractive index of about 1.6 or higher, and wherein the low-refractive index layer includes a material having a refractive index of less than about 1.6.The reflection-preventing layer may include a first chromium layer, a first silicon oxide layer, a second chromium layer, a titanium oxide layer, and a second silicon oxide layer.",
"An OLED display according to the present invention includes a substrate on which an organic light emitting element is located, an inorganic layer and an organic layer on the substrate and covering the organic light emitting element, and a reflection-preventing layer on the organic layer, wherein the organic layer includes a light-blocking unit and a light-transmitting unit.",
"The substrate may include a light-emission area where the organic light emitting element is located, and a non-light-emission area including an area other than the light-emission area, wherein the light-blocking unit of the organic layer corresponds to the non-light-emission area, and wherein the light-transmitting unit corresponds to the light-emission area.",
"The organic light emitting element may include a first electrode, an organic emission layer, and a second electrode, and the light-emission area may correspond to the organic emission layer.",
"The OLED display may further include a plurality of inorganic layers and a plurality of organic layers, wherein the inorganic layers and the organic layers are alternately layered.",
"The organic layer may further include a transparent organic layer including a transparent organic material.",
"The reflection-preventing layer may include a metal layer and a dielectric material layer.",
"Transmittance of the reflection-preventing layer may be about 30% to about 70%.",
"The metal layer may include at least one of chromium (Cr), molybdenum (Mo), titanium (Ti), tungsten (W), or an alloy thereof.",
"The dielectric material layer may include a high refractive index layer and a low refractive index layer, wherein the high refractive index layer includes a material having a refractive index of about 1.6 or higher, and wherein the low refractive index layer includes a material having a refractive index of less than about 1.6.The reflection-preventing layer may include a first chromium layer, a first silicon oxide layer, a second chromium layer, a titanium oxide layer, and a second silicon oxide layer.",
"The OLED display may further include a transistor on the substrate, an interlayer insulating layer on the transistor, a first electrode of the organic light emitting element on the interlayer insulating layer and coupled with the transistor through a contact hole, a pixel defining layer on the interlayer insulating layer and having an opening that exposes the first electrode, an organic emission layer of the organic light emitting element in the opening, and a second electrode of the organic light emitting element on the organic emission layer and the pixel defining layer, wherein the light-blocking unit has a plane pattern that is the same as that of the pixel defining layer.",
"A method for manufacturing an OLED display according to another exemplary embodiment includes forming a substrate on which an organic light emitting element is formed, forming an inorganic layer on the substrate, forming an organic layer including a light-transmitting unit and a light-blocking unit on the inorganic layer using an inkjet printing method, and forming a reflection-preventing layer on the organic layer.",
"The light-blocking unit may include an organic material that includes a black pigment, and the light-transmitting unit may include a transparent organic material.",
"The method may further include forming a transparent organic layer including a transparent organic material on the inorganic layer after forming the inorganic layer.",
"When the thin film encapsulation unit formed according to an exemplary embodiment of the present invention is used, contrast can be improved without using a thick polarization plate.",
"In addition, since the thick polarization plate is not used, the OLED display can be formed slim by reducing the thickness of the OLED display and a flexible characteristic can be improved.",
"BRIEF DESCRIPTION OF THE DRAWINGS FIG.",
"1 is a cross-sectional view of a thin film encapsulation unit according to an exemplary embodiment of the present invention.",
"FIG.",
"2 to FIG.",
"4 are cross-sectional views of a thin film encapsulation unit according to other exemplary embodiments of the present invention.",
"FIG.",
"5 is an equivalent circuit of a pixel of an organic light emitting diode (OLED) display according to an exemplary embodiment of the present invention.",
"FIG.",
"6 is a cross-sectional view of the pixel of the OLED display of the embodiment shown in FIG.",
"5.FIG.",
"7 is a top plan view of a pixel defining layer according to an exemplary embodiment of the present invention.",
"FIG.",
"8 is a graph measuring light efficiency characteristics of a conventional OLED display and of an OLED display according to an exemplary embodiment of the present invention.",
"FIG.",
"9 to FIG.",
"11 are cross-sectional views depicting a method for manufacturing the OLED display according to an exemplary embodiment of the present invention.",
"DETAILED DESCRIPTION Embodiments of the present invention will be described more fully hereinafter with reference to the accompanying drawings, in which exemplary embodiments of the present invention are shown.",
"As those skilled in the art would realize, the described embodiments may be modified in various different ways, all without departing from the spirit or scope of the present invention.",
"The drawings and description are to be regarded as illustrative in nature and not restrictive.",
"Like reference numerals designate like elements throughout the specification.",
"In the drawings, the size and thickness of each element may be arbitrarily shown, and the present invention is not necessarily limited thereto.",
"Further, the thickness of layers, films, panels, regions, etc., may be exaggerated for clarity, and the thickness of some of layers and regions may be exaggerated for the sake of explanation.",
"It will be understood that when an element such as a layer, film, region, or plate is referred to as being “on” another element, it can be directly on the other element, or one or more intervening elements may also be present.",
"In addition, unless explicitly described to the contrary, the word “comprise” and variations thereof, such as “comprises” or “comprising,” will be understood to imply the inclusion of stated elements, but not necessarily the exclusion of any other elements.",
"Also, throughout the specification, “on” means that an element is positioned on or above another element, or under or below another element, and may not necessarily mean that an element is positioned at an upper side of the other element with respect to a direction of gravity.",
"Hereinafter, an organic light emitting diode (OLED) display according to an exemplary embodiment will be described with reference to the accompanying drawings.",
"FIG.",
"1 is a cross-sectional view of a thin film encapsulation unit according to an exemplary embodiment of the present invention.",
"As shown in FIG.",
"1, a thin film encapsulation unit 1001 according to the exemplary embodiment includes at least one of an inorganic layer 201, a first organic layer 203, and a second organic layer 205.The thin film encapsulation unit 1001 may have a thickness of, for example, less than 10 μm.",
"In multi-layering, the inorganic layer 201, or multiple layers thereof, and the first organic layer 203, or multiple layers thereof, or the inorganic layer 201, or multiple layers thereof, and the second organic layer 205, or multiple layers thereof, may be alternately layered.",
"Also, the inorganic layer 201, the first organic layer 203, and the second organic layer 205 may be alternately layered.",
"The inorganic layer 201 may be located between neighboring organic layers 203 and 205 among a plurality of organic layers 203 and 205, and may be the lowest/bottommost or the highest/topmost layer of the thin film encapsulation unit 1001.The inorganic layer 201 has excellent waterproofing characteristics when compared to the organic layers 203 and 205.The inorganic layer 201 may be a single layer or may be multilayer including at least one of aluminum oxide, such as silicon oxide (SiOx), silicon nitride (SiNx), titanium oxide (TiOx), alumina (Al2O3), and the like, and silicon oxynitride.",
"The first organic layer 203 and the second organic layer 205 have weaker waterproofing properties when compared to the inorganic layer 201, but have flexibility so that the first and second organic layers 203 and 205 can improve deficiencies of the organic layer 201, which is harder than the first and second organic layers 203 and 205.The first organic layer 203 includes a light-blocking unit 25 for blocking light and a light-transmitting unit 27 for transmitting light.",
"The light-transmitting unit 27 may be formed of a transparent light-transmissive material, for example a resin such as polyethylene terephthalate (PET), polyacrylate, polyimide (PI), and polycarbonate (PC), and the like.",
"The light-blocking unit 25 may be formed of a material having low transmittance to absorb light, and may be formed of an organic material including a black pigment.",
"The organic material may include, for example, an acryl resin, a silicon resin, and an epoxy resin.",
"The second organic layer 205 is a light-transmissive material, and may be formed of the same material of the light-transmitting unit 27 of the first organic layer 203.The thin film encapsulation unit according to the exemplary embodiment improves contrast of the display device.",
"The display device including the organic light emitting element includes a display area and a non-display area.",
"The display area is an area where an organic emission layer of the organic light emitting element is located, while the non-display area is the remaining areas of the display area.",
"In the present embodiment, in the display device, the light-blocking unit of the thin film encapsulation unit is located in the non-display area, and the light-transmitting unit is located in the light-emission area.",
"Thus, the light-blocking unit reduces or eliminates light reflected by the non-light-emission area by absorbing the light, thereby improving contrast.",
"The thin film encapsulation unit may have various structures, as shown in FIG.",
"2 to FIG.",
"4.FIG.",
"2 to FIG.",
"4 are cross-sectional views of thin film encapsulation units according to other exemplary embodiments of the present invention.",
"As shown in FIG.",
"2, a thin film encapsulation unit 1002 includes at least one of an inorganic layer 201, a first organic layer 203, and a second organic layer 205.The thin film encapsulation unit 1002 is similar to the thin film encapsulation unit 1001 of FIG.",
"1, and therefore, only differences thereof will be described in further detail.",
"In FIG.",
"2, the thin film encapsulation unit 1002 further includes a reflection-preventing layer 300 formed on the uppermost inorganic layer 201.The reflection-preventing layer 300 includes at least one of a metal layer and a dielectric material layer, and may have a thickness of, for example, less than 1 μm.",
"The metal layer and the dielectric material layer may be alternately layered.",
"The metal layer may be formed of at least one of chromium (Cr), molybdenum (Mo), titanium (Ti), tungsten (W), and an alloy thereof, and may be formed as a single layer or as a multilayer (e.g., multiple layers).",
"The dielectric material layer includes at least one of a high-refractive index layer and a low-refractive index layer, and the high-refractive index layer may have a refractive index of, for example, about 1.6 or higher, and may be chromium (Cr) or titanium oxide (TiO2), and the low-refractive index layer may have a refractive index of, for example, lower than about 1.6, and may be SiO2.The reflection-preventing layer 300 reduces or blocks inflow of undesired external light to the display device, and allows light emitted from the organic light emitting element to be emitted to the outside, rather than being reflected.",
"Therefore, transmittance of the reflection-preventing layer 300 may be, for example, about 30% to about 70%, and preferably about 43%.",
"A thin film encapsulation unit 1003 of FIG.",
"3 includes at least one of an inorganic layer 201, a first organic layer 203, and a second organic layer 205.The thin film encapsulation unit 1003 is similar to the thin film encapsulation unit 1002 of FIG.",
"2, and therefore only differences thereof will be described in further detail.",
"In the thin film encapsulation unit 1003 of FIG.",
"3, a reflection-preventing layer 300 is formed on the second organic layer 205.Thus, deterioration of contrast occurring due to reflection by the inorganic layer 201 between the reflection-preventing layer 300 and the second organic layer 205 can be prevented or reduced.",
"In addition, a thin film encapsulation unit 1004 of FIG.",
"4 includes at least one of an inorganic layer 201 and a first organic layer 203.The thin film encapsulation unit 1004 is almost the same as the thin film encapsulation unit 1001 of FIG.",
"1, and therefore only differences thereof will be described in further detail.",
"A thin film encapsulation unit 1004 of FIG.",
"4 can reduce or prevent deterioration of contrast due to reflection by the second organic layer 205 (see FIGS.",
"2 and 3) by iteratively, or alternatingly, layering the inorganic layer 201 and the first organic layer 203.An OLED display including the thin film encapsulation unit, according to embodiments of the present invention, will be described in further detail with reference to FIG.",
"5 to FIG.",
"7.FIG.",
"5 is an equivalent circuit diagram of a pixel of the OLED display according to an exemplary embodiment of the present invention.",
"As shown in FIG.",
"5, a pixel P of the OLED display has a 2Tr-1Cap structure in which an organic light emitting diode 70, two thin film transistors (TFTs) Q1 and Q2, and one capacitor 80 are arranged.",
"However, the exemplary embodiment is not limited thereto.",
"Thus, in another exemplary embodiment, one pixel of the OLED display 1001 may have a structure in which three or more thin film transistors and/or two or more capacitors are arranged, and various other structures with additional wirings.",
"The additional thin film transistor and capacitor may form a compensation circuit, which suppresses deviation in image quality by improving uniformity of operation of an organic light emitting diode 70 formed in each pixel P. In general, the compensation circuit includes 2 to 8 thin film transistors.",
"The organic light emitting element 70 includes an anode, which is a hole injection electrode, a cathode, which is an electron injection electrode, and an organic emission layer located between the anode and the cathode.",
"Each pixel P according to the present exemplary embodiment includes a first thin film transistor Q1 and a second thin film transistor Q2.The first thin film transistor Q1 and the second thin film transistor Q2 respectively include gate electrodes, semiconductors, source electrodes, and drain electrodes.",
"In addition, a semiconductor of at least one of the first thin film transistor Q1 and the second thin film transistor Q2 includes a polysilicon layer doped with an impurity, an amorphous silicon layer, and microcrystalline silicon.",
"FIG.",
"5 illustrates a gate line 121, a data line 171, a constant voltage line 172, and a capacitor line 131, although the capacitor line 131 may be omitted as necessary or desired.",
"The gate line 121 and the data line 171 of FIG.",
"5 may respectively be a first signal line and a second signal line.",
"The data line 171 is coupled with a source electrode of the first thin film transistor Q1, and a gate electrode of the first thin film transistor Q1 is coupled with the gate line 121.In addition, a drain electrode of the first thin film transistor Q1 is coupled to the capacitor line 131 through the capacitor 80.A node is formed between the drain electrode of the first thin film transistor Q1 and the capacitor 80, and thus a gate electrode of the second thin film transistor Q2 is coupled to the node.",
"In addition, a source electrode of the second thin film transistor Q2 is coupled with the constant voltage line 172, and a drain electrode thereof is coupled with the anode of the organic light emitting element 70.The first thin film transistor Q1 is used as a switch to select a pixel P for light emission.",
"When the first thin film transistor Q1 is turned on, the capacitor 80 is charged, and the amount of charge is proportional to a voltage applied from the data line 171.In addition, when a voltage increasing signal is input for each frame cycle to the capacitor line 131 while the first thin film transistor Q1 is turned off, a gate potential of the second thin film transistor Q2 is increased in accordance with (or pursuant to) the voltage applied through the capacitor line 131.Here, the voltage has a level of a voltage applied with reference to the potential charged in the capacitor 80.The second thin film transistor Q2 is turned on when the gate potential thereof exceeds a threshold voltage of the second thin film transistor Q2.Then, a voltage applied to the constant voltage line 172 is applied to the organic light emitting element 70 through the second thin film transistor Q2 such that the organic light emitting element 70 emits light.",
"FIG.",
"6 is a cross-sectional view of the pixel of the OLED display of the embodiment shown in FIG.",
"5, and FIG.",
"7 is a top plan view of a pixel defining layer according to an exemplary embodiment of the present invention.",
"Referring to FIG.",
"6, a structure of the OLED display, particularly the second thin film transistor Q2 and the organic light emitting element 70 of FIG.",
"5, will be described in detail according to the lamination order.",
"Hereinafter, the second thin film transistor Q2 will be referred to as a thin film transistor.",
"As shown in FIG.",
"6, a buffering layer 120 that prevents or reduces permeation of unnecessary or undesired components, such as impurities or moisture, and that also planarizes the surface, is formed on the substrate 100.A semiconductor 135 formed of polysilicon is formed on the buffering layer 120, and is divided into a channel area 1355, a source area 1356, and a drain area 1357.The source area 1356 and the drain area 1357 are formed at respective sides of the channel area 1355, the channel area 1355 including polysilicon not doped with an impurity, that is, the channel area 1355 is an intrinsic semiconductor.",
"The source area 1356 and the drain area 1357 of the semiconductor 135 are polysilicon doped with a conductive impurity (i.e., impurity semiconductors).",
"The impurity doped to the source area 1356 and the drain area 1357 may be one of a p-type impurity or an n-type impurity.",
"A gate insulating layer 140 is formed on the semiconductor 135, and may be a single layer or multilayer including at least one of tetraethyl orthosilicate (TEOS), silicon nitride, or silicon oxide.",
"A gate electrode 155 is formed on the gate insulating layer 140, and overlaps the channel area 1355.An interlayer insulating layer 60 is formed on the gate electrode 155.Like the gate insulating layer 140, the interlayer insulating layer 160 may be formed of tetraethyl orthosilicate (TEOS), silicon nitride, or silicon oxide.",
"The interlayer insulating layer 160 and the gate insulating layer 140 have a source contact hole 166 and a drain contact hole 167 respectively exposing the source area 1356 and the drain area 1357.A source electrode 177 and a drain electrode 176 are formed on the interlayer insulating layer 160.The source electrode 177 is coupled with the source area 1356 through the source contact hole 166, and the drain electrode 176 is coupled with the drain area 1357 through the drain contact hole 167.A protective layer 180 is formed on the interlayer insulating layer 160.The protective layer 180 has a contact hole 185 that exposes the drain electrode 176.A first electrode 710 coupled with the drain electrode 176 through the contact hole 185 is formed on the protective layer 180.The first electrode 710 becomes the anode of the organic light emitting element of FIG.",
"5.A pixel defining layer 190 is formed on the first electrode 710, and has an opening 195 exposing the first electrode 710.The pixel defining layer 190 may include a resin such as, for example, polyacrylates or polyim ides, and an inorganic material such as silica.",
"An organic emission layer 720 is formed in the opening 195 of the pixel defining layer 190, and is formed as a multilayer including one or more of a light emission layer, a hole injection layer (HIL), a hole transport layer (HTL), an electron transport layer (ETL), and an electron injection layer (EIL).",
"When the organic emission layer 720 includes all of the above, then the electron injection layer is located on the negative electrode 710, on which the electron transport layer, the organic emission layer, the hole transport layer, and the hole injection layer are then sequentially stacked.",
"A second electrode 730 is formed on the pixel defining layer 190 and the organic emission layer 720, and becomes the cathode of the organic light emitting element 70 of FIG.",
"5.Thus, the first electrode 710, the organic emission layer 720, and the second electrode 730 form the organic light emitting element 70.The OLED display may be structured as any one of a front-display type, a rear-display type, and a single-panel dual-display type, depending upon the light-emitting direction of the organic light emitting diode 70.If the OLED display is structured as the front-display type, the first electrode 710 is formed with a reflective film, and the second electrode 730 is formed with a semitransparent film.",
"If the OLED display is structured as the rear-display type, the first electrode 710 is formed with a semitransparent film, and the second electrode 730 is formed with a reflective film.",
"If the OLED display is structured as the single-panel dual-display type, the first electrode 710 and the second electrode 730 are formed with a transparent film or a semitransparent film.",
"The reflective film and the semitransparent film are formed with at least one metallic material selected from magnesium (Mg), silver (Ag), gold (Au), calcium (Ca), lithium (Li), chromium (Cr), aluminum (Al), and alloys thereof.",
"Whether a given film is a reflective film or a semitransparent film is determined depending upon the thickness thereof.",
"With the semitransparent film, the smaller the thickness is, the more light transmittance is increased, and the more resistance is reduced.",
"The transparent film may be formed with, for example, indium tin oxide (ITO), indium zinc oxide (IZO), zinc oxide (ZnO), or indium oxide (In2O3).",
"A thin film encapsulation unit 500 is formed on the second electrode 730.In the exemplary embodiment of the present invention shown in FIG.",
"6, the inorganic layer 201 and the second organic layer 205 are iteratively layered twice, and then the inorganic layer 201, the first organic layer 203, and the reflection-preventing layer 300 are sequentially layered.",
"In present exemplary embodiment, the inorganic layer 201 and the second organic layer 205 are iteratively layered.",
"Thereafter, just the first organic layer 203 may be layered thereon, or alternatively, multiple first and second organic layers 203 and 205 may be alternately layered thereon.",
"Furthermore, the layering may be repeated once, twice, three times, or more than three times.",
"In addition, the thin film encapsulation units 1001-1004 of FIG.",
"1 to FIG.",
"4 may be included.",
"A light-transmitting unit 27 of the thin film encapsulation unit 500 may be located in an area that corresponds to the organic emission layer 720, and a light-blocking unit 25 may be formed in areas that do not include the organic emission layer 720.As shown in FIG.",
"7, the light-blocking unit 27 may have the same plane pattern as the pixel defining layer 190.As in the present exemplary embodiment, reflection of external light incident on the display device can be effectively reduced or eliminated by forming the thin film encapsulation unit 500 such that contrast of the OLED display can be improved.",
"That is, external light incident on the display device is reflected to various thin films included in the display device, but reduced or eliminated by being absorbed by the light-blocking unit 25 of the thin film encapsulation unit, and therefore image quality formed by light emitted from the organic light emitting element of the display can be improved by reducing or preventing deterioration due to reflection of the external light.",
"Accordingly, the contrast of the display device can be improved.",
"In addition, the reflection-preventing layer 300 of the thin film encapsulation unit 500 can reduce or prevent inflow of unwanted or unnecessary external light to the display device, and can allow light emitted from the organic light emitting element to be emitted to the outside, rather than being reflected.",
"Accordingly, reflection of the external light can be reduced, and contrast can be improved.",
"FIG.",
"8 is a graph of measured light efficiency characteristics of a conventional OLED display, and of an OLED display according to an exemplary embodiment of the present invention.",
"In the graph of FIG.",
"8, a conventional display device uses an encapsulation substrate formed of glass, and the display device according to the present exemplary embodiment is the OLED display of the embodiment shown in FIG.",
"6.As shown in the graph of FIG.",
"8, transmittance of the display device according to the exemplary embodiment and transmittance of the conventional display device are similar to each other.",
"Table 1 shows a contrast ratio (CR) of the conventional display device and the OLED display according to the present exemplary embodiment.",
"In Table 1, the conventional display device uses an encapsulation substrate formed of glass, and a circular polarization plate is attached onto the encapsulation substrate, while the display device according to the present exemplary embodiment is the OLED display of the embodiment shown in FIG.",
"6.TABLE 1 Ambient light illumination (Lux) 0 150 500 1,000 5,000 100,000 200,000 CR of Polarizer 33700 199.3 43.3 19.0 4.2 2.5 1.84 CR of 43% AR 32691 182 44 20.4 4.3 2.6 1.84 & BM *CR: contrast ratio As shown in Table 1, a contrast of the display device according to the exemplary embodiment is similar to a contrast of the conventional display device.",
"As described, when the thin film encapsulation unit is used as in the exemplary embodiment, the display device can acquire the same transmittance characteristic and the same contrast ratio without using a polarization plate having a thickness of several hundreds pm and a heavy glass encapsulation substrate.",
"Accordingly, the thickness of the display device can be reduced, and a flexible characteristic can be improved.",
"Hereinafter, a method for manufacturing an OLED display according to an exemplary embodiment of the present embodiment will be described with reference to FIG.",
"9 to FIG.",
"11.FIG.",
"9 to FIG.",
"11 are cross-sectional views that sequentially illustrate a manufacturing method of the OLED display according to an exemplary embodiment of the present invention.",
"As shown in FIG.",
"9, the thin film transistor Q2 and the organic light emitting element 70 are formed on the substrate 100.In addition, the inorganic layer 201 and the second organic layer 205 are formed by alternately layering the inorganic layer 201 and the second organic layer 205 on the organic light emitting element 70.The inorganic layer 201 and the second organic layer 205 may be formed by, for example, sputtering, E-beam, CVD, and the like.",
"Next, as shown in FIG.",
"10, the light-transmitting unit 27 of the first organic layer 203 is formed on the inorganic layer 201.The light-transmitting unit 27 may be formed of a transparent organic material, and is formed using an inkjet printing method in only a light-emission area that corresponds to the organic emission layer 720.Then, as shown in FIG.",
"11, the first organic layer 203 is completed by forming the light-blocking unit 25 on the inorganic layer 201 that corresponds to a non-light-emission area.",
"The light-blocking unit 25 is an organic material including a black pigment, and may be formed using an inkjet printing method, like the light-transmitting unit 27.Next, as shown in FIG.",
"6, the reflection-preventing layer 300 is formed on the first organic layer 203, and may be formed by layering the metal layer and the dielectric material layer, and may be formed using sputtering, E-beam, CVD, or flash evaporation, and the like.",
"While this disclosure has been described in connection with what is presently considered to be practical exemplary embodiments, it is to be understood that the invention is not limited to the disclosed embodiments, but, on the contrary, is intended to cover various modifications and equivalent arrangements included within the spirit and scope of the appended claims and their equivalents."
]
] |
Patent_15871102
|
[
[
"DISPLAY APPARATUS",
"A display device includes a substrate including a display region, and a peripheral region that is outside of the display region, a plurality of dummy pads at the peripheral region, an insulating layer covering the plurality of dummy pads, wherein top surfaces of first portions of the insulating layer above the plurality of dummy pads are higher than top surfaces of second portions of the insulating layer between the plurality of dummy pads, and a plurality of pads over the second portions of the insulating layer at the peripheral region."
],
[
"1.A display device comprising: a substrate comprising a display region, and a peripheral region that is outside of the display region; a first dummy pad and a second dummy pad at the peripheral region; an insulating layer completely covering the first and second dummy pads such that each of the first and second dummy pads does not contact a conductive layer, wherein top surfaces of first portions of the insulating layer above centers of the first and second dummy pads are higher than a top surface of a second portion of the insulating layer between the first and second dummy pads; and a pad over the second portion of the insulating layer at the peripheral region, the pad being electrically connected to an electronic chip or a printed circuit board.",
"2.The display device of claim 1, wherein a first distance from a top surface of the substrate to the top surfaces of the first portions of the insulating layer is greater than a second distance from the top surface of the substrate to the top surface of the pad.",
"3.The display device of claim 1, further comprising conductive balls having a diameter that is greater than a difference between the first distance and the second distance, and being in electrical contact with the top surface of the pad, wherein the electronic chip or the printed circuit board is in electrical contact with the conductive balls to be electrically connected to the pad.",
"4.The display device of claim 1, further comprising a thin-film transistor at the display region, the thin-film transistor comprising: a semiconductor layer; a gate electrode above the semiconductor layer; and a source electrode and a drain electrode above the gate electrode, wherein the insulating layer extends to the display region, and is between the gate electrode and the source and drain electrodes.",
"5.The display device of claim 4, wherein the pad comprises a same material as the source and drain electrodes, and wherein the first and second dummy pads comprise a same material as the gate electrode.",
"6.The display device of claim 4, further comprising a first additional dummy pad below the first dummy pad and a second additional dummy pad below the second dummy pad, the first and second additional dummy pads comprising a same material as the semiconductor layer.",
"7.The display device of claim 1, wherein the pad is electrically connected to the electronic chip.",
"8.The display device of claim 1, wherein the pad is electrically connected to the electronic chip or the printed circuit board via an anisotropic conductive film."
],
[
"<SOH> BACKGROUND <EOH>"
],
[
"<SOH> SUMMARY <EOH>However, in a display device according to the related art, pads of a printed circuit board (PCB), or bumps of an electronic chip, are electrically connected to not only pads corresponding thereto, but are also connected to pads adjacent thereto, and thus, a short circuit may occur.",
"Also, the display device according to the related art has a problem, in that a short circuit may occur because adjacent pads are electrically connected to each other.",
"To address the problems above, one or more embodiments include a display device in which a short-circuit ratio is low in pads.",
"However, the one or more embodiments are merely examples, and thus the inventive concept is not limited thereto.",
"Additional aspects will be set forth in part in the description that follows and, in part, will be apparent from the description, or may be learned by practice of the presented embodiments.",
"According to one or more embodiments, a display device includes a substrate including a display region, and a peripheral region that is outside of the display region, a plurality of dummy pads at the peripheral region, an insulating layer covering the plurality of dummy pads, wherein top surfaces of first portions of the insulating layer above the plurality of dummy pads are higher than top surfaces of second portions of the insulating layer between the plurality of dummy pads, and a plurality of pads over the second portions of the insulating layer at the peripheral region.",
"A first distance from a top surface of the substrate to the top surfaces of the first portions of the insulating layer may be greater than a second distance from the top surface of the substrate to top surfaces of the plurality of pads.",
"The display device may further include conductive balls having a diameter that is greater than a difference between the first distance and the second distance, and being in electrical contact with the top surfaces of the plurality of pads, and an electronic chip or a printed circuit board in electrical contact with the conductive balls to be electrically connected to at least one of the pads.",
"The display device may further include a thin-film transistor at the display region, the thin-film transistor including a semiconductor layer, a gate electrode above the semiconductor layer, and a source electrode and a drain electrode above the gate electrode, wherein the insulating layer extends to the display region, and is between the gate electrode and the source and drain electrodes.",
"The plurality of pads may include a same material as the source and drain electrodes, and the plurality of dummy pads may include a same material as the gate electrode.",
"The display device may further include a plurality of additional dummy pads below the plurality of dummy pads and including a same material as the semiconductor layer.",
"The plurality of dummy pads may include a plurality of first dummy pads, and a plurality of second dummy pads above the plurality of first dummy pads.",
"The display device may further include an additional insulating layer between the plurality of first dummy pads and the plurality of second dummy pads.",
"The display device may further include a first thin-film transistor at the display region, the first thin-film transistor including a first semiconductor layer, a first gate electrode above the first semiconductor layer, and a first source electrode and a first drain electrode above the first gate electrode, and a second thin-film transistor in the display region of the substrate, the second thin-film transistor including a second semiconductor layer, a second gate electrode above the second semiconductor layer and over the additional insulating layer, and a second source electrode and a second drain electrode above the second gate electrode, the additional insulating layer may extend to the display region and covers the first gate electrode, and the insulating layer may extend to the display region, and is between the second gate electrode and the first and second source and drain electrodes.",
"The plurality of pads may include a same material as the first and second source and drain electrodes, the plurality of first dummy pads may include a same material as the first gate electrode, and the plurality of second dummy pads may include a same material as the second gate electrode.",
"The display device may further include a plurality of additional dummy pads below the plurality of dummy pads and including a same material as the first and second semiconductor layers."
],
[
"CROSS-REFERENCE TO RELATED APPLICATION This application is a continuation of U.S. patent application Ser.",
"No.",
"15/272,140, filed Sep. 21, 2016, which claims priority to and the benefit of Korean Patent Application No.",
"10-2015-0150265, filed Oct. 28, 2015, the entire content of both of which is incorporated herein by reference.",
"BACKGROUND 1.Field One or more embodiments relate to a display apparatus in which a short-circuit ratio is low in pads/pad units.",
"2.Description of the Related Art A display device is a device that receives information or data regarding an image, and displays the image.",
"The display device includes pads, which are electrically connected to display elements, at one or more edges thereof to receive information or data regarding an image, etc.",
"The pads are electrically connected to pads of a printed circuit board (PCB), bumps of an electronic chip, or the like.",
"In this case, the pads of the PCB or the bumps of the electronic chip should be electrically connected to preset pads corresponding thereto.",
"SUMMARY However, in a display device according to the related art, pads of a printed circuit board (PCB), or bumps of an electronic chip, are electrically connected to not only pads corresponding thereto, but are also connected to pads adjacent thereto, and thus, a short circuit may occur.",
"Also, the display device according to the related art has a problem, in that a short circuit may occur because adjacent pads are electrically connected to each other.",
"To address the problems above, one or more embodiments include a display device in which a short-circuit ratio is low in pads.",
"However, the one or more embodiments are merely examples, and thus the inventive concept is not limited thereto.",
"Additional aspects will be set forth in part in the description that follows and, in part, will be apparent from the description, or may be learned by practice of the presented embodiments.",
"According to one or more embodiments, a display device includes a substrate including a display region, and a peripheral region that is outside of the display region, a plurality of dummy pads at the peripheral region, an insulating layer covering the plurality of dummy pads, wherein top surfaces of first portions of the insulating layer above the plurality of dummy pads are higher than top surfaces of second portions of the insulating layer between the plurality of dummy pads, and a plurality of pads over the second portions of the insulating layer at the peripheral region.",
"A first distance from a top surface of the substrate to the top surfaces of the first portions of the insulating layer may be greater than a second distance from the top surface of the substrate to top surfaces of the plurality of pads.",
"The display device may further include conductive balls having a diameter that is greater than a difference between the first distance and the second distance, and being in electrical contact with the top surfaces of the plurality of pads, and an electronic chip or a printed circuit board in electrical contact with the conductive balls to be electrically connected to at least one of the pads.",
"The display device may further include a thin-film transistor at the display region, the thin-film transistor including a semiconductor layer, a gate electrode above the semiconductor layer, and a source electrode and a drain electrode above the gate electrode, wherein the insulating layer extends to the display region, and is between the gate electrode and the source and drain electrodes.",
"The plurality of pads may include a same material as the source and drain electrodes, and the plurality of dummy pads may include a same material as the gate electrode.",
"The display device may further include a plurality of additional dummy pads below the plurality of dummy pads and including a same material as the semiconductor layer.",
"The plurality of dummy pads may include a plurality of first dummy pads, and a plurality of second dummy pads above the plurality of first dummy pads.",
"The display device may further include an additional insulating layer between the plurality of first dummy pads and the plurality of second dummy pads.",
"The display device may further include a first thin-film transistor at the display region, the first thin-film transistor including a first semiconductor layer, a first gate electrode above the first semiconductor layer, and a first source electrode and a first drain electrode above the first gate electrode, and a second thin-film transistor in the display region of the substrate, the second thin-film transistor including a second semiconductor layer, a second gate electrode above the second semiconductor layer and over the additional insulating layer, and a second source electrode and a second drain electrode above the second gate electrode, the additional insulating layer may extend to the display region and covers the first gate electrode, and the insulating layer may extend to the display region, and is between the second gate electrode and the first and second source and drain electrodes.",
"The plurality of pads may include a same material as the first and second source and drain electrodes, the plurality of first dummy pads may include a same material as the first gate electrode, and the plurality of second dummy pads may include a same material as the second gate electrode.",
"The display device may further include a plurality of additional dummy pads below the plurality of dummy pads and including a same material as the first and second semiconductor layers.",
"BRIEF DESCRIPTION OF THE DRAWINGS These and/or other aspects will become apparent and more readily appreciated from the following description of the embodiments, taken in conjunction with the accompanying drawings, in which: FIG.",
"1 is a schematic plan view of a display device according to an embodiment; FIG.",
"2 is a schematic cross-sectional view taken along the line II-II of FIG.",
"1; FIG.",
"3 is a schematic cross-sectional view of a part of a display device according to another embodiment; FIG.",
"4 is a schematic cross-sectional view of a part of a display device according to another embodiment; FIG.",
"5 is a schematic cross-sectional view of a part of a display device according to another embodiment; and FIG.",
"6 is a schematic cross-sectional view of a part of a display device according to another embodiment.",
"DETAILED DESCRIPTION Features of the inventive concept and methods of accomplishing the same may be understood more readily by reference to the following detailed description of embodiments and the accompanying drawings.",
"Hereinafter, example embodiments will be described in more detail with reference to the accompanying drawings, in which like reference numbers refer to like elements throughout.",
"The present invention, however, may be embodied in various different forms, and should not be construed as being limited to only the illustrated embodiments herein.",
"Rather, these embodiments are provided as examples so that this disclosure will be thorough and complete, and will fully convey the aspects and features of the present invention to those skilled in the art.",
"Accordingly, processes, elements, and techniques that are not necessary to those having ordinary skill in the art for a complete understanding of the aspects and features of the present invention may not be described.",
"Unless otherwise noted, like reference numerals denote like elements throughout the attached drawings and the written description, and thus, descriptions thereof will not be repeated.",
"In the drawings, the relative sizes of elements, layers, and regions may be exaggerated for clarity.",
"It will be understood that, although the terms “first,” “second,” “third,” etc., may be used herein to describe various elements, components, regions, layers and/or sections, these elements, components, regions, layers and/or sections should not be limited by these terms.",
"These terms are used to distinguish one element, component, region, layer or section from another element, component, region, layer or section.",
"Thus, a first element, component, region, layer or section described below could be termed a second element, component, region, layer or section, without departing from the spirit and scope of the present invention.",
"Spatially relative terms, such as “beneath,” “below,” “lower,” “under,” “above,” “upper,” and the like, may be used herein for ease of explanation to describe one element or feature's relationship to another element(s) or feature(s) as illustrated in the figures.",
"It will be understood that the spatially relative terms are intended to encompass different orientations of the device in use or in operation, in addition to the orientation depicted in the figures.",
"For example, if the device in the figures is turned over, elements described as “below” or “beneath” or “under” other elements or features would then be oriented “above” the other elements or features.",
"Thus, the example terms “below” and “under” can encompass both an orientation of above and below.",
"The device may be otherwise oriented (e.g., rotated 90 degrees or at other orientations) and the spatially relative descriptors used herein should be interpreted accordingly.",
"It will be understood that when an element, layer, region, or component is referred to as being “on,” “connected to,” or “coupled to” another element, layer, region, or component, it can be directly on, connected to, or coupled to the other element, layer, region, or component, or one or more intervening elements, layers, regions, or components may be present.",
"In addition, it will also be understood that when an element or layer is referred to as being “between” two elements or layers, it can be the only element or layer between the two elements or layers, or one or more intervening elements or layers may also be present.",
"In the following examples, the x-axis, the y-axis and the z-axis are not limited to three axes of a rectangular coordinate system, and may be interpreted in a broader sense.",
"For example, the x-axis, the y-axis, and the z-axis may be perpendicular to one another, or may represent different directions that are not perpendicular to one another.",
"The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the present invention.",
"As used herein, the singular forms “a,” “an,” and “the” are intended to include the plural forms as well, unless the context clearly indicates otherwise.",
"It will be further understood that the terms “comprises,” “comprising,” “includes,” and “including,” when used in this specification, specify the presence of the stated features, integers, steps, operations, elements, and/or components, but do not preclude the presence or addition of one or more other features, integers, steps, operations, elements, components, and/or groups thereof.",
"As used herein, the term “and/or” includes any and all combinations of one or more of the associated listed items.",
"Expressions such as “at least one of,” when preceding a list of elements, modify the entire list of elements and do not modify the individual elements of the list.",
"As used herein, the term “substantially,” “about,” and similar terms are used as terms of approximation and not as terms of degree, and are intended to account for the inherent deviations in measured or calculated values that would be recognized by those of ordinary skill in the art.",
"Further, the use of “may” when describing embodiments of the present invention refers to “one or more embodiments of the present invention.” As used herein, the terms “use,” “using,” and “used” may be considered synonymous with the terms “utilize,” “utilizing,” and “utilized,” respectively.",
"Also, the term “exemplary” is intended to refer to an example or illustration.",
"When a certain embodiment may be implemented differently, a specific process order may be performed differently from the described order.",
"For example, two consecutively described processes may be performed substantially at the same time or performed in an order opposite to the described order.",
"The electronic or electric devices and/or any other relevant devices or components according to embodiments of the present invention described herein may be implemented utilizing any suitable hardware, firmware (e.g.",
"an application-specific integrated circuit), software, or a combination of software, firmware, and hardware.",
"For example, the various components of these devices may be formed on one integrated circuit (IC) chip or on separate IC chips.",
"Further, the various components of these devices may be implemented on a flexible printed circuit film, a tape carrier package (TCP), a printed circuit board (PCB), or formed on one substrate.",
"Further, the various components of these devices may be a process or thread, running on one or more processors, in one or more computing devices, executing computer program instructions and interacting with other system components for performing the various functionalities described herein.",
"The computer program instructions are stored in a memory which may be implemented in a computing device using a standard memory device, such as, for example, a random access memory (RAM).",
"The computer program instructions may also be stored in other non-transitory computer readable media such as, for example, a CD-ROM, flash drive, or the like.",
"Also, a person of skill in the art should recognize that the functionality of various computing devices may be combined or integrated into a single computing device, or the functionality of a particular computing device may be distributed across one or more other computing devices without departing from the spirit and scope of the exemplary embodiments of the present invention.",
"Unless otherwise defined, all terms (including technical and scientific terms) used herein have the same meaning as commonly understood by one of ordinary skill in the art to which the present invention belongs.",
"It will be further understood that terms, such as those defined in commonly used dictionaries, should be interpreted as having a meaning that is consistent with their meaning in the context of the relevant art and/or the present specification, and should not be interpreted in an idealized or overly formal sense, unless expressly so defined herein.",
"FIG.",
"1 is a schematic plan view of a display device according to an embodiment.",
"FIG.",
"2 is a schematic cross-sectional view taken along the line II-II of FIG.",
"1, and illustrates the display device as an organic light-emitting display device, which includes an organic light-emitting device/organic light-emitting diode 200.The display device according to the present embodiment includes a substrate 100 including a display region DA in which organic light-emitting devices 300, which are display devices, are located, and includes a peripheral region PA, which is a non-display region that is outside the display region DA.",
"The substrate 100 may include various materials, such as a glass material, a metal material, a plastic material, etc.",
"A first thin-film transistor 210 is in the display region DA of the substrate 100.In addition, the organic light-emitting device 300 electrically connected to the first thin-film transistor 210 may be in the display region DA.",
"The electrical connection of the organic light-emitting device 300 to the first thin-film transistor 210 may be understood as a pixel electrode 310 being electrically connected to the first thin-film transistor 210.Alternatively, a first thin-film transistor may be also located in the peripheral region PA of the substrate 100.The first thin-film transistor located in the peripheral region PA may be, for example, a part of a circuit for controlling an electrical signal to be supplied into the display region DA.",
"The first thin-film transistor 210 includes a first semiconductor layer 211, which includes amorphous silicon, polycrystalline silicon, or an organic semiconductor material, a first gate electrode 213, a first source electrode 215, and a first drain electrode 217.A buffer layer 110 formed of a silicon oxide, a silicon nitride, or the like may be located over the substrate 100 to planarize a surface of the substrate 100, or to prevent impurities, etc.",
"from penetrating the first semiconductor layer 211.The first semiconductor layer 211 may be located over the buffer layer 110.The first gate electrode 213 is over the first semiconductor layer 211.The first source electrode 215 and the first drain electrode 217 are electrically connected to each other according to a signal supplied to the first gate electrode 213.The first gate electrode 213 may be provided in a single layer structure, or in a multi-layer structure formed of, for example, at least one selected from the group consisting of aluminum (Al), platinum (Pt), palladium (Pd), silver (Ag), magnesium (Mg), gold (Au), nickel (Ni), neodymium (Nd), iridium (Ir), chromium (Cr), lithium (Li), calcium (Ca), molybdenum (Mo), titanium (Ti), tungsten (W), and/or copper (Cu), taking into account an adhesive property between the first gate electrode 213 and a layer adjacent thereto, a surface smoothness of a surface of a layer to be stacked thereon, processability, etc.",
"In this case, to secure an insulating property between the first semiconductor layer 211 and the first gate electrode 213, a gate insulating layer 120 formed of silicon oxide and/or a silicon nitride may be between the first semiconductor layer 211 and the first gate electrode 213.An interlayer insulating layer 130 may be located over the first gate electrode 213.The interlayer insulating layer 130 may be provided in a single layer structure, or in a multi-layer structure formed of a silicon oxide, a silicon nitride, or the like.",
"The first source electrode 215 and the first drain electrode 217 are over the interlayer insulating layer 130.The first source electrode 215 and the first drain electrode 217 are respectively electrically connected to the first semiconductor layer 211 via respective contact holes in the interlayer insulating layer 130 and respective contact holes in the gate insulating layer 120.The first source electrode 215 and the first drain electrode 217 may be provided in a single layer structure or in a multi-layer structure formed of, for example, at least one selected from the group consisting of aluminum (Al), platinum (Pt), palladium (Pd), silver (Ag), magnesium (Mg), gold (Au), nickel (Ni), neodymium (Nd), iridium (Ir), chromium (Cr), lithium (Li), calcium (Ca), molybdenum (Mo), titanium (Ti), tungsten (W), and/or copper (Cu), taking account into a conductive property, etc.",
"A protective film may be provided to cover the first thin-film transistor 210 to protect the first thin-film transistor 210 having the above structure.",
"The protective film may include, for example, an inorganic material such as a silicon oxide, a silicon nitride, a silicon oxynitride, etc.",
"The protective film may be a single layer structure or a multi-layer structure.",
"A planarization layer 140 may be located over the protective film.",
"For example, as illustrated in FIG.",
"2, when the organic light-emitting device 300 is above the first thin-film transistor 210, the planarization layer 140 may planarize an upper portion of the protective film covering the first thin-film transistor 210.The planarization layer 140 may include, for example, an acryl-based organic material, benzocyclobutene (BCB), and/or the like.",
"Although FIG.",
"2 illustrates the planarization layer 140 as a single layer, embodiments are not limited thereto, and the planarization layer 140 may be a multi-layer structure.",
"The display device according to the present embodiment may include both of the protective film and the planarization layer 140, or may include only one of them.",
"In the display region DA of the substrate 100, the organic light-emitting device 300 is over the planarization layer 140.The organic light-emitting device 300 includes the pixel electrode 310, an opposite electrode 330, and an intermediate layer 320 interposed between the pixel electrode 310 and the opposite electrode 330 and including an emission layer.",
"An opening is provided in the planarization layer 140 to expose at least one of the first source electrode 215 and the first drain electrode 217 of the first thin-film transistor 210.The pixel electrode 310 is provided over the planarization layer 140.The pixel electrode 310 is in electrical contact with the first source electrode 215 or the first drain electrode 217 via the opening to be electrically connected to the first thin-film transistor 210.The pixel electrode 310 may be a transparent (or semi-transparent) electrode, or may be a reflective electrode.",
"When the pixel electrode 310 is the transparent (or semi-transparent) electrode, the pixel electrode 310 may include, for example, ITO, IZO, ZnO, In2O3, IGO, and/or AZO.",
"When the pixel electrode 310 is the reflective electrode, the pixel electrode 310 may include a reflective film formed of Ag, Mg, Al, Pt, Pd, Au, Ni, Nd, Ir, Cr, or a compound thereof, and may include a layer formed of ITO, IZO, ZnO, In2O3, IGO, or AZO.",
"However, embodiments are not limited thereto, and the pixel electrode 310 may include various materials, and may have any of various structures, e.g., a single layer structure or a multi-layer structure.",
"A pixel defining film 150 may be located over the planarization layer 140.The pixel defining film 150 includes openings corresponding to respective sub-pixels (i.e., at least one opening for exposing a central region of the pixel electrode 310) to define a pixel.",
"Also, as illustrated in FIG.",
"2, the pixel defining film 150 increases a distance between an edge of the pixel electrode 310 and the opposite electrode 330 above the pixel electrode 310 to prevent an arc, or the like, to occur at the edge of the pixel electrode 310.The pixel defining film 150 may include, for example, an organic material, such as polyimide.",
"The intermediate layer 320 of the organic light-emitting device 300 may include a low molecular weight material, or a high molecular weight material.",
"When the intermediate layer 320 includes the low molecular weight material, the intermediate layer 320 may have a stacked structure including at least one among a hole injection layer (HIL), a hole transport layer (HTL), an emission layer (EML), an electron transport layer (ETL), an electron injection layer (EIL), etc., and may include various organic materials, such as CuPc (copper phthalocyanine), N,N′-Di(naphthalene-1-yl)-N,N′-diphenyl-benzidine (NPB), tris-8-hydroxyquinoline aluminum (Alq3), etc.",
"These layers may be formed by vacuum deposition.",
"In general, when the intermediate layer 320 includes the high molecular weight material, the intermediate layer 320 may have a structure including a hole injection layer (HIL) and an emission layer (EML).",
"In this case, the HIL may include PEDOT, and the emission layer may include a polymeric material, such as poly-phenylenevinylene (PPV)-based polymeric material, a polyfluorene-based polymeric material, etc.",
"The intermediate layer 320 may be formed by screen printing, inject printing, laser induced thermal imaging (LITI), etc.",
"However, the intermediate layer 320 is not limited thereto, and may have any of other various structures.",
"The opposite electrode 330 is over the top of the display region DA, and may be arranged to cover the display region DA, as illustrated in FIG.",
"2.That is, the opposite electrode 330 may be integrally formed across a plurality of organic light-emitting devices 200 to correspond to a plurality of pixel electrodes 310 (e.g., may be a common electrode).",
"The opposite electrode 330 may be a transparent (or semi-transparent) electrode, or may be a reflective electrode.",
"When the opposite electrode 330 is the transparent (or semi-transparent) electrode, the opposite electrode 330 may include a layer formed of a metal having a low work function (i.e., Li, Ca, LiF/Ca, LiF/Al, Al, Ag, Mg, or a compound thereof), and formed of a transparent (semi-transparent) conductive layer formed of ITO, IZO, ZnO, In2O3, or the like.",
"When the opposite electrode 330 is the reflective electrode, the opposite electrode 330 may include a layer formed of Li, Ca, LiF/Ca, LiF/Al, Al, Ag, Mg, or a compound thereof.",
"However, the opposite electrode 330 is not limited to the above structures and materials, and may be embodied in many different forms.",
"A plurality of pads 410 are located in the peripheral region PA of the substrate 100.The plurality of pads 410 may be located, for example, on the same layer as the first source electrode 215 and the first drain electrode 217 (i.e., over the interlayer insulating layer 130), as illustrated in FIG.",
"2.In this case, the plurality of pads 410 may include the same material as the first source electrode 215 and the first drain electrode 217.During the manufacture of the display device, the plurality of pads 410 may be formed during a same process as the first source electrode 215 and the first drain electrode 217.A portion of an edge of each of the plurality of pads 410 over the interlayer insulating layer 130 is covered with a pad separation layer 140a.",
"FIG.",
"2 illustrates that each of the plurality of pads 410 extends in an x-axis direction, and edges of each of the plurality of pads 410, which are in a +y-axis direction and a −y-axis direction, are covered with the pad separation layer 140a.",
"Because the edges of the plurality of pads 410 are covered with an end of the pad separation layer 140a, the end of the pad separation layer 140a is over the plurality of pads 410, and the height of a top surface of the end of the pad separation layer 140a is higher than a height(s) of top surfaces of the plurality of pads 410.The pad separation layer 140a has a thickness t2, which is different from a thickness t1 of the planarization layer 140, but may be formed of the same material as the planarization layer 140 during a process when the planarization layer 140 is formed.",
"An electronic chip 600 may be located over the plurality of pads 410.Bumps 610 at a bottom of a body 620 of the electronic chip 600 are adhered to the pads 410 via an anisotropic conductive film (ACF) to be electrically connected to the pads 410.That is, conductive balls 500 included in the ACF are in electrical contact with both of the pads 410 and the bumps 610 to electrically connect the pads 410 and the bumps 610.The conductive balls 500 have a diameter that is greater than the distance between, or height difference between, the top surface of the end of the pad separation layer 140a and the top surfaces of the plurality of pads 410.Thus the conductive balls 500 protrude upward more than the top surface of the end of the pad separation layer 140a to be in electrical contact with the bumps 610, as illustrated in FIG.",
"2.In the display device according to the present embodiment, the bumps 610 of the electronic chip 600 are electrically connected to only pads (e.g., preset pads) 410 corresponding thereto.",
"Because the pad separation layer 140a includes/defines the openings for respectively exposing the pads 410, as described above, the conductive balls 500 are located inside or outside the openings of the pad separation layer 140a when the ACF is placed over and around the pads 410, and when the electronic chip 600 is pressurized/pressed downward (i.e., pressed in a −z-axis direction) to adhere the electronic chip 600 to the pads 410.In this case, the conductive balls 500 inside of the openings of the pad separation layer 140a, and the conductive balls 500 outside of the openings of the pad separation layer 140a, are physically separated due to ends of the pad separation layer 140a, which protrude upward.",
"Thus, the bumps 610 of the electronic chip 600 are electrically connected to only the pads 410 corresponding thereto, and a short circuit does not occur between the pads 410 due to the conductive balls 500.When the pad separation layer 140a is omitted, unlike what is shown in FIG.",
"2, the conductive balls 500 may be arranged in a row (e.g., aligned in a y-axis direction) to be in electrical contact with side surfaces of adjacent conductive balls 500.In this case, the conductive balls 500 electrically connect the pads 410 with each other, thereby causing a short circuit to occur.",
"FIG.",
"3 is a schematic cross-sectional view of a part of a display device according to another embodiment.",
"The display device according to the present embodiment is different from the display device described above with reference to FIG.",
"2, in that a plurality of dummy pads 420 are provided, and in that the pad separation layer 140a shown in FIG.",
"2 is omitted.",
"In detail, the display device according to the present embodiment includes the plurality of dummy pads 420 located in a peripheral region PA of a substrate 100.As illustrated in FIG.",
"3, the plurality of dummy pads 420 may include the same material as a first gate electrode 213 of a first thin-film transistor 210, and may be located over a gate insulating layer 120 in a manner similar to the first gate electrode 213 of the first thin-film transistor 210.That is, the plurality of dummy pads 420 may be formed during a same process as the first gate electrode 213 of the first thin-film transistor 210 by using the same material during the manufacture of the display device.",
"Not only the first gate electrode 213, but also the plurality of dummy pads 420, are covered with an interlayer insulating layer 130.That is, the interlayer insulating layer 130 extends to not only the peripheral region PA, but also extends to a display region DA to be interposed between the first gate electrode 213 and the first source and drain electrodes 215 and 217.A top surface of the interlayer insulating layer 130 has a concavo-convex structure corresponding to a shape of a structure below the interlayer insulating layer 130.Thus, top surfaces of first portions of the interlayer insulating layer 130, which correspond to locations of the plurality of dummy pads 420, are higher than top surfaces of second portions of the interlayer insulating layer 130, which correspond to spaces between the plurality of dummy pads 420.Here, the first portions of the interlayer insulating layer 130 may correspond to the top surfaces of the plurality of dummy pads 420, as opposed to side surfaces of the plurality of dummy pads 420, and may be farthest from a top surface of the substrate 100 among all portions of the interlayer insulating layer 130.A plurality of pads 410 are provided over the interlayer insulating layer 130, and more particularly, are provided over the second portions of the interlayer insulating layer 130 corresponding to the spaces between the plurality of dummy pads 420.An electronic chip 600 may be located over the plurality of pads 410.Bumps/protrusions 610 at a bottom of a body 620 of the electronic chip 600 are adhered to the plurality of pads 410 via an ACF to be electrically connected to the plurality of pads 410.That is, conductive balls 500 included in the ACF are in electrical contact with both of the plurality of pads 410 and the bumps 610 to electrically connect the plurality of pads 410 and the bumps 610 to one another.",
"The conductive balls 500 each have a diameter that is greater than the distance between, or height difference of, the top surfaces of the first portions of the interlayer insulating layer 130, which are above/correspond to the plurality of dummy pads 420, and top surfaces of the plurality of pads 410.Specifically, when the distance from the top surface of the substrate 100 to the top surfaces of the first portions of the interlayer insulating layer 130 is defined as a first distance, and when the distance from the top surface of the substrate 100 to the top surfaces of the plurality of pads 410 is defined as a second distance, the conductive balls 500 have a diameter that is greater than the difference between the first distance and the second distance.",
"Thus the conductive balls 500 protrude upwardly more than, or have a surface that is higher than, the top surfaces of the first portions of the interlayer insulating layer 130 to thereby be in electrical contact with the bumps 610, as illustrated in FIG.",
"3.In the display device according to the present embodiment, the bumps 610 of the electronic chip 600 are electrically connected to only pads 410 corresponding thereto.",
"Because the top surfaces of the first portions of the interlayer insulating layer 130, which correspond to locations of the plurality of dummy pads 420, are higher than the top surfaces of the second portions of the interlayer insulating layer 130, which are between adjacent dummy pads 420, as described above, the interlayer insulating layer 130 having the above structure may function to be substantially the same as the pad separation layer 140a shown in FIG.",
"2.Thus, the conductive balls 500 are located between, or outside of, the first portions of the interlayer insulating layer 130, rather than over/above the first portions of the interlayer insulating layer 130, when the ACF is placed over and around the plurality of pads 410, and when the electronic chip 600 is pressurized/pressed downward (e.g., pressed in a −z-axis direction), the electronic chip 600 is adhered onto the plurality of pads 410.As described above, the locations of the conductive balls 500 are limited by the first portions of the interlayer insulating layer 130.Thus, the bumps 610 of the electronic chip 600 are electrically connected to only pads 410 corresponding thereto, and a short circuit does not occur between the plurality of pads 410 due to the conductive balls 500.In the display device described above with reference to FIG.",
"2, a process of forming the planarization layer 140 and the pad separation layer 140a is relatively complicated.",
"That is, as illustrated in FIG.",
"2, to form the planarization layer 140 having the thickness t1 and the pad separation layer 140a having the thickness t2, while using the same material, a halftone mask process, which is relatively expensive and has strict process conditions, should be performed.",
"If the planarization layer 140 having the thickness t1 and the pad separation layer 140a having the thickness t2 are formed according to separate processes, the processes are more complicated, and thus, manufacturing costs increase In contrast, in the display device according to the present embodiment, the plurality of dummy pads 420 may be formed during a same process as the first gate electrode 213 of the first thin-film transistor 210.The interlayer insulating layer 130 may be formed to have the same thickness at the display region DA and at the peripheral region PA.",
"The plurality of pads 410 may be formed during a same process as the first source electrode 215 and the first drain electrode 217 of the first thin-film transistor 210.The planarization layer 140 need not be formed over the plurality of pads 410, or may be formed over the plurality of pads 410 and then removed from the pads 410 and/or from the vicinity thereof.",
"In the case of the latter, a via hole is provided in the planarization layer 140 to connect the first source electrode 215 or the first drain electrode 217 to a pixel electrode 310.When the via hole is formed, the planarization layer 140 may be removed from the pads 410, and/or from the vicinity thereof, during a same process.",
"As described above, in the case of the display device according to the present embodiment, the plurality of pads 410 and elements near the plurality of pads 410 may be formed during a same process while forming the display region DA, thereby simplifying a process of manufacturing the display device.",
"Also, the bumps 610 of the electronic chip 600 may be electrically connected to only intended pads 410 corresponding thereto, and a short circuit may be prevented from occurring between the plurality of pads 410, as described above, without complicating the process of manufacturing the display device.",
"Although it is described above that the plurality of dummy pads 420 is formed during a same process as the first gate electrode 213 by using the same material, embodiments are not limited thereto and the plurality of dummy pads 420 may be formed of a different material.",
"Also, the plurality of dummy pads 420 need not be located over the gate insulating layer 120, and may instead be located over another layer.",
"Also, a layer over which the plurality of pads 410 are located is not limited to the interlayer insulating layer 130, and may be any layer covering the plurality of dummy pads 420.This also applies to the following embodiments and modified examples thereof.",
"As illustrated in FIG.",
"3, a distance d1 from the top surface of the substrate 100 to the top surfaces of the first portions of the interlayer insulating layer 130 is greater than a distance d2 from the top surface of the substrate 100 to the top surface of the plurality of pads 410.Thus, the bumps 610 of the electronic chip 600 may be electrically connected to only respective pads 410 corresponding thereto, and a short circuit may be effectively prevented from occurring between the plurality of pads 410.To increase the above aspects, a structure as illustrated in FIG.",
"4, which is a cross-sectional view of a portion of a display device according to another embodiment, may be employed.",
"The display device according to the present embodiment shown in FIG.",
"4 is different from the display device described above with reference to FIG.",
"3, in that additional dummy pads 430 are further provided.",
"The additional dummy pads 430 may include the same material as a first semiconductor layer 211 of a first thin-film transistor 210, and may be located below a plurality of dummy pads 420.That is, the additional dummy pads 430 may be formed during a same process as the first semiconductor layer 211 of the first thin-film transistor 210 by using the same material.",
"In the display device according to the present embodiment described above, the difference between the distance d1, which is from the top surface of the substrate 100 to the top surfaces of the first portions of the interlayer insulating layer 130, and the distance d2, which is from the top surface of the substrate 100 to the top surfaces of the plurality of pads 410, is greater than in the previous embodiment described above with reference to FIG.",
"3, due to the additional dummy pads 430.Thus, bumps 610 of an electronic chip 600 may be more securely electrically connected to only pads 410 corresponding thereto and a short circuit may be more effectively prevented from occurring between the plurality of pads 410.FIG.",
"5 is a schematic cross-sectional view of a part of a display device according to another embodiment.",
"In the display device according to the present embodiment, a first thin-film transistor 210 and a second thin-film transistor 220 are provided in a display region DA, and dummy pads 420 include first dummy pads 421 and second dummy pads 422, unlike in the previous embodiment described above with reference to FIG.",
"3.The display device according to the present embodiment is the same as the previous embodiment of FIG.",
"3, in that a first gate electrode 213 of the first thin-film transistor 210 is over a gate insulating layer 120, and in that a first source electrode 215 and a first drain electrode 217 of the first thin-film transistor 210 are over an interlayer insulating layer 130.However, the present embodiment is different from the previous embodiment of FIG.",
"3, in that an additional insulating layer 120a is between the gate insulating layer 120 and the interlayer insulating layer 130.In the second thin-film transistor 220, a second semiconductor layer 221 is on the same layer (i.e., on a buffer layer 110) as a first semiconductor layer 211, and a second source electrode 225 and a second drain electrode 227 are on the same layer (i.e., on the interlayer insulating layer 130) as the first source electrode 215 and the first drain electrode 217.However, a second gate electrode 223 is over the additional insulating layer 120a rather than the gate insulating layer 120.In this case, the additional insulating layer 120a covers the first gate electrode 213 and the first dummy pads 421, and the second dummy pads 422 are over the additional insulating layer 120a, so that the second dummy pads 422 may be above the first dummy pads 421.In the display device according to the present embodiment described above, the first dummy pads 421 include the same material as the first gate electrode 213, and the second dummy pads 422 include the same material as the second gate electrode 223.That is, during the manufacture of the display device, the first dummy pads 421 may be formed during a same process with the first gate electrode 213 by using the same material, and the second dummy pads 422 may be formed during a same process with the second gate electrode 223 by using the same material.",
"In the display device according to the present embodiment described above, because the dummy pads 420 include the first dummy pads 421 and the second dummy pads 422, a distance d1 from a top surface of a substrate 100 to top surfaces of first portions of the interlayer insulating layer 130 corresponding to the dummy pads 420 may be sufficiently greater than a distance d2, which is from the top surface of the substrate 100 to the top surfaces of the plurality of pads 410.In the display device according to the previous embodiment illustrated in FIG.",
"3, the top surfaces of the first portions of the interlayer insulating layer 130 are illustrated as protruding more than the top surfaces of the pads 410 due to sufficient thicknesses of the first gate electrode 213 and the dummy pads 420.However, when the first gate electrode 213 and the dummy pads 420 are not sufficiently thick, the top surfaces of the first portions of the interlayer insulating layer 130 might not protrude far more than the top surfaces of the pads 410.However, in the display device according to the present embodiment, even if the first gate electrode 213, the second gate electrode 223, the first dummy pads 421, and the second dummy pads 422 are not sufficiently thick, when compared to the first gate electrode 213 illustrated in FIG.",
"3, the first dummy pads 421 and the second dummy pads 422 are located to vertically overlap each other, so that the top surfaces of the first portions of the interlayer insulating layer 130 may be protrude sufficiently when compared to the top surfaces of the pad 410.Thus, bumps 610 of an electronic chip 600 may be more securely electrically connected to only intended pads 410 corresponding thereto, and a short circuit may be more effectively prevented from occurring between the plurality of pads 410.To increase this aspect, a structure illustrated in FIG.",
"6, which is a schematic cross-sectional view of a portion of a display device according to another embodiment, may be employed.",
"The display device according to the present embodiment is different from the display device described above with reference to FIG.",
"5, in that additional dummy pads 430 are further provided.",
"The additional dummy pads 430 may include the same material as a first semiconductor layer 211 of a first thin-film transistor 210, and may be located below dummy pads 420.That is, the additional dummy pads 430 may be formed during a same process as the first semiconductor layer 211 of the first thin-film transistor 210 by using the same material.",
"In the display device according to the present embodiment, the difference between a distance d1 from a top surface of a substrate 100 to top surfaces of first portions of an interlayer insulating layer 130, and a distance d2 from the top surface of the substrate 100 to top surfaces of a plurality of pads 410, is greater than in the previous embodiment described above with reference to FIG.",
"5, due to the additional dummy pads 430.Thus, bumps 610 of an electronic chip 600 may be more securely electrically connected to only intended pads 410 corresponding thereto, and a short circuit may be effectively prevented from occurring between the plurality of pads 410.Although cases in which the organic light-emitting device 300 is a display device in the display region DA have been described above, embodiments are not limited thereto.",
"For example, embodiments are also applicable to cases in which a liquid crystal display device, or another device, is employed as a display device.",
"Also, although the cases in which the bumps 610 of the electronic chip 600 are electrically connected to the plurality of pads 410 have been described above, embodiments are not limited thereto, and may be embodied in many different forms, e.g., pads of a printed circuit board (PCB) may be electrically connected to the plurality of pads 410.As described above, according to an embodiment, a display device in which a short-circuit ratio is low in pads may be realized.",
"However, the scope of the inventive concept is not limited to the above effect.",
"It should be understood that embodiments described herein should be considered in a descriptive sense only, and not for purposes of limitation.",
"Descriptions of aspects within each embodiment should typically be considered as available for other similar aspects in other embodiments.",
"While one or more embodiments have been described with reference to the figures, it will be understood by those of ordinary skill in the art that various changes in form and details may be made therein without departing from the spirit and scope as defined by the following claims and their equivalents."
]
] |
Patent_15871103
|
[
[
"ORGANIC LIGHT-EMITTING DISPLAY DEVICE",
"An organic light-emitting display device includes: a substrate; a driving thin film transistor on the substrate; and a DAM at an outermost portion of the substrate, where the DAM includes an inorganic layer and includes a first metallic DAM.",
"The first metallic DAM may include two or more metal layers spaced apart at a set interval."
],
[
"1.An organic light-emitting display device comprising: a substrate; a driving thin film transistor on the substrate; and a DAM at an outermost portion of the substrate, wherein the DAM comprises an inorganic layer and a first metallic DAM.",
"2.The device of claim 1, wherein the first metallic DAM comprises two or more metal layers spaced apart at a set interval.",
"3.The device of claim 2, wherein the first metallic DAM comprises three metal layers spaced apart at a set interval.",
"4.The device of claim 1, wherein the DAM has a step difference at an upper portion of the inorganic layer and a step difference at a lower portion of the inorganic layer of the first metallic DAM.",
"5.The device of claim 1, wherein the first metallic DAM is formed on an upper portion of a gate insulating layer; and wherein the DAM further comprises a first interlayer insulating layer on an upper portion of the first metallic DAM.",
"6.The device of claim 5, further comprising: a storage capacitor comprising a first electrode coupled with a driving gate electrode of the driving thin film transistor, and a second electrode on an upper portion of the first electrode and insulated from the first electrode, wherein the driving gate electrode and the first electrode are integrally formed in a same layer, and the first metallic DAM is in the layer in which the driving gate electrode and the first electrode are formed.",
"7.The device of claim 6, wherein the first interlayer insulating layer is between the first electrode and the second electrode and insulates the second electrode from the first electrode.",
"8.The device of claim 6, further comprising: a second interlayer insulating layer on the first interlayer insulating layer and having an opening that exposes a portion of the first interlayer insulating layer, wherein the second electrode is in the opening.",
"9.The device of claim 5, further comprising: an organic light-emitting diode on an upper portion of the driving thin film transistor; and an encapsulation structure on an upper portion of the organic light-emitting diode and sealing the organic light-emitting diode, wherein the encapsulation structure comprises alternately stacked thin film encapsulation organic layers and thin film encapsulation inorganic layers.",
"10.The device of claim 9, wherein the DAM further comprises a thin film encapsulation inorganic layer that extends to a portion of the first interlayer insulating layer.",
"11.The device of claim 1, wherein the DAM comprises a second metallic DAM on an upper portion of the first metallic DAM.",
"12.The device of claim 11, wherein the second metallic DAM comprises two or more metal layers spaced apart at a set interval.",
"13.The device of claim 11, wherein the DAM further comprises: a first interlayer insulating layer formed between the first metallic DAM and the second metallic DAM; and a second interlayer insulating layer formed on an upper portion of the first interlayer insulating layer and covering the second metallic DAM.",
"14.The device of claim 11, further comprising: a storage capacitor comprising a first electrode coupled with a driving gate electrode of the driving thin film transistor, and a second electrode on an upper portion of the first electrode and insulated from the first electrode, wherein the driving gate electrode and the first electrode are integrally formed in a same layer, the first metallic DAM is in the layer in which the driving gate electrode and the first electrode are formed, and the second metallic DAM is formed in a layer in which the second electrode is formed.",
"15.The device of claim 14, wherein: the inorganic layer comprises a first interlayer insulating layer, the device further comprises a second interlayer insulating layer on the first interlayer insulating layer and having an opening that exposes a portion of the first interlayer insulating layer, and the second electrode is in the opening.",
"16.The device of claim 15, further comprising: an organic light-emitting diode on an upper portion of the driving thin film transistor; and an encapsulation structure on an upper portion of the organic light-emitting diode, and comprising alternatively stacked thin film encapsulation organic layers and thin film encapsulation inorganic layers, and sealing the organic light-emitting diode, wherein the DAM further comprises a thin film encapsulation inorganic layer that extends to a portion of the second interlayer insulating layer.",
"17.The device of claim 11, wherein the DAM further comprises a third metallic DAM on an upper portion of the second metallic DAM.",
"18.The device of claim 17, wherein the third metallic DAM comprises two or more metal layers spaced apart at a set interval.",
"19.The device of claim 17, wherein the DAM further comprises: a first interlayer insulating layer formed between the first metallic DAM and the second metallic DAM; a second interlayer insulating layer formed on an upper portion of the second metallic DAM; and a thin film encapsulation inorganic layer that extends up to an upper portion of the third metallic DAM.",
"20.The device of claim 17, further comprising: a storage capacitor comprising a first electrode coupled to a driving gate electrode of the driving thin film transistor, and a second electrode on an upper portion of the first electrode and insulated from the first electrode; and a data line on an upper portion of the second electrode, wherein the driving gate electrode and the first electrode are integrally formed in a same layer, the first metallic DAM is in the layer in which the driving gate electrode and the first electrode are formed, the second metallic DAM is in a layer in which the second electrode is formed, and the third metallic DAM is in a layer in which the data line is formed.",
"21.An organic light-emitting display device comprising: a substrate; a driving thin film transistor on the substrate; and a DAM at an outermost portion of the substrate, wherein the DAM comprises an inorganic layer, a first metallic DAM and a second metallic DAM on an upper portion of the first metallic DAM, and wherein the inorganic layer comprises a first interlayer insulating layer between the first metallic DAM and the second metallic DAM, a second interlayer insulating layer on the second metallic DAM, and a thin film encapsulation inorganic layer on an upper portion of the second interlayer insulating layer.",
"22.The device of claim 21, further comprising: a storage capacitor comprising a first electrode coupled to a driving gate electrode of the driving thin film transistor, and a second electrode on an upper portion of the first electrode and insulated from the first electrode, wherein the driving gate electrode and the first electrode are integrally formed in a same layer, the first metallic DAM is in the layer in which the driving gate electrode and the first electrode are formed, and the second metallic DAM is in a layer in which the second electrode is formed."
],
[
"<SOH> BACKGROUND <EOH>"
],
[
"<SOH> SUMMARY <EOH>One or more exemplary embodiments include an organic light-emitting display device.",
"Additional aspects of embodiments will be set forth in part in the description which follows and, in part, will be apparent from the description, or may be learned by practice of the presented embodiments.",
"According to one or more exemplary embodiments, an organic light-emitting display device includes: a substrate; a driving thin film transistor provided on the substrate; and a DAM disposed at an outermost portion of the substrate, and the DAM includes an inorganic layer and includes a first metallic DAM therein.",
"The first metallic DAM may include two or more metals spaced apart at a set interval.",
"The first metallic DAM may include three metals spaced apart at a set interval.",
"The DAM may have a step difference between an upper portion of the inorganic layer and a lower portion of the inorganic layer based on the first metallic DAM.",
"The first metallic DAM is formed on an upper portion of a gate insulating layer; and the DAM may further include a first interlayer insulating layer provided on an upper portion of the first metallic DAM.",
"The organic light-emitting display device may further include: a storage capacitor including a first electrode coupled or connected with a driving gate electrode of the driving thin film transistor, and a second electrode provided on an upper portion of the first electrode and insulated from the first electrode, and the driving gate electrode and the first electrode may be integrally formed in a same layer, and the first metallic DAM may be formed in the layer in which the driving gate electrode and the first electrode are formed.",
"The first interlayer insulating layer may be formed between the first electrode and the second electrode and may insulate the second electrode from the first electrode.",
"The organic light-emitting display device may further include: a second interlayer insulating layer disposed on the first interlayer insulating layer and including an opening that exposes a portion of the first interlayer insulating layer, and the second electrode may be disposed in the opening.",
"The organic light-emitting display device may further include: an organic light-emitting diode formed on an upper portion of the driving thin film transistor; and an encapsulation structure formed on an upper portion of the organic light-emitting diode and sealing the organic light-emitting diode, and the encapsulation structure may include alternately stacked thin film encapsulation organic layers and thin film encapsulation inorganic layers.",
"The DAM may further include a thin film encapsulation inorganic layer and extend to a portion of the first interlayer insulating layer.",
"The DAM may include a second metallic DAM formed on an upper portion of the first metallic DAM.",
"The second metallic DAM may include two or more metals spaced apart at a set interval.",
"The DAM may further include: a first interlayer insulating layer formed between the first metallic DAM and the second metallic DAM; and a second interlayer insulating layer formed on an upper portion of the first interlayer insulating layer and covering the second metallic DAM.",
"The organic light-emitting display device may further include: a storage capacitor including a first electrode coupled or connected with a driving gate electrode of the driving thin film transistor, and a second electrode provided on an upper portion of the first electrode and insulated from the first electrode, and the driving gate electrode and the first electrode may be integrally formed in a same layer, the first metallic DAM may be formed in the layer in which the driving gate electrode and the first electrode are formed, and the second metallic DAM may be formed in a layer in which the second electrode is formed.",
"The organic light-emitting display device may further include: a second interlayer insulating layer disposed on the first interlayer insulating layer and including an opening that exposes a portion of the first interlayer insulating layer, and the second electrode may be disposed in the opening.",
"The organic light-emitting display device may further include: an organic light-emitting diode formed on an upper portion of the driving thin film transistor; and an encapsulation structure formed on an upper portion of the organic light-emitting diode, including alternatively stacked thin film encapsulation organic layers and thin film encapsulation inorganic layers, and sealing the organic light-emitting diode, and the DAM may further include a thin film encapsulation inorganic layer and extend to a portion of the second interlayer insulating layer.",
"The DAM may further include a third metallic DAM formed on an upper portion of the second metallic DAM.",
"The third metallic DAM may include two or more metals spaced apart at a set interval.",
"The DAM may further include: a first interlayer insulating layer formed between the first metallic DAM and the second metallic DAM; a second interlayer insulating layer formed on an upper portion of the second metallic DAM; and a thin film encapsulation inorganic layer that extends up to an upper portion of a third metallic DAM.",
"The organic light-emitting display device may further include: a storage capacitor including a first electrode coupled or connected to a driving gate electrode of the driving thin film transistor, and a second electrode provided on an upper portion of the first electrode and insulated from the first electrode; and a data line disposed on an upper portion of the second electrode, and the driving gate electrode and the first electrode may be integrally formed in a same layer, the first metallic DAM may be formed in the layer in which the driving gate electrode and the first electrode are formed, the second metallic DAM may be formed in a layer in which the second electrode is formed, and the third metallic DAM may be formed in a layer in which the data line is formed.",
"According to one or more exemplary embodiments, an organic light-emitting display device includes: a substrate; a driving thin film transistor provided on the substrate; and a DAM disposed at an outermost portion of the substrate, and the DAM includes an inorganic layer and includes a first metallic DAM therein and a second metallic DAM disposed on an upper portion of the first metallic DAM, and the inorganic layer includes a first interlayer insulating layer provided between the first metallic DAM and the second metallic DAM, a second interlayer insulating layer formed on the second metallic DAM, and a thin film encapsulation inorganic layer provided on an upper portion of the second interlayer insulating layer.",
"The organic light-emitting display device may further include: a storage capacitor including a first electrode coupled or connected to a driving gate electrode of the driving thin film transistor, and a second electrode provided on an upper portion of the first electrode and insulated from the first electrode, and the driving gate electrode and the first electrode may be integrally formed in a same layer, and the first metallic DAM may be formed in the layer in which the driving gate electrode and the first electrode are formed, and the second metallic DAM may be formed in a layer in which the second electrode is formed.",
"An exemplary embodiment provides a feature (e.g., an advantageous effect) of controlling a Ti tip defect by forming a DAM including a metallic DAM and an inorganic material (e.g., an interlayer insulating layer).",
"Also, since a DAM includes an inorganic layer, an inorganic layer of a thin film encapsulation structure may extend up to an outer portion, so that a dead space may be suitably or advantageously reduced.",
"The effect of exemplary embodiments may be derived from content to be described below with reference to the drawings in addition to the above-described content."
],
[
"CROSS-REFERENCE TO RELATED APPLICATION This application is a continuation of U.S. patent application Ser.",
"No.",
"15/019,774, filed Feb. 9, 2016, which claims priority to and the benefit of Korean Patent Application No.",
"10-2015-0066242, filed May 12, 2015, the entire content of both of which is incorporated herein by reference.",
"BACKGROUND 1.Field One or more exemplary embodiments relate to an organic light-emitting display device.",
"2.Description of the Related Art An organic light-emitting display device includes an organic light-emitting diode including a hole injection electrode, an electron injection electrode, and an organic emission layer disposed therebetween.",
"The organic light-emitting display device is a self-luminous display device in which an exciton generated when a hole injected from the hole injection electrode and an electron injected from the electron injection electrode recombine in the organic emission layer and the exciton falls down (e.g., transition) from an excited state to a ground state to emit light.",
"Since the organic light-emitting display device, which is a self-luminous display device, does not require a separate light source, it may be driven by a low voltage and configured in a lightweight and slim profile, and provides high quality characteristics such as a wide viewing angle, high contrast, a fast respond speed, etc., so that it is in the limelight as a next-generation display device.",
"SUMMARY One or more exemplary embodiments include an organic light-emitting display device.",
"Additional aspects of embodiments will be set forth in part in the description which follows and, in part, will be apparent from the description, or may be learned by practice of the presented embodiments.",
"According to one or more exemplary embodiments, an organic light-emitting display device includes: a substrate; a driving thin film transistor provided on the substrate; and a DAM disposed at an outermost portion of the substrate, and the DAM includes an inorganic layer and includes a first metallic DAM therein.",
"The first metallic DAM may include two or more metals spaced apart at a set interval.",
"The first metallic DAM may include three metals spaced apart at a set interval.",
"The DAM may have a step difference between an upper portion of the inorganic layer and a lower portion of the inorganic layer based on the first metallic DAM.",
"The first metallic DAM is formed on an upper portion of a gate insulating layer; and the DAM may further include a first interlayer insulating layer provided on an upper portion of the first metallic DAM.",
"The organic light-emitting display device may further include: a storage capacitor including a first electrode coupled or connected with a driving gate electrode of the driving thin film transistor, and a second electrode provided on an upper portion of the first electrode and insulated from the first electrode, and the driving gate electrode and the first electrode may be integrally formed in a same layer, and the first metallic DAM may be formed in the layer in which the driving gate electrode and the first electrode are formed.",
"The first interlayer insulating layer may be formed between the first electrode and the second electrode and may insulate the second electrode from the first electrode.",
"The organic light-emitting display device may further include: a second interlayer insulating layer disposed on the first interlayer insulating layer and including an opening that exposes a portion of the first interlayer insulating layer, and the second electrode may be disposed in the opening.",
"The organic light-emitting display device may further include: an organic light-emitting diode formed on an upper portion of the driving thin film transistor; and an encapsulation structure formed on an upper portion of the organic light-emitting diode and sealing the organic light-emitting diode, and the encapsulation structure may include alternately stacked thin film encapsulation organic layers and thin film encapsulation inorganic layers.",
"The DAM may further include a thin film encapsulation inorganic layer and extend to a portion of the first interlayer insulating layer.",
"The DAM may include a second metallic DAM formed on an upper portion of the first metallic DAM.",
"The second metallic DAM may include two or more metals spaced apart at a set interval.",
"The DAM may further include: a first interlayer insulating layer formed between the first metallic DAM and the second metallic DAM; and a second interlayer insulating layer formed on an upper portion of the first interlayer insulating layer and covering the second metallic DAM.",
"The organic light-emitting display device may further include: a storage capacitor including a first electrode coupled or connected with a driving gate electrode of the driving thin film transistor, and a second electrode provided on an upper portion of the first electrode and insulated from the first electrode, and the driving gate electrode and the first electrode may be integrally formed in a same layer, the first metallic DAM may be formed in the layer in which the driving gate electrode and the first electrode are formed, and the second metallic DAM may be formed in a layer in which the second electrode is formed.",
"The organic light-emitting display device may further include: a second interlayer insulating layer disposed on the first interlayer insulating layer and including an opening that exposes a portion of the first interlayer insulating layer, and the second electrode may be disposed in the opening.",
"The organic light-emitting display device may further include: an organic light-emitting diode formed on an upper portion of the driving thin film transistor; and an encapsulation structure formed on an upper portion of the organic light-emitting diode, including alternatively stacked thin film encapsulation organic layers and thin film encapsulation inorganic layers, and sealing the organic light-emitting diode, and the DAM may further include a thin film encapsulation inorganic layer and extend to a portion of the second interlayer insulating layer.",
"The DAM may further include a third metallic DAM formed on an upper portion of the second metallic DAM.",
"The third metallic DAM may include two or more metals spaced apart at a set interval.",
"The DAM may further include: a first interlayer insulating layer formed between the first metallic DAM and the second metallic DAM; a second interlayer insulating layer formed on an upper portion of the second metallic DAM; and a thin film encapsulation inorganic layer that extends up to an upper portion of a third metallic DAM.",
"The organic light-emitting display device may further include: a storage capacitor including a first electrode coupled or connected to a driving gate electrode of the driving thin film transistor, and a second electrode provided on an upper portion of the first electrode and insulated from the first electrode; and a data line disposed on an upper portion of the second electrode, and the driving gate electrode and the first electrode may be integrally formed in a same layer, the first metallic DAM may be formed in the layer in which the driving gate electrode and the first electrode are formed, the second metallic DAM may be formed in a layer in which the second electrode is formed, and the third metallic DAM may be formed in a layer in which the data line is formed.",
"According to one or more exemplary embodiments, an organic light-emitting display device includes: a substrate; a driving thin film transistor provided on the substrate; and a DAM disposed at an outermost portion of the substrate, and the DAM includes an inorganic layer and includes a first metallic DAM therein and a second metallic DAM disposed on an upper portion of the first metallic DAM, and the inorganic layer includes a first interlayer insulating layer provided between the first metallic DAM and the second metallic DAM, a second interlayer insulating layer formed on the second metallic DAM, and a thin film encapsulation inorganic layer provided on an upper portion of the second interlayer insulating layer.",
"The organic light-emitting display device may further include: a storage capacitor including a first electrode coupled or connected to a driving gate electrode of the driving thin film transistor, and a second electrode provided on an upper portion of the first electrode and insulated from the first electrode, and the driving gate electrode and the first electrode may be integrally formed in a same layer, and the first metallic DAM may be formed in the layer in which the driving gate electrode and the first electrode are formed, and the second metallic DAM may be formed in a layer in which the second electrode is formed.",
"An exemplary embodiment provides a feature (e.g., an advantageous effect) of controlling a Ti tip defect by forming a DAM including a metallic DAM and an inorganic material (e.g., an interlayer insulating layer).",
"Also, since a DAM includes an inorganic layer, an inorganic layer of a thin film encapsulation structure may extend up to an outer portion, so that a dead space may be suitably or advantageously reduced.",
"The effect of exemplary embodiments may be derived from content to be described below with reference to the drawings in addition to the above-described content.",
"BRIEF DESCRIPTION OF THE DRAWINGS These and/or other aspects will become apparent and more readily appreciated from the following description of the exemplary embodiments, taken in conjunction with the accompanying drawings in which: FIG.",
"1 is a schematic cross-sectional view illustrating an organic light-emitting display device according to an exemplary embodiment; FIG.",
"2 is a schematic cross-sectional view illustrating a display portion of an organic light-emitting display device according to an exemplary embodiment; FIG.",
"3 is a schematic cross-sectional view illustrating a portion of an organic light-emitting display device according to an exemplary embodiment; FIG.",
"4 is a schematic cross-sectional view illustrating an organic light-emitting display device according to an exemplary embodiment; FIG.",
"5 is a schematic cross-sectional view illustrating an organic light-emitting display device according to an exemplary embodiment; and FIG.",
"6 is a schematic cross-sectional view illustrating an organic light-emitting display device according to an exemplary embodiment.",
"DETAILED DESCRIPTION As the inventive concept allows for various changes and numerous embodiments, exemplary embodiments will be illustrated in the drawings and described in detail in the written description.",
"An effect and a characteristic of the inventive concept, and a method for accomplishing these will be apparent when exemplary embodiments described below in detail are referred together with the drawings.",
"However, the inventive concept is not limited to the exemplary embodiments described below and may be implemented in various forms.",
"Hereinafter, exemplary embodiments are described in detail with reference to the accompanying drawings.",
"Like reference numerals are used for like or corresponding elements when description is made with reference to the drawings, and repeated description thereof is not provided.",
"As used herein, the term “and/or” includes any and all combinations of one or more of the associated listed items.",
"Expressions such as “at least one of,” when preceding a list of elements, modify the entire list of elements and do not modify the individual elements of the list.",
"It will be understood that although the terms “first”, “second”, etc.",
"may be used herein to describe various components, these components should not be limited by these terms.",
"These components are only used to distinguish one component from another.",
"As used herein, the singular forms “a,” “an” and “the” are intended to include the plural forms as well, unless the context clearly indicates otherwise.",
"It will be further understood that the terms “comprises” and/or “comprising” used herein specify the presence of stated features or components, but do not preclude the presence or addition of one or more other features or components.",
"It will be understood that when a layer, region, or component is referred to as being “on,” “formed on,” “coupled to,” or “connected to” another layer, region, or component, it can be directly or indirectly on, formed on, coupled to, or connected to the other layer, region, or component.",
"That is, for example, intervening layers, regions, or components may be present.",
"In addition, it will also be understood that when an element or layer is referred to as being “between” two elements or layers, it can be the only element or layer between the two elements or layers, or one or more intervening elements or layers may also be present.",
"Sizes of elements in the drawings may be exaggerated for convenience of explanation.",
"In other words, since sizes and thicknesses of components in the drawings may be arbitrarily illustrated for convenience of explanation, the following embodiments are not limited thereto.",
"When a certain embodiment may be implemented differently, a specific process order may be performed differently from the described order.",
"For example, two consecutively described processes may be performed substantially at the same time (e.g., concurrently or simultaneously) or performed in an order opposite to the described order.",
"FIG.",
"1 is a schematic cross-sectional view illustrating an organic light-emitting display device according to an exemplary embodiment, and FIG.",
"2 is a schematic cross-sectional view illustrating a display portion of an organic light-emitting display device according to an exemplary embodiment.",
"As illustrated in FIG.",
"1, a buffer layer 110 may be formed on an upper portion of a substrate 100.The buffer layer 110 may prevent or inhibit impurity ions from diffusing (e.g., from diffusing into the substrate), prevent or inhibit moisture or the air from penetrating (e.g., from penetrating into the display device through the substrate), and serve as a barrier layer and/or a blocking layer for planarizing a surface (e.g., a surface of the substrate).",
"Referring to FIGS.",
"1 and 2, a thin film transistor (TFT) may be formed on an upper portion of the buffer layer 110.A semiconductor layer A of the TFT may include polysilicon, and may include a channel region undoped with impurities, and a source region and a drain region respectively doped with impurities, disposed at two (e.g., both) sides of the channel region.",
"Here, the impurities change depending on a kind of the TFT, and may be N-type impurities or P-type impurities (e.g., the source and drain regions may be doped independently with N-type or P-type impurities).",
"After the semiconductor layer A is formed, a gate insulating layer 210 may be formed on an upper portion of the semiconductor layer A over the entire surface (or substantially the entire surface) of the substrate 100.The gate insulating layer 210 may include a single layer or layers (e.g., a plurality of layers) including an inorganic material such as a silicon oxide or a silicon nitride, etc.",
"The gate insulating layer 210 insulates the semiconductor layer A from a gate electrode G disposed thereon.",
"After the gate insulating layer 120 is formed, the gate electrode G may be formed on an upper portion of the gate insulating layer 120.The gate electrode G may be formed via a photolithography process and/or an etching process.",
"The gate electrode G may include one or more metals selected from Mo, Al, Pt, Pd, Ag, Mg, Au, Ni, Nd, Ir, Cr, Li, Ca, Ti, W, and Cu.",
"After the gate electrode G is formed, a first interlayer insulating layer 230 may be formed on the entire surface (or substantially the entire surface) of the substrate 100.The first interlayer insulating layer 230 may include an inorganic material.",
"For example, the first interlayer insulating layer 230 may include a metallic oxide or a metallic nitride.",
"In some embodiments, the inorganic material may include SiO2, SiNx (1/2≤x≤2, e.g., x=1.33), SiON, Al2O3, TiO2, Ta2O5, HfO2, or ZnO2, etc.",
"The first interlayer insulating layer 230 may include layers (e.g., a plurality of layers) or a single layer including an inorganic material such as SiOy (1≤y≤2, e.g., y=2) and/or SiNx (1/2≤x≤2, e.g., x=1.33), etc.",
"In some exemplary embodiments, the first interlayer insulating layer 230 may include a double structure of SiOy/SiNx or SiNx/SiOy.",
"As illustrated in FIG.",
"1, a DAM including the first interlayer insulating layer 230 and including a first metallic dam 410 therein may be at a side of the substrate 100 (e.g., formed on the outermost portion of the substrate 100).",
"An effect that by the DAM, a lateral side of the organic light-emitting display device becomes strong against damage may be obtained (e.g., in some embodiments, the DAM protects the lateral side of the organic light-emitting display from damage).",
"The structure and role of the DAM are described in more detail below.",
"As illustrated in FIG.",
"2, a source electrode S, a drain electrode D of the TFT, a data line, and a driving voltage line may be disposed on an upper portion of the first interlayer insulating layer 230.The source electrode S, the drain electrode D, the data line, and the driving voltage line may include one or more metals selected from Al, Pt, Pd, Ag, Mg, Au, Ni, Nd, Ir, Cr, Li, Ca, Mo, Ti, W, and Cu.",
"As illustrated in FIG.",
"2, a via layer 250 is formed on the entire surface (or substantially the entire surface) of the substrate 100 to cover wirings such as, for example, the source electrode S, the drain electrode D, the data line, and/or the driving voltage line.",
"A pixel electrode 281 may be formed on an upper portion of the via layer 250.According to an exemplary embodiment illustrated in FIG.",
"2, the pixel electrode 281 is coupled or connected with the drain electrode D through a via hole.",
"The via layer 250 may include an insulating material.",
"For example, the via layer 250 may include a single layer or layers (e.g., a plurality of layers) including an inorganic material, an organic material, or an organic/inorganic compound, and may be formed by using various suitable deposition methods.",
"As illustrated in FIG.",
"2, an organic light-emitting diode (OLED) is provided to the upper portion of the via layer 250.The OLED includes the pixel electrode 281, an interlayer 283 including an organic emission layer, and an opposite electrode 285.Also, the organic light-emitting display device of FIG.",
"2 may further include a pixel defining layer 270.As shown in FIG.",
"2, the buffer layer 110, the gate insulating layer 210, the first interlayer insulating layer 230, the via layer 250, and the pixel defining layer 270 may be included in a stack 200.In the embodiment shown in FIG.",
"1, the stack 200 includes the gate insulating layer 210, the first interlayer insulating layer 230, and the via layer 250.The pixel electrode 281 and/or the opposite electrode 285 may be provided as a transparent electrode or a reflective electrode.",
"In the case where the pixel electrode 281 and/or the opposite electrode 285 are provided as a transparent electrode, they may include ITO, IZO, ZnO, or In2O3.In the case where the pixel electrode 281 and/or the opposite electrode 285 are provided as a reflective electrode, they may include a reflective layer including Ag, Mg, Al, Pt, Pd, Au, Ni, Nd, Ir, Cr, or a compound thereof, etc., and a transparent layer including ITO, IZO, ZnO, or In2O3.In some exemplary embodiments, the pixel electrode 281 or the opposite electrode 285 may have an ITO/Ag/ITO structure.",
"As illustrated in FIG.",
"2, the pixel defining layer 270 may define a pixel region and a non-pixel region.",
"The pixel defining layer 270 may include an opening 270a that exposes the pixel electrode 281 and may be formed to entirely cover (or substantially entirely cover) the substrate 100 (e.g., the pixel defining layer 270 may be formed to cover the entire or substantially the entire surface of the substrate 100 and the opening 270a may then be formed in the pixel defining layer 270).",
"An interlayer 283 which will be described in more detail below may be formed in the opening 270a, so that the opening 270a may become a substantial pixel region (e.g., the opening 270a may substantially define the pixel region).",
"The pixel electrode 281, the interlayer 283, and the opposite electrode 285 may form the organic light-emitting diode (OLED).",
"A hole and an electron respectively injected from the pixel electrode 281 and the opposite electrode 285 of the OLED may recombine in the organic emission layer of the interlayer 283 to emit light.",
"The interlayer 283 may have the organic emission layer.",
"In some embodiments, the interlayer 283 may have the organic emission layer, and besides, may further have at least one selected from a hole injection layer (HIL), a hole transport layer (HTL), an electron transport layer (ETL), and an electron injection layer (EIL).",
"The present exemplary embodiment is not limited thereto, and the interlayer 283 may have the organic emission layer and further have other various suitable functional layers.",
"The opposite electrode 285 is disposed on the interlayer 283.The opposite electrode 285 forms an electric field with the pixel electrode 281 to allow light to be emitted from the interlayer 283.The pixel electrode 281 may be patterned every pixel (e.g., may be patterned to correspond to the pixels), and the opposite electrode 285 may be formed such that a common voltage is applied over all pixels.",
"The pixel electrode 281 may serve as an anode electrode, and the opposite electrode 285 may serve as a cathode electrode, but they are not limited thereto.",
"For example, the pixel electrode 281 may serve as a cathode electrode, and the opposite electrode 285 may serve as an anode electrode.",
"As illustrated in FIG.",
"1, an encapsulation structure 300 for sealing the OLED from the air and moisture may be formed on the upper portion of the OLED.",
"The encapsulation structure 300 may be formed in various suitable shapes, and formed by stacking thin films as illustrated in FIG.",
"1.The encapsulation structure 300 may be formed on the upper portion of the substrate 100 to cover the OLED as illustrated in FIG.",
"1.The encapsulation structure 300 is a structure where layers are stacked, and may be formed in a structure where an inorganic layer 310 and an organic layer 330 are stacked in turns (e.g., alternately).",
"Though FIG.",
"1 illustrates an exemplary embodiment where a first inorganic layer 311, a first organic layer 330, and a second inorganic layer 313 are sequentially stacked, the number of thin film layers is not limited thereto, of course.",
"The inorganic layer 310 may solidly block or reduce penetration of oxygen or moisture, and the organic layer 330 may absorb stress of the inorganic layer 310 to give flexibility.",
"The inorganic layer 310 may be a single layer or a stacked layer including a metallic oxide or a metallic nitride.",
"For example, the inorganic layers may include at least one selected from SiNx (1/2≤x≤2, e.g., x=1.33), Al2O3, SiO2, and TiO2.The organic layer 330 may include a polymer, and for example, may be a single layer or a stacked layer including at least one selected from polyethylene terephthalate, polyimide, polycarbonate, epoxy, polyethylene, and polyacrylate.",
"For example, the organic layers may include polyacrylate.",
"In some embodiments, the organic layers may include a polymerized monomer composition including a diacrylate-based monomer and a triacrylate-based monomer.",
"The monomer composition may further include a monoacrylate-based monomer.",
"Also, the monomer composition may further include a photoinitiator such as monoacrylphosphine oxide (TPO) but is not limited thereto.",
"The organic light-emitting display device according to an exemplary embodiment may prevent or inhibit penetration of oxygen and moisture and concurrently or simultaneously secure flexibility by forming the encapsulation structure 300 in a structure in which the inorganic layer 310 and the organic layer 330 are stacked alternately.",
"FIG.",
"3 is a schematic cross-sectional view illustrating a portion of an organic light-emitting display device according to an exemplary embodiment.",
"As illustrated in FIGS.",
"1 and 3, a DAM including the first interlayer insulating layer 230 and including the first metallic dam 410 therein may be at a side of the substrate 100 (e.g., formed on the outermost portion of the substrate 100).",
"The DAM may include the first interlayer insulating layer 230 including an inorganic layer, and include the first metallic dam 410 inside the inorganic layer.",
"The first metallic dam (DAM) 410 may include two or more metals (e.g., two or more metal layers) spaced apart by a set or predetermined interval.",
"FIGS.",
"1 and 3 illustrate an exemplary embodiment and the first metallic DAM 410 may include three metals (e.g., three metal layers).",
"Of course, the number of metals forming the first metallic DAM 410 is not limited thereto and the first metallic DAM 410 may include a plurality of metals.",
"The first metallic DAM 410 may include one or more metals selected from Al, Pt, Pd, Ag, Mg, Au, Ni, Nd, Ir, Cr, Li, Ca, Mo, Ti, W, and Cu.",
"The organic light-emitting display device according to the present exemplary embodiment may include the first metallic DAM 410 where a DAM is formed on the upper portion of the gate insulating layer 210, and the first interlayer insulating layer 230 formed on the upper portion of the first metallic DAM 410 and including an inorganic material as illustrated in FIG.",
"3.Also, as illustrated in FIG.",
"1, the DAM may also include the thin film encapsulation inorganic layer 310 of the encapsulation structure 300 formed on the upper portion of the first interlayer insulating layer 230, that extends up to the outer portion of the substrate 100.Since the DAM includes the first metallic DAM 410 and the first interlayer insulating layer 230 which is an inorganic layer, a step difference may be formed between the first interlayer insulating layer 230 and the thin film encapsulation inorganic layer 310 of the encapsulation structure 300.For example, the DAM may have a step difference at an upper portion of the inorganic layer (e.g., the first interlayer insulating layer 230) and may have a step difference at a lower portion of the inorganic layer (e.g., the first interlayer insulating layer 230).",
"Since the DAM at the side of the substrate 100 (e.g., formed on the outermost portion of the substrate 100) is formed to have a step difference by including the first metallic DAM 410, the organic light-emitting display device according to an exemplary embodiment has a feature (e.g., an advantageous effect) of strengthening the lateral structure which would otherwise be more vulnerable to damage.",
"For example, since the DAM of the organic light-emitting display device according to an exemplary embodiment includes the first metallic DAM 410 having stiffness therein as compared to a DAM that includes an inorganic layer but does not include the first metallic DAM, the organic light-emitting display device is strengthened and thus has a feature of protecting against damage.",
"Also, the first interlayer insulating layer 230 and the thin film encapsulation inorganic layer 310 are formed to have a step difference at the DAM by the first metallic DAM 410, and thus the organic light-emitting display device has a feature (e.g., an advantageous effect) of controlling Ti tip.",
"Ti tip is a problem caused by a crack DAM (e.g., a cracked DAM) including an inorganic layer.",
"Since a profile of the crack DAM that includes an inorganic layer but does not include the first metallic DAM is formed to have an angle of 80-90 degrees (e.g., an angle of 80 to 90 degrees relative to the upper surface of the substrate), when etching is performed after a layer is formed during a process of forming S/D (e.g., source/drain), a residual layer of S/D remains.",
"At this point, there is a probability that a Ti component of an S/D residual layer is separated and moves into a display region during a subsequent process, and a defective display device may be caused by this Ti component of the S/D residual layer.",
"For example, Ti tip caused by a DAM that includes an inorganic layer but does not include the first metallic DAM may result in a defective display device as a result of Ti contaminating the display region of the display device.",
"To solve this problem, an organic light-emitting display device according to the present exemplary embodiment allows a DAM at the side of the substrate (e.g., formed on the outermost portion) to be formed to have a step difference by including the first metallic DAM 410, so that a profile lowers (e.g., a profile of the DAM is reduced), and consequently, the S/D residual layer does not remain and thus a defect generation by Ti tip may be suitably or advantageously prevented or reduced.",
"Furthermore, since the DAM includes the first interlayer insulating layer 230 including an inorganic layer, extension of the thin film encapsulation inorganic layer 310 is possible, and consequently, a dead space may be suitably or advantageously reduced.",
"For example, a DAM structure such as a metallic DAM is generally formed by using an inorganic layer without a structure such as the first metallic DAM disclosed by the present exemplary embodiment, and an organic layer VIA layer covers the inorganic layer DAM in order to control a Ti tip defect.",
"Accordingly, when the inorganic layer DAM and the organic layer VIA layer that covers the same form a DAM, but do not include the first metallic DAM, and a separation between the organic layer VIA layer and the thin film encapsulation inorganic layer is required, it is difficult to extend the thin film encapsulation inorganic layer.",
"For example, when the thin film encapsulation inorganic layer cannot be extended and the DAM should be spaced apart by a set or predetermined interval, a dead space is extended.",
"On the other hand, in the organic light-emitting display device according to the present exemplary embodiment, the DAM includes the first metallic DAM 410 and includes the first interlayer insulating layer 230 that covers the first metallic DAM 410 and includes an inorganic material, so that not only the lateral structure is strengthened by the first metallic DAM 410 but also thin film encapsulation inorganic layer 310 may be suitably or advantageously extended up to side of the substrate (e.g., the outermost portion of the substrate).",
"The first metallic DAM 410 according to the present exemplary embodiment may be formed in a layer where the driving gate electrode G of the driving TFT (refer to FIG.",
"2) is formed as illustrated in FIG.",
"1.For example, in manufacturing the organic light-emitting display device according to the present exemplary embodiment, the first metallic DAM 410 and the driving gate electrode G may be concurrently or simultaneously formed.",
"FIG.",
"4 is a schematic cross-sectional view illustrating an organic light-emitting display device according to an exemplary embodiment.",
"In FIG.",
"4, like reference numerals used for FIGS.",
"1 to 3 represent like members, and duplicated descriptions of the like members are not provided for conciseness of description herein.",
"In the organic light-emitting display device according to the present exemplary embodiment, the driving gate electrode G of the driving TFT may be coupled or connected with a first electrode C1 of a storage capacitor Cst.",
"In more detail, the driving gate electrode G is integrally formed in a layer where the first electrode C1 is formed.",
"For example, the storage capacitor may include the first electrode coupled with the driving gate electrode.",
"Also, a second electrode C2 of the storage capacitor Cst is disposed such that at least a portion of the second electrode C2 overlaps the first electrode C1, and the second electrode C2 may be formed in a layer where a driving voltage line is formed.",
"For example, the storage capacitor may include the second electrode on an upper portion of the first electrode and insulated from the first electrode.",
"In the case where a distance between wirings disposed to overlap such as the first electrode C1 and the second electrode C2 is close, parasitic capacitance between the wirings may occur, and an interference phenomenon between transferred signals may occur due to the wirings (e.g., due to the proximity of the wirings to each other).",
"To reduce this parasitic capacitance and/or a signal interference phenomenon, the present exemplary embodiment may include a second interlayer insulating layer 231.As shown in FIG.",
"4, the stack 200 may include the gate insulating layer 210, the first interlayer insulating layer 230, the second interlayer insulating layer 231, and the via layer 250.The second interlayer insulating layer 231 is disposed on the first interlayer insulating layer 230 and includes an opening that exposes a portion of the first interlayer insulating layer 230.The second electrode C2 of the storage capacitor Cst is disposed in the opening.",
"For example, the organic light-emitting display device according to the present exemplary embodiment may include the substrate 100, the TFT provided to the substrate 100, the storage capacitor Cst, the first interlayer insulating layer 230, the second interlayer insulating layer 231, and the DAM formed on the outermost portion of the substrate 100.As described above, the second interlayer insulating layer 231 may be additionally disposed between these wirings and/or the wiring and the TFT to reduce a value of parasitic capacitance and/or signal interference.",
"Meanwhile, there is a portion between the first electrode C1 and the second electrode C2 of the storage capacitor Cst where the second interlayer insulating layer 231 is not disposed, so that the storage capacitor Cst may maintain high storage capacity.",
"The first interlayer insulating layer 230 is intended for securing high storage capacity of the storage capacitor Cst.",
"In the organic light-emitting display device according to the present exemplary embodiment, the first interlayer insulating layer 230 may suitably or advantageously include an inorganic material having a high dielectric constant as described above.",
"Also, the second interlayer insulating layer 231 may also include an inorganic material.",
"In the organic light-emitting display device according to the present exemplary embodiment, since the first metallic DAM 410 may be formed in a layer where the driving gate electrode G of the driving TFT is formed, and since the driving gate electrode G may be integrally formed in a layer where the first electrode C1 is formed, the first metallic DAM 410 may be formed in a layer where the driving gate electrode G and the first electrode C1 are formed.",
"FIG.",
"5 is a schematic cross-sectional view illustrating an organic light-emitting display device according to an exemplary embodiment.",
"In FIG.",
"5, like reference numerals used for FIGS.",
"1 to 4 represent like members, and duplicated descriptions of the like members are not provided for conciseness of description herein.",
"As illustrated in FIG.",
"5, in the organic light-emitting display device according to the present exemplary embodiment, the DAM may further include a second metallic DAM 430 formed on an upper portion of the first metallic DAM 410.In the organic light-emitting display device according to the present exemplary embodiment, since the DAM disposed on the outermost portion of the substrate 100 doubly includes the metallic layer having stiffness, the lateral structure is suitably or advantageously strengthened against damage.",
"Like the first metallic DAM 410, the second metallic DAM 430 may include two or more metals (e.g., two or more metal layers) spaced apart by a set or predetermined interval.",
"Though FIG.",
"5 illustrates an exemplary embodiment where the first metallic DAM 410 and the second metallic DAM 430 respectively include three metals (e.g., three metal layers) spaced apart by a set or predetermined interval, the first metallic DAM 410 and the second metallic DAM 430 are not limited thereto, of course.",
"The DAM of the organic light-emitting display device according to the present exemplary embodiment may include the first metallic DAM 410, the first interlayer insulating layer 230 that covers the first metallic DAM 410 and includes an inorganic material, the second metallic DAM 430 formed on the upper portion of the first interlayer insulating layer 230, and the second interlayer insulating layer 231 that covers the second metallic DAM 430 and includes an inorganic material.",
"Also, like the above-described exemplary embodiments, the DAM may include the thin film encapsulation inorganic layer 310 disposed on the upper portion of the second interlayer insulating layer 231 and extending up to the outermost portion of the substrate 100.This is because the first interlayer insulating layer 230 and the second interlayer insulating layer 231 include an inorganic material, and thus, the thin film encapsulation inorganic layer 310 may extend without separation, and consequently, a dead space may be suitably or advantageously reduced.",
"In the organic light-emitting display device according to the present exemplary embodiment, the driving gate electrode G of the driving TFT may be coupled or connected with the first electrode C1 of the storage capacitor Cst.",
"In more detail, the driving gate electrode G may be integrally provided to a layer where the first electrode C1 is formed.",
"Also, the second electrode C2 of the storage capacitor Cst may be disposed such that at least a portion of the second electrode C2 overlaps the first electrode C1, and the second interlayer insulating layer 231 may include an opening that exposes a portion of the first interlayer insulating layer 230, and the second electrode C2 may be disposed in the opening.",
"In the organic light-emitting display device according to the present exemplary embodiment, the first metallic DAM 410 may be formed in a layer where the driving gate electrode G of the driving TFT and the first electrode C1 are formed.",
"For example, the first metallic DAM 410 may be concurrently or simultaneously formed when the driving gate electrode G and the first electrode C1 are integrally formed.",
"Also, the second metallic DAM 430 may be formed in a layer where the second electrode C2 of the storage capacitor Cst is formed.",
"For example, the second metallic DAM 430 and the second electrode C2 may be concurrently or simultaneously formed, and after the second metallic DAM 430 and the second electrode C2 are formed, the second interlayer insulating layer 231 that covers these features may be formed thereon.",
"Since the DAM of the organic light-emitting display device according to the present exemplary embodiment includes the first metallic DAM 410 and the second metallic DAM 430, a step difference may be formed at the first interlayer insulating layer 230, the second interlayer insulating layer 231, and the thin film encapsulation inorganic layer 310.Accordingly, Ti tip may be suitably or advantageously controlled.",
"Ti tip is a problem caused by a crack DAM (e.g., a cracked DAM) including an inorganic layer.",
"Since a profile of the crack DAM that includes an inorganic layer, but does not include the first metallic DAM, is formed to have an angle of 80-90 degrees (e.g., an angle of 80 to 90 degrees relative to the upper surface of the substrate), when etching is performed after a layer is formed during a process of forming S/D (e.g., source/drain), a residual layer of S/D remains.",
"At this point, there is a probability that a Ti component of an S/D residual layer is separated and moves into a display region during a subsequent process, and a defective display device may be caused by this Ti component of the S/D residual layer.",
"For example, Ti tip caused by a DAM that includes an inorganic layer but does not include the first metallic DAM may result in a defective display device as a result of Ti contaminating the display region of the display device.",
"To solve this problem, an organic light-emitting display device according to the present exemplary embodiment allows a DAM at the side of the substrate (e.g., formed on the outermost portion) to be formed to have a step difference by including the first metallic DAM 410, so that a profile lowers (e.g., a profile of the DAM is reduced), and consequently, the S/D residual layer does not remain and thus a defect generation by Ti tip may be suitably or advantageously prevented or reduced.",
"FIG.",
"6 is a schematic cross-sectional view illustrating an organic light-emitting display device according to an exemplary embodiment.",
"In FIG.",
"6, like reference numerals used for FIGS.",
"1 to 5 represent like members, and duplicated descriptions of the like members are not provided for conciseness of description herein.",
"As illustrated in FIG.",
"6, in the organic light-emitting display device according to the present exemplary embodiment, a DAM may include the first metallic DAM 410, the second metallic DAM 430 formed on the upper portion of the first metallic DAM 410, and may further include a third metallic DAM 450 formed on an upper portion of the second metallic DAM 430.In the organic light-emitting display device according to the present exemplary embodiment, since the DAM at a side of the substrate 100 (e.g., disposed on the outermost portion of the substrate 100) triply includes metal layers having stiffness, the lateral structure is suitably or advantageously strengthened against damage.",
"Like the first metallic DAM 410 and the second metallic DAM 430, the third metallic DAM 450 may include two or more metals (e.g., two or more metal layers) spaced apart by a set or predetermined interval.",
"Though FIG.",
"6 illustrates an exemplary embodiment where the first metallic DAM 410, the second metallic DAM 430, and the third metallic DAM 450 respectively include three metals (e.g., three metal layers) spaced apart by a set or predetermined interval, the DAM is not limited thereto, of course.",
"The DAM of the organic light-emitting display device according to the present exemplary embodiment may include the first metallic DAM 410, the first interlayer insulating layer 230 that covers the first metallic DAM 410 and includes an inorganic material, the second metallic DAM 430 formed on the upper portion of the first interlayer insulating layer 230, the second interlayer insulating layer 231 that covers the second metallic DAM 430 and includes an inorganic material, the third metallic DAM 450 formed on the upper portion of the second interlayer insulating layer 231, and the thin film encapsulation inorganic layer 310 that extends up to the side of the substrate 100 (e.g., the outermost portion of the substrate 100) to cover the third metallic DAM 450.Since the first interlayer insulating layer 230 and the second interlayer insulating layer 231 respectively include an inorganic material, the thin film encapsulation inorganic layer 310 may extend up to the DAM without separation, and consequently, a dead space may be suitably or advantageously reduced.",
"In the organic light-emitting display device according to the present exemplary embodiment, the driving gate electrode G of the driving TFT may be coupled or connected with the first electrode C1 of the storage capacitor Cst.",
"In more detail, the driving gate electrode G may be integrally provided to a layer where the first electrode C1 is formed.",
"The second electrode C2 of the storage capacitor Cst may be disposed such that at least a portion of the second electrode C2 overlaps the first electrode C1, and the second interlayer insulating layer 231 may include an opening that exposes a portion of the first interlayer insulating layer 230, and the second electrode C2 may be disposed in the opening.",
"Also, a source electrode S, a drain electrode D, and a data line may be provided to the upper portion of the second interlayer insulating layer 231.In the organic light-emitting display device according to the present exemplary embodiment, the first metallic DAM 410 may be formed in a layer where the driving gate electrode G of the driving TFT and the first electrode C1 of the storage capacitor Cst integrally formed with the driving gate electrode G are formed.",
"The second metallic DAM 430 may be formed in a layer where the second electrode C2 of the storage capacitor Cst is formed.",
"Also, the third metallic DAM 450 may be formed in a layer where the data line is formed.",
"As used herein, the term “substantially,” “about,” and similar terms are used as terms of approximation and not as terms of degree, and are intended to account for the inherent deviations in measured or calculated values that would be recognized by those of ordinary skill in the art.",
"Further, the use of “may” when describing embodiments of the present invention refers to “one or more embodiments of the present invention.” As used herein, the terms “use,” “using,” and “used” may be considered synonymous with the terms “utilize,” “utilizing,” and “utilized,” respectively.",
"Also, the term “exemplary” is intended to refer to an example or illustration.",
"Spatially relative terms, such as “beneath,” “below,” “lower,” “under,” “above,” “upper,” and the like, may be used herein for ease of explanation to describe one element or feature's relationship to another element(s) or feature(s) as illustrated in the figures.",
"It will be understood that the spatially relative terms are intended to encompass different orientations of the device in use or in operation, in addition to the orientation depicted in the figures.",
"For example, if the device in the figures is turned over, elements described as “below” or “beneath” or “under” other elements or features would then be oriented “above” the other elements or features.",
"Thus, the example terms “below” and “under” can encompass both an orientation of above and below.",
"The device may be otherwise oriented (e.g., rotated 90 degrees or at other orientations) and the spatially relative descriptors used herein should be interpreted accordingly.",
"While one or more exemplary embodiments have been described with reference to the figures, it will be understood by those of ordinary skill in the art that various changes in form and details may be made therein without departing from the spirit and scope of the present disclosure as defined by the following claims, and equivalents thereof."
]
] |
Patent_15871109
|
[
[
"LITHIUM ION BATTERY STACKING DEVICE",
"A lithium ion battery stacking device comprising a separator releasing mechanism, a stacking mechanism, and a collecting mechanism is provided.",
"The separator releasing mechanism is configured to be loaded with a separator and release the separator.",
"The stacking mechanism is configured to attach a cathode plate and an anode plate to the separator.",
"The collecting mechanism is configured to stack the separator attached with the cathode plate and the anode plate.",
"The separator releasing mechanism, the stacking mechanism, and the collecting mechanism are configured to keep the separator perpendicular to a horizontal plane."
],
[
"1.A lithium ion battery stacking device, comprising: a separator releasing mechanism to be loaded with a separator and release the separator; a stacking mechanism to attach a cathode plate and an anode plate to the separator; and a collecting mechanism to stack the separator attached with the cathode plate and the anode plate, wherein the separator releasing mechanism, the stacking mechanism, and the collecting mechanism are configured to keep the separator perpendicular to a horizontal plane.",
"2.The lithium ion battery stacking device of claim 1, wherein the stacking mechanism comprises a plurality of double-face clamps to clamp the cathode plate and the anode plate on the separator.",
"3.The lithium ion battery stacking device of claim 2, wherein each double-face clamp has two sheet structures opposite to each other, the two sheet structures are capable of being opened and closed to clamp the cathode plate and the anode plate on the separator.",
"4.The lithium ion battery stacking device of claim 3, wherein a width of the double-face clamp is larger than or equal to a width of either the cathode plate or the anode plate.",
"5.The lithium ion battery stacking device of claim 3, wherein two opposite inner surfaces of each double-face clamp are provided with a plurality of bulges to be in contact with the cathode plate, the anode plate, and the separator, the plurality of bulges are made of a flexible material to form a plastic surface, and a plurality of micropores are defined on a surface of each bulge.",
"6.The lithium ion battery stacking device of claim 3, wherein the plurality of double-face clamps is configured to rotate and fold the separator attached with the cathode plate and the anode plate near the collecting mechanism.",
"7.The lithium ion battery stacking device of claim 1, wherein the separator releasing mechanism comprises a separator roller and a plurality of transport rollers, the plurality of transport rollers is arranged according to a “Z”-shape, the separator is winded on the separator roller and transported by the plurality of transport rollers, and the separator roller and the plurality of transport rollers are perpendicular to the horizontal plane.",
"8.The lithium ion battery stacking device of claim 1, wherein the stacking mechanism comprises a positioning platform to position the cathode plate on the separator, and to position the anode plate on the separator, the positioning platform is movable, and a movement precision of the positioning platform is in a range from about 10 μm to about 100 μm.",
"9.The lithium ion battery stacking device of claim 1, wherein the collecting mechanism comprises a stacking platform, a first pressing claw, and a second pressing claw, the stacking platform has a stacking surface perpendicular to the horizontal plane, and the first pressing claw and the second pressing claw are opposite to and spaced from each other, and disposed at two ends of the stacking surface.",
"10.The lithium ion battery stacking device of claim 1, wherein the device further comprises two electrode plate boxes to respectively store the cathode plate and the anode plate, and further comprises a rotatable manipulator hand to suck the cathode plate and the anode plate from the two electrode plate boxes and transport the cathode plate and the anode plate to surfaces of the separator.",
"11.The lithium ion battery stacking device of claim 1, wherein the device further comprises a duster disposed between the attaching mechanism and the collecting mechanism to remove dust adsorbed on the cathode plate, the anode plate, and the separator and to eliminate static electricity between the cathode plate and the separator, and between the anode plate and the separator.",
"12.The lithium ion battery stacking device of claim 1, wherein the duster is an ionized blower to blow air in a vertical direction."
],
[
"<SOH> BACKGROUND <EOH>A high power lithium ion battery is a current developing direction.",
"A conventional high power lithium ion battery is manufactured by insulating a cathode plate and an anode plate by a separator, and alternately stacking the separator and the electrode plates repeatedly to form ten to hundred pairs.",
"In a conventional lithium ion battery stacking device, when a manipulator hand moves from one side to another, electrode plates are sucked by the manipulator hand from a cathode plate box and an anode plate box, and alternately placed on a stacking platform.",
"Meanwhile, the separator is moved with a sucking disc frame and is folded repeatedly, by which the electrode plates and the separator are stacked and assembled to form a complete cell.",
"The conventional stacking method of the lithium ion battery uses three-station type stacking manner, whose stacking route is through electrode plates picking up, positioning, and stacking.",
"However, in the conventional lithium ion battery stacking device, more than one plates may be picked in one picking step.",
"Moreover, the dust adsorbed on the cathode plate and the anode plate is difficult to be cleaned, thereby affecting the performance of the lithium ion battery."
],
[
"<SOH> SUMMARY <EOH>A lithium ion battery stacking device is provided.",
"The lithium ion battery stacking device comprises a separator releasing mechanism, a stacking mechanism, and a collecting mechanism, which are disposed in sequence.",
"The separator releasing mechanism is configured to be loaded with a separator and release the separator.",
"The stacking mechanism is configured to attach a cathode plate and an anode plate to the separator.",
"The collecting mechanism is configured to stack the separator attached with the cathode plate and the anode plate to form the lithium ion battery.",
"The surface of the separator is perpendicular to a horizontal plane and is successively released from the separator releasing mechanism, attached with the cathode plate and the anode plate in the stacking mechanism, and the plates are stacked in the collecting mechanism.",
"The stacking mechanism can comprise a double-face clamp to clamp the cathode plate and the anode plate on the separator, rotate the cathode plate and the anode plate attached on the separator, and transport the cathode plate and the anode plate attached on the separator to the collecting mechanism.",
"In the present disclosure, the stacking direction is changed, and the electrode plates and the separator are stacked in a direction perpendicular to the horizontal plane, thereby removing the dust effectively and decreasing the chance of stacking multiple cathode plates or multiple anode plates in one stack.",
"By having the positioning platform, stacking the electrode plates and the separator vertically in a “Z” shaped curve manner, providing the electrode plates in vertical manner, and using the double-face clamp circularly, the dust adsorbed on the surfaces of the electrode plates are easily removed, the work efficiency is increased, and product quality is enhanced."
],
[
"CROSS-REFERENCE TO RELATED APPLICATIONS This application claims all benefits accruing under 35 U.S.C.",
"§ 119 from China Patent Application No.",
"201510442394.0, filed on Jul.",
"24, 2015 in the State Intellectual Property Office of China, the content of which is hereby incorporated by reference.",
"This application is a continuation under 35 U.S.C.",
"§ 120 of international patent application PCT/CN2016/090257 filed on Jul.",
"18, 2016, the content of which is also hereby incorporated by reference.",
"FIELD The present disclosure relates to lithium ion battery stacking devices, especially to stacking devices and stacking methods using a vertical “Z” shaped stacking manner.",
"BACKGROUND A high power lithium ion battery is a current developing direction.",
"A conventional high power lithium ion battery is manufactured by insulating a cathode plate and an anode plate by a separator, and alternately stacking the separator and the electrode plates repeatedly to form ten to hundred pairs.",
"In a conventional lithium ion battery stacking device, when a manipulator hand moves from one side to another, electrode plates are sucked by the manipulator hand from a cathode plate box and an anode plate box, and alternately placed on a stacking platform.",
"Meanwhile, the separator is moved with a sucking disc frame and is folded repeatedly, by which the electrode plates and the separator are stacked and assembled to form a complete cell.",
"The conventional stacking method of the lithium ion battery uses three-station type stacking manner, whose stacking route is through electrode plates picking up, positioning, and stacking.",
"However, in the conventional lithium ion battery stacking device, more than one plates may be picked in one picking step.",
"Moreover, the dust adsorbed on the cathode plate and the anode plate is difficult to be cleaned, thereby affecting the performance of the lithium ion battery.",
"SUMMARY A lithium ion battery stacking device is provided.",
"The lithium ion battery stacking device comprises a separator releasing mechanism, a stacking mechanism, and a collecting mechanism, which are disposed in sequence.",
"The separator releasing mechanism is configured to be loaded with a separator and release the separator.",
"The stacking mechanism is configured to attach a cathode plate and an anode plate to the separator.",
"The collecting mechanism is configured to stack the separator attached with the cathode plate and the anode plate to form the lithium ion battery.",
"The surface of the separator is perpendicular to a horizontal plane and is successively released from the separator releasing mechanism, attached with the cathode plate and the anode plate in the stacking mechanism, and the plates are stacked in the collecting mechanism.",
"The stacking mechanism can comprise a double-face clamp to clamp the cathode plate and the anode plate on the separator, rotate the cathode plate and the anode plate attached on the separator, and transport the cathode plate and the anode plate attached on the separator to the collecting mechanism.",
"In the present disclosure, the stacking direction is changed, and the electrode plates and the separator are stacked in a direction perpendicular to the horizontal plane, thereby removing the dust effectively and decreasing the chance of stacking multiple cathode plates or multiple anode plates in one stack.",
"By having the positioning platform, stacking the electrode plates and the separator vertically in a “Z” shaped curve manner, providing the electrode plates in vertical manner, and using the double-face clamp circularly, the dust adsorbed on the surfaces of the electrode plates are easily removed, the work efficiency is increased, and product quality is enhanced.",
"BRIEF DESCRIPTION OF THE DRAWINGS Implementations are described by way of example only with reference to the attached figures.",
"FIG.",
"1 is a schematic view of one embodiment of a lithium ion battery stacking device.",
"FIG.",
"2 is a schematic view of one embodiment of a double-face clamp of the lithium ion battery stacking device.",
"FIG.",
"3 is a schematic view of one embodiment of a collecting mechanism of the lithium ion battery stacking device.",
"FIG.",
"4 is a schematic view of one embodiment of an electrode plate box of the lithium ion battery stacking device.",
"FIG.",
"5 is a schematic view of one embodiment of a rotatable manipulator hand of the lithium ion battery stacking device.",
"FIG.",
"6 is schematic view showing a stacking process of the lithium ion battery stacking device.",
"DETAILED DESCRIPTION A detailed description with the above drawings is made to further illustrate the present disclosure.",
"Referring to FIG.",
"1, one embodiment of a lithium ion battery stacking device 100 comprises a separator releasing mechanism 10, a stacking mechanism 20, and a collecting mechanism 30.The separator releasing mechanism 10 is configured to be loaded with a separator 40 and release the separator 40.The stacking mechanism 20 is configured to attach a cathode plate 50 and an anode plate 60 alternately on the separator.",
"The collecting mechanism 30 is configured to fold and stack the separator 40 attached with the cathode plate 50 and the anode plate 60 to form the lithium ion battery.",
"The separator releasing mechanism 10 is configured to be loaded with the separator 40 and continuously release the separator 40.The separator releasing mechanism 10 can comprise a separator roller 101 and at least one transport roller 102.The separator 40 can be winded on the separator roller 101 and transported by the least one transport roller 102.An angle can be defined between a surface of the separator 40 and a horizontal plane.",
"The at least one transport roller 102 can be perpendicular to the horizontal plane.",
"The separator 40 can be attached to the transport roller 102 and bypass the transport roller 102.The surface of the separator 40 can be perpendicular to the horizontal plane, and can be kept perpendicular to the horizontal plane in the whole stacking process.",
"In one embodiment, the separator releasing mechanism 10 can comprise four transport rollers 102.The four transport rollers 102 can be parallel to each other and parallel to the separator roller 101.A plurality of transport rollers 102 can be arranged according to a “Z”-shape.",
"The separator 40 can successively bypass the plurality of transport rollers 102 one by one to decrease the stretching force of the separator 40, by which the separator 40 can be transported stably.",
"The stacking mechanism 20 can be spaced from the separator releasing mechanism 10 to position the separator 40, so that the cathode plate 50 or the anode plate 60 can be accurately attached on the surface of the separator 40, and an offset between the cathode plate 50 and the separator 40, or the anode plate 60 and the separator 40 can be avoided in the attaching process.",
"The stacking mechanism 20 can comprises a positioning platform 201.The positioning platform 201 can comprise a plurality of positioning sensors (not shown) to position the cathode plate 50 to the separator 40, and the anode plate 60 to the separator 40.The positioning platform 201 can move up and down.",
"A movement precision of the positioning platform 201 can be in a range from about 10 μm to about 100 μm to position the cathode plate 50 and the anode plate 60 accurately.",
"Referring to FIG.",
"2, the stacking mechanism 20 can comprise a plurality of double-face clamps 202 to clamp the cathode plate 50 and the separator 40, and clamp the anode plate 60 and the separator 40 to fix a relative position between the cathode plate 50 and the separator 40, or between the anode plate 60 and the separator 40.The plurality of double-face clamps 202 can be driven by a mechanism such as a sliding rail to move along a transport direction of the separator 40, thereby driving the cathode plate 50 with the separator 40, or the anode plate 60 with the separator 40 to move, and preventing the cathode plate 50 and the anode plated 60 from falling off from an attaching position on the surface of the separator 40 due to gravity.",
"The double-face clamp 202 can have two sheet structures opposite to each other.",
"The two sheet structures can be opened and closed to clamp the cathode plate 50 and the anode plate 60.The lengths of a side that have a lug of the cathode plate 50 and the anode plate 60 can be respectively defined as the widths of the cathode plate 50 and the anode plate 60.The maximum length that the double-face clamp 202 can clamp the separator 40 can also be a clamping width of the double-face clamp 202 along the transport direction of the separator 40.The width of the double-face clamp 202 can be larger than or equal to the widths of the cathode plate 50 and the anode plate 60 to fix the cathode plate 50 and the anode plate 60 more firmly, preventing a misalignment between the cathode plate 50 and the separator 40, and between the anode plate 60 and the separator 40.Two opposite inner surfaces of the double-face clamp 202 can be provided with a plurality of bulges 2021 to be in contact with the cathode plate 50, the anode plate 60, and the separator 40.The double-face clamp 202 can rotate with the cathode plate 50 and the anode plate 60, and transport the cathode plate 50 and the anode plate 60 to the collecting mechanism 30.The plurality of bulges 2021 can be uniformly arranged along a width direction of the double-face clamp 202.The plurality of bulges 2021 can be made of a flexible material to form a plastic/pliant surface, to fix the electrode plates firmly.",
"A plurality of micropores can be defined on a surface touching the electrode plates and the separator 40 of each bulge 2021 to attach the electrode plates and the separator 40 more firmly.",
"In one embodiment, a material of the plurality of bulges 2021 is smooth silicon rubber.",
"Referring to FIG.",
"3, the collecting mechanism 30 can be disposed along the transport direction of the separator 40, and spaced from the stacking mechanism 20.The collecting mechanism 30 can comprise a stacking platform 303, a first pressing claw 304, and a second pressing claw 306.The stacking platform 303 can have a stacking surface to support the stacked cathode plate 50, anode plate 60, and the separator 40.The stacking surface of the stacking platform 303 can be a vertical plane.",
"The stacking surface can be perpendicular to the surface of the separator 40.The first pressing claw 304 and the second pressing claw 306 can be opposite to and spaced from each other, and disposed at two ends of the stacking platform 303 to alternately collect the cathode plate 50 and the anode plate 60 attached on the surfaces of the separator 40, and press the cathode plate 50 and the anode plate 60 onto the stacking surface.",
"The first pressing claw 304 and the second pressing claw 306 can move toward or far away from each other by an air cylinder and a threaded rod.",
"A distance between the first pressing claw 304 and the second pressing claw 306 can be selected according to the widths of the cathode plate 50 and the anode plate 50, as long as the first pressing claw 304 and the second pressing claw 306 can grab the cathode plate 50 and the anode plate 50 to put the cathode plate 50 and the anode plate 50 onto the stacking platform 303.The first pressing claw 304 can be configured to press the cathode plate 50.The second pressing claw 305 can be configured to press the anode plate 60.Because the separator 40 attached with the cathode plate 50 and the anode plate 60 is alternately folded at a position near the stacking surface, the first pressing claw 304 and the second pressing claw 306 can be symmetrically disposed at two ends of the stacking surface near two sides that is formed by folding the separator 40 to press the sides.",
"Referring to FIG.",
"4 and FIG.",
"5, the cathode plate 50 and the anode plate 60 can be respectively stored in an electrode plate box 70 before stacked with the separator 40.The electrode plate box 70 can define a lug channel 71 to accommodate lugs of the cathode plate 50 and the anode plate 60.The lugs of the cathode plate 50 and the anode plate 60 can slide in the lug channel 71.Two electrode plate boxes 70 that are respectively used to store the cathode plate 50 and the anode plate 60 can be spaced from each other.",
"The two electrode plate boxes 70 can be respectively disposed on two sides of two opposite surfaces of the separator 40 to avoid micro-short circuiting.",
"A rotatable manipulator hand 80 can suck and transport the cathode plate 50 and the anode plate 60 to the surfaces of the separator 40.The rotatable manipulator hand 80 can comprises a plurality of sucking discs 81 to suck and transport the cathode plate 50 and the anode plate 60, and transport them to the surfaces of the separator 40.The plurality of sucking discs 81 can be distributed in a triangle to suck the surfaces of the cathode plate 50 and the anode plate 60 more firmly.",
"The stacking device can further comprise a duster 90 to remove dust from the surfaces of the cathode plate 50 and the anode plate 60, and eliminate static electricity between the cathode plate 50 and the separator 40, and between the anode plate 60 and the separator 40.The duster 90 can blow air vertically, that is, a direction of airflow is parallel to the surface of the separator 40 and perpendicular to the horizontal plane, thereby greatly enhancing the dedusting effect.",
"The duster 90 can be disposed between the stacking mechanism 20 and the collecting mechanism 30 to remove dust effectively.",
"In one embodiment, the duster 90 is an ionized blower.",
"Referring to FIG.",
"6, when using the lithium ion battery stacking device 100 to stack plates, automatic plate providing and positioning, separator and electrode plates positioning, and stacking platform positioning can be set.",
"The electrode plates can be stacked in a Z-shape compression manner.",
"After the electrode plates (cathode plates and anode plates) are put into the electrode plate boxes, the rotatable manipulator hand sucks the electrode plates by the sucking disc and rotates to transport the electrode plates to the separator.",
"A plurality of manipulator hands such as three manipulator hands can transport the electrode plates simultaneously.",
"The cathode plates and the anode plates can be disposed in a stagger way and disposed according to a process data.",
"The electrode plates and the separator are clamped by the plurality of double-face clamps to prevent the electrode plates from falling off from the attaching position on the separator due to gravity.",
"In the stacking process, the plurality of double-face clamps connected to an automated electronic device can move along a “Z”-shaped path.",
"When the electrode plates get close to the stacking platform, the first pressing claw and the second pressing claw is moved to press the separator attaching the electrode plates onto the stacking platform.",
"Furthermore, the ionized blower blows air to the electrode plates and the separator to prevent static electricity and dust from staying between the electrode plates and the separator to improve dust removal effect under the action of gravity.",
"In the present disclosure, the stacking direction is changed, and the electrode plates and the separator are stacked in a direction perpendicular to the horizontal plane.",
"By disposing the positioning platform, stacking the electrode plates and the separator in vertical direction and in a “Z”-shaped curve manner, providing the electrode plates in vertical manner, and using the double-face clamp circularly, the dust adsorbed on the surfaces of the electrode plates are easily removed, the work efficiency is increased, and product quality is enhanced.",
"By clamping the electrode plates on the separator using double-face clamps on which smooth silicone rubber is disposed to touch the electrode plates, damage of the electrode plates due to non-uniform surface is avoided, and the electrode plates are accurately positioned.",
"By setting the movement of the double-face clamp by an operational procedure, selecting route by a rotating device, and driving the double-face clamps clamping the cathode plates and the anode plates to move in different directions, the electrode plates and the separator is stacked circularly and work efficiency is improved.",
"The stacking precision and the stacking speed are increased.",
"The micro-short circuiting caused by dust is decreased.",
"By disposing the ionized blower between the stacking mechanism and the collecting mechanism to blow air vertically, the dust is removed from the surfaces of the cathode plate, the anode plate, and the separator, and the static electricity between the cathode plate and the separator, and between the anode plate and the separator is eliminated.",
"Finally, it is to be understood that the above-described embodiments are intended to illustrate rather than limit the present disclosure.",
"Variations may be made to the embodiments without departing from the spirit of the present disclosure as claimed.",
"Elements associated with any of the above embodiments are envisioned to be associated with any other embodiments.",
"The above-described embodiments illustrate the scope of the present disclosure but do not restrict the scope of the present disclosure."
]
] |
Patent_15871110
|
[
[
"NOVEL CONDUCTING STRUCTURE AND CONDUCTING METHOD FOR UPPER SHEET AND LOWER SHEET OF FILM BUTTON CIRCUIT",
"A novel conducting structure and conducting method for an upper sheet and a lower sheet of a film button circuit.",
"A first upper sheet conducting layer and a second upper sheet conducting layer are coated in sequence on an upper sheet conducting contact point.",
"A first lower sheet conducting layer and a second lower sheet conducting layer are coated in sequence on a lower sheet conducting contact point.",
"The first upper sheet conducting layer, the second upper sheet conducting layer, the second lower sheet conducting layer and the first lower sheet conducting layer are overlapped in sequence, thereby forming a composite conducting layer that is slightly greater than a back glue layer in thickness.",
"The present invention can simplify assembly processes and can improve the production efficiency."
],
[
"1.A novel conducting method for an upper sheet and a lower sheet of a film button circuit, comprising the following steps: S1: preparing an upper circuit sheet and a lower circuit sheet which are printed with predetermined circuits respectively, a lower surface of the upper circuit sheet being provided with a plurality of upper sheet conducting contact points corresponding to buttons arranged in rows and columns, an upper surface of the lower circuit sheet being provided with a plurality of lower sheet conducting contact points corresponding to the buttons arranged in rows and columns, the respective upper sheet conducting contact points and the respective lower sheet conducting contact points being disposed outside button areas of the upper and lower circuit sheets, the respective upper sheet conducting contact points and the respective lower sheet conducting contact points being disposed correspondingly; S2: each upper sheet conducting contact point being coated with a first upper sheet conducting layer and a second upper sheet conducting layer in sequence, each lower sheet conducting contact point being coated with a first lower sheet conducting layer and a second lower sheet conducting layer in sequence, the first upper sheet conducting layer, the second upper sheet conducting layer, the second lower sheet conducting layer and the first lower sheet conducting layer being overlapped in sequence to form a composite conducting layer; S3: the lower surface of the upper circuit sheet and the upper surface of the lower circuit sheet after treated by the Step S2 being bounded together through a back glue layer, a thickness of the back glue layer being controlled, enabling the composite conducting layer to have a thickness slightly greater than the thickness of the back glue layer to form a conduction pressure between the corresponding upper and lower sheet conducting contact points; and S4: the corresponding upper conducting contact points and the corresponding lower sheet conducting contact points being conducted to lead X-Y matrix circuits to the upper circuit sheet and the lower circuit sheet to be guided out and plugged on a FPC connector through a flat cable.",
"2.The novel conducting method for an upper sheet and a lower sheet of a film button circuit as claimed in claim 5, wherein the thickness of the composite conducting layer is greater than that of the back glue layer by 0.01 mm-0.1 mm.",
"3.The novel conducting method for an upper sheet and a lower sheet of a film button circuit as claimed in claim 5, wherein the first upper sheet conducting layer and the first lower sheet conducting layer are conducting silver paste layers, and the second upper sheet conducting layer and the second lower sheet conducting layer are conducting carbon film layers.",
"4.The novel conducting method for an upper sheet and a lower sheet of a film button circuit as claimed in claim 5, wherein the second upper sheet conducting layer and the second lower sheet conducting layer completely cover the first upper sheet conducting layer and the first lower sheet conducting layer, respectively."
],
[
"<SOH> BACKGROUND OF THE INVENTION <EOH>"
],
[
"<SOH> SUMMARY OF THE INVENTION <EOH>The primary object of the present invention is to provide a novel conducting structure and a conducting method for an upper sheet and a lower sheet of a film button circuit.",
"The conducting structure has the advantages of low cost, convenience in machining and high working reliability.",
"According to an aspect of the present invention, a novel conducting structure for an upper sheet and a lower sheet of a film button circuit is provided.",
"The conducting structure has an upper circuit sheet and a lower circuit sheet.",
"A lower surface of the upper circuit sheet and an upper surface of the lower circuit sheet are bonded together through a back glue layer.",
"The lower surface of the upper circuit sheet is provided with a plurality of upper sheet conducting contact points corresponding to buttons arranged in rows and columns The upper surface of the lower circuit sheet is provided with a plurality of lower sheet conducting contact points corresponding to the buttons arranged in rows and columns.",
"The respective upper sheet conducting contact points and the respective lower sheet conducting contact points are disposed outside button areas of the upper and lower circuit sheets.",
"The respective upper sheet conducting contact points and the respective lower sheet conducting contact points are disposed correspondingly.",
"Each upper sheet conducting contact point is coated with a first upper sheet conducting layer and a second upper sheet conducting layer in sequence.",
"Each lower sheet conducting contact point is coated with a first lower sheet conducting layer and a second lower sheet conducting layer in sequence.",
"The first upper sheet conducting layer, the second upper sheet conducting layer, the second lower sheet conducting layer and the first lower sheet conducting layer are overlapped in sequence to form a composite conducting layer.",
"The composite conducting layer has a thickness slightly greater than that of the back glue layer to form a conduction pressure between the corresponding upper and lower sheet conducting contact points.",
"The corresponding upper and lower sheet conducting contact points lead X-Y matrix circuits to the upper circuit sheet and the lower circuit sheet to be guided out and plugged on a FPC connector through a flat cable.",
"Preferably, the thickness of the composite conducting layer is greater than that of the back glue layer by 0.01 mm-0.1 mm.",
"Preferably, the first upper sheet conducting layer and the first lower sheet conducting layer are conducting silver paste layers, and the second upper sheet conducting layer and the second lower sheet conducting layer are conducting carbon film layers.",
"Preferably, the second upper sheet conducting layer and the second lower sheet conducting layer completely cover the first upper sheet conducting layer and the first lower sheet conducting layer, respectively.",
"According to another aspect of the present invention, a novel conducting method for an upper sheet and a lower sheet of a film button circuit is provided.",
"The conducting method comprises the following steps: S 1 : preparing an upper circuit sheet and a lower circuit sheet which are printed with predetermined circuits respectively, a lower surface of the upper circuit sheet being provided with a plurality of upper sheet conducting contact points corresponding to buttons arranged in rows and columns, an upper surface of the lower circuit sheet being provided with a plurality of lower sheet conducting contact points corresponding to the buttons arranged in rows and columns, the respective upper sheet conducting contact points and the respective lower sheet conducting contact points being disposed outside button areas of the upper and lower circuit sheets, the respective upper sheet conducting contact points and the respective lower sheet conducting contact points being disposed correspondingly; S 2 : each upper sheet conducting contact point being coated with a first upper sheet conducting layer and a second upper sheet conducting layer in sequence, each lower sheet conducting contact point being coated with a first lower sheet conducting layer and a second lower sheet conducting layer in sequence, the first upper sheet conducting layer, the second upper sheet conducting layer, the second lower sheet conducting layer and the first lower sheet conducting layer being overlapped in sequence to form a composite conducting layer; S 3 : the lower surface of the upper circuit sheet and the upper surface of the lower circuit sheet after treated by the Step S 2 being bounded together through a back glue layer, a thickness of the back glue layer being controlled, enabling the composite conducting layer to have a thickness slightly greater than the thickness of the back glue layer to form a conduction pressure between the corresponding upper and lower sheet conducting contact points; and S 4 : the corresponding upper conducting contact points and the corresponding lower sheet conducting contact points being conducted to lead X-Y matrix circuits to the upper circuit sheet and the lower circuit sheet to be guided out and plugged on a FPC connector through a flat cable.",
"Preferably, the thickness of the composite conducting layer is greater than that of the back glue layer by 0.01 mm-0.1 mm Preferably, the first upper sheet conducting layer and the first lower sheet conducting layer are conducting silver paste layers, and the second upper sheet conducting layer and the second lower sheet conducting layer are conducting carbon film layers.",
"Preferably, the second upper sheet conducting layer and the second lower sheet conducting layer completely cover the first upper sheet conducting layer and the first lower sheet conducting layer, respectively.",
"Accordingly, the features of the novel conducting structure and conducting method for an upper sheet and a lower sheet of a film button circuit of the present invention are that each upper sheet conducting contact point is coated with the first upper sheet conducting layer and the second upper sheet conducting layer in sequence, each lower sheet conducting contact point is coated with the first lower sheet conducting layer and the second lower sheet conducting layer in sequence, the first upper sheet conducting layer, the second upper sheet conducting layer, the second lower sheet conducting layer and the first lower sheet conducting layer are overlapped in sequence to form the composite conducting layer, and the composite conducting layer has a thickness slightly greater than that of the back glue layer.",
"The upper sheet conducting contact points and the lower sheet conducting contact points are cushioned and raised by using a low-cost multiple-time printing way, and the second upper sheet conducting layer and the second lower sheet conducting layer are reliably compressed together by using micro deformation force generated as the composite conducting layer is slightly greater than the back glue layer in thickness, thereby realizing the conduction of buttons.",
"Through this structure, a bar-shaped conducting pressure is formed between the upper and lower sheet conducting contact points.",
"The conducting structure has the advantages of low cost, convenience in machining and high working reliability.",
"The method can simplify production testing and assembly processes, and can improve the production efficiency."
],
[
"CROSS-REFERENCE TO RELATED APPLICATION This is a divisional application of co-pending U.S. patent application Ser.",
"No.",
"15/125,147 filed on Sep. 10, 2016 and owned by the present applicant.",
"BACKGROUND OF THE INVENTION 1.Field of the Invention The present invention relates to a button circuit of an electronic product, and more particularly to a novel conducting structure and a conducting method for an upper sheet and a lower sheet of a film button circuit.",
"2.Description of the Prior Art Most conventional film button circuit sheets on the market are composed of an upper circuit sheet and a lower circuit sheet (made of a PET transparent sheet).",
"The lower surface of the upper circuit sheet and the upper surface of the lower circuit sheet are printed with X-Y silver paste matrix circuits and bonded together through a back glue layer.",
"As shown in FIG.",
"1, tongues 101, 201 extend out from the upper and lower circuit sheets 100, 200 respectively.",
"The upper and lower circuit sheets 100, 200 are provided with conducting contact points on the tongues 101, 201 corresponding to respective buttons.",
"The distal ends of the tongues 101, 201 are connected with piercing conducting terminals 102, 202 by riveting.",
"The piercing conducting terminals 102, 202 are electrically connected with respective pin sockets of a circuit board 300 to form an X-Y matrix button circuit to be scanned and trigged by a microprocessor.",
"The tongues extend from the upper and lower circuit sheets of the film button circuit sheet for X-Y signal output.",
"The tongues are respectively plugged on two pin sockets through the piercing conducting terminals This structure has the following drawbacks.",
"The area of the film button circuit sheet is large.",
"The matrix circuit formed by the upper and lower circuit sheets must have a certain length to be plugged on the circuit board, so the cost is high.",
"The tongues must be connected with the piercing pin sockets by riveting for connection of the pin sockets.",
"The processing technique is more complicated and the cost is high.",
"Accordingly, the inventor of the present invention has devoted himself based on his many years of practical experiences to solve this problem.",
"SUMMARY OF THE INVENTION The primary object of the present invention is to provide a novel conducting structure and a conducting method for an upper sheet and a lower sheet of a film button circuit.",
"The conducting structure has the advantages of low cost, convenience in machining and high working reliability.",
"According to an aspect of the present invention, a novel conducting structure for an upper sheet and a lower sheet of a film button circuit is provided.",
"The conducting structure has an upper circuit sheet and a lower circuit sheet.",
"A lower surface of the upper circuit sheet and an upper surface of the lower circuit sheet are bonded together through a back glue layer.",
"The lower surface of the upper circuit sheet is provided with a plurality of upper sheet conducting contact points corresponding to buttons arranged in rows and columns The upper surface of the lower circuit sheet is provided with a plurality of lower sheet conducting contact points corresponding to the buttons arranged in rows and columns.",
"The respective upper sheet conducting contact points and the respective lower sheet conducting contact points are disposed outside button areas of the upper and lower circuit sheets.",
"The respective upper sheet conducting contact points and the respective lower sheet conducting contact points are disposed correspondingly.",
"Each upper sheet conducting contact point is coated with a first upper sheet conducting layer and a second upper sheet conducting layer in sequence.",
"Each lower sheet conducting contact point is coated with a first lower sheet conducting layer and a second lower sheet conducting layer in sequence.",
"The first upper sheet conducting layer, the second upper sheet conducting layer, the second lower sheet conducting layer and the first lower sheet conducting layer are overlapped in sequence to form a composite conducting layer.",
"The composite conducting layer has a thickness slightly greater than that of the back glue layer to form a conduction pressure between the corresponding upper and lower sheet conducting contact points.",
"The corresponding upper and lower sheet conducting contact points lead X-Y matrix circuits to the upper circuit sheet and the lower circuit sheet to be guided out and plugged on a FPC connector through a flat cable.",
"Preferably, the thickness of the composite conducting layer is greater than that of the back glue layer by 0.01 mm-0.1 mm.",
"Preferably, the first upper sheet conducting layer and the first lower sheet conducting layer are conducting silver paste layers, and the second upper sheet conducting layer and the second lower sheet conducting layer are conducting carbon film layers.",
"Preferably, the second upper sheet conducting layer and the second lower sheet conducting layer completely cover the first upper sheet conducting layer and the first lower sheet conducting layer, respectively.",
"According to another aspect of the present invention, a novel conducting method for an upper sheet and a lower sheet of a film button circuit is provided.",
"The conducting method comprises the following steps: S1: preparing an upper circuit sheet and a lower circuit sheet which are printed with predetermined circuits respectively, a lower surface of the upper circuit sheet being provided with a plurality of upper sheet conducting contact points corresponding to buttons arranged in rows and columns, an upper surface of the lower circuit sheet being provided with a plurality of lower sheet conducting contact points corresponding to the buttons arranged in rows and columns, the respective upper sheet conducting contact points and the respective lower sheet conducting contact points being disposed outside button areas of the upper and lower circuit sheets, the respective upper sheet conducting contact points and the respective lower sheet conducting contact points being disposed correspondingly; S2: each upper sheet conducting contact point being coated with a first upper sheet conducting layer and a second upper sheet conducting layer in sequence, each lower sheet conducting contact point being coated with a first lower sheet conducting layer and a second lower sheet conducting layer in sequence, the first upper sheet conducting layer, the second upper sheet conducting layer, the second lower sheet conducting layer and the first lower sheet conducting layer being overlapped in sequence to form a composite conducting layer; S3: the lower surface of the upper circuit sheet and the upper surface of the lower circuit sheet after treated by the Step S2 being bounded together through a back glue layer, a thickness of the back glue layer being controlled, enabling the composite conducting layer to have a thickness slightly greater than the thickness of the back glue layer to form a conduction pressure between the corresponding upper and lower sheet conducting contact points; and S4: the corresponding upper conducting contact points and the corresponding lower sheet conducting contact points being conducted to lead X-Y matrix circuits to the upper circuit sheet and the lower circuit sheet to be guided out and plugged on a FPC connector through a flat cable.",
"Preferably, the thickness of the composite conducting layer is greater than that of the back glue layer by 0.01 mm-0.1 mm Preferably, the first upper sheet conducting layer and the first lower sheet conducting layer are conducting silver paste layers, and the second upper sheet conducting layer and the second lower sheet conducting layer are conducting carbon film layers.",
"Preferably, the second upper sheet conducting layer and the second lower sheet conducting layer completely cover the first upper sheet conducting layer and the first lower sheet conducting layer, respectively.",
"Accordingly, the features of the novel conducting structure and conducting method for an upper sheet and a lower sheet of a film button circuit of the present invention are that each upper sheet conducting contact point is coated with the first upper sheet conducting layer and the second upper sheet conducting layer in sequence, each lower sheet conducting contact point is coated with the first lower sheet conducting layer and the second lower sheet conducting layer in sequence, the first upper sheet conducting layer, the second upper sheet conducting layer, the second lower sheet conducting layer and the first lower sheet conducting layer are overlapped in sequence to form the composite conducting layer, and the composite conducting layer has a thickness slightly greater than that of the back glue layer.",
"The upper sheet conducting contact points and the lower sheet conducting contact points are cushioned and raised by using a low-cost multiple-time printing way, and the second upper sheet conducting layer and the second lower sheet conducting layer are reliably compressed together by using micro deformation force generated as the composite conducting layer is slightly greater than the back glue layer in thickness, thereby realizing the conduction of buttons.",
"Through this structure, a bar-shaped conducting pressure is formed between the upper and lower sheet conducting contact points.",
"The conducting structure has the advantages of low cost, convenience in machining and high working reliability.",
"The method can simplify production testing and assembly processes, and can improve the production efficiency.",
"BRIEF DESCRIPTION OF THE DRAWINGS FIG.",
"1 is a schematic view of a novel conducting structure for an upper sheet and a lower sheet of a film button circuit of the prior art; FIG.",
"2 is a schematic view of a novel conducting structure for an upper sheet and a lower sheet of a film button circuit of the present invention; FIG.",
"3 is a partial enlarged view of FIG.",
"2; and FIG.",
"4 is a sectional view taken along line A-A of FIG.",
"3.DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Embodiments of the present invention will now be described, by way of example only, with reference to the accompanying drawings.",
"As shown in FIG.",
"2 to FIG.",
"4, a novel conducting structure for an upper sheet and a lower sheet of a film button circuit of the present invention comprises an upper circuit sheet 10 and a lower circuit sheet 20.A lower surface of the upper circuit sheet 10 and an upper surface of the lower circuit sheet 20 are bonded together through a back glue layer 30.The lower surface of the upper circuit sheet 10 is provided with a plurality of upper sheet conducting contact points 11 corresponding to buttons arranged in rows and columns.",
"The upper surface of the lower circuit sheet 20 is provided with a plurality of lower sheet conducting contact points 21 corresponding to the buttons arranged in rows and columns The respective upper sheet conducting contact points 11 and the respective lower sheet conducting contact points 21 are disposed outside button areas of the upper and lower circuit sheets.",
"The respective upper sheet conducting contact points 11 and the respective lower sheet conducting contact points 21 are disposed correspondingly.",
"Each upper sheet conducting contact point 11 is coated with a first upper sheet conducting layer 12 and a second upper sheet conducting layer 13 in sequence.",
"Each lower sheet conducting contact point 21 is coated with a first lower sheet conducting layer 22 and a second lower sheet conducting layer 23 in sequence.",
"The first upper sheet conducting layer 12, the second upper sheet conducting layer 13, the second lower sheet conducting layer 23 and the first lower sheet conducting layer 22 are overlapped in sequence to form a composite conducting layer.",
"The composite conducting layer has a thickness slightly greater than that of the back glue layer 30.In this embodiment, the thickness of the composite conducting layer is greater than that of the back glue layer 30 by 0.01 mm-0.1 mm.",
"The corresponding upper sheet conducting contact points 11 and the corresponding lower sheet conducting contact points 21 are conducted to lead X-Y matrix circuits to the upper circuit sheet 10 and the lower circuit sheet 20 to be guided out and plugged on a FPC connector through a flat cable 40.A novel conducting method for an upper sheet and a lower sheet of a film button circuit of the present invention comprises the following steps: S1: preparing an upper circuit sheet 10 and a lower circuit sheet 20 which are printed with predetermined circuits respectively, in this embodiment, a lower surface of the upper circuit sheet and an upper surface of the lower circuit sheet are printed with X-Y silver paste matrix circuits respectively, the lower surface of the upper circuit sheet 10 is provided with a plurality of upper sheet conducting contact points 11 corresponding to buttons arranged in rows and columns, the upper surface of the lower circuit sheet 20 is provided with a plurality of lower sheet conducting contact points 21 corresponding to the buttons arranged in rows and columns, the respective upper sheet conducting contact points 11 and the lower sheet conducting contact points 21 are disposed outside button areas of the upper and lower circuit sheets, the respective upper sheet conducting contact points 11 and the respective lower sheet conducting contact points 21 are disposed correspondingly; S2: each upper sheet conducting contact point 11 is coated with a first upper sheet conducting layer 12 and a second upper sheet conducting layer 13 in sequence, each lower sheet conducting contact point 21 is coated with a first lower sheet conducting layer 22 and a second lower sheet conducting layer 23 in sequence, the first upper sheet conducting layer 12, the second upper sheet conducting layer 13, the second lower sheet conducting layer 23 and the first lower sheet conducting layer 22 are overlapped in sequence to form a composite conducting layer; S3: the lower surface of the upper circuit sheet 10 and the upper surface of the lower circuit sheet 20 after treated by the Step S2 are bounded together through a back glue layer 30, the thickness of the back glue layer is controlled, enabling the composite conducting layer to have a thickness slightly greater than that of the back glue layer 30, in this embodiment, the thickness of the composite conducting layer is greater than that of the back glue layer 30 by 0.01 mm-0.1 mm to form a conduction pressure between the corresponding upper and lower sheet conducting contact points; S4: the corresponding upper sheet conducting contact points 11 and the corresponding lower sheet conducting contact points 21 are conducted to lead X-Y matrix circuits to the upper circuit sheet 10 and the lower circuit sheet 20 to be guided out and plugged on a FPC connector through a flat cable 40.In this embodiment, the first upper sheet conducting layer and the first lower sheet conducting layer are conducting silver paste layers.",
"The second upper sheet conducting layer and the second lower sheet conducting layer are conducting carbon film layers.",
"The second upper sheet conducting layer and the second lower sheet conducting layer completely cover the first upper sheet conducting layer and the first lower sheet conducting layer, respectively.",
"Although particular embodiments of the present invention have been described in detail for purposes of illustration, various modifications and enhancements may be made without departing from the spirit and scope of the present invention.",
"Accordingly, the present invention is not to be limited except as by the appended claims."
]
] |
Patent_15871118
|
[
[
"Anti-breakage and anti-scald bottle",
"An anti-breakage and anti-scald bottle includes an inner container and a plastic jacket arranged outside the inner container in a sleeving mode, wherein a soft rubber retainer ring is arranged at the inner bottom of the plastic jacket, and the bottom end of the inner container is clamped on the soft rubber retainer ring; an opening of the plastic jacket is connected with a fixed sleeve in a threaded mode, the neck of the fixed sleeve abuts against the periphery of an opening of the inner container, a soft rubber ring is fixedly arranged on the inner surface of the neck of the fixed sleeve and makes contact with the opening of the inner container, and a top opening of the fixed sleeve is sealed and covered with a bottle cap."
],
[
"1.An anti-breakage and anti-scald bottle, characterized by comprising an inner container and a plastic jacket arranged outside the inner container in a sleeving mode, wherein a soft rubber retainer ring is arranged at the inner bottom of the plastic jacket, and the bottom end of the inner container is clamped on the soft rubber retainer ring; an opening of the plastic jacket is connected with a fixed sleeve in a threaded mode, the neck of the fixed sleeve abuts against the periphery of an opening of the inner container, a soft rubber ring is fixedly arranged on the inner surface of the neck of the fixed sleeve and makes contact with the opening of the inner container, and a top opening of the fixed sleeve is sealed and covered with a bottle cap.",
"2.The anti-breakage and anti-scald bottle according to claim 1, characterized in that a plurality of inner convex parts extend inwards from the inner surface of the soft rubber retainer ring, and the inner convex parts make contact with the outer surface of the inner container; a plurality of outer convex parts extend outwards from the outer surface of soft rubber retainer ring, and the outer convex parts make contact with the inner surface of the plastic jacket.",
"3.The anti-breakage and anti-scald bottle according to claim 1, characterized in that the inner container is a glass inner container, a ceramic inner container or a purple clay inner container.",
"4.The anti-breakage and anti-scald bottle according to claim 1, characterized in that a circular wristlet is arranged at the top of the bottle cap.",
"5.The anti-breakage and anti-scald bottle according to claim 1, characterized in that n-shaped protrusions are arranged on the outer surface of the fixed sleeve.",
"6.The anti-breakage and anti-scald bottle according to claim 1, characterized in that the plastic jacket is a transparent jacket.",
"7.The anti-breakage and anti-scald bottle according to claim 5, characterized in that a temperature-sensitive ink layer is printed on the outer surface of the inner container.",
"8.The anti-breakage and anti-scald bottle according to claim 1, characterized in that a signing area is arranged on the outer surface of the inner container."
],
[
"<SOH> BACKGROUND OF THE INVENTION <EOH>"
],
[
"<SOH> BRIEF SUMMARY OF THE INVENTION <EOH>For overcoming the defects of the prior art, the invention aims to provide an anti-breakage and anti-scald bottle which is good in breakage resistance, not prone to scalding the hands, safe, reliable, attractive and practical.",
"According to the technical scheme of the invention, an anti-breakage and anti-scald bottle comprises an inner container and a plastic jacket arranged outside the inner container in a sleeving mode, wherein a soft rubber retainer ring is arranged at the inner bottom of the plastic jacket, and the bottom end of the inner container is clamped on the soft rubber retainer ring; an opening of the plastic jacket is connected with a fixed sleeve in a threaded mode, the neck of the fixed sleeve abuts against the periphery of an opening of the inner container, a soft rubber ring is fixedly arranged on the inner surface of the neck of the fixed sleeve and makes contact with the opening of the inner container, and a top opening of the fixed sleeve is sealed and covered with a bottle cap.",
"As a preferred scheme, a plurality of inner convex parts extend inwards from the inner surface of the soft rubber retainer ring, and the inner convex parts make contact with the outer surface of the inner container; a plurality of outer convex parts extend outwards from the outer surface of soft rubber retainer ring, and the outer convex parts make contact with the inner surface of the plastic jacket.",
"As a preferred scheme, the inner container is a glass inner container, a ceramic inner container or a purple clay inner container.",
"As a preferred scheme, a circular wristlet is arranged at the top of the bottle cap.",
"As a preferred scheme, n-shaped protrusions are arranged on the outer surface of the fixed sleeve.",
"As a preferred scheme, the plastic jacket is a transparent jacket.",
"As a preferred scheme, a temperature-sensitive ink layer is printed on the outer surface of the inner container.",
"As a preferred scheme, a signing area is arranged on the outer surface of the inner container.",
"According to the anti-breakage and anti-scald bottle of the invention, the plastic jacket is arranged outside the inner container in the sleeving mode, the soft rubber retainer ring is arranged at the inner bottom of the plastic jacket, the fixed sleeve is arranged at the opening of the plastic jacket, the inner container is clamped between the soft rubber retainer ring and the neck of the fixed sleeve, the soft rubber ring making contact with the opening of the inner container is arranged on the inner surface of the neck of the fixed sleeve, in this way, when the bottle is impacted by a large external force, the plastic jacket can effectively prevent the inner container from being damaged by the collision or being broken, the soft rubber retainer ring and the soft rubber ring can fix the inner container and can also achieve a good buffering effect, and thus the breakage resistance of the bottle is greatly improved; in addition, when hot water is contained in the inner container, the plastic jacket can insulate heat, and thus the hands of a user are protected against scalds when the user holds the bottle.",
"The anti-breakage and anti-scald bottle of the invention has the advantages of being good in breakage resistance, not prone to scalding hands, safe and reliable."
],
[
"BACKGROUND OF THE INVENTION Technical Field The invention relates to water bottles, in particular to an anti-breakage and anti-scald bottle good in breakage resistance, not prone to scalding hands, safe, reliable, attractive and practical.",
"Description of Related Art Water bottles are daily necessities in wide use and are generally used for containing water or other liquid and usually carried with people so that people can drink water conveniently.",
"Existing water bottles are made of ceramic or glass or plastic, water bottles made of ceramic and glass are prone to being damaged by collisions or being broken, water bottles made of rubber are not prone to being damaged by collisions or being broken, but not suitable for containing high-temperature liquid, and consequentially, the increasing using requirements of people cannot be met.",
"BRIEF SUMMARY OF THE INVENTION For overcoming the defects of the prior art, the invention aims to provide an anti-breakage and anti-scald bottle which is good in breakage resistance, not prone to scalding the hands, safe, reliable, attractive and practical.",
"According to the technical scheme of the invention, an anti-breakage and anti-scald bottle comprises an inner container and a plastic jacket arranged outside the inner container in a sleeving mode, wherein a soft rubber retainer ring is arranged at the inner bottom of the plastic jacket, and the bottom end of the inner container is clamped on the soft rubber retainer ring; an opening of the plastic jacket is connected with a fixed sleeve in a threaded mode, the neck of the fixed sleeve abuts against the periphery of an opening of the inner container, a soft rubber ring is fixedly arranged on the inner surface of the neck of the fixed sleeve and makes contact with the opening of the inner container, and a top opening of the fixed sleeve is sealed and covered with a bottle cap.",
"As a preferred scheme, a plurality of inner convex parts extend inwards from the inner surface of the soft rubber retainer ring, and the inner convex parts make contact with the outer surface of the inner container; a plurality of outer convex parts extend outwards from the outer surface of soft rubber retainer ring, and the outer convex parts make contact with the inner surface of the plastic jacket.",
"As a preferred scheme, the inner container is a glass inner container, a ceramic inner container or a purple clay inner container.",
"As a preferred scheme, a circular wristlet is arranged at the top of the bottle cap.",
"As a preferred scheme, n-shaped protrusions are arranged on the outer surface of the fixed sleeve.",
"As a preferred scheme, the plastic jacket is a transparent jacket.",
"As a preferred scheme, a temperature-sensitive ink layer is printed on the outer surface of the inner container.",
"As a preferred scheme, a signing area is arranged on the outer surface of the inner container.",
"According to the anti-breakage and anti-scald bottle of the invention, the plastic jacket is arranged outside the inner container in the sleeving mode, the soft rubber retainer ring is arranged at the inner bottom of the plastic jacket, the fixed sleeve is arranged at the opening of the plastic jacket, the inner container is clamped between the soft rubber retainer ring and the neck of the fixed sleeve, the soft rubber ring making contact with the opening of the inner container is arranged on the inner surface of the neck of the fixed sleeve, in this way, when the bottle is impacted by a large external force, the plastic jacket can effectively prevent the inner container from being damaged by the collision or being broken, the soft rubber retainer ring and the soft rubber ring can fix the inner container and can also achieve a good buffering effect, and thus the breakage resistance of the bottle is greatly improved; in addition, when hot water is contained in the inner container, the plastic jacket can insulate heat, and thus the hands of a user are protected against scalds when the user holds the bottle.",
"The anti-breakage and anti-scald bottle of the invention has the advantages of being good in breakage resistance, not prone to scalding hands, safe and reliable.",
"BRIEF DESCRIPTION OF THE SEVERAL VIEWS OF THE DRAWINGS FIG.",
"1 is a structural diagram of an embodiment of the invention; FIG.",
"2 is a structural breakdown diagram of the embodiment of the invention; FIG.",
"3 is a structural diagram of a soft rubber retainer ring in the embodiment of the invention; FIG.",
"4 is a structural diagram of a fixed sleeve and a soft rubber ring in the embodiment of the invention; and FIG.",
"5 is a structural diagram of an inner container covered with a cap when used independently in the embodiment of the invention.",
"DETAILED DESCRIPTION OF THE INVENTION A further detailed description of the invention is given with embodiments and accompanying drawings as follows.",
"As is shown in FIGS.",
"1-5, an anti-breakage and anti-scald bottle comprises an inner container 3 and a plastic jacket 2 arranged outside the inner container 3 in a sleeving mode, wherein a soft rubber retainer ring 1 is arranged at the inner bottom of the plastic jacket 2, and the bottom end of the inner container 3 is clamped on the soft rubber retainer ring 1; an opening of the plastic jacket 2 is connected with a fixed sleeve 5 in a threaded mode, the neck of the fixed sleeve 5 abuts against the periphery of an opening of the inner container 3, and a soft rubber ring 4 is fixedly arranged on the inner surface of the neck of the fixed sleeve 5 and makes contact with the opening of the inner container 3; a top opening of the fixed sleeve 5 is sealed and covered with a bottle cap 6, and the inner container is a glass inner container, a ceramic inner container or a purple clay inner container.",
"According to the anti-breakage and anti-scald bottle, the plastic jacket 2 is arranged outside the inner container 3 in the sleeving mode, the soft rubber retainer ring 1 is arranged at the inner bottom of the plastic jacket 2, the fixed sleeve 5 is arranged at the opening of the plastic jacket 2, the bottom of the inner container 3 is clamped on the soft rubber retainer ring 1, the top opening of the inner container 3 abuts against the top of the fixed sleeve 5, the soft rubber ring 4 making contact with the opening of the inner container 3 is arranged on the inner surface of the neck of the fixed sleeve 5, in this way, when the bottle is impacted by large external force, the plastic jacket 2 can effectively prevent the inner container 3 from being damaged by collisions or being broken, the soft rubber retainer ring 1 and the soft rubber ring 4 can fix the inner container 3 and can also achieve a good buffering effect, and thus the breakage resistance of the bottle is greatly improved; in addition, when hot water is contained in the inner container 3, the plastic jacket 2 can insulate heat, and thus hands are prevented from being scalded by the bottle; liquid at different temperatures can be contained in the plastic jacket 2 and the inner container 3, liquid in the inner container 3 is heated or cooled through heat transfer, and thus the bottle can be used more conveniently.",
"As is shown in FIG.",
"3, particularly for the anti-breakage and anti-scald bottle based on the above technical scheme in one embodiment, a plurality of inner convex parts 11 extend inwards from the inner surface of the soft rubber retainer ring 1, and the inner convex parts 11 make contact with the outer surface of the inner container 3; a plurality of outer convex parts 12 extend outwards from the outer surface of soft rubber retainer ring 1, and the outer convex parts 12 make contact with the inner surface of the plastic jacket 2; in this way, the soft rubber retainer ring 1 and the plastic jacket 2 make contact with the inner container 3 more tightly, the inner container 3 is fixed more firmly, and thus the breakage resistance of the inner container 3 is improved.",
"As is shown in FIG.",
"2, particularly for the anti-breakage and anti-scald bottle based on the above technical scheme in one embodiment, a circular wristlet 61 is arranged at the top of the bottle cap 6, and for holding the wristlet 61 conveniently, a decorative string can be threaded through the wristlet 61, and thus the water bottle can be carried conveniently.",
"As is shown in FIG.",
"4, particularly for the anti-breakage and anti-scald bottle based on the above technical scheme in one embodiment, n-shaped protrusions 51 are arranged on the outer surface of the fixed sleeve 5 so that the fixed sleeve 5 can be screwed off conveniently for taking out or placing in the inner container 3, accordingly, inner containers 3 in different colors can be conveniently adopted, and the attractiveness of the bottle is improved; the inner container 3 can also be matched with a cap after being taken out, the soft rubber retainer ring 1 in the plastic jacket 2 is taken out, and thus the anti-breakage and anti-scald bottle can be used as two bottles flexibly and conveniently.",
"As is shown in FIG.",
"1, particularly for the anti-breakage and anti-scald bottle based on the above technical scheme in one embodiment, the plastic jacket 2 is a transparent jacket so that liquid in the inner container 3 can be observed conveniently, liquid can be added in time when the amount of liquid in the inner container is small, and meanwhile, the attractiveness of the bottle is improved.",
"As is shown in FIG.",
"2, particularly for the anti-breakage and anti-scald bottle based on the above technical scheme in one embodiment, a temperature-sensitive ink layer is printed on the outer surface of the inner container 3, and thus the temperature of liquid in the inner container can be sensed in real time; when the temperature-sensitive ink layer is red, it indicates that liquid in the inner container is hot; when the temperature-sensitive ink layer is yellow, it indicates that the liquid in the inner container is warm; when the temperature-sensitive ink layer is blue, it indicates that liquid in the inner container is at the normal temperature; in this way, the interestingness and practicability of the anti-breakage and anti-scald bottle are improved.",
"As is shown in FIG.",
"2, particularly for the anti-breakage and anti-scald bottle based on the above technical scheme in one embodiment, a signing area is arranged on the outer surface of the inner container 3, characters in the signing area can be erased and changed, and the user can sign in the signing area, so that the bottle is prevented from being confused with other bottles or getting lost; characters used for expressing moods can also be written in the signing area, and thus the interestingness of the bottle is further improved.",
"Of course, in other embodiments, a transparent interlayer can be arranged on the plastic jacket 2, a photo of the user or a card with the name of the user is placed in the transparent interlayer, and thus the owner of the bottle can be recognized.",
"An illustration of the anti-breakage and anti-scald bottle of the invention is given above and used for assisting in understanding the invention, however, the execution modes of the invention are not limited to the above embodiments, and any equivalent substitute modes such as changes, modifications, substitutes, combinations and simplifications made without deviating from the principle of the invention are within the protection scope of the invention."
]
] |
Patent_15871130
|
[
[
"WRAPPING METHOD FOR COMMON MODE INDUCTOR",
"The present disclosure provides a wrapping method for the common mode inductor.",
"The common mode inductor includes a first coil winding and a second coil winding.",
"The wrapping method for a common mode inductor includes steps of: disposing two isolation blocking sheets at different positions of a magnetic core; wrapping the first coil winding around the magnetic core, wherein the first coil winding is divided into two wrapping areas by one of the isolation blocking sheets; wrapping the second coil winding around the magnetic core, wherein the second coil winding is divided into two wrapping areas by the other one of the isolation blocking sheets, wherein the first coil winding and the second coil winding are symmetrically wrapped."
],
[
"1.A wrapping method for a common mode inductor, wherein the common mode inductor comprises a first coil winding and a second coil winding, and the method comprises: disposing two isolation blocking sheets at different positions of a magnetic core; wrapping the first coil winding around the magnetic core, wherein the first coil winding is divided into two wrapping areas by one of the isolation blocking sheets; and wrapping the second coil winding around the magnetic core, wherein the second coil winding is divided into two wrapping areas by the other one of the isolation blocking sheets, wherein the first coil winding and the second coil winding are symmetrically wrapped, and after symmetrical wrapping of the two coil windings around the magnetic core, the method further comprises: taking off the isolation blocking sheets.",
"2.The method according to claim 1, wherein the isolation blocking sheets are magnetic or comprise a ferromagnetic material, and magnetic absorption force exists between the isolation blocking sheets and the magnetic core.",
"3.The method according to claim 1, wherein the isolation blocking sheets are of non magnetic materials, and the isolation blocking sheets are assembled to the magnetic core in a snap-fit manner, or adhered to the magnetic core.",
"4.The method according to claim 1, wherein the isolation blocking sheets have a “␣” shape or a “L” shape.",
"5.The method according to claim 1, wherein the isolation blocking sheets are of an integrated structure or are constructed by stacking a plurality of thin sheet structures.",
"6.The method according to claim 1, wherein the isolation blocking sheets have a thickness which is set depending on a size of an isolation gap to be formed.",
"7.The method according to claim 6, wherein the isolation blocking sheets have a thickness of 0.5 mm˜5 mm.",
"8.The method according claim 1, wherein the magnetic core is a closed-loop-shaped magnetic core or a closed-polygon-shaped magnetic core."
],
[
"<SOH> BACKGROUND <EOH>A switching power supply is a power supply which maintains a stable output voltage by controlling a ratio of on-to-off time of a switch.",
"Currently, switching power supply products are developing towards a direction of small type and high frequency, which results in difficulties in improvement of EMI noise in switching power supply products.",
"A common mode inductor, as one of main components for suppressing EMI noise in a switching power supply, self characters of which have obvious influence on EMI noise suppression.",
"As shown in FIG.",
"1 , an equivalent circuit diagram of a common mode inductor is illustrated.",
"As shown in FIG.",
"2 , a schematic structure diagram of a common mode inductor in conventional technologies is shown.",
"The common mode inductor mainly includes a closed magnetic core 102 and two coil windings 101 symmetrically wrapped around the closed magnetic core 101 .",
"However, the EMI noise suppression capability of the common mode inductor still needs to be enhanced, which hampers the development of switching power supplies towards a direction of small type and high frequency."
],
[
"<SOH> SUMMARY <EOH>The present disclosure provides a wrapping method for a common mode inductor in order to better form an isolation gap in coil windings.",
"Other properties and advantages of the present disclosure will become clear from the detailed description below, or may be partly appreciated by practice of the present disclosure.",
"According to an aspect of the present disclosure, a wrapping method for a common mode inductor is provided.",
"The common mode inductor includes a first coil winding and a second coil winding.",
"The method includes steps of: disposing two isolation blocking sheets at different positions of a magnetic core; wrapping the first coil winding around the magnetic core, wherein the first coil winding is divided into two wrapping areas by one of the isolation blocking sheets; and wrapping the second coil winding around the magnetic core, wherein the second coil winding is divided into two wrapping areas by the other one of the isolation blocking sheets.",
"The first coil winding and the second coil winding are symmetrically wrapped.",
"In an embodiment of the present disclosure, after symmetrical wrapping of the two coil windings around the magnetic core, the method further includes: taking off the isolation blocking sheets.",
"In an embodiment of the present disclosure, the isolation blocking sheets are magnetic or include a ferromagnetic material, and magnetic absorption force exists between the isolation blocking sheets and the magnetic core.",
"In an embodiment of the present disclosure, the isolation blocking sheets are of non magnetic materials, and the isolation blocking sheets are assembled to the magnetic core in a snap-fit manner, or adhered to the magnetic core.",
"In an embodiment of the present disclosure, the isolation blocking sheets have a “␣” shape or a “L” shape.",
"In an embodiment of the present disclosure, the isolation blocking sheets are of an integrated structure or are constructed by stacking a plurality of thin sheet structures.",
"In an embodiment of the present disclosure, the isolation blocking sheets have a thickness which is set depending on a size of an isolation gap to be formed.",
"In an embodiment of the present disclosure, the isolation blocking sheets have a thickness of 0.5 mm˜5 mm.",
"In an embodiment of the present disclosure, the magnetic core is a closed-loop-shaped magnetic core or a closed-polygon-shaped magnetic core.",
"In the wrapping method for a common mode inductor provided by embodiments of the present disclosure, an isolation blocking sheet is disposed at two different positions of the magnetic core in advance respectively; during the wrapping procedure, an isolation gap is formed in each coil winding by using the isolation blocking sheets, so as to divide each coil winding into two wrapping areas.",
"On one hand, during the wrapping procedure, the isolation blocking sheets may maintain the shape of the isolation gap to avoid deformation of the isolation gap, and the size of the isolation gap may be stably controlled by selecting the thicknesses of the isolation blocking sheets.",
"Thus, not only the EMI noise suppression capability of the common mode inductor may be improved, but also products properties become stable.",
"On the other hand, with the leading and assistance of the isolation blocking sheets, it is more convenient for wrapping operation, which brings benefits for increase of production efficiencies; and the isolation blocking sheets may be reused, which may reduce production costs of the common mode inductor."
],
[
"CROSS REFERENCE This application is a divisional application of U.S. application Ser.",
"No.",
"14/697,349, filed on Apr.",
"27, 2015, and is based upon and claims the benefit of priority from the U.S. application Ser.",
"No.",
"14/697,349, filed on Apr.",
"27, 2015 and the prior Chinese Patent Application No.",
"201410242191.2 filed on Jun.",
"3, 2014, entitled “SWITCHING POWER SUPPLY, EMI FILTER, COMMON MODE INDUCTOR AND WRAPPING METHOD FOR THE COMMON MODE INDUCTOR”, before Chinese State Intellectual Property Office, under 35 U.S.C.",
"§ 119.The content of the above prior Chinese Patent Application is incorporated herein by reference in its entirety.",
"TECHNICAL FIELD The present disclosure generally relates to the technical field of ElectroMagnetic Interference (EMI) suppression, and more particularly, to a wrapping method for a common mode inductor.",
"BACKGROUND A switching power supply is a power supply which maintains a stable output voltage by controlling a ratio of on-to-off time of a switch.",
"Currently, switching power supply products are developing towards a direction of small type and high frequency, which results in difficulties in improvement of EMI noise in switching power supply products.",
"A common mode inductor, as one of main components for suppressing EMI noise in a switching power supply, self characters of which have obvious influence on EMI noise suppression.",
"As shown in FIG.",
"1, an equivalent circuit diagram of a common mode inductor is illustrated.",
"As shown in FIG.",
"2, a schematic structure diagram of a common mode inductor in conventional technologies is shown.",
"The common mode inductor mainly includes a closed magnetic core 102 and two coil windings 101 symmetrically wrapped around the closed magnetic core 101.However, the EMI noise suppression capability of the common mode inductor still needs to be enhanced, which hampers the development of switching power supplies towards a direction of small type and high frequency.",
"SUMMARY The present disclosure provides a wrapping method for a common mode inductor in order to better form an isolation gap in coil windings.",
"Other properties and advantages of the present disclosure will become clear from the detailed description below, or may be partly appreciated by practice of the present disclosure.",
"According to an aspect of the present disclosure, a wrapping method for a common mode inductor is provided.",
"The common mode inductor includes a first coil winding and a second coil winding.",
"The method includes steps of: disposing two isolation blocking sheets at different positions of a magnetic core; wrapping the first coil winding around the magnetic core, wherein the first coil winding is divided into two wrapping areas by one of the isolation blocking sheets; and wrapping the second coil winding around the magnetic core, wherein the second coil winding is divided into two wrapping areas by the other one of the isolation blocking sheets.",
"The first coil winding and the second coil winding are symmetrically wrapped.",
"In an embodiment of the present disclosure, after symmetrical wrapping of the two coil windings around the magnetic core, the method further includes: taking off the isolation blocking sheets.",
"In an embodiment of the present disclosure, the isolation blocking sheets are magnetic or include a ferromagnetic material, and magnetic absorption force exists between the isolation blocking sheets and the magnetic core.",
"In an embodiment of the present disclosure, the isolation blocking sheets are of non magnetic materials, and the isolation blocking sheets are assembled to the magnetic core in a snap-fit manner, or adhered to the magnetic core.",
"In an embodiment of the present disclosure, the isolation blocking sheets have a “␣” shape or a “L” shape.",
"In an embodiment of the present disclosure, the isolation blocking sheets are of an integrated structure or are constructed by stacking a plurality of thin sheet structures.",
"In an embodiment of the present disclosure, the isolation blocking sheets have a thickness which is set depending on a size of an isolation gap to be formed.",
"In an embodiment of the present disclosure, the isolation blocking sheets have a thickness of 0.5 mm˜5 mm.",
"In an embodiment of the present disclosure, the magnetic core is a closed-loop-shaped magnetic core or a closed-polygon-shaped magnetic core.",
"In the wrapping method for a common mode inductor provided by embodiments of the present disclosure, an isolation blocking sheet is disposed at two different positions of the magnetic core in advance respectively; during the wrapping procedure, an isolation gap is formed in each coil winding by using the isolation blocking sheets, so as to divide each coil winding into two wrapping areas.",
"On one hand, during the wrapping procedure, the isolation blocking sheets may maintain the shape of the isolation gap to avoid deformation of the isolation gap, and the size of the isolation gap may be stably controlled by selecting the thicknesses of the isolation blocking sheets.",
"Thus, not only the EMI noise suppression capability of the common mode inductor may be improved, but also products properties become stable.",
"On the other hand, with the leading and assistance of the isolation blocking sheets, it is more convenient for wrapping operation, which brings benefits for increase of production efficiencies; and the isolation blocking sheets may be reused, which may reduce production costs of the common mode inductor.",
"BRIEF DESCRIPTION OF THE DRAWINGS The above and other features and advantages of the present disclosure will become clear from detailed description of exemplary embodiments with reference to accompanying drawings.",
"FIG.",
"1 is an equivalent circuit diagram of a common mode inductor; FIG.",
"2 is a schematic structure diagram of a common mode inductor in conventional technologies; FIG.",
"3 is a schematic structure diagram of a common mode inductor to be achieved by the present disclosure; FIG.",
"4 is a schematic flowchart showing a wrapping method for a common mode inductor according to an exemplary embodiment of the present disclosure; FIG.",
"5 is a schematic structure diagram of an isolation blocking sheet according to an exemplary embodiment of the present disclosure; FIG.",
"6 is a schematic structure diagram after an assemblage of the isolation blocking sheet in FIG.",
"5 with a closed magnetic core; FIG.",
"7 is a schematic structure diagram after a wrapping around the closed magnetic core in FIG.",
"6; and FIG.",
"8 is a schematic structure diagram of a common mode inductor prepared using the wrapping method for the common mode inductor of the present disclosure.",
"DESCRIPTION OF REFERENCE NUMBERS 101: coil winding 1011: first wrapping area 1012: second wrapping area 101A: first coil winding 101B: second coil winding 102: closed magnetic core 103: isolation gap 104: isolation blocking sheet H: thickness of the isolation blocking sheet W: opening width of the isolation blocking sheet S101˜S103: steps DETAILED DESCRIPTION Now, exemplary implementations will be described more comprehensively with reference to the accompanying drawings.",
"However, the exemplary implementations may be carried out in various manners, and shall not be interpreted as being limited to the implementations set forth herein; instead, providing these implementations will make the present disclosure more comprehensive and complete and will fully convey the conception of the exemplary implementations to the ordinary skills in this art.",
"In the drawings, thicknesses of areas and layers are exaggerated for the sake of clarity.",
"Throughout the drawings similar reference numbers indicate the same or similar structures, and their detailed description will be omitted.",
"The features, structures or characteristics described herein may be combined in one or more embodiments in any suitable manner.",
"In the following description, many specific details are provided to facilitate sufficient understanding of the embodiments of the present disclosure.",
"However, the ordinary skills in this art will appreciate that the technical solutions in the present disclosure may be practiced without one or more of the specific details, or by employing other methods, elements, materials and so on.",
"In other conditions, well-known structures, materials or operations are not shown or described in detail so as to avoid confusion of respective aspects of the present disclosure.",
"In order to improve EMI noise suppression capabilities of a common mode inductor, an embodiment relates to forming an isolation gap in every coil winding, i.e., dividing one coil winding into two wrapping areas.",
"That is to say, finally, the common mode inductor structure shown in FIG.",
"3 needs to be achieved, in which every coil winding 101 includes a first wrapping area 1011 and a second wrapping area 1012 which are divided by an isolation gap 103.In order to achieve the common mode inductor structure shown in FIG.",
"3, the only method is to reserve an isolation gap by experience of workers after they have wrapped the first wrapping area 1011, and then the second wrapping area 1012 is wrapped.",
"However, during the wrapping procedure, wires may become saggy and thus the reserved isolation gap may deform as the advancing of the wrapping procedure and finally disappear.",
"Thus it is only increasing operation steps, but no benefit may be brought to improvement of the EMI noise suppression capability of the common mode inductor.",
"Or, even if the reserved isolation gap may be maintained after completion of the wrapping, it is difficult to maintain the size of this isolation gap to be in consistency with its original size (the original size is reserved only by experience and may not be set accurately), i.e., the size of the isolation gap may not be controlled, resulting in instability in product properties.",
"In the exemplary embodiment, a wrapping method for a common mode inductor is provided at first.",
"As shown in FIGS.",
"4˜8, the wrapping method for a common mode inductor mainly includes the following steps.",
"In step S101, two isolation blocking sheets are disposed at different positions of a magnetic core.",
"In the exemplary embodiment, explanation will be made using a closed magnetic core as an example.",
"However, the magnetic core may also be an unclosed magnetic core, and the present disclosure is not limited to this.",
"In step S102, a first coil winding 101A is wrapped around the magnetic core 102, wherein the first coil winding 101A is divided into two wrapping areas by one of the separation blocking sheets; a second coil winding 101B is wrapped around the magnetic core 102, wherein the second coil winding 101B is divided into two wrapping areas by the other one of the separation blocking sheets.",
"The second coil winding 101B and the first coil winding 101A are symmetrically wrapped.",
"It shall be noted that the present disclosure does not impose specific limitations on the wrapping sequence of the first coil winding 101A and the second coil winding 101B.",
"In addition to the above steps, the method further includes Step S103.In step S103, the isolation blocking sheets are taken down.",
"It shall be noted that not taking down the isolation blocking sheets is also applicable, which depends on actual conditions.",
"The above steps will be described in detail with reference to FIGS.",
"5˜8.FIG.",
"5 is a schematic structure diagram of an isolation blocking sheet according to an exemplary embodiment of the present disclosure.",
"As shown in FIG.",
"5, an isolation blocking sheet 104 has a “␣” shape or other similar shapes such as “U” shape or a “C” shape or a swallow tail shape.",
"An opening width W of the isolation blocking sheet is substantially the same as a thickness of the closed magnetic core, and thus the isolation blocking sheet 104 may be assembled to the closed magnetic core in a snap-fit manner.",
"As shown in FIG.",
"6, it is a schematic structure diagram after an assemblage of the isolation blocking sheet 104 with the closed magnetic core 102 in a snap-fit manner.",
"It shall be noted that although the closed magnetic core 102 shown is a closed-ring-loop-shaped magnetic core, the present disclosure is not limited to this and a closed-polygon-shaped (e.g., rectangular-shaped) magnetic core or a closed magnetic core 102 having other shapes are also applicable.",
"The material of the isolation blocking sheet 104 may be non magnetic material (such as organic material or alloy material) which may be coupled to the closed magnetic core 102 in a snap-fit manner or may be adhered to the closed magnetic core 102.In addition, considering the magnetic material of the closed magnetic core 102, the isolation blocking sheet 104 may also be formed of a magnetic material, i.e., the isolation blocking sheet 104 is magnetic.",
"Indeed, the isolation blocking sheet 104 may also be made by ferromagnetic material.",
"Thus, magnetic absorption force exists between the isolation blocking sheet 104 and the closed magnetic core 102, such that the isolation blocking sheet 104 may be fitted onto the closed magnetic core 102 by using this magnetic absorption force.",
"Thus, the shape of the isolation blocking sheet 104 may be not limited to the above “␣” shape, but may also be “L” shapes and so on.",
"For example, when the isolation blocking sheet has a relatively large thickness H, due to a large contact area with the closed magnetic core 102, the applied force is more sufficient.",
"Thus, “L” shapes may be selected.",
"When the isolation blocking sheet has a relatively small thickness H, a “U” shape may be selected to fix the isolation blocking sheet 104 by using a snap-fit force and a magnetic absorption force.",
"The thickness H of the isolation blocking sheet may be set depending on a size of the isolation gap to be formed.",
"For example, a width of the isolation gap may be set as 0.5 mm˜5 mm.",
"For example, if a width of the isolation gap to be formed is 1 mm, the thickness H of the isolation blocking sheet needs to be set as 1 mm; if a width of the isolation gap to be formed is 2 mm, the thickness H of the isolation blocking sheet needs to be set as 2 mm, and so on.",
"The isolation blocking sheet 104 may be of an integrated structure, and the thickness of the isolation blocking sheet 104 may be determined when the isolation blocking sheet 104 is molded; or, for convenient adjustment of the thickness of the isolation blocking sheet 104, the isolation blocking sheet 104 may be constructed by stacking a plurality of thin sheet structures.",
"For example, when a thickness of every thin sheet structure is 0.5 mm and a 2 mm-isolation blocking sheet 104 is needed, it only needs to stack 4 such thin sheet structures together.",
"The connection manner between such thin sheet structures may be an adhesive connection, or may be a magnetic connection, and the present disclosure does not impose special limitations on this.",
"After the isolation blocking sheets 104 is disposed at preset positions of the closed magnetic core 102, one coil winding may be wrapped around two half-rings of the closed magnetic core 102 respectively, and the wire diameter and the number of turns of the two coil windings are the same.",
"As shown in FIG.",
"7, a schematic structure diagram after a wrapping is shown.",
"It can be seen that, during the wrapping procedure, the isolation blocking sheets 104 may maintain the shape of the isolation gap so as to avoid deformation of the isolation gap, and the size of the isolation gap may be stably controlled by selection of the thicknesses of the isolation blocking sheets 104.In addition, with the leading and assistance of the isolation blocking sheets 104, it is more convenient for wrapping operation, which brings benefits for increase of production efficiencies.",
"As shown in FIG.",
"8, after completion of wrapping, the isolation blocking sheets 104 may be taken off, and then an isolation gap 103 having a stable shape and a preset size is finally left.",
"Thus, not only the EMI noise suppression capability of the common mode inductor is increased, but also stability of product property is obtained.",
"Indeed, the isolation blocking sheets 104 may not be taken from the closed magnetic core 102 after completion of wrapping, so as to further ensure that the formed isolation gap 103 does not deform during usage of the common mode inductor and thus reliability of product performance is increased.",
"In an exemplary embodiment, a common mode inductor prepared by the above wrapping method for the common mode inductor is provided.",
"According to the description of the above wrapping method for the common mode inductor, it can be known that, an isolation gap is formed in every coil winding of the common mode inductor, and the shape and the size of the isolation gap are in consistence with preset shape and size.",
"Thus, by this common mode inductor, the EMI noise suppression capability of the common mode inductor may be improved and stable product properties may be achieved.",
"In an exemplary embodiment, an EMI filter is also provided.",
"The EMI filter includes an anti-EMI filter circuit composed of inductors, capacitors and resistors which are coupled in series or parallel.",
"The inductors include the above common mode inductor.",
"Since the above common mode inductor has enhanced EMI noise suppression capability, it is possible to provide better EMI suppression capability for the EMI filter, and less dependency on other EMI suppression components may be achieved (e.g., the number of capacitors in the integrated filter circuit may be reduced and the capacitance amount may be decreased).",
"Consequently, the EMI filter may have a simple structure design, such that space and production costs may be saved, which brings benefits for development of the EMI filter towards a direction of small type and high frequency.",
"In an exemplary embodiment, a switching power supply is provided.",
"The switching power supply may be any power supply which is achieved by controlling on and off of a switch.",
"For example, the switching power supply may be an Uninterruptible Power System (UPS), a communication power supply or a welding power supply, etc.",
"One of the biggest distinctions between the switching power supply in the present disclosure and that in the conventional technologies is that the switching power supply in the present disclosure includes the above common mode inductor.",
"Since the above common mode inductor has enhanced EMI noise suppression capability, it is possible to provide better EMI suppression capability for the switching power supply, and less dependency on other EMI suppression components may be achieved (e.g., the number of capacitors in the integrated switching power supply may be reduced and the capacitance amount may be decreased).",
"Consequently, the switching power supply may have a simple structure design, such that space and production costs may be saved, which brings benefits for development of the switching power supply towards a direction of small type and high frequency.",
"The present disclosure is described with the above exemplary embodiments which are only examples for implementing the present disclosure.",
"It shall be pointed out that the disclosed embodiments do not limit the scope of the present disclosure.",
"Instead, modifications and variations without departing from the spirit and scope of the present disclosure fall into the protection scope of the present disclosure."
]
] |
Patent_15871134
|
[
[
"DEVICE AND METHOD FOR SUPERVISING BIOFILM CULTURING",
"A device for supervising biofilm culturing, the device including: a fixed seat including an upper end; a supervision chamber; two ultrasonic sensing probes; a first mounting chamber; a second mounting chamber disposed between the fixed seat and the supervision chamber; an ultrasonic generator; an oscilloscope; and a controller.",
"The first and second mounting chambers are disposed at two opposite ends of the supervision chamber, respectively.",
"The two ultrasonic sensing probes are disposed in the first and second mounting chambers, respectively.",
"The second mounting chamber is connected to the upper end of the fixed seat.",
"The two ultrasonic sensing probes each are respectively connected to the ultrasonic generator, the oscilloscope, and the controller successively."
],
[
"1.A device for supervising biofilm culturing, the device comprising: a fixed seat comprising an upper end; a supervision chamber; two ultrasonic sensing probes; a first mounting chamber; a second mounting chamber disposed between the fixed seat and the supervision chamber; an ultrasonic generator; an oscilloscope; and a controller; wherein the first and second mounting chambers are disposed at two opposite ends of the supervision chamber, respectively; the two ultrasonic sensing probes are disposed in the first and second mounting chambers, respectively; the second mounting chamber is connected to the upper end of the fixed seat; and the two ultrasonic sensing probes each are respectively connected to the ultrasonic generator, the oscilloscope, and the controller successively.",
"2.The device of claim 1, wherein the fixed seat comprises a circular pedestal and a semi-open cylinder.",
"3.The device of claim 1, wherein the supervision chamber is transparent and comprises a side wall and a bottom wall; the side wall comprises a water inlet and a water outlet which is located higher than the water inlet; and the bottom wall comprises a groove for receiving a filler film.",
"4.The device of claim 2, wherein the supervision chamber is transparent and comprises a side wall and a bottom wall; the side wall comprises a water inlet and a water outlet which is located higher than the water inlet; and the bottom wall comprises a groove for receiving a filler film.",
"5.The device of claim 3, wherein the first mounting chamber is disposed on the supervision chamber; the first mounting chamber comprises a cylindrical holder and a chamber for accommodating one of the two ultrasonic sensing probes; the chamber for accommodating the one of the two ultrasonic sensing probes is disposed on an upper surface of the cylindrical holder; a first fixation device is disposed in the chamber to fix the one of the two ultrasonic sensing probes; the one of the two ultrasonic sensing probes is fixed on a side wall of the first fixation device; the cylindrical holder comprises a side wall and a plurality of slots disposed on the side wall; the slots correspond to the water inlet and the water outlet of the supervision chamber; the second mounting chamber comprises a second fixation device for accommodating the other of the two ultrasonic sensing probes; and the other of the two ultrasonic sensing probes is fixed on a side wall of the second fixation device.",
"6.The device of claim 4, wherein the first mounting chamber is disposed on the supervision chamber; the first mounting chamber comprises a cylindrical holder and a chamber for accommodating one of the two ultrasonic sensing probes; the chamber for accommodating the one of the two ultrasonic sensing probes is disposed on an upper surface of the cylindrical holder; a first fixation device is disposed in the chamber to fix the one of the two ultrasonic sensing probes; the one of the two ultrasonic sensing probes is fixed on a side wall of the first fixation device; the cylindrical holder comprises a side wall and a plurality of slots disposed on the side wall; the slots correspond to the water inlet and the water outlet of the supervision chamber 4; the second mounting chamber comprises a second fixation device for accommodating the other of the two ultrasonic sensing probes; and the other of the two ultrasonic sensing probes is fixed on a side wall of the second fixation device.",
"7.The device of claim 5, wherein the two ultrasonic sensing probes are coated with a coupling agent and then fixed on sides wall of the first and second fixation devices.",
"8.The device of claim 6, wherein the two ultrasonic sensing probes are coated with a coupling agent and then fixed on the sides wall of the first and second fixation devices.",
"9.The device of claim 5, wherein the cylindrical holder of the first mounting chamber comprises a bottom edge, and an annular groove and a gasket are disposed on the bottom edge; the first mounting chamber and the supervision chamber are fixed and sealed using the annular groove and the gasket.",
"10.The device of claim 6, wherein the cylindrical holder of the first mounting chamber comprises a bottom edge, and an annular groove and a gasket are disposed on the bottom edge; the first mounting chamber and the supervision chamber are fixed and sealed using the annular groove and the gasket.",
"11.A method for supervising biofilm culturing, the method comprising: 1) sampling a mixture of target muddy water, and homogenizing the mixture; 2) filtering the homogenized mixture of muddy water, and collecting a filtrate resulting therefrom; 3) dividing the filtrate into two parts, labeling one of the two parts as Filtrate A; filtering the other part of the two parts using a filter membrane to yield another filtrate which is labeled as Filtrate B; 4) assembling the device for supervising biofilm culturing of claim; 5) fixing a first filler film in the supervision chamber; 6) pumping the Filtrate A into the supervision chamber via a water inlet thereof; 7) starting the ultrasonic generator when the Filtrate A is about to overflow from a water outlet of the supervision chamber, turning on an ultrasonic reflection mode, adjusting working parameters of the ultrasonic generator to preset values, opening the oscilloscope, and on-line supervising the biofilm culturing on the first filler film through the controller; 8) substituting the Filtrate B for the Filtrate A, and repeating 6)-7); 9) recording a time with regard to the biofilm culturing on the first filler film according to an oscillogram on the oscilloscope; 10) replacing the first filler film using a second filler film, repeating 5)-9), and recording a time with regard to the biofilm culturing on the second filler film; and 11) based on the observation results in 9-10), selecting a filler with which the biofilm culturing is the quickest to use in a target water body for sewage treatment.",
"12.The method of claim 11, wherein in 1), the mixture is homogenized for 10-15 times.",
"13.The method of claim 11, wherein in 2), the homogenized mixture of muddy water is filtered using an 8-10 μm filter membrane; in 3), the other part of the two parts is filtered using a 0.22-0.45 μm filter membrane.",
"14.The method of claim 11, wherein in 6), a flow rate of the Filtrate A into the supervision chamber is 0.5-10 mL/min.",
"15.The method of claim 11, wherein in 7), the working parameters of the ultrasonic generator 9 are as follows: repetition frequency, 15-25 Hz; pulse resistance, 30-60Ω; pulse voltage, 200-400 V; gain, 60 dB; high-pass filtering, 0.03-0.1 mHz; and low-pass filtering, 1-3 mHz."
],
[
"<SOH> BACKGROUND OF THE INVENTION <EOH>"
],
[
"<SOH> SUMMARY OF THE INVENTION <EOH>In view of the above-described problems, it is one objective of the invention to provide a device and method for supervising biofilm culturing that is effective and efficient in matching a filler and a target water body for biofilm culturing for sewage treatment.",
"To achieve the above objectives, in accordance with one embodiment of the invention, there is provided a device for supervising biofilm culturing, the device comprising: a fixed seat comprising an upper end; a supervision chamber; two ultrasonic sensing probes; a first mounting chamber; a second mounting chamber disposed between the fixed seat and the supervision chamber; an ultrasonic generator; an oscilloscope; and a controller.",
"The first and second mounting chambers are disposed at two opposite ends of the supervision chamber, respectively; the two ultrasonic sensing probes are disposed in the first and second mounting chambers, respectively; the second mounting chamber is connected to the upper end of the fixed seat; and the two ultrasonic sensing probes each are respectively connected to the ultrasonic generator, the oscilloscope, and the controller successively.",
"In a class of this embodiment, the fixed seat comprises a circular pedestal and a semi-open cylinder.",
"In a class of this embodiment, the supervision chamber is transparent and comprises a side wall and a bottom wall; the side wall comprises a water inlet and a water outlet which is located higher than the water inlet; and the bottom wall comprises a groove for receiving a filler film.",
"In a class of this embodiment, the first mounting chamber is disposed on the supervision chamber; the first mounting chamber comprises a cylindrical holder and a chamber for accommodating one of the two ultrasonic sensing probes; the chamber for accommodating the one of the two ultrasonic sensing probes is disposed on an upper surface of the cylindrical holder; a first fixation device is disposed in the chamber to fix the one of the two ultrasonic sensing probes; the one of the two ultrasonic sensing probes is fixed on a side wall of the first fixation device; the cylindrical holder comprises a side wall and a plurality of slots disposed on the side wall; the slots correspond to the water inlet and the water outlet of the supervision chamber; the second mounting chamber comprises a second fixation device for accommodating the other of the two ultrasonic sensing probes; and the other of the two ultrasonic sensing probes is fixed on a side wall of the second fixation device.",
"In a class of this embodiment, the two ultrasonic sensing probes are coated with a coupling agent and then fixed on sides wall of the first and second fixation devices.",
"In a class of this embodiment, the cylindrical holder of the first mounting chamber comprises a bottom edge, and an annular groove and a gasket are disposed on the bottom edge; the first mounting chamber and the supervision chamber are fixed and sealed using the annular groove and the gasket.",
"In another aspect, the disclosure provides a method for supervising biofilm culturing, the method comprising: 1) sampling a mixture of target muddy water, and homogenizing the mixture; 2) filtering the homogenized mixture of muddy water, and collecting a filtrate resulting therefrom; 3) dividing the filtrate into two parts, labeling one of the two parts as Filtrate A; filtering the other part of the two parts using a filter membrane to yield another filtrate which is labeled as Filtrate B; 4) assembling the device for supervising biofilm culturing of claim; 5) fixing a first filler film in the supervision chamber; 6) pumping the Filtrate A into the supervision chamber via a water inlet thereof; 7) starting the ultrasonic generator when the Filtrate A is about to overflow from a water outlet of the supervision chamber, turning on an ultrasonic reflection mode, adjusting working parameters of the ultrasonic generator to preset values, opening the oscilloscope, and on-line supervising the biofilm culturing on the first filler film through the controller; 8) substituting the Filtrate B for the Filtrate A, and repeating 6)-7); 9) recording a time with regard to the biofilm culturing on the first filler film according to an oscillogram on the oscilloscope; 10) replacing the first filler film using a second filler film, repeating 5)-9), and recording a time with regard to the biofilm culturing on the second filler film; and 11) based on the observation results in 9-10), selecting a filler with which the biofilm culturing is the quickest to use in a target water body for sewage treatment.",
"In a class of this embodiment, in 1), the mixture is homogenized for 10-15 times.",
"In a class of this embodiment, in 2), the homogenized mixture of muddy water is filtered using an 8-10 μm filter membrane; in 3), the other part of the two parts is filtered using a 0.22-0.45 μm filter membrane.",
"In a class of this embodiment, in 6), a flow rate of the Filtrate A into the supervision chamber is 0.5-10 mL/min.",
"In a class of this embodiment, in 7), the working parameters of the ultrasonic generator 9 are as follows: repetition frequency, 15-25 Hz; pulse resistance, 30-60Ω; pulse voltage, 200-400 V; gain, 60 dB; high-pass filtering, 0.03-0.1 mHz; and low-pass filtering, 1-3 mHz.",
"Advantages of the device and method for supervising biofilm culturing of the disclosure are summarized as follows.",
"1.Through the device of the disclosure, different water bodies and fillers are employed to perform matching experiments, and based on the experimental results to select optimal filler for biofilm culturing.",
"So, there is no need to develop special membranes for special water bodies, saving the resources and reducing the costs.",
"2.The device for supervising biofilm culturing of the disclosure comprises a main body, a built-in cylinder, ultrasonic sensing probes, a signal generator, an oscilloscope, and a controller, so it is simple, easy to install and operate.",
"3.The supervision chamber is transparent and comprises two mounting chambers for accommodating filler films, the filler films are easy to replace, so the experimental operation is efficient.",
"4.The two ultrasonic sensing probes are coated with a coupling agent and then fixed on sides wall of the first and second fixation devices using the screws, which greatly improves the accuracy of ultrasonic detection.",
"5.The basic operation process of the method is: pretreatment of sludge—installation of filler film—on-line supervision of the biofilm culturing on the first filler film—selection of a filler with which the biofilm culturing is the quickest to use in a target water body for sewage treatment.",
"The method of the disclosure aims at finding an optimum matching of a filler and a water body, no need to develop special membranes for special water bodies, saving the resources and reducing the costs.",
"The monitoring device is an on-line, non-contact and real-time non-destructive monitoring system.",
"The monitoring is timesaving, efficient, accurate, inexpensive, safe and environmentally friendly.",
"6.The detection device of the invention is connected to an oscilloscope and controller, which can observe the data directly.",
"It is on online, real-time, non-contact, direct, and non-destructive detection, with short detection time and high efficiency.",
"7.The device has good matching accuracy, low cost, and safe operation, can greatly save the space and time of different biofilm culturing tests in different water bodies, and provides reliable biofilm culturing schemes for difficult water bodies."
],
[
"CROSS-REFERENCE TO RELAYED APPLICATIONS This application is a continuation-in-part of International Patent Application No.",
"PCT/CN2017/095850 with an international filing date of Aug. 3, 2017, designating the United States, now pending, and further claims foreign priority benefits to Chinese Patent Application No.",
"201610984895.6 filed Nov. 9, 2016.The contents of all of the aforementioned applications, including any intervening amendments thereto, are incorporated herein by reference.",
"Inquiries from the public to applicants or assignees concerning this document or the related applications should be directed to: Matthias Scholl P C., Attn.",
": Dr. Matthias Scholl Esq., 245 First Street, 18th Floor, Cambridge, Mass.",
"02142.BACKGROUND OF THE INVENTION Field of the Invention The disclosure relates to a device and method for supervising biofilm culturing.",
"Description of the Related Art In the present, biofilms are widely used for sewage treatment.",
"However, subject to the complexity of water bodies and the variety of the bacteria in the sludge, the biofilm culturing performance of the fillers in different water bodies varies greatly.",
"Conventionally, the fillers are directly added to a water body for biofilm culturing.",
"The biofilm culturing process is laborious, time-consuming, and is likely to fail.",
"SUMMARY OF THE INVENTION In view of the above-described problems, it is one objective of the invention to provide a device and method for supervising biofilm culturing that is effective and efficient in matching a filler and a target water body for biofilm culturing for sewage treatment.",
"To achieve the above objectives, in accordance with one embodiment of the invention, there is provided a device for supervising biofilm culturing, the device comprising: a fixed seat comprising an upper end; a supervision chamber; two ultrasonic sensing probes; a first mounting chamber; a second mounting chamber disposed between the fixed seat and the supervision chamber; an ultrasonic generator; an oscilloscope; and a controller.",
"The first and second mounting chambers are disposed at two opposite ends of the supervision chamber, respectively; the two ultrasonic sensing probes are disposed in the first and second mounting chambers, respectively; the second mounting chamber is connected to the upper end of the fixed seat; and the two ultrasonic sensing probes each are respectively connected to the ultrasonic generator, the oscilloscope, and the controller successively.",
"In a class of this embodiment, the fixed seat comprises a circular pedestal and a semi-open cylinder.",
"In a class of this embodiment, the supervision chamber is transparent and comprises a side wall and a bottom wall; the side wall comprises a water inlet and a water outlet which is located higher than the water inlet; and the bottom wall comprises a groove for receiving a filler film.",
"In a class of this embodiment, the first mounting chamber is disposed on the supervision chamber; the first mounting chamber comprises a cylindrical holder and a chamber for accommodating one of the two ultrasonic sensing probes; the chamber for accommodating the one of the two ultrasonic sensing probes is disposed on an upper surface of the cylindrical holder; a first fixation device is disposed in the chamber to fix the one of the two ultrasonic sensing probes; the one of the two ultrasonic sensing probes is fixed on a side wall of the first fixation device; the cylindrical holder comprises a side wall and a plurality of slots disposed on the side wall; the slots correspond to the water inlet and the water outlet of the supervision chamber; the second mounting chamber comprises a second fixation device for accommodating the other of the two ultrasonic sensing probes; and the other of the two ultrasonic sensing probes is fixed on a side wall of the second fixation device.",
"In a class of this embodiment, the two ultrasonic sensing probes are coated with a coupling agent and then fixed on sides wall of the first and second fixation devices.",
"In a class of this embodiment, the cylindrical holder of the first mounting chamber comprises a bottom edge, and an annular groove and a gasket are disposed on the bottom edge; the first mounting chamber and the supervision chamber are fixed and sealed using the annular groove and the gasket.",
"In another aspect, the disclosure provides a method for supervising biofilm culturing, the method comprising: 1) sampling a mixture of target muddy water, and homogenizing the mixture; 2) filtering the homogenized mixture of muddy water, and collecting a filtrate resulting therefrom; 3) dividing the filtrate into two parts, labeling one of the two parts as Filtrate A; filtering the other part of the two parts using a filter membrane to yield another filtrate which is labeled as Filtrate B; 4) assembling the device for supervising biofilm culturing of claim; 5) fixing a first filler film in the supervision chamber; 6) pumping the Filtrate A into the supervision chamber via a water inlet thereof; 7) starting the ultrasonic generator when the Filtrate A is about to overflow from a water outlet of the supervision chamber, turning on an ultrasonic reflection mode, adjusting working parameters of the ultrasonic generator to preset values, opening the oscilloscope, and on-line supervising the biofilm culturing on the first filler film through the controller; 8) substituting the Filtrate B for the Filtrate A, and repeating 6)-7); 9) recording a time with regard to the biofilm culturing on the first filler film according to an oscillogram on the oscilloscope; 10) replacing the first filler film using a second filler film, repeating 5)-9), and recording a time with regard to the biofilm culturing on the second filler film; and 11) based on the observation results in 9-10), selecting a filler with which the biofilm culturing is the quickest to use in a target water body for sewage treatment.",
"In a class of this embodiment, in 1), the mixture is homogenized for 10-15 times.",
"In a class of this embodiment, in 2), the homogenized mixture of muddy water is filtered using an 8-10 μm filter membrane; in 3), the other part of the two parts is filtered using a 0.22-0.45 μm filter membrane.",
"In a class of this embodiment, in 6), a flow rate of the Filtrate A into the supervision chamber is 0.5-10 mL/min.",
"In a class of this embodiment, in 7), the working parameters of the ultrasonic generator 9 are as follows: repetition frequency, 15-25 Hz; pulse resistance, 30-60Ω; pulse voltage, 200-400 V; gain, 60 dB; high-pass filtering, 0.03-0.1 mHz; and low-pass filtering, 1-3 mHz.",
"Advantages of the device and method for supervising biofilm culturing of the disclosure are summarized as follows.",
"1.Through the device of the disclosure, different water bodies and fillers are employed to perform matching experiments, and based on the experimental results to select optimal filler for biofilm culturing.",
"So, there is no need to develop special membranes for special water bodies, saving the resources and reducing the costs.",
"2.The device for supervising biofilm culturing of the disclosure comprises a main body, a built-in cylinder, ultrasonic sensing probes, a signal generator, an oscilloscope, and a controller, so it is simple, easy to install and operate.",
"3.The supervision chamber is transparent and comprises two mounting chambers for accommodating filler films, the filler films are easy to replace, so the experimental operation is efficient.",
"4.The two ultrasonic sensing probes are coated with a coupling agent and then fixed on sides wall of the first and second fixation devices using the screws, which greatly improves the accuracy of ultrasonic detection.",
"5.The basic operation process of the method is: pretreatment of sludge—installation of filler film—on-line supervision of the biofilm culturing on the first filler film—selection of a filler with which the biofilm culturing is the quickest to use in a target water body for sewage treatment.",
"The method of the disclosure aims at finding an optimum matching of a filler and a water body, no need to develop special membranes for special water bodies, saving the resources and reducing the costs.",
"The monitoring device is an on-line, non-contact and real-time non-destructive monitoring system.",
"The monitoring is timesaving, efficient, accurate, inexpensive, safe and environmentally friendly.",
"6.The detection device of the invention is connected to an oscilloscope and controller, which can observe the data directly.",
"It is on online, real-time, non-contact, direct, and non-destructive detection, with short detection time and high efficiency.",
"7.The device has good matching accuracy, low cost, and safe operation, can greatly save the space and time of different biofilm culturing tests in different water bodies, and provides reliable biofilm culturing schemes for difficult water bodies.",
"BRIEF DESCRIPTION OF THE DRAWINGS The invention is described hereinbelow with reference to the accompanying drawings, in which: FIG.",
"1 is an exploded view of a device for supervising biofilm culturing in accordance with one embodiment of the disclosure; FIG.",
"2A is a signal image of a first filler prior to biofilm culturing; FIG.",
"2B is a signal image of the first filler after 8 hours' biofilm culturing; FIG.",
"3A is a signal image of a second filler prior to biofilm culturing; and FIG.",
"3B is a signal image of the second filler after 8 hours' biofilm culturing.",
"In the drawings, the following reference numbers are used: 1.fixed seat; 2.first mounting chamber; 2′.",
"second mounting chamber; 3.Filler film; 4.Supervision chamber; 5.Water inlet; 6.Water outlet; 7.Ultrasonic sensing probe; 8.Screw; 9.Ultrasonic generator; 10.Oscilloscope; 11.Controller.",
"DETAILED DESCRIPTION OF THE EMBODIMENTS For further illustrating the invention, experiments detailing a device and method for supervising biofilm culturing are described below.",
"As shown in FIG.",
"1, a device for supervising biofilm culturing, comprises: a fixed seat 1 comprising an upper end; a supervision chamber 4; two ultrasonic sensing probes 7; a first mounting chamber 2; a second mounting chamber 2′ disposed between the fixed seat 1 and the supervision chamber 4; an ultrasonic generator 9; an oscilloscope 10; and a controller 11.The fixed seat 1 comprises a circular pedestal and a semi-open cylinder.",
"The supervision chamber 4 is transparent and comprises a side wall and a bottom wall; the side wall comprises a water inlet 5 and a water outlet 6 which is located higher than the water inlet 5; and the bottom wall comprises a groove for receiving a filler film 3.The first and second mounting chambers are disposed at two opposite ends of the supervision chamber 4, respectively; the two ultrasonic sensing probes 7 are disposed in the first and second mounting chambers, respectively; the second mounting chamber 2′ is connected to the upper end of the fixed seat 1; and the two ultrasonic sensing probes 7 each are respectively connected to the ultrasonic generator 9, the oscilloscope 10, and the controller 11 successively.",
"The first mounting chamber 2 is disposed on the supervision chamber 4; the first mounting chamber 2 comprises a cylindrical holder and a chamber for accommodating one of the two ultrasonic sensing probes 7; the chamber for accommodating the one of the two ultrasonic sensing probes is disposed on an upper surface of the cylindrical holder; a first fixation device is disposed in the chamber to fix the one of the two ultrasonic sensing probes; the one of the two ultrasonic sensing probes is fixed on a side wall of the first fixation device using screws 8; the cylindrical holder comprises a side wall and a plurality of slots disposed on the side wall; the slots correspond to the water inlet 5 and the water outlet 6 of the supervision chamber 4; the second mounting chamber 2′ comprises a second fixation device for accommodating the other of the two ultrasonic sensing probes 7; and the other of the two ultrasonic sensing probes is fixed on a side wall of the second fixation device using screws 8.The two ultrasonic sensing probes 7 are coated with a coupling agent and then fixed on sides wall of the first and second fixation devices using the screws 8.The device has the advantages of simple structure, high work efficiency, and is easy to assemble and operate.",
"A method for supervising biofilm culturing using the device, comprises: 1) sampling a mixture of target muddy water, and homogenizing the mixture; 2) filtering the homogenized mixture of muddy water, and collecting a filtrate resulting therefrom; 3) dividing the filtrate into two parts, labeling one of the two parts as Filtrate A; filtering the other part of the two parts using a filter membrane to yield another filtrate which is labeled as Filtrate B; 4) assembling the device for supervising biofilm culturing of claim 1; 5) fixing a first filler film 3 in the supervision chamber 4; 6) pumping the Filtrate A into the supervision chamber 4 via a water inlet 5 thereof; 7) starting the ultrasonic generator 9 when the Filtrate A is about to overflow from a water outlet of the supervision chamber 4, turning on an ultrasonic reflection mode, adjusting working parameters of the ultrasonic generator 9 to preset values, opening the oscilloscope 10, and on-line supervising the biofilm culturing on the first filler film through the controller 11; 8) substituting the Filtrate B for the Filtrate A, and repeating 6)-7); 9) recording a time with regard to the biofilm culturing on the first filler film according to an oscillogram on the oscilloscope 10; 10) replacing the first filler film using a second filler film, repeating 5)-9), and recording a time with regard to the biofilm culturing on the second filler film; and 11) based on the observation results in 9-10), selecting a filler with which the biofilm culturing is the quickest to use in a target water body for sewage treatment.",
"More other fillers made of different materials can be used for the test of biofilm culturing, which is conducive to selecting an optimum filler for sewage treatment.",
"Example 1 The effluent quality of an industrial wastewater does not fulfill the emission standard, so the disclosure proposes a biofilm method to upgrade the sewage treatment of the original aerobic tank.",
"Specifically, the method comprises: 1) sampling a mixture of target muddy water, and homogenizing the mixture for 15 times; 2) filtering the homogenized mixture of muddy water using a 10 μm filter membrane, and collecting a filtrate resulting therefrom; 3) dividing the filtrate into two parts, labeling one of the two parts as Filtrate A; filtering the other part of the two parts using a 0.22 μm filter membrane to yield another filtrate which is labeled as Filtrate B; 4) assembling the device for supervising biofilm culturing; 5) fixing a first filler film 3 in the supervision chamber 4; 6) pumping the Filtrate A into the supervision chamber 4 via a water inlet 5 thereof, the flow rate of the Filtrate A into the supervision chamber 4 is 1 mL/min; 7) starting the ultrasonic generator 9 when the Filtrate A is about to overflow from a water outlet of the supervision chamber 4, turning on an ultrasonic reflection mode, adjusting working parameters of the ultrasonic generator 9 to preset values, opening the oscilloscope 10, and on-line supervising the biofilm culturing on the first filler film through the controller 11; where the working parameters of the ultrasonic generator 9 are as follows: repetition frequency, 20 Hz; pulse resistance, 30Ω; pulse voltage, 400 V; gain, 60 dB; high-pass filtering, 0.03 mHz; and low-pass filtering, 1 mHz; 8) substituting the Filtrate B for the Filtrate A, and repeating 6)-7); 9) recording a time with regard to the biofilm culturing on the first filler film according to an oscillogram on the oscilloscope 10; 10) replacing the first filler film using a second filler film, repeating 5)-9), and recording a time with regard to the biofilm culturing on the second filler film; and 11) based on the observation results in 9-10), selecting a filler with which the biofilm culturing is the quickest to use in a target water body for sewage treatment.",
"As shown in FIGS.",
"2A, 2B, 3A, and 3B, it is known that besides the signal corresponding to the deposition of inorganic salts at 0.45 μs and the echoed signal of the filler at 0.85 μs, in FIG.",
"3B, after 8 hours' biofilm culturing, the echoed signal of the formation of biofilm on the filler is firstly captured at 0.1 μs.",
"Experimental results in this example show that the filler corresponding to the second filler film is suitable for biofilm culturing in the target water body.",
"Example 2 The effluent quality of an industrial wastewater does not fulfill the emission standard, so the disclosure proposes a biofilm method to upgrade the sewage treatment of the original aerobic tank.",
"Specifically, the method comprises: 1) sampling a mixture of target muddy water, and homogenizing the mixture for 10 times; 2) filtering the homogenized mixture of muddy water using an 8 μm filter membrane, and collecting a filtrate resulting therefrom; 3) dividing the filtrate into two parts, labeling one of the two parts as Filtrate A; filtering the other part of the two parts using a 0.45 μm filter membrane to yield another filtrate which is labeled as Filtrate B; 4) assembling the device for supervising biofilm culturing; 5) fixing a first filler film 3 in the supervision chamber 4; 6) pumping the Filtrate A into the supervision chamber 4 via a water inlet 5 thereof, the flow rate of the Filtrate A into the supervision chamber 4 is 10 mL/min; 7) starting the ultrasonic generator 9 when the Filtrate A is about to overflow from a water outlet of the supervision chamber 4, turning on an ultrasonic reflection mode, adjusting working parameters of the ultrasonic generator 9 to preset values, opening the oscilloscope 10, and on-line supervising the biofilm culturing on the first filler film through the controller 11; where the working parameters of the ultrasonic generator 9 are as follows: repetition frequency, 15 Hz; pulse resistance, 60Ω; pulse voltage, 200 V; gain, 60 dB; high-pass filtering, 0.1 mHz; and low-pass filtering, 3 mHz; 8) substituting the Filtrate B for the Filtrate A, and repeating 6)-7); 9) recording a time with regard to the biofilm culturing on the first filler film according to an oscillogram on the oscilloscope 10; 10) replacing the first filler film using a second filler film, repeating 5)-9), and recording a time with regard to the biofilm culturing on the second filler film; and 11) based on the observation results in 9-10), selecting a filler with which the biofilm culturing is the quickest to use in a target water body for sewage treatment.",
"Example 3 The effluent quality of an industrial wastewater does not fulfill the emission standard, so the disclosure proposes a biofilm method to upgrade the sewage treatment of the original aerobic tank.",
"Specifically, the method comprises: 1) sampling a mixture of target muddy water, and homogenizing the mixture for 12 times; 2) filtering the homogenized mixture of muddy water using a 9 μm filter membrane, and collecting a filtrate resulting therefrom; 3) dividing the filtrate into two parts, labeling one of the two parts as Filtrate A; filtering the other part of the two parts using a 0.3 μm filter membrane to yield another filtrate which is labeled as Filtrate B; 4) assembling the device for supervising biofilm culturing; 5) fixing a first filler film 3 in the supervision chamber 4; 6) pumping the Filtrate A into the supervision chamber 4 via a water inlet 5 thereof, the flow rate of the Filtrate A into the supervision chamber 4 is 0.5 mL/min; 7) starting the ultrasonic generator 9 when the Filtrate A is about to overflow from a water outlet of the supervision chamber 4, turning on an ultrasonic reflection mode, adjusting working parameters of the ultrasonic generator 9 to preset values, opening the oscilloscope 10, and on-line supervising the biofilm culturing on the first filler film through the controller 11; where the working parameters of the ultrasonic generator 9 are as follows: repetition frequency, 25 Hz; pulse resistance, 40Ω; pulse voltage, 300 V; gain, 60 dB; high-pass filtering, 0.05 mHz; and low-pass filtering, 2 mHz; 8) substituting the Filtrate B for the Filtrate A, and repeating 6)-7); 9) recording a time with regard to the biofilm culturing on the first filler film according to an oscillogram on the oscilloscope 10; 10) replacing the first filler film using a second filler film, repeating 5)-9), and recording a time with regard to the biofilm culturing on the second filler film; and 11) based on the observation results in 9-10), selecting a filler with which the biofilm culturing is the quickest to use in a target water body for sewage treatment.",
"Example 4 The effluent quality of an industrial wastewater does not fulfill the emission standard, so the disclosure proposes a biofilm method to upgrade the sewage treatment of the original aerobic tank.",
"Specifically, the method comprises: 1) sampling a mixture of target muddy water, and homogenizing the mixture for 12 times; 2) filtering the homogenized mixture of muddy water using a 9 μm filter membrane, and collecting a filtrate resulting therefrom; 3) dividing the filtrate into two parts, labeling one of the two parts as Filtrate A; filtering the other part of the two parts using a 0.3 μm filter membrane to yield another filtrate which is labeled as Filtrate B; 4) assembling the device for supervising biofilm culturing; 5) fixing a first filler film 3 in the supervision chamber 4; 6) pumping the Filtrate A into the supervision chamber 4 via a water inlet 5 thereof, the flow rate of the Filtrate A into the supervision chamber 4 is 0.5 mL/min; 7) starting the ultrasonic generator 9 when the Filtrate A is about to overflow from a water outlet of the supervision chamber 4, turning on an ultrasonic reflection mode, adjusting working parameters of the ultrasonic generator 9 to preset values, opening the oscilloscope 10, and on-line supervising the biofilm culturing on the first filler film through the controller 11; where the working parameters of the ultrasonic generator 9 are as follows: repetition frequency, 25 Hz; pulse resistance, 40Ω; pulse voltage, 300 V; gain, 60 dB; high-pass filtering, 0.05 mHz; and low-pass filtering, 2 mHz; 8) substituting the Filtrate B for the Filtrate A, and repeating 6)-7); 9) recording a time with regard to the biofilm culturing on the first filler film according to an oscillogram on the oscilloscope 10; 10) replacing the first filler film using a second filler film, repeating 5)-9), and recording a time with regard to the biofilm culturing on the second filler film; and 11) based on the observation results in 9-10), selecting a filler with which the biofilm culturing is the quickest to use in a target water body for sewage treatment.",
"Unless otherwise indicated, the numerical ranges involved in the invention include the end values.",
"While particular embodiments of the invention have been shown and described, it will be obvious to those skilled in the art that changes and modifications may be made without departing from the invention in its broader aspects, and therefore, the aim in the appended claims is to cover all such changes and modifications as fall within the true spirit and scope of the invention."
]
] |
Patent_15871145
|
[
[
"PROCESS OF CLEAN PRODUCTION OF ELECTRONIC GRADE HIGH-PURITY COPPER OXIDE",
"The present disclosure provides a process of clean production of electronic grade high-purity copper oxide.",
"The process includes (1) preparing a carbon-ammonia system solution with a certain ratio of CO2, NH3 and H2O; (2) dissolving copper under a slightly negative pressure and at a system temperature less than or equal to 60° C.; the reaction ends until the concentration of copper in the carbon-ammonia system solution reaches 80 to 140 g/L; (3) adding sodium polyacrylate; the reaction solution is heated to 60-80° C. under a reduced pressure for deamination; (4) disposing basic copper carbonate to separate the solid from the liquid by a centrifuge to give an filter cake and copper-containing clear solution; (5) calcining the filter cake at 250-600° C. for 1-5 hours to give an electronic grade high purity copper oxide; ammonia collected in step (3), the copper-containing clear solution collected in step (4), and carbon dioxide and water vapor collected in step (5) are transferred to the solution-preparing device of step (1) and directly used as raw materials for preparing carbonate-ammonia system solution, wherein the copper-containing clear solution is used as water.",
"The process of production of the disclosure has a shortened processing line and a low energy consumption; it is not only cost saving but also can achieve goals of energy saving, reduced emission and environment pollution."
],
[
"1.A process of clean production of the electronic grade high-purity copper oxide, comprising the following steps in sequence: (1) continuously preparing a carbon-ammonia system solution through a solution-preparing device, wherein the molar ratio of CO2:NH3:H2O is 1:1.3-2:17-20; (2) adding the carbon-ammonia system solution into a reaction vessel preloaded with metallic copper, and constantly inhaling air, oxygen or ozone under a slightly negative pressure to keep the temperature of the reaction system equal to or less than 60° C.; the negative pressure is closed when the concentration of copper in the carbon-ammonia system reaches 80-140 g/L; (3) filtering the copper-ammonia solution to a reaction kettle for deamination, adding sodium polyacrylate; the reaction solution is heated to a temperature of 60-80° C. under a reduced pressure for deamination after stirring evenly; when the deamination ends, sodium polyacrylate is added in an amount of 0.2-0.6 g/L based on a volume of the copper-ammonia filtrate and ammonia water is collected during deamination; (4) disposing basic copper carbonate resulted in step (3) to separate solid from liquid by a centrifuge and to give a filter cake and a copper-containing clear solution; collecting the copper-containing clear solution; (5) calcining the filter cake at a temperature of 250-600° C. for 1-5 hours to give an electronic grade high-purity copper oxide, and carbon dioxide and water vapor are produced during the calcination; the ammonia water collected in the above step (3), the copper-containing clear solution collected in the step (4) and carbon dioxide and water vapor collected in the step (5) are transferred into the solution-preparing device in the step (1) and directly used as raw materials to prepare the carbonate-ammonia system solution, wherein the copper-containing clear solution is used as water.",
"2.The process of clean production of the electronic grade high-purity copper oxide according to the claim 1, wherein the carbonate-ammonia system solution of the above step (1) is prepared by firstly injecting the ammonia water into the solution-preparing device and then introducing carbon dioxide, which is followed by spraying with water, and the procedure is a continuous closed-loop operation.",
"3.The process of clean production of the electronic grade high-purity copper oxide according to the claim 1, wherein the water vapor collected in the above step (5), after dust removing, is transferred into the solution-preparing device along with carbon dioxide by a fan.",
"4.The process of clean production of the electronic grade high-purity copper oxide according to the claim 3, wherein ammonia gas volatilized during dissolving copper in the above step (2) is transferred into the solution-preparing device by the fan to form a part of the closed-loop operation for recycling.",
"5.The process of clean production of the electronic grade high-purity copper oxide according to the claim 4, wherein the slightly negative pressure in the above step (2) is between −0.01 and −0.02 Mpa.",
"6.The process of clean production of the electronic grade high-purity copper oxide according to the claim 5, wherein the reduced pressure in the above step (3) is between −0.03 and −0.08 Mpa.",
"7.The process of clean production of the electronic grade high-purity copper oxide according to the claim 6, wherein micro-amount ammonia gas generated in the above steps due to the problem of airtightness is uniformly recycled by a gas-collecting hood, and then absorbed by circulating spray of a dilute acid spraying solution to give analytically pure ammonium salt.",
"8.The process of clean production of the electronic grade high-purity copper oxide according to the claim 7, wherein the dilute acid spraying solution is preferably sulfuric acid, nitric acid or acetic acid."
],
[
"<SOH> BACKGROUND TECHNOLOGY <EOH>Flexible printed circuit (FPC) is a printed circuit made of polyimide or polyester film as a substrate and having a high reliability and excellent flexibility.",
"With the rapid development of microelectronic technology, the printed circuit board has been developed fast in the direction of multi-layer, lamination, functionalization and integration, which causes a large-scale adoption of micro-hole, narrow pitch and fine wire in the design of the printed circuit for the conception and design of circuit diagram.",
"FPC will be increasingly widely used due to having a special function and will become a trend in the printed circuit board in the future.",
"It is technically great difficult to manufacture the flexible printed circuit board, the conventional vertically electroplating process can no longer meet the technical requirements for high quality and reliability of interconnected holes, and therefore horizontally electroplating has been developed.",
"At present, the supplement of copper ions to an acid-copper system in the horizontally electroplating in FPC industry mainly depends on copper oxide powder.",
"However, the copper oxide powder required in this process must have a high activity and can be rapidly dissolved in the electroplating solution system.",
"Many scientific and technical literatures and patents involve methods for preparing copper oxide.",
"The conventional method for preparing copper oxide may include: reacting a soluble copper salt, such as copper sulfate, copper nitrate and the like, with a precipitant, such as sodium carbonate, sodium bicarbonate and the like under a temperature, converting the soluble copper salt into solid basic copper carbonate, which is washed, calcined and decomposed into copper oxide.",
"The conventional method of preparation, due to high content of impurities in copper source, is not adaptable to the requirements of current advanced FPC electroplating.",
"Chinese invention patent application No.",
"201410550840.5 discloses a method for preparing activated copper oxide powder comprising using a copper plate as a raw material, preparing a copper-ammonia complex solution through ammonia leaching process, followed by a fine filtration and evaporation under slightly negative pressure to give basic copper carbonate, which then was calcined at a low temperature to give activated copper oxide powder product.",
"The copper oxide prepared by the method has characteristics of high activity and high purity of the product.",
"However, the method, making no comprehensive circulation and utilization of introduced agents, has a high production cost and lacks competitiveness on the market.",
"Chinese invention patent application No.",
"201210068019.0 discloses a method for preparing copper oxide by dissolving copper, including: adding copper, ammonia water, and powdery ammonium bicarbonate or ammonium carbonate or a mixture of ammonium bicarbonate and ammonium carbonate into a reaction vessel, stirring continuously while introducing air or oxygen to conduct the reaction, and at the same time, disposing a circulating device to retransfer ammonia gas and carbon dioxide volatilized from the reaction vessel into the reaction vessel after recycling so as to get into the reaction; the reaction ended when the pressure of the system no longer changes as the temperature of the system increases, the undissolved copper in the reaction system was removed, the reaction solution was filtered, and the filter cake was retained, washed and calcined at a temperature of 500° C.-700° C. to give copper oxide.",
"In the method, ammonia gas and carbon dioxide produced during the decomposition of ammonium bicarbonate when copper is dissolved in ammonia bicarbonate are recycled and utilized, but the method for recycling the same utilizes the absorbent to absorb a volatile gas and then the absorbent is heated so that the volatile gas escapes.",
"Such a circulation and utilization process requires reheating and energy consumption, and does not meet the requirement for environment protection.",
"In addition, the copper-ammonia complex solution formed after dissolving copper further contains lots of ammonia and carbon dioxide, which are not recycled and utilized in the method, and the filtrate containing copper ions and a small amount of ammonia is directly drained off as waste water.",
"This is wasteful and applies great pressure on the environment protection."
],
[
"<SOH> SUMMARY OF THE DISCLOSURE <EOH>In order to solve the above problems, an objective of the present disclosure is to provide a process of clean production of electronic grade high-purity copper oxide, in which the added chemicals and water may be circulated and utilized.",
"In order to achieve the above objective, the process of clean production of the electronic grade high-purity copper oxide of the present disclosure includes the following steps in sequence: (1) continuously preparing a carbon-ammonia system solution through a solution-preparing device, wherein the molar ratio of CO 2 : NH 3 : H 2 O is 1:1.3-2: 17-20; (2) adding the carbon-ammonia system solution into a reaction vessel preloaded with metallic copper, and constantly inhaling air, oxygen or ozone under a slightly negative pressure to keep the temperature of the reaction system equal to or less than 60° C.; the negative pressure is closed when the concentration of copper in the carbon-ammonia system reaches 80-140 g/L; (3) filtering the copper-ammonia solution to a reaction kettle for deamination, adding sodium polyacrylate; the reaction solution is heated to a temperature of 60-80° C. under a reduced pressure for deamination after stirring evenly; when the deamination ends, sodium polyacrylate is added in an amount of 0.2-0.6 g/L based on a volume of the copper-ammonia filtrate and ammonia water is collected during deamination; (4) disposing basic copper carbonate resulted in step (3) to separate the solid from the liquid by a centrifuge and to give a filter cake and a copper-containing clear solution; collecting the copper-containing clear solution; (5) calcining the filter cake at a temperature of 250-600° C. for 1-5 hours to give an electronic grade high-purity copper oxide, and collecting carbon dioxide and water vapor produced during the calcination; the ammonia water collected in the above step (3), the copper-containing clear solution collected in the step (4) and carbon dioxide and water vapor collected in the step (5) are transferred into the solution-preparing device in the step (1) and directly used as raw materials to prepare the carbonate-ammonia system solution, wherein the copper-containing clear solution is used as water.",
"The carbonate-ammonia system solution of the above step (1) is prepared by firstly injecting the ammonia water into the solution-preparing device and then introducing carbon dioxide, which is followed by spraying with water.",
"Moreover, the procedure is a continuous closed-loop operation.",
"The water vapor collected in the above step (5), after dust removing, is transferred into the solution-preparing device along with carbon dioxide by a fan.",
"In order to make better use of the introduced chemical agent, ammonia gas volatilized during dissolving copper in the above step (2) is transferred into the solution-preparing device by the fan to form a part of the closed-loop operation for recycling.",
"The slightly negative pressure in the above step (2) is between −0.01 to −0.02 Mpa of the atmospheric pressure.",
"The reduced pressure in the above step (3) is between −0.03 to −0.08 Mpa of the atmospheric pressure.",
"In order to further reduce the environmental pollution, micro-amount ammonia gas generated in the above steps due to the problem of airtightness is uniformly recycled by a gas-collecting hood, and then absorbed by circulating spray of a dilute acid spraying solution to give analytically pure ammonium salt.",
"The above dilute acid spraying solution is preferably sulfuric acid, nitric acid or acetic acid, and more preferably dilute sulfuric acid.",
"The process of clean production of the electronic grade high-purity copper oxide of the present disclosure, with metal copper as raw material, uses an ammonia leaching process to prepare copper-ammonia complex solution, followed by deamination and filtration to give basic copper carbonate, which is then calcined to give electronic grade high-purity copper oxide; the carbon-ammonia system solution is formulated with ammonia water, carbon dioxide and water in a certain ratio, so that ammonia, carbon dioxide and the copper-containing clear solution collected in each step during the whole process can be directly circulated and utilized without treatment.",
"This is not only cost saving, but also achieves goals of energy saving, reduced emission and environment pollution.",
"The process of production of the disclosure has a shortened processing line, a low energy consumption, and a friendly production environment, and the resulted product has a high purity, a high activity and a controllable particle size, and it is particularly adaptive to the quality requirements for the copper ions in a horizontally electroplating acid-copper system in the FPC industry.",
"detailed-description description=\"Detailed Description\" end=\"lead\"?"
],
[
"TECHNICAL FIELD The present disclosure relates to a process for preparing copper oxide, particularly to a process for preparing electronic grade high-purity copper oxide, and more specifically to a process of clean production of electronic grade high-purity copper oxide for the circulation and utilization of ammonia, carbon dioxide and copper-containing clear solution produced during a reaction.",
"BACKGROUND TECHNOLOGY Flexible printed circuit (FPC) is a printed circuit made of polyimide or polyester film as a substrate and having a high reliability and excellent flexibility.",
"With the rapid development of microelectronic technology, the printed circuit board has been developed fast in the direction of multi-layer, lamination, functionalization and integration, which causes a large-scale adoption of micro-hole, narrow pitch and fine wire in the design of the printed circuit for the conception and design of circuit diagram.",
"FPC will be increasingly widely used due to having a special function and will become a trend in the printed circuit board in the future.",
"It is technically great difficult to manufacture the flexible printed circuit board, the conventional vertically electroplating process can no longer meet the technical requirements for high quality and reliability of interconnected holes, and therefore horizontally electroplating has been developed.",
"At present, the supplement of copper ions to an acid-copper system in the horizontally electroplating in FPC industry mainly depends on copper oxide powder.",
"However, the copper oxide powder required in this process must have a high activity and can be rapidly dissolved in the electroplating solution system.",
"Many scientific and technical literatures and patents involve methods for preparing copper oxide.",
"The conventional method for preparing copper oxide may include: reacting a soluble copper salt, such as copper sulfate, copper nitrate and the like, with a precipitant, such as sodium carbonate, sodium bicarbonate and the like under a temperature, converting the soluble copper salt into solid basic copper carbonate, which is washed, calcined and decomposed into copper oxide.",
"The conventional method of preparation, due to high content of impurities in copper source, is not adaptable to the requirements of current advanced FPC electroplating.",
"Chinese invention patent application No.",
"201410550840.5 discloses a method for preparing activated copper oxide powder comprising using a copper plate as a raw material, preparing a copper-ammonia complex solution through ammonia leaching process, followed by a fine filtration and evaporation under slightly negative pressure to give basic copper carbonate, which then was calcined at a low temperature to give activated copper oxide powder product.",
"The copper oxide prepared by the method has characteristics of high activity and high purity of the product.",
"However, the method, making no comprehensive circulation and utilization of introduced agents, has a high production cost and lacks competitiveness on the market.",
"Chinese invention patent application No.",
"201210068019.0 discloses a method for preparing copper oxide by dissolving copper, including: adding copper, ammonia water, and powdery ammonium bicarbonate or ammonium carbonate or a mixture of ammonium bicarbonate and ammonium carbonate into a reaction vessel, stirring continuously while introducing air or oxygen to conduct the reaction, and at the same time, disposing a circulating device to retransfer ammonia gas and carbon dioxide volatilized from the reaction vessel into the reaction vessel after recycling so as to get into the reaction; the reaction ended when the pressure of the system no longer changes as the temperature of the system increases, the undissolved copper in the reaction system was removed, the reaction solution was filtered, and the filter cake was retained, washed and calcined at a temperature of 500° C.-700° C. to give copper oxide.",
"In the method, ammonia gas and carbon dioxide produced during the decomposition of ammonium bicarbonate when copper is dissolved in ammonia bicarbonate are recycled and utilized, but the method for recycling the same utilizes the absorbent to absorb a volatile gas and then the absorbent is heated so that the volatile gas escapes.",
"Such a circulation and utilization process requires reheating and energy consumption, and does not meet the requirement for environment protection.",
"In addition, the copper-ammonia complex solution formed after dissolving copper further contains lots of ammonia and carbon dioxide, which are not recycled and utilized in the method, and the filtrate containing copper ions and a small amount of ammonia is directly drained off as waste water.",
"This is wasteful and applies great pressure on the environment protection.",
"SUMMARY OF THE DISCLOSURE In order to solve the above problems, an objective of the present disclosure is to provide a process of clean production of electronic grade high-purity copper oxide, in which the added chemicals and water may be circulated and utilized.",
"In order to achieve the above objective, the process of clean production of the electronic grade high-purity copper oxide of the present disclosure includes the following steps in sequence: (1) continuously preparing a carbon-ammonia system solution through a solution-preparing device, wherein the molar ratio of CO2: NH3: H2O is 1:1.3-2: 17-20; (2) adding the carbon-ammonia system solution into a reaction vessel preloaded with metallic copper, and constantly inhaling air, oxygen or ozone under a slightly negative pressure to keep the temperature of the reaction system equal to or less than 60° C.; the negative pressure is closed when the concentration of copper in the carbon-ammonia system reaches 80-140 g/L; (3) filtering the copper-ammonia solution to a reaction kettle for deamination, adding sodium polyacrylate; the reaction solution is heated to a temperature of 60-80° C. under a reduced pressure for deamination after stirring evenly; when the deamination ends, sodium polyacrylate is added in an amount of 0.2-0.6 g/L based on a volume of the copper-ammonia filtrate and ammonia water is collected during deamination; (4) disposing basic copper carbonate resulted in step (3) to separate the solid from the liquid by a centrifuge and to give a filter cake and a copper-containing clear solution; collecting the copper-containing clear solution; (5) calcining the filter cake at a temperature of 250-600° C. for 1-5 hours to give an electronic grade high-purity copper oxide, and collecting carbon dioxide and water vapor produced during the calcination; the ammonia water collected in the above step (3), the copper-containing clear solution collected in the step (4) and carbon dioxide and water vapor collected in the step (5) are transferred into the solution-preparing device in the step (1) and directly used as raw materials to prepare the carbonate-ammonia system solution, wherein the copper-containing clear solution is used as water.",
"The carbonate-ammonia system solution of the above step (1) is prepared by firstly injecting the ammonia water into the solution-preparing device and then introducing carbon dioxide, which is followed by spraying with water.",
"Moreover, the procedure is a continuous closed-loop operation.",
"The water vapor collected in the above step (5), after dust removing, is transferred into the solution-preparing device along with carbon dioxide by a fan.",
"In order to make better use of the introduced chemical agent, ammonia gas volatilized during dissolving copper in the above step (2) is transferred into the solution-preparing device by the fan to form a part of the closed-loop operation for recycling.",
"The slightly negative pressure in the above step (2) is between −0.01 to −0.02 Mpa of the atmospheric pressure.",
"The reduced pressure in the above step (3) is between −0.03 to −0.08 Mpa of the atmospheric pressure.",
"In order to further reduce the environmental pollution, micro-amount ammonia gas generated in the above steps due to the problem of airtightness is uniformly recycled by a gas-collecting hood, and then absorbed by circulating spray of a dilute acid spraying solution to give analytically pure ammonium salt.",
"The above dilute acid spraying solution is preferably sulfuric acid, nitric acid or acetic acid, and more preferably dilute sulfuric acid.",
"The process of clean production of the electronic grade high-purity copper oxide of the present disclosure, with metal copper as raw material, uses an ammonia leaching process to prepare copper-ammonia complex solution, followed by deamination and filtration to give basic copper carbonate, which is then calcined to give electronic grade high-purity copper oxide; the carbon-ammonia system solution is formulated with ammonia water, carbon dioxide and water in a certain ratio, so that ammonia, carbon dioxide and the copper-containing clear solution collected in each step during the whole process can be directly circulated and utilized without treatment.",
"This is not only cost saving, but also achieves goals of energy saving, reduced emission and environment pollution.",
"The process of production of the disclosure has a shortened processing line, a low energy consumption, and a friendly production environment, and the resulted product has a high purity, a high activity and a controllable particle size, and it is particularly adaptive to the quality requirements for the copper ions in a horizontally electroplating acid-copper system in the FPC industry.",
"DETAILED DESCRIPTION The technical solutions of the present disclosure are further described below with reference to the specific examples.",
"However, these examples are not intended to limit the scope of the present disclosure and changes, for example, of the steps or technical parameters for preparing a copper-ammonia complex solution, shall fall within the scope of the present disclosure without departing from the concept of the present disclosure.",
"Example 1 (1) Preparation of carbon-ammonia system solution: firstly, 2520 g of 25% ammonia water was injected into a solution-preparing device, 1100 g of carbon dioxide was slowly introduced and the reaction solution was sprayed and prepared with pure water; 6125 g of pure water was consumed.",
"The molar ratio of the three materials was kept in a range of 1:1.3-2: 17-20 during the whole preparation.",
"(2) 10 kg of metallic copper (excess) was added into a stainless steel reaction kettle, 20 L of the prepared carbon-ammonia system solution was added into the reaction kettle, then the negative pressure circulating pump was turned on to inhale air at −0.01 to −0.02 Mpa, and turned off after 3-4 hours (the duration is not a constant value and depends on the flow of inhaled air), and the reaction of dissolving copper ended.",
"9.2 kg of metal copper was retained, 0.8 kg of copper was dissolved out, and the concentration of the copper solution was 100 g/L.",
"Ammonia gas volatilized during the dissolving was transferred to the solution-preparing device by a fan for recycling.",
"(3) The copper solution was filtered into a reaction kettle for deamination and stirred rapidly, and 6 g of sodium polyacrylate was added.",
"After stirring evenly, the reaction solution was heated for deamination under a condition of −0.03 to −0.08 Mpa, and the ammonia water collected was transferred to the solution-preparing device.",
"(4) The solid was separated from the liquid.",
"The copper-containing clear solution was collected, and 1.6 kg of basic copper carbonate, including about 50% of copper, was obtained.",
"The copper-containing clear solution was transferred to the solution-preparing device.",
"(5) Basic copper carbonate was calcined at 450° C. for 4 hours to give 0.99 kg of copper oxide as a finished product.",
"The water vapor produced during the calcination was transferred to the solution-preparing device along with carbon dioxide by the fan after dust removing.",
"Example 2 (1) Preparation of carbon-ammonia system solution: (continuous preparation) 6250 g of recycled ammonia water was injected at a flow into the solution-preparing device and supplemented with 1070 g of 25% ammonia water while slowly introducing 655 g of carbon dioxide, and the reaction solution was sprayed and prepared with the recycled copper-containing clear solution and pure water; 2480 g of the copper-containing clear solution and 100 g of pure water was consumed.",
"By flow control, the molar ratio of the three materials was kept in a range of 1:1.3-2:17-20 during the whole preparation.",
"(2) 9.2 kg of remaining metallic copper (excess) in the example 1 was added, 20 L of the prepared carbon-ammonia system solution was added into the reaction kettle, then the negative pressure circulating pump was turned on to inhale oxygen at −0.01 to −0.02 Mpa, and turned off after 2-4 hours (the duration is not a constant value and depends on the flow of inhaled oxygen), and the reaction of dissolving copper ended.",
"8.36 kg of electrolytic copper was retained, 0.84 kg of copper was dissolved out, and the concentration of the copper solution was 100 g/L.",
"Ammonia gas volatilized during the dissolving was transferred to the solution-preparing device by a fan for recycling.",
"(3) The copper solution was filtered into a reaction kettle for deamination and stirred rapidly, and 10 g of sodium polyacrylate was added.",
"After stirring evenly, the reaction solution was heated for deamination under a condition of −0.03 to −0.08 Mpa, and the ammonia water collected was transferred to the solution-preparing device.",
"(4) The solid was separated from the liquid.",
"The copper-containing clear solution was collected, and 1.68 kg of basic copper carbonate, including about 49% of copper, was obtained.",
"The copper-containing clear solution was transferred to the solution-preparing device.",
"(5) Basic copper carbonate was calcined at 400° C. for 4 hours to give 1.05 kg of copper oxide as a finished product.",
"The water vapor produced during the calcination was transferred to the solution-preparing device along with carbon dioxide by the fan after dust removing.",
"Example 3 (1) Preparation of carbon-ammonia system solution: (continuous preparation) 8580 g of recycled ammonia water was injected at a flow into the solution-preparing device and supplemented with 170 g of 25% ammonia water while introducing 435 g of carbon dioxide at a flow, and the reaction solution was sprayed and prepared with recycled copper-containing clear solution and pure water; 994 g of the copper-containing clear solution and 100 g of pure water was consumed.",
"By flow control, the molar ratio of the three materials was kept in a range of 1:1.3-2:17-20 during the whole preparation.",
"(2) 8.36 kg of remaining metallic copper (excess) in the example 2 was added, 20 L of the prepared carbon-ammonia system solution was added into the reaction kettle, then the negative pressure circulating pump was turned on to inhale air at −0.01 to −0.02 Mpa, and turned off after 3-4 hours (the duration is not a constant value and depends on the flow of inhaled air), and the reaction of dissolving copper ended.",
"7.54 kg of electrolytic copper was retained, 0.82 kg of copper was dissolved out, and the concentration of the copper solution was 100 g/L.",
"Ammonia gas volatilized during the dissolving was transferred to the solution-preparing device by a fan for recycling.",
"(3) The copper solution was filtered into a reaction kettle for deamination and stirred rapidly, and 10 g of sodium polyacrylate was added.",
"After stirring evenly, the reaction solution was heated for deamination under a condition of −0.03 to −0.08 Mpa, and the ammonia water collected was transferred to the solution-preparing device.",
"(4) The solid was separated from the liquid.",
"The copper-containing clear solution was collected, and 1.67 kg of basic copper carbonate, including about 49% of copper, was obtained.",
"The copper-containing clear solution was transferred to the solution-preparing device.",
"(5) Basic copper carbonate was calcined at 500° C. for 3 hours to give 1.02 kg of copper oxide as a finished product.",
"The water vapor produced during the calcination was transferred to the solution-preparing device along with carbon dioxide by the fan after dust removing.",
"Example 4 (1) Preparation of carbon-ammonia system solution: (continuous preparation) 7994 g of recycled ammonia water was injected at a flow into the solution-preparing device and supplemented with 160 g of 25% ammonia water while introducing 405 g of carbon dioxide at a flow, and the reaction solution was sprayed and prepared with recycled copper-containing clear solution and pure water; 920 g of the copper-containing clear solution and 100 g of pure water was consumed.",
"By flow control, the molar ratio of the three materials was kept in a range of 1:1.3-2:17-20 during the whole preparation.",
"(2) 7.54 kg of remaining metallic copper in the example 3 was added, 20 L of the prepared carbon-ammonia system solution was added into the reaction kettle, then the negative pressure circulating pump was turned on to inhale ozone, and turned off after 1-3 hours (the duration is not a constant value and depends on the flow of inhaled ozone), and the reaction of dissolving copper ended.",
"6.78 kg of electrolytic copper was retained, 0.76 kg of copper was dissolved out, and the concentration of the copper solution was 100 g/L.",
"Ammonia gas volatilized during the dissolving was transferred to the solution-preparing device by a fan for recycling.",
"(3) The copper solution was filtered into a reaction kettle for deamination and stirred rapidly, and 8 g of sodium polyacrylate was added.",
"After stirring evenly, the reaction solution was heated for deamination under a condition of −0.03 to −0.08 Mpa, and the ammonia water collected was transferred to the solution-preparing device.",
"(4) The solid was separated from the liquid.",
"The copper-containing clear solution was collected, and 1.52 kg of basic copper carbonate, including about 50% of copper, was obtained.",
"The copper-containing clear solution was transferred to the solution-preparing device.",
"(5) Basic copper carbonate was calcined at 550° C. for 5 hours to give 0.95 kg of copper oxide as a finished product.",
"The water vapor produced during the calcination was transferred to the solution-preparing device along with carbon dioxide by the fan after dust removing.",
"Micro-amount ammonia gas generated in the above steps due to the problem of airtightness was uniformly recycled by a gas-collecting hood, and then the micro-amount ammonia gas was absorbed circulating spray of sulfuric acid, nitric acid or acetic acid to give analytically pure ammonium salt.",
"The content and purity of the copper oxide products resulted in the above Examples 1-4 were measured.",
"Its content (based on copper oxide) was greater than or equal to 99.5%, and the content of impurity elements are as follows: Ca≤5 ppm, Zn≤5 ppm, Ni≤5 ppm, Fe≤5 ppm, Mg≤5 ppm, Pb≤5 ppm, Mn≤2 ppm, which meets the quality requirements for copper ions in the horizontally electroplating acid-copper system in the FPC industry.",
"The statistics of material consumptions are as follows (kg/kg copper oxide) Example 1 Example 2 Example 3 Example 4 Pure Water 6.19 0.1 0.1 0.11 Ammonia 2.55 1.02 0.17 0.17 Carbon Dioxide 1.11 0.62 0.43 0.43 It can be seen from the above table that the statistics of material consumptions is relatively high when initially introducing.",
"However, with the closed-loop recycling and utilization of subsequent by-products, the material consumption tends to constant, which is not only a reduced emission, but also is a great cost saving."
]
] |
Patent_15871147
|
[
[
"METHOD AND SYSTEM FOR IDENTIFYING FINGERPRINT",
"The invention discloses a method and system for identifying fingerprint.",
"The method comprises: S1: adjusting a camera to focus the camera on a lens; S2: capturing continuously by the camera fingerprint images formed by a finger pressing the lens, and sending the fingerprint images to an image processing module; and S3: processing the fingerprint images by the image processing module so as to acquire fingerprints.",
"In this way, only a common camera is required for acquiring the fingerprint according to the invention, which is easy to operate at a low cost."
],
[
"1.A method for identifying fingerprint, characterized by comprising: S1: adjusting a camera to focus the camera on a lens; S2: capturing continuously by the camera fingerprint images formed by a finger pressing the lens, and sending the fingerprint images to an image processing module; and S3: processing the fingerprint images by the image processing module so as to acquire the fingerprint.",
"2.The method for identifying a fingerprint according to claim 1, wherein, before step S3, the method further comprises: S31: adhering an anti-fingerprint film on the outside of the lens.",
"3.The method for identifying a fingerprint according to claim 1, wherein, before step S2, the method further comprises: S21: setting the camera to be in a continuous previewing state; and S22: connecting the camera to the image processing module via a CSI interface.",
"4.The method for identifying a fingerprint according to claim 1, wherein, step S2 specifically comprises: S20: determining by the camera whether a brightness component value Y is smaller than a preset value, according to the YUV format; executing S23 of capturing a fingerprint image by the camera and sending the fingerprint image to the image processing module, if the brightness component value Y is smaller than the preset value; otherwise, executing S24 of capturing continuously by the camera fingerprint images formed by the finger pressing the lens, and returning to the execution of S20.5.The method for identifying a fingerprint according to claim 1, wherein, step S3 specifically comprises: S32: converting the fingerprint image into a black-and-white gray-scale image by the image processing module and performing binarization on the black-and-white gray-scale image so as to obtain a black-and-white texture image; S33: extracting feature values of the black-and-white texture image and sending the feature values to a system backstage for comparison; S34: acquiring a fingerprint according to the comparison result.",
"6.A system for identifying fingerprint, comprising a camera, a lens and an image processing module, the system performing the following steps: S1: adjusting the camera to focus the camera on the lens; S2: capturing continuously by the camera fingerprint images formed by a finger pressing the lens, and sending the fingerprint images to the image processing module; and S3: processing the fingerprint images by the image processing module so as to acquire the fingerprint.",
"7.The system for identifying fingerprint according to claim 6, wherein, before step S3, the following step is further included: S31: adhering an anti-fingerprint film on the outside of the lens.",
"8.The system for identifying fingerprint according to claim 6, wherein, before step S2, the following step is further included: S21: setting the camera to be in a continuous previewing state; and S22: connecting the camera to the image processing module via a CSI interface.",
"9.The system for identifying fingerprint according to claim 6, wherein, step S2 specifically comprises: S20: determining by the camera whether a brightness component value Y is smaller than a preset value, according to the YUV format; executing S23 of capturing a fingerprint image by the camera and sending the fingerprint image to the image processing module, if the brightness component value Y is smaller than the preset value; otherwise, executing S24 of capturing continuously by the camera fingerprint images formed by the finger pressing the lens, and returning to the execution of S20.10.The system for identifying fingerprint according to claim 6, wherein, step S3 specifically comprises: S32: converting the fingerprint image into a black-and-white gray-scale image by the image processing module and performing binarization on the black-and-white gray-scale image so as to obtain a black-and-white texture image; S33: extracting feature values of the black-and-white texture image and sending the feature values to a system backstage for comparison; S34: acquiring a fingerprint according to the comparison result."
],
[
"<SOH> BACKGROUND OF THE INVENTION <EOH>With the continuous advancement of science and technology and the ever-increasing demands on secure identification, the application of fingerprint identification has become more and more widespread.",
"A fingerprint module is directly used on most existing electronic devices that support fingerprinting, such as an optical fingerprint module and a semiconductor fingerprint module or the like.",
"The optical fingerprint module has a complicated structure, while the semiconductor fingerprint module typically has a higher price, and has more limitations on the design of product.",
"The prior art patent (Chinese patent application No.",
"201310352969.0) discloses a fingerprint identification access control management system, which includes a fingerprint input module, a fingerprint verification module, an electronic lock module, and a liquid crystal display module.",
"The fingerprint input module includes a fingerprint camera and a storage unit.",
"A fingerprint image captured by the fingerprint camera is stored in the storage unit.",
"The fingerprint verification module includes a fingerprint comparison unit and a fingerprint identification unit.",
"The electronic control lock module includes a user name and a password input.",
"The liquid crystal display module includes a liquid crystal display.",
"The fingerprint input module, the fingerprint verification module, and the liquid crystal display module are connected with the electronic lock module.",
"Image acquisition and image processing are not mentioned in this reference document.",
"However, image acquisition and image processing are important steps for obtaining a fingerprint image with high accuracy."
],
[
"<SOH> SUMMARY OF THE INVENTION <EOH>"
],
[
"CROSS REFERENCE TO RELATED APPLICATIONS The present application is a Continuation Application of PCT Application No.",
"PCT/CN2016/091973 filed on Jul.",
"28, 2016, which claims the benefit of Chinese Patent Application No.",
"201510498076.6 filed on Aug. 14, 2015.All the above are hereby incorporated by reference.",
"FIELD OF THE INVENTION The invention relates to the field of biometric identification technology, and in particular, to a method and system for identifying a fingerprint.",
"BACKGROUND OF THE INVENTION With the continuous advancement of science and technology and the ever-increasing demands on secure identification, the application of fingerprint identification has become more and more widespread.",
"A fingerprint module is directly used on most existing electronic devices that support fingerprinting, such as an optical fingerprint module and a semiconductor fingerprint module or the like.",
"The optical fingerprint module has a complicated structure, while the semiconductor fingerprint module typically has a higher price, and has more limitations on the design of product.",
"The prior art patent (Chinese patent application No.",
"201310352969.0) discloses a fingerprint identification access control management system, which includes a fingerprint input module, a fingerprint verification module, an electronic lock module, and a liquid crystal display module.",
"The fingerprint input module includes a fingerprint camera and a storage unit.",
"A fingerprint image captured by the fingerprint camera is stored in the storage unit.",
"The fingerprint verification module includes a fingerprint comparison unit and a fingerprint identification unit.",
"The electronic control lock module includes a user name and a password input.",
"The liquid crystal display module includes a liquid crystal display.",
"The fingerprint input module, the fingerprint verification module, and the liquid crystal display module are connected with the electronic lock module.",
"Image acquisition and image processing are not mentioned in this reference document.",
"However, image acquisition and image processing are important steps for obtaining a fingerprint image with high accuracy.",
"SUMMARY OF THE INVENTION Technical Problem The technical problem to be solved by the invention is to use a common camera to acquire fingerprint images, and compare the acquired fingerprint images to obtain fingerprints, which is easy to operate at a low cost.",
"Technical Solution In order to solve the above-mentioned technical problem, the invention adopts the following technical solution.",
"A method for identifying a fingerprint is provided, which includes: S1: adjusting a camera to focus the camera on a lens; S2: capturing continuously by the camera fingerprint images formed by a finger pressing the lens, and sending the fingerprint images to an image processing module; and S3: processing the fingerprint images by the image processing module so as to acquire the fingerprint.",
"In order to solve the above-mentioned technical problem, a system for identifying fingerprint is further provided by the invention, which includes: a camera, a lens and an image processing module, and the system performs the following steps: S1: adjusting the camera to focus the camera on the lens; S2: capturing continuously by the camera fingerprint images formed by a finger pressing the lens, and sending the fingerprint images to the image processing module; and S3: processing the fingerprint images by the image processing module so as to acquire the fingerprint.",
"Advantageous Effects The invention has the following advantageous effects: in contrast to the prior art, in the invention, the camera is focused on the lens, fingerprint images of a finger pressing on the lens are acquired, and the fingerprint images are sent to the image processing module for processing so as to acquire the fingerprint.",
"In this way, only a common camera is required for acquiring the fingerprint according to the invention, which is easy to operate at a low cost.",
"BRIEF DESCRIPTION OF THE ACCOMPANYING DRAWINGS FIG.",
"1 is a schematic flowchart of a method according to a first embodiment of the invention; FIG.",
"2 is a schematic flowchart of a method according to a second embodiment of the invention; FIG.",
"3 is a schematic diagram of various components in a specific embodiment of the invention; FIG.",
"4 is a schematic diagram of an operational component for acquiring a fingerprint in a specific embodiment of the invention; and FIG.",
"5 is a structural block diagram of a system according to a third embodiment of the invention.",
"DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS The main concept of the invention is to capture fingerprint images using a common camera and process the acquired fingerprint images to obtain a fingerprint.",
"Referring to FIG.",
"1, a method for identifying a fingerprint is provided according to a first embodiment of the invention, which includes: S1: adjusting a camera to focus the camera on a lens; S2: capturing continuously by the camera fingerprint images formed by a finger pressing the lens, and sending the fingerprint images to an image processing module; and S3: processing the fingerprint images by the image processing module so as to acquire the fingerprint.",
"In contrast to the prior art, in the first embodiment of the invention, the camera is focused on the lens, fingerprint images of a finger pressing on the lens are acquired, and the fingerprint images are sent to the image processing module for processing so as to acquire the fingerprint.",
"In this way, only a common camera is required for acquiring the fingerprint according to the invention, which is easy to operate at a low cost.",
"Referring to FIG.",
"2 to FIG.",
"4, on the basis of the first embodiment, before step S3, the second embodiment further includes: S31: adhering an anti-fingerprint film on the outside of the lens.",
"Since the camera specially used for fingerprint collection is typically expensive, existing common cameras can be used in all the embodiments of the invention, such as a common high-definition camera (the number of pixels are equal to or greater than 5 million).",
"In the embodiment of the invention, a fingerprint identification auxiliary structure 3 may be added to the auto-focus camera 2 of a common PDA or a cell-phone 1.The auxiliary structure is a hollow lens cone, the camera 2 can be covered by one side of the lens cone, and the lens 4 can be provided on the other side of the lens cone.",
"An anti-fingerprint film is adhered on the outside of the lens 4.The film can directly contact the finger.",
"When the finger presses on the lens 4, no fingerprint is left.",
"After the finger is pressed on the lens 4, an image containing the finger texture can be formed on the other side of the lens 4, and the fingerprint can penetrate the lens 4 and be captured by the camera 2.According to the invention, the focus of the camera 2 is aligned with the center of the lens 4, and the auto-focus camera can be used for achieving auto-focusing.",
"Before step S2, the method further includes: S21: setting the camera to be in a continuous previewing state; and S22: connecting the camera to the image processing module via a CSI interface.",
"The purpose of setting the camera to be in a continuous previewing state is to acquire fingerprint images in real-time and make a timely adjustment as required, including adjusting the position of finger pressing or the focal length so as to obtain the fingerprint image with the best resolution.",
"The images are continuously sent to the image processing module.",
"The image processing module can be a device that can perform image processing, such as a CPU.",
"The step S2 specifically includes: S20: determining by the camera whether a brightness component value Y is smaller than a preset value, according to the YUV format; executing S23 of capturing fingerprint images by the camera and sending the fingerprint images to the image processing module, if the brightness component value Y is smaller than the preset value; otherwise, capturing continuously by the camera fingerprint images formed by a finger pressing the lens, and returning to the execution of S21.Specifically, the previewed image is sent by the camera to the CPU for processing, via the CSI interface, and the determination according to the YUV format is made.",
"When the finger is not pressed, the image captured by the camera has a high brightness; and after the finger is pressed, the image is dark.",
"Therefore, it is determined whether the finger is pressed by determining a change of image brightness signal Y value.",
"In a practical operation, the preset brightness value can be set.",
"If the brightness signal Y value is smaller than the preset brightness value, it indicates that the finger is pressed, and then the camera captures the fingerprint image; and if the brightness signal Y value is larger than the preset brightness value, it indicates that no finger pressing is sensed, and the user needs to press the finger again; the image is further acquired, the determination steps are repeated, and the captured image is sent to the CPU for image processing.",
"The step S3 of processing the fingerprint image specifically includes: S32: converting the fingerprint image into a black-and-white gray-scale image by the image processing module and performing binarization on the black-and-white gray-scale image so as to obtain a black-and-white texture image; S33: extracting feature values of the black-and-white texture image and sending the feature values to a system backstage for comparison; S34: acquiring a fingerprint according to the comparison result.",
"Specifically, the processing procedure is: the color picture of the fingerprint image captured by the camera is converted into a black-and-white gray-scale image, and then the binarization processing is performed on the image so as to obtain the black-and-white texture image of the fingerprint; feature values of the black-and-white texture image are extracted, the identified feature values are sent to the system backstage for comparison.",
"Whether the fingerprint identification is successful is fed back according to the comparison result.",
"If the fingerprint identification is successful, the fingerprint is obtained; otherwise, the next operation is waited for.",
"In contrast to the prior art, according to the second embodiment of the invention, an anti-fingerprint film is adhered on the outside of the lens so as to obtain a clear fingerprint of the finger, and it is determined whether finger pressing is sensed according to the change of the brightness so as to automatically realize capturing of image.",
"Image conversion and feature value extraction are performed on the images in the image processing module for eventually obtaining the fingerprint.",
"In this way, only a common camera is required for acquiring the fingerprint according to the invention, which is easy to operate at a low cost.",
"As shown in FIG.",
"5, a system 100 for identifying fingerprint is provided according to a third embodiment of the invention, which includes: a camera 110, a lens 120 and an image processing module 130, and the system performs the following steps: S1: adjusting the camera 110 to focus the camera 110 on the lens 120; S2: capturing continuously by the camera 110 fingerprint images formed by a finger pressing the lens, and sending the fingerprint images to the image processing module 130; and S3: processing the fingerprint images by the image processing module 130 so as to acquire the fingerprint.",
"Before step S3, the following step is further included: S31: adhering an anti-fingerprint film on the outside of the lens 120.Before step S2, the following step is further included: S21: setting the camera 110 to be in a continuous previewing state; and S22: connecting the camera 110 to the image processing module 130 via a CSI interface.",
"The step S2 specifically includes: S20: determining by the camera 110 whether a brightness component value Y is smaller than a preset value according to the YUV format; executing S23 of capturing fingerprint images by the camera 110 and sending the fingerprint images to the image processing module 130, if the brightness component value Y is smaller than the preset value; otherwise, returning to the execution of S21.The step S3 specifically includes: S32: converting the fingerprint image into a black-and-white gray-scale image by the image processing module 130 and performing binarization on the black-and-white gray-scale image so as to obtain a black-and-white texture image; S33: extracting feature values of the black-and-white texture image and sending the feature values to a system backstage for comparison; S34: acquiring a fingerprint according to the comparison result."
]
] |
Patent_15871150
|
[
[
"METHOD AND SYSTEM FOR DECODING TWO-DIMENSIONAL CODE USING WEIGHTED AVERAGE GRAY-SCALE ALGORITHM",
"The invention provides a method and system for decoding two-dimensional code using weighted average gray-scale algorithm.",
"The method comprises: segmenting a received two-dimensional code image into bit regions each containing one bit data; presetting a shifting threshold, and shifting four original boundary lines of the bit region outwards by a distance of the shifting threshold to obtain four preset boundary lines; calculating an average gray-scale value of the bit region using the weighted average algorithm by taking an overlapping area between pixels inside the four preset boundary lines and the bit region as a weight; binarizing the two-dimensional code image according to the average gray-scale value of the bit region; and decoding the two-dimensional code image.",
"The influence of the pixels which have an overlapping area with the bit region on the average gray-scale value of the bit region is considered, and the decoding accuracy and success rate are high."
],
[
"1.A method for decoding two-dimensional code using weighted average gray-scale algorithm, characterized by comprising: segmenting a received two-dimensional code image into bit regions each containing one bit data; presetting a shifting threshold, and shifting four original boundary lines of the bit region outwards by a distance of the shifting threshold to obtain four preset boundary lines; calculating an average gray-scale value of the bit region using the weighted average algorithm by taking an overlapping area between pixels inside the four preset boundary lines and the bit region as a weight; binarizing the two-dimensional code image according to the average gray-scale value of the bit region; and decoding the binarized two-dimensional code image.",
"2.The method for decoding two-dimensional code using weighted average gray-scale algorithm according to claim 1, wherein the shifting threshold is less than or equal to the width of one pixel.",
"3.The method for decoding two-dimensional code using weighted average gray-scale algorithm according to claim 1, wherein a solution of calculating the overlapping area between pixels inside the four preset boundary lines and the bit region includes: finding all the pixels inside the four preset boundary lines; selecting one selected point from the pixels and recording coordinates of the selected point and a position relationship between the selected point and boundary lines of the pixels; calculating distances from the selected point to the four original boundary lines of the bit region and their position relationships; calculating a length and a width of the overlapping area between the pixels and the bit region; and calculating the overlapping area between the pixels and the bit region.",
"4.The method for decoding two-dimensional code using weighted average gray-scale algorithm according to claim 3, wherein the selected point is any one of the pixels.",
"5.The method for decoding two-dimensional code using weighted average gray-scale algorithm according to claim 3, wherein calculating an average gray-scale value of the bit region using the weighted average algorithm by taking the overlapping area between pixels inside the four preset boundary lines and the bit region as a weight specifically includes: assuming that k represents the number of pixels inside the four preset boundary lines, Pi, represents pixels, where i=1, 2, .",
".",
".",
", k, Si represents the overlapping area between the pixels Pi and the bit region, S represents the area of the bit region, Gpi represents the gray-scale value of the pixels Pi, and Gave represents the average gray-scale value of the bit region, then the average gray-scale value Gave of the bit region is: Gave = ∑ i = 1 k Gp i * S i / S .",
"6.The method for decoding two-dimensional code using weighted average gray-scale algorithm according to claim 3, wherein calculating an average gray-scale value of the bit region using the weighted average algorithm by taking the overlapping area between pixels inside the four preset boundary lines and the bit region as a weight specifically includes: assuming that k represents the number of pixels inside the four preset boundary lines, Pi represents pixels, where i=1, 2, .",
".",
".",
", k, Si represents the overlapping area between the pixels Pi and the bit region, Gpi represents the gray-scale value of the pixel Pi, and Gave represents the average gray-scale value of the bit region, then the average gray-scale value Gave of the bit region is: Gave = ∑ i = 1 k Gp i * S i ∑ i = 1 k S i .",
"7.The method for decoding two-dimensional code using weighted average gray-scale algorithm according to claim 1, wherein binarizing the two-dimensional code image according to the average gray-scale value of the bit region specifically includes: calculating a gray-scale threshold of the two-dimensional code image according to the average gray-scale value of the bit region by using the Otsu method; and binarizing the bit region according to the gray-scale threshold so as to obtain the binarization of the two-dimensional code image.",
"8.The method for decoding two-dimensional code using weighted average gray-scale algorithm according to claim 1, wherein binarizing the two-dimensional code image according to the average gray-scale value of the bit region specifically includes: calculating a gray-scale threshold of the two-dimensional code image according to the average gray-scale value of the bit region by using the average value algorithm; and binarizing the bit region according to the gray-scale threshold so as to obtain the binarization of the two-dimensional code image.",
"9.A system for decoding two-dimensional code using weighted average gray-scale algorithm, characterized by comprising: a segmenting module which is configured for segmenting a received two-dimensional code image into bit regions each containing only one bit data; a shifting module which is configured for shifting four original boundary lines of the bit region outwards by a distance of the shifting threshold to obtain four preset boundary lines; a calculating module which is configured for calculating an average gray-scale value of the bit region using the weighted average algorithm by taking the overlapping area between pixels inside the four preset boundary lines and the bit region as a weight; a binarizing module which is configured for binarizing the two-dimensional code image according to the average gray-scale value of the bit region; and a decoding module which is configured for decoding the binarized two-dimensional code image."
],
[
"<SOH> BACKGROUND OF THE INVENTION <EOH>The two-dimensional code decoding algorithm based on image processing can be generally divided into six steps: acquiring an image, preprocessing image, positioning and correcting, reading data, error correcting and decoding.",
"The basic step of image preprocessing includes gray-scale transformation, image filtration, threshold segmentation and edge detection, and binarization is included in the threshold segmentation.",
"After enhancement algorithms such as contrast adaption and brightness adjustment are applied to the obtained gray-scale image, the background and the target in the image are segmented using the binarized image algorithm, and the image is converted into an image with only two colors of black and white for subsequent use in decoding.",
"However, due to factors such as different media on which the two-dimensional code is attached, different lighting environments and different imaging systems, the two-dimensional code images captured by the two-dimensional code reading devices may differ greatly, and the influence of noise, image lighting unevenness and a contrast that is too large or too small will all make the conversion of the two-dimensional code image into a binarized image be very complicated.",
"However, the effect of image binarization process has a direct influence on the two-dimensional code reading effect.",
"The binarization methods in the prior art have some deficiencies in dealing with a complicated background, and cannot well handle problems such as darkness, uneven lighting, too large contrast, or too small contrast, thus failing to obtain a good binarization effect.",
"Chinese invention patent publication No.",
"CN104517089A discloses a two-dimensional code decoding system and method.",
"The decoding method includes: binarizing a two-dimensional code image to obtain a binarized image, and the binarization processing includes: segmenting the two-dimensional code image to obtain several block regions; acquiring gray-scale values of all the pixels in each of the block regions, and obtaining a gray-scale value of each of the block regions according to the gray-scale values of all the pixels; calculating a gray-scale threshold of each of the block regions according to an average gray-scale value of the predetermined range in which the block region is located; binarizing pixels in the block region to obtain a binarized image, according to the gray-scale threshold corresponding to each of the block regions; and decoding the binarized image to obtain information content contained in the two-dimensional code.",
"In binarizing the code image, by segmenting the code image into blocks, the average gray-scale value of a predetermined range of the block region in which the pixel is located is considered when determining whether the pixel in each block region is black or white during the process of restoring the code image.",
"The two-dimensional code image is segmented into n*n block regions, where n>1.The gray-scale value of a certain block region is determined according to the relationship between the contrast factor and the difference between the maximum gray-scale value and the minimum gray-scale value in the block region in combination with the gray-scale values of other block regions adjacent to the block region.",
"Only the sum of gray-scale values of all the pixels, the maximum gray-scale value, the minimum gray-scale value and the number of pixels in the block region are considered for the contrast factor, without considering the area factor of the block region, and the area of the block region is related to the division of the block regions."
],
[
"<SOH> SUMMARY OF THE INVENTION <EOH>"
],
[
"CROSS REFERENCE TO RELATED APPLICATIONS The present application is a Continuation Application of PCT Application No.",
"PCT/CN2016/090990 filed on Jul.",
"22, 2016, which claims the benefit of Chinese Patent Application No.",
"201510437265.2 filed on Jul.",
"23, 2015.All the above are hereby incorporated by reference.",
"FIELD OF THE INVENTION The invention relates to the field of two-dimensional code technology, and in particular, to a method and system for decoding two-dimensional code using weighted average gray-scale algorithm.",
"BACKGROUND OF THE INVENTION The two-dimensional code decoding algorithm based on image processing can be generally divided into six steps: acquiring an image, preprocessing image, positioning and correcting, reading data, error correcting and decoding.",
"The basic step of image preprocessing includes gray-scale transformation, image filtration, threshold segmentation and edge detection, and binarization is included in the threshold segmentation.",
"After enhancement algorithms such as contrast adaption and brightness adjustment are applied to the obtained gray-scale image, the background and the target in the image are segmented using the binarized image algorithm, and the image is converted into an image with only two colors of black and white for subsequent use in decoding.",
"However, due to factors such as different media on which the two-dimensional code is attached, different lighting environments and different imaging systems, the two-dimensional code images captured by the two-dimensional code reading devices may differ greatly, and the influence of noise, image lighting unevenness and a contrast that is too large or too small will all make the conversion of the two-dimensional code image into a binarized image be very complicated.",
"However, the effect of image binarization process has a direct influence on the two-dimensional code reading effect.",
"The binarization methods in the prior art have some deficiencies in dealing with a complicated background, and cannot well handle problems such as darkness, uneven lighting, too large contrast, or too small contrast, thus failing to obtain a good binarization effect.",
"Chinese invention patent publication No.",
"CN104517089A discloses a two-dimensional code decoding system and method.",
"The decoding method includes: binarizing a two-dimensional code image to obtain a binarized image, and the binarization processing includes: segmenting the two-dimensional code image to obtain several block regions; acquiring gray-scale values of all the pixels in each of the block regions, and obtaining a gray-scale value of each of the block regions according to the gray-scale values of all the pixels; calculating a gray-scale threshold of each of the block regions according to an average gray-scale value of the predetermined range in which the block region is located; binarizing pixels in the block region to obtain a binarized image, according to the gray-scale threshold corresponding to each of the block regions; and decoding the binarized image to obtain information content contained in the two-dimensional code.",
"In binarizing the code image, by segmenting the code image into blocks, the average gray-scale value of a predetermined range of the block region in which the pixel is located is considered when determining whether the pixel in each block region is black or white during the process of restoring the code image.",
"The two-dimensional code image is segmented into n*n block regions, where n>1.The gray-scale value of a certain block region is determined according to the relationship between the contrast factor and the difference between the maximum gray-scale value and the minimum gray-scale value in the block region in combination with the gray-scale values of other block regions adjacent to the block region.",
"Only the sum of gray-scale values of all the pixels, the maximum gray-scale value, the minimum gray-scale value and the number of pixels in the block region are considered for the contrast factor, without considering the area factor of the block region, and the area of the block region is related to the division of the block regions.",
"SUMMARY OF THE INVENTION Technical Problem The technical problem to be addressed by the invention is to provide a method and system for decoding two-dimensional code using weighted average gray-scale algorithm, which have more accurate average gray-scale values of image division regions.",
"In order to solve the above technical problem, technical solutions according to the invention are provided as follows.",
"A method for decoding two-dimensional code using weighted average gray-scale algorithm includes: segmenting a received two-dimensional code image into bit regions each containing one bit data; presetting a shifting threshold, and shifting four original boundary lines of the bit region outwards by a distance of the shifting threshold to obtain four preset boundary lines; calculating an average gray-scale value of the bit region using the weighted average algorithm by taking an overlapping area between pixels inside the four preset boundary lines and the bit region as a weight; binarizing the two-dimensional code image according to the average gray-scale value of the bit region; and decoding the binarized two-dimensional code image.",
"The invention has the following advantageous effects: all the pixels associated with the bit region are found by shifting the four original boundary lines of the bit region outwards by a distance of the shifting threshold, the average gray-scale value of the bit region is calculated using the weighted average algorithm by taking an overlapping area between the pixels and the bit region as a weight, thus reducing the error in decoding the two-dimensional code, eliminating the decoding difficulty caused by the distortion of the two-dimensional code image and the insignificant gray-scale contrast or the like due to environmental factors such as photographing light and angle, and avoiding a case where there is no gray-scale value in the bit region due to the fact that no pixel falls completely into the bit region, which presents a high decoding success rate.",
"A system for decoding two-dimensional code using weighted average gray-scale algorithm includes: a segmenting module which is configured for segmenting a received two-dimensional code image into bit regions each containing one bit data; a shifting module which is configured for shifting four original boundary lines of the bit region outwards by a distance of the shifting threshold to obtain four preset boundary lines; a calculating module which is configured for calculating an average gray-scale value of the bit region using the weighted average algorithm by taking the overlapping area between pixels inside the four preset boundary lines and the bit region as a weight; a binarizing module which is configured for binarizing the two-dimensional code image according to the average gray-scale value of the bit region; and a decoding module which is configured for decoding the binarized two-dimensional code image.",
"The invention has the following advantageous effects: the received two-dimensional code image is segmented into bit regions corresponding to the bit data, and then the bit regions are binarized so as to facilitate fast decoding of the two-dimensional code image; the searching range for the pixels influencing the gray-scale value of the bit region is expanded to a region whose distance from the four original boundary lines of the bit region is within the shifting threshold range, thus avoiding unsuccessful decoding due to the fact that there is no pixel in the bit region; the average gray-scale value of the bit region is calculated using the weighted average algorithm by taking the overlapping area between the pixels inside the four preset boundary lines and the bit region as a weight, so the influence of image distortion and environmental factors such as photographing light and angle on the two-dimensional code image can be eliminated, thus presenting high decoding accuracy and success rate.",
"BRIEF DESCRIPTION OF THE ACCOMPANYING DRAWINGS FIG.",
"1 is a flowchart of a method for decoding two-dimensional code using weighted average gray-scale algorithm according to an embodiment of the invention; and FIG.",
"2 is a schematic diagram of the weighted average algorithm for bit regions of a two-dimensional code image according to a first embodiment of the invention.",
"DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS In order to illustrate the technical solutions, the objects and effects of the invention in detail, embodiments are described below in conjunction with the accompanying drawings.",
"The critical concept of the invention is to calculate the average gray-scale value of the bit region using the weighted average algorithm by taking the overlapping area between the pixels and the bit region as a weight.",
"The influence of gray-scale values of the pixels which have an overlapping area with the bit region on the average gray-scale value of the bit region is fully considered, thus eliminating the influence of environmental factors on the average gray-scale value of the bit region and improving the success rate of decoding the two-dimensional code image.",
"Technical term involved in the invention is listed in table 1.TABLE 1 technical term interpretation weighted average algorithm typically meaning using a number of observation values of the same one variable arranged in temporal sequence in the past and using the temporal sequence number as a weight to calculate the weighted arithmetic average value of observation values; in the present application, meaning using the overlapping area between the pixels and the bit region as a weight and using the gray-scale values of pixels as observation values to calculate the weighted arithmetic average value of observation values, that is, the average gray-scale value of the bit region.",
"Referring to FIG.",
"1, a specific embodiment of the invention is described as follows.",
"A method for decoding two-dimensional code using weighted average gray-scale algorithm includes: segmenting a received two-dimensional code image into bit regions each containing one bit data; presetting a shifting threshold, and shifting four original boundary lines of the bit region outwards by a distance of the shifting threshold to obtain four preset boundary lines; calculating an average gray-scale value of the bit region using the weighted average algorithm by taking an overlapping area between pixels inside the four preset boundary lines and the bit region as a weight; binarizing the two-dimensional code image according to the average gray-scale value of the bit region; and decoding the binarized two-dimensional code image.",
"Further, the shifting threshold is less than or equal to the width of one pixel.",
"As can be seen from the above description, if a pixel falls outside the bit region, there will be no influence on the average gray-scale value of the bit region, and therefore, the shifting threshold should be less than or equal to the width of one pixel.",
"Further, a solution of calculating the overlapping area between pixels inside the four preset boundary lines and the bit region includes: finding all the pixels inside the four preset boundary lines; selecting one selected point from the pixels and recording coordinates of the selected point and a position relationship between the selected point and boundary lines of the pixels; calculating distances from the selected point to the four original boundary lines of the bit region and their position relationships; calculating a length and a width of the overlapping area between the pixels and the bit region; and calculating the overlapping area between the pixels and the bit region.",
"As can be seen from the above description, by selecting a selected point from the pixels, distances from the selected point to the four original boundary lines of the bit region and their position relationships are firstly calculated, and then the overlapping area between the pixels and the bit region is calculated.",
"The calculation of the overlapping area between regions is converted into the calculation of a point-to-line distance, thus simplifying the data processing step and improving the operation efficiency and accuracy.",
"Further, the selected point is any one of the pixels.",
"As can be seen from the above description, if a corner point among the pixels is selected as the selected point, there is an advantage of simplifying calculation.",
"Of course, the selected point may be any one of the pixels, as long as the position relationships between the selected point and the boundary lines of the pixels can be determined.",
"The boundary lines of the pixels can be also found easily, and the overlapping area between the pixels and the bit region is further calculated.",
"Further, calculating an average gray-scale value of the bit region using the weighted average algorithm by taking the overlapping area between pixels inside the four preset boundary lines and the bit region as a weight specifically includes: assuming that k represents the number of pixels inside the four preset boundary lines, Pi represents pixels, where i=1, 2, .",
".",
".",
", k, Si represents the overlapping area between the pixels Pi and the bit region, S represents the area of the bit region, Gpi represents the gray-scale value of the pixels Pi, and Gave represents the average gray-scale value of the bit region, then the average gray-scale value Gave of the bit region is: Gave = ∑ i = 1 k Gp i * S i / S .",
"As can be seen from the above description, by using the gray-scale value of the pixel as an observation value and using the overlapping area between the pixels and the bit region as a weight, the average gray-scale value of the bit region is obtained by dividing the sum of the products of the observation values and the weight by the area of the bit region.",
"The average gray-scale value of the bit region is obtained using the weighted average algorithm, and the influence of the gray-scale value of each pixel on the average gray-scale value of the bit region is fully considered, thus improving the decoding success rate.",
"Further, calculating an average gray-scale value of the bit region using the weighted average algorithm by taking the overlapping area between pixels inside the four preset boundary lines and the bit region as a weight specifically includes: assuming that k represents the number of pixels inside the four preset boundary lines, Pi represents pixels, where i=1, 2, .",
".",
".",
", k, Si represents the overlapping area between the pixels Pi and the bit region, Gpi represents the gray-scale value of the pixel Pi, and Gave represents the average gray-scale value of the bit region, then the average gray-scale value Gave of the bit region is: Gave = ∑ i = 1 k Gp i * S i ∑ i = 1 k S i .",
"As can be seen from the above description, by using the gray-scale value of the pixel as an observation value and using the overlapping area between the pixels and the bit region as a weight, the average gray-scale value of the bit region is obtained by dividing the sum of the products of the observation values and the weight by the sum of the all the overlapping areas.",
"The average gray-scale value of the bit region is obtained using the weighted average algorithm, and the influence of the gray-scale value of each pixel on the average gray-scale value of the bit region is fully considered, thus improving the decoding success rate.",
"Further, binarizing the two-dimensional code image according to the average gray-scale value of the bit region specifically includes: calculating a gray-scale threshold of the two-dimensional code image according to the average gray-scale value of the bit region by using the Otsu method; and binarizing the bit region according to the gray-scale threshold so as to obtain the binarization of the two-dimensional code image.",
"As can be seen from the above description, by calculating the gray-scale threshold of the two-dimensional code image using the Otsu method, the probability of misclassifying the background color and the foreground color can be reduced, and the correctness of decoding the two-dimensional code image is improved.",
"Further, binarizing the two-dimensional code image according to the average gray-scale value of the bit region specifically includes: calculating a gray-scale threshold of the two-dimensional code image according to the average gray-scale value of the bit region by using the average value algorithm; and binarizing the bit region according to the gray-scale threshold so as to obtain the binarization of the two-dimensional code image.",
"As can be seen from the above description, for a two-dimensional image whose dark color region and light color region have the same area, calculating the gray-scale threshold of the two-dimensional code image using the average value algorithm has the advantage of fast and convenient calculation.",
"Referring to FIG.",
"1 and FIG.",
"2, a first embodiment of the invention is described as follows.",
"A method for decoding two-dimensional code using weighted average gray-scale algorithm includes: segmenting a received two-dimensional code image into bit regions each containing one bit data; presetting a shifting threshold, and shifting four original boundary lines of the bit region outwards by a distance of the shifting threshold to obtain four preset boundary lines, the shifting threshold being less than or equal to the width of one pixel; Referring to FIG.",
"2, calculating an average gray-scale value of the bit region using the weighted average algorithm by taking the overlapping area between pixels inside the four preset boundary lines and the bit region as a weight specifically includes: finding all the pixels inside the four preset boundary lines, and assuming that four pixels are found; selecting a pixel at the upper left corner among the pixels as the selected point, i.e., P0, P1, P2 and P3 respectively, and recording coordinates of the selected point and its position relationship with boundary lines of the pixels, assuming that both the length and width of each of the pixels are 1; calculating distances from the selected point to the four original boundary lines of the bit region and their position relationships, specifically including: assuming that the four original boundary lines lie in straight lines l0, l1, l2, l3, and calculating distances from P0 to the four original boundary lines l0, l1, l2, l3: calculating a distance x1 from P0 to l0, where if P0 is on the left of l0, the result is negative; and if P0 is on the right of l0, the result is positive; translating the straight line l2 which intersects with the straight line l0 and is nearer to P0 so that the translated straight line l2 passes through P0, setting the intersection point of the translated straight line l2 and the straight line l0 to be a point Q, then calculating a distance between two points P0 and Q, namely the distance from P0 to l0; assuming that the linear equation of straight line l0 is y=kx+b, bringing coordinates of a point into r=y−k*x−b to obtain the value of r; if r>0, then P0 is on the right of l0, x1=d; if r=0, then P0 is on l0, x1=0; and if r<0, P0 is on the left of l0, x1=−d; calculating a distance x2 from a straight line passing through P0 and parallel to the straight line l0 to the straight line l3 using a similar method; calculating a distance y1 from a straight line passing through P0 and perpendicular to the straight line l0 to the straight line l2 using a similar method; calculating a distance y2 from a straight line passing through P0 and parallel to the straight line l2 to the straight line l4 using a similar method; calculating a length fx and a width fy of the overlapping area between the pixels and the bit region, specifically including: fx=0, if x1<=−1; fx=1+x1, if −1<x1<0 and x2<=−1; fx=x1−x2, if −1<x1<0 and x2>−1; fx=1, if x1>=0 and x2<=−1; fx=x2, if x1>=0 and −1<x2<0; fx=0, if x1>=0 and x2>=0; fy=0, if y1<=−1; fy=1+y1, if −1<y1<0 and y2<=−1; fy=y1−y2, if −1<y1<0 and y2>−1; fy=1, if y1>=0 and y2<=−1; fy=y2, if y1>=0 and −1<y2<0; fy=0, if y1>=0 and y2>=0; calculating the overlapping area S0=fx*fy between the pixels and the bit region; calculating S1, S2 and S3 using the above-described method; where S represents the area of the bit region, S=S0+S1+S2+S3, Gpi represents the gray-scale value of the pixel Pi, and Gave represents the average gray-scale value of the bit region, then the average gray-scale value Gave of the bit region is: Gave = ∑ i = 1 k Gp i * S i / S ; calculating the average gray-scale value of the bit region using the above-described method; binarizing the two-dimensional code image according to the average gray-scale value of the bit region, specifically including: calculating a gray-scale threshold of the two-dimensional code image according to the average gray-scale value of the bit region using the Otsu method; and binarizing the bit region according to the gray-scale threshold so as to obtain the binarization of the two-dimensional code image; and decoding the binarized two-dimensional code image.",
"A system for decoding two-dimensional code using weighted average gray-scale algorithm includes: a segmenting module which is configured for segmenting a received two-dimensional code image into bit regions each containing only one bit data; a shifting module which is configured for shifting four original boundary lines of the bit region outwards by a distance of the shifting threshold to obtain four preset boundary lines; a calculating module which is configured for calculating an average gray-scale value of the bit region using the weighted average algorithm by taking the overlapping area between pixels inside the four preset boundary lines and the bit region as a weight; a binarizing module which is configured for binarizing the two-dimensional code image according to the average gray-scale value of the bit region; and a decoding module which is configured for decoding the binarized two-dimensional code image.",
"A second embodiment of the invention is described as follows.",
"A system for decoding two-dimensional code using weighted average gray-scale algorithm includes: a segmenting module which is configured for segmenting a received two-dimensional code image into bit regions each containing only one bit data; a shifting module which is configured for shifting four original boundary lines of the bit region outwards by a distance of the shifting threshold to obtain four preset boundary lines; a calculating module which is configured for calculating an average gray-scale value of the bit region using the weighted average algorithm by taking the overlapping area between pixels inside the four preset boundary lines and the bit region as a weight; a binarizing module which is configured for binarizing the two-dimensional code image according to the average gray-scale value of the bit region; and a decoding module which is configured for decoding the binarized two-dimensional code image.",
"In summary, with the method and system for decoding two-dimensional code using weighted average gray-scale algorithm according to the invention, all the pixels having an overlapping area with the bit region are found by shifting four original boundary lines of the bit region outwards by a distance of the shifting threshold, the average gray-scale value of the bit region is calculated using the weighted average algorithm by taking the overlapping area between the pixels and the bit region as a weight and taking the gray-scale values of pixels as observation values, and the gray-scale threshold for the binarization of the two-dimensional code image is calculated using the Otsu method or the average value algorithm, thus reducing the error in decoding the two-dimensional code.",
"The method can eliminate the decoding difficulty caused by the distortion of the two-dimensional code image and the insignificant gray-scale contrast or the like due to environmental factors such as photographing light and angle, and avoid a case where there is no gray-scale value in the bit region due to the fact that no pixel falls completely into the bit region.",
"The system has high decoding correctness and success rate."
]
] |
Patent_15871161
|
[
[
"ULTRASOUND IMAGE DISPLAY SET-UP FOR REMOTE DISPLAY TERMINAL",
"An ultrasound system enables simplified setup of a remote terminal for display of ultrasound images acquired by the ultrasound system.",
"An image acquired by the ultrasound system is processed by or with display parameters for different viewing conditions or devices, such as display gamma correction, ambient lighting, or image quality.",
"A plurality of versions of an image with slightly different display appearances are exported to the remote terminal, where a viewer can view all of the image versions simultaneously.",
"The viewer selects the best image, and the display characteristics of the selected image are used for images subsequently exported from the ultrasound system to the remote terminal."
],
[
"1.An ultrasound system, comprising: a processor configured to produce a plurality of versions of ultrasound image data such that each version of the ultrasound image data is configured to produce a different display appearance when displayed; a data storage device configured to, in response to a user selection of at least one version of the ultrasound image data, store a parameter for the at least one version of the ultrasound image data selected by the user, wherein the parameter is further associated with an identifier of a remote terminal where the user selection input was entered; and an export processor configured to export ultrasound image data to the remote terminal based at least in part on the parameter.",
"2.The ultrasound system of claim 1, wherein the remote terminal comprises a display screen configured to display the plurality of versions of the ultrasound image data of the single ultrasound image plane simultaneously.",
"3.The ultrasound system of claim 1, wherein the parameter comprises a display device gamma characteristic, image brightness or image contrast.",
"4.The ultrasound system of claim 3, wherein the remote terminal comprises a PACS system or PACS system image archive.",
"5.The ultrasound system of claim 3, wherein the remote terminal comprises one of a plurality of workstations of a PACS system.",
"6.The ultrasound system of claim 1, further comprising a network input and a network output configured to connect the ultrasound system and the remote terminal.",
"7.The ultrasound system of claim 1, wherein the remote terminal and the ultrasound system are not on a common network, wherein the plurality of versions of the image are exported to the remote terminal on portable media.",
"8.The ultrasound system of claim 1, further comprising an input device by which ambient light condition data can be input into the ultrasound system, wherein the image processor is configured to produce the plurality of versions of the image for export based at least in part on the ambient light condition data.",
"9.The ultrasound system of claim 1, further comprising an input device by which image file size data is input into the ultrasound system, wherein the image processor is configured to produce the plurality of versions of the image for export based at least in part on the image file size data.",
"10.The ultrasound system of claim 9, wherein the image file size comprises the file size of images stored on a network image archive.",
"11.The ultrasound system of claim 1, further comprising an input device by which image quality data is input into the ultrasound system, wherein the image processor is configured to produce the plurality of versions of the image for export based at least in part on the image quality data.",
"12.The ultrasound system of claim 1, wherein the data storage device is further configured to store the parameter for the version of the selected image in lookup table form.",
"13.The ultrasound system of claim 1, wherein the processor is configured to produce a plurality of versions of the image for export from an input initiated from the ultrasound system.",
"14.The ultrasound system of claim 1, wherein the processor is configured to produce a plurality of versions of the image for export from an input initiated from the remote terminal.",
"15.The ultrasound system of claim 1, wherein the data storage device is configure to store a plurality of parameters, each in association with an identifier of a different remote terminal, wherein the export processor is configured to export images based at least in part on the identifier of the remote terminal."
],
[
"This application is a continuation application of U.S. patent application Ser.",
"No.",
"15/585,271 filed May 3, 2017 which is a continuation application of Ser.",
"No.",
"14/402,353 filed Nov. 20, 2014, which is a national stage filing under 35 U.S.C.",
"§ 371(c) of International Appl.",
"No.",
"PCT/IB2013/053788, filed Mar.",
"11, 2013, which claims priority to U.S. Prov.",
"Appl.",
"No.",
"61/650,241, filed May 22, 2012, the disclosures of which are incorporated herein by reference in their entirety.",
"This invention relates to medical diagnostic ultrasound systems and, in particular, to the export and display of images from an ultrasound system to a remote display terminal such as a review station on a PACS (picture archiving and communication) system.",
"A typical ultrasonic imaging system will have dozens of control setting which can be adjusted by a user to best display an image of anatomy of the body.",
"For instance, when imaging tissue a sonographer will be able to set the line density, focal zones, dynamic range, transmit and receive frequencies, resolution penetration, transmit power, sector width, grayscale mapping, number of multilines, and numerous other imaging variables.",
"When imaging blood flow in the colorflow mode some of the imaging variables which may be adjusted are wall filter settings, color map, frame rate, velocity range, frequency compounding, filter settings, and Doppler steering angle.",
"With so many possible settings it is not surprising that ultrasound systems have control software that stores parameter presets for different types of imaging exams.",
"A sonographer starting an obstetrical exam, for example, can select the presets for an OB exam and the ultrasound system will invoke a set of presets commonly used for most OB exams.",
"The sonographer may be satisfied and use the system-selected presets, or can adjust the preset values and save the new set of presets as his or her preferred presets for a particular patient or type of exam.",
"Unless a sonographer is always satisfied by the system presets for an exam type, even customizing and saving sets of preset parameters for different exams can be a time consuming task.",
"Moreover even custom presets can become unsatisfactory or obsolete as equipment is upgraded and new probes become available for standard exams.",
"However, U.S. Pat.",
"No.",
"6,951,543 (Roundhill) has provided a solution to this problem.",
"That is to process an ultrasound image with a variety of different parameter values, such as the standard system preset values and common variations thereof.",
"The sonographer does not have adjust numerous parameters and controls and see what difference each incremental or new parameter variation produces.",
"Instead, the sonographer views a gallery of images, each of which has been processed by at least a slightly different set of acquisition or image processing parameters.",
"The sonographer then simply picks the image that looks the best, and the parameters of that image are then applied for a particular exam.",
"The selection process is far simpler than painstakingly adjusting numerous ultrasound system parameters.",
"The reading of ultrasound images in order to arrive at a diagnosis of a disease condition often does not occur on the ultrasound system which acquired the images.",
"In many hospitals and clinics a sonographer may acquire the ultrasound images by scanning a patient, and the images of the patient are then transmitted to a diagnostic workstation or terminal where a cardiologist or radiologist will view the images, make a diagnosis, and prepare a diagnostic report.",
"At times the images may be stored on a PACS archive server from which a physician can access the images for diagnosis.",
"The workstation or terminal where the images are read may be equipped with special diagnostic software such as the QLAB diagnostic ultrasound analysis software package available from Philips Healthcare in Andover, Mass., USA, which facilitates the diagnosis of ultrasound images and the reporting of a diagnosis.",
"When images are viewed on a new terminal or display screen, they are often not viewed under the same conditions as they were on the ultrasound system which acquired the images, causing subtle anatomic differences to appear differently.",
"The review workstation or terminal may be in a more dimly or brightly lighted room, for instance, which will affect the appearance of the images in other environments.",
"Different display screens will cause subtle image differences, as will the image file size and image compression which may be used to archive images.",
"The physician could go through an adjustment procedure to optimize the images on the review terminal (e.g., GSDF) but this is usually not done due to its complexity and the time involved in evaluating different display options.",
"Many doctors simply accept the factory default settings on their terminals and settle for sub-optimal images.",
"Accordingly there is a need to simplify the optimization of a workstation, terminal or display screen for the optimal viewing of diagnostic ultrasound images which have been exported from the acquiring ultrasound system.",
"In accordance with the principles of the present invention, a diagnostic ultrasound system has a setup procedure that optimizes images for display on remote workstations, terminals, and display screens.",
"The ultrasound system enables a user to select one ultrasound image acquired on the ultrasound system which is exported to a remote display terminal with a number of different display settings applied to the image.",
"A user on the remote display terminal views a gallery of the same image with different display settings such as different display gamma correction, file sizes, brightness and/or contrast.",
"The user then selects the image from the gallery with the best appearance on the remote terminal and the display parameters of the selected image are stored on the ultrasound system.",
"Each time a new image or images are exported to the terminal, they are thereafter sent with the selected display settings, assuring that they will be remotely displayed as the remote user desires.",
"Should the remote user have a change of mind or a new display with different characteristics be installed, the process can repeated to update the display parameters applied to images exported to the remote terminal.",
"In the drawings: FIG.",
"1 illustrates in block diagram form an ultrasound system constructed in accordance with the principles of the present invention.",
"FIG.",
"2 illustrates an ultrasound system networked with a PACS system.",
"FIGS.",
"3a-3f illustrate display screens for setting up an ultrasound system on a network with user preferences for exported images.",
"FIG.",
"4 illustrates a method for setting up and exporting a gallery of images with different display settings to a remote terminal.",
"FIG.",
"5 illustrates a gallery of images with different display settings which are presented to a user for selection of the best image.",
"Referring first to FIG.",
"1 an ultrasonic diagnostic imaging system constructed in accordance with the principles of the present invention is shown in block diagram form.",
"An ultrasound probe 112 includes an array 114 of ultrasonic transducers that transmit and receive ultrasound signals.",
"The array may be a one dimensional linear or curved array for two dimensional imaging, or may be a two dimensional matrix of transducer elements for electronic beam steering in three dimensions.",
"Three dimensional image data sets and images are preferably acquired using a two dimensional array transducer.",
"Three dimensional images may also be acquired with a mechanically swept one dimensional array probe.",
"The ultrasonic transducers in the array 114 transmit ultrasonic energy and receive echoes returned in response to this transmission.",
"A transmit/receive (“T/R”) switch 22 is coupled to the ultrasonic transducers in the array 114 and switches between the transmit and receive phases of pulse-echo imaging.",
"The times at which the transducer array is activated to transmit signals may be synchronized to an internal system clock (not shown), or may be synchronized to a bodily function such as the heart cycle, for which a heart cycle waveform is provided by an ECG device 26.When the heartbeat is at the desired phase of its cycle as determined by the waveform provided by ECG device 26, the probe is commanded to acquire an ultrasonic image.",
"The frequency and bandwidth of the ultrasonic energy transmitted by the transducer array is controlled by control signals generated by a central controller 28.Echoes from the transmitted ultrasonic energy are received by the transducers of the array 114, which generate echo signals that are coupled through the T/R switch 22 and digitized by analog to digital (“A/D”) converters 30 when the system uses a digital beamformer.",
"Analog beamformers may also be used.",
"The A/D converters 30 sample the received echo signals at a sampling frequency controlled by a signal fs generated by the central controller 28.The desired sampling rate dictated by sampling theory is at least twice the highest frequency of the received passband, and might be on the order of at least 30-40 MHz.",
"Sampling rates higher than the minimum requirement are also desirable.",
"The echo signal samples from the individual transducers of the array 114 are delayed and summed by a beamformer 32 to form coherent echo signals.",
"For 3D imaging with a two dimensional array, it is preferable to partition the beamformer between a microbeamformer located in the probe and the main beamformer in the system mainframe as described in U.S. Pat.",
"No.",
"6,013,032 (Savord) and U.S. Pat.",
"No.",
"6,375,617 (Fraser).",
"The digital coherent echo signals are then filtered by a digital filter 34.In the illustrated system the transmit frequency and the receiver frequency are individually controlled so that the beamformer 32 is free to receive a band of frequencies which is different from that of the transmitted band such as a harmonic frequency band.",
"The digital filter 34 bandpass filters the signals, and can also shift the frequency band to a lower or baseband frequency range.",
"The digital filter could be a filter of the type disclosed in U.S. Pat.",
"No.",
"5,833,613, for example.",
"Filtered echo signals from tissue are coupled from the digital filter 34 to a B mode processor 36 for conventional B mode processing.",
"Filtered echo signals of a contrast agent, such as microbubbles, are coupled to a contrast signal processor 38.Contrast agents are often used to more clearly delineate the endocardial wall in relation to contrast agent in the blood pool of the heart chamber, or to perform perfusion studies of the microvasculature of the myocardium as described in U.S. Pat.",
"No.",
"6,692,438 for example.",
"The contrast signal processor 38 preferably separates echoes returned from harmonic contrast agents by the pulse inversion technique, in which echoes resulting from the transmission of multiple pulses to an image location are combined to cancel fundamental signal components and enhance harmonic components.",
"A preferred pulse inversion technique is described in U.S. Pat.",
"No.",
"6,186,950, for instance.",
"The filtered echo signals from the digital filter 34 are also coupled to a Doppler processor 40 for conventional Doppler processing to produce velocity and power Doppler signals.",
"The output signals from these processors may be displayed as planar images, and are also coupled to a 3D image processor 42 for the rendering of three dimensional images, which are stored in a 3D image memory 44.Three dimensional rendering may be performed as described in U.S. Pat.",
"No.",
"5,720,291, and in U.S. Pat.",
"Nos.",
"5,474,073 and 5,485,842, all of which are incorporated herein by reference.",
"The signals from the contrast signal processor 38, the B mode processor 36 and the Doppler processor 40, and the three dimensional image signals from the 3D image memory 44 are coupled to a Cineloop® memory 48, which stores image data for each of a large number of ultrasonic images.",
"The image data are preferably stored in the Cineloop memory 48 in sets, with each set of image data corresponding to an image obtained at a respective time.",
"The image data in a data set can be used to display a parametric image showing tissue perfusion at a respective time during the heartbeat.",
"The sets of image data stored in the Cineloop memory 48 may also be stored in a permanent memory device such as a disk drive or digital video recorder for later analysis.",
"The images in the Cineloop memory are displayed on a display 52.When a sonographer begins a particular ultrasound exam the sonographer will generally start by selecting the appropriate probe for the exam, such as a phased array probe for a cardiac exam or a curved linear array for an abdominal or OB exam.",
"The sonographer may then set up and adjust all the imaging parameters for the exam by adjusting the switches and controls on the system control panel 150.Generally, however, the sonographer will configure the system by calling up the set of standard or previously customized parameters for the type of exam being commenced.",
"These preset parameters are stored in a configuration data memory 152 and are applied to the central controller 28 when selected by the sonographer.",
"The central controller then uses the imaging parameters, as adjusted by the sonographer, to set up and conduct the imaging procedure selected by the sonographer.",
"In larger hospitals and clinics the ultrasound system is generally connected to a network over which ultrasound images can be communicated.",
"A network interface 54 enables the ultrasound system to communicate over the network and is coupled to a network connection in the hospital or clinic.",
"A typical network with a PACS system is shown in FIG.",
"2.In FIG.",
"2, four ultrasound systems 102-106, a PACS image workstation 244, and a PACS network server 242 are connected in a local area network as indicated by LAN 240.The LAN 240 may be wired or wireless and may include both Ethernet hub systems and multi-switch, multi-layered networks.",
"The network server 242 for a PACS system will have extended storage 234 for retention of a large volume of ultrasound images and reports produced by the network's ultrasound systems and image review stations.",
"A user at the image workstation 244 can access the network server and individual active ultrasound systems of the network, or interact over the Internet with other externally accessible networks and devices.",
"In accordance with the principles of the present invention the ultrasound system of FIG.",
"1 is configured to export ultrasound images for viewing on a workstation or terminal on a network by use of an export configuration wizard illustrated in FIGS.",
"3a-3f.",
"The starting screen of FIG.",
"3a informs the user that the wizard will guide them through the selection of various export configuration choices for an optimum configuration.",
"The starting screen presents four topics for configuration.",
"For an initial configuration all four topics are used.",
"If the user wants to adjust a configuration that has been implemented previously, the user is given the choice of selecting only the topic(s) to be modified.",
"The subsequent drawings illustrate an initial configuration setup.",
"When the user clicks on the Next button of the starting screen the Network Configuration screen is presented as shown in FIG.",
"3b.",
"On this screen the user can enter the identification of the network server.",
"The next line on this screen allows the user to specify whether the DHCP (dynamic host configuration protocol) is being used, whether the ultrasound system will have a fixed IP address on the network or a variable (dynamic) IP address assigned by the host server.",
"If the ultrasound system has a fixed IP address it is entered on the next line.",
"The user clicks the Next button and the PACs Configuration screen appears as shown in FIG.",
"3c.",
"Here the user can select a PACS system from a pulldown list that is on the network and already identified by the wizard.",
"Alternatively the user can click the Custom PACs Configuration radio button and is presented with a screen for entry of data that defines a custom PACS configuration.",
"The user clicks the Next button and is presented with the FIG.",
"3d screen.",
"On the Image Quality and File Size Selection screen of FIG.",
"3d the user defines one of the parameters that affects how images exported from the ultrasound system appear on the screen of a workstation or terminal on the network.",
"The PACS system or other storage device may store ultrasound images with a predetermined amount of compression or a file size limit.",
"The size of the image file is directly related to the perceived image quality since finer detail can be shown in an image of a larger file size.",
"In this example the user drags a slider 62 horizontally to set the desired image quality.",
"An arrow above the File Size graphic moves correspondingly, showing the user the file size recommended for the desired image quality.",
"The user will generally balance the desired image quality and file size to obtain the highest quality images within the bounds of the permitted size of images archived on the PACS system.",
"The user clicks the Next button and is presented with the screen of FIG.",
"3e.",
"The Image Acquisition & Review Environment screen enables a user to set another parameter that affects how images acquired by the ultrasound system will appear on the remote terminal.",
"The patient scanning room may be only dimly lighted and consequently the user may employ low brightness and contrast settings to view the ultrasound images as they are acquired.",
"The physician reading the images may be viewing them in a brightly lighted room, which means that the view settings on the ultrasound system will not be suited to the ambient lighting conditions of the reading room.",
"Or, the reverse may be true.",
"With the screen of FIG.",
"3e the user can adjust slider 64 to indicate the ambient lighting conditions in the scanning room as low, high, or intermediate.",
"The user can also check the GSDF (grayscale standard display function) box if the display at the remote terminal has this DICOM calibrated display function, in which case further display optimization is not necessary.",
"After the user has adjusted the last set of display parameters the user is presented with the closing screen of FIG.",
"3f.",
"If the user has finished specifying the PACS and image export parameters the user can click on the Finish button to conclude the export configuration process.",
"If the user has encountered a problem or has a question, the user can click on the question mark symbol to request technical assistance in completing the configuration process.",
"With the export parameters and network protocols thus set, the user now prepares an export of images that will be displayed with different display parameters as exemplified by the export screens of FIG.",
"4.In this set of screens, identified as the Export IQ Wizard, the user is guided through the acquisition of an ultrasound image and its export with different processing for viewing and selection on a remote terminal.",
"The first screen 70 instructs the user to prepare the ultrasound system to scan an image under the condition generally preferred by the user, such as in an appropriately lighted room.",
"If the display at the remote terminal is DICOM GSDF calibrated, this compensation procedure is not needed, however.",
"The user will then click the DICOM GSDF Enabled radio button and proceed to Finish this compensation procedure, as indicated by screen 72.When the user clicks the Continue button on screen 70 to proceed with the compensation procedure, the user is shown screen 74.This screen instructs the user to acquire an ultrasound image with the ultrasound system.",
"The user can do this by scanning a patient at this time, in which case the user will click the Continue button on screen 74 and will scan a subject.",
"After the user has acquired a satisfactory image the user presses Acquire 1 on the ultrasound system control panel 150.Alternatively, the user can select a previously acquired satisfactory image from the image storage on the ultrasound system.",
"Again, the user indicates that a satisfactory image has been obtained by pressing Acquire 1 on the ultrasound system control panel 150.With the basic compensation image identified, the user selects a destination to which compensation selection images are to be exported using screen 76.In this example the user has selected Archive Server 1, a PACS image storage device on the network where the images are stored with the image processing employed by the PACS system.",
"Screen 76 gives examples of different export destinations including one called PC Media for ultrasound systems not connected to a reading station by a network.",
"If this radio button is selected the screen 78 appears to instruct the user to insert media into the ultrasound system such as a portable flash drive.",
"The images are then transferred to the flash drive which can be carried to the reading workstation for the compensation setup.",
"In this example the user has selected Archive Server 1 and a set of compensation images such as that of FIG.",
"5 is sent to the Archive Server 1 PACS system.",
"Screen 80 is then displayed to the user, instructing the user to view the compensation images on the PACS system display terminal and select the image that best represents the basic image acquired by or selected on the ultrasound system.",
"FIG.",
"5 is an example of a set of compensation images 200 that are exported to the PACS system and viewed on a review station on the PACS system such as terminal 244 in FIG.",
"2.Each of the twenty-five compensation images has been processed by the controller 28 or contains slightly different display parameters that will affect its appearance on a display screen.",
"For instance, each of the twenty-five images can be processed by a slightly different display device gamma correction characteristic.",
"Or each image will have a slightly different brightness or contrast to compensate for different ambient lighting conditions.",
"The user views all twenty-five images simultaneously on the remote terminal display screen and selects the one which appears the best on that display screen.",
"The user can click on the up and down arrows in the selection box 210 at the bottom of the screen to select the number of the best image.",
"In this example the user has selected image number 13.Alternatively the user can click on an image to select it, such as clicking on image 202 to select that image as the best compensated image.",
"When the user makes the selection the identity of the selection is sent back to the ultrasound system where the display parameters of the selected image are stored in a lookup table in the configuration data memory 152 of the system in association with the export destination device, Archive Server 1 in this example.",
"Thereafter, whenever images are exported from the ultrasound system to Archive Server 1, the display parameters stored in the lookup table in memory for that PACS system are applied to the images prior to export so that they are properly compensated to appear on the PACS terminal just as they appeared on the ultrasound system.",
"A reviewer on the PACS workstation will then be viewing an exported image with the same image quality and characteristics as seen by the sonographer who acquired the image.",
"Screen 80 of FIG.",
"4 also gives the user the ability to select the desired image from the screen on the ultrasound system.",
"The user can make the selection on screen 80, then click the Finish button to conclude the image export compensation process.",
"A PACS system may have multiple review stations or terminals on the system and each may have a different display characteristic.",
"In that event, the foregoing compensation process may be performed for each display device of each station or terminal.",
"The ultrasound system will then use the correspondingly identified display station when exporting images for display on one of the terminals.",
"A review station or terminal can also be replaced or modified with a different display screen or used by a clinician with different viewing preferences, requiring that the compensation be performed again for the new or different display device or reviewer.",
"In that event, the Export IQ Wizard of FIG.",
"4 can be called up on the ultrasound system to send a new set of compensation screens to the terminal and the compensation selection process performed again and new display parameters for the terminal stored in the configuration data memory 152.Alternatively, the clinician at the review station can send a query to the ultrasound system, requesting transmission of another set of compensation images.",
"The user of the remote terminal can thereby adjust or update the display parameters of images exported from the ultrasound system without interrupting the workflow of the sonographer who is using the ultrasound system.",
"The present invention has applicability in other medical imaging modalities, particularly in the use of “secondary captures,” image information which is derived from a primary diagnostic image.",
"For example, an MRI image of the body may show an invasive instrument such as a biopsy needle which a clinician wants to view in well defined resolution.",
"The optimization technique of the present invention can be used to optimize the displayed images for optimal viewing of this secondary capture, the needle in the MRI image."
]
] |
Patent_15871164
|
[
[
"LED structure and luminaire for continuous disinfection",
"A LED structure, a lighting fixture and a method of providing white light illumination.",
"The LED structure comprises a substrate; a light emitting area defined on the substrate as a cavity; a first type of light emitting semiconductor source with bactericidal characteristics mounted in the cavity; a second type of light emitting semiconductor source mounted in the cavity with ability to excite the wavelength conversion material to generate white light; and a wavelength conversion material layer formed on top of the light emitting semiconductor sources.",
"The invention enables disinfection by a lighting source or a luminaire visibly apparent to human as a white light source that is neither harmful to a human nor creates discomfort."
],
[
"1.A LED structure comprised of a substrate; a light emitting area defined on the substrate as a cavity; at least two light emitting semiconductor sources with bactericidal and germicidal characteristics mounted in the cavity; wherein both of the light emitting semiconductor sources have ability to excite a wavelength conversion material to generate white light and at least one of the light emitting semiconductor sources have a peak wavelength emission above ultraviolet wavelengths and below 410 nm, preferably substantially at 405 nm, and the full width half maximum of the emission is below 30 nm; and a wavelength conversion material layer formed on top of the light emitting semiconductor sources to be excited by the light emitting semiconductor sources.",
"2.The LED structure according to claim 1, wherein the wavelength conversion material layer is adapted to have a low absorption, allowing at least 10% of the emitted light to be transmitted through the wavelength conversion material layer, at emission wavelengths above ultraviolet wavelengths and below 410 nm.",
"3.The LED structure according to claim 2, wherein the wavelength conversion material layer is bleached by a high intensity emission of the light emitting semiconductor sources.",
"4.The LED structure according to claim 1, comprising a second light emitting semiconductor source mounted in the cavity and having a peak wavelength emission substantially at 470 nm.",
"5.The LED structure according to claim 1, wherein the first type of light emitting semiconductor source has a peak light emission in the wavelength range of 365 to 430 nm, and the full width half maximum of the emission is below 30 nm and third emission peak of a wavelength conversion material in the wavelength range of 450 to 750 nm.",
"6.The LED structure according to claim 1, wherein CRI of visible spectrum is over 70 and the color temperature is between 2000 K and 8000 K and that at least 5% optical power is emitted between 365 nm and 430 nm wavelength range.",
"7.The LED structure according to claim 1, wherein the light emitting semiconductor sources are connected via an electrical circuit layer to electrical control interface such that the light emitting semiconductor sources can be independently controlled.",
"8.A LED structure comprised of a substrate, a light emitting area defined on the substrate as a cavity, a light emitting semiconductor source mounted in the cavity, a wavelength conversion material layer formed on the top of the light emitting, semiconductor source, and an electrical circuit layer for connecting the said light emitting semiconductor source to electrical control interface, the light emitting semiconductor source has a peak wavelength emission above ultraviolet wavelengths and below 410 nm, preferably substantially at 405 nm, and the full width half maximum of the emission is below 30 nm.",
"9.The LED structure according to claim 8, wherein the light emitting semiconductor source has the peak light emission in the wavelength range of 365 to 410 nm, and the full width half maximum of the emission is below 30 nm.",
"10.The LED structure according to claim 8, comprising a second light emitting semiconductor source mounted in the cavity and having a peak wavelength emission substantially at 470 nm.",
"11.The LED structure according to claim 8, wherein the emission area comprises of a wavelength conversion material with a light emission band being in the wavelength range of 425 to 750 nm, with the peak emission being in the wavelength range of 450 to 650 nm and the full width half maximum of the emission is at least 50 nm.",
"12.The LED structure according to claim 8, wherein there is only one type of light emitting semiconductor source having a center emission located close to 405 nm.",
"13.The LED structure according to claim 8, wherein the first type of light emitting semiconductor source has a peak light emission in the wavelength range of 365 to 430 nm, and the full width half maximum of the emission is below 30 nm and local emission peak of a wavelength conversion material in the wavelength range of 450 to 750 nm.",
"14.The LED structure according to claim 8, wherein the first type of light emitting semiconductor source has a peak light emission in the wavelength range of 365 to 430 nm, and the full width half maximum of the emission is below 30 nm and third emission peak of a wavelength conversion material in the wavelength range of 450 to 750 nm.",
"15.The LED structure according to claim 8, wherein CRI of visible spectrum is over 70 and the color temperature is between 2000 K and 8000 K and that at least 5% optical power is emitted between 365 nm and 430 nm wavelength range.",
"16.A lighting fixture comprising: a LED structure comprised of a substrate; a light emitting area defined on the substrate as a cavity; at least two light emitting semiconductor sources with bactericidal and germicidal characteristics mounted in the cavity; wherein both of the light emitting semiconductor sources have ability to excite a wavelength conversion material to generate white light and at least one of the light emitting semiconductor sources have a peak wavelength emission above ultraviolet wavelengths and below 410 nm, preferably substantially at 405 nm, and the full width half maximum of the emission is below 30 nm; and a wavelength conversion material layer formed on top of the light emitting semiconductor sources to be excited by the light emitting semiconductor sources.",
"17.A lighting fixture comprising: a LED structure comprised of a substrate, a light emitting area defined on the substrate as a cavity, a light emitting semiconductor source mounted in the cavity, a wavelength conversion material layer formed on the top of the light emitting, semiconductor source, and an electrical circuit layer for connecting the said light emitting semiconductor source to electrical control interface, the light emitting semiconductor source has a peak wavelength emission above ultraviolet wavelengths and below 410 nm, preferably substantially at 405 nm, and the full width half maximum of the emission is below 30 nm.",
"18.A method of treating an object by a LED structure comprised of a substrate; a light emitting area defined on the substrate as a cavity; at least two light emitting semiconductor sources with bactericidal and germicidal characteristics mounted in the cavity; wherein both of the light emitting semiconductor sources have ability to excite a wavelength conversion material to generate white light and at least one of the light emitting semiconductor sources have a peak wavelength emission above ultraviolet wavelengths and below 410 nm, preferably substantially at 405 nm, and the full width half maximum of the emission is below 30 nm; and a wavelength conversion material layer formed on top of the light emitting semiconductor sources to be excited by the light emitting semiconductor sources, for obtaining germicidial, anti-bacterial, fungicidal or anti-viral effect.",
"19.A method of treating an object by a LED structure comprised of a LED structure comprised of a substrate, a light emitting area defined on the substrate as a cavity, a light emitting semiconductor source mounted in the cavity, a wavelength conversion material layer formed on the top of the light emitting, semiconductor source, and an electrical circuit layer for connecting the said light emitting semiconductor source to electrical control interface, the light emitting semiconductor source has a peak wavelength emission above ultraviolet wavelengths and below 410 nm, preferably substantially at 405 nm, and the full width half maximum of the emission is below 30 nm, for obtaining germicidial, anti-bacterial, fungicidal or anti-viral effect.",
"20.A lighting fixture facilitating white light illumination and continuous disinfection functionality comprising at least one integrated LED source having a first emission, being non-perceptible to human eye, in the range of 360 to 430 nm and a full width half maximum of less than 30 nm, with an additional emission peak being perceptible to human eye as a white light with maximum emission in the range of 430 to 700 nm.",
"21.A lighting fixture facilitating white light illumination and continuous disinfection functionality comprising at least one integrated source having a first emission, being non-perceptible to human eye, in the range of 395 to 408 nm and a full width half maximum of less than 5 nm; and a second emission being perceptible to human eye as a white light with maximum emission in the range of 450 to 700 nm."
],
[
"<SOH> BACKGROUND ART <EOH>It is well known that ultra-violet (UV) sources have bactericidal and fungicidal effects, well suited for disinfection.",
"Deep UV (UVC) sources are known to effectively prevent bacterial growth on surfaces and are widely used as germicidal sources.",
"However, the drawback of usage of UVC sources such as Mercury lamps is the fact that UVC light is harmful for humans and thus prevents its use in presence of people.",
"The mechanism behind the deep UV disinfection is known to be the cracking of DNA molecules, which have particularly strong absorption between 260-290 nm.",
"It is also known that longer wavelengths produce also bactericidal effects, although based on different physical mechanism.",
"UVA light at 365 nm is known to inhibit bacterial growth and also blue/violet light produces similar growth blocking effects.",
"Although the bactericidal effect is less strong at blue/violet wavelengths it can be exploited in continuously operating disinfection lights.",
"The 405 nm light is well known to cause reactive oxygen species (ROS) generation in cells.",
"These negatively charged oxygen ions in turn prevent cell metabolism and effectively suppress e.g.",
"growth of bacterial colonies.",
"While the intensity of the disinfection light is of primary importance, it is the total dose, expressed in terms of J/m 2 , accumulated on the surface or on the objects, which ultimately define the disinfection power.",
"Any lower intensity source with suitable emission spectrum can be used for disinfection as long as the exposure times are long enough but still of practical value.",
"However, again the human presence sets boundaries for such lights.",
"International regulations and safety guidelines are defined by the International Commission on Non-Ionizing Radiation Protection (ICNIRP) and IEC standard IEC-62471.Again, the ICNIRP defines ultra-violet wavelengths to be 100-400 nm.",
"If the radiation source has a short wavelength emission, say below 410 nm, and this short wavelength emission is the dominating intensity or color, humans are commonly experiencing discomfort.",
"Known growth lights for plant growth and photosynthesis comprise blue and red light sources that are sometimes accompanied with white light sources.",
"Hence they are not addressing issues relating to antibacterial and fungicidal function.",
"A light source applying LEDs and UV germicidal lamp is disclosed in CN 104056289 A.",
"However, again such assembly is not suitable for general lighting due to detrimental effects of UV light to humans.",
"A LED source with disinfection capability in closed environment is presented in EP 2554583 A1.Again such source emitting wavelengths below 300 nm is not suitable for general lighting due to detrimental effects of UV light to humans.",
"According to our laboratory tests a combination of individual, spatially separated LEDs with 405 nm emission and individual white light LEDs results in a light source that causes discomfort.",
"A light source based on individually packaged LEDs does not produce a smooth and uniform light field.",
"Particularly point sources with intensive short wavelength emission are disturbing.",
"It is necessary to provide a source in which the short wavelength point sources are not distinctively visually appearing between the white light LEDs.",
"However, physical overlaying of the white light LEDs with 405 nm LEDs is not straightforward or possible.",
"An example of spatially mixing the source is shown in US8398264.A diffuser plate is used in conjunction with Fresnel type lens to provide uniform emissions and to avoid direct visibility of individual short wavelength emitters in the source plane.",
"The known diffuser based constellation is complex and expensive."
],
[
"<SOH> SUMMARY OF INVENTION <EOH>To solve above discussed problems it is an object of the present invention to provide a method of white light illumination using an integrated light emitting diode structure with an adjustable emission spectrum with disinfection capability.",
"It is an aspect of certain embodiments to provide an integrated LED structure functioning as a white light source and comprising; a substrate, at least one or a plurality of emission areas, and an electrical two or three wire control interface.",
"It is another objective to prevent the discomfort perceived by humans from radiation source having a short wavelength emission, which is the dominating intensity or color.",
"The present invention is based on the concept of providing a LED structure comprised of a substrate; a light emitting area defined on the substrate as a cavity; a first type of light emitting semiconductor source with bactericidal and germicidal characteristics mounted in the cavity; and a second type of light emitting semiconductor source mounted in the cavity with ability to excite the wavelength conversion material to generate white light.",
"In another embodiment, the LED structure is comprised of a substrate, a light emitting area defined on the substrate as a cavity, a light emitting semiconductor source mounted in the cavity, a wavelength conversion material layer formed on the top of the light emitting semiconductor source, and an electrical circuit layer, optionally on the top surface of the substrate, for connecting the said light emitting semiconductor source to electrical control interface.",
"In another embodiment, the LED structure is comprised of a substrate, a light emitting area defined on the substrate as a cavity, a light emitting semiconductor source mounted in the cavity, a wavelength conversion material layer formed on the top of the light emitting, semiconductor source, and an electrical circuit layer for connecting the said light emitting semiconductor source to electrical control interface, the light emitting semiconductor source has a peak wavelength emission above ultraviolet wavelengths and below 410 nm, preferably substantially at 405 nm, and the full width half maximum of the emission is below 30 nm.",
"Typically, there is wavelength conversion material layer formed on top of the light emitting semiconductor sources, and an electrical circuit layer for connecting the light emitting semiconductor sources to electrical control interface.",
"The present invention also provides a lighting fixture facilitating white light illumination and continuous disinfection functionality comprising at least one integrated LED source having a first emission, which is non-perceptible to human eye, in the range of 360 to 430 nm and a full width half maximum of less than 30 nm, and a second emission peak, which is perceptible to human eye as a white light, with maximum emission in the range of 430 to 700 nm.",
"In preferred embodiments the emitters are of two different types and have emission peaks near or at wavelength of 405 nm and near or at wavelength of 450 nm.",
"More specifically the present invention is characterized by what is stated in the characterizing parts of the independent claims.",
"Considerable advantages are obtained.",
"Thus, the present invention provides an integrated LED structure and a luminaire which achieve a continuous disinfection process.",
"The invention enables disinfection by a lighting source or a luminaire visibly apparent to human as a white light source that is neither harmful to humans nor creates discomfort.",
"This aim is achieved by overlaying the short wavelength emission with white light emission.",
"Such a white light source or a luminaire is suitable for the general illumination purposes while simultaneously providing means to disinfect exposed surfaces and objects.",
"The said emission area typically comprises one or several LED semiconductor diodes, which are technically reliable and economically viable, as light emitters to provide the light emission.",
"The use of electromagnetic radiation at wavelength of 405 nm as disclosed in this invention is safe.",
"The new type of LED sources disclosed avoids the disturbing effect of the short wavelength visible light.",
"In specific embodiments, the invention also achieves a light source that provides for disinfection of an object and also simulated photosynthesis of plants.",
"Thus, the present integrated LED structure can be incorporated into white light sources for providing disinfection with bactericidal and fungicidal, anti-viral (germicidal), and photosynthesis effects.",
"The present invention provides disinfection functionality for general lighting and photosynthesis lighting enabled by the disclosed integrated LED structure and luminaire.",
"Spatial integration gives an integrated LED structure which has both 405 nm emission source and a 450 nm blue emission source buried under a wavelength conversion layer, in very near vicinity of each other.",
"In a preferred embodiment, independent control of the two emissions, namely the 405 nm radiation and the white light emission, are provided for.",
"This allows for the control of intensity of 405 nm radiation so that in situations where no white light is necessarily needed, only 405 nm radiation can be used and with maximum intensity, while white light radiation can be turned off.",
"And conversely when e.g.",
"humans, or in some applications animals, are present the radiation intensity of 405 nm can be turned low, or completely off, while maintaining suitable level of white light illumination.",
"With the integrated LED structure the white light quality parameters, such as CRI and CCT, remain constant as the 405 nm emission has negligible contribution to the luminous flux or illuminance.",
"The integrated structure provides means for spatially mounting the emitter with bactericidal and germicidal effect in close vicinity of the white light source, and in some embodiment even to combine them.",
"When the intensity of the bactericidal short wavelength is appropriately chosen with respect to the white light intensity, the source appears as a normal white light source to human eye.",
"Furthermore the spatial arrangement guarantees that the emission of 405 nm is not distinguishable for humans due to overlaying white light emission."
],
[
"FIELD OF INVENTION The present invention relates to artificial lighting arrangements and methods used for disinfection by light.",
"In particular, the present invention relates to the field of optoelectronics and white light emitting diodes (LEDs) providing bactericidal effects.",
"The present invention relates to the applications of an integrated LED structure and continuously operating disinfection luminaire.",
"BACKGROUND ART It is well known that ultra-violet (UV) sources have bactericidal and fungicidal effects, well suited for disinfection.",
"Deep UV (UVC) sources are known to effectively prevent bacterial growth on surfaces and are widely used as germicidal sources.",
"However, the drawback of usage of UVC sources such as Mercury lamps is the fact that UVC light is harmful for humans and thus prevents its use in presence of people.",
"The mechanism behind the deep UV disinfection is known to be the cracking of DNA molecules, which have particularly strong absorption between 260-290 nm.",
"It is also known that longer wavelengths produce also bactericidal effects, although based on different physical mechanism.",
"UVA light at 365 nm is known to inhibit bacterial growth and also blue/violet light produces similar growth blocking effects.",
"Although the bactericidal effect is less strong at blue/violet wavelengths it can be exploited in continuously operating disinfection lights.",
"The 405 nm light is well known to cause reactive oxygen species (ROS) generation in cells.",
"These negatively charged oxygen ions in turn prevent cell metabolism and effectively suppress e.g.",
"growth of bacterial colonies.",
"While the intensity of the disinfection light is of primary importance, it is the total dose, expressed in terms of J/m2, accumulated on the surface or on the objects, which ultimately define the disinfection power.",
"Any lower intensity source with suitable emission spectrum can be used for disinfection as long as the exposure times are long enough but still of practical value.",
"However, again the human presence sets boundaries for such lights.",
"International regulations and safety guidelines are defined by the International Commission on Non-Ionizing Radiation Protection (ICNIRP) and IEC standard IEC-62471.Again, the ICNIRP defines ultra-violet wavelengths to be 100-400 nm.",
"If the radiation source has a short wavelength emission, say below 410 nm, and this short wavelength emission is the dominating intensity or color, humans are commonly experiencing discomfort.",
"Known growth lights for plant growth and photosynthesis comprise blue and red light sources that are sometimes accompanied with white light sources.",
"Hence they are not addressing issues relating to antibacterial and fungicidal function.",
"A light source applying LEDs and UV germicidal lamp is disclosed in CN 104056289 A.",
"However, again such assembly is not suitable for general lighting due to detrimental effects of UV light to humans.",
"A LED source with disinfection capability in closed environment is presented in EP 2554583 A1.Again such source emitting wavelengths below 300 nm is not suitable for general lighting due to detrimental effects of UV light to humans.",
"According to our laboratory tests a combination of individual, spatially separated LEDs with 405 nm emission and individual white light LEDs results in a light source that causes discomfort.",
"A light source based on individually packaged LEDs does not produce a smooth and uniform light field.",
"Particularly point sources with intensive short wavelength emission are disturbing.",
"It is necessary to provide a source in which the short wavelength point sources are not distinctively visually appearing between the white light LEDs.",
"However, physical overlaying of the white light LEDs with 405 nm LEDs is not straightforward or possible.",
"An example of spatially mixing the source is shown in US8398264.A diffuser plate is used in conjunction with Fresnel type lens to provide uniform emissions and to avoid direct visibility of individual short wavelength emitters in the source plane.",
"The known diffuser based constellation is complex and expensive.",
"SUMMARY OF INVENTION To solve above discussed problems it is an object of the present invention to provide a method of white light illumination using an integrated light emitting diode structure with an adjustable emission spectrum with disinfection capability.",
"It is an aspect of certain embodiments to provide an integrated LED structure functioning as a white light source and comprising; a substrate, at least one or a plurality of emission areas, and an electrical two or three wire control interface.",
"It is another objective to prevent the discomfort perceived by humans from radiation source having a short wavelength emission, which is the dominating intensity or color.",
"The present invention is based on the concept of providing a LED structure comprised of a substrate; a light emitting area defined on the substrate as a cavity; a first type of light emitting semiconductor source with bactericidal and germicidal characteristics mounted in the cavity; and a second type of light emitting semiconductor source mounted in the cavity with ability to excite the wavelength conversion material to generate white light.",
"In another embodiment, the LED structure is comprised of a substrate, a light emitting area defined on the substrate as a cavity, a light emitting semiconductor source mounted in the cavity, a wavelength conversion material layer formed on the top of the light emitting semiconductor source, and an electrical circuit layer, optionally on the top surface of the substrate, for connecting the said light emitting semiconductor source to electrical control interface.",
"In another embodiment, the LED structure is comprised of a substrate, a light emitting area defined on the substrate as a cavity, a light emitting semiconductor source mounted in the cavity, a wavelength conversion material layer formed on the top of the light emitting, semiconductor source, and an electrical circuit layer for connecting the said light emitting semiconductor source to electrical control interface, the light emitting semiconductor source has a peak wavelength emission above ultraviolet wavelengths and below 410 nm, preferably substantially at 405 nm, and the full width half maximum of the emission is below 30 nm.",
"Typically, there is wavelength conversion material layer formed on top of the light emitting semiconductor sources, and an electrical circuit layer for connecting the light emitting semiconductor sources to electrical control interface.",
"The present invention also provides a lighting fixture facilitating white light illumination and continuous disinfection functionality comprising at least one integrated LED source having a first emission, which is non-perceptible to human eye, in the range of 360 to 430 nm and a full width half maximum of less than 30 nm, and a second emission peak, which is perceptible to human eye as a white light, with maximum emission in the range of 430 to 700 nm.",
"In preferred embodiments the emitters are of two different types and have emission peaks near or at wavelength of 405 nm and near or at wavelength of 450 nm.",
"More specifically the present invention is characterized by what is stated in the characterizing parts of the independent claims.",
"Considerable advantages are obtained.",
"Thus, the present invention provides an integrated LED structure and a luminaire which achieve a continuous disinfection process.",
"The invention enables disinfection by a lighting source or a luminaire visibly apparent to human as a white light source that is neither harmful to humans nor creates discomfort.",
"This aim is achieved by overlaying the short wavelength emission with white light emission.",
"Such a white light source or a luminaire is suitable for the general illumination purposes while simultaneously providing means to disinfect exposed surfaces and objects.",
"The said emission area typically comprises one or several LED semiconductor diodes, which are technically reliable and economically viable, as light emitters to provide the light emission.",
"The use of electromagnetic radiation at wavelength of 405 nm as disclosed in this invention is safe.",
"The new type of LED sources disclosed avoids the disturbing effect of the short wavelength visible light.",
"In specific embodiments, the invention also achieves a light source that provides for disinfection of an object and also simulated photosynthesis of plants.",
"Thus, the present integrated LED structure can be incorporated into white light sources for providing disinfection with bactericidal and fungicidal, anti-viral (germicidal), and photosynthesis effects.",
"The present invention provides disinfection functionality for general lighting and photosynthesis lighting enabled by the disclosed integrated LED structure and luminaire.",
"Spatial integration gives an integrated LED structure which has both 405 nm emission source and a 450 nm blue emission source buried under a wavelength conversion layer, in very near vicinity of each other.",
"In a preferred embodiment, independent control of the two emissions, namely the 405 nm radiation and the white light emission, are provided for.",
"This allows for the control of intensity of 405 nm radiation so that in situations where no white light is necessarily needed, only 405 nm radiation can be used and with maximum intensity, while white light radiation can be turned off.",
"And conversely when e.g.",
"humans, or in some applications animals, are present the radiation intensity of 405 nm can be turned low, or completely off, while maintaining suitable level of white light illumination.",
"With the integrated LED structure the white light quality parameters, such as CRI and CCT, remain constant as the 405 nm emission has negligible contribution to the luminous flux or illuminance.",
"The integrated structure provides means for spatially mounting the emitter with bactericidal and germicidal effect in close vicinity of the white light source, and in some embodiment even to combine them.",
"When the intensity of the bactericidal short wavelength is appropriately chosen with respect to the white light intensity, the source appears as a normal white light source to human eye.",
"Furthermore the spatial arrangement guarantees that the emission of 405 nm is not distinguishable for humans due to overlaying white light emission.",
"BRIEF DESCRIPTION OF DRAWINGS The invention will now be further described, by way of non-limiting examples, with reference to the accompanying diagrammatic drawings.",
"In the drawings: FIG.",
"1 is a graph presenting spectral weighting function of blue-hazard light FIG.",
"2 is a graph presenting spectral weighting function of blue-hazard light with typical emission spectrum of light emitting diode at 405 nm and a typical emission spectrum of a laser diode at 405 nm.",
"FIG.",
"3 is a photo of LED source for continuous disinfection luminaire with spatially combined white light emitter and low wavelength emitter in one LED source and the spectrum is spatially combined.",
"FIG.",
"4 is a schematic top side view of an integrated LED structure according to an embodiment of the present invention.",
"FIG.",
"5 is a schematic view of the cross-section of an integrated LED structure according to an embodiment of the present invention.",
"FIG.",
"6 is a graph representing a typical emission spectrum of an integrated LED structure according to an embodiment of the present invention.",
"FIG.",
"7 is a graph representing a typical emission spectrum of an integrated LED structure according to an embodiment of the present invention.",
"FIG.",
"8 is a schematic top side view of an integrated LED structure according to an embodiment of the present invention.",
"FIG.",
"9 is a schematic view of the cross-section of an integrated LED structure according to an embodiment of the present invention.",
"FIG.",
"10 is a graph representing a typical emission spectrum of an integrated LED structure according to an embodiment of the present invention.",
"FIG.",
"11 is a graph representing a typical emission spectrum of an integrated LED structure according to a further embodiment of the present invention DESCRIPTION OF EMBODIMENTS The following descriptions are merely non-limiting examples and it will be appreciated by one skilled in the art that specific details of the examples may be changed without departing from the spirit of the invention.",
"The present technology provides an integrated LED structure and a luminaire for enabling, for example, a continuous disinfection process.",
"In one embodiment, disinfection is achieved by a lighting source or a luminaire visibly apparent to human as a white light source that is firstly not harmful to a human and secondly is not creating discomfort.",
"Such a white light source or a luminaire is suitable for the general illumination purposes while simultaneously providing means to disinfect exposed surfaces and objects.",
"The present technology also achieves a light source that provides for disinfection of objects and also simulated photosynthesis of plants.",
"The disclosed integrated LED structure can be incorporated into white light source for providing disinfection with bactericidal and fungicidal, anti-viral (germicidal), anti-viral and photosynthesis effects.",
"Thus, disinfection functionality can be achieved for general lighting and photosynthesis lighting, enabled by the disclosed integrated LED structure and luminaire.",
"In an embodiment, the emission area comprises wavelength conversion material to provide means for white light emission.",
"Emission area comprises in some preferred embodiment more than one type of wavelength conversion materials.",
"The materials can be layered vertically upon each other, or horizontally with different materials adjacent to each other, or in mixed material layers, to achieve high efficiency or high color rendering index (CRI), or wanted color correction temperature (CCT).",
"The light emitters are in some cases electrically connected in series or parallel to enable a common current drive scheme.",
"The control interface has then at least one wire for providing the common drive current and least one ground wire to close the current path back to power supply.",
"However, in some cases the emitters are not connected electrically enabling independent intensity control.",
"The control interface has then at least three wires for providing the drive current independently, and at least one ground wire to close the current path back to power supply.",
"In an embodiment, the integrated LED component or package has two different types of semiconductor emitters, which can be also in independent in terms of electrical circuits.",
"In a nominal operation point the current is adjusted for both emitters are simultaneously, however, electrical circuitry being independent current is adjusted separately and the emission appears as white light in both cases, but with the emission spectrum having a spectroscopically observable double peak structure with blue emission at or near 450 nm and violet emission at or near 405 nm.",
"If the intensity of the 405 nm emission is A and the intensity of the 450 nm emission is B, the ratio A/B can be now freely adjusted with the two independent drive currents.",
"In nominal situation the ratio is adjusted so that the emission of 405 nm is distinguishable for human and is within the safety limits as discussed earlier.",
"The source is emitting white light and same time giving low intensity emission at 405 nm to provide continuous disinfection functionality.",
"In an embodiment, the intensity control is exploited dynamically depending of the human presence.",
"In the first case of no human presence the ratio A/B can be maximized.",
"In the second case of human presence the intensity A can be adjusted to a low value, and to comply with the safety standards.",
"Thus there are at least two set points of operation in typical case.",
"In the first set point of operation, the drive current is tuned up to e.g.",
"350 mA for the 405 nm emitter, while the drive current for the 450 nm emitter can be tuned down to 0 mA.",
"In the second set point the drive current is tuned down to e.g.",
"50 mA for the 405 nm emitter, and the drive current for the 450 nm emitter is tuned to e.g.",
"350 mA.",
"Thus while still maintaining the white light emission, the LED is providing illumination with bactericidal and germicidal effect.",
"Such intensity tuning is beneficial for ensuring safety in presence of humans, and to avoid exposure to high intensity radiation at 405 nm.",
"In some preferred mode of use, the dynamic intensity tuning can be exploited to adjust the emission of 405 nm after a certain total radiation dose has accumulated on the target surface.",
"This can be detected by integrating the specific wavelength signal with a detector circuit and providing the necessary feedback to control appropriately the output of the integrated LED structure.",
"This is beneficial for reducing energy consumption and to lengthen the life time of the LED by avoiding unnecessary use of the 405 nm emitter.",
"The complete emission of the white light source is formed of as a sum of the emission of the 405 nm emitter and of the emission of the 450 nm emitter, and the emission from the wavelength conversion material, which is excited by the emission of the 450 nm emitter.",
"In some embodiments the integrated LED structure comprises only one type of light emitter, preferably having a short wavelength emission below wavelength of 410 nm, and a wavelength conversion material layer formed on top of the emitter.",
"In some preferred embodiments the complete white light source emission the light emission spectrum is formed of as a sum of emission from the 405 nm emitter and the emission from the wavelength conversion material, excited by the emission at 405 nm.",
"Preferably, the light emitter is capable of high intensity emission, whereby a wavelength conversion material layer formed on top of the light emitter capable of a peak emission of light above ultraviolet wavelengths and below 410 nm, preferably substantially at 405 nm, may be bleached by the high intensity emission.",
"In an embodiment, the wavelength conversion material layer may be adapted to have a low absorption at emission wavelengths above ultraviolet wavelengths and below 410 nm.",
"Preferably the absorption is low at least at or close to emission wavelength of 405 nm.",
"The absorption of the wavelength conversion material should be adapted to allow at least 10% of the emission of the semiconductor light source to be transmitted through the wavelength conversion material layer.",
"In this way, a led structure may provide efficient disinfection at the low absorption wavelengths of the wavelength conversion material layer.",
"It should be appreciated that the adapted wavelength conversion material layer may support the high intensity emission causing bleaching of the wavelength conversion material layer.",
"In preferred embodiments the wavelength conversion material is a phosphor based e.g.",
"in YAG:Ce materials providing white light emission spectrum with CRI and CCT characteristics suitable for general lighting applications.",
"The wavelength conversion material has in this case a relatively low extinction coefficient at the wavelength range of 360 to 410 nm to avoid excessive absorption of the emission below 410 nm.",
"The said emission areas can be formed as buried shallow cavity on the top surface of the said substrate.",
"In some preferred embodiments the LED structure can comprise several emission areas in buried cavities of different heights.",
"In some embodiments the short wavelength emitter has an emission wavelength that has bactericidal, germicidal or fungicidal effects.",
"In preferred embodiments the short wavelength emission or intensity has no or negligible detrimental effects to human skin, human eyes, or human health in general.",
"In some embodiments the short wavelength emitter has an emission wavelength that has bactericidal, germicidal or fungicidal effects and the emitter is also emitting at wavelengths to support, enhance and propagate photosynthesis in plants.",
"As referred to above, in one further embodiment, the LED structure is comprised of a substrate, a light emitting area defined on the substrate as a cavity, a light emitting semiconductor source mounted in the cavity, a wavelength conversion material layer formed on the top of the light emitting semiconductor source, and an electrical circuit layer, optionally on the top surface of the substrate, for connecting the said light emitting semiconductor source to electrical control interface.",
"Specific embodiments of this embodiment include the following: LED structures, wherein the wavelength conversion material layer is adapted to have a low absorption, allowing at least 10% of the emitted light to be transmitted through the wavelength conversion material layer, at emission wavelengths above ultraviolet wavelengths and below 410 nm.",
"LED structures, wherein the wavelength conversion material layer is bleached by a high intensity emission of the light emitting semiconductor sources.",
"LED structures, comprising a second light emitting semiconductor source mounted in the cavity and having a peak wavelength emission substantially at 470 nm.",
"LED structures, wherein the light emitting semiconductor source has the peak light emission in the wavelength range of 365 to 410 nm, and the full width half maximum of the emission is below 30 nm; LED structures, wherein the emission area comprises of a wavelength conversion material with a light emission band being in the wavelength range of 425 to 750 nm, with the peak emission being in the wavelength range of 450 to 650 nm and the full width half maximum of the emission is at least 50 nm; LED structures, wherein there is only one type of light emitting semiconductor source, which has a peak light emission in the wavelength range of 365 to 430 nm, with a center emission located close to 405 nm, and the full width half maximum of the emission is below 30 nm; LED structures, wherein the first type of light emitting semiconductor source has a peak light emission in the wavelength range of 365 to 430 nm, and the full width half maximum of the emission is below 30 nm and local emission peak of a wavelength conversion material in the wavelength range of 450 to 750 nm; LED structures, wherein the first type of light emitting semiconductor source has a peak light emission in the wavelength range of 365 to 430 nm, and the full width half maximum of the emission is below 30 nm and third emission peak of a wavelength conversion material in the wavelength range of 450 to 750 nm; and LED structures, wherein CRI of visible spectrum is over 70 and the color temperature is between 2000 K and 8000 K and that at least 5% optical power is emitted between 365 nm and 430 nm wavelength range.",
"As referred to above, in one further embodiment a LED structure comprises a substrate, a light emitting area defined on the substrate as a cavity, at least two light emitting semiconductor sources with bactericidal and germicidal characteristics mounted in the cavity.",
"Both of the light emitting semiconductor sources have ability to excite a wavelength conversion material to generate white light and at least one of the light emitting semiconductor sources have a peak wavelength emission above ultraviolet wavelengths and below 410 nm, preferably substantially at 405 nm, and the full width half maximum of the emission is below 30 nm.",
"A wavelength conversion material layer is formed on top of the light emitting semiconductor sources to be excited by the light emitting semiconductor sources.",
"Specific embodiments of this embodiment include the following: LED structures comprising, wherein the wavelength conversion material layer is adapted to have a low absorption, allowing at least 10% of the emitted light to be transmitted through the wavelength conversion material layer, at emission wavelengths above ultraviolet wavelengths and below 410 nm; LED structures comprising, wherein the wavelength conversion material layer is bleached by a high intensity emission of the light emitting semiconductor sources; and LED structures comprising a second light emitting semiconductor source mounted in the cavity and having a peak wavelength emission substantially at 470 nm.",
"In an embodiment, one or more LED structures may be comprised in lighting fixtures to provide a method, the method comprising: in the presence of humans, the light source is adjusted to provide white light illumination with a bactericidal and optionally germicidal low-intensity emission in the background of the white light emission, non-perceptible to human eye; and in a situation with no humans present, the white light illumination is turned off, while the bactericidal and optionally germicidal emission is maximized.",
"Turning now to the embodiments shown in the drawings, it can be noted that in one embodiment (yellow phosphor), the LED structure is comprised of a substrate 100, an emission area inside the cavity wall 101, wavelength conversion material layer 102, an emitter with main emission centered around 405 nm wavelength 103, an emitter with main emission centered around 450 nm wavelength 104, and a three wire control interface 105.The emission area comprises the first type of LED semiconductor chip 203 emitting at between 385 nm and 430 nm, and having a full width half maximum (FWHM) emission of 5 to 20 nm.",
"The emission area comprises also a second type of LED semiconductor chip 204 emitting at between 430 nm and 500 nm, and wavelength conversion material 202 having its peak emission at between 500 nm and 700 nm and having a full width half maximum emission of about 100 nm.",
"The control interface is having a three wire structure and is to enable independent control of the said two semiconductor chips.",
"The LED structure emits a spectrum as shown in FIG.",
"5.By controlling the current of the first semiconductor chip emitting at 405 nm, the spectrum can be tuned dynamically as shown in the FIG.",
"6 (dotted and dashed lines).",
"Or by changing the wavelength conversion material as shown in the FIG.",
"6 (solid line).",
"In another embodiment (UV phosphor), the LED structure is comprised of a substrate 300, an emission area inside the cavity wall 301, wavelength conversion material 302, two emitters with main emission centered around 365 and 430 nm nm wavelength 303, and a two wire control interface 305.The emission area comprises a single type of LED semiconductor chips 403 emitting at 405 nm, and having a full width half maximum (FWHM) emission of about 14 nm.",
"The emission area also comprises of wavelength conversion material layer 402 having its relatively high extinction coefficient at 405 nm and peak emission between 500 to 700 nm and having a full width half maximum (FWHM) emission is normally more than 30 nm.",
"The control interface is having a two wire structure and is to enable electrical control of the said emitter chips.",
"The LED structure emits a spectrum as shown in FIG.",
"10.Another set of tests with spatially combined LEDs with 405 nm emission fully embedded in the white light emission, in standard Surface Mount Device (SMD) of 5630 package type, were carried out.",
"Schematic representation of this embodiment is shown in FIGS.",
"8 and 9.Two GaN semiconductor chips emitting light with center emission at 405 nm wavelength were first mounted in the 5630 package and wire bonded.",
"The chips were in close proximity of each other.",
"The wavelength conversion layer was next dispensed over these two chips in to the cavity of the 5630 package.",
"The thickness and the phosphor concentration of the wavelength conversion layer was varied in order to find optimum thickness and concentration.",
"The five samples thus have slightly varying characteristics in terms of CRI, CCT and efficiency.",
"As the 405 nm was fully embedded in the wavelength conversion layer it was not possible to visually distinguish the 405 nm emission from the white light emission.",
"The spectrum of the above structure is shown in FIG.",
"11.The solid curve in the figure depicts a typical measured spectrum of the sample LEDs.",
"The high transmission of 405 nm emission through the wavelength conversion layer was possible and was measured to be between 17 to 24 mW, while the total optical output was measured to be 116 to 126 mW.",
"These sample units had an electrical to optical conversion efficiency of 33 to 36%.",
"The CRI of the white light was 83 to 95 with CCT being 4954 to 6918 K. The below table shows the measured test results of these LED samples.",
"TABLE Wavelength Vf P Flux Fe Eff.",
"Tc Ld Lp HW Eff %.",
"Sample span (nm) (V) (mW) (lm) (mW) (lm/W) x y (K) (nm) (nm) (nm) CRI (Fe/P) 1 300-1000 3.12 351.20 24.68 123.80 70.3 0.332 0.334 5541 493.1 403.8 17.5 83 35 300-415 3.12 350.60 NA 23.12 0.0 0.173 0.005 NA 408.5 403.8 17.6 NA 7 2 300-1000 3.13 352.30 25.14 114.90 71.4 0.346 0.351 4954 574.3 403.5 18.0 87 33 300-415 3.12 351.20 NA 16.58 0.0 0.173 0.005 NA 408.5 403.5 18.0 NA 5 3 300-1000 3.13 351.80 23.96 121.20 68.1 0.320 0.344 6056 502.6 405.4 17.7 94 34 300-415 3.13 351.70 NA 22.74 0.0 0.173 0.005 NA 408.5 404.5 17.6 NA 6 4 300-1000 3.13 352.20 24.71 116.10 70.2 0.347 0.365 4974 568.6 403.7 17.4 94 33 300-415 3.18 357.40 NA 17.45 0.0 0.173 0.005 NA 406.5 403.6 17.3 NA 5 5 300-1000 3.12 350.70 24.86 115.70 70.9 0.334 0.360 5444 555.7 405.7 18.5 95 33 300-415 3.12 350.40 NA 16.80 0.0 0.173 0.005 NA 408.5 405.6 17.5 NA 5 6 300-1000 3.14 353.20 25.37 126.40 71.9 0.302 0.344 6918 496.3 403.6 17.2 93 36 300-415 nm 3.13 351.50 NA 23.84 0.0 0.173 0.005 NA 406.5 403.5 17.2 NA 7 The above-described embodiment has the additional benefit that the white light emission is without an emission peak at 450 nm.",
"As is well known blue wavelengths are considered hazardous (blue hazard).",
"With this embodiment safer white light illumination is provided.",
"It is to be understood that the embodiments of the invention disclosed are not limited to the particular structures, process steps, or materials disclosed herein, but are extended to equivalents thereof as would be recognized by those ordinarily skilled in the relevant arts.",
"It should also be understood that terminology employed herein is used for the purpose of describing particular embodiments only and is not intended to be limiting.",
"Reference throughout this specification to “one embodiment” or “an embodiment” means that a particular feature, structure, or characteristic described in connection with the embodiment is included in at least one embodiment of the present invention.",
"Thus, appearances of the phrases “in one embodiment” or “in an embodiment” in various places throughout this specification are not necessarily all referring to the same embodiment.",
"As used herein, a plurality of items, structural elements, compositional elements, and/or materials may be presented in a common list for convenience.",
"However, these lists should be construed as though each member of the list is individually identified as a separate and unique member.",
"Thus, no individual member of such list should be construed as a de facto equivalent of any other member of the same list solely based on their presentation in a common group without indications to the contrary.",
"In addition, various embodiments and example of the present invention may be referred to herein along with alternatives for the various components thereof.",
"It is understood that such embodiments, examples, and alternatives are not to be construed as de facto equivalents of one another, but are to be considered as separate and autonomous representations of the present invention.",
"Furthermore, the described features, structures, or characteristics may be combined in any suitable manner in one or more embodiments.",
"In the following description, numerous specific details are provided, such as examples of lengths, widths, shapes, etc., to provide a thorough understanding of embodiments of the invention.",
"One skilled in the relevant art will recognize, however, that the invention can be practiced without one or more of the specific details, or with other methods, components, materials, etc.",
"In other instances, well-known structures, materials, or operations are not shown or described in detail to avoid obscuring aspects of the invention.",
"While the forgoing examples are illustrative of the principles of the present invention in one or more particular applications, it will be apparent to those of ordinary skill in the art that numerous modifications in form, usage and details of implementation can be made without the exercise of inventive faculty, and without departing from the principles and concepts of the invention.",
"Accordingly, it is not intended that the invention be limited, except as by the claims set forth below.",
"INDUSTRIAL APPLICABILITY The disclosed integrated LED structure has applications for example but not limited to in food production and processing sites, airplanes and hospitals.",
"The ability to have white light illumination and simultaneously having disinfection functionality can greatly reduce infection diseases.",
"Particularly interesting applications are refrigerators at domestic use.",
"In such closed environments low-cost, energy efficient integrated LED structure can be applied in very efficient manner.",
"While the refrigerator's door is closed the emission of short wavelength disinfection emission can be tuned to high intensity and white light can be turned off.",
"Again during anyone opening the door the emission of the short wavelength can be turned off and the white light emission can be turned on.",
"Another application for continuous disinfection with white light is found with fruit, vegetable, fish and meat desks in grocery stores.",
"Use of continuous disinfection white light in such places would reduce risks of spreading infections while improving the shelf life of fresh products.",
"In operating rooms in hospitals, as well as in patient rooms and airplanes white lights with disinfection functionality can be applied to reduce risk for infections.",
"Another use in greenhouses and food factories to provided photosynthesis (so call growth) for plants and simultaneously provide germicidal or fungicidal effects for the plants.",
"REFERENCE SIGNS LIST 100 substrate 101 cavity wall 102 wavelength conversion material layer 103, 104 emitter 105 control interface 200 substrate 201 cavity wall 202 wavelength conversion material layer 203, 204 semiconductor chip 300 substrate 301 cavity wall 302 wavelength conversion material layer 303 emitter 305 control interface 400 substrate 401 cavity wall 402 wavelength conversion material layer 403 semiconductor chip CITATION LIST Patent Literature U.S. Pat.",
"No.",
"8,398,264 CN 104056289 A EP 2554583A1 Non-Patent Literature IEC standard IEC-62471"
]
] |
Patent_15871171
|
[
[
"PARKING ASSIST SYSTEM",
"A parking assist system for a vehicle includes a rearward viewing camera, a display and a controller.",
"When operating in a first mode, the controller generates a first overlay at the displayed images that includes a representation of a target parking position.",
"When the vehicle is in a reverse gear, the controller operates in a second mode and generates second and third overlays at the displayed images.",
"The second overlay includes a representation of a projected rearward path of the vehicle that is based on a current steering angle of the vehicle.",
"When operating in the second mode and after the representation of the target parking position is positioned at a displayed target parking space for the vehicle, the controller determines a target path for the vehicle to guide the driver to the target parking space, with the third overlay including a representation of the determined target path."
],
[
"1.A parking assist system for a vehicle, the parking assist system comprising: a camera mounted to the vehicle so as to have a field of view rearward of the vehicle, wherein the camera captures images of a rearward scene rearward of the vehicle; a display in the vehicle that displays images captured by the camera; a controller, wherein the controller is activated in a first mode in response to actuation of a first user input in the vehicle and is activated in a second mode in response to actuation of a second user input in the vehicle; wherein, when operating in the first mode, the controller generates a first overlay at the displayed images of the rearward scene, and wherein the first overlay includes a representation of a target parking position, and wherein the representation of the target parking position is displayed so as to appear offset a selected distance behind the vehicle and a selected distance laterally from the vehicle; wherein the representation of the target parking position has a length that represents the length of the vehicle and wherein the representation of the target parking position has a width that represents the width of the vehicle; wherein the controller is operable in the first mode while the vehicle is being driven; wherein, when operating in the first mode, the vehicle is driven to position the representation of the target parking position at a displayed target parking space for the vehicle; wherein, when the vehicle is in a reverse gear, and responsive to actuation of the second user input, the controller operates in the second mode, and wherein, when operating in the second mode, the controller generates a second overlay and a third overlay at the displayed images of the rearward scene; wherein the second overlay includes a representation of a projected rearward path of the vehicle that is based on a current steering angle of the vehicle; and wherein, when operating in the second mode and after the representation of the target parking position is positioned at the displayed target parking space for the vehicle, the controller determines a target path for the vehicle to guide the driver to the target parking space, and wherein the third overlay includes a representation of the determined target path.",
"2.The parking assist system of claim 1, wherein the representation of the target parking position comprises a rectangle.",
"3.The parking assist system of claim 2, wherein the first overlay includes a line extending along an outside edge of the rectangle that extends a selected distance forward and rearward of the rectangle to assist the driver of the vehicle in lining up the vehicle to be parallel to the target parking space.",
"4.The parking assist system of claim 1, wherein the target parking space is parallel to a direction of travel of the vehicle.",
"5.The parking assist system of claim 1, wherein the target parking space is perpendicular to a direction of travel of the vehicle.",
"6.The parking assist system of claim 1, wherein the controller informs the driver of the projected rearward path for the vehicle based on the current steering angle of the vehicle, and informs the driver of whether the projected path matches the determined target path.",
"7.The parking assist system of claim 6, wherein the controller is operable in the first mode while the vehicle is being driven in a forward direction along the road.",
"8.The parking assist system of claim 6, wherein, when the vehicle is moving along the determined target path, the controller adds a representation of the progress of the vehicle on the determined target path.",
"9.The parking assist system of claim 6, wherein the representation of the projected rearward path of the vehicle has a width that represents the entire width of the vehicle.",
"10.The parking assist system of claim 6, wherein the controller is configured to select a plurality of target path segments for the vehicle to follow.",
"11.The parking assist system of claim 10, wherein the controller informs the driver of the target path segments via at least one of the display and a speaker.",
"12.The parking assist system of claim 11, wherein the controller informs the driver of the target path segments by instructing the driver to turn the steering wheel of the vehicle to a selected position.",
"13.The parking assist system of claim 10, wherein the controller informs the driver of whether or not the projected rearward path matches the determined target path via a speaker.",
"14.The parking assist system of claim 10, wherein each target path segment involves the vehicle having steering wheels pointed straight or at full lock, and wherein the plurality of target path segments comprises three target path segments, including a first target path segment in which the vehicle is driven straight rearwardly, a second target path segment in which the vehicle is driven rearwardly with the steering wheels at full lock in one direction, and a third target path segment in which the vehicle is driven rearwardly with the steering wheels at full lock in the opposite direction.",
"15.The parking assist system of claim 14, wherein the length of each target path segment remains constant from one parking maneuver to another.",
"16.A parking assist system for a vehicle, the parking assist system comprising: a camera mounted to the vehicle so as to have a field of view rearward of the vehicle, wherein the camera captures images of a rearward scene rearward of the vehicle; a display in the vehicle that displays images captured by the camera; a controller, wherein the controller is activated in a first mode in response to actuation of a first user input in the vehicle and is activated in a second mode in response to actuation of a second user input in the vehicle; wherein, when operating in the first mode, the controller generates a first overlay at the displayed images of the rearward scene, and wherein the first overlay includes a representation of a target parking position, and wherein the representation of the target parking position is displayed so as to appear offset a selected distance behind the vehicle and a selected distance laterally from the vehicle; wherein the representation of the target parking position has a length that represents the length of the vehicle and wherein the representation of the target parking position has a width that represents the width of the vehicle; wherein the controller is operable in the first mode while the vehicle is being driven; wherein, when operating in the first mode, the vehicle is driven to position the representation of the target parking position at a displayed target parking space for the vehicle; wherein the first overlay includes a line extending along an outside edge of the representation of the target parking position that extends a selected distance forward and rearward of the representation of the target parking position to assist the driver of the vehicle in lining up the vehicle with the target parking space; wherein, when the vehicle is in a reverse gear, and responsive to actuation of the second user input, the controller operates in the second mode, and wherein, when operating in the second mode, the controller generates a second overlay and a third overlay at the displayed images of the rearward scene; wherein the second overlay includes a representation of a projected rearward path of the vehicle that is based on a current steering angle of the vehicle; wherein, when operating in the second mode and after the representation of the target parking position is positioned at the displayed target parking space for the vehicle, the controller determines a target path for the vehicle to guide the driver to the target parking space, and wherein the third overlay includes a representation of the determined target path; and wherein the controller informs the driver of the projected rearward path for the vehicle based on the current steering angle of the vehicle, and informs the driver of whether or not the projected path matches the determined target path.",
"17.The parking assist system of claim 16, wherein the controller is operable in the first mode while the vehicle is being driven in a forward direction along the road.",
"18.The parking assist system of claim 16, wherein, when the vehicle is moving along the determined target path, the controller adds a representation of the progress of the vehicle on the determined target path.",
"19.A parking assist system for a vehicle, the parking assist system comprising: a camera mounted to the vehicle so as to have a field of view rearward of the vehicle, wherein the camera captures images of a rearward scene rearward of the vehicle; a display in the vehicle that displays images captured by the camera; a controller, wherein the controller is activated in a first mode in response to actuation of a first user input in the vehicle and is activated in a second mode in response to actuation of a second user input in the vehicle; wherein, when operating in the first mode, the controller generates a first overlay at the displayed images of the rearward scene, and wherein the first overlay includes a representation of a target parking position, and wherein the representation of the target parking position is displayed so as to appear offset a selected distance behind the vehicle and a selected distance laterally from the vehicle; wherein the representation of the target parking position has a length that represents the length of the vehicle and wherein the representation of the target parking position has a width that represents the width of the vehicle; wherein the controller is operable in the first mode while the vehicle is being driven forwardly or rearwardly along a road; wherein, when operating in the first mode, the vehicle is driven to position the representation of the target parking position at a displayed target parking space for the vehicle; wherein, when the vehicle is in a reverse gear, and responsive to actuation of the second user input, the controller operates in the second mode, and wherein, when operating in the second mode, the controller generates a second overlay and a third overlay at the displayed images of the rearward scene; wherein the second overlay includes a representation of a projected rearward path of the vehicle that is based on a current steering angle of the vehicle; wherein, when operating in the second mode and after the representation of the target parking position is positioned at the displayed target parking space for the vehicle, the controller determines a target path for the vehicle to guide the driver to the target parking space, and wherein the third overlay includes a representation of the determined target path; wherein the representation of the determined target path comprises a plurality of target path segments for the vehicle to follow toward the target parking space; and wherein, when the vehicle is moving along the determined target path, the controller adds a representation of the progress of the vehicle on the determined target path.",
"20.The parking assist system of claim 19, wherein the representation of the target parking position comprises a rectangle, and wherein the first overlay includes a line extending along an outside edge of the rectangle that extends a selected distance forward and rearward of the rectangle to assist the driver of the vehicle in lining up the vehicle to be parallel to the target parking space."
],
[
"<SOH> BACKGROUND OF THE INVENTION <EOH>Parking assist systems are currently available only on certain luxury vehicles, and are typically relatively complex systems that are either entirely or semi-autonomous, capable of steering and/or driving the vehicle into a parking spot.",
"Such systems typically require significant processing power in order to determine a suitable path to follow during the parking maneuver.",
"Such systems can be relatively expensive.",
"It would be advantageous if a parking assist system were available that required relatively less processing power, that was relatively simpler, and was relatively less expensive than some systems of the prior art."
],
[
"<SOH> SUMMARY OF THE INVENTION <EOH>In a first aspect, the invention is directed to a parking assist system for a vehicle, wherein a target parking position overlay is added to a rearview scene displayed to the vehicle driver.",
"In a particular embodiment of the first aspect, the parking assist system includes a camera mounted to the vehicle so as to receive a rearward scene, a display in the vehicle connected to the camera and configured to display an image of the rearward scene, and a controller configured to add an overlay to the image of the rearward scene.",
"The overlay includes a representation of a target parking position.",
"In a second aspect, the invention is directed to a parking assist system for a vehicle, that is configured to select a target path for the vehicle driver to follow while parking the vehicle, to inform the driver of the vehicle's projected path based on the vehicle's steering angle, and to inform the driver of whether the projected path matches the target path.",
"In a particular embodiment of the second aspect, the parking assist system includes a camera mounted to the vehicle so as to receive a rearward scene, a display in the vehicle connected to the camera and configured to display an image of the rearward scene, and a controller configured to add an overlay to the image of the rearward scene.",
"The overlay includes a representation of a projected path for the vehicle based on a current vehicle steering angle, and a representation of a target path for the vehicle.",
"In a third aspect, the invention is directed to a parking assist system for a vehicle, wherein the parking assist system has two modes of operation.",
"In a first mode a first overlay is added to a rearview scene displayed to the vehicle driver.",
"The first overlay includes a representation of a target parking position.",
"In a second mode a second overlay is added to the rearview scene displayed to the vehicle driver.",
"The second overlay includes a representation of a projected path for the vehicle based on a current vehicle steering angle, and a representation of a target path segment for the vehicle.",
"In a particular embodiment of the third aspect, the parking assist system includes a camera mounted to the vehicle so as to receive a rearward scene, a display in the vehicle connected to the camera and configured to display an image of the rearward scene, and a controller configured to operate the parking assist system in two operating modes.",
"In a first operating mode the controller is configured to add a first overlay to the image of the rearward scene, wherein the first overlay includes a representation of a target parking position.",
"In a second operating mode the controller is configured to add a second overlay to the image of the rearward scene, wherein the second overlay includes a representation of a projected path for the vehicle based on a current vehicle steering angle, and a representation of a target path segment for the vehicle.",
"In a fourth aspect, the invention is directed to a parking assist system for a vehicle, wherein the parking assist system selects a plurality of target path segments for the vehicle to follow to park in a target parking spot, wherein each target path segment involves the vehicle having steering wheels pointed straight or at full lock.",
"In a particular embodiment of the fourth aspect, the parking assist system includes a camera mounted to the vehicle so as to receive a rearward scene, a display in the vehicle connected to the camera and configured to display an image of the rearward scene, and a controller configured to select a plurality of target path segments for the vehicle to follow to park in a target parking spot.",
"Each target path segment involves the vehicle having the steering wheels pointed straight or at full lock."
],
[
"CROSS REFERENCE TO RELATED APPLICATIONS The present application is a continuation of U.S. patent application Ser.",
"No.",
"15/278,110, filed Sep. 28, 2016, now U.S. Pat.",
"No.",
"9,868,463, which is a continuation of U.S. patent application Ser.",
"No.",
"14/524,203, filed Oct. 27, 2014, now U.S. Pat.",
"No.",
"9,457,717, which is a continuation of U.S. patent application Ser.",
"No.",
"13/384,672, filed Jan. 18, 2012, now U.S. Pat.",
"No.",
"8,874,317, which is a 371 national phase filing of PCT Application No.",
"PCT/US2010/043330, filed Jul.",
"27, 2010, which claims the filing benefit of U.S. provisional application Ser.",
"No.",
"61/228,655, filed Jul.",
"27, 2009, which are hereby incorporated herein by reference in their entireties.",
"FIELD OF THE INVENTION The present invention relates to a parking assist system for use in vehicles.",
"BACKGROUND OF THE INVENTION Parking assist systems are currently available only on certain luxury vehicles, and are typically relatively complex systems that are either entirely or semi-autonomous, capable of steering and/or driving the vehicle into a parking spot.",
"Such systems typically require significant processing power in order to determine a suitable path to follow during the parking maneuver.",
"Such systems can be relatively expensive.",
"It would be advantageous if a parking assist system were available that required relatively less processing power, that was relatively simpler, and was relatively less expensive than some systems of the prior art.",
"SUMMARY OF THE INVENTION In a first aspect, the invention is directed to a parking assist system for a vehicle, wherein a target parking position overlay is added to a rearview scene displayed to the vehicle driver.",
"In a particular embodiment of the first aspect, the parking assist system includes a camera mounted to the vehicle so as to receive a rearward scene, a display in the vehicle connected to the camera and configured to display an image of the rearward scene, and a controller configured to add an overlay to the image of the rearward scene.",
"The overlay includes a representation of a target parking position.",
"In a second aspect, the invention is directed to a parking assist system for a vehicle, that is configured to select a target path for the vehicle driver to follow while parking the vehicle, to inform the driver of the vehicle's projected path based on the vehicle's steering angle, and to inform the driver of whether the projected path matches the target path.",
"In a particular embodiment of the second aspect, the parking assist system includes a camera mounted to the vehicle so as to receive a rearward scene, a display in the vehicle connected to the camera and configured to display an image of the rearward scene, and a controller configured to add an overlay to the image of the rearward scene.",
"The overlay includes a representation of a projected path for the vehicle based on a current vehicle steering angle, and a representation of a target path for the vehicle.",
"In a third aspect, the invention is directed to a parking assist system for a vehicle, wherein the parking assist system has two modes of operation.",
"In a first mode a first overlay is added to a rearview scene displayed to the vehicle driver.",
"The first overlay includes a representation of a target parking position.",
"In a second mode a second overlay is added to the rearview scene displayed to the vehicle driver.",
"The second overlay includes a representation of a projected path for the vehicle based on a current vehicle steering angle, and a representation of a target path segment for the vehicle.",
"In a particular embodiment of the third aspect, the parking assist system includes a camera mounted to the vehicle so as to receive a rearward scene, a display in the vehicle connected to the camera and configured to display an image of the rearward scene, and a controller configured to operate the parking assist system in two operating modes.",
"In a first operating mode the controller is configured to add a first overlay to the image of the rearward scene, wherein the first overlay includes a representation of a target parking position.",
"In a second operating mode the controller is configured to add a second overlay to the image of the rearward scene, wherein the second overlay includes a representation of a projected path for the vehicle based on a current vehicle steering angle, and a representation of a target path segment for the vehicle.",
"In a fourth aspect, the invention is directed to a parking assist system for a vehicle, wherein the parking assist system selects a plurality of target path segments for the vehicle to follow to park in a target parking spot, wherein each target path segment involves the vehicle having steering wheels pointed straight or at full lock.",
"In a particular embodiment of the fourth aspect, the parking assist system includes a camera mounted to the vehicle so as to receive a rearward scene, a display in the vehicle connected to the camera and configured to display an image of the rearward scene, and a controller configured to select a plurality of target path segments for the vehicle to follow to park in a target parking spot.",
"Each target path segment involves the vehicle having the steering wheels pointed straight or at full lock.",
"BRIEF DESCRIPTION OF THE DRAWINGS The present invention will now be described by way of example only with reference to the attached drawings, in which: FIG.",
"1 is a schematic illustration of a parking assist system in accordance with an embodiment of the present invention; FIG.",
"2 is a view of a rearward scene on a display that is part of the parking assist system shown in FIG.",
"1; FIG.",
"3 is a view of a rearward scene on the display shown in FIG.",
"3, with the parking assist system in a parking spot locator mode; FIG.",
"4 is a view of a rearward scene on the display shown in FIG.",
"3, with the parking assist system in the parking spot locator mode, after the vehicle has traveled past a target parking spot; FIG.",
"5 is a view of a rearward scene on the display shown in FIG.",
"3, with the parking assist system in the parking spot locator mode, after the vehicle has backed up to a suitable position to park in the target parking spot; FIG.",
"6 is a view of a rearward scene on the display shown in FIG.",
"3, with the parking assist system in a parking guidance mode, showing the alignment between the projected path of the vehicle with a first target path segment for the vehicle; FIGS.",
"7a-7d are views of a rearward scene on the display shown in FIG.",
"3, with the parking assist system in the parking guidance mode, illustrating the progression of the vehicle along the first target path segment; FIGS.",
"8a-8c are views of a rearward scene on the display shown in FIG.",
"3, with the parking assist system in the parking guidance mode, showing the progression towards alignment between the projected path of the vehicle with a second target path segment for the vehicle; FIGS.",
"9a and 9b are views of a rearward scene on the display shown in FIG.",
"3, with the parking assist system in the parking guidance mode, illustrating the progression of the vehicle along the second target path segment; FIGS.",
"10a-10d are views of a rearward scene on the display shown in FIG.",
"3, with the parking assist system in the parking guidance mode, showing the progression towards alignment between the projected path of the vehicle with a third target path segment for the vehicle; FIG.",
"11 is a view of a rearward scene on the display shown in FIG.",
"3, with the parking assist system in the parking guidance mode, showing the vehicle having nearly completed the third target path segment for the vehicle; and FIG.",
"12 is a view of a rearward scene on the display shown in FIG.",
"3, with the parking system in the parking guidance mode, wherein the vehicle is parking in a perpendicular parking spot.",
"DETAILED DESCRIPTION OF THE INVENTION Reference is made to FIG.",
"1, which shows a parking assist system 10 for use in a vehicle 11, in accordance with an embodiment of the present invention.",
"The parking assist system includes a camera 12, a controller 14 and a display 16.The camera 12 is positioned on the vehicle 11 for rearward viewing and receives a rearward scene shown at 18.The controller 14 communicates with the camera 12 and sends an image 20 of the rearward scene 18 (FIG.",
"2) to the display 16, which is positioned in the vehicle cabin.",
"The display 16 is positioned to display the image 20 of the rearward scene 18 to the vehicle driver.",
"When the vehicle driver wants to use the parking assist system 10 (FIG.",
"1), he or she presses a button in the interior of the vehicle 11, which activates the parking assist system 10 in a first mode, which is a parking spot locator mode.",
"When in the parking spot locator mode, the controller 14 adds an overlay 22 (FIG.",
"3) to the image 20, which assists the driver in finding a suitable parking spot for the vehicle 11 (FIG.",
"1).",
"The overlay 22 (FIG.",
"3) includes a rectangle 24 which is a representation of a target parked position which is offset a selected distance behind and a selected distance laterally from the vehicle 11 (FIG.",
"1).",
"The size of the rectangle 24 (FIG.",
"3) preferably represents substantially the length and further preferably represents substantially the width of the vehicle 11 (FIG.",
"1).",
"The overlay 22 (FIG.",
"3) also includes a line 26 extending along the outside edge (shown at 28) of the rectangle 24 (i.e., the side edge of the rectangle 24 that faces outwardly from the parking spot).",
"The line 26 extends a selected distance forward of the rectangle 24 and a selected distance rearward of the rectangle 24 and assists the driver of the vehicle 11 in lining up the vehicle 11 to be parallel to the parking lane.",
"With the overlay 22 shown on the image 20, the driver drives along the road until he or she finds a potential parking spot, shown at 30 in FIG.",
"4.In the exemplary embodiment shown in the figures, the driver drove forward to find the potential parking spot 30.As shown in FIG.",
"4, the vehicle 11 has overshot the potential parking spot 30 and so the forward edge of the rectangle 24 is too far forward, overlapping with the vehicle (shown at 32) that is forward of the potential parking spot 30.Having driven too far forward, the driver may put vehicle 11 (FIG.",
"1) into reverse gear in order to back up to superimpose the rectangle 24 on the potential parking spot 30.When the vehicle is in reverse, a representation 34 of the projected path of the vehicle is added to the included in the overlay 22 that is provided with the image 20 shown on the display 16.The representation 34 is based on the steering angle of the vehicle and is updated as the steering angle changes.",
"The representation 34 includes several features such as lateral edge lines 36 and distance markers 38.The lateral edge lines 36 correspond to the lateral edges of the vehicle.",
"The distance markers 38 each correspond to a selected distance behind the vehicle, preferably in uniform increments.",
"As shown in FIG.",
"5, the vehicle 11 (FIG.",
"1) has backed up sufficiently to superimpose the rectangle 24 on the potential parking spot 30.Once in this position, the driver can see that the vehicle 11 (FIG.",
"1) has sufficient room to fit in the parking spot 30.It is optionally possible for the length of the rectangle 24 to be the length required by the vehicle to fit in the parking spot instead of simply representing the length of the vehicle 11 (FIG.",
"1) itself.",
"As will be understood by one skilled in the art, the length required by the vehicle (FIG.",
"1) to park in a spot is some amount longer than the length of the vehicle (FIG.",
"1) itself.",
"Once the driver has decided that the parking spot 30 (FIG.",
"5) is suitable, he or she may press another button on the dashboard to activate the parking assist system 10 (FIG.",
"1) in a parking guidance mode, as shown in FIG.",
"6.In the parking guidance mode, the parking assist system 10 (FIG.",
"1) determines a target path for the vehicle 11 to follow in order to park in the spot delineated by the rectangle 24 (FIG.",
"6) at the time that the parking guidance mode was initiated.",
"When in the parking guidance mode, two representations are shown on the display 16.One is the aforementioned representation 34 of the vehicle's projected path at the current steering angle.",
"The other is a representation shown at 40a of a segment of the target path to reach the parking spot delineated by the rectangle 24 (FIG.",
"5).",
"Initially, the driver turns the vehicle's steering wheel until the projected path representation 34 of the vehicle substantially aligns with the target path segment representation 40a.",
"When they are suitably aligned, the parking assist system 10 may notify the driver that he/she can proceed to back the vehicle up along the target path.",
"Alternatively, the alignment of the representations 34 and 40a visually on the display 16 may itself be considered notification to the driver that the projected path suitably matches the target path.",
"Referring to FIGS.",
"7a, 7b, 7c and 7d, as the driver backs the vehicle up progressively along the target path segment, a distal portion 42 of the target path representation 40a change from one color to another, shortening the length of the proximal portion 44 of the representation 40a that remains in the first color.",
"This gives the driver an indication of how much of the target path segment remains to be driven before another phase of the parking maneuver is to be made.",
"Once the vehicle has driven the entire target path segment, the parking assist system 10 selects the next segment of the target path for the vehicle to follow, and represents it on the display 16 as the representation 40b shown in FIG.",
"8a.",
"The second target path segment representation 40b guides the driver in the turn-in phase of the parking maneuver.",
"At the point in time shown in FIG.",
"8a, the vehicle's steering wheels are still pointed straight since the first target path segment which was just completed was a straight segment.",
"Thus, at the point in time shown in FIG.",
"8a, the driver's projected path represented at 34 is misaligned with the second target path segment represented at 40b.",
"As the driver turns the steering wheel to align the vehicle's projected path with the target path segment, the projected path representation 34 becomes progressively aligned with and superimposed with the target path segment representation 40b, as shown in FIG.",
"8b.",
"After the driver turns the steering wheel sufficiently, the vehicle's projected path is aligned with the vehicle's target path segment, as shown by the representations 34 and 40b in FIG.",
"8c.",
"The target path segment illustrated in FIGS.",
"8a, 8b and 8c may be the path at full wheel lock (i.e., at the maximum steering angle the vehicle is capable of).",
"FIGS.",
"9a and 9b show the progress of the vehicle along the second target path segment.",
"Once the vehicle has moved along the entire second target path segment, the parking assist system 10 selects the next (i.e., third) target path segment for the vehicle to follow, which is represented in FIG.",
"10a at 40c.",
"The third target path segment is the tuck-in phase of the parking maneuver and requires that the driver turn the steering wheel to the opposite limit.",
"FIGS.",
"10a-10d illustrate the driver turning the wheel to bring the projected path into alignment with the third target path segment.",
"Once the projected path and third target path segment are aligned, the driver backs the vehicle up along the third target path segment.",
"FIG.",
"11 illustrates the vehicle having completed almost all of the third target path segment.",
"After the third target path segment is completed, the driver has completed the entire parking maneuver.",
"Optionally he/she can drive forward if desired to adjust the spacing between the driver's vehicle and the vehicles in front and behind.",
"It will be noted that the parking maneuver includes three phases, a backup phase wherein the vehicle is backed up in a straight line (with the wheels pointing straight), a turn-in phase wherein the vehicle is backed up at full wheel lock in one direction, and a tuck-in phase wherein the vehicle is backed up at full wheel lock in the other direction.",
"Providing target path segments wherein the wheels are pointed straight or are at full lock simplifies the process of aligning the projected path with the target path segment, and simplifies keeping the vehicle along the target path segment.",
"While backing the vehicle up along a target path segment, if the driver for some reason veers off the target path by more than a selected amount, the parking assist system 10 notifies the driver, and optionally aborts the parking maneuver.",
"Optionally, the parking assist system 10 can permit the driver to select whether the parking spot is to the left of the vehicle (as shown in the figures) or to the right of the vehicle.",
"For a parking spot on the right of the vehicle, the turn-in and tuck-in phases would be mirror images of the turn-in and tuck-in phases illustrated in FIGS.",
"8a-11.It will be understood that the three target path segments need not all be the same length.",
"It will be noted that the rectangle 24 (FIG.",
"5) is at a fixed position behind and to the side of the vehicle.",
"The target path for the parking maneuver is thus the same each time the vehicle is to be parked although it may be mirrored in the optional embodiment wherein the parking assist system 10 permits selecting a parking spot on the other side (i.e., the right side) of the vehicle.",
"As a result of the consistency in the parking maneuver, the parking maneuver need not be recalculated each time the vehicle uses the parking assist system 10.This permits the parking assist system 10 to operate using relatively inexpensive control hardware and software.",
"In the above description, the in-cabin display 16 was used as the human/machine interface and provided the driver with instructions visually/graphically for driving the vehicle into a parking spot.",
"It is possible to provide instructions to the driver by other means in addition to or instead of using the in-cabin display 16.For example, the human/machine interface could include a speaker (e.g., from the vehicle's sound system) and could emit audible messages to the driver via the speaker.",
"Such messages could be instructions in any language, such as English.",
"For example, an instruction could be given audibly to turn the vehicle steering wheel to a selected position (e.g., full lock to the left).",
"It will be noted that such an instruction would in effect inform the driver of the target path for the vehicle.",
"In addition to the audible messages, or instead of them, a chime or a beep could be emitted at points in the parking process where the driver is supposed to carry out a new maneuver, to let the driver know that he/she is off course, to let the driver know that he/she is on course (i.e., that the projected vehicle path matches the target path), or for any other suitable purpose.",
"In the above description a method and system were described for parallel parking into a parking spot.",
"It is also possible for an embodiment of the invention to be provided for parking into a perpendicular parking spot 30 (see FIG.",
"12).",
"A perpendicular parking spot 30 is a parking spot that is perpendicular to the direction of travel of the vehicle when driving by.",
"Perpendicular parking spots are typically used in parking lots for malls, office buildings and the like.",
"In the position shown in FIG.",
"12, the vehicle has already completed some portion of the parking process and is backing into the parking spot 30.While the above description constitutes a plurality of embodiments of the present invention, it will be appreciated that the present invention is susceptible to further modification and change without departing from the fair meaning of the accompanying claims."
]
] |
Patent_15871172
|
[
[
"VEHICLE VISION SYSTEM WITH EXTERIOR VIEWING CAMERA",
"A vehicular vision system includes a camera module having a camera, a flexible ribbon cable and a main PCB.",
"The main PCB has a first planar side and an opposing second planar side.",
"First circuitry is disposed at the first planar side and second circuitry is disposed at the second planar side of the main PCB.",
"The main PCB at its second planar side includes a second electrical connector, which is configured for mating with a first electrical connector of the flexible ribbon cable.",
"Image data provided via the flexible ribbon cable at least to the second circuitry disposed at the second planar side of the main PCB is processed by a digital image processor for at least one driving assist system of the vehicle.",
"At least a portion of a lens barrel of the camera extends through an aperture of a housing portion of the camera module."
],
[
"1.A vehicular vision system suitable for use in a vehicle, said vehicular vision system comprising: a camera module; said camera module comprising a camera; said camera comprising (i) an imager disposed on an imager circuit board and (ii) a lens assembly comprising a lens barrel accommodating at least one lens; wherein said camera, when mounted at a vehicle equipped with said vehicular vision system, is operable to capture image data representative of a scene exterior of the equipped vehicle; a flexible ribbon cable connecting to and extending from the imager circuit board; said flexible ribbon cable comprising electrical conductors that connect electrical circuitry of the imager circuit board to a terminator portion of said flexible ribbon cable, wherein said terminator portion comprises a first electrical connector; wherein the electrical circuitry of the imager circuit board comprises the imager; said camera module comprising a main circuit board, said main circuit board including a digital image processor for processing image data captured by the imager; wherein said main circuit board comprises a multilayered printed circuit board (PCB) having a first planar side and an opposing second planar side separated from the first planar side by a thickness dimension of the multilayered PCB; wherein first circuitry is disposed at the first planar side of the multilayered PCB, and wherein second circuitry is disposed at the second planar side of the multilayered PCB; wherein said camera is disposed at the first planar side of the multilayered PCB; wherein said second circuitry disposed at the second planar side of the multilayered PCB comprises said digital image processor; wherein the multilayered PCB at its second planar side comprises a second electrical connector, and wherein said second electrical connector at the second planar side of the multilayered PCB is configured for mating with said first electrical connector at the terminator portion of said flexible ribbon cable; wherein, with said camera module disposed at an equipped vehicle and with said camera operated to capture image data and with said first electrical connector at the terminator portion of said flexible ribbon cable mated with said second electrical connector at the second planar side of the multilayered PCB and with said flexible ribbon cable connecting to and extending from the imager circuit board, image data captured by the imager of said camera is provided via said flexible ribbon cable at least to said second circuitry disposed at the second planar side of the multilayered PCB; wherein image data provided via said flexible ribbon cable at least to said second circuitry disposed at the second planar side of the multilayered PCB is processed by said digital image processor for at least one driving assist system of the equipped vehicle; wherein said camera module comprises a housing; wherein said main circuit board is disposed within said housing; wherein said camera is at least partially disposed within said housing; wherein said housing encloses said main circuit board and the imager circuit board; wherein said housing comprises a front portion that is in front of a rear portion of said housing; wherein said main circuit board is enclosed within said front and rear portions of said housing; wherein said camera is at least partially housed within said rear portion of said housing; wherein said rear portion of said housing has an aperture; wherein at least a portion of said lens barrel of said camera extends through said aperture of said rear portion; and wherein said lens barrel of said camera protrudes outside said housing at an acute angle relative to said front portion of said housing.",
"2.The vehicular vision system of claim 1, wherein said camera module is configured for mounting at an in-cabin side of a vehicle windshield of the equipped vehicle, and wherein the vehicle windshield, as installed in the equipped vehicle, is sloped at an acute angle relative to horizontal, and wherein, with said camera module mounted at the in-cabin side of the vehicle windshield, said camera of said camera module views through the vehicle windshield to capture image data forward of the equipped vehicle.",
"3.The vehicular vision system of claim 2, wherein said camera module mounts at the vehicle windshield via a mounting bracket that is attached at the in-cabin side of the vehicle windshield.",
"4.The vehicular vision system of claim 3, wherein, with said camera module mounted at the mounting bracket that is attached at the in-cabin side of the vehicle windshield, a stray light shield is positioned between said camera and the vehicle windshield to reduce incidence of stray light at the at least one lens of said camera.",
"5.The vehicular vision system of claim 4, wherein said stray light shield is formed separately from said camera module.",
"6.The vehicular vision system of claim 5, wherein, with said camera module mounted at the mounting bracket that is attached at the in-cabin side of the vehicle windshield, said stray light shield is urged towards the in-cabin side of the windshield.",
"7.The vehicular vision system of claim 4, wherein the mounting bracket comprises said stray light shield.",
"8.The vehicular vision system of claim 7, wherein said stray light shield is integrally formed with the mounting bracket and constitutes an integral part thereof.",
"9.The vehicular vision system of claim 4, wherein said stray light shield is formed separately from said camera module, and wherein said stray light shield is formed separately from the mounting bracket.",
"10.The vehicular vision system of claim 9, wherein said stray light shield is attached at said camera module before said camera module is mounted at the mounting bracket attached at the in-cabin side of the vehicle windshield.",
"11.The vehicular vision system of claim 3, wherein, with said camera module mounted at the mounting bracket that is attached at the in-cabin side of the vehicle windshield, a stray light shield is positioned between said camera and the vehicle windshield to reduce incidence of stray light at the at least one lens of said camera, and wherein the mounting bracket is formed of a polymeric material in an injection molding operation, and wherein the mounting bracket comprises said stray light shield, and wherein said stray light shield is integrally formed with the mounting bracket by injection molding of the polymeric material in the injection molding operation, and wherein said stray light shield constitutes an integral part of the mounting bracket, and wherein said stray light shield comprises a base portion and side walls that extend upward from said base portion so as to establish a pocket, and wherein at least said base portion of said stray light shield comprises light traps structurally established thereat and configured to at least partially trap extraneous light emanating from exterior the equipped vehicle and passing through the vehicle windshield of the equipped vehicle so as to be incident at said base portion, said light traps reducing incidence of the extraneous light at the imager, and wherein said light traps are integrally formed as part of said stray light shield by the injection molding operation, and wherein said light traps comprise a plurality of shaped light absorbing elements that are spaced apart and shaped to trap light, and wherein said shaped light absorbing elements comprise a plurality of generally vertical ribs each having a first surface and a second surface opposite said first surface, and wherein said first surface of a given rib is closer to the windshield than said second surface of the given rib, and wherein said first surface is configured to be at an angle of less than or equal to five degrees relative to vertical and said second surface is configured to be at an angle of less than or equal to ten degrees relative to vertical when said camera module is mounted at the mounting bracket attached at the in-cabin side of the vehicle windshield of the equipped vehicle, and wherein said first and second surfaces are different so that said rib narrows towards its upper end, and wherein a ratio of a distance between adjacent ribs to the height dimension of the ribs is greater than one, and wherein, with said camera module mounted at the mounting bracket attached at the in-cabin side of the vehicle windshield of the equipped vehicle, (i) said first surface is at an angle of zero degrees relative to vertical and (ii) said second surface is at an angle of five degrees relative to vertical.",
"12.The vehicular vision system of claim 3, wherein one side of the mounting bracket comprises structure configured to cooperate with corresponding other structure of said camera module, and wherein, when the mounting bracket is attached at the in-cabin side of the vehicle windshield and said camera module mounts at the mounting bracket, the structure of the mounting bracket and the other structure of said camera module cooperate to detachably secure said camera module at the mounting bracket.",
"13.The vehicular vision system of claim 12, wherein an opposing other side of the mounting bracket is configured for adhesive attachment at the in-cabin side of the vehicle windshield, and wherein, when the mounting bracket is attached at the in-cabin side of the vehicle windshield, the other side of the mounting bracket is bonded using a cured adhesive at the in-cabin side of the vehicle windshield.",
"14.The vehicular vision system of claim 12, comprising a plurality of at least three fixing elements, each bonded using a cured adhesive at the in-cabin side of the vehicle windshield, wherein the mounting bracket comprises a corresponding plurality of at least three slots configured for mounting the mounting bracket to the plurality of at least three fixing elements bonded at the in-cabin side of the vehicle windshield.",
"15.The vehicular vision system of claim 2, wherein said camera module mounts at the in-cabin side of the vehicle windshield via a mounting bracket that is attached at the in-cabin side of the vehicle windshield, and wherein, with said camera module mounted at the vehicle windshield as installed in the equipped vehicle via the mounting bracket that is attached at the in-cabin side of the vehicle windshield, said camera has a forward field of view with its principal axis directed within 2 degrees upward with respect to horizontal ground.",
"16.The vehicular vision system of claim 2, wherein said camera module mounts at the in-cabin side of the vehicle windshield via a mounting bracket that is attached at the in-cabin side of the vehicle windshield, and wherein, with said camera module mounted at the vehicle windshield as installed in the equipped vehicle via the mounting bracket that is attached at the in-cabin side of the vehicle windshield, said camera has a forward field of view with its principal axis directed parallel to horizontal ground.",
"17.The vehicular vision system of claim 2, wherein said camera module mounts at the in-cabin side of the vehicle windshield via a mounting bracket that is attached at the in-cabin side of the vehicle windshield, and wherein, with said camera module mounted at the vehicle windshield via the mounting bracket that is attached at the in-cabin side of the vehicle windshield, the imager of said camera is within 4 mm distance to the portion of the vehicle windshield said camera views through.",
"18.The vehicular vision system of claim 1, wherein a portion of said camera extends through an opening of the multilayered PCB.",
"19.The vehicular vision system of claim 18, wherein the opening of the multilayered PCB comprises a hole that is surrounded by material of the multilayered PCB and that extends from the first side of the multilayered PCB to the second side of the multilayered PCB.",
"20.The vehicular vision system of claim 18, wherein the opening of the multilayered PCB comprises a cut-out section that is cut out from a section of the multilayered PCB.",
"21.The vehicular vision system of claim 18, wherein the opening of the multilayered PCB has a rectangular shape.",
"22.The vehicular vision system of claim 1, wherein the imager circuit board is tilted at an acute angle with respect to said main circuit board.",
"23.The vehicular vision system of claim 1, wherein said flexible ribbon cable passes via an opening in the multilayered PCB to connect with said second circuitry disposed at the second planar side of the multilayered PCB.",
"24.The vehicular vision system of claim 1, wherein said housing of said camera module has a breadth and a length, and wherein the multilayered PCB extends across the breadth of said housing and along the length of said housing.",
"25.The vehicular vision system of claim 24, wherein the maximum height dimension of said rear portion of said housing is greater than the maximum height dimension of said front portion of said housing.",
"26.The vehicular vision system of claim 25, wherein at least a portion of said lens barrel of said camera protrudes outside said housing at least partially over and above said front portion of said housing.",
"27.The vehicular vision system of claim 1, wherein, with said camera disposed at the first planar side of the multilayered PCB, the lens barrel of said camera is tilted at an angle between 10 degrees and 20 degrees relative to the plane of the multilayered PCB, whereby a principal viewing axis of the at least one lens accommodated in the lens barrel is angled between 10 degrees and 20 degrees relative to the plane of the multilayered PCB.",
"28.The vehicular vision system of claim 1, wherein said camera disposed at the first planar side of the multilayered PCB is mechanically secured at the multilayered PCB.",
"29.The vehicular vision system of claim 28, wherein said camera disposed at the first planar side of the multilayered PCB is mechanically secured to the multilayered PCB by at least one fastener.",
"30.The vehicular vision system of claim 1, wherein said digital image processor disposed at the second planar side of the multilayered PCB comprises an image processing chip.",
"31.The vehicular vision system of claim 30, wherein a heat sink is placed over and in contact with said image processing chip.",
"32.The vehicular vision system of claim 31, wherein said image processing chip comprises an EyeQ3™ image processing chip.",
"33.The vehicular vision system of claim 1, wherein said housing of said camera module has a breadth and a length, and wherein the multilayered PCB extends across the breadth of said housing and along the length of said housing, and wherein said rear portion of said housing has a height, and wherein the imager circuit board is enclosed by said rear portion of said housing and is tilted at an acute angle with respect to said main circuit board.",
"34.The vehicular vision system of claim 33, wherein the breadth of said housing has a maximum dimension of 100 mm or less, and wherein the length of said housing has a maximum dimension of 100 mm or less, and wherein the height of said rear portion of said housing has a maximum dimension of 35 mm or less.",
"35.The vehicular vision system of claim 33, wherein said camera module is configured for mounting at an in-cabin side of a vehicle windshield of the equipped vehicle, and wherein the vehicle windshield, as installed in the equipped vehicle, is sloped at an acute angle relative to horizontal, and wherein, with said camera module mounted at the in-cabin side of the vehicle windshield, said camera of said camera module views through the vehicle windshield to capture image data forward of the equipped vehicle, and wherein said camera module mounts at the vehicle windshield via a mounting bracket that is attached at the in-cabin side of the vehicle windshield, and wherein the mounting bracket, as attached at the in-cabin side of the vehicle windshield, establishes the angle of view of said camera relative to the vehicle windshield when said camera module is mounted at the mounting bracket.",
"36.The vehicular vision system of claim 35, wherein the mounting bracket that is attached at the in-cabin side of the vehicle windshield is configured and constructed so that, with said camera module mounted at the mounting bracket attached at the in-cabin side of the vehicle windshield which is sloped at the acute angle relative to horizontal as installed in the equipped vehicle, said camera has a principal axis of its forward field of view directed at an angle closer to horizontal than the acute angle made by the vehicle windshield to horizontal.",
"37.The vehicular vision system of claim 36, wherein said camera, with said camera module mounted at the mounting bracket and with the mounting bracket attached at the in-cabin side of the vehicle windshield as installed in the equipped vehicle, has the principal axis of its forward field of view directed within 2 degrees of horizontal.",
"38.The vehicular vision system of claim 37, wherein said camera, with said camera module mounted at the mounting bracket and with the mounting bracket attached at the in-cabin side of the vehicle windshield as installed in the equipped vehicle, has the principal axis of its forward field of view directed within 2 degrees upward from horizontal.",
"39.The vehicular vision system of claim 37, wherein image data provided via said flexible ribbon cable at least to said second circuitry disposed at the second planar side of the multilayered PCB is processed by said digital image processor for at least two driving assist systems of the equipped vehicle selected from the group consisting of (i) a headlamp control system of the equipped vehicle, (ii) a traffic sign recognition system of the equipped vehicle, (iii) a lane departure warning system of the equipped vehicle, (iv) an object detection system of the equipped vehicle and (v) a distance to a leading vehicle determination system of the equipped vehicle.",
"40.A vehicular vision system suitable for use in a vehicle, said vehicular vision system comprising: a camera module; said camera module comprising a camera; said camera comprising (i) an imager disposed on an imager circuit board and (ii) a lens assembly comprising a lens barrel accommodating at least one lens; wherein said camera, when mounted at a vehicle equipped with said vehicular vision system, is operable to capture image data representative of a scene exterior of the equipped vehicle; a flexible ribbon cable connecting to and extending from the imager circuit board; said flexible ribbon cable comprising electrical conductors that connect electrical circuitry of the imager circuit board to a terminator portion of said flexible ribbon cable, wherein said terminator portion comprises a first electrical connector; wherein the electrical circuitry of the imager circuit board comprises the imager; said camera module comprising a main circuit board, said main circuit board including a digital image processor for processing image data captured by the imager; wherein said main circuit board comprises a multilayered printed circuit board (PCB) having a first planar side and an opposing second planar side separated from the first planar side by a thickness dimension of the multilayered PCB; wherein first circuitry is disposed at the first planar side of the multilayered PCB, and wherein second circuitry is disposed at the second planar side of the multilayered PCB; wherein said camera is disposed at the first planar side of the multilayered PCB; wherein said second circuitry disposed at the second planar side of the multilayered PCB comprises said digital image processor; wherein the multilayered PCB at its second planar side comprises a second electrical connector, and wherein said second electrical connector at the second planar side of the multilayered PCB is configured for mating with said first electrical connector at the terminator portion of said flexible ribbon cable; wherein, with said camera module disposed at an equipped vehicle and with said camera operated to capture image data and with said first electrical connector at the terminator portion of said flexible ribbon cable mated with said second electrical connector at the second planar side of the multilayered PCB and with said flexible ribbon cable connecting to and extending from the imager circuit board, image data captured by the imager of said camera is provided via said flexible ribbon cable at least to said second circuitry disposed at the second planar side of the multilayered PCB; wherein image data provided via said flexible ribbon cable at least to said second circuitry disposed at the second planar side of the multilayered PCB is processed by said digital image processor for at least one driving assist system of the equipped vehicle; wherein, with said camera disposed at the first planar side of the multilayered PCB, the lens barrel of said camera is tilted at an acute angle relative to the plane of the multilayered PCB, whereby a principal viewing axis of the at least one lens accommodated in the lens barrel is orientated at the acute angle relative to the plane of the multilayered PCB; wherein said camera module comprises a housing; wherein said main circuit board is disposed within said housing; wherein said camera is at least partially disposed within said housing; wherein said housing encloses said main circuit board and the imager circuit board; wherein said housing comprises a front portion that is in front of a rear portion of said housing; wherein said main circuit board is enclosed within said front and rear portions of said housing; wherein said camera is at least partially housed within said rear portion of said housing; wherein said camera module is configured for mounting at an in-cabin side of a vehicle windshield of the equipped vehicle, and wherein the vehicle windshield, as installed in the equipped vehicle, is sloped at an acute angle relative to horizontal; wherein said camera module mounts at the vehicle windshield via a mounting bracket that is attached at the in-cabin side of the vehicle windshield; wherein, with said camera module mounted at the mounting bracket attached at the in-cabin side of the vehicle windshield, said camera of said camera module views through the vehicle windshield to capture image data forward of the equipped vehicle; wherein one side of the mounting bracket comprises structure configured to cooperate with corresponding other structure of said camera module; wherein, when the mounting bracket is attached at the in-cabin side of the vehicle windshield, the structure of the mounting bracket and the other structure of said camera module cooperate to detachably secure said camera module at the mounting bracket; wherein the mounting bracket, as attached at the in-cabin side of the vehicle windshield, establishes the angle of view of said camera relative to the vehicle windshield when said camera module is mounted at the mounting bracket; and wherein the mounting bracket that is attached at the in-cabin side of the vehicle windshield is configured and constructed so that, with said camera module mounted at the mounting bracket attached at the in-cabin side of the vehicle windshield which is sloped at the acute angle relative to horizontal as installed in the equipped vehicle, said camera has a principal axis of its forward field of view directed at an angle closer to horizontal than the acute angle made by the vehicle windshield to horizontal.",
"41.The vehicular vision system of claim 40, wherein said camera, with said camera module mounted at the mounting bracket and with the mounting bracket attached at the in-cabin side of the vehicle windshield as installed in the equipped vehicle, has the principal axis of its forward field of view directed within 2 degrees of horizontal.",
"42.The vehicular vision system of claim 41, wherein said camera, with said camera module mounted at the mounting bracket and with the mounting bracket attached at the in-cabin side of the vehicle windshield as installed in the equipped vehicle, has the principal axis of its forward field of view directed within 2 degrees upward from horizontal.",
"43.The vehicular vision system of claim 40, wherein, with said camera disposed at the first planar side of the multilayered PCB, the lens barrel of said camera is tilted at an angle between 10 degrees and 20 degrees relative to the plane of the multilayered PCB, whereby the principal viewing axis of the at least one lens accommodated in the lens barrel is angled between 10 degrees and 20 degrees relative to the plane of the multilayered PCB.",
"44.The vehicular vision system of claim 40, wherein, with said camera module mounted at the mounting bracket that is attached at the in-cabin side of the vehicle windshield, a stray light shield is positioned between said camera and the vehicle windshield to reduce incidence of stray light at the at least one lens of said camera.",
"45.The vehicular vision system of claim 44, wherein said stray light shield is integrally formed with the mounting bracket by injection molding of a polymeric material in the same injection molding operation, and wherein said stray light shield constitutes an integral part of the mounting bracket.",
"46.The vehicular vision system of claim 40, wherein said flexible ribbon cable passes via an opening in the multilayered PCB to connect with said second circuitry disposed at the second planar side of the multilayered PCB.",
"47.The vehicular vision system of claim 40, wherein, with said camera module mounted at the vehicle windshield via the mounting bracket that is attached at the in-cabin side of the vehicle windshield, the imager of said camera is within 4 mm distance to the portion of the vehicle windshield said camera views through.",
"48.The vehicular vision system of claim 40, wherein said camera disposed at the first planar side of the multilayered PCB is mechanically secured by at least one fastener at the multilayered PCB.",
"49.The vehicular vision system of claim 48, wherein said digital image processor disposed at the second planar side of the multilayered PCB comprises an image processing chip, and wherein a heat sink is placed over and in contact with said image processing chip.",
"50.The vehicular vision system of claim 49, wherein said image processing chip comprises an EyeQ3™ image processing chip.",
"51.The vehicular vision system of claim 40, wherein said housing of said camera module has a breadth and a length, and wherein the multilayered PCB extends across the breadth of said housing and along the length of said housing, and wherein said rear portion of said housing has a height, and wherein the imager circuit board is enclosed by said rear portion of said housing and is tilted at an acute angle with respect to said main circuit board, and wherein said rear portion of said housing has an aperture, and wherein at least a portion of said lens barrel of said camera extends through said aperture of said rear portion.",
"52.The vehicular vision system of claim 51, wherein the breadth of said housing has a maximum dimension of 100 mm or less, and wherein the length of said housing has a maximum dimension of 100 mm or less, and wherein the height of said rear portion of said housing has a maximum dimension of 35 mm or less.",
"53.A vehicular vision system suitable for use in a vehicle, said vehicular vision system comprising: a camera module; said camera module comprising a camera; said camera comprising (i) an imager disposed on an imager circuit board and (ii) a lens assembly comprising a lens barrel accommodating at least one lens; wherein said camera, when mounted at a vehicle equipped with said vehicular vision system, is operable to capture image data representative of a scene exterior of the equipped vehicle; a flexible ribbon cable connecting to and extending from the imager circuit board; said flexible ribbon cable comprising electrical conductors that connect electrical circuitry of the imager circuit board to a terminator portion of said flexible ribbon cable, wherein said terminator portion comprises a first electrical connector; wherein the electrical circuitry of the imager circuit board comprises the imager; said camera module comprising a main circuit board, said main circuit board including a digital image processor for processing image data captured by the imager; wherein said main circuit board comprises a multilayered printed circuit board (PCB) having a first planar side and an opposing second planar side separated from the first planar side by a thickness dimension of the multilayered PCB; wherein first circuitry is disposed at the first planar side of the multilayered PCB, and wherein second circuitry is disposed at the second planar side of the multilayered PCB; wherein said camera is disposed at the first planar side of the multilayered PCB; wherein said second circuitry disposed at the second planar side of the multilayered PCB comprises said digital image processor; wherein the multilayered PCB at its second planar side comprises a second electrical connector, and wherein said second electrical connector at the second planar side of the multilayered PCB is configured for mating with said first electrical connector at the terminator portion of said flexible ribbon cable; wherein, with said camera module disposed at an equipped vehicle and with said camera operated to capture image data and with said first electrical connector at the terminator portion of said flexible ribbon cable mated with said second electrical connector at the second planar side of the multilayered PCB and with said flexible ribbon cable connecting to and extending from the imager circuit board, image data captured by the imager of said camera is provided via said flexible ribbon cable at least to said second circuitry disposed at the second planar side of the multilayered PCB; wherein image data provided via said flexible ribbon cable at least to said second circuitry disposed at the second planar side of the multilayered PCB is processed by said digital image processor for at least one driving assist system of the equipped vehicle; wherein, with said camera disposed at the first planar side of the multilayered PCB, the lens barrel of said camera is tilted at an acute angle relative to the plane of the multilayered PCB, whereby a principal viewing axis of the at least one lens accommodated in the lens barrel is orientated at the acute angle relative to the plane of the multilayered PCB; wherein said camera module comprises a housing; wherein said main circuit board is disposed within said housing; wherein said camera is at least partially disposed within said housing; wherein said housing encloses said main circuit board and the imager circuit board; wherein said housing comprises a front portion that is in front of a rear portion of said housing; wherein said main circuit board is enclosed within said front and rear portions of said housing; wherein said camera is at least partially housed within said rear portion of said housing; wherein said camera module is configured for mounting at an in-cabin side of a vehicle windshield of the equipped vehicle, and wherein the vehicle windshield, as installed in the equipped vehicle, is sloped at an acute angle relative to horizontal; wherein said camera module mounts at the vehicle windshield via a mounting bracket that is attached at the in-cabin side of the vehicle windshield; wherein, with said camera module mounted at the mounting bracket attached at the in-cabin side of the vehicle windshield, said camera of said camera module views through the vehicle windshield to capture image data forward of the equipped vehicle; wherein one side of the mounting bracket comprises structure configured to cooperate with corresponding other structure of said camera module; wherein, when the mounting bracket is attached at the in-cabin side of the vehicle windshield and said camera module mounts at the mounting bracket, the structure of the mounting bracket and the other structure of said camera module cooperate to detachably secure said camera module at the mounting bracket; wherein the mounting bracket, as attached at the in-cabin side of the vehicle windshield, establishes the angle of view of said camera relative to the vehicle windshield when said camera module is mounted at the mounting bracket; and wherein said flexible ribbon cable passes via an opening in the multilayered PCB to connect with said second circuitry disposed at the second planar side of the multilayered PCB.",
"54.The vehicular vision system of claim 53, wherein the opening of the multilayered PCB comprises a hole that is surrounded by material of the multilayered PCB and that extends from the first side of the multilayered PCB to the second side of the multilayered PCB.",
"55.The vehicular vision system of claim 53, wherein the opening of the multilayered PCB comprises a cut-out section that is cut out from a section of the multilayered PCB.",
"56.The vehicular vision system of claim 53, wherein a portion of said camera extends through an opening of the multilayered PCB.",
"57.The vehicular vision system of claim 53, wherein, with said camera disposed at the first planar side of the multilayered PCB, the lens barrel of said camera is tilted at an angle between 10 degrees and 20 degrees relative to the plane of the multilayered PCB, whereby the principal viewing axis of the at least one lens accommodated in the lens barrel is angled between 10 degrees and 20 degrees relative to the plane of the multilayered PCB.",
"58.The vehicular vision system of claim 57, wherein, with said camera module mounted at the mounting bracket that is attached at the in-cabin side of the vehicle windshield, a stray light shield is positioned between said camera and the vehicle windshield to reduce incidence of stray light at the at least one lens of said camera.",
"59.The vehicular vision system of claim 57, wherein said camera disposed at the first planar side of the multilayered PCB is mechanically secured by at least one fastener at the multilayered PCB.",
"60.The vehicular vision system of claim 59, wherein said digital image processor disposed at the second planar side of the multilayered PCB comprises an image processing chip, and wherein a heat sink is placed over and in contact with said image processing chip.",
"61.The vehicular vision system of claim 60, wherein said image processing chip comprises an EyeQ3™ image processing chip.",
"62.The vehicular vision system of claim 61, wherein said housing of said camera module has a breadth and a length, and wherein the multilayered PCB extends across the breadth of said housing and along the length of said housing, and wherein said rear portion of said housing has a height, and wherein the imager circuit board is enclosed by said rear portion of said housing and is tilted at an acute angle with respect to said main circuit board.",
"63.The vehicular vision system of claim 62, wherein the breadth of said housing has a maximum dimension of 100 mm or less, and wherein the length of said housing has a maximum dimension of 100 mm or less, and wherein the height of said rear portion of said housing has a maximum dimension of 35 mm or less.",
"64.The vehicular vision system of claim 62, wherein the mounting bracket that is attached at the in-cabin side of the vehicle windshield is configured and constructed so that, with said camera module mounted at the mounting bracket attached at the in-cabin side of the vehicle windshield which is sloped at the acute angle relative to horizontal as installed in the equipped vehicle, said camera has a principal axis of its forward field of view directed at an angle closer to horizontal than the acute angle made by the vehicle windshield to horizontal.",
"65.The vehicular vision system of claim 64, wherein the acute angle made by the vehicle windshield to horizontal is in the range 24 degrees to 28 degrees, and wherein said camera, with said camera module mounted at the mounting bracket attached at the in-cabin side of the vehicle windshield, has the principal axis of its forward field of view directed at an angle within 2 degrees of horizontal.",
"66.The vehicular vision system of claim 62, wherein said flexible ribbon cable provides LVDS signals to said second circuitry disposed at the second planar side of the multilayered PCB.",
"67.The vehicular vision system of claim 53, wherein, with said camera module mounted at the mounting bracket that is attached at the in-cabin side of the vehicle windshield, the imager of said camera is within 4 mm distance to the portion of the vehicle windshield said camera views through.",
"68.The vehicular vision system of claim 53, wherein said rear portion of said housing has an aperture, and wherein at least a portion of said lens barrel of said camera extends through said aperture of said rear portion."
],
[
"<SOH> BACKGROUND OF THE INVENTION <EOH>Use of imaging sensors in vehicle imaging systems is common and known.",
"Examples of such known systems are described in U.S. Pat.",
"Nos.",
"8,324,552; 8,314,689; 8,222,588; 8,203,440; 7,994,462; 7,655,894; 7,339,149; 7,344,261; 7,459,664; 7,423,248; 6,097,023; 5,949,331; 5,670,935 and/or 5,550,677, which are hereby incorporated herein by reference in their entireties."
],
[
"<SOH> SUMMARY OF THE INVENTION <EOH>The present invention provides a vision system or imaging system for a vehicle that utilizes one or more cameras to capture images exterior of the vehicle, and provides the communication/data signals, including camera data or image data, which may be displayed or processed to provide the desired display images and/or processing and control, depending on the particular application of the camera and vision or imaging system.",
"The present invention provides a stray light shield for a forward facing imaging (FFI) machine vision camera module.",
"The stray light shield of the present invention adapts or customizes a standard or common camera module for a particular vehicle windshield application (for example, to compensate for the particular windshield angle used in the equipped vehicle so that the stray light shield construction generally compensates for the windshield rake angle so that, with the camera module attached at the vehicle windshield, the principal line of vision of the camera that is located in the camera module is set appropriately for the desired FFI application, for example, generally horizontal with the road being traveled).",
"The stray light shield preferably provides a tapered or wedge-shaped pocket or recess that is disposed in front of the lens/image sensor (such as a CMOS photosensor array or the like) and that shields the lens/image sensor from extraneous light emanating from within the cabin of the vehicle at which the camera module is disposed when the camera module is mounted either directly to the windshield or to a bracket that itself is attached at the windshield.",
"The stray light shield may be an integral part of the bracket that is attached to the windshield (and to which bracket the camera module is attached, preferably detachably attached) or the light shield may be formed as a separate component or element and may be attached or secured at the camera module (or at the bracket) before the camera module is attached at the bracket at the windshield.",
"The stray light shield may include a light baffling or light trapping structure or configuration or system that limits or reduces extraneous light that passes through a window or windshield of the equipped vehicle from exterior the vehicle from being directly or indirectly imaged by the forward facing camera that is at or near the windshield and that views through the windshield.",
"The light baffling/light trapping structure thus helps assure that light originating external of the vehicle that is incident at the image sensor of the forward facing camera emanates from (or is reflected by) objects of interest in the forward field of view of the imager (for example, other vehicles, pedestrians, road signs, oncoming headlights, leading taillights, road markers, construction zone lanes and/or the like), and the light baffling/light trapping structure or system does so in a manner that reduces extraneous light (such as sunlight glare, overhead streetlights, extraneous shop or billboard lighting or the like) from glaring at or otherwise confusing image data gathered by the forward facing camera and its associated image processing system.",
"According to an aspect of the present invention, a vehicle vision system or driver assistance system includes a camera module comprising an imager or camera or image sensor with a field of view through a window of the vehicle, such as a forward field of view through a windshield of the equipped vehicle when the camera module is disposed at the in-cabin surface of that window or windshield.",
"A bracket has an attachment portion that is configured to attach at an in-cabin surface of the vehicle windshield (such as by direct adhesive attachment or by attachment to one or more attachment elements that themselves are adhered at the in-cabin surface of the vehicle windshield).",
"A light shield comprises a base portion and side walls (preferably tapering side walls) that extend upward from the base portion so as to preferably provide a tapered pocket or cavity or recess, and wherein an aperture is provided at a narrower end of the tapered pocket.",
"The camera module comprises the imager assembly or camera having an image sensor array and a lens, and the camera module is configured to attach at the bracket (preferably to detachably attach).",
"When the camera module is attached at the bracket, with the light shield disposed at the camera module, the lens is disposed at the aperture (such as to protrude at least partially through the aperture and into the pocket, or such as to view into the pocket via the aperture) and views via the pocket through the windshield of the equipped vehicle.",
"The light shield may be an integral part of the bracket (for example, the light shield may be integrally molded with the bracket via an injection molding operation or the like) or may be a separate structure that is attached at the camera module (or that is attached at the bracket) before the camera module is attached at the bracket at the vehicle windshield.",
"The separate light shield (that is a separate and distinct component from the camera module) provides an adapting or customizing feature that, when disposed at the camera module at the vehicle windshield, adapts or configures the camera module for the particular vehicle and/or windshield application.",
"The light shield may include a light baffling device or structure or light trap disposed in front of the camera or imager and between a lens of the camera and the window of the vehicle.",
"The light baffling device comprises a plurality of baffle elements arranged in a spaced apart manner, with each baffle element comprising a generally vertically oriented element (or fin or rib or column or the like) having a first surface and a second surface opposite the first surface.",
"The first surface of a given baffle element is closer to the window than the second surface of the given baffle element.",
"The first surface may be configured to be at an angle of less than about five degrees relative to vertical and the second surface may be configured to be at an angle of less than about ten degrees relative to vertical when the camera and the light baffling device are normally mounted in the vehicle.",
"The baffle elements are arranged to limit or reduce extraneous light that passes through the window or windshield of the equipped vehicle (that can directly impinge or be incident on or at the camera or that may reflect or scatter in front of the camera) from reaching and being imaged by the camera.",
"Optionally, the first and second surfaces of the baffle element may be at different angles so that the baffle element narrows towards its upper end.",
"The upper end of the baffle element may narrow to a point or may be substantially pointed.",
"The vehicle window may comprise a vehicle windshield, such as a windshield that is angled relative to horizontal, such as an angle of at least about 15 degrees relative to horizontal or at least about 25 degrees relative to horizontal or at least about 30 degrees relative to horizontal or more, such as at least about 45 degrees relative to horizontal.",
"Therefore, the present invention provides for adaptation or customization of a camera module (such as a common or universal camera module) for various vehicle and/or windshield applications.",
"The stray light shield of the present invention is a separate component from the camera module and is attached at or disposed at the camera module at least when the camera module is attached or disposed at the vehicle windshield to adapt the camera module for the particular vehicle/windshield application.",
"In accordance with the present invention, a camera module manufacturer can manufacture a standard camera module that lacks a stray light shield, and the needed light shield can be customized for a particular vehicle brand and/or model.",
"Since the stray light shield can be manufactured at considerably lower cost and with greater flexibility than that of a camera module, this aspect of the present invention improves manufacturing economy and flexibility.",
"The present invention also provides enhanced imaging of light, such as light that passes through a windshield of a vehicle to a forward facing camera disposed at or near the windshield of the vehicle, by limiting or reducing imaging of reflected or scattered light.",
"The light baffling elements are spaced apart in front the imaging device to reflect the scattered light and reduce the amount of reflected or scattered light that is received by and imaged by the imaging device or camera.",
"The construction and arrangement of the light baffling elements is selected to limit or reduce imaging of the reflected or scattered light, and may be optimized via computer algorithms and design systems.",
"These and other objects, advantages, purposes and features of the present invention will become apparent upon review of the following specification in conjunction with the drawings."
],
[
"CROSS REFERENCE TO RELATED APPLICATIONS won The present application is a continuation application of U.S. patent application Ser.",
"No.",
"14/377,939, filed Aug. 11, 2014, now U.S. Pat.",
"No.",
"9,871,971, which is a 371 national phase filing of PCT Application No.",
"PCT/US2013/026101, filed Feb. 14, 2013, which claims the filing benefit of U.S. provisional applications, Ser.",
"No.",
"61/600,205, filed Feb. 17, 2012, which is hereby incorporated herein by reference in its entirety.",
"U.S. patent application Ser.",
"No.",
"14/377,939 is a continuation-in-part of U.S. patent application Ser.",
"No.",
"14/233,507, filed Jan. 17, 2014, now U.S. Pat.",
"No.",
"9,596,387, which is a 371 national stage filing of PCT Application No.",
"PCT/US2012/048993, filed Jul.",
"31, 2012 and published Feb. 7, 2013 as International Publication No.",
"WO 2013/019795, which is hereby incorporated herein by reference in its entirety, and which claims priority of U.S. provisional applications, Ser.",
"No.",
"61/583,431, filed Jan. 5, 2012, and Ser.",
"No.",
"61/514,191, filed Aug. 2, 2011.FIELD OF THE INVENTION The present invention relates to imaging systems or vision systems for vehicles.",
"BACKGROUND OF THE INVENTION Use of imaging sensors in vehicle imaging systems is common and known.",
"Examples of such known systems are described in U.S. Pat.",
"Nos.",
"8,324,552; 8,314,689; 8,222,588; 8,203,440; 7,994,462; 7,655,894; 7,339,149; 7,344,261; 7,459,664; 7,423,248; 6,097,023; 5,949,331; 5,670,935 and/or 5,550,677, which are hereby incorporated herein by reference in their entireties.",
"SUMMARY OF THE INVENTION The present invention provides a vision system or imaging system for a vehicle that utilizes one or more cameras to capture images exterior of the vehicle, and provides the communication/data signals, including camera data or image data, which may be displayed or processed to provide the desired display images and/or processing and control, depending on the particular application of the camera and vision or imaging system.",
"The present invention provides a stray light shield for a forward facing imaging (FFI) machine vision camera module.",
"The stray light shield of the present invention adapts or customizes a standard or common camera module for a particular vehicle windshield application (for example, to compensate for the particular windshield angle used in the equipped vehicle so that the stray light shield construction generally compensates for the windshield rake angle so that, with the camera module attached at the vehicle windshield, the principal line of vision of the camera that is located in the camera module is set appropriately for the desired FFI application, for example, generally horizontal with the road being traveled).",
"The stray light shield preferably provides a tapered or wedge-shaped pocket or recess that is disposed in front of the lens/image sensor (such as a CMOS photosensor array or the like) and that shields the lens/image sensor from extraneous light emanating from within the cabin of the vehicle at which the camera module is disposed when the camera module is mounted either directly to the windshield or to a bracket that itself is attached at the windshield.",
"The stray light shield may be an integral part of the bracket that is attached to the windshield (and to which bracket the camera module is attached, preferably detachably attached) or the light shield may be formed as a separate component or element and may be attached or secured at the camera module (or at the bracket) before the camera module is attached at the bracket at the windshield.",
"The stray light shield may include a light baffling or light trapping structure or configuration or system that limits or reduces extraneous light that passes through a window or windshield of the equipped vehicle from exterior the vehicle from being directly or indirectly imaged by the forward facing camera that is at or near the windshield and that views through the windshield.",
"The light baffling/light trapping structure thus helps assure that light originating external of the vehicle that is incident at the image sensor of the forward facing camera emanates from (or is reflected by) objects of interest in the forward field of view of the imager (for example, other vehicles, pedestrians, road signs, oncoming headlights, leading taillights, road markers, construction zone lanes and/or the like), and the light baffling/light trapping structure or system does so in a manner that reduces extraneous light (such as sunlight glare, overhead streetlights, extraneous shop or billboard lighting or the like) from glaring at or otherwise confusing image data gathered by the forward facing camera and its associated image processing system.",
"According to an aspect of the present invention, a vehicle vision system or driver assistance system includes a camera module comprising an imager or camera or image sensor with a field of view through a window of the vehicle, such as a forward field of view through a windshield of the equipped vehicle when the camera module is disposed at the in-cabin surface of that window or windshield.",
"A bracket has an attachment portion that is configured to attach at an in-cabin surface of the vehicle windshield (such as by direct adhesive attachment or by attachment to one or more attachment elements that themselves are adhered at the in-cabin surface of the vehicle windshield).",
"A light shield comprises a base portion and side walls (preferably tapering side walls) that extend upward from the base portion so as to preferably provide a tapered pocket or cavity or recess, and wherein an aperture is provided at a narrower end of the tapered pocket.",
"The camera module comprises the imager assembly or camera having an image sensor array and a lens, and the camera module is configured to attach at the bracket (preferably to detachably attach).",
"When the camera module is attached at the bracket, with the light shield disposed at the camera module, the lens is disposed at the aperture (such as to protrude at least partially through the aperture and into the pocket, or such as to view into the pocket via the aperture) and views via the pocket through the windshield of the equipped vehicle.",
"The light shield may be an integral part of the bracket (for example, the light shield may be integrally molded with the bracket via an injection molding operation or the like) or may be a separate structure that is attached at the camera module (or that is attached at the bracket) before the camera module is attached at the bracket at the vehicle windshield.",
"The separate light shield (that is a separate and distinct component from the camera module) provides an adapting or customizing feature that, when disposed at the camera module at the vehicle windshield, adapts or configures the camera module for the particular vehicle and/or windshield application.",
"The light shield may include a light baffling device or structure or light trap disposed in front of the camera or imager and between a lens of the camera and the window of the vehicle.",
"The light baffling device comprises a plurality of baffle elements arranged in a spaced apart manner, with each baffle element comprising a generally vertically oriented element (or fin or rib or column or the like) having a first surface and a second surface opposite the first surface.",
"The first surface of a given baffle element is closer to the window than the second surface of the given baffle element.",
"The first surface may be configured to be at an angle of less than about five degrees relative to vertical and the second surface may be configured to be at an angle of less than about ten degrees relative to vertical when the camera and the light baffling device are normally mounted in the vehicle.",
"The baffle elements are arranged to limit or reduce extraneous light that passes through the window or windshield of the equipped vehicle (that can directly impinge or be incident on or at the camera or that may reflect or scatter in front of the camera) from reaching and being imaged by the camera.",
"Optionally, the first and second surfaces of the baffle element may be at different angles so that the baffle element narrows towards its upper end.",
"The upper end of the baffle element may narrow to a point or may be substantially pointed.",
"The vehicle window may comprise a vehicle windshield, such as a windshield that is angled relative to horizontal, such as an angle of at least about 15 degrees relative to horizontal or at least about 25 degrees relative to horizontal or at least about 30 degrees relative to horizontal or more, such as at least about 45 degrees relative to horizontal.",
"Therefore, the present invention provides for adaptation or customization of a camera module (such as a common or universal camera module) for various vehicle and/or windshield applications.",
"The stray light shield of the present invention is a separate component from the camera module and is attached at or disposed at the camera module at least when the camera module is attached or disposed at the vehicle windshield to adapt the camera module for the particular vehicle/windshield application.",
"In accordance with the present invention, a camera module manufacturer can manufacture a standard camera module that lacks a stray light shield, and the needed light shield can be customized for a particular vehicle brand and/or model.",
"Since the stray light shield can be manufactured at considerably lower cost and with greater flexibility than that of a camera module, this aspect of the present invention improves manufacturing economy and flexibility.",
"The present invention also provides enhanced imaging of light, such as light that passes through a windshield of a vehicle to a forward facing camera disposed at or near the windshield of the vehicle, by limiting or reducing imaging of reflected or scattered light.",
"The light baffling elements are spaced apart in front the imaging device to reflect the scattered light and reduce the amount of reflected or scattered light that is received by and imaged by the imaging device or camera.",
"The construction and arrangement of the light baffling elements is selected to limit or reduce imaging of the reflected or scattered light, and may be optimized via computer algorithms and design systems.",
"These and other objects, advantages, purposes and features of the present invention will become apparent upon review of the following specification in conjunction with the drawings.",
"BRIEF DESCRIPTION OF THE DRAWINGS The drawings illustrate, by way of example only, embodiments of the present disclosure.",
"FIG.",
"1 is a perspective view of a vehicular camera system; FIG.",
"2 is a perspective view of a vehicle having the vehicular camera system; FIG.",
"3 is a plan view of a main circuit board of the vehicular camera system; FIG.",
"4A is a hidden-line top view of the vehicular camera system showing internal components; FIG.",
"4B is a hidden-line perspective view of the vehicular camera system showing internal components; FIG.",
"4C is a section view of the vehicular camera system along section line C-C of FIG.",
"4A; FIG.",
"5A is an exploded view of the vehicular camera system; FIG.",
"5B is an exploded view of the imager assembly; FIGS.",
"6A-B, 7A-B, 8A-B are perspective views that show a method of assembly of the vehicular camera system; FIG.",
"9 is a perspective view of a vehicular camera system with a stray light shield; FIG.",
"10 is a perspective view of a vehicular camera system with another stray light shield; FIG.",
"11 is a perspective view of another vehicular camera system of the present invention; FIGS.",
"12A and 12B are sectional views taken along the line XII-XII in FIG.",
"11, showing the camera system mounted at windshields having different windshield angles; FIG.",
"13 is a side elevation and partial sectional view of the vehicular camera system of FIG.",
"11; FIG.",
"14 is a plan view of a vehicle with a vision system and imaging sensors or cameras that provide exterior fields of view in accordance with the present invention; FIG.",
"15 is a perspective view of a windshield electronics module that is configured for housing a camera or imaging sensor at an interior surface of a vehicle windshield; FIG.",
"16 is a schematic showing light reflecting at a baffle configuration of the present invention; FIG.",
"17 is a perspective schematic of the baffle configuration and light reflection of FIG.",
"15; FIG.",
"18 is another schematic of a baffle configuration of the present invention, showing baffles with a first baffle surface of about zero degrees and a second baffle surface of about zero degrees, and as disposed at a windshield having an angle of about 60 degrees; FIG.",
"19 is another schematic of a baffle configuration of the present invention, showing baffles with a first baffle surface of about zero degrees and a second baffle surface of about five degrees, and as disposed at a windshield having an angle of about 60 degrees; FIG.",
"20 is another schematic of a baffle configuration of the present invention, showing baffles with a first baffle surface of about zero degrees and a second baffle surface of about ten degrees, and as disposed at a windshield having an angle of about 60 degrees; FIG.",
"21 is another schematic of a baffle configuration of the present invention, showing baffles with a first baffle surface of about five degrees and a second baffle surface of about ten degrees, and as disposed at a windshield having an angle of about 60 degrees; FIG.",
"22 is another schematic of a baffle configuration of the present invention, showing baffles with a first baffle surface of about five degrees and a second baffle surface of about five degrees, and as disposed at a windshield having an angle of about 60 degrees; FIG.",
"23 is a perspective view of a bracket or shroud for a windshield electronics module of the present invention; FIG.",
"24 is another view of the bracket of FIG.",
"23; FIG.",
"25 is a plan view of the bracket of FIGS.",
"23 and 24, shown with a camera module attached thereat; FIG.",
"26 is a perspective view of the camera module and bracket construction of FIG.",
"25, shown attached at a vehicle windshield; FIG.",
"26A is a sectional view of the camera module and bracket construction taken along the line A-A in FIG.",
"26; FIG.",
"26B is a sectional view of the camera module and bracket construction taken along the line B-B in FIG.",
"26; FIGS.",
"27A and 27B are plan views of camera module and bracket constructions of the present invention, shown with a common camera module and different brackets to accommodate different vehicle applications; FIG.",
"27C is a side elevation of a camera module of the present invention; FIGS.",
"28-30 are perspective views showing the steps in attaching a bracket and camera module at a vehicle windshield in accordance with the present invention; FIG.",
"31 is a perspective view of another camera module and separate light shield in accordance with the present invention; FIG.",
"32 is an underside perspective view of the separate light shield of FIG.",
"31; FIGS.",
"33-36 are views of the camera module and separate light shield of FIG.",
"31, showing the assembly of the light shield to the camera module; FIGS.",
"37-40 are views of the camera module and light shield assembly of FIG.",
"31, showing the attachment of the camera module and light shield assembly to a bracket attached at a vehicle windshield; FIGS.",
"41 and 42 are perspective views of the camera module and light shield assembly as attached to the bracket; FIG.",
"43 is a perspective view of another camera module attachment at a bracket in accordance with the present invention; FIG.",
"44 is a perspective view of the separate light shield of FIG.",
"31; FIG.",
"45 is a sectional view of the light shield of FIG.",
"44; FIG.",
"46 is a schematic of a light shield and baffles of the present invention; and FIG.",
"47 is a schematic of another light shield and baffles of the present invention.",
"DESCRIPTION OF THE PREFERRED EMBODIMENTS A vehicular camera system can be installed on the inside of the front windshield of a vehicle, such as a car, truck, bus, or van.",
"Such a camera system may be used for a variety of functions such as object detection, lane keeping, and high beam control.",
"FIG.",
"1 shows an example of a vehicular camera system or module 10 configured to be attached in a front-facing manner to a vehicle.",
"The camera system 10 includes a housing 12 and a lens barrel 14 projecting therefrom.",
"FIG.",
"2 shows a forward-facing position for a camera system 10 in the vehicle 100.The camera system or module 10 can be attached to the windshield 102, as shown, such as via a frame or bracket that is adhesively attached at the windshield via a plurality of fixing elements or attachment elements.",
"Other positions are also possible.",
"The camera system or camera module of the present invention may utilize aspects of the systems and/or modules described in PCT Application No.",
"PCT/US2012/048993, filed Jul.",
"31, 2012 and published Feb. 7, 2013 as International Publication No.",
"WO 2013/019795, and/or U.S. Pat.",
"Nos.",
"8,256,821; 7,480,149; 7,289,037; 7,004,593; 6,824,281; 6,690,268; 6,445,287; 6,428,172; 6,420,975; 6,326,613; 6,278,377; 6,243,003; 6,250,148; 6,172,613 and/or 6,087,953, and/or U.S. patent application Ser.",
"Ser.",
"No.",
"11/721,406, filed Jun.",
"11, 2007 and published Dec. 3, 2009 as U.S.",
"Publication No.",
"US-2009-0295181, which are all hereby incorporated herein by reference in their entireties.",
"Since the camera system 10 uses a portion of the limited amount of space on the windshield 102, which is needed for a clear view of the road and/or placement of other components of the vehicle, the camera housing 12 can be made as small as practical.",
"A height H (see FIG.",
"4C) of the camera housing 12 tends to have a relatively significant effect on driver and passenger visual perception.",
"As will be discussed below, the components of the camera system 10 can be configured to reduce the height H. In one example, the height H can be reduced to about 28 mm (about 1.1 inches), which is about 15 percent smaller than a comparable camera system.",
"As shown in FIG.",
"3, the camera system 10 includes a main circuit board 16, such as a printed circuit board (PCB), that has an opening 18, which may be referred to as a hole or a cut-out section.",
"The opening 18 can be approximately centrally located, as depicted, in the main PCB 16, or, in other examples, can be positioned at other locations.",
"The opening 18 is surrounded by material of the main PCB 16.The opening 18 can be formed by any mechanical technique suitable for the material of the main PCB 16, such as cutting, punching, drilling, or milling, or by another technique, such as laser cutting.",
"The opening 18 can be formed during the fabrication process of PCB material for use as PCBs or can be formed subsequently.",
"In the embodiment shown in FIG.",
"3, the opening 18 has a rectangular shape with rounded inside corners.",
"In other embodiments other shapes, such as elliptical, can be used for the opening 18.As seen in FIGS.",
"4A-C, the main PCB 16 is installed extending along a breadth B and length L of the housing 12.The main PCB 16 is dual-sided and has circuitry or electrical components or elements established at or populated at both sides of the PCB.",
"The main PCB 16 supports or includes or carries or has established thereon a digital image processor 20, memory components, power supply components, and a vehicle connector 22, which are electrically operatively coupled together by conductive traces and vias.",
"The processor 20 and memory are cooperatively configured to provide functions such as image processing, object detection, and lane detection.",
"The main PCB 16 can be multilayered.",
"In the above-mentioned example where the height H of the camera housing 12 is about 28 mm (about 1.1 inches), the breadth B of the housing 12 can be about 58 mm (about 2.3 inches) and the length can be about 85 mm (about 3.3 inches).",
"A forward height H2 of the housing can be about 10 mm (about 0.4 inches).",
"In addition to the 15 percent reduction in height, these dimensions afford as much as a 35 percent reduction in breadth and a 15 percent reduction in length with respect to the comparable camera system.",
"An imager assembly 24 extends through the opening 18 of the main PCB 16.The imager assembly 24 includes an imager 26, such as an integrated circuit (IC) imager, which receives light directed by a lens 28 positioned in front of the imager 26 to capture a scene in front of the vehicle.",
"The imager 26 can include a charge-coupled device (CCD), a complementary metal-oxide semiconductor (CMOS) active-pixel sensor (APS), or similar device.",
"The imager 26 is connected to an imager circuit board 30 (such as a PCB), and a lens holder 32 mechanically fixes the lens 28 to the imager PCB 30.The imager PCB 30 and the lens holder 32 extend along the height H of the housing 12 partially through the opening 18 of the main PCB 16, which can allow for the above-mentioned reduction in the height H of the housing 12.The imager PCB 30 extending along the height H need not be parallel to the height H, and the imager PCB 30 can be tilted at an angle, as depicted, resulting in the other components of the imager assembly 24 being tilted as well.",
"The magnitude of such angle can be selected to allow for the height H of the housing 12 to meet an operational constraint.",
"For example, when a taller housing 12 is acceptable, then the angle can be 90 degrees, meaning that the imager PCB 30 extends parallel to the height H or perpendicular to the main PCB 16.When a shorter housing 12 is needed, the magnitude of the angle can be reduced, thereby tilting the imager PCB 30 with respect to the main PCB 16 so that the imager PCB 30 is not perpendicular to the main PCB 16 (as depicted).",
"The location in the vehicle of the camera system 10 can be taken into account when determining the angle of the imager PCB 30.Geometric factors such as windshield slope and shape of the housing 12 as well as the desired field of view of the camera system 10 can be taken into account.",
"In this example, the angle is about 75 degrees.",
"In other examples, the angle can be smaller, such as about 60 degrees, or larger.",
"The imager PCB 30 also includes a flexible portion 34 that terminates at a small rigid PCB terminator 36.The flexible portion 34 can include any of a flexible connector (also known as a flex connector), a flexible PCB, a ribbon cable, wires, or the like.",
"The flexible portion 34 includes conductors that electrically connect the components of the imager PCB 30 to the terminator 36.The terminator 36 has an electrical connector 38 that attaches to a mating electrical connector 40 on the underside 64 of the main PCB 16.The flexible connector or ribbon cable provides image signals/data (such as LVDS signals or the like) to the circuitry of the main PCB.",
"Thus, the imager 26 and the main PCB 16 are operatively connected to allow image signals/data captured by the imager 26 to be received at the processor 20.The underside 64 is located opposite a top side 66 of the main PCB 16 on which the lens 28 is positioned.",
"The electrical connector 38 can be removably attachable to the electrical connector 40.FIG.",
"5A shows an exploded view of the camera system 10, where it will be seen that the housing 12 can be subdivided into an upper cover 12a and a lower cover 12b.",
"FIG.",
"5B shows an exploded view of the imager assembly 24.The housing upper cover 12a includes a lens opening 68 through which the lens 28 of the imager assembly 24 receives light.",
"Protective components can be installed within the housing 12 and can include a lens gasket 42, an imager resilient member 44, a heat sink 46, and a connector resilient member 48.The lens gasket 42 serves to reduce or eliminate infiltration of dust, particulate or moisture into the imager assembly 24 between the lens 28 and the lens holder 32.The heat sink 46 is positioned on the processor 20 to collect and dissipate heat generated by the processor 20.Each of the resilient members 44, 48 can include a foam cushion, or the like.",
"The imager resilient member 44 is of rectangular shape with a central rectangular opening sized to accommodate the imager 26.The imager resilient member 44 surrounds the imager 26 and is sandwiched between the imager PCB 30 and the lens holder 32, and serves to reduce or eliminate infiltration of dust, particulate, or moisture past the imager PCB 30 and the lens holder 32 to protect the imager 26.As shown in FIG.",
"4C, the connector resilient member 48 is sandwiched between the PCB terminator 36 that carries the electrical connector 38 and the lower cover 12b of the housing 12, and accordingly, the connector resilient member 48 transmits force from the lower cover 12b to the electrical connector 38 to ensure that the electrical connector 38 is firmly seated to the mating electrical connector 40 of the main PCB 16 in order to maintain a sound electrical connection between the imager PCB 30 and the main PCB 16.In this example, the thickness of the connector resilient member 48 is selected to be larger than the space between the lower cover 12b of the housing and the terminator 36, so that the resiliency of the connector resilient member 48 provides an effective seating force.",
"FIGS.",
"6A-B, 7A-B and 8A-B show a method of assembling the camera system 10.First, as shown in FIGS.",
"6A and 6B, the imager assembly 24 is assembled.",
"The lens 28 is screwed into the lens holder 32, or alternatively another technique, such as adhesive bonding, is used to mount the lens 28 to the lens holder 32.The lens holder 32 is fixed to the imager PCB 30 using, for example, one or more fasteners 50 (e.g., screws) that extend through holes 70 in the imager PCB 30 and mate with threaded holes in the lens holder 32.The lens gasket 42 is slid over and around the lens 28.Next, as shown in FIGS.",
"7A and 7B, the imager assembly 24 is placed in the housing upper cover 12a such that the lens 28 is aligned with the lens opening 68.The imager assembly 24 is mounted to the inside of the housing upper cover 12a by, for example, one or more fasteners 52 (such as, for example, screws or the like), which can mate with corresponding features (such as, for example, threaded holes or the like) in the upper cover 12a.",
"The lens holder 32 (see also FIG.",
"4B) includes wings 54 on either side having openings for receiving the fasteners 52.Next, the main PCB 16 is brought into alignment with the housing upper cover 12a and is fitted so that a portion of the imager assembly 24 extends through the opening 18 of the main PCB 16, as seen best in FIG.",
"4C.",
"The connector resilient member 48 is positioned on the inside of the housing lower cover 12b, and can be held in place using an adhesive or other technique.",
"The connector 38 is then extended through the opening 18 in the main PCB 16 (as can be seen in FIG.",
"8A), aligned with the mating connector 40 on the underside 64 of the main PCB 16 by virtue of the flexible portion 34, and mated with the connector 40.The electrical connection between the imager PCB 30 and the main PCB 16 is made.",
"The housing lower cover 12b is then fastened to the housing upper cover 12a via, for example, one or more fasteners 56, which compresses the connector resilient member 48 to firmly seat the camera-side connector 38 on the mating main PCB-side connector 40.In other examples, the method steps described above can be performed in an order different from that described.",
"FIG.",
"9 shows a frame or bracket 60 that can be attached to the camera housing 12 and that provides a stray light shield or light baffle or the like.",
"The stray light shield can function to reduce capture by the camera lens 28 of stray light or glare that may, for example, be reflected off of the windshield.",
"The frame or bracket 60 can be attached to the housing 12 by, for example, a mechanical clip-and-notch structure, referenced at 72, whereby the housing 12 of the accessory or camera module 10 may modularly locate and/or attach at the frame or bracket 60 with the frame or bracket attached at the windshield via fixing elements or attachment elements 76.For example, narrowing slots 74 can be provided in the frame or bracket 60 to removably mate with knobs or structure on the backs of the fixing elements 76.The pads of fixing elements 76 can be attached to the vehicle windshield by way of an adhesive (and such as by utilizing aspects of the modules described in U.S. patent application Ser.",
"No.",
"11/721,406, filed Jun.",
"11, 2007 and published Dec. 3, 2009 as U.S.",
"Publication No.",
"US-2009-0295181, which is hereby incorporated herein by reference in its entirety).",
"Alternatively, the pads can be suction pads.",
"The stray light shield of the frame or bracket 60 may comprise ridges 78 positioned (such as below and in front of the lens) to reduce the amount of light reflected into the lens 28 (such as by utilizing aspects of the vision systems described in U.S. provisional application Ser.",
"No.",
"61/600,205, filed Feb. 17, 2012, which is hereby incorporated herein by reference in its entirety).",
"Further, a shield gasket 80 can be positioned on the frame or bracket 60 around the lens 28 to reduce incursion of dust, particulate, or moisture into the vicinity of the lens 28.The gasket may utilize aspects of the gaskets described in U.S. patent application Ser.",
"No.",
"12/393,223, filed Feb. 26, 2009, which is hereby incorporated herein by reference in its entirety.",
"Thus, the frame or bracket 60 may be attached at the fixing elements 76 (which may be adhered at the in-cabin surface of the vehicle windshield), whereby the tapered or wedge-shaped recess or pocket (having the stray light shield portion and tapered sidewalls) is disposed in front of the camera and lens with the camera and lens viewing through the pocket and through the vehicle windshield.",
"FIG.",
"10 shows another stray light shield 62 that can be attached to or established at the camera housing 12.The stray light shield 62 can function to reduce capture by the camera lens 28 of stray light or glare that may, for example, be reflected off of the windshield.",
"The stray light shield 62 can be attached to the housing 12 by, for example, a mechanical clip-and-notch structure, such as shown at 82, and the module (with the stray light shield at the housing) may be mechanically attached to a frame or bracket adhesively attached at the windshield via a plurality of spaced apart fixing elements or attaching elements or the like.",
"The stray light shield 62 can include ridges 84 positioned to reduce the amount of light reflected into the lens 28.The stray light shield may comprise any suitable material, such as a shield that utilizes aspects of the light baffling system of the vision systems described in U.S. provisional application Ser.",
"No.",
"61/600,205, filed Feb. 17, 2012, which is hereby incorporated herein by reference in its entirety.",
"Thus, a stray or extraneous light shield may be selected or customized or adapted for a particular windshield/vehicle application of a camera module, and may be snapped onto (via a snap fit or snap attachment) or otherwise attached at the camera module to adapt or configure the camera module for the particular application.",
"For example, a common camera module may be used with a SUV having a windshield angle of, for example, about 28 degrees, or the same common module may be used with a compact vehicle having a windshield angle of, for example, about 24 degrees, by customizing the stray light shield for the respective requirements of the SUV or the compact vehicle, depending on the particular or target application of the camera module and stray light shield.",
"The side walls of the stray light shield are preferably dimensioned and configured so as to form a pocket that (with the camera module mounted at the windshield-attached bracket) is sufficiently large or dimensioned so that the field of view of the camera does not encompass the base portion and/or side walls of the stray light shield.",
"When the light shield and camera module are disposed at the windshield-attached bracket, the roof of the pocket (the upper boundary of the pocket of the stray light shield) is formed by the windshield and optionally a portion of the bracket and windshield.",
"For example, the stray light shield, when disposed at the bracket, is aligned with an aperture of the bracket, and a perimeter portion of the bracket that circumscribes the bracket aperture may overlap the side walls and may extend over the stray light shield such that a small portion of the “roof” of the stray light shield comprises the circumscribing portion of the bracket (and optionally the circumscribing portion of the bracket may have light traps or ribs or columns thereat).",
"The field of view of the camera, when the camera module and stray light shield are disposed at the windshield-attached bracket, preferably views through the aperture of the bracket (and may also view through an aperture or light transmitting opening of a light absorbing/opaque layer or frit layer at the windshield) and preferably does not encompass the circumscribing portion of the bracket (or any portion of the opaque layer at the windshield that circumscribes the aperture at the opaque layer).",
"Optionally, and with reference to FIGS.",
"11-13, a camera module 110 may be adjustable to adapt or configure the module for different windshield applications (having different angles relative to horizontal) of different vehicles, while still providing the desired, generally horizontal, forward field of view of the camera or imager assembly 124.The camera module 110 is configured to mechanically attach to a frame or bracket 160, which includes a plurality of fixing elements or attaching elements 176, which are configured for adhesive attachment to the in-cabin surface of the vehicle windshield.",
"The camera module 110 may attach to the frame or bracket (with the frame or bracket attached at the windshield surface) via any suitable means, such as via a sliding engagement or snap attachment or the like.",
"As can be seen with reference to FIGS.",
"12A and 12B, the imager assembly 124 (including the imager 126, lens 128, imager circuit element or board 130 and lens holder 132) extends through the opening 118 of the main circuit element or board 116 and may be adjusted or pivoted relative to the camera module housing 112 and main circuit board 116 to adjust the angle of the imager assembly (and the imager 126 and lens 128) relative to horizontal so as to provide the desired field of view and viewing angle or lens tip angle of the imager assembly for different windshield/vehicle applications.",
"For example, and as shown in FIG.",
"12A, for a windshield with a reduced slope, the imager assembly 124 is pivoted or adjusted or set to provide the desired or appropriate lens tip angle when the camera module 110 is attached at the frame or bracket 160 at the windshield 102.For a windshield with a greater slope, and such as shown in FIG.",
"12B, the imager assembly 124 is pivoted or adjusted or set at a different angle relative to the main circuit board 116 to provide the desired or appropriate lens tip angle when the camera module 110 is attached at the frame or bracket 160 at the windshield.",
"In both configurations shown in FIGS.",
"12A and 12B, the distance D from the inner surface of the windshield 102 to the lower surface of the housing 112 (when the camera module 110 is attached at the frame or bracket 160 at the windshield) is about the same because the camera modules mount or attach at the windshield in the same manner, with only the imager assembly being adjusted or pivoted within the module to adjust the viewing angle or lens tip angle of the imager assembly.",
"The imager assembly 124 is mounted at the housing 112 (or to the main circuit board 116 or the like) via one or more threaded fasteners.",
"For example, and as shown in FIG.",
"13, the imager assembly 124 may include a holder or mounting structure 125 (such as a plastic holder or the like) that is attached at the housing 112 and supports the imager 126 and lens assembly 128 and imager circuit board 130).",
"The holder 125 includes a mounting or stationary or fixed portion 125a that may be attached or fastened to a threaded fastener 112a of the housing, whereby a rotatable portion or adjustable portion 125b of holder 125 of imager assembly 124 may be rotatable or pivotable or adjustable relative to the mounting portion 125a to provide for adjustment of the tip angle of the lens 128 and viewing angle of the imager 126 relative to the housing 112 and main circuit board 116.The adjustable portion 125b of the holder 125 of imager assembly 124 thus may be adjusted relative to the mounting portion 125a to provide the desired tip angle or viewing angle and may be secured at the selected or adjusted or appropriate orientation, such as via tightening of a fastener or the like.",
"Optionally, the adjustable portion 125b may have a ratcheting engagement with the mounting portion 125a or may have multiple detent settings, such that an operator adjusts or sets or clicks the adjustable portion 125b to the desired or appropriate angle relative to the mounting portion 125a to set the desired or appropriate viewing angle of the imager and lens for the particular windshield angle of the windshield of the particular vehicle application of the camera module 110.Optionally, instead of having an adjustable holder portion, the holder may be removable and replaceable so that an appropriately angled holder may be selected for the particular windshield application, with the camera and lens and circuit board and the like being common components for various applications.",
"Thus, the camera module of the present invention provides for a low profile module that may be selected or adjusted to provide a desired viewing angle for the particular application of the camera module.",
"The module thus keeps the lens angle or viewing angle of the imager in the same orientation or position for different windshield angle applications.",
"The module may be adapted or configured for different applications by adjusting the camera holder or installing an appropriate or selected low cost plastic holder or replacing the plastic holder with an appropriate or selected holder, while keeping the camera and lens and PCB and housing the same or common components of the module for the various windshield applications (so that the manufacturer does not have to replace the PCB for different windshield angles), and while keeping the profile of the module the same for various windshield applications.",
"The holder may be threadedly fastened or screwed to the cover or housing, such as at either side of the holder (with one fastener at one side of the holder shown in FIG.",
"13).",
"Because of the number of components established at the main circuit board, it is desirable to have the main circuit board comprise a double sided PCB with circuitry and components established at both sides of the circuit board.",
"The flexible connector or cable provides LVDS signals conveying image data captured by the imager to the image processor of the main circuit board.",
"Alternately, image data captured by the imager may be conveyed to the image processor via the likes of Ethernet or by the protocols described in U.S. Pat.",
"No.",
"7,697,027, which is hereby incorporated herein by reference in its entirety.",
"The aperture or opening or hole in the main circuit board provides for passage of the flexible connector through the circuit board so as to establish electrical connection to the opposite side of the main circuit board, and the aperture or opening or hole in the main circuit board also at least partially receives a portion of imager assembly (such as a portion of the imager circuit board and/or imager and/or lens holder and/or lens) to provide a lower profile camera system or module.",
"Optionally, the camera module may include ventilation means for ventilating the module at the windshield (such as by utilizing aspects of the modules described in U.S. patent application Ser.",
"No.",
"11/721,406, filed Jun.",
"11, 2007 and published Dec. 3, 2009 as U.S.",
"Publication No.",
"US-2009-0295181; and/or U.S. patent application Ser.",
"No.",
"12/393,223, filed Feb. 26, 2009, which are hereby incorporated herein by reference in their entireties).",
"For example, the ventilation means may comprise one or more vents or ports or ventilation openings (such as a vent or port or opening established through the housing and/or gasket and/or frame or the like), a gas permeable and fluid impermeable material, a baffle that passes air and that blocks moisture, and/or a breathable membrane and/or the like.",
"Such ventilation means may be provided to reduce moisture or fogging of the windshield at the viewing area of the camera or imager.",
"Optionally, a localized heater element or grid may be established at the windshield (such as a conductive trace, such as a transparent conductive trace or the like, established at the in-cabin surface of the windshield local to the camera module) to provide heating of the windshield at the area through which the camera views, in order to reduce moisture or fogging of the windshield at the viewing area of the camera or imager.",
"Terms such as top side, underside, and height are used herein in a relative sense and are not intended to be limiting with respect to vertical or horizontal orientation.",
"For example, in a hypothetical example, a camera system may be installed such that a top side is positioned below an underside.",
"According to an aspect of the present invention, a vehicular camera system includes an imager assembly including an imager disposed on an imager circuit board and a lens positioned to direct light to the imager.",
"The vehicular camera system further includes a main circuit board operatively connected to the imager circuit board.",
"The main circuit board includes at least one processor for processing images captured by the imager.",
"The main circuit board includes an opening, and at least a portion of the imager assembly extends through the opening.",
"The imager circuit board can extend through the opening of the main circuit board.",
"Optionally, for example, and such as best seen in FIG.",
"6A, the imager circuit board may have a narrowed portion that is sized to fit at least partially through the aperture or opening of the main circuit board, with the wider portion of the imager circuit board disposed above the main circuit board when the imager assembly is disposed at the main circuit board.",
"Thus, a portion of the imager circuit board extends through the opening of the main circuit board, and optionally, a portion of the imager and/or of the lens holder and/or the lens may extend at least partially through the opening of the main circuit board when the imager assembly is disposed at the main circuit board.",
"The vehicular camera system can further include a housing having a breadth and a height.",
"The main circuit board can extend generally along the breadth of the housing and the imager circuit board can extend generally along the height of the housing.",
"The imager circuit board can include a flexible portion that terminates at an electrical connector.",
"The electrical connector can be connected to an underside of the main circuit board, the underside being opposite a top side of the main circuit board at which the lens is positioned.",
"The vehicular camera system can further include a connector resilient member sandwiched between the electrical connector and the housing to seat the electrical connector to a mating electrical connector positioned on the underside of the main circuit board.",
"The housing can be configured to be mounted to the front of a vehicle.",
"The vehicular camera system can further include a lens holder connecting the lens and the imager circuit board.",
"The lens holder can extend through the opening of the main circuit board.",
"The opening can be surrounded by material of the main circuit board.",
"The opening can have a rectangular shape.",
"The opening can have rounded inside corners.",
"The imager circuit board can be tilted at an angle with respect to the main circuit board.",
"The vehicular camera system can further include a stray light shield positioned to reduce stray light reflected to the lens.",
"According to another aspect of this disclosure, a method of assembling a vehicular camera system includes positioning an imager assembly at a top side of a main circuit board.",
"The imager assembly can have a lens and an imager for capturing images and the main circuit board can have a processor for processing the captured images.",
"The method further includes extending a portion of the imager assembly through an opening in the main circuit board, and operatively connecting the portion of the imager assembly with an underside of the main circuit board opposite the top side.",
"Extending a portion of the imager assembly through an opening can include extending a flexible portion through the opening.",
"Operatively connecting can include connecting an electrical connector of the imager assembly with a mating electrical connector of the main circuit board.",
"The method can further include positioning a connector resilient member between an inside of a housing and the electrical connector.",
"The method can further include fastening a lower cover of the housing to an upper cover of the housing to compress the connector resilient member to firmly seat the electrical connector to the mating electrical connector.",
"The method can further include fastening the imager assembly to the upper cover of the housing.",
"The method can further include attaching a stray light shield to the housing.",
"The driver assist system and/or vision system and/or object detection system and/or alert system may operate to capture images exterior of the vehicle and process the captured image data to detect objects at or near the vehicle and in the predicted path of the vehicle, such as to assist a driver of the vehicle in maneuvering the vehicle in a rearward direction.",
"The object detection may utilize detection and analysis of moving vectors representative of objects detected in the field of view of the vehicle camera, in order to determine which detected objects are objects of interest to the driver of the vehicle, such as when the driver of the vehicle undertakes a reversing maneuver.",
"Referring now to FIG.",
"14, a vehicle 10 includes an imaging system or vision system 12 that includes a forward facing camera or imaging sensor 13 disposed behind the windshield 20 of the vehicle and having a forward field of view through the windshield of the vehicle.",
"The vision system 12 may also include one or more other imaging sensors or cameras (such as a rearward facing imaging sensor or camera 14a and/or a forwardly facing camera 14b at the front of the vehicle, and/or a sidewardly/rearwardly facing camera 14c, 14b at the sides of the vehicle), which capture images exterior of the vehicle, with the cameras having a lens for focusing images at or onto an imaging array or imaging plane of the camera (FIG.",
"14).",
"The vision system 12 is operable to process image data captured by the cameras and may provide displayed images at a display device 16 for viewing by the driver of the vehicle.",
"Optionally, the vision system may process image data to detect objects, such as objects forward of the vehicle during forward driving or such as objects to the rear of the subject or equipped vehicle during a reversing maneuver, or such as approaching or following vehicles or vehicles at a side lane adjacent to the subject or equipped vehicle or the like.",
"Forward facing driver assistant image sensors or cameras that are installed behind the vehicle's front windshield are known.",
"It is also known to encase such sensors in a manner so that light from the outside of the vehicle can enter or be captured by the image sensor, but also so that reduced or no light from within the vehicle is captured by the image sensor.",
"Some image sensor cases may have grooves or polymorph surfaces to reduce scattered light from within the vehicle.",
"On optical thresholds of transparent surfaces (such as glass to air, such as the vehicle windshield to air within the cabin of the vehicle), the light passing from its source to the light sensor or camera becomes reflected, sometimes scattered.",
"Also, the geometrics of the windshield and the sensor housing may cause scattered light.",
"Further, the windshield's tilt angle may have an influence to the light reflection ratio.",
"Images captured by image sensors or cameras (such as forward facing image sensors) become distorted by scattered or reflected light, which does not originate from direct rays of light sources or objects in front of the vehicle that are in the field of view of the image sensor and/or within the scope of the driver assistant system's surveillance (machine vision or provided to a human machine interface or HMI or the like).",
"The sensor case may have grooves or polymorph surfaces for catching or reducing scattered light, but these typically do not possess optimized surfaces for advanced scatter capturing.",
"The light trap or baffles, formed of light absorbing materials/surfaces, may trap the extraneous light and limit or preclude or reduce the extraneous light from reflecting towards the camera.",
"The light baffle or light trap may comprise dark or light absorbing baffles or ribs or columns or pits or depressions or the like (such as baffles or ribs formed of a dark or black plastic material or the like) to limit or reduce the amount of light that reflects off of the baffles.",
"For enhancing or optimizing the capability to capture scattered light, the present invention utilizes specifically designed baffles.",
"These baffles are disposed or placed along an inner surface of a vision system image sensor casing.",
"In the illustrated embodiment, the image sensor and casing are disposed behind the front windshield of a vehicle, and the casing has an opening to the front capturing light that passes through the windshield.",
"The baffles may comprise a plurality of spaced apart elongated ribs or vanes with angled or generally vertical surfaces.",
"The individual ribs or vanes may comprise elongated linear or curved ribs or vanes (and optionally may be slightly curved to generally correspond with the curvature of the windshield at the area where the camera module or windshield electronics module is disposed), with the angled surfaces of the individual ribs or vanes or elements and the spacing distance between the individual ribs or vanes or elements being selected to provide the desired baffling and/or reflecting of light for the particular application of the imaging sensor or camera.",
"The camera or module may utilize aspects of the cameras described in PCT Application No.",
"PCT/US2012/048993, filed Jul.",
"31, 2012 and published Feb. 7, 2013 as International Publication No.",
"WO 2013/019795, which is hereby incorporated herein by reference in its entirety.",
"As shown in FIG.",
"15, the forward facing camera 13 may be disposed at or housed at a casing or module 18 (such as at a windshield electronics module or the like) that is configured to attach at an interior or in-cabin surface of a vehicle windshield 20.Optionally, the module 18 and camera 13 may utilize aspects of the imaging systems and/or modules described in U.S. Pat.",
"Nos.",
"7,946,505; 7,188,963; 7,004,593; 6,824,281; 6,968,736; 6,690,268; 6,250,148; 6,341,523; 6,593,565; 6,428,172; 6,501,387; 6,329,925 and 6,326,613, and/or in U.S. patent application Ser.",
"No.",
"10/538,724, filed Jun.",
"13, 2005 and published Mar.",
"9, 2006 as U.S.",
"Publication No.",
"US-2006-0050018, and/or U.S. patent applications, Ser.",
"No.",
"11/721,406, filed Jun.",
"11, 2007, now U.S. Pat.",
"No.",
"8,256,821; and/or U.S. Ser.",
"No.",
"13/258,850, filed Sep. 22, 2011, now U.S. Pat.",
"No.",
"8,451,332, which are hereby incorporated herein by reference in their entireties.",
"Optionally, the forward facing camera may be disposed at a module that is spaced from the windshield, such as at or near or part of the interior rearview mirror assembly, or the forward facing camera may be disposed at or in the interior rearview mirror assembly that is attached at an in-cabin portion of the vehicle, while remaining within the spirit and scope of the present invention.",
"The baffles or light baffling elements of the baffle configuration or structure 22 may be disposed or established at a plate or substrate, which may be disposed at or in the module and may be arranged generally horizontally in front of and below the imaging sensor (or a lens or optical assembly of the imaging sensor or camera), with the baffles extending laterally in a cross car direction in front of the imaging sensor or camera.",
"The baffles or light baffling elements may be generally vertically arranged at the plate or substrate or base of the baffle structure, so that the light baffling elements may be generally vertically oriented when the base of the structure is generally horizontally disposed at the vehicle (with selected angles of the opposite surfaces of the light baffling elements as discussed below).",
"As shown in FIGS.",
"16-22, the baffles or light baffling elements have a first or front facing reflection surface and a second or rear facing reflection surface.",
"Both reflection surfaces are disposed at and have a vertical angle.",
"The reflection angle of the first surface is at or close to vertical, while the reflection angle of the second surface is within about 10 degrees from vertical.",
"In the illustrated embodiment, the baffles are generally in a spike like shape, with the baffles top optionally and desirably being substantially pointed or sharp, such as being as sharp as possible for the particular manufacturing techniques used to manufacture the baffles.",
"As can be seen in FIGS.",
"16-22, the height of the baffles may be equal or substantially equal.",
"Optionally, the height of the baffles may be unequal, such as in a pattern configuration, such as a linear height pattern, an exponential height pattern a logarithmic height pattern, an alternating row height pattern, a squared sine height pattern or the like.",
"Optionally, the baffles are spaced apart by a predetermined or selected or appropriate distance.",
"For example, the baffles may be spaced apart by specific distances, or the baffle's may be set up in a pattern, or the baffle's spacing distances may be a ratio of the height of the baffles or spikes.",
"Optionally, the baffle's spacing distances pattern may be a linear pattern or an exponential pattern or a logarithmic pattern or an alternating row pattern or a squared sine pattern or the like.",
"Optionally, and desirably, the baffle's surfaces, angles, height, spacing distances and/or the like, may, at least in part, be designed or generated by an optimization algorithm, such as by a simulating ray tracing algorithm or the like.",
"Optionally, the optimization algorithm may use various input parameters, such as the length, width, height, opening angle of the light sensor casing, as well the position of the sensor relative to the opening or baffles, the opening angle of the sensor optics, the tilt angle of the windshield and the different materials' surface reflection ratio and/or the like.",
"Optionally, the optimization may comprise an evolutionary hill climbing algorithm (try—evaluate—decide change—return), or the like.",
"Therefore, the present invention provides a vehicle vision system that provides enhanced imaging of light that passes through a window or transparent panel of a vehicle, such as through a windshield of the vehicle or the like.",
"The light may be scattered or reflected as it passes through the window or windshield, and the system includes a baffle or light baffling system or configuration to reduce the amount of reflected or scattered light that is imaged by or received by the imaging sensor or camera.",
"The vehicle vision system of the present invention thus provides enhanced display of information and images to the driver of the vehicle based on images captured by one or more cameras or image sensors of the vehicle and having exterior fields of view, such as forwardly, rearwardly and sidewardly of the vehicle.",
"Optionally, the bracket may include attachment means (such as slots or the like) for attaching the bracket to one or more (such as three or four) fixing elements or attachment elements adhered at the windshield surface, and may include a stray light shield that shields light emanating from inside the vehicle from being received by the camera, such as in a similar manner as shown in FIGS.",
"9 and 11.Thus, the bracket provides the light shield at or in front of the camera and lens, and may also provide a light baffling element or system that limits light emanating from outside the vehicle and passing through the windshield from reflecting off of the generally horizontal portion of the bracket in front of the camera towards the camera and lens.",
"The light baffling system provides a plurality of baffles or generally vertically oriented ribs that cause the light passing through the windshield to reflect between opposing surfaces of the ribs before reflecting towards the camera and lens, such that the light is scattered and the intensity of the scattered light at the camera and lens is reduced.",
"As discussed above, the present invention provides for a camera module that is attachable at or to a bracket that attaches at the vehicle windshield, with the bracket having a light shield that is separate from the camera module so as to adapt the camera module for the particular vehicle or windshield application of the camera module.",
"Typically, different OEMs and different types and styles of vehicles elect to use different windshield angles (for example, some windshields of some vehicles are more vertical and some windshields of some vehicles are more sloped).",
"The present invention provides a light shield element or component that is selected for a particular windshield or vehicle application, such that a common camera module may be used in various applications (having different windshield angles and the like), with a selected or appropriate light shield and bracket used to mount or attach the common or universal camera module at the windshield.",
"By placing the light shield at the bracket and/or separate from the camera module, the manufacturer can set or compensate for the particular windshield angle of a particular vehicle by the forming or molding (such as injection molding of a polymeric material, preferably a dark or light absorbing or non-reflecting plastic or polymeric material or the like) of that particular light shield.",
"The present invention thus may provide for a standard or stock camera module that is configured to attach to a selected particular bracket for a particular application.",
"The field of view of the camera or imager of the standard camera module may be set for the different vehicle applications by using the molding of the selected bracket for the different applications.",
"The present invention thus provides for a separate and independent light shield, which provides for decoupling or divorcing of the light shield from the camera module itself.",
"Thus, when the light shield and bracket abut against the windshield, the aperture of the frit allows light to pass through the windshield, while the walls of the pocket of the light shield abut the windshield (with a gasket or seal disposed therebetween) to block light emanating from inside vehicle from being received by the imager.",
"For example, and with reference to FIGS.",
"23-30, a camera system 310 includes a camera module or housing 312 that houses a camera and lens or imager assembly 328 and that is attachable at a bracket or frame 360, which in turn is attachable at a vehicle windshield.",
"As shown in FIGS.",
"23 and 24, the bracket 360 comprises an attaching portion 360a (which may comprise a generally planar plate or portion or a curved plate or portion that is curved to correspond to a curvature of the windshield that it will attach to) that has a plurality of slots or attaching elements 360b formed thereat for attaching the bracket to a plurality of fixing elements 376 adhered at the in-cabin surface of the vehicle windshield.",
"In the illustrated embodiment, there are four slots 360b for receiving a portion of four fixing elements 376 (FIGS.",
"26, 28 and 29).",
"The fixing elements 376 each have a base or adhering portion 376a for attaching at the in-cabin surface of the vehicle windshield W and an elongated neck portion 376b extending therefrom, and with a larger diameter attaching portion 376c for retaining the bracket at the fixing element when the larger diameter attaching portion is received through a larger slot portion of the slots 360b and moved to a narrower or smaller slot portion of the slots 360b, as discussed below.",
"The bracket 360 also includes one or more front tabs or elements 360c and rear tabs or elements 360d for retaining the camera housing or module at the bracket, as also discussed below.",
"As best shown in FIGS.",
"23 and 24, the bracket or frame 360 includes the light shield 362 (which, in the illustrated embodiment, is integrally formed or molded with the rest of the bracket), which comprises a tapered generally wedge-shaped pocket or recess 362a having a lower or base portion 362b and tapering sidewalls 362c, with a gasket or seal 362d disposed around a perimeter of the light shield 362.An aperture 362e is established through the bracket 360 at the narrower end region of the pocket or recess 362a to at least partially receive a lens portion 328a of the camera 328 when the camera module 312 is attached at the bracket.",
"Thus, when the bracket 360 is attached at the fixing elements 376 at the windshield W, the seal 362d engages or seals against the in-cabin surface of the windshield and the side walls 362c and lower portion 362b of the light shield 362 function to substantially block or attenuate light emanating from inside the vehicle cabin from entering the pocket or recess 362a at which the camera is disposed.",
"In the illustrated embodiment, the light shield 362 also includes a plurality of baffles or ribs at the lower portion 362b to limit glare or reflection of light emanating from outside of the vehicle and passing through the windshield from being received at the camera or imager assembly.",
"As shown in FIG.",
"28, the windshield W may have an opaque or light absorbing or non-light-transmitting layer 380 (such as an opaque ceramic frit layer or the like) disposed at the area of the windshield at which the bracket is mounted, with an aperture 380a established through the opaque layer generally at the area in front of and generally aligned with the imager assembly when the bracket and camera housing are attached at the windshield.",
"Thus, and as can be seen with reference to FIGS.",
"26, 28 and 29, the windshield W may have a plurality of fixing elements 376 adhered at its inner or in-cabin surface at an area or region of the windshield at which an opaque layer 380 is established.",
"As best shown in FIG.",
"28, an aperture 380a is formed through the opaque layer 380.As shown in FIG.",
"29, the bracket may be attached at the fixing elements 376 to attach the bracket at the windshield.",
"As can be seen in FIG.",
"29, when the bracket 360 is so attached, the pocket 362a of the light shield 362 is disposed generally at or behind the aperture 380a, with the seal 362d engaging or sealing the in-cabin surface of the windshield.",
"Optionally, the seal 362d may comprise an open cell foam material (such as by utilizing aspects of the camera systems described in U.S. patent application Ser.",
"No.",
"12/393,223, filed Feb. 26, 2009, which is hereby incorporated herein by reference in its entirety), and one or more other sealing elements or pads 382 (which may comprise any suitable material, such as a closed cell foam material or the like) may be disposed between the bracket 360 and the windshield W to maintain a substantially constant gap between the bracket and the windshield surface and/or to limit rattling or the like when the bracket is attached at the windshield.",
"As shown in FIG.",
"30, the camera module or housing 312 may be moved or slid along the bracket 360 to attach the housing at the bracket.",
"For example, the front of the housing 312 may include a front mounting lip 312a that is received at or engages the front mounting tab or tabs 360c of the bracket while a rear mounting tab 312b of the camera housing 312 may engage or slide along the respective rear tab 360d of the bracket.",
"The camera housing or module is slid along the bracket until the locking tab 312c of the camera housing engages a receiving portion 360e of the bracket 360, whereby the locking tab limits or substantially precludes movement of the housing in the opposite direction, thereby retaining the camera housing or module at the bracket.",
"When the camera housing or module 312 is so attached at the bracket 360, the lens 328a of the imager assembly protrudes at least partially through the opening 362e in the shield portion 362 of the bracket 360, with its field of view through or across the pocket 362a and through the aperture 380a at the windshield W. When the camera module is attached at the bracket at the windshield (such as shown in FIGS.",
"26, 26A and 26B), the imager assembly 328 has a field of view through the aperture 380a in the opaque layer 380 at the windshield W, with no obstruction in the field of view of the imager.",
"The field of view of the imager is set (such as by the bracket configuration) to be at or slightly above horizontal (such as, for example, at at least about 0.5 degrees above horizontal or about 1 degree above horizontal or at about 2 degrees above horizontal or thereabouts), with the field of view of the imager encompassing the ground ahead of the equipped vehicle at less than about 7 m from the imager.",
"The stray light shield 360 is arranged so that it extends from the lens of the imager to where the field of view of the imager crosses the windshield.",
"The camera module and bracket configuration also provide for the imager to be mounted at the windshield at a location that is a reduced distance from the windshield (such as less than about 4 mm, preferably less than about 2 mm and preferably about 2.0+/−1.9 mm or thereabouts).",
"The camera module 312 may comprise a reduced size camera module, such as a module or housing that is less than about 100 mm long (such as less than about 90 mm long and such as, for example, about 88 mm long or thereabouts) and that is less than about 100 mm wide (such as less than about 75 mm wide and such as, for example, about 58 mm wide or thereabouts) and that is less than about 35 mm tall (such as less than about 30 mm tall and such as, for example, about 29 mm tall or thereabouts).",
"The imager may comprise any suitable imager or imaging array, such as, for example, a wide VGA imager having, for example, 752 columns.",
"Optionally, the imager may only use about 640 columns of pixels of the imaging array.",
"Thus, the imager or image processor may have about 112 columns or 56 columns in either direction to adjust the imager to accommodate for any misalignment or yaw (such as within a range of about +/−3 to 4 degrees or thereabouts) of the imager when the camera module is mounted at the windshield of a vehicle.",
"The camera module or system may also provide for adjustment of the imager's field of view to accommodate variation in tip angle (such as, for example, about +/−6 degrees or thereabouts) and/or roll angle (such as, for example, about +/−3 degrees or thereabouts).",
"As can be seen with reference to FIGS.",
"27A and 27B, the camera module 312 may be selectively attached at a selected bracket 360 (FIG.",
"27A) or bracket 360′ (FIG.",
"27B).",
"The selected bracket 360, 360′ establishes the angle of the imager relative to the windshield and is selected based at least in part on the windshield angle of the vehicle at which the camera is to be installed.",
"For example, the bracket 360 sets or mounts the camera module for a windshield angle of about 23 degrees relative to horizontal and a camera height of about 120 cm, while the bracket 360′ sets or mounts the camera module for a windshield angle of about 23 degrees relative to horizontal and a camera height of between about 120 cm and about 135 cm.",
"As can be seen by comparing FIGS.",
"27A and 27B, the bracket 360′ has a larger light shield 362′ than the light shield 362 of bracket 360.As shown in FIG.",
"27C, the camera module 312 is formed with the camera or imager 328 and lens 328a angled upwardly at an angle of at least about 10 degrees to an angle of about 20 degrees or more, preferably, for example, at an angle of about 16 degrees, relative to the housing of the camera module.",
"Such an angle allows the imager and module to be disposed close to the windshield for applications at the most common vehicle windshield or rake angles (such as between about 19 degrees relative to horizontal and about 26 degrees relative to horizontal).",
"Thus, in accordance with the present invention, the camera holder or module (including the camera and housing portion) is configured to attach to a bracket that is attachable at the in-cabin surface of the vehicle windshield, such as via attachment to one or more attachment elements adhesively attached at the in-cabin surface of the vehicle windshield.",
"The bracket has an aperture for at least partially receiving and/or aligning with the camera and lens, such that the camera views through the windshield of the vehicle when the camera holder is attached at the bracket that is attached at the windshield.",
"The camera holder and/or the bracket and/or a separate element provides a light shield having a wedge-shaped or tapered recess or pocket at the camera lens, whereby the camera views through the recess or pocket and through the windshield (such as by utilizing aspects of the camera systems described in U.S. Pat.",
"Nos.",
"8,256,821 and/or 6,824,281, and/or U.S. patent application Ser.",
"No.",
"13/470,860, filed May 14, 2012, now U.S. Pat.",
"No.",
"8,405,726, which are hereby incorporated herein by reference in their entireties).",
"The wedge-shaped recess or pocket is defined or formed by a base portion and opposite sidewalls that taper towards the lens and that extend generally upwards from the base portion to form the wedge-shaped recess or pocket between the in-cabin surface of the windshield and the base portion.",
"Thus, the camera holder or module or unit may comprise a common or universal component for vehicle vision system, and the bracket may be selected for a particular vehicle application.",
"For example, a bracket of the present invention may be selected or provided that has the appropriate attachment for a particular windshield angle and that has a light shield and wedge-shaped recess or pocket formed or selected for the particular windshield angle and windshield application.",
"Thus, the dimensions of the bracket and recess/pocket formed thereat may be selected or configured for particular vehicle windshield applications, while the camera module or unit may comprise a common unit that is attached at the selected particular bracket for the selected particular vehicle/windshield application.",
"The light shield is formed so that, when the camera module is attached at the bracket and/or light shield, the light shield is not in the field of view of the imager (in other words, the cone of vision of the imager does not encompass the light shield).",
"The texture of the light shield may be any suitable material, such as a Rio grain texture combined with Micromatte (such as known in the texturing arts).",
"The selected material preferably comprises a low gloss material (such as a material having a gloss level of 10max), and is preferably a dark or black color, such as Ebony 848 or the like.",
"The selected material may comprise any suitable material, and may comprise a glass filled Nylon material or the like, such as, for example, ULTRAMID® B3WG6 glass fiber reinforced plastic available from BASF Aktiengesellschaft of Germany, or such as, for example, Bayblend T85 XF plastic available from Bayer MaterialScience AG of Germany.",
"Optionally, the surface of the ribs or light traps may be stippled or otherwise configured or textured so as to enhance the light trapping capability thereof.",
"Although preferably light absorbing, the ribs or light traps of the present invention may comprise a non-light-absorbing material/surface or may comprise a partially light reflective material/surface or the like.",
"Optionally, the surfaces of the light traps may comprise fiber/flocked surfaces or the like.",
"Although the mounting bracket is preferably formed via injection molding of a polymeric material and although the light shield is preferably integrally formed therewith in the same injection molding operation, other forms of fabrication are contemplated.",
"For example, the bracket and the light shield integrally formed therewith may be fabricated by metal forming, such as by stamping or casting or die casting or the like.",
"Preferably, for purposes of light-weightness, the bracket and light shield integrally formed therewith may be formed of magnesium metal, preferably fabricated using thixomolding.",
"Other forms of semi-solid metal casting techniques can be used, including rheocasting, thixocasting and SIMA, such as are known in the metal fabrication arts.",
"Optionally, non-ferrous metals, such as aluminum or aluminum alloys, magnesium or magnesium alloys or copper or copper alloys or the like, may be used in fabrication of the bracket and light shield.",
"Optionally, a separate stray light shield may be provided as a separate component that attaches at the camera module before the camera module is attached at a bracket attached at a vehicle windshield.",
"In such a configuration, a selected light shield and bracket may be selected for a particular vehicle application, whereby the selected light shield and bracket are used with a common or universal camera module to adapt the camera module for the particular or selected vehicle and windshield application.",
"For example, and with reference to FIGS.",
"31-45, a light shield element 462 is configured to attach at a camera module or camera holder or housing 412 to provide the desired or selected or appropriate light shield feature or configuration at the imager and lens assembly 428 for the particular vehicle windshield application of the camera module.",
"In the illustrated embodiment, the light shield element 462 comprises a tapered generally wedge-shaped pocket or recess 462a having a lower or base portion 462b and tapering sidewalls 462c.",
"A partial aperture or notch 462e is established at the narrower end region of the pocket or recess 462a to at least partially receive a lens portion 428a of the camera 428 when the light shield 462 is attached at the camera module 412.In the illustrated embodiment, the light shield 462 also includes a plurality of baffles or ribs at the lower portion 462b to limit glare or reflection of light emanating from outside of the vehicle and passing through the windshield from being received at the camera or imager assembly.",
"As shown in FIGS.",
"31-36, the light shield element 462 is configured to be partially received at a generally planar light shield attaching portion 412d of the camera module.",
"In the illustrated embodiment, the camera module 412 includes a partial wall or rib 412e that receives a base or footprint 462f of the light shield and also includes a pair of protrusions 412f that are received in respective slots 462g of the light shield to locate the light shield 462 at the camera module so that the light shield is generally aligned with the imager and lens assembly 428.As shown in FIG.",
"32, the light shield 462 may include an adhesive layer or pad 462h (such as a pressure sensitive adhesive layer, such as a VHB adhesive or the like, such as, for example, an Acrylic Plus Tape Series EX4000 adhesive commercially available from 3M of St. Paul, Minn.) that adheres the base of the light shield at the attaching portion 412d of the camera module.",
"Thus, and as shown in FIGS.",
"33-36, the light shield 462 may be attached at the camera module 412 by angling the light shield as shown in FIG.",
"33 and moving or sliding the light shield towards the imager until the base or footprint 462f of the light shield 462 is stopped by the partial wall 412e of the camera module.",
"When the light shield contacts the partial wall or rib 412e, the light shield is then pivoted or pressed or moved downward to engage the base or footprint of the light shield with the attaching portion of the camera module, whereby the light shield is adhered to the attaching portion of the camera module.",
"When the light shield is pivoted downward, the protrusions 412f are received in the respective slots 462g to guide and locate the light shield at the appropriate or desired location at the camera module.",
"The light shield 462 may also include a forward tab or lip 462i that engages or contacts the forward end of the camera module when the light shield is adhered at the camera module.",
"After the light shield 462 is attached or adhered at the camera module 412, the camera module and light shield construction or assembly may be attached at a bracket 460 (such as a bracket already attached at a windshield of a vehicle or at a bracket that is configured for attachment at a windshield of a vehicle), such as shown in FIGS.",
"37-43.The bracket and light shield may be selected for a particular vehicle windshield application to adapt or configure the camera module for that particular vehicle windshield application.",
"The bracket may be configured to attach at a vehicle windshield via any suitable manner, such as via a plurality of fixing elements or buttons that are adhered at the vehicle windshield and that are received through respective slots or apertures (not shown in FIGS.",
"37-43) of the bracket, such as in a similar manner as described above, or the bracket may be adhered directly at the vehicle windshield or may otherwise attach to one or more fixing elements or buttons adhered at the vehicle windshield.",
"In the illustrated embodiment, the bracket 460 (such as a metallic bracket formed by stamping or the like) comprises a generally planar portion 460a and a pair of spaced apart forward tabs 460b and a pair of spaced apart rearward side tabs 460c.",
"The forward tabs 460b are configured to receive respective posts or protrusions 412g at opposite sides of the camera module as the camera module is moved towards the bracket 460 (such as can be seen with reference to FIGS.",
"37-40).",
"When the posts 412g are received in the tabs or hooks 460b of the bracket 460 (FIG.",
"40), the camera module 412 is pivoted upward until the rearward side tabs 460c engage respective tabs 412h at the upper rear region of the camera module 412.The rearward side tabs 460c flex to receive and retain the tabs 412h to secure or retain or mount or attach the camera module 412 at the bracket 460.In the illustrated embodiment, and as best shown in FIGS.",
"38-40 and 43, the bracket 460 also includes one or more rear tabs 460d at the rear of the bracket for engaging or receiving respective rear tabs or elements 412i at the rear of the camera module 412.The bracket 460 is formed so that the generally planar portion 460a has a generally wedge-shaped or tapered aperture of notch 460e formed therethrough that generally corresponds to the shape of the light shield (and may be sized to be slightly larger than the tapered pocket of the light shield).",
"Thus, when the camera module and light shield assembly is attached at the bracket, the bracket does not interfere with the forward field of view of the imager (such as can be seen with reference to FIGS.",
"41 and 42).",
"The bracket is formed such that it at least partially circumscribes the light shield, with the roof or upper boundary of the light shield (when disposed at the windshield-attached bracket) comprising the windshield.",
"Optionally, a sealing element may be disposed at and along the upper edge region of the light shield for sealing against the in-cabin surface of the windshield or against a portion of the bracket (where the bracket may overlap the side walls of the light shield, and where the bracket may include a sealing element to seal against the in-cabin surface of the windshield).",
"Thus, when the light shield and camera module are disposed at the windshield-attached bracket, the roof of the pocket (the upper boundary of the pocket of the stray light shield) is formed by the windshield and optionally a portion of the bracket and windshield.",
"For example, the stray light shield, when disposed at the windshield-attached bracket, is aligned with an aperture or opening of the bracket, and a perimeter portion of the bracket that circumscribes or partially circumscribes the bracket aperture or opening may overlap the side walls and may extend over the stray light shield such that a small portion of the “roof” of the stray light shield comprises the circumscribing portion of the bracket (and optionally the circumscribing portion of the bracket may have light traps or ribs or columns thereat).",
"The field of view of the camera, when the camera module and stray light shield are disposed at the windshield-attached bracket, preferably views through the aperture of the bracket (and may also view through an aperture of an opaque layer or frit layer at the windshield) and preferably does not encompass the circumscribing portion of the bracket (or any portion of the opaque layer at the windshield that circumscribes the aperture at the opaque layer).",
"Thus, the present invention provides a light shield that is separate and distinct from the camera module.",
"The light shield may be incorporated into or formed with or molded as part of the bracket (such as a plastic bracket formed by injection molding or the like, preferably of a dark or opaque or black plastic material or the like), or the light shield may comprise a separate and distinct component or element (such as a plastic light shield element formed by injection molding or the like of a dark or opaque or black plastic material or the like) that is separate from the camera module and separate from the bracket.",
"In such an embodiment, the bracket may comprise a metallic bracket that may be stamped or formed to provide the desired hooks or tabs for mounting the camera module thereat (and optionally with some of the tabs riveted or otherwise attached at the metallic bracket).",
"In the illustrated embodiment, the light shield element 462 provides a plurality of ribs or baffles 462j (FIG.",
"45) that are formed across the base portion 462b and at least partially up the side walls 462c of the light shield.",
"The ribs or baffles 462j are spaced apart along the base portion 462b and function to scatter and trap light emanating from exterior of the vehicle that passes through the windshield and that may, absent the presence of the baffles or ribs, reflect off of the base portion 462b and into the lens 428a of the imager (see, for example, the schematic of FIG.",
"46).",
"The baffles or ribs protrude upward from the base portion at least about 0.5 mm and preferably at least about 1 mm, and are at least about 0.5 mm wide and preferably at least about 1 mm wide.",
"The spacing of the baffles is selected to be at least about 0.5 mm and preferably at least about 1 mm between a rear surface of one baffle and a forward surface of an adjacent baffle.",
"In the illustrated embodiment of FIG.",
"45, the baffles comprise rounded ribs that protrude upwards about 1.2 mm and are about 1.2 mm wide and are spaced apart by about 1.3 mm (having about a 2.5 mm pitch).",
"The baffles are preferably angled relative to the generally planar base portion and may be angled at least about 90 degrees and optionally, for example, about 93.5 degrees as shown in FIG.",
"45.As shown in FIG.",
"45, the light shield has the baffles or ribs 462j extending at least partially up the side walls 462c, which are tapered or angled or formed to generally correspond with the windshield angle for the particular application of the camera module and light shield assembly.",
"Optionally, and desirably, the ratio of the distance between the ribs to the height of the ribs is preferably greater than about 1, such as a ratio of about 1 to about 1.5.Optionally, and desirably, the spacing distance between the ribs is at least about 0.5 mm and less than about 3 mm.",
"Optionally, and desirably, and such as shown in the schematic of FIG.",
"47, the baffles or ribs of a light trapping or scattering element may be formed with a generally vertical forward surface (which is generally normal to the generally planar base portion) and an angled rearward surface (which is angled towards the forward surface so as to form a generally pointed baffle or rib).",
"For example, the forward surface of the baffles may be at an angle of about 90 degrees relative to the base portion and the rearward surface of the baffles are at an angle relative towards the forward surface, such as at an angle of less than about 15 degrees relative to the forward surface, preferably less than about 10 degrees relative to the forward surface and preferably less than about 5 degrees relative to the forward surface, and greater than about 2 degrees relative to the forward surface.",
"Such a configuration of spaced apart baffles or ribs provides enhanced trapping of light that passes through the vehicle windshield and towards the light trap and baffles or ribs.",
"However, clearly, other configurations of baffles or ribs or light trapping means (such as vertical posts or pillars or the like or such as a surface having a plurality of compartments or walls or the like or such as a textured surface or light absorbing black flocked material or the like) may be implemented at a camera module or windshield electronics module or the like, while remaining within the spirit and scope of the present invention.",
"The present invention thus provides an engineered structured light trap that is incorporated as part of the light shield during the fabrication of the light shield, such as during an injection molding process.",
"Optionally, the light scattering or trapping element may be molded of a plastic material or may be cast or machined of a metallic material or the like.",
"The camera or imager or imaging sensor may comprise any suitable camera or imager or sensor.",
"Optionally, the camera may comprise a “smart camera” that includes the imaging sensor array and associated circuitry and image processing circuitry and electrical connectors and the like as part of a camera module, such as by utilizing aspects of the vision systems described in PCT Application No.",
"PCT/US2012/066571, filed Nov. 27, 2012, and published Jun.",
"6, 2013 as International Publication No.",
"WO 2013/081985, and/or PCT Application No.",
"PCT/US2012/066570, filed Nov. 27, 2012, and published Jun.",
"6, 2013 as International Publication No.",
"WO 2013/081984, which are hereby incorporated herein by reference in their entireties.",
"The vehicle may include any type of sensor or sensors, such as imaging sensors or radar sensors or lidar sensors or ladar sensors or ultrasonic sensors or the like.",
"The imaging sensor or camera may capture image data for image processing and may comprise any suitable camera or sensing device, such as, for example, an array of a plurality of photosensor elements arranged in at least about 640 columns and 480 rows (at least about a 640×480 imaging array), with a respective lens focusing images onto respective portions of the array.",
"Alternatively, a megapixel imager may be utilized that comprises a photosensor array with at least one million photosensor elements, preferably arranged in rows and columns, and the image processor associated therewith and processing image data captured thereby is preferably an EyeQ3™ image processing chip available from Mobileye Vision Technologies Ltd. of Jerusalem, Israel.",
"The photosensor array may comprise a plurality of photosensor elements arranged in a photosensor array having rows and columns.",
"The logic and control circuit of the imaging sensor may function in any known manner, and the image processing and algorithmic processing may comprise any suitable means for processing the images and/or image data.",
"For example, the vision system and/or processing and/or camera and/or circuitry may utilize aspects described in U.S. Pat.",
"Nos.",
"7,005,974; 5,760,962; 5,877,897; 5,796,094; 5,949,331; 6,222,447; 6,302,545; 6,396,397; 6,498,620; 6,523,964; 6,611,202; 6,201,642; 6,690,268; 6,717,610; 6,757,109; 6,802,617; 6,806,452; 6,822,563; 6,891,563; 6,946,978; 7,859,565; 5,550,677; 5,670,935; 6,636,258; 7,145,519; 7,161,616; 7,230,640; 7,248,283; 7,295,229; 7,301,466; 7,592,928; 7,881,496; 7,720,580; 7,038,577; 6,882,287; 5,929,786 and/or 5,786,772, PCT Application No.",
"PCT/US2010/047256, filed Aug. 31, 2010 and published Mar.",
"10, 2011 as International Publication No.",
"WO 2011/028686 and/or International Publication No.",
"WO 2010/099416, published Sep. 2, 2010, and/or PCT Application No.",
"PCT/US10/25545, filed Feb. 26, 2010 and published Sep. 2, 2010 as International Publication No.",
"WO 2010/099416, and/or PCT Application No.",
"PCT/US2012/048800, filed Jul.",
"30, 2012, and published Feb. 7, 2013 as International Publication No.",
"WO 2013/019707, and/or PCT Application No.",
"PCT/US2012/048110, filed Jul.",
"25, 2012, and published Jan. 31, 2013 as International Publication No.",
"WO 2013/016409, and/or PCT Application No.",
"PCT/CA2012/000378, filed Apr.",
"25, 2012, and published Nov. 1, 2012 as International Publication No.",
"WO 20112/145822, and/or PCT Application No.",
"PCT/US2012/056014, filed Sep. 19, 2012, and published Mar.",
"28, 2013 as International Publication No.",
"WO 2013/043661, and/or PCT Application No.",
"PCT/US12/57007, filed Sep. 25, 2012, and published Apr.",
"4, 2013 as International Publication No.",
"WO 2013/048994, and/or PCT Application No.",
"PCT/US2012/061548, filed Oct. 24, 2012, and published May 2, 2013 as International Publication No.",
"WO 2013/063014, and/or PCT Application No.",
"PCT/US2012/062906, filed Nov. 1, 2012, and published May 10, 2013 as International Publication No.",
"WO 2013/067083, and/or PCT Application No.",
"PCT/US2012/063520, filed Nov. 5, 2012, and published May 16, 2013 as International Publication No.",
"WO 2013/070539, and/or PCT Application No.",
"PCT/US2012/064980, filed Nov. 14, 2012, and published May 23, 2013 as International Publication No.",
"WO 2013/074604, and/or PCT Application No.",
"PCT/US2012/066570, filed Nov. 27, 2012, and published Jun.",
"6, 2013 as International Publication No.",
"WO 2013/081984, and/or PCT Application No.",
"PCT/US2012/066571, filed Nov. 27, 2012, and published Jun.",
"6, 2013 as International Publication No.",
"WO 2013/081985, and/or PCT Application No.",
"PCT/US2012/068331, filed Dec. 7, 2012, and published Jun.",
"13, 2013 as International Publication No.",
"WO 2013/086249, and/or PCT Application No.",
"PCT/US2012/071219, filed Dec. 21, 2012, and published on Jul.",
"11, 2013 as International Publication No.",
"WO 2013/103548, and/or PCT Application No.",
"PCT/US2013/022119, filed Jan. 18, 2013, and published Jul.",
"25, 2013 as International Publication No.",
"WO 2013/109869, and/or U.S. patent applications, Ser.",
"No.",
"13/681,963, filed Nov. 20, 2012, now U.S. Pat.",
"No.",
"9,264,673; U.S. Ser.",
"No.",
"13/660,306, filed Oct. 25, 2012, now U.S. Pat.",
"No.",
"9,146,898; U.S. Ser.",
"No.",
"13/653,577, filed Oct. 17, 2012, now U.S. Pat.",
"No.",
"9,174,574; and/or U.S. Ser.",
"No.",
"13/534,657, filed Jun.",
"27, 2012, and published Jan. 3, 2013 as U.S.",
"Publication No.",
"US-2013-002873, and/or U.S. provisional applications, Ser.",
"No.",
"61/736,104, filed Dec. 12, 2012; Ser.",
"No.",
"61/736,103, filed Dec. 12, 2012; Ser.",
"No.",
"61/735,314, filed Dec. 10, 2012; Ser.",
"No.",
"61/734,457, filed Dec. 7, 2012; Ser.",
"No.",
"61/733,598, filed Dec. 5, 2012; Ser.",
"No.",
"61/733,093, filed Dec. 4, 2012; Ser.",
"No.",
"61/727,912, filed Nov. 19, 2012; Ser.",
"No.",
"61/727,911, filed Nov. 19, 2012; Ser.",
"No.",
"61/727,910, filed Nov. 19, 2012; Ser.",
"No.",
"61/718,382, filed Oct. 25, 2012; Ser.",
"No.",
"61/710,924, filed Oct. 8, 2012; Ser.",
"No.",
"61/696,416, filed Sep. 4, 2012; Ser.",
"No.",
"61/682,995, filed Aug. 14, 2012; Ser.",
"No.",
"61/682,486, filed Aug. 13, 2012; Ser.",
"No.",
"61/680,883, filed Aug. 8, 2012; Ser.",
"No.",
"61/676,405, filed Jul.",
"27, 2012; Ser.",
"No.",
"61/666,146, filed Jun.",
"29, 2012; Ser.",
"No.",
"61/648,744, filed May 18, 2012; Ser.",
"No.",
"61/624,507, filed Apr.",
"16, 2012; Ser.",
"No.",
"61/616,126, filed Mar.",
"27, 2012; Ser.",
"No.",
"61/615,410, filed Mar.",
"26, 2012; Ser.",
"No.",
"61/613,651, filed Mar.",
"21, 2012; Ser.",
"No.",
"61/607,229, filed Mar.",
"6, 2012; Ser.",
"No.",
"61/602,876, filed Feb. 24, 2012, which are all hereby incorporated herein by reference in their entireties.",
"The system may communicate with other communication systems via any suitable means, such as by utilizing aspects of the systems described in PCT Application No.",
"PCT/US10/038477, filed Jun.",
"14, 2010, and/or U.S. patent application Ser.",
"No.",
"13/202,005, filed Aug. 17, 2011, now U.S. Pat.",
"No.",
"9,126,525, which are hereby incorporated herein by reference in their entireties.",
"The imaging device and control and image processor and any associated illumination source, if applicable, may comprise any suitable components, and may utilize aspects of the cameras and vision systems described in U.S. Pat.",
"Nos.",
"5,550,677; 5,877,897; 6,498,620; 5,670,935; 5,796,094; 6,396,397; 6,806,452; 6,690,268; 7,005,974; 7,123,168; 7,004,606; 6,946,978; 7,038,577; 6,353,392; 6,320,176; 6,313,454 and 6,824,281, and/or International Publication No.",
"WO 2010/099416, published Sep. 2, 2010, and/or PCT Application No.",
"PCT/US10/47256, filed Aug. 31, 2010 and published Mar.",
"10, 2011 as International Publication No.",
"WO 2011/028686, and/or U.S. patent application Ser.",
"No.",
"12/508,840, filed Jul.",
"24, 2009, and published Jan. 28, 2010 as U.S. Pat.",
"Publication No.",
"US 2010-0020170, and/or PCT Application No.",
"PCT/US2012/048110, filed Jul.",
"25, 2012, and published Jan. 31, 2013 as International Publication No.",
"WO 2013/016409, and/or U.S. patent application Ser.",
"No.",
"13/534,657, filed Jun.",
"27, 2012, and published Jan. 3, 2013 as U.S.",
"Publication No.",
"US-2013-0002873, which are all hereby incorporated herein by reference in their entireties.",
"The camera or cameras may comprise any suitable cameras or imaging sensors or camera modules, and may utilize aspects of the cameras or sensors described in U.S. patent applications, Ser.",
"No.",
"12/091,359, filed Apr.",
"24, 2008 and published Oct. 1, 2009 as U.S.",
"Publication No.",
"US-2009-0244361, and/or U.S. Ser.",
"No.",
"13/260,400, filed Sep. 26, 2011, now U.S. Pat.",
"No.",
"8,542,451, and/or U.S. Pat.",
"Nos.",
"7,965,336 and/or 7,480,149, which are hereby incorporated herein by reference in their entireties.",
"The imaging array sensor may comprise any suitable sensor, and may utilize various imaging sensors or imaging array sensors or cameras or the like, such as a CMOS imaging array sensor, a CCD sensor or other sensors or the like, such as the types described in U.S. Pat.",
"Nos.",
"5,550,677; 5,670,935; 5,760,962; 5,715,093; 5,877,897; 6,922,292; 6,757,109; 6,717,610; 6,590,719; 6,201,642; 6,498,620; 5,796,094; 6,097,023; 6,320,176; 6,559,435; 6,831,261; 6,806,452; 6,396,397; 6,822,563; 6,946,978; 7,339,149; 7,038,577; 7,004,606 and/or 7,720,580, and/or U.S. patent application Ser.",
"No.",
"10/534,632, filed May 11, 2005, now U.S. Pat.",
"No.",
"7,965,336; and/or PCT Application No.",
"PCT/US2008/076022, filed Sep. 11, 2008 and published Mar.",
"19, 2009 as International Publication No.",
"WO/2009/036176, and/or PCT Application No.",
"PCT/US2008/078700, filed Oct. 3, 2008 and published Apr.",
"9, 2009 as International Publication No.",
"WO/ 2009/046268, which are all hereby incorporated herein by reference in their entireties.",
"The camera module and circuit chip or board and imaging sensor may be implemented and operated in connection with various vehicular vision-based systems, and/or may be operable utilizing the principles of such other vehicular systems, such as a vehicle headlamp control system, such as the type disclosed in U.S. Pat.",
"Nos.",
"5,796,094; 6,097,023; 6,320,176; 6,559,435; 6,831,261; 7,004,606; 7,339,149 and/or 7,526,103, which are all hereby incorporated herein by reference in their entireties, a rain sensor, such as the types disclosed in commonly assigned U.S. Pat.",
"Nos.",
"6,353,392; 6,313,454; 6,320,176 and/or 7,480,149, which are hereby incorporated herein by reference in their entireties, a vehicle vision system, such as a forwardly, sidewardly or rearwardly directed vehicle vision system utilizing principles disclosed in U.S. Pat.",
"Nos.",
"5,550,677; 5,670,935; 5,760,962; 5,877,897; 5,949,331; 6,222,447; 6,302,545; 6,396,397; 6,498,620; 6,523,964; 6,611,202; 6,201,642; 6,690,268; 6,717,610; 6,757,109; 6,802,617; 6,806,452; 6,822,563; 6,891,563; 6,946,978 and/or 7,859,565, which are all hereby incorporated herein by reference in their entireties, a trailer hitching aid or tow check system, such as the type disclosed in U.S. Pat.",
"No.",
"7,005,974, which is hereby incorporated herein by reference in its entirety, a reverse or sideward imaging system, such as for a lane change assistance system or lane departure warning system or for a blind spot or object detection system, such as imaging or detection systems of the types disclosed in U.S. Pat.",
"Nos.",
"7,720,580; 7,038,577; 5,929,786 and/or 5,786,772, and/or U.S. pat.",
"applications, Ser.",
"No.",
"11/239,980, filed Sep. 30, 2005, now U.S. Pat.",
"No.",
"7,881,496, and/or U.S. provisional applications, Ser.",
"No.",
"60/628,709, filed Nov. 17, 2004; Ser.",
"No.",
"60/614,644, filed Sep. 30, 2004; Ser.",
"No.",
"60/618,686, filed Oct. 14, 2004; Ser.",
"No.",
"60/638,687, filed Dec. 23, 2004, which are hereby incorporated herein by reference in their entireties, a video device for internal cabin surveillance and/or video telephone function, such as disclosed in U.S. Pat.",
"Nos.",
"5,760,962; 5,877,897; 6,690,268 and/or 7,370,983, and/or U.S. patent application Ser.",
"No.",
"10/538,724, filed Jun.",
"13, 2005 and published Mar.",
"9, 2006 as U.S.",
"Publication No.",
"US-2006-0050018, which are hereby incorporated herein by reference in their entireties, a traffic sign recognition system, a system for determining a distance to a leading or trailing vehicle or object, such as a system utilizing the principles disclosed in U.S. Pat.",
"Nos.",
"6,396,397 and/or 7,123,168, which are hereby incorporated herein by reference in their entireties, and/or the like.",
"Optionally, the circuit board or chip may include circuitry for the imaging array sensor and or other electronic accessories or features, such as by utilizing compass-on-a-chip or EC driver-on-a-chip technology and aspects such as described in U.S. Pat.",
"No.",
"7,255,451 and/or U.S. Pat.",
"No.",
"7,480,149; and/or U.S. patent applications, U.S. Ser.",
"No.",
"11/226,628, filed Sep. 14, 2005 and published Mar.",
"23, 2006 as U.S.",
"Publication No.",
"US-2006-0061008, and/or U.S. Ser.",
"No.",
"12/578,732, filed Oct. 14, 2009, now U.S. Pat.",
"No.",
"9,487,144, which are hereby incorporated herein by reference in their entireties.",
"Optionally, the vision system may include a display for displaying images captured by one or more of the imaging sensors for viewing by the driver of the vehicle while the driver is normally operating the vehicle.",
"Optionally, for example, the vision system may include a video display device disposed at or in the interior rearview mirror assembly of the vehicle, such as by utilizing aspects of the video mirror display systems described in U.S. Pat.",
"No.",
"6,690,268 and/or U.S. patent application Ser.",
"No.",
"13/333,337, filed Dec. 21, 2011, now U.S. Pat.",
"No.",
"9,264,672, which are hereby incorporated herein by reference in their entireties.",
"The video mirror display may comprise any suitable devices and systems and optionally may utilize aspects of the compass display systems described in U.S. Pat.",
"Nos.",
"7,370,983; 7,329,013; 7,308,341; 7,289,037; 7,249,860; 7,004,593; 4,546,551; 5,699,044; 4,953,305; 5,576,687; 5,632,092; 5,677,851; 5,708,410; 5,737,226; 5,802,727; 5,878,370; 6,087,953; 6,173,508; 6,222,460; 6,513,252 and/or 6,642,851, and/or European patent application, published Oct. 11, 2000 under Publication No.",
"EP 0 1043566, and/or U.S. patent application Ser.",
"No.",
"11/226,628, filed Sep. 14, 2005 and published Mar.",
"23, 2006 as U.S.",
"Publication No.",
"US-2006-0061008, which are all hereby incorporated herein by reference in their entireties.",
"Optionally, the video mirror display screen or device may be operable to display images captured by a rearward viewing camera of the vehicle during a reversing maneuver of the vehicle (such as responsive to the vehicle gear actuator being placed in a reverse gear position or the like) to assist the driver in backing up the vehicle, and optionally may be operable to display the compass heading or directional heading character or icon when the vehicle is not undertaking a reversing maneuver, such as when the vehicle is being driven in a forward direction along a road (such as by utilizing aspects of the display system described in PCT Application No.",
"PCT/US2011/056295, filed Oct. 14, 2011 and published Apr.",
"19, 2012 as International Publication No.",
"WO 2012/051500, which is hereby incorporated herein by reference in its entirety).",
"Optionally, the vision system (utilizing the forward facing camera and a rearward facing camera and other cameras disposed at the vehicle with exterior fields of view) may be part of or may provide a display of a top-down view or birds-eye view system of the vehicle or a surround view at the vehicle, such as by utilizing aspects of the vision systems described in PCT Application No.",
"PCT/US10/25545, filed Feb. 26, 2010 and published on Sep. 2, 2010 as International Publication No.",
"WO 2010/099416, and/or PCT Application No.",
"PCT/US10/47256, filed Aug. 31, 2010 and published Mar.",
"10, 2011 as International Publication No.",
"WO 2011/028686, and/or PCT Application No.",
"PCT/US2011/062834, filed Dec. 1, 2011 and published Jun.",
"7, 2012 as International Publication No.",
"WO 2012/075250, and/or PCT Application No.",
"PCT/US2012/048993, filed Jul.",
"31, 2012 and published Feb. 7, 2013 as International Publication No.",
"WO 2013/019795, and/or PCT Application No.",
"PCT/US11/62755, filed Dec. 1, 2011 and published Jun.",
"7, 2012 as International Publication No.",
"WO 2012-075250, and/or PCT Application No.",
"PCT/CA2012/000378, filed Apr.",
"25, 2012, and published Nov. 1, 2012 as International Publication No.",
"WO 2012/145822, and/or PCT Application No.",
"PCT/US2012/066571, filed Nov. 27, 2012, and published Jun.",
"6, 2013 as International Publication No.",
"WO 2013/081985, and/or U.S. patent application Ser.",
"No.",
"13/333,337, filed Dec. 21, 2011, now U.S. Pat.",
"No.",
"9,264,672, and/or U.S. provisional applications, Ser.",
"No.",
"61/615,410, filed Mar.",
"26, 2012, which are hereby incorporated herein by reference in their entireties.",
"Optionally, a video mirror display may be disposed rearward of and behind the reflective element assembly and may comprise a display such as the types disclosed in U.S. Pat.",
"Nos.",
"5,530,240; 6,329,925; 7,855,755; 7,626,749; 7,581,859; 7,446,650; 7,370,983; 7,338,177; 7,274,501; 7,255,451; 7,195,381; 7,184,190; 5,668,663; 5,724,187 and/or 6,690,268, and/or in U.S. patent applications, Ser.",
"No.",
"12/091,525, filed Apr.",
"25, 2008, now U.S. Pat.",
"No.",
"7,855,755; U.S. Ser.",
"No.",
"11/226,628, filed Sep. 14, 2005 and published Mar.",
"23, 2006 as U.S.",
"Publication No.",
"US-2006-0061008; and/or U.S. Ser.",
"No.",
"10/538,724, filed Jun.",
"13, 2005 and published Mar.",
"9, 2006 as U.S.",
"Publication No.",
"US-2006-0050018, which are all hereby incorporated herein by reference in their entireties.",
"The display is viewable through the reflective element when the display is activated to display information.",
"The display element may be any type of display element, such as a vacuum fluorescent (VF) display element, a light emitting diode (LED) display element, such as an organic light emitting diode (OLED) or an inorganic light emitting diode, an electroluminescent (EL) display element, a liquid crystal display (LCD) element, a video screen display element or backlit thin film transistor (TFT) display element or the like, and may be operable to display various information (as discrete characters, icons or the like, or in a multi-pixel manner) to the driver of the vehicle, such as passenger side inflatable restraint (PSIR) information, tire pressure status, and/or the like.",
"The mirror assembly and/or display may utilize aspects described in U.S. Pat.",
"Nos.",
"7,184,190; 7,255,451; 7,446,924 and/or 7,338,177, which are all hereby incorporated herein by reference in their entireties.",
"The thicknesses and materials of the coatings on the substrates of the reflective element may be selected to provide a desired color or tint to the mirror reflective element, such as a blue colored reflector, such as is known in the art and such as described in U.S. Pat.",
"Nos.",
"5,910,854; 6,420,036 and/or 7,274,501, which are hereby incorporated herein by reference in their entireties.",
"Optionally, the display or displays and any associated user inputs may be associated with various accessories or systems, such as, for example, a tire pressure monitoring system or a passenger air bag status or a garage door opening system or a telematics system or any other accessory or system of the mirror assembly or of the vehicle or of an accessory module or console of the vehicle, such as an accessory module or console of the types described in U.S. Pat.",
"Nos.",
"7,289,037; 6,877,888; 6,824,281; 6,690,268; 6,672,744; 6,386,742 and 6,124,886, and/or U.S. patent application Ser.",
"No.",
"10/538,724, filed Jun.",
"13, 2005 and published Mar.",
"9, 2006 as U.S.",
"Publication No.",
"US-2006-0050018, which are hereby incorporated herein by reference in their entireties.",
"Changes and modifications to the specifically described embodiments may be carried out without departing from the principles of the present invention, which is intended to be limited only by the scope of the appended claims as interpreted according to the principles of patent law."
]
] |
Patent_15871173
|
[
[
"METHOD OF MANUFACTURING VEHICULAR CAMERA WITH FLEXIBLE CONNECTORS",
"A method of assembling a camera for mounting at a vehicle for a vehicle vision system includes providing front and rear housings and providing a set of first electrical connectors at a circuit board of the front housing and providing a set of second electrical connectors at the rear housing.",
"One of the first and second electrical connectors includes male connectors and the other of the first and second electrical connectors includes female connectors.",
"The rear housing is mated with the front housing to encase an imaging element and the circuit board.",
"When mating the rear housing with the front housing, the male connectors are inserted into respective female connectors to electrically conductively connect the first and second electrical connectors.",
"When inserting the male connectors into the respective female connectors, the female connectors flex to accommodate misalignment of the male and female connectors."
],
[
"1.A method of assembling a camera for mounting at a vehicle for a vehicle vision system, said method comprising: providing a front housing having a lens, an imaging element and a circuit board; providing a rear housing; providing a set of first electrical connectors at the circuit board; providing a set of second electrical connectors at the rear housing, wherein the set of second electrical connectors is configured to electrically connect to an electrical connector of a vehicle wire harness when the assembled camera is mounted at the vehicle; wherein one of the sets of first and second electrical connectors comprises a set of male connectors and the other of the sets of first and second electrical connectors comprises a set of female connectors; providing a connector housing at the female connectors, wherein the connector housing includes a plurality of chambers, and wherein each chamber holds a respective one of the female connectors, and wherein each chamber is defined by a chamber wall that separates the respective chamber from the other chambers; mating the rear housing with the front housing to encase the imaging element and the circuit board; when mating the rear housing with the front housing, inserting the male connectors into respective female connectors and clamping the male connectors therein via jaw structure of the respective female connectors to electrically conductively connect the first and second electrical connectors; when inserting the male connectors into the respective female connectors, the female connectors flex to accommodate misalignment of the male and female connectors; and wherein inserting the male connectors into the respective female connectors comprises inserting the male connectors until a stop element at at least one respective female connector limits movement of the male connector or the female connector.",
"2.The method of claim 1, wherein mating the rear housing with the front housing comprises moving one of the rear housing and the front housing in a first direction along a first axis.",
"3.The method of claim 2, wherein, when inserting the male connectors into the respective female connectors, the female connectors flex in a second direction transverse to the first axis to accommodate misalignment of the male and female connectors.",
"4.The method of claim 2, wherein the male and female connectors are configured to accommodate misalignment along two axes that are orthogonal to the each other and to the first axis.",
"5.The method of claim 2, comprising, when mating of the front and rear housings, moving the male connectors in the first direction to enter the female connectors, wherein the stop elements are positioned to limit movement of the female connectors in the first direction during entry of the male connectors into the female connectors.",
"6.The method of claim 1, wherein the stop elements are part of the connector housing.",
"7.The method of claim 1, comprising providing retraction stop elements that limit movement of the female connectors when the male connectors are retracted from the female connectors.",
"8.The method of claim 7, wherein the retraction stop elements are part of the connector housing.",
"9.The method of claim 1, wherein providing the connector housing at the female connectors comprises forming a female connector assembly that is provided as a unit at the circuit board or at the rear housing.",
"10.The method of claim 9, wherein the connector housing comprises base structure that snugly engages a base portion of each of the female connectors to retain the female connectors at the connector housing.",
"11.The method of claim 1, wherein the jaw structure of each female connector has a width that is sized so that a male connector is insertable therein over a range of positions.",
"12.The method of claim 1, wherein the female connectors have biasing structure that bias the jaw structure towards a home position.",
"13.The method of claim 1, comprising, when mating the rear housing with the front housing, mating rear housing alignment structure of the rear housing with front housing alignment structure of the front housing to align the rear housing with respect to the front housing.",
"14.The method of claim 1, wherein the first electrical connectors comprise the female connectors and the second electrical connectors comprise the male connectors.",
"15.The method of claim 1, wherein the first electrical connectors comprise the male connectors and the second electrical connectors comprise the female connectors.",
"16.The method of claim 1, wherein the female connectors include a flexible base portion, and wherein the connector housing comprises a flex-limiting structure that limits flexing of the flexible base portion when the male connectors are inserted into the female connectors.",
"17.A method of assembling a camera for mounting at a vehicle for a vehicle vision system, said method comprising: providing a front housing having a lens, an imaging element and a circuit board; providing a rear housing; providing a set of first electrical connectors at the circuit board; providing a set of second electrical connectors at the rear housing, wherein the set of second electrical connectors is configured to electrically connect to an electrical connector of a vehicle wire harness when the assembled camera is mounted at the vehicle; wherein the set of first electrical connectors comprises a set of female connectors and the set of second electrical connectors comprises a set of male connectors; providing a connector housing at the female connectors, wherein the connector housing includes a plurality of chambers, and wherein each chamber holds a respective one of the female connectors, and wherein each chamber is defined by a chamber wall that separates the respective chamber from the other chambers; mating the rear housing with the front housing to encase the imaging element and the circuit board; wherein mating the rear housing with the front housing comprises moving one of the rear housing and the front housing in a first direction along a first axis; when mating the rear housing with the front housing, inserting the male connectors into respective female connectors and clamping the male connectors therein via jaw structure of the respective female connectors to electrically conductively connect the first and second electrical connectors; wherein each female connector has a width along a second axis orthogonal to the first axis that is sized so that a male connector is insertable therein over a range of positions; and when inserting the male connectors into the respective female connectors, the female connectors flex in a direction orthogonal to the first and second axes to accommodate misalignment of the male and female connectors.",
"18.The method of claim 17, comprising, when mating of the front and rear housings, moving the male connectors in the first direction to enter the female connectors, wherein stop elements are positioned to limit movement of the female connectors in the first direction during entry of the male connectors into the female connectors.",
"19.A method of assembling a camera for mounting at a vehicle for a vehicle vision system, said method comprising: providing a front housing having a lens, an imaging element and a circuit board; providing a rear housing; providing a set of first electrical connectors at the circuit board; providing a set of second electrical connectors at the rear housing, wherein the set of second electrical connectors is configured to electrically connect to an electrical connector of a vehicle wire harness when the assembled camera is mounted at the vehicle; wherein one of the sets of first and second electrical connectors comprises a set of male connectors and the other of the sets of first and second electrical connectors comprises a set of female connectors; providing a connector housing at the female connectors, wherein the connector housing includes a plurality of chambers, and wherein each chamber holds a respective one of the female connectors, and wherein each chamber is defined by a chamber wall that separates the respective chamber from the other chambers; mating the rear housing with the front housing to encase the imaging element and the circuit board; when mating the rear housing with the front housing, inserting the male connectors into respective female connectors and clamping the male connectors therein via jaw structure of the respective female connectors to electrically conductively connect the first and second electrical connectors; when inserting the male connectors into the respective female connectors, the female connectors flex to accommodate misalignment of the male and female connectors; wherein inserting the male connectors into the respective female connectors comprises inserting the male connectors until a stop element at at least one respective female connector limits flexing of the female connector; wherein the stop elements are part of the connector housing; when mating of the front and rear housings, moving the male connectors in the first direction to enter the female connectors, wherein the stop elements are positioned to limit flexing of the female connectors during entry of the male connectors into the female connectors; providing retraction stop elements that limit movement of the female connectors when the male connectors are retracted from the female connectors; and wherein the retraction stop elements are part of the connector housing.",
"20.The method of claim 19, wherein providing the connector housing at the female connectors comprises forming a female connector assembly that is provided as a unit at the circuit board or at the rear housing, and wherein the connector housing comprises base structure that snugly engages a base portion of each of the female connectors to retain the female connectors at the connector housing."
],
[
"<SOH> BACKGROUND OF THE INVENTION <EOH>A typical camera for mounting on a vehicle has a lens member, an imaging element, a circuit board and housing members that connect together.",
"In particular, for certain applications, such as for some applications wherein the camera is rearwardly facing and is mounted in a rear panel on a vehicle, there can be relatively severe space restrictions for the camera.",
"However, other vehicular camera applications also impose space restrictions on the camera.",
"Additionally, some cameras are relatively complex assemblies that are expensive, and can suffer from reliability problems due to the number of components and the number of individual electrical connections that are associated therewith.",
"In particular, some cameras have a front housing which holds a circuit board and a rear housing which mounts in a tight alignment with the front housing member and which houses electrical connectors (i.e.",
"pins).",
"At the distal end of the rear housing member are the terminals of the pins, which connect via a cable assembly to another component in the vehicle.",
"At the front end of the rear housing member, a jumper is typically used to connect the front ends of the pins to the circuit board.",
"This solution is used because it accommodates variation in the positions of the pins in the rear housing member and in the positions of the points on the circuit board intended to connect to the pins.",
"It would be advantageous to provide a camera that addresses one or more of these considerations."
],
[
"<SOH> SUMMARY OF THE INVENTION <EOH>The present invention provides a camera for mounting at a vehicle that includes aligned front and rear portions of a housing and provides direct electrical connection of electrical connectors or terminals at the front and rear portions of the housing.",
"According to a first aspect of the present invention, a camera for mounting on a vehicle includes a front housing member that holds a lens member, an imaging element and a circuit board with a set of front electrical connectors thereon, and a rear housing member that holds a set of rear electrical connectors that are directly mounted to the front electrical connectors (i.e.",
"without the use of a jumper).",
"The rear housing member is aligned to the front housing member with respect to a first axis.",
"The front and rear electrical connectors are able to accommodate misalignment along two axes which are orthogonal to the each other and to the first axis.",
"By directly mounting the front and rear electrical connectors, a jumper wire is not needed, thereby reducing cost and eliminating potential sources of circuit failures that are associated with the use of jumper wires.",
"By aligning the front and rear housing members, the overall space occupied by the camera is smaller, which is advantageous particularly when the camera is to be used in tight spaces.",
"In one embodiment, the camera includes a front camera housing member, a lens member mounted to the front housing member, an imager that is positioned to receive images through the lens member, a circuit board mounted to the front housing member, and a rear camera housing member.",
"The circuit board comprises circuitry that is configured or operable to receive signals from the imager and to send signals to another component.",
"The circuit board has a plurality of front electrical connectors thereon.",
"The rear camera housing member has a rear housing alignment structure that mates with a front housing alignment structure to align the rear camera housing member with respect to the front camera housing member along a first axis.",
"The rear camera housing member has a plurality of rear electrical connectors extending therefrom.",
"The rear electrical connectors are electrically connected to the front electrical connector.",
"One set of the sets of front and rear electrical connectors is a set of male electrical connectors and the other set of the sets of front and rear electrical connectors is a set of female electrical connectors.",
"Each female electrical connector has a jaw structure including first and second jaws.",
"The first and second jaws together define a second axis along which the first and second jaws clamp one of the male electrical connectors.",
"The second axis is generally perpendicular to the first axis.",
"The first and second jaws have a width that is sized so that the male electrical connector is positionable therebetween over a range of positions along the second axis.",
"The female electrical connector has a jaw structure biasing member that biases the jaw structure towards a home position but permits movement of the jaw structure along a third axis that is generally perpendicular to the first and second axes.",
"These and other objects, advantages, purposes and features of the present invention will become apparent upon review of the following specification in conjunction with the drawings."
],
[
"CROSS REFERENCE TO RELATED APPLICATIONS The present application is a continuation of U.S. patent application Ser.",
"No.",
"14/992,254, filed Jan. 11, 2016, now U.S. Pat.",
"No.",
"9,868,404, which is a continuation of U.S. patent application Ser.",
"No.",
"14/001,272, filed Aug. 23, 2013, now U.S. Pat.",
"No.",
"9,233,641, which is a 371 national phase filing of PCT Application No.",
"PCT/US2012/026073, filed Feb. 22, 2012, which claims the filing benefit of U.S. provisional applications, Ser.",
"No.",
"61/593,962, filed Feb. 2, 2012, and Ser.",
"No.",
"61/446,975, filed Feb. 25, 2011, which are hereby incorporated herein by reference in their entireties.",
"FIELD OF THE INVENTION The present invention relates to cameras for use in vehicles, and more particularly to rearview cameras.",
"BACKGROUND OF THE INVENTION A typical camera for mounting on a vehicle has a lens member, an imaging element, a circuit board and housing members that connect together.",
"In particular, for certain applications, such as for some applications wherein the camera is rearwardly facing and is mounted in a rear panel on a vehicle, there can be relatively severe space restrictions for the camera.",
"However, other vehicular camera applications also impose space restrictions on the camera.",
"Additionally, some cameras are relatively complex assemblies that are expensive, and can suffer from reliability problems due to the number of components and the number of individual electrical connections that are associated therewith.",
"In particular, some cameras have a front housing which holds a circuit board and a rear housing which mounts in a tight alignment with the front housing member and which houses electrical connectors (i.e.",
"pins).",
"At the distal end of the rear housing member are the terminals of the pins, which connect via a cable assembly to another component in the vehicle.",
"At the front end of the rear housing member, a jumper is typically used to connect the front ends of the pins to the circuit board.",
"This solution is used because it accommodates variation in the positions of the pins in the rear housing member and in the positions of the points on the circuit board intended to connect to the pins.",
"It would be advantageous to provide a camera that addresses one or more of these considerations.",
"SUMMARY OF THE INVENTION The present invention provides a camera for mounting at a vehicle that includes aligned front and rear portions of a housing and provides direct electrical connection of electrical connectors or terminals at the front and rear portions of the housing.",
"According to a first aspect of the present invention, a camera for mounting on a vehicle includes a front housing member that holds a lens member, an imaging element and a circuit board with a set of front electrical connectors thereon, and a rear housing member that holds a set of rear electrical connectors that are directly mounted to the front electrical connectors (i.e.",
"without the use of a jumper).",
"The rear housing member is aligned to the front housing member with respect to a first axis.",
"The front and rear electrical connectors are able to accommodate misalignment along two axes which are orthogonal to the each other and to the first axis.",
"By directly mounting the front and rear electrical connectors, a jumper wire is not needed, thereby reducing cost and eliminating potential sources of circuit failures that are associated with the use of jumper wires.",
"By aligning the front and rear housing members, the overall space occupied by the camera is smaller, which is advantageous particularly when the camera is to be used in tight spaces.",
"In one embodiment, the camera includes a front camera housing member, a lens member mounted to the front housing member, an imager that is positioned to receive images through the lens member, a circuit board mounted to the front housing member, and a rear camera housing member.",
"The circuit board comprises circuitry that is configured or operable to receive signals from the imager and to send signals to another component.",
"The circuit board has a plurality of front electrical connectors thereon.",
"The rear camera housing member has a rear housing alignment structure that mates with a front housing alignment structure to align the rear camera housing member with respect to the front camera housing member along a first axis.",
"The rear camera housing member has a plurality of rear electrical connectors extending therefrom.",
"The rear electrical connectors are electrically connected to the front electrical connector.",
"One set of the sets of front and rear electrical connectors is a set of male electrical connectors and the other set of the sets of front and rear electrical connectors is a set of female electrical connectors.",
"Each female electrical connector has a jaw structure including first and second jaws.",
"The first and second jaws together define a second axis along which the first and second jaws clamp one of the male electrical connectors.",
"The second axis is generally perpendicular to the first axis.",
"The first and second jaws have a width that is sized so that the male electrical connector is positionable therebetween over a range of positions along the second axis.",
"The female electrical connector has a jaw structure biasing member that biases the jaw structure towards a home position but permits movement of the jaw structure along a third axis that is generally perpendicular to the first and second axes.",
"These and other objects, advantages, purposes and features of the present invention will become apparent upon review of the following specification in conjunction with the drawings.",
"BRIEF DESCRIPTION OF THE DRAWINGS The present invention will now be described by way of example only with reference to the attached drawings, in which: FIG.",
"1 is a perspective view of a camera in accordance with an embodiment of the present invention; FIG.",
"2 is a sectional view of a portion of the camera shown in FIG.",
"1; FIG.",
"3 is a magnified perspective view of a female electrical connector assembly from the camera shown in FIG.",
"1; FIG.",
"4 is a magnified perspective side view of a female electrical connector from the female electrical connector assembly shown in FIG.",
"3; FIG.",
"5 is a magnified sectional end view of the female electrical connector assembly shown in FIG.",
"3; FIG.",
"6 is a magnified sectional perspective view of the female electrical connector assembly shown in FIG.",
"3; FIG.",
"7 is an exploded view of the female electrical connector assembly shown in FIG.",
"3; and FIGS.",
"8a and 8b are perspective views illustrating stages of assembly of the female electrical connector assembly shown in FIG.",
"3.DETAILED DESCRIPTION OF THE INVENTION Reference is made to FIG.",
"1, which shows a camera 10 for use in a vehicle (not shown), and in particular for use as a rearview camera in a vehicle.",
"The camera 10 includes an optical element or lens assembly or lens member 12, a circuit board 14, an imager 15, a front housing member 16 and a rear housing member 18 (shown in FIG.",
"1 as being transparent).",
"The lens member 12 may be any suitable lens member known in the art, and is mounted to the front housing member 16.In some instances the lens member 12 may a separate element from the front housing member 16, or it may be integral with the front housing member 16.Note that the terms ‘front’ and ‘rear’ as used in the present document refer to the front of the camera 10 (i.e., the portion of the camera where the lens member is located), and the rear of the camera 10 (i.e., the portion of the camera 10 opposite the front of the camera 10).",
"When the camera 10 is used in a rearview application in a vehicle (such as when the camera is mounted at a rear portion of a vehicle and has a rearward field of view rearward of the vehicle), the front of the camera 10 thus faces rearwardly relative to the vehicle and the rear of the camera 10 faces towards the front of the vehicle.",
"The lens member 12 is positioned in a selected position to receive images and focus them on the imager 15.The imager 15 may be any suitable imaging element, such as an imaging array of photosensors or such as a charge-coupled device (CCD) or a complementary metal-oxide semiconductor (CMOS) sensor, such as discussed below.",
"The circuit board 14 receives signals from the imager 15 and sends signals to one or more other components of the vehicle, such as a control device (not shown) within the vehicle.",
"The imaging element 15 may be mounted directly onto the circuit board 14.The circuit board 14 is mounted to the front housing member 16.Referring to FIG.",
"2, the rear housing member 18 mounts to the front housing member 16 in a fixed position by virtue of an alignment structure 22, which aligns the rear housing member 18 in a specific position relative to the front housing member 16.The alignment structure 22 may be made up of any suitable rear housing alignment structure and any suitable front housing alignment structure which mate together to align the rear housing portion 18 with respect to the front housing member 16 along a first axis 27.For example, the alignment structure 22 may include a peripheral edge portion 24 on the rear housing member 18 that mates with a press fit onto a peripheral shoulder 26 on the front housing member 16.In an alternative embodiment, the alignment structure 22 may include a plurality of threaded fasteners (not shown), which pass through fastener apertures (not shown) on one of the housing members 16 or 18 and into threaded apertures (not shown) in the other of the housing members 16 or 18.An adhesive or some other means of joining or permanently joining the front and rear housing members 16 and 18 together may also be provided.",
"For example, the housing members 16 and 18 may be welded together or otherwise bonded or joined.",
"The front and rear housing members 16 and 18 may be made from any suitable material, such as a polymeric material, such as a material called Xenoy™ from Sabic Americas, Inc. in Houston, Tex., USA.",
"Alternatively to Xenoy™, any other type of PBT (Polybutylene Terephthalate) or PBT/PC (a blend of Polybutylene Terephthalate and Polycarbonate) or other suitable material may be used.",
"In instances wherein the front and rear housing members 16 and 18 may build up a static electrical charge, it is preferable to provide means to inhibit such a buildup so as to protect components such as the circuit board 14.A set of front electrical connectors 20 are connected to the circuit board 14, which are female electrical connectors.",
"The rear housing member 18 has a set of rear electrical connectors 28 therein which, in the illustrated embodiment, are male electrical connectors.",
"The rear electrical connectors 28 may be incorporated into the rear housing member 18 by any suitable means, such as by insert molding.",
"The male electrical connectors 28 have first terminals 29 that mate with the female electrical connectors 20 on the circuit board 14, and second terminals 32, which are contained in a vehicle connection portion 30 of the rear housing member 18.The vehicle connection portion 30 is configured to connect to or receive a vehicle connector (such as a connector of a vehicle wiring harness or the like), which connects the circuit board 14 to some other component in the vehicle such as a control unit (not shown).",
"The vehicle connection portion 30 need not be as shown.",
"For example, the vehicle connection portion 30 may instead include a wire harness connected to the male electrical connectors 28, and a housing with pins therein connected to a distal end of the wire harness.",
"Reference is made to FIG.",
"3, which shows a female electrical connector assembly 33, which the female electrical connectors are a part of.",
"The female electrical connector assembly 33 includes a plurality of the female electrical connectors 20 and a connector housing 34.Referring to FIG.",
"4, each female electrical connector 20 has a jaw structure 35 including first and second jaws 36 and 38.The first and second jaws 36 and 38 are biased towards each other so that they clamp the male electrical connector 28 therebetween.",
"The first and second jaws 36 and 38 together define a clamping line 42 may be referred to as a second axis along which they clamp the male electrical connector 28.The jaws 36 and 38 have a width Wj that is larger than the width (shown at Wm in FIG.",
"4) of the male electrical connector 28 so that the male electrical connector 28 is positionable between the jaws 36 and 38 over a range of positions along the second axis 42.The jaws 36 and 38 are biased towards each other by jaw biasing members 44 and 46, which may be any suitable biasing members such as leaf springs.",
"The jaw structure 35 is biased towards a home position by a jaw structure biasing member 48, to which the jaw structure 35 is connected.",
"The jaw structure biasing member 48 may be any suitable biasing member such as a leaf spring and permits movement of the jaw structure 35 along a third axis 50 (see FIG.",
"5) that is generally perpendicular to the first and second axes 27 and 42.As a result, the male electrical connector 28 can be received in the jaws 36 and 38 of the female electrical connector 20 over a range of positions along the third axis 50.The female electrical connector 20 further includes a contact 52 that is positioned for connecting to the circuit board 14.The contact 52 has a suitable surface area over which to connect to an electrical trace on the circuit board 14.The female electrical connector 20 further includes a clamp portion 54, which is sized to clamp onto a base member 56 (FIGS.",
"6 and 7) that forms part of the connector housing 34.The contact 52 forms part of the clamp portion 54.The female electrical connector 20 is preferably formed from a single piece of material that is cut and bent as necessary.",
"The connector 20 may be made from any suitable material, such as a copper alloy or the like.",
"An example material is tin-plated C15219 phosphor bronze, but other materials may be used.",
"Referring to FIG.",
"7, the base member 56 includes a plurality of clamp receiving portions 58 which are sized to snugly receive the clamp portions 54 of the female electrical connectors 20, thereby forming a pre-assembly 60 (FIG.",
"8b) that is self-supporting and that can be handled as a single item so as to facilitate assembly of the camera 10.As shown in FIG.",
"8a, the base member 56 may be configured such that successive female electrical connectors 20 alternately connect to the base member 56 from one side shown at 62 and then from the other side shown at 64, which facilitates placement of the female electrical connectors 20 onto the base member 56.The connector housing 34 further includes an upper member 66, which cooperates with the base member 56 to form chambers 68, each of which houses one of the female electrical connectors 20 (shown in FIGS.",
"8e and 3).",
"The chambers 68 are defined by chamber walls 70, which include fore and aft walls 70a, divider walls 70b and end walls 70c.",
"Referring to FIG.",
"5, one of the chambers 68 is shown.",
"As shown, the fore and aft walls 70a serve to limit the movement of the jaw structure 35 along the third axis 50.The upper member 66 cooperates with the base member 56 to form the divider walls 70b.",
"More particularly, the divider walls 70b have lower portions 72 which are portions of the base member 56 and upper portions 74 which are portions of the upper member 66.During entry of the male electrical connector 28 into the female electrical connector 20 the male electrical connector 28 will drive the jaw structure 35 of the female electrical connector 20 in a first direction shown by arrow 77 (i.e.",
"downwards in FIG.",
"5).",
"An entry limit member 76 is provided on one of the chamber walls 70 (e.g., the lower portion 72 of the divider wall 70b), which is engaged by an entry limit shoulder 78 on the female electrical connector 20 to limit the amount of downward movement that the jaw structure 35 will incur during entry of the male electrical connector 28.During withdrawal of the male electrical connector 28 from the female electrical connector 20, the male electrical connector 28 will pull the jaw structure 35 of the female electrical connector 20 in a second direction 79 (i.e., upwards in FIG.",
"5) so as to withdraw it from the chamber 68.A withdrawal limit member 80 is provided on one of the chamber walls 70 (e.g., the upper portion 74 of the divider wall 70b), which is engaged by a withdrawal limit shoulder 82 on the female electrical connector 20 to limit the amount of upward movement that the jaw structure 35 will incur during withdrawal of the male electrical connector 28.The connector housing 34 may be made from any suitable material, such as an electrically insulative material so as to limit or prevent conduction of electrical signals between adjacent female electrical connectors 20.An example material is Nylon 9T, but other suitable materials may be used.",
"The upper member 66 may connect to the base member 56 fixedly, such as by way of a suitable adhesive.",
"As an alternative to adhesive, a mechanical means may be used, such as snap features, or interference ribs that would provide a force fit.",
"Alternatively, the upper member 66 may connect to the circuit board 14 using some suitable means such as an adhesive and may engage the base member 56 without being connected to the base member 56.As a result of the configuration of the female electrical connectors 20, the male electrical connectors 28 and the female electrical connectors 20 need not be precisely aligned with respect to either of the second or third axes in order for them to mate together to form a strong electrical connection without causing undue stresses on each other.",
"As a result, the rear housing member 18 can be aligned with the front housing member 16 without damaging the connectors 20 and 28 and while providing a strong electrical connection therebetween.",
"By aligning the front and rear housing members 16 and 18 together, greater control over the overall dimensions of the camera 10 are provided, as compared to an assembly where the rear housing ‘floats’ relative to the front housing member.",
"As a result, the camera 10 can fit in a smaller space than a similar camera 10 with a floating rear housing member, which is advantageous in today's vehicles where there is a continuing need to fit such cameras in ever shrinking spaces.",
"Further, the non-floating rear housing member 18 may be used as a datum feature during installation of the camera to maintain tight tolerances relative to a camera with a floating rear housing member.",
"The camera 10 need not be mounted at the rear of a vehicle or as a rearview camera at all.",
"The camera may be mounted anywhere suitable about the vehicle.",
"For example, the camera could face the front or side of the vehicle, or may, for example, face the rear of the vehicle while being mounted on the side of the vehicle (e.g., such as for blind-spot monitoring for the vehicle or the like).",
"In the illustrated embodiment, the front electrical connectors 20 are female electrical connectors and the rear electrical connectors 28 are male electrical connectors.",
"It is alternatively possible to provide the male electrical connectors on the circuit board 14 as the front electrical connectors and the female electrical connectors as the rear electrical connectors.",
"The camera or imager or imaging sensor may comprise any suitable camera or imager or sensor.",
"Optionally, the camera may comprise a “smart camera” that includes the imaging sensor array and associated circuitry and image processing circuitry and electrical connectors and the like as part of a camera module, such as by utilizing aspects of the vision systems described in U.S. provisional application Ser.",
"No.",
"61/563,965, filed Nov. 28, 2011, which is hereby incorporated herein by reference in its entirety.",
"The vehicle may include any type of sensor or sensors, such as imaging sensors or radar sensors or lidar sensors or ultrasonic sensors or the like.",
"The imaging sensor or camera may capture image data for image processing and may comprise any suitable camera or sensing device, such as, for example, an array of a plurality of photosensor elements arranged in 640 columns and 480 rows (a 640×480 imaging array), with a respective lens focusing images onto respective portions of the array.",
"The photosensor array may comprise a plurality of photosensor elements arranged in a photosensor array having rows and columns.",
"The logic and control circuit of the imaging sensor may function in any known manner, such as in the manner described in U.S. Pat.",
"Nos.",
"5,550,677; 5,877,897; 6,498,620; 5,670,935; 5,796,094 and/or 6,396,397, and/or U.S. provisional applications, Ser.",
"No.",
"61/600,205, filed Feb. 17, 2012; Ser.",
"No.",
"61/588,833, filed Jan. 20, 2012; Ser.",
"No.",
"61/583,381, filed Jan. 5, 2012; Ser.",
"No.",
"61/579,682, filed Dec. 23, 2011; Ser.",
"No.",
"61/570,017, filed Dec. 13, 2011; Ser.",
"No.",
"61/568,791, filed Dec. 9, 2011; Ser.",
"No.",
"61/567,446, filed Dec. 6, 2011; Ser.",
"No.",
"61/567,150, filed Dec. 6, 2011; Ser.",
"No.",
"61/565,713, filed Dec. 1, 2011; Ser.",
"No.",
"61/559,970, filed Nov. 15, 2011; Ser.",
"No.",
"61/552,167, filed Oct. 27, 2011; Ser.",
"No.",
"61/540,256, filed Sep. 28, 2011; Ser.",
"No.",
"61/513,745, filed Aug. 1, 2011; Ser.",
"No.",
"61/511,738, filed Jul.",
"26, 2011; and/or Ser.",
"No.",
"61/503,098, filed Jun.",
"30, 2011, which are all hereby incorporated herein by reference in their entireties.",
"The system may communicate with other communication systems via any suitable means, such as by utilizing aspects of the systems described in PCT Application No.",
"PCT/US10/038477, filed Jun.",
"14, 2010 and published Dec. 16, 2010 as International Publication No.",
"WO 2010/144900, and/or U.S. patent application Ser.",
"No.",
"13/202,005, filed Aug. 17, 2011, now U.S. Pat.",
"No.",
"9,126,525, which are hereby incorporated herein by reference in their entireties.",
"The camera or cameras may comprise any suitable cameras or imaging sensors or camera modules, and may utilize aspects of the cameras or sensors described in U.S. patent applications, Ser.",
"No.",
"12/091,359, filed Apr.",
"24, 2008 and published Oct. 1, 2009 as U.S.",
"Publication No.",
"US-2009-0244361, and/or Ser.",
"No.",
"13/260,400, filed Sep. 26, 2011, now U.S. Pat.",
"No.",
"8,542,451, and/or U.S. Pat.",
"Nos.",
"7,965,336 and/or 7,480,149, which are hereby incorporated herein by reference in their entireties.",
"The imaging array sensor may comprise any suitable sensor, and may utilize various imaging sensors or imaging array sensors or cameras or the like, such as a CMOS imaging array sensor, a CCD sensor or other sensors or the like, such as the types described in U.S. Pat.",
"Nos.",
"5,550,677; 5,670,935; 5,760,962; 5,715,093; 5,877,897; 6,922,292; 6,757,109; 6,717,610; 6,590,719; 6,201,642; 6,498,620; 5,796,094; 6,097,023; 6,320,176; 6,559,435; 6,831,261; 6,806,452; 6,396,397; 6,822,563; 6,946,978; 7,339,149; 7,038,577; 7,965,336; 7,004,606 and/or 7,720,580, and/or PCT Application No.",
"PCT/US2008/076022, filed Sep. 11, 2008 and published Mar.",
"19, 2009 as International Publication No.",
"WO/2009/036176, and/or PCT Application No.",
"PCT/US2008/078700, filed Oct. 3, 2008 and published Apr.",
"9, 2009 as International Publication No.",
"WO/2009/046268, which are all hereby incorporated herein by reference in their entireties.",
"The imaging device and control and image processor and any associated illumination source, if applicable, may comprise any suitable components, and may utilize aspects of the cameras and vision systems described in U.S. Pat.",
"Nos.",
"5,550,677; 5,877,897; 6,498,620; 5,670,935; 5,796,094; 6,396,397; 6,806,452; 6,690,268; 7,005,974; 7,123,168; 7,004,606; 6,946,978; 7,038,577; 6,353,392; 6,320,176; 6,313,454 and 6,824,281, and/or International Publication No.",
"WO 2010/099416, published Sep. 2, 2010, and/or PCT Application No.",
"PCT/US10/47256, filed Aug. 31, 2010 and published Mar.",
"10, 2011 as International Publication No.",
"WO 2011/028686, and/or U.S. patent application Ser.",
"No.",
"12/508,840, filed Jul.",
"24, 2009, and published Jan. 28, 2010 as U.S. Pat.",
"Publication No.",
"US 2010-0020170; and/or U.S. provisional applications, Ser.",
"No.",
"61/511,738, filed Jul.",
"26, 2011; and/or Ser.",
"No.",
"61/503,098, filed Jun.",
"30, 2011, which are all hereby incorporated herein by reference in their entireties.",
"The camera module and circuit chip or board and imaging sensor may be implemented and operated in connection with various vehicular vision-based systems, and/or may be operable utilizing the principles of such other vehicular systems, such as a vehicle headlamp control system, such as the type disclosed in U.S. Pat.",
"Nos.",
"5,796,094; 6,097,023; 6,320,176; 6,559,435; 6,831,261; 7,004,606; 7,339,149 and/or 7,526,103, which are all hereby incorporated herein by reference in their entireties, a rain sensor, such as the types disclosed in commonly assigned U.S. Pat.",
"Nos.",
"6,353,392; 6,313,454; 6,320,176 and/or 7,480,149, which are hereby incorporated herein by reference in their entireties, a vehicle vision system, such as a forwardly, sidewardly or rearwardly directed vehicle vision system utilizing principles disclosed in U.S. Pat.",
"Nos.",
"5,550,677; 5,670,935; 5,760,962; 5,877,897; 5,949,331; 6,222,447; 6,302,545; 6,396,397; 6,498,620; 6,523,964; 6,611,202; 6,201,642; 6,690,268; 6,717,610; 6,757,109; 6,802,617; 6,806,452; 6,822,563; 6,891,563; 6,946,978 and/or 7,859,565, which are all hereby incorporated herein by reference in their entireties, a trailer hitching aid or tow check system, such as the type disclosed in U.S. Pat.",
"No.",
"7,005,974, which is hereby incorporated herein by reference in its entirety, a reverse or sideward imaging system, such as for a lane change assistance system or lane departure warning system or for a blind spot or object detection system, such as imaging or detection systems of the types disclosed in U.S. Pat.",
"Nos.",
"7,881,496; 7,720,580; 7,038,577; 5,929,786 and/or 5,786,772, and/or U.S. provisional application Ser.",
"No.",
"60/618,686, filed Oct. 14, 2004, which are hereby incorporated herein by reference in their entireties, a video device for internal cabin surveillance and/or video telephone function, such as disclosed in U.S. Pat.",
"Nos.",
"5,760,962; 5,877,897; 6,690,268 and/or 7,370,983, and/or U.S. patent application Ser.",
"No.",
"10/538,724, filed Jun.",
"13, 2005 and published Mar.",
"9, 2006 as U.S.",
"Publication No.",
"US-2006-0050018-A1, which are hereby incorporated herein by reference in their entireties, a traffic sign recognition system, a system for determining a distance to a leading or trailing vehicle or object, such as a system utilizing the principles disclosed in U.S. Pat.",
"Nos.",
"6,396,397 and/or 7,123,168, which are hereby incorporated herein by reference in their entireties, and/or the like.",
"Optionally, the circuit board or chip may include circuitry for the imaging array sensor and or other electronic accessories or features, such as by utilizing compass-on-a-chip or EC driver-on-a-chip technology and aspects such as described in U.S. Pat.",
"Nos.",
"7,255,451 and/or 7,480,149; and/or U.S. patent applications, Ser.",
"No.",
"11/226,628, filed Sep. 14, 2005 and published Mar.",
"23, 2006 as U.S.",
"Publication No.",
"US-2006-0061008, and/or Ser.",
"No.",
"12/578,732, filed Oct. 14, 2009 and published Apr.",
"22, 2010 as U.S.",
"Publication No.",
"US-2010-0097469, which are hereby incorporated herein by reference in their entireties.",
"Optionally, the vision system may include a display for displaying images captured by one or more of the imaging sensors for viewing by the driver of the vehicle while the driver is normally operating the vehicle.",
"Optionally, for example, the vision system may include a video display device disposed at or in the interior rearview mirror assembly of the vehicle, such as by utilizing aspects of the video mirror display systems described in U.S. Pat.",
"No.",
"6,690,268 and/or U.S. patent application Ser.",
"No.",
"13/333,337, filed Dec. 21, 2011 and published Jun.",
"28, 2012 as U.S.",
"Publication No.",
"US-2012-0162427, which are hereby incorporated herein by reference in their entireties.",
"The video mirror display may comprise any suitable devices and systems and optionally may utilize aspects of the compass display systems described in U.S. Pat.",
"Nos.",
"7,370,983; 7,329,013; 7,308,341; 7,289,037; 7,249,860; 7,004,593; 4,546,551; 5,699,044; 4,953,305; 5,576,687; 5,632,092; 5,677,851; 5,708,410; 5,737,226; 5,802,727; 5,878,370; 6,087,953; 6,173,508; 6,222,460; 6,513,252 and/or 6,642,851, and/or European patent application, published Oct. 11, 2000 under Publication No.",
"EP 0 1043566, and/or U.S. patent application Ser.",
"No.",
"11/226,628, filed Sep. 14, 2005 and published Mar.",
"23, 2006 as U.S.",
"Publication No.",
"US-2006-0061008, which are all hereby incorporated herein by reference in their entireties.",
"Optionally, the video mirror display screen or device may be operable to display images captured by a rearward viewing camera of the vehicle during a reversing maneuver of the vehicle (such as responsive to the vehicle gear actuator being placed in a reverse gear position or the like) to assist the driver in backing up the vehicle, and optionally may be operable to display the compass heading or directional heading character or icon when the vehicle is not undertaking a reversing maneuver, such as when the vehicle is being driven in a forward direction along a road (such as by utilizing aspects of the display system described in PCT Application No.",
"PCT/US2011/056295, filed Oct. 14, 2011 and published Apr.",
"19, 2012 as International Publication No.",
"WO 2012/051500, which is hereby incorporated herein by reference in its entirety).",
"Optionally, the vision system (utilizing the rearward facing camera and other cameras disposed at the vehicle with exterior fields of view) may the camera or cameras may be part of a vehicle vision system and the vision system may comprise or utilize a plurality of cameras, and the vision system (utilizing a rearward facing camera and sidewardly facing cameras and a forwardly facing cameras disposed at the vehicle) may provide a display of a top-down view or birds-eye view of the vehicle or a surround view at the vehicle, such as by utilizing aspects of the vision systems described in PCT Application No.",
"PCT/US10/25545, filed Feb. 26, 2010 and published on Sep. 2, 2010 as International Publication No.",
"WO 2010/099416, and/or PCT Application No.",
"PCT/US10/47256, filed Aug. 31, 2010 and published Mar.",
"10, 2011 as International Publication No.",
"WO 2011/028686, and/or U.S. patent application Ser.",
"No.",
"13/333,337, filed Dec. 21, 2011 and published Jun.",
"28, 2012 as U.S.",
"Publication No.",
"US-2012-0162427, and/or U.S. provisional applications, Ser.",
"No.",
"61/570,017, filed Dec. 13, 2011; Ser.",
"No.",
"61/559,970, filed Nov. 15, 2011; and/or Ser.",
"No.",
"61/540,256, filed Sep. 28, 2011, which are hereby incorporated herein by reference in their entireties.",
"Optionally, the video mirror display may be disposed rearward of and behind the reflective element assembly and may comprise a display such as the types disclosed in U.S. Pat.",
"Nos.",
"7,855,755; 5,530,240; 6,329,925; 7,855,755; 7,626,749; 7,581,859; 7,446,650; 7,370,983; 7,338,177; 7,274,501; 7,255,451; 7,195,381; 7,184,190; 5,668,663; 5,724,187 and/or 6,690,268, and/or in U.S. patent applications, Ser.",
"No.",
"11/226,628, filed Sep. 14, 2005 and published Mar.",
"23, 2006 as U.S.",
"Publication No.",
"US-2006-0061008; and/or Ser.",
"No.",
"10/538,724, filed Jun.",
"13, 2005 and published Mar.",
"9, 2006 as U.S.",
"Publication No.",
"US-2006-0050018, which are all hereby incorporated herein by reference in their entireties.",
"The display is viewable through the reflective element when the display is activated to display information.",
"The display element may be any type of display element, such as a vacuum fluorescent (VF) display element, a light emitting diode (LED) display element, such as an organic light emitting diode (OLED) or an inorganic light emitting diode, an electroluminescent (EL) display element, a liquid crystal display (LCD) element, a video screen display element or backlit thin film transistor (TFT) display element or the like, and may be operable to display various information (as discrete characters, icons or the like, or in a multi-pixel manner) to the driver of the vehicle, such as passenger side inflatable restraint (PSIR) information, tire pressure status, and/or the like.",
"The mirror assembly and/or display may utilize aspects described in U.S. Pat.",
"Nos.",
"7,184,190; 7,255,451; 7,446,924 and/or 7,338,177, which are all hereby incorporated herein by reference in their entireties.",
"The thicknesses and materials of the coatings on the substrates of the reflective element may be selected to provide a desired color or tint to the mirror reflective element, such as a blue colored reflector, such as is known in the art and such as described in U.S. Pat.",
"Nos.",
"5,910,854; 6,420,036 and/or 7,274,501, which are hereby incorporated herein by reference in their entireties.",
"Optionally, the display or displays and any associated user inputs may be associated with various accessories or systems, such as, for example, a tire pressure monitoring system or a passenger air bag status or a garage door opening system or a telematics system or any other accessory or system of the mirror assembly or of the vehicle or of an accessory module or console of the vehicle, such as an accessory module or console of the types described in U.S. Pat.",
"Nos.",
"7,289,037; 6,877,888; 6,824,281; 6,690,268; 6,672,744; 6,386,742 and 6,124,886, and/or U.S. patent application Ser.",
"No.",
"10/538,724, filed Jun.",
"13, 2005 and published Mar.",
"9, 2006 as U.S.",
"Publication No.",
"US-2006-0050018, which are hereby incorporated herein by reference in their entireties.",
"While the above description constitutes a plurality of embodiments of the present invention, it will be appreciated that the present invention is susceptible to further modification and change without departing from the fair meaning of the accompanying claims."
]
] |
Patent_15871174
|
[
[
"VIRTUAL RADAR CONFIGURATION FOR 2D ARRAY",
"A radar sensing system for a vehicle includes a plurality of transmitters, a plurality of receivers, and a plurality of receive and transmit antennas.",
"The plurality of transmitters are configured for installation and use on a vehicle, and operable to transmit radio signals.",
"The plurality of receivers are configured for installation and use on the vehicle, and operable to receive radio signals which include transmitted radio signals reflected from objects in the environment.",
"The plurality of receive antennas and the plurality of transmit antennas are arranged in a selected configuration to provide a quantity of receive antennas and transmit antennas for a desired level of two-dimensional angle capability for a given board size."
],
[
"1.A radar sensing system for a vehicle, the radar sensing system comprising: a plurality of transmitters configured for installation and use on a vehicle, and configured to transmit radio signals; a plurality of receivers configured for installation and use on the vehicle, and configured to receive radio signals that include transmitted radio signals transmitted by the plurality of transmitters and reflected from objects in an environment; and a plurality of antennas, wherein the plurality of antennas comprises a plurality of receive antennas and a plurality of transmit antennas, wherein the antennas of the plurality of antennas are arranged with spacings between adjacent antennas of greater than a half wavelength (λ/2) apart, and wherein the arrangements of the antennas produce a virtual receive array with virtual antennas spaced no more than λ/2 apart.",
"2.The radar sensing system of claim 1, wherein spacings between transmit antennas of the plurality of transmit antennas comprise uniform spacings of an integer multiple of λ/2, and wherein spacings between receive antennas of the plurality of receive antennas comprise uniform spacings of a different integer multiple of λ/2.3.The radar sensing system of claim 1, wherein the wavelength is defined by a frequency of the transmitted signal frequency.",
"4.The radar sensing system of claim 1, wherein the plurality of receive antennas and the plurality of transmit antennas are swapped without changing the resulting virtual receive array.",
"5.The radar sensing system of claim 1, wherein at least a portion of the transmit antennas are arranged in at least one linear array, and wherein at least a portion of the receive antennas are arranged in at least one linear array or a two dimensional (2D) array.",
"6.The radar sensing system of claim 5, wherein at least a portion of the receive antennas are arranged in at least one linear array, and wherein the at least one linear array of receive antennas comprises one of: (i) at least one horizontal array, (ii) at least one vertical array, and (iii) at least one horizontal array and at least one vertical array.",
"7.The radar sensing system of claim 1, wherein the receive antennas and transmit antennas are arranged as combinations of sub-arrays, and wherein the combinations of sub-arrays are selectively (i) processed independently for target detection and angle measurement, or (ii) combined coherently to form a composite antenna response prior to detection and/or angle measurement.",
"8.The radar sensing system of claim 1, wherein the virtual receive array comprises no grating lobes.",
"9.The radar sensing system of claim 1, wherein the spacings of the transmit antennas and the receive antennas suppress grating lobes in the resulting virtual receive array.",
"10.The radar sensing system of claim 1, wherein the virtual receive array comprises virtual antennas with non-uniform spacing greater than λ/2, and wherein the virtual receive array is modified according to one of (i) at least one of the virtual antennas is discarded, and (ii) resulting holes produced through the non-uniform spacings are filled to extend the length of the portion of the virtual receive array with uniform spacing of virtual antennas via array interpolation techniques.",
"11.The radar sensing system of claim 1, wherein the spacings between antennas are uniform or irregular.",
"12.The radar sensing system of claim 11, wherein the arrangements of the receive antennas and transmit antennas are selected as defined by a given quantity of receive antennas and a given quantity of transmit antennas needed for a desired level of two-dimensional angle capability.",
"13.A radar sensing system for a vehicle, the radar sensing system comprising: a plurality of transmitters configured for installation and use on a vehicle, and configured to transmit radio signals; a plurality of receivers configured for installation and use on the vehicle, and configured to receive radio signals that include transmitted radio signals transmitted by the plurality of transmitters and reflected from objects in an environment; a plurality of receive antennas arranged as a two-dimensional (2D) array of receive antennas; a plurality of transmit antennas arranged as at least two linear arrays of transmit antennas, and wherein the receive antennas and the transmit antennas are arranged with spacings between antennas of greater than a half wavelength (λ/2) apart, and wherein the arrangements of the receive antennas and the transmit antennas produce a 2D virtual receive array with virtual antennas spaced no more than λ/2 apart.",
"14.The radar sensing system of claim 13, wherein spacings between adjacent transmit antennas of the plurality of transmit antennas comprise uniform spacings of an integer multiple of λ/2, and wherein spacings between adjacent receive antennas of the plurality of receive antennas comprise uniform spacings of a different integer multiple of λ/2.15.The radar sensing system of claim 13, wherein the plurality of receive antennas and the plurality of transmit antennas are swapped without changing the resulting virtual receive array.",
"16.The radar sensing system of claim 13, wherein the receive antennas and the transmit antennas are arranged as combinations of sub-arrays, and wherein the combinations of sub-arrays are selectively (i) processed independently for target detection and angle measurement, or (ii) combined coherently to form a composite antenna response prior to detection and/or angle measurement.",
"17.The radar sensing system of claim 13, wherein the virtual receive array comprises no grating lobes.",
"18.The radar sensing system of claim 13, wherein the spacings of the transmit antennas and the receive antennas suppress grating lobes in the resulting virtual receive array.",
"19.The radar sensing system of claim 13, wherein the virtual receive array comprises virtual antennas with non-uniform spacing greater than 212, and wherein the virtual receive array is modified according to one of (i) at least one of the virtual antennas is discarded, and (ii) resulting holes produced through the non-uniform spacings are filled to extend the length of the portion of the virtual receive array with uniform spacing of virtual antennas via array interpolation techniques.",
"20.A radar sensing system for a vehicle, the radar sensing system comprising: a plurality of transmitters configured for installation and use on a vehicle, and configured to transmit radio signals; a plurality of receivers configured for installation and use on the vehicle, and configured to receive radio signals that include transmitted radio signals transmitted by the plurality of transmitters and reflected from objects in an environment; a plurality of receive antennas comprising receive antennas arranged as a two-dimensional (2D) receiver antenna array selectively and irregularly filled with antennas; a plurality of transmit antennas comprising transmit antennas arranged as at least two linear arrays of transmit antennas; and wherein the arrangements of the receive antennas and the transmit antennas produce a 2D virtual receive array irregularly filled with virtual receivers to select a particular asymmetrical horizontal and vertical angle capability.",
"21.The radar sensing system of claim 20, wherein the selected antenna arrangements are chosen for a given quantity of receive antennas and a given quantity of transmit antennas needed for a desired level of 2D angle capability.",
"22.The radar sensing system of claim 20, wherein the selected antenna arrangements comprise a multiple-input, multiple-output (MIMO) antenna configuration.",
"23.The radar sensing system of claim 20, wherein the transmit antennas are arranged as at least three linear arrays of transmit antennas.",
"24.The radar sensing system of claim 23, wherein the at least three linear arrays of transmit antennas are arranged at opposite sides of the 2D receiver antenna array."
],
[
"<SOH> BACKGROUND OF THE INVENTION <EOH>The use of radar to determine range and velocity of objects in an environment is important in a number of applications including automotive radar and gesture detection.",
"A radar typically transmits a signal and listens for the reflection of the signal from objects in the environment.",
"By comparing the transmitted radio signals with the received radio signals, a radar system can determine the distance to an object.",
"Using Doppler processing, the velocity of an object can be determined.",
"Using various transmitter and receiver combinations, the location (angle) of an object can also be determined."
],
[
"<SOH> SUMMARY OF THE INVENTION <EOH>The present invention provides multiple-input, multiple-output (MIMO) virtual array methods and a system for achieving better performance in a radar system in determining the angles of an object/target.",
"MIMO antenna techniques offer the potential for substantial improvements in azimuth and elevation angle accuracy and resolution.",
"Automotive radar with MIMO technology is now entering the market place with modest improvements in angle capability, primarily in the azimuth angle dimension, with less capability in the elevation angle dimension.",
"To support autonomous driving, substantially better capability in both azimuth and elevation will be required to detect and determine the angles of closely spaced objects and to image individual objects.",
"Therefore, improved MIMO antenna configurations are needed to provide the required resolution in azimuth and elevation within the constraints of the physical antenna size and performance/cost of the radio frequency (RF) and digital signal processing components.",
"Improved MIMO antenna configurations are disclosed herein.",
"A radar sensing system for a vehicle in accordance with an embodiment of the present invention includes a plurality of transmitters, a plurality of receivers, and a plurality of receive antennas and transmit antennas.",
"The plurality of transmitters is configured for installation and use on a vehicle, and operable to transmit radio signals.",
"The plurality of receivers is configured for installation and use on the vehicle, and operable to receive radio signals that include transmitted radio signals reflected from objects in the environment.",
"A selected antenna configuration provides a quantity of receive antennas and transmit antennas for a desired two-dimensional angle capability for a given board size.",
"A radar sensing system for a vehicle in accordance with an embodiment of the present invention includes a plurality of transmitters and a plurality of receivers, and a plurality of receive and transmit antennas arranged according to MIMO antenna topologies that comprise transmit and receive antennas with uniform spacing of virtual phase centers as well as sparse array configurations with non-uniform spacing of the virtual phase centers in both horizontal and vertical dimensions.",
"A radar sensing system for a vehicle in accordance with an embodiment of the present invention includes a plurality of transmitters and a plurality of receivers, and a plurality of receive and transmit antennas arranged according to MIMO antenna topologies that provide a virtual receive sub-array with antennas spaced by half a wavelength (λ/2) while using transmit and receive antennas spaced by greater than λ/2 through the uniform spacing of the transmit antennas by an integer multiple of λ/2 and uniform spacing of the receive antennas by a different integer multiple of λ/2.A radar sensing system for a vehicle in accordance with an embodiment of the present invention includes a plurality of transmitters and a plurality of receivers, and a plurality of receive antennas and transmit antennas in an MIMO antenna configuration comprising one of: (i) a MIMO configuration with a minimum quantity of antennas and minimum antenna board size for a desired 2D angle capability; (ii) a MIMO configuration comprising TX antenna and/or RX antenna spacing substantially greater than half a wavelength (λ/2) and compatible with wide field of view (FOV), wherein selected TX antenna and/or RX antenna sizes are selected for enhanced detection range while still yielding a virtual uniform linear array (ULA) of λ/2 spacing with no grating lobes; (iii) a MIMO configuration comprising TX antenna and/or RX antenna spacing substantially greater than λ/2 that yields a virtual receive array with uniform phase center spacing of less than the TX or RX phase center spacing, but greater than λ/2, yet with the capability to suppress resulting grating lobes; (iv) a MIMO configuration wherein at least one of quantity, size, and spacing of TX antennas and RX antennas are selected for a desired 2D angle capability; and (v) a MIMO configuration with a selected spacing and/or layout for a desired level of azimuth and elevation capability for a given quantity of TX and RX antennas.",
"These and other objects, advantages, purposes and features of the present invention will become apparent upon review of the following specification in conjunction with the drawings."
],
[
"CROSS REFERENCE TO RELATED APPLICATION This application is a continuation of U.S. patent application Ser.",
"No.",
"15/705,627, filed Sep. 15, 2017, now U.S. Pat.",
"No.",
"9,869,762, which claims the filing benefit of U.S. provisional application Ser.",
"No.",
"62/395,583, filed Sep. 16, 2016, which is hereby incorporated by reference herein in its entirety.",
"FIELD OF THE INVENTION The present invention is directed to radar systems, and in particular to radar systems for vehicles.",
"BACKGROUND OF THE INVENTION The use of radar to determine range and velocity of objects in an environment is important in a number of applications including automotive radar and gesture detection.",
"A radar typically transmits a signal and listens for the reflection of the signal from objects in the environment.",
"By comparing the transmitted radio signals with the received radio signals, a radar system can determine the distance to an object.",
"Using Doppler processing, the velocity of an object can be determined.",
"Using various transmitter and receiver combinations, the location (angle) of an object can also be determined.",
"SUMMARY OF THE INVENTION The present invention provides multiple-input, multiple-output (MIMO) virtual array methods and a system for achieving better performance in a radar system in determining the angles of an object/target.",
"MIMO antenna techniques offer the potential for substantial improvements in azimuth and elevation angle accuracy and resolution.",
"Automotive radar with MIMO technology is now entering the market place with modest improvements in angle capability, primarily in the azimuth angle dimension, with less capability in the elevation angle dimension.",
"To support autonomous driving, substantially better capability in both azimuth and elevation will be required to detect and determine the angles of closely spaced objects and to image individual objects.",
"Therefore, improved MIMO antenna configurations are needed to provide the required resolution in azimuth and elevation within the constraints of the physical antenna size and performance/cost of the radio frequency (RF) and digital signal processing components.",
"Improved MIMO antenna configurations are disclosed herein.",
"A radar sensing system for a vehicle in accordance with an embodiment of the present invention includes a plurality of transmitters, a plurality of receivers, and a plurality of receive antennas and transmit antennas.",
"The plurality of transmitters is configured for installation and use on a vehicle, and operable to transmit radio signals.",
"The plurality of receivers is configured for installation and use on the vehicle, and operable to receive radio signals that include transmitted radio signals reflected from objects in the environment.",
"A selected antenna configuration provides a quantity of receive antennas and transmit antennas for a desired two-dimensional angle capability for a given board size.",
"A radar sensing system for a vehicle in accordance with an embodiment of the present invention includes a plurality of transmitters and a plurality of receivers, and a plurality of receive and transmit antennas arranged according to MIMO antenna topologies that comprise transmit and receive antennas with uniform spacing of virtual phase centers as well as sparse array configurations with non-uniform spacing of the virtual phase centers in both horizontal and vertical dimensions.",
"A radar sensing system for a vehicle in accordance with an embodiment of the present invention includes a plurality of transmitters and a plurality of receivers, and a plurality of receive and transmit antennas arranged according to MIMO antenna topologies that provide a virtual receive sub-array with antennas spaced by half a wavelength (λ/2) while using transmit and receive antennas spaced by greater than λ/2 through the uniform spacing of the transmit antennas by an integer multiple of λ/2 and uniform spacing of the receive antennas by a different integer multiple of λ/2.A radar sensing system for a vehicle in accordance with an embodiment of the present invention includes a plurality of transmitters and a plurality of receivers, and a plurality of receive antennas and transmit antennas in an MIMO antenna configuration comprising one of: (i) a MIMO configuration with a minimum quantity of antennas and minimum antenna board size for a desired 2D angle capability; (ii) a MIMO configuration comprising TX antenna and/or RX antenna spacing substantially greater than half a wavelength (λ/2) and compatible with wide field of view (FOV), wherein selected TX antenna and/or RX antenna sizes are selected for enhanced detection range while still yielding a virtual uniform linear array (ULA) of λ/2 spacing with no grating lobes; (iii) a MIMO configuration comprising TX antenna and/or RX antenna spacing substantially greater than λ/2 that yields a virtual receive array with uniform phase center spacing of less than the TX or RX phase center spacing, but greater than λ/2, yet with the capability to suppress resulting grating lobes; (iv) a MIMO configuration wherein at least one of quantity, size, and spacing of TX antennas and RX antennas are selected for a desired 2D angle capability; and (v) a MIMO configuration with a selected spacing and/or layout for a desired level of azimuth and elevation capability for a given quantity of TX and RX antennas.",
"These and other objects, advantages, purposes and features of the present invention will become apparent upon review of the following specification in conjunction with the drawings.",
"BRIEF DESCRIPTION OF THE DRAWINGS FIG.",
"1 is a plan view of an automobile equipped with a radar system in accordance with the present invention; FIG.",
"2A and FIG.",
"2B are block diagrams of radar systems in accordance with the present invention; FIG.",
"3 is a block diagram illustrating a radar system with a plurality of transmitters and transmit antennas and a plurality of receivers and receive antennas in accordance with the present invention; FIG.",
"4 illustrates capabilities of a radar system with multiple transmitters and transmit antennas and multiple receivers and receive antennas; FIG.",
"5A is a diagram illustrating a two dimensional (2D) MIMO configuration in accordance with an aspect of the present invention; FIG.",
"5B is a diagram illustrating a 2D virtual receive array synthesized by the MIMO configuration of FIG.",
"5A; FIG.",
"6A is a diagram illustrating 2D MIMO configuration in accordance with another aspect of the present invention; FIG.",
"6B is a diagram illustrating a 2D virtual receive array synthesized by the MIMO configuration of FIG.",
"6A in accordance with an aspect of the present invention; FIG.",
"7A is a diagram illustrating a 2D MIMO configuration in accordance with another aspect of the present invention; FIG.",
"7B is a diagram illustrating a 2D virtual receive array synthesized by the MIMO configuration of FIG.",
"7A in accordance with an aspect of the present invention; FIG.",
"8 is a diagram illustrating an example antenna comprised of multiple radiating elements in accordance with the present invention; FIG.",
"9A is a diagram illustrating a 2D MIMO configuration in accordance with another aspect of the present invention; FIG.",
"9B is a diagram illustrating a 2D virtual receive array synthesized by the MIMO configuration of FIG.",
"9A in accordance with an aspect of the present invention; FIG.",
"10A is a diagram illustrating a 2D MIMO configuration in accordance with an aspect of the present invention; FIG.",
"10B is a diagram illustrating a 2D virtual receive array synthesized by the MIMO configuration of FIG.",
"10A in accordance with an aspect of the present invention; FIG.",
"11A is a diagram illustrating a 2D MIMO configuration in accordance with an aspect of the present invention; FIG.",
"11B is a diagram illustrating a 2D virtual receive array synthesized by the MIMO configuration of FIG.",
"11A in accordance with an aspect of the present invention; FIG.",
"12A is a diagram illustrating a 2D MIMO configuration in accordance with an aspect of the present invention; FIG.",
"12B is a diagram illustrating a 2D virtual receive array synthesized by the MIMO configuration of FIG.",
"12A in accordance with an aspect of the present invention; FIG.",
"13A is a diagram illustrating a 2D MIMO configuration in accordance with an aspect of the present invention; FIG.",
"13B is a diagram illustrating a 2D virtual receive array synthesized by the MIMO configuration of FIG.",
"13A in accordance with an aspect of the present invention; FIG.",
"14A is a diagram illustrating a 2D MIMO configuration in accordance with an aspect of the present invention; FIG.",
"14B is a diagram illustrating a 2D virtual receive array synthesized by the MIMO configuration of FIG.",
"14A in accordance with an aspect of the present invention; FIG.",
"15A is a diagram illustrating a 2D MIMO configuration in accordance with an aspect of the present invention; FIG.",
"15B is a diagram illustrating a 2D virtual receive array synthesized by the MIMO configuration of FIG.",
"15A in accordance with an aspect of the present invention; FIG.",
"16A is a diagram illustrating a 2D MIMO configuration in accordance with an aspect of the present invention; and FIG.",
"16B is a diagram illustrating a 2D virtual receive array synthesized by the MIMO configuration of FIG.",
"16A in accordance with an aspect of the present invention.",
"DESCRIPTION OF THE PREFERRED EMBODIMENTS The present invention will now be described with reference to the accompanying figures, wherein numbered elements in the following written description correspond to like-numbered elements in the figures.",
"Exemplary embodiments of the present invention accomplish better two-dimensional (2D) angle capability over the current state of the art via exemplary multiple input, multiple output (MIMO) antenna topologies in accordance with the present invention.",
"Improvement in angle capability includes better angle resolution for more reliable detection of multiple closely spaced objects as well as better quality imaging for contour detection and identification of individual objects.",
"Angle resolution is known to scale linearly with the length of the MIMO virtual receiver array, which in turn depends on the number of transmit and receive antennas and their spatial distribution.",
"Therefore, as described herein, the present invention provides methods and a system for achieving better 2D angle performance in a radar system where a MIMO antenna configuration provides an efficient quantity of antennas and antenna board size for a given level of two-dimensional angle capability.",
"In an aspect of the present invention, the exemplary MIMO antenna topologies are scalable in the size and spacing of the TX and RX antennas, as well as the number of antennas, and the resulting 2D angle capability.",
"FIG.",
"1 illustrates an exemplary radar system 100 configured for use in a vehicle 150.In an aspect of the present invention, a vehicle 150 may be an automobile, truck, or bus, etc.",
"As illustrated in FIG.",
"1, the radar system 100 may comprise one or more transmitters and one or more receivers 104a-104d that interface with a control & processing module 102 and an indicator 106.Other configurations are also possible.",
"For example, modules 104a-104d can be complete radar sensors, each with one or multiple transmitters and one or multiple receivers and their own individual control & processing module.",
"FIG.",
"1 illustrates receivers/transmitters 104a-104d placed to acquire and provide data for object detection and adaptive cruise control.",
"The radar system 100 (providing such object detection and adaptive cruise control or the like) may be part of an Advanced Driver Assistance System (ADAS) for the automobile 150.FIG.",
"2A illustrates an exemplary radar system 200 with an antenna 202 that is time-shared between a transmitter 206 and a receiver 208 via a duplexer 204.As also illustrated in FIG.",
"2A, output from the receiver 208 is received by a control and processing module 210 that processes the output from the receiver 208 to produce display data for the display 212.As discussed herein, the control and processing module 210 is also operable to produce a radar data output that is provided to other control units.",
"The control and processing module 210 is also operable to control the transmitter 206.FIG.",
"2B illustrates an alternative exemplary radar system 250 with a pair of antennas 202a, 202b, a separate antenna 202a for the transmitter 206 and another antenna 202b for the receiver 208.Radars with a single transmitter/antenna and a single receiver/antenna can determine distance to a target/object but cannot determine a direction or an angle of an object from the radar sensor or system (unless the transmit antenna or receive antenna is mechanically scanned).",
"To achieve angular information, either multiple transmitters/antennas or multiple receivers/antennas or both are needed.",
"The larger the number of transmitters and receivers (with corresponding antennas), the better the resolution possible.",
"A system with multiple transmitters and multiple receivers is also called a multiple input, multiple output or MIMO system.",
"As discussed herein, a quantity of virtual receivers/antennas (a quantity of physical transmitters times a quantity of physical receivers equals a quantity of virtual receivers/antennas).",
"An exemplary MIMO radar system is illustrated in FIG.",
"3 with multiple transmitters 306 connected to multiple transmit antennas 304 and multiple receivers 308 connected to multiple receive antennas 302.Using multiple antennas allows a radar system 300 to determine the angle of objects/targets in the environment.",
"Depending on the geometry of the antenna system 300, different angles (e.g., with respect to the horizontal or vertical) can be determined.",
"The radar system 300 may be connected to a network via an Ethernet connection or other types of network connections 314.The radar system 300 includes memory 310, 312 to store software used for processing the received radio signals to determine range, velocity, and location of objects/targets in the environment.",
"Memory may also be used to store information about objects/targets in the environment.",
"The radar sensing system of the present invention may utilize aspects of the radar systems described in U.S. Pat.",
"Nos.",
"9,753,121; 9,599,702; 9,575,160; 9,689,967; 9,772,397; 9,806,914; 9,791,564; 9,846,228, and/or 9,791,551, and/or U.S. patent application Ser.",
"No.",
"15/492,159, filed Apr.",
"20, 2017, Ser.",
"No.",
"15/496,038, filed Apr.",
"25, 2017, Ser.",
"No.",
"15/496,039, filed Apr.",
"25, 2017, Ser.",
"No.",
"15/598,664, filed May 18, 2017, and/or Ser.",
"No.",
"15/689,273, filed Aug. 29, 2017, and/or U.S. provisional application Ser.",
"No.",
"62/528,789, filed Jul.",
"5, 2017, which are all hereby incorporated by reference herein in their entireties.",
"With MIMO radar systems, each transmitter signal is rendered distinguishable from every other transmitter by using appropriate differences in the modulation, for example, different digital code sequences.",
"Each receiver correlates with each transmitter signal, producing a number of correlated outputs equal to the product of the number of receivers with the number of transmitters.",
"The outputs are deemed to have been produced by a number of virtual receivers, which can exceed the number of physical receivers.",
"In general, if there are N transmitters (T×N) and M receivers (R×M), there will be N×M virtual receivers, one for each transmitter-receiver pair.",
"FIG.",
"4 illustrates a MIMO antenna configuration with three transmitters/antennas: Tx1, Tx2, and Tx3 (410) and three receivers/antennas: Rx1, Rx2, Rx3 (420).",
"Each of the three receivers/antennas receives and processes the signals from each of the three transmitters/antennas resulting in nine virtual receivers/antennas: Vrx1, Vrx2, Vrx3, Vrx4, Vrx5, Vrx6, Vrx7, and Vrx9 (430).",
"The spatial distribution of the virtual receive antennas is given by the spatial convolution of the positions of the transmit and receive antennas.",
"In a preferred radar system of the present invention, there are 1-8 transmitters and 4-8 receivers, or more preferably 4-8 transmitters and 8-16 receivers, and most preferably 16 or more transmitters and 16-64 or more receivers.",
"Two-Dimensional Arrays for Desired Virtual Radar Configurations: In an aspect of the present invention, FIG.",
"5A illustrates an exemplary MIMO antenna configuration 500 that is most efficient in terms of a number of antennas and an antenna board size for a given level of 2D angle capability.",
"The multiple-input, multiple-output (MIMO) configuration illustrated in FIG.",
"5A incorporates 3 transmit antenna elements 510 and N receive antenna elements 520, 530.The antenna elements 510, 520, 530 are placed in a manner that minimizes the physical size of an antenna board needed to synthesize virtual uniform linear receive arrays in both the horizontal and vertical dimensions, with a length equal to twice a physical length of the corresponding receive arrays.",
"The key design features include two uniform linear arrays of receive antennas, one being composed of NH antennas disposed horizontally (520) with spacing ΔH and the other being composed of NV antennas disposed vertically (530) with spacing ΔV, (the total number of receive antennas N=NH+NV) and with corresponding transmit antennas separated by a distance equal to NX ΔX where NX equals the number receive antennas and ΔX equals the spacing between the receive antennas in the corresponding uniform linear receive array.",
"As illustrated in FIG.",
"5A, an exemplary horizontal linear array 520 of receive antenna elements is arranged along one edge of an antenna board, while an exemplary vertical linear array 530 of receive antenna elements is arranged along an adjacent edge of the antenna board.",
"The MIMO virtual array 540 formed by the antenna configuration of FIG.",
"5A is illustrated in FIG.",
"5B.",
"Two uniform virtual linear receive arrays 550, 560 are synthesized, one disposed horizontally (550) with 2NH virtual antennas spaced by ΔH and one disposed vertically (560) with 2NV virtual antennas spaced by ΔV, the number of virtual receive antennas being twice the number of antennas in the corresponding real receive array of FIG.",
"5A.",
"f00551 As described above, MIMO configurations in accordance with the present invention may be arranged that provide 2D angle capability with aperture doubling in both the horizontal and vertical dimensions with only 3 transmit antennas and with placement of the transmit and receive antennas in a manner that minimizes the physical size of the antenna board for the given level of 2D angle capability.",
"The given level of 2D angle capability (and antenna board size) scales by the number of receive antennas incorporated (NH+NV=N) and their spacing (ΔH and DV).",
"The MIMO configuration and virtual receiver arrays illustrated in FIGS.",
"5A and 5B, respectively, provide 2D angle capability via two uniform linear arrays.",
"For target detection and angle measurement, the two linear arrays can be processed independently or combined coherently to form a composite antenna response prior to detection and/or angle measurement.",
"In either case, the virtual receiver array is rather sparse with inherent tradeoffs in 2D angle performance compared to a fully filled 2D array (e.g., with respect to detection of multiple objects at different azimuth or elevation angles or imaging of a single distributed object).",
"The symbols “X” in FIG.",
"5A represent the positions of the phase centers of the respective transmit and receive antennas.",
"The antennas themselves may consist of single or multiple radiators depending on the required gain and beamwidth of the particular MIMO antennas.",
"FIG.",
"8 illustrates an exemplary antenna 810 consisting of three linear arrays of radiators that are arranged as vertical columns of radiators 820.Each of the three vertical columns of radiators consist of three individual radiators 830 connected by feed lines 840.The three vertical columns of radiators are combined into a single antenna port using a three-way power combiner 850.The phase center 860 of the example antenna is indicated by the symbol “X”.",
"In general, each of the various transmit and receive antennas can be of different size and incorporate a different number and/or configuration of radiators.",
"The size of the individual transmit and receive antennas will constrain the minimum spacing between their phase centers (for example, ΔH and ΔV in FIG.",
"5) to be used in the MIMO configuration.",
"The MIMO antennas can be implemented using well known antenna structures and fabrication techniques, including multi-layer printed circuit board antennas with, for example, microstrip feed lines and patch radiators, substrate integrated waveguide (SIW) feed lines and SIW slotted radiators, coplanar waveguide feed lines with SIW slotted radiators, or suitable combinations thereof.",
"Other common types of feed and radiator structures can be used as well.",
"The antenna illustrated in FIG.",
"8 would typically be recognized to represent patch radiators 830 connected by microstrip feed lines 840.In general, to improve radar detection range and/or angle capability, large arrays of antennas are needed leading to increased size and/or cost.",
"The number of antennas in the array can be reduced by spacing the individual antennas by a distance greater than λ/2 (where λ is wavelength of the transmitted radio signal) with the inherent penalty of grating lobes (multiple ambiguous replicas of the mainlobe and/or large radiation side lobes produced by antenna arrays when element spacing is too large).",
"In another aspect of the present invention, FIG.",
"6A illustrates an exemplary MIMO antenna configuration 600 using a linear array of transmit antennas 610 and a linear array of receive antennas 620 with uniform spacing substantially greater than λ/2, yet producing a virtual receive sub-array 630 (illustrated in FIG.",
"6B) with antennas spaced λ/2 apart.",
"For a given number of antennas, this style of MIMO antenna configuration synthesizes a longer virtual receiver array compared to MIMO configurations with transmit and/or receive antennas spaced by λ/2.Furthermore, larger higher-gain antennas can be incorporated compared to MIMO configurations with antennas spaced by λ/2.Benefits of this exemplary style of MIMO configuration that incorporates larger higher-gain antennas in a manner that produces a longer virtual receive array with λ/2 spacing can include enhanced detection range and improved angle capability without introducing grating lobes.",
"The enabling innovation that synthesizes a MIMO virtual receive sub-array with antennas spaced λ/2 while using transmit and receive antennas spaced by greater than λ/2 is uniform spacing of the transmit antennas by an integer multiple of λ/2 and uniform spacing of the receive antennas by a different integer multiple of λ/2.The resulting MIMO virtual receive array may produce a few antennas at either end with a non-uniform spacing greater than λ/2.These antennas with non-uniform spacing can either be discarded or the “holes” (640) in the virtual array can be filled to further extend the length of the uniform virtual linear array 630.A number of different known techniques can be used to fill the holes.",
"These techniques, which include linear prediction methods, fill the resulting holes produced through the non-uniform spacings and extend the length of the portion of the virtual receive sub-array with uniform spacing of virtual antennas via array interpolation techniques.",
"For the MIMO antenna configuration of FIGS.",
"6A and 6B, the length of the resulting virtual receive array 630, and the associated angle capability, scales with the number of transmit and receive antennas incorporated, NTX and NRX respectively, and their respective spacings, (Nλ/2) and (N+/−K) λ/2, respectively.",
"The antennas can be oriented for a desired direction of 1D angle capability (e.g., either horizontally or vertically) or two sets of transmit and receive antennas can be used for 2D angle capability (e.g., one set with horizontal orientation and another set with vertical orientation).",
"In another aspect of the present invention, FIGS.",
"7A and 7B illustrate another MIMO configuration in accordance with the present invention.",
"This particular MIMO configuration combines the MIMO configurations of FIGS.",
"5A and 5B and FIGS.",
"6A and 6B in a manner to further improve 2D angle capability.",
"The exemplary MIMO configuration 700 of FIG.",
"7A is the MIMO configuration of FIG.",
"5A with the addition of the NTX transmit antennas of FIG.",
"6A (610 from FIG.",
"6A shown as 740 in FIG.",
"7A) with the additional constraint that NH horizontally disposed receive antennas are spaced by ΔH=(N+/−K)(λ/2).",
"This exemplary MIMO configuration synthesizes a MIMO virtual receive array 750 composed of several virtual sub-arrays, as illustrated in FIG.",
"7B.",
"Attributes of this exemplary MIMO configuration include a more fully filled (less sparse) 2D virtual receive array (780) compared to the MIMO configuration of FIGS.",
"5A and 5B, aperture doubling in both the horizontal dimension and vertical dimension (virtual receive antennas 760 and 770, respectively) in a manner that minimizes the physical size of the antenna board for a given level of 2D angle capability and a virtual receive sub-array 790 with antennas spaced by λ/2 while using transmit and/or receive antennas spaced by greater than λ/2 (740 and 720, respectively).",
"The various sub-arrays illustrated in FIG.",
"7B can be processed independently for target detection and angle measurement, combined coherently to form a composite antenna response prior to detection and/or angle measurement, or various combinations of the sub-arrays can be processed independently or combined coherently.",
"In any case, the diversity of virtual receive arrays illustrated in FIG.",
"7B improve 2D angle capability in a synergistic manner compared to the MIMO configurations illustrated in FIGS.",
"5A and 5B and FIGS.",
"6A and 6B.",
"For example, the benefit of the more fully filled (less sparse) 2D virtual receive array (780) shown in FIG.",
"7B compared to the 2D array of FIG.",
"5B (550+560) includes improved 2D angle resolution capability with respect to multi-target discrimination (detection of multiple objects at different azimuth or elevation angles) and also with respect to imaging a single distributed object.",
"Further, if the spacings of the transmit antennas and/or receive antennas used to synthesize the 2D virtual receive array are greater than λ/2 (as may be desired to produce a narrow beam), the antennas in the 2D virtual array will likewise be spaced by greater than λ/2 resulting in grating lobes.",
"For the MIMO configuration of FIGS.",
"7A and 7B, the 1D virtual receive sub-array 790 with λ/2 spacing mitigates the horizontal grating lobes of the 2D virtual receive subarray 780 and can also be used in a similar manner to improve upon the horizontal resolution and accuracy of the 2D array (see FIG.",
"7B).",
"The 1D virtual receive array 760 can be used in a similar manner to further improve upon the horizontal resolution and accuracy.",
"The 1D horizontal virtual sub-array 790 with λ/2 spacing of FIG.",
"7B, can be oriented vertically if desired by orienting the transmit antennas 740 of FIG.",
"7A vertically.",
"Alternatively, another set of transmit antennas similar to 740, but oriented vertically, can be added to the MIMO configuration of FIG.",
"7A to produce a 1D vertical virtual sub-array similar to 790 but oriented vertically.",
"For a given MIMO antenna configuration, it's known that interchanging the transmit antennas and the receive antennas will yield the same MIMO virtual receive array.",
"For example, referring to FIGS.",
"5A and 5B, to synthesize the MIMO virtual receive array of FIG.",
"5B, the receive antennas RX1 through RXN could instead be transmit antennas and the transmit antennas TX1 through TX3 could instead be receive antennas.",
"For a given MIMO antenna configuration, it's also know that the virtual receive array is determined by the relative location of the transmit antennas to each other and the relative location of the receive antennas to each other but not the relative location of the transmit antennas to the receive antennas.",
"Hence the position of the set of transmit antennas relative to the position of the set of receive antennas can be adapted as needed to tailor the antenna board dimensions without affecting the resulting MIMO virtual receive array.",
"For example, referring to FIG.",
"5, the set of three transmit antennas 510 can be relocated relative to the set of N receive antennas (520+530) without affecting the MIMO virtual receive array 540.Note, it is known that the MIMO virtual receive array represents the far field response of the MIMO antenna layout.",
"Although the far field response of the MIMO antenna layout is not affected by the relative position of the set of transmit antennas to the set of receive antennas, the near field response is affected and can be determined using ray tracing techniques for the specific layout of the transmit antennas and receive antennas.",
"The 2D MIMO configurations as depicted herein do not necessarily provide symmetrical angle capability in the horizontal and vertical directions.",
"Depending on the application, it may be appropriate to provide asymmetrical angle capability, for example, better angle capability in the horizontal direction compared to the vertical direction.",
"For the 2D MIMO configurations herein, angle capability in a given direction can be adapted by the variable parameters illustrated and/or by suitable orientation of the sets of transmit antennas and receive antennas.",
"In accordance with aspects of the present invention, FIGS.",
"9 through 16 illustrate additional exemplary 2D MIMO configurations with a specific number of transmit (TX) and receive (RX) antennas configured for different horizontal and vertical angle capabilities.",
"An exemplary quantity of TX and RX antennas can vary from 12 TX×16 RX antennas to 24 TX×32 RX antennas with a corresponding quantity of virtual receive (Vrx) antennas from 192 to 768.For each configuration, the vertical angle capability can be tailored based on the vertical spacing parameter ΔV.",
"The above exemplary MIMO antenna configurations include eight exemplary configurations to yield a desired outcome.",
"The quantity of TX, RX, and Vrx antennas involve tradeoffs in angle resolution versus the requirements imposed on the physical size of the antenna board as well as the requirements imposed on the radio frequency (RF) and digital signal processing components and the resulting cost implications.",
"Radar horizontal and vertical angle resolution determine the capability to distinguish (discriminate) multiple closely spaced objects and to image a single distributed object.",
"Horizontal and vertical angle resolution are proportional to the azimuth and elevation beamwidths of the (virtual) receive array and can be further improved via angle super-resolution processing techniques.",
"In the automotive radar frequency band of 77 GHz, the 2D MIMO configurations here-in can yield azimuth and elevation beamwidths from 5.0 to 1.5 deg.",
"while incorporating from 3 TX×8 RX (24 Vrx) antennas to 12 TX×16 RX (192 Vrx) antennas.",
"The corresponding physical size of the antenna board would vary from about 40 mm×40 mm to 100 mm×100 mm.",
"The number of antennas is within the emerging capabilities of low-cost, single chip RFCMOS MMICs now being developed.",
"Automotive radar with azimuth and elevation beamwidth less than 1.5 deg.",
"can be accomplished with 2D MIMO configurations here-in incorporating additional antennas, for example up to 24 TX×32 RX (768 Vrx), at the expense of increased physical size of the antenna board and increased cost of the supporting RF, analog and digital chipset (e.g., the need for multiple RFCMOS MMICs).",
"Angle resolution for the purposes of target imaging is typically on the order of the antenna beamwidth.",
"Using super-resolution signal processing, angle resolution can be improved to on the order of one-half to one-third of the beamwidth.",
"For adequate imaging capability for automotive radar, it is estimated that angle resolution on the order of one to two degrees is needed.",
"For a given angle resolution metric, the radar image quality (object contour quality) will depend on the distribution of radar signal scattering in position and strength along the contour of the object.",
"Thus, embodiments of the present invention provide adequate accuracy and resolution capabilities necessary to support a variety of convenience and safety functions including full speed range adaptive cruise control, forward and side collision warning and avoidance, and automated parking as well as emerging autonomous driving functions including traffic jam pilot and highway pilot up to fully autonomous operation.",
"As discussed herein, the exemplary embodiments incorporate MIMO configurations with uniform spacing of the virtual phase centers as well as sparse array MIMO configurations with non-uniform spacing of the virtual phase centers in both the horizontal and vertical dimensions.",
"Changes and modifications in the specifically described embodiments can be carried out without departing from the principles of the present invention which is intended to be limited only by the scope of the appended claims, as interpreted according to the principles of patent law including the doctrine of equivalents."
]
] |
Patent_15871175
|
[
[
"WRIST STABILIZATION SYSTEMS",
"Devices, systems, and methods for bone stabilization, especially ulna head stabilization.",
"The stabilization system may include a bone plate having an elongated portion extending along a longitudinal axis between a proximal end and a distal end.",
"The bone plate defines a plurality of through holes extending through the elongated portion.",
"A plurality of fasteners are configured to extend through one or more of the plurality of through holes in the bone plate and configured to secure the bone plate to the bone.",
"The proximal end of the elongate portion has an arcuate configuration."
],
[
"1.A stabilization system for stabilizing a bone, the system comprising: a bone plate, the bone plate comprising an elongated portion extending along a longitudinal axis between a proximal end and a distal end, the bone plate comprising a plurality of through holes extending through the elongated portion; and a plurality of fasteners configured to extend through one or more of the plurality of through holes in the bone plate and configured to secure the bone plate to the bone, wherein the proximal end of the elongate portion having an arcuate configuration.",
"2.The stabilization system of claim 1, wherein the arcuate configuration is configured to complement a curvature of an ulna head to which the plate is to be secured.",
"3.The stabilization system of claim 1, wherein the distal end is formed with a chamfer.",
"4.The stabilization system of claim 1, wherein the plurality of through holes includes a polyaxial hole positioned proximate to the proximal end, and the plurality of fasteners include a polyaxial fastener configured to be received in the polyaxial hole, the polyaxial fastener configured to be aimed distally.",
"5.The stabilization system of claim 1, wherein the elongated portion includes a slot for receiving a sliding fastener for provisional alignment of the bone plate.",
"6.The stabilization system of claim 5, wherein the elongated slot allows for proximal-distal and medial-lateral adjustment of the plate.",
"7.The stabilization system of claim 1, wherein the plurality of fasteners include fasteners having self-forming threads on a head portion of the fasteners, which are configured to lock to at least one of the plurality of through holes on the plate.",
"8.The stabilization system of claim 1, wherein the plate further comprises a second plurality of openings configured as k-wire holes to receive one or more k-wires.",
"9.The stabilization system of claim 1, wherein the plate includes a plurality recesses located along the elongated portion between the through holes, and the plurality of recesses are configured to facilitate bending of the plate.",
"10.A stabilization system for stabilizing a bone, the system comprising: a bone plate having an upper surface and a lower surface configured to contact the bone, the bone plate comprising a plurality of through holes extending through the elongated portion, wherein at least one of the through holes is a locking through hole which defines an upper tapered portion extending from the upper surface and a lower tapered portion extending from the lower surface with a deformation area defined between the upper tapered portion and the lower tapered portion; and a plurality of fasteners configured to extend through one or more of the plurality of through holes in the bone plate and configured to secure the bone plate to the bone, wherein at least one of the fasteners includes self-forming threads on a head portion of the fastener which are configured to deform the deformation area and lock to one of the locking through holes on the plate.",
"11.The stabilization system of claim 10, wherein the deformation area has a smooth surface.",
"12.The stabilization system of claim 10, wherein the deformation area includes a textured portion.",
"13.The stabilization system of claim 12, wherein the textured portion includes a windswept cut design comprised of a plurality of shallow cuts where each cut overlaps the next.",
"14.The stabilization system of claim 12, wherein the textured portion includes a plurality of shallow knurled grooves set in a diamond pattern.",
"15.The stabilization system of claim 12, wherein the textured portion includes a plurality of 360° circular swept cuts and a series of triangular cuts.",
"16.The stabilization system of claim 1, wherein the locking through hole is also configured to receive a non-locking fastener.",
"17.A stabilization system for stabilizing a bone, the system comprising: a bone plate having an upper surface and a lower surface configured to contact the bone, wherein the bone plate further has a first portion and a second portion, the second portion extending at an angle relative to the first portion, the first portion of the bone plate comprising an opening for receiving a fixation member; and the second portion of the plate including at least one hook having an arcuate configuration.",
"18.The stabilization system of claim 17, wherein the second portion includes at least two hooks, each having an arcuate configuration.",
"19.The stabilization system of claim 17, wherein the arcuate configuration is configured to complement a curvature of a lunate facet rim to which the plate is configured to be secured.",
"20.The stabilization system of claim 16, wherein the first portion of the plate is configured and dimensioned to be able to slide under a second bone plate."
],
[
"<SOH> BACKGROUND <EOH>Bone fractures are often repaired by internal fixation of the bone, such as diaphyseal bone, using one or more plates.",
"The plate is held against the fractured bone with screws, for example, which engage the bone and heads which provide a compressive force against the plate.",
"The plate and bone are thus forced against each other in a manner that transfers load primarily between a bone contacting surface of the plate and the bone surface to reinforce the fractured bone during healing.",
"This manner of plating generally creates relatively low stress concentration in the bone, as there may be a large contact area between the plate and the diaphyseal bone surface permitting transfer of load to be dispersed.",
"There may be a desire to use locking screws, non-locking screws, or a combination of both that are able to dynamically compress the bone.",
"Of course, the designs of the plates, types of screws, and locking and/or non-locking capabilities may vary based on the location and type of fracture.",
"The three long bones of the upper extremity are the humerus, radius, and ulna.",
"In the case of radial fracture fixation, a volar approach may be suitable for plating certain fracture types.",
"There remains a need, however, for improved plating systems for anatomical articular reduction and stable fixation of the radius."
],
[
"<SOH> SUMMARY <EOH>To meet this and other needs, devices, systems, and methods of bone stabilization are provided, for example, for radius or ulna stabilization.",
"The stabilization systems may include one or more plates and one or more fasteners.",
"Although generally described with reference to the radius or ulna, it will be appreciated that the stabilization systems described herein may be used or adapted to be used for the fixation of other long bones as well, such as the humerus, femur, tibia, etc.",
"According to one embodiment, a stabilization system includes a bone plate and a plurality of fasteners.",
"The bone plate comprises an elongated portion extending along a longitudinal axis, an enlarged head portion, and a transition region connecting the elongated portion to the enlarged head portion, wherein the transition region is curved and connect to an end portion of the enlarged head portion, the bone plate comprising a plurality of through holes extending through the enlarged head portion, the transition region, and the elongated portion.",
"The fasteners are configured to extend through one or more of the plurality of through holes in the bone plate and configured to secure the bone plate to the bone.",
"The fasteners may include locking fasteners (e.g., configured to lock to the plate), non-locking fasteners (e.g., configured to provide dynamic compression of the bone), polyaxial fasteners (e.g., configured to be inserted at a plurality of angles or trajectories), fixed angle fasteners (e.g., configured to be inserted at a fixed angle or trajectory), or any other suitable fasteners known in the art.",
"In some instances, the locking fasteners may include fasteners having self-forming threads on a head portion of the fasteners, which are configured to lock to at least one of the plurality of through holes on the plate.",
"According to another embodiment, a stabilization system configured to stabilize a radius includes a bone plate, a plurality of fixed angle fasteners, a polyaxial fastener, and a fastener.",
"The bone plate comprises an elongated portion extending along a longitudinal axis, an enlarged head portion, and a transition region connecting the elongated portion to the enlarged head portion, wherein the transition region is curved and connect to an end portion of the enlarged head portion, the bone plate comprising a plurality of fixed angle holes positioned in general alignment along the elongated portion, a polyaxial hole positioned proximate to the end portion of the enlarged head portion connected to the transition region, and an elongated slot on the elongated portion.",
"The fixed angle fasteners are configured to be received in the fixed angle holes, the plurality of fixed angle fasteners configured to be aimed at a radio-carpal joint and a distal radio-ulnar joint.",
"The polyaxial fastener is configured to be received in the polyaxial hole, the polyaxial fastener configured to be aimed at a radial styloid.",
"The fastener is configured to be received in the elongated slot, wherein the elongated slot allows for proximal-distal and medial-lateral adjustment of the plate.",
"According to another embodiment, a stabilization system for stabilizing a bone includes a bone plate and a plurality of fasteners.",
"The bone plate has an upper surface and a lower surface configured to contact the bone, wherein the lower surface comprises one or more recesses configured to reduce contact between the plate and a surface of the bone.",
"The bone plate comprises an elongated portion extending along a longitudinal axis, an enlarged head portion, and a transition region connecting the elongated portion to the enlarged head portion, wherein the transition region is connect to an end portion of the enlarged head portion and the other end portion of the enlarged head portion is a free end, the bone plate comprising a plurality of through holes extending through the enlarged head portion, the transition region, and the elongated portion.",
"The plurality of fasteners are configured to extend through one or more of the plurality of through holes in the bone plate and configured to secure the bone plate to the bone.",
"According to another embodiment, the stabilization system may include a bone plate having an elongated portion extending along a longitudinal axis between a proximal end and a distal end.",
"The bone plate defines a plurality of through holes extending through the elongated portion.",
"A plurality of fasteners are configured to extend through one or more of the plurality of through holes in the bone plate and configured to secure the bone plate to the bone.",
"The proximal end of the elongate portion has an arcuate configuration.",
"According to another embodiment, the stabilization system may include a bone plate having an upper surface and a lower surface configured to contact the bone.",
"The bone plate includes a plurality of through holes extending through the elongated portion.",
"At least one of the through holes is a locking through hole which defines an upper tapered portion extending from the upper surface and a lower tapered portion extending from the lower surface with a deformation area defined between the upper tapered portion and the lower tapered portion.",
"A plurality of fasteners are configured to extend through one or more of the plurality of through holes in the bone plate and configured to secure the bone plate to the bone.",
"At least one of the fasteners includes self-forming threads on a head portion of the fastener which are configured to deform the deformation area and lock to one of the locking through holes on the plate.",
"According to another embodiment, the stabilization system may include a bone plate having an upper surface and a lower surface configured to contact the bone.",
"The bone plate further has a first portion and a second portion with the second portion extending at an angle relative to the first portion.",
"The first portion of the bone plate includes an opening for receiving a fixation member and the second portion of the plate includes at least one hook having an arcuate configuration.",
"According to yet another embodiment, one or more methods of installing a stabilization system may include aligning a bone plate against the volar side of the radial bone, and inserting one or more fasteners through the bone plate and into the bone to stabilize the radius and repair the fracture.",
"Also provided are kits for the stabilization systems including bone plates of varying sizes and orientations, fasteners including locking fasteners, non-locking, compression fasteners, polyaxial fasteners, fixed angle fasteners, or any other suitable fasteners, drill guides, k-wires, and other components for installing the same."
],
[
"CROSS REFERENCE TO RELATED APPLICATIONS The present application is a continuation-in-part of U.S. patent application Ser.",
"No.",
"15/456,642, filed Mar.",
"13, 2017, which is a continuation-in-part of U.S. patent application Ser.",
"No.",
"15/238,773, filed on Aug. 17, 2016.This application also claims the benefit of U.S.",
"Provisional Application Ser.",
"No.",
"62/554,700, filed on Sep. 6, 2017.The contents of each of these applications are incorporated herein by reference in their entirety for all purposes.",
"FIELD The present disclosure relates to surgical devices and stabilization systems, for example, for trauma applications, and more particularly, for stabilization of distal radius and ulna fractures.",
"BACKGROUND Bone fractures are often repaired by internal fixation of the bone, such as diaphyseal bone, using one or more plates.",
"The plate is held against the fractured bone with screws, for example, which engage the bone and heads which provide a compressive force against the plate.",
"The plate and bone are thus forced against each other in a manner that transfers load primarily between a bone contacting surface of the plate and the bone surface to reinforce the fractured bone during healing.",
"This manner of plating generally creates relatively low stress concentration in the bone, as there may be a large contact area between the plate and the diaphyseal bone surface permitting transfer of load to be dispersed.",
"There may be a desire to use locking screws, non-locking screws, or a combination of both that are able to dynamically compress the bone.",
"Of course, the designs of the plates, types of screws, and locking and/or non-locking capabilities may vary based on the location and type of fracture.",
"The three long bones of the upper extremity are the humerus, radius, and ulna.",
"In the case of radial fracture fixation, a volar approach may be suitable for plating certain fracture types.",
"There remains a need, however, for improved plating systems for anatomical articular reduction and stable fixation of the radius.",
"SUMMARY To meet this and other needs, devices, systems, and methods of bone stabilization are provided, for example, for radius or ulna stabilization.",
"The stabilization systems may include one or more plates and one or more fasteners.",
"Although generally described with reference to the radius or ulna, it will be appreciated that the stabilization systems described herein may be used or adapted to be used for the fixation of other long bones as well, such as the humerus, femur, tibia, etc.",
"According to one embodiment, a stabilization system includes a bone plate and a plurality of fasteners.",
"The bone plate comprises an elongated portion extending along a longitudinal axis, an enlarged head portion, and a transition region connecting the elongated portion to the enlarged head portion, wherein the transition region is curved and connect to an end portion of the enlarged head portion, the bone plate comprising a plurality of through holes extending through the enlarged head portion, the transition region, and the elongated portion.",
"The fasteners are configured to extend through one or more of the plurality of through holes in the bone plate and configured to secure the bone plate to the bone.",
"The fasteners may include locking fasteners (e.g., configured to lock to the plate), non-locking fasteners (e.g., configured to provide dynamic compression of the bone), polyaxial fasteners (e.g., configured to be inserted at a plurality of angles or trajectories), fixed angle fasteners (e.g., configured to be inserted at a fixed angle or trajectory), or any other suitable fasteners known in the art.",
"In some instances, the locking fasteners may include fasteners having self-forming threads on a head portion of the fasteners, which are configured to lock to at least one of the plurality of through holes on the plate.",
"According to another embodiment, a stabilization system configured to stabilize a radius includes a bone plate, a plurality of fixed angle fasteners, a polyaxial fastener, and a fastener.",
"The bone plate comprises an elongated portion extending along a longitudinal axis, an enlarged head portion, and a transition region connecting the elongated portion to the enlarged head portion, wherein the transition region is curved and connect to an end portion of the enlarged head portion, the bone plate comprising a plurality of fixed angle holes positioned in general alignment along the elongated portion, a polyaxial hole positioned proximate to the end portion of the enlarged head portion connected to the transition region, and an elongated slot on the elongated portion.",
"The fixed angle fasteners are configured to be received in the fixed angle holes, the plurality of fixed angle fasteners configured to be aimed at a radio-carpal joint and a distal radio-ulnar joint.",
"The polyaxial fastener is configured to be received in the polyaxial hole, the polyaxial fastener configured to be aimed at a radial styloid.",
"The fastener is configured to be received in the elongated slot, wherein the elongated slot allows for proximal-distal and medial-lateral adjustment of the plate.",
"According to another embodiment, a stabilization system for stabilizing a bone includes a bone plate and a plurality of fasteners.",
"The bone plate has an upper surface and a lower surface configured to contact the bone, wherein the lower surface comprises one or more recesses configured to reduce contact between the plate and a surface of the bone.",
"The bone plate comprises an elongated portion extending along a longitudinal axis, an enlarged head portion, and a transition region connecting the elongated portion to the enlarged head portion, wherein the transition region is connect to an end portion of the enlarged head portion and the other end portion of the enlarged head portion is a free end, the bone plate comprising a plurality of through holes extending through the enlarged head portion, the transition region, and the elongated portion.",
"The plurality of fasteners are configured to extend through one or more of the plurality of through holes in the bone plate and configured to secure the bone plate to the bone.",
"According to another embodiment, the stabilization system may include a bone plate having an elongated portion extending along a longitudinal axis between a proximal end and a distal end.",
"The bone plate defines a plurality of through holes extending through the elongated portion.",
"A plurality of fasteners are configured to extend through one or more of the plurality of through holes in the bone plate and configured to secure the bone plate to the bone.",
"The proximal end of the elongate portion has an arcuate configuration.",
"According to another embodiment, the stabilization system may include a bone plate having an upper surface and a lower surface configured to contact the bone.",
"The bone plate includes a plurality of through holes extending through the elongated portion.",
"At least one of the through holes is a locking through hole which defines an upper tapered portion extending from the upper surface and a lower tapered portion extending from the lower surface with a deformation area defined between the upper tapered portion and the lower tapered portion.",
"A plurality of fasteners are configured to extend through one or more of the plurality of through holes in the bone plate and configured to secure the bone plate to the bone.",
"At least one of the fasteners includes self-forming threads on a head portion of the fastener which are configured to deform the deformation area and lock to one of the locking through holes on the plate.",
"According to another embodiment, the stabilization system may include a bone plate having an upper surface and a lower surface configured to contact the bone.",
"The bone plate further has a first portion and a second portion with the second portion extending at an angle relative to the first portion.",
"The first portion of the bone plate includes an opening for receiving a fixation member and the second portion of the plate includes at least one hook having an arcuate configuration.",
"According to yet another embodiment, one or more methods of installing a stabilization system may include aligning a bone plate against the volar side of the radial bone, and inserting one or more fasteners through the bone plate and into the bone to stabilize the radius and repair the fracture.",
"Also provided are kits for the stabilization systems including bone plates of varying sizes and orientations, fasteners including locking fasteners, non-locking, compression fasteners, polyaxial fasteners, fixed angle fasteners, or any other suitable fasteners, drill guides, k-wires, and other components for installing the same.",
"BRIEF DESCRIPTION OF THE DRAWINGS A more complete understanding of the present invention, and the attendant advantages and features thereof, will be more readily understood by reference to the following detailed description when considered in conjunction with the accompanying drawings wherein: FIGS.",
"1A-1K depict stabilization systems according to embodiments including volar distal radius bone plates and a plurality of bone fasteners; FIG.",
"2 is a top perspective view of two fasteners engaged with combination holes according to an embodiment; FIG.",
"3 is a close-up view of an alternative version of a combination hole according to another embodiment; FIGS.",
"4A-4C show a perspective view, top view, and cross-section view, respectively, of an another embodiment of a combination hole; FIGS.",
"5A-5C show a perspective view, top view, and cross-section view, respectively, of an another embodiment of a combination hole; FIGS.",
"6A-6C show a perspective view, top view, and cross-section view, respectively, of an another embodiment of a hole for receiving a fastener; FIGS.",
"7A-7C show a perspective view, top view, and cross-section view, respectively, of an another embodiment of a combination hole; FIGS.",
"8A-8C show a perspective view, top view, and cross-section view, respectively, of an another embodiment of separate locking and non-locking holes; FIGS.",
"9A-9D show a perspective view, a top view, a cross-section view, and a perspective view with a locking fastener, respectively, according to another embodiment of a plate including three overlapping locking and non-locking holes; FIGS.",
"10A-10B show perspective views of a plate according to another embodiment with locking and non-locking functionality; FIGS.",
"11A-11E shows alternative locking screw and openings in plates according to yet another embodiment; FIGS.",
"12A and 12B depict a perspective view and cross-section view of an alternative version of a plate with blocking screws; FIGS.",
"13A and 13B depict a fastener according to another embodiment with self-forming threads configured to form threads in the opening of a plate; FIG.",
"13C illustrates an opening in a plate which is usable with the fastener; FIGS.",
"14A and 14B depict an opening in a plate according to one embodiment having a windswept cut configured to receive the self-forming threads of the fastener of FIGS.",
"13A-13B; FIGS.",
"15A and 15B depict an opening in a plate according to another embodiment having a knurled cut configured to receive the self-forming threads of the fastener of FIGS.",
"13A-13B; FIGS.",
"15C and 15D depict an opening in a plate according to another embodiment having triangular cuts configured to receive the self-forming threads of the fastener of FIGS.",
"13A-13B; FIGS.",
"16A and 16B depict an opening in a plate according to another embodiment having a polygonal cut configured to receive the self-forming threads of the fastener of FIGS.",
"13A-13B; FIG.",
"17A depicts an alternative opening in a plate according to another embodiment; FIG.",
"17B depicts another alternative opening in a plate according to yet another embodiment; FIGS.",
"18A-18D depict a plate assembly according to one embodiment where a locking or non-locking fastener may be positioned at an angle or perpendicular to the plate; FIG.",
"19 depicts a stabilization system according to one embodiment including a volar distal radius dia-meta bone plate; FIG.",
"20 depicts a stabilization system according to one embodiment including an acute dorsal bone plate.",
"FIG.",
"21 is a cross sectional view of the dorsal bone plate of FIG.",
"20; FIG.",
"22 depicts a stabilization system according to one embodiment including an oblique dorsal bone plate; FIG.",
"23 depicts dorsal bone plates of FIGS.",
"20 and 22 with fixation screws; FIG.",
"24 is a close up view of a portion of the dorsal bone plates of FIGS.",
"20 and 22; FIG.",
"25 depicts a stabilization system according to one embodiment including a lateral bone plate; FIG.",
"26 is a cross sectional view of the lateral bone plate of FIG.",
"25; FIG.",
"27 depicts the lateral bone plate of FIG.",
"25 with fixation screws; FIG.",
"28 depicts a stabilization system according to one embodiment including a bridge bone plate; FIG.",
"29 depicts a stabilization system according to one embodiment including a lunate facet hook plate; FIG.",
"30 depicts the lunate facet hook plate of FIG.",
"29 with a fixation screw; FIG.",
"31 depicts the volar distal radius plate of FIG.",
"1 used with the lunate facet hook plate of FIG.",
"30; FIG.",
"32 depicts an alternative stabilization system including a lunate facet hook plate; FIG.",
"33 depicts the volar distal radius plate of FIG.",
"1 used with the lunate facet hook plate of FIG.",
"32; FIGS.",
"34A-34E depict an illustrative method of installing the lunate facet hook plate of FIG.",
"32; FIGS.",
"35A-35E depict an illustrative method of installing the lunate facet hook plate of FIG.",
"32 with the volar distal radius plate of FIG.",
"1; FIGS.",
"36A-36B depict another illustrative method of installing the lunate facet hook plate of FIG.",
"32 with the volar distal radius plate of FIG.",
"1; FIGS.",
"37 and 38 depict a lunate facet hook plate reduction instrument; FIGS.",
"39 and 40 depict a backpack drill guide for use with at least the volar distal radius plates of FIG.",
"1; FIGS.",
"41A and 41B depict a stabilization system according to one embodiment including a neck and head bone plate; and FIGS.",
"42A and 42B depict an illustrative method of installing the bone plate of FIGS.",
"41A and 41B.",
"DETAILED DESCRIPTION Embodiments of the disclosure are generally directed to devices, systems, and methods for bone stabilization, especially radius stabilization.",
"Specifically, embodiments are directed to volar distal radius stabilization systems including a bone plate configured to sit against the volar side of the radial bone.",
"The fasteners may be configured to secure the bone plate to the radius.",
"Still other embodiments are directed to different types of holes and fasteners configured to provide locking and/or compression to the bone.",
"The bone plate may be comprised of titanium, stainless steel, cobalt chrome, carbon composite, plastic or polymer—such as polyetheretherketone (PEEK), polyethylene, ultra high molecular weight polyethylene (UHMWPE), resorbable polylactic acid (PLA), polyglycolic acid (PGA), combinations or alloys of such materials or any other appropriate material that has sufficient strength to be secured to and hold bone, while also having sufficient biocompatibility to be implanted into a body.",
"Similarly, the fasteners may be comprised of titanium, cobalt chrome, cobalt-chrome-molybdenum, stainless steel, tungsten carbide, combinations or alloys of such materials or other appropriate biocompatible materials.",
"Although the above list of materials includes many typical materials out of which bone plates and bone fasteners are made, it should be understood that the bone plates and fasteners comprised of any appropriate material are contemplated.",
"The embodiments of the disclosure and the various features and advantageous details thereof are explained more fully with reference to the non-limiting embodiments and examples that are described and/or illustrated in the accompanying drawings and detailed in the following description.",
"The features of one embodiment may be employed with other embodiments as the skilled artisan would recognize, even if not explicitly stated herein.",
"Descriptions of well-known components and processing techniques may be omitted so as to not unnecessarily obscure the embodiments of the disclosure.",
"The examples used herein are intended merely to facilitate an understanding of ways in which the disclosure may be practiced and to further enable those of skill in the art to practice the embodiments of the disclosure.",
"Accordingly, the examples and embodiments herein should not be construed as limiting the scope of the disclosure, which is defined solely by the appended claims and applicable law.",
"Moreover, it is noted that like reference numerals represent similar features and structures throughout the several views of the drawings.",
"Volar Distal Radius Plate System Referring now to the drawing, FIGS.",
"1A-1K depict embodiments of a volar distal radius stabilization system 100 including a bone plate 110 configured to sit against the volar side of the radial bone and one or more bone fasteners 130 configured to be received in the bone plate 110 and secured to the radius 102.The radius 102 or radial bone is one of the two large bones of the forearm, the other being the ulna.",
"The radius 102 extends from the lateral side of the elbow to the thumb side of the wrist and runs parallel to the ulna, which exceeds it in length and size.",
"Near the wrist, the distal end 104 of the radius 102 is large and of quadrilateral form.",
"Although generally described with reference to the radius 102, it will be appreciated that the stabilization systems described herein may be used or adapted to be used for the fixation of other long bones as well, such as the humerus, femur, tibia, etc.",
"The bone plate 110 extends from a first end 112 configured to be positioned proximate to a shaft portion of radius 102 to a second end 114 configured to be positioned proximate to the distal end 104 of the radius 102.The plate 110 includes a top surface 116 and an opposite, bottom surface 118 configured to contact adjacent bone.",
"The top and bottom surfaces 116, 118 are connected by opposite side surfaces extending from the first to second ends 112, 114 of the plate 110.The bottom surface 118 of the plate 110 includes an anatomic contour configured to follow the best approximation of average distal radial anatomy, flaring up slightly along the radial column and more significantly along the intermediate column of the plate 110.The plate 110 is designed to sit low and have a generally low profile proximal portion.",
"The thickness of the plate 110 may generally be about 2 mm along the shaft and distal intermediate column, tapering to a thickness of 2.5 mm along the distal radial column which allows for the severe angle of the radial styloid fastener.",
"The watershed line of the volar distal radius defines the border between the radiocarpal (RC) joint and the volar surface of the radius 102.A chamfer at the second end 114 on the distal radius column of the plate 110 may help to ensure minimal tendon disruption, for example of the flexor pollicus longus and flexor carpi radialis, by maintaining a lower profile over the tendon sites.",
"The bone plate 110 includes an elongated portion 140 extending along a longitudinal axis L, having a length greater than its width.",
"The elongated portion 140 is configured to contact the shaft of the radius 102.The elongated portion 140 may terminate at the first end 112 with a taper such that it has a width and/or thickness less than the remainder of the elongated portion 140.A transition region 144 may connect the elongated portion 140 to an enlarged head portion 142.The transition region 144 may extend along an axis T which is generally angled relative to the axis L of the elongated portion 140.The transition region 144 may extend at an angle X relative to the elongated portion 140.The angle X of the transition region 144 relative to the elongated portion 140 may range from about 10-60°, about 20-50°, about 30-40°, about 40-50°, or another appropriate angle.",
"The transition region 144 may generally form a curve from the elongated portion 140 to an end of the enlarged head portion 142.The transition region 144 may connect to an end portion of the enlarged head portion 142 and the other end portion of the enlarged head portion 142 may be a free end.",
"In other words, the opposite end portion of the enlarged head portion 142, not connected to the transition region 144, is not connected to any other portion of the plate 110.The free end of the enlarged head portion 142 may be separated a distance from the transition region 144 and the elongated portion 140 of the plate 110.The enlarged head portion 142 or a portion thereof is configured to contact the distal end 104 of the radius 102.The enlarged head portion 142 has a width greater than the width of the elongated portion 140.The enlarged head portion 142 extends along an axis A at an angle Y relative to the transition region 144.The angle Y of the head portion 142 relative to the transition region 144 may range from about 10-60°, about 20-50°, about 30-40°, about 40-50°, or another appropriate angle.",
"Accordingly, the axis A of the enlarged head portion 142 may be transverse to the axis L of the elongated portion 140.In some embodiments, the axis A of the enlarged head portion 142 may be generally perpendicular to the axis L of the elongated portion 140.As best seen in FIG.",
"1C, the bone plates 110 may be available in a variety of lengths and sizes based on the anatomy of the patient.",
"The plates 110 are configured to sit against the volar side of the radial bone 102.The plates 110 are configured in both left and right designs, in a mirrored configuration, in order to address the anatomy of both the left and right arms of the patient.",
"As best seen in FIGS.",
"1I and 1J, the bottom surface 118 of the plate 110 may include a plurality of recesses 119 located along the elongated portion 140 between the fastener openings 120.In the embodiment shown in FIG.",
"1I, the recesses 119 are in the form small partial bores in the lateral surface, which are configured to facilitate bending of the plate 110.The recesses 119 remove material such that the plate 110 shield stress from the fastener openings 120, discouraging hole warping effect during recontouring of the plate 110.The recesses 119 may also provide attachment points for plate placement instrumentation (not shown).",
"In the embodiment shown in FIG.",
"1J, the recesses 119 are in the form of scallop cuts having partially cylindrical valleys cut around a periphery of the bottom surface 118 of the plate 110.This again shields stress from the fastener openings 120 during bending, discouraging hole warping effects while recontouring the plate 110.This also reduces contact between the plate 110 and the bone surface, thereby helping to preserve blood supply to the bone and prevent osteonecrosis.",
"In addition to or in place of the recesses 119, a plurality of dimples, best seen in FIG.",
"1K, may be positioned along the bottom surface 118 of the plate 110 (e.g., along the entire bottom surface 118 or a portion thereof) to further reduce contact between the plate 110 and bone surface, further helping to preserve blood supply and prevent osteonecrosis.",
"The plate 110 includes one or more through openings 120 configured to receive one or more bone fasteners 130.The openings 120 extend through the body of the plate 110 from the top surface 116 to the bottom surface 118.The openings 120 may include cylindrical openings, conical openings, elongated openings, threaded openings, textured openings, non-threaded and/or non-textured openings, and the like.",
"The openings 120 may allow for locking of the fastener 130 to the plate 110 or may allow for movement and dynamic compression of the bone.",
"The plate 110 may comprise any suitable number of openings 120 in any suitable configuration.",
"These openings 120 allow surgeons more flexibility for fastener placement, based on preference, anatomy, and fracture location.",
"Surgeons may have differing opinions as to the number, location, and types of fasteners 130.Further, complexity of fracture location and shape makes having as many locations for fasteners 130 as possible necessary.",
"This design offers surgeons a versatile method to achieve higher accuracy in placement of the fasteners 130.The openings 120 may be configured to receive one or more bone fasteners 130.The fasteners 130 may include locking fasteners, non-locking fasteners, or any other fasteners known in the art.",
"The fasteners 130 may comprise bone screws or the like.",
"The fasteners 130 may also include other fasteners or anchors configured to be secured or engaged with bone, such as nails, spikes, staples, pegs, barbs, hooks, or the like.",
"The fasteners 130 may include fixed and/or variable angle bone screws.",
"The fastener 130 may include a head portion 132 and a shaft portion 134 configured to engage bone.",
"For a locking fastener 130, the shaft portion 134 may be threaded such that the fastener 130 may be threaded into the bone.",
"The head portion 132 may include a textured area, such as threads, around its outer surface sized and configured to engage with the opening 120, for example, and corresponding threads in the opening 120 in order to lock the fastener 130 to the plate 110.In the alternative, for a non-locking fastener 130, the head portion 132 may be substantially smooth to allow for dynamic compression of the bone.",
"In one embodiment, the enlarged head portion 142 of the plate 110 includes a plurality of holes 120A are aligned so that their nominal trajectories follow the articular surfaces of both the radio-carpal joint and the distal radio ulnar-joint.",
"This allows the fasteners 130A to buttress and support the articular surfaces during fracture reconstruction.",
"As shown in the embodiment in FIGS.",
"1A-1C, the plate 110 may have a single row of holes 120A generally in alignment and a secondary hole 120A positioned on the transition region 144.FIG.",
"1C depicts one embodiment of the plate 110 (right most plate 110) having a first, distal row of holes 120A generally in alignment and a second row of holes 120A generally in alignment.",
"The second row of holes 120A may receive fasteners 130A with trajectories converging with the distal row screw trajectories.",
"In an alternative version of the stabilization system 100, shown in FIGS.",
"1D and 1E, the elongated portion 140 directly transitions into the enlarged head portion 142 and the enlarged head portion 142 is increased in dimension in order to receive the second row of the fasteners 130A.",
"The holes 120A may be fixed openings configured to accept fixed angle fasteners 130A that can be secured into the distal end 104 of the radius 102.The screw holes 120A and screw heads 132 may have mating conical threads that lock the screw 130A in both angular and axial alignment to prevent collapse and backout.",
"The fasteners 130A may have predetermined trajectories based on the orientations of the openings 120A.",
"An upper portion of the holes 120A may be tapered 128 to allow for the proper positioning of each of the fasteners 130A.",
"Each of the fasteners 130A may be angled along a different trajectory than the other respective fasteners 130A.",
"Some of the fasteners 130A may have a greater angulation than other respective fasteners 130A.",
"The enlarged head portion of the plate 110 further include a hole 120B configured to receive fastener 130B with a trajectory having the severe angle necessary to reach the tip of the radial styloid.",
"An upper portion of the hole 120B may be tapered 128 and a portion of the plate 110 around the hole 120B may be enlarged or increased in thickness to allow for the proper angle of the fasteners 130B to be achieved.",
"The fastener 130B may be in the form of a polyaxial bone screw, which may be generally larger (e.g., in length and/or diameter) than the other fasteners 130 securing the plate 110 to the bone.",
"The fasteners 130A, 130B are optionally cannulated to allow for precise placement with a k-wire (not shown) if desired by the surgeon.",
"In some embodiments, the fasteners 130A, 130B may include polyaxial screws having self-forming threads that work by displacement of the plate material, which are described in more detail herein.",
"The plate 110 also include one or more holes 120C present along the elongated portion 140 of the plate 110 and configured to accommodate a compression fastener 130C.",
"As best seen in FIG.",
"1G, the holes 120C may offer a sliding slot for proximal-distal adjustment of the plate 110 during provisional placement.",
"The slot 120C may allow for proximal adjustment, distal adjustment, and/or medial-lateral adjustment of the plate 110.This allows surgeons to optimally center the plate position along the bone prior to locking screw insertion.",
"The hole or holes 120C may be elongated along the longitudinal axis L of the elongated portion 140 as well as elongated, relative to the fastener 130C, from lateral side to lateral side.",
"The elongated hole or holes 120C may have varying lengths and/or widths.",
"Preferably, the length is greater than the width of the slot 120C.",
"In the alternative embodiment of the slot 120C′ illustrated in FIG.",
"1H, adjustment markings 125 are provided along each longitudinal side of the slot 120C′.",
"The adjustment markings 125 may include be applied via ink, etching, for example, via laser etching, or other suitable means.",
"The adjustment markings 125 are spaced in increments, for example, equally spaced increments, such as 1 mm increments, to assist with accurate proximal/distal adjustment of the plate 110.The hole 120C may be configured to accommodate non-locking, compression screws 130C, the heads of which have a spherical underside, so the screw 130C may be placed at varying angles.",
"The compression screw 130C can be inserted and preliminarily tightened to secure the plate 110 to the bone.",
"As the screw 130C is inserted eccentrically in to the hole 120C, the screw 130C slides down the slot 120C, displacing the plate 110 and the bone as well.",
"The compression screw 130C may have a shorter length and/or a smaller diameter than the screws 130A and/or 130B.",
"If the plate 110 needs to be adjusted later, the screw 130C can be loosened and the plate 110 can be shifted in the proximal, distal, and/or medial-lateral directions.",
"This slot 120C also accommodates reduction of the radius 102 by inserting a longer compression screw 130C and pulling the bone to the plate 110.The plate 110 may include one or more holes 120D present along the elongated portion 140 of the plate 110 configured to secure the plate 110 to the shaft of the radius 102.The holes 120D may be configured to accommodate fixed and/or variable angle fasteners 130D.",
"For locking fasteners 130D, the screw holes 120D and screw heads 132 may have mating conical threads that lock the screw 130D in both angular and axial alignment to prevent collapse and backout.",
"An upper portion of the holes 120D may be tapered 128, for example, around the perimeter of the hole 120D, to allow for the proper positioning of each of the fasteners 130D.",
"For non-locking fasteners 130D, the head portion 132 may be substantially smooth to allow for dynamic compression of the bone.",
"The plate 110 including head portion 142 and/or the elongated portion 140 may further comprise a plurality of openings 124 configured to receive one or more k-wires (not shown).",
"The k-wire holes 124 may comprise small diameter holes (e.g., having a diameter significantly smaller than the fastener openings 120).",
"The k-wire holes 124 may allow preliminary placement of the plate 110 against the bone and/or to aid in reduction of the fracture.",
"The distal k-wire holes 124 on the head portion 142 may ensure a trajectory to follow the RC joint and provide direction during insertion of the distal locking screws.",
"The proximal k-wire holes in the elongated portion 140 of the plate 110 are arrange between fastener openings 120 and may be angled relative to the surface of the plate 110 to avoid intrusion into areas where instrumentation must pass during screw insertion.",
"In the embodiment shown in FIGS.",
"1D and 1E, the plate 110 may also comprise a window 126.The window 126 may provide visualization of the plate 110 with respect to the radius 102 in the operating environment and on imaging (e.g., fluoroscopy).",
"The window 126 is show as generally an asymmetrical triangle, but it envisioned that the window 126, if present, may be of any suitable shape, size, and dimension.",
"The bone plate 110 may be attached to a proximal humerus to fixate one or more bone fractures or fragments and thereby promote healing of the bone.",
"In one embodiment, the plate 110 further restores the anatomic alignment of the radius 102.The plate 110 may be positioned against the volar side of the radial bone.",
"One or more k-wires may be supplied through the k-wire holes 124 to assist with preliminary placement of the plate 110.Pilot holes may be drilled through the fastener openings 120 to prepare to receive the respective fasteners 130.The fasteners 130A, 130B, 130C, 130D may be positioned through the respective openings 120A, 120B, 120C, 120D and into the radius 102.The fasteners 130 may be affixed to the bone in any suitable order, number, and orientation depending on the anatomy of the bone and the fracture.",
"Alternative Hole Configurations The fixed and variable angle, locking and non-locking openings 120, 220 (e.g., including openings 120A, 120B, 120C, 120D) and respective fasteners 130, 230 (e.g., including 130A, 130B, 130C, 130D) described herein may be substituted with or include one or more of the following openings 20 and/or fasteners 30, 40.The openings 20 and/or fasteners 30, 40 are generally described with reference to a generic plate 10, which may include plate 110, 210, 310, 410, 510, 610, or any other suitable plate design.",
"Referring now to the drawing, FIGS.",
"2-18 depict alternative openings 20 in plate 10.The openings 20 extending through the plate 10 are configured to accept locking fasteners 30, non-locking fasteners 40, or a combination of both locking and non-locking fasteners 30, 40 that are able to dynamically compress the bone and/or affix the plate 10 to the bone.",
"When plating diaphyseal bone, surgeons may use a combination of both locking and non-locking fasteners 30, 40 that are able to dynamically compress bone and to connect the bone and the plate 10.Dynamic compression may also be desirable to create interfragmental compression while tightening the fasteners 30, 40.The plate 10 includes a top surface 16 and an opposite, bottom surface 18 configured to contact adjacent bone.",
"The plate 10 includes one or more through openings 20 configured to receive one or more bone fasteners 30, 40.The openings 20 extend through the body of the plate 10 from the top surface 16 to the bottom surface 18.In the embodiments depicted in FIGS.",
"2-3, for example, the openings 20 may be in the form of a combination opening that has at least two overlapping holes.",
"As shown in FIG.",
"2, the combination opening 20 includes a first hole 22 overlapping a second hole 24.One of the holes 22 may be configured to be the locking hole 22, thereby able to receive and secure the locking fastener 30 to the plate 10, and the other of the holes 24 may be configured to be the dynamic compression hole 24, thereby allowing the non-locking fastener 40 to freely move in the hole 24 and apply dynamic compression.",
"The locking hole 22 may have one or more locking features designed to engage with a locking fastener 30, and the dynamic compression hole 24 may be elongated, for example, along the central longitudinal axis of the plate 10.The screw holes 22, 24 are not constrained to parallel axes.",
"This hole geometry may be used in bone plates 10 to utilize either fixed angle or variable angle locking screws 30 and/or polyaxial non-locking screws 40 that can achieve dynamic compression.",
"These openings 20 allow surgeons more flexibility for fastener placement, based on preference, anatomy, and fracture location.",
"Surgeons may have differing opinions as to whether non-locking or locking screws 30, 40 (or some combination of the two) should be used in diaphyseal bone.",
"Further, complexity of fracture location and shape makes having as many locations for fasteners 30, 40 as possible necessary.",
"This design offers surgeons a versatile method to achieve higher accuracy in placement of locking and/or non-locking screws 30, 40.As best seen in FIG.",
"2, the locking and non-locking fasteners 30, 40 are shown.",
"The locking and non-locking fasteners 30, 40 may include traditional fasteners known in the art.",
"The locking and non-locking fasteners 30, 40 may comprise bone screws or the like.",
"The fasteners 30, 40 may also include other fasteners or anchors configured to be secured or engaged with bone, such as nails, spikes, staples, pegs, barbs, hooks, or the like.",
"The fasteners 30, 40 may include fixed and/or variable angle bone screws.",
"The locking fastener 30 may include a head portion 32 and a shaft portion 34 configured to engage bone.",
"The shaft portion 34 may be threaded such that the fastener 30 may be threaded into the bone.",
"The head portion 32 of the locking fastener 30 includes a textured area 36 around its outer surface sized and configured to engage with the locking hole 22 of the combination opening 20.The textured area 36 may include threads, ridges, bumps, dimples, serrations, or other types of textured areas.",
"As shown, the texture area 36 preferably includes a threaded portion extending substantially from the top of the head portion 32 to the bottom of the head portion 32 proximate to the shaft portion 34.Thus, when the textured area 36 engages the locking hole 22, the locking fastener 30 is thereby locked to the plate 10.The non-locking fastener 40 includes a head portion 42 and a shaft portion 44 configured to engage bone.",
"The shaft portion 44 may be threaded such that the fastener 40 may be threaded into the bone.",
"The head portion 42 of the non-locking fastener 40 is substantially smooth around its outer surface such that is able to slide along the elongated compression hole 24.Thus, the non-locking fastener 30 may be coupled to the plate 10, but not locked thereto to enable dynamic compression of the bone.",
"It will be recognized that the head portions 32, 42 of the fasteners 30, 40 may include a recess configured to receive a driver or the like.",
"The locking hole portion 22 of the combination opening 20 includes a textured portion 26.The textured portion 26 may include threads, ridges, bumps, dimples, serrations, knurls, or other types of textured areas.",
"The textured portion 26 may be of the same type (e.g., mating surfaces) or different from the textured area 36 of the locking fastener 30.As shown, the textured portion 26 is serrated or knurled along an inner portion of the hole 22.The knurled surface may include straight, angled, or crossed lines cut or rolled into the material.",
"In the embodiment shown in FIG.",
"2, the textured portion 26 extends along substantially the entire inner surface of the hole 22.With reference to the embodiment shown in FIG.",
"3, the combination hole 20 is substantially the same as that shown in FIG.",
"2 except that the textured portion 26 the locking hole 22 now includes a thin centralized textured ribbon of material.",
"For example, the textured portion 26 takes up about half or less of the surface area of the hole 22.In this instance, only a portion of the textured area 36 of the head portion 32 of the locking fastener 30 engages with and locks to the textured portion 26 of the hole 22.An upper portion of the hole 22 may be tapered 28, without texturing, for example, to facilitate alignment of the fastener 30 with the opening 20.As shown in FIG.",
"3, this tapered portion 28 is enlarged in area relative to the embodiment in FIG.",
"2.The hole 22 may be configured to receive a fixed or variable angle fastener 30.The hole 22 may be generally conical in shape such that it is wider near the top surface 16 of the plate 10 and narrower toward the bottom surface 18 of the plate 10.The tapered portion 28 and/or the textured area 26 may be conical in shape.",
"In this embodiment, the locking hole 22 is a textured fixed angle conical hole configured to receive locking fastener 30.The textured holes 22 may deform as the fastener head 32 interferes with the textured portion 26 of the hole 22, thereby providing a positive lock between the fastener 30 and the plate 10.The second hole portion 24 of the combination opening 20 may be an elongated dynamic compression hole.",
"The dynamic compression hole 24 may be elongated such that it has a length greater than its width.",
"The hole 24 may be elongated along the longitudinal axis of the plate 10.In the alternative, the hole 24 may be generally cylindrical such that the hole 24 only permits polyaxial movement of the fastener 40.The inner surface of the hole 24 may be substantially smooth such that the non-locking fastener 40 is able to freely pivot and/or slide along the hole 24.This provides for at least two directions of compressive force (e.g., along the longitudinal axis and perpendicular to the longitudinal axis of the plate 10).",
"The head portion 42 of the non-locking fastener 40 may be substantially smooth around its outer surface.",
"The head portion 42 is sized and configured to engage with and be retained within the hole portion 24 of the combination opening 20.The hole 24 may be configured to receive a fixed or variable angle fastener 40.In one embodiment, the hole 24 may be generally conical in shape and/or tapered such that it is wider near the top surface 16 of the plate 10 and narrower toward the bottom surface 18 of the plate 10.In this embodiment, the hole 24 is a smooth variable angle conical hole configured to receive the non-locking fastener 40.The hole 24 may receive the fastener head 42 allowing movement of the fastener 40, for example, in a polyaxial fashion and/or along the length of the hole 22, thereby providing dynamic compression of the bone.",
"Turning now to FIGS.",
"4-7, alternative types of openings 20A-20G, which provide for locking and/or non-locking, dynamic compression are provided.",
"As many of the features of these openings are similar to the combination openings 20 described already for FIGS.",
"2-3, only the different features will be further explained.",
"With reference to FIGS.",
"4A-4C, the combination opening 20A is similar to combination opening 20 except that the dynamic compression hole 24A has the same general diameter as the locking hole 22A, and the locking hole 22A includes a different type of textured portion 26A.",
"In this embodiment, the locking hole 22A has a first diameter D1, and the dynamic compression hole 24A has a second diameter D2.Unlike the elongated hole 24 described earlier, dynamic compression hole 24A has substantially same diameter as the locking hole 22A.",
"Thus, the first and second diameters D1, D2 are substantially the same.",
"The hole 24A may be formed by milling or drilling a sphere out of the plate 10 in the center of the circle with tapers or ramps on either side.",
"The hole 24A is not elongated, but is generally circular and the non-locking fastener 40 will be allowed to translate in the hole 24A because the diameter of the head portion 42 and/or shaft (e.g., bone thread) will be smaller than the size of the hole 24A in the plate 10.With respect to hole 22A, the textured portion 26A of the hole 22A may be in the form of a tapered thread.",
"This tapered thread may generally correspond to a similar tapered thread on the locking fastener 30.This hole 22A also does not include a tapered portion, and the textured portion 26A begins at the intersection with the top surface 16 of the plate 10.This alternative opening 20A also provides for the use of both locking and non-locking fasteners 30, 40 that are able to dynamically compress bone and/or lock the plate 10 to the bone.",
"Turning now to FIGS.",
"5A-5C, the combination opening 20B is similar to other combination openings except that the locking hole 22B includes a different type of textured portion 26B.",
"The textured portion 26B includes a series of alternating recesses and protrusions around a central portion of the hole 22B.",
"The recesses may be in form of a wave of alternating cutouts extending around the inner perimeter of the hole 22B.",
"The textured portion 26B may lock the fastener 30 with a friction fit or may be modified during insertion of the fastener 30 to form a lock in situ.",
"In this embodiment, the locking hole may allow for polyaxial locking.",
"The plate 10 and the locking fastener 30 may be made of dissimilar materials having dissimilar hardness values.",
"For example, the fastener 30 may have a higher hardness (e.g., on the Rockwell scale) relative to the plate 10, which may be formed of a material having a lower relative hardness value.",
"Due to the increased hardness, the head portion 32 of the locking fastener 30 may create a thread in the plate 10 as the fastener 30 is inserted (e.g., threaded) into the hole 22B, thereby locking the fastener 30 to the plate 10.With reference to FIGS.",
"6A-6C, the opening 20C includes locking hole 22C and dynamic compression hole 24C with a more open configuration.",
"The locking portion 22C has a textured portion 26C in the form of a tapered thread.",
"This tapered thread may generally correspond to a similar tapered thread on the locking fastener 30.The opposite portion 24C of the opening 20C is oblong with a ramp 25C milled into the top surface 16 of the plate 10 to allow for dynamic compression.",
"As best seen in FIG.",
"6C, the ramp may be partially spherical in shape and extend from the top surface 16 of the plate 10 and connect to the textured portion 26C.",
"When viewed from above in FIG.",
"6B, the ramp 25C creates a square-like, key-hole, and/or non-hole geometry that sweeps into the tapered threaded locking hole 22C.",
"This alternative opening 20C also provides for the use of both locking and non-locking fasteners 30, 40 that are able to dynamically compress bone and/or lock the plate 10 to the bone.",
"Turning now to FIGS.",
"7A-7C, the opening 20D includes locking hole 22D and dynamic compression hole 24D.",
"These holes 22D, 24D are connected and close together but are not overlapping.",
"The holes 22D, 24D are separated by a small portion or sliver of plate material proximate to the lower portion of the holes 22D, 24D (e.g., at bottom surface 18 of the plate 10 and partially extending between the holes 22D, 24D).",
"The locking portion 22D has a textured portion 26D in the form of a tapered thread.",
"The textured portion 26D extends around almost the entire circumference of the hole 22D except where connected to hole 24D.",
"The dynamic compression hole 24D is elongated and has ramped portions 25D on opposite sides of the hole 24D to receive fastener 40.This configuration allows for a very close population of holes 22D, 24D on the plate 10 while giving structural stability at the holes 22D, 24D.",
"With reference to FIGS.",
"8A-8C, locking hole 22E and dynamic compression hole 24E are adjacent, but separate from one another.",
"The holes 22E, 24E are completely separated from one another by a wall 56 of plate material.",
"The locking portion 22E has a textured portion 26E in the form of a tapered thread extends around the entire perimeter of the hole 22E.",
"The dynamic compression hole 24E is elongated and has ramped portions 25E on opposite sides of the hole 24E.",
"This configuration also allows for a very close population of holes 22E, 24E on the plate 10 while giving options for both locking and/or dynamic compression.",
"Turning now to FIGS.",
"9A-9D, an alternative version of opening 20F is provided.",
"In this embodiment, the hole construct 20F is comprised of at least three overlapping conical threaded holes in the plate 10.The opening 20F includes a first, locking hole 22F, a second hole 24F, and a third hole 23F arranged along a longitudinal axis of the plate 10.The third hole 23F is the mirror image of hole 24F across the first locking hole 22F.",
"The conically threaded holes 22F, 23F, 24F may or may not have parallel axes.",
"Each hole 22F, 23F, 24F may include a textured portion 26F, for example, in the form of one or more threaded portions.",
"Thus, the locking fastener 30 may lock to any of the holes 22F, 23F, 24F.",
"Although each of the holes 22F, 23F, 24F are shown in with the textured portion 26F, it will be appreciated that one or more of the holes 22F, 23F, 24F may have a substantially smooth inner portion instead of the textured portion 26F.",
"The upper part of the hole construct at the first and second ends of the hole 20F each have a ramped feature 25F (e.g., adjacent to holes 23F and 24F) to allow for dynamic compression of the plate 10.In addition, the ramped feature 25F may span the three or more conical holes 22F, 23F, 24F (e.g., around the entire perimeter of the opening 20F).",
"The non-locking compression fasteners 40 may have a major bone thread diameter such that the fastener 40 can translate between overlapping holes 22F, 24F, 23F without interference.",
"As best seen in FIG.",
"9D, the locking fastener 30 may include a textured area 36, for example, in the form of a thread, configured to engage with the textured portion 26F of any of the holes 22F, 23F, 24F.",
"The hole geometry of opening 20F can be applied to bone plates 10 to utilize either fixed angle and/or variable angle locking screws 30 and/or polyaxial non-locking screws 40 that can achieve dynamic compression.",
"This allows surgeons more flexibility for screw placement, based on preference, anatomy, and fracture location.",
"Turning now to FIGS.",
"10A-10B, another embodiment of opening 20G is provided.",
"This opening 20G may be comprised of one elongate hole or slot extending from the top surface 16 to the bottom surface 18 of the plate 10.A locking portion 22G of the opening 20G may include a textured portion 26G having straight machine threads.",
"The threads may extend more than 180 degrees to retain the locking fastener 30.A non-locking portion 24G of the opening 20G may be positioned opposite the locking portion 22G to complete the opening 20G.",
"The upper part of the opening 20G may have one or more ramped features 25G to allow for dynamic compression of the plate 10.The ramp 25G may span along the entire upper perimeter of the elongated slot 20G or a portion thereof.",
"The compression screws 40 may have a major bone thread diameter such that the screws 40 are able to translate along the opening 20G without interference.",
"With reference to FIGS.",
"11A-11E, alternative embodiments of the locking fastener 30 may be used with any plate 10.The head portion 32 of the fastener 30 may include a textured area 36 in the form of a thread, for example, to lock the fastener 30 to the plate 10.The fastener 30 and/or plate 10 may also include one or more mechanisms to prevent back out of the fastener 30 from the plate 10.In FIG.",
"11A, the head portion 32 includes at threaded portion 36A (e.g., having straight threads) that interface with the plate 10 and the top of the head extends larger than the threads.",
"The head portion 32 bottoms out when the fastener 30 is fully inserted and creates preload in the fastener 30, thus locking the fastener 30 rotationally.",
"In FIG.",
"11B, the head portion 32 includes threaded portion 36B.",
"The head portion 32 has a constant major diameter while the minor diameter is tapered.",
"The thread depth may go to zero at the top of the head portion 32 of the screw 30.The first few turns smoothly insert, but as the tapered portion of the male thread engages with the plate 10, interference occurs, jamming and/or locking the screw 30 and preventing backout.",
"In FIG.",
"11C, a screw thread 36C on the head portion 32, similar to the design in FIG.",
"11B, except the minor diameter of the screw 30 stays constant while the major diameter of the head portion 32 gets larger toward the top of the screw 30.A similar jamming and locking mechanism results through tightening of the screw 30 in the plate 10.In FIG.",
"11D, the threaded portion 36D has areas of varying pitch.",
"In particular, a straight screw thread on the head portion 32 of the screw 30 has a similar pitch to that of the plate 10 at the bottom of the head portion 32 of the screw 30.The pitch then increases or decreases towards the top of the head portion 32, which thereby results in jamming of the threads and preventing unwanted backout of the screw 30.In an alternative variation of the concept of FIG.",
"11D, shown in FIG.",
"11E, the opening in the plate 10 is provided with areas of varying pitch while the pitch of the threaded portion 36D remains constant.",
"For example, the head portion 32 may include a straight thread with a constant pitch.",
"The upper surface of the plate 10 may include a thread pitch is similar to that of the screw 10, but towards the bottom surface of the plate 10, the thread pitch would either increase or decrease to lock the screw 30 to the plate 10.Turning now to FIGS.",
"12A and 12B, the plate 10 includes an additional anti-backout feature.",
"In this embodiment, the plate 10 includes cylindrical holes or openings 20H configured to accept either the compression fastener 40 or the locking fastener 30.Each opening 20H may include a ramped portion 25H extending around a portion or the entire perimeter of the opening 20H to allow for dynamic compression with a compression fastener 40.Each opening 20H may include a cylindrical feature to provide angular stability with a locking fastener 30.The opening 20H may also include an angular taper 28 to cause compressive tightening between the locking fastener 30 and the cylindrical opening 20H.",
"Each opening 20H has an accompanying blocking screw 46 that can be actuated to block the fastener 30, 40 from backing out.",
"The blocking screw 46 may extend from a first end at the top surface 16 to a second end at the bottom surface 18 of the plate 10.The first end of the blocking screw 46 may include a recess sized to receive an instrument to rotate the blocking screw 46 from an unblocked position to a blocked position.",
"The blocked position may include a portion of the blocking screw 46 covering a portion of the head portion 42 of the fastener 40, thereby further preventing backout of the fastener 40 from the plate 10.According to yet another embodiment, the plate 10 may include one or more openings 20 configured to receive the locking fastener 30 having self-forming threads that work by displacement of the plate material to lock the fastener 30 to the plate 10.Turning now to FIGS.",
"13-18, the locking fastener 30 and alternative embodiments of the openings 20 in the plate 10 are shown.",
"In these embodiments, the locking mechanism of the fastener 30 (e.g., bone screw) to the internal fixation plate 10 may allow for variable angle screw insertion.",
"The fastener 30 may be inserted within an angular cone where the force required to dislodge the head portion 32 of the fastener 30 is substantially equivalent to the force required when the fastener 30 is inserted perpendicular to the plate 10.The holes or openings 20 in the plate 10 may be shaped such that the fastener 30 may be inserted at different angles.",
"The geometry of the opening 20 is conducive to catching the threads on the head portion 32 of the fastener 30 and to reduce the axial force necessary to initiate the thread formation.",
"The locking mechanism includes a fastener 30 having a head portion 32 with self-forming threads that displace the plate material.",
"The plate 10 may be made of a material softer than the fastener 30 to facilitate displacement.",
"For example, the plate 10 may be comprised of titanium, alloys, polymers, or other materials having a lower material hardness (e.g., Rockwell hardness).",
"The fastener 30 may be made of a harder relative material, for example, comprised of cobalt chrome, tungsten, alloys, or other materials having a higher material hardness.",
"Preferably, the fastener 30 is comprised of a material having a strong, stiff, and high surface hardness which facilitates the thread forming process.",
"The forming mechanism works by displacement of material rather than removal of the material of the plate 10, thereby minimizing fragments or chips which are created from tapping.",
"In FIGS.",
"13A-13B, the locking fastener 30 includes a head portion 32 and a shaft portion 34 configured to engage bone.",
"Although not shown, the shaft portion 34 may be threaded such that the fastener 30 may be threaded into the bone.",
"The head portion 32 may be tapered (e.g., at an angle of about 20°) such that the fit within the opening 20 in the plate 10 becomes tighter as the fastener 30 is advanced in to the bone.",
"The head portion 32 of the locking fastener 30 includes a textured area 36 around its outer surface sized and configured to engage an opening 20 in the plate 10.The textured area 36 may include threads, ridges, bumps, dimples, serrations, or other types of textured areas.",
"As shown, the textured area 36 preferably includes a threaded portion extending substantially from the top of the head portion 32 to the bottom of the head portion 32 proximate to the shaft portion 34.The threads 36 may run generally perpendicular to the conical surface of the head portion 32.The threaded portion 36 is in the form of self-forming threads configured to displace the plate material and create threads in the opening 20 of the plate 10.The threaded portion has an exaggerated sharp thread peak to facilitate cutting or forming of the plate material.",
"Turning now to FIGS.",
"13C-17, alternative versions of the openings 20 are shown before being tapped with the fastener 30.Once the fastener 30 is inserted, these openings 20 are modified based on the self-forming threads.",
"The geometry of the openings 20 are conducive to catching the threads 36 and designed to reduce the axial force necessary to initiate the thread formation.",
"An upper portion of the hole 20 may be tapered 28, for example, with a conical straight tapered surface cut through the top surface 16 of the plate 10 for clearance of the head portion 32 of the fastener 30 during off angle insertion.",
"A lower portion of hole 20 may further be tapered 29, for example, with a conical straight tapered surface cut through the bottom surface 18 of the plate 10 for clearance of the shaft portion 34 during off angle insertion.",
"The upper tapered portion 28 may be larger, for example, with a larger degree of taper than the lower tapered portion 29.For example, the upper tapered portion 28 may have a taper in a range from about 60-90°, 70-80°, or 72-78°, preferably about 70°, 75°, or 80° whereas the lower tapered portion 29 may have a taper in a range from about 50-70°, 55-65°, or 57-63°, preferably about 55°, 60°, or 65°.",
"The upper and/or lowered tapered portions 28, 29 may be substantially conical (e.g., FIGS.",
"14B, 15B, 15C, 16B) or may be segmented with more than one section, such as two separate conical sections having different diameters or degrees of taper (e.g., FIGS.",
"17A and 17B).",
"At the intersection between the upper tapered portion 28 and the lower tapered portion 29, a narrowed central portion, as indicated by the area 31 within the dashed lines of FIG.",
"13C defines the area where thread forming takes place.",
"The area 31 provides a concentric ring of material for material displacement and thread forming.",
"The area 31 may have the untextured surface illustrated in FIG.",
"13C or may have a textured portion 26.As described herein, the textured portion 26 may include threads, ridges, bumps, dimples, serrations, or other types of textured areas.",
"In the embodiment shown in FIGS.",
"14A-14B, the textured portion 26 includes a windswept cut design comprised of a plurality of shallow cuts where each cut overlaps the next.",
"For example, the windswept design may include a plurality of threadlike helical cut sweeps.",
"Each cut has a smooth transition into the inner diameter of the hole 20 (e.g., into the upper and lower tapered portions 28, 29).",
"The windswept cuts provide a positive surface for the self-forming threads to cut into, thereby helping to prevent peeling of the newly formed threads into the plate 10.In FIGS.",
"15A-15D, the textured portion 26 includes a knurled cut design.",
"In the embodiment illustrated in FIGS.",
"15A-15B, a rounded transition between the upper tapered portion 28 and the lower tapered portion 29 (e.g., the two conical cuts) provides a workable surface for the knurling process as well as a surface for the head portion 32 to be able to roll over during off-axis locking.",
"The knurled design may include a plurality of shallow knurled grooves set in a diamond pattern (e.g., about 45°) where each cut overlaps the next.",
"The knurled grooves allow for the self-forming threads to cut more deeply into the material and reduce the necessary axial force to begin the thread forming process.",
"In the embodiment illustrated in FIGS.",
"15C-15D, the area 31 has a textured portion 26 defined by a plurality of 360° circular swept cuts.",
"Additionally, a series of 60° triangular cuts is made at a 17° trajectory from a plane normal to hole axis, with the same number of cuts being applied in both a clockwise and counter-clockwise fashion, creating a pattern on the inside ring of material.",
"The cuts create “plateaus” of material protruding into the hole, as shown.",
"While specific angles are described, the disclosure is not limited to the specific angles.",
"The resultant geometry from the cuts provides positive surfaces to cut into, dramatically reducing the axial force necessary to lock the screw to the plate.",
"As such, the mechanism does not rely on bone purchase to engage the threads in the head of the screw.",
"Secondly, the material removed by the cuts allow the head threads to cut deeper by reducing the amount of material which must be formed, and reducing friction between the screw 30 and plate 10 during the forming process.",
"FIGS.",
"16A-16B depict a polygon form cut design.",
"In this design, there is no textured portion at the transition between the upper tapered portion 28 and the lower tapered portion 29.Instead, the narrowed central region has an overall polygonal form such that the hole 20 is neither cylindrical nor conical.",
"The polygonal shape includes a number of sides with distinct linear section of material and rounded corners around which the form cut is allowed to sweep.",
"For example, the polygonal shape may be substantially hexagonal (6-sided), heptagonal (7-sided), octagonal (8-sided), etc.",
"The hole 20 may also be represented without lobe cuts, as a single concentric ring with the same geometry.",
"In FIG.",
"17A, the upper tapered portion 28 includes a conical straight tapered surface cut for clearance of the head portion 32 of the fastener 30 during off angle insertion.",
"The upper tapered portion 28 is segmented to have an upper area with a larger area relative to a lower area proximate the transition to the lower tapered portion 29 having a narrower diameter.",
"The central area between the upper and lower tapered portions 28, 29, where the thread forming process occurs, includes two peaks or concentric rings of material (e.g., a superficial ring 60 and a deep ring 62) with a groove 27 being locating in between for material removal and thread forming relief.",
"The groove 27 between the rings 60, 62 may be angled, for example, in the range of about 40-80°, about 50-70°, or about 60°.",
"The superficial ring 60 is of a slightly smaller inner diameter than the deep ring 62, as the superficial ring 60 is responsible for supporting a majority of the cantilever loads.",
"The deep ring 62 provides additional fixation and support during off-angle insertion as well as additional support during nominal trajectory insertion.",
"The lower tapered portion 29 includes a straight tapered surface that provides clearance for the shaft 34 of the fastener 30 when inserted off angle.",
"The embodiment of the opening 20 in FIG.",
"17B is similar to FIG.",
"17A, but further includes textured portion 26 in the form of a plurality of helical swept cuts at the transition between the upper tapered portion 28 and the lower tapered portion 29.The shallow helical cuts or windswept cuts may include a series of cuts at a steep pitch.",
"The windswept cuts may be angled, for example, at about 50-70°, or about 60°.",
"The same number of cuts may be made in both a clockwise and counter-clockwise fashion.",
"The cuts may create plateaus of material protruding into the opening 20.The resultant geometry provides positive surfaces for the fastener 30 to cut into, which can dramatically reduce the axial force necessary to lock the fastener 30 to the plate 10.Thus mechanism does not need to rely on bone purchase in order to engage the threads in the head portion 32 of the fastener 30.The material removed during insertion of the fastener 30 allows the self-forming threads to cut deeper by removing material which much be formed and reducing friction between the fastener 30 and the plate 10 during the forming process.",
"FIGS.",
"18A-18D depict a screw-plate assembly.",
"The assembly, in FIG.",
"18C, shows the locking fastener 30 placed at an angle, other than perpendicular, to the upper surface 16 of the plate 10.In FIG.",
"18D, a non-locking fastener 40 is placed generally perpendicular to the plate 10.It will be appreciated that the locking fastener 30 and non-locking fastener 40 may be oriented at any appropriate angle relative to the plate 10.The section view in FIG.",
"18C shows the thread engagement with the plate 10 in which material of the plate 10 is displaced around the threads of the fastener 30.By using the self-forming threads, the fastener 30 is able to be inserted into the plate 10 at variable angles and engages with the plate 10 with one-step locking requiring no additional steps to lock the fastener 30 to the plate 10.The section view in FIG.",
"18D show the compressive, non-locking screw 40 received in the opening 20, without threadedly locking thereto.",
"The non-locking screw 40 may provide for dynamic compression of the bone.",
"Accordingly, the fasteners and openings described herein provide a wide variety of options for the surgeon, thereby providing appropriate locking and/or unlocking capability for dynamic compression depending on the desired treatment of the fracture and the bone.",
"Dia-Meta Volar Distal Radius Plate System FIG.",
"19 depicts embodiments of a dia-meta volar distal radius stabilization system 200 including a bone plate 210 configured to sit against the volar side of the radial bone and one or more bone fasteners are configured to be received in the bone plate 210 and secured to the radius and radial shaft of a bone.",
"Although generally described with reference to the radius and radial shaft, it will be appreciated that the stabilization system 200 described herein may be used or adapted to be used for the fixation of other long bones as well, such as the humerus, femur, tibia, etc.",
"The bone plate 210 extends from a first end 212 configured to be positioned on a shaft portion of radial bone to a second end 214 configured to be positioned proximate to the distal end of the radius.",
"The plate 210 includes a top surface 216 and an opposite, bottom surface 218 configured to contact adjacent bone.",
"The top and bottom surfaces 216, 218 are connected by opposite side surfaces extending from the first to second ends 212, 214 of the plate 210.The bottom surface 218 of the plate 210 includes an anatomic contour configured to follow the best approximation of average distal radial anatomy, flaring up slightly along the radial column and more significantly along the intermediate column of the plate 210.The plate 210 is designed to sit low and have a generally low profile proximal portion.",
"The thickness of the plate 210 may generally be about 2 mm along the shaft and distal intermediate column, tapering to a thickness of 2.5 mm along the distal radial column which allows for the severe angle of the radial styloid fastener.",
"The thickness of the plate 210 may generally increase towards the first end 212 when compared to the second end 214.In addition, the width of the plate 210 proximate the first end 212 and along the elongate portion 240 may be thicker than the width of the plate at the second end 214.The design of plate 210 allows for an easy transition from the second end 214 of the plate 210 to the elongate portion 240 to the first end 212 of the plate 210 to address fractures proximal to the second end of the plate 214 while also providing adequate support in the radial shat of the bone.",
"The second end 214 of the bone plate 210 toward the elongate portion 240 of the bone plate 210 is very similar to the bone plate 110, thus the features and disclosures set forth above relating to the bone plate 110 are equally applicable to bone plate 210 and are incorporated in their entirety herein.",
"Looking at the elongate portion or dia-meta portion 240 of the plate 210, the plate 210 includes one or more through openings 220 configured to receive one or more bone fasteners.",
"The openings 220 extend through the body of the plate 210 from the top surface 216 to the bottom surface 218.The openings 220 may include cylindrical openings, conical openings, elongated openings, threaded openings, textured openings, non-threaded and/or non-textured openings, and the like.",
"The openings 220 may allow for locking of the fastener to the plate 210 or may allow for movement and dynamic compression of the bone.",
"The plate 210 may comprise any suitable number of openings 220 in any suitable configuration.",
"These openings 220 allow surgeons more flexibility for fastener placement, based on preference, anatomy, and fracture location.",
"Surgeons may have differing opinions as to the number, location, and types of fasteners.",
"Further, complexity of fracture location and shape makes having as many locations for fasteners as possible necessary.",
"This design offers surgeons a versatile method to achieve higher accuracy in placement of the fasteners.",
"The openings 220 may be configured to receive one or more bone fasteners.",
"The fasteners may include locking fasteners, non-locking fasteners, or any other fasteners known in the art.",
"The fasteners may comprise bone screws or the like.",
"The fasteners may also include other fasteners or anchors configured to be secured or engaged with bone, such as nails, spikes, staples, pegs, barbs, hooks, or the like.",
"The fasteners may include fixed and/or variable angle bone screws.",
"The fastener may include a head portion and a shaft portion configured to engage bone.",
"For a locking fastener, the shaft portion may be threaded such that the fastener may be threaded into the bone.",
"The head portion may include a textured area, such as threads, around its outer surface sized and configured to engage with the opening 220, for example, and corresponding threads in the opening 220 in order to lock the fastener to the plate 210.In the alternative, for a non-locking fastener, the head portion may be substantially smooth to allow for dynamic compression of the bone.",
"The plate 210 may further comprise a plurality of openings 224 configured to receive one or more k-wires (not shown).",
"The k-wire holes 224 may comprise small diameter holes (e.g., having a diameter significantly smaller than the fastener openings 220).",
"The k-wire holes 224 may allow preliminary placement of the plate 210 against the bone and/or to aid in reduction of the fracture.",
"The distal k-wire holes 224 on the head portion 242 may ensure a trajectory to follow the RC joint and provide direction during insertion of the distal locking screws.",
"The proximal k-wire holes in the elongated portion 240 of the plate 210 are arrange between fastener openings 220 and may be angled relative to the surface of the plate 210 to avoid intrusion into areas where instrumentation must pass during screw insertion.",
"Dorsal Plate System FIGS.",
"20-24 depict embodiments of a dorsal stabilization system 300 including bone plates 310, 410 which are configured to sit against the dorsal portion of bone.",
"One or more bone fasteners 320C are configured to be received in the bone plates 310, 410 to secure the plates 310, 410 to the dorsal portion of a bone.",
"Although generally described with reference to the dorsal portion of bone, it will be appreciated that the stabilization system 300 described herein may be used or adapted to be used for the fixation of other bones as well, such as other portions of the identified bones.",
"It should be noted that the same reference numerals are being used for plates 310, 410 because the plates are similar except for their respective first ends 312 which show different opening 320 configurations.",
"FIG.",
"20 shows an acute configuration and FIG.",
"22 shows an oblique configuration.",
"As shown in FIGS.",
"20-22, the plates 310, 410 each have a body that extends from a first end 312 to a second end 314.The plates 310, 410 each include a top surface 316 and an opposite, bottom surface 318 configured to contact adjacent bone.",
"The top and bottom surfaces 316, 318 are connected by opposite side surfaces extending from the first to second ends 312, 314 of the plate 310.Although the plate 310, 410 are shown having a generally longitudinal body, it will be appreciated that any suitable shape and contouring of the plates may be provided depending on the location and type of fracture to be plated.",
"The bone plates 310, 410 include one or more openings 320.The openings 320 extend through the plate 310, 410 from the upper surface 316 to the bottom surface 318 and are configured to accept locking fasteners and non-locking fasteners 320C.",
"When using the plates 310, 410 with bone, surgeons may use only locking, only non-locking or a combination of both locking and non-locking fasteners to connect the bone and the plates 310, 410.The openings 320 may be in the form of any of the openings discussed above with respect to the volar distal radial plate system, the dia-meta plate system, and the alternative hole configurations.",
"The plates 310, 410 also include one or more slots 320C present along the elongated portion 340 of the plates 310, 410 and configured to accommodate a sliding fastener 322C, shown in FIGS.",
"23 and 24.As best seen in FIGS.",
"20-24, the slot 320C may offer a sliding slot for proximal-distal adjustment of the plates 310, 410 during provisional placement.",
"The slot 320C may allow for proximal adjustment, distal adjustment, and/or medial-lateral adjustment of the plates 310, 410.This allows surgeons to optimally center the plate position along the bone prior to locking screw insertion.",
"The slot 320C may be elongated along a longitudinal axis of the elongated portion 340 as well as elongated, perpendicular to the longitudinal axis, from lateral side to lateral side.",
"The elongated slot 320C may have varying lengths and/or widths.",
"Preferably, the length is greater than the width of the slot 320C.",
"The plates 310, 410 may include etch lines adjacent to slot 320C for more accurate adjustment of the plate 310 when being positioned on bone.",
"As best seen in FIGS.",
"20 and 22, plates 310, 410 also may include a plurality of side relief cuts or scalloped edging 322 along the length of the plates 310, 410 which allows the plates 310, 410 to be bent, for example, in three dimensions.",
"The side relief cuts or scalloped edges 322 may be in the form of one or more curves having a widened portion along the sides of the plates 310, 410 and a narrowed portion towards the center of the plates 310, 410.The side relief cuts or scalloped edges 322 may be positioned between consecutive openings 320.The plurality of relief cuts or scalloped edges 322 may form a scalloped or wavy profile along the side edges of the plates 310, 410.As a result, the plates 310, 410 are able to be shaped to a multi-contour surface without warping the openings 320.The plates 310, 410 may further comprise a plurality of openings 324 configured to receive one or more k-wires (not shown).",
"The k-wire holes 324 may comprise small diameter holes (e.g., having a diameter significantly smaller than the fastener openings 320).",
"The k-wire holes 324 may allow preliminary placement of the plates 310, 410 against the bone and/or to aid in reduction of the fracture.",
"Lateral Plate FIGS.",
"25-27 depict embodiments of a lateral stabilization system 500 including bone plate 510 which is configured to sit against the lateral portion of bone to address fractures on the side of the radius.",
"One or more bone fasteners 520C are configured to be received in the bone plate 510 to secure the plate 510 to the lateral portion of a radius of a bone.",
"Although generally described with reference to the lateral portion of the radius of the bone, it will be appreciated that the stabilization system 500 described herein may be used or adapted to be used for the fixation of other bones, such as long bones, as well as other portions of the identified bones.",
"The plate 510 has a body that extends from a first end 512 to a second end 514.The plate 510 includes a top surface 516 and an opposite, bottom surface 518 configured to contact adjacent bone.",
"The top and bottom surfaces 516, 518 are connected by opposite side surfaces extending from the first to second ends 512, 514 of the plate 510.Although the plate 510 is shown having a generally longitudinal body, that contours or radius upwardly to accommodate distal radius bony anatomy, it will be appreciated that any suitable shape and contouring of the plates may be provided depending on the location and type of fracture to be plated.",
"The bone plate 510 includes one or more openings 520.The openings 520 extend through the plate 510 from the upper surface 516 to the bottom surface 518 and are configured to accept locking fasteners and non-locking fasteners 520C.",
"When using the plate 510 with bone, surgeons may use only locking, only non-locking or a combination of both locking and non-locking fasteners to connect the bone and the plate 510.The openings 520 may be in the form of any of the openings discussed above with respect to the volar distal radial plate system, the dia-meta plate system, the dorsal plates and the alternative hole configurations.",
"The plate 510 also includes one or more slots 520C present along the elongated portion 540 of the plate 510 and configured to accommodate a sliding fastener 522C, shown in FIG.",
"27.As best seen in FIGS.",
"25-26, the slot 520C may offer a sliding slot for proximal-distal adjustment of the plate 510 during provisional placement.",
"The slot 520C may allow for proximal adjustment, distal adjustment, and/or medial-lateral adjustment of the plate 510.This allows surgeons to optimally center the plate position along the bone prior to locking screw insertion.",
"The slot 520C may be elongated along a longitudinal axis of the elongated portion 540 as well as elongated, perpendicular to the longitudinal axis, from lateral side to lateral side.",
"The elongated slot 520C may have varying lengths and/or widths.",
"Preferably, the length is greater than the width of the slot 520C.",
"The plate 510 may include etch lines adjacent to slot 520C for more accurate adjustment of the plate 510 when being positioned on bone.",
"As best seen in FIGS.",
"25 and 27, plate 510 also may include a plurality of side relief cuts or scalloped edging 522 along a portion of the length of the plate 510 which allows that portion of the plate 510 to be bent, for example, in three dimensions.",
"The side relief cuts or scalloped edges 522 may be in the form of one or more curves having a widened portion along the sides of the plate 510 and a narrowed portion towards the center of the plate 510.The side relief cuts or scalloped edges 522 may be positioned between consecutive openings 520.The plurality of relief cuts or scalloped edges 522 may form a scalloped or wavy profile along the side edges of the plate 510.As a result, a portion of the plate 510 is able to be shaped to a multi-contour surface without warping the openings 520.The plate 510 may further comprise a plurality of openings 524 configured to receive one or more k-wires (not shown).",
"The k-wire holes 524 may comprise small diameter holes (e.g., having a diameter significantly smaller than the fastener openings 520).",
"The k-wire holes 524 may allow preliminary placement of the plate 519 against the bone and/or to aid in reduction of the fracture.",
"Bridge Plate FIG.",
"28 depicts an embodiment of a stabilization system 600 including bone plate 610 which acts as an internal fixator for high energy comminuted distal radius fractures.",
"The plate 610 is placed dorsally and extends from the third or second metacarpal to approximately a third to half way down the radius.",
"One or more bone fasteners are configured to be received in the bone plate 610 to secure the plate 610 to the desired portions of bone.",
"Although generally described with reference to the radius and metacarpals, it will be appreciated that the stabilization system 600 described herein may be used or adapted to be used for the fixation of other bones, such as long bones, as well as other portions of the identified bones.",
"The plate 610 has a body that extends from a first end 612 to a second end 614.The plate 610 includes a top surface 616 and an opposite, bottom surface 618 configured to contact adjacent bone.",
"The top and bottom surfaces 616, 618 are connected by opposite side surfaces extending from the first to second ends 612, 614 of the plate 610.Although the plate 610 is shown having a generally longitudinal body that is generally planar, it will be appreciated that any suitable shape and contouring of the plates may be provided depending on the location and type of fracture to be plated.",
"The bone plate 610 includes one or more openings 620.The openings 620, which are located proximate the first end 612 and the second end 614, extend through the plate 610 from the upper surface 616 to the bottom surface 618 and are configured to accept locking fasteners and non-locking fasteners.",
"When using the plate 610 with bone, surgeons may use only locking, only non-locking or a combination of both locking and non-locking fasteners to connect the bone and the plate 610.The openings 620 may be in the form of any of the openings discussed above with respect to the volar distal radial plate system, the dia-meta plate system, the dorsal plates, the lateral plates and the alternative hole configurations.",
"Lunate Facet Hook Plate FIGS.",
"29-36 depict embodiments of a stabilization system 700 including hook plate 710, 710′ which is designed for fracture patterns that involve the volar ulnar corner of the distal radius.",
"The plate 710, 710′ may be used as a stand-alone stabilization plate, as shown in FIGS.",
"32 and 34 or may be used in combination with a volar distal radius plate 110, as shown in FIGS.",
"31, 33 and 35-36.When the plate 710 is used alone, the hooks 712 of the plate are embedded or tapped into bone to prevent the shifting of the plate in a lateral or medial direction.",
"It is contemplated that there may one, two, or more hooks 712.The plate 710 also includes an opening 720 to receive a fixation screw 714, which may aid in further fixation of the plate 710 the bone and the fracture site.",
"When the plate 710 is used with the volar distal radius plate, the plate 710 is configured and dimensioned such that is can be slidably placed under a pre-positioned volar distal radius plate 110.The opening 720 will align with an opening 120 on the volar distal radius plate 110 such that a fastener will pass through the opening 120 on the volar distal radius plate 110 and the opening 720 on the plate 710.The opening 720 can accept a locking screw or a non-locking screw.",
"Referring to FIGS.",
"32 and 34A-34E, the plate 710′ is similar to the previous embodiment and includes a pair of hooks 712′ extending from the body 716 of the plate 710′ with a transition area 713 therebetween.",
"The hooks 712′ have an arcuate configuration such that the hooks 712′ complement the curvature of the rim of the lunate facet (see FIGS.",
"32 and 34E).",
"The transition area 713 narrows between the elongate body 716 and the hooks 712′.",
"An elongate slot 720 extends through the elongate body 716 and is configured to receive a fixation screw 714.As seen in FIG.",
"34E, the elongate body 716 may have an initial curvature or be bent to complement the contour of the bone 102.Referring to FIGS.",
"34A-34E, an illustrative method of installing the plate 710′ as a stand-alone stabilization plate will be described.",
"As shown in FIG.",
"34A, an inserter 730 is utilized to hold plate 710′ and apply the plate 710′ to the bone 102 with the hooks 712′ positioned over the lunate facet.",
"A tamp 732 is struck with a mallet 734 or the like to tamp the hooks 712′ in or over the facet as shown in FIG.",
"34B.",
"With the plate 710′ in position, a hole is drilled through the slot 720, for example, utilizing a drill 738 with a bit passing through a soft tissue protector 736 as illustrated in FIG.",
"34C.",
"It may be desired to position the hole in a proximal portion of the slot 720.After the hole is drilled, the desired screw length may be determined utilizing a depth gauge or the like (not shown).",
"The desired fixation screw 714 may then be inserted into the hole using a driver 740 or the like, as shown in FIG.",
"34D.",
"Non-locking screws lag the plate 710′ to the bone 102 and help to maintain fracture compression and avoiding last translation of the plate 710′ distally.",
"FIGS.",
"32 and 34E illustrate the final construct of the stabilization plate.",
"Fluoroscopy, as shown in FIG.",
"34E, may be utilized to confirm proper screw 714 placement.",
"Turning to FIGS.",
"35A-35E, a first illustrative method of installing the plate 710′ along with a volar distal radius plate 110 will be described.",
"In this illustrative method, the plate 710′ is positioned prior to the volar plate insertion.",
"Initially, the plate 710′ is positioned relative to the bone 102 and the hooks 712′ are tamped into position in a manner similar to that described with respect to FIGS.",
"34A and 34B.",
"With the plate 710′ in position, a k-wire 742 is inserted through the slot 720 and into the bone 102 as shown in FIG.",
"35A.",
"The volar plate 110 is then positioned such that the k-wire 742 extends through one of the screw holes 120A in the head portion 142 of the volar plate 110 as shown in FIG.",
"35B.",
"The inserter 730 may be utilized to hold and manipulate the volar plate 110.The volar plate 110 is slid along the k-wire 742 such that the volar plate 110 is properly positioned on the bone 102 and is covering the hook plate 710′ as shown in FIG.",
"35C.",
"When positioned correctly, the ulnar-most subchondral locking screw hole 120A aligns with the slot 720 of the hook plate 710′.",
"With the volar plate 110 positioned properly, a fixation screw 714 is inserted through the screw hole 120A and the slot 720 and secured within the bone.",
"FIGS.",
"33 and 35E illustrate the final construct of the stabilization assembly.",
"Fluoroscopy, as shown in FIG.",
"35E, may be utilized to confirm proper screw 714 placement and proper placement of the hook plate 710′.",
"Referring to FIGS.",
"36A and 36B, another illustrative method of installing the plate 710′ along with a volar distal radius plate 110 will be described.",
"In this illustrative method, the volar plate 110 has already been installed and thereafter it is determined that a hook plate 710′ is desired, for example, when an unstable lunate facet fracture is identified after the volar plate fixation.",
"Initially, at least one of the fixation screws securing the head portion of the volar plate 110 is removed (not shown).",
"Thereafter, the elongate body 716 of the hook plate 710′ is slid behind the volar plate 110 and the hooks 712′ are tamped into position as shown in FIG.",
"36A.",
"With the plate 710′ in position, a k-wire 742 is inserted through the slot 720 and into the bone 102 as shown in FIG.",
"35A.",
"The volar plate 110 is then positioned such that the k-wire 742 extends through one of the screw holes 120A in the head portion 142 of the volar plate 110 as shown in FIG.",
"35B.",
"Once the hook plate 710′ positioned properly, a fixation screw 714 is inserted through the screw hole 120A and the slot 720 and secured within the bone as illustrated in FIG.",
"36B.",
"The final construct of the stabilization assembly will be as shown in FIGS.",
"33 and 35E.",
"Again, fluoroscopy, as shown in FIG.",
"35E, may be utilized to confirm proper screw 714 placement and proper placement of the hook plate 710′.",
"FIGS.",
"37 and 28 show a lunate facet hook plate reduction instrument 810.The instrument is capable of being connected to any quick connect handle known in the industry, such as the AO quick-connect handle.",
"The reduction instrument 810 utilizes a two-piece contact surface that is capable of capturing a lunate facet hook plate and releasing the hook plate when it is positioned in the desired location and orientation.",
"FIGS.",
"39 and 40 depict a drill guide 910 that can be attached to second end 114 of the volar distal radius plate 110.The drill guide 910 may include a plurality of cannulated openings 912 which correspond to each of the respective openings 120 in the plate 110.The drill guide 910 openings 912 may be configured in order to drill the pilot holes at the appropriate trajectories for each opening 120, and subsequently receive the respective fasteners at the correct trajectories.",
"The drill guide 910 may also include a plurality of k-wire openings 914 which match with the k-wire openings in the plate 110.The drill guide 910 may be secured to the plate 110 with one or more fasteners or may be secured to the plate 110 through an integrated connection system such as a thumb screw, an interference fit, etc.",
"The fastener may thread into the plate 110 or otherwise temporarily secure the drill guide 910 to the plate 110.The drill guide 910 may be pre-assembled to the plate 110 or may be attached at any other suitable time before or during the surgery.",
"The fastener may be secured, for example, in the operating room, via thumb or hexalobular fastener, to attach the drill guide 910 to the plate 110.After the pilot holes are drilled, the drill guide 910 may then be removed and the fasteners positioned through the respective openings 120.The drill guide 910 may be relatively slim in thickness, for example, not protruding more than 10 mm above the plate 110, to prevent impinging on soft tissue.",
"Neck and Head Plate FIGS.",
"41A and 41B depict an embodiment of a lateral stabilization system 1000 including bone plate 1010 which is configured to treat fractures of the ulnar neck and head.",
"One or more bone fasteners 1030 are configured to be received in the bone plate 1010 to secure the plate 1010 to the neck and head portion of the ulna 102.The plate 1010 has a body that extends from a first end 1012 to a second end 1014.The plate 1010 includes a top surface 1016 and an opposite, bottom surface 1018 configured to contact adjacent bone.",
"The top and bottom surfaces 1016, 1018 are connected by opposite side surfaces extending from the first to second ends 1012, 1014 of the plate 1010.The first end 1012 of the plate 1010 preferably has a chamfer which allows distal placement of the plate 1010.The second end 1014 of the plate 1010 has an arcuate configuration which complements the curvature of the distal portion of the ulna 102.The plate 1010 has a generally longitudinal body, that contours or radius upwardly slightly to accommodate distal radius bony anatomy, however, it will be appreciated that any suitable shape and contouring of the plates may be provided depending on the location and type of fracture to be plated.",
"The bone plate 1010 includes one or more openings 1020.The openings 1020 extend through the plate 1010 from the upper surface 1016 to the bottom surface 1018 and are configured to accept locking fasteners and non-locking fasteners 1030.When using the plate 1010 with bone, surgeons may use only locking, only non-locking or a combination of both locking and non-locking fasteners to connect the bone and the plate 1010.The openings 1020 may be in the form of any of the openings discussed above with respect to the volar distal radial plate system, the dia-meta plate system, the dorsal plates and the alternative hole configurations.",
"The proximal most opening 1020A preferably is a polyaxial screw hole which is angled distally.",
"Such a configuration helps to prevent screw impingement on the articular surface.",
"The plate 1010 also includes one or more slots 1020C present along the elongated portion 1040 of the plate 1010 and configured to accommodate a sliding fastener 1030C.",
"The slot 1020C has a configuration similar to the slot 120C′ illustrated in FIG.",
"1H and may offer a sliding slot for proximal-distal adjustment of the plate 1010 during provisional placement.",
"The slot 1020C may allow for proximal adjustment, distal adjustment, and/or medial-lateral adjustment of the plate 1010.This allows surgeons to optimally center the plate position along the bone prior to locking screw insertion.",
"The slot 1020C may be elongated along a longitudinal axis of the elongated portion 1040 as well as elongated, perpendicular to the longitudinal axis, from lateral side to lateral side.",
"The elongated slot 1020C may have varying lengths and/or widths.",
"Preferably, the length is greater than the width of the slot 1020C.",
"The plate 1010 may include etch lines adjacent to slot 1020C for more accurate adjustment of the plate 1010 when being positioned on bone.",
"As best seen in FIG.",
"41A, plate 1010 also may include a plurality of side relief cuts or scalloped edging 1022 along a portion of the length of the plate 1010 which allows that portion of the plate 1010 to be bent, for example, in three dimensions.",
"The side relief cuts or scalloped edges 1022 may be in the form of one or more curves having a widened portion along the sides of the plate 1010 and a narrowed portion towards the center of the plate 1010.The side relief cuts or scalloped edges 1022 may be positioned between consecutive openings 1020.The plurality of relief cuts or scalloped edges 1022 may form a scalloped or wavy profile along the side edges of the plate 1010.As a result, a portion of the plate 1010 is able to be shaped to a multi-contour surface without warping the openings 1020.The plate 1010 may further comprise a plurality of openings 1024 configured to receive one or more k-wires (not shown).",
"The k-wire holes 1024 may comprise small diameter holes (e.g., having a diameter significantly smaller than the fastener openings 1020).",
"The k-wire holes 1024 may allow preliminary placement of the plate 1010 against the bone and/or to aid in reduction of the fracture.",
"Alternatively, as illustrated in FIG.",
"42A, a drill guide 744 may be utilized to direct a drill bit of a drill 738 through the openings 1020 through the plate 1010.For example, the proximal most opening 1020A and the distal most opening 1020D may be utilized for positioning of k-wires 742 to provisionally hold the plate 1010 in place.",
"The placement of the k-wires 742 may be confirmed utilizing fluoroscopy as illustrate in FIG.",
"42B.",
"According to one embodiment, the ulna plate 1010 may be used for fixation of an unstable ulna following distal radius repair.",
"Using a subcutaneous ulnar approach, the patient's arm may be positioned on a hand table with the elbow flexed.",
"The forearm may be positioned to expose the subcutaneous border of the ulna.",
"A longitudinal incision may be created distally and proximally.",
"The interval between the extensor carpi ulnaris (ECU) and the flexor carpi ulnaris (FCU) may be split to expose the ulnar shaft.",
"The plate 1010 may be applied dorsally if desired.",
"The fracture may be reduced and the reduction may be confirmed, for example, with fluoroscopy.",
"The speed locking drill guide 744 may be used to place k-wires 742 in the distal and proximal screw holes to provisionally hold the plate in position.",
"A hole may be drilled through the center of the positioning slot, and a screw may be positioned therein, thereby allowing for adjustment of the plate 1010 proximal-distal and/or medial-lateral for optimal placement.",
"The remaining screws may be predrilled and placed and the k-wires may be replaced with locking screws.",
"Although the invention has been described in detail and with reference to specific embodiments, it will be apparent to one skilled in the art that various changes and modifications can be made without departing from the spirit and scope of the invention.",
"Thus, it is intended that the invention covers the modifications and variations of this invention provided they come within the scope of the appended claims and their equivalents.",
"It is expressly intended, for example, that all ranges broadly recited in this document include within their scope all narrower ranges which fall within the broader ranges.",
"It is also intended that the components of the various devices disclosed above may be combined or modified in any suitable configuration."
]
] |
Patent_15871183
|
[
[
"METHOD AND SYSTEM FOR ENCRYPTING AND DECRYPTING TWO-DIMENSIONAL CODE MASK",
"The invention provides a method and system for encrypting and decrypting two-dimensional code mask.",
"The method comprises: generating a target two-dimensional code containing a function pattern and an identification, an initial mask pattern and a key by a two-dimensional code generating device; sending the identification, the initial mask pattern and the key to a server by the two-dimensional code generating device;; sending the identification to the server by the two-dimensional code decoding device; receiving the identification by the server; sending the key and the initial mask pattern to the two-dimensional code decoding device by the server according to the identification; receiving by the two-dimensional code decoding device the key and the initial mask pattern sent by the server; and decrypting the encrypted two-dimensional code by the two-dimensional code decoding device according to the key and the initial mask pattern to acquire the target two-dimensional code.",
"The system has high security."
],
[
"1.A method for encrypting and decrypting two-dimensional code mask, characterized by comprising: generating a target two-dimensional code containing a function pattern and an identification, an initial mask pattern and a key by a two-dimensional code generating device; sending the identification and the key to a server by the two-dimensional code generating device; receiving and storing the identification and the key by the server; encrypting the initial mask pattern by the two-dimensional code generating device using the key and then embedding the target two-dimensional code into the encrypted mask pattern so as to acquire an encrypted two-dimensional code; acquiring and decoding the encrypted two-dimensional code by a two-dimensional code decoding device so as to acquire the function pattern and the identification of the two-dimensional code; sending the identification to the server by the two-dimensional code decoding device; receiving the identification by the server; sending the key to the two-dimensional code decoding device by the server according to the identification; receiving by the two-dimensional code decoding device the key sent by the server; generating the initial mask pattern by the two-dimensional code decoding device according to the function pattern and the identification; and decrypting the encrypted two-dimensional code by the two-dimensional code decoding device according to the key and the initial mask pattern so as to acquire the target two-dimensional code.",
"2.A method for encrypting and decrypting two-dimensional code mask, characterized by comprising: generating a target two-dimensional code containing an identification, an initial mask pattern and a key by a two-dimensional code generating device; sending the identification, the initial mask pattern and the key to a server by the two-dimensional code generating device; receiving and storing the identification, the initial mask pattern and the key by the server; encrypting the initial mask pattern by the two-dimensional code generating device using the key and then embedding the target two-dimensional code into the encrypted mask pattern to acquire the encrypted two-dimensional code; acquiring and decoding the encrypted two-dimensional code by a two-dimensional code decoding device so as to acquire the identification; sending the identification to the server by the two-dimensional code decoding device; receiving the identification by the server; sending the key and the initial mask pattern to the two-dimensional code decoding device by the server according to the identification; receiving by the two-dimensional code decoding device the key and the initial mask pattern sent by the server; and decrypting the encrypted two-dimensional code by the two-dimensional code decoding device according to the key and the initial mask pattern to acquire the target two-dimensional code.",
"3.The method for encrypting and decrypting two-dimensional code mask according to claim 1, wherein, the method further comprises establishing a secure channel between the two-dimensional code generating device and the server, specifically comprising: generating a public key pair and a private key pair by the server and sending the public key pair to the two-dimensional code generating device; receiving the public key pair by the two-dimensional code generating device; encrypting an identity ID and a work key by the two-dimensional code generating device using the public key pair and sending the encrypted ID and the encrypted work key to the server; receiving the encrypted ID and the encrypted work key by the server; decrypting the encrypted identity ID and the encrypted work key by the server using the private key pair to acquire the identity ID and the work key.",
"4.The method for encrypting and decrypting two-dimensional code mask according to claim 2, wherein, the method further comprises establishing a secure channel between the two-dimensional code generating device and the server, specifically comprising: generating a public key pair and a private key pair by the server and sending the public key pair to the two-dimensional code generating device; receiving the public key pair by the two-dimensional code generating device; encrypting an identity ID and a work key by the two-dimensional code generating device using the public key pair and sending the encrypted ID and the encrypted work key to the server; receiving the encrypted ID and the encrypted work key by the server; decrypting the encrypted identity ID and the encrypted work key by the server using the private key pair to acquire the identity ID and the work key.",
"5.The method for encrypting and decrypting two-dimensional code mask according to claim 1, wherein, the method further comprises establishing a secure channel between the two-dimensional code decoding device and the server, specifically comprising: generating a public key pair and a private key pair by the server and sending the public key pair to the two-dimensional code decoding device; receiving the public key pair by the two-dimensional code decoding device; encrypting an identity ID and a work key by the two-dimensional code decoding device using the public key pair and sending the encrypted ID and the encrypted work key to the server; receiving the encrypted ID and the encrypted work key by the server; decrypting the encrypted identity ID and the encrypted work key by the server using the private key pair to acquire the identity ID and the work key.",
"6.The method for encrypting and decrypting two-dimensional code mask according to claim 2, wherein, the method further comprises establishing a secure channel between the two-dimensional code decoding device and the server, specifically comprising: generating a public key pair and a private key pair by the server and sending the public key pair to the two-dimensional code decoding device; receiving the public key pair by the two-dimensional code decoding device; encrypting an identity ID and a work key by the two-dimensional code decoding device using the public key pair and sending the encrypted ID and the encrypted work key to the server; receiving the encrypted ID and the encrypted work key by the server; decrypting the encrypted identity ID and the encrypted work key by the server using the private key pair to acquire the identity ID and the work key.",
"7.The method for encrypting and decrypting two-dimensional code mask according to claim 1, wherein, “encrypting the initial mask pattern by the two-dimensional code generating device using the key and then embedding the target two-dimensional code into the encrypted mask pattern to acquire the encrypted two-dimensional code” specifically comprises: encrypting the initial mask pattern by the two-dimensional code generating device using the key to acquire the encrypted mask pattern; performing an exclusive-OR operation on the encrypted mask pattern and the target two-dimensional code by the two-dimensional code generating device to acquire the encrypted two-dimensional code; “decrypting the encrypted two-dimensional code by the two-dimensional code decoding device according to the key and the initial mask pattern to acquire the target two-dimensional code” specifically comprises: encrypting the initial mask pattern by the two-dimensional code decoding device using the key to acquire the encrypted mask pattern; performing an exclusive-OR operation on the encrypted mask pattern and the encrypted two-dimensional code by the two-dimensional code decoding device to acquire the target two-dimensional code.",
"8.The method for encrypting and decrypting two-dimensional code mask according to claim 2, wherein, “encrypting the initial mask pattern by the two-dimensional code generating device using the key and then embedding the target two-dimensional code into the encrypted mask pattern to acquire the encrypted two-dimensional code” specifically comprises: encrypting the initial mask pattern by the two-dimensional code generating device using the key to acquire the encrypted mask pattern; performing an exclusive-OR operation on the encrypted mask pattern and the target two-dimensional code by the two-dimensional code generating device to acquire the encrypted two-dimensional code; “decrypting the encrypted two-dimensional code by the two-dimensional code decoding device according to the key and the initial mask pattern to acquire the target two-dimensional code” specifically comprises: encrypting the initial mask pattern by the two-dimensional code decoding device using the key to acquire the encrypted mask pattern; performing an exclusive-OR operation on the encrypted mask pattern and the encrypted two-dimensional code by the two-dimensional code decoding device to acquire the target two-dimensional code.",
"9.The method for encrypting and decrypting two-dimensional code mask according to claim 1, wherein, the initial mask pattern is consistent with the target two-dimensional code in size, areas of the mask pattern corresponding to the function patterns of the target two-dimensional code are set to be of a light color, and the function patterns of the target two-dimensional code comprise a position detection pattern, a position detection pattern separator, a positioning pattern, a correction pattern, an auxiliary correction pattern and an identification pattern, “encrypting the initial mask pattern by the two-dimensional code generating device using the key” specifically comprises: sequentially skipping the areas of the mask pattern corresponding to the function patterns of the target two-dimension code, extracting bit data of the initial mask pattern to form initial data strings, and recording the position and the number of the skipped areas; encrypting the initial data strings using the key to acquire the encrypted data strings; and sequentially splicing the encrypted data strings and the function areas together to form the encrypted mask pattern according to the position and the number of skipped areas.",
"10.The method for encrypting and decrypting two-dimensional code mask according to claim 2, wherein, the initial mask pattern is consistent with the target two-dimensional code in size, areas of the mask pattern corresponding to the function patterns of the target two-dimensional code are set to be of a light color, and the function patterns of the target two-dimensional code comprise a position detection pattern, a position detection pattern separator, a positioning pattern, a correction pattern, an auxiliary correction pattern and an identification pattern, “encrypting the initial mask pattern by the two-dimensional code generating device using the key” specifically comprises: sequentially skipping the areas of the mask pattern corresponding to the function patterns of the target two-dimension code, extracting bit data of the initial mask pattern to form initial data strings, and recording the position and the number of the skipped areas; encrypting the initial data strings using the key to acquire the encrypted data strings; and sequentially splicing the encrypted data strings and the function areas together to form the encrypted mask pattern according to the position and the number of skipped areas.",
"11.The method for encrypting and decrypting two-dimensional code mask according to claim 1, wherein, the method further comprises: presetting a time threshold and recording a storage duration of the key in the server; not sending the key to the two-dimensional code decoding device by the server, if the storage duration exceeds the time threshold.",
"12.The method for encrypting and decrypting two-dimensional code mask according to claim 2, wherein, the method further comprises: presetting a time threshold and recording a storage duration of the key in the server; not sending the key to the two-dimensional code decoding device by the server, if the storage duration exceeds the time threshold.",
"13.A system for encrypting and decrypting two-dimensional code mask, characterized by comprising: a two-dimensional code generating device, a two-dimensional code decoding device and a server, wherein the two-dimensional code generating device comprises a first generating module, a first sending module, an encrypting module and an embedding module, the two-dimensional code decoding device comprises an acquiring module, a second sending module, a third receiving module, a second generating module and a decrypting module, and the server comprises a first receiving module, a second receiving module and a third sending module; the first generating module is configured for generating a target two-dimensional code containing a function pattern and an identification, an initial mask pattern and a key by the two-dimensional code generating device; the first sending module is configured for sending the identification and the key to the server by the two-dimensional code generating device; the first receiving module is configured for receiving and storing the identification and the key by the server; the encrypting module is configured for encrypting the initial mask pattern by the two-dimensional code generating device using the key and then embedding the target two-dimensional code into the encrypted mask pattern so as to acquire an encrypted two-dimensional code; the acquiring module is configured for acquiring and decoding the encrypted two-dimensional code by the two-dimensional code decoding device to acquire the function pattern and the identification of the two-dimensional code; the second sending module is configured for sending the identification to the server by the two-dimensional code decoding device; the second receiving module is configured for receiving the identification by the server; the third sending module is configured for sending the key to the two-dimensional code decoding device by the server according to the identification; the third receiving module is configured for receiving by the two-dimensional code decoding device the key sent by the server; the second generating module is configured for generating the initial mask pattern by the two-dimensional code decoding device according to the function pattern and the identification; and the decrypting module is configured for decrypting the encrypted two-dimensional code by the two-dimensional code decoding device according to the key and the initial mask pattern to acquire the target two-dimensional code.",
"14.A system for encrypting and decrypting two-dimensional code mask, characterized by comprising: a two-dimensional code generating device, a two-dimensional code decoding device and a server, wherein the two-dimensional code generating device comprises a generating module, a first sending module, an encrypting module and an embedding module, the two-dimensional code decoding device comprises an acquiring module, a second sending module, a third receiving module, and a decrypting module, and the server comprises a first receiving module, a second receiving module and a third sending module; the generating module is configured for generating a target two-dimensional code containing an identification, an initial mask pattern and a key by the two-dimensional code generating device; the first sending module is configured for sending the identification, the initial mask pattern and the key to the server by the two-dimensional code generating device; the encrypting module is configured for encrypting the initial mask pattern by the two-dimensional code generating device using the key; the embedding module is configured for embedding the target two-dimensional code into the encrypted initial mask pattern by the two-dimensional code generating device to acquire the encrypted two-dimensional code after the encrypting the initial mask pattern using the key; the acquiring module is configured for acquiring and decoding the encrypted two-dimensional code by the two-dimensional code decoding device to acquire the identification; the second sending module is configured for sending the identification to the server by the two-dimensional code decoding device; the third receiving module is configured for receiving by the two-dimensional code decoding device the key and the initial mask pattern sent by the server; the decrypting module is configured for decrypting the encrypted two-dimensional code by the two-dimensional code decoding device according to the key and the initial mask pattern to acquire the target two-dimensional code; the first receiving module is configured for receiving and storing the identification, the initial mask pattern and the key by the server; the second receiving module is configured for receiving the identification by the server; and the third sending module is configured for sending the key and the initial mask pattern to the two-dimensional code decoding device by the server according to the identification."
],
[
"<SOH> BACKGROUND OF THE INVENTION <EOH>Two-dimensional code is being more and more widely used.",
"However, at the same time of bringing convenience to people, hidden security risks also gradually arise for the two-dimensional code.",
"For example, incidents such as stealing of cell-phone balance occur from time to time after the two-dimensional code is scanned by the cell-phone Chinese invention patent publication No.",
"CN102243714B discloses a two-dimensional code encrypting system, in which a user terminal device represents a user ID by a first area of a two-dimensional code and represents a user password by a second area of the two-dimensional code; a client computer receives and decodes by the two-dimensional code sent by the user terminal device so as to obtain the ID and the password corresponding to the two-dimensional code, and sends the decoded ID and the password to a management server; the management server verifies whether the received ID and password are consistent with the data stored in a user database, and sends the verification result to the client computer; and the client computer receives the verification result sent by the management server.",
"Although the user ID and the user password are added in the designated areas of the two-dimensional code, the attacker can regenerate or modify the data by intercepting the target two-dimensional code image and reserving the areas where the user ID and password are located, so that the user ID and the password keep the same as the original image.",
"In this situation, the server cannot identify the true from the false, and thus the security attack cannot be tackled.",
"Chinese invention patent publication No.",
"CN103401679B discloses a two-dimensional code encrypting and decoding method, in which the two-dimensional code is encrypted and decoded in a way of symmetric encryption, one two-dimensional code corresponds to one identification; a ciphertext is formed by adding an identification in front of or behind the encrypted original information, and the ciphertext is used to generate a two-dimensional code; the two-dimensional code can be generated only after the original information is encrypted.",
"The two-dimensional code is scanned to obtain the ciphertext composed of the identification and the encrypted original information.",
"There is no protection measure for the encrypting mode database.",
"Once the encrypting mode database is leaked, it can be easily attacked by the attacker."
],
[
"<SOH> SUMMARY OF THE INVENTION <EOH>"
],
[
"CROSS REFERENCE TO RELATED APPLICATIONS The present application is a Continuation Application of PCT Application No.",
"PCT/CN2016/090999 filed on Jul.",
"22, 2016, which claims the benefit of Chinese Patent Application No.",
"201510449982.7 filed on Jul.",
"28, 2015.All the above are hereby incorporated by reference.",
"FIELD OF THE INVENTION The invention relates to the field of two-dimensional code encrypting technology, and in particular, to a method and system for encrypting and decrypting two-dimensional code mask.",
"BACKGROUND OF THE INVENTION Two-dimensional code is being more and more widely used.",
"However, at the same time of bringing convenience to people, hidden security risks also gradually arise for the two-dimensional code.",
"For example, incidents such as stealing of cell-phone balance occur from time to time after the two-dimensional code is scanned by the cell-phone Chinese invention patent publication No.",
"CN102243714B discloses a two-dimensional code encrypting system, in which a user terminal device represents a user ID by a first area of a two-dimensional code and represents a user password by a second area of the two-dimensional code; a client computer receives and decodes by the two-dimensional code sent by the user terminal device so as to obtain the ID and the password corresponding to the two-dimensional code, and sends the decoded ID and the password to a management server; the management server verifies whether the received ID and password are consistent with the data stored in a user database, and sends the verification result to the client computer; and the client computer receives the verification result sent by the management server.",
"Although the user ID and the user password are added in the designated areas of the two-dimensional code, the attacker can regenerate or modify the data by intercepting the target two-dimensional code image and reserving the areas where the user ID and password are located, so that the user ID and the password keep the same as the original image.",
"In this situation, the server cannot identify the true from the false, and thus the security attack cannot be tackled.",
"Chinese invention patent publication No.",
"CN103401679B discloses a two-dimensional code encrypting and decoding method, in which the two-dimensional code is encrypted and decoded in a way of symmetric encryption, one two-dimensional code corresponds to one identification; a ciphertext is formed by adding an identification in front of or behind the encrypted original information, and the ciphertext is used to generate a two-dimensional code; the two-dimensional code can be generated only after the original information is encrypted.",
"The two-dimensional code is scanned to obtain the ciphertext composed of the identification and the encrypted original information.",
"There is no protection measure for the encrypting mode database.",
"Once the encrypting mode database is leaked, it can be easily attacked by the attacker.",
"SUMMARY OF THE INVENTION Technical Problem The technical problem to be solved by the invention is to provide a method and system for encrypting and decrypting two-dimensional code mask with high security.",
"Technical Solution In order to solve the above technical problem, the invention provides the following technical solutions.",
"A method for encrypting and decrypting two-dimensional code mask is provided, which includes: generating a target two-dimensional code containing a function pattern and an identification, an initial mask pattern and a key by a two-dimensional code generating device; sending the identification and the key to a server by the two-dimensional code generating device; receiving and storing the identification and the key by the server; encrypting the initial mask pattern by the two-dimensional code generating device using the key and then embedding the target two-dimensional code into the encrypted mask pattern so as to acquire an encrypted two-dimensional code; acquiring and decoding the encrypted two-dimensional code by a two-dimensional code decoding device so as to acquire the function pattern and the identification of the two-dimensional code; sending the identification to the server by the two-dimensional code decoding device; receiving the identification by the server; sending the key to the two-dimensional code decoding device by the server according to the identification; receiving by the two-dimensional code decoding device the key sent by the server; generating the initial mask pattern by the two-dimensional code decoding device according to the function pattern and the identification; and decrypting the encrypted two-dimensional code by the two-dimensional code decoding device according to the key and the initial mask pattern so as to acquire the target two-dimensional code.",
"The invention has the following advantageous effects: a generating rule of generating the initial mask pattern according to the function pattern of the two-dimensional code and encrypting rules for encrypting the initial mask pattern using the key and encrypting the target two-dimensional code using the encrypted initial mask pattern are pre-stored in the two-dimensional code generating device and the two-dimensional code decoding device, and the identification is used to identify the target two-dimensional code and the key.",
"The generation of the initial mask pattern, the encryption of the initial mask pattern using the key and the encryption of the target two-dimensional code using the encrypted initial mask pattern are performed inside the two-dimensional code generating device and the two-dimensional code decoding device, and only the identification and the key are transmitted between the two-dimensional code generating device and the server as well as between the two-dimensional code decoding device and the server, thus presenting high security and less loads for the server.",
"A method for encrypting and decrypting two-dimensional code mask is provided, which includes: generating a target two-dimensional code containing an identification, an initial mask pattern and a key by a two-dimensional code generating device; sending the identification, the initial mask pattern and the key to a server by the two-dimensional code generating device; receiving and storing the identification, the initial mask pattern and the key by the server; encrypting the initial mask pattern by the two-dimensional code generating device using the key and then embedding the target two-dimensional code into the encrypted mask pattern so as to acquire an encrypted two-dimensional code; acquiring and decoding the encrypted two-dimensional code by a two-dimensional code decoding device so as to acquire the identification; sending the identification to the server by the two-dimensional code decoding device; receiving the identification by the server; sending the key and the initial mask pattern to the two-dimensional code decoding device by the server according to the identification; receiving by the two-dimensional code decoding device the key and the initial mask pattern sent by the server; and decrypting the encrypted two-dimensional code by the two-dimensional code decoding device according to the key and the initial mask pattern so as to acquire the target two-dimensional code.",
"The invention has the following advantageous effects: encrypting rules for encrypting the initial mask pattern using the key and encrypting the target two-dimensional code using the encrypted initial mask pattern are pre-stored in the two-dimensional code generating device and the two-dimensional code decoding device, and the identification is used to identify the target two-dimensional code, the initial mask pattern and the key.",
"The encryption of the initial mask pattern using the key and the encryption of the target two-dimensional code using the encrypted initial mask pattern are performed inside the two-dimensional code generating device and the two-dimensional code decoding device, and only the identification, the initial mask pattern and the key are transmitted between the two-dimensional code generating device and the server as well as between the two-dimensional code decoding device and the server, thus presenting high security.",
"A system for encrypting and decrypting two-dimensional code mask is provided, which includes: a two-dimensional code generating device, a two-dimensional code decoding device and a server, wherein the two-dimensional code generating device includes a first generating module, a first sending module, an encrypting module and an embedding module, the two-dimensional code decoding device includes an acquiring module, a second sending module, a third receiving module, a second generating module and a decrypting module, and the server includes a first receiving module, a second receiving module and a third sending module; the first generating module is configured for generating a target two-dimensional code containing a function pattern and an identification, an initial mask pattern and a key by the two-dimensional code generating device; the first sending module is configured for sending the identification and the key to the server by the two-dimensional code generating device; the first receiving module is configured for receiving and storing the identification and the key by the server; the encrypting module is configured for encrypting the initial mask pattern by the two-dimensional code generating device using the key and then embedding the target two-dimensional code into the encrypted mask pattern so as to acquire an encrypted two-dimensional code; the acquiring module is configured for acquiring and decoding the encrypted two-dimensional code by the two-dimensional code decoding device so as to acquire the function pattern and the identification of the two-dimensional code; the second sending module is configured for sending the identification to the server by the two-dimensional code decoding device; the second receiving module is configured for receiving the identification by the server; the third sending module is configured for sending the key to the two-dimensional code decoding device by the server according to the function pattern information of the two-dimensional code and the identification; the third receiving module is configured for receiving by the two-dimensional code decoding device the key sent by the server; the second generating module is configured for generating an initial mask pattern by the two-dimensional code decoding device according to the function pattern and the identification; and the decrypting module is configured for decrypting the encrypted two-dimensional code by the two-dimensional code decoding device according to the key and the initial mask pattern so as to acquire the target two-dimensional code.",
"The invention has the following advantageous effects: the identification and the key are sent by the two-dimensional code generating device to the server, the identification is sent to the server by the two-dimensional code decoding device, and the key is sent to the two-dimensional code decoding device by the server according to the identification.",
"The generation and encryption of the initial mask pattern and the encryption of the target two-dimensional code are performed inside the two-dimensional code generating device and the two-dimensional code decoding device, and only the identification and the key are transmitted among the two-dimensional code generating device, the server and the two-dimensional code decoding device, thus presenting high security and less loads for the server.",
"The target two-dimensional code corresponding to each identification may be unique, or may also be in batch, which is convenient for use.",
"A system for encrypting and decrypting two-dimensional code mask is provided, which includes: a two-dimensional code generating device, a two-dimensional code decoding device and a server, wherein the two-dimensional code generating device includes a generating module, a first sending module, an encrypting module and an embedding module, the two-dimensional code decoding device includes an acquiring module, a second sending module, a third receiving module, and a decrypting module, and the server includes a first receiving module, a second receiving module and a third sending module; the generating module is configured for generating a target two-dimensional code containing an identification, an initial mask pattern and a key by the two-dimensional code generating device; the first sending module is configured for sending the identification, the initial mask pattern and the key to the server by the two-dimensional code generating device; the encrypting module is configured for encrypting the initial mask pattern by the two-dimensional code generating device using the key; the embedding module is configured for encrypting the initial mask pattern by the two-dimensional code generating device using the key and then embedding the target two-dimensional code into the encrypted mask pattern so as to acquire an encrypted two-dimensional code; the acquiring module is configured for acquiring and decoding the encrypted two-dimensional code by the two-dimensional code decoding device so as to acquire the identification; the second sending module is configured for sending the identification to the server by the two-dimensional code decoding device; the third receiving module is configured for receiving by the two-dimensional code decoding device the key and the initial mask pattern sent by the server; the decrypting module is configured for decrypting the encrypted two-dimensional code by the two-dimensional code decoding device according to the key and the initial mask pattern so as to acquire the target two-dimensional code; the first receiving module is configured for receiving and storing the identification, the initial mask pattern and the key by the server; the second receiving module is configured for receiving the identification by the server; and the third sending module is configured for sending the key and the initial mask pattern to the two-dimensional code decoding device by the server according to the identification.",
"Advantageous Effects The invention has the following advantageous effects: the identification, the initial mask pattern and the key are sent to the server by the two-dimensional code generating device, the identification is sent to the server by the two-dimensional code decoding device, and the initial mask pattern and the key are sent to the two-dimensional code decoding device by the server according to the identification.",
"The encryption of the initial mask pattern and the encryption of the target two-dimensional code are performed inside the two-dimensional code generating device and the two-dimensional code decoding device, and only the identification, the initial mask pattern and the key are transmitted among the two-dimensional code generating device, the server and the two-dimensional code decoding device, thus presenting high security.",
"The target two-dimensional code corresponding to each identification may be unique, or may also be in batch, which is convenient for use.",
"BRIEF DESCRIPTION OF THE ACCOMPANYING DRAWINGS FIG.",
"1 is a flowchart of a method for encrypting two-dimensional code mask according to a first embodiment of the invention; and FIG.",
"2 is a flowchart of a method for encrypting two-dimensional code mask according to a second embodiment of the invention.",
"DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS In order to illustrate the technical solutions, the objects and effects of the invention in detail, embodiments are described below in conjunction with the accompanying drawings.",
"The main concept of the invention lies in that only an identification and a key, or an initial mask pattern are transmitted among a two-dimensional code generating device, a server and a two-dimensional code decoding device with high security.",
"The specific embodiments of the invention are described as follows.",
"Referring to FIG.",
"1, a method for encrypting and decrypting two-dimensional code mask is provided, which includes: generating a target two-dimensional code containing a function pattern and an identification, an initial mask pattern and a key by a two-dimensional code generating device; sending the identification and the key to a server; by the two-dimensional code generating device receiving and storing the identification and the key by the server; encrypting the initial mask pattern by the two-dimensional code generating device using the key and then embedding the target two-dimensional code into the encrypted mask pattern so as to acquire an encrypted two-dimensional code; acquiring and decoding the encrypted two-dimensional code by a two-dimensional code decoding device so as to acquire the function pattern and the identification of the two-dimensional code; sending the identification to the server by the two-dimensional code decoding device; receiving the identification by the server; sending the key to the two-dimensional code decoding device by the server according to the identification; receiving by the two-dimensional code decoding device the key sent by the server; generating the initial mask pattern by the two-dimensional code decoding device according to the function pattern and the identification; and decrypting the encrypted two-dimensional code by the two-dimensional code decoding device according to the key and the initial mask pattern so as to acquire the target two-dimensional code.",
"Referring to FIG.",
"2, a method for encrypting and decrypting two-dimensional code mask is provided, which includes: generating a target two-dimensional code containing an identification, an initial mask pattern and a key by a two-dimensional code generating device; sending the identification, the initial mask pattern and the key to a server by the two-dimensional code generating device; receiving and storing the identification, the initial mask pattern and the key by the server; encrypting the initial mask pattern by the two-dimensional code generating device using the key and then embedding the target two-dimensional code into the encrypted mask pattern so as to acquire an encrypted two-dimensional code; acquiring and decoding the encrypted two-dimensional code by a two-dimensional code decoding device so as to acquire the identification; sending the identification to the server by the two-dimensional code decoding device; receiving the identification by the server; sending the key and the initial mask pattern to the two-dimensional code decoding device by the server according to the identification; receiving by the two-dimensional code decoding device the key and the initial mask pattern sent by the server; and decrypting the encrypted two-dimensional code by the two-dimensional code decoding device according to the key and the initial mask pattern so as to acquire the target two-dimensional code.",
"Further, the method further includes establishing a secure channel between the two-dimensional code generating device and the server, specifically including: generating a public key pair and a private key pair by the server and sending the public key pair to the two-dimensional code generating device; receiving the public key pair by the two-dimensional code generating device; encrypting an identity ID and a work key by the two-dimensional code generating device using the public key pair and sending the encrypted ID and the encrypted work key to the server; receiving the encrypted ID and the encrypted work key by the server; decrypting the encrypted identity ID and the encrypted work key by the server using the private key pair so as to acquire the identity ID and the work key.",
"The work key is used for encrypting and decrypting data transmission between the two-dimensional code generating device and the server so as to establish the secure channel.",
"As can be seen from the above description, the secure channel is established between the two-dimensional code generating device and the server by means of a public key pair, a private key pair and a work key, the identity ID and the work key transmitted between the two-dimensional code generating device and the server are encrypted using the public key pair, and the private key pair is necessary for the decryption of the encrypted identity ID and the encrypted work key.",
"Therefore, even if the attacker intercepts the encrypted identity ID and the encrypted work key and knows the public key, it would also be very difficult to decrypt the encrypted identity ID and the encrypted work key, thus presenting high security.",
"Further, the method further includes establishing a secure channel between the two-dimensional code decoding device and the server, specifically including: generating a public key pair and a private key pair by the server and sending the public key pair to the two-dimensional code decoding device; receiving the public key pair by the two-dimensional code decoding device; encrypting an identity ID and a work key by the two-dimensional code decoding device using the public key pair and sending the encrypted identity ID and the encrypted work key to the server; receiving the encrypted identity ID and the encrypted work key by the server; decrypting the encrypted identity ID and the encrypted work key by the server using the private key pair so as to acquire the identity ID and the work key.",
"The work key is used for encrypting and decrypting data transmission between the two-dimensional code decoding device and the server so as to establish the secure channel.",
"As can be seen from the above description, the secure channel is established between the two-dimensional code decoding device and the server by means of a public key pair, a private key pair and a work key, the identity ID and the work key transmitted between the two-dimensional code decoding device and the server are encrypted using the public key pair, and the private key pair is necessary for the decryption of the encrypted identity ID and the encrypted work key.",
"Therefore, even if the attacker intercepts the encrypted identity ID and the encrypted work key and knows the public key, it would also be very difficult to decrypt the encrypted identity ID and the encrypted work key, thus presenting high security.",
"Further, “encrypting the initial mask pattern by the two-dimensional code generating device using the key and then embedding the target two-dimensional code into the encrypted mask pattern so as to acquire the encrypted two-dimensional code” specifically includes: encrypting the initial mask pattern by the two-dimensional code generating device using the key so as to acquire an encrypted mask pattern; performing an exclusive-OR operation on the encrypted mask pattern and the target two-dimensional code by the two-dimensional code generating device so as to acquire an encrypted two-dimensional code; “decrypting the encrypted two-dimensional code by the two-dimensional code decoding device according to the key and the initial mask pattern so as to acquire the target two-dimensional code” specifically includes: encrypting the initial mask pattern by the two-dimensional code decoding device using the key so as to acquire an encrypted mask pattern; performing an exclusive-OR operation on the encrypted mask pattern and the encrypted two-dimensional code by the two-dimensional code decoding device so as to acquire the target two-dimensional code.",
"As can be seen from the above description, the initial mask pattern is encrypted by the two-dimensional code generating device using the key, and then an exclusive-OR operation is performed by the two-dimensional code generating device on the encrypted mask pattern and the target two-dimensional code to acquire the encrypted two-dimensional code; the initial mask pattern is encrypted by the two-dimensional code decoding device using the key, and then an exclusive-OR operation is performed by the two-dimensional code decoding device on the encrypted mask pattern and the encrypted two-dimensional code to acquire the target two-dimensional code.",
"The encrypting process and the decrypting process of the target two-dimensional code are the same operational procedure.",
"The two-dimensional code can be successfully encrypted and decrypted as long as the protocol of the encrypting rule is stored in the two-dimensional code generating device and the two-dimensional code decoding device.",
"Further, the initial mask pattern is consistent with the target two-dimensional code in size, areas of the mask pattern corresponding to the function patterns of the target two-dimensional code are set to be of a light color, and the function patterns of the target two-dimensional code include a position detection pattern, a position detection pattern separator, a positioning pattern, a correction pattern, an auxiliary correction pattern and an identification pattern.",
"“encrypting the initial mask pattern by the two-dimensional code generating device using the key” specifically includes: sequentially skipping the areas of the mask pattern corresponding to the function patterns of the target two-dimension code, extracting bit data of the initial mask pattern to form initial data strings, and recording the position and the number of the skipped areas; encrypting the initial data strings using the key to acquire encrypted data strings; and sequentially splicing the encrypted data strings and the function areas together to form the encrypted mask pattern according to the position and the number of skipped areas.",
"As can be seen from the above description, the initial mask pattern as the encrypting pattern of the target two-dimensional code is consistent with the target two-dimensional code in size and can avoid the function patterns of the target two-dimensional code.",
"With an appropriately designed structure, identification, positioning and correction of the target two-dimensional code and the encrypted two-dimensional code are facilitated.",
"The areas corresponding to the function patterns of the target two-dimensional code are required to be skipped in encrypting the initial mask pattern, for avoiding that the positioning pattern, the correction pattern, the auxiliary correction pattern and the identification pattern of the target two-dimensional code from are encrypted and that the target two-dimensional code cannot be identified.",
"The method is reasonably devised and facilitates the identification, positioning and correction of the target two-dimensional code.",
"Further, the method further includes: presetting a time threshold and recording a storage duration of the key in the server; not sending the key to the two-dimensional code decoding device by the server, if the storage duration exceeds the time threshold.",
"As can be seen from the above description, the time threshold is preset in the server; if the storage duration of the key exceeds the time threshold, it means that the key is outdated and the target two-dimensional code has failed, then the key is not sent by the server to the two-dimensional code decoding device, and the encrypted two-dimensional code cannot be decrypted by the two-dimensional code decoding device.",
"The method is reasonably devised, facilitates setting the period of validity of the target two-dimensional code, and is convenient for use.",
"Referring to FIG.",
"1, a first embodiment of the invention is described as follows.",
"A method for encrypting and decrypting two-dimensional code mask is provided, which includes: establishing a secure channel between a two-dimensional code generating device and a server, specifically including: generating a public key pair and a private key pair by the server and sending the public key pair to the two-dimensional code generating device; receiving the public key pair by the two-dimensional code generating device; encrypting an identity ID and a work key by the two-dimensional code generating device using the public key pair and sending the encrypted identity ID and the encrypted work key to the server; receiving the encrypted identity ID and the encrypted work key by the server; decrypting the encrypted identity ID and the encrypted work key by the server using the private key pair so as to acquire the identity ID and the work key; generating a target two-dimensional code containing a function pattern and an identification, an initial mask pattern and a key by the two-dimensional code generating device; sending the identification and the key to the server by the two-dimensional code generating device; receiving and storing the identification and the key by the server; encrypting the initial mask pattern by the two-dimensional code generating device using the key and then embedding the target two-dimensional code into the encrypted mask pattern so as to acquire an encrypted two-dimensional code, specifically including: encrypting the initial mask pattern by the two-dimensional code generating device using the key so as to acquire an encrypted mask pattern; performing an exclusive-OR operation on the encrypted mask pattern and the target two-dimensional code by the two-dimensional code generating device so as to acquire an encrypted two-dimensional code; establishing a secure channel between the two-dimensional code decoding device and the server, specifically including: generating a public key pair and a private key pair by the server and sending the public key pair to the two-dimensional code decoding device; receiving the public key pair by the two-dimensional code decoding device; encrypting an identity ID and a work key by the two-dimensional code decoding device using the public key pair and sending the encrypted identity ID and the encrypted work key to the server; receiving the encrypted identity ID and the encrypted work key by the server; decrypting the encrypted identity ID and the encrypted work key by the server using the private key pair so as to acquire the identity ID and the work key; acquiring and decoding the encrypted two-dimensional code by the two-dimensional code decoding device to acquire the function pattern and the identification; sending the identification to the server by the two-dimensional code decoding device; receiving the identification by the server; sending the key to the two-dimensional code decoding device by the server according to the identification; receiving by the two-dimensional code decoding device the key sent by the server; generating the initial mask pattern by the two-dimensional code decoding device according to the function pattern and the identification; and “decrypting the encrypted two-dimensional code by the two-dimensional code decoding device according to the key and the initial mask pattern so as to acquire the target two-dimensional code” specifically includes: encrypting the initial mask pattern by the two-dimensional code decoding device using the key to acquire an encrypted mask pattern; and performing an exclusive-OR operation on the encrypted mask pattern and the encrypted two-dimensional code by the two-dimensional code decoding device to acquire the target two-dimensional code.",
"Referring to FIG.",
"2, a second embodiment of the invention is described as follows.",
"A method for encrypting and decrypting two-dimensional code mask is provided, which includes: establishing a secure channel between a two-dimensional code generating device and a server, specifically including: generating a public key pair and a private key pair by the server and sending the public key pair to the two-dimensional code generating device; receiving the public key pair by the two-dimensional code generating device; encrypting an identity ID and a work key by the two-dimensional code generating device using the public key pair and sending the encrypted identity ID and the encrypted work key to the server; receiving the encrypted identity ID and the encrypted work key by the server; decrypting the encrypted identity ID and the encrypted work key by the server using the private key pair so as to acquire the identity ID and the work key; generating by the two-dimensional code generating device a target two-dimensional code containing an identification, an initial mask pattern and a key, wherein the initial mask pattern is consistent with the target two-dimensional code in size, areas of the mask pattern corresponding to the function patterns of the target two-dimensional code are set to be of a light color, and the function patterns of the target two-dimensional code include a position detection pattern, a position detection pattern separator, a positioning pattern, a correction pattern, an auxiliary correction pattern and an identification pattern; sending the identification, the initial mask pattern and the key to the server by the two-dimensional code generating device; receiving and storing the identification, the initial mask pattern and the key by the server; “encrypting the initial mask pattern by the two-dimensional code generating device using the key and then embedding the target two-dimensional code into the encrypted mask pattern so as to acquire an encrypted two-dimensional code” specifically includes: encrypting the initial mask pattern by the two-dimensional code generating device using the key so as to acquire an encrypted mask pattern; sequentially skipping the areas of the mask pattern corresponding to the function patterns of the target two-dimension code, extracting bit data of the initial mask pattern to form initial data strings, and recording the position and the number of the skipped areas; encrypting the initial data strings using the key to acquire encrypted data strings; sequentially splicing the encrypted data strings and the function areas together to form the encrypted mask pattern according to the position and the number of skipped areas; performing an exclusive-OR operation on the encrypted mask pattern and the target two-dimensional code by the two-dimensional code generating device so as to acquire the encrypted two-dimensional code; “establishing a secure channel between the two-dimensional code decoding device and the server” specifically includes: generating a public key pair and a private key pair by the server and sending the public key pair to the two-dimensional code decoding device; receiving the public key pair by the two-dimensional code decoding device; encrypting an identity ID and a work key by the two-dimensional code decoding device using the public key pair and sending the encrypted ID and the encrypted work key to the server; receiving by the server the encrypted identity ID and the encrypted work key; decrypting the encrypted identity ID and the encrypted work key by the server using the private key pair so as to acquire the identity ID and the work key; acquiring and decoding the encrypted two-dimensional code by the two-dimensional code decoding device to acquire the identification; sending the identification to the server by the two-dimensional code decoding device; receiving the identification by the server; presetting a time threshold in the server and recording a storage duration of the key in the server; not sending the key to the two-dimensional code decoding device by the server, if the storage duration exceeds the time threshold; sending the key and the initial mask pattern to the two-dimensional code decoding device by the server according to the identification, if the storage time does not exceed the time threshold; receiving by the two-dimensional code decoding device the key and the initial mask pattern sent by the server; and “decrypting the encrypted two-dimensional code by the two-dimensional code decoding device according to the key and the initial mask pattern to acquire the target two-dimensional code” specifically includes: encrypting the initial mask pattern by the two-dimensional code decoding device using the key to acquire the encrypted mask pattern; sequentially skipping the areas of the mask pattern corresponding to the function patterns of the target two-dimension code, extracting bit data of the initial mask pattern to form initial data strings, and recording the position and the number of the skipped areas; encrypting the initial data strings using the key to acquire the encrypted data strings; sequentially splicing the encrypted data strings and the function areas together to form the encrypted mask pattern according to the position and the number of skipped areas; performing an exclusive-OR operation on the encrypted mask pattern and the encrypted two-dimensional code by the two-dimensional code decoding device to acquire the target two-dimensional code.",
"A system for encrypting and decrypting two-dimensional code mask is provided, which includes: a two-dimensional code generating device, a two-dimensional code decoding device and a server, wherein the two-dimensional code generating device includes a first generating module, a first sending module, an encrypting module and an embedding module, the two-dimensional code decoding device includes an acquiring module, a second sending module, a third receiving module, a second generating module and a decrypting module, and the server includes a first receiving module, a second receiving module and a third sending module; the first generating module is configured for generating a target two-dimensional code containing a function pattern and an identification, an initial mask pattern and a key by the two-dimensional code generating device; the first sending module is configured for sending the identification and the key to the server by the two-dimensional code generating device; the first receiving module is configured for receiving and storing the identification and the key by the server; the encrypting module is configured for encrypting the initial mask pattern by the two-dimensional code generating device using the key and then embedding the target two-dimensional code into the encrypted mask pattern to acquire an encrypted two-dimensional code; the acquiring module is configured for acquiring and decoding the encrypted two-dimensional code by the two-dimensional code decoding device to acquire the function pattern and the identification of the two-dimensional code; the second sending module is configured for sending the identification to the server by the two-dimensional code decoding device; the second receiving module is configured for receiving the identification by the server; the third sending module is configured for sending the key to the two-dimensional code decoding device by the server according to the identification; the third receiving module is configured for receiving by the two-dimensional code decoding device the key sent by the server; the second generating module is configured for generating the initial mask pattern by the two-dimensional code decoding device according to the function pattern and the identification; and the decrypting module is configured for decrypting the encrypted two-dimensional code by the two-dimensional code decoding device according to the key and the initial mask pattern so as to acquire the target two-dimensional code.",
"A third embodiment of the invention is described as follows.",
"A system for encrypting and decrypting two-dimensional code mask is provided, which includes: a two-dimensional code generating device, a two-dimensional code decoding device and a server, wherein the two-dimensional code generating device includes a first generating module, a first sending module, an encrypting module and an embedding module, the two-dimensional code decoding device includes an acquiring module, a second sending module, a third receiving module, a second generating module and a decrypting module, and the server includes a first receiving module, a second receiving module and a third sending module; the first generating module is configured for generating a target two-dimensional code containing a function pattern and an identification, an initial mask pattern and a key by the two-dimensional code generating device; the first sending module is configured for sending the identification and the key to the server by the two-dimensional code generating device; the first receiving module is configured for receiving and storing the identification and the key by the server; the encrypting module is configured for encrypting the initial mask pattern by the two-dimensional code generating device using the key and then embedding the target two-dimensional code into the encrypted mask pattern so as to acquire the encrypted two-dimensional code; the acquiring module is configured for acquiring and decoding the encrypted two-dimensional code by the two-dimensional code decoding device so as to acquire the function pattern and the identification of the two-dimensional code; the second sending module is configured for sending the identification to the server by the two-dimensional code decoding device; the second receiving module is configured for receiving the identification by the server; the third sending module is configured for sending the key to the two-dimensional code decoding device by the server according to the identification; the third receiving module is configured for receiving by the two-dimensional code decoding device the key sent by the server; the second generating module is configured for generating the initial mask pattern by the two-dimensional code decoding device according to the function pattern and the identification; and the decrypting module is configured for decrypting the encrypted two-dimensional code by the two-dimensional code decoding device according to the key and the initial mask pattern to acquire the target two-dimensional code.",
"A system for encrypting and decrypting two-dimensional code mask is provided, which includes: a two-dimensional code generating device, a two-dimensional code decoding device and a server, wherein the two-dimensional code generating device includes a generating module, a first sending module, an encrypting module and an embedding module, the two-dimensional code decoding device includes an acquiring module, a second sending module, a third receiving module, and a decrypting module, and the server includes a first receiving module, a second receiving module and a third sending module; the generating module is configured for generating a target two-dimensional code containing an identification, an initial mask pattern and a key by the two-dimensional code generating device; the first sending module is configured for sending the identification, the initial mask pattern and the key to the server by the two-dimensional code generating device; the encrypting module is configured for encrypting the initial mask pattern by the two-dimensional code generating device using the key; the embedding module is configured for encrypting the initial mask pattern by the two-dimensional code generating device using the key and then embedding the target two-dimensional code into the encrypted mask pattern so as to acquire an encrypted two-dimensional code; the acquiring module is configured for acquiring and decoding the encrypted two-dimensional code by the two-dimensional code decoding device to acquire the identification; the second sending module is configured for sending the identification to the server by the two-dimensional code decoding device; the third receiving module is configured for receiving by the two-dimensional code decoding device the key and the initial mask pattern sent by the server; the decrypting module is configured for decrypting the encrypted two-dimensional code by the two-dimensional code decoding device according to the key and the initial mask pattern to acquire the target two-dimensional code; the first receiving module is configured for receiving and storing the identification, the initial mask pattern and the key by the server; the second receiving module is configured for receiving the identification by the server; and the third sending module is configured for sending the key and the initial mask pattern to the two-dimensional code decoding device by the server according to the identification.",
"A fourth embodiment of the invention is described as follows.",
"A system for encrypting and decrypting two-dimensional code mask is provided, which includes: a two-dimensional code generating device, a two-dimensional code decoding device and a server, wherein the two-dimensional code generating device includes a generating module, a first sending module, an encrypting module and an embedding module, the two-dimensional code decoding device includes an acquiring module, a second sending module, a third receiving module, and a decrypting module, and the server includes a first receiving module, a second receiving module and a third sending module; the generating module is configured for generating a target two-dimensional code containing an identification, an initial mask pattern and a key by the two-dimensional code generating device; the first sending module is configured for sending the identification, the initial mask pattern and the key to the server by the two-dimensional code generating device; the encrypting module is configured for encrypting the initial mask pattern by the two-dimensional code generating device using the key; the embedding module is configured for encrypting the initial mask pattern by the two-dimensional code generating device using the key and then embedding the target two-dimensional code into the encrypted mask pattern so as to acquire an encrypted two-dimensional code; the acquiring module is configured for acquiring and decoding the encrypted two-dimensional code by the two-dimensional code decoding device to acquire the identification; the second sending module is configured for sending the identification to the server by the two-dimensional code decoding device; the third receiving module is configured for receiving by the two-dimensional code decoding device the key and the initial mask pattern sent by the server; the decrypting module is configured for decrypting the encrypted two-dimensional code by the two-dimensional code decoding device according to the key and the initial mask pattern to acquire the target two-dimensional code; the first receiving module is configured for receiving and storing the identification, the initial mask pattern and the key by the server; the second receiving module is configured for receiving the identification by the server; and the third sending module is configured for sending the key and the initial mask pattern to the two-dimensional code decoding device by the server according to the identification.",
"In summary, in the method and system for encrypting and decrypting two-dimensional code mask provided by the invention, a secure channel is established between the two-dimensional code generating device and the server as well as between the two-dimensional code decoding device and the server, thereby improving the security of system application environment.",
"Only the identification and the key, or the initial mask pattern are transmitted between the two-dimensional code generating device and the server as well as between the two-dimensional code decoding device and the server.",
"The generation of the initial mask pattern and the encryption of the target two-dimensional code are performed inside the two-dimensional code generating device, the decrypting process of the encrypted two-dimensional code is performed inside the two-dimensional code decoding device, and the two-dimensional code decoding device can also generate the initial mask pattern according to the function pattern information of the two-dimensional code, thus presenting high security.",
"The time validity of the key can be set in the server, which is convenient for use.",
"The identification is used to identify the target two-dimensional code, the key, the function pattern information of the two-dimensional code or the initial mask pattern.",
"The target two-dimensional code corresponding to each identification may be unique, or may also be in batch.",
"The areas corresponding to the function patterns of the target two-dimensional code are skipped for the encrypted area of the initial mask pattern, which is convenient for the identification, positioning and correction of the target two-dimensional code and the encrypted two-dimensional code.",
"The system has high security, the server has less loads, and the use is convenient."
]
] |
Patent_15871184
|
[
[
"Lip Exfoliating Device",
"A lip exfoliator includes an exfoliant with one or more dry abrasive materials for exfoliation of the lips, which may be provided as a single compact unit.",
"Embodiments of a lip exfoliator may include an attachment surface—such as an adhesive sticker, suction device, or cup mechanism—for attaching the lip exfoliator to a lip balm or other cosmetic.",
"Thus, a consumer may use embodiments of the lip exfoliator with a lip balm or cosmetic of their choice easily while on the go."
],
[
"1.A lip exfoliator comprising: an exfoliant comprising an active surface, wherein the active surface is composed of an insoluble dry abrasive material comprising a binding agent that holds in place exfoliating particles; a bottom section comprising an attachment surface; and a binding mechanism configured to attach the exfoliant to the bottom section, wherein the attachment surface is adapted to attach to an end of a lip balm by an adhesive.",
"2.The lip exfoliator of claim 1, wherein the binding mechanism comprises a solid body that at least partially covers the exfoliant; and the lip exfoliator further comprises a cap configured to attach to the solid body, wherein the cap covers the active surface when attached to the solid body.",
"3.The lip exfoliator of claim 1, wherein the exfoliating particles comprise at least one of: natural luffa, hemp fibers, pumice, stone, diamond particles, food particles, synthetic luffa, Teflon, and PTFE.",
"4.The lip exfoliator of claim 1, wherein the lip exfoliator has a cylindrical shape with a diameter of less than 1 inch and a height between ½ inch and 1 inch.",
"5.The lip exfoliator of claim 1, wherein the exfoliating particles are disposed along the active surface.",
"6.The lip exfoliator of claim 1, wherein the binding agent comprises at least one of: a rubber, a natural resin, and a viscous sugar.",
"7.The lip exfoliator of claim 1, wherein the binding mechanism comprises an adhesive tape.",
"8.The lip exfoliator of claim 1, wherein the binding mechanism comprises an elastic material.",
"9.A lip balm comprising: a body containing a balm, wherein the body comprises a first opening for distributing the balm; a cap for covering the first opening; and an exfoliant disposed within the body, wherein the exfoliant comprises an active surface accessible through a second opening in the body, and the active surface is composed of an insoluble dry-abrasive material comprising a binding agent that holds in place exfoliating particles.",
"10.The lip balm of claim 9, further comprising: a cover attached to the body and configured to protect the active surface of the exfoliant when closed.",
"11.The lip balm of claim 9, wherein the exfoliating particles comprise at least one of: natural luffa, hemp fibers, pumice, stone, diamond particles, ground food particles, synthetic luffa, Teflon, and PTFE.",
"12.A cap configured to removably attach to a body of a lip balm, wherein: an end of the cap comprises an exfoliant; the exfoliant is composed of an insoluble dry abrasive material comprising exfoliating particles, and when attached to the body of the hp balm, the cap covers an opening in the body of the lip balm for dispensing a balm.",
"13.The cap of claim 12, further comprising: a cover attached to the cap and configured to protect an active surface of the exfoliant when closed.",
"14.The cap of claim 13, wherein the exfoliating particles are disposed along the active surface.",
"15.The cap of claim 14, wherein the exfoliating particles are held in place by a binding agent.",
"16.The lip exfoliator of claim 15, wherein the binding agent comprises at least one of: a rubber, a natural resin, and a viscous sugar.",
"17.The cap claim 12, wherein the exfoliating particles comprise at least one of: natural luffa, hemp fibers, pumice, stone, diamond particles, ground food particles, synthetic luffa, Teflon, and PTFE."
],
[
"<SOH> BACKGROUND <EOH>This disclosure relates to health and beauty products and devices and their methods of use—for exfoliating lips to improve the appearance and health of the lips.",
"Most areas of human skin have sebaceous glands, which produce oil (sebum) to moisturize and protect the skin, and sweat (sudoriferous) glands, which provide moisture and regulate body temperature.",
"In contrast, the lips have no sebaceous glands and no sweat glands.",
"Saliva is the only natural source of lubrication for the lips, which makes them particularly vulnerable to becoming dry and chapped.",
"For this reason, there are many products on the market for protecting and beautifying lips, including a wide range of lip balms, glosses, and lipsticks.",
"However, because of the lack of natural oils, lips cannot adequately wick away salts and other debris—e.g., food particles, sugars, chemicals, dry skin, etc.—before the application of such a lip balm, gloss, or lipstick, which may serve only to seal in debris against the lips.",
"As a result, even when a product is applied to the lips, they may still become dry and chapped.",
"This is why chapped lips can occur even with the application of a lip balm or other product.",
"As used herein, the term “lip balm” includes, without limitation, lip balms, lip glosses, lip sticks, and other cosmetics for treating or beautifying the lips.",
"Currently there exist products intended to help prevent the problem of chapped lips when applying a lip balm.",
"However, these existing products all suffer from drawbacks.",
"For example, existing lip scrubs require the use of water with the scrub, which means that normally they would be applied in front of a bathroom sink and require several steps to apply and remove.",
"This can be time-consuming and inconvenient when on the go.",
"Also, lip balms exist which include a solvent for dissolving salt and sugars on the lips.",
"After applying such a balm, the consumer is supposed to rub their lips together to dissolve the debris.",
"However, this method requires the consumer to rub their lips together aggressively, which can be uncomfortable, unattractive, and frequently ineffective.",
"It is, in fact, quite difficult to dissolve all of the salt and sugar particles from the lips using this method.",
"In most cases, the consumer is supposed to leave the balm on their lips after application, which means that the salts and sugars are never completely removed.",
"Thus, small salt and sugar particles are left on the lips along with excess balm.",
"Moreover, such lip balms only include solvents for certain types of debris and, thus, may be completely ineffective at removing other types of particles.",
"There are dry abrasives which may be used for exfoliating lips.",
"However, such dry abrasives have not been integrated into an end product in a way that is convenient and easy for the consumer to use with their preferred lip balm while on the go.",
"Thus, there is a need for an effective lip exfoliator that is convenient and easy for the consumer to use while on the go.",
"The present invention(s) are directed towards lip exfoliating devices and methods that solve these and other problems in the art."
],
[
"<SOH> SUMMARY OF THE DISCLOSURE <EOH>The present disclosure relates to lip exfoliators that are convenient and easy to use while on the go.",
"Lip exfoliators of the present disclosure may have an exfoliant that incorporates one or more dry abrasive materials for exfoliation.",
"Such dry abrasive materials advantageously do not require the use of water—nor access to a sink—for application.",
"Moreover, the consumer does not need to rub their lips together in order to remove debris from their lips when using lip exfoliators of the present disclosure.",
"To the contrary, the consumer may simply rub the lip exfoliator along the lips until they are adequately exfoliated, a quick and easy process.",
"In some embodiments, lip exfoliators of the present disclosure may be provided as a single unit.",
"Advantageously, the lip exfoliator may be compact, relatively small, and easy to carry in a purse or cosmetic bag.",
"The lip exfoliator may be attached to a lip balm for convenience and ease of use.",
"For example, embodiments of the lip exfoliator may include an attachment surface—such as an adhesive sticker, suction device, or cup mechanism—for attaching the lip exfoliator to a lip balm or other cosmetic.",
"Thus, the consumer may use the lip exfoliator with the lip balm or cosmetic of their choice and need not purchase a particular lip balm together with the lip exfoliator.",
"Alternatively, in other embodiments, lip exfoliators of the present disclosure may be integrated into the cap or body of a lip balm or other cosmetic.",
"In these embodiments, the lip exfoliator may be packaged together with a particular lip balm.",
"Integrating a lip exfoliator into a lip balm may provide an additional incentive for consumers to purchase the product.",
"In embodiments of the present disclosure, a lip exfoliator may include an exfoliant with an active surface having a dry abrasive material suitable for application to the lips.",
"The lip exfoliator also may include a bottom section and a binding mechanism that attaches the exfoliant to the bottom section, thereby creating a single unit.",
"The bottom section may include an attachment surface capable of attaching the lip exfoliator to a lip balm or other cosmetic.",
"A cap or cover also may be provided for protecting the active surface when not in use.",
"In other embodiments of the present disclosure, a lip balm may have a body containing a balm suitable for application to the lips.",
"The body may have a first opening for distributing the balm along the lips and a cap for covering the first opening.",
"The body also may contain an exfoliant made, at least in part, of a dry abrasive material suitable for application to the lips.",
"The exfoliant may have an active surface accessible through a second opening in the body.",
"A cap or cover may be provided for protecting the active surface when not in use.",
"In still other embodiments of the present disclosure, a cap may be configured to attach to a body of a lip balm.",
"The cap may include an exfoliant at its end.",
"The exfoliant may include a dry abrasive material suitable for application to the lips.",
"A cap or cover also may be provided for protecting the exfoliant when not in use.",
"The foregoing discussion in the Summary of the Disclosure is exemplary only and should not be used to limit the scope of the claimed invention(s) or the embodiments described below in any way."
],
[
"CROSS-REFERENCE TO RELATED APPLICATIONS This application is a continuation of U.S. patent application Ser.",
"No.",
"14/875,547 filed Oct. 5, 2015.BACKGROUND This disclosure relates to health and beauty products and devices and their methods of use—for exfoliating lips to improve the appearance and health of the lips.",
"Most areas of human skin have sebaceous glands, which produce oil (sebum) to moisturize and protect the skin, and sweat (sudoriferous) glands, which provide moisture and regulate body temperature.",
"In contrast, the lips have no sebaceous glands and no sweat glands.",
"Saliva is the only natural source of lubrication for the lips, which makes them particularly vulnerable to becoming dry and chapped.",
"For this reason, there are many products on the market for protecting and beautifying lips, including a wide range of lip balms, glosses, and lipsticks.",
"However, because of the lack of natural oils, lips cannot adequately wick away salts and other debris—e.g., food particles, sugars, chemicals, dry skin, etc.—before the application of such a lip balm, gloss, or lipstick, which may serve only to seal in debris against the lips.",
"As a result, even when a product is applied to the lips, they may still become dry and chapped.",
"This is why chapped lips can occur even with the application of a lip balm or other product.",
"As used herein, the term “lip balm” includes, without limitation, lip balms, lip glosses, lip sticks, and other cosmetics for treating or beautifying the lips.",
"Currently there exist products intended to help prevent the problem of chapped lips when applying a lip balm.",
"However, these existing products all suffer from drawbacks.",
"For example, existing lip scrubs require the use of water with the scrub, which means that normally they would be applied in front of a bathroom sink and require several steps to apply and remove.",
"This can be time-consuming and inconvenient when on the go.",
"Also, lip balms exist which include a solvent for dissolving salt and sugars on the lips.",
"After applying such a balm, the consumer is supposed to rub their lips together to dissolve the debris.",
"However, this method requires the consumer to rub their lips together aggressively, which can be uncomfortable, unattractive, and frequently ineffective.",
"It is, in fact, quite difficult to dissolve all of the salt and sugar particles from the lips using this method.",
"In most cases, the consumer is supposed to leave the balm on their lips after application, which means that the salts and sugars are never completely removed.",
"Thus, small salt and sugar particles are left on the lips along with excess balm.",
"Moreover, such lip balms only include solvents for certain types of debris and, thus, may be completely ineffective at removing other types of particles.",
"There are dry abrasives which may be used for exfoliating lips.",
"However, such dry abrasives have not been integrated into an end product in a way that is convenient and easy for the consumer to use with their preferred lip balm while on the go.",
"Thus, there is a need for an effective lip exfoliator that is convenient and easy for the consumer to use while on the go.",
"The present invention(s) are directed towards lip exfoliating devices and methods that solve these and other problems in the art.",
"SUMMARY OF THE DISCLOSURE The present disclosure relates to lip exfoliators that are convenient and easy to use while on the go.",
"Lip exfoliators of the present disclosure may have an exfoliant that incorporates one or more dry abrasive materials for exfoliation.",
"Such dry abrasive materials advantageously do not require the use of water—nor access to a sink—for application.",
"Moreover, the consumer does not need to rub their lips together in order to remove debris from their lips when using lip exfoliators of the present disclosure.",
"To the contrary, the consumer may simply rub the lip exfoliator along the lips until they are adequately exfoliated, a quick and easy process.",
"In some embodiments, lip exfoliators of the present disclosure may be provided as a single unit.",
"Advantageously, the lip exfoliator may be compact, relatively small, and easy to carry in a purse or cosmetic bag.",
"The lip exfoliator may be attached to a lip balm for convenience and ease of use.",
"For example, embodiments of the lip exfoliator may include an attachment surface—such as an adhesive sticker, suction device, or cup mechanism—for attaching the lip exfoliator to a lip balm or other cosmetic.",
"Thus, the consumer may use the lip exfoliator with the lip balm or cosmetic of their choice and need not purchase a particular lip balm together with the lip exfoliator.",
"Alternatively, in other embodiments, lip exfoliators of the present disclosure may be integrated into the cap or body of a lip balm or other cosmetic.",
"In these embodiments, the lip exfoliator may be packaged together with a particular lip balm.",
"Integrating a lip exfoliator into a lip balm may provide an additional incentive for consumers to purchase the product.",
"In embodiments of the present disclosure, a lip exfoliator may include an exfoliant with an active surface having a dry abrasive material suitable for application to the lips.",
"The lip exfoliator also may include a bottom section and a binding mechanism that attaches the exfoliant to the bottom section, thereby creating a single unit.",
"The bottom section may include an attachment surface capable of attaching the lip exfoliator to a lip balm or other cosmetic.",
"A cap or cover also may be provided for protecting the active surface when not in use.",
"In other embodiments of the present disclosure, a lip balm may have a body containing a balm suitable for application to the lips.",
"The body may have a first opening for distributing the balm along the lips and a cap for covering the first opening.",
"The body also may contain an exfoliant made, at least in part, of a dry abrasive material suitable for application to the lips.",
"The exfoliant may have an active surface accessible through a second opening in the body.",
"A cap or cover may be provided for protecting the active surface when not in use.",
"In still other embodiments of the present disclosure, a cap may be configured to attach to a body of a lip balm.",
"The cap may include an exfoliant at its end.",
"The exfoliant may include a dry abrasive material suitable for application to the lips.",
"A cap or cover also may be provided for protecting the exfoliant when not in use.",
"The foregoing discussion in the Summary of the Disclosure is exemplary only and should not be used to limit the scope of the claimed invention(s) or the embodiments described below in any way.",
"BRIEF DESCRIPTION OF THE DRAWINGS FIG.",
"1A illustrates an exemplary embodiment of a lip exfoliator with an active surface and an attachment surface.",
"FIG.",
"1B illustrates an exemplary embodiment of a lip exfoliator attached to the top surface of a lip balm.",
"FIG.",
"2 illustrates an exemplary embodiment of a lip exfoliator having a solid body and a cap.",
"FIG.",
"3A illustrates a side view of an exemplary embodiment of a lip exfoliator where the attachment surface comprises a cup mechanism.",
"FIG.",
"3B illustrates an underneath view of an exemplary embodiment of a lip exfoliator where the attachment surface comprises a cup mechanism.",
"FIG.",
"3C illustrates an exemplary embodiment of a lip exfoliator attached to a lip balm by a cup mechanism.",
"FIG.",
"3D illustrates an exemplary embodiment of a lip exfoliator attached to a fingertip by a cup mechanism.",
"FIG.",
"4A illustrates an exemplary embodiment of a lip exfoliator integrated into the cap of a lip balm.",
"FIG.",
"4B illustrates an exemplary embodiment of a lip exfoliator integrated into the bottom of a tip balm.",
"FIG.",
"4C illustrates an exemplary embodiment of a lip exfoliator integrated into the side of a lip balm.",
"DETAILED DESCRIPTION Lip exfoliators of the present disclosure may have an exfoliant with an active surface for removing salt and other debris from the lips by rubbing the active surface against the lips.",
"The active surface may include one or more dry abrasive materials for exfoliating the lips.",
"In some embodiments, the lip exfoliator also may have an attachment surface for, optionally, attaching the lip exfoliator to a lip balm, cosmetic device, or other convenient location.",
"For example, the attachment surface may include an adhesive sticker or suction device capable of adhering to the surface of a lip balm.",
"A cap or case also may be provided for the lip exfoliator to prevent it from getting dirty while not in use.",
"Lip exfoliators of the present disclosure may be provided as a single unit, which may be compact, relatively small (e.g., about the diameter of a typical lip balm and about ½ inch in length), and easy to carry in a purse, cosmetic bag, or pocket.",
"Embodiments of the lip exfoliator may be capable of attaching to a lip balm or other cosmetic by the attachment surface.",
"In these embodiments, the lip exfoliator may be used together with a lip balm or other cosmetic of the consumer's choice.",
"After attaching the lip exfoliator to a lip balm, a consumer may grasp the lip balm, using it as a handle when applying the lip exfoliator.",
"Alternatively, the consumer may use the lip exfoliator by itself and may, if already attached, detach the lip exfoliator from the lip balm before application.",
"In preferred embodiments of the disclosure, the exfoliant may include one or more dry abrasive materials for exfoliating the lips.",
"The consumer may simply rub the active surface of the exfoliant against their lips to remove any accumulated particles or debris.",
"This method of exfoliation is much more convenient than using a lip scrub, because dry abrasives do not require water or a sink.",
"Unlike a lip scrub, the lip exfoliator may be used anywhere while on the go.",
"Dry abrasives also are more effective than lip balms containing solvents.",
"Unlike solvents, dry abrasives can remove all types of debris and particles that may have accumulated on the lips.",
"Lip exfoliators of the present disclosure also act as a beauty aid, because application of dry abrasives improves blood flow to the lips and makes the lips appear more pink.",
"Natural dry abrasives, such as luffa, may be used safely on the lips and may be included in the exfoliant (and its active surface).",
"Certain foods also act as natural exfoliants when ground and can be used safely on the lips.",
"For example, the exfoliant may include ground particles of flax seeds, cornmeal, oatmeal, and/or other seeds or grains.",
"The exfoliant also may include minerals, such as diamond particles, pumice, or sandstone.",
"A material such as rubber or a natural resin or viscous sugar may be used as a binding agent in the exfoliant for holding in place the exfoliating particles (e.g., food or minerals).",
"The exfoliant (and its active surface) also may include synthetic materials such as Polytetrafluoroethylene (“PTFE”) or a material that mimics the fibrous structure of luffa.",
"Moreover, a synthetic material may be used as a binding agent for dry abrasive particles within the exfoliant and/or disposed on the active surface.",
"Other materials suitable for application to the lips with abrasive properties also may be used in the exfoliant d on the active surface.",
"As would be understood by a person of skill in the art in view of the present disclosure, materials suitable for application to the lips generally should not include toxic materials that are likely to be imbibed by the consumer or materials likely to cut or damage the lips during normal application.",
"FIG.",
"1A shows an exemplary embodiment of a lip exfoliator of the present disclosure.",
"In FIG.",
"1A, lip exfoliator 100 includes exfoliant 101, bottom section 102, and binding mechanism 103.Exfoliant 101 includes active surface 104, which is used to exfoliate the lips.",
"Bottom section 102 includes attachment surface 105, which may be used to optionally attach lip exfoliator 100 to a lip balm or other cosmetic.",
"As shown in FIG.",
"1A, binding mechanism 103 joins exfoliant 101 to bottom section 102, thereby creating a single unit 100.Binding mechanism 103 may include an adhesive or elastic material.",
"For example, binding mechanism 103 may be an adhesive tape that wraps around portions of exfoliant 101 and bottom section 102, thereby joining them together.",
"As another example, binding mechanism 103 may be an elastic material that uses elastic force to hold exfoliant 101 and bottom section 102 together.",
"Alternatively or in addition, a glue or other adhesive may be provided between exfoliant 101 and bottom section 102 to join them together.",
"Other binding mechanisms also may be used to join exfoliant 101 and bottom section 102, as would be understood by a person of skill in the art in view of the present disclosure.",
"Exfoliant 101 and/or active surface 104 may, by way of example and not limitation, include one or more of the following dry abrasives: natural luffa, hemp fibers, pumice, stone, minerals, diamond particles, ground food particles, synthetic luffa, PTFE, Teflon and/or other synthetic materials suitable for application to the lips.",
"The dry abrasive material may be dispersed throughout exfoliant 101, including active surface 104.Alternatively, in some embodiments, the dry abrasive material may be concentrated along active surface 104.For example, diamond particles may be held in place by a binding agent distributed along active surface 104.By concentrating the dry abrasive along the active surface, less dry abrasive material may be used, which may save on the cost of manufacture (e.g., when using diamond or other expensive dry abrasives).",
"Bottom section 102 may be composed of rubber or plastic material.",
"Attachment surface 105 may include, for example, an adhesive or a suction mechanism.",
"The adhesive may provide a semi-permanent connection to an attached surface or it may be easily removable, depending on the particular adhesive used.",
"Adhesives such as stickers, tape, glue, Velcro™ or other mechanisms may be used, as would be apparent to one of skill in the art in view of the present disclosure.",
"Alternatively, a suction mechanism, such as a flexible plastic (or rubber) cup, may be provided.",
"The suction mechanism may be capable of forming a suction seal between lip exfoliator 100 and the body of a lip balm or other cosmetic.",
"In other embodiments of the disclosure, attachment surface 105 may be configured to attach to a specific lip balm or cosmetic and may comprise, for example, a screw or snapping mechanism for fitting securely onto a receiving portion of the specific lip balm.",
"In yet other embodiments of the disclosure, lip exfoliator 100 may be provided without attachment surface 105.Lip exfoliator 100 may be manufactured in various sizes.",
"In preferred embodiments of the disclosure, lip exfoliator 100 may be relatively small and compact.",
"For example, lip exfoliator 100 may have a cylindrical shape with a diameter of less than 1 inch and a height of between ½ to 1 inch.",
"This relatively small size is easy to carry and attach to a lip balm.",
"In alternative embodiments, lip exfoliator 100 may be larger, having a diameter greater than 1 inch, thereby providing a larger surface area for the active surface and facilitating exfoliation.",
"Lip exfoliator 100 also may be manufactured in various other shapes, such as a rectangular or oval shape, as would be understood by a person of skill in the art in view of the present disclosure.",
"FIG.",
"1B shows an exemplary embodiment in which lip exfoliator 100 is attached to lip balm 200 by attachment surface 105.As illustrated in FIG.",
"1B, lip exfoliator 100 is attached to cap 201 of lip balm 200.However, lip exfoliator 100 could be attached to other surfaces, as well, such as body 202 of lip balm 200.When attached as shown in FIG.",
"1b, a consumer may optionally apply lip exfoliator 101 by grasping lip balm 200 and using it as a handle, which provides additional leverage and ease of use.",
"FIG.",
"2 shows an exemplary embodiment of a lip exfoliator having a solid body and a cap.",
"As shown in FIG.",
"2, lip exfoliator 300 includes exfoliant 301 and solid body 302.Cap 303 fits onto solid body 302 and covers active surface 304 of exfoliant 301.Solid body 302 may be composed of hard plastic, metal, or another material of sufficient strength and hardness.",
"Solid body 302 may act to hold exfoliant 301 together with a bottom section that includes attachment surface 305.Solid body 302 may be provided instead of, or in addition to, a binding mechanism, such as an adhesive tape, elastic material, and/or glue.",
"The embodiment of FIG.",
"2 provides extra protection for lip exfoliator 300 and a convenient way to carry the device.",
"Solid body 302 and cap 303 prevent exfoliant 301 from becoming damaged or dirty when not in use.",
"Solid body 302 also provides an area for a consumer to grip when using lip exfoliator 300 without an attached lip balm or other cosmetic.",
"FIG.",
"3A shows an exemplary embodiment of a lip exfoliator where the attachment surface includes a cup mechanism.",
"As shown in FIG.",
"3A, bottom section 402 of lip exfoliator 400 includes cup mechanism 405.Exfoliant 401 may be fitted into a top portion of bottom section 402, as shown in FIG.",
"3A; or, in other embodiments, exfoliant 401 may be attached to bottom section 402 by a binding mechanism, as described previously with respect to FIG.",
"1.Cup mechanism 402 may be composed of a material having sufficient elasticity for fitting onto the ends of lip balms of various sizes, such as a soft rubber material.",
"Other materials having sufficient elasticity also may be used for cup mechanism 402, as would be understood by a person of skill in the art in view of the present disclosure.",
"FIG.",
"3B shows a different view, from a bottom angle, of an embodiment having cup mechanism 405.Cup mechanism 405 includes hollow opening 406 for fitting around a lip balm or finger.",
"As shown in FIG.",
"3C, cup mechanism 405 may be placed over an end of a lip balm, thereby attaching lip exfoliator 400 to the lip balm.",
"As shown in FIG.",
"3D, cup mechanism 405 also may be placed over the end of a consumer's finger, thereby allowing the consumer to easily apply lip exfoliator 400 to their lips.",
"In other embodiments of the disclosure, the lip exfoliator may be integrated into the body or cap of a lip balm (or other cosmetic).",
"In these embodiments, the lip exfoliator may be packaged together with a particular lip balm.",
"FIG.",
"4A shows an exemplary embodiment in which exfoliant 501 is integrated into cap 503 of lip balm 500.As shown in FIG.",
"4a, exfoliant 501 is disposed at an end of cap 503 for easy application to the lips.",
"For example, a consumer may first exfoliate their lips using exfoliant 501, then remove the cap and apply lip balm to their lips.",
"In some embodiments, cover 504 may be provided for covering exfoliant 501 when not in use.",
"Cover 504 may be attached to cap 503 by a hinge or similar mechanism and may snap shut.",
"Alternatively, cover 504 may detach completely from cap 503 when opened and may snap or screw onto cap 503 when closed.",
"FIG.",
"4B shows an exemplary embodiment in which exfoliant 601 is integrated into body 602 of lip balm 600.Lip balm 600 may contain a balm suitable for application to the lips within body 602.Body 602 may have a first opening (not shown) for distributing the balm onto the consumer's lips, and cap 603 may be provided to cover the first opening.",
"As shown in FIG.",
"4B, exfoliant 601 may be disposed in an end opposite cap 603 of lip balm 600.In some embodiments, cover 604 may be provided for covering exfoliant 601 when not in use.",
"Cover 604 may be attached to body 602 by a hinge or similar mechanism and may snap shut.",
"Alternatively, cover 604 may detach completely from body 602 when opened and may snap or screw onto body 602 when closed.",
"FIG.",
"4C shows an exemplary embodiment in which exfoliant 701 is integrated into a side portion of body 702 of lip balm 700.In some embodiments, cover 704 may be provided for protecting exfoliant 701 when not in use.",
"Cover 704 may be attached to body 702 by a hinge or similar mechanism and may snap shut.",
"Alternatively, cover 704 may detach completely from body 702 when opened and may snap onto body 702 when closed.",
"It should be understood that, while various embodiments have been described herein, the present invention(s) should not be limited by those embodiments.",
"To the contrary, the foregoing written description, figures, and abstract have been presented for illustrative purposes, and are not meant to limit the present invention(s).",
"Indeed, as a person of skill in the art in view of the present disclosure would recognize, various changes can be made to the embodiments described herein without departing from the scope and spirit of the present invention(s)."
]
] |
Patent_15871185
|
[
[
"WIRE GRID POLARIZER AND METHOD OF FABRICATING THE SAME",
"A method of fabricating a wire grid polarizer includes sequentially depositing a conductive wire pattern layer, and a plurality of guide patterns which forms one or more trenches therebetween on the conductive wire pattern layer, hydrophobically treating surfaces of the conductive wire pattern layer exposed in the trenches, and the guide patterns, coating the hydrophobically treated conductive wire pattern layer in the trenches with a neutral layer to partially fill the trenches, filling a remainder of the trenches with a block copolymer of two monomers with different etching rates, aligning the block copolymer filled in the trenches, selectively removing blocks of one monomer among the two monomers from the aligned block copolymer, and patterning the conductive wire pattern layer by using blocks of the other monomer among the two monomers remaining in the trenches and the guide patterns as a mask."
],
[
"1.A wire grid polarizer, comprising: a base substrate; a plurality of conductive wire patterns which protrudes from the base substrate and is arranged side-by-side with one another; and a hydrophobic layer on at least one of the conductive wire patterns.",
"2.The wire grid polarizer of claim 1, wherein each of the conductive wire patterns includes two or more layers.",
"3.The wire grid polarizer of claim 1, wherein one or more conductive wire patterns with the hydrophobic layer disposed thereon is arranged periodically on the base substrate.",
"4.The wire grid polarizer of claim 3, wherein a plurality of conductive wire patterns with the hydrophobic layer disposed thereon is repeatedly arranged between each pair of adjacent conductive wire patterns with no hydrophobic layer disposed thereon.",
"5.The wire grid polarizer of claim 1, further comprising: a neutral layer on the hydrophobic layer.",
"6.A liquid crystal display device, comprising: a lower display substrate on which light is incident; an upper display substrate from which light is emitted; a liquid crystal layer between the lower display substrate and the upper display substrate; and the wire grid polarizer of claim 1.7.The liquid crystal display device of claim 6, wherein the wire grid polarizer is disposed in the lower display substrate."
],
[
"<SOH> BACKGROUND <EOH>"
],
[
"<SOH> SUMMARY <EOH>Exemplary embodiments of the invention provide a method of fabricating uniform wire grid patterns, a wire grid polarizer obtained by the method, and a display device including the wire grid polarizer.",
"Exemplary embodiments of the invention are not restricted to those set forth herein.",
"The above and other exemplary embodiments of the invention will become more apparent to one of ordinary skill in the art to which the invention pertains by referencing the detailed description of the invention given below.",
"According to an exemplary embodiment of the invention, there is provided a method of fabricating a wire grid polarizer including sequentially depositing a conductive wire pattern layer, and a plurality of guide patterns which forms one or more trenches therebetween on the conductive wire pattern layer, on a substrate, hydrophobically treating surfaces of the conductive wire pattern layer exposed in the trenches, and the guide patterns, coating the hydrophobically treated conductive wire pattern layer in the trenches with a neutral layer to partially fill the trenches, filling a remainder of the trenches with a block copolymer of two monomers with different etching rates, aligning the block copolymer filled in the trenches, selectively removing blocks of one monomer among the two monomer from the aligned block copolymer such that the other monomer among the two monomers remains in the trenches, and patterning the conductive wire pattern layer by using blocks of the remaining other monomer among the two monomers and the guide patterns as a mask.",
"According to an exemplary embodiment of the invention, there is provided a wire grid polarizer including a base substrate, a plurality of conductive wire patterns which protrudes from the base substrate and is arranged side-by-side with one another, and a hydrophobic layer on at least one of the conductive wire patterns.",
"According to an exemplary embodiment of the invention, there is provided a liquid crystal display (“LCD”) device including a lower display substrate on which light is incident, an upper display substrate from which light is emitted, a liquid crystal layer between the lower display substrate and the upper display substrate, and the wire grid polarizer.",
"According to the exemplary embodiments, a wire grid polarizer with excellent optical properties is provided.",
"Other features and exemplary embodiments will be apparent from the following detailed description, the drawings, and the claims."
],
[
"This application is a divisional application of U.S. patent application Ser.",
"No.",
"14/623,708 filed on Feb. 17, 2015, which claims priority to Korean Patent Application No.",
"10-2014-0121123 filed on Sep. 12, 2014, and all the benefits accruing therefrom under 35 U.S.C.",
"§ 119, the disclosure of which is incorporated herein by reference in its entirety.",
"BACKGROUND 1.Field The invention relates to a wire grid polarizer and a method of fabricating the same.",
"2.Description of the Related Art A parallel conduction wire array in which conductor wires are arranged parallel to one another to polarize certain light from electromagnetic waves is generally referred to as a wire grid polarizer.",
"In response to non-polarized light being incident thereto, a wire grid polarizer with a smaller period than the wavelength of the incident light reflects polarized light parallel to a direction of the wires thereof, and transmits therethrough polarized light perpendicular to the direction of the wires thereof.",
"A wire grid polarizer is more beneficial than an absorptive polarizer in that it allows reflected polarized light to be reused.",
"SUMMARY Exemplary embodiments of the invention provide a method of fabricating uniform wire grid patterns, a wire grid polarizer obtained by the method, and a display device including the wire grid polarizer.",
"Exemplary embodiments of the invention are not restricted to those set forth herein.",
"The above and other exemplary embodiments of the invention will become more apparent to one of ordinary skill in the art to which the invention pertains by referencing the detailed description of the invention given below.",
"According to an exemplary embodiment of the invention, there is provided a method of fabricating a wire grid polarizer including sequentially depositing a conductive wire pattern layer, and a plurality of guide patterns which forms one or more trenches therebetween on the conductive wire pattern layer, on a substrate, hydrophobically treating surfaces of the conductive wire pattern layer exposed in the trenches, and the guide patterns, coating the hydrophobically treated conductive wire pattern layer in the trenches with a neutral layer to partially fill the trenches, filling a remainder of the trenches with a block copolymer of two monomers with different etching rates, aligning the block copolymer filled in the trenches, selectively removing blocks of one monomer among the two monomer from the aligned block copolymer such that the other monomer among the two monomers remains in the trenches, and patterning the conductive wire pattern layer by using blocks of the remaining other monomer among the two monomers and the guide patterns as a mask.",
"According to an exemplary embodiment of the invention, there is provided a wire grid polarizer including a base substrate, a plurality of conductive wire patterns which protrudes from the base substrate and is arranged side-by-side with one another, and a hydrophobic layer on at least one of the conductive wire patterns.",
"According to an exemplary embodiment of the invention, there is provided a liquid crystal display (“LCD”) device including a lower display substrate on which light is incident, an upper display substrate from which light is emitted, a liquid crystal layer between the lower display substrate and the upper display substrate, and the wire grid polarizer.",
"According to the exemplary embodiments, a wire grid polarizer with excellent optical properties is provided.",
"Other features and exemplary embodiments will be apparent from the following detailed description, the drawings, and the claims.",
"BRIEF DESCRIPTION OF THE DRAWINGS The above and other advantages and features of this disclosure will become more apparent by describing in further detail exemplary embodiments thereof with reference to the accompanying drawings, in which: FIGS.",
"1 to 8 are cross-sectional views illustrating an exemplary embodiment of a method of fabricating a wire grid polarizer, according to the invention.",
"FIG.",
"9 is a vertical cross-sectional view of an exemplary embodiment of a wire grid polarizer according to the invention.",
"FIG.",
"10 is a vertical cross-sectional view of another exemplary embodiment of a wire grid polarizer according to the invention.",
"FIG.",
"11 is a vertical cross-sectional view of an exemplary embodiment of a display device according to the invention.",
"DETAILED DESCRIPTION Advantages and features of the invention and methods of accomplishing the same may be understood more readily by reference to the following detailed description of exemplary embodiments and the accompanying drawings.",
"The invention may, however, be embodied in many different forms and should not be construed as being limited to the exemplary embodiments set forth herein.",
"Rather, these exemplary embodiments are provided so that this disclosure will be thorough and complete and will fully convey the invention to those skilled in the art, and the invention will be defined by the appended claims.",
"Like reference numerals refer to like elements throughout the specification.",
"The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention.",
"As used herein, the singular forms “a,” “an” and “the” are intended to include the plural forms as well, unless the context clearly indicates otherwise.",
"It will be further understood that the terms “comprises” and/or “comprising,” when used in this specification, specify the presence of stated features, integers, steps, operations, elements, and/or components, but do not preclude the presence or addition of one or more other features, integers, steps, operations, elements, components, and/or groups thereof.",
"It will be understood that when an element or layer is referred to as being “on,” “connected to” or “coupled to” another element or layer, it can be directly on, connected or coupled to the other element or layer or intervening elements or layers may be present.",
"In contrast, when an element is referred to as being “directly on,” “directly connected to” or “directly coupled to” another element or layer, there are no intervening elements or layers present.",
"As used herein, the term “and/or” includes any and all combinations of one or more of the associated listed items.",
"It will be understood that, although the terms first, second, etc.",
"may be used herein to describe various elements, components, regions, layers and/or sections, these elements, components, regions, layers and/or sections should not be limited by these terms.",
"These terms are only used to distinguish one element, component, region, layer or section from another region, layer or section.",
"Thus, a first element, component, region, layer or section discussed below could be termed a second element, component, region, layer or section without departing from the teachings of the invention.",
"Spatially relative terms, such as “beneath,” “below,” “lower,” “above,” “upper,” and the like, may be used herein for ease of description to describe one element or feature's relationship to another element(s) or feature(s) as illustrated in the figures.",
"It will be understood that the spatially relative terms are intended to encompass different orientations of the device in use or operation in addition to the orientation depicted in the figures.",
"For example, if the device in the figures is turned over, elements described as “below” or “beneath” other elements or features would then be oriented “above” the other elements or features.",
"Thus, the exemplary term “below” can encompass both an orientation of above and below.",
"The device may be otherwise oriented (rotated 90 degrees or at other orientations) and the spatially relative descriptors used herein interpreted accordingly.",
"Embodiments are described herein with reference to cross-section illustrations that are schematic illustrations of idealized embodiments (and intermediate structures).",
"As such, variations from the shapes of the illustrations as a result, for example, of manufacturing techniques and/or tolerances, are to be expected.",
"Thus, these embodiments should not be construed as limited to the particular shapes of regions illustrated herein but are to include deviations in shapes that result, for example, from manufacturing.",
"For example, an implanted region illustrated as a rectangle will, typically, have rounded or curved features and/or a gradient of implant concentration at its edges rather than a binary change from implanted to non-implanted region.",
"Likewise, a buried region formed by implantation may result in some implantation in the region between the buried region and the surface through which the implantation takes place.",
"Thus, the regions illustrated in the figures are schematic in nature and their shapes are not intended to illustrate the actual shape of a region of a device and are not intended to limit the scope of the invention.",
"“About” or “approximately” as used herein is inclusive of the stated value and means within an acceptable range of deviation for the particular value as determined by one of ordinary skill in the art, considering the measurement in question and the error associated with measurement of the particular quantity (i.e., the limitations of the measurement system).",
"For example, “about” can mean within one or more standard deviations, or within ±30%, 20%, 10%, 5% of the stated value.",
"Unless otherwise defined, all terms (including technical and scientific terms) used herein have the same meaning as commonly understood by one of ordinary skill in the art to which the invention belongs.",
"It will be further understood that terms, such as those defined in commonly used dictionaries, should be interpreted as having a meaning that is consistent with their meaning in the context of the relevant art and this specification and will not be interpreted in an idealized or overly formal sense unless expressly so defined herein.",
"Hereinafter, embodiments of the invention will be described with reference to the accompanying drawings.",
"FIGS.",
"1 to 8 are cross-sectional views illustrating an exemplary embodiment of a method of fabricating a wire grid polarizer, according to the invention.",
"Referring to FIG.",
"1, a conductive wire pattern layer 120a and a plurality of guide patterns 130, which form one or more trenches in the conductive wire pattern layer 120a, may be sequentially deposited on a substrate 110.The substrate 110 may transmit visible light therethrough.",
"The material of the substrate 110 may be appropriately selected in consideration of the purpose of use of the substrate 110 and the type of processes that the substrate 110 is subjected to.",
"In exemplary embodiments, for example, the substrate 110 may be formed of glass, quartz, acrylic, triacetylcellulose (“TAC”), cyclic olefin polymer (“COP”), cyclic olefin copolymer (“COC”), polycarbonate (“PC”), polyethylene naphthalate (“PET”), polyimide (“PI”), polyethylene naphthalate (“PEN”), polyether sulfone (“PES”) or polyarylate (“PAR”), but the invention is not limited thereto.",
"The substrate 110 may be implemented as an optical film member with flexibility.",
"The conductive wire pattern layer 120a may be formed of any of a number of conductive materials.",
"In an exemplary embodiment, the conductive wire pattern layer 120a may be formed of a metallic material.",
"More specifically, the conductive wire pattern layer 120a may be formed of one metal selected from aluminum (Al), chromium (Cr), silver (Ag), copper (Cu), nickel (Ni), titanium (Ti), cobalt (Co) and molybdenum (Mo) or an alloy thereof, but the invention is not limited thereto.",
"In an exemplary embodiment, the conductive wire pattern layer 120a may include two or more layers, for example, a first conductive wire pattern layer 121a and a second conductive wire pattern layer 122a.",
"More specifically, the first conductive wire pattern layer 121a and the second conductive wire pattern layer 122a may be formed of Al and Ti, respectively, but the invention is not limited thereto.",
"Where the first conductive wire pattern layer 121a is formed of Al, hillocks may be generated at the top of the conductive wire pattern layer 120a depending on the temperature in a subsequent process.",
"As a result of the hillocks generated at the top of the conductive wire pattern layer 120a, the top surface of a wire grid polarizer may become irregular, and the optical properties of the wire grid polarizer may deteriorate.",
"To reduce or effectively prevent the hillocks generated at the top of the conductive wire pattern layer 120a, the second conductive wire pattern layer 122a may be formed on the first conductive wire pattern layer 121a by using Ti so as to prevent the generation of hillocks.",
"The conductive wire pattern layer 120a may be formed by sputtering, chemical vapor deposition (“CVD”) or evaporation, but the invention is not limited thereto.",
"The guide patterns 130 may be relatively soft patterns formed of photoresist or an organic material, or relatively hard patterns formed of a metal or an inorganic material.",
"The guide patterns 130 may be formed by, for example, coating the substrate 110 with photoresist and subjecting the photoresist to exposure and development processes with the use of a mask.",
"To reduce the width of the photoresist, a trimming process may be additionally performed after the development process so as to reduce the width of the guide patterns 130.Referring to FIG.",
"1, the width of the guide patterns 130 is defined in the horizontal direction.",
"The guide patterns 130 may also be formed by, for example, coating the substrate 110 with photoresist, subjecting the photoresist to exposure and development processes with the use of a mask, forming an inorganic material layer, such as a silicon oxide layer or a silicon nitride layer, on the entire surface of the substrate 110, and performing selective etching such that parts of the inorganic material layer on the sides of the photoresist may form the guide patterns 130.Referring to FIG.",
"2, exposed surfaces of the conductive wire pattern layer 120a and the guide patterns 130 may be subjected to a hydrophobic treatment process.",
"The hydrophobic treatment process may involve forming a hydrophobic layer 131.The hydrophobic layer 131 may be, for example, a fluorine (F)-based (e.g., fluorinated) hydrophobic layer, but the invention is not limited thereto.",
"The hydrophobic layer 131 may be formed as a monolayer, but the invention is not limited thereto.",
"As used herein, “fluorinated” means a compound containing at least one fluorine atom.",
"The hydrophobic layer 131 may be formed by atomic layer deposition (“ALD”) for forming a monolayer, but the invention is not limited thereto.",
"That is, various methods for forming a thin layer, other than ALD, may be used to form the hydrophobic layer 131.In an exemplary embodiment, chemical ALD may be used to form the hydrophobic layer 131 on the sides of each of the guide patterns 130.Referring to FIG.",
"2, the hydrophobic layer 131 extends from the exposed surfaces of the conductive wire pattern layer 120a to be vertically disposed on the sides of each of the guide patterns 130.A plurality of trenches is defined by the guide patterns 130 and the conductive wire pattern layer 120a.",
"Referring to FIG.",
"3, a neutral layer 132 may be coated inside the trenches formed by the guide patterns 130 and the conductive wire pattern layer 120a.",
"The neutral layer 132 may include a random copolymer of the monomers of a block copolymer 140 (refer to FIG.",
"5) for a later alignment of the block copolymer 140, but the invention is not limited thereto.",
"In an exemplary embodiment, for example, the random copolymer may be a cross-linkable random copolymer.",
"Due to the effect of the surface energy during coating, the neutral layer 132 may be formed in a cross-sectional shape of a half-moon to be higher on trench sides than in the middle of each of the trenches formed by the guide patterns 130 and the conductive wire pattern layer 120a.",
"Referring to FIG.",
"4, the neutral layer 132 may be planarized.",
"The trenches formed by the guide patterns 130 and the conductive wire pattern layer 120a may be partially filled with the planarized neutral layer 132.The planarization of the neutral layer 132 may be appropriately controlled depending on a set of processing conditions such as including temperature.",
"The neutral layer 132 may be planarized until the contact angle between the neutral layer 132 and the hydrophobic layer 131 reaches the range of about 70 degrees to about 110 degrees.",
"When the contact angle between the neutral layer 132 and the hydrophobic layer 131 falls within the range of about 70 degrees to about 110 degrees, pattern irregularities that may be caused by the half-moon shape of the formed neutral layer 132 may be reduced or effectively prevented, and thus, a wire grid polarizer with excellent optical properties may be obtained.",
"When the contact angle between the neutral layer 132 and the hydrophobic layer 131 falls within the range of about 70 degrees to about 110 degrees, the neutral layer 132 may be cross-linked, and as a result, a planarized neutral layer 132 may be maintained.",
"The neutral layer 132 may be cross-linked by a thermal reaction or an optical reaction.",
"Referring to FIG.",
"5, the trenches formed by the guide patterns 130 and the conductive wire pattern layer 120a may be filled with a block copolymer 140 of two monomers with different etching rates.",
"Since the neutral layer 132 has been planarized to partially fill the trenches as illustrated in FIG.",
"4, the block copolymer 140 may be further formed in each of the trenches formed by the guide patterns 130 and the conductive wire pattern layer 120a to a uniform cross-sectional thickness.",
"An upper surface of the block copolymer 140 may be coplanar with an uppermost surface of the hydrophobic layer 131 on the guide patterns 130.The block copolymer 140 may be, for example, a polystyrene (“PS”)-polymethyl methacrylate (“PMMA”) block copolymer, but the invention is not limited thereto.",
"Referring to FIG.",
"6, the block copolymer 140 may be aligned as first monomer blocks 141 and second monomer blocks 142 through phase separation.",
"The first monomer blocks 141 and the second monomer blocks 142 may use materials that differ from each other not only in etching rate, but also in hydrophilicity or hydrophobicity.",
"Accordingly, the block copolymer 140 may be effectively aligned by forming the neutral layer 132 at the bottom of the block copolymer 140 and performing selective surface treatment for forming the hydrophobic layer 131 on the sides of the block copolymer 140.The alignment of the block copolymer 140 may be performed by thermal annealing or solvent annealing, but the invention is not limited thereto.",
"Even though solvent annealing, which involves performing annealing in a chamber containing a vaporized solvent, can reduce the amount of time to align the block copolymer 140, as compared to thermal annealing, which involves performing annealing while applying heat, one of thermal annealing and solvent annealing may be appropriately selected in consideration of the entire process layout for forming a wire grid polarizer.",
"Referring to FIG.",
"7, the second monomer blocks 142, which have a relatively high etching rate as compared to the first monomer blocks 141, may be selectively removed.",
"To selectively remove the second monomer blocks 142, an etching process, for example, dry etching, may be used, but the invention is not limited thereto.",
"A gas selected from 02, a fluorocarbon gas and hydrogen fluoride (HF) gas may be used in the etching process for selectively removing the second monomer blocks 142, but the invention is not limited thereto.",
"The fluorocarbon gas may be one or more selected from C4F8, CHF3, CH2F2, CF4 and C2F6, but the invention is not limited thereto.",
"Referring to FIG.",
"8, the conductive wire pattern layer 120a may be etched by using the first monomer blocks 141, which have a relatively low etching rate compared to the other formed layers on the substrate 110, and the guide patterns 130 as a mask.",
"As a result, multiple conductive wire patterns 120 may be formed to protrude from the substrate 110.Each collective conductive wire pattern 120 may include a plurality of wire pattern portions such as a first conductive wire pattern 121 and a second conductive wire pattern 122.Layers other than those in the conductive wire pattern layer 120a may be removed in the etching the first monomer blocks 141, to form the multiple conductive wire patterns 120.FIG.",
"9 is a vertical cross-sectional view of an exemplary embodiment of a wire grid polarizer according to the invention.",
"Referring to FIG.",
"9, a wire grid polarizer includes a substrate 110, a plurality of conductive wire patterns 120, which protrude from the substrate 110 side-by-side with one another.",
"The conductive wire patterns 120 of a collective conductive wire pattern layer include a plurality of first conductive wire patterns 121, respectively, and a plurality of second conductive wire patterns 122, respectively.",
"The wire grid polarizer also includes both a hydrophobic layer 131 and a neutral layer 132 among a hydrophobic layer 131 and a neutral layer 132, which are sequentially deposited on a portion of the second wire conductive wire patterns 122.That is, among the hydrophobic layer 131 and the neutral layer 132, a first portion of the second wire conductive wire patterns 122 excludes both the hydrophobic layer 131 and the neutral layer 132 while a second portion of the second wire conductive wire patterns 122 different from the first portion includes both the hydrophobic layer 131 and the neutral layer 132.The material of the substrate 110 may be appropriately selected in consideration of the purpose of use of the substrate 110 and the type of processes that the substrate 110 is subjected to during manufacturing of the wire grid polarizer.",
"In exemplary embodiments, for example, the substrate 110 may include glass, quartz, acrylic, TAC, COP, COC, PC, PET, PI, PEN, PES, or PAR, but the invention is not limited thereto.",
"The substrate 110 may be implemented as an optical film member with flexibility.",
"The conductive wire patterns 120 may be arranged side-by-side on the substrate 110 to have a uniform period.",
"Referring to FIG.",
"9, a period of the conductive wire patterns 120 may be defined as a horizontal distance between common positions of adjacent conductive wire patterns 120, but the invention is not limited thereto.",
"The smaller the period of the conductive wire patterns 120 becomes with regard the wavelength of incident light, the higher the polarization-to-extinction ratio of the conductive wire patterns 120 becomes.",
"However, as the period of the conductive wire patterns 120 decreases, fabrication of the conductive wire patterns 120 becomes more difficult in manufacturing the wire grid polarizer.",
"Visible light generally falls within the range of wavelengths of about 380 nanometers (nm) to about 780 nm.",
"Accordingly, in order for the wire grid polarizer to have a high extinction ratio for three primary colors of light, e.g., red (R), green (G) and blue (B), the conductive wire patterns 120 may have a period of about 200 nm or less to exhibit adequate polarization performance.",
"In order for the wire grid polarizer to provide at least equivalent polarization performance to a related-art polarizer, an exemplary embodiment of the conductive wire patterns 120 may have a period of about 120 nm or less.",
"The conductive wire patterns 120 may include any of a number of conductive materials.",
"In an exemplary embodiment, the conductive wire patterns 120 may include a metallic material.",
"More specifically, the conductive wire patterns 120 may include one metal selected from Al, Cr, Ag, Cu, Ni, Ti, Co and Mo or an alloy thereof, but the invention is not limited thereto.",
"More specifically, the first conductive wire patterns 121 and the second conductive wire patterns 122 may include Al and Ti, respectively, but the invention is not limited thereto.",
"Where the first conductive wire patterns 121 include Al, hillocks may be generated at the top of the conductive wire patterns 120 depending on the temperature in a subsequent process in manufacturing the wire grid polarizer.",
"As a result, the finally formed top surface of the wire grid polarizer may become irregular, and the optical properties of the finally formed wire grid polarizer may deteriorate.",
"To reduce or effectively prevent the hillocks generated at the top of the conductive wire patterns 120 during manufacturing of the wire grid polarizer, the second conductive wire patterns 122 may disposed on the first conductive wire patterns 121 including Ti.",
"The width of the conductive wire patterns 120 may be appropriately determined as long as the conductive wire patterns 120 exhibit adequate polarization performance.",
"Referring again to FIG.",
"9, the conductive wire patterns 120 may have a width in the horizontal direction of about 10 nm to about 20 nm, but the invention is not limited thereto.",
"The conductive wire patterns 120 may have a thickness in a vertical direction of FIG.",
"9 of about 10 nm to about 500 nm, but the invention is not limited thereto.",
"The hydrophobic layer 131 may be a F-based hydrophobic layer, but the invention is not limited thereto.",
"The hydrophobic layer 131 may be a monolayer, but the invention is not limited thereto.",
"The neutral layer 132 may include a random copolymer of the monomers of a block copolymer, for example, a cross-linked random copolymer, but the invention is not limited thereto.",
"In an exemplary embodiment of manufacturing the wire grid polarizer, the hydrophobic layer 131 and the neutral layer 132 may be formed by using the block copolymer as a mask.",
"In this exemplary embodiment, neither the hydrophobic layer 131 nor the neutral layer 132 is formed on (e.g., overlapping) one or more second conductive wire patterns 122 that are masked by guide patterns.",
"Referring to FIG.",
"9, for example, portions of the hydrophobic layer 131 and the neutral layer 132 are disposed on some of the conductive wire patterns 120, while not being disposed on others of the conductive wire patterns 120.That is, during manufacturing of a wire grid polarizer, guide patterns masked those other conductive wire patterns 120 on which the hydrophobic layer 131 and the neutral layer 132 are not disposed.",
"That is, one or more conductive wire patterns 120 with the hydrophobic layer 131 and the neutral layer 132 disposed thereon may be arranged to periodically appear on the substrate 110.FIG.",
"10 is a vertical cross-sectional view of another exemplary embodiment of a wire grid polarizer according to the invention.",
"Referring to FIG.",
"10, a wire grid polarizer includes a substrate 110, a plurality of conductive wire patterns 120, which protrude from the substrate 110 side-by-side with one another.",
"The conductive wire patterns 120 of a collective conductive wire pattern layer include a plurality of first conductive wire patterns 121, respectively, and a plurality of second conductive wire patterns 122, respectively, and only a hydrophobic layer 131 among a hydrophobic layer 131 and a neutral layer 132, is disposed on a portion of the second wire conductive wire patterns 122.The wire grid polarizer of FIG.",
"10 is the same as the wire grid polarizer of FIG.",
"9 except for not including (e.g., excluding) the neutral layer 132, and thus, a detailed description thereof will be omitted.",
"FIG.",
"11 is a vertical cross-sectional view of an exemplary embodiment of a display device according to the invention.",
"Referring to FIG.",
"11, a liquid crystal display (“LCD”) device 10 may include a backlight unit 11, which emits light, a liquid crystal panel (12, 13, 14, 15), which is deposited on the backlight unit 11 and includes a lower display substrate 12, a lower polarizing plate 13, a liquid crystal layer 14 and an upper display substrate 15, and an upper polarizing plate 16, which is disposed on the liquid crystal panel (12, 13, 14, 15).",
"The transmission axes of the lower polarizing plate 13 and the upper polarizing plate 16 may be orthogonal or parallel to each other.",
"The LCD device 10 is illustrated in FIG.",
"11 as having both the upper polarizing plate 16 and the lower polarizing plate 13, but the invention is not limited thereto.",
"That is, the upper polarizing plate 16 may be optional.",
"The backlight unit 11 may include a light guide plate (“LGP”) (not illustrated), a light source unit (not illustrated), a reflective member (not illustrated) and one or more optical sheets (not illustrated).",
"The LGP, which changes the path of light emitted from the light source unit so as for the light to be transmitted toward the liquid crystal layer 14, may include a light incidence surface upon which light is incident and a light emission surface through which light is emitted toward the liquid crystal layer 14.The LGP may include a light-transmissive material with a predetermined refractive index, such as PMMA or PC, but the invention is not limited thereto.",
"Light incident upon one or both sides of the LGP may have a smaller incidence angle than the critical angle of the LGP, and may thus enter the LGP.",
"On the other hand, light incident upon the top or bottom surface of the LGP may have a greater incidence angle than the critical angle of the LGP, and may thus be evenly distributed within the LGP, instead of being emitted outward from the LGP.",
"A plurality of diffusion patterns may be disposed on one of the top and bottom surfaces of the LGP, for example, the bottom surface of the LGP that is opposite to and faces the emission surface, so as for guided light to be emitted upwards.",
"More specifically, in order for light transmitted inside the LGP to be emitted upwards towards the liquid crystal layer 14, the diffusion patterns may be disposed on one surface of the LGP.",
"In a method of manufacturing the LCD device 10, the diffusion patterns may be disposed on one surface of the LGP through, for example, printing with the use of ink, but the invention is not limited thereto.",
"That is, in a method of manufacturing the LCD device 10, fine grooves or protrusions may be formed on the LGP as the diffusion patterns, or various other modifications may be made to the diffusion patterns without departing from the scope of the invention.",
"A reflective member (not illustrated) may be additionally provided between the LGP and a lower accommodating member (not illustrated).",
"The reflective member reflects light emitted from the bottom surface of the LGP, which is opposite to, and faces, the emission surface of the LGP, and thus applies the light back to the LGP.",
"The reflective member may be a thin film, but the invention is not limited thereto.",
"The light source unit may be disposed to face the incidence surface of the LGP.",
"The number of light source units provided may be appropriately adjusted.",
"In an exemplary embodiment, for example, one light source unit may be provided on only one side of the LGP.",
"Alternatively, three or more light source units may be provided to correspond to three or more sides, respectively, of the LGP.",
"Still alternatively, a plurality of light source units may be provided to correspond to only one side of the LGP.",
"The backlight unit has been described above, taking as an example a side or edge light-type backlight unit in which a light source unit is provided on the side of an LGP, but the invention is not limited thereto.",
"That is, the invention is also applicable to a direct-type backlight unit or another light source device, such as a surface-type light source device.",
"The light source unit may include a white light-emitting diode (“LED”), which emits white light, or a plurality of LEDs, which emit R light, G light and B light.",
"In response to the light source unit including a plurality of LEDs, which emit R light, G light and B light, white light may be realized by turning on all the LEDs to mix the R light, G light, and B light together.",
"The lower polarizing plate 13 may be disposed on the lower display substrate 12.In an exemplary embodiment, for example, the lower display substrate 12 may include a plurality of conductive wire patterns, which protrude from a base substrate including a transparent insulating material such as glass or plastics, side-by-side with one another, may be disposed, as illustrated in FIG.",
"8, a passivation layer may be disposed on the conductive wire patterns by using an insulating material, and one or more thin-film transistors (“TFTs”) and one or more pixel electrodes may be disposed on the passivation layer.",
"Each of the TFTs includes a gate electrode, a gate insulating layer, a semiconductor layer, a resistive contact layer and source/drain electrodes.",
"The pixel electrodes, which are electric field-generating electrodes, include a transparent conductive oxide such as indium tin oxide (“ITO”) or indium zinc oxide (“IZO”).",
"The upper display substrate 15 may be a color filter (“CF”) substrate.",
"In an exemplary embodiment, for example, the upper display substrate 15 may include a black matrix, which is provided at, and reduces or effectively prevents light from leaking from, the bottom of a base substrate including a transparent insulating material such as glass or plastic, R, G and B CFs, and a common electrode, which is an electric field generating electrode including a transparent conductive oxide such as ITO or IZO.",
"Plastic substrates may be used as the base substrates of the lower display substrate 12 and the upper display substrate 15.The plastic substrates may include one of PET, PC, PI, PEN, PES, PAR and COC, but the invention is not limited thereto.",
"The lower display substrate 12 and the upper display substrate 15 may include a flexible material.",
"The liquid crystal layer 14, which rotates the polarization axis of incident light, is aligned in a predetermined direction and is disposed between the upper display substrate 15 and the lower display substrate 12.The liquid crystal layer 14 may be of a twisted nematic (“TN”) mode, a vertical alignment (“VA”) mode, or a horizontal alignment mode (such as an in-plane switching (“IPS”) mode or a fringe field switching (“FFS”) mode) with positive dielectric anisotropy.",
"The invention has been described above, taking an LCD device as an example, but one or more exemplary embodiment of the invention is also applicable to various other display devices such as an organic light-emitting display device not requiring additional light sources or an LGP, or a plasma display device using plasma.",
"While the invention has been particularly shown and described with reference to exemplary embodiments thereof, it will be understood by those of ordinary skill in the art that various changes in provide and detail may be made therein without departing from the spirit and scope of the invention as defined by the following claims.",
"The exemplary embodiments should be considered in a descriptive sense only and not for purposes of limitation."
]
] |
Patent_15871186
|
[
[
"FKBP52-TAU INTERACTION AS A NOVEL THERAPEUTICAL TARGET FOR TREATING THE NEUROLOGICAL DISORDERS INVOLVING TAU DYSFUNCTION",
"The invention relates generally to neuroprotection and repair in neurological disorders involving Tau dysfunction (including Alzheimer's disease).",
"The invention describes AND INCLUDES a direct interaction between proteins FKBP52 and Tau.",
"More particularly, the invention relates to a method for screening a drug for the prevention and treatment of neurological disorders involving Tau dysfunction comprising the following steps: a) determining the ability of a candidate compound, to modulate the interaction between a Tau polypeptide and a FKBP52 polypeptide and b) selecting positively the candidate compound that modulates said interaction.",
"The present invention finally relates to diagnostic, prognostic, and monitoring assays of neurological disorders involving Tau dysfunction."
],
[
"1-10.",
"(canceled) 11.A method of treating neurological disorders involving Tau dysfunction, in a subject thought to have or be predisposed to having a neurological disorder involving Tau dysfunction, comprising the administration to said subject of an effective amount of a compound which enhances the interaction between Tau and FKBP52 proteins, so as to prevent aggregation of Tau protein.",
"12.The method according to claim 11, wherein the neurological disorders involving Tau dysfunction are selected from the group consisting of Alzheimer's disease, frontotemporal dementia, progressive supranuclear palsy, corticobasal degeneration and frontotemporal lobar degeneration.",
"13.The method according to claim 11, wherein said compound is combined with pharmaceutically acceptable excipients.",
"14.The method according to claim 11, wherein the compound is selected among candidate compounds by a screening method comprising the steps of: a) determining the ability of the candidate compound to enhance the interaction between Tau and FKBP52 proteins, and b) selecting positively the candidate compound if the candidate compound enhances said interaction.",
"15.A method of treating Alzheimer disease comprising the administration to a subject in need thereof of an therapeutically effective amount of a compound that modulate both the interaction between Tau and FKBP52 proteins and the interaction between FKBP52 and APP proteins."
],
[
"<SOH> BACKGROUND OF THE INVENTION <EOH>The Tau protein is a major Microtubule Associated Protein (MAP) widely expressed in the central nervous system, predominantly in neurons, where it plays a key role in regulating microtubule dynamics, axonal transport and neurite outgrowth.",
"Protein Tau occurs in the adult human brain under six different isoforms generated by alternative splicing of exons 2, 3 and 10 of a primary transcript of a unique gene located on chromosome 17.The length of their sequences varies from 352 to 441 amino acids.",
"Growing evidence suggests that aberrant assembly of “aggregated” Tau (natively unfolded protein) is a hallmark of a series of human cognitive diseases collectively referred to as tauopathies or neurological disorders involving Tau dysfunction, which include Alzheimer's disease, Pick's disease, corticobasal degeneration, mild cognitive impairment, progressive supranuclear palsy, and frontotemporal dementia with chromosome 17-linked parkinsonism.",
"Abnormalities of Tau such as hyperphosphorylation, mutation, truncation and the aggregation in “tangles” may be contributing factors to the pathogenic processes.",
"To date the role of Tau modifications in the induction of neurodegenerative diseases is not fully understood and deciphering the molecular mechanism(s) which control(s) Tau structure/function is therefore of great interest and may help to find novel therapeutic approaches for these diseases.",
"The instant invention is based on the discovery that Tau protein (all 6 isoforms) binds specifically and directly the immunophilin FKBP52 (FK506-Binding Protein).",
"FKBPs are a family of ubiquitously expressed intracellular receptors for the powerful immunosuppressant drugs FK506 and Rapamycin and therefore take place in the large group of proteins known as immunophilins.",
"These proteins show a large distribution and are particularly abundant in the nervous system suggesting novel and unexpected functions distinct from their immunomodulatory effects.",
"In addition, neuroprotective effects of FK506 have been reported.",
"These latter observations have provided new perspectives for the FKBP protein family and a particular interest for FK506 and its non immunosuppressive derivative molecules as factors to devise new therapeutic assay for treating lesions and diseases of the nervous system.",
"FKBP52, first identified and cloned as associated to steroid receptor (Lebeau et al., 1992), presents a modular organization.",
"including four individual and functional domains (Callebaut et al., 1992).",
"The FK506 binding site of FKBP52 (domain I) localized in the N-terminal part of the protein (aa 1 to 149) contains a peptidyl prolyl-isomerase (PPIase) activity (Chambraud et al., 1993) characteristic of all immunophilin protein family.",
"While the second domain (aa 149 to 267) shares structural homology with domain I, the PPIase activity is residual and it does not bind FK506 (14,15); a noteworthy aspect of domain II is a consensus ATP-GTP-binding sequence (16).",
"The C-terminal domain, covering domains III and IV, includes a putative calmodulin binding site (Massol et al., 1992) and mediates, through its three tetratricopeptide repeat (TPR) (aa 273 to 389) the protein's interaction with HSP90 (Radanyi et al., 1994) which is also a component of steroid receptor complex (Catelli et al., 1980, Tai et al., 1986; Renoir et al., 1990).",
"In addition the binding activity of FKBP52 with HSP90 is regulated by casein kinase II which specifically phosphorylates FKBP52 (Myata et al., 1997).",
"Recently it has been reported that FKBP52 interacts with microtubules and prevents tubulin polymerization (Chambraud et al., 2007).",
"Results obtained so far suggest that this inhibition of tubulin polymerization by FKBP52 may not only result from the sequestration of tubulin or from a modification of its structure, such a bending, by FKBP52, but that another important factor required in the assembling of tubulin into microtubules may be involved.",
"The inventors now postulate herein that the intervention of one or more microtubule stabilizing factor(s), such as microtubule-associated proteins (MAPS), could explain the inhibition of tubulin polymerization by FKBP52.Using classical biochemical and cellular approaches they establish solid foundations to the role of FKBP52 on Tau function and discover a direct and specific interaction between FKBP52 and Tau.",
"This FKBP52-Tau interaction results in the modulation of the known Tau-mediated cellular functions such as: tubulin polymerization (FKBP52 inhibits this function), Tau accumulation (FKBP52 inhibits this accumulation) and neurite outgrowth."
],
[
"<SOH> SUMMARY OF THE INVENTION <EOH>The inventors have discovered a direct and specific protein-protein interaction between the immunophilin FKBP52 and the microtubule associated protein Tau (under all of its known isoforms, hyperphosphorylated or not).",
"The invention establishes that the FKBP52-Tau interaction provides a new target that may be used advantageously for novel therapeutic approaches of neurological disorders involving Tau dysfunction, and especially for Alzheimer's disease.",
"Therefore invention provides methods for identifying molecules that modulate the FKBP52-Tau interaction, therefore acting beneficially onto the detrimental effects of the neurological disorders involving Tau dysfunction.",
"The molecules identified via the method of the invention for their ability to modulate the interaction between Tau and FKBP52 are drug candidates for the prevention and treatment of neurological disorders involving Tau dysfunction and in particular for the Alzheimer's disease.",
"The invention also establishes that the FKBP52-Tau interaction provides a biological marker, potentially involved in diagnostic, prognostic, clinical follow-ups."
],
[
"FIELD OF THE INVENTION The invention relates generally to neuroprotection and repair in neurological disorders involving Tau dysfunction (including Alzheimer's disease).",
"The invention describes a direct interaction between proteins FKBP52 and Tau.",
"The invention relates to a screening method for molecules acting on FKBP52-Tau interaction, in order to modulate the detrimental effects of pathogenic Tau.",
"The present invention finally relates to therapeutical diagnostic, prognostic, and monitoring assays of neurological disorders involving Tau dysfunction.",
"BACKGROUND OF THE INVENTION The Tau protein is a major Microtubule Associated Protein (MAP) widely expressed in the central nervous system, predominantly in neurons, where it plays a key role in regulating microtubule dynamics, axonal transport and neurite outgrowth.",
"Protein Tau occurs in the adult human brain under six different isoforms generated by alternative splicing of exons 2, 3 and 10 of a primary transcript of a unique gene located on chromosome 17.The length of their sequences varies from 352 to 441 amino acids.",
"Growing evidence suggests that aberrant assembly of “aggregated” Tau (natively unfolded protein) is a hallmark of a series of human cognitive diseases collectively referred to as tauopathies or neurological disorders involving Tau dysfunction, which include Alzheimer's disease, Pick's disease, corticobasal degeneration, mild cognitive impairment, progressive supranuclear palsy, and frontotemporal dementia with chromosome 17-linked parkinsonism.",
"Abnormalities of Tau such as hyperphosphorylation, mutation, truncation and the aggregation in “tangles” may be contributing factors to the pathogenic processes.",
"To date the role of Tau modifications in the induction of neurodegenerative diseases is not fully understood and deciphering the molecular mechanism(s) which control(s) Tau structure/function is therefore of great interest and may help to find novel therapeutic approaches for these diseases.",
"The instant invention is based on the discovery that Tau protein (all 6 isoforms) binds specifically and directly the immunophilin FKBP52 (FK506-Binding Protein).",
"FKBPs are a family of ubiquitously expressed intracellular receptors for the powerful immunosuppressant drugs FK506 and Rapamycin and therefore take place in the large group of proteins known as immunophilins.",
"These proteins show a large distribution and are particularly abundant in the nervous system suggesting novel and unexpected functions distinct from their immunomodulatory effects.",
"In addition, neuroprotective effects of FK506 have been reported.",
"These latter observations have provided new perspectives for the FKBP protein family and a particular interest for FK506 and its non immunosuppressive derivative molecules as factors to devise new therapeutic assay for treating lesions and diseases of the nervous system.",
"FKBP52, first identified and cloned as associated to steroid receptor (Lebeau et al., 1992), presents a modular organization.",
"including four individual and functional domains (Callebaut et al., 1992).",
"The FK506 binding site of FKBP52 (domain I) localized in the N-terminal part of the protein (aa 1 to 149) contains a peptidyl prolyl-isomerase (PPIase) activity (Chambraud et al., 1993) characteristic of all immunophilin protein family.",
"While the second domain (aa 149 to 267) shares structural homology with domain I, the PPIase activity is residual and it does not bind FK506 (14,15); a noteworthy aspect of domain II is a consensus ATP-GTP-binding sequence (16).",
"The C-terminal domain, covering domains III and IV, includes a putative calmodulin binding site (Massol et al., 1992) and mediates, through its three tetratricopeptide repeat (TPR) (aa 273 to 389) the protein's interaction with HSP90 (Radanyi et al., 1994) which is also a component of steroid receptor complex (Catelli et al., 1980, Tai et al., 1986; Renoir et al., 1990).",
"In addition the binding activity of FKBP52 with HSP90 is regulated by casein kinase II which specifically phosphorylates FKBP52 (Myata et al., 1997).",
"Recently it has been reported that FKBP52 interacts with microtubules and prevents tubulin polymerization (Chambraud et al., 2007).",
"Results obtained so far suggest that this inhibition of tubulin polymerization by FKBP52 may not only result from the sequestration of tubulin or from a modification of its structure, such a bending, by FKBP52, but that another important factor required in the assembling of tubulin into microtubules may be involved.",
"The inventors now postulate herein that the intervention of one or more microtubule stabilizing factor(s), such as microtubule-associated proteins (MAPS), could explain the inhibition of tubulin polymerization by FKBP52.Using classical biochemical and cellular approaches they establish solid foundations to the role of FKBP52 on Tau function and discover a direct and specific interaction between FKBP52 and Tau.",
"This FKBP52-Tau interaction results in the modulation of the known Tau-mediated cellular functions such as: tubulin polymerization (FKBP52 inhibits this function), Tau accumulation (FKBP52 inhibits this accumulation) and neurite outgrowth.",
"SUMMARY OF THE INVENTION The inventors have discovered a direct and specific protein-protein interaction between the immunophilin FKBP52 and the microtubule associated protein Tau (under all of its known isoforms, hyperphosphorylated or not).",
"The invention establishes that the FKBP52-Tau interaction provides a new target that may be used advantageously for novel therapeutic approaches of neurological disorders involving Tau dysfunction, and especially for Alzheimer's disease.",
"Therefore invention provides methods for identifying molecules that modulate the FKBP52-Tau interaction, therefore acting beneficially onto the detrimental effects of the neurological disorders involving Tau dysfunction.",
"The molecules identified via the method of the invention for their ability to modulate the interaction between Tau and FKBP52 are drug candidates for the prevention and treatment of neurological disorders involving Tau dysfunction and in particular for the Alzheimer's disease.",
"The invention also establishes that the FKBP52-Tau interaction provides a biological marker, potentially involved in diagnostic, prognostic, clinical follow-ups.",
"DETAILED DESCRIPTION OF THE INVENTION Screening Methods of the Invention A first object of the invention consists of a method for screening a drug for the prevention and treatment of neurological disorders involving Tau dysfunction comprising the following steps: a) determining the ability of a candidate compound to modulate the interaction between a Tau polypeptide and a FKBP52 polypeptide and b) selecting positively the candidate compound that modulates said interaction.",
"As used herein the term “neurological disorders involving Tau dysfunction” includes but is not limited to Alzheimer's disease, frontotemporal dementia, progressive supranuclear palsy, corticobasal degeneration and frontotemporal lobar degeneration, also known as Pick's disease, as well as all neurological disorders which might, in the future, prove to involve Tau, such as the Parkinson disease for instance.",
"In the context of the invention, the term “treating” or “treatment”, as used herein, means reversing, alleviating, or inhibiting the progress of the disorder or condition to which such term applies, or one or more symptoms of such disorder or condition.",
"As used herein, the term “prevention” refers to preventing the disease or condition from occurring in a subject which has not yet been diagnosed as having it.",
"As used herein the expression “a compound that modulates the interaction between FKBP52 and Tau” refers any compound having the capability to inhibit, decrease or enhance the interaction between protein Tau and protein FKBP52.At step a), any method suitable for the screening of protein-protein interactions is suitable.",
"Whatever the embodiment of step a) of the screening method, the complete Tau protein and the complete FKBP52 protein may be used as the binding partners.",
"Alternatively, fragments of Tau protein and FKBP52 protein that include the site of interaction may be uses as the binding partners.",
"Therefore in one embodiment step a) of the screening method of the invention consists of the following steps: a1) bringing into contact the candidate compound to be tested with a mixture of a first Tau polypeptide or a substantially homologous or substantially similar amino acid sequence thereof and (2) a second FKBP52 polypeptide or a substantially homologous or substantially similar amino acid sequence thereof a2) determining the ability of said candidate compound to modulate the binding between said Tau polypeptide and said second FKBP52 polypeptide.",
"The term “polypeptide” means herein a polymer of amino acids having no specific length.",
"Thus, peptides, oligopeptides and proteins are included in the definition of “polypeptide” and these terms are used interchangeably throughout the specification, as well as in the claims.",
"The term “polypeptide” does not exclude post-translational modifications that include but are not limited to phosphorylation, acetylation, glycosylation.",
"and the like.",
"Especially, the term includes all phosphoryaled forms of the polypeptide (e.g.",
"all phosphorylated forms of Tau or FKBP52).",
"Also encompassed by this definition of “polypeptide” are homologs thereof.",
"Accordingly, the term “Tau polypeptide” refers to the Tau protein or a fragment thereof that comprises the site of interaction with FKBP52 protein.",
"In the same manner, the term “FKBP52 polypeptide” refers to the FKBP52 protein or a fragment thereof that comprises the site of interaction with Tau protein.",
"Two amino acid sequences are “substantially homologous” or “substantially similar” when greater than 80%, preferably greater than 85%, preferably greater than 90% of the amino acids are identical, or greater than about 90%, preferably grater than 95%, are similar (functionally identical).",
"The term “sequence identity” refers to the identity between two peptides.",
"Identity between sequences can be determined by comparing a position in each of the sequences which may be aligned for the purposes of comparison.",
"When a position in the compared sequences is occupied by the same base or amino acid, then the sequences are identical at that position.",
"A degree of sequence identity between nucleic acid sequences is a function of the number of identical nucleotides at positions shared by these sequences.",
"A degree of identity between amino acid sequences is a function of the number of identical amino acid sequences that are shared between these sequences.",
"To determine the percent identity of two amino acids sequences or two nucleic acid sequences, the sequences are aligned for optimal comparison.",
"For example, gaps can be introduced in the sequence of a first amino add sequence or a first nucleic acid sequence for optimal alignment with the second amino acid sequence or second nucleic acid sequence.",
"The amino acid residues or nucleotides at corresponding amino acid positions or nucleotide positions are then compared.",
"When a position in the first sequence is occupied by the same amino acid residue or nucleotide as the corresponding position in the second sequence, the molecules are identical at that position.",
"The percent identity between the two sequences is a function of the number of identical positions shared by the sequences.",
"In this comparison the sequences can be the same length or may be different in length.",
"Optimal alignment of sequences for determining a comparison window may be conducted by the local homology algorithm of Smith and Waterman (J. Theor.",
"Biol., 91 (2) pgs.",
"370-380 (1981), by the homology alignment algorithm of Needleman and Wunsch, J. Miol.",
"Biol., 48(3) pgs.",
"443-453 (1972), by the search for similarity via the method of Pearson and Lipman, PNAS, USA, 85(5) pgs.",
"2444-2448 (1988), by computerized implementations of these algorithms (GAP, BESTFIT, FASTA and TFASTA in the Wisconsin Genetics Software Package Release 7.0, Genetic Computer Group, 575, Science Drive, Madison, Wis.) or by inspection.",
"The term “sequence similarity” means that amino acids can be modified while retaining the same function.",
"It is known that amino acids are classified according to the nature of their side groups and some amino adds such as the basic amino acids can be interchanged for one another while their basic function is maintained.",
"In one embodiment the step a2) consists in generating physical values which illustrate or not the ability of said candidate compound to modulate the interaction between said first polypeptide and said second polypeptide and comparing said values with standard physical values obtained in the same assay performed in the absence of the said candidate compound.",
"The “physical values” that are referred to above may be of various kinds depending of the binding assay that is performed, but notably encompass light absorbance values, radioactive signals and intensity value of fluorescence signal.",
"If after the comparison of the physical values with the standard physical values, it is determined that the said candidate compound modulates the binding between said first polypeptide and said second polypeptide, then the candidate is positively selected at step b).",
"The compounds that modulate the interaction between (i) the Tau polypeptide and (ii) the FKBP52 polypeptide encompass those compounds that bind either to the Tau polypeptide or to FKBP52 polypeptide, provided that the binding of the said compounds of interest then modulates the interaction between Tau and FKBP52.Polypeptides of the invention may be produced by any technique known per se in the art, such as without limitation, any chemical, biological, genetic or enzymatic technique, either alone or in combination(s).",
"Knowing the amino acid sequence of the desired sequence, one skilled in the art can readily produce said polypeptides, by standard techniques for production of polypeptides.",
"For instance, they can be synthesized using well-known solid phase method, preferably using a commercially available peptide synthesis apparatus (such as that made by Applied Biosystems, Foster City, Calif.) and following the manufacturer's instructions.",
"Alternatively, the polypeptides of the invention can be synthesized by recombinant DNA techniques as is now well-known in the art.",
"For example, these fragments can be obtained as DNA expression products after incorporation of DNA sequences encoding the desired (poly)peptide into expression vectors and introduction of such vectors into suitable eukaryotic or prokaryotic hosts that will express the desired polypeptide, from which they can be later isolated using well-known techniques.",
"A wide variety of host/expression vector combinations are employed in expressing the nucleic acids encoding for the polypeptides of the present invention.",
"Useful expression vectors that can be used include, for example, segments of chromosomal, non-chromosomal and synthetic DNA sequences.",
"Suitable vectors include, but are not limited to, derivatives of SV40 and pcDNA and known bacterial plasmids such as col EI, pCR1, pBR322, pMal-C2, pET, pGEX, pMB9 and derivatives thereof, plasmids such as RP4, phage DNAs such as the numerous derivatives of phage I such as NM989, as well as other phage DNA such as M13 and filamentous single stranded phage DNA; yeast plasmids such as the 2 microns plasmid or derivatives of the 2 microns plasmid, as well as centomeric and integrative yeast shuttle vectors; vectors useful in eukaryotic cells such as vectors useful in insect or mammalian cells; vectors derived from combinations of plasmids and phage DNAs, such as plasmids that have been modified to employ phage DNA or the expression control sequences; and the like.",
"Consequently, mammalian and typically human cells, as well as bacterial, yeast, fungi, insect, nematode and plant cells an used in the present invention and may be transfected by the nucleic acid or recombinant vector as defined herein.",
"Examples of suitable cells include, but are not limited to, VERO cells, HELA cells such as ATCC No.",
"CCL2, CHO cell lines such as ATCC No.",
"CCL61, COS cells such as COS-7 cells and ATCC No.",
"CRL 1650 cells, W138, BHK, HepG2, 3T3 such as ATCC No.",
"CRL6361, A549, PC12, K562 cells, 293T cells, Sf9 cells such as ATCC No.",
"CRL1711 and Cv1 cells such as ATCC No.",
"CCL70.Other suitable cells that can be used in the present invention include, but are not limited to, prokaryotic host cells strains such as Escherichia coli, (e.g., strain DH5-[alpha]), Bacillus subtilis, Salmonella typhimurium, or strains of the genera of Pseudomonas, Streptomyces and Staphylococcus.",
"Further suitable cells that can be used in the present invention include yeast cells such as those of Saccharomyces such as Saccharomyces cerevisiae.",
"In one embodiment, any Tau derived or FKBP52 polypeptide of the invention is labelled with a detectable molecule for the screening purposes.",
"According to the invention, said detectable molecule may consist of any compound or substance that is detectable by spectroscopic, photochemical, biochemical, immunochemical or chemical means.",
"For example, useful detectable molecules include radioactive substance (including those comprising 32P, 25S, 3H, or 1251), fluorescent dyes (including 5-bromodesosyrudin, fluorescein, acetylaminofluorene or digoxigenin), fluorescent proteins (including GFPs and YFPs), or detectable proteins or peptides (including biotin, polyhistidine tails or other antigen tags like the HA antigen, the FLAG antigen, the c-myc antigen and the DNP antigen).",
"According to the invention, the detectable molecule is located at, or bound to, an amino acid residue located outside the said amino acid sequence of interest, in order to minimise or prevent any artefact for the binding between said polypeptides or between the candidate compound and or any of said polypeptides.",
"In another particular embodiment, the polypeptides of the invention are fused with a GST tag (Glutathione S-transferase).",
"In this embodiment, the GST moiety of the said fusion protein may be used as detectable molecule.",
"In the said fusion protein, the GST may be located either at the N-terminal end or at the C-terminal end.",
"The GST detectable molecule may be detected when it is subsequently brought into contact with an anti-GST antibody, including with a labelled anti-GST antibody.",
"Anti-GST antibodies labelled with various detectable molecules are easily commercially available.",
"In another particular embodiment, the polypeptides of the invention are fused with a poly-histidine tag.",
"Said poly-histidine tag usually comprises at least four consecutive hisitidine residues and generally at least six consecutive histidine residues.",
"Such a polypeptide tag may also comprise up to 20 consecutive histidine residues.",
"Said poly-histidine tag may be located either at the N-terminal end or at the C-terminal end In this embodiment, the poly-histidine tag may be detected when it is subsequently brought into contact with an anti-poly-histidine antibody, including with a labelled anti-poly-histidine antibody.",
"Anti-poly-histidine antibodies labelled with various detectable molecules are easily commercially available.",
"In a further embodiment, the polypeptides of the invention are fused with a protein moiety consisting of either the DNA binding domain or the activator domain of a transcription factor.",
"Said protein moiety domain of transcription may be located either at the N-terminal end or at the C-terminal end.",
"Such a DNA binding domain may consist of the well-known DNA binding domain of LexA protein originating form E. Coli.",
"Moreover said activator domain of a transcription factor may consist of the activator domain of the well-known Gal4 protein originating from yeast.",
"In one embodiment of the screening method according to the invention, the first Tau polypeptide and second FKBP52 polypeptide as described above, comprise a portion of a transcription factor.",
"In said assay, the binding together of the first and second portions generates a functional transcription factor that binds to a specific regulatory DNA sequence, which in turn induces expression of a reporter DNA sequence, said expression being further detected and/or measured.",
"A positive detection of the expression of said reporter DNA sequence means that an active transcription factor is formed, due to the binding together of said first Tau polypeptide and second FKBP52 polypeptide polypeptide.",
"Usually, in a two-hybrid assay, the first and second portion of a transcription factor consist respectively of (i) the DNA binding domain of a transcription factor and (ii) the activator domain of a transcription factor.",
"In some embodiments, the DNA binding domain and the activator domain both originate from the same naturally occurring transcription factor.",
"In some embodiments, the DNA binding domain and the activator domain originate from distinct naturally occurring factors, while, when bound together, these two portions form an active transcription factor.",
"The term “portion” when used herein for transcription factor, encompass complete proteins involved in multi protein transcription factors, as well as specific functional protein domains of a complete transcription factor protein.",
"Therefore in one embodiment of the invention, step a) of the screening method of the invention comprises the following steps: (1) providing a host cell expressing: a first fusion polypeptide between (i) a Tau polypeptide as define above and (ii) a first protein portion of transcription factor a second fusion polypeptide between (i) a FKBP52 polypeptide as defined above and (ii) a second portion of a transcription factor said transcription factor being active on DNA target regulatory sequence when the first and second protein portion are bound together and said host cell also containing a nucleic acid comprising (i) a regulatory DNA sequence that may be activated by said active transcription factor and (ii) a DNA report sequence that is operatively linked to said regulatory sequence (2) bringing said host cell provided at step 1) into contact with a candidate compound to be tested (3) determining the expression level of said DNA reporter sequence The expression level of said DNA reporter sequence that is determined at step (3) above is compared with the expression of said DNA reporter sequence when step (2) is omitted.",
"A different expression level of said DNA reporter sequence in the presence of the candidate compound means that the said candidate compound effectively modulates the binding between the Tau polypeptide and the FKBP52 polypeptide and that said candidate compound may be positively selected a step b) of the screening method.",
"Suitable host cells include, without limitation, prokaryotic cells (such as bacteria) and eukaryotic cells (such as yeast cells, mammalian cells, insect cells, plant cells, etc.).",
"However preferred host cell are yeast cells and more preferably a Saccharomyces cerevisiae cell or a Schizosaccharomyces pombe cell.",
"Similar systems of two-hybrid assays are well know in the art and therefore can be used to perform the screening method according to the invention (see.",
"Fields et al.",
"1989; Vasavada et al.",
"1991; Fearon et al.",
"1992; Dang et al., 1991, Chien et al.",
"1991, U.S. Pat.",
"No.",
"5,283,173, U.S. Pat.",
"No.",
"5,667,973, U.S. Pat.",
"No.",
"5,468,614, U.S. Pat.",
"No.",
"5,525,490 and U.S. Pat.",
"No.",
"5,637,463).",
"For instance, as described in these documents, the Gal4 activator domain can be used for performing the screening method according to the invention.",
"Gal4 consists of two physically discrete modular domains, one acting as the DNA binding domain, the other one functioning as the transcription-activation domain.",
"The yeast expression system described in the foregoing documents takes advantage of this property.",
"The expression of a Gal1-LacZ reporter gene under the control of a Gal4-activated promoter depends on the reconstitution of Gal4 activity via protein-protein interaction.",
"Colonies containing interacting polypeptides are detected with a chromogenic substrate for β-galactosidase.",
"A compete kit (MATCHMAKER, TM) for identifying protein-protein interactions is commercially available from Clontech.",
"So in one embodiment, a first Tau polypeptide as above defined is fused to the DNA binding domain of Gal4 and the second FKBP52 polypeptide as above defined is fused to the activation domain of Gal4.The expression of said detectable marker gene may be assessed by quantifying the amount of the corresponding specific mRNA produced.",
"However, usually the detectable marker gene sequence encodes for detectable protein, so that the expression level of the said detectable marker gene is assessed by quantifying the amount of the corresponding protein produced.",
"Techniques for quantifying the amount of mRNA or protein are well known in the art.",
"For example, the detectable marker gene placed under the control of regulatory sequence may consist of the β-galactosidase as above described.",
"In another one embodiment, step a) comprises a step of subjecting to a gel migration assay the mixture of the first Tau polypeptide and the second FKBP52 polypeptide as above defined, with or without the candidate compound to be tested and then measuring the binding of the said polypeptides altogether by performing a detection of the complexes formed between said polypeptides.",
"The gel migration assay can be carried out as known by the one skilled in the art.",
"Therefore in one embodiment of the invention, step a) of the screening method of the invention comprises the following steps: (1) providing a first Tau polypeptide and a second FKBP52 polypeptide as defined above (2) bringing into contact the candidate compound to be tested with said polypeptides (3) performing a gel migration assay a suitable migration substrate with said polypeptides and said candidate compound as obtained at step (2) (4) detecting and quantifying the complexes formed between said polypeptides on the migration assay as performed at step (3).",
"The presence or the amount of the complexes formed between the polypeptides are then compared with the results obtained when the assay is performed in the absence of the candidate compound to be tested.",
"The detection of the complexes formed between the said two polypeptides may be easily performed by staining the migration gel with a suitable dye and then determining the protein bands corresponding to the protein analysed since the complexes formed between the first and the second polypeptides possess a specific apparent molecular weight.",
"Staining of proteins in gels may be done using any well known methods in the art.",
"Suitable gels are well known in the art but it is preferred to use non denaturant gels.",
"In a general manner, western blotting assays are well known in the art and have been widely described (Rybicki et al., 1982; Towbin et al.",
"1979; Kurien et al.",
"2006).",
"In a particular embodiment, the protein bands corresponding to the polypeptides submitted to the gel migration assay can be detected by specific antibodies.",
"It may used both antibodies directed against the Tau polypeptides and antibodies specifically directed against the FKBP52 polypeptides.",
"In another embodiment, the said two polypeptides are labelled with a detectable antigen as above described.",
"Therefore, the proteins bands can be detected by specific antibodies directed against said detectable antigen.",
"Preferably, the detectable antigen conjugates to the Tau polypeptide is different from the antigen conjugated to the FKBP52 polypeptide.",
"For instance, the first Tau polypeptide can be fused to a GST detectable antigen and the second FKBP52 polypeptide can be fused with the HA antigen.",
"Then the protein complexes formed between the two polypeptides may be quantified and determined with antibodies directed against the GST and HA antigens respectively.",
"In another embodiment, step a) included the use of an optical biosensor such as described by Edwards et al.",
"(1997) or also by Szabo et al.",
"(1995).",
"This technique allows the detection of interactions between molecules in real time, without the need of labelled molecules.",
"This technique is indeed based on the surface plasmon resonance (SPR) phenomenon.",
"Briefly, a first protein partner is attached to a surface (such as a carboxymethyl dextran matrix).",
"Then the second protein partner is incubated with the previously immobilised first partner, in the presence or absence of the candidate compound to be tested.",
"Then the binding including the binding level, or the absence of binding between said protein partner is detected.",
"For this purpose, a light beam is directed towards the side of the surface area of the substrate that does not contain the sample to be tested and is reflected by said surface.",
"The SPR phenomenon causes a decrease in the intensity of the reflected light with a combination of angle and wavelength.",
"The binding of the first and second protein partner causes a change in the refraction index on the substrate surface, which change is detected as a change in the SPR signal.",
"In another one embodiment of the invention, the screening method includes the use of affinity chromatography.",
"Candidate compounds for use in the screening method above can also be selected by any immunoaffinity chromatography technique using any chromatographic substrate onto which (i) the first Tau polypeptide or (ii) the second FKBP52 polypeptide as above defined, has previously been immobilised, according to techniques well known from the one skilled in the art.",
"Briefly, the Tau polypeptide or the FKBP52 polypeptide as above defined may be attached to a column using conventional techniques including chemical coupling to a suitable column matrix such as agarose, Affi Gel®, or other matrices familiar to those of skill in the art.",
"In some embodiment of this method, the affinity column contains chimeric proteins in which the Tau polypeptide or FKBP52 polypeptide as above defined, is fused to glutathion-s-transferase (GST).",
"Then a candidate compound is brought into contact with the chromatographic substrate of the affinity column previously, simultaneously or subsequently to the other polypeptide among the said first and second polypeptide.",
"The after washing, the chromatography substrate is eluted and the collected elution liquid is analysed by detection and/or quantification of the said later applied first or second polypeptide, so as to determine if, and/or to which extent, the candidate compound has modulated the binding between (i) first Tau polypeptide and (ii) the second FKBP52 polypeptide.",
"In another one embodiment of the screening method according to the invention, the first Tau polypeptide and the second FKBP52 polypeptide as above defined are labelled with a fluorescent molecule or substrate.",
"Therefore, the potential alteration effect of the candidate compound to be tested on the binding between the first Tau polypeptide and the second FKBP52 polypeptide as above defined is determined by fluorescence quantification.",
"For example, the first Tau polypeptide and the second FKBP52 polypeptide as above defined may be fused with auto-fluorescent polypeptides, as GFP or YFPs as above described.",
"The first Tau polypeptide and the second FKBP52 polypeptide as above defined may also be labelled with fluorescent molecules that are suitable for performing fluorescence detection and/or quantification for the binding between said polypeptides using fluorescence energy transfer (FRET) assay.",
"The first Tau polypeptide and the second FKBP52 polypeptide as above defined may be directly labelled with fluorescent molecules, by covalent chemical linkage with the fluorescent molecule as GFP or YFP.",
"The first Tau polypeptide and the second FKBP52 polypeptide as above defined may also be indirectly labelled with fluorescent molecules, for example, by non covalent linkage between said polypeptides and said fluorescent molecule.",
"Actually, said first Tau polypeptide and second FKBP52 polypeptide as above defined may be fused with a receptor or ligand and said fluorescent molecule may be fused with the corresponding ligand or receptor, so that the fluorecent molecule can non-covalently bind to said first Tau polypeptide and second FKBP52 polypeptide.",
"A suitable receptor/ligand couple may be the biotin/streptavifin paired member or may be selected among an antigen/antibody paired member.",
"For example, a polypeptide according to the invention may be fused to a poly-histidine tail and the fluorescent molecule may be fused with an antibody directed against the poly-histidine tail.",
"As already specified, step a) of the screening method according to the invention encompasses determination of the ability of the candidate compound to modulate the interaction between the Tau polypeptide and the FKBP52 polypeptide as above defined by fluorescence assays using FRET.",
"Thus, in a particular embodiment, the first Tau polypeptide as above defined is labelled with a first fluorophore substance and the second FKBP52 polypeptide is labelled with a second fluorophore substance.",
"The first fluorophore substance may have a wavelength value that is substantially equal to the excitation wavelength value of the second fluorophore, whereby the bind of said first and second polypeptides is detected by measuring the fluorescence signal intensity emitted at the emission wavelength of the second fluorophore substance.",
"Alternatively, the second fluorophore substance may also have an emission wavelength value of the first fluorophore, whereby the binding of said and second polypeptides is detected by measuring the fluorescence signal intensity emitted at the wavelength of the first fluorophore substance.",
"The fluorophores used may be of various suitable kinds, such as the well-known lanthanide chelates.",
"These chelates have been described as having chemical stability, long-lived fluorescence (greater than 0.1 ms lifetime) after bioconjugation and significant energy-transfer in specificity bioaffinity assay.",
"Document U.S. Pat.",
"No.",
"5,162,508 discloses bipyridine cryptates.",
"Polycarboxylate chelators with TEKES type photosensitizers (EP0203047A1) and terpyridine type photosensitizers (EP0649020A1) are known.",
"Document WO96/00901 discloses diethylenetriaminepentaacetic acid (DPTA) chelates which used carbostyril as sensitizer.",
"Additional DPT chelates with other sensitizer and other tracer metal are known for diagnostic or imaging uses (e.g., EP0450742A1).",
"In a preferred embodiment, the fluorescence assay performed at step a) of the screening method consists of a Homogeneous Time Resolved Fluorescence (HTRF) assay, such as described in document WO 00/01663 or U.S. Pat.",
"No.",
"6,740,756, the entire content of both documents being herein incorporated by reference.",
"HTRF is a TR-FRET based technology that uses the principles of both TRF (time-resolved fluorescence) and FRET.",
"More specifically, the one skilled in the are may use a HTRF assay based on the time-resolved amplified cryptate emission (TRACE) technology as described in Leblanc et al.",
"(2002).",
"The HTRF donor fluorophore is Europium Cryptate, which has the long-lived emissions of lanthanides coupled with the stability of cryptate encapsulation.",
"XL665, a modified allophycocyanin purified from red algae, is the HTRF primary acceptor fluorophore.",
"When these two fluorophores are brought together by a biomolecular interaction, a portion of the energy captured by the Cryptate during excitation is released through fluorescence emission at 620 nm, while the remaining energy is transfered to XL665.This energy is then released by XL665 as specific fluorescence at 665 nm.",
"Light at 665 nm is emitted only through FRET with Europium.",
"Because Europium Cryptate is always present in the assay, light at 620 nm is detected even when the biomolecular interaction does not bring XL665 within close proximity.",
"Therefore in one embodiment, step a) of the screening method may therefore comprises the steps consisting of: (1) bringing into contact a pre-assay sample comprising: a first Tau polypeptide fused to a first antigen, a second FKBP52 polypeptide fused to a second antigen a candidate compound to be tested (2) adding to the said pre assay sample of step (2): at least one antibody labelled with a European Cryptate which is specifically directed against the first said antigen at least one antibody labelled with XL665 directed against the second said antigen (3) illuminating the assay sample of step (2) at the excitation wavelength of the said European Cryptate (4) detecting and/or quantifying the fluorescence signal emitted at the XL665 emission wavelength (5) comparing the fluorescence signal obtained at step (4) to the fluorescence obtained wherein pre assay sample of step (1) is prepared in the absence of the candidate compound to be tested.",
"If at step (5) as above described, the intensity value of the fluorescence signal is different (lower or higher) than the intensity value of the fluorescence signal found when pre assay sample of step (1) is prepared in the absence of the candidate compound to be tested, then the candidate compound may be positively selected at step b) of the screening method.",
"Antibodies labelled with a European Cryptate or labelled with XL665 can be directed against different antigens of interest including GST, poly-histidine tail, DNP, c-myx, HA antigen and FLAG which include.",
"Such antibodies encompass those which are commercially available from CisBio (Bedfors, Mass., USA), and notably those referred to as 61GSTKLA or 61HISKLB respectively.",
"In a particular embodiment, the methods of the invention may further comprise a step consisting of determining the ability of the candidate compound to modulate the interaction between a Amyloid Precursor Protein (APP) polypeptide and a FKBP52 polypeptide.",
"Indeed a recent study have demonstrated that FKBP52 formed stable complexes with APP through its FK506 interacting domain.",
"This study studies identify a novel role for FKBP52 in modulating toxicity of Abeta peptides (Sanokawa-Akakura R, Cao W, Allan K, Patel K, Ganesh A, Heiman G, Burke R, Kemp F W, Bogden J D, Camakaris J, Birge R B, Konsolaki M. Control of Alzheimer's amyloid beta toxicity by the high molecular weight immunophilin FKBP52 and copper homeostasis in Drosophila.",
"PLoS One.",
"2010 Jan. 13; 5(1):e8626.).",
"Accordingly, compounds that modulate both interaction between Tau and FKBP52 and interaction between APP and FKBP52 may be useful for the treatment of Alzheimer's disease.",
"In Cellulo Screening Methods of the Invention The candidate compounds that have been positively selected at the end of any one of the embodiments of the in vitro screening which has been described previously in the present specification may be subjected to further selection steps in view of further assaying its properties on the Tau mediated cellular functions (such as tubulin polymerisation), Tau accumulation, Tau aggregation and all the post-translational Tau modifications.",
"For this purpose, the candidate compounds that have been positively selected with the general in vitro screening method as above described may be further selected for their ability modulates the Tau mediated cellular functions, Tau accumulation, Tau aggregation and all the post-translational Tau modifications.",
"Thus another aspect of the invention relates to a method for screening a drug for the prevention and treatment of neurological disorders involving Tau dysfunction, wherein said method comprises the steps of: i) screening for compounds that modulate the interaction between the Tau and the FKBP52 proteins, by performing the in vitro screening method according to any of claims 1 to 6 and ii) screening the compounds positively selected at the end of step i) for their Tau mediated cellular functions, Tau accumulation, Tau aggregation and all the post-translational Tau modifications.",
"In certain preferred embodiments of the screening method above, step ii) of said screening method comprises the following steps: (1) bringing into contact a cell with a compound that has been positively selected at the end of step i) (2) determining the capacity of compound to modulate the Tau mediated cellular functions, Tau accumulation, Tau aggregation and all the post-translational Tau modifications (3) comparing the Tau mediated cellular functions, Tau accumulation, Tau aggregation and all the post-translational Tau modifications determined at step (2) with the Tau mediated cellular functions, Tau accumulation, Tau aggregation and all the post-translational Tau modifications that are determined when step (1) is performed in the absence of the said positively selected compound.",
"For performing step (1), any cell may be suitable but neurons are preferred.",
"Step (1) as above described may be performed by adding an amount of the candidate compound to be tested to the culture medium.",
"Usually, a plurality of culture samples are prepared, so as to add increasing amounts of the candidate compound to be tested in distinct culture samples.",
"Generally, at least one culture sample without candidate compound is also prepared as a negative control for further comparison.",
"Optionally, at least one culture sample with an already known agent that modulates the Tau mediated cellular functions, Tau accumulation, Tau aggregation and all the post-translational Tau modifications is also prepared as a positive control for standardisation of the method.",
"Therefore, step (3) may be performed by comparing the percentage of cells wherein the Tau mediated cellular functions, Tau accumulation, Tau aggregation and all the post-translational Tau modifications are modulated obtained for the cell cultures incubated with the candidate compound to be tested with the percentage of cells wherein the Tau mediated cellular functions, Tau accumulation, Tau aggregation and all the post-translational Tau modifications are modulated obtained for the negative control cell cultures without the said candidate compound.",
"Illustratively, the efficiency of the candidate compound may be assessed by comparing (i) the percentage of cells wherein the Tau mediated cellular functions, Tau accumulation, Tau aggregation and all the post-translational Tau modifications are modulated measured in the cell cultures that were incubated therewith with (ii) the percentage of cells wherein the Tau mediated cellular functions, Tau accumulation, Tau aggregation and all the post-translational Tau modifications are modulated measured in the supernatant of the cell cultures that were incubated with the known agent that modulates the Tau mediated cellular functions, Tau accumulation, Tau aggregation and all the post-translational Tau modifications.",
"Further illustratively, the efficiency of the candidate compound may be assessed by determining for which amount of the candidate compound added to the cell cultures the percentage of cells wherein the Tau mediated cellular functions, Tau accumulation, Tau aggregation and all the post-translational Tau modifications are modulated is close or higher than the percentage of cells wherein the Tau mediated cellular functions, Tau accumulation, Tau aggregation and all the post-translational Tau modifications are modulated measured with the known agent that modulates the Tau mediated cellular functions, Tau accumulation, Tau aggregation and all the post-translational Tau modifications.",
"Candidate Compounds of the Invention According to a one embodiment of the invention, the candidate compound of may be selected from the group consisting of peptides, petptidomimetics, small organic molecules, antibodies, aptamers or nucleic acids.",
"For example the candidate compound according to the invention may be selected from a library of compounds previously synthesised, or a library of compounds for which the structure is determined in a database, or from a library of compounds that have been synthesised de novo.",
"In a particular embodiment, the candidate compound may be selected form small organic molecules.",
"As used herein, the term “small organic molecule” refers to a molecule of size comparable to those organic molecules generally sued in pharmaceuticals.",
"The term excludes biological macromolecules (e.g.",
"; proteins, nucleic acids, etc.",
"); preferred small organic molecules range in size up to 2000 da, and most preferably up to about 1000 Da.",
"The candidate compounds according to the invention may be selected from molecules that neutralize the PPIase activity of FKBP52 by interfering with its synthesis, translation and ligand/substrate/product-binding.",
"In a preferred embodiment, the molecules are selected from PPIase ligands of domain I of Protein FKBP52, preferably PPIase ligands preventing, blocking or inhibiting the PPIase activity of domain I of Protein FKBP52.Advantageously, the molecules of the invention may prevent/inhibit/block the PPIase activity of domain I of Protein FKBP52 without inducing immunosuppressive activity.",
"A first series of the molecules are derivatives of FK 506 that are lacking immunosuppresive activity.",
"FK 506 is represented hereunder: One particularly preferred family of molecules may consist of novel analogues of the neurophilin compound represented below also named as VA-10367 (Vertex, Inc): Other examples include derivatives of Rapamycin lacking the immunosuppressant activity, such as Meridamycin as described in the International Patent Application Publication no WO2005084673.Other derivatives of Rapamycin include those described in Ruan B. et al.",
"(Ruan B, Pong K, Jow F, Bowlby M, Crozier R A, Liu D, Liang S, Chen Y, Mercado M L, Feng X, Bennett F, von Schack D, McDonald L, Zaleska M M, Wood A, Reinhart P H, Magolda R L, Skotnicki J, Pangalos M N, Koehn F E, Carter G T, Abou-Gharbia M, Graziani E I.",
"Binding of rapamycin analogs to calcium channels and FKBP52 contributes to their neuroprotective activities.",
"Proc Natl Acad Sci USA.",
"2008 Jan. 8; 105(1):33-8.Epub 2007 Dec.",
"27.)",
"such as WYE-592 or ILS-290: The molecules of the invention may be synthesized by any conventional method well known to the skilled person.",
"In another particular embodiment, the candidate compounds according to the invention may be antibodies o specifically directed to the interaction site between protein Tau and protein FKBP52 or impacting the FKBP52-Tau interaction and/or its functional cellular functions.",
"The term “antibody” or “antibodies” relates to an antibody characterized as being specifically directed to the interaction site of FKBP52 with Tau, or any functional derivative thereof, with above mentioned antibodies being preferably monoclonal antibodies; or an antigen-binding fragment thereof, of the F (ab′)2, or single chain Fv type, or any type of recombinant antibody derived thereof.",
"These antibodies of the invention include specific polyclonal antisera prepared against the interaction site of FKBP52 with Tau.",
"The antibodies of the invention can for instance be produced by any hybridoma liable to be formed according to classical methods from splenic cells of an animal, particularly of a mouse or rat immunized against the peptidic sequence involved in the interaction between Tau and FKBP52 or any functional derivative thereof, and of cells of a myeloma cell line, and to be selected by the ability of the hybridoma to produce the monoclonal antibodies recognizing the peptidic sequence involved in the interaction between Tau and FKBP52 or any functional derivative thereof which have been initially used for the immunization of the animals.",
"The antibodies according to this embodiment of the invention may be humanized versions of the mouse antibodies made by means of recombinant DNA technology, departing from the mouse and/or human genomic DNA sequences coding for H and L chains or from cDNA clones coding for H and L chains.",
"Alternatively the antibodies according to this embodiment of the invention may be human antibodies.",
"Such human antibodies are prepared, for instance, by means of human peripheral blood lymphocytes (PBL) repopulation of severe combined immune deficiency (SCID) mice as described in PCT/EP 99/03605 or by using transgenic non-human animals capable of producing human antibodies as described in U.S. Pat.",
"No.",
"5,545,806.Also fragments derived from these antibodies such as Fab, F (ab)′2 ands (“single chain variable fragment”), providing they have retained the original binding properties, form part of the present invention.",
"Such fragments are commonly generated by, for instance, enzymatic digestion of the antibodies with papain, pepsin, or other proteases.",
"It is well known to the person skilled in the art that monoclonal antibodies or fragments thereof, can be modified for various uses.",
"An appropriate label of the enzymatic, fluorescent, or radioactive type can label the antibodies involved in the invention.",
"In another particular embodiment, the candidate compounds according to the invention may be selected from aptamers.",
"Aptamers are a class of molecule that represents an alternative to antibodies in term of molecular recognition.",
"Aptamers are oligonucleotide or oligopeptide sequences with the capacity to recognize virtually any class of target molecules with high affinity and specificity.",
"Such ligands may be isolated through Systematic Evolution of Ligands by EXponential enrichment (SELEX) of a random sequence library, as described in Tuerk C. and Gold L., 1990.The random sequence library is obtainable by combinatorial chemical synthesis of DNA.",
"In this library, each member is a linear oligomer, eventually chemically modified, of a unique sequence.",
"Possible modifications, uses and advantages of this class of molecules have been reviewed in Jayasena S. D., 1999.Peptide aptamers consists of a conformationally constrained antibody variable region displayed by a platform protein, such as E. coli Thioredoxin A that are selected from combinatorial libraries by two hybrid methods (Colas et al., 1996).",
"In another embodiment, the candidate molecules may be selected from molecules that block the synthesis of Protein FKBP52.By synthesis is meant the transcription of the FKBP52 gene.",
"Small molecules can bind on the promoter region of the FKBP52 and inhibit binding of a transcription factor or these molecules can bind a transcription factor and inhibit binding to the FKBP52-promoter so that there is no expression of the FKBP52.Also within the scope of the invention is the use of oligoribonucleotide sequences that include anti-sense RNA and DNA molecules and ribozymes that function to inhibit the translation of FKBP52 mRNA.",
"Anti-sense RNA and DNA molecules act to directly block the translation of mRNA by binding to targeted mRNA and preventing protein translation.",
"In regard to antisense DNA, oligodeoxyribonucleotides derived from the translation initiation site.",
"Ribozymes are enzymatic RNA molecules capable of catalysing the specific cleavage of RNA.",
"The mechanism of ribozyme action involves sequence specific hybridisation of the ribozyme molecule to complementary target RNA, followed by an endonucleolytic To inhibit the activity of the gene or the gene product of FKBP52 custom-made techniques are available directed at three distinct types of targets: DNA, RNA and protein; For example, the gene or gene product of FKBP52 can be altered by homologous recombination, the expression of the genetic code can be inhibited at the RNA levels by antisense oligonucleotides, interfering RNA (RNAi) or ribozymes, and the protein function can be altered by antibodies or drugs.",
"Another embodiment of present invention is the use of a molecule that inhibits the expression of FKBP52 and preferably a molecule that inhibits the expression of FKBP52 selected from the list consisting of an antisense molecule, a RNAi and a ribozyme, for the manufacture of a drug to prevent or treat a disorder of Tau aggregation or deposition in neurofibrillary tangles in a subject in need thereof.",
"Methods of Treatment of the Invention In a further aspect, the invention provides a method for the prevention and treatment of neurological disorders involving Tau dysfunction comprising administering a subject in need thereof with a therapeutically effective amount of a compound that modulate the interaction between the Tau and the FKBP52 protein.",
"Said compound may be identified by the screening methods of the invention.",
"More particularly, the invention relates to a compound that modulates the interaction between the Tau and the FKBP52 protein for use in the prevention and treatment of neurological disorders involving Tau dysfunction.",
"The methods of the invention are useful for the prevention and treatment of neurological disorders involving Tau dysfunction including Alzheimer's disease, frontotemporal dementia, progressive supranuclear palsy, corticobasal degeneration and frontotemporal lobar degeneration, also known as Pick's disease, as well as all neurological disorders which might, in the future, prove to involve Tau, such as the Parkinson disease for instance.",
"According to the invention, the term “patient” or “patient in need thereof”, is intended for a human or non-human mammal (e.g.",
"dog, cat, horses .",
".",
". )",
"affected or likely to be affected with neurological disorders involving Tau dysfunction.",
"By a “therapeutically effective amount” of the compound of the invention is meant a sufficient amount of compound to treat neurological disorders involving Tau dysfunction, at a reasonable benefit/risk ratio applicable to any medical treatment.",
"It will be understood, however, that the total daily usage of the compound of the invention and compositions of the present invention will be decided by the attending physician within the scope of sound medical judgment.",
"The specific therapeutically effective dose level for any particular patient will depend upon a variety of factors including the disorder being treated and the severity of the disorder; activity of the specific compound employed; the specific composition employed, the age, body weight, general health, sex and diet of the patient; the time of administration, route of administration, and rate of excretion of the specific compound employed; the duration of the treatment; drugs used in combination or coincidental with the specific compound employed; and like factors well known in the medical arts.",
"For example, it is well within the skill of the art to start doses of the compound at levels lower than those required to achieve the desired therapeutic effect and to gradually increase the dosage until the desired effect is achieved.",
"The compound that modulates the interaction between the Tau and the FKBP52 protein of the invention may be combined with pharmaceutically acceptable excipients.",
"“Pharmaceutically” or “pharmaceutically acceptable” refers to molecular entities and compositions that do not produce an adverse, allergic or other untoward reaction when administered to a mammal, especially a human, as appropriate.",
"A pharmaceutically acceptable carrier or excipient refers to a non-toxic solid, semi-solid or liquid filler, diluent, encapsulating material or formulation auxiliary of any type.",
"In a further aspect, the invention provides a method for the prevention and treatment of Alzheimer's disease comprising administering a subject in need thereof with a therapeutically effective amount of a compound that modulate both the interaction between the Tau and the FKBP52 protein and the interaction between FKBP52 and APP.",
"Diagnostic Methods of the Invention A further aspect of the invention pertains to diagnostic, prognostic, and monitoring assays.",
"Accordingly, in a particular embodiment, the invention relates to a method of testing a subject thought to have or be predisposed to having a neurological disorders involving Tau dysfunction, which comprises the step of analyzing a sample of interest obtained from said subject for measuring the level of the complex between FKBP52 protein and Tau protein.",
"As used herein, the term “sample of interest” include encompasses a variety of sample types obtained from a subject and can be used in a diagnostic assay.",
"Samples herein may be any type of sample, such as any cell samples, biological fluids including, blood, serum, urine, spinal fluid .",
".",
".",
"or any biopsy sample obtained from a subject's tissue.",
"In a preferred embodiment, the sample of interest is a spinal fluid sample.",
"In a particular embodiment, the methods of the invention comprise contacting the sample of interest with a binding partner capable of selectively interacting with the complex between FKBP52 protein and Tau protein present in the sample of interest.",
"In another particular embodiment, methods of the invention comprise may involve contacting the sample of interest with a binding partner capable of selectively interacting with the FKBP52 protein and another binding partner capable of selectively interacting Tau protein present in the sample of interest.",
"The binding partners according to the invention may be an antibody that may be polyclonal or monoclonal, preferably monoclonal.",
"In another embodiment, the binding partner may be an aptamer.",
"The binding partners of the invention such as antibodies or aptamers, may be labelled with a detectable molecule or substance, such as a fluorescent molecule, a radioactive molecule or any others labels known in the art.",
"Labels are known in the art that generally provide (either directly or indirectly) a signal.",
"As used herein, the term “labelled”, with regard to the antibody, is intended to encompass direct labelling of the antibody or aptamer by coupling (i.e., physically linking) a detectable substance, such as a radioactive agent or a fluorophore (e.g.",
"fluorescein isothiocyanate (FITC) or phycoerythrin (PE) or Indocyanine (Cy5)) to the antibody or aptamer, as well as indirect labelling of the probe or antibody by reactivity with a detectable substance.",
"An antibody or aptamer of the invention may be labelled with a radioactive molecule by any method known in the art.",
"For example radioactive molecules include but are not limited radioactive atom for scintigraphic studies such as I123, I124, In111, Re186, Re188.The aforementioned assays generally involve the bounding of the binding partner (ie.",
"Antibody or aptamer) in a solid support.",
"Solid supports which can be used in the practice of the invention include substrates such as nitrocellulose (e. g., in membrane or microtiter well form); polyvinylchloride (e. g., sheets or microtiter wells); polystyrene latex (e.g., beads or microtiter plates); polyvinylidine fluoride; diazotized paper; nylon membranes; activated beads, magnetically responsive beads, and the like.",
"The level of the complex between FKBP52 protein and Tau protein may be measured by using standard immunodiagnostic techniques, including immunoassays such as competition, direct reaction, or sandwich type assays.",
"Such assays include, but are not limited to, agglutination tests; enzyme-labelled and mediated immunoassays, such as ELISAs; biotin/avidin type assays; radioimmunoassays; immunoelectrophoresis; immunoprecipitation.",
"More particularly, an ELISA method can be used, wherein the wells of a microtiter plate are coated with a set of binding partners according to the invention.",
"A sample of interest containing or suspected of containing the complex between FKBP52 protein and Tau protein is then added to the coated wells.",
"After a period of incubation sufficient to allow the formation of antibody-antigen complexes, the plate(s) can be washed to remove unbound moieties and a detectably labelled secondary binding molecule added.",
"The secondary binding molecule is allowed to react with any captured sample marker protein, the plate washed and the presence of the secondary binding molecule detected using methods well known in the art.",
"Alternatively an immunohistochemistry (IHC) method may be preferred.",
"IHC specifically provides a method of detecting targets in a tissue specimen in situ.",
"The overall cellular integrity of the sample of interest is therefore maintained in IHC, thus allowing detection of both the presence and location of the complex between FKBP52 protein and Tau protein.",
"Typically the sample is fixed with formalin, embedded in paraffin and cut into sections for staining and subsequent inspection by light microscopy.",
"Current methods of IHC use either direct labeling or secondary antibody-based or hapten-based labeling.",
"Examples of known IHC systems include, for example, EnVision™ (DakoCytomation), Powervision® (Immunovision, Springdale, Ariz.), the NBA™ kit (Zymed Laboratories Inc., South San Francisco, Calif.), HistoFine® (Nichirei Corp, Tokyo, Japan).",
"In particular embodiment, a tissue section may be mounted on a slide or other support after incubation with the binding partners of the invention d. Then, microscopic inspections in the sample mounted on a suitable solid support may be performed.",
"For the production of photomicrographs, sections comprising samples may be mounted on a glass slide or other planar support, to highlight by selective staining the presence of the proteins of interest.",
"Therefore IHC samples may include, for instance: (a) preparations comprising a cell sample or a tissue sample (b) fixed and embedded said cells and (c) detecting the complex between FKBP52 protein and Tau protein in said cells samples.",
"In some embodiments, an IHC staining procedure may comprise steps such as: cutting and trimming tissue, fixation, dehydration, paraffin infiltration, cutting in thin sections, mounting onto glass slides, baking, deparaffination, rehydration, antigen retrieval, blocking steps, applying primary antibodies, washing, applying secondary antibodies (optionally coupled to a suitable detectable label), washing, counter staining, and microscopic examination.",
"In one embodiment, the method of the invention further may comprise a step of comparing the level of the complex between FKBP52 protein and Tau protein with a predetermined threshold value.",
"Said comparison is indicative whether the subject is thought to have or be predisposed to having a neurological disorders involving Tau dysfunction.",
"The predetermined value may refer to the amount of the complex between FKBP52 protein and Tau protein in sample of interests obtained from the general population or from a select population of subjects.",
"For example, the select population may be comprised of apparently healthy subjects, such as individuals who have not previously had any sign or symptoms indicating the presence of neurological disorders involving Tau dysfunction.",
"In another example, the predetermined value may be comprised of subjects having established neurological disorders involving Tau dysfunction.",
"The predetermined value can be a cut-off value, or a range.",
"The predetermined value can be established based upon comparative measurements between apparently healthy subjects and subjects with established neurological disorders involving Tau dysfunction.",
"Moreover, without wishing to be bound by theory, the inventors believe that aberrant expression or activity of FKBP52, and/or especially its ability to bind Tau thereby determine whether an individual is afflicted with a neurological disorders involving Tau dysfunction, or is at risk of developing a neurological disorders involving Tau dysfunction.",
"Accordingly, in a particular embodiment, the invention relates to a method of testing a subject thought to have or be predisposed to having a neurological disorders involving Tau dysfunction, which comprises the step of analyzing a sample of interest obtained from said subject for detecting the presence of a mutation in the gene encoding for FKBP52 protein and/or its associated promoter.",
"Typical techniques for detecting a mutation in the gene encoding for FKBP52 protein may include restriction fragment length polymorphism, hybridisation techniques, DNA sequencing, exonuclease resistance, microsequencing, solid phase extension using ddNTPs, extension in solution using ddNTPs, oligonucleotide assays, methods for detecting single nucleotide polymorphism such as dynamic allele-specific hybridisation, ligation chain reaction, mini-sequencing, DNA “chips”, allele-specific oligonucleotide hybridisation with single or dual-labelled probes merged with PCR or with molecular beacons, and others.",
"In another particular embodiment, the invention relates to a method of testing a subject thought to have or be predisposed to having a neurological disorders involving Tau dysfunction, which comprises the step of analyzing a sample of interest obtained from said subject for analyzing the expression of the gene encoding for FKBP52 protein.",
"Analyzing the expression of the gene encoding for FKBP52 protein may be assessed by any of a wide variety of well-known methods for detecting expression of a transcribed nucleic acid or translated protein.",
"In a preferred embodiment, the expression of the gene encoding for FKBP52 protein is assessed by analyzing the expression of mRNA transcript or mRNA precursors, such as nascent RNA, of said gene.",
"Said analysis can be assessed by preparing mRNA/cDNA from cells in a sample of interest from a subject, and hybridizing the mRNA/cDNA with a reference polynucleotide.",
"The prepared mRNA/cDNA can be used in hybridization or amplification assays that include, but are not limited to, Southern or Northern analyses, polymerase chain reaction analyses, such as quantitative PCR (TaqMan), and probes arrays such as GeneChip™ DNA Arrays (AFF-YMETRIX).",
"Advantageously, the analysis of the expression level of mRNA transcribed from the gene encoding for FKBP52 protein involves the process of nucleic acid amplification, e. g., by RT-PCR (the experimental embodiment set forth in U.S. Pat.",
"No.",
"4,683,202), ligase chain reaction (BARANY, Proc.",
"Natl.",
"Acad.",
"Sci.",
"USA, vol.",
"88, p: 189-193, 1991), self sustained sequence replication (GUATELLI et al., Proc.",
"Natl.",
"Acad.",
"Sci.",
"USA, vol.",
"57, p: 1874-1878, 1990), transcriptional amplification system (KWOH et al., 1989, Proc.",
"Natl.",
"Acad.",
"Sci.",
"USA, vol.",
"86, p: 1173-1177, 1989), Q-Beta Replicase (LIZARD′ et al., Biol.",
"Technology, vol.",
"6, p: 1197, 1988), rolling circle replication (U.S. Pat.",
"No.",
"5,854,033) or any other nucleic acid amplification method, followed by the detection of the amplified molecules using techniques well known to those of skill in the art.",
"These detection schemes are especially useful for the detection of nucleic acid molecules if such molecules are present in very low numbers.",
"As used herein, amplification primers are defined as being a pair of nucleic acid molecules that can anneal to 5′ or 3′ regions of a gene (plus and minus strands, respectively, or vice-versa) and contain a short region in between.",
"In general, amplification primers are from about 10 to 30 nucleotides in length and flank a region from about 50 to 200 nucleotides in length.",
"Under appropriate conditions and with appropriate reagents, such primers permit the amplification of a nucleic acid molecule comprising the nucleotide sequence flanked by the primers.",
"In another particular embodiment, the invention relates to a method of testing a subject thought to have or be predisposed to having a neurological disorders involving Tau dysfunction, which comprises the step of analyzing a sample of interest obtained from said subject for measuring the concentration of FKBP52 protein.",
"Measuring the concentration of the FKBP52 protein may be assessed by using a binding partner as above described, and more particularly an antibody (e.g., a radio-labeled, chromophore-labeled, fluorophore-labeled, or enzyme-labeled antibody), an antibody derivative (e.g., an antibody conjugate with a substrate or with the protein or ligand of a protein of a protein/ligand pair (e.g., biotin-streptavidin)), or an antibody fragment (e.g., a single-chain antibody, an isolated antibody hypervariable domain, etc.)",
"which binds specifically to the FKBP52 protein.",
"Said analysis can be assessed by a variety of techniques well known from one of skill in the art including, but not limited to, enzyme immunoassay (EIA), radioimmunoassay (RIA), Western blot analysis and enzyme linked immunoabsorbant assay (RIA).",
"The methods of the invention may comprise comparing the level of expression of the gene encoding for FKBP52 protein or the concentration of the FKBP52 protein in the sample of interest from a subject with a predetermined threshold value.",
"The predetermined value may refer to the expression level or concentration measured in sample of interests obtained from the general population or from a select population of subjects.",
"For example, the select population may be comprised of apparently healthy subjects, such as individuals who have not previously had any sign or symptoms indicating the presence of neurological disorders involving Tau dysfunction.",
"In another example, the predetermined value may be comprised of subjects having established neurological disorders involving Tau dysfunction.",
"The predetermined value can be a cut-off value, or a range.",
"The predetermined value can be established based upon comparative measurements between apparently healthy subjects and subjects with established neurological disorders involving Tau dysfunction.",
"In another particular embodiment, the invention relates to a method of testing a subject thought to have or be predisposed to having a neurological disorders involving Tau dysfunction, which comprises the step of analyzing a sample of interest obtained from said subject for detecting post-translational modifications of FKBP52 protein.",
"The post-translational modifications FKBP52 protein include but are not limited to phosphorylation, acetylation, glycosylation.",
"and the like.",
"Detecting the post-translational modifications of the FKBP52 protein may be assessed by using a binding partner specific for a post-translational form of FKBP52 protein.",
"As described above, the binding partner may be an antibody (e.g., a radio-labeled, chromophore-labeled, fluorophore-labeled, or enzyme-labeled antibody), an antibody derivative (e.g., an antibody conjugate with a substrate or with the protein or ligand of a protein of a protein/ligand pair (e.g., biotin-streptavidin)), or an antibody fragment (e.g., a single-chain antibody, an isolated antibody hypervariable domain, etc.)",
"which binds specifically to a specific form of the FKBP52 protein.",
"Said analysis can be assessed by a variety of techniques well known from one of skill in the art including, but not limited to, enzyme immunoassay (EIA), radioimmunoassay (RIA), Western blot analysis and enzyme linked immunoabsorbant assay (RIA).",
"The methods as above described may then particularly suitable for the prognostic or predictive purpose to administer the subject with a prophylactic treatment prior to the onset of clinical signs characterized by or associated with a neurological disorders involving Tau dysfunction.",
"Clinical signs may include but are not limited to any sort of dysfunction of any CNS activity (such as motor/sensitive activities, sleep disturbances, depressive states, amnesic troubles, etc.",
".",
".",
".",
").",
"More particularly, the methods of the invention may be also useful for monitoring the treatment of a subject affected with a neurological disorders involving Tau dysfunction.",
"The invention will be further illustrated by the following figures and examples.",
"However, these examples and figures should not be interpreted in any way as limiting the scope of the present invention.",
"FIGURES FIG.",
"1: FKBP52 in the brain.",
"Twenty μg of cytosol proteins from different adult rat brain regions were analyzed by Western blotting using anti-FKBP52 antibody 761.Actin served as the loading control.",
"FIGS.",
"2A-D: Association between FKBP52 and Tau proteins.",
"A) GST Pull-down assay: Immunoblot (IB) for Tau showing the binding of soluble microtubule extract proteins incubated with GST-tagged FKBP52, or GST alone as control.",
"B) Co-immunoprecipitation assay: A soluble microtubule extract was subjected to immunoprecipitation (IP) with immunopurified anti-FKBP52 antibody, or pre-immune serum used as control.",
"The supernatants (S) and precipitates (P) were immunoblotted with anti-Tau antibody (clone DC25).",
"C) The ability of Tau proteins to bind FKBP52 directly was monitored by dot blot assay.",
"Different amounts of recombinant Tau (hT40) were spotted onto nitrocellulose membranes and then assayed for bound FKBP52 (0.5 μg) using anti-FKBP52 antibody.",
"5 μg GST spotted onto nitrocellulose membrane were used as the control.",
"D) Quantitation: 100% corresponds to 0.5 μg of FKBP52 loading before milk saturation, and 0% corresponds to 0.5 μg of FKBP52 loading after milk saturation.",
"The background is defined as the signal when GST was loaded instead of hT40.The level of FKBP52 captured by hT40 was calculated after substraction of background.",
"FIGS.",
"3A-C: Relevance of Tau phosphorylation for its interaction with FKBP52.A) Recombinant Tau (hT40), P-Tau and HP-Tau were analyzed by SDS-Page.",
"Phosphorylation and hyperphosphorylation of HT40 resulted in a marked reduction in the gel mobility of recombinant Tau as shown on an immunoblot (IB), with anti-Tau antibody (clone DC25).",
"B) Dot blot assay with 2.2 μg of HP-Tau (1), P-Tau (2), pure recombinant hT40 (3), to which had been added, just before spotting, the same amount of cytosol as used to generate P-Tau (4) or HP-Tau (5).",
"Dot 6 refers to the GST (5 μg) load.",
"FIGS.",
"4A-B: Colocalization of FKBP52 and TAU in primary cortical neurons and PC12 cells.",
"A) Immunofluorescence staining of primary cortical neurons and PC12 cells treated with 50 nM NGF for 5 days.",
"Double staining for Tau and FKBP52 was performed after cytosol extraction to reveal cytoskeletal association.",
"Arrows indicate preferential colocalization of both proteins in the distal part of the nerve cell axon and at the extremity of PC12 cell neurites.",
"B) Confocal images of primary cortical neurons.",
"Double staining was performed as in (A).",
"Analysis of 0.5 μm slices confirms the preferential colocalization in the distal part of the axon (see arrowheads) FIGS.",
"5A-G: Effect of FKBP52 on tubulin polymerization induced by recombinant Tau isoforms.",
"Tubulin polymerization was performed by switching the samples from 4° C. to 37° C. and the change in turbidity was monitored at 345 nm for 15 min.",
"Tubulin (1 mg/ml) purified from rat brain was incubated in the absence (♦) or presence of 1.7 μM (23 μg for HT40) different human Tau isoforms without FKBP52 (⋄) or with 3.5 μM (55 μg) FKBP52 (▴) Tau isoforms differ from each other by the number of repeats in the microtubule binding domain and insertions in the N-terminal.",
"The labelling of tau isoforms uses the published nomenclature (28).",
"A: ht40, B: ht39, C: hT37, D: hT34, E: hT24, F: hT23, G: This control experiment was carried out as in (A), except that 3.5 μM GST (▴) was used instead of FKBP52.FIGS.",
"6A-F: Effect of FKBP52 overexpression on Tau accumulation and neurite outgrowth A) PC12 cells treated or not with NGF (50 nM) in the absence or presence of 1 μg/ml Dox (doxycycline).",
"Ten μg of total protein extracts were analyzed for FKBP52 levels by western blot using anti-FKBP52 antibody 761.B) The FKBP52 level was determined as in (A) in H7C2 cells treated or not with Dox.",
"The use of rabbit FKBP52 as the exogenous protein explains the small difference in gel mobility with the endogenous rat protein.",
"C) H7C2 and D) PC12 cells were treated or not with NGF for 5 days, in the presence or absence of Dox for one week; 50 μg of extracts was subjected to SDS-PAGE and immunoblotted with anti-Tau (antibody clone DC25).",
"Actin was used as the loading control.",
"E) Representative H7C2 cells in the presence of NGF (50 nM) with or without Dox.",
"F) Neurite length was quantified from random photographs (see materials and methods).",
"Similar results were obtained in 3 separate experiments.",
"**: P<0.01 (Student-Newman-Keuls test, Anova).",
"FIGS.",
"7A-B: centrifugal sedimentation and western blot analysis of Tau polymerization: (A) in oxidative conditions: Ox (B) in reducing conditions: Red.",
"S, Supernatants, P, Pellets.",
"FIG.",
"8: Centrifugal sedimentation and western blot analysis of Tau polymerization in oxidative conditions: recombinant Tau at 0.5 mg/ml 1: alone, 2: with FKBP52, 3: with GST.",
"S, Supernatants, P, Pellets.",
"FIGS.",
"9A-F: Expression level of FKBP52 in Alzheimer disease and control brains.",
"Western blot analysis of FKBP52 in soluble homogenate fraction from normal and Alzheimer disease.",
"GAPDH was used as loading control.",
"Intensities of the chemoluminescence were quantified with Image-J software.",
"LA), soluble fractions 1-5; (B), soluble fractions 6-12; (C) soluble data combined; (D) insoluble fractions 1-5; (E), insoluble fractions 6-12; (F) insoluble data combined.",
"FIGS.",
"10A-B: Expression level of mRNA FKBP52 in Alzheimer disease and controls.",
"Quantification of mRNA FKBP52 was carried out after normalisation with mRNA GAPDH.",
"(A) individual samples; (B) combined data.",
"EXAMPLE 1: A ROLE FOR FKBP52 IN TAU PROTEIN FUNCTION Materials and Methods Antibodies and Reagents: Anti-Tau mAB (clone DC25) and anti-Tau mAB (Tau5) was from Sigma and Calbiochem respectively.",
"Anti-FKBP52 pAB 761 was as described (9).",
"GTP was from Sigma and doxycycline was from Clontech.",
"Preparation of Tubulin and Microtubule Assembly Assay: Male adult Sprague-Dawley rats (body weight˜250 g) were obtained from Janvier (Le Genest-St.-Isle, France).",
"They were killed by decapitation, according to institutional guidelines, and whole brains were used immediately to prepare tubulin as described (9).",
"Microtubule assembly assays were performed as in (9).",
"Protein Purification and Overexpression of Different Tau Isoforms and FKBP52 Protein: The six isoforms of human brain Tau were expressed in E. coli from clones hT40, hT39, hT37, hT34, hT24, hT23 and purified as described (28).",
"Full length FKBP52 was affinity purified as in (23).",
"For the Tubulin polymerization assay, FKBP52 bound to glutathione-sepharose beads (GE Healthcare) were cleaved overnight at 4° C. with 2 units of thrombin (GE Healthcare) and dialyzed against buffer L (0.1 M Mes, 1 mM EGTA, 1 mM MgCL2, 0.1 mM EDTA) with 10% glycerol, and complemented before use to 1 mM GTP and 1 mM DTT and 10 μM PPACK (a potent irreversible inhibitor of thrombin) (Biomol).",
"Phosphorylation and Hyperphosphorylation of Recombinant Tau: Rat brain extract was used as the source of kinase activity, as described (18).",
"Briefly, recombinant hT40 was incubated with cytosol of adult rat brain, in the presence or absence of okadaic acid, to give HP-Tau (hyperphosphorylated-Tau) and P-Tau (phosphorylated-Tau), respectively.",
"Protein Binding Assays: GST-pull down assay: 100 μl of glutathione-Sepharose beads preloaded with 1 nmol GST-FKBP52 or 1 nmol GST, were washed 4 times with 500 μl of buffer A (buffer L complemented with 1 mM DTT and 1 mM GTP) and then resuspended in the same buffer containing protein microtubule extract.",
"The proteins were analyzed for the presence of Tau isoforms by SDS/PAGE western blot analysis using antibody anti-Tau (clone DC25) diluted 1/1000.Coimmunoprecipitation Assay: It was carried out with 1 mg cytosol microtubule extract as described (12).",
"Dot Blot Assay: 100 μl of buffer A containing different amounts of hT40 were applied to a nitrocellulose membrane, blocked with 5% non-fat milk in phosphate-buffered saline (PBS) containing 0.1% Tween 20 (PBS-T) at room temperature, washed with PBS-T and buffer A, followed by 2 h incubation at room temperature with 100 μl of buffer A containing 0.5 μg recombinant FKBP52.The membranes were washed with buffer IP (50 mM Tris (pH 7.5)/150 mM NaCl/2 mM MgCl2/0.1% Brij97 (Sigma)/10% glycerol/protease inhibitors) and with PBS-T. After blocking with milk in PBS-T, the membranes were incubated with anti-FKBP52 761 antibody.",
"The presence of FKBP52 was revealed by ECL.",
"Quantitation was performed with Quantity-one software using Chemidoc XRS fitted with a 16 bit CCD camera (Biorad).",
"Cell Line and Stable DNA Transfection: Generation of H7C2 Cells: The cDNA encoding rabbit FKBP52 was inserted into the HindIII and AccI restriction sites of the pTRE2 vector (Clontech) in order to give pTRE2-FKBP52.Transfection of 100 μg of pTR2-FKBP52 and 10 μg of pTK-hygromicin was carried out in a commercially available PC12 Tet-on cell line (Clontech) that expresses the reverse tetracycline controlled transactivator, using Lipofectamine™ (Invitrogen).",
"Stably transfected cells were selected with 100 μg/ml hygromycin and screened individually.",
"Cell Culture: PC12 cells and H7C2 cells were grown in DMEM containing 10% (v/v) horse serum and 5% (v/v) FBS (Invitrogen) at 37° C. in 90% 02/10% CO2.The differentiated neuronal phenotype of cells grown on plastic dishes coated with 10 μg/ml poly(L)-lysine (Sigma), was induced by adding nerve growth factors (NGF) (Invitrogen) for 5 days.",
"Primary cultures from cerebral cortex of embryonic day 17 rat foetuses were carried out.",
"Dissociated cells were plated (50,000 cells per ml) on glass coverslips coated with poly(L-ornithine) and cultured in a defined medium in 95% O2/5% CO2 at 37° C. Immunocytochemistry: Cells were grown on glass coverslips precoated in 12-well tissue culture plates.",
"Primary cells and PC12 cells were incubated for 2.5 min and 3 min respectively, in PEM buffer (80 mM PIPES, 1 mM MgCl2, 2 mM EGTA, pH6.9) with 0.05% Triton, rinsed with warm Triton-free PEM, fixed for 5 min with methanol at −20° C. and incubated with affinity-purified anti-FKBP52 761 (1/1000), and anti-Tau5 (1/100).",
"Anti-rabbit Alexa Fluor 488-conjugated (Invitrogen), anti-mouse FITC-conjugated or Cy™3 red-conjugated (GE-Healthcare) antibodies were used at 1/500 and 1/1000, respectively.",
"The coverslips were examined by epifluorescence using a Zeiss axioplan 2 microscope with, either a ×63 objective or by confocal microscopy (Zeiss, Thornwood, N.Y., USA) Quantitation of Neurite Outgrowth: Random field photographs of PC12 and H7C2 cells, in each of three wells, were analyzed with Neuron J software.",
"The average neurite length was determined by measuring the longest neurites of at least 200 cells randomly selected.",
"Results Tau FKBP52 Association: FKBP52 is widely distributed in the brain as shown by Western blots of cytosolic proteins from several brain areas (FIG.",
"1).",
"In order To investigate whether MAPs may be involved in the effect of FKBP52 on microtubule stability (9), GST pull-down assays were carried out incubating GST-FKBP52 bound to sepharose beads with microtubules cytosol prepared from adult rat brain.",
"Specifically bound proteins were analyzed by immunoblotting using antibodies directed against MAP1b, MAP2 and Tau.",
"In these experimental conditions, no immunoreactivity was observed for MAP1b or MAP2, but Tau immunoreactivity was present (FIG.",
"2A).",
"In rat brain homogenates, Tau appears as multiple bands representing different splice isoforms with various degrees of phosphorylation.",
"Several Tau species were also found in pull-down experiments of rat brain cytosol microtubules using GST-FKBP52.Tau immunoreactivity was not detected in controls using purified GST (FIG.",
"2A).",
"To confirm the specificity of this association, microtubules of adult rat brain cytosol were immunoprecipitated with a polyclonal antibody against FKBP52.Immunoprecipitates were analyzed by Western blotting with a monoclonal Tau antibody.",
"Tau co-immunoprecipitated with FKBP52 but not with a preimmune serum (FIG.",
"2B).",
"Thus, Tau and FKBP52 form a complex in rat brain.",
"These experiments do not address whether the binding of Tau to FKBP52 is direct or whether it involves additional factors.",
"To investigate this, recombinant Tau (hT40, the longest isoform, expressed in E. coli and purified) was spotted onto nitrocellulose and incubated with purified recombinant FKBP52.Then, proteins sequestered by Tau were detected with a polyclonal antibody against FKBP52.As shown on FIG.",
"2C, FKBP52 was retained in a dose dependent manner by Tau, but not by the GST.",
"These findings indicate a direct interaction between FKBP52 and Tau.",
"Effect of Tau Phosphorylation on its Interaction with FKBP52: To define whether the phosphorylation of Tau modulates its association with FKBP52, dot blot experiments were performed using recombinant phosphorylated Tau (P-Tau) and hyperphosphorylated Tau (HP-Tau) (18) (FIG.",
"3A).",
"The specificity of the interaction between FKBP52 and P-Tau or HP-Tau was determined by experiments using as the bait either these phosphorylated ht40, non phosphorylated hT40, or hT40 to which had been added, just prior to spotting, the same amount of cytosol protein as used to obtain phosphorylated or hyperphosphorylated hT40.As shown in FIG.",
"3B, the amount of FKBP52 recruited by Tau depends on its phosphorylation state.",
"73% (±7) of FKBP52 was retained by 2.2 μg HP-Tau, whereas only 3.5% and 6.6% were respectively retained by the same amount of hT40 and by hT40 in the presence of cytosolic proteins used as controls.",
"When P-Tau was used as bait, only 41% (±15) of FKBP52 was captured.",
"This difference in binding between HP-Tau and P-Tau to FKBP52 may be explained by the different degree of Tau phosphorylation at specific sites or by the global amount of Tau phosphorylation, or by a combination of both mechanisms (FIG.",
"3A).",
"In any case, these results underline the importance of Tau phosphorylation for its binding to FKBP52.Colocalization of Tau and FKBP52 in Primary Cortical Neurons and PC12 Cells.",
"The subcellular localization of Tau and FKBP52 was examined by immunofluorescence experiments with rat primary cortical neurons.",
"After 6 days of culture, and mild extraction selectively removing unbound cytosolic proteins while retaining proteins associated with the cytoskeleton, double staining was performed on neurons with monoclonal antibody Tau5 and affinity-purified polyclonal anti-FKBP52 antibody.",
"In agreement with an earlier report (19), Tau was concentrated in the distal portion of axons and at the growth cone neck, where a strong accumulation of FKBP52 was also observed (FIG.",
"4).",
"Colocalization and accumulation of FKBP52 and Tau were also found at the growth cones of PC12 cells (FIG.",
"4).",
"Very recently it has been reported that Tau is selectively enriched at axonal tips and that this may be due to its specific anchoring (20).",
"Our results suggest that FKBP52 may be involved in the trapping of Tau, and thereby able to influence its subcellular distribution.",
"FKBP52 Inhibits Tubulin Polymerization Induced by Tau In Vitro.",
"To demonstrate a functional interaction between Tau and FKBP52, a microtubule kinetic assay was set up.",
"In experiments with purified rat brain tubulin alone, no microtubule was formed, whereas in experiments with recombinant human Tau isoforms, an increased absorbance reflecting microtubule assembly was observed (FIG.",
"5).",
"However, when Tau was added to the tubulin in the presence of purified recombinant FKBP52, formation of microtubules was prevented, whereas GST was ineffective.",
"Similar results were obtained with the 6 isoforms of human Tau (FIG.",
"5).",
"We concluded that FKBP52 inhibits the promotion of microtubule assembly by Tau.",
"FKBP52 Prevents Tau Accumulation and Neurite Outgrowth in PC12 Cells: An FKBP52-inducible expression system based on a tetracycline-responsive element allowing the generation of a stably transformed PC12 cell line was used (21) to determine a cellular role for FKBP52.Among clones which were positively tested, one clone, so called H7C2, was selected and used to study the effects of FKBP52 overexpression on PC12 cells, and to further investigate the possible relationship between FKBP52 and Tau.",
"Under basal conditions H7C2 cells expressed endogenous FKBP52, and treatment with Dox (doxycycline) resulted in a marked increase of recombinant FKBP52 protein expression (FIG.",
"6A).",
"FKBP52 induction in H7C2 cells was about 4 fold after 5 days of Dox treatment.",
"The effect of FKBP52 on the accumulation of Tau was examined next.",
"The amount of Tau protein was determined by Western blotting of extracts from cultures of either PC12 cells or H7C2 cells, treated or not with NGF (50 nM) for 5 days with or without Dox.",
"In PC12 cells, FKBP52 expression was unchanged after treatment with NGF (FIG.",
"6B).",
"As expected, in both PC12 and H7C2 cells an increase in Tau was observed after NGF treatment.",
"However, when H7C2 cells were exposed to Dox in addition to NGF, thus overexpressing FKBP52, no additional accumulation of Tau protein occurred.",
"An increase in Tau protein was still observed in PC12 cells treated with NGF and Dox, ruling out the possibility that Dox was responsible for the lack of decrease in Tau (FIG.",
"6C).",
"In conclusion, FKBP52 prevented the accumulation of Tau induced by NGF in PC12 cells.",
"Since one role of Tau is to stimulate neurite outgrowth (12), we investigated the consequence of FKBP52 overexpression on neurite length in both PC12 and H7C2 cells.",
"In the absence of NGF, no neurite outgrowth was observed in H7C2 cells, whether or not they were treated with Dox for a week.",
"However in H7C2 cells treated with 50 nM NGF and Dox, a 40% (+7) decrease in neurite length, compared to control (H7C2 not treated with Dox) was observed (FIG.",
"6D).",
"The same effect of Dox on neurite length was observed in H7C2 cells treated with 10 or 20 nM NGF.",
"That Dox by itself was involved in the process of neurite outgrowth could be ruled out, since no difference in neurite length between Dox-treated and untreated PC12 cells was observed.",
"The inhibition of neurite outgrowth resulting from FKBP52 overexpression is in agreement with our previous report showing that the loss of FKBP52 in PC12 cells results in the formation of neurite extensions (9).",
"The FKBP52 effect on neurite length could be explained by the binding of Tau to FKBP52, removing Tau from microtubules.",
"In addition the prevention of Tau accumulation by overexpression of FKBP52 is consistent with the decrease of neurite length and evokes a potential role of this immunophilin in Tau function.",
"Discussion This newly discovered “anti-Tau” activity of FKBP52 leads us to re-examine the functions of this protein, which was originally identified and cloned as modulator of hormone steroid receptors (8, 22).",
"FKPB52 is a multimodular protein, which includes a peptidyl prolyl isomerase (“rotamase”) segment, the function of which is blocked by FK506 (23), rapamycin and some related non-immunosuppressive derivatives.",
"There is a noteworthy structural similarity between FKBP52 and Pin1: both proteins have a peptidyl-prolyl isomerase (PPIase) activity and a specific protein-protein interaction domain (7).",
"Since the Pin1 PPIase activity restores the function of phosphorylated Tau protein in a model of Alzheimer's disease (7), the interaction observed between Tau and FKBP52 may have implications for the pathogenesis of the tauopathies, including Alzheimer's disease.",
"It must be remembered that, unlike FKBP12 (24) FKBP52 does not bind calcineurin (25), and thus FKBP52 does not mediate the immunosuppressant capacity of FK506.Therefore, the pharmacological modulation of the rotamase activity of FKBP52 by non-immunosuppressive FK506/rapamycin derivatives may offer a novel approach for preventing/reducing the pathogenic effects of misfolded Tau.",
"In addition to its peptidyl prolyl isomerase activity, FKBP52 serves as a molecular chaperone.",
"This activity depends on its tetratricopeptide repeat domain (26) to which the molecular chaperone HSP90 and other proteins bind.",
"It has already been noted that chaperone co-chaperone protein complexes play a critical role in neurodegenerative diseases characterized by Tau accumulation (27).",
"We now report that FKBP52 could decrease the function/accumulation of Tau, and therefore suggest its possible involvement in these described cochaperone systems (27).",
"Our results establish a role of FKBP52 in Tau function.",
"The interaction described in this report rapidly deserves to be studied further, since effective pharmacological targeting of FKBP52 is likely to become a reality in the near future.",
"EXAMPLE 2: EFFECT OF FKBP52 ON OLIGOMERIZATION OF TAU IN VITRO Aggregates of Tau protein are characteristic of multiple neurodegenerative diseases.",
"(Delacourte A and Bué L, 2000).",
"Studies of conditions for Tau aggregation in vitro have led to different experimental systems including oxidative conditions, inductions by polyanions such as heparin, and by fatty acids such as arachidonic acid (Barghorn S and Mandelkow E, 2002).",
"To investigate the effect of FKBP52 on Tau oligomerization we monitored by sedimentation assay the ability of recombinant Tau protein (here using the longest isoform) to polymerise in oxidative conditions in presence or absence of recombinant FKBP52.After dialysis of Tau (0.5 mg/ml) overnight at 4° C. in Tris 10 mM pH7.4 and centrifugation at 14000 rpm, quantitative western blotting was used to monitor the polymerization of Tau protein.",
"In this condition sedimentation analysis revealed the presence of Tau in pellet fraction contrary to the experiment carried out in presence of DTT where no detectable pelletable polymers of Tau could be obtained (FIG.",
"7).",
"This experiment means that Tau in oxidative conditions self polymerise and confirms, as already reported, the importance of cysteines in first step of Tau oligomerization process (Schweers et al 1995).",
"The effects of coincubating, in oxidative medium, Tau and FKBP52 on Tau oligomerization process were monitored.",
"As shown on FIG.",
"8 no detectable presence of Tau in pellet fraction could be observed when dialysis were performed in equimolecular presence of FKBP52 where a pelletable polymers of Tau could be observed when coincubation was carried out in presence of GST used as control.",
"However when sedimentation analysis experiments were realized in varying the concentration of FKBP52 (1 to 0.1 mg/ml) where the concentration of Tau was constant (0.5 mg/ml) the presence of FKBP52 at 0.1 or at 0.25 mg/ml results in increasing Tau polymers in pellet where the presence of equimolecular or two times quantities of FKBP52 versus Tau prevent the presence of pelletable polymers of Tau (FIG.",
"9).",
"These results suggest a dual role for FKBP52: firstly: a FKBP52 conformational activity on Tau, possibly involving peptidyl prolyl isomerase activity of FKBP52, leading Tau in a favourable proaggregative form; secondly: FKBP52 could protecte by possible steric hindrance the ability of Tau to oligomerize via the formation of disulfide bridges.",
"EXAMPLE 3: DOWN REGULATION OF FKBP52 PROTEIN IN BRAINS FROM PATIENTS WITH ALZHEIMER DISEASE Human brain pre frontal cortex, obtained thanks to the access of National BrainBank (GIE NeuroCEB), were homogenized in 5 volumes of buffer containing Tris 10 mM, Saccharose 0.32M, DTT 1 mM and protease inhibitor cocktail.",
"The homogenates were centrifugated at 14000 RPM at 4° C. for 5 min.",
"The supernatant was used as soluble fraction.",
"The pellet was solubilised by homogenization in the same conditions and used as insoluble fraction.",
"FKBP52 levels in the soluble and insoluble fractions were analyzed by western blotting.",
"The FKBP52 level in soluble and insoluble fraction represents respectively 80% and 20% of total FKBP52; In the aim of elucidate if FKBP52 protein expression level might be altered in patient brain we have compared its expression in the pre frontal cortex of normal control (n=3) and patients with Alzheimer disease (n=12).",
"As shown on FIG.",
"10 marked reduction of FKBP52 in Alzheimer disease brains is observed in soluble fraction.",
"After normalization with GAPDH (Glyceraldehyde 3-phosphatedehydrogenase) expression levels of FKBP52 found in soluble fraction of Alzheimer disease brains represent 35% (±24) compared to the controls.",
"No modification of expression protein level of FKBP52 could be detectable in insoluble fraction; this last observation suggests that FKBP52 is not trapped in aggregates of Tau.",
"Subsequently the mRNA expression level of FKBP52 gene was analyzed by real time quantitative RT-PCR (QPCR) in prefrontal cortex of human brain disease and controls.",
"As shown on FIG.",
"11 no modification of FKBP52 mRNA level is observed in brain diseases versus control.",
"These results indicate that the decreasing of FKBP52 protein expression in the patient brain is due to a post transcriptional mechanism.",
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]
] |
Patent_15871187
|
[
[
"BLOCK DECODING METHOD AND SYSTEM FOR TWO-DIMENSIONAL CODE",
"The invention provides a block decoding method and system for a two-dimensional code.",
"The block decoding method includes: storing a received two-dimensional code image in an image data backup register; binarizing the received two-dimensional code image; searching for a boundary line of the two-dimensional code image; segmenting each of the regions into bit regions each of which corresponds to one bit data; re-acquiring the received two-dimensional code image stored in the image data backup register; calculating an average gray-scale value of all the pixels in the bit region as a gray-scale value of the bit region; calculating a gray-scale threshold of each of the bit regions n using the Otsu method; binarizing the bit region so as to obtain a binarized two-dimensional code image; and decoding the binarized two-dimensional code image.",
"In the system, the two-dimensional code image is segmented precisely, thereby effecting quick and accurate decoding."
],
[
"1.A block decoding method for a two-dimensional code, characterized by comprising: storing a received two-dimensional code image in an image data backup register; binarizing the received two-dimensional code image based on a gray-scale value of a pixel; searching for a boundary line of the two-dimensional code image based on a position detection pattern; searching for a version number and a correction pattern of the two-dimensional code image; segmenting the two-dimensional code image into regions based on the boundary line of the two-dimensional code image, a straight line where a boundary line of the position detection pattern is located and a straight line where a boundary line of the correction pattern is located; calculating the number of bits in each of the regions based on the position detection pattern, the correction pattern and the version number; segmenting each of the regions into bit regions each of which corresponds to one bit data, based on deformation amount of the position detection pattern and deformation amount of the correction pattern; re-acquiring the received two-dimensional code image stored in the image data backup register; calculating an average gray-scale value of all the pixels in the bit region as a gray-scale value of the bit region; calculating a gray-scale threshold of each of the bit regions based on the gray-scale value of the bit region using the Otsu method; binarizing the bit region based on the gray-scale threshold so as to obtain a binarized two-dimensional code image; and decoding the binarized two-dimensional code image.",
"2.A block decoding method for a two-dimensional code, characterized by comprising: storing a received two-dimensional code image in an image data backup register; binarizing the received two-dimensional code image based on a gray-scale value of a pixel; searching for a boundary line of the two-dimensional code image based on a position detection pattern; searching for a version number of the two-dimensional code image; segmenting the two-dimensional code image into regions based on the boundary line of the two-dimensional code image and a straight line where a boundary line of the position detection pattern is located; calculating the number of bits in each of the regions based on the position detection pattern and the version number; segmenting each of the regions into bit regions each of which corresponds to one bit data, based on deformation amount of the position detection pattern; re-acquiring the received two-dimensional code image stored in the image data backup register; calculating an average gray-scale value of all the pixels in the bit region as a gray-scale value of the bit region; calculating a gray-scale threshold of each of the bit regions based on the gray-scale value of the bit region using the Otsu method; binarizing the bit region based on the gray-scale threshold so as to obtain a binarized two-dimensional code image; and decoding the binarized two-dimensional code image.",
"3.The block decoding method for a two-dimensional code according to claim 1, wherein binarizing the received two-dimensional code image based on the gray-scale value of the pixel specifically includes: calculating a gray-scale threshold based on the gray-scale value of the pixel using an average value method; and binarizing the received two-dimensional code image based on the gray-scale threshold.",
"4.The block decoding method for a two-dimensional code according to claim 2, wherein binarizing the received two-dimensional code image based on the gray-scale value of the pixel specifically includes: calculating a gray-scale threshold based on the gray-scale value of the pixel using an average value method; and binarizing the received two-dimensional code image based on the gray-scale threshold.",
"5.The block decoding method for a two-dimensional code according to claim 1, wherein binarizing the received two-dimensional code image based on the gray-scale value of the pixel specifically includes: calculating a gray-scale threshold based on the gray-scale value of the pixel using the Otsu method; and binarizing the received two-dimensional code image based on the gray-scale threshold.",
"6.The block decoding method for a two-dimensional code according to claim 2, wherein binarizing the received two-dimensional code image based on the gray-scale value of the pixel specifically includes: calculating a gray-scale threshold based on the gray-scale value of the pixel using the Otsu method; and binarizing the received two-dimensional code image based on the gray-scale threshold.",
"7.The block decoding method for a two-dimensional code according to claim 1, wherein searching for the boundary line of the two-dimensional code image based on the position detection pattern specifically includes: determining two adjacent boundary lines in the two-dimensional code image based on three position detection patterns; translating the two adjacent boundary lines respectively so that the translated boundary lines pass through corner points of the position detection pattern; searching for black-and-white demarcation points of the received two-dimensional code image in the proximity of the translated boundary lines; and fitting the black-and-white demarcation points of the received two-dimensional code image using the least squares method so as to obtain the boundary lines of the two-dimensional code image.",
"8.The block decoding method for a two-dimensional code according to claim 2, wherein searching for the boundary line of the two-dimensional code image based on the position detection pattern specifically includes: determining two adjacent boundary lines in the two-dimensional code image based on three position detection patterns; translating the two adjacent boundary lines respectively so that the translated boundary lines pass through corner points of the position detection pattern; searching for black-and-white demarcation points of the received two-dimensional code image in the proximity of the translated boundary lines; and fitting the black-and-white demarcation points of the received two-dimensional code image using the least squares method so as to obtain the boundary lines of the two-dimensional code image.",
"9.The block decoding method for a two-dimensional code according to claim 1, wherein searching for the version number and the correction pattern of the two-dimensional code image specifically includes: searching for a position where the version number is located in the two-dimensional code image based on the boundary lines of the two-dimensional code image and the position detection pattern; decoding an image corresponding to the position where the version number is located to obtain the version number; determining a position of the correction pattern based on the version number and a shape of the position detection pattern; and searching in the two-dimensional code image for an image corresponding to the position of the correction pattern, and decoding the image to obtain the correction pattern.",
"10.The block decoding method for a two-dimensional code according to claim 1, wherein segmenting each of the regions into bit regions each of which corresponds to one bit data based on the deformation amount of the position detection pattern and the deformation amount of the correction pattern specifically includes: calculating a ratio of the lengths of two adjacent bits based on the number of bits and the length of bits of the position detection patterns having the same straight-line boundary or of the correction pattern; calculating the length of each bit in each region on the same straight-line boundary based on the ratio of the lengths of the two adjacent bits and the number of bits in each region on the same straight-line boundary; sequentially calculating the length of each bit on the boundaries of all the regions and marking segmenting points; and connecting the segmenting points on two opposite boundaries in each of the regions to segment each region into bit regions each of which corresponds to one bit.",
"11.The block decoding method for a two-dimensional code according to claim 2, wherein segmenting each of the regions into bit regions each of which corresponds to one bit data based on the deformation amount of the position detection pattern specifically includes: calculating a ratio of the lengths of two adjacent bits based on the number of bits and the length of bits of the position detection patterns having the same straight-line boundary; calculating the length of each bit in each region on the same straight-line boundary based on the ratio of the lengths of the two adjacent bits and the number of bits in each region on the same straight-line boundary; sequentially calculating the length of each bit on the boundaries of all the regions and marking segmenting points; and connecting the segmenting points on two opposite boundaries in each of the regions to segment each region into bit regions each of which corresponds to one bit.",
"12.A block decoding system for a two-dimensional code, characterized by comprising: a storage module which is configured for storing a received two-dimensional code image in an image data backup register; a first binarizing module which is configured for binarizing the received two-dimensional code image based on a gray-scale value of a pixel; a first searching module which is configured for searching for a boundary line of the two-dimensional code image based on a position detection pattern; a second searching module which is configured for searching for a version number and a correction pattern of the two-dimensional code image; a first segmenting module which is configured for segmenting the two-dimensional code image into regions based on the boundary line of the two-dimensional code image, a straight line where a boundary line of the position detection pattern is located and a straight line where a boundary line of the correction pattern is located; a first calculating module which is configured for calculating the number of bits in each of the regions based on the position detection pattern, the correction pattern and the version number; a second segmenting module which is configured for segmenting each of the regions into bit regions each of which corresponds to one bit data, based on deformation amount of the position detection pattern and deformation amount of the correction pattern; an acquiring module which is configured for re-acquiring the received two-dimensional code image stored in the image data backup register; a second calculating module which is configured for calculating an average gray-scale value of all the pixels in the bit region as a gray-scale value of the bit region; a third calculating module which is configured for calculating a gray-scale threshold of each of the bit regions based on the gray-scale value of the bit region using the Otsu method; a second binarizing module which is configured for binarizing the bit region based on the gray-scale threshold so as to obtain a binarized two-dimensional code image; and a decoding module which is configured for decoding the binarized two-dimensional code image.",
"13.A block decoding system for a two-dimensional code, characterized by comprising a storage module which is configured for storing a received two-dimensional code image in an image data backup register; a first binarizing module which is configured for binarizing the received two-dimensional code image based on a gray-scale value of a pixel; a first searching module which is configured for searching for a boundary line of the two-dimensional code image based on a position detection pattern; a second searching module which is configured for searching for a version number of the two-dimensional code image; a first segmenting module which is configured for segmenting the two-dimensional code image into regions based on the boundary line of the two-dimensional code image and a straight line where a boundary line of the position detection pattern is located; a first calculating module which is configured for calculating the number of bits in each of the regions based on the position detection pattern and the version number; a second segmenting module which is configured for segmenting each of the regions into bit regions each of which corresponds to one bit data, based on deformation amount of the position detection pattern; an acquiring module which is configured for re-acquiring the received two-dimensional code image stored in the image data backup register; a second calculating module which is configured for calculating an average gray-scale value of all the pixels in the bit region as a gray-scale value of the bit region; a third calculating module which is configured for calculating a gray-scale threshold of each of the bit regions based on the gray-scale value of the bit region using the Otsu method; a second binarizing module which is configured for binarizing the bit region based on the gray-scale threshold so as to obtain a binarized two-dimensional code image; and a decoding module which is configured for decoding the binarized two-dimensional code image."
],
[
"<SOH> BACKGROUND OF THE INVENTION <EOH>The two-dimensional code decoding algorithm based on image processing can be generally divided into six steps: acquiring an image, preprocessing image, positioning and correcting, reading data, error correcting and decoding.",
"The basic step of image preprocessing includes gray-scale transformation, image filtration, threshold segmentation and edge detection, and binarization is included in the threshold segmentation.",
"After enhancement algorithms such as contrast adaption and brightness adjustment are applied to the obtained gray-scale image, the background and the target in the image are segmented using the binarized image algorithm, and the image is converted into an image with only two colors of black and white for subsequent use in decoding.",
"However, due to factors such as different media on which the two-dimensional code is attached, different lighting environments and different imaging systems, the two-dimensional code images captured by the two-dimensional code reading devices may differ greatly, and the influence of noise, image lighting unevenness and a contrast that is too large or too small will all make the conversion of the two-dimensional code image into a binarized image be very complicated.",
"However, the effect of image binarization process has a direct influence on the two-dimensional code reading effect.",
"The binarization methods in the prior art have some deficiencies in dealing with a complicated background, and cannot well handle problems such as darkness, uneven lighting, too large contrast, or too small contrast, thus failing to obtain a good binarization effect.",
"A poor binarization effect of the image increases the difficulty in subsequent decoding, or increases amount of operation, or reduces accuracy of decoding, and may even results in that the decoding step cannot be performed successfully.",
"Chinese invention patent publication No.",
"CN104517089A discloses a two-dimensional code decoding system and method.",
"The decoding method includes: binarizing a two-dimensional code image to obtain a binarized image, and the binarization processing includes: segmenting the two-dimensional code image to obtain several block regions; acquiring gray-scale values of all the pixels in each of the block regions, and obtaining a gray-scale value of each of the block regions according to the gray-scale values of all the pixels; calculating a gray-scale threshold of each of the block regions according to an average gray-scale value of the predetermined range in which the block region is located; binarizing pixels in the block region to obtain a binarized image, according to the gray-scale threshold corresponding to each of the block regions; and decoding the binarized image to obtain information content contained in the two-dimensional code.",
"In binarizing the code image, by segmenting the code image into blocks, the average gray-scale value of a predetermined range of the block region in which the pixel is located is considered when determining whether the pixel in each block region is black or white during the process of restoring the code image.",
"In this way, interference from the external environment is avoided.",
"The two-dimensional code image is segmented into n*n block regions, where n>1.The two-dimensional code image is not segmented based on the functional modules of the two-dimensional code, and therefore information in the functional modules of the two-dimensional code cannot be positioned and decoded quickly and accurately.",
"Moreover, the two-dimensional code image is decoded by binarizing the pixels in the block regions after the gray-scale threshold of each block region is calculated, and one pixel does not indicate one data bit of the two-dimensional code image.",
"Therefore, a process of decoding the two-dimensional code by binarizing the pixels is complicated."
],
[
"<SOH> SUMMARY OF THE INVENTION <EOH>The technical problem to be addressed by the invention is to provide a block decoding method and system for a two-dimensional code, which have precise segmentation and accurate decoding.",
"In order to address the technical problem, the invention provides the following technical solutions.",
"A block decoding method for a two-dimensional code includes: storing a received two-dimensional code image in an image data backup register; binarizing the received two-dimensional code image based on a gray-scale value of a pixel; searching for a boundary line of the two-dimensional code image based on a position detection pattern; searching for a version number and a correction pattern of the two-dimensional code image; segmenting the two-dimensional code image into regions based on the boundary line of the two-dimensional code image, a straight line where a boundary line of the position detection pattern is located and a straight line where a boundary line of the correction pattern is located; calculating the number of bits in each of the regions based on the position detection pattern, the correction pattern and the version number; segmenting each of the regions into bit regions each of which corresponds to one bit data, based on deformation amount of the position detection pattern and deformation amount of the correction pattern; re-acquiring the received two-dimensional code image stored in the image data backup register; calculating an average gray-scale value of all the pixels in the bit region as a gray-scale value of the bit region; calculating a gray-scale threshold of each of the bit regions based on the gray-scale value of the bit region using the Otsu method; binarizing the bit region based on the gray-scale threshold so as to obtain a binarized two-dimensional code image; and decoding the binarized two-dimensional code image.",
"The invention has the following advantageous effects.",
"Since the sizes, shapes and positions of the position detection pattern and the correction image corresponding to the version number of the two-dimensional code are fixed, it is a reasonable to segment the two-dimensional code image into regions based on the position detection pattern and the correction pattern, and segment the region into bit regions corresponding to bit data based on the deformation amount of the position detection pattern and the deformation amount of the correction pattern, thereby eliminating the influence of the deformation amount of the two-dimensional code image on the segmentation precision of the two-dimensional code image, improving the segmentation precision and increasing the segmentation speed.",
"The received two-dimensional code image stored in the image data backup register is re-acquired after segmenting the two-dimensional code image into regions, and this is equivalent to re-acquiring the coordinates and gray-scale values of the pixels in the received two-dimensional code image, thereby preventing decoding precision of the two-dimensional code image from being affected by the previous binarized data, and improving decoding precision of the two-dimensional code.",
"The received two-dimensional code image is segmented into bit regions, and a gray-scale value of the bit region is calculated based on an average gray-scale value of pixels in the bit region, thereby effecting quick decoding.",
"The two-dimensional code image is segmented into at least one region, and a gray-scale threshold of each region is calculated using the Otsu method, thereby reducing the influence of environmental factors such as lights on the gray-scale value of each region, and reducing a possibility of misclassifying a foreground color from a background color in each region.",
"A block decoding method for a two-dimensional code includes: storing a received two-dimensional code image in an image data backup register; binarizing the received two-dimensional code image based on a gray-scale value of a pixel; searching for a boundary line of the two-dimensional code image based on a position detection pattern; searching for a version number of the two-dimensional code image; segmenting the two-dimensional code image into regions based on the boundary line of the two-dimensional code image and a straight line where a boundary line of the position detection pattern is located; calculating the number of bits in each of the regions based on the position detection pattern and the version number; segmenting each of the regions into bit regions each of which corresponds to one bit data, based on deformation amount of the position detection pattern; re-acquiring the received two-dimensional code image stored in the image data backup register; calculating an average gray-scale value of all the pixels in the bit region as a gray-scale value of the bit region; calculating a gray-scale threshold of each of the bit regions based on the gray-scale value of the bit region using the Otsu method; binarizing the bit region based on the gray-scale threshold so as to obtain a binarized two-dimensional code image; and decoding the binarized two-dimensional code image.",
"The invention has the following advantageous effects.",
"In case that some two-dimensional codes do not include a correction pattern, since the size, shape and position of the position detection pattern corresponding to the version number of the two-dimensional code are fixed, it is a reasonable to segment the two-dimensional code image into regions based on the position detection pattern, and segment the region into bit regions corresponding to bit data based on the deformation amount of the position detection pattern, thereby eliminating the influence of the deformation amount of the two-dimensional code image on the segmentation precision of the two-dimensional code image, improving the segmentation precision and increasing the segmentation speed.",
"The received two-dimensional code image stored in the image data backup register is re-acquired after segmenting the two-dimensional code image into regions, and this is equivalent to re-acquiring the coordinates and gray-scale values of the pixels in the received two-dimensional code image, thereby preventing decoding precision of the two-dimensional code image from being affected by the previous binarized data, and improving decoding precision of the two-dimensional code.",
"The received two-dimensional code image is segmented into bit regions, and a gray-scale value of the bit region is calculated based on an average gray-scale value of pixels in the bit region, thereby effecting quick decoding.",
"The two-dimensional code image is segmented into at least one region, and a gray-scale threshold of each region is calculated using the Otsu method, thereby reducing the influence of environmental factors such as lights on the gray-scale value of each region, and reducing a possibility of misclassifying a foreground color and a background color in each region.",
"A block decoding system for a two-dimensional code includes: a storage module which is configured for storing a received two-dimensional code image in an image data backup register; a first binarizing module which is configured for binarizing the received two-dimensional code image based on a gray-scale value of a pixel; a first searching module which is configured for searching for a boundary line of the two-dimensional code image based on a position detection pattern; a second searching module which is configured for searching for a version number and a correction pattern of the two-dimensional code image; a first segmenting module which is configured for segmenting the two-dimensional code image into regions based on the boundary line of the two-dimensional code image, a straight line where a boundary line of the position detection pattern is located and a straight line where a boundary line of the correction pattern is located; a first calculating module which is configured for calculating the number of bits in each of the regions based on the position detection pattern, the correction pattern and the version number; a second segmenting module which is configured for segmenting each of the regions into bit regions each of which corresponds to one bit data, based on deformation amount of the position detection pattern and deformation amount of the correction pattern; an acquiring module which is configured for re-acquiring the received two-dimensional code image stored in the image data backup register; a second calculating module which is configured for calculating an average gray-scale value of all the pixels in the bit region as a gray-scale value of the bit region; a third calculating module which is configured for calculating a gray-scale threshold of each of the bit regions based on the gray-scale value of the bit region using the Otsu method; a second binarizing module which is configured for binarizing the bit region based on the gray-scale threshold so as to obtain a binarized two-dimensional code image; and a decoding module which is configured for decoding the binarized two-dimensional code image.",
"The invention has the following advantageous effects.",
"The received two-dimensional code image is stored in the image data backup register, thus facilitating re-acquiring the received two-dimensional code image after segmenting into bit regions, avoiding the influence of binarization of the received two-dimensional code image on the decoding precision before segmenting into the bit regions, and improving the decoding precision.",
"The boundary line and the version number of the two-dimensional code image and the correction pattern are searched for based on the position detection pattern, and the two-dimensional code image is segmented into regions based on the boundary line of the position detection pattern and the boundary line of the correction pattern, thereby reducing the influence of environmental factors such as lights and scanning angle on the two-dimensional code image.",
"The region is segmented into bit regions corresponding to bit data based on the deformation amount of the position detection pattern and the deformation amount of the correction pattern, thereby preventing the accuracy of segmenting into the bit regions from being affected by the deformation amount of the received two-dimensional code image, and meanwhile effecting quick decoding of the two-dimensional code image by segmenting into the bit regions.",
"A block decoding system for a two-dimensional code includes: a storage module which is configured for storing a received two-dimensional code image in an image data backup register; a first binarizing module which is configured for binarizing the received two-dimensional code image based on a gray-scale value of a pixel; a first searching module which is configured for searching for a boundary line of the two-dimensional code image based on a position detection pattern; a second searching module which is configured for searching for a version number of the two-dimensional code image; a first segmenting module which is configured for segmenting the two-dimensional code image into regions based on the boundary line of the two-dimensional code image and a straight line where a boundary line of the position detection pattern is located; a first calculating module which is configured for calculating the number of bits in each of the regions based on the position detection pattern and the version number; a second segmenting module which is configured for segmenting each of the regions into bit regions each of which corresponds to one bit data, based on deformation amount of the position detection pattern; an acquiring module which is configured for re-acquiring the received two-dimensional code image stored in the image data backup register; a second calculating module which is configured for calculating an average gray-scale value of all the pixels in the bit region as a gray-scale value of the bit region; a third calculating module which is configured for calculating a gray-scale threshold of each of the bit regions based on the gray-scale value of the bit region using the Otsu method; a second binarizing module which is configured for binarizing the bit region based on the gray-scale threshold so as to obtain a binarized two-dimensional code image; and a decoding module which is configured for decoding the binarized two-dimensional code image.",
"The invention has the following advantageous effects.",
"In case that some two-dimensional codes do not include a correction pattern, the received two-dimensional code image is stored in the image data backup register, thus facilitating re-acquiring the received two-dimensional code image after segmenting into bit regions, avoiding the influence of binarization of the received two-dimensional code image on the decoding precision before segmenting into the bit regions, and improving the decoding precision.",
"The boundary line and the version number of the two-dimensional code image are searched for based on the position detection pattern, and the two-dimensional code image is segmented into regions based on the boundary line of the position detection pattern, thereby reducing the influence of environmental factors such as lights and scanning angle on the two-dimensional code image.",
"The region is segmented into bit regions corresponding to bit data based on the deformation amount of the position detection pattern, thereby preventing the accuracy of segmenting into the bit regions from being affected by the deformation amount of the received two-dimensional code image, and meanwhile effecting quick decoding of the two-dimensional code image by segmenting into the bit regions."
],
[
"CROSS REFERENCE TO RELATED APPLICATIONS The present application is a Continuation Application of PCT Application No.",
"PCT/CN2016/090993 filed on Jul.",
"22, 2016, which claims the benefit of Chinese Patent Application No.",
"201510446105.4 filed on Jul.",
"27, 2015.All the above are hereby incorporated by reference.",
"FIELD OF THE INVENTION The invention relates to the technical field of a two-dimensional code, and in particular to a block decoding method and system for a two-dimensional code.",
"BACKGROUND OF THE INVENTION The two-dimensional code decoding algorithm based on image processing can be generally divided into six steps: acquiring an image, preprocessing image, positioning and correcting, reading data, error correcting and decoding.",
"The basic step of image preprocessing includes gray-scale transformation, image filtration, threshold segmentation and edge detection, and binarization is included in the threshold segmentation.",
"After enhancement algorithms such as contrast adaption and brightness adjustment are applied to the obtained gray-scale image, the background and the target in the image are segmented using the binarized image algorithm, and the image is converted into an image with only two colors of black and white for subsequent use in decoding.",
"However, due to factors such as different media on which the two-dimensional code is attached, different lighting environments and different imaging systems, the two-dimensional code images captured by the two-dimensional code reading devices may differ greatly, and the influence of noise, image lighting unevenness and a contrast that is too large or too small will all make the conversion of the two-dimensional code image into a binarized image be very complicated.",
"However, the effect of image binarization process has a direct influence on the two-dimensional code reading effect.",
"The binarization methods in the prior art have some deficiencies in dealing with a complicated background, and cannot well handle problems such as darkness, uneven lighting, too large contrast, or too small contrast, thus failing to obtain a good binarization effect.",
"A poor binarization effect of the image increases the difficulty in subsequent decoding, or increases amount of operation, or reduces accuracy of decoding, and may even results in that the decoding step cannot be performed successfully.",
"Chinese invention patent publication No.",
"CN104517089A discloses a two-dimensional code decoding system and method.",
"The decoding method includes: binarizing a two-dimensional code image to obtain a binarized image, and the binarization processing includes: segmenting the two-dimensional code image to obtain several block regions; acquiring gray-scale values of all the pixels in each of the block regions, and obtaining a gray-scale value of each of the block regions according to the gray-scale values of all the pixels; calculating a gray-scale threshold of each of the block regions according to an average gray-scale value of the predetermined range in which the block region is located; binarizing pixels in the block region to obtain a binarized image, according to the gray-scale threshold corresponding to each of the block regions; and decoding the binarized image to obtain information content contained in the two-dimensional code.",
"In binarizing the code image, by segmenting the code image into blocks, the average gray-scale value of a predetermined range of the block region in which the pixel is located is considered when determining whether the pixel in each block region is black or white during the process of restoring the code image.",
"In this way, interference from the external environment is avoided.",
"The two-dimensional code image is segmented into n*n block regions, where n>1.The two-dimensional code image is not segmented based on the functional modules of the two-dimensional code, and therefore information in the functional modules of the two-dimensional code cannot be positioned and decoded quickly and accurately.",
"Moreover, the two-dimensional code image is decoded by binarizing the pixels in the block regions after the gray-scale threshold of each block region is calculated, and one pixel does not indicate one data bit of the two-dimensional code image.",
"Therefore, a process of decoding the two-dimensional code by binarizing the pixels is complicated.",
"SUMMARY OF THE INVENTION The technical problem to be addressed by the invention is to provide a block decoding method and system for a two-dimensional code, which have precise segmentation and accurate decoding.",
"In order to address the technical problem, the invention provides the following technical solutions.",
"A block decoding method for a two-dimensional code includes: storing a received two-dimensional code image in an image data backup register; binarizing the received two-dimensional code image based on a gray-scale value of a pixel; searching for a boundary line of the two-dimensional code image based on a position detection pattern; searching for a version number and a correction pattern of the two-dimensional code image; segmenting the two-dimensional code image into regions based on the boundary line of the two-dimensional code image, a straight line where a boundary line of the position detection pattern is located and a straight line where a boundary line of the correction pattern is located; calculating the number of bits in each of the regions based on the position detection pattern, the correction pattern and the version number; segmenting each of the regions into bit regions each of which corresponds to one bit data, based on deformation amount of the position detection pattern and deformation amount of the correction pattern; re-acquiring the received two-dimensional code image stored in the image data backup register; calculating an average gray-scale value of all the pixels in the bit region as a gray-scale value of the bit region; calculating a gray-scale threshold of each of the bit regions based on the gray-scale value of the bit region using the Otsu method; binarizing the bit region based on the gray-scale threshold so as to obtain a binarized two-dimensional code image; and decoding the binarized two-dimensional code image.",
"The invention has the following advantageous effects.",
"Since the sizes, shapes and positions of the position detection pattern and the correction image corresponding to the version number of the two-dimensional code are fixed, it is a reasonable to segment the two-dimensional code image into regions based on the position detection pattern and the correction pattern, and segment the region into bit regions corresponding to bit data based on the deformation amount of the position detection pattern and the deformation amount of the correction pattern, thereby eliminating the influence of the deformation amount of the two-dimensional code image on the segmentation precision of the two-dimensional code image, improving the segmentation precision and increasing the segmentation speed.",
"The received two-dimensional code image stored in the image data backup register is re-acquired after segmenting the two-dimensional code image into regions, and this is equivalent to re-acquiring the coordinates and gray-scale values of the pixels in the received two-dimensional code image, thereby preventing decoding precision of the two-dimensional code image from being affected by the previous binarized data, and improving decoding precision of the two-dimensional code.",
"The received two-dimensional code image is segmented into bit regions, and a gray-scale value of the bit region is calculated based on an average gray-scale value of pixels in the bit region, thereby effecting quick decoding.",
"The two-dimensional code image is segmented into at least one region, and a gray-scale threshold of each region is calculated using the Otsu method, thereby reducing the influence of environmental factors such as lights on the gray-scale value of each region, and reducing a possibility of misclassifying a foreground color from a background color in each region.",
"A block decoding method for a two-dimensional code includes: storing a received two-dimensional code image in an image data backup register; binarizing the received two-dimensional code image based on a gray-scale value of a pixel; searching for a boundary line of the two-dimensional code image based on a position detection pattern; searching for a version number of the two-dimensional code image; segmenting the two-dimensional code image into regions based on the boundary line of the two-dimensional code image and a straight line where a boundary line of the position detection pattern is located; calculating the number of bits in each of the regions based on the position detection pattern and the version number; segmenting each of the regions into bit regions each of which corresponds to one bit data, based on deformation amount of the position detection pattern; re-acquiring the received two-dimensional code image stored in the image data backup register; calculating an average gray-scale value of all the pixels in the bit region as a gray-scale value of the bit region; calculating a gray-scale threshold of each of the bit regions based on the gray-scale value of the bit region using the Otsu method; binarizing the bit region based on the gray-scale threshold so as to obtain a binarized two-dimensional code image; and decoding the binarized two-dimensional code image.",
"The invention has the following advantageous effects.",
"In case that some two-dimensional codes do not include a correction pattern, since the size, shape and position of the position detection pattern corresponding to the version number of the two-dimensional code are fixed, it is a reasonable to segment the two-dimensional code image into regions based on the position detection pattern, and segment the region into bit regions corresponding to bit data based on the deformation amount of the position detection pattern, thereby eliminating the influence of the deformation amount of the two-dimensional code image on the segmentation precision of the two-dimensional code image, improving the segmentation precision and increasing the segmentation speed.",
"The received two-dimensional code image stored in the image data backup register is re-acquired after segmenting the two-dimensional code image into regions, and this is equivalent to re-acquiring the coordinates and gray-scale values of the pixels in the received two-dimensional code image, thereby preventing decoding precision of the two-dimensional code image from being affected by the previous binarized data, and improving decoding precision of the two-dimensional code.",
"The received two-dimensional code image is segmented into bit regions, and a gray-scale value of the bit region is calculated based on an average gray-scale value of pixels in the bit region, thereby effecting quick decoding.",
"The two-dimensional code image is segmented into at least one region, and a gray-scale threshold of each region is calculated using the Otsu method, thereby reducing the influence of environmental factors such as lights on the gray-scale value of each region, and reducing a possibility of misclassifying a foreground color and a background color in each region.",
"A block decoding system for a two-dimensional code includes: a storage module which is configured for storing a received two-dimensional code image in an image data backup register; a first binarizing module which is configured for binarizing the received two-dimensional code image based on a gray-scale value of a pixel; a first searching module which is configured for searching for a boundary line of the two-dimensional code image based on a position detection pattern; a second searching module which is configured for searching for a version number and a correction pattern of the two-dimensional code image; a first segmenting module which is configured for segmenting the two-dimensional code image into regions based on the boundary line of the two-dimensional code image, a straight line where a boundary line of the position detection pattern is located and a straight line where a boundary line of the correction pattern is located; a first calculating module which is configured for calculating the number of bits in each of the regions based on the position detection pattern, the correction pattern and the version number; a second segmenting module which is configured for segmenting each of the regions into bit regions each of which corresponds to one bit data, based on deformation amount of the position detection pattern and deformation amount of the correction pattern; an acquiring module which is configured for re-acquiring the received two-dimensional code image stored in the image data backup register; a second calculating module which is configured for calculating an average gray-scale value of all the pixels in the bit region as a gray-scale value of the bit region; a third calculating module which is configured for calculating a gray-scale threshold of each of the bit regions based on the gray-scale value of the bit region using the Otsu method; a second binarizing module which is configured for binarizing the bit region based on the gray-scale threshold so as to obtain a binarized two-dimensional code image; and a decoding module which is configured for decoding the binarized two-dimensional code image.",
"The invention has the following advantageous effects.",
"The received two-dimensional code image is stored in the image data backup register, thus facilitating re-acquiring the received two-dimensional code image after segmenting into bit regions, avoiding the influence of binarization of the received two-dimensional code image on the decoding precision before segmenting into the bit regions, and improving the decoding precision.",
"The boundary line and the version number of the two-dimensional code image and the correction pattern are searched for based on the position detection pattern, and the two-dimensional code image is segmented into regions based on the boundary line of the position detection pattern and the boundary line of the correction pattern, thereby reducing the influence of environmental factors such as lights and scanning angle on the two-dimensional code image.",
"The region is segmented into bit regions corresponding to bit data based on the deformation amount of the position detection pattern and the deformation amount of the correction pattern, thereby preventing the accuracy of segmenting into the bit regions from being affected by the deformation amount of the received two-dimensional code image, and meanwhile effecting quick decoding of the two-dimensional code image by segmenting into the bit regions.",
"A block decoding system for a two-dimensional code includes: a storage module which is configured for storing a received two-dimensional code image in an image data backup register; a first binarizing module which is configured for binarizing the received two-dimensional code image based on a gray-scale value of a pixel; a first searching module which is configured for searching for a boundary line of the two-dimensional code image based on a position detection pattern; a second searching module which is configured for searching for a version number of the two-dimensional code image; a first segmenting module which is configured for segmenting the two-dimensional code image into regions based on the boundary line of the two-dimensional code image and a straight line where a boundary line of the position detection pattern is located; a first calculating module which is configured for calculating the number of bits in each of the regions based on the position detection pattern and the version number; a second segmenting module which is configured for segmenting each of the regions into bit regions each of which corresponds to one bit data, based on deformation amount of the position detection pattern; an acquiring module which is configured for re-acquiring the received two-dimensional code image stored in the image data backup register; a second calculating module which is configured for calculating an average gray-scale value of all the pixels in the bit region as a gray-scale value of the bit region; a third calculating module which is configured for calculating a gray-scale threshold of each of the bit regions based on the gray-scale value of the bit region using the Otsu method; a second binarizing module which is configured for binarizing the bit region based on the gray-scale threshold so as to obtain a binarized two-dimensional code image; and a decoding module which is configured for decoding the binarized two-dimensional code image.",
"The invention has the following advantageous effects.",
"In case that some two-dimensional codes do not include a correction pattern, the received two-dimensional code image is stored in the image data backup register, thus facilitating re-acquiring the received two-dimensional code image after segmenting into bit regions, avoiding the influence of binarization of the received two-dimensional code image on the decoding precision before segmenting into the bit regions, and improving the decoding precision.",
"The boundary line and the version number of the two-dimensional code image are searched for based on the position detection pattern, and the two-dimensional code image is segmented into regions based on the boundary line of the position detection pattern, thereby reducing the influence of environmental factors such as lights and scanning angle on the two-dimensional code image.",
"The region is segmented into bit regions corresponding to bit data based on the deformation amount of the position detection pattern, thereby preventing the accuracy of segmenting into the bit regions from being affected by the deformation amount of the received two-dimensional code image, and meanwhile effecting quick decoding of the two-dimensional code image by segmenting into the bit regions.",
"BRIEF DESCRIPTION OF THE ACCOMPANYING DRAWINGS FIG.",
"1 is a flowchart of a block decoding method for a two-dimensional code according to a first embodiment of the invention; FIG.",
"2 is an original diagram of a Chinese-sensible code according to the first embodiment of the invention; FIG.",
"3 is a schematic diagram of segmenting the Chinese-sensible code according to the first embodiment of the invention; FIG.",
"4 is a flowchart of a block decoding method of a two-dimensional code according to a second embodiment of the invention; FIG.",
"5 is an original diagram of a QR code according to the second embodiment of the invention; FIG.",
"6 is a schematic diagram of a boundary line of the QR code according to the second embodiment of the invention; and FIG.",
"7 is a schematic diagram of segmenting the QR code according to the second embodiment of the invention.",
"Reference numbers 1.first region; 2.second region; 3.third region; 4.fourth region; 5.fifth region; 6.sixth region; 7.seventh region; 8.eighth region; 9.ninth region; 10.position detection pattern; 11.correction pattern; 12.position detection pattern.",
"DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS In order to illustrate the technical solutions, the objects and effects of the invention in detail, embodiments are described below in conjunction with the accompanying drawings.",
"A critical concept of the invention is to segment a two-dimensional code image into regions in consideration of deformation amount of a position detection pattern and deformation amount of a correction pattern of the two-dimensional code image, and to divide the segmented region into bit regions corresponding to bit data, thereby improving segmenting precision; and to re-read the two-dimensional code image after the two-dimensional code image is segmented into bit regions, thereby realizing quick and accurate decoding.",
"A specific embodiment of the invention is described as follows.",
"Referring to FIG.",
"1, a block decoding method for a two-dimensional code includes: storing a received two-dimensional code image in an image data backup register; binarizing the received two-dimensional code image based on a gray-scale value of a pixel; searching for a boundary line of the two-dimensional code image based on a position detection pattern; searching for a version number and a correction pattern of the two-dimensional code image; segmenting the two-dimensional code image into regions based on the boundary line of the two-dimensional code image, a straight line where a boundary line of the position detection pattern is located and a straight line where a boundary line of the correction pattern is located; calculating the number of bits in each of the regions based on the position detection pattern, the correction pattern and the version number; segmenting each of the regions into bit regions each of which corresponds to one bit data, based on deformation amount of the position detection pattern and deformation amount of the correction pattern; re-acquiring the received two-dimensional code image stored in the image data backup register; calculating an average gray-scale value of all the pixels in the bit region as a gray-scale value of the bit region; calculating a gray-scale threshold of each of the bit regions based on the gray-scale value of the bit region using the Otsu method; binarizing the bit region based on the gray-scale threshold so as to obtain a binarized two-dimensional code image; and decoding the binarized two-dimensional code image.",
"Referring to FIG.",
"4, a block decoding method for a two-dimensional code includes: storing a received two-dimensional code image in an image data backup register; binarizing the received two-dimensional code image based on a gray-scale value of a pixel; searching for a boundary line of the two-dimensional code image based on a position detection pattern; searching for a version number of the two-dimensional code image; segmenting the two-dimensional code image into regions based on the boundary line of the two-dimensional code image and a straight line where a boundary line of the position detection pattern is located; calculating the number of bits in each of the regions based on the position detection pattern and the version number; segmenting each of the regions into bit regions each of which corresponds to one bit data, based on deformation amount of the position detection pattern; re-acquiring the received two-dimensional code image stored in the image data backup register; calculating an average gray-scale value of all the pixels in the bit region as a gray-scale value of the bit region; calculating a gray-scale threshold of each of the bit regions based on the gray-scale value of the bit region using the Otsu method; binarizing the bit region based on the gray-scale threshold so as to obtain a binarized two-dimensional code image; and decoding the binarized two-dimensional code image.",
"Further, binarizing the received two-dimensional code image based on the gray-scale value of the pixel specifically includes: calculating a gray-scale threshold based on the gray-scale value of the pixel using an average value method; and binarizing the received two-dimensional code image based on the gray-scale threshold.",
"It can be known from the above description that in case where the gray-scale threshold of the received two-dimensional code image is calculated using the average value method, such advantages as small data calculation amount and quick calculation process are realized.",
"Further, binarizing the received two-dimensional code image based on the gray-scale value of the pixel specifically includes: calculating a gray-scale threshold based on the gray-scale value of the pixel using the Otsu method; and binarizing the received two-dimensional code image based on the gray-scale threshold.",
"It can be known from the above description that in case where the gray-scale threshold of the received two-dimensional code image is calculated using the Otsu method, such advantages as reducing the possibility of misclassifying a foreground color from a background color are realized.",
"Further, searching for the boundary line of the two-dimensional code image based on the position detection pattern specifically includes: determining two adjacent boundary lines in the two-dimensional code image based on three position detection patterns; translating the two adjacent boundary lines respectively so that the translated boundary lines pass through corner points of the position detection pattern; searching for black-and-white demarcation points of the received two-dimensional code image in the proximity of the translated boundary lines; and fitting the black-and-white demarcation points of the received two-dimensional code image using the least squares method so as to obtain the boundary lines of the two-dimensional code image.",
"It can be known from the above description that when determining the boundary lines of the two-dimensional code image based on three position detection patterns, two adjacent boundary lines in the two-dimensional code image are determined based on two position detection patterns having the same straight-line boundary, then the two adjacent boundary lines are translated, and then black-and-white demarcation points are searched for in the proximity of the translated boundary lines and the black-and-white demarcation points are fitted using the least squares method so as to obtain the boundary lines of the two-dimensional code image, thus having an advantage of quick and accurate positioning.",
"Further, searching for the version number and the correction pattern of the two-dimensional code image specifically includes: searching for a position where the version number is located in the two-dimensional code image based on the boundary lines of the two-dimensional code image and the position detection pattern; decoding an image corresponding to the position where the version number is located to obtain the version number; determining a position of the correction pattern based on the version number and a shape of the position detection pattern; and searching in the two-dimensional code image for an image corresponding to the position of the correction pattern, and decoding the image to obtain the correction pattern.",
"It can be known from the above description that the version number in the two-dimensional code image may be found out based on the shape and the position of the position detection pattern, and can be decoded.",
"The position of the correction pattern can be determined based on the version number and the position detection pattern.",
"The above process is reasonable.",
"Further, segmenting each of the regions into bit regions each of which corresponds to one bit data based on the deformation amount of the position detection pattern and the deformation amount of the correction pattern specifically includes: calculating a ratio of the lengths of two adjacent bits based on the number of bits and the length of bits of the position detection patterns having the same straight-line boundary or of the correction pattern; calculating the length of each bit in each region on the same straight-line boundary based on the ratio of the lengths of the two adjacent bits and the number of bits in each region on the same straight-line boundary; sequentially calculating the length of each bit on the boundaries of all the regions and marking segmenting points; and connecting the segmenting points on two opposite boundaries in each of the regions to segment each region into bit regions each of which corresponds to one bit.",
"It can be known from the above description that the number of bits in the width direction and the number of bits in the length direction of each region can be calculated based on the number of bits in the length direction and the number of bits in the width direction of the position detection pattern and the correction pattern, and the number of bits in each region is further calculated.",
"The length of bits on the boundary of each region may be calculated based on deformation amount on the boundaries of the position detection pattern and the correction pattern, and each of the regions may be segmented into bit regions each of which corresponds to one bit.",
"The above process is reasonable, thereby preventing decoding precision of the received two-dimensional code image from being affected by the deformation amount of the received two-dimensional code image, and improving decoding precision of the two-dimensional code image.",
"Further, segmenting each of the regions into bit regions each of which corresponds to one bit data based on the deformation amount of the position detection pattern specifically includes: calculating a ratio of the lengths of two adjacent bits based on the number of bits and the length of bits of the position detection patterns having the same straight-line boundary; calculating the length of each bit in each region on the same straight-line boundary based on the ratio of the lengths of the two adjacent bits and the number of bits in each region on the same straight-line boundary; sequentially calculating the length of each bit on the boundaries of all the regions and marking segmenting points; and connecting the segmenting points on two opposite boundaries in each of the regions to segment each region into bit regions each of which corresponds to one bit.",
"It can be known from the above description that the number of bits in the width direction and the number of bits in the length direction of each region can be calculated based on the number of bits in the length direction and the number of bits in the width direction of the position detection pattern, and the number of bits in each region is further calculated.",
"The length of bits on the boundary of each region may be calculated based on deformation amount on the boundary of the position detection pattern, and each of the regions may be segmented into bit regions each of which corresponds to one bit.",
"The above process is reasonable, thereby preventing decoding precision of the received two-dimensional code image from being affected by the deformation amount of the received two-dimensional code image, and improving decoding precision of the two-dimensional code image.",
"Referring to FIG.",
"1 to FIG.",
"3, a first embodiment of the invention is described as follows.",
"A block decoding method for a two-dimensional code is disclosed.",
"Referring to FIG.",
"2, a received two-dimensional code image is stored in an image data backup register.",
"The received two-dimensional code is a Chinese-sensible code.",
"A position detection pattern 10 and a correction pattern 11 of the Chinese-sensible code are shown in FIG.",
"2.The received two-dimensional code image is binarized based on a gray-scale value of a pixel.",
"Specifically, gray-scale threshold is calculated based on the gray-scale value of the pixel using an average value method; the received two-dimensional code image is binarized based on the gray-scale threshold; a boundary line of the two-dimensional code image is searched for based on the position detection pattern 10.The version number and the correction pattern 11 of the two-dimensional code image is searched for.",
"Specifically, a position where the version number is located in the two-dimensional code image can be found out based on the boundary line and the position detection pattern 10 of the two-dimensional code image; an image corresponding to the position where the version number is located is decoded to obtain the version number; a position of the correction pattern 11 is determined based on the version number and a shape of the position detection pattern 10; an image corresponding to the position of the correction pattern 11 is searched for in the two-dimensional code image, and the image is decoded.",
"Referring to FIG.",
"3, the two-dimensional code image is segmented into regions based on the boundary line of the two-dimensional code image, a straight line where a boundary line of the position detection pattern 10 is located and a straight line where a boundary line of the correction pattern 11 is located.",
"The number of bits in each of the regions is calculated based on the position detection pattern 10, the correction pattern 11 and the version number.",
"Each of the regions is segmented into bit regions each of which corresponds to one bit data based on deformation amount of the position detection pattern 10 and deformation amount of the correction pattern 11.Specifically, a ratio of the lengths of two adjacent bits can be calculated based on the number of bits and the length of bits of the position detection patterns 10 having the same straight-line boundary or of the correction pattern 11; the length of each bit in each region on the same straight-line boundary is calculated based on the ratio of the lengths of the two adjacent bits and the number of bits in each region on the same straight-line boundary; the length of each bit on the boundaries of all the regions is sequentially calculated and segmenting points are marked; the segmenting points on two opposite boundaries in each of the regions are connected to segment each region into bit regions each of which corresponds to one bit; the received two-dimensional code image stored in the image data backup register is re-acquired; an average gray-scale value of all the pixels in the bit region is calculated as a gray-scale value of the bit region; a gray-scale threshold of each bit region is calculated based on the gray-scale value of the bit region using the Otsu method; the bit region is binarized based on the gray-scale threshold so as to obtain a binarized two-dimensional code image; the binarized two-dimensional code image is decoded.",
"Referring to FIG.",
"4 to FIG.",
"7, a second embodiment of the invention is described as follows.",
"A block decoding method for a two-dimensional code is disclosed.",
"Referring to FIG.",
"5, a received two-dimensional code image is stored in an image data backup register.",
"The received two-dimensional code is a QR code, and a position detection pattern 12 of the QR code is shown in FIG.",
"5.The QR code in FIG.",
"5 does not include a correction pattern.",
"The received two-dimensional code image is binarized based on a gray-scale value of a pixel.",
"Specifically, a gray-scale threshold is calculated based on the gray-scale value of the pixel using the Otsu method; the received two-dimensional code image is binarized based on the gray-scale threshold.",
"Referring to FIG.",
"6, a boundary line of the two-dimensional code image is searched for based on the position detection pattern 12.Specifically, two adjacent boundary lines u and 1 in the two-dimensional code image can be determined based on three position detection patterns 12; the two adjacent boundary lines u and 1 are translated respectively so that the translated boundary lines pass through corner points Q and P of the pattern detection pattern 12; black-and-white demarcation points of the received two-dimensional code image are searched for in the proximity of the translated boundary lines; the black-and-white demarcation points of the received two-dimensional code image are fit using the least squares method so as to obtain the boundary lines d and r of the two-dimensional code image; a version number v of the two-dimensional code image is searched for.",
"Referring to FIG.",
"7, the two-dimensional code image is segmented into nine regions based on the boundary lines of the two-dimensional code image and straight lines where boundary lines of the position detection patterns 12 are located.",
"The nine regions are a first region 1, a second region 2, a third region 3, a fourth region 4, a fifth region 5, a sixth region 6, a seventh region 7, an eighth region 8 and a ninth region 9.The number of bits in each region is calculated based on the position detection pattern 12 and the version number v. Specifically, the position detection pattern 12 in FIG.",
"6 includes 49 bit regions, wherein seven bits are arranged in a width direction of the position detection pattern 12, and seven bits are arranged in a length direction of the position direction pattern 12.That is, seven bits are arranged at both sides of each of the first region 1, the second region 2 and the fourth region 4, and seven bits are arranged in each of the width direction and the length direction of the third region 3.Seven bits are arranged in the length direction at one side of each of the fifth region 5, the sixth region 6, the seventh region 7 and the eighth region 8.Seven bits are arranged in the width direction of the fifth region 5.Assuming the total length of the two-dimensional code in a transverse direction is m, m=4v+17 is obtained based on the version number.",
"The length of bits in the length direction of the fifth region 5 is calculated, m−14=4v+3.The length of the other side of each of the sixth region 6, the seventh region 7 and the eighth region 8 is 4v+3.Each region is segmented into bit regions each of which corresponds to one bit, based on deformation amount of the position detection pattern 12.Specifically, a ratio of the lengths of two adjacent bits can be calculated based on the number of bits and the length of bits in each of the position detection patterns 12 having the same straight-line boundary.",
"Specifically, for example, for an upper length side of the fifth region 5, a straight line where it is located is an upper boundary line of the two-dimensional code image.",
"Assuming the length of each bit on the upper boundary line of the two-dimensional code image is denoted as ti from left to right, where i=1, 2, .",
".",
".",
"m, and it is known that the length of an upper boundary line of the first region 1 is denoted as d1, the length of an upper boundary line of the fourth region 4 is denoted as d4, the total length of the upper boundary line of the two-dimensional code image is denoted as d0, then the ratio of the lengths of two adjacent bits is represented as t i + 1 / t 4 = d 4 / d 1 ( m - 7 ) , The length of each bit in each region on the same straight-line boundary can be calculated based on the ratio of the lengths of the two adjacent bits and the number of bits in each region on the same straight-line boundary.",
"The length of each bit on the boundaries of all the regions is sequentially calculated, and segmenting points are marked.",
"The segmenting points on two opposite boundaries in each of the regions are connected to segment each region into bit regions each of which corresponds to one bit.",
"The received two-dimensional code image stored in the image data backup register is re-acquired.",
"An average gray-scale value of all the pixels in the bit region is calculated as a gray-scale value of the bit region.",
"A gray-scale threshold of each of the bit regions is calculated based on the gray-scale value of the bit region using the Otsu method.",
"The bit region is binarized based on the gray-scale threshold so as to obtain a binarized two-dimensional code image.",
"The binarized two-dimensional code image is decoded.",
"A block decoding system for a two-dimensional code includes: a storage module which is configured for storing a received two-dimensional code image in an image data backup register; a first binarizing module which is configured for binarizing the received two-dimensional code image based on a gray-scale value of a pixel; a first searching module which is configured for searching for a boundary line of the two-dimensional code image based on a position detection pattern; a second searching module which is configured for searching for a version number and a correction pattern of the two-dimensional code image; a first segmenting module which is configured for segmenting the two-dimensional code image into regions based on the boundary line of the two-dimensional code image, a straight line where a boundary line of the position detection pattern is located and a straight line where a boundary line of the correction pattern is located; a first calculating module which is configured for calculating the number of bits in each of the regions based on the position detection pattern, the correction pattern and the version number; a second segmenting module which is configured for segmenting each of the regions into bit regions each of which corresponds to one bit data, based on deformation amount of the position detection pattern and deformation amount of the correction pattern; an acquiring module which is configured for re-acquiring the received two-dimensional code image stored in the image data backup register; a second calculating module which is configured for calculating an average gray-scale value of all the pixels in the bit region as a gray-scale value of the bit region; a third calculating module which is configured for calculating a gray-scale threshold of each of the bit regions based on the gray-scale value of the bit region using the Otsu method; a second binarizing module which is configured for binarizing the bit region based on the gray-scale threshold so as to obtain a binarized two-dimensional code image; and a decoding module which is configured for decoding the binarized two-dimensional code image.",
"A third embodiment of the invention is described as follows.",
"A block decoding system for a two-dimensional code includes: a storage module which is configured for storing a received two-dimensional code image in an image data backup register; a first binarizing module which is configured for binarizing the received two-dimensional code image based on a gray-scale value of a pixel; a first searching module which is configured for searching for a boundary line of the two-dimensional code image based on a position detection pattern; a second searching module which is configured for searching for a version number and a correction pattern of the two-dimensional code image; a first segmenting module which is configured for segmenting the two-dimensional code image into regions based on the boundary line of the two-dimensional code image, a straight line where a boundary line of the position detection pattern is located and a straight line where a boundary line of the correction pattern is located; a first calculating module which is configured for calculating the number of bits in each of the regions based on the position detection pattern, the correction pattern and the version number; a second segmenting module which is configured for segmenting each of the regions into bit regions each of which corresponds to one bit data, based on deformation amount of the position detection pattern and deformation amount of the correction pattern; an acquiring module which is configured for re-acquiring the received two-dimensional code image stored in the image data backup register; a second calculating module which is configured for calculating an average gray-scale value of all the pixels in the bit region as a gray-scale value of the bit region; a third calculating module which is configured for calculating a gray-scale threshold of each of the bit regions based on the gray-scale value of the bit region using the Otsu method; a second binarizing module which is configured for binarizing the bit region based on the gray-scale threshold so as to obtain a binarized two-dimensional code image; and a decoding module which is configured for decoding the binarized two-dimensional code image.",
"A block decoding system for a two-dimensional code includes: a storage module which is configured for storing a received two-dimensional code image in an image data backup register; a first binarizing module which is configured for binarizing the received two-dimensional code image based on a gray-scale value of a pixel; a first searching module which is configured for searching for a boundary line of the two-dimensional code image based on a position detection pattern; a second searching module which is configured for searching for a version number of the two-dimensional code image; a first segmenting module which is configured for segmenting the two-dimensional code image into regions based on the boundary line of the two-dimensional code image and a straight line where a boundary line of the position detection pattern is located; a first calculating module which is configured for calculating the number of bits in each of the regions based on the position detection pattern and the version number; a second segmenting module which is configured for segmenting each of the regions into bit regions each of which corresponds to one bit data, based on deformation amount of the position detection pattern; an acquiring module which is configured for re-acquiring the received two-dimensional code image stored in the image data backup register; a second calculating module which is configured for calculating an average gray-scale value of all the pixels in the bit region as a gray-scale value of the bit region; a third calculating module which is configured for calculating a gray-scale threshold of each of the bit regions based on the gray-scale value of the bit region using the Otsu method; a second binarizing module which is configured for binarizing the bit region based on the gray-scale threshold so as to obtain a binarized two-dimensional code image; and a decoding module which is configured for decoding the binarized two-dimensional code image.",
"A fourth embodiment of the invention is described as follows.",
"A block decoding system for a two-dimensional code includes: a storage module which is configured for storing a received two-dimensional code image in an image data backup register; a first binarizing module which is configured for binarizing the received two-dimensional code image based on a gray-scale value of a pixel; a first searching module which is configured for searching for a boundary line of the two-dimensional code image based on a position detection pattern; a second searching module which is configured for searching for a version number of the two-dimensional code image; a first segmenting module which is configured for segmenting the two-dimensional code image into regions based on the boundary line of the two-dimensional code image and a straight line where a boundary line of the position detection pattern is located; a first calculating module which is configured for calculating the number of bits in each of the regions based on the position detection pattern and the version number; a second segmenting module which is configured for segmenting each of the regions into bit regions each of which corresponds to one bit data, based on deformation amount of the position detection pattern; an acquiring module which is configured for re-acquiring the received two-dimensional code image stored in the image data backup register; a second calculating module which is configured for calculating an average gray-scale value of all the pixels in the bit region as a gray-scale value of the bit region; a third calculating module which is configured for calculating a gray-scale threshold of each of the bit regions based on the gray-scale value of the bit region using the Otsu method; a second binarizing module which is configured for binarizing the bit region based on the gray-scale threshold so as to obtain a binarized two-dimensional code image; and a decoding module which is configured for decoding the binarized two-dimensional code image.",
"To sum up, in the block decoding method and system for a two-dimensional code provided by the invention, a boundary of the two-dimensional code image is determined based on a position detection pattern of the received two-dimensional code image, thereby effecting accurate positioning; the two-dimensional code image is segmented into regions based on the straight lines where the position detection pattern and the correction pattern are located, thereby facilitating decoding and reducing an influence of environmental factor such as lights and angle on the received two-dimensional code image; the region is segmented into bit regions each of which corresponds to one bit based on deformation amount of the position detection pattern and deformation amount of the correction pattern, thereby effecting quick decoding of the two-dimensional code image; the received two-dimensional code image stored in the image data backup register is re-acquired after segmenting the two-dimensional code image into regions, and this is equivalent to re-acquiring the coordinates and gray-scale values of the pixels in the received two-dimensional code image, thereby improving decoding precision of the two-dimensional code.",
"In the system, the two-dimensional code image is segmented precisely, thereby avoiding external interference and realizing accurate decoding."
]
] |
Patent_15871188
|
[
[
"METHODS AND SOFTWARE FOR REDUCING MACHINING EQUIPMENT USAGE WHEN MACHINING MULTIPLE OBJECTS FROM A SINGLE WORKPIECE",
"Methods for providing a workpiece computer model including a plurality of objects defined in a body of material.",
"A temporary support frame is provided as part of a two-sided machining process in which the workpiece is partially milled from an obverse side.",
"The machine-control instructions are also based on one or more occupying structures added to the workpiece to fill in one or more excess unoccupied regions of the workpiece that would otherwise be machined away during machining of the objects.",
"Providing such occupying structure(s) reduces the amount of machining that needs to be performed."
],
[
"1.A method of providing a workpiece computer model including a plurality of objects defined in a body of material, the method comprising: receiving, a graphical representation of a temporary support frame to be machined from the body of material, wherein the graphical representation of the temporary support frame includes: first and second surfaces spaced from one another; and an opening for receiving graphical representations of computer models of the plurality of objects, the opening extending from the first side to the second side; receiving a selection of the graphical representations of the plurality of objects to be machined from the workpiece; locating the graphical representations of the plurality of objects in the opening so that the graphical representations of the plurality of objects are spaced from one another and from the graphical representation of the temporary support frame so as to permit machining of the plurality of objects; receiving an identification of one or more excess unoccupied regions within the opening after the locating of the graphical representations of the plurality of objects; for each excess unoccupied region, generating a graphical representation of an occupying structure occupying at least one of the one or more excess unoccupied regions; and generating a workpiece computer model including a plurality of objects defined in a body of material, wherein the workpiece computer model further comprises information for generating a machine control instruction set for controlling machining equipment to machine the plurality of objects into discrete objects so that when machining operations on the body of material are done, each occupying structure substantially remains as a remnant of the machining.",
"2.The method according to claim 1, wherein the locating of the graphical representations of the plurality of objects in the opening includes executing automated-nesting algorithms that automatically locate the graphical representations of the plurality of objects within the opening in a manner that consolidates excess unoccupied regions into a smaller number of larger unoccupied regions.",
"3.The method according to claim 1, wherein the locating of the graphical representations of the plurality of objects in the opening includes clustering the graphical representation of the plurality of objects into a cluster in one region of the opening so as to create an excess unoccupied region partially bordered by the temporary support frame and partially bordered by the cluster.",
"4.The method according to claim 4, wherein the generating of a graphical representation of an occupying structure for the excess unoccupied region partially bordered by the temporary support frame and partially bordered by the cluster includes generating a graphical representation that moves a portion of an inner perimeter of the graphical representation of the temporary support frame proximate to the cluster.",
"5.The method according to claim 1, wherein: the receiving of an identification of one or more excess unoccupied regions includes receiving an identification of an island region surrounded by ones of the graphical representations of the plurality of objects; and the generating of a graphical representation of an occupying structure includes generating a graphical representation of an island structure.",
"6.The method according to claim 1, wherein the receiving of an identification of one or more unoccupied regions includes receiving inputs from the user that create an occupying structure in one of the one or more excess unoccupied regions.",
"7.The method according to claim 6, wherein the receiving of inputs includes receiving inputs that extends a portion of the graphical representation of the temporary support frame toward a cluster of the graphical representations of the plurality of objects within the opening.",
"8.The method according to claim 6, wherein the receiving of inputs includes receiving inputs that create an island structure surrounded by ones of the graphical representations of the plurality of objects.",
"9.The method according to claim 1, further comprising executing automated excess unoccupied region identification algorithms, wherein the receiving of an identification of one or more excess unoccupied regions includes receiving an identification of one or more excess unoccupied regions from the executing of the automated excess unoccupied region identification algorithms.",
"10.The method according to claim 1, wherein generating a graphical representation of an occupying structure includes executing automated occupying structure generating algorithms that generate the graphical representation of the occupying structure.",
"11.The method according to claim 1, wherein the graphical representation of the temporary support frame includes interlock features.",
"12.The method according to claim 11, wherein the generating of a graphical representation of an occupying structure includes generating a graphical representation of an occupying structure that includes a graphical representation of at least one interlock feature.",
"13.The method according to claim 12, wherein the locating of the graphical representations of the plurality of objects in the opening includes clustering the graphical representation of the plurality of objects into a cluster in one region of the opening so as to create an excess unoccupied region partially bordered by the temporary support frame and partially bordered by the cluster.",
"15.The method according to claim 12, wherein the locating of the graphical representations of the plurality of objects in the opening includes clustering the graphical representation of the plurality of objects into a cluster in one region of the opening so as to create an excess unoccupied region partially bordered by the temporary support frame and partially bordered by the cluster.",
"16.The method according to claim 15, wherein the graphical representation of at least one interlock feature is included on the portion of the inner perimeter of the graphical representation of the temporary support frame proximate to the cluster.",
"17.The method according to claim 1, further comprising receiving a selection of the graphical representation of the temporary support frame from a set of predefined graphical representations of differing temporary support frames.",
"18.The method according to claim 17, wherein the receiving of a selection of the graphical representation of the temporary support frame includes receiving a user selection of the graphical representation of the temporary support frame.",
"19.The method according to claim 18, further comprising displaying a plurality of the predefined graphical representations of differing temporary support frames in the set of the predefined graphical representations of differing temporary support frames in a manner that allows a user to select a desired one of the displayed plurality of predefined graphical representations of differing temporary support frames.",
"20.The method according to claim 17, wherein the receiving of a selection of the graphical representation of the temporary support frame includes receiving the selection based on a selection of a particular piece of stock material."
],
[
"<SOH> BACKGROUND <EOH>Many types of objects are manufactured using rotary-tool milling and other types of subtractive manufacturing processes.",
"Typically, a single object is made from a single body of material, or “workpiece,” such as a block or slab of steel or aluminum.",
"For example, steel and aluminum parts for any of a wide variety of assemblies are often machined from individual workpieces using one or more milling machines.",
"However, making such machined parts can be labor intensive as operators load and unload individual workpieces to and from milling machines."
],
[
"<SOH> SUMMARY OF THE DISCLOSURE <EOH>A method of providing a workpiece computer model including a plurality of objects defined in a body of material, the method comprising: receiving, a graphical representation of a temporary support frame to be machined from the body of material, wherein the graphical representation of the temporary support frame includes: first and second surfaces spaced from one another; and an opening for receiving graphical representations of computer models of the plurality of objects, the opening extending from the first side to the second side; receiving a selection of the graphical representations of the plurality of objects to be machined from the workpiece; locating the graphical representations of the plurality of objects in the opening so that the graphical representations of the plurality of objects are spaced from one another and from the graphical representation of the temporary support frame so as to permit machining of the plurality of objects; receiving an identification of one or more excess unoccupied regions within the opening after the locating of the graphical representations of the plurality of objects; and for each excess unoccupied region, generating a graphical representation of an occupying structure occupying at least one of the one or more excess unoccupied regions; and generating a workpiece computer model including a plurality of objects defined in a body of material."
],
[
"RELATED APPLICATION DATA This application claims the benefit of priority of U.S. Non-provisional application Ser.",
"No.",
"15/487,395, filed on Apr.",
"13, 2017, and entitled “METHODS AND SOFTWARE FOR REDUCING MACHINING EQUIPMENT USAGE WHEN MACHINING MULTIPLE OBJECTS FROM A SINGLE WORKPIECE,” which claims the benefit of U.S.",
"Provisional Patent Application Ser.",
"No.",
"62/322,275, filed on Apr.",
"14, 2016, and titled “METHODS AND SOFTWARE FOR REDUCING MACHINING EQUIPMENT USAGE WHEN MACHINING MULTIPLE OBJECTS FROM A SINGLE WORKPIECE.” Each of U.S. Non-provisional application Ser.",
"No.",
"15/487,395 and U.S.",
"Provisional Patent Application Ser.",
"No.",
"62/322,275 is incorporated herein by reference in its entirety.",
"FIELD OF THE INVENTION The present invention generally relates to the field of machining.",
"In particular, the present invention is directed to methods and software for reducing machining equipment usage when machining multiple objects from a single workpiece.",
"BACKGROUND Many types of objects are manufactured using rotary-tool milling and other types of subtractive manufacturing processes.",
"Typically, a single object is made from a single body of material, or “workpiece,” such as a block or slab of steel or aluminum.",
"For example, steel and aluminum parts for any of a wide variety of assemblies are often machined from individual workpieces using one or more milling machines.",
"However, making such machined parts can be labor intensive as operators load and unload individual workpieces to and from milling machines.",
"SUMMARY OF THE DISCLOSURE A method of providing a workpiece computer model including a plurality of objects defined in a body of material, the method comprising: receiving, a graphical representation of a temporary support frame to be machined from the body of material, wherein the graphical representation of the temporary support frame includes: first and second surfaces spaced from one another; and an opening for receiving graphical representations of computer models of the plurality of objects, the opening extending from the first side to the second side; receiving a selection of the graphical representations of the plurality of objects to be machined from the workpiece; locating the graphical representations of the plurality of objects in the opening so that the graphical representations of the plurality of objects are spaced from one another and from the graphical representation of the temporary support frame so as to permit machining of the plurality of objects; receiving an identification of one or more excess unoccupied regions within the opening after the locating of the graphical representations of the plurality of objects; and for each excess unoccupied region, generating a graphical representation of an occupying structure occupying at least one of the one or more excess unoccupied regions; and generating a workpiece computer model including a plurality of objects defined in a body of material.",
"BRIEF DESCRIPTION OF THE DRAWINGS For the purpose of illustrating the invention, the drawings show aspects of one or more embodiments of the invention.",
"However, it should be understood that the present invention is not limited to the precise arrangements and instrumentalities shown in the drawings, wherein: FIG.",
"1A is a plan view of a first workpiece for creating two objects using a temporary support frame, illustrating expanses of excess unoccupied regions of a workpiece that are machined away during machining used to form the two objects; FIG.",
"1B is a plan view of a second workpiece for creating the same two objects of FIG.",
"1A but providing occupying structures that occupy excess unoccupied regions of the workpiece to reduce the amount of machining required to form the two objects; FIG.",
"1C is a plan view of a third workpiece for creating the same two objects of FIGS.",
"1A and 1B but providing highly optimized occupying structures that occupy substantially all excess unoccupied regions of the workpiece to minimize the amount of machining required to form the two objects; FIG.",
"2 is a flow diagram of an exemplary method of generating a workpiece computer model including a plurality of objects defined in a body of material; FIG.",
"3A is an isometric view of an object to be machined from a workpiece, illustrating structural features for which silhouetting can be useful when generating computer models of occupying structures in accordance with the present invention; FIG.",
"3B is a plan view of the object of FIG.",
"3A showing the extents of the object in the x-y directions; FIG.",
"3C is a silhouette of the object of FIGS.",
"3A and 3B that can be used for generating one or more occupying structures around the object and/or locating the object relative to one or more other objects and/or a temporary support frame; FIG.",
"4 is a screenshot of a window of CAD software showing a graphical representation of a workpiece computer model for creating eight identical objects from a single body of material, showing the workpiece computer model prior to generating an occupying structure to occupy an excess unoccupied region; FIG.",
"5 is a screenshot of the window of FIG.",
"4 illustrating the manual addition of adding a graphical representation of an occupying structure to the workpiece computer model of FIG.",
"4 using an entity extrusion process; FIG.",
"6 is a screenshot of the window of FIG.",
"4 illustrating certain steps of defining a graphical representation of a new channel of the workpiece; FIG.",
"7 is a screenshot of the window of FIG.",
"4 illustrating additional steps of defining the graphical representation of the new channel; FIG.",
"8 is a screenshot of the window of FIG.",
"4 illustrating further steps of defining the graphical representation of the new channel; FIG.",
"9 is a screenshot of the window of FIG.",
"4 illustrating the finished graphical representation of the new channel; FIG.",
"10 is a screenshot of a window of CAD software illustrating creating workpiece computer model using a process of defining a graphical representation of an occupying structure manually using offsets; FIG.",
"11 is a screenshot of the window of FIG.",
"11 showing the graphical representation of the occupying structure defined using offsets; FIG.",
"12 is an isometric view of a graphical representation of a workpiece computer model for creating fourteen objects of three differing types from a single body of material prior to adding any occupying structure; FIG.",
"13 is an isometric view of the graphical representation of FIG.",
"12 after modifying the workpiece to include an occupying structure in one of the excess unoccupied regions; FIG.",
"14 is a high-level diagram illustrating a workpiece-layout system made in accordance with the present invention; and FIG.",
"15 is a high-level diagram illustrating a computing system suitable for use in implementing any one or more parts of a workpiece-layout system of the present disclosure, including the workpiece-layout system of FIG.",
"14 and steps of the method of FIG.",
"2.DETAILED DESCRIPTION In one aspect, the present invention is directed to methods of reducing machining equipment usage during manufacturing of a plurality of discrete objects from a single body of material, or “workpiece.” As described below in detail, in these methods a temporary support frame is provided, for example, to aid in handling, datum referencing, and/or object layout, among other things.",
"Examples of discrete objects that can be manufactured using techniques disclosed herein include, but are not limited to, finished parts for assemblies (such as consumer products, military equipment, commercial equipment, among others), precursors to finished parts (such as precursors that required further processing to create finished assembly parts), finished standalone products, and precursors to finished standalone products, among others.",
"Generally, the only limitations on the nature and character of the discrete objects is that they are manufactureable by one or more subtractive manufacturing processes and are compatible with other steps of processes described below.",
"It is noted that for any given workpiece, the multiple discrete parts may all be identical to one another or they may all be different from one another or some may be identical and others may be different.",
"As used herein and in the appended claims, a “precursor” to a finished part or finished object is a discrete object, i.e., an object liberated from the body of material from which it is made, that requires further processing to become the finished part or finished object.",
"FIGS.",
"1A to 1C illustrate aspects of the present invention that result in savings of machining time, machining equipment wear, and cost of machining a given set of objects.",
"FIG.",
"1A illustrates a first workpiece 100 after machining from the obverse side 100A of the first workpiece to create a first object 104 and a second object 108 from the same body of material.",
"In this example, a result of the machining also forms a temporary support frame 112 that is used at certain steps of the machining process to stabilize the first and second objects.",
"As described in more detail below, to create first workpiece 100, it is first modeled with computer-modeling software using graphical representations of temporary support frame 112 and graphical representations of first and second objects 104 and 108.The graphical representation of temporary support frame 112 is used as a starting point for arranging the objects (here, first and second objects 104 and 108) within the workpiece.",
"This is done by locating graphical representations of the objects, here, first and second objects 104 and 108, within an opening of the graphical representation of temporary support frame 112.It is noted that an opening of the graphical representation of temporary support frame 112 may be centrally located.",
"It is further noted that an opening may be a through-opening of the graphical representation of temporary support frame.",
"Additionally, and alternatively, an opening of the graphical representation of temporary support frame 112 may be a recess.",
"Specifically, and to avoid confusion, a recess may not be an opening and may be a recess that may be located within a graphical representation of temporary support frame 112.A recess may be of any appropriate depth.",
"A person of ordinary skill in the art will readily appreciate after reading this disclosure in its entirety that depending on variables, like the type of first object 104 or second object 108, that any number of recess depths may be desired and easily incorporated into the innovation of the current disclosure.",
"An opening and a recess, or an opening or a recess, and any appropriate number of each may be included in a graphical representation of temporary support frame 112.Again, a person of ordinary skill in the art will readily appreciate the number of different configurations possible.",
"Herein, the term opening may be used interchangeably with recess.",
"Since temporary support frame 112 and first and second objects 104 and 108 are the only structures to be made from workpiece 100, when the workpiece is machined to create these structures, all of the material of the workpiece not part of these structures is machined away, here creating void 116 and void 120 (which are parts of the opening of the temporary support frame.",
"Machining away that much material is time consuming and costly.",
"FIG.",
"1B illustrates a second workpiece 130 for making the same first and second objects 104 and 108.Like first workpiece 100, second workpiece 130 includes frame 112 and first and second objects 104 and 108.However, to reduce the amount of machining needed to create these structures, second workpiece 130 includes a set of four occupying structures 134(1) to 134(4) that occupy what are referred to herein and in the appended claims as “excess unoccupied regions,” which are regions outside the silhouettes (see FIGS.",
"3A-3C and accompanying descriptions for silhouetting features) of first and second objects 104 and 108 and temporary support frame 112 that do not need to be machined away in order to form the first and second objects.",
"In this example, occupying structures 134(1) to 134(4) are defined in computer-modeling software by corresponding graphical representations that are essentially added to the graphical representations of temporary support frame 112 and first and second objects 104 and 108.The graphical representations of occupying structures 134(1) to 134(4) are then considered in the creation of the machine-control instruction set as structures to be machined from second workpiece 130 along with temporary support frame 112 and first and second objects 104 and 108.As can be readily appreciated, not having to machine away material from second workpiece 130 in the regions of occupying structures 134(1) to 134(4) significantly reduced the machining usage needed to create first and second objects 104 and 108.For example, it generally takes a certain amount of time to machine a certain amount of volume from a workpiece and by reducing the volume to be machined you reduce the amount of time it takes to machine an object.",
"After completion of machining operations, occupying structures 134(1) to 134(4) can be recycled, as can be temporary support frame 112.As can be seen in FIG.",
"1B, occupying structures 134(1) to 134(4) are simple geometric shapes that approximate the shapes of the corresponding excess unoccupied regions.",
"In other instances, occupying structures may be complex geometric shapes following the contouring of non-rectilinear parts.",
"As described below in detail, occupying structures 134(1) to 134(4) can be modeled manually by a user or automatically by a suitably capable workpiece-layout system.",
"FIG.",
"1C takes the occupying-structure feature to an extreme with a third workpiece 150 that is also defined to create first and second objects 104 and 108.In FIG.",
"1C, third workpiece 150 is defined to nearly completely minimize the amount of material that needs to be machined away to create first and second objects 104 and 108 by largely outlining the first and second objects with a gap that is based on the machine tool(s) plus an offset, if any, that is(are) used during the machining of the third workpiece, leaving everything beyond that gap outside the first and second objects untouched by the machining.",
"It is noted that in the creation of third workpiece 150, a graphical representation of temporary support frame 112 (FIGS.",
"1A and 1B and shown via dashed lines in FIG.",
"1C) is initially in the model of the third workpiece as it is with first and second workpieces 100 and 130 of FIGS.",
"1A and 1B.",
"However, during the creation of the occupying structure 154 in the computer model of third workpiece 150, the occupying structure is created in such a way that it is effectively an inward extension of temporary support frame 112 to a point that the originally inner periphery 112A of the temporary support frame morphs to surround first and second objects 104 and 108 and be spaced therefrom by the gap described above.",
"In this example, third workpiece 150 of FIG.",
"1C also includes occupying structure 134(1) also present in second workpiece 130 of FIG.",
"1B within an interior region of second object 108.Though not illustrated, in some instantiations excess unoccupied regions and corresponding occupying structures can be located between a pair of objects or among a group of three or more objects, depending on the shape(s) of the objects, their orientations relative to one another, the number of objects, and their locations relative to one another.",
"As with second workpiece 130 of FIG.",
"1B, the computer model for third workpiece 150 of FIG.",
"1C can be created manually or automatically, depending on the functionality of the modeling software used.",
"In addition to the description provided above, and as will be appreciated after reading this disclosure in its entirety, the x, y, and z contours of any object can be defined to minimize the amount of material that needs to be machined away.",
"For example, although only the x and y contours appear to be defined in FIGS.",
"1A-1C, a person of skill in the art after reading this disclosure in its entirety will readily appreciate that the z contours of an object may also be defined to reduce the volume to be machined, which will in-turn reduce the amount of machining time.",
"Examples of bodies of material from which the multiple discrete objects can be made include, but are not limited to, plates, slabs, blooms, billets, boards, blocks, among many other shapes, including curvilinear and multisided shapes, and any combination thereof.",
"As for the material composing the body, the material may be any suitable material, such as metal (solid, sintered, etc.",
"), polymer (solid, foamed, etc.",
"), wood, composite, and multilayer material, among others.",
"Fundamentally, there is no limitation on the composition of the body of material other than it be compatible with the selected subtractive manufacturing process(es).",
"Each machining process used may be any suitable process, such as, but not limited to, rotary-tool milling, electronic discharge machining, ablation, etching, erosion, cutting, and cleaving, among others.",
"Fundamentally, there is no limitation on the type of subtractive manufacturing process(es) used other than each is compatible with composition of the body of material, depending on when a particular subtractive manufacturing process is used in the overall method.",
"If rotary-tool milling is utilized, this milling may be accomplished using any suitable type of milling equipment, such as milling equipment having either a vertically or horizontally oriented spindle shaft(s).",
"Examples of milling equipment include bed mills, turret mills, C-frame mills, floor mills, gantry mills, knee mills, and ram-type mills, among others.",
"In some embodiments, the milling equipment used for removing material may be of the computerized numerical control (CNC) type that is automated and operates by precisely programmed commands that control movement of one or more parts of the equipment to effect the material removal.",
"CNC machines, their operation, programming, and relation to computer aided manufacturing (CAM) tools and computer aided design (CAD) tools are well known and need not be described in detail herein for those skilled in the art to understand the scope of the present invention and how to practice it in any of its widely varying forms.",
"Methods disclosed herein include methods of providing a workpiece computer model of a plurality of objects defined in a body of material.",
"A workpiece computer model may include machine-control instruction sets, for example, numerical control (NC) instructions sets, for controlling machining equipment to machine a plurality of objects from a single workpiece in an efficient manner that seeks to minimize the amount of machining that needs to be performed, thereby reducing the wear on the machine and machine tools, and time needed to complete machining the workpiece.",
"FIG.",
"2 illustrates a method 200, which is an example of such methods.",
"As will be understood from reading this entire disclosure, aspects of some of the methods described herein, including method 200, may be performed by a workpiece-layout system that runs computer software, such as CAD software and software for generating machine-control instructions sets from CAD models and/or other types of computer models of objects to be fabricated using the machine-control instructions provided by these methods.",
"Such a workpiece-layout system can comprise any suitable computing system, including standalone computing systems and networked computing systems that can run conventional CAD software, CAM software, and the like.",
"As alluded to above, the term “machine-control instructions” and like terms are used herein and in the appended claims to denote any instruction set needed to control any one or more types of machining equipment to perform the necessary machining and, as appropriate, any additional machine-control instructions for performing non-machining operations, such as controlling any robotic manipulator(s) and/or other equipment that automatically moves a workpiece before, during, or after machining operations.",
"Referring now to FIG.",
"2, exemplary method 200 includes a step 205 at which the workpiece-layout system may receive at the workpiece-layout system, a graphical representation of a temporary support frame that is to be machined from the body of material (or, again, “workpiece”), along with the discrete objects that are the subjects of the machining.",
"It is emphasized that step 205 is exemplary and that exemplary method 200 may proceed without receiving a graphical representation of a temporary support frame.",
"In an embodiment, rather than receive a graphical representation of a temporary support frame, the graphical representation of the temporary support frame may be displayed.",
"Continuing with this example, it is noted that this method may be automated entirely or certain steps may be automated and that the method may or may not include interaction by a user.",
"After reading this disclosure in its entirety, a person of ordinary skill in the art will readily appreciate the circumstances where an automated system may be desirable.",
"The temporary support frame in this example may be used as part of an object-stabilizing scheme for holding the objects and their partially machined precursors in place.",
"The temporary support frame may include an opening, defined by its inner periphery, that, after machining the workpiece from its first and second sides to create the discrete objects and temporary support frame, contains the discrete objects.",
"In some embodiments in which the temporary support frame is rectangular in shape, it generally resembles a picture frame, with an opening being the region defined by the inner perimeter of the frame and its thickness.",
"Examples of temporary support frames are depicted in various figures of the attached drawings.",
"In some embodiments, the workpiece-layout system may include a temporary-support-frame library containing graphical representations for multiple temporary support frames of differing sizes and/or thicknesses, wherein the multiple temporary support frames are configured for specific bodies of materials.",
"For example, a graphical representation of one temporary support frame may correspond to a stock piece of stainless steel that is 24.02″×18.02″×1″.",
"In this case, the temporary support frame may be 24″×18″×0.75″ to account for, for example, aspects of the two-part machining of the first and second sides of the workpiece.",
"As another example, a graphical representation for another temporary support frame may correspond to a stock piece of aluminum that is 36.02″×24.02″×3″, and this temporary support frame may be 36″×24″×2.75″.",
"These examples are merely illustrative; fundamentally there is no limitation on the differing graphical representations of temporary support frames that can be provided in a temporary-support-frame library of the present disclosure.",
"If the workpiece-layout system includes a temporary-support-frame library containing two or more graphical representations of differing temporary support frames, the workpiece-layout system may receive a selection of that graphical representation from the temporary-support-frame library (not shown).",
"This selection may be accomplished in any one or more of a variety of ways, such as by user selection via a dialog box that displays either the multiple graphical representations of the differing temporary support frames or corresponding descriptors or filenames and allowing a user to select the desired one, allowing the user to drag and drop the desired graphical representation, or allowing the user to select the desired body of material and automatically selecting the corresponding graphical representation of the pertinent temporary support frame for the selected body of material, among others.",
"In the case of the last-mentioned option, such selection of the body of material can also be enabled in any one or more of a variety of ways, including via a dialog box that may displays either the multiple graphical representations of the differing available bodies of material or corresponding descriptors or filenames and allowing a user to select the desired one, among others.",
"In embodiments of the workpiece-layout system not having an interactive temporary support frame library, the user may retrieve the graphical representation of the temporary support frame in any suitable manner, such as by receiving an identification of a computer-model file in an onscreen dialog box, dragging and dropping the graphical representation from one onscreen window to another onscreen window, copying and pasting the graphical representation from one onscreen window to another onscreen window, and any combination of these ways.",
"At optional step 210, a graphical representation of a temporary support frame may be displayed.",
"In an embodiment, all each of the process described above may completed automatically or automatedly.",
"For example, a workpiece-layout system may receive a graphical representation of a temporary support frame automatedly.",
"Continuing with this example, a workpiece-layout system may select a temporary support frame from a temporary support frame library automatically as a function of a plurality of objects.",
"Still with reference to the continuing example, a plurality of objects may be interrogated for attributes.",
"Attributes may include geometric data and manufacturing data such as the tolerances, material used, finishes and other common manufacturing characteristics.",
"Those of ordinary skill in the art, after reading this disclosure in its entirety will readily appreciate the various interrogatable attributes.",
"Continuing with the same exemplary embodiment, and as a function of attributes of a plurality of objects a workpiece-layout system may automatically select a graphical representation of a temporary support frame, which may be automatically or automatedly received by the workpiece-layout system.",
"At step 215, the workpiece-layout system receives a selection of graphical representations of the plurality of objects to be machined from the workpiece.",
"The workpiece-layout system may receive the selection in any of a variety of ways, including ways that are the same as or similar to ways known in conventional CAD software, such as SOLIDWORKS® CAD software, available from Dassault Systèmes Americas, Waltham, Mass., among others.",
"Examples of ways of receiving a selection of graphical representations of a plurality of objects to be machined include, but are not limited to, receiving an identification of one or more computer-model files in an onscreen dialog box, dragging and dropping one or more graphical representations from one onscreen window to another onscreen window that contains or will contain the representation of the temporary support frame, copying and pasting one or more graphical representations from one onscreen window to another onscreen window that contains or will contain the representation of the temporary support frame, and any combination of these ways.",
"In some embodiments, the selected graphical representations of the objects to be machined may be displayed on the graphical display along with the graphical representation of the temporary support frame.",
"At step 220, the workpiece-layout system locates the graphical representations of the plurality of objects in an opening of the graphical representation of the temporary support frame so that they are spaced from one another and from adjacent portions of the temporary support frame by one or more minimum distances that permits machining away material from in between immediately adjacent ones of the objects themselves and between various ones of the objects and the temporary support frame.",
"Generally, the locating of the graphical representations that occurs at step 220 typically results in the clustering of the graphical representations of the objects within the opening of the graphical representation of the temporary support frame into one or more clusters that leave one or more unoccupied regions.",
"Depending on the size and/or number of graphical representations of the objects, the size of the unoccupied region(s) can be to varying extents, including large extents, greater than the minimum regions that would need to be machined away to define and separate the objects during machining.",
"Consequently, the machining away of the material in such excess unoccupied region(s) that would occur in the normal course, i.e., without intervention to minimize such machining, can significantly increase the time needed to machine the objects and temporary support frame from the body of material, as well as increase wear on the machining tools.",
"In addition, depending on the sizes and/or shapes of the graphical representations of the objects, one or more excess unoccupied regions can occur between or among a set of graphical representations of objects.",
"As a simple example, of the most efficient locations of a graphical representations of a U-shaped object and a bar-shaped object is such that the bar-shaped graphical representation extends along the open end of the U-shaped graphical representation, there can be a significantly sized excess unoccupied region among the legs of the U-shape and the bar.",
"To save time, money, and wear on machining tools, eliminating or significantly reducing machining in these excess unoccupied regions is needed.",
"In some cases today, the machining of excess unoccupied regions can be over 50% of the total machine time.",
"The locating of the graphical representations of the objects at step 220 may be performed in any one or more of a variety of manners.",
"For example, when the graphical representations of the objects may be received along with the graphical representation of the temporary support frame and the workpiece-layout system is so configured, the locating may be in response to a user's onscreen manipulation of those graphical representations, such as by dragging and dropping, snapping the representations to grid or other points, and keying in coordinates for reference points, among others or locating may occur automatically or automatedly.",
"In another example, the workpiece-layout system may include a set of software instructions designed and configured to automatically perform the locating at step 220.For instance, and as described in more detail below relative to a detailed example, the SOLIDWORKS® CAD software mentioned above has a nesting feature that automatically nests, or locates, a plurality of graphical representations relative to one another in a manner that optimizes clustering of the objects to varying extents, depending on the shapes of the graphical representations and the nesting options selected.",
"At step 225, the workpiece-layout system receives an identification of one or more excess unoccupied regions within the opening of the graphical representation of the temporary support frame.",
"The workpiece-layout system's receipt of the identification of each excess unoccupied region at step 225 can be effected in any of a variety of ways.",
"For example, the receipt of the identification can occur via a user identifying each excess unoccupied region in any of a variety of ways.",
"For example, a user may identify an excess unoccupied region by adding a graphical representation of an occupying structure to that excess unoccupied region.",
"As described below in more detail, such an occupying structure is generally treated like an object to be formed from the multi-object workpiece in that it will not be machined away, but rather it will be formed from the workpiece during the machining process that forms the objects that are the desired end-products of the machining.",
"As those skilled in the art will readily appreciate, by replacing an excess unoccupied region of a workpiece with an occupying structure and essentially treating the occupying structure like an end-product object, machining time and effort can be reduced because the workpiece material in the excess unoccupied region that would in the normal course be machined away based on a conventional CAM model of the objects and temporary support frame no longer will be machined away by virtue of the occupying structure.",
"As another example of receiving an identification of one or more excess unoccupied regions at step 225, in, for example, a screen view looking in a direction perpendicular to the plane of the graphical representation of the temporary support frame, the user may “click” at a location within an excess unoccupied region to identify it.",
"As yet another example, the user may make a selection, such as in a pop-up window or other user-control interface, that instructs the workpiece-layout system to identify each excess unoccupied region using, for example, automated excess unoccupied region identification algorithms.",
"Such automated excess unoccupied region identification algorithms may be designed and configured to account for certain variables, such as the size(s) of the machining tool(s) that will be used during the machining of the workpiece to create the individual objects and temporary support frame.",
"In some embodiments, the automated excess unoccupied region identification algorithms may be programmed, for example, by user selection or other identification, of a minimum size for an excess unoccupied region below which the workpiece layout system ignores an excess unoccupied region.",
"For example, if a particular excess unoccupied region has any dimension less than the diameter of the milling tool used to define the objects and temporary support frame, then the workpiece layout system will ignore it and let it be treated as a region to be machined away during machining.",
"At step 230, the workpiece-layout system generates a graphical representation of an occupying structure occupying a corresponding one of the excess unoccupied regions identified in connection with step 225.Depending on the mode of operation, the workpiece-layout system can generate the graphical representation of each occupying structure in any one or more of a number of manners.",
"For example, in a manual mode, a user can create the graphical representation of the occupying structure using any suitable entity-creation and/or manipulation function(s) of the computer modeling, for example, CAD, software being used to view and manipulate the graphical representations of the objects and temporary support frame.",
"Those skilled in the art will readily appreciate the variety of entity creating and/or manipulating functions that a user can use to create a graphical representation for each occupying structure.",
"An example of creating a graphical representation of an occupying structure utilizing specific entity creation and manipulation functions available in SOLIDWORKS® CAD software is presented below.",
"In some embodiments, the workpiece-layout system includes features and functionality designed and configured specifically for creating occupying structures for multi-object workpieces.",
"Examples of such features and functionality include dialog boxes that allow a user to specify minimum offset(s) between graphical representations of occupying structures and graphical representations of objects to allow for machining, dialog boxes that allow a user to specify automatically created mechanical interlock structures, and a feature that allows a user to select an excess unoccupied region and specify any required variables that allow the workpiece layout system to automatically generate the occupying structure.",
"The minimum offset(s) between graphical representations of occupying structures and graphical representations of objects to allow for machining may be determined based on the minimum relevant dimension of the machining tool(s), such as diameter(s) of milling bit(s), that will be used for machining the objects.",
"For example, when the machining equipment includes an end mill, the offset may be set equal to the diameter of the end mill's bit plus an additional amount for refining operations.",
"In some embodiments, the workpiece-layout system may include occupying-structure-defining algorithms for automatically determining the extents of each occupying structure based on any variable(s) established by a user, such as the machining tool information mentioned above.",
"In some cases, an occupying structure will result in a modification to the temporary support frame such that the occupying structure is continuous with the temporary support frame.",
"An example of a case in which an occupying structure is part of the temporary support frame is described below in a detailed example.",
"In other cases, an occupying structure will effectively be an island structure, surrounded by one or more of the objects being formed from the workpiece.",
"In some embodiments and as alluded to above, an island-type occupying structure may be provided with interlock structures.",
"Depending on the configuration of an object to be formed from the multi-object workpiece, certain additional processing may be needed to enable the workpiece-layout system to optimize the shape of each corresponding occupying structure(s) to minimize the amount of machining required.",
"FIGS.",
"3A to 3C illustrate a silhouetting process that can be used to optimize the shape of each occupying structure adjacent an object having structural features that complicate the process of determining suitable occupying structure(s).",
"In the example of FIGS.",
"3A to 3C, the object 300 (FIGS.",
"3A and 3B) has upper-facing (relative to FIG.",
"3A) surfaces 304(1) to 304(3) that are significantly offset from upper-facing surface 304(4) and has a lower-facing surface 308(1) that is significantly offset from lower-facing surfaces 308(2) and 308(3).",
"When object 300 is machined from a plate-type body of material (not shown) in which the thickness of the plate-type body is parallel to the thickness, T, of the object, automated occupying-structure-defining algorithms would need to account for these vertical (relative to FIG.",
"3A) offsets.",
"This is so because the algorithms cannot simply use either uppermost surface 304(4) or lowermost surfaces 308(2) and 308(3), since, as those skilled in the art will appreciate, the result would be one or more occupying structures that overlap or underlying one or more portions of object 300.For the sake of convenience and for consistency with usual nomenclature, in the forgoing example of machining of a plate-type body of material, thickness T of object 300 and the thickness of the body are parallel to the z-axis of the machining equipment.",
"To account for issues that can arise from the fact that the objects to be fabricated are three dimensional and can have offsets along the z-axis of the machining equipment, silhouetting can be used to ensure that each corresponding occupying structure for a given object is properly defined in the graphical model so that the machine-control instructions that the workpiece-layout system ultimately generates are efficient and create the desired occupying structure(s).",
"When an object, such as object 300, is machined using a machine that plunges along the z-axis (e.g., along the direction of thickness of the workpiece), it is desirable to create occupying structures by silhouetting the object as viewed along the z-axis, i.e., plunge axis, to effectively outline the entire x-y region from which the object will be machined.",
"This silhouetting is illustrated in FIGS.",
"3B and 3C for object 300, wherein in FIG.",
"3B the object is being viewed along the z-axis (plunge axis) and in FIG.",
"3C the silhouette 312 of the object along the z-axis (plunge axis) is presented.",
"Once silhouette 312 has been defined, a lateral offset, O, in an x-y plane for any occupying structure, here occupying structure 316, can be set, for example, in the manner indicated above to account for one or more of the machining tools that will be used to machine the workpiece.",
"Referring to FIG.",
"2, at step 235, the workpiece-layout system may generate a workpiece computer model including plurality of objects defined in a body of material.",
"Additionally, a machine-control instruction set for machining the workpiece to create the multiple end-product objects desired to be created from the workpiece may be generated and may also be associated with a workpiece computer model.",
"The generated machine-control instruction set contains the instructions for controlling the one or more pieces of numerical control (NC) machining equipment, such as one or more NC milling machines, to perform the machining on the workpiece to create the objects and, as a byproduct of such machining, to create the occupying structure(s) and the temporary support frame, including any version thereof modified by one or more occupying structures as noted above.",
"The generating of the machine-control instruction set accounts for, among other things, 1) the graphical representations of i) the objects, ii) the occupying structure(s) generated at step 230, and iii) the temporary support frame (including any interlock structure(s) and any modifications made thereto to define an occupying structure generated at step 230, 2) the machining equipment, including any particular tool(s), 3) the actual dimensions of the body of material forming the workpiece, 4) any datum(s) provided to properly locate the workpiece relative to the machining equipment, and 5) separate machining steps for forming valleys from an obverse side of the workpiece and for removing interconnecting portions from the reverse side that connect the objects to one another and/or to the temporary support frame and/or the occupying structure(s).",
"As a simple example in which one single-ended CNC end mill is used for all of the milling on the obverse and reverse sides of the workpiece, the machine-control instruction set includes instructions for directing the cutting tool of the end mill along a first path on the obverse side of the workpiece that forms 1) the valleys that define portions of the openings among the multiple objects that define the objects, inner portion(s) of the temporary support frame, and one or more portions of each occupying structure, 2) the interlock features on the inner periphery of the temporary support frame, including any occupying structure, if any, that modified the starting temporary support frame and on any island-type occupying structure, if any, and 3) any cavity or other surface feature, if any, on any one or more of the objects.",
"Such a machine-control instruction set may also include instructions for directing the cutting tool (or a different cutting tool) of the end mill along a second path on the reverse side of the workpiece in which any surfaces and/or surface features on the objects, if any, are machined.",
"As those skilled in the art will readily appreciate, the machine-control instruction set may be generated as a function of 1) the specific machining tool(s) (e.g., milling bit(s)) that will be used during the machining of the workpiece to create the multiple objects as well as 2) the size of the body of material that becomes the workpiece.",
"It is noted that the specific machining tool(s) have been at least partially accounted for in the process of defining the offsets for the objects and any occupying structures.",
"The size of the workpiece is used to define where the machining equipment will actually be removing material and engaging the workpiece.",
"Other inputs, such as type of material (e.g., to control machining speed), may also be used for generating the machine-control instruction set as needed or desired.",
"The generation of the machine-control instruction set may be performed automatically, such as by intelligent CAM software (e.g., CAMWORKS® software available from Geometric Technologies, Inc., Scottsdale, Ariz.), performed semi-automatically with the assistance of a user (such as when the CAM software does not have intelligence on how to handle certain physical features), or under the complete control of a user.",
"With the foregoing principles and features in mind, FIGS.",
"4-9 illustrate a simple example of creating a workpiece computer model 400 (illustrated in the figures by graphical representations generated by computer modeling software, such as CAD software) of a workpiece for providing eight identical objects (illustrated in the figures by graphical representations 404(1) to 404(8)) located in an opening of a suitable temporary support frame (illustrated in the figures by graphical representations 408A and 408, respectively).",
"As seen in FIG.",
"4, the arrangement of object graphical representations 404(1) to 404(8) within opening 408A results in a relatively large unoccupied region 412 (highlighted by box 416) that would require a relatively large amount of machining to create the actual workpiece.",
"Consequently, this example is directed to generating a graphical representation 900 (FIG.",
"9) of an occupying structure that, in this example, can be characterized as an extension of a portion of graphical representation 408 of the temporary support frame.",
"Referring to FIG.",
"5, a first step of generating graphical representation 900 (FIG.",
"9) of occupying structure within the modeling software may be to use a suitable sketch function of the modeling software to make a sketch 500 of a rectangle on the back face (relative to FIG.",
"5) of graphical representation 408 of temporary support frame that connects the three portions of the graphical representation of temporary support frame bordering unoccupied region 412.In the present example, the offset between objects 404(4) and 404(8) and occupying structure 900 (FIG.",
"9) is 0.28″ to accommodate ¼-inch milling bit plus a machining offset.",
"Consequently, the edge 500(1) of rectangle sketch 500 is located 0.28″ away from the edges of objects 404(4) and 404(8) closest to the rectangle sketch.",
"Next, the rectangle sketch 500 is extruded using a suitable function of the modeling software to the upper face 412A of temporary support frame 412 to define a solid rectangular prism entity 600 (FIG.",
"6).",
"Such sketching and extrusion operations are well known in the art as are other software modeling functions described below.",
"Next, as illustrated in FIG.",
"6, edge 600(1) of rectangular prism entity 600 is converted to a line 604 on upper face 412A to allow for creating a new sketch 608 for defining features of graphical representations 904 and 908 (FIG.",
"9) of, respectively, a shelf and a channel.",
"After creating line 604, an offset line 612 on upper face 412A is created at an offset of 0.5″, which is the width of the shelf containing the channel.",
"This offset can be created using any suitable function(s) available in the modeling software, such as an offset line function.",
"After creating line 612, lines 616 and 620 connecting lines 604 and 612 can be created to form a first rectangle 624.Next, a second rectangle 628 can be formed at an offset of 0.1″, for example, using an offset function available in the modeling software.",
"Next, as illustrated in FIG.",
"7, a rectangular tubular extrusion 700 can be extruded to the bottom face of graphical representation 412 of the temporary support frame using a suitable extrusion function of the modeling software, and the z-axis location of upper end 700A of the tubular extrusion can be set, for example, using a suitable locating function (such as the illustrated “Up To Surface” function) of the modeling software and referencing a surface at the same z-axis location, such as surface 704.The result of locating upper end 700A of tubular extrusion 700 at the same location of surface 704 is illustrated in FIGS.",
"8 and 9.Next, graphical representation 904 (FIG.",
"9) of the channel can be formed by performing a similar upper end locating operation on rectangular extrusion 800 (FIG.",
"8) and selecting surface 804 as the reference surface, and then specifying that all vertical corners of the depression 908 (FIG.",
"9) created by this step have a radius of 0.15″.",
"The result of all of these operations are illustrated in FIG.",
"9, in which it is seen that the graphical representation 900 of the occupying structure is now configured like the graphical representation 412 of the rest of the temporary support frame relative to the channels and excess area 412 is now part of the frame.",
"FIGS.",
"10 and 11 illustrate initial steps in defining a graphical representation (not shown) of an occupying structure for occupying an excess unoccupied region 1000 (FIG.",
"10) within a workpiece computer model 1100 (FIG.",
"11) that includes graphical representations 1104(1) to 1104(5), 1108(1) to 1108(3), 1112(1) to 1112(3), 1116(1) to 1116(3), 1120, and 1124 (FIG.",
"11), respectively, of 1) five differing types of objects to be made from the modeled workpiece and 2) a temporary support frame.",
"As seen in FIG.",
"10, a line-offset function available in the modeling software allows a user to draw lines, such as lines 1004(1) to 1004(9), that are offset by a set distance, here 0.28″, from corresponding edges 1008(1) to 1008(9) of graphical representations 1108(2) and 1104(2) to 1104(4).",
"As seen in FIG.",
"11, lines 1004(1) to 1004(9) and similar lines 1128(1) to 1128(9) can then be joined, along with similar lines (unlabeled), to define a continuous line 1128 that can then be used in a process to create a graphical representation (not shown, but would occupy hatched region 1132) of an occupying structure that occupies excess unoccupied region 1000.The process used to create the graphical representation (not shown) of an occupying structure may be an extrusion process the same as or similar to the extrusion process described above in connection with FIGS.",
"4-9.FIGS.",
"12 and 13 illustrate, respectively, a workpiece computer model 1200 and 1200′ before and after adding a graphical representation 1300 (FIG.",
"13) of an occupying structure to the primary unoccupied region 1204 (FIG.",
"12) of workpiece computer model 1200, which in this case is between the graphical representation 1208 of the temporary support frame and the cluster 1212 of graphical representations 1216, 1220(1) to 1220(4), and 1224(1) to 1224(9) of three differing types of objects to be made from the workpiece represented by computer model 1200′.",
"In this example, graphical representation 1300 (FIG.",
"13) of the occupying structure is essentially provided as an extension to the graphical representation 1208 of the temporary support frame.",
"It is seen in FIG.",
"13 that the graphical representations 1228(1) to 1228(4) of FIG.",
"12 of channels formed in shelves of the graphical representation 1208 of the temporary support frame are effectively replaced in computer model 1200′ (FIG.",
"13) with a graphical representation 1304 of a single continuous channel formed in a single continuous shelf.",
"Graphical representation 1300 of the occupying structure may have been created automatically or manually, for example, using any of the suitable techniques described above.",
"In addition, the formation of cluster 1212 of graphical representations 1216, 1220(1) to 1220(4), and 1224(1) to 1224(9) of three differing types of objects may have been created automatically or manually, for example, using any of the suitable techniques described above.",
"FIG.",
"14 illustrates an exemplary workpiece-layout system 1400 that can perform methods of the present disclosure, including method 200 of FIG.",
"2, to create a workpiece computer model 1404 for automatically machining a plurality of objects 1408 from a single workpiece 1412 using one or more pieces of machining equipment 1416.In this example, workpiece-layout system 1400 includes computer-modeling software 1420, such as CAD software, that allows a user to create, build, modify, etc., computer models of various structures via graphical representations displayed to use on one or more graphical displays and manipulated by the user using one or more computer input devices.",
"An example of such software that can be part of computer-modeling software 1420 is SOLIDWORKS® CAD software, but any of many others, can be used to provide three-dimensional (3D) modeling functionality.",
"In some embodiments, a user can use computer-modeling software 1420, for example, in a manner described above, to create workpiece computer model 1404 “manually,” i.e., using conventional drawing commands native to commercial off-the-shelf (COTS) computer modeling software.",
"In some embodiments, computer-modeling software 1420 can include COTS CAD software that is augmented with custom software, such as via one or more plugin software modules, that automates and/or otherwise assists the user in efficiently building a workpiece computer model, such as workpiece computer model 1404.In some embodiments, computer-modeling software 1420 can be entirely custom software built for the specific task of building workpiece computer models, such as workpiece computer model 1404.Generally, the form of computer-modeling software 1420 can be any suitable form that provides the requisite functionality.",
"Following are examples of customization that can be provided to computer-modeling software 1420, for example, via one or more plugin modules and/or direct integration, and to workpiece-layout system 1400 more generally, to enhance the user experience and/or increase the speed and ease of creating workpiece computer models, such as workpiece computer model 1404.In some embodiments, for example, where a fabricator frequently makes an object from a variety of stock bodies of material (e.g., sheets or slabs of stainless steel, aluminum, etc.",
"), workpiece-layout system 1400 may include a stock-materials datastore 1424 and a corresponding stock-frames datastore 1428 that contain, respectively, stock-material definitions 1424(1) to 1424(N) (e.g., sizes, material type, etc.)",
"of bodies of material typically used and preconfigured frame computer models 1428(1) to 1428(N) of temporary support frames suitable for use with corresponding respective stock bodies of material.",
"In this connection, computer-modeling software 1420 may include a user interface (UI) designed and configured to allow a user to select a desired one of stock-material definitions 1424(1) to 1424(N) and/or a desired one of preconfigured frame computer models 1428(1) to 1428(N) for use in creating a particular workpiece computer model.",
"When stock-materials datastore 1424 and/or stock-frames datastore 1428 are not provided, a user can import them into workpiece-layout system 1400 as needed or create them as needed, for example, using computer-modeling software 1400.Relatedly, workpiece-layout system 1400 may also include an object-model datastore 1432 that stores computer models 1432(1) to 1432(N) of objects to be made from workpieces modeled using the workpiece-layout system.",
"In the absence of object-model datastore 1432, computer models of objects to be made can be stored elsewhere and imported into workpiece-layout system 1400 when needed and/or created using computer-modeling software 1420.As mentioned above in connection with method 200, computer-modeling software made in accordance with the present invention, such as computer-modeling software of FIG.",
"14, may include clustering algorithms 1436 designed and configure to automatically cluster the object models within a selected temporary support frame in a manner that minimizes the amount of machining that needs to be performed, for example, by maximizing consolidation of the excess unoccupied regions into as few relatively large excess unoccupied regions as possible, to create the objects from the workpiece modeled using workpiece-layout system 1400.Computer-modeling software 1420 may also include any suitable UI(s) 1440 that allow a user to implement clustering algorithms 1436.As also mentioned above, computer-modeling software made in accordance with the present invention, such as computer-modeling software of FIG.",
"14, may include excess unoccupied region identification algorithms 1444 for automatically identifying any excess unoccupied regions within a workpiece computer model that may each be suitable for receiving a computer model of a corresponding occupying structure that does not get machined away during machining of the modeled workpiece.",
"Correspondingly, computer-modeling software 1420 may include one or more UIs 1448 that allow a user to input any information needed to allow excess unoccupied region identification algorithms 1444 to function properly.",
"Exemplary details of functionalities and inputs that can be involved with excess unoccupied region identification algorithms 1444 are described above in connection with step 225 of method 200 of FIG.",
"2.As also described above, computer-modeling software of the present invention, such as computer-modeling software 1420 may also include occupying-structure-defining algorithms 1452 for automatically defining computer models for the occupying structures that do not get machined away during machining of the modeled workpiece.",
"Computer-modeling software 1420 may also include one or more UIs 1456 that allow a user to input any information needed to allow occupying-structure-defining algorithms 1452 to function properly.",
"Exemplary details of functionalities and inputs that can be involved with occupying-structure-defining algorithms 1452 are described above in connection with step 230 of method 200 of FIG.",
"2 Algorithms 1436, 1444, and 1452 and any corresponding functionalities and UIs, such as UIs 1440, 1448, and 1456, may be implemented, for example, via one or more plugin modules or implemented within a core of the computer-modeling software itself.",
"As those skilled in the art will readily appreciate, these and other customizations could be made to an extent that the only inputs needed are an indication of the computer models of the objects to be machined and an instruction to create the workpiece-computer model, and perhaps an indication of the material from which the objects are to be made if workpiece-layout system 1400 is being used to create workpiece computer models for differing materials.",
"Workpiece layout system 1400 may further include CAM software 1460 designed and configured to generate, for each workpiece computer model 1404, a machine-control instruction set 1464 that controls machining equipment 1416 during the machining of workpiece 1412 to create plurality of objects 1408 therefrom, as well as to create the temporary support frame 1468 and any occupying structure(s) 1472 that are generally remnants of the machining.",
"CAM software 1460 may include COTS CAM software, such as CAMWORKS®, CAM software, or any other suitable software that can utilize workpiece computer model 1404 to generate machine-control instruction set 1464, for example, in the manner described above in connection with step 235 of method 200 of FIG.",
"2.It is to be noted that any one or more of the aspects and embodiments described herein may be conveniently implemented using one or more machines (e.g., one or more computing devices that are utilized as a user computing device for an electronic document, one or more server devices, such as a document server, etc.)",
"programmed according to the teachings of the present specification, as will be apparent to those of ordinary skill in the computer art.",
"Appropriate software coding can readily be prepared by skilled programmers based on the teachings of the present disclosure, as will be apparent to those of ordinary skill in the software art.",
"Aspects and implementations discussed above employing software and/or software modules may also include appropriate hardware for assisting in the implementation of the machine executable instructions of the software and/or software module.",
"Such software may be a computer program product that employs a machine-readable storage medium.",
"A machine-readable storage medium may be any medium that is capable of storing and/or encoding a sequence of instructions for execution by a machine (e.g., a computing device) and that causes the machine to perform any one of the methodologies and/or embodiments described herein.",
"Examples of a machine-readable storage medium include, but are not limited to, a magnetic disk, an optical disc (e.g., CD, CD-R, DVD, DVD-R, etc.",
"), a magneto-optical disk, a read-only memory “ROM” device, a random access memory “RAM” device, a magnetic card, an optical card, a solid-state memory device, an EPROM, an EEPROM, and any combinations thereof.",
"A machine-readable medium, as used herein, is intended to include a single medium as well as a collection of physically separate media, such as, for example, a collection of compact discs or one or more hard disk drives in combination with a computer memory.",
"As used herein, a machine-readable storage medium does not include transitory forms of signal transmission.",
"Such software may also include information (e.g., data) carried as a data signal on a data carrier, such as a carrier wave.",
"For example, machine-executable information may be included as a data-carrying signal embodied in a data carrier in which the signal encodes a sequence of instruction, or portion thereof, for execution by a machine (e.g., a computing device) and any related information (e.g., data structures and data) that causes the machine to perform any one of the methodologies and/or embodiments described herein.",
"Examples of a computing device include, but are not limited to, an electronic book reading device, a computer workstation, a terminal computer, a server computer, a handheld device (e.g., a tablet computer, a smartphone, etc.",
"), a web appliance, a network router, a network switch, a network bridge, any machine capable of executing a sequence of instructions that specify an action to be taken by that machine, and any combinations thereof.",
"In one example, a computing device may include and/or be included in a kiosk.",
"FIG.",
"15 shows a diagrammatic representation of one embodiment of a computing device in the exemplary form of a computer system 1500 within which a set of instructions for causing a control system, such as the workpiece-layout system 1400 of FIG.",
"14, to perform any one or more of the aspects and/or methodologies of the present disclosure may be executed.",
"It is also contemplated that multiple computing devices may be utilized to implement a specially configured set of instructions for causing one or more of the devices to perform any one or more of the aspects and/or methodologies of the present disclosure; for example, workpiece-layout system 1400, computer-modeling software 1420, CAM software 1460, and/or any user interfaces such as UIs 1440, 1448, and 1456, may be executed using a single device or any number of devices.",
"Computer system 1500 includes a processor 1504 and a memory 1508 that communicate with each other, and with other components, via a bus 1512.Bus 1512 may include any of several types of bus structures including, but not limited to, a memory bus, a memory controller, a peripheral bus, a local bus, and any combinations thereof, using any of a variety of bus architectures.",
"Memory 1508 may include various components (e.g., machine-readable media) including, but not limited to, a random access memory component, a read only component, and any combinations thereof.",
"In one example, a basic input/output system 1516 (BIOS), including basic routines that help to transfer information between elements within computer system 1500, such as during start-up, may be stored in memory 1508.Memory 1508 may also include (e.g., stored on one or more machine-readable media) instructions (e.g., software) 1520 embodying any one or more of the aspects and/or methodologies of the present disclosure, such as one or more aspects of FIGS.",
"1-5.In another example, memory 1508 may further include any number of program modules including, but not limited to, an operating system, one or more application programs, other program modules, program data, and any combinations thereof.",
"Computer system 1500 may also include a storage device 1524, which may be used to implement datastores 1424, 1428, and 1432, among other aspects of the present disclosure.",
"Examples of a storage device (e.g., storage device 1524) include, but are not limited to, a hard disk drive, a magnetic disk drive, an optical disc drive in combination with an optical medium, a solid-state memory device, and any combinations thereof.",
"Storage device 1524 may be connected to bus 1512 by an appropriate interface (not shown).",
"Example interfaces include, but are not limited to, SCSI, advanced technology attachment (ATA), serial ATA, universal serial bus (USB), IEEE 1194 (FIREWIRE), and any combinations thereof.",
"In one example, storage device 1524 (or one or more components thereof) may be removably interfaced with computer system 1500 (e.g., via an external port connector, not shown).",
"Particularly, storage device 1524 and an associated machine-readable medium 1528 may provide nonvolatile and/or volatile storage of machine-readable instructions, data structures, program modules, and/or other data for computer system 1500, which in some implementations and embodiments may transform at least part of the computer system into an electronic pricing machine, as described hereinabove.",
"In one example, software 1520 may reside, completely or partially, within machine-readable medium 1528.In another example, software 1520 may reside, completely or partially, within processor 1504.Computer system 1500 may also include an input device 1532.In one example, a user of computer system 1500 may enter commands and/or other information into computer system 1500 via input device 1532.Examples of an input device 1532 include, but are not limited to, an alpha-numeric input device (e.g., a keyboard), a pointing device, a joystick, a gamepad, an audio input device (e.g., a microphone, a voice response system, etc.",
"), a cursor control device (e.g., a mouse), a touchpad, an optical scanner, a video capture device (e.g., a still camera, a video camera), a touchscreen, and any combinations thereof, among others.",
"Input device 1532 may be interfaced to bus 1512 via any of a variety of interfaces (not shown) including, but not limited to, a serial interface, a parallel interface, a game port, a USB interface, a FIREWIRE interface, a direct interface to bus 1512, and any combinations thereof.",
"Input device 1532 may include a touch screen interface that may be a part of or separate from display 1536, discussed further below.",
"Input device 1532 may be utilized as a user selection device for selecting one or more graphical representations in a graphical interface as described above.",
"A user may also input commands and/or other information to computer system 1500 via storage device 1524 (e.g., a removable disk drive, a flash drive, etc.)",
"and/or network interface device 1540.For example, a user may provide inputs to workpiece-layout system 1400 simply by connecting an appropriately configured device to an appropriate network.",
"A network interface device, such as network interface device 1540, may be utilized for connecting computer system 1500 to one or more of a variety of networks, such as network 1544, and one or more remote devices 1548 connected thereto.",
"Examples of a network interface device include, but are not limited to, a network interface card (e.g., a mobile network interface card, a LAN card), a modem, and any combination thereof.",
"Examples of a network include, but are not limited to, a wide area network (e.g., the Internet, an enterprise network), a local area network (e.g., a network associated with an office, a building, a campus or other relatively small geographic space), a telephone network, a data network associated with a telephone/voice provider (e.g., a mobile communications provider data and/or voice network), a direct connection between two computing devices, and any combinations thereof.",
"A network, such as network 1544, may employ a wired and/or a wireless mode of communication.",
"In general, any network topology may be used.",
"Information (e.g., data, software 1520, etc.)",
"may be communicated to and/or from computer system 1500 via network interface device 1540.Computer system 1500 may further include a video display adapter 1552 for communicating a displayable image, such as one or more prices and/or lists of suppliers, to a display device, such as display device 1536.Examples of a display device include, but are not limited to, a liquid crystal display (LCD), a cathode ray tube (CRT), a plasma display, a light emitting diode (LED) display, and any combinations thereof.",
"Display adapter 1552 and display device 1536 may be utilized in combination with processor 1504 to provide graphical representations of aspects of the present disclosure.",
"In addition to a display device, computer system 1500 may include one or more other peripheral output devices including, but not limited to, an audio speaker, a printer, and any combinations thereof.",
"Such peripheral output devices may be connected to bus 1512 via a peripheral interface 1556.Examples of a peripheral interface include, but are not limited to, a serial port, a USB connection, a FIREWIRE connection, a parallel connection, and any combinations thereof.",
"The foregoing has been a detailed description of illustrative embodiments of the invention.",
"It is noted that in the present specification and claims appended hereto, conjunctive language such as is used in the phrases “at least one of X, Y and Z” and “one or more of X, Y, and Z,” unless specifically stated or indicated otherwise, shall be taken to mean that each item in the conjunctive list can be present in any number exclusive of every other item in the list or in any number in combination with any or all other item(s) in the conjunctive list, each of which may also be present in any number.",
"Applying this general rule, the conjunctive phrases in the foregoing examples in which the conjunctive list consists of X, Y, and Z shall each encompass: one or more of X; one or more of Y; one or more of Z; one or more of X and one or more of Y; one or more of Y and one or more of Z; one or more of X and one or more of Z; and one or more of X, one or more of Y and one or more of Z.",
"Various modifications and additions can be made without departing from the spirit and scope of this invention.",
"Features of each of the various embodiments described above may be combined with features of other described embodiments as appropriate in order to provide a multiplicity of feature combinations in associated new embodiments.",
"Furthermore, while the foregoing describes a number of separate embodiments, what has been described herein is merely illustrative of the application of the principles of the present invention.",
"Additionally, although particular methods herein may be illustrated and/or described as being performed in a specific order, the ordering is highly variable within ordinary skill to achieve aspects of the present disclosure.",
"Accordingly, this description is meant to be taken only by way of example, and not to otherwise limit the scope of this invention.",
"Exemplary embodiments have been disclosed above and illustrated in the accompanying drawings.",
"It will be understood by those skilled in the art that various changes, omissions and additions may be made to that which is specifically disclosed herein without departing from the spirit and scope of the present invention."
]
] |
Patent_15871191
|
[
[
"BIOMETRIC SENSING CHIP AND ELECTRONIC DEVICE USING SAME",
"A biometric sensing chip includes a biometric sensing die including a memory circuit for saving data and an electrostatic conductor set above the memory circuit for discharging static electricity.",
"An electronic device includes the biometric sensing chip described above is also provided."
],
[
"1.A biometric sensing chip comprising: a biometric sensing die comprising a memory circuit for saving data; and an electrostatic conductor set above the memory circuit for discharging static electricity.",
"2.The biometric sensing chip of claim 1, wherein the electrostatic conductor is partially or entirely set right above the memory circuit.",
"3.The biometric sensing chip of claim 1, wherein the electrostatic conductor crosses over the memory circuit.",
"4.The biometric sensing chip of claim 1, wherein the memory circuit is an ultraviolet erasable memory circuit.",
"5.The biometric sensing chip of claim 1, wherein the memory circuit comprises a one-time programmable memory and/or a multi-time programmable memory.",
"6.The biometric sensing chip of claim 1, wherein the electrostatic conductor is directly or indirectly grounded for discharging the static electricity.",
"7.The biometric sensing chip of claim 1, wherein the electrostatic conductor is a wire.",
"8.The biometric sensing chip of claim 7, wherein the electrostatic conductor is formed as a protrusion or a tip right above the memory circuit.",
"9.The biometric sensing chip of claim 7, wherein ways of setting the wire comprise that both ends of the wire are set on the biometric sensing die, one end of the wire is set on the biometric sensing die and the other end of the wire is set at a side of biometric sensing die, or both ends of the wire are correspondingly set at two opposite sides of the biometric sensing die.",
"10.The biometric sensing chip of claim 1, further comprising an encapsulant for encapsulating the biometric sensing die and the electrostatic conductor, wherein the electrostatic conductor is located between the biometric sensing die and the encapsulant.",
"11.The biometric sensing chip of claim 10, wherein the encapsulant is filled in a space between the electrostatic conductor and the encapsulant.",
"12.The biometric sensing chip of claim 10, further comprising two pads grounded directly or indirectly, wherein the electrostatic conductor connects the two pads.",
"13.The biometric sensing chip of claim 12, wherein ways of setting the pads comprise that both pads are set on the biometric sensing die, one of the two pads is set on the biometric sensing die and the other one of the two pads is set at one side of the biometric sensing die, or both pads are correspondingly set at two opposite sides of the biometric sensing die.",
"14.The biometric sensing chip of claim 13, wherein the biometric sensing die defines a through hole corresponding to each pad when both pads are set on the biometric sensing die, and the electrostatic conductor is connected to the pad via the through hole.",
"15.The biometric sensing chip of claim 1, defining a side surface for sensing biological information of a user, wherein the electrostatic conductor is closer to the sensing surface than the memory circuit.",
"16.The biometric sensing chip of claim 1, further comprising a sensing unit for sensing biological information of a user.",
"17.The biometric sensing chip of claim 1, wherein the biometric sensing chip comprises one or more than one of a fingerprint sensor chip, a blood oxygen sensor chip, and a heartbeat sensor chip.",
"18.A biometric sensing chip comprising: a biometric sensing die comprising an ultraviolet erasable memory; and a wire partially or entirely set right above the ultraviolet erasable memory; wherein the wire is formed as a protrusion or a tip right above the biometric sensing die and is grounded directly or indirectly.",
"19.The biometric sensing chip of claim 18, further comprising an encapsulant for encapsulating the biometric sensing die and the electrostatic conductor, wherein the electrostatic conductor is located between the biometric sensing die and the encapsulant.",
"20.An electronic device comprising the biometric sensing chip of claim 1."
],
[
"<SOH> BACKGROUND <EOH>A biometric sensor gradually becomes a must-have element of an electronic device, especially for a mobile terminal The biometric sensor, such as a fingerprint sensor, is needed to be contacted with or approached to by the user when senses the biological information in order to acquire a sensing signal strong enough.",
"However, a memory circuit of the biometric sensor for saving data may be damaged by the static electricity on human body when the user contacts with or approach to the biosensor, which leads to a failure or a low performance of the biometric sensor."
],
[
"<SOH> SUMMARY <EOH>To solve the technical problem set forth above, the present disclosure provides a biometric sensing chip and an electronic device using same which can prevent a memory circuit from a damage made by static electricity.",
"A biometric sensing chip includes a biometric sensing die including a memory circuit for saving data and an electrostatic conductor set above the memory circuit for discharging static electricity.",
"In some embodiments, the electrostatic conductor is partially or entirely set right above the memory circuit.",
"In some embodiments, the electrostatic conductor crosses over the memory circuit.",
"In some embodiments, the memory circuit is an ultraviolet erasable memory circuit.",
"In some embodiments, the memory circuit includes a one-time programmable memory and/or a multi-time programmable memory.",
"In some embodiments, the electrostatic conductor is directly or indirectly grounded for discharging the static electricity.",
"In some embodiments, the electrostatic conductor is a wire.",
"In some embodiments, the electrostatic conductor is formed as a protrusion or a tip right above the memory circuit.",
"In some embodiments, ways of setting the wire include that both ends of the wire are set on the biometric sensing die, one end of the wire is set on the biometric sensing die and the other end of the wire is set at a side of biometric sensing die, or both ends of the wire are correspondingly set at two opposite sides of the biometric sensing die.",
"In some embodiments, the biometric sensing chip further includes an encapsulant for encapsulating the biometric sensing die and the electrostatic conductor.",
"The electrostatic conductor is located between the biometric sensing die and the encapsulant.",
"In some embodiments, the encapsulant is filled in a space between the electrostatic conductor and the encapsulant.",
"In some embodiments, the biometric sensing chip further includes two pads grounded directly or indirectly.",
"The electrostatic conductor connects the two pads.",
"In some embodiments, ways of setting the pads include that both pads are set on the die, one of the two pads is set on the biometric sensing die and the other one of the two pads is set at one side of the biometric sensing die, or both pads are correspondingly set at two opposite sides of the biometric sensing die.",
"In some embodiments, the biometric sensing die defines a through hole corresponding to each pad when both pads are set on the biometric sensing die, and the electrostatic conductor is connected to the pad via the through hole.",
"In some embodiments, the biometric sensing chip defines a side surface for sensing biological information of a user.",
"The electrostatic conductor is closer to the sensing surface than the memory circuit.",
"In some embodiments, the biometric sensing die further includes a sensing unit for sensing biological information of a user.",
"In some embodiments, the biometric sensing chip includes one or more than one of a fingerprint sensor chip, a blood oxygen sensor chip, and a heartbeat sensor chip.",
"The biometric sensing chip includes the electrostatic conductor set above the memory circuit.",
"The electrostatic conductor can conduct the static electricity to ground when the user contacts with or approaches to the biometric sensing chip, thus the memory circuit is prevented from the damage made by the static electricity.",
"Furthermore, the electrostatic conductor has the advantages of simple structure, less material consumption, and low material cost.",
"A biometric sensing chip includes a biometric sensing die including an ultraviolet erasable memory and a wire partially or entirely set right above the ultraviolet erasable memory.",
"The wire is formed as a protrusion or a tip right above the biometric sensing die and is grounded directly or indirectly.",
"In some embodiments, the ultraviolet erasable memory includes a one-time programmable memory and/or a multi-time programmable memory.",
"In some embodiments, the biometric sensing chip comprises an encapsulant for encapsulating the biometric sensing die and the electrostatic conductor.",
"The electrostatic conductor is located between the biometric sensing die and the encapsulant.",
"In some embodiments, the biometric sensing chip defines a side surface for sensing biological information of a user.",
"The electrostatic conductor is closer to the sensing surface than the ultraviolet erasable memory.",
"The biometric sensing chip includes the electrostatic conductor set above the memory circuit.",
"The electrostatic conductor can conduct the static electricity to ground when the user contacts with or approaches to the biometric sensing chip, thus the memory circuit is prevented from the damage made by the static electricity.",
"Furthermore, the electrostatic conductor has the advantages of simple structure, less material consumption, and low material cost.",
"An electronic device includes the biometric sensing chip of any one of embodiments described above.",
"The electronic device includes the biometric sensing chip mentioned above, thus the electronic device also can prevent the memory circuit from the damage made by the static electricity and has the advantages of simple structure, less material consumption, and low material cost.",
"The above-described contents are detailed with specific and preferred embodiments for the present disclosure.",
"The implementation of the present disclosure is not to be limited to these illustrations.",
"For one of ordinary skill in the art, variations and equivalents having the same effects and applications can be made without departing from the spirit of the present disclosure and are to be considered as belonging to the scope of the present disclosure."
],
[
"CROSS-REFERENCE TO RELATED APPLICATIONS This application is a continuation under 35 U.S.C.",
"§120 of international patent application No.",
"PCT/CN2016/083979, filed on May 30, 2016, the content of each application is hereby incorporated by reference.",
"FIELD The subject matter herein generally relates to biometric identification technologies, and particularly, to a biometric sensing chip and an electronic device using same.",
"BACKGROUND A biometric sensor gradually becomes a must-have element of an electronic device, especially for a mobile terminal The biometric sensor, such as a fingerprint sensor, is needed to be contacted with or approached to by the user when senses the biological information in order to acquire a sensing signal strong enough.",
"However, a memory circuit of the biometric sensor for saving data may be damaged by the static electricity on human body when the user contacts with or approach to the biosensor, which leads to a failure or a low performance of the biometric sensor.",
"SUMMARY To solve the technical problem set forth above, the present disclosure provides a biometric sensing chip and an electronic device using same which can prevent a memory circuit from a damage made by static electricity.",
"A biometric sensing chip includes a biometric sensing die including a memory circuit for saving data and an electrostatic conductor set above the memory circuit for discharging static electricity.",
"In some embodiments, the electrostatic conductor is partially or entirely set right above the memory circuit.",
"In some embodiments, the electrostatic conductor crosses over the memory circuit.",
"In some embodiments, the memory circuit is an ultraviolet erasable memory circuit.",
"In some embodiments, the memory circuit includes a one-time programmable memory and/or a multi-time programmable memory.",
"In some embodiments, the electrostatic conductor is directly or indirectly grounded for discharging the static electricity.",
"In some embodiments, the electrostatic conductor is a wire.",
"In some embodiments, the electrostatic conductor is formed as a protrusion or a tip right above the memory circuit.",
"In some embodiments, ways of setting the wire include that both ends of the wire are set on the biometric sensing die, one end of the wire is set on the biometric sensing die and the other end of the wire is set at a side of biometric sensing die, or both ends of the wire are correspondingly set at two opposite sides of the biometric sensing die.",
"In some embodiments, the biometric sensing chip further includes an encapsulant for encapsulating the biometric sensing die and the electrostatic conductor.",
"The electrostatic conductor is located between the biometric sensing die and the encapsulant.",
"In some embodiments, the encapsulant is filled in a space between the electrostatic conductor and the encapsulant.",
"In some embodiments, the biometric sensing chip further includes two pads grounded directly or indirectly.",
"The electrostatic conductor connects the two pads.",
"In some embodiments, ways of setting the pads include that both pads are set on the die, one of the two pads is set on the biometric sensing die and the other one of the two pads is set at one side of the biometric sensing die, or both pads are correspondingly set at two opposite sides of the biometric sensing die.",
"In some embodiments, the biometric sensing die defines a through hole corresponding to each pad when both pads are set on the biometric sensing die, and the electrostatic conductor is connected to the pad via the through hole.",
"In some embodiments, the biometric sensing chip defines a side surface for sensing biological information of a user.",
"The electrostatic conductor is closer to the sensing surface than the memory circuit.",
"In some embodiments, the biometric sensing die further includes a sensing unit for sensing biological information of a user.",
"In some embodiments, the biometric sensing chip includes one or more than one of a fingerprint sensor chip, a blood oxygen sensor chip, and a heartbeat sensor chip.",
"The biometric sensing chip includes the electrostatic conductor set above the memory circuit.",
"The electrostatic conductor can conduct the static electricity to ground when the user contacts with or approaches to the biometric sensing chip, thus the memory circuit is prevented from the damage made by the static electricity.",
"Furthermore, the electrostatic conductor has the advantages of simple structure, less material consumption, and low material cost.",
"A biometric sensing chip includes a biometric sensing die including an ultraviolet erasable memory and a wire partially or entirely set right above the ultraviolet erasable memory.",
"The wire is formed as a protrusion or a tip right above the biometric sensing die and is grounded directly or indirectly.",
"In some embodiments, the ultraviolet erasable memory includes a one-time programmable memory and/or a multi-time programmable memory.",
"In some embodiments, the biometric sensing chip comprises an encapsulant for encapsulating the biometric sensing die and the electrostatic conductor.",
"The electrostatic conductor is located between the biometric sensing die and the encapsulant.",
"In some embodiments, the biometric sensing chip defines a side surface for sensing biological information of a user.",
"The electrostatic conductor is closer to the sensing surface than the ultraviolet erasable memory.",
"The biometric sensing chip includes the electrostatic conductor set above the memory circuit.",
"The electrostatic conductor can conduct the static electricity to ground when the user contacts with or approaches to the biometric sensing chip, thus the memory circuit is prevented from the damage made by the static electricity.",
"Furthermore, the electrostatic conductor has the advantages of simple structure, less material consumption, and low material cost.",
"An electronic device includes the biometric sensing chip of any one of embodiments described above.",
"The electronic device includes the biometric sensing chip mentioned above, thus the electronic device also can prevent the memory circuit from the damage made by the static electricity and has the advantages of simple structure, less material consumption, and low material cost.",
"The above-described contents are detailed with specific and preferred embodiments for the present disclosure.",
"The implementation of the present disclosure is not to be limited to these illustrations.",
"For one of ordinary skill in the art, variations and equivalents having the same effects and applications can be made without departing from the spirit of the present disclosure and are to be considered as belonging to the scope of the present disclosure.",
"BRIEF DESCRIPTION OF THE DRAWINGS The present disclosure is illustrated by way of embodiments and accompanying drawings.",
"FIG.",
"1 is a cross sectional view of a first embodiment of a biometric sensing module of the present disclosure.",
"FIG.",
"2 is a cross sectional view of a second embodiment of a biometric sensing module of the present disclosure.",
"FIG.",
"2a is a top view of the second embodiment of the biometric sensing module of the present disclosure, showing a first arrangement of a number of pads of the biometric sensing module.",
"FIG.",
"2b is a top view of the second embodiment of the biometric sensing module of the present disclosure, showing a second arrangement of a number of pads of the biometric sensing module.",
"FIG.",
"2c is a top view of the second embodiment of the biometric sensing module of the present disclosure, showing a third arrangement of a number of pads of the biometric sensing module.",
"FIG.",
"2d is a top view of the second embodiment of the biometric sensing module of the present disclosure, showing a third arrangement of a number of pads of the biometric sensing module.",
"FIG.",
"3 is a cross sectional view of a third embodiment of a biometric sensing module of the present disclosure.",
"FIG.",
"3a is a top view of the third embodiment of the biometric sensing module of the present disclosure, showing a first arrangement of a number of electrostatic conductors of the biometric sensing module.",
"FIG.",
"3b is a top view of the third embodiment of the biometric sensing module of the present disclosure, showing a second arrangement of a number of electrostatic conductors of the biometric sensing module.",
"FIG.",
"4 is a cross sectional view of a first embodiment of a biometric sensing chip of the present disclosure.",
"FIG.",
"5 is a cross sectional view of a second embodiment of a biometric sensing chip of the present disclosure.",
"FIG.",
"6 is a cross sectional view of a third embodiment of a biometric sensing chip of the present disclosure.",
"FIG.",
"7 is a three-dimensional view of an electronic device of the present disclosure.",
"DETAILED DESCRIPTION The embodiments are illustrated in more detail with reference to the drawings now.",
"However, the disclosure can be implemented in many different embodiments, and cannot be limited to the embodiments described in the present disclosure.",
"On the contrary, the embodiments described herein can make the disclosure fully and completely understood by those skilled in the art.",
"The thickness and size of each layer and the number of elements in the drawings may be exaggerated, omitted, or schematically shown for the convenience and clarity of description.",
"That is, the size of elements in the drawing are not required to be the full size thereof, and the number of elements are also not required to be the actual number thereof.",
"The same reference numbers in the drawings denote the same or similar structures.",
"A part indicated by the dashed line in the drawings represents the inside part of a solid and is shown for the convenience of description in the present disclosure.",
"In fact, the dashed line parts can not be seen from the outside.",
"In description of the present disclosure, it is understood that the term “a number of” or “a plurality of” is defined as two or more than two, unless there is the other definite limitation.",
"Correspondingly, this definition can be applied to the other plural terms, such as “multiple”, “different kinds of”, and “many” The term “connect” can be understood as various connection, such as electrical connection, mechanical connection, coupling, direct connection, or indirect connection, and is not particularly limited unless there is a specified statement below.",
"In addition, the ordinal terms, such as “first” and “second”, appearing in the name of the elements do not limit the sequential order of the appearance of the elements, and is just for the convenience of naming and distinguishing the elements, so as to make the description more clear and concise.",
"In the present disclosure, the terms “thickness”, “above”, “below”, “front”, “back”, “left”, “right”, “perpendicular”, “horizontal”, “top”, “bottom”, “inner”, “outer”, etc.",
"are based on the orientation or positional relation schematically shown in the drawings, which is just for the convenience of simplified description rather than indicating or implying the apparatus or element must has a specific orientation or to be constructed and operated in a specific orientation, and thus cannot be understood as a limitation to the disclosure.",
"Furthermore, the features and structures described herein may be combined into one or more than one embodiments in any appropriate way.",
"A lot of details are provided in the following description to give a thorough understanding of the embodiments of the present disclosure.",
"However, one of ordinary skill in the art should realize that the embodiments of the present disclosure still can be implemented without one or more than one of said details or by employing the other structures or components.",
"In the other instances, the well-known details or operations are not provided in order to avoid obscuring the present disclosure.",
"A biometric sensing module is provided in the present disclosure.",
"The biometric sensing module is used to sense the biological information input by an object.",
"Preferably, the biometric sensing module is completely formed in a biometric sensing chip.",
"In detail, the biometric sensing chip includes a biometric sensing die and an electrostatic conductor.",
"The biometric sensing die includes a memory circuit.",
"The memory circuit is used to save data.",
"The data, for example, can be initialization data of a circuit of the biometric sensing chip, product model, etc.",
"The electrostatic conductor is partially or entirely formed above the biometric sensing die.",
"Preferably, the electrostatic conductor is formed as a protrusion or a tip right above the memory circuit and directly or indirectly grounded to discharge the static electricity.",
"Furthermore, the biometric sensing chip further includes an encapsulant.",
"The encapsulant is used to encapsulate the biometric sensing die and the electrostatic conductor.",
"The electrostatic conductor is formed between the biometric sensing die and the encapsulant.",
"The encapsulant is filled in a space between the electrostatic conductor and the encapsulant.",
"One side surface of the encapsulant is defined as a sensing surface of the biometric sensing chip for sensing an input operation of the user.",
"The electrostatic conductor is closer to the sensing surface than the memory circuit.",
"The electrostatic conductor conducts the static electricity of the user to ground when the user approaches to or contacts with the sensing surface, thus a loss or a damage of the memory circuit made by the static electricity can be avoid.",
"The electrostatic conductor can be, for example, a wire.",
"The protrusion or the tip can be formed by a wire bonding process.",
"However, the electrostatic conductor is not limited to the wire, and can be other different shaped conductive members.",
"The memory circuit can be, for example, an ultraviolet erasable memory.",
"The ultraviolet erasable memory, for example, can be a one-time programmable memory (OTP memory) and/or a multi-time programmable memory (MTP memory).",
"However, the memory circuit can be other different kinds of memory and is not limited to the ultraviolet erasable memory described herein.",
"In the present disclosure, a fingerprint sensor chip is taken as an example of the biometric sensing chip.",
"The memory circuit is usually set in a fingerprint sensing die of the fingerprint sensor chip.",
"The electrostatic conductor is set above the corresponding memory circuit in the fingerprint sensor chip for absorbing the static electricity flowing towards the memory circuit.",
"For example, the electrostatic conductor can be a metal conductive element, but is not limited thereto.",
"In particular, the OTP memory is taken as an example for illustration when the memory circuit is the ultraviolet erasable memory.",
"After the fingerprint sensing die is taped out, and before the fingerprint sensing die is encapsulated to be the fingerprint sensor chip, the fingerprint sensing die needs to be tested by writing the data to the OTP memory.",
"The data written in the OTP memory during the test is erased by the ultraviolet when the OTP memory passes the test.",
"The electrostatic conductor cannot be set above the OTP memory of the fingerprint sensing die because the OTP memory needs to be erased by the ultraviolet during the test of the fingerprint sensing die.",
"If the fingerprint sensing die (it is noted that there is no electrostatic conductor set on said fingerprint sensor chip) is encapsulated to be the fingerprint sensor chip, the OTP memory is more likely to be damaged by the static electricity of human body due to the absence of the conductive metal element when the user approaches to or contacts with the fingerprint sensor chip, thus the fingerprint sensor chip breaks down.",
"To solve the problem set forth above, the electrostatic conductor is formed above the fingerprint sensing die when the fingerprint sensing die has passed the test and is going to be encapsulated to be the fingerprint sensor chip.",
"Preferably, the electrostatic conductor is located right above the OTP memory or across the OTP memory.",
"After that, the electrostatic conductor and the fingerprint sensing die are encapsulated into the encapsulant to form the fingerprint sensor chip.",
"Thus, the electrostatic conductor conducts the static electricity flowing towards the OTP memory to the ground when the user approaches to or contacts with the fingerprint sensor chip having the electrostatic conductor, and the OTP memory can be prevented from the damage made by the static electricity.",
"In one embodiment, both ends of the wire are formed on the fingerprint sensing die.",
"In another embodiment, one of the both ends of the wire is formed on the fingerprint sensing die, and the other one of the both ends of the wire is formed at one side of the fingerprint sensing die.",
"In another embodiment, two ends of the wire are respectively formed at two sides of the fingerprint sensing die.",
"Preferably, two ends of the wires are respectively formed at two opposite sides of the fingerprint sensing die.",
"That is, the wire crosses over the fingerprint sensing die.",
"It is noted that one end or both ends of the wire are not formed on the fingerprint sensing die when one end or both ends of the wire are formed on one side or both sides of the fingerprint sensing die.",
"For example, the fingerprint sensor chip further includes a circuit board when the fingerprint sensor chip employs the ball grid array package (BGA), the fingerprint sensing die and the electrostatic conductor are formed between the circuit board and the encapsulant, and one end or both ends of the wire can be formed on the circuit board.",
"Since the fingerprint sensor chip can be encapsulated in various ways, for example, a quad flat no-lead (QFN) encapsulation, correspondingly, the fingerprint sensor chip may not include the circuit board, but instead of a lead frame formed around the fingerprint sensing die.",
"The biometric sensing module includes one or more than one of a fingerprint sensing module, a blood oxygen sensing module, a heartbeat sensing module, a pressure sensing module, a humidity sensing module, a temperature sensing module, and an iris sensing module.",
"Correspondingly, the biological information includes one or more than one of fingerprint information, blood oxygen information, heartbeat information, pressure information, humidity information, temperature information, and iris information.",
"The object to be sensed may be a finger of the user or the other part of the user's body, such as the eye, the heartbeat, the palm, the toe, the ears, etc., or a combination of any part of the user's body, even can be other suitable type of organisms not limited to the human body.",
"The present disclosure is further illustrated as below by way of embodiments and accompanying drawings.",
"Referring to FIG.",
"1, FIG.",
"1 illustrates a cross sectional view of the biometric sensing module 100 in accordance with a first embodiment of the present disclosure.",
"The biometric sensing module 100 includes a sensing unit 10, a memory circuit 20, at least one pad 30, and an electrostatic conductor 40.The sensing unit 10 is used to sense the biological information of the object when the object approaches to or contacts with the sensing unit 10.The memory circuit 20 is used to save the data.",
"The data, for example, can be initialization data of a circuit in the biometric sensing module 100, product model, etc.",
"The pad 30 is used to ground directly or indirectly.",
"The pad 30 is located, for example, around the memory circuit 20 or above the memory circuit 20.In this embodiment, the pad 30 is set above the memory circuit and outside the memory circuit 20.The electrostatic conductor 40 is connected to the pad 30.The electrostatic conductor 40 is used to conduct the static electricity to the ground.",
"The ground, for example, can be a system ground or a device ground of an electronic device 400 (see FIG.",
"7) to which the biometric sensing module 100 is applied.",
"The ground is usually loaded with a voltage of 0 volt (V).",
"The pad 30, for example, can be grounded via a modulation circuit or a power supply when the pad 30 is indirectly grounded.",
"In this embodiment, the electrostatic conductor 40 extends from the pad 30 to a place above the memory circuit 20.In other embodiments, the electrostatic conductor 40 also can extend perpendicularly upwards from the pad 30 or extend in other appropriate ways.",
"The electrostatic conductor 40 can be a wire.",
"The wire is a metal wire.",
"The material of the metal wire, for example, can be gold, copper, aluminum, etc.",
"It is understood that the wire also can be made of other appropriate conductive materials.",
"The wire has the advantages of simple structure, less material consumption, and low material cost.",
"In addition, the electrostatic conductor 40 also can be other conductive elements with appropriate shape, and is not limited to the wire.",
"Furthermore, the wire includes a protrusion 41 set above the memory circuit 20.The protrusion 41 is formed by the wire bonding process.",
"The protrusion 41 is shaped as a tip or an arc to conduct the static electricity of the user to ground via the pad 30, thus the memory circuit 20 can be prevented from the damage made by the static electricity.",
"The number of the pad 30 may be one or more than one.",
"The material of the pad 30 can be one or a combination of aluminum, copper, gold, silver, platinum, palladium, nickel, etc.",
"It is understood that the material of the pad 30 also can be other appropriate materials.",
"In this embodiment, the memory circuit 20 is the ultraviolet erasable memory, such as OTP memory or MTP memory.",
"It is understood that the memory circuit 20 also can be other appropriate types of memory and not limited to the ultraviolet erasable memory.",
"The biometric sensing module 100 may further includes a first insulating layer 50.The first insulating layer 50 is set above the sensing unit 10 and the memory circuit 20.The pad 30 is set on the first insulating layer 50.In other embodiments, the first insulating layer 50 is set on one of the memory circuit 20 and the sensing unit 10.Alternatively, the first insulating layer 50 is omitted, and the pad 30 is set around the memory circuit 20.Referring to FIGS.",
"2-2d, FIG.",
"2 is a cross sectional view of a second embodiment of the biometric sensing module 100 of the present disclosure.",
"FIG.",
"2a is a top view of the second embodiment of the biometric sensing module 100 of the present disclosure, showing a first arrangement of a number of pads 30 of the biometric sensing module 100.FIG.",
"2b is a top view of the second embodiment of the biometric sensing module 100 of the present disclosure, showing a second arrangement of a number of pads 30 of the biometric sensing module 100.FIG.",
"2c is a top view of the second embodiment of the biometric sensing module 100 of the present disclosure, showing a third arrangement of a number of pads 30 of the biometric sensing module 100.FIG.",
"2d is a top view of the second embodiment of the biometric sensing module 100 of the present disclosure, showing a fourth arrangement of a number of pads 30 of the biometric sensing module 100.Referring to FIG.",
"2, the pad 30 includes a first sub-pad 31 and a second sub-pad 32 formed around the memory circuit 20.The first sub-pad 31 and the second sub-pad 32 are used to receive a ground signal.",
"Two ends of the electrostatic conductor 40 are correspondingly connected to the first sub-pad 31 and the second sub-pad 32.One or both of the first sub-pad 31 and the second sub-pad 32 can be directly grounded, electrically connected to the ground end of the memory circuit 20 or the sensing unit 10, or electrically connected to the ground of system.",
"It is understood that the grounding way of the first sub-pad 31 and the second sub-pad 32 of the present disclosure are not limited to the ways listed herein and can be other appropriate grounding ways.",
"The first sub-pad 31 and the second sub-pad 32 are correspondingly formed at arbitrary two sides of the memory circuit 20 so that the electrostatic conductor 40 crosses over the memory circuit 20.For example, the first sub-pad 31 and the second sub-pad 32 are correspondingly formed at two adjacent sides, two opposite sides of the memory circuit 20, etc.",
"Referring to FIG.",
"2a, the first sub-pad 31 and the second sub-pad 32 are correspondingly formed at two adjacent sides of the memory circuit 20.Thus, the electrostatic conductor 40 connecting the first sub-pad 31 and the second sub-pad 32 crosses over the memory circuit 20 at a corner composed of the two adjacent sides where the first sub-pad 31 and the second sub-pad 32 formed.",
"Referring to FIG.",
"2b, the first sub-pad 31 and the second sub-pad 32 are correspondingly formed at two opposite sides of the memory circuit 20.Thus, the electrostatic conductor 40 connecting the first sub-pad 31 and the second sub-pad 32 horizontally crosses over the memory circuit 20.Referring to FIG.",
"2c, alternatively, the first sub-pad 31 and the second sub-pad 32 are correspondingly formed at the opposite corners of the memory circuit 20.Thus, the electrostatic conductor 40 connecting the first sub-pad 31 and the second sub-pad 32 crosses over the memory circuit 20 along the diagonal line of the memory circuit 20.Referring to FIG.",
"2d, alternatively, the first sub-pad 31 and the second sub-pad 32 are correspondingly formed at the same side of the memory circuit 20 with a predetermined interval.",
"Thus, the electrostatic conductor 40 connecting the first sub-pad 31 and the second sub-pad 32 do not cross over the memory circuit 20 but still higher than the memory circuit 20.Alternatively, in other embodiments, the first sub-pad 31 can be set at a corner of the memory circuit 20, and the second sub-pad 32 is set on one side of the memory circuit 20.In the FIG.",
"2, FIG.",
"2b, and FIG.",
"2c, the first sub-pad 31 is set between the memory circuit 20 and the sensing unit 10.Alternatively, in other embodiments, the first sub-pad 31 also can be set right above the memory circuit 20 or the sensing unit 10.The arrangements of the first sub-pad 31 and the second sub-pad 32 are not limited to the arrangements described in the present disclosure, and can be other appropriate arrangements.",
"For example, the first sub-pad 31 and the second sub-pad 32 can be correspondingly set at two sides of each two or three circuits.",
"Thus, one electrostatic conductor 40 connecting the first sub-pad 31 and the second sub-pad 32 is set corresponding to each of the two or three circuits.",
"It is noted that the biometric sensing module 100, the memory circuit 20, and the sensing unit 10 are not limited to the rectangle shown in FIGS.",
"2a-2d and also can be other regular shapes, such as a square, a hexagon, an octagonal, etc., irregular shapes, or other appropriate shapes.",
"In addition, the first sub-pad 31 and the second sub-pad 32 are not limited to the circular shape shown in FIGS.",
"2a-2d and also can be other regular shapes, such as a square, a rectangular, etc., irregular shapes, or other appropriate shapes.",
"Referring to FIGS.",
"3-3b, FIG.",
"3 is a cross sectional view of a third embodiment of the biometric sensing module 100 of the present disclosure.",
"FIG.",
"3a is a top view of the third embodiment of the biometric sensing module 100 of the present disclosure, showing a first arrangement of a number of electrostatic conductors 40 of the biometric sensing module 100.FIG.",
"3b is a top view of the third embodiment of the biometric sensing module 100 of the present disclosure, showing a second arrangement of a number of electrostatic conductors 40 of the biometric sensing module 100.The number of the electrostatic conductor 40 can be one or more than one.",
"The electrostatic conductors 40 are spaced apart when the electrostatic conductors 40 are more than one.",
"The electrostatic conductors 40 can be spaced apart on the vertical plane or on the horizontal plane.",
"For example, the electrostatic conductors 40 of FIG.",
"3 are spaced apart on the vertical plane, and the electrostatic conductors 40 of FIG.",
"3a are spaced apart on the horizontal plane.",
"It is noted that relative heights between the memory circuit 20 and each of the electrostatic conductors 40 in FIG.",
"3 are different from each other, but the shape and size of each electrostatic conductor 40 in FIG.",
"3 can be the same as one another or different from each other.",
"It is noted that horizontal projection lengths of each electrostatic conductors 40 in FIG.",
"3a are the same as one another, but the physical lengths, shapes, sizes of each electrostatic conductor 40 can be the same as one another or different from each other.",
"The electrostatic conductors 40 can be arranged in an array, such as a matrix.",
"It is understood that the electrostatic conductors 40 also can be arranged in other regular or irregular ways.",
"Alternatively, as shown in FIG.",
"3b, the electrostatic conductors 40 also can cross each other.",
"It is noted that there are only two electrostatic conductors 40 schematically shown in FIG.",
"3 to FIG.",
"3b, the number of the electrostatic conductors 40 is not limited to two, and can be more than two, correspondingly, the numbers of the first sub-pads 31 and the second sub-pad 32 increase.",
"In addition, the arrangement of the electrostatic conductors 40 is not limited to the embodiments described herein, and can employ other arrangements.",
"Referring to FIGS.",
"2 and 4, FIG.",
"4 is a cross sectional view of a first embodiment of the biometric sensing chip 300.The biometric sensing chip 300 includes the biometric sensing module 100.The biometric sensing chip 300 includes the biometric sensing die 200 and the electrostatic conductor 40.The biometric sensing die 200 is set on the circuit board 330.The biometric sensing die 200 includes the memory circuit 20.Preferably, the electrostatic conductor 40 is partially or entirely set above the memory circuit 20 to conduct the static electricity to the ground.",
"The biometric sensing die 200 further includes a substrate 310, the sensing unit 10, the first insulating layer 50, a second insulating layer 60, and the pad 30.The memory circuit 20 is set on the substrate 310.The first insulating layer 50 and the second insulating layer 60 are set on the memory circuit 20.The memory circuit 20 is located between the substrate 310 and the first insulating layer 50.The pad 30 is set on the first insulating layer 50.The second insulating layer 60 is formed on the first insulating layer 50 and defines a through hole H corresponding to the pad 30.In this embodiment, there are two pads 30 on the first insulating layer 50, correspondingly, there are two through holes 61 in the second insulating layer 60.The electrostatic conductor 40 is connected to the pads 30 via the through holes H. The substrate 310 is made of, for example, semiconductor.",
"The semiconductor, for example, can be silicon.",
"It is understood that the substrate 310 also can be made of other appropriate materials, such as an insulating material.",
"For example, the second insulating layer 60 covers the memory circuit 20 or both the memory circuit 20 and the sensing unit 10 to prevent the biometric sensing die 200 from a mechanical or chemical damage when the biometric sensing die 200 is encapsulated to be the biometric sensing chip 300.The biometric sensing chip 300 of the present disclosure may include a single biometric sensing die 200 or a number of biometric sensing dies 200.For example, the memory circuit 20 is formed in the biometric sensing die 200 when the biometric sensing chip 300 includes the single biometric sensing die 200.The memory circuit 20 can be formed as an independent memory die and set outside the biometric sensing die 200 when the biometric sensing chip 300 includes a number of biometric sensing dies 200.Correspondingly, the first insulating layer 50 and the second insulating layer 60 are not formed on the memory die 30.One of the pads 30 is formed on the biometric sensing die 200, the other one of the pads 30 is formed on the circuit board 330(see below) and located at left side of the memory die 20.The electrostatic conductor 40 crosses over the memory die 30.Alternatively, both pads 30 located at two sides of the memory die 30 are formed on the circuit board 330.The number of the biometric sensing die 200 of the biometric sensing chip 300 and formation thereof are not limited to the number and the formation described above, and can be other appropriate numbers and formations.",
"For example, the memory circuit 20 can be formed in a control die (not shown) when the biometric sensing chip 300 includes two biometric sensing dies 200.The control die is used to control the biometric sensing dies 200 to sense the biological information.",
"It is understood that the biometric sensing module 100 of the biometric sensing chip 300 is not limited to the embodiment of biometric sensing module 100 shown in FIG.",
"2, and can be can be replaced by any one of embodiments of the biometric sensing module 100 described above.",
"Referring to FIG.",
"4, the biometric sensing chip 300 further includes a circuit board 330 and the encapsulant 320.The encapsulant 320 encapsulates the biometric sensing die 200 and the electrostatic conductor 40 into the biometric sensing chip 300.The encapsulant 320 is filled into a space between the electrostatic conductor 40 and the biometric sensing die 200 to fix the electrostatic conductor 40 in the encapsulant 320.The material of the encapsulant 320 can be, for example, an epoxy resin material or other insulating materials.",
"The circuit board 330 is, for example, a printed circuit board.",
"An encapsulating method of the biometric sensing chip 300, for example, includes step 101 to step 104.Step 101, the biometric sensing die 200 is electrically connected to the circuit board 330.Step 102, the electrostatic conductor 40 is connected to the pads 30 via the wire bonding process.",
"Step 103, the circuit board 320 loading the biometric sensing chip 300 is disposed in a mold of the epoxy resin material.",
"Step 104, the mold is closed to encapsulate the biometric sensing chip 300 therein.",
"However, the steps of the encapsulating method of the biometric sensing chip 300 of the present disclosure are not limited to the steps described herein, and can include other appropriate steps.",
"A side surface S of the encapsulant 320 opposite to the memory circuit 20 is used to contact with the object or receive the other input operation and is defined as a sensing surface.",
"The electrostatic conductor 40 is closer to the sensing surface 322 than the memory circuit 20.Since the electrostatic conductor 40 is located between the memory circuit 20 and the encapsulant 320, the static electricity is conducted to the ground through the electrostatic conductor 40 when the object introduces the static electricity.",
"Thus, the memory circuit 20 is prevented from the damage of the static electricity.",
"In addition, the biometric sensing chip 300 includes the circuit board 330 when the biometric sensing chip 300 employs the ball grid array (BGA) encapsulation.",
"The circuit board 300 can be omitted and the biometric sensing chip 300 includes a frame lead set around the biometric sensing chip 200 when the biometric sensing chip 300 employs quad flat no-lead encapsulation.",
"Referring to FIG.",
"5, FIG.",
"5 is a cross sectional view of a second embodiment of the biometric sensing chip 300 of the present disclosure.",
"One end of the electrostatic conductor 40 is set on the biometric sensing die 200.The other end of the electrostatic conductor 400 is set on the circuit board 330.The electrostatic conductor 40 crosses over the memory circuit 20.Correspondingly, when the number of the pads 30 is more than one, a part of the pads 30 are set on the biometric sensing dies 200.The other part of the pads 30 are set on the circuit board 330.The electrostatic conductor 40 is connected to the pads 30.The pads 300 can be replaced by the lead frame when the biometric sensing chip 300 employs the QFN encapsulation.",
"Referring to FIG.",
"6, FIG.",
"6 is a cross sectional view of a third embodiment of the biometric sensing chip 300.Alternatively, both ends of the electrostatic conductor 40 are set on two sides of the biometric sensing die 200.Preferably, both ends of the electrostatic conductor 40 are correspondingly set on two opposite sides of the biometric sensing die 200.Correspondingly, the electrostatic conductor 40 crosses over the biometric sensing die 200.A part of the electrostatic conductor 40 is located right above the memory circuit 20.In this embodiment, the pads 30 connecting with the electrostatic conductor 40 are set on the circuit board 330.The pads 30 are directly or indirectly connected to the ground.",
"The pads 300 can be replaced by the lead frame when the biometric sensing chip 300 employs the QFN encapsulation.",
"The technical idea of the present disclosure is not limited to the biometric sensing module 100 and the biometric sensing chip 300 described above and can be applied to other appropriate chips including the memory circuit 20, in particular, the memory circuit 20 is an ultraviolet erasable memory and needs to be contacted or approached by the user when the chips is in operation.",
"The electrostatic conductor 40 is set right above or across the memory circuit 20 by the wire bonding when the chip is encapsulated, thus the static flowing to the memory circuit 20 is conducted away when the user contacts on the chip.",
"The chip can be, for example, a capacitive sensor chip, an optical sensor chip, and an ultrasonic sensor chip.",
"Referring to FIG.",
"7, FIG.",
"7 is a three-dimensional view of an electronic device 400 of the present disclosure.",
"The electronic device 400 includes any one of the embodiments of the biometric sensing chip 300 described above.",
"In this embodiment, the electronic device 400 is a cellular phone.",
"It is noted that the electronic device 400 may be, but not limited to, a portable electronic device, a household electronic device, or an on-board electronic device.",
"The portable device can be a mobile terminal, such as a cellular phone, a tablet computer, a notebook computer, a wearable product, etc.",
"The household electronic device can be, for example, a smart lock, a television, a refrigerator, a desktop computer, etc.",
"The on-board electronic device can be, for example, a car display, a driving recorder, a navigator, a car refrigerator, etc.",
"Although the present disclosure has been described with reference to various embodiments, it is understood that these embodiments are illustrative and the scope of the present disclosure is not limited thereto.",
"Many variations, modifications, additions, and improvements are possible.",
"More generally, various embodiments disclosed in accordance with the present disclosure are described in the context of the specific embodiment.",
"The functions of the disclosed embodiments of the present disclosure may be separated or combined in various ways, or described in different terms.",
"These and other variations, modifications, additions, and improvements should be considered within the scope of the present disclosure defined by the following claims."
]
] |
Patent_15871193
|
[
[
"COMMUNICATION APPARATUS AND COMMUNICATION METHOD FOR RECEIVING CONTROL INFORMATION OVER A SEARCH SPACE",
"A communication apparatus has a receiver and a decoder.",
"The receiver receives a control signal including first downlink control information and second downlink control information, and receives decoding area information that indicates whether the extended Physical Downlink Control Channel (PDCCH) should be decoded for each of a plurality of terminal apparatuses.",
"The decoder decodes each of a plurality of first mapping candidates in the PDCCH area or decodes each of the plurality of first mapping candidates in the PDCCH area and each of the plurality of second mapping candidates in the extended PDCCH.",
"A number of the second mapping candidates included in the user-specific search space equals to or is more than a number of the first mapping candidates included in the common search space."
],
[
"1.A communication apparatus comprising: a receiver which, in operation, receives a control signal including first downlink control information and second downlink control information, the first downlink control information being mapped to one of a plurality of first mapping candidates that are included in a common search space in a Physical Downlink Control Channel (PDCCH) region of a subframe, and the second downlink control information being mapped to one of a plurality of second mapping candidates that are included in a user-specific search space in an extended Physical Downlink Control Channel (extended PDCCH) defined within a data region of the subframe, and receives search space information indicating the user-specific search space in the extended PDCCH to be decoded by the communication apparatus; and a decoder which, in operation, according to the search space information, decodes each of the plurality of first mapping candidates in the PDCCH area and each of the plurality of second mapping candidates in the extended PDCCH.",
"2.The communication apparatus according to claim 1, wherein each of the plurality of first mapping candidates and each of the plurality of second mapping candidates are comprised of one control channel element (CCE) or a plurality of aggregated CCEs; the number of the first mapping candidates is a sum of numbers of mapping candidates, the numbers respectively corresponding to a plurality of CCE aggregation levels defined in the common search space; and the number of the second mapping candidates is a sum of numbers of mapping candidates, the numbers respectively corresponding to a plurality of CCE aggregation levels defined in the user-specific search space.",
"3.The communication apparatus according to claim 1, wherein the CCE aggregation levels defined in the common search space are four and eight; and when the CCE aggregation levels is four, the number of mapping candidates is four; and when the CCE aggregation levels is eight, the number of mapping candidates is two.",
"4.The communication apparatus according to claim 1, wherein a demodulation reference signal (DM-RS) is mapped as a reference signal to the extended PDCCH.",
"5.The communication apparatus according to claim 1, wherein a common reference signal (CRS) is mapped in the common search space as a reference signal and a demodulation reference signal (DM-RS) is mapped in the user-specific search space as the reference signal.",
"6.The communication apparatus according to claim 1, wherein the decoder decodes each of the plurality of first mapping candidates and each of the plurality of second mapping candidates, for each of a plurality of DCI formats.",
"7.The communication apparatus according to claim 1, wherein a temporary cell-radio network temporary identifier (C-RNTI) is applied to the PDCCH region.",
"8.The communication apparatus according to claim 1, wherein the decoder decodes each of the plurality of first mapping candidates and each of the plurality of second mapping candidates by using a terminal ID of the communication apparatus.",
"9.A communication method comprising: receiving a control signal including first downlink control information and second downlink control information, the first downlink control information being mapped to one of a plurality of first mapping candidates that are included in a common search space in a Physical Downlink Control Channel (PDCCH) region of a subframe, and the second downlink control information being mapped to one of a plurality of second mapping candidates that are included in a user-specific search space in an extended Physical Downlink Control Channel (extended PDCCH) defined within a data region of the subframe; receiving search space information indicating the user-specific search space in the extended PDCCH to be decoded by a communication apparatus; and according to the search space information, decoding each of the plurality of first mapping candidates in the PDCCH area and each of the plurality of second mapping candidates in the extended PDCCH.",
"10.The communication method according to claim 9, wherein each of the plurality of first mapping candidates and each of the plurality of second mapping candidates are comprised of one control channel element (CCE) or a plurality of aggregated CCEs; the number of the first mapping candidates is a sum of numbers of mapping candidates, the numbers respectively corresponding to a plurality of CCE aggregation levels defined in the common search space; and the number of the second mapping candidates is a sum of numbers of mapping candidates, the numbers respectively corresponding to a plurality of CCE aggregation levels defined in the user-specific search space.",
"11.The communication method according to claim 9, wherein the CCE aggregation levels defined in the common search space are four and eight; and when the CCE aggregation levels is four, the number of mapping candidates is four; and when the CCE aggregation levels is eight, the number of mapping candidates is two.",
"12.The communication method according to claim 9, wherein a demodulation reference signal (DM-RS) is mapped as a reference signal to the extended PDCCH.",
"13.The communication method according to claim 9, wherein a common reference signal (CRS) is mapped in the common search space as a reference signal and a demodulation reference signal (DM-RS) is mapped in the user-specific search space as the reference signal.",
"14.The communication method according to claim 9, wherein the decoding includes decoding each of the plurality of first mapping candidates and the plurality of second mapping candidates, for each of a plurality of DCI formats.",
"15.The communication method according to claim 9, wherein a temporary cell-radio network temporary identifier (C-RNTI) is applied to the PDCCH region.",
"16.The communication method according to claim 9, wherein the decoding is performed by decoding each of the plurality of first mapping candidates and each of the plurality of second mapping candidates by using a terminal ID of the communication apparatus."
],
[
"<SOH> BACKGROUND ART <EOH>In 3rd Generation Partnership Project Radio Access Network Long Term Evolution (3GPP-LTE (hereinafter, referred to as LTE)), Orthogonal Frequency Division Multiple Access (OFDMA) is adopted as a downlink communication scheme, and Single Carrier Frequency Division Multiple Access (SC-FDMA) is adopted as an uplink communication scheme (e.g., see NPL-1, NPL-2, and NPL-3).",
"In LTE, a base station apparatus for radio communications (hereinafter, abbreviated as “base station”) performs communications by allocating a resource block (RB) in a system band to a terminal apparatus for radio communications (hereinafter, abbreviated as “terminal”) for every time unit called “subframe.” The base station also transmits allocation control information (i.e., L1/L2 control information) for the notification of the result of resource allocation of downlink data and uplink data to the terminal.",
"As this allocation control information, Downlink Control Information (DCI) which is downlink allocation control information is transmitted.",
"There are two types of DCI (which will be described later); common DCI targeting all terminals and specific DCI targeting a specific terminal (specific terminal or terminal in a specific group).",
"Furthermore, control information such as DCI is transmitted to a terminal using a downlink control channel such as a Physical Downlink Control Channel (PDCCH).",
"Here, the base station controls the resource amount, that is, the number of OFDM symbols, used for transmission of a PDCCH in subframe units according to the number of terminals allocated or the like.",
"To be more specific, the resource amount used for transmission of a PDCCH is set variably over the entire system band in the frequency-domain, and three OFDM symbols from a leading OFDM symbol to a third OFDM symbol of one subframe in the time-domain.",
"The base station reports to the terminal, a Control Format Indicator (CFI) which is information indicating the number of OFDM symbols available for transmission of a PDCCH with the leading OFDM symbol of each subframe using a Physical Control Format Indicator Channel (PCFICH).",
"The terminal receives DCI according to the CFI detected from the received PCFICH.",
"Furthermore, the base station transmits a HARQ Indicator (HI) indicating delivery acknowledgment information (ACK/NACK) for uplink data to the terminal using a Physical Hybrid ARQ Indicator CHannel (PHICH) (e.g., see NPL-1).",
"In LTE a frequency band having a system bandwidth of up to 20 MHz is supported.",
"Each PDCCH also occupies a resource composed of one or more consecutive control channel elements (CCEs).",
"A CCE is a minimum unit of radio resource allocated to a PDCCH.",
"Furthermore, a CCE is made up of a plurality of consecutive resource element groups (REGs) composed of resource elements (REs).",
"For example, one REG is made up of four REs.",
"To be more specific, a CCE is made up of a plurality of consecutive REGs (e.g., nine consecutive REGs) among REGs not allocated as radio resources for the aforementioned PCFICH and PHICH.",
"Furthermore, the base station may also perform interleaving processing in REG units with resources for a PDCCH for each terminal in order to randomize interference.",
"In LTE, the number of CCEs occupied by a PDCCH (the number of concatenated CCEs: CCE aggregation level) is selected from 1, 2, 4, and 8 depending on the number of information bits of allocation control information or the condition of a propagation path of a terminal.",
"At this time, allocatable CCEs are predetermined for each CCE aggregation level (e.g., see PTL 1).",
"For example, when the CCE aggregation level is n (e.g., n=1, 2, 4, 8), the base station can allocate to a PDCCH for the terminal, only n consecutive CCEs starting from a CCE with a CCE index (CCE number) corresponding to a multiple of n. On the other hand, since the terminal cannot know which CCE is allocated to a PDCCH for the terminal and what the CCE aggregation level is, the terminal has to try decoding (blind decoding) on a PDCCH for all CCEs which may be allocated to the PDCCH for the terminal using a round-robin method.",
"For this reason, as described above, it is possible to reduce the number of trials of PDCCH decoding at the terminal by providing constraints (tree-based structure) of CCEs allocatable to the PDCCH.",
"Furthermore, if a base station allocates a plurality of terminals to one subframe, the base station transmits a plurality of items of DCI via a plurality of PDCCHs at a time.",
"In this case, in order to identify a terminal to which each PDCCH is transmitted, the base station transmits the PDCCH with CRC bits included therein, the bits being masked (or scrambled) with a terminal ID of the transmission destination terminal.",
"Then, the terminal performs demasking (or descrambling) on the CRC bits of a plurality of PDCCHs for the terminal with its own ID, thereby trial-decoding (hereinafter, referred to as “blind-decoding”) the DCI to detect the DCI for the terminal.",
"Also, for the purpose of reducing the number of DCI blind decoding operations on a terminal, a method for limiting CCEs targeted for blind decoding for each terminal is under study.",
"This method limits a CCE region that may be targeted for blind decoding by each terminal (hereinafter, referred to as “search space (SS)”).",
"There are two types of search space; common search space (hereinafter, referred to as “C-SS”) and terminal (UE) specific search space (or UE specific by C-RNTI Search Space: hereinafter, referred to as “UE-SS”).",
"The terminal performs blind decoding on DCI in a C-SS and DCI in a UE-SS corresponding to the terminal.",
"A C-SS is a search space common to all the terminals, indicating a range of CCEs in which all the terminals perform blind decoding on DCI.",
"A C-SS is allocated with a PDCCH which is simultaneously reported to a plurality of terminals for transmitting control information for data allocation common to terminals (e.g., dynamic broadcast channel (D-BCH), paging channel (PCH) and RACH response or the like) (hereinafter, referred to as “allocation control information for a common channel”).",
"A C-SS includes six candidates targeted for blind decoding in total, namely, 4 candidates (=16 CCEs (=4 CCEs×4 candidates)) and 2 candidates (=16 CCEs (8 CCEs×2 candidates)) with respect to the CCE aggregation level, 4 and 8, respectively.",
"On the other hand, a UE-SS is a search space specific to each terminal and is randomly configured for each terminal.",
"For example, a UE-SS in each terminal is configured using a terminal ID of each terminal and a hash function which is a function for randomization.",
"The number of CCEs that forms this UE-SS is defined based on the CCE aggregation level of a PDCCH.",
"For example, the number of CCEs forming search spaces is 6, 12, 8, and 16 in association with CCE aggregation levels of PDCCHs 1, 2, 4, and 8 respectively.",
"That is, the number of blind decoding region candidates is 6 (6 CCEs (=1 CCE×6 candidates)), 6 (12 CCEs (=2 CCEs×6 candidates)), 2 (8 CCEs (4 CCEs×2 candidates)), and 2 (16 CCEs (=8 CCEs×2 candidates)) in association with CCE aggregation levels of PDCCHs 1, 2, 4, and 8 respectively.",
"That is, blind decoding region candidates are limited to 16 candidates in total.",
"For example, a UE-SS is allocated with a PDCCH for transmitting uplink scheduling information and downlink scheduling information directed to the target terminal.",
"Thus, each terminal needs only to perform blind decoding on only a group of blind decoding region candidates in search spaces (C-SS and UE-SS) allocated to the terminal in each subframe, allowing the number of blind decoding operations to be reduced.",
"Here, a C-SS and a UE-SS may be configured so as to overlap each other, or UE-SSs may also be configured so as to overlap each other.",
"However, when UE-SSs for a plurality of terminals overlap each other, a case may be assumed where the base station cannot allocate CCEs to a PDCCH directed to a specific terminal.",
"Thus, the probability that the base station is not allowed to allocate CCEs to a PDCCH is referred to as “blocking probability.” For example, a case will be described where 32 CCEs of CCE0 to CCE31 (CCE numbers 0 to 31) are defined.",
"In this case, the base station sequentially allocates CCEs to a PDCCH for each terminal.",
"Here, suppose, for example, CCE2 to CCE9, and CCE13 to CCE19 have already been allocated to a PDCCH.",
"In this case, when a UE-SS corresponding to the next PDCCH (CCE aggregation level=1) is configured of CCE4 to CCE9, the base station cannot allocate CCEs to this PDCCH because CCE4 to CCE9 (all CCEs in the UE-SS) are already allocated to the other PDCCH.",
"Furthermore, suppose, in another example, CCE0, CCE1, CCE6 to CCE9 and CCE13 to CCE19 are already allocated to a PDCCH.",
"In this case, when a UE-SS corresponding to the next PDCCH (CCE aggregation level=4) is configured of CCE0 to CCE7, the base station cannot allocate CCEs to this PDCCH (CCE aggregation level=4).",
"This is because the CCE aggregation level is based on a tree-based structure, and so the base station can allocate only 4 CCEs of CCE0 to CCE3 or 4 CCEs of CCE4 to CCE7 to this PDCCH (CCE aggregation level=4).",
"That is, CCE0 and CCE1 among 4 CCEs of CCE0 to CCE3 are already allocated to the other PDCCH, and CCE6 and CCE7 among 4 CCEs of CCE4 to CCE7 are already allocated to the other PDCCH.",
"Thus, when the base station fails to allocate CCEs to the PDCCH for the terminal, the base station changes the CCE aggregation level and allocates a plurality of consecutive CCEs to the PDCCH for the terminal based on the changed CCE aggregation level.",
"For example, as in the case of the aforementioned example, suppose CCE2 to CCE9, and CCE13 to CCE19 are already allocated.",
"In this case, when a UE-SS corresponding to the next PDCCH (CCE aggregation level=1) is CCE4 to CCE9, CCEs cannot be allocated to this PDCCH as described above.",
"In this case, the base station changes the CCE aggregation level from 1 to 2.This causes the UE-SS corresponding to the PDCCH (CCE aggregation level=2) to be changed from CCE4 to CCE9 (6 CCEs) to CCE8 to CCE19 (12 CCEs).",
"As a result, the base station can allocate CCE10 and CCE11 to this PDCCH (CCE aggregation level=2).",
"Even when the CCE aggregation level is changed in this way, if CCEs cannot yet be allocated to the PDCCH, the base station attempts transmission or the like in the next subframe.",
"Furthermore, downlink control information transmitted from the base station is called “DCI” as described above, and contains information on resource allocated to the terminal by the base station (resource allocation information), and modulation and channel coding scheme (MCS).",
"The DCI has a plurality of formats.",
"That is, examples thereof include an uplink format, downlink multiple input multiple output (MIMO) transmission format, and downlink non-consecutive band allocation format.",
"The terminal needs to receive both downlink allocation control information (downlink-related allocation control information) and uplink allocation control information (uplink-related allocation control information).",
"For example, for the downlink control information (DCI), formats of a plurality of sizes are defined depending on a method for controlling a transmission antenna of a base station and a method for allocating a resource.",
"Among the formats, a downlink allocation control information format for consecutive band allocation (hereinafter, simply referred to as “downlink allocation control information”) and an uplink allocation control information format for consecutive band allocation (hereinafter, simply referred to as “uplink allocation control information”) have the same size.",
"These formats (i.e., DCI formats) include type information (for example, a one-bit flag) indicating the type of allocation control information (downlink allocation control information or uplink allocation control information).",
"Thus, even if DCI indicating downlink allocation control information and DCI indicating uplink allocation control information have the same size, a terminal can determine whether specific DCI indicates downlink allocation control information or uplink allocation control information by checking type information included in allocation control information.",
"For example, the DCI format in which uplink allocation control information for consecutive band allocation is transmitted is referred to as “DCI format 0” (hereinafter, referred to as “DCI 0”), and the DCI format in which downlink allocation control information for consecutive band allocation is transmitted is referred to as “DCI format 1A” (hereinafter, referred to as “DCI 1A”).",
"DCI 0 and DCI 1A are of the same size and distinguishable from each other by referring to type information as described above.",
"Hereinafter, DCI 0 and DCI 1A will be collectively referred to as DCI 0/1A.",
"In addition to these DCI formats, there are other formats for downlink, such as DCI format used for common channel allocation (DCI format 1C: hereinafter, referred to as “DCI 1C”), DCI format used for non-consecutive band allocation on a downlink (DCI format 1: hereinafter, referred to as “DCI 1”) and DCI format used for allocating spatial multiplexing MIMO transmission (DCI formats 2, 2A, 2B and 2C: hereinafter, referred to as “DCI 2, 2A, 2B and 2C”).",
"Furthermore, there are also other DCI formats, such as DCI formats 1B and 1D (hereinafter, referred to as “DCI 1B and 1D”).",
"Here, DCI 1, 1B, 1D, 2, 2A, 2B and 2C are formats used depending on the downlink transmission mode of the terminal (format of specific DCI).",
"That is, DCI 1, 1B, 1D, 2, 2A, 2B and 2C are formats configured for each terminal.",
"On the other hand, DCI 0/1A is a format independent of the transmission mode and available to a terminal in any transmission mode.",
"That is, DCI 0/1A is a format commonly used for all the terminals (common DCI format).",
"If DCI 0/1A is used, single-antenna transmission or a transmission diversity scheme is used as a default transmission mode.",
"In the above description, specific DCI formats (DCI 2, 2A, 2B and 2C) in which spatial multiplexing MIMO transmission corresponding to a plurality of layers may also be generically called “DCI family 2.” Furthermore, specific DCI formats (DCI 1, 1B and 1D) corresponding to a single layer may also be generically called “DCI family 1.” A correlation between a DCI format and a transmission mode is defined (e.g., see Table 7-1-5 of NPL-4).",
"Here, DCI 1A used for common channel allocation and DCI 0/1A used for terminal-specific data allocation have the same size, and terminal IDs are used to distinguish between DCI 1A and DCI 0/1A.",
"To be more specific, the base station applies CRC masking to DCI 1A used for common channel allocation so as to be distinguishable with a terminal ID common to all the terminals.",
"Furthermore, the base station applies CRC masking to DCI 0/1A used for terminal-specific data allocation so as to be distinguishable with a terminal ID assigned in a terminal-specific manner.",
"Therefore, the base station can transmit DCI 0/1A used for terminal-specific data allocation also using a C-SS without increasing the number of blind decoding operations of the terminal.",
"Also, the standardization of 3GPP LTE-Advanced (hereinafter, referred to as “LTE-A”), which provides a data transfer rate higher than that of LTE, has been started.",
"In LTE-A, a downlink transfer rate of maximum 1 Gbps or higher and an uplink transfer rate of maximum 500 Mbps or higher are achieved.",
"Therefore, a base station and a terminal capable of communicating at a wideband frequency of 40 MHz or higher (hereinafter, referred to as “LTE-A terminal”) will be introduced.",
"An LTE-A system is also required to support a terminal designed for an LTE system (hereinafter, referred to as “LTE terminal”) in addition to an LTE-A terminal.",
"In LTE-A, a transmission method using non-consecutive band allocation and a transmission method using MIMO will be introduced as new uplink transmission methods.",
"Accordingly, the definitions of new DCI formats (e.g., DCI formats 0A, 0B and 4: hereinafter, referred to as DCI 0A, 0B and 4)) are being studied (e.g., see NPL-4 and NPL-5).",
"In other words, DCI 0A, 0B and 4 are DCI formats dependent on an uplink transmission mode.",
"As described above, in LTE-A, if a DCI format dependent on a downlink transmission mode (one of DCI 1, 1B, 1D, 2, 2A, 2B and 2C), a DCI format dependent on an uplink transmission mode (one of DCI 0A, 0B and 4), and a DCI format independent of a transmission mode and common to all the terminals (DCI 0/1A) are used in a UE-SS, then the terminal performs blind decoding (monitoring) on PDCCHs of the abovementioned three DCI formats respectively.",
"For example, since 16 blind decoding operations (blind decoding region candidates: 16 candidates in total) in one DCI format need to be performed, 48 (=16×3) blind decoding operations in total are performed.",
"Furthermore, in LTE-A, if DCI 1C and DCI 1A which are common channel allocation formats are used in a C-SS, then the terminal performs blind decoding (monitoring) on PDCCHs of the abovementioned two DCI formats.",
"For example, since 6 blind decoding operations (blind decoding region candidates: 6 candidates in total) in one DCI format need to be performed in a C-SS, 12 (=6×2) blind decoding operations in total are performed.",
"Therefore, the terminal performs 60 (=48+12) blind decoding operations in total per subframe.",
"Additionally, in LTE-A, to achieve an increased coverage, the introduction of radio communication relay apparatus (hereinafter, referred to as “relay station”) has been specified.",
"Accordingly, the standardization of downlink control channels from base stations to relay stations (hereinafter, referred to as “R-PDCCH (Relay-Physical Downlink Control CHannel)”) is under way (e.g., see NPLs-6, 7, 8 and 9).",
"As a resource region to which an R-PDCCH is mapped (hereinafter, referred to as “R-PDCCH region”), a resource region to which downlink data is mapped (hereinafter, referred to as “PDSCH (Physical Downlink Shared CHannel) region”) is used.",
"At present, the following matters are being studied in relation to the R-PDCCH.",
"(1) A mapping start position in the time-domain of an R-PDCCH is fixed to a fourth OFDM symbol from a leading symbol of one subframe, and thus does not depend on the rate at which a PDCCH occupies OFDM symbols in the time-domain.",
"(2) As a mapping method in the frequency-domain of an R-PDCCH, two disposing methods, “localized” and “distributed” are supported.",
"(3) As reference signals for demodulation, Common Reference Signal (CRS) and Demodulation Reference Signal (DM-RS) are supported.",
"The base station notifies the relay station of which one of the reference signals is used.",
"(4) Each R-PDCCH is divided into slot 0 (slot 0 or first slot) and slot 1 (slot 1 or second slot) in one subframe in the time-domain.",
"(5) Each R-PDCCH occupies a resource configured of one or a plurality of consecutive Relay-Control Channel Elements (R-CCEs).",
"(6) A PDCCH notifying downlink resource allocation (hereinafter referred to as “DL grant”) is transmitted using slot 0 and a PDCCH notifying uplink resource allocation (hereinafter referred to as “UL grant”) is transmitted using slot 1.",
"(7) When a data signal (hereinafter, referred to as “PDSCH”) is indicated by an R-PDCCH, a PDSCH is transmitted using only slot 1 or both slot 0 and slot 1 (that is, data transmission using only slot 0 is not possible)."
],
[
"<SOH> SUMMARY OF INVENTION <EOH>"
],
[
"CROSS-REFERENCE TO RELATED APPLICATIONS This application is a continuation of U.S. patent application Ser.",
"No.",
"14/955,964 filed on Dec. 1, 2015, which is a continuation of U.S. patent application Ser.",
"No.",
"14/698,014 filed on Apr.",
"28, 2015, which is a continuation of U.S. patent application Ser.",
"No.",
"13/811,031, filed on Jan. 18, 2013, which was the National Stage of International Application No.",
"PCT/JP2011/003899, filed on Jul.",
"7, 2011, the contents of each of which are herein incorporated by reference in their entirety.",
"U.S. patent application Ser.",
"No.",
"14/698,014 issued as U.S. Pat.",
"No.",
"9,237,571 on Jan. 12, 2016.U.S.",
"patent application Ser.",
"No.",
"13/811,031 issued as U.S. Pat.",
"No.",
"9,049,709 on Jun.",
"2, 2015.TECHNICAL FIELD The present invention relates to a base station apparatus, a terminal apparatus, a transmission method and a reception method.",
"BACKGROUND ART In 3rd Generation Partnership Project Radio Access Network Long Term Evolution (3GPP-LTE (hereinafter, referred to as LTE)), Orthogonal Frequency Division Multiple Access (OFDMA) is adopted as a downlink communication scheme, and Single Carrier Frequency Division Multiple Access (SC-FDMA) is adopted as an uplink communication scheme (e.g., see NPL-1, NPL-2, and NPL-3).",
"In LTE, a base station apparatus for radio communications (hereinafter, abbreviated as “base station”) performs communications by allocating a resource block (RB) in a system band to a terminal apparatus for radio communications (hereinafter, abbreviated as “terminal”) for every time unit called “subframe.” The base station also transmits allocation control information (i.e., L1/L2 control information) for the notification of the result of resource allocation of downlink data and uplink data to the terminal.",
"As this allocation control information, Downlink Control Information (DCI) which is downlink allocation control information is transmitted.",
"There are two types of DCI (which will be described later); common DCI targeting all terminals and specific DCI targeting a specific terminal (specific terminal or terminal in a specific group).",
"Furthermore, control information such as DCI is transmitted to a terminal using a downlink control channel such as a Physical Downlink Control Channel (PDCCH).",
"Here, the base station controls the resource amount, that is, the number of OFDM symbols, used for transmission of a PDCCH in subframe units according to the number of terminals allocated or the like.",
"To be more specific, the resource amount used for transmission of a PDCCH is set variably over the entire system band in the frequency-domain, and three OFDM symbols from a leading OFDM symbol to a third OFDM symbol of one subframe in the time-domain.",
"The base station reports to the terminal, a Control Format Indicator (CFI) which is information indicating the number of OFDM symbols available for transmission of a PDCCH with the leading OFDM symbol of each subframe using a Physical Control Format Indicator Channel (PCFICH).",
"The terminal receives DCI according to the CFI detected from the received PCFICH.",
"Furthermore, the base station transmits a HARQ Indicator (HI) indicating delivery acknowledgment information (ACK/NACK) for uplink data to the terminal using a Physical Hybrid ARQ Indicator CHannel (PHICH) (e.g., see NPL-1).",
"In LTE a frequency band having a system bandwidth of up to 20 MHz is supported.",
"Each PDCCH also occupies a resource composed of one or more consecutive control channel elements (CCEs).",
"A CCE is a minimum unit of radio resource allocated to a PDCCH.",
"Furthermore, a CCE is made up of a plurality of consecutive resource element groups (REGs) composed of resource elements (REs).",
"For example, one REG is made up of four REs.",
"To be more specific, a CCE is made up of a plurality of consecutive REGs (e.g., nine consecutive REGs) among REGs not allocated as radio resources for the aforementioned PCFICH and PHICH.",
"Furthermore, the base station may also perform interleaving processing in REG units with resources for a PDCCH for each terminal in order to randomize interference.",
"In LTE, the number of CCEs occupied by a PDCCH (the number of concatenated CCEs: CCE aggregation level) is selected from 1, 2, 4, and 8 depending on the number of information bits of allocation control information or the condition of a propagation path of a terminal.",
"At this time, allocatable CCEs are predetermined for each CCE aggregation level (e.g., see PTL 1).",
"For example, when the CCE aggregation level is n (e.g., n=1, 2, 4, 8), the base station can allocate to a PDCCH for the terminal, only n consecutive CCEs starting from a CCE with a CCE index (CCE number) corresponding to a multiple of n. On the other hand, since the terminal cannot know which CCE is allocated to a PDCCH for the terminal and what the CCE aggregation level is, the terminal has to try decoding (blind decoding) on a PDCCH for all CCEs which may be allocated to the PDCCH for the terminal using a round-robin method.",
"For this reason, as described above, it is possible to reduce the number of trials of PDCCH decoding at the terminal by providing constraints (tree-based structure) of CCEs allocatable to the PDCCH.",
"Furthermore, if a base station allocates a plurality of terminals to one subframe, the base station transmits a plurality of items of DCI via a plurality of PDCCHs at a time.",
"In this case, in order to identify a terminal to which each PDCCH is transmitted, the base station transmits the PDCCH with CRC bits included therein, the bits being masked (or scrambled) with a terminal ID of the transmission destination terminal.",
"Then, the terminal performs demasking (or descrambling) on the CRC bits of a plurality of PDCCHs for the terminal with its own ID, thereby trial-decoding (hereinafter, referred to as “blind-decoding”) the DCI to detect the DCI for the terminal.",
"Also, for the purpose of reducing the number of DCI blind decoding operations on a terminal, a method for limiting CCEs targeted for blind decoding for each terminal is under study.",
"This method limits a CCE region that may be targeted for blind decoding by each terminal (hereinafter, referred to as “search space (SS)”).",
"There are two types of search space; common search space (hereinafter, referred to as “C-SS”) and terminal (UE) specific search space (or UE specific by C-RNTI Search Space: hereinafter, referred to as “UE-SS”).",
"The terminal performs blind decoding on DCI in a C-SS and DCI in a UE-SS corresponding to the terminal.",
"A C-SS is a search space common to all the terminals, indicating a range of CCEs in which all the terminals perform blind decoding on DCI.",
"A C-SS is allocated with a PDCCH which is simultaneously reported to a plurality of terminals for transmitting control information for data allocation common to terminals (e.g., dynamic broadcast channel (D-BCH), paging channel (PCH) and RACH response or the like) (hereinafter, referred to as “allocation control information for a common channel”).",
"A C-SS includes six candidates targeted for blind decoding in total, namely, 4 candidates (=16 CCEs (=4 CCEs×4 candidates)) and 2 candidates (=16 CCEs (8 CCEs×2 candidates)) with respect to the CCE aggregation level, 4 and 8, respectively.",
"On the other hand, a UE-SS is a search space specific to each terminal and is randomly configured for each terminal.",
"For example, a UE-SS in each terminal is configured using a terminal ID of each terminal and a hash function which is a function for randomization.",
"The number of CCEs that forms this UE-SS is defined based on the CCE aggregation level of a PDCCH.",
"For example, the number of CCEs forming search spaces is 6, 12, 8, and 16 in association with CCE aggregation levels of PDCCHs 1, 2, 4, and 8 respectively.",
"That is, the number of blind decoding region candidates is 6 (6 CCEs (=1 CCE×6 candidates)), 6 (12 CCEs (=2 CCEs×6 candidates)), 2 (8 CCEs (4 CCEs×2 candidates)), and 2 (16 CCEs (=8 CCEs×2 candidates)) in association with CCE aggregation levels of PDCCHs 1, 2, 4, and 8 respectively.",
"That is, blind decoding region candidates are limited to 16 candidates in total.",
"For example, a UE-SS is allocated with a PDCCH for transmitting uplink scheduling information and downlink scheduling information directed to the target terminal.",
"Thus, each terminal needs only to perform blind decoding on only a group of blind decoding region candidates in search spaces (C-SS and UE-SS) allocated to the terminal in each subframe, allowing the number of blind decoding operations to be reduced.",
"Here, a C-SS and a UE-SS may be configured so as to overlap each other, or UE-SSs may also be configured so as to overlap each other.",
"However, when UE-SSs for a plurality of terminals overlap each other, a case may be assumed where the base station cannot allocate CCEs to a PDCCH directed to a specific terminal.",
"Thus, the probability that the base station is not allowed to allocate CCEs to a PDCCH is referred to as “blocking probability.” For example, a case will be described where 32 CCEs of CCE0 to CCE31 (CCE numbers 0 to 31) are defined.",
"In this case, the base station sequentially allocates CCEs to a PDCCH for each terminal.",
"Here, suppose, for example, CCE2 to CCE9, and CCE13 to CCE19 have already been allocated to a PDCCH.",
"In this case, when a UE-SS corresponding to the next PDCCH (CCE aggregation level=1) is configured of CCE4 to CCE9, the base station cannot allocate CCEs to this PDCCH because CCE4 to CCE9 (all CCEs in the UE-SS) are already allocated to the other PDCCH.",
"Furthermore, suppose, in another example, CCE0, CCE1, CCE6 to CCE9 and CCE13 to CCE19 are already allocated to a PDCCH.",
"In this case, when a UE-SS corresponding to the next PDCCH (CCE aggregation level=4) is configured of CCE0 to CCE7, the base station cannot allocate CCEs to this PDCCH (CCE aggregation level=4).",
"This is because the CCE aggregation level is based on a tree-based structure, and so the base station can allocate only 4 CCEs of CCE0 to CCE3 or 4 CCEs of CCE4 to CCE7 to this PDCCH (CCE aggregation level=4).",
"That is, CCE0 and CCE1 among 4 CCEs of CCE0 to CCE3 are already allocated to the other PDCCH, and CCE6 and CCE7 among 4 CCEs of CCE4 to CCE7 are already allocated to the other PDCCH.",
"Thus, when the base station fails to allocate CCEs to the PDCCH for the terminal, the base station changes the CCE aggregation level and allocates a plurality of consecutive CCEs to the PDCCH for the terminal based on the changed CCE aggregation level.",
"For example, as in the case of the aforementioned example, suppose CCE2 to CCE9, and CCE13 to CCE19 are already allocated.",
"In this case, when a UE-SS corresponding to the next PDCCH (CCE aggregation level=1) is CCE4 to CCE9, CCEs cannot be allocated to this PDCCH as described above.",
"In this case, the base station changes the CCE aggregation level from 1 to 2.This causes the UE-SS corresponding to the PDCCH (CCE aggregation level=2) to be changed from CCE4 to CCE9 (6 CCEs) to CCE8 to CCE19 (12 CCEs).",
"As a result, the base station can allocate CCE10 and CCE11 to this PDCCH (CCE aggregation level=2).",
"Even when the CCE aggregation level is changed in this way, if CCEs cannot yet be allocated to the PDCCH, the base station attempts transmission or the like in the next subframe.",
"Furthermore, downlink control information transmitted from the base station is called “DCI” as described above, and contains information on resource allocated to the terminal by the base station (resource allocation information), and modulation and channel coding scheme (MCS).",
"The DCI has a plurality of formats.",
"That is, examples thereof include an uplink format, downlink multiple input multiple output (MIMO) transmission format, and downlink non-consecutive band allocation format.",
"The terminal needs to receive both downlink allocation control information (downlink-related allocation control information) and uplink allocation control information (uplink-related allocation control information).",
"For example, for the downlink control information (DCI), formats of a plurality of sizes are defined depending on a method for controlling a transmission antenna of a base station and a method for allocating a resource.",
"Among the formats, a downlink allocation control information format for consecutive band allocation (hereinafter, simply referred to as “downlink allocation control information”) and an uplink allocation control information format for consecutive band allocation (hereinafter, simply referred to as “uplink allocation control information”) have the same size.",
"These formats (i.e., DCI formats) include type information (for example, a one-bit flag) indicating the type of allocation control information (downlink allocation control information or uplink allocation control information).",
"Thus, even if DCI indicating downlink allocation control information and DCI indicating uplink allocation control information have the same size, a terminal can determine whether specific DCI indicates downlink allocation control information or uplink allocation control information by checking type information included in allocation control information.",
"For example, the DCI format in which uplink allocation control information for consecutive band allocation is transmitted is referred to as “DCI format 0” (hereinafter, referred to as “DCI 0”), and the DCI format in which downlink allocation control information for consecutive band allocation is transmitted is referred to as “DCI format 1A” (hereinafter, referred to as “DCI 1A”).",
"DCI 0 and DCI 1A are of the same size and distinguishable from each other by referring to type information as described above.",
"Hereinafter, DCI 0 and DCI 1A will be collectively referred to as DCI 0/1A.",
"In addition to these DCI formats, there are other formats for downlink, such as DCI format used for common channel allocation (DCI format 1C: hereinafter, referred to as “DCI 1C”), DCI format used for non-consecutive band allocation on a downlink (DCI format 1: hereinafter, referred to as “DCI 1”) and DCI format used for allocating spatial multiplexing MIMO transmission (DCI formats 2, 2A, 2B and 2C: hereinafter, referred to as “DCI 2, 2A, 2B and 2C”).",
"Furthermore, there are also other DCI formats, such as DCI formats 1B and 1D (hereinafter, referred to as “DCI 1B and 1D”).",
"Here, DCI 1, 1B, 1D, 2, 2A, 2B and 2C are formats used depending on the downlink transmission mode of the terminal (format of specific DCI).",
"That is, DCI 1, 1B, 1D, 2, 2A, 2B and 2C are formats configured for each terminal.",
"On the other hand, DCI 0/1A is a format independent of the transmission mode and available to a terminal in any transmission mode.",
"That is, DCI 0/1A is a format commonly used for all the terminals (common DCI format).",
"If DCI 0/1A is used, single-antenna transmission or a transmission diversity scheme is used as a default transmission mode.",
"In the above description, specific DCI formats (DCI 2, 2A, 2B and 2C) in which spatial multiplexing MIMO transmission corresponding to a plurality of layers may also be generically called “DCI family 2.” Furthermore, specific DCI formats (DCI 1, 1B and 1D) corresponding to a single layer may also be generically called “DCI family 1.” A correlation between a DCI format and a transmission mode is defined (e.g., see Table 7-1-5 of NPL-4).",
"Here, DCI 1A used for common channel allocation and DCI 0/1A used for terminal-specific data allocation have the same size, and terminal IDs are used to distinguish between DCI 1A and DCI 0/1A.",
"To be more specific, the base station applies CRC masking to DCI 1A used for common channel allocation so as to be distinguishable with a terminal ID common to all the terminals.",
"Furthermore, the base station applies CRC masking to DCI 0/1A used for terminal-specific data allocation so as to be distinguishable with a terminal ID assigned in a terminal-specific manner.",
"Therefore, the base station can transmit DCI 0/1A used for terminal-specific data allocation also using a C-SS without increasing the number of blind decoding operations of the terminal.",
"Also, the standardization of 3GPP LTE-Advanced (hereinafter, referred to as “LTE-A”), which provides a data transfer rate higher than that of LTE, has been started.",
"In LTE-A, a downlink transfer rate of maximum 1 Gbps or higher and an uplink transfer rate of maximum 500 Mbps or higher are achieved.",
"Therefore, a base station and a terminal capable of communicating at a wideband frequency of 40 MHz or higher (hereinafter, referred to as “LTE-A terminal”) will be introduced.",
"An LTE-A system is also required to support a terminal designed for an LTE system (hereinafter, referred to as “LTE terminal”) in addition to an LTE-A terminal.",
"In LTE-A, a transmission method using non-consecutive band allocation and a transmission method using MIMO will be introduced as new uplink transmission methods.",
"Accordingly, the definitions of new DCI formats (e.g., DCI formats 0A, 0B and 4: hereinafter, referred to as DCI 0A, 0B and 4)) are being studied (e.g., see NPL-4 and NPL-5).",
"In other words, DCI 0A, 0B and 4 are DCI formats dependent on an uplink transmission mode.",
"As described above, in LTE-A, if a DCI format dependent on a downlink transmission mode (one of DCI 1, 1B, 1D, 2, 2A, 2B and 2C), a DCI format dependent on an uplink transmission mode (one of DCI 0A, 0B and 4), and a DCI format independent of a transmission mode and common to all the terminals (DCI 0/1A) are used in a UE-SS, then the terminal performs blind decoding (monitoring) on PDCCHs of the abovementioned three DCI formats respectively.",
"For example, since 16 blind decoding operations (blind decoding region candidates: 16 candidates in total) in one DCI format need to be performed, 48 (=16×3) blind decoding operations in total are performed.",
"Furthermore, in LTE-A, if DCI 1C and DCI 1A which are common channel allocation formats are used in a C-SS, then the terminal performs blind decoding (monitoring) on PDCCHs of the abovementioned two DCI formats.",
"For example, since 6 blind decoding operations (blind decoding region candidates: 6 candidates in total) in one DCI format need to be performed in a C-SS, 12 (=6×2) blind decoding operations in total are performed.",
"Therefore, the terminal performs 60 (=48+12) blind decoding operations in total per subframe.",
"Additionally, in LTE-A, to achieve an increased coverage, the introduction of radio communication relay apparatus (hereinafter, referred to as “relay station”) has been specified.",
"Accordingly, the standardization of downlink control channels from base stations to relay stations (hereinafter, referred to as “R-PDCCH (Relay-Physical Downlink Control CHannel)”) is under way (e.g., see NPLs-6, 7, 8 and 9).",
"As a resource region to which an R-PDCCH is mapped (hereinafter, referred to as “R-PDCCH region”), a resource region to which downlink data is mapped (hereinafter, referred to as “PDSCH (Physical Downlink Shared CHannel) region”) is used.",
"At present, the following matters are being studied in relation to the R-PDCCH.",
"(1) A mapping start position in the time-domain of an R-PDCCH is fixed to a fourth OFDM symbol from a leading symbol of one subframe, and thus does not depend on the rate at which a PDCCH occupies OFDM symbols in the time-domain.",
"(2) As a mapping method in the frequency-domain of an R-PDCCH, two disposing methods, “localized” and “distributed” are supported.",
"(3) As reference signals for demodulation, Common Reference Signal (CRS) and Demodulation Reference Signal (DM-RS) are supported.",
"The base station notifies the relay station of which one of the reference signals is used.",
"(4) Each R-PDCCH is divided into slot 0 (slot 0 or first slot) and slot 1 (slot 1 or second slot) in one subframe in the time-domain.",
"(5) Each R-PDCCH occupies a resource configured of one or a plurality of consecutive Relay-Control Channel Elements (R-CCEs).",
"(6) A PDCCH notifying downlink resource allocation (hereinafter referred to as “DL grant”) is transmitted using slot 0 and a PDCCH notifying uplink resource allocation (hereinafter referred to as “UL grant”) is transmitted using slot 1.",
"(7) When a data signal (hereinafter, referred to as “PDSCH”) is indicated by an R-PDCCH, a PDSCH is transmitted using only slot 1 or both slot 0 and slot 1 (that is, data transmission using only slot 0 is not possible).",
"CITATION LIST Patent Literature PTL 1 Japanese Patent Application Laid-Open No.",
"2010-114780 Non-Patent Literature NPL 1 3GPP TS 36.211 V9.1.0, “Physical Channels and Modulation (Release 9),” March 2010 NPL 2 3GPP TS 36.212 V9.2.0, “Multiplexing and channel coding (Release 9),” June 2010 NPL 3 3GPP TS 36.213 V9.2.0, “Physical layer procedures (Release 9),” June 2010 NPL 4 3GPP TS 36.213 V10.0.1, “Physical layer procedures (Release 10),” December 2010 NPL 5 3GPP TSG RAN WG1 meeting, R1-092641, “PDCCH design for Carrier aggregation and Post Rel-8 feature,” June 2009 NPL 6 3GPP TSG RAN WG1 meeting, R1-102700, “Backhaul Control Channel Design in Downlink,” May 2010 NPL 7 3GPP TSG RAN WG1 meeting, R1-102881, “R-PDCCH placement,” May 2010 NPL 8 3GPP TSG RAN WG1 meeting, R1-103040, “R-PDCCH search space design” May 2010 NPL 9 3GPP TSG RAN WG1 meeting, R1-103062, “Supporting frequency diversity and frequency selective R-PDCCH transmissions” May 2010 SUMMARY OF INVENTION Technical Problem In the future, it is anticipated that various devices for machine to machine (M2M) communication or the like will be introduced as radio communication terminals or the number of terminals applying spatial multiplexing MIMO transmission to improve throughput will increase in response to an increase in the volume of content communicated, that is, the number of pieces of control information with the large amount of information will increase.",
"In consideration of these anticipations, there is concern that there may be a shortage of resources in a resource region to which a PDCCH is mapped (hereinafter, referred to as “PDCCH region”).",
"When a PDCCH cannot be mapped due to a shortage of resources, downlink data cannot be allocated to the terminal, and therefore even when there is free space in the resource region to which downlink data is mapped (hereinafter, referred to as “PDSCH region”), the free space cannot be used, and there is concern that the system throughput may deteriorate.",
"Thus, LTE-A is studying the possibility of mapping DCI for a terminal connected to a base station (the terminal under the control of the base station) to the aforementioned R-PDCCH region in addition to the PDCCH region.",
"When transmitting a PDCCH for a terminal also in the R-PDCCH region, a frequency division multiplexing (FDM) configuration (see FIG.",
"1A) and a time division multiplexing+frequency division multiplexing (TDM+FDM) configuration (see FIG.",
"1B) as shown in FIG.",
"1 are possible.",
"In the FDM configuration shown in FIG.",
"1A, signals in the R-PDCCH region are not multiplexed in the time-domain but multiplexed only in the frequency-domain.",
"On the other hand, in the TDM+FDM configuration shown in FIG.",
"1B, the R-PDCCH region is configured of two slots (called slot 0 and slot 1, or 1st slot and 2nd slot) in the time-domain.",
"Furthermore, in the TDM+FDM configuration, signals in the R-PDCCH region are multiplexed in both the time-domain and the frequency-domain.",
"However, simply adding an R-PDCCH region in addition to a PDCCH region as a region for transmitting DCI for a terminal connected to a base station may disadvantageously lead to an increase in the number of blind decoding operations to be performed by the terminal, resulting in increases in power consumption, processing delay of the terminal, and circuit scale.",
"For example, according to the above-described configuration of a search space, in one subframe, a search space is configured for each of a PDCCH region, an R-PDCCH region of slot 0 and an R-PDCCH region of slot 1.Thus, if the number of blind decoding operations to be performed by a terminal in each region is 60 as mentioned above, the terminal would repeat 180 blind decoding operations (=60×3 regions) in total for each subframe.",
"In other words, the number of blind decoding operations increases and the configuration of a terminal becomes complicated.",
"On the other hand, another possible approach of configuring the search space is allocation of a search space to each of a PDCCH region and an R-PDCCH region (slot 0 and slot 1) under the assumption that the total number of region candidates for blind decoding to be performed by a terminal in one subframe (i.e., the total number of blind decoding operations) is set to the number used in the related art as described (e.g., 60 operations).",
"However, in this case, the size of a search space in each of the PDCCH region, the R-PDCCH region of slot 0 and the R-PDCCH region of slot 1 is substantially reduced to ⅓, and thus the aforementioned blocking probability may increase.",
"For that reason, inefficient use of resources may cause a decrease in system throughput.",
"Furthermore, an environment in which various modes of cell such as a femto cell and pico cell in addition to a macro cell coexist (e.g., heterogeneous network (HetNet) environment made up of macro cell and pico cell/femto cell) is under study.",
"However, in an environment in which cells in various modes coexist, there is concern that interference in a PDCCH region of each cell may increase due to influences from other cells.",
"When, for example, a terminal connected to a macro cell (Non-closed Subscriber Group (Non-CSG) terminal) is located in proximity of a femto cell, the Non-CSG terminal receives large interference from the femto cell.",
"Alternatively, when a terminal connected to a pico cell is located near a cell edge of the pico cell (e.g., range expansion region), the terminal receives large interference from the macro cell.",
"For this reason, in the PDCCH region, PDCCH reception performance of each terminal deteriorates.",
"Thus, when a search space is allocated to each of a PDCCH region and an R-PDCCH region (slot 0 and slot 1), there are problems that system throughput and the PDCCH reception performance in each terminal deteriorates depending on the configuration of the search space in each region.",
"It is an object of the present invention to provide a base station, a terminal, a transmission method and a reception method that can prevent deterioration of system throughput and secure desired receiving quality in the terminal even when a PDCCH for the terminal connected to the base station is mapped to both a PDCCH region and an R-PDCCH region.",
"Solution to Problem A base station according to a first aspect of the present invention is a base station apparatus that can transmit control information using a first control channel using a common reference signal that can be received by all terminal apparatuses and a second control channel using the common reference signal or a specific reference signal for each terminal apparatus, and adopts a configuration including: a search space configuring section that configures a search space having a plurality of allocation candidates in a first resource region to which the first control channel is mapped and a second resource region to which the second control channel is mapped; and an allocating section that allocates the control information to a resource in one allocation candidate from among the plurality of allocation candidates in the search space, in which a ratio of a number of the allocation candidates in the second resource region to a number of the allocation candidates in the first resource region in the search space configured in the terminal apparatus using the specific reference signal in the second control channel is equal to or greater than a ratio of a number of the allocation candidates in the second resource region to a number of the allocation candidates in the first resource region in the search space configured in the terminal apparatus using the common reference signal in the second control channel.",
"A terminal according to a second aspect of the present invention adopts a configuration including: a first receiving section that blind-decodes a search space having a plurality of allocation candidates configured in a first resource region to which a first control channel using a common reference signal that is receivable by all terminal apparatuses is mapped and a second resource region to which a second control channel using the common reference signal or a specific reference signal for each terminal apparatus is mapped and obtains control information transmitted using the first control channel or the second control channel; and a second receiving section that receives a downlink data signal based on the control information for the terminal apparatus allocated to one of the plurality of allocation candidates, in which a ratio of a number of the allocation candidates in the second resource region to a number of the allocation candidates in the first resource region in the search space configured in the terminal apparatus using the specific reference signal in the second control channel is equal to or greater than a ratio of a number of the allocation candidates in the second resource region to a number of the allocation candidates in the first resource region in the search space configured in the terminal apparatus using the common reference signal in the second control channel.",
"A transmission method according to a third aspect of the present invention is a transmission method performed by a base station apparatus that transmits control information using a first control channel using a common reference signal that is receivable by all terminal apparatuses and a second control channel using the common reference signal or a specific reference signal for each terminal apparatus, the transmission method including: configuring a search space having a plurality of allocation candidates, in a first resource region to which the first control channel is mapped and a second resource region to which the second control channel is mapped; and allocating the control information to a resource in one allocation candidate from among the plurality of allocation candidates in the search space, in which a ratio of a number of the allocation candidates in the second resource region to a number of the allocation candidates in the first resource region in the search space configured in the terminal apparatus using the specific reference signal in the second control channel is equal to or greater than a ratio of a number of the allocation candidates in the second resource region to a number of the allocation candidates in the first resource region in the search space configured in the terminal apparatus using the common reference signal in the second control channel.",
"A reception method according to a fourth aspect of the present invention is a reception method that adopts a configuration including: blind-decoding a search space having a plurality of allocation candidates configured in a first resource region to which a first control channel using a common reference signal that is receivable by all terminal apparatuses is mapped and a second resource region to which a second control channel using the common reference signal or a specific reference signal for each terminal apparatus is mapped and obtaining control information transmitted using the first control channel or the second control channel; and receiving a downlink data signal based on the control information for the terminal apparatus allocated to one of the plurality of allocation candidates, in which a ratio of a number of the allocation candidates in the second resource region to a number of the allocation candidates in the first resource region in the search space configured in the terminal apparatus using the specific reference signal in the second control channel is equal to or greater than a ratio of a number of the allocation candidates in the second resource region to a number of the allocation candidates in the first resource region in the search space configured in the terminal apparatus using the common reference signal in the second control channel.",
"Advantageous Effects of Invention According to the present invention, even when a PDCCH for a terminal connected to a base station is mapped to both a PDCCH region and an R-PDCCH region, desired receiving quality can be secured in the terminal without causing deterioration of system throughput.",
"BRIEF DESCRIPTION OF DRAWINGS FIGS.",
"1A and 1B illustrate examples of multiplexed configuration of R-PDCCH regions; FIG.",
"2 is a diagram illustrating downlink resources according to Embodiment 1 of the present invention; FIG.",
"3 is a diagram for explaining features of a reference signal according to Embodiment 1 of the present invention; FIG.",
"4 is a principal block diagram of a base station according to Embodiment 1 of the present invention; FIG.",
"5 is a principal block diagram of a terminal according to Embodiment 1 of the present invention; FIG.",
"6 is a block diagram illustrating the configuration of the base station according to Embodiment 1 of the present invention; FIG.",
"7 is a diagram illustrating search spaces configured in the terminal according to Embodiment 1 of the present invention; FIG.",
"8 is a block diagram illustrating the configuration of the terminal according to Embodiment 1 of the present invention; FIG.",
"9A is a diagram illustrating an example of search space configuration in a PDCCH region according to Embodiment 1 of the present invention; FIG.",
"9B is a diagram illustrating an example of search space configuration in an R-PDCCH region according to Embodiment 1 of the present invention; FIG.",
"10 is a diagram illustrating the number of DCI allocation region candidates (number of blind decoding region candidates) in a PDCCH region and an R-PDCCH region according to Embodiment 1 of the present invention; FIG.",
"11 is a diagram illustrating an example of search space configuration according to Embodiment 2 of the present invention (configuration method 1); FIG.",
"12A is a diagram illustrating an example of search space configuration in a PDCCH region according to Embodiment 3 of the present invention; FIG.",
"12B is a diagram illustrating an example of search space configuration in an R-PDCCH region according to Embodiment 3 of the present invention; FIG.",
"13 is a diagram illustrating search space patterns according to Embodiment 3 of the present invention; FIG.",
"14 is a block diagram illustrating an internal configuration of a search space configuration section according to Embodiment 5 of the present invention; FIG.",
"15 is a diagram illustrating features of a reference signal arranged in each transmission region according to Embodiment 5 of the present invention; FIG.",
"16 is a diagram illustrating features of a downlink DCI format according to Embodiment 5 of the present invention; FIG.",
"17A is a diagram illustrating an example of search space configuration in a PDCCH region according to Embodiment 6 of the present invention; FIG.",
"17B is a diagram illustrating an example of search space configuration in an R-PDCCH region according to Embodiment 6 of the present invention; FIG.",
"18 is a diagram illustrating an example of search space configuration according to a variation of Embodiment 6 of the present invention; FIG.",
"19 is a block diagram illustrating an internal configuration of a search space configuration section according to Embodiment 7 of the present invention; FIG.",
"20 is a diagram illustrating an example of search space configuration according to Embodiment 7 of the present invention; FIG.",
"21 is a diagram illustrating a data allocation example in each transmission region according to Embodiment 7 of the present invention; and FIG.",
"22 is a diagram illustrating search space patterns according to the present invention.",
"DESCRIPTION OF EMBODIMENTS Embodiments of the present invention will be described in detail with reference to the accompanying drawings.",
"In the embodiments, the same reference numerals are used for denoting the same components, and a redundant description thereof is omitted.",
"The following matters are assumed as premises in the description below.",
"That is, as for a region for which DCI for a terminal connected to a base station according to the present invention is transmitted (PDCCH transmission region), a case will be described as an example where only a PDCCH region shown on the left side of FIG.",
"2 is used and where both a PDCCH region and an R-PDCCH region shown on the left side of FIG.",
"2 are used.",
"Furthermore, as shown on the left side of FIG.",
"2, when a TDM+FDM configuration is applied in the R-PDCCH region, the R-PDCCH region is divided into slot 0 and slot 1 within one subframe in the time-domain.",
"Furthermore, in the PDCCH region, as shown on the right side of FIG.",
"2, a CRS is used as a reference signal (RS) for demodulation.",
"In contrast, in the R-PDCCH region as shown on the right side of FIG.",
"2, a CRS or DM-RS is used as a reference signal (RS) for demodulation.",
"That is, in the PDCCH region and R-PDCCH region, there are two combinations of reference signals used for DCI demodulation by a terminal under the control of the base station; (1) CRS (PDCCH region)+CRS (R-PDCCH region) and (2) CRS (PDCCH region)+DM-RS (R-PDCCH region).",
"Here, features of CRS and DM-RS are shown in FIG.",
"3.When a reference signal to be used is a CRS, the CRS itself and control information demodulated using the CRS are not precoded (weighted on the transmitting side) (no precoding).",
"That is, a CRS is an RS common to all the terminals, which is a reference signal that can be received by all the terminals.",
"Furthermore, a CRS is disposed distributed over the entire frequency-domain (that is, a CRS is disposed over the entire frequency-domain), and so there is no constraint on the disposition of control information demodulated using the CRS in the frequency-domain, and therefore the control information can also be disposed distributed over the entire system bandwidth (distributed disposition) and it is possible to obtain a frequency diversity effect with respect to the control information.",
"Therefore, use of CRS is effective in reducing influences of a variation in the received signal level in the frequency-domain caused by the terminal moving at a high speed.",
"On the other hand, when a reference signal used is a DM-RS, the DM-RS itself and control information demodulated using the DM-RS is subjected to precoding (weighting on the transmitting side) optimized for a certain terminal.",
"For this reason, it is difficult for all the terminals to receive a DM-RS while securing desired receiving quality.",
"That is, a DM-RS is a specific RS for each terminal.",
"Furthermore, since a DM-RS is subjected to precoding optimized for a specific terminal in the frequency-domain, its disposition in the frequency-domain is a concentrated disposition (localized disposition) on a certain frequency band.",
"This makes it possible to improve received signal power of control information for a specific terminal.",
"Therefore, use of a DM-RS is effective for a terminal located at a cell edge or the like (terminal whose received signal level is low).",
"In FIG.",
"3, it is assumed that a CRS is disposed distributed over the entire frequency-domain, but the CRS may be disposed only in part of the frequency-domain (that is, localized disposition).",
"Furthermore, the present invention is not limited to the use of CRS and DM-RS.",
"That is, not only a CRS and DM-RS but also any reference signal that satisfies one of the features of reference signals shown in FIG.",
"3 (presence or absence of precoding, target terminal (common or specific) and disposition in the frequency-domain (distributed disposition or localized disposition)) may be used instead of a CRS and DM-RS.",
"Embodiment 1 [Overview of Communication System] A communication system according to Embodiment 1 of the present invention includes base station 100 and terminal 200.Base station 100 is an LTE-A base station, and terminal 200 is an LTE-A terminal.",
"In a communication system according to the present embodiment, allocation control information is transmitted from base station 100 to terminal 200 through a PDCCH using CRSs which is a common reference signal that can be received by all the terminals and an R-PDCCH using CRSs or DM-RS which is a specific reference signal for each terminal.",
"FIG.",
"4 illustrates principal components of base station 100 according to the present embodiment.",
"In base station 100 shown in FIG.",
"4, search space configuration section 103 configures search spaces having a plurality of DCI allocation region candidates in a PDCCH region and an R-PDCCH region, and allocating section 106 allocates allocation control information (that is, DCI) to resources in one DCI allocation region candidate among a plurality of DCI allocation region candidates in a search space (resource composed of one or a plurality of CCEs in a PDCCH region or resource composed of one or a plurality of R-CCEs in an R-PDCCH region).",
"FIG.",
"5 illustrates principal components of terminal 200 according to the present embodiment.",
"In terminal 200 shown in FIG.",
"5, PDCCH receiving section 207 blind-decodes a search space having a plurality of DCI allocation region candidates (that is, blind decoding region candidates in terminal 200) configured in a PDCCH region to which a PDCCH using CRSs that can be received by all the terminals is mapped and an R-PDCCH region to which an R-PDCCH using CRSs or DM-RS for each terminal is mapped, and obtains allocation control information (that is, DCI) transmitted using the PDCCH and R-PDCCH.",
"PDSCH receiving section 208 receives downlink data signals on the basis of the allocation control information for terminal 200 disposed in any one of the plurality of DCI allocation region candidates.",
"However, the ratio of the number of DCI allocation region candidates in the R-PDCCH region to the number of DCI allocation region candidates in the PDCCH region in a search space configured in terminal 200 using DM-RSs in the R-PDCCH region is equal to or greater than the number of DCI allocation region candidates in the R-PDCCH region to the number of DCI allocation region candidates in the PDCCH region in a search space configured in terminal 200 using CRSs in the R-PDCCH region.",
"[Configuration of Base Station 100] FIG.",
"6 is a block diagram illustrating the configuration of base station 100 according to Embodiment 1 of the claimed invention.",
"In base station 100 shown in FIG.",
"6, configuration section 101 configures a resource region for use in the transmission of DCI to terminal 200 (transmission region) and also configures each transmission mode for uplink and downlink for terminal 200.The configuration of a resource region and a transmission mode is performed for each terminal 200 to be configured.",
"Specifically, configuration section 101 includes transmission region configuration section 131 and transmission mode configuration section 132.Transmission region configuration section 131 configures whether or not to include an R-PDCCH region in addition to a PDCCH region for each terminal 200 as a region for use in the transmission of DCI (transmission region).",
"For example, when there is concern that the PDCCH region might become tight or when it is determined that interference in the PDCCH region is large, transmission region configuration section 131 configures the DCI transmission region so as to include the R-PDCCH region in addition to the PDCCH region.",
"Examples of the case where there is concern that the PDCCH region might become tight include a case where many terminals are connected to base station 100 and a case where there are many terminals 200 to which spatial multiplexing MIMO transmission adaptable to a plurality of layers is allocated.",
"That is, transmission region configuration section 131 determines whether blind decoding is performed, for each terminal, on only a PDCCH region or on both a PDCCH region and an R-PDCCH region (or only on an R-PDCCH region).",
"Furthermore, transmission region configuration section 131 configures a reference signal for use in each transmission region.",
"To be more specific, transmission region configuration section 131 configures a CRS as a reference signal for use in a PDCCH region.",
"Furthermore, when the DCI transmission region is configured to also include an R-PDCCH region, transmission region configuration section 131 configures one of a CRS and DM-RS as a reference signal for use in the R-PDCCH region.",
"For example, when it is determined that terminal 200 is located at a cell edge covered by base station 100 and the intensity of the received signal (received signal level) needs to be improved, transmission region configuration section 131 configures a DM-RS as a reference signal for use in an R-PDCCH region to which a control signal (that is, DCI) for terminal 200 is mapped based on features of the DM-RS (see FIG.",
"3).",
"Alternatively, when it is determined that terminal 200 is moving fast, transmission region configuration section 131 configures a CRS as a reference signal for use in an R-PDCCH region to which a control signal for terminal 200 is mapped based on features of the CRS (see FIG.",
"3).",
"Furthermore, transmission mode configuration section 132 configures, based on a propagation path situation for each terminal 200 or the like, the DCI format and transmission mode (for example, spatial multiplexing MIMO transmission, beam forming transmission, and non-consecutive band allocation) of each of uplink and downlink for terminal 200.Configuration section 101 then outputs configuration information containing the information indicating the transmission region of DCI, information indicating a reference signal for use in the transmission region of DCI and information indicating the transmission mode configured in each terminal 200 to control section 102, search space configuration section 103, coding/modulation section 107 and transmission weight configuration section 108.These items of information contained in the configuration information are reported to each terminal 200 via coding/modulation section 107 as upper layer control information (referred to as “RRC control information” or “RRC signaling”).",
"Furthermore, since the reference signal for use in a PDCCH region is fixed to a CRS, configuration section 101 may output only information indicating a reference signal for use in an R-PDCCH region.",
"Alternatively, when a reference signal for use in an R-PDCCH region is fixed to one of CRS and DM-RS beforehand, configuration section 101 need not output information indicating a reference signal.",
"These items of information outputted from configuration section 101 may be simultaneously transmitted or transmitted at different timings.",
"Control section 102 generates allocation control information according to the configuration information inputted from configuration section 101.To be more specific, control section 102 generates allocation control information containing MCS information corresponding to one transport block transmitted, resource (RB) allocation information and a new data indicator (NDI) or the like.",
"As the resource allocation information, control section 102 generates uplink resource allocation information indicating an uplink resource (for example, a Physical Uplink Shared Channel (PUSCH)) to which uplink data from terminal 200 is allocated, or downlink resource allocation information indicating a downlink resource (for example, a Physical Downlink Shared Channel (PDSCH)) to which downlink data to terminal 200 is allocated.",
"Furthermore, on the basis of the configuration information received from configuration section 101, control section 102 generates allocation control information according to a DCI format based on a transmission mode of the uplink from terminal 200 (i.e., one of DCI 0A, 0B and 4), a DCI format based on a transmission mode of the downlink (one of DCI 1, 1B, 1D, 2, 2A, 2B and 2C) or a DCI format common to all the terminals (DCI 0/1A).",
"For example, during normal data transmission, control section 102 generates allocation control information in a format depending on the transmission mode for each terminal 200 (one of DCI 1, 1B, 1D, 2, 2A, 2B and 2C or one of DCI 0A, 0B and 4).",
"As a result, data can be transmitted at the transmission mode configured for each terminal 200, which improves throughput.",
"However, an abrupt change in the condition of a propagation path or a change in interference from an adjacent cell may cause frequent errors in receiving data in the transmission mode configured for each terminal 200.In this case, control section 102 generates allocation control information in the format (DCI 0/1A) common to all the terminals and transmits data in a robust default transmission mode.",
"As a result, robust data transmission is allowed even if a propagation environment is abruptly changed.",
"Also, when upper-layer control information (i.e., RRC signaling) is transmitted for the notification of a transmission mode change under deteriorated conditions of a propagation path, control section 102 generates allocation control information (i.e., DCI 0/1A) common to all the terminals and transmits the information using the default transmission mode.",
"The number of information bits of DCI 0/1A common to all the terminals is smaller than that of DCI 1, 1B, 1D, 2, 2A, 2B, 2C, 0A, 0B and 4 depending on a particular transmission mode.",
"For this reason, if the same number of CCEs is set, DCI 0/1A can allow transmission at a lower coding rate than that related to DCI 1, 1B, 1D, 2, 2A, 2B, 2C, 0A, 0B and 4.Thus, use of DCI 0/1A in control section 102 under a deteriorated condition of a propagation path enables terminal 200 having a poor condition of a propagation path to receive allocation control information (and data) with a low error rate.",
"Control section 102 also generates allocation control information for common channels (for example, DCI 1C and 1A) for the allocation of data common to a plurality of terminals, such as broadcasting and paging information, in addition to the allocation control information for the allocation of terminal-specific data.",
"Control section 102 outputs MCS information and an NDI to PDCCH generating section 104, uplink resource allocation information to PDCCH generating section 104 and extracting section 118, and downlink resource allocation information to PDCCH generating section 104 and multiplexing section 110, among the generated items of allocation control information for the allocation of terminal-specific data.",
"Control section 102 also outputs the generated allocation control information for a common channel to PDCCH generating section 104.Search space configuration section 103 configures a common search space (C-SS) and specific search space (UE-SS) on the basis of a transmission region of DCI and a reference signal used, indicated by the configuration information inputted from configuration section 101.The common search space (C-SS) is a search space common to all the terminals, and the specific search space (UE-SS) is a search space specific to each terminal as described above.",
"Specifically, search space configuration section 103 configures prepared CCEs (for example, CCEs from leading to 16th ones) as a C-S S. A CCE is a basic unit of the control information disposed.",
"Search space configuration section 103 also configures a UE-SS for each terminal.",
"For example, search space configuration section 103 determines a UE-SS for a certain terminal on the basis of the ID of the terminal, a CCE number obtained by calculations using a hash function for randomization, and the number of CCEs (L) that form a search space.",
"A UE-SS can be configured in each of the PDCCH region and R-PDCCH region.",
"FIG.",
"7 is a diagram illustrating an example of configuration of a C-SS and a UE-SS for a certain terminal.",
"In FIG.",
"7, with respect to CCE aggregation level 4 of a PDCCH, four DCI allocation region candidates (i.e., CCEs 0 to 3, CCEs 4 to 7, CCEs 8 to 11, and CCEs 12 to 15) are configured as a C-SS.",
"Also, with respect to CCE aggregation level 8 of the PDCCH, two DCI allocation region candidates (i.e., CCEs 0 to 7 and CCEs 8 to 15) are configured as another C-S S. In other words, in FIG.",
"7, the six DCI allocation region candidates in total are configured as the C-SSs.",
"Furthermore, in FIG.",
"7, with respect to CCE aggregation level 1, six DCI allocation region candidates (i.e., each of CCEs 16 to 21) are configured as a UE-SS.",
"With respect to CCE aggregation level 2, six DCI allocation region candidates (i.e., obtained by partitioning CCEs 6 to 17 into sets of 2) are configured as another UE-SS.",
"With respect to CCE aggregation level 4, two DCI allocation region candidates (i.e., CCEs 20 to 23 and CCEs 24 to 27) are configured as yet another UE-SS.",
"With respect to CCE aggregation level 8, two DCI allocation region candidates (i.e., CCEs 16 to 23 and CCEs 24 to 31) are configured as still another UE-SS.",
"In other words, in FIG.",
"7, 16 DCI allocation region candidates in total are configured as the UE-SSs.",
"Furthermore, when both a PDCCH region and an R-PDCCH region are configured as DCI transmission regions, search space configuration section 103 configures search spaces (C-SS and UE-SS) having the aforementioned plurality of DCI allocation region candidates in the PDCCH region and R-PDCCH region.",
"Details of the search space configuration processing of search space configuration section 103 will be described later.",
"Search space configuration section 103 outputs search space information indicating the configured C-SS and UE-SS of each terminal to allocating section 106 and coding/modulation section 107.Returning to FIG.",
"6, PDCCH generating section 104 generates DCI containing allocation control information for the allocation of terminal-specific data inputted from control section 102 (that is, uplink resource allocation information, downlink resource allocation information, MCS information and NDI or the like for each terminal, and uplink resource allocation information or downlink resource allocation information) or DCI containing allocation control information for a common channel (that is, broadcast information and paging information common to terminals or the like).",
"At this time, PDCCH generating section 104 adds CRC bits to the uplink allocation control information and the downlink allocation control information generated for each terminal and masks (or scrambles) the CRC bits with a terminal ID.",
"PDCCH generating section 104 then outputs the masked DCI to coding/modulation section 105.Coding/modulation section 105 modulates the DCI received from PDCCH generating section 104 after coding and outputs the modulated signals to allocating section 106.Coding/modulation section 105 determines a coding rate set on the basis of channel quality indicator (CQI) information reported from each terminal so as to achieve a sufficient reception quality in each terminal.",
"For example, as a distance between a terminal and a cell boundary decreases (i.e., as the channel quality of a terminal deteriorates), the coding rate to be set by coding/modulation section 105 decreases.",
"Allocating section 106 allocates, to each of CCEs or R-CCEs in a C-SS, or CCEs or R-CCEs in a UE-SS for each terminal, which are indicated by search space information inputted from search space configuration section 103, DCI containing allocation control information for a common channel and DCI containing allocation control information for the allocation of terminal-specific data to each terminal, which are inputted from coding/modulation section 105.For example, allocating section 106 selects one DCI allocation region candidate from a group of DCI allocation region candidates in a C-SS (for example, see FIG.",
"7).",
"Allocating section 108 then allocates DCI containing allocation control information for a common channel to a CCE (or an R-CCE; hereinafter, sometimes simply referred to as “CCE” without distinguishing “CCE” from “R-CCE”) in the selected DCI allocation region candidate.",
"In the case where a DCI format for the allocation target terminal is a DCI format dependent on a transmission mode (for example, DCI 1, 1B, 1D, 2, 2A, 2B, 2C, 0A, 0B and 4), allocating section 106 allocates a CCE in a UE-SS configured for the allocation target terminal to DCI.",
"On the other hand, in the case where a DCI format for the allocation target terminal is a format common to all the terminals (for example, DCI 0/1A), allocating section 106 allocates a CCE in a C-SS or a CCE in a UE-SS configured for the allocation target terminal to DCI.",
"The CCE aggregation level to be allocated to one DCI item depends on the coding rate and the number of DCI bits (namely, the amount of allocation control information).",
"For example, more physical resources are required for a coding rate set to be low of DCI for a terminal located around a cell boundary.",
"For this reason, allocating section 106 allocates more CCEs to DCI for a terminal located around a cell boundary.",
"Allocating section 106 then outputs information about the CCEs allocated to the DCI to multiplexing section 110 and ACK/NACK receiving section 121.Allocating section 106 outputs the coded/modulated DCI to multiplexing section 109.Coding/modulation section 107 modulates the configuration information inputted from configuration section 101 and search space information inputted from search space configuration section 103 (that is, upper-layer control information) after channel coding and outputs the modulated configuration information and search space information to multiplexing section 110.Transmission weight configuration section 108 configures a transmission weight (precoding weight) for a terminal using DM-RSs as reference signals for demodulation based on the configuration information inputted from configuration section 101 and outputs the configured transmission weight to multiplexing section 110.Coding/modulation section 109 modulates the input transmission data (downlink data) after channel coding and outputs the modulated transmission data signals to multiplexing section 110.Multiplexing section 110 multiplexes the coded/modulated DCI signal inputted from allocating section 106, the configuration information and search space information (that is, upper-layer control information) inputted from coding/modulation section 107, and the data signals (namely, PDSCH signals) inputted from coding/modulation section 109 in the time-domain and the frequency-domain.",
"Here, multiplexing section 110 multiplies DCI information and a PDSCH signal or the like in an R-PDCCH region for a terminal using DM-RSs as reference signals for demodulation, by a transmission weight inputted from transmission weight configuration section 108, and outputs the weighted signals to Inverse Fast Fourier Transform (IFFT) section 111 for each antenna.",
"Furthermore, multiplexing section 110 performs spatial frequency block coding (SFBC) processing on a signal for which no transmission weight is configured (DCI information in a PDCCH region or the like) and outputs the signal to Inverse Fast Fourier Transform (IFFT) section 111 for each antenna.",
"Furthermore, multiplexing section 110 maps the PDCCH signals and the data signals (PDSCH signals) on the basis of the downlink resource allocation information inputted from control section 102.Multiplexing section 110 may also map the configuration information and search space information onto the PDSCH.",
"IFFT sections 111-1 and 111-2, CP (Cyclic Prefix) adding sections 112-1 and 112-2 and RF transmitting sections 113-1 and 113-2 are provided for antennas 114-1 and 114-2 correspondingly.",
"IFFT sections 111-1 and 111-2 convert the multiplexed signals from multiplexing section 110 for each antenna into a time waveform and CP adding sections 112-1 and 112-2 add a CP to the time waveform to obtain OFDM signals.",
"Transmission RF sections 113-1 and 113-2 perform radio processing for transmission (for example, up-conversion or digital-analog (D/A) conversion) on the OFDM signals inputted from CP adding sections 112-1 and 112-2 and transmit the resultant received signals via antennas 114-1 and 114-2.On the other hand, RF receiving section 115 also performs radio processing for reception (for example, down-conversion or analog-digital (A/D) conversion) on radio signals received via antenna 114-1 at a receiving band and outputs the resultant received signals to CP removing section 116.CP removing section 116 removes the CP from the received signals and fast Fourier transform (FFT) section 117 converts the received signals from which the CP is removed into frequency-domain signals.",
"Extracting section 118 extracts uplink data from the frequency-domain signals received from FFT section 117 on the basis of uplink resource allocation information received from control section 102 and Inverse Discrete Fourier transform (IDFT) section 119 converts the extracted signals into time-domain signals and outputs the time-domain signals to data receiving section 120 and ACK/NACK receiving section 121.Data receiving section 120 decodes the time-domain signals inputted from IDFT section 119.Data receiving section 120 then outputs decoded uplink data as received data.",
"ACK/NACK receiving section 121 extracts, from the time-domain signals received from IDFT section 119, ACK/NACK signals from each terminal for the downlink data (PDSCH signals).",
"Specifically, ACK/NACK receiving section 121 extracts the ACK/NACK signals from an uplink control channel (e.g., a Physical Uplink Control Channel (PUCCH) on the basis of the information inputted from allocating section 106.The uplink control channel is associated with the CCEs used for the transmission of the downlink allocation control information corresponding to the downlink data.",
"ACK/NACK receiving section 121 then determines the ACK or NACK of the extracted ACK/NACK signals.",
"One reason that the CCEs and the PUCCH are associated with each other is to obviate the need for signaling sent by the base station to notify each terminal of a PUCCH for use in transmitting ACK/NACK signals from the terminal, which thereby allows downlink communication resources to be efficiently used.",
"Consequently, in accordance with the association between the CCEs and the PUCCH, each terminal determines a PUCCH for use in transmitting ACK/NACK signals on the basis of the CCEs to which downlink allocation control information (DCI) for the terminal is mapped.",
"[Configuration of Terminal 200] FIG.",
"8 is a block diagram illustrating the configuration of terminal 200 according to Embodiment 1 of the present invention.",
"Terminal 200 receives downlink data and transmits an ACK/NACK signal corresponding to the downlink data to base station 100 using a PUCCH which is an uplink control channel.",
"In terminal 200 shown in FIG.",
"8, RF receiving section 202 configures a reception band based on band information received from configuration information receiving section 206.RF reception section 202 performs radio processing for reception (e.g., down-conversion or analog-digital (A/D) conversion) on radio signals (i.e., OFDM signals in this case) received via antenna 201 at the reception band and outputs resultant received signals to CP removing section 203.The received signals may include a PDSCH signal, DCI, and upper-layer control information including configuration information and search space information.",
"The DCI (allocation control information) for terminal 200 is allocated to a common search space (C-SS) configured for terminal 200 and other terminals or to a specific search space (UE-SS) configured for terminal 200.CP removing section 203 removes a CP from the received signals and FFT section 204 converts the received signals from which the CP is removed into frequency-domain signals.",
"The frequency-domain signals are outputted to demultiplexing section 205.Demultiplexing section 205 outputs a component of signals received from FFT section 204 that may include DCI (i.e., signals extracted from a PDCCH region and an R-PDCCH region) to PDCCH receiving section 207.Demultiplexing section 205 also outputs upper-layer control signals (e.g., RRC signaling) including configuration information to configuration information receiving section 206 and data signals (i.e., PDSCH signals) to PDSCH receiving section 208.Configuration information receiving section 206 reads, from the upper-layer control signals inputted from demultiplexing section 205, band information configured for the terminal, information indicating a terminal ID configured for the terminal, search space information configured for the terminal, information indicating a reference signal configured for the terminal and information indicating a transmission mode configured for the terminal.",
"The band information configured for the terminal is outputted to PDCCH receiving section 207, RF receiving section 202 and RF transmitting section 215.The information indicating a terminal ID set for the terminal is outputted to PDCCH receiving section 207 as terminal ID information.",
"The search space information configured for the terminal is outputted to PDCCH receiving section 207 as search space region information.",
"The information indicating a reference signal set for the terminal is outputted to PDCCH receiving section 207 as reference signal information.",
"The information indicating a transmission mode configured for the terminal is outputted to PDCCH receiving section 207 as transmission mode information.",
"PDCCH receiving section 207 blind-decodes (monitors) the DCI inputted from demultiplexing section 205 to obtain DCI for the terminal.",
"PDCCH receiving section 207 performs blind-decoding for a DCI format for the allocation of data common to all the terminals (for example, DCI 0/1A), a DCI format dependent on the transmission mode configured for the terminal (for example, one of DCI 1, 1B, 1D, 2, 2A, 2B, 2C, 0A, 0B and 4), and a DCI format for the allocation of channels common to all the terminals (for example, DCI 1C and 1A).",
"This operation creates DCI containing allocation control information on the DCI formats.",
"To be more specific, PDCCH receiving section 207 blind-decodes a C-SS indicated by the search space region information inputted from configuration information receiving section 206 in a DCI format for the allocation of a common channel (DCI 1C and 1A) and in a DCI format (DCI 0/1A) for the allocation of data common to all the terminals.",
"That is, for each region candidate targeted for blind decoding in a C-SS (i.e., candidates of a CCE region allocated to terminal 200), PDCCH receiving section 207 demodulates and decodes the size of the DCI format for common channel allocation and the size of the DCI format for the allocation of data common to all the terminals.",
"For the decoded signals, PDCCH receiving section 207 demasks CRC bits with an ID common to a plurality of terminals.",
"PDCCH receiving section 207 then determines signals for which “CRC=OK” is found (i.e.",
"no error is found) as a result of the demasking to be DCI containing allocation control information for a common channel.",
"For the decoded signals, PDCCH receiving section 207 further demasks the CRC bits with the ID of the terminal indicated by the terminal ID information.",
"PDCCH receiving section 207 then determines signals for which “CRC=OK” is found (i.e.",
"no error is found) as a result of the demasking to be DCI containing allocation control information for the terminal.",
"In other words, PDCCH receiving section 207 determines, in a C-SS, whether allocation control information on DCI 0/1A is for a common channel or for the allocation of data to the terminal with a terminal ID (i.e., an ID common to a plurality of terminals or the ID of terminal 200).",
"PDCCH receiving section 207 calculates a UE-SS for the terminal for each CCE aggregation level with the terminal ID indicated by the terminal ID information inputted from configuration information receiving section 206.For each blind decoding region candidate (CCE candidate of each CCE aggregation level) in the obtained UE-SS, PDCCH receiving section 207 then demodulates and decodes the size of the DCI format corresponding to the transmission mode configured for the terminal (the transmission mode indicated by the transmission mode information) and the size of the DCI format common to all the terminals (DCI 0/1A).",
"For the decoded signals, PDCCH receiving section 207 demasks CRC bits with the ID of the terminal.",
"PDCCH receiving section 207 determines signals for which “CRC=OK” is found (i.e.",
"no error is found) as a result of demasking to be DCI for the terminal.",
"Even if the search space region indicated by the search space region information inputted from configuration information receiving section 206 includes an R-PDCCH region, PDCCH receiving section 207 blind-decodes (monitors) search spaces configured for the PDCCH region and R-PDCCH region and acquires DCI for the terminal transmitted using the PDCCH and R-PDCCH as in the case of the aforementioned PDCCH region.",
"If PDCCH receiving section 207 receives no search space region information (i.e., if base station 100 transmits no search space region information) from configuration information receiving section 206, PDCCH receiving section 207 may perform blind decoding in a transmission region of a plurality of items of DCI which may be directed to terminal 200 without considering the search spaces of terminal 200.Upon reception of downlink allocation control information, PDCCH receiving section 207 outputs downlink resource allocation information contained in the DCI for the terminal to PDSCH receiving section 208 and upon reception of uplink allocation control information, PDCCH receiving section 207 outputs uplink resource allocation information to mapping section 212.PDCCH receiving section 207 also outputs the CCE number for the CCE used for the transmission of the DCI for the terminal (i.e., CCE used for the transmission of the signals for which “CRC=OK” is found) to mapping section 212 (CCE number for the leading CCE if the CCE aggregation level is plural).",
"The details of blind decoding (monitoring) in the PDCCH receiving section 207 will be described later.",
"PDSCH receiving section 208 extracts received data (i.e., downlink data) from the PDSCH signals inputted from demultiplexing section 205 on the basis of the downlink resource allocation information received from PDCCH receiving section 207.That is, PDSCH receiving section 208 receives downlink data (downlink data signal) based on downlink resource allocation information (allocation control information) for terminal 200 allocated to one of a plurality of DCI allocation region candidates (blind decoding region candidates).",
"PDSCH receiving section 208 also detects any error in the extracted received data (i.e., downlink data).",
"If an error is found in the received data as a result of the error detection, PDSCH receiving section 208 generates NACK signals as ACK/NACK signals.",
"If no error is found in the received data, PDSCH receiving section 208 generates ACK signals as ACK/NACK signals.",
"The ACK/NACK signals are outputted to modulating section 209.Modulating section 209 modulates the ACK/NACK signals inputted from PDSCH receiving section 208 and outputs the modulated ACK/NACK signals to mapping section 212.Modulating section 210 modulates transmission data (i.e., uplink data) and outputs the modulated data signal to DFT section 211.DFT section 211 converts the data signals received from modulating section 210 into the frequency-domain and outputs a plurality of resultant frequency components to mapping section 212.Mapping section 212 maps the frequency component corresponding to the data signal among a plurality of frequency components inputted from DFT section 211 to a PUSCH in accordance with the uplink resource allocation information inputted from PDCCH receiving section 207.Mapping section 212 also identifies a PUCCH in accordance with the CCE number inputted from PDCCH receiving section 207.Mapping section 212 then maps the ACK/NACK signals inputted from modulating section 209 to the identified PUCCH.",
"IFFT section 213 converts the plurality of frequency components mapped to the PUSCH into a time-domain waveform.",
"CP adding section 214 adds a CP to the time-domain waveform.",
"RF transmitting section 215 can vary the range for transmission.",
"RF transmitting section 215 determines a specific transmission range on the basis of the band information received from configuration information receiving section 206.RF transmitting section 215 then performs transmission radio processing (for example, up-conversion or digital-analog (D/A) conversion) on the CP-added signals and transmits the resultant signals via antenna 201 [Operations of Base Station 100 and Terminal 200] Operations of base station 100 and terminal 200 having the above-described configurations will be described with reference to FIG.",
"9A and FIG.",
"9B.",
"In the following description, 6 DCI allocation region candidates (that is, blind decoding region candidates) in total are configured as C-SSs; 4 candidates (16 CCEs (=4 CCEs×4 candidates)) for CCE aggregation level 4 and 2 candidates (16 CCEs (=8 CCEs×2 candidates)) for CCE aggregation level 8.Furthermore, 16 DCI allocation region candidates (that is, blind decoding region candidates) in total are configured as UE-SSs; 6 candidates (6 CCEs (=1 CCE×6 candidates)), 6 candidates (12 CCEs (=2 CCEs×6 candidates)), 2 candidates (8 CCEs (4 CCEs×2 candidates)) and 2 candidates (16 CCEs (=8 CCEs×2 candidates)) for CCE aggregation levels 1, 2, 4 and 8 respectively.",
"That is, search spaces (C-SS and UE-SS) composed of 22 DCI allocation region candidates (that is, blind decoding region candidates) in total are configured for each terminal.",
"Furthermore, a case will be described here where configuration section 101 of base station 100 configures both the PDCCH region and the R-PDCCH region for terminal 200 as PDCCH transmission regions.",
"In this case, the above 22 DCI allocation region candidates (that is, blind decoding region candidates) are each configured in one of the PDCCH region and an R-PDCCH region.",
"In other words, the sum of the number of DCI allocation region candidates configured in a PDCCH region and the number of DCI allocation region candidates configured in an R-PDCCH region amounts to 22.Furthermore, configuration section 101 configures a CRS as a reference signal for use in a PDCCH region and configures one of a CRS and a DM-RS as a reference signal for use in an R-PDCCH region.",
"Search space configuration section 103 configures a common search space (C-SS) and a specific search space (UE-SS) based on a PDCCH transmission region indicated by the configuration information inputted from configuration section 101 and reference signals used.",
"To be more specific, when using both a PDCCH region and an R-PDCCH region as a region for transmitting a PDCCH to terminal 200, search space configuration section 103 configures a search space in the PDCCH region (C-SS or UE-SS) and a search space (C-SS or UE-SS) in the R-PDCCH region respectively.",
"In this case, search space configuration section 103 configures search spaces for each terminal so that the ratio of DCI allocation region candidates in the R-PDCCH region to the DCI allocation region candidates in the PDCCH region is greater in a terminal for which a DM-RS is indicated as a reference signal for demodulation in the R-PDCCH region (terminal using DM-RSs in the R-PDCCH region) than in a terminal for which a CRS is indicated as a reference signal for demodulation in the R-PDCCH region (terminal using CRSs in the R-PDCCH region).",
"When using only an R-PDCCH region as a region for transmitting a PDCCH to terminal 200, search space configuration section 103 configures search spaces (C-SS and UE-SS) of terminal 200 in the PDCCH region.",
"For example, as shown in FIG.",
"9A, for a certain terminal using CRSs in the R-PDCCH region, search space configuration section 103 configures UE-SSs of 12 candidates in total in the PDCCH region; 6 candidates of CCE aggregation level 2 and 6 candidates of CCE aggregation level 1.Furthermore, as shown in FIG.",
"9B, for a certain terminal using CRSs in the R-PDCCH region, search space configuration section 103 configures C-SSs of 6 candidates in total in the R-PDCCH region; 2 candidates of CCE aggregation level 8 and 4 candidates of CCE aggregation level 4, and UE-SSs of 4 candidates in total; 2 candidates of CCE aggregation level 8 and 2 candidates of CCE aggregation level 4.Here, as shown in FIG.",
"10, if the number of DCI allocation region candidates in the PDCCH region for a terminal using CRSs in the R-PDCCH region is assumed to be NA and the number of DCI allocation region candidates in the R-PDCCH region is assumed to be NB, NA=12 and NB=10 in FIG.",
"9A and FIG.",
"9B respectively.",
"On the other hand, as shown in FIG.",
"9A, for a certain terminal using DM-RSs in an R-PDCCH region, search space configuration section 103 configures C-SSs of 6 candidates in total in a PDCCH region; 2 candidates of CCE aggregation level 8 and 4 candidates of CCE aggregation level 4, and configures UE-SSs of 4 candidates in total; 2 candidates of CCE aggregation level 8 and 2 candidates of CCE aggregation level 4.Furthermore, as shown in FIG.",
"9B, for a certain terminal using DM-RSs in an R-PDCCH region, search space configuration section 103 configures UE-S Ss of 12 candidates in total in an R-PDCCH region; 6 candidates of CCE aggregation level 2 and 6 candidates of CCE aggregation level 1.Here, as shown in FIG.",
"10, if the number of DCI allocation region candidates in a PDCCH region for a terminal using DM-RSs in the R-PDCCH region is assumed to be NC and the number of DCI allocation region candidates in the R-PDCCH region is assumed to be ND, then NC=10 and ND=12 in FIG.",
"9A and FIG.",
"9B respectively.",
"That is, search space configuration section 103 configures search spaces (C-SS and UE-SS) so that a ratio of the number of DCI allocation region candidates ND in the R-PDCCH region to the number of DCI allocation region candidates NC in the PDCCH region (ND/NC) in terminal 200 using DM-RSs in the R-PDCCH region is equal to or above a ratio of the number of DCI allocation region candidates NB in the R-PDCCH region to the number of DCI allocation region candidates NA in the PDCCH region (NB/NA) in terminal 200 using CRSs in the R-PDCCH region.",
"That is, search space configuration section 103 configures the allocation of search spaces between the PDCCH region and R-PDCCH region so as to satisfy (NB/NA≤ND/NC).",
"In other words, the ratio of the number of blind decoding region candidates ND in the R-PDCCH region to the number of blind decoding region candidates NC in the PDCCH region (ND/NC) in terminal 200 using DM-RSs in the R-PDCCH region is equal to or above the ratio of the number of blind decoding region candidates NB in the R-PDCCH region to the number of blind decoding region candidates NA in the PDCCH region (NB/NA) in terminal 200 using CRSs in the R-PDCCH region.",
"Allocating section 106 then allocates DCI containing allocation control information to CCEs in C-SSs or UE-SSs shown in FIG.",
"9A and FIG.",
"9B.",
"To be more specific, allocating section 106 allocates DCI containing allocation control information for common channels (e.g., DCI 1C and 1A) to CCEs in C-SSs shown in FIG.",
"9A and FIG.",
"9B.",
"Furthermore, allocating section 106 allocates DCI containing allocation control information for the allocation of data common to all the terminals (e.g., DCI 0/1A) to CCEs in CSSs or CCEs in UE-SSs shown in FIG.",
"9A and FIG.",
"9B.",
"Furthermore, allocating section 106 allocates DCI containing allocation control information dependent on the transmission mode configured in the terminal (e.g., uplink (DCI 0A, 0B and 4) and downlink (DCI 1, 1B, 1D, 2, 2A, 2B and 2C)) to CCEs in UE-SSs shown in FIG.",
"9A and FIG.",
"9B.",
"In contrast, in terminal 200, PDCCH receiving section 207 blind-decodes DCI containing allocation control information for common channels (e.g., DCI 1C and 1A) and DCI containing allocation control information for the allocation of data common to all the terminals (e.g., DCI 0/1A) for C-SSs shown in FIG.",
"9A and FIG.",
"9B.",
"Furthermore, for UE-SSs shown in FIG.",
"9A and FIG.",
"9B, PDCCH receiving section 207 blind-decodes DCI containing allocation control information for the allocation of data common to all the terminals (e.g., DCI 0/1A) and DCI containing allocation control information dependent on the transmission mode (e.g., uplink (DCI 0A, 0B and 4), downlink (DCI 1, 1B, 1D, 2, 2A, 2B and 2C)) configured for terminal 200.That is, terminal 200 performs blind decoding on two DCI formats (DCI 1C, 1A and DCI 0/1A) for C-SSs.",
"On the other hand, terminal 200 performs blind decoding on three DCI formats (DCI dependent on the uplink transmission mode (DCI 0A, 0B and 4), DCI dependent on the downlink transmission mode (DCI 1, 1B, 1D, 2, 2A, 2B and 2C) and DCI 0/1A) for UE-SSs.",
"Blind decoding in terminal 200 described above is summarized as follows: 36 (=12 candidates×3 DCI formats) blind decoding operations in total are performed for UE-SSs of 12 candidates in a PDCCH region (FIG.",
"9A) for a terminal using CRSs in the R-PDCCH region.",
"Furthermore, 12 (=6 candidates×2 DCI formats) blind decoding operations in total are performed for C-SSs of 6 candidates and 12 (=4 candidates×3 DCI formats) blind decoding operations in total are performed for UE-SSs of 4 candidates in the R-PDCCH region (FIG.",
"9B).",
"Furthermore, a terminal using DM-RSs in the R-PDCCH region performs 12 (=6 candidates×2 DCI formats) blind decoding operations in total for C-SSs of 6 candidates in the PDCCH region (FIG.",
"9A) and 12 (=4 candidates×3 DCI formats) blind decoding operations in total for UE-SSs of 4 candidates.",
"Furthermore, the terminal performs 36 (=12 candidates×3 DCI formats) blind decoding operations for UE-SSs of 12 candidates in the R-PDCCH region (FIG.",
"9B).",
"That is, the ratio of the number of blind decoding operations in the R-PDCCH region to the number of blind decoding operations in the PDCCH region of the terminal using DM-RSs in the R-PDCCH region is greater than that of the terminal using CRSs in the R-PDCCH region.",
"To be more specific, in terminal 200, the ratio (36/24) of the number of blind decoding operations in the R-PDCCH region (36 in FIG.",
"9B) to the number of blind decoding operations in the PDCCH region (24 in FIG.",
"9A) in terminal 200 using DM-RSs in the R-PDCCH region is equal to or greater than the ratio (24/36) of the number of blind decoding operations in the R-PDCCH region (24 in FIG.",
"9B) to the number of blind decoding operations in the PDCCH region (36 in FIG.",
"9A) in terminal 200 using CRSs in the R-PDCCH region.",
"Thus, more DCI allocation region candidates (blind decoding region candidates) are more likely to be configured in an R-PDCCH region for a terminal using DM-RSs in the R-PDCCH region than a terminal using CRSs in the R-PDCCH region.",
"That is, with the terminal using DM-RSs in the R-PDCCH region, DCI is more likely to be allocated to the R-PDCCH region.",
"Here, as shown in FIG.",
"3, use of DM-RSs is effective for a terminal located at a cell edge or a terminal whose received signal level is low.",
"That is, base station 100 is more likely to instruct terminal 200 located at a cell edge and receiving large interference from other cells (other cell interference) (or terminal 200 whose received signal level is low) to use DM-RSs in the R-PDCCH region.",
"Furthermore, an R-PDCCH region is more likely to be able to reduce other cell interference than a PDCCH region through, for example, interference control.",
"Thus, base station 100 configures search spaces so that DCI is more likely to be allocated to a terminal using DM-RSs (e.g., terminal 200 located near a cell edge) in an R-PDCCH region.",
"In this way, the terminal using DM-RSs achieves an effect of improving received signal power of a PDCCH using DM-RSs (see FIG.",
"3) while reducing influences of other cell interference, and can thereby secure desired receiving quality.",
"Here, for example, base station 100 allocates data for a terminal using CRSs in an R-PDCCH region within a search space using relatively more CCEs in a PDCCH region (that satisfies, for example, NBNA) so as to satisfy a relationship of (NB/NA≤ND/NC).",
"On the other hand, base station 100 allocates data for a terminal using DM-RSs in an R-PDCCH region within a search space using relatively more CCEs in an R-PDCCH region (that satisfies, for example, NC≤ND).",
"This makes it possible to achieve a load balance of PDCCHs to which control information for each terminal is allocated, that is, to uniformly map PDCCHs onto a PDCCH region and an R-PDCCH region.",
"That is, it is possible to avoid cases where PDCCHs cannot be transmitted within a limited region because PDCCHs are biased to a specific region.",
"Thus, it is possible to prevent one of the PDCCH region and R-PDCCH region from becoming tight as the number of communicating terminals increases.",
"Furthermore, preventing the R-PDCCH region from becoming tight makes it possible to avoid an adverse influence of data allocation on a relay station (a terminal under the control of a relay station) and prevent the PDSCH region from becoming tight.",
"This prevents system throughput from deteriorating.",
"Furthermore, each terminal moves in a cell covered by base station 100.For example, in a cell covered by base station 100, there are terminals in a variety of situations such as a terminal moving fast, terminal moving slowly, terminal located near a cell edge or terminal located near the center of the cell.",
"For such terminals, base station 100 may use a PDCCH region or R-PDCCH region using CRSs (reference signals with which a frequency diversity effect can be achieved) for DCI for the terminal moving fast (whose received signal level fluctuates violently).",
"Furthermore, base station 100 may use an R-PDCCH region using DM-RSs (reference signals with which received signal power can be improved) for DCI for the terminal located near a cell edge (whose received signal level is low).",
"That is, using a PDCCH region and an R-PDCCH region as the PDCCH transmission region, base station 100 can configure search spaces capable of securing desired receiving quality regardless of the moving speed or location area or the like of a terminal.",
"Thus, base station 100 determines which region (PDCCH region or R-PDCCH region) is used to transmit DCI in consideration of the situation of each terminal (e.g., position of the terminal, scale of other cell interference, traffic situation (e.g., “the PDCCH region becomes tight as the number of communicating terminals increases”) or the like).",
"Furthermore, when allocating DCI for a terminal to an R-PDCCH region, base station 100 configures one of CRS and DM-RS as a reference signal for demodulation in the R-PDCCH region.",
"In this case, base station 100 configures search spaces in the PDCCH region and R-PDCCH region so as to satisfy the above-described relationship of (NB/NA≤ND/NC).",
"Thus, it is possible to prevent throughput deterioration in the entire system caused by the PDCCH region or R-PDCCH region becoming tight.",
"Furthermore, each terminal can receive DCI using a resource (transmission region of a PDCCH) suited to the situation of each terminal and secure desired receiving quality in the terminal.",
"Therefore, according to the present embodiment, even when DCI for a terminal connected to a base station is allocated to a PDCCH region and an R-PDCCH region, it is possible to secure desired receiving quality in the terminal without causing system throughput to deteriorate.",
"In the present embodiment, when a terminal using CRSs in an R-PDCCH region and a terminal using DM-RSs in an R-PDCCH region coexist, base station 100 configures search spaces in the PDCCH region and R-PDCCH region so as to satisfy the aforementioned relationship of (NB/NA≤ND/NC).",
"However, when a terminal using CRSs in an R-PDCCH region and a terminal using DM-RSs in an R-PDCCH region coexist, base station 100 may also cause the number of DCI allocation region candidates (number of blind decoding region candidates) NB in the R-PDCCH region for a terminal using CRSs in the R-PDCCH region to be equal to or below the number of DCI allocation region candidates (number of blind decoding region candidates) ND (NB≤ND) in the R-PDCCH region for a terminal using DM-RSs in the R-PDCCH region.",
"Here, if the number of DCI allocation region candidates contained in a search space configured for each terminal is assumed to be constant (e.g., 22 candidates in FIG.",
"9A and FIG.",
"9B), satisfying the relationship of (NB≤ND) is equivalent to satisfying the relationship of (NB/NA≤ND/NC) as in the case of the present embodiment.",
"Similarly, base station 100 may also cause the number of DCI allocation region candidates (number of blind decoding region candidates) NA in the PDCCH region for a terminal using CRSs in the R-PDCCH region to be equal to or above the number of DCI allocation region candidates (number of blind decoding region candidates) NC (NA≥NC) in the PDCCH region for a terminal using DM-RSs in the R-PDCCH region.",
"In this case, if the number of DCI allocation region candidates contained in a search space configured for each terminal is also assumed to be constant (e.g., 22 candidates in FIG.",
"9A and FIG.",
"9B), satisfying the relationship of (NA≥NC) is equivalent to satisfying the relationship of (NB/NA≤ND/NC) as in the case of the present embodiment.",
"Alternatively, in the present embodiment, base station 100 may also configure search spaces of each terminal so as to satisfy the relationship of (NA≥NC) and satisfy the relationship of (NB≤ND) at the same time.",
"At this time, the ratio between NA and NB, and the ratio between NC and ND can take any value.",
"For example, the ratio between NC and ND (NC:ND) may be NC:ND=12:10 or NC:ND=10:12.Alternatively, in the present embodiment, base station 100 may also dispose C-SSs in a PDCCH region and dispose UE-SSs in an R-PDCCH region, for example, so as to satisfy the relationship of (NA≥NC) and the relationship of (NB≤ND) at the same time.",
"For example, base station 100 configures search spaces as shown in FIG.",
"9A and FIG.",
"9B, resulting in NA=12, NB=10, NC=10 and ND=12, which satisfies (NA≥NC) and (NB≤ND).",
"That is, base station 100 configures search spaces so that in the R-PDCCH region, the number of DCI allocation region candidates (number of blind decoding region candidates) ND for a terminal using DM-RSs is greater than the number of DCI allocation region candidates (number of blind decoding region candidates) NB for a terminal using CRSs.",
"As in the case of the present embodiment, it is possible for a terminal using DM-RSs to obtain an effect of improving received signal power of a PDCCH using DM-RSs (see FIG.",
"3) while suppressing influences of other cell interference.",
"Furthermore, when (NA≥NC) and (NB≤ND) are satisfied, the number of DCI allocation region candidates (number of blind decoding region candidates) NB for a terminal using CRSs becomes smaller than the number of DCI allocation region candidates (number of blind decoding region candidates) ND for a terminal using DM-RSs in the R-PDCCH region, whereas in the PDCCH region, the number of DCI allocation region candidates (number of blind decoding region candidates) NA for a terminal using CRSs becomes greater than the number of DCI allocation region candidates (number of blind decoding region candidates) NC for a terminal using DM-RSs.",
"This makes it possible to maintain a load balance of PDCCHs in the PDCCH region and R-PDCCH region as a whole.",
"Embodiment 2 A case has been described in Embodiment 1 where a terminal using CRSs and a terminal using DM-RSs coexist in an R-PDCCH region.",
"In contrast, a case will be described in the present embodiment where reference signals used for each terminal are fixedly configured in an R-PDCCH region.",
"Hereinafter, search space configuration methods 1 to 3 according to the present embodiment will be described more specifically.",
"Since the basic configurations of a base station and a terminal according to the present embodiment are common to those in Embodiment 1, these configurations will be described using FIG.",
"6 and FIG.",
"8.In the following description, as in the case of Embodiment 1, 6 DCI allocation region candidates (that is, blind decoding region candidates) in total are configured as C-SSs; 4 candidate (16 CCEs) for CCE aggregation level 4 and 2 candidates (16 CCEs) for CCE aggregation level 8.Furthermore, 16 DCI allocation region candidates (that is, blind decoding region candidates) in total are configured as UE-SSs; 6 candidates (6 CCEs), 6 candidates (12 CCEs), 2 candidates (8 CCEs), 2 candidates (16 CCEs) corresponding to CCE aggregation levels 1, 2, 4 and 8 respectively.",
"That is, search spaces (C-SS and UE-SS) composed of 22 DCI allocation region candidates in total (that is, blind decoding region candidates) are configured for each terminal.",
"Furthermore, as in the case of Embodiment 1, for C-SSs, terminal 200 (PDCCH receiving section 207) performs blind decoding for two DCI formats; DCI containing allocation control information for common channels (e.g., DCI 1C and 1A) and DCI containing allocation control information for the allocation of data common to all the terminals (e.g., DCI 0/1A).",
"For UE-SSs, terminal 200 (PDCCH receiving section 207) performs blind decoding for three DCI formats; DCI containing allocation control information for the allocation of data common to all the terminals (for example, DCI 0/1A), DCI containing allocation control information dependent on the transmission mode configured for terminal 200 (for example, uplink (DCI 0A, 0B and 4), and downlink (DCI 1, 1B, 1D, 2, 2A, 2B and 2C)).",
"Furthermore, as in the case of Embodiment 1, as shown in FIG.",
"10, the number of DCI allocation region candidates (number of blind decoding region candidates) in a PDCCH region for a terminal using CRSs in an R-PDCCH region is assumed to be NA and the number of DCI allocation region candidates (number of blind decoding region candidates) in an R-PDCCH region is assumed to be NB.",
"Furthermore, as shown in FIG.",
"10, the number of DCI allocation region candidates (number of blind decoding region candidates) in a PDCCH region for a terminal using DM-RSs in an R-PDCCH region is assumed to be NC and the number of DCI allocation region candidates (number of blind decoding region candidates) in an R-PDCCH region is assumed to be ND.",
"<Configuration Method 1 (when Configuring Only CRSs in R-PDCCH Region)> According to configuration method 1, search space configuration section 103 of base station 100 configures search spaces so that the number of DCI allocation region candidates (number of blind decoding region candidates) NB in R-PDCCH region becomes equal to or above the number of DCI allocation region candidates (number of blind decoding region candidates) NA in a PDCCH region (NA≤NB).",
"For example, as shown in FIG.",
"11, for a certain terminal, search space configuration section 103 configures C-SSs of 6 candidates in total in a PDCCH region; 2 candidates of CCE aggregation level 8 and 4 candidates of CCE aggregation level 4 and configures UE-SSs of 4 candidates in total; 2 candidates of CCE aggregation level 8 and 2 candidates of CCE aggregation level 4.Furthermore, as shown in FIG.",
"11, for a certain terminal, search space configuration section 103 configures UE-SSs of 12 candidates in total in an R-PDCCH region; 6 candidates of CCE aggregation level 2 and 6 candidate of CCE aggregation level 1.Thus, the number of DCI allocation region candidates (number of blind decoding region candidates) NA in the PDCCH region shown in FIG.",
"11 is 10 and the number of DCI allocation region candidates (number of blind decoding region candidates) NB in the R-PDCCH region is 12.That is, in FIG.",
"11, the relationship of (NA≤NB) is satisfied.",
"In contrast, PDCCH receiving section 207 of terminal 200 blind-decodes DCI for the C-SSs and UE-SSs shown in FIG.",
"11 according to search space region information inputted from configuration information receiving section 206.In FIG.",
"11, PDCCH receiving section 207 blind decodes for only C-SSs of CCE aggregation levels 4 and 8 and for only UE-SSs of CCE aggregation levels 4 and 8 in the PDCCH region, and blind decodes for only UE-SSs of CCE aggregation levels 1 and 2 in the R-PDCCH region.",
"That is, PDCCH receiving section 207 performs 12 (=6 candidates×2 types) blind decoding operations for C-SSs configured for the PDCCH region shown in FIG.",
"11 and performs 12 (=4 candidates×3 types) blind decoding operations for UE-SSs configured for the PDCCH region shown in FIG.",
"11.On the other hand, PDCCH receiving section 207 performs 36 (=12 candidates×3 types) blind decoding operations for UE-SSs configured for the R-PDCCH region shown in FIG.",
"11.That is, in FIG.",
"11, the number of blind decoding operations (36 operations) in the R-PDCCH region is greater than the number of blind decoding operations (24 operations) in the PDCCH region.",
"Here, according to configuration method 1, the same reference signal (CRS) is used for terminal 200 in both the PDCCH region and R-PDCCH region.",
"That is, there is no difference in reference signals used in the PDCCH region and R-PDCCH region for terminal 200 for which the search spaces shown in FIG.",
"11 are configured.",
"On the other hand, as described above, other cell interference is more likely to be reduced in the R-PDCCH region than in the PDCCH region.",
"Therefore, as shown in FIG.",
"11, base station 100 configures search spaces so that the number of DCI allocation region candidates (number of blind decoding region candidates) NB in the R-PDCCH region is greater than the number of DCI allocation region candidates (number of blind decoding region candidates) NA in the PDCCH region (NA≤NB), and terminal 200 is thereby more likely to be able to receive control information allocated to terminal 200 in the R-PDCCH region where other cell interference is more likely to be reduced.",
"Furthermore, as shown in FIG.",
"11, by using the PDCCH region and R-PDCCH region as PDCCH transmission regions for terminal 200, base station 100 can select a transmission region to transmit DCI depending on the moving speed (high-speed or low-speed) of terminal 200 or the location area (center of the cell or cell edge) of terminal 200.That is, base station 100 can configure search spaces capable of securing desired receiving quality regardless of the moving speed or location area or the like of the terminal.",
"Thus, according to configuration method 1, when DCI for a terminal connected to a base station is allocated to a PDCCH region and an R-PDCCH region, it is possible to secure desired receiving quality in the terminal by further reducing the possibility of receiving other cell interference.",
"Furthermore, robust PDCCH reception performance can be secured depending on the situation of the terminal.",
"Configuration method 1 may satisfy not only the configuration of search spaces (allocation of search spaces) shown in FIG.",
"11 but also the relationship of (NANB).",
"For example, UE-SSs of 10 candidates (e.g., 10 candidates in total of CCE aggregation levels 2, 4 and 8 among 16 candidates) may be configured in the PDCCH region (NA=10) and C-SSs of 6 candidates and UE-SSs of 6 candidates (6 candidates of CCE aggregation level 1); 12 candidates in total, may be configured in the R-PDCCH region (NB=12).",
"Alternatively, C-SSs of 6 candidates may be configured in the PDCCH region (NA=6) and UE-SSs of 16 candidates (16 candidates in total of CCE aggregation levels 1, 2, 4 and 8) may be configured in the R-PDCCH region (NB=16).",
"<Configuration Method 2 (when Configuring Only DM-RSs in R-PDCCH Region)> According to configuration method 2, search space configuration section 103 of base station 100 configures search spaces so that the number of DCI allocation region candidates (number of blind decoding region candidates) ND in an R-PDCCH region is equal to or above the number of DCI allocation region candidates (number of blind decoding region candidates) NC in a PDCCH region (NC≤ND).",
"For example, as in the case of configuration method 1, as shown in FIG.",
"11, for a certain terminal, search space configuration section 103 configures C-SSs of 6 candidates in total in the PDCCH region; 2 candidates of CCE aggregation level 8 and 4 candidates of CCE aggregation level 4, and configures UE-SSs of 4 candidates in total; 2 candidates of CCE aggregation level 8 and 2 candidates of CCE aggregation level 4.Furthermore, as shown in FIG.",
"11, for a certain terminal, search space configuration section 103 configures UE-SSs of 12 candidates in total in the R-PDCCH region; 6 candidates of CCE aggregation level 2 and 6 candidates of CCE aggregation level 1.Thus, the number of DCI allocation region candidates (number of blind decoding region candidates) NC in the PDCCH region shown in FIG.",
"11 is 10, and the number of DCI allocation region candidates (number of blind decoding region candidates) ND in the R-PDCCH region is 12.That is, in FIG.",
"11, the relationship of (NC≤ND) is satisfied.",
"In contrast, PDCCH receiving section 207 of terminal 200 blind-decodes DCI for the C-SSs and UE-SSs shown in FIG.",
"11 according to search space region information inputted from configuration information receiving section 206.In FIG.",
"11, PDCCH receiving section 207 performs blind decoding only for C-SSs of CCE aggregation levels 4 and 8 and for UE-SSs of CCE aggregation levels 4 and 8 in the PDCCH region, and performs blind decoding only for UE-SSs of CCE aggregation levels 1 and 2 in the R-PDCCH region.",
"That is, as in the case of configuration method 1, PDCCH receiving section 207 performs 12 (=6 candidates×2 types) blind decoding operations for C-SSs configured in the PDCCH region shown in FIG.",
"11 and performs 12 (=4 candidates×3 types) blind decoding operations for UE-SSs.",
"Furthermore, as in the case of configuration method 1, PDCCH receiving section 207 performs 36 (=12 candidates×3 types) blind decoding operations for UE-SSs configured in the R-PDCCH region shown in FIG.",
"11.That is, in FIG.",
"11, the number of blind decoding operations (36 operations) in the R-PDCCH region is greater than the number of blind decoding operations (24 operations) in the PDCCH region.",
"Here, according to configuration method 2, CRSs are used in the PDCCH region and DM-RSs are used in the R-PDCCH region for terminal 200.Furthermore, as described above, use of DM-RSs is effective for a terminal located at a cell edge or the like or a terminal whose received signal level is low.",
"Furthermore, the R-PDCCH region is more likely to be able to reduce other cell interference through interference control or the like than the PDCCH region.",
"Thus, by making the number of blind decoding region candidates ND in the R-PDCCH region greater than the number of blind decoding region candidates NC in the PDCCH region (NC≤ND), terminal 200 using DM-RSs can obtain an effect of improving received signal power of a PDCCH using DM-RSs (see FIG.",
"3) while suppressing influences of other cell interference in the R-PDCCH region.",
"Thus, desired receiving quality in terminal 200 can be secured.",
"Furthermore, as shown in FIG.",
"11, by using the PDCCH region and R-PDCCH region as PDCCH transmission regions for terminal 200, base station 100 can select a transmission region using an appropriate reference signal (CRS or DM-RS) to transmit DCI depending on the moving speed (high-speed or low-speed) of terminal 200 or the location area (center of the cell or cell edge) of terminal 200.That is, base station 100 can configure search spaces capable of securing desired receiving quality regardless of the moving speed or location area or the like of the terminal.",
"Thus, according to configuration method 2, when DCI for a terminal connected to a base station is allocated to a PDCCH region and an R-PDCCH region, it is also possible to secure desired receiving quality in the terminal by further reducing the possibility of receiving other cell interference.",
"Furthermore, robust PDCCH reception performance can be secured depending on the situation of the terminal.",
"A case has been described in configuration method 2 where only DM-RSs are configured in the R-PDCCH region.",
"However, configuration method 2 is likewise applicable to a case where DM-RSs are indicated in a terminal in which CRSs or DM-RSs may be indicated in the R-PDCCH region.",
"At this time, in the case where CRSs are indicated in a terminal in which CRSs or DM-RSs may be indicated in the R-PDCCH region, search space configuration section 103 of base station 100 may configure search spaces so that the number of DCI allocation region candidates (number of blind decoding region candidates) NA in the PDCCH region becomes equal to or above the number of DCI allocation region candidates (number of blind decoding region candidates) NB in the R-PDCCH region (NA≥NB).",
"For example, for a certain terminal using CRSs in the R-PDCCH region, search space configuration section 103 configures UE-S Ss of 12 candidates in total in the PDCCH region; 6 candidates of CCE aggregation level 2 and 6 candidates of CCE aggregation level 1 (NA=12).",
"Furthermore, in the R-PDCCH region, search space configuration section 103 configures C-SSs of 6 candidates in total; 2 candidates of CCE aggregation level 8 and 4 candidates of CCE aggregation level 4, and UE-SSs of 4 candidates in total; 2 candidates of CCE aggregation level 8 and 2 candidates of CCE aggregation level 4 (NB=10).",
"In contrast, PDCCH receiving section 207 of terminal 200 performs 36 (=12 candidates×3 types) blind decoding operations for UE-SSs in the PDCCH region.",
"Furthermore, PDCCH receiving section 207 performs 12 (=6 candidate×2 types) blind decoding operations for C-SSs in the R-PDCCH region and performs 12 (=4 candidates×3 types) blind decoding operations for UE-SSs.",
"Thus, the number of blind decoding operations (36 operations) in the PDCCH region is greater than the number of blind decoding operations (24 operations) in the R-PDCCH region.",
"Thus, as described above, it is possible to secure desired receiving quality for a terminal using DM-RSs and maintain a load balance of PDCCHs in the PDCCH region and the R-PDCCH region as a whole.",
"<Configuration Method 3 (when Configuring Only DM-RSs in R-PDCCH Region)> According to configuration method 3, search space configuration section 103 of base station 100 configures C-SSs only in a PDCCH region.",
"For example, for a certain terminal, search space configuration section 103 configures C-SSs of 6 candidates in total in the PDCCH region; 2 candidates of CCE aggregation level 8 and 4 candidates of CCE aggregation level 4.On the other hand, for a certain terminal, search space configuration section 103 arbitrarily configures 6 candidates, 6 candidates, 2 candidates and 2 candidates of CCE aggregation levels 1, 2, 4 and 8 respectively which are UE-SSs in the PDCCH region and R-PDCCH region.",
"That is, search space configuration section 103 configures C-SSs of 6 candidates in the PDCCH region and UE-SSs of (NC−6) candidates and configures only UE-SSs of ND candidates in the R-PDCCH region.",
"In this case, the relationship of (NC≤ND) may be satisfied as in the case of configuration method 2, for example.",
"Thus, PDCCH receiving section 207 of terminal 200 performs 12 (=6 candidates×2 types) blind decoding operations for C-SSs in the PDCCH region and ((NC−12) candidates×3 types) blind decoding operations for UE-SSs.",
"On the other hand, PDCCH receiving section 207 performs 0 blind decoding operations (no blind decoding operations) for C-SSs in the R-PDCCH region and performs (ND candidate×3 types) blind decoding operations for UE-SSs.",
"Here, as shown in FIG.",
"3, precoding is not applied to reference signals and data signals in the transmission region using CRSs, whereas precoding is applied to reference signals and data signals in the transmission region using DM-RSs (here, R-PDCCH region).",
"Therefore, for example, when C-SSs are configured in the R-PDCCH region using DM-RSs, precoding is also applied to the C-SSs with a transmission weight optimized for a certain terminal.",
"For this reason, there may be cases where other terminals cannot receive DCI allocated to CCEs in a C-S S. In contrast, according to configuration method 3, search space configuration section 103 configures C-SSs only in a PDCCH region where only CRSs (reference signals without precoding) are used, and all the terminals can receive DCI allocated to CCEs in the C-SS.",
"Thus, according to configuration method 3, PDCCH reception performance in C-SSs for all the terminals can be secured.",
"A case has been described in configuration method 3 where only DM-RSs are configured in the R-PDCCH region.",
"However, configuration method 3 is likewise applicable to a case where DM-RSs are indicated in a terminal in which CRSs or DM-RSs may be indicated in the R-PDCCH region.",
"In this case, the relationship of (NB/NA≤ND/NC) may be satisfied as in the case of Embodiment 1.Search space configuration methods 1 to 3 according to the present embodiment have been described so far.",
"Thus, according to the present embodiment, when DCI for a terminal connected to a base station is mapped onto a PDCCH region and an R-PDCCH region, even when reference signals used for each terminal are fixedly configured in the R-PDCCH region, desired receiving quality for the terminal can be secured in the PDCCH region or R-PDCCH region.",
"Embodiment 3 The present embodiment will describe a case where search spaces are configured for each DCI format.",
"Since basic configurations of a base station and a terminal according to the present embodiment are common to those in Embodiment 1, these configurations will be described using FIG.",
"6 and FIG.",
"8.Furthermore, in the following description as in the case of Embodiment 1, 6 DCI allocation region candidates (that is, blind decoding region candidates) in total are configured as C-SSs; 4 candidates (16 CCEs) for CCE aggregation level 4 and 2 candidates (16 CCEs) for CCE aggregation level 8.Furthermore, 16 DCI allocation region candidates (that is, blind decoding region candidates) in total are configured as UE-SSs; 6 candidates (6 CCEs), 6 candidates (12 CCEs), 2 candidates (8 CCEs) and 2 candidates (16 CCEs) for CCE aggregation levels 1, 2, 4 and 8 respectively.",
"That is, search spaces (C-SS and UE-SS) composed of 22 DCI allocation region candidates in total (that is, blind decoding region candidates) are configured for each terminal.",
"Furthermore, as in the case of Embodiment 1, terminal 200 (PDCCH receiving section 207) performs blind decoding for C-SSs in two DCI formats; DCI containing allocation control information for common channels (e.g., DCI 1C and 1A) and DCI containing allocation control information for the allocation of data common to all the terminals (e.g., DCI 0/1A).",
"Terminal 200 (PDCCH receiving section 207) performs blind decoding for UE-SSs in three DCI formats; DCI containing allocation control information for the allocation of data common to all the terminals (for example, DCI 0/1A), and DCI containing allocation control information dependent on the transmission mode configured for terminal 200 (for example, uplink (DCI 0A, 0B and 4), and downlink (DCI 1, 1B, 1D, 2, 2A, 2B and 2C)).",
"For example, when base station 100 configures only CRSs in an R-PDCCH region as in the case of configuration method 1 in Embodiment 2, a case will be described where base station 100 configures search spaces so that the number of DCI allocation region candidates (number of blind decoding region candidates) NB in the R-PDCCH region is equal to or above the number of DCI allocation region candidates (number of blind decoding region candidates) NA in the PDCCH region (NA≤NB).",
"In this case, as shown in FIG.",
"12A, in a PDCCH region for a certain terminal, search space configuration section 103 configures C-SSs corresponding to two DCI formats (12 candidates (=6 candidates×2 types)) and configures UE-SSs corresponding to one DCI format (16 candidates).",
"Furthermore, as shown in FIG.",
"12B, in an R-PDCCH region for a certain terminal, search space configuration section 103 configures UE-SSs corresponding to two DCI formats (32 candidates (=16 candidates×2 types)).",
"Therefore, in FIG.",
"12A and FIG.",
"12B, the number of DCI allocation region candidates (number of blind decoding region candidates) NB (=32) in the R-PDCCH region is greater than the number of DCI allocation region candidates (number of blind decoding region candidates) NA (=28) in the PDCCH region.",
"In contrast, PDCCH receiving section 207 of terminal 200 blind-decodes DCI for C-SSs and UE-SSs shown in FIG.",
"12A and FIG.",
"12B according to search space region information inputted from configuration information receiving section 206.To be more specific, PDCCH receiving section 207 performs 12 (=6 candidates×2 types) blind decoding operations for C-SSs in the PDCCH region shown in FIG.",
"12A and performs 16 (=16 candidates×1 types) blind decoding operations for UE-SSs.",
"Thus, the number of blind decoding operations in the PDCCH region shown in FIG.",
"12A is 28.Furthermore, PDCCH receiving section 207 blind-decodes UE-SSs corresponding to two DCI formats (16 candidates) in the R-PDCCH region shown in FIG.",
"12B.",
"That is, in FIG.",
"12A and FIG.",
"12B, the number of blind decoding operations (36 operations) in the R-PDCCH region is greater than the number of blind decoding operations (24 operations) in the PDCCH region.",
"That is, terminal 200 is more likely to be able to receive DCI for terminal 200 in an R-PDCCH region where other cell interference is more likely to be reduced.",
"Thus, when DCI for a terminal connected to a base station is mapped onto a PDCCH region and an R-PDCCH region, the present embodiment further reduces the possibility of receiving other cell interference, and can thereby secure desired receiving quality in the terminal.",
"Furthermore, according to the present embodiment, the base station configures search spaces for each DCI format.",
"The base station can configure search spaces for each DCI format in an appropriate transmission region of the PDCCH region or R-PDCCH region depending on features of each DCI format (e.g., usage frequency, receiving quality at a location where usage is anticipated).",
"Thus, the terminal can receive DCI of each DCI format with desired receiving quality.",
"To be more specific, since the number of information bits of DCI 0/1A is smaller than the number of information bits of other DCI formats dependent on the transmission mode, if the same number of CCEs is configured, DCI 0/1A allows transmission with a lower coding rate than DCI 1, 1B, 1D, 2, 2A, 2B and 2C, 0A, 0B and 4.That is, when DCI 0/1A is configured by focusing on the fact that DCI 0/1A is a format less likely to be influenced by a propagation path situation than other DCI formats, the base station may configure DCI 0/1A in the PDCCH region, and configure DCI 0A, 0B and 4 dependent on the uplink transmission mode and DCI 1, 1B, 1D, 2, 2A, 2B and 2C dependent on the downlink transmission mode in the R-PDCCH region.",
"That is, the base station configures a common DCI format with the small amount of information in the PDCCH region.",
"This makes it possible to alleviate the tight condition of the PDCCH region (resources dependent on the uplink transmission mode are allocated to the R-PDCCH region), reduce influences of interference (DCI less likely to be influenced by a propagation path situation is allocated to the PDCCH region), and thereby achieve their respective required receiving qualities.",
"The present embodiment is applicable not only to above-described configuration method 1 but also to Embodiment 1 and configuration methods 2 and 3 of Embodiment 2.For example, as in the case of Embodiment 1, applying the present embodiment to these embodiments can prevent throughput deterioration caused by the tight condition of a PDCCH region or R-PDCCH region in the entire system.",
"Moreover, each terminal is allowed to receive DCI using resources (PDCCH transmission region) suitable for a situation of each terminal and it is possible to secure desired receiving quality for each terminal.",
"Furthermore, in the present embodiment, the base station and the terminal may also store allocation patterns (e.g., FIG.",
"13) of DCI allocation region candidates (blind decoding region candidates) in the respective search spaces of the PDCCH region and R-PDCCH region.",
"For example, in FIG.",
"13, “∘” indicates that a search space for the corresponding DCI format is configured for an allocation region corresponding to “∘” and “-” indicates that a search space for the corresponding DCI format is configured for allocation region corresponding to “-.” For example, in the case of search spaces of pattern number 4 shown in FIG.",
"13, a C-SS corresponding to two DCI formats (DCI 1C and DCI 0/1A) and a UE-SS corresponding to one DCI format (one of DCI 1, 1B, 1D, 2, 2A, 2B and 2C) are configured in the PDCCH region, and a UE-SS corresponding to two DCI formats (DCI 0/1A and DCI 0A, 0B and 4) is configured in the R-PDCCH region.",
"The same applies to search spaces with other pattern numbers shown in FIG.",
"13.For example, the base station may report pattern numbers shown in FIG.",
"13 to each terminal depending on the situation (moving speed, position or the like) of each terminal.",
"Alternatively, the base station may select a search space that allows the blocking probability to be reduced every time (e.g., for each subframe) and report the selected pattern number to the terminal.",
"Furthermore, the present embodiment has described configuration method 1 of Embodiment 2 as an example.",
"However, as in the case of configuration method 2 or 3 of Embodiment 2, the present embodiment may also be applied to a case where base station 100 configures only DM-RSs in an R-PDCCH region.",
"That is, the present embodiment may be applied to a case where search spaces are configured so that the number of DCI allocation region candidates (number of blind decoding region candidates) ND in an R-PDCCH region is equal to or above the number of DCI allocation region candidates (number of blind decoding region candidates) NC in a PDCCH region (NC≤ND).",
"Embodiment 4 A case has been described in Embodiment 3 where the base station configures a transmission region (PDCCH region or R-PDCCH region) depending on features of each DCI format.",
"The present embodiment will describe a specific example of the above configuration processing in the base station according to Embodiment 3.Since basic configurations of a base station and a terminal according to the present embodiment are common to those in Embodiment 1, these configurations will be described using FIG.",
"6 and FIG.",
"8.Allocating section 106 of base station 100 disposes DCI containing allocation control information for common channels (e.g., DCI 1C and 1A) and DCI containing allocation control information for the allocation of data common to all the terminals (e.g., DCI 0/1A) in a PDCCH region, and disposes DCI containing allocation control information dependent on the transmission mode (e.g., uplink (DCI 0A, 0B and 4), downlink (DCI 1, 1B, 1D, 2, 2A, 2B and 2C)) configured for terminal 200 in an R-PDCCH region.",
"That is, allocating section 106 allocates allocation control information in a format common to all the terminals to search spaces configured in the PDCCH region and allocates allocation control information in a format corresponding to a transmission mode configured for terminal 200 to search spaces configured in the R-PDCCH region.",
"Operation of search space configuration section 103 may be similar to those of Embodiments 1 to 3.In contrast, PDCCH receiving section 207 of terminal 200 blind-decodes DCI for C-SSs and UE-SSs according to search space region information inputted from configuration information receiving section 206.To be more specific, PDCCH receiving section 207 performs blind decoding for C-SSs in the PDCCH region in DCI 1C and DCI 0/1A formats and performs blind decoding for UE-SSs in a DCI format (DCI 0/1A) used commonly in plurality of transmission modes.",
"As the number of blind decoding operations in the PDCCH region, 12 (=6 candidates×2 types (DCI 1C and DCI 0/1A, DCI formats 0 and 1A are blind-decoded as one type) blind decoding operations are performed for C-SSs and 16 (=16 candidates×1 type) blind decoding operations are performed for UE-SSs.",
"Thus, the number of blind decoding operations in the PDCCH region is 28.Furthermore, PDCCH receiving section 207 performs blind decoding operations in a DCI format determined dependently of the transmission mode in the R-PDCCH region.",
"In the R-PDCCH region, PDCCH receiving section 207 blind-decodes a DCI format dependent on the downlink transmission mode and a DCI format dependent on the uplink transmission mode.",
"When a transmission mode supporting only DCI 0 is selected in control information for an uplink, PDCCH receiving section 207 blind-decodes DCI 0 in both the PDCCH region and the R-PDCCH region.",
"When PDCCH receiving section 207 blind-decodes 2 DCI formats in the R-PDCCH region, if 16 candidates are blind-decoded in the respective DCI formats, the number of blind decoding operations in the R-PDCCH region is doubled to 32.When terminal 200 configures the number of blind decoding operations as described above, the number of blind decoding operations (32 operations) in the R-PDCCH region is greater than the number of blind decoding operations (28 operations) in the PDCCH region.",
"That is, terminal 200 is more likely to receive DCI for terminal 200 in the R-PDCCH region where other cell interference is more likely to be reduced.",
"Thus, when DCI for a terminal connected to a base station is mapped to a PDCCH region and an R-PDCCH region, the present embodiment can further reduce the possibility of receiving other cell interference.",
"This allows desired receiving quality in the terminal to be secured.",
"Furthermore, according to the present embodiment, the base station configures search spaces for each DCI format.",
"By so doing, the base station can configure search spaces for each DCI format in an appropriate transmission region among the PDCCH region and the R-PDCCH region depending on features of each DCI format (e.g., usage frequency and receiving quality at a location where usage is anticipated).",
"On a downlink, a DCI format commonly used among a plurality of transmission modes is used mainly when receiving quality drastically deteriorates or when a change in the transmission mode cannot be followed or the like.",
"Therefore, the usage frequency of a DCI format dependent on the transmission mode is considered to be higher than the usage frequency of a DCI format commonly used among a plurality of transmission modes regardless of the transmission mode.",
"As in the case of the present embodiment, the terminal disposes a DCI format with a high usage frequency in the R-PDCCH region, and the R-PDCCH region is thereby mainly used.",
"By so doing, the base station can more easily control interference with other cells caused by the R-PDCCH in the frequency-domain.",
"Furthermore, the terminal can receive DCI transmitted with interference controlled with desired receiving quality.",
"Furthermore, the number of information bits of DCI 0/1A is less than the number of information bits of other DCI dependent on the transmission mode.",
"For this reason, when the same number of CCEs is configured, the base station can transmit data at a lower coding rate in DCI 0/1A than in DCI 1, 1B, 1D, 2, 2A, 2B and 2C, 0A, 0B and 4.That is, when DCI 0/1A is configured by focusing on the fact that DCI 0/1A is a format less likely to be influenced by a propagation path situation than other DCI formats, the base station configures DCI 0/1A in the PDCCH region and configures DCI 1, 1B, 1D, 2, 2A, 2B and 2C, 0A, 0B and 4 dependent on the transmission mode in the R-PDCCH region.",
"This makes it possible to reduce the tight condition of the PDCCH region (resources dependent on the transmission mode are allocated to the R-PDCCH region), reduce influences of interference (DCI less likely to be influenced by the propagation path situation is allocated to the PDCCH region), and thereby achieve their respective required receiving qualities.",
"Furthermore, when DCI 0/1A is configured in the PDCCH region and search spaces in the R-PDCCH region are thereby changed, even if the terminal fails to receive a control signal for reporting a change in the search spaces and a difference in recognition of the search spaces is produced between the terminal and the base station, the terminal can receive DCI 0/1A transmitted in the PDCCH region and continue communication.",
"Furthermore, even for a period during which search spaces are changed in the R-PDCCH region, the terminal can receive DCI 0/1A transmitted to the PDCCH region and continue communication.",
"A case has been described in the present embodiment where when a transmission mode supporting only DCI 0 is selected in uplink control information, the terminal blind-decodes DCI 0 in both the PDCCH region and the R-PDCCH region.",
"However, the terminal may also blind-decode DCI 0 only in the PDCCH region.",
"By so doing, it is possible to reduce the number of decoding operations on the uplink control information.",
"Embodiment 5 A case has been described in Embodiment 3 where attention is focused on whether a DCI format is dependent on the transmission mode or not as an example of configuring search spaces for each DCI format.",
"In contrast, the present embodiment will describe a case where attention is focused on DCI format family 1 and DCI format family 2 as an example of configuring search spaces for each DCI format.",
"Since basic configurations of a base station and a terminal according to the present embodiment are common to those in Embodiment 1, these configurations will be described using FIG.",
"6 and FIG.",
"8.In the present embodiment, operation of search space configuration section 103 of base station 100 shown in FIG.",
"6 is different from that of Embodiment 1.FIG.",
"14 illustrates an internal configuration of search space configuration section 103 according to the present embodiment.",
"As shown in FIG.",
"14, search space configuration section 103 according to the present embodiment has a configuration including transmission mode decision section 141 and configuration section 142.Transmission mode decision section 141 decides a transmission mode configured for terminal 200 using configuration information inputted from configuration section 101.To be more specific, transmission mode decision section 141 decides using the configuration information whether the downlink transmission mode configured for terminal 200 is a transmission mode including DCI format family 1 or a transmission mode including DCI format family 2.Transmission mode decision section 141 outputs the decided transmission mode to configuration section 142.Configuration section 142 configures common search spaces (C-SSs) and specific search spaces (UE-SSs) based on a DCI transmission region indicated by the configuration information inputted from configuration section 101 (only PDCCH region or R-PDCCH region, or both PDCCH region and R-PDCCH region) and the transmission mode inputted from transmission mode decision section 141.For example, a case will be described where both a PDCCH region and an R-PDCCH region are configured as DCI transmission regions.",
"Upon deciding that a transmission mode including DCI format family 1 is configured as the DCI format dependent on the transmission mode among downlink transmission modes, configuration section 142 configures DCI allocation region candidates (blind decoding region candidates) of specific search spaces (UE-SSs) in the PDCCH region.",
"On the other hand, upon deciding that a transmission mode including DCI format family 2 is configured as the downlink transmission mode, configuration section 142 configures DCI allocation region candidates (blind decoding region candidates) of specific search spaces (UE-SSs) in the PDCCH region and the R-PDCCH region, and configuration section 142 further configures DCI allocation region candidates in a DCI format not dependent on the transmission mode in the PDCCH region, and configures DCI allocation region candidates in a DCI format dependent on the transmission mode in the R-PDCCH region.",
"The present embodiment does not impose any restrictions on whether C-SSs should be configured in the PDCCH region or R-PDCCH region.",
"However, configuration section 142 may configure C-SSs in the PDCCH region in consideration that a load balance should be kept between the PDCCH region and R-PDCCH region or that an error resistant DCI format should be disposed in C-SSs.",
"Furthermore, configuration section 142 may configure a DCI format subjected to Temporary C-RNTI which is used only for RACH processing in the PDCCH region.",
"This is because the configuration such as allocation of the R-PDCCH region or the like is not performed at timing of RACH processing.",
"Allocating section 106 allocates DCI containing allocation control information to CCEs in C-SSs or UE-SSs using search space information from search space configuration section 103.To be more specific, allocating section 106 allocates DCI corresponding to DCI format family 2 (e.g., DCI 2, 2A, 2B and 2C) of allocation control information dependent on the transmission mode configured for the terminal to CCEs in UE-SSs in the R-PDCCH region.",
"Furthermore, allocating section 106 allocates DCI corresponding to DCI format family 1 (e.g., DCI 1, 1B and 1D) of allocation control information dependent on the transmission mode configured for the terminal to CCEs in UE-SSs in the PDCCH region.",
"Furthermore, allocating section 106 allocates DCI containing allocation control information for common channels (e.g., DCI 1C and 1A) to CCEs in C-SSs.",
"Furthermore, allocating section 106 allocates DCI containing allocation control information for the allocation of data used in a plurality of transmission modes (e.g., DCI 0/1A) to CCEs in C-SSs or CCEs in UE-SSs.",
"In contrast, in terminal 200, PDCCH receiving section 207 blind-decodes DCI containing allocation control information for common channels (e.g., DCI 1C and 1A) and DCI containing allocation control information for the allocation of data used in plurality of transmission modes (e.g., DCI 0/1A) for C-SSs indicated by a search space region indicated by the search space region information inputted from configuration information receiving section 206.Furthermore, PDCCH receiving section 207 blind-decodes DCI containing allocation control information for the allocation of data used in a plurality of transmission modes (e.g., DCI 0/1A) and DCI containing allocation control information dependent on the transmission mode configured for terminal 200 (e.g., uplink (DCI 0A, 0B and 4), downlink (DCI 1, 1B and 1D, 2, 2A, 2B and 2C)) for UE-SSs indicated by a search space region indicated by the search space region information inputted from configuration information receiving section 206.That is, for C-SSs, terminal 200 performs blind decoding on two DCI formats (DCI 1C and 1A and DCI 0/1A).",
"On the other hand, for UE-SSs, terminal 200 performs blind decoding on three DCI formats (DCI dependent on the uplink transmission mode (DCI 0A, 0B and 4), DCI dependent on the downlink transmission mode (DCI 1, 1B, 1D, 2, 2A, 2B and 2C) and DCI 0/1A).",
"However, when the uplink transmission mode supports only DCI0, terminal 200 performs blind decoding on two DCI formats.",
"When the search space region information is predetermined by a cell ID or the like or even when the search space region information is decided not to be updated, if the transmission mode configured for terminal 200 includes DCI format family 2, PDCCH receiving section 207 may perform blind decoding for UE-SSs limited to the R-PDCCH region.",
"Furthermore, when the transmission mode configured for terminal 200 includes DCI format family 1, PDCCH receiving section 207 may perform blind decoding for UE-SSs limited to the PDCCH region.",
"Furthermore, PDCCH receiving section 207 may perform blind decoding for C-SSs limited to the PDCCH region.",
"Even when the search space region information is not updated (when configuration information from an upper layer is not updated simultaneously with update of the transmission mode), if a transmission mode including DCI format family 1 is configured, PDCCH receiving section 207 may perform blind decoding for UE-SSs limited to the PDCCH region.",
"For example, a case will be described where a transmission mode including DCI format family 2 is configured and both a PDCCH region and an R-PDCCH region are configured in the search space region information.",
"That is, terminal 200 performs blind decoding for UE-SSs in both the PDCCH region and the R-PDCCH region.",
"In this case, when the search space region information is not updated and the transmission mode is changed to one including DCI format family 1, PDCCH receiving section 207 performs blind decoding operations for UE-SSs limited to the PDCCH region.",
"That is, although the search space region information is configured such that the R-PDCCH region is included as a search space, if a transmission mode including DCI format family 1 is configured, PDCCH receiving section 207 blind-decodes only the PDCCH region as a search space.",
"Furthermore, when the transmission mode is changed to a transmission mode including DCI format family 2 again, terminal 200 may use the configuration of the newest R-PDCCH region in the reported configuration information.",
"By so doing, terminal 200 need not configure an R-PDCCH region every time the transmission mode is changed, and can thereby reduce control signals for configuring the R-PDCCH region.",
"Here, among the downlink DCI formats (DCI 1A, 1, 1B and 1D, 2, 2A, 2B and 2C), DCI format family 2 (DCI 2, 2A, 2B and 2C) is control information to allocate spatial multiplexing MIMO transmission corresponding to a plurality of layers.",
"Thus, DCI format family 2 has more information bits than other downlink DCI formats.",
"Furthermore, a terminal to which DCI format family 2 is applied is a terminal supporting spatial multiplexing MIMO transmission adaptable to a plurality of layers.",
"Thus, DM-RSs are more likely to be indicated to be used as reference signals for the terminal.",
"Furthermore, as shown in FIG.",
"15, when reference signals used are CRSs, a frequency diversity effect is obtained in the PDCCH region in common among terminals.",
"For this reason, when reference signals used are CRSs, there are assumed to be no differences in reception performance (e.g., reception SINR) depending on the location where search spaces are configured.",
"On the other hand, as shown in FIG.",
"15, when reference signals used are DM-RSs, the location where search spaces are configured is an R-PDCCH region.",
"When reference signals used are DM-RSs, it is possible to obtain an effect that a frequency resource having good reception performance is specifically selected for the corresponding terminal (frequency selectivity effect) and a precoding gain through beam forming specifically adjusted for the terminal.",
"For this reason, when reference signals used are DM-RSs, improvement in reception performance (reception SINR) can be expected.",
"That is, when reference signals used are DM-RSs, it is possible to further improve reception performance (reception SINR) and reduce the number of CCEs required compared to a case where reference signals used are CRSs.",
"That is, the greater the number of information bits of control information used, the greater the effect of a reduction in the number of CCEs used becomes.",
"Thus, when a transmission mode including DCI format family 2 with many information bits is configured, base station 100 (search space configuration section 103) configures more UE-SSs in the R-PDCCH region and allocating section 106 allocates DCI to CCEs in UE-SSs configured in the R-PDCCH region.",
"By so doing, DM-RSs are more likely to be configured in the transmission mode including DCI format family 2.It is thereby possible to reduce the number of CCEs used in the transmission mode including DCI format family 2 and reduce the resource amount used in the PDCCH region and R-PDCCH region as a whole.",
"In other words, when the resource amount used is assumed to be constant, more terminals can be accommodated.",
"Furthermore, for example, in a HetNet environment, since an arrangement of resources in the PDCCH region is defined beforehand by a cell ID or the like, it is difficult to avoid interference.",
"In contrast, in the HetNet environment, since an arrangement of resources in the R-PDCCH region can be scheduled, it is possible to avoid interference.",
"Thus, interference among cells is more likely to be reduced through interference control or the like in an R-PDCCH region than in a PDCCH region.",
"That is, the reception performance (reception SINR) is more likely to be improved in an R-PDCCH region than in a PDCCH region.",
"On the other hand, when the same number of CCEs is configured in a downlink DCI format, as shown in FIG.",
"16, a DCI format with more information bits has a larger M-ary modulation value and a higher coding rate.",
"That is, as shown in FIG.",
"16, a DCI format with more information bits has lower error resistance.",
"Thus, when a transmission mode including DCI format family 2 with more information bits is configured, base station 100 (search space configuration section 103) configures more UE-SSs in the R-PDCCH region and allocating section 106 allocates DCI to CCEs in UE-SSs configured in the R-PDCCH region.",
"By so doing, it is possible to transmit a DCI format of weak error resistance (DCI format family 2) in the R-PDCCH region having better reception performance than in the PDCCH region.",
"That is, search space configuration section 103 can configure search spaces capable of securing desired receiving quality for the DCI format of low error resistance (DCI format family 2).",
"In contrast, when the same number of CCEs is configured in a downlink DCI format, as shown in FIG.",
"16, a DCI format having fewer information bits has a smaller M-ary modulation value and a lower coding rate.",
"That is, as shown in FIG.",
"16, a DCI format having fewer information bits has higher error resistance.",
"Among downlink DCI formats (DCI 1A, 1, 1B and 1D, 2, 2A, 2B and 2C), DCI format family 1 (DCI 1, 1B and 1D) is control information for allocating transmission corresponding to a single layer.",
"For this reason, DCI format family 1 has fewer information bits than DCI format family 2.Therefore, when a transmission mode including DCI format family 1 having fewer information bits is configured, base station 100 (search space configuration section 103) configures more UE-SSs in the PDCCH region and allocating section 106 allocates DCI to CCEs in UE-SSs configured in the PDCCH region.",
"By so doing, a DCI format having high error resistance (DCI format family 1) is transmitted in the PDCCH region of poorer reception performance than the R-PDCCH region.",
"That is, even when transmitting a DCI format having high error resistance in a transmission region of poor reception performance, search space configuration section 103 can configure search spaces capable of securing desired receiving quality.",
"Furthermore, by configuring a DCI format having low error resistance (DCI format family 2) in the R-PDCCH region and configuring a DCI format having high error resistance (DCI format family 1) in the PDCCH region, base station 100 can keep a load balance relating to resource utilization between the PDCCH region and R-PDCCH region.",
"In this way, base station 100 determines in which region (PDCCH region or R-PDCCH region) DCI should be transmitted in consideration of the situation of each terminal (e.g., position of the terminal, magnitude of other cell interference, traffic situation (e.g., “PDCCH region is becoming tight as the number of communicating terminals increases”) or the like).",
"To be more specific, the base station configures a specific DCI format having the large amount of information (e.g., DCI format family 2) in the R-PDCCH region.",
"Furthermore, the base station configures a specific DCI format having the small amount of information (DCI format family 1) in the PDCCH region.",
"Thus, it is possible to prevent throughput deterioration caused by the tight condition of the PDCCH region or R-PDCCH region in the entire system.",
"Furthermore, each terminal can receive DCI using resources (PDCCH transmission region) suitable for a situation of each terminal and secure desired receiving quality in the terminal.",
"Therefore, according to the present embodiment, even when DCI for a terminal connected to a base station is allocated to a PDCCH region and an R-PDCCH region, it is possible to secure desired receiving quality in the terminal without causing system throughput to deteriorate.",
"The present embodiment has described a DCI format dependent on a downlink transmission mode in particular.",
"However, the present embodiment may also apply operation similar to that of DCI format family 2 to DCI format 4 (DCI 4) in which spatial multiplexing MIMO transmission is allocated in a DCI format dependent on an uplink transmission mode.",
"Furthermore, the above-described operation whereby DCI format 4 is configured in an R-PDCCH region may be limited to only a case where DCI format family 2 is used as a downlink transmission mode.",
"Embodiment 6 A case has been described in Embodiments 1 to 3 where the base station configures search spaces based on the relationship of the number of DCI allocation region candidates (number of blind decoding region candidates) between a PDCCH region and an R-PDCCH region in the terminal.",
"In contrast, in the present embodiment, the base station configures search spaces based on the relationship in a search space size (the number of CCEs constituting a search space) between a PDCCH region and an R-PDCCH region.",
"Since basic configurations of a base station and a terminal according to the present embodiment are common to those in Embodiment 1, these configurations will be described using FIG.",
"6 and FIG.",
"8.In the following description, as in the case of Embodiment 1, 6 DCI allocation region candidates (blind decoding region candidates) in total (total 32 CCEs); 4 candidates (16 CCEs) for CCE aggregation level 4 and 2 candidates (16 CCEs) for CCE aggregation level 8, are configured as C-SSs.",
"Furthermore, 16 DCI allocation region candidates (blind decoding region candidates) (total 42 CCEs) in total; 6 candidates (6 CCEs), 6 candidates (12 CCEs), 2 candidates (8 CCEs) and 2 candidates (16 CCEs) for CCE aggregation levels 1, 2, 4 and 8 respectively are configured as UE-SSs.",
"That is, search spaces (C-SS and UE-SS) composed of 74 CCEs in total are configured for each terminal.",
"Search space configuration section 103 of base station 100 according to the present embodiment configures search spaces for each terminal so that the ratio of the search space size (that is, the number of CCEs constituting a search space) in an R-PDCCH region to the search space size in a PDCCH region is greater in a terminal using DM-RSs in the R-PDCCH region than in a terminal using CRSs in the R-PDCCH region.",
"For example, as shown in FIG.",
"17A, for a certain terminal using CRSs in the R-PDCCH region, search space configuration section 103 configures C-SSs of 32 CCEs in total; 2 candidates (16 CCEs) of CCE aggregation level 8 and 4 candidates (16 CCEs) of CCE aggregation level 4, and configures UE-SSs of 24 CCEs in total; 2 candidates (16 CCEs) of CCE aggregation level 8 and 2 candidates (8 CCEs) of CCE aggregation level 4 in the PDCCH region.",
"Furthermore, as shown in FIG.",
"17B, for a certain terminal using CRSs in the R-PDCCH region, search space configuration section 103 configures UE-SSs of 18 CCEs in total; 6 candidates (12 CCEs) of CCE aggregation level 2 and 6 candidates (6 CCEs) of CCE aggregation level 1 in the R-PDCCH region.",
"On the other hand, as shown in FIG.",
"17A, for a certain terminal using DM-RSs in the R-PDCCH region, search space configuration section 103 configures UE-SSs of 18 CCEs in total; 6 candidates (12 CCEs) of CCE aggregation level 2 and 6 candidates (6 CCEs) of CCE aggregation level 1 in the PDCCH region.",
"Furthermore, as shown in FIG.",
"17B, for a certain terminal using DM-RSs in the R-PDCCH region, search space configuration section 103 configures C-SSs of 32 CCEs in total; 2 candidates (16 CCEs) of CCE aggregation level 8 and 4 candidates (16 CCEs) of CCE aggregation level 4 in the R-PDCCH region, and configures UE-SSs of 24 CCEs in total; 2 candidates (16 CCEs) of CCE aggregation level 8 and 2 candidates (8 CCEs) of CCE aggregation level 4.That is, search space configuration section 103 configures search spaces (C-SS and UE-SS) so that the ratio of the search space size (56 CCEs) in the R-PDCCH region to the search space size (18 CCEs) in the PDCCH region for terminal 200 using DM-RSs in the R-PDCCH region (56/18) is equal to or greater than the ratio of the search space size (18 CCEs) in the R-PDCCH region to the search space size (56 CCEs) in the PDCCH region in terminal 200 using CRSs in the R-PDCCH region (18/56).",
"The configuration of search spaces is not limited to the above-described one, but as shown in configuration method 3 of Embodiment 2, for a certain terminal using DM-RSs in the R-PDCCH region, C-SSs of 32 CCEs in total may be configured in the PDCCH region; 2 candidates (16 CCEs) of CCE aggregation level 8 and 4 candidates (16 CCEs) of CCE aggregation level 4, and UE-SSs of 32 CCEs in total may be configured in the R-PDCCH region; 2 candidates (16 CCEs) of CCE aggregation level 8, 2 candidates (8 CCEs) of CCE aggregation level 4, 6 candidates (12 CCEs) of CCE aggregation level 2 and 6 candidates (6 CCEs) of CCE aggregation level 1.In this case, search spaces (C-SS and UE-SS) are also configured so that the ratio of the search space size (32 CCEs) in the R-PDCCH region to the search space size (32 CCEs) in the PDCCH region for terminal 200 using DM-RSs in the R-PDCCH region (32/32) is equal to or above the ratio of the search space size (18 CCEs) in the R-PDCCH region to the search space size (56 CCEs) in the PDCCH region for terminal 200 using CRSs in the R-PDCCH region (18/56).",
"That is, as shown in FIG.",
"17B, in the R-PDCCH region, search space configuration section 103 can configure search spaces using more CCEs for a terminal using DM-RSs in the R-PDCCH region (terminal having greater other cell interference) than a terminal using CRSs in the R-PDCCH region.",
"Furthermore, as described above, other cell interference is more likely to be reduced in the R-PDCCH region than in the PDCCH region through interference control or the like.",
"Thus, for a terminal using DM-RSs, DCI is more likely to be received in the R-PDCCH region that occupies a greater part (more CCEs) of the configured search space.",
"Therefore, the terminal using DM-RSs obtains a PDCCH received signal power improving effect using DM-RSs (see FIG.",
"3) while suppressing influences from other cell interference in the R-PDCCH region, and can thereby secure desired receiving quality in the terminal.",
"Here, for example, for a terminal using CRSs in the R-PDCCH region, base station 100 allocates data in search spaces using relatively more CCEs in the PDCCH region.",
"On the other hand, for a terminal using DM-RSs in the R-PDCCH region, base station 100 allocates data in search spaces using relatively more CCEs in the R-PDCCH region.",
"This makes it possible to maintain a load balance in a PDCCH to which control information for each terminal is allocated.",
"That is, it is possible to avoid PDCCHs from being biased to a specific region preventing PDCCHs from being transmitted within a limited region.",
"This prevents throughput deterioration caused by the tight condition of the PDCCH region and R-PDCCH region.",
"Furthermore, base station 100 may use, for example, a PDCCH region or an R-PDCCH region using CRSs (reference signals capable of obtaining a frequency diversity effect) for DCI for a terminal that is moving fast (with a violent fluctuation in the received signal level).",
"On the other hand, base station 100 may use an R-PDCCH region using DM-RSs (reference signals that allow received signal power to be improved) for DCI for a terminal located near a cell edge (with a low received signal level).",
"This makes it possible to realize search space allocation capable of securing desired receiving quality regardless of the moving speed or location area or the like of a terminal.",
"This allows each terminal to receive DCI using resources suitable for a situation of each terminal (PDCCH transmission region) and secure desired receiving quality of the terminal.",
"Thus, according to the present embodiment, even when mapping DCI for a terminal connected to a base station onto the PDCCH region and R-PDCCH region, it is possible to secure desired receiving quality in a terminal without causing system throughput to deteriorate.",
"A case has been described in the present embodiment where a terminal using CRSs and a terminal using DM-RSs coexist in the R-PDCCH region.",
"In contrast, the present embodiment is also applicable to a case where reference signals used for each terminal in an R-PDCCH region are fixedly configured.",
"For example, base station 100 may configure search spaces so that the search space size in the R-PDCCH region is equal to or greater than the search space size in the PDCCH region as in the case of configuration method 1 in Embodiment 2 (when DCI allocation region candidates are used).",
"For example, as shown in FIG.",
"18, search space configuration section 103 configures UE-SSs of 18 CCEs in total in a PDCCH region for a certain terminal using only CRSs in an R-PDCCH region and configures C-SSs of 32 CCEs in total and UE-SSs of 24 CCEs in total in the R-PDCCH region.",
"That is, in FIG.",
"18, the search space size in the R-PDCCH region (56 CCEs) is greater than the search space size in the PDCCH region (18 CCEs).",
"Thus, by increasing the ratio of the search space configured in the R-PDCCH region among search spaces configured in terminal 200, terminal 200 is more likely to receive DCI in the R-PDCCH region that occupies a greater part (more CCEs) of the configured search space.",
"This allows terminal 200 to suppress influences of other cell interference and secure desired receiving quality.",
"Furthermore, the present embodiment is not limited to Embodiment 1 and configuration method 1 of Embodiment 2, but may configure search spaces based on a search space size in the same way as configuration methods 2 and 3 of Embodiment 2 and Embodiment 3 (when the number of blind decoding operations is used).",
"Embodiment 7 The present embodiment will describe a case where a TDM+FDM configuration is applied to an R-PDCCH region.",
"However, suppose whether the R-PDCCH region has an FDM configuration or a TDM+FDM configuration is configured beforehand.",
"Since basic configurations of a base station and a terminal according to the present embodiment are common to those in Embodiment 1, these configurations will be described using FIG.",
"6 and FIG.",
"8.In the present embodiment, operation of search space configuration section 103 of base station 100 shown in FIG.",
"6 is different from that of Embodiment 1.FIG.",
"19 shows an internal configuration of search space configuration section 103 according to the present embodiment.",
"In base station 100 according to the present embodiment, search space configuration section 103 adopts a configuration including transmission format decision section 151, data allocation decision section 152 and configuration section 153.Transmission format decision section 151 decides a DCI format configured for terminal 200 using configuration information inputted from configuration section 101.To be more specific, transmission format decision section 151 decides whether or not the transmission format configured for terminal 200 is a common DCI format and whether or not the transmission format is DCI 1A corresponding to downlink allocation control information subject to consecutive band allocation.",
"Transmission format decision section 151 outputs the decision result to configuration section 153.Data allocation decision section 152 decides whether or not transmission data is allocated to terminal 200.Data allocation decision section 152 outputs the decision result to configuration section 153.Configuration section 153 configures common search spaces (C-SSs) and specific search spaces (UE-SSs).",
"For example, when both a PDCCH region and an R-PDCCH region are configured as DCI transmission regions, configuration section 153 configures search spaces (C-SS and UE-SS) having the aforementioned plurality of DCI allocation region candidates in the PDCCH region and R-PDCCH region.",
"Particularly, configuration section 153 configures search spaces for disposing DCI 0 which is a common DCI format and which corresponds to uplink allocation control information subject to consecutive band allocation based on a DCI transmission region indicated by the configuration information inputted from configuration section 101 (only PDCCH region or R-PDCCH region, or both PDCCH region and R-PDCCH region), the decision result inputted from transmission format decision section 151 (DCI 1A or not) and the decision result inputted from data allocation decision section 152 (presence or absence of data allocation).",
"To be more specific, as shown in FIG.",
"20, when DCI 1A is configured for terminal 200 (format 1A: Yes) or when there is data allocation (data allocation: Yes), configuration section 153 configures search spaces (C-SS or UE-SS) for disposing DCI 0 in the PDCCH region.",
"As described above, to suppress an increase in the number of blind decoding operations, C-SSs are more likely to be indicated for DCI 0.On the other hand, as shown in FIG.",
"20, when DCI 1A is not configured for terminal 200 (format 1A: No) and when there is no data allocation (data allocate: No), configuration section 153 configures search spaces (C-SS or UE-SS) for disposing DCI 0 in slot 1 (2nd slot) of the R-PDCCH region.",
"UE-SSs are more likely to be indicated for DCI 0 also in consideration of a case where DM-RSs are configured in the R-PDCCH region.",
"Allocating section 106 then allocates DCI containing allocation control information to CCEs in C-SSs or UE-SSs using search space information from search space configuration section 103.In particular, allocating section 106 allocates DCI corresponding to DCI 0 to a transmission region (PDCCH region or slot 1 (2nd slot) of the R-PDCCH region) configured by configuration section 153 of search space configuration section 103.In contrast, PDCCH receiving section 207 in terminal 200 blind-decodes DCI containing allocation control information for common channels (e.g., DCI 1C and 1A) and DCI containing allocation control information for the allocation of data common to all the terminals (e.g., DCI 0/1A) for C-SSs indicated by a search space region indicated by the search space region information inputted from configuration information receiving section 206.Furthermore, PDCCH receiving section 207 blind-decodes DCI containing allocation control information for the allocation of data common to all the terminals (e.g., DCI 0/1A) and DCI containing allocation control information dependent on the transmission mode configured for terminal 200 (e.g., uplink (DCI 0A, 0B and 4), downlink (DCI 1, 1B and 1D, 2, 2A, 2B and 2C)) for UE-SSs indicated by the search space region indicated by the search space region information inputted from configuration information receiving section 206.Particularly, PDCCH receiving section 207 specifies search spaces in which DCI 0 for terminal 200 is disposed based on the detection result of DCI 1A for terminal 200 and the presence or absence of data allocation for terminal 200.The search space configuration method according to the present embodiment will be described more specifically below.",
"As described above, the following matters should be considered about an R-PDCCH region in a TDM+FDM configuration with respect to a relay station (relay node).",
"(a) A DL grant is transmitted in slot 0 (1st slot) and a UL grant is transmitted in slot 1 (2nd slot).",
"(b) When a data signal (PDSCH) is indicated by an R-PDCCH, a PDSCH is transmitted using only slot 1 or both slot 0 and slot 1 (that is, data transmission in only slot 0 is not possible).",
"The above-described matters about the R-PDCCH region with respect to the relay station are also more likely to be applicable to the R-PDCCH region with respect to the terminal.",
"Thus, as shown in case 1 in FIG.",
"21, when DCI 1A is configured in the PDCCH region as a DL grant for terminal 200, search space configuration section 103 configures a search space for disposing DCI 0 in the PDCCH region.",
"Upon detecting DCI 1A (DL grant) for terminal 200 in the PDCCH region, PDCCH receiving section 207 decides that DCI 0 for terminal 200 is configured in the PDCCH region.",
"PDCCH receiving section 207 then limits blind decoding on DCI 0 to the PDCCH region.",
"Thus, as shown in case 1 in FIG.",
"21, since DCI 1A and DCI 0 are disposed together in the PDCCH region, base station 100 can allocate data in the R-PDCCH region.",
"Alternatively, base station 100 can use the R-PDCCH region as a PDSCH and an R-PDCCH for another apparatus (relay station or other terminal).",
"As shown in case 2 in FIG.",
"21, when DCI 1A for terminal 200 is not configured and data is allocated, search space configuration section 103 configures a search space for disposing DCI 0 in the PDCCH region.",
"When no DCI 1A for terminal 200 is not detected in the PDCCH region, PDCCH receiving section 207 decides that DCI 0 directed to terminal 200 is configured in slot 1 (2nd slot) of the PDCCH region or R-PDCCH region.",
"PDCCH receiving section 207 then limits blind decoding on DCI 0 to slot 1 (2nd slot) of the PDCCH region or R-PDCCH region.",
"For example, as a result of detecting downlink control information (DCI 1, 1B and 1D, 2, 2A, 2B and 2C) dependent on the transmission mode in slot 0 (1st slot) of the R-PDCCH region, if data allocation is found, PDCCH receiving section 207 decides that DCI 0 is configured in the PDCCH region.",
"PDCCH receiving section 207 then limits blind decoding on DCI 0 to the PDCCH region.",
"Thus, as shown in case 2 in FIG.",
"21, base station 100 can allocate a DL grant to slot 0 (1st slot) in the R-PDCCH region and allocate data to slot 1 (2nd slot) in the R-PDCCH region.",
"Furthermore, as shown in case 3 in FIG.",
"21, when no DCI 1A for terminal 200 is configured and no data allocation is found, search space configuration section 103 configures a search space for disposing DCI 0 in slot 1 (2nd slot) of the R-PDCCH region.",
"When DCI 1A for terminal 200 is not detected in the PDCCH region, and data allocation is not found as a result of detecting downlink control information dependent on the transmission mode for terminal 200 (DCI 1, 1B and 1D, 2, 2A, 2B and 2C) in slot 0 (1st slot) of the R-PDCCH region, PDCCH receiving section 207 decides that DCI 0 is configured in slot 1 (2nd slot) of the R-PDCCH region.",
"PDCCH receiving section 207 then limits blind decoding on DCI 0 to slot 1 (2nd slot) of the R-PDCCH region.",
"Thus, as shown in case 3 in FIG.",
"21, base station 100 disposes DCI 0 in the R-PDCCH region, and can thereby reduce the resource amount (that is, overhead) used in the PDCCH region.",
"Alternatively, base station 100 can use the PDCCH region for other terminals.",
"When no search space region information is inputted from configuration information receiving section 206 (when base station 100 does not transmit search space information), PDCCH receiving section 207 may perform blind decoding in a plurality of DCI transmission regions which may be directed to terminal 200 without being aware of search spaces of terminal 200.In this case, PDCCH receiving section 207 may also decide blind decoding locations of DCI 0 based on whether DCI 1A is detected in the PDCCH region or not and whether data is allocated or not.",
"Whether data is allocated or not is decided based on whether a DCI format of downlink allocation control information dependent on the transmission mode is detected in slot 0 (1st slot) of the R-PDCCH region or not.",
"That is, upon detecting DCI 1A in the PDCCH region, PDCCH receiving section 207 decides that DCI 0 is also configured in the same search space and blind-decodes the PDCCH region.",
"On the other hand, upon not detecting DCI 1A (nor detecting DCI 0 in the PDCCH region), PDCCH receiving section 207 decides that DCI 0 is disposed in slot 1 (2nd slot) of the R-PDCCH region.",
"When no data allocation is found as a result of detecting a DCI format of downlink allocation control information dependent on the transmission mode in slot 0 (1st slot) of the R-PDCCH region, PDCCH receiving section 207 decides that DCI 0 is disposed in slot 1 (2nd slot) of the R-PDCCH region.",
"Furthermore, when data allocation is found (and DCI 0 is not detected in the PDCCH region), PDCCH receiving section 207 may decide that uplink allocation control information dependent on the transmission mode (one of DCI 0A, 0B and 4) is disposed in slot 1 (2nd slot) of the R-PDCCH region and perform blind decoding.",
"In this way, according to the present embodiment, when the R-PDCCH region has a TDM+FDM configuration, the base station disposes DCI 0 in the PDCCH region or slot 1 (2nd slot) of the R-PDCCH region based on the presence or absence of DCI 1A and the presence or absence of data allocation.",
"This allows the base station to improve flexibility of scheduling and effectively use resources.",
"Furthermore, since DCI 0 is also disposed in slot 1 (2nd slot) of the R-PDCCH region, it is possible to reduce resources used in the PDCCH region.",
"Furthermore, DCI 0 is also disposed in slot 1 (2nd slot) of the R-PDCCH region, which increases the probability that the number of necessary CCEs may be reduced as described above, and it is possible to reduce resources used in the PDCCH region and R-PDCCH region as a whole.",
"In other words, when the resource amount used is assumed to be constant, more terminals can be accommodated.",
"Thus, according to the present embodiment, even when DCI for a terminal connected to a base station is mapped onto a PDCCH region and an R-PDCCH region, it is possible to secure desired receiving quality in the terminal without causing system throughput to deteriorate.",
"Each embodiment of the present invention has been described hereinbefore.",
"In each embodiment above, the base station and terminal may store allocation patterns (e.g., FIG.",
"22) of blind decoding region candidates in respective search spaces of the PDCCH region and R-PDCCH region.",
"For example, in the case of search spaces in pattern number 2 shown in FIG.",
"22, C-SSs of 6 candidates in total; 2 candidates of CCE aggregation level 8 and 4 candidates of CCE aggregation level 4, and UE-SSs of 4 candidates in total; 2 candidates of CCE aggregation level 8 and 2 candidates of CCE aggregation level 4 are configured in the PDCCH region, and UE-SSs of 12 candidates in total; 6 candidates of CCE aggregation level 2 and 6 candidates of CCE aggregation level 1 are configured in the R-PDCCH region.",
"The same applies to search spaces with other pattern numbers shown in FIG.",
"22.For example, the base station may report pattern numbers shown in FIG.",
"22 to the terminal depending on the situation (moving speed, position or the like) of each terminal.",
"Alternatively, the base station may select a search space that allows a blocking probability to be reduced every time (e.g., subframe by subframe) and report the selected pattern number to the terminal.",
"Furthermore, the present invention is not limited to the above embodiments, but may be implemented modified in various ways.",
"For example, the present invention may be implemented by combining the respective embodiments as appropriate depending on the situation of each terminal.",
"Furthermore, Cell-Radio Network Temporary Identifier (C-RNTI) may also be used for the terminal ID in the above embodiments.",
"Furthermore, the expression “DCI format common to all the terminals” in the above embodiments may also be read as “DCI format independent of a transmission mode.” Although a case has been described in the above embodiments where DCI 0/1A is used as “DCI format common to all the terminals,” the present invention is not limited to this, but any format may be used if it can be used regardless of a transmission mode.",
"Furthermore, a case has been described in the above embodiments where DCI 0A, 0B, 1, 1B, 1D, 2 or 2A is used as DCI dependent on the transmission mode.",
"However, formats other than DCI 1, 1B, 1D, 2, 2A, 2B, 2C, 0A, 0B and 4 may also be used as DCI dependent on the transmission mode.",
"Furthermore, consecutive band allocation transmission may also be included as an uplink or downlink transmission mode.",
"For a terminal in which this transmission mode is set, DCI dependent on the transmission mode is DCI 0 (uplink) and DCI 1A (downlink) respectively.",
"In this case, since the DCI format common to all the terminals and the format dependent on the transmission mode are identical, blind decoding may be performed for UE-SSs on one format for the uplink and downlink respectively.",
"One format in total is used in the case of consecutive band allocation for both the uplink and downlink.",
"Thus, configuring DCI 0/1A for DCI dependent on the transmission mode having a wider search space can prevent an increase in the blocking probability for a terminal to which PDCCH can be allocated using only DCI 0/1A because its propagation path situation is originally poor.",
"Furthermore, CCEs described in the above embodiments are logical resources and when CCEs are disposed in actual physical time/frequency resources, CCEs are disposed distributed over the entire bandwidth within a component band.",
"Furthermore, if only CCEs are divided based on the unit of component band as logical resources, CCEs may be disposed in actual physical time/frequency resources distributed over the entire system band (that is, over all component bands).",
"Furthermore, the terminal may be called “UE” and the base station may be called “Node B” or “BS (Base Station).” Furthermore, the terminal ID may be called “ID” or “UE-ID.” In the foregoing embodiments, the present invention is configured with hardware by way of example, but the invention may also be provided by software in cooperation with hardware.",
"The functional blocks used in the description of the embodiments may be typically implemented as an LSI, an integrated circuit.",
"They may be individual chips, or some of or all of them may be integrated into a single chip.",
"“LSI” is used here, but “IC,” “system LSI,” “super LSI,” or “ultra LSI” may also be adopted depending on the degree of integration.",
"Alternatively, circuit integration may also be implemented using a dedicated circuit or a general processor other than an LSI.",
"After an LSI is manufactured, an FPGA (field programmable gate array) or a reconfigurable processor which enables the reconfiguration of connection and setting of circuit cells in an LSI may be used.",
"If integrated circuit technology appears to replace LSIs as a result of the advancement of semiconductor technology or other derivative technology, the functional blocks could be integrated using this technology.",
"Biotechnology can also be applied.",
"The disclosure of the specification, the drawings, and the abstract included in Japanese Patent Application No.",
"2010-164307, filed on Jul.",
"21, 2010, and Japanese Patent Application No.",
"2011-045088 filed on Mar.",
"2, 2011, is incorporated herein by reference in its entirety.",
"INDUSTRIAL APPLICABILITY The present invention is useful for a mobile communication system.",
"REFERENCE SIGNS LIST 100 base station 101, 142, 153 configuration section 102 control section 103 search space configuration section 104 PDCCH generating section 105, 107, 109 coding/modulation section 106 allocating section 108 transmission weight configuration section 110 multiplexing section 111, 213 IFFT section 112, 214 CP adding section 113, 215 RF transmitting section 114, 201 antenna 115, 202 RF receiving section 116, 203 CP removing section 117, 204 FFT section 118 extracting section 119 IDFT section 120 data receiving section 121 ACK/NACK receiving section 200 terminal 205 demultiplexing section 206 configuration information receiving section 207 PDCCH receiving section 208 PDSCH receiving section 209, 210 modulation section 211 DFT section 212 mapping section 141 transmission mode decision section 151 transmission format decision section 152 data allocation decision section"
]
] |
Patent_15871194
|
[
[
"ORGANIC LIGHT-EMITTING DISPLAY APPARATUS AND METHOD OF MANUFACTURING THE SAME",
"An organic light-emitting display apparatus including a substrate; a display unit which defines an active area of the substrate and includes a thin film transistor; concave-convex portions protruded from the substrate in an area outside the active area; and an encapsulation layer which encapsulates the display unit.",
"The thin film transistor includes an active layer, a gate insulating layer on the active layer, a gate electrode, a source electrode, a drain electrode, and an interlayer insulating layer between the gate electrode and the source electrode, and between the gate electrode and the drain electrode.",
"The concave-convex portions include portions of the gate insulating layer and the interlayer insulating layer, and the encapsulation layer covers the concave-convex portions."
],
[
"1.An organic light-emitting display apparatus comprising: a substrate; a display unit which defines an active area of the substrate, and comprises a thin film transistor and an organic light-emitting device which are connected to each other; and an encapsulation layer which is in the active area and encapsulates the display unit, the encapsulating layer in the active area disposing each of the thin film transistor and the organic light-emitting device between the substrate and the encapsulation layer, wherein the thin film transistor comprises: a gate insulating layer extending to an area outside the active area, and an interlayer insulating layer on the gate insulating layer and extending to the area outside the active area, concave-convex portions are defined by the interlayer insulating layer in the area outside the active area, and the encapsulation layer in the active area is extended from the active area to the area outside the active area to contact each of the concave-convex portions, a top surface of the encapsulation layer in the active area being further from the substrate than a top surface of the encapsulation layer outside the active area.",
"2.The organic light-emitting display apparatus of claim 1, wherein each of the protruding portions comprises a metal layer.",
"3.The organic light-emitting display apparatus of claim 2, wherein the thin film transistor further comprises an active layer, a gate electrode, a source electrode and a drain electrode, the interlayer insulating layer is between the gate electrode and the source electrode, and between the gate electrode and the drain electrode, the organic light-emitting device comprises: a pixel electrode connected to the source electrode or the drain electrode; an intermediate layer on the pixel electrode and comprising an organic emission layer; and an opposite electrode on the intermediate layer, and the protruding portions comprise a same material as that of the gate electrode, the source electrode, the drain electrode or the pixel electrode.",
"4.The organic light-emitting display apparatus of claim 1, wherein the encapsulation layer comprises an inorganic layer, and the inorganic layer contacts the concave-convex portions.",
"5.The organic light-emitting display apparatus of claim 4, wherein the inorganic layer and the interlayer insulating layer comprise a same material.",
"6.The organic light-emitting display apparatus of claim 1, wherein the encapsulation layer has a stacked structure comprising an organic layer and an inorganic layer, and the inorganic layer contacts the concave-convex portions.",
"7.The organic light-emitting display apparatus of claim 6, wherein the stacked structure comprises more than one of the organic layer or the inorganic layer alternated with each other.",
"8.The organic light-emitting display apparatus of claim 6, wherein the inorganic layer and the interlayer insulating layer comprise a same material.",
"9.The organic light-emitting display apparatus of claim 8, wherein the inorganic layer and the interlayer insulating layer each comprises silicon nitride.",
"10.The organic light-emitting display apparatus of claim 1, further comprising a protective layer between the encapsulation layer and the display unit.",
"11.The organic light-emitting display apparatus of claim 1, wherein protruding portions are between the gate insulating layer and the interlayer insulating layer in the area outside the active area and spaced apart from each other.",
"12.The organic light-emitting display apparatus of claim 11, wherein the concave-convex portions are defined by portions of the interlayer insulating layer overlapping the protruding portions and between the protruding portions, and the encapsulation layer in the area outside the active area contacts each of the portions of the interlayer insulating layer overlapping the protruding portions and between the protruding portions."
],
[
"<SOH> BACKGROUND <EOH>"
],
[
"<SOH> SUMMARY <EOH>One or more exemplary embodiment of the invention include an organic light-emitting display apparatus including a thin film encapsulation layer having an improved encapsulation characteristic and a method of manufacturing the organic light-emitting display apparatus.",
"Additional features will be set forth in part in the description which follows and, in part, will be apparent from the description, or may be learned by practice of the exemplary embodiments described herein.",
"According to one or more exemplary embodiment of the invention, an organic light-emitting display apparatus includes a substrate; a display unit which defines an active area of the substrate and includes a thin film transistor; concave-convex portions protruded from the substrate in an area outside the active area; and an encapsulation layer which encapsulates the display unit.",
"The thin film transistor includes an active layer, a gate insulating layer on the active layer, a gate electrode, a source electrode, a drain electrode, and an interlayer insulating layer between the gate electrode and the source electrode, and between the gate electrode and the drain electrode.",
"The concave-convex portions include portions of the gate insulating layer and the interlayer insulating layer, and the encapsulation layer covers the concave-convex portions.",
"Each of the concave-convex portions may have a double-layer structure including the portions of the gate insulating layer and the interlayer insulating layer.",
"The encapsulation layer may include an inorganic layer, and the inorganic layer may contact the concave-convex portions.",
"The inorganic layer and the interlayer insulating layer may include a same material.",
"The inorganic layer and the gate insulating layer may include a same material.",
"The encapsulation layer may include a stacked structure including an organic layer and an inorganic layer, and the inorganic layer may contact the concave-convex portions.",
"The stacked structure may include more than one of the organic layer or the inorganic layer.",
"The inorganic layer and the interlayer insulating layer may include a same material.",
"The inorganic layer and the gate insulating layer may include a same material.",
"The organic light-emitting display apparatus may further include a protective layer between the encapsulation layer and the display unit.",
"According to one or more exemplary embodiment of the invention, an organic light-emitting display apparatus includes a substrate; a display unit which defines an active area of the substrate and includes a thin film transistor and an organic light-emitting device electrically connected to each other; and an encapsulation layer which encapsulates the display unit.",
"The thin film transistor includes a gate insulating layer extending to an area outside the active area, and an interlayer insulating layer on the gate insulating layer and extending to the area outside the active area.",
"Protruding portions are between the gate insulating layer and the interlayer insulating layer in the area outside the active area.",
"The concave-convex portions are defined by the interlayer insulating layer in the area outside the active area, and the encapsulation layer covers the concave-convex portions.",
"Each of the stepped portions may include a metal layer.",
"The thin film transistor may further include an active layer, a gate electrode, a source electrode and a drain electrode.",
"The interlayer insulating layer may be between the gate electrode and the source electrode, and between the gate electrode and the drain electrode.",
"The display unit may further include an organic light-emitting device including a pixel electrode connected to the source electrode or the drain electrode; an intermediate layer on the pixel electrode and including an organic emission layer; and an opposite electrode on the intermediate layer.",
"The protruding portions may include a same material as that of the gate electrode, the source electrode, the drain electrode or the pixel electrode.",
"The encapsulation layer may include an inorganic layer, and the inorganic layer may contact the concave-convex portions.",
"The inorganic layer and the interlayer insulating layer may include a same material.",
"The encapsulation layer may have a stacked structure including an organic layer and an inorganic layer, and the inorganic layer may contact the concave-convex portions.",
"The stacked structure may include more than one of the organic layer or the inorganic layer.",
"The inorganic layer and the interlayer insulating layer may include a same material.",
"The inorganic layer and the interlayer insulating layer may each include silicon nitride (SiNx).",
"The organic light-emitting display apparatus may further include a protective layer between the encapsulation layer and the display unit."
],
[
"This application is a continuation application of U.S. patent application Ser.",
"No.",
"15/096,534 filed on Apr.",
"12, 2016, which is divisional application of U.S. patent application Ser.",
"No.",
"14/262,757 filed on Apr.",
"27, 2014 and issued as U.S. Pat.",
"No.",
"9,343,699 on May 17, 2016, which claims priority to Korean Patent Application No.",
"10-2013-0102658, filed on Aug. 28, 2013, and all the benefits accruing therefrom under 35 U.S.C.",
"§ 119, the disclosure of which is incorporated herein in its entirety by reference.",
"BACKGROUND 1.Field One or more exemplary embodiment of the invention relate to an organic light-emitting display apparatus and a method of manufacturing the same, and more particularly, to an organic light-emitting display apparatus including a thin film encapsulation layer having an improved encapsulation characteristic and a method of manufacturing the organic light-emitting display apparatus.",
"2.Description of the Related Art An organic light-emitting display apparatus is a self-emissive display apparatus having an organic light-emitting device.",
"The organic light-emitting device includes a hole injection electrode and an electron injection electrode, and an organic emission layer (organic EML) therebetween.",
"A hole injected from the hole injection electrode and an electrode injected from the electron injection electrode are combined in the organic EML so that an exciton is generated from the combination and emits light when the exciton transitions from an exited state to a ground state.",
"The organic light-emitting display apparatus that is a self-emissive display apparatus does not require a separate light source, is capable of operating with a relatively low voltage, is capable of having a relatively light weight and slimness, and is expected to become a next generation display apparatus due to high display quality characteristics such as a wide viewing angle, high contrast and a fast response time.",
"SUMMARY One or more exemplary embodiment of the invention include an organic light-emitting display apparatus including a thin film encapsulation layer having an improved encapsulation characteristic and a method of manufacturing the organic light-emitting display apparatus.",
"Additional features will be set forth in part in the description which follows and, in part, will be apparent from the description, or may be learned by practice of the exemplary embodiments described herein.",
"According to one or more exemplary embodiment of the invention, an organic light-emitting display apparatus includes a substrate; a display unit which defines an active area of the substrate and includes a thin film transistor; concave-convex portions protruded from the substrate in an area outside the active area; and an encapsulation layer which encapsulates the display unit.",
"The thin film transistor includes an active layer, a gate insulating layer on the active layer, a gate electrode, a source electrode, a drain electrode, and an interlayer insulating layer between the gate electrode and the source electrode, and between the gate electrode and the drain electrode.",
"The concave-convex portions include portions of the gate insulating layer and the interlayer insulating layer, and the encapsulation layer covers the concave-convex portions.",
"Each of the concave-convex portions may have a double-layer structure including the portions of the gate insulating layer and the interlayer insulating layer.",
"The encapsulation layer may include an inorganic layer, and the inorganic layer may contact the concave-convex portions.",
"The inorganic layer and the interlayer insulating layer may include a same material.",
"The inorganic layer and the gate insulating layer may include a same material.",
"The encapsulation layer may include a stacked structure including an organic layer and an inorganic layer, and the inorganic layer may contact the concave-convex portions.",
"The stacked structure may include more than one of the organic layer or the inorganic layer.",
"The inorganic layer and the interlayer insulating layer may include a same material.",
"The inorganic layer and the gate insulating layer may include a same material.",
"The organic light-emitting display apparatus may further include a protective layer between the encapsulation layer and the display unit.",
"According to one or more exemplary embodiment of the invention, an organic light-emitting display apparatus includes a substrate; a display unit which defines an active area of the substrate and includes a thin film transistor and an organic light-emitting device electrically connected to each other; and an encapsulation layer which encapsulates the display unit.",
"The thin film transistor includes a gate insulating layer extending to an area outside the active area, and an interlayer insulating layer on the gate insulating layer and extending to the area outside the active area.",
"Protruding portions are between the gate insulating layer and the interlayer insulating layer in the area outside the active area.",
"The concave-convex portions are defined by the interlayer insulating layer in the area outside the active area, and the encapsulation layer covers the concave-convex portions.",
"Each of the stepped portions may include a metal layer.",
"The thin film transistor may further include an active layer, a gate electrode, a source electrode and a drain electrode.",
"The interlayer insulating layer may be between the gate electrode and the source electrode, and between the gate electrode and the drain electrode.",
"The display unit may further include an organic light-emitting device including a pixel electrode connected to the source electrode or the drain electrode; an intermediate layer on the pixel electrode and including an organic emission layer; and an opposite electrode on the intermediate layer.",
"The protruding portions may include a same material as that of the gate electrode, the source electrode, the drain electrode or the pixel electrode.",
"The encapsulation layer may include an inorganic layer, and the inorganic layer may contact the concave-convex portions.",
"The inorganic layer and the interlayer insulating layer may include a same material.",
"The encapsulation layer may have a stacked structure including an organic layer and an inorganic layer, and the inorganic layer may contact the concave-convex portions.",
"The stacked structure may include more than one of the organic layer or the inorganic layer.",
"The inorganic layer and the interlayer insulating layer may include a same material.",
"The inorganic layer and the interlayer insulating layer may each include silicon nitride (SiNx).",
"The organic light-emitting display apparatus may further include a protective layer between the encapsulation layer and the display unit.",
"BRIEF DESCRIPTION OF THE DRAWINGS These and/or other features will become apparent and more readily appreciated from the following description of the exemplary embodiments, taken in conjunction with the accompanying drawings of which: FIG.",
"1 is a plane view illustrating an exemplary embodiment of an organic light-emitting display apparatus according to the invention; FIG.",
"2 is a cross-sectional view of the organic light-emitting display apparatus of FIG.",
"1, taken along line II-II′; FIG.",
"3 is a cross-sectional view of the organic light-emitting display apparatus of FIG.",
"1, taken along line III-III′; FIG.",
"4 is a magnified cross-sectional view illustrating portion P1 of FIG.",
"3; FIG.",
"5 is a plane view illustrating another exemplary embodiment of an organic light-emitting display apparatus according to the invention; FIG.",
"6 is a cross-sectional view of the organic light-emitting display apparatus of FIG.",
"5, taken along line VI-VI′; FIG.",
"7 is a cross-sectional view of the organic light-emitting display apparatus of FIG.",
"5, taken along line VII-VII′; and FIG.",
"8 is a magnified cross-sectional view illustrating portion P2 of FIG.",
"7.DETAILED DESCRIPTION Reference will now be made in detail to exemplary embodiments, examples of which are illustrated in the accompanying drawings.",
"In this regard, the exemplary embodiments may have different forms and should not be construed as being limited to the descriptions set forth herein.",
"Accordingly, the exemplary embodiments are merely described below, by referring to the figures, to explain features of the invention.",
"In the drawings, the size and relative sizes of layers and regions may be exaggerated for clarity.",
"It will be understood that when an element or layer is referred to as being “on” or “connected to” another element or layer, the element or layer can be directly on or connected to another element or layer or intervening elements or layers.",
"In contrast, when an element is referred to as being “directly on” or “directly connected to” another element or layer, there are no intervening elements or layers present.",
"As used herein, connected may refer to elements being physically and/or electrically connected to each other.",
"Like numbers refer to like elements throughout.",
"As used herein, the term “and/or” includes any and all combinations of one or more of the associated listed items.",
"It will be understood that, although the terms first, second, third, etc., may be used herein to describe various elements, components, regions, layers and/or sections, these elements, components, regions, layers and/or sections should not be limited by these terms.",
"These terms are only used to distinguish one element, component, region, layer or section from another element, component, region, layer or section.",
"Thus, a first element, component, region, layer or section discussed below could be termed a second element, component, region, layer or section without departing from the teachings of the invention.",
"Spatially relative terms, such as “below,” “above,” and the like, may be used herein for ease of description to describe the relationship of one element or feature to another element(s) or feature(s) as illustrated in the figures.",
"It will be understood that the spatially relative terms are intended to encompass different orientations of the device in use or operation, in addition to the orientation depicted in the figures.",
"For example, if the device in the figures is turned over, elements described as “below” relative to other elements or features would then be oriented “above” relative to the other elements or features.",
"Thus, the exemplary term “below” can encompass both an orientation of above and below.",
"The device may be otherwise oriented (rotated 90 degrees or at other orientations) and the spatially relative descriptors used herein interpreted accordingly.",
"The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention.",
"As used herein, the singular forms “a,” “an” and “the” are intended to include the plural forms as well, unless the context clearly indicates otherwise.",
"It will be further understood that the terms “comprises,” “comprising,” “includes” and/or “including,” when used in this specification, specify the presence of stated features, integers, operations, elements, and/or components, but do not preclude the presence or addition of one or more other features, integers, steps, operations, elements, components, and/or groups thereof.",
"Expressions such as “at least one of,” when preceding a list of elements, modify the entire list of elements and do not modify the individual elements of the list.",
"Embodiments of the invention are described herein with reference to cross-section illustrations that are schematic illustrations of idealized embodiments (and intermediate structures) of the invention.",
"As such, variations from the shapes of the illustrations as a result, for example, of manufacturing techniques and/or tolerances, are to be expected.",
"Thus, embodiments of the invention should not be construed as limited to the particular shapes of regions illustrated herein but are to include deviations in shapes that result, for example, from manufacturing.",
"Unless otherwise defined, all terms (including technical and scientific terms) used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs.",
"It will be further understood that terms, such as those defined in commonly used dictionaries, should be interpreted as having a meaning that is consistent with their meaning in the context of the relevant art and will not be interpreted in an idealized or overly formal sense unless expressly so defined herein.",
"Since an organic light-emitting display apparatus may deteriorate due to external moisture or oxygen, the organic light-emitting device is encapsulated to be protected from external moisture or oxygen.",
"In order to obtain slimness and/or flexibility of the organic light-emitting display apparatus, a thin film encapsulation (“TFE”) such as including a plurality of inorganic layers or a plurality of layers including an organic layer and an inorganic layer, is used to encapsulate the organic light-emitting device.",
"The inorganic layer of the TFE may reduce or effectively prevent penetration of external moisture or oxygen, as a thickness of the inorganic layer is increased.",
"However, when the thickness of the inorganic layer is increased, a stress of the inorganic layer is increased such that the inorganic layer may be delaminated from other layers in the organic light-emitting display apparatus.",
"When the delamination of the inorganic layer occurs, external moisture or oxygen may penetrate into the organic light-emitting device such that a lifetime of the organic light-emitting display apparatus may be decreased.",
"Therefore, there remains a need for an improved organic light-emitting display apparatus and organic light-emitting device in which delamination of the TFE is reduced and penetration of external moisture or oxygen is reduced or effectively prevented.",
"Hereinafter, the invention will be described in detail with reference to the accompanying drawings.",
"FIG.",
"1 is a plane view illustrating an exemplary embodiment of an organic light-emitting display apparatus 10 according to the invention.",
"FIG.",
"2 is a cross-sectional view of the organic light-emitting display apparatus 10 of FIG.",
"1, taken along line II-II′.",
"FIG.",
"3 is a cross-sectional view of the organic light-emitting display apparatus 10 of FIG.",
"1, taken along line III-III′.",
"FIG.",
"4 is a magnified cross-sectional view illustrating portion P1 of FIG.",
"3.Referring to FIGS.",
"1 through 4, the organic light-emitting display apparatus 10 includes a substrate 101, a display unit 200 which defines an active area AA of the substrate 101 and/or the organic light-emitting display apparatus 10, and an encapsulation layer 300 which encapsulates the display unit 200.The active area AA may be a display area while an area outside the active area AA may be a peripheral or non-display area.",
"The substrate 101 may be a flexible substrate including a plastic material such as polyimide, polyethylene terephthalate (“PET”), polycarbonate, polyethylene naphthalate, polyarylate (“PAR”), polyetherimide (“PEI”) or the like that have excellent heat-resistance and durability.",
"However, the invention is not limited thereto, and the substrate 101 may include various materials such as including metal, glass or the like.",
"The display unit 200 defines the active area AA of the substrate 101 or the organic light-emitting display apparatus 10 and includes a thin film transistor TFT and an organic light-emitting device OLED that are electrically connected to each other.",
"A plurality of pad units 1 is disposed around the active area AA, thereby transmitting an electric signal from a power supply device (not shown) or a signal generation device (not shown) to the active area AA.",
"Hereinafter, the display unit 200 is described in detail with reference to FIG.",
"3.A buffer layer 201 may be disposed on the substrate 101.The buffer layer 201 may be on an entire top surface of the substrate 101, e.g., the buffer layer 201 may be disposed in the active area AA and an area outside of the active area AA.",
"The buffer layer 201 may function to reduce or effectively prevent penetration of foreign substances via the substrate 101 and to provide a flat surface on the substrate 101.The buffer layer 201 may include various materials capable of performing the above-described functions.",
"In one exemplary embodiment, for example, the buffer layer 201 may be a composite layer of two or more layers such as an inorganic material layer including silicon oxide, silicon nitride, silicon oxynitride, aluminum oxide, aluminum nitride, titanium oxide, titanium nitride, or the like, and an organic material layer including polyimide, polyester, acryl or the like.",
"The thin film transistor TFT may be disposed on the buffer layer 201.The thin film transistor TFT may include an active layer 202, a gate electrode 204, a source electrode 206 and a drain electrode 207.The active layer 202 may include an inorganic semiconductor such as amorphous silicon or polysilicon, an organic semiconductor, or an oxide semiconductor.",
"The active layer 212 may include a source region, a drain region, and a channel region respectively corresponding to the source, drain and gate electrodes 206, 207 and 204.A gate insulating layer 203 is disposed on the active layer 202.The gate insulating layer 203 may correspond to the entire top surface of the substrate 101.That is, the gate insulating layer 203 may correspond to the active area AA and the area outside of the active area AA.",
"The gate insulating layer 203 may insulate the active layer 202 from the gate electrode 204.The gate insulating layer 203 may include an organic material, or an inorganic material including SiNx, SiO2, or the like.",
"The gate electrode 204 is disposed on the gate insulating layer 203.The gate electrode 204 may include Au, Ag, Cu, Ni, Pt, Pd, Al, Mo, or an alloy of Al:Nd or Mo:W. However, the invention is not limited thereto, and the gate electrode 204 may include various materials in consideration of a design condition of the organic light-emitting display apparatus 10.An interlayer insulating layer 205 is disposed on the gate electrode 204.The interlayer insulating layer 205 may correspond to the entire top surface of the substrate 101.That is, the interlayer insulating layer 205 may correspond to the active area AA and the outer area of the active area AA.",
"The interlayer insulating layer 205 is disposed between the gate electrode 204 and the source electrode 206, and between the gate electrode 204 and the drain electrode 207 so as to respectively obtain insulation therebetween.",
"The interlayer insulating layer 205 may include an inorganic material including SiNx, SiO2, or the like.",
"Concave-convex portions 209 may be disposed in the area outside of the active area AA.",
"The concave-convex portions 209 may be disposed on the buffer layer 201.Each of the concave-convex portions 209 may have a double-layer structure including the gate insulating layer 203 and the interlayer insulating layer 205.In an exemplary embodiment of manufacturing the organic light-emitting display apparatus 10, the concave-convex portions 209 may be formed by patterning the gate insulating layer 203 and the interlayer insulating layer 205.A region of the organic light-emitting display apparatus 10 in which the concave-convex portions 209 are formed may be considered to have an embossed shape.",
"The concave-convex portions 209 are covered by the encapsulation layer 300.Due to the repeating protruding and recessed shape defined by the concave-convex portions 209, a contact area between the encapsulation layer 300 and each of the gate and interlayer insulating layers 203 and 205 is increased.",
"Thus, adhesion between the encapsulation layer 300 and each of the gate and interlayer insulating layers 203 and 205 is improved, so that delamination of the encapsulation layer 300 may be reduced or effectively prevented, and by doing so, penetration of external moisture or oxygen to organic light-emitting device OLED may be efficiently reduced or effectively prevented.",
"Also, because portions of the gate insulating layer 203 and the interlayer insulating layer 205 are absent between and around the concave-convex portions 209, a strain in and below the encapsulation layer 300 due to occurrence of a stress may be decreased.",
"The source electrode 206 and the drain electrode 207 are disposed on the interlayer insulating layer 205.In more detail, the interlayer insulating layer 205 and the gate insulating layer 203 expose the source region and the drain region of the active layer 202, and the source electrode 206 and the drain electrode 207 respectively contact the exposed source and drain regions of the active layer 202.In an exemplary embodiment of manufacturing the organic light-emitting display apparatus 10, the concave-convex portions 209 may be formed by a process in which the interlayer insulating layer 205 and the gate insulating layer 203 are formed to expose the source region and the drain region of the active layer 202, such that an additional process to form the concave-convex portions 209 is omitted.",
"While FIG.",
"3 illustrates a top gate type thin film transistor TFT that sequentially includes the active layer 202, the gate electrode 204, the source electrode 206 and the drain electrode 207, the invention is not limited thereto, and the gate electrode 204 may be disposed below the active layer 202 in a bottom gate type thin film transistor TFT.",
"The thin film transistor TFT is electrically connected to the organic light-emitting device OLED and drives the organic light-emitting device OLED.",
"The thin film transistor TFT is covered by a passivation layer 208.The passivation layer 208 may include an inorganic insulating layer and/or an organic insulating layer.",
"The inorganic insulating layer may include SiO2, silicon nitride (SiNx), silicon oxynitride (SiON), Al2O3, TiO2, Ta2O5, HfO2, ZrO2, barium strontium titanate (“BST”), lead zirconate titanate (“PZT”) or the like, and the organic insulating layer may include polymer derivatives having a commercial polymer such as poly(methyl methacrylate) (“PMMA”) and polystyrene (“PS) and a phenol group, an acryl-based polymer, an imide-based polymer, an allyl ether-based polymer, an amide-based polymer, a fluorine-based polymer, a p-xylene-based polymer, a vinylalcohol-based polymer or a combination thereof.",
"The passivation layer 208 may have a multi-layer structure including the inorganic insulating layer and the organic insulating layer.",
"The organic light-emitting device OLED may be disposed on the passivation layer 208, and may include a pixel electrode 211, an intermediate layer 214 and an opposite electrode 215.The pixel electrode 211 is disposed on the passivation layer 208.In more detail, the passivation layer 208 may expose a predetermined region of the drain electrode 207 without covering an entire portion of the drain electrode 207, and the pixel electrode 211 may be connected to the exposed portion of the drain electrode 207.In the illustrated exemplary embodiment, the pixel electrode 211 may be a reflective electrode.",
"The pixel electrode 211 may include a reflective material layer including Ag, Mg, Al, Pt, Pd, Au, Ni, Nd, Ir, Cr or a combination thereof, and a transparent or translucent electrode layer disposed on the reflective layer.",
"The transparent or translucent electrode layer may include indium tin oxide (“ITO”), indium zinc oxide (“IZO”), zinc oxide (“ZnO”), indium oxide (In2O3), indium gallium oxide (“IGO”) aluminum zinc oxide (“AZO”) or a combination thereof.",
"The opposite electrode 215 disposed to face the pixel electrode 211 may be a transparent or translucent electrode.",
"The opposite electrode 215 may include a metal thin layer having a low work function and including Li, Ca, LiF/Ca, LiF/Al, Al, Ag, Mg or a combination thereof.",
"Also, opposite electrode 215 may include an auxiliary electrode layer or a bus electrode, which includes a transparent electrode forming material such as ITO, IZO, ZnO, In2O3 or a combination thereof may be further disposed on the metal thin layer.",
"Thus, the opposite electrode 215 may transmit light emitted from an organic emission layer (organic EML) included in the intermediate layer 214.That is, the light emitted from the organic EML may be directly emitted toward the opposite electrode 215, or may be reflected from the pixel electrode 211 as a reflective electrode and then emitted toward the opposite electrode 215.The organic light-emitting display apparatus 10 according to the invention is not limited to a top-emission type organic light-emitting display apparatus and alternatively may be a bottom-emission type organic light-emitting display apparatus in which light from the organic EML is emitted toward the substrate 101.In an exemplary embodiment of the bottom-emission type organic light-emitting display apparatus, the pixel electrode 211 may be a transparent or translucent electrode, and the opposite electrode 215 may be a reflective electrode.",
"Also, in another alternative exemplary embodiment, the organic light-emitting display apparatus 10 according to the illustrated exemplary embodiment may be a dual-emission type organic light-emitting display apparatus in which light is emitted toward both top and bottom surfaces.",
"A pixel defining layer 213 including an insulating material is disposed on the pixel electrode 211.An opening defined in the pixel defining layer 213 exposes a predetermined region of the pixel electrode 211, and the intermediate layer 214 including the organic EML is disposed on the exposed region of the pixel electrode 211 and in the opening defined in the pixel defining layer 213.The organic EML may be a relatively small-molecule organic layer or a polymer organic layer.",
"In addition to the organic EML, the intermediate layer 214 may selectively further include a functional layer such as a hole transport layer (“HTL”), a hole injection layer (“HIL”), an electron transport layer (“ETL”), an electron injection layer (“EIL”), or the like.",
"The encapsulation layer 300 is disposed on the opposite electrode 215.The encapsulation layer 300 may include a first inorganic layer 301, a first organic layer 302 and a second inorganic layer 303.Also, a protective layer 220 may be further disposed between the encapsulation layer 300 and the display unit 200.The protective layer 220 includes a capping layer 222 covering the opposite electrode 215, and a blocking layer 224 on the capping layer 222.The capping layer 222 may include an organic material such as N,N′-diphenyl-N,N′-bis(1-naphthyl)-1,1′-biphenyl-4,4″-diamine (“a-NPD”), N,N′-di(naphthalene-1-yl)-N, N′-diphthalbenzidine (“NPB”), N,N′-diphenyl-N,N′-bis(3-methylphenyl)-(1,1′-biphenyl)-4,4′-diamine (“TPD”), 4,4′,4″-Tris(N-3-methylphenyl-N-phenylamino)triphenylamine (“m-MTDATA”), tris(8-quinolinolato)aluminum (“Alq3”) copper phthalocyanine (“CuPc”), or the like.",
"The capping layer 222 may function to protect the organic light-emitting device OLED and to help light, which is generated in the organic light-emitting device OLED, to be efficiently emitted from the organic light-emitting device OLED.",
"The blocking layer 224 may include an inorganic material such as lithium fluoride (LiF), magnesium fluoride (MgF2), calcium fluoride (CaF2) or the like.",
"In an exemplary embodiment of manufacturing the organic light-emitting display apparatus 10, the blocking layer 224 may function to block plasma, which is used in forming the first inorganic layer 301, from penetrating into the organic light-emitting device OLED and then damaging elements thereof such as the intermediate layer 214, the opposite electrode 215 or the like.",
"In the illustrated exemplary embodiment, the blocking layer 224 may include LiF having a pin-hole structure.",
"The first inorganic layer 301 is disposed on the protective layer 220.In one exemplary embodiment, for example, the first inorganic layer 301 may include an aluminum oxide (AlOx).",
"The first inorganic layer 301 may have a preset cross-sectional thickness, formed in an exemplary embodiment of manufacturing the organic light-emitting display apparatus 10 such as by a sputtering method.",
"The first organic layer 302 is disposed on the first inorganic layer 301 and may have a preset cross-sectional thickness so as to planarize a step difference due to the pixel defining layer 213.The first organic layer 302 may include epoxy, acrylate, urethane-acrylate or a combination thereof.",
"A planar area of the first organic layer 302 may be less than that of the first inorganic layer 301.The second inorganic layer 303 may surround the first inorganic layer 301 and the first organic layer 302.That is, the first organic layer 302 is completely surrounded by the first inorganic layer 301 and the second inorganic layer 303, so that penetration of external moisture or oxygen may be efficiently reduced or effectively prevented.",
"The second inorganic layer 303 may include SiNx and may have a preset cross-sectional thickness formed in an exemplary embodiment of manufacturing the organic light-emitting display apparatus 10 such as by chemical vapor deposition (“CVD”).",
"A planar area of the second inorganic layer 303 may be greater than that of the first inorganic layer 301 and may directly cover the concave-convex portions 209 in the area outside of the active area AA.",
"Also, the second inorganic layer 303 may include a same material as the interlayer insulating layer 205 and/or be in same layer as the interlayer insulating layer 2205.That is, in an exemplary embodiment of manufacturing the organic light-emitting display apparatus 10, when the second inorganic layer 303 is formed of SiNx and the interlayer insulating layer 205 is also formed of SiNx, adhesion between the second inorganic layer 303 and the interlayer insulating layer 205 may be improved, so that adhesion between the second inorganic layer 303 and the concave-convex portions 209 may be improved.",
"In this manner, the second inorganic layer 303 has a cross-sectional thickness sufficient to cover particles, so that, although a layer stress is increased, delamination of the second inorganic layer 303 may be reduced or effectively prevented, and by doing so, penetration of external moisture or oxygen to the organic light-emitting device OLED may be efficiently reduced or effectively prevented.",
"Also, the second inorganic layer 303 may include a same material as the gate insulating layer 203.That is, in an exemplary embodiment of manufacturing the organic light-emitting display apparatus 10, when the second inorganic layer 303 is formed of SiNx and the gate insulating layer 203 is also formed of SiNx, adhesion between the second inorganic layer 303 and the gate insulating layer 203 may be improved, so that adhesion between the second inorganic layer 303 and the concave-convex portions 209 including portions of the gate insulating layer 203 may be improved.",
"In this manner, the second inorganic layer 303 has a cross-sectional thickness sufficient to cover particles, so that, although a layer stress is increased, delamination of the second inorganic layer 303 may be reduced or effectively prevented, and by doing so, penetration of external moisture or oxygen to the organic light-emitting device OLED may be efficiently reduced or effectively prevented.",
"A second organic layer 304 and a third inorganic layer 305 may be disposed on the second inorganic layer 303.Although not illustrated, a fourth inorganic layer (not shown) including AlOx may be disposed on an exterior surface of the encapsulation layer 300.The second organic layer 304 may include epoxy, acrylate, urethane-acrylate or a combination thereof, and may have a preset cross-sectional thickness.",
"The second organic layer 304 may lessen a layer stress occurred in the first inorganic layer 301 and may evenly cover the particles or the like.",
"The third inorganic layer 305 covers the second organic layer 304.The third inorganic layer 305 contacts a top surface of the second inorganic layer 303 in the area outside the active area AA.",
"The third inorganic layer 305 may include a same material as the second inorganic layer 303.In one exemplary embodiment, for example, the third inorganic layer 305 may include SiNx.",
"Thus, adhesion between the third inorganic layer 305 and the second inorganic layer 303 is improved, so that penetration of external moisture or oxygen to the organic light-emitting device OLED may be efficiently reduced and effectively prevented.",
"The encapsulation layer 300 may further include additional inorganic layers and organic layers that alternate with each other, and the number of times of stacking the inorganic and organic layers is not limited.",
"A protection film (not shown) is attached on a top surface of the encapsulation layer 300.In an exemplary embodiment where the protection film has strong adhesion, when the protection film is removed, the encapsulation layer 300 may be delaminated.",
"In this regard, by further disposing the outermost fourth inorganic layer including AlOx and having weak adhesion with respect to the protection film, the delamination problem may be reduced or effectively prevented.",
"FIG.",
"5 is a plane view illustrating another exemplary embodiment of an organic light-emitting display apparatus 20 according to the invention.",
"FIG.",
"6 is a cross-sectional view of the organic light-emitting display apparatus 20 of FIG.",
"5, taken along line VI-VI′.",
"FIG.",
"7 is a cross-sectional view of the organic light-emitting display apparatus 20 of FIG.",
"5, taken along line VII-VII′.",
"FIG.",
"8 is a magnified cross-sectional view illustrating portion P2 of FIG.",
"7.Hereinafter, the exemplary embodiment of FIGS.",
"5 through 8 will now be described with reference to differences with respect to the previous exemplary embodiment shown in FIGS.",
"1 through 4.Here, like reference numerals in FIGS.",
"5 through 8 refer to the like elements in FIGS.",
"1 through 4.Referring to FIGS.",
"5 through 8, the organic light-emitting display apparatus 20 includes a substrate 101, a display unit 2200 which defines an active area AA of the substrate 101 and/or the organic light-emitting display apparatus 20, and an encapsulation layer 300 which encapsulates the display unit 2200.Hereinafter, the display unit 2200 is described in detail with reference to FIG.",
"7.A buffer layer 201 may be disposed on the substrate 101.A thin film transistor TFT may be disposed on the buffer layer 201.The thin film transistor TFT may include an active layer 202, a gate electrode 204, a source electrode 206 and a drain electrode 207.A gate insulating layer 203 is disposed on the active layer 202.The gate insulating layer 203 may correspond to an entire top surface of the substrate 101.That is, the gate insulating layer 203 may correspond to the active area AA and an area outside of the active area AA.",
"The gate electrode 204 is disposed on the gate insulating layer 203.An interlayer insulating layer 2205 is disposed on the gate electrode 204.The interlayer insulating layer 2205 may correspond to the entire top surface of the substrate 101.That is, the interlayer insulating layer 2205 may correspond to the active area AA and the area outside of the active area AA.",
"The interlayer insulating layer 2205 is disposed between the gate electrode 204 and the source electrode 206, and between the gate electrode 204 and the drain electrode 207 so as to respectively obtain insulation therebetween.",
"The interlayer insulating layer 2205 may include an inorganic material including SiNx, SiO2, or the like.",
"Stepped portions 2210 may be disposed in the area outside of the active area AA and spaced apart from each other.",
"The stepped portions 2210 may be disposed between the gate insulating layer 203 and the interlayer insulating layer 2205 in a cross-sectional thickness direction.",
"Each of the stepped portions 2210 may include a metal layer.",
"Each of the stepped portions 2210 may include a same material as that of the gate electrode 204, the source electrode 206 and/or a pixel electrode 211.Thus, in an exemplary embodiment of manufacturing the organic light-emitting display apparatus 10, the stepped portions 2210 may be formed by using the same method of forming the aforementioned electrodes so as to be in a same layer as the respective electrode.",
"Concave-convex portions 2209 may be disposed in the area outside of the active area AA.",
"Since the interlayer insulating layer 2205 is disposed on the stepped portions 2210, the concave-convex portions 2209 may be formed by portions of the interlayer insulating layer 2205 due to a step difference between the stepped portions 2210 and the gate insulating layer 303.A region in which the concave-convex portions 2209 are disposed may be considered to have an embossed shape.",
"The concave-convex portions 2209 are covered by the encapsulation layer 300.Due to the repeating protruding and recessed shape defined by the concave-convex portions 2209, a contact area between the encapsulation layer 300 and the interlayer insulating layer 2205 is increased.",
"Thus, adhesion between the encapsulation layer 300 and the interlayer insulating layer 2205 is improved, so that delamination of the encapsulation layer 300 may be reduced or effectively prevented, and by doing so, penetration of external moisture or oxygen to organic light-emitting device OLED may be efficiently reduced or effectively prevented The source electrode 206 and the drain electrode 207 are disposed on the interlayer insulating layer 2205.The thin film transistor TFT is electrically connected to an organic light-emitting device OLED and drives the organic light-emitting device OLED, and is covered by a passivation layer 208.The passivation layer 208 may include an inorganic insulating layer and/or an organic insulating layer.",
"The organic light-emitting device OLED may be disposed on the passivation layer 208, and may include a pixel electrode 211, an intermediate layer 214 and an opposite electrode 215.A pixel defining layer 213 including an insulating material is disposed on the pixel electrode 211.An opening defined in the pixel defining layer 213 exposes a predetermined region of the pixel electrode 211, and the intermediate layer 214 including an organic EML is disposed on the exposed region of the pixel electrode 211 and in the opening defined in the pixel defining layer 213.The encapsulation layer 300 is disposed on the opposite electrode 215.The encapsulation layer 300 may include a first inorganic layer 301, a first organic layer 302 and a second inorganic layer 303.Also, a protective layer 220 may be further disposed between the encapsulation layer 300 and the display unit 2200.The protective layer 220 includes a capping layer 222 covering the opposite electrode 215, and a blocking layer 224 on the capping layer 222.The first inorganic layer 301 is disposed on the protective layer 220.In one exemplary embodiment, for example, the first inorganic layer 301 may include AlOx.",
"The first organic layer 302 is disposed on the first inorganic layer 301 and may have a preset cross-sectional thickness so as to planarize a step difference due to the pixel defining layer 213.A planar area of the first organic layer 302 may be less than that of the first inorganic layer 301.The second inorganic layer 303 may surround the first inorganic layer 301 and the first organic layer 302.That is, the first organic layer 302 is completely surrounded by the first inorganic layer 301 and the second inorganic layer 303, so that penetration of external moisture or oxygen may be efficiently reduced or effectively prevented.",
"The second inorganic layer 303 may include SiNx and may have a preset cross-sectional thickness formed in an exemplary embodiment of manufacturing the organic light-emitting display apparatus 10 such as by CVD.",
"A planar area of the second inorganic layer 303 may be greater than that of the first inorganic layer 301 and may directly cover the concave-convex portions 2209 in the area outside of the active area AA.",
"Also, the second inorganic layer 303 may include a same material as the interlayer insulating layer 2205 and/or be in same layer as the interlayer insulating layer 2205.That is, in an exemplary embodiment of manufacturing the organic light-emitting display apparatus 10, when the second inorganic layer 303 is formed of SiNx and the interlayer insulating layer 2205 is also formed of SiNx, adhesion between the second inorganic layer 303 and the interlayer insulating layer 2205 may be improved, so that adhesion between the second inorganic layer 303 and the concave-convex portions 2209 may be improved.",
"In this manner, the second inorganic layer 303 has a cross-sectional thickness sufficient to cover particles, so that, although a layer stress is increased, delamination of the second inorganic layer 303 may be reduced or effectively prevented, and by doing so, penetration of external moisture or oxygen to the organic light-emitting device OLED may be efficiently reduced or effectively prevented.",
"A second organic layer 304 and a third inorganic layer 305 may be disposed on the second inorganic layer 303, and although not illustrated, a fourth inorganic layer (not shown) including of AlOx may be disposed on an exterior surface of the encapsulation layer 300.The second organic layer 304 may lessen a layer stress occurring in the first inorganic layer 301 and may evenly cover the particles or the like.",
"The third inorganic layer 305 covers the second organic layer 304.The third inorganic layer 305 contacts a top surface of the second inorganic layer 303 in the area outside of the active area AA.",
"The third inorganic layer 305 may include a same material as the second inorganic layer 303.In one exemplary embodiment, for example, the third inorganic layer 305 may include SiNx.",
"Thus, adhesion between the third inorganic layer 305 and the second inorganic layer 303 is improved, so that penetration of external moisture or oxygen to the organic light-emitting device OLED may be efficiently reduced or effectively prevented.",
"The encapsulation layer 300 may further include additional inorganic layers and organic layers that alternate with each other, and the number of times of stacking the inorganic and organic layers is not limited.",
"As described above, according to one or more of the above-described exemplary embodiments of the invention, delamination of an encapsulation layer may be reduced or effectively prevented so that penetration of external moisture or oxygen to the organic light-emitting device OLED may be efficiently reduced or effectively prevented.",
"It should be understood that the exemplary embodiments described herein should be considered in a descriptive sense only and not for purposes of limitation.",
"Descriptions of features within each exemplary embodiment should typically be considered as available for other similar features in other exemplary embodiments.",
"While one or more exemplary embodiments of the invention have been described with reference to the figures, it will be understood by those of ordinary skill in the art that various changes in form and details may be made therein without departing from the spirit and scope of the invention as defined by the following claims."
]
] |
Patent_15871196
|
[
[
"MULTI-WIRE FEEDER METHOD AND SYSTEM FOR ALLOY SAMPLE FORMATION AND ADDITIVE MANUFACTURING",
"Systems and methods, comprising a directed heat source coupled to a multi-wire feed-head configured to feed one or more wires having diverse compositions into a heat affected region, are provided for the synthesis of alloy samples having defined compositions, combinatorial alloy sample series and libraries, and shaped alloy components."
],
[
"1.A multi-wire integrated feed-head for producing multiple alloy samples, comprising: an upper section comprising an entrance opening for receiving heat output from a directional heat source; a lower section comprising an upward facing surface and a downward facing surface; an elongated heat delivery channel traversing the upper and lower head sections running between the upper section opening and an exit disposed in the downward-facing surface of the lower section; and a multiplicity of elongated wire channels traversing the lower head section, each channel running between one of the multiplicity of entrances disposed on the upward facing surface and one of the multiplicity of exits disposed on the downward-facing surface; wherein at least a two of the multiplicity of entrances are configured to receive each of at least two wire feeds from each of at least a two wire feeders and the corresponding two wire exits are configured to deliver wire towards a common focus.",
"2.The feed-head of claim 1, wherein the heat delivery channel is aligned along a common longitudinal axis of the upper and lower head sections, and the longitudinal axes of the multiplicity of elongated wire channels are inclined at equal angles to the head longitudinal axis and converge on the common focus disposed on the head longitudinal axis below the downward-facing surface.",
"3.The feed-head of claim 1, wherein the longitudinal axes of the multiplicity of channels are inclined at around 50 degrees to the longitudinal axis and distributed symmetrically around the longitudinal head axis.",
"4.The feed-head of claim 1, wherein the multiplicity of channels have essentially cylindrical portions with internal diameters between about 1.5 and 3.0 mm and lengths between about 15 and 50 mm.",
"5.The feed-head of claim 1, wherein the multiplicity of wire channels comprises twelve or more channels.",
"6.The feed-head of claim 1, wherein one or more of the multiplicity of wire channels further comprises a constriction at the channel exit.",
"7.The feed-head of claim 1, wherein the multiplicity of wire channels comprises wire channels of the same length and internal diameter.",
"8.The feed-head of claim 1, further comprising liner tubes traversing at least a portion of one or more of the wire channels and extending beyond the downward-facing surface.",
"9.The feed-head of claim 1, wherein the downward-facing surface is essentially flat and disposed perpendicular to the head longitudinal axis.",
"10.The feed head of claim 1, wherein the downward-facing surface is concave and disposed co-axially with respect to the longitudinal head axis to reflect heat radiation towards the common focus.",
"11.The feed head of claim 10, wherein the downward-facing surface is substantially hemispherical.",
"12.The feed head of claim 1, further comprising a second upward-facing surface and one or more elongated powder feed channels, each running between an entrance on the second upward facing surface and an exit on the downward-facing surface.",
"13.The feed-head of claim 12, wherein the longitudinal axes of the one or more powder channels are inclined at around 20 degrees to the longitudinal axis and have essentially cylindrical portions with internal diameters between about 1.5 and 3.0 mm.",
"14.A system for alloy sample formation comprising the feed-head of claim 1, and further comprising: mechanisms for applying controlled relative displacement and/or rotation of feed-head and work-piece; at least two wire feeders and controllers for the at least two-wire feeders; and a directional heat source coupled to the feed-head.",
"15.The system of claim 14, further comprising a chamber enclosing the multi-wire feed head and work-piece configured to allow back-filling with an inert gas.",
"16.The system of 14, further comprising a flowing inert gas shield configured to enclose at least a fraction of the downward-facing surface and the heat-affected region comprising the sample and/or at least a portion of the work-piece surface."
],
[
"<SOH> BACKGROUND <EOH>The combinatorial approach to materials development depends on being able to rapidly synthesize sample libraries spanning diverse ranges of compositions and processing conditions.",
"The approach has seen widespread application in the pharmaceutical and other sectors, but has been applied only tentatively in alloy development, largely because of the difficulties of rapidly synthesizing, under clean conditions and at high temperatures, series or libraries of samples large and homogeneous enough to exhibit bulk-like alloy properties.",
"Separately, the high cost of shaped alloy components made using conventional metallurgical processes has spurred development of a range of additive-manufacturing technologies, in which components are formed by sequentially depositing controlled amounts of material on selected areas of a work-piece surface while a localized heat source is applied to those areas.",
"In such additive manufacturing technologies, the localized heat source is typically a laser, a directed plasma arc or an electron beam, and the material is typically fed in the form of a powder stream or wire.",
"Additive manufacturing systems that combine a localized heat source with one or more powder streams have been developed.",
"For example, U.S. Pat.",
"No.",
"5,961,862 (University of California) discloses an integrated deposition head delivering two or more gas-assisted powder streams having the same composition towards the focal region of the laser.",
"However, the difficulty of incorporating even a substantial fraction of the incident powder stream (or streams) directed towards a small heated region, such as a pool of molten material produced by a focused laser, renders powder-based systems inherently unsuitable for use in combinatorial alloy development, which requires precise and accurate control of sample composition, and also increases the cost of components made by powder-based additive manufacturing.",
"Unlike powder feeders, a suitably configured wire-feeder can deliver substantially all of a length of wire, comprising an element or alloy, into a small region of molten material.",
"Various wire feeders, allowing accurate and precise control of feed rate, rapid starting and stopping of the feed, and accurate and precise positioning of the end of a single wire, have been developed, generally for use in welding.",
"U.S. Pub.",
"App.",
"No.",
"2010/0089890 (Manning) describes a hand-held wire-feeder with a positioning tube for the relatively fine wires, 0.13 to 0.32 mm diameter, used in laser welding of jewelry, and U.S. Pat.",
"No.",
"5,137,223 (U.S. Dept.",
"of Energy), a machine-controlled wire feeder, comprising a torque motor that applies tension to the wire and a stepper motor that advances an elastic-coated drive wheel to deliver wire through a hypodermic needle into the less than 0.25 mm diameter melt pools typical in high density electron beam or laser welding.",
"A laser welding system having a separate wire-feeder for introducing wire into the output of a laser head integrated with a powder feeder, allowing switching between laser and powder feed, has also be proposed.",
"U.S. Pub.",
"App.",
"No.",
"2006/0049153 (Honeywell Int'l, Ltd.).",
"In order to improve process controllability and access to non-planar work-pieces, feed-heads having laser optical systems adapted to accommodate a single, axially-fed wire have been developed.",
"U.S. Pat.",
"No.",
"6,294,754 (Mitsubishi Heavy Indus., Ltd.); WO Pub.",
"App.",
"No.",
"2009/039753 (Suzhou Univ.).",
"A plasma-arc feed-head comprising a single, axially-fed, wire has also been developed.",
"U.S. Pat.",
"No.",
"6,365,867 (Sandia Corp.).",
"Such single-wire feed-heads are not capable of the rapid synthesis of combinatorial alloy sample series or libraries from multiple wires having diverse compositions.",
"U.S. Pat.",
"No.",
"5,578,227 (Rabinovitch) discloses a rapid prototyping system comprising a wire feeder and delivery tube configured to pivot around the optic axis of a laser head, FIG.",
"1; 5:55-6:6 & 6:9-14.U.S.",
"Pat.",
"No.",
"5,578,227, and proposes that composite prototype articles, comprising, for example, layers of stainless steel and an organic material, might be produced by alternating two wire feeders delivering two different materials.",
"7:3-9.U.S.",
"Pat.",
"No.",
"5,578,227 does not disclose combining the output of two wire feeders in a single molten region, either sequentially or simultaneously.",
"The present invention overcomes the above and other limitations of the prior art by employing an integrated multi-wire feed-head to form alloy samples having defined compositions, suitable for combinatorial alloy discovery and additive manufacturing applications."
],
[
"<SOH> SUMMARY OF THE INVENTION <EOH>In one embodiment, a method is disclosed for producing an alloy sample, comprising the steps of: furnishing a directional heat source and wire feed-head; disposing a work-piece surface a fixed distance from the wire feed-head, wherein the feed-head and work-piece are configured to allow the feed-head to deliver heat from the directional heat source into a heat-affected region comprising at least a portion of the work-piece surface, and wherein the feed-head is further configured to feed the ends of one or more of a multiplicity of wires having diverse compositions into the heat-affected region; the method further comprising the steps of: delivering heat and feeding selected lengths of at least two wires having diverse compositions into the heat-affected region to form, on the portion of the work-piece surface, a substantially homogeneous molten alloy portion having a composition defined by the cross sectional areas and relative proportions of the selected lengths of the at least two wires; and cooling the molten alloy portion to form a solid alloy portion having the same defined composition as the molten alloy portion.",
"In other embodiments, the selected lengths of the at least two wires are fed simultaneously into the heat affected region, the selected lengths are regulated by regulating the feed rates of the at least two wires over a time interval, and the feed rates of the at least two wires are fixed over the time interval and the relative proportions of the selected lengths are regulated by regulating the relative proportions of the feed rates of the at least two wires.",
"In yet another embodiment, immediately preceding the step of delivering heat and feeding selected lengths of the at least two wires, a length of one of the at least two wires is fed and heat is delivered into the heat affected region to form a molten nucleus on the portion of the work-piece surface, wherein the length is a negligible fraction of the selected length of that wire.",
"In another embodiment, following the step of delivering heat into the heat-affected region while feeding and melting selected lengths of the at least two wires, the steps are implemented of delivering heat and feeding second selected lengths of the at least two wires having diverse compositions into the molten alloy portion over a second time interval while maintaining the defined composition of the molten alloy portion essentially constant during the second time interval; and maintaining an essentially fixed distance between the feed-head and the molten alloy portion during the second interval by increasing the distance between the feed-head and the original work-piece surface to compensate for formation of a solid alloy portion disposed between the molten alloy portion and the original work-piece surface.",
"In yet another embodiment, the second selected lengths have the same relative proportions as the selected lengths, the feed rates of the at least two wires are fixed over the second time interval and the relative proportions of the second selected lengths are regulated by regulating the relative proportions of the feed rates of the at least two wires, In yet other embodiments, the feed rates of the at least two wires are unchanged between the first and second time intervals, the second time interval is at least five times as long as the first time interval and the molten alloy portion maintains essentially the same diameter throughout the second interval.",
"In other embodiments, the head is further configured to direct one or more powder streams towards the heat-affected region, one or more powder streams are directed towards the heat-affected region and material comprising the one or more powder streams incorporated into the molten alloy portion.",
"In yet other embodiments, the molten or solid alloy portions are exposed to a reactive gas and at least a fraction of the reactive gas incorporated into the molten or solid alloy portions.",
"In other embodiments, the directional heat source is a laser, an electron beam or a plasma arc.",
"In yet further embodiments, additional heat is supplied to or removed from the work-piece while feeding the at least two wires, one or more of the selected lengths of at least two wires are preheated, heat is delivered from a second directional heat source to the molten alloy portion.",
"In other embodiments, the molten alloy portion is cooled to form a substantially homogeneous solid alloy portion or heat is delivered to the solid alloy portion to form a substantially homogeneous solid alloy portion before it is cooled.",
"In further embodiments, a shaped component is formed by applying controlled relative motion between feed-head and work-piece while directing heat and feeding the at least two wires to form successive solid alloy layers on selected regions of the work-piece surface, wherein the selective layers comprise a shaped alloy component having a defined composition, and the defined composition of at least a portion of the successive solid alloy layers are changed, wherein the selected layers comprise a shaped alloy component comprising regions of diverse defined alloy compositions.",
"In another embodiment, a combinatorial alloy sample series or library is created by applying controlled relative motion between feed-head and work-piece and forming, at different locations on the original work-piece surface, a multiplicity of alloy samples have diverse defined compositions and/or diverse thermal histories.",
"In another embodiment, a multi-wire feed-head is disclosed suitable for use in any of the above methods, comprising: an upper section comprising an entrance opening for receiving heat output from a directional heat source; a lower section comprising an upward facing surface and a downward facing surface; an elongated heat delivery channel traversing the upper and lower head sections running between the upper section opening and an exit disposed in the downward-facing surface of the lower section; and, a multiplicity of elongated wire channels traversing the lower head section, each channel running between one of the multiplicity of entrances disposed on the upward facing surface and one of the multiplicity of exits disposed on the downward-facing surface; wherein at least a two of the multiplicity of entrances are configured to receive each of at least two wire feeds from each of at least a two wire feeders and the corresponding two wire exits are configured to deliver wire towards a common focus.",
"In other embodiments of the feed-head, the heat delivery channel is aligned along a common longitudinal axis of the upper and lower head sections, and the longitudinal axes of the multiplicity of elongated wire channels are inclined at equal angles to the head longitudinal axis and converge on the common focus disposed on the head longitudinal axis below the downward-facing surface.",
"In yet other embodiments, the longitudinal axes of the multiplicity of channels are inclined at around 50 degrees to the longitudinal axis and distributed symmetrically around the longitudinal head axis, the multiplicity of channels have essentially cylindrical portions with internal diameters between about 1.5 and 3.0 mm and lengths between about 15 and 50 mm, the multiplicity of wire channels comprises twelve or more channels, one or more of the multiplicity of wire channels further comprises a constriction at the channel exit, the multiplicity of wire channels comprises wire channels of the same length and internal diameter, liner tubes traverse at least a portion of one or more of the wire channels and extend beyond the downward-facing surface, In further embodiments, the downward-facing surface is essentially flat and disposed perpendicular to the head longitudinal axis, concave and disposed co-axially with respect to the longitudinal head axis to reflect heat radiation towards the common focus, and substantially hemispherical, again disposed co-axially with respect to the longitudinal head axis to reflect heat radiation towards the common focus.",
"In other embodiments, feed head further comprises a second upward-facing surface and one or more elongated powder feed channels, each running between an entrance on the second upward facing surface and an exit on downward-facing surface, and the longitudinal axes of the one or more powder channels are inclined at around 20 degrees to the longitudinal axis and have essentially cylindrical portions with internal diameters between about 1.5 and 3.0 mm.",
"In another embodiment, a system for alloy sample formation according to the above-disclosed methods is disclosed, comprising the above-disclosed feed-head and further comprising: mechanisms for applying controlled relative displacement and/or rotation of feed-head and work-piece; at least two wire feeders and controllers for the at least two-wire feeders; and a directional heat source coupled to the feed-head.",
"In other embodiments, the system further comprises a chamber enclosing the multi-wire feed head and work-piece configured to allow back-filling with an inert gas, and a flowing inert gas shield configured to enclose at least a fraction of the downward-facing surface and the heat-affected region comprising the sample and/or at least a portion of the work-piece surface."
],
[
"RELATED APPLICATIONS This application is a divisional application of U.S. application Ser.",
"No.",
"14/403,913 filed Nov. 25, 2014 and now U.S. ______ that in turn is a U.S. National Phase of PCT/EP2012/059895 filed May 25, 2012; the contents of which are hereby incorporated by reference.",
"TECHNICAL FIELD The invention relates to the formation of alloy samples, to combinatorial alloy discovery using combinatorial sample series and libraries, and to additive manufacturing of shaped alloy components.",
"BACKGROUND The combinatorial approach to materials development depends on being able to rapidly synthesize sample libraries spanning diverse ranges of compositions and processing conditions.",
"The approach has seen widespread application in the pharmaceutical and other sectors, but has been applied only tentatively in alloy development, largely because of the difficulties of rapidly synthesizing, under clean conditions and at high temperatures, series or libraries of samples large and homogeneous enough to exhibit bulk-like alloy properties.",
"Separately, the high cost of shaped alloy components made using conventional metallurgical processes has spurred development of a range of additive-manufacturing technologies, in which components are formed by sequentially depositing controlled amounts of material on selected areas of a work-piece surface while a localized heat source is applied to those areas.",
"In such additive manufacturing technologies, the localized heat source is typically a laser, a directed plasma arc or an electron beam, and the material is typically fed in the form of a powder stream or wire.",
"Additive manufacturing systems that combine a localized heat source with one or more powder streams have been developed.",
"For example, U.S. Pat.",
"No.",
"5,961,862 (University of California) discloses an integrated deposition head delivering two or more gas-assisted powder streams having the same composition towards the focal region of the laser.",
"However, the difficulty of incorporating even a substantial fraction of the incident powder stream (or streams) directed towards a small heated region, such as a pool of molten material produced by a focused laser, renders powder-based systems inherently unsuitable for use in combinatorial alloy development, which requires precise and accurate control of sample composition, and also increases the cost of components made by powder-based additive manufacturing.",
"Unlike powder feeders, a suitably configured wire-feeder can deliver substantially all of a length of wire, comprising an element or alloy, into a small region of molten material.",
"Various wire feeders, allowing accurate and precise control of feed rate, rapid starting and stopping of the feed, and accurate and precise positioning of the end of a single wire, have been developed, generally for use in welding.",
"U.S. Pub.",
"App.",
"No.",
"2010/0089890 (Manning) describes a hand-held wire-feeder with a positioning tube for the relatively fine wires, 0.13 to 0.32 mm diameter, used in laser welding of jewelry, and U.S. Pat.",
"No.",
"5,137,223 (U.S. Dept.",
"of Energy), a machine-controlled wire feeder, comprising a torque motor that applies tension to the wire and a stepper motor that advances an elastic-coated drive wheel to deliver wire through a hypodermic needle into the less than 0.25 mm diameter melt pools typical in high density electron beam or laser welding.",
"A laser welding system having a separate wire-feeder for introducing wire into the output of a laser head integrated with a powder feeder, allowing switching between laser and powder feed, has also be proposed.",
"U.S. Pub.",
"App.",
"No.",
"2006/0049153 (Honeywell Int'l, Ltd.).",
"In order to improve process controllability and access to non-planar work-pieces, feed-heads having laser optical systems adapted to accommodate a single, axially-fed wire have been developed.",
"U.S. Pat.",
"No.",
"6,294,754 (Mitsubishi Heavy Indus., Ltd.); WO Pub.",
"App.",
"No.",
"2009/039753 (Suzhou Univ.).",
"A plasma-arc feed-head comprising a single, axially-fed, wire has also been developed.",
"U.S. Pat.",
"No.",
"6,365,867 (Sandia Corp.).",
"Such single-wire feed-heads are not capable of the rapid synthesis of combinatorial alloy sample series or libraries from multiple wires having diverse compositions.",
"U.S. Pat.",
"No.",
"5,578,227 (Rabinovitch) discloses a rapid prototyping system comprising a wire feeder and delivery tube configured to pivot around the optic axis of a laser head, FIG.",
"1; 5:55-6:6 & 6:9-14.U.S.",
"Pat.",
"No.",
"5,578,227, and proposes that composite prototype articles, comprising, for example, layers of stainless steel and an organic material, might be produced by alternating two wire feeders delivering two different materials.",
"7:3-9.U.S.",
"Pat.",
"No.",
"5,578,227 does not disclose combining the output of two wire feeders in a single molten region, either sequentially or simultaneously.",
"The present invention overcomes the above and other limitations of the prior art by employing an integrated multi-wire feed-head to form alloy samples having defined compositions, suitable for combinatorial alloy discovery and additive manufacturing applications.",
"SUMMARY OF THE INVENTION In one embodiment, a method is disclosed for producing an alloy sample, comprising the steps of: furnishing a directional heat source and wire feed-head; disposing a work-piece surface a fixed distance from the wire feed-head, wherein the feed-head and work-piece are configured to allow the feed-head to deliver heat from the directional heat source into a heat-affected region comprising at least a portion of the work-piece surface, and wherein the feed-head is further configured to feed the ends of one or more of a multiplicity of wires having diverse compositions into the heat-affected region; the method further comprising the steps of: delivering heat and feeding selected lengths of at least two wires having diverse compositions into the heat-affected region to form, on the portion of the work-piece surface, a substantially homogeneous molten alloy portion having a composition defined by the cross sectional areas and relative proportions of the selected lengths of the at least two wires; and cooling the molten alloy portion to form a solid alloy portion having the same defined composition as the molten alloy portion.",
"In other embodiments, the selected lengths of the at least two wires are fed simultaneously into the heat affected region, the selected lengths are regulated by regulating the feed rates of the at least two wires over a time interval, and the feed rates of the at least two wires are fixed over the time interval and the relative proportions of the selected lengths are regulated by regulating the relative proportions of the feed rates of the at least two wires.",
"In yet another embodiment, immediately preceding the step of delivering heat and feeding selected lengths of the at least two wires, a length of one of the at least two wires is fed and heat is delivered into the heat affected region to form a molten nucleus on the portion of the work-piece surface, wherein the length is a negligible fraction of the selected length of that wire.",
"In another embodiment, following the step of delivering heat into the heat-affected region while feeding and melting selected lengths of the at least two wires, the steps are implemented of delivering heat and feeding second selected lengths of the at least two wires having diverse compositions into the molten alloy portion over a second time interval while maintaining the defined composition of the molten alloy portion essentially constant during the second time interval; and maintaining an essentially fixed distance between the feed-head and the molten alloy portion during the second interval by increasing the distance between the feed-head and the original work-piece surface to compensate for formation of a solid alloy portion disposed between the molten alloy portion and the original work-piece surface.",
"In yet another embodiment, the second selected lengths have the same relative proportions as the selected lengths, the feed rates of the at least two wires are fixed over the second time interval and the relative proportions of the second selected lengths are regulated by regulating the relative proportions of the feed rates of the at least two wires, In yet other embodiments, the feed rates of the at least two wires are unchanged between the first and second time intervals, the second time interval is at least five times as long as the first time interval and the molten alloy portion maintains essentially the same diameter throughout the second interval.",
"In other embodiments, the head is further configured to direct one or more powder streams towards the heat-affected region, one or more powder streams are directed towards the heat-affected region and material comprising the one or more powder streams incorporated into the molten alloy portion.",
"In yet other embodiments, the molten or solid alloy portions are exposed to a reactive gas and at least a fraction of the reactive gas incorporated into the molten or solid alloy portions.",
"In other embodiments, the directional heat source is a laser, an electron beam or a plasma arc.",
"In yet further embodiments, additional heat is supplied to or removed from the work-piece while feeding the at least two wires, one or more of the selected lengths of at least two wires are preheated, heat is delivered from a second directional heat source to the molten alloy portion.",
"In other embodiments, the molten alloy portion is cooled to form a substantially homogeneous solid alloy portion or heat is delivered to the solid alloy portion to form a substantially homogeneous solid alloy portion before it is cooled.",
"In further embodiments, a shaped component is formed by applying controlled relative motion between feed-head and work-piece while directing heat and feeding the at least two wires to form successive solid alloy layers on selected regions of the work-piece surface, wherein the selective layers comprise a shaped alloy component having a defined composition, and the defined composition of at least a portion of the successive solid alloy layers are changed, wherein the selected layers comprise a shaped alloy component comprising regions of diverse defined alloy compositions.",
"In another embodiment, a combinatorial alloy sample series or library is created by applying controlled relative motion between feed-head and work-piece and forming, at different locations on the original work-piece surface, a multiplicity of alloy samples have diverse defined compositions and/or diverse thermal histories.",
"In another embodiment, a multi-wire feed-head is disclosed suitable for use in any of the above methods, comprising: an upper section comprising an entrance opening for receiving heat output from a directional heat source; a lower section comprising an upward facing surface and a downward facing surface; an elongated heat delivery channel traversing the upper and lower head sections running between the upper section opening and an exit disposed in the downward-facing surface of the lower section; and, a multiplicity of elongated wire channels traversing the lower head section, each channel running between one of the multiplicity of entrances disposed on the upward facing surface and one of the multiplicity of exits disposed on the downward-facing surface; wherein at least a two of the multiplicity of entrances are configured to receive each of at least two wire feeds from each of at least a two wire feeders and the corresponding two wire exits are configured to deliver wire towards a common focus.",
"In other embodiments of the feed-head, the heat delivery channel is aligned along a common longitudinal axis of the upper and lower head sections, and the longitudinal axes of the multiplicity of elongated wire channels are inclined at equal angles to the head longitudinal axis and converge on the common focus disposed on the head longitudinal axis below the downward-facing surface.",
"In yet other embodiments, the longitudinal axes of the multiplicity of channels are inclined at around 50 degrees to the longitudinal axis and distributed symmetrically around the longitudinal head axis, the multiplicity of channels have essentially cylindrical portions with internal diameters between about 1.5 and 3.0 mm and lengths between about 15 and 50 mm, the multiplicity of wire channels comprises twelve or more channels, one or more of the multiplicity of wire channels further comprises a constriction at the channel exit, the multiplicity of wire channels comprises wire channels of the same length and internal diameter, liner tubes traverse at least a portion of one or more of the wire channels and extend beyond the downward-facing surface, In further embodiments, the downward-facing surface is essentially flat and disposed perpendicular to the head longitudinal axis, concave and disposed co-axially with respect to the longitudinal head axis to reflect heat radiation towards the common focus, and substantially hemispherical, again disposed co-axially with respect to the longitudinal head axis to reflect heat radiation towards the common focus.",
"In other embodiments, feed head further comprises a second upward-facing surface and one or more elongated powder feed channels, each running between an entrance on the second upward facing surface and an exit on downward-facing surface, and the longitudinal axes of the one or more powder channels are inclined at around 20 degrees to the longitudinal axis and have essentially cylindrical portions with internal diameters between about 1.5 and 3.0 mm.",
"In another embodiment, a system for alloy sample formation according to the above-disclosed methods is disclosed, comprising the above-disclosed feed-head and further comprising: mechanisms for applying controlled relative displacement and/or rotation of feed-head and work-piece; at least two wire feeders and controllers for the at least two-wire feeders; and a directional heat source coupled to the feed-head.",
"In other embodiments, the system further comprises a chamber enclosing the multi-wire feed head and work-piece configured to allow back-filling with an inert gas, and a flowing inert gas shield configured to enclose at least a fraction of the downward-facing surface and the heat-affected region comprising the sample and/or at least a portion of the work-piece surface.",
"BRIEF DESCRIPTION OF THE FIGURES FIG.",
"1 is a schematic of a system suitable for implementing embodiments of the invention.",
"FIGS.",
"2A through 2H show various stages in the formation of alloy samples.",
"FIG.",
"3 is a longitudinal section of a multi-wire feed-head suitable for implementing embodiments of the invention.",
"FIGS.",
"4A and 4B show top and bottom views of the lower portion of a multi-wire feed-head suitable for implementing embodiments of the invention.",
"FIG.",
"5 is a longitudinal section of the lower portion of a wire-fed head suitable for implementing embodiments of the invention.",
"FIG.",
"6 is a longitudinal section of the lower portion of a wire-fed head suitable for implementing embodiments of the invention.",
"Various features of the invention are described herein with reference to the figures, the written description and claims.",
"These features may be combined with or interchanged in any permutation other than one in which the features are mutually exclusive.",
"Comprising is used to mean including but not limited to the referenced features.",
"Unless otherwise specified, work-piece and work-piece surface are used to refer to the object and surface onto which deposition is performed, which may include a substrate, not necessarily comprising the metal or alloy being deposited, and may include already deposited metal or alloy material, including a portion of a metal or alloy component.",
"Adjacent is used to mean proximate, though not in contact with.",
"Abutting is used to mean in contact with.",
"DETAILED DESCRIPTION In the following, systems and methods for implementing various embodiments of the invention are described, comprising a directional heat source and a feed-head configured to feed the ends of one or more of multiple wires having diverse compositions into a heat-affected region at the surface of a work-piece, allowing selected lengths of two or more wires to be melted, combined into a substantially uniform molten alloy portion, cooled, and solidified to form a solid alloy portion having a defined composition.",
"FIG.",
"1 is a schematic of a part of a system suitable for practicing various embodiments of the invention.",
"A multi-wire feed-head 15 and directional heat source 14 are shown aligned along a common longitudinal axis, indicated by the dashed arrow, normal to horizontal and flat work-piece surface 18.",
"(In general, work-piece surface 18 need not be flat or horizontal, and head 15 and heat source 14 need not share a common longitudinal axis aligned vertically or normal to the surface of work-piece 18.)",
"Head 15 is shown comprising an upper section 15U, coupled to a directional heat source 14, and a lower section 15L having a flat and horizontal downward-facing surface disposed a vertical distance ZW above work-piece surface 18.",
"(As discussed below, the downward facing surface need not be flat or horizontal.)",
"Heat output H from heat source 14 travels along path B, shown bounded by the dashed lines and aligned with the longitudinal axis of heat source 14 and head 15, exits from lower head section 15L, and impinges on a portion of sample 17, shown formed on work-piece surface 18.",
"(In general, the heat path B need not be aligned with the common longitudinal axis of heat source 14 and head 15, nor aligned normal to original work-piece surface 18, and heat output H may be attenuated between leaving source 14 and reaching the surface of sample 17 or original work-piece surface 18.)",
"Directional heat source 14 may be one of several types, including a laser (as in the binary alloy examples given below) electron beam or plasma arc, and its output need not have the convergent, straight-sided profile shown.",
"The ends of lower portions of a multiplicity of wires may be fed from the downward-facing surface of lower head section 15L along directions (defined by the directions of the longitudinal axes of the elongated channels traversing the head, as discussed below) that converge on a common focus F located a distance ZF below the downward-facing surface along the longitudinal axis of head.",
"(In general, each of the multiplicity of wires traversing head 15 need not be fed towards the same common focus, as also discussed below.)",
"The multiplicity of wires may comprise wires consisting of elements or alloys and may comprise wires having diverse cross-sectional areas.",
"Continuous wires 1 and 2, consisting of materials M1 and M2, are shown in FIG.",
"1 as comprising upper portions 1U and 2U—originating on spools S1 and S2, being impelled at rates R1 and R2 by feeder drive wheels F1 and F2 towards entrances (not shown) disposed across an upward-facing surface of lower section 15L—middle portions 1M and 2M—traversing lower head section 15L, as shown by the dashed lines, through elongated channels (not shown)—and lower portions 1L and 2L—extending from exits (not shown) disposed across a downward-facing surface of lower head section 15L towards sample 17.The feed rates R1 and R2 (typically expressed in units of mm/s) imparted to wires 1 and 2 may be controlled independently, including being accelerated, decelerated, started and stopped independently.",
"(Only wires 1 and 2 are illustrated.",
"However, further wires 3 through N may be fed at variable rates R3 to RN through head 15 towards sample 17, where N is the number of available wire channels, equal to eight in FIGS.",
"4A and 4B, twelve in the head used to fabricate the alloy examples discussed below, and may be up to around fifty, as discussed below.)",
"As shown in FIG.",
"1, for a given heat output H from source 14 (possibly assisted by heat from other sources, as discussed below) over a given path B, feed rates R1 and R2 of wires 1 and 2 may be regulated such that the converging ends of lower portions 1L and 2L are continuously melted upon entry into a heat-affected region formed at the intersection of heat path B with the surface of sample 17 or original work-piece surface 18.In FIG.",
"1, the heat-affected region (not shown) may be a molten alloy portion (also referred to as a melt pool) at the surface of sample 17 extending beyond the boundaries of path B (as shown in FIGS.",
"2D and 2H) into which volumes of materials M1 and M2 from wires 1 and 2 are continuously incorporated at rates R1A1 and R2A2, where A1 and A2 are the cross-sectional areas of wires 1 and 2.The size of the heat-affected region may vary over the growth of sample 17.As explained below with reference to FIG.",
"2, when heat source 14 is first directed towards original work-piece surface 18, the heat-affected region may be essentially confined to the intersection of path B with work-piece surface 18 (corresponding, for example, to a laser spot on the substrate surface), while at later stages in the growth of a sample 17, the heat-affected region may be a molten alloy portion (or melt pool) encompassing all or part of sample 17.Stages in the growth of an alloy sample 17 on the surface of work-piece 18 according to an embodiment of the invention are shown in FIGS.",
"2A to 2D.",
"Feed-head 15 is not shown, though the vertical distance from the surface of lower head section 15L, from which wires 1 and 2 exit, to a horizontal and flat portion of original work-piece surface 18 is indicated in each figure.",
"(For convenience, vertical, horizontal, upward-facing and downward-facing are used to refer to the relative orientation of work-piece and head, though, as already noted, the work-piece surface need not be perfectly horizontal and the longitudinal orientation of the head need not be aligned perfectly along a vertical direction above the work-piece surface.)",
"The path B of the heat output, also aligned vertically and normal to horizontal work-piece surface 18, is indicated by the converging dashed lines labeled B.",
"The heat output H and path B are unchanged between FIGS.",
"2A, 2B, 2C and 2D.",
"FIG.",
"2A shows original work-piece surface 18 disposed a distance ZF below lower head section 15L, measured from the exit of the heat-directing channel, with common wire focus F in the plane of original work-piece surface 18.In general, focus F may lie below or above a work-piece surface 18.Heat path B is shown intersecting a circular region of work-piece surface 18 with diameter YB centered on common focus F. The end of lower portion 1L of wire 1 is shown being fed at a fixed rate R1 towards common focus F, extending as far as the edge of heat path B in a straight line.",
"(In general, the heated wire may flex, or melt, before it reaches the boundary of path B, and may extend into the center of path B in a straight line, depending on factors such as the feed rate R1, heat output H, size of path B, and the sequence in which wire feed and directional heat source are applied.)",
"FIG.",
"2B shows the end portion 1L having been fed at rate R1 for a time interval TN to melt a volume R1A1TN of wire 1 to form a molten nucleus 17N with diameter YN of material M1 on original work-piece surface 18.The lower portion 2L of wire 2 is also shown, being fed at a fixed rate R2 towards, but having not yet reached, molten nucleus 17N.",
"(Though the diameter YN of molten nucleus 17N is shown as greater than the diameter of region YB, formed by the intersection of heat path B with original work-piece surface 18, the end of lower wire portion 2L may be brought into contact with a molten nucleus having a diameter YN which is smaller than YB, as in FIG.",
"2F).",
"FIG.",
"2C shows the ends of lower portions 1L and 2L of wires 1 and 2 having been fed at fixed rates R1 and R2 over a further time interval TM, in a case where TN is a small fraction of TM, and melted to form a molten portion 17M with diameter YM and height ZM comprising a mixture of materials M1 and M2 from selected lengths L1, equal to R1TM, and L2, equal to R2TM, of wires 1 and 2.",
"(In general, rates R1 and R2 need not be fixed during time interval TM, so long as the selected lengths L1 and L2 of wires 1 and 2 may be regulated, for example, by integrating variable rates R1 and R2 over TM, or by applying another direct or indirect measurement of L1 and L2 allowing regulation of L1 and L2.)",
"Setting aside the contribution from nucleus 17N as negligible (which need not be the case, such as where the nucleus forms a fraction of a selected length), and possible losses or gains of material, due to evaporation, diffusion, etc., molten portion 17M will consist of an amount of material M1 equivalent to a solid volume L1A1 of material M1 and an amount of material M2 equivalent to a solid volume L2A2, material M2.By regulating selected lengths L1 and L2, for given cross-sectional areas A1 and A2, the composition of molten alloy portion 17M may be defined as L1A1 parts material M1 and L2A2 parts material M2.With cross-sectional areas A1 and A2 essentially constant over the length of each of wires 1 and 2, the composition of molten alloy portion 17M may be defined by regulating the relative proportions of selected lengths L1 and L2.Further, where feed rates R1 and R2 are fixed over interval TM, the composition of molten alloy portion 17M may be defined by regulating the relative proportions of feed rates R1 and R2.",
"(In the special case where R1 and R2 vary over interval TM, but always in a fixed proportion, a similar relationship may be established.)",
"For example, where equal cross-sectional area wires 1 and 2 consists of elements E1 and E2, a binary alloy, having a defined composition of R1 parts E1 and R2 parts E2, may be formed by regulating the feed rates R1 and R2 over a time interval TM.",
"As another example, again for equal cross-section wires, where wire 1 consists of an equal mixture of elements E1 and E2, and wire 2 consists of element E3, a tertiary alloy having a defined composition R1/2 parts E1, R1/2 parts E2 and R2 parts E3, may be formed by regulating the fixed feed rates R1 and R2.Given sufficient convection and diffusion within molten portion 17M, a substantially homogeneous mixture may be formed between materials M1 and M2.",
"(The molten portion may not be completely homogeneous, having, for example, locally higher concentrations of M1 and M2 where the ends of wires 1 and 2 enter, so long there is sufficient mixing within the volume before all or part of the molten alloy portion solidifies.)",
"Having grown, as shown in FIG.",
"2C, with the molten portion extending beyond the boundaries of heat path B, the wire feeds may be stopped and the heat output removed, and molten portion 17M cooled to form a substantially homogeneous solid alloy portion 17S having the same composition as molten portion 17M, as defined by regulating rates R1 and R2.On the other hand, molten alloy portion 17M, having reached a given size, may begin to solidify, once the heat output H entering along path B is insufficient to maintain the entire sample in a molten state, as heat is continuously lost from the boundaries of the molten portion furthest from heat path B, through radiation, conduction, etc.",
"For a given heat output H entering along path B, a given composition substrate (original work-piece), and given materials M1 and M2 being fed at given rates R1A1 and R1A1, a molten portion 17M may be formed with a certain maximum size before solidification begins.",
"(As discussed below additional heat may be delivered to the molten and solid alloy portions and work-piece, in an effort to retard solidification.)",
"FIG.",
"2D shows the result of feeding wires 1 and 2 at fixed rates R1 and R2 over a further time interval TS, which is long enough for the molten portion to have grown beyond a maximum molten size, while at the same time increasing the vertical separation between head and original work-piece surface 18 by an amount ZS, where ZS is the increase in height of sample 17 due to formation of solid portion 17S during time interval TS.",
"Alloy sample 17 is shown comprising an upper molten portion 17M, with substantially the same diameter YM and composition as the molten portion shown in FIG.",
"2C, and a larger solid portion 17S, with diameter YS and height ZS, formed underneath molten portion 17M, (The boundary between molten and solid portions is shown by the dashed line, but need not follow the contour indicated).",
"Molten portion 17M may attain and maintain an essentially constant size and be maintained at fixed distance below the head, with a composition defined by the relative proportions of rates R1 and R2, by compensating the increase in elevation of molten portion 17M, caused by the incorporation of materials M1 and M2 at rates R1A1 and R2A2 into the solid portion 17S of sample 17, throughout a time interval TS.",
"Where interval TS is significantly longer than TM, a solid alloy portion 17S significantly larger than molten portion 17M may be formed.",
"By increasing the vertical separation between head and work-piece at an essentially constant rate ZS/TS over time TS, and introducing molten materials M1 and M2 at fixed rates R1A1 and R2A2 into molten portion 17M having an essentially constant diameter YM over time TS, substantially homogeneous molten material may be maintained and solidified under stable conditions, and a substantially homogeneous microstructure formed in the solid alloy portion 17S.",
"Once time interval TS has elapsed, wire feeds 1 and 2 and the heat output may be stopped, or simply removed, allowing residual molten portion 17M to solidify completely.",
"Heat delivery may also be diminished gradually, to control the cooling rate of residual molten portion 17M and solid portion 17S.",
"In order to ensure complete melting of wires 1 and 2 upon introduction into the heat-affected region, and avoid premature solidification of molten alloy portion 17M, for given cross-sectional areas A1 and A2, and compositions M1 and M2, and for a given heat output H over path B, feed rates R1 and R2 may be kept below threshold values.",
"Where the ends of lower portions 1L and 2L are fed into molten portion 17M but outside the intersection of path B (as in FIGS.",
"2C and 2D), these threshold values may depend on additional factors, such as the distances from the wire entry points to the boundaries of path B and solid portion 17S.",
"The method shown in FIGS.",
"2A to 2D may be generalized to three, four or more wires, and to the formation of tertiary, quaternary, or higher, molten alloys having any of a range of defined compositions.",
"FIGS.",
"2E to 2H show stages in the production of tertiary alloy from wires 1, 2 and 3, each composed of different elements E1, E2 and E3, with the process viewed from the head looking down onto the work-piece surface 18.FIG.",
"2E show the end or lower portion IL of wire 1 extending from an exit in the lower surface of the head (not shown) having been fed at a fixed rate R1 and just reached path B.",
"The lower portions 2L and 3L of stationary wires 2 and 3 are shown extending slightly below the lower head surface from their respective channel exits.",
"(Unlike the embodiment shown in FIGS.",
"4A and 4B, the head employed in FIGS.",
"2E to H is capable of introducing lower wire portions with three-fold symmetry.)",
"FIG.",
"2F shows the end portion 1L of wire 1 having been fed at rate R1 over time interval TN1 and melted to form to a molten nucleus 17N1 on surface 18.Lower portion 2L of wire 2 is stationary and lower portion 3L of wire 3 is shown being fed from the head at a fixed rate a R3 towards, but having not yet reached, molten nucleus 17N1, which has a diameter smaller than that of heat path B.",
"In FIG.",
"2G, a further time interval TN3 has passed, and the ends of lower portions 1L and 3L of wires 1 and 3 are shown being fed at fixed rates R1 and R3 into nucleus 17N13, which consists of elements E1 and E3.The end of lower portion 2L of wire 2 is shown being fed from the head at rate a R2 towards, but having not yet reached, molten nucleus 17N13, which is shown with a diameter smaller than heat path B.",
"The sequence of introduction of the ends of wires 3 and 2 into the nucleus first formed from wire 1 may be reversed and, in some circumstances, wires 3 and 2 may be introduced at the same time.",
"In FIG.",
"2H, a time interval TM has passed since the end of lower portion 2L of wire 2 made contact with nucleus 17N13, during which the ends of the lower portions of wires 1, 2 and 3 have been fed and melted at fixed rates R1, R2 and R3 to form molten portion 17M, formed from selected lengths L1, L2 and L3, equal to TMR1, TMR2 and TMR3, of wires 1, 2 and 3.Under appropriate conditions, molten portion 17M, shown having grown in time TM to a diameter greater than heat path B, formed form volumes L1A1, L2A2 and L3A3, where A1, A2 and A3 are the cross-sectional areas of wires 1, 2 and 3, may be substantially homogeneous.",
"As discussed above, setting aside negligible contributions from nucleus 17N13, and possible additions or losses of material, the composition of molten tertiary alloy portion 17M may be defined by appropriately regulating the relative proportions of fixed feed rates R1, R2 and R3.For example, where A1, A2 and A3 are equal, molten tertiary alloy portion 17M may be formed consisting of R1 parts E1, R2 parts E2 and R3 parts E3.As discussed for samples formed from two wires, heat output H may be maintained over beam path B, and wire feed rates maintained at R1, R2 and R3, over a further time interval TS, during which a gradual compensatory increase in the vertical separation between head and work-piece is applied, equivalent to the height ZS of the solid alloy portion formed over time TS, allowing formation of a solid alloy portion 17S that is significantly larger than molten alloy portion TM, albeit with the same composition, defined by regulating the proportions of R1, R2 and R3.As also discussed above for samples formed from two wires, after time interval TS has elapsed, wire feeds 1, 2 and 3, and the heat output may be stopped, or simply removed, allowing sample 17 to solidify completely.",
"As described above, the feed rates of one or more of a multiplicity of wires having diverse compositions may be regulated independently to form, from selected wire lengths, a molten alloy portion having a desired composition.",
"Though the feed rates of the one or more wires used to form a sample need not be fixed over an entire deposition interval (or intervals), fixed feed rates, or at least fixed feed rate ratios, may be used for simplicity, stability and ease of process control, particularly in the method discussed above, in which the vertical separation of head and work-piece is increased, during a second deposition interval, to compensate for solidification during deposition.",
"As also mentioned above, alloy wires of known composition may be substituted for one or more of the elemental wires, to reduce the number of wire feeds required to form a desired alloy composition consisting of a given number of elements.",
"As already noted, for materials which are not available in wire form, one or more powder streams may also be used in combination with the wire feeds.",
"The rate of the powder feed may be regulated using known methods, in which a powder is typically introduced with an inert gas stream.",
"One or more reactive gases may also be used to introduce additional elements into molten or solid alloy samples.",
"Such reactive gases may be introduced as a fixed background pressure or a jet, optionally passing through one of the elongated channels in the head, or may be combined with the inert gas in the powder streams.",
"Since the incorporation rate of material in powder and gas form may not be regulated as directly as a wire feed, powder and gas feed rates may need to be calibrated for each set of processing conditions.",
"For certain combinations of wire materials and feed rates (and optionally powder/gas streams and feed rates), particularly those involving high melting point materials and high feed rates, heat output H exiting head 15 may not be large enough to form a sufficiently homogeneous molten alloy portion.",
"In such cases, a second directed heat source, for example, a CO2 laser not coupled to head 15, may be used to deliver additional heat to the molten alloy portion, and/or to reduce heat losses by heating the adjacent work-piece surface or solid alloy portions.",
"(The binary alloy examples given below, portions of which solidified during deposition as the vertical distance from head to original work-piece surface separation increased, were not prepared using an additional heat source, and yet yielded homogeneous solid alloy samples.)",
"Wires or powder feeds may also be preheated, to further increase heat delivery to the sample.",
"Conversely, in order to reduce heat loss from the molten and solid alloy portions, the work-piece may be heated, for example, using a resistance heater, based on nichrome or molybdenum disilicide, an infrared radiation heater or an induction heater.",
"As already mentioned, the lower surface of the feed head may also be shaped to focus radiated or reflected heat towards the sample.",
"Each of the methods discussed above, for increasing the heat delivery to or decreasing the heat loss from a molten alloy portion, may also be used to affect the thermal histories of solid alloy portions formed during the deposition process.",
"A fully solidified alloy sample may also be cooled at a defined rate, or given diverse heat treatments, by selective application of the additional directional heat source, and/or the directed heat source coupled to the head (with the wire/powder feeds stopped and a suitably-adjusted beam path).",
"Solidified alloy samples may also be heated indirectly, by heating the work-piece by any of the methods mentioned above.",
"Conversely, alloy samples may be cooled indirectly, by cooling the work-piece, during and after deposition, by placing the work-piece in thermal contact with a cooled body, such as a copper plate through which cooling water is circulated.",
"The methods and systems described herein, comprising a multi-wire feed-head, for formation of a single alloy sample having a defined composition may be extended to form combinatorial series or libraries of alloy samples having diverse compositions and processing/thermal histories distributed in different locations across a work-piece surface, optionally in a regular array on a flat surface.",
"Combinatorial series or libraries may be formed by systematically changing the defined composition and processing conditions/thermal histories between samples and applying controlled relative motion (rotation and/or displacement) of the head and work-piece to address different work-piece surface locations.",
"For example, with a head configured to feed three elemental wires, as discussed above and illustrated in FIGS.",
"2E to 2H, by systematically changing the feed rates of the three wires between samples, a multiplicity of alloy samples having diverse compositions may be formed on different locations of a work-piece surface, allowing exploration of the phase space of the tertiary alloy system.",
"(Series is used here to mean changing one variable, and library, more than one.)",
"By adding an additional elemental wire, elemental powder feeder, or reactive gas source, a quaternary alloy system may be investigated.",
"As already noted, other configurations, involving alloy wires, may be used to explore quaternary and higher alloy systems.",
"Further, the effect of diverse processing conditions within such alloy series or libraries may be investigated by applying different thermal processing histories to different samples, using the methods discussed above.",
"The wire feeds may be stopped completely as head and work-piece are moved between samples, or may be adjusted to maintain one or more wire feeds, suitable for forming a nucleus for the next sample in the series or library.",
"The methods and systems described herein, comprising a multi-wire feed-head, may also be used for additive manufacturing of alloy components, by implementing well known control technologies to apply successive layers of alloys (possibly interspersed with layers of elements) to selected regions of a work-piece surface.",
"As the defined composition of a component may be changed during formation of a component, diverse compositions within components may be created using the multi-wire feed-head.",
"A longitudinal section through the axis of a suitable multi-wire feed-head is shown in FIG.",
"3.Head 15 comprises upper, middle and lower sections, 15U, 15M and 15L, and may be manufactured as a single piece of material, such as a copper alloy, or assembled form one or more sections or subsections.",
"Upper section 15U couples to heat source 14 and middle section 15M (shown, but not labeled in FIG.",
"1), and encloses cavity 15S, which is configured to accept at least part of heat source 14 (for example, part of a CO2 laser or laser optics package) and abut the top of heat-delivery channel 15H, which is shown having a substantially conical inner surface (though other forms may be used) and extending from cavity 15S through a portion of section 15U, traversing sections 15M and 15L, and exiting a downward-facing surface of lower section 15L.",
"Middle section 15M is also coupled to lower section 15L, shown in FIG.",
"1 being traversed by portions 1M and 2M of wires 1 and 2 and disposed a distance ZW above original work-piece surface 18.FIG.",
"3 shows upper section 15U having an inlet and outlet, collectively 15W, for a cooling liquid, typically water.",
"(The internal cooling channel or channels between inlet and outlet 15W are not shown, though they may extend into sections 15M and 15L.)",
"As in FIG.",
"1 and elsewhere, the longitudinal head axis, along which the heat output H from heat source 14 is directed, is indicated by a dashed arrow and the extent of heat path B by dashed lines.",
"(The inside of heat delivery channel 15H may be polished or have a reflective or heat resistive coating applied and, where a laser heat source is used, one or more heat transparent windows, not shown, may also be introduced.)",
"Wire lower portions 1L and 2L of wires 1 and 2 are shown extending in straight lines towards a common focus in the center of heat path B, though they wires may flex or melt.",
"Because the heat-affected region at a sample or work-piece surface may extend well beyond path B, all the wire channels need not be focused exactly on the center of the heat path B, though the symmetrical, co-focused, arrangement shown in FIG.",
"3 offers advantages, as discussed below.",
"As also shown in FIG.",
"3, head section 15L is bounded by upward-facing surface 15B, an axially symmetric section of a conic surface, and upward-facing surface 15C, a second axially symmetric section of a conic surface.",
"The lower portion of lower head section 15L is bounded by downward-facing surface 15D, a third axially symmetric section of a conic surface, and a lower surface, which may be flat (solid line 15EF) or concave (dashed line 15Ec), for example, hemispherical, configured to reflect and concentrate heat towards the converging ends of one or more lower wire portions and alloy sample 17, as already mentioned.",
"In FIG.",
"3, elongated wire channels 151 and 152 are shown traversing lower head section 15L and running between wire entrance openings disposed on surface 15C and wire exit openings located on concave surface 15EC.",
"Wire channels 151 and 152 may have a circular cross section and comprise a wider entrance portion, as shown, which may facilitate attachment of the wire feed mechanism, and an exit constriction (not shown) intersecting concave downward-facing surface 15EC or 15EF, guiding the exiting wire lower portion along the channel axis.",
"(The liner tubes extending below the head shown below in FIG.",
"6, may also have constrictions at their exits.)",
"Channel lengths, channel widths and exit constrictions, may be configured to guide the wire towards a common focus without imparting undue resistance.",
"Typical internal channel diameters may vary between 1.5 and 3.0 mm and channel lengths between 15 and 50 mm.",
"The size of the wire exit constriction may depend on the diameter of the wire.",
"For example a 0.5 mm diameter wire may have a 0.7 mm diameter exit constriction, as in the feed head used to produce the alloy examples discussed below.",
"The inclination of the longitudinal axes of the elongated wire channels may be varied between 5 and 85 degrees from the longitudinal head axis, with an inclination of around 45 degrees being typical.",
"FIG.",
"4A is a view of head sections 15M and 15L seen from above, showing middle section 15M and axial heat-delivery channel 15H, upward-facing surface 15C, with entrances of wire channels 151, 152, 153 and 154 disposed in a four-fold symmetric arrangement, and upward-facing surface 15B, with entrances of wire/powder channels 1510, 1520, 1530 and 1540 also disposed in a four-fold symmetric arrangement.",
"FIG.",
"4B is a view of head 15 from below, showing downward-facing surface 15D and downward-facing concave surface 15EC, with the exit of axial heat-delivery channel 15H and the exits of wire channels 151, 152, 153 and 154 and wire/powder channels 1510, 1520, 1530 and 1540, each set of exits disposed in a four-fold symmetric arrangement.",
"In FIGS.",
"4A and 4B, the longitudinal sectional views of FIGS.",
"3 and 5 are marked by the dashed lines and arrows labeled 3′ and 5′.",
"FIG.",
"5 is a longitudinal section of head sections 15M and 15L showing wire/powder channels 1510 and 1520 intersecting surfaces 15B and 15EC, having a circular cross section and comprising a wide entrance section intersecting surface 15B and a narrower section intersecting concave surface 15EC.",
"Where such channels are used to feed wire, they may further comprise a constriction at the exits and have the dimensions noted above with relation to channels 151 through 154.Where channels 1510 or 1520 are used for powder streams, optionally comprising an inert or reactive gas, as indicated by the stream P10, the interior diameter of the powder feed channels may be between around 0.5 and 3.0 mm, typically around 1.6 mm.",
"The longitudinal axes of elongated powder delivery channels may be disposed at angles less than 45 degrees to the longitudinal head axis, typically around 20 degrees, in order to reduce the horizontal area onto which the divergent powder stream is projected.",
"In FIG.",
"6, wire delivery channels 151 and 152 are shown lined with tubes, T1 and T2, which may extend beyond surface 15EC, as shown, in order to further improve the precision and accuracy of wire delivery towards a common focus.",
"In which case, the larger diameter entrance portion of the wire channels shown in the figure may facilitate exchange of liner tubes and their attachment to wire feeders.",
"The liner tube may be made from a different material from the head, in order to improve wear resistance or enable operation of the head at higher temperatures.",
"As noted above, the liner tube may also comprise a constriction at its exit.",
"A suitable multi-wire feed-head may have an external shape and internal configuration different from those described above and shown in FIGS.",
"1 and 3 to 6.Intersecting upward- and downward-facing surfaces 15C and 15D may be equal-sized and disposed symmetrically about a horizontal plane, upward-facing surfaces 15B and 15C and downward-facing surface 15D need not be sections of conic surfaces, downward facing surface 15EC or 15EF need be flat or concave, and one or more of these surfaces may be combined to form a single surface bounding at least part of section 15L.",
"Further, coupling section 15U may be incorporated into section 15M, and sections 15U and 15Mmay be incorporated into section 15L, which may couple directly to heat source 14.The head 15 may be formed in a variety of external shapes that present an appropriate upward-facing surface (or surfaces), for the wire feed and powder feed entrances, coupling to the directional heat source, and an appropriate downward facing surface (or surfaces), for the exits of the wire and powder channels and the heat delivery channel.",
"The wire (or powder) channels and heat delivery channel may be disposed in a variety of configurations that allow delivery of the ends of one or more wires, and optionally one or more powder streams, into one or more common foci disposed at the center of heat path B (or an associated heat affected zone).",
"In general, the heat directing channel need not traverse the head in a direction parallel to the longitudinal head axis and need not emerge at the center of an axially symmetric downward-facing surface, and the wire and powder channels need not be disposed symmetrically around the heat delivery channel, need not all have the same internal diameters and lengths, and, as already noted, need not all be directed towards a single common focus.",
"However, a configuration with an axial heat delivery channel and symmetrical wire/powder channels converging on single common focus disposed along the head axis may be adopted to improve the thermal and mechanical stability of the head, leading to more accurate and precise control of, particular, the wire feeds, and, therefore, sample composition.",
"Further, by delivering wires in a symmetrical arrangement into an inherently highly symmetrical heat-affected zone, which is typically the case for a melt pool formed on a horizontal surface by a localized heat source, more stable and controllable process conditions may be achieved, particularly when balancing the entry of material into a molten alloy portion against the rate of solidification, while also compensating for increased sample height, as discussed above.",
"Depending on the specific internal and external head configuration, particularly, the size and separation of the upward-facing and downward-facing surfaces across which the wire (and optionally powder/gas stream) channel entrances and exits are distributed, and the size of those channel exits and entrances, anywhere from two to about fifty (50) channels may be accommodated in a feed-head of the type shown in FIGS.",
"1 and 3 to 6.Such a feed-head, having twelve symmetrically disposed wire channels with entrances intersecting surface 15C and exits forming a circle on flat lower surface 15E, was used to fabricate the binary alloy examples discussed below.",
"One advantage of having 12 symmetrically distributed channels is that two, three, four, six or twelve wires may be distributed symmetrically around the feed-head, allowing symmetrical delivery of wire lower portions.",
"Wire feeders, as shown schematically in FIG.",
"1 by spools S1 and S2 and drive wheels F1 and F2, may be of a number of suitable designs.",
"For example, a precision wire-feeder of the type described in U.S. Pat.",
"No.",
"5,137,223 (U.S. Dept.",
"of Energy), comprising a torque motor coupled to the spool to apply tension to the wire, a stepper motor coupled to an elastic-coated drive wheel to deliver wire into a feeder tube and an idler deployed to reverse direction of the wire moving between spool and drive wheel, may be particularly suitable.",
"As discussed above, the feed rates of each of multiplicity of wires may be regulated independently.",
"For typical wire diameters, between 0.125 and 2 mm, wire feed rates may be regulated up to around 40 m/minute, with and accuracy of a few mm.",
"A wire feed can typically be started or stopped within approximately 0.1 seconds.",
"Powder feeders may be one or several commercially available, generally gas-stream assisted, types, such as Sulzer Metco model Twin 10C fluidized bed powder feeder, capable of delivering powder at a rate between around 0.05 to 10 grams per minute.",
"The powder stream may be pre-warmed before introduction into the channels to improve flow.",
"Powder channels may also be lined with a tube of a suitable material having improved wear or thermal resistance over the material comprising the head.",
"As already noted, when using powder/gas streams, the rate at which material is incorporated into a molten sample is less amenable to rapid control.",
"In order to minimize the exposure of molten or heated alloys and constituents to contaminants, and prevent uncontrolled reactions with the constituents of the atmosphere, the multi-wire feed-head may be operated in an inert gas atmosphere, in a vacuum-pumped chamber back-filled with inert gas or with a flowing inert gas shield, or at reduced pressure in a vacuum-pumped chamber.",
"As already noted, when operating the system in a vacuum chamber, a regulated amount of one or more reactive gases, may be introduced into the chamber housing the multi-wire feed head, for controlled incorporation into an alloy sample, optionally directed towards the sample, including as part of the powder streams.",
"As already discussed, the multi-wire feed-head may be equipped with control mechanisms for applying relative motion (rotation and or displacement) between head and work-piece, which may be operated/programmed, in combination with wire feed (and optionally powder feeds) control mechanisms, to form combinatorial series or libraries of sufficiently separated alloy samples, typically distributed on the surface of a planar work-piece.",
"On the other hand, as already noted, by applying well known additive-manufacturing control techniques, and by depositing successive layers of alloy material, a three-dimensional shaped component, optionally having a graded and diverse composition may be formed.",
"(In either mode, depending on the type of directional heat source applied, continuous operation of the heat source may be advantageous for stability.)",
"EXAMPLES Alloy samples, including the Fe/Al and Nb/Ti binary examples discussed below, were formed using a multi-wire feed-head comprising upper, middle and lower sections, with the lower head section bounded by two upward-facing sections of conical surfaces, a downward facing section of a conical surface and a flat lower surface, as described and shown in FIGS.",
"1 and 3.The axially feed head was made from a Cu alloy with, unlike the example shown in FIGS.",
"4A and 4B, 12 wire channels entrances distributed symmetrically at equal distances from the longitudinal head axis across the lower upward-facing section of conical surface (equivalent to surface 15C in FIGS.",
"3 and 4A).",
"The longitudinal axes of the 12 cylindrical channels, each comprising a uniform 1.6 mm diameter section approximately 40 mm in length, are each inclined at 40 degrees to the horizontal plane (50 degrees to longitudinal head axis), with the 12 elliptical channel exits distributed symmetrically on the flat lower head surface (equivalent to 15EF in FIG.",
"3), and each exit having a 0.7 mm diameter constriction, with the 12 exits together describing a 12.5 mm diameter circle centered on the longitudinal axis of the head.",
"An axial heat delivery channel, approximately 5 mm in diameter at its exit at the center of the flat lower surface, allowed the adjustable output of a 1750 W CO2 laser to be directed along the longitudinal axis of the head and onto the work-piece and the sample.",
"Multi-wire feed-head and work-piece were operated in a chamber, evacuated and back-filled with Ar, and equipped with an optical system for observing alloy sample formation in real time.",
"Example 1 Fe/Al A binary Fe/Al alloy was prepared using Fe and Al wire, 0.5 mm diameter of 99.95% purity Fe and 99.5% purity Al (Goodfellow, UK), melted with the CO2 laser output set at 768 W, focused to a spot with a diameter of around 2 mm on a flat stainless steel (SS304) substrate disposed approximately 11 mm below and parallel to the flat lower surface of the head.",
"Fe wire was fed into the heat-affected region until a visible Fe melt pool nucleus had formed.",
"Al wire was then fed into the melt pool nucleus and Fe and Al wires fed simultaneously until the melt pool reached approximately 6 mm in diameter, after an interval of approximately 30 seconds.",
"Throughout nucleation and growth of the alloy melt pool, the Fe feed rate was set at a fixed 909 mm/min.",
"During the alloy melt pool growth, the Al feed rate was fixed at 349 mm/min.",
"With Fe and Al feed rates and the laser operating conditions unchanged, the head was then displaced vertically relative to the substrate at a uniform rate of 9 mm/min over an interval of around 3 to 4 minutes, during which time the apparent diameter of the molten portion remained the same, while a solid Fe—Al alloy portion between the substrate and molten portion formed and increased in size.",
"The Fe and Al wire feeds were then stopped and the laser source immediately removed from the sample.",
"Ignoring the small excess of Fe in the molten nucleus, assuming complete incorporation of the equal diameter Fe and Al wires into the molten portion, and no preferential losses or incorporation of other elements in the molten and solid portions, a fixed Fe feed rate of 909 mm/min and a fixed Al feed rate of 349 mm/min defines the average composition of the alloy sample to be 909 parts Fe and 349 parts Al, which, adjusted for the different atomic weights and densities of solid Fe and Al, is equivalent to Fe-21 at % Al.",
"A cross-section of the Al—Fe sample, observed in a scanning electron microscope (“SEM”) at 20 kV operated in compositional contrast (back scatter) mode, showed a uniform and fine-grained microstructure, consistent with cast Fe-21 at % Al alloys prepared in bulk.",
"Further, quantitative composition measurements performed in the SEM on different sample areas using energy dispersive x-ray spectroscopy analysis (“EDS”) yielded an average sample composition of Fe-21.1 at % Al±0.5 at %, consistent with complete incorporation of the selected lengths of Al and Fe wire.",
"Example 2 Nb/Ti A binary Nb/Ti alloy was prepared using Nb wire, 0.5 mm diameter of 99.9% purity (Plansee, Germany), and Ti wire of 99.6% purity (Goodfellow, UK), melted with the CO2 laser output set at 1690 W, focused to a spot with a diameter of around 2 mm on a flat stainless steel (SS304) substrate disposed approximately 11 mm below and parallel to the flat lower head surface.",
"Nb wire was fed into the heat-affected region until a visible Nb melt pool nucleus had formed.",
"Ti wire was then introduced into the melt pool and Nb and Ti wires fed simultaneously until the melt pool reached approximately 4 mm in diameter, after an interval of approximately 30 seconds.",
"Throughout nucleation and growth of the alloy melt pool, the Nb feed rate was set at a fixed 208 mm/min.",
"During growth, the Ti feed rate at a fixed set at 26 mm/min.",
"With Nb and Ti feed rates and the laser operating conditions unchanged, the head was displaced vertically relative to the sample at a uniform rate of 4 mm/min over an interval of around 3 to 4 minutes, during which time the apparent diameter of the melt pool remained the same, while a solid Nb—Ti alloy portion between the substrate and molten portion formed and increased in size.",
"The Nb and Ti wire feeds were then stopped and the laser source immediately removed from the sample.",
"Ignoring the small amount of excess Nb in the sample nucleus, assuming complete incorporation of the equal diameter Nb and Ti wires into the molten portion, and no preferential losses or incorporation of other elements in the molten and solid portions, a fixed Nb feed rate of 208 mm/min and Ti feed rate of 26 mm/min defines the average composition of the alloy sample to be 208 parts Nb and 26 parts Ti, which, adjusted for the different atomic weights and densities of solid Nb and Ti, is equivalent to Nb-11.5 at % Ti A cross-section of the Nb—Ti sample, observed in a scanning electron microscope (“SEM”) at 20 kV operated in compositional contrast (back scatter) mode, showed a uniform and fine-grained microstructure, consistent with cast Nb-11 at % Ti alloys prepared in bulk.",
"Further, quantitative composition measurements performed in the SEM on different sample areas using energy dispersive x-ray spectroscopy analysis (“EDS”) yielded an average sample composition of Nb-11.7 at % Ti±0.8%, consistent with complete incorporation of the selected lengths of Nb and Ti wire."
]
] |
Patent_15871208
|
[
[
"COMPUTER IMPLEMENTED SYSTEM AND METHOD OF IDENTIFICATION OF USEFUL UNTESTED STATES OF AN ELECTRONIC DESIGN",
"A computer implemented system and method of computer implemented method of instrumentation of an electronic design comprising receiving by a computer a computer readable representation of said electronic design having at least in one part of said electronic design, an analog portion.",
"At least one instrumented netlist is generated based at least in part upon said representation of said electronic design.",
"At least one specification of said electronic design is received and at least one set of valid states is generated based on said at least one specification.",
"An analog verification coverage is determined utilizing said at least one instrumented netlist."
],
[
"1.A computer implemented method of instrumentation of an electronic design, comprising: receiving by a computer a computer readable representation of said electronic design having at least in one part of said electronic design, an analog portion; generating at least one instrumented netlist based at least in part upon said representation of said electronic design; receiving at least one specification of said electronic design; generating at least one set of valid states based on said at least one specification; and determining an analog verification coverage utilizing said at least one instrumented netlist.",
"2.The computer implemented method of instrumentation of said electronic design of claim 1, further comprising: simulating said at least one instrumented netlist; generating at least one verification coverage history of said electronic design based in part upon said simulation; and identifying at least one useful untested state based at least in part upon at least one of said at least one specification, said at least one instrumented netlist, said at least one set of valid states and said at least one verification coverage history.",
"3.The computer implemented method of instrumentation of said electronic design of claim 2, further comprising assessing verification completeness based at least in part upon said verification coverage history and said at least one set of valid states.",
"4.The computer implemented method of instrumentation of said electronic design of claim 3, further comprising correlating said at least one verification coverage history and at least one input vector.",
"5.The computer implemented method of instrumentation of said electronic design of claim 3, wherein said simulation of said at least one instrumented netlist is performed at a behavioral level.",
"6.The computer implemented method of instrumentation of said electronic design of claim 5, further comprising determining a minimum number of at least one input vector to minimize said useful untested states.",
"7.The computer implemented method of instrumentation of said electronic design of claim 6, further comprising simulating at least one of a transistor level and a behavioral level of said representation of said electronic design said minimum number of said at least one input vector.",
"8.The computer implemented method of instrumentation of said electronic design of claim 7, further comprising assessing a measurement output at a behavioral level simulation, wherein said assessment is based at least in part upon said at least one set of valid states.",
"9.The computer implemented method of instrumentation of said electronic design of claim 8, further comprising correlating said measurement output at said transistor level simulation, wherein said correlation is based at least in part upon said measurement output at said behavioral level simulation.",
"10.A computer program product embodied on a non-transitory computer usable medium, said non-transitory computer usable medium having stored thereon a sequence of instructions which, when executed by at least one processor causes said at least one processor to execute a method of instrumentation of an electronic design, comprising: receiving by a computer a computer readable representation of said electronic design having at least in one part of said electronic design, an analog portion; generating at least one instrumented netlist based at least in part upon said representation of said electronic design; receiving at least one specification of said electronic design; generating at least one set of valid states based on said at least one specification; and determining an analog verification coverage utilizing said at least one instrumented netlist.",
"11.The computer program product to execute said method of method of instrumentation of said electronic design of claim 1, further comprising: simulating said at least one instrumented netlist; generating at least one verification coverage history of said electronic design based in part upon said simulation; and identifying at least one useful untested state based at least in part upon at least one of said at least one specification, said at least one instrumented netlist, said at least one set of valid states and said at least one verification coverage history.",
"12.The computer program product to execute said method of method of instrumentation of said electronic design of claim 11, further comprising the step of assessing verification completeness based at least in part upon said verification coverage history and said at least one set of valid states.",
"13.The computer program product to execute said method of method of instrumentation of said electronic design of claim 12, further comprising the step of correlating said at least one verification coverage history and at least one input vector.",
"14.The computer program product to execute said method of method of instrumentation of said electronic design of claim 13, wherein said simulation of said at least one instrumented netlist is performed at a behavioral level.",
"15.The computer program product to execute said method of method of instrumentation of said electronic design of claim 14, further comprising the step of determining a minimum number of at least one input vector to minimize said useful untested states.",
"16.The computer program product to execute said method of method of instrumentation of said electronic design of claim 15, further comprising the step of simulating at least one of a transistor level and a behavioral level of said representation of said electronic design said minimum number of said at least one input vector.",
"17.The computer program product to execute said method of method of instrumentation of said electronic design of claim 16, further comprising the step of assessing a measurement output at a behavioral level simulation, wherein said assessment is based at least in part upon said at least one set of valid states.",
"18.The computer program product to execute said method of method of instrumentation of said electronic design of claim 17, further comprising the step of correlating said measurement output at said transistor level simulation, wherein said correlation is based at least in part upon said measurement output at said behavioral level simulation."
],
[
"<SOH> BACKGROUND <EOH>The method and system are generally related to the verification of analog and mixed signal integrated circuits and is particularly useful in, but not limited to instrumenting an electronic design to assess completeness of verification and identify useful untested states.",
"Electronic design automation (EDA) is software for designing electronic blocks.",
"There are several broad types of electronic signals, components and blocks: digital, analog and a mixture of digital and analog termed mixed signal.",
"The electronic design generally comprises at least one of the following levels of circuit information: a system level, an architectural level, a dataflow level, an electrical level, a device level and a technology level and/or the like.",
"Digital signals have discrete input and output values “0” and “1”, occurring at discrete time values, typically tied to a clock signal.",
"Digital components which input and output the digital signals typically have static pin outs and interaction protocols.",
"Digital blocks comprised of the digital components have well established and well documented physical layouts and electrical interactions.",
"Simulators for digital blocks are discrete time event driven simulators.",
"Analog signals generally have continuous input and output values that may vary over time.",
"Analog components typically have customizable layouts in order to modify inputs, outputs, triggers, biases, etc.",
"Therefore, due to customization, analog blocks comprised of the analog components may not have as well established or well documented physical layouts or electrical interactions as digital circuits.",
"Simulators for analog blocks generally necessitate continuous time domain simulators.",
"Mixed signal blocks are a combination of digital signal blocks and analog signal blocks within a component being simulated.",
"The most common options available for simulation are to simulate the component as a grouping of analog blocks, or to separately analyze the analog components/blocks and the digital components/blocks and translate the inputs and outputs at the boundaries of the digital and analog domains for inter-domain communication.",
"Within EDA there are two broad categories of circuit review that are often related: simulation and verification.",
"Simulation is a numerical solution set that predicts the behavior of a circuit.",
"Verification is the systematic pursuit of describing the behavior of a circuit under relevant conditions (functional verification) and over manufacturing process variation (parametric verification).",
"Therefore, verification generally necessitates a much more extensive review of the circuit, its operating conditions, and manufacturing operation variations than a simulation.",
"It is possible to run a large number of simulations without verifying to any significant degree the functionality of a circuit.",
"Verification is the mathematical modeling of circuit behavior and evaluation of circuit performance over a range of conditions.",
"Ultimately, the measure of success of verification is to report how well the circuit design complies with the circuit specification.",
"Analog and mixed signal verification methodology is struggling to keep pace with the complexity, cost, and computational demands of ever-growing analog and mixed signal circuits.",
"The number and complexity of verification test cases grows with the complexity of analog and mixed signal designs.",
"Additionally, simulation speed decreases and memory utilization increases as the size of the circuit grows.",
"Thus, the computational processing-power to verify a circuit may dramatically increase with circuit complexity.",
"To make this issue more painful, verification normally occurs at the end of a design cycle where schedule delays are perceived to be most severe.",
"Thus, verification is an activity that generally necessitates a significant amount of simulation processing-power for a small part of the overall design cycle, and therefore an efficient use of verification resources is generally necessitated to meet time to market demands.",
"Today's complex verification solutions specifically focus engineering on the verification activity to ensure that the operation of the circuit is fully and efficiently verified under pertinent conditions.",
"This focused analog and mixed signal verification is much more manual and experience driven than digital verification.",
"This sporadic interactive analog verification leaves companies at risk.",
"The present disclosure may allow verification tasks to be defined at a higher level of abstraction.",
"The present disclosure may allow efficient capture of complex relationships between stimulus or stimulus assertions and output measurements or output assertions.",
"The present disclosure may allow the test of transistor level circuits, circuits implemented with behavioral models, or circuits that contain a combination of behavioral models and transistor level implementations.",
"The methods used presently for modeling analog and mixed signal circuits are not efficient for minimizing the number of verification runs to exercise the valid states.",
"This is due at least in part to the fact that the netlist is insufficiently instrumented to efficiently record the states exercised.",
"A netlist describes the connectivity of the electronic design.",
"There is a long felt need for instrumenting a netlist to identify valid useful untested states of the electronic design.",
"Robust verification of analog and mixed signal circuits generally necessitates a significant investment in test benches, performance analysis routines, and macro-models that may be used to accelerate the simulations.",
"The complexity of this collateral grows with the complexity of the analog and mixed signal integrated circuits to be verified.",
"As a design team adds design resources it also needs to add verification resources, adding to the cost of the design.",
"The efficient use of those resources becomes paramount due to the inevitable time constraints that are imposed at the end of the design cycle, when companies are trying to get a product to market.",
"The current technology trajectory, within the electronics manufacturing industry, is to move more and more toward single chip designs, called Systems on a Chip (SoC), or multi-chip modules (MCM) where multiple chips are included in one package.",
"Most systems on a chip and multi-chip modules generally necessitate some level of mixed signal verification.",
"As mixed signal designs continue to increase in size and complexity, this places additional burdens on verification to insure first pass design success and reduce the time-to-market.",
"Although the complexity of analog and mixed signal ASIC design has followed Moore's law, innovations in design verification generally have not.",
"Valuable design time and computational resources as well as expensive simulator resources may be specifically focused by the disclosed method for instrumenting the netlist in order to ascertain the minimum verification runs necessary to test valid states.",
"The method makes assessment of global verification more efficient.",
"The resulting minimized run list allows more efficient use of resources.",
"This disclosure is related to instrumenting a netlist of an electronic design for analog and mixed signal (A/MS) application specific integrated circuits (ASICs).",
"Analog and mixed signal integrated circuits exist in many modern electronic devices, and these circuits needs to be verified through simulation prior to fabrication."
],
[
"<SOH> SUMMARY <EOH>There is provided according to, just one exemplary embodiment and it's aspect of the present disclosure of a computer implemented system and method of instrumentation of an electronic design comprising receiving by a computer a computer readable representation of said electronic design having at least in one part of said electronic design, an analog portion.",
"At least one instrumented netlist is generated based at least in part upon said representation of said electronic design.",
"At least one specification of said electronic design is received and at least one set of valid states is generated based on said at least one specification.",
"An analog verification coverage is determined utilizing said at least one instrumented netlist."
],
[
"CROSS-REFERENCE TO RELATED APPLICATIONS This application is a Divisional of U.S. patent application Ser.",
"No.",
"14/707,723, filed on May 8, 2015, and entitled COMPUTER IMPLEMENTED SYSTEM AND METHOD OF IDENTIFICATION OF USEFUL UNTESTED STATES OF AN ELECTRONIC DESIGN, now U.S. Pat.",
"No.",
"9,875,325 issuing Jan. 23, 2018 (Atty.",
"Dkt.",
"No.",
"ZPLG-32170).",
"U.S. patent application Ser.",
"No.",
"14/707,723 claims benefit of U.S.",
"Provisional Application No.",
"61/991,069, filed on May 9, 2014, entitled COMPUTER IMPLEMENTED SYSTEM AND METHOD OF IDENTIFICATION OF USEFUL UNTESTED STATES OF AN ELECTRONIC DESIGN (Atty.",
"Dkt.",
"No.",
"ZPLG-32197).",
"U.S. application Ser.",
"Nos.",
"14/707,723 and 61/991,069 and U.S. Pat.",
"No.",
"9,875,325 are incorporated herein by reference in their entireties.",
"BACKGROUND The method and system are generally related to the verification of analog and mixed signal integrated circuits and is particularly useful in, but not limited to instrumenting an electronic design to assess completeness of verification and identify useful untested states.",
"Electronic design automation (EDA) is software for designing electronic blocks.",
"There are several broad types of electronic signals, components and blocks: digital, analog and a mixture of digital and analog termed mixed signal.",
"The electronic design generally comprises at least one of the following levels of circuit information: a system level, an architectural level, a dataflow level, an electrical level, a device level and a technology level and/or the like.",
"Digital signals have discrete input and output values “0” and “1”, occurring at discrete time values, typically tied to a clock signal.",
"Digital components which input and output the digital signals typically have static pin outs and interaction protocols.",
"Digital blocks comprised of the digital components have well established and well documented physical layouts and electrical interactions.",
"Simulators for digital blocks are discrete time event driven simulators.",
"Analog signals generally have continuous input and output values that may vary over time.",
"Analog components typically have customizable layouts in order to modify inputs, outputs, triggers, biases, etc.",
"Therefore, due to customization, analog blocks comprised of the analog components may not have as well established or well documented physical layouts or electrical interactions as digital circuits.",
"Simulators for analog blocks generally necessitate continuous time domain simulators.",
"Mixed signal blocks are a combination of digital signal blocks and analog signal blocks within a component being simulated.",
"The most common options available for simulation are to simulate the component as a grouping of analog blocks, or to separately analyze the analog components/blocks and the digital components/blocks and translate the inputs and outputs at the boundaries of the digital and analog domains for inter-domain communication.",
"Within EDA there are two broad categories of circuit review that are often related: simulation and verification.",
"Simulation is a numerical solution set that predicts the behavior of a circuit.",
"Verification is the systematic pursuit of describing the behavior of a circuit under relevant conditions (functional verification) and over manufacturing process variation (parametric verification).",
"Therefore, verification generally necessitates a much more extensive review of the circuit, its operating conditions, and manufacturing operation variations than a simulation.",
"It is possible to run a large number of simulations without verifying to any significant degree the functionality of a circuit.",
"Verification is the mathematical modeling of circuit behavior and evaluation of circuit performance over a range of conditions.",
"Ultimately, the measure of success of verification is to report how well the circuit design complies with the circuit specification.",
"Analog and mixed signal verification methodology is struggling to keep pace with the complexity, cost, and computational demands of ever-growing analog and mixed signal circuits.",
"The number and complexity of verification test cases grows with the complexity of analog and mixed signal designs.",
"Additionally, simulation speed decreases and memory utilization increases as the size of the circuit grows.",
"Thus, the computational processing-power to verify a circuit may dramatically increase with circuit complexity.",
"To make this issue more painful, verification normally occurs at the end of a design cycle where schedule delays are perceived to be most severe.",
"Thus, verification is an activity that generally necessitates a significant amount of simulation processing-power for a small part of the overall design cycle, and therefore an efficient use of verification resources is generally necessitated to meet time to market demands.",
"Today's complex verification solutions specifically focus engineering on the verification activity to ensure that the operation of the circuit is fully and efficiently verified under pertinent conditions.",
"This focused analog and mixed signal verification is much more manual and experience driven than digital verification.",
"This sporadic interactive analog verification leaves companies at risk.",
"The present disclosure may allow verification tasks to be defined at a higher level of abstraction.",
"The present disclosure may allow efficient capture of complex relationships between stimulus or stimulus assertions and output measurements or output assertions.",
"The present disclosure may allow the test of transistor level circuits, circuits implemented with behavioral models, or circuits that contain a combination of behavioral models and transistor level implementations.",
"The methods used presently for modeling analog and mixed signal circuits are not efficient for minimizing the number of verification runs to exercise the valid states.",
"This is due at least in part to the fact that the netlist is insufficiently instrumented to efficiently record the states exercised.",
"A netlist describes the connectivity of the electronic design.",
"There is a long felt need for instrumenting a netlist to identify valid useful untested states of the electronic design.",
"Robust verification of analog and mixed signal circuits generally necessitates a significant investment in test benches, performance analysis routines, and macro-models that may be used to accelerate the simulations.",
"The complexity of this collateral grows with the complexity of the analog and mixed signal integrated circuits to be verified.",
"As a design team adds design resources it also needs to add verification resources, adding to the cost of the design.",
"The efficient use of those resources becomes paramount due to the inevitable time constraints that are imposed at the end of the design cycle, when companies are trying to get a product to market.",
"The current technology trajectory, within the electronics manufacturing industry, is to move more and more toward single chip designs, called Systems on a Chip (SoC), or multi-chip modules (MCM) where multiple chips are included in one package.",
"Most systems on a chip and multi-chip modules generally necessitate some level of mixed signal verification.",
"As mixed signal designs continue to increase in size and complexity, this places additional burdens on verification to insure first pass design success and reduce the time-to-market.",
"Although the complexity of analog and mixed signal ASIC design has followed Moore's law, innovations in design verification generally have not.",
"Valuable design time and computational resources as well as expensive simulator resources may be specifically focused by the disclosed method for instrumenting the netlist in order to ascertain the minimum verification runs necessary to test valid states.",
"The method makes assessment of global verification more efficient.",
"The resulting minimized run list allows more efficient use of resources.",
"This disclosure is related to instrumenting a netlist of an electronic design for analog and mixed signal (A/MS) application specific integrated circuits (ASICs).",
"Analog and mixed signal integrated circuits exist in many modern electronic devices, and these circuits needs to be verified through simulation prior to fabrication.",
"SUMMARY There is provided according to, just one exemplary embodiment and it's aspect of the present disclosure of a computer implemented system and method of instrumentation of an electronic design comprising receiving by a computer a computer readable representation of said electronic design having at least in one part of said electronic design, an analog portion.",
"At least one instrumented netlist is generated based at least in part upon said representation of said electronic design.",
"At least one specification of said electronic design is received and at least one set of valid states is generated based on said at least one specification.",
"An analog verification coverage is determined utilizing said at least one instrumented netlist.",
"BRIEF DESCRIPTION OF THE DRAWINGS The present disclosure will be more clearly understood from consideration of the following detailed description and drawings in which: FIG.",
"1 is a block diagram showing a computer system suitable for practicing the instant disclosure; FIG.",
"2 is a block diagram showing a computer network system suitable for practicing the instant disclosure; FIG.",
"3 depicts an example Low Voltage Dropout (LDO) circuit; FIG.",
"4 depicts an example amplifier circuit; FIG.",
"5 depicts a test bench pin out for an amplifier; FIG.",
"6 depicts a general example hierarchy; FIG.",
"7 depicts an instance parsed example test hierarchy; FIG.",
"8 depicts a first example test bench for a power management integrated circuit; FIG.",
"9 depicts a second example test bench for a power management integrated circuit; FIG.",
"10 depicts a third example test bench for a power management integrated circuit; FIG.",
"11 depicts an example simple MOSFET current sink; FIG.",
"12 depicts an example cascade MOSFET current sink; FIG.",
"13 depicts an example mux and opamp of an electronic design; FIG.",
"14 depicts a B level example of an electronic design; FIG.",
"15 depicts a D level example of an electronic design; FIG.",
"16 depicts a hierarchical example of an electronic design; FIG.",
"17 depicts an E level example of an electronic design; FIG.",
"18 depicts a first example of a computer implemented method of identification of useful untested states of an electronic design; FIG.",
"19 depicts additional steps that the first example of identification of useful untested states of an electronic design may additionally comprise; FIG.",
"20 depicts additional steps that the first example of identification of useful untested states of an electronic design may additionally comprise; FIG.",
"21 depicts a second example of a computer implemented method of identification of useful untested states of an electronic design; FIG.",
"22 depicts additional steps that the second example of identification of useful untested states of an electronic design may additionally comprise; FIG.",
"23 depicts a third example of a computer implemented method of identification of useful untested states of an electronic design; FIG.",
"24 depicts additional steps that the third example of identification of useful untested states of an electronic design may additionally comprise; FIG.",
"25 depicts a fourth example of a computer implemented method of identification of useful untested states of an electronic design; FIG.",
"26 depicts additional steps that the fourth example of instrumentation of identification of useful untested states of an electronic design; FIG.",
"27 depicts a fifth example of a computer program product embodied on a non-transitory computer usable medium to identify of useful untested states of an electronic design; FIG.",
"28 depicts additional steps that the fifth example of a computer program product embodied on a non-transitory computer usable medium to identification of useful untested states of an electronic design may additionally comprise; FIG.",
"29 depicts a sixth example of a computer-based system of identification of useful untested states of an electronic design; and FIG.",
"30 depicts an example system diagram for identification of useful untested states of an electronic design.",
"References in the detailed description correspond to like references in the various drawings unless otherwise noted.",
"Descriptive and directional terms used in the written description such as right, left, back, top, bottom, upper, side, et cetera, refer to the drawings themselves as laid out on the paper and not to physical limitations of the disclosure unless specifically noted.",
"The drawings are not to scale, and some features of examples shown and discussed are simplified or amplified for illustrating principles and features as well as advantages of the disclosure.",
"DETAILED DESCRIPTION The features and other details of the disclosure will now be more particularly described with reference to the accompanying drawings, in which various illustrative examples of the disclosed subject matter are shown and/or described.",
"It will be understood that particular examples described herein are shown by way of illustration and not as limitations of the disclosure.",
"Furthermore, the disclosed subject matter should not be construed as limited to any of examples set forth herein.",
"These examples are provided so that this disclosure will be thorough and complete, and will fully convey the scope of the disclosed subject matter to those skilled in the art.",
"The principle features of this disclosure may be employed in various examples without departing from the scope of the disclosure.",
"The terminology used herein is for the purpose of describing particular examples only and is not intended to be limiting of the disclosed subject matter.",
"Like number refer to like elements throughout.",
"As used herein the term “and/or” includes any and all combinations of one or more of the associated listed items.",
"Also, as used herein, the singular forms “a”, “an”, and “the” are intended to include the plural forms as well, unless the context clearly indicates otherwise.",
"It will be further understood that the terms “comprises”, and/or “comprising” when used in this specification, specify the presence of stated features, integers, steps, operations, elements, and/or components, but do not preclude the presence or addition of one or more other features, integers, steps, operations, elements, components, and/or groups thereof.",
"Also, as used herein, relational terms such as first and second, top and bottom, left and right, and the like may be used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions.",
"Cost of entry barriers into analog and mixed signal IC design is endemic especially to fabless companies that are developing ASIC intellectual property in the form of packaged ASICs or modules to be integrated into their customer's Systems-on-Chip (SoCs) or multi-chip modules (MCMs).",
"For example, if a fabless design center is staffed with five IC design engineers, equipping the team with design tools is financially equivalent to quadrupling the staff.",
"This is due to the high cost of ownership of the EDA tools, not just in annual license fees, installation and support, training and the like.",
"Reducing system use through instrumentation of the netlist to capture valid state verification data allows more efficient resource allocation.",
"Analog and mixed signal verification is time and computationally intensive.",
"Functionality of the circuit for various inputs, at various conditions and for various manufacturing conditions are generally necessitated to be simulated to insure that the circuit functions to the specifications.",
"Prior to running a simulation of an electronic design, the electronic design undergoes a conversion to a netlist which describes the connectivity of the electronic design.",
"The netlist whilst describing the connectivity of the circuit does not include metadata pertaining to the circuit.",
"The disclosed system and method of instrumentation of an electronic design instruments the netlist to capture metadata pertaining to the verification.",
"This captured metadata in conjunction with generation of valid states from the specification allows an assessment of the completion of the verification of the electronic design.",
"AMST™ (Analog Mixed Signal Test) is a module for specifying analog/mixed-signal (A/MS) stimulus as well as assertions and output measurements.",
"An AMST is able to efficiently capture complex relationships between stimulus and output assertions.",
"Verification models specified in the AMST Language (AMSTL™) captures higher level commands that are subsequently translated into Verilog-A/AMS.",
"Verilog-A, Verilog-AMS, VHDL-AMS, SystemC-AMS or the like, which are standardized languages for defining analog and mixed-signal, respectively.",
"It is envisioned that the code could also be used to generate any language standard that supports direct branch contribution statements for analog simulators.",
"AMSTL can be used to capture higher level commands with IBCS regardless of whether the resulting translated code will be used in the behavioral model of a circuit or a test harness.",
"The value of capturing assertions within an AMST rather than in the behavioral model of the circuit is that the verification commands can be reused regardless of the representation of the circuit.",
"For example, in FIG.",
"17 the AMP_AMST block will execute the same commands and assertions whether the op amp and mux are represented as transistor level schematics or behavioral models.",
"The AMP_AMST now serves as verification intellectual property (VIP) that can be reused with these circuits.",
"This concept becomes especially valuable when considering the case of providing analog design intellectual property (IP) to a third party.",
"The purchasing party now has verification IP that can be embedded with the purchased IP within a larger SOC.",
"This VIP reduces the risk that the purchased design IP will be used incorrectly.",
"Verification IP has been a proven concept for digital circuits and top-level inputs and outputs but has not been previously practical to provide with embedded analog IP.",
"The language AMSTL is intended to describe behaviors, stimulus, outputs, measurements, etc.",
"for analog mixed signal integrated circuit design and provides higher level constructs than available in standard hardware description languages that are intended for input into analog simulators.",
"One benefit is an efficiency improvement based on the availability of IBCS in AMSTL.",
"Additionally, AMSTL code can be parsed to output any desired standard language.",
"The module AMST is a behavioral model of analog mixed-signal verification intellectual property and is intended to reside at any level of the hierarchy within the design.",
"The module may reside with the IP that it is monitoring, stimulating and/or evaluating.",
"The output form of the model (in Verilog-A, Verilog-AMS, VHDL-AMS, etc.)",
"can be input through a netlist into an analog or mixed-signal simulator.",
"A netlist is a representation of one or more databases that contain information relevant to a verification project and simulation task including but not limited to: 1) a description of components (e.g.",
"transistors, resistors, capacitors, behavioral model, AMSTs, digital gates) and properties of components that make up the design (e.g.",
"PMOS2 has W=1 um), 2) the connectivity of the design (e.g.",
"drain of PMOS1 is connection to gate of NMOS2), 3) hierarchical configuration of the design for a specific simulation task (e.g.",
"PLL1 is represented as a model, LDO3 is represented at the transistor level) 4) configuration of the simulation task including simulation type (e.g.",
"transient simulation), duration (e.g.",
"2 ms), tolerance settings (e.g.",
"iabstol<10e−10), configuration of interface elements between digital and analog partitions, and output signal selections 5) any information in the verification database such as expected performance values, signal transitions, signal shape, duty cycle, etc of any signal or element of interest to the verification activity).",
"The netlist is the input to a simulation.",
"The purpose of a simulation is to predict the behavior of the circuit described in the netlist subject to the stimulus conditions and accuracy criteria specified in the netlist.",
"Simulation is an essential part of integrated circuit (IC) design since a) photomasks for IC designs are very expensive b) IC manufacturing takes a long time, c) probing of signals internal to an IC is extremely difficult and d) bread-boarding of modern IC designs is impractical.",
"A simulation is performed with a simulator.",
"At a high level, there are three approaches to simulating an integrated circuit: SPICE-level simulation, digital-level simulation, and mixed-mode simulation.",
"A SPICE-level simulator reduces the netlist to a set of nonlinear differential algebraic equations which are solved using implicit integration methods, Newton's method, and sparse matrix techniques.",
"A SPICE-level simulator conserves charge, satisfies Kirchhoff's Current Law and Kirchhoff's Voltage Law, subject to a set of absolute or relative tolerances.",
"A digital simulator reduces the netlist to a set of boolean functions which are triggered by discrete events.",
"Digital simulators do not conserve charge, satisfy Kirchhoff's Current Law or Kirchhoff's Voltage Law.",
"But they can simulate much larger circuits at a higher level of abstraction.",
"Mixed-mode (AMS) simulation combines a SPICE-level simulator with a digital simulator.",
"In this type of simulation a SPICE-level simulator is used to simulate a portion of the design, predicting the net voltages and terminal currents of the components in the SPICE-level partition, while the digital simulator is used to predict the digital outputs of the components in the digital partition.",
"In a mixed-mode simulation, the SPICE-level partition and the digital partition are connected with interface elements which, at a basic level, are idealized 1-bit analog to digital converters (for signals going from the SPICE partition to the digital partition) and 1-bit digital to analog converters (for signals going from the digital partition to the SPICE partition).",
"A simulation can produce the following outputs: 1) continuous-time/continuous-value waveforms of net voltages and terminal currents 2) discrete-time/discrete-value digital waveforms of logic net outputs 3) any data written by any behavioral model including any AMST modules that have been included into the netlist 4) assertion violation messages 5) debug information about model behavior, circuit convergence difficulties, etc.",
"These outputs from the simulation are stored in one or more databases.",
"These outputs are subsequently used to evaluate the suitability of the circuit.",
"This process can be manual.",
"A designer can, for example, review waveforms in a graphical waveform viewer.",
"The process can also be automated.",
"A software program can programmatically analyze waveform results and AMST outputs to build a spec compliance matrix which summarizes the set of design objectives that have been satisfied and the set of design objectives that have been failed in the circuit simulation.",
"An instrumentation point may be: 1) any component in the netlist (e.g.",
"transistors, resistors, capacitors, behavioral model), or 2) any net that defines some aspect of the connectivity of the design, or 3) any arbitrary set of one or more components and zero or more nets, or 4) any arbitrary set of zero or more components and one or more nets.",
"Instrumentation points can be created in one of three ways: 1) Manually specified by the user of the system.",
"In this usage scenario, the user manually identifies instrumentation points.",
"This can be accomplished from the user's schematic capture environment.",
"As a simple example, the user could select two nets as an instrumentation point.",
"The instrumentation module, called an AMST, can be implemented in Verilog-A/AMS or any other hardware description language.",
"In the instrumentation module the user can specify the shape, behavior, or transfer function between the two nets that identifies a desirable or undesirable mode or operation.",
"A more complex example, consisting of many nets, is shown in FIG.",
"17.Once specified, the software can track coverage of these desirable or undesirable behaviors.",
"2) Programmatically identified from programmatically described patterns.",
"Analog and mixed-signal circuits frequently have repeating topological patterns such as the current mirror consisting of M1 and M2 in FIG.",
"11.In this topology, the current through M2 is a fixed ratio of I_REF if certain conditions are satisfied.",
"These topologies can be programmatically identified, assertions or AMSTs for these topologies can be automatically generated and these assertions or AMSTs can be automatically instrumented to measure coverage for the topological pattern.",
"Static patterns for identifying circuit function can incorporate circuit topology (specific connections between specific device terminals), device names and types, device properties (such as device model names), net names and net properties (such as net width).",
"3) Programmatically derived from aggregated analytic information.",
"Static analysis of netlist constructs is limited as a mechanism for deriving circuit function as the same circuit topology can used for different applications (with different biasing or stimulus).",
"To overcome this problem, additional instrumentation points can be derived from historical analytic information such as known-good simulation results.",
"For example, a program can analyze the simulation results from the current mirror in FIG.",
"12, determine that the current flowing from source to drain of M4 is in a certain range, automatically generate assertions or AMSTs for this particular instance of the circuit in a larger design.",
"These assertions or AMSTs can then be automatically instrumented to measure coverage for the topological patterns.",
"Instrumentation can be accomplished in two different ways: 1) Instrumentation of Existing Behavioral Models and AMSTs.",
"Behavioral model and hand-written AMSTs are very useful because they capture a mathematical description of the desired function of the circuit.",
"Behavioral models implement the desired function directly.",
"AMSTs describe circuit function indirectly through a set of assertions that test circuit response to a specified stimulus.",
"Both can be instrumented for coverage by a) tracking the execution of conditional branch statements in the model and/or b) dividing any transfer function implemented in the model into distinct regions and tracking the use of each region.",
"A simple example of a conditional branch statement is an if-then-else clause in Verilog-A/AMS.",
"To measure coverage, the software tracks how many of the conditional branches in each instance of each behavioral model are executed in the verification simulation.",
"The transfer function resulting from the model can also be analyzed to identify any discontinuities in the transfer function, its first, second, third, fourth, or arbitrary n-th derivative.",
"Any identified discontinuity is used to partition the model into regions of operation.",
"To measure coverage, the software tracks the number of regions of operation reached for each instance of each model in the verification simulation.",
"2) Automatic Insertion of Instrumented AMSTs.",
"For transistor-level circuits the desired function is not always known.",
"As described above, an AMST module for an instrumentation point can be automatically generated from static analysis of the netlist or aggregated analytic information that can incorporate known-good simulation results, simulation configuration, user inputs, or observed user behavior.",
"Once the module is generated, it can be added into the netlist by adding an instance of the new module in the appropriate part of the netlist, connecting voltage measurement nets, and splicing any nets where current measurement is required.",
"Once connected, the AMST can be instrumented as described above.",
"Therefore the disclosed system and method of translation of instrumentation of an electronic design may solve one or more of the following issues, to allow more efficient use of computer and personnel resources through reduced verification run overlaps, to reduce the time lag to market and/or to insure a more focused and thorough verification confirmation.",
"Computer System FIG.",
"1 illustrates the system architecture, for an exemplary computer system 100, on which the current disclosure may be implemented.",
"The exemplary computer system of FIG.",
"1 is for descriptive purposes only.",
"Although the description may refer to terms commonly used in describing particular computer systems, such as a personal computer, the description and concepts equally apply to other systems, including systems having architectures dissimilar to FIG.",
"1.Computer system 100 typically includes a central processing unit (CPU) 110, which may be implemented with one or more microprocessors, a random access memory (RAM) 112 for temporary storage of information, and a read only memory (ROM) 114 for permanent storage of information.",
"A memory controller 116 is provided for controlling RAM.",
"A bus 118 interconnects the components of the computer system.",
"A bus controller 120 is provided for controlling the bus.",
"An interrupt controller 122 is used for receiving and processing various interrupt signals from the system components.",
"Mass storage may be provided by flash 124, DVD 126, or hard disk 128, or, for example a solid-state drive.",
"Data and software may be exchanged with the computer system via removable media such as the flash drive and DVD.",
"The flash drive is insertable into a Universal Serial Bus, USB, drive 130, which is, in turn, connected to the bus by a controller 132.Similarly, the DVD is insertable into DVD drive 134, which is, in turn, connected to bus by controller 136.Hard disk is part of a fixed disk drive 138, which is connected to the bus by controller 140.User input to the computer system may be provided by a number of devices.",
"For example, a keyboard 142 and a mouse 144 are connected to the bus by a controller 146.An audio transducer 148, which may act as a microphone and a speaker, is connected to bus by audio controller 150, as illustrated.",
"Other input devices, such as a pen and/or tabloid, may be connected to the bus and an appropriate controller and software.",
"DMA controller 152 is provided for performing direct memory access to the system RAM.",
"A visual display is generated by video subsystem 154, which controls video display 156.The computer system also includes a communications adaptor 158, which allows the system to be interconnected to a local area network (LAN) or a wide area network (WAN) or other suitable network, schematically illustrated by a bus 160 and a network 162.Operation of the computer system is generally controlled and coordinated by an operating system, such as the Windows, Windows 7 and Windows 8 operating systems, available from Microsoft Corporation, Unix, Linux or Apple OS X operating system, to name a few.",
"The operating system controls allocation of system resources and performs tasks such as processing scheduling, memory management, networking, and I/O services, among other things.",
"Computer System FIG.",
"2 illustrates the system 200 in which the computer user 210 is connected to a network 212 which in turn is connected to the cloud 214 and the compute farm 216.In an example schematic of a circuit to be verified/analyzed, a low voltage dropout (LDO) 300 circuit is shown in FIG.",
"3.The LDO has an amplifier A1, having an inverting input (−input), a non-inverting input (+input) an output, a positive voltage input +V and a negative voltage input −V.",
"The LDO circuit has a voltage in Vin and a voltage out Vout.",
"The LDO has a power out block Q1, Q2 and R2.The LDO feedback circuit is comprised of R3, R4, D1 and R1.The amplifier A1 is termed a symbol, the elements D1, R1, R2, R3, R4, C1, C2, Q1 and Q2 are referred to as primitives.",
"An example schematic of an amplifier A1 400 circuit is shown in FIG.",
"4.The symbol of the amplifier is comprised of transistors Q3, Q4, Q5, Q6, Q7 and Q8 and resistor R5.The amplifier A1, having an inverting input (−input), a non-inverting input (+input) an output, a positive voltage input +V and a negative voltage input −V.",
"FIG.",
"5 shows a test bench 500 for amplifier A1 510.A test bench is a specific configuration of inputs, outputs, test conditions and the like that are run for a device to which it is connected.",
"The test bench has an inverting input 512, a non-inverting input 514, a positive power input 516, a negative power input 518 and an output 520.The test bench has associated connections, power supplies, IOs, etc.",
"which are referred to as the test bench collateral.",
"The portion around the periphery of the circuit is referred to as the verification harness.",
"Pin outs and the operation of the verification harness need to be matched to the circuit under test.",
"FIG.",
"6 shows a general example hierarchy 600 of a Test bench with a device under test, DUT.",
"The hierarchy is arranged according to levels, A, B, C and Device and according to instances 1, 2 and 3.The connecting lines indicate which models are connected throughout the hierarchy for a specific verification.",
"Within level and instance, multiple view types may exist.",
"The examples illustrate some possible hierarchical configurations and are not intended to limit the cases and views or view types.",
"Integrated circuit design hierarchy is the representation of integrated circuit designs utilizing hierarchical representations.",
"This representation allows for more efficient creation of complex designs that may include millions of components such as transistors, resistors, and capacitors as well as the metal lines that connect the devices.",
"The design hierarchy representation used at any given point in the design process may vary based on the design step being performed and the type of design function such as analog, digital, or memory.",
"In the case that a design is to be manufactured, a layout of the design is created so that a representation may be mapped.",
"This mapping allows patterns to be created on individual levels of the mask sets to allow design manufacture.",
"In general, the design flow to create the layout representation is very different for analog as compared to digital functional blocks and subsystems.",
"Early in the design process, there may be large portions of the design that are designed for the first time and do not have any existing layout representations.",
"Other portions of the design may already have been proven, and these may be represented at a higher level of abstraction or in combination may include the layout representation, or may be stock items not even coming from the same design house.",
"Some common types of design representations referred to here as views may comprise various view types.",
"A Schematic view type is a picture of components or blocks with connectivity shown by lines or nets and connections to other levels of the hierarchy through pins.",
"A Spice view type is a representation of a component and its associated parameters, possibly including a specific device model that will be instantiated into the spice netlist.",
"An LVSExtract is a view type that is created by a tool analyzing the layout view and reverse engineering the individual components and connectivity.",
"Variations of this type of view may also include extracted parasitic components resulting from the physical layout that were not drawn by the designer.",
"A Layout view type is a representation of the specific geometries including routing for that portion of the design.",
"A Verilog™ view type is a text file that is in standardized Verilog™ format.",
"A Verilog-A™ view type is a text file in standardized Verilog-A™ syntax.",
"A Verilog-AMS™ view type is a text file in standardized Verilog-AMS™ syntax.",
"View type names may be different depending on the electronic design automation tool provider, examples of which include SpectreHDL and HDL-A.",
"Other types of view types may help organization and readability of the hierarchy.",
"As an example, graphic design tools such as schematic capture systems may use a Symbol view type for the graphic that is placed.",
"The symbol may contain pins that connect the instance through the hierarchy as well as a drawing that indicates the function of the block.",
"Examples include common symbols for operational amplifiers, basic digital gates, transistors, resistors, and the like.",
"Further adding to the complexity of description, a given block at a level of the design hierarchy may include multiple views of the same view type.",
"An example would be different Verilog™ representations of a given block, for instance, one with annotated timing based on the layout, one with estimated timing, one without timing, or different levels of design representation such as gate-level or register transfer level (RTL).",
"Similarly, an analog view may have numerous schematic views: for instance, one that will map to the final transistor-level design, one that includes placement of behavioral blocks for higher level modeling, one that may include parasitic elements from the layout, one that includes interface elements between analog and digital blocks for mixed-signal simulation.",
"Also, for analog blocks there may be multiple Verilog-A™ or Verilog-AMS™ model views for the same block where models include different functionality and accuracy based on the purpose of different simulation exercises.",
"These multiple views and view types are mapped into configurations that are used for a specific task or analysis.",
"Often view names are created to provide hints for what types of analysis a specific view may be useful.",
"View name may include those listed hereinafter and the like.",
"A Schematic is a schematic view including the placement of blocks that may be evaluated at the transistor level or at some level of the hierarchy such as a behavioral model.",
"A Schematic_behavioral is a schematic view that comprises behavioral elements.",
"A Schematic_parasitics is a schematic view that includes parasitic components extracted or estimated from the layout.",
"A Spice is a spice view that includes the information implemented in a netlist and a component for a specific analog simulator.",
"A Behavioral_va is a text view in the Verilog-A™ format that models a specific block for an analog simulator that may evaluate Verilog-A™, and a Behavioral_vams is a text view in the Verilog-AMS™ format that models a specific block for a mixed-signal simulator that may evaluate Verilog-A™ and Verilog.",
"In the specific example shown in FIG.",
"6, general example hierarchy, with device under test A1, Instance 1, would be defined based on the following configuration: A1, Instance 1 and B1, Instance 1 are modeled with a Schematic level model.",
"B2, Instance 1 is modeled with a Schematic_behavioral model, and C1, Instance 1 and C2 Instance 1 are modeled using a Schematic model.",
"C1, Instance 2 and C3, Instance 1 are modeled with a Behavioral_va model.",
"At the bottom of the hierarchy, Devices 1, 2 and 3, instances 1, 2 and 3 are modeled using Spice.",
"In the specific example shown in FIG.",
"6, Device 1, Instance 2 is a dummy device and therefore would not change the simulator matrix.",
"Device 1, Instance 2 is placed in the C1, Instance 1 schematic connected as a dummy device and is therefore not part of the A1, Instance 1 matrix that would be stamped in the simulator.",
"Whether a change necessitates a verification to be rerun is determined in part by the connections through the hierarchy.",
"In this specific example for general example hierarchy, device under test A1, Instance 1, if Device 1, Instance 2, Schematic view is changed the simulator would not need to be rerun, since the device is a dummy device and would not modify the matrix that would be stamped into the simulator.",
"With a view to FIG.",
"6, C1, Instance 1 Schematic view forms part of the configuration of the simulator model, and if it is changed and the change is substantive enough to affect the simulator matrix, Test bench 1 would need to be rerun.",
"C1, Instance 2 Schematic view would not form a part of the configuration of the simulator model example, therefore if it is changed, Test bench 1 would not need to be rerun.",
"At a more abstract level, if C1, Schematic view is changed, therefore changing the schematic view in Instance 1 and 2, which affects a change in the information stamped in the simulator matrix, Test bench 1 would need to be rerun.",
"If a non-substantive change to C1, Schematic view is made for example by adding a comment and no change is made to the information stamped by the simulator in the matrix, this design configuration would not need to be rerun.",
"It is apparent that determining whether a change was made to a configuration and the effect of the stamping of the matrix, may have a large effect on the number of necessitated verification runs.",
"FIG.",
"7 shows some of the different model views that may be chosen from for modeling a power management chip PMIC 700.The PMIC_testbench has Behavioral_vams and Behavioral_va levels having stimulus and oututs.",
"The PMIC has Schematic and Schematic_behavioral levels.",
"The LDO, LDO Enable Control and Battery Supervisor are defined at the Schematic, Schematic_behavioral and Behavioral_vams levels.",
"The Voltage Reference, LDO Feedback and LDO Comparator are defined at the Schematic and Behavioral_va levels.",
"The LDO Amplifier is defined at the Schematic and Schematic_parasitics levels.",
"The Behavioral Amplifier and Behavioral Bias are defined at the Behavior_va level.",
"The LDO Control Logic is defined at the Schematic and Verilog™ levels, and Devices 1 through X are defined at the Spice level.",
"FIG.",
"8 shows a first test hierarchy of the power management chip PMIC described in FIG.",
"6 for a power management chip 800.The figure illustrates a portion of the hierarchy if a Spice primitive component configuration is defined.",
"Device 1, Instance 2 is a dummy device in this model and would not change the simulator matrix.",
"FIG.",
"9 shows a second test hierarchy of the power management chip PMIC described in FIG.",
"7 for a power management chip 900.The figure illustrates a portion of the hierarchy for one possible mixed configuration with some analog behavioral level models, some Verilog™ representations and some Spice primitive components.",
"FIG.",
"10 shows a third test hierarchy of the power management chip PMIC described in FIG.",
"7 for a power management chip 1000.The figure illustrates a portion of the hierarchy if a behavioral configuration is defined.",
"Analog and mixed-signal circuits frequently have repeating topological patterns.",
"FIGS.",
"11 and 12 are examples of common easily identifiable analog topologies.",
"Current mirrors, also referred to as current sources and current sinks depending on the usage, are important tools in analog integrated circuit design to provide matched or ratioed currents throughout the circuit and therefore provide precision operation.",
"FIG.",
"11 depicts an example simple current MOSFET current mirror.",
"In this topology, the current I_OUT is approximately a fixed ratio of I_REF and independent of voltage if certain biasing conditions are satisfied.",
"FIG.",
"12 depicts an example cascode current sink.",
"The cascode current mirror configuration creates higher output resistance and therefore offers some performance advantages compared to the simpler current source topology shown in FIG.",
"11.There are numerous other basic analog building block topologies in addition to these two example current mirrors.",
"Other examples include but are not limited to differential input transistor pairs, standard gain stages, bandgap configurations.",
"FIG.",
"13 depicts a simple example of an operational amplifier with some typical features of an amplifier included within a larger system-on-a-chip (SOC).",
"Even this simple example can demonstrate the increasing complexity of today's verification challenges for mixed-signal designs.",
"Feeding the inputs to the amplifier is a simple multiplexer (mux).",
"The control signal IN_CTRL to the mux will serve as a digital input signal to a series of logic gates within the mux block.",
"These gates will then control the switches to select between two pairs of analog inputs: pair one (IN_POS_1 and IN_NEG_1) and pair 2 (IN_POS_2 and IN_NEG_2).",
"For instance, a value of IN_CTRL equal to logic level “0” could close the switches connected to IN_POS_1 and IN_NEG_1 while an IN_CTRL value of logic level “1” could close the switches connected to IN_POS_2 and IN_NEG_2.The analog inputs selected are then output from the mux.",
"These signals are now connected to the amplifier inputs.",
"The mux block also has connections for the power supplies.",
"In this case because analog signals will pass through the block, the power supply connections are to the analog supply voltages AVDD and GND.",
"For the amplifier block, the power supply connection is also to the analog supply voltage AVDD and GND.",
"Note that it is not unusual on complex SOC's to have multiple internal power supplies.",
"Even for the analog blocks there may be options such as different power supply levels.",
"In other cases, the same voltage level may be supplied, but one supply source may be used for critical blocks that may be susceptible to any noise on the supply line.",
"Other blocks that are noisier (typically due to functions such as high frequency switching), may be connected to a different supply source that is the same voltage level.",
"For this reason, digital blocks are almost always powered separately from analog blocks.",
"In addition, with the increasing importance of reducing power, some power supplies may be turned off during various operating modes.",
"As a result, design engineers may also need to verify that a given block is connected to a supply that will be available at the appropriate times.",
"Another common configuration within a larger chip is to have a common block that provides many of the biasing currents required by analog functions.",
"In this example, the amplifier has an input for a 1 uA bias current.",
"Other common options include signals for trim and control or programmability.",
"In this example, the amplifier has 2 control bits, GAIN_CTRL <1:0>, that can set a gain value and 3 bits, GAIN_TRIM<2:0>, that would slightly tune the gain value.",
"Trim is typically performed when each device is tested and is used to compensate for manufacturing process variations and match the desired gain values to specified values as closely as possible.",
"In this case GAIN_CTRL is a programmability feature to pick the best gain setting for a specific application.",
"The ENABLE signal allows the amplifier to be powered on or off while the chip is operating.",
"These types of controls are often provided to minimize power consumption, allow for clean power up sequences of the chip, and to provide protection during fault conditions.",
"For this simple example, there are numerous examples of verification requirements.",
"These requirements can be separated into several categories: operating function—do the amplifier and mux meet their respective functional requirements does the mux correctly pass the selected input signals to the mux output does the amplifier meet it's expected behavior: gain, slew rate, input range, output range, etc.",
"power supply and biasing is the block connected to the appropriate power supply and receiving the correct biasing is the supply and biasing available when expected and operating within the expected range control signals for every setting of control signals, is the correct behavior observed fault conditions when any of the block pins behaves in an manner outside allowed or expected ranges, does the block behave appropriately or is that condition either not possible (prevented elsewhere) or not expected to be handled Within the context of this disclosure, one benefit results from more efficiently managing the process of stepping through many combinations of possibilities.",
"One of the best examples is just stepping through large numbers of digital control or trim options.",
"Consider this simple example within the context of a larger SOC and a top-level test bench for this SOC.",
"This test bench may be one of many test benches for the chip, but this example can show how verification intellectual property developed for the amplifier can be leveraged even from a top-level test bench.",
"The hierarchical concepts illustrated in FIG.",
"6 can be populated to show how an example test bench can be built.",
"In this example A1 from FIG.",
"6 will represent the top-level test bench that includes the chip, all the necessary circuits or models to represent the system inputs, output loads, and external power supplies or other components for the chip, as well as portions of the tests configuration that can be described programmatically through software.",
"This example hierarchy can be seen in the diagram in FIG.",
"6.As discussed previously, each item in the hierarchy can be represented by multiple types of views depending on the information available and the intended purpose of the block.",
"The second level of hierarchy in this example that correlates to level “B” in FIG.",
"6 will include all the elements placed in this top-level test bench.",
"The first element will be the chip itself.",
"In this example, the chip is identified as cell B1.B2 could be a cell that contains circuits or models to represent the system inputs to the chip.",
"B3 could be a cell that contains circuits or models to represent the system provided power supplies and system output loads seen by the chip.",
"B4 in this example will be a block written in software to connect either directly to pins of the chip or other blocks, provide values to any parameterized functions within any of the blocks, and/or monitor and measure specific performances during the simulation.",
"In this simplified example, only signals that lead to the creation of the signals in the lower level example amplifier block are included.",
"This block B4 (or blocks) that can be captured in software will typically use high-level languages targeted at integrated circuit design (SystemVerilog, Verilog, Verilog-AMS, Verilog-A, SystemC, VHDL, etc.)",
"but can also leverage more general languages and scripts such as C, C++, TCL, PERL, etc.",
"The software portions may create stimulus, define design values for parameters in existing circuit or system blocks, or measure and monitor performance throughout the simulation.",
"For example, the Universal Verification Methodology (UVM) for SystemVerilog includes common constructs for defining monitoring and scoreboard functions as well as defining stimulus.",
"Digital verification methodology also includes numerous specific pieces of verification intellectual property (VIP) that are targeted to specific functions or protocols.",
"For instanced defined communication standards such as Universal Serial Bus (USB), Serial Peripheral Interface (SPI) bus, etc.",
"will have specific verification IP that can be leveraged during the verification process both to supply data through the interface and also test and validate that the interface is matching the protocol standards.",
"In this example, the digital trim and controls will be assumed programmed through a SPI interface or by the chip itself.",
"FIG.",
"14 depicts a simplified example testbench for a SOC.",
"In this example, the SOC hierarchy contains the amplifier and mux shown in FIG.",
"13.This example shows how some signals may pass from the top level of the design through the hierarchy to a lower level subsystem.",
"In this testbench, the external power supply VDD_EXT is being generated by Verilog-A code within the TOP_AMST.",
"Then VDD_EXT is an input for the SUPPLIES_AND_OUTPUTS block.",
"That block then outputs VDD which is connected to the SOC as the primary external power supply.",
"For the inputs, the system inputs are generated within the INPUTS block and then passed through the TOP_AMST block before connecting to the SOC.",
"Passing the inputs through the test harness allows both the voltage and current of the input signals to be monitored (or used as parameters for other calculations) throughout the simulation.",
"Similarly VOUT from the SOC is passed through the TOP_AMST before entering the SUPPLIES_AND_OUTPUTS block.",
"Finally, the VOUT_EXT is fed from the SUPPLIES_AND_OUTPUTS block to the TOP_AMST for monitoring.",
"The decisions on which signals should be passed through the AMST test harness blocks are highly dependent on the system and the amount of circuits/models required around the chip to adequately represent the full system.",
"Ultimately these decisions are driven by the system design and the verification plan.",
"FIG.",
"15 depicts a D level example of an electronic design.",
"Signals at lower levels of the hierarchy cannot be accessed unless those signals are brought to a pin at the top-level.",
"Consider further the hierarchy of Instance B1 which represents the chip.",
"In this example, the next level of the chip's hierarchy will contain C1, the SOC_CORE, and C2, the SOC_PAD_RING.",
"Then push down into C1 to see D1, the AMP_CORE subsystem; D2, PWR_MGT (power management functions for the chip); and D3, DIG_CTRL (digital controls for the chip).",
"The AMP_CORE subsystem contains the example amplifier and mux from FIG.",
"13.FIG.",
"16 depicts a hierarchical example of an electronic design.",
"At the SOC_TESTBENCH, there are four B level portions, B1 SOC (the chip being verified), B2 INPUTS, B3 SUPPLIES_AND_INPUTS and B4 TOP_AMST.",
"At the C level are two portions, C1 SOC_CORE and C2 SOC_PAD_RING.",
"The D level includes D1 AMP_CORE, D2 PWR_MGT and D3 DIG_CTRL and the E level includes E1 MUX, E2 AMP and E3 AMP_AMST.",
"Throughout this example hierarchy, instrumentation points could be added.",
"FIG.",
"17 depicts an E level example of an electronic design.",
"Further descending into the AMP_CORE subsystem shows the subsystem elements: E1, the MUX; E2, the AMP; and E3, the AMP_AMST which is a VerilogAMS block containing verification IP for this subsystem.",
"AMP_AMST provides a convenient point to add instrumentation for signals within the AMP_CORE hierarchy.",
"Examples include capturing whether all of the amplifier control signals have been exercised and if the inputs to the amplifier are correct based on the inputs to the MUX and have been tested for all possible combinations of the MUX IN_CTRL.",
"Other information such as whether the amplifier inputs (AMP_IN_POS, AMP_IN_NEG in FIG.",
"17) tested by signals supplied to the inputs at the top level of the SOC hierarchy (IN_POS_1, IN_NEG_1, IN_POS_2, IN_NEG_2 in FIG.",
"14), passed through the SOC_PAD_RING into AMP_CORE (IN_POS_1_CORE, IN_NEG_1_CORE, IN_POS_2_CORE, and IN_NEG_2_CORE in FIG.",
"15) and passed through the MUX and selected by IN_CTRL fully exercise the input dynamic range of the amplifier.",
"Note that a verification monitor at the top level of the hierarchy cannot connect directly to the amplifier inputs, AMP_IN_POS and AMP_IN_NEG.",
"In this manner, the instrumentation points in combination with criteria defined within the AMST, provide a direct measure of verification coverage of the amplifier.",
"This data can be calculated cumulatively over numerous individual simulations and different input conditions.",
"In the first example which is netlist initiated, FIG.",
"18, has as its starting point a pre-existing netlist of an analog or mixed signal design.",
"This flow chart illustrates a computer program product for identification of useful untested states of an electronic design 1800.The method comprises parsing 1810 at least one netlist of a representation of the electronic design comprised at least in part of at least one analog portion, determining 1812 at least one instrumentation point based on the at least one netlist, generating 1814 at least one instrumented netlist based on the at least one instrumentation point and determining 1816 an analog verification coverage utilizing the at least one instrumented netlist.",
"The electronic design may be analog or mixed signal.",
"It is also envisioned that this electronic design may be extended to the verification of electromechanical, electrochemical and electrobiological systems.",
"FIG.",
"19 depicts additional steps that would begin before step one 1812 of the first example of instrumentation 1900 of an electronic design.",
"In this case the electronic design is the initiation point, from which the netlist is created and additionally, the specification and the verification history are part of the initial dataset.",
"The example may additionally comprise receiving 1910 by a computer a computer readable representation of the electronic design having at least in one part of the electronic design, an analog portion and generating 1912 at least one set of valid states based on the at least one specification.",
"The first example may also comprise receiving 1914 at least one verification coverage history of the electronic design, it is envisioned that the coverage history may be for related circuits, circuits sharing common characteristics and the like.",
"The method may also comprise identifying 1916 at least one useful untested state based at least in part upon at least one of the at least one specification, the at least one instrumented netlist, the at least one set of valid states and the at least one verification coverage history and assessing 1918 verification completeness based at least in part upon at least one of the at least one instrumented netlist, the at least one verification coverage history and the at least one set of valid states.",
"The at least one untested state are valid states that have not yet been tested.",
"Referring back to FIG.",
"6, the electronic design would encompass each connected block in the figure.",
"The top level hierarchy is A1, the next level of hierarchy is B, which includes B1 and B2 and underneath the B hierarchy is the C hierarchy having C1, C2 and C3.In this specific example at the B1 level and below the model is comprised of Schematic and Spice models.",
"At the B2 level the model encompasses Schematic_behavioral and Behavioral_va models.",
"In this instance the analog test model would be connected to A1, instance 1 level and would be connected through the netlist, connecting lines to each of the components under test.",
"FIG.",
"20 depicts additional steps that are in addition to the steps in the FIG.",
"19 example of instrumentation 2000 of an electronic design, it is envisioned that the steps would fall between step 1914 and 1916, but may occur at other points in the flow.",
"These additional steps may comprise correlating 2010 the at least one verification coverage history and at least one input vector and determining 2012 a minimum number of the at least one input vector to maximize the assessed completeness of verification.",
"The correlation may comprise a measure of sameness, overlap, or the like of input characteristics and assertions.",
"The method may further comprise simulating 2014 at a behavioral level of the representation of the electronic design the minimum number of the at least one input vector and assessing 2016 a measurement output at the behavioral level simulation, wherein the assessment is based at least in part upon the at least one set of valid states.",
"The method may further comprise the steps of simulating 2018 at a transistor level of the representation of the electronic design the minimum number of the at least one input vector and correlating 2020 a measurement output at the transistor level simulation, wherein the correlation is based at least in part upon the measurement output at the behavioral level simulation.",
"The method may also comprise receiving 2022 at least one of at least one stimulus and at least one stimulus assertion, receiving 2024 at least one of at least one output measurement and at least one output assertion and modifying 2026 the at least one instrumented netlist to capture data indicative of at least one coverage contribution of at least one simulation.",
"Behavioral level simulations may precede transistor level and/or behavioral level follow-on tests.",
"FIG.",
"21 depicts a second example which is electronic design initiated in that it begins with a representation of the analog or mixed signal electronic design.",
"This electronic design initiated method comprises the steps of receiving 2110 by a computer a computer readable representation of the electronic design having at least in one part of the electronic design, an analog portion, generating 2112 at least one instrumented netlist based at least in part upon the representation of the electronic design, receiving 2114 at least one specification of the electronic design, generating 2116 at least one set of valid states based on the at least one specification and determining 2118 an analog verification coverage utilizing the at least one instrumented netlist.",
"The untested states are valid states that have not yet been tested.",
"Returning back to FIG.",
"8, the electronic design would encompass each of the connected blocks following the PMIC_testbench, and at least one analog test harness model would pertain to the block marked PMIC_testbench.",
"The netlist for that model would indicate each connection, connecting line in FIG.",
"8.The hierarchies associated with this design indicate that the LDO, Battery Supervisor and Voltage Reference blocks are lower in hierarchy than the PMIC block.",
"Additionally, this model primarily reviews the schematic portion of the design.",
"FIG.",
"22 depicts additional steps of the electronic design initiated method, it is envisioned that the steps of FIG.",
"22 would fall after step 2112 of FIG.",
"21, however the order and placement of the steps may vary.",
"The second example of instrumentation 2200 of an electronic design may additionally comprise steps such as simulating 2210 the at least one instrumented netlist, generating 2212 at least one verification coverage history of the electronic design based in part upon the simulation, and identifying 2214 at least one useful untested state based at least in part upon at least one of the at least one specification, the at least one instrumented netlist, the at least one set of valid states and the at least one verification coverage history.",
"The method may further comprise assessing 2216 verification completeness based at least in part upon the verification coverage history and the at least one set of valid states, correlating 2218 the at least one verification coverage history and at least one input vector, wherein the simulation of the at least one instrumented netlist may be performed at a behavioral level and determining 2220 a minimum number of at least one input vector to minimize the useful untested states.",
"The method may also comprise simulating 2222 at least one of a transistor level and a behavioral level of the representation of the electronic design the minimum number of the at least one input vector, assessing 2224 a measurement output at a behavioral level simulation, wherein the assessment is based at least in part upon the at least one set of valid states and correlating 2226 the measurement output at the transistor level simulation, wherein the correlation is based at least in part upon the measurement output at the behavioral level simulation.",
"FIG.",
"23 depicts another electronic design initiated example of a computer implemented method of instrumentation of an analog or mixed signal electronic design 2300.This method also includes an assessment of the verification completeness utilizing the specification, instrumented netlist, a list of valid states and the previous verification coverage that has been performed on the design.",
"The method comprises the steps of receiving 2310 by a computer a computer readable representation of the electronic design having at least in one part of the electronic design, at least one digital portion and at least one analog portion, generating 2312 at least one instrumented netlist based at least in part upon the representation of the electronic design and receiving 2314 at least one specification of the electronic design.",
"The method also comprises generating 2316 at least one set of valid states based on the at least one specification, receiving 2318 at least one verification coverage history of the electronic design and assessing 2320 completeness of verification based at least in part upon at least one of the at least one specification, the at least one instrumented netlist, the at least one set of valid states and the at least one verification coverage history.",
"Referring back to FIG.",
"9, the electronic design would encompass each of the connected blocks following the PMIC_testbench, and at least one analog test harness model would pertain to the block marked PMIC_testbench.",
"The netlist would indicate the connectivity, shown by the lines connecting each of the blocks.",
"The hierarchies associated with this design indicate that the LDO, Battery Supervisor and Voltage Reference blocks are lower in hierarchy than the PMIC block.",
"This model reviews the schematic, schematic behavioral and behavioral.va aspects of the model.",
"Though the overall electronic design is the same as in FIG.",
"8, what is tested, the hierarchies and connectivity are different.",
"FIG.",
"24 depicts additional steps that may occur after step 2318 of FIG.",
"23, although the exact point of inclusion may alter depending upon the specific implementation.",
"The third example of instrumentation 2400 of an electronic design may additionally comprise such as correlating 2410 the at least one verification coverage history and at least one input vector, determining 2412 a minimum number of the at least one input vector to maximize the assessing completeness of verification and simulating 2414 at a behavioral level of the representation of the electronic design the minimum number of the at least one input vector.",
"The method may also comprise assessing 2416 a measurement output at the behavioral level simulation, wherein the assessment is based at least in part upon the at least one set of valid states, simulating 2418 at a transistor level of the representation of the electronic design the minimum number of the at least one input vector and correlating 2420 the measurement output at the transistor level simulation, wherein the correlation is based at least in part upon the measurement output at the behavioral level simulation.",
"In a fourth example, FIG.",
"25 illustrates an electronic design initiated behavioral model.",
"The computer program product 2500 is embodied on a non-transitory computer usable medium 2510.The non-transitory computer usable medium having stored thereon a sequence of instructions which, when executed by at least one processor 2512 causes the at least one processor to execute a method of identification of useful untested states of an electronic design, comprising the steps of receiving 2514 a representation of the electronic design comprised at least in part of at least one analog portion and generating 2516 at least one instrumented netlist based at least in part upon the representation of the electronic design.",
"The computer program product further comprises the steps of receiving 2518 at least one specification of the electronic design, generating 2520 at least one set of valid states based on the at least one specification and simulating 2522 at a behavioral level of the representation of the electronic design the at least one instrumented netlist at a minimum number of the at least one input vector.",
"The computer program product further comprises the steps of generating 2524 at least one verification coverage history of the electronic design based in part upon the simulation and identifying 2526 useful untested states based at least in part upon at least one of the at least one specification, the at least one instrumented netlist, the at least one set of valid states and the at least one verification coverage history.",
"Referring back to FIG.",
"10, the electronic design would encompass each of the connected blocks following the PMIC_testbench, and at least one analog test harness model would pertain to the block marked PMIC_testbench.",
"In this example the PMIC hierarchy and the LDO, Battery Supervisor and Voltage Reference hierarchies are reviewed.",
"At the highest level the PMIC is reviewed at the schematic level and the LDO at the Behavioral_vams, the Battery Supervisor at the Behavioral_vams and the Voltage reference at the Behavioral_va level.",
"FIG.",
"26 depicts additional steps beginning at some point after step 2516 of FIG.",
"25.The steps may additionally comprise assessing 2610 a measurement output at a behavioral level simulation, wherein the assessment is based at least in part upon the at least one set of valid states, correlating 2612 the at least one verification coverage history and at least one input vector and simulating 2614 at a transistor level of the representation of the electronic design the minimum number of the at least one input vector.",
"The example may also comprise correlating 2616 the measurement output at a transistor level simulation, wherein the correlation is based at least in part upon the measurement output at the behavioral level simulation, receiving 2618 at least one output measurement and receiving at least one output assertion and receiving 2620 at least one analog test harness model.",
"FIG.",
"27 depicts a post-simulation aggregated analysis as a fifth example of a computer implemented method of instrumentation of an electronic design 2700.In this case the simulations have been run and a database of information collected which allows a review looking for holes in the verification coverage.",
"The analysis method comprises the steps of receiving 2710 a representation of the electronic design, having at least in one part of the electronic design, an analog portion, receiving 2712 at least one specification of the electronic design, generating 2714 at least one set of valid states delimited by the at least one specification, receiving 2016 at least one verification history of the electronic design and identifying 2718 useful untested states based at least in part upon at least one of the at least one specification, the at least one set of valid states and the at least one verification history.",
"Referring back to FIG.",
"8, the electronic design would encompass each of the connected blocks following the PMIC_testbench, and at least one analog test harness model would pertain to the block marked PMIC_testbench.",
"The netlist for that model would indicate each connection, connecting line in FIG.",
"8.The hierarchies associated with this design indicate that the LDO, Battery Supervisor and Voltage Reference blocks are lower in hierarchy than the PMIC block.",
"Additionally, this model primarily reviews the schematic portion of the design.",
"FIG.",
"28 depicts additional steps that may occur at any point after step 2710 of FIG.",
"27.In this example, the data inputs may vary and allow a broader review of the states that have been reviewed and what additional states need to be reviewed.",
"This fifth example of instrumentation 2800 of an electronic design may additionally comprise steps such as receiving 2810 at least one manufacturing process variation of the electronic design, receiving 2812 at least one functional variation of the electronic design wherein the identifying useful untested states based at least in part upon the at least one manufacturing process variation and the at least one functional variation and receiving 2814 at least one of at least one stimulus and at least one stimulus assertion.",
"The method may also comprise receiving 2816 at least one of at least one output measurement and at least one output assertion, receiving 2818 at least one analog test harness model, analyzing 2820 at least one output of a simulation and identifying 2822 verification state coverage based at least in part upon at least one of the at least one verification history and at least one level of abstraction of the at least one specification.",
"Referring back to FIG.",
"9, the electronic design would encompass each of the connected blocks following the PMIC_testbench, and at least one analog test harness model would pertain to the block marked PMIC_testbench.",
"The netlist would indicate the connectivity, shown by the lines connecting each of the blocks.",
"The hierarchies associated with this design indicate that the LDO, Battery Supervisor and Voltage Reference blocks are lower in hierarchy than the PMIC block.",
"This model reviews the schematic, schematic behavioral and behavioral.va aspects of the model.",
"Though the overall electronic design is the same as in FIG.",
"8, what is tested, the hierarchies and connectivity are different.",
"In a sixth example, FIG.",
"29 illustrates a manufacturing inclusive review of the verification coverage of an analog or mixed signal design.",
"In this example not only the specification is taken into account, but also manufacturing process variations that will likely be encountered and probable functional variations encountered post manufacturing.",
"In this example the computer program product 2900 is embodied on a non-transitory computer usable medium 2910, the non-transitory computer usable medium having stored thereon a sequence of instructions which, when executed by a processor 2912 causes the processor to execute a method of identification of useful untested states of an electronic design, comprising the steps of, receiving 2914 a representation of the electronic design comprised at least in part of at least one analog portion, receiving 2916 at least one specification of the electronic design, receiving 2918 at least one manufacturing process variation of the at least one analog portion of the electronic design and receiving 2920 at least one functional variation of the at least one analog portion of the electronic design.",
"The computer program product also comprises the steps of generating 2922 at least one set of valid states delimited by one of the at least one specification, the at least one manufacturing process variation and the at least one functional variation, receiving 2924 at least one verification history of the at least one analog portion of the electronic design and identifying 2926 useful untested states based at least in part upon at least one of the at least one specification, the at least one set of valid states, the at least one manufacturing process variation, the at least one functional variation and the at least one verification history.",
"The product may also include the step of assessing a verification completeness based at least in part upon the at least one verification history and the at least one set of valid states.",
"FIG.",
"30 illustrates an example system diagram 3000 for identification of useful untested states of an electronic design.",
"A user's schematic capture module 3010 captures a representation of the electronic design.",
"A netlist is generated 3012 from the captured schematic and the netlist is processed by a netlist processor 3014.The netlist is subsequently instrumented 3016 to allow inputs and outputs at netlist nodes to be independently captured and a simulation is performed at a transistor level by a transistor level simulator 3018.Data from the simulator is stored in a simulator output database 3020.The simulation output data is post processed by a simulation post processor 3022, which feeds the data into a project level hierarchical tested states database 3024.A coverage analysis and model checking module 3026 receives data from the project level hierarchical tested states database.",
"The data from the simulator output database may also be sent to the user's schematic capture and/or waveform viewer 3028 which feeds data to the design database 3030.The design database may also send and receive data from the project level hierarchical tested states database.",
"Although the examples have been directed to analog electronic testing, the methods, system and computer readable media may be applied to electro-mechanical, electro-chemical and electro-biological verification and testing.",
"While the making and using of various exemplary examples of the disclosure are discussed herein, it is to be appreciated that the present disclosure provides concepts which can be described in a wide variety of specific contexts.",
"Although the disclosure has been shown and described with respect to a certain example, it is obvious that equivalents and modifications will occur to others skilled in the art upon the reading and understanding of the specification.",
"The present disclosure includes such equivalents and modifications, and is limited only by the scope of the following claims.",
"It is to be understood that the method and apparatus may be practiced locally, distributed or remotely and that the data for steps may be stored either locally or remotely.",
"For purposes of clarity, detailed descriptions of functions, components, and systems familiar to those skilled in the applicable arts are not included.",
"The methods and apparatus of the disclosure provide one or more advantages including which are not limited to, improved speed efficiency, decreased computation time, decreased number of re-verifications and the like.",
"While the disclosure has been described with reference to certain illustrative examples, those described herein are not intended to be construed in a limiting sense.",
"For example, variations or combinations of steps in the examples shown and described may be used in particular cases while not departing from the disclosure.",
"Various modifications and combinations of the illustrative examples as well as other advantages and examples will be apparent to persons skilled in the arts upon reference to the drawings, description, and claims."
]
] |
Patent_15871210
|
[
[
"TECHNIQUES FOR COORDINATING A MESSAGING EXPERIENCE ACROSS PLATFORMS",
"Techniques for coordinating a message experience across platforms are described.",
"In one embodiment, an apparatus may comprise a messaging application operative on a processor circuit to receive a request from a remote web browser to login to the messaging application.",
"The messaging application may comprise an access code generator to generate a first access code and present the first access code on a messaging application website; an authenticator to receive a second access code from a second device associated with a user identifier, compare the second and first access codes, and lookup an account associated with the user identifier; and a messaging component to retrieve message data for an account associated with the user identifier in response the second access code matching the first access code, and to transmit the message data to the remote web browser for presentation.",
"Other embodiments are described and claimed."
],
[
"1.A method comprising: receiving a request from a remote web browser, the request to login to a messaging application and including a user identifier; generating a first access code; transmitting the first access code to a mobile device associated with the user identifier; receive a second access code from the remote web browser; comparing the second access code to the first access code; retrieving message data for an account associated with the user identifier when the second access code matches the first access code; and transmitting the message data to the remote web browser for presentation.",
"2.The method of claim 1, wherein the user identifier is a mobile telephone number, an electronic mail address, or a user name associated with a mobile telephone number.",
"3.The method of claim 1, wherein generating the first access code comprises generating an alphanumeric text sequence, a machine-readable optical pattern, an audio signal, or a visual image.",
"4.The method of claim 1, wherein retrieving the message data comprises retrieving messages sent to the user, messages sent by the user, message status updates, or other updates to the status of a messaging conversation, from a data store.",
"5.The method of claim 1, further comprising creating a session identifier, wherein the session identifier is usable by the remote web browser and by the messaging application to identify the user and locate message data of the user, and to send the session identifier to the remote web browser.",
"6.The method of claim 5, wherein the session identifier is useable to identify the user and locate message data until the user logs out of the messaging application.",
"7.The method of claim 5, further comprising: receiving a second request from the remote web browser to load a web page for the messaging application, the request including the session identifier; and retrieving message data associated with the session identifier.",
"8.An apparatus, comprising: a processor circuit on a device; and a messaging application operative on the processor circuit to receive a request from a remote web browser executing on a first device, the request to login to the messaging application and including a user identifier; the messaging application comprising: an access code generator to generate a first access code and to present the first access code to the user on a messaging service website at the remote web browser; an authenticator to receive a second access code from a second device associated with the user identifier, compare the second access code to the first access code, and lookup an account associated with the user identifier and the second device; and a messaging component to retrieve message data for an account associated with the user identifier in response the second access code matching the first access code, and to transmit the message data to the remote web browser for presentation.",
"9.The apparatus of claim 8, wherein the user identifier is a mobile telephone number, an electronic mail address, or a user name associated with a mobile telephone number.",
"10.The apparatus of claim 8, the access code generator to generate an alphanumeric text sequence, a machine-readable optical pattern, an audio signal, or a visual image.",
"11.The apparatus of claim 8, the messaging component to retrieve messages sent to the user, messages sent by the user, message status updates, or other updates to the status of a messaging conversation, from a data store.",
"12.The apparatus of claim 8, the messaging application to create a session identifier, wherein the session identifier is usable by the remote web browser and by the messaging application to identify the user and locate message data of the user, and to send the session identifier to the remote web browser.",
"13.The apparatus of claim 12, wherein the session identifier is useable to identify the user and locate message data until the user logs out of the messaging application.",
"14.The apparatus of claim 12, the messaging application to receive a second request from the remote web browser to load a web page for the messaging service, the request including the session identifier; and the messaging component to retrieve message data associated with the session identifier.",
"15.At least one computer-readable storage medium comprising instructions that, when executed, cause a system to: receive a request from a remote web browser, the request to login to a messaging application and including a user identifier; generate a first access code; transmit the first access code to a mobile device associated with the user identifier; receive a second access code from the remote web browser; compare the second access code to the first access code; retrieve message data for an account associated with the user identifier when the second access code matches the first access code; and transmit the message data to the remote web browser for presentation.",
"16.The computer-readable storage medium of claim 15, wherein the user identifier is a mobile telephone number, an electronic mail address, or a user name associated with a mobile telephone number.",
"17.The computer-readable storage medium of claim 15, the instructions to generate the first access code comprising instructions to generate an alphanumeric text sequence, a machine-readable optical pattern, an audio signal, or a visual image.",
"18.The computer-readable storage medium of claim 15, the instructions to retrieve message data comprising instructions to retrieve messages sent to the user, messages sent by the user, message status updates, or other updates to the status of a messaging conversation, from a data store.",
"19.The computer-readable storage medium of claim 15, further comprising instructions to create a session identifier, wherein the session identifier is usable by the remote web browser and by the messaging application to identify the user and locate message data of the user, and to send the session identifier to the remote web browser.",
"20.The computer-readable storage medium of claim 19, further comprising instructions to: receive a second request from the remote web browser to load a web page for the messaging application, the request including the session identifier; and retrieve message data associated with the session identifier."
],
[
"<SOH> BACKGROUND <EOH>Users of social networking services and messaging services may have multiple ways to access and use these services, for example, via a website and via an application executing on a mobile device.",
"Coordinating the message experience across devices and platforms, however, may be challenging.",
"Users expect to see all of their messages and related data regardless of how they connect to their messaging service, while also expecting an easy and secure way to access their message data."
],
[
"<SOH> SUMMARY <EOH>The following presents a simplified summary in order to provide a basic understanding of some novel embodiments described herein.",
"This summary is not an extensive overview, and it is not intended to identify key/critical elements or to delineate the scope thereof.",
"Its sole purpose is to present some concepts in a simplified form as a prelude to the more detailed description that is presented later.",
"Various embodiments are generally directed to techniques for providing a coordinated messaging experience across platforms.",
"Some embodiments are particularly directed to techniques for accessing messages and message data from multiple platforms and sign-on methods.",
"In one embodiment, for example, a method may comprise receiving a request to load a web page at a messaging service website from a web browser executing on a client device, where the request includes a first session identifier for an open session between the web browser and a social network service for a user of the social network service.",
"The method may further comprise sending a second request to a server of the social network service for user information associated with the first session identifier; receiving the user information from the server of the social network service; and rendering a login graphical user interface (UI) dialog, on the web page, the dialog comprising the user information and a selectable login UI element.",
"The method may further comprise receiving a control directive on the selectable login UI element; requesting message data associated with the user from a messaging service in response to receiving the control directive; receiving the requested message data; and transmitting the message data to the client device for presentation on the web browser.",
"Other embodiments are described and claimed.",
"To the accomplishment of the foregoing and related ends, certain illustrative aspects are described herein in connection with the following description and the annexed drawings.",
"These aspects are indicative of the various ways in which the principles disclosed herein can be practiced and all aspects and equivalents thereof are intended to be within the scope of the claimed subject matter.",
"Other advantages and novel features will become apparent from the following detailed description when considered in conjunction with the drawings."
],
[
"CROSS-REFERENCE TO RELATED APPLICATIONS This application is a divisional of, claims the benefit of and priority to previously filed U.S. patent application Ser.",
"No.",
"14/701,867 filed May 1, 2015 titled “TECHNIQUES FOR COORDINATING A MESSAGING EXPERIENCE ACROSS PLATFORMS”, which is hereby incorporated by reference in its entirety.",
"BACKGROUND Users of social networking services and messaging services may have multiple ways to access and use these services, for example, via a website and via an application executing on a mobile device.",
"Coordinating the message experience across devices and platforms, however, may be challenging.",
"Users expect to see all of their messages and related data regardless of how they connect to their messaging service, while also expecting an easy and secure way to access their message data.",
"SUMMARY The following presents a simplified summary in order to provide a basic understanding of some novel embodiments described herein.",
"This summary is not an extensive overview, and it is not intended to identify key/critical elements or to delineate the scope thereof.",
"Its sole purpose is to present some concepts in a simplified form as a prelude to the more detailed description that is presented later.",
"Various embodiments are generally directed to techniques for providing a coordinated messaging experience across platforms.",
"Some embodiments are particularly directed to techniques for accessing messages and message data from multiple platforms and sign-on methods.",
"In one embodiment, for example, a method may comprise receiving a request to load a web page at a messaging service website from a web browser executing on a client device, where the request includes a first session identifier for an open session between the web browser and a social network service for a user of the social network service.",
"The method may further comprise sending a second request to a server of the social network service for user information associated with the first session identifier; receiving the user information from the server of the social network service; and rendering a login graphical user interface (UI) dialog, on the web page, the dialog comprising the user information and a selectable login UI element.",
"The method may further comprise receiving a control directive on the selectable login UI element; requesting message data associated with the user from a messaging service in response to receiving the control directive; receiving the requested message data; and transmitting the message data to the client device for presentation on the web browser.",
"Other embodiments are described and claimed.",
"To the accomplishment of the foregoing and related ends, certain illustrative aspects are described herein in connection with the following description and the annexed drawings.",
"These aspects are indicative of the various ways in which the principles disclosed herein can be practiced and all aspects and equivalents thereof are intended to be within the scope of the claimed subject matter.",
"Other advantages and novel features will become apparent from the following detailed description when considered in conjunction with the drawings.",
"BRIEF DESCRIPTION OF THE DRAWINGS FIG.",
"1 illustrates an embodiment of a messaging web access system.",
"FIG.",
"2 illustrates an embodiment of the messaging web access system having a social network service and a messaging service each accessible from either a web browser or a mobile device.",
"FIG.",
"3 illustrates an embodiment of the messaging service.",
"FIG.",
"4 illustrates an embodiment of a messaging system.",
"FIG.",
"5 illustrates an embodiment of a message flow for the messaging web access system.",
"FIG.",
"6 illustrates an embodiment of a second message flow for the messaging web access system.",
"FIG.",
"7 illustrates an embodiment of a third message flow for the messaging web access system.",
"FIG.",
"8 illustrates an embodiment of a logic flow for the messaging web access system.",
"FIG.",
"9 illustrates an embodiment of a second logic flow for the messaging web access system.",
"FIG.",
"10 illustrates an embodiment of a third logic flow for the messaging web access system.",
"FIG.",
"11 illustrates an embodiment of a centralized system for the system of FIG.",
"1.FIG.",
"12 illustrates an embodiment of a distributed system for the system of FIG.",
"1.FIG.",
"13 illustrates an embodiment of a computing architecture.",
"FIG.",
"14 illustrates an embodiment of a communications architecture.",
"FIG.",
"15 illustrates an embodiment of a radio device architecture.",
"DETAILED DESCRIPTION Various embodiments are directed to providing multiple access points to a messaging service while also providing a coordinated messaging experience across the access points.",
"A messaging application and a messaging website may empower a user to communicate with other users by sending and receiving messages as part of a messaging service.",
"In some embodiments, the messaging service may be provided within another service such as a social networking service, as well as being available independently of the social networking service.",
"Some users of both the messaging service and the social networking service may wish to remain in communication with their contacts even when one or more access platforms are unavailable.",
"For example, some work environments do not allow their employees to access social networks from company computers, and others may not permit the use of mobile devices in some environments.",
"Regardless, a user may wish to be accessible to their contacts by messages immediately.",
"At the same time, the user might not wish to use simple message service (SMS) or multimedia message service (MMS) messaging services provided by a cellular service provider for cost or for other reasons.",
"Being able to switch easily from messaging on a mobile device, to a social network website, to a messaging service website and back again without losing message data and continuity is therefore a desirable feature.",
"Users of a messaging service may wish to access the messaging service at times from within a social network website that also provides messaging capability.",
"At other times, the users may wish to access the messaging service through a different website than the social network website.",
"At still other times, the users may wish to use an application on a mobile device to access the messaging service.",
"In some cases, the users of the messaging service may not be users of the social network site and may still need a way to access their messages through both a website and from a mobile device application.",
"Accordingly, various embodiments provide a way for a user to access the messaging service from a variety of platforms without losing message continuity.",
"In order to provide the coordinated seamless transition from one messaging endpoint to another, a messaging service may need to identify and authenticate the user that is attempting to access the messaging service.",
"In some embodiments, when the user of the messaging service is also a user of a social network service (SNS), the messaging service may use the user's SNS information to access the message information for the user.",
"In some embodiments, the user may not be a user of the SNS.",
"In such cases, the user may attempt to access the messaging service through a messaging service website, using, for example, a phone number of their mobile device to access their messaging information.",
"A phone number, however, by itself, may not be sufficient to authenticate the user at the messaging service.",
"Accordingly, various embodiments provide additional authentication processes.",
"Reference is now made to the drawings, wherein like reference numerals are used to refer to like elements throughout.",
"In the following description, for purposes of explanation, numerous specific details are set forth in order to provide a thorough understanding thereof.",
"It may be evident, however, that the novel embodiments can be practiced without these specific details.",
"In other instances, well known structures and devices are shown in block diagram form in order to facilitate a description thereof.",
"The intention is to cover all modifications, equivalents, and alternatives consistent with the claimed subject matter.",
"It is worthy to note that “a” and “b” and “c” and similar designators as used herein are intended to be variables representing any positive integer.",
"Thus, for example, if an implementation sets a value for a=5, then a complete set of components 122 illustrated as components 122-1 through 122-a may include components 122-1, 122-2, 122-3, 122-4 and 122-5.The embodiments are not limited in this context.",
"FIG.",
"1 illustrates a block diagram for a messaging web access system 100.In one embodiment, the messaging web access system 100 may comprise a computer-implemented system having software applications comprising one or more components.",
"Although the messaging web access system 100 shown in FIG.",
"1 has a limited number of elements in a certain topology, it may be appreciated that the messaging web access system 100 may include more or fewer elements in alternate topologies as desired for a given implementation.",
"As shown in FIG.",
"1, a remote web browser 190 on a personal computer device 180 may be used as an interface to a messaging service 160.A mobile device 120 may also be used as an interface to the messaging service 160.Both or either of the remote web browser 190 and the mobile device 120 may be used to carry out a messaging conversation with a remote messaging client 170.A mobile device 120 may communicate with other devices using wireless transmissions to exchange network traffic.",
"Exchanging network traffic, such as may be included in the exchange of a messaging update 110, may comprise transmitting and receiving network traffic via a network interface controller (NIC).",
"A NIC comprises a hardware component connecting a computer device, such as mobile device 120, to a computer network.",
"The NIC may be associated with a software network interface empowering software applications to access and use the NIC.",
"Network traffic may be received over the computer network as signals transmitted over data links.",
"The network traffic may be received by capturing these signals and interpreting them.",
"The NIC may receive network traffic over the computer network and transfer the network traffic to memory storage accessible to software applications using a network interface application programming interface (API).",
"The mobile device 120 may perform various operation using network data accessed over a network.",
"The mobile device 120 may access a cellular system 130 using cellular signals 135.The cellular system 130 may be a cellular network including data access, the cellular system 130 provided by a cellular provider with which the user of the mobile device 120 has a service contract, the service contract for cellular data server to the mobile device 120.The mobile device 120 may use the cellular system 130 to access the public Internet 150 for interacting with one or more other devices.",
"The mobile device 120 may access one or more Wi-Fi access points 140 using Wi-Fi signals 145.Wi-Fi access points 140 may be provided by a plurality of different operators.",
"Some of the Wi-Fi access points 140 may be personal in nature, such as a home Wi-Fi network operated by the user of mobile device 120 based on a domestic Internet connection.",
"Some of the Wi-Fi access points 140 may be free of charge or provided as a complimentary portion of a service, such as free Wi-Fi service in coffee shops, hotels, and other public accommodations.",
"The mobile device 120 may use Wi-Fi access points 140 to access the public Internet 150 for interacting with one or more other devices.",
"The dashed line between the Internet 150 and mobile device 120 indicates that the messaging update 110 may be exchanged with other devices ultimately using the Internet 150, with one of the cellular system 130 and Wi-Fi access point 140 acting as the medium to access the Internet 150.The mobile device 120 may engage in a messaging conversation with a remote local messaging client application 170.The messaging conversation may comprise the exchange of messaging updates such as messaging update 110.Messaging updates may comprise messages, message status updates, and other updates to the status of a messaging conversation.",
"The same user of the mobile device 120 may own and operate a personal computer device 180.The personal computer device 180 may comprise a Mac OS® device, Windows® device, Linux® device, or other computer device running another operating system.",
"The personal computer device 180 may be an Ethernet device capable of connecting to the Internet 150 via an Ethernet connection.",
"In some embodiments and in some cases the personal computer device 180 may additionally or alternatively use cellular, Wi-Fi, or other networking technologies to the Internet 150.The personal computer device 180 may execute a web browser 190 to access a messaging service 160 and to receive messaging updates such as message update 110 from the mobile device 120 via the messaging service 160.The messaging service 160 may receive and store messages exchanged between two or more individuals as part of a messaging conversation or chat.",
"The messaging service 160 may receive a message sent, for example, using the mobile device 120, and may forward or push the message to a device of the intended recipient, e.g.",
"the remote messaging client 170.The messaging service 160 may, alternatively or additionally, send a notification to the recipient device that a message has been received, and may allow the recipient device to request or pull the message.",
"Messaging web access system 100 may include an authorization server (or other suitable component(s)) that allows users to opt in to or opt out of having their actions logged by messaging web access system 100 or shared with other systems (e.g., third-party systems), for example, by setting appropriate privacy settings.",
"A privacy setting of a user may determine what information associated with the user may be logged, how information associated with the user may be logged, when information associated with the user may be logged, who may log information associated with the user, whom information associated with the user may be shared with, and for what purposes information associated with the user may be logged or shared.",
"Authorization servers or other authorization components may be used to enforce one or more privacy settings of the users of messaging web access system 100 and other elements of a social-networking system through blocking, data hashing, anonymization, or other suitable techniques as appropriate.",
"FIG.",
"2 illustrates an embodiment of the messaging web access system 100 in which the messaging service 160 may be accessed from a remote web browser directly, or via a social network service 210, and from a mobile device 120.As shown in FIG.",
"2, the remote web browser 190 may access a social network service (SNS) 210 by loading a web page for the SNS at a SNS uniform locator resource (URL) 212.The SNS 210 may require that a user log in to the SNS 210 prior to accessing their content and connections within the SNS 210.For example, the user may need to provide a user name and password.",
"Once the user is successfully logged in to the SNS 210, session information 202 may be generated and stored by the remote web browser 190.The session information 202 may include a session identifier.",
"A session identifier may be used by the remote web browser 190 and the SNS 210 to connect a user automatically to their SNS content, without having to log in again, even after the remote web browser 190 is closed or quit, or the personal computer device 180 is restarted.",
"The session identifier may be specific to a particular web browser, in that accessing the SNS URL 212 from a different remote web browser application would still require the user to log in to the SNS 210.The SNS 210 may provide messaging functionality with a SNS messaging application 214 to the member users of the SNS 210.For example, the SNS messaging application 214 may allow a member to send a message to another user of the SNS 210 from within the web pages provided by the SNS 210.The SNS messaging application 214 may access and use the messaging functionality provided by the messaging service 160.For example, a message sent by a user while accessing the SNS 210 from the SNS URL 212 at the remote web browser 190 may be stored by the messaging service 160 and sent to another user within the SNS 210.The messaging service 160 may provide notifications to the recipient users via the SNS 210, which may present, for example, a new message icon, and/or an audible alert that a message is received.",
"As shown in FIG.",
"2, the remote web browser 190 may access the messaging service 160 directly by accessing a messaging uniform locator resource (URL) 216.The messaging URL 216 may be different from the SNS URL 212.For example, the SNS URL 212 may be “http://www.facebook.com”, while the messaging URL 216 may be “http://www.messenger.com”.",
"The messaging service 160 may provide messaging functionality with a messaging application 218.As with the SNS 210, the messaging service 160 may require that the user log in and/or authenticate themselves before accessing their message content.",
"The messaging application 218 may authenticate the user.",
"Once logged in, a second session identifier may be generated and included with session information 202.The second session identifier may allow the user to access their message content automatically without logging in again from that particular remote web browser 190 application, even if their session with the SNS is expired or closed, and/or if the web browser is closed or quit, or the personal computer device 180 is restarted.",
"For example, the remote web browser can later request to load a web page for the messaging application 218.If the request includes the second session identifier, the message data associated with the session identifier can be retrieved without requiring that the user login again.",
"Once logged in successfully, the user may have access to all of their stored sent and received messages from the messaging service 160, including messages sent and received while using the SNS 210, if the user is also a user of the SNS 210.The messaging service 160 may also provide one or more interfaces within a web browser window to allow the user to read, compose and send messages, and to see which of their messaging contacts are currently online or offline.",
"The SNS 210 and the messaging service 160 may also be accessed from a mobile device 120.The mobile device 120 may execute a SNS application client 220.The SNS application client 220 may be operated by the user of the mobile device 120 to access the functionality of the SNS 210 from the mobile device 120 without using the SNS URL 212.The SNS application client 220 may allow the user of the mobile device 120 to view, share, and publish content on the SNS 210, and may provide access to the messaging functionality of the SNS 210 to the user of the mobile device 120.The mobile device 120 may execute a message application client 230.The message application client 230 may be operated by a user of the mobile device 120 to exchange messages with other users via the exchange of messages with their respective devices.",
"A message may comprise one or more of a text sequence, image file, video file, sound file, and any other form of media file.",
"The message application client 230 may use an interface on the mobile device 120 for displaying messages received from other users, receiving the entry of messages by the user of the mobile device 120, and for displaying other user interface elements related to messaging.",
"The message application client 230 may connect directly to the messaging service 160 to access the features of the messaging application 218 without using the messaging URL 216.In some embodiments, the message application client 230 may be invoked by the SNS application client 220 when the user selects to use the messaging functions of the SNS 210.For example, when the user selects a messaging UI element within the SNS application client 220, the message client application 230 may open and be visible on the mobile device 120, and the SNS application client 220 may be switched to the background on the mobile device 120.The message application client 230 may be a dedicated message application client 230 that has a primary purpose of messaging.",
"A dedicated message application client 230 may be specifically associated with a messaging provider administering the messaging service 160 including a messaging server.",
"The message application client 230 may be a general client operative to work with a plurality of different messaging providers including the messaging provider administering the messaging platform including the messaging service 160.The message application client 230 may be associated with a first user account with the messaging service 160.A messaging update 110 may have been received from a second messaging application on a second mobile device, the second messaging application associated with a second user account with the messaging service 160.The messaging update 110 may therefore comprise a message in a messaging conversation between the first user account and the second user account.",
"This may be a message sent from the first user account to the second user account or a message sent from the second user account to the first user account.",
"The message may comprise one or more of a text segment, an image, a video segment, and an audio segment.",
"Both the remote web browser 190 and the mobile device 120 may be used to originate messages as well as to view messaging originating from each other or from the remote messaging client 170.In various embodiments, however, a user is likely to use only one or the other but not both simultaneously.",
"Either the remote web browser 190 or the mobile device 120 may transmit an outgoing message to a second messaging application, the second messaging application associated with the second user account.",
"This second messaging application may correspond to the remote messaging client 170.In some embodiments, when a message is received for a user, the messaging service 160 may push a notification and/or the message itself to any messaging endpoint for the recipient having an open session with the messaging service 160.For example, if a user has an unexpired session identifier at the remote web browser 190 and has a web browser connection to the messaging URL 216, then the message and/or a notification of a received message may be pushed to the remote web browser 190.Similarly, if the user has an unexpired session identifier on the mobile device 120 for the message application client 230, then the message and/or a notification of a received message may be pushed to the message application client 230.If the user also, or alternatively, has an open session with the SNS 210 and has a web browser connection to the SNS messaging application 214, then the message and/or a notification of a received message may be pushed to the remote web browser 190 for presentation with the SNS 210 web interface.",
"In some embodiments, an originating messaging endpoint may be notified when a message sent from that originating endpoint is displayed on the destination messaging endpoint.",
"As such, the message application client 230 and/or the remote web browser 190 may receive an acknowledgement of the outgoing message from the second messaging application and update the outgoing message according to the acknowledgement of the outgoing message.",
"Updating the outgoing message may comprise displaying an icon, symbol, or other visual element adjacent to the outgoing message, the visual element visually associated with the message being viewed by its recipient.",
"As part of establishing the remote web browser 190 as an endpoint for accessing the messaging service 160, the web session of the remote web browser 190 may be loaded with messaging state for the user account when the user successfully logs in to the messaging service 160 from the remote web browser 190, or has an open session identifier.",
"The remote web browser 190 may receive or retrieve a messaging state associated with the user account from the messaging service 160.The messaging update may correspond to a messaging conversation between the first user account and a second user account.",
"The messaging state may comprise a history of the messaging conversation between the first user account and the second user account.",
"For example, the user of the mobile device 120 may engage in a messaging conversation with the user of a remote messaging client 170.Initially this conversation may use involve the direct use by the user of the message application client 230 on the mobile device 120.However, the user may at some point desire to start using their personal computer device 180 to continue the conversation.",
"For example, the user may have been travelling to their home and using the mobile device 120 and then return home and want to use the personal computer device 180.By transmitting the history to the remote web browser 190 on the personal computer device 180, the user may not only continue the conversation but be reminded of the history of that, and other, conversations.",
"The messaging state may include additional or alternative information, such as the contact list for the first user account.",
"In some cases, the full contact list of a user account may be too lengthy to efficiently send, and as such the messaging state may comprise a portion of the contact list for the first user account.",
"The message application client 230 may retrieve the contact list for the first user account from a local store on the mobile device 120 and determine the portion of the contact list based on messaging activity of the contacts in the contact list.",
"FIG.",
"3 illustrates an embodiment of the messaging service 160 of the messaging web access system 100.As shown in FIG.",
"3, the messaging service 160 may include the messaging application 218, message website data 320 and message data 310.More, fewer or other components may be used to provide the functionality described herein.",
"The messaging application 218 may include one or more functional components, such as a messaging component 302, an access code generator 304, and an authenticator 306.More, fewer, or different components may also be used to provide the functionality described herein.",
"The messaging component 302 may operate to provide the message receiving and sending functions as described above.",
"That is, the messaging component 302 may receive a message sent by a first user to a second user, store the message, and send the message and/or a notification about the message to the second user.",
"The access code generator 304 may generate a code to be used to authenticate a user who is attempting to access their messages via the messaging URL 216 and who does not have an account with the SNS 210.The access code may be presented on one device to the user.",
"The user may then need to enter the access code on a second device, which may communicate the access code back to the messaging service 160.For example, the access code may be presented on a web page for logging into the messaging service 160 after the user enters a user identifier such as a user name or a telephone number.",
"The user may then need to enter the access code into their mobile device 120 and using the message application client 230, send the access code back to the messaging service 160.Alternatively, the access code may be sent to and presented on the mobile device 120 after the user enters a user identifier such as a user name or a telephone number into a logging in web page for the messaging service 160.The user would then need to enter the access code into the web site before being able to access their messages.",
"The access code may be in any format that can be output from one device an input into a second device.",
"For example, the access code may be in a visual format, such as, but not limited to, an alphanumeric text string, a machine-readable optical pattern, e.g.",
"a barcode, an image and so forth.",
"The access code may be in an auditory format, for example, a tone or sequence of tones, and may be detectable or undetectable to human ears.",
"In some embodiments, the access code may be randomly generated and may not have any embedded information.",
"In other embodiments, the access code may include, or be generated from, information that can be used to identify the user, a session identifier, a date or time, a location, or any other information.",
"The access code may be entered on the second device according to its format.",
"For example, an alphanumeric text string may be entered on a keyboard interface of the second device.",
"A camera on the second device may be used to capture a text string, an image, or a barcode.",
"A scanning operation may also be used with a camera to read a machine-readable optical pattern.",
"An auditory access code may be captured by a microphone and played back out of a speaker, or sent as an audio file.",
"The embodiments are not limited to these examples.",
"The authenticator 306 may receive the access code generated by the access code generator 304, and the access code received from the second device.",
"The authenticator 306 may compare the two versions of the access code.",
"If they match, then the user may access their message information.",
"In some embodiments, the match may need to be exact.",
"In other embodiments, the two access codes may need to match within a tolerance, to allow for data loss in transmission or during the capture of the access code by the second device.",
"The matching operation performed by the authenticator 306 may include any operations needed to compare two access codes.",
"The authenticator 306 may include additional processing operations to convert an access code into a digital representation that can be compared to another.",
"For example, if the access code is an alphanumeric text sequence, each character may be compared in order.",
"If the access code is an optical pattern, the results of a scanning operation may be compared to the originally generated pattern.",
"The embodiments are not limited to these examples.",
"In some embodiments, the authenticator 306 may lookup and/or locate an account associated with the user identifier and/or the second device.",
"The messaging component 302 may use the account information to locate and send the messaging information to the remote web browser 190 when the authentication succeeds.",
"The messaging service 160 may also include a messaging service website 320.The messaging service website 320 may include the data and operations needed to provide access to the messaging service 160 through a web browser.",
"The messaging service website 320 may include pages 322.The pages 322 may include one or more documents, such as hypertext markup language (HTML) documents, that when loaded by a web browser, present user interface elements that allow a user to log in to the messaging service 160, and to read and compose messages.",
"The messaging service website 320 may be accessed by a user when the messaging URL 216 is loaded by a web browser.",
"The messaging service 160 may also include message data 310.The message data 310 may include accounts 312.The accounts 312 may include messages, contact lists, statuses, and other message related data indexed to an account of a user.",
"An account 312 may be identified by a user name, a social network profile name, a mobile telephone number, an email address, a network address of a computing device, or any other identifier that specifically identifies one user among many.",
"FIG.",
"4 illustrates an embodiment of a plurality of servers implementing various functions of a messaging system 400.It will be appreciated that different distributions of work and functions may be used in various embodiments of a messaging system 400.The messaging system 400 may comprise the messaging web access system 100 with the operations of the messaging web access system 100 comprising a portion of the overall operations of the messaging system 400.The messaging system 400 may comprise a domain name front end 410.The domain name front end 410 may be assigned one or more domain names associated with the messaging system 400 in a domain name system (DNS).",
"The domain name front end 410 may receive incoming connections and distribute the connections to servers providing various messaging services.",
"The messaging system 400 may comprise one or more chat servers 415.The chat servers 415 may comprise front-end servers for receiving and transmitting user-to-user messaging updates such as chat messages.",
"Incoming connections may be assigned to the chat servers 415 by the domain name front end 410 based on workload balancing.",
"The messaging system 400 may comprise backend servers 430.The backend servers 430 may perform specialized tasks in the support of the chat operations of the front-end chat servers 415.A plurality of different types of backend servers 430 may be used.",
"It will be appreciated that the assignment of types of tasks to different backend serves 430 may vary in different embodiments.",
"In some embodiments some of the back-end services provided by dedicated servers may be combined onto a single server or a set of servers each performing multiple tasks divided between different servers in the embodiment described herein.",
"Similarly, in some embodiments tasks of some of dedicated back-end servers described herein may be divided between different servers of different server groups.",
"The messaging system 400 may comprise one or more offline storage servers 431.The one or more offline storage servers 431 may store messaging content for currently-offline messaging endpoints in hold for when the messaging endpoints reconnect.",
"The messaging system 400 may comprise one or more sessions servers 432.The one or more session servers 432 may maintain session state of connected messaging endpoints.",
"The one or more session servers 432 may generate, store, and send session identifiers to messaging endpoints.",
"The messaging system 400 may comprise one or more presence servers 433.The one or more presence servers 433 may maintain presence information for the messaging system 400.Presence information may correspond to user-specific information indicating whether or not a given user has an online messaging endpoint and is available for chatting, has an online messaging endpoint but is currently away from it, does not have an online messaging endpoint, and any other presence state.",
"The messaging system 400 may comprise one or more push storage servers 434.The one or more push storage servers 434 may cache push requests and transmit the push requests to messaging endpoints.",
"Push requests may be used to wake messaging endpoints, to notify messaging endpoints that a messaging update is available, and to otherwise perform server-side-driven interactions with messaging endpoints.",
"The messaging system 400 may comprise one or more group servers 435.The one or more group servers 435 may maintain lists of groups, add users to groups, remove users from groups, and perform the reception, caching, and forwarding of group chat messages.",
"The messaging system 400 may comprise one or more block list servers 436.The one or more block list servers 436 may maintain user-specific block lists, the user-specific incoming-block lists indicating for each user the one or more other users that are forbidden from transmitting messages to that user.",
"Alternatively or additionally, the one or more block list servers 436 may maintain user-specific outgoing-block lists indicating for each user the one or more other users that that user is forbidden from transmitting messages to.",
"It will be appreciated that incoming-block lists and outgoing-block lists may be stored in combination in, for example, a database, with the incoming-block lists and outgoing-block lists representing different views of a same repository of block information.",
"The messaging system 400 may comprise one or more last seen information servers 437.The one or more last seen information servers 437 may receive, store, and maintain information indicating the last seen location, status, messaging endpoint, and other elements of a user's last seen connection to the messaging system 400.The messaging system 400 may comprise one or more key servers 438.The one or more key servers may host public keys for public/private key encrypted communication.",
"The messaging system 400 may comprise one or more profile photo servers 439.The one or more profile photo servers 439 may store and make available for retrieval profile photos for the plurality of users of the messaging system 400.The messaging system 400 may comprise one or more spam logging servers 440.The one or more spam logging servers 440 may log known and suspected spam (e.g., unwanted messages, particularly those of a promotional nature).",
"The one or more spam logging servers 440 may be operative to analyze messages to determine whether they are spam and to perform punitive measures, in some embodiments, against suspected spammers (users that send spam messages).",
"The messaging system 400 may comprise one or more statistics servers 441.The one or more statistics servers may compile and store statistics information related to the operation of the messaging system 400 and the behavior of the users of the messaging system 400.The messaging system 400 may comprise one or more web servers 442.The one or more web servers 442 may engage in hypertext transport protocol (HTTP) and hypertext transport protocol secure (HTTPS) connections with web browsers.",
"The one or more web servers 442 may, in some embodiments, host the SNS 210 and/or the messaging service 160 as part of the operation of the messaging web access system 100.The messaging system 400 may comprise one or more chat activity monitoring servers 443.The one or more chat activity monitoring servers 443 may monitor the chats of users to determine unauthorized or discouraged behavior by the users of the messaging system 400.The one or more chat activity monitoring servers 443 may work in cooperation with the spam logging servers 440 and block list servers 436, with the one or more chat activity monitoring servers 443 identifying spam or other discouraged behavior and providing spam information to the spam logging servers 440 and blocking information, where appropriate to the block list servers 436.The messaging system 400 may comprise one or more sync servers 444.The one or more sync servers 444 may sync the messaging system 440 with contact information from a messaging endpoint, such as an address book on a mobile phone, to determine contacts for a user in the messaging system 400.The messaging system 400 may comprise one or more multimedia servers 445.The one or more multimedia servers may store multimedia (e.g., images, video, audio) in transit between messaging endpoints, multimedia cached for offline endpoints, and may perform transcoding of multimedia.",
"The messaging system 400 may comprise one or more payment servers 446.The one or more payment servers 446 may process payments from users.",
"The one or more payment servers 446 may connect to external third-party servers for the performance of payments.",
"The messaging system 400 may comprise one or more registration servers 447.The one or more registration servers 447 may register new users of the messaging system 400.The messaging system 400 may comprise one or more voice relay servers 448.The one or more voice relay servers 448 may relay voice-over-internet-protocol (VoIP) voice communication between messaging endpoints for the performance of VoIP calls.",
"FIG.",
"5 illustrates an embodiment of a message flow 500 for the system 100.The message flow 500 may represent messages communicated among the components of system 100.As used in FIG.",
"5, a “message” may include data and/or instructions communicated from one component to another, as well as internal functions within a component, and is distinct from the chat messages sent from a sender to a recipient.",
"In particular, the message flow 500 may occur among the remote web browser 190, the messaging service website 320, the social network service 210 and the messaging service 160.In message flow 500, time flows from the top of the diagram toward the bottom.",
"Message flow 500 may represent messages communicated among the components when a user tries to access messages at the messaging service 160 from the messaging service website 320 and where the user has an account with the SNS 210.The message flow 500 begins when the web browser 190 requests to load the page at the messaging service website 320 using the messaging service URL 216, in message 502.The message 502 may include a session identifier (ID).",
"The session ID indicates that the user has an open session with the SNS 210 at the web browser 190.An “open” session means that the user has used the web browser 190 to log into the SNS 210 and has not logged out of the SNS 210, and that an expiration period has not passed.",
"The user may or may not be accessing or viewing the SNS 210 in a web browser window at the time of message 502.The message flow 500 continues when the messaging service website 320 requests user information from the SNS 210 in message 504.The message 504 may include the session ID received from the web browser 190.In an embodiment, the presence of the session ID in the message 502 may cause the messaging service website 320 to request the user information from the SNS 210 automatically.",
"The message flow 500 continues when the SNS 210 retrieves the requested user information in message 506.For example, the session ID may be linked to or otherwise identify a particular user of the SNS 210.The retrieved user information may include, for example, a user name, a profile name (if different from the user name), a profile photograph or other components of the user's social network identity.",
"The message flow 500 continues when the SNS 210 transmits the requested user information back to the messaging service website 320 in message 508.The message 508 may include a text element that contains the user or profile name, and may include an image element that contains a copy of the profile photograph.",
"In another embodiment, the message 508 may include a link or a reference to the user information elements such that the messaging service website 320 can retrieve the elements.",
"The message flow 500 continues when messaging service website 320 presents a user interface (UI) that shows the received user information in message 510.For example, the user interface may present an option to log into the messaging service 160 using the social network user information.",
"The UI may display the user or profile name and the profile photograph, or any other user information, along with a selectable login UI element.",
"The message flow 500 continues when the user issues a control directive to the web browser 190 that selects the selectable login UI element in message 512.The message 512 indicates that the user wishes to use their existing SNS session to access their messaging data.",
"The message flow 500 continues when the web browser 190 sends a login request to the messaging service website 320 in message 514, in response to the control directive in message 512.The message flow 500 continues when the messaging service website 320 requests message data for the user from the messaging service 160 in message 516, in response to receiving the login request in message 512.The message 516 may include information to identify the user's message account, such as the user name or the session ID.",
"The message flow 500 continues when the messaging service 160 retrieves the message data for the user in message 518.The retrieved message data may include some or all of the stored messages for the user, including sent and received messages, and read and unread messages.",
"The retrieved message data may also include unsent messages drafts, group conversation messages, message status updates, and other updates to the status of a messaging conversation.",
"The message flow 500 continues when the messaging service 160 transmits the retrieved message data to the messaging service website 320 in message 520.The message 520 may include actual message content, and/or links or references to stored message content and data.",
"The message flow 500 continues when the messaging service website 320 renders the message data in a message graphical user interface, in message 522.The messaging service website 320 may present one or more pages 322 that allow the user to view one or more of their chat messages, conversations, contact presence, and/or new message composition UI elements.",
"FIG.",
"6 illustrates an embodiment of a message flow 600 for the system 100.The message flow 600 may represent messages communicated among the components of system 100.As used in FIG.",
"6, a “message” may include data and/or instructions communicated from one component to another, as well as internal functions within a component, and is distinct from the chat messages sent from a sender to a recipient.",
"In particular, the message flow 600 may occur among the remote web browser 190, the messaging service website 320, the messaging service 160, and a mobile device 120.In message flow 600, time flows from the top of the diagram toward the bottom.",
"Message flow 600 may represent messages communicated among the components when a user tries to access messages at the messaging service 160 from the messaging service website 320 and where the user does not have an account with the SNS 210.The message flow 600 begins when the web browser 190 requests to load the page at the messaging service website URL 216, in message 602.The message 602 may include a user identifier.",
"The user identifier may be a user name, a telephone number corresponding to the mobile device 120, a network address corresponding to the mobile device 120, an email address, or other means for identifying a user message account.",
"The message flow 600 continues when the messaging service website 320 requests an access code for the user identifier from the messaging service 160, in message 604.The message 604 may include the user identifier provided by the user in the message 602.The message flow 600 continues when the messaging service 160 generates an access code in message 606.The access code may be, for example, an alphanumeric text sequence, a machine-readable optical pattern, a sound, or any other data structure that can be output from the website 216 and captured by a second device, such as the mobile device 120.In another embodiment, the access code may be generated by the messaging service website 320 and sent to the messaging service 160.The message flow 600 continues when the messaging service 160 transmits the access code to the messaging service website 320 in message 608.The message flow 600 continues when the messaging service website 320 presents the access code on a web page to the user, in message 610.If the access code is visual, it may be displayed on the web page.",
"If the access code is audible, a playback UI element may be presented so that the user can cause the access code to be played through a speaker.",
"The message flow 600 may continue when the user enters the access code from the web page into their mobile device 120, in message 612.For example, the user may use a keyboard component to type in an alphanumeric string.",
"The user may speak the alphanumeric characters and the mobile device 120 may use a speech-to-text converter to convert the spoken characters to text.",
"The user may use a camera on the mobile device 120 to scan an optical pattern, or to photograph the access code.",
"The user may record an audio access code with a microphone on the mobile device 120.The embodiments are not limited to these examples.",
"The message flow 600 continues when the mobile device 120 sends the entered access code to the messaging service 160 in message 614.In some embodiments, the mobile device 120 may convert the format of the entered access code to a format expected by the messaging service 160 prior to sending the message 614.For example, an analog audio recording may be digitized, or the format of the access code may be hashed.",
"The message flow 600 continues when the messaging service 160 compares the access code generated in message 606 with the access code received in message 614, in message 616.If the two access codes match, or match within a tolerance, the messaging service 160 may have confidence that the user attempting to log in via the messaging service website 320 is the same user associated with the mobile device 120 and an account associated with the user identifier and the mobile device 120.The message flow 600 continues, assuming that the two access codes were matched, when the messaging service 160 retrieves the message data for the user, in message 618.The retrieved message data may include some or all of the stored messages for the user, including sent and received messages, and read and unread messages.",
"The retrieved message data may also include unsent messages drafts, group conversation messages, message status updates, and other updates to the status of a messaging conversation.",
"The message flow 600 continues when the messaging service 160 transmits the retrieved message data to the messaging service website 320 in message 620.The message 620 may include actual message content, and/or links or references to stored message content and data.",
"The message flow 600 continues when the messaging service website 320 renders the message data in a message graphical user interface, in message 622.The messaging service website 320 may present one or more pages 322 that allow the user to view one or more of their chat messages, conversations, contact presence, and/or new message composition UI elements.",
"FIG.",
"7 illustrates an embodiment of a message flow 700 for the system 100.The message flow 700 may represent messages communicated among the components of system 100.As used in FIG.",
"7, a “message” may include data and/or instructions communicated from one component to another, as well as internal functions within a component, and is distinct from the chat messages sent from a sender to a recipient.",
"In particular, the message flow 700 may occur among the remote web browser 190, the messaging service website 320, the messaging service 160, and a mobile device 120.In message flow 700, time flows from the top of the diagram toward the bottom.",
"Message flow 700 may represent messages communicated among the components when a user tries to access messages at the messaging service 160 from the messaging service website 320 and where the user does not have an account with the SNS 210.The message flow 700 begins similarly to the message flow 600, and messages 702, 704 and 706 are analogous to messages 602, 604, and 606.The message flow 700 differs from the message flow 600 once the access code is generated in message 706.The message flow 700 continues when the messaging service 160 sends the access code to the mobile device 120 associated with the user identifier, in message 708.The access code may be, for example, sent directly to the message application client 230, or may be sent as an email message, a text message, a voice mail message, and so forth.",
"At any point after sending message 702, the messaging service website 320 may present a user interface for access code entry in message 710.For example, the messaging service website 320 may provide a text entry field for accepting a typed alphanumeric string, or may provide a UI element that causes an image or a sound file to be uploaded.",
"The message flow 700 continues when the mobile device 120 presents the received access code in a user interface, in message 712.For example, the access code may be displayed on a lock screen or a home screen of the mobile device, or within the message application client 230.The message flow 700 continues when the user enters the access code presented on the mobile device 120 into the messaging service website 320 in message 714.For example, the user may type an alphanumeric code into a text entry field on the web page, or may hold an image or optical pattern up to a camera connected to the computer device 180.The message 700 continues when the messaging service website 320 sends a request for message data for the user to the messaging service 160, in message 716.The message 716 may include the access code entered by the user at the website.",
"Messages 718, 720, 722, and 724 may be the same as the messages 616, 618, 620, and 622, respectively.",
"Namely, the two access codes may be compared, and when they match, the message data for the user may be sent to the website and presented in a user interface.",
"Included herein is a set of flow charts representative of exemplary methodologies for performing novel aspects of the disclosed architecture.",
"While, for purposes of simplicity of explanation, the one or more methodologies shown herein, for example, in the form of a flow chart or flow diagram, are shown and described as a series of acts, it is to be understood and appreciated that the methodologies are not limited by the order of acts, as some acts may, in accordance therewith, occur in a different order and/or concurrently with other acts from that shown and described herein.",
"For example, those skilled in the art will understand and appreciate that a methodology could alternatively be represented as a series of interrelated states or events, such as in a state diagram.",
"Moreover, not all acts illustrated in a methodology may be required for a novel implementation.",
"FIG.",
"8 illustrates one embodiment of a logic flow 800.The logic flow 800 may be representative of some or all of the operations executed by one or more embodiments described herein.",
"In particular, the logic flow 800 may illustrate operations performed when a user wants to access the messaging service 160 at the messaging URL 216 and already has an open session with the social network service 210.In the illustrated embodiment shown in FIG.",
"8, the logic flow 800 may receive a request to load a web page at a messaging service website from a web browser executing on a client device in block 802.For example, the remote web browser 190 may request to load the messaging service website 320 using the messaging service URL 216.The request may include a first session identifier for an open session between the web browser 190 and a social network service 210.The logic flow 800 may send a second request to a server of the social network service for user information associated with the first session identifier, and receive the user information in block 804.For example, the messaging service website 320 may request the user information from the social network service 210.The request may include the first session identifier.",
"The logic flow 800 may render a login graphical UI dialog on the web page, comprising the user information and a selectable login UI element in block 806.For example, the messaging service website 320 may receive user information including a profile picture and a user name associated with the user's account at the social network service 210.The messaging service website 320 may provide the user information to the web browser 190 for rendering a login UI dialog.",
"The login UI dialog may show the user information, and a selectable UI element, e.g.",
"a button, a menu selection, a checkbox, and so forth.",
"In some embodiments, the selectable UI element may include some or all of the user information.",
"The logic flow 800 may receive a control directive on the selectable login UI element in block 808.For example, the user may use an input device to select the login UI element.",
"The control directive may signify that the user wishes to login to the messaging service 160 using their social network service 210 account information.",
"The logic flow 800 may request and receive message data associated with the user from a messaging service in response to receiving the control directive in block 810.For example, the messaging service website 320 may request the message data 310 from the messaging service 160.The request may include the first session identifier and/or some or all of the user information, or other means to identify the particular account 312 for which to retrieve message data 310.In an embodiment, the messaging service website 320 may request the message data 310 via the social network service 210, where the social network service 210 identifies from which account 312 to retrieve message data.",
"The logic flow 800 may transmit the message data to the client device for presentation on the web browser in block 812.For example, the messaging service 160 may look up the message data 310 for the identified user, and may transmit the message data 310 to the messaging service website 320, which may cause the message data 310 to be presented in the web browser 190.The message data 310 may include sent and received messages for the user, both read and unread, as well as draft messages, attached files and links, status updates and any other information needed to render a messaging interface on the web browser 190.FIG.",
"9 illustrates one embodiment of a logic flow 900.The logic flow 900 may be representative of some or all of the operations executed by one or more embodiments described herein.",
"In particular, the logic flow 900 may illustrate operations performed when a user wants to access the messaging service 160 at the messaging URL 216 and without an open session with the social network service 210.In the illustrated embodiment shown in FIG.",
"9, the logic flow 900 may receive a request to load a web page at a messaging service website from a web browser executing on a client device, the request including a user identifier in block 902.For example, the remote web browser 190 may present the page of the messaging service website 320 corresponding to the messaging service URL 216.The page may include an entry field where the user can enter a user identifier and select a UI element to request logging into the messaging service 160.The logging in request may include the user identifier, such as a mobile telephone number, a network address, an email address, or other user identifier associated with a user account 310 at the messaging service 160.The logic flow 900 may generate a first access code and present the first access code to the user on a messaging service website at the remote web browser in block 904.For example, the access code generator 304 may generate an access code comprising an alphanumeric sequence, a machine-readable optical pattern, an audio signal or a visual image.",
"The access code may be presented on the web page of the messaging service website 320.If the access code is a visual access code, the access code may be displayed on the web page directly.",
"If the access code is an audio signal, a UI element may be presented that, when selected by a control directive, outputs the audio signal via a speaker on the computer device 180.In addition to presenting the access code, the web page may also prompt the user to enter the access code into their mobile device 120.The logic flow 900 may receive a second access code from a second device associated with the user identifier in block 906.For example, the messaging service 160 may receive an access code entered into the user's mobile device 120 and sent to the messaging service 160 from the mobile device 120.The second access code may be received, for example, from the message application client 230, as an email message, as a text message, and so forth.",
"The logic flow 900 may compare the second access code to the first access code, and lookup an account associated with the user identifier and the second device in block 908.For example, the authenticator 306 may compare the two access codes to determine whether they match.",
"In some embodiments, an exact match may be needed for authentication.",
"In other embodiments, a match within a tolerance, e.g.",
"a 98% or 99% match, may be sufficient, to allow for data loss and corruption.",
"If the two access codes match, the authenticator 306 may then identify an account 312 associated with the user identifier and/or the mobile device 120.The logic flow 900 may retrieve message data for an account associated with the user identifier in response the second access code matching the first access code in block 910.For example, the messaging component 302 may use the identified account 312 to retrieve the message data 310 for the user.",
"The logic flow 900 may transmit the message data to the remote web browser for presentation in block 912.For example, the messaging service 160 may transmit the message data 310 to the messaging service website 320, which may cause the message data 310 to be presented in the web browser 190.The message data 310 may include sent and received messages for the user, both read and unread, as well as draft messages, attached files and links, status updates and any other information needed to render a messaging interface on the web browser 190.FIG.",
"10 illustrates one embodiment of a logic flow 1000.The logic flow 1000 may be representative of some or all of the operations executed by one or more embodiments described herein.",
"In particular, the logic flow 1000 may illustrate other operations performed when a user wants to access the messaging service 160 at the messaging URL 216 and without an open session with the social network service 210.In the illustrated embodiment shown in FIG.",
"10, the logic flow 1000 may receive a request to load a web page at a messaging service website from a web browser executing on a client device, the request including a user identifier, in block 1002.For example, as in block 902, the remote web browser 190 may present the page of the messaging service website 320 corresponding to the messaging service URL 216.The page may include an entry field where the user can enter a user identifier and select a UI element to request logging into the messaging service 160.The logging in request may include the user identifier, such as a mobile telephone number, a network address, an email address, or other user identifier associated with a user account 310 at the messaging service 160.The logic flow 1000 may generate a first access code and transmit the first access code to a messaging application installed on a mobile device associated with the user identifier in block 1004.The access code may be generated as described with respect to block 904 in logic flow 900.The access code may, however, be transmitted to a mobile device 120 associated with the user identifier rather than presenting the access code on the browser.",
"The first access code may be transmitted to the mobile device 120, for example, to the message application client 230, as an email message, as a text message, and so forth.",
"The mobile device 120 may prompt the user to enter the first access code into a field on the web page at the messaging service website 320.The logic flow 1000 may receive a second access code from the remote web browser in block 1006.For example, the user may have entered the first access code into a field in a web page for the messaging service website 320.The user may, for example, have typed in an alphanumeric sequence, or used a camera in communication with the computer device 180 to capture an image or scan a machine-readable optical pattern.",
"The messaging service website 320 may send the entered access code to the messaging application 218.The logic flow 1000 may compare the second access code to the first access code in block 1008.For example, as in block 908, the authenticator 306 may compare the two access codes to determine whether they match.",
"If the two access codes match, the authenticator 306 may then identify an account 312 associated with the user identifier and/or the mobile device 120.The logic flow 1000 may retrieve message data for an account associated with the user identifier when the second access code matches the first access code in block 1010.For example, the messaging component 302 may use the identified account 312 to retrieve the message data 310 for the user.",
"The logic flow 1000 may transmit the message data to the remote web browser for presentation in block 1012.For example, as in block 912, the messaging service 160 may transmit the message data 310 to the messaging service website 320, which may cause the message data 310 to be presented in the web browser 190.FIG.",
"11 illustrates a block diagram of a centralized system 1100.The centralized system 1100 may implement some or all of the structure and/or operations for the messaging web access system 100 in a single computing entity, such as entirely within a single device 1120.The device 1120 may comprise any electronic device capable of receiving, processing, and sending information for the system 100.Examples of an electronic device may include without limitation an ultra-mobile device, a mobile device, a personal digital assistant (PDA), a mobile computing device, a smart phone, a telephone, a digital telephone, a cellular telephone, eBook readers, a handset, a one-way pager, a two-way pager, a messaging device, a computer, a personal computer (PC), a desktop computer, a laptop computer, a notebook computer, a netbook computer, a handheld computer, a tablet computer, a server, a server array or server farm, a web server, a network server, an Internet server, a work station, a mini-computer, a main frame computer, a supercomputer, a network appliance, a web appliance, a distributed computing system, multiprocessor systems, processor-based systems, consumer electronics, programmable consumer electronics, game devices, television, digital television, set top box, wireless access point, base station, subscriber station, mobile subscriber center, radio network controller, router, hub, gateway, bridge, switch, machine, or combination thereof.",
"The embodiments are not limited in this context.",
"The device 1120 may execute processing operations or logic for the system 100 using a processing component 1130.The processing component 1130 may comprise various hardware elements, software elements, or a combination of both.",
"Examples of hardware elements may include devices, logic devices, components, processors, microprocessors, circuits, processor circuits, circuit elements (e.g., transistors, resistors, capacitors, inductors, and so forth), integrated circuits, application specific integrated circuits (ASIC), programmable logic devices (PLD), digital signal processors (DSP), field programmable gate array (FPGA), memory units, logic gates, registers, semiconductor device, chips, microchips, chip sets, and so forth.",
"Examples of software elements may include software components, programs, applications, computer programs, application programs, system programs, software development programs, machine programs, operating system software, middleware, firmware, software modules, routines, subroutines, functions, methods, procedures, software interfaces, application program interfaces (API), instruction sets, computing code, computer code, code segments, computer code segments, words, values, symbols, or any combination thereof.",
"Determining whether an embodiment is implemented using hardware elements and/or software elements may vary in accordance with any number of factors, such as desired computational rate, power levels, heat tolerances, processing cycle budget, input data rates, output data rates, memory resources, data bus speeds and other design or performance constraints, as desired for a given implementation.",
"The device 1120 may execute communications operations or logic for the system 100 using communications component 1140.The communications component 1140 may implement any well-known communications techniques and protocols, such as techniques suitable for use with packet-switched networks (e.g., public networks such as the Internet, private networks such as an enterprise intranet, and so forth), circuit-switched networks (e.g., the public switched telephone network), or a combination of packet-switched networks and circuit-switched networks (with suitable gateways and translators).",
"The communications component 1140 may include various types of standard communication elements, such as one or more communications interfaces, network interfaces, network interface cards (NIC), radios, wireless transmitters/receivers (transceivers), wired and/or wireless communication media, physical connectors, and so forth.",
"By way of example, and not limitation, communication media 1112, 1142 include wired communications media and wireless communications media.",
"Examples of wired communications media may include a wire, cable, metal leads, printed circuit boards (PCB), backplanes, switch fabrics, semiconductor material, twisted-pair wire, co-axial cable, fiber optics, a propagated signal, and so forth.",
"Examples of wireless communications media may include acoustic, radio-frequency (RF) spectrum, infrared and other wireless media.",
"The device 1120 may communicate with other devices 1110, 1150 over a communications media 1112, 1142, respectively, using communications signals 1114, 1144, respectively, via the communications component 1140.The devices 1110, 1150 may be internal or external to the device 1120 as desired for a given implementation.",
"The device 1110 may comprise a messaging endpoint, such as message application client 230 on mobile device 120.The device 1150 may comprise a second messaging endpoint, such as remote web browser 190 on personal computer device 180.The signals 1114 and 1144 may jointly carry the encrypted connection between the message application client 230 and the remote web browser 190.FIG.",
"12 illustrates a block diagram of a distributed system 1200.The distributed system 1200 may distribute portions of the structure and/or operations for the system 100 across multiple computing entities.",
"Examples of distributed system 1200 may include without limitation a client-server architecture, a 3-tier architecture, an N-tier architecture, a tightly-coupled or clustered architecture, a peer-to-peer architecture, a master-slave architecture, a shared database architecture, and other types of distributed systems.",
"The embodiments are not limited in this context.",
"The distributed system 1200 may comprise a client device 1210 and a server device 1250.In general, the client device 1210 and the server device 1250 may be the same or similar to the client device 1120 as described with reference to FIG.",
"11.For instance, the client system 1210 and the server system 1250 may each comprise a processing component 1230 and a communications component 1240 which are the same or similar to the processing component 1130 and the communications component 1140, respectively, as described with reference to FIG.",
"11.In another example, the devices 1210, 1250 may communicate over a communications media 1212 using communications signals 1214 via the communications components 1240.The client device 1210 may comprise or employ one or more client programs that operate to perform various methodologies in accordance with the described embodiments.",
"In one embodiment, for example, the client device 1210 may implement the message application client 230.The server device 1250 may comprise or employ one or more server programs that operate to perform various methodologies in accordance with the described embodiments.",
"In one embodiment, for example, the server device 1250 may implement the messaging service 160.FIG.",
"13 illustrates an embodiment of an exemplary computing architecture 1300 suitable for implementing various embodiments as previously described.",
"In one embodiment, the computing architecture 1300 may comprise or be implemented as part of an electronic device.",
"Examples of an electronic device may include those described with reference to FIG.",
"1, among others.",
"The embodiments are not limited in this context.",
"As used in this application, the terms “system” and “component” are intended to refer to a computer-related entity, either hardware, a combination of hardware and software, software, or software in execution, examples of which are provided by the exemplary computing architecture 1300.For example, a component can be, but is not limited to being, a process running on a processor, a processor, a hard disk drive, multiple storage drives (of optical and/or magnetic storage medium), an object, an executable, a thread of execution, a program, and/or a computer.",
"By way of illustration, both an application running on a server and the server can be a component.",
"One or more components can reside within a process and/or thread of execution, and a component can be localized on one computer and/or distributed between two or more computers.",
"Further, components may be communicatively coupled to each other by various types of communications media to coordinate operations.",
"The coordination may involve the uni-directional or bi-directional exchange of information.",
"For instance, the components may communicate information in the form of signals communicated over the communications media.",
"The information can be implemented as signals allocated to various signal lines.",
"In such allocations, each message is a signal.",
"Further embodiments, however, may alternatively employ data messages.",
"Such data messages may be sent across various connections.",
"Exemplary connections include parallel interfaces, serial interfaces, and bus interfaces.",
"The computing architecture 1300 includes various common computing elements, such as one or more processors, multi-core processors, co-processors, memory units, chipsets, controllers, peripherals, interfaces, oscillators, timing devices, video cards, audio cards, multimedia input/output (I/O) components, power supplies, and so forth.",
"The embodiments, however, are not limited to implementation by the computing architecture 1300.As shown in FIG.",
"13, the computing architecture 1300 comprises a processing unit 1304, a system memory 1306 and a system bus 1308.The processing unit 1304 can be any of various commercially available processors, including without limitation an AMD® Athlon®, Duron® and Opteron® processors; ARM® application, embedded and secure processors; IBM® and Motorola® DragonBall® and PowerPC® processors; IBM and Sony® Cell processors; Intel® Celeron®, Core (2) Duo®, Itanium®, Pentium®, Xeon®, and XScale® processors; and similar processors.",
"Dual microprocessors, multi-core processors, and other multi-processor architectures may also be employed as the processing unit 1304.The system bus 1308 provides an interface for system components including, but not limited to, the system memory 1306 to the processing unit 1304.The system bus 1308 can be any of several types of bus structure that may further interconnect to a memory bus (with or without a memory controller), a peripheral bus, and a local bus using any of a variety of commercially available bus architectures.",
"Interface adapters may connect to the system bus 1308 via a slot architecture.",
"Example slot architectures may include without limitation Accelerated Graphics Port (AGP), Card Bus, (Extended) Industry Standard Architecture ((E)ISA), Micro Channel Architecture (MCA), NuBus, Peripheral Component Interconnect (Extended) (PCI(X)), PCI Express, Personal Computer Memory Card International Association (PCMCIA), and the like.",
"The computing architecture 1300 may comprise or implement various articles of manufacture.",
"An article of manufacture may comprise a computer-readable storage medium to store logic.",
"Examples of a computer-readable storage medium may include any tangible media capable of storing electronic data, including volatile memory or non-volatile memory, removable or non-removable memory, erasable or non-erasable memory, writeable or re-writeable memory, and so forth.",
"Examples of logic may include executable computer program instructions implemented using any suitable type of code, such as source code, compiled code, interpreted code, executable code, static code, dynamic code, object-oriented code, visual code, and the like.",
"Embodiments may also be at least partly implemented as instructions contained in or on a non-transitory computer-readable medium, which may be read and executed by one or more processors to enable performance of the operations described herein.",
"The system memory 1306 may include various types of computer-readable storage media in the form of one or more higher speed memory units, such as read-only memory (ROM), random-access memory (RAM), dynamic RAM (DRAM), Double-Data-Rate DRAM (DDRAM), synchronous DRAM (SDRAM), static RAM (SRAM), programmable ROM (PROM), erasable programmable ROM (EPROM), electrically erasable programmable ROM (EEPROM), flash memory, polymer memory such as ferroelectric polymer memory, ovonic memory, phase change or ferroelectric memory, silicon-oxide-nitride-oxide-silicon (SONOS) memory, magnetic or optical cards, an array of devices such as Redundant Array of Independent Disks (RAID) drives, solid state memory devices (e.g., USB memory, solid state drives (SSD) and any other type of storage media suitable for storing information.",
"In the illustrated embodiment shown in FIG.",
"13, the system memory 1306 can include non-volatile memory 1310 and/or volatile memory 1312.A basic input/output system (BIOS) can be stored in the non-volatile memory 1310.The computer 1302 may include various types of computer-readable storage media in the form of one or more lower speed memory units, including an internal (or external) hard disk drive (HDD) 1314, a magnetic floppy disk drive (FDD) 1316 to read from or write to a removable magnetic disk 1318, and an optical disk drive 1320 to read from or write to a removable optical disk 1322 (e.g., a CD-ROM or DVD).",
"The HDD 1314, FDD 1316 and optical disk drive 1320 can be connected to the system bus 1308 by a HDD interface 1324, an FDD interface 1326 and an optical drive interface 1328, respectively.",
"The HDD interface 1324 for external drive implementations can include at least one or both of Universal Serial Bus (USB) and IEEE 1394 interface technologies.",
"The drives and associated computer-readable media provide volatile and/or nonvolatile storage of data, data structures, computer-executable instructions, and so forth.",
"For example, a number of program modules can be stored in the drives and memory units 1310, 1312, including an operating system 1330, one or more application programs 1332, other program modules 1334, and program data 1336.In one embodiment, the one or more application programs 1332, other program modules 1334, and program data 1336 can include, for example, the various applications and/or components of the messaging web access system 100.A user can enter commands and information into the computer 1302 through one or more wire/wireless input devices, for example, a keyboard 1338 and a pointing device, such as a mouse 1340.Other input devices may include microphones, infra-red (IR) remote controls, radio-frequency (RF) remote controls, game pads, stylus pens, card readers, dongles, finger print readers, gloves, graphics tablets, joysticks, keyboards, retina readers, touch screens (e.g., capacitive, resistive, etc.",
"), trackballs, trackpads, sensors, styluses, and the like.",
"These and other input devices are often connected to the processing unit 1304 through an input device interface 1342 that is coupled to the system bus 1308, but can be connected by other interfaces such as a parallel port, IEEE 1394 serial port, a game port, a USB port, an IR interface, and so forth.",
"A monitor 1344 or other type of display device is also connected to the system bus 1308 via an interface, such as a video adaptor 1346.The monitor 1344 may be internal or external to the computer 1302.In addition to the monitor 1344, a computer typically includes other peripheral output devices, such as speakers, printers, and so forth.",
"The computer 1302 may operate in a networked environment using logical connections via wire and/or wireless communications to one or more remote computers, such as a remote computer 1348.The remote computer 1348 can be a workstation, a server computer, a router, a personal computer, portable computer, microprocessor-based entertainment appliance, a peer device or other common network node, and typically includes many or all of the elements described relative to the computer 1302, although, for purposes of brevity, only a memory/storage device 1350 is illustrated.",
"The logical connections depicted include wire/wireless connectivity to a local area network (LAN) 1352 and/or larger networks, for example, a wide area network (WAN) 1354.Such LAN and WAN networking environments are commonplace in offices and companies, and facilitate enterprise-wide computer networks, such as intranets, all of which may connect to a global communications network, for example, the Internet.",
"When used in a LAN networking environment, the computer 1302 is connected to the LAN 1352 through a wire and/or wireless communication network interface or adaptor 1356.The adaptor 1356 can facilitate wire and/or wireless communications to the LAN 1352, which may also include a wireless access point disposed thereon for communicating with the wireless functionality of the adaptor 1356.When used in a WAN networking environment, the computer 1302 can include a modem 1358, or is connected to a communications server on the WAN 1354, or has other means for establishing communications over the WAN 1354, such as by way of the Internet.",
"The modem 1358, which can be internal or external and a wire and/or wireless device, connects to the system bus 1308 via the input device interface 1342.In a networked environment, program modules depicted relative to the computer 1302, or portions thereof, can be stored in the remote memory/storage device 1350.It will be appreciated that the network connections shown are exemplary and other means of establishing a communications link between the computers can be used.",
"The computer 1302 is operable to communicate with wire and wireless devices or entities using the IEEE 802 family of standards, such as wireless devices operatively disposed in wireless communication (e.g., IEEE 802.5 over-the-air modulation techniques).",
"This includes at least Wi-Fi (or Wireless Fidelity), WiMax, and Bluetooth™ wireless technologies, among others.",
"Thus, the communication can be a predefined structure as with a conventional network or simply an ad hoc communication between at least two devices.",
"Wi-Fi networks use radio technologies called IEEE 802.5x (a, b, g, n, etc.)",
"to provide secure, reliable, fast wireless connectivity.",
"A Wi-Fi network can be used to connect computers to each other, to the Internet, and to wire networks (which use IEEE 802.3-related media and functions).",
"FIG.",
"14 illustrates a block diagram of an exemplary communications architecture 1400 suitable for implementing various embodiments as previously described.",
"The communications architecture 1400 includes various common communications elements, such as a transmitter, receiver, transceiver, radio, network interface, baseband processor, antenna, amplifiers, filters, power supplies, and so forth.",
"The embodiments, however, are not limited to implementation by the communications architecture 1400.As shown in FIG.",
"14, the communications architecture 1400 comprises includes one or more clients 1402 and servers 1404.The clients 1402 may implement a client device such as the mobile device 120 or the personal computer device 180.The servers 1404 may implement a server device such as the SNS service 210 or the messaging service 160.The clients 1402 and the servers 1404 are operatively connected to one or more respective client data stores 1408 and server data stores 1410 that can be employed to store information local to the respective clients 1402 and servers 1404, such as cookies and/or associated contextual information.",
"The clients 1402 and the servers 1404 may communicate information between each other using a communication framework 1406.The communications framework 1406 may implement any well-known communications techniques and protocols.",
"The communications framework 1406 may be implemented as a packet-switched network (e.g., public networks such as the Internet, private networks such as an enterprise intranet, and so forth), a circuit-switched network (e.g., the public switched telephone network), or a combination of a packet-switched network and a circuit-switched network (with suitable gateways and translators).",
"The communications framework 1406 may implement various network interfaces arranged to accept, communicate, and connect to a communications network.",
"A network interface may be regarded as a specialized form of an input output interface.",
"Network interfaces may employ connection protocols including without limitation direct connect, Ethernet (e.g., thick, thin, twisted pair 10/100/1000 Base T, and the like), token ring, wireless network interfaces, cellular network interfaces, IEEE 802.11a-x network interfaces, IEEE 802.16 network interfaces, IEEE 802.20 network interfaces, and the like.",
"Further, multiple network interfaces may be used to engage with various communications network types.",
"For example, multiple network interfaces may be employed to allow for the communication over broadcast, multicast, and unicast networks.",
"Should processing requirements dictate a greater amount speed and capacity, distributed network controller architectures may similarly be employed to pool, load balance, and otherwise increase the communicative bandwidth required by clients 1402 and the servers 1404.A communications network may be any one and the combination of wired and/or wireless networks including without limitation a direct interconnection, a secured custom connection, a private network (e.g., an enterprise intranet), a public network (e.g., the Internet), a Personal Area Network (PAN), a Local Area Network (LAN), a Metropolitan Area Network (MAN), an Operating Missions as Nodes on the Internet (OMNI), a Wide Area Network (WAN), a wireless network, a cellular network, and other communications networks.",
"FIG.",
"15 illustrates an embodiment of a device 1500 for use in a multicarrier OFDM system, such as the messaging web access system 100.Device 1500 may implement, for example, software components 1560 as described with reference to messaging web access system 100 and/or a logic circuit 1530.The logic circuit 1530 may include physical circuits to perform operations described for the messaging web access system 100.As shown in FIG.",
"15, device 1500 may include a radio interface 1510, baseband circuitry 1520, and computing platform 1530, although embodiments are not limited to this configuration.",
"The device 1500 may implement some or all of the structure and/or operations for the messaging web access system 100 and/or logic circuit 1530 in a single computing entity, such as entirely within a single device.",
"Alternatively, the device 1500 may distribute portions of the structure and/or operations for the messaging web access system 100 and/or logic circuit 1530 across multiple computing entities using a distributed system architecture, such as a client-server architecture, a 3-tier architecture, an N-tier architecture, a tightly-coupled or clustered architecture, a peer-to-peer architecture, a master-slave architecture, a shared database architecture, and other types of distributed systems.",
"The embodiments are not limited in this context.",
"In one embodiment, radio interface 1510 may include a component or combination of components adapted for transmitting and/or receiving single carrier or multi-carrier modulated signals (e.g., including complementary code keying (CCK) and/or orthogonal frequency division multiplexing (OFDM) symbols) although the embodiments are not limited to any specific over-the-air interface or modulation scheme.",
"Radio interface 1510 may include, for example, a receiver 1512, a transmitter 1516 and/or a frequency synthesizer 1514.Radio interface 1510 may include bias controls, a crystal oscillator and/or one or more antennas 1518.In another embodiment, radio interface 1510 may use external voltage-controlled oscillators (VCOs), surface acoustic wave filters, intermediate frequency (IF) filters and/or RF filters, as desired.",
"Due to the variety of potential RF interface designs an expansive description thereof is omitted.",
"Baseband circuitry 1520 may communicate with radio interface 1510 to process receive and/or transmit signals and may include, for example, an analog-to-digital converter 1522 for down converting received signals, a digital-to-analog converter 1524 for up converting signals for transmission.",
"Further, baseband circuitry 1520 may include a baseband or physical layer (PHY) processing circuit 1556 for PHY link layer processing of respective receive/transmit signals.",
"Baseband circuitry 1520 may include, for example, a processing circuit 1528 for medium access control (MAC)/data link layer processing.",
"Baseband circuitry 1520 may include a memory controller 1532 for communicating with processing circuit 1528 and/or a computing platform 1530, for example, via one or more interfaces 1534.In some embodiments, PHY processing circuit 1526 may include a frame construction and/or detection module, in combination with additional circuitry such as a buffer memory, to construct and/or deconstruct communication frames, such as radio frames.",
"Alternatively or in addition, MAC processing circuit 1528 may share processing for certain of these functions or perform these processes independent of PHY processing circuit 1526.In some embodiments, MAC and PHY processing may be integrated into a single circuit.",
"The computing platform 1530 may provide computing functionality for the device 1500.As shown, the computing platform 1530 may include a processing component 1540.In addition to, or alternatively of, the baseband circuitry 1520, the device 1500 may execute processing operations or logic for the messaging web access system 100 and logic circuit 1530 using the processing component 1540.The processing component 1540 (and/or PHY 1526 and/or MAC 1528) may comprise various hardware elements, software elements, or a combination of both.",
"Examples of hardware elements may include devices, logic devices, components, processors, microprocessors, circuits, processor circuits, circuit elements (e.g., transistors, resistors, capacitors, inductors, and so forth), integrated circuits, application specific integrated circuits (ASIC), programmable logic devices (PLD), digital signal processors (DSP), field programmable gate array (FPGA), memory units, logic gates, registers, semiconductor device, chips, microchips, chip sets, and so forth.",
"Examples of software elements may include software components, programs, applications, computer programs, application programs, system programs, software development programs, machine programs, operating system software, middleware, firmware, software modules, routines, subroutines, functions, methods, procedures, software interfaces, application program interfaces (API), instruction sets, computing code, computer code, code segments, computer code segments, words, values, symbols, or any combination thereof.",
"Determining whether an embodiment is implemented using hardware elements and/or software elements may vary in accordance with any number of factors, such as desired computational rate, power levels, heat tolerances, processing cycle budget, input data rates, output data rates, memory resources, data bus speeds and other design or performance constraints, as desired for a given implementation.",
"The computing platform 1530 may further include other platform components 1550.Other platform components 1550 include common computing elements, such as one or more processors, multi-core processors, co-processors, memory units, chipsets, controllers, peripherals, interfaces, oscillators, timing devices, video cards, audio cards, multimedia input/output (I/O) components (e.g., digital displays), power supplies, and so forth.",
"Examples of memory units may include without limitation various types of computer readable and machine readable storage media in the form of one or more higher speed memory units, such as read-only memory (ROM), random-access memory (RAM), dynamic RAM (DRAM), Double-Data-Rate DRAM (DDRAM), synchronous DRAM (SDRAM), static RAM (SRAM), programmable ROM (PROM), erasable programmable ROM (EPROM), electrically erasable programmable ROM (EEPROM), flash memory, polymer memory such as ferroelectric polymer memory, ovonic memory, phase change or ferroelectric memory, silicon-oxide-nitride-oxide-silicon (SONOS) memory, magnetic or optical cards, an array of devices such as Redundant Array of Independent Disks (RAID) drives, solid state memory devices (e.g., USB memory, solid state drives (SSD) and any other type of storage media suitable for storing information.",
"Device 1500 may be, for example, an ultra-mobile device, a mobile device, a fixed device, a machine-to-machine (M2M) device, a personal digital assistant (PDA), a mobile computing device, a smart phone, a telephone, a digital telephone, a cellular telephone, user equipment, eBook readers, a handset, a one-way pager, a two-way pager, a messaging device, a computer, a personal computer (PC), a desktop computer, a laptop computer, a notebook computer, a netbook computer, a handheld computer, a tablet computer, a server, a server array or server farm, a web server, a network server, an Internet server, a work station, a mini-computer, a main frame computer, a supercomputer, a network appliance, a web appliance, a distributed computing system, multiprocessor systems, processor-based systems, consumer electronics, programmable consumer electronics, game devices, television, digital television, set top box, wireless access point, base station, node B, evolved node B (eNB), subscriber station, mobile subscriber center, radio network controller, router, hub, gateway, bridge, switch, machine, or combination thereof.",
"Accordingly, functions and/or specific configurations of device 1500 described herein, may be included or omitted in various embodiments of device 1500, as suitably desired.",
"In some embodiments, device 1500 may be configured to be compatible with protocols and frequencies associated one or more of the 3GPP LTE Specifications and/or IEEE 802.16 Standards for WMANs, and/or other broadband wireless networks, cited herein, although the embodiments are not limited in this respect.",
"Embodiments of device 1500 may be implemented using single input single output (SISO) architectures.",
"However, certain implementations may include multiple antennas (e.g., antennas 1518) for transmission and/or reception using adaptive antenna techniques for beamforming or spatial division multiple access (SDMA) and/or using MIMO communication techniques.",
"The components and features of device 1500 may be implemented using any combination of discrete circuitry, application specific integrated circuits (ASICs), logic gates and/or single chip architectures.",
"Further, the features of device 1500 may be implemented using microcontrollers, programmable logic arrays and/or microprocessors or any combination of the foregoing where suitably appropriate.",
"It is noted that hardware, firmware and/or software elements may be collectively or individually referred to herein as “logic” or “circuit.” It should be appreciated that the exemplary device 1500 shown in the block diagram of FIG.",
"15 may represent one functionally descriptive example of many potential implementations.",
"Accordingly, division, omission or inclusion of block functions depicted in the accompanying figures does not infer that the hardware components, circuits, software and/or elements for implementing these functions would be necessarily be divided, omitted, or included in embodiments.",
"A computer-implemented method may comprise receiving a request to load a web page at a messaging service website from a web browser executing on a client device, wherein the request includes a first session identifier for an open session between the web browser and a social network service for a user of the social network service; sending a second request to a server of the social network service for user information associated with the first session identifier; receiving the user information from the server of the social network service; rendering a login graphical user interface (UI) dialog, on the web page, the dialog comprising the user information and a selectable login UI element; receiving a control directive on the selectable login UI element; requesting message data associated with the user from a messaging service in response to receiving the control directive; receiving the requested message data; and transmitting the message data to the client device for presentation on the web browser.",
"A computer-implemented method may further comprise creating a second session identifier, wherein the second session identifier is usable by the web browser and by the messaging service to identify the user and locate message data of the user; and sending the second session identifier to the messaging service.",
"A computer-implemented method may further comprise receiving a second session identifier from the messaging service with the message data, wherein the second session identifier is usable by the web browser and by the messaging service to identify the user and locate message data of the user.",
"The second session identifier may be usable to identify the user and locate message data after the user logs out of the social network service, or until the user logs out of the messaging service A computer-implemented method may further comprise presenting a profile image of the user and a user name in the login graphical UI dialog.",
"A computer-implemented method may further comprise receiving messages sent to the user, messages sent by the user, message status updates, or other updates to the status of a messaging conversation; and presenting messages sent to or sent by the user in a message interface in the web browser.",
"A computer-implemented method may further comprise presenting a message composing user interface in the web browser to receive control directives to address a message, generate a body of a message, and send a message.",
"An apparatus may comprise a processor circuit on a mobile device; and a messaging application operative on the processor circuit to receive a request from a remote web browser executing on a first device, the request to login to the messaging application and including a user identifier.",
"The message application may comprise an access code generator to generate a first access code and to present the first access code to the user on a messaging application website at the remote web browser.",
"The messaging application may comprise an authenticator to receive a second access code from a second device associated with the user identifier, compare the second access code to the first access code, and lookup an account associated with the user identifier and the second device.",
"The messaging application may comprise a messaging component to retrieve message data for an account associated with the user identifier in response the second access code matching the first access code, and to transmit the message data to the remote web browser for presentation.",
"The apparatus may be operative to implement any of the computer-implemented methods described herein.",
"The user identifier may be a mobile telephone number, an electronic mail address, or a user name associated with a mobile telephone number.",
"The access code generator may generate an alphanumeric text sequence, a machine-readable optical pattern, an audio signal, or a visual image.",
"The messaging component may retrieve messages sent to the user, messages sent by the user, message status updates, or other updates to the status of a messaging conversation, from a data store.",
"The messaging application may create a session identifier, wherein the session identifier is usable by the remote web browser and by the messaging application to identify the user and locate message data of the user, and to send the session identifier to the remote web browser.",
"The session identifier may be useable to identify the user and locate message data until the user logs out of the messaging application.",
"The messaging application may receive a second request from the remote web browser to load a web page for the messaging application, the request including the session identifier; and the messaging component to retrieve message data associated with the session identifier.",
"At least one computer-readable storage medium may comprise instructions that, when executed, cause a system to receive a request from a remote web browser, the request to login to a messaging application and including a user identifier; generate a first access code; transmit the first access code to a messaging application installed on a mobile device associated with the user identifier; receive a second access code from the remote web browser; compare the second access code to the first access code; retrieve message data for an account associated with the user identifier when the second access code matches the first access code; and transmit the message data to the remote web browser for presentation.",
"The user identifier may be a mobile telephone number, an electronic mail address, or a user name associated with a mobile telephone number.",
"The instructions to generate the first access code may comprise instructions to generate an alphanumeric text sequence, a machine-readable optical pattern, an audio signal, or a visual image.",
"The instructions to retrieve message data may comprise instructions to retrieve messages sent to the user, messages sent by the user, message status updates, or other updates to the status of a messaging conversation, from a data store.",
"The computer-readable storage medium may comprise instructions to create a session identifier, wherein the session identifier is usable by the remote web browser and by the messaging application to identify the user and locate message data of the user, and to send the session identifier to the remote web browser.",
"The session identifier may be useable to identify the user and locate message data until the user logs out of the messaging application.",
"The computer-readable storage medium may comprise instructions to receive a second request from the remote web browser to load a web page for the messaging application, the request including the session identifier; and retrieve message data associated with the session identifier.",
"At least one computer-readable storage medium may comprise instructions that, when executed, cause a system to perform any of the computer-implemented methods described herein.",
"Some embodiments may be described using the expression “one embodiment” or “an embodiment” along with their derivatives.",
"These terms mean that a particular feature, structure, or characteristic described in connection with the embodiment is included in at least one embodiment.",
"The appearances of the phrase “in one embodiment” in various places in the specification are not necessarily all referring to the same embodiment.",
"Further, some embodiments may be described using the expression “coupled” and “connected” along with their derivatives.",
"These terms are not necessarily intended as synonyms for each other.",
"For example, some embodiments may be described using the terms “connected” and/or “coupled” to indicate that two or more elements are in direct physical or electrical contact with each other.",
"The term “coupled,” however, may also mean that two or more elements are not in direct contact with each other, but yet still co-operate or interact with each other.",
"With general reference to notations and nomenclature used herein, the detailed descriptions herein may be presented in terms of program procedures executed on a computer or network of computers.",
"These procedural descriptions and representations are used by those skilled in the art to most effectively convey the substance of their work to others skilled in the art.",
"A procedure is here, and generally, conceived to be a self-consistent sequence of operations leading to a desired result.",
"These operations are those requiring physical manipulations of physical quantities.",
"Usually, though not necessarily, these quantities take the form of electrical, magnetic or optical signals capable of being stored, transferred, combined, compared, and otherwise manipulated.",
"It proves convenient at times, principally for reasons of common usage, to refer to these signals as bits, values, elements, symbols, characters, terms, numbers, or the like.",
"It should be noted, however, that all of these and similar terms are to be associated with the appropriate physical quantities and are merely convenient labels applied to those quantities.",
"Further, the manipulations performed are often referred to in terms, such as adding or comparing, which are commonly associated with mental operations performed by a human operator.",
"No such capability of a human operator is necessary, or desirable in most cases, in any of the operations described herein which form part of one or more embodiments.",
"Rather, the operations are machine operations.",
"Useful machines for performing operations of various embodiments include general purpose digital computers or similar devices.",
"Various embodiments also relate to apparatus or systems for performing these operations.",
"This apparatus may be specially constructed for the required purpose or it may comprise a general purpose computer as selectively activated or reconfigured by a computer program stored in the computer.",
"The procedures presented herein are not inherently related to a particular computer or other apparatus.",
"Various general purpose machines may be used with programs written in accordance with the teachings herein, or it may prove convenient to construct more specialized apparatus to perform the required method steps.",
"The required structure for a variety of these machines will appear from the description given.",
"It is emphasized that the Abstract of the Disclosure is provided to allow a reader to quickly ascertain the nature of the technical disclosure.",
"It is submitted with the understanding that it will not be used to interpret or limit the scope or meaning of the claims.",
"In addition, in the foregoing Detailed Description, it can be seen that various features are grouped together in a single embodiment for the purpose of streamlining the disclosure.",
"This method of disclosure is not to be interpreted as reflecting an intention that the claimed embodiments require more features than are expressly recited in each claim.",
"Rather, as the following claims reflect, inventive subject matter lies in less than all features of a single disclosed embodiment.",
"Thus the following claims are hereby incorporated into the Detailed Description, with each claim standing on its own as a separate embodiment.",
"In the appended claims, the terms “including” and “in which” are used as the plain-English equivalents of the respective terms “comprising” and “wherein,” respectively.",
"Moreover, the terms “first,” “second,” “third,” and so forth, are used merely as labels, and are not intended to impose numerical requirements on their objects.",
"What has been described above includes examples of the disclosed architecture.",
"It is, of course, not possible to describe every conceivable combination of components and/or methodologies, but one of ordinary skill in the art may recognize that many further combinations and permutations are possible.",
"Accordingly, the novel architecture is intended to embrace all such alterations, modifications and variations that fall within the spirit and scope of the appended claims."
]
] |
Patent_15871214
|
[
[
"METHODS OF COATING AN ELECTRICALLY CONDUCTIVE SUBSTRATE AND RELATED ELECTRODEPOSITABLE COMPOSITIONS",
"A method of producing an electrode for a lithium ion battery is disclosed in which an electrically conductive substrate is immersed into an electrodepositable composition, the substrate serving as the electrode in an electrical circuit comprising the electrode and a counter-electrode immersed in the composition, a coating being applied onto or over at least a portion of the substrate as electric current is passed between the electrodes.",
"The electrodepositable composition comprises: (a) an aqueous medium; (b) an ionic (meth)acrylic polymer; and (c) solid particles comprising: (i) lithium-containing particles, and (ii) electrically conductive particles, wherein the composition has a weight ratio of solid particles to ionic (meth)acrylic polymer of at least 4:1."
],
[
"1.An electrodepositable composition comprising: (a) at least 75% by weight of an aqueous medium, based on the total weight of the electrodepositable composition; (b) an ionic (meth)acrylic polymer; and (c) solid particles comprising: (i) lithium-containing particles, and (ii) electrically conductive particles; wherein the composition has a weight ratio of solid particles to ionic (meth)acrylic polymer of at least 4:1.2.The composition of claim 1, wherein the weight ratio is at least 8:1.3.The composition of claim 1, wherein the ionic (meth)acrylic polymer is anionic.",
"4.The composition of claim 1, wherein the (meth)acrylic polymer is prepared by polymerizing a mixture of (meth)acrylic monomers wherein the (meth)acrylic monomers comprise alkyl methacrylates containing from 4 to 6 carbon atoms in the alkyl group and alkyl acrylates having 1 to 3 carbon atoms in the alkyl group.",
"5.The composition of claim 1, wherein the ionic (meth)acrylic polymer is prepared by organic solution polymerization techniques.",
"6.The composition of claim 1, wherein the ionic (meth)acrylic polymer is prepared by emulsion polymerization techniques.",
"7.The composition of claim 1, wherein the (meth)acrylic polymer is prepared by polymerizing a mixture of (meth)acrylic monomers including a (meth)acrylic acid monomer and at least partially neutralizing the (meth)acrylic polymer with a base.",
"8.The composition of claim 7 in which the (meth)acrylic acid is present in the mixture in an amount of at least 30 percent by weight based on total weight of the mixture of (meth)acrylic monomers.",
"9.The composition of claim 7 in which the mixture of (meth)acrylic monomers includes a monomer having a Tg of −20° C. or less.",
"10.The composition of claim 9, wherein the low Tg monomer is present in the mixture in amounts of at least 30 percent by weight based on total weight of (meth)acrylic monomer.",
"11.The composition of claim 9 in which the low Tg monomer comprises 2-ethylhexyl acrylate and/or butyl acrylate.",
"12.The composition of claim 1, wherein the lithium-containing particles comprise LiCoO2, LiNiO2, LiFePO4, LiCoPO4, LiMnO2, LiMn2O4, Li(NiMnCo)O2, and/or Li(NiCOAl)O2.13.The composition of claim 1, wherein the lithium-containing particles are present in an amount of at least 50 percent by weight, based on the total weight of the solid particles.",
"14.The composition of claim 1, wherein the electrically conductive particles comprise electrically conductive carbon particles.",
"15.The composition of claim 1, wherein the composition has a weight ratio of lithium-containing particles to electrically conductive particles in the composition of at least 3:1.16.The composition of claim 1, wherein the composition has a total solids content of 1 to 5 percent by weight, based on the total weight of the composition.",
"17.The composition of claim 1, wherein the lithium particles are present in the electrodepositable composition in an amount of at least 50 percent by weight based on the total weight of solids in the composition.",
"18.The composition of claim 1, wherein the ionic (meth)acrylic polymer is cationic.",
"19.The composition of claim 18, wherein the cationic polymer comprises a poly(C2-4)-alkyleneimine.",
"20.The composition of claim 1, wherein the electrically conductive carbon particles have an average particle size, prior to incorporation into the composition, of less than 300 nanometers.",
"21.A substrate at least partially coated with the electrodepositable composition of claim 1.22.A battery electrode comprising a curable electrodepositable composition comprising; (a) at least 75% by weight of an aqueous medium, based on the total weight of the electrodepositable composition; (b) an ionic (meth)acrylic polymer; and (c) solid particles comprising: (i) lithium-containing particles, and (ii) electrically conductive particles; wherein the composition has a weight ratio of solid particles to ionic (meth)acrylic polymer of at least 4:1."
],
[
"<SOH> BACKGROUND <EOH>Electrodeposition as a coating application method involves the deposition onto an electrically conductive substrate of a composition under the influence of an applied electrical potential.",
"A coating is deposited as the substrate is immersed in the composition, the substrate serving as an electrode in an electrical circuit of the electrode and a counter-electrode immersed in the composition, the coating being applied to the substrate as electric current is passed between the electrodes.",
"Often, the composition used in an electrodeposition process includes a resinous phase dispersed in an aqueous medium.",
"While the composition into which the substrate is immersed may include pigments to provide color and other fillers and additives, the properties historically sought by electrodeposited coatings, such as outstanding corrosion resistance, arise primarily because of the deposition of a continuous resinous film.",
"Therefore, the resin content of the composition into which the substrate is immersed is relatively high in relation to the amount of pigment and other fillers.",
"For example, such compositions usually contain 0.02 to 1 parts by weight pigment to 1 part by weight resinous phase.",
"Lithium ion batteries consist of a cathode, an anode, a separator, and an electrolyte.",
"The cathode is a metal (often aluminum) foil substrate having a lithium-containing active material, such as LiFePO 4 , deposited thereon.",
"The lithium-containing active material is deposited on the substrate from a slurry containing the lithium-containing active material, conductive carbon, and binder (such as polyvinylidene difluoride) in organic solvent (such as n-methyl-2-pyrrolidone) via a slot die coater.",
"In these slurries, the sum of the amount of lithium-containing active material and conductive carbon is high relative to the amount of binder, typically at least 9 parts by weight to 1 part by weight.",
"The use of such solvent-borne slurries is, however, environmentally undesirable.",
"As a result, alternative methods and compositions for depositing lithium-containing compositions on a metal foil are desired.",
"The present invention was made in view of the foregoing."
],
[
"<SOH> SUMMARY OF THE INVENTION <EOH>The present invention is directed to a method of producing an electrode for a lithium ion battery.",
"The method comprises immersing an electrically conductive substrate into an electrodepositable composition, the substrate serving as the electrode in an electrical circuit comprising the electrode and a counter-electrode immersed in the composition, a coating being applied onto or over at least a portion of the substrate as electric current is passed between the electrodes.",
"The electrodepositable composition used in this method comprises: (a) an aqueous medium; (b) an ionic (meth)acrylic polymer; and (c) solid particles comprising: (i) lithium-containing particles, and (ii) electrically conductive particles and has a weight ratio of solid particles to ionic (meth)acrylic polymer of at least 4:1.The present invention is also directed to electrodepositable compositions comprising: (a) an aqueous medium; (b) an ionic (meth)acrylic polymer; and (c) solid particles comprising: (i) lithium-containing particles, and (ii) electrically conductive particles, wherein the composition has a weight ratio of solid particles to ionic (meth)acrylic polymer of at least 4:1.detailed-description description=\"Detailed Description\" end=\"lead\"?"
],
[
"CROSS-REFERENCE TO RELATED APPLICATION This application is a continuation of application Ser.",
"No.",
"14/831,047, filed Aug. 20, 2015, now allowed, which is a continuation-in-part of U.S. Pat.",
"No.",
"9,150,736, which issued Oct. 6, 2015, copending application Ser.",
"No.",
"13/686,003, filed Nov. 27, 2012.FIELD The present invention relates to methods of producing a lithium ion battery by electrodeposition.",
"The present invention is also related to electrodepositable compositions for producing a lithium ion-containing battery.",
"BACKGROUND Electrodeposition as a coating application method involves the deposition onto an electrically conductive substrate of a composition under the influence of an applied electrical potential.",
"A coating is deposited as the substrate is immersed in the composition, the substrate serving as an electrode in an electrical circuit of the electrode and a counter-electrode immersed in the composition, the coating being applied to the substrate as electric current is passed between the electrodes.",
"Often, the composition used in an electrodeposition process includes a resinous phase dispersed in an aqueous medium.",
"While the composition into which the substrate is immersed may include pigments to provide color and other fillers and additives, the properties historically sought by electrodeposited coatings, such as outstanding corrosion resistance, arise primarily because of the deposition of a continuous resinous film.",
"Therefore, the resin content of the composition into which the substrate is immersed is relatively high in relation to the amount of pigment and other fillers.",
"For example, such compositions usually contain 0.02 to 1 parts by weight pigment to 1 part by weight resinous phase.",
"Lithium ion batteries consist of a cathode, an anode, a separator, and an electrolyte.",
"The cathode is a metal (often aluminum) foil substrate having a lithium-containing active material, such as LiFePO4, deposited thereon.",
"The lithium-containing active material is deposited on the substrate from a slurry containing the lithium-containing active material, conductive carbon, and binder (such as polyvinylidene difluoride) in organic solvent (such as n-methyl-2-pyrrolidone) via a slot die coater.",
"In these slurries, the sum of the amount of lithium-containing active material and conductive carbon is high relative to the amount of binder, typically at least 9 parts by weight to 1 part by weight.",
"The use of such solvent-borne slurries is, however, environmentally undesirable.",
"As a result, alternative methods and compositions for depositing lithium-containing compositions on a metal foil are desired.",
"The present invention was made in view of the foregoing.",
"SUMMARY OF THE INVENTION The present invention is directed to a method of producing an electrode for a lithium ion battery.",
"The method comprises immersing an electrically conductive substrate into an electrodepositable composition, the substrate serving as the electrode in an electrical circuit comprising the electrode and a counter-electrode immersed in the composition, a coating being applied onto or over at least a portion of the substrate as electric current is passed between the electrodes.",
"The electrodepositable composition used in this method comprises: (a) an aqueous medium; (b) an ionic (meth)acrylic polymer; and (c) solid particles comprising: (i) lithium-containing particles, and (ii) electrically conductive particles and has a weight ratio of solid particles to ionic (meth)acrylic polymer of at least 4:1.The present invention is also directed to electrodepositable compositions comprising: (a) an aqueous medium; (b) an ionic (meth)acrylic polymer; and (c) solid particles comprising: (i) lithium-containing particles, and (ii) electrically conductive particles, wherein the composition has a weight ratio of solid particles to ionic (meth)acrylic polymer of at least 4:1.DETAILED DESCRIPTION For purposes of the following detailed description, it is to be understood that the invention may assume various alternative variations and step sequences, except where expressly specified to the contrary.",
"Moreover, other than in any operating examples, or where otherwise indicated, all numbers expressing, for example, quantities of ingredients used in the specification and claims are to be understood as being modified in all instances by the term “about”.",
"Accordingly, unless indicated to the contrary, the numerical parameters set forth in the following specification and attached claims are approximations that may vary depending upon the desired properties to be obtained by the present invention.",
"At the very least, and not as an attempt to limit the application of the doctrine of equivalents to the scope of the claims, each numerical parameter should at least be construed in light of the number of reported significant digits and by applying ordinary rounding techniques.",
"Notwithstanding that the numerical ranges and parameters setting forth the broad scope of the invention are approximations, the numerical values set forth in the specific examples are reported as precisely as possible.",
"Any numerical value, however, inherently contains certain errors necessarily resulting from the standard variation found in their respective testing measurements.",
"Also, it should be understood that any numerical range recited herein is intended to include all sub-ranges subsumed therein.",
"For example, a range of “1 to 10” is intended to include all sub-ranges between (and including) the recited minimum value of 1 and the recited maximum value of 10, that is, having a minimum value equal to or greater than 1 and a maximum value of equal to or less than 10.In this application, the use of the singular includes the plural and plural encompasses singular, unless specifically stated otherwise.",
"In addition, in this application, the use of “or” means “and/or” unless specifically stated otherwise, even though “and/or” may be explicitly used in certain instances.",
"As used herein, the term “polymer” refers to copolymers and oligomers.",
"The term “(meth)acrylic” refers to both acrylic and methacrylic monomers and polymers.",
"In certain embodiments, the substrate is embodied in the form of a sheet, coil, or foil.",
"As used herein, the term “foil” refers to a thin and pliable sheet of metal.",
"Such foils may be constructed of, for example, aluminum, iron, copper, manganese, nickel, combinations thereof, and/or alloys thereof.",
"In certain embodiments, the thickness of the foil, such as a foil comprising aluminum, is no more than 8 mils (203.2 μm), such as no more than 4 mils (101.6 μm), no more than 2 mils (50.8 μm), or, in some cases no more than 1 mil (25.4 μm), and/or at least 0.1 mil (2.54 μm), such as at least 0.2 mil (5.08 μm), at least 0.4 mils (10.2 μm), or at least 0.5 mil (12.7 μm).",
"The methods of the present invention comprise immersing the electrically conductive substrate into an electrodepositable composition, the substrate serving as an electrode for a lithium ion battery in an electrical circuit comprising the electrode and a counter-electrode immersed in the composition, a coating being applied onto or over at least a portion of the substrate as electric current is passed between the electrodes.",
"As used herein, the term “electrodepositable composition” refers to a composition that includes components that are electrodepositable.",
"As used herein, the term “electrodepositable” means capable of being deposited onto an electrically conductive substrate under the influence of an applied electrical potential.",
"The electrodepositable compositions used in the methods of the present invention comprise an aqueous medium.",
"As used herein, the term “aqueous medium” refers to a medium that either consists exclusively of water or comprises predominantly water in combination with inert organic cosolvent(s).",
"In certain embodiments, the aqueous medium is present in the composition used in the methods of the present invention in an amount of at least 75 percent by weight, at least 90 percent by weight, or at least 95 percent by weight, such as 75 to 99.5 percent by weight, 90 to 99 percent by weight, or, in some cases, 95 to 99 percent by weight, based on the total weight of the composition.",
"In other words, the compositions used in the methods of the present invention may have a relatively low total solids content, as described further below.",
"The electrodepositable compositions used in the methods of the present invention comprise an ionic (meth)acrylic polymer.",
"As used herein, the term “ionic” refers to a (meth)acrylic polymer that carries a charge, including (meth)acrylic polymers that carry a negatively charged ion and (meth)acrylic polymers that carry a positively charged ion.",
"Suitable ionic (meth)acrylic polymers include, therefore, anionic (meth)acrylic polymers and cationic (meth)acrylic polymers.",
"Suitable anionic (meth)acrylic polymers contain at least partially neutralized anionic groups, such as acid groups, such as carboxylic acid groups, which impart a negative charge.",
"Non-limiting examples of suitable anionic (meth)acrylic polymers, therefore, include base-neutralized, carboxylic acid group-containing polymers.",
"The ionic (meth)acrylic polymers are water dispersible.",
"As used herein, a “water dispersible ionic (meth)acrylic polymer” means that the polymer is capable of being distributed throughout water as finely divided particles.",
"See R. Lewis, Sr., Hawley's Condensed Chemical Dictionary, (12th Ed.",
"1993) at page 435.Examples of (meth)acrylic polymers are those which are prepared by polymerizing mixtures of (meth)acrylic monomers.",
"The (meth)acrylic polymer contains carboxylic acid moieties that are introduced into the polymer from the use of (meth)acrylic carboxylic acids.",
"The carboxylic acid functionality provides sites for subsequent neutralization with a base such as an organic amine to stabilize the polymer dispersed in aqueous medium.",
"The unsaturated carboxylic acid will constitute from 20 to 60, such as 30 to 50 percent by weight of the total weight of monomers used in preparing the (meth)acrylic polymer.",
"Examples of (meth)acrylic carboxylic acids are acrylic acid and (meth)acrylic acid.",
"The (meth)acrylic polymer typically contains a “soft” polymer segment from the use of a monomer having a glass transition temperature of −20° C. or less.",
"Examples of such monomers are alkyl acrylates containing from 4 to 8 carbon atoms in the alkyl group such as butyl acrylate and 2-ethylhexyl acrylate.",
"Such monomers will constitute from 30 to 70, such as 40 to 60 percent by weight of the total weight of the monomers used in preparing the (meth)acrylic polymer.",
"Glass transition temperatures (Tg) of (meth)acrylic monomers are widely reported in the literature.",
"Examples of (meth)acrylic monomers and their Tgs are as follows: Monomer Tg, ° C. Methacrylic acid 228 Acrylic acid 105 Hydroxyethyl methacrylate 57 Butyl methacrylate 20 2-Ethylhexyl acrylate −50 n-Butyl acrylate −54 Examples of other (meth)acrylic monomers that can be used in preparing the (meth)acrylic polymers are alkyl methacrylates containing from 4 to 6 carbon atoms in the alkyl group such as butyl methacrylate and hexyl methacrylate and alkyl acrylates having 1 to 3 carbon atoms in the alkyl group such as methyl acrylate and ethyl acrylate.",
"These (meth)acrylic monomers typically constitute up to 20 percent by weight based on total weight of monomers used in preparing the (meth)acrylic polymer.",
"Vinyl monomers can optionally be used in preparing the (meth)acrylic polymer.",
"Examples of such monomers are vinyl aromatic monomers such as styrene and alpha-methyl styrene.",
"If used, these monomers constitute up to 10 percent by weight based on total weight of monomers used in preparing the (meth)acrylic polymer.",
"The (meth)acrylic polymer typically has a glass transition temperature of less than 20° C., such as less than 0° C. to provide the necessary flexibility in the resultant electrodeposited coating.",
"The term “glass transition temperature” (Tg) is a theoretical value being the glass transition temperature as calculated by the method of Fox on the basis of monomer composition of the monomer charges according to T. G. Fox, Bull.",
"Am.",
"Phys.",
"Soc.",
"(Ser.",
"II) 1, 123 (1056) and J. Brandrup, E. H. Immergut, Polymer Handbook 3rd edition, John Wiley, New York, 1989.The (meth)acrylic polymers will typically have molecular weights of at least 2000, such as 4000 to 500,000 on a weight average basis (Mw) as determined by gel permeation chromatography using polystyrene standards.",
"The electrodepositable compositions are typically thermosetting in nature by the presence of curing agent.",
"The curing agents can be integral with the (meth)acrylic polymer or they can be present as a separate component.",
"Curing agents which are integral with the (meth)acrylic polymer are incorporated into the polymer by including within the monomer charge polymerizable (meth)acrylic monomers containing self-curing groups.",
"Examples of monomers which contain self-curing groups include N-methylol ether derivatives of acrylic and methacrylic amides.",
"When these monomers are employed, they constitute up to 30, such as up to 20 percent by weight of the monomers used in preparing the (meth)acrylic polymer.",
"Such self-curing groups are stable when the (meth)acrylic polymer-containing compositions are at room temperature, that is, about 20°-25° C., but under the influence of heat, are reactive with each other or with other active hydrogen groups in the polymer such as hydroxyl groups and carboxylic acid groups to crosslink the polymer.",
"Suitable N-methylol ether derivatives of acrylic acid and methacrylic acid amides are N-butoxymethyl acrylamide and N-methoxymethyl methacrylamide.",
"Besides self-curing (meth)acrylic polymers, thermosetting compositions can be formed from (meth)acrylic polymers containing active hydrogens and a curing agent which is present in the coating composition as a separate component, for example, an aminoplast.",
"The curing agent is one which is stable in the presence of the active hydrogen-containing acrylic polymer at room temperature, that is 20°-25° C., but is reactive with the active hydrogens under the influence of heat to form a cured or crosslinked product.",
"Active hydrogens are incorporated into the (meth)acrylic polymer by including with the monomer charge monomers containing hydroxyl groups.",
"Examples of (meth)acrylic monomers containing hydroxyl groups are hydroxyalkyl acrylates and methacrylates.",
"Preferably, the hydroxyalkyl group will contain from 2 to 4 carbon atoms and examples would include hydroxyethyl acrylate, hydroxyethyl methacrylate, hydroxypropyl acrylate and hydroxypropyl methacrylate.",
"The (meth)acrylic monomers containing the active hydrogens (exclusive of the carboxylic acid containing monomer) can be used in amounts of up to 30, usually up to 15 percent by weight, based on total weight of the monomers used in preparing the (meth)acrylic polymer.",
"As mentioned above, the externally added curing agent is one which is stable with the (meth)acrylic polymer at room temperature (20°-25° C.) but reactive with the active hydrogens of the (meth)acrylic polymer at elevated temperature, that is, 135-200° C., to form a cured or crosslinked product.",
"Preferred curing agents are water-soluble or water-dispersible aminoplasts.",
"The aminoplasts are aldehyde condensation products of melamine, benzoguanamine, urea or similar compounds.",
"Generally, the aldehyde employed is formaldehyde, although useful products can be made from other aldehydes such as acetaldehyde, crotonaldehyde, acrolein, benzaldehyde, furfural and others.",
"Condensation products of melamine, urea or benzoguanamine are most common and are preferred but products of other amines and amides in which at least one amino group is present can also be employed.",
"For example, such condensation products can be produced from various diazines, triazoles, guanidines, guanamines and alkyl and di-substituted derivatives of such compounds including alkyl and aryl-substituted ureas and alkyl and aryl-substituted melamines and benzoguanamines.",
"Examples of such compounds are N,N-dimethyl urea, N-phenyl urea, dicyandiamide, formoguanamine, acetoguanamine, 6-methyl-2,4-diamino-1,3,5-triazine, 3,5-diaminotriazole, triaminopyrimidine, 2,4,6-triethyltriamine-1,3,5-triazine and the like.",
"These amine-aldehyde condensation products contain methylol groups or similar alkylol groups depending upon the particular aldehyde employed.",
"If desired, these methylol groups can be etherified by reaction with an alcohol.",
"Various alcohols are employed for this purpose including essentially any monohydric alcohol, although the preferred alcohols contain from 1 to 4 carbon atoms such as methanol, ethanol, isopropanol and n-butanol.",
"The (meth)acrylic polymer can be prepared by free radical initiated solution polymerization techniques in which the polymerizable monomers are dissolved in organic solvent and polymerized in the presence of a free radical initiator such as azobisisobutyronitrile or benzoyl peroxide.",
"Alternatively, the (meth)acrylic polymer can be prepared in aqueous medium by emulsion polymerization techniques.",
"To prepare the (meth)acrylic polymer by solution polymerization techniques, the solvent is first heated to reflux and the mixture of polymerizable monomers containing the free radical initiator is added slowly to the refluxing solvent.",
"The reaction mixture is held at polymerizing temperatures so as to reduce the free monomer content to below 1.0 and usually below 0.5 percent.",
"The (meth)acrylic polymer prepared as described above typically has a molecular weight on a weight average basis of about 2000 to 50,000, such as 4000 to 25,000.The acid group-containing (meth)acrylic polymer is treated with a base to form a water-dispersible salt thereof.",
"Examples of suitable bases are inorganic bases such as sodium and potassium hydroxides.",
"Preferably the base is an amine.",
"Examples of suitable amines are water-soluble amines including ammonia, primary, secondary and tertiary amines including hydroxyalkyl amines.",
"Examples include ethanolamine, diethanolamine, N-methylethanolamine, ethylamine and diethylamine.",
"The acid group-containing polymer is at least partially neutralized, usually to the extent of at least 20 and more usually at least 40 percent of the total theoretical neutralization.",
"After the acid group-containing (meth)acrylic polymer has been treated with a base, it is dispersed in aqueous medium.",
"The step of dispersion is accomplished by combining the neutralized or partially neutralized polymer with the aqueous medium.",
"Neutralization and dispersion can be accomplished in one step by combining the acid group-containing acrylic polymer and aqueous medium which contains the base.",
"The polymer (or its salt) can be added to the aqueous medium or the aqueous medium added to the polymer (or its salt).",
"The pH of the dispersion is preferably within the range of 7.0 to 9.0.The (meth)acrylic polymers can also be prepared by emulsion polymerization techniques well known in the art.",
"Examples of suitable techniques involve the pre-emulsification technique and the seeding technique.",
"In the pre-emulsification technique, a small amount of water is present in the polymerization vessel together with a polymerization initiator and optionally all or part of the emulsifying agent.",
"The monomer charge is emulsified in a larger amount of water and is continuously added to the reaction vessel under polymerizing conditions.",
"If all the emulsifier is not present initially in the reaction vessel, it can be added simultaneously with the monomer addition.",
"Alternately, the total amount of water may be present in the reaction vessel and the monomers added in bulk form.",
"In the seeding technique, a small amount of the monomer charge is added to the reaction vessel along with all or part of the polymerization initiator and all or part of the emulsifier and polymerized to form a seed latex.",
"After formation of the seed latex, the remaining polymerization ingredients are added in a continuous manner to the reaction vessel under polymerizing conditions to form the final polymer emulsion.",
"The (meth)acrylic polymers prepared as described above typically have molecular weights on a weight average basis of about 25,000 to 500,000, such as 50,000 to 100,000 as determined by gel permeation chromatography using polystyrene standards.",
"To form the ionic salt of the (meth)acrylic monomer, the latices are rendered alkaline in pH in the range of 7.5 to 9.5 by adding ammonia or a water-soluble amine to the latex.",
"In other embodiments of the present invention, the ionic resin comprises a cationic salt group-containing resin.",
"Suitable cationic salt-group containing resins include resins that contain at least partially neutralized cationic groups, such as sulfonium groups and amine groups, which impart a positive charge.",
"The cationic resin may comprise a water soluble cationic resin.",
"In certain embodiments, the water soluble cationic resin comprises a poly(C2-4)-alkyleneimine, which can be linear or branched, specific examples of which include polyethyleneimines (PEIs).",
"As will be appreciated, PEIs are made by a ring opening polymerization of ethyleneamine.",
"Other suitable water soluble cationic resins include poly(allylamine hydrochloride), poly(acrylamide-co-diallyldimethylammonium chloride) and poly(2-methacryloxyethyltrimethylammonium chloride).",
"In certain embodiments, the water soluble cationic resin, such as those mentioned above, has a weight average molecular weight of at least 5,000, such as at least 10,000, or, in some cases, 5,000 to 50,000, or, in some cases 10,000 to 25,000 as determined by gel permeation techniques using polystyrene standards.",
"Typically, the water soluble cationic resin, such as a PEI, is present in an amount of at least 50 percent by weight, such as at least 60 percent by weight, at least 70 percent by weight, at least 80 percent by weight, or, in some cases, at least 90 percent by weight, based on the total weight of resin in the composition.",
"In certain embodiments, the water soluble cationic resin, such as a PEI, is present in an amount of no more than 20 percent by weight, no more than 15 percent by weight, no more than 10 percent by weight, no more than 5 percent by weight, such as 1 to 20 percent by weight, 1 to 15 percent by weight, 5 to 15 percent by weight, or, in some cases, 1 to 3 percent by weight, based on the total weight of solids in the composition.",
"The composition may comprise a water dispersible cationic resin.",
"Examples of water dispersible cationic resins that are suitable for use in the compositions described herein are active hydrogen-containing, cationic salt group-containing resins.",
"As used herein, the term “active hydrogen-containing, cationic salt group-containing resin” refers to resins that include active hydrogen functional groups and at least partially neutralized cationic groups.",
"Examples of resins that are suitable for use as the active hydrogen-containing, cationic salt group-containing resin in the present invention include, but are not limited to, alkyd resins, acrylics, polyepoxides, polyamides, polyurethanes, polyureas, polyethers, and polyesters, among others.",
"More specific examples of suitable active hydrogen-containing, cationic salt group containing resins include polyepoxide-amine adducts, such as the adduct of a polyglycidyl ethers of a polyphenol, such as bisphenol A, and primary and/or secondary amines, such as are described in U.S. Pat.",
"No.",
"4,031,050 at col. 3, line 27 to col. 5, line 50, U.S. Pat.",
"No.",
"4,452,963 at col. 5, line 58 to col. 6, line 66, and U.S. Pat.",
"No.",
"6,017,432 at col. 2, line 66 to col. 6, line 26, these portions of which being incorporated herein by reference.",
"In certain embodiments, a portion of the amine that is reacted with the polyepoxide is a ketamine of a polyamine, as is described in U.S. Pat.",
"No.",
"4,104,147 at col. 6, line 23 to col. 7, line 23, the cited portion of which being incorporated herein by reference.",
"Also suitable are ungelled polyepoxide-polyoxyalkylenepolyamine resins, such as are described in U.S. Pat.",
"No.",
"4,432,850 at col. 2, line 60 to col. 5, line 58, the cited portion of which being incorporated herein by reference.",
"In addition, cationic acrylic resins, such as those described in U.S. Pat.",
"Nos.",
"3,455,806 at col. 2, line 18 to col. 3, line 61 and 3,928,157 at col. 2, line 29 to col. 3, line 21, these portions of both of which being incorporated herein by reference, can be used.",
"Besides amine salt group-containing resins, quaternary ammonium salt group-containing resins can also be employed as a cationic salt group-containing resin in the compositions described herein.",
"Examples of these resins are those which are formed from reacting an organic polyepoxide with a tertiary amine acid salt.",
"Such resins are described in U.S. Pat.",
"No.",
"3,962,165 at col. 2, line 3 to col. 11, line 7, U.S. Pat.",
"No.",
"3,975,346 at col. 1, line 62 to col. 17, line 25, and U.S. Pat.",
"No.",
"4,001,156 at col. 1, line 37 to col. 16, line 7, these portions of which being incorporated herein by reference.",
"Examples of other suitable cationic resins include ternary sulfonium salt group-containing resins, such as those described in U.S. Pat.",
"No.",
"3,793,278 at col. 1, line 32 to col. 5, line 20, this portion of which being incorporated herein by reference.",
"Also, cationic resins which cure via a transesterification mechanism, such as described in European Patent Application No.",
"12463B1 at p. 2, line 1 to p. 6, line 25, this portion of which being incorporated herein by reference, can also be employed.",
"Other suitable cationic salt group-containing resins include those that may form photodegradation resistant electrodepositable coating compositions.",
"Such resins include the resins comprising cationic amine salt groups which are derived from pendant and/or terminal amino groups that are disclosed in United States Patent Application Publication 2003/0054193 A1 at [0064] to [0088], this portion of which being incorporated herein by reference.",
"Also suitable are the active hydrogen-containing, cationic salt group-containing resins derived from a polyglycidyl ether of a polyhydric phenol that is essentially free of aliphatic carbon atoms to which are bonded more than one aromatic group, which are described in United States Patent Application Publication US 2003/0054193 A1 at [0096] to [0123], this portion of which being incorporated herein by reference.",
"The compositions comprising a cationic resin composition may comprise a water soluble cationic resin, such as a PEI, and a water dispersible cationic resin, different from the PEI, wherein the water dispersible cationic resin is present in the composition in an amount of less than 50 percent by weight, such as less than 40 percent by weight, less than 30 percent by weight, less than 20 percent by weight, or, in some cases, less than 10 percent by weight, based on the total weight of cationic resin in the composition.",
"As will be appreciated, in adapting the cationic resin to be solubilized or dispersed in an aqueous medium, the resin is at least partially neutralized by, for example, treating with an acid.",
"Non-limiting examples of suitable acids are inorganic acids, such as phosphoric acid and sulfamic acid, as well as organic acids, such as, acetic acid and lactic acid, among others.",
"Besides acids, salts such as dimethylhydroxyethylammonium dihydrogenphosphate and ammonium dihydrogenphosphate can be used.",
"In certain embodiments, the cationic resin is neutralized to the extent of at least 50 percent or, in some cases, at least 70 percent, of the total theoretical neutralization equivalent.",
"The step of solubilization or dispersion may be accomplished by combining the neutralized or partially neutralized resin with the water.",
"The composition further includes a curing agent to react with the active hydrogen groups of the cationic salt group containing resin described above.",
"Non-limiting examples of suitable curing agents are polyisocyanates, including at least partially blocked polyisocyanates, aminoplast resins and phenolic resins, such as phenolformaldehyde condensates including allyl ether derivatives thereof.",
"The electrodepositable compositions comprise lithium-containing particles, such as, for example, LiCoO2, LiNiO2, LiFePO4, LiCoPO4, LiMnO2, LiMn2O4, Li(NiMnCo)O2, and/or Li(NiCoAl)O2.The lithium-containing particles typically have an average particle size, prior to incorporation into the composition, of no more than 10 micron, no more than 5 micron, no more than 3 micron, no more than 1 micron, such as 10 nanometers to 1,000 nanometers, or, in some cases 500 nanometers to 1,000 nanometers or 600 nanometers to 800 nanometers.",
"The lithium-containing solid particles are present in the electrodepositable composition in an amount of at least 50 percent by weight, at least 60 percent by weight, at least 70 percent by weight, at least 80 percent by weight, such as at least 85 percent by weight, or, in some cases, at least 90 percent by weight, based on the total weight of solids in the composition.",
"In addition to the lithium-containing particles, the electrodepositable composition comprises electrically conductive particles, such as electrically conductive carbon particles.",
"Suitable electrically conductive particles include electrically conductive carbon blacks.",
"Examples of commercially available electrically conductive carbon blacks, that are suitable for use herein, include, but are not limited to, Cabot Monarch™ 1300, Cabot XC-72R, Black Pearls 2000 and Vulcan XC 72 sold by Cabot Corporation; Acheson Electrodag™ 230 sold by Acheson Colloids Co.; Columbian Raven™ 3500 sold by Columbian Carbon Co.; and Printex™ XE 2, Printex 200, Printex L and Printex L6 sold by DeGussa Corporation, Pigments Group, and Super P® and Super P®, Li, C-Nergy™ Super C45 and C-Nergy™ Super C65 sold by TIMCAL Ltd.",
"The electrically conductive carbon particles typically have an average particle size, prior to incorporation into the composition, of less than 300 nanometers, such as 1 to 200 nanometers, 10 to 100 nanometers, or, in some cases, 30 to 50 nanometers.",
"The electrically conductive carbon particles are typically present in the composition in an amount such that the relative weight ratio of lithium-containing particles to electrically conductive particles in the composition is at least 3:1, at least 4:1, at least 5:1, at least 8:1, at least 10:1, or, in some cases, at least 15:1.The electrically conductive carbon particles are present in an amount of no more than 20 percent by weight, no more than 10 percent by weight, such as 1 to 10 percent by weight, or 1 to 5 percent by weight, based on the total weight of the solids in the composition.",
"The electrodepositable composition may include other typical ingredients, such as adjuvant polymers such as polyvinylidene difluoride, corrosion inhibitors, anti-oxidants, flow control agents and surfactants.",
"The compositions described above can be prepared in any desired manner, including the methods described in the Examples.",
"For example, in some embodiments, it may be desirable to incorporate the solid particles by means of a composition in which the solid particles are mixed with ionic (meth)acrylic polymer that has been pre-solubilized in an aqueous medium.",
"The solids content of such a composition may be relatively high, such as 2 times, 3 times, or 4 times or more the total solids content of the composition in the methods of the present invention.",
"The composition may be mixed, such as by sonication, to provide a uniform dispersion.",
"This sonication may take 15 to 30 minutes or more.",
"The resulting composition may then subsequently be combined with further liquid carrier, i.e., water and optionally organic solvent, to provide the final composition for use in the methods of the present invention.",
"In the method of the present invention, the substrate is immersed in a composition that has a weight ratio of solid particles (lithium-containing particles and carbon particles) to ionic polymer of at least 4:1, such as at least 5:1, at least 6:1, at least 7:1, at least 8:1, at least 9:1, at least 10:1, at least 11:1, at least 12:1, at least 13:1, at least 14:1, at least 15:1, at least 16:1, at least 17:1, or higher.",
"Moreover, the substrate is immersed in a composition that has a total solids content of 0.5 to 25 percent by weight, such as 1 to 10 percent by weight, or, in some cases, 1 to 5 percent by weight, based on the total weight of the composition.",
"Indeed, it has been discovered that such compositions can be provide stable dispersions of the solid particles and ionic polymer in an aqueous medium, even without the use of a thickener.",
"As used herein, the term “stable dispersion” refers to a dispersion that does not gel, flocculate or precipitate when maintained at a temperature of 25° C. for at least 60 days, or, if some precipitation does occur, the precipitate can be redispersed upon agitation.",
"Moreover, it has been discovered that when such compositions are used in the methods of the present invention, even when the weight ratio of solid particles (such as lithium-containing particles in combination with electrically conductive carbon particles) to ionic polymer in the bath is within the foregoing ranges, a solid uniform coating of a suitable film thickness and limited porosity can be provided, which may make the foregoing methods particularly suitable for manufacturing coated substrates that may be used as a cathode for a lithium ion battery.",
"In the methods of the present invention, a coating is applied onto or over at least a portion of the substrate via an electrodeposition process.",
"In such a process, an electrically conductive substrate (such as any of those described earlier) serving as an anode in an electrical circuit comprising the anode and cathode is immersed in a composition of the type described above.",
"An electric current is passed between the electrodes to cause the coating to deposit on the anode.",
"The applied voltage may be varied and can be, for example, as low as one volt to as high as several thousand volts, but is often between 50 and 500 volts.",
"The current density is often between 0.5 ampere and 15 amperes per square foot.",
"In certain embodiments, the residence time of the substrate in the composition is from 30 to 180 seconds.",
"After electrocoating, the substrate is removed from the bath and may, in certain embodiments and depending upon the particulars of the composition and the preferences of the end user, be baked in an oven.",
"For example, the coated substrate may be baked at temperatures of 200° C. or lower, such as 125-175° C.) for 10 to 60 minutes.",
"EXAMPLES The following examples are offered to aid in understanding of the present invention and are not to be construed as limiting the scope thereof.",
"Unless otherwise indicated, all parts and percentages are by weight.",
"Two (2) (meth)acrylic polymers were prepared as described in Examples 1 and 2.The (meth)acrylic polymer of Example 1 was prepared by emulsion polymerization techniques.",
"The (meth)acrylic polymer of Example 2 was prepared by solution polymerization techniques, dispersed in water and neutralized with amine to form an anionic (meth)acrylic polymer.",
"In Example 3, the (meth)acrylic polymer of Example 1 was neutralized with amine and combined with additional aqueous medium, lithium-containing particles and electrically conductive carbon particles to form an electrodeposition bath.",
"In Example 4, the anionic (meth)acrylic polymer of Example 2 was combined with additional aqueous medium, lithium-containing particles and electrically conductive carbon particles to form an electrodeposition bath.",
"The electrodeposition baths of Examples 3 and 4 were then used to electrodeposit a coating on an aluminum foil that was to serve as a cathode in a lithium ion battery.",
"The electrocoated cathodes were roll calendered and evaluated for ½ cell coin cell discharge capacities (mAh/g) at various discharge rates.",
"The results are reported in Table I below.",
"Example 1 In a 4-neck, 2-liter glass reactor equipped with a temperature probe, nitrogen inlet, and stainless steel stir blade, the following materials are added: deionized (DI) water (460 g) and Rhodapex AB-20 (1 g).",
"The reactor is heated to 75° C. under a nitrogen blanket with stirring.",
"Concurrently, the pre-emulsion monomer feed containing DI water (200 g), Rheasoap SR10 (4.3 g), Rhodapex AB-20 (2.2 g), Triton N101 (4.3 g), 2-ethylhexylacrylate (147 g), butyl acrylate (18 g), 56 wt % solution of N-butoxymethylacrylamide in butanol (26.8 g), and methacrylic acid (120 g) is stirred for 30 minutes in a separate glass flask.",
"Once the water solution in the reactor reaches 75° C., 5% of the pre-emulsion feed is added at once followed by stirring for 5 minutes.",
"Next, a solution of DI water (28 g) and ammonium persulfate (0.5 g) is added at once to the reactor followed by stirring for 15 minutes.",
"Next, the remainder of the pre-emulsion monomer feed and the initiator feed containing DI water (32 g) and ammonium persulfate (0.2 g) is added simultaneously in separate addition funnels over 150 minutes.",
"After the feeds are complete, the mixture is stirred at 75° C. for 2 hours.",
"After the 2-hour hold, the reaction is cooled to 30° C. and poured through a 10-micron filter bag into a suitable container.",
"The resulting latex has a Tg-13° C., a weight average molecular weight (Mw) of 96400, pH=3, and particle size of 119 nm.",
"Example 2 In a 4-neck, 2-liter glass reactor equipped with a temperature probe, nitrogen inlet, and stainless steel stir blade, the solvent butyl cellosolve (174 g) is added.",
"The reactor is heated to 140° C. under a nitrogen blanket with stirring.",
"The monomer feed consisting of 2-ethylhexylacrylate (162 g), butyl methacrylate (36 g), 56 wt % solution of N-butoxymethylacrylamide in butanol (32.1 g), methacrylic acid (144 g), and tertiary-dodecyl mercaptan (11.3 g) is mixed and added into an addition funnel.",
"The initiator feed consisting of Trigonox F-050 (7.26 g) and butyl cellosolve (48 g) is mixed and added into a second addition funnel.",
"Once the solvent in the reactor reaches 140° C., the monomer feed and initiator feed are added simultaneously in separate addition funnels over 180 minutes.",
"After the feeds are complete, the addition funnel containing the monomer feed is rinsed with butyl cellosolve (12 g) and the reaction is stirred for 1 hour at 140° C. Next, a chaser feed containing Trigonox F-050 (3.63 g) and butyl cellosolve (4.8 g) is added over 30 minutes.",
"Then the initiator feed funnel is rinsed with butyl cellosolve (6 g) and the reaction is stirred for 90 minutes at 140° C. Next, the reaction mixture is cooled to 100° C. and DI water (20 g) warmed to 70° C. is added over 10 minutes and then the mixture is allowed to stir for 15 minutes.",
"The following step is to cool the reaction mixture to 88° C. and begin addition of dimethylethanolamine (164.4 g) warmed to 70° C. over 1 hour.",
"Then the feed is rinsed with butyl cellosolve (9 g) and the reaction is stirred for 15 minutes.",
"Once this is complete, the resin is cooled to <80° C. and poured out into a suitable container.",
"The resulting anionic (meth)acrylic polymer has a Tg-13° C., a weight average molecular weight (Mw) of 5556, and pH=8.9.Example 3 35 grams of the (meth)acrylic polymer prepared as in Example 1 was added dropwise to a stirring solution of 4.2 grams of DMEA in 966.5 grams DI water.",
"To prepare an electrodeposition bath, 86.5 grams of this anionic (meth)acrylic polymer was then diluted with 95 grams of DI water.",
"Next, 6 grams of conductive carbon, C-Nergy™ Super C65 (commercially available from Timcal Ltd.), was added and then the mixture was sonicated for 25 minutes.",
"12.5 grams of LiFePO4 (LFP) (commercially available from Phostech Lithium Inc.) was then added in 4 equivalent portions with each addition followed by 5 minutes of sonication.",
"An additional 10 minutes of sonication was performed to ensure a uniform dispersion.",
"Finally, 600 grams of deionized water and 74 grams of butyl cellosolve solvent were added to the bath.",
"To perform coating by electrodeposition, a carbon coated aluminum foil (commercially available from MTI) was wired as an electrode and placed in the stirring 75° F. (24° C.) bath containing a thermocouple and heating/cooling coil that also acted as a counter electrode.",
"The voltage was then turned on for 75 seconds at 75 volts with the current set to 1.5 amps.",
"The coated foil was then allowed to dry at room temperature before heating to 150° C. for 20 minutes.",
"The electrocoated cathode was then tested in a half-cell coin cell and the battery performance results are found in Table I.",
"Example 4 250 grams of the anionic (meth)acrylic polymer prepared as in Example 2 was added slowly to 300 grams of water while mixing aggressively with a Cowles blade mixer.",
"To prepare an electrodeposition bath, 4.1 grams of the anionic (meth)acrylic polymer was then diluted with 176.8 grams of DI water.",
"Next, 3.6 grams of conductive carbon, C-Nergy™ Super C65 (commercially available from Timcal Ltd.), was added and then the mixture was sonicated for 25 minutes.",
"15.5 grams of LiFePO4 (commercially available from Phostech Lithium Inc.) was then added in 4 equivalent portions with each addition followed by 5 minutes of sonication.",
"An additional 10 minutes of sonication was performed to ensure a uniform dispersion.",
"Finally, 600 grams of deionized water and 74 grams of butyl cellosolve solvent were added to the bath.",
"To perform coating by electrodeposition, a carbon coated aluminum foil (commercially available from MTI) was wired as an electrode and placed in the stirring 75° F. (24° C.) bath containing a thermocouple and heating/cooling coil that also acted as a counter electrode.",
"The voltage was then turned on for 75 seconds at 100 volts with the current set to 1.5 amps.",
"The coated foil was then allowed to dry at room temperature before heating to 150° C. for 20 minutes.",
"The electrocoated cathode was then tested in a half-cell coin cell and the battery performance results are found in Table I.",
"TABLE I ½ cell coin cell discharge capacities (mAh/g) at various c-rates Bath % capacity composition pigment/ionic retention LFP/C65/Ionic (meth)acrylic after 25 (meth)acrylic polymer weight Discharge C-rate (hrs.−1) cycles at Example Exp't polymer ratio Li/c 0.2 1.0 1.6 6.4 c-rate of 1 3 15-AHO- 62.5/30/7.5 12.3 2.1 160 125 101 0 96.4 096-A-4 4 15-AHO- 77.5/18/4.5 21.2 4.3 123 84 54 0 93.8 087-A-4 Whereas particular embodiments of this invention have been described above for purposes of illustration, it will be evident to those skilled in the art that numerous variations of the details of the present invention may be made without departing from the invention as defined in the appended claims.",
"Although various embodiments of the invention have been described in terms of “comprising”, embodiments consisting essentially of or consisting of are also within the scope of the present invention."
]
] |
Patent_15871215
|
[
[
"Performing Predefined Actions Based on Scheduled User Events in Response to Incoming Email Messages",
"A computing device, such as a network server or user terminal, automatically performs one or more predefined actions on inbound email messages responsive to receiving the inbound email messages.",
"However, rather than base the performance of the actions on information manually provided to an email application by the user, the computing device retrieves event-related information stored in one or more calendar applications communicatively connected to the email application.",
"The computing device then utilizes that information to perform the predefined actions.",
"One example of such an action is automatically generating and sending an autoreply email message to the sender of the inbound email message."
],
[
"1.A computer-implemented method comprising: receiving, at an email application executing on a computing device, an incoming email message addressed to a user, wherein the email application is communicatively interfaced to a calendar application associated with the user, and defines a filter for the incoming email message; retrieving event information from the calendar application responsive to receiving the incoming email message, the event information comprising an identifier that identifies a predetermined action to be performed by the email application when processing the incoming email message; determining a prioritized execution order for the predetermined action and the filter based on the event information; and executing the predetermined action and the filter in the prioritized execution order when processing the incoming email message.",
"2.The method of claim 1 wherein retrieving event information from the calendar application responsive to receiving the incoming email message comprises: sending a request message to the calendar application, wherein the request message identifies the user to the calendar application, and controls the calendar application to indicate whether a scheduled event is currently active for the user; and receiving a response message comprising the event information from the calendar application.",
"3.The method of claim 1 wherein the event information further comprises an event identifier, and wherein the method further comprises determining whether a scheduled event associated with the user is currently active based on the event identifier.",
"4.The method of claim 2 wherein the event information further comprises an event type identifier identifying the currently active event as being one of a single event type or a group event type, and wherein the predetermined action is selected based on the event type identifier.",
"5.The method of claim 1 wherein the event information further comprises a data indicator identifying data associated with the predetermined action to be performed, and wherein executing the predetermined action and the filter in the prioritized execution order when processing the incoming email message comprises executing the predetermined action using the data identified by the data indicator.",
"6.The method of claim 1 wherein the event information further comprises a priority indicator indicating a priority for performing the predetermined action relative to the filter, and wherein determining a prioritized execution order for the predetermined action and the filter based on the event information comprises determining which of the predetermined action and the filter to execute first based on the priority indicator.",
"7.The method of claim 1 wherein executing the predetermined action comprises: determining whether a predetermined condition is true; selectively executing a plurality of actions if the predetermined condition is satisfied.",
"8.A computing device comprising: a communication interface circuit configured to receive an incoming email message addressed to a user, wherein an email application executing on the computing device is communicatively interfaced to a calendar application associated with the user, and defines a filter for the incoming email message; and a processing circuit configured to execute the email application and to: retrieve event information from the calendar application responsive to receiving the incoming email message, the event information comprising an identifier that identifies a predetermined action to be performed by the email application when processing the incoming email message; determine a prioritized execution order for the predetermined action and the filter based on the event information; and execute the predetermined action and the filter in the prioritized execution order when processing the incoming email message.",
"9.The computing device of claim 8 wherein to retrieve event information from the calendar application responsive to receiving the incoming email message, the processing circuit is further configured to: send a request message to the calendar application, wherein the request message identifies the user to the calendar application, and controls the calendar application to indicate whether a scheduled event is currently active for the user; and receive a response message comprising the event information from the calendar application.",
"10.The computing device of claim 9 wherein the processing circuit is further configured to convert the messages and the event information between a first protocol associated with the email application and a second, different protocol associated with the calendar application.",
"11.The computing device of claim 8 wherein the event information further comprises an event identifier, and wherein the processing circuit is further configured to determine whether a scheduled event associated with the user is currently active based on the event identifier.",
"12.The computing device of claim 11 wherein the event information further comprises an event type identifier identifying the currently active event as being one of a single event type or a group event type, and wherein the processing circuit is further configured to select the predetermined action based on the event type identifier.",
"13.The computing device of claim 8 wherein the event information further comprises a data indicator identifying data associated with the predetermined action to be performed, and wherein to execute the predetermined action and the filter in the prioritized execution order when processing the incoming email message, the processing circuit is further configured to execute the predetermined action using the data identified by the data indicator.",
"14.The computing device of claim 8 wherein the event information further comprises a priority indicator indicating a priority for performing the predetermined action relative to the filter, and wherein to determine a prioritized execution order for the predetermined action and the filter based on the event information, the processing circuit is further configured to determine which of the predetermined action and the filter to execute first based on the priority indicator.",
"15.The computing device of claim 8 wherein executing the predetermined action comprises: determining whether a predetermined condition is true; selectively executing a plurality of actions if the predetermined condition is satisfied.",
"16.A computer program product comprising: a non-transitory computer readable medium configured to store an email application that, when executed by a computing device, configures a programmable processing circuit associated with the computing device to: receive an incoming email message addressed to a user, wherein an email application executing on the computing device is communicatively interfaced to a calendar application associated with the user, and defines a filter for the incoming email message; and retrieve event information from the calendar application responsive to receiving the incoming email message, the event information comprising an identifier that identifies a predetermined action to be performed by the email application when processing the incoming email message; determine a prioritized execution order for the predetermined action and the filter based on the event information; and execute the predetermined action and the filter in the prioritized execution order when processing the incoming email message.",
"17.The computer program product of claim 16 wherein the email application further configures the processing circuit to: send a request message to the calendar application, wherein the request message identifies the user to the calendar application, and controls the calendar application to indicate whether a scheduled event is currently active for the user; and receive a response message comprising the event information from the calendar application.",
"18.The computer program product of claim 16 wherein the email application further configures the processing circuit to convert the messages and the event information between a first protocol associated with the email application and a second, different protocol associated with the calendar application.",
"19.The computer program product of claim 16 wherein the event information further comprises an event identifier, and wherein the email application further configures the processing circuit to determine whether a scheduled event associated with the user is currently active based on the event identifier.",
"20.The computer program product of claim 19 wherein the event information further comprises an event type identifier identifying the currently active event as being one of a single event type or a group event type, and wherein the processing circuit is further configured to select the predetermined action based on the event type identifier.",
"21.The computer program product of claim 16 wherein the event information further comprises a data indicator identifying data associated with the predetermined action to be performed, and wherein the processing circuit is further configured to execute the predetermined action using the data identified by the data indicator.",
"22.The computer program product of claim 16 wherein the event information further comprises a priority indicator indicating a priority for performing the predetermined action relative to the filter, and wherein to determine a prioritized execution order for the predetermined action and the filter based on the event information, the processing circuit is further configured to determine which of the predetermined action and the filter to execute first based on the priority indicator."
],
[
"<SOH> BACKGROUND <EOH>The present disclosure relates to email messaging on computer systems, and particularly to performing predefined actions based on events scheduled in a user's calendar application upon receiving inbound email messages.",
"Many people commonly use email for communicating digital messages.",
"As such, there are a great many different types of email applications available for users.",
"Some of the more well-known email applications include those known under the trademarks MICROSOFT OUTLOOK and GMAIL, but most email applications offer a wide variety of features for users in addition to the typical send/receive capability.",
"One such feature is the “autoreply” feature, which is particularly useful for letting all senders know that the user is currently not able to respond to the incoming email messages.",
"With this feature, the user manually creates the body of an “autoreply” email message.",
"The body may comprise text indicating, for example, that the user cannot currently reply to incoming email messages personally.",
"In some cases, the text may also indicate when the user expects to be able to respond to incoming emails.",
"The user also creates a rule within the context of the email application that defines how incoming messages are to be treated.",
"Thereafter, in accordance with the rule, the email application autonomously sends the autoreply message to the sender each time it receives an inbound email message."
],
[
"<SOH> BRIEF SUMMARY <EOH>The present disclosure provides a computer-implemented method, an apparatus, and a computer-readable medium for automatically performing one or more predefined actions (e.g., generate and send an autoreply email message, forward the inbound email message to another destination address, etc.)",
"in response to receiving inbound email messages.",
"However, rather than perform such actions based on information manually provided to an email application by the user, as is conventional, the present disclosure performs the actions autonomously utilizing information stored in one or more calendar applications communicatively connected to the email application.",
"Particularly, the present disclosure determines whether any scheduled events associated with the user are currently active, and if so, performs a predefined action based on the information associated with the active user event.",
"Accordingly, one embodiment of the present disclosure provides a computer-implemented method comprising receiving, at an email application executing on a computing device, an incoming email message addressed to a user.",
"The email application is communicatively interfaced to a calendar application associated with the user and defines a filter for the incoming email message.",
"Responsive to receiving the incoming email message, the method calls for retrieving event information from the calendar application.",
"The event information, in this embodiment, comprises an identifier that identifies a predetermined action to be performed by the email application when processing the incoming email message.",
"Based on this event information, the method determines a prioritized execution order for the predetermined action and the filter, and then executes the predetermined action and the filter in the prioritized execution order when processing the incoming email message.",
"In another embodiment, the present disclosure provides a computing device that executes an email application communicatively interfaced to a calendar application associated with the user.",
"In this embodiment, the email application also defines a filter for processing the incoming email message.",
"The computing device comprises a communication interface circuit and a programmable processing circuit.",
"The communication interface circuit is configured to receive an incoming email message addressed to a user.",
"The processing circuit, which executes the email application, is configured to retrieve event information from the calendar application responsive to receiving the incoming email message.",
"The event information comprises an identifier that identifies a predetermined action to be performed by the email application when processing the incoming email message.",
"The processing circuit also determines a prioritized execution order for the predetermined action and the filter based on the event information, and executes the predetermined action and the filter in the prioritized execution order when processing the incoming email message.",
"In another embodiment, the present disclosure provides a computer readable medium configured to store an email application.",
"When executed by a computing device, the email application configures a programmable processing circuit associated with the computing device to receive an incoming email message addressed to a user.",
"Notably, the processing circuit communicatively interfaces the email application to a calendar application associated with the user.",
"Further, the email application defines a filter for the incoming email message.",
"In one embodiment, responsive to receiving the incoming email message, the email application controls the processing circuit to retrieve event information from the calendar application.",
"In this embodiment, the event information comprises an identifier that identifies a predetermined action to be performed by the email application when processing the incoming email message.",
"Once the event information has been received, the email application determines a prioritized execution order for the predetermined action and the filter based on the event information, and then executes the predetermined action and the filter in the prioritized execution order when processing the incoming email message.",
"Of course, those skilled in the art will appreciate that the present embodiments are not limited to the above contexts or examples, and will recognize additional features and advantages upon reading the following detailed description and upon viewing the accompanying drawings."
],
[
"RELATED APPLICATIONS This application is a continuation application of U.S. patent application Ser.",
"No.",
"14/203357, which was filed Mar.",
"10, 2014 and which is incorporated herein by reference in its entirety.",
"BACKGROUND The present disclosure relates to email messaging on computer systems, and particularly to performing predefined actions based on events scheduled in a user's calendar application upon receiving inbound email messages.",
"Many people commonly use email for communicating digital messages.",
"As such, there are a great many different types of email applications available for users.",
"Some of the more well-known email applications include those known under the trademarks MICROSOFT OUTLOOK and GMAIL, but most email applications offer a wide variety of features for users in addition to the typical send/receive capability.",
"One such feature is the “autoreply” feature, which is particularly useful for letting all senders know that the user is currently not able to respond to the incoming email messages.",
"With this feature, the user manually creates the body of an “autoreply” email message.",
"The body may comprise text indicating, for example, that the user cannot currently reply to incoming email messages personally.",
"In some cases, the text may also indicate when the user expects to be able to respond to incoming emails.",
"The user also creates a rule within the context of the email application that defines how incoming messages are to be treated.",
"Thereafter, in accordance with the rule, the email application autonomously sends the autoreply message to the sender each time it receives an inbound email message.",
"BRIEF SUMMARY The present disclosure provides a computer-implemented method, an apparatus, and a computer-readable medium for automatically performing one or more predefined actions (e.g., generate and send an autoreply email message, forward the inbound email message to another destination address, etc.)",
"in response to receiving inbound email messages.",
"However, rather than perform such actions based on information manually provided to an email application by the user, as is conventional, the present disclosure performs the actions autonomously utilizing information stored in one or more calendar applications communicatively connected to the email application.",
"Particularly, the present disclosure determines whether any scheduled events associated with the user are currently active, and if so, performs a predefined action based on the information associated with the active user event.",
"Accordingly, one embodiment of the present disclosure provides a computer-implemented method comprising receiving, at an email application executing on a computing device, an incoming email message addressed to a user.",
"The email application is communicatively interfaced to a calendar application associated with the user and defines a filter for the incoming email message.",
"Responsive to receiving the incoming email message, the method calls for retrieving event information from the calendar application.",
"The event information, in this embodiment, comprises an identifier that identifies a predetermined action to be performed by the email application when processing the incoming email message.",
"Based on this event information, the method determines a prioritized execution order for the predetermined action and the filter, and then executes the predetermined action and the filter in the prioritized execution order when processing the incoming email message.",
"In another embodiment, the present disclosure provides a computing device that executes an email application communicatively interfaced to a calendar application associated with the user.",
"In this embodiment, the email application also defines a filter for processing the incoming email message.",
"The computing device comprises a communication interface circuit and a programmable processing circuit.",
"The communication interface circuit is configured to receive an incoming email message addressed to a user.",
"The processing circuit, which executes the email application, is configured to retrieve event information from the calendar application responsive to receiving the incoming email message.",
"The event information comprises an identifier that identifies a predetermined action to be performed by the email application when processing the incoming email message.",
"The processing circuit also determines a prioritized execution order for the predetermined action and the filter based on the event information, and executes the predetermined action and the filter in the prioritized execution order when processing the incoming email message.",
"In another embodiment, the present disclosure provides a computer readable medium configured to store an email application.",
"When executed by a computing device, the email application configures a programmable processing circuit associated with the computing device to receive an incoming email message addressed to a user.",
"Notably, the processing circuit communicatively interfaces the email application to a calendar application associated with the user.",
"Further, the email application defines a filter for the incoming email message.",
"In one embodiment, responsive to receiving the incoming email message, the email application controls the processing circuit to retrieve event information from the calendar application.",
"In this embodiment, the event information comprises an identifier that identifies a predetermined action to be performed by the email application when processing the incoming email message.",
"Once the event information has been received, the email application determines a prioritized execution order for the predetermined action and the filter based on the event information, and then executes the predetermined action and the filter in the prioritized execution order when processing the incoming email message.",
"Of course, those skilled in the art will appreciate that the present embodiments are not limited to the above contexts or examples, and will recognize additional features and advantages upon reading the following detailed description and upon viewing the accompanying drawings.",
"BRIEF DESCRIPTION OF THE DRAWINGS Aspects of the present disclosure are illustrated by way of example and are not limited by the accompanying figures with like references indicating like elements.",
"FIG.",
"1 is a block diagram illustrating a communications network configured to function according to one embodiment of the present disclosure.",
"FIG.",
"2 is a block diagram illustrating some functional components that comprise a conventional email application.",
"FIG.",
"3 is a block diagram illustrating some functional components that comprise an email application configured according to one embodiment of the present disclosure.",
"FIG.",
"4 is a flow diagram illustrating a method for generating an autoreply email message in accordance with one embodiment of the present disclosure.",
"FIG.",
"5 is a block diagram illustrating some of the functional components that comprise an email application configured according to another embodiment of the present disclosure.",
"FIG.",
"6 is a block diagram illustrating some functional components of a computing device configured to function according to one embodiment of the present disclosure.",
"DETAILED DESCRIPTION As will be appreciated by one skilled in the art, aspects of the present disclosure may be illustrated and described herein in any of a number of patentable classes or context including any new and useful process, machine, manufacture, or composition of matter, or any new and useful improvement thereof.",
"Accordingly, aspects of the present disclosure may be implemented entirely as hardware, entirely as software (including firmware, resident software, micro-code, etc.)",
"or combining software and hardware implementation that may all generally be referred to herein as a “circuit,” “module,” “component,” or “system.” Furthermore, aspects of the present disclosure may take the form of a computer program product embodied in one or more computer readable media having computer readable program code embodied thereon.",
"Any combination of one or more computer readable media may be utilized.",
"The computer readable media may be a computer readable signal medium or a computer readable storage medium.",
"A computer readable storage medium may be, for example, but not limited to, an electronic, magnetic, optical, electromagnetic, or semiconductor system, apparatus, or device, or any suitable combination of the foregoing.",
"More specific examples (a non-exhaustive list) of the computer readable storage medium would include the following: a portable computer diskette, a hard disk, a random access memory (RAM), a read-only memory (ROM), an erasable programmable read-only memory (EPROM or Flash memory), an appropriate optical fiber with a repeater, a portable compact disc read-only memory (CD-ROM), an optical storage device, a magnetic storage device, or any suitable combination of the foregoing.",
"In the context of this document, a computer readable storage medium may be any tangible medium that can contain, or store a program for use by or in connection with an instruction execution system, apparatus, or device.",
"A computer readable signal medium may include a propagated data signal with computer readable program code embodied therein, for example, in baseband or as part of a carrier wave.",
"Such a propagated signal may take any of a variety of forms, including, but not limited to, electro-magnetic, optical, or any suitable combination thereof.",
"A computer readable signal medium may be any computer readable medium that is not a computer readable storage medium and that can communicate, propagate, or transport a program for use by or in connection with an instruction execution system, apparatus, or device.",
"Program code embodied on a computer readable signal medium may be transmitted using any appropriate medium, including but not limited to wireless, wireline, optical fiber cable, RF, etc., or any suitable combination of the foregoing.",
"Computer program code for carrying out operations for aspects of the present disclosure may be written in any combination of one or more programming languages, including an object oriented programming language such as Java, Scala, Smalltalk, Eiffel, JADE, Emerald, C++, C#, VB.NET, Python or the like, conventional procedural programming languages, such as the “C” programming language, Visual Basic, Fortran 2003, Perl, COBOL 2002, PHP, ABAP, dynamic programming languages such as Python, Ruby and Groovy, or other programming languages.",
"The program code may execute entirely on the user's computer, partly on the user's computer, as a stand-alone software package, partly on the user's computer and partly on a remote computer or entirely on the remote computer or server.",
"In the latter scenario, the remote computer may be connected to the user's computer through any type of network, including a local area network (LAN) or a wide area network (WAN), or the connection may be made to an external computer (for example, through the Internet using an Internet Service Provider) or in a cloud computing environment or offered as a service such as a Software as a Service (SaaS).",
"Aspects of the present disclosure are described herein with reference to flowchart illustrations and/or block diagrams of methods, apparatuses (systems) and computer program products according to embodiments of the disclosure.",
"It will be understood that each block of the flowchart illustrations and/or block diagrams, and combinations of blocks in the flowchart illustrations and/or block diagrams, can be implemented by computer program instructions.",
"These computer program instructions may be provided to a processor of a general purpose computer, special purpose computer, or other programmable data processing apparatus to produce a machine, such that the instructions, which execute via the processor of the computer or other programmable instruction execution apparatus, create a mechanism for implementing the functions/acts specified in the flowchart and/or block diagram block or blocks.",
"These computer program instructions may also be stored in a computer readable medium that when executed can direct a computer, other programmable data processing apparatus, or other devices to function in a particular manner, such that the instructions when stored in the computer readable medium produce an article of manufacture including instructions which when executed, cause a computer to implement the function/act specified in the flowchart and/or block diagram block or blocks.",
"The computer program instructions may also be loaded onto a computer, other programmable instruction execution apparatus, or other devices to cause a series of operational steps to be performed on the computer, other programmable apparatuses or other devices to produce a computer implemented process such that the instructions which execute on the computer or other programmable apparatus provide processes for implementing the functions/acts specified in the flowchart and/or block diagram block or blocks.",
"Accordingly, the present disclosure provides a computer-implemented method, a corresponding computing device, and a computer-readable medium for performing one or more predefined actions in response to receiving an inbound email message.",
"Such actions may include, but are not limited to, automatically generating and sending an autoreply email message to the sender of an inbound email message.",
"However, rather than perform the predefined actions based on information manually provided to an email application by the user, a computing device configured according to the present disclosure autonomously retrieves information stored in association with one or more calendar applications communicatively connected to the email application, and performs the predefined action or actions utilizing that retrieved information.",
"This method of autonomously performing predefined actions provides a variety of benefits over conventional methods.",
"For example, consider a situation in which a user will be away from the office and wishes to reply to inbound email messages using the autoreply feature of his/her email application.",
"With conventional methods, the user must manually prepare a different autoreply message template that will be sent to the sender each time the user will be away from the office.",
"Further, each template is conventionally a “one-size-fits-all” message that addresses all inbound email messages indiscriminately.",
"The present disclosure, however, identifies groups or types of events that are of a similar nature, and utilizes the data and information that is stored within a calendar application associated with the user to generate the autoreply email message for such groups.",
"Therefore, the user is no longer constrained to manually defining a single, “one-size-fits-all” message within the context of the email application for automatically replying to all incoming messages.",
"In another benefit, the present disclosure allows a user to better control how inbound emails are directed based on his/her scheduled events.",
"For example, a user may “schedule” a commute to/from work, a travel destination, or even define a plurality of state and federal holidays in his/her calendar application.",
"The user may also define a “rule” in an email application program to forward inbound emails received during these scheduled travel times to a predefined destination address.",
"This would allow a user to always ensure that emails are received and handled during those times when the user is not able to personally reply to an inbound email message.",
"Moreover, which actions are performed upon receiving an inbound email message may be selective, thereby allowing the user to specify how inbound email messages are handled.",
"For example, in one embodiment, the present disclosure allows a user to forward inbound email messages and/or generate autoreplies to inbound messages received from predefined contacts.",
"Turning now to the drawings, FIG.",
"1 is a block diagram of a computer network 10 configured according to one embodiment of the present disclosure.",
"As described herein, embodiments of the present disclosure are described in the context of automatically generating an autoreply email message upon receiving an inbound email message.",
"However, those of ordinary skill in the art should appreciate that this is for illustrative purposes only, and that the present disclosure is not so limited.",
"As described in more detail later, embodiments of the present disclosure also contemplate automatically performing other predefined actions upon receiving an inbound email message, and utilizing scheduled event information retrieved from a calendar application.",
"As seen in FIG.",
"1, network 10 comprises one or more communications networks, such as IP network 12, over which a plurality of user terminals 14, 16 communicate data with one another.",
"In this embodiment, the user terminals 14, 16 communicate data in email messages over the Internet.",
"Therefore, both user terminals 14, 16 execute client email applications locally.",
"In addition, however, user terminal 16 also utilizes a server-based email application program executing on server 20 that may be communicatively connected to a database (DB) 18.Such server-based email applications may be any known email application program used for composing and delivering email.",
"Such programs include, but are not limited to, those known under the trademarks MICROSOFT OUTLOOK, HOTMAIL, and GMAIL.",
"Generally, server-based applications receive email messages sent by a sending party (e.g., user terminal 14) that are intended for a receiving party (e.g., user terminal 16).",
"Upon receipt, the server-based email application filters the inbound email messages and forwards them to the intended user's inbox.",
"In some cases, where it is necessary, the server-based email application generates and returns an autoreply email message to the sender before delivering the email message to the intended recipient.",
"FIG.",
"2 is a block diagram illustrating, generally, how the component functions of a conventional email application program 30 interact to apply different “rules” or “filters” applied by a user.",
"As seen in FIG.",
"2, inbound email messages are received at the email application program 30 and “filtered” using filter logic 32.The filter logic 32 comprises the hardware and/or software needed to organize incoming email messages in accordance with specified criteria.",
"In FIG.",
"2, the criteria are embodied as a set of predetermined “rules” 36 that may be defined or refined by the user.",
"A rule is an action that is automatically performed by the email application 30 upon receiving an inbound email message, or upon sending an outgoing message, based on user-specified conditions.",
"Generally, users are able to create such rules by selecting one or more predetermined parameter values provided by the email application 30.In more detail, inbound email messages received by the filter logic 32 are generally sent to a user's “Inbox.” However, in accordance with the one or more rules 36, the inbound messages may be processed differently.",
"For example, a first rule 36 may cause filter logic 32 to route all inbound email messages from a specified domain to some other folder (e.g., a spam folder) instead of the Inbox.",
"Another rule 36 may cause filter logic 32 to forward a copy of the inbound email to some other predefined email address.",
"Additionally, email messages may be selectively processed or routed based on whether they contain specified words.",
"In some cases, the rules 36 may cause the filter logic 32 to trigger an autoreply generator logic component 34.Particularly, the autoreply generator logic 34, which may also comprise hardware and/or software, is configured to automatically generate a reply message and send that message to the sender.",
"The autoreply email message may indicate, for example, that the intended recipient is away from the office, and will return by a specified date.",
"In this manner, the sender of the email message is aware that he/she may not receive a timely reply.",
"Such features are handy, for example, when a user will be on vacation and unable to access email.",
"However, with conventional email applications 30, a user must create custom rules 36 for each occurrence of each different event.",
"For example, when a user goes on a first vacation, the user must generate a custom rule and autoreply message template to cover the time the user will be away.",
"However, the user must also generate a new rule and a new autoreply message template separately for each subsequent time the user goes on vacation.",
"Similarly, if a user enters important meetings and does not want to be disturbed, the user would have to generate a custom rule and autoreply message template to cover the user each time the user enters a meeting.",
"Information regarding these events, however, is usually entered into a calendar application by the user.",
"Nevertheless, conventional email applications 30 are not able to access such calendar applications 50, or their data.",
"Thus, conventional email applications, such as email application 30, are generally unable to leverage the event data that is stored with the calendar application 50, and therefore, are unable to process inbound emails in accordance with user events that are active at the time the inbound email messages are received.",
"Accordingly, the present disclosure provides a method for utilizing this calendar information to the user's advantage with respect to performing actions in response to receiving email messages.",
"FIG.",
"3 is a block diagram illustrating some functional components of an email application 40 configured according to one embodiment of the present disclosure.",
"As seen in FIG.",
"3, the email application 40 comprises a calendar event checker 42, a protocol interface 44, a priority checker 46, an action module 48, a filter 50, and a set of templates, rules, and data (TRD) 52 defined by a user of the email application 40, the email application 40, or both.",
"Each of these components seen in FIG.",
"3 may be implemented as hardware circuitry, or a combination of both software and hardware circuitry.",
"The event checker 42 receives inbound email messages sent by remote users, such as user 16, via network 12.Upon receiving the email messages, the event checker 42 accesses a calendar application 60 associated with the user, and determines whether there are any active events for the user.",
"For example, in one embodiment, the event checker 42 generates a request message identifying the user responsive to receiving the incoming email message, and sends the request message to the calendar application 60.The request message directs the calendar application 60 to indicate whether an event is currently active for the user, and if so, to provide information and data associated with that currently active event.",
"Such information and data may be stored, for example, in memory, such as a database 62, accessible to the calendar application 60.Table 1 provides some examples of the information and data that may be associated with a given event and provided to the event checker 42 by the calendar application 60 according to one embodiment.",
"TABLE 1 DATA ASSOCIATED WITH A GIVEN CALENDAR EVENT MEANING Event ID An identifier that uniquely identifies the event.",
"Event Type ID A value that identifies what type of event the currently active event is (e.g., VACATION, MEETING, FEDERAL HOLIDAY, STATE HOLIDAY, etc.).",
"Action Indicator A value that indicates which specific user-defined action, if any, is to be used to process the incoming email message.",
"TRD Data associated with the action to be performed (e.g., a list of addresses and/or user IDs to be used when action is to forward an inbound email message to specified recipients).",
"Filter Indicator A value that indicates a specific filter, if any, that is to be used to process the incoming message.",
"Priority Indicator A value that identifies whether a user- defined action, or a specific filter, should be applied first to the incoming message.",
"Of course, the list of data in Table 1 is not exhaustive, and other information and data not expressly identified herein may also be returned in the response message as needed or desired.",
"Responsive to receiving the request message, the calendar application 60 accesses the data in database 62 and determines whether there are any currently active events associated with the user.",
"If so, the calendar application 60 retrieves the data associated with the active event, generates a response message to include the retrieved data, and sends the response message to the event checker 42 via the protocol interface 44.The email application 40 and the calendar application 60 may, in some cases, be associated with disparate protocols.",
"Such may be the case, for example, when the email application 40 and the calendar application 60 are manufactured by different vendors.",
"Therefore, in at least one embodiment of the present disclosure, the protocol interface 44 facilitates communication between the email application 40 and the calendar application 60.The protocol interface 44 can be any type of interface needed or desired, but generally comprises the hardware and software needed for converting the messages, data, and information between a format understood by the email application 40 and a format understood by the calendar application 60.The priority checker 46 is configured to determine how the inbound email message should be processed, as well as to effect that processing.",
"In one embodiment, for example, the priority checker 46 determines whether the email application 40 should perform a predefined user action on the inbound email message before filtering the inbound email message, or alternatively, should filter the inbound email message before performing a predefined action on the inbound email message.",
"The decision on which process has priority over the other is determined, in one embodiment, on the Action Indicator provided by the calendar application 60.Particularly, when creating an event, the user would identify an action (e.g., delete the inbound message, generate an autoreply message, forward the message, etc.",
"), if desired, that is to be performed on an inbound email message.",
"Similarly, the user could also, if desired, indicate a filter that is to be used to process the inbound email message.",
"In some cases, the user may define both an action and a filter for the inbound email messages.",
"However, when both are defined, there could be a conflict when executing one before the other.",
"Therefore, the Action Indicator is simply a user-defined value (e.g., “ACTION” or “FILTER”) that identifies which of those two processes should occur first.",
"The Action Indicator value is intended to reduce or eliminate any ambiguities in the processing of a given inbound email message.",
"For example, consider an inbound email message in which the user indicates that all inbound messages from specified domains should be deleted.",
"However, the user may also specify that copies of the inbound email messages sent from a particular sender or domain should be moved to a predetermined folder.",
"In such cases, performing the predefined action first (i.e., deleting the email message) would cause problems for the filter 50.Specifically, there would be no email message to filter 50 since the inbound email message was deleted.",
"In these cases, the priority checker 46 would be configured, based on the Activity Indicator value provided by the event checker 42, to forward the email message to filter 50 before the action is taken on the email message by action module 48.Thus, a copy of the email message would first be placed in the predetermined folder, provided it was sent by a pre-identified person or from a predefined domain as defined by filter 50, and then subject to deletion performed by the action module 48.In other cases, where it does not matter if an action is performed first, a given email message may be marked as important (i.e., an action performed by the action module 48) and then moved to a predetermined folder based on the filter 50 processing.",
"The action module 48 comprises the hardware circuitry, or combination of hardware circuitry and software, required to perform a predefined action on an inbound email message.",
"The action is specified by the user and provisioned in the calendar application 60, identified in the Event ID data parameter sent by the event checker 42, and executed to perform its function(s) according to the set of templates, rules, and data in TRD 52.The TRD 52 may comprise any information needed or desired, but is generally utilized by the action module 48 when performing its function.",
"As stated above, the predefined action may be the generation and sending of an autoreply email message to the sender of the inbound message; however, as described in more detail below, other actions are also possible.",
"The filter 50 processes the inbound email messages based on predetermined criteria sent with the inbound email message.",
"For example, the filter 50 may process the inbound email message based on the identity of the sender, or on whether the message has a specific subject in the subject line.",
"Based on the filter results, the email application 40 may perform some action on the email message.",
"FIG.",
"4 is a flow diagram illustrating a method 70 by which an email application program 40 configured according to an embodiment of the present disclosure interfaces with calendar application 60 to generate an autoreply email message.",
"It is assumed for clarity that a user has already provisioned the calendar application 60 with a particular user event (e.g., a two week long vacation), as well as a rule and an autoreply template message within the context of the email application 40.Method 70 begins with the email application 40 receiving an inbound email message from a sender (box 72).",
"Upon receiving the email message, the event checker 42 generates and sends a request message to the calendar application 60 to determine whether there are any events that are currently active for the user (box 74).",
"For example, the request message may comprise a query as to whether any scheduled user events are currently on-going, and may include a username or user ID that identifies the user.",
"The request message may also incorporate the user's password, where needed.",
"In one embodiment, the request message is sent through the protocol interface 44 that converts the request message from a format that is understood by the email application 40 into a format that is understood by the calendar application 60.However, those of ordinary skill in the art will appreciate that such an interface 44 may not be needed in cases where the email application 40 and the calendar application 60 may communicate using compatible message formats.",
"In response, the event checker 42 receives a response message from the calendar application 60 that may comprise data and information indicating whether any events are currently active for the identified user (box 76).",
"In one embodiment, the information and data included in the response message is associated with the current event.",
"If the event checker 42 determines, that no events are currently active based on the data in the response message, the method 70 ends and the inbound email message is handled conventionally by email application 40.However, if the response message from calendar application 60 indicates that an event is active (e.g., that the user is currently on vacation), the event checker 42 will pass the data and information received in the response message to the priority checker 46.The data and information received in the response message from the calendar application 60 may include any information known in the art.",
"However in one embodiment, the information in the response message comprises the data and information described previously in Table 1.As stated above, the information may comprise an Action Indicator indicating the priority of the event to the user, as well as an Event Type ID intended to indicate whether the event occurs only once (e.g., a vacation, holiday, or a telephone call), or whether the event will reoccur in the future (e.g., weekly status update meeting calls).",
"Of course, this list is not exhaustive, and other data and information may be provided to the event checker 42 by calendar application 60 as needed or desired.",
"The event checker 42 then passes the information and data to the priority checker 46.In one embodiment, the priority checker 46 determines, based on the information returned in the response message, an event type for the active event.",
"That is, the priority checker 46 determines whether the active event is a single, unique event that rarely, if ever, reoccurs (e.g., “Telephone call with Sam”), or whether the event is one of many events of the same type (e.g., vacation events, meeting events, commute events, holidays, etc.)",
"(box 80).",
"To accomplish this determination, the priority checker 46 may analyze the Event Type ID parameter that was returned in the response message to determine the particular type of event.",
"A value of “TELEPHONE CALL” might be interpreted as a single event by priority checker 46, while a value of “VACATION,” “COMMUTE,” “FEDERAL HOLIDAY,” or “MEETING” may be interpreted as a group event by priority checker 46.Alternatively, the data in the response message could comprise an explicit parameter that identifies the active event to the priority checker 46 as being either a single or group event.",
"However, in the latter cases, the user may have to identify the event as being a single event or a group event when provisioning the calendar application 60 with scheduled event data.",
"Once the event type has been determined, the priority checker 46 determines whether an action exists for that event type based on the value contained in the Action Indicator (box 82).",
"For example, the user may not have created an action for a single type event such as a telephone call.",
"In such cases, the Action Indicator may be empty, or have a specified value.",
"Method 70 may then simply end and the email application 40 would handle the inbound email message normally.",
"However, if the user did create an action for the event type, the priority checker 46 could use the value in the Action Indicator to identify the appropriate action to apply to the inbound email message from the value in the Action Indicator parameter (box 84).",
"In this embodiment, the Action Indicator identifies a particular autoreply email message template to return to the sender of the inbound email message.",
"For example, if the Event Type Indicator received from the calendar application 60 indicates that the user is currently on vacation, the Action Indicator might specify an action (e.g., generate and send an autoreply message) created by the user specifically for vacations.",
"The specific template to use in the identified action could be identified in the TRD parameter, for example.",
"Alternatively, if the Event Type Indicator indicates that the user is currently in a meeting or on a commute, the Action Indicator might specify an action that was created by the user specifically for meetings or commutes.",
"The priority checker 46 then analyzes the Priority Indicator to determine, if necessary, whether the action module 48 or the filter 50 should be called first to continue processing the inbound email message (box 84).",
"This helps the email application 40 to avoid conflicts between the action module 48 and the filter 50.If the priority checker 46 determines that the action should be performed prior to filtering, the priority checker 46 calls the action module 48.The information received by the priority checker 46 is also passed or otherwise made available to the action module 48.The action module 48 then selects and retrieves the predetermined action from TRD 52 (box 86), performs the action in accordance with the templates, rules, and data included in the TRD 52 (box 88), and then passes the inbound email message to the filter 50 for filtering (box 90).",
"Alternatively, if the priority checker 46 determines that the inbound email message should be filtered prior to performing an action on the email (box 84), the priority checker 46 will pass the inbound email message to filter 50 for filtering (box 92).",
"Once the filter 50 has completed its processing, the filter 50 then passes the inbound email message to the action module 48, which selects the predetermined action from TRD 52 (box 92) and performs the action in accordance with the templates, rules, and data included in the TRD 52 (box 96).",
"Once complete, the method 70 ends, for example, with the email application sending an autoreply email message to the sender of the inbound email message.",
"As a practical example, consider a user that created a vacation event type autoreply message template to state where the user is, or what the user is doing, and when the user is expected back (e.g., “I'm currently on vacation, and will return to the office on Jul.",
"10, 2014”).",
"For meeting event types, the autoreply message template may reflect when the meeting will end and whom to contact for an emergency (e.g., “I'm currently in a meeting and will not be reachable until 4:00 pm.",
"If you need immediate assistance, please contact my assistant at 800-555-0192 or assistant©company.com”).",
"In each case, the data and information that is included in the autoreply email message may be provided by the calendar application 60 (e.g., contained in the TRD parameter) rather than from the email application 40.Thus, the user need only to generate a single autoreply message template for all vacations via the email application 40 with the calendar application 60 providing the data that is used to populate the information in the autoreply message.",
"Those skilled in the art should readily appreciate that method 70 may also be used to perform other types of user notifications.",
"For example, in one embodiment, the action module 48 may determine one or more predefined addresses for forwarding an inbound email message and/or the message generated by the action module 48.In these embodiments, the user would provision the event with the address information when creating the event.",
"The calendar application 60 could return such address information to the event checker 42 in the TRD parameter responsive to receiving the query.",
"That address information, along with any other data that is returned from the calendar application 60, may then be utilized to populate certain fields in the autoreply message being generated and/or to reflect the activities of the user, as stated above.",
"As stated previously, the present disclosure allows for performing one or more predefined actions in response to receiving an inbound email message.",
"More particularly, the email application 40, in one embodiment, may be configured to perform multiple actions with respect to an incoming email message based on whether predetermined conditions are held true at the time of processing.",
"For example, the embodiment seen in FIG.",
"5 illustrates some functional components of the email application 40.The components seen in FIG.",
"5 are functionally similar to those seen in FIG.",
"3; however, in this embodiment, the email application 40 may also comprise a logic circuit 54 that processes the data received from the priority checker 46 prior to calling the action module 48 to perform an action.",
"More specifically, the logic circuit 54 may determine whether one or more conditions are held true, and based on that analysis, call the action module 48 to selectively perform one or more actions.",
"By way of example only, the logic circuit 54 may perform its function as follows: IF (Incoming Email is from User A) THEN Send Autoreply Message with Content “ABC”; Forward email to User B; ELSE Move incoming email message to Folder 1; END IF Thus, the logic circuit 54 may call the action module 48 to selectively perform different multiple actions based on an analysis of the incoming email message, and on whether a predetermined condition is satisfied based on that analysis.",
"In another embodiment, the logic circuit 54 may be configured to process the incoming email with respect to a nested set of conditions, and then to call the action module 48 to selectively perform one or more actions on the incoming email message.",
"By way of example, the logic circuit 54 may be configured according to the following logic.",
"IF (incoming email message is from User A) THEN Send Autoreply message with content “ABC”; Forward email message to User B; ELSE IF (incoming email message is URGENT) Send Autoreply message with content “DEF; ELSE Send Autoreply message with content “XYZ” END IF Those of ordinary skill in the art should readily appreciate that, while FIG.",
"5 illustrates a logic circuit 54, which may be, for example, a processor circuit as, the present disclosure is not so limited.",
"The functions described herein with respect to the logic circuit 54 may be performed by the action module 48, the priority checker 46, or both.",
"FIG.",
"6 is a block diagram illustrating some of the components of a server 20 configured according to one or more aspects of the present disclosure.",
"It should be noted that while FIG.",
"5 and the previous embodiments discuss the present disclosure in the context of being performed at a network server 20, this is for illustrative purposes only.",
"The method of the present disclosure may, in some embodiments, be performed at a user terminal 14, 16.As seen in FIG.",
"5, server 20 comprises a processor circuit 22, a memory 24, and a communications interface 26.Although not specifically seen in the figure, those of ordinary skill in the art will readily appreciate that server 20 may comprise other components such as various user input/output (I/O) components that allow an operator or administrator, for example, to interact with server 20.Such components include, but are not limited to, a display monitor, a keyboard, a mouse, or other user input/output device.",
"The processor circuit 22 may be implemented, for example, as one or more programmable microprocessors, hardware, firmware, or a combination thereof.",
"The processor circuit 22 generally controls the operation and functions of the server 20 according to logic and instructions and data stored in memory 24.Such operations and functions include, but are not limited to, executing the email application 40 on server 20 receive inbound email messages, interface with a calendar application program 60 to determine whether there are any currently active events associated with the user, and generate and send autoreply messages to contain information retrieved from the calendar application 60, as previously described.",
"The memory 24 may comprise any non-transitory, solid state memory or computer readable media known in the art.",
"Suitable examples of such media include, but are not limited to, Read Only Memory (ROM), Dynamic Random Access Memory (DRAM), Flash, or a device capable of reading computer-readable media, such as optical or magnetic media.",
"The memory 24 stores programs and instructions, such as email application 40, which when executed by the processor circuit 22, control the processor circuit 22 to perform the functions previously described.",
"The communications interface 26 comprises, for example, an ETHERNET interface.",
"Communications interface 26 allows server 20 to communicate data and messages with the user terminals 14, 16, such as email messages, as well as with other servers in network 10, using any of a variety of well-known and well-documented protocols, such as TCP/IP, for example.",
"Other communication interfaces not specifically mentioned herein are also possible.",
"As stated above, embodiments of the present disclosure may be utilized to generate and send an autoreply email message to a send of a received email message.",
"However, those of ordinary skill in the art will readily appreciate that the present disclosure is not so limited.",
"In fact, the present disclosure may be utilized to perform other actions in addition to, or in lieu of, autoreply generation, as seen in the following, non-exhaustive list.",
"Move the inbound email message to the inbox folder (this may be a default action for the user, if desired).",
"Assign the inbound email message to a predefined event types (e.g., VACATION, MEETING, COMMUTE, etc.).",
"Delete the inbound email message (i.e., move the inbound email message to the trash folder).",
"Permanently delete the inbound email message (i.e., move the inbound email message to the trash folder and then empty the trash folder).",
"Forward the inbound email message to a predefined person or group of persons.",
"Forward the inbound email message to a person or group of persons as an attachment.",
"Redirect the inbound email message to a person or group of persons.",
"Flag the inbound email message.",
"Clear the flag from the inbound email message.",
"Clear the event type indicator from the inbound email message.",
"Mark the inbound email message as urgent.",
"Print the inbound email message.",
"Launch a predefined application upon receipt of the inbound email message.",
"The application may be identified in TRD 52 and/or in the data retrieved from the calendar application 60.Mark the inbound email message as read.",
"Run a script file.",
"Perform a custom action (e.g., defined by a macro) upon receipt of the inbound email message.",
"Display a predefined message in an alert sent to the desktop of the user, and/or to another predetermined device.",
"Additionally, the filter 50 may be configured to filter the inbound email messages based on any desired predefined criteria before or after performing one or more of the above-mentioned actions.",
"Some examples of the filter criteria are identified in the following non-exhaustive list.",
"The inbound email message is from a specific person.",
"The inbound email message has a specific subject.",
"The inbound email message was sent to a specific user or group.",
"The inbound email message has a specific word in the subject line or message body.",
"The inbound email message identifies the user in the “TO” line and/or CC line.",
"The inbound email message is a meeting invitation or an update to an already scheduled meeting.",
"The inbound email message is an autoreply email message from another person.",
"The inbound email message is assigned to a specific category.",
"The inbound email message includes specific predefined words in the header of the email message, and/or in the recipient address or sender address parts of the inbound email message.",
"The present embodiments may, of course, be carried out in other ways than those specifically set forth herein without departing from essential characteristics of the disclosure.",
"For example, it should be noted that the flowchart and block diagrams in the Figures illustrate the architecture, functionality, and operation of possible implementations of systems, methods and computer program products according to various aspects of the present disclosure.",
"In this regard, each block in the flowchart or block diagrams may represent a module, segment, or portion of code, which comprises one or more executable instructions for implementing the specified logical function(s).",
"It should also be noted that, in some alternative implementations, the functions noted in the block may occur out of the order noted in the figures.",
"For example, two blocks shown in succession may, in fact, be executed substantially concurrently, or the blocks may sometimes be executed in the reverse order, depending upon the functionality involved.",
"It will also be noted that each block of the block diagrams and/or flowchart illustration, and combinations of blocks in the block diagrams and/or flowchart illustration, can be implemented by special purpose hardware-based systems that perform the specified functions or acts, or combinations of special purpose hardware and computer instructions.",
"The terminology used herein is for the purpose of describing particular aspects only and is not intended to be limiting of the disclosure.",
"As used herein, the singular forms “a”, “an” and “the” are intended to include the plural forms as well, unless the context clearly indicates otherwise.",
"It will be further understood that the terms “comprises” and/or “comprising,” when used in this specification, specify the presence of stated features, integers, steps, operations, elements, and/or components, but do not preclude the presence or addition of one or more other features, integers, steps, operations, elements, components, and/or groups thereof.",
"The corresponding structures, materials, acts, and equivalents of any means or step plus function elements in the claims below are intended to include any disclosed structure, material, or act for performing the function in combination with other claimed elements as specifically claimed.",
"The description of the present disclosure has been presented for purposes of illustration and description, but is not intended to be exhaustive or limited to the disclosure in the form disclosed.",
"Many modifications and variations will be apparent to those of ordinary skill in the art without departing from the scope and spirit of the disclosure.",
"The aspects of the disclosure herein were chosen and described in order to best explain the principles of the disclosure and the practical application, and to enable others of ordinary skill in the art to understand the disclosure with various modifications as are suited to the particular use contemplated.",
"Thus, the foregoing description and the accompanying drawings represent non-limiting examples of the methods and apparatus taught herein.",
"As such, the present invention is not limited by the foregoing description and accompanying drawings.",
"Instead, the present invention is limited only by the following claims and their legal equivalents."
]
] |
Patent_15871221
|
[
[
"Film for Semiconductor Device and Fabrication Method Thereof",
"A film for semiconductor device includes a base material and an adhesive layer formed over the base material.",
"The film is divided into an adhesive area and an expansion area.",
"The elasticity modulus of the expansion area is less than that of the adhesive area.",
"When tensile strength is applied on the film, the expansion area is more prone to tensile deformation than the adhesive area.",
"When this film is used for film expansion of semiconductor devices, the devices can be evenly and orderly arranged on the film."
],
[
"1.A film for semiconductor device, comprising: a base material; and an adhesive layer formed over the base material; wherein, the film is divided into an adhesive area and an expansion area; elasticity modulus of the expansion area is less than that of the adhesive area; when tensile strength is applied on the film, the expansion area of the film is more prone to tensile deformation than the adhesive area.",
"2.The film for semiconductor device of claim 1, wherein, connection strength between the expansion area and the adhesive area of the film is not less than connection strength of the film in the expansion area so that the expansion area of the film can be elongated and not broken when tensile strength is applied on the film.",
"3.The film for semiconductor device of claim 1, wherein, ratio of an elasticity modulus E1 of the adhesive area and an elasticity modulus E2 of the expansion area is greater than 1, and more preferably greater than 2.4.The film for semiconductor device of claim 1, wherein, the elasticity modulus E1 of the adhesive area of the film is above 100 MPa under 23° C. 5.The film for semiconductor device of claim 1, wherein, the elasticity modulus of the expansion area of the film is below 200 MPa under 23° C., and more preferably 2-150 MPa; 6.The film for semiconductor device of claim 1, wherein, elasticity modulus E2 of the expansion area of the film is below 200 MPa under 23° C. 7.The film for semiconductor device of claim 1, wherein, when tensile strength is applied on the film, ratio of deformation quantity dV1 of the expansion area and deformation quantity dV2 of the adhesive area is greater than 1.8.The film for semiconductor device of claim 1, wherein, patterns for the distribution of the adhesive area and the expansion area of the film are designed based on the cutting pattern of the semiconductor device, wherein, the expansion area corresponds to the cut of the cutting pattern of the semiconductor device.",
"9.The film for semiconductor device of claim 1, wherein, size of the adhesive area is designed based on the semiconductor device size, which is smaller than or equals to the semiconductor device size.",
"10.The film for semiconductor device of claim 1, wherein, the film surface is in grid distribution, wherein, the grid unit is the adhesive area, and the grid line is the expansion area.",
"11.The film for semiconductor device of claim 8, wherein, a width of the expansion area is 5-1,000 μm wide.",
"12.The film for semiconductor device of claim 1, wherein, an adhesive area thickness is greater than an expansion area thickness.",
"13.The film for semiconductor device of claim 1, wherein, the base material contains light sensing material; elasticity modulus of the lighted area can be locally changed by lighting the adhesive area or the expansion area of the film so that elasticity modulus of the adhesive area of the film is greater than that of the expansion area.",
"14.The film for semiconductor device of claim 1, wherein, the base material contains thermal curing material; elasticity modulus of the heated area can be changed by heating the adhesive area or the expansion area of the film so that elasticity modulus of the adhesive area of the film is greater than that of the expansion area.",
"15.The film for semiconductor device of claim 1, wherein, the base material contains an activated thinner; the activated thinner content in the adhesive area is higher than that in the expansion area; activated thinner content in the adhesive area and the expansion area can be controlled so that elasticity modulus of the adhesive area is greater than that of the expansion area.",
"16.The film for semiconductor device of claim 1, wherein, the adhesive area of the film is in glassy state, and the expansion area is an elastomer.",
"17.The film for semiconductor device of claim 1, further comprises: a strengthened layer only formed over the base material surface in the adhesive area; wherein, elasticity modulus of the strengthened layer is greater than that of the base material; and adhesive strength between the strengthened layer and the base material is big enough to strengthen elasticity modulus of the adhesive area of the base material.",
"18.The film for semiconductor device of claim 17, wherein, the adhesive layer is formed over the strengthened layer, and adhesive strength between the base material and the strengthened layer is greater than that between the fixed layer and the adhesive layer.",
"19.The film for semiconductor device of claim 17, wherein, elasticity modulus of the base material is 1-200 MPa, and elasticity modulus of the strengthened layer is above 500 MPa; 20.A fabrication method of semiconductor devices, comprising: (1) providing a semiconductor wafer, and defining a chip area and a cut area, and forming a cut in the cut area; (2) providing a film, and bonding the semiconductor wafer to the film, wherein, the chip area of the wafer corresponds to the adhesive area of the film, and the wafer cut corresponds to the expansion area of the film; (3) dividing the semiconductor wafer into a series of chips along the cut; and (4) applying tensile strength on the film to elongate the expansion area of the film to separate and evenly arrange the chips; wherein, the film further comprises: a base material; and an adhesive layer formed over the base material; wherein, the film is divided into an adhesive area and an expansion area; elasticity modulus of the expansion area is less than that of the adhesive area; when tensile strength is applied on the film, the expansion area of the film is more prone to tensile deformation than the adhesive area."
],
[
"<SOH> BACKGROUND <EOH>During fabrication process of semiconductor devices, when the wafer is cut into chip cores or after cutting, it is common to use an adhesive film (such as commonly used blue film tape or white film tape in LED chips) for connection and film expansion."
],
[
"<SOH> SUMMARY <EOH>The inventors of the present disclosure have recognized through research that, after expansion, semiconductor devices are not always distributed over the film evenly.",
"Such uneven arrangement is mainly caused by factors below: I. Adhesive strength between the device and the film.",
"As adhesive strength between the semiconductor device and the film is hardly controllable, it is prone to displacement during film expansion if such adhesive strength is too small or is unevenly distributed under tensile strength.",
"This is especially the case in small-size devices because the contact surface between each device and the film is small, and thereby causes deviation; II.",
"During extrusion, molding, stretch and other fabrication processes, film materials are subject to anisotropy.",
"When the film is applied in film expansion process, entire periphery of the film is stretched in the radius direction and loaded with tensile stress.",
"With such anisotropy, tensile properties of the film within the surface become uneven.",
"FIG.",
"1 .",
"Illustrates that, after expansion, semiconductor devices are not always distributed over the film evenly.",
"To solve the aforementioned problems, the present disclosure provides a film for semiconductor device and a fabrication method for semiconductor device.",
"This film has small elasticity modulus in specific area.",
"Therefore, when tensile strength is applied back on the film, it is more likely to produce tensile deformation.",
"When it is applied in film expansion process of the semiconductor device fabrication, it can reduce displacement during stretch of the device and obtain more uniform and orderly-distributed semiconductor device arrangements.",
"According to a first aspect of the present disclosure, a film for semiconductor device includes a base material and an adhesive layer formed over the base material, wherein, the film is divided into an adhesive area and an expansion area; elasticity modulus of the expansion area is less than that of the adhesive area; when tensile strength is applied on the film, the expansion area is more prone to tensile deformation than the adhesive area.",
"In some embodiments, connection strength between the expansion area and the adhesive area is not less than connection strength of the film in the expansion area so that the expansion area of the film can be elongated but not broken when tensile strength is applied on the film.",
"In some embodiments, ratio of elasticity modulus E1 of the adhesive area and elasticity modulus E2 of the expansion area is greater than 1, and more preferably greater than 2.In some embodiments, elasticity modulus of the expansion area of the film is below 200 MPa under 23° C., and more preferably 2-150 MPa; elasticity modulus of the adhesive area of the film is above 100 MPa, and more preferably above 150 MPa.",
"In some embodiments, when tensile strength is applied on the film, ratio of deformation quantity dV1 of the expansion area and deformation quantity dV2 of the adhesive area is greater than 1.In some embodiments, patterns for the distribution of the adhesive area and the expansion area of the film are designed based on the cutting pattern of the semiconductor device, wherein, the expansion area corresponds to the cut of the cutting pattern of the semiconductor device.",
"In some embodiments, size of the adhesive area is designed based on the semiconductor device size, which is smaller than or equals to the semiconductor device size.",
"In some embodiments, the film surface is in grid distribution, wherein, the grid unit is the adhesive area, and the grid line is the expansion area.",
"Preferably, the expansion area is 5-1,000 μm wide.",
"In the various embodiments of the present disclosure, by controlling the film thickness, elasticity modulus distribution of the film can be controlled so that elasticity modulus of the adhesive area is greater than that of the expansion area.",
"For example, the adhesive area thickness is greater than the expansion area thickness.",
"Or, elasticity modulus of the film can be locally changed through lighting, heating and doping to achieve 2D patterning elasticity modulus distribution while the film thickness is consistent.",
"In some embodiments, elasticity modulus of the expansion area can be reduced by reducing thickness of the film expansion area.",
"For instance, a groove structure is set in the expansion area of the film, which can be at the front or back of the film, and preferably, at the back of the film.",
"For another instance, extrusion is used to make thickness of the expansion area of the film less than thickness of the adhesive area.",
"In some embodiments, a strengthened layer with larger elasticity modulus is added in the adhesive area of the film base material, wherein, elasticity modulus of the strengthened layer is greater than that of the base material; and adhesive strength between the fixed layer and the base material is big enough to strengthen elasticity modulus of the adhesive area of the base material.",
"Thus, when tensile strength is applied back on the film base material, elongation deformation of the adhesive area of the base material is greatly decreased affected by the strengthened layer.",
"In some embodiments, elasticity modulus of the base material is 1-200 MPa, and elasticity modulus of the strengthened layer is above 500 MPa; the adhesive layer is formed over the strengthened layer, and adhesive strength between the base material and the strengthened layer is greater than that between the fixed layer and the adhesive layer.",
"In some embodiments, the base material contains light sensing material; elasticity modulus of the lighted area can be locally changed by lighting the adhesive area or the expansion area of the film so that elasticity modulus of the adhesive area of the film is greater than that of the expansion area.",
"In some embodiments, the base material contains thermal curing material; elasticity modulus of the heated area can be changed by heating the adhesive area or the expansion area of the film so that elasticity modulus of the adhesive area of the film is greater than that of the expansion area.",
"In some embodiments, the base material contains activated thinner, wherein, the activated thinner content in the adhesive area is higher than that in the expansion area; activated thinner content in the adhesive area and the expansion area can be controlled so that elasticity modulus of the adhesive area is greater than that of the expansion area.",
"In some embodiments, the adhesive area of the film is in glassy state, and the expansion area is an elastomer.",
"According to a second aspect of the present disclosure, a fabrication method for semiconductor device includes: providing a semiconductor wafer, and defining a chip area and a cut area, and forming a cut in the cut area; providing any of the film, and bonding the semiconductor wafer to the film, wherein, the chip area of the wafer corresponds to the adhesive area of the film, and the wafer cut corresponds to the expansion area of the film; dividing the semiconductor wafer into a series of chips along the cut; and applying tensile strength on the film to elongate the expansion area of the film to separate the chips.",
"The other features and advantages of this present disclosure will be described in detail in the following specification, and it is believed that such features and advantages will become more obvious in the specification or through implementations of this disclosure.",
"The purposes and other advantages of the present disclosure can be realized and obtained in the structures specifically described in the specifications, claims and drawings."
],
[
"CROSS-REFERENCE TO RELATED APPLICATIONS The present application is a continuation of, and claims priority to, PCT/CN2017/087716 filed on Jun.",
"9, 2017, which claims priority to Chinese Patent Application No.",
"201610636215.1 filed on Aug. 5, 2016.The disclosures of these applications are hereby incorporated by reference in their entirety.",
"BACKGROUND During fabrication process of semiconductor devices, when the wafer is cut into chip cores or after cutting, it is common to use an adhesive film (such as commonly used blue film tape or white film tape in LED chips) for connection and film expansion.",
"SUMMARY The inventors of the present disclosure have recognized through research that, after expansion, semiconductor devices are not always distributed over the film evenly.",
"Such uneven arrangement is mainly caused by factors below: I. Adhesive strength between the device and the film.",
"As adhesive strength between the semiconductor device and the film is hardly controllable, it is prone to displacement during film expansion if such adhesive strength is too small or is unevenly distributed under tensile strength.",
"This is especially the case in small-size devices because the contact surface between each device and the film is small, and thereby causes deviation; II.",
"During extrusion, molding, stretch and other fabrication processes, film materials are subject to anisotropy.",
"When the film is applied in film expansion process, entire periphery of the film is stretched in the radius direction and loaded with tensile stress.",
"With such anisotropy, tensile properties of the film within the surface become uneven.",
"FIG.",
"1.Illustrates that, after expansion, semiconductor devices are not always distributed over the film evenly.",
"To solve the aforementioned problems, the present disclosure provides a film for semiconductor device and a fabrication method for semiconductor device.",
"This film has small elasticity modulus in specific area.",
"Therefore, when tensile strength is applied back on the film, it is more likely to produce tensile deformation.",
"When it is applied in film expansion process of the semiconductor device fabrication, it can reduce displacement during stretch of the device and obtain more uniform and orderly-distributed semiconductor device arrangements.",
"According to a first aspect of the present disclosure, a film for semiconductor device includes a base material and an adhesive layer formed over the base material, wherein, the film is divided into an adhesive area and an expansion area; elasticity modulus of the expansion area is less than that of the adhesive area; when tensile strength is applied on the film, the expansion area is more prone to tensile deformation than the adhesive area.",
"In some embodiments, connection strength between the expansion area and the adhesive area is not less than connection strength of the film in the expansion area so that the expansion area of the film can be elongated but not broken when tensile strength is applied on the film.",
"In some embodiments, ratio of elasticity modulus E1 of the adhesive area and elasticity modulus E2 of the expansion area is greater than 1, and more preferably greater than 2.In some embodiments, elasticity modulus of the expansion area of the film is below 200 MPa under 23° C., and more preferably 2-150 MPa; elasticity modulus of the adhesive area of the film is above 100 MPa, and more preferably above 150 MPa.",
"In some embodiments, when tensile strength is applied on the film, ratio of deformation quantity dV1 of the expansion area and deformation quantity dV2 of the adhesive area is greater than 1.In some embodiments, patterns for the distribution of the adhesive area and the expansion area of the film are designed based on the cutting pattern of the semiconductor device, wherein, the expansion area corresponds to the cut of the cutting pattern of the semiconductor device.",
"In some embodiments, size of the adhesive area is designed based on the semiconductor device size, which is smaller than or equals to the semiconductor device size.",
"In some embodiments, the film surface is in grid distribution, wherein, the grid unit is the adhesive area, and the grid line is the expansion area.",
"Preferably, the expansion area is 5-1,000 μm wide.",
"In the various embodiments of the present disclosure, by controlling the film thickness, elasticity modulus distribution of the film can be controlled so that elasticity modulus of the adhesive area is greater than that of the expansion area.",
"For example, the adhesive area thickness is greater than the expansion area thickness.",
"Or, elasticity modulus of the film can be locally changed through lighting, heating and doping to achieve 2D patterning elasticity modulus distribution while the film thickness is consistent.",
"In some embodiments, elasticity modulus of the expansion area can be reduced by reducing thickness of the film expansion area.",
"For instance, a groove structure is set in the expansion area of the film, which can be at the front or back of the film, and preferably, at the back of the film.",
"For another instance, extrusion is used to make thickness of the expansion area of the film less than thickness of the adhesive area.",
"In some embodiments, a strengthened layer with larger elasticity modulus is added in the adhesive area of the film base material, wherein, elasticity modulus of the strengthened layer is greater than that of the base material; and adhesive strength between the fixed layer and the base material is big enough to strengthen elasticity modulus of the adhesive area of the base material.",
"Thus, when tensile strength is applied back on the film base material, elongation deformation of the adhesive area of the base material is greatly decreased affected by the strengthened layer.",
"In some embodiments, elasticity modulus of the base material is 1-200 MPa, and elasticity modulus of the strengthened layer is above 500 MPa; the adhesive layer is formed over the strengthened layer, and adhesive strength between the base material and the strengthened layer is greater than that between the fixed layer and the adhesive layer.",
"In some embodiments, the base material contains light sensing material; elasticity modulus of the lighted area can be locally changed by lighting the adhesive area or the expansion area of the film so that elasticity modulus of the adhesive area of the film is greater than that of the expansion area.",
"In some embodiments, the base material contains thermal curing material; elasticity modulus of the heated area can be changed by heating the adhesive area or the expansion area of the film so that elasticity modulus of the adhesive area of the film is greater than that of the expansion area.",
"In some embodiments, the base material contains activated thinner, wherein, the activated thinner content in the adhesive area is higher than that in the expansion area; activated thinner content in the adhesive area and the expansion area can be controlled so that elasticity modulus of the adhesive area is greater than that of the expansion area.",
"In some embodiments, the adhesive area of the film is in glassy state, and the expansion area is an elastomer.",
"According to a second aspect of the present disclosure, a fabrication method for semiconductor device includes: providing a semiconductor wafer, and defining a chip area and a cut area, and forming a cut in the cut area; providing any of the film, and bonding the semiconductor wafer to the film, wherein, the chip area of the wafer corresponds to the adhesive area of the film, and the wafer cut corresponds to the expansion area of the film; dividing the semiconductor wafer into a series of chips along the cut; and applying tensile strength on the film to elongate the expansion area of the film to separate the chips.",
"The other features and advantages of this present disclosure will be described in detail in the following specification, and it is believed that such features and advantages will become more obvious in the specification or through implementations of this disclosure.",
"The purposes and other advantages of the present disclosure can be realized and obtained in the structures specifically described in the specifications, claims and drawings.",
"BRIEF DESCRIPTION OF THE DRAWINGS The accompanying drawings, which are included to provide a further understanding of the disclosure and constitute a part of this specification, together with the embodiments, are therefore to be considered in all respects as illustrative and not restrictive.",
"In addition, the drawings are merely illustrative, which are not drawn to scale.",
"FIG.",
"1 shows a schematic diagram of film expansion for the existing adhesive film.",
"FIG.",
"2 illustrates a top view of a film according to some embodiments of the present disclosure.",
"FIG.",
"3 illustrates a sectional view of a film according to some embodiments of the present disclosure, which is cut along A-A line of FIG.",
"2.FIG.",
"4 shows a variant of the film as shown in FIG.",
"3.FIG.",
"5 shows another variant of the film as shown in FIG.",
"3.FIG.",
"6 illustrates a side sectional view of another film according to some embodiments of the present disclosure.",
"FIG.",
"7 illustrates a side sectional view of another film according to some embodiments of the present disclosure.",
"FIG.",
"8 illustrates a side sectional view of another film according to some embodiments of the present disclosure.",
"FIG.",
"9 illustrates a side sectional view of another film according to some embodiments of the present disclosure.",
"FIG.",
"10 shows a flow diagram of the fabrication method of a semiconductor device according to some embodiments of the present disclosure.",
"FIG.",
"11 shows a step in the procedure of the fabrication method of a semiconductor device according to some embodiments of the present disclosure: providing a semiconductor wafer, and defining a chip area and a cutting area on the wafer.",
"FIG.",
"12 shows a step in the procedure of the fabrication method of a semiconductor device according to some embodiments of the present disclosure: bonding the semiconductor wafer on any of the film as shown in FIG.",
"3-9.FIG.",
"13 shows a step in the procedure of the fabrication method of a semiconductor device according to some embodiments of the present disclosure: cutting the wafer into a series of chips.",
"FIG.",
"14 shows a step in the procedure of the fabrication method of a semiconductor device according to some embodiments of the present disclosure: placing the film together with the chip thereon on a film expansion device, and applying tensile strength on the film for film expansion.",
"FIG.",
"15 shows a step in the procedure of the fabrication method of a semiconductor device according to some embodiments of the present disclosure: In the drawings: 100, existing adhesive film; 200, film of the present disclosure; 200A, adhesive area of the film; 200B, expansion area of the film; 210, base material; 220, adhesive layer; 230, groove; 240, first adhesive layer; 250, elasticity modulus strengthened layer; 300, semiconductor wafer; 310, chip area of the semiconductor wafer/chip; 320, cut; 400, tension device.",
"DETAILED DESCRIPTION The embodiments below provide a film for semiconductor device, which is divided into an adhesive area and an expansion area, wherein, elasticity modulus of the expansion area is less than that of adhesive area; and patterns for elasticity modulus distribution can be consistent with the cutting pattern of the semiconductor device.",
"FIGS.",
"2 and 3 provide a first preferred embodiment of the present disclosure.",
"An adhesive film 200, includes a base material 210 and an adhesive layer 220 thereon, which is divided into an adhesive area 200A and an expansion area 200B, in which, the adhesive area 200A is used for adhering the semiconductor device with elasticity modulus greater than that of the expansion area 200B.",
"Preferably, elasticity modulus of the film 200 under room temperature (in general, 23° C.) is 1-200 MPa, and ratio of elasticity modulus E1 of the adhesive area and elasticity modulus E2 of the expansion area is greater than 1, and preferably 2-200.Specifically, elasticity modulus of the adhesive area E1 prefers to be 100-200 MPa.",
"Elasticity modulus of the expansion area E2 prefers to be 1-100 MPa.",
"In this way, during film extension, the expansion area has far greater tensile deformation quantity than that of the adhesive area, and is not broken.",
"That means, during film stretch, it is mainly elongated by the expansion area, and elongation in the adhesive area can be ignored.",
"Elasticity modulus of the film 200 is mainly dependent on material of the base material 210, which is resin film with good stretchability.",
"In this embodiment, the base material 210 can be polyethylene, propylene random copolymer, propylene block copolymer, noblen, polybutylene, polymethylpentene and other polyolefins, ethylene-vinyl acetate copolymer, ionomer resin, ethylene-(methyl) acrylic acid copolymer, ethylene-(methyl) acrylate copolymer, ethylene-butylene copolymer, ethylene-hexene copolymer, polyurethane, polyethylene glycol terephthalate, polyethylene glycol naphthalate and other polyesters, polycarbonate, polyimide, polyetheretherketone, polyetherimide, polyamide, aromatic polyamide, polyphenylene sulfide, aromatic poly amide, fluorine element, polyvinyl chloride, polyvinylidene chloride, cellulose resin, organopolysiloxane resin, etc.",
"The adhesive layer 220 is used for adhering the semiconductor device, which can be UV curing adhesive.",
"In this embodiment, the adhesive area 200A of the film 200 and the expansion area 200B have same base materials so that connection strength between the adhesive area 200A and the expansion area 200B is big enough.",
"When tensile strength is applied, it is not likely to break at a position between the adhesive area 200A and the expansion area 200B.",
"To make elasticity modulus between the adhesive area 200A of the film and the expansion area 200B different, set the base material thicknesses of the film 200 inconsistent, i.e., the adhesive area 200A is thicker, while the expansion area 200B is thinner so that different areas of a same film have different elasticity modulus.",
"In general, thickness d1 of the base material of the adhesive area 200A can be 5-200 μm, and thickness d2 of the base material of the expansion area 200B is ⅕-⅘ of d1.Preferably, d2 is ⅓-⅔ of d1.During such range, on the one hand, the film 200 has strong adhesive strength and is not easy for break; on the other hand, elasticity modulus of the adhesive area of the film is far larger than that of the expansion area; therefore, during tension process of the film 200, the expansion area 200B is more prone to tensile deformation and provides main elongation deformation quantity.",
"Yet, the adhesive area 200A can hardly produce tensile formation and the elongation deformation quantity is small.",
"This reduces uneven film expansion caused by uneven adhesive layer and also reduces interaction force of the film on the semiconductor device during film stretch.",
"This also decreases the displacement possibility of the device on the film, especially for small-sized devices.",
"The film 200 is mainly used for semiconductor devices, wherein, the pattern for elasticity modulus distribution is mainly designed based on the cutting pattern of the semiconductor device.",
"The expansion area 200B of the film 200 corresponds to the cut of the cutting pattern, whose size is equal to or larger than the cut size; and size a of the adhesive area 200A is mainly set based on the semiconductor device size, which is less than or equal to the semiconductor device size.",
"Preferably, size a of the adhesive area 200A of the film is equal to or is slightly less than the semiconductor device size.",
"In this embodiment, a series of groove structures 230 are formed over the lower surface of the film 200 in grid distribution, wherein, the gird area 200A is the adhesive area, and the grid line area 200B is the expansion area.",
"The expansion area 200B corresponds to the cut of the semiconductor wafer during singularization.",
"The size b can be 5-1,000 μm, and preferably 10-200 μm, which is determined based on specific applications.",
"Set a groove structure 230 in the corresponding base material 210 of the expansion area 200B to reduce elasticity modulus of the expansion area 200B of the film 200 so that elongation deformation mainly occurs in the expansion area 200B when tensile strength is applied on the film.",
"In the aforesaid film formation, form the base material 210 through methods well known in the art such as rolling, tape casting in organic solvent, trapped-air process in an enclosed system, T-shape die extrusion, co-extrusion and dry lamination; next, press the front or back side of the base material by a screen printing plate to form a groove structure so that the expansion area is thinner than the adhesive area; next, coat adhesive composition solution over the base material 210 and dry it to form an adhesive layer 220.The coating method is not particularly restricted and examples thereof include: roller coating, silk screen coating, intaglio coating, etc.",
"FIG.",
"4 shows another film structure of the present disclosure.",
"Difference between this film and the film as shown in FIG.",
"3 is that: the groove structure 230 is different.",
"In this structure, the cross section of the groove structure 230 is arc, and connection strength between the adhesive area and the expansion area of the film is strong to decrease break possibility during film stretch.",
"FIG.",
"5 shows another film structure of the present disclosure.",
"Difference between this film and the film as shown in FIG.",
"3 is that: the groove structure 230 is formed on the front surface of the film.",
"During film stretch, as the back surface of the film is flat and has strong connection strength.",
"This further reduces displacement during device stretch.",
"FIG.",
"6 shows another film structure of the present disclosure.",
"The film 200 includes a base material 210 for connecting the body, a first adhesive layer 240, a strengthened layer 250 and a second adhesive layer 220 thereon.",
"Specifically, the base material 210 is of same material and uniform thickness.",
"Materials can be referred to the aforesaid embodiments.",
"The surface of the base material 210 is divided into an adhesive area 200A and an expansion area 200B, wherein, elasticity modulus E1 of the expansion area is dependent on material of the base material 210, which is 1-200 MPa, and preferably 2-150 MPa; the first adhesive layer 240, the strengthened layer 250 and the second adhesive layer 220 are only formed in the adhesive area 200A of the base material 210, wherein, elasticity modulus 2 of the strengthened layer 250 is far greater than elasticity modulus E1 of the base material 210, preferably above 500 MPa, and more preferably above 1,000 MPa; the material can be glass sheet or metal sheet; adhesive strength between the first adhesive layer 240 and the base material 210 is strong so that the adhesive area 200A of the base material is affected by the strengthened layer 250 during stretch and the elasticity modulus of the adhesive area is close to that of the strengthened layer, and produced tensile deformation quantity is far less than that of the expansion area of the base material; adhesive strength between the second adhesive layer 220 and the curing layer 250 is not necessary strong, which is smaller than required adhesive strength between the first adhesive layer 240 and the base material; therefore, the semiconductor device is easily separated from the film after it is adhered to the film.",
"Material of the second adhesive layer 220 can be referred to the aforesaid embodiments.",
"FIG.",
"7 shows another film structure of the present disclosure.",
"Difference between this film and the film as shown in FIG.",
"6 is that: The strengthened layer 250, made of high-strength film-forming material, is directly formed over the base material 210 with photosensitive resin.",
"After curing, it has good adhesive strength on the base material.",
"The material can be polyurethane.",
"Specific fabrication method includes: form a base material 210 through any of film fabrication methods well known in the art; next, coat a layer of UV curing resin in the adhesive area over the surface of the base material 210, and cure it with UV light to form a strengthened layer 250 with high elasticity modulus; next, coat adhesive composition solution over the strengthened layer 250 to form a film, dry it to form an adhesive layer 220.As adhesive strength between the strengthened layer 250 and the base material 210 is strong and elasticity modulus of the strengthened layer 250 is far greater than that of the base material 210, elasticity modulus of the adhesive area 200A over the base material 210 can be strengthened; when periphery tensile strength is applied on the base material 210, elongation deformation is mainly in the expansion area 200B.",
"While the adhesive area 200A is not easily to produce elongation deformation under the action of the strengthened layer 250, and it is not prone to displacement as adhesive strength between the strengthened layer and the base material is strong.",
"FIG.",
"8 shows another film structure of the present disclosure.",
"In this embodiment, the base material 210 of the film 200 contains light-sensitive material.",
"Elasticity modulus of the film can be locally changed by lighting to achieve 2D patterning elasticity modulus distribution.",
"Specifically, the light-sensitive material can be aliphatic compound with soft segment, which can be PUA (polyurethane acrylate), polyester acrylate, polyether acrylate and polysiloxane acrylic acid, EP (ethoxyline resin), vinyl ether compounds, etc.",
"According to one embodiment, the base material 210 is mainly photo curing material.",
"Control different lighting intensity and time of the adhesive area and the expansion area so that elasticity modulus of the adhesive area is greater than that of the expansion area.",
"In another embodiment, the base material 210 is mainly common resin doped with photosensitive solvent.",
"After curing, locally light the base material to change elasticity modulus of the film locally.",
"Specific lighting area is based on type of the photosensitive solvent.",
"If the photosensitive solvent is high-elongation material whose material elasticity modulus is reduced after lighting, the expansion area is selected for lighting; if the photosensitive solvent is high-strength material whose elasticity modulus is improved after lighting, the adhesive area is selected for lighting.",
"As a variant of the aforesaid embodiment, the base material 210 of the film 200 contains photosensitive resin.",
"Activated thinner is added in the photosensitive resin, wherein, activated thinner content in the adhesive area is higher than that in the expansion area.",
"Therefore, during lighting, curing rate of the adhesive area of the base material is quicker and elasticity modulus after curing is higher.",
"Further, control content of activated thinner of the adhesive area and the expansion area so that the adhesive area of the base material after lighting is in a glassy state and the expansion area is an elastomer with low elasticity modulus.",
"FIG.",
"9 shows another film structure of the present disclosure.",
"In this embodiment, the base material 210 of the film 200 contains thermosetting resin or thermoplastic resin.",
"Elasticity modulus of the film can be locally changed through heating to achieve 2D patterning elasticity modulus distribution.",
"In another embodiment, the base material 210 is mainly thermocuring material or thermoplastic material.",
"Control different heating intensity and time of the adhesive area and the expansion area so that elasticity modulus of the adhesive area is greater than that of the expansion area.",
"In another embodiment, at first, take initial curing for the base material 210, and partially heat the base material to locally change elasticity modulus of the film.",
"Specific lighting area is determined based on the base material.",
"If elasticity modulus of the material is reduced after heating, select the expansion area for lighting; if elasticity modulus of the material is improved after heating, select the adhesive area for lighting.",
"Details are described for the application of the film 200 in combination with the fabrication method of the semiconductor device.",
"FIG.",
"10 shows a flow chart of the fabrication method of a semiconductor device, mainly including steps S100-400.Details are given below in combination with FIGS.",
"11-15.As shown in FIG.",
"11, provide a semiconductor wafer 300, and define a chip area 310 and a cutting area 320 on the wafer 300, and form a cut 320 in the cut area.",
"As shown in FIG.",
"12, bond the aforesaid semiconductor wafer 300 on any of the film 200 as shown in FIGS.",
"3-9.In this embodiment, take the film 200 as shown in FIG.",
"3 as an example for illustration, wherein, the cut corresponds to the expansion area of the film.",
"Certain deviation is allowed as long as a majority of the adhesive area 200A of the film is in the chip area, preferably within 20%.",
"As shown in FIG.",
"13, cut the aforesaid wafer 300 into a series of chips 310 along the cut.",
"As shown in FIG.",
"14, place the film 200 together with the chip 310 thereon on a film expansion device 400, and apply tensile strength on the film 200 for film expansion.",
"Referring to FIGS.",
"12 and 15, size a0 and size a1 of the adhesive area of the film 200 before and after film expansion have little change, yet size b0 and size b1 of the expansion area before and after film expansion differ a lot.",
"This is because that the expansion area 200B of the film 200 is of small thickness (in this embodiment, d10=2 d20), and therefore has small elasticity modulus.",
"During film expansion, elongation deformation of the expansion area 200B is large, and elongation deformation of the adhesive area 200B is small.",
"This reduces displacement of device during film expansion, and thereby guarantees that the device after film expansion can be evenly and orderly arranged on the film.",
"Although specific embodiments have been described above in detail, the description is merely for purposes of illustration.",
"It should be appreciated, therefore, that many aspects described above are not intended as required or essential elements unless explicitly stated otherwise.",
"Various modifications of, and equivalent acts corresponding to, the disclosed aspects of the exemplary embodiments, in addition to those described above, can be made by a person of ordinary skill in the art, having the benefit of the present disclosure, without departing from the spirit and scope of the disclosure defined in the following claims, the scope of which is to be accorded the broadest interpretation so as to encompass such modifications and equivalent structures."
]
] |
Patent_15871224
|
[
[
"POWER SUPPLY APPARATUS",
"A power supply apparatus capable of appropriately supplying electrical power to a power transmission coil even if a foreign object is heated during power supply.",
"The power supply apparatus (100) is provided with a power supply coil (103a) opposing a power-receiving unit (153) provided to a vehicle and supplying power to the power-receiving unit (153), and a casing (103b) accommodating the power supply coil (103a).",
"In the casing (103b), a first cover (202) is formed on a surface of the casing (103b) opposing the power-receiving unit (153), and a second cover (203) opposing the first cover (202) is arranged between the first cover (202) and the power supply coil (103a)."
],
[
"1.An electric supply apparatus configured to contactlessly supply electric power using electromagnetic induction to an electric reception section provided in a vehicle, the electric supply apparatus comprising: an electric supply coil having a ring-shape and a hollow and configured to supply electric power to the electric reception section; a first cover covering the hollow of the electric supply coil, said first cover configured to face the electric reception section; and a second cover covering the hollow of the electric supply coil, said second cover configured to face the electric reception section and being placed between the first cover and the electric supply coil, wherein a part of the second cover is distinct from the first cover, the part of the second cover is between the first cover and the electric supply coil, and at least the part of the second cover has higher heat resistant properties than the first cover.",
"2.The electric supply apparatus according to claim 1, wherein the electric supply apparatus has a space between the first cover and the part of the second cover.",
"3.The electric supply apparatus according to claim 1, wherein the electric supply coil is configured to supply electric power to the electric reception section through the first cover and the part of the second cover.",
"4.The electric supply apparatus according to claim 1, further comprising a casing accommodating the electric supply coil.",
"5.The electric supply apparatus according to claim 4, wherein the casing includes at least the first cover.",
"6.The electric supply apparatus according to claim 5, wherein the casing includes at least the second cover.",
"7.The electric supply apparatus according to claim 5, wherein the first cover forms a part of an out surface of the casing.",
"8.The electric supply apparatus according to claim 1, wherein the first cover has higher load capacity than the second cover.",
"9.The electric supply apparatus according to claim 1, wherein: the first cover has load capacity that allows the first cover to withstand a load of the vehicle applied when the vehicle is placed on the first cover; and the second cover has heat resistant properties that allow the second cover to withstand heat generation of a foreign object existing between the electric reception section and the electric supply coil.",
"10.The electric supply apparatus according to claim 1, wherein the second cover is placed between the first cover and the electric supply coil in a direction of a central axis of the electric supply coil.",
"11.The electric supply apparatus according to claim 1, wherein the first cover includes: a flat portion formed so as to be located above a hollow portion of the electric supply coil; and an incline portion formed in a portion of the first cover being where the electric supply coil is projected when the electric supply coil is projected on the casing toward the electric reception section, and gradually approaching the electric supply coil toward the flat portion in a radial direction of the electric supply coil.",
"12.The electric supply apparatus according to claim 11, wherein: the flat portion is formed so as to cross a central axis of the electric supply coil; the second cover is placed so as to cross the central axis of the electric supply coil; and the second cover has a larger area than the flat portion.",
"13.The electric supply apparatus according to claim 1, wherein the part of the second cover has a smaller area than the first cover.",
"14.The electric supply apparatus according to claim 1, wherein the second cover is concentric to the electric supply coil.",
"15.The electric supply apparatus according to claim 1, further comprising a first reinforcement member that supports the first cover.",
"16.The electric supply apparatus according to claim 15, wherein a space surrounded by the first cover, the second cover, and the first reinforcement member is sealed.",
"17.The electric supply apparatus according to claim 1, further comprising a second reinforcement member that is connected to a bottom portion of the casing and the second cover, that is placed in a hollow portion of the electric supply coil, and that support the second cover.",
"18.The electric supply apparatus according to claim 1, wherein the first cover includes a surface covered with a material having a frictional coefficient less than a predetermined value.",
"19.The electric supply apparatus according to claim 1, wherein the second cover is formed of heat-resistant glass."
],
[
"<SOH> BACKGROUND ART <EOH>A typical known contactless electric supply apparatus is one that is placed on a ground surface and supplies electric power to an electric reception section mounted in a vehicle (for example, Patent Literature (hereinafter, abbreviated as PTL) 1).",
"In PTL 1, two units, i.e., an electric transmission unit and an electric reception section are provided.",
"The electric transmission unit includes a ring-shaped electric transmission coil and a casing that houses this coil, and is placed on a road surface side position where a vehicle stops, such as a parking space.",
"The electric reception section includes a ring-shaped electric reception coil and a casing that houses this coil, and is placed on the bottom surface of the vehicle at a position that faces the electric transmission unit placed on the ground surface.",
"The surface of the casing that faces the electric reception section of the electric transmission unit (hereinafter referred to as “upper surface”) is formed so as to be in parallel with the radial direction of the electric transmission coil."
],
[
"<SOH> SUMMARY OF INVENTION <EOH>"
],
[
"CROSS-REFERENCE TO RELATED APPLICATIONS This is a continuation of U.S. patent application Ser.",
"No.",
"14/387,492 filed on Sep. 23, 2014 which is the National Phase Entry of International Application No.",
"PCT/JP2013/001769 filed on Mar.",
"15, 2013 which claims priority from Japanese Patent Application No.",
"2012-073711 filed on Mar.",
"28, 2012.The contents of these applications are incorporated herein by reference in their entireties.",
"TECHNICAL FIELD The present invention relates to an electric supply apparatus that contactlessly supplies electric power using electromagnetic induction to an electric reception section provided in a vehicle.",
"BACKGROUND ART A typical known contactless electric supply apparatus is one that is placed on a ground surface and supplies electric power to an electric reception section mounted in a vehicle (for example, Patent Literature (hereinafter, abbreviated as PTL) 1).",
"In PTL 1, two units, i.e., an electric transmission unit and an electric reception section are provided.",
"The electric transmission unit includes a ring-shaped electric transmission coil and a casing that houses this coil, and is placed on a road surface side position where a vehicle stops, such as a parking space.",
"The electric reception section includes a ring-shaped electric reception coil and a casing that houses this coil, and is placed on the bottom surface of the vehicle at a position that faces the electric transmission unit placed on the ground surface.",
"The surface of the casing that faces the electric reception section of the electric transmission unit (hereinafter referred to as “upper surface”) is formed so as to be in parallel with the radial direction of the electric transmission coil.",
"CITATION LIST Patent Literature PTL 1 Japanese Patent Application Laid-Open No.",
"2011-10435 SUMMARY OF INVENTION Technical Problem In the electric supply apparatus according to the related art, however, it is likely that a foreign object is put on the upper surface of the electric transmission unit because the surface of the electric transmission unit is in parallel with the radial direction of the transmission coil.",
"The foreign object on the upper surface involves a problem in that the foreign object is heated to a high temperature by a magnetic flux penetrating the foreign object during electric supply.",
"Moreover, the foreign object heated to a high temperature may cause, for example, a hole at a portion in contact with the foreign object and damage the upper surface.",
"Consequently, the foreign object or the like entering from the damaged portion falls onto the electric transmission coil.",
"This heated foreign object may melt a coating film of a metallic thin wire included in the electric transmission coil and may cause a short circuit between portions of the metallic thin wire of the electric transmission coil.",
"It is an object of the present invention to provide an electric supply apparatus that can prevent a foreign object from reaching an electric transmission coil and that can appropriately perform an electric supply process even when the foreign object is heated during electric supply.",
"Solution to Problem An electric supply apparatus according to an aspect of the present invention is an apparatus that contactlessly supplies electric power using electromagnetic induction to an electric reception section provided in a vehicle, the apparatus including: a ring-shaped electric supply coil that faces the electric reception section and that supplies electric power to the electric reception section; and a casing that houses the electric supply coil, in which the casing includes: a first cover formed on a surface of the casing, the surfacing facing the electric reception section; and a second cover facing the first cover and being placed between the first cover and the electric supply coil.",
"Advantageous Effects of Invention According to the present invention, it is possible to prevent a foreign object from reaching an electric transmission coil and thus to appropriately perform an electric supply process even when the foreign object is heated during electric supply.",
"BRIEF DESCRIPTION OF DRAWINGS FIG.",
"1 is a block diagram illustrating an example of the configuration of a charging system according to Embodiment 1 of the present invention; FIG.",
"2 is a perspective view of an electric supply section according to Embodiment 1 of the present invention; FIG.",
"3 is a plane view of FIG.",
"2; FIG.",
"4 is a sectional view taken along line A-A in FIG.",
"2; FIG.",
"5 is a sectional view taken along line B-B in FIG.",
"2; and FIG.",
"6 is a sectional view taken along line C-C in FIG.",
"2.DESCRIPTION OF EMBODIMENTS Hereafter, an embodiment of the present invention will be described in detail with reference to the accompanying drawings.",
"Embodiment 1 Configuration of Charging System FIG.",
"1 is a block diagram illustrating an example of the configuration of charging system 10 in Embodiment 1 of the present invention.",
"Charging system 10 includes electric supply apparatus 100, vehicle 150, storage battery 154, and charging apparatus 170.Electric supply apparatus 100 is placed on a ground surface or buried so that electric supply section 103 is exposed from land surface g. Electric supply apparatus 100 is provided, for example, in a parking space and supplies electric power to charging apparatus 170 while facing electric reception section 153, during parking of vehicle 150.The configuration of electric supply apparatus 100 will be described below.",
"Vehicle 150 includes storage battery 154 and charging apparatus 170, and runs with storage battery 154 as a power source.",
"Vehicle 150 is, for example, an automobile that can run with the electric power of storage battery 154 such as an HEV (Hybrid Electric Vehicle), a PHEV (Plug-in Hybrid Electric Vehicle), or an EV (Electric Vehicle).",
"Storage battery 154 stores the electric power supplied from charging apparatus 170.Charging apparatus 170 includes vehicle side control section 151 and electric reception apparatus 160, and supplies the electric power supplied from electric supply apparatus 100, to storage battery 154.The configuration of charging apparatus 170 will be described below in detail.",
"Vehicle side control section 151 controls electric reception apparatus 160 to perform various processes associated with charging or various processes associated with the stop of charging.",
"Electric reception apparatus 160 supplies the electric power supplied from electric supply apparatus 100, to storage battery 154 according to the control of vehicle side control section 151.The configuration of electric reception apparatus 160 will be described below.",
"Configuration of Electric Supply Apparatus Electric supply apparatus 100 includes electric supply side communication section 101, electric supply side control section 102, and electric supply section 103.Electric supply side communication section 101 receives an electric supply start signal or an electric supply stop signal from vehicle side communication section 152.Electric supply side communication section 101 outputs the received electric supply start signal or electric supply stop signal to electric supply side control section 102.Electric supply side control section 102 controls electric supply section 103 to start electric supply according to the electric supply start signal inputted from electric supply side communication section 101.Electric supply side control section 102 controls electric supply section 103 to stop electric supply according to the electric supply stop signal inputted from electric supply side communication section 101.Electric supply section 103 includes electric supply coil 103a.",
"Electric supply section 103 supplies the current having a predetermined frequency to electric supply coil 103a according to the control of electric supply side control section 102 to thereby supply electric power using electromagnetic induction to electric reception section 153.This electric supply is performed in an electromagnetic induction system or a magnetic resonance system, for example.",
"The configuration of electric supply section 103 will be described below in detail.",
"Configuration of Electric Reception Apparatus Electric reception apparatus 160 includes vehicle side communication section 152 and electric reception section 153.Vehicle side communication section 152 generates a charging start signal or a charging stop signal according to control of vehicle side control section 151, and transmits the generated charging start signal or charging stop signal to electric supply side communication section 101.Electric reception section 153 is provided at the bottom portion of vehicle 150.Electric reception section 153 includes electric reception coil 153a and contactlessly faces electric supply section 103 when storage battery 154 is charged.",
"Electric reception section 153 supplies the electric power, which is supplied from electric supply section 103 to electric reception coil 153a, to storage battery 154 according to the control of vehicle side control section 151.Configuration of Electric Supply Section FIG.",
"2 is a perspective view of electric supply section 103, and FIG.",
"3 is a plane view of electric supply section 103 viewed from the direction of electric reception section 153.FIG.",
"4 is a sectional view taken along line A-A in FIG.",
"2, FIG.",
"5 is a sectional view taken along line B-B in FIG.",
"2, and FIG.",
"6 is a sectional view taken along line C-C in FIG.",
"2.Hereinafter, the configuration of electric supply section 103 will be described mainly with reference to FIG.",
"2 and FIG.",
"4.Electric supply section 103 includes electric supply coil 103a and casing 103b.",
"Electric supply coil 103a is of a hollow ring shape and placed on inner bottom surface (base) 201 of casing 103b.",
"Electric supply coil 103a is connected, for example, to a commercial power source and supplies electric power to electric reception section 153 by supplying a current from this power source.",
"Electric supply coil 103a is formed, for example, by winding a metallic thin wire.",
"Casing 103b includes base 201, first cover 202, and second cover 203.Base 201 is formed, for example, in a square flat plate shape (for example, see FIG.",
"3).",
"Base 201 is formed of a material, such as aluminum.",
"Electric supply coil 103a is placed on base 201, and first cover 202 and second cover 203 are attached to base 201.When first cover 202 and second cover 203 are attached to base 201, casing 103b has first cover 202 on a surface that faces electric reception section 153, and has second cover 203 that faces first cover 202 between first cover 202 and electric supply coil 103a in the direction of central axis P1 of electric supply coil 103a.",
"First cover 202 is formed of, for example, a nonmetallic material, such as a reinforced plastic, having load capacity.",
"For example, first cover 202 may have such load capacity that no damage is caused even when vehicle 150 expected to use electric supply apparatus 100 is mounted on first cover 202.In first cover 202: flat portion 202a and incline portion 202b are each formed as a portion of the surface of casing 103b, which faces electric reception section 153; flat portion 202c is formed as a portion other than flat portion 202a and incline portion 202b on the surface of casing 103b, which faces electric reception section 153; side portion 202d in connection with incline portion 202b and flat portion 202c is formed; and side portion 202e connected to flat portion 202c and base 201 is formed.",
"Flat portion 202a is formed so as to have one end connected to incline portion 202b.",
"When casing 103b is placed on a ground surface, flat portion 202a is formed so as to be located above a hollow portion of electric supply coil 103a.",
"Flat portion 202a is also formed so as to cross central axis P1 of electric supply coil 103a.",
"Incline portion 202b is formed so as to have one end connected to side portion 202d and the other end connected to flat portion 202a.",
"Incline portion 202b is formed in a portion where electric supply coil 103a is projected when electric supply coil 103a is projected on casing 103b toward electric reception section 153, and so as to gradually approach electric supply coil 103a toward flat portion 202a in the radial direction of electric supply coil 103a.",
"Note that, the radial direction of electric supply coil 103a is a direction orthogonal to central axis P1 of electric supply coil 103a.",
"Second cover 203 is formed of, for example, a heat-resistant material, such as heat-resistant glass.",
"Second cover 203 is attached, for example, by first reinforcement member 204.Second cover 203 is also placed between first cover 202 and electric supply coil 103a in the direction of central axis P1 of electric supply coil 103a so as to face first cover 202.For example, second cover 203 is also concentric to electric supply coil 103a and is placed so as to cross central axis P1.The space surrounded by first cover 202, second cover 203, and first reinforcement member 204 is sealed.",
"Even when a heated foreign object stops at second cover 203 after melting first cover 202 and falling off, entering of water such as rain through the hole made in first cover 202 may cause a short circuit between portions of metallic thin wire in electric supply coil 103a.",
"In this regard, sealing the space as described above makes it possible to avoid a situation where water or the like reaches electric supply coil 103a when rain water or the like enters from outside.",
"First reinforcement member 204 is formed so as to have one end connected to first cover 202 and the other end connected to second cover 203.First reinforcement member 204 attaches second cover 203 to first cover 202 as described above and also supports first cover 202.This can secure the withstand load of first cover 202.First reinforcement member 204 is formed, for example, of an insulator.",
"Second reinforcement member 205 is formed so as to have one end connected to second cover 203 and the other end connected to base 201.Second reinforcement member 205 is also placed in the hollow portion of electric supply coil 103a.",
"That is, second reinforcement member 205 supports second cover 203.This can secure the withstand load of second cover 203.Second reinforcement member 205 is formed, for example, of an insulator.",
"Advantageous Effect of Present Embodiment In the present embodiment, first cover 202 is formed on the surface of the casing 103, which faces electric reception section 153.Second cover 203 is placed between first cover 202 and electric supply coil 103a in the direction of central axis P1 of electric supply coil 103a.",
"That is, casing 103b has a dual structure of first cover 202 and second cover 203.Generally, the heat-resistant material used for second cover 203 is a fragile material such as heat-resistant glass.",
"In considering a situation where vehicle 150 is put on first cover 202, it is not preferable to use such a heat-resistant material for first cover 202.For this reason, in the present embodiment, the part of first cover 202 which is on the outer side of the casing and on which the tire of vehicle 150 may be put is formed of a member having high load capacity such as reinforced plastic, and the part of second cover 203 which is formed of a heat-resistant material is placed between first cover 202 and electric supply coil 103a.",
"These covers provide a dual structure.",
"This configuration enables electric supply apparatus 100 providing both load capacity and heat resistance.",
"Even when a foreign object on first cover 202 is heated and melts first cover 202, the foreign object falls onto second cover 203.Second cover 203 is heat-resistant as described above.",
"Therefore, even if the foreign object heated to a high temperature falls onto second cover 203, second cover 203 does not melt.",
"Consequently, the foreign object does not contact electric supply coil 103a.",
"As a result, even when a foreign object is, for example, heated during electric supply and damages first cover 202, the foreign object does not reach electric supply coil 103a.",
"Thereby, the heated foreign object can be prevented from falling onto electric supply coil 103a and melting a coating film of a metallic thin wire included in electric supply coil 103a to cause a short circuit between portions of the metallic thin wire of electric supply coil 103a.",
"Thus, an electric supply process can be performed appropriately.",
"Moreover, in the present embodiment, the heated foreign object does not melt heat-resistant second cover 203.If a hole is made in the cover by heat of the foreign object and exposes the electric supply coil, a human body or the like can contact the electric supply coil, which results in a security problem.",
"With regard to this problem, in the present embodiment, the heated foreign object stops at second cover 203, and there is no chance to expose electric supply coil 103a.",
"This provides an additional advantageous effect in that electric supply apparatus 100 having high security can be provided.",
"Moreover, in the present embodiment, in first cover 202, incline portion 202b that gradually approaches electric supply coil 103a toward flat portion 202a in the radial direction of electric supply coil 103a is formed in a portion of casing 103b on which electric supply coil 103a is projected when electric supply coil 103a is projected on casing 103b toward electric reception section 153.Thereby, a foreign object on incline portion 202b slides down into flat portion 202a that faces the hollow portion of electric supply coil 103a.",
"Since flat portion 202a is distant from the position corresponding to intermediate position 213 between inner edge portion 211 and outer circumference 212 of electric supply coil 103a, the foreign object on flat portion 202a is not easily heated.",
"This can prevent the foreign object from being heated to a high temperature and thereby damaging first cover 202.Furthermore, in the present embodiment, as illustrated in FIG.",
"4, second cover 203 may have a smaller area than the area of first cover 202.A smaller area of second cover 203 enables first reinforcement member 204 used also for attachment of second cover 203 to be placed at a position closer to the center of casing 103b in the radial direction of electric supply coil 103a.",
"This can appropriately set the location of first reinforcement member 204.For example, in comparison with the case (not illustrated) where first reinforcement member 204 is connected near side portion 202d on incline portion 202b, first cover 202 can be supported more stably in the case where first reinforcement member 204 is connected near the center of incline portion 202b (for example, see FIG.",
"4).",
"This can secure a higher withstand load of first cover 202.The location of first reinforcement member 204 may be determined, for example, in consideration of both the viewpoint of the reinforcement for first cover 202 and the viewpoint of protection of a foreign object by second cover 203.Meanwhile, as illustrated in FIG.",
"4 in this case, in a region outside the connection point to first reinforcement member 204 in first cover 202, second cover 203 is not placed in the direction of central axis P1 of electric supply coil 103a.",
"However, the region in which second cover 203 is not placed in first cover 202 in the direction of central axis P1 of electric supply coil 103a corresponds to incline portion 202b, so that it is unlikely that a foreign object stays in the region.",
"Furthermore, the region in which second cover 203 is not placed in the direction of central axis P1 of electric supply coil 103a is distant from electric supply coil 103a in comparison with the region in which second cover 203 is placed.",
"Therefore, in the region in which second cover 203 is not placed in first cover 202 in the direction of central axis P1 of electric supply coil 103a, even if a foreign object exists, the foreign object is not easily heated.",
"From the above, even if the region in which second cover 203 is not placed in first cover 202 in the direction of central axis P1 of electric supply coil 103a exists, it is unlikely that a foreign object is heated to a high temperature and thereby damages first cover 202.Moreover, in the present embodiment, first cover 202 (in particular incline portion 202b) may be covered with a protective cover coated with a material having a frictional coefficient less than a predetermined value.",
"For example, the predetermined value may be set to approximately a value that makes a foreign object on first cover 202 slidable.",
"This enables a foreign object to readily slide on first cover 202 and to surely slide down into flat portion 202a.",
"The disclosure of the specification, drawings, and abstract in Japanese Patent Application No.",
"2012-073711 filed on Mar.",
"28, 2012, is incorporated herein by reference in its entirety.",
"INDUSTRIAL APPLICABILITY An electric supply apparatus according to the present invention is suitable for contactlessly supplying electric power to an electric reception section provided in a vehicle.",
"REFERENCE SIGNS LIST 103 Electric supply section 103a Electric supply coil 103b Casing 153 Electric reception section 201 Base 202 First cover 202a, 202c Flat portions 202b Incline portion 202d, 202e Side portions 203 Second cover 204 First reinforcement member 205 Second reinforcement member 211 Inner edge portion 212 Outer circumference 213 Intermediate position"
]
] |
Patent_15871226
|
[
[
"REVERSION OF SYSTEM OBJECTS AFFECTED BY A MALWARE",
"A computerized method of reverting system data affected by a malware.",
"The method comprises monitoring, in run time, a plurality of events of a plurality of processes executed by an operating system (OS) running on a computing device, logging in an event log, in run time, the plurality of events, classifying, in run time, a first process of the plurality of processes as a malware, identifying a set of events of the first process from the plurality of events using the event log, and reverting, in response to the classification, at least one system object hosted in the computing device to remove an effect of the set of events on the OS."
],
[
"1.A computerized method of reverting system data effected by a malware, comprising: monitoring, in run time, a plurality of events of a plurality of processes executed by an operating system (OS) running on a computing device: logging in an event log, in run time, said plurality of events; classifying, in run time, a first process of said plurality of processes as a malware; identifying a set of events of said first process from said plurality of events using said event log; and reverting, in response to said classification, at least one system object hosted in said computing device to remove an effect of said set of events on said OS.",
"2.The computerized method of claim 1, wherein said classifying comprises calculating a plurality of scores each for another of said plurality of processes according to an analysis of respective associated events from said plurality of events in run time and performing said classifying according to said plurality of scores.",
"3.The computerized method of claim 2, wherein said reverting comprises a reverting action selected according to a score from said plurality of scores of said first score.",
"4.The computerized method of claim 1, wherein said reverting comprises deleting a file added by said first process.",
"5.The computerized method of claim 1, wherein said reverting comprises deleting said at least one system object; further comprising identifying a regeneration of said at least one system object and preemptively blocking said regeneration.",
"6.The computerized method of claim 1, wherein said reverting comprises deleting a registry value added by said first process.",
"7.The computerized method of claim 1, wherein said reverting comprises disabling said first process.",
"8.The computerized method of claim 1, wherein said reverting comprises identifying a match between said at least one system object and at least one system object template and using said at least one system object template to revert said at least one system object for removing said effect on said OS.",
"9.The computerized method of claim 8, wherein said at least one system object template is at least one specific system object template adapted for said OS.",
"10.The computerized method of claim 8, wherein said at least one system object template is at least one generic system object template adapted for an update version of said OS.",
"11.A computer readable medium comprising computer executable instructions adapted to perform the method of claim 1.12.A system of reverting system data effected by a malware, comprising: a memory hosting a an event log wherein a; a processor; a threat monitoring module which monitors, in run time, a plurality of events of a plurality of processes executed by an installed operating system (OS) running on a computing device and logs said plurality of events in said event log, said threat monitoring module uses said processor to classify, in run time, a first process of said plurality of processes as a malware and to identify a set of events of said first process from said plurality of events using said event log; and a data reverting module which reverts at least one system object hosted in said computing device and affected by said set of events in response to said classification.",
"13.The system of claim 12, further comprising a generic template database which stores a plurality generic system object templates of a plurality of different versions of an operating system, said data reverting module selects at least one of said plurality generic system object templates for a replacement of said at least one system object according to a version of said installed OS.",
"14.The system of claim 12, further comprising a specific template database which stores a plurality specific system object templates generated to replicate a plurality of different system objects of said installed OS, said data reverting module selects at least one of said plurality specific system object templates for a replacement of said at least one system object.",
"15.A computerized method of repairing damage caused by malware operations, comprising: monitoring in run time a plurality of events of a plurality of processes executed by an operating system (OS) running on a computing device: classifying, in run time, a first process of said plurality of processes as a malware by an analysis of a set of events associated with said first process from said plurality of events; detecting, in run time, an additional event performed by said first process on said computing device; and reverting at least one system object hosted in said computing device and affected by said additional event.",
"16.A computer program product for reverting system data effected by a malware, comprising: a computer readable storage medium; first program instructions to monitor, in run time, a plurality of events of a plurality of processes executed by an operating system (OS) running on said computing device: second program instructions to log in an event log, in run time, said plurality of events; third program instructions to classify, in run time, a first process of said plurality of processes as a malware; fourth program instructions to identify a set of events of said first process from said plurality of events using said event log; and fifth program instructions to revert, in response to said classification, at least one system object hosted in said computing device to remove an effect of said set of events on said OS wherein said first, second, third, fourth, and fifth program instructions are stored on said computer readable storage medium."
],
[
"<SOH> FIELD AND BACKGROUND OF THE INVENTION <EOH>The present invention, in some embodiments thereof, relates to malicious activity detection and/or handling and, more specifically, but not exclusively, to systems and methods of malicious activity detection and/or handling based on event monitoring.",
"Conventional anti-virus (AV) applications attempt to prevent harmful or malicious transmissions such as viruses and worms from infiltrating a computing device.",
"Typically, such applications operate on a network gateway or host and monitor incoming traffic.",
"Conventional AV applications, whether server or host based typically rely on a so-called fingerprint matching implementation.",
"Such a fingerprint matching mechanism aggregates a set of unique indicators, or signatures, exhibited by known malicious transmissions.",
"The unique indicators typically represent portions of files which a particular AV vendor has previously identified as malicious, such as a signature copy and used from a particular byte range in the file, or a hash computed over a predetermined portion of a file.",
"The result is a signature value substantially shorter that the entity (file) it represents yet which has a high likelihood of matching a signature computed from another similar instance of the file.",
"A set of signatures of known malicious transmissions is readily comparable to an incoming transmission to determine malicious content in the incoming transmission.",
"During the last years system and methods for integration of behavioral and signature based security have been developed."
],
[
"<SOH> SUMMARY OF THE INVENTION <EOH>According to some embodiments of the present invention, there is provided a computerized method of reverting system data affected by a malware.",
"The method comprises monitoring, in run time, a plurality of events of a plurality of processes executed by an operating system (OS) running on a computing device, logging in an event log, in run time, the plurality of events, classifying, in run time, a first process of the plurality of processes as a malware, identifying a set of events of the first process from the plurality of events using the event log, and reverting, in response to the classification, at least one system object hosted in the computing device to remove an effect of the set of events on the OS.",
"Optionally, the classifying comprises calculating a plurality of scores each for another of the plurality of processes according to an analysis of respective associated events from the plurality of events in run time and performing the classifying according to the plurality of scores.",
"More optionally, the reverting comprises a reverting action selected according to a score from the plurality of scores of the first score.",
"Optionally, the reverting comprises deleting a file added by the first process.",
"Optionally, the reverting comprises deleting the at least one system object; further comprising identifying a regeneration of the at least one system object and preemptively blocking the regeneration.",
"Optionally, the reverting comprises deleting a registry value added by the first process.",
"Optionally, the reverting comprises disabling the first process.",
"Optionally, the reverting comprises identifying a match between the at least one system object and at least one system object template and using the at least one system object template to revert the at least one system object for removing the effect on the OS.",
"The computerized method of claim 8 , wherein the at least one system object template is at least one specific system object template adapted for the OS.",
"More optionally, the at least one system object template is at least one generic system object template adapted for an update version of the OS.",
"According to some embodiments of the present invention, there is provided a system of reverting system data affected by a malware.",
"The system comprises a memory hosting a an event log wherein a, a processor, a threat monitoring module which monitors, in run time, a plurality of events of a plurality of processes executed by an installed operating system (OS) running on a computing device and logs the plurality of events in the event log, the threat monitoring module uses the processor to classify, in run time, a first process of the plurality of processes as a malware and to identify a set of events of the first process from the plurality of events using the event log, and a data reverting module which reverts at least one system object hosted in the computing device and affected by the set of events in response to the classification.",
"Optionally, the system comprises a generic template database which stores a plurality generic system object templates of a plurality of different versions of an operating system, the data reverting module selects at least one of the plurality generic system object templates for a replacement of the at least one system object according to a version of the installed OS.",
"Optionally, the system comprises a specific template database which stores a plurality specific system object templates generated to replicate a plurality of different system objects of the installed OS, the data reverting module selects at least one of the plurality specific system object templates for a replacement of the at least one system object.",
"According to some embodiments of the present invention, there is provided a computerized method of repairing damage caused by malware operations.",
"The method comprises monitoring in run time a plurality of events of a plurality of processes executed by an operating system (OS) running on a computing device, classifying, in run time, a first process of the plurality of processes as a malware by an analysis of a set of events associated with the first process from the plurality of events, detecting, in run time, an additional event performed by the first process on the computing device, and reverting at least one system object hosted in the computing device and affected by the additional event.",
"Unless otherwise defined, all technical and/or scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which the invention pertains.",
"Although methods and materials similar or equivalent to those described herein can be used in the practice or testing of embodiments of the invention, exemplary methods and/or materials are described below.",
"In case of conflict, the patent specification, including definitions, will control.",
"In addition, the materials, methods, and examples are illustrative only and are not intended to be necessarily limiting."
],
[
"RELATED APPLICATION This application is a continuation of U.S. patent application Ser.",
"No.",
"14/468,374, filed on Aug. 26, 2014, which claims the benefit of priority from U.S.",
"Provisional Patent Application No.",
"61/869,775 filed on Aug. 26, 2013.The contents of the above applications are all incorporated by reference as if fully set forth herein in their entirety.",
"FIELD AND BACKGROUND OF THE INVENTION The present invention, in some embodiments thereof, relates to malicious activity detection and/or handling and, more specifically, but not exclusively, to systems and methods of malicious activity detection and/or handling based on event monitoring.",
"Conventional anti-virus (AV) applications attempt to prevent harmful or malicious transmissions such as viruses and worms from infiltrating a computing device.",
"Typically, such applications operate on a network gateway or host and monitor incoming traffic.",
"Conventional AV applications, whether server or host based typically rely on a so-called fingerprint matching implementation.",
"Such a fingerprint matching mechanism aggregates a set of unique indicators, or signatures, exhibited by known malicious transmissions.",
"The unique indicators typically represent portions of files which a particular AV vendor has previously identified as malicious, such as a signature copy and used from a particular byte range in the file, or a hash computed over a predetermined portion of a file.",
"The result is a signature value substantially shorter that the entity (file) it represents yet which has a high likelihood of matching a signature computed from another similar instance of the file.",
"A set of signatures of known malicious transmissions is readily comparable to an incoming transmission to determine malicious content in the incoming transmission.",
"During the last years system and methods for integration of behavioral and signature based security have been developed.",
"SUMMARY OF THE INVENTION According to some embodiments of the present invention, there is provided a computerized method of reverting system data affected by a malware.",
"The method comprises monitoring, in run time, a plurality of events of a plurality of processes executed by an operating system (OS) running on a computing device, logging in an event log, in run time, the plurality of events, classifying, in run time, a first process of the plurality of processes as a malware, identifying a set of events of the first process from the plurality of events using the event log, and reverting, in response to the classification, at least one system object hosted in the computing device to remove an effect of the set of events on the OS.",
"Optionally, the classifying comprises calculating a plurality of scores each for another of the plurality of processes according to an analysis of respective associated events from the plurality of events in run time and performing the classifying according to the plurality of scores.",
"More optionally, the reverting comprises a reverting action selected according to a score from the plurality of scores of the first score.",
"Optionally, the reverting comprises deleting a file added by the first process.",
"Optionally, the reverting comprises deleting the at least one system object; further comprising identifying a regeneration of the at least one system object and preemptively blocking the regeneration.",
"Optionally, the reverting comprises deleting a registry value added by the first process.",
"Optionally, the reverting comprises disabling the first process.",
"Optionally, the reverting comprises identifying a match between the at least one system object and at least one system object template and using the at least one system object template to revert the at least one system object for removing the effect on the OS.",
"The computerized method of claim 8, wherein the at least one system object template is at least one specific system object template adapted for the OS.",
"More optionally, the at least one system object template is at least one generic system object template adapted for an update version of the OS.",
"According to some embodiments of the present invention, there is provided a system of reverting system data affected by a malware.",
"The system comprises a memory hosting a an event log wherein a, a processor, a threat monitoring module which monitors, in run time, a plurality of events of a plurality of processes executed by an installed operating system (OS) running on a computing device and logs the plurality of events in the event log, the threat monitoring module uses the processor to classify, in run time, a first process of the plurality of processes as a malware and to identify a set of events of the first process from the plurality of events using the event log, and a data reverting module which reverts at least one system object hosted in the computing device and affected by the set of events in response to the classification.",
"Optionally, the system comprises a generic template database which stores a plurality generic system object templates of a plurality of different versions of an operating system, the data reverting module selects at least one of the plurality generic system object templates for a replacement of the at least one system object according to a version of the installed OS.",
"Optionally, the system comprises a specific template database which stores a plurality specific system object templates generated to replicate a plurality of different system objects of the installed OS, the data reverting module selects at least one of the plurality specific system object templates for a replacement of the at least one system object.",
"According to some embodiments of the present invention, there is provided a computerized method of repairing damage caused by malware operations.",
"The method comprises monitoring in run time a plurality of events of a plurality of processes executed by an operating system (OS) running on a computing device, classifying, in run time, a first process of the plurality of processes as a malware by an analysis of a set of events associated with the first process from the plurality of events, detecting, in run time, an additional event performed by the first process on the computing device, and reverting at least one system object hosted in the computing device and affected by the additional event.",
"Unless otherwise defined, all technical and/or scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which the invention pertains.",
"Although methods and materials similar or equivalent to those described herein can be used in the practice or testing of embodiments of the invention, exemplary methods and/or materials are described below.",
"In case of conflict, the patent specification, including definitions, will control.",
"In addition, the materials, methods, and examples are illustrative only and are not intended to be necessarily limiting.",
"BRIEF DESCRIPTION OF THE SEVERAL VIEWS OF THE DRAWINGS Some embodiments of the invention are herein described, by way of example only, with reference to the accompanying drawings.",
"With specific reference now to the drawings in detail, it is stressed that the particulars shown are by way of example and for purposes of illustrative discussion of embodiments of the invention.",
"In this regard, the description taken with the drawings makes apparent to those skilled in the art how embodiments of the invention may be practiced.",
"In the drawings: FIG.",
"1 is a flowchart of a method of identifying events of a malware process, based on a process score and/or thread score and/or event score, according to some embodiments of the present invention; FIG.",
"2 is a schematic illustration of a system of reverting target one or more system object(s) affected by malware events in a computing device, according to some embodiments of the present invention; FIG.",
"3 is a flowchart of a process for selecting a generic system object or a specific system object for replacing a damaged system object, according to some embodiments of the present invention; and FIG.",
"4 is a flowchart of a process for selecting a generic operating system object or a specific operating system object for replacing a damaged operating system object, according to some embodiments of the present invention.",
"DESCRIPTION OF SPECIFIC EMBODIMENTS OF THE INVENTION The present invention, in some embodiments thereof, relates to malicious activity detection and/or handling and, more specifically, but not exclusively, to systems and methods of malicious activity detection and/or handling based on event monitoring.",
"According to an aspect of some embodiments of the present invention there are provided methods and systems of remediating a malware infected system by identifying logged events of a process classified as a malware and reverting one or more system object(s) affected by these events.",
"The methods and systems involve continuously monitoring events of a plurality of processes executed by or using a target system hosted on a computing device, for example an operating system or a file system, detecting a process classified as a malware, for example based on a run time scoring, and reverting system objects affected by the events of the classified process.",
"The system objects may be files, registry values, and setting values of a target system.",
"According to an aspect of some embodiments of the present invention, there are provided methods and systems for identifying, in run time, an event performed by a process classified as a malware and reverting, in run time, the effect thereof on one or more system objects.",
"As used herein, a process classified as a malware may be a process scored with a score indicative of a probability of being a malware above a threshold, optionally predefined.",
"Optionally, the reversion of system objects affected by the classified process in any of the above outlined embodiments is performed using generic or specific system object templates stored in one or more database(s), for example local or remote databases.",
"For example, system object templates may be generic system object templates based on uninfected reference files and/or values (e.g.",
"registry or setting) of an operating system.",
"Optionally, the database stores system object templates of system objects from different versions of an operating system and/or from different operating systems.",
"Additionally or alternatively, the database stores specific system object templates which are based on system objects of an operating system adapted after the installation thereof on the monitored computing device.",
"In use, system objects affected by the classified process are replaced with matching system objects from the database(s).",
"Optionally, the reverting is performed by reversion operations adapted to the level of the treat from the classified process and/or the score of the classified process.",
"The above reversion methods and systems allow “healing” (or mending) a target system infected with a malware regardless of the removal of the malware and/or the deletions of malware files.",
"The above reversion methods and systems treat damaged system objects, such as file, and does not just delete or quarantine infected files.",
"The reversion operations are designated to be performed after a malicious activities are completed and/or during the performance of malicious activities.",
"The reversion operations may not triggered in response to identification of a signature of a process but rather on a score that is given thereto from an analysis of its events.",
"Before explaining at least one embodiment of the invention in detail, it is to be understood that the invention is not necessarily limited in its application to the details of construction and the arrangement of the components and/or methods set forth in the following description and/or illustrated in the drawings and/or the Examples.",
"The invention is capable of other embodiments or of being practiced or carried out in various ways.",
"As will be appreciated by one skilled in the art, aspects of the present invention may be embodied as a system, method or computer program product.",
"Accordingly, aspects of the present invention may take the form of an entirely hardware embodiment, an entirely software embodiment (including firmware, resident software, micro-code, etc.)",
"or an embodiment combining software and hardware aspects that may all generally be referred to herein as a “circuit”, “module” or “system”.",
"Furthermore, aspects of the present invention may take the form of a computer program product embodied in one or more computer readable medium(s) having computer readable program code embodied thereon.",
"Any combination of one or more computer readable medium(s) may be utilized.",
"The computer readable medium may be a computer readable signal medium or a computer readable storage medium.",
"A computer readable storage medium may be, for example, but not limited to, an electronic, magnetic, optical, electromagnetic, infrared, or semiconductor system, apparatus, or device, or any suitable combination of the foregoing.",
"More specific examples (a non-exhaustive list) of the computer readable storage medium would include the following: an electrical connection having one or more wires, a portable computer diskette, a hard disk, a random access memory (RAM), a read-only memory (ROM), an erasable programmable read-only memory (EPROM or Flash memory), an optical fiber, a portable compact disc read-only memory (CD-ROM), an optical storage device, a magnetic storage device, or any suitable combination of the foregoing.",
"In the context of this document, a computer readable storage medium may be any tangible medium that can contain, or store a program for use by or in connection with an instruction execution system, apparatus, or device.",
"A computer readable signal medium may include a propagated data signal with computer readable program code embodied therein, for example, in baseband or as part of a carrier wave.",
"Such a propagated signal may take any of a variety of forms, including, but not limited to, electro-magnetic, optical, or any suitable combination thereof.",
"A computer readable signal medium may be any computer readable medium that is not a computer readable storage medium and that can communicate, propagate, or transport a program for use by or in connection with an instruction execution system, apparatus, or device.",
"Program code embodied on a computer readable medium may be transmitted using any appropriate medium, including but not limited to wireless, wireline, optical fiber cable, RF, etc., or any suitable combination of the foregoing.",
"Computer program code for carrying out operations for aspects of the present invention may be written in any combination of one or more programming languages, including an object oriented programming language such as Java, Smalltalk, C++ or the like and conventional procedural programming languages, such as the “C” programming language or similar programming languages.",
"The program code may execute entirely on the user's computer, partly on the user's computer, as a stand-alone software package, partly on the user's computer and partly on a remote computer or entirely on the remote computer or server.",
"In the latter scenario, the remote computer may be connected to the user's computer through any type of network, including a local area network (LAN) or a wide area network (WAN), or the connection may be made to an external computer (for example, through the Internet using an Internet Service Provider).",
"Aspects of the present invention are described below with reference to flowchart illustrations and/or block diagrams of methods, apparatus (systems) and computer program products according to embodiments of the invention.",
"It will be understood that each block of the flowchart illustrations and/or block diagrams, and combinations of blocks in the flowchart illustrations and/or block diagrams, can be implemented by computer program instructions.",
"These computer program instructions may be provided to a processor of a general purpose computer, special purpose computer, or other programmable data processing apparatus to produce a machine, such that the instructions, which execute via the processor of the computer or other programmable data processing apparatus, create means for implementing the functions/acts specified in the flowchart and/or block diagram block or blocks.",
"These computer program instructions may also be stored in a computer readable medium that can direct a computer, other programmable data processing apparatus, or other devices to function in a particular manner, such that the instructions stored in the computer readable medium produce an article of manufacture including instructions which implement the function/act specified in the flowchart and/or block diagram block or blocks.",
"The computer program instructions may also be loaded onto a computer, other programmable data processing apparatus, or other devices to cause a series of operational steps to be performed on the computer, other programmable apparatus or other devices to produce a computer implemented process such that the instructions which execute on the computer or other programmable apparatus provide processes for implementing the functions/acts specified in the flowchart and/or block diagram block or blocks.",
"Reference is now made to FIG.",
"1, which is a flowchart 100 a method of identifying events of a malware process, based on a process score, threat score and/or event score, for instance a malware and reverting one or more system object(s) effected by the events, for example files, and/or operating system states, according to some embodiments of the present invention.",
"Events are optionally identified based on run time monitoring, for instance as described in international patent application No.",
"PCT/IL2013/050366, which is incorporated herein by reference.",
"Reference is also made to FIG.",
"2, which is a schematic illustration of a data reverting system 200 of reverting one or more system object(s) affected by malware events in a computing device 201, according to some embodiments of the present invention.",
"As used herein, one or more system object(s) includes OS files, file system values, setting values, registry entries, OS related dynamic link libraries (DLLs) and/or objects accessed or executed by the target system.",
"The data reverting system 200 optionally supports the data reverting methods depicted in FIGS.",
"1 and 4 when implemented in an operating system based computing device having one or more processor 205, for example a server, a laptop, a desktop, a tablet, a Smartphone, Smart TV, a Car computer, a Smart watch, a virtual machine hosted in a network node and/or the like.",
"The data reverting system 200 includes a malicious threat monitoring module 203 and a data reverting module 204 hosted, either permanently and/or temporarily, in the computing devices 201.As further described below, the malicious threat monitoring module 203 scores and/or classifies, in real time, processes which are executed by a target system running on the computing devices 201, identifies one or more suspected events of these processes, and reverts accordingly one or more system object(s) affected by the events.",
"As further described below, the data reverting module 204 reverts one or more system object(s) of a monitored system executed on the computing device 201, for example an operating system (OS), optionally including any file system, directory, registry and/or setting, referred to herein as a target system 209.Optionally, the data reverting system 200 includes or connected to a generic template database 210 via a network 105, for example a server based database that stores a plurality of uninfected OS template files.",
"These generic system object templates may be used for reverting one or more system object(s), for example as described below.",
"These generic system object templates may be system objects, such as files and/or values, which are suitable for the target system 209.The generic template database 210 optionally stores generic system object templates per version and/or update version of a plurality of different possible target systems 209, for instance operating systems.",
"The generic template database 210 may be a cloud server or a local server in an organizational network.",
"A generic system object template may be a copy of a certain version of an OS object, such as an OS file or a copy of a certain image thereof (e.g.",
"ghost or a part thereof).",
"The generic template database 210 may acquire a requested generic system object template from a demo OS executed on a client, for instance on a web accessible desktop or laptop identified as uninfected.",
"Optionally, the generic system object templates in the generic template database 210 are divided according to their OS update level.",
"In such embodiments clusters of different generic system object templates exist.",
"Each cluster is associated with a different OS update level and therefore contains a certain set of generic system object templates pertaining to files and settings of the respective OS update level reflecting, inter alia, changes in default setting(s) in the target system 209.OS update level cluster may be formed per major update, for instance service pack update, and/or a minor update, for instance periodical update.",
"Additionally or alternatively, the data reverting system 200 includes or connected to a specific template database 211, for example a dataset locally stored in the local memory of the computing device 201.The specific template database 211 includes machine specific system object templates, such as templates of files and/or values of the OS that is running on computing device 201, for example the target system.",
"These specific system object templates may be edited or otherwise adapted system object templates which are suitable for the target system 209 itself only, for example generic system object templates which have been modified during the run time of the target system 209 and/or personalized for its operator(s).",
"A machine specific template OS dataset of machine specific system object templates may be generated by matching the signatures of system objects of a target system 209 monitored by the data reverting system 200 and signatures of system object templates of a suitable OS update level and/or version, for instance from the generic template database 210, to identify which system objects have been adapted or otherwise personalized.",
"The matching may be performed using cryptographic hash algorithms, creating the updated dataset of specific system objects which are different from respective generic system objects.",
"This matching may be performed as part of the installation process of the data reverting system 200.Optionally, the machine specific template OS dataset is updated or replaced periodically, for example by repeating the above matching process.",
"Optionally, a snapshot of the target system 209 is created in case a system object is changed while the system is offline and no matching with the system object templates of the target system 209 could have been performed, for example by mounting a storage to a secondary machine or booting from a secondary boot device.",
"Past versions of each system object may be kept for a certain period, for example a day, a week, a month, a year or any intermediate or longer period.",
"An access to the machine specific template OS dataset 211 is optionally protected for authentication, using cryptographic algorithms for example, so that third party interferences are avoided.",
"The integrity of each template OS dataset is done using digital signature for example or using similar standard.",
"The computing device determines the validity of each signature.",
"First, as shown at 101, during the run time of the target system, events executed by a target system 209 running on a target computing device, of each of a plurality of processes, are monitored, for example by the malicious threat monitoring module 203.As used herein, an event means an action or occurrence detectable by another program.",
"An event triggered by a process may be referred to herein as an event of the process, for example events to communicate a task status.",
"Optionally, the malicious threat monitoring module 203 channels events of the target system running on the hosting computing device 201 to an event processor which analyzes the events.",
"Optionally, events are channeled from the application program interfaces (APIs) of the operating system (OS) of the hosting computing device 201, for example by utilizing API calls and/or API aggregators.",
"Additionally or alternatively, the malicious threat monitoring module 203 channels events using a kernel driver, optionally, a mini filter kernel driver.",
"The kernel driver initiates before all the modules of the OS is loaded with the lowest altitude possible, and collects events in the kernel level.",
"Such a kernel driver has a higher priority and more authorizations than a process executed by the OS (application level).",
"Optionally, events, for example entries, which are identified as unmalicious events, are filtered, also referred to herein as purged, and/or classified as unmalicious events.",
"Optionally, the unmalicious events are identified according to a match with unmalicious event dataset, a structure holding restructured events that were tagged as unmalicious, for example not related to a known attack pattern.",
"The unmalicious event dataset is optionally generated as described in International Patent Application No.",
"PCT/IL2013/050366, which is incorporated herein by reference.",
"As shown at 102, the events, optionally unfiltered events, are recorded as entries in an event log.",
"The event log may be any dataset or other mathematical or computational structure such as vector or cluster, The event log may document events detected during a monitoring period, for example since the initiation of the monitoring and/or during a certain defined period.",
"The event log is optionally updated in real time.",
"For example, an event entry in the event log has the following format (structure): Process Name, Operation, Path, Result, Event Class, Image Path, User, Command Line, Category.",
"The event log may document events detected during a monitoring period, for example since the initiation of the monitoring and/or during a certain defined period, for example the last 1, 3, 6, 12 and 18 month(s) or any intermediate or longer term.",
"The event log is optionally updated in real time.",
"By logging events, as part of the detection scheme, the data reverting system 200 tracks and keeps a trail of events indicative of any suspicious activity performed by any of the processes running on the target computing device 201.As shown at 103, in run time, the plurality of processes are classified and/or scored, for instance based on a classification and/or scoring given to the monitored and optionally logged events.",
"Classifying a process as a malware may be an outcome of scoring the process with a malware risk score above a threshold.",
"As shown at 104, events are monitored and logged continuously.",
"While each event may not constitute independently a malicious act, an event detection algorithm, using machine learning (ML) techniques, may be used to aggregate events and determine a score of each process based on events associated therewith, for instance as described in international patent application No.",
"PCT/IL2013/050366, which is incorporated herein by reference.",
"For example, when a score of a process passes a certain threshold, the data reverting system 200 tags the process as malware.",
"For example, a deterministic event score indicative of an estimated threat level may be calculated per event, for example according to the classification.",
"For example, an event score is propagated to all of the events of a certain process based on the scoring that is given to one of the events of the certain process.",
"Optionally, event scores are accumulated, for example an event may inherit event scores from one or more parent events and may pass on its event score children events.",
"Optionally, event scores are used for calculating a process score for a process related to the respective events.",
"For example, scoring may be performed as follows: If Event class is “Registry” and the event Operation is “RegSetValue” and the event path is “\\System\\CurrentControlSet\\Control .",
".",
".",
"” then label then classify this event as “AutoStart” and apply a scoring function.",
"Scores and classifications are propagated and attached to the entity representing the process emitting the specific event.",
"Optionally, a deterministic process score is given to each group of events representing a common process.",
"The score is optionally aggregated, for example passed on from children process(es) to a parent process that adds their scores.",
"Optionally, a process score is determined according to the respective event scores.",
"In such embodiments, the process score is a sum of the respective event scores and optionally a current process score and optionally children score(s).",
"As shown at 105, processes are classified.",
"When a process is classified as a malware, events of the classified process are optionally identified by reviewing the entries of the event log.",
"Optionally, a list of the events of the classified process is created.",
"The list may be represented in any dataset.",
"Now, as shown at 106, during a reversion process, target system 209 system object(s) affected by the logged events of the classified process are reverted, for instance by iteratively reverting system object(s) damaged by each event in the list of the events, for instance by a first in first out (FIFO) or last in first out (LIFO) order.",
"For instance, the system object(s) are edited so as reflect a state wherein the events were not executed by the target system.",
"The challenge in this may be restoring the target system 209 to a pre-infection resource state, namely to its state before the classified process has been executed.",
"Optionally, the reverting includes fixing a damage caused to the target system 209 by additive operations (events) of the classified process.",
"For example, if a resource, a system object, is added to the target system 209 by an event of a process classified as a malware, it is deleted.",
"Optionally, the reverting includes fixing a damage caused to the target system 209 by modification operations (events) of the classified process.",
"Modification operations may include any deletion operation, a change of settings, for example, registry settings, and change of files, for example persistent code injection.",
"In such embodiments, a modified system object may be replaced with a specific system object if a respective specific system object template is found in the specific template database 211 and replaced with a generic system object from the generic template database 210 if a respective specific system object template is not found in the specific template database 211 and found in the generic template database 210.For example, FIG.",
"3 depicts a flowchart of a process for selecting a generic system object or a specific system object for replacing a damaged system object, according to some embodiments of the present invention.",
"Optionally, data, for instance generic system object templates, is copied from the generic template database 210 and/or the specific template database 211 and used to replace one or more system damaged object(s) of the target system 209.For example, the generic template database 210 is accessed by the data reverting module 204 that copies generic system object templates such as registry values of possible update versions of the target system 209.The generic system object templates are optionally selected based on the update version of the target system 209.Settings are optionally kept in a default state for the specific OS update level.",
"For example, the data reverting module 204 compares a signature of a system object such as a file or value which has been affected by an event of the classified process and the system object templates.",
"Optionally, data, for instance specific system object templates, is copied from the specific template database 211 and used to replace one or more damaged system object(s) of the target system 209.For example, the specific system object templates include local OS files and/or registry settings.",
"In an exemplary scenario, the target system 209 executes a malware.",
"An event of the malware is a write commend to write a malware DLL file to a directory of the target system 209, replacing a system DLL File and triggering the changing of a shell setting in the registry of the target system 209 from explorer.exe to a binary file: (HKEY_LOCAL_MACHINE\\SOFTWARE\\Microsoft\\Windows NT\\CurrentVersion\\Winlogon\\Shell).",
"During the reversion process, an event indicating the creation of the malware DLL and an event indicating the changing of the shell setting are identified and respective system object templates are searched for in the databases 210, 211.In this example, a system object template of the replaced system DLL file is identified in the generic template database 210 and used to replace the malware DLL and a system object template of the shell setting is identified in the specific template database 211 and used for restoring the registry.",
"In another exemplary scenario, an event of the malware changes domain name service (DNS) settings of the target system 209 by editing HOSTS file and/or any DNS settings in the target system 209.Such a change allows an attacker to redirect a connection to a known site, such as worldwidewebdotgoogledotcom, to his own server.",
"During the reversion process the list is followed to identify, for example in the specific template database 211, a version of the specific HOSTS file of the target system 209.If such a file does not exist in the specific template database 211, the generic template database 210 is contacted to restore a generic version of the HOSTS file for the respective OS version.",
"Reference is now also made to FIG.",
"4, which is a flowchart of a method 300 of reverting in run time system object(s), for example files, and/or operating system states, affected by an event of a process classified as a malware, optionally automatically, according to some embodiments of the present invention.",
"Blocks 101 and 103 are as depicted in FIG.",
"1 and described above; however, as indicted in 305 and 306, in this method 300, when a new event of a process classified as a malware is detected, for example unlogged event, data affected by the new event is reverted in real time, for example edited so as to reflect a state wherein the new event is not executed by the system.",
"For example, when a score of a process passes a threshold, the data reverting system 200 tags the process as malware.",
"The effect of last event raising the score over the threshold is optionally reverted.",
"Such reverting may be referred to herein as a remediation process.",
"The reverting may be performed by deleting an added file, delete a registry value, disabling the classified process and/or the like.",
"Optionally, reverting actions (either in the method depicted in FIG.",
"1 or the method depicted in FIG.",
"4) depend on the score of the classified process and/or the type of the classified process and/or user's decision.",
"For example, reverting actions at different levels may be authorized and performed as a derivative of the score of the classified process.",
"For instance, the following levels are defined: Level 1: safe operations unlikely to have an undesired impact on the target system in case of a false positive classification of the process, for instance disabling a non-OS process; Level 2: operations unlikely to have a negative effect on the target system; however, might harm another software in case of false positive classification, for example deletion of AutoRun entries; Level 3: relatively dangerous operations that might harm the target system in case of false positive classification, for example deletion of files in OS directories.",
"It should be noted that AutoRun entries are special locations in the file system or the registry wherein the OS executes the listed entries on boot time, for example HKLM\\SOFTWARE\\Microsoft\\Windows\\CurrentVersion\\Run\\.",
"According to some embodiments of the present invention, reverting operations includes reverting the outcome of a malware consisting of two separate pieces of software, a first that performs actual malware operation(s), and a second that acts as a guard keeping the first installed in the target system, commonly known as a watchdog.",
"In such embodiments, post reverting processes may be executed.",
"For example, any event instructing a recreation of a reverted and/or deleted system object, such as a registry key or a system file, is automatically and preemptively blocked, optionally regardless of the classification or score of the process, thus improving a detection rate and preventing reinfection by the same malware.",
"In one example, a malware process induces malware events that include regular software events, for example, defining AutoRun variables and system settings.",
"It then proceeds to adding an executable object in a new folder.",
"At this stage, the score of the malware process is below a malware threshold.",
"The malware then proceeds to adding a DLL file in the windows system folder.",
"The predictive score of the suspect process is now above a threshold, indicating that the suspect process is a malware.",
"The system may now block the process from writing the DLL file and then proceeds to creating a procedure to remove the AutoRun entry, restore system settings and delete the new executable, for example as described above.",
"Every system object related to the malware process is detected and handled, for example as described above.",
"A watchdog process that tries to reinstall deleted system objects is blocked and the watchdog process is classified as a malware for blocking and remediation, for instance as described above.",
"The methods as described above are used in the fabrication of integrated circuit chips.",
"The flowchart and block diagrams in the Figures illustrate the architecture, functionality, and operation of possible implementations of systems, methods and computer program products according to various embodiments of the present invention.",
"In this regard, each block in the flowchart or block diagrams may represent a module, segment, or portion of code, which comprises one or more executable instructions for implementing the specified logical function(s).",
"It should also be noted that, in some alternative implementations, the functions noted in the block may occur out of the order noted in the figures.",
"For example, two blocks shown in succession may, in fact, be executed substantially concurrently, or the blocks may sometimes be executed in the reverse order, depending upon the functionality involved.",
"It will also be noted that each block of the block diagrams and/or flowchart illustration, and combinations of blocks in the block diagrams and/or flowchart illustration, can be implemented by special purpose hardware-based systems that perform the specified functions or acts, or combinations of special purpose hardware and computer instructions.",
"The descriptions of the various embodiments of the present invention have been presented for purposes of illustration, but are not intended to be exhaustive or limited to the embodiments disclosed.",
"Many modifications and variations will be apparent to those of ordinary skill in the art without departing from the scope and spirit of the described embodiments.",
"The terminology used herein was chosen to best explain the principles of the embodiments, the practical application or technical improvement over technologies found in the marketplace, or to enable others of ordinary skill in the art to understand the embodiments disclosed herein.",
"It is expected that during the life of a patent maturing from this application many relevant methods and systems will be developed and the scope of the term a unit, a module, a network and a malware is intended to include all such new technologies a priori.",
"As used herein the term “about” refers to ±10%.",
"The terms “comprises”, “comprising”, “includes”, “including”, “having” and their conjugates mean “including but not limited to”.",
"This term encompasses the terms “consisting of” and “consisting essentially of”.",
"The phrase “consisting essentially of” means that the composition or method may include additional ingredients and/or steps, but only if the additional ingredients and/or steps do not materially alter the basic and novel characteristics of the claimed composition or method.",
"As used herein, the singular form “a”, “an” and “the” include plural references unless the context clearly dictates otherwise.",
"For example, the term “a compound” or “at least one compound” may include a plurality of compounds, including mixtures thereof.",
"The word “exemplary” is used herein to mean “serving as an example, instance or illustration”.",
"Any embodiment described as “exemplary” is not necessarily to be construed as preferred or advantageous over other embodiments and/or to exclude the incorporation of features from other embodiments.",
"The word “optionally” is used herein to mean “is provided in some embodiments and not provided in other embodiments”.",
"Any particular embodiment of the invention may include a plurality of “optional” features unless such features conflict.",
"Throughout this application, various embodiments of this invention may be presented in a range format.",
"It should be understood that the description in range format is merely for convenience and brevity and should not be construed as an inflexible limitation on the scope of the invention.",
"Accordingly, the description of a range should be considered to have specifically disclosed all the possible subranges as well as individual numerical values within that range.",
"For example, description of a range such as from 1 to 6 should be considered to have specifically disclosed subranges such as from 1 to 3, from 1 to 4, from 1 to 5, from 2 to 4, from 2 to 6, from 3 to 6 etc., as well as individual numbers within that range, for example, 1, 2, 3, 4, 5, and 6.This applies regardless of the breadth of the range.",
"Whenever a numerical range is indicated herein, it is meant to include any cited numeral (fractional or integral) within the indicated range.",
"The phrases “ranging/ranges between” a first indicate number and a second indicate number and “ranging/ranges from” a first indicate number “to” a second indicate number are used herein interchangeably and are meant to include the first and second indicated numbers and all the fractional and integral numerals therebetween.",
"It is appreciated that certain features of the invention, which are, for clarity, described in the context of separate embodiments, may also be provided in combination in a single embodiment.",
"Conversely, various features of the invention, which are, for brevity, described in the context of a single embodiment, may also be provided separately or in any suitable subcombination or as suitable in any other described embodiment of the invention.",
"Certain features described in the context of various embodiments are not to be considered essential features of those embodiments, unless the embodiment is inoperative without those elements.",
"Although the invention has been described in conjunction with specific embodiments thereof, it is evident that many alternatives, modifications and variations will be apparent to those skilled in the art.",
"Accordingly, it is intended to embrace all such alternatives, modifications and variations that fall within the spirit and broad scope of the appended claims.",
"All publications, patents and patent applications mentioned in this specification are herein incorporated in their entirety by reference into the specification, to the same extent as if each individual publication, patent or patent application was specifically and individually indicated to be incorporated herein by reference.",
"In addition, citation or identification of any reference in this application shall not be construed as an admission that such reference is available as prior art to the present invention.",
"To the extent that section headings are used, they should not be construed as necessarily limiting."
]
] |
Patent_15871227
|
[
[
"ASHLESS OR REDUCED ASH QUATERNARY DETERGENTS",
"A composition of an oil-soluble ionic detergent that does not contribute metal ions to the composition, and which comprises a quaternary non-metallic pnictogen cation and an organic anion having at least one hydrocarbyl group of sufficient length to impart oil solubility to the detergent, the detergent having a total base number (TBN) to total acid number (TAN) ratio of at least 2:1 imparts ash-free basicity to a lubricant composition."
],
[
"1.A composition comprising an oil-soluble ionic detergent, which detergent comprises (a) a quaternary non-metallic pnictogen cation and (b) an organic anion having at least one aliphatic hydrocarbyl group of sufficient length to impart oil solubility to the detergent; said oil-soluble ionic detergent having a total base number (TBN) to total acid number (TAN) ratio of at least 2:1; wherein said oil-soluble ionic detergent exhibits a TBN of at least about 10 arising from a non-metallic base.",
"2.The composition of claim 1 wherein the oil-soluble ionic detergent comprises a quaternary ammonium cation or a quaternary phosphonium cation.",
"3.The composition of claim 1 wherein the cation comprises a tetrahydrocarbyl ammonium ion.",
"4.The composition of claim 3 wherein the cation comprises four groups selected from the group consisting of methyl groups, ethyl groups, propyl groups, butyl groups, benzyl groups, phenyl groups, hydroxyalkyl groups, aminoalkyl groups, and mixtures thereof.",
"5.The composition of claim 3 wherein the cation comprises a pyridinium ion or an imidazolium ion.",
"6.The composition of claim 5 wherein the oil-soluble ionic detergent comprises a sulfonate, carboxylate, or phenate anion.",
"7.The composition of claim 6 wherein the oil-soluble ionic detergent comprises a sulfonate anion or a salicylate anion.",
"8.The composition of claim 7 wherein the oil-soluble ionic detergent comprises a stoichiometric excess of quaternary non-metallic pnictogen cations of (a) over organic anions of (b) such that said cations and anions are present in an equivalent ratio (a):(b) of at least 2:1.9.The composition of claim 8 wherein the overbased detergent further comprises an additional oxo-anion.",
"10.The composition of claim 9 wherein the additional oxo-anion comprises a carbonate, bicarbonate, borate, hydroxide, nitrate, phosphate, sulfate, or carboxylate ion or mixtures thereof, said carboxylate ion containing 5 or fewer carbon atoms.",
"11.A method for preparing an oil-soluble ionic detergent, comprising the steps of: (a) reacting a tertiary amine with a dihydrocarbyl carbonate to form a quaternary ammonium carbonate; and (b) reacting the quaternary ammonium carbonate with an oil-soluble acidic substrate having at least one aliphatic hydrocarbyl group of sufficient length to impart oil solubility to the detergent.",
"12.The method of claim 11 wherein the quaternary ammonium carbonate is reacted with less than 1 equivalent of the oil-soluble acidic substrate.",
"13.A method for preparing an oil-soluble ionic detergent, comprising the steps of: (a) providing an oil-soluble acidic substrate having at least one aliphatic hydrocarbyl group of sufficient length to impart oil solubility to the detergent, optionally in an organic solvent and optionally in the presence of a C1 to C6 alcohol; (b) admixing with said acidic substrate a molar excess of a basic compound comprising a quaternary ammonium or quaternary phosphonium compound; and (c) optionally reacting the resulting mixture with an oxo-acid."
],
[
"<SOH> BACKGROUND OF THE INVENTION <EOH>The disclosed technology relates to a lubricant additive component for internal combustion engines, having no or low ash but high basicity.",
"The formulation of engine oils which contain reduced metal content (expressed as sulfated ash, ASTM D 874) but sufficient basicity (expressed as Total Base Number, TBN, ASTM D 2896) to adequately neutralize acidic combustion products while continuing to provide good protection to engine components has remained elusive.",
"Low ash is desirable to minimize fouling of catalysts and other pollution control devices in the exhaust stream, which may be caused by migration of metal ions from the lubricant into the exhaust system.",
"Metal containing detergents, however, and especially overbased metal-containing detergents, have long been a key to protecting engine parts from attack by acidic exhaust components that may enter the lubricant system by piston ring blow-by.",
"It is desirable to attain these seemingly contradictory goals while still providing excellent lubrication and protection to the engine.",
"There have been many attempts to design overbased detergents.",
"For example, U.S. Pat.",
"No.",
"5,827,805, Adams et al., Oct. 27, 1998, discloses a salt represented by the structure where Ar is an aromatic group, each R is independently a hydrocarbyl or substituted hydrocarbyl group, at least one R group having at least 8 carbon atoms, a is 1 to 4, R′ is hydrogen or alkyl, M n+ is a quaternary ammonium ion or a metal ion of valence n, and q is a number up to n. The salts can be neutral salts, partially neutralized salts, or overbased salts.",
"The overbased materials are prepared by reacting an acidic material with a mixture comprising the initial lactone or carboxylic acid product, a stoichiometric excess of a metal base, and a promoter.",
"The compositions disclosed are useful as lubricant and fuel additives.",
"U.S. Patent Application Publication 2006/0247140, Cressey et al., Nov. 2, 2006, discloses a sulphur free reaction product of a hydrocarbyl substituted aromatic compound containing an acidic group and an organic nitrogen-containing base reacted with the acidic group.",
"The organic nitrogen-containing base may be, among other materials, a tetraalkylammonium salt.",
"It is said to be advantageous to use a strong organic nitrogen-containing base such as tetraalkylammonium hydroxide to neutralize an oligomeric reaction product prepared by reacting an alkylphenol such as dodecylphenol and an aldehyde such as formaldehyde.",
"The compositions disclosed are said to be useful in a method for lubricating an internal combustion engine.",
"U.S. Pat.",
"No.",
"3,962,104, Swietlik et al., Jun.",
"8, 1976, discloses lubricating oils containing as an ashless detergent a quaternary ammonium salt derived from an organic acid and a cation obtained by the reaction of a tertiary amine, olefin oxide and water.",
"The quaternary ammonium hydroxides are disclosed as Tertiary amines which are suitable include, among others, amines of the formula R 1 R 2 R 3 N such as, among others, trimethyl amine; or pyridine and substituted pyridines.",
"The organic acids include, among others, carboxylic acids, phenols, sulphurized phenols, and sulphonic acids.",
"U.S. Pat.",
"No.",
"5,688,751, Cleveland et al., Nov. 18, 1977, discloses salicylate salts as lubricant additives for two-cycle engines.",
"The salt of the salicylic acid may be a basic metal salt, also known as an overbased salt.",
"The hydroxyaromatic carboxylic compound can also be in the form of an ammonium salt or a hydrocarbylamine salt (i.e., a quaternary nitrogen salt).",
"Appropriate amines can by hydrocarbyl primary, secondary, or tertiary amines.",
"PCT Publication WO 2008/075016, Jun.",
"26, 2008, discloses a non-aqueous lubricating oil composition comprising a major amount of abase oil and a minor amount of an additive which is a salt of general formula C + A − , with the cation, C + , being a quaternary phosphonium or quaternary ammonium ion having four hydrocarbyl groups.",
"The anions may be of the general formula [R 1 R 2 P(O)O] − or sulfosuccinate esters or carboxylate anions.",
"PCT Publication WO 2006/135881, Dec. 21, 2006, discloses a quaternary ammonium salt detergent for use in fuels.",
"The quaternary ammonium salt is the reaction product of (a) a hydrocarbyl-substituted acylating agent and a compound having an oxygen or nitrogen atom capable of condensing with said acylating agent and further having a tertiary amino group; and (b) a quaternizing agent suitable for converting the tertiary amino group to a quaternary nitrogen.",
"U.S. Pat.",
"No.",
"5,531,911, Adams et al., Jul.",
"2, 1996, discloses functional fluids such as lubricants comprising the reaction product of an amine and a sulfonic acid as an anti-rust agent.",
"The sulfonic acid may include mono-, di-, and tri-alkylated benzene and naphthalene sulfonic acids.",
"The amines include primary, secondary, and tertiary amines.",
"A particularly useful product is the ethylenediamine salt of dinonylnaphthalenesulfonic acid.",
"European Patent EP 0 727 477 B, Mar.",
"14, 2001, discloses ash-free detergents in lubricating oils.",
"Calixarenes are used to complex a moiety derived from an organic nitrogen-containing base, typically a guanidine or ammonium, preferably a guanidine salt.",
"U.S. Pat.",
"No.",
"3,362,801, Fareri et al., Jan. 9, 1968, discloses hydrocarbon oil composition containing alkyl quaternary ammonium salicylates.",
"The hydrocarbon oil may be a fuel oil blend.",
"The disclosed technology, therefore, solves certain of the above-identified problems by employing a quaternary pnictogen detergent."
],
[
"<SOH> SUMMARY OF THE INVENTION <EOH>The disclosed technology provides a composition comprising an oil-soluble ionic detergent, which detergent may be substantially free from acidic protons, which does not contribute metal ions to the composition, and which comprises (a) a quaternary non-metallic pnictogen cation and (b) an organic anion having at least one hydrocarbyl group of sufficient length to impart oil solubility to the detergent; said ionic detergent having a total base number (TBN) to total acid number (TAN) ratio of at least 2:1.The disclosed technology also provides a composition comprising an oil-soluble ionic detergent, which detergent comprises (a) a quaternary non-metallic pnictogen cation and (b) an organic anion having at least one aliphatic hydrocarbyl group of sufficient length to impart oil solubility to the detergent; said oil-soluble ionic detergent having a total base number (TBN) to total acid number (TAN) ratio of at least 2:1; wherein said oil-soluble ionic detergent exhibits a TBN of at least 10 arising from a non-metallic base.",
"The disclosed technology further provides a composition comprising an oil-soluble ionic detergent, which detergent is substantially free from acidic protons and which comprises (a) a quaternary non-metallic pnictogen cation and (b) an organic anion having at least one hydrocarbyl group of sufficient length to impart oil solubility to the detergent; said ionic detergent having a total base number (TBN) to total acid number (TAN) ratio of at least 2:1; wherein said ionic detergent exhibits a TBN of at least 50 arising from a non-metallic base.",
"In another aspect, the technology provides a method for preparing an oil-soluble ionic detergent, comprising the steps of (a) providing an oil-soluble acidic substrate, optionally in an organic solvent and optionally in the presence of a C 1 to C 6 alcohol; (b) admixing with said acidic substrate a molar excess of a basic compound comprising a quaternary ammonium compound or a quaternary phosphonium compound; and (c) optionally reacting the resulting mixture with an oxo-acid.",
"In another aspect, the technology provides a method for preparing an oil-soluble ionic detergent, comprising the steps of: (a) reacting a tertiary amine with a dihydrocarbyl carbonate to form a quaternary ammonium carbonate; and (b) reacting the quaternary ammonium carbonate with an oil-soluble acidic substrate having at least one aliphatic hydrocarbyl group of sufficient length to impart oil solubility to the detergent.",
"And in yet another aspect, the technology provides a method for preparing an, oil-soluble ionic detergent, comprising the steps of (a) providing a metal salt of an oil-soluble acidic substrate, optionally in an organic solvent and optionally in the presence of a C1 to C6 alcohol; and (b) admixing with said metal salt a quaternary pnictogen halide compound.",
"In yet another aspect, the technology provides a method for preparing an oil-soluble ionic detergent comprising the steps of: (a) mixing together a tertiary amine, an alkylene oxide, and an oil-soluble acidic compound, and (b) heating the resulting mixture to effect reaction among the components of (a).",
"detailed-description description=\"Detailed Description\" end=\"lead\"?"
],
[
"CROSS REFERENCE TO RELATED APPLICATIONS This application is a continuation application of U.S. application Ser.",
"No.",
"15/288,839 filed on Oct. 7, 2016 which is a divisional application of U.S. application Ser.",
"No.",
"14/277,124 filed on May 14, 2014, granted as U.S. Pat.",
"No.",
"9,109,184 issued on Aug. 18, 2015, which is a 371 of international Application Serial No.",
"PCT/US2010/025714 filed on Mar.",
"1, 2010, which claims the benefit of Provisional Application Ser.",
"No.",
"61/156,981 filed on Mar.",
"3, 2009.BACKGROUND OF THE INVENTION The disclosed technology relates to a lubricant additive component for internal combustion engines, having no or low ash but high basicity.",
"The formulation of engine oils which contain reduced metal content (expressed as sulfated ash, ASTM D 874) but sufficient basicity (expressed as Total Base Number, TBN, ASTM D 2896) to adequately neutralize acidic combustion products while continuing to provide good protection to engine components has remained elusive.",
"Low ash is desirable to minimize fouling of catalysts and other pollution control devices in the exhaust stream, which may be caused by migration of metal ions from the lubricant into the exhaust system.",
"Metal containing detergents, however, and especially overbased metal-containing detergents, have long been a key to protecting engine parts from attack by acidic exhaust components that may enter the lubricant system by piston ring blow-by.",
"It is desirable to attain these seemingly contradictory goals while still providing excellent lubrication and protection to the engine.",
"There have been many attempts to design overbased detergents.",
"For example, U.S. Pat.",
"No.",
"5,827,805, Adams et al., Oct. 27, 1998, discloses a salt represented by the structure where Ar is an aromatic group, each R is independently a hydrocarbyl or substituted hydrocarbyl group, at least one R group having at least 8 carbon atoms, a is 1 to 4, R′ is hydrogen or alkyl, Mn+ is a quaternary ammonium ion or a metal ion of valence n, and q is a number up to n. The salts can be neutral salts, partially neutralized salts, or overbased salts.",
"The overbased materials are prepared by reacting an acidic material with a mixture comprising the initial lactone or carboxylic acid product, a stoichiometric excess of a metal base, and a promoter.",
"The compositions disclosed are useful as lubricant and fuel additives.",
"U.S. Patent Application Publication 2006/0247140, Cressey et al., Nov. 2, 2006, discloses a sulphur free reaction product of a hydrocarbyl substituted aromatic compound containing an acidic group and an organic nitrogen-containing base reacted with the acidic group.",
"The organic nitrogen-containing base may be, among other materials, a tetraalkylammonium salt.",
"It is said to be advantageous to use a strong organic nitrogen-containing base such as tetraalkylammonium hydroxide to neutralize an oligomeric reaction product prepared by reacting an alkylphenol such as dodecylphenol and an aldehyde such as formaldehyde.",
"The compositions disclosed are said to be useful in a method for lubricating an internal combustion engine.",
"U.S. Pat.",
"No.",
"3,962,104, Swietlik et al., Jun.",
"8, 1976, discloses lubricating oils containing as an ashless detergent a quaternary ammonium salt derived from an organic acid and a cation obtained by the reaction of a tertiary amine, olefin oxide and water.",
"The quaternary ammonium hydroxides are disclosed as Tertiary amines which are suitable include, among others, amines of the formula R1R2R3N such as, among others, trimethyl amine; or pyridine and substituted pyridines.",
"The organic acids include, among others, carboxylic acids, phenols, sulphurized phenols, and sulphonic acids.",
"U.S. Pat.",
"No.",
"5,688,751, Cleveland et al., Nov. 18, 1977, discloses salicylate salts as lubricant additives for two-cycle engines.",
"The salt of the salicylic acid may be a basic metal salt, also known as an overbased salt.",
"The hydroxyaromatic carboxylic compound can also be in the form of an ammonium salt or a hydrocarbylamine salt (i.e., a quaternary nitrogen salt).",
"Appropriate amines can by hydrocarbyl primary, secondary, or tertiary amines.",
"PCT Publication WO 2008/075016, Jun.",
"26, 2008, discloses a non-aqueous lubricating oil composition comprising a major amount of abase oil and a minor amount of an additive which is a salt of general formula C+A−, with the cation, C+, being a quaternary phosphonium or quaternary ammonium ion having four hydrocarbyl groups.",
"The anions may be of the general formula [R1R2P(O)O]− or sulfosuccinate esters or carboxylate anions.",
"PCT Publication WO 2006/135881, Dec. 21, 2006, discloses a quaternary ammonium salt detergent for use in fuels.",
"The quaternary ammonium salt is the reaction product of (a) a hydrocarbyl-substituted acylating agent and a compound having an oxygen or nitrogen atom capable of condensing with said acylating agent and further having a tertiary amino group; and (b) a quaternizing agent suitable for converting the tertiary amino group to a quaternary nitrogen.",
"U.S. Pat.",
"No.",
"5,531,911, Adams et al., Jul.",
"2, 1996, discloses functional fluids such as lubricants comprising the reaction product of an amine and a sulfonic acid as an anti-rust agent.",
"The sulfonic acid may include mono-, di-, and tri-alkylated benzene and naphthalene sulfonic acids.",
"The amines include primary, secondary, and tertiary amines.",
"A particularly useful product is the ethylenediamine salt of dinonylnaphthalenesulfonic acid.",
"European Patent EP 0 727 477 B, Mar.",
"14, 2001, discloses ash-free detergents in lubricating oils.",
"Calixarenes are used to complex a moiety derived from an organic nitrogen-containing base, typically a guanidine or ammonium, preferably a guanidine salt.",
"U.S. Pat.",
"No.",
"3,362,801, Fareri et al., Jan. 9, 1968, discloses hydrocarbon oil composition containing alkyl quaternary ammonium salicylates.",
"The hydrocarbon oil may be a fuel oil blend.",
"The disclosed technology, therefore, solves certain of the above-identified problems by employing a quaternary pnictogen detergent.",
"SUMMARY OF THE INVENTION The disclosed technology provides a composition comprising an oil-soluble ionic detergent, which detergent may be substantially free from acidic protons, which does not contribute metal ions to the composition, and which comprises (a) a quaternary non-metallic pnictogen cation and (b) an organic anion having at least one hydrocarbyl group of sufficient length to impart oil solubility to the detergent; said ionic detergent having a total base number (TBN) to total acid number (TAN) ratio of at least 2:1.The disclosed technology also provides a composition comprising an oil-soluble ionic detergent, which detergent comprises (a) a quaternary non-metallic pnictogen cation and (b) an organic anion having at least one aliphatic hydrocarbyl group of sufficient length to impart oil solubility to the detergent; said oil-soluble ionic detergent having a total base number (TBN) to total acid number (TAN) ratio of at least 2:1; wherein said oil-soluble ionic detergent exhibits a TBN of at least 10 arising from a non-metallic base.",
"The disclosed technology further provides a composition comprising an oil-soluble ionic detergent, which detergent is substantially free from acidic protons and which comprises (a) a quaternary non-metallic pnictogen cation and (b) an organic anion having at least one hydrocarbyl group of sufficient length to impart oil solubility to the detergent; said ionic detergent having a total base number (TBN) to total acid number (TAN) ratio of at least 2:1; wherein said ionic detergent exhibits a TBN of at least 50 arising from a non-metallic base.",
"In another aspect, the technology provides a method for preparing an oil-soluble ionic detergent, comprising the steps of (a) providing an oil-soluble acidic substrate, optionally in an organic solvent and optionally in the presence of a C1 to C6 alcohol; (b) admixing with said acidic substrate a molar excess of a basic compound comprising a quaternary ammonium compound or a quaternary phosphonium compound; and (c) optionally reacting the resulting mixture with an oxo-acid.",
"In another aspect, the technology provides a method for preparing an oil-soluble ionic detergent, comprising the steps of: (a) reacting a tertiary amine with a dihydrocarbyl carbonate to form a quaternary ammonium carbonate; and (b) reacting the quaternary ammonium carbonate with an oil-soluble acidic substrate having at least one aliphatic hydrocarbyl group of sufficient length to impart oil solubility to the detergent.",
"And in yet another aspect, the technology provides a method for preparing an, oil-soluble ionic detergent, comprising the steps of (a) providing a metal salt of an oil-soluble acidic substrate, optionally in an organic solvent and optionally in the presence of a C1 to C6 alcohol; and (b) admixing with said metal salt a quaternary pnictogen halide compound.",
"In yet another aspect, the technology provides a method for preparing an oil-soluble ionic detergent comprising the steps of: (a) mixing together a tertiary amine, an alkylene oxide, and an oil-soluble acidic compound, and (b) heating the resulting mixture to effect reaction among the components of (a).",
"DETAILED DESCRIPTION OF THE INVENTION Various preferred features and embodiments will be described below by way of non-limiting illustration.",
"One component of the disclosed technology comprises an oil-soluble ionic detergent which, in itself, does not contribute metal ions to the composition or which, alternatively, contributes a lesser quantity of metal ions to the composition than would normally be indicated by the extent of basicity of the detergent.",
"Most conventional detergents used in the field of engine lubrication, unlike those of the present technology, obtain most or all of their basicity or TBN from the presence of basic metal compounds (metal hydroxides, oxides, or carbonates, typically based on such metals as calcium, magnesium, or sodium).",
"Such metallic overbased detergents, also referred to as overbased or superbased salts, are generally single phase, homogeneous Newtonian systems characterized by a metal content in excess of that which would be present for neutralization according to the stoichiometry of the metal and the particular acidic organic compound reacted with the metal.",
"The overbased materials are typically prepared by reacting an acidic material (typically an inorganic acid such as carbon dioxide or a lower carboxylic acid) with a mixture of an acidic organic compound (also referred to as a substrate), a stoichiometric excess of a metal base, typically in a reaction medium of an one inert, organic solvent (e.g., mineral oil, naphtha, toluene, xylene) for the acidic organic substrate.",
"Optionally a small amount of promoter such as a phenol or alcohol is present.",
"The acidic organic substrate will normally have a sufficient number of carbon atoms to provide a degree of solubility in oil.",
"Such conventional overbased materials and their methods or preparation are well known to those skilled in the art.",
"Patents describing techniques for making basic metallic salts of sulfonic acids (e.g., hydrocarbyl-substituted benzenesulfonic acids), carboxylic acids (e.g., stearic acid and other long-chain fatty acids, hydrocarbyl-substituted succinic acid, hydrocarbyl-substituted salicylic acids), phenols (including hydrocarbyl-substituted sulfur- or methylene-bridged phenols of both linear or cyclic geometry, the latter also being referred to as calixarenes), phosphonic acids, and mixtures of any two or more of these include U.S. Pat.",
"Nos.",
"2,501,731; 2,616,905; 2,616,911; 2,616,925; 2,777,874; 3,256,186; 3,384,585; 3,365,396; 3,320,162; 3,318,809; 3,488,284; and 3,629,109.Salixarate detergents (based on salixarenes) are described in U.S. Pat.",
"No.",
"6,200,936 and PCT Publication WO 01/56968.Saligenin detergents are described in U.S. Pat.",
"No.",
"6,310,009.Any of these types of acids or substrates may also be used in the presently disclosed technology.",
"The detergents of the present technology differ from conventional metal-based detergents in that they are metal free or substantially metal free or contain a lower amount of metal that would be expected based on the amount of TBN that they deliver.",
"Alternatively expressed, they do not contribute metal ions to lubricants in which they are added, or contribute less metal ions than would be expected on the amount of TBN that they deliver.",
"In certain embodiments, the detergents are metal free, although they may be mixed with other components, such as other detergents that do contain metal, while still, in themselves, being metal free.",
"By the term “substantially metal free” is meant a detergent that contains only a contaminant or a trace amount of a metal, an amount that may in many circumstances be ignored.",
"For instance, such a detergent may contain less than 5% or less than 3 or 1% metal by weight.",
"In place of some or all of the metal ion of the detergent, the materials of the present invention will contain one or more quaternary non-metallic pnictogen cations.",
"Pnictogens (the term being derived from Greek pnigein, to choke or stifle) are the elements in column 15 (or Va) of the periodic table, the column headed by nitrogen.",
"The non-metallic pnictogens include nitrogen and phosphorus.",
"Quaternary nitrogen or phosphorus compounds are known.",
"Ordinarily nitrogen is a trivalent element, forming three covalent bonds to hydrogen or carbon atoms in ammonia or amines: NHxR3−x, where R is a group linked to the nitrogen atom through a carbon atom of the R group.",
"Quaternary nitrogen compounds, on the other hand, comprise a quaternary ammonium ion and a counterion (e.g., hydroxide, halide), represented by the general formula NR4+X−.",
"Quaternary phosphonium ions may be similarly represented.",
"In such materials, the nitrogen (or phosphorus) has four substantially non-ionizable covalent bonds to carbon atoms.",
"The quaternary atoms are permanently charged and are comparatively unaffected by the pH of the medium.",
"They are thus distinguished from ordinary ammonium or phosphonium ions or protonated amines, which materials contain up to three substantially non-ionizable covalent bonds to carbon and one or more acidic hydrogen atoms or protons associated with the nitrogen or phosphorus atom.",
"The present quaternary ions will not contribute acidity to the detergent, as would be titratable as TAN by ASTM D 664A.",
"The ionic detergents of the present technology will thus be free from acidic protons in the sense that they will have the general structure NR4+X− rather than HNR3+X−, in the case of nitrogen.",
"However, the detergent molecules overall may (or may not) contain other acidic hydrogen that is titratable as TAN, on other portions of the detergent than the cation, that is, on the anionic substrate portion.",
"An example of a titratable hydrogen might be on a phenolic OH group.",
"In certain embodiments, however, the detergent as a whole will be substantially free from acidic protons, having a TAN of less than 10 or less than 5 or less than 3 or less than 1, on an oil free basis.",
"It is not intended that each of the four bonds of the nitrogen or phosphorus must necessarily be directed to a separate carbon atom: The 4 R groups are not necessary different carbon groups.",
"Thus, two of the bonds may be directed to the same carbon atom in a double-bonded structure or as delocalized bonds within an aromatic ring.",
"Examples of such include pyridinium ions and imidazolium ions, such as where R, R′ and R″ are hydrocarbyl groups (substitution on the ring carbon atoms being optional).",
"Such species may optionally be included within the present use of the term “quaternary,” since the quaternary atom therein has four bonds to carbon atoms.",
"Many quaternary salt compounds are known.",
"Quaternary ammonium salts, for instance, are commercially available and may be prepared by the reaction of ammonia or an amine with an alkyl halide as the complete alkylation product.",
"Certain quaternary phosphonium salts may be prepared by the reaction of phosphine with aldehydes, e.g., tetrakis(hydroxymethyl)phosphonium chloride.",
"Examples of quaternary ammonium compounds include tetrahydrocarbyl ammonium salts with hydrocarbyl groups such as methyl, ethyl, propyl, butyl, benzyl, and mixtures thereof.",
"In another embodiment, up to three of the R groups in the quaternary NR4+ structure may be such hydrocarbyl groups and one or more groups may be a hydroxy-substituted hydrocarbyl group such as a hydroxyalkyl group, or an amine-substituted hydrocarbyl group.",
"Examples of quaternary ammonium salts containing a hydroxyalkyl group, and methods for their synthesis, are disclosed in U.S. Pat.",
"No.",
"3,962,104, Swietlik et al.",
"; see column 1 line 16 through column 2 line 49; column 8 lines 13 through 49, and the Examples.",
"In certain embodiments, the quaternary ammonium compound is derived from a monoamine, i.e, a tertiary amine having only a single amino group, that is, having no additional amine nitrogen atoms in any of the three hydrocarbyl groups or substituted hydrocarbyl groups attached to the tertiary amine nitrogen.",
"In certain embodiments, there are no additional amine nitrogen atoms in any of the hydrocarbyl groups or substituted hydrocarbyl groups attached to the central nitrogen in the quaternary ammonium ion.",
"Further examples of quaternary ammonium compounds include tetraethylammonium hydroxide or halide and tetrabutylammonium hydroxide or halide and such biological materials as choline chloride, HOCH2CH2N(CH3)3Cl.",
"Any such materials may provide the cation for the present detergents.",
"The detergents of the present technology will contain a quaternary pnictogen cation, along with optionally a metal cation.",
"The anion portion of the detergent will be an organic anion having at least one aliphatic hydrocarbyl group of sufficient length to impart oil solubility to the detergent.",
"(As used herein, the term “aliphatic” is intended to encompass “alicyclic.” That is, the aliphatic hydrocarbyl groups may be linear, branched, or cyclic or may contain carboxylic moieties, but are to be distinguished from “aromatic” groups, which are not to be considered “aliphatic.”) Suitable aliphatic hydrocarbyl groups, if they are in the form of a substituent on an aromatic ring (as in alkylphenates or alkylbenzenesulfonates) may contain 4 to 400 carbon atoms, or 6 to 80 or 6 to 30 or 8 to 25 or 8 to 15 carbon atoms.",
"The anionic portion of the detergent may thus be any of the anions derived from the acidic organic materials that are used to prepare conventional detergents.",
"As mentioned above, these include sulfonic acids, providing sulfonate detergents with sulfonate anions, carboxylic acids, providing carboxylate detergents with carboxylate anions, phenols, providing phenate detergents with phenate anions, hydrocarbyl-substituted salicylic acids, providing salicylate detergents with salicylate anions, phosphonic acids, providing phosphonate detergents, as well as salixarate, calixarate, and saligenin detergents, and mixtures thereof.",
"In certain embodiments, the ionic detergents may be sulfonates or salicylates, and in other embodiments, sulfonates.",
"The ionic detergents of the present technology will be characterized by having ratio of a total base number (TBN) to total acid number (TAN) of at least 2:1.The TBN:TAN ratio may also be 7:1 to 150:1 or to 300:1 or greater, or 10:1 to 70:1.If the TAN is zero, the resulting ratio is also to be considered to be greater than 2:1.That is, the detergent will have relatively little acidity, such as may be provided by acidic protons, such as a TAN typically of less than 10 or less than 5 or 2 or 1.The detergent will also have a relatively large amount of basicity.",
"The TBN of the detergent may be, for example, at least 10 or at least 30 or 50 to 300 or 70 to 210 or 100 to 150 (each presented on a neat chemical basis, absent oil dilution).",
"The basicity of a metal detergent is also sometimes expressed in terms of metal ratio, which refers to the ratio of the total equivalents of the metal to the equivalents of the acidic organic compound or substrate.",
"A neutral metal salt has a metal ratio of one.",
"A salt having 4.5 times as much metal as present in a normal salt will have metal excess of 3.5 equivalents, or a ratio of 4.5, and so on.",
"In the case of the detergents of the present technology, which may be substantially free from metal salts, the corresponding concept may be expressed as “base ratio.” The basic salts of the present invention may thus, in certain embodiments, have a base ratio of 1.5 or 2 or 3 or 7, up to 40 or 25 or 20 or 10.That is, in certain embodiments the materials may comprise a stoichiometric excess of quaternary non-metallic pnictogen cations over the organic anions such that said cations and anions are present in an equivalent ratio of at least 2:1, which is to say to a base ratio of at least 2.0.Alternatively, in certain embodiments the materials of the present technology may have little or no stoichiometric excess of quaternary non-metallic pnictogen cations.",
"Such high TBN values may be obtained by a process analogous to overbasing of the ionic detergent.",
"The process for preparing overbased metal-containing detergents is known, as described above, and the process for preparing the present materials may be understood by reference thereto, while considering the important differences required to obtain the present materials.",
"That is, the present detergents may be prepared by reacting a mixture comprising an acidic organic compound or substrate, as described above, with a molar excess, that is, a stoichiometric excess, of a basic quaternary pnictogen compound, optionally in an inert reaction medium or organic solvent such as mineral oil, naphtha, toluene, or xylene.",
"Optionally an additional acidic material may be present, such as oxo acid, e.g., carbon dioxide, to form a carbonate or bicarbonate, and optionally a small amount of a promoter (e.g.",
"an alkanol of one to twelve or one to six carbon atoms such as methanol, ethanol, or amyl alcohol, or an alkylated an alkylated phenol such as heptylphenol, octylphenol, or nonylphenols) may be present.",
"The presence of the oxo acid may assist in incorporation of larger quantities of base, through formation of, in the case of carbon dioxide, colloidal carbonate of the base.",
"Suitable oxo anions which may become a part of the overbased detergent include carbonate, bicarbonate, borate, hydroxide, nitrate, phosphate, sulfate, and carboxylate, such as oxalate, tartrate, phenate, citrate, benzoate, succinate, and acetate ions.",
"The carboxylate anions may contain 8 or fewer or 6 or fewer or 5 or fewer or 3 or 2 or 1 carbon atom(s).",
"Also included may be ions derived from β-keto esters and diketones.",
"The oxo anions may be derived from inorganic acids, e.g., carbonate or bicarbonate ions.",
"In one embodiment, the ionic detergent of the present technology may be prepared by reacting the acidic organic compound, i.e., substrate, with an excess of a basic quaternary pnictogen compound in the substantial absence of a basic metal compound, so as to provide a substantially metal-free detergent.",
"In another embodiment, the acidic organic compound, i.e., substrate, may be reacted with an excess of a basic metal compound and a basic quaternary pnictogen compound, reacted simultaneously as a mixture, or sequentially, in any order, so as to prepare an ionic detergent that is not metal free but rather has a metal content that is reduced in proportion to the amount of the quaternary pnictogen material that is present.",
"Also, the substrates of the quaternary ammonium salts, (e.g., salicylates, sulfonates), whether neutral or basic, may be overbased with metal bases such as Ca(OH)2 or MgO in the presence of CO2 and suitable known overbasing promoters or solvents.",
"Any such materials may have, for instance, 10 to 90% or 25% or 50% or 75% of the metal content that would normally be present based on its TBN.",
"In one embodiment, an ionic detergent of the present technology may be prepared by providing a metal salt of an oil-soluble acidic substrate of the type described above, optionally in an organic solvent and optionally in the presence of a C1 to C6 alcohol and admixing with said metal salt a quaternary pnictogen halide compound.",
"In certain embodiments, the halide may be bromide or chloride, and in one embodiment the halide may be chloride.",
"This reaction may be described as a metathesis reaction, in which the metal-containing organic salt is reacted with the quaternary pnictogen halide to form the quaternary pnictogen organic salt and the metal halide.",
"In this instance, the originally present metal may be retained in the product or it may be removed (e.g., by filtration of metal halide) to provide a product with reduced metal content, as in the above paragraph.",
"If substantially all the metal is removed (or is not present from the initial synthesis), the product may be substantially metal free.",
"The quaternary pnictogen halide compound may be a commercially available material, or it may be prepared by reaction of a tertiary amine with a hydrocarbyl halide, by known techniques.",
"This reaction may be done in a separate vessel or in the same vessel in which it is subsequently (or simultaneously) reacted with the oil-soluble acidic compound, which may be converted previously (or simultaneously) into its metal neutralized form.",
"This may be represented by the following general reaction scheme: NR3+R—X→NR4+X−;NR4+X−H-A+MOH→NR4+A−+MX where the Rs represents hydrocarbyl or substituted hydrocarbyl groups, which may be the same or different, X represents a halogen or halide, M represents a metal (without regard to its valence) such as Na, and A− represents the anionic portion of the oil-soluble acid substrate.",
"One advantage of this method of preparing the quaternary detergent is that the use of a benzyl halide or substituted benzyl halide, such as benzyl chloride, as the alkylating agent R—X permits preparation of quaternary ammonium detergents prepared from amines of low nucleophilicity which could not be readily quaternized by other methods.",
"A neutral or overbased quaternary ammonium detergent may also be prepared by an alternative process in which a tertiary amine is reacted with a dihydrocarbyl carbonate, such as a dialkyl carbonate or a dibenzyl carbonate to form an intermediate quaternary ammonium carbonate, as shown: where each R is independently a hydrocarbyl group (which may be the same or different).",
"The carbonate used may be, for instance, methyl carbonate or benzyl carbonate.",
"Reaction of the intermediate quaternary carbonate with an acidic organic compound (that is, an oil-soluble acidic substrate having at least one aliphatic hydrocarbyl group of sufficient length to impart oil solubility to the detergent) will generate the quaternary detergent by simple proton transfer from the acidic compound, releasing CO2 and an alcohol ROH, both of which may be removed if desired.",
"Moreover, the quaternary ammonium carbonate intermediate may be employed in stoichiometric excess relative to the detergent substrate, facilitating the synthesis of ashless overbased detergents (with base ratio >1.0).",
"That is, the quaternary ammonium carbonate may be reacted with less than 1 equivalent of the oil-soluble acidic substrate.",
"The detergent substrate may be derived from any of the acidic organic compounds disclosed herein for preparing detergents, to make detergents including carboxyl ate, sulfonate, phenate, salicylate, salixarate, and saligenin detergents.",
"By an analogous process, quaternary phosphonium detergents may likewise be prepared.",
"The resulting detergent may be reacted with additional basic material, whether of a quaternary pnictogen base or a metal base, to increase its TBN, as described in further detail above.",
"The detergent may be prepared entirely free of metal ions or it may contain a portion of metal ions along with the quaternary ammonium (pnictogen) ions, for example, by additional treatment with a basic metal compound, as described in greater detail above.",
"Such further treated materials may optionally be reacted with an oxo-acid, as described above.",
"A neutral quaternary ammonium detergent may also be prepared by yet another alternative process.",
"It is known that quaternization of a tertiary amine may be effected by reaction with an olefin oxide.",
"In the instant process, however, this quaternization reaction may be conducted simultaneously with reaction with the acidic organic compound (substrate), in a “one-step” process.",
"By “simultaneously” is meant mixing the three components, typically in a single vessel, and permitting them to react without any isolation or purification of intermediates and without intentionally reacting the amine and the olefin oxide to substantial completion before addition of the acidic organic compound.",
"The reaction may occur in the presence or absence of solvent and in the presence or absence of diluent oil.",
"In one embodiment, an amount of diluent oil is present that conventionally accompanies one or more of the reactants.",
"For instance, the acidic organic compound may be supplied mixed with 10 to 60 (or 20 to 50) weight percent diluent oil.",
"The presence of intentionally added water is not required for this simultaneous reaction, and it may be conducted in the absence of water.",
"This simultaneous reaction may be represented by the following reaction scheme: where R1, R2, R3 and R4 are hydrocarbyl groups or substituted hydrocarbyl groups as elsewhere described, and A-H represents an acidic organic compound that serves as the detergent substrate.",
"In order to effect reaction, it may be desirable to heat the reaction mixture, often in a sealed vessel, to an elevated temperature, such as at least 40 or 50° C., e.g., 60-150° C. or 70 to 130° C. or 80-110° C. or 80 to 100° C. for an appropriate period of time such as 15 minutes to 3 hours or 30 minutes to 2 hours or 45 minutes to 1.5 hours.",
"The reaction product may be worked up by conventional means such as vacuum stripping.",
"The product so obtained may be used as is, as a substantially neutral detergent, or it may be treated with excess base, either a metallic base or quaternary ammonium or phosphonium compound, as described above, and, optionally, further with an oxo acid, as described above.",
"It is believed that detergents prepared by the above one-step process exhibit certain advantages compared with similar materials prepared by a two-step process of first reacting the amine with the epoxide and subsequently reacting with the acidic organic compound.",
"In addition to the simplicity of the process, it is believed that a more complete reaction ensues, fewer byproducts are formed, and a more favorable TBN:TAN ratio is typically obtained, Alternatively, in any of the foregoing embodiments and processes, the mixture may be further reacted with an oxo acid such as carbon dioxide to facilitate the incorporation of additional basicity.",
"In any of the above-described synthetic methods, additional basicity may be introduced, if desired, by means of addition of a basic metal compound in addition to the basic quaternary pnictogen compound.",
"Any treatment with the oxo compound may be used to facilitate the incorporation of either the metal basicity or the quaternary pnictogen basicity, or both.",
"The detergents described herein may be profitably used in a lubricant formulation.",
"A prominent component of lubricant formulations is typically an oil of lubricating viscosity.",
"The base oil used in the inventive lubricating oil composition may be selected from any of the base oils in Groups I-V as specified in the American Petroleum Institute (API) Base Oil Interchangeability Guidelines.",
"The five base oil groups are as follows: Group I: >0.03% sulfur and/or <90% saturates and viscosity index 80 to 120; Group II: ≤0.03% S and ≥90% saturates and VI 80 to 120; Group III: ≤0.03% S and ≥90% saturates and VI >120; Group IV: all polyalphaolefins; Group V: all others.",
"Groups I, II and III are mineral oil base stocks.",
"The oil of lubricating viscosity, then, can include natural or synthetic lubricating oils and mixtures thereof.",
"Natural oils include animal oils and vegetable oils as well as mineral lubricating oils such as liquid petroleum oils and solvent-treated or acid treated mineral lubricating oils of the paraffinic, naphthenic or mixed paraffinic-naphthenic types.",
"Hydrotreated or hydrocracked oils are included within the scope of useful oils of lubricating viscosity.",
"Oils of lubricating viscosity derived from coal or shale are also useful.",
"Synthetic lubricating oils include hydrocarbon oils and halosubstituted hydrocarbon oils such as polymerized and interpolymerized olefins and mixtures thereof, alkylbenzenes, polyphenyl, alkylated diphenyl ethers and alkylated diphenyl sulfides and their derivatives, analogs and homologues.",
"Alkylene oxide polymers and interpolymers and derivatives thereof, and those where terminal hydroxyl groups have been modified by, for example, esterification or etherification, constitute other classes of synthetic lubricating oils.",
"Another suitable class of synthetic lubricating oils that can be used comprises the esters of dicarboxylic acids and those made from C5 to C12 monocarboxylic acids and polyols or polyol ethers.",
"Other synthetic lubricating oils include liquid esters of phosphorus-containing acids, polymeric tetrahydrofurans, and silicon-based oils.",
"Hydrotreated naphthenic oils are also known.",
"Synthetic oils may be used, such as those produced by Fischer-Tropsch reactions and typically may be hydroisomerized Fischer-Tropsch hydrocarbons or waxes.",
"In one embodiment oils may be prepared by a Fischer-Tropsch gas-to-liquid synthetic procedure as well as other gas-to-liquid oils.",
"The amount of the present detergents in a lubricant may be 0.1 to 10 percent by weight, or 0.9 to 6 or 1.3 to 4 or 1.5 to 3 percent by weight.",
"The detergents may also be supplied in the form of a concentrate in which a relatively larger amount of the detergent is provided in an oil medium, to be mixed with further components and further oil to form the final lubricant.",
"The amount of the detergent in a concentrate may be 5 to 50 percent by weight or 12 to 35 or 26 to 28 or 28 to 24 percent by weight.",
"The amount of the detergent of the present technology may also be present in a lubricant in an amount suitable to provide at least 0.1 TBN to the lubricant, alternatively, 0.1 to 20 TBN or 0.2 to 10 TBN or 0.5 to 5 or 1 to 3 TBN.",
"The lubricant as a whole may be a low or very low ash lubricant, having a sulfated ash level (ASTM D 874) of 0.01 to 1.5%, or 0.01 to 1.0%, or 0.05 to 1% or 0.1 to 0.5%.",
"Typically, the ash, or much or most of the ash, in the lubricant may be provided by components other than the detergents of the present technology.",
"In certain embodiments, the lubricant has a sulfated ash level of less than 1.0% and a TBN (ASTM D 2896, from all sources) of at least 7 or 8 or 9 or 10 or 12.Additional conventional components may be used in preparing a lubricant according to the present invention, for instance, those additives typically employed in a crankcase lubricant.",
"Crankcase lubricants may contain any or all of the following components hereinafter described.",
"Another additive is a dispersant.",
"Dispersants are well known in the field of lubricants and include primarily what is known as ashless-type dispersants and polymeric dispersants.",
"Ashless type dispersants are characterized by a polar group attached to a relatively high molecular weight hydrocarbon chain.",
"Typical ashless dispersants include nitrogen-containing dispersants such as N-substituted long chain alkenyl succinimides, also known as succinimide dispersants.",
"Succinimide dispersants are more fully described in U.S. Pat.",
"Nos.",
"4,234,435, 6,077,909 and 3,172,892 and in EP 0 355 895.Another class of ashless dispersant is high molecular weight esters, prepared by reaction of a hydrocarbyl acylating agent and a polyhydric aliphatic alcohol such as glycerol, pentaerythritol, or sorbitol.",
"Such materials are described in more detail in U.S. Pat.",
"No.",
"3,381,022.Another class of ashless dispersant is Mannich bases.",
"These are materials which are formed by the condensation of a higher molecular weight, alkyl substituted phenol, an alkylene polyamine, and an aldehyde such as formaldehyde and are described in more detail in U.S. Pat.",
"No.",
"3,634,515.Other dispersants include polymeric dispersant additives, which are generally hydrocarbon-based polymers which contain polar functionality to impart dispersancy characteristics to the polymer.",
"Dispersants can also be post-treated by reaction with any of a variety of agents.",
"Among these are urea, thiourea, dimercaptothiadiazoles, carbon disulfide, aldehydes, ketones, carboxylic acids, hydrocarbon-substituted succinic anhydrides, nitriles, epoxides, boron compounds, and phosphorus compounds.",
"References detailing such treatment are listed in U.S. Patent 4,654,403.The amount of dispersant in the present composition can typically be 1 to 10 weight percent, or 1.5 to 9.0 percent, or 2.0 to 8.0 percent, all expressed on an oil-free basis.",
"Another component is an antioxidant.",
"Antioxidants encompass phenolic antioxidants, which may comprise a butyl substituted phenol containing 2 or 3 t-butyl groups.",
"The para position may also be occupied by a hydrocarbyl group or a group bridging two aromatic rings.",
"The latter antioxidants are described in greater detail in U.S. Patent 6,559,105.Antioxidants also include aromatic amine, such as nonylated diphenylamines.",
"Other antioxidants include sulfurized olefins, titanium compounds, and molybdenum compounds.",
"U.S. Pat.",
"No.",
"4,285,822, for instance, discloses lubricating oil compositions containing a molybdenum and sulfur containing composition.",
"Typical amounts of antioxidants will, of course, depend on the specific antioxidant and its individual effectiveness, but illustrative total amounts can be 0.01 to 5 percent by weight or 0.15 to 4.5 percent or 0.2 to 4 percent.",
"Additionally, more than one antioxidant may be present, and certain combinations of these can be synergistic in their combined overall effect.",
"Viscosity improvers (also sometimes referred to as viscosity index improvers or viscosity modifiers) may be included in the compositions of this invention.",
"Viscosity improvers are usually polymers, including polyisobutenes, polymethacrylic acid esters, hydrogenated diene polymers, polyalkylstyrenes, esterified styrene-maleic anhydride copolymers, hydrogenated alkenylarene-conjugated diene copolymers, and polyolefins.",
"Multifunctional viscosity improvers, which also have dispersant and/or antioxidancy properties are known and may optionally be used.",
"Another additive is an antiwear agent.",
"Examples of anti-wear agents include phosphorus-containing antiwear/extreme pressure agents such as metal thiophosphates, phosphoric acid esters and salts thereof, phosphorus-containing carboxylic acids, esters, ethers, and amides; and phosphites.",
"In certain embodiments a phosphorus antiwear agent may be present in an amount to deliver 0.01 to 0.2 or 0.015 to 0.15 or 0.02 to 0.1 or 0.025 to 0.08 percent phosphorus.",
"Often the antiwear agent is a zinc dialkyldithiophosphate (ZDP).",
"For a typical ZDP, which may contain 11 percent P (calculated on an oil free basis), suitable amounts may include 0.09 to 0.82 percent.",
"Non-phosphorus-containing anti-wear agents include borate esters (including borated epoxides), dithiocarbamate compounds, molybdenum-containing compounds, tartrate esters, tartrimides, and sulfurized olefins.",
"Other additives that may optionally be used in lubricating oils include pour point depressing agents, extreme pressure agents, anti-wear agents, color stabilizers, friction modifiers, seal swell agents, corrosion inhibitors, and anti-foam agents.",
"One or more metal-containing detergents, as described above, may also be included in any of the formulations.",
"The lubricant described herein may be used to lubricate a mechanical device, by supplying the lubricant to the device, and in particular to its moving parts.",
"The device may be an internal combustion engine, a driveline component (e.g., automatic or manual transmission, gear box, differential).",
"The internal combustion engines that may be lubricated may include gasoline fueled engines, spark ignited engines, diesel engines, compression ignited engines, two-stroke cycle engines, four-stroke cycle engines, sump-lubricated engines, fuel-lubricated engines, natural gas-fueled engines, marine diesel engines, and stationary engines.",
"The vehicles in which such engines may be employed include automobiles, trucks, off-road vehicles, marine vehicles, motorcycles, all-terrain vehicles, and snowmobiles.",
"In one embodiment, the lubricated engine is a heavy duty diesel engine, which may include sump-lubricated, two- or four-stroke cycle engines, which are well known to those skilled in the art.",
"As used herein, the term “hydrocarbyl substituent” or “hydrocarbyl group” is used in its ordinary sense, which is well-known to those skilled in the art.",
"Specifically, it refers to a group having a carbon atom directly attached to the remainder of the molecule and having predominantly hydrocarbon character.",
"Examples of hydrocarbyl groups include: hydrocarbon substituents, including aliphatic, alicyclic, and aromatic substituents; substituted hydrocarbon substituents, that is, substituents containing non-hydrocarbon groups which, in the context of this invention, do not alter the predominantly hydrocarbon nature of the substituent; and hetero substituents, that is, substituents which similarly have a predominantly hydrocarbon character but contain other than carbon in a ring or chain.",
"A more detailed description is found in WO2008/147704, paragraphs 0118-0119.It is known that some of the materials described above may interact in the final formulation, so that the components of the final formulation may be different from those that are initially added.",
"For instance, metal ions (of, e.g., a detergent) can migrate to other acidic or anionic sites of other molecules.",
"The products formed thereby, including the products formed upon employing the composition of the present invention in its intended use, may not be susceptible of easy description.",
"Nevertheless, all such modifications and reaction products are included within the scope of the present invention; the present invention encompasses the composition prepared by admixing the components described above.",
"EXAMPLES Quaternary Ammonium Sulfonate Detergents Example 1a Tetra-n-butylammonium sulfonate Detergent (Base Ratio 2) 1) Diluent oil (18.6 g) and tetra-n-butyl ammonium hydroxide (“TNBAH,” 129.5 g of a 40% solution in methanol; 0.20 mol) are stirred under nitrogen.",
"A long-chain alkylbenzenesulfonic acid (50.3 g; 0.10 mol, in 5% oil) is slowly added over to give a brown colloidal suspension.",
"The reaction mixture is heated with stirring to 70-75° C. for 60 minutes under nitrogen.",
"2) Thereafter, the reaction is heated to 90-110° C. under nitrogen for 60 minutes to remove volatiles.",
"The reaction mixture is subsequently placed under vacuum (<5.3 kPa (<40 mmHg)) for 15-30 minutes.",
"3) Final product is isolated using a steam jacketed funnel and filter.",
"4) 91 g of product containing 17.8% oil is isolated, having a measured TBN of 80 and TAN of 1.2 (each measured on the oil-containing product).",
"Example 1b Tetra-n-butylammonium sulfonate Detergent (Base Ratio 3) 1) Example 1a, item 1, is substantially repeated except 194.3 g (0.30 moles) of the TNBAH is used.",
"2) See Example 1a item 2.3) See Example 1a item 3.4) 145 g of product containing 14.5% oil is isolated, TBN: 121; TAN: 0.7.Example 1c Tetra-n-butylammonium sulfonate/carbonate Detergent (Base Ratio 2) 1) Diluent oil (18.6 g) and TNBAH (194.3 g of a 40% solution in methanol; 0.30 mol) are mixed with 5.03 g (0.10 moles) alkylbenzenesulfonic acid substantially as in Example 1a, step 1.The mixture is heated with stirring to 60° C. 2) Carbon dioxide is administered (above surface at 14-20 L/hr (0.5-0.7 cfh)) for 60 minutes at 60° C. 3) See item 2 in Example 1a.",
"4) See item 3 in Example 1a.",
"5) 123 g of product containing 17.1% oil is isolated, TBN 86, TAN 0.6.Example 1d Tetra-n-butylammonium sulfonate/succinate detergent (base ratio 2) 1) Example 1c, part 1, is substantially repeated except that 5.9 g succinic acid is added along with the alkylbenzenesulfonic acid.",
"2) See item 2 in Example 1a.",
"3) See item 3 in Example 1a.",
"4) 98 g of product containing 17.1% oil is isolated.",
"TBN 83, TAN 3.4.Quaternary Ammonium Phenate Detergents Example 2a Tetra-n-butylammonium phenolate (C16-18)/carbonate Detergent (Base Ratio 10) 1) Diluent oil (20 g), ethylene glycol (5 g), mixed C4 and C5 alcohols (15 g), C16-18 alkyl phenol (6.64 g; 0.02 mol) and TNBAH (167 g of a 31% solution in methanol; 0.20 mol actives) are stirred at 50° C. under nitrogen for 60 minutes.",
"Water (9 g) is added with stirring for an additional 10 minutes.",
"2) See item 2 in Example 1c 3) See item 2 in Example 1a.",
"4) See item 3 in Example 1a.",
"5) 77 g of product containing 22.0% oil is isolated.",
"TBN 94, TAN 0.Example 2b Tetra-n-butylammonium phenolate (C16-18)/carbonate Detergent (Base Ratio 2) 1) Example 2a, item 1, is substantially repeated except that the amount of the C16-16 alkyl phenol is 33.2 g (0.10 mol) and the amount of the TNBAH solution is 130 g (40% solution, 0.20 mol).",
"2) See item 2 in Example 1c 3) See item 2 in Example 1a.",
"4) See item 3 in Example 1a.",
"5) 113 g of product containing 17.8% oil is isolated.",
"TBN 76, TAN 0.Example 2c Tetra-n-butylammonium phenolate (C7)/carbonate Detergent (Base Ratio 2) 1) Example 2a, item 1, is substantially repeated except that the phenol employed is 24.8 g (0.10 mol) C7 alkyl phenol and the amount of TNBAH is 130g (40% solution, 0.20 mol).",
"2) See item 2) in Example 1c 3) See item 2) in Example 1a.",
"4) Hot liquid is decanted from any settled solid material.",
"5) 103 g of product containing 19.2% oil is isolated.",
"TBN: 93; TAN: 0.Example 2d Tetra-n-butylammonium phenolate (C39) Detergent (Base Ratio 1) 1) Diluent oil (10 g), C39 alkyl phenol (68.1 g; 0.10 mol), methanol (50 g) and TNBAH (65 g of a 40% solution in Methanol; 0.10 mol) are stirred at 65° C. for 60 minutes under nitrogen.",
"2) See item 2 in Example 1a.",
"3) See item 3 in Example 1a.",
"4) 66 g of product containing 9.8% oil is isolated.",
"TBN: 55; TAN: 0.Example 2e Tetra-n-butylammonium phenolate (C39)/succinate Detergent (Base Ratio 2) 1) Diluent oil (10 g), C39 alkyl phenol (68.1 g; 0.10 mol), succinic acid (5.9 g; 0.05 mol) and TNBAH (129.5 g of a 40% solution in methanol; 0.20 mol) are stirred at 65° C. for 210 minutes under nitrogen.",
"2) See item 2 in Example 1a.",
"3) See item 3 in Example 1a.",
"4) 123 g of product containing 7.6% oil is isolated.",
"TBN: 56; TAN: 0.Example 2f Tetra-n-butylammonium phenolate (C39)/carbonate Detergent (Base Ratio 2) 1) Diluent oil (10 g), C39 alkyl phenol (68.1 g; 0.10 mol) water (5 g), mixed C4 and C5 alcohols (5 g) and TNBAH (129.5 g of a 40% solution in methanol; 0.2 mol) are stirred at 65° C. for 60 minutes under nitrogen.",
"2) See item 2 in Example 1c.",
"3) See item 2 in Example 1a.",
"4) See item 3 in Example 1a.",
"5) 107 g product containing 8.2% oil is isolated.",
"TBN: 62; TAN: 4.6.Quaternary Ammonium Stearate Detergents Example 3a Tetra-n-butylammonium iso-stearate/carbonate Detergent (Base Ratio 2) 1) Diluent oil (20 g), water (18 g), mixed C4 and C5 alcohols (15 g) and iso-stearic acid (28.6 g) and TNBAH (130 g of a 40% solution in methanol; 0.20 mol) are stirred at 50° C. for 60 minutes under nitrogen.",
"2) See item 2) in Example 1c.",
"3) See item 2) in Example 1a.",
"4) Decanting some solids from product affords oil, free from particulates.",
"5) 100 g product containing 19.4% oil is isolated.",
"TBN: 95; TAN: 2.1.Example 3b Tetra-n-butylammonium isostearate/carbonate Detergent (Base Ratio 5) 1) Diluent oil (20 g), water (18 g), mixed C4 and C5 alcohols (15 g), ethylene glycol (5 g) isostearic acid (11.4 g) and TNBAH (130 g of a 40% solution in methanol; 0.20 mol) are stirred at 50° C. for 60 minutes under nitrogen.",
"2) See item 2 in Example 1c.",
"3) See item 2 in Example 1a.",
"4) Upon cooling, freely flowing oil is obtained.",
"5) 86 g product containing 21.1% oil is obtained.",
"TBN: 111; TAN: 1.2.Quaternary Ammonium Salixarate Detergent Example 4 Tetra-n-butylammonium salixarate (C16-18) Detergent (Base Ratio 4) 1) Mixed C4-05 (15 g), C16-18 alkyl salixarene (46.8 g; 0.10 mol; containing 18.6% oil) and TNBAH (332 g of a 1.0 M solution in methanol; 0.40 mol) are stirred at 70° C. for 120 minutes under nitrogen.",
"(The salixarene is a mixture of materials prepared by the formaldehyde coupling of 2 moles of C16-18 alkyl phenol with 1 mole of salicylic acid.)",
"2) See item 2 in Example 1a.",
"3) 103g product containing 6.2% oil is obtained without further purification.",
"TBN: 188; TAN: 0.Quaternary Ammonium Calixarate Detergent Example 5 Tetra-n-butylammonium calixarate (C16-18) Detergent (Base Ratio 1) 1) Mixed C4-05 alcohols (15 g), C16-18 alkyl calixarene (104 g; 0.20 mol) and TNBAH (129.5 g of a 40% solution in methanol; 0.20 mol) are stirred at 70° C. for 120 minutes under nitrogen.",
"(The calixarene is a mixture of materials prepared by the formaldehyde coupling of C12 alkyl phenol.",
"It is believed that the calixarene mixture contains cyclic structures of about 6-8 or more alkylphenol units.",
"Such materials are described in EP 0 755 998.)",
"2) See item 2) in Example 1a.",
"3) 152 g product containing 34.2% oil is obtained without further purification.",
"TBN: 76; TAN: 0.Quaternary Ammonium Salicylate Detergents Example 6a Tetramethylammonium salicylate (C14-18) Detergent (Base Ratio 1) 1) Alkyl(C14-18)salicylic acid (142.4 g; 0.15 mol) in toluene, diluent oil (9.3 g), methanol (15 g) and tetramethylammonium hydroxide pentahydrate (27.2 g; 0.15 mol) are stirred at 60° C. for 60 minutes under nitrogen.",
"2) See item 2 in Example 1a.",
"3) 74 g product containing 12.5% oil is obtained without further purification.",
"TBN: 98; TAN: 1.Example 6b Tetraethylammonium salicylate (C14-18) Detergent (Base Ratio 1) 1) Alkyl(C14-18)salicylic acid (67.1 g; 0.10 mol), in oil (21%) and tetraethylammonium hydroxide (58.8 g of a 25% solution in methanol; 0.10 mol) are stirred at 65° C. for 60 minutes under nitrogen.",
"2) See item 2) in Example 1a.",
"3) 80 g product containing 18.1% oil is obtained without further purification.",
"TBN: 69; TAN: 2.4.Example 6c Tetraethylammonium salicylate (C14-18) Detergent (Base Ratio 2) 1) Example 6a, step 1, is substantially repeated except that the amount of tetraethylammonium hydroxide is 117.6 g of a 25% solution; 0.20 mol.",
"2) See item 2 in Example 1a.",
"3) See item 3 in Example 1a.",
"4) 83 g product containing 15.3% oil is obtained.",
"TBN: 86; TAN: 0.Example 6d Benzyltrimethylammonium salicylate (C14-18) Detergent (Base Ratio 1) 1) Alkylsalicylic acid (C14-18) (67.1 g; 0.10 mol) in oil (21%) and benzyltrimethylammonium hydroxide (41.8 g of a 40% solution in methanol; 0.10 mol actives) are stirred at 65° C. for 90 minutes.",
"2) See item 2 in Example 1a.",
"3) See item 3 in Example 1a.",
"4) 76 g product containing 17.7% oil is obtained.",
"TBN: 67; TAN: 0.Example 6e Tetra-n-butylammonium salicylate (C14-18) Detergent (Base Ratio 1) 1) Alkyl(C14-18)salicylic acid (67.1 g; 0.10 mol) in oil (21%) and TNBAH (64.8 g of a 40% solution in methanol; 0.10 mol) are stirred at 65° C. for 60 minutes under nitrogen.",
"2) See item 2 in Example 1a.",
"3) See item 3 in Example 1a.",
"4) 83 g product containing 15.9% oil is obtained.",
"TBN: 66; TAN: 0.8.Example 6f Tetra-n-butylammonium salicylate (C14-18) Detergent (Base Ratio 2) 1) Example 6e, step 1 is substantially repeated except that the amount of the TNBAH solution is 129.5 g (0.20 mol).",
"2) See item 2 in Example 1a.",
"3) See item 3 in Example 1a.",
"4) 122 g product containing 19.3% oil is obtained.",
"TBN: 82; TAN: 0.1.Example 6g Tetra-n-butylammonium salicylate (C14-18) detergent (base ratio 3) 1) Alkyl(C14-18)salicylic acid (60 g; 0.09 mol) in oil (21%) and TNBAH (173.7 g of a 40% solution in methanol; 0.27 mol) are stirred at 70-75° C. for 90 minutes under nitrogen.",
"2) See item 2 in Example 1a.",
"3) See item 3 in Example 1a.",
"4) 128g product containing 10.2% oil is obtained.",
"TBN: 111; TAN: 0.Example 6h Tetra-n-butylammonium salicylate (C14-18)/borate ester Detergent (Base Ratio 2) 1) Alkyl(C14-18)salicylic acid (60 g; 0.09 mol) in oil (21%), 2-ethylhexylborate ester (39.8 g; 0.10 mol) and TNBAH (115.3 g of a 40% solution in methanol; 0.18 mol) are stirred at 70-75° C. for 90 minutes under nitrogen.",
"2) See item 2 in Example 1a.",
"3) See item 3 in Example 1a.",
"4) 131 g product containing 9.0% oil is obtained.",
"TBN: 69; TAN: 0.Example 6i Tetra-n-butylammonium salicylate (C14-18)/tartrate Detergent (Base Ratio 2) 1) Alkyl(C14-18)salicylic acid (56.2 g; 0.10 mol) in oil (18%), water (5 g), tartaric acid (7.5 g; 0.05 mol) and TNBAH (129.5 g of a 40% solution in methanol; 0.20 mol) are stirred at 70-75° C. for 60 minutes under nitrogen.",
"2) See item 2 in Example 1a.",
"3) See item 3 in Example 1a.",
"4) 91 g product containing 9.1% oil is obtained.",
"TBN: 94; TAN: 8.5.Example 6j Tetra-n-butylammonium salicylate (C14-18)/acetylacetonate Detergent (Base Ratio 2) 1) Alkyl(C14-18)salicylic acid (56.2 g; 0.10 mol) in oil (18%), acetylacetone (10 g; 0.10 mol) and TNBAH (129.5 g of a 40% solution in methanol; 0.20 mol) are stirred at 70-75° C. for 60 minutes under nitrogen.",
"2) See item 2) in Example 1a.",
"3) See item 3 in Example 1a.",
"4) 81 g product containing 8.9% oil is obtained.",
"TBN: 105; TAN: 9.7 Quaternary Ammonium Succinate Detergents Example 7a Tetra-n-butylammonium succinate (C12)/carbonate Detergent (Base Ratio 3) 1) Diluent oil (20 g), water (9 g) and dodecylsuccinic anhydride (15.6 g) are stirred at room temperature under nitrogen for 1 hr ensuring hydrolysis of the succinic anhydride.",
"2) TNBAH (40% solution in methanol, 130 g; 0.20 mol), ethylene glycol (5 g) and mixed C4 and C5 alcohols (15 g) are added and the mixture is stirred at 50° C. for 60 minutes under nitrogen.",
"3) See item 2 in Example 1c.",
"4) See item 2 in Example 1a.",
"5) The mixture is filtered to obtain 72 g of a brown oil containing 20.6% oil.",
"TBN: 101; TAN: 9.3.Example 7b Tetra-n-butyl ammonium succinate (C16)/carbonate Detergent (Base Ratio 2) 1) Diluent oil (20 g), water (36 g) and hexadecenylsuccinic anhydride (30.0 g) are stirred at (50° C.) under nitrogen for 30 minutes ensuring hydrolysis of the succinic anhydride.",
"2) TNBAH (40% solution in methanol, 130 g; 0.20 mol), and mixed C4 and C5 alcohols (15 g) are added and the mixture is stirred at 50° C. for 60 minutes under nitrogen.",
"3) See item 2 in Example 1c.",
"4) See item 2 in Example 1a.",
"5) 105g product containing 21.8% oil is obtained.",
"TBN: 97; TAN: 6.1.Example 7c Tetra-n-butylammonium succinate (C39) neutral Detergent (Base Ratio 1) 1) Diluent oil (10 g), water (18 g), methanol (30 g) and polyisobutene-substituted succinic anhydride (63.2 g; 0.05 mol) are stirred and heated (65° C.) under nitrogen for 60 minutes to ensure hydrolysis of the succinic anhydride.",
"2) TNBAH (65 g of a 40% solution in Methanol; 0.10 mol) is added and the mixture is heated and stirred at 65° C. for 60 minutes under nitrogen.",
"3) See item 2 in Example 1a.",
"4) See item 3 in Example 1a.",
"5) 56 g product containing 10.2% oil is obtained.",
"TBN: 60; TAN: 0.Example 7d Tetra-n-butylammonium succinate (C39) Detergent (Base Ratio 2) 1) Step 1 of Example 7c is substantially repeated.",
"2) TNBAH (129.5 g of a 40% solution in methanol; 0.20 mol) is added and the mixture heated as in Example 7c.",
"3) See item 2 in Example 1a.",
"4) See item 3 in Example 1a.",
"5) 65 g product containing 8.1% oil is obtained.",
"TBN: 85; TAN: 0.Example 7e Tetra-n-butyl ammonium succinate (C39)/carbonate Detergent (Base Ratio 2) 1) Steps 1 and 2 of Example 7c are substantially repeated 2) See item 2 in Example 1c.",
"3) See item 2 in Example 1a.",
"4) See item 3 in Example 1a.",
"5) 128 g product containing 7.8% oil is obtained.",
"TBN: 88; TAN: 3.9.Quaternary Imidazolium or Pyridinium Detergents Example 8 Imidazolium phenolate (C16-18) Detergent (Base Ratio 1) 1) Aqueous sodium hydroxide (8.0 g; 0.20 mol) in water (50 g) is added to diluent oil (10 g), mixed C4 and C5 alcohols (25 g) and C16-18 alkyl phenol (33.2 g; 0.10 mol) mixture and the reaction heated at 60° C. for 60 minutes under nitrogen.",
"2) 1-butyl-3-methylimidazolium chloride (17.5 g; 0.10 mol) is added and the reaction mixture stirred at the above conditions for an additional 120 minutes.",
"3) The resultant organic layer is separated from the aqueous layer and the organic layer is heated (100-110° C.) for 30 minutes under nitrogen and then placed under vacuum (ca.",
"2.7 kPa (20 mmHg)) at the same temperature to remove remaining traces of volatile components.",
"4) 51 g product containing 28.3% oil is obtained.",
"TBN: 61; TAN: 0.Example 9 Imidazolium salicylate (C14-16) Detergent (Base Ratio 2) 1) Aqueous sodium hydroxide (8.0 g; 0.20 mol) in water (25 g) is added to diluent oil (20 g), mixed C4 and C5 alcohols (25 g), water (36 g) and alkyl(C14-16)salicylic acid (44.0 g; 0.10 mol).",
"The reaction mixture is heated and stirred at (75° C. for 30 minutes under nitrogen.",
"2) To this mixture, 1-butyl-3-methylimidazolium chloride (34.9 g; 0.20 mol) is added and the reaction mixture stirred for an additional 120 minutes.",
"3) See item 3 in Example 8.4) 57 g product containing 29.6% oil is obtained.",
"TBN: 101; TAN: 3.7.Example 10 Cetylpyridinium salicylate (C14-16) Detergent (Base Ratio 1) 1) Aqueous sodium hydroxide (6 g; 0.15 mol) in water (10g) is added to a toluene (30 g), mixed C4 and C5 alcohols (30 g), water (36 g) and alkyl(C14-16) salicylate (44.0 g; 0.10 mol).",
"The reaction mixture is heated, with stirring, to 75° C. for 30 minutes under nitrogen.",
"2) To this mixture, cetylpyridinium chloride (38.8 g; 0.10 mol) is added and the reaction mixture stirred for a further 120 minutes.",
"3) See item 3) in Example 8.4) 50 g product containing 0% oil is obtained.",
"TBN: 84; TAN: 0.Example 11 A formulation is prepared containing 1.9 percent of a product similar to that of Example 6f, above, except that the amount of diluent oil is somewhat different.",
"The formulation is compared, in the table below, against the same formulation that does not contain the material of the present invention.",
"Example Comparative Component, % 11 Ex.",
"1 Oils (API Group II) 87.0 88.9 Quaternary ammonium salicylate (9.6% 1.9 — oil) Viscosity modifier, olefin copolymer 6.1 6.1 Pour point depressant 0.2 0.2 Succinimide dispersant (incl.",
"50% oil) 6.2 6.2 Ca sulfonate detergents (~44% oil) 1.61 1.61 Ca phenate detergents (~34% oil) 1.22 1.22 Zinc dialkyl dithiophosphate (9% oil) 0.88 0.88 Antioxidants 1.04 1.04 Other conventional components 0.12 0.12 Analysis: Ca content of composition 0.230 0.228 Zn content 0.104 0.106 % Sulfated Ash (ASTM D 874) 0.94 0.97 TBN (ASTM D 2896) 10.0 7.7 TBN (ASTM D 4739) Buffer Point 8.8 6.3 Inflection Point 9.3 6.8 It is evident from the table that the presence of the quaternary ammonium detergent serves to desirably increase the TBN of the lubricant composition, without imparting additional metals or sulfated ash to the lubricant.",
"Example 12 A one-step reaction.",
"A flask is charged with 1,4-diazabicylo[2.2.2]octane (11.2 g; 0.10 mol) and alkylsalicylic acid (48.4 g, oil-containing, 0.10 mol) to which propylene oxide (11.6 g, 0.20 mol) is added dropwise at room temperature with stirring over 15 minutes.",
"The reaction mixture is stirred for an additional 15 minutes at room temperature and heated to 50° C. for 120 minutes, and then to 80-110° C. under nitrogen for 60 minutes, before being subjected to vacuum (<5.3 kPa, 40 mm Hg) for 15 minutes.",
"56 g of product containing 12.5% oil is isolated, having TBN of 166 and TAN of 6.2.Example 13 A one-step reaction.",
"Example 12 is substantially repeated except that in place of the diazabicylooctane there is used 1,8-diazabicylo[5.4.0]undec-7-ene (15.2 g, 0.10 mol).",
"60 g of product containing 11.8% oil is isolated, having TBN of 83 and TAN of 0.Examples 14 -33 Except as noted, each of the following materials is charged to a Parr bomb, heated to 80-100° C. for 1-3 hours and then cooled to room temperature.",
"In each instance, the tertiary amine is as shown in the table below; the alkylene oxide is propylene oxide, and the organic acid is a (A) hydrocarbyl-substituted salicylic acid or (B) an alkylbenzene sulfonic acid.",
"Stoichi- % Ex Tertiary amine Acid ometrya Yield TBN TAN 14 A 1.0:2.0: 1.0 96 66 0 15 A 1.0:1.2: 1.0 95 73 1 16 A 1.0:1.2: 1.0 92 77 0 17 A 1.0:1.2: 1.0 96 72 0 18 A 1.0:1.2: 1.0 95 74 1 19 A 1.0:1.2: 1.0 97 70 9 20 A 1.0:2.0: 94 73 0 1.0 21 A 1.0:1.1: 1.0 94 77 2 22 A 1.0:1.2: 1.0 87 77 0 23 A 1.0:1.2: 1.0 94 76 0 24 A 1.0:1.2: 1.0 95 72 2 25 A 1.0:1.2: 1.0 89 77 0 26 A 1.0:1.2: 1.0 97 73 2 27 B 1.0:4.0: 1.0 96 52 5 28 B 1.0:4.0: 1.0 96 55 0 29 B 1.0:4.0: 1.0 96 62 0 30 B 1.0:4.0: 1.0 93 60 0 31b B 1.0:4.0: 1.0 63 65 40 32 B 1.0:4.0: 1.0 93 55 0 33 B 1.0:1.5: 1.0 96 57 8 aequivalent ratio amine:alkylene oxide:organic acid bA reference example: prepared by a two step process in which the amine, propylene oxide, and acetic acid are charged to the Parr bomb and reacted, then subsequently reacted with the sulfonic acid.",
"The reported product is believed to be contaminated with a significant amount of tertiary amine salt.",
"Bz: benzyl Ph: phenyl Example 34 General synthesis of quaternary ammonium salt from dimethyl carbonate.",
"A Parr bomb is charged with 1.0 equivalents of a tertiary amine, 1.0 equivalents of dimethylcarbonate, and methanol solvent (about 4.8 equivalents).",
"The mixture is sealed and heated to 120° C. for 2 hours before being cooled to room temperature.",
"The volatiles are removed by vacuum and the product isolated.",
"Example 35 General synthesis of quaternary ammonium salt from dibenzyl carbonate.",
"A flask is charged with dibenzylcarbonate (75 g, 0.30 mol, 1 equivalent) and a tertiary amine (0.60 mol, 2 equivalents) and heated at 100-130° C. for 24-72 hours.",
"Thereafter the reaction mixture is subjected to vacuum (<0.3kPa, <2 mm Hg) and heating (100-130° C.) for 1 hour and the product is isolated.",
"Example 36 General synthesis of quaternary ammonium salt from benzyl chloride.",
"A flask is charged with water (91 g, 5 mol), methanol (32 g, 1 mol), benzyl chloride (127 g, 1 mole) and a tertiary amine (1 mole).",
"An exothermic reaction is observed.",
"After the reaction mixture has cooled to room temperature, the volatiles are removed by vacuum and the products isolated.",
"Example 37 General detergent synthesis by carbonate anion metathesis, from benzyl carbonate.",
"A flask is charged with the quaternary ammonium carbonate prepared generally as in Example 35 (0.106 equivalents) and heated to 80° C., to which a detergent acid (e.g., a C16-18 alkyl salicylic acid, 0.100 equivalents, containing diluent oil) is added dropwise with stirring, over the course of 1 hour.",
"The mixture is stirred for an additional 30 minutes, then heated to 130° C. under nitrogen for 30 minutes and subjected to vacuum (<0.3 kPa, <2 mm Hg) for 30 minutes.",
"The product obtained typically will contain 5-10% diluent oil.",
"Example 38 General detergent synthesis by carbonate anion metathesis, from methyl carbonate.",
"A flask is charged with the quaternary ammonium carbonate prepared generally as in Example 34 (1.0-2.0 equivalents) and heated to 80° C., to which a detergent acid (e.g., a C16-18 alkyl salicylic acid, 1.0 equivalents, containing diluent oil) is added dropwise with stirring, over the course of 30 minutes.",
"The mixture is stirred for an additional 30 minutes, then heated to 100° C. under nitrogen for 30 minutes, to isolate a product containing 5 to 10% oil.",
"Example 39 General detergent synthesis by chloride-based anion metathesis.",
"A flask is charged with the detergent acid (e.g.",
"a C16-18 alkyl salicylic acid, 1.0 equivalents, containing diluent oil) and toluene (7.4 eq), to which a solution of sodium hydroxide (1.0 equivalents) in water (4.5 eq.)",
"is added dropwise with stirring over 30 minutes.",
"Thereafter the mixture is heated to 75° C. and a trihydrocarbylammonium chloride prepared generally as in Example 36 (1.1 equivalent) is added and the mixture stirred for 1 hour.",
"Stirring is discontinued and the mixture typically separates into two layers, and the aqueous layer is removed.",
"Additional water is added and the mixture is stirred at 75° C. and the aqueous phase separated.",
"The washing procedure may be repeated, for example, up to 3 times.",
"Thereafter, the mixture is heated to 130° C. under nitrogen and subjected to vacuum (<7 kPa, <50 mm Hg) for 30 minutes, to isolate a product containing 5-10% oil.",
"Examples 40-57 Quaternary ammonium detergents are prepared using the general techniques of Examples 34 through 39 as shown in the following Table: Prep Base Method Ex Cation Aniona Ratio of Ex.",
": Yield TBN TAN 40 41 B A 1.06 1.05 37 37 100 100 90.9 75.9 0 0.17 42 43 B A 1.05 1.05 37 37 100 99 78.0 68.2 0 1.98 44 45 B A 1.1 1.1 39b 39b 99 84 73.6 66.2 0.98 2.33 46 47 B A 1.05 1.05 37 37 95 100 75.0 66.3 0.15 0.32 48 49 B A 1.1 1.1 39 39 94 88 72.0 70.2 1.58 0.74 50 51 B A 1.06 1.0 39 39 89 96 71.6 68.8 9.75 3.81 52 53 A B 1.04 1.0 38 38 92 92 159 77.2 0.24 4.51 54 A 1.97 38 92 100.8 0.66 55 56 A A 1.13 1.74 38 38 77 96 106.4 118.7 8.54 9.81 57 A 2.0 39 77 122 12.25 aAnion A: from hydrocarbyl salicylic acid Anion B: from alkylbenzene sulfonic acid balso prepared by the method of example 37 Ph: phenyl Each of the documents referred to above is incorporated herein by reference.",
"The mention of any document is not an admission that such document qualifies as prior art or constitutes the general knowledge of the skilled person in any jurisdiction.",
"Except in the Examples, or where otherwise explicitly indicated, all numerical quantities in this description specifying amounts of materials, reaction conditions, molecular weights, number of carbon atoms, and the like, are to be understood as modified by the word “about.” Unless otherwise indicated, each chemical or composition referred to herein should be interpreted as being a commercial grade material which may contain the isomers, by-products, derivatives, and other such materials which are normally understood to be present in the commercial grade.",
"However, the amount of each chemical component is presented exclusive of any solvent or diluent oil, which may be customarily present in the commercial material, unless otherwise indicated.",
"It is to be understood that the upper and lower amount, range, and ratio limits set forth herein may be independently combined.",
"Similarly, the ranges and amounts for each element of the invention can be used together with ranges or amounts for any of the other elements.",
"As used herein, the expression “consisting essentially of” permits the inclusion of substances that do not materially affect the basic and novel characteristics of the composition under consideration."
]
] |
Patent_15871233
|
[
[
"ACOUSTIC CHANNEL-BASED DATA COMMUNICATIONS METHOD",
"It discloses an acoustic channel-based data communications method which performs channel coding on an original data signal using a CRC coding method and a BCH coding method to obtain a coded sequence; modulates the coded sequence using a preset audio sequence symbol set via a symbol mapping method to obtain a digital audio signal; selects a channel frequency band according to characteristics of a transmitting equipment and interference between frequency bands; and converts the digital audio signal into an analog audio signal through a digital-to-analog converter and transmits the signal to a channel for transmission according to the selected channel frequency band."
],
[
"1.An acoustic channel-based data communications method, comprising: receiving an analog audio signal transmitted in a channel and converting the analog audio signal into a digital audio signal through an analog-to-digital converter; eliminating strong interference channel frequency band data from the digital audio signal by calculating the cross-correlation between the digital audio signal having a frequency within the range of each channel frequency band and an original sample signal; capturing a synchronization symbol by calculating the cross-correlation between a synchronization symbol sample and the digital audio signal with strong interference channel frequency band data eliminated, and performing symbol inverse mapping, thus completing signal demodulation and obtaining a digital sequence; and performing channel decoding on the digital sequence using a CRC decoding method and a BCH decoding method to obtain the original data signal.",
"2.The acoustic channel-based data communication method according to claim 1, wherein the eliminating strong interference channel frequency band data from the digital audio signal by calculating the cross-correlation cross-correlation between the digital audio signal having a frequency within the range of each channel frequency band and the original sample signal specifically comprises: dividing the channel into a plurality of channel frequency bands, respectively calculating the cross-correlation between the digital audio signal having a frequency within the range of each channel frequency band and the original sample signal, determining the channel frequency band with unobvious correlation peak as a strong interference channel frequency band, and eliminating the strong interference channel frequency band data from the digital audio signal, wherein a cross-correlation function is rxy=IFFT{FFT{x(k)}*FFT{y(k)}′}; in the formula, x(k) is the digital audio signal, y(k) is the original sample signal, ′ indicates conjugation, FFT indicates fast Fourier transform, and IFFT indicates inverse fast Fourier transform.",
"3.The acoustic channel-based data communication method according to claim 1, wherein the capturing a synchronization symbol by calculating the cross-correlation between the synchronization symbol sample and the digital audio signal with strong interference channel frequency band data eliminated, and performing symbol inverse mapping, thus completing signal demodulation and obtaining the digital sequence specifically comprises: for the digital audio signal with strong interference channel frequency band data eliminated, continuously calculating the cross-correlation between data in a detection window and the synchronization symbol sample; when obvious correlation peaks are not identified, sliding backward for a certain distance and capturing the synchronization symbol again; when obvious correlation peaks are identified, determining that frame synchronization is successful, and calculating the offset distance between the detection window and an original point according to the position of the correlation peak, adjusting the position of the detection window according to the offset distance between the detection window and the original point, and capturing the synchronization symbol; and performing correlation calculation on a sample sequence of odd/even mapping symbols and the digital symbol after the synchronization symbol in the digital audio signal in sequence according to an odd-even order, the most similar odd/even mapping symbol being a current symbol content, and mapping the current symbol content as the digital sequence according to a preset mapping relation, thus completing demodulation; wherein the odd/even mapping symbol is obtained through the following steps: selecting 2n+1 sequence symbols from a preset audio sequence symbol set, and classifying the 2n+1 sequence symbols into odd mapping symbols and even mapping symbols, wherein the number of the odd mapping symbols is equal to that of the even mapping symbols, and n=1, 2, 3 .",
".",
".",
"4.The acoustic channel-based data communication method according to claim 1, wherein the performing channel decoding on the digital sequence using a CRC decoding method and a BCH decoding method to obtain the original data signal specifically comprises: decoding the digital sequence using the BCH decoding method; and decoding the BCH decoded signal using the CRC decoding method to obtain the original data signal.",
"5.An acoustic channel-based data communications method, comprising: performing channel coding on an original data signal using a CRC coding method and a BCH coding method to obtain a coded sequence; modulating the coded sequence using a preset audio sequence symbol set via a symbol mapping method to obtain a digital audio signal; selecting a channel frequency band according to characteristics of a transmitting equipment and interference between frequency bands; converting the digital audio signal into an analog audio signal through a digital-to-analog converter and transmitting the signal to a channel for transmission according to the selected channel frequency band; receiving the analog audio signal transmitted in the channel and converting the signal into a digital audio signal through the analog-to-digital converter; eliminating strong interference channel frequency band data from the digital audio signal by calculating the cross-correlation between the digital audio signal having a frequency within the range of each channel frequency band and an original sample signal; capturing a synchronization symbol by calculating the cross-correlation between a synchronization symbol sample and the digital audio signal with strong interference channel frequency band data eliminated, and performing symbol inverse mapping, thus completing signal demodulation and obtaining a digital sequence; and performing channel decoding on the digital sequence using a CRC decoding method and a BCH decoding method to obtain the original data signal.",
"6.The acoustic channel-based data communication method according to claim 5, wherein the performing channel coding on the original data signal using a CRC coding method and a BCH coding method to obtain the coded sequence specifically comprises: coding the original data signal using the CRC coding method to obtain a CRC coded sequence; and coding the CRC coded sequence using the BCH coding method to obtain the coded sequence; the performing channel decoding on the digital sequence using a BCH decoding method and a CRC decoding method to obtain the original data signal specifically comprises: decoding the digital sequence using the BCH decoding method; and decoding the BCH decoded signal using the CRC decoding method to obtain the data audio signal.",
"7.The acoustic channel-based data communication method according to claim 5, wherein the modulating the coded sequence using a preset audio sequence symbol set via a symbol mapping method to obtain a digital audio signal specifically comprises: selecting a sequence symbol as a synchronization symbol for a data frame of the digital audio signal; selecting 2n+1 sequence symbols from the preset audio sequence symbol set and classifying the 2n+1 sequence symbols into odd mapping symbols and even mapping symbols, wherein the number of the odd mapping symbols is equal to that of the even mapping symbols, and n=1, 2, 3 .",
".",
".",
"; dividing the coded sequence into a plurality of coded sequence groups, each coded sequence group comprising n bit data; and mapping the odd coded sequence group into a sequence symbol in the odd mapping symbol according to a preset mapping relation, and mapping the even coded sequence group into a sequence symbol in the even mapping symbol according to the preset mapping relation, thus mapping the coded sequences into a plurality of digital audio symbols; wherein the synchronization symbol and the plurality of digital audio symbols form a data frame of the digital audio signal.",
"8.The acoustic channel-based data communication method according to claim 7, wherein the method, after mapping the coded sequence into a plurality of digital audio symbols, further comprises: copying partial data sequences of the digital audio symbols to a front end and a back end of the digital audio signal to form a front transition area and a back transition area, and completing symbol extension of the digital audio symbol; wherein a gradient window function of the front transition area is f(x)=½(cos x+1), x ∈ (π,2π), a gradient window function of the back transition area is f(x)=½(cos x+1), x ∈ (0,π), and the back transition area of a previous data frame and the front transition area of a later data frame of the digital audio signal are overlapped.",
"9.The acoustic channel-based data communication method according to claim 8, wherein the method, after completing symbol extension of the digital audio symbol, further comprises: for the digital audio symbol after the symbol extension, copying partial data sequences at the tail and inserting the partial data sequences between the front transition area and a head of the current digital audio symbol as guard interval, and performing further symbol extension on the digital audio data frame.",
"10.The acoustic channel-based data communication method according to claim 5, wherein the eliminating strong interference channel frequency band data from the digital audio signal by calculating the cross-correlation between the digital audio signal having a frequency within the range of each channel frequency band and the original sample signal specifically comprises: dividing the channel into a plurality of channel frequency bands, respectively calculating the cross-correlation between the digital audio signal having a frequency within the range of each channel frequency band and the original sample signal, determining the channel frequency band with unobvious correlation peak as a strong interference channel frequency band, and eliminating the strong interference channel frequency band data from the digital audio signal, wherein a cross-correlation function is rxy=IFFT{FFT{x(k)}*FFT{y(k)}′}; in the formula, x(k) is the digital audio signal, y(k) is the original sample signal, ′ indicates conjugation, FFT indicates fast Fourier transform, and IFFT indicates inverse fast Fourier transform.",
"11.The acoustic channel-based data communication method according to claim 7, wherein the capturing a synchronization symbol by calculating the cross-correlation between the synchronization symbol sample and the digital audio signal with strong interference channel frequency band data eliminated, and performing symbol inverse mapping, thus completing signal demodulation and obtaining a digital sequence comprises: for the digital audio signal with strong interference channel frequency band data eliminated, continuously calculating the cross-correlation between data in a detection window and the synchronization symbol sample; when obvious correlation peaks are not identified, sliding backward for a certain distance and capturing the synchronization symbol again; when obvious correlation peaks are identified, determining that frame synchronization is successful, and calculating the offset distance between the detection window and an original point according to the position of the correlation peak, adjusting the position of the detection window according to the offset distance between the detection window and the original point, and capturing the synchronization symbol; and performing correlation calculation on a sample sequence of odd/even mapping symbols and the digital symbol after the synchronization symbol in the digital audio signal in sequence according to an odd-even order, the most similar odd/even mapping symbol being a current symbol content, and mapping the current symbol content as the digital sequence according to a preset mapping relation, thus completing demodulation."
],
[
"<SOH> BACKGROUND <EOH>A system model of a signal communications system is as shown in FIG.",
"1 .",
"At a transmitting end, signal modulation is performed on primary data subjected to channel coding, so as to modulate the primary data into an audio signal of a data frame composed of a plurality of symbols and conduct digital-to-analogue conversion on the signal, and finally the signal is transmitted through a loud speaker.",
"At a receiving end, a microphone after receiving the audio signal, reduces the audio signal to the primary data through analogue-to-digital conversion, signal demodulation and channel decoding.",
"Audio communications with a frequency below 24 kHz may make full use of present video and audio playing devices and receiving devices without specially customized loud speaker and microphone.",
"However, in the natural world, an audio with a frequency below 24 kHz usually has very strong interference caused by environment noises."
],
[
"<SOH> SUMMARY <EOH>A technical problem to be solved by the present invention is to provide an acoustic channel-based data communications method.",
"The present invention can implement audio signal communications in weak signal environment submerged in background noise.",
"In order to solve the foregoing technical problem, the present invention provides an acoustic channel-based data communications method, including: performing channel coding on an original data signal using a CRC coding method and a BCH coding method to obtain a coded sequence; modulating the coded sequence using a preset audio sequence symbol set via a symbol mapping method to obtain a digital audio signal; selecting a channel frequency band according to characteristics of a transmitting equipment and interference between frequency bands; and converting the digital audio signal into an analog audio signal through a digital-to-analog converter and transmitting the signal to a channel for transmission according to the selected channel frequency band.",
"Further, the performing channel coding on the original data signal using a CRC coding method and a BCH coding method to obtain the coded sequence specifically includes: coding the original data signal using the CRC coding method to obtain a CRC coded sequence; and coding the CRC coded sequence using the BCH coding method to obtain the coded sequence.",
"Further, the modulating the coded sequence using the preset audio sequence symbol set via a symbol mapping method to obtain the digital audio signal specifically includes: selecting a sequence symbol as a synchronization symbol for a data frame of the digital audio signal; selecting 2 n+1 sequence symbols from the preset audio sequence symbol set and classifying the 2 n+1 sequence symbols into odd mapping symbols and even mapping symbols, wherein the number of the odd mapping symbols is equal to that of the even mapping symbols, and n=1, 2, 3 .",
".",
".",
"; dividing the coded sequence into a plurality of coded sequence groups, each coded sequence group comprising n bit data; and mapping the odd coded sequence group into a sequence symbol in the odd mapping symbol according to a preset mapping relation, and mapping the even coded sequence group into a sequence symbol in the even mapping symbol according to the preset mapping relation, thus mapping the coded sequences into a plurality of digital audio symbols; wherein the synchronization symbol and the plurality of digital audio symbols form a data frame of the digital audio signal.",
"Further, the method, after mapping the coded sequence into a plurality of digital audio symbols, further includes: copying partial data sequences of the digital audio symbols to a front end and a back end of the digital audio signal to form a front transition area and a back transition area, and completing symbol extension of the digital audio symbol; wherein a gradient window function of the front transition area is f(x)=½(cos x+1), x ∈ (π,2π), a gradient window function of the back transition area is f(x)=½(cos x+1), x ∈ (0,π), and the back transition area of a previous data frame and the front transition area of a later data frame of the digital audio signal are overlapped.",
"Further, the method, after completing symbol extension of the digital audio symbol, further includes: for the digital audio symbol after the symbol extension, copying partial data sequences at the tail and inserting the partial data sequences between the front transition area and a head of the current digital audio symbol as guard interval, and performing further symbol extension on the digital audio data frame.",
"The present invention further provides an acoustic channel-based data communications method, including: receiving an analog audio signal transmitted in a channel and converting the analog audio signal into a digital audio signal through an analog-to-digital converter; eliminating strong interference channel frequency band data from the digital audio signal by calculating the cross-correlation between the digital audio signal having a frequency within the range of each channel frequency band and an original sample signal; capturing a synchronization symbol by calculating the cross-correlation between a synchronization symbol sample and the digital audio signal with strong interference channel frequency band data eliminated, and performing symbol inverse mapping, thus completing signal demodulation and obtaining a digital sequence; and performing channel decoding on the digital sequence using a CRC decoding method and a BCH decoding method to obtain the original data signal.",
"Further, the eliminating strong interference channel frequency band data from the digital audio signal by calculating the cross-correlation between the digital audio signal having a frequency within the range of each channel frequency band and the original sample signal specifically includes: dividing the channel into a plurality of channel frequency bands, respectively calculating the cross-correlation between the digital audio signal having a frequency within the range of each channel frequency band and the original sample signal, determining the channel frequency band with unobvious correlation peak as a strong interference channel frequency band, and eliminating the strong interference channel frequency band data from the digital audio signal, wherein a cross-correlation function is r xy =IFFT{FFT{x(k)}*FFT{y(k)}′}; in the formula, x(k) is the digital audio signal, y(k) is the original sample signal, ′ indicates conjugation, FFT indicates fast Fourier transform, and IFFT indicates inverse fast Fourier transform.",
"Further, the capturing a synchronization symbol by calculating the cross-correlation between the synchronization symbol sample and the digital audio signal with strong interference channel frequency band data eliminated, and performing symbol inverse mapping, thus completing signal demodulation and obtaining the digital sequence specifically includes: for the digital audio signal with strong interference channel frequency band data eliminated, continuously calculating the cross-correlation between data in a detection window and the synchronization symbol sample; when obvious correlation peaks are not identified, sliding backward for a certain distance and capturing the synchronization symbol again; when obvious correlation peaks are identified, determining that frame synchronization is successful, and calculating the offset distance between the detection window and an original point according to the position of the correlation peak, adjusting the position of the detection window according to the offset distance between the detection window and the original point, and capturing the synchronization symbol; and performing correlation calculation on a sample sequence of odd/even mapping symbols and the digital symbol after the synchronization symbol in the digital audio signal in sequence according to an odd-even order, the most similar odd/even mapping symbol being a current symbol content, and mapping the current symbol content as the digital sequence according to a preset mapping relation, thus completing demodulation; wherein the odd/even mapping symbol is obtained through the following steps: selecting 2 n+1 sequence symbols from a preset audio sequence symbol set, and classifying the 2 n+1 sequence symbols into odd mapping symbols and even mapping symbols, wherein the number of the odd mapping symbols is equal to that of the even mapping symbols, and n=1, 2, 3 .",
".",
".",
".",
"Further, the performing channel decoding on the digital sequence using a CRC decoding method and a BCH decoding method to obtain the original data signal specifically includes: decoding the digital sequence using the BCH decoding method; and decoding the BCH decoded signal using the CRC decoding method to obtain the original data signal.",
"The present invention further provides another acoustic channel-based data communications method, including: performing channel coding on an original data signal using a CRC coding method and a BCH coding method to obtain a coded sequence; modulating the coded sequence using a preset audio sequence symbol set by a symbol mapping method to obtain a digital audio signal; selecting a channel frequency band according to characteristics of a transmitting equipment and interference between frequency bands; converting the digital audio signal into an analog audio signal through a digital-to-analog converter, and transmitting the signal to a channel for transmission according to the selected channel frequency band; receiving the analog audio signal transmitted in the channel and converting the signal into a digital audio signal through the analog-to-digital converter; eliminating strong interference channel frequency band data from the digital audio signal by calculating the cross-correlation between the digital audio signal having a frequency within the range of each channel frequency band and an original sample signal; capturing a synchronization symbol by calculating the cross-correlation between a synchronization symbol sample and the digital audio signal with strong interference channel frequency band data eliminated, and performing symbol inverse mapping, thus completing signal demodulation and obtaining a digital sequence; and performing channel decoding on the digital sequence using a CRC decoding method and a BCH decoding method to obtain the original data signal.",
"Further, the performing channel coding on the original data signal using a CRC coding method and a BCH coding method to obtain the coded sequence specifically includes: coding the original data signal using the CRC coding method to obtain a CRC coded sequence; and coding the CRC coded sequence using the BCH coding method to obtain the coded sequence; and the performing channel decoding on the digital sequence using a BCH decoding method and a CRC decoding method to obtain the original data signal specifically includes: decoding the digital sequence using the BCH decoding method; and decoding the BCH decoded signal using the CRC decoding method to obtain the data audio signal.",
"Further, the modulating the coded sequence using the preset audio sequence symbol set via a symbol mapping method to obtain the digital audio signal specifically includes: selecting a sequence symbol as a synchronization symbol for a data frame of the digital audio signal; selecting 2 n+1 sequence symbols from the preset audio sequence symbol set and classifying the 2 n+1 sequence symbols into odd mapping symbols and even mapping symbols, wherein the number of the odd mapping symbols is equal to that of the even mapping symbols, and n=1, 2, 3; dividing the coded sequence into a plurality of coded sequence groups, each coded sequence group comprising n bit data; and mapping the odd coded sequence group into a sequence symbol in the odd mapping symbol according to a preset mapping relation, and mapping the even coded sequence group into a sequence symbol in the even mapping symbol according to preset mapping relation, thus mapping the coded sequence into a plurality of digital audio symbols; wherein the synchronization symbol and the plurality of digital audio symbols form a data frame of the digital audio signal.",
"Further, the method, after mapping the coded sequence into a plurality of digital audio symbols, further includes: copying partial data sequences of the digital audio symbols to a front end and a back end of the digital audio signal, to form a front transition area and a back transition area, and completing symbol extension of the digital audio symbol; wherein a gradient window function of the front transition area is f(x)=½(cos x+1), x ∈ (π,2π), a gradient window function of the back transition area is f(x)=½(cos x+1), x ∈ (0,π), and the back transition area of a previous data frame and the front transition area of a later data frame of the digital audio signal are overlapped.",
"Further, the method, after completing symbol extension of the digital audio symbol, further includes: for the digital audio symbol after the symbol extension, copying partial data sequences at the tail and inserting the partial data sequences between the front transition area and a head of current digital audio symbol as guard interval, and performing further symbol extension on the digital audio data frame.",
"Further, the eliminating strong interference channel frequency band data from the digital audio signal by calculating the cross-correlation between the digital audio signal having a frequency within the range of each channel frequency band and the original sample signal specifically includes: dividing the channel into a plurality of channel frequency bands, respectively calculating the cross-correlation between the digital audio signal having a frequency within the range of each channel frequency band and the original sample signal, determining the channel frequency band with unobvious correlation peak as a strong interference channel frequency band, and eliminating the strong interference channel frequency band data from the digital audio signal, wherein a cross-correlation function is r xy =IFFT{FFT{x(k)}*FFT{y(k)}′}; in the formula, x(k) is the digital audio signal, y(k) is the original sample signal, ′ indicates conjugation, FFT indicates fast Fourier transform, and IFFT indicates inverse fast Fourier transform.",
"Further, the capturing a synchronization symbol by calculating the cross-correlation between the synchronization symbol sample and the digital audio signal with strong interference channel frequency band data eliminated, and performing symbol inverse mapping, thus completing signal demodulation and obtaining the digital sequence specifically includes: for the digital audio signal with strong interference channel frequency band data eliminated, continuously calculating the cross-correlation between data in a detection window and the synchronization symbol sample; when obvious correlation peaks are not identified, sliding backward for a certain distance and capturing the synchronization symbol again; when obvious correlation peaks are identified, determining that frame synchronization is successful, and calculating the offset distance between the detection window and the original point according to the position of the correlation peak, adjusting the position of the detection window according to the offset distance between the detection window and the original point, and capturing the synchronization symbol; and performing correlation calculation on a sample sequence of odd/even mapping symbols and the digital symbol behind the synchronization symbol in the digital audio signal in sequence according to an odd-even order, the most similar odd/even mapping symbol being the current symbol content, and mapping the current symbol content as the digital sequence according to a preset mapping relation, thus completing demodulation.",
"Implementing the present invention has the following advantageous effects that: the present invention can implement communications in weak signal environment submerged in background noise."
],
[
"This application is a divisional application of U.S. application Ser.",
"No.",
"14/859,342 filed 20 Sep. 2015 that claims priority to Chinese Patent Application Ser.",
"No.",
"2015101764939 filed 14 Apr.",
"2015.TECHNICAL FIELD The present invention relates to the field of communications technology, and more particularly, to an acoustic channel-based data communications method.",
"BACKGROUND A system model of a signal communications system is as shown in FIG.",
"1.At a transmitting end, signal modulation is performed on primary data subjected to channel coding, so as to modulate the primary data into an audio signal of a data frame composed of a plurality of symbols and conduct digital-to-analogue conversion on the signal, and finally the signal is transmitted through a loud speaker.",
"At a receiving end, a microphone after receiving the audio signal, reduces the audio signal to the primary data through analogue-to-digital conversion, signal demodulation and channel decoding.",
"Audio communications with a frequency below 24 kHz may make full use of present video and audio playing devices and receiving devices without specially customized loud speaker and microphone.",
"However, in the natural world, an audio with a frequency below 24 kHz usually has very strong interference caused by environment noises.",
"SUMMARY A technical problem to be solved by the present invention is to provide an acoustic channel-based data communications method.",
"The present invention can implement audio signal communications in weak signal environment submerged in background noise.",
"In order to solve the foregoing technical problem, the present invention provides an acoustic channel-based data communications method, including: performing channel coding on an original data signal using a CRC coding method and a BCH coding method to obtain a coded sequence; modulating the coded sequence using a preset audio sequence symbol set via a symbol mapping method to obtain a digital audio signal; selecting a channel frequency band according to characteristics of a transmitting equipment and interference between frequency bands; and converting the digital audio signal into an analog audio signal through a digital-to-analog converter and transmitting the signal to a channel for transmission according to the selected channel frequency band.",
"Further, the performing channel coding on the original data signal using a CRC coding method and a BCH coding method to obtain the coded sequence specifically includes: coding the original data signal using the CRC coding method to obtain a CRC coded sequence; and coding the CRC coded sequence using the BCH coding method to obtain the coded sequence.",
"Further, the modulating the coded sequence using the preset audio sequence symbol set via a symbol mapping method to obtain the digital audio signal specifically includes: selecting a sequence symbol as a synchronization symbol for a data frame of the digital audio signal; selecting 2n+1 sequence symbols from the preset audio sequence symbol set and classifying the 2n+1 sequence symbols into odd mapping symbols and even mapping symbols, wherein the number of the odd mapping symbols is equal to that of the even mapping symbols, and n=1, 2, 3 .",
".",
".",
"; dividing the coded sequence into a plurality of coded sequence groups, each coded sequence group comprising n bit data; and mapping the odd coded sequence group into a sequence symbol in the odd mapping symbol according to a preset mapping relation, and mapping the even coded sequence group into a sequence symbol in the even mapping symbol according to the preset mapping relation, thus mapping the coded sequences into a plurality of digital audio symbols; wherein the synchronization symbol and the plurality of digital audio symbols form a data frame of the digital audio signal.",
"Further, the method, after mapping the coded sequence into a plurality of digital audio symbols, further includes: copying partial data sequences of the digital audio symbols to a front end and a back end of the digital audio signal to form a front transition area and a back transition area, and completing symbol extension of the digital audio symbol; wherein a gradient window function of the front transition area is f(x)=½(cos x+1), x ∈ (π,2π), a gradient window function of the back transition area is f(x)=½(cos x+1), x ∈ (0,π), and the back transition area of a previous data frame and the front transition area of a later data frame of the digital audio signal are overlapped.",
"Further, the method, after completing symbol extension of the digital audio symbol, further includes: for the digital audio symbol after the symbol extension, copying partial data sequences at the tail and inserting the partial data sequences between the front transition area and a head of the current digital audio symbol as guard interval, and performing further symbol extension on the digital audio data frame.",
"The present invention further provides an acoustic channel-based data communications method, including: receiving an analog audio signal transmitted in a channel and converting the analog audio signal into a digital audio signal through an analog-to-digital converter; eliminating strong interference channel frequency band data from the digital audio signal by calculating the cross-correlation between the digital audio signal having a frequency within the range of each channel frequency band and an original sample signal; capturing a synchronization symbol by calculating the cross-correlation between a synchronization symbol sample and the digital audio signal with strong interference channel frequency band data eliminated, and performing symbol inverse mapping, thus completing signal demodulation and obtaining a digital sequence; and performing channel decoding on the digital sequence using a CRC decoding method and a BCH decoding method to obtain the original data signal.",
"Further, the eliminating strong interference channel frequency band data from the digital audio signal by calculating the cross-correlation between the digital audio signal having a frequency within the range of each channel frequency band and the original sample signal specifically includes: dividing the channel into a plurality of channel frequency bands, respectively calculating the cross-correlation between the digital audio signal having a frequency within the range of each channel frequency band and the original sample signal, determining the channel frequency band with unobvious correlation peak as a strong interference channel frequency band, and eliminating the strong interference channel frequency band data from the digital audio signal, wherein a cross-correlation function is rxy=IFFT{FFT{x(k)}*FFT{y(k)}′}; in the formula, x(k) is the digital audio signal, y(k) is the original sample signal, ′ indicates conjugation, FFT indicates fast Fourier transform, and IFFT indicates inverse fast Fourier transform.",
"Further, the capturing a synchronization symbol by calculating the cross-correlation between the synchronization symbol sample and the digital audio signal with strong interference channel frequency band data eliminated, and performing symbol inverse mapping, thus completing signal demodulation and obtaining the digital sequence specifically includes: for the digital audio signal with strong interference channel frequency band data eliminated, continuously calculating the cross-correlation between data in a detection window and the synchronization symbol sample; when obvious correlation peaks are not identified, sliding backward for a certain distance and capturing the synchronization symbol again; when obvious correlation peaks are identified, determining that frame synchronization is successful, and calculating the offset distance between the detection window and an original point according to the position of the correlation peak, adjusting the position of the detection window according to the offset distance between the detection window and the original point, and capturing the synchronization symbol; and performing correlation calculation on a sample sequence of odd/even mapping symbols and the digital symbol after the synchronization symbol in the digital audio signal in sequence according to an odd-even order, the most similar odd/even mapping symbol being a current symbol content, and mapping the current symbol content as the digital sequence according to a preset mapping relation, thus completing demodulation; wherein the odd/even mapping symbol is obtained through the following steps: selecting 2n+1 sequence symbols from a preset audio sequence symbol set, and classifying the 2n+1 sequence symbols into odd mapping symbols and even mapping symbols, wherein the number of the odd mapping symbols is equal to that of the even mapping symbols, and n=1, 2, 3 .",
".",
".",
".",
"Further, the performing channel decoding on the digital sequence using a CRC decoding method and a BCH decoding method to obtain the original data signal specifically includes: decoding the digital sequence using the BCH decoding method; and decoding the BCH decoded signal using the CRC decoding method to obtain the original data signal.",
"The present invention further provides another acoustic channel-based data communications method, including: performing channel coding on an original data signal using a CRC coding method and a BCH coding method to obtain a coded sequence; modulating the coded sequence using a preset audio sequence symbol set by a symbol mapping method to obtain a digital audio signal; selecting a channel frequency band according to characteristics of a transmitting equipment and interference between frequency bands; converting the digital audio signal into an analog audio signal through a digital-to-analog converter, and transmitting the signal to a channel for transmission according to the selected channel frequency band; receiving the analog audio signal transmitted in the channel and converting the signal into a digital audio signal through the analog-to-digital converter; eliminating strong interference channel frequency band data from the digital audio signal by calculating the cross-correlation between the digital audio signal having a frequency within the range of each channel frequency band and an original sample signal; capturing a synchronization symbol by calculating the cross-correlation between a synchronization symbol sample and the digital audio signal with strong interference channel frequency band data eliminated, and performing symbol inverse mapping, thus completing signal demodulation and obtaining a digital sequence; and performing channel decoding on the digital sequence using a CRC decoding method and a BCH decoding method to obtain the original data signal.",
"Further, the performing channel coding on the original data signal using a CRC coding method and a BCH coding method to obtain the coded sequence specifically includes: coding the original data signal using the CRC coding method to obtain a CRC coded sequence; and coding the CRC coded sequence using the BCH coding method to obtain the coded sequence; and the performing channel decoding on the digital sequence using a BCH decoding method and a CRC decoding method to obtain the original data signal specifically includes: decoding the digital sequence using the BCH decoding method; and decoding the BCH decoded signal using the CRC decoding method to obtain the data audio signal.",
"Further, the modulating the coded sequence using the preset audio sequence symbol set via a symbol mapping method to obtain the digital audio signal specifically includes: selecting a sequence symbol as a synchronization symbol for a data frame of the digital audio signal; selecting 2n+1 sequence symbols from the preset audio sequence symbol set and classifying the 2n+1 sequence symbols into odd mapping symbols and even mapping symbols, wherein the number of the odd mapping symbols is equal to that of the even mapping symbols, and n=1, 2, 3; dividing the coded sequence into a plurality of coded sequence groups, each coded sequence group comprising n bit data; and mapping the odd coded sequence group into a sequence symbol in the odd mapping symbol according to a preset mapping relation, and mapping the even coded sequence group into a sequence symbol in the even mapping symbol according to preset mapping relation, thus mapping the coded sequence into a plurality of digital audio symbols; wherein the synchronization symbol and the plurality of digital audio symbols form a data frame of the digital audio signal.",
"Further, the method, after mapping the coded sequence into a plurality of digital audio symbols, further includes: copying partial data sequences of the digital audio symbols to a front end and a back end of the digital audio signal, to form a front transition area and a back transition area, and completing symbol extension of the digital audio symbol; wherein a gradient window function of the front transition area is f(x)=½(cos x+1), x ∈ (π,2π), a gradient window function of the back transition area is f(x)=½(cos x+1), x ∈ (0,π), and the back transition area of a previous data frame and the front transition area of a later data frame of the digital audio signal are overlapped.",
"Further, the method, after completing symbol extension of the digital audio symbol, further includes: for the digital audio symbol after the symbol extension, copying partial data sequences at the tail and inserting the partial data sequences between the front transition area and a head of current digital audio symbol as guard interval, and performing further symbol extension on the digital audio data frame.",
"Further, the eliminating strong interference channel frequency band data from the digital audio signal by calculating the cross-correlation between the digital audio signal having a frequency within the range of each channel frequency band and the original sample signal specifically includes: dividing the channel into a plurality of channel frequency bands, respectively calculating the cross-correlation between the digital audio signal having a frequency within the range of each channel frequency band and the original sample signal, determining the channel frequency band with unobvious correlation peak as a strong interference channel frequency band, and eliminating the strong interference channel frequency band data from the digital audio signal, wherein a cross-correlation function is rxy=IFFT{FFT{x(k)}*FFT{y(k)}′}; in the formula, x(k) is the digital audio signal, y(k) is the original sample signal, ′ indicates conjugation, FFT indicates fast Fourier transform, and IFFT indicates inverse fast Fourier transform.",
"Further, the capturing a synchronization symbol by calculating the cross-correlation between the synchronization symbol sample and the digital audio signal with strong interference channel frequency band data eliminated, and performing symbol inverse mapping, thus completing signal demodulation and obtaining the digital sequence specifically includes: for the digital audio signal with strong interference channel frequency band data eliminated, continuously calculating the cross-correlation between data in a detection window and the synchronization symbol sample; when obvious correlation peaks are not identified, sliding backward for a certain distance and capturing the synchronization symbol again; when obvious correlation peaks are identified, determining that frame synchronization is successful, and calculating the offset distance between the detection window and the original point according to the position of the correlation peak, adjusting the position of the detection window according to the offset distance between the detection window and the original point, and capturing the synchronization symbol; and performing correlation calculation on a sample sequence of odd/even mapping symbols and the digital symbol behind the synchronization symbol in the digital audio signal in sequence according to an odd-even order, the most similar odd/even mapping symbol being the current symbol content, and mapping the current symbol content as the digital sequence according to a preset mapping relation, thus completing demodulation.",
"Implementing the present invention has the following advantageous effects that: the present invention can implement communications in weak signal environment submerged in background noise.",
"BRIEF DESCRIPTION OF THE DRAWINGS In order to explain the technical solutions in the embodiments of the invention or in the related art more clearly, the drawings used in the descriptions of the embodiments or the related art will be simply introduced hereinafter.",
"It is apparent that the drawings described hereinafter are merely some embodiments of the invention, and those skilled in the art may also obtain other drawings according to these drawings without going through creative work.",
"FIG.",
"1 is a block diagram of a signal communications system in the related art; FIG.",
"2 is a flow block diagram of an embodiment of an acoustic channel-based data communications method provided by the present invention; FIG.",
"3 is a block diagram of CRC coding and BCH coding; FIG.",
"4 is a block diagram of a signal mapping process; FIG.",
"5 is a block diagram of symbol extension; FIG.",
"6 is a block diagram illustrating the symbol extension; FIG.",
"7A is a flow block diagram of another embodiment of the acoustic channel-based data communications method provided by the present invention; FIG.",
"7B is a continued flow block diagram of FIG.",
"7A; FIG.",
"8 is a diagram of a correlation function when a received signal is similar to an original signal sample; FIG.",
"9 is a diagram of a correlation function when the received signal is irrelevant to the original signal sample; and FIG.",
"10A is a flow block diagram of one another embodiment of the acoustic channel-based data communications method provided by the present invention; FIG.",
"10B is a continued flow block diagram of FIG.",
"10A.",
"DETAILED DESCRIPTION Further illustrative explanations will be made clearly and completely to the technical solutions in the embodiments of the invention hereinafter with reference to the accompanying drawings in the embodiments of the invention.",
"Apparently, the embodiments described are merely partial embodiments of the present invention, rather than all embodiments.",
"Other embodiments derive by those having ordinary skills in the art on the basis of the embodiments of the invention without going through creative efforts shall all fall within the protection scope of the present invention.",
"FIG.",
"2 is a flow block diagram of an embodiment of an acoustic channel-based data communications method provided by the present invention.",
"The embodiment is described on the basis of data.",
"As shown in FIG.",
"2, the embodiment includes the following steps.",
"In step S101, channel coding is performed on an original data signal using a CRC coding method and a BCH coding method to obtain a coded sequence.",
"When transmitting a digital signal, error code is produced during transmitting a data stream due to various reasons.",
"By performing corresponding processing on the digital code stream via the link of channel coding, a system has a certain error correcting capability and anti-jamming capability, which can greatly avoid error code during transmitting a digital code stream; moreover, the data correctness and integrity can be verified.",
"To be specific, the step S101 includes the following steps.",
"In step S1011, the original data signal is coded using the CRC coding method to obtain a CRC coded sequence.",
"Wherein, the original data signal is any binary data.",
"CRC, i.e., cyclic redundancy check code (Cyclic Redundancy Check) is an error correction code that is most commonly used in the field of data communications, which is characterized in that the lengths of an information field and a check field can be selected at random.",
"The cyclic redundancy check (CRC) is a data transmission error detection function, which performs polynomial calculation on data, and attaches a result obtained behind a frame, through which a receiving equipment may verify whether the data received is wrong.",
"Referring to FIG.",
"3, given that each frame transmits 32 bit primary data, the primary data is extended into 44 bit (32 bit primary data+12 bitCRC) according to CRC12 coding, i.e., the CRC coded sequence is 44 bit.",
"In step S1012, the CRC coded sequence is coded using the BCH coding method to obtain the coded sequence.",
"BCH coding is derived from the abbreviation of Bose, ray-Chaudhuri and Hocquenghem, which is a coding method for multistage, cycle, error correction and variable-length digital coding, and is a cyclic linear block code.",
"Error occurred during transmission is corrected through the BCH coding.",
"The BCH coding divides a primary data sequence into message groups with each group including stationary k bits, and then independently transforms each message group into a binary digit group having a length of n(n>k), which is called as codeword, wherein a check fit r=n−k, and is recorded as bch(n,k).",
"If the number of the message groups is M (apparently, M>=2), the totality of M codewards obtained in this way are called as a block code having a code length of n and an information number of M. The process of transforming the message groups into the codewords is called as coding, and an inverse process thereof is called as decoding.",
"Referring to FIG.",
"3, the CRC coded sequence is divided into four groups, each group including 11 bit.",
"After BCH(15,11) coding, 60 bit data is obtained.",
"That is, the coded sequence is 60 bit.",
"In step S102, the coded sequence is modulated using a preset audio sequence symbol set via a symbol mapping method to obtain a digital audio signal.",
"To be specific, the step S102 specifically includes the following steps.",
"In step S1021, a sequence symbol is selected from a preset audio sequence symbol set as a synchronization symbol for a data frame of the digital audio signal.",
"The obtaining the preset audio sequence symbol set employs the following steps: performing audio sampling on the preset symbols to obtain a time sequence, and selecting a plurality of groups from the time sequence as audio sequence symbols using a symbol selection criteria.",
"To be specific, the symbol selection criteria is as follows: power on each frequency complies with equal-loudness contours of a human ear, so as to ensure that the human ear senses the same loudness at each frequency; it is relatively flat on time domains without dramatic fluctuations; and the cross-correlation between each audio sequence symbol is extremely weak.",
"In step S1022, 2n+1 sequence symbols are selected from the preset audio sequence symbol set, and the 2n+1 sequence symbols are classified into odd mapping symbols and even mapping symbols, wherein the number of the odd mapping symbols is equal to that of the even mapping symbols, and n=1, 2, 3 .",
".",
".",
"When n=1, four sequence symbols are selected from the preset audio sequence symbol set, and two of the four sequence symbols are divided into odd mapping symbols and the other two are divided into even mapping symbols.",
"When n=2, eight sequence symbols are selected from the preset audio sequence symbol set, and four of the eight sequence symbols are classified as odd mapping symbols and the other four are classified as even mapping symbols; for example, given that n=2, and the eight sequence symbols are respectively represented by A, B, C, D, E, F, G and H, A, B, C and D are classified as odd mapping symbols, while E, F, G and H are classified as even mapping symbols.",
"In step S1023, the coded sequence is divided into a plurality of coded sequence groups, each coded sequence group including n bit data.",
"Given that the coded sequence is 00010110 .",
".",
".",
", then the coding sequences may be divided into a plurality of sequence groups like 00, 01, 01, 10 .",
".",
".",
", each sequence group including 2 bit data.",
"In step S1024, the odd coded sequence group is mapped into a sequence symbol in the odd mapping symbol according to a preset mapping relation, and the even coded sequence group is mapped into a sequence symbol in the even mapping symbol according to the preset mapping relation, thus mapping the coded sequences into a plurality of digital audio symbols.",
"Given that the mapping relation is: odd mapping symbols A/B/C/D represent data 00/01/10/11, and even mapping symbols E/F/G/H represent data 00/01/10/11, then the coded sequence group ranking 1 is 00, wherein 1 is an odd number, and an odd mapping symbol corresponding to the 00 coded sequence group is A; therefore, the 00 coded sequence group is mapped into the symbol A; the coded sequence group ranking 2 is 01, wherein 2 is an even number, and an even mapping symbols corresponding to the 01 coded sequence group is F; therefore, the 00 coded sequence group is mapped into the symbol F. Referring to FIG.",
"4 and by this analogy, the coded sequence groups are completely mapped, thus obtaining a data frame of the digital audio signal, wherein S represents a synchronization symbol.",
"Wherein, the synchronization symbol and the plurality of digital audio symbols form a data frame of the digital audio signal.",
"Optionally, the step S102, after the step S1024, may further include step S1025 and step S1026.In step S1025, partial data sequences of the digital audio symbols are copied to a front end and a back end of the digital audio signal to form a front transition area and a back transition area, and symbol extension of the digital audio symbol is completed; wherein a gradient window function of the front transition area is f(x)=½(cos x+1), x ∈ (π,2π), a gradient window function of the back transition area is f(x)=½(cos x+1), x ∈ (0,π), and the back transition area of a previous data frame and the front transition area of a later data frame of the digital audio signal are overlapped.",
"Wherein, in order to ensure that energy when switching two symbols is not leak to other frequencies (reducing noise), partial original signal extension needs to be copied as a transition area.",
"In order to improve the synchronization capturing success rate and reduce signal distortion caused by multipath interference, partial signal at the tail of the original signal may be copied between the front transition area and the original signal as guard interval.",
"Refer to FIG.",
"5 for details.",
"In step S1026, for the digital audio symbol after the symbol extension, partial data sequences at the tail are copied and inserted between the front transition area and a head of the current digital audio symbol as guard interval, and further symbol extension is performed on the digital audio data frame.",
"Given that 2048 sampling points are served as a sample sequence length of one symbol, and the length from the guard interval and the transition area is ⅛ of the sample sequence length; 256 samples on the head of the digital audio signal of the sequence having 2048 points are copied to the tail and added with a cosine window as the back transition area, the 512 samples in the tail are copied to the head and a cosine window is added in the front 256 samples of the head as the front transition area, and the last 256 samples are served as the guard interval; and the back transition area of a previous symbol and the front transition area of a later symbol are overlapped.",
"Refer to FIG.",
"6 for details.",
"In S103, a channel frequency band is selected according to characteristics of a transmitting equipment and interference between frequency bands.",
"Before the AD conversion of the transmitting end, channel frequency band may be selected for a transmitted signal in view of the characteristics and using requirements of the transmitting equipment; that is, quietness is performed on channels at some frequencies, and signals are transmitted only in the channel with a specific frequency.",
"Selecting the channel frequency band mainly focuses on: {circle around (1)} the transmit power of the transmitting equipment is limited; the more the channel frequency bands are divided, the smaller the power averaged to each channel will be, and the power needs to be concentrated to a channel with small interference; {circle around (2)} a band width for transmitting the modulated data audio signal is limited, the fewer the frequency bands are, the smaller the band width will be required.",
"Therefore, the transmitting end gives priority to the frequency band (above 16 khz) that cannot be perceived by a human ear, and then considers the frequency bands with less interference.",
"In step S104, the digital audio signal is converted into an analog audio signal through a digital-to-analog converter and transmitted to a channel for transmission according to the selected channel frequency band.",
"FIG.",
"7 is a flow block diagram of another embodiment of the acoustic channel-based data communications method provided by the present invention.",
"The embodiment is described with respect to one signal receiving end, which is as shown in FIG.",
"7, including: In step S201, the analog audio signal transmitted in the channel is received and converted into a digital audio signal through the analog-to-digital converter.",
"In step S202, strong interference channel frequency band data is eliminated from the digital audio signal by calculating the cross-correlation between the digital audio signal having a frequency within the range of each channel frequency band and an original sample signal.",
"To be specific, the step S202 includes the following steps.",
"The channel is divided into a plurality of channel frequency bands, the cross-correlation between the digital audio signal having a frequency within the range of each channel frequency band and the original sample signal is calculated respectively, the channel frequency band with unobvious correlation peak is determined as a strong interference channel frequency band, and the strong interference channel frequency band data is eliminated from the digital audio signal.",
"Wherein, a calculation formula of a cross-correlation function is rxy=IFFT{FFT{x(k)}*FFT{y(k)}′}; in the formula, x(k) is the digital audio signal, y(k) is the original sample signal, ′ indicates conjugation, FFT indicates fast Fourier transform, and IFFT indicates inverse fast Fourier transform.",
"Wherein, signals on some frequencies are difficult to recognize due to transmission process loss, phonation device attenuation and environment noise interference; therefore, it needs to select the channel during the actual demodulating process.",
"A specific principle is as follows: 0-24 kHz are divided into a plurality of channels; when calculating the correlation, correlation calculation is respectively performed on the frequencies within the range of each channel frequency band (set the FFT results of other channels as zero), the correlation peaks of the interfered channel frequency bands are not obvious relative to other channels, and interference channel frequency band data can be eliminated.",
"In step S203, a synchronization symbol is captured by calculating the cross-correlation between a synchronization symbol sample and the digital audio signal with strong interference channel frequency band data eliminated, and symbol inverse mapping is performed, thus completing signal demodulation and obtaining a digital sequence.",
"In step S2031, for the digital audio signal with strong interference channel frequency band data eliminated, the cross-correlation between data in a detection window and the synchronization symbol sample is continuously calculated; when obvious correlation peaks are not identified, sliding back for a certain distance is performed and the synchronization symbol is captured again; when obvious correlation peaks are identified, that frame synchronization is determined to be successful, and the offset distance between the detection window and an original point is calculated according to the position of the correlation peak, the position of the detection window is adjusted according to the offset distance between the detection window and the original point, and the synchronization symbol is captured.",
"Wherein, when the received signal is similar to the sample, the image of the correlation function is as shown in FIG.",
"8, wherein the position of the correlation peak is the offset distance between the detection window and the original point.",
"When the received signal is irrelevant to the sample, the image of the correlation function is as shown in FIG.",
"9; therefore, the currently received signal can be determined whether to include the contents of the current symbol sample by just recognizing the correlation peak of the correlation function.",
"When no obvious correlation peaks are recognized through the image of the correlation function, then the current window does not include or include few sample sequences of the synchronization symbol, or the current signal interference is too strong, and it needs to slide back for a certain distance and then perform synchronization capturing again; when obvious correlation peaks are recognized through the image of the correlation function, i.e., the current detection window includes the sample sequences of the synchronization symbol, and the frame synchronization is successful, then the offset distance between the detection window and the original point can be calculated according to the position of the correlation peak, and the position of the detection window is adjusted according to this offset so as to conduct symbol synchronization.",
"In step S2032, correlation calculation is performed on a sample sequence of odd/even mapping symbols and the digital symbol after the synchronization symbol in the digital audio signal in sequence according to an odd-even order, the most similar odd/even mapping symbol being a current symbol content, and mapping the current symbol content as the digital sequence according to a preset mapping relation, thus completing demodulation.",
"Wherein, the odd/even mapping symbol is obtained through the following steps: selecting 2n+1 sequence symbols from the preset audio sequence symbol set and classifying the 2n+1 sequence symbols into odd mapping symbols and even mapping symbols, wherein the number of the odd mapping symbols is equal to that of the even mapping symbols, and n=1, 2, 3 .",
".",
".",
"In step S204, channel decoding is performed on the digital sequence using a CRC decoding method and a BCH decoding method to obtain the original data signal.",
"To be specific, the step S204 specifically includes the following steps.",
"In step S2041, the digital sequence is decoded using the BCH decoding method; and in step S2042, the BCH decoded signal is decoded using the CRC decoding method to obtain the original data signal.",
"FIG.",
"10 is a flow block diagram of one another embodiment of the acoustic channel-based data communications method provided by the present invention, including the following steps.",
"In step S301, channel coding is performed on an original data signal using a CRC coding method and a BCH coding method to obtain a coded sequence.",
"When transmitting a digital signal, error code is produced during transmitting a data stream due to various reasons.",
"By performing corresponding processing on the digital code stream via the link of channel coding, a system has a certain error correcting capability and anti-jamming capability, which can greatly avoid error code during transmitting a digital code stream; moreover, the data correctness and integrity can be verified.",
"To be specific, the step S301 includes the following steps.",
"In step S3011, the original data signal is coded using the CRC coding method to obtain a CRC coded sequence.",
"Wherein, the original data signal is any binary data.",
"CRC, i.e., cyclic redundancy check code (Cyclic Redundancy Check) is an error correction code that is most commonly used in the field of data communications, which is characterized in that the lengths of an information field and a check field can be selected at random.",
"The cyclic redundancy check (CRC) is a data transmission error detection function, which performs polynomial calculation on data, and attaches a result obtained behind a frame, through which a receiving equipment may verify whether the data received is correct.",
"Referring to FIG.",
"3, given that each frame transmits 32 bit primary data, the primary data is extended into 44 bit (32 bit primary data+12 bitCRC) according to CRC12 coding, i.e., the CRC coded sequence is 44 bit.",
"In step S3012, the CRC coded sequence is coded using the BCH coding method to obtain the coded sequence.",
"BCH coding is derived from the abbreviation of Bose, ray-Chaudhuri and Hocquenghem, which is a coding method for multistage, cycle, error correction and variable-length digital coding, and is a cyclic linear block code.",
"Error occurred during transmission is corrected through the BCH coding.",
"The BCH coding divides a primary data sequence into message groups with each group including stationary k bits, and then independently transforms each message group into a binary digit group having a length of n(n>k), which is called as codeword, wherein a check fit r=n−k, and is recorded as bch(n,k).",
"If the number of the message groups is M (apparently, M>=2), the totality of M codewords obtained in this way are called as a block code having a code length of n and an information number of M. The process of transforming the message groups into the codewords is called as coding, and an inverse process thereof is called as decoding.",
"Referring to FIG.",
"3, the CRC coded sequence is divided into four groups, each group including 11 bit.",
"After BCH(15,11) coding, 60 bit data is obtained.",
"That is, the coded sequence is 60 bit.",
"In step S302, the coded sequence is modulated using a preset audio sequence symbol set via a symbol mapping method to obtain a digital audio signal.",
"To be specific, the step S302 specifically includes the following steps.",
"In step S3021, a sequence symbol is selected from a preset audio sequence symbol set as a synchronization symbol for a data frame of the digital audio signal.",
"The obtaining the preset audio sequence symbol set employs the following steps: performing audio sampling on the preset symbols to obtain a time sequence, and selecting a plurality of groups from the time sequence as audio sequence symbols using a symbol selection criteria.",
"To be specific, the symbol selection criteria is as follows: power on each frequency complies with equal-loudness contours of a human ear, so as to ensure that the human ear senses the same loudness at each frequency.",
"it is relatively flat on time domains without dramatic fluctuations; and the cross-correlation between each audio sequence symbol is extremely weak.",
"In step S3022, 2n+1 sequence symbols are selected from the preset audio sequence symbol set and the 2n+1 sequence symbols are classified into odd mapping symbols and even mapping symbols, wherein the number of the odd mapping symbols is equal to that of the even mapping symbols, and n=1, 2, 3 .",
".",
".",
"When n=1, four sequence symbols are selected from the preset audio sequence symbol set, and two of the four sequence symbols are divided into odd mapping symbols and the other two are divided into even mapping symbols.",
"When n=2, eight sequence symbols are selected from the preset audio sequence symbol set, and four of the eight sequence symbols are classified as odd mapping symbols and the other four are classified as even mapping symbols; for example, given that n=2, and the eight sequence symbols are respectively represented by A, B, C, D, E, F, G and H, A, B, C and D are classified as odd mapping symbols, while E, F, G and H are classified as even mapping symbols.",
"In step S3023, the coded sequence is divided into a plurality of coded sequence groups, each coded sequence group including n bit data.",
"Given that the coded sequence is 00010110 .",
".",
".",
", then the coding sequences may be divided into a plurality of sequence groups like 00, 01, 01, 10 .",
".",
".",
", each sequence group including 2 bit data.",
"In step S3024, the odd coded sequence group is mapped into a sequence symbol in the odd mapping symbol according to a preset mapping relation, and the even coded sequence group is mapped into a sequence symbol in the even mapping symbol according to the preset mapping relation, thus mapping the coded sequences into a plurality of digital audio symbols.",
"Given that the mapping relation is: odd mapping symbols A/B/C/D represent data 00/01/10/11, and even mapping symbols E/F/G/H represent data 00/01/10/11, then the coded sequence group ranking 1 is 00, wherein 1 is an odd number, and an odd mapping symbol corresponding to the 00 coded sequence group is A; therefore, the 00 coded sequence group is mapped into the symbol A; the coded sequence group ranking 2 is 01, wherein 2 is an even number, and an even mapping symbols corresponding to the 01 coded sequence group is F; therefore, the 00 coded sequence group is mapped into the symbol F. Referring to FIG.",
"4 and by this analogy, the coded sequence groups are completely mapped, thus obtaining a data frame of the digital audio signal, wherein S represents a synchronization symbol.",
"Wherein, the synchronization symbol and the plurality of digital audio symbols form a data frame of the digital audio signal.",
"Optionally, the step S302, after the step S3024, may further include step S3025 and step S3026.In step S3025, partial data sequences of the digital audio symbols are copied to a front end and a back end of the digital audio signal to form a front transition area and a back transition area, and symbol extension of the digital audio symbol is completed; wherein a gradient window function of the front transition area is f(x)=½(cos x+1), x ∈ (π,2π), a gradient window function of the back transition area is f(x)=½(cos x+1), x ∈ (0,π), and the back transition area of a previous data frame and the front transition area of a later data frame of the digital audio signal are overlapped.",
"Wherein, in order to ensure that energy when switching two symbols is not leak to other frequencies (reducing noise), partial original signal extension needs to be copied as a transition area.",
"In order to improve the synchronization capturing success rate and reduce signal distortion caused by multipath interference, partial signal at the tail of the original signal may be copied between the front transition area and the original signal as guard interval.",
"Refer to FIG.",
"5 for details.",
"In step S3026, for the digital audio symbol after the symbol extension, partial data sequences at the tail are copied and inserted between the front transition area and a head of the current digital audio symbol as guard interval, and further symbol extension is performed on the digital audio data frame.",
"Given that 2048 sampling points are served as a sample sequence length of one symbol, and the length from the guard interval and the transition area is ⅛ of the sample sequence length; 256 samples on the head of the digital audio signal of the sequence having 2048 points are copied to the tail and added with a cosine window as the back transition area, the 512 samples in the tail are copied to the head and a cosine window is added in the front 256 samples of the head as the front transition area, and the last 256 samples are served as the guard interval; and the back transition area of a previous symbol and the front transition area of a later symbol are overlapped.",
"Refer to FIG.",
"6 for details.",
"In S303, a channel frequency band is selected according to characteristics of a transmitting equipment and interference between frequency bands.",
"Before the AD conversion of the transmitting end, channel frequency band may be selected for a transmitted signal in view of the characteristics and using requirements of the transmitting equipment; that is, quietness is performed on channels at some frequencies, and signals are transmitted only in the channel with a specific frequency.",
"Selecting the channel frequency band mainly focuses on: {circle around (1)} the transmit power of the transmitting equipment is limited; the more the channel frequency bands are divided, the smaller the power averaged to each channel will be, and the power needs to be concentrated to a channel with small interference; {circle around (2)} a band width for transmitting the modulated data audio signal is limited, the fewer the frequency bands are, the smaller the band width will be required.",
"Therefore, the transmitting end gives priority to the frequency band (above 16 khz) that cannot be perceived by a human ear, and then considers the frequency bands with less interference.",
"In step S304, the digital audio signal is converted into an analog audio signal through a digital-to-analog converter and transmitted to a channel for transmission according to the selected channel frequency band.",
"In step S305, the analog audio signal transmitted in the channel is received and converted into a digital audio signal through the analog-to-digital converter.",
"In step S306, strong interference channel frequency band data is eliminated from the digital audio signal by calculating the cross-correlation between the digital audio signal having a frequency within the range of each channel frequency band and an original sample signal.",
"To be specific, the step S306 includes the following steps.",
"The channel is divided into a plurality of channel frequency bands, the cross-correlation between the digital audio signal having a frequency within the range of each channel frequency band and the original sample signal is calculated respectively, the channel frequency band with unobvious correlation peak is determined as a strong interference channel frequency band, and the strong interference channel frequency band data is eliminated from the digital audio signal.",
"Wherein, a calculation formula of a cross-correlation function is rxy=IFFT{FFT{x(k)}*FFT{y(k)}′}; in the formula, x(k) is the digital audio signal, y(k) is the original sample signal, ′ indicates conjugation, FFT indicates fast Fourier transform, and IFFT indicates inverse fast Fourier transform.",
"Wherein, signals on some frequencies are difficult to recognize due to transmission process loss, phonation device attenuation and environment noise interference; therefore, it needs to select the channel during the actual demodulating process.",
"A specific principle is as follows: 0-24 kHz are divided into a plurality of channels; when calculating the correlation, correlation calculation is respectively performed on the frequencies within the range of each channel frequency band (set the FFT results of other channels as zero), the correlation peaks of the interfered channel frequency bands are not obvious relative to other channels, and interference channel frequency band data can be eliminated.",
"In step S307, a synchronization symbol is captured by calculating the cross-correlation between a synchronization symbol sample and the digital audio signal with strong interference channel frequency band data eliminated, and symbol inverse mapping is performed, thus completing signal demodulation and obtaining a digital sequence.",
"In step S3071, for the digital audio signal with strong interference channel frequency band data eliminated, the cross-correlation between data in a detection window and the synchronization symbol sample is continuously calculated; when obvious correlation peaks are not identified, sliding back for a certain distance is performed and the synchronization symbol is captured again; when obvious correlation peaks are identified, that frame synchronization is determined to be successful, and the offset distance between the detection window and an original point is calculated according to the position of the correlation peak, the position of the detection window is adjusted according to the offset distance between the detection window and the original point, and the synchronization symbol is captured.",
"Wherein, when the received signal is similar to the sample, the image of the correlation function is as shown in FIG.",
"8, wherein the position of the correlation peak is the offset distance between the detection window and the original point.",
"When the received signal is irrelevant to the sample, the image of the correlation function is as shown in FIG.",
"9; therefore, the currently received signal can be determined whether to include the contents of the current symbol sample by recognizing the correlation peak of the correlation function.",
"When no obvious correlation peaks are recognized through the image of the correlation function, then the current window does not include or include few sample sequences of the synchronization symbol, or the current signal interference is too strong, and it needs to slide back for a certain distance and then perform synchronization capturing again; when obvious correlation peaks are recognized through the image of the correlation function, i.e., the current detection window includes the sample sequences of the synchronization symbol, and the frame synchronization is successful, then the offset distance between the detection window and the original point can be calculated according to the position of the correlation peak, and the position of the detection window is adjusted according to this offset so as to conduct symbol synchronization.",
"In step S3072, correlation calculation is performed on a sample sequence of odd/even mapping symbols and the digital symbol after the synchronization symbol in the digital audio signal in sequence according to an odd-even order, the most similar odd/even mapping symbol being a current symbol content, and mapping the current symbol content as the digital sequence according to a preset mapping relation, thus completing demodulation.",
"Wherein, the odd/even mapping symbol is obtained through the following steps: selecting 2n+1 sequence symbols from the preset audio sequence symbol set and classifying the 2n+1 sequence symbols into odd mapping symbols and even mapping symbols, wherein the number of the odd mapping symbols is equal to that of the even mapping symbols, and n=1, 2, 3 .",
".",
".",
"In step 308, channel decoding is performed on the digital sequence using a CRC decoding method and a BCH decoding method to obtain the original data signal.",
"To be specific, the step S308 specifically includes the following steps.",
"In step S3081, the digital sequence is decoded using the BCH decoding method; and In step S3082, the BCH decoded signal is decoded using the CRC decoding method to obtain the original data signal.",
"Implementing the present invention has the following advantageous effects that: the present invention implements frame synchronization through the position of the correlation peaks during communications; and implement data frame synchronization through a method of inserting the synchronization symbol.",
"Through a method of calculating the signal correlation and selectively eliminating strong interference channel frequency band, the present invention can implement communications in weak signal environment submerged in background noise.",
"It should be noted that, in the description herein, the terms “include”, “comprise” and any variation thereof refer to “including but not limited to”.",
"Therefore, in the context of a process, method, object or device that includes a series of elements, the process, method, object or device not only includes such elements, but also includes other elements not specified expressly, or may include inherent elements of the process, method, object or device.",
"Unless otherwise specified, in the context of “include a .",
".",
".",
"”, the process, method, object or device that includes or comprises the specified elements may include other identical elements.",
"The number of the above embodiment is merely provided for description, but does not represent the strengths of the embodiments.",
"In the embodiments provided by the present application, it shall be appreciated that the disclosed system, device and method may be implemented in other ways.",
"For example, the above device embodiments are just exemplary.",
"For example, the unit division is just a logical function division, and other division mode may be used in the implementation, e.g., multiple units or components may be combined or integrated into another system, or some features may be omitted or not executed.",
"Another point is that the displayed or discussed mutual coupling, direct coupling or communication connection may be implemented through indirect coupling or communication connection between some interfaces, devices or units in electrical, mechanical or other forms.",
"Persons skilled in the art may further realize that, in combination with the embodiments disclosed here, described units and algorithm steps of each example can be implemented with electronic hardware, computer software, or a combination thereof.",
"In order to clearly describe the interchangeability between the hardware and the software, compositions and steps of each example have been generally described according to functions in the foregoing descriptions.",
"Whether these functions are executed as hardware or software depends on particular applications and design constraint conditions of the technical solutions.",
"Persons skilled in the art may use different methods to implement the described functions for each particular application, but the implementation should not be considered as going beyond the scope of the present invention.",
"In combination with the embodiments disclosed here, described steps of the method or algorithm may be directly implemented by using hardware, a software module executed by a processor, or a combination of the two.",
"The software module may be placed in a random access memory (RAM), a memory, a read-only memory (ROM), an electrically programmable ROM, an electrically erasable programmable ROM, a register, a hard disk, a removable magnetic disk, a CD-ROM, or any storage medium of other forms well-known in the technical field.",
"The above descriptions on the disclosed embodiments enable those skilled in the art can realize or use the present invention.",
"Various modifications on these embodiments are apparent for those skilled in the art, and general principles defined herein can be realized in other embodiments without departing from the spirit or scope of the present invention.",
"Accordingly, the present invention will not be limited to these embodiments shown herein, but is to be accorded with the widest scope consistent with the principles and novel features disclosed herein."
]
] |
Patent_15871246
|
[
[
"GEARED LOW FAN PRESSURE RATIO FAN EXIT GUIDE VANE STAGGER ANGLE",
"A fan exit guide vane assembly for a gas turbine engine includes a plurality of guide vanes having a pressure side and a suction side extending between a leading edge and a trailing edge.",
"The vanes further include a span extending between a root and tip with a stagger angle defined as an angle between a longitudinal axis parallel to an engine axis of rotation and a line connecting the leading edge and the trailing edge that is less than about 15°."
],
[
"1.A gas turbine engine comprising: a turbine driven fan rotor including a plurality of fan blades rotatable about an axis; a core engine including a turbine section that drives the fan; a duct circumscribing the fan rotor and defining a passageway aft of the fan rotor about the core engine; and a fan exit guide vane assembly including a plurality of exit guide vanes positioned downstream of the fan rotor within the duct, wherein each of the plurality of exit guide vanes includes a stagger angle that varies along a span between a root, and tip as shown by percent span location values set out in Table 1.2.The gas turbine engine as recited in claim 1, wherein the stagger angle is less than about 15° at a midspan portion relative to a line parallel to the axis.",
"3.The gas turbine engine as recited in claim 1, wherein the stagger angle is less than about 12° at a midspan portion.",
"4.The gas turbine engine as recited in claim 1, wherein the stagger angle is between about 8° and 12° at a midspan portion.",
"5.The gas turbine engine as recited in claim 4, wherein the midspan portion is between about 40% and about 85% of a total span of the vane.",
"6.The gas turbine engine as recited in claim 1, wherein a difference between a maximum stagger angle and a minimum stagger angle for each of the plurality of exit guide vanes is less than about 6°.",
"7.The gas turbine engine as recited in claim 6, wherein the duct defines a bypass with a bypass ratio being defined as the portion of air delivered into the bypass duct divided by the amount of air delivered into the core engine, with the bypass ratio being greater than about 6.0.8.The gas turbine engine as recited in claim 6, wherein the bypass ratio is greater than about 10.0.9.The gas turbine engine as recited in claim 7, wherein a fan pressure ratio across the fan is less than about 1.5.10.The gas turbine engine as recited in claim 9, wherein each of the plurality of guide vanes are support at least a portion of the core engine.",
"11.The gas turbine engine as recited in claim 10, wherein the duct defines a bypass with a bypass ratio being defined as the portion of air delivered into the bypass duct divided by the amount of air delivered into the core engine, with the bypass ratio being greater than about 6.0.12.A gas turbine engine assembly comprising: a turbine driven fan rotor including a plurality of fan blades rotatable about an axis; a core engine including a turbine section that drives the fan; a duct circumscribing the fan rotor and defining a passageway aft of the fan rotor about the core engine; and a fan exit guide vane including a plurality of guide vanes including a pressure side and a suction side extending between a leading edge and a trailing edge and a span extending between a root and tip, wherein a stagger angle defined as an angle between a longitudinal axis parallel to an engine axis of rotation varies along the span from the root to the tip with a difference between a maximum stagger angle and a minimum stagger angle along the span is less than about 6°.",
"13.The gas turbine engine assembly as recited in claim 12, wherein the stagger angle varies along a span between a root and tip as shown by percent average span location values set out in table 1.14.The gas turbine engine assembly as recited in claim 13, wherein a line connecting the leading edge and the trailing edge is less than about 15° at a midspan portion.",
"15.The gas turbine engine assembly as recited in claim 13, wherein the stagger angle is less than about 12° at a midspan portion.",
"16.The gas turbine engine assembly as recited in claim 15, wherein the midspan portion includes that portion of the span between about 40% and about 85% of a total span of the vane.",
"17.The gas turbine engine assembly as recited in claim 6, wherein the duct defines a bypass with a bypass ratio being defined as the portion of air delivered into the bypass duct divided by the amount of air delivered into the core engine, with the bypass ratio being greater than about 6.0.18.The gas turbine engine as recited in claim 17, including a geared architecture driven by the turbine section for driving the fan about the axis.",
"19.The gas turbine engine as recited in claim 18, wherein the turbine section includes a low pressure turbine that drives the geared architecture, the low pressure turbine including no more than six turbine rotors.",
"20.The gas turbine engine as recited in claim 19, wherein a ratio between the number of the plurality of fan blades and the number of turbine rotors is between 3.3 and 8.6."
],
[
"<SOH> BACKGROUND <EOH>A gas turbine engine typically includes a fan section, a compressor section, a combustor section and a turbine section.",
"Air entering the compressor section is compressed and delivered into the combustion section where it is mixed with fuel and ignited to generate a high-speed exhaust gas flow.",
"The high-speed exhaust gas flow expands through the turbine section to drive the compressor and the fan section.",
"The compressor section typically includes low and high pressure compressors, and the turbine section includes low and high pressure turbines.",
"The fan section may also be driven by the low inner shaft.",
"A speed reduction device such as an epicyclical gear assembly may be utilized to drive the fan section such that the fan section may rotate at a speed different than the turbine section so as to increase the overall propulsive efficiency of the engine.",
"In such engine architectures, a shaft driven by one of the turbine sections provides an input to the epicyclical gear assembly that drives the fan section at a reduced speed such that both the turbine section and the fan section can rotate at closer to optimal speeds.",
"The fan section drives air through a bypass duct and induces a swirl within bypass airflow that is diffused by exit guide vanes.",
"The exit guide vanes turn bypass flow through the bypass duct toward an axial direction.",
"Each of the guide vanes includes a stagger angle that provides the desired turning or diffusion of airflow toward the axial direction.",
"Although geared architectures have improved propulsive efficiency, turbine engine manufacturers continue to seek further improvements to engine performance including improvements to thermal, transfer and propulsive efficiencies."
],
[
"<SOH> SUMMARY <EOH>A gas turbine according to an exemplary embodiment of this disclosure, among other possible things includes a turbine driven fan rotor including a plurality of fan blades rotatable about an axis, a core engine including a turbine section that drives the fan, a duct circumscribing the fan rotor and defining a passageway aft of the fan rotor about the core engine, and a fan exit guide vane assembly including a plurality of exit guide vanes positioned downstream of the fan rotor within the duct.",
"Each of the plurality of exit guide vanes includes a stagger angle of less than about 15° at a midspan portion relative to a line parallel to the axis.",
"In a further embodiment of the foregoing gas turbine engine, the stagger angle is less than about 12° at the midspan portion.",
"In a further embodiment of any of the foregoing gas turbine engines, the stagger angle is between about 8° and 12° at the midspan portion.",
"In a further embodiment of any of the foregoing gas turbine engines, the midspan portion is between about 40% and about 85% of a total span of the vane.",
"In a further embodiment of any of the foregoing gas turbine engines, a difference between a maximum stagger angle and a minimum stagger angle for each of the plurality of exit guide vanes is less than about 6°.",
"In a further embodiment of any of the foregoing gas turbine engines, the duct defines a bypass with a bypass ratio being defined as the portion of air delivered into the bypass duct divided by the amount of air delivered into the core engine, with the bypass ratio being greater than about 6.0.In a further embodiment of any of the foregoing gas turbine engines, the bypass ratio is greater than about 10.0.In a further embodiment of any of the foregoing gas turbine engines, a fan pressure ratio across the fan is less than about 1.5.In a further embodiment of any of the foregoing gas turbine engines, each of the plurality of guide vanes are support at least a portion of the core engine.",
"In a further embodiment of any of the foregoing gas turbine engines, includes a geared architecture driven by the turbine section for rotating the fan about the axis.",
"A fan exit guide vane assembly for a gas turbine engine according to an exemplary embodiment of this disclosure, among other possible things includes a plurality of guide vanes including a pressure side and a suction side extending between a leading edge and a trailing edge and a span extending between a root and tip.",
"A stagger angle is defined as an angle between a longitudinal axis parallel to an engine axis of rotation and a line connecting the leading edge and the trailing edge is less than about 15° at a midspan portion.",
"In a further embodiment of the foregoing fan exit guide vane assembly, the stagger angle varies along the span from the root to the tip with a difference between a maximum stagger angle and a minimum stagger angle along the span is less than about 6°.",
"In a further embodiment of any of the foregoing fan exit guide vane assemblies, the stagger angle varies along the span between the root and the tip for a specific percent of the span according to the values set out in Table 1.In a further embodiment of any of the foregoing fan exit guide vane assemblies, the stagger angle is less than about 12° at a midspan portion.",
"In a further embodiment of any of the foregoing fan exit guide vane assemblies, the midspan portion includes that portion of the span between about 40% and about 85% of a total span of the vane.",
"A method of assembling a fan exit guide vane assembly according to an exemplary embodiment of this disclosure, among other possible things includes forming a plurality of guide vanes to include a pressure side and a suction side extending between a leading edge and a trailing edge and a span extending between a root and tip.",
"A stagger angle is defined as an angle between a longitudinal axis parallel to an engine axis of rotation and a line connecting the leading edge and the trailing edge is less than about 15° at a midspan portion, and arranging the plurality of guide vanes for assembly within a bypass duct.",
"In a further embodiment of the foregoing method, includes forming each of the plurality of guide vanes to include a stagger angle between about 8° and 12° at the midspan portion.",
"In a further embodiment of any of the foregoing methods, includes forming each of the plurality of guide vanes to include a varying stagger angle between the root and the tip with a difference between a maximum stagger angle and a minimum stagger angle for each of the plurality of guide vanes is less than about 6°.",
"Although the different examples have the specific components shown in the illustrations, embodiments of this disclosure are not limited to those particular combinations.",
"It is possible to use some of the components or features from one of the examples in combination with features or components from another one of the examples.",
"These and other features disclosed herein can be best understood from the following specification and drawings, the following of which is a brief description."
],
[
"CROSS REFERENCE TO RELATED APPLICATION This application is a continuation of U.S. application Ser.",
"No.",
"14/433,700 filed on Apr.",
"6, 2015, which is United States National Phase of PCT Application No.",
"PCT/US2013/036891 filed on Apr.",
"17, 2013, which claims priority to U.S.",
"Provisional Application No.",
"61/711,264 filed on Oct. 9, 2012.STATEMENT REGARDING FEDERALLY SPONSORED RESEARCH OR DEVELOPMENT This disclosure was made with Government support under NAS3-01138 awarded by the National Aeronautics and Space Administration.",
"The Government has certain rights in this disclosure.",
"BACKGROUND A gas turbine engine typically includes a fan section, a compressor section, a combustor section and a turbine section.",
"Air entering the compressor section is compressed and delivered into the combustion section where it is mixed with fuel and ignited to generate a high-speed exhaust gas flow.",
"The high-speed exhaust gas flow expands through the turbine section to drive the compressor and the fan section.",
"The compressor section typically includes low and high pressure compressors, and the turbine section includes low and high pressure turbines.",
"The fan section may also be driven by the low inner shaft.",
"A speed reduction device such as an epicyclical gear assembly may be utilized to drive the fan section such that the fan section may rotate at a speed different than the turbine section so as to increase the overall propulsive efficiency of the engine.",
"In such engine architectures, a shaft driven by one of the turbine sections provides an input to the epicyclical gear assembly that drives the fan section at a reduced speed such that both the turbine section and the fan section can rotate at closer to optimal speeds.",
"The fan section drives air through a bypass duct and induces a swirl within bypass airflow that is diffused by exit guide vanes.",
"The exit guide vanes turn bypass flow through the bypass duct toward an axial direction.",
"Each of the guide vanes includes a stagger angle that provides the desired turning or diffusion of airflow toward the axial direction.",
"Although geared architectures have improved propulsive efficiency, turbine engine manufacturers continue to seek further improvements to engine performance including improvements to thermal, transfer and propulsive efficiencies.",
"SUMMARY A gas turbine according to an exemplary embodiment of this disclosure, among other possible things includes a turbine driven fan rotor including a plurality of fan blades rotatable about an axis, a core engine including a turbine section that drives the fan, a duct circumscribing the fan rotor and defining a passageway aft of the fan rotor about the core engine, and a fan exit guide vane assembly including a plurality of exit guide vanes positioned downstream of the fan rotor within the duct.",
"Each of the plurality of exit guide vanes includes a stagger angle of less than about 15° at a midspan portion relative to a line parallel to the axis.",
"In a further embodiment of the foregoing gas turbine engine, the stagger angle is less than about 12° at the midspan portion.",
"In a further embodiment of any of the foregoing gas turbine engines, the stagger angle is between about 8° and 12° at the midspan portion.",
"In a further embodiment of any of the foregoing gas turbine engines, the midspan portion is between about 40% and about 85% of a total span of the vane.",
"In a further embodiment of any of the foregoing gas turbine engines, a difference between a maximum stagger angle and a minimum stagger angle for each of the plurality of exit guide vanes is less than about 6°.",
"In a further embodiment of any of the foregoing gas turbine engines, the duct defines a bypass with a bypass ratio being defined as the portion of air delivered into the bypass duct divided by the amount of air delivered into the core engine, with the bypass ratio being greater than about 6.0.In a further embodiment of any of the foregoing gas turbine engines, the bypass ratio is greater than about 10.0.In a further embodiment of any of the foregoing gas turbine engines, a fan pressure ratio across the fan is less than about 1.5.In a further embodiment of any of the foregoing gas turbine engines, each of the plurality of guide vanes are support at least a portion of the core engine.",
"In a further embodiment of any of the foregoing gas turbine engines, includes a geared architecture driven by the turbine section for rotating the fan about the axis.",
"A fan exit guide vane assembly for a gas turbine engine according to an exemplary embodiment of this disclosure, among other possible things includes a plurality of guide vanes including a pressure side and a suction side extending between a leading edge and a trailing edge and a span extending between a root and tip.",
"A stagger angle is defined as an angle between a longitudinal axis parallel to an engine axis of rotation and a line connecting the leading edge and the trailing edge is less than about 15° at a midspan portion.",
"In a further embodiment of the foregoing fan exit guide vane assembly, the stagger angle varies along the span from the root to the tip with a difference between a maximum stagger angle and a minimum stagger angle along the span is less than about 6°.",
"In a further embodiment of any of the foregoing fan exit guide vane assemblies, the stagger angle varies along the span between the root and the tip for a specific percent of the span according to the values set out in Table 1.In a further embodiment of any of the foregoing fan exit guide vane assemblies, the stagger angle is less than about 12° at a midspan portion.",
"In a further embodiment of any of the foregoing fan exit guide vane assemblies, the midspan portion includes that portion of the span between about 40% and about 85% of a total span of the vane.",
"A method of assembling a fan exit guide vane assembly according to an exemplary embodiment of this disclosure, among other possible things includes forming a plurality of guide vanes to include a pressure side and a suction side extending between a leading edge and a trailing edge and a span extending between a root and tip.",
"A stagger angle is defined as an angle between a longitudinal axis parallel to an engine axis of rotation and a line connecting the leading edge and the trailing edge is less than about 15° at a midspan portion, and arranging the plurality of guide vanes for assembly within a bypass duct.",
"In a further embodiment of the foregoing method, includes forming each of the plurality of guide vanes to include a stagger angle between about 8° and 12° at the midspan portion.",
"In a further embodiment of any of the foregoing methods, includes forming each of the plurality of guide vanes to include a varying stagger angle between the root and the tip with a difference between a maximum stagger angle and a minimum stagger angle for each of the plurality of guide vanes is less than about 6°.",
"Although the different examples have the specific components shown in the illustrations, embodiments of this disclosure are not limited to those particular combinations.",
"It is possible to use some of the components or features from one of the examples in combination with features or components from another one of the examples.",
"These and other features disclosed herein can be best understood from the following specification and drawings, the following of which is a brief description.",
"BRIEF DESCRIPTION OF THE DRAWINGS FIG.",
"1 is a schematic view of an example gas turbine engine.",
"FIG.",
"2 is a schematic view of the example gas turbine engine and bypass duct.",
"FIG.",
"3 is a forward view aft into the example bypass duct.",
"FIG.",
"4 is a schematic view of an example exit guide vane assembly.",
"FIG.",
"5 is cross-section through the exit guide vane.",
"FIG.",
"6 is a side view of an example exit guide vane.",
"DESCRIPTION FIG.",
"1 schematically illustrates an example gas turbine engine 20 that includes a fan section 22, and a core engine section 18 including a compressor section 24, a combustor section 26 and a turbine section 28.Alternative engines might include an augmenter section (not shown) among other systems or features.",
"The fan section 22 drives air along a bypass flow path B while the compressor section 24 draws air in along a core flow path C where air is compressed and communicated to a combustor section 26.In the combustor section 26, air is mixed with fuel and ignited to generate a high pressure exhaust gas stream that expands through the turbine section 28 where energy is extracted and utilized to drive the fan section 22 and the compressor section 24.Although the disclosed non-limiting embodiment depicts a turbofan gas turbine engine, it should be understood that the concepts described herein are not limited to use with turbofans as the teachings may be applied to other types of turbine engines; for example a turbine engine including a three-spool architecture in which three spools concentrically rotate about a common axis and where a low spool enables a low pressure turbine to drive a fan via a gearbox, an intermediate spool that enables an intermediate pressure turbine to drive a first compressor of the compressor section, and a high spool that enables a high pressure turbine to drive a high pressure compressor of the compressor section.",
"The example engine 20 generally includes a low speed spool 30 and a high speed spool 32 mounted for rotation about an engine central longitudinal axis A relative to an engine static structure 36 via several bearing systems 38.It should be understood that various bearing systems 38 at various locations may alternatively or additionally be provided.",
"The low speed spool 30 generally includes an inner shaft 40 that connects a fan 42 and a low pressure (or first) compressor section 44 to a low pressure (or first) turbine section 46.The inner shaft 40 drives the fan 42 through a speed change device, such as a geared architecture 48, to drive the fan 42 at a lower speed than the low speed spool 30.The high-speed spool 32 includes an outer shaft 50 that interconnects a high pressure (or second) compressor section 52 and a high pressure (or second) turbine section 54.The inner shaft 40 and the outer shaft 50 are concentric and rotate via the bearing systems 38 about the engine central longitudinal axis A.",
"A combustor 56 is arranged between the high pressure compressor 52 and the high pressure turbine 54.In one example, the high pressure turbine 54 includes at least two stages to provide a double stage high pressure turbine 54.In another example, the high pressure turbine 54 includes only a single stage.",
"As used herein, a “high pressure” compressor or turbine experiences a higher pressure than a corresponding “low pressure” compressor or turbine.",
"The example low pressure turbine 46 has a pressure ratio that is greater than about 5.The pressure ratio of the example low pressure turbine 46 is measured prior to an inlet of the low pressure turbine 46 as related to the pressure measured at the outlet of the low pressure turbine 46 prior to an exhaust nozzle.",
"A mid-turbine frame 58 of the engine static structure 36 is arranged generally between the high pressure turbine 54 and the low pressure turbine 46.The mid-turbine frame 58 further supports bearing systems 38 in the turbine section 28 as well as setting airflow entering the low pressure turbine 46.Airflow through the core flow path C is compressed by the low pressure compressor 44 then by the high pressure compressor 52 mixed with fuel and ignited in the combustor 56 to produce high speed exhaust gases that are then expanded through the high pressure turbine 54 and low pressure turbine 46.The mid-turbine frame 58 includes vanes 60, which are in the core airflow path and function as an inlet guide vane for the low pressure turbine 46.Utilizing the vane 60 of the mid-turbine frame 58 as the inlet guide vane for low pressure turbine 46 decreases the length of the low pressure turbine 46 without increasing the axial length of the mid-turbine frame 58.Reducing or eliminating the number of vanes in the low pressure turbine 46 shortens the axial length of the turbine section 28.Thus, the compactness of the gas turbine engine 20 is increased and a higher power density may be achieved.",
"The disclosed gas turbine engine 20 in one example is a high-bypass geared aircraft engine.",
"In a further example, the gas turbine engine 20 includes a bypass ratio greater than about six (6), with an example embodiment being greater than about ten (10).",
"The example geared architecture 48 is an epicyclical gear train, such as a planetary gear system, star gear system or other known gear system, with a gear reduction ratio of greater than about 2.3.In one disclosed embodiment, the gas turbine engine 20 includes a bypass ratio greater than about ten (10:1) and the fan diameter is significantly larger than an outer diameter of the low pressure compressor 44.It should be understood, however, that the above parameters are only exemplary of one embodiment of a gas turbine engine including a geared architecture and that the present disclosure is applicable to other gas turbine engines.",
"A significant amount of thrust is provided by the bypass flow B due to the high bypass ratio.",
"The fan section 22 of the engine 20 is designed for a particular flight condition—typically cruise at about 0.8 Mach and about 35,000 feet.",
"The flight condition of 0.8 Mach and 35,000 ft., with the engine at its best fuel consumption—also known as “bucket cruise Thrust Specific Fuel Consumption (‘TSFC’)”—is the industry standard parameter of pound-mass (lbm) of fuel per hour being burned divided by pound-force (lbf) of thrust the engine produces at that minimum point.",
"“Low fan pressure ratio” is the pressure ratio across the fan blade alone, without a Fan Exit Guide Vane (“FEGV”) system.",
"The low fan pressure ratio as disclosed herein according to one non-limiting embodiment is less than about 1.50.In another non-limiting embodiment the low fan pressure ratio is less than about 1.45.“Low corrected fan tip speed” is the actual fan tip speed in ft/sec divided by an industry standard temperature correction of [(Tram ° R)/(518.7° R)]0.5.The “Low corrected fan tip speed”, as disclosed herein according to one non-limiting embodiment, is less than about 1150 ft/second.",
"The example gas turbine engine includes the fan section 22 that comprises in one non-limiting embodiment less than about twenty-six (26) fan blades 42.In another non-limiting embodiment, the fan section 22 includes less than about twenty (20) fan blades 42.Moreover, in one disclosed embodiment the low pressure turbine 46 includes no more than about six (6) turbine rotors schematically indicated at 34.In another non-limiting example embodiment the low pressure turbine 46 includes about 3 turbine rotors.",
"A ratio between the number of fan blades 42 and the number of low pressure turbine rotors is between about 3.3 and about 8.6.The example low pressure turbine 46 provides the driving power to rotate the fan section 22 and therefore the relationship between the number of turbine rotors 34 in the low pressure turbine 46 and the number of blades 42 in the fan section 22 disclose an example gas turbine engine 20 with increased power transfer efficiency.",
"Referring to FIGS.",
"2, 3 and 4 with continued reference to FIG.",
"1, a principle of gas turbine engines is that a higher propulsive efficiency is enabled as exit jet velocity decreases while the bypass ratio increases.",
"In this circumstance, the amount of air passing through the core flow stream that includes the compressor and turbine is exceeded by the amount that bypasses it through a surrounding annular bypass duct 62.As this bypass air flow B increases and a lower jet velocity is pursued, the optimal duct fan pressure ratio (FPR) tends to be lower.",
"Pressure in the bypass duct 62 is generated by the fan blades 42.The resulting swirled duct airflow is turned back toward the engine axial direction by a stationary blade row, or fan exit guide vane (FEGV) assembly 68.Because of the presence of a sizeable pylon 76 (shown in FIG.",
"2) in the downstream duct the FEGV assembly 68 is comprised of a number of circumferentially offset, differently cambered vanes 70, including a generally “nominal” class vane, that is, the most numerous class vane in the row.",
"The benefit of increased bypass flow is fully realized and enabled, and the overall engine performance significantly improved, only so long as the component efficiency for the fan section 22 and the FEGV assembly 68 function properly.",
"Achieving a desired bypass flow B, pressure ratio and efficiency is directly related to the proper design of the fan section 22 and the FEGV geometry.",
"In the pursuit of a highly efficient low pressure ratio fan stage, it is important to understand that performance debits fall into two main categories: shock losses and frictional losses.",
"In the case of the fan blades 42, the dominant loss source has historically been shock losses associated due to the high rate of rotational speed that is typical of direct drive engine configurations.",
"The geared architecture 48 enables a differentiation of design point rotational speed between the fan section 22 and the fan drive or low pressure turbine 46 in this example.",
"The geared architecture 48 enables lower fan blade shock losses and therefore also requires different fan blade 22 and FEGV 70 designs in order to realize the performance benefits.",
"Reductions in the level of flow swirl emitted by the gear drive fan section 22 enable the nominal FEGV 70 to have a simplified configuration.",
"The example FEGV assembly 68 includes a plurality of circumferentially offset FEGVs 70 disposed aft, that is, downstream of the fan blades 42 within the bypass duct 62, illustrated schematically in FIG.",
"4.The bypass duct 62 is an annular duct bounded on a radially outward side by an outer nacelle 64 and fan case 66 and on a radially inner side by a core nacelle 74.The FEGVs 70 are arranged within the bypass duct 62 and extend radially outward from the core nacelle 74.In this example, the FEGVs 70 are a structural feature that supports the core engine 18 within the fan case 66.Each of the FEGVs 70 includes a slightly different geometry to direct bypass airflow B around obstructions in the bypass duct 62 such as a mounting pylon 76.However, the plurality of FEGVs 70 have a similar nominal airfoil shape.",
"Referring to FIGS.",
"5 and 6 with continued reference to FIG.",
"2, each of the FEGVs 70 comprise an airfoil shape including a pressure side 80, and a suction side 82 that meet at a leading edge 84 and trailing edge 86.The FEGV 70 further includes a root portion 94 that is disposed at the radially inner surface of the duct 62 and a tip 96 disposed at the radially outer surface of the duct 62.The airfoil includes a span 98, extending in the radial direction for the fan, that extends between the root 94 and the tip 96.A stagger angle 90 is the angle between a line 88 parallel with the engine longitudinal axis and a line 92 connecting the leading edge 84 and the trailing edge 86.The example FEGV 70 includes a twist that results in differing stagger angles at different locations along the span 98.Table 1 below lists one example series of stagger angles 90 as a function of a position along the span 98 that provides a nominal FEGV 70 for the an exemplary geared fan stage within a range of about +/−0.5 degrees.",
"TABLE 1 Geared Fan Stage FEGV Stagger Angle Nominal FEGV PCT-AVG STAGGER (°) 0.0 13.4 9.4 12.6 17.6 12.0 24.9 11.6 31.5 11.2 37.5 11.0 43.0 10.7 48.1 10.6 52.9 10.4 57.5 10.3 61.8 10.2 66.0 10.2 70.1 10.2 74.0 10.2 77.8 10.3 81.5 10.5 65.1 10.7 88.8 11.1 92.4 11.8 96.1 12.9 100.0 15.3 Table 1 above discloses one specific example embodiment of the FEGV assembly 68.However, the functions of the FEGVs 70 are enabled by including a plurality of nominal FEGVs 70 that include a stagger angle of less than about 15° within the midspan portion 100 relative to the line 88.In another example embodiment, the stagger angle 90 is between about 8° and 12° at the midspan portion 100.In this example the midspan portion is between about 40% and about 85% of total span 98 of the FEGV 70.The FEGVs 70 are further defined to include small differences in the stagger angle 90 along the span 98.In this example, a difference between a maximum stagger angle along the entire span 98 and a minimum stagger angle along the span 98 for each of the FEGVs 70 is less than about 6°.",
"The small differences in stagger angle 90 along the span 98 for any one FEGV 70 simplifies manufacture and assembly while also providing the desired functional bypass flow diverting performance.",
"Accordingly, the disclosed FEGV assembly 68 provides vanes with a decreased and more axially oriented, stagger angle that enable the required function and high efficiency to completely realize the benefits of the geared architecture 48.Although an example embodiment has been disclosed, a worker of ordinary skill in this art would recognize that certain modifications would come within the scope of this disclosure.",
"For that reason, the following claims should be studied to determine the scope and content of this disclosure."
]
] |
Patent_15871248
|
[
[
"METHOD AND APPARATUS FOR COOLING A FLUID BEVERAGE BELOW A BEVERAGE'S FREEZING POINT",
"The present invention relates to a method and apparatus for super-cooling a contained fluid by exposing a portion of the contained fluid to a temperature below a freezing point of the liquid while exposing a second portion of the contained fluid to a warmer temperature.",
"The present invention establishes a temperature differential between the ambient air or fluid temperature within the cooler and a portion of a receiving element which receives a beveraged container.",
"By creating a temperature differential, convection flow of the beverage within the packaged beverage occurs allowing the liquid beverage to achieve a temperature below its freezing point while being maintained in a liquid state."
],
[
"1.A cooler for maintaining a packaged beverage below a freezing point of the beverage and in a liquid state comprising: a housing defining an interior volume which is cooled to a temperature below a freezing point of a beverage: a plurality of receiving elements within the housing, each receiving element adapted for receiving a packaged beverage and positioning the beverage at about a 35 degree to about a 55 degree angle relative to a horizontal reference plane; a portion of the receiving element having a temperature which is warmer than a cooling temperature of the interior volume; wherein, the temperature differential between a portion of the receiving element and the interior volume establishes within the packaged beverage a convection flow, the convection flow allowing the beverage to be maintained at a temperature below the freezing point and in a liquid state.",
"2.The cooler according to claim 1 wherein the angle in which the beverages are positioned is substantially about 45 degrees.",
"3.The cooler according to claim 1 wherein the temperature differential between the interior volume and a portion of the receiving element is between a range of 5° to 15° Fahrenheit.",
"4.The cooler according to claim 1 wherein the receiving element is in the form of a cylindrical sleeve.",
"5.The cooler according to claim 1 wherein the receiving element defines an arcuate base for receiving a packaged beverage and an upper surface of the packaged beverage is in direct communication with a cooling medium which maintains a temperature differential such that the upper surface of the packaged beverage container is colder than the beverage container in contact with the receiving element.",
"6.The apparatus of claim 5 wherein the contained fluid is a canned or bottled beverage.",
"7.The apparatus of claim 5 wherein the receptacle comprises a gasket that seals between the inner surface of the receptacle and the outer surface of the contained fluid; therefore providing a barrier between the ambient air and the inside of the receptacle.",
"8.A method of partially super-cooling a contained fluid, comprising: obtaining a contained fluid, and inserting the contained fluid into the apparatus of claim 1.9.",
"(canceled) 10.",
"(canceled) 11.",
"(canceled) 12.",
"(canceled) 13.A process of cooling a beverage below a freezing point of the beverage while maintaining the beverage in a liquid state comprising the steps of: providing a freezer; establishing an ambient temperature within an interior of the freezer and at a temperature below a freezing point of a packaged beverage; placing the packaged beverage within the freezer, the package beverage positioned at an angle of between about 40° to about 50°, relative to a horizontal reference line; maintaining at least a portion of a lower surface of the positioned beverage container at a temperature greater than the ambient temperature within the freezer, thereby creating a temperature differential between an upper surface of the positioned beverage container and a lower system of the positioned beverage container; establishing a convection flow of the beverage within the packaging, the convection having a velocity sufficient to prevent freezing of the beverage.",
"14.",
"(canceled) 15.",
"(canceled) 16.",
"(canceled) 17.The process according to claim 13 wherein the step of placing the beverage container in the freezer further defines placing the packaged beverage container within a receiving element which defines a slot that allows exposure of ambient freezer air to the beverage container.",
"18.The process according to claim 17 wherein the receiving element is further supplied by a shelf supported within the freezer.",
"19.The process according to claim 18 wherein the shelf further defines a plenum within an interior of the shelf, the plenum in communication with a heated air source and in further communication with a base of the receiving element.",
"20.The process according to claim 18 wherein the receiving element further defines an insulated region surrounding of a least a portion of the resistance heater.",
"21.",
"(canceled) 22.The process according to claim 21 wherein an insulation material surrounds at least a portion of the outlet defined within the receiving element.",
"23.",
"(canceled) 24.The process according to claim 13 wherein the freezer is a non mechanical portable cooler.",
"25.The process according to claim 24 wherein said step of establishing an ambient temperature further included supplying a mixture of ice and salt to an upper surface of the positioned beverage.",
"26.The process according to claim 25 wherein the freezer is a portable cooler.",
"27.The process according to claim 13 wherein the ambient temperature within the freezer is at least about 10 degrees below the freezing point of the packaged beverage.",
"28.The process according to claim 13 wherein the temperature differential is at least about 3 degrees."
],
[
"<SOH> FIELD OF THE INVENTION <EOH>The present disclosure relates to a method and apparatus that cools a fluid below its freezing point while maintaining the fluid in a liquid state by exposing a portion of a fluid container to a cooling substance.",
"The process of cooling a fluid below its freezing point while maintaining its liquid state is known as super-cooling.",
"Contained fluids have been known to reach super-cooled temperatures especially when the container is smooth and devoid of foreign particulate and the fluid and container are exposed to a cooling means capable of reaching a temperature below the freezing point of the contained liquid.",
"Modern beverage containment methods include the manufacture of unique containers for each contained beverage.",
"Health and safety standards often dictate beverage liquids to be of pure, filtered nature.",
"Pure, filtered liquid in a new container tends to provide the necessary conditions for super-cooling to occur.",
"Embodiment of the present disclosure relates to both mechanical and portable containers that cause a contained fluid(s) to be super-cooled by the exposing an upper surface portion of the container to a first temperature by a cooling substance while a lower surface portion of the container is exposed to a second warmer temperature, thereby establish convection induced movement of the liquid beverage which enables the beverage to reach temperatures below a beverage freezing point and still in a liquid state."
],
[
"<SOH> SUMMARY OF THE INVENTION <EOH>The present invention relates to a method and apparatus for super-cooling a contained fluid by exposing a first portion of the contained fluid to a cooling substance while leaving a second portion of the contained fluid uncooled.",
"On exemplary embodiment of the container includes three sections: an insulated upper chamber, referred to as a cooling chamber and which is adapted for holding or receiving a cooling substance; a second, lower chamber, referred to as the uncooled chamber; and at least one hollow chamber that extends through and is in contact with both cooling and uncooled chambers.",
"The hollow chamber, referred to as a containment chamber, receives the contained (i.e., bottled or canned or otherwise contained) fluid that is to be partially super-cooled.",
"A horizontally oriented plane divides the cooling chamber and the uncooled chamber.",
"In some embodiments the containment chamber is oriented at an angle to the horizontal plane, so that the containment chamber extends through the upper (cooled) and lower (uncooled) chamber(s).",
"The present invention works by causing both convection and super cooling.",
"Convection is achieved by exposing only part of the contained fluid to a cooling substance.",
"Placing the contained fluid in the invention's hollow containment chamber exposes the contained fluid to both the upper cooling chamber and the lower uncooled chamber.",
"In this manner the fluid is exposed to a temperature differential which results in convection.",
"That is, the contained liquid moves from a lower warmer position to an upper region of the contained liquid when the liquid is cooled, sinks, and is reheated.",
"The action of super-cooling is achievable because contained fluids such as currently marketed bottled or canned beverages are of a purity that more easily permits super-cooling.",
"Super-cooling can occur more easily when a fluid that is devoid of particulates is cooled to a temperature below its freezing or crystallization point.",
"Any liquid lacking of particulates can be cooled to a temperature that is below that liquid's freezing point because it is the presence of particulates in liquids that promotes crystallization.",
"Thus a contained fluid in a clean, smooth container—for example a bottled, canned, pouched, paperboard or similar packaged beverage—could be super-cooled, dropping to a below-freezing temperature.",
"The present invention receives such contained fluids and causes this super-cooling.",
"Two aspects of the present invention, the super-cooling plus the aforementioned convection, keep the contained fluids in their super-cooled, liquid state.",
"In a context of beverages, the present invention provides a container for super-cooling and storing a contained fluid (for example a beverage) for a convenient period of time in which beverages may be stored and consumed.",
"One skilled in the art will realize that a cooling substance may include a powered cooling system such as a refrigerant and compressor combination or may be a chemical combination that produces low temperatures such as rock salt and ice or the use of dry ice.",
"The present invention offers improvements to the prior art by permitting super-cooling of contained fluids to extremely chilled liquid states while avoiding solid freezing.",
"It also keeps contained fluids separate from any cooling substance (such as ice-and-rock-salt mixtures), allowing, for example, enjoyment of a canned or bottled beverage which has no taste of rock salt, and with no unwanted ice or water on the beverage bottle or can.",
"It is a further aspect of at least one embodiment of the present invention to provide for an apparatus for partially super-cooling a packaged beverage, comprising at least one upper chamber and at least one lower chamber, between which at least one receptacle for a contained fluid resides; a portion which separates the upper chamber and the lower chamber, the upper chamber engaged with a cooling means; the packaged beverage engaging both the upper chamber and a portion of the container in thermal communication with the lower chamber, such that the packaged beverage is in partial contact with the cooling substance.",
"It is a further aspect of at least one embodiment of the present invention to provide for an apparatus of a freezer further defining plurality of receptacles, each receptacle having an inner surface, an outer surface, and a longitudinal axis; with an axis disposed at an angle between 20 and 80 degrees and more preferably about 45° in reference to a horizontal plane, the receptacle defining an area sufficient to receive a contained fluid.",
"It is a further aspect of at least one embodiment of the present invention to provide for a freezer for cooling packaged beverages to a temperature below a freezing point of the beverage while maintaining the beverage in a liquid state comprising; a mechanical freezer unit defining an interior volume and an opening for accessing the interior volume; a plurality of shelves positioned within the interior volume, each shelf further adapted for holding a plurality of packaged beverages at an angle of between about 35° to about 55° relative to a horizontal reference plane and within a receiving element supported by the shelf each receiving element further adapted for positioning a packaged beverage so that a first surface length of the packaged beverage is exposed to cooled air within the freezer interior, a heat source in communication with a base of each receiving element, said heat source adapted for increasing a temperature of at least a portion of a second surface length of the packaged beverage to a temperature above the temperature of the cooled air within the freezer, wherein, when a packaged beverage container is placed within the receiving element, the temperature differential between the upper length of the beverage container and the lower length of the beverage container creates a convection current within the liquid contents of the beverage container, thereby allowing the beverage to stay in a liquid state while maintained at a temperature below a freezing point of the beverage.",
"It is a further aspect of at least one embodiment of the present invention to provide for the freezer in which a receiver element has a heat source that is either resistive heating strip within the receiving element or a light bulb.",
"It is a further aspect of at least one embodiment of the present invention to provide for the freezer in which a receiving element has a heat source supplied by warm air generated by operation of the freezer and distributed within a plenum defined by an interior of the shelves.",
"It is a further aspect of at least one embodiment of the present invention to provide for a process of cooling a beverage below a freezing point of the beverage while maintaining the beverage in a liquid state comprising the steps of: providing a freezer, establishing an ambient temperature within an interior of the freezer and at a temperature below a freezing point of a packaged beverage; placing the packaged beverage within the freezer, the package beverage positioned at an angle of between about 30 degrees to about 60 degrees, relative to a horizontal reference plane; maintaining at least a portion of a lower surface of the positioned beverage container at a temperature greater than the ambient temperature within the freezer, thereby creating a temperature differential between an upper surface of the positioned beverage container at a lower system of the positioned beverage container, establishing a convection flow of the beverage within the packaging the convection flow rate being at a velocity sufficient to prevent freezing of the beverage.",
"It is a further aspect of at least one embodiment of the present invention to provide for the beverage cooling process wherein said step of maintaining a temperature of a lower section further defines using a resistance heat strip or a light bulb, or infrared heat source in communication with a lower surface of the positioned beverage container.",
"It is a further aspect of at least one embodiment of the present invention to provide for the process of cooling a beverage includes the step of maintaining a temperature of a lower surface of the packaged beverage container by supply a source of warm air generated from the operation of the freezer to a lower surface of the positioned beverage containers.",
"It is a further aspect of at least one embodiment of the present invention to provide for the process of cooling a beverage wherein the packaged beverage container is placed within a receiving element positioned within the freezer, the receiving element adapted for warming a lower portion of the beverage within the beverage container to a temperature greater than an upper portion of the beverage.",
"It is a further aspect of at least one embodiment of the present invention to provide for the process of cooling a beverage wherein a shelf defines a plenum within an interior of the shelf, the plenum in communication with an air source and in further communication with a base of a receiving element and wherein the receiving element may further define an insulated region surrounding of a least a portion of the base of the receiving element.",
"It is a further aspect of at least one embodiment of the present invention to provide a receiving element for holding a beverage which defines a heat source, and optionally insulation surrounds at least a portion of the heat source defined within the receiving element.",
"It is a further aspect of at least one embodiment of the present invention to provide for the process of cooling a beverage wherein the step of establishing an ambient temperature further includes supplying a mixture of ice and salt to an upper surface of the positioned beverage.",
"It is a further aspect of at least one embodiment of the present invention to provide for the process of cooling a beverage wherein the ambient temperature within a freezer is at least about 10 degrees Fahrenheit (F) below the freezing point of the packaged beverage.",
"It is a further aspect of at least one embodiment of the present invention to provide for the process of cooling a beverage wherein a temperature differential of least about 3° F. is maintained between a first length of the beverage container and a second opposite length of the beverage container.",
"The details of one or more variations of the instant subject matter are set forth in the accompanying drawings and the description below.",
"Other features and advantages of the instant subject matter will be apparent from the description and drawings, and from the claims."
],
[
"RELATED APPLICATIONS This application is a continuation-in-part of U.S. application Ser.",
"No.",
"13/742,307 filed on Jan. 15, 2013 and which is incorporated herein by reference.",
"FIELD OF THE INVENTION The present disclosure relates to a method and apparatus that cools a fluid below its freezing point while maintaining the fluid in a liquid state by exposing a portion of a fluid container to a cooling substance.",
"The process of cooling a fluid below its freezing point while maintaining its liquid state is known as super-cooling.",
"Contained fluids have been known to reach super-cooled temperatures especially when the container is smooth and devoid of foreign particulate and the fluid and container are exposed to a cooling means capable of reaching a temperature below the freezing point of the contained liquid.",
"Modern beverage containment methods include the manufacture of unique containers for each contained beverage.",
"Health and safety standards often dictate beverage liquids to be of pure, filtered nature.",
"Pure, filtered liquid in a new container tends to provide the necessary conditions for super-cooling to occur.",
"Embodiment of the present disclosure relates to both mechanical and portable containers that cause a contained fluid(s) to be super-cooled by the exposing an upper surface portion of the container to a first temperature by a cooling substance while a lower surface portion of the container is exposed to a second warmer temperature, thereby establish convection induced movement of the liquid beverage which enables the beverage to reach temperatures below a beverage freezing point and still in a liquid state.",
"SUMMARY OF THE INVENTION The present invention relates to a method and apparatus for super-cooling a contained fluid by exposing a first portion of the contained fluid to a cooling substance while leaving a second portion of the contained fluid uncooled.",
"On exemplary embodiment of the container includes three sections: an insulated upper chamber, referred to as a cooling chamber and which is adapted for holding or receiving a cooling substance; a second, lower chamber, referred to as the uncooled chamber; and at least one hollow chamber that extends through and is in contact with both cooling and uncooled chambers.",
"The hollow chamber, referred to as a containment chamber, receives the contained (i.e., bottled or canned or otherwise contained) fluid that is to be partially super-cooled.",
"A horizontally oriented plane divides the cooling chamber and the uncooled chamber.",
"In some embodiments the containment chamber is oriented at an angle to the horizontal plane, so that the containment chamber extends through the upper (cooled) and lower (uncooled) chamber(s).",
"The present invention works by causing both convection and super cooling.",
"Convection is achieved by exposing only part of the contained fluid to a cooling substance.",
"Placing the contained fluid in the invention's hollow containment chamber exposes the contained fluid to both the upper cooling chamber and the lower uncooled chamber.",
"In this manner the fluid is exposed to a temperature differential which results in convection.",
"That is, the contained liquid moves from a lower warmer position to an upper region of the contained liquid when the liquid is cooled, sinks, and is reheated.",
"The action of super-cooling is achievable because contained fluids such as currently marketed bottled or canned beverages are of a purity that more easily permits super-cooling.",
"Super-cooling can occur more easily when a fluid that is devoid of particulates is cooled to a temperature below its freezing or crystallization point.",
"Any liquid lacking of particulates can be cooled to a temperature that is below that liquid's freezing point because it is the presence of particulates in liquids that promotes crystallization.",
"Thus a contained fluid in a clean, smooth container—for example a bottled, canned, pouched, paperboard or similar packaged beverage—could be super-cooled, dropping to a below-freezing temperature.",
"The present invention receives such contained fluids and causes this super-cooling.",
"Two aspects of the present invention, the super-cooling plus the aforementioned convection, keep the contained fluids in their super-cooled, liquid state.",
"In a context of beverages, the present invention provides a container for super-cooling and storing a contained fluid (for example a beverage) for a convenient period of time in which beverages may be stored and consumed.",
"One skilled in the art will realize that a cooling substance may include a powered cooling system such as a refrigerant and compressor combination or may be a chemical combination that produces low temperatures such as rock salt and ice or the use of dry ice.",
"The present invention offers improvements to the prior art by permitting super-cooling of contained fluids to extremely chilled liquid states while avoiding solid freezing.",
"It also keeps contained fluids separate from any cooling substance (such as ice-and-rock-salt mixtures), allowing, for example, enjoyment of a canned or bottled beverage which has no taste of rock salt, and with no unwanted ice or water on the beverage bottle or can.",
"It is a further aspect of at least one embodiment of the present invention to provide for an apparatus for partially super-cooling a packaged beverage, comprising at least one upper chamber and at least one lower chamber, between which at least one receptacle for a contained fluid resides; a portion which separates the upper chamber and the lower chamber, the upper chamber engaged with a cooling means; the packaged beverage engaging both the upper chamber and a portion of the container in thermal communication with the lower chamber, such that the packaged beverage is in partial contact with the cooling substance.",
"It is a further aspect of at least one embodiment of the present invention to provide for an apparatus of a freezer further defining plurality of receptacles, each receptacle having an inner surface, an outer surface, and a longitudinal axis; with an axis disposed at an angle between 20 and 80 degrees and more preferably about 45° in reference to a horizontal plane, the receptacle defining an area sufficient to receive a contained fluid.",
"It is a further aspect of at least one embodiment of the present invention to provide for a freezer for cooling packaged beverages to a temperature below a freezing point of the beverage while maintaining the beverage in a liquid state comprising; a mechanical freezer unit defining an interior volume and an opening for accessing the interior volume; a plurality of shelves positioned within the interior volume, each shelf further adapted for holding a plurality of packaged beverages at an angle of between about 35° to about 55° relative to a horizontal reference plane and within a receiving element supported by the shelf each receiving element further adapted for positioning a packaged beverage so that a first surface length of the packaged beverage is exposed to cooled air within the freezer interior, a heat source in communication with a base of each receiving element, said heat source adapted for increasing a temperature of at least a portion of a second surface length of the packaged beverage to a temperature above the temperature of the cooled air within the freezer, wherein, when a packaged beverage container is placed within the receiving element, the temperature differential between the upper length of the beverage container and the lower length of the beverage container creates a convection current within the liquid contents of the beverage container, thereby allowing the beverage to stay in a liquid state while maintained at a temperature below a freezing point of the beverage.",
"It is a further aspect of at least one embodiment of the present invention to provide for the freezer in which a receiver element has a heat source that is either resistive heating strip within the receiving element or a light bulb.",
"It is a further aspect of at least one embodiment of the present invention to provide for the freezer in which a receiving element has a heat source supplied by warm air generated by operation of the freezer and distributed within a plenum defined by an interior of the shelves.",
"It is a further aspect of at least one embodiment of the present invention to provide for a process of cooling a beverage below a freezing point of the beverage while maintaining the beverage in a liquid state comprising the steps of: providing a freezer, establishing an ambient temperature within an interior of the freezer and at a temperature below a freezing point of a packaged beverage; placing the packaged beverage within the freezer, the package beverage positioned at an angle of between about 30 degrees to about 60 degrees, relative to a horizontal reference plane; maintaining at least a portion of a lower surface of the positioned beverage container at a temperature greater than the ambient temperature within the freezer, thereby creating a temperature differential between an upper surface of the positioned beverage container at a lower system of the positioned beverage container, establishing a convection flow of the beverage within the packaging the convection flow rate being at a velocity sufficient to prevent freezing of the beverage.",
"It is a further aspect of at least one embodiment of the present invention to provide for the beverage cooling process wherein said step of maintaining a temperature of a lower section further defines using a resistance heat strip or a light bulb, or infrared heat source in communication with a lower surface of the positioned beverage container.",
"It is a further aspect of at least one embodiment of the present invention to provide for the process of cooling a beverage includes the step of maintaining a temperature of a lower surface of the packaged beverage container by supply a source of warm air generated from the operation of the freezer to a lower surface of the positioned beverage containers.",
"It is a further aspect of at least one embodiment of the present invention to provide for the process of cooling a beverage wherein the packaged beverage container is placed within a receiving element positioned within the freezer, the receiving element adapted for warming a lower portion of the beverage within the beverage container to a temperature greater than an upper portion of the beverage.",
"It is a further aspect of at least one embodiment of the present invention to provide for the process of cooling a beverage wherein a shelf defines a plenum within an interior of the shelf, the plenum in communication with an air source and in further communication with a base of a receiving element and wherein the receiving element may further define an insulated region surrounding of a least a portion of the base of the receiving element.",
"It is a further aspect of at least one embodiment of the present invention to provide a receiving element for holding a beverage which defines a heat source, and optionally insulation surrounds at least a portion of the heat source defined within the receiving element.",
"It is a further aspect of at least one embodiment of the present invention to provide for the process of cooling a beverage wherein the step of establishing an ambient temperature further includes supplying a mixture of ice and salt to an upper surface of the positioned beverage.",
"It is a further aspect of at least one embodiment of the present invention to provide for the process of cooling a beverage wherein the ambient temperature within a freezer is at least about 10 degrees Fahrenheit (F) below the freezing point of the packaged beverage.",
"It is a further aspect of at least one embodiment of the present invention to provide for the process of cooling a beverage wherein a temperature differential of least about 3° F. is maintained between a first length of the beverage container and a second opposite length of the beverage container.",
"The details of one or more variations of the instant subject matter are set forth in the accompanying drawings and the description below.",
"Other features and advantages of the instant subject matter will be apparent from the description and drawings, and from the claims.",
"DESCRIPTION OF DRAWINGS The accompanying drawings, which are incorporated in and constitute part of this specification, show certain aspects of the instant subject matter and, together with the description, help explain some of the principles associated with the disclosed embodiments and implementations.",
"One skilled in the art will understand that a container-apparatus can take various forms and shapes.",
"It is described here as a rectangular volume for purposes of simplicity.",
"In the drawings: FIG.",
"1 is a side diagrammatic view of an example of the embodiment of the present disclosure.",
"FIG.",
"2 is a left, front, perspective view of an example of the embodiment of the contained-fluid-cooling apparatus.",
"FIG.",
"3 is a top-perspective, partially exploded view of an example of the contained-fluid-cooling apparatus.",
"FIG.",
"4 is a perspective, partial cutaway view of an example of the contained-fluid-cooling apparatus.",
"FIG.",
"5 is a side, orthographic section view of an example of the contained-fluid-cooling apparatus.",
"FIG.",
"6 is a perspective view illustrating an electric version of a freezer that can be used for lowering a packaged beverage to a temperature below the beverage's freezing point.",
"FIGS.",
"7-9 show various embodiments of the receiving element which retains a packaged beverage and further maintains a contact region with the beverage at a temperature greater than the ambient temperature within the freezer.",
"FIG.",
"10 illustrates an external ambient air source circulation pathway within the interior of the freezer.",
"FIG.",
"11 is an exploded view of a multi-compartment, non-mechanical cooler that provides for cooling and maintaining a beverage below the beverage's freezing point.",
"DETAILED DESCRIPTION OF DRAWINGS Reference will now be made in detail to the embodiments of the invention, one or more examples of which are set forth below.",
"Each example is provided by way of explanation of the invention, not limitation of the invention.",
"In fact, it will be apparent to those skilled in the art that various modifications and variations can be made in the present invention without departing from the scope or spirit of the invention.",
"For instance, features illustrated or described as part of one embodiment can be used on another embodiment to yield a still further embodiment.",
"Thus, it is intended that the present invention cover such modifications and variations as come within the scope of the appended claims and their equivalents.",
"Other objects, features, and aspects of the present invention are disclosed in the following detailed description.",
"It is to be understood by one of ordinary skill in the art that the present discussion is a description of exemplary embodiments only and is not intended as limiting the broader aspects of the present invention, which broader aspects are embodied in the exemplary constructions.",
"In describing the various figures herein, the same reference numbers are used throughout to describe the same material, apparatus, or process pathway.",
"To avoid redundancy, detailed descriptions of much of the apparatus once described in relation to a figure is not repeated in the descriptions of subsequent figures, although such apparatus or process is labeled with the same reference numbers.",
"FIG.",
"1 is a cross-section of one embodiment 10 for an apparatus and method for cooling a portion of a contained fluid is described.",
"The fluid-cooling apparatus comprises an enclosure 11.The enclosure 11 further comprises an upper chamber 26 and a lower chamber 13.A containment chamber 22 is partially surrounded by walls of the upper chamber 20 and is further surrounded by walls 21 of the lower chamber 13.A cooling substance creates a bath 28 contained within the upper chamber 26.The bath is capable of producing temperatures below the freezing point of the fluid to be cooled.",
"The lower chamber 13 remains empty or uncooled.",
"Fluid 25 in the containment chamber 22 is partially cooled by being partially surrounded by the cooling bath 28 which surrounds the upper portion of the containment chamber 22.The portion of the containment chamber 22 that is in contact with the wall 21 is not cooled.",
"By convection, fluid 25 in the containment chamber 22 will move from relatively warmer areas to relatively cooler areas as illustrated by arrows 23.A liquid of significant water composition in a clean, smooth container, devoid of particulate that may cause crystallization, in combination with movement of the fluid caused by the aforementioned convection, will be cooled below the freezing point of the liquid while maintaining a liquid state.",
"Gaskets 24 reside between walls 21 so that the majority of the containment chamber 22 and the fluid 25 contained therein is insulated from ambient temperature.",
"The containment chamber 22 is made of a rigid material that conducts cold from the cooling bath 28 to the interior of the containment chamber 22, which holds the contained fluid 25.The cooling chamber partially cooling the contained liquid 25 below its freezing temperature, in conjunction with the empty lower chamber 13 provide a cool liquid for a significant duration of time, a greater period of time than if the contained fluid were submersed entirely in a cooling substance.",
"FIG.",
"2 shows a portable, contained-fluid-cooling apparatus 100 in its closed state with lid 112 on and handle 114 folded down.",
"On at least one side of the outer chamber 111 at least one opening 118 joins with an integrated containment chamber 120.The integrated containment chamber 120 is shaped to hold contained fluids, for example canned or bottled beverages 122.A vent 116 provides a means of relieving pressure between the interior of the apparatus and the ambient pressure so as to allow for easy lid-opening, as a cooling process on the interior of the apparatus tends to create a pressure differential.",
"FIG.",
"3 shows the portable, contained-fluid-cooling apparatus 100 with its lid 112 removed.",
"The upper portions of the integrated containment chamber 120 meet the upper chamber 126.An opening 118 in the outer chamber 111 receives a contained fluid 122 such as a canned or bottled beverage.",
"FIG.",
"4 is a partial cutaway view of the apparatus 100 showing contained fluids 122 placed as intended in the integrated containment chamber 120 so that the contained fluids 122 are cooled by contact with a cooling bath 128 which surrounds a portion of the integrated containment chambers 120 in the upper chamber 126.Thus only the upper portion of the contained fluid 122 is cooled.",
"Gaskets 124 integrated with the integrated containment chambers 120 create a seal between the interior of the containment chambers and the exterior of the contained fluids 128 so as to keep the contained fluids 122 insulated from the ambient temperature.",
"The integrated containment chambers 120 are made of a rigid material that conducts cold from the cooling bath 128 to the interior of the integrated containment chambers 120, where the contained fluids 122 are stored.",
"On at least one side of the outer chamber 111 at least one opening 118 joins with an integrated containment chamber 120.The integrated containment chamber 120 is shaped to hold contained fluids 122, for example canned or bottled beverages.",
"A gasket 124 makes a seal between the integrated containment chamber 120 and contained fluid 122.The integrated containment chambers 120 extend from an opening 118 in the outer chamber 111 into the inside of the upper chamber 126 and the lower chamber 113.FIG.",
"5 is a cross-section of the present embodiment 100.An apparatus and method for cooling a portion of a beverage container is described.",
"The fluid-cooling apparatus 100 comprises an enclosure 111.The enclosure 111 further comprises an upper chamber 126 and a lower chamber 113.A containment chamber 122 is partially surrounded by walls of the upper chamber 120 and is further surrounded by walls 121 of the lower chamber 113.A cooling substance creates a bath 128 that is capable of producing temperatures below the freezing point of the fluid to be cooled, and is contained within the upper chamber 126 while the lower chamber 113 remains empty and not directly cooled.",
"A beverage container 122 in the containment chamber 118 is partially cooled by being surrounded by the cooling bath 128 which surrounds the upper portion of the containment chamber 122.The portion of the containment chamber 122 that is in contact with the wall 121 is not cooled and creates a temperature differential between opposite sites of the container 122.In accordance with the present invention, it has been found that temperatures substantially below the freezing point of a liquid can be achieved using a chest type freezer of the type described in FIGS.",
"1-4.For instance, a bottled beer may be brought and maintained at a temperature of about 14.5° F. without freezing.",
"Other beverages could be reduced to temperatures between 17° to 22° F. For instance, bottled water could be maintained between temperatures of 22 to 24° F. without being frozen.",
"Without being limited by theory, it is believed that the below freezing point temperatures are possible because of the kinetic energy associated with the convection movement of fluids within the packaged beverage container.",
"It is believed that maintaining a temperature differential preferably between about 1° to about 15, more preferably between about 5° to about 10° and still more preferably between about 6° to about 9° o a Fahrenheit scale, allows for a sufficient kinetic energy and convection current to be established while maintaining the liquid beverage at a below freezing temperature.",
"While even a minor temperature differential between an upper surface of the packaged beverage and a lower surface of the packaged beverage will inpart a convection current, it is believed that having a temperature differential of at least about 7°degrees will provide sufficient energy in the form of convection movement of the beverage such that below freezing temperatures can be maintained.",
"As seen in reference to FIGS.",
"6-10, an apparatus and a process is provided in which a mechanical freezer may be used to establish an ambient temperature within the freezer which is below the freezing point of a packaged beverage.",
"The packaged beverages are maintained within a receiving element 208 on an inclined shelf 206 that positions the packaged beverage 210 at an angle of between about 20° to about 70° and more preferably about 40° to about 50°, and move preferably at an angle of about 45° relative to a horizontal reference plane.",
"As best seen in reference to FIGS.",
"6 and 7, an electrically operated mechanical operated freezer 200 is seen.",
"The freezer can have a door 202 which may be of metal or glass.",
"Situated within the interior of the freezer are a plurality of the shelves 206, each shelf further defining a plurality of receiving elements 208 for holding a prepackaged beverage 210.While the preferred embodiment illustrates a receiving element 208 adapted for a cylindrical beverage container 210, it is noted that the receiving element can be altered to fit any desired beverage container shape.",
"For instance, a soft drink or beer provider could have the receiving element molded in a dimension that conforms to the contours of a preferred beverage bottle.",
"Likewise, a receiving element could be fashioned in accordance with the present teachings to receive flat sided containers such as cartons.",
"The operation of the cooling components of the freezer are conventional and well known within the art.",
"As seen in reference to FIG.",
"6, there is a compressor 212 which directs a cooling medium to a condenser 218.From condenser 218 the cooling medium is directed to an evaporator 214 within an associated fan 216 which distributes the chilled air from operation of the evaporator unit into the interior space of the freezer 200.The distribution of chilled air within the freezer can be through air directly released into the freezer or by chilling the interior walls.",
"The mechanical operation of any conventional freezer design can be utilized in accordance with the present invention so as to provide the necessary shelving, receiving elements, and modifications of the receiving element as described below so as to bring about a differential temperature with respect to a portion of the beverage container and the ambient air temperature which is in contact with the surface of the beverage container not in contact with the receiving element.",
"As best seen in reference to FIGS.",
"7-9 are various embodiments of receiving elements 208 that have been modified along a portion of the receiving element so as to bring about a temperature differential with respect to a surface of the bottle that engages the receiving element and the opposite side of the bottle.",
"For instance, as seen in reference to FIG.",
"7, a strip heater 220 can be positioned within the receiving element and which would be in contact with a beverage container placed within the receiving element.",
"The strip heater 220 can be responsive to a thermostat and can be set at a temperature preselected for the type of beverage being placed within the receiving element.",
"For instance, if a desired temperature differential of 7° between the ambient air temperature of the freezer and a warmer temperature established by the strip heater 220 is desired, the appropriate temperature of the strip heater can be maintained.",
"That temperature will of course vary depending upon the nature of the contents of the packaged beverage.",
"For instance, bottled water may have an ambient freezer temperature of 20° in which the strip heater 220 is maintained at a temperature of 27°.",
"The temperature differential is sufficient to establish a convection flow within the packaged beverage as seen in reference to directional movement 23 seen in FIG.",
"1.An alternative embodiment of the receiving element 208 can be seen in reference to FIG.",
"8 in which a plurality of light bulbs 224 can be used to bring about a temperature differential between any bottle or beverage container within the receiving element 208 and the opposing side of the beverage container.",
"The bulbs 224 can be incandescent, infrared, tungsten, or other electric bulb which generates an effective amount of heat.",
"The bulbs can be regulated by a thermostat, a rheostat, or some combination of the two such that the heat from the bulbs will establish the desired temperature differential.",
"As seen in reference to FIG.",
"8, optional insulation 222 can be provided within the receiving element.",
"The insulation 222 can be used with any of the embodiments described herein and can provide for a more energy efficient operation of the freezer unit.",
"In addition, the insulation 222 can also provide a physical cushion with respect to the beverage container which can lessen noise and minimize possible breakage of glass containers.",
"Set forth in FIG.",
"9 is yet another alternative embodiment of a receiving element 208 in which a portion of the receiving element is in communication with a warm air outlet 226.By way of example, the outlet 226 can comprise a plurality of small apertures and are in communication with an air flow which is warmer than the ambient air temperature of the freezer.",
"One way of providing a warm air source to the air outlet 226 can be seen in reference to the air flow pathway set forth in FIG.",
"10.As seen in reference to FIG.",
"10, an air flow pathway 232 as seen by the directional arrows is schematically indicated as flowing through the plurality of shelves 206 and the associated interior walls of the freezer.",
"The air flow 232 is in communication with an inlet 230 positioned near a base of the freezer 200 and exits through a wall outlet 234 along an upper edge of freezer 200.The air flow 232 can be in communication with the receiving element 208 defined within each shelf.",
"The warmer air associated with air flow can be used to raise the entire surface temperature of receiving element 208 or be a more direct communication through outlet 226 as seen in reference to FIG.",
"9.In addition, the air flow 232 can either use an air source external to the freezer 200, or utilize heated air displaced from the operation of the compressor and other portions of the mechanical cooling unit.",
"Further, it is envisioned that a combined air flow using a combination of outside air and air warmed by operation of the freezer can be used to establish a temperature differential between base surface of the receiving elements 208 and the ambient air temperature within the interior of freezer 200.A portion of the receiving element is in thermal contact with a lower surface of the beverage container.",
"This portion of the thermal contact area can provide a means for increasing a localized temperature within the receiving element such that the heat is subsequently transferred to the packaged beverage.",
"Suitable heating elements can include a resistance strip heater 220 (FIG.",
"9) which is positioned within the receiving element 206, a surface of the receiving element which contains flush or recessed infrared light sources 224 (FIG.",
"8) such as incandescent bulbs, tungsten bulbs, or infrared bulbs.",
"By supplying a heat source to the lower surface of the container and/or a receiving portion of the receiving element, sufficient heat can be transferred to the contents of the packaged beverage such that a convection movement is created by temperature differentials between the upper liquid surface and lower liquid surface of the beverage.",
"The temperature difference between a lower portion of the packaged liquid and an upper portion of the package liquidage establishing the convection movement within the container and the associated kinetic energy prevents the contents from freezing even when the contents are at a temperature that may be well below a freezing point of the packaged beverage.",
"An alternative embodiment and process for maintaining a packaged beverage below a freezing point can be seen in reference in FIG.",
"10 wherein the receiving element is in communication with a source of air that is warmer than the ambient air within the freezer.",
"For instance, an air plenum can be defined within the shelves 206 and the receiving element 208 such that the portion of the receiving element 208 that makes contact with the beverage container is maintained at a warmer temperature than the freezer ambient temperature.",
"The warmer air can be either air from outside the freezer or air directed from the heat generated by the compressor 212 or a combination of both.",
"By introducing warmer air to the receiving element area, the beverage placed within the receiving element will have the corresponding adjacent surface warmed which in turn increases a localized temperature of the beverage adjacent to the corresponding interior beverage container wall.",
"The difference between the warmer temperature and the cooler temperature of the beverage exposed to the upper portion of the packaged container will bring about the convection rotational movement of the beverage within the container.",
"One or more thermostats can be used to help regulate the desired temperature differential between the freezer ambient air temperature and the localized temperature within the receiving element.",
"A suitable preprogrammed temperature profile can be established for various types of beverages depending upon the type of beverage i.e.",
"water, beer, or soft drink, as well as make adjustments for the size of the container.",
"Fine tuning of the temperature controls can also make allowances for the type of beverage container.",
"For instance, highly conductive materials such as aluminum may operate at an optimal temperature values that may be different from the identical beverage packaged in a thicker glass, a plastic container, or a paper board container.",
"As the ambient temperature in the freezer is lowered, the corresponding localized temperature within the receiving element can optionally be increased.",
"Without undue experimentation, one of ordinary skill in the art can readily ascertain the desired temperature differentials for any particular beverage as packaged so as to achieve a desired beverage temperature.",
"The receiving 208 element can also be responsive to one or more sensors such as a light sensor, a proximity sensor or a mechanical switch that is engaged when a packaged beverage is placed within the receiving element.",
"When the sensor detects that there is no beverage container present, the various types of heating mechanisms utilized for increasing the temperature within the receiving element can be turned off.",
"While the illustrated embodiments reflect a receiving element for holding a single beverage, it is envisioned and within in the scope of the present invention that a plurality of aligned receiving elements can be provided within a freezer such that a plurality of beverage containers can be placed end to end within a cylindrical or linear receiving element 208.As it is known in the art, various springs or biasing members can be used to reposition a packaged beverage to a terminal end of the receiving element such that an individual can easily grasp and remove the packaged beverage.",
"To the extent there are other beverages packaged within the receiving element magazine, the next beveraged item can then be positioned into the display and/or point of sale position.",
"The embodiments set forth in FIGS.",
"6-10 illustrate preferred embodiments of a receiving element having a heat transfer area that substantially corresponds to a portion of a length of a packaged beverage container.",
"It is also possible to provide a heat source applied to either a partial length of the beverage container or to the beverage base.",
"While as not as effective in establishing a convectional flow, such an arrangement would still operate to prevent the beverage contents from freezing by creating a convection movement within the container.",
"As seen in reference to FIG.",
"11, an embodiment of a non-mechanical cooler is provided.",
"The cooler is designed to be portable and can be used with ice and rock salt to lower enclosed beverages to a temperature below the freezing point of the beverage.",
"The cooler 300 has a removable top 310, a water tight cooling compartment 320 which is adapted to nest within an uncooled compartment 330.Cooling compartment 320 and uncooled compartment 330 can be further secured in an insulated enclosure 340.Cooling compartment 320 is designed to hold a mixture of ice and rock salt.",
"It has been found that ratios of 1 cup of salt to 5 to 8 pounds of ice can achieve temperatures well below freezing.",
"For instance, a 1 to 3 ratio of sodium chloride to ice can achieve a temperature of minus 4.0° F. As a general rule, the greater percentage of salt in the salt to ice ratio will bring about a lower temperature.",
"The exact ratio can be influenced by the nature of the beverage.",
"For instance, the lower temperature can be utilized for beers which would ultimately freeze at a lower temperature than for instance bottled water.",
"Cooling compartment 320 is scaled so that ice, salt, and melted water are entirely contained within compartment 320.Compartment 320 is placed in an engaged position with the corresponding lower uncooled compartment 330 when second in place, the curved arcuate surfaces 322 defined by upper compartment 320 will align with openings 332 in compartment 330.The mated engagement will establish a receiving sleeve that is formed between the arcuate curvature 322 and the arcuate member 332.In an assembled configuration, apertures 342 of base 340 are aligned with corresponding apertures 332 and 322 of corresponding bases 330 and 320.A beveraged container, not illustrated, can be inserted into aperture 342 and is inter-engaged between an upper half of a cylinder formed by arcuate surface 322 and a lower half of arcuate surfaces 332.The beverage is exposed to a cooling medium contained in the opening defined by compartment 320 that allows the cooling medium to achieve a temperature below freezing.",
"The cooling medium is transferred along the curved surface of opening 322 and cools an upper surface of an enclosed beverage.",
"The lower surface 322 is not cooled and is at a warmer temperature.",
"The temperature differential brings about a convection movement within the beverage.",
"With the components being housed within an insulated base 342, the cooler can provide for at least 24 hours of below freezing temperature cooling of liquids placed in the container such as bottled water, soft drinks, beer, juices, and similar beverages.",
"In this embodiment, the temperature differential is largely controlled by the temperature present within the interior of compartment 330.Since compartment 330 is not directly exposed to the cooling medium present within compartment 320, a temperature differential is created and will vary depending upon the ambient air temperature in which the cooler is stored and maintained.",
"One having ordinary skill in the art will recognize that the greater the temperature differential that is established between an upper layer of the liquid beverage and a lower layer portion of the liquid beverage, the greater the amount of convection and hence kinetic energy will be established within the container.",
"As a general rule, the greater the temperature differential, the lower the temperature relative to the freezing point that can be established.",
"Without undue experimentation, one of the ordinary skill in the art can establish the appropriate temperature differentials that are needed given the variation in container shapes, container materials, beverage contents, desired below freezing temperature point for the liquid beverage, and the amount of kinetic energy needed to be supplied by the temperature differential induced convection.",
"In general, a lower subfreezing point for the beverage will require a greater temperature differential in order to maintain the necessary kinetic energy.",
"The freezing point (° C.) of beer=(−0.42×A)+(0.04×E)+0.2, where A is the percent of alcohol content by weight, and E is the original gravity of the wort (° Plato).",
"Therefore, each 1% increase in alcohol content lowers the freezing point by 0.42° C. and each increase in gravity of 1 Plato raises it by 0.04° C. Thus, no beer will freeze at −1° C., and products at higher alcohol concentrations (including high-gravity brews prior to dilution) will withstand even lower temperatures.",
"TABLE 1 Cargo type Freezing point in ° F. 1 Carbonated water 31.5 2 Fizzy lemonade 31.1 3 Fizzy orange 30.0 4 Tomato juice 29.4 5 Apple juice 29.0 6 Mango juice 29.0 7 Unfermented rhubarb juice 28.6 8 Malt beer, ordinary 28.5 9 Vollbier, pale 28.3 10 Unfermented sour cherry juice 28.1 11 Unfermented redcurrant juice 27.8 12 German Pilsner 27.6 13 Bock beer, pale 26.5 Set forth above in Table 1 are freezing points of various types of beverages.",
"All these beverages can be brought to and maintained at a temperature.",
"It is believed to be at least about 10 degrees below the freezing point of the beverage by creating a sufficient temperature differential within the beverage container to bring about convection movement of the beverage.",
"The presence or absence of carbonation, alcohol content, sugar content, and the presence of other solutes can all have an impact on the normal freezing point of a beverage.",
"As a general rule, the more materials such as sugars, alcohol, and dissolved gases such as carbonation that are present within a beverage, the lower the normal freezing point of the beverage.",
"Although preferred embodiments of the invention have been described using specific terms, devices, and methods, such description is for illustrative purposes only.",
"The words used are words of description rather than of limitation.",
"It is to be understood that changes and variations may be made by those of ordinary skill in the art without departing from the spirit or the scope of the present invention which is set forth in the following claims.",
"In addition, it should be understood that aspects of the various embodiments may be interchanged, both in whole, or in part.",
"Therefore, the spirit and scope of the appended claims should not be limited to the description of the preferred versions contained therein."
]
] |
Patent_15871249
|
[
[
"COMPONENT-BASED SOFTWARE SYSTEM AND DEVELOPMENT METHOD",
"A method of assembling software includes: enabling a user to code a Computation Function (CF) (S101); determining whether the user is done coding the CFs (S102); enabling a user to code a Part Function (PF) using one or more of the available CFs (S103); determining when the user is done creating all the PFs (S104); and enabling a user to create software using one or more of the available PFs.",
"(FIG.",
"1)"
],
[
"1.A method of assembling a computer program to perform a service, the method comprising: converting an input/output (I/O) requirement of the service into a respective data message comprising a plurality of I/O key-value pairs; configuring a part function (PF) of the program to receive the data message as an input argument; generating a variable matching structure (VMS) set (VMSS) including key-pairs that map to arguments of a computation function (CF) and to the I/O key-value pairs; and configuring the PF to call the computation function (CF) using the VMSS, wherein the CF is configured to perform an operation related to the service.",
"2.The method of claim 1, wherein the VMSS includes a VMS comprising a subset of the key-pairs, wherein a first key-pair among the key-pairs of the subset includes a first key that maps to an input argument of the CF, and a second key that maps to an input key-value pair among the I/O key value pairs.",
"3.The method of claim 2, wherein a second key-pair among the key-pairs of the subset includes a third key that maps to an output argument of the CF, and a fourth key that maps to an output key-value pair among the I/O key value pairs.",
"4.The method claim 1, further comprising storing the VMSS in data storage indexable by a name of the data message.",
"5.The method of claim 1, wherein the data message has a JavaScript Object Notation (JSON) format.",
"6.A method of executing a computer program configured to perform a service, the computer program comprising a part function (PF) configured to receive a data message comprising a plurality of input/output (I/O) key-value pairs as an input argument, the method comprising: retrieving a data structure comprising a plurality of elements using a name of the data message, wherein each element includes a name and a variable matching structure (VMS); for each element in the retrieved data structure, using the name of the element to retrieve a computation function (CF); and calling the retrieved CF using the VMS of the element and the data message.",
"7.The method of claim 6, wherein the calling comprises: determining input data from the data message; mapping arguments of the CF to data parts of the input data from the VMS; and calling the CF with the data parts according to the mapping.",
"8.The method of claim 6, wherein the calling further uses data stored in an internal data structure of the PF comprising a result of a prior call of the retrieved CF.",
"9.The method of claim 6, wherein the data message has a JavaScript Object Notation (JSON) format.",
"10.The method of claim 6, wherein the calling calls the retrieved CF with a second data message comprising a plurality of input/output (I/O) key-value pairs to invoke a second PF.",
"11.A computer program product to assemble a computer program to perform a service, the computer program product comprising a computer readable storage medium having program instructions embodied therewith, the program instructions executable by a computer to perform a method comprising: converting an input/output (I/O) requirement of the service into a respective data message comprising a plurality of I/O key-value pairs; configuring a part function (PF) of the program to receive the data message as an input argument; generating a variable matching structure (VMS) set (VMSS) including key-pairs that map to arguments of a computation function (CF) and to the I/O key-value pairs; and configuring the PF to call the computation function (CF) using the VMSS, wherein the CF is configured to perform an operation related to the service.",
"12.The computer program product of claim 11, wherein the VMSS includes a VMS comprising a subset of the key-pairs, wherein a first key-pair among the key-pairs of the subset includes a first key that maps to an input argument of the CF, and a second key that maps to an input key-value pair among the I/O key value pairs.",
"13.The computer program product of claim 12, wherein a second key-pair among the key-pairs of the subset includes a third key that maps to an output argument of the CF, and a fourth key that maps to an output key-value pair among the I/O key value pairs.",
"14.The computer program product of claim 11, further comprising storing the VMSS in data storage indexable by a name of the data message.",
"15.The computer program product of claim 11, wherein the data message has a JavaScript Object Notation (JSON) format.",
"16.A computer program product to execute a computer program configured to perform a service, the computer program comprising a part function (PF) configured to receive a data message comprising a plurality of input/output (I/O) key-value pairs as an input argument, the computer program product comprising a computer readable storage medium having program instructions embodied therewith, the program instructions executable by a computer to perform a method comprising: retrieving a data structure comprising a plurality of elements using a name of the data message, wherein each element includes a name and a variable matching structure (VMS); for each element in the retrieved data structure, using the name of the element to retrieve a computation function (CF); and calling the retrieved CF using the VMS of the element and the data message.",
"17.The computer program product of claim 16, wherein the calling comprises: determining input data from the data message; mapping arguments of the CF to data parts of the input data from the VMS; and calling the CF with the data parts according to the mapping.",
"18.The computer program product of claim 16, wherein the calling further uses data stored in an internal data structure of the PF comprising a result of a prior call of the retrieved CF.",
"19.The computer program product of claim 16, wherein the data message has a JavaScript Object Notation (JSON) format.",
"20.The computer program product of claim 16, wherein the calling calls the retrieved CF with a second data message comprising a plurality of input/output (I/O) key-value pairs to invoke a second PF."
],
[
"<SOH> BACKGROUND <EOH>"
],
[
"<SOH> BRIEF SUMMARY <EOH>According to an exemplary embodiment of the invention, a method of assembling computer code to perform a service is provided.",
"The method includes: converting an input/output (I/O) requirement of the service into a respective data message comprising a plurality of I/O key-value pairs; configuring a part function (PF) of the program to receive the data message as an input argument; generating a variable matching structure (VMS) set (VMSS) including key-pairs that map to arguments of a computation function (CF) and to the I/O key-value pairs; and configuring the PF to call the computation function (CF) using the VMSS, where the CF is configured to perform an operation related to the service.",
"According to an exemplary embodiment of the invention, a method of executing a computer program configured to perform a service is provided.",
"The computer program includes a part function (PF) configured to receive a data message including a plurality of input/output (I/O) key-value pairs as an input argument.",
"The method includes: retrieving a data structure including a plurality of elements using a name of the data message, wherein each element includes a name and a variable matching structure (VMS); and for each element in the retrieved data structure, using the name of the element to retrieve a computation function (CF) and calling the retrieved CF using the VMS of the element and the data message."
],
[
"CROSS-REFERENCE TO RELATED APPLICATIONS This Patent Application is a Continuation in Part (CIP) of International Application No.",
"PCT/US2016/042402 filed on Jul.",
"15, 2016, which claims priority to U.S.",
"Provisional Patent Application No.",
"62/193,151 filed on Jul.",
"16, 2015.BACKGROUND 1.Technical Field The present disclosure relates generally to component-based software development techniques.",
"2.Discussion of Related Art Procedural programming is a programming paradigm, derived from structured programming, based on the concept of the procedural call.",
"Procedures, also known as routines, subroutines, or functions, contain a series of computational steps to be carried out.",
"Examples of procedural programming languages include C, Fortran, and Pascal.",
"In Object-oriented programming, the focus is on breaking down a programming tasks into objects that expose behaviors (methods) and data (members or attributes) using interfaces.",
"While procedural programming uses procedures to operate on data structures, object-oriented programming bundles the two together, so an “object”, which is an instance of a class, operates on its “own” data structure.",
"However, it can be difficult for a layperson to write a working computer program using Procedural programming or Object-oriented programming.",
"Further, and more importantly, it can be difficult for a layperson to write computer programs or functions for computer programs in such a way that they can be re-used in other applications.",
"Thus, each time the previously written computer program or computer function needs to be applied to a new application; it needs to be modified for the new application, thereby slowing down development.",
"Code reuse is a fundamental way to increase the efficiency of software development.",
"A computer function is the smallest reusable unit or structure of a computer program.",
"A computer function is invoked by a function call in either procedure programming or object oriented programming and implemented at the statement level.",
"Variables corresponding to the arguments of the called function need to be declared, set values and passed to the called function and a value returned by the called function is set to a variable so it can be used in a later computation.",
"These statements produce coupling between the calling functions and the called functions and reduce the reusability of the calling function.",
"When writing software (e.g., a computer function) using either procedure programming or object oriented programming, a lot of application specific data variables need to be declared and used at a statement level.",
"Because these statements are application specific, they are not reusable in other software.",
"These statements are implemented in the same programming language as the reused codes in the software, they are mixed together with the reused codes.",
"Programmers that maintain and modify this type of software need to be able to understand these statements so they can change them when needed to a new application, which is especially time consuming when the statements were previously written by someone else.",
"An assembly line is a manufacturing process in which interchangeable parts are added as the semi-finished assembly moves from workstation to workstation where the parts are added in sequence until the final assembly is produced.",
"Due to use of the assembly line, a finished product can be assembled faster and with less labor.",
"BRIEF SUMMARY According to an exemplary embodiment of the invention, a method of assembling computer code to perform a service is provided.",
"The method includes: converting an input/output (I/O) requirement of the service into a respective data message comprising a plurality of I/O key-value pairs; configuring a part function (PF) of the program to receive the data message as an input argument; generating a variable matching structure (VMS) set (VMSS) including key-pairs that map to arguments of a computation function (CF) and to the I/O key-value pairs; and configuring the PF to call the computation function (CF) using the VMSS, where the CF is configured to perform an operation related to the service.",
"According to an exemplary embodiment of the invention, a method of executing a computer program configured to perform a service is provided.",
"The computer program includes a part function (PF) configured to receive a data message including a plurality of input/output (I/O) key-value pairs as an input argument.",
"The method includes: retrieving a data structure including a plurality of elements using a name of the data message, wherein each element includes a name and a variable matching structure (VMS); and for each element in the retrieved data structure, using the name of the element to retrieve a computation function (CF) and calling the retrieved CF using the VMS of the element and the data message.",
"BRIEF DESCRIPTION OF THE SEVERAL VIEWS OF THE DRAWINGS Exemplary embodiments of the invention can be understood in more detail from the following descriptions taken in conjunction with the accompanying drawings in which: FIG.",
"1 shows a method of assembling software according to an exemplary embodiment of the inventive concept; FIG.",
"2 illustrates an exemplary computer system that may be used to execute the method; FIG.",
"3 illustrates a method of configuring a part function of the software according to an exemplary embodiment of the inventive concept; FIG.",
"4 illustrates a method of executing a part function of the software according to an exemplary embodiment of the inventive concept; FIG.",
"5 illustrates a method of assembling software according to an exemplary embodiment of the inventive concept; FIG.",
"6A illustrates an exemplary data message that may be used in embodiments of the inventive concept; FIG.",
"6B illustrates an exemplary variable matching structure set that may be used in embodiments of the inventive concept; FIG.",
"6C illustrates examples of input and output arguments of exemplary computation functions; FIG.",
"7 illustrates a flow diagram showing execution of an part function of the assembled software according to an exemplary embodiment of the inventive concept; FIG.",
"8 illustrates a method of enabling a user to assemble software according to an exemplary embodiment of the inventive concept; FIG.",
"9 illustrates a method of executing a part function according to an exemplary embodiment of the inventive concept; and FIG.",
"10 illustrates an exemplary sequence of part functions being executed in response to an applied data message, according to an exemplary embodiment of the inventive concept.",
"DETAILED DESCRIPTION The inventive concept will be described in more detail with reference to the accompanying drawings, where exemplary embodiments of the present disclosure have been illustrated.",
"Throughout the drawings, same or like reference numerals are used to represent the same or like components.",
"However, the present inventive concept can be implemented in various manners, and thus should not be construed to be limited to the embodiments disclosed herein.",
"On the contrary, those embodiments are provided for the thorough and complete understanding of the present disclosure to convey the scope of the present disclosure to those skilled in the art.",
"A component-based software system and development method is described herein.",
"In the following description, numerous specific details are set forth in order to provide a more thorough understanding of the present invention.",
"However, it will be apparent to one skilled in the art that the present invention may be practiced without these specific details.",
"In other instances, well-known features have not been described in detail, in order to avoid obscuring the present invention.",
"In an embodiment of the invention, a software development method declares all application specific variables outside the code part (i.e., outside the computer functions) of the software in a special data structure referred to as the computation goal data message and its property sheet.",
"The method removes the coupling between computer functions that is prevalent in the prior art that prevents code reusability in the prior art.",
"In the method, computer functions are mutually independent so their reusability is increased.",
"The computer functions can also become pure algorithm functions that need not be related to any application so they can be used in any application.",
"This further increases the reusability of the computer functions.",
"The reusability is achieved by using a part function to implement mapping of variables in the computation goal data messages to arguments of the part functions and executing the part functions and mapping the computation results of the part functions back to the computation goal data messages.",
"The part function behaves like an organizer by assembling functions to achieve a computation goal.",
"The application specific information in software, application specific data variables and using them in computation, are implemented differently from the code (functions) and can be easily identified, understood and modified.",
"The code part of the software in an embodiment of the invention is pure algorithm functions and thus need not contain any application specific information.",
"Embodiments of the invention also provide the advantage of having all application specific variables being represented outside the code (in the CGDM, not mixed into the code) and directed into and from computations by VMS, which makes the software more easily understood, modified, and maintained.",
"The computer code devices (e.g., methods, classes, libraries) referenced herein may be stored on a data storage medium.",
"The term “data storage medium” as used herein denotes all computer-readable media such as compact disks, hard disks, floppy disks, tape, magneto-optical disks, PROMs (EPROM, EEPROM, Flash EPROM.",
"etc.",
"), DRAMs, SRAMs, and so forth.",
"FIG.",
"1 is a high-level diagram showing a method of assembling software according to an exemplary embodiment of the inventive concept.",
"The method includes enabling a user to code a computation function (CF) (S101).",
"For example, a CF graphical user interface (e.g., CF-GUI) including a text field may be provided by a computer program that enables a user to enter code for the CF.",
"For example, the CF-GUI may include a first button that when selected by the user, informs the program that the user has completed coding of the current CF.",
"As an example, a CF may be coded to perform a calculation, query to a database, or present a graphic or text on a webpage.",
"For example, the calculation could be used to perform a mathematical calculation on results returned by the query.",
"In an embodiment, each CF is given a unique name by the user and coded to receive one or more input parameters (herein referred to as CF input parameters) and to return an output parameter (herein referred to as a CF output parameter.",
"For example, the CF input and output parameters could be integers, floats, strings, arrays, pointers, etc.",
"The method then includes determining whether the user is done coding the CFs (S102).",
"For example, selection of the first button could indicate that the user desires to create another CF.",
"For example the CF-GUI may include a second button that when selected by the user informs the program that the user is done creating the CFs 50.The completed CFs can be stored in a CF database 60 so they are available to other coders.",
"The method next includes enabling a user to code a Part Function (PF) using one or more of the available CFs (S103).",
"For example, the program may present a second GUI (e.g., PF-GUI) with a selectable list of the available CFs stored in the CF database 60 in the GUI and a pane showing which CFs have been selected and their order of execution within the PF.",
"For example, the user can select one of the available CFs each time an instance of the corresponding CF is needed for the corresponding PF and insert the selected instance into the pane in an order the user desires the CF instance to be executed.",
"The method next includes the program determining when the user is done creating all the PFs (S104).",
"For example, the PF-GUI may include a graphical button that when selected by the user indicates the user is done creating all the PFs 70.The PFs 70 can be stored in a PF database 80 so they are available to other coders.",
"The method then includes the program enabling a user to create software using one or more of the available PFs 70 that are stored in the PF database 80 (S105).",
"For example, a computer program may be used to launch a third GUI that presents a text field to enable a user to enter connecting code and a selectable list of the available PFs 70.For example, the user can select a PF from the list to insert the corresponding PF into a certain location in the connecting code of the computer program.",
"In an embodiment, the computer program may be in a form that is interpreted by an interpreter.",
"FIG.",
"2 illustrates an exemplary computer system 1000 that may be used to implement the method of FIG.",
"1.Referring to FIG.",
"2, the computer system 1000 may include, for example, a central processing unit (CPU) 1001, random access memory (RAM) 1004, a printer interface 1010, a display unit 1011, a local area network (LAN) data transmission controller 1005, a LAN interface 1006, a network controller 1003, an internal bus 1002, and one or more input devices 1009, for example, a keyboard, mouse etc.",
"As shown, the system 1000 may be connected to a data storage device, for example, a hard disk 1008 via a link 1007.The above described GUIs may be presented on the Display Unit 1011.The above-described CFs 50, PFs 70, program, and assembled software may be stored on the memory 1004 and/or the hard disk 1008.FIG.",
"3 illustrates a method according to an exemplary embodiment of the invention that may be used to implement step S103 of FIG.",
"1 to code a PF.",
"Referring to FIG.",
"3, the method includes configuring a Part Function (PF) to receive an input of a Computation Goal Data Message (CGDM) (S301).",
"In an exemplary embodiment, a CGDM has i) input and output parts, ii) a name-value form (e.g., all values, substructures of values that will be assigned to a variable in any later computation should have name), and iii) its structure follows some syntax rules (e.g., HTML, XML, or JSON).",
"Two CGDMs are the same if i) both of their input and output parts have the same structures, and ii) all names in the structures are the same.",
"The CGDM is used as an argument of a PF.",
"Any PF can only have one argument.",
"A PF can process one or more than one CGDM.",
"Each CGDM has a VMSS corresponding to it.",
"A VMSS instructs a PF how to achieve the computation goal of a CGDM.",
"The names in CGDM may be referred to as working names, where they represent variables for the application data.",
"All PFs have the same interface.",
"For example, each Part Function is configured to be invoked with the CGDM, which may be referred to as an invocation parameter or an argument of the Part Function.",
"The CGDM includes Input parameters X (e.g., Input: X) and output Parameters Y (e.g., Output:Y), where X and Y can be any data structure that has a name (key)-value form.",
"In the X part, the names have values, and the Y part's values are blank to be filled by the Part Function.",
"Two CGDMs are the same if both their Input Parts and Output Parts have the same structures and all names (keys) in the structures are the same.",
"Each CGDM has a unique name.",
"A CGDM with values of all names (keys) of its Input Part set is called an instance of the CGDM.",
"A PF returns a data structure the same as the Output part of the CGDM with values filled.",
"A PF accepts any CGDM as an argument.",
"A PF contains one or more Computation Functions (CFs).",
"Any function can be a CF.",
"A PF can accept any CGDM as an argument because how a PF executes the CFs is not determined by the CGDM only, but also by a data structure called a Variable Matching Structure (VMS).",
"A PF executes a CF through a CF Caller.",
"A CF Caller accepts a CGDM, a VMS and a CFResults structure as arguments.",
"It provides a uniform interface for the PF to call.",
"A CF Caller: i) prepares the arguments of the CF and a call according to the CGDM and VMS, ii) sets the output part of the CGDM according to the CGDM and VMS, and iii) saves the result to CFResults for possible use by later CF execution.",
"In an embodiment of the invention, two types of CF functions may be present, i) a Complete CF and ii) a Partial CF.",
"A Complete CF does not call a PF, and has the interface requirement completely done.",
"A Partial CF calls a PF, and has the interface requirement partially done.",
"How the interface requirement is done depends on what PF is called, and what the PF is configured to do.",
"The VMS maps data between CFs and CGDM, so the CFs has no direct relation with the CGDM, that is no relation with application data variables.",
"The CFs can be pure algorithm functions.",
"The VMS separates a CF from a CGDM, if the CGDM is sent by a partial CF, the CFs processing the CGDM are also not bound to the partial CF.",
"There is no calling actions between any CF, so there is no coupling between CFs and they are mutually independent of one another and each CF can be independently developed to implement an algorithm without being aware of the other algorithms.",
"When a CF calls a PF, it prepares a CGDM, and passes the CGDM as an argument to the called PF.",
"The naming of values in the CGDM may follow a Consistent Naming Rule.",
"The names of PFs a CF calls and names of the CGDMs it creates can be specified in the VMSs of the CF.",
"The VMSSs provide control for connecting the CFs, the Partial CF provide control for connecting the PFs.",
"Software can be formed by manipulating VMS and VMSS for connecting the PFs and the CFs according to a given design.",
"For one CGDM, we call the execution sequence of all PFs (may involve more than one PF) and CFs to achieve the computation goal of the CGDM the Computation Structure of the CGDM.",
"FIG.",
"6A is an example of a CGDM that could be passed as an argument to a Part Function.",
"In this example, the CGDM has a JavaScript Object Notation (JSON) format.",
"The CGDM includes one or more input key-value pairs and an output key-value pair.",
"The CGDM may include identifiers that can be used by a parser or an interpreter to extract the input and output key-value pairs.",
"In the example shown in FIG.",
"6A, an input parameter identifier in a CGDM is entitled ‘Input:’ and an output parameter identifier is entitled ‘Output’.",
"For example, after a parser parsing a CGDM recognizes an identifier of ‘Input’, the parser can assume that the next elements located between a next open brace ‘{’ and closed brace ‘}’ are key-value input parameter pairs.",
"For example, after a parser parsing the CGDM recognizes an identifier of ‘Output’, the parser can assume that the next elements located between a next open brace ‘{’ and closed brace ‘}’ are key-value output parameter pairs.",
"For example, the key-value pairs may be separated by a semicolon ‘;’, and a key and value of a given key-value pair may be separated by a colon ‘:’.",
"While FIG.",
"6A shows use of the term ‘Input:’ to denote input parameter key-value pairs, use of the term ‘Output’ to denote output parameter key-value pairs, use of the term ‘{’ to denote the beginning of key-value pairs, use of the term ‘}’ to denote the end of key-value pairs, and use of the term ‘:’ to enable a parser to distinguish a key from a value, the invention is not limited thereto.",
"For example, these terms may be changed to other words or symbols, as desired by the implementer.",
"Referring back to FIG.",
"3, the method includes determining whether the user desires the Part Function to call a new instance of a Computation Function (CF) (S302).",
"A new instance means that this is the first time a specific CF has been requested for insertion or the requested insertion would cause an instance of a CF (e.g., CF2) to be inserted after a different CF (e.g., CH).",
"For ease of explanation it is assumed that only a first Computation Function CF1 and a second Computation Function CF2 as shown in FIG.",
"6B are available.",
"If the user has requested a new instance of a CF, the method inserts a label to identify the particular CF (S303).",
"For example, since the user has requested that the first Computation Function CF1 be used, the method inserts a label such as ‘CH’ into a variable matching structure sequence (VMSS) to identify that the first computation function CF1 is to be called.",
"The VMSS, when completed, will include a sequence of pairs, where each pair includes a name of a given CF (e.g., CF1) and a VMS (e.g., CFName, VMS).",
"For example, a completed VMSS could include pairs: ({CF1, VMS1}, .",
".",
".",
", {CFN, VMSN}}, where N is 1 or more.",
"A VMSS is associated with a CGDM, and all VMSs in a VMSS completely fill all names' (keys') values of the CGDM.",
"That is, the VMSS fulfills the computation goal for the CGDM.",
"A VMSS instructs a PF how to achieve the computation goal for the CGDM.",
"Next, the method includes enabling the user to configure a variable matching structure (VMS) that maps input parameters of a CF instance to input parameters within the CGDM and maps output parameters of the CF instance to output an output parameter within the CGDM (S304).",
"A VMS instructions a PF how to execute one CF.",
"For example, FIG.",
"6B shows an example, of a first VMS 601 being configured for a first CF1 611 with a plurality of key pairs, where each key pair is separated by a semicolon ‘;’.",
"For example, the first key ‘a’ in the first key pair ‘a:x’ of the first VMS 601 corresponds to the first input parameter ‘a’ of the first CF1 611 and the second key ‘x’ in the first key pair ‘a:x’ corresponds to the second input parameter ‘x:2’ of the CGDM 600 shown in FIG.",
"6A.",
"For example, the first key ‘b’ in the second key pair ‘b:y’ of the first VMS 601 corresponds to the second input parameter ‘b’ of the first CF1 611 and the second key ‘y’ in the second key pair ‘b:y’ corresponds to the third input parameter ‘y:3’ of the CGDM 600 shown in FIG.",
"6A.",
"For example, the first key ‘c’ in the third key pair ‘c:z’ of the first VMS 601 corresponds to the output parameter ‘c’ of the first CF1 611 and the second key ‘z’ in the third key pair ‘c:z’ corresponds to the output parameter ‘z:NULL’ of the CGDM 600 shown in FIG.",
"6A.",
"FIG.",
"6C illustrates examples of calls to the CFs.",
"In the case when an argument of a CF is a composite type, if it maps to a same composite type in the Input part of the CGDM, if we assume the argument's name is C and the name of the same type (a sub-structure of the Input part of the CGDM) is D, the mapping can be specified as ‘C:D’.",
"If it does not map to a same composite type in the Input part of the CGDM and its members map to names distributed in the Input part of the CGDM, mapping for each member of the composite type needs to be specified.",
"If we assume the composite type is T and the names in the Input part of the CGDM are d1, d2, .",
".",
".",
", the mapping can be specified as ‘C, T(‘member1:d1’, ‘member2:d2’.",
".",
".",
")’.",
"If C is an array type, the mapping can be specified as, ‘C: Array[d1,d2, .",
".",
".",
"]’.",
"Next the method inserts the configured VMS into the VMMS associated with the Part Function CF (S305).",
"The VMS is inserted so that a parser can recognize that it is associated with the identified CF.",
"For example, the first VMS 601 shown in FIG.",
"6B below label ‘CF1’ is an example of a VMS configured for a PF being inserted into a VMSS and associated with the first Computation Function CF1.The method then includes determining whether the user is done (S305).",
"For example, a GUI may be used by the user to select Computation Functions (CFs) and to indicate that they are done entering Computation Functions (CFs).",
"If the user selects another Computation Function (CF) or another instance of the previously selected Computation Function (CF), the method proceeds to step S302.For example, if the user were to enter another instance of the same CF (e.g., CF1 again), and send the CF different parameters of the CGDM, the method would proceed to step S304.For example, this could result in insertion of the second VMS 602 under the same label (e.g., CF1) that identifies the first Computation Function CF1.However, if the user selects a new Computation Function (e.g., CF2 612), it could result in insertion of the second label (e.g., CF2) and the third VMS 603, as shown in FIG.",
"6B.",
"Except taking values from the Input of the CGDM, a CF's argument can also take a value from the results of one or more previously executed CFs.",
"For example, when a PF executes a first CF, it can store a result of executing the CF into a data structure (e.g., CFResults structure) or list that is internal to the PF, so that if the PF re-executes the same first CF or a second CF, the result is available to either CF so that the corresponding CF can operate on the result if necessary.",
"As shown in FIG.",
"7, when a PF 701 is called through a PF Call, the PF 701 executes a CF through a CFCaller function.",
"The CFCaller function may be loaded from an external storage region 702 (e.g., CFCaller Store) that stores a plurality of available CFCaller functions.",
"A CFCaller function takes the CGDM, a VMSS 703 associated with the CF and the CFResults structure 704 as input.",
"The VMSS 703 may be loaded from an external storage region 705 (e.g., VMSS Store).",
"The CFCaller function performs the following: 1) declares the arguments of the CF and initializes each argument using the VMSS 703, the CGDM, and CFResults within the CFResults structure 704; 2) executes the CF with the arguments; and 3) adds the results to the CFResults structure 704 and sets the Output of the CGDM (e.g., CGDM.output) according to the VMSS 703.In an embodiment, each CF has an associated CFCaller function and each CF has the same interface.",
"The VMSS Store contains all the VMSS for all the CGDM the PF is called with.",
"The CFCall Store contains the CFCaller functions associated with all the CFs the PF contains.",
"FIG.",
"4 illustrates a method for executing a PF Call for a received CGDM according to an exemplary embodiment of the invention.",
"The method includes: clearing the CF Results structure 704 (S401); using the name of the CGDM to retrieve the corresponding VMSS 703 from the VMSS Store 705 (S402); for each element in the VMSS 703, using the name part of the element to retrieve the CFCaller function from the CFCaller Store 702 and call the retrieved CFCaller function with the VMS part of the element, the CGDM, and the CF Results structure 704 (S403); make a copy of the output of the CGDM (now filled with values) (S404); and return the copy (S405).",
"A CF can call others PFs.",
"The way to do it is to create a CGDM and pass the created CGDM as an argument to the call.",
"If a CF passes a value in the CGDM it computes to the CGDM it creates, the CF should use the same name as in the CGDM it computes.",
"If a CF passes a value in the CF Results structure 704 to the CGDM it creates, it should use the same name as in the CF Results structure 704.This is called a Name Consistent Rule.",
"When a CF creates a CGDM to call another PF it should follow the Name Consistent Rule.",
"Because all PFs have the same interface, the difference of calling different PFs is only by names.",
"PF name arguments can be added for a CF for all PFs it calls, then which PFs it calls can be specified in the VMS of the CF.",
"Also the names of the CGDMs it creates can be specified in the VMS.",
"So what PFs a CF calls and what CGDM names it uses can be determined after development of the CF.",
"In an embodiment, all data storage parameters are in the name (key)—value form.",
"The data storage format can have different syntax rules with the CGDM.",
"The names in the data storages and the CGDMs may be created by different users and at different times, and therefore may not be consistent.",
"A set of name-values are called consistent if the same names in the set describe the same semantic meaning for the named values and the different names in the set describe the different semantic meaning for the named values.",
"A set of consistent name-values forms a Name Space (NS).",
"A PF and its CFs need to operate in one NS.",
"If the CGDMs and data storages are not in one NS, a conversion can be applied to the CGDMs to convert them into one NS.",
"For one CGDM, we call the execution sequence of all PFs and CFs to achieve the computation goal of the CGDM.",
"FIG.",
"5 illustrates a software development process according to an exemplary embodiment of the invention.",
"The process includes: converting all input and output requirements of the software into the CGDMs format (S501); designing the computation structure of each CGDM generated from the converting, marking the CGDM with a markup rule, creating a new markup rule is necessary, and marking the CGDM with the new markup rule using a Property Sheet, if necessary (S502); designing the data storage to support the designed computation structures (S503); selecting existing PFs and/or CFs; developing new PFs and/or CFs, if necessary, if new markup rule is added, developing new CFCallers for the CFs involved (S504); and creating VMSs and VMSSs to connect the developed and/or selected PFs and CFs (S505).",
"In an embodiment, step S505 is implemented by calling a CGDM without the values of the Input Part, i.e., the Name Instance (NI) of the CGDM.",
"The NI is the CGDM with both the Input and Output parts without values.",
"In an embodiment, each CF that calls other PFs has Developing Mode (DV) processing.",
"In DV, the CG takes a NI of the CGDM it computes and outputs the NIs of all CGDMs it creates for the CGDM it computes to a persistent data storage (e.g., like a file).",
"The output NIs specifies the contents of CGDMs of the called PFs.",
"The VMSs and VMSSs can be created accordingly.",
"FIG.",
"8 illustrates a method of generating software using one or more of the available Part Functions (PFs), according to an exemplary embodiment of the inventive concept.",
"The method includes: querying a user to select a PF from available PFs (S801); query user to enter input name (key)-value pairs and an output key-value pair (S802); format a CGDM based on the entered data (S803); insert PF call with formatted CGDM as input argument (S804); determining whether the user is done making PF calls (S805).",
"If the user is not done, the method proceeds to step S801 to query the user to select a new PF.",
"If the user is done, the method terminates.",
"FIG.",
"9 illustrates a method of interpreting software including a PF call according to an exemplary embodiment of the invention.",
"The method includes parsing the PF call to identify a given PF and a CGDM passed to the PF call as an argument (S901).",
"The method then includes loading a VMSS associated with the identified PF and identifying input key-value pairs and output key-value pairs within the identified CGDM (S902).",
"The method then includes parsing a next line of the loaded VMSS (S903).",
"The method then determines whether the parsed line includes a CF label (S904).",
"For example, if the next line is the first line of the VMSS depicted in FIG.",
"6B, then the method would conclude that it has identified a CF label of CF1.If it is determined that a CF label has been identified, the method identifies a particular CF to call from the determined CF label, and parses the next line of the VMSS.",
"Then if the method determines that the next line is not a CF label (i.e., the next line corresponds to a VMS), the method matches the first key of a current key pair of the VMS to a selected I/O parameter of the identified CF, and matches the second key of the current key pair to a selected I/O key of the CGDM (S906).",
"For example, if VMS 601 is parsed, and the current key pair parsed is ‘a:x’, and the identified CF is CF1 611, then the method matches first key ‘a’ of current key pair ‘a:x’ to input parameter ‘a’ of CF1 611, and matches second key ‘x’ of the current key pair to Input key ‘x’ of the Input parameter x:2 of CGDM 600.Then, the method includes formatting a call to the identified CF such that the selected I/O parameter of the CF is passed a value of the selected I/O key (S907).",
"For example, input parameter ‘a’ of CFL1 611 is passed value ‘2’ since ‘first key ‘a’ is matched to ‘x’ and x is set to 2 (e.g., ‘x:2’).",
"The method then repeats these matching steps for every key pair of the VMS.",
"The method determines whether it has parsed the last key pair of the VMS to determine whether it is done (S908).",
"If the method is not done it advances to the next key pair of the VMS, by proceeding to step S906.If the method is done, it proceeds to step S902 to parse the next line of the VMSS to find either a new CF label or another VMS under the previously identified CF label.",
"While FIG.",
"6A shows use of a JSON format for a CGDM, the invention is not limited thereto.",
"For example, the JSON format can be replaced with a HyperText Markup Language (HTML) format or an Extensible Markup Language (XML) format.",
"We define a Markup Rule as the Rule to expand the content of a CGDM using the CGDM's syntax rules such that for any input instance of the algorithm there is an expanded content corresponding to it, and the input instance and its full data features can be deducted from the expanded content.",
"A Markup Rule is associated with an algorithm.",
"In an embodiment of the invention, input data messages to the software are in the HTML format, the CGDM are in the JSON format, and the data storages are relational databases, which enables a web development environment.",
"The Part Functions that handle input run in a web browser, and may be referred to as frontend Part Functions.",
"The Part Functions that run a server side may be referred to as Backend Part Functions.",
"The Backend Part functions may be connected to a database.",
"The CFs can be analogized to computer chips with their arguments as input and output pins of these chips.",
"The CGDM can then be analogized to a data bus with names in the name-value pair as lines of the data bus.",
"The data bus has two directions of data flow, the input and output.",
"Computations are achieved by connecting the chips (i.e., the CFs) to the data bus.",
"The software development can then be like hardware development.",
"For example, the software can be developed by dragging and dropping CFs (chips) and drawing lines between the CGD (data bus) and the CFs (chips).",
"In an embodiment, hardware could be developed from this concept, where the hardware includes a plurality of computer chips connected to a common data bus, and each computer chip includes a processor or microprocessor that implements a given CF.",
"One PF processing HTML input can be one that handles linear cascade inputs.",
"An example, of the linear cascade inputs is the inputs for selecting state, then selecting county, and then selecting city.",
"The inputs are a list of <select>s and a current selection, the output is the next option array.",
"The markup rule can be any rule that expresses a list.",
"An example, of the markup rule is, mark the first list as<select Cascade=“cs1” cs1=“1” mName=“name1” .",
".",
".",
">, mark the second list as<select Cascade=“cs1” cs1=“2” mName=“name2” .",
".",
".",
">, the third<select Cascade=“cs1” cs1=“3” mName=“name3” .",
".",
".",
"> and so on.",
"The Cascade is the computation name, Cascade=“cs1” declares an instance cs1, cs1=‘n’, the n declares the position in the list.",
"The PF is triggered by the onSelect event of the <select> elements.",
"The same onSelect event handler cascadeHndler is set for all <select>.",
"The cascadeHndler is the Part Function that handles this type input and output requirements.",
"The handler's algorithm is: Get instance name from Cascade=”instance_i”; Get position number from instance_i=”n”; Get selected value v and name n1 of the current <select> Get name n2 of the next <select> Send a data message of the form {{ “input”: {“n1” : v} }, { “output”: { [{“n2”:0}]} }} to a backend component Set return result to the next <select> Any number cascade input of any length and with any application meanings in one HTML data message can be handled by this Part Function.",
"It can be assumed that the Part Function contains only one CF that implements the algorithm mentioned above.",
"The Part Function implements a pure cascade and it is not related the application meaning assigned to the cascade.",
"For example, either it's Country-State-County or Grade-Class-StudentName.",
"A cascade implementation with smaller function granularity is given later.",
"Another case of input is referred to as star cascade input, where the options of some <select> s is decided by one <select>, like the case where the available size and color options is decided based on which cloths have been chosen.",
"For the center mark <select star=“star1” star1=“name list of all end select node”>.",
"No end node <select> is needed to be marked.",
"When the selection of the center <select> is done, a data message of the form, { {“input”: {“centerName” : “v”} }, { “output”: { [{“n1”, “”}], [{“n2”, “”}], ... }} } is sent to the backend, where n1 and n2 are the name of end nodes.",
"When the returned values are not arrays but a single value and the end nodes are text or number inputs, this becomes auto-fill, like a customer's name is chosen, its address is auto-filled.",
"Input suggestion handling is the reverse operation of auto-fill.",
"Except the current input value and some other input values can restrain options of the current input, like the department and position inputs restrain the employees' name input suggestion.",
"When the current input value is text, with respect to the suggested values it may have more than one interpretation, for example it may mean the suggested values start with this text or contain the text.",
"So further information needs to be provided for the value { {“input”: { {“otherValues1”: “v1”}, {“otherValues2”: “v2”}, {“currentValue”: { {“value”: “v3”}, {“type”: “LIKE”} } } ... }, { “output”: { [{“n1”, “”}] } } }, where n1 is the current input element's name.",
"Ranges input can also be implemented having a markup rule such as, the first element <input rangeInput=“ri1” ri1=“1” .",
".",
".",
">, the second element<input rangeInput=“ri1” ri1=“2” .",
".",
".",
"> or for selection inputs the first element <select rangeInput=“ri1” ri1=“1” .",
".",
".",
">, the second element<select rangeInput=“ri1” ri1=“2” .",
".",
".",
">.",
"The algorithm is before accept current input check if it satisfy the constrain set by the other input or one input restrain the options of the other input.",
"Because of the input format choices there may exist a few different type range input, like date range input, selection range input, numerical value range input.",
"A form contains some number of different types of input elements (text, numerical, list options, range input, cascade input .",
".",
".",
").",
"The action of form submit is to collect (name, value) pair for all element.",
"The markup rule for form submission is defining a type symbol for each type of input element.",
"Different type means the name value access needs to use different ways.",
"Mark each input element for its proper type.",
"The algorithm for the form submission is: For each type { Get all input element for the type For each input element of the type { Get the name and value, pack the name value into JSON format. }",
"} mark the data message as ADD or MODIFY send the JSON data message to a backend address A form submission can either be an ADD of new data or MODIFY the old data.",
"For modification the data are first loaded from backend, with some extra data, the keys or reference numbers.",
"Then the data are modified and send to backend.",
"The extra key data can be handled by a similar mechanism such as cookies.",
"One implementation of cookies is to use some hidden elements of the HTML with special tags.",
"For adding new data, this extra key data is not used.",
"So the PF for form submission can distinguish between modify and add.",
"A form PF can handle form submission of any forms with any number of input elements of the defined types.",
"A search page contains one or more data input elements as search conditions, and a two dimensional data grid to display the search results.",
"Each column of the data grid can be named.",
"For submission of a data search, the JSON data message send to backend has two parts, the search condition part and data grid part of empty two dimensions array part as shown: { {“input”:{ {“name1”: “value1”}, {“name2”: { {“Max”: {“value”: “v2”, “EQUAL”: “true”}}, {“Min”: {“value”: “v3”, “EQUAL”: “false”}} } }, ... }, {“output”: { [[{name4:0}, {name5:0},...]] }} }, where name2 specifies range values input, EQUAL is true means <= pr >= and false means < or >.",
"The search condition part can be named and marked types and packed up the same way as form for ADD.",
"One embodiment of the backend is to choose the relational database as the data storages and the data messages received and sent between data messages are in JSON format.",
"For PFs that need to interact with a relational database, database schema names need to be used.",
"For working names in the data message that correspond to a database schema names, they are converted to a database schema name.",
"A column name of a table is in the form tableName.columnName.",
"The PF that handles insertion in a single table can be implemented with a CGDM as follows: {“input”: { {“column1”: “table1.column1”}, {“column2”: “table1.Column2” }, {“column3”, “table1.Column3” }, ... } } For insertion into one table, each column is treated the same by the SQL insert statement, so there is one type of data.",
"The CGDM that handles such insertion becomes, { input: { {“table1.column1”, “”}, { “table1.Column2”, “” }, { “table1.Column3”, “” }, ... }} For insertion into a master-detail table, the CGDM is, {“input”: { {“Master”: { { “table1.column1”: “”}, { “table1.Column2”: “”}, { “table1.Column3”: “”} ... }} { “Detail”: { [{“table2.column1”: “”}, { “table2.Column2”: “” }, { “table2.Column3”: “” },...] }} }}, where the CGDM includes data for the master table and an array of data for the detail table.",
"The PF that handles update into one table has a CGDM as follows: {“input”: { “primarykey”: { { “table1.column1”: “”}, { “table1.Column2”: “”}, ... } }, {“values”: { { “table1.Column3”: “” }, { “table1.Column4”: “”}, ... }} } The PF that handles update into a master-detail tables has a CGDM as follows: {“input”: {{“m_Primarykey”: { { “table1.column1”: “”}, { “table1.Column2”: “”}, ... } }, {“m_values”: { { “table1.Column3” : “”}, { “table1.Column4” : “”}, ... } }, {“d_Primarykey”: { { “table2.column1” : “”}, { “table2.Column2” : “”} ... } }, {“d_values”: { { “table2.column3” : “”}, { “table2.Column4” : “”} ... } }, {“d_data”: { [{“table2.column1” : “”},{ “table2.Column2” : “”},..., { “table2.Column3” : “”},{ “table2.Column3” : “”}...] } }} } For the below examples, it is assumed that an SQL select statement takes as form such as Select [A: output section] from [B: table section] where [C: conditions section] group by [D: aggregation section] having [E: aggregation condition] order by [F: order section].",
"The data for its input and output are divided into six sections.",
"We assume the section A contains the columns of the tables that appear in the section B or SQL function on the column of the tables that appear in the section B; the section B contains tables and join relations; the section C contains condition of the form column=value or column>(=)value or column<(=)value, column LIKE value SQLFunction(column) in the same relations; the section D contains column of SQLFunction(column); the section E contains columns of SQLAggregateFunction(column)=or <(=) or >(=) values; and the section F contains columns.",
"The tables and their join relation information needed in the section B can be obtained from the schema of the database, but the join type information should come from application.",
"An array structure can be chosen to represent the relation between two tables in the CGDM of the PF that implement this select statement.",
"The CGDM of this select statement is, {{“input”: {{“requirement”: { [{ “tableA.column8”: “tableA.column8”}, { “total1”: { “tableB.column4”: { “FUNC”: “SUM” }} }, ...]} }, {“table”: { {[ “tableA”, “tableB”, “joinType”, “tableA.column1= tableB.column2”, “tableA.column3= tableB.column4”, ...], [ “tableC”, “tableD”, “joinType”, “tableC.column1= tableD.column2”, “tableC.column3= tableD.column4”, ...], ...}} }, {“condition”: { { “tableA.column5”: “v1”}, //default to tableA.column5= v1 { “tableB.column1”: { “value”: “v2”, //default to SUM(tableB.column1)=v2 “FUNC”: “SUM” } }, ...} }, {“groupby”: [ “tableA.column6”, { “tableB.column2”: { “FUNC”: “DATE” } }, ...] }, {“having”: { { “tableB.column3”: { “value”: “v3”, “FUNC”: “MAX” } }, ...} }, {“orderby”: [ “tableA.column7”, ...] } }}, {“output”: {“results”: [{ “tableA.column8”: ‘’}, { “total1”: ‘’}, ...]} }} The input.requirement is corresponding to section A of the SQL select and specify the output of the SQL select.",
"It specifies an array format.",
"The {“tableA.column8”: “tableA.column8”} means to get tableA.column8's value and set to the name “tableA.column8”.",
"The pair { “total1”: { “tableB.column4”: { “FUNC”: “SUM” }} } means apply SUM function column tableB.column4 and apply the value to the name “total1”.",
"For the implementation of using more than one PFs to achieve a backend computation task consider the case of operation of shipping of sales orders, as shown in FIG.",
"10.Assume a sales order can be partially shipped (because of partial payment or constrain of inventory), so a sales order may need to be shipped more than one time.",
"The incoming CGDM is as follows: { “Order_Shipment_Data” : {“input”: { { “orderID”, “value1”} }}, {“output”: { {“order_info”: { {“orderCode”:””}, {“salesmanName”:””}, {“customerName”:””} }}, {“order_prod_info”: { [[{“productName”:””}, {“productionDate”:””}, {“Quantity”:””},{“shippedQuantity”:””}, { “quantityLeft”:””}]] }} }} } The input is the order id, the required output includes some order info, a order code, salesman name and customer name, and a list of product information, product name, product date, order quantity, shipped quantity and quantity left to be shipped.",
"In FIG.",
"10, the CGDM is received by the DataExpander PF 10.The DataExpander PF 10 connects to a relational dataset 12.A working name space mapping WNSM 100 for the CGDM is as follows: { {“orderID”, “order.id”}; { “orderCode”, “order.code”} { “salesmanName”, “employee.name” } {“customerName”, “customer.name”} {“productName”, “product.name”} {“productionDate”, “product.productionDate”} { “Quantity”, “order.Quantity” } } After mapping the CGDM becomes as follows: { “Order_Shipment_Data” : {“input”: { “order.id”, “value1”} }, {“output”: { {“order_info”: { {“ order.code”: “”} {“ employee.name”: “”}, {“ customer.name”: “”} }}, {“order_prod_info”: { [[{“product.name”: “”}, {“ product.productionDate”: “”}, {“ order.Quantity”: “”},{“shippedQuantity”: “”}, { “quantityLeft”: “”}]] }} }} } The PF 10 has two CFs, Select and Packer.",
"The Select CF runs three instances, 102, 104, and 106.The Packer CF runs one instance 108.The Select does the type SQL select of the above example to a relational database, the Packer CF packs all its inputs into a corresponding input and output parts of a data message (e.g., a CGDM) and sends the data message to a Loop PF 14.The PF 14 has one CF called KeyMatchLoop which runs one instance that takes arrays A and B, as inputs, and outputs an array C. Each element in A, B and C has a key part and a value part.",
"The key of an element is a sequence of name-values.",
"Two keys are the same type if the length of the name value sequence of the two keys are the same and for the two name-value pairs of each position of the sequence the names are the same.",
"Two keys are equal if they have the same type and the values of the corresponding names are equal.",
"A and B have the same type of key.",
"The algorithm of KeyMatchLoop is, For each element a of A Create an element c with key part same as a if there is an element b of B with a.key==b.key if there is an element b of B with a.key==b.key } value part of c is computed from value parts of a and b by computation rule 1.}",
"else { value part of c is computed from value parts of a and b by computation rule2.}",
"add c to The computation rule1 and computation rule2 are done by the Calculator PF 16.The PF 16 has 3 computations, the Equal, Zero and Minus.",
"The CGDM of Order_Shipment_Data for PF 10 is, {“Order_Shipment”: {“Select.order”: { { “input”: { { “requirement”: { {“order.code”: “order.code”} {“salesman.name”: “salesman.name”}, {“customer.name”: “customer.name”} }}, { “condition” : { {“order.id”, “Order_Shipment_Data.input.",
"‘order.id’” } }}, { “table” : { {[“order”, “salesman”, “inner join”, “order.",
"salesmanID= salesman.id”], [“order”, “customer”, “inner join”, “order.",
"customerID= customer.id”]} }} }}, { “output”: { “result”: “Order_Shipment_Data.output.order_info”} }} }}, {“Select.orderProduct”: { { “input”: { { “requirement”: { [{“product.name”: “product.name”}, {“production.date”: “production.date”}, {“order_product.quantity”: “order_product.quantity”}] }}, { “condition” : { { “order_product.orderId”, “Order_Shipment_Data.input.‘order.id’” } }}, { “table” : { [“order_product”, “product”, “inner join”, “order_product.productId=production.id”] }} }}, { “output”: { “result”: “”} }} }} {“Select.shipped”: { { “input”: { { “requirement”: { {“product.name”: “product.name”}, {“production.date”: “production.date”}, { “shippedQuantity”: { “shipment.Quantity”: { “FUNC”: “SUM” }} } }}, { “condition” : { {“shipment.orderid”,“Order_Shipment_Data.input.‘order.id’” } }}, { “table” : { [“shipment”, “product”, “inner join”, “shipment.productID= product.id”] }} { “aggregate” : { [“product.name”, “product.productiondate”] }} }}, { “output”: { “result”: “”} } }} {“packer”: { {“input”: { {“In”: { {“A”: “Select.orderProduct.output.Result”}, {“B”: “Select.shipped.output.Result”} }}, {“Out”: {{“C”: “Order_Shipment_Data.output.order_prod_info”}}} }}, {“output”: { {“result” : “Order_Shipment_Data.output.order_prod_info”} }} }} } The order_prod_info of output part of the data message Order_Shipment_Data is used as input to generate the output part of the data message the PF 10 sends to the PF 14.The PF 10 sends a data message Order_Shipment_Data_Full to PF 14, {“Order_Shipment_Data_Full”: { {“input”: { {“A”: [[{“product.name”: “v1”}, {“product.productionDate”: “v2”}, {“order_product.quantity”: “v3”}]]}, {“B”: [[{“product.Name”: “v4”}, { “product.productionDate”: “v5”}, {“shippedQuantity”: “v6”}]]} }}, {“output”: { {“C”: [[{“product.Name”: “”}, { “product.productionDate”: “”}, {“order.Quantity”: “”},{“shippedQuantity”: “”},{ “quantityLeft”: “”}]]} }} } } The CGDM of the data message Order_Shipment_Data_Full for the PF 14 is.",
"{“Loop”: { {“input”: { {“A”: {“Order_Shipment_Data_full.Input.A”, {“key”:[“product.name”, “product.productionDate”]}, {“value”:{ { “shippedQuantity” } }] }, {“B” : {“Order_Shipment_Data_full.Input.B”, {“key”:[“product.name”, “product.productionDate”]}, {“value”:{ {“order_product.quantity”} }] }, { “C” : [“Order_Shipment_Data_full.output.C”, {“key”:[“product.name”, “product.productionDate”]}, {“value”:{{“order_product.quantity”},{“shippedQuantity”},{“quantityLeft”}}] } }}, {“output”: { “result”: “Order_Shipment_Data_full.output.C”} } } } The PF 14 send two data messages to the PF 16, {“Order_data”: { {“input”: { {“A”:{ “order_product.quantity”: “v1”}} }}, {“output”: { {“C”:{{“order_product.Quantity”: “”},{“shippedQuantity”: “”},{ “quantityLeft”: “”}}} }} } } {“Order_Ship_data”: { {“input”: { {“A”: { “order_product.quantity”: “v1”}}, {“B”: {“shippedQuantity”: “v2”}} } {“output”: { {“C”: {{“order_product.quantity”: “”},{“shippedQuantity”: “”},{ “quantityLeft”: “”}}} }} } } The CGDM for Order_Ship_data is.",
"{“Order_Ship_Data”: { {“Equal.quantity”: { {“input”: { “X”: “A.order_product.quantity” }}, {“output”: { “Y”: “C.order_product.quantity” //Y=X }} } }, {“Equal.",
"quantityLeft”: { {“input”: { “X”: “A.order_product.quantity” }}, {“output”: { “Y”: “C.quantityLeft” }} } } {“Zero”: { {“output”: { “X”: “C.shippedQuantity” //X=0 }} } } }} The CGDM for Order_data is as follows: {“Order_Data”: { {“Equal.quantity”: { {“input”: { “X”: “A.order_product.quantity” }}, {“output”: { “Y”: “C.order_product.quantity” }} } }, {“Equal.shippedQuantity”: { {“input”: { “X”: “B.shippedQuantity” }}, {“output”: { “Y”: “C.shippedQuantity” }} } }, {“Minus”: { {“input”: { {“X”: “A.order_product.quantity”}, {“Y”: “B.shippedQuantity”} }}, {“output”: { “Z”: “C.quantityLeft” //Z=X−Y }} } } }} The output part of the data message Order_Shipment_Data are formed by the output part of the CF instance 106 and the CF instance 108.It can then be reversely mapped to the working name space of the incoming data message Order_Shipment_Data and send to the sender of the Order_Shipment_Data.",
"An exemplary embodiment of the invention makes use of markups and a property sheet of a CGDM.",
"While this embodiment will be discussed below with respect to a linear cascade, the invention is not limited to any particular organization of data.",
"A linear cascade is a list of <select> elements that, starting from the first element and except the last element, the selected value of one <select> element determines the options of the next <select> in the list, One example of the linear cascade inputs is the Country-State-City inputs, which enables a user to select a country from the Country's options, determines the options of the State, enables a user to select a state from the State's options, and determines the options of the City.",
"In a browser implementation Country, State and City each represented by a <select> element.",
"An event handler for Country is attached to the Country <select> element, an event handler for State is attached to the State <select> element.",
"For example, when a country such as “USA” is selected, the event handler of Country is called, and the event handler gets the value of “USA” and creates a message of {Country=“USA”, State[]} and sends the message to a backend process to get all states for “USA” and store the values in the State[].",
"The values of State[] is then set to the <select> representing State.",
"The event handler for State and City are similar.",
"In an embodiment of the invention, the cascade is represented by as a list data structure, where each element of the list has five members, namely ID, Next, SelectedValue, eventHandler and Options.",
"The ID holds the name of the element, the Next has the value of the Name of the next element of the list, the SelectedValue holds the selected values, the eventHandler holds the event handler function of the element and the Options holds a set of values.",
"An action of selecting a value from the Options and setting the SelectedValue can be done to the element of the list.",
"When the action is done, the function in the eventHandler is called by passing the element as the argument.",
"The algorithm is abstract because the IDs can take any names.",
"They can be Country, State, City or Company, Department, Employee Name or Category, Type, Product Name.",
"The algorithm is generalized because any number of elements is allowed.",
"Next, the list structure is marked on the HTML.",
"Except ID and Next, the <select> element has all others.",
"In our definition of CGDM, each value should have a name, so on a CGDM, only the Next is needed.",
"We assume the name of value is implemented by adding an ID property to all elements of the HTML tag.",
"The Markup Rule for the cascade is for each <select> element add a Next property and its value is the ID′ value of the next <select> in the cascade.",
"More than one cascade in one HTML page is allowed.",
"In general, the Markup Rule is defined as the Rules to expand the content of a CGDM using the CGDM's syntax rules such that for any input instance of the algorithm there is an expanded content corresponding to it and the input instance and its full data features can be deducted from the expanded content.",
"A Markup Rule is associated with an algorithm.",
"The PF function maybe the event-handler of the selection event for all the <select> elements, even in a different cascade.",
"In this example, we give the PF the name cascadePF.",
"The inputs of the cascadePF are the selected value and the <select> element that generate the event.",
"A Document Object Model (DOM) structure of the whole HTML is also accessible to the cascadePF.",
"The CGDM of the PF can be considered as CGDM={{the selected <select> element}, DOM} with the input part being {{the selected <select> element}, {All <select> element of the cascade}} and the output part being {{the next element of the selected <select> element}}.",
"Because all cascades, even in different HTML pages, use the same cascadePF and also can use the same CGDM name, the VMSS Store of the cascadePF can be configured to return one VMSS for any lookup.",
"Exemplary CF functions of the cascadePF are, initRestElement(CurrentElementName name), which for a current element with ID=name, resets the options for all from the next element to the end, Results r=getValuesFromBackend(Condition condition, Results r, BackendProc p, CGDMName pCGDMName), which packs a CGDM and calls a backend process p and passes a CGDM with name pCGDMName, and setOptions(Results r); set options of the <select> of ID=r.name.",
"The CGDM has the format, {pCGDMName: { {Input: {Condition:{ name:value}}}, {Output:{Results:{ r:NULL}} } Because the cascadePF can be used for all the <select> elements, the selected <select> element the PF receives is different when the selection is done on different <select> elements.",
"So a direct Variable Mapping(VM) is not possible.",
"But the arguments of the CFs can be deducted from the Markups and the CGDM.",
"We call this the Rule Based VM (RBVM).",
"In the backend we can have a PF called handleDBSelection, which contains set SQL select implementations.",
"Usually the values of options for a <select> can be obtained by running a SQL select.",
"We assign cascadeOptionsCGDM as the name of the CGDM and the getValuesFromBackend are passed to the handleDBSelection.",
"Using RBVM, the VMSS for the PF becomes, {initRestElement: RBVM} { getValuesFromBackend: {{ condition: RBVM }, {r : RBVM }, { p: handleDBSelection },{ pCGDMName: cascadeOptionsCGDM }}} { setOptions: { {r: getValuesFromBackend.r}} The Callers of the CFs are, initRestElementCaller(RBVM, CGDM, CFResults) {initRestElement: RBVM} { getValuesFromBackend: {{ condition: RBVM }, { r : RBVM }, { p: handleDBSelection },{ pCGDMName: cascadeOptionsCGDM }}} { setOptions: { {r: getValuesFromBackend.r}} The benefit of RBVM is the rule processing part of code does not change when a new cascade is added or the length of a cascade is extended.",
"All cascades can use the same cod since the algorithm we have chosen is abstract and generalized.",
"The implementation of the CFCallers is affected by the Markup Rule.",
"A new CFCaller of a CF needs to be developed for a Markup Rule.",
"Because of Markup Rule, a CF may have more than one CFCaller.",
"All the CFs are pure algorithm functions and they implement a pure cascade and are not related the application meaning assigned to the cascade.",
"For example, either it's Country-State-County or Grade-Class-StudentName.",
"The Markups can be done on a separate message that has equal or more expressive syntax rules, using the names of the values of the CGDM as a cross reference.",
"We call the separate Markup message, the Property Sheet (PS) of the CGDM.",
"Any CGDM can have a PS attached to it.",
"Because at development time, the Name Instance (NI) of the CGDM is known, so a PS can be attached to a CGDM at development time.",
"Having described exemplary embodiments of the invention, it is to be understood that the invention is not limited to the disclosed embodiments, and is intended to cover various modifications and equivalent arrangements included within the spirit and scope of the disclosure."
]
] |
Patent_15871254
|
[
[
"METHODS AND SOLUTIONS FOR CLEANING INGAAS (OR III-V) SUBSTRATES",
"Embodiments described herein generally relate to improved methods and solutions for cleaning a substrate prior to epitaxial growth of Group III-V channel materials.",
"A first processing gas, which includes a noble gas and a hydrogen source, is used to remove the native oxide layer from the substrate surface.",
"A second processing gas, Ar/Cl2/H2, is then used to create a reactive surface layer on the substrate surface.",
"Finally, a hydrogen bake with a third processing gas, which includes a hydrogen source and an arsine source, is used to remove the reactive layer from the substrate surface."
],
[
"1.A method for cleaning a substrate, comprising: introducing a first processing gas comprising a noble gas and a hydrogen source into a chamber; activating the first processing gas; exposing a substrate having a native oxide layer thereon to the activated first processing gas; introducing a second processing gas comprising Cl2 and H2 into the chamber; activating the second processing gas; exposing the substrate to the activated second processing gas; introducing a third processing gas comprising a hydrogen source and an arsine source into the chamber; and exposing the substrate to the third processing gas.",
"2.The method of claim 1, wherein the first processing gas comprises Ar and H2.3.The method of claim 1, wherein the third processing gas comprises H2 and TertbutylArsine.",
"4.The method of claim 2, wherein Ar is introduced into the chamber at a flow rate of between about 100 sccm and about 1200 sccm.",
"5.The method of claim 1, wherein activating the first processing gas and activating the second processing gas occurs at a source power of between about 150 W and about 1000 W. 6.The method of claim 1, wherein activating the first processing gas occurs at a bias power of between about 10 W and about 50 W. 7.The method of claim 1, wherein activating the second processing gas occurs at a bias power of between about 0 W and about 30 W. 8.A method for cleaning a substrate, comprising: introducing a first processing gas comprising a noble gas and a hydrogen source into a first chamber; activating the first processing gas; exposing a substrate having a native oxide layer thereon to the activated first processing gas; introducing a second processing gas comprising Cl2 and H2 into the first chamber; activating the second processing gas; exposing the substrate to the activated second processing gas; transferring the substrate to a second chamber; introducing a third processing gas comprising a hydrogen source and an arsine source into the second chamber; and exposing the substrate to the third processing gas.",
"9.The method of claim 8, wherein the first processing gas comprises Ar and H2.10.The method of claim 8, wherein the third processing gas comprises H2 and TertbutylArsine.",
"11.The method of claim 8, wherein a temperature of the first chamber is between about 30° C. and about 120° C. 12.The method of claim 8, wherein a temperature of the second chamber is between about 300° C. and about 800° C. 13.The method of claim 8, wherein a pressure in the first chamber is between about 5 mT and about 100 mT.",
"14.The method of claim 8, wherein a pressure in the second chamber is between about 10 T and about 600 T. 15.A method for fabricating a substrate, comprising: introducing a first processing gas comprising Ar and H2 into a first chamber; activating the first processing gas; exposing a substrate having a native oxide layer thereon to the activated first processing gas; introducing a second processing gas comprising Cl2 and H2 into the first chamber; activating the second processing gas; exposing the substrate to the activated second processing gas; transferring the substrate to a second chamber; introducing a third processing gas comprising H2 and TertbutylArsine into the second chamber; exposing the substrate to the third processing gas; and depositing an epitaxial material over a surface of the substrate.",
"16.The method of claim 15, wherein the first chamber is an etch chamber.",
"17.The method of claim 16, wherein the second chamber is a deposition chamber.",
"18.The method of claim 15, wherein the epitaxial material is a Group III-V material.",
"19.The method of claim 15, wherein the epitaxial material is InAs.",
"20.The method of claim 15, wherein a temperature of the second chamber is 550° C."
],
[
"<SOH> BACKGROUND <EOH>"
],
[
"<SOH> SUMMARY <EOH>Embodiments described herein generally provide a method of cleaning a substrate surface.",
"The method includes positioning a substrate having a native oxide layer thereon on a support in a chamber.",
"A first processing gas, which includes a noble gas and a hydrogen source, may be introduced into the chamber.",
"The first processing gas may be activated.",
"The native oxide layer of the substrate may be contacted with the activated first processing gas to activate or partially remove the native oxide layer.",
"After activation or partial removal of the native oxide layer, a second processing gas, Ar/Cl 2 /H 2 , may be introduced into the chamber.",
"The second processing gas may be activated.",
"The substrate may be contacted with the second processing gas to create a reactive surface layer.",
"A third processing gas, which includes a hydrogen source and an arsine source, may be introduced into the chamber.",
"Finally, the substrate may be contacted with the third processing gas to remove the reactive surface layer.",
"In another embodiment, a method of cleaning a substrate surface is provided.",
"The method includes positioning a substrate having a native oxide layer thereon on a support in a first chamber.",
"A first processing gas, which includes a noble gas and a hydrogen source, may be introduced into the first chamber.",
"The first processing gas may be activated.",
"The native oxide layer of the substrate may be contacted with the activated first processing gas to activate or partially remove the native oxide layer.",
"After activation or partial removal of the native oxide layer, a second processing gas, Ar/Cl 2 /H 2 , may be introduced into the first chamber.",
"The second processing gas may be activated.",
"The substrate may be contacted with the second processing gas to create a reactive surface layer.",
"The substrate may be transferred to a second chamber.",
"A third processing gas, which includes a hydrogen source and an arsine source, may be introduced into the second chamber.",
"Finally, the substrate may be contacted with the third processing gas to remove the reactive surface layer.",
"In yet another embodiment, a method of fabricating a substrate is provided.",
"The method includes positioning a substrate having a native oxide layer thereon on a support in a first chamber.",
"A first processing gas, Ar/H 2 , may be introduced into a first chamber.",
"The first processing gas may be ionized.",
"The native oxide layer of the substrate may be contacted with the activated first processing gas to activate or partially remove the native oxide layer.",
"After activation or partial removal of the native oxide layer, a second processing gas, Ar/Cl 2 /H 2 , may be introduced into the first chamber.",
"The second processing gas may be activated.",
"The substrate may be contacted with the second processing gas to create a reactive surface layer.",
"The substrate may be transferred to a second chamber.",
"A third processing gas, H 2 /TertbutylArsine (TBA), may be introduced into the second chamber.",
"The substrate may be contacted with the third processing gas to remove the reactive surface layer.",
"Finally, a Group III-V channel material may be deposited over the substrate surface."
],
[
"CROSS-REFERENCE TO RELATED APPLICATIONS This application claims benefit of co-pending U.S. patent application Ser.",
"No.",
"15/340,292, which claims benefit of U.S. patent application Ser.",
"No.",
"62/263,271 filed Dec. 4, 2015, and U.S.",
"Provisional Patent Application No.",
"62/281,761 filed Jan. 22, 2016, each of which is herein incorporated by reference.",
"BACKGROUND Field Embodiments of the present disclosure generally relate to manufacture of semiconductor devices.",
"More specifically, improved methods and solutions are described for cleaning a substrate surface prior to epitaxial growth.",
"Description of the Related Art Epitaxial growth is widely used in manufacturing semiconductor devices, display devices, and other devices.",
"Before the epitaxial layer is deposited on the substrate, a surface cleaning process is performed to remove native oxides and/or other impurities from the deposition surface, and increase the quality of the epitaxial layer being formed.",
"Deposition of Group III-V elements may be advantageous in certain applications for silicon-based devices.",
"For example, Group III-V elements may serve as a channel, or fin, material for sub-7nanometer (nm) complementary metal-oxide semiconductor (CMOS) devices due to the low contact resistance, superior electron mobility and lower operation voltage.",
"However, there are major challenges of growing III-V material on III-V, such as lattice mismatch, valence difference, thermal property differences, conductivity differences, and anti-phase defects.",
"The current wet or dry cleaning processes may not be suitable for reliable fabrication of next-generation devices with Group III-V materials, such as InP, InAs, GaAs and InGaAs because they are high power, high temperature (>600° C.) processes.",
"Furthermore, they are not suitable for cleaning materials inside very small features (<7 nm), and they create a damaged surface layer.",
"Thus, there is a need in the art for improved methods and solutions for cleaning an InGaAs or III-V substrate prior to epitaxial growth of III-V channel materials.",
"SUMMARY Embodiments described herein generally provide a method of cleaning a substrate surface.",
"The method includes positioning a substrate having a native oxide layer thereon on a support in a chamber.",
"A first processing gas, which includes a noble gas and a hydrogen source, may be introduced into the chamber.",
"The first processing gas may be activated.",
"The native oxide layer of the substrate may be contacted with the activated first processing gas to activate or partially remove the native oxide layer.",
"After activation or partial removal of the native oxide layer, a second processing gas, Ar/Cl2/H2, may be introduced into the chamber.",
"The second processing gas may be activated.",
"The substrate may be contacted with the second processing gas to create a reactive surface layer.",
"A third processing gas, which includes a hydrogen source and an arsine source, may be introduced into the chamber.",
"Finally, the substrate may be contacted with the third processing gas to remove the reactive surface layer.",
"In another embodiment, a method of cleaning a substrate surface is provided.",
"The method includes positioning a substrate having a native oxide layer thereon on a support in a first chamber.",
"A first processing gas, which includes a noble gas and a hydrogen source, may be introduced into the first chamber.",
"The first processing gas may be activated.",
"The native oxide layer of the substrate may be contacted with the activated first processing gas to activate or partially remove the native oxide layer.",
"After activation or partial removal of the native oxide layer, a second processing gas, Ar/Cl2/H2, may be introduced into the first chamber.",
"The second processing gas may be activated.",
"The substrate may be contacted with the second processing gas to create a reactive surface layer.",
"The substrate may be transferred to a second chamber.",
"A third processing gas, which includes a hydrogen source and an arsine source, may be introduced into the second chamber.",
"Finally, the substrate may be contacted with the third processing gas to remove the reactive surface layer.",
"In yet another embodiment, a method of fabricating a substrate is provided.",
"The method includes positioning a substrate having a native oxide layer thereon on a support in a first chamber.",
"A first processing gas, Ar/H2, may be introduced into a first chamber.",
"The first processing gas may be ionized.",
"The native oxide layer of the substrate may be contacted with the activated first processing gas to activate or partially remove the native oxide layer.",
"After activation or partial removal of the native oxide layer, a second processing gas, Ar/Cl2/H2, may be introduced into the first chamber.",
"The second processing gas may be activated.",
"The substrate may be contacted with the second processing gas to create a reactive surface layer.",
"The substrate may be transferred to a second chamber.",
"A third processing gas, H2/TertbutylArsine (TBA), may be introduced into the second chamber.",
"The substrate may be contacted with the third processing gas to remove the reactive surface layer.",
"Finally, a Group III-V channel material may be deposited over the substrate surface.",
"BRIEF DESCRIPTION OF THE DRAWINGS So that the manner in which the above recited features of the present disclosure can be understood in detail, a more particular description of the disclosure, briefly summarized above, may be had by reference to embodiments, some of which are illustrated in the appended drawings.",
"It is to be noted, however, that the appended drawings illustrate only exemplary embodiments and are therefore not to be considered limiting of its scope, for the disclosure may admit to other equally effective embodiments.",
"FIG.",
"1 is a flow diagram summarizing a method according to one embodiment described herein.",
"FIGS.",
"2A-2C depict schematic sectional side views of stages of fabrication of a device structure in accordance with the method of FIG.",
"1.FIG.",
"3 is a schematic view of an apparatus for performing a method according to one embodiment described herein.",
"To facilitate understanding, identical reference numerals have been used, where possible, to designate identical elements that are common to the figures.",
"It is contemplated that elements and features of one embodiment may be beneficially incorporated in other embodiments without further recitation.",
"DETAILED DESCRIPTION Embodiments described herein generally relate to methods and solutions for cleaning substrate surfaces prior to epitaxial growth of Group III-V channel materials.",
"Exemplary substrates for the method include InGaAs substrates.",
"Variation in substrate surface contamination and roughness is managed using plasma dry cleaning and a thermal treatment at a lower temperature.",
"A substrate is placed into a first processing chamber.",
"A first precursor is flowed into the first processing chamber and activated with low energy and power, creating reactive sites on the substrate surface.",
"Then low energy plasma is reacted with the substrate surface to create a reactive layer on the substrate surface.",
"The substrate is then transferred into a second processing chamber with a low temperature.",
"A second precursor is injected into the second processing chamber, removing the reactive layer and leaving a very clean substrate surface, which is ready for epitaxial growth of Group III-V channel materials.",
"The first processing chamber may be an etch chamber, and the second processing chamber may be an epitaxial deposition chamber.",
"FIG.",
"1 is a flow diagram summarizing a method 100 for cleaning a substrate surface according to one embodiment described herein.",
"Exemplary substrates for the method 100 include InGaAs (or III-V) substrates.",
"FIGS.",
"2A-2C depict schematic sectional side views of stages of fabrication of a device structure in accordance with the method 100 of FIG.",
"1.The method 100 is described below in accordance with the stages of fabrication of a device structure as illustrated in FIGS.",
"2A-2C.",
"At operation 102, a substrate 222 is positioned in a first chamber.",
"Prior to operation 102, as shown in FIG.",
"2A, a recess made from dielectric material 224 is formed on the substrate 222, and a buffer material 226 is deposited in the recess.",
"There may be a native oxide layer 228 over the buffer material 226.The substrate 222 may be part of a device, such as a CMOS device with a critical dimension as low as 3 nm, for example 5 nm or 7 nm.",
"Other devices, such as fin shaped field effect transistors (FinFETs) or the like may be used with the inventive methods provided herein.",
"The first process chamber is a plasma processing chamber.",
"In one embodiment, the first process chamber is an etch chamber.",
"In another embodiment, the first process chamber is vapor deposition chamber.",
"The etch chamber may be a commercially available process chamber, such as the AdvantEdge™ Mesa™ Hardware Configuration, available from Applied Materials, Inc. of Santa Clara, Calif., or any suitable semiconductor process chamber adapted for performing epitaxial deposition processes.",
"The substrate 222 may be a silicon-containing substrate.",
"The substrate may further comprise germanium (Ge), carbon (C), boron (B), phosphorous (P), or other known elements that may be co-grown, doped and/or associated with silicon materials.",
"The recess forming dielectric material 224 may comprise one or more of silicon oxide (SiO), silicon dioxide (SiO2), silicon nitride (SiN), silicon oxynitride (SiON), or other suitable materials that may be used to form a dielectric material.",
"The dielectric material 224 may be deposited by various deposition processes.",
"For example, the dielectric material 224 may be deposited by a chemical vapor deposition (CVD) process, which may be plasma enhanced.",
"The recess formed in dielectric material 224 may be formed by patterning the dielectric material, using for example an etching process, to achieve the desired recess characteristics.",
"Suitable etching methods include, but are not limited to, anisotropic dry etching or an in-situ dry clean process.",
"The buffer material 226 may comprise one or more Group III-V elements.",
"In one embodiment, the buffer material 226 comprises InGaAs.",
"Sometimes, a native oxide layer 228 forms on the surface of the buffer material 226.The native oxide layer 228 includes oxides (and suboxides) of indium (In), gallium (Ga), arsenic (As).",
"For example, the native oxide layer may include indium oxide (In2O3), gallium oxide (Ga2O3), arsenic trioxide (As2O3), or arsenic pentoxide (As2O5).",
"At operation 104, a first processing gas comprising a noble gas, such as argon (Ar), and a hydrogen source gas, such as hydrogen gas (H2) or methane, is introduced into the first chamber.",
"In one embodiment, the first processing gas may be Ar/H2.The first processing gas is continuously flowed into the chamber.",
"In another embodiment, RF power, which may be pulsed, is coupled into the first processing gas for activation.",
"The flow rate of the noble gas, in one embodiment H2, into the first chamber is between about 5 sccm and about 300 sccm.",
"The flow rate of a noble gas, in one embodiment Ar, into the first chamber is between about 100 sccm and about 1200 sccm.",
"The first processing gas may be introduced by introducing the noble gas at a first flow rate, followed by introducing the hydrogen source gas at a second flow rate, or by introducing the hydrogen source gas at the second flow rate, and then introducing the noble gas at the first flow rate.",
"The flow rate of the hydrogen source gas may be ramped to the second flow rate, and the flow rate of the noble gas may be ramped to the first flow rate.",
"The first processing gas may also be introduced by introducing the noble gas and the hydrogen source gas at the same time as a mixture.",
"The first processing gas is provided at a total flow rate between 100 sccm and 1500 sccm, and the flow rate of the first processing gas may be ramped to the total flow rate.",
"At operation 106, the first processing gas is activated.",
"A target pressure of about 20 mT is established prior to activation.",
"During this process, the chamber pressure is between about 5 mT and about 100 mT and the temperature inside the chamber is between about 30° C. and about 120° C. The temperature is controlled by heating the substrate at about 50° C. and heating the reactive surface at 65° C. Low radio frequency (RF) source and bias powers are applied to the chamber and coupled to the first processing gas to activate the first processing gas, producing ions and radicals in some cases.",
"The source power may be between about 150 W and about 1000 W. The bias power may be between about 10 W and about 50 W. In operation, the Ar ions break the In—O, Ga—O and As—O bonds, creating reactive sites.",
"Hydrogen radicals react with the O atoms.",
"Thus, at operation 108, as shown in FIG.",
"2B, the native oxide layer 228 is removed.",
"At operation 110 a second processing gas, Ar/Cl2/H2, is introduced into the first chamber.",
"RF power, which may be pulsed, is coupled into the second processing gas for activation.",
"The pulse frequency range may be between about 1 KHz and about 10 KHz.",
"The flow rate of H2 into the first chamber is between about 0 sccm and about 300 sccm.",
"The flow rate of Cl2 into the first chamber is between about 5 sccm and about 300 sccm.",
"The flow rate of Ar into the first chamber is between about 100 sccm and about 1200 sccm.",
"At operation 112, the second processing gas is activated.",
"During this process, the chamber pressure is between about 5 mT and about 100 mT and the temperature inside the chamber is between about 30° C. and about 120° C. Low radiofrequency (RF) source and bias powers are applied to the chamber.",
"The source power is between about 150 W and about 1000 W. The bias power is between about 0 W and about 30 W. At operation 114, the substrate 222 is contacted with the second processing gas to create a reactive surface layer.",
"In operation, the low energy Ar/Cl2/H2 second processing gas is reacted with the wafer surface, InGaAs in one embodiment, creating a reactive surface layer.",
"Specifically, the reactive surface layer includes highly reactive, unbound hydride and chloride molecules.",
"At operation 116, the substrate 222 is transferred to a second chamber.",
"The second process chamber is a deposition chamber.",
"The deposition chamber may be a commercially available process chamber, such as the Centura® RP EPI reactor, available from Applied Materials, Inc. of Santa Clara, Calif., or any suitable semiconductor process chamber adapted for performing epitaxial deposition processes.",
"At operation 117 a third processing gas comprising a hydrogen source and an arsine source is introduced into the chamber.",
"In one embodiment, the third processing gas comprises H2 and TertbutylArsine (TBA).",
"The second chamber has a pressure of between about 10 T and about 600 T, and a temperature of between about 300° C. and about 800° C. In a preferred embodiment, the chamber temperature is ≤550° C. At operation 118, the substrate 222 is contacted with the third processing gas to remove the reactive surface layer.",
"In operation, the third processing gas is only introduced into the second chamber for a short period of time.",
"For example, the processing gas is introduced to the chamber for between about 15 seconds and about 300 seconds.",
"During this short time, the H2 and TBA quickly react and remove the reactive surface layer, leaving a clean buffer layer, in one embodiment InGaAs, surface.",
"At the conclusion of the method 100, as shown in FIG.",
"2C, a channel material 230 may be epitaxially grown over the substrate surface, specifically over the buffer material 226.The channel material 230 may comprise any combination of at least a Group III element and a Group V element.",
"In one embodiment, the channel material 230 comprises indium gallium arsenide (InGaAs).",
"In another embodiment, the channel material 230 may comprise aluminum gallium arsenide (AlGaAs), indium arsenide (InAs), gallium antimonide (GaSb), or indium antimonide (InSb).",
"In further embodiments, the channel material 230 may comprise a Group III-V material having high electron mobility and a good crystallographic structure.",
"As a result of the surface preparation process of the method 100, the channel material 230 has a very low concentration of defects.",
"FIG.",
"1 shows one embodiment of a method for cleaning a substrate.",
"In another embodiment, the operations of method 100 may occur in a single chamber.",
"As described above, FIGS.",
"2A-2C depict schematic sectional side views of a device having recesses at various stages of the method 100.Alternatively, FIGS.",
"2A-2C may depict schematic sectional side views of a device having features, which may be trenches, contact holes, or other types of features.",
"The methods disclosed herein can be performed in a single chamber or in multiple chambers of a single apparatus.",
"FIG.",
"3 is a schematic view of an apparatus 340 for performing a method according to one embodiment described herein.",
"More specifically, the apparatus 340 is a cluster tool for fabricating semiconductor devices according to the methods described above.",
"A central portion of the apparatus 340 is a transfer chamber 342.Within the transfer chamber 342 is a wafer transferring mechanism 344.The wafer transferring mechanism 344 transfers a wafer from the first chamber 350 or the second chamber 352 to the load lock chamber 346 and vice versa.",
"The first chamber 350 and second chamber 352 are connected to the transfer chamber 342.The load lock chamber 346 is connected to the transfer chamber 342 through a wafer alignment chamber 348.In a preferred embodiment, the first chamber 350 is an etch chamber and the second chamber 352 is a deposition chamber.",
"The etch chamber may be a commercially available process chamber, such as the AdvantEdge™ Mesa™ Hardware Configuration, available from Applied Materials, Inc, of Santa Clara, Calif., or any suitable semiconductor process chamber adapted for performing epitaxial deposition processes.",
"The deposition chamber may be a commercially available process chamber, such as the Centura® RP Epi reactor, available from Applied Materials, Inc. of Santa Clara, Calif., or any suitable semiconductor process chamber adapted for performing epitaxial deposition processes.",
"The method 100 begins at operation 102 by disposing a substrate 222, as shown in FIG.",
"2A, into the first chamber 350.A first processing gas is introduced into the first chamber 350, where it is ionized, as described in operations 104 and 106.The first processing gas contacts the native oxide layer 228 of the substrate 222 and actively or partially removes the native oxide layer 228, as explained in operation 108 and shown in FIG.",
"2B.",
"A second processing gas is introduced into the first chamber 350, where it is ionized, as described in operations 110 and 112.The second processing gas contacts the substrate 222 and creates a reactive surface layer, as explained in operation 116.The substrate 222 is then transferred from the first chamber 350 to the second chamber 352 via the wafer transferring mechanism 344, as described in operation 116.A third processing gas is introduced into the second chamber, where it contacts the substrate to remove the reactive surface layer as described in operations 117 and 118, and as shown in FIG.",
"2C.",
"Use of the single apparatus 340 containing process chambers 350, and 352 allows for the various stages of the method of FIG.",
"1 to occur without breaking vacuum.",
"While FIG.",
"3 depicts one example of an apparatus having two process chambers for performing the methods described herein, other apparatus and chamber configurations are contemplated for performing the methods.",
"For example, more than two process chambers may be attached to the transfer chamber 342 of the apparatus 340.The apparatus 340 may further include one or more of the following disposed about locations of the transfer chamber 342, in any order: deposition chambers, etch chambers, cleaning chambers, anneal chambers, oxidation chambers, plasma chambers, remote plasma chambers, thermal chambers, CVD chambers, physical vapor deposition (PVD) chambers, plasma-enhanced chemical vapor deposition (PECVD) chambers, rapid thermal processing (RTP) chambers, atomic layer deposition (ALD) chambers, or atomic-layer etch (ALE) chambers.",
"Thus, methods and solutions for cleaning a substrate prior to epitaxial growth of III-V channel materials are provided.",
"The disclosed pre-epitaxial growth clean enables high selective epitaxial growth of Group III-V materials on an InGaAs substrate surface in sub 7 nm CMOS devices.",
"Benefits of this disclosure include reduction of the oxygen level on the substrate surface to less than 5.0E+11 atoms/cm2 without damage to the surface smoothness.",
"While the foregoing is directed to embodiments of the present disclosure, other and further embodiments of the disclosure may be devised without departing from the basic scope thereof, and the scope thereof is determined by the claims that follow."
]
] |
Patent_15871264
|
[
[
"BIAS CONTROL CIRCUIT AND POWER AMPLIFICATION MODULE",
"Provided is a bias control circuit that includes: a reference voltage circuit that generates a reference voltage; a resistor; a temperature dependent current generating circuit that generates a temperature dependent current, which changes depending on temperature, on the basis of the reference voltage and that supplies the temperature dependent current to one end of the resistor; a reference voltage buffer circuit that applies the reference voltage to the other end of the resistor; a constant current generating circuit that generates a constant current, which is for driving the reference voltage buffer circuit, on the basis of the reference voltage and that supplies the constant current to the other end of the resistor; and a bias generating circuit that generates a bias voltage or a bias current for a power amplification circuit on the basis of the voltage at the one end of the resistor."
],
[
"1.A bias control circuit comprising: a reference voltage circuit that generates a reference voltage; a resistor; a reference voltage buffer circuit that applies the reference voltage to a second end of the resistor; a constant current generating circuit that generates a constant current and that supplies the constant current to the second end of the resistor, the constant current being based on the reference voltage and driving the reference voltage buffer circuit; and a bias generating circuit that generates a bias voltage or a bias current for a power amplification circuit based on a voltage at a first end of the resistor.",
"2.The bias control circuit according to claim 1, wherein: the reference voltage buffer circuit includes an operational amplifier and a P-channel MOSFET, the reference voltage is applied to a first input terminal of the operational amplifier, a second input terminal of the operational amplifier and a source of the P-channel MOSFET are connected to the second end of the resistor, and an output terminal of the operational amplifier is connected to a gate of the P-channel MOSFET.",
"3.The bias control circuit according to claim 2, wherein the first input is a non-inverting input and the second input is an inverting input.",
"4.The bias control circuit according to claim 1, wherein the bias generating circuit includes an amplification circuit that amplifies the voltage at the first end of the resistor and outputs the bias voltage.",
"5.The bias control circuit according to claim 2, wherein the bias generating circuit includes an amplification circuit that amplifies the voltage at the first end of the resistor and outputs the bias voltage.",
"6.The bias control circuit according to claim 1, wherein the bias generating circuit includes a voltage-current converting circuit that converts the voltage at the first end of the resistor into the bias current.",
"7.The bias control circuit according to claim 2, wherein the bias generating circuit includes a voltage-current converting circuit that converts the voltage at the first end of the resistor into the bias current.",
"8.The bias control circuit according to claim 1, further comprising a diode, wherein the diode is operatively connected to the first end of the resistor, and wherein a temperature dependent current is supplied to the first end of the resistor based in part on a product of a coefficient and a difference between the reference voltage and a forward voltage of the diode.",
"9.The bias control circuit according to claim 8, further comprising: four P-channel MOSFETs and two N-channel MOSFETs, wherein the coefficient corresponds to ratios of sizes of the four P-channel MOSFETs and two N-channel MOSFETs.",
"10.The bias control circuit according to claim 1, wherein: the constant current generating circuit includes a second resistor, and the constant current is equal to a product of a coefficient and the reference voltage divided by a resistance of the second resistor.",
"11.The bias control circuit according to claim 10, wherein: the constant current generating circuit further includes two P-channel MOSFETs, and the coefficient corresponds to a ratio of sizes of the two P-channel MOSFETs.",
"12.A power amplification module comprising: the bias control circuit according to claim 1; and a power amplification circuit that amplifies an input signal based on the bias voltage or the bias current output from the bias control circuit, and outputs the amplified input signal."
],
[
"<SOH> BACKGROUND <EOH>"
],
[
"<SOH> BRIEF SUMMARY <EOH>In the configuration disclosed in Patent Document 1, a current mirror circuit is generally used when generating a constant current from a bandgap reference voltage.",
"When a current mirror circuit is used in this way, if variations occur in the ratio of the sizes of the transistors that form the current mirror circuit due to variations in the manufacture of the transistors, variations will also occur in the constant current.",
"Furthermore, if variations occur in the constant current, variations will also occur in the bias voltage or bias current.",
"For example, a typical method of suppressing the effect of such variations is a method in which the resistance value of a resistor, which is provided in the circuit that generates a constant current, is adjusted in response to the variations.",
"However, with this method, the manufacturing process becomes complex and an increase in manufacturing cost is incurred.",
"The present disclosure was made in light of such circumstances and was made to suppress fluctuations in a bias voltage or bias current that occur with manufacturing variations and to suppress an increase in cost.",
"A bias control circuit according to an embodiment of the present disclosure includes: a reference voltage circuit that generates a reference voltage; a resistor; a temperature dependent current generating circuit that generates a temperature dependent current, which changes depending on temperature, on the basis of the reference voltage and that supplies the temperature dependent current to one end of the resistor; a reference voltage buffer circuit that applies the reference voltage to the other end of the resistor; a constant current generating circuit that generates a constant current, which is for driving the reference voltage buffer circuit, on the basis of the reference voltage and that supplies the constant current to the other end of the resistor; and a bias generating circuit that generates a bias voltage or a bias current for a power amplification circuit on the basis of a voltage at the one end of the resistor.",
"According to the present disclosure, fluctuations in the bias voltage or bias current that occur with manufacturing variations can be suppressed and an increase in manufacturing cost can be suppressed."
],
[
"This is a continuation of U.S. patent application Ser.",
"No.",
"15/435,442 filed on Feb. 17, 2017, which is a continuation of International Application No.",
"PCT/JP2015/062928 filed on Apr.",
"30, 2015 which claims priority from Japanese Patent Application No.",
"2014-174260 filed on Aug. 28, 2014.The contents of these applications are incorporated herein by reference in their entireties.",
"BACKGROUND Technical Field The present disclosure relates to a bias control circuit and a power amplification module.",
"A power amplification module is used in a mobile communication device such as a cellular phone in order to amplify the power of a radio frequency (RF) signal to be transmitted to a base station.",
"In such a power amplification module, a bias voltage or a bias current to be supplied to a power amplification circuit may be given temperature dependence.",
"For example, Patent Document 1 discloses a configuration in which a current, which is obtained by combining a constant current and a current that has temperature dependence, is converted into a voltage by being supplied to a resistor, one end of which is grounded, and a bias voltage or bias current having temperature dependence is generated on the basis of the voltage.",
"Patent Document 1: Japanese Unexamined Patent Application Publication No.",
"2009-218996 BRIEF SUMMARY In the configuration disclosed in Patent Document 1, a current mirror circuit is generally used when generating a constant current from a bandgap reference voltage.",
"When a current mirror circuit is used in this way, if variations occur in the ratio of the sizes of the transistors that form the current mirror circuit due to variations in the manufacture of the transistors, variations will also occur in the constant current.",
"Furthermore, if variations occur in the constant current, variations will also occur in the bias voltage or bias current.",
"For example, a typical method of suppressing the effect of such variations is a method in which the resistance value of a resistor, which is provided in the circuit that generates a constant current, is adjusted in response to the variations.",
"However, with this method, the manufacturing process becomes complex and an increase in manufacturing cost is incurred.",
"The present disclosure was made in light of such circumstances and was made to suppress fluctuations in a bias voltage or bias current that occur with manufacturing variations and to suppress an increase in cost.",
"A bias control circuit according to an embodiment of the present disclosure includes: a reference voltage circuit that generates a reference voltage; a resistor; a temperature dependent current generating circuit that generates a temperature dependent current, which changes depending on temperature, on the basis of the reference voltage and that supplies the temperature dependent current to one end of the resistor; a reference voltage buffer circuit that applies the reference voltage to the other end of the resistor; a constant current generating circuit that generates a constant current, which is for driving the reference voltage buffer circuit, on the basis of the reference voltage and that supplies the constant current to the other end of the resistor; and a bias generating circuit that generates a bias voltage or a bias current for a power amplification circuit on the basis of a voltage at the one end of the resistor.",
"According to the present disclosure, fluctuations in the bias voltage or bias current that occur with manufacturing variations can be suppressed and an increase in manufacturing cost can be suppressed.",
"BRIEF DESCRIPTION OF THE SEVERAL VIEWS OF THE DRAWINGS FIG.",
"1 illustrates an example configuration of a transmission unit that includes a power amplification module according to an embodiment of the present disclosure.",
"FIG.",
"2 illustrates an example of the configuration of the power amplification module.",
"FIG.",
"3 illustrates an example of the configuration of a bias control circuit.",
"FIG.",
"4 illustrates an example of the configuration of a temperature dependent current generating circuit.",
"FIG.",
"5 illustrates an example of how the temperature dependent current changes.",
"FIG.",
"6 illustrates an example of the configuration of a constant current generating circuit.",
"FIG.",
"7 illustrates an example of the configuration of a bias generating circuit.",
"FIG.",
"8 illustrates another example of the configuration of a bias generating circuit.",
"FIG.",
"9 illustrates an example of the distribution of variations in bias voltage in bias control circuits that generate a bias voltage having temperature dependence by converting a current, which is obtained by combining a constant current and a current that has temperature dependence, into a voltage by supplying the current to a resistor, one end of which is grounded, on the basis of the voltage.",
"FIG.",
"10 illustrates an example of variations in bias voltage in a bias control circuit of the embodiment.",
"DETAILED DESCRIPTION Hereafter, an embodiment of the present disclosure will be described while referring to the drawings.",
"FIG.",
"1 illustrates an example configuration of a transmission unit that includes a power amplification module according to an embodiment of the present disclosure.",
"A transmission unit 100 is for example used in a mobile communication device such as a cellular phone in order to transmit various signals such as speech and data to a base station.",
"Although such a mobile communication device would also be equipped with a reception unit for receiving signals from the base station, the description of such a reception unit will be omitted here.",
"As illustrated in FIG.",
"1, the transmission unit 100 includes a modulator 110, a transmission power control unit 120, a power amplification module 130, a front end unit 140 and an antenna 150.The modulator 110 modulates an input signal on the basis of a modulation scheme such as high speed uplink packet access (HSUPA) or long term evolution (LTE) and generates a radio frequency (RF) signal for performing wireless transmission.",
"The RF signal has a frequency of around several hundred MHz to several GHz, for example.",
"The transmission power control unit 120 adjusts the power of the RF signal on the basis of a transmission power control signal and outputs an adjusted signal.",
"For example, the transmission power control signal is generated on the basis of an adaptive power control (APC) signal transmitted from a base station.",
"For example, the base station can transmit an APC signal to a mobile communication device as a command for adjusting the transmission power in the mobile communication device to an appropriate level by measuring a reception signal from the mobile communication device.",
"The power amplification module 130 amplifies the power of an RF signal (RFIN) output from the transmission power control unit 120 up to the level that is required to transmit the RF signal to the base station, and outputs an amplified signal (RFOUT).",
"The front end unit 140 filters the amplified signal and switches a reception signal received from the base station.",
"The amplified signal output from the front end unit 140 is transmitted to the base station via the antenna 150.FIG.",
"2 illustrates an example of the configuration of the power amplification module 130.The power amplification module 130 includes a power amplification circuit 200 and a bias control circuit 210.The power amplification circuit 200 amplifies the power of the RF signal (RF-IN) and outputs the amplified signal (RFOUT).",
"The bias control circuit 210 supplies a bias voltage VBIAS or a bias current IBIAS to the power amplification circuit 200.In the case where the bias voltage VBIAS or the bias current IBIAS is constant, the gain of the power amplification circuit 200 has a characteristic of changing in response to the temperature.",
"Therefore, in the power amplification module 130 of this embodiment, changes in the gain of the power amplification circuit 200 that occur in response to the temperature are suppressed by giving the bias voltage VBIAS or the bias current IBIAS temperature dependence.",
"FIG.",
"3 illustrates an example of the configuration of the bias control circuit 210.The bias control circuit 210 includes a reference voltage circuit 300, a resistor 310, a temperature dependent current generating circuit 320, a constant current generating circuit 330, a reference voltage buffer circuit 340 and a bias generating circuit 350.The reference voltage circuit 300 generates a band gap reference voltage VBG (hereafter, simply referred to as “reference voltage”) that does not depend upon the temperature.",
"The reference voltage VBG is around 1.2 V, for example.",
"The temperature dependent current generating circuit 320 generates a temperature dependent current IT on the basis of the reference voltage VBG.",
"The temperature dependent current IT changes depending on the temperature.",
"The temperature dependent current IT is supplied to one end (A side) of the resistor 310.An example of the configuration of the temperature dependent current generating circuit 320 will be described later.",
"The constant current generating circuit 330 generates a constant current IC on the basis of the reference voltage VBG.",
"The constant current IC is supplied to the other end (B side) of the resistor 310.The constant current IC is used to drive the reference voltage buffer circuit 340.An example of the configuration of the constant current generating circuit 330 will be described later.",
"The reference voltage buffer circuit 340 applies the reference voltage VBG to the other end (B side) of the resistor 310.The reference voltage buffer circuit 340 includes an operational amplifier 360 and a P-channel MOSFET 370, for example.",
"The reference voltage VBG is applied to the non-inverting input terminal of the operational amplifier 360, the inverting input terminal of the operational amplifier 360 is connected to the source of the P-channel MOSFET 370 and the output terminal of the operational amplifier 360 is connected to the gate of the P-channel MOSFET 370.The source of the P-channel MOSFET 370 is connected to the other end (B side) of the resistor 310 and P-channel MOSFET 370 has a common drain configuration.",
"The reference voltage buffer circuit 340 operates such that the inverting input terminal of the operational amplifier 360 comes to be at the reference voltage VBG due to imaginary short circuiting of the operational amplifier 360.Thus, the reference voltage VBG is applied to the other end (B side) of the resistor 310.The bias generating circuit 350 generates the bias voltage VBIAS or the bias current IBIAS for the power amplification circuit 200 on the basis of a voltage VIN at the one end of the resistor 310.An example of the configuration of the bias generating circuit 350 will be described later.",
"In the bias control circuit 210, the reference voltage buffer circuit 340 controls the voltage at the other end (B side) of the resistor 310 to be the reference voltage VBG.",
"Therefore, the voltage VIN at the one end (A side) of the resistor 310 is given by VIN=VBG+IT×R1, where R1 is the resistance value of the resistor 310.Since the reference voltage VBG is dominant in the voltage VIN, fluctuations in the voltage VIN caused by fluctuations in the temperature dependent current IT caused by variations are suppressed.",
"FIG.",
"4 illustrates an example of the configuration of the temperature dependent current generating circuit 320.The temperature dependent current generating circuit 320 includes operational amplifiers 400 and 401, P-channel MOSFETs 410, 411, 412 and 413, N-channel MOSFETs 420 and 421, resistors 430 and 431 and a diode 440.The reference voltage VBG is applied to the non-inverting input terminal of the operational amplifier 400, the inverting input terminal of the operational amplifier 400 is connected to a connection point between the drain of the P-channel MOSFET 410 and the resistor 430, and the output terminal of the operational amplifier 400 is connected to the gate of the P-channel MOSFET 410.A battery voltage VBAT is applied to the source of the P-channel MOSFET 410 and the drain of the P-channel MOSFET 410 is connected to one end of the resistor 430.The battery voltage VBAT is applied to the source of the P-channel MOSFET 411, the drain of the P-channel MOSFET 411 is connected to the drain of the N-channel MOSFET 421 and the gate of the P-channel MOSFET 411 is connected to the gate of the P-channel MOSFET 410.The one end of the resistor 430 is connected to the inverting input terminal of the operational amplifier 400 and the other end of the resistor 430 is grounded.",
"The reference voltage VBG is applied to the non-inverting input terminal of the operational amplifier 401, the inverting input terminal of the operational amplifier 401 is connected to a connection point between the drain of the P-channel MOSFET 412 and the resistor 431, and the output terminal of the operational amplifier 401 is connected to the gate of the P-channel MOSFET 412.The battery voltage VBAT is applied to the source of the P-channel MOSFET 412 and the drain of the P-channel MOSFET 412 is connected to one end of the resistor 431.The battery voltage VBAT is applied to the source of the P-channel MOSFET 413, the drain of the P-channel MOSFET 413 is connected to the drain of the N-channel MOSFET 420 and the gate of the P-channel MOSFET 413 is connected to the gate of the P-channel MOSFET 412.The N-channel MOSFET 420 is diode-connected in series with the P-channel MOSFET 413 and the N-channel MOSFET 420 has a common-source configuration.",
"The drain of the N-channel MOSFET 421 is connected to the drain of the P-channel MOSFET 411, the N-channel MOSFET 421 has a common-source configuration, and the gate of the N-channel MOSFET 421 is connected to the gate of the N-channel MOSFET 420.The one end of the resistor 431 is connected to the inverting input terminal of the operational amplifier 401 and the other end of the resistor 431 is connected to the anode of the diode 440.In addition, the cathode of the diode 440 is grounded.",
"In the configuration illustrated in FIG.",
"4, a current I1 that flows through the P-channel MOSFET 410 is given by I1=VBG/R2 (constant current), where R2 is the resistance value of the resistor 430.A current I2 that flows through the P-channel MOSFET 411 is given by I2=k1×I2 (constant current).",
"k1 is a coefficient that corresponds to a ratio of the sizes of the P-channel MOSFETs 410 and 411.In addition, a current It1 that flows through the P-channel MOSFET 412 is given by It1=(VBG−VF)/R3, where R3 is the resistance value of the resistor 431 and VF is the forward voltage of the diode 440.A current It2 that flows through the P-channel MOSFET 413 is given by It2=k2×It1.k2 is a coefficient that corresponds to a ratio of the sizes of the P-channel MOSFETs 412 and 413.Furthermore, a current It3 that flows through the N-channel MOSFET 421 is given by It3=k3×It2.k3 is a coefficient that corresponds to a ratio of the sizes of the N-channel MOSFETs 420 and 421.Here, since VF changes in accordance with the temperature, the currents It1 to It3 also change in accordance with the temperature.",
"The temperature dependent current generating circuit 320 outputs the temperature dependent current IT from a connection point between the P-channel MOSFET 411 and the N-channel MOSFET 421.In other words, IT=I2−It3.IT is positive in the case where I2>It3 and is negative in the case where I2<It3.FIG.",
"5 illustrates an example of how the temperature dependent current IT changes.",
"Assuming that the forward voltage VF of the diode 440 decreases in response to an increase in temperature, the current It3 increases in response to an increase in temperature.",
"Since the temperature dependent current IT is given by IT=I2−It3, as illustrated in FIG.",
"5, the temperature dependent current IT decreases in response to an increase in temperature.",
"For example, I2=It3 at room temperature (25° C.) and the temperature dependent current IT is zero.",
"FIG.",
"6 illustrates an example of the configuration of the constant current generating circuit 330.The constant current generating circuit 330 includes an operational amplifier 600, P-channel MOSFETs 610 and 611 and a resistor 620.The reference voltage VBG is applied to the non-inverting input terminal of the operational amplifier 600, the inverting input terminal of the operational amplifier 600 is connected to a connection point between the drain of the P-channel MOSFET 610 and the resistor 620, and the output terminal of the operational amplifier 600 is connected to the gate of the P-channel MOSFET 610.The battery voltage VBAT is applied to the source of the P-channel MOSFET 610 and the drain of the P-channel MOSFET 610 is connected to one end of the resistor 620.The battery voltage VBAT is applied to the source of the P-channel MOSFET 611 and the gate of the P-channel MOSFET 611 is connected to the gate of the P-channel MOSFET 610.The one end of the resistor 620 is connected to the inverting input terminal of the operational amplifier 600 and the other end of the resistor 620 is grounded.",
"In the configuration illustrated in FIG.",
"6, a current I3 that flows though the P-channel MOSFET 610 is given by I3=VBG/R4 (constant current), where R4 is the resistance value of the resistor 620.A current IC output from the P-channel MOSFET 611 is given by IC=k4×I3 (constant current).",
"k4 is a coefficient that corresponds to a ratio of the sizes of the P-channel MOSFETs 610 and 611.FIG.",
"7 illustrates an example of the configuration of the bias generating circuit 350.A bias generating circuit 350A includes an operational amplifier 700 and resistors 710 and 711.The voltage VIN is applied to the non-inverting input terminal of the operational amplifier 700.One end of the resistor 710 is connected to the inverting input terminal of the operational amplifier 700 and the other end of the resistor 710 is grounded.",
"One end of the resistor 711 is connected to the inverting input terminal of the operational amplifier 700 and the other end of the resistor 711 is connected to the output terminal of the operational amplifier 700.In the configuration illustrated in FIG.",
"7, the operational amplifier 700 and the resistors 710 and 711 form a non-inverting amplification circuit, and the bias voltage VBIAS is output, the bias voltage VBIAS being obtained by amplifying the voltage VIN with a gain corresponding to the resistance values of the resistors 710 and 711.FIG.",
"8 illustrates another example of the configuration of the bias generating circuit 350.A bias generating circuit 350B includes an operational amplifier 800, P-channel MOSFETs 810 and 811 and a resistor 820.The voltage VIN is applied to the non-inverting input terminal of the operational amplifier 800, the inverting input terminal of the operational amplifier 800 is connected to a connection point between the drain of the P-channel MOSFET 810 and the resistor 820, and the output terminal of the operational amplifier 800 is connected to the gate of the P-channel MOSFET 810.The battery voltage VBAT is applied to the source of the P-channel MOSFET 810 and the drain of the P-channel MOSFET 810 is connected to one end of the resistor 820.The battery voltage VBAT is applied to the source of the P-channel MOSFET 811 and the gate of the P-channel MOSFET 811 is connected to the gate of the P-channel MOSFET 810.The one end of the resistor 820 is connected to the inverting input terminal of the operational amplifier 800 and the other end of the resistor 820 is grounded.",
"In the configuration illustrated in FIG.",
"8, the bias generating circuit 350B forms a voltage-current converting circuit that converts the voltage VIN into the bias current IBIAS and outputs the bias current IBIAS.",
"A current I4 that flows through the P-channel MOSFET 810 is given by I4=VIN/R5, where R5 is the resistance value of the resistor 820.The bias current IBIAS output from the P-channel MOSFET 811 is given by IBIAS=k5×I4.k5 is a coefficient that corresponds to a ratio of the sizes of the P-channel MOSFETs 810 and 811.FIGS.",
"9 and 10 illustrate examples of the distribution of variations in the bias voltage VBIAS in bias control circuits.",
"In FIGS.",
"9 and 10, the horizontal axis represents the bias voltage VBIAS and the vertical axis represents the number of bias control circuits.",
"In FIGS.",
"9 and 10, the set value of the bias voltage VBIAS is 2.80 V. FIG.",
"9 illustrates an example of the distribution of variations in the bias voltage VBIAS in bias control circuits that generate the bias voltage VBIAS having temperature dependence by converting a current obtained by combining a constant current and a current that has temperature dependence into a voltage by supplying the current to a resistor, one end of which is grounded, on the basis of the voltage.",
"As illustrated in FIG.",
"9, the variations in the bias voltage VBIAS are around ±100 mV from the set value 2.80 V. FIG.",
"10 illustrates an example of variations in the bias voltage CBIAS in the bias control circuit 210 of this embodiment.",
"As illustrated in FIG.",
"10, the variations in the bias voltage VBIAS are around ±80 mV from the set value 2.80 V. In other words, it is clear that the distribution of variations is smaller than in the example illustrated in FIG.",
"9.An embodiment has been described above.",
"According to the embodiment, in the bias control circuit 210, the reference voltage buffer circuit 340 controls the voltage at the other end (B side) of the resistor 310 so as to be the reference voltage VBG.",
"Thus, fluctuations in the bias voltage or the bias current can be suppressed compared with a configuration in which a temperature dependent current is supplied to a resistor, one end of which is grounded, and is consequently converted into a voltage, and a bias voltage or bias current having a temperature dependence is generated on the basis of the voltage.",
"In addition, according to this embodiment, there is no need for a process of adjusting the resistance value in order to suppress the effect of such variations.",
"Therefore, an increase in manufacturing cost can be suppressed.",
"This embodiment is for allowing the present disclosure to be easily understood and is not to be interpreted as limiting the present disclosure.",
"The present disclosure can be modified or improved without departing from the gist of the disclosure and equivalents to the present disclosure are also included in the present invention.",
"REFERENCE SIGNS LIST 100 transmission unit 110 modulator 120 transmission power control unit 130 power amplification module 140 front end unit 150 antenna 200 power amplification circuit 210 bias control circuit 300 reference voltage circuit 310, 430, 431, 620, 710, 711, 820 resistor 320 temperature dependent current generating circuit 330 constant current generating circuit 340 reference voltage buffer circuit 350 bias generating circuit 400, 401, 600, 700, 800 operational amplifier 410, 411, 412, 413, 610, 611, 810, 811 P-channel MOSFET 420, 421 N-channel MOSFET 440 diode"
]
] |
Patent_15871275
|
[
[
"Light Emitting Diode and Fabrication Method Thereof",
"A light-emitting diode includes a light-emitting epitaxial laminated layer with an upper surface including an ohmic contact region and a non-ohmic contact region; an ohmic contact layer in the ohmic contact region; an expanding electrode over the ohmic contact layer, at least a part of which contacts with the upper surface of the light-emitting epitaxial laminated layer; a transparent insulating layer that covers the expanding electrode, the exposed ohmic contact layer and the upper surface of the light-emitting epitaxial laminated layer, having a current channel connected to the expanding electrode; a welding wire electrode over the transparent insulating layer, which connects to the expanding electrode via a current channel; when current is input, current quickly flows to the ohmic contact region along the current channel under the welding wire electrode, so that no current is input to the active layer under the welding wire electrode for lighting."
],
[
"1.A light-emitting diode, comprising: a light-emitting epitaxial laminated layer, which comprises: a first semiconductor layer; an active layer; and a second semiconductor layer; wherein, an upper surface is divided into an ohmic contact region and a non-ohmic contact region; an ohmic contact layer in the ohmic contact region of the light-emitting epitaxial laminated layer; an expanding electrode over the ohmic contact layer, at least a part of which extends towards the edge of the ohmic contact layer to the non-ohmic contact region of the light-emitting epitaxial laminated layer, and contacts with the upper surface of the light-emitting epitaxial laminated layer; a transparent insulating layer that covers the expanding electrode, the exposed ohmic contact layer and the upper surface of the light-emitting epitaxial laminated layer; a current channel that is in and runs through the transparent insulating layer, and connects to the expanding electrode, wherein, a projection on the light-emitting epitaxial laminated layer is in the non-ohmic contact region; a welding wire electrode over the transparent insulating layer, which connects to the expanding electrode via a current channel, wherein, the projection on the light-emitting epitaxial laminated layer is in the non-ohmic contact region; when current is input, current quickly flows to the ohmic contact region of the light-emitting epitaxial laminated layer along the current channel under the welding wire electrode, so that no current is input to the active layer under the welding wire electrode for lighting.",
"2.The light-emitting diode of claim 1, wherein, the lower part of the welding wire electrode and nearby regions have no ohmic contact layer.",
"3.The light-emitting diode of claim 1, wherein, the non-ohmic contact region over the upper surface of the light-emitting epitaxial laminated layer is larger than the welding wire electrode.",
"4.The light-emitting diode of claim 1, wherein, the current channel is distal from the ohmic contact layer as much as possible.",
"5.The light-emitting diode of claim 1, wherein, the non-ohmic contact region is distributed at both ends of the upper surface of the light-emitting epitaxial laminated layer; and the expanding electrode is a series of parallel linear structure, in which, the first and last ends are in the non-ohmic contact region, and the mid part contacts with the ohmic contact layer.",
"6.The light-emitting diode of claim 1, wherein, refractive index of the transparent insulating layer is between that of the light-emitting epitaxial laminated layer and air.",
"7.The light-emitting diode of claim 1, wherein, the transparent insulating layer, the light-emitting epitaxial laminated layer, and the welding wire electrode form an omnidirectional reflection system to avoid light absorption by the welding wire electrode.",
"8.The light-emitting diode of claim 1, wherein, the transparent insulating layer in the ohmic contact region is λ/4n thick.",
"9.The light-emitting diode of claim 1, wherein, a lower surface of the light-emitting epitaxial laminated layer is provided with a reflector.",
"10.A fabrication method of a light-emitting diode, the method comprising: 1) forming a light-emitting epitaxial laminated layer and an ohmic contact layer, wherein, the light-emitting epitaxial laminated layer comprises a first semiconductor layer, an active layer and a second semiconductor layer; 2) defining an ohmic contact region and a non-ohmic contact region over the ohmic contact layer surface, and removing the ohmic contact layer in the non-ohmic contact region to expose the light-emitting epitaxial laminated layer; 3) forming an expanding electrode over the ohmic contact layer, a least a part of which extends towards the edge of the ohmic contact layer to the non-ohmic contact region of the upper surface of the light-emitting epitaxial laminated layer, and directly contacts with the exposed light-emitting epitaxial laminated layer; 4) forming a transparent insulating layer that covers the expanding electrode, the exposed ohmic contact layer and the upper surface of the light-emitting epitaxial laminated layer; 5) forming a current channel over the formed transparent insulating layer, which connects to the expanding electrode, wherein, the projection on the light-emitting epitaxial laminated layer is in the non-ohmic contact region; and 6) forming a welding wire electrode over the transparent insulating layer, which connects to the expanding electrode via the current channel, wherein, the projection on the light-emitting epitaxial laminated layer is in the non-ohmic contact region; when current is input, current quickly flows to the ohmic contact region of the light-emitting epitaxial laminated layer along the current channel under the welding wire electrode, so that no current is input to the active layer under the welding wire electrode for lighting.",
"11.A fabrication method of a light-emitting diode, the method comprising: 1) forming a light-emitting epitaxial laminated layer over the growth substrate, comprising a first semiconductor layer, an active layer and a second semiconductor layer having a first surface and a second surface opposite to each other, wherein, the first surface is far from the growth substrate, and is divided in to an ohmic contact region and a non-ohmic contact region; 2) forming an ohmic contact layer in the ohmic contact region of the first surface of the light-emitting epitaxial laminated layer; 3) fabricating an expanding electrode over the ohmic contact layer, a least a part of which extends towards the edge of the ohmic contact layer to the non-ohmic contact region of the light-emitting epitaxial laminated layer, and contacts with the light-emitting epitaxial laminated layer; 4) providing a temporary substrate, and binding it to the first surface of the light-emitting epitaxial laminated layer; 5) removing the growth substrate to expose the second surface of the light-emitting epitaxial laminated layer; 6) forming a reflector over the second surface of exposed light-emitting epitaxial laminated layer; 7) providing a conductive substrate, and binding it to the reflector; 8) removing the temporary substrate to expose the expanding electrode, a part of the light-emitting epitaxial laminated layer surface and the ohmic contact layer; 9) forming a transparent insulating layer, which covers the expanding electrode, the exposed ohmic contact layer and the first surface of the light-emitting epitaxial laminated layer; 10) setting a current channel over the formed transparent insulating layer, which connects to the expanding electrode, wherein, the projection on the light-emitting epitaxial laminated layer is in the non-ohmic contact region; and 11) forming a welding wire electrode over the transparent insulating layer, which connects to the expanding electrode via the current channel, wherein, the projection on the light-emitting epitaxial laminated layer is in the non-ohmic contact region.",
"wherein the fabricated light-emitting diode comprises: the light-emitting epitaxial laminated layer, which comprises: the first semiconductor layer; the active layer; and the second semiconductor layer; wherein, the upper surface has the ohmic contact region and the non-ohmic contact region; the ohmic contact layer in the ohmic contact region of the light-emitting epitaxial laminated layer; the expanding electrode over the ohmic contact layer, at least a part of which extends towards the edge of the ohmic contact layer to the non-ohmic contact region of the light-emitting epitaxial laminated layer, and contacts with the upper surface of the light-emitting epitaxial laminated layer; the transparent insulating layer that covers the expanding electrode, the exposed ohmic contact layer and the upper surface of the light-emitting epitaxial laminated layer; the current channel that is in and runs through the transparent insulating layer, and connects to the expanding electrode, wherein, a projection on the light-emitting epitaxial laminated layer is in the non-ohmic contact region; the welding wire electrode over the transparent insulating layer, which connects to the expanding electrode via a current channel, wherein, the projection on the light-emitting epitaxial laminated layer is in the non-ohmic contact region; when current is input, current quickly flows to the ohmic contact region of the light-emitting epitaxial laminated layer along the current channel under the welding wire electrode, so that no current is input to the active layer under the welding wire electrode for lighting.",
"12.The method of claim 11, wherein, the lower part of the welding wire electrode and nearby regions have no ohmic contact layer.",
"13.The method of claim 11, wherein, the non-ohmic contact region over the upper surface of the light-emitting epitaxial laminated layer is larger than the welding wire electrode.",
"14.The method of claim 11, wherein, the current channel is distal from the ohmic contact layer as much as possible.",
"15.The method of claim 11, wherein, the non-ohmic contact region is distributed at both ends of the upper surface of the light-emitting epitaxial laminated layer; and the expanding electrode is a series of parallel linear structure, in which, the first and last ends are in the non-ohmic contact region, and the mid part contacts with the ohmic contact layer.",
"16.The method of claim 11, wherein, refractive index of the transparent insulating layer is between that of the light-emitting epitaxial laminated layer and air.",
"17.The method of claim 11, wherein, the transparent insulating layer, the light-emitting epitaxial laminated layer, and the welding wire electrode form an omnidirectional reflection system to avoid light absorption by the welding wire electrode.",
"18.The method of claim 11, wherein, the transparent insulating layer in the ohmic contact region is λ/4n thick.",
"19.The method of claim 11, wherein, a lower surface of the light-emitting epitaxial laminated layer is provided with a reflector."
],
[
"<SOH> BACKGROUND <EOH>In recent years, light-emitting diode (LED) is widely applied and plays an increasingly important role in various fields like display system, lighting system and automobile tail light."
],
[
"<SOH> SUMMARY <EOH>The inventors of the present disclosure have recognized that, in the existing big-power light-emitting diode, light is emitted from the lower part of the welding wire electrode.",
"Therefore, the existing big-power light-emitting diode suffers low light extracting rate due to light absorption by electrodes.",
"FIG.",
"1 shows an existing big-power light-emitting diode structure where light is emitted from the P-side, wherein, a light-emitting epitaxial laminated layer 150 is bonded to the conductive substrate 100 via a metal bonding layer 110 ; an ohmic contact layer 160 is fabricated over the upper surface of the light-emitting laminated layer 150 , and a first welding wire electrode 171 and a second welding wire electrode 172 are formed over the ohmic contact layer 160 .",
"Though meeting big power needs, this structure itself is of great waste.",
"Referring to FIG.",
"2 , the second welding wire electrode (wiring electrode) in the design is large.",
"When current is connected, a high proportion of current is input to the active layer under the first welding wire electrode for recombination luminescence.",
"A large majority of emitted light is absorbed or blocked by the first welding wire electrode, and cannot be emitted from the epitaxial surface, causing great waste of current.",
"In addition, light emitted from the light-emitting region to the lower part of the second welding wire electrode is also absorbed and blocked, which greatly influences light extraction rate of LED.",
"To solve the above problems, the present disclosure provides a light-emitting diode and fabrication thereof, where, no light is emitted from the lower part of the welding wire electrode.",
"This structure is designed with a patterned ohmic contact layer.",
"With a combination of a transparent insulating layer, an expanding electrode and a welding wire electrode, the lower part of the welding wire electrode has no ohmic contact and is far from the ohmic contact layer as much as possible.",
"The technical scheme of the present disclosure to solve the above problems is: a light-emitting diode, which includes: a light-emitting epitaxial laminated layer, including a first semiconductor layer, an active layer and a second semiconductor layer, wherein, the upper surface is divided into an ohmic contact region and a non-ohmic contact region; an ohmic contact layer in the ohmic contact region of the light-emitting epitaxial laminated layer; an expanding electrode over the ohmic contact layer, at least a part of which extends towards the edge of the ohmic contact layer to the non-ohmic contact region of the light-emitting epitaxial laminated layer, and contacts with the upper surface of the light-emitting epitaxial laminated layer; a transparent insulating layer that covers the expanding electrode, the exposed ohmic contact layer and the upper surface of the light-emitting epitaxial laminated layer; a current channel that is in and runs through the transparent insulating layer, and connects to the expanding electrode, wherein, the projection on the light-emitting epitaxial laminated layer is in the non-ohmic contact region; a welding wire electrode over the transparent insulating layer, which connects to the expanding electrode via a current channel, wherein, the projection on the light-emitting epitaxial laminated layer is in the non-ohmic contact region; when current is input, current quickly flows to the ohmic contact region of the light-emitting epitaxial laminated layer along the current channel under the welding wire electrode, so that no current is input to the active layer under the welding wire electrode for lighting.",
"In some embodiments, the lower part of the welding wire electrode and nearby regions have no ohmic contact layer.",
"In some embodiments, the non-ohmic contact region over the upper surface of the light-emitting epitaxial laminated layer is larger than the welding wire electrode.",
"In some embodiments, the current channel is distal from the ohmic contact layer as much as possible.",
"In some embodiments, the non-ohmic contact region is distributed at both ends of the upper surface of the light-emitting epitaxial laminated layer, and the expanding electrode is a series of parallel linear structure, in which, the first and last ends are in the non-ohmic contact region, and the mid part contacts with the ohmic contact layer.",
"In some embodiments, refractive index of the transparent insulating layer is between that of the light-emitting epitaxial laminated layer and air.",
"In some embodiments, the transparent insulating layer, the light-emitting epitaxial laminated layer, and the welding wire electrode form an omnidirectional reflection system to avoid light absorption by the welding wire electrode.",
"In some embodiments, the lower surface of the light-emitting epitaxial laminated layer is provided with a reflector.",
"The present disclosure also provides a fabrication method of the light-emitting diode, including: 1) forming a light-emitting epitaxial laminated layer and an ohmic contact layer, wherein, the light-emitting epitaxial laminated layer includes a first semiconductor layer, an active layer and a second semiconductor layer; 2) defining an ohmic contact region and a non-ohmic contact region over the ohmic contact layer surface, and removing the ohmic contact layer in the non-ohmic contact region to expose the light-emitting epitaxial laminated layer; 3) forming an expanding electrode over the ohmic contact layer, a least a part of which extends towards the edge of the ohmic contact layer to the non-ohmic contact region of the upper surface of the light-emitting epitaxial laminated layer, and directly contacts with the exposed light-emitting epitaxial laminated layer; 4) forming a transparent insulating layer that covers the expanding electrode, the exposed ohmic contact layer and the upper surface of the light-emitting epitaxial laminated layer; 5) forming a current channel over the formed transparent insulating layer, which connects to the expanding electrode, wherein, the projection on the light-emitting epitaxial laminated layer is in the non-ohmic contact region; and 6) forming a welding wire electrode over the transparent insulating layer, which connects to the expanding electrode via the current channel, wherein, the projection on the light-emitting epitaxial laminated layer is in the non-ohmic contact region; when current is input, current quickly flows to the ohmic contact region of the light-emitting epitaxial laminated layer along the current channel at the lower portion of the welding wire electrode, so that no current is input to the active layer under the welding wire electrode for lighting.",
"The present disclosure also provides another fabrication method of light-emitting diode, including: 1) forming a light-emitting epitaxial laminated layer over the growth substrate, including a first semiconductor layer, an active layer and a second semiconductor layer having a first surface and a second surface opposite to each other, wherein, the first surface is far from the growth substrate, and is divided in to an ohmic contact region and a non-ohmic contact region; 2) forming an ohmic contact layer in the ohmic contact region of the first surface of the light-emitting epitaxial laminated layer; 3) fabricating an expanding electrode over the ohmic contact layer, a least a part of which extends towards the edge of the ohmic contact layer to the non-ohmic contact region of the light-emitting epitaxial laminated layer, and contacts with the light-emitting epitaxial laminated layer; 4) providing a temporary substrate, and binding it to the first surface of the light-emitting epitaxial laminated layer; 5) removing the growth substrate to expose the second surface of the light-emitting epitaxial laminated layer; 6) forming a reflector over the second surface of exposed light-emitting epitaxial laminated layer; 7) providing a conductive substrate, and binding it to the reflector; 8) removing the temporary substrate to expose the expanding electrode, a part of the light-emitting epitaxial laminated layer surface and the ohmic contact layer; 9) forming a transparent insulating layer, which covers the expanding electrode, the exposed ohmic contact layer and the first surface of the light-emitting epitaxial laminated layer; 10) setting a current channel over the formed transparent insulating layer, which connects to the expanding electrode, wherein, the projection on the light-emitting epitaxial laminated layer is in the non-ohmic contact region; and 11) forming a welding wire electrode over the transparent insulating layer, which connects to the expanding electrode via the current channel, wherein, the projection on the light-emitting epitaxial laminated layer is in the non-ohmic contact region.",
"In another aspect, a light-emitting system is provided including a plurality of light-emitting diodes described above.",
"The light-emitting system can be used in the applications of lighting, display, signage, etc.",
"The other features and advantages of various embodiments of the present disclosure will be described in detail in the following specification, and it is believed that such features and advantages will become more obvious in the specification or through implementations of this disclosure.",
"The purposes and other advantages of the present disclosure can be realized and obtained in the structures specifically described in the specifications, claims and drawings."
],
[
"CROSS-REFERENCE TO RELATED APPLICATIONS The present application is a continuation of, and claims priority to, PCT/CN2017/085660 filed on May 24, 2017, which claims priority to Chinese Patent Application No.",
"201610413139.8 filed on Jun.",
"13, 2016.The disclosures of these applications are hereby incorporated by reference in their entirety.",
"BACKGROUND In recent years, light-emitting diode (LED) is widely applied and plays an increasingly important role in various fields like display system, lighting system and automobile tail light.",
"SUMMARY The inventors of the present disclosure have recognized that, in the existing big-power light-emitting diode, light is emitted from the lower part of the welding wire electrode.",
"Therefore, the existing big-power light-emitting diode suffers low light extracting rate due to light absorption by electrodes.",
"FIG.",
"1 shows an existing big-power light-emitting diode structure where light is emitted from the P-side, wherein, a light-emitting epitaxial laminated layer 150 is bonded to the conductive substrate 100 via a metal bonding layer 110; an ohmic contact layer 160 is fabricated over the upper surface of the light-emitting laminated layer 150, and a first welding wire electrode 171 and a second welding wire electrode 172 are formed over the ohmic contact layer 160.Though meeting big power needs, this structure itself is of great waste.",
"Referring to FIG.",
"2, the second welding wire electrode (wiring electrode) in the design is large.",
"When current is connected, a high proportion of current is input to the active layer under the first welding wire electrode for recombination luminescence.",
"A large majority of emitted light is absorbed or blocked by the first welding wire electrode, and cannot be emitted from the epitaxial surface, causing great waste of current.",
"In addition, light emitted from the light-emitting region to the lower part of the second welding wire electrode is also absorbed and blocked, which greatly influences light extraction rate of LED.",
"To solve the above problems, the present disclosure provides a light-emitting diode and fabrication thereof, where, no light is emitted from the lower part of the welding wire electrode.",
"This structure is designed with a patterned ohmic contact layer.",
"With a combination of a transparent insulating layer, an expanding electrode and a welding wire electrode, the lower part of the welding wire electrode has no ohmic contact and is far from the ohmic contact layer as much as possible.",
"The technical scheme of the present disclosure to solve the above problems is: a light-emitting diode, which includes: a light-emitting epitaxial laminated layer, including a first semiconductor layer, an active layer and a second semiconductor layer, wherein, the upper surface is divided into an ohmic contact region and a non-ohmic contact region; an ohmic contact layer in the ohmic contact region of the light-emitting epitaxial laminated layer; an expanding electrode over the ohmic contact layer, at least a part of which extends towards the edge of the ohmic contact layer to the non-ohmic contact region of the light-emitting epitaxial laminated layer, and contacts with the upper surface of the light-emitting epitaxial laminated layer; a transparent insulating layer that covers the expanding electrode, the exposed ohmic contact layer and the upper surface of the light-emitting epitaxial laminated layer; a current channel that is in and runs through the transparent insulating layer, and connects to the expanding electrode, wherein, the projection on the light-emitting epitaxial laminated layer is in the non-ohmic contact region; a welding wire electrode over the transparent insulating layer, which connects to the expanding electrode via a current channel, wherein, the projection on the light-emitting epitaxial laminated layer is in the non-ohmic contact region; when current is input, current quickly flows to the ohmic contact region of the light-emitting epitaxial laminated layer along the current channel under the welding wire electrode, so that no current is input to the active layer under the welding wire electrode for lighting.",
"In some embodiments, the lower part of the welding wire electrode and nearby regions have no ohmic contact layer.",
"In some embodiments, the non-ohmic contact region over the upper surface of the light-emitting epitaxial laminated layer is larger than the welding wire electrode.",
"In some embodiments, the current channel is distal from the ohmic contact layer as much as possible.",
"In some embodiments, the non-ohmic contact region is distributed at both ends of the upper surface of the light-emitting epitaxial laminated layer, and the expanding electrode is a series of parallel linear structure, in which, the first and last ends are in the non-ohmic contact region, and the mid part contacts with the ohmic contact layer.",
"In some embodiments, refractive index of the transparent insulating layer is between that of the light-emitting epitaxial laminated layer and air.",
"In some embodiments, the transparent insulating layer, the light-emitting epitaxial laminated layer, and the welding wire electrode form an omnidirectional reflection system to avoid light absorption by the welding wire electrode.",
"In some embodiments, the lower surface of the light-emitting epitaxial laminated layer is provided with a reflector.",
"The present disclosure also provides a fabrication method of the light-emitting diode, including: 1) forming a light-emitting epitaxial laminated layer and an ohmic contact layer, wherein, the light-emitting epitaxial laminated layer includes a first semiconductor layer, an active layer and a second semiconductor layer; 2) defining an ohmic contact region and a non-ohmic contact region over the ohmic contact layer surface, and removing the ohmic contact layer in the non-ohmic contact region to expose the light-emitting epitaxial laminated layer; 3) forming an expanding electrode over the ohmic contact layer, a least a part of which extends towards the edge of the ohmic contact layer to the non-ohmic contact region of the upper surface of the light-emitting epitaxial laminated layer, and directly contacts with the exposed light-emitting epitaxial laminated layer; 4) forming a transparent insulating layer that covers the expanding electrode, the exposed ohmic contact layer and the upper surface of the light-emitting epitaxial laminated layer; 5) forming a current channel over the formed transparent insulating layer, which connects to the expanding electrode, wherein, the projection on the light-emitting epitaxial laminated layer is in the non-ohmic contact region; and 6) forming a welding wire electrode over the transparent insulating layer, which connects to the expanding electrode via the current channel, wherein, the projection on the light-emitting epitaxial laminated layer is in the non-ohmic contact region; when current is input, current quickly flows to the ohmic contact region of the light-emitting epitaxial laminated layer along the current channel at the lower portion of the welding wire electrode, so that no current is input to the active layer under the welding wire electrode for lighting.",
"The present disclosure also provides another fabrication method of light-emitting diode, including: 1) forming a light-emitting epitaxial laminated layer over the growth substrate, including a first semiconductor layer, an active layer and a second semiconductor layer having a first surface and a second surface opposite to each other, wherein, the first surface is far from the growth substrate, and is divided in to an ohmic contact region and a non-ohmic contact region; 2) forming an ohmic contact layer in the ohmic contact region of the first surface of the light-emitting epitaxial laminated layer; 3) fabricating an expanding electrode over the ohmic contact layer, a least a part of which extends towards the edge of the ohmic contact layer to the non-ohmic contact region of the light-emitting epitaxial laminated layer, and contacts with the light-emitting epitaxial laminated layer; 4) providing a temporary substrate, and binding it to the first surface of the light-emitting epitaxial laminated layer; 5) removing the growth substrate to expose the second surface of the light-emitting epitaxial laminated layer; 6) forming a reflector over the second surface of exposed light-emitting epitaxial laminated layer; 7) providing a conductive substrate, and binding it to the reflector; 8) removing the temporary substrate to expose the expanding electrode, a part of the light-emitting epitaxial laminated layer surface and the ohmic contact layer; 9) forming a transparent insulating layer, which covers the expanding electrode, the exposed ohmic contact layer and the first surface of the light-emitting epitaxial laminated layer; 10) setting a current channel over the formed transparent insulating layer, which connects to the expanding electrode, wherein, the projection on the light-emitting epitaxial laminated layer is in the non-ohmic contact region; and 11) forming a welding wire electrode over the transparent insulating layer, which connects to the expanding electrode via the current channel, wherein, the projection on the light-emitting epitaxial laminated layer is in the non-ohmic contact region.",
"In another aspect, a light-emitting system is provided including a plurality of light-emitting diodes described above.",
"The light-emitting system can be used in the applications of lighting, display, signage, etc.",
"The other features and advantages of various embodiments of the present disclosure will be described in detail in the following specification, and it is believed that such features and advantages will become more obvious in the specification or through implementations of this disclosure.",
"The purposes and other advantages of the present disclosure can be realized and obtained in the structures specifically described in the specifications, claims and drawings.",
"BRIEF DESCRIPTION OF THE DRAWINGS The accompanying drawings, which are included to provide a further understanding of the disclosure and constitute a part of this specification, together with the embodiments, are therefore to be considered in all respects as illustrative and not restrictive.",
"In addition, the drawings are merely illustrative, which are not drawn to scale.",
"FIG.",
"1 illustrates a side sectional view of an existing big-power light-emitting diode where light is emitted from the P-side.",
"FIG.",
"2 shows a current flow diagram of the light-emitting diode as shown in FIG.",
"1.FIG.",
"3 illustrates a side sectional view of a big-power light-emitting diode where light is emitted from the P-side according to some embodiments of the present disclosure.",
"FIG.",
"4 illustrates a sectional view for the electrode fabrication process of the light-emitting diode chip according to some embodiments of the present disclosure.",
"FIG.",
"5 shows a current flow diagram of the light-emitting diode as shown in FIG.",
"3.In the drawing: 100, 200: conductive substrate; 110, 210: metal bonding layer; 120, 220: conductive reflective layer; 130, 230: medium layer; 140, 240: N-type ohmic contact layer; 150, 250: light-emitting epitaxial laminated layer; 151, 251: N-type current spreading layer; 152, 252: N-type cladding layer; 153, 253: active layer; 154, 254: P-type cladding layer; 155, 255: P-type window layer; 160, 260: P-type ohmic contact layer; 170, 270: top electrode; 171: first welding wire electrode; 172: second welding wire electrode; 250a: ohmic contact region; 250b: non-ohmic contact layer; 271: expanding electrode; 272: welding wire electrode; 273: current channel; 280: transparent insulating layer.",
"DETAILED DESCRIPTION Various embodiments of the present disclosure will be described in detail with reference to the accompanying drawings and examples, to help understand and practice the disclosed embodiments, regarding how to solve technical problems using technical approaches for achieving the technical effects.",
"It should be understood that the embodiments and their characteristics described in this disclosure may be combined with each other and such technical proposals are deemed to be within the scope of this disclosure without departing from the spirit of this disclosure.",
"With reference to FIG.",
"3, a light-emitting diode of the present disclosure includes: a conductive substrate 200, a metal bonding layer 210, a conductive reflective layer 220, a transparent dielectric layer 230, a light-emitting epitaxial laminated layer 250, an ohmic contact layer 260, an expanding electrode 271, a transparent insulating layer 280 and a welding wire electrode 272, wherein, the conductive substrate 200 can be Si substrate; the transparent dielectric layer 230 is provided with a series of N-type contact layer points 231; the transparent dielectric layer 230 and the conductive reflective layer 220 form an omnidirectional mirror system; the upper surface of the light-emitting epitaxial laminated layer 250 is divided into an ohmic contact region 250a and a non-ohmic contact region 250b; an ohmic contact layer 260 is formed in the ohmic contact region 250a of the light-emitting epitaxial laminated layer 250, and the expanding electrode 271 is formed over the ohmic contact layer 260, a part of which extends towards the edge of the ohmic contact layer to the non-ohmic contact region 250b of the light-emitting epitaxial laminated layer, and contacts with the upper surface 250b of the light-emitting epitaxial laminated layer; the transparent insulating layer 280 covers the expanding electrode 271, the exposed ohmic contact layer 260 and the upper surface 250b of the light-emitting epitaxial laminated layer; the current channel 273 is in and runs through the transparent insulating layer 280, and connects to the expanding electrode 271, wherein, the projection on the light-emitting epitaxial laminated layer is in the non-ohmic contact region 250b; the welding wire electrode 272 is over the transparent insulating layer 280, which connects to the expanding electrode 271 via the current channel 273, the projection of which on the light-emitting epitaxial laminated layer is in the non-ohmic contact region 250b.",
"Details will be given below for the above light-emitting diode in combination with the fabrication method.",
"The fabrication method mainly includes growth of the epitaxial laminated layer, patterning of the ohmic contact layer, fabrication of the expanding electrode, twice substrate transfer and fabrication of the insulating layer and the welding wire electrode.",
"I. Fabricate the Epitaxial Laminated Layer.",
"Form a light-emitting epitaxial laminated layer 250 over the growth substrate.",
"The substrate can be sapphire, AN, GaN, Si, SiC, GaAs and other materials, and the surface structure can be a plane structure or a patterned structure.",
"When applied current flows through the light-emitting epitaxial laminated layer, the active layer is triggered to emit light.",
"When the active layer is made of nitride-based material, blue or green light will be emitted; when made of AlInGaP-based material, red, orange or yellow light in amber color will be emitted.",
"In another embodiment, the active layer is AlInGaP-based material.",
"Therefore, the ohmic contact layer 260 is semiconductor material, which is formed with the light-emitting epitaxial laminated layer via epitaxial growth.",
"Details are as follows: Form a stopping layer, an N-type ohmic contact layer 240, an N-type current spreading layer 251, an N-type cladding layer 252, an active layer 253, a P-type cladding layer 254, a P-type window layer 255 and a P-type ohmic contact layer 260 over the GaAs substrate in successive, wherein, the N-type current spreading layer 251, the N-type cladding layer 252, the active layer 253, the P-type cladding layer 254 and the P-type window layer 255 form a light-emitting epitaxial laminated layer 250.II.",
"Patterning the Ohmic Contact Layer and Fabricate the Expanding Electrode.",
"Referring to FIG.",
"4, panel (a), define an ohmic contact region 250a and a non-ohmic contact region 250b over the surface of the light-emitting epitaxial laminated layer 250.In this embodiment, the chip appears rectangle.",
"The non-ohmic contact region 250b is distributed at both ends of the upper surface of the light-emitting epitaxial laminated layer.",
"Remove the ohmic contact layer of the non-ohmic contact region 250b to expose the P-type window layer 255 of the light-emitting epitaxial laminated layer.",
"Referring to FIG.",
"4, panel (b), fabricate an expanding electrode 271.This expanding electrode 271 is a series of parallel linear structure, in which, the first and last ends are in the non-ohmic contact region 250b, and the mid part contacts with the P-type ohmic contact layer 260.III.",
"Transfer the Substrate.",
"First, transfer the substrate for the first time.",
"Specifically, provide a temporary substrate, and bind it to the P-side surface (In this embodiment, the P-side surface includes surfaces of the P-type ohmic contact layer 260, the expanding electrode 271 and the P-type window layer 255) of the light-emitting epitaxial laminated layer 250, and remove the growth substrate to expose the N-side surface of the light-emitting epitaxial laminated layer.",
"In this embodiment, expose the N-type ohmic contact layer 251; and fabricate a reflector over the surface of the exposed light-emitting epitaxial laminated layer.",
"In a preferred embodiment, etch a part of the N-type contact layer and remain some ohmic contact points 231.Deposit a transparent medium layer 230 and a conductive reflective layer 220 over the N-type ohmic contact layer, wherein, the transparent medium layer 230 can be a single-layer structure, or a distributed Bragg reflection layer structure with alternating-stacked materials with high and low refractive index; and the conductive reflective layer 220 can be metal materials with high refractive index, such as Ag and Al.",
"Next, transfer the substrate for the second time.",
"Specifically, provide a conductive substrate 200, and coat a metal bonding layer 210 over the conductive substrate 200 and the reflective layer 220 respectively for high temperature bonding so that the light-emitting epitaxial laminated layer is bonded to the conductive substrate 200; remove the temporary substrate to expose the P-side surface of the light-emitting epitaxial laminated layer 250, thus finishing substrate transfer process.",
"IV.",
"Fabricate the Transparent Insulating Layer and the Welding Wire Electrode.",
"Cover a transparent insulating layer over the P-side surface of the exposed light-emitting epitaxial laminated layer 250.Referring to FIG.",
"4, panel (c), deposit a transparent insulating layer 280, which covers entire upper surface of the sample, which comprises an expanding electrode 271, an exposed P-type ohmic contact layer and a P-type window layer.",
"This transparent insulating layer 280 users high-transparency medium, wherein, n value is between that of air and the epitaxy, and thickness T=214n, serving as an antireflection film in the light-emitting region.",
"Referring to FIG.",
"4, panel (d), fabricate a current through hole 290 over the transparent insulating layer, which corresponds to the expanding electrode 271 of the non-ohmic contact region, and is distal from the P-type ohmic contact layer 260 as much as possible.",
"Referring to FIG.",
"4, panel (e), fabricate a welding wire electrode 272 over the transparent insulating layer, the projection of which on the light-emitting epitaxial laminated layer is in the non-ohmic contact region 250b, which fills the current through hole 290 to form a current channel so that a connection is built to the expanding electrode 271 to form a chip.",
"The welding wire electrode 272 uses high-reflectivity material, and prefers to be Ti/Pt/Au, Cr/Al/Ti/Pt/Au or Ti/Al/Pt/Au structure.",
"In the above light-emitting diode, the transparent insulating layer 280 at least has the purposes in below: I.",
"The transparent insulating layer is above the expanding electrode 271 and below the welding wire electrode 272 to make current expands outwards.",
"This reduces current waste of the active layer under the welding wire electrode and light absorption and blocking of the welding wire electrode; II.",
"serve as an antireflection film of the light-emitting surface; III.",
"form an ODR system together with the welding wire electrode and the P-type ohmic contact layer 255, which reflects light emitted to the lower part of the welding wire electrode; and IV.",
"serve as a protection film to prevent external or process scraps from adhering to the side wall of the chip core, which may form an electric leakage path.",
"FIG.",
"5 displays the current flow diagram of the above light-emitting diode.",
"An insulating layer is provided below the welding wire electrode, which is far from the P-type ohmic contact layer, whose lower part and the regions near the expanding electrode have no ohmic contact.",
"Therefore, current directly flows to the active region along the current channel to achieve effective outward expansion of current.",
"When external power is connected, as current takes priority to flow along the path with lowest resistance, it quickly flows to the ohmic contact region in the active region along the current channel below the welding wire electrode.",
"Although specific embodiments have been described above in detail, the description is merely for purposes of illustration.",
"It should be appreciated, therefore, that many aspects described above are not intended as required or essential elements unless explicitly stated otherwise.",
"Various modifications of, and equivalent acts corresponding to, the disclosed aspects of the exemplary embodiments, in addition to those described above, can be made by a person of ordinary skill in the art, having the benefit of the present disclosure, without departing from the spirit and scope of the disclosure defined in the following claims, the scope of which is to be accorded the broadest interpretation so as to encompass such modifications and equivalent structures."
]
] |
Patent_15871289
|
[
[
"Method, Apparatus, and System for Detecting Terminal Security Status",
"A method, an apparatus, and a system for detecting a terminal security status are provided.",
"The method includes: receiving a file, and running the file, to generate a dynamic behavior result.",
"The dynamic behavior result includes a behavior sequence that is generated according to a chronological order of occurrence of behaviors.",
"When the file includes an APT, the security protection device obtains a stable behavior feature in the dynamic behavior result, generates a corresponding IOC according to the stable behavior feature, and sends the generated IOC to a terminal.",
"The stable behavior feature is a behavior always existing in a behavior sequence that is generated each time after the file is run."
],
[
"1.A device, comprising: at least one processor; and a non-transitory computer-readable storage medium storing a program to be executed by the processor, the program including instructions for: receiving a file from a public network; running the file in the device to generate a dynamic behavior result, wherein running the file in the device causes a sequence of behaviors to occur, and the dynamic behavior result comprises the sequence of behaviors, and wherein behaviors in the sequence of behaviors comprise creating a file, modifying a registry, configuring a domain name, resolving an address, connecting to a network, loading a process, and adding a user; determining, according to the generated dynamic behavior result, whether the file comprises an advanced persistent threat; and when the file comprises the advanced persistent threat, obtaining a stable behavior feature in the dynamic behavior result, generating a first indicator of compromise corresponding to the stable behavior feature, and sending the first indicator of compromise to a terminal, wherein the stable behavior feature is a behavior that occurs each time the file is run; wherein the device is located at a junction between a private network and the public network, and the terminal is located in the private network.",
"2.The device according to claim 1, wherein the non-transitory computer-readable storage medium further stores a dynamic behavior feature library, wherein the dynamic behavior feature library comprises multiple false positive behavior features and multiple threat behavior features; and wherein the program further includes instructions for: comparing the dynamic behavior result with the multiple false positive behavior features and the multiple threat behavior features in the dynamic behavior feature library; and determining whether the file comprises the advanced persistent threat according to a result of the comparison.",
"3.The device according to claim 2, wherein the program further includes instructions for: running the file in the device a plurality of times to generate a plurality of dynamic behavior results, wherein each running of the file in the device causes a respective sequence of behaviors to occur, and each dynamic behavior result comprises the respective sequence of behaviors; determining identical behaviors that exist in each sequence of behaviors comprised in the plurality of dynamic behavior results, wherein the identical behaviors have a same behavior types and a same behavior content; and identifying a set of behaviors, the set of behaviors comprising the determined identical behaviors, and using the set of behaviors as the stable behavior feature.",
"4.The device according to claim 1, wherein the program further includes instructions for: running the file in the device a plurality of times to generate a plurality of dynamic behavior results, wherein each running of the file in the device causes a respective sequence of behaviors to occur, and each dynamic behavior result comprises the respective sequence of behaviors; determining identical behaviors that exist in each sequence of behaviors comprised in the plurality of dynamic behavior results, wherein the identical behaviors have a same behavior type and a same behavior content; and identifying a set of behaviors, the set of behaviors comprising the determined identical behaviors, and using the set of behaviors as the stable behavior feature.",
"5.The device according to claim 1, wherein generating the first indicator of compromise corresponding to the stable behavior feature comprises: generating a plurality of second indicators of compromise corresponding to a plurality of behaviors in the stable behavior feature; and creating the first indicator of compromise by summarizing each of the plurality of second indicators of compromise.",
"6.The device according to claim 1, wherein the device is comprised in a gateway, the gateway further comprises a firewall, and the device receives the file from the firewall.",
"7.The device according to claim 1, wherein the program further comprises instructions for: when the file does not comprise the advanced persistent threat, sending the file to the terminal.",
"8.The device according to claim 1, wherein the first indicator of compromise describes an indicator of the advanced persistent threat.",
"9.The device according to claim 8, wherein the first indicator of compromise describes an attribute of a file.",
"10.The device according to claim 8, wherein the first indicator of compromise describes a change to a registry.",
"11.A terminal device, comprising: at least one processor; and a non-transitory computer-readable storage medium storing a program to be executed by the processor, the program including instructions for: receiving an indicator of compromise from a security protection device; parsing the received indicator of compromise to obtain a behavior feature that corresponds to an advanced persistent threat (APT), wherein the behavior feature is comprised in the indicator of compromise; and searching an operating system and a file system of the terminal device to determine whether a behavior described by the behavior feature corresponding to the APT has occurred in the terminal device; and when it is determined that the behavior described by the behavior feature corresponding to the APT has occurred in the terminal device, determining that the terminal device has been infected with the APT.",
"12.The terminal device according to claim 11, wherein the behavior feature corresponding to the APT comprises a plurality of behaviors.",
"13.The terminal according to claim 12, wherein the plurality of behaviors comprises creating a file, modifying a registry, configuring a domain name, resolving an address, connecting to a network, loading a process, and adding a user.",
"14.The terminal according to claim 11, wherein the terminal is connected to a gateway using a private network, wherein the gateway connects the terminal to a public network, and wherein the security protection device is comprised in the gateway.",
"15.A system, comprising: a terminal device, located in a private network; and a security protection device, wherein the security protection device is located at a junction between the private network and a public network, and the security protection device is configured to: receive a file from the public network; run the file to generate a dynamic behavior result, wherein running the file causes a sequence of behaviors to occur, and the dynamic behavior result comprises the sequence of behaviors, and wherein behaviors in the sequence of behaviors comprise creating a file, modifying a registry, configuring a domain name, resolving an address, connecting to a network, loading a process, and adding a user; determine, according to the generated dynamic behavior result, whether the file comprises an advanced persistent threat; and when the file comprises the advanced persistent threat, obtain a stable behavior feature in the dynamic behavior result, generate a first indicator of compromise corresponding to the stable behavior feature, and send the first indicator of compromise to the terminal, wherein the stable behavior feature is a behavior that occurs each time the file is run; wherein the terminal device is configured to: receive the first indicator of compromise from the security protection device; parse the received first indicator of compromise to obtain the stable behavior feature; and search an operating system and a file system of the terminal device to determine whether a behavior described by the stable behavior feature has occurred in the terminal device; and when it is determined that the behavior described by the stable behavior feature has occurred in the terminal device, determine that the terminal device has been infected with the advanced persistent threat.",
"16.The system according to claim 15, wherein the security protection device is further configured to: run the file in the device a plurality of times to generate a plurality of dynamic behavior results, wherein each running the file in the device causes a respective sequence of behaviors to occur, and each dynamic behavior result comprises the respective sequence of behaviors; determine identical behaviors that exist in each sequence of behaviors comprised in the plurality of dynamic behavior results, wherein the identical behaviors have a same behavior type and a same behavior content; and identify a set of behaviors, the set of behaviors comprising the determined identical behaviors, and using the set of behaviors as the stable behavior feature.",
"17.The system according to claim 15, wherein the security protection device being configured to generate the first indicator of compromise corresponding to the stable behavior feature comprises the security protection device being configured to: generate a plurality of second indicators of compromise corresponding to a plurality of behaviors in the stable behavior feature; and create the first indicator of compromise by summarizing each of the plurality of second indicators of compromise.",
"18.The system according to claim 15, wherein the security protection device is comprised in a gateway, the gateway further comprises a firewall, and the security protection device receives the file from the firewall.",
"19.The system according to claim 15, wherein the security protection device is further configured to: when the file does not comprise the advanced persistent threat, send the file to the terminal device.",
"20.The system according to claim 15, wherein the first indicator of compromise describes an indicator of the advanced persistent threat."
],
[
"<SOH> BACKGROUND <EOH>As a next generation threat represented by an advanced persistent threat (APT) arises, a conventional security protection approach faces challenges.",
"Once attacked by the APT, a core trade secret of a company may be leaked, resulting in incalculable losses for the company.",
"Industries related to national economies and people's livelihoods, such as the financial industry, the energy industry, and the transportation industry, may be paralyzed.",
"The effect thereof can be as severe as an effect of a war.",
"In 2010, Google (Google Incorporation) was attacked by a next generation threat of Aurora.",
"As a result, a large quantity of Gmail (a free network email service of Google) emails were leaked, severely affecting the Google brand.",
"In 2010, nuclear facilities of Iran were attacked by Stuxnet, causing a severe damage to a centrifuge, which is a core component of the nuclear facilities.",
"A consequence of this attack can be as severe as a precision bombing.",
"In 2011, RSA was attacked by a next generation threat for SecureID.",
"Consequently, a large quantity of SecureID data was leaked, and security of customers using SecureID was severely affected.",
"Doubts about security of RSA severely affected the public image of RSA.",
"In March 2013, the banking industry of the Republic of Korea was attacked by an orientated APT.",
"Consequently, many bank host systems broke down, severely affecting the image of banks in customers' mind.",
"How to cope with the next generation threat represented by the APT in the future and how to cope with a future possible network war are significant problems faced by people.",
"In an existing user network, anti-virus software is usually installed on a terminal device, and a sandbox is deployed in front of a gateway or in front of an email server.",
"The anti-virus software installed on the terminal device detects malicious software mainly using a latest feature library provided by a software vendor.",
"The sandbox is deployed in front of the gateway or the email server, mainly to detect an APT from the Internet.",
"Sandboxes are generally capable of detecting the APT from the Internet.",
"However, while sandboxes may be able to monitor that an internal network is being attacked by the APT, sandboxes may not be able to detect whether a user terminal on the internal network is infected with the APT, and may not be able to identify user terminals of the internal network that are infected with the APT.",
"For example, a sandbox may detect that an internal network to which the sandbox belongs is being attacked by an APT, and the APT attack was sent to user terminals by using an email.",
"Some user terminals are infected with the APT because they have opened the email including an APT attachment, and some user terminals are not infected with the APT because they have not opened the email.",
"For another example, a sandbox detects that an internal network to which the sandbox belongs is being attacked by an APT, and the APT attack is implemented using a vulnerability of a particular version of application software.",
"Some user terminals use this version of the application software, and therefore are being attacked by the APT.",
"Some user terminals use a later version, which has no corresponding vulnerability, of the application software, and therefore the user terminals are not being attacked by the APT.",
"As such, although an attack by the APT on an internal network can be detected using an existing sandbox, whether a user terminal is infected with the APT, and identifying specific user terminals infected with the APT, cannot be determined.",
"Therefore, no targeted operation can be used."
],
[
"<SOH> SUMMARY <EOH>A method, an apparatus, and a system for detecting a terminal security status are described in this specification, to detect whether a specific terminal is infected with an APT.",
"According to a first aspect, an embodiment of this application provides an apparatus for detecting a terminal security status.",
"The apparatus is located at a junction between a private network and a public network, and a terminal is located in the private network.",
"The apparatus includes a dynamic behavior result generation module, a dynamic behavior analysis module, and an indicator of compromise generator.",
"The dynamic behavior result generation module is configured to: receive a file from the public network, and run the file in the apparatus, to generate a dynamic behavior result.",
"The dynamic behavior result includes a behavior sequence that is generated according to a chronological order of occurrence of behaviors.",
"Behaviors in the behavior sequence belong to different behavior types, and the behavior types include creating a file, modifying a registry, configuring a domain name, resolving an address, connecting to a network, loading a process, and adding a user.",
"The dynamic behavior analysis module is configured to determine, according to the dynamic behavior result generated by the dynamic behavior result generation module, whether the file includes an advanced persistent threat.",
"The indicator of compromise generator is configured to, if the dynamic behavior analysis module determines that the file includes the advanced persistent threat, obtain a stable behavior feature in the dynamic behavior result, generate a corresponding indicator of compromise according to the stable behavior feature, and send the indicator of compromise to the terminal.",
"The stable behavior feature is a behavior always existing in a behavior sequence that is generated each time after the file is run.",
"According to a second aspect, an embodiment of this application provides a terminal device.",
"The terminal includes a receiving module, an indicator of compromise interpreter, and a determining module.",
"The receiving module is configured to receive an indicator of compromise from a security protection device.",
"The indicator of compromise interpreter is configured to parse the indicator of compromise received by the receiving module, to obtain a behavior feature that corresponds to an advanced persistent threat and that is included in the indicator of compromise.",
"The determining module is configured to search an operating system and a file system of the terminal device, to determine whether a behavior described by the behavior feature corresponding to the advanced persistent threat has occurred in the terminal, and if the behavior described by the behavior feature corresponding to the advanced persistent threat has occurred in the terminal device, determine that the terminal device has been infected with the advanced persistent threat.",
"According to a third aspect, an embodiment of this application provides a system for detecting a terminal security status.",
"The system includes the apparatus for detecting a terminal security status according to the first aspect, and the terminal device according to the second aspect.",
"According to a fourth aspect, an embodiment of this application provides a method for detecting a terminal security status.",
"The method is executed by a security protection device, the security protection device is located at a junction between a private network and a public network, and a terminal is located in the private network.",
"First, the security protection device receives a file from the public network, and runs the file in the security protection device, to generate a dynamic behavior result.",
"The dynamic behavior result includes a behavior sequence that is generated according to a chronological order of occurrence of behaviors.",
"Behaviors in the behavior sequence belong to different behavior types, and the behavior types include creating a file, modifying a registry, configuring a domain name, resolving an address, connecting to a network, loading a process, and adding a user.",
"The security protection device determines, according to the generated dynamic behavior result, whether the file includes an advanced persistent threat.",
"If the file includes the advanced persistent threat, the security protection device obtains a stable behavior feature in the dynamic behavior result, generates a corresponding indicator of compromise according to the stable behavior feature, and sends the indicator of compromise to the terminal.",
"The stable behavior feature is a behavior always existing in a behavior sequence that is generated each time after the file is run.",
"According to a fifth aspect, an embodiment of this application provides a method for detecting a terminal security status.",
"The terminal receives an indicator of compromise from a security protection device.",
"The terminal parses the indicator of compromise, to obtain a behavior feature that corresponds to an advanced persistent threat and that is included in the indicator of compromise.",
"The terminal also searches an operating system and a file system of the terminal, to determine whether behavior described by the behavior feature corresponding to the advanced persistent threat has occurred in the terminal.",
"If the behavior described by the behavior feature corresponding to the advanced persistent threat has occurred in the terminal, the terminal determines that the terminal has been infected with the advanced persistent threat.",
"Compared with an existing sandbox, the solutions provided in the embodiments of this application can specifically detect whether there is a user terminal infected with the APT in a network, and can identify user terminals infected with the APT."
],
[
"CROSS-REFERENCE TO RELATED APPLICATIONS This application is a continuation of International Application No.",
"PCT/CN2016/101263, filed on Sep. 30, 2016, which claims priority to Chinese Patent Application No.",
"201510988051.4, filed on Dec. 24, 2015.The disclosures of the aforementioned applications are hereby incorporated by reference in their entireties.",
"TECHNICAL FIELD This application relates to the field of computers, and in particular, to the field of computer security protection.",
"BACKGROUND As a next generation threat represented by an advanced persistent threat (APT) arises, a conventional security protection approach faces challenges.",
"Once attacked by the APT, a core trade secret of a company may be leaked, resulting in incalculable losses for the company.",
"Industries related to national economies and people's livelihoods, such as the financial industry, the energy industry, and the transportation industry, may be paralyzed.",
"The effect thereof can be as severe as an effect of a war.",
"In 2010, Google (Google Incorporation) was attacked by a next generation threat of Aurora.",
"As a result, a large quantity of Gmail (a free network email service of Google) emails were leaked, severely affecting the Google brand.",
"In 2010, nuclear facilities of Iran were attacked by Stuxnet, causing a severe damage to a centrifuge, which is a core component of the nuclear facilities.",
"A consequence of this attack can be as severe as a precision bombing.",
"In 2011, RSA was attacked by a next generation threat for SecureID.",
"Consequently, a large quantity of SecureID data was leaked, and security of customers using SecureID was severely affected.",
"Doubts about security of RSA severely affected the public image of RSA.",
"In March 2013, the banking industry of the Republic of Korea was attacked by an orientated APT.",
"Consequently, many bank host systems broke down, severely affecting the image of banks in customers' mind.",
"How to cope with the next generation threat represented by the APT in the future and how to cope with a future possible network war are significant problems faced by people.",
"In an existing user network, anti-virus software is usually installed on a terminal device, and a sandbox is deployed in front of a gateway or in front of an email server.",
"The anti-virus software installed on the terminal device detects malicious software mainly using a latest feature library provided by a software vendor.",
"The sandbox is deployed in front of the gateway or the email server, mainly to detect an APT from the Internet.",
"Sandboxes are generally capable of detecting the APT from the Internet.",
"However, while sandboxes may be able to monitor that an internal network is being attacked by the APT, sandboxes may not be able to detect whether a user terminal on the internal network is infected with the APT, and may not be able to identify user terminals of the internal network that are infected with the APT.",
"For example, a sandbox may detect that an internal network to which the sandbox belongs is being attacked by an APT, and the APT attack was sent to user terminals by using an email.",
"Some user terminals are infected with the APT because they have opened the email including an APT attachment, and some user terminals are not infected with the APT because they have not opened the email.",
"For another example, a sandbox detects that an internal network to which the sandbox belongs is being attacked by an APT, and the APT attack is implemented using a vulnerability of a particular version of application software.",
"Some user terminals use this version of the application software, and therefore are being attacked by the APT.",
"Some user terminals use a later version, which has no corresponding vulnerability, of the application software, and therefore the user terminals are not being attacked by the APT.",
"As such, although an attack by the APT on an internal network can be detected using an existing sandbox, whether a user terminal is infected with the APT, and identifying specific user terminals infected with the APT, cannot be determined.",
"Therefore, no targeted operation can be used.",
"SUMMARY A method, an apparatus, and a system for detecting a terminal security status are described in this specification, to detect whether a specific terminal is infected with an APT.",
"According to a first aspect, an embodiment of this application provides an apparatus for detecting a terminal security status.",
"The apparatus is located at a junction between a private network and a public network, and a terminal is located in the private network.",
"The apparatus includes a dynamic behavior result generation module, a dynamic behavior analysis module, and an indicator of compromise generator.",
"The dynamic behavior result generation module is configured to: receive a file from the public network, and run the file in the apparatus, to generate a dynamic behavior result.",
"The dynamic behavior result includes a behavior sequence that is generated according to a chronological order of occurrence of behaviors.",
"Behaviors in the behavior sequence belong to different behavior types, and the behavior types include creating a file, modifying a registry, configuring a domain name, resolving an address, connecting to a network, loading a process, and adding a user.",
"The dynamic behavior analysis module is configured to determine, according to the dynamic behavior result generated by the dynamic behavior result generation module, whether the file includes an advanced persistent threat.",
"The indicator of compromise generator is configured to, if the dynamic behavior analysis module determines that the file includes the advanced persistent threat, obtain a stable behavior feature in the dynamic behavior result, generate a corresponding indicator of compromise according to the stable behavior feature, and send the indicator of compromise to the terminal.",
"The stable behavior feature is a behavior always existing in a behavior sequence that is generated each time after the file is run.",
"According to a second aspect, an embodiment of this application provides a terminal device.",
"The terminal includes a receiving module, an indicator of compromise interpreter, and a determining module.",
"The receiving module is configured to receive an indicator of compromise from a security protection device.",
"The indicator of compromise interpreter is configured to parse the indicator of compromise received by the receiving module, to obtain a behavior feature that corresponds to an advanced persistent threat and that is included in the indicator of compromise.",
"The determining module is configured to search an operating system and a file system of the terminal device, to determine whether a behavior described by the behavior feature corresponding to the advanced persistent threat has occurred in the terminal, and if the behavior described by the behavior feature corresponding to the advanced persistent threat has occurred in the terminal device, determine that the terminal device has been infected with the advanced persistent threat.",
"According to a third aspect, an embodiment of this application provides a system for detecting a terminal security status.",
"The system includes the apparatus for detecting a terminal security status according to the first aspect, and the terminal device according to the second aspect.",
"According to a fourth aspect, an embodiment of this application provides a method for detecting a terminal security status.",
"The method is executed by a security protection device, the security protection device is located at a junction between a private network and a public network, and a terminal is located in the private network.",
"First, the security protection device receives a file from the public network, and runs the file in the security protection device, to generate a dynamic behavior result.",
"The dynamic behavior result includes a behavior sequence that is generated according to a chronological order of occurrence of behaviors.",
"Behaviors in the behavior sequence belong to different behavior types, and the behavior types include creating a file, modifying a registry, configuring a domain name, resolving an address, connecting to a network, loading a process, and adding a user.",
"The security protection device determines, according to the generated dynamic behavior result, whether the file includes an advanced persistent threat.",
"If the file includes the advanced persistent threat, the security protection device obtains a stable behavior feature in the dynamic behavior result, generates a corresponding indicator of compromise according to the stable behavior feature, and sends the indicator of compromise to the terminal.",
"The stable behavior feature is a behavior always existing in a behavior sequence that is generated each time after the file is run.",
"According to a fifth aspect, an embodiment of this application provides a method for detecting a terminal security status.",
"The terminal receives an indicator of compromise from a security protection device.",
"The terminal parses the indicator of compromise, to obtain a behavior feature that corresponds to an advanced persistent threat and that is included in the indicator of compromise.",
"The terminal also searches an operating system and a file system of the terminal, to determine whether behavior described by the behavior feature corresponding to the advanced persistent threat has occurred in the terminal.",
"If the behavior described by the behavior feature corresponding to the advanced persistent threat has occurred in the terminal, the terminal determines that the terminal has been infected with the advanced persistent threat.",
"Compared with an existing sandbox, the solutions provided in the embodiments of this application can specifically detect whether there is a user terminal infected with the APT in a network, and can identify user terminals infected with the APT.",
"BRIEF DESCRIPTION OF THE DRAWINGS To describe the technical solutions in the embodiments of this application more clearly, the following briefly describes the accompanying drawings required for describing the embodiments.",
"FIG.",
"1 is a schematic diagram of a network architecture for detecting that a terminal is infected with an APT according to an embodiment of this application; FIG.",
"2 is a block diagram of an apparatus for detecting a terminal security status according to an embodiment of this application; FIG.",
"3 is a schematic diagram of a dynamic behavior result; FIG.",
"4 is a schematic diagram of a terminal device according to an embodiment of this application; FIG.",
"5 is a graphical schematic diagram of a summarized IOC output by an editor according to an embodiment of this application; FIG.",
"6 is a schematic diagram of a system for detecting a terminal security status according to an embodiment of this application; FIG.",
"7 is a flowchart of a method for detecting a terminal security status according to an embodiment of this application; FIG.",
"8 is a flowchart of a method for detecting a terminal security status according to another embodiment of this application; FIG.",
"9 is a schematic diagram of a file-type IOC according to an embodiment of this application; FIG.",
"10 is a schematic diagram of a registry-type IOC according to an embodiment of this application; and FIG.",
"11 is a schematic diagram of a summarized IOC according to an embodiment of this application.",
"DETAILED DESCRIPTION OF ILLUSTRATIVE EMBODIMENTS The technical solutions in embodiments of this application are described in the following with reference to the accompanying drawings.",
"A network architecture is described in the embodiments of this application to describe the technical solutions in the embodiments of this application more clearly, and does not constitute any limitation to the technical solutions provided in the embodiments of this application.",
"A person of ordinary skill in the art may learn that with evolution of network architectures and appearance of new service scenarios, the technical solutions provided in the embodiments of this application are also applicable to a similar technical problem.",
"FIG.",
"1 is a schematic diagram of a network architecture of a system for detecting a terminal security status according to an embodiment of this application.",
"A terminal device no obtains data using the Internet.",
"For example, the terminal device no receives an email.",
"A firewall 120 arranged at a gateway receives packetized data, and combines the packetized data into a file to restore the transmitted file.",
"For example, the firewall restores traffic to a file by using a Hypertext Transfer Protocol (HTTP) proxy method.",
"Types of the file include an executable program (exe) file, a dynamic link library (DLL, also referred to as application program expansion) file, a system (sys) file, a com file, a doc file (a Word file), an Microsoft Excel worksheet (xls) file, a Portable Document Format (PDF) file, and the like.",
"The firewall 120 sends a restored file to a sandbox 130 for detection.",
"The sandbox 130 is arranged at the gateway, and detects whether the file from the firewall 120 is a malicious file including an advanced persistent threat (APT).",
"If the sandbox 130 detects that the file includes the APT, the sandbox 130 generates an indicator of compromise (IOC) corresponding to the APT.",
"The sandbox 130 synchronizes the IOC to each terminal device.",
"Each terminal device parses the IOC, to obtain a behavior feature that is included in the IOC that corresponds to an APT.",
"Each terminal device searches an operating system and a file system of the corresponding terminal device according to the behavior feature, to determine whether the user terminal is infected with the APT.",
"The sandbox 130 is a security mechanism that provides an isolation environment for a running program.",
"The sandbox 130 usually strictly controls a resource that can be accessed by a program running in the sandbox 130.For example, the sandbox 130 may provide disk and memory space that can be recycled after being used.",
"In the sandbox 130, network access, access to a real operating system, and read and write permissions to an input device are prohibited or strictly restricted.",
"A change made in the sandbox 130 does not cause any loss to the real operating system.",
"Therefore, such a technology is usually widely applied to testing of an executable file carrying a virus, or other malicious code.",
"The user terminal in this application may include a terminal device such as a mobile phone, a tablet computer, a notebook computer, a ultra-mobile personal computer (UMPC), a netbook, or a personal digital assistant (PDA).",
"FIG.",
"2 is a block diagram of an apparatus for detecting a terminal security status according to an embodiment of this application.",
"The apparatus 200 for detecting a terminal security status, that is, a security protection apparatus, is located at a junction between a private network and a public network, and a terminal is located in the private network.",
"The apparatus 200 includes: a dynamic behavior result generation module 210, a dynamic behavior analysis module 230, a dynamic behavior feature library 220, and an IOC generator 240.In an example, the apparatus 200 for detecting a terminal security status is a sandbox.",
"Further, the sandbox is arranged at a gateway.",
"The dynamic behavior result generation module 210 is configured to: receive a file from the public network, and run the file in the apparatus 200 for detecting a terminal security status, to generate a dynamic behavior result (referring to FIG.",
"3).",
"The dynamic behavior result includes a behavior sequence that is generated according to a chronological order of occurrence of behaviors.",
"Behaviors in the behavior sequence belong to different behavior types, and the behavior types include creating a file, modifying a registry, configuring a domain name, resolving an address, connecting to a network, loading a process, and adding a user.",
"The dynamic behavior analysis module 230 is configured to determine, according to the dynamic behavior result generated by the dynamic behavior result generation module 210, whether the file includes an APT.",
"The IOC generator 240 is configured to, if the dynamic behavior analysis module determines that the file includes the APT, obtain a stable behavior feature in the dynamic behavior result, generate a corresponding IOC according to the stable behavior feature, and send the IOC to the terminal.",
"The stable behavior feature is a behavior always existing in a behavior sequence that is generated each time after the file is run.",
"In an example, a file from the public network is, for example, an exe file, a DLL file, a sys file, a com file, a doc file, an xls file, or a PDF file.",
"In an example, the dynamic behavior result includes a series of behavior operations.",
"Each behavior operation includes a time-based behavior sequence.",
"In an example, the dynamic behavior result generation module 210 includes a heuristic detection engine module and a virtual execution environment module (which are not shown in FIG.",
"2) in an existing sandbox.",
"The heuristic detection engine module includes a web heuristic detection engine submodule, a PDF heuristic detection engine submodule, and a Portable Executable (PE) heuristic detection engine submodule (which are not shown in FIG.",
"2).",
"The heuristic detection engine module and the virtual execution environment module in the sandbox are all configured to generate a corresponding dynamic behavior result.",
"As shown in FIG.",
"3, FIG.",
"3 is a schematic diagram of a dynamic behavior result.",
"The dynamic behavior result in FIG.",
"3 includes a behavior sequence that is generated according to a chronological order of occurrence of behaviors.",
"Behaviors in the behavior sequence belong to different behavior types.",
"In FIG.",
"3, the behavior types include creating a file, loading a process, modifying a registry, and connecting to a network.",
"In FIG.",
"2, the dynamic behavior feature library 220 includes multiple dynamic behavior features related to an APT.",
"For example, the dynamic behavior feature library 220 includes a false positive behavior feature library and a threat behavior feature library (which are not shown in FIG.",
"2).",
"The false positive behavior feature library includes multiple false positive behavior features.",
"The threat behavior feature library includes multiple threat behavior features.",
"In an example, the dynamic behavior analysis module 230 matches the dynamic behavior result from the dynamic behavior result generation module 210 with each dynamic behavior feature in the dynamic behavior feature library 220, to determine whether the dynamic behavior result includes the APT.",
"In an example, the dynamic behavior analysis module 230 matches the dynamic behavior result first with each false positive behavior feature in the false positive behavior feature library of the dynamic behavior feature library 220, and then with each threat behavior feature in the threat behavior feature library, to determine whether the dynamic behavior result includes the APT.",
"In an example, after determining that the dynamic behavior result includes the APT, the dynamic behavior analysis module 230 sends the dynamic behavior result to an IOC generator 240.After determining that the dynamic behavior result does not include the APT, the dynamic behavior analysis module 230 sends the file (that is, a normal file, or an uninfected file) received by the apparatus 200 to a terminal device.",
"That is, the dynamic behavior result received by the IOC generator 240 includes the APT.",
"The APT may be highly concealed, and an attack method of the APT includes hiding the APT.",
"The APT chronically invades a user terminal for a particular target in a planned way by using a series of behavior operations.",
"In an example, the IOC generator 240 includes a first loader 241, multiple IOC generators, and an IOC summarization module 243.The multiple IOC generators include multiple types of IOC generators, for example, include a file generator, a registry generator, a domain name generator (DNS generator), an Address Resolution Protocol generator (ARP generator), a network connection generator (Network generator), a process generator, and a user generator.",
"A type of the IOC generator that is selected to respond to an APT is related to a type of behavior in the stable behavior feature of the APT.",
"For example, if a behavior feature in a dynamic behavior result that includes an APT is creating a file, the type of the IOC generator that will be selected to respond to the APT includes the file generator.",
"The first loader (loader) 241 in the IOC generator 240 loads a corresponding program of the dynamic behavior result to memory, and allocates behavior operations in the dynamic behavior result to different generators.",
"The dynamic behavior result includes a series of behavior operations.",
"Each behavior operation includes a time-based behavior sequence.",
"In an example, the first loader 241 analyzes the behavior operations in the dynamic behavior result one by one according to a chronological order, to obtain corresponding behavior features, and sends a corresponding behavior operation in the dynamic behavior result to a corresponding generator according to a determined behavior feature.",
"For example, the first loader 241 checks a behavior operation, and obtains that a behavior feature of the behavior operation is FCreate, that is, creating a file; then the first loader 241 sends the behavior operation to the file generator.",
"In an example, the first loader 241 includes a comparison table.",
"The comparison table shows a correspondence between each behavior feature and each generator of multiple types of generators.",
"The first loader 241 obtains a behavior feature from each behavior operation in the received dynamic behavior result, determines, by searching the comparison table, a generator corresponding to each behavior operation, and allocates the behavior operation to the corresponding generator.",
"For example, if the first loader 241 checks that a behavior feature of a behavior operation in the received dynamic behavior result (that is, it is already determined that the dynamic behavior result includes an APT) includes creating a file, the first loader 241 determines, by searching the comparison table, that a generator corresponding to the behavior operation is a file generator, and the first loader 241 allocates the behavior operation to the file generator.",
"Each IOC generator in the IOC generator 240 parses a corresponding behavior operation in the dynamic behavior result from the first loader 241, to obtain the stable behavior feature in the dynamic behavior result, that is, to extract a trail left by the APT, and generates a corresponding IOC according to the stable behavior feature.",
"The stable behavior feature is a behavior always existing in a behavior sequence that is generated each time after the file including the APT is run.",
"In an example, that the IOC generator 240 obtains a stable behavior feature in the dynamic behavior result includes: running the file in the apparatus 200 at least twice, to separately obtain a behavior sequence that is generated each time after running, so as to obtain at least two behavior sequences; determining identical behaviors that exist in the at least two behavior sequences, where the identical behaviors are behaviors that are the same in terms of behavior types and behavior content; and obtaining a set formed by the identical behaviors in the at least two behavior sequences, and using the set as the stable behavior feature.",
"Obviously, in a process of obtaining the stable behavior feature, a larger quantity of times of running the file indicates higher accuracy of the finally obtained stable behavior feature, and higher accuracy of identifying, according to the IOC generated according to the stable behavior feature, whether the terminal device is infected with the APT.",
"An indicator of compromise (IOC) describes a trail left by a captured APT, and the trail is described in an xml document form.",
"Content includes an attribute of a virus file, a changed feature of a registry, virtual memory, and the like.",
"For example, a trail that is described by an IOC and that is left by an APT is: searching a path C:\\WINDOWS\\apocalyps32.exe for a file, and a length of the file is 108544 bytes.",
"The IOC summarization module 243 summarizes multiple IOCs from multiple IOC generators (for example, a file generator and a registry generator) into one IOC, and sends the summarized IOC to the terminal device.",
"The summarized IOC is represented by using an Extensible Markup Language (XML) document.",
"FIG.",
"4 is a schematic diagram of a terminal device according to an embodiment of this application.",
"The terminal device 400 includes an IOC interpreter 410, a receiving module 430, and a determining module 440.The receiving module 430 is configured to receive an IOC from a security protection device.",
"The IOC interpreter 410 is configured to parse the IOC received by the receiving module 430, to obtain a behavior feature that corresponds to an APT and that is included in the IOC.",
"The determining module 440 is configured to search an operating system and a file system of the terminal device 400, to determine whether a behavior described by the behavior feature corresponding to the APT has occurred in the terminal device 400.If the behavior described by the behavior feature corresponding to the APT has occurred in the terminal device 400, the determining module 440 is configured to determine that the terminal device 400 has been infected with the APT.",
"In an example, the terminal device 400 further includes an editor 420.The editor 420 is configured to describe and display a received IOC, such as a summarized IOC, in a graphical form, referring to FIG.",
"5.FIG.",
"5 a schematic diagram of a graphical representation form of a summarized IOC.",
"The editor 420 is an optional module.",
"In an example, the IOC interpreter 410 is in a terminal security management (TSM) software module of the terminal device 400.A person skilled in the art may understand that the structure of the terminal device shown in FIG.",
"4 does not constitute any limitation to the terminal device, and may include more or less components than those shown in the figure, or some components may be combined, or a different component layout may be used.",
"In an example, the IOC interpreter 410 includes a second loader 411 and multiple types of interpreters.",
"In FIG.",
"4, the second loader 411 in the IOC interpreter 410 receives an IOC from the receiving module 430.For example the second loader 411 receives a summarized IOC from the receiving module 430.The second loader 411 loads a corresponding program of the summarized IOC to memory, and allocates IOCs in the summarized IOC to different interpreters.",
"In an example, the second loader 411 analyzes the IOCs in the summarized IOC one by one, to obtain types of the IOCs, and allocates the IOCs in the summarized IOC according to the determined types of the IOCs.",
"For example, in an IOC, if a type of a context document included in the IOC is FileItem, it indicates that the IOC is a file-type IOC.",
"In an example, the second loader 411 includes a comparison table.",
"The comparison table shows a correspondence between each IOC type and each interpreter of multiple types of interpreters.",
"The second loader 411 obtains the IOC type from the IOC received by the second loader 411, determines, by searching the comparison table, an interpreter corresponding to each IOC, and allocates each IOC in the summarized IOC to a corresponding interpreter.",
"It should be noted that the IOC interpreter 410 may alternatively include an allocator (not shown in FIG.",
"4).",
"In this case, the allocator allocates each IOC in the summarized IOC to a corresponding interpreter, and the second loader 411 is configured only to load the corresponding program of the summarized IOC to the memory.",
"The IOC interpreter 410 includes some or all of the following multiple types of interpreters: a file interpreter, a registry interpreter, a domain name interpreter (DNS interpreter), an Address Resolution Protocol interpreter (ARP interpreter), a network connection interpreter (Network interpreter), a process interpreter, and a user interpreter.",
"A type of the interpreter is related to an IOC type.",
"Each interpreter in the IOC interpreter 410 receives a corresponding IOC from the second loader 411, and parses the IOC, to obtain a behavior feature included in the IOC that corresponds to the APT, to obtain a trail left by the APT.",
"The determining module 440 searches the operating system and the file system of the terminal device 400 according to the behavior feature, to determine whether a behavior described by the behavior feature corresponding to the APT has occurred in the terminal device 400.If the behavior described by the behavior feature corresponding to the APT has occurred in the terminal device 400, the determining module 440 determines that the terminal device 400 has been infected with the APT.",
"For example, the file interpreter obtains, by parsing, a first feature that corresponds to an APT and that is in an IOC, where the first feature is: a path C:\\WINDOWS\\apocalyps32.exe.",
"The file interpreter also obtains a second feature that corresponds to the APT and that is in the IOC, where the second feature is: a file whose length is 108544 bytes.",
"The determining module 440 searches the operating system and the file system of the terminal device 440, and queries a path C:\\WINDOWS\\apocalyps32.exe, to determine whether there is a file whose length is 108544 bytes, so as to determine whether the terminal device 400 is infected with the APT.",
"FIG.",
"6 shows a system for detecting a terminal security status according to an embodiment of this application.",
"The system includes the apparatus 200 for detecting a terminal security status and the terminal device 400, the apparatus 200 for detecting a terminal security status is located at a junction between a private network and a public network, and the terminal device 400 is located in the private network.",
"The apparatus 200 for detecting a terminal security status receives a file from the public network, and runs the file, to generate a dynamic behavior result.",
"The apparatus 200 determines, according to the dynamic behavior result, whether the file includes an APT.",
"If the dynamic behavior result includes the APT, the apparatus 200 obtains a stable behavior feature in the dynamic behavior result, and generates a corresponding IOC according to the stable behavior feature.",
"The dynamic behavior result includes a behavior sequence that is generated according to a chronological order of occurrence of behaviors.",
"Behaviors in the behavior sequence belong to different behavior types, and the behavior types include creating a file, modifying a registry, configuring a domain name, resolving an address, connecting to a network, loading a process, and adding a user.",
"The stable behavior feature is a behavior that always exists in a behavior sequence that is generated each time after the file is run.",
"The terminal device 400 receives an IOC from the apparatus 200 for detecting a terminal security status, and parses the IOC, to obtain a behavior feature that corresponds to an APT and that is included in the IOC.",
"The terminal device 400 searches an operating system and a file system of the terminal device 400 according to the behavior feature, to determine whether behavior described by the behavior feature corresponding to the APT has occurred in the terminal device 400.If the behavior described by the behavior feature corresponding to the APT has occurred in the terminal device 400, the terminal device 400 determines that the terminal device 400 has been infected with the APT.",
"It should be noted that, for modules included in the apparatus 200 for detecting a terminal security status and the terminal device 400 and functions of the modules, refer to FIG.",
"2, FIG.",
"4, and related descriptions.",
"Details are not described herein again.",
"FIG.",
"7 is a flowchart of a method for detecting a terminal security status according to an embodiment of this application.",
"The method for detecting a terminal security status is executed by a security protection device.",
"The security protection device is located at a junction between a private network and a public network, and a terminal is located in the private network.",
"In an example, the method for detecting a terminal security status is performed by a sandbox, and the sandbox is arranged at a gateway.",
"In step 710, the security protection device receives a file from the public network, and runs the file in the security protection device, to generate a dynamic behavior result, referring to FIG.",
"3.The dynamic behavior result includes a behavior sequence that is generated according to a chronological order of occurrence of behaviors.",
"Behaviors in the behavior sequence belong to different behavior types, and the behavior types include creating a file, modifying a registry, configuring a domain name, resolving an address, connecting to a network, loading a process, and adding a user.",
"In an example, the dynamic behavior result includes a series of behavior operations.",
"Each behavior operation includes a time-based behavior feature.",
"In an example, a file from the Internet is, for example, an exe file, a DLL file, a sys file, a com file, a doc file, an xls file, or a PDF file.",
"In step 720, the security protection device determines, according to the generated dynamic behavior result, whether the file includes an APT.",
"In an example, the dynamic behavior result is matched with each dynamic behavior feature in a dynamic behavior feature library, to determine whether the dynamic behavior result includes the APT.",
"In step 730, if the dynamic behavior result includes the APT, the security protection device analyzes behavior operations in the dynamic behavior result one by one, to obtain a stable behavior feature in each behavior operation, that is, to extract a trail left by the APT, and generates a corresponding IOC according to the stable behavior feature.",
"The stable behavior feature is a behavior always existing in a behavior sequence that is generated each time after the file is run.",
"In an example, the obtaining a stable behavior feature in the dynamic behavior result includes: running the file in the security protection device at least twice, to separately obtain a behavior sequence that is generated after each time of running, so as to obtain at least two behavior sequences; determining identical behaviors that exist in the at least two behavior sequences, where the identical behaviors are behaviors that are the same in terms of behavior types and behavior content; and obtaining a set formed by the identical behaviors in the at least two behavior sequences, and using the set as a stable behavior feature.",
"In step 740, the security protection device summarizes multiple IOCs generated according to the dynamic behavior result into one IOC.",
"The summarized IOC is represented by using an Extensible Markup Language (XML) document.",
"Step 740 is an optional step.",
"When an IOC is obtained according to the dynamic behavior result, the IOC does not need to be summarized, that is, step 740 does not need to be performed.",
"In step 750, the security protection device sends the summarized IOC to the terminal device.",
"FIG.",
"8 is a flowchart of a method for detecting a terminal security status according to another embodiment of this application.",
"In step 810, the terminal device receives an IOC, such as a summarized IOC, from a security protection device, where the summarized IOC includes multiple IOCs.",
"In step 820, the terminal device parses the IOC, to obtain a behavior feature that corresponds to an APT and that is included in the IOC.",
"In an example, the IOC is a summarized IOC.",
"IOCs in the summarized IOC are parsed one by one, to obtain a behavior feature that is corresponding to an APT and that is included in each IOC.",
"In step 830, the terminal device searches an operating system and a file system of the terminal device according to the obtained behavior feature, to determine whether a behavior described by the behavior feature corresponding to the APT has occurred in the terminal device; and if the behavior described by the behavior feature corresponding to the APT has occurred in the terminal device, determines that the terminal device has been infected with the APT.",
"For example, a first feature that corresponds to an APT and that is in an IOC is: a path C:\\WINDOWS\\apocalyps32.exe.",
"A second feature that corresponds to the APT is: a file whose length is 108544 bytes.",
"Therefore, the user terminal searches the path C:\\WINDOWS\\apocalyps32.exe in the operating system and the file system of the user terminal, and checks whether there is a file whose length is 108544 bytes in the path.",
"If there is a file whose length is 108544 bytes in the path, it is determined that the terminal has been infected with the APT.",
"In an example, when the terminal device finds that an IOC in the summarized IOC includes the APT, it is determined that the terminal device is infected with the APT.",
"A dynamic behavior result infected with a typical APT in FIG.",
"3 is used as an example to describe in detail how an IOC generator converts the dynamic behavior result infected with the APT into an IOC, and how the terminal device determines, according to the received IOC, whether the terminal device is infected with the APT.",
"(1) A first loader 241 in an IOC generator 240 analyzes behavior operations in a received dynamic behavior result one by one, and first checks a first behavior operation in the dynamic behavior result, that is, checks a behavior operation “A sample releases a PE file” in FIG.",
"3.The first loader 241 learns, according to a field “action” in the first behavior operation, that the behavior feature is FCreate, that is, creating a file.",
"The first loader 241 allocates the first behavior operation, that is, the behavior operation “A sample releases a PE file” to a file generator.",
"The file generator analyzes the first behavior operation, and learns that the behavior operation is FCreate, that is, creating a file, in a path C:\\windows\\apocalyps32.exe; and FWritePE, that is, writing an executable file.",
"A length is 43008 bytes, that is, the length of the file is 43008 bytes; an offset is 65536 bytes, and therefore a total length of the file is 43008+65536=108544.Therefore, the file generator analyzes the behavior operation, to obtain that a corresponding behavior feature is creating an executable file apocalyps32.exe in a C:\\windows\\directory, and a length of the executable file is 108544 bytes.",
"This type of behavior feature is stable, and does not vary with different terminals.",
"A trail having the behavior feature is left provided that the terminal device is infected with a corresponding APT.",
"The stable behavior feature is a behavior that always exists in a behavior sequence that is generated each time after the file including the APT is run.",
"The file generator generates a file-type IOC according to the stable behavior feature.",
"For the file-type IOC, refer to FIG.",
"9.Therefore, the first behavior operation in the dynamic behavior result is converted into an IOC.",
"FIG.",
"9 is a schematic diagram of a file-type IOC.",
"In FIG.",
"9, the file-type IOC represents that a trail left by an APT is a file whose length is 108544 bytes in the path C:\\windows\\apocalyps32.exe.",
"(2) The first loader 241 checks a second behavior operation in the dynamic behavior result.",
"For example, the first loader 241 checks a behavior operation “Run the sample”.",
"The first loader 241 learns, according to the field “action”, that the behavior operation is CreateProcess, that is, creating a process, in a path C:\\windows\\apocalyps32.exe:1252.The first loader 241 allocates the behavior operation to a process generator.",
"The process generator analyzes the second behavior operation, to learn that the behavior operation is CreateProcess, that is, loading a process, in the path C:\\windows\\apocalyps32.exe:1252, where a value of a pid is 1448; and then FOpen, that is, opening a file, where a value of a process identifier (pid) is 1488.The pid is an unstable feature, and a value of the pid varies with different terminal devices.",
"Therefore, the behavior operation “Run the sample” is an unstable behavior operation, and no IOC is generated.",
"(3) The first loader 241 checks a third behavior operation in the dynamic behavior result.",
"For example, the first loader 241 checks a behavior operation “Create a thread, and inject the thread into a process IEXPLORE.EXE to hide the thread”.",
"The first loader 241 learns, according to the field “action”, that the behavior operation is OpenProcess explorer.exe, that is, opening a browser.",
"The first loader 241 allocates the behavior operation to a process generator.",
"The process generator analyzes the third behavior operation, to learn that the behavior operation is first OpenProcess explorer.exe, that is, opening a browser, where a value of a process identifier (pid) is 1244; and then, WriteOtherProcMem, that is, writing an IE thread, where a value of a pid is 1488.The pid is an unstable feature, and a value of the pid varies with different terminal devices.",
"Therefore, the behavior operation is an unstable behavior operation, and no IOC is generated.",
"(4) The first loader 241 checks a fourth behavior operation in the dynamic behavior result, that is, checks a behavior operation “Modify a registry to add an automatic startup item”.",
"The first loader 241 learns, according to the field “action”, that the behavior operation is RegCreateKey, that is, creating a registry item, in a path HKLM\\SOFTWARE\\Microsoft\\Windows\\CurrentVersion\\Run.",
"The first loader 241 sends the behavior operation to a registry generator.",
"The registry generator analyzes the fourth behavior operation, to learn that the behavior operation is RegCreateKey, that is, creating a registry item, in HKLM\\SOFTWARE\\Microsoft\\Windows\\CurrentVersion\\Run.",
"A key value of the registry item is set to C:\\WINDOWS\\apocalyps32.exe.",
"Therefore, the registry generator analyzes the behavior operation, to obtain that a corresponding behavior feature is adding an automatic startup item C:\\WINDOWS\\apocalyps32.exe in a path HKLM\\SOFTWARE\\Microsoft\\Windows\\CurrentVersion\\Run\\apocalyps32.This type of behavior feature is stable, and does not vary with different terminal devices.",
"A trail of the behavior feature is left provided that the terminal device is infected with a corresponding APT.",
"The stable behavior feature is a behavior that always exist in a behavior sequence that is generated each time after a file including the APT is run.",
"The registry generator converts the behavior operation into a registry-type IOC, referring to FIG.",
"10.FIG.",
"10 is a schematic diagram of a registry-type IOC.",
"In FIG.",
"10, a trail left by an APT is: searching a registry path HKLM\\SOFTWARE\\Microsoft\\Windows\\CurrentVersion\\Run\\apocalyps32 to determine whether the path exists.",
"If the path exists, a value corresponding to the path is C:\\windows\\apocalyps32.exe.",
"(5) The first loader 241 checks a fifth behavior operation in the dynamic behavior result, that is, checks a behavior operation “Connect to an external network”.",
"The first loader 241 learns, according to the field “action”, that the behavior operation is connect, that is, connecting to an external network.",
"The first loader 241 allocates the behavior operation to a network connection generator.",
"The network connection generator analyzes the fifth behavior operation, to learn that the behavior operation is connecting to the external network, and an IP address is 5.5.66.101:1453.1453 in the IP address is an unstable feature, and values thereof vary with different terminal devices.",
"Therefore, the behavior operation “Connect to an external network” is an unstable behavior operation, and no IOC is generated.",
"It may be learned, according to the foregoing analysis, that an APT execution process in FIG.",
"3 is: first releasing an executable file; subsequently, running the executable file; then, hiding the APT execution process in an IE browser, so that the APT execution process cannot be found in the task manager; adding an automatic startup registry item, so that the APT exists in a system each time after the system is restarted; and finally, stealing information or damaging the system by connecting to an external network.",
"(6) The IOC summarization module 243 receives the file-type IOC (as shown in FIG.",
"9) from the file generator, receives the registry-type IOC (as shown in FIG.",
"10) from the registry generator, summarizes the file-type IOC and the registry-type IOC, to obtain a summarized IOC, and displays the summarized IOC in an XML document form, referring to FIG.",
"11.FIG.",
"11 is a schematic diagram of a summarized IOC.",
"The summarized IOC is represented in an XML file form.",
"The XML file includes information such as a brief description about the IOC, an author, and a creation date, and includes a description about the trail of the APT: an executable file whose length is 108544 bytes in the path C:\\windows\\apocalyps32.exe; or adding an automatic startup item C:\\WINDOWS\\apocalyps32.exe in the path HKLM\\SOFTWARE\\Microsoft\\Windows\\CurrentVersion\\Run\\apocalyps32.",
"(7) A receiving module 430 in the terminal device receives the summarized IOC (including the file-type IOC and the registry-type IOC) from the apparatus 200 for detecting a terminal security status (that is, the security protection device), where for a specific summarized IOC, refer to FIG.",
"10, and sends the summarized IOC to a second loader 411.",
"(8) The second loader 411 analyzes the IOCs in the summarized IOC one by one, and first checks a first IOC, that is, the file-type IOC, in the summarized IOC.",
"The second loader 411 learns, according to a field “Context document”, that a behavior feature is FileItem, that is, a file item.",
"The second loader 411 allocates the first IOC, that is, the file-type IOC, to a file interpreter.",
"(9) The file interpreter parses the file-type IOC, to obtain two behavior features of the APT that are included in the IOC: One behavior feature is determining whether C:\\WINDOWS\\apocalyps32.exe exists; and the other behavior feature is determining whether a length of the file is 108544 bytes.",
"The two behavior features are in an “and (English: and)” relationship, referring to FIG.",
"9.",
"(10) A determining module 440 searches an operating system and a file system of a terminal device 400, to determine whether a behavior described by a behavior feature corresponding to the APT has occurred in the terminal device 400.If the behavior described by the behavior feature corresponding to the APT has occurred in the terminal device 400, the determining module 440 determines that the terminal device 400 has been infected with the APT.",
"That is, if a file whose length is 108544 bytes is found in the path C:\\WINDOWS\\apocalyps32.exe, the determining module 440 determines that the terminal device 400 has been infected with the APT.",
"(11) The second loader 411 checks a second IOC, that is, the registry-type IOC, in the summarized IOC.",
"The second loader 411 learns, according to the field “Context document”, that the feature is RegistryItem, that is, a registry item.",
"The second loader 411 allocates the second IOC, that is, the registry-item IOC, to a registry interpreter.",
"The registry interpreter parses the registry-item IOC, to obtain two behavior features of the APT that are included in the IOC: One behavior feature is determining whether a registry path “HKLM\\SOFTWARE\\Microsoft\\Windows\\CurrentVersion\\Run\\apocalyps32” exists; and the other behavior feature is determining whether registry-item content is “C:\\WINDOWS\\apocalyps32.exe”.",
"The two behavior features are in an “and (English: and)” relationship, referring to FIG.",
"10.",
"(12) The determining module 440 searches the operating system and the file system of the terminal device 400, to determine whether the behavior described by the behavior feature corresponding to the APT has occurred in the terminal device 400.If the behavior described by the behavior feature corresponding to the APT has occurred in the terminal device 400, the determining module determines that the terminal device 400 has been infected with the APT.",
"That is, the determining module 440 searches in the path HKLM\\SOFTWARE\\Microsoft\\Windows\\CurrentVersion\\Run\\apocalyps32 to determine whether content C:\\WINDOWS\\apocalyps32.exe is included.",
"If the content is included, it indicates that the terminal device 400 is infected with the APT.",
"Steps of the method or algorithm that are described in the content disclosed in this application may be implemented in a hardware manner, or may be implemented in a manner of a software instruction executed by a processor.",
"The software instruction may include a corresponding software module.",
"The software module may be located in a random access memory (RAM) memory, a flash memory, a read only memory (ROM) memory, an erasable programmable read only memory (EPROM) memory, an electrically erasable programmable read only memory (EEPROM) memory, a register, a hard disk, a removable hard disk, a CD-ROM, or a storage medium of any other form known in the art.",
"For example, a storage medium is coupled to a processor, so that the processor can read information from the storage medium or write information into the storage medium.",
"Certainly, the storage medium may be a component of the processor.",
"The processor and the storage medium may be located in an ASIC.",
"In addition, the ASIC may be located in user equipment.",
"Certainly, the processor and the storage medium may exist in the user equipment as discrete components.",
"A person skilled in the art should be aware that in the foregoing one or more examples, functions described in this application may be implemented by hardware, software, firmware, or any combination thereof.",
"When this application is implemented by software, the foregoing functions may be stored in a computer-readable medium or transmitted as one or more instructions or code in the computer-readable medium.",
"The computer-readable medium includes a computer storage medium and a communications medium, where the communications medium includes any medium that enables a computer program to be transmitted from one place to another.",
"The storage medium may be any available medium accessible to a general-purpose or dedicated computer.",
"The objectives, technical solutions, and beneficial effects of this application are further described in detail in the foregoing specific embodiments.",
"It should be understood that the foregoing descriptions are merely specific embodiments of this application, but are not intended to limit the protection scope of this application.",
"Any modification, equivalent replacement or improvement made based on the technical solutions of this application shall fall within the protection scope of this application."
]
] |
Patent_15871308
|
[
[
"Bromine-Facilitated Synthesis of Fluoro-Sulfur Compounds",
"Described herein are methods for the bromine-facilitated synthesis of fluoro-sulfur compounds, that include SF4, SF5Cl, SF5Br and SF6.",
"The methods described herein generally require lower temperature and pressure, produce higher yields, require less time, do not use corrosive or costly reactants and solvents that are commonly used in the synthesis of the fluoro-sulfur compounds, and do not produce deleterious waste products when compared to previously-used methods."
],
[
"1.-17.",
"(canceled) 18.A method comprising: admixing a Br2 reactant, an SF4 reactant, and a metal fluoride reactant selected from the group consisting of AgF2, AgF, or a combination thereof, thereby initiating a reaction that produces SF5Br.",
"19.The method of claim 18, wherein the reaction takes place at temperatures from about −10° C. to about 200° C. 20.The method of claim 18, wherein the reaction takes place at temperatures from about −10° C. to about 100° C. 21.The method of claim 18, wherein the reaction takes place at temperatures from about −10° C. to about 27° C. 22.The method of claim 18, wherein the SF5Br is produced at a yield from about 10% to less than about 100%.",
"23.The method of claim 18, wherein the SF5Br is produced at a yield of greater than about 50%.",
"24.The method of claim 18, wherein the metal fluoride reactant is AgF and the mixing occurs at a stoichiometric ratio of about 1 AgF to about 1 Br2 to about 1 SF4.25.The method of claim 18, wherein the metal fluoride reactant is AgF2 and the mixing occurs at a stoichiometric ratio of about 2 AgF2 to about 3 Br2 to about 4 SF4.26.The method of claim 18, wherein the reaction occurs in the absence of S2F10, BrF, BrF3, BrF5, CsBrF4, CsBrF2, or combinations thereof.",
"27.The method of claim 18, wherein the SF5Br is produced at a yield of at least about 10% within about 52 hours at temperatures from about −10° C. to about 150° C. 28.A method comprising: initiating a single step reaction that produces SF5Br by admixing a Br2 reactant, an SF4 reactant, and a metal fluoride reactant.",
"29.The method of claim 28, wherein the metal fluoride reactant is selected from AgF, AgF2, or combinations thereof.",
"30.The method of claim 29, wherein the reaction also produces AgBr.",
"31.The method of claim 28, wherein the reaction occurs in the absence of S2F10, BrF, BrF3, BrF5, CsBrF4, CsBrF2, or combinations thereof.",
"32.The method of claim 28, wherein the reaction proceeds at temperatures from about −10° C. to about 200° C. 33.The method of claim 28, wherein the SF5Br is produced at a yield of at least about 10% within about 79 hours at temperatures from about −10° C. to about 140° C. 34.The method of claim 28, wherein the SF5Br is produced at a yield from about 10% to less than 100%.",
"35.The method of claim 28, wherein the SF5Br is produced at a yield of at least about 10% in less than 3 days.",
"36.The method of claim 28, wherein the SF5Br is produced at a yield from about 10% to less than 100% at temperatures from about −10° C. to about 140° C. 37.The method of claim 28, wherein the metal fluoride reactant is AgF and the mixing occurs at a stoichiometric ratio of about 1 AgF to about 1 Br2 to about 1 SF4 or the metal fluoride reactant is AgF2 and the mixing occurs at a stoichiometric ratio of about 2 AgF2 to about 3 Br2 to about 4 SF4."
],
[
"<SOH> BACKGROUND OF THE INVENTION <EOH>A number of fluoro-sulfur compounds have beneficial applications.",
"For example, sulfur tetrafluoride (SF 4 ) is a widely-used compound produced yearly at the metric ton level, which can be utilized as a deoxofluorinating reagent in converting carboxylic acids, aldehydes, some alcohols and ketones into their corresponding deoxofluorine derivatives (i.e.",
"R—CF 3 , R—CHF 2 , RF, RR′—CF 2 ).",
"SF 4 is also utilized as an etching agent in the electronics industry.",
"Moreover, SF 4 can be utilized as a precursor for the synthesis of other important fluorinated products such as, without limitation, pentafluorosulfur chloride (SF 5 Cl), pentafluorosulfur bromide (SF 5 Br), and sulfur hexafluoride (SF 6 ).",
"Sulfur hexafluoride (SF 6 ), is a compound that is produced by the thousands of metric tons each year, and its worldwide uses include: acting as a PCB replacement and an inert dielectric medium for electrical equipment, the etching of semiconductors, the casting of magnesium, the manufacture of thermal windows, a source of thrust in some rocket propulsion systems, the tracing of air flow through industrial systems, a tamponade for retinal holes of the eye and in medical imaging.",
"Compounds harboring fluoro-organic modifications such as R—CF 3 , R—CHF 2 , RF, RR′—CF 2 and RSF 5 , have been used in a variety of applications including fluorinated therapeutic and diagnostic drugs, pesticides, herbicides, antibiotics, perfluorinated blood substitutes, fungicides, polymer solvents, polymers, lubricants, liquid crystals, surface-active agents, high-boiling solvents, stable solvents, electrically conducting polymers and the like.",
"Utilizing an SF 5 group in the place of CF 3 offers many advantages.",
"Particularly, the SF 5 group possesses greater electronegativity than CF 3 .",
"Moreover, compounds containing SF 5 may be further distinguished by their outstanding chemical properties including high to extreme chemical and thermal stability, hydro- and oleophobicity, lipophilicity, high-density, reduction of shock sensitivity in explosives, low boiling point, low polarizability and low surface tension.",
"While SF 5 -derivatives offer these advantages, they have been difficult to synthesize.",
"The difficulty of obtaining such compounds is in part related to the difficulty of obtaining sufficient and affordable quantities of SF 5 Cl or SF 5 Br, which are the principal chemical reagents used to synthesize and obtain a number of organic or inorganic derivatives that bear the SF 5 -radical moiety.",
"SF 5 Cl, particularly, is a valuable reactant to produce SF 5 -radical bearing derivatives of (sulfur hexafluoride) SF 6 and may be reduced to disulfur decafluoride (S 2 F 10 ) with the latter being converted into pentafluorosulfur bromide (SF 5 Br).",
"SF 5 Cl can also be used in the synthesis of SF 6 .",
"It is of interest that SF 5 Cl can be particularly used in the manufacture of SF 6 by a pyrogenic route (e.g.",
"U.S. Pat.",
"No.",
"4,390,511), whereby a disproportionation occurs according to the following reaction: in-line-formulae description=\"In-line Formulae\" end=\"lead\"?",
"SF 5 Cl→½SF 6 +½SF 4 +½Cl 2 in-line-formulae description=\"In-line Formulae\" end=\"tail\"?",
"In this method, SF 6 is obtained that is free of S 2 F 10 , a compound believed to be highly toxic and a by-product of the manufacture of SF 6 by the reaction of sulfur with fluorine.",
"Accordingly, the use of SF 5 Cl can be used to produce high purity SF 6 .",
"Collectively, a variety of methods have been demonstrated as processes for the production of SF 6 and include U.S. Pat.",
"Nos.",
"2,883,267, 2,912,307, 3,054,661, 3,345,277, 3,399,036, 3,373,000, 4,390,511, 5,639,435 and Japanese Patent No.",
"7,625,497.These methods frequently employ electrochemical preparation, high reaction temperatures and pressures, and/or utilize highly-reactive and/or costly reactants that can include F 2 , SF 5 Cl, IF 5 , SF 4 , ClF and HF.",
"SF 5 Br is also a valuable chemical compound that has been demonstrated as a reactant for the efficient production of SF 5 -radical bearing chemicals; also known as derivatives of SF 6 .",
"Currently available methods of producing fluoro-sulfur compounds suffer a number of drawbacks.",
"The drawbacks generally include the use of excessive temperatures, electrochemical preparation, expensive and/or hazardous reactants, the requirement for numerous successive steps or long reaction times, the production of low or variable yields and/or the generation of toxic by-products.",
"Accordingly, there is room for improvement in the synthesis of fluoro-sulfur compounds."
],
[
"<SOH> SUMMARY OF THE INVENTION <EOH>Described herein are methods for the synthesis of fluoro-sulfur compounds, more specifically SF 4 , SF 5 Cl, SF 5 Br and SF 6 .",
"The methods described herein generally require lower temperatures and pressure, produce high yields, in some cases require less time, do not use highly reactive oxidants or costly reactants and solvents that are commonly used in the synthesis of fluoro-sulfur compounds, and do not produce deleterious waste products when compared to previously-used methods.",
"One embodiment disclosed herein includes a method of producing a fluoro-sulfur compound or a compound made using the produced fluoro-sulfur compound comprising: admixing Br 2 , a metal fluoride reactant, and a sulfur reactant thereby initiating a reaction that produces a yield of the fluoro-sulfur compound of greater than about 10%.",
"In another embodiment, the admixing further includes Cl 2 .",
"In another embodiment, the reaction proceeds at temperature of about 10 to about 400° C. In another embodiment, either S 2 F 10 or BrF, BrF 3 , BrF 5 , CsBrF 4 , CsBrF 2 , acetonitrile, Dioxane, ClF, ClF 3 , NOF, HF, F 2 , (HF) n ⋅amine, IF 5 or combinations thereof are not added to the reaction.",
"Embodiments disclosed herein also include methods of producing SF 4 or a compound made using the produced SF 4 .",
"In one embodiment the method includes admixing a sulfur reactant, a metal fluoride reactant, and a Br 2 reactant thereby initiating a reaction that produces SF 4 at a yield of greater than about 10%.",
"In another embodiment of producing SF 4 or a compound made using the produced SF 4 , the reaction proceeds at a temperature of about 10 to about 400° C. In another embodiment of producing SF 4 or a compound made using the produced SF 4 , the sulfur reactant is S and the metal fluoride is KF and the admixing occurs at a stoichiometric ratio of about 4 KF to about 2Br 2 to about 1 S and the reaction proceeds at a temperature of about 10 to about 400° C. In another embodiment of producing SF 4 or a compound made using the produced SF 4 , the metal fluoride is an alkaline earth metal fluoride, an alkali metal fluoride, CsF, RbF, KF, BaF 2 , SrF 2 or a combination thereof and/or the sulfur reactant is S, S 2 Cl 2 , SCl 2 , S 2 Br 2 , SBr 2 or a combination thereof.",
"In an additional embodiment of producing SF 4 or a compound made using the produced SF 4 , the method includes admixing a sulfur reactant, a metal fluoride reactant, a Cl 2 reactant and a Br 2 reagent thereby initiating a reaction that produces SF 4 at a yield of greater than about 10%.",
"In another embodiment of producing SF 4 or a compound made using the produced SF 4 , the reaction proceeds at a temperature of about 10 to about 400° C. In another embodiment of producing SF 4 or a compound made using the produced SF 4 , the sulfur reactant is S and the metal fluoride is KF and the admixing occurs at a stoichiometric ratio of about 4 KF to about 1 Br 2 to about 1 S to about 2Cl 2 or the sulfur reactant is SCl 2 and the metal fluoride is KF and the admixing occurs at a stoichiometric ratio of about 4 KF to about 1 Br 2 to about 1 SCl 2 to about 1 Cl 2 and the reaction proceeds at a temperature of about 10 to about 400° C. In another embodiment of producing SF 4 or a compound made using the produced SF 4 , the metal fluoride is an alkaline earth metal fluoride, an alkali metal fluoride, CsF, RbF, KF, BaF 2 , NaF, SrF 2 or a combination thereof and/or the sulfur reactant is S, S 2 Cl 2 , SCl 2 , S 2 Br 2 , SBr 2 or a combination thereof.",
"Embodiments disclosed herein also include methods of producing SF 5 Cl or a compound made using the produced SF 5 Cl.",
"In one embodiment the method includes admixing a Cl 2 reactant, a sulfur reactant, a metal fluoride reactant, and Br 2 reagent thereby initiating a reaction that produces the SF 5 Cl at a yield of greater than about 50%.",
"In another embodiment of producing SF 5 Cl or a compound made using the produced SF 5 Cl, the reaction proceeds at a temperature of about 10 to about 200° C. In another embodiment of producing SF 5 Cl or a compound made using the produced SF 5 Cl, the sulfur reactant is S and the metal fluoride is KF and the admixing occurs at a stoichiometric ratio of about 5 KF to about 1 Br 2 to about 1 S to about 3Cl 2 or the sulfur reactant is SF 4 and the metal fluoride is KF and the admixing occurs at a stoichiometric ratio of about 1 KF to about 1 Br 2 to about 1 SF 4 to about 1Cl 2 or the sulfur reactant is SCl 2 and the metal fluoride is KF and the admixing occurs at a stoichiometric ratio of about 5 KF to about 1 Br 2 to about 1 SCl 2 to about 2Cl 2 and the reaction proceeds at a temperature of about 10 to about 200° C. In another embodiment of producing SF 5 Cl or a compound made using the produced SF 5 Cl, the metal fluoride is an alkaline earth metal fluoride, an alkali metal fluoride, CsF, RbF, KF, BaF 2 , SrF 2 or a mixture thereof and/or the sulfur reactant S, S 2 Cl 2 , SCl 2 , SF 4 or a combination thereof.",
"Embodiments disclosed herein also include methods of producing SF 5 Br or a compound made using the produced SF 5 Br.",
"In one embodiment the method includes admixing a Br 2 reactant, a sulfur reactant, and a metal fluoride reactant thereby initiating a reaction that produces SF 5 Br at a yield of greater than about 50%.",
"In another embodiment of producing SF 5 Br or a compound made using the produced SF 5 Br, either S 2 F 10 or BrF, BrF 3 , BrF 5 , CsBrF 4 , CsBrF 2 or mixtures thereof are not added to the reaction.",
"In another embodiment of producing SF 5 Br or a compound made using the produced SF 5 Br, the reaction proceeds at a temperature of about 10 to about 140° C. In another embodiment of producing SF 5 Br or a compound made using the produced SF 5 Br, the sulfur reactant is SF 4 and the metal fluoride is AgF and the admixing occurs at a stoichiometric ratio of about 1 AgF to about 1 Br 2 to about 1 SF 4 or the sulfur reactant is SF 4 and the metal fluoride is AgF 2 and the admixing occurs at a stoichiometric ratio of about 2 AgF 2 to about 3 Br 2 to about 4 SF 4 and the reaction proceeds at a temperature of about 10 to about 140° C. In another embodiment of producing SF 5 Br or a compound made using the produced SF 5 Br, the metal fluoride is an alkaline earth metal fluorides, an alkali metal fluorides, AgF 2 , AgF, AuF, MnF 3 , PbF 4 , CeF 4 or a mixture thereof.",
"Embodiments disclosed herein also include methods of producing SF 6 or a compound made using the produced SF 6 .",
"In one embodiment, the method includes: admixing a Br 2 reactant, an SF 4 reactant, and a metal fluoride reactant thereby initiating a reaction that produces SF 6 at a yield of greater than about 50%.",
"In another embodiment of producing SF 6 or a compound made using the produced SF 6 , the reaction proceeds at a temperature of about 10 to about 400° C. In another embodiment of producing SF 6 or a compound made using the produced SF 6 , the sulfur reactant is SF 4 and the metal fluoride is CoF 3 and the admixing occurs at a stoichiometric ratio of about 2 CoF 3 to about 1 Br 2 to about 1 SF 4 and the reaction proceeds at a temperature of about 10 to about 400° C. In another embodiment of producing SF 6 or a compound made using the produced SF 6 , the metal fluoride is selected from the group consisting of an alkaline earth metal fluoride, an alkali metal fluoride, CoF 3 , MnF 3 , PbF 4 , CeF4 or a mixture thereof.",
"detailed-description description=\"Detailed Description\" end=\"lead\"?"
],
[
"CROSS REFERENCE TO RELATED APPLICATIONS This application is a divisional of U.S. patent application Ser.",
"No.",
"12/746,717, filed Jun.",
"7, 2010 and claims the benefit of U.S.",
"Provisional Patent Application No.",
"61/060,642, filed Jun.",
"11, 2008, U.S.",
"Provisional Patent Application No.",
"61/153,180, filed Feb. 17, 2009, U.S.",
"Provisional Patent Application No.",
"61/176,674, filed May 8, 2009, and U.S. Non-Provisional patent application Ser.",
"No.",
"12/746,717, filed Jun.",
"7, 2010, which is a national stage application of PCT Patent Application No.",
"PCT/US09/47116, filed Jun.",
"11, 2009, the entire disclosures of which are incorporated herein by reference.",
"FIELD OF THE INVENTION Disclosed herein are methods of synthesizing fluoro-sulfur compounds.",
"The disclosed methods use bromine to promote the synthesis of fluoro-sulfur compounds while avoiding the use excessive temperatures, electrochemical preparation, or the use of traditionally used solvents or reactants generally deemed less desirable due to toxicity, excess reactivity or cost.",
"BACKGROUND OF THE INVENTION A number of fluoro-sulfur compounds have beneficial applications.",
"For example, sulfur tetrafluoride (SF4) is a widely-used compound produced yearly at the metric ton level, which can be utilized as a deoxofluorinating reagent in converting carboxylic acids, aldehydes, some alcohols and ketones into their corresponding deoxofluorine derivatives (i.e.",
"R—CF3, R—CHF2, RF, RR′—CF2).",
"SF4 is also utilized as an etching agent in the electronics industry.",
"Moreover, SF4 can be utilized as a precursor for the synthesis of other important fluorinated products such as, without limitation, pentafluorosulfur chloride (SF5Cl), pentafluorosulfur bromide (SF5Br), and sulfur hexafluoride (SF6).",
"Sulfur hexafluoride (SF6), is a compound that is produced by the thousands of metric tons each year, and its worldwide uses include: acting as a PCB replacement and an inert dielectric medium for electrical equipment, the etching of semiconductors, the casting of magnesium, the manufacture of thermal windows, a source of thrust in some rocket propulsion systems, the tracing of air flow through industrial systems, a tamponade for retinal holes of the eye and in medical imaging.",
"Compounds harboring fluoro-organic modifications such as R—CF3, R—CHF2, RF, RR′—CF2 and RSF5, have been used in a variety of applications including fluorinated therapeutic and diagnostic drugs, pesticides, herbicides, antibiotics, perfluorinated blood substitutes, fungicides, polymer solvents, polymers, lubricants, liquid crystals, surface-active agents, high-boiling solvents, stable solvents, electrically conducting polymers and the like.",
"Utilizing an SF5 group in the place of CF3 offers many advantages.",
"Particularly, the SF5 group possesses greater electronegativity than CF3.Moreover, compounds containing SF5 may be further distinguished by their outstanding chemical properties including high to extreme chemical and thermal stability, hydro- and oleophobicity, lipophilicity, high-density, reduction of shock sensitivity in explosives, low boiling point, low polarizability and low surface tension.",
"While SF5-derivatives offer these advantages, they have been difficult to synthesize.",
"The difficulty of obtaining such compounds is in part related to the difficulty of obtaining sufficient and affordable quantities of SF5Cl or SF5Br, which are the principal chemical reagents used to synthesize and obtain a number of organic or inorganic derivatives that bear the SF5-radical moiety.",
"SF5Cl, particularly, is a valuable reactant to produce SF5-radical bearing derivatives of (sulfur hexafluoride) SF6 and may be reduced to disulfur decafluoride (S2F10) with the latter being converted into pentafluorosulfur bromide (SF5Br).",
"SF5Cl can also be used in the synthesis of SF6.It is of interest that SF5Cl can be particularly used in the manufacture of SF6 by a pyrogenic route (e.g.",
"U.S. Pat.",
"No.",
"4,390,511), whereby a disproportionation occurs according to the following reaction: SF5Cl→½SF6+½SF4+½Cl2 In this method, SF6 is obtained that is free of S2F10, a compound believed to be highly toxic and a by-product of the manufacture of SF6 by the reaction of sulfur with fluorine.",
"Accordingly, the use of SF5Cl can be used to produce high purity SF6.Collectively, a variety of methods have been demonstrated as processes for the production of SF6 and include U.S. Pat.",
"Nos.",
"2,883,267, 2,912,307, 3,054,661, 3,345,277, 3,399,036, 3,373,000, 4,390,511, 5,639,435 and Japanese Patent No.",
"7,625,497.These methods frequently employ electrochemical preparation, high reaction temperatures and pressures, and/or utilize highly-reactive and/or costly reactants that can include F2, SF5Cl, IF5, SF4, ClF and HF.",
"SF5Br is also a valuable chemical compound that has been demonstrated as a reactant for the efficient production of SF5-radical bearing chemicals; also known as derivatives of SF6.Currently available methods of producing fluoro-sulfur compounds suffer a number of drawbacks.",
"The drawbacks generally include the use of excessive temperatures, electrochemical preparation, expensive and/or hazardous reactants, the requirement for numerous successive steps or long reaction times, the production of low or variable yields and/or the generation of toxic by-products.",
"Accordingly, there is room for improvement in the synthesis of fluoro-sulfur compounds.",
"SUMMARY OF THE INVENTION Described herein are methods for the synthesis of fluoro-sulfur compounds, more specifically SF4, SF5Cl, SF5Br and SF6.The methods described herein generally require lower temperatures and pressure, produce high yields, in some cases require less time, do not use highly reactive oxidants or costly reactants and solvents that are commonly used in the synthesis of fluoro-sulfur compounds, and do not produce deleterious waste products when compared to previously-used methods.",
"One embodiment disclosed herein includes a method of producing a fluoro-sulfur compound or a compound made using the produced fluoro-sulfur compound comprising: admixing Br2, a metal fluoride reactant, and a sulfur reactant thereby initiating a reaction that produces a yield of the fluoro-sulfur compound of greater than about 10%.",
"In another embodiment, the admixing further includes Cl2.In another embodiment, the reaction proceeds at temperature of about 10 to about 400° C. In another embodiment, either S2F10 or BrF, BrF3, BrF5, CsBrF4, CsBrF2, acetonitrile, Dioxane, ClF, ClF3, NOF, HF, F2, (HF)n⋅amine, IF5 or combinations thereof are not added to the reaction.",
"Embodiments disclosed herein also include methods of producing SF4 or a compound made using the produced SF4.In one embodiment the method includes admixing a sulfur reactant, a metal fluoride reactant, and a Br2 reactant thereby initiating a reaction that produces SF4 at a yield of greater than about 10%.",
"In another embodiment of producing SF4 or a compound made using the produced SF4, the reaction proceeds at a temperature of about 10 to about 400° C. In another embodiment of producing SF4 or a compound made using the produced SF4, the sulfur reactant is S and the metal fluoride is KF and the admixing occurs at a stoichiometric ratio of about 4 KF to about 2Br2 to about 1 S and the reaction proceeds at a temperature of about 10 to about 400° C. In another embodiment of producing SF4 or a compound made using the produced SF4, the metal fluoride is an alkaline earth metal fluoride, an alkali metal fluoride, CsF, RbF, KF, BaF2, SrF2 or a combination thereof and/or the sulfur reactant is S, S2Cl2, SCl2, S2Br2, SBr2 or a combination thereof.",
"In an additional embodiment of producing SF4 or a compound made using the produced SF4, the method includes admixing a sulfur reactant, a metal fluoride reactant, a Cl2 reactant and a Br2 reagent thereby initiating a reaction that produces SF4 at a yield of greater than about 10%.",
"In another embodiment of producing SF4 or a compound made using the produced SF4, the reaction proceeds at a temperature of about 10 to about 400° C. In another embodiment of producing SF4 or a compound made using the produced SF4, the sulfur reactant is S and the metal fluoride is KF and the admixing occurs at a stoichiometric ratio of about 4 KF to about 1 Br2 to about 1 S to about 2Cl2 or the sulfur reactant is SCl2 and the metal fluoride is KF and the admixing occurs at a stoichiometric ratio of about 4 KF to about 1 Br2 to about 1 SCl2 to about 1 Cl2 and the reaction proceeds at a temperature of about 10 to about 400° C. In another embodiment of producing SF4 or a compound made using the produced SF4, the metal fluoride is an alkaline earth metal fluoride, an alkali metal fluoride, CsF, RbF, KF, BaF2, NaF, SrF2 or a combination thereof and/or the sulfur reactant is S, S2Cl2, SCl2, S2Br2, SBr2 or a combination thereof.",
"Embodiments disclosed herein also include methods of producing SF5Cl or a compound made using the produced SF5Cl.",
"In one embodiment the method includes admixing a Cl2 reactant, a sulfur reactant, a metal fluoride reactant, and Br2 reagent thereby initiating a reaction that produces the SF5Cl at a yield of greater than about 50%.",
"In another embodiment of producing SF5Cl or a compound made using the produced SF5Cl, the reaction proceeds at a temperature of about 10 to about 200° C. In another embodiment of producing SF5Cl or a compound made using the produced SF5Cl, the sulfur reactant is S and the metal fluoride is KF and the admixing occurs at a stoichiometric ratio of about 5 KF to about 1 Br2 to about 1 S to about 3Cl2 or the sulfur reactant is SF4 and the metal fluoride is KF and the admixing occurs at a stoichiometric ratio of about 1 KF to about 1 Br2 to about 1 SF4 to about 1Cl2 or the sulfur reactant is SCl2 and the metal fluoride is KF and the admixing occurs at a stoichiometric ratio of about 5 KF to about 1 Br2 to about 1 SCl2 to about 2Cl2 and the reaction proceeds at a temperature of about 10 to about 200° C. In another embodiment of producing SF5Cl or a compound made using the produced SF5Cl, the metal fluoride is an alkaline earth metal fluoride, an alkali metal fluoride, CsF, RbF, KF, BaF2, SrF2 or a mixture thereof and/or the sulfur reactant S, S2Cl2, SCl2, SF4 or a combination thereof.",
"Embodiments disclosed herein also include methods of producing SF5Br or a compound made using the produced SF5Br.",
"In one embodiment the method includes admixing a Br2 reactant, a sulfur reactant, and a metal fluoride reactant thereby initiating a reaction that produces SF5Br at a yield of greater than about 50%.",
"In another embodiment of producing SF5Br or a compound made using the produced SF5Br, either S2F10 or BrF, BrF3, BrF5, CsBrF4, CsBrF2 or mixtures thereof are not added to the reaction.",
"In another embodiment of producing SF5Br or a compound made using the produced SF5Br, the reaction proceeds at a temperature of about 10 to about 140° C. In another embodiment of producing SF5Br or a compound made using the produced SF5Br, the sulfur reactant is SF4 and the metal fluoride is AgF and the admixing occurs at a stoichiometric ratio of about 1 AgF to about 1 Br2 to about 1 SF4 or the sulfur reactant is SF4 and the metal fluoride is AgF2 and the admixing occurs at a stoichiometric ratio of about 2 AgF2 to about 3 Br2 to about 4 SF4 and the reaction proceeds at a temperature of about 10 to about 140° C. In another embodiment of producing SF5Br or a compound made using the produced SF5Br, the metal fluoride is an alkaline earth metal fluorides, an alkali metal fluorides, AgF2, AgF, AuF, MnF3, PbF4, CeF4 or a mixture thereof.",
"Embodiments disclosed herein also include methods of producing SF6 or a compound made using the produced SF6.In one embodiment, the method includes: admixing a Br2 reactant, an SF4 reactant, and a metal fluoride reactant thereby initiating a reaction that produces SF6 at a yield of greater than about 50%.",
"In another embodiment of producing SF6 or a compound made using the produced SF6, the reaction proceeds at a temperature of about 10 to about 400° C. In another embodiment of producing SF6 or a compound made using the produced SF6, the sulfur reactant is SF4 and the metal fluoride is CoF3 and the admixing occurs at a stoichiometric ratio of about 2 CoF3 to about 1 Br2 to about 1 SF4 and the reaction proceeds at a temperature of about 10 to about 400° C. In another embodiment of producing SF6 or a compound made using the produced SF6, the metal fluoride is selected from the group consisting of an alkaline earth metal fluoride, an alkali metal fluoride, CoF3, MnF3, PbF4, CeF4 or a mixture thereof.",
"DETAILED DESCRIPTION OF THE INVENTION Described herein are methods for the synthesis of fluoro-sulfur compounds in the presence of Br2.In certain exemplary embodiments the fluoro-sulfur compounds are SF4, SF5Cl SF5Br and SF6.The methods disclosed herein involve the mixing of readily available and relatively inexpensive reactants.",
"When compared to previously-used approaches, the methods described herein generally require lower temperatures and pressure, produce high yields, require less time, do not use excessively reactive or costly reactants and solvents that are frequently utilized in the synthesis of the fluoro-sulfur compounds, do not produce deleterious waste products or one or more of the above in various combinations.",
"Disclosed methods of synthesizing SF4 utilize Br2 in both the presence and absence of Cl2, whereas disclosed methods of synthesizing SF5Cl utilize Br2 in the presence of Cl2.Disclosed methods of synthesizing SF4 and SF5Cl can utilize Br2 in the absence of excessive temperature and pressure, and, in certain embodiments, in the absence of acetonitrile, Dioxane, ClF, ClF3, NOF, HF, F2, (HF)n⋅amine and/or IF5.Disclosed methods of synthesizing SF6Br utilize Br2 and can be carried out in the absence of high reaction temperatures and pressures, and in certain embodiments, in the absence of S2F10, BrF3, BrF5, CsBrF4 and/or CsBrF2.Disclosed methods of synthesizing SF6 utilize Br2 and can be carried out in the absence of electrochemical preparation, high reaction temperatures and/or pressures, and, in certain embodiments, in the absence of F2, SF5Cl, IF5, SF4, ClF and/or HF.",
"As used herein “metal fluoride (MF)” encompasses a variety of mono or multivalent MFs including, without limitation, alkaline earth fluorides and alkali metal fluorides and can particularly include, without limitation, CoF3, CeF4, MnF3, PbF4, CsF, RbF, KF, BaF2, SrF2, AgF2, AgF and AuF.",
"As used herein, the term “about” is used to indicate that a value includes the standard deviation of error for the device or method being employed to determine the value.",
"In one example embodiment, the synthesis of SF4 is described.",
"One example synthesis reaction for SF4 can proceed as follows in reaction I: 4KF+S+2Br2SF4+4KBr I.",
"In reaction I, the SF4-producing reaction can proceed at autogenous or elevated reaction pressures at ambient temperatures of about 10 to about 27° C., or at a mildly-elevated temperatures of up to about 80° C., or even at higher temperatures that are below those (about 400 to about 500° C.) which promote SF4 to disproportionate into S and SF6.Accordingly, the described methods do not require excessive temperatures or pressures or require the use of unusually reactive or costly reactants or solvents that are commonly used in the synthesis of SF4, such as, but not limited to acetonitrile, Dioxane, HF, F2, Cl2, (HF)n⋅amine and IF5.The described reaction I can produce yields ranging from about 57 to about 96% or greater, in a time frame of several hours to several days.",
"Due to the low cost of the reagents used, modifying the reaction to produce lower yields can also be commercially advantageous.",
"In one embodiment, yields of 10% or higher can be produced.",
"This reaction does not create or leave behind undesirable side products.",
"Only Br2, MFs and sulfur bromides that can easily be removed and discarded or recycled into subsequent production runs of SF4 or other unrelated chemical reactions, are created.",
"Moreover, the disclosed reaction produces little or no gases, other than SF4, making purification of the SF4 end-product a simple process.",
"Particularly, low boiling constituents (SF4) or excess unused Br2 can be separated by lowering the temperature and transferring into a cold trap.",
"This described reaction I provides a method for synthesizing SF4 employing Br2 in the absence of Cl2.The absence of Cl2 in this reaction prevents the formation of SF5Cl when SF4 is the desired SF4 end-product.",
"In another example embodiment, either S, Br2, or both S and Br2 can be replaced by sulfur bromides (e.g.",
"S2Br2, SBr2) in the production of SF4.In one embodiment, specifically relating to reaction I, S to Br2 molar ratios of greater than about 1.00:2.00 can be used.",
"In alternative embodiments, ratios ranging from about 1.00:0.44 to about 1.00:5.33 can also be used.",
"In another example embodiment, particularly useful MFs in the production of SF4 and SF5Cl include, without limitation, CsF, RbF, KF, BaF2, SrF2 or a combination thereof.",
"Further described herein are methods for the production of SF5Cl, and optionally SF4 (in the presence of Cl2), utilizing Br2 as a solvent and/or reactive solvent.",
"In the case of S as a reactant, when SF4 is the desired product, slightly more than about four equivalents of the MF can be used.",
"If SF5Cl is the desired product, slightly more than about five equivalents of the MF can be used.",
"When SF4 is used as a reactant to produce SF5Cl, an equivalent or slightly larger amount of the MF can be utilized to efficiently produce the SF5Cl.",
"The minimum amount of Cl2 in the reactions can easily be determined by the stoichiometry of the reaction itself.",
"In the present example embodiment, KF is used as the MF, however, a variety of other mono or multivalent MFs can be used.",
"Example synthesis reactions for SF4 and SF5Cl in the presence of Cl2 as described above proceed as follows in reactions II-IV: 4KF+S+2Cl2+(Br2)→SF4+4KCl+(Br2) II.",
"5KF+S+3Cl2+(Br2)→SF5Cl+5KCl+(Br2) III.",
"KF+SF4+Cl2+(Br2)→SF5Cl+KCl+(Br2) IV.",
"In reactions II-IV above, the SF5Cl— and SF4-producing reactions can proceed at autogenous or elevated reaction pressures, at ambient temperatures of about 10 to about 27° C., or at a mildly-elevated temperatures of up to about 115° C., or, even at higher temperatures that are below those which promote decomposition of SF5Cl (about 200 to about 400° C.), or cause SF4 to disproportionate into S and SF6 (about 400 to about 500° C.).",
"Accordingly, the described methods do not require excessive temperatures or pressures or require the use of unusually reactive or costly reactants or solvents that are commonly used in the synthesis of SF4 and SF5Cl, such as, but not limited to acetonitrile, Dioxane, ClF, ClF3, NOF, HF, F2, (HF)n⋅amine and IF5.The described reaction III above can produce yields of about 88 to about 95% or greater and can theoretically approach 100%, in a time frame of several hours to several weeks.",
"Due to the low cost of the reagents used, modifying the reaction to produce lower yields can also be commercially advantageous.",
"In one embodiment, yields of 50% or higher can be produced.",
"Other lower yields, such as yields as low as 10%, are also within the scope of embodiments disclosed herein.",
"This reaction does not create or leave behind undesirable side products.",
"Br2 can be easily separated from the reaction products and then SF5Cl and any excess Cl2 can be collected by cooling the reaction vessel to approximately −80° C. and condensing out SF5Cl and any excess Cl2 at reduced pressure.",
"Cl2 can be removed from the mixture by storage over elemental sulfur and the recovered sulfur chlorides can be used for a new production batch of either SF4 or SF5Cl.",
"One function of the chlorine in the procedure is to oxidize sulfur to sulfur chlorides (e.g.",
"S2Cl2, SCl2) as the predominant sulfur species, which exchange chlorine for fluorine with a fluoride.",
"Thus, it will not be necessary to dispose of sulfur chlorides as waste.",
"Collectively, the recovered Cl2 as well as the recovered sulfur chlorides and Br2, may be used in a near quantitative fashion, as outlined in the following reactions: 4KF+SCl2+Cl2+(Br2)→SF4+4KCl+(Br2) V. 5KF+SCl2+2Cl2+(Br2)SF5Cl+5KCl+(Br2) VI.",
"In the SF4-producing reaction, a small amount of SF5Cl may be formed as a by-product.",
"In each of the reactions, the function of Br2 may be to provide an improved reaction environment with Br2 possibly acting as a solvent, a reactive solvent or with Cl2 forming BrCl from the Br2+Cl2 upon mixing.",
"Interestingly, it has been shown previously, that without the addition of Br2, KF+SF4+Cl2 yields, upon intense heating (about 75 to about 150° C. or about 220 to about 300° C.) only variable amounts (about 5 to about 80%) of SF5Cl (Bekker et al., Isw.",
"Akad.",
"Nauk U.S.S.R., Bull.",
"Ser.",
"Chim.",
"2575, 1970; U. Jonethal, R. Kuschel, K. Seppelt, J. Fl.",
"Chem.",
"88, 3, 1998).",
"Thus, the Br2 utilized in the present methods alleviates the requirement for excessive temperature (energy input), and also improves both the yield and the consistency of the yield, as well as the overall ease of production.",
"Moreover, when using S instead of SF4 as the sulfur source to produce SF5Cl, the use of Br2 alleviates both the requirement for SF4 and excessive temperature, as other methods which do not utilize Br2 (excess CsF+S+3 Cl2 at about 175° C.) do not produce meaningful amounts of SF5Cl.",
"The methods described herein employ the use of Br2 as a solvent or reactive solvent in the production of SF5Cl and SF4, which in turn promotes the transfer of both fluorine and chlorine into the production of the SF5Cl and SF4 end-products.",
"Alternatively, in the SF5Cl-producing reaction, S and Cl2 may be replaced by sulfur chlorides (e.g.",
"S2Cl2, SCl2) or SF4, if desired.",
"In both the SF5Cl— and SF4-producing reactions described herein, when there is insufficient Br2 present, the reactions are either extremely slow or do not progress at all.",
"Further, in both the SF5Cl— and SF4-producing reactions that utilize Cl2 as a reactant, a Br2 to S molar ratio greater than about 1:1 can be used.",
"Ratios of from about 1:2 to about 2:1 can also be used.",
"Particularly useful MFs in the production of SF5Cl and SF4 include, without limitation, CsF, RbF, KF, BaF2, SrF2 and combinations thereof.",
"In another example embodiment disclosed herein, the synthesis of SF5Br is described.",
"In the case where SF4 and Br2 are reactants, more than about 1 equivalent of a metal monofluoride (AgF) can be used or about 2 equivalents can be used in the case of a metal difluoride (AgF2).",
"Example synthesis reactions for SF5Br can proceed as follows: AgF+SF4+Br2→SF5Br+AgBr VII.",
"2AgF2+4SF4+3Br2→4SF5Br+2AgBr VIII.",
"These reactions can be run at ambient temperatures (about 10 to about 27° C.) or at temperatures up to those at which SF5Br begins to decompose (about 140 to about 150° C.) and at the autogenous pressures generated in closed reactor vessels.",
"Highly-reactive and/or costly reactants that are commonly used to synthesize SF5Br, such as, without limitation, S2F10, BrF3, BrF5, CsBrF4 and CsBrF2 are not necessary.",
"The described reaction can produce yields of about 75% and can theoretically approach 100%, in a time frame of several hours to several days.",
"Due to the low cost of the reagents used, modifying the reaction to produce lower yields can also be commercially advantageous.",
"In one embodiment, yields of 50% or higher can be produced.",
"Other lower yields, such as yields as low as 10%, are also within the scope of embodiments disclosed herein.",
"The reaction does not create or leave behind undesirable side products.",
"SF5Br and any excess Br2 can be collected by cooling the reaction vessel to approximately −78° C. and condensing out the SF5Br.",
"The Br2 can be easily recycled into subsequent reactions including, without limitation, the production of SF5Br, whereas AgBr can be readily reutilized in subsequent reactions including, without limitation, SF5Br reactions by reforming the metal fluoride (without limitation, AgF or AgF2).",
"In one example embodiment, the present SF5Br production methods can employ only SF4, a MF, for example and without limitation, AgF or AgF2, and Br2 as reactants.",
"Particularly useful MFs in the production of SF5Br include, without limitation, CeF4, MnF3, PbF4, AgF2, AgF, AuF or a mixture thereof.",
"Further, the methods described herein for producing SF5Br eliminate inefficient multi-step production protocols that are currently used.",
"In another example embodiment disclosed herein, the synthesis of SF6 is described.",
"In the case where SF4 and Br2 are reactants, more than about 2 equivalents of a MF capable of transferring about one fluorine equivalent, such as CoF3, can be used.",
"An example synthesis reaction for SF6 can proceed as follows: 2CoF3+SF4+(Br2)→SF6+2CoF2+(Br2) IX.",
"Reaction IX shown above can be run at ambient temperatures or theoretically up to temperatures at which SF4 begins to decompose (about 400 to about 500° C.), and at the autogenous pressures generated in closed reactor vessels.",
"Electrochemical preparation, high temperatures and pressures as well as highly-reactive and/or costly reactants (without limitation, F2, SF5Cl, IF5, SF4, ClF and HF) that are commonly used to synthesize SF6 can be avoided.",
"Due to the low cost of the reagents used, modifying the reaction to produce lower yields can also be commercially advantageous.",
"In one embodiment, yields of 50% or higher can be produced.",
"Other lower yields, such as yields as low as 10%, are also within the scope of embodiments disclosed herein.",
"In the described reaction IX, the Br2 can be easily recycled into subsequent reactions including, without limitation, the production of additional SF6, whereas CoF2 can be readily re-fluorinated to CoF3 and reutilized in subsequent SF6 reactions as well as other reactions.",
"In one example embodiment, the present SF6 production methods can employ only SF4, a MF, for example and without limitation, CeF4, MnF3, PbF4, AgF2, AgF, AuF and mixtures thereof as reactants.",
"Further, the methods described herein for producing SF6 eliminate inefficient multi-step production protocols that are currently used.",
"The reactions described herein for producing SF4, SF5Cl, SF5Br and SF6 can be performed at temperatures below those commonly used in the art.",
"In one example embodiment, the reactions are carried out at or near room (ambient) temperature (about 10 to about 27° C.).",
"In other embodiments, the temperature is from about 10° C. to about 27° C. (ambient), or from about 27° C. to about 115° C. Higher temperatures can theoretically be used, for example, up to about 250° C. to about 500° C. (up to temperatures at which SF4, SF5Cl and SF5Br decompose).",
"Additionally, lower temperatures can be used, for example down to about −10° C.; a temperature at which Br2 would solidify.",
"While permissible, however, these more extreme reaction temperatures are not required.",
"The reactions described herein for producing SF4, SF5Cl, SF5Br and SF6 can be performed at pressures below those commonly used in the art.",
"In one example embodiment, the reactions are carried out just above atmospheric pressure, at autogenous pressures that are estimated of only up to about 10 atms.",
"In other embodiments, at higher temperatures, the pressure is estimated to be from about 10 atm to about 40 atm.",
"Slightly higher pressures can also be used.",
"For example, it is estimated that up to about 100 atm could be used.",
"Additionally, lower pressures can be used, for example down to about 0.5 atms, or about 0.01 atms, or about 0.001 atms.",
"While permissible, however, these more extreme pressures are not required.",
"Further, in some embodiments, the reactions for producing SF4, SF5Cl, SF5Br and SF6 described herein can be carried out in one or more physical configuration that increases the reaction surface area of the solid phase reactants.",
"For example, the solid phase reactants can be spray-dried, finely dispersed, or otherwise subjected to commonly used methods which increase the surface area.",
"In some example embodiments, the reactants for producing SF4, SF5Cl, SF5Br and SF6 can be physically or mechanically agitated to aid the reactions.",
"For example, inversion, milling/grinding, ball-milling, stirring, rotation, and the like can be used.",
"Such mechanical agitation methods can minimize MFBr or MFCl formation that can mask the effective MF reaction surface area and slow the progression of desired reactions.",
"The methods described herein theoretically can generate SF4, SF5Cl, SF5Br and SF6 at near 100% yields.",
"In one example embodiment, the yield is between about 57% and about 96%.",
"In another embodiment the yield is about 95% In another embodiment, the yield is about 75%.",
"As will be understood by one of ordinary skill in the art, depending on the reactants used and the desired end-products, the conditions of the reaction and the like, the time for a reaction to be substantially complete varies.",
"Substantially complete means a particular reaction is within about 10% of completion, within about 5% of completion or within about 1% or less of completion.",
"Reaction times can be as short as about a few hours to as long as about several days or weeks.",
"In some embodiments, the reactions are substantially complete within less than about 30 days, less than about 17 days, less than about 14 days, less than about 6 days, less than about 4 days, less than about 3 days, less than about 2 days or less than about 1 day.",
"In other embodiments, the reactions are substantially complete within less than about 8 hours, less than about 4 hours or less than about 3 hours.",
"Reactions described herein can be modified by those skilled in the art.",
"As such, altering the order of adding and mixing of reactants and reagents, adjusting relative molar ratios of reactants, as well as altering reaction times, temperatures and pressures, to more precisely control specific reaction outcomes, and maximizing the ease and production of the desired end product are within the scope of the present description.",
"The following examples are included to demonstrate embodiments of the disclosed methods and processes.",
"It should be appreciated by those of ordinary skill in the art that the techniques disclosed in the examples which follow represent techniques discovered by the inventor to function well in the practice of the present disclosure, and thus can be considered to constitute preferred modes for its practice.",
"However, those of ordinary skill in the art should, in light of the present disclosure, appreciate that many changes can be made in the specific embodiments which are disclosed and still obtain a like or similar result.",
"Example 1.Formation of SF4 Anhydrous fine grain KF powder (about 5.09 g) was dried in a stainless steel 100-ml Hoke bomb tube reactor at about 150° C. to about 200° C., for about 1 hour, at high vacuum (about 0.05 to about 0.1 torr).",
"The reactor was allowed to cool to ambient temperature, opened, and fine-grain S powder (about 0.69 g) was added.",
"Cl2 (about 3.13 g) and Br2 (about 1.5 g) were then added to the reactor vessel by condensation to produce a molar ratio of S:Cl2:KF:Br2 of about 1.0:2.0:4.1:0.44.The vessel was kept at ambient temperature overnight and little or no SF5Cl and SF4 were detected from the infrared (IR) spectrum of the gaseous phase.",
"IR spectrometry was performed using a Model 4020 Galaxy FTIR spectrophotometer (Mattson Instruments, Madison, Wis. 53711, USA).",
"No change in the IR spectrum was noticed after about four more days.",
"More Br2 (about 5.5 g) was added to the reactor vessel by condensation to produce a new molar ratio of: S:Cl2:KF:Br2 of about 1:2.0:4.1:2.0.After about 4 days at ambient temperature, a very strong SF4-specific spectral signal was observed (e.g.",
"band groups centered at about 876 cm−1 and about 730 cm−1), which was accompanied by a very weak SF5Cl IR spectral signal (e.g.",
"band groups centered at about 909 cm−1, about 855 cm−1 and about 602 cm−1), The reaction displayed a high degree of conversion to SF4, as indicated by the IR spectrum.",
"This example illustrates that: 1.)",
"increasing the molar ratio of Br2 appears to promote the formation of SF4, and 2.)",
"SF4 can be efficiently synthesized within about 4 days at ambient temperatures in the reaction: 4KF+S+2Cl2+(Br2)→SF4+4KCl+(Br2).",
"Example 2.Formation of SF4 at an Elevated Temperature Anhydrous fine-grain KF powder (about 10.50 g) was dried in a stainless steel 100-ml Hoke bomb tube reactor at about 150° C. to 200° C., for about 1 hour, at high vacuum.",
"The reactor was allowed to cool to ambient temperature, opened, and fine-grain S powder (about 1.37 g) was added.",
"Cl2 (about 6.1 g) and Br2 (about 14.3 g) were then added to the reactor vessel by condensation to produce a molar ratio of S:Cl2:KF:Br2 of about 1.00:2.00:4.23:2.09.The vessel was then kept at a temperature of 65-70° C. for 30 days.",
"Initially, some SF5Cl besides SF4 was detected in the IR spectrum of the gaseous constituents of the reactor bomb tube, but it disappeared in the course of time and no SF5Cl was detected after 30 days, only SF4.",
"(IR spectrometry was performed).",
"The reactor vessel bomb tube was cooled to −78° C., and pumped on through a liquid-nitrogen cooled cold trap for two hours.",
"The crude product (4.6 g) was stored in a reactor vessel bomb tube over sulfur (20 g) for 20 hours to remove excess chlorine that might be present.",
"After cooling the sulfur-treatment vessel to −78° C., the product was collected in a cold trap (liquid nitrogen) as before.",
"A yellow tinge was removed by treatment with Hg.",
"The final mass of the recovered SF4 end product was about 4.08 g for a calculated yield of about 88% (based upon sulfur).",
"The final SF4 product appeared as a colorless liquid (when cold), showing the characteristic bands of SF4 in the IR spectrum.",
"This example illustrates that: 1.)",
"increasing the temperature appears to promote the formation of SF4, and 2.)",
"SF4, free of SF5Cl, can be efficiently synthesized in the reaction: 4KF+S+2Cl2+(Br2)→SF4+4KCl+(Br2) Example 3.Alternate Formation of SF4 in the Absence of Cl2 Anhydrous fine-grain KF (about 24.2 g) was dried in a stainless steel 300-ml Hoke bomb tube reactor at about 150° C. to about 200° C., for about 1 hour, at high vacuum.",
"The reactor was allowed to cool to ambient temperature, opened, and fine-grain S powder (about 3.24 g) was added.",
"Br2, representing a molar ratio of S to Br2 of greater than about two (about 86.4 g), was then added to the reactor vessel by condensation to produce a final molar ratio of S:KF:Br2 of about 1.00:4.10:5.30.After about 3 days at ambient temperature, a strong SF4 IR spectral signal was observed and the reaction displayed a high degree of conversion to SF4.After an additional 3 days at ambient temperature, no significant change was noticed in the IR spectrum.",
"The final SF4 product was isolated as follows: The reaction vessel was cooled on a dry ice bath (about −78° C.) and connected via a liquid nitrogen cold trap (about −196° C.) to a vacuum pump.",
"After about 1.5 hours, about 11.5 grams of a light brown, presumably bromine-contaminated crude product was obtained.",
"To remove residual contaminants (e.g.",
"Br2, Sulfur Bromides), the crude product was condensed into a large glass pressure vessel containing about 10 grams of Hg to remove trace amounts of any discoloring contaminants (i.e.",
"e.g.",
"Br2).",
"After brief shaking at about 0° C., the product was condensed into a cold trap and obtained as a colorless liquid.",
"The final mass of the recovered end product was about 10.5 g for a calculated yield of about 96% (based upon sulfur).",
"The IR spectrum of the end product revealed a substantially pure sample of SF4, with a small contamination by SOF2 (e.g.",
"band groups centered at about 1340 cm−1 and about 808 cm−1 and about 750 cm−1).",
"This example illustrates that: SF4 can be efficiently synthesized in the absence of Cl2 within about 3 days at ambient temperatures, in the reaction: 4KF+S+2Br2→SF4+4KBr Example 4.Alternate Formation of SF4 Using Coarse-Grain KF and Agitation by Ball-Milling Anhydrous coarse grain KF (about 28.1 g) was dried in a stainless steel 300-ml Hoke bomb tube reactor containing 19, ½ inch 316 grade stainless steel balls, at about 150° C. to about 200° C., for about 1 hour, at high vacuum.",
"The reactor was allowed to cool to ambient temperature, opened, and fine-grain S powder (about 3.8 g) was added.",
"Bromine, (about 63.1 g), was then added to the reactor vessel to produce a final molar ratio of S:KF:Br2 of about 1.00:4.10:3.30.After rotating the reaction vessel for about 4 days at ambient temperature, a strong SF4 IR spectral signal was observed and the reaction displayed a high degree of conversion to SF4.The final SF4 product was isolated as follows: The reaction vessel was cooled to about −78° C. and connected via a cold trap (about −196° C.) to a vacuum pump.",
"After about 5 hours, about 9.8 grams of a light brown, presumably bromine-contaminated crude product was obtained.",
"A low temperature vacuum transfer was performed, yielding a very light brown liquid.",
"The final mass of the recovered SF4 end product was estimated about 7.3 g for a calculated yield of about 57% (based upon sulfur).",
"The IR spectrum of the end product revealed a substantially pure sample of SF4, with a small contamination by SOF2.This example illustrates that: SF4 can be efficiently synthesized in the absence of Cl2 using coarse-grain KF and ball-milling agitation within about 4 days at ambient temperatures, in the reaction: 4KF+S+2Br2→SF4+4KBr Example 5.Alternate Formation of SF4 at Elevated Temperature Anhydrous fine-grain KF (about 17.1 g) was dried in a stainless steel 300-ml Hoke bomb tube reactor at about 150° C. to about 200° C., for about 1 hour under high vacuum.",
"The reactor was allowed to cool to ambient temperature, opened, and fine-grain S powder (about 2.3 g) was added.",
"Br2 (about 36.3 g), was then added to the reactor vessel to produce a final molar ratio of S:KF:Br2 of about 1.00:4.10:3.20.The reactor vessel was heated to about 60° C. for about 3 hours and the formation SF4 product was monitored by IR spectroscopy.",
"The reaction vessel was cooled to about −78° C. and the SF4 product was pumped into a liquid nitrogen cold trap.",
"The mass of the crude SF4 product indicated about 50% chemical yield.",
"After recondensation of the SF4 product into the reaction vessel, it was heated for another about 2 hours at about 72° C., and another about 4 hours at about 80 to about 86° C. Isolation of the SF4 product was accomplished by cooling the reaction vessel to about −78° C. and pumping under high vacuum for about 1.5 hours into a liquid nitrogen cold trap.",
"Debromination was performed by brief shaking in large Carius tube containing about 20 g. of Hg at about 0° C. About 6.7 grams of purified SF4 was recovered containing a small amount of SOF2, as judged by IR spectroscopy.",
"The final calculated yield was about 86% (based upon sulfur).",
"This example illustrates that SF4 can be efficiently synthesized at mildly elevated temperature, within about 9 hours, in the reaction: 4KF+S+2Br2→SF4+4KBr Example 6.Alternate Formation of SF4 while Limiting Br2 Anhydrous fine grain KF (about 24.12 g) was dried in a stainless steel 300-ml Hoke bomb tube reactor at about 150° C. to about 200° C., for about 1 hour, at high vacuum.",
"The reactor was allowed to cool to ambient temperature, opened, and fine-grain S powder (about 3.16 g) was added.",
"Br2 (about 31.1 g), was then added to the reactor vessel to produce a final molar ratio of S:KF:Br2 of about 1.00:4.21:1.97.The reaction vessel was then cooled with liquid nitrogen and evacuated.",
"The reaction vessel was kept at ambient temperature for about 6 days, and then heated at about 80° C. for about 8 hours.",
"The reaction vessel was cooled to about −78° C. and the volatile material was pumped into a liquid nitrogen cooled cold trap until transfer apparently ceased.",
"The contents of the cold trap were transferred to a second cold trap, leaving a brown residue in the first cold trap.",
"The transferred material was condensed into a large glass pressure vessel containing about 10 grams of Hg to remove trace amounts of Br2.About 7.31 g of colorless product was again condensed into a liquid nitrogen cooled cold trap.",
"The recovered end product appeared as colorless product of about 7.31 g mass, for a calculated yield of about 70% (based upon Br2).",
"The IR spectrum of the end product revealed a substantially pure sample of SF4.This example illustrates that it is advantageous to use more than the required stoichiometric amount of bromine in the reaction: 4KF+S+2Br2→SF4+4KBr Example 7.Formation of SF5Cl Anhydrous fine grain CsF (about 10.95 g) was dried under high vacuum at about 100° C. in a stainless steel 300-ml Hoke bomb tube reactor, whereupon SF4 (about 9.17 g), Cl2 (about 3.20 g) and bromine (about 36.8 g) were added consecutively by vacuum condensation at liquid-nitrogen temperature (about −196° C.) to produce a molar ratio of SF4:CsF:Cl2:Br2 of about 1.00:0.85:0.53:2.71.The vessel was set aside at ambient temperature for about 5 days, and an IR spectrum of the gaseous constituents showed very strong bands or band groups corresponding to SF5Cl.",
"This example illustrates that SF5Cl can be efficiently synthesized within about 5 days at ambient temperatures using Cl2, Br2, and SF4, in the reaction: CsF+SF4+Cl2+(Br2)→SF5Cl+CsCl+(Br2).",
"Example 8.Alternate Formation of SF5Cl Using a Different Metal Fluoride KF (about 5.0 g) was dried at about 150° C. to about 200° C. in a stainless steel 100-ml Hoke bomb tube reactor, for about 1 hour, at high vacuum.",
"Br2 (about 9.71 g), Cl2 (about 3.54 g) and SF4 (about 4.71 g) were added to the bomb tube reactor by condensation to produce a molar ratio of: SF4:Cl2:KF:Br2 of about 1.00:1.14:1.98:1.39.The reaction appeared almost complete after about 2 days at ambient temperature, as determined from the IR spectrum (i.e.",
"a strong SF5Cl to SF4 IR spectral signals was observed).",
"The reactants were then heated for about 2 days at about 115° C., and an IR spectrum of the gaseous phase showed very little signal corresponding to SF4.This example illustrates that SF5Cl can be efficiently synthesized within about 2 to about 4 days at ambient or mildly elevated temperatures using Cl2, Br2, and SF4, in the reaction: KF+SF4+Cl2+(Br2)→SF5Cl+KCl+(Br2).",
"Example 9.Alternate Formation of SF5Cl Using S Instead of SF4 KF (about 15.60 g) was added to a stainless steel 300-ml Hoke bomb tube reactor and dried at about 150° C. to about 200° C., for about 1 hour, at high vacuum.",
"The bomb reactor was opened and fine-grain S powder (about 1.50 g) was added.",
"After resealing the reactor, Cl2 (about 9.03 g) and Br2 (about 8.59 g) were added by condensation to produce a molar ratio of: S:Cl2:KF:Br2 of about 1.00:2.71:5.71:1.15.The pressure reactor was kept at ambient temperature overnight and both SF5Cl and SF4 were detected from the IR spectrum.",
"No change in the IR spectrum was noticed after about three days.",
"More Cl2 was added (about 1.20 g), bringing the molar ratio to: S:Cl2:KF:Br2 of about 1.00:3.26:5.72:1.15.The reaction was occasionally monitored by IR spectroscopy.",
"After about two more weeks at ambient temperature, the reaction was substantially complete as judged by IR spectrometry.",
"This example illustrates that 1.)",
"compared to other SF4-producing reactions, increasing the molar ratios of Cl2 and KF promotes the production of SF5Cl over SF4 in this reaction, and 2.)",
"SF5Cl can be efficiently synthesized, at ambient temperatures within weeks, in the reaction: 5 KF+S+3Cl2+(Br2)→SF5Cl+5 KCl.",
"Example 10.Formation of SF5Cl KF (about 10.55 g) was dried under high vacuum in a stainless steel 100-ml Hoke bomb tube reactor and dried for about 1 hour at about 150° C. to about 200° C. The reactor was opened and fine-grain S powder (about 1.13 g) was added.",
"After resealing the reactor, Cl2 (about 8.15 g) and Br2 (about 7.99 g) were added by condensation to produce a stoichiometric ratio of S:Cl2:KF:Br2 of about 1.00:3.25:5.15:1.41 (reaction “A”).",
"A second, similar reaction was prepared utilizing about 1.58 g of fine-grain S powder and the same molar ratios of the other constituents (reaction “B”).",
"The reaction “A” and “B” vessels were placed at ambient temperature for about 3 days and the successful production of SF4 and SF5Cl was noted by IR spectroscopy.",
"Thereafter, SF4 and SF5Cl were monitored every 2 to about 3 days by IR spectroscopy, and by about day 13, it was evident that the reaction was not at completion, and that the production of SF4 and SF5Cl had slowed significantly.",
"The volatile components of both reaction vessels were then condensed and combined into a third vessel containing about 7.94 grams of KF.",
"After about 4 more days at ambient temperature, IR spectroscopy revealed that all the remaining SF4 appeared to have been consumed, leaving SF5Cl as the apparent sole product.",
"The final product was isolated in the following manner: 1.)",
"The reaction vessel was cooled to about −78° C. and connected via a cold trap (about −196° ° C.) to a vacuum pump.",
"After about 6 hours, about 15.5 grams of a light yellowish crude product was obtained.",
"To remove residual contaminants (e.g.",
"Cl2, Br2, Sulfur Chlorides), the crude product was kept overnight in a pressure reactor, over about 3 grams of S. The product was pumped out of this vessel, cooled to about −78° C. and connected via a cold trap (about −196° C.) to a pump and then condensed into a large cold trap containing a small amount of mercury to remove trace amounts of any discoloring contaminants (e.g.",
"Br2, Sulfur Chlorides).",
"The product was obtained as a colorless liquid.",
"The final mass of the recovered end product was about 13.10 g for a calculated yield of about 95% (based upon Sulfur).",
"The IR spectrum of the end product revealed a pure sample of SF5Cl.",
"This example illustrates that 1.)",
"Additional KF may be required to recharge the SF5Cl-producing reaction and drive it to completion or near completion.",
"2.)",
"The production of SF5Cl may be slowed by a reduction of reaction-accessible KF, perhaps due to the buildup of unreactive KCl on the exposed surfaces of the KF; which may be rectified by the addition of fresh KF, agitation of the reaction vessel, or other methods that may increase reactive surface area of the KF over the reaction time.",
"3.)",
"From the reaction: 5 KF+S+3Cl2+(Br2)→SF5Cl+5 KCl+(Br2) it is possible to reach complete, or substantially complete SF5Cl production within about 2 to about 3 weeks at ambient temperature, yielding substantially pure SF5Cl.",
"Example 11.Formation of SF5Cl KF (about 10.58 g) was dried under high vacuum for about 1 hour at about 150° C. to about 200° C., in a stainless steel 300-ml Hoke bomb tube pressure reactor.",
"The reactor was opened and S (about 1.1 g) was added.",
"After resealing the reactor, Cl2 (about 9.0 g) was added by condensation to produce a stoichiometric ratio of S:Cl2:KF of about 1.00:3.70:5.30.The reaction vessel was set aside at ambient temperature and no production of either SF4 or SF5Cl was detected by IR spectroscopy after about 30 days.",
"Br2 (about 7.54 g) was then added by condensation to produce a new stoichiometric ratio of S:Cl2:KF:Br2 of about 1.00:3.70:5.30:1.37.After about 3 days at ambient temperature, production of both SF4 and SF5Cl was noted by IR spectroscopy.",
"This example illustrates that 1.)",
"Although all the chemical elements required for production of SF4 and SF5Cl were present in the reaction vessel for a duration of about 30 days, no production of SF4 or SF5Cl was noted in the absence of Br2 at ambient temperature.",
"2.)",
"After the necessary components (S, Cl2, KF) of the reaction remained unreactive for 30 days, the subsequent addition of Br2, within days, promoted the efficient formation of SF4 and SF5Cl at ambient temperatures.",
"3.)",
"Br2 appears to be required for the efficient ambient temperature production of SF4 and SF5Cl from the reactants KF, S and Cl2.Example 12.Formation of SF5Br AgF (about 11.02 g) was dried under high vacuum at about 150 to about 200° C. Br2 (about 35.5 g) and SF4 (about 7.3 g) were added to a 300-ml Hoke bomb tube pressure reactor by condensation to produce a molar ratio of: SF4:AgF:Br2 of about 1.00:1.28:3.30.The reaction vessel was then placed into an about 100° C. boiling water bath and subsequently monitored by IR spectroscopy at about 2, about 6.5, about 15 and about 79 hours.",
"The IR spectra indicated a progressive accumulation of SF5Br (e.g.",
"band groups centered at about 891 cm−1 and about 854 cm−1 and about 594 cm−1), and a reduction in SF4, as exemplified by observing an increasing ratio of SF5Br to SF4 IR spectral signals over time.",
"The final product was isolated in the following manner: The reaction vessel was cooled to about −78° C. and connected via a cold trap (about −196° C.) to a vacuum pump.",
"After about 3 hours, about 9.3 grams of a light yellowish crude product was obtained in the cold trap.",
"The product was vacuum transferred from the cold trap to a Carius tube containing a small amount of mercury to remove trace amounts of any discoloring contaminants (e.g.",
"Br2).",
"The product was obtained as a pale straw-yellow liquid.",
"The final mass of the recovered end product was about 8.55 g for a calculated yield of about 75.4% (based upon SF4).",
"The IR spectrum of the end product revealed a substantially pure sample of SF5Br.",
"This example illustrates that: 1.)",
"SF5Br can be efficiently synthesized within about 79 hours at 100° C. in the reaction: AgF+SF4+Br2→SF5Br+AgBr Example 13.Formation of SF5Br Using an Alternate Metal Fluoride AgF2 (about 2.33 g) was dried under high vacuum at about 150 to about 200° C. in a 100-ml Hoke bomb tube pressure reactor.",
"Br2 (about 12.95 g) and SF4 (about 3.14 g) were added to the reactor by condensation to produce a molar ratio of: SF4:AgF2:Br2 of about 1.00:0.55:2.78.The reaction vessel was then placed at 100° C. and subsequently monitored by IR spectroscopy at about 52 hours.",
"The IR spectrum indicated very strong bands or band groups indicative of SF5Br, very weak bands or band groups corresponding to SF4 and SOF2 and medium-strength bands or band groups corresponding to SF6 (e.g.",
"medium-strength band centered at about 947 cm−1).",
"This example illustrates that: 1.)",
"SF5Br can be efficiently synthesized within about 52 hours at about 100° C. in the reaction: 2AgF2+4SF4+3Br2→4SF5Br+2AgBr Example 14.Formation of SF6 CoF3 (about 4.2 g) was dried under high vacuum at about 150 to about 200° C. in a 100-ml Hoke bomb tube pressure reactor.",
"Br2 (about 22.0 g) and SF4 (about 4.63 g) were added to the pressure reactor by condensation to produce a molar ratio of: SF4:CoF3:Br2 of about 1.00:0.84:3.21.The reaction vessel was then placed at about 100° C. and subsequently monitored by IR spectroscopy at about 52 hours.",
"The IR spectrum indicated strong bands or band groups indicative of SF6 moderate-strength bands or band groups corresponding to SF4 and weak bands or band groups corresponding to SOF2.No indication of SF5Br was evident form the IR spectrum.",
"This example indicates that: 1.)",
"SF6 can be efficiently synthesized within about 52 hours at about 100° C. in the reaction: 2CoF3+SF4+(Br2)→SF6+2CoF2+(Br2) Example 15.Comparative Example To determine if an alternate MF could efficiently replace KF as a reactant in the production of SF4, anhydrous fine-grain NaF (about 16.94 g) was dried in a stainless steel Hoke bomb tube pressure reactor at about 150° C. to about 200° C., for about 1 hour, at high vacuum.",
"The reactor was allowed to slowly cool to ambient temperature, opened, and sulfur (about 2.17 g) was added.",
"Br2 (about 29.5 g), was then added to the reactor vessel to produce a final molar ratio of S:NaF:Br2 of about 1.00:5.90:2.70.After about 2 days at ambient temperature, no SF4 was evident as measured by IR spectroscopy of the gaseous constituents removed from the reaction vessel.",
"The reaction vessel was then heated to about 80° C. for about 18 hours, IR spectroscopy of the gaseous constituents again revealed that no reaction products (SF4, SOF2) were present.",
"The reaction vessel was subsequently heated to about 155° C. for about 18 hours, IR spectroscopy of the gaseous constituents revealed very low levels SOF2 and no SF4, suggesting the formation of only traces of SF4, which were apparently hydrolyzed by the minuscule amount of water introduced into the reaction vessel.",
"Example 16.Comparative Example To determine if an alternate MF could efficiently replace KF as reactant in the production of SF5Cl from SF4, a 100-ml stainless steel Hoke bomb tube reactor was charged with NaF (about 10.19 g), and after drying under high vacuum as described above, the reactor was then charged with chlorine (about 4.77 g), bromine (about 11.57 g) and SF4 (about 14.61 g), consecutively, by vacuum condensation.",
"The molar ratio of SF4:NaF:Cl2:Br2 equaled about 1.00:1.79:1.10:1.50.The reaction was allowed to occur without agitation at ambient temperature for about 11 days, after which time no reaction was apparent from the IR spectrum.",
"Heating of the reaction vessel for an additional about 9 days at about 115 to about 125° C. did not result in the formation of SF5Cl, as indicated by IR spectroscopy.",
"Example 17.Comparative Example CuF2 (about 4.59 g) was dried for about 1 hour under high vacuum at about 150 to about 200° C. Br2 (about 18.9 g) and SF4 (about 3.21 g) were added to the pressure reactor by condensation to produce a molar ratio of: SF4:CuF2:Br2 of about 1.00:1.54:3.72.The reaction vessel was then placed at about 100° C. and subsequently monitored by IR spectroscopy at about 52 hours.",
"The IR spectrum indicated that no reaction had occurred.",
"Example 18.Comparative Example TIF (about 4.23 g) was dried under high vacuum at about 150 to about 200° C., for about 1 hour.",
"Br2 (about 7.6 g) and SF4 (about 1.38 g) were added to the pressure reactor by condensation to produce a molar ratio of: SF4:TIF:Br2 of about 1.00:1.49:3.86.The reaction vessel was then placed at 100° C. and subsequently monitored by IR spectroscopy at about 52 hours.",
"The IR spectrum indicated that no reaction had occurred.",
"Unless otherwise indicated, all numbers expressing quantities of ingredients, properties such as molecular weight, reaction conditions, and so forth used in the specification and claims are to be understood as being modified in all instances by the term “about.” Accordingly, unless indicated to the contrary, the numerical parameters set forth in the specification and attached claims are approximations that may vary depending upon the desired properties sought to be obtained by the present invention.",
"At the very least, and not as an attempt to limit the application of the doctrine of equivalents to the scope of the claims, each numerical parameter should at least be construed in light of the number of reported significant digits and by applying ordinary rounding techniques.",
"Notwithstanding that the numerical ranges and parameters setting forth the broad scope of the invention are approximations, the numerical values set forth in the specific examples are reported as precisely as possible.",
"Any numerical value, however, inherently contains certain errors necessarily resulting from the standard deviation found in their respective testing measurements.",
"The terms “a,” “an,” “the” and similar referents used in the context of describing the invention (especially in the context of the following claims) are to be construed to cover both the singular and the plural, unless otherwise indicated herein or clearly contradicted by context.",
"Recitation of ranges of values herein is merely intended to serve as a shorthand method of referring individually to each separate value falling within the range.",
"Unless otherwise indicated herein, each individual value is incorporated into the specification as if it were individually recited herein.",
"All methods described herein can be performed in any suitable order unless otherwise indicated herein or otherwise clearly contradicted by context.",
"The use of any and all examples, or exemplary language (e.g., “such as”) provided herein is intended merely to better illuminate the invention and does not pose a limitation on the scope of the invention otherwise claimed.",
"No language in the specification should be construed as indicating any non-claimed element essential to the practice of the invention.",
"Groupings of alternative elements or embodiments of the invention disclosed herein are not to be construed as limitations.",
"Each group member may be referred to and claimed individually or in any combination with other members of the group or other elements found herein.",
"It is anticipated that one or more members of a group may be included in, or deleted from, a group for reasons of convenience and/or patentability.",
"When any such inclusion or deletion occurs, the specification is deemed to contain the group as modified thus fulfilling the written description of all Markush groups used in the appended claims.",
"Certain embodiments of this invention are described herein, including the best mode known to the inventors for carrying out the invention.",
"Of course, variations on these described embodiments will become apparent to those of ordinary skill in the art upon reading the foregoing description.",
"The inventor expects skilled artisans to employ such variations as appropriate, and the inventors intend for the invention to be practiced otherwise than specifically described herein.",
"Accordingly, this invention includes all modifications and equivalents of the subject matter recited in the claims appended hereto as permitted by applicable law.",
"Moreover, any combination of the above-described elements in all possible variations thereof is encompassed by the invention unless otherwise indicated herein or otherwise clearly contradicted by context.",
"Furthermore, numerous references have been made to patents and printed publications throughout this specification.",
"Each of the above-cited references and printed publications are individually incorporated herein by reference in their entirety.",
"In closing, it is to be understood that the embodiments of the invention disclosed herein are illustrative of the principles of the present invention.",
"Other modifications that may be employed are within the scope of the invention.",
"Thus, by way of example, but not of limitation, alternative configurations of the present invention may be utilized in accordance with the teachings herein.",
"Accordingly, the present invention is not limited to that precisely as shown and described."
]
] |
Patent_15871311
|
[
[
"METHOD OF DETERMINING A PROTEIN IN A SAMPLE",
"The present invention relates to a method of determining a protein in a sample and the use of the method for the identification of aptamer target proteins."
],
[
"1.A method of determining a protein in a sample, comprising the steps of: (a) Providing an aptamer, which is functionalized at the 5′-end with a labeling reagent comprising a photo-activatable crosslinking moiety, a labeling moiety, and a linker moiety connecting the labeling reagent to the 5′-end of the aptamer; (b) Incubating a sample comprising an aptamer target protein with the functionalized aptamer of step (a); (c) Irradiating the sample with ultraviolet light for crosslinking the aptamer via the photoactivatable crosslinking moiety to the protein; and (d) Determining the protein via the labeling moiety.",
"2.The method according to claim 1, wherein the photo-activatable crosslinking moiety is selected from the group comprising aryl azides (phenyl azide), diazirine derivatives such as 3-trifluoromethyl-3-phenyl-diazirine (TPD), and benzophenone derivatives.",
"3.The method according to claim 1 or 2, wherein the labeling moiety is selected from the group comprising biotin and desthiobiotin.",
"4.The method according to any one of the preceding claims wherein the linker moiety provides a spacer arm length of about 6 Å to 45 Å, preferably about 20 Å to 40 Å, between the 5′-end of the aptamer and the crosslinking moiety.",
"5.The method according to any one of the preceding claims wherein the labeling reagent is Sulfosuccinimidyl-2-[6-(biotinamido)-2-(p-azidobenzamido) hexanoamido]ethyl-1,3′-dithiopropionate.",
"6.The method according to any one of the preceding claims wherein the method comprises incubating a biotin-labeled cross-linked aptamer-protein complex formed in step (c) with avidin-, neutravidin-, or streptavidin-coated magnetic beads.",
"7.The method according to any one of the preceding claims wherein step (d) includes determining a protein in a cell, or in an exosome, or in a circulating microvesicle.",
"8.The method according to any one of the preceding claims wherein step (d) includes determining a protein on the surface of a cell, or an exosome, or a circulating microvesicle.",
"9.Use of the method according to any one of the preceding claims for the identification of aptamer target proteins, particularly of aptamer target proteins in the proteome of cells, tissue or organisms, particularly for proteins of exosomes or circulating microvesicles.",
"10.Use of the method according to any one of the preceding claims for cell surface labeling.",
"11.Use of the method according to claim 6 for magnetic cell sorting."
],
[
"<SOH> BACKGROUND OF THE INVENTION <EOH>Aptamers are versatile, single stranded oligonucleotides that can be employed for the molecular recognition of different target structures via a strategy called Systematic Evolution of Ligands via EXponential enrichment (SELEX).",
"Traditionally, aptamers were evolved against small molecules or proteins, and subsequently modified to enable application in a variety of in vitro assays.",
"However, in recent years both the selection and application of aptamers has progressed towards considerably more complex targets such as cells, tissue slices or even live organisms.",
"The target structures can be bound with high selectivity and affinity without knowledge of the actual molecule that is recognized by the aptamer.",
"On the other hand, once an aptamer for targets of such complexity has been identified, this lack of knowledge immediately turns into a severe disadvantage, as it prevents further advancements, for example, as an analytical tool or as a biomarker for certain disease states.",
"These restrictions require technologies that allow for the rational identification of unknown target molecules of an aptamer.",
"Especially, the proteome-wide profiling or target identification of aptamers is not well established.",
"To identify aptamer targets photo-crosslinking of aptamers by photoreactive 5-iododeoxyuridines incorporated in an aptamer was used.",
"However, the method suffers from a loss in affinity observed when introducing photoreactive nucleotides into an aptamer and requires tedious optimization of the position of the crosslinker moiety.",
"Moreover, as this approach requires similar optimizations for other aptamer/target pairs, its general applicability is limited.",
"Therefore, the object underlying the present invention was to provide a method that allows for the identification of aptamer target structures.",
"Especially it was an object of the present invention to provide a method that avoids optimization for each aptamer/target pair."
],
[
"<SOH> SUMMARY OF THE INVENTION <EOH>The problem is solved by a method of determining a protein in a sample, comprising the steps of: (a) Providing an aptamer, which is functionalized at the 5′-end with a labeling reagent comprising a photo-activatable crosslinking moiety, a labeling moiety, and a linker moiety connecting the labeling reagent to the 5′-end of the aptamer; (b) Incubating a sample comprising an aptamer target protein with the functionalized aptamer of step (a); (c) Irradiating the sample with ultraviolet light for crosslinking the aptamer via the photo-activatable crosslinking moiety to the protein; and (d) Determining the protein via the labeling moiety."
],
[
"CROSS REFERENCE This application is a continuation of U.S. patent application Ser.",
"No.",
"15/258,962, filed on Sep. 7, 2016, which application is a continuation of U.S. patent application Ser.",
"No.",
"14/416,450, filed on Jan. 22, 2015, which is a U.S. National Phase Application under 35 U.S.C.",
"§ 371 of International Application No.",
"PCT/EP2013/065690, filed on Jul.",
"25, 2013, which claims priority to EP12178091.0, filed on Jul.",
"26, 2012, the disclosures of which are all hereby incorporated by reference herein in their entirety.",
"SEQUENCE LISTING SUBMITTED VIA EFS-WEB The entire content of the following electronic submission of the sequence listing via the USPTO EFS-WEB server, as authorized and set forth in MPEP § 1730 II.B.2(a), is incorporated herein by reference in its entirety for all purposes.",
"The sequence listing is within the electronically filed text file that is identified as follows: File Name: Sequence_Listing.txt Date of Creation: Jan. 11, 2018 Size (bytes): 1,416 bytes FIELD OF THE INVENTION The present invention relates to methods of determining a protein in a sample.",
"Particularly, the present invention relates to a method utilizing a functionalized aptamer.",
"BACKGROUND OF THE INVENTION Aptamers are versatile, single stranded oligonucleotides that can be employed for the molecular recognition of different target structures via a strategy called Systematic Evolution of Ligands via EXponential enrichment (SELEX).",
"Traditionally, aptamers were evolved against small molecules or proteins, and subsequently modified to enable application in a variety of in vitro assays.",
"However, in recent years both the selection and application of aptamers has progressed towards considerably more complex targets such as cells, tissue slices or even live organisms.",
"The target structures can be bound with high selectivity and affinity without knowledge of the actual molecule that is recognized by the aptamer.",
"On the other hand, once an aptamer for targets of such complexity has been identified, this lack of knowledge immediately turns into a severe disadvantage, as it prevents further advancements, for example, as an analytical tool or as a biomarker for certain disease states.",
"These restrictions require technologies that allow for the rational identification of unknown target molecules of an aptamer.",
"Especially, the proteome-wide profiling or target identification of aptamers is not well established.",
"To identify aptamer targets photo-crosslinking of aptamers by photoreactive 5-iododeoxyuridines incorporated in an aptamer was used.",
"However, the method suffers from a loss in affinity observed when introducing photoreactive nucleotides into an aptamer and requires tedious optimization of the position of the crosslinker moiety.",
"Moreover, as this approach requires similar optimizations for other aptamer/target pairs, its general applicability is limited.",
"Therefore, the object underlying the present invention was to provide a method that allows for the identification of aptamer target structures.",
"Especially it was an object of the present invention to provide a method that avoids optimization for each aptamer/target pair.",
"INCORPORATION BY REFERENCE All publications, patents and patent applications mentioned in this specification are herein incorporated by reference to the same extent as if each individual publication, patent or patent application was specifically and individually indicated to be incorporated by reference.",
"SUMMARY OF THE INVENTION The problem is solved by a method of determining a protein in a sample, comprising the steps of: (a) Providing an aptamer, which is functionalized at the 5′-end with a labeling reagent comprising a photo-activatable crosslinking moiety, a labeling moiety, and a linker moiety connecting the labeling reagent to the 5′-end of the aptamer; (b) Incubating a sample comprising an aptamer target protein with the functionalized aptamer of step (a); (c) Irradiating the sample with ultraviolet light for crosslinking the aptamer via the photo-activatable crosslinking moiety to the protein; and (d) Determining the protein via the labeling moiety.",
"BRIEF DESCRIPTION OF THE DRAWINGS The figures which follow serve to illustrate the invention in more detail but do not constitute a limitation thereof.",
"FIG.",
"1A shows a schematic representation of an embodiment of the method according to the invention.",
"FIG.",
"1B shows the structure of an aptamer functionalized at the 5′-end with Sulfo-SBED, which is attached via a hexyl-group to the 5′-site of the aptamer.",
"FIGS.",
"2A-B show the binding of trCLN3 to the target protein c-Met.",
"FIG.",
"2A shows the result of the filter retention assay in which increasing concentrations of 5′-functionalized variants of trCLN3 competed with radiolabeled trCLN3 for binding to the target protein c-Met.",
"FIG.",
"2B shows the Western blot analysis of cross-linking between 5′-functionalized trCLN3 (ABAL-t:rCLN3) and c-Met (left panel) as compared to a non-binding point mutant of the aptamer trCLN3 (right panel).",
"FIGS.",
"3A-B show the binding of D17.4 to the target protein IgE.",
"FIG.",
"3A shows the result of the filter retention assay in which increasing concentrations of 5′-functionalized variants of D17.4 competed with radiolabeled D17.4 for binding to the target protein IgE.",
"FIG.",
"3B shows the Western blot analysis of cross-linking between 5′-functionalized D17.4 (ABAL-D17.4) and IgE (left panel) as compared to a non-binding scrambled sequence of the aptamer D17.4 (right panel).",
"FIGS.",
"4A-B show the binding of C10.35 to the target protein cytohesin-2.FIG.",
"4A shows the result of the filter retention assay in which increasing concentrations of 5′-functionalized variants of C10.35 competed with radiolabeled C10.35 for binding to the target protein cytohesin-2.FIG.",
"4B shows the Western blot analysis of cross-linking between 5′-functionalized C10.35 (ABAL-C10.35) and cytohesin-2 (left panel) as compared to a non-binding point mutant of the aptamer C10.35 (right panel).",
"FIGS.",
"5A-B show the photo-affinity labeling of c-Met on the surface of H1838 cells.",
"FIG.",
"5A shows light microscopy images of magnetic bead binding to H1838 cells incubated with 5′-functionalized trCLN3 (ABAL-trCLN3), FIG.",
"5B a 5′-functionalized non-binding G25A point-mutant of trCLN3 (ABAL-t:rCLN3 G25A), and FIG.",
"5C no aptamer.",
"The scale bars indicate 25 μm.",
"FIG.",
"6 shows Western Blot analysis of the supernatant (Sn) or bead (B) fractions of samples treated with 5′-functionalized trCLN3 (ABAL-trCLN3) (1), 5′-functionalized non-binding G25A point-mutant of trCLN3 (ABAL-trCLN3 G25A) (2) or no aptamer (-) in presence or absence of UV irradiation.",
"Sample L contains H1838 cell lysate without aptamer.",
"DETAILED DESCRIPTION OF THE INVENTION The details of one or more embodiments of the invention are set forth in the accompanying description below.",
"Although any methods and materials similar or equivalent to those described herein can be used in the practice or testing of the present invention, the preferred methods and materials are now described.",
"Other features, objects, and advantages of the invention will be apparent from the description.",
"In the specification, the singular forms also include the plural unless the context clearly dictates otherwise.",
"Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs.",
"In the case of conflict, the present Specification will control.",
"The problem is solved by a method of determining a protein in a sample, comprising the steps (a) Providing an aptamer, which is functionalized at the 5′-end with a labeling reagent comprising a photo-activatable crosslinking moiety, a labeling moiety, and a linker moiety connecting the labeling reagent to the 5′-end of the aptamer; (b) Incubating a sample comprising an aptamer target protein with the functionalized aptamer of step (a); (c) Irradiating the sample with ultraviolet light for crosslinking the aptamer via the photo-activatable crosslinking moiety to the protein; and (d) Determining the protein via the labeling moiety.",
"The method allows for the rational identification of aptamer target structures within complex samples.",
"The functionalization of the 5′-end makes the method easily applicable to the multitude of existing aptamers.",
"Highly efficient and specific cross-linking of aptamer-protein pairs with large differences in secondary structure was achieved without loss in affinity.",
"The method hence provides a general strategy usable for a variety of aptamer/target structures.",
"Advantageously, the loss in affinity commonly observed when introducing photoreactive nucleotides into an aptamer is prevented by attaching the crosslinking moiety at the 5′-end of the aptamer.",
"It was observed that the binding affinity for the respective protein targets was not altered after 5′-modification with the labeling reagent.",
"Surprisingly it was found that attaching the crosslinking moiety distant from the bound protein did not prevent efficient cross-linking.",
"Positioning of the labeling reagent at the 5′-end of the aptamer surprisingly places the crosslinking moiety sufficiently close to the protein target to enable efficient cross-linking, yet at the same time distant enough from the binding site to prevent a loss in affinity.",
"Advantageously, the invention provides an efficient aptamer-based affinity labeling of proteins.",
"The crosslinking of a photo-activatable crosslinking moiety can be initiated by irradiation with ultraviolet light, which provides a reactive species that can covalently link the functionalized aptamer to the protein.",
"This provides a second or cross-linking further to the affinity-based linking of the aptamer to its protein target.",
"In preferred embodiments, the photo-activatable crosslinking moiety is selected from the group comprising aryl azides, diazirine derivatives such as 3-trifluoromethyl-3-phenyl-diazirine, benzophenone, and benzophenone derivatives.",
"Aryl azides are also called phenyl azides.",
"Upon photolysis, aryl azides form short-lived nitrenes that react nonspecifically by initiating addition reactions with double bonds or insertion into C—H and N—H sites or undergo ring expansion and react with nucleophiles, especially amines.",
"Using a photoreactive phenyl azide crosslinker a nonselective coupling to the target protein can be provided.",
"Diazirines are a class of organic molecules comprising a carbon bound to two nitrogen atoms which are double-bonded to each other, forming a three-membered ring.",
"Diazirines can easily and efficiently be activated with long-wave UV light of 330-370 nm.",
"Upon photo-activation diazirines provide a carbene which can form covalent bonds through addition reactions with any amino acid side chain or peptide backbone at distances corresponding to the spacer arm lengths of the labeling reagent.",
"Diazirines can provide a less reactive but more specific coupling.",
"Preferred are 3-aryldiazirines, especially diazirine derivatives such as 3-trifluoromethyl-3-phenyl-diazirine (TPD).",
"The labeling moiety provides for the determination or detection of the protein.",
"The labeling moiety can be a part of a specific binding pair.",
"Such a labeling moiety can have the function of an anchor moiety.",
"Specific binding pairs used conventionally in biological assays are for example biotin, which can bind with avidin/streptavidin, neutravidin, or an anti-biotin antibody.",
"In preferred embodiments, the labeling moiety is selected from the group comprising biotin and desthiobiotin.",
"A linker moiety connects the labeling reagent to the 5′-end of the aptamer.",
"The linker moiety can provide that the crosslinking moiety is sufficiently close to the protein target to enable an efficient cross-linking but is distant enough from the aptamer to prevent a loss in aptamer affinity to the protein.",
"Further, a certain length of the linker moiety can be required when steric effects dictate a distance between the potential reaction sites for crosslinking.",
"In preferred embodiments, the linker moiety provides a spacer arm length of about 6 Å to 45 Å, preferably about 9 Å to 40 Å, more preferably about 12 Å to 30 Å, particularly about 20 Å to 30 Å, between the 5′-end of the aptamer and the crosslinking moiety.",
"As used herein, the term “spacer arm length” refers to the molecular span i.e.",
"the distance between the 5′-end of the aptamer and the crosslinking moiety, or between the crosslinking moiety and the labeling moiety.",
"A single bond between carbon atoms has a length of about 1.5 Å.",
"A spacer arm lengths of about 6 Å to 45 Å roughly corresponds to a chain length of about 4 to 30 carbon or hetero atoms.",
"A shorter linker moiety might influence the aptamer affinity to the protein, while a longer linker moiety might reduce efficient cross-linking.",
"The linker moiety can have incorporated hetero atoms, for example resulting from the binding reaction of the crosslinking moiety, to the labeling reagent, or the binding site of the labeling reagent to the aptamer.",
"The linker moiety can be provided by the labeling reagent, for example if the labeling reagent has a chain-like molecule part up to the crosslinking moiety, which provides a sufficient spacer arm length.",
"Preferably, the linker moiety comprises a linker separate from the labeling reagent.",
"The linker can be provided by an alkyl-chain, which preferably is a linear and/or unsaturated chain.",
"The alkyl linker can be a linear saturated C2-C10 alkyl group, preferably a C4-C8 alkyl group, more preferably a C5-C6 alkyl group.",
"Alkyl chains can be incorporated at the 5′-position of an aptamer via Phosphoramidite Synthesis of the aptamer sequence.",
"The linker moiety alternatively can be provided by linear polyethylene glycol (PEG)-units.",
"Preferred are PEG-units according to formula HO—(CH2CH2O)n—H wherein n preferably is 1 to 5, particularly 2 to 3 or 4.Preferably, the labeling moiety is placed at a certain distance to the crosslinking moiety.",
"Preferably, the labeling reagent provides a spacer arm length of about 9 Å to 30 Å, preferably about 12 Å to 20 Å between the crosslinking moiety and the labeling moiety.",
"A spacer arm length of about 9 Å preferably of about 12 Å to 20 Å or 12 Å to 30 Å can provide that the labeling moiety may not disturb the crosslinking when reacting with its binding partner.",
"In preferred embodiments, the labeling reagent is Sulfosuccinimidyl-2-[6-(biotinamido)-2-(p-azidobenzamido) hexanoamido]ethyl-1,3′-dithiopropionate (Sulfo-SBED).",
"Sulfo-SBED is commercially available for example from Thermo Scientific.",
"Sulfo-SBED is a trifunctional crosslinking reagent containing a biotin, a sulfonated N-hydroxysuccinimide (Sulfo-NHS) active ester and a photoactivatable aryl azide.",
"The NHS ester can react with primary amine groups of the amino acids at the 5′-position of the aptamer that can be incorporated via Phosphoramidite Synthesis of the aptamer sequence, to form covalent amide bonds.",
"It is preferred that the aptamer is functionalized at the 5′-end with Sulfo-SBED.",
"An aptamer 5′-functionalized with Sulfo-SBED provides a phenyl azide moiety for cross-linking, which could be changed for other crosslinkers such as diazirine derivatives, and also contains a biotin residue that can be employed for determining the aptamer-protein conjugate.",
"For example, the biotin residue can be employed for enriching the aptamer-protein conjugate by incubating with avidin or streptavidin beads.",
"Hence, the method can be used for the enrichment of a target protein from complex mixtures.",
"The counter binding reagent for the labeling moiety can be fluorescence-labeled.",
"A fluorescence-labeling, for example provided by fluorescence-labeled neutravidin, can provide a visualization of the crosslinked aptamer protein complex by light microscopy.",
"Further, the counter binding reagent of the labeling moiety can be attached to an antibody or beads, particularly magnetic beads.",
"Counter binding reagents of the labeling moiety attached to an antibody provide for a determination of the target protein via Western Blot analysis.",
"Further, target proteins can be visualized using fluorescence-labeled second antibodies.",
"Streptavidin-coated beads can be added after the cross-linking.",
"In preferred embodiments, the method comprises the step of incubating a biotin-labeled cross-linked aptamer-protein complex formed in step (c) by with avidin-, neutravidin-, or streptavidin-coated magnetic beads.",
"Subsequent incubation with streptavidin-coated magnetic beads allows the purification of the crosslinked aptamer-protein complex.",
"Particularly, a labeling of cells with magnetic beads also expands the repertoire of methods for magnetic cell sorting.",
"Further, a labeling reagent containing a biotin residue can be employed for enriching the aptamer-protein conjugate by incubating with avidin or streptavidin beads.",
"Determining a target protein can correspond to identifying unknown target proteins, for example for proteome-wide profiling or target identification of aptamers, or determining the amount of a known or unknown target protein.",
"Determining a target protein can also correspond to visualizing a target protein by light microscopy or Western blotting.",
"The incubation of an aptamer target protein with the functionalized aptamer serves for the affinity binding of the aptamer to the protein.",
"Conditions for affinity binding widely depend on the nature of aptamer and protein, and temperature and time can vary.",
"For example, samples can be incubated at 37° C. for 30 minutes.",
"Irradiating the sample with ultraviolet light serves for the crosslinking of the aptamer via the photoactivatable crosslinking moiety to the target protein.",
"Conditions for crosslinking widely depend on the crosslinking moiety, and temperature and time can vary.",
"For example, samples can be illuminated at 365 nm for 10 minutes, preferably under cooling on ice.",
"The functionalized aptamer can provide an efficient aptamer-based labeling reagent for the respective aptamer target protein.",
"The broad applicability of the aptamer-based affinity labeling of proteins was confirmed using different aptamer-protein pairs employing aptamers representing a diversity of motifs of secondary structures such as G-quadruplexes, hairpin-loops, or internal bulges, and using aptamer-protein pairs that vastly differ in the cellular environment in which their respective target primarily resides, namely at the cell surface, in the blood stream, and in the cytoplasm.",
"Suitable aptamers are for example C10.35 (SEQ ID NO: 1), D17.4 (SEQ ID NO: 3), and trCLN3 (SEQ ID NO: 5).",
"These aptamers bind to the target proteins cytohesin-2, immunoglobulin E (IgE), and c-Met, respectively.",
"The method can be applied to a broad variety of aptamer/protein complexes.",
"Advantageously, the ability to specifically and reliably cross-link targets in complex media allows for a wide diversity of samples of biological structures.",
"Especially, the method is not limited to purified protein samples, but extendable to highly complex biological contexts such as cellular lysate or even directly at the membranes of living cells.",
"Hence, the sample can be a protein sample of a cell, tissue or organism, a cellular lysate, or a tissue slice.",
"A sample also can be a living cell, a cell organelle, or a membrane of living cells or cell organelles.",
"Especially, a sample can be a membrane or surface of a cell or cell organelle such as exosomes or microsomes.",
"As used herein, the term “sample” refers to any material, which probably contains target proteins which can be determined, including any liquid or fluid sample or solid material, particularly a sample derived from a biological source.",
"The term sample particularly refers to biological material, for example cells, cell organelles, or tissues, or extracts of any of the foregoing, biological fluids, biological molecules, or supernatants.",
"Advantageously, cross-linking of the functionalized aptamer to its target protein is possible in complex mixtures of different proteins.",
"The method opens up the opportunity to be directly applied to cell surface proteins in the context of living cells.",
"In preferred embodiments, step (d) includes determining a protein in a cell, or in an exosome, or in a circulating microvesicle.",
"In further preferred embodiments, step (d) includes determining a protein on the surface of a cell, or of an exosome, or of a circulating microvesicle.",
"As used herein, the term “exosome” refers to small vesicles secreted by a wide range of mammalian cell types.",
"Exosomes can be released from a cell when multivesicular bodies fuse with the plasma membrane.",
"The term “circulating microvesicles” refers to larger vesicular bodies, which are fragments of plasma membrane shed from almost all cell types.",
"Circulating microvesicles are released by a number of cell types during cellular activation and apoptosis and supposedly play a role in intercellular communication.",
"The identification of these vesicles has opened a new era in the understanding of cell signaling and the process of molecular communication between cells.",
"Especially human body fluids can contain exosomes and circulating microvesicles.",
"The method can crosslink aptamers to their target structures in a light-dependent and highly specific manner.",
"The aptamer-protein-complexes can be enriched in vitro, from a cellular lysate or from the surface of living cells.",
"The method allows one to study aptamer interactions in a variety of biological contexts.",
"Advantageously, the method further provides for a proteome-wide profiling or target identification of aptamers.",
"Another aspect of the invention relates to a use of the method for the identification of aptamer target proteins, particularly for the identification of aptamer target proteins in the proteome of cells, tissue or organisms.",
"Especially, the method can be used for the identification of proteins of exosomes or circulating microvesicles.",
"The term “proteome” as used herein refers to the entire set of proteins expressed by a genome, cell, tissue or organism.",
"More specifically, the term proteome refers to the set of expressed proteins in a given type of cells or an organism at a given time under defined conditions.",
"The term “proteome” also is used to refer to the collection of proteins in certain sub-cellular biological systems.",
"A cellular proteome is the collection of proteins found in a particular cell type under a particular set of environmental conditions.",
"The methods also can be useful for complexes between an aptamer and a known target, for example for target validation inside cells.",
"In another embodiment, the method is usable for target validation inside cells.",
"The method further opens up the opportunity to be directly applied to cell surface proteins in the context of living cells.",
"This augments the repertoire of the method for specific cell surface labeling.",
"In a further embodiment, the method is usable for cell surface labeling, or the labeling of exosomes or circulating microvesicles.",
"The method can comprise the incubation of a biotin-labeled cross-linked aptamer-protein complex with avidin-, neutravidin-, or streptavidin-coated magnetic beads.",
"The labeling of cells with magnetic beads also expands the repertoire of the method for magnetic cell sorting.",
"Another aspect of the invention relates to the use of the method including incubation of a biotin-labeled cross-linked aptamer-protein complex with avidin-, neutravidin-, or streptavidin-coated magnetic beads for magnetic cell sorting.",
"FIG.",
"1A shows a schematic representation of an embodiment of the method of determining a protein in a sample.",
"An aptamer 1 which is functionalized at the 5′-end with a labeling reagent containing a photo-activatable crosslinking moiety 3, which can be a phenyl azide, and a labeling moiety 4, which can be biotin, is incubated with a target protein 2.The aptamer 1 binds via affinity binding to the protein 2.In a next step the aptamer-protein complex 7 is irradiated with ultraviolet light (hν) for crosslinking the aptamer via the photoactivatable crosslinking moiety 3 to the protein 2.The protein can be determined by incubating the labeled cross-linked aptamer-protein complex 7 with magnetic beads 5 coated with a counter binding reagent 6, which can be streptavidin.",
"Via binding of the labeling moiety 4 to the counter binding reagent 6 the aptamer-protein complex is attached to the beads.",
"This allows for magnetic cell sorting.",
"FIG.",
"1B shows the structure of an aptamer functionalized at the 5′-end with Sulfo-SBED, which contains a phenyl azide 3 and a biotin 4, and which is attached via a hexyl-group linker 8 to the 5′-site of the aptamer.",
"Unless otherwise defined, the technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs.",
"The examples which follow serve to illustrate the invention in more detail but do not constitute a limitation thereof.",
"EXAMPLES Materials and Methods Aptamers according to Table 1, both unfunctionalized and functionalized with a hexylamine at the 5′ site, were purchased in HPLC purified form from Metabion (Martinsried, Germany).",
"The lyophilized samples were dissolved in double distilled H2O (ddH2O) to a concentration of 100 μM.",
"TABLE 1 Sequences of the individual aptamers Aptamer name Sequence C10.35/ 5′-ACTCGGGAGGACTGCTTAGGATTGCG SEQ ID NO: 1 AACCCGGGT-3′ C10.35 C15T/ 5′-ACTCGGGAGGACTGTTTAGGATTGCG SEQ ID NO: 2 AACCCGGGT-3′ D17.4/ 5′-GGGGCACGTTTATCCGTCCCTCCTAG SEQ ID NO: 3 TGGCGTGCCCC-3′ D17.4sc/ 5′-CCAGCTGGCTCACCGTTCGCGCTAGG SEQ ID NO: 4 GCTTTCCGTCG-3′ trCLN3/ 5′-TGGATGGTAGCTCGGTCGGGGTGGGT SEQ ID NO: 5 GGGTTGGCAAGTCT-3′ trCLN3 G25A/ 5′-TGGATGGTAGCTCGGTCGGGGTGGAT SEQ ID NO: 6 GGGTTGGCAAGTCT-3′ The Sec7 domain was expressed in E. coli and purified as described in X. Bi et al., Angew.",
"Chem.",
"2008, 120, 9707-9710; Angew.",
"Chem.",
"Int.",
"Ed.",
"2008, 47, 9565.IgE was purchased from Abcam (Cambridge, United Kingdom) and c-Met-Fc, which represents the ectodomain of c-Met fused to the Fe domain of human IgG1 was bought at R&D Systems (Wiesbaden, Germany).",
"H1838 cells and HF460 cells were both cultured in RPMI 1640 (PAA, Colbe, Germany) supplemented with 10% fetal calf serum (Lonza, Verviers, Belgium).",
"Filter Retention Assays Affinities and IC50 values were determined using dot blot filter retention assays.",
"First, aptamers C10.35, D17.4 and trCLN3 were radioactively labeled via addition of a 32P at the 5′ site.",
"A 20 μL solution containing 50 pmol aptamer, 6.7 pmol γ-32P ATP and 20 U T4 Polynucleotide kinase (New England Biolabs, Frankfurt a. M., Germany) in 1× Polynucleotide buffer was incubated for 1 h at 37° C., followed by removal of unreacted γ-32P ATP using an Illustra™ Microspin™ G-25 column (GE Healthcare, Mûnchen, Germany).",
"The purity of the radiolabeled aptamer was confirmed using a 10% PAGE-gel, which was also used to determine the percentage of radioactive signal caused by the aptamer.",
"To determine the affinity, ˜10 fmol of radiolabeled aptamer was incubated with protein dilution series for 30 min at 37° C. in 25 μL of buffer containing 1 mg/ml E. coli tRNA (Roche, Mannheim, Germany), 1 μg/ml BSA, 3 mM MgCl2 in PBS, pH 7.4.For Sec7, 0.005% Triton X-100 was added and for c-Met-Fc, 1 mg/ml of BSA was used instead of 1 μg/ml.",
"The aptamer-protein complexes were captured on a Protran™ nitrocellulose membrane (GE Healthcare) that was pre-incubated in 0.4 M KOH for 10 minutes, followed by washing with ddH2O and PBS containing 3 mM MgCl2, pH 7.4.After addition of the aptamer-protein solution, the filter was washed 4 times with PBS containing 3 mM MgCl2, pH 7.4.Radioactivity was quantified using a Fujifilm Fla-3000 Phosphorlmager and AIDA software package.",
"The percentage of bound aptamer was calculated using equation 1: % of bound aptamer = cpm sample - cpm background ( cpm total - cpm background ) · n · 100 % ( 1 ) in which cpmsample is the radioactive signal of the sample of interest and cpmbackground the signal of the control sample without radioactive aptamer and n the correction factor for the amount of radioactive signal arising from the aptamer.",
"Cpmtotal is the total radioactive signal, obtained from a dot blot of the radioactive aptamer solution on the nitrocellulose membrane without subsequent washing.",
"The Kd's were determined via equation (2) using Graphpadprism software, assuming a single binding event and no cooperativity in binding % of bound aptamer = a · x x + K d + b ( 2 ) In (2), x is the protein concentration in mol·l−1, Kd is the binding affinity in M and a and b are constants that are included in the fit.",
"IC50's were obtained using a similar filter retention assays, yet in which ˜10 fmol of aptamer was incubated with a protein concentration approximately 2-fold below the determined Kd (75 nM for C10.35, 50 nM for IgE and 20 nM for c-Met-Fc), together with dilution series of either non-radioactive, unfunctionalized aptamer or the ABAL-functionalized variants of the aptamers.",
"The percentage of the maximal radioactive signal was determined using equation (3), % of maximum signal = cpm sample - cpm background cpm max - cpm background · 100 % ( 3 ) in which cpmsample represents the radioactive signal of the respective sample, cpmbackground the signal in absence of radiolabeled aptamer and cpmmax the signal obtained for a sample containing only protein and radiolabeled aptamer.",
"The plots displaying the percentage of the maximum signal as a function of the amount of competing aptamer were fitted using equation (4) to obtain the IC50, in mol·l−1.% of maximum signal = a + b - a 1 + 10 x - log ( EC 50 ) ( 4 ) In equation (4), x is the amount of competing aptamer in mol·l−1 and a and b are constants that are included in the fit and represent the minimum and maximum percentage, respectively.",
"Example 1: Generation of the Functionalized Aptamers Sulfo-N-hydroxysuccinimidyl-2-(6-[biotinamido]-2-(p-azido benzamido)-hexanoamido) ethyl-1,3′-dithioproprionate (Sulfo-SBED; Thermo Scientific, USA) was freshly dissolved in dry DMSO to a concentration of 20 mM.",
"Coupling was performed in brown Eppendorf tubes with a 100-fold excess of sulfo-SBED in a buffer consisting of 25 mM Hepes, 100 mM NaCl, 20% dry DMSO and 40 μM of the respective aptamer.",
"Purification of the functionalized aptamers was performed on an Agilent 1100 series HPLC (Agilent, Bôblingen, Germany) using a C18 Zorbax SB-Aq column (4.6×150 mm; Agilent) by applying a gradient of 0.1 M tetraethylammoniumacetate (TEAAc) up to 25% acetonitrile.",
"The fraction containing the functionalized aptamer was dried overnight using a Concentrator 5301 (Eppendorf, Germany) at 4° C. and the resulting solid was dissolved in ddH2O, aliquoted and stored at a concentration of 30-40 μM at −20° C. in brown eppendorf tubes.",
"Example 2: In Vitro Cross-Linking of the 5′-Functionalized Aptamer trCLN3 with c-Met Determined was the cross-linking of the DNA aptamer CLN0003, hereafter referred to as CLN3, which recognizes the ectodomain of the membrane protein hepatocyte growth factor receptor (HGFR) also known as c-Met.",
"According to the analysis of the inventors, this aptamer has two G-quadruplex structures.",
"Used was a commercially available fusion protein between the ectodomain of c-Met and an IgG Fe domain (c-Met-Fc).",
"A variant of the DNA aptamer CLN3 that was truncated to 40 nucleotides and hereafter is referred to as trCLN3 (SEQ ID NO: 5) that binds c-Met with nanomolar affinity was functionalized at its 5′-end with Sulfo-SBED as labeling reagent as described in Example 1.The resulting functionalized aptamer was separated from the excess unreacted Sulfo-SBED and unreacted trCLN3 aptamer by reverse phase HPLC.",
"Incubating the target protein c-Met with the 5′-functionalized aptamer trCLN3 was performed by mixing 250 nM of the aptamer with different protein concentrations in a round-bottom polypropylene 96 wells plate (Brand, Wertheim, Germany) using the buffer from the filter binding experiments.",
"Samples were covered from light using aluminium foil and incubated at 37° C. for 30 min.",
"Subsequently, control samples without UV light were stored in the dark at 4° C., whereas crosslinking was performed by placing the 96-wells plate containing the remaining samples on ice and illuminating at 365 nm for 10 minutes using a UVP 3UV lamp (Thermo Scientific, Rockford, USA).",
"To test the influence of the 5′-functionalisation on aptamer binding filter retention assays as described above were performed in which the 5′-functionalized aptamer competed with non-derivatized aptamer for binding to c-Met.",
"FIG.",
"2A shows that the IC50 of 5′-functionalized aptamer trCLN3 (ABAL-trCNN3) was 50±8 nM, which is similar to the 76±17 nM obtained for the unlabeled trCLN3.This result demonstrates that functionalization of the 5′ site of the aptamer did not affect its binding affinity.",
"FIG.",
"2A also shows that a 5′-functionalized non-binding G25A point-mutant of trCLN3 (ABAL-trCLN3 G25A, SEQ ID NO: 6) displayed no binding in the tested concentration range.",
"This result established a negative-control and confirmed that no non-specific cross-linking occurred without affinity-binding via the aptamer in the incubation step.",
"This also confirmed the G-quadruplex structure of the aptamer.",
"Further, the amount of cross-linking of the 5′-functionalized aptamer trCLN3 to purified c-Met was investigated.",
"c-Met was incubated in concentrations of 0.5 μM, 167 nm, 56 nm and 19 nM with 250 nM of the 5′-functionalized aptamer trCLN3 and trCLN3 G25A, followed by UV irradiation at 365 nm.",
"The amount of cross-linking was analyzed using SDS-PAGE, followed by western blotting using fluorescence-labeled Neutravidin-Dylight™ 800 (Thermo Scientific) to visualize biotinylated proteins.",
"Anti-penta-his (1:2000, Qiagen) was used to visualize the total amount of c-Met-Fc.",
"Goat-anti-mouse-IgG-Dylight™ 800 (Thermo Scientific) was used as a secondary antibody.",
"The blots were scanned at 800 nm using an Odyssey scanner (Li-cor Biotechnology, Bad Homburg, Germany).",
"FIG.",
"2B shows that no cross-linking occurred in the absence of UV irradiation.",
"But after exposure to 365 nm light, a high level of cross-linking was observed between 5′-functionalized trCLN3 and 0.5 μM c-Met.",
"Even at concentrations as low as 19 nM of c-Met cross-linking was still clearly detectable.",
"In contrast, even the highest concentration of c-Met resulted in very low cross-linking when 5′-functionalized trCLN3 G25A was used; quantification of the band intensities at 500 nM c-Met revealed a 24-fold lower signal as compared to 5′-functionalized trCLN3.This difference clearly shows that the reaction strictly depends on the affinity binding of the aptamer combined with crosslinking via UV-irradiation.",
"Example 3: Determination of the Cross-Linking Efficiencies of the 5′-Functionalized Aptamer Tr⋅CLN3 with c-Met In Vitro Cross-linking efficiencies were determined by cross-linking 250 nM of the 5′-functionalized aptamer trCLN3 with 0.5 μM of c-Met-Fc as described above, followed by addition of 30 μg MyOne™ streptavidin Dynabeads (Invitrogen) to 50 μL of cross-linking sample and transfer into a brown eppendorf tube.",
"This mixture was mixed overnight at 4° C. using a tumble shaker, after which a magnetic rack was used to collect the supernatant and wash the beads 3 times with 2 M NaCl, 1 mM EDTA, 0.01% Triton X-100 and 10 mM Tris-HCl, pH 7.5.The beads were then resuspended in 50 μL PBS.",
"The supernatant, bead fraction and a dilution series of purified sec7 were analyzed via Western blots involving anti-penta-his (1:2000, Qiagen) in combination with anti-mouse-IgG-Dylight™ 800 (1:20000, Thermo Scientific).",
"The band intensities were quantified using Quantity One™ software (Bio-rad).",
"A dilution series of c-Met showed a linear correlation between protein concentration and band intensity and was used to generate a calibration curve.",
"The quantified amount of cross-linked protein in the bead fraction was calculated and converted to the amount of cross-linked aptamer.",
"This value was then divided by the total amount of aptamer to obtain the cross-link efficiency.",
"A comparison of the total amount of c-Met and the cross-linked c-Met fraction after UV irradiation revealed a cross-linking efficiency of approximately 30%.",
"This efficiency is higher than the 5-20% efficiencies typically observed when using aptamers functionalized with 5-bromo- or 5-iododeoxyuridine residues, and similar to the efficiency observed with mRNA 2,4-dinitro-5-fluoro phenyl azide.",
"Thus, the observed high levels of functionalization demonstrate that positioning of the labeling reagent at the 5′-end of the aptamer places the phenyl azide sufficiently close to the protein target to enable efficient cross-linking, yet at the same time distant enough from the binding site to prevent a loss in affinity.",
"Example 4: In Vitro Cross-Linking of the 5′-Functionalized Aptamer D17.4 with Immunoglobulin E To estimate its generality of the method in vitro cross-linking of a 5′-functionalized aptamer was repeated using another aptamer/protein pair using the immunoglobulin E (IgE) binding DNA aptamer D17.4 (SEQ ID NO: 3), whose target primarily resides in the blood stream.",
"The secondary structure of the aptamer D17.4 forms a simple hairpin-loop structure and differs from the secondary structure of the aptamer CLN3.For a non-binding variant to be used as negative control, a scrambled sequence variant D17.4sc (SEQ ID NO: 4) was created.",
"Functionalization at the 5′-ends of aptamers D17.4 and D17.4sc with Sulfo-SBED as labeling reagent was performed as described in Example 1.As described in Example 2, incubation of the target protein IgE with the 5′-functionalized aptamer D17.4 was performed by mixing 250 nM of the aptamer with different protein concentrations in a round-bottom polypropylene 96 wells plate (Brand, Wertheim, Germany) using the buffer from the filter binding experiments.",
"Samples were covered from light using aluminum foil and incubated at 37° C. for 30 min.",
"Subsequently, control samples without UV light were stored in the dark at 4° C., whereas crosslinking was performed by placing the 96-wells plate containing the remaining samples on ice and illuminating at 365 nm for 10 minutes using a UVP 3UV lamp (Thermo Scientific, Rockford, USA).",
"Filter retention assays in which the 5′-functionalized aptamer competed with the non-functionalized aptamer for binding to IgE were performed as described above to test the influence of the 5′-functionalization on aptamer binding.",
"FIG.",
"3A shows that the binding affinity for the protein target IgE was not altered for the aptamer functionalized at the 5′-end with Sulfo-SBED (ABAL-D17.4) compared to the non functionalized aptamer (D17.4).",
"Further, the amount of cross-linking of the 5′-functionalized aptamer D17.4 to IgE was investigated.",
"IgE was incubated in concentrations of 0.5 μM, 167 nm, 56 nm and 19 nM with 250 nM of the 5′-functionalized aptamer D17.4 and D17.4sc, followed by UV irradiation at 365 nm.",
"The amount of cross-linking was analyzed using SDS-PAGE, followed by Western blotting using Neutravidin-Dylight™ 800 (Thermo Scientific) to visualize biotinylated proteins.",
"Anti-IgE (XTE4, mouse monoclonal, 1:500, Abcam) was used to visualize the total amount of IgE.",
"The blots were scanned at 800 nm using an Odyssey scanner (Li-cor Biotechnology, Bad Homburg, Germany).",
"FIG.",
"3B shows that high levels of cross-linking were observed for the 5′-functionalized aptamer D17.4 (ABAL-D17.4), whereas for the functionalized non-binding aptamer variant (ABAL-D17.4sc) marginal cross-linking was detectable at only the highest protein concentrations.",
"Quantification of the cross-linking bands at the highest protein concentrations yielded differences in cross-linking of 17-fold between D17.4 and its negative control for IgE.",
"This result is similar to the observation for 5′-functionalized aptamer trCLN3 in Example 2, indicating that the method can potentially be applied to a broad variety of aptamer/protein complexes.",
"Example 5: In Vitro Cross-Linking of the 5′-Functionalized Aptamer C10.35 with the Sec7 Domain of the Guanine Nucleotide Exchange Factor Cytohesin-2 In vitro cross-linking of a 5′-functionalized aptamer was repeated using the aptamer C10.35 (SEQ ID NO: 1) which binds the Sec7 domain of the guanine nucleotide exchange factor cytohesin-2 (Sec-7), a cytoplasmic protein required for activating small GTPases and receptor tyrosin kinases, respectively.",
"The secondary structure of the aptamer C10.35 comprises a stem with a double bulge.",
"For a non-binding variant to be used as negative control the non-binding point mutant C10.35 C15T (SEQ ID NO: 2) was used.",
"Functionalization at the 5′-ends of aptamers C10.35 and C10.35 C15T with Sulfo-SBED as labeling reagent was performed as described in Example 1.Incubation of the target protein Sec7 with the 5′-functionalized aptamer C10.35 was performed by mixing 250 nM of the aptamer with different protein concentrations at 37° C. for 30 min as described in Examples 2 and 4.Crosslinking also was performed on ice by illuminating at 365 nm for 10 minutes.",
"Filter retention assays in which the 5′-functionalized aptamer competed with the non-functionalized aptamer for binding to Sec-7 were performed as described above to test the influence of the 5′-functionalization on aptamer binding.",
"FIG.",
"4A shows that the binding affinity for the protein target Sec-7 was not altered for the aptamer functionalized at the 5′-end with Sulfo-SBED (ABAL-C10.35) compared to the non functionalized aptamer (C10.35).",
"Further, the amount of cross-linking of the 5′-functionalized aptamer C10.35 to Sec-7 was investigated after incubating 0.5 μM, 167 nm, 56 nm and 19 nM Sec-7 with 250 nM of the 5′-functionalized aptamers C10.35 and C10.35 C15T, followed by UV irradiation at 365 nm using SDS-PAGE, followed by western blotting using Neutravidin-Dylight™ 800 (Thermo Scientific) to visualize biotinylated proteins.",
"Anti-penta-his (1:2000, Qiagen) was used to visualize the total amount of Sec7 and goat-anti-mouse-IgG-Dylight™ 800 (Thermo Scientific) was used as a secondary antibody.",
"The blots were scanned at 800 nm using an Odyssey scanner (Li-cor Biotechnology, Bad Homburg, Germany).",
"FIG.",
"4B shows that high levels of cross-linking were observed for the 5′-functionalized aptamer C10.35 (ABAL-C10.35), whereas for the functionalized non-binding aptamer variant (ABAL-C10.35 C15T) marginal cross-linking was detectable at only the highest protein concentrations.",
"Quantification of the cross-linking bands at the highest protein concentrations yielded differences in cross-linking of 7-fold between C10.35 and its negative control for Sec-7.This result confirms that the method can potentially be applied to a broad variety of aptamer/protein complexes.",
"Example 6: Cross-Linking of a 5′-Functionalized Aptamer in a Cell Lysate The ability to specifically and reliably cross-link targets in complex media was determined in a lysate from human H460 cells.",
"To a cell lysate of H460 cells of a final concentration of 2 mg/ml 250 nM of the 5′-functionalized aptamer C10.35 and 1 μM of Sec7 were added.",
"As a control sample 1 μM of Sec7 and 250 nM of the 5′-functionalized negative control aptamer C10.35 C15T were added to respective lysate samples.",
"Samples were covered from light using aluminium foil and incubated at 37° C. for 30 min.",
"Subsequently, the samples were placed on ice and illuminated at 365 nm for 10 minutes using a UVP 3UV lamp (Thermo Scientific, Rockford, USA).",
"For visualization of crosslinked products SDS-PAGE, followed by western blotting using fluorescence-labeled Neutravidin-Dylight™ 800 (Thermo Scientific) to visualize biotinylated proteins was used.",
"Anti-penta-his (1:2000, Qiagen) was used to visualize the total amount of Sec7 and goat-anti-mouse-IgG-Dylight™ 800 (Thermo Scientific) was used as a secondary antibody.",
"The blots were scanned at 800 nm using an Odyssey scanner (Li-cor Biotechnology, Bad Homburg, Germany).",
"A band corresponding to the molecular weight of Sec7 in the lysate was detected, whereas this band was absent when the negative control ABAL-C10.35 C15T was used.",
"This demonstrates that cross-linking of the 5′-functionalized aptamer to its target protein is possible in complex mixtures of different proteins.",
"Example 7: Identification of Aptamer Target Proteins on the Cell Surface H1838 cells, a non-small-cell lung carcinoma (NSCLC) cell line which is known to overexpress c-Met, were grown in a Ibidi μ-Dish 35 mm, low (Ibidi), and washed twice with PBS prior to addition of PBS containing 250 nM of 5′-functionalized trCLN3 aptamer and 1 mg/mL tRNA solution, pH 7.4.Control cells were incubated with the 5′-functionalized non-binding G25A point-mutant of trCLN3 or no aptamer.",
"The cell samples were incubated for 30 minutes at 37° C. on a tilting platform, followed by 10 minutes of irradiation at 365 nm on ice.",
"After addition of streptavidin-coated magnetic MyOne™ streptavidin Dynabeads (Invitrogen) to a final concentration of 0.25 mg/mL, the cells were incubated for 1 h at room temperature, washed 1× with PBS and subsequently used for microscopy imaging.",
"Microscopy images where obtained using an Axio Observer.D1 microscopy (Zeiss) equipped with a Zeiss CD-plan Neofluar 40× objective and a PCO Sensicam detector.",
"FIG.",
"5A shows the images of magnetic bead binding to H1838 cells incubated with 5′-functionalized trCLN3 (ABAL-trCLN3), FIG.",
"5B the 5′-functionalized non-binding mutant (ABAL-trCLN3 G25A), and FIG.",
"5C no aptamer.",
"As is evident from FIG.",
"5A, cells incubated with the 5′-functionalized trCLN3 aptamer ABAL-trCLN3 showed impressively enhanced bead binding to their surface.",
"Virtually no bead binding was observed when using the 5′-functionalized non-binding mutant, or no aptamer, as can be taken from FIGS.",
"5B and 5C respectively.",
"This result not only demonstrates that the identification of aptamer target proteins can be employed to targets in the context of living cells, but also shows that the specificity of the method observed in vitro is maintained.",
"Furthermore, the efficient labeling of cells with magnetic beads also expands the repertoire of methods for magnetic cell sorting, which so far was restricted to the introduction of magnetism by antibodies.",
"Example 8: Enrichment of Target Protein in a Sample H1838 cells were grown to 70-80%, followed by resuspension using Alfazyme (PAA, Colbe, Germany).",
"After Alfazyme treatment, the cells were centrifuged for 5 minutes at 200 g, resuspended in PBS and centrifuged again at 200 g for 5 minutes.",
"For each sample ˜8×105 cells were used and resuspended in PBS containing 1 mM MgCl2 and 1 mg/ml tRNA, pH 7.4, together with 5′-functionalized trCLN3 aptamer, the 5′-functionalized non-binding G25A point-mutant of trCLN3 or no aptamer.",
"Cells were incubated for 30 min at 37° C. in a tumble shaker followed by placement on ice and exposure to UV light of 365 nm for 10 minutes.",
"After cross-linking, the sample was transferred to a brown eppendorf tube containing 30 μg MyOne™ streptavidin Dynabeads (Invitrogen) and incubated in a tumble shaker for 1 hour at room temperature.",
"Next, lysis buffer was added to a final concentration of 50 mM Tris, 10 mM MgCl2, 200 mM NaCl, 5% glycerol, 1% Triton X-100, 1 mM PMSF, pH 7.4, and 1× protease inhibitor cocktail (Roche) and placed on ice for 20 min.",
"Using a magnetic rack, the supernatant was separated from the beads, followed by 2 washes using 2 M NaCl, 1 mM EDTA, 1% Triton X-100 and 10 mM Tris-HCl, pH 7.5 and 1 wash using the same buffer except for 0.01% instead of 1% Triton X-100.The beads were resuspended in PBS, after which the supernatant and bead fraction were used for Western Blot analysis.",
"Neutravidin-Dylight™ 800 (1:20000; Thermo Scientific) was used to visualize biotinylated proteins, whereas Met (C-28) antibody (SC-161, Santa Cruz Biotechnology, Santa Cruz, USA) was used in combination with fluorescence-labeled goat-anti-rabbit-IgG-Dylight™ 800 (1:20000; Thermo Scientific) for c-Met.",
"FIG.",
"6 shows the Western Blot analysis of the supernatant (Sn) or bead (B) fractions of samples treated with 5′-functionalized trCLN3 (ABAL-trCLN3) (1), 5′-functionalized non-binding G25A point-mutant of trCLN3 (ABAL-trCLN3 G25A) (2) or no aptamer (-) in presence or absence of UV irradiation.",
"Sample L contained H1838 cell lysate without aptamer.",
"This shows an enrichment of c-Met when using the 5′-functionalized trCLN3 aptamer whereas no band corresponding to c-Met was observed in the bead fraction when using the G25A mutant.",
"This further underlines the importance of specific binding in combination the UV-induced crosslinking for the enrichment of the target protein from complex mixtures.",
"Although preferred embodiments of the present invention have been shown and described herein, it will be obvious to those skilled in the art that such embodiments are provided by way of example only.",
"Numerous variations, changes, and substitutions will now occur to those skilled in the art without departing from the invention.",
"It should be understood that various alternatives to the embodiments of the invention described herein may be employed in practicing the invention.",
"It is intended that the following claims define the scope of the invention and that methods and structures within the scope of these claims and their equivalents be covered thereby."
]
] |
Patent_15871313
|
[
[
"METHOD AND APPARATUS FOR PROCESSING OPERATION REQUEST IN STORAGE SYSTEM",
"According to embodiments of the present invention, in a storage system, a switch receives an operation request, where the operation request carries request identification; the switch queries, according to the request identification, a flow table of the switch to obtain a flow table entry matching the operation request; and the switch forwards the operation request to a target storage device among storage devices according to a forwarding rule of the matching flow table entry.",
"By using a characteristic of a SDN, the operation request is processed according to the forwarding rule of the flow table entry of the switch, thereby implementing load balancing of the storage devices and reducing information interaction between the storage devices."
],
[
"1.A method implemented by a switch, the method comprising: receiving, by the switch, an operation request, wherein the operation request comprises a request identification, and the request identification comprises storage strategy information wherein the storage strategy information indicates a number of copies of an object; querying, by the switch according to the request identification, a flow table of the switch to obtain a flow table entry matching the operation request; when the operation request is a read request, a forwarding rule of the matching flow table entry is formulated according to flow load of storage devices that store requested data; when the operation request is a write request, the forwarding rule of the matching flow table entry is formulated according to remaining storage capacity of the storage devices; and forwarding, by the switch, the operation request to a target storage device among the storage devices according to the forwarding rule of the matching flow table entry.",
"2.The method according to claim 1, wherein the request identification further comprises user group information, and wherein a virtual local area network identification field of the operation request carries the user group information, and a virtual local area network identification field in a packet header field of the matching flow table entry carries the user group information.",
"3.The method according to claim 1, wherein an Internet Protocol Type of Service field in a packet header field of the matching flow table entry carries the storage strategy information.",
"4.The method according to claim 1, wherein the request identification further comprises user group information, and wherein a virtual local area network identification field of the operation request carries the user group information, a virtual local area network identification field in a packet header field of the matching flow table entry carries the user group information, and an Internet Protocol Type of Service field in a packet header field of the matching flow table entry carries the storage strategy information.",
"5.The method according to claim 1, further comprising: updating a number of times that the read request is forwarded to the target storage device, wherein the number of times is recorded in the matching flow table entry when the operation request is the read request.",
"6.The method according to claim 1, further comprising: updating a number of times that the write request is forwarded to the target storage device, wherein a number of times is recorded in the matching flow table entry when the operation request is the write request.",
"7.A storage system comprising: a switch; a controller in communication with the switch; wherein the switch comprises a processor and a memory storing instructions that, when executed by the processor, cause the processor perform the steps of: receive a flow table from the controller wherein the flow table comprises a plurality of flow table entries; receive an operation request, wherein the operation request carries comprises identification, and the request identification storage strategy information, wherein the storage strategy information indicates a number of copies of an object; query, according to the request identification, the flow table to obtain a flow table entry matching the operation request; when the operation request is a read request, a forwarding rule of the matching flow table entry is formulated according to flow load of storage devices that store requested data; when the operation request is a write request, the forwarding rule of the matching flow table entry is formulated according to remaining storage capacity of the storage devices; and forward the operation request to a target storage device among the storage devices according to the forwarding rule of the matching flow table entry.",
"8.The switch according to claim 7, wherein the request identification further comprises user group information, and wherein a virtual local area network identification field of the operation request carries the user group information, and a virtual local area network identification field in a packet header field of the matching flow table entry carries the user group information.",
"9.The switch according to claim 7, wherein an Internet Protocol Type of Service field in a packet header field of the matching flow table entry carries the storage strategy information.",
"10.The switch according to claim 7, wherein the request identification further comprises user group information, and wherein a virtual local area network identification field of the operation request carries the user group information, a virtual local area network identification field in a packet header field of the matching flow table entry carries the user group information, and an Internet Protocol Type of Service field in a packet header field of the matching flow table entry carries the storage strategy information.",
"11.The switch according to claim 7, wherein the processor executes the instructions to: update a number of times that the read request is forwarded to the target storage device, wherein the number of times is recorded in the matching flow table entry when the operation request is the read request.",
"12.The switch according to claim 7, wherein processor executes the instructions to: update a number of times that the write request is forwarded to the target storage device, wherein the number of times is recorded in the matching flow table entry when the operation request is the write request.",
"13.A nonvolatile computer readable storage medium comprising instructions that when executed by one or more processors, cause the one or more processors to: receive an operation request, wherein the operation request carries request comprises identification, and the request identification comprises storage strategy information wherein the storage strategy information indicates a number of copies of an object; query, according to the request identification, a flow table of the switch to obtain a flow table entry matching the operation request; when the operation request is a read request, a forwarding rule of the matching flow table entry is formulated according to flow load of storage devices that store requested data; when the operation request is a write request, the forwarding rule of the matching flow table entry is formulated according to remaining storage capacity of the storage devices; and forward the operation request to a target storage device among the storage devices according to a the forwarding rule of the matching flow table entry.",
"14.The nonvolatile computer readable storage medium according to claim 13, further comprising instructions that when executed by one or more processors, cause the one or more processors to: update a number of times that a read request is forwarded to the target storage device, wherein the number of times is recorded in the matching flow table entry when the operation request is the read request.",
"15.The nonvolatile computer readable storage medium according to claim 13, further comprising instructions that when executed by one or more processors, cause the processors to: update a number of times that a write request is forwarded to the target storage device, wherein the number of times is recorded in the matching flow table entry when the operation request is the write request."
],
[
"<SOH> BACKGROUND <EOH>In a storage system, a metadata server is used to manage an operation request for the storage system, and record metadata of the storage system.",
"When accessing the storage system, a user firstly needs to communicate with the metadata server to obtain metadata required by the operation request.",
"To ensure load balancing of a storage system, the storage system is based on a global distributed load balancing scheme in the prior art, and load balancing of the storage system is realized by performing information interaction between storage devices.",
"However, it is inconvenient to perform information interaction between the storage devices."
],
[
"<SOH> SUMMARY <EOH>To solve the foregoing problem in the prior art, embodiments of the present invention provide a method and an apparatus for processing an operation request in a storage system, and a nonvolatile computer readable storage medium, as well as a method and an apparatus for generating a flow table entry forwarding rule, and a nonvolatile computer readable storage medium.",
"According to a first aspect, an embodiment of the present invention provides a method for processing an operation request in a storage system, where the storage system includes a controller, a switch, and storage devices communicating with the switch, the controller communicates with the switch, and the controller is configured to formulate and deliver a flow table of the switch; and the method includes: receiving, by the switch, an operation request, where the operation request carries request identification, and the request identification includes at least one of user group information and storage strategy information; querying, by the switch according to the request identification, the flow table of the switch to obtain a flow table entry matching the operation request; and forwarding, by the switch, the operation request to a target storage device among the storage devices according to a forwarding rule of the matching flow table entry.",
"According to the embodiment of the first aspect, in a first possible implementation manner, when the request identification is the user group information, a virtual local area network identification bit of the operation request carries the user group information, and a virtual local area network identification bit in a packet header field of the matching flow table entry carries the user group information; or when the request identification is the storage strategy information, an Internet Protocol Type of Service bit of the operation request carries the storage strategy information, and an Internet Protocol Type of Service bit in a packet header field of the matching flow table entry carries the storage strategy information; or when the request identification is the user group information and the storage strategy information, a virtual local area network identification bit of the operation request carries the user group information, an Internet Protocol Type of Service bit of the operation request carries the storage strategy information, a virtual local area network identification bit in a packet header field of the matching flow table entry carries the user group information, and an Internet Protocol Type of Service bit in a packet header field of the matching flow table entry carries the storage strategy information.",
"According to the embodiment of the first aspect, in a second possible implementation manner, when the operation request is a read request, the forwarding rule of the matching flow table entry is formulated by the controller according to flow load of storage devices that store requested data.",
"According to the second possible implementation manner, in a third possible implementation manner, the method further includes: updating, by the switch, the number of times that the read request is forwarded to the target storage device, where the number of times is recorded in the matching flow table entry.",
"According to the embodiment of the first aspect or the first possible implementation manner of the embodiment of the first aspect, in a fourth possible implementation manner, when the operation request is a write request, the forwarding rule of the matching flow table entry is formulated by the controller according to remaining storage capacity of the storage devices.",
"According to the fourth possible implementation manner, in a fifth possible implementation manner, the method further includes: updating, by the switch, the number of times that the write request is forwarded to the target storage device, where the number of times is recorded in the matching flow table entry.",
"According to a second aspect, an embodiment of the present invention provides a method for generating a flow table entry forwarding rule, where the method is applied to a storage system, the storage system includes a controller, a switch, and a storage device communicating with the switch, the controller communicates with the switch, and the controller is configured to formulate and deliver a flow table of the switch; and the method includes: obtaining, by the controller, remaining storage capacity information of the storage device communicating with the switch; and generating, by the controller according to the remaining storage capacity information of the storage device, a forwarding rule matching a write request, where the write request is used to write data into the storage device communicating with the switch.",
"According to the second aspect, in a first possible implementation manner, the obtaining, by the controller, remaining storage capacity information of the storage device communicating with the switch specifically includes: receiving, by the controller, the remaining storage capacity information reported by the storage device.",
"According to the second aspect, in a second possible implementation manner, the obtaining, by the controller, remaining storage capacity information of the storage device communicating with the switch specifically includes: obtaining, by the controller, the number of times that the write request is forwarded to the storage device and a size of written data, where the number of times and the size are recorded in a flow table entry of the flow table of the switch; and calculating, by the controller, remaining storage capacity of the storage device according to storage capacity of the storage device, the number of times of the write request, and the size of the written data.",
"According to a third aspect, an embodiment of the present invention provides a method for generating a flow table entry forwarding rule, where the method is applied to a storage system, the storage system includes a controller, a switch, and storage devices communicating with the switch, the controller communicates with the switch, and the controller is configured to formulate and deliver a flow table of the switch; and the method includes: obtaining, by the controller, flow load information of storage device that store requested data; and generating, by the controller according to the flow load information of the storage devices that store the requested data, a forwarding rule matching a read request.",
"According to the third aspect, in a first possible implementation manner, the obtaining, by the controller, flow load information of storage devices that store requested data specifically includes: receiving, by the controller, the flow load information reported by the storage devices that store the requested data.",
"According to the third aspect, in a second possible implementation manner, the obtaining, by the controller, flow load information of storage devices that store requested data specifically includes: obtaining, by the controller, the number of times that an operation request is forwarded to the storage devices that store requested data, where the number of times is recorded in a flow table entry of the flow table of the switch, and the operation request includes a write request and a read request.",
"According to a fourth aspect, an embodiment of the present invention provides a switch, where the switch is applied to a storage system, the storage system includes a controller, the switch, and storage devices communicating with the switch, the controller communicates with the switch, and the controller is configured to formulate and deliver a flow table of the switch; and the switch includes: a receiving unit, configured to receive an operation request, where the operation request carries request identification, and the request identification includes at least one of user group information and storage strategy information; a querying unit, configured to query, according to the request identification, the flow table of the switch to obtain a flow table entry matching the operation request; and a forwarding unit, configured to forward the operation request to a target storage device among the storage devices according to a forwarding rule of the matching flow table entry.",
"According to the fourth aspect, in a first possible implementation manner, when the operation request is a read request, the forwarding rule of the matching flow table entry is formulated by the controller according to flow load of storage devices that store requested data.",
"According to the fourth aspect, in a second possible implementation manner, when the operation request is a write request, the forwarding rule of the matching flow table entry is formulated by the controller according to remaining storage capacity of the storage devices.",
"According to a fifth aspect, an embodiment of the present invention provides a controller, where the controller is applied to a storage system, the storage system includes the controller, a switch, and a storage device communicating with the switch, the controller communicates with the switch, and the controller is configured to formulate and deliver a flow table of the switch; and the controller includes: an obtaining unit, configured to obtain remaining storage capacity information of the storage device communicating with the switch; and a generating unit, configured to generate, according to the remaining storage capacity information of the storage device, a forwarding rule matching a write request, where the write request is used to write data into the storage device communicating with the switch.",
"According to the fifth aspect, in a first possible implementation manner, the obtaining unit is specifically configured to receive the remaining storage capacity information reported by the storage device.",
"According to the fifth aspect, in a second possible implementation manner, the obtaining unit is specifically configured to: obtain the number of times that the write request is forwarded to the storage device and a size of written data, where the number of times and the size are recorded in a flow table entry of the flow table of the switch; and the controller calculates remaining storage capacity of the storage device according to storage capacity of the storage device, the number of times of the write request, and the size of the written data.",
"According to a sixth aspect, an embodiment of the present invention provides a controller, where the controller is applied to a storage system, the storage system includes the controller, a switch, and storage devices communicating with the switch, the controller communicates with the switch, and the controller is configured to formulate and deliver a flow table of the switch; and the controller includes: an obtaining unit, configured to obtain flow load information of storage devices that store requested data; and a generating unit, configured to generate, according to the flow load information of the storage devices that store the requested data, a forwarding rule matching a read request.",
"According to the sixth aspect, in a first possible implementation manner, the obtaining unit is specifically configured to receive the flow load information reported by the storage devices that store the requested data.",
"According to the sixth aspect, in a second possible implementation manner, the obtaining unit is specifically configured to obtain the number of times that an operation request is forwarded to the storage devices that store requested data, where the number of times is recorded in a flow table entry of the flow table of the switch, and the operation request includes a write request and a read request.",
"According to a seventh aspect, an embodiment of the present invention provides a switch, where the switch is applied to a storage system, the storage system includes a controller, the switch, and storage devices communicating with the switch, the controller communicates with switch, and the controller is configured to formulate and deliver a flow table of the switch; and the switch includes a central processing unit and a memory, where the central processing unit and the memory are connected by using a bus, the memory is configured to store a computer instruction, and the central processing unit executes the computer instruction stored in the memory, so as to implement the first aspect or any one of the first to fourth possible implementation manners of the first aspect in the present invention.",
"According to an eighth aspect, an embodiment of the present invention provides a controller, where the controller is applied to a storage system, the storage system includes the controller, a switch, and a storage device communicating with the switch, the controller communicates with switch, and the controller is configured to formulate and deliver a flow table of the switch; and the controller includes a central processing unit and a memory, where the central processing unit and the memory are connected by using a bus, the memory is configured to store a computer instruction, and the central processing unit executes the computer instruction stored in the memory, so as to implement the second aspect, or the first or the second possible implementation manner of the second aspect in the present invention.",
"According to a ninth aspect, an embodiment of the present invention provides a controller, where the controller is applied to a storage system, the storage system includes the controller, a switch, and storage devices communicating with the switch, the controller communicates with switch, and the controller is configured to formulate and deliver a flow table of the switch; and the controller includes a central processing unit and a memory, where the central processing unit and the memory are connected by using a bus, the memory is configured to store a computer instruction, and the central processing unit executes the computer instruction stored in the memory, so as to implement the third aspect, or the first or the second possible implementation manner of the third aspect in the present invention.",
"According to a tenth aspect, an embodiment of the present invention provides a nonvolatile computer readable storage medium, where the computer storage medium stores a computer instruction, and is configured to implement, when a computer executes the computer instruction, the first aspect or any one of the first to fourth possible implementation manners of the first aspect in the present invention.",
"According to an eleventh aspect, an embodiment of the present invention provides a nonvolatile computer readable storage medium, where the computer storage medium stores a computer instruction, and is configured to implement the second aspect, or the first or the second possible implementation manner of the second aspect in the present invention when a computer executes the computer instruction.",
"According to a twelfth aspect, an embodiment of the present invention provides a nonvolatile computer readable storage medium, where the computer storage medium stores a computer instruction, and is configured to implement the third aspect, or the first or the second possible implementation manner of the third aspect in the present invention when a computer executes the computer instruction.",
"According to embodiments of the present invention, in a storage system, a switch receives an operation request, where the operation request carries request identification; the switch queries, according to the request identification, a flow table of the switch to obtain a flow table entry matching the operation request; and the switch forwards the operation request to a target storage device among storage devices according to a forwarding rule of the matching flow table entry.",
"By using a characteristic of a Software Defined Network (SDN), the operation request is processed according to the forwarding rule of the flow table entry of the switch, thereby implementing load balancing of the storage devices and reducing information interaction between the storage devices."
],
[
"CROSS-REFERENCE TO RELATED APPLICATIONS This application is a continuation of U.S. application Ser.",
"No.",
"14/583,456, filed on Dec. 26, 2014, now allowed, which is a continuation of International Application No.",
"PCT/CN2013/082755, filed on Aug. 31, 2013.Both of the aforementioned applications are hereby incorporated by reference in their entireties.",
"TECHNICAL FIELD The present invention relates to the field of information technologies, and in particular, to a method and an apparatus for processing an operation request in a storage system.",
"BACKGROUND In a storage system, a metadata server is used to manage an operation request for the storage system, and record metadata of the storage system.",
"When accessing the storage system, a user firstly needs to communicate with the metadata server to obtain metadata required by the operation request.",
"To ensure load balancing of a storage system, the storage system is based on a global distributed load balancing scheme in the prior art, and load balancing of the storage system is realized by performing information interaction between storage devices.",
"However, it is inconvenient to perform information interaction between the storage devices.",
"SUMMARY To solve the foregoing problem in the prior art, embodiments of the present invention provide a method and an apparatus for processing an operation request in a storage system, and a nonvolatile computer readable storage medium, as well as a method and an apparatus for generating a flow table entry forwarding rule, and a nonvolatile computer readable storage medium.",
"According to a first aspect, an embodiment of the present invention provides a method for processing an operation request in a storage system, where the storage system includes a controller, a switch, and storage devices communicating with the switch, the controller communicates with the switch, and the controller is configured to formulate and deliver a flow table of the switch; and the method includes: receiving, by the switch, an operation request, where the operation request carries request identification, and the request identification includes at least one of user group information and storage strategy information; querying, by the switch according to the request identification, the flow table of the switch to obtain a flow table entry matching the operation request; and forwarding, by the switch, the operation request to a target storage device among the storage devices according to a forwarding rule of the matching flow table entry.",
"According to the embodiment of the first aspect, in a first possible implementation manner, when the request identification is the user group information, a virtual local area network identification bit of the operation request carries the user group information, and a virtual local area network identification bit in a packet header field of the matching flow table entry carries the user group information; or when the request identification is the storage strategy information, an Internet Protocol Type of Service bit of the operation request carries the storage strategy information, and an Internet Protocol Type of Service bit in a packet header field of the matching flow table entry carries the storage strategy information; or when the request identification is the user group information and the storage strategy information, a virtual local area network identification bit of the operation request carries the user group information, an Internet Protocol Type of Service bit of the operation request carries the storage strategy information, a virtual local area network identification bit in a packet header field of the matching flow table entry carries the user group information, and an Internet Protocol Type of Service bit in a packet header field of the matching flow table entry carries the storage strategy information.",
"According to the embodiment of the first aspect, in a second possible implementation manner, when the operation request is a read request, the forwarding rule of the matching flow table entry is formulated by the controller according to flow load of storage devices that store requested data.",
"According to the second possible implementation manner, in a third possible implementation manner, the method further includes: updating, by the switch, the number of times that the read request is forwarded to the target storage device, where the number of times is recorded in the matching flow table entry.",
"According to the embodiment of the first aspect or the first possible implementation manner of the embodiment of the first aspect, in a fourth possible implementation manner, when the operation request is a write request, the forwarding rule of the matching flow table entry is formulated by the controller according to remaining storage capacity of the storage devices.",
"According to the fourth possible implementation manner, in a fifth possible implementation manner, the method further includes: updating, by the switch, the number of times that the write request is forwarded to the target storage device, where the number of times is recorded in the matching flow table entry.",
"According to a second aspect, an embodiment of the present invention provides a method for generating a flow table entry forwarding rule, where the method is applied to a storage system, the storage system includes a controller, a switch, and a storage device communicating with the switch, the controller communicates with the switch, and the controller is configured to formulate and deliver a flow table of the switch; and the method includes: obtaining, by the controller, remaining storage capacity information of the storage device communicating with the switch; and generating, by the controller according to the remaining storage capacity information of the storage device, a forwarding rule matching a write request, where the write request is used to write data into the storage device communicating with the switch.",
"According to the second aspect, in a first possible implementation manner, the obtaining, by the controller, remaining storage capacity information of the storage device communicating with the switch specifically includes: receiving, by the controller, the remaining storage capacity information reported by the storage device.",
"According to the second aspect, in a second possible implementation manner, the obtaining, by the controller, remaining storage capacity information of the storage device communicating with the switch specifically includes: obtaining, by the controller, the number of times that the write request is forwarded to the storage device and a size of written data, where the number of times and the size are recorded in a flow table entry of the flow table of the switch; and calculating, by the controller, remaining storage capacity of the storage device according to storage capacity of the storage device, the number of times of the write request, and the size of the written data.",
"According to a third aspect, an embodiment of the present invention provides a method for generating a flow table entry forwarding rule, where the method is applied to a storage system, the storage system includes a controller, a switch, and storage devices communicating with the switch, the controller communicates with the switch, and the controller is configured to formulate and deliver a flow table of the switch; and the method includes: obtaining, by the controller, flow load information of storage device that store requested data; and generating, by the controller according to the flow load information of the storage devices that store the requested data, a forwarding rule matching a read request.",
"According to the third aspect, in a first possible implementation manner, the obtaining, by the controller, flow load information of storage devices that store requested data specifically includes: receiving, by the controller, the flow load information reported by the storage devices that store the requested data.",
"According to the third aspect, in a second possible implementation manner, the obtaining, by the controller, flow load information of storage devices that store requested data specifically includes: obtaining, by the controller, the number of times that an operation request is forwarded to the storage devices that store requested data, where the number of times is recorded in a flow table entry of the flow table of the switch, and the operation request includes a write request and a read request.",
"According to a fourth aspect, an embodiment of the present invention provides a switch, where the switch is applied to a storage system, the storage system includes a controller, the switch, and storage devices communicating with the switch, the controller communicates with the switch, and the controller is configured to formulate and deliver a flow table of the switch; and the switch includes: a receiving unit, configured to receive an operation request, where the operation request carries request identification, and the request identification includes at least one of user group information and storage strategy information; a querying unit, configured to query, according to the request identification, the flow table of the switch to obtain a flow table entry matching the operation request; and a forwarding unit, configured to forward the operation request to a target storage device among the storage devices according to a forwarding rule of the matching flow table entry.",
"According to the fourth aspect, in a first possible implementation manner, when the operation request is a read request, the forwarding rule of the matching flow table entry is formulated by the controller according to flow load of storage devices that store requested data.",
"According to the fourth aspect, in a second possible implementation manner, when the operation request is a write request, the forwarding rule of the matching flow table entry is formulated by the controller according to remaining storage capacity of the storage devices.",
"According to a fifth aspect, an embodiment of the present invention provides a controller, where the controller is applied to a storage system, the storage system includes the controller, a switch, and a storage device communicating with the switch, the controller communicates with the switch, and the controller is configured to formulate and deliver a flow table of the switch; and the controller includes: an obtaining unit, configured to obtain remaining storage capacity information of the storage device communicating with the switch; and a generating unit, configured to generate, according to the remaining storage capacity information of the storage device, a forwarding rule matching a write request, where the write request is used to write data into the storage device communicating with the switch.",
"According to the fifth aspect, in a first possible implementation manner, the obtaining unit is specifically configured to receive the remaining storage capacity information reported by the storage device.",
"According to the fifth aspect, in a second possible implementation manner, the obtaining unit is specifically configured to: obtain the number of times that the write request is forwarded to the storage device and a size of written data, where the number of times and the size are recorded in a flow table entry of the flow table of the switch; and the controller calculates remaining storage capacity of the storage device according to storage capacity of the storage device, the number of times of the write request, and the size of the written data.",
"According to a sixth aspect, an embodiment of the present invention provides a controller, where the controller is applied to a storage system, the storage system includes the controller, a switch, and storage devices communicating with the switch, the controller communicates with the switch, and the controller is configured to formulate and deliver a flow table of the switch; and the controller includes: an obtaining unit, configured to obtain flow load information of storage devices that store requested data; and a generating unit, configured to generate, according to the flow load information of the storage devices that store the requested data, a forwarding rule matching a read request.",
"According to the sixth aspect, in a first possible implementation manner, the obtaining unit is specifically configured to receive the flow load information reported by the storage devices that store the requested data.",
"According to the sixth aspect, in a second possible implementation manner, the obtaining unit is specifically configured to obtain the number of times that an operation request is forwarded to the storage devices that store requested data, where the number of times is recorded in a flow table entry of the flow table of the switch, and the operation request includes a write request and a read request.",
"According to a seventh aspect, an embodiment of the present invention provides a switch, where the switch is applied to a storage system, the storage system includes a controller, the switch, and storage devices communicating with the switch, the controller communicates with switch, and the controller is configured to formulate and deliver a flow table of the switch; and the switch includes a central processing unit and a memory, where the central processing unit and the memory are connected by using a bus, the memory is configured to store a computer instruction, and the central processing unit executes the computer instruction stored in the memory, so as to implement the first aspect or any one of the first to fourth possible implementation manners of the first aspect in the present invention.",
"According to an eighth aspect, an embodiment of the present invention provides a controller, where the controller is applied to a storage system, the storage system includes the controller, a switch, and a storage device communicating with the switch, the controller communicates with switch, and the controller is configured to formulate and deliver a flow table of the switch; and the controller includes a central processing unit and a memory, where the central processing unit and the memory are connected by using a bus, the memory is configured to store a computer instruction, and the central processing unit executes the computer instruction stored in the memory, so as to implement the second aspect, or the first or the second possible implementation manner of the second aspect in the present invention.",
"According to a ninth aspect, an embodiment of the present invention provides a controller, where the controller is applied to a storage system, the storage system includes the controller, a switch, and storage devices communicating with the switch, the controller communicates with switch, and the controller is configured to formulate and deliver a flow table of the switch; and the controller includes a central processing unit and a memory, where the central processing unit and the memory are connected by using a bus, the memory is configured to store a computer instruction, and the central processing unit executes the computer instruction stored in the memory, so as to implement the third aspect, or the first or the second possible implementation manner of the third aspect in the present invention.",
"According to a tenth aspect, an embodiment of the present invention provides a nonvolatile computer readable storage medium, where the computer storage medium stores a computer instruction, and is configured to implement, when a computer executes the computer instruction, the first aspect or any one of the first to fourth possible implementation manners of the first aspect in the present invention.",
"According to an eleventh aspect, an embodiment of the present invention provides a nonvolatile computer readable storage medium, where the computer storage medium stores a computer instruction, and is configured to implement the second aspect, or the first or the second possible implementation manner of the second aspect in the present invention when a computer executes the computer instruction.",
"According to a twelfth aspect, an embodiment of the present invention provides a nonvolatile computer readable storage medium, where the computer storage medium stores a computer instruction, and is configured to implement the third aspect, or the first or the second possible implementation manner of the third aspect in the present invention when a computer executes the computer instruction.",
"According to embodiments of the present invention, in a storage system, a switch receives an operation request, where the operation request carries request identification; the switch queries, according to the request identification, a flow table of the switch to obtain a flow table entry matching the operation request; and the switch forwards the operation request to a target storage device among storage devices according to a forwarding rule of the matching flow table entry.",
"By using a characteristic of a Software Defined Network (SDN), the operation request is processed according to the forwarding rule of the flow table entry of the switch, thereby implementing load balancing of the storage devices and reducing information interaction between the storage devices.",
"BRIEF DESCRIPTION OF THE DRAWINGS To describe the technical solutions in the embodiments of the present invention more clearly, the following briefly introduces the accompanying drawings required for describing the embodiments.",
"Apparently, the accompanying drawings in the following description show merely some embodiments of the present invention, and a person of ordinary skill in the art may still derive other drawings from these accompanying drawings without creative efforts.",
"FIG.",
"1 is a schematic diagram of a method according to an embodiment of the present invention; FIG.",
"2 is a schematic diagram of an object storage system according to an embodiment of the present invention; FIG.",
"3 is a diagram of a system of a SDN based on the Openflow (Openflow) protocol; FIG.",
"4 is a flow table of a switch in a SDN; FIG.",
"5 is a schematic structural diagram of a flow table entry in a flow table; FIG.",
"6 is a schematic structural diagram of a packet header field of a flow table entry; FIG.",
"7 is a schematic diagram of a method for processing an object operation request in an object storage system according to an embodiment of the present invention; FIG.",
"8 is a schematic diagram of a method for generating a flow table entry forwarding rule by a controller according to an embodiment of the present invention; FIG.",
"9 is a schematic diagram of a method for generating a flow table entry forwarding rule by a controller according to an embodiment of the present invention; FIG.",
"10 is a schematic diagram of a switch; and FIG.",
"11 is a schematic diagram of a controller.",
"DETAILED DESCRIPTION The following clearly describes the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention.",
"Apparently, the described embodiments are a part rather than all of the embodiments of the present invention.",
"All other embodiments obtained by a person of ordinary skill in the art based on the embodiments of the present invention without creative efforts shall fall within the protection scope of the present invention.",
"Embodiments of the present invention are applied to a storage system, the storage system includes a controller, a switch, and storage devices communicating with the switch, the controller communicates with the switch, and the controller is configured to formulate and deliver a flow table of the switch.",
"The storage system may be a file level storage system, a data block level storage system, or an object storage system.",
"The storage system may also include at least two of a file level storage system, a data block level storage system, and an object storage system.",
"As shown in FIG.",
"1, a method for processing an operation request in a storage system provided in an embodiment of the present invention is as follows: 101: A switch receives an operation request, where the operation request carries request identification, and the request identification includes at least one of user group information and storage strategy information.",
"102: A switch queries, according to the request identification, a flow table of the switch to obtain a flow table entry matching the operation request.",
"103: The switch forwards the operation request to a target storage device among the storage devices according to a forwarding rule of the matching flow table entry.",
"In an implementation manner, when the request identification is the user group information, a virtual local area network identification bit of the operation request carries the user group information, and a virtual local area network identification bit in a packet header field of the matching flow table entry carries the user group information; or when the request identification is the storage strategy information, an Internet Protocol Type of Service bit of the operation request carries the storage strategy information, and an Internet Protocol Type of Service bit in a packet header field of the matching flow table entry carries the storage strategy information; or when the request identification is the user group information and the storage strategy information, a virtual local area network identification bit of the operation request carries the user group information, an Internet Protocol Type of Service bit of the operation request carries the storage strategy information, a virtual local area network identification bit in a packet header field of the matching flow table entry carries the user group information, and an Internet Protocol Type of Service bit in a packet header field of the matching flow table entry carries the storage strategy information.",
"In an implementation manner, when the operation request is a read request, the forwarding rule of the matching flow table entry is formulated by the controller according to flow load of storage devices that store requested data.",
"The method further includes: updating, by the switch, the number of times that the read request is forwarded to the target storage device, where the number of times is recorded in the matching flow table entry.",
"In an implementation manner, when the operation request is a write request, the forwarding rule of the matching flow table entry is formulated by the controller according to remaining storage capacity of the storage devices.",
"The method further includes: updating, by the switch, the number of times that the write request is forwarded to the target storage device, where the number of times is recorded in the matching flow table entry.",
"According to the embodiment of the present invention, the request identification includes at least one of the user group information and the storage strategy information, where the user group information may be IP address information of a client, address information of a client, or the like; and the storage strategy information may be the number of copies of requested data in the storage devices, or the number of copies of requested data to be written into the storage devices.",
"According to the method for processing an operation request in a storage system provided in the embodiment of the present invention, by using a characteristic of a SDN, the operation request is processed according to a forwarding rule of a flow table of a switch, thereby implementing load balancing of storage devices and reducing information interaction between the storage devices.",
"Using an object storage system as an example, in the object storage system, an object is used as a basic unit for data storage.",
"One object includes file data and file metadata; an operation request is an object operation request, including an object read request and an object write request; data requested by a read request, namely, requested by an object read request, is an object, and data written by an object write request is an object; and a storage device in the object storage system is an object storage device.",
"In the embodiment of the present invention, as shown in FIG.",
"2, an object storage system includes a metadata server 103, a controller 104, switches 1051 to 105m, and storage devices 1061, 1062, and 1063 to 106L, that is, object storage devices 1061, 1062, and 1063 to 106L in the object storage system, where L is an integer, indicating the number of object storage devices, and a specific value is not limited.",
"The metadata server 103 is configured to store request identification of data stored in the object storage devices 1061, 1062, and 1063 to 106L, that is, configured to store request identification of an object stored in the object storage devices 1061, 1062, and 1063 to 106L.",
"For the request identification, details are to be described below.",
"The object storage devices 1061, 1062, and 1063 to 106L are configured to store data, that is, configured to store an object in the object storage system.",
"The switches 1051 to 105m and the controller 104 form a SDN.",
"The switches 1051 to 105m communicate with the object storage devices 1061, 1062, and 1063 to 106L.",
"The switches 1051 to 105m are configured to forward an operation request, that is an object operation request in the object storage system, to the object storage devices 1061, 1062, and 1063 to 106L according to a forwarding rule of a flow table entry in a flow table.",
"The controller 104 is configured to formulate and update a flow table entry in a flow table of the switches 1051 to 105m.",
"Only the controller 104 is described in the embodiment of the present invention.",
"In the object storage system of the embodiment of the present invention, the number of controllers is not limited to one, and there may be multiple controllers, so as to implement load balancing and redundancy.",
"For clients 1011 to 101n shown in FIG.",
"2, in an implementation manner, an object operation request is sent by using an object storage system proxy 102 to access the object storage devices 1061, 1062, and 1063 to 106L, where n is an integer, indicating the number of clients, and a specific value is not limited.",
"In the embodiment of the present invention, the object storage system proxy 102 may be an independent physical server, or may be integrated in the clients 1011 to 101n, which is not limited in the present invention.",
"In the SDN formed by the controller 104 and the switches 1051 to 105m, the controller 104 communicates with the switches 1051 to 105m by using a secure channel.",
"For example, the controller 104 may communicate with the switches 1051 to 105m by using the Openflow protocol, and the controller 104 formulates and updates a flow table entry of a flow table stored in the switches 1051 to 105m.",
"In the embodiment of the present invention, that the Openflow protocol is used between the controller 104 and the switch 1051 is only an exemplary description.",
"The present invention is also applicable to a manner that another protocol is used for implementation in the SDN.",
"Using the switch 1051 and the controller 104 as an example, as shown in FIG.",
"3, the controller 104 formulates and updates a flow table entry of a flow table in the switch 1051; and when the switch 1051 receives an object operation request, parses the object operation request, queries a flow table entry matching the object operation request in the flow table of the switch 1051, and processes the object operation request according to a forwarding rule of the matching flow table entry.",
"Specifically, in an implementation manner, the flow table in the switch 1051 is formed by a flow table entry 1 and flow table entries 2 to R, where R is a natural number.",
"As shown in FIG.",
"4, the switch 1051 receives an object operation request, and queries a flow table entry of the flow table, where the flow table entry of the flow table is generally queried in a stream line manner; and if a flow table entry matching the object operation request is obtained by querying, performs processing according to a forwarding rule of the matching flow table entry.",
"For a flow table entry of a flow table shown in FIG.",
"4, a specific structure is shown in FIG.",
"5, and includes three parts: a packet header field, a counter, and a forwarding rule.",
"The packet header field is used to match an object operation request; the counter is used to count the number of times that the object operation request matching the flow table entry is processed; and the forwarding rule is used to determine a forwarding manner of the object operation request, for example, deciding how to forward the object operation request, deciding to which port the operation request is forwarded, and the like.",
"As shown in FIG.",
"6, the packet header field includes an input port, a source media access control (Media Access Control, MAC) address, a destination MAC address, an Ethernet type, virtual local area network identification (Virtual Local Area Network Identification, VLAN ID), a source Internet Protocol (IP) address, a destination IP address, an IP port, an IP Type of Service (ToS) bit, a source Transmission Control Protocol (TCP) port, and a destination TCP port.",
"In the embodiment of the present invention, an object operation request may encapsulate request identification, and the request identification includes at least one of user group information and storage strategy information.",
"For example, the user group information is encapsulated in the object operation request.",
"Specifically, the user group information may be encapsulated in a VLAN ID bit of the object operation request, and the storage strategy information may be encapsulated in an IP ToS bit of the object operation request.",
"Encapsulation of the request identification may be implemented by the object storage system proxy 102.After receiving an object operation request, the switch 1051 queries a flow table entry matching the object operation request in the flow table of the switch 1051.The object operation request is processed according to a forwarding rule of the matching flow table entry obtained by querying.",
"After the object operation request is forwarded according to the forwarding rule, the counter updates the number of times for forwarding the object operation request according to the flow table entry.",
"When the flow table entry matching the object operation request does not exist, the object operation request is forwarded to the controller 104; and the controller 104 formulates a forwarding rule for the object operation request, generates a flow table entry, and updates the flow table in the switch 1051.Based on the foregoing description, as shown in FIG.",
"7, an embodiment of the present invention provides a method for processing an object operation request in an object storage system under a system architecture shown in FIG.",
"2, including: Step 701: A switch receives an object operation request, where the object operation request carries request identification, and the request identification includes at least one of user group information and storage strategy information.",
"702: The switch queries, according to the request identification, a flow table of the switch to obtain a flow table entry matching the object operation request.",
"703: The switch forwards the object operation request to a target object storage device among object storage devices according to a forwarding rule of the matching flow table entry.",
"In the foregoing method for processing an object operation request in an object storage system, when the request identification is the user group information, a virtual local area network identification bit of the object operation request carries the user group information, and a virtual local area network identification bit in a packet header field of the matching flow table entry carries the user group information; or when the request identification is the storage strategy information, an Internet Protocol Type of Service bit of the object operation request carries the storage strategy information, and an Internet Protocol Type of Service bit in a packet header field of the matching flow table entry carries the storage strategy information; or when the request identification is the user group information and the storage strategy information, a virtual local area network identification bit of the object operation request carries the user group information, an Internet Protocol Type of Service bit of the object operation request carries the storage strategy information, a virtual local area network identification bit in a packet header field of the matching flow table entry carries the user group information, and an Internet Protocol Type of Service bit in a packet header field of the matching flow table entry carries the storage strategy information.",
"In the object storage system provided in the embodiment of the present invention, an object operation request carrying request identification is forwarded to a corresponding object storage device by using a switch in a SDN, a controller formulates a forwarding rule in a flow table entry of the switch, and the switch forwards an object operation request according to the forwarding rule in the flow table entry, thereby implementing load balancing of the object storage devices and reducing information interaction between the object storage devices.",
"With reference to FIG.",
"2, specifically, in the method for processing an object operation request shown in FIG.",
"7, when the object operation request is an object read request, the forwarding rule of the matching flow table entry is formulated by the controller according to flow load of object storage devices that store a requested object.",
"After the switch forwards the object operation request to a target object storage device among the object storage devices according to a forwarding rule of the matching flow table entry, the method further includes: updating, by the switch, the number of times that the object read request is forwarded to the target object storage device, where the number of times is recorded in the matching flow table entry.",
"The following describes details.",
"Using an example that the client 101 sends a read request to the object storage system, the client 101 sends a read request, and the object storage system proxy 102 receives the read request sent by the client 101, accesses the metadata server 103 according to the read request, and obtains request identification of a requested object, where the request identification includes at least one of user group information and storage strategy information, the request identification is used to store, in the metadata server 103, after the object is written into the object storage devices, at least one of the user group information and the storage strategy information carried in an object write request; and the request identification stored in the metadata server 103 is determined by content of the request identification of the object that is registered with the metadata server 103 by the object storage devices that store the object written.",
"When the client initiates a read request for the object to the object storage system, the metadata server 103 is queried to obtain the request identification of the object, where the user group information may be IP address information of the client that writes the object into the object storage system, or other information that may identify the client that writes the object into the object storage system; and the storage strategy information may be the number of copies of the requested object in the object storage devices.",
"For the object read request, because the requested object has already been stored in the object storage devices, when the requested object is written into the object storage devices, the request identification of the object is sent to the metadata server 103.In the embodiment of the present invention, request identification including user group information and a storage strategy is used as an example, where the user group information is IP address information of a client that writes the object into the object storage system, and the storage strategy information is the number of copies of the requested object, which is 3.The object storage system proxy 102 encapsulates the request identification obtained from the metadata server 103 to generate the object read request, and a specific format of the object read request is shown in FIG.",
"6.In the embodiment of the present invention, the user group information is encapsulated in a VLAN ID bit of the object read operation request, and the storage strategy information is encapsulated in an IP ToS bit of the object read operation request.",
"The object storage system proxy 102 sends the object read request to the switch 1051.The switch 1051 receives the object read request sent by the storage system proxy 102, and parses VLAN ID bit and ToS bit information of the object read request to obtain the user group information and the storage strategy information, respectively.",
"A flow table entry of the flow table is queried according to the user group information and storage strategy information that are obtained by parsing.",
"The user group information that is parsed from the VLAN ID bit of the object read request and the storage strategy information that is parsed from the IP ToS bit of the object read request are used to match the packet header field of the flow table entry each to find a matching flow table entry, and then the object read request is forwarded according to the forwarding rule of the matching flow table entry.",
"Specifically, for the object read request, the forwarding rule of the flow table entry is formulated by the controller 104 according to flow load of the object storage devices that store the requested object, that is, a target object storage device is selected according to flow load of the object storage device where the requested object is located.",
"For example, in the flow table shown in FIG.",
"4, the flow table entry 3 is a flow table entry matching the object read request, and a structure of the flow table entry 3 is shown in FIG.",
"5, information in the VLAN ID of the packet header field matches information in the VLAN ID of the object read request, and information in the IP ToS bit of the packet header field matches information in the IP ToS bit of the object read request.",
"The forwarding rule of the flow table entry 3 is formulated by the controller 104 according to flow load of the object storage devices that store the requested object, for example, the object storage devices 1061, 1062, and 1063 are object storage devices storing three copies of the requested object.",
"The controller 104 determines, according to flow load of the object storage devices 1061, 1062, and 1063, that the object storage device 1061 is an object storage device with lightest flow load, and the forwarding rule is to forward the object read request to the object storage device 1061.The controller 104 formulates the forwarding rule according to flow load of the object storage devices 1061, 1062, and 1063; specifically, the switch 1051 periodically reports, to the controller 104, the number of times of forwarding the object operation request, where the number of times is recorded in each flow table entry in the flow table, or the controller 104 periodically obtains, from the switch 1051, the number of times of forwarding the object operation request, where the number of times is recorded in each flow table entry of the flow table, or the object storage devices 1061, 1062, and 1063 report flow load to the controller 104, so as to update the forwarding rule of the flow table entry, where the object operation request herein includes an object read request and an object write request.",
"In a manner, the controller 104 formulates or updates the forwarding rule of the flow table entry according to the number of times that the object operation request is forwarded to object storage devices 1061, 1062, and 1063, where the number of times is recorded in the counter of the flow table entry.",
"For example, there are 50 flow table entries with a forwarding rule that is to forward an object operation request to the object storage device 1061, and in the foregoing period, for the 50 flow tables, the total number of times of forwarding the object operation request is 5000, where the number of times is recorded by the counter of each flow table entry; there are 45 flow table entries with a forwarding rule that is to forward an object operation request to the object storage device 1062, and in the foregoing period, for the 45 flow tables, the total number of times of forwarding the object operation request is 5500, where the number of times is recorded by the counter of each flow table entry times of forwarding the object operation request; and there are 50 flow table entries with a forwarding rule that is to forward an object operation request to the object storage device 1063, and in the foregoing period, for the 50 flow tables, the total number of times of forwarding the object operation request is 6000, where the number of times is recorded by the counter of each flow table entry times of forwarding the object operation request.",
"In the foregoing period, the object storage device 1061 has lightest flow load.",
"Therefore, in the embodiment of the present invention, for an object requested by the object read request, the forwarding rule that the controller 104 formulates for the object read request according to flow load of the object storage devices 1061, 1062, and 1063 storing the object is to forward the object read request to the object storage device 1061.When no matching flow table entry is obtained by the switch 1051 by querying, the switch 1051, by using the Openflow protocol, forwards the object read request to the controller 104 through a secure channel shown in FIG.",
"2; the controller 104 determines the requested object according to the request identification carried in the object read request, formulates a flow table entry for the object read request according to flow load of the object storage devices that stores the requested object, and delivers the flow table entry to the switch 1051, so as to update the flow table in the switch 1051; and the switch 1051 forwards the object read request according to the flow table entry delivered by the controller 104.In the embodiment of the present invention, assuming that the object storage device 1061 is an object storage device with lightest flow load, the switch forwards, according to a matching forwarding rule in the flow table entry 3, the object operation request to a port over which the object storage device 1061 and the switch 1051 communicate.",
"The counter in the flow table entry 3 update the number of times of forwarding the object read request to the object storage device 1061.The switch 1051 changes a destination IP address of the object read request to an IP address of the object storage device 1062, changes a destination MAC address of the object read request to a MAC address of the object storage device 1062, and forwards a modified object read request to the object storage device 1062.After receiving the modified object read request, the object storage device 1062 returns content of the requested object to the object storage system proxy 102.The object storage system proxy 102 returns the content of the requested object to the client 101.According to the embodiment of the present invention, another implementation manner for an object read request is that for an object having more than two copies, for example, the requested object in the embodiment of the present invention, which has three copies in the object storage devices, the forwarding rule of the flow table entry matching the object read request may be to forward the object read request to two object storage devices.",
"As described in the foregoing embodiment, for example, there are 50 flow table entries with a forwarding rule that is to forward the object operation request to the object storage device 1061, and in the foregoing period, for the 50 flow tables, the total number of times of forwarding the object operation request is 5000, where the objet operation request is recorded by the counter of each flow table entry; there are 45 flow table entries with a forwarding rule that is to forward an object operation request to the object storage device 1062, and in the foregoing period, for the 45 flow tables, the total number of times of forwarding the object operation request that is recorded by the counter of each flow table entry is 5500; and there are 50 flow table entries with a forwarding rule that is to forward an object operation request to the object storage device 1063, and in the foregoing period, for the 50 flow tables, the total number of times of forwarding the object operation request that is recorded by the counter of each flow table entry is 6000.In the foregoing period, the object storage devices 1061 and 1062 are target object storage devices with relatively light flow load; if the object read request is to be forwarded to the two target devices, the flow table entry forwarding rule that the controller 104 formulates for the object read request is to forward the object read request to the object storage devices 1061 and 1062, thereby implementing object read concurrency and improving efficiency of the object read request.",
"In the embodiment of the present invention, the request identification carried in the object read request may also include only one of user group information or storage strategy information, which is not limited in the present invention.",
"In the object storage system provided in the embodiment of the present invention, according to the processing method for forwarding an object read request carrying request identification to a corresponding object storage device by using a switch in SDN, a controller delivers a flow table entry corresponding to a forwarding rule of the object read request according to flow load of a target object storage device, and the switch forwards the object read request according to the forwarding rule in the flow table entry, thereby implementing load balancing of the object storage devices and reducing information interaction between the object storage devices.",
"With reference to FIG.",
"2, specifically, in the method for processing an object operation request shown in FIG.",
"7, when the object operation request is an object write request, the forwarding rule of the matching flow table entry is formulated by the controller according to remaining storage capacity of the object storage devices.",
"After the switch forwards the object operation request to a target object storage device among the object storage devices according to a forwarding rule of the matching flow table entry, the method further includes: updating, by the switch, the number of times that the write request is forwarded to the target object storage device, where the number of times is recorded in the matching flow table entry.",
"The following describes details.",
"Using an example that the client 101 sends a write request to the object storage system, the client 101 sends a write request, and the object storage system proxy 102 receives the write request sent by the client 101.Because an object is to be written into the object storage system, the metadata server 103 does not have request identification of the object to be written, and the object storage system proxy 102 obtains, from the write request, the request identification of the object to be written.",
"The request identification includes at least one of user group information and a storage strategy information, where the user group information may be IP address information of the client that writes the object into the object storage system, or other information that may identify the client that writes the object into the object storage system; and the storage strategy information may be the number of copies of the written object in the object storage devices.",
"In the embodiment of the present invention, request identification including user group information and a storage strategy information is used as an example, where the user group information is IP address information of a client, and the storage strategy information is specifically the number of copies of an object requested by a user in the object storage devices 1061, 1062, and 1063 to 106L, where the number of copies of the object is 3.The object storage system proxy 102 encapsulates the request identification to generate an object write request.",
"A specific format of the object write request is shown in FIG.",
"6.The object storage system proxy 102 encapsulates the obtained request identification in a specific identification bit of the object write request.",
"In the embodiment of the present invention, the user group information is encapsulated in a VLAN ID bit of the object write request, and the storage strategy information is encapsulated in an IP ToS bit of the object write request.",
"The object storage system proxy 102 sends the object write request to the switch 1051.The switch 1051 receives the object write request sent by the object storage system proxy 102, and parses VLAN ID bit and ToS bit information of the object write request to obtain the user group information and the storage strategy information, respectively.",
"A flow table entry of the flow table is queried according to the user group information and storage strategy information that are obtained by parsing.",
"The user group information that is parsed from the VLAN ID bit of the object write request and the storage strategy information that is parsed from the IP ToS bit of the object write request are used to match the packet header field of the flow table entry, respectively to find a matching flow table entry, and then the object write request is forwarded according to the forwarding rule of the matching flow table entry.",
"Specifically, for the object write request, the forwarding rule of the flow table entry is formulated by the controller 104 according to remaining storage capacity of the object storage devices 1061, 1062, and 1063 to 106L, that is, a target object storage device is selected for the object write request according to the remaining storage capacity of the object storage devices.",
"For example, in the flow table shown in FIG.",
"4, the flow table entry 3 is a flow table entry matching the object write request, and a structure of the flow table entry 3 is shown in FIG.",
"5, information in the VLAN ID of the packet header field matches information in the VLAN ID of the object write request, and information in the IP ToS bit of the packet header field matches information in the IP ToS bit of the object write request.",
"An operation rule of the flow table entry 3 is determined by the controller 104 according to the remaining storage capacity of the object storage devices 1061, 1062, and 1063 to 106L, that is, a target object storage device is determined according to a size of the remaining storage capacity of the object storage devices 1061, 1062, and 1063 to 106L.",
"An implementation manner is that the switch 1051 periodically reports, to the controller 104, the number of times of forwarding the object write request, where the number of times is recorded in each flow table entry in the flow table, or the controller 104 periodically obtains, from the switch 1051, the number of times of forwarding the object write request, where the number of times is recorded in each flow table entry in the flow table, or the object storage devices 1061, 1062, and 1063 to 106L report the remaining storage capacity to the controller 104.Remaining storage capacity of each object storage devices is calculated according to the number of times that the object write request is forwarded to each object storage device and a size of the object to be written, where the number of times is counted by each flow table entry in the flow table of the switch 1051.Specifically, an implementation scheme is that, using the object storage device 1061 as an example, the controller 104 calculates, according to the number of times of forwarding the object write request to the object storage device 1061 and the size of the written object of the object write request each time, a total size of objects written into the object storage device 1061 for storage, where the number of times is recorded in each flow table entry; and obtains, by subtracting occupied object storage capacity from total storage capacity of the object storage device 1061, remaining storage capacity of the object storage device 1061.Similarly, remaining storage capacity of the object storage devices 1062 to 106L in a period can be obtained.",
"In the embodiment of the present invention, when the object write request is a first object write request, and the flow table of the switch 1051 does not have a matching flow table entry, the switch 1051 forwards the object write request to the controller 104 through a secure channel shown in FIG.",
"3 by using the Openflow protocol.",
"The controller 104 formulates, according to the remaining storage capacity of the current object storage devices 1061, 1062, and 1063 to 106L, a forwarding rule for the object write request, generates the flow table entry 3 in the embodiment of the present invention, and delivers the flow table entry 3 to the switch 1051.The switch 1051 updates the flow table according to the flow table entry 3 and forwards, according to the forwarding rule of the flow table entry 3, the object write request.",
"For example, according to the storage strategy information that the switch 1051 obtains by parsing the object write request, the number of copies of a written object is 3, and the controller 104 selects, from the object storage devices 1061, 1062, and 1063 to 106L, three object storage devices with maximum remaining storage capacity as target object storage devices.",
"For example, the object storage devices 1063, 1067, and 1068 are three object storage devices with maximum remaining storage capacity, of which the remaining storage capacity is all 1000 Gb, and remaining storage capacity of other object storage devices is less than 1000 Gb; or the object storage devices 1063, 1067, and 1068 are three object storage devices with maximum remaining storage capacity, of which the remaining storage capacity is 1000 Gb, 950 Gb, and 900 Gb successively, and remaining storage capacity of other object storage devices is less than 900 Gb.",
"Therefore, the operation rule that the controller 104 formulates for the object write request is to forward the object write request to the object storage devices 1064, 1067, and 1068.The object write request is forwarded to a destination port of the switch 1051 according to the forwarding rule of the flow table entry 3, where the destination port of the switch 1051 is a port over which the switch 1051 communicates with the object storage devices 1064, 1067, and 1068 separately.",
"The controller 104 records, according to the request identification carried in the object write request, information of the object storage devices that store the object; may obtain, by using the recorded information of the object storage devices that store the object, flow load of the object storage devices that store the object; formulates, according to the flow load of the object storage devices that store the object, a forwarding rule for the object read request reading the object; generates a flow table entry matching the object read request reading the object, where the flow table entry carries request identification of the object; and matching the request identification carried in the object read request with the request identification carried in the flow table entry, so as to determine the matching flow table entry.",
"For a specific procedure, reference may be made to the description of the object read request part in the embodiment, and details are not repeatedly described herein.",
"The switch 1051 changes a destination IP address of the object write request to an IP address of the object storage device 1062, and changes a destination MAC address of the object write request to a MAC address of the object storage device 1062.In the embodiment of the present invention, the object write request is separately forwarded to the object storage devices 1064, 1067, and 1068 according to the forwarding rule of the matching flow table entry.",
"Correspondingly, the destination IP address of the object write request is changed to an IP address of the object storage device 1064, and the destination MAC address of the object write request is changed to a MAC address of the object storage device 1064, and a modified object write request is forwarded to the object storage device 1064.Similarly, the object write request to be forwarded to the object storage devices 1067 and 1068 is modified, and a modified object write request is separately forwarded to the object storage devices 1067 and 1068.The counter in the flow table entry 3 separately updates the number of times of forwarding the object write request to the object storage devices 1064, 1067, and 1068.The object storage devices 1064, 1067, and 1068 store a written object, and register request identification of the written object to the metadata server 103, where the metadata server 103 may not store specific storage location information of the object, but only needs to include the request identification of the object.",
"In the embodiment of the present invention, the request identification carried in the object write request may also include only one of user group information and storage strategy information, which is not limited in the present invention.",
"Preferably, the request identification at least includes the user group information.",
"In the object storage system provided in the embodiment of the present invention, according to the processing method for forwarding an object write request carrying request identification to a corresponding object storage device by using a switch in a SDN, a controller delivers, according to remaining storage capacity of the object storage devices, a forwarding rule of the object write request to generate a flow table entry of the switch, and the switch forwards the object write request according to the forwarding rule of the matching flow table entry, thereby implementing load balancing of storage capacity of the object storage devices and reducing information interaction between the object storage devices.",
"In addition, for an object written in the object storage system, the metadata server may only record request identification of the object, thereby reducing work load of the metadata server.",
"In the object storage system provided in the embodiment of the present invention, when an object storage device is added, for example, when an object storage device 1061(L+1) is added, the object storage device 1061(L+1) is registered with the controller 104; and information registered with the controller 104 includes a MAC address of the object storage device 1061(L+1), a number of a port for communicating with the switch 1051, and storage capacity.",
"After receiving registration information of the object storage device 1061(L+1), the controller 104 records the registration information of the object storage device 1061(L+1), formulates a forwarding rule, generates a new flow table entry, and delivers the flow table entry to the switch 1051.In the object storage system provided in the embodiment of the present invention, when an object storage device in the object storage system exits due to a fault or another reason, for example, when an object storage device 1061L exits, the controller 104 receives a state change message of the object storage device 1061L, where the message carries a MAC address of the object storage device 1061L, a number of a port for communicating with the switch 1051, and storage capacity information; and the controller 104 deletes, according to the state change message, a flow table entry with a forwarding rule that is to forward to the object storage device 1061L.",
"For a flow table entry with a forwarding rule that is to forward the object read request to the object storage device 1061L, the controller 104 generates a flow table entry with a forwarding rule that is to forward to a redundant object storage device of the object storage device 1061L, where the redundant object storage device is an object storage device that stores an object of the object storage device 1061L.",
"Therefore, using of the SDN in the object storage system implements an increase or decrease of object storage devices of the object storage system, and improves flexibility of the object storage system.",
"According to the description of the embodiment of the method for processing an operation request in a storage system, the controller 104 provides a method for generating a flow table entry forwarding rule, as shown in FIG.",
"8, including: Step 801: The controller obtains remaining storage capacity information of the storage device communicating with the switch.",
"Step 802: The controller generates, according to the remaining storage capacity information of the storage device, a forwarding rule matching a write request, where the write request is used to write data into the storage device communicating with the switch.",
"In an implementation manner, that the controller obtains remaining storage capacity information of the storage device communicating with the switch specifically includes: receiving, by the controller, the remaining storage capacity information reported by the storage device.",
"In an implementation manner, that the controller obtains remaining storage capacity information of the storage device communicating with the switch specifically includes: obtaining, by the controller, the number of times of forwarding the write request to the storage device and a size of written data, where the number of times and the size are recorded in a flow table entry in the flow table of the switch; and calculating, by the controller, remaining storage capacity of the storage device according to storage capacity of the storage device, the number of times of the write request, and the size of the written data.",
"Specifically, in the object storage system, according to the method in which the controller 104 in the embodiment of the present invention provides a method for generating a flow table entry forwarding rule, a storage device is specifically an object storage device, the write request is specifically an object write request, and data written into the object storage device according to the object write request is an object.",
"In the storage system provided in the embodiment of the present invention, a controller based on a SDN generates, according to remaining storage capacity information of a storage device, a forwarding rule of a flow table entry matching a write request, so that a switch processes the write request according to the forwarding rule generated by the controller, thereby implementing load balancing of the storage device and reducing information interaction between storage devices.",
"The storage system applicable to the embodiment of the present invention may be a file level storage system, a data block level storage system, or an object storage system, or may also be a storage system including at least two of a file level storage system, a data block level storage system, and an object storage system.",
"Specifically, for applicability to the object storage system, reference may be made to the foregoing embodiment of processing an object operation request in an object operation system, and details are not repeatedly described herein.",
"According to the description of the embodiment of the method for processing an operation request in a storage system, the controller 104 provides a method for generating a flow table entry forwarding rule, as shown in FIG.",
"9, including: 901: The controller obtains flow load information of storage devices that store requested data.",
"902: The controller generates, according to the flow load information of the storage devices that stores the requested data, a forwarding rule matching a read request.",
"In an implementation manner, that the controller obtains flow load information of storage devices that store requested data specifically includes: receiving, by the controller, the flow load information reported by the storage devices that store the requested data.",
"In an implementation manner, that the controller obtains flow load information of storage devices that store requested data specifically includes: obtaining, by the controller, the number of times of forwarding an operation request to the storage devices that store the requested data, where the number of times is recorded in a flow table entry in the flow table of the switch, and the operation request includes a write request and a read request.",
"Specifically, in the object storage system, according to the method in which the controller 104 provides a method for generating a flow table entry forwarding rule in the embodiment of the present invention, a storage device is specifically an object storage device, the read request is specifically an object read request, and data requested by the object read request and stored in an object storage device is an object.",
"In the storage system provided in the embodiment of the present invention, a controller based on a SDN generates, according to flow load of storage devices that store requested data, a forwarding rule of a flow table entry matching a read request, so that a switch processes the read request according to the forwarding rule generated by the controller, thereby implementing load balancing of the storage devices and reducing information interaction between the storage devices.",
"The storage system applicable to the embodiment of the present invention may be a file level storage system, a data block level storage system, or an object storage system, or may also be a hybrid storage system including at least two of a file level storage system, a data block level storage system, and an object storage system.",
"Specifically, for applicability to the object storage system, reference may be made to the foregoing embodiment of processing an object operation request in an object operation system, and details are not repeatedly described herein.",
"According to the foregoing embodiments of the present invention, a SDN is used in the storage system; in the SDN, a specific implementation of the controller may be a universal server running controller software, so as to implement control over a switch on a data forwarding plane.",
"A structure of the universal server includes a central processing unit, a memory, and the like; the central processing unit and the memory are connected by using a bus; and the controller and a switch implement communication described in the foregoing embodiments.",
"The switch located in the data forwarding plane may be a universal switch or an Openflow switch, including a central processing unit, a memory, and the like; the central processing unit and the memory are connected by using a bus; and the central processing unit and the controller implement communication described in the foregoing embodiments, and implement forwarding of an object operation request at the same time.",
"In the embodiment of the present invention, the controller and the switch are only described exemplarily, and other switches and controllers that are capable of implementing the SDN may also be used to implement the present invention.",
"According to the description of the foregoing method embodiments of the present invention, an embodiment of the present invention provides a switch, as shown in FIG.",
"10, including a receiving unit 1001, a querying unit 1002, and a forwarding unit 1003.The receiving unit 1001 is configured to receive an operation request, where the operation request carries request identification, and the request identification includes at least one of user group information and storage strategy information; the querying unit 1002 is configured to query, according to the request identification, a flow table of the switch to obtain a flow table entry matching the operation request; and the forwarding unit 1003 is configured to forward the operation request to a target storage device among storage devices according to the forwarding rule of the matching flow table entry.",
"According to the switch shown in FIG.",
"10, when the operation request is a read request, the forwarding rule of the matching flow table entry is formulated by the controller according to flow load of storage devices that store requested data, and when the operation request is a write request, the forwarding rule of the matching flow table entry is formulated by the controller according to remaining storage capacity of the storage devices.",
"Specifically, in the object storage system, the receiving unit 1001 is configured to receive an object operation request, where the object operation request carries request identification, and the request identification includes at least one of user group information and storage strategy information; the querying unit 1002 is configured to query, according to the request identification, a flow table of a switch to obtain a flow table entry matching the object operation request; and the forwarding unit 1003 is configured to forward the object operation request to a target object storage device among object storage devices according to a forwarding rule of the matching flow table entry, where when the object operation request is an object read request, the forwarding rule of the matching flow table entry is formulated by the controller according to flow load of object storage devices that store a requested object; and when the object operation request is an object write request, the forwarding rule of the matching flow table entry is formulated by the controller according to remaining storage capacity of the object storage devices.",
"In the storage system provided in the embodiment of the present invention, according to the processing method for forwarding an operation request carrying request identification to a corresponding storage device by using a switch in a SDN, a controller formulates a forwarding rule in a flow table entry of a switch, and the switch forwards the operation request according to the forwarding rule in the flow table entry, thereby implementing load balancing of storage devices and reducing information interaction between the storage devices.",
"According to the description of the foregoing method embodiments of the present invention, an embodiment of the present invention provides a controller, as shown in FIG.",
"11, including an obtaining unit 1101 and a generating unit 1102, where the obtaining unit 1101 is configured to obtain remaining storage capacity information of a storage device communicating with a switch; and the generating unit 1102 is configured to generate, according to the remaining storage capacity information of the storage device, a forwarding rule matching a write request, where the write request is used to write data into the storage device communicating with the switch.",
"In an implementation manner, the obtaining unit 1101 is specifically configured to receive the remaining storage capacity information reported by the storage device.",
"In an implementation manner, the obtaining unit 1101 is specifically configured to obtain the number of times of forwarding the write request to the storage device and a size of written data, where the number of times and the size are recorded in a flow table entry of a flow table of the switch, and calculate remaining storage capacity of the storage device according to storage capacity of the storage device, the number of times of the write request, and the size of the written data.",
"Specifically, in an object storage system, the obtaining unit 1101 is configured to obtain remaining storage capacity information of an object storage device communicating with a switch; and the generating unit 1102 is configured to generate, according to the remaining storage capacity information of the object storage device, a forwarding rule matching an object write request, where the object write request is used to write an object in the object storage device communicating with the switch.",
"In an implementation manner, the obtaining unit 1101 is specifically configured to receive the remaining storage capacity information reported by the object storage device.",
"In an implementation manner, the obtaining unit 1101 is specifically configured to obtain the number of times of forwarding an object write request to the object storage device and a size of written data, where the number of times and the size are recorded in a flow table entry of a flow table of the switch, and calculate remaining storage capacity of the object storage device according to storage capacity of the object storage device, the number of times of forwarding the object write request and the size of the written object.",
"According to the controller provided in the embodiment of the present invention, by using a SDN, the controller formulates, according to remaining storage capacity of each storage device in a storage system, a flow table entry of a switch and a forwarding rule matching a write request, thereby implementing load balancing of each storage device and reducing information interaction between the storage devices.",
"According to the description of the foregoing method embodiments of the present invention, an embodiment of the present invention provides a controller.",
"As shown in FIG.",
"11, the controller includes an obtaining unit 1101 and a generating unit 1102.In the embodiment of the present invention, the obtaining unit 1101 is configured to obtain flow load information of storage devices that store requested data; and the generating unit 1102 is configured to generate, according to the flow load information of the storage devices that store the requested data, a forwarding rule matching a read request.",
"In an implementation manner, the obtaining unit 1101 is specifically configured to receive the flow load information reported by the storage devices that store the requested data.",
"In an implementation manner, the obtaining unit 1101 is specifically configured to obtain the number of times of forwarding an operation request to the storage devices that store the requested data, where the number of times is recorded in a flow table entry of a flow table of the switch, and the operation request includes a write request and a read request.",
"Specifically, in an object storage system, the obtaining unit 1101 is configured to obtain flow load information of object storage devices that store a requested object; and the generating unit 1102 is configured to generate, according to the flow load information of the object storage devices that store the requested object, a forwarding rule matching an object read request.",
"In an implementation manner, the obtaining unit 1101 is specifically configured to receive the flow load information reported by the object storage devices that store the requested object.",
"In an implementation manner, the obtaining unit 1101 is specifically configured to obtain the number of times of forwarding an object operation request to the object storage devices that store the requested object, where the number of times is recorded in a flow table entry of a flow table of the switch, and the object operation request includes an object write request and an object read request.",
"According to the controller provided in the embodiment of the present invention, by using a SDN, the controller formulates, according to flow load of storage devices that store requested data in a storage system, a flow table entry of a switch and a forwarding rule matching a read request, thereby implementing load balancing of each storage device and reducing information interaction between the storage devices.",
"For a specific functional description of the switch and the controller described in the foregoing apparatus embodiments of the present invention, reference may further be made to the method embodiments; in addition, for an application scenario, reference may be made to the architectural diagram shown in FIG.",
"2 and the description, and details are not repeatedly described herein.",
"A person of ordinary skill in the art may be aware that, in combination with the examples described in the embodiments disclosed in this specification, units and algorithm steps may be implemented by electronic hardware or a combination of computer software and electronic hardware.",
"Whether the functions are performed by hardware or software depends on particular applications and design constraint conditions of the technical solutions.",
"A person skilled in the art may use different methods to implement the described functions for each particular application, but it should not be considered that the implementation goes beyond the scope of the present invention.",
"It may be clearly understood by a person skilled in the art that, for the purpose of convenient and brief description, for a detailed working process of the foregoing system, apparatus, and unit, reference may be made to a corresponding process in the foregoing method embodiments, and details are not described herein again.",
"In the several embodiments provided in the present application, it should be understood that the disclosed apparatus and method may be implemented in other manners.",
"For example, the described apparatus embodiment is merely exemplary.",
"For example, the unit division is merely logical function division and may be other division in actual implementation.",
"For example, a plurality of units or components may be combined or integrated into another system, or some features may be ignored or not performed.",
"Furthermore, the displayed or discussed mutual couplings or direct couplings or communication connections may be implemented through some interfaces.",
"The indirect couplings or communication connections between the apparatuses or units may be implemented in electronic, mechanical, or other forms.",
"The units described as separate parts may or may not be physically separate, and parts displayed as units may or may not be physical units, may be located in one position, or may be distributed on a plurality of network units.",
"A part or all of the units may be selected according to an actual need to implement the objectives of the solutions of the embodiments.",
"In addition, functional units in the embodiments of the present invention may be integrated into one processing unit, or each of the units may exist alone physically, or two or more units are integrated into one unit.",
"When the functions are implemented in a form of a software functional unit and sold or used as an independent product, the functions may be stored in a computer-readable storage medium.",
"Based on such an understanding, the technical solutions of the present invention essentially, or the part contributing to the prior art, or a part of the technical solutions may be implemented in a form of a software product.",
"The software product is stored in a storage medium, and includes several instructions for instructing a computer device (which may be a personal computer, a server, or a network device) to perform all or a part of the steps of the methods described in the embodiments of the present invention.",
"The foregoing nonvolatile storage medium includes any medium that can store program code, such as a USB flash drive, a removable hard disk, a read-only memory (Read-Only Memory, ROM), a magnetic disk, or an optical disc.",
"The foregoing descriptions are merely specific implementation manners of the present invention, but are not intended to limit the protection scope of the present invention.",
"Any variation or replacement readily figured out by a person skilled in the art within the technical scope disclosed in the present invention shall fall within the protection scope of the present invention.",
"Therefore, the protection scope of the present invention shall be subject to the protection scope of the claims."
]
] |
Patent_15871317
|
[
[
"Availability Counting Apparatus and Method",
"Embodiments of the present invention disclose an availability counting apparatus and method.",
"The apparatus includes: a configuration module, configured to: receive an unavailability rule configured by a user, and subscribe to a detection item from a detection apparatus at each layer of network functions virtualization and notify the detection apparatus of a condition for triggering a fault alarm, according to the unavailability rule; a calculation module, configured to: receive fault alarm information and fault recovery information that are reported by the detection apparatus, and calculate availability of each layer of the network functions virtualization; and a report module, configured to output an availability counting report according to a preset period."
],
[
"1.An apparatus, comprising: an input device; an output device; a non-transitory memory; and a processor, wherein the input device, the output device, the memory, and the processor are connected to a bus, the memory stores a set of program code, and the processor is configured to invoke the program code stored in the memory to: receive an unavailability rule configured by a user, subscribe to a detection item from a detection apparatus at each layer of network functions virtualization, and notify the detection apparatus of a condition for triggering a fault alarm, wherein the unavailability rule is received and the detection apparatus is notified according to the unavailability rule; receive fault alarm information and fault recovery information that are reported by the detection apparatus, and calculate availability of each layer of the network functions virtualization; and output an availability counting report according to a preset period.",
"2.The apparatus according to claim 1, wherein the unavailability rule comprises an availability indicator defined by the user, a detection item corresponding to the availability indicator, and an algorithm for counting the availability indicator, and the processor is configured to calculate a result of the availability indicator according to the algorithm for counting the availability indicator.",
"3.The apparatus according to claim 1, wherein the processor is further configured to compare detection results of detection items, and determine a location at which a fault occurs.",
"4.The apparatus according to claim 1, wherein the processor is further configured to: receive detection results of all the detection items and that are reported by the detection apparatus, and calculate availability of each device at each layer of the network functions virtualization.",
"5.The apparatus according to claim 1, wherein the processor is further configured to identify a device with substandard availability.",
"6.The apparatus according to claim 1, wherein the availability counting apparatus is integrated in an orchestrator of the network functions virtualization.",
"7.The apparatus according to claim 1, wherein the availability counting apparatus is integrated at an operation support layer of the network functions virtualization.",
"8.The apparatus according to claim 1, wherein the availability counting apparatus is disposed independently.",
"9.A method, comprising: receiving an unavailability rule configured by a user, subscribing to a detection item from a detection apparatus at each layer of network functions virtualization, and notifying the detection apparatus of a condition for triggering a fault alarm, wherein the unavailability rule is received and the detection apparatus is notified according to the unavailability rule; receiving fault alarm information and fault recovery information that are reported by the detection apparatus, and calculating availability of each layer of the network functions virtualization; and outputting an availability counting report according to a preset period.",
"10.The method according to claim 9, wherein the unavailability rule comprises an availability indicator defined by the user, a detection item corresponding to the availability indicator, and an algorithm for counting the availability indicator; and wherein calculating the availability of each layer of the network functions virtualization comprises calculating a result of the availability indicator according to the algorithm for counting the availability indicator.",
"ii.",
"The method according to claim 9, wherein before calculating the availability of each layer of the network functions virtualization, the method further comprises: comparing detection results of detection items, and determining a location at which a fault occurs.",
"12.The method according to claim 9, further comprising: receiving detection results of all the detection items that are reported by the detection apparatus, and calculating availability of each device at each layer of the network functions virtualization.",
"13.The method according to claim 9, wherein during outputting the availability counting report according to the preset period, the method further comprises: identifying a device with substandard availability."
],
[
"<SOH> BACKGROUND <EOH>Network functions virtualization (NFV for short) is software processing for bearing many functions by using commodity hardware such as x86 and a virtualization technology, so as to reduce high device costs of a network.",
"By means of software/hardware decoupling and function abstraction, a network device function no longer depends on special-purpose hardware, a resource can be fully and flexibly shared, a new service can be rapidly developed and deployed, and automatic deployment, auto scaling, fault isolation, self-healing, and the like are performed based on an actual service requirement.",
"An NFV system is structured vertically and horizontally.",
"According to an NFV design, there are three layers vertically: an infrastructure layer, a virtual network layer, and an operation support layer.",
"There are two domains horizontally: a service network domain and a management and orchestration domain.",
"Because a telecommunications operator has a relatively high requirement on device reliability, generally, availability needs to reach five nines (that is, running interruption of a device is less than 5 minutes each year).",
"In availability calculation, usually, an interruption time is manually and periodically counted, to determine whether a predetermined availability requirement is met.",
"Specifically, availability may be calculated by using a system runtime and the interruption time.",
"That is, Availability=(Runtime−Unavailable time)/Runtime.",
"Because the runtime may be directly obtained by counting a time from a time point at which a device is powered on and starts running to a counting time point, a main issue is to count the unavailable time caused by a fault.",
"In the prior art, during counting of the unavailable time, a third-party tool may be used to maintain a continuous connection, and whether a network is available is determined according to whether a service is available.",
"The network is determined as unavailable when the third-party tool cannot connect to the network.",
"This is often applied to an Internet network.",
"Alternatively, when a fault occurs in the system, a maintenance engineer manually calculates an unavailable time of a service according to maintenance alarm information.",
"This is often applied to a communications network.",
"However, in the foregoing methods, only overall availability of a system (an Internet network or a communications device) is counted, and availability of different layers of a system, such as a network functions virtualization system, that includes a multilayer architecture cannot be determined."
],
[
"<SOH> SUMMARY <EOH>A technical problem to be resolved in embodiments of the present invention is to provide an availability counting apparatus and method, so that availability of layers of a network functions virtualization system can be counted separately.",
"To resolve the foregoing technical problem, in a first aspect, an embodiment of the present invention provides an availability counting apparatus.",
"The apparatus includes a configuration module, configured to: receive an unavailability rule configured by a user, and subscribe to a detection item from a detection apparatus at each layer of network functions virtualization and notify the detection apparatus of a condition for triggering a fault alarm, according to the unavailability rule.",
"The apparatus also includes a calculation module, configured to: receive fault alarm information and fault recovery information that are reported by the detection apparatus, and calculate availability of each layer of the network functions virtualization.",
"The apparatus also includes a report module, configured to output an availability counting report according to a preset period.",
"With reference to an implementation of the first aspect, in a first possible implementation of the first aspect, the unavailability rule includes an availability indicator defined by the user, a detection item corresponding to the availability indicator, and an algorithm for counting the availability indicator, and the calculation module is specifically configured to calculate a result of the availability indicator according to the algorithm for counting the availability indicator.",
"With reference to the first aspect, or the first possible implementation of the first aspect, in a second possible implementation of the first aspect, the calculation module is further configured to compare detection results of detection items, and determine a location at which a fault occurs.",
"With reference to any one of the first aspect, or the first to the second possible implementations of the first aspect, in a third possible implementation of the first aspect, the calculation module is further configured to: receive detection results of all the detection items that are reported by the detection apparatus, and calculate availability of each device at each layer of the network functions virtualization.",
"With reference to any one of the first aspect, or the first to the third possible implementations of the first aspect, in a fourth possible implementation of the first aspect, the report module is further configured to identify a device with substandard availability.",
"With reference to any one of the first aspect, or the first to the fourth possible implementations of the first aspect, in a fifth possible implementation of the first aspect, the calculation module and the detection apparatus are disposed in an integrated manner.",
"With reference to any one of the first aspect, or the first to the fifth possible implementations of the first aspect, in a sixth possible implementation of the first aspect, the availability counting apparatus is integrated in an orchestrator of the network functions virtualization, or integrated at an operation support layer of the network functions virtualization, or disposed independently.",
"According to a second aspect, an embodiment of the present invention provides an availability counting apparatus.",
"The apparatus also includes an input device, an output device, a memory, and a processor.",
"The input device, the output device, the memory, and the processor are connected to a bus.",
"The memory stores a set of program code.",
"The processor is configured to invoke the program code stored in the memory to perform the following operations: receiving an unavailability rule configured by a user, and subscribing to a detection item from a detection apparatus at each layer of network functions virtualization and notifying the detection apparatus of a condition for triggering a fault alarm, according to the unavailability rule; receiving fault alarm information and fault recovery information that are reported by the detection apparatus, and calculating availability of each layer of the network functions virtualization; and outputting an availability counting report according to a preset period.",
"With reference to an implementation of the second aspect, in a first possible implementation of the second aspect, the unavailability rule includes an availability indicator defined by the user, a detection item corresponding to the availability indicator, and an algorithm for counting the availability indicator, and the processor is specifically configured to calculate a result of the availability indicator according to the algorithm for counting the availability indicator.",
"With reference to the second aspect, or the first possible implementation of the second aspect, in a second possible implementation of the second aspect, the processor is further configured to compare detection results of detection items, and determine a location at which a fault occurs.",
"With reference to any one of the second aspect, or the first to the second possible implementations of the second aspect, in a third possible implementation of the second aspect, the processor is further configured to: receive detection results of all the detection items that are reported by the detection apparatus, and calculate availability of each device at each layer of the network functions virtualization.",
"With reference to any one of the second aspect, or the first to the third possible implementations of the second aspect, in a fourth possible implementation of the second aspect, the processor is further configured to identify a device with substandard availability.",
"With reference to any one of the second aspect, or the first to the fourth possible implementations of the second aspect, in a fifth possible implementation of the second aspect, the availability counting apparatus is integrated in an orchestrator of the network functions virtualization, or integrated at an operation support layer of the network functions virtualization, or disposed independently.",
"According to a third aspect, an embodiment of the present invention provides an availability counting method.",
"The method includes receiving an unavailability rule configured by a user, and subscribing to a detection item from a detection apparatus at each layer of network functions virtualization and notifying the detection apparatus of a condition for triggering a fault alarm, according to the unavailability rule.",
"The method also includes receiving fault alarm information and fault recovery information that are reported by the detection apparatus, and calculating availability of each layer of the network functions virtualization; and outputting an availability counting report according to a preset period.",
"With reference to implementation of the third aspect, in a first possible implementation of the third aspect, the unavailability rule includes an availability indicator defined by the user, a detection item corresponding to the availability indicator, and an algorithm for counting the availability indicator; and the calculating availability of each layer of the network functions virtualization includes: calculating a result of the availability indicator according to the algorithm for counting the availability indicator.",
"With reference to the third aspect, or the first possible implementation of the third aspect, in a second possible implementation of the third aspect, before the calculating availability of each layer of the network functions virtualization, the method further includes: comparing detection results of detection items, and determining a location at which a fault occurs.",
"With reference to any one of the third aspect, or the first to the second possible implementations of the third aspect, in a third possible implementation of the third aspect, the method further includes: receiving detection results of all the detection items that are reported by the detection apparatus, and calculating availability of each device at each layer of the network functions virtualization.",
"With reference to any one of the third aspect, or the first to the third possible implementations of the third aspect, in a fourth possible implementation of the third aspect, during the outputting an availability counting report according to a preset period, the method further includes: identifying a device with substandard availability.",
"The following beneficial effects are achieved by implementing the embodiments of the present invention.",
"A configuration module receives an unavailability rule configured by a user, and notifies a detection apparatus at each layer of network functions virtualization of an item that needs to be detected and a condition for triggering a fault alarm, so that detection apparatuses at different layers can report fault alarm information and fault recovery information according to detection results.",
"A calculation module may calculate availability of each layer by using the information, and finally, a report module periodically outputs an availability counting report.",
"Counting can be performed on layers separately, and therefore, availability levels of different vendors that provide devices can be obtained and provided to a telecommunications operator as a basis for selecting a supplier, and may be used as a basis for determining whether a contract is up to standard."
],
[
"CROSS-REFERENCE TO RELATED APPLICATIONS This application is a continuation of International Application No.",
"PCT/CN2015/085611, filed on Jul.",
"30, 2015, the disclosure of which is hereby incorporated by reference in its entirety.",
"TECHNICAL FIELD Embodiments of the present invention relate to the field of communications technologies, and in particular, to an availability counting apparatus and method.",
"BACKGROUND Network functions virtualization (NFV for short) is software processing for bearing many functions by using commodity hardware such as x86 and a virtualization technology, so as to reduce high device costs of a network.",
"By means of software/hardware decoupling and function abstraction, a network device function no longer depends on special-purpose hardware, a resource can be fully and flexibly shared, a new service can be rapidly developed and deployed, and automatic deployment, auto scaling, fault isolation, self-healing, and the like are performed based on an actual service requirement.",
"An NFV system is structured vertically and horizontally.",
"According to an NFV design, there are three layers vertically: an infrastructure layer, a virtual network layer, and an operation support layer.",
"There are two domains horizontally: a service network domain and a management and orchestration domain.",
"Because a telecommunications operator has a relatively high requirement on device reliability, generally, availability needs to reach five nines (that is, running interruption of a device is less than 5 minutes each year).",
"In availability calculation, usually, an interruption time is manually and periodically counted, to determine whether a predetermined availability requirement is met.",
"Specifically, availability may be calculated by using a system runtime and the interruption time.",
"That is, Availability=(Runtime−Unavailable time)/Runtime.",
"Because the runtime may be directly obtained by counting a time from a time point at which a device is powered on and starts running to a counting time point, a main issue is to count the unavailable time caused by a fault.",
"In the prior art, during counting of the unavailable time, a third-party tool may be used to maintain a continuous connection, and whether a network is available is determined according to whether a service is available.",
"The network is determined as unavailable when the third-party tool cannot connect to the network.",
"This is often applied to an Internet network.",
"Alternatively, when a fault occurs in the system, a maintenance engineer manually calculates an unavailable time of a service according to maintenance alarm information.",
"This is often applied to a communications network.",
"However, in the foregoing methods, only overall availability of a system (an Internet network or a communications device) is counted, and availability of different layers of a system, such as a network functions virtualization system, that includes a multilayer architecture cannot be determined.",
"SUMMARY A technical problem to be resolved in embodiments of the present invention is to provide an availability counting apparatus and method, so that availability of layers of a network functions virtualization system can be counted separately.",
"To resolve the foregoing technical problem, in a first aspect, an embodiment of the present invention provides an availability counting apparatus.",
"The apparatus includes a configuration module, configured to: receive an unavailability rule configured by a user, and subscribe to a detection item from a detection apparatus at each layer of network functions virtualization and notify the detection apparatus of a condition for triggering a fault alarm, according to the unavailability rule.",
"The apparatus also includes a calculation module, configured to: receive fault alarm information and fault recovery information that are reported by the detection apparatus, and calculate availability of each layer of the network functions virtualization.",
"The apparatus also includes a report module, configured to output an availability counting report according to a preset period.",
"With reference to an implementation of the first aspect, in a first possible implementation of the first aspect, the unavailability rule includes an availability indicator defined by the user, a detection item corresponding to the availability indicator, and an algorithm for counting the availability indicator, and the calculation module is specifically configured to calculate a result of the availability indicator according to the algorithm for counting the availability indicator.",
"With reference to the first aspect, or the first possible implementation of the first aspect, in a second possible implementation of the first aspect, the calculation module is further configured to compare detection results of detection items, and determine a location at which a fault occurs.",
"With reference to any one of the first aspect, or the first to the second possible implementations of the first aspect, in a third possible implementation of the first aspect, the calculation module is further configured to: receive detection results of all the detection items that are reported by the detection apparatus, and calculate availability of each device at each layer of the network functions virtualization.",
"With reference to any one of the first aspect, or the first to the third possible implementations of the first aspect, in a fourth possible implementation of the first aspect, the report module is further configured to identify a device with substandard availability.",
"With reference to any one of the first aspect, or the first to the fourth possible implementations of the first aspect, in a fifth possible implementation of the first aspect, the calculation module and the detection apparatus are disposed in an integrated manner.",
"With reference to any one of the first aspect, or the first to the fifth possible implementations of the first aspect, in a sixth possible implementation of the first aspect, the availability counting apparatus is integrated in an orchestrator of the network functions virtualization, or integrated at an operation support layer of the network functions virtualization, or disposed independently.",
"According to a second aspect, an embodiment of the present invention provides an availability counting apparatus.",
"The apparatus also includes an input device, an output device, a memory, and a processor.",
"The input device, the output device, the memory, and the processor are connected to a bus.",
"The memory stores a set of program code.",
"The processor is configured to invoke the program code stored in the memory to perform the following operations: receiving an unavailability rule configured by a user, and subscribing to a detection item from a detection apparatus at each layer of network functions virtualization and notifying the detection apparatus of a condition for triggering a fault alarm, according to the unavailability rule; receiving fault alarm information and fault recovery information that are reported by the detection apparatus, and calculating availability of each layer of the network functions virtualization; and outputting an availability counting report according to a preset period.",
"With reference to an implementation of the second aspect, in a first possible implementation of the second aspect, the unavailability rule includes an availability indicator defined by the user, a detection item corresponding to the availability indicator, and an algorithm for counting the availability indicator, and the processor is specifically configured to calculate a result of the availability indicator according to the algorithm for counting the availability indicator.",
"With reference to the second aspect, or the first possible implementation of the second aspect, in a second possible implementation of the second aspect, the processor is further configured to compare detection results of detection items, and determine a location at which a fault occurs.",
"With reference to any one of the second aspect, or the first to the second possible implementations of the second aspect, in a third possible implementation of the second aspect, the processor is further configured to: receive detection results of all the detection items that are reported by the detection apparatus, and calculate availability of each device at each layer of the network functions virtualization.",
"With reference to any one of the second aspect, or the first to the third possible implementations of the second aspect, in a fourth possible implementation of the second aspect, the processor is further configured to identify a device with substandard availability.",
"With reference to any one of the second aspect, or the first to the fourth possible implementations of the second aspect, in a fifth possible implementation of the second aspect, the availability counting apparatus is integrated in an orchestrator of the network functions virtualization, or integrated at an operation support layer of the network functions virtualization, or disposed independently.",
"According to a third aspect, an embodiment of the present invention provides an availability counting method.",
"The method includes receiving an unavailability rule configured by a user, and subscribing to a detection item from a detection apparatus at each layer of network functions virtualization and notifying the detection apparatus of a condition for triggering a fault alarm, according to the unavailability rule.",
"The method also includes receiving fault alarm information and fault recovery information that are reported by the detection apparatus, and calculating availability of each layer of the network functions virtualization; and outputting an availability counting report according to a preset period.",
"With reference to implementation of the third aspect, in a first possible implementation of the third aspect, the unavailability rule includes an availability indicator defined by the user, a detection item corresponding to the availability indicator, and an algorithm for counting the availability indicator; and the calculating availability of each layer of the network functions virtualization includes: calculating a result of the availability indicator according to the algorithm for counting the availability indicator.",
"With reference to the third aspect, or the first possible implementation of the third aspect, in a second possible implementation of the third aspect, before the calculating availability of each layer of the network functions virtualization, the method further includes: comparing detection results of detection items, and determining a location at which a fault occurs.",
"With reference to any one of the third aspect, or the first to the second possible implementations of the third aspect, in a third possible implementation of the third aspect, the method further includes: receiving detection results of all the detection items that are reported by the detection apparatus, and calculating availability of each device at each layer of the network functions virtualization.",
"With reference to any one of the third aspect, or the first to the third possible implementations of the third aspect, in a fourth possible implementation of the third aspect, during the outputting an availability counting report according to a preset period, the method further includes: identifying a device with substandard availability.",
"The following beneficial effects are achieved by implementing the embodiments of the present invention.",
"A configuration module receives an unavailability rule configured by a user, and notifies a detection apparatus at each layer of network functions virtualization of an item that needs to be detected and a condition for triggering a fault alarm, so that detection apparatuses at different layers can report fault alarm information and fault recovery information according to detection results.",
"A calculation module may calculate availability of each layer by using the information, and finally, a report module periodically outputs an availability counting report.",
"Counting can be performed on layers separately, and therefore, availability levels of different vendors that provide devices can be obtained and provided to a telecommunications operator as a basis for selecting a supplier, and may be used as a basis for determining whether a contract is up to standard.",
"BRIEF DESCRIPTION OF THE DRAWINGS To describe the technical solutions in the embodiments of the present invention or in the prior art more clearly, the following briefly describes the accompanying drawings required for describing the embodiments.",
"Apparently, the accompanying drawings in the following description show merely some embodiments of the present invention, and persons of ordinary skill in the art may still derive other drawings from these accompanying drawings without creative efforts.",
"FIG.",
"1A and FIG.",
"1B are a schematic diagram of a reference architecture of an NFV system; FIG.",
"2 is a schematic diagram of composition of a first embodiment of an availability counting apparatus according to the present invention; FIG.",
"3A and FIG.",
"3B are a schematic diagram of an architecture of a first embodiment of an NFV system to which an availability counting apparatus is applied according to the present invention; FIG.",
"4A and FIG.",
"4B are a schematic diagram of an architecture of a second embodiment of an NFV system to which an availability counting apparatus is applied according to the present invention; FIG.",
"5 is a schematic diagram of composition of a second embodiment of an availability counting apparatus according to the present invention; FIG.",
"6 is a schematic flowchart of a first embodiment of an availability counting method according to the present invention; and FIG.",
"7 is a schematic flowchart of a second embodiment of an availability counting method according to the present invention.",
"DETAILED DESCRIPTION OF ILLUSTRATIVE EMBODIMENTS The following describes the technical solutions in embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention.",
"Apparently, the described embodiments are merely some but not all of the embodiments of the present invention.",
"All other embodiments obtained by persons of ordinary skill in the art based on the embodiments of the present invention without creative efforts shall fall within the protection scope of the present invention.",
"Referring to FIG.",
"1A and FIG.",
"1B, FIG.",
"1A and FIG.",
"1B are a schematic diagram of a reference architecture of an NFV system.",
"Compared with an existing network architecture (independent service network+operation support system), the NFV is deconstructed vertically and horizontally.",
"According to an NFV design, the NFV is divided into three layers vertically.",
"Infrastructure layer (NFV Infrastructure, NFVI for short): The infrastructure layer is a resource pool from a perspective of cloud computing, and includes various hardware resources such as computer hardware, storage hardware, and network hardware, and a virtual computer, a virtual storage, and a virtual network that are virtualized by using a virtualization layer.",
"When the NFVI is mapped to a physical infrastructure, the NFVI is multiple data centers that are dispersed geographically and that are connected by using a high-speed communications network.",
"The NFVI needs to convert a physical computing/storage/exchange resource to a virtual computing/storage/exchange resource pool by means of virtualization.",
"Virtual network layer: The virtual network layer is corresponding to various existing telecommunications service networks.",
"Each physical network element is mapped as a virtual network element (Virtual Network Feature, VNF for short).",
"Resources required by the VNF need to be classified into virtual computing/storage/exchange resources, and are carried by the NFVI.",
"A signaling interface (3GPP+ITU−T) defined in a conventional network is still used as an interface between VNFs.",
"The VNF is managed by a corresponding element management system (EMS for short).",
"Operation support layer: The operation support layer is an existing operation support system (OSS for short)/business support system (BSS for short), and needs to make necessary modification and adjustment for virtualization.",
"The NFV is divided into two domains horizontally.",
"Service network domain: The service network domain is various existing telecommunications service networks.",
"Management and orchestration domain: A largest difference from a conventional network lies in that the management and orchestration (MANO for short) domain is added to the NFV.",
"MANO is responsible for management and orchestration of an entire NFVI resource, is responsible for mapping and association between a service network and an NFVI resource, and is responsible for implementation of an OSS service resource process and the like.",
"The MANO includes three entities internally: a virtualized resource manager (Virtualised Infrastructure Managers, VIM for short), a virtual network element manager (VNF Manager, VNFM for short), and an orchestrator that are respectively used to complete three layers of management on network services (NS for short) that are provided by an NFVI, a VNF, and the service network.",
"Different layers, different devices, or different managers may communicate by using a corresponding reference point.",
"Referring to FIG.",
"2, FIG.",
"2 is a schematic diagram of composition of a first embodiment of an availability counting apparatus according to the present invention.",
"In this embodiment, the apparatus includes: a configuration module 100, configured to: receive an unavailability rule configured by a user, and subscribe to a detection item from a detection apparatus at each layer of network functions virtualization and notify the detection apparatus of a condition for triggering a fault alarm, according to the unavailability rule; a calculation module 200, configured to: receive fault alarm information and fault recovery information that are reported by the detection apparatus, and calculate availability of each layer of the network functions virtualization; and a report module 300, configured to output an availability counting report according to a preset period.",
"The detection apparatus is an existing apparatus at each layer of the network functions virtualization, and may perform customized configuration or standardized configuration on the detection item of the detection apparatus.",
"The unavailability rule configured by the user may include but is not limited to an unavailability rule for a service, a virtual machine, or hardware.",
"The unavailability rule may be a rule used for determining an unavailable fault scope of a device or converting a fault impact scope.",
"Certainly, in addition to being configured by the user, the unavailability rule may be configured by default by a vendor at delivery, or several configuration templates are provided to the user for selection.",
"Optionally, the unavailability rule includes an availability indicator defined by the user, a detection item corresponding to the availability indicator, and an algorithm for counting the availability indicator.",
"The calculation module 200 is specifically configured to calculate a result of the availability indicator according to the algorithm for counting the availability indicator.",
"For example, for calculation of availability of an operation support layer, NS availability may be defined.",
"Related detection items of the NS availability may include but are not limited to process unavailability, a processor fault ratio, a virtual network element fault ratio, and a virtual machine fault ratio.",
"A counting algorithm corresponding to the NS availability may be a ratio of a sum of unavailable time of VNFs to a network run period.",
"If the VNF is unavailable because of multiple factors in the detection item, during calculation of the NS availability, a sum of unavailable time of the VNF that is caused by any one of all detection items needs to be counted, that is, regardless of a triggering factor, only total duration of such a result of VNF unavailability needs to be counted.",
"For example, if VNF unavailability of 5 minutes is caused because of the process unavailability, and VNF unavailability of 10 minutes is caused because of the processor fault ratio, total unavailable duration is 15 minutes.",
"If VNF unavailability of 10 minutes is caused because of the process unavailability and the processor fault ratio, total unavailable duration is 10 minutes.",
"Similarly, layer-I availability may be defined for an infrastructure layer.",
"A detection item may include but is not limited to a virtual resource error or an alarm light.",
"A calculation formula of the layer-I availability may be a sum of all critical resource fault time divided by a product of a total resource quantity and a resource online period.",
"In addition, hardware reliability may further be defined to calculate availability of a hardware resource, and the like.",
"Details are not described herein.",
"During availability calculation at each layer, availability of the entire layer may be determined by centralizing dispersed detection results of multiple detection items and availability of different devices.",
"The detection item may mainly include availability detection of the following main resources: a server, a virtual machine, a process, a virtual network element, or the like.",
"When the detection apparatus detects unavailability information, occurrence frequency and recovery time that are of a device fault may be recorded and reported to a manager corresponding to each layer.",
"The detection result may be reported by using an operation and maintenance interface.",
"Optionally, the calculation module 200 is further configured to: compare detection results of detection items, and determine a location at which a fault occurs.",
"Because faults in some devices may lead to unavailability of other devices, or faults at some layers may lead to faults at other layers, availability calculation accuracy may be improved by means of fault location analysis.",
"For example, when a fault occurs in a hard disk in storage hardware, a basic service layer may give an alarm, affecting availability calculation.",
"In this case, a fault may also be caused at a virtual network layer, affecting the availability calculation.",
"In this case, comparison and analysis need to be performed according to a specific detection result, to determine a cause and a location of the fault, and availability calculation is performed after unwanted data is dropped.",
"Optionally, in addition to separately calculating availability of layers, availability of devices of a specific type or availability of a specific device may further be calculated in detail.",
"The calculation module 200 is further configured to: receive detection results of all the detection items that are reported by the detection apparatus, and calculate availability of each device at each layer of the network functions virtualization, to facilitate rapid device replacement and maintenance.",
"Optionally, during generation of the report, the report module 300 may list only a layer or a device with unqualified availability, or may list all layers or devices, and the report module is further configured to identify a device with substandard availability.",
"To facilitate viewing all detection data and availability data by the user, the substandard device is removed or replaced, a device that is close to a substandardization edge may be replaced, or use of a device with low availability may be avoided as much as possible during resource allocation, so as to improve availability of an entire system and meet requirements of the user for spare part replacement evaluation, contract satisfaction evaluation, purchase decision, and the like.",
"It should be noted that the configuration module 100, the calculation module 200, and the report module 300 may exist independently, or may be disposed in an integrated manner.",
"In this embodiment, the configuration module 100, the calculation module 200, or the report module 300 may be disposed independently and independent of a processor of the availability counting apparatus in a form of hardware, and may be disposed in a form of a microprocessor, or may be built in a processor of the apparatus in a form of hardware, or may be built in a memory of the apparatus in a form of software, so that the processor of the apparatus invokes and performs an operation corresponding to the configuration module 100, the calculation module 200, or the report module 300.For example, in this embodiment (the embodiment shown in FIG.",
"2) of the availability counting apparatus according to the present invention, the calculation module 200 may be the processor of the availability counting apparatus, and functions of the configuration module 100 and the report module 300 may be built in the processor, or may be independent of the processor and disposed independently, or may be stored in the memory in a form of software.",
"The processor invokes and implements the functions of the configuration module 100 and the report module 300.This embodiment of the present invention sets no limitation.",
"The foregoing processor may be a central processing unit (CPU), a microprocessor, a single-chip microcomputer, or the like.",
"Certainly, in addition to integrated configuration of the three modules, the calculation module 200 and the detection apparatus may be disposed in an integrated manner.",
"Therefore, item detection and availability calculation are unified, and a detection apparatus and a calculation module are disposed each time, so that distributed configuration is implemented.",
"A configuration module receives an unavailability rule configured by a user, and notifies a detection apparatus at each layer of network functions virtualization of an item that needs to be detected and a condition for triggering a fault alarm, so that detection apparatuses at different layers can report fault alarm information and fault recovery information according to detection results.",
"A calculation module may calculate availability of each layer by using the information, and finally, a report module periodically outputs an availability counting report.",
"Counting can be performed on layers separately, and therefore, availability levels of different vendors that provide devices can be obtained and provided to a telecommunications operator as a basis for selecting a supplier, and may be used as a basis for determining whether a contract is up to standard.",
"In addition, when a fault or unavailability occurs in a system including different supplier devices, information and data that are provided by this apparatus may be used to help with responsibility definition.",
"Further, use of a device with relatively low availability that is learned after the counting may be avoided as much as possible during resource allocation, so that availability of an entire system is improved.",
"In addition, the availability counting apparatus described in this embodiment of the present invention may be integrated in an orchestrator of the network functions virtualization, or integrated at an operation support layer of the network functions virtualization, or disposed independently.",
"The present invention sets no limitation.",
"Configuration of the availability counting apparatus in this embodiment of the present invention is described as an example below with reference to FIG.",
"3A and FIG.",
"3B and FIG.",
"4A and FIG.",
"4B.",
"Referring to FIG.",
"3A and FIG.",
"3B, FIG.",
"3A and FIG.",
"3B are a schematic diagram of an architecture of a first embodiment of an NFV system to which an availability counting apparatus is applied according to the present invention.",
"In this embodiment, for architecture composition of the NFV, refer to related descriptions of FIG.",
"1A and FIG.",
"1B.",
"Details are not described herein again.",
"The availability counting apparatus is integrated in an orchestrator in a management and orchestration domain.",
"After detecting results, detection apparatuses at an infrastructure layer, a virtual network layer, and an operation support layer may respectively transmit the results to respective corresponding managers, and then the managers send the results to the availability counting apparatus in the orchestrator for calculation and report outputting.",
"Specifically, a detection apparatus at each layer may be configured by using an existing fault detection module, and a detection item may be customized by a user.",
"Specific data transmission channels may be as follows: VNF-VNFM-Orchestrator in which transmitted data may be VNF software fault alarm information or fault recovery information; NFVI-VIM-Orchestrator in which transmitted data may be virtual resource fault alarm information or fault recovery information; and NFVI-VIM-Orchestrator in which transmitted data may be hardware on-line information or hardware fault alarm information.",
"For a specific architecture of an operation support layer of the network functions virtualization at which the apparatus is integrated, refer to FIG.",
"4A and FIG.",
"4B.",
"FIG.",
"4A and FIG.",
"4B are a schematic diagram of an architecture of a second embodiment of an NFV system to which an availability counting apparatus is applied according to the present invention.",
"In this embodiment, the availability counting apparatus includes the following content.",
"The availability counting apparatus is integrated at an operation support layer of network functions virtualization.",
"After detecting a result, a detection apparatus at an infrastructure layer may transmit the result to a corresponding manager VIM, then the VIM sends the result to a VNFM, and then the VNFM sends the result to a network element manager system at a virtual network layer, and finally, the network element manager system sends the result to the availability counting apparatus at the operation support layer for calculation and report outputting.",
"A result detected by a detection apparatus at the virtual network layer may be transmitted to the network element manager system, and may finally be sent by the network element manager system to the availability counting apparatus at the operation support layer for calculation and report outputting.",
"A detection result of an operation management layer may be directly sent to the availability counting apparatus for calculation and report outputting.",
"Specifically, a detection apparatus at each layer may be configured by using an existing fault detection module, and a detection item may be customized by a user.",
"Specific data transmission channels may be as follows: VNF-EMS-OSS in which transmitted data may be VNF software fault alarm information or fault recovery information; NFVI-VIM-VNFM-EMS-OSS in which transmitted data may be virtual resource fault alarm information or fault recovery information; and NFVI-VIM-VNFM-EMS-OSS in which transmitted data may be hardware on-line information or hardware fault alarm information.",
"Certainly, in addition to the foregoing implementation solution of integrated disposing, an independent apparatus may be configured, and the apparatus communicates with and transmits data to each layer and two domains of the network functions virtualization by using an existing interface.",
"Referring to FIG.",
"5, FIG.",
"5 is a schematic diagram of composition of a second embodiment of an availability counting apparatus according to the present invention.",
"In this embodiment, the apparatus includes: an input device 400, an output device 500, a memory 600, and a processor 700.The input device 400, the output device 500, the memory 600, and the processor 700 are connected to a bus, the memory 600 stores a set of program code, and the processor 700 is configured to invoke the program code stored in the memory 600 to perform the following operations: receiving an unavailability rule configured by a user, and subscribing to a detection item from a detection apparatus at each layer of network functions virtualization and notifying the detection apparatus of a condition for triggering a fault alarm, according to the unavailability rule; receiving fault alarm information and fault recovery information that are reported by the detection apparatus, and calculating availability of each layer of the network functions virtualization; and outputting an availability counting report according to a preset period.",
"Optionally, the unavailability rule includes an availability indicator defined by the user, a detection item corresponding to the availability indicator, and an algorithm for counting the availability indicator.",
"The processor 700 is specifically configured to calculate a result of the availability indicator according to the algorithm for counting the availability indicator.",
"Optionally, the processor 700 is further configured to compare detection results of detection items, and determine a location at which a fault occurs.",
"Optionally, the processor 700 is further configured to: receive detection results of all the detection items that are reported by the detection apparatus, and calculate availability of each device at each layer of the network functions virtualization.",
"Optionally, the processor 700 is further configured to identify a device with substandard availability.",
"Optionally, the availability counting apparatus is integrated in an orchestrator of the network functions virtualization, or integrated at an operation support layer of the network functions virtualization, or disposed independently.",
"It should be noted that the processor 700 herein may be one processor or may be a collective term for multiple processing elements.",
"For example, the processor may be a central processing unit (CPU for short), or may be an application specific integrated circuit (ASIC for short), or may be one or more integrated circuits configured to implement this embodiment of the present invention, for example, one or more microprocessors (digital signal processor, DSP for short), or one or more field programmable gate arrays (FPGA for short).",
"The memory 600 may be a storage apparatus, or may be a collective term for multiple storage elements, and is configured to store executable program code, or a parameter and data that are required for running the availability counting apparatus.",
"In addition, the memory 600 may include a random access memory (RAM), and may further include a non-volatile memory, for example, a disk memory and a flash memory.",
"The bus may be an industry standard architecture (ISA for short) bus, a peripheral component interconnect (PCI for short) bus, an extended industry standard architecture (EISA for short) bus, or the like.",
"The bus may be classified into an address bus, a data bus, a control bus, and the like.",
"For ease of representation, only one thick line is used in FIG.",
"5 for representation, but it does not indicate that there is only one bus or one type of bus.",
"The input apparatus 400 and the output apparatus 500 are connected to the bus, so as to be connected to the processor 700 and other parts by using the bus.",
"The input apparatus 400 may provide an input interface for an operator, so that the operator selects a control item by using the input interface, and configures the unavailability rule, and the like.",
"In addition, the output apparatus 500 may further provide an output interface to display the availability counting report to the operator.",
"Referring to FIG.",
"6, FIG.",
"6 is a schematic flowchart of a first embodiment of an availability counting method according to the present invention, and in this embodiment, the method includes the following steps.",
"S601.Receive an unavailability rule configured by a user, and subscribe to a detection item from a detection apparatus at each layer of network functions virtualization and notify the detection apparatus of a condition for triggering a fault alarm, according to the unavailability rule.",
"Optionally, the unavailability rule includes an availability indicator defined by the user, a detection item corresponding to the availability indicator, and an algorithm for counting the availability indicator.",
"S602.Receive fault alarm information and fault recovery information that are reported by the detection apparatus, and calculate availability of each layer of the network functions virtualization.",
"The calculating availability of each layer of the network functions virtualization includes: calculating a result of the availability indicator according to the algorithm for counting the availability indicator.",
"S603.Output an availability counting report according to a preset period.",
"In this embodiment, availability of each layer of an NFV system may be obtained by separately calculating availability of the layers.",
"Referring to FIG.",
"7, FIG.",
"7 is a schematic flowchart of a second embodiment of an availability counting method according to the present invention, and in this embodiment, the method includes the following steps.",
"S701.Receive an unavailability rule configured by a user, and subscribe to a detection item from a detection apparatus at each layer of network functions virtualization and notify the detection apparatus of a condition for triggering a fault alarm, according to the unavailability rule.",
"S702.Receive fault alarm information and fault recovery information that are reported by the detection apparatus, and receive detection results of all detection items that are reported by the detection apparatus.",
"S703.Compare detection results of the detection items, and determine a location at which a fault occurs.",
"S704.Calculate availability of each device at each layer of the network functions virtualization.",
"S705.Output an availability counting report according to a preset period and identify a device with substandard availability.",
"In this embodiment, a more detailed availability calculation manner is used, so that availability of each device at each layer of an NFV system can be obtained, and the availability is marked when an availability report is output, to facilitate avoiding and rapid maintenance during resource allocation.",
"It should be noted that the embodiments in this specification are all described in a progressive manner, and each embodiment focuses on a difference from other embodiments.",
"For same or similar parts in the embodiments, mutual reference may be made to these embodiments.",
"Apparatus embodiments are basically similar to method embodiments, and therefore descriptions are relatively brief.",
"For related parts, refer to the descriptions in the method embodiments.",
"According to the description of the foregoing embodiments, the present invention has the following advantages.",
"A configuration module receives an unavailability rule configured by a user, and notifies a detection apparatus at each layer of network functions virtualization of an item that needs to be detected and a condition for triggering a fault alarm, so that detection apparatuses at different layers can report fault alarm information and fault recovery information according to detection results.",
"A calculation module may calculate availability of each layer by using the information, and finally, a report module periodically outputs an availability counting report.",
"Counting can be performed on layers separately, and therefore, availability levels of different vendors that provide devices can be obtained and provided to a telecommunications operator as a basis for selecting a supplier, and may be used as a basis for determining whether a contract is up to standard.",
"In addition, when a fault and unavailability occur in a system including different supplier devices, information and data that are provided by this apparatus may be used to help with responsibility definition.",
"Further, use of a device with relatively low availability that is learned after the counting may be avoided as much as possible during resource allocation, so that availability of an entire system is improved.",
"Persons of ordinary skill in the art may understand that all or some of the steps of the method embodiments may be implemented by a program instructing relevant hardware.",
"The program may be stored in a computer readable storage medium.",
"When the program runs, the steps of the method embodiments are performed.",
"The foregoing storage medium includes: any medium that can store program code, such as a ROM, a RAM, a magnetic disk, or an optical disc.",
"The availability counting apparatus and method provided in the embodiments of the present invention are described in detail above.",
"In this specification, specific examples are used to describe the principle and the implementations of the present invention, and the description of the embodiments is only intended to help understand the method and core idea of the present invention.",
"In addition, persons of ordinary skill in the art can make modifications to specific implementations and application scopes according to the idea of the present invention.",
"In conclusion, the content of this specification shall not be understood as a limitation on the present invention."
]
] |
Patent_15871324
|
[
[
"Agricultural Implement with a Scraper Internal to a Rolling Basket",
"An agricultural implement having a rolling basket is disclosed.",
"A stationary blade is disposed inside an inner chamber of the rolling basket and attached at ends of the rolling basket near the bearings that are connected to the rolling basket.",
"The rolling basket rotates around its major axis via the bearings, while the blade is held stationary.",
"The stationary blade has sleeves at the ends, and each of the sleeves is connected to a post of a support arm and locked into the posts via a pin."
],
[
"1.An agricultural implement for breaking and mixing a soil surface, comprising: a rolling basket comprising a plurality of elongated members arranged in a substantially cylindrical shape, wherein the rolling basket is adapted to rotate around a major axis of rotation of the rolling basket, wherein the plurality of elongated members define an inner chamber of the rolling basket; and an internal scraper disposed in the inner chamber of the rolling basket adapted for breaking up a material from the inner chamber as the rolling basket is rotated around the major axis of rotation of the rolling basket, wherein the internal scraper is stationary relative to the rolling basket as the rolling basket rotates; wherein the internal scraper includes an upper edge and a lower edge; wherein the internal scraper extends in an upward direction with respect to the major axis of rotation of the rolling basket; wherein the upper edge of the internal scraper is distally spaced away from the major axis of rotation of the rolling basket; wherein the upper edge of the internal scraper is positioned above the major axis of rotation of the rolling basket; wherein the lower edge of the internal scraper is distally spaced away from the major axis of rotation of the rolling basket; wherein the lower edge of the internal scraper is positioned above the major axis of rotation of the rolling basket; and wherein the upper edge of the internal scraper is positioned above the lower edge of the internal scraper.",
"2.The agricultural implement of claim 1, wherein the plurality of elongated members are each comprised of a blade.",
"3.The agricultural implement of claim 1, wherein the plurality of elongated members are each comprised of a rod.",
"4.The agricultural implement of claim 3, wherein the rod is comprised of a wire rod.",
"5.The agricultural implement of claim 1, wherein the plurality of elongated members are each comprised of a bar.",
"6.The agricultural implement of claim 1, wherein the plurality of elongated members extend from a first end to a second end of the rolling basket parallel to the major axis of rotation of the rolling basket.",
"7.The agricultural implement of claim 1, wherein the plurality of elongated members are evenly spaced around a circumference of the rolling basket at a fixed radius away from the major axis.",
"8.The agricultural implement of claim 1, wherein the plurality of elongated members are straight.",
"9.The agricultural implement of claim 1, wherein the plurality of elongated members are curved.",
"10.The agricultural implement of claim 1, wherein the plurality of elongated members are helical.",
"11.The agricultural implement of claim 1, wherein the internal scraper extends along an axis which is offset with respect to the major axis of rotation of the rolling basket.",
"12.The agricultural implement of claim 1, wherein the rolling basket comprises a first end and a second end, wherein the internal scraper is connected between the first end and the second end of the rolling basket.",
"13.The agricultural implement of claim 1, further comprising a first sleeve connecting the internal scraper to a first support arm and a second sleeve connecting the internal scraper to a second support arm such that the internal scraper does not rotate with the rolling basket.",
"14.The agricultural implement of claim 1, wherein a first end of the rolling basket comprises a first outer ring plate and wherein a second end of the rolling basket comprises a second outer ring plate, and including a first bearing connected between the first support arm and the first outer ring plate and a second bearing connected between the second support arm and the second outer ring plate.",
"15.The agricultural implement of claim 1, wherein the internal scraper comprises a first sleeve positioned at a first end of the internal scraper and a second sleeve positioned at a second end of the internal scraper for connecting the internal scraper to the rolling basket in a non-rotational manner.",
"16.The agricultural implement of claim 15, wherein the internal scraper extends upwardly from the first sleeve and the second sleeve.",
"17.The agricultural implement of claim 1, wherein the upper edge of the internal scraper is positioned near an inner edge of the plurality of elongated members.",
"18.An agricultural implement for breaking and mixing a soil surface, comprising: a rolling basket comprising a first end and a second end, wherein the rolling basket comprises a plurality of elongated members arranged in a substantially cylindrical shape, wherein the rolling basket is adapted to rotate around a major axis of rotation of the rolling basket, wherein the plurality of elongated members define an inner chamber of the rolling basket; and an internal scraper disposed in the inner chamber of the rolling basket adapted for breaking up a material from the inner chamber as the rolling basket is rotated around the major axis of rotation of the rolling basket, wherein the internal scraper includes an upper edge and a lower edge, wherein the internal scraper extends in an upward direction with respect to the major axis of rotation of the rolling basket, wherein the internal scraper is stationary relative to the rolling basket as the rolling basket rotates, wherein the internal scraper extends between the first end and the second end of the rolling basket, wherein the internal scraper extends along an axis which is offset with respect to the major axis of rotation of the rolling basket, wherein the upper edge of the scraper is distally spaced away from the major axis of rotation of the rolling basket, the upper edge of the internal scraper is positioned near an inner edge of the plurality of elongated members, wherein the upper edge of the internal scraper is positioned above the major axis of rotation of the rolling basket, wherein the lower edge of the internal scraper is distally spaced away from the major axis of rotation of the rolling basket, wherein the lower edge of the internal scraper is positioned above the major axis of rotation of the rolling basket, and wherein the upper edge of the internal scraper is positioned above the lower edge of the internal scraper.",
"19.The agricultural implement of claim 18, wherein the plurality of elongated members are each comprised of a blade.",
"20.The agricultural implement of claim 18, wherein the plurality of elongated members are each comprised of a rod."
],
[
"<SOH> BACKGROUND <EOH>An agricultural tillage implement for crumbling soil can include one or more rolling baskets.",
"A rolling basket is commonly disposed and connected at a rear of an agricultural tillage implement for crumbling soil, firming up the soil profile, breaking up clods of soil, and/or enhance the seed bed."
],
[
"<SOH> SUMMARY <EOH>An agricultural tillage implement having a rolling basket is disclosed.",
"One or more of the rolling baskets can be attached at an end of the agricultural tillage implement after rows of disk coulters.",
"The rolling basket functions to break up clumps of dirt.",
"A stationary blade is disposed inside an inner chamber of the rolling basket and attached at ends of the rolling basket near the bearings connected to the rolling basket.",
"The rolling basket rotates around its major axis via the bearings, while the blade is held stationary.",
"The stationary blade has sleeves at the ends, and each of the sleeves is connected to a post of a support arm and locked into the posts via a pin.",
"The stationary blade can be a part of an internal scraper disposed inside an inner chamber of the rolling basket."
],
[
"CROSS REFERENCE TO RELATED APPLICATIONS The present application is a continuation of U.S. application Ser.",
"No.",
"15/289,670 filed on Oct. 10, 2016 which issues as U.S. Pat.",
"No.",
"9,867,321 on Jan. 16, 2018 (Docket No.",
"SUMM-037), which is a continuation of U.S. application Ser.",
"No.",
"15/088,704 filed on Apr.",
"1, 2016 now issued as U.S. Pat.",
"No.",
"9,462,737 (Docket No.",
"SUMM-023), which is a divisional of U.S. application Ser.",
"No.",
"14/154,657 filed on Jan. 14, 2014 now issued as U.S. Pat.",
"No.",
"9,326,439 (Docket No.",
"SUMM-016), which claims priority to U.S.",
"Provisional Application No.",
"61/759,048 filed Jan. 31, 2013 (Docket No.",
"SUMM-032).",
"Each of the aforementioned patent applications, and any applications related thereto, is herein incorporated by reference in their entirety.",
"STATEMENT REGARDING FEDERALLY SPONSORED RESEARCH OR DEVELOPMENT Not applicable to this application.",
"FIELD This disclosure generally relates to a rolling basket for an agricultural tillage implement for crumbling soil for agricultural use.",
"BACKGROUND An agricultural tillage implement for crumbling soil can include one or more rolling baskets.",
"A rolling basket is commonly disposed and connected at a rear of an agricultural tillage implement for crumbling soil, firming up the soil profile, breaking up clods of soil, and/or enhance the seed bed.",
"SUMMARY An agricultural tillage implement having a rolling basket is disclosed.",
"One or more of the rolling baskets can be attached at an end of the agricultural tillage implement after rows of disk coulters.",
"The rolling basket functions to break up clumps of dirt.",
"A stationary blade is disposed inside an inner chamber of the rolling basket and attached at ends of the rolling basket near the bearings connected to the rolling basket.",
"The rolling basket rotates around its major axis via the bearings, while the blade is held stationary.",
"The stationary blade has sleeves at the ends, and each of the sleeves is connected to a post of a support arm and locked into the posts via a pin.",
"The stationary blade can be a part of an internal scraper disposed inside an inner chamber of the rolling basket.",
"BRIEF DESCRIPTION OF THE DRAWINGS Referring now to the drawings in which like reference numbers represent corresponding parts throughout.",
"FIG.",
"1 illustrates a side schematic view of an embodiment of an agricultural tillage implement.",
"FIG.",
"2 illustrates a partially exploded perspective view of an embodiment of an agricultural tillage implement assembly having two rolling baskets.",
"FIG.",
"3 illustrates a close-up view of one of the rolling baskets shown in FIG.",
"2.FIG.",
"4 is a perspective view showing the implement in assembled form.",
"DETAILED DESCRIPTION The term “rolling basket” generally refers to a “basket roller” as used by American Society of Agricultural Engineers (ASAE) Standard Terminology and Definitions for Agricultural Tillage Implements.",
"A rolling basket is assembled and connected to be a part of an agricultural tillage implement.",
"The agricultural tillage implement can have one or more rolling baskets assembled thereto.",
"It has been discovered that conventional rolling baskets are prone to plugging in muddy or moist conditions.",
"The present invention solves the plugging problem with an internal scraper in the rolling basket.",
"The internal scraper (e.g.",
"stationary blade) disrupts the flow of mud inside the inner chamber of the rolling basket.",
"That is, the internal scraper prevents the mud from pushing into the center of the inner chamber of the rolling basket which otherwise tends to fill up the rolling basket.",
"FIG.",
"1 shows an embodiment of an agricultural tillage implement 10, having a front 12 that is configured to connect to a puller (e.g.",
"a tractor) (see arrow).",
"The agricultural tillage implement 10 includes a tillage equipment assembly 14 and a support member 16, wherein the support member 16 is directed towards a rear 18 of the agricultural implement 10 and the support member 16 is connected to and supports a rolling basket assembly 100, which includes one or more rolling basket 102 connected to a support arm 120 connected to a support bar 160.The tillage equipment assembly 14 has a frame 20 and various tillage equipment attached to the frame 20.The tillage equipment assembly 14 can have one or more tillage equipment connected and assembled thereto.",
"The tillage equipment assembly 14 which can include a harrow.",
"The harrow can be, for example, a disk harrow, single disk harrow, a tandem disk harrow, an offset disk harrow, and/or a one-way disk harrow.",
"FIG.",
"1 shows the tillage equipment assembly 14 including a plurality of teeth 26 for mixing and leveling the soil surface.",
"The teeth 26 can be round-wire teeth, spike teeth, and/or spring teeth.",
"Further, although not shown, the agricultural tillage implement 10 can include one or more plows, such as a chisel plow, a moldboard plow, a disk plow, a combination chisel plow, a subsoiler, a field cultivator, a row bedder, and/or a row crop cultivator.",
"Further, although not shown, the tillage equipment assembly 14 can include a vertical tillage disc.",
"The frame 20 includes wheels 28 to support the agricultural tillage implement 10 on the ground.",
"The wheels 28 can be used to control a digging depth of the agricultural equipment (e.g.",
"harrow 22 and/or teeth 26).",
"FIG.",
"2 shows an embodiment of a rolling basket assembly 100 for an agricultural tillage implement (10 shown in FIG.",
"1) including two rolling baskets 102, 104.Each of the rolling baskets 102, 104 has a generally cylindrical shape formed by a plurality of blades 106, 108.In other embodiments, one or more of the blades 106, 108 can be replaced with wire rods or bars.",
"The plurality of blades 106, 108 of the rolling basket 102, 104 extend from near one end along a major axis 110, 112 of the rolling basket 102, 104 to an opposing end of the major axis 110, 112, respectively.",
"The rolling basket assembly 100 has the two rolling baskets 102, 104 aligned so that the each of the major axis 110, 112 are aligned and/or parallel to each other.",
"The rolling basket 102 has the plurality blades 106 disposed generally evenly spaced around a circumference defined by a fixed radius away from the major axis 110 thereby forming a “basket” structure.",
"The basket structure defines an inner chamber 114 of the rolling basket 102.The basket structure has a plurality of openings 115 connecting the inner chamber 114 to the outside of the basket structure.",
"The plurality of blades 106 can be straight or curved (e.g.",
"helical) as they extend axially from one end 116 of the rolling basket 102 to an opposing end 118.When in use, the rolling basket 102 is positioned on the ground so that its major axis 110 is substantially parallel with a surface of the ground, and the plurality of blades 106 rotate around the major axis 110 to work the soil.",
"The rolling basket 102 is connected to two support arms 120, 122 via bearings 124, 126.The bearings 124, 126 are connected to the rolling basket 102 at ends 116, 118 of the rolling basket.",
"The bearings 124, 126 are configured to allow the rolling basket 102 to rotate around its major axis 110 (as shown by, for example, arrow 128).",
"The arrow 128 is not intended to limit a direction of the rotation of the rolling basket 102.Accordingly, the rolling basket 102 can rotate in either direction of the arrow 128.The support arm 120 has a post 130 configured to connect to the bearing 124.The bearing 124 is configured to rotate around the post 130.The support arm 122 also has a post 132 configured to connect to the bearing 126, wherein the bearing 126 is configured to rotate around that post 132.Thus, the rolling basket 102, which is connected to the bearings 124, 126 rotates around the posts 130, 132.In the embodiment shown, an axial shaft for rotating the rolling basket 102 is not included in the rolling basket 102.An internal scraper 134 includes a stationary blade 136 connected to two sleeves 138, 140 at each end of the stationary blade 136.The first sleeve 138 receives the post 130.A pin 142 can be inserted into matching openings 144, 146 to lock the first sleeve 138 stationary with respect to the post 130.The opening 144 is in the first sleeve 138 and the opening 146 is in the post 130.The bearing 124 is disposed between the support arm 120 and the first sleeve 138 on the post 130.A washer 148 can be provided between the bearing 124 and the first sleeve 138 to aid in rotation of the bearing 124 with respect to the first sleeve 138.Similar to the configuration of the first sleeve 138, the second sleeve 140 receives the post 132.A pin is inserted into matching openings of the second sleeve 140 and the post 132 to hold the second sleeve 140 stationary with respect to the post 132.The bearing 126 is disposed between the support arm 122 and the second sleeve 140 on the post 132.A washer can be provided between the bearing 126 and the second sleeve 140 to aid in rotation of the bearing 126 with respect to the second sleeve 140.The first sleeve 138 and the second sleeve 140 are configured to make the internal scraper 134 stationary when the rolling basket 102 is rotating (i.e.",
"during operation of the rolling basket 102).",
"Accordingly, in addition to the pins 142 and/or as an alternative, each of the first sleeve 138 and the second sleeve 140 can have a locking structure that make the sleeves 138, 140 stationary with respect to the to the respective posts 130, 132.The rolling basket 104 is assembled similarly to the rolling basket 102.Fully assembled, the internal scraper 150 is disposed inside the inner chamber 152 of the rolling basket 104.The rolling basket 104 has openings 153 connecting the inner chamber 152 to the outside of the rolling basket 104.The stationary blade 154 of the internal scraper 150 extends radially away from the major axis 112 of the rolling basket 104.The rolling basket 104 has the stationary blade 154 extending vertically in the “up” direction, away from the surface of the ground.",
"The internal scraper 150 is connected to the support arms 156, 158 and is held stationary with respect to the rotating blades 108.The rolling basket 104 is connected to bearings at each ends, similarly to the rolling basket 102 described above.",
"In other embodiments, the stationary blade may extend in other directions with respect to the surface of the ground.",
"The stationary blade is never extended “down” towards the surface of the ground.",
"The support arms 120, 122, 156, 158 are connected to a support bar, i.e.",
"a horizontal bar via, for example, a plurality of pins 162 (e.g.",
"U-bolt) and nuts 164.The pins 162 are inserted through openings in an upper base portion of the support arms 120, 122, 156, 158 and the nuts 164 engage the pins 162 from the bottom of the upper base portion.",
"Other means of connecting the support arms 120, 122, 156, 158 are possible.",
"The internal scrapers 134, 150 are fixedly positioned so that they do not rotate around the major axis 110, 112 when the rolling baskets 102, 104 rotate around their major axis 110, 112.Accordingly, when large pieces of material are introduced into the inner chambers 114, 152 the large pieces will move towards the internal scrapers 134, 150 by the rotating motion of the rolling baskets 102, 104.As the rolling baskets 102, 104 rotate, material inside the inner chamber of the rolling baskets 102, 104 may move up (e.g.",
"away from the ground) with the rotating motion.",
"As the material reaches the top of the rolling baskets 102, 104, the internal scrapers 134, 150 make contact with the material and prevent the material from moving along with the rotation of the rolling baskets 102, 104.Thus, the internal scrapers 134, 150 provide resistive force for the materials.",
"The resistive force provided by the internal scrapers 134, 150 prevents the materials from rotating with the rolling baskets 102, 104.Accordingly, the materials disconnect from the rolling baskets 102, 104 and then with the aid of gravity, fall down towards the direction of the ground.",
"The materials can contact the rotating blades 106, 108 as they fall down and this contact can help in breaking down the materials to smaller sizes.",
"Then, the materials are discharged (i.e.",
"removed) via one of the openings 115 of the rolling baskets 102, 104.FIG.",
"3 illustrates a close-up view of a portion of the FIG.",
"2, near an end 116 of the rolling basket 102.The rolling basket 102 includes the plurality of blades 106 defining the inner chamber 114 of the basket structure defined by the plurality of blades 106.The plurality of blades 106 are connected to an outer ring plate 200 and an inner ring plate 202.The outer ring plate 200 is located at the end 116 of the rolling basket 102 and includes a central opening 206 with a notch 208 extending in a radial direction away from a center of the outer ring plate 200.The central opening 206 receives the sleeve 140 of the internal scraper 134 and the notch 208 receives the stationary blade 136 of the internal scraper 134 during assembly, so that the internal scraper 134 can be disposed inside the inner chamber 114 of the rolling basket 102.The inner ring plate 202 has an inner opening 210 that has a larger diameter than the central opening 206.Preferably, the inner opening 210 has a radius that is substantially the same as a radial distance of the notch 208.Thus, the inner opening 210 allows the rolling basket 102 to rotate around the stationary blade 136 without the inner ring plate 202 directly contacting the stationary blade 136.Advantageously, a rolling basket having an internal scraper can prevent materials from getting stuck in the basket structure of the rolling basket.",
"This can improve performance of the rolling basket (and agricultural implements that include the rolling basket).",
"Further, the rolling basket having an internal scraper can prevent and/or reduce damage to the equipment by aiding in breaking apart large materials that can get otherwise stuck in the inner chamber of the rolling basket.",
"With regard to the foregoing description, it is to be understood that changes may be made in detail without departing from the scope of the present invention.",
"It is intended that the specification and depicted embodiment to be considered exemplary only, with a true scope and spirit of the invention being indicated by the broad meaning of the claims."
]
] |
Patent_15871327
|
[
[
"SYSTEMS AND METHODS FOR VIEWING DATA GENERATED BY ROTATIONAL SCANNING IN NON-DESTRUCTIVE TESTING",
"A testing system for testing a work piece.",
"The testing system may be non-destructive.",
"An associated method.",
"The method may include obtaining C-scan images and corresponding S-scan images.",
"The C-scan images and the corresponding S-scan images are of the same portion of the work piece being tested."
],
[
"1.A testing system for testing a work piece, the testing system comprising: an ultrasonic probe outputting at least one beam from a location within the work piece being tested; a control unit for controlling the ultrasonic probe from a location outside of the work piece being tested; and wherein the ultrasonic probe and the control unit configured to obtain at least one of C-scan images and corresponding S-scan images of the same portion of the work piece being tested.",
"2.The testing system of claim 1, wherein the ultrasonic probe comprises a two-dimensional array probe.",
"3.The testing system of claim 1, wherein the ultrasonic probe comprises a translational device.",
"4.The testing system of claim 1, comprising a hand-held display configured to display the C-scan images in a radar-like view with a beam cursor.",
"5.The testing system of claim 1, wherein the ultrasonic probe produces a plurality of C-scan images.",
"6.The testing system of claim 1, wherein the ultrasonic probe produces a plurality of S-scan images.",
"7.A non-destructive testing system for testing a work piece, the non-destructive testing system comprising: an ultrasonic probe configured for a first S-scan image at a first direction orientation and the ultrasonic probe configured for a second S-scan image at a second direction orientation different from the first direction orientation.",
"8.The non-destructive testing system of claim 1, further comprising a motor for rotating the ultrasonic probe.",
"9.The non-destructive testing system of claim 8, wherein the motor comprises a position encoder in communication with the ultrasonic probe.",
"10.A method of viewing non-destructive test data in connection with testing a work piece from within the work piece, the method comprising: obtaining C-scan images and corresponding S-scan images, the C-scan images and the corresponding S-scan images are of the same portion of the work piece being tested; displaying a plurality of C-scan images on a hand-held display; selecting one of the plurality of C-scan images; and displaying an S-scan image corresponding to the selected C-scan image on the hand-held display.",
"11.The method of viewing of claim 10, wherein the step of displaying the plurality of C-scan images comprises displaying the plurality of C-scan images in a radar-like view.",
"12.The method of viewing of claim 11, wherein the radar-like view comprises rotating a beam cursor.",
"13.The method of viewing of claim 12, wherein a position of the beam cursor comprises the S-scan image corresponding to the selected C-scan image.",
"14.The method of viewing of claim 10, wherein the displaying step comprises displaying the scans on a hand-held device.",
"15.The method of viewing of claim 10, further comprising the step of resuming display of the plurality of C-scan images.",
"16.The method of claim 10, including maneuvering an ultrasonic probe."
],
[
"<SOH> BACKGROUND OF THE INVENTION <EOH>Non-destructive testing such as ultrasonic testing and the like may be used to inspect various types of materials and components.",
"Specifically, ultrasonic testing is a suitable method for finding internal anomalies and/or certain types of material characteristics in most types of sound conducting materials.",
"Such sound conducting materials include most metals and other types of substantially rigid materials.",
"Generally described, an ultrasonic probe detects anomalies or other characteristics upon changes in the reflection of sound waves on a boundary surface of the component or the anomaly.",
"Ultrasonic testing has the advantage of detecting such internal characteristics with a generally high degree of accuracy.",
"Data generated by ultrasonic testing may be presented in a number of different formats.",
"For example, the scan data may be presented as an A-scan (energy received as a function of time), a B-scan (cross-sectional view), a C-scan (plan view), an S-scan (sectional view), and the like.",
"A one-dimensional or two-dimensional ultrasonic probe may generate the scans.",
"A number of the individual scans may be combined so as to generate three-dimensional views.",
"As opposed to similar types of ultrasonic devices used in the healthcare field, non-destructive testing tools used in, for example, the oil and gas industry and the like, may be relatively small, handheld, and battery driven.",
"Moreover, such non-destructive testing tools generally need to last in the field for at least a complete shift (about 8 hours or more) without recharging.",
"Generating three-dimensional views, however, requires significant memory and computational power.",
"There is, thus, a desire for improved systems and methods of non-destructive testing such as ultrasonic testing and the like.",
"Such improved systems and methods may present ultrasonic and other types of non-destructive testing data in a useful and efficient fashion while requiring less computational resources."
],
[
"<SOH> SUMMARY OF THE INVENTION <EOH>The present application relates to a testing system and a related method.",
"The present application describes a testing system for testing a work piece.",
"The testing system includes an ultrasonic probe outputting at least one beam from a location within the work piece being tested.",
"The testing system includes a control unit for controlling the ultrasonic probe from a location outside of the work piece being tested.",
"The ultrasonic probe and the control unit are configured to obtain at least one of C-scan images and corresponding S-scan images of the same portion of the work piece being tested.",
"The present application further describes a non-destructive testing system for testing a work piece.",
"The non-destructive testing system includes an ultrasonic probe configured for a first S-scan image at a first direction orientation and the ultrasonic probe configured for a second S-scan image at a second direction orientation different from the first direction orientation.",
"The present application further describes a method of viewing non-destructive test data in connection with testing a work piece from within the work piece.",
"The method includes obtaining C-scan images and corresponding S-scan images, the C-scan images and the corresponding S-scan images are of the same portion of the work piece being tested.",
"The method includes displaying a plurality of C-scan images on a hand-held display.",
"The method includes selecting one of the plurality of C-scan images.",
"The method includes displaying an S-scan image corresponding the selected C-scan image on the hand-held display.",
"These and other features and improvements of the present application will become apparent to one of ordinary skill in the art upon review of the following detailed description when taken in conjunction with the several drawings and the appended claims."
],
[
"RELATED APPLICATIONS This application is a Continuation of, and benefit of priority is claimed herein from, U.S. patent application Ser.",
"No.",
"15/260,861 (now U.S. Pat.",
"No.",
"9,869,660) filed Sep. 9, 2016, which claimed priority from U.S. patent application Ser.",
"No.",
"14/838,992 (now U.S. Pat.",
"No.",
"9,442,097) filed Aug. 28, 2015, which claimed priority from U.S. patent application Ser.",
"No.",
"13/628,066 (now U.S. Pat.",
"No.",
"9,157,895), filed on Sep. 27, 2012, with benefit of priority also being claimed herein from U.S. patent application Ser.",
"No.",
"14/838,992 (U.S. Pat.",
"No.",
"9,442,097), with benefit of priority also being claimed herein from U.S. patent application Ser.",
"No.",
"13/628,066 (U.S. Pat.",
"No.",
"9,157,895), and the entire disclosures of all of which (U.S. patent application Ser.",
"Nos.",
"15/260,861, 14/838,992 and 13/628,066) are incorporated herein by reference.",
"TECHNICAL FIELD The present disclosure relates generally to ultrasonic probes used for non-destructive testing and more particularly relates to systems and methods for viewing data generated by rotational scanning in non-destructive testing with reduced storage and computational requirements.",
"BACKGROUND OF THE INVENTION Non-destructive testing such as ultrasonic testing and the like may be used to inspect various types of materials and components.",
"Specifically, ultrasonic testing is a suitable method for finding internal anomalies and/or certain types of material characteristics in most types of sound conducting materials.",
"Such sound conducting materials include most metals and other types of substantially rigid materials.",
"Generally described, an ultrasonic probe detects anomalies or other characteristics upon changes in the reflection of sound waves on a boundary surface of the component or the anomaly.",
"Ultrasonic testing has the advantage of detecting such internal characteristics with a generally high degree of accuracy.",
"Data generated by ultrasonic testing may be presented in a number of different formats.",
"For example, the scan data may be presented as an A-scan (energy received as a function of time), a B-scan (cross-sectional view), a C-scan (plan view), an S-scan (sectional view), and the like.",
"A one-dimensional or two-dimensional ultrasonic probe may generate the scans.",
"A number of the individual scans may be combined so as to generate three-dimensional views.",
"As opposed to similar types of ultrasonic devices used in the healthcare field, non-destructive testing tools used in, for example, the oil and gas industry and the like, may be relatively small, handheld, and battery driven.",
"Moreover, such non-destructive testing tools generally need to last in the field for at least a complete shift (about 8 hours or more) without recharging.",
"Generating three-dimensional views, however, requires significant memory and computational power.",
"There is, thus, a desire for improved systems and methods of non-destructive testing such as ultrasonic testing and the like.",
"Such improved systems and methods may present ultrasonic and other types of non-destructive testing data in a useful and efficient fashion while requiring less computational resources.",
"SUMMARY OF THE INVENTION The present application relates to a testing system and a related method.",
"The present application describes a testing system for testing a work piece.",
"The testing system includes an ultrasonic probe outputting at least one beam from a location within the work piece being tested.",
"The testing system includes a control unit for controlling the ultrasonic probe from a location outside of the work piece being tested.",
"The ultrasonic probe and the control unit are configured to obtain at least one of C-scan images and corresponding S-scan images of the same portion of the work piece being tested.",
"The present application further describes a non-destructive testing system for testing a work piece.",
"The non-destructive testing system includes an ultrasonic probe configured for a first S-scan image at a first direction orientation and the ultrasonic probe configured for a second S-scan image at a second direction orientation different from the first direction orientation.",
"The present application further describes a method of viewing non-destructive test data in connection with testing a work piece from within the work piece.",
"The method includes obtaining C-scan images and corresponding S-scan images, the C-scan images and the corresponding S-scan images are of the same portion of the work piece being tested.",
"The method includes displaying a plurality of C-scan images on a hand-held display.",
"The method includes selecting one of the plurality of C-scan images.",
"The method includes displaying an S-scan image corresponding the selected C-scan image on the hand-held display.",
"These and other features and improvements of the present application will become apparent to one of ordinary skill in the art upon review of the following detailed description when taken in conjunction with the several drawings and the appended claims.",
"BRIEF DESCRIPTION OF THE DRAWINGS FIG.",
"1 is a schematic diagram of a known non-destructive testing system with an ultrasonic probe.",
"FIG.",
"2 is a schematic diagram of a non-destructive testing system with an ultrasonic probe as may be described herein.",
"FIG.",
"3 is a plan view of the ultrasonic probe of the non-destructive testing system of FIG.",
"2 positioned within a work piece.",
"FIG.",
"4 is an example of a C-scan image produced by the non-destructive testing system of FIG.",
"2.FIG.",
"5 is an example of a number of S-scan images produced by the non-destructive testing system of FIG.",
"2.FIG.",
"6 is a schematic diagram of an alternative embodiment of a non-destructive testing system with an ultrasonic probe as may be described herein.",
"DETAILED DESCRIPTION Referring to the drawings, in which like numerals refer to like elements throughout the several views, FIG.",
"1 is a schematic diagram of a non-destructive testing system 10.The non-destructive testing system 10 includes an ultrasonic probe 15.Generally described, the ultrasonic probe 15 may be of conventional design and includes one or more arrays of transducers, a transmit beamformer, and a receive beamformer.",
"The ultrasonic transducers may be arranged as a phase array.",
"The transmit beamformer supplies electrical signals to the transducer arrays and the transducer arrays produce ultrasonic signals.",
"The structure facing the transducer arrays scatters the ultrasonic energy back to the transducer arrays so as to generate received electric signals.",
"Many different types of array processing techniques may be used for processing the received signals.",
"The ultrasonic probe 15 is in communication with a control unit 20.The control unit 20 may include a display 25.Many different types of control units 20 and display 25 may be used.",
"The non-destructive testing system 10 typically may be used to test a work piece 30.The work piece 30 may have one or more anomalies 35 therein.",
"The ultrasonic probe 15 may be configured to produce a number of S-scans 40 (sectional scans).",
"In the S-scans 40, a first axis may represent the distance from an insonification location or a depth in the work piece 30 and a second axis may represent an azimuth or an insonification angle.",
"Other types of scans such as a C-scan (plan view) and the like also may be generated and displayed on the display 25.A number of the S-scans 40 may be combined so as to produce a largely three-dimensional image.",
"As described above, however, displaying such three-dimensional data may be complicated and may require significant amounts of memory and computational power.",
"FIG.",
"2 is a schematic diagram of a non-destructive testing system 100 as is described herein.",
"Similar to that described above, the non-destructive testing system 100 includes an ultrasonic probe 110.The ultrasonic probe 110 may be of conventional design.",
"The ultrasound probe 110 may be in communication with a control unit 120 and a display 130.In this example, the control unit 120 may be a handheld device 140.The handheld device 140 may be any type of portable equipment.",
"The handheld device 140 also may be battery operated.",
"The ultrasonic probe 110 may be a phased array device 150.Other components and other configurations may be used herein.",
"The ultrasonic probe 110 may be configured as a translational device 160.Specifically, the ultrasonic probe 110 may include a matrix of transducers arranged as a two-dimensional probe.",
"The probe 110 thus may have discrete element separation in two directions such that a sound beam 170 may be controlled in a three-dimensional volume.",
"Specifically, the beam 170 is rotated about a middle axis, perpendicular to a horizontal plane.",
"The ultrasonic probe 110 thus may rotate the beam 170 about 360 degrees.",
"Resolution in terms of data capture may be at each one degree step for a 360 degree scan or at any desired resolution.",
"The resolution also may be varied for a particular type of application and/or type of work piece 30.FIG.",
"3 shows the use of the non-destructive testing system 100 within the work piece 30 with the anomaly 35.The ultrasonic probe 110 may be positioned about the work piece 30 in the form of a tube.",
"The ultrasonic probe 110 thus may rotate the beam 170 with a rotational axis 115 through the middle of the probe 110 and so as to produce any number of finely pitched scans.",
"Other components and other configurations also may be used herein.",
"The ultrasonic probe 110 may produce a number of different scans.",
"FIGS.",
"4 and 5 show examples of different types of scans produced and displayed by the display 130 of the non-destructive system 100.The ultrasonic probe 110 may produce both a number of C-scan images for top/down views and a number of S-scan images for side view imaging.",
"FIG.",
"4 shows a number C-scan images 190 combined with a beam cursor 200 so as to provide a radar-like view 210.FIG.",
"5 shows a number of S-scan images 220.Each S-scan image 220 may relate to an angle of interest along the 360 degrees of rotation based upon a position of the beam cursor 200 in the radar-like view 210 of the C-scan images 190.The user thus may toggle back and forth between the C-Scan images 190 and the associated S-scan images 220.Although a 360 degree scan is shown in FIG.",
"4, any smaller angle may be shown.",
"If so, the resultant image would be similar to a pie slice as opposed to the entire pie shown herein.",
"Other types of scans also may be used and combined herein.",
"The use of the C-scan images 190 in the radar-like view 210 requires only a two-dimensional display of the scan data.",
"As such, less memory and computational power may be required as compared to displaying three-dimensional data.",
"Using the location of the beam cursor 200, one may switch to the S-scan image 220 for further detail according to the position of the beam cursor 200.The non-destructive testing system 100 described herein thus provides three-dimensional data without requiring the power and other resources to display such.",
"The ultrasonic testing probe 110 and the non-destructing testing system 100 described herein thus may be implemented as the hand held device 140.FIG.",
"6 shows a further example of a non-destructive testing system 230 as may be described herein.",
"In this example, the ultrasonic probe 110 may be physically rotated.",
"Specifically, the ultrasonic probe 110 may be attached to and rotated by a motor 240.The motor 240 may be any type of device capable of producing rotational movement.",
"The rotational position of the ultrasonic probe 110 may be determined by a position encoder 250 and the like.",
"Other types of positioning and drive means may be used herein.",
"The non-destructive testing system 230 may then produce the scan images in a manner similar to that described above.",
"Other components and other configurations may be used herein.",
"It should be apparent that the foregoing relates only to certain embodiments of the present application and the resultant patent.",
"Numerous changes and modifications may be made herein by one of ordinary skill in the art without departing from the general spirit and scope of the invention as defined by the following claims and the equivalents thereof."
]
] |
Patent_15871328
|
[
[
"ORGANIC LIGHT-EMITTING DEVICE",
"An organic light-emitting device including a first electrode; a second electrode facing the first electrode; and an organic layer between the first electrode and the second electrode, wherein the organic layer includes at least one first material represented by Formula 1 and at least one second material represented by Formula 2:"
],
[
"1.-20.",
"(canceled) 21.An organic light-emitting device, comprising: a first electrode; a second electrode facing the first electrode; and an organic layer between the first electrode and the second electrode, wherein the organic layer includes a first material represented by any one of Formulae 1A and 1B below, and a second material represented by any one of Formulae 2A to 2C below, wherein in Formulae 1A, 1B, and 2A to 2C, L11, L21, and L22 are each independently selected from a phenylene group and a pyridinylene group; a11 is 0 or 1; a21 and a22 are each independently selected from 0, 1, and 2; R11 and R12 are each independently selected from a phenyl group, a naphthyl group, a fluorenyl group, a benzofluorenyl group and a benzothiophenyl group; and a phenyl group, a naphthyl group, a fluorenyl group, a benzofluorenyl group and a benzothiophenyl group, each substituted with at least one selected from a deuterium, —F, —Cl, —Br, —I, a cyano group, a nitro group and a C1-C20 alkyl group; R22 is selected from a pyridyl group, a quinolinyl group, and an isoquinolinyl group; b11, b12, b21, and b22 are 1; R13, R14, R23, and R24 are a hydrogen; b13, b14, b23, and b24 are 4.22.The organic light-emitting device as claimed in claim 21, wherein: the first material is represented by any one of Formulae 1A-1 and 1B-1 below, the second material is represented by any one of Formulae 2A to 2C below, wherein in Formulae 1A-1, 1B-1, and 2A to 2C, L11, a11, R11 to R14, b11 to b14, L21, L22, a21, a22, R22 to R24, and b22 to b24 are the same as defined with respect to Formulae 1A and 1B and 2A to 2C.",
"23.The organic light-emitting device as claimed in claim 21, wherein: the organic layer includes: an emission layer, and an electron transport region between the second electrode and the emission layer, the emission layer includes the at least one first material, and the electron transport region includes the at least one second material.",
"24.The organic light-emitting device as claimed in claim 23, wherein: the electron transport region includes an electron transport layer, and the electron transport layer includes the at least one second material.",
"25.The organic light-emitting device as claimed in claim 23, wherein: the electron transport region includes a buffer layer, and the buffer layer includes the at least one second material."
],
[
"<SOH> BACKGROUND <EOH>"
],
[
"<SOH> SUMMARY <EOH>Embodiments are directed to an organic light-emitting device One or more embodiments provides an organic light-emitting device including a first electrode; a second electrode facing the first electrode; and an organic layer disposed between the first electrode and the second electrode, the organic layer includes at least one material selected from first materials represented by Formula 1 and at least one material selected from second materials represented by Formula 2: wherein in Formulae 1 and 2, L 11 , L 21 , and L 22 may be each independently selected from a substituted or unsubstituted C 6 -C 60 arylene group and a substituted or unsubstituted C 1 -C 60 heteroarylene group; L 12 may be selected from a substituted or unsubstituted phenylene group and a substituted or unsubstituted naphthylenyl group; a11 may be 0 or 1; a12 may be 1 or 2; a21 and a22 may be each independently selected from 0, 1, and 2; R 11 and R 12 may be each independently selected from a substituted or unsubstituted C 6 -C 60 aryl group, a substituted or unsubstituted C 1 -C 60 heteroaryl group, a substituted or unsubstituted monovalent non-aromatic condensed polycyclic group, and a substituted or unsubstituted monovalent non-aromatic condensed heteropolycyclic group; R 21 and R 22 may be each independently selected from a substituted or unsubstituted pyridyl group, a substituted or unsubstituted quinolinyl group, and a substituted or unsubstituted isoquinolinyl group; b11, b12, b21, and b22 may be each independently selected from 1, 2, and 3; R 13 , R 14 , R 23 , and R 24 may be each independently selected from a hydrogen, a deuterium, —F, —Cl, —Br, —I, a hydroxyl group, a cyano group, a nitro group, an amino group, an amidino group, a hydrazine group, a hydrazone group, a carboxylic acid or a salt thereof, a sulfonic acid or a salt thereof, a phosphoric acid or a salt thereof, a substituted or unsubstituted C 1 -C 60 alkyl group, a substituted or unsubstituted C 1 -C 60 alkoxy group, a substituted or unsubstituted C 3 -C 10 cycloalkyl group, a substituted or unsubstituted C 6 -C 60 aryl group, a substituted or unsubstituted C 6 -C 60 aryloxy group, a substituted or unsubstituted C 1 -C 60 heteroaryl group a substituted or unsubstituted monovalent non-aromatic condensed polycyclic group, a substituted or unsubstituted monovalent non-aromatic condensed hetero-polycyclic group, and —Si(Q 1 )(Q 2 )(Q 3 ); b13, b14, b23, and b24 may be each independently selected from 1, 2, 3 and 4; at least one of substituents of the substituted C 6 -C 60 arylene group, the substituted C 1 -C 60 heteroarylene group, the substituted a phenylene group, the substituted naphthylenyl group, the substituted C 6-60 aryl group, the substituted C 1 -C 60 heteroaryl group, the substituted monovalent non-aromatic condensed polycyclic group, the substituted monovalent non-aromatic condensed hetero-polycyclic group, the substituted pyridyl group, the substituted quinolinyl group, the substituted isoquinolinyl group, the substituted C 1 -C 60 alkyl group, the substituted C 1 -C 60 alkoxy group, the substituted C 3 -C 10 cycloalkyl group, and the substituted C 6 -C 60 aryloxy group may be selected from a deuterium, —F, —Cl, —Br, —I, a hydroxyl group, a cyano group, a nitro group, an amino group, an amidino group, a hydrazine group, a hydrazone group, a carboxylic acid group or a salt thereof, a sulfonic acid group or a salt thereof, a phosphoric acid group or a salt thereof, a C 1 -C 60 alkyl group, a C 2 -C 60 alkenyl group, a C 2 -C 60 alkynyl group, and a C 1 -C 60 alkoxy group; a C 1 -C 60 alkyl group, a C 2 -C 60 alkenyl group, a C 2 -C 60 alkynyl group, and a C 1 -C 60 alkoxy group, each substituted with at least one selected from a deuterium, —F, —Cl, —Br, —I, a hydroxyl group, a cyano group, a nitro group, an amino group, an amidino group, a hydrazine group, a hydrazone group, a carboxylic acid or a salt thereof, a sulfonic acid or a salt thereof, a phosphoric acid or a salt thereof, a C 3 -C 10 cycloalkyl group, a C 2 -C 10 heterocycloalkyl group, a C 3 -C 10 cycloalkenyl group, a C 2 -C 10 heterocycloalkenyl group, a C 6 -C 60 aryl group, a C 6 -C 60 aryloxy group, a C 6 -C 60 arythio group, a C 1 -C 60 heteroaryl group, a monovalent non-aromatic condensed polycyclic group, a monovalent non-aromatic condensed hetero-polycyclic group, and —Si(Q 11 )(Q 12 )(Q 13 ); a C 3 -C 10 cycloalkyl group, a C 2 -C 10 heterocycloalkyl group, a C 3 -C 10 cycloalkenyl group, a C 2 -C 10 heterocycloalkenyl group, a C 6 -C 60 aryl group, a C 6 -C 60 aryloxy group, a C 6 -C 60 arylthio group, a C 1 -C 60 heteroaryl group, a monovalent non-aromatic condensed polycyclic group, and a monovalent non-aromatic condensed heteropolycyclic group; a C 3 -C 10 cycloalkyl group, a C 2 -C 10 heterocycloalkyl group, a C 3 -C 10 cycloalkenyl group, a C 2 -C 10 heterocycloalkenyl group, a C 6 -C 60 aryl group, a C 6 -C 60 aryloxy group, a C 6 -C 60 arythio group, a C 1 -C 60 heteroaryl group, a monovalent non-aromatic condensed polycyclic group, and a monovalent non-aromatic condensed hetero-polycyclic group, each substituted with at least one selected from a deuterium, —F, —Cl, —Br, —I, a hydroxyl group, a cyano group, a nitro group, an amino group, an amidino group, a hydrazine group, a hydrazone group, a carboxylic acid or a salt thereof, a sulfonic acid or a salt thereof, a phosphoric acid or a salt thereof, a C 1 -C 60 alkyl group, a C 2 -C 60 alkenyl group, a C 2 -C 60 alkynyl group, a C 1 -C 60 alkoxy group, a C 3 -C 10 cycloalkyl group, a C 2 -C 10 heterocycloalkyl group, a C 3 -C 10 cycloalkenyl group, a C 2 -C 10 heterocycloalkenyl group, a C 6 -C 60 aryl group, a C 6 -C 60 aryloxy group, a C 6 -C 60 arythio group, a C 1 -C 60 heteroaryl group, a monovalent non-aromatic condensed polycyclic group, a monovalent non-aromatic condensed hetero-polycyclic group, and —Si(Q 21 )(Q 22 )(Q 23 ); and —Si(Q 31 )(Q 32 )(Q 33 ), Q 1 to Q 3 , Q 11 to Q 13 , Q 21 to Q 23 and Q 31 to Q 33 may be each independently selected from a C 1 -C 60 alkyl group, a C 6 -C 60 aryl group, a C 1 -C 6 heteroaryl group, a monovalent non-aromatic condensed polycyclic group, and a monovalent non-aromatic condensed heteropolycyclic group."
],
[
"CROSS-REFERENCE TO RELATED APPLICATION Korean Patent Application No.",
"10-2014-0069566, filed on Jun.",
"9, 2014, in the Korean Intellectual Property Office, and entitled: “Organic Light-Emitting Device,” is incorporated by reference herein in its entirety.",
"BACKGROUND 1.Field Embodiments relate to an organic light-emitting device.",
"2.Description of the Related Art Organic light emitting devices are self-emission devices that have wide viewing angles, high contrast ratios, short response times, and excellent brightness, driving voltage, and response speed characteristics, and produce full-color images.",
"The organic light-emitting device may include a first electrode disposed on a substrate, and a hole transport region, an emission layer, an electron transport region, and a second electrode, which are sequentially disposed on the first electrode.",
"Holes provided from the first electrode may move toward the emission layer through the hole transport region, and electrons provided from the second electrode may move toward the emission layer through the electron transport region.",
"Carriers, such as holes and electrons, may be recombined in the emission layer to produce excitons.",
"These excitons may change from an excited state to a ground state, thereby generating light.",
"SUMMARY Embodiments are directed to an organic light-emitting device One or more embodiments provides an organic light-emitting device including a first electrode; a second electrode facing the first electrode; and an organic layer disposed between the first electrode and the second electrode, the organic layer includes at least one material selected from first materials represented by Formula 1 and at least one material selected from second materials represented by Formula 2: wherein in Formulae 1 and 2, L11, L21, and L22 may be each independently selected from a substituted or unsubstituted C6-C60 arylene group and a substituted or unsubstituted C1-C60 heteroarylene group; L12 may be selected from a substituted or unsubstituted phenylene group and a substituted or unsubstituted naphthylenyl group; a11 may be 0 or 1; a12 may be 1 or 2; a21 and a22 may be each independently selected from 0, 1, and 2; R11 and R12 may be each independently selected from a substituted or unsubstituted C6-C60 aryl group, a substituted or unsubstituted C1-C60 heteroaryl group, a substituted or unsubstituted monovalent non-aromatic condensed polycyclic group, and a substituted or unsubstituted monovalent non-aromatic condensed heteropolycyclic group; R21 and R22 may be each independently selected from a substituted or unsubstituted pyridyl group, a substituted or unsubstituted quinolinyl group, and a substituted or unsubstituted isoquinolinyl group; b11, b12, b21, and b22 may be each independently selected from 1, 2, and 3; R13, R14, R23, and R24 may be each independently selected from a hydrogen, a deuterium, —F, —Cl, —Br, —I, a hydroxyl group, a cyano group, a nitro group, an amino group, an amidino group, a hydrazine group, a hydrazone group, a carboxylic acid or a salt thereof, a sulfonic acid or a salt thereof, a phosphoric acid or a salt thereof, a substituted or unsubstituted C1-C60 alkyl group, a substituted or unsubstituted C1-C60 alkoxy group, a substituted or unsubstituted C3-C10 cycloalkyl group, a substituted or unsubstituted C6-C60 aryl group, a substituted or unsubstituted C6-C60 aryloxy group, a substituted or unsubstituted C1-C60 heteroaryl group a substituted or unsubstituted monovalent non-aromatic condensed polycyclic group, a substituted or unsubstituted monovalent non-aromatic condensed hetero-polycyclic group, and —Si(Q1)(Q2)(Q3); b13, b14, b23, and b24 may be each independently selected from 1, 2, 3 and 4; at least one of substituents of the substituted C6-C60 arylene group, the substituted C1-C60 heteroarylene group, the substituted a phenylene group, the substituted naphthylenyl group, the substituted C6-60 aryl group, the substituted C1-C60 heteroaryl group, the substituted monovalent non-aromatic condensed polycyclic group, the substituted monovalent non-aromatic condensed hetero-polycyclic group, the substituted pyridyl group, the substituted quinolinyl group, the substituted isoquinolinyl group, the substituted C1-C60 alkyl group, the substituted C1-C60 alkoxy group, the substituted C3-C10 cycloalkyl group, and the substituted C6-C60 aryloxy group may be selected from a deuterium, —F, —Cl, —Br, —I, a hydroxyl group, a cyano group, a nitro group, an amino group, an amidino group, a hydrazine group, a hydrazone group, a carboxylic acid group or a salt thereof, a sulfonic acid group or a salt thereof, a phosphoric acid group or a salt thereof, a C1-C60 alkyl group, a C2-C60 alkenyl group, a C2-C60 alkynyl group, and a C1-C60 alkoxy group; a C1-C60 alkyl group, a C2-C60 alkenyl group, a C2-C60 alkynyl group, and a C1-C60 alkoxy group, each substituted with at least one selected from a deuterium, —F, —Cl, —Br, —I, a hydroxyl group, a cyano group, a nitro group, an amino group, an amidino group, a hydrazine group, a hydrazone group, a carboxylic acid or a salt thereof, a sulfonic acid or a salt thereof, a phosphoric acid or a salt thereof, a C3-C10 cycloalkyl group, a C2-C10 heterocycloalkyl group, a C3-C10 cycloalkenyl group, a C2-C10 heterocycloalkenyl group, a C6-C60 aryl group, a C6-C60 aryloxy group, a C6-C60 arythio group, a C1-C60 heteroaryl group, a monovalent non-aromatic condensed polycyclic group, a monovalent non-aromatic condensed hetero-polycyclic group, and —Si(Q11)(Q12)(Q13); a C3-C10 cycloalkyl group, a C2-C10 heterocycloalkyl group, a C3-C10 cycloalkenyl group, a C2-C10 heterocycloalkenyl group, a C6-C60 aryl group, a C6-C60 aryloxy group, a C6-C60 arylthio group, a C1-C60 heteroaryl group, a monovalent non-aromatic condensed polycyclic group, and a monovalent non-aromatic condensed heteropolycyclic group; a C3-C10 cycloalkyl group, a C2-C10 heterocycloalkyl group, a C3-C10 cycloalkenyl group, a C2-C10 heterocycloalkenyl group, a C6-C60 aryl group, a C6-C60 aryloxy group, a C6-C60 arythio group, a C1-C60 heteroaryl group, a monovalent non-aromatic condensed polycyclic group, and a monovalent non-aromatic condensed hetero-polycyclic group, each substituted with at least one selected from a deuterium, —F, —Cl, —Br, —I, a hydroxyl group, a cyano group, a nitro group, an amino group, an amidino group, a hydrazine group, a hydrazone group, a carboxylic acid or a salt thereof, a sulfonic acid or a salt thereof, a phosphoric acid or a salt thereof, a C1-C60 alkyl group, a C2-C60 alkenyl group, a C2-C60 alkynyl group, a C1-C60 alkoxy group, a C3-C10 cycloalkyl group, a C2-C10 heterocycloalkyl group, a C3-C10 cycloalkenyl group, a C2-C10 heterocycloalkenyl group, a C6-C60 aryl group, a C6-C60 aryloxy group, a C6-C60 arythio group, a C1-C60 heteroaryl group, a monovalent non-aromatic condensed polycyclic group, a monovalent non-aromatic condensed hetero-polycyclic group, and —Si(Q21)(Q22)(Q23); and —Si(Q31)(Q32)(Q33), Q1 to Q3, Q11 to Q13, Q21 to Q23 and Q31 to Q33 may be each independently selected from a C1-C60 alkyl group, a C6-C60 aryl group, a C1-C6 heteroaryl group, a monovalent non-aromatic condensed polycyclic group, and a monovalent non-aromatic condensed heteropolycyclic group.",
"BRIEF DESCRIPTION OF THE DRAWING Features will be apparent to those of skill in the art by describing in detail exemplary embodiments with reference to the attached drawing in which: FIG.",
"1 illustrates a schematic cross-sectional view of an organic light-emitting device according to an embodiment.",
"DETAILED DESCRIPTION Example embodiments will now be described more fully hereinafter with reference to the accompanying drawing; however, they may be embodied in different forms and should not be construed as limited to the embodiments set forth herein.",
"Rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey exemplary implementations to those skilled in the art.",
"In the drawing FIGURE, the dimensions of layers and regions may be exaggerated for clarity of illustration.",
"Like reference numerals refer to like elements throughout.",
"Expressions such as “at least one of,” when preceding a list of elements, modify the entire list of elements and do not modify the individual elements of the list.",
"As used herein, the singular forms “a,” “an” and “the” are intended to include the plural forms as well, unless the context clearly indicates otherwise.",
"It will be further understood that the terms “comprises” and/or “comprising” used herein specify the presence of stated features or components, but do not preclude the presence or addition of one or more other features or components.",
"It will be understood that when a layer, region, or component is referred to as being “on” or “onto” another layer, region, or component, it can be directly or indirectly formed on the other layer, region, or component.",
"That is, for example, intervening layers, regions, or components may be present.",
"The term “(an organic layer) includes at least one selected from first materials” or “(an organic layer) includes a first material” used herein includes a case in which “(an organic layer) includes one kind of material selected from first materials represented by Formula 1 and a case in which (an organic layer) includes two or more different kinds of materials selected from first materials represented Formula 1”.",
"In FIG.",
"1, a substrate may be additionally disposed under a first electrode 110 or above a second electrode 190.The substrate may be a glass substrate or transparent plastic substrate, each with excellent mechanical strength, thermal stability, transparency, surface smoothness, ease of handling, and water repellency.",
"The first electrode 110 may be formed by depositing or sputtering a material for forming the first electrode on the substrate.",
"When the first electrode 110 is an anode, the material for the first electrode 110 may be selected from materials with a high work function to facilitate hole injection.",
"The first electrode 110 may be a reflective electrode or a transmissive electrode.",
"The material for the first electrode 110 may be a transparent and highly conductive material, and examples of such a material may include indium tin oxide (ITO), indium zinc oxide (IZO), tin oxide (SnO2), and zinc oxide (ZnO).",
"When the first electrode 110 is a semi-transmissive electrode or a reflective electrode, as a material for forming the first electrode, at least one of magnesium (Mg), aluminum (Al), aluminum-lithium (Al—Li), calcium (Ca), magnesium-indium (Mg—In), magnesium-silver (Mg—Ag) may be used.",
"The first electrode 110 may have a single-layer structure, or a multi-layer structure including two or more layers.",
"For example, the first electrode 110 may have a three-layered structure of ITO/Ag/ITO, but the structure of the first electrode 110 is not limited thereto.",
"An organic layer 150 may be disposed on the first electrode 110.The organic layer 150 may include an emission layer.",
"The organic layer 150 may include at least one selected from first materials represented by Formula 1 and at least one selected from second materials represented by Formula 2.For example, the organic layer 150 may include a first material represented by Formula 1 and a second material represented by Formula 2.In Formulae 1 and 2, L11, L21, and L22 may be each independently selected from a substituted or unsubstituted C6-C60 arylene group and a substituted or unsubstituted C1-C60 heteroarylene group; L12 may be selected from a substituted or unsubstituted phenylene group and a substituted or unsubstituted naphthylenyl group; a11 may be 0 or 1; a12 may be 1 or 2; a21 and a22 may be each independently selected from 0, 1, and 2; R11 and R12 may be each independently selected from a substituted or unsubstituted C6-C60 aryl group, a substituted or unsubstituted C1-C60 heteroaryl group, a substituted or unsubstituted monovalent non-aromatic condensed polycyclic group, and a substituted or unsubstituted monovalent non-aromatic condensed heteropolycyclic group; R21 and R22 may be each independently selected from a substituted or unsubstituted pyridyl group, a substituted or unsubstituted quinolinyl group, and a substituted or unsubstituted isoquinolinyl group; b11, b12, b21, and b22 may be each independently selected from 1, 2, and 3; R13, R14, R23, and R24 may be each independently selected from a hydrogen, a deuterium, —F, —Cl, —Br, —I, a hydroxyl group, a cyano group, a nitro group, an amino group, an amidino group, a hydrazine group, a hydrazone group, a carboxylic acid or a salt thereof, a sulfonic acid or a salt thereof, a phosphoric acid or a salt thereof, a substituted or unsubstituted C1-C60 alkyl group, a substituted or unsubstituted C1-C60 alkoxy group, a substituted or unsubstituted C3-C10 cycloalkyl group, a substituted or unsubstituted C6-C60 aryl group, a substituted or unsubstituted C6-C60 aryloxy group, a substituted or unsubstituted C1-C60 heteroaryl group a substituted or unsubstituted monovalent non-aromatic condensed polycyclic group, a substituted or unsubstituted monovalent non-aromatic condensed hetero-polycyclic group, and —Si(Q1)(Q2)(Q3); b13, b14, b23, and b24 may be each independently selected from 1, 2, 3 and 4; at least one of substituents of the substituted C6-C60 arylene group, the substituted C1-C60 heteroarylene group, the substituted a phenylene group, the substituted naphthylenyl group, the substituted C6-C60 aryl group, the substituted C1-C60 heteroaryl group, the substituted monovalent non-aromatic condensed polycyclic group, the substituted monovalent non-aromatic condensed hetero-polycyclic group, the substituted pyridyl group, the substituted quinolinyl group, the substituted isoquinolinyl group, the substituted C1-C60 alkyl group, the substituted C1-C60 alkoxy group, the substituted C3-C10 cycloalkyl group, and the substituted C6-C60 aryloxy group may be selected from a deuterium, —F, —Cl, —Br, —I, a hydroxyl group, a cyano group, a nitro group, an amino group, an amidino group, a hydrazine group, a hydrazone group, a carboxylic acid group or a salt thereof a sulfonic acid group or a salt thereof, a phosphoric acid group or a salt thereof, a C1-C60 alkyl group, a C2-C60 alkenyl group, a C2-C60 alkynyl group, and a C1-C60 alkoxy group; a C1-C60 alkyl group, a C2-C60 alkenyl group, a C2-C60 alkynyl group, and a C1-C60 alkoxy group, each substituted with at least one selected from a deuterium, —F, —Cl, —Br, —I, a hydroxyl group, a cyano group, a nitro group, an amino group, an amidino group, a hydrazine group, a hydrazone group, a carboxylic acid or a salt thereof, a sulfonic acid or a salt thereof, a phosphoric acid or a salt thereof, a C3-C10 cycloalkyl group, a C2-C10 heterocycloalkyl group, a C3-C10 cycloalkenyl group, a C2-C10 heterocycloalkenyl group, a C6-C60 aryl group, a C6-C60 aryloxy group, a C6-C60 arythio group, a C1-C60 heteroaryl group, a monovalent non-aromatic condensed polycyclic group, a monovalent non-aromatic condensed hetero-polycyclic group, and —Si(Q11)(Q12)(Q13); a C3-C10 cycloalkyl group, a C2-C10 heterocycloalkyl group, a C3-C10 cycloalkenyl group, a C2-C10 heterocycloalkenyl group, a C1-C60 aryl group, a C6-C60 aryloxy group, a C6-C60 arylthio group, a C1-C60 heteroaryl group, a monovalent non-aromatic condensed polycyclic group, and a monovalent non-aromatic condensed heteropolycyclic group; a C3-C10 cycloalkyl group, a C2-C10 heterocycloalkyl group, a C3-C10 cycloalkenyl group, a C2-C10 heterocycloalkenyl group, a C6-C60 aryl group, a C6-C60 aryloxy group, a C6-C60 arythio group, a C1-C60 heteroaryl group, a monovalent non-aromatic condensed polycyclic group, and a monovalent non-aromatic condensed hetero-polycyclic group, each substituted with at least one selected from a deuterium, —F, —Cl, —Br, —I, a hydroxyl group, a cyano group, a nitro group, an amino group, an amidino group, a hydrazine group, a hydrazone group, a carboxylic acid or a salt thereof, a sulfonic acid or a salt thereof, a phosphoric acid or a salt thereof, a C1-C60 alkyl group, a C2-C60 alkenyl group, a C2-C60 alkynyl group, a C1-C6 alkoxy group, a C3-C10 cycloalkyl group, a C2-C10 heterocycloalkyl group, a C3-C10 cycloalkenyl group, a C2-C10 heterocycloalkenyl group, a C6-C60 aryl group, a C6-C60 aryloxy group, a C6-C60 arythio group, a C1-C60 heteroaryl group, a monovalent non-aromatic condensed polycyclic group, a monovalent non-aromatic condensed hetero-polycyclic group, and —Si(Q21)(Q22)(Q23); and —Si(Q31)(Q32)(Q33), wherein Q1 to Q3, Q11 to Q13, Q21 to Q23 and Q31 to Q33 may be each independently selected from a C1-C60 alkyl group, a C6-C60 aryl group, a C1-C60 heteroaryl group, a monovalent non-aromatic condensed polycyclic group, and a monovalent non-aromatic condensed heteropolycyclic group.",
"For example, L11, L21, and L22 in Formulae 1 and 2 may be each independently selected from a phenylene group, a naphthylene group, a phenanthrenylene group, an anthracenylene group, a triphenylenylene group, a pyrenylene group, a chrysenylene group, a pyrrolylene group, a thiophenylene group, a furanylene group, an imidazolylene group, a pyridinylene group, a pyrazinylene group, a pyrimidinylene group, a pyridazinylene group, an indolylene indolylene group, a quinolinylene group, an isoquinolinylene group, a benzoquinolinylene group, a phenanthridinylene group, an acridinylene group, a phenanthrolinylene group, a benzofuranylene group, a benzothiophenylene group, a triazolylene group, a tetrazolylene group, a triazinylene triazinylene group, a dibenzofuranylene group, and a dibenzothiophenylene group; and a phenylene group, a naphthylene group, a phenanthrenylene group, an anthracenylene group, a triphenylenylene group, a pyrenylene group, a chrysenylene group, a pyrrolylene group, a thiophenylene group, a furanylene group, an imidazolylene group, a pyridinylene group, a pyrazinylene group, a pyrimidinylene group, a pyridazinylene group, an indolylene group, a quinolinylene group, an isoquinolinylene group, a benzoquinolinylene group, a phenanthridinylene group, an acridinylene group, a phenanthrolinylene group, a benzofuranylene group, a benzothiophenylene group, a triazolylene group, a tetrazolylene group, a triazinylene group, a dibenzofuranylene group, and a dibenzothiophenylene group, each substituted with at least one selected from a deuterium, —F, —Cl, —Br, —I, a hydroxyl group, a cyano group, a nitro group, an amino group, an amidino group, a hydrazine group, a hydrazone group, a carboxylic acid or a salt thereof, a sulfonic acid or a salt thereof, a phosphoric acid or a salt thereof, a C1-C20 alkyl group, a C1-C20 alkoxy group, a cyclopentyl group, a cyclohexyl group, a cycloheptyl group, a cyclopentenyl group, a cyclohexenyl group, a phenyl group, a pentalenyl group, an indenyl group, a naphthyl group, an azulenyl group, a heptalenyl group, an indacenyl group, acenaphthyl group, a fluorenyl group, a spiro-fluorenyl group, a benzofluorenyl group, a dibenzofluorenyl group, a phenalenyl group, a phenanthrenyl group, an anthracenyl group, a fluoranthenyl group, a triphenylenyl group, a pyrenyl group, a chrysenyl group, a naphthacenyl group, a picenyl group, a perylenyl group, a pentaphenyl group, a hexacenyl group, a pentacenyl group, a rubicenyl group, a coronenyl group, an ovalenyl group, a pyrrolyl group, a thiophenyl group, a furanyl group, an imidazolyl group, a pyrazolyl group, a thiazolyl group, an isothiazolyl group, an oxazolyl group, an isoxazolyl group, a pyridinyl group, a pyrazinyl group, a pyrimidinyl group, a pyridazinyl group, an isoindolyl group, an indolyl group, an indazolyl group, a purinyl group, a quinolinyl group, an isoquinolinyl group, a benzoquinolinyl group, a phthalazinyl group, a naphthyridinyl group, a quinoxalinyl group, a quinazolinyl group, a cinnolinyl group, a carbazolyl group, a phenanthridinyl group, an acridinyl group, a phenanthrolinyl group, a phenazinyl group, a benzimidazolyl group, a benzofuranyl group, a benzothiophenyl group, an isobenzothiazolyl group, a benzooxazolyl group, an isobenzooxazolyl group, a triazolyl group, a tetrazolyl group, an oxadiazolyl group, a triazinyl group, dibenzofuranyl group, a dibenzothiophenyl group, a benzocarbazolyl group, a dibenzocarbazolyl group, a thiadiazolyl group, and an imidazopyridinyl group, but they are not limited thereto.",
"In some embodiments, L11, L21, and L22 in Formulae 1 and 2 may be each independently selected from a phenylene group, a naphthylene group, a pyridinylene group, a quinolinylene group and an isoquinolinylene group; and a phenylene group, a naphthylene group, a pyridinylene group, a quinolinylene group, and an isoquinolinylene group, each substituted with at least one selected from a deuterium, —F, —Cl, —Br, —I, a cyano group, a nitro group, a C1-C20 alkyl group, a phenyl group, and a naphthyl group, but they are not limited thereto.",
"In some embodiments, L11, L21, and L22 in Formulae 1 and 2 may be each independently selected from a group represented by any one of Formulae 3-1 to 3-6, but they are not limited thereto.",
"In Formulae 3-1 to 3-6, * and *′ indicate binding sites to a neighboring atom.",
"For example, L12 in Formula 1 may be selected from a phenylene group and a naphthylenyl group, but is not limited thereto.",
"a11 in Formula 1 indicates the number of L11, and when a11 is 0, (L11)a11 may indicate a direct bond.",
"a12 in Formula 1 indicates the number of L12, and when a12 is 2, a plurality of L12 may be identical or different.",
"a21 in Formula 2 indicates the number of L21, and when a21 is 2, a plurality of L21 may be identical or different.",
"When a21 is 0, (L21)a21 may indicate a direct bond.",
"a22 in Formula 2 indicates the number of L22, and when a22 is 2, a plurality of L22 may be identical or different.",
"When a22 is 0, (L22)a22 may indicate a direct bond.",
"For example, R11 and R12 in Formula 1 may be each independently selected from a phenyl group, a pentalenyl group, an indenyl group, a naphthyl group, a azulenyl group, a heptalenyl group, an indacenyl group, an acenaphthyl group, a fluorenyl group, a spiro-fluorenyl group, a benzofluorenyl group, a dibenzofluorenyl group, phenalenyl group, a phenanthrenyl group, an anthracenyl group, a fluoranthenyl group, a triphenylenyl group, a pyrenyl group, a chrysenyl group, a naphthacenyl group, a picenyl group, a perylenyl group, a pentaphenyl group, a hexacenyl group, a pentacenyl group, a rubicenyl group, a coronenyl group, a ovalenyl group, a pyrrolyl group, a thiophenyl group, a furanyl group, a imidazolyl group, a pyrazolyl group, a thiazolyl group, an isothiazolyl group, a oxazolyl group, an isoxazolyl group, a pyridinyl group, a pyrazinyl group, a pyrimidinyl group, a pyridazinyl group, an isoindolyl group, an indolyl group, an indazolyl group, a purinyl group, a quinolinyl group, an isoquinolinyl group, a carbazolyl group, a benzoquinolinyl group, a phthalazinyl group, a naphthyridinyl group, a quinoxalinyl group, a quinazolinyl group, a cinnolinyl group, a phenanthridinyl group, an acridinyl group, a phenanthrolinyl group, a phenazinyl group, a benzimidazolyl group, a benzofuranyl group, a benzothiophenyl group, an isobenzothiazolyl group, a benzooxazolyl group, an isobenzooxazolyl group, a triazolyl group, a tetrazolyl group, an oxadiazolyl group, a triazinyl group, a dibenzofuranyl group, a dibenzothiophenyl group, a dibenzosilolyl group, a benzocarbazolyl group, and a dibenzocarbazolyl group; and a phenyl group, a pentalenyl group, an indenyl group, a naphthyl group, an azulenyl group, a heptalenyl group, an indacenyl group, acenaphthyl group, a fluorenyl group, a spiro-fluorenyl group, a benzofluorenyl group, a dibenzofluorenyl group, a phenalenyl group, a phenanthrenyl group, an anthracenyl group, a fluoranthenyl group, a triphenylenyl group, a pyrenyl group, a chrysenyl group, a naphthacenyl group, a picenyl group, a perylenyl group, a pentaphenyl group, a hexacenyl group, a pentacenyl group, a rubicenyl group, a coronenyl group, an ovalenyl group, a pyrrolyl group, a thiophenyl group, a furanyl group, an imidazolyl group, a pyrazolyl group, a thiazolyl group, an isothiazolyl group, an oxazolyl group, an isoxazolyl group, a pyridinyl group, a pyrazinyl group, a pyrimidinyl group, a pyridazinyl group, an isoindolyl group, an indolyl group, an indazolyl group, a purinyl group, a quinolinyl group, an isoquinolinyl group, a carbazolyl group, a benzoquinolinyl group, a phthalazinyl group, a naphthyridinyl group, a quinoxalinyl group, a quinazolinyl group, a cinnolinyl group, a phenanthridinyl group, an acridinyl group, a phenanthrolinyl group, a phenazinyl group, a benzimidazolyl group, a benzofuranyl group, a benzothiophenyl group, an isobenzothiazolyl group, a benzooxazolyl group, an isobenzooxazolyl group, a triazolyl group, a tetrazolyl group, an oxadiazolyl group, a triazinyl group, dibenzofuranyl group, a dibenzothiophenyl group, a dibenzosilolyl group, a benzocarbazolyl group, and a dibenzocarbazolyl group, each substituted with at least one selected from a deuterium, —F, —Cl, —Br, —I, a hydroxyl group, a cyano group, a nitro group, an amino group, an amidino group, a hydrazine group, a hydrazone group, a carboxylic acid or a salt thereof, a sulfonic acid or a salt thereof, a phosphoric acid or a salt thereof, a C1-C20 alkyl group, a C1-C20 alkoxy group, a phenyl group, a pentalenyl group, an indenyl group, a naphthyl group, an azulenyl group, a heptalenyl group, an indacenyl group, acenaphthyl group, a fluorenyl group, a spiro-fluorenyl group, a benzofluorenyl group, a dibenzofluorenyl group, a phenalenyl group, a phenanthrenyl group, an anthracenyl group, a fluoranthenyl group, a triphenylenyl group, a pyrenyl group, a chrysenyl group, a naphthacenyl group, a picenyl group, a perylenyl group, a pentaphenyl group, a hexacenyl group, a pentacenyl group, a rubicenyl group, a coronenyl group, an ovalenyl group, a pyrrolyl group, a thiophenyl group, a furanyl group, an imidazolyl group, a pyrazolyl group, a thiazolyl group, an isothiazolyl group, an oxazolyl group, an isoxazolyl group, a pyridinyl group, a pyrazinyl group, a pyrimidinyl group, a pyridazinyl group, an isoindolyl group, an indolyl group, an indazolyl group, a purinyl group, a quinolinyl group, an isoquinolinyl group, a carbazolyl group, a benzoquinolinyl group, a phthalazinyl group, a naphthyridinyl group, a quinoxalinyl group, a quinazolinyl group, a cinnolinyl group, a carbazolyl group, a phenanthridinyl group, an acridinyl group, a phenanthrolinyl group, a phenazinyl group, a benzimidazolyl group, a benzofuranyl group, a benzothiophenyl group, an isobenzothiazolyl group, a benzooxazolyl group, an isobenzooxazolyl group, a triazolyl group, a tetrazolyl group, an oxadiazolyl group, a triazinyl group, dibenzofuranyl group, a dibenzothiophenyl group, a benzocarbazolyl group, and a dibenzocarbazolyl group, but they are not limited thereto.",
"In some embodiments, R11 and R12 in Formula 1 may be each independently selected from a phenyl group, a naphthyl group, a fluorenyl group, a benzofluorenyl group, a dibenzofluorenyl group, a phenanthrenyl group, an anthracenyl group, a fluoranthenyl group, a triphenylenyl group, a pyrenyl group, a chrysenyl group, a pyrrolyl group, a thiophenyl group, a furanyl group, an imidazolyl group, a pyrazolyl group, a thiazolyl group, an isothiazolyl group, an oxazolyl group, an isoxazolyl group, a pyridinyl group, a pyrazinyl group, a pyrimidinyl group, a pyridazinyl group, an isoindolyl group, an indolyl group, an indazolyl group, a quinolinyl group, an isoquinolinyl group, a carbazolyl group, a benzoquinolinyl group, a phthalazinyl group, a phenanthridinyl group, an acridinyl group, a phenanthrolinyl group, a phenazinyl group, a benzimidazolyl group, a benzofuranyl group, a benzothiophenyl group, an isobenzothiazolyl group, a benzooxazolyl group, an isobenzooxazolyl group, a triazolyl group, a tetrazolyl group, an oxadiazolyl group, a triazinyl group, dibenzofuranyl group, a dibenzothiophenyl group, a dibenzosilolyl group, a benzocarbazolyl group, and a dibenzocarbazolyl group; and a phenyl group, a naphthyl group, a fluorenyl group, a benzofluorenyl group, a dibenzofluorenyl group, a phenanthrenyl group, an anthracenyl group, a fluoranthenyl group, a triphenylenyl group, a pyrenyl group, a chrysenyl group, a pyrrolyl group, a thiophenyl group, a furanyl group, an imidazolyl group, a pyrazolyl group, a thiazolyl group, an isothiazolyl group, an oxazolyl group, an isoxazolyl group, a pyridinyl group, a pyrazinyl group, a pyrimidinyl group, a pyridazinyl group, an isoindolyl group, an indolyl group, an indazolyl group, a quinolinyl group, an isoquinolinyl group, a carbazolyl group, a benzoquinolinyl group, a phthalazinyl group, a phenanthridinyl group, an acridinyl group, a phenanthrolinyl group, a phenazinyl group, a benzimidazolyl group, a benzofuranyl group, a benzothiophenyl group, an isobenzothiazolyl group, a benzooxazolyl group, an isobenzooxazolyl group, a triazolyl group, a tetrazolyl group, an oxadiazolyl group, a triazinyl group, dibenzofuranyl group, a dibenzothiophenyl group, a dibenzosilolyl group, a benzocarbazolyl group, and a dibenzocarbazolyl group, each substituted with at least one selected from a deuterium, —F, —Cl, —Br, —I, a cyano group, a nitro group, a C1-C20 alkyl group, a phenyl group, and a naphthyl group, but they are not limited thereto.",
"In some embodiments, R11 and R12 in Formula 1 may be each independently selected from a phenyl group, a naphthyl group, a fluorenyl group, a benzofluorenyl group, a dibenzofluorenyl group, a phenanthrenyl group, an anthracenyl group, a fluoranthenyl group, a triphenylenyl group, a pyrenyl group, a chrysenyl group, a furanyl group, a thiophenyl group, a carbazolyl group, a benzofuranyl group, a benzothiophenyl group, dibenzofuranyl group, a dibenzothiophenyl group, a dibenzosilolyl group, a benzocarbazolyl group, and a dibenzocarbazolyl group; and a phenyl group, a naphthyl group, a fluorenyl group, a benzofluorenyl group, a dibenzofluorenyl group, a phenanthrenyl group, an anthracenyl group, a fluoranthenyl group, a triphenylenyl group, a pyrenyl group, a chrysenyl group, a furanyl group, a thiophenyl group, a carbazolyl group, a benzofuranyl group, a benzothiophenyl group, dibenzofuranyl group, a dibenzothiophenyl group, a dibenzosilolyl group, a benzocarbazolyl group, and a dibenzocarbazolyl group, each substituted with at least one selected from a deuterium, —F, —Cl, —Br, —I, a cyano group, a nitro group, a C1-C20 alkyl group, a phenyl group, and a naphthyl group, but they are not limited thereto.",
"In other embodiments, R11 and R12 in Formula 1 may be each independently selected from a group represented by any one of one of Formulae 4-1 to 4-9 below, but they are not limited thereto.",
"In Formulae 4-1 to 4-9, * indicates a binding site to a neighboring atom.",
"For example, R21 and R22 in Formula 2 may be each independently selected from a pyridyl group, a quinolinyl group, and an isoquinolinyl group, but they are not limited thereto.",
"In some embodiments, R21 and R22 in Formula 2 may be each independently selected from a group represented by any one of one of Formulae 5-1 to 5-17 below, but they are not limited thereto.",
"In Formulae 5-1 to 5-17, * indicates a binding site to a neighboring atom.",
"In some embodiments, R21 and R22 in Formula 2 may be each independently a group selected from Formulae 5-1, 5-2, 5-5, and 5-13, but they are not limited thereto.",
"In Formulae 5-1, 5-2, 5-5, and 5-13, * indicates a binding site to a neighboring atom.",
"b11, b12, b21 and b22 in Formula 1 and 2 respectively indicate the number of R11, R12, R21, and R22 and when each of b11, b12, b21, and b22 is 2 or 3, a plurality of R11, R12, R21, and R22 may be identical or different.",
"For example, R13, R14, R23, and R24 in Formulae 1 and 2 may be each independently selected from a hydrogen, a deuterium, —F, —Cl, —Br, —I, a cyano group, a nitro group, a methyl group, an ethyl group, n-a propyl group, iso-a propyl group, an n-butyl group, a sec-butyl group, iso-butyl group, a tert-butyl group, an n-pentyl group, an n-hexyl group, an n-heptyl group, an n-octyl group, a phenyl group, a pentalenyl group, an indenyl group, a naphthyl group, an azulenyl group, a heptalenyl group, an indacenyl group, acenaphthyl group, a fluorenyl group, a spiro-fluorenyl group, a benzofluorenyl group, a dibenzofluorenyl group, a phenalenyl group, a phenanthrenyl group, an anthracenyl group, a fluoranthenyl group, a triphenylenyl group, a pyrenyl group, a chrysenyl group, a naphthacenyl group, a picenyl group, a perylenyl group, a pentaphenyl group, a hexacenyl group, a pentacenyl group, a rubicenyl group, a coronenyl group, an ovalenyl group, a pyrrolyl group, a thiophenyl group, a furanyl group, an imidazolyl group, a pyrazolyl group, a thiazolyl group, an isothiazolyl group, an oxazolyl group, an isoxazolyl group, a pyridinyl group, a pyrazinyl group, a pyrimidinyl group, a pyridazinyl group, an isoindolyl group, an indolyl group, an indazolyl group, a purinyl group, a quinolinyl group, an isoquinolinyl group, a carbazolyl group, a benzoquinolinyl group, a phthalazinyl group, a naphthyridinyl group, a quinoxalinyl group, a quinazolinyl group, a cinnolinyl group, a phenanthridinyl group, an acridinyl group, a phenanthrolinyl group, a phenazinyl group, a benzimidazolyl group, a benzofuranyl group, a benzothiophenyl group, an isobenzothiazolyl group, a benzooxazolyl group, an isobenzooxazolyl group, a triazolyl group, a tetrazolyl group, an oxadiazolyl group, a triazinyl group, dibenzofuranyl group, a dibenzothiophenyl group, a dibenzosilolyl group, a benzocarbazolyl group, and a dibenzocarbazolyl group, but they are not limited thereto.",
"In some embodiments, R13, R14, R23, and R24 in Formulae 1 and 2 may be each independently selected from a hydrogen, a deuterium, —F, —Cl, —Br, —I, a cyano group, a nitro group, a methyl group, an ethyl group, n-a propyl group, iso-a propyl group, an n-butyl group, a sec-butyl group, iso-butyl group, a tert-butyl group, an n-pentyl group, an n-hexyl group, an n-heptyl group, and an n-octyl group, a group represented by one of Formulae 4-1 to 4-9 and a group represented by one of Formulae 5-1 to 5-17, but they are not limited thereto.",
"In Formulae 4-1 to 4-9 and 5-1 to 5-17, * indicates a binding site to a neighboring atom.",
"b13, b14, b23, and b24 in Formula 1 and 2 respectively indicate the number of R13, R14, R23, and R24, and when each of b13, b14, b23, and b24 is selected from 2, 3, and 4, a plurality of R13, R14, R23, and R24 may be identical or different.",
"For example, the first materials may be represented by any one of Formulae 1A and 1B below, and the second materials may be represented by Formula 2 below, but they are not limited thereto.",
"In Formulae 1A, 1B, and 2, L11, a11, R11 to R14, b11 to b14, L21, L22, a21, a22, R21 to R24, and b21 to b24 have already described above.",
"In some embodiments, the first materials may be represented by any one of Formulae 1A and 1B below, and the second materials may be represented by one of Formulae 2A to 2C below, but they are not limited thereto.",
"In Formulae 1A, 1B, and 2A to 2C, L11, a11, R11 to R14, b11 to b14, L21, L22, a21, a22, R22 to R24, and b22 to b24 have already described above.",
"In some embodiments, the first materials may be represented by any one of Formulae 1A-1 and 1B-1 below, and the second materials may be represented by one of Formulae 2A to 2C below, but they are not limited thereto.",
"In Formulae 1A-1, 1B-1, and 2A to 2C, L11, a11, R11 to R14, b11 to b14, L21, L22, a21, a22, R22 to R24, and b22 to b24 have already described above.",
"In some embodiments, the first materials may be selected from Compounds 100 to 263 below, and the second materials may be selected from Compounds 300 to 397, but they are not limited thereto.",
"The second materials represented by Formula 2 may have high electron mobility.",
"The first materials represented by Formula 1 may have higher efficiency in combination with an electron trapping dopant.",
"Generally, in order to stably trap excitons in an emission layer, stability of an electron transporting material may be considered.",
"The second materials represented by Formula 2 may have high stability, and a lifespan of an organic light-emitting device including the second materials may be improved.",
"Accordingly, an organic emitting device including the first materials represented by Formula 1 and the second materials represented by Formula 2 may have high efficiency and a long lifespan.",
"The organic layer 150 may further include a hole transport region 130 between the first electrode and the emission layer.",
"The organic layer 150 may further include an electron transport region 180 between the emission layer and the second electrode.",
"The hole transport region 130 may include at least one selected from a hole injection layer (HIL), a hole transport layer (HTL), a buffer layer, and an electron blocking layer (EBL), and the electron transport region 180 may include at least one selected from a buffer layer, an electron transport layer (ETL), and an electron injection layer (EIL), but they are not limited thereto.",
"The hole transport region 130 may have a single-layered structure formed of a single material, a single-layered structure formed of a plurality of different materials, or a multi-layered structure having a plurality of layers formed of a plurality of different materials.",
"For example, the hole transport region 130 may have a single-layered structure formed of a plurality of different materials, or a structure of hole injection layer/hole transport layer, a structure of hole injection layer/hole transport layer/buffer layer, a structure of hole injection layer/buffer layer, a structure of hole transport layer/buffer layer, or a structure of hole injection layer/hole transport layer/electron blocking layer, wherein layers of each structure are sequentially stacked from the first electrode 110 in this stated order, but are not limited thereto.",
"When the hole transport region 130 includes a hole injection layer, the hole injection layer may be formed on the first electrode 110 by using various methods, such as vacuum deposition, spin coating casting, a Langmuir-Blodgett (LB) method, ink-jet printing, laser-printing, or laser-induced thermal imaging.",
"When a hole injection layer is formed by vacuum deposition, for example, the vacuum deposition may be performed at a temperature of a deposition temperature of about 100 to about 500° C., at a vacuum degree of about 10−8 to about 10−3 torr, and at a deposition rate of about 0.01 to about 100 Å/sec, in consideration of a compound for a hole injection layer to be deposited, and the structure of a hole injection layer to be formed.",
"When a hole injection layer is formed by spin coating, the spin coating may be performed at a coating rate of about 2,000 rpm to about 5,000 rpm, and at a temperature of about 80° C. to 200° C., in consideration of a compound for a hole injection layer to be deposited, and the structure of a hole injection layer to be formed.",
"When the hole transport region 130 includes a hole transport layer, the hole transport layer may be formed on the first electrode 110 or the hole injection layer by using various methods, such as vacuum deposition, spin coating, casting, a LB method, ink-jet printing, laser-printing, or laser-induced thermal imaging.",
"When the hole transport layer is formed by vacuum deposition or spin coating, deposition and coating conditions for the hole transport layer may be determined by referring to the deposition and coating conditions for the hole injection layer.",
"The hole transport region 130 may include at least one selected from m-MTDATA, TDATA, 2-TNATA, NPB, 3-NPB, TPD, Spiro-TPD, Spiro-NPB, α-NPB, TAPC, HMTPD, 4,4′,4″-tris(N-carbazolyl)triphenylamine (TCTA), polyaniline/dodecylbenzenesulfonic acid (Pani/DBSA), poly(3,4-ethylenedioxythiophene)/poly(4-styrenesulfonate) (PEDOT/PSS), polyaniline/camphor sulfonicacid (Pani/CSA), (polyaniline)/poly(4-styrenesulfonate) (PANI/PSS), a compound represented by Formula 201 below, and a compound represented by Formula 202 below.",
"In Formulae 201 and 202, L201 to L205 may be each independently selected from a substituted or unsubstituted C3-C10 cycloalkylene, a substituted or unsubstituted C3-C10 heterocycloalkylene, a substituted or unsubstituted C3-C10 cycloalkenylene, a substituted or unsubstituted C3-C10 heterocycloalkenylene, a substituted or unsubstituted C6-C60 arylene, a substituted or unsubstituted C2-C60 heteroarylene, and a substituted or unsubstituted bivalent non-aromatic condensed polycyclic group, at least one of substituents of the substituted C3-C10 cycloalkylene, the substituted C3-C10 heterocycloalkylene, substituted C3-C10 cycloalkenylene, substituted C3-C10 heterocycloalkenylene, substituted C6-C60 arylene, substituted C2-C60 heteroarylene, and a substituted bivalent non-aromatic condensed polycyclic group may be selected from a deuterium, a halogen atom, a hydroxyl, a cyano, a nitro, an amino, an amidino, a hydrazine, a hydrazone, a carboxylic acid and a salt thereof, a sulfonic acid and a salt thereof, a phosphoric acid and a salt thereof, a C1-C60 alkyl, a C2-C60 alkenyl, a C2-C60 alkynyl, and a C1-C60 alkoxy; a C1-C60 alkyl, a C2-C60 alkenyl, a C2-C60 alkynyl, and a C1-C60 alkoxy, each substituted with at least one selected from a deuterium, a halogen atom, a hydroxyl, a cyano, a nitro, an amino, an amidino, a hydrazine, a hydrazone, a carboxylic acid and a salt thereof, a sulfonic acid and a salt thereof, a phosphoric acid and a salt thereof, a C3-C10 cycloalkyl, a C3-C10 heterocycloalkyl, a C3-C10 cycloalkenyl, a C3-C10 heterocycloalkenyl, a C6-C60 aryl, a C6-C60 aryloxy, a C6-C60 arylthio, a C2-C60 heteroaryl, a monovalent non-aromatic condensed polycyclic, a monovalent non-aromatic condensed heteropolycyclic, —N(Q201)(Q202), —Si(Q203)(Q204)(Q205), and —B(Q206)(Q207); a C3-C10 cycloalkyl group, a C3-C10 heterocycloalkyl group, a C3-C10 cycloalkenyl group, a C3-C10 heterocycloalkenyl group, a C6-C60 aryl group, a C6-C60 aryloxy group, a C6-C60 arythio group, a C2-C60 heteroaryl group, a monovalent non-aromatic condensed polycyclic group, and a monovalent non-aromatic condensed heteropolycyclic group; a C3-C10 cycloalkyl, a C3-C0 heterocycloalkyl, a C3-C10 cycloalkenyl, a C3-C10 heterocycloalkenyl, a C6-C60 aryl, a C6-C60 aryloxy, a C6-C60 arythio, a C2-C60 heteroaryl, a monovalent non-aromatic condensed polycyclic group, and a monovalent non-aromatic condensed heteropolycyclic group, each substituted with at least one selected from a deuterium, a halogen atom, a hydroxyl, a cyano, a nitro, an amino, an amidino, a hydrazine, a hydrazone, a carboxylic acid and a salt thereof, a sulfonic acid and a salt thereof, a phosphoric acid and a salt thereof, a C1-C60 alkyl, a C2-C60 alkenyl, a C2-C60 alkynyl, a C1-C60 alkoxy, a C3-C10 cycloalkyl, a C3-C10 heterocycloalkyl, a C3-C10 cycloalkenyl, a C3-C10 heterocycloalkenyl, a C6-C60 aryl, a C6-C60 aryloxy, a C6-C60 arythio, a C2-C60 heteroaryl, a monovalent non-aromatic condensed polycyclic group, a monovalent non-aromatic condensed heteropolycyclic group, —N(Q211)(Q212), —Si(Q213)(Q214)(Q215), and —B(Q216)(Q217); and —N(Q221)(Q222), —Si(Q223)(Q224)(Q225), and —B(Q226)(Q227), xa1 to xa4 may be each independently selected from 0, 1, 2, and 3; xa5 may be selected from 1, 2, 3, 4, and 5; and R201 to R204 may be each independently selected from a C1-C60 alkyl, a C2-C60 alkenyl, a C2-C60 alkynyl, and a C1-C60 alkoxy; a C1-C60 alkyl, a C2-C60 alkenyl, a C2-C60 alkynyl, and a C1-C60 alkoxy, each substituted with at least one selected from a deuterium, a halogen atom, a hydroxyl, a cyano, a nitro, an amino, an amidino, a hydrazine, a hydrazone, a carboxylic acid and a salt thereof, a sulfonic acid and a salt thereof, a phosphoric acid and a salt thereof, a C3-C10 cycloalkyl, a C3-C10 heterocycloalkyl, a C3-C10 cycloalkenyl, a C3-C10 heterocycloalkenyl, a C6-C60 aryl, a C6-C60 aryloxy, a C6-C60 arylthio, a C2-C60 heteroaryl, a monovalent non-aromatic condensed polycyclic, —N(Q231)(Q232), —Si(Q233)(Q234)(Q235), and —B(Q236)(Q237); a C3-C10 cycloalkyl group, a C3-C10 heterocycloalkyl group, a C3-C10 cycloalkenyl group, a C3-C10 heterocycloalkenyl group, a C6-C60 aryl group, a C6-C60 aryloxy group, a C6-C60 arythio group, a C2-C60 heteroaryl group, a monovalent non-aromatic condensed polycyclic group, and a monovalent non-aromatic condensed heteropolycyclic group; and a C3-C10 cycloalkyl, a C3-C10 heterocycloalkyl, a C3-C10 cycloalkenyl, a C3-C10 heterocycloalkenyl, a C6-C60 aryl, a C6-C60 aryloxy, a C6-C60 arythio, a C2-C60 heteroaryl, a monovalent non-aromatic condensed polycyclic group, and a monovalent non-aromatic condensed heteropolycyclic group, each substituted with at least one selected from a deuterium, a halogen atom, a hydroxyl, a cyano, a nitro, an amino, an amidino, a hydrazine, a hydrazone, a carboxylic acid and a salt thereof, a sulfonic acid and a salt thereof, a phosphoric acid and a salt thereof, a C1-C60 alkyl, a C2-C60 alkenyl, a C2-C60 alkynyl, a C1-C60 alkoxy, a C3-C10 cycloalkyl, a C3-C10 heterocycloalkyl, a C3-C10 cycloalkenyl, a C3-C10 heterocycloalkenyl, a C6-C60 aryl, a C6-C60 aryloxy, a C6-C60 arythio, a C2-C60 heteroaryl, a monovalent non-aromatic condensed polycyclic group, a monovalent non-aromatic condensed heteropolycyclic group, —N(Q241)(Q242), —Si(Q243)(Q244)(Q245), and —B(Q246)(Q247), Q201 to Q207, Q211 to Q217, Q221 to Q227, Q231 to Q237, and Q241 to Q247 may be each independently selected from: a hydrogen, a deuterium, a halogen atom, a hydroxyl group, a cyano group, a nitro group, an amino group, an amidino group, a hydrazine group, a hydrazone group, a carboxylic acid and a salt thereof, a sulfonic acid and a salt thereof, a phosphoric acid and a salt thereof, a C1-C60 alkyl group, a C2-C60 alkenyl group, a C2-C60 alkynyl group, and a C1-C60 alkoxy group; a C1-C60 alkyl group, a C2-C60 alkenyl group, a C2-C06 alkynyl group, and a C1-C60 alkoxy group, each substituted with at least one selected from a deuterium, a halogen atom, a hydroxyl group, a cyano group, a nitro group, an amino group, an amidino group, a hydrazine group, a hydrazone group, a carboxylic acid and a salt thereof, a sulfonic acid and a salt thereof, a phosphoric acid and a salt thereof, a C3-C10 cycloalkyl group, a C3-C10 heterocycloalkyl group, a C3-C10 cycloalkenyl group, a C3-C10 heterocycloalkenyl group, a C6-C60 aryl group, a C6-C60 aryloxy group, a C6-C60 arythio group, a C2-C60 heteroaryl group, a monovalent non-aromatic condensed polycyclic group, and a monovalent non-aromatic condensed heteropolycyclic group; a C3-C10 cycloalkyl group, a C3-C10 heterocycloalkyl group, a C3-C10 cycloalkenyl group, a C3-C10 heterocycloalkenyl group, a C6-C60 aryl group, a C6-C60 aryloxy group, a C6-C60 arythio group, a C2-C60 heteroaryl group, a monovalent non-aromatic condensed polycyclic group, and a monovalent non-aromatic condensed heteropolycyclic group; and a C3-C10 cycloalkyl group, a C3-C10 heterocycloalkyl group, a C3-C10 cycloalkenyl group, a C3-C10 heterocycloalkenyl group, a C6-C60 aryl group, a C6-C60 aryloxy group, a C6-C60 arythio group, a C2-C60 heteroaryl group, a monovalent non-aromatic condensed polycyclic group, and a monovalent non-aromatic condensed heteropolycyclic group, each substituted with at least one selected from a deuterium, a halogen atom, a hydroxyl group, a cyano group, a nitro group, an amino group, an amidino group, a hydrazine group, a hydrazone group, a carboxylic acid and a salt thereof, a sulfonic acid and a salt thereof, a phosphoric acid and a salt thereof, a C1-C60 alkyl group, a C2-C60 alkenyl group, a C2-C60 alkynyl group, a C1-C60 alkoxy group, a C3-C10 cycloalkyl group, a C3-C10 heterocycloalkyl group, a C3-C10 cycloalkenyl group, a C3-C10 heterocycloalkenyl group, a C6-C60 aryl group, a C6-C60 aryloxy group, a C6-C60 arythio group, a C2-C60 heteroaryl group, a monovalent non-aromatic condensed polycyclic group, and a monovalent non-aromatic condensed heteropolycyclic group.",
"wherein in Formulae 201 and 202, L201 to L205 may be each independently selected from: a phenylene, a naphthylenylene, a fluorenylene, a spiro-fluorenylene, a benzofluorenylene, a dibenzofluorenylene, a phenanthrenylene, an anthracenylene, a pyrenylene, a chrysenylene, a pyridinylene, a pyrazinylene, a pyrimidinylene, a pyridazinylene, a quinolinylene, an isoquinolinylene, a quinoxalinylene, a quinazolinylene, a carbazolylene, and a triazinylene; and a phenylene group, a naphthylenylene group, a fluorenylene group, a spiro-fluorenylene group, a benzofluorenylene group, a dibenzofluorenylene group, a phenanthrenylene group, an anthracenylene group, a pyrenylene group, a chrysenylene group, a pyridinylene group, a pyrazinylene group, a pyrimidinylene group, a pyridazinylene group, a quinolinylene group, a isoquinolinylene group, a quinoxalinylene group, a quinazolinylene group, a carbazolylene group, and a triazinylene group, each substituted with at least one selected from a deuterium, a halogen atom, a hydroxyl group, a cyano group, a nitro group, an amino group, an amidino group, a hydrazine group, a hydrazone group, a carboxyl group, and a salt thereof, a sulfonic acid, and a salt thereof, a phosphoric acid and a salt thereof, a C1-C20 alkyl group, a C1-C20 alkoxy group, a phenyl group, a naphthyl group, a fluorenyl group, a spiro-fluorenyl group, a benzofluorenyl group, a dibenzofluorenyl group, a phenanthrenyl group, an anthracenyl group, a pyrenyl group, a chrysenyl group, a pyridinyl group, a pyrazinyl group, a pyrimidinyl group, a pyridazinyl group, a isoindolyl group, a quinolinyl group, a isoquinolinyl group, a quinoxalinyl group, a quinazolinyl group, a carbazolyl group, and a triazinyl group; xa1 to xa4 may be each independently 0, 1, or 2; xa5 may be 1, 2, or 3; R201 to R205 may be each independently selected from a phenyl group, a naphthyl group, a fluorenyl group, a spiro-fluorenyl group, a benzofluorenyl group, a dibenzofluorenyl group, a phenanthrenyl group, an anthracenyl group, a pyrenyl group, a chrysenyl group, a pyridinyl group, a pyrazinyl group, a pyrimidinyl group, a pyridazinyl group, a quinolinyl group, an isoquinolinyl group, a quinoxalinyl group, a quinazolinyl group, a carbazolyl group, and a triazinyl group; and a phenyl group, a naphthyl group, a fluorenyl group, a spiro-fluorenyl group, a benzofluorenyl group, a dibenzofluorenyl group, a phenanthrenyl group, an anthracenyl group, a pyrenyl group, a chrysenyl group, a pyridinyl group, a pyrazinyl group, a pyrimidinyl group, a pyridazinyl group, a quinolinyl group, an isoquinolinyl group, a quinoxalinyl group, a quinazolinyl group, a carbazolyl group, and a triazinyl group, each substituted with at least one selected from a deuterium, a halogen atom, a hydroxyl group, a cyano group, a nitro group, an amino group, an amidino group, a hydrazine group, a hydrazone group, a carboxylic acid group or a salt thereof, a sulfonic acid or a salt thereof, a phosphoric acid or a salt thereof, a C1-C20 alkyl group, a C1-C20 alkoxy group, a phenyl group, a naphthyl group, a azulenyl group, a fluorenyl group, a spiro-fluorenyl group, a benzofluorenyl group, a dibenzofluorenyl group, a phenanthrenyl group, an anthracenyl group, a pyrenyl group, a chrysenyl group, a pyridinyl group, a pyrazinyl group, a pyrimidinyl group, a pyridazinyl group, a quinolinyl group, an isoquinolinyl group, a quinoxalinyl group, a quinazolinyl group, a carbazolyl group, and a triazinyl group, but are not limited thereto.",
"The compound represented by Formula 201 may be represented by Formula 201A.",
"For example, the compound represented by Formula 201 may be represented by Formula 201A-1 below, but is not limited thereto.",
"For example, the compound represented by Formula 202 may be represented by Formula 202A below, but is not limited thereto.",
"In Formulae 201A, 201A-1, and 202A, L201 to L203, xa1 to xa3, xa5 and R202 to R204 have already been described above, R211 and R212 may be understood by referring to the description provided in connection with R203, and R213 to R216 may be each independently selected from a hydrogen, a deuterium, a halogen atom, a hydroxyl group, cyano, nitro, amino, amidino, hydrazine, a hydrazine group, a carboxylic acid and a salt thereof, a sulfonic acid and a salt thereof, a phosphoric acid and a salt thereof, a C1-C60 alkyl, a C2-C60 alkenyl, a C2-C60 alkynyl, a C1-C60 alkoxy, a C3-C10 cycloalkyl, a C3-C10 heterocycloalkyl, a C3-C10 cycloalkenyl, a C3-C10 heterocycloalkenyl, a C6-C60 aryl, a C6-C60 aryloxy, a C6-C60 arylthio, a C2-C60 heteroaryl, and a non-aromatic condensed polycyclic group.",
"For example, in Formulae 201A, 201A-1, and 202A, L201 to L203 may be each independently selected from a phenylene, a naphthylenylene, a fluorenylene, a spiro-fluorenylene, a benzofluorenylene, a dibenzofluorenylene, a phenanthrenylene, an anthracenylene, a pyrenylene, a chrysenylene, a pyridinylene, a pyrazinylene, a pyrimidinylene, a pyridazinylene, a quinolinylene, an isoquinolinylene, a quinoxalinylene, a quinazolinylene, a carbazolylene, and a triazinylene; and a phenylene group, a naphthylenylene group, a fluorenylene group, a spiro-fluorenylene group, a benzofluorenylene group, a dibenzofluorenylene group, a phenanthrenylene group, an anthracenylene group, a pyrenylene group, a chrysenylene group, a pyridinylene group, a pyrazinylene group, a pyrimidinylene group, a pyridazinylene group, a quinolinylene group, a isoquinolinylene group, a quinoxalinylene group, a quinazolinylene group, a carbazolylene group, and a triazinylene group, each substituted with at least one selected from a deuterium, a halogen atom, a hydroxyl group, a cyano group, a nitro group, an amino group, an amidino group, a hydrazine group, a hydrazone group, a carboxyl group, and a salt thereof, a sulfonic acid, and a salt thereof, a phosphoric acid and a salt thereof, a C1-C20 alkyl group, a C1-C20 alkoxy group, a phenyl group, a naphthyl group, a fluorenyl group, a spiro-fluorenyl group, a benzofluorenyl group, a dibenzofluorenyl group, a phenanthrenyl group, an anthracenyl group, a pyrenyl group, a chrysenyl group, a pyridinyl group, a pyrazinyl group, a pyrimidinyl group, a pyridazinyl group, a quinolinyl group, a isoquinolinyl group, a quinoxalinyl group, a quinazolinyl group, a carbazolyl group, and a triazinyl group; xa1 to xa3 may be each independently 0 or 1; R203, R211, and R212 may be each independently selected from a phenyl group, a naphthyl group, a fluorenyl group, a spiro-fluorenyl group, a benzofluorenyl group, a dibenzofluorenyl group, a phenanthrenyl group, an anthracenyl group, a pyrenyl group, a chrysenyl group, a pyridinyl group, a pyrazinyl group, a pyrimidinyl group, a pyridazinyl group, a quinolinyl group, an isoquinolinyl group, a quinoxalinyl group, a quinazolinyl group, a carbazolyl group, and a triazinyl group; and a phenyl group, a naphthyl group, a fluorenyl group, a spiro-fluorenyl group, a benzofluorenyl group, a dibenzofluorenyl group, a phenanthrenyl group, an anthracenyl group, a pyrenyl group, a chrysenyl group, a pyridinyl group, a pyrazinyl group, a pyrimidinyl group, a pyridazinyl group, a quinolinyl group, an isoquinolinyl group, a quinoxalinyl group, a quinazolinyl group, a carbazolyl group, and a triazinyl group, each substituted with at least one selected from a deuterium, a halogen atom, a hydroxyl group, a cyano group, a nitro group, an amino group, an amidino group, a hydrazine group, a hydrazone group, a carboxylic acid group or a salt thereof, a sulfonic acid or a salt thereof, a phosphoric acid or a salt thereof, a C1-C20 alkyl group, a C1-C20 alkoxy group, a phenyl group, a naphthyl group, a fluorenyl group, a spiro-fluorenyl group, a benzofluorenyl group, a dibenzofluorenyl group, a phenanthrenyl group, an anthracenyl group, a pyrenyl group, a chrysenyl group, a pyridinyl group, a pyrazinyl group, a pyrimidinyl group, a pyridazinyl group, a quinolinyl group, an isoquinolinyl group, a quinoxalinyl group, a quinazolinyl group, a carbazolyl group, and a triazinyl group; R213 and R214 may be each independently selected from a C1-C20 alkyl and a C1-C20 alkoxy; a C1-C20 alkyl and a C1-C20 alkoxy, each substituted with at least one selected from a deuterium, a halogen atom, a hydroxyl group, a cyano group, a nitro group, an amino group, an amidino group, a hydrazine group, a hydrazone group, a carboxylic acid group or a salt thereof, a sulfonic acid or a salt thereof, a phosphoric acid or a salt thereof, a phenyl group, a naphthyl group, a fluorenyl group, a spiro-fluorenyl group, a benzofluorenyl group, a dibenzofluorenyl group, a phenanthrenyl group, an anthracenyl group, a pyrenyl group, a chrysenyl group, a pyridinyl group, a pyrazinyl group, a pyrimidinyl group, a pyridazinyl group, a quinolinyl group, an isoquinolinyl group, a quinoxalinyl group, a quinazolinyl group, a carbazolyl group, and a triazinyl group; a phenyl group, a naphthyl group, a fluorenyl group, a spiro-fluorenyl group, a benzofluorenyl group, a dibenzofluorenyl group, a phenanthrenyl group, an anthracenyl group, a pyrenyl group, a chrysenyl group, a pyridinyl group, a pyrazinyl group, a pyrimidinyl group, a pyridazinyl group, a quinolinyl group, an isoquinolinyl group, a quinoxalinyl group, a quinazolinyl group, a carbazolyl group, and a triazinyl group; and a phenyl, a naphthyl, a fluorenyl, a spiro-fluorenyl, a benzofluorenyl, a dibenzofluorenyl, a phenanthrenyl, an anthracenyl, a pyrenyl, a chrysenyl, a pyridinyl, a pyrazinyl, a pyrimidinyl, a pyridazinyl, a quinolinyl, an isoquinolinyl, a quinoxalinyl, a quinazolinyl, a carbazolyl, and a triazinyl, each substituted with at least one selected from a deuterium, a halogen atom, a hydroxyl, a cyano, a nitro, an amino, an amidino, a hydrazine, a hydrazone, a carboxylic acid or a salt thereof, a sulfonic acid or a salt thereof, a phosphoric acid or a salt thereof, a C1-C20 alkyl, a C1-C20 alkoxy, a phenyl, a naphthyl, a fluorenyl, a spiro-fluorenyl, a benzofluorenyl, a dibenzofluorenyl, a phenanthrenyl, an anthracenyl, a pyrenyl, a chrysenyl, a pyridinyl, a pyrazinyl, a pyrimidinyl, a pyridazinyl, a quinolinyl, an isoquinolinyl, a quinoxalinyl, a quinazolinyl, a carbazolyl, and a triazinyl; R215 and R216 may be each independently selected from a hydrogen, a deuterium, a halogen atom, a hydroxyl group, a cyano group, a nitro group, an amino group, an amidino group, a hydrazine group, a hydrazone group, a carboxylic acid group or a salt thereof, a sulfonic acid or a salt thereof, a phosphoric acid or a salt thereof, a C1-C20 alkyl and a C1-C20 alkoxy; a C1-C20 alkyl and a C1-C20 alkoxy, each substituted with at least one selected from a deuterium, a halogen atom, a hydroxyl group, a cyano group, a nitro group, an amino group, an amidino group, a hydrazine group, a hydrazone group, a carboxylic acid group or a salt thereof, a sulfonic acid or a salt thereof, a phosphoric acid or a salt thereof, a phenyl group, a naphthyl group, a fluorenyl group, a spiro-fluorenyl group, a benzofluorenyl group, a dibenzofluorenyl group, a phenanthrenyl group, an anthracenyl group, a pyrenyl group, a chrysenyl group, a pyridinyl group, a pyrazinyl group, a pyrimidinyl group, a pyridazinyl group, a quinolinyl group, an isoquinolinyl group, a quinoxalinyl group, a quinazolinyl group, a carbazolyl group, and a triazinyl group; a phenyl group, a naphthyl group, a fluorenyl group, a spiro-fluorenyl group, a benzofluorenyl group, a dibenzofluorenyl group, a phenanthrenyl group, an anthracenyl group, a pyrenyl group, a chrysenyl group, a pyridinyl grout, a pyrazinyl group, a pyrimidinyl group, a pyridazinyl group, a quinolinyl group, an isoquinolinyl group, a quinoxalinyl group, a quinazolinyl group, and a triazinyl group; and a phenyl, a naphthyl, a fluorenyl, a spiro-fluorenyl, a benzofluorenyl, a dibenzofluorenyl, a phenanthrenyl, an anthracenyl, a pyrenyl, a chrysenyl, a pyridinyl, a pyrazinyl, a pyrimidinyl, a pyridazinyl, a quinolinyl, an isoquinolinyl, a quinoxalinyl, a quinazolinyl, a carbazolyl, and a triazinyl, each substituted with at least one selected from a deuterium, a halogen atom, a hydroxyl, a cyano, a nitro, an amino, an amidino, a hydrazine, a hydrazone, a carboxylic acid or a salt thereof, a sulfonic acid or a salt thereof, a phosphoric acid or a salt thereof, a C1-C20 alkyl, a C1-C20 alkoxy, a phenyl, a naphthyl, a fluorenyl, a spiro-fluorenyl, a benzofluorenyl, a dibenzofluorenyl, a phenanthrenyl, an anthracenyl, a pyrenyl, a chrysenyl, a pyridinyl, a pyrazinyl, a pyrimidinyl, a pyridazinyl, a quinolinyl, an isoquinolinyl, a quinoxalinyl, a quinazolinyl, a carbazolyl, and a triazinyl; and xa5 is 1 or 2.R213 and R214 in Formulae 201A, and 201A-1 may bind to each other to form a saturated or unsaturated ring.",
"The compound represented by Formula 201, and the compound represented by Formula 202 may each include compounds HT1 to HT20 illustrated below, but are not limited thereto.",
"A thickness of the hole transport region 130 may be in a range of about 100 Å to about 10,000 Å, e.g., about 100 Å to about 1000 Å.",
"When the hole transport region 130 includes both a hole injection layer and a hole transport layer, a thickness of the hole injection layer may be in a range of about 100 Å to about 10000 Å, e.g., about 100 Å to about 1000 Å, and a thickness of the hole transport layer may be in a range of about 50 Å to about 2000 Å, e.g., about 100 Å to about 1500 Å.",
"When the thicknesses of the hole transport region 130, the hole injection layer, and the hole transport layer are within these ranges, satisfactory hole transporting characteristics may be obtained without a substantial increase in driving voltage.",
"The hole transport region 130 may further include, in addition to these materials, a charge-generation material for the improvement of conductive properties.",
"The charge-generation material may be homogeneously or non-homogeneously dispersed in the hole transport region 130.The charge-generation material may be, e.g., a p-dopant.",
"The p-dopant may be one of a quinone derivative, a metal oxide, and a cyano group-containing compound, but is not limited thereto.",
"For example, non-limiting examples of the p-dopant are a quinone derivative, such as tetracyanoquinonedimethane (TCNQ) or 2,3,5,6-tetrafluoro-tetracyano-1,4-benzoquinonedimethane (F4-TCNQ); a metal oxide, such as a tungsten oxide or a molybdenum oxide, and Compound HT-D1 illustrated below, but are not limited thereto.",
"The hole transport region 130 may further include, in addition to the hole injection layer and the hole transport layer, at least one of a buffer layer and an electron blocking layer.",
"The buffer layer may compensate for an optical resonance distance according to a wavelength of light emitted from the emission layer, and light-emission efficiency of a formed organic light-emitting device may be improved.",
"For use as a material included in the buffer layer, materials that are included in the hole transport region 130 may be used.",
"The electron blocking layer may help prevent injection of electrons from the electron transport region 130.An emission layer may be formed on the first electrode 110 or the hole transport region 130 by using various methods, such as vacuum deposition, spin coating, casting, a LB method, ink-jet printing, laser-printing, or laser-induced thermal imaging.",
"When the emission layer is formed by vacuum deposition or spin coating, deposition and coating conditions for the emission layer may be determined by referring to the deposition and coating conditions for the hole injection layer.",
"When the organic light-emitting device 10 is a full color organic light-emitting device, the emission layer may be patterned into a red emission layer, a green emission layer, or a blue emission layer, according to a sub pixel.",
"In some embodiments, the emission layer may have a stacked structure of a red emission layer, a green emission layer, and a blue emission layer, or may include a red-light emission material, a green-light emission material, and a blue-light emission material, which are mixed with each other in a single layer, to emit white light.",
"According to another embodiment, the emission layer may be a white emission layer, and may further include a color converting layer or a color filter to turn white light into light of a desired color.",
"The emission layer may include a host and a dopant.",
"The host may include at least one first material represented by Formula 1.The dopant may be at least one selected from a fluorescent dopant and a phosphorescent dopant.",
"The fluorescent dopant may include a compound represented by Formula 501 below.",
"In Formula 501, Ar501 may be selected from: a naphthalene, a heptalene, a fluorenene, a spiro-fluorene, a benzofluorene, a dibenzofluorene, a phenalene, a phenanthrene, an anthracene, a fluoranthene, a triphenylene, a pyrene, a chrysene, a naphthacene, a picene, a perylene, a pentaphene, and an indenoanthracene; and a naphthalene, a heptalene, a fluorenene, a spiro-fluorene, a benzofluorene, a dibenzofluorene, a phenalene, a phenanthrene, an anthracene, a fluoranthene, a triphenylene, a pyrene, a chrysene, a naphthacene, a picene, a perylene, a pentaphene, and an indenoanthracene, each substituted with at least one selected from a deuterium, —F, —Cl, —Br, —I, a hydroxyl, a cyano, a nitro, an amino, an amidino, a hydrazine, a hydrazone, a carboxylic acid and a salt thereof, a sulfonic acid and a salt thereof, a phosphoric acid and a salt thereof, a C1-C60 alkyl, a C2-C60 alkenyl, a C2-C60 alkynyl, a C1-C60 alkoxy, a C3-C10 cycloalkyl, a C3-C10 heterocycloalkyl, a C3-C10 cycloalkenyl, a C3-C10 heterocycloalkenyl, a C6-C60 aryl, a C6-C60 aryloxy, a C6-C60 arylthio, a C2-C60 heteroaryl, a monovalent non-aromatic condensed polycyclic group, a monovalent non-aromatic condensed heteropolycyclic group, and —Si(Q501)(Q502)(Q503) (Q501 to Q503 may be each independently selected from a hydrogen, a C1-C60 alkyl, a C2-C60 alkenyl, a C6-C60 aryl, and a C2-C60 heteroaryl); L501 to L503 may be understood by referring to the description provided herein in connection with L201; R501 and R502 may be each independently selected from a phenyl group, a naphthyl group, a fluorenyl group, a spiro-fluorenyl group, a benzofluorenyl group, a dibenzofluorenyl group, a phenanthrenyl group, an anthracenyl group, a pyrenyl group, a chrysenyl group, a pyridinyl group, a pyrazinyl group, a pyrimidinyl group, a pyridazinyl group, a quinolinyl group, an isoquinolinyl group, a quinoxalinyl group, a quinazolinyl group, a carbazolyl group, a triazinyl group, a dibenzofuranyl group, and a dibenzothiophenyl group; and a phenyl, a naphthyl, a fluorenyl, a spiro-fluorenyl, a benzofluorenyl, a dibenzofluorenyl, a pyridinyl, a pyrazinyl, a pyrimidinyl, a pyridazinyl, a quinolinyl, an isoquinolinyl, a quinoxalinyl, a quinazolinyl, a carbazolyl, and a triazinyl, each substituted with at least one selected from a deuterium, a halogen atom, a hydroxyl, a cyano, a nitro, an amino, an amidino, a hydrazine, a hydrazone, a carboxylic acid or a salt thereof, a sulfonic acid or a salt thereof, a phosphoric acid or a salt thereof, a C1-C20 alkyl, a C1-C20 alkoxy, a phenyl, a naphthyl, a fluorenyl, a spiro-fluorenyl, a benzofluorenyl, a dibenzofluorenyl, a phenanthrenyl, an anthracenyl, a pyrenyl, a chrysenyl, a pyridinyl, a pyrazinyl, a pyrimidinyl, a pyridazinyl, a quinolinyl, an isoquinolinyl, a quinoxalinyl, a quinazolinyl, a carbazolyl, a triazinyl, a dibenzofuranyl, and a dibenzothiophenyl; and xd1 to xd3 may be each independently selected from 0, 1, 2, and 3; and xd4 may be selected from 1, 2, 3, and 4.The fluorescent dopant may include at least one of Compounds FD1 to FD8: An amount of the dopant in the emission layer may be, e.g., in a range of about 0.01 to about 15 parts by weight based on 100 parts by weight of the host, but is not limited thereto.",
"A thickness of the emission layer may be in a range of about 100 Å to about 1,000 Å, e.g., about 200 Å to about 600 Å.",
"When the thickness of the emission layer is within this range, excellent light-emission characteristics may be obtained without a substantial increase in driving voltage.",
"Then, the electron transport region 180 may be disposed on the emission layer.",
"The electron transport region 180 may include at least one selected from a buffer layer, an electron transport layer (ETL), and an electron injection layer, but is not limited thereto.",
"For example, the electron transport region 180 may have an electron transport layer alone, a structure of electron transport layer/electron injection layer, or a structure of buffer layer/electron transport layer/electron injection layer, wherein layers of each structure are sequentially stacked from the emission layer in this stated order, but is not limited thereto.",
"The electron transport region 180 may include a buffer layer.",
"The buffer layer may be formed, when the emission layer includes a phosphorescent dopant, to help prevent diffusion of excitons or holes into an electron transport layer.",
"When the electron transport region 180 includes the buffer layer, the buffer layer may be formed on the emission layer by using various methods, such as vacuum deposition, spin coating casting, a Langmuir-Blodgett (LB) method, ink-jet printing, laser-printing, or laser-induced thermal imaging.",
"When the buffer layer is formed by vacuum deposition or spin coating, deposition and coating conditions for the buffer layer may be determined by referring to the deposition and coating conditions for the hole injection layer.",
"In an implementation, the buffer layer may include, e.g., at least one second material represented by Formula 2.A thickness of the buffer layer may be in a range of about 20 Å to about 1,000 Å, e.g., about 30 Å to about 300 Å.",
"When the thickness of the hole blocking layer is within these ranges, the hole blocking layer may have excellent hole blocking characteristics without a substantial increase in driving voltage.",
"The electron transport region 180 may include an electron transport layer.",
"The electron transport layer may be formed on the emission layer or the buffer layer by using various methods, e.g., vacuum deposition, spin coating casting, a LB method, ink-jet printing, laser-printing, or laser-induced thermal imaging.",
"When an electron transport layer is formed by vacuum deposition or spin coating, deposition and coating conditions for the electron transport layer may be determined by referring to the deposition and coating conditions for the hole injection layer.",
"The electron transport layer may include at least one selected from a second material represented by Formula 2, BCP, Bphen, Alq3, Balq, TAZ, NTAZ, and a compound represented by Formula 601 below.",
"Ar601-[(L601)xe1-E601]xe2 In Formula 601, Ar601 may be selected from a naphthalene, a heptalene, a fluorenene, a spiro-fluorene, a benzofluorene, a dibenzofluorene, a phenalene, a phenanthrene, an anthracene, a fluoranthene, a triphenylene, a pyrene, a chrysene, a naphthacene, a picene, a perylene, a pentaphene, and an indenoanthracene; and a naphthalene, a heptalene, a fluorenene, a spiro-fluorene, a benzofluorene, a dibenzofluorene, a phenalene, a phenanthrene, an anthracene, a fluoranthene, a triphenylene, a pyrene, a chrysene, a naphthacene, a picene, a perylene, a pentaphene, and an indenoanthracene, each substituted with at least one selected from a deuterium, a halogen atom, a hydroxyl, a cyano group, a nitro group, an amino, an amidino, a hydrazine, a hydrazone, a carboxylic acid and a salt thereof, a sulfonic acid and a salt thereof, a phosphoric acid and a salt thereof, a C1-C60 alkyl, a C2-C60 alkenyl, a C2-C60 alkynyl, a C1-C60 alkoxy, a C3-C10 cycloalkyl, a C3-C10 heterocycloalkyl, a C3-C10 cycloalkenyl, a C3-C10 heterocycloalkenyl, a C6-C60 aryl, a C6-C60 aryloxy, a C2-C60 arylthio, a C2-C60 heteroaryl, a non-aromatic condensed polycyclic group, and —Si(Q301)(Q302)(Q303) (Q301 to Q303 may be each independently selected from a hydrogen, a C1-C60 alkyl, a C2-C60 alkenyl, a C6-C60 aryl, and a C2-C60 heteroaryl); L601 may be understood by referring to the description provided in connection with L201; E601 may be selected from a pyrrolyl group, a thiophenyl group, a furanyl group, an imidazolyl group, a pyrazolyl group, a thiazolyl group, an isothiazolyl group, an oxazolyl group, an isoxazolyl group, a pyridinyl group, a pyrazinyl group, a pyrimidinyl group, a pyridazinyl group, an isoindolyl group, an indolyl group, an indazolyl group, a purinyl group, a quinolinyl group, an isoquinolinyl group, a benzoquinolinyl group, a phthalazinyl group, a naphthyridinyl group, a quinoxalinyl group, a quinazolinyl group, a cinnolinyl group, a carbazolyl group, a phenanthridinyl group, an acridinyl group, a phenanthrolinyl group, a phenazinyl group, a benzimidazolyl group, a benzofuranyl group, a benzothiophenyl group, an isobenzothiazolyl group, a benzooxazolyl group, an isobenzooxazolyl group, a triazolyl group, a tetrazolyl group, an oxadiazolyl group, a triazinyl group, a dibenzofuranyl group, a dibenzothiophenyl group, a benzocarbazolyl group, and a dibenzocarbazolyl group; and a pyrrolyl group, a thiophenyl group, a furanyl group, a imidazolyl group, a pyrazolyl group, a thiazolyl group, a isothiazolyl group, a oxazolyl group, a isoxazolyl group, a pyridinyl group, a pyrazinyl group, a pyrimidinyl group, a pyridazinyl group, a isoindolyl group, a indolyl group, a indazolyl group, a purinyl group, a quinolinyl group, a isoquinolinyl group, a benzoquinolinyl group, a phthalazinyl group, a naphthyridinyl group, a quinoxalinyl group, a quinazolinyl group, a cinnolinyl group, a carbazolyl group, a phenanthridinyl group, a acridinyl group, a phenanthrolinyl group, a phenazinyl group, a benzimidazolyl group, a benzofuranyl group, a benzothiophenyl group, a isobenzothiazolyl group, a benzooxazolyl group, a isobenzooxazolyl group, a triazolyl group, a tetrazolyl group, a oxadiazolyl group, a triazinyl group, a dibenzofuranyl group, a dibenzothiophenyl group, a benzocarbazolyl group, and a dibenzocarbazolyl group, each substituted with at least one selected from a deuterium, a halogen atom, a hydroxyl group, a cyano group, a nitro group, an amino group, an amidino group, a hydrazine group, a hydrazone group, a carboxylic acid group or a salt thereof, a sulfonic acid or a salt thereof, a phosphoric acid or a salt thereof, a C1-C20 alkyl group, a C1-C20 alkoxy group, a phenyl group, a pentalenyl group, a indenyl group, a naphthyl group, a azulenyl group, a heptalenyl group, a indacenyl group, a acenaphthyl group, a fluorenyl group, a spiro-fluorenyl group, a benzofluorenyl group, a dibenzofluorenyl group, a phenalenyl group, a phenanthrenyl group, an anthracenyl group, a fluorantenyl group, a triphenylenyl group, a pyrenyl group, a chrysenyl group, a naphthacenyl group, a pycenyl group, a perylenyl group, a pentaphenyl group, a hexacenyl group, a pentacenyl group, a rubicenyl group, a coronenyl group, a ovalenyl group, a pyrrolyl group, a thiophenyl group, a furanyl group, a imidazolyl group, a pyrazolyl group, a thiazolyl group, a isothiazolyl group, a oxazolyl group, a isoxazolyl group, a pyridinyl group, a pyrazinyl group, a pyrimidinyl group, a pyridazinyl group, a isoindolyl group, a indolyl group, a indazolyl group, a purinyl group, a quinolinyl group, a isoquinolinyl group, a benzoquinolinyl group, a phthalazinyl group, a naphthyridinyl group, a quinoxalinyl group, a quinazolinyl group, a cinnolinyl group, a carbazolyl group, a phenanthridinyl group, a acridinyl group, a phenanthrolinyl group, a phenazinyl group, a benzimidazolyl group, a benzofuranyl group, a benzothiophenyl group, a isobenzothiazolyl group, a benzooxazolyl group, a isobenzooxazolyl group, a triazolyl group, a tetrazolyl group, a oxadiazolyl group, a triazinyl group, a dibenzofuranyl group, and a dibenzothiophenyl group; and xe1 may be selected from 0, 1, 2, and 3; and xe2 may be selected from 1, 2, 3, and 4.In some embodiments, the electron transport layer may further include at least one of compounds represented by Formula 602 below.",
"In Formula 602, X611 may be N or C-(L611)xe611-R611, X612 may be N or C-(L612)xe612-R612, X613 may be N or C-(L613)xe13-R613, and at least one of X611 to X613 may be N; L611 to L616 may be understood by referring to the description provided herein in connection with L201; R611 and R616 may be each independently selected from a phenyl group, a naphthyl group, a fluorenyl group, a spiro-fluorenyl group, a benzofluorenyl group, a dibenzofluorenyl group, a phenanthrenyl group, an anthracenyl group, a pyrenyl group, a chrysenyl group, a pyridinyl group, a pyrazinyl group, a pyrimidinyl group, a pyridazinyl group, a quinolinyl group, an isoquinolinyl group, a quinoxalinyl group, a quinazolinyl group, a carbazolyl group, and a triazinyl group; and a phenyl group, a naphthyl group, a fluorenyl group, a spiro-fluorenyl group, a benzofluorenyl group, a dibenzofluorenyl group, a phenanthrenyl group, an anthracenyl group, a pyrenyl group, a chrysenyl group, a pyridinyl group, a pyrazinyl group, a pyrimidinyl group, a pyridazinyl group, a quinolinyl group, a isoquinolinyl group, a quinoxalinyl group, a quinazolinyl group, a carbazolyl group, and a triazinyl group, each substituted with at least one selected from a deuterium, a halogen atom, a hydroxyl group, a cyano group, a nitro group, an amino group, an amidino group, a hydrazine group, a hydrazone group, a carboxylic acid group or a salt thereof, a sulfonic acid or a salt thereof, a phosphoric acid or a salt thereof, a C1-C20 alkyl group, a C1-C20 alkoxy group, a phenyl group, a naphthyl group, an azulenyl group, a fluorenyl group, a spiro-fluorenyl group, a benzofluorenyl group, a dibenzofluorenyl group, a phenanthrenyl group, an anthracenyl group, a pyrenyl group, a chrysenyl group, a pyridinyl group, a pyrazinyl group, a pyrimidinyl group, a pyridazinyl group, a quinolinyl group, a isoquinolinyl group, a quinoxalinyl group, a quinazolinyl group, a carbazolyl group, and a triazinyl group; and xe611 to xe616 may be each independently selected from 0, 1, 2, and 3.The compound represented by Formula 601 and the compound represented by Formula 602 may include at least one of Compounds ET1 to ET15 illustrated below.",
"A thickness of the electron transport layer may be in a range of about 100 Å to about 1,000 Å, e.g., about 150 Å to about 500 Å.",
"When the thickness of the electron transport layer is within the range described above, the electron transport layer may have satisfactory electron transport characteristics without a substantial increase in driving voltage.",
"In an implementation, the electron transport layer may further include, in addition to the materials described above, a metal-containing material.",
"The metal-containing material may include a Li complex.",
"The Li complex may include, e.g., Compound ET-D1 (lithium quinolate, LiQ) or ET-D2.The electron transport region 180 may include an electron injection layer that allows electrons to be easily provided from the second electrode 190.The electron injection layer may be formed on the electron transport layer by using various methods, such as vacuum deposition, spin coating casting, a LB method, ink-jet printing, laser-printing, or laser-induced thermal imaging.",
"When an electron injection layer is formed by vacuum deposition or spin coating, deposition and coating conditions for the electron injection layer may be determined by referring to the deposition and coating conditions for the hole injection layer.",
"The electron injection layer may include at least one selected from, LiF, NaCl, CsF, Li2O, BaO, and LiQ.",
"A thickness of the electron injection layer may be in a range of about 1 Å to about 100 Å, e.g., about 3 Å to about 90 Å.",
"When the thickness of the electron injection layer is within the range described above, the electron injection layer may have satisfactory electron injection characteristics without a substantial increase in driving voltage.",
"The second electrode 190 may be disposed on the organic layer 150 having such a structure.",
"The second electrode 190 may be a cathode, which is an electron injection electrode, and in this regard, a material for the second electrode 190 may include a metal, an alloy, an electrically conductive compound, and a mixture thereof, which have a relatively low work function.",
"Detailed examples of the second electrode 190 may include lithium (Li), magnesium (Mg), aluminum (Al), aluminum-lithium (Al—Li), calcium (Ca), magnesium-indium (Mg—In), or magnesium-silver (Mg—Ag).",
"According to another embodiment, the material for forming the second electrode 190 may include ITO or IZO.",
"The second electrode 190 may be a reflective electrode, a semi-transmissive electrode, or a transmissive electrode.",
"Hereinbefore, the organic light-emitting device has been described with reference to FIG.",
"1, but is not limited thereto.",
"A C1-C60 alkyl group used herein refers to a linear or branched aliphatic hydrocarbon monovalent group having 1 to 60 carbon atoms, and detailed examples thereof are a methyl group, an ethyl group, a propyl group, an isobutyl group, a sec-butyl group, a ter-butyl group, a pentyl group, an iso-amyl group, and a hexyl group.",
"A C1-C60 alkylene group used herein refers to a divalent group having the same structure as the C1-C60 alkyl group.",
"A C1-C60 alkoxy group used herein refers to a monovalent group represented by —OA101 (wherein A101 is the C1-C60 alkyl group), and detailed examples thereof are a methoxy group, an ethoxy group, and an isopropyloxy group.",
"A C2-C60 alkenyl group used herein refers to a hydrocarbon group formed by substituting at least one carbon double bond in the middle or terminal of the C2-C60 alkyl group, and detailed examples thereof are an ethenyl group, a prophenyl group, and a butenyl group.",
"A C2-C60 alkenylene group used herein refers to a divalent group having the same structure as the C2-C60 alkenyl group.",
"A C2-C60 alkynyl group used herein refers to a hydrocarbon group formed by substituting at least one carbon triple bond in the middle or terminal of the C2-C60 alkyl group, and detailed examples thereof are an ethynyl group, and a propynyl group.",
"A C2-C60 alkynylene group used herein refers to a divalent group having the same structure as the C2-C60 alkynyl group.",
"A C3-C10 cycloalkyl group used herein refers to a monovalent hydrocarbon monocyclic group having 3 to 10 carbon atoms, and detailed examples thereof are a cyclopropyl group, a cyclobutyl group, a cyclopentyl group, a cyclohexyl group, and a cycloheptyl group.",
"A C3-C10 cycloalkylene group used herein refers to a divalent group having the same structure as the C3-C10 cycloalkyl group.",
"A C2-C10 heterocycloalkyl group used herein refers to a monovalent monocyclic group having at least one hetero atom selected from N, O, P, and S as a ring-forming atom and 2 to 10 carbon atoms, and detailed examples thereof are a tetrahydrofuranyl group, and a tetrahydrothiophenyl group.",
"A C2-C10 heterocycloalkylene group used herein refers to a divalent group having the same structure as the C2-C10 heterocycloalkyl group.",
"A C3-C10 cycloalkenyl group used herein refers to a monovalent monocyclic group that has 3 to 10 carbon atoms and at least one double bond in the ring thereof and does not have aromacity, and detailed examples thereof are a cyclopentenyl group, a cyclohexenyl group, and a cycloheptenyl group.",
"A C3-C10 cycloalkenylene group used herein refers to a divalent group having the same structure as the C3-C10 cycloalkenyl group.",
"A C2-C10 heterocycloalkenyl group used herein refers to a monovalent monocyclic group that has at least one hetero atom selected from N, O, P, and S as a ring-forming atom, 2 to 10 carbon atoms, and at least one double bond in its ring.",
"Detailed examples of the C2-C10 heterocycloalkenyl group are a 2,3-hydrofuranyl group and a 2,3-hydrothiophenyl group.",
"A C2-C10 heterocycloalkenylene group used herein refers to a divalent group having the same structure as the C2-C10 heterocycloalkenyl group.",
"A C6-C60 aryl group used herein refers to a monovalent group having a carbocyclic aromatic system having 6 to 60 carbon atoms, and a C6-C60 arylene group used herein refers to a divalent group having a carbocyclic aromatic system having 6 to 60 carbon atoms.",
"Detailed examples of the C6-C60 aryl group are a phenyl group, a naphthyl group, an anthracenyl group, a phenanthrenyl group, a pyrenyl group, and a chrysenyl group.",
"When the C6-C60 aryl group and the C6-C60 arylene group each include two or more rings, the rings may be fused to each other.",
"A C2-C60 heteroaryl group used herein refers to a monovalent group having a carboncyclic aromatic system that has at least one hetero atom selected from N, O, P, and S as a ring-forming atom, and 2 to 60 carbon atoms.",
"A C2-C60 heteroarylene group used herein refers to a divalent group having a carbocyclic aromatic system that has at least one hetero atom selected from N, O, P, and S as a ring-forming atom, and 2 to 60 carbon atoms.",
"Examples of the C2-C60 heteroaryl group are a pyridinyl group, a pyrimidinyl group, a pyrazinyl group, a pyridazinyl group, a triazinyl group, a quinolinyl group, and an isoquinolinyl group.",
"When the C2-C60 heteroaryl group and the C2-C60 heteroarylene group each include two or more rings, the rings may be fused to each other.",
"A C6-C60 aryloxy group used herein indicates —OA102 (wherein A102 is the C6-C60 aryl group), and a C6-C60 arylthio group indicates —SA103 (wherein A103 is the C6-C60 aryl group).",
"A monovalent non-aromatic condensed polycyclic group used herein refers to a momovalent group that has two or more rings condensed to each other, only carbon atoms (for example, the number of carbon atoms may be in a range of 8 to 60) as a ring forming atom, and non-aromacity in the entire molecular structure.",
"An example of the monovalent non-aromatic condensed polycyclic group is a fluorenyl group.",
"A divalent non-aromatic condensed polycyclic group used herein refers to a divalent group having the same structure as the monovalent non-aromatic condensed polycyclic group.",
"A monovalent non-aromatic condensed heteropolycyclic group used herein refers to a momovalent group that has two or more rings condensed to each other, has a heteroatom selected from N, O P, and S, other than carbon atoms (for example, the number of carbon atoms may be in a range of 2 to 60), as a ring forming atom, and has non-aromacity in the entire molecular structure.",
"An example of the monovalent non-aromatic condensed heteropolycyclic group is a carbazolyl group.",
"A divalent non-aromatic condensed heteropolycyclic group used herein refers to a divalent group having the same structure as the monovalent non-aromatic condensed heteropolycyclic group.",
"The term “Ph” used herein refers to phenyl group, the term “Me” used herein refers to methyl group, the term “Et” used herein refers to ethyl group, and the term “ter-Bu” or “But” used herein refers to tert-butyl.",
"Hereinafter, an organic light-emitting device according to an embodiment will be described in detail with reference to Synthesis Examples and Examples.",
"The wording “B was used instead of A” used in describing Synthesis Examples means that a molar equivalent of A was identical to a molar equivalent of B.",
"The following Examples and Comparative Examples are provided in order to highlight characteristics of one or more embodiments, but it will be understood that the Examples and Comparative Examples are not to be construed as limiting the scope of the embodiments, nor are the Comparative Examples to be construed as being outside the scope of the embodiments.",
"Further, it will be understood that the embodiments are not limited to the particular details described in the Examples and Comparative Examples.",
"EXAMPLE Example 1 An anode was prepared by cutting a Corning 15 Ωcm2 (1,200 Å) ITO glass substrate to a size of 50 mm×50 mm×0.7 mm, ultrasonically cleaning the glass substrate by using isopropyl alcohol and pure water for 5 minutes each, and then irradiating UV light for 30 minutes thereto and exposing to ozone to clean.",
"Then, the anode was loaded into a vacuum deposition apparatus.",
"Compound HT13 was vacuum deposited on the substrate to form a hole injection layer having a thickness of 500 Å.",
"Then, compound HT3, which is a hole transportable compound, was vacuum deposited thereon to form a hole transport layer having a thickness of 450 Å.",
"Then, Compound 100A and FD1 were co-deposited at a ratio of 95:5 to form an emission layer having a thickness of 300 Å.",
"Then, Compound 200B was deposited on the emission layer to form an electron transport layer having a thickness of 250 Å.",
"Then, LiF, which is a halogenated alkali metal, was deposited on the electron transport layer to form an electron injection layer having a thickness of 10 Å. Al was vacuum deposited thereon to a thickness of 1500 Å (cathode), thereby completing the manufacturing of an organic light-emitting device.",
"Example 2 An organic light-emitting device was manufactured in the same manner as in Example 1, except that in forming an electron transport layer, Compound 201B was used instead of Compound 200B.",
"Example 3 An organic light-emitting device was manufactured in the same manner as in Example 1, except that in forming an electron transport layer, Compound 202B was used instead of Compound 200B.",
"Example 4 An organic light-emitting device was manufactured in the same manner as in Example 1, except that in forming an electron transport layer, Compound 203B was used instead of Compound 200B.",
"Example 5 An organic light-emitting device was manufactured in the same manner as in Example 1, except that in forming an electron transport layer, Compound 204B was used instead of Compound 200B.",
"Example 6 An organic light-emitting device was manufactured in the same manner as in Example 1, except that in forming an electron transport layer, Compound 205B was used instead of Compound 200B.",
"Example 7 An organic light-emitting device was manufactured in the same manner as in Example 1, except that in forming an electron transport layer, Compound 206B was used instead of Compound 200B.",
"Example 8 An organic light-emitting device was manufactured in the same manner as in Example 1, except that in forming an electron transport layer, Compound 207B was used instead of Compound 200B.",
"Example 9 An organic light-emitting device was manufactured in the same manner as in Example 1, except that in forming an emission layer, Compound 101A was used instead of Compound 100A, and in forming an electron transport layer, Compound 201B was used instead of Compound 200B.",
"Example 10 An organic light-emitting device was manufactured in the same manner as in Example 1, except that in forming an emission layer, Compound 102A was used instead of Compound 100A, and in forming an electron transport layer, Compound 201B was used instead of Compound 200B.",
"Example 11 An organic light-emitting device was manufactured in the same manner as in Example 1, except that in forming an emission layer, Compound 103A was used instead of Compound 100A, and in forming an electron transport layer, Compound 201B was used instead of Compound 200B.",
"Example 12 An organic light-emitting device was manufactured in the same manner as in Example 1, except that in forming an emission layer, Compound 104A was used instead of Compound 100A, and in forming an electron transport layer, Compound 201B was used instead of Compound 200B.",
"Example 13 An organic light-emitting device was manufactured in the same manner as in Example 1, except that in forming an emission layer, Compound 105A was used instead of Compound 100A, and in forming an electron transport layer, Compound 201B was used instead of Compound 200B.",
"Example 14 An organic light-emitting device was manufactured in the same manner as in Example 1, except that in forming an emission layer, Compound 106A was used instead of Compound 100A, and in forming an electron transport layer, Compound 201B was used instead of Compound 200B.",
"Example 15 An organic light-emitting device was manufactured in the same manner as in Example 1, except that in forming an emission layer, Compound 107A was used instead of Compound 100A, and in forming an electron transport layer, Compound 201B was used instead of Compound 200B.",
"Example 16 An organic light-emitting device was manufactured in the same manner as in Example 1, except that in forming an emission layer, Compound 108A was used instead of Compound 100A, and in forming an electron transport layer, Compound 201B was used instead of Compound 200B.",
"Example 17 An organic light-emitting device was manufactured in the same manner as in Example 1, except that in forming an emission layer, Compound 109A was used instead of Compound 100A.",
"Example 18 An organic light-emitting device was manufactured in the same manner as in Example 1, except that in forming an emission layer, Compound 109A was used instead of Compound 100A, and in forming an electron transport layer, Compound 201B was used instead of Compound 200B.",
"Example 19 An organic light-emitting device was manufactured in the same manner as in Example 1, except that in forming an emission layer, Compound 109A was used instead of Compound 100A, and in forming an electron transport layer, Compound 202B was used instead of Compound 200B.",
"Example 20 An organic light-emitting device was manufactured in the same manner as in Example 1, except that in forming an emission layer, Compound 109A was used instead of Compound 100A, and in forming an electron transport layer, Compound 203B was used instead of Compound 200B.",
"Example 21 An organic light-emitting device was manufactured in the same manner as in Example 1, except that in forming an emission layer, Compound 109A was used instead of Compound 100A, and in forming an electron transport layer, Compound 204B was used instead of Compound 200B.",
"Example 22 An organic light-emitting device was manufactured in the same manner as in Example 1, except that in forming an emission layer, Compound 109A was used instead of Compound 100A, and in forming an electron transport layer, Compound 205B was used instead of Compound 200B.",
"Example 23 An organic light-emitting device was manufactured in the same manner as in Example 1, except that in forming an emission layer, Compound 109A was used instead of Compound 100A, and in forming an electron transport layer, Compound 206B was used instead of Compound 200B.",
"Example 24 An organic light-emitting device was manufactured in the same manner as in Example 1, except that in forming an emission layer, Compound 109A was used instead of Compound 100A, and in forming an electron transport layer, Compound 207B was used instead of Compound 200B.",
"Example 25 An organic light-emitting device was manufactured in the same manner as in Example 1, except that in forming an emission layer, Compound 110A was used instead of Compound 100A, and in forming an electron transport layer, Compound 201B was used instead of Compound 200B.",
"Example 26 An organic light-emitting device was manufactured in the same manner as in Example 1, except that in forming an emission layer, Compound 111A was used instead of Compound 100A, and in forming an electron transport layer, Compound 201B was used instead of Compound 200B.",
"Example 27 An organic light-emitting device was manufactured in the same manner as in Example 1, except that in forming an emission layer, Compound 112A was used instead of Compound 100A, and in forming an electron transport layer, Compound 201B was used instead of Compound 200B.",
"Example 28 An organic light-emitting device was manufactured in the same manner as in Example 1, except that in forming an emission layer, Compound 113A was used instead of Compound 100A, and in forming an electron transport layer, Compound 201B was used instead of Compound 200B.",
"Example 29 An organic light-emitting device was manufactured in the same manner as in Example 1, except that in forming an emission layer, Compound 114A was used instead of Compound 100A, and in forming an electron transport layer, Compound 201B was used instead of Compound 200B.",
"Example 30 An organic light-emitting device was manufactured in the same manner as in Example 1, except that in forming an emission layer, Compound 115A was used instead of Compound 100A, and in forming an electron transport layer, Compound 201B was used instead of Compound 200B.",
"Comparative Example 1 An organic light-emitting device was manufactured in the same manner as in Example 1, except that in forming an emission layer, Compound H1, below, was used instead of Compound 100A, and in forming an electron transport layer, Compound 201B was used instead of Compound 200B.",
"Comparative Example 2 An organic light-emitting device was manufactured in the same manner as in Example 1, except that in forming an emission layer, Compound H2, below, was used instead of Compound 100A, and in forming an electron transport layer, Compound 201B was used instead of Compound 200B.",
"Comparative Example 3 An organic light-emitting device was manufactured in the same manner as in Example 1, except that in forming an electron transport layer, Compound E1, below, was used instead of Compound 200B.",
"Comparative Example 4 An organic light-emitting device was manufactured in the same manner as in Example 1, except that in forming an electron transport layer, Compound E2, below, was used instead of Compound 200B.",
"Comparative Example 5 An organic light-emitting device was manufactured in the same manner as in Example 1, except that in forming an emission layer, Compound 109A, below, was used instead of Compound 100A, and in forming an electron transport layer, Compound E1 was used instead of Compound 200B.",
"Comparative Example 6 An organic light-emitting device was manufactured in the same manner as in Example 1, except that in forming an emission layer, Compound 109A, below, was used instead of Compound 100A, and in forming an electron transport layer, Compound E2 was used instead of Compound 200B.",
"Comparative Example 7 An organic light-emitting device was manufactured in the same manner as in Example 1, except that in forming an emission layer, Compound H3, below, was used instead of Compound 100A, and in forming an electron transport layer, Compound E3 was used instead of Compound 200B.",
"Example 31 An anode was prepared by cutting a Corning 15 Ωcm2 (1,200 Å) ITO glass substrate to a size of 50 mm×50 mm×0.7 mm, ultrasonically cleaning the glass substrate by using isopropyl alcohol and pure water for 5 minutes each, and then irradiating UV light for 30 minutes thereto and exposing to ozone to clean.",
"Then, the anode was loaded into a vacuum deposition apparatus.",
"Compound HT13 was vacuum deposited on the substrate to form a hole injection layer having a thickness of 500 Å.",
"Then, compound HT3, which is a hole transportable compound, was vacuum deposited thereon to form a hole transport layer having a thickness of 450 Å.",
"Then, Compound 100A and FD1 were co-deposited at a ratio of 95:5 to form an emission layer having a thickness of 300 Å.",
"Then, Compound 200B and Liq were deposited at a weight ratio of 50:50 on the emission layer to form an electron transport layer having a thickness of 250 Å, and then, LiF, which is a halogenated alkali metal, was deposited on the electron transport layer to form an electron injection layer having a thickness of 10 Å, and Al was vacuum deposited thereon to a thickness of 1,500 Å (cathode), thereby completing the manufacturing of an organic light-emitting device.",
"Example 32 An organic light-emitting device was manufactured in the same manner as in Example 31, except that in forming an electron transport layer, Compound 201B was used instead of Compound 200B.",
"Example 33 An organic light-emitting device was manufactured in the same manner as in Example 31, except that in forming an electron transport layer, Compound 202B was used instead of Compound 200B.",
"Example 34 An organic light-emitting device was manufactured in the same manner as in Example 31, except that in forming an electron transport layer, Compound 203B was used instead of Compound 200B.",
"Example 35 An organic light-emitting device was manufactured in the same manner as in Example 31, except that in forming an electron transport layer, Compound 204B was used instead of Compound 200B.",
"Example 36 An organic light-emitting device was manufactured in the same manner as in Example 31, except that in forming an electron transport layer, Compound 205B was used instead of Compound 200B.",
"Example 37 An organic light-emitting device was manufactured in the same manner as in Example 31, except that in forming an electron transport layer, Compound 206B was used instead of Compound 200B.",
"Example 38 An organic light-emitting device was manufactured in the same manner as in Example 31, except that in forming an electron transport layer, Compound 207B was used instead of Compound 200B.",
"Example 39 An organic light-emitting device was manufactured in the same manner as in Example 31, except that in forming an emission layer, Compound 109A was used instead of Compound 100A.",
"Example 40 An organic light-emitting device was manufactured in the same manner as in Example 31, except that in forming an emission layer, Compound 109A was used instead of Compound 100A, and in forming an electron transport layer, Compound 201B was used instead of Compound 200B.",
"Example 41 An organic light-emitting device was manufactured in the same manner as in Example 31, except that in forming an emission layer, Compound 109A was used instead of Compound 100A, and in forming an electron transport layer, Compound 202B was used instead of Compound 200B.",
"Example 42 An organic light-emitting device was manufactured in the same manner as in Example 31, except that in forming an emission layer, Compound 109A was used instead of Compound 100A, and in forming an electron transport layer, Compound 203B was used instead of Compound 200B.",
"Example 43 An organic light-emitting device was manufactured in the same manner as in Example 31, except that in forming an emission layer, Compound 109A was used instead of Compound 100A, and in forming an electron transport layer, Compound 204B was used instead of Compound 200B.",
"Example 44 An organic light-emitting device was manufactured in the same manner as in Example 31, except that in forming an emission layer, Compound 109A was used instead of Compound 100A, and in forming an electron transport layer, Compound 205B was used instead of Compound 200B.",
"Example 45 An organic light-emitting device was manufactured in the same manner as in Example 31, except that in forming an emission layer, Compound 109A was used instead of Compound 100A, and in forming an electron transport layer, Compound 206B was used instead of Compound 200B.",
"Example 46 An organic light-emitting device was manufactured in the same manner as in Example 31, except that in forming an emission layer, Compound 109A was used instead of Compound 100A, and in forming an electron transport layer, Compound 207B was used instead of Compound 200B.",
"Comparative Example 8 An organic light-emitting device was manufactured in the same manner as in Example 31, except that in forming an emission layer, Compound H1, below, was used instead of Compound 100A, and in forming an electron transport layer, Compound 201B was used instead of Compound 200B.",
"Comparative Example 9 An organic light-emitting device was manufactured in the same manner as in Example 31, except that in forming an emission layer, Compound H2, below, was used instead of Compound 100A, and in forming an electron transport layer, Compound 201B was used instead of Compound 200B.",
"Comparative Example 10 An organic light-emitting device was manufactured in the same manner as in Example 31, except that in forming an electron transport layer, Compound E1, below, was used instead of Compound 200B.",
"Comparative Example 11 An organic light-emitting device was manufactured in the same manner as in Example 31, except that in forming an electron transport layer, Compound E2, below, was used instead of Compound 200B.",
"Comparative Example 12 An organic light-emitting device was manufactured in the same manner as in Example 31, except that in forming an emission layer, Compound 109A was used instead of Compound 100A, and in forming an electron transport layer, Compound E1 was used instead of Compound 200B.",
"Comparative Example 13 An organic light-emitting device was manufactured in the same manner as in Example 31, except that in forming an emission layer, Compound 109A was used instead of Compound 100A, and in forming an electron transport layer, Compound E2 was used instead of Compound 200B.",
"Comparative Example 14 An organic light-emitting device was manufactured in the same manner as in Example 31, except that in forming an emission layer, Compound H3, below, was used instead of Compound 100A, and in forming an electron transport layer, Compound E3 was used instead of Compound 200B.",
"Example 47 An anode was prepared by cutting a Corning 15 Ωcm2 (1,200 Å) ITO glass substrate to a size of 50 mm×50 mm×0.7 mm, ultrasonically cleaning the glass substrate by using isopropyl alcohol and pure water for 5 minutes each, and then irradiating UV light for 30 minutes thereto and exposing to ozone to clean.",
"Then, the anode was loaded into a vacuum deposition apparatus.",
"Compound HT13 was vacuum deposited on the substrate to form a hole injection layer having a thickness of 500 Å.",
"Then, compound HT3, which is a hole transportable compound, was vacuum deposited thereon to form a hole transport layer having a thickness of 450 Å.",
"Then, Compound 100A and FD1 were co-deposited at a ratio of 95:5 to form an emission layer having a thickness of 300 Å.",
"Then, Compound 200B was deposited on the emission layer to form a buffer layer having a thickness of 100 Å.",
"Then, BPhen and Liq were deposited at a weight ratio of 50:50 on the buffer layer to form an electron transport layer having a thickness of 150 Å.",
"Then, LiF, which is a halogenated alkali metal, was deposited on the electron transport layer to form an electron injection layer having a thickness of 10 Å. Al was vacuum deposited thereon to a thickness of 1500 Å (cathode), thereby completing the manufacturing of an organic light-emitting device.",
"Example 48 An organic light-emitting device was manufactured in the same manner as in Example 47, except that in forming an electron transport layer, Compound 201B was used instead of Compound 200B.",
"Example 49 An organic light-emitting device was manufactured in the same manner as in Example 47, except that in forming an electron transport layer, Compound 202B was used instead of Compound 200B.",
"Example 50 An organic light-emitting device was manufactured in the same manner as in Example 47, except that in forming an electron transport layer, Compound 203B was used instead of Compound 200B.",
"Example 51 An organic light-emitting device was manufactured in the same manner as in Example 47, except that in forming an electron transport layer, Compound 204B was used instead of Compound 200B.",
"Example 52 An organic light-emitting device was manufactured in the same manner as in Example 47, except that in forming an electron transport layer, Compound 205B was used instead of Compound 200B.",
"Example 53 An organic light-emitting device was manufactured in the same manner as in Example 47, except that in forming an electron transport layer, Compound 206B was used instead of Compound 200B.",
"Example 54 An organic light-emitting device was manufactured in the same manner as in Example 47, except that in forming an electron transport layer, Compound 207B was used instead of Compound 200B.",
"Example 55 An organic light-emitting device was manufactured in the same manner as in Example 47, except that in forming an emission layer, Compound 101A was used instead of Compound 100A, and in forming an electron transport layer, Compound 201B was used instead of Compound 200B.",
"Example 56 An organic light-emitting device was manufactured in the same manner as in Example 47, except that in forming an emission layer, Compound 102A was used instead of Compound 100A, and in forming an electron transport layer, Compound 201B was used instead of Compound 200B.",
"Example 57 An organic light-emitting device was manufactured in the same manner as in Example 47, except that in forming an emission layer, Compound 103A was used instead of Compound 100A, and in forming an electron transport layer, Compound 201B was used instead of Compound 200B.",
"Example 58 An organic light-emitting device was manufactured in the same manner as in Example 47, except that in forming an emission layer, Compound 104A was used instead of Compound 100A, and in forming an electron transport layer, Compound 201B was used instead of Compound 200B.",
"Example 59 An organic light-emitting device was manufactured in the same manner as in Example 47, except that in forming an emission layer, Compound 105A was used instead of Compound 100A, and in forming an electron transport layer, Compound 201B was used instead of Compound 200B.",
"Example 60 An organic light-emitting device was manufactured in the same manner as in Example 47, except that in forming an emission layer, Compound 106A was used instead of Compound 100A, and in forming an electron transport layer, Compound 201B was used instead of Compound 200B.",
"Example 61 An organic light-emitting device was manufactured in the same manner as in Example 47, except that in forming an emission layer, Compound 107A was used instead of Compound 100A, and in forming an electron transport layer, Compound 201B was used instead of Compound 200B.",
"Example 62 An organic light-emitting device was manufactured in the same manner as in Example 47, except that in forming an emission layer, Compound 108A was used instead of Compound 100A, and in forming an electron transport layer, Compound 201B was used instead of Compound 200B.",
"Example 63 An organic light-emitting device was manufactured in the same manner as in Example 47, except that in forming an emission layer, Compound 109A was used instead of Compound 100A.",
"Example 64 An organic light-emitting device was manufactured in the same manner as in Example 47, except that in forming an emission layer, Compound 109A was used instead of Compound 100A, and in forming an electron transport layer, Compound 201B was used instead of Compound 200B.",
"Example 65 An organic light-emitting device was manufactured in the same manner as in Example 47, except that in forming an emission layer, Compound 109A was used instead of Compound 100A, and in forming an electron transport layer, Compound 202B was used instead of Compound 200B.",
"Example 66 An organic light-emitting device was manufactured in the same manner as in Example 47, except that in forming an emission layer, Compound 109A was used instead of Compound 100A, and in forming an electron transport layer, Compound 203B was used instead of Compound 200B.",
"Example 67 An organic light-emitting device was manufactured in the same manner as in Example 47, except that in forming an emission layer, Compound 109A was used instead of Compound 100A, and in forming an electron transport layer, Compound 204B was used instead of Compound 200B.",
"Example 68 An organic light-emitting device was manufactured in the same manner as in Example 47, except that in forming an emission layer, Compound 109A was used instead of Compound 100A, and in forming an electron transport layer, Compound 205B was used instead of Compound 200B.",
"Example 69 An organic light-emitting device was manufactured in the same manner as in Example 47, except that in forming an emission layer, Compound 109A was used instead of Compound 100A, and in forming an electron transport layer, Compound 206B was used instead of Compound 200B.",
"Example 70 An organic light-emitting device was manufactured in the same manner as in Example 47, except that in forming an emission layer, Compound 109A was used instead of Compound 100A, and in forming an electron transport layer, Compound 207B was used instead of Compound 200B.",
"Example 71 An organic light-emitting device was manufactured in the same manner as in Example 47, except that in forming an emission layer, Compound 110A was used instead of Compound 100A, and in forming an electron transport layer, Compound 201B was used instead of Compound 200B.",
"Example 72 An organic light-emitting device was manufactured in the same manner as in Example 47, except that in forming an emission layer, Compound 111A was used instead of Compound 100A, and in forming an electron transport layer, Compound 201B was used instead of Compound 200B.",
"Example 73 An organic light-emitting device was manufactured in the same manner as in Example 47, except that in forming an emission layer, Compound 112A was used instead of Compound 100A, and in forming an electron transport layer, Compound 201B was used instead of Compound 200B.",
"Example 74 An organic light-emitting device was manufactured in the same manner as in Example 47, except that in forming an emission layer, Compound 113A was used instead of Compound 100A, and in forming an electron transport layer, Compound 201B was used instead of Compound 200B.",
"Example 75 An organic light-emitting device was manufactured in the same manner as in Example 47, except that in forming an emission layer, Compound 114A was used instead of Compound 100A, and in forming an electron transport layer, Compound 201B was used instead of Compound 200B.",
"Example 76 An organic light-emitting device was manufactured in the same manner as in Example 47, except that in forming an emission layer, Compound 115A was used instead of Compound 100A, and in forming an electron transport layer, Compound 201B was used instead of Compound 200B.",
"Comparative Example 15 An organic light-emitting device was manufactured in the same manner as in Example 47, except that in forming an emission layer, Compound H1, below, was used instead of Compound 100A, and in forming an electron transport layer, Compound 201B was used instead of Compound 200B.",
"Comparative Example 16 An organic light-emitting device was manufactured in the same manner as in Example 47, except that in forming an emission layer, Compound H2, below, was used instead of Compound 100A, and in forming an electron transport layer, Compound 201B was used instead of Compound 200B.",
"Comparative Example 17 An organic light-emitting device was manufactured in the same manner as in Example 47, except that in forming an electron transport layer, Compound E1, below, was used instead of Compound 200B.",
"Comparative Example 18 An organic light-emitting device was manufactured in the same manner as in Example 47, except that in forming an electron transport layer, Compound E2, below, was used instead of Compound 200B.",
"Comparative Example 19 An organic light-emitting device was manufactured in the same manner as in Example 47, except that in forming an emission layer, Compound 109A was used instead of Compound 100A, and in forming an electron transport layer, Compound E1 was used instead of Compound 200B.",
"Comparative Example 20 An organic light-emitting device was manufactured in the same manner as in Example 47, except that in forming an emission layer, Compound 109A was used instead of Compound 100A, and in forming an electron transport layer, Compound E2 was used instead of Compound 200B.",
"Comparative Example 21 An organic light-emitting device was manufactured in the same manner as in Example 47, except that in forming an emission layer, Compound H3, below, was used instead of Compound 100A, and in forming an electron transport layer, Compound E3 was used instead of Compound 200B.",
"Evaluation Example Efficiency (at a current density of 10 mA/cm2) and a lifespan T80 (at a current density of 50 mA/cm2) of the organic light-emitting devices of Examples 1 to 76 and Comparative Examples 1 to 21 were evaluated by using PR650 Spectroscan Source Measurement Unit.",
"(product of PhotoResearch Co., Ltd).",
"T80 indicates a time period taken until brightness reduces to 80% of the initial brightness.",
"Results thereof are shown in Tables 1 to 3, below.",
"TABLE 1 Electron Efficiency T80 Example Emission layer transport layer (cd/A) (hours) Example 1 100A 200B 5.4 130 Example 2 100A 201B 5.4 140 Example 3 100A 202B 5.7 100 Example 4 100A 203B 5.4 120 Example 5 100A 204B 5.8 110 Example 6 100A 205B 5.5 110 Example 7 100A 206B 5.6 120 Example 8 100A 207B 5.7 110 Example 9 101A 201B 5.5 130 Example 10 102A 201B 5.8 100 Example 11 103A 201B 5.6 110 Example 12 104A 201B 5.5 120 Example 13 105A 201B 5.7 100 Example 14 106A 201B 5.2 140 Example 15 107A 201B 5.3 130 Example 16 108A 201B 5.5 100 Example 17 109A 200B 5.5 140 Example 18 109A 201B 5.6 110 Example 19 109A 202B 5.6 100 Example 20 109A 203B 5.5 130 Example 21 109A 204B 5.9 100 Example 22 109A 205B 5.6 110 Example 23 109A 206B 5.9 100 Example 24 109A 207B 5.8 110 Example 25 110A 201B 5.6 120 Example 26 111A 201B 5.9 110 Example 27 112A 201B 5.4 110 Example 28 113A 201B 5.4 120 Example 29 114A 201B 5.8 100 Example 30 115A 201B 5.3 110 Comparative H1 201B 5.0 60 Example 1 Comparative H2 201B 4.8 70 Example 2 Comparative 100A E1 5.2 90 Example 3 Comparative 100A E2 5.3 100 Example 4 Comparative 109A E1 5.2 90 Example 5 Comparative 109A E2 5.3 100 Example 6 Comparative H3 E3 5.4 90 Example 7 TABLE 2 Emission Electron transport Efficiency Life span Example layer layer (cd/A) (hours) Example 31 100A 200B:Liq 5.3 170 Example 32 100A 201B:Liq 5.4 130 Example 33 100A 202B:Liq 5.6 110 Example 34 100A 203B:Liq 5.5 140 Example 35 100A 204B:Liq 5.5 120 Example 36 100A 205B:Liq 5.6 110 Example 37 100A 206B:Liq 5.3 120 Example 38 100A 207B:Liq 5.4 120 Example 39 109A 200B:Liq 5.4 160 Example 40 109A 201B:Liq 5.5 120 Example 41 109A 202B:Liq 5.6 120 Example 42 109A 203B:Liq 5.4 140 Example 43 109A 204B:Liq 5.6 110 Example 44 109A 205B:Liq 5.4 120 Example 45 109A 206B:Liq 5.8 110 Example 46 109A 207B:Liq 5.7 120 Comparative 109A 201B:Liq 4.9 60 Example 8 Comparative 109A 201B:Liq 4.6 70 Example 9 Comparative 100A E1:Liq 5.0 90 Example 10 Comparative 100A E2:Liq 5.1 100 Example 11 Comparative 109A E1:Liq 5.0 90 Example 12 Comparative 109A E2:Liq 5.1 100 Example 13 Comparative H3 E3:Liq 5.2 100 Example 14 TABLE 3 Life Emission Buffer Electron Efficiency span Example layer layer transport layer (cd/A) (hours) Example 47 100A 200B BPhen:Liq 5.4 150 Example 48 100A 201B BPhen:Liq 5.3 160 Example 49 100A 202B BPhen:Liq 5.5 110 Example 50 100A 203B BPhen:Liq 5.3 130 Example 51 100A 204B BPhen:Liq 5.6 110 Example 52 100A 205B BPhen:Liq 5.4 120 Example 53 100A 206B BPhen:Liq 5.6 130 Example 54 100A 207B BPhen:Liq 5.6 130 Example 55 101A 201B BPhen:Liq 5.6 140 Example 56 102A 201B BPhen:Liq 5.9 120 Example 57 103A 201B BPhen:Liq 5.6 120 Example 58 104A 201B BPhen:Liq 5.7 140 Example 59 105A 201B BPhen:Liq 5.5 110 Example 60 106A 201B BPhen:Liq 5.3 160 Example 61 107A 201B BPhen:Liq 5.4 140 Example 62 108A 201B BPhen:Liq 5.6 130 Example 63 109A 200B BPhen:Liq 5.6 160 Example 64 109A 201B BPhen:Liq 5.5 120 Example 65 109A 202B BPhen:Liq 5.7 110 Example 66 109A 203B BPhen:Liq 5.6 150 Example 67 109A 204B BPhen:Liq 6.0 110 Example 68 109A 205B BPhen:Liq 5.6 110 Example 69 109A 206B BPhen:Liq 5.9 100 Example 70 109A 207B BPhen:Liq 5.9 120 Example 71 110A 201B BPhen:Liq 5.5 130 Example 72 111A 201B BPhen:Liq 5.9 120 Example 73 112A 201B BPhen:Liq 5.5 110 Example 74 113A 201B BPhen:Liq 5.6 130 Example 75 114A 201B BPhen:Liq 5.9 110 Example 76 115A 201B BPhen:Liq 5.4 120 Comparative 109A 200B BPhen:Liq 4.9 70 Example 15 Comparative 109A 201B BPhen:Liq 5.0 80 Example 16 Comparative 100A E1 BPhen:Liq 5.4 100 Example 17 Comparative 100A E2 BPhen:Liq 5.4 110 Example 18 Comparative 109A E1 BPhen:Liq 5.4 100 Example 19 Comparative 109A E2 BPhen:Liq 5.4 110 Example 20 Comparative H3 E3 BPhen:Liq 5.4 100 Example 21 As may be seen in Table 1 to 3, the organic light-emitting devices of Examples 1 to 76 exhibited higher efficiency and longer lifespan than the organic light-emitting devices of Comparative Examples 1 to 21.Organic light-emitting devices according to the embodiments may have high efficiency and long lifespan characteristics.",
"Example embodiments have been disclosed herein, and although specific terms are employed, they are used and are to be interpreted in a generic and descriptive sense only and not for purpose of limitation.",
"In some instances, as would be apparent to one of ordinary skill in the art as of the filing of the present application, features, characteristics, and/or elements described in connection with a particular embodiment may be used singly or in combination with features, characteristics, and/or elements described in connection with other embodiments unless otherwise specifically indicated.",
"Accordingly, it will be understood by those of skill in the art that various changes in form and details may be made without departing from the spirit and scope of the present invention as set forth in the following claims."
]
] |
Patent_15871333
|
[
[
"PAYMENT INFORMATION TECHNOLOGIES",
"A method includes maintaining first payment card information for a cardholder.",
"The method includes processing a first card not present transaction between the cardholder and a merchant.",
"The first transaction based at least in part on the first information.",
"The method includes generating second payment card information for the cardholder.",
"The second information replacing the first information for subsequent use via the cardholder.",
"The method includes receiving an input from the cardholder.",
"The input indicating the merchant.",
"The input based at least in part on the second information replacing the first information.",
"The method includes sending the second information to the merchant based at least in part on the input.",
"The method includes processing a second card not present transaction between the cardholder and the merchant.",
"The second transaction based at least in part on the second information after the sending."
],
[
"1.A method of modifying payment information, the method comprising: receiving, via a merchant computing system, a logic from a payment card computing system, wherein the merchant computing system hosts a customer record storing a first payment card number; executing, via the merchant computing system, the logic such that the logic configures the merchant computing system to receive a second payment card number from the payment card computing system; receiving, via the merchant computing system, the second payment card number from the payment card computing system; writing, via the merchant computing system, the second payment card number into the customer record; deactivating, via the merchant computing system, the first payment card number in the customer record; activating, via the merchant computing system, the second payment card number in the customer record; and receiving, via the merchant computing system, an order request from a cardholder computing system, wherein the order request is based on the second payment card number, wherein the cardholder computing system is associated with the customer record."
],
[
"<SOH> BACKGROUND <EOH>In the present disclosure, where a document, an act and/or an item of knowledge is referred to and/or discussed, then such reference and/or discussion is not an admission that the document, the act and/or the item of knowledge and/or any combination thereof was at the priority date, publicly available, known to the public, part of common general knowledge and/or otherwise constitutes prior art under the applicable statutory provisions; and/or is known to be relevant to an attempt to solve any problem with which the present disclosure may be concerned with.",
"Further, nothing is disclaimed.",
"Many people purchase goods and/or services online from merchants, such as Amazon®, Target®, and others.",
"Such purchases are typically made, whether via the merchants' websites and/or mobile apps, using payment card information, such as credit card information and/or debit card information.",
"In order to make such shopping experience simpler, many of such merchants optionally allow for the payment card information to be saved on the merchants' computer systems for future use.",
"Therefore, based on the customers' sign in into the merchants' systems, such as via provision of an email address and/or a password, the payment card information is readily available for authorizing payment.",
"However, despite such functionality, there are many drawbacks.",
"A person's payment card information is often stolen, misused, lost, expired, and/or updated.",
"Consequently, new payment card information is issued to the person and the old payment card information is deactivated.",
"The new payment card information usually includes a new card number, a new card expiration date, and/or a new card security code.",
"Accordingly, if the person had the old payment card information previously saved on some merchant's computer system, then, in order to make another purchase through that merchant, the person typically has to manually enter the new payment card information into that merchant's computer system.",
"Although such steps are relatively minimal for a single merchant, cumulatively, this process becomes tedious, time consuming, emotionally draining, and/or inconvenient if the person must repeat this process for many merchants.",
"Such process becomes even more tedious, time consuming, emotionally draining, and/or inconvenient when performed at different times for different merchants because the user can misplace and/or forget merchant related sign in information and/or have the new payment card information stolen, misused, lost, expired, and/or updated in the interim.",
"Moreover, the person may not remember every website and/or app that needs to be updated and at least with paying bills online, such as utility bills, entertainment bills, and/or others, the person may only find out about providing new payment card information when the merchant contacts the person for lack of payment.",
"Such state of being hardship not only for the person, but also for the merchant who has to dedicate resources for tracking down the customer for the lack of payment and/or ensuring that the customer actually pays.",
"Also, such forgetfulness can lead to potential negative impact on the person's credit score.",
"Although online payment services, such as PayPal®, can somewhat mitigate the above, many merchants avoid using such services at least due to competition, security, added complexity, more computer infrastructure, additional service and/or transaction fees, which cut into the merchants' profits."
],
[
"<SOH> BRIEF SUMMARY <EOH>The present disclosure may address at least one of the above.",
"However, the present disclosure may also prove useful to other technical areas.",
"Therefore, the claims should not be construed as necessarily limited to addressing any of the above.",
"According to an example embodiment of the present disclosure a method is provided.",
"The method includes maintaining, via a payment card issuer computer system, first payment card information for a cardholder.",
"The method includes processing, via the system, a first card not present transaction between the cardholder and a merchant.",
"The first transaction based at least in part on the first information.",
"The method includes generating, via the system, second payment card information for the cardholder.",
"The second information replacing the first information for subsequent use via the cardholder.",
"The method includes receiving, via the system, an input from the cardholder.",
"The input indicating the merchant.",
"The input based at least in part on the second information replacing the first information.",
"The method includes sending, via the system, the second information to the merchant based at least in part on the input.",
"The method includes processing, via the system, a second card not present transaction between the cardholder and the merchant.",
"The second transaction based at least in part on the second information after the sending.",
"According to another example embodiment of the present disclosure a method is provided.",
"The method includes maintaining, via a payment card issuer computer system, first payment card information for a cardholder.",
"The first information associated with a transaction history.",
"The method includes processing, via the system, a first card not present transaction between the cardholder and a merchant.",
"The first transaction based at least in part on the first information.",
"The history listing the first transaction.",
"The method includes generating, via the system, second payment card information for the cardholder.",
"The second information replacing the first information for subsequent use via the cardholder.",
"The method includes selecting, via the system, the merchant from the history based at least in part on the first transaction.",
"The selecting based at least in part on the second information replacing the first information.",
"The method includes sending, via the system, the second information to the merchant based at least in part on the selecting.",
"The method includes processing, via the system, a second card not present transaction between the cardholder and the merchant.",
"The second transaction based at least in part on the second information after the sending.",
"The present disclosure may be embodied in the form illustrated in the accompanying drawings.",
"However, attention is called to the fact that the drawings are illustrative.",
"Variations are contemplated as being part of the disclosure, limited only by the scope of the claims."
],
[
"CROSS-REFERENCE TO RELATED APPLICATIONS This application is a continuation of U.S. Utility patent application Ser.",
"No.",
"14/165,240, filed on Jan. 27, 2014, which claims priority to U.S.",
"Provisional Patent Application 61/757,224, filed on Jan. 27, 2013, all of which are herein fully incorporated by reference for all purposes.",
"BACKGROUND In the present disclosure, where a document, an act and/or an item of knowledge is referred to and/or discussed, then such reference and/or discussion is not an admission that the document, the act and/or the item of knowledge and/or any combination thereof was at the priority date, publicly available, known to the public, part of common general knowledge and/or otherwise constitutes prior art under the applicable statutory provisions; and/or is known to be relevant to an attempt to solve any problem with which the present disclosure may be concerned with.",
"Further, nothing is disclaimed.",
"Many people purchase goods and/or services online from merchants, such as Amazon®, Target®, and others.",
"Such purchases are typically made, whether via the merchants' websites and/or mobile apps, using payment card information, such as credit card information and/or debit card information.",
"In order to make such shopping experience simpler, many of such merchants optionally allow for the payment card information to be saved on the merchants' computer systems for future use.",
"Therefore, based on the customers' sign in into the merchants' systems, such as via provision of an email address and/or a password, the payment card information is readily available for authorizing payment.",
"However, despite such functionality, there are many drawbacks.",
"A person's payment card information is often stolen, misused, lost, expired, and/or updated.",
"Consequently, new payment card information is issued to the person and the old payment card information is deactivated.",
"The new payment card information usually includes a new card number, a new card expiration date, and/or a new card security code.",
"Accordingly, if the person had the old payment card information previously saved on some merchant's computer system, then, in order to make another purchase through that merchant, the person typically has to manually enter the new payment card information into that merchant's computer system.",
"Although such steps are relatively minimal for a single merchant, cumulatively, this process becomes tedious, time consuming, emotionally draining, and/or inconvenient if the person must repeat this process for many merchants.",
"Such process becomes even more tedious, time consuming, emotionally draining, and/or inconvenient when performed at different times for different merchants because the user can misplace and/or forget merchant related sign in information and/or have the new payment card information stolen, misused, lost, expired, and/or updated in the interim.",
"Moreover, the person may not remember every website and/or app that needs to be updated and at least with paying bills online, such as utility bills, entertainment bills, and/or others, the person may only find out about providing new payment card information when the merchant contacts the person for lack of payment.",
"Such state of being hardship not only for the person, but also for the merchant who has to dedicate resources for tracking down the customer for the lack of payment and/or ensuring that the customer actually pays.",
"Also, such forgetfulness can lead to potential negative impact on the person's credit score.",
"Although online payment services, such as PayPal®, can somewhat mitigate the above, many merchants avoid using such services at least due to competition, security, added complexity, more computer infrastructure, additional service and/or transaction fees, which cut into the merchants' profits.",
"BRIEF SUMMARY The present disclosure may address at least one of the above.",
"However, the present disclosure may also prove useful to other technical areas.",
"Therefore, the claims should not be construed as necessarily limited to addressing any of the above.",
"According to an example embodiment of the present disclosure a method is provided.",
"The method includes maintaining, via a payment card issuer computer system, first payment card information for a cardholder.",
"The method includes processing, via the system, a first card not present transaction between the cardholder and a merchant.",
"The first transaction based at least in part on the first information.",
"The method includes generating, via the system, second payment card information for the cardholder.",
"The second information replacing the first information for subsequent use via the cardholder.",
"The method includes receiving, via the system, an input from the cardholder.",
"The input indicating the merchant.",
"The input based at least in part on the second information replacing the first information.",
"The method includes sending, via the system, the second information to the merchant based at least in part on the input.",
"The method includes processing, via the system, a second card not present transaction between the cardholder and the merchant.",
"The second transaction based at least in part on the second information after the sending.",
"According to another example embodiment of the present disclosure a method is provided.",
"The method includes maintaining, via a payment card issuer computer system, first payment card information for a cardholder.",
"The first information associated with a transaction history.",
"The method includes processing, via the system, a first card not present transaction between the cardholder and a merchant.",
"The first transaction based at least in part on the first information.",
"The history listing the first transaction.",
"The method includes generating, via the system, second payment card information for the cardholder.",
"The second information replacing the first information for subsequent use via the cardholder.",
"The method includes selecting, via the system, the merchant from the history based at least in part on the first transaction.",
"The selecting based at least in part on the second information replacing the first information.",
"The method includes sending, via the system, the second information to the merchant based at least in part on the selecting.",
"The method includes processing, via the system, a second card not present transaction between the cardholder and the merchant.",
"The second transaction based at least in part on the second information after the sending.",
"The present disclosure may be embodied in the form illustrated in the accompanying drawings.",
"However, attention is called to the fact that the drawings are illustrative.",
"Variations are contemplated as being part of the disclosure, limited only by the scope of the claims.",
"BRIEF DESCRIPTION OF THE DRAWINGS The accompanying drawings illustrate example embodiments of the present disclosure.",
"Such drawings are not to be construed as necessarily limiting the disclosure.",
"Like numbers and/or similar numbering scheme can refer to like and/or similar elements throughout.",
"FIG.",
"1 shows an example embodiment of a network diagram according to the present disclosure.",
"FIG.",
"2A shows an example embodiment of a process for using payment information according to the present disclosure.",
"FIG.",
"2B shows an example embodiment of a process for using payment information according to the present disclosure.",
"FIG.",
"3 shows an example embodiment of a process for disclosing payment information according to the present disclosure.",
"FIG.",
"4 shows an example embodiment of a communication diagram according to the present disclosure.",
"FIG.",
"5 shows an example embodiment of a process for module operation according to the present disclosure.",
"FIG.",
"6 shows an example embodiment of a process for receiving notifications according to the present disclosure.",
"FIG.",
"7 shows an example embodiment of a process for disclosing payment information according to the present disclosure.",
"FIG.",
"8 shows an example embodiment of a process for handling payment information according to the present disclosure.",
"FIG.",
"9 shows an example embodiment of a process for transacting via a new account according to the present disclosure.",
"DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS The present disclosure is now described more fully with reference to the accompanying drawings, in which example embodiments of the present disclosure are shown.",
"The present disclosure may, however, be embodied in many different forms and should not be construed as necessarily being limited to the example embodiments disclosed herein.",
"Rather, these example embodiments are provided so that the present disclosure is thorough and complete, and fully conveys the concepts of the present disclosure to those skilled in the relevant art.",
"In addition, features described with respect to certain example embodiments may be combined in and/or with various other example embodiments.",
"Different aspects and/or elements of example embodiments, as disclosed herein, may be combined in a similar manner.",
"Further, some example embodiments, whether individually and/or collectively, may be components of a larger system, wherein other procedures may take precedence over and/or otherwise modify their application.",
"Additionally, a number of steps may be required before, after, and/or concurrently with example embodiments, as disclosed herein.",
"Note that any and/or all methods and/or processes, at least as disclosed herein, can be at least partially performed via at least one entity in any manner.",
"The terminology used herein can imply direct or indirect, full or partial, temporary or permanent, action or inaction.",
"For example, when an element is referred to as being “on,” “connected” or “coupled” to another element, then the element can be directly on, connected or coupled to the other element and/or intervening elements may be present, including indirect and/or direct variants.",
"In contrast, when an element is referred to as being “directly connected” or “directly coupled” to another element, there are no intervening elements present.",
"Although the terms first, second, etc.",
"may be used herein to describe various elements, components, regions, layers and/or sections, these elements, components, regions, layers and/or sections should not necessarily be limited by such terms.",
"These terms are only used to distinguish one element, component, region, layer or section from another element, component, region, layer or section.",
"Thus, a first element, component, region, layer, or section discussed below could be termed a second element, component, region, layer, or section without departing from the teachings of the present disclosure.",
"The terminology used herein is for describing particular embodiments only and is not intended to be necessarily limiting of the present disclosure.",
"As used herein, the singular forms “a,” “an” and “the” are intended to include the plural forms as well, unless the context clearly indicates otherwise.",
"The terms “comprises,” “includes” and/or “comprising,” “including” when used in this specification, specify the presence of stated features, integers, steps, operations, elements, and/or components, but do not preclude the presence or addition of one or more other features, integers, steps, operations, elements, components, and/or groups thereof.",
"Further, alternate terminology should not be limited necessarily as exclusionary, but can be inclusionary as well.",
"Example embodiments of the present disclosure are described herein with reference to illustrations of idealized embodiments (and intermediate structures) of the present disclosure.",
"As such, variations from the shapes of the illustrations as a result, for example, of manufacturing techniques and/or tolerances, are to be expected.",
"Thus, the example embodiments of the present disclosure should not be construed as necessarily limited to the particular shapes of regions illustrated herein, but are to include deviations in shapes that result, for example, from manufacturing.",
"Unless otherwise defined, all terms used herein, including technical and scientific terms, have the same meaning as commonly understood by one of ordinary skill in the art to which this disclosure belongs.",
"The terms, such as those defined in commonly used dictionaries, should be interpreted as having a meaning that is consistent with their meaning in the context of the relevant art and should not be interpreted in an idealized and/or overly formal sense unless expressly so defined herein.",
"As used herein, the term “about” and/or “substantially” refers to an up to and including a +/−10% variation from the nominal value/term.",
"Such variation is always included in any given value/term provided herein, whether or not such variation is specifically referred thereto.",
"If any disclosures are incorporated herein by reference and such disclosures conflict in part and/or in whole with the present disclosure, then to the extent of conflict, and/or broader disclosure, and/or broader meaning of terms, the present disclosure controls.",
"If such disclosures conflict in part and/or in whole with one another, then to the extent of conflict, the later-dated disclosure controls.",
"FIG.",
"1 shows an example embodiment of a network environment according to the present disclosure.",
"An environment 100 includes a network 102, a cardholder 104, a card issuer 106, and a merchant 108.Network 102 includes a plurality of nodes, such as a collection of computers and/or other hardware interconnected by communication channels, which allow for sharing of resources and/or information.",
"Such interconnection can be direct and/or indirect.",
"Network 102 can be wired and/or wireless.",
"Network 102 can allow for communication over short and/or long distances.",
"Network 102 can operate via at least one network protocol, such as Ethernet, a Transmission Control Protocol (TCP)/Internet Protocol (IP), and so forth.",
"Network 102 can have any scale, such as a personal area network, a local area network, a home area network, a storage area network, a campus area network, a backbone network, a metropolitan area network, a wide area network, an enterprise private network, a virtual private network, a virtual network, a satellite network, a computer cloud network, an internetwork, a cellular network, and so forth.",
"Network 102 can be and/or include an intranet and/or an extranet.",
"Network 102 can be and/or include Internet.",
"Network 102 can include other networks and/or allow for communication with other networks, whether sub-networks and/or distinct networks, whether identical and/or different from network 102.Network 102 can include hardware, such as a network interface card, a repeater, a hub, a bridge, a switch and/or a firewall.",
"Network 102 can be operated, directly and/or indirectly, by and/or on behalf of one and/or more entities, irrespective of any relation to cardholder 104, card issuer 106, and/or merchant 108.Network 102 can include a payment card association network, such as Visa® network, MasterCard® network, American Express® network, Discover® network, and others.",
"The payment card association network serves as a link between card issuer 106, which acts on behalf of cardholder 104, and an acquirer, such as an acquiring bank, which acts on behalf of merchant 108.An operator of the payment card association network, such as Visa®, MasterCard®, American Express®, Discover®, and/or others, can set a transaction term for merchant 108, card issuing 106, and/or the acquirer.",
"The payment card association network can be operated by an independent company and/or one company may operate multiple networks.",
"Cardholder 104 operates a computer, which can be a hardware and/or software server, a workstation, a desktop, a laptop, a tablet, a mobile phone, a mainframe, a supercomputer, a server farm, and so forth.",
"The computer can be operated, directly and/or indirectly, by and/or on behalf of cardholder 104.The computer can be touchscreen and/or non-touchscreen.",
"The computer can include and/or be part of another computer system and/or cloud network.",
"The computer can run any type of operating system (OS), such as iOS®, Windows®, Android®, Unix®, Linux® and/or others.",
"The computer can include and/or be coupled to an input device, such as a mouse, a keyboard, a camera, whether forward-facing and/or back-facing, an accelerometer, a touchscreen, and/or a microphone, and/or an output device, such as a display, a speaker, and/or a printer.",
"The computer is in communication with network 102, such as directly and/or indirectly.",
"Such communication can be via a software application, a mobile app, a browser, an OS, and/or any combination thereof.",
"The computer can include circuitry for global positioning determination, such as via a global positioning system (GPS), a signal triangulation system, and so forth.",
"The computer can be equipped with near-field-communication (NFC) circuitry.",
"Card issuer 106 operates a computer, which can be a hardware and/or software server, a workstation, a desktop, a laptop, a tablet, a mobile phone, a mainframe, a supercomputer, a server farm, and so forth.",
"The computer can be operated, directly and/or indirectly, by and/or on behalf of card issuer 106.The computer can be touchscreen and/or non-touchscreen.",
"The computer can include and/or be part of another computer system and/or cloud network.",
"The computer can run any type of OS, such as iOS®, Windows®, Android®, Unix®, Linux® and/or others.",
"The computer can include and/or be coupled to an input device, such as a mouse, a keyboard, a camera, whether forward-facing and/or back-facing, an accelerometer, a touchscreen, and/or a microphone, and/or an output device, such as a display, a speaker, and/or a printer.",
"The computer is in communication with network 102, such as directly and/or indirectly.",
"Such communication can be via a software application, a mobile app, a browser, an OS, and/or any combination thereof.",
"The computer can include circuitry for global positioning determination, such as via GPS, a signal triangulation system, and so forth.",
"The computer can be equipped with NFC circuitry.",
"The computer can run a database, such as a relational database, which contains card issuing information and/or cardholder information.",
"Merchant 108 operates a computer, which can be a hardware and/or software server, a workstation, a desktop, a laptop, a tablet, a mobile phone, a mainframe, a supercomputer, a server farm, and so forth.",
"The computer can be operated, directly and/or indirectly, by and/or on behalf of card issuer 106.The computer can be touchscreen and/or non-touchscreen.",
"The computer can include and/or be part of another computer system and/or cloud network.",
"The computer can run any type of OS, such as iOS®, Windows®, Android®, Unix®, Linux® and/or others.",
"The computer can include and/or be coupled to an input device, such as a mouse, a keyboard, a camera, whether forward-facing and/or back-facing, an accelerometer, a touchscreen, and/or a microphone, and/or an output device, such as a display, a speaker, and/or a printer.",
"The computer is in communication with network 102, such as directly and/or indirectly.",
"Such communication can be via a software application, a mobile app, a browser, an OS, and/or any combination thereof.",
"The computer can include circuitry for global positioning determination, such as via GPS, a signal triangulation system, and so forth.",
"The computer can be equipped with NFC circuitry.",
"The computer can run a database, such as a relational database, which contains payment information.",
"Cardholder 104 is in communication with network 102, such as direct, indirect, encrypted, unencrypted, and others.",
"Cardholder 104 is in selective communication, such as direct, indirect, encrypted, unencrypted, and others, with at least one of card issuer 106 and merchant 108 via network 102.Cardholder 104 includes an individual who makes purchases via a payment card.",
"That individual can be a consumer and/or a legal entity, such as an organization, a company, a partnership, and/or others.",
"Cardholder 104 is responsible for charges made onto the payment card.",
"The payment card includes a card which can be used by cardholder 104 and accepted by merchant 108 to make a payment for a purchase and/or in payment of some other obligation.",
"Such purchase and/or obligation can be for a good and/or a service.",
"The payment card includes at least one of a credit card, a debit card, an automatic teller machine (ATM) card, a charge card, a stored-value card, a fleet card, a gift card, a scrip, an electronic purse, an electronic money wallet, a crypto-currency wallet, a virtual card, and/or others.",
"Note that in some embodiments, a physical card may be absent, but a value is associated with the consumer based at least in part on some form of credit system, such as Hawala.",
"Further, note that the payment card can include any information storage medium, whether physical and/or virtual, such as paper, metal, wood, rubber, computer memory, and/or others.",
"For example, the card can include plastic items, paper items, metal items, wood items, rubber items, quick response (QR) codes depicted on an item, whether physically and/or electronically, information displayed on electronic mobile devices, wearable computers, and/or others.",
"Card issuer 106 is in communication with network 102, such as direct, indirect, encrypted, unencrypted, and others.",
"Card issuer 106 is in selective communication, such as direct, indirect, encrypted, unencrypted, and others, with at least one of cardholder 104 and merchant 108 via network 102.For example, card issuer 106 can communicate with the acquirer of merchant 108 regarding merchant 108.Also for example, card issuer 106 can communicate with cardholder 104 via email.",
"Card issuer 106 includes a financial entity, such as a bank, like Chase®, Bank of America®, American Express®, Discover®, TD Bank®, and/or others, and/or any other organization that issued the payment card to cardholder 104.Card issuer 106 bills cardholder 104 for repayment and bears a risk that the payment card is used fraudulently.",
"Cardholder 104 is responsible for repaying after making a purchase via the payment card issued via card issuer 106.Card issuer 106 can issue an offshore payment card.",
"The acquirer includes a financial entity, which accepts and/or processes payment card transactions for merchant 108, including crediting an account of merchant 108 for a value charged to the payment card minus any relevant fees.",
"Such accepting and/or processing is for a good and/or a service offered via merchant 108 to cardholder 104.Merchant 108 is in communication with network 102, such as direct, indirect, encrypted, unencrypted, and others.",
"Merchant 108 is in selective communication, such as direct, indirect, encrypted, unencrypted, and others, with at least one of cardholder 104 and card issuer 106 via network 102.For example, merchant 108 is in communication with cardholder 104 via email.",
"Also for example, merchant 108 is in communication with card issuer 106 via the acquirer of merchant 108.Merchant 108 includes an individual, an organization, and/or a business accepting payment card payments for a good and/or a service sold to cardholder 104, whether directly and/or indirectly.",
"Merchant 108 includes a for-profit entity, a non-for-profit entity, a government agency, and/or others.",
"Merchant 108 includes an online merchant, a brick-and-mortar merchant, and/or any combination thereof.",
"Note that any amount of merchants 108 can be used, as described herein.",
"Note that card issuer 106 can be merchant 108 and/or merchant 108 can include card issuer 104.Note that cardholder 104 can be merchant 108 and/or merchant 108 can be cardholder 104.FIG.",
"2A shows an example embodiment of a process for using payment information according to the present disclosure.",
"Some elements of this figure are described above.",
"Thus, same and/or similar reference characters identify identical and/or like components described above and any repetitive detailed description thereof will hereinafter be omitted or simplified in order to avoid complication.",
"A process 200A includes a plurality of blocks 202A-214A.",
"Process 200A can be performed in sequential numerical order and/or non-sequential numerical order.",
"Process 200A is performed via card issuer 106.However, whether domestically and/or internationally, process 200A can be performed, facilitated for performance, and/or assisted in such performance via at least one entity, such as merchant 108, cardholder 104, the acquirer of merchant 108, an operator of the credit card transaction network, an independent sales organization reselling to merchant 108 services of the acquirer, an operator of a transaction network which implements electronic payment card transactions, an affinity partner, such as a retailer, a sports team, a university, a charity, a professional organization, lending its name to card issuer 106 for attracting a customer who has a strong relationship with the partner where the partner get paid a fee/balance percentage for each card issued using the partner name, and/or an insurance provider which underwriting various insurance protections offered as payment card perks, such as car rental insurance, hotel burglary insurance, and others.",
"In block 202A, card issuer 106 maintains, via a payment card issuer computer system, first payment card information for cardholder 104.The system can include a server and a database running on the server.",
"The database contains information for a plurality of cardholders, which includes cardholder 104.The first information includes a payment card number, an expiration date, a security code, an operator of the payment card association network and/or other relevant information.",
"Such maintenance can include at least one of issuing the first information, storage of the first information, securing of the first information from unauthorized access, sending a bill based at least in part on the first information, storing a transaction history associated with the first information, receiving a payment from cardholder 104 based at least in part on the first information, and/or other relevant types of maintenance.",
"Note that the first information can vary based on payment card type.",
"In block 204A, card issuer 106 processes, via the system, a first transaction with merchant 108 based on the first information.",
"The first transaction can be a card not present transaction, in which cardholder 104 is not in a same locale as merchant 108 during transacting.",
"Such transactions include mail order transactions, telephone transactions, facsimile transactions, recurring transaction, and/or Internet/e-commerce transactions.",
"However, note that the the first transaction can be a card present transaction.",
"The first transaction is between at least merchant 108 and cardholder 104.Such processing can include communicating with the acquirer, who acts on behalf of merchant 108, to facilitate payment to merchant 108 via the acquirer.",
"Such processing can also include billing cardholder 104 based at least in part on payment to the acquirer and the first information.",
"Such processing can also include receiving payment from cardholder 104 based on the billing and the first information.",
"The first transaction can be a recurring transaction, an e-commerce transaction, and/or others.",
"In block 206A, card issuer 106 generates, via the system, second payment card information for cardholder 104.Such generation can be manual, such as via a phone operator of card issuer 106 running a payment information generation program, and/or automatic, such as via receiving a notification that the first information is insecure.",
"The second information includes a payment card number, which can be different from the first information, an expiration date, which can be different from the first information, a security code, which can be different from the first information, an operator of the payment card association network, which can be different from the first information, and/or other relevant information.",
"For example, card issuer 106 can issue a new payment card based on the second information to cardholder 104.Note that the second information can vary based on payment card type.",
"Although the first information and the second information are for an identical payment card type, in some embodiments, the first information can be for a payment card of a first type and the second information can be for a payment card of a second type different from the first type.",
"In block 208A, card issuer 106 replaces, via the system, the first information with the second information for subsequent use via the cardholder.",
"Such replacement can occur based at least in part on at least one of stolen first information, misused first information, lost first information, expired first information, updated first information, cardholder 104 request, and/or others.",
"Such replacing can include deactivating the first information such that the first information cannot be subsequently used for purchasing.",
"In block 210A, card issuer 106 receives, via the system, an input from cardholder 104.The input indicates/implicates merchant 108 since cardholder 104 already transacted with merchant 108 and there is a chance that cardholder 104 will again transact with merchant 108 with the second information, such as a recurring transaction, a new e-commerce order, and/or others.",
"The input is based at least in part on the second information replacing the first information, such as after the replacing has been noted by card issuer 106.For example, after the replacing has been confirmed via card issuer 106, cardholder 104 is provided with the transaction history via the system.",
"Cardholder 104 can be allowed to provide the input whether based at least in part on the transaction history associated with the first information and/or manually entering a merchant identification, such as a name of merchant 108 and/or a date of transaction with merchant 108.The input can be via any input manner, such as a keyboard, a mouse, a microphone, a camera, and/or others.",
"The input can include an alphanumeric text, a voice, an image, a symbol, and/or others.",
"The text can identify merchant 108.For example, the text can include at least one of a name of merchant 108, an address of merchant 108, an electronic communication information of merchant 108, a spent amount of transaction with merchant 108, a geolocation of merchant 108, and a date of transaction with merchant 108.The input can be via selecting from a plurality of choices, such as merchant choices listed in the transaction history associated with the first information.",
"The input can via selecting merchant 108 from other merchants based at least in part on the transaction history.",
"The input can be via any element of a graphical user interface provided to cardholder 104 via card issuer 106.Some examples of such elements include a text box, a combo box, a radio button, a check box, a split button, a slider, a list box, a spinner, a drop-down list, a control menu, a pie menu, a ribbon, and/or others.",
"Note that card issuer 106 can maintain, via the system, the transaction history associated with the first information.",
"Card issuer 106 can provide, via the system, a list to cardholder 104.The list includes a plurality of merchants.",
"The merchants include merchant 108.The list is generated based at least in part on a computerized analysis of the history.",
"The input is via selecting merchant 108 from the merchants based at least in part on the list.",
"The analysis is based at least in part on at least one of a frequency of use, an amount per transaction, and a total amount spent per merchant.",
"In block 212A, card issuer 106 sends, via the system, the second information to merchant 108 based at least in part on the input.",
"Card issuer 106 initiates a means of communication by which the second information is sent to merchant 108 without merchant 108 being informed by card issuer 106 of such sending prior to the sending.",
"Although the sending is without merchant 108 specifically requesting for the second information, such configuration can be different in other embodiments.",
"The second information can be send in a direct and/or indirect manner.",
"The second information can be sent in a encrypted and/or unencrypted manner.",
"For sending, the second information can include alphanumeric, symbolic, audio, video, and/or other types of data.",
"The second information can be sent in an original manner, such as how card issuer 106 stores the second information, and/or in a amended manner, such as specifically formatted manner and/or how merchant 108 desires such information.",
"Such means of communication can be via any communication technology, including a browser-based email, a client-based email, an instant message, a text message, a short message service (SMS), a chat, a voice chat, a web conferencing, a physical snail mail, a telephone, a facsimile, a webpage, a social media post, a social media message, a module-to-module message, a hypertext transfer protocol (HTTP and/or HTTPS), a file transfer protocol (FTP), and/or any other type of message sending technology.",
"For example, card issuer 106 can send the second information via the electronic mail to merchant device, such as a computer and/or phone which is operated by and/or on behalf of merchant 108 via the Internet.",
"The second information can include a message asking merchant 108 to update card holder 104 account on the merchant's computer with the updated card information, i.e., the second information.",
"Alternatively, no message is sent along with the second information since by virtue of receiving the second information, merchant 108 can understand that an action to be taken is to update card holder 104 account on the merchant's computer.",
"In another alternative embodiment, instead of sending the second information via the electronic mail, a link is sent via the electronic mail for which merchant 108 can click to access a webpage containing the second information to be retrieved.",
"Alternatively, instead of a link, information directing merchant 108 to a specific web address/domain name can be sent for which merchant 108 can access to retrieve the second information.",
"Further, merchant 108 can submit a preference list to card issuer 106.The preference list lists which means of sending is preferred so that card issuer 106 can send the second information via such preferred means.",
"The preference list can be stored in an account on card issuer 106 computer either locally and/or remotely.",
"In addition to communicating the second information to merchant 108, card issuer 106 can simultaneously, or thereafter, inform cardholder 104 that such information is, or has been, sent to merchant 108.Note that the second information can be sent by itself and/or with other information to merchant 108, such as the second information for other cardholders 104, general information, technical information, non-payment information for other cardholders 104, and/or others.",
"In block 214A, card issuer 106 processes, via the system, a second transaction with merchant 108 based on the second information after the sending.",
"The second transaction can be a card not present transaction in which cardholder 104 is not in a same locale as merchant 108 during transacting.",
"Such transactions include mail order transactions, telephone transactions, facsimile transactions, recurring transaction, and/or Internet/e-commerce transactions.",
"However, second transaction can be a card present transaction.",
"The second transaction is between at least merchant 108 and cardholder 104.Such processing can include communicating with the acquirer, who acts on behalf of merchant 108, to facilitate payment to merchant 108 via the acquirer.",
"Such processing can also include billing cardholder 104 based at least in part on payment to the acquirer and the second information.",
"Such processing can also include receiving payment from cardholder 104 based on the billing and the second information.",
"The second transaction can be a recurring transaction, an e-commerce transaction, and/or others.",
"The second transaction and the first transaction can relate to identical subject matter and/or be non-related.",
"For example, cardholders 104 purchase goods and/or services online from merchants 108, such as Amazon®, Target®, and others.",
"Such purchases are typically made, whether via merchants' 108 websites and/or mobile apps, using payment card information, such as credit card information and/or debit card information.",
"In order to make such shopping experience simpler, many merchants 108 optionally allow for the payment card information to be saved on merchants' 108 computer systems for future use.",
"Therefore, based on cardholders' 104 signing-in into merchants' 108 systems, such as via provision of an email address and/or a password, the payment card information is readily available for authorizing payment.",
"However, often, cardholder 104 payment card information, such as the first information, is stolen, misused, lost, expired, and/or updated.",
"Consequently, new payment card information, such as the second information, is issued to cardholder 104 and the old payment card information, such as the first information, is deactivated.",
"The new payment card information, such as the second information, usually includes a new card number, a new card expiration date, and/or a new card security code.",
"Accordingly, if cardholder 104 had the old payment card information, such as the first information, previously saved on merchant 108 computer system, then, in order to make another purchase through that merchant 108, cardholder 104 typically has to manually enter the new payment card information, such as the second information, into that merchant's 108 computer system.",
"Although such steps are relatively minimal for a single merchant 108, cumulatively, this process becomes tedious, time consuming, emotionally draining, and/or inconvenient if cardholder 104 must repeat this process for many merchants 108.Such process becomes even more tedious, time consuming, emotionally draining, and/or inconvenient when performed at different times for different merchants 108 because cardholder 104 can misplace and/or forget merchant 108 related sign in information and/or have the new payment card information, such as the second information, stolen, misused, lost, expired, and/or updated in the interim.",
"Moreover, cardholder 104 may not remember every website and/or app that needs to be updated and at least with paying bills online, such as utility bills, entertainment bills, and/or others, cardholder 104 may only find out about providing new payment card information when merchant 108 contacts cardholder 104 for lack of payment.",
"Such state of being hardship not only for cardholder 104, but also for merchant 108 who has to dedicate resources for tracking down cardholder 104 for the lack of payment and/or ensuring that cardholder 104 actually pays.",
"Also, such forgetfulness can lead to potential negative impact on cardholder 104 credit score.",
"Therefore, via cardholder 104 accessing card issuer 106 to send the new payment information, such as the second payment information, to merchant 108, cardholder 104 avoids manually entering the new payment information, such as the second information, into merchants 108 computer systems, while effectively saving time in a convenient manner, even if the new payment card information, such as the second information, stolen, misused, lost, expired, and/or updated in the interim.",
"Further, cardholder 104 effectively avoids every website and/or app that needs to be updated and at least with paying bills online, such as utility bills, entertainment bills, and/or others.",
"Likewise, merchant 108 can effectively avoid dedicating resources for tracking down cardholder 104 for the lack of payment and/or ensuring that cardholder 104 actually pays.",
"Moreover, cardholder 104 can avoid such forgetfulness leading to potential negative impact on cardholder 104 credit score.",
"Consequently, such technology effectively reduces a need for cardholder 104 to visit multiple merchant websites and update payment information on those sites piecemeal.",
"In some embodiments, in order to reduce a likelihood of sensitive information, such as the second information, being intercepted, card issuer 106 sends the second information when cardholder 104 accesses card issuer 106 to update payment information for merchant 108.FIG.",
"2B shows an example embodiment of a process for using payment information according to the present disclosure.",
"Some elements of this figure are described above.",
"Thus, same and/or similar reference characters identify identical and/or like components described above and any repetitive detailed description thereof will hereinafter be omitted or simplified in order to avoid complication.",
"A process 200B includes a plurality of blocks 202B-216B.",
"Process 200B can be performed in sequential numerical order and/or non-sequential numerical order.",
"Process 200B is performed via card issuer 106.However, whether domestically and/or internationally, process 200B can be performed, facilitated for performance, and/or assisted in such performance via at least one entity, such as merchant 108, cardholder 104, the acquirer of merchant 108, an operator of the credit card transaction network, an independent sales organization reselling to merchant 108 services of the acquirer, an operator of a transaction network which implements electronic payment card transactions, an affinity partner, such as a retailer, a sports team, a university, a charity, a professional organization, lending its name to card issuer 106 for attracting a customer who has a strong relationship with the partner where the partner get paid a fee/balance percentage for each card issued using the partner name, and/or an insurance provider which underwriting various insurance protections offered as payment card perks, such as car rental insurance, hotel burglary insurance, and others.",
"In block 202B, card issuer 106 maintains, via the system, the first information cardholder 104, as described herein.",
"The first information is associated with the transaction history listing transactions between cardholder 104 and other merchants 108.In block 204B, card issuer 106 processes, via the system, the first transaction between cardholder 104 and merchant 108, as described herein.",
"The first transaction is based at least in part on the first information, such as charged according to the first information.",
"In block 206B, card issuer 106 stores, via the system, information about the first transaction in the transaction history, as described herein.",
"The transaction history is for the first information such that the transaction history lists the first transaction.",
"In block 208B, card issuer 106 generates, via the system, the second information for cardholder 104, as described herein.",
"In block 210B, card issuer 106 replaces, via the system, the first information with the second information, as described herein.",
"In block 212B, card issuer 106 selects, via the system, merchant 108 from the transaction history based at least in part on the first transaction.",
"The selecting indicates/implicates merchant 108 since cardholder 104 already transacted with merchant 108 and there is a chance that cardholder 104 will again transact with merchant 108 with the second information, such as a recurring transaction, a new e-commerce order, and/or others.",
"The selecting is done manually, such as via an employee of card issuer 106, and/or automatically, via a computer program, which analyzes the transaction history for who to select in the history.",
"Such analysis can be heuristic, deterministic, and/or others.",
"Such analysis can be based at least in part on at least one of a frequency of use, such as how frequently has merchant 108 transacted with cardholder 106 for a selected time period in relation to other merchants listed in the transaction history, an amount per transaction, such as an average amount per transaction between cardholder 104 and merchant 108 in relation to other merchants listed in the transaction history, and a total amount spent per merchant, such as how much as cardholder 104 transacted with merchant 108 in relation to other merchants listed in the transaction history.",
"The selecting is based at least in part on the second information replacing the first information, such as after the replacing has been noted by card issuer 106.For example, after the replacing has been confirmed via card issuer 106, selects merchant 108 based on the analysis above.",
"The selecting can be via any selecting manner, such as a keyboard, a mouse, a microphone, a camera, and/or others.",
"The selecting can include an alphanumeric text, a voice, an image, a symbol, and/or others.",
"The selecting can be via selecting from a plurality of choices, such as merchant choices listed in the transaction history associated with the first information.",
"The selecting can be via any element of a graphical user interface provided to cardholder 104 via card issuer 106.Some examples of such elements include a text box, a combo box, a radio button, a check box, a split button, a slider, a list box, a spinner, a drop-down list, a control menu, a pie menu, a ribbon, and/or others.",
"For example, card issuer 106 can computationally analyze the transaction history and generate a report based at least in part on such analysis.",
"Such analysis can be based at least in part on at least one of a frequency of use, such as how frequently has merchant 108 transacted with cardholder 106 for a selected time period in relation to other merchants listed in the transaction history, an amount per transaction, such as an average amount per transaction between cardholder 104 and merchant 108 in relation to other merchants listed in the transaction history, and a total amount spent per merchant, such as how much as cardholder 104 transacted with merchant 108 in relation to other merchants listed in the transaction history.",
"Resultantly, the report contains a list of merchants, which includes merchant 108.Card issuer 106 then provides the report, such as via a webpage, to cardholder 104 for review, such as via accessing the system of card issuer 106.Cardholder 104 can review the report and fully confirm, fully disconfirm, partially confirm, and/or partially disconfirm which merchants mentioned in the report that cardholder 104 desires to send the second information to.",
"When cardholder 104 confirms at least merchant 108 during such review, then card issuer 106 sends the second information to merchant 108.In block 2148, card issuer 106 sends, via the system, the second information to merchant 108 based at least in part on the selecting, as described herein.",
"In block 216B, card issuer 106 processes, via the system, a second card not present transaction between cardholder 104 and merchant 108, as described herein.",
"The second transaction is based at least in part on the second information after the sending.",
"For example, cardholder 104 can manually select from the list and/or inform card issuer 106 which merchants 108 will receive the second information.",
"The list can be obtained from card issuer 106.The list includes merchants 108 from which cardholder 104 previously purchased items/services from using the first information.",
"Cardholder 104 can also select, based on merchant selection algorithms, for card issuer 106 to automatically select merchants, such as merchant 108, based on various criteria, such as prior spending history, most frequently used merchants based one or more time periods, money spent and/or every merchant ever used.",
"Upon selecting merchant(s) to which to send the second information, such as merchant 108, card issuer 106 sends data representing the second information to the merchant(s).",
"Such data can include personal identifying information, which may be just the second payment information, contact information, personal identification information and/or first payment information for identifying the user on the merchant(s) computer system and/or any combination thereof.",
"Upon receiving such data, whether immediately or after some time period, the merchant(s) associates, whether manually and/or automatically, the second information with cardholder 104 account at the merchant(s) computer system.",
"Alternatively, the information is updated on merchant's end without merchant involvement and/or input.",
"In other embodiments, process 200B includes receiving, via the system, a message from merchant 108.The message confirming a receipt of the second information based at least in part on the sending.",
"Process 200B further includes receiving, via the system, a message from merchant 108.The message confirming a storage of second information on a storage medium associated with merchant 108, such as owned via merchant 108.Process 200B further includes providing a software module via card issuer 106 to merchant 108 before the sending.",
"The module is configured for receiving the second information based at least in part on the sending.",
"Process 200B further includes receiving, via the system, an input from cardholder 104.The input modifying a selection of merchant 108 based at least in part on the selecting.",
"For example, if, based on the computerized analysis, the system provided a list of merchants, with merchant 108 therein, to cardholder 104 and cardholder 104 desires to modify that list, such as via adding merchants thereto and/or removing merchants therefrom, then cardholder 104 can provide the input into the system to modify the list.",
"However, if cardholder 104 is happy with contents of the list, then the system can receive an input from cardholder 104, which confirms the selecting.",
"Note that cardholder 104 can elect other merchants, such as via checking off corresponding checkboxes in the transaction history and/or the list, who were not selected via the system.",
"Such electing allows card issuer 106 to send the second information to those merchants.",
"FIG.",
"3 shows an example embodiment of a process for disclosing payment information according to the present disclosure.",
"Some elements of this figure are described above.",
"Thus, same and/or similar reference characters identify identical and/or like components described above and any repetitive detailed description thereof will hereinafter be omitted or simplified in order to avoid complication.",
"A process 300 includes a plurality of blocks 302-306.Process 300 can be performed in sequential numerical order and/or non-sequential numerical order.",
"Process 300 is performed via cardholder 104.However, whether domestically and/or internationally, process 300 can be performed, facilitated for performance, and/or assisted in such performance via at least one entity, such as merchant 108, card issuer 106, the acquirer of merchant 108, an operator of the credit card transaction network, an independent sales organization reselling to merchant 108 services of the acquirer, an operator of a transaction network which implements electronic payment card transactions, an affinity partner, such as a retailer, a sports team, a university, a charity, a professional organization, lending its name to card issuer 106 for attracting a customer who has a strong relationship with the partner where the partner get paid a fee/balance percentage for each card issued using the partner name, and/or an insurance provider which underwriting various insurance protections offered as payment card perks, such as car rental insurance, hotel burglary insurance, and others.",
"In block 302, cardholder 104 accesses the system of card issuer 106.Such accessing can be in any manner, whether secure and/or insecure, whether direct and/or indirect.",
"For example, cardholder 104 can operate the computer of cardholder 104 and, over network 102, securely sign-in into the system of card issuer 104.In other embodiments, such access can be over phone, email, facsimile, in-person, social media, texting, messaging, chat, and/or others.",
"In block 302, cardholder 104 indicates merchant 108.Such indication allows cardholder 104 to select to which merchant 108 should card issuer 106 send the second information for subsequent use, which can be immediate.",
"Such indication can be via textual, voice, image, symbolic and/or any other input.",
"Such indication can be via cardholder 104 selecting merchant 108 from the transaction history.",
"Such indication can be via cardholder 104 selecting merchant 108 from a list provided to cardholder 104 via card issuer 106 based at least in part on card issuer 106 analyzing the transaction history for various trends of cardholder 104.In block 306, cardholder 104 authorizes card issuer 106 to send the second information from card issuer 106 to merchant 108.Such authorization can be via any manner, such as via a message prompt, a checkbox, and others.",
"The authorization is requested, via the system.",
"Note that in other embodiments, card issuer 106 sends the second information without authorization of cardholder 104.FIG.",
"4 shows an example embodiment of a communication diagram according to the present disclosure.",
"Some elements of this figure are described above.",
"Thus, same and/or similar reference characters identify identical and/or like components described above and any repetitive detailed description thereof will hereinafter be omitted or simplified in order to avoid complication.",
"Card issuer 406 provides a software module 410 to merchant 408 before card issuer 406 sends the second information to merchant 408.Module 410 configured for receiving the second information based at least in part on the sending of the second information via card issuer 406.For example, module 410 can communicate with the system of card issuer 406.Note that module 410 is an example and card issuer 406 can provide merchant 408 with any logic, whether hardware, like a chip and/or circuitry, and/or software, like a software patch, a piece of code, and/or a program and/or any combination thereof.",
"In some embodiments, the logic can be operative for retrofitting preexisting hardware and/or software on merchant's 408 end, irrespective of whether such hardware and/or software is merchant 408 specific, or be a new feature on the merchant's 408 end.",
"This logic can provide for standardization of performance of such process for any, many and/or all merchants capable of payment processing according to the second information.",
"The logic can allow for seamless updating of the second information data on the backend between card issuer 406 and merchants 408.The logic can include and/or allow for security measures, such as encryption, user questions, image matching, automated phone call, emails, text messages, card issuer 406 staff call and/or any combination thereof.",
"The measures can be between cardholder 104 and card issuer 406 and/or card issuer 406 and merchant(s) 408.The logic and/or card issuer 406 independent of the logic can display a message confirming update of the second information when card issuer 406 accesses merchant 408(s) system(s).",
"In an embodiment, when cardholder 104 has at least two payment information accounts with one card issuer 406 accessible via one login, then cardholder 104 can send at least one of the at least two payment account data to merchant 408(s), as described herein.",
"For example, cardholder 104 has credit cards X and Y accessible via one login at card issuer 406.Credit card X has been used more frequently than credit card Y as believed by cardholder 104.Cardholder 104 can access card issuer 406 to authorize card issuer 406 to transmit credit card data for X and Y to merchant(s) 408 that have charged either credit card so that each credit card information is accessible to merchant 408 that have charged the other card.",
"For example, if card X has been used at merchants A, B and C and card Y has been used by A, B, D and E, then cardholder 104 can authorize card issuer 406 to transmit card X data to D and/or E and card Y data to C. FIG.",
"5 shows an example embodiment of a process for module operation according to the present disclosure.",
"Some elements of this figure are described above.",
"Thus, same and/or similar reference characters identify identical and/or like components described above and any repetitive detailed description thereof will hereinafter be omitted or simplified in order to avoid complication.",
"A process 500 includes a plurality of blocks 502-514.Process 500 can be performed in sequential numerical order and/or non-sequential numerical order.",
"Process 500 is performed via merchant 408.However, whether domestically and/or internationally, process 500 can be performed, facilitated for performance, and/or assisted in such performance via at least one entity, such as cardholder 104, card issuer 406, the acquirer of merchant 108, an operator of the credit card transaction network, an independent sales organization reselling to merchant 108 services of the acquirer, an operator of a transaction network which implements electronic payment card transactions, an affinity partner, such as a retailer, a sports team, a university, a charity, a professional organization, lending its name to card issuer 106 for attracting a customer who has a strong relationship with the partner where the partner get paid a fee/balance percentage for each card issued using the partner name, and/or an insurance provider which underwriting various insurance protections offered as payment card perks, such as car rental insurance, hotel burglary insurance, and others.",
"In block 502, merchant 408 receives module 410 from card issuer 406.Such receipt can be via any manner, whether physically and/or electronically.",
"For example, such receipt can be via email, chat, file transfer, a physically mailed computer memory with module 410 thereon, source code, texting, multimedia messaging, a payment system update/upgrade, and/or others.",
"In block 504, merchant 408 installs module 410.Such installation depends on how module 410 was provided.",
"For example, a self-extracting module 410 can be executed via merchant 408 and self-installed onto the payment system of merchant 408.Also for example, module 410 can be installed via an update/upgrade to the payment system of merchant 408.In block 506, merchant 408 stores the first information in the payment system, as described herein.",
"Note that block 506 can occur before block 502 and/or block 504.In block 508, merchant 408 transacts with cardholder 106 based at least in part on the first information, as described herein.",
"Note that block 506 can occur after block 508.In block 510, merchant 408 receives the second information from card issuer 406 via module 410.Such receipt can be wired and/or wireless.",
"Such receipt can be direct and/or indirect.",
"Such receipt can be encrypted and/or unencrypted.",
"Note that the second information can be sent en masse for a set of cardholders 104.In block 512, merchant 408 stores the second information in the payment system.",
"The payment system retrieves the second information from module 410 for storing in the payment system.",
"The payment system can delete the second information from module 410 for security purposes after such retrieval.",
"Module 410 can also be configured to self-delete the second information upon retrieval confirmation.",
"Module 410 can also be configured to delete such information upon receiving a command from card issuer 406, which can be periodic.",
"Module 410 can also be configured to contain a linked list, a stack, and/or a queue for retrieval of the second information in a first-in-first-out (FIFO) and/or first-in-last-out (FILO) manner.",
"Module 410 can also be configured to decrypt the second payment information before provision to the payment system when the second information is encrypted via card issuer 406 at least before sending to module 410.Alternatively, module 410 sends the second information to the payment system immediately upon receipt of the second information from card issuer 406 and then self-deletes the second information upon receipt confirmation from the payment system.",
"In block 514, merchant 408 transacts with cardholder 104 based at least in part on the second information, as described herein.",
"FIG.",
"6 shows an example embodiment of a process for receiving notifications according to the present disclosure.",
"Some elements of this figure are described above.",
"Thus, same and/or similar reference characters identify identical and/or like components described above and any repetitive detailed description thereof will hereinafter be omitted or simplified in order to avoid complication.",
"A process 600 includes a plurality of blocks 602-608.Process 600 can be performed in sequential numerical order and/or non-sequential numerical order.",
"Process 600 is performed via card issuer 106.However, whether domestically and/or internationally, process 600 can be performed, facilitated for performance, and/or assisted in such performance via at least one entity, such as cardholder 104, merchant 108, the acquirer of merchant 108, an operator of the credit card transaction network, an independent sales organization reselling to merchant 108 services of the acquirer, an operator of a transaction network which implements electronic payment card transactions, an affinity partner, such as a retailer, a sports team, a university, a charity, a professional organization, lending its name to card issuer 106 for attracting a customer who has a strong relationship with the partner where the partner get paid a fee/balance percentage for each card issued using the partner name, and/or an insurance provider which underwriting various insurance protections offered as payment card perks, such as car rental insurance, hotel burglary insurance, and others.",
"In block 602, card issuer 104 sends, via the system, the second information to merchant 108, as described herein.",
"In block 604, card issuer 104 receives, via the system, a receipt notification message from merchant 108.The message confirms a receipt of the second information based at least in part on the sending.",
"The message can be sent from merchant 108 via module 410.The message can be sent from merchant 108 via another communication means, such as email, fax, texting, chatting, file transfer, facsimile, physical letter, and/or others.",
"In block 606, card issuer 104 receives, via the system, a storage notification message from merchant 108.The message confirms a storage of the second information based at least in part on the sending.",
"The message can be sent from merchant 108 via module 410.The message can be sent via the payment system of merchant 108.The message can be sent from merchant 108 via another communication means, such as email, fax, texting, chatting, file transfer, facsimile, physical letter, and/or others.",
"The storage of the second information on a storage medium associated with merchant 108.The storage medium can be digital and/or analog.",
"For example, the storage medium can include computer memory, paper records, and/or others.",
"In block 608, card issuer 104 facilitates transacting between cardholder 104 and merchant 108 based at least in part on the second information, as described herein.",
"For example, such facilitation can include processing the second transaction with merchant 108 based at least in part on the second information.",
"FIG.",
"7 shows an example embodiment of a process for disclosing payment information according to the present disclosure.",
"Some elements of this figure are described above.",
"Thus, same and/or similar reference characters identify identical and/or like components described above and any repetitive detailed description thereof will hereinafter be omitted or simplified in order to avoid complication.",
"A process 700 includes a plurality of blocks 702-710.Process 700 can be performed in sequential numerical order and/or non-sequential numerical order.",
"Process 700 is performed via card issuer 106.However, whether domestically and/or internationally, process 700 can be performed, facilitated for performance, and/or assisted in such performance via at least one entity, such as cardholder 104, merchant 108, the acquirer of merchant 108, an operator of the credit card transaction network, an independent sales organization reselling to merchant 108 services of the acquirer, an operator of a transaction network which implements electronic payment card transactions, an affinity partner, such as a retailer, a sports team, a university, a charity, a professional organization, lending its name to card issuer 106 for attracting a customer who has a strong relationship with the partner where the partner get paid a fee/balance percentage for each card issued using the partner name, and/or an insurance provider which underwriting various insurance protections offered as payment card perks, such as car rental insurance, hotel burglary insurance, and others.",
"In block 702, card issuer 106 generates the second information, as described herein.",
"In block 704, card issuer 106 provides the transaction history for the first information to cardholder 104, as described herein.",
"Such provision is visual, but can be auditory, alphanumeric, symbolic, and others.",
"For example, such provision can be via a liquid crystal display (LCD).",
"Such provision can be requested via cardholder 104 from card issuer 106, such as via a webpage.",
"Such provision can be mandated onto cardholder 104 via card issuer 106, such as via a webpage.",
"In block 706, card issuer 106 selects merchant 108 from the transaction history based at least in part on computerized analysis of the transaction history, as described herein.",
"Note that card issuer 106 can also select no merchants at all.",
"Further, note that card issuer 106 can select a plurality of merchants, which can include merchant 108.The merchants can be ranked/rated, as described herein.",
"Note that such rankings/ratings can be selectively sorted via cardholder 104.In block 708, card issuer 106 receives authorization from cardholder 104 to send the second information to merchants, which can include merchant 108, as selected via card issuer 106 and/or cardholder 104.Such authorization can be biometric, alphanumeric, symbolic, and others.",
"Such authorization can be via any visual and/or communication means described herein.",
"In block 710, card issuer 106 facilitates transacting between cardholder 104 and merchant 108 based at least in part on the second information, as described herein.",
"For example, such facilitation can include processing the second transaction with merchant 108 based at least in part on the second information.",
"FIG.",
"8 shows an example embodiment of a process for handling payment information according to the present disclosure.",
"Some elements of this figure are described above.",
"Thus, same and/or similar reference characters identify identical and/or like components described above and any repetitive detailed description thereof will hereinafter be omitted or simplified in order to avoid complication.",
"A process 800 includes a plurality of blocks 802-810.Process 800 can be performed in sequential numerical order and/or non-sequential numerical order.",
"Process 800 is performed via merchant 108.However, whether domestically and/or internationally, process 800 can be performed, facilitated for performance, and/or assisted in such performance via at least one entity, such as cardholder 104, card issuer 106, the acquirer of merchant 108, an operator of the credit card transaction network, an independent sales organization reselling to merchant 108 services of the acquirer, an operator of a transaction network which implements electronic payment card transactions, an affinity partner, such as a retailer, a sports team, a university, a charity, a professional organization, lending its name to card issuer 106 for attracting a customer who has a strong relationship with the partner where the partner get paid a fee/balance percentage for each card issued using the partner name, and/or an insurance provider which underwriting various insurance protections offered as payment card perks, such as car rental insurance, hotel burglary insurance, and others.",
"In block 802, merchant 108 maintains a customer account of cardholder 104.Merchant 108 stores the first information in the account.",
"For example, such maintenance can include securing access to the account, storing transaction data for the account, and others.",
"In block 804, merchant 108 receives the second information from card issuer 106, as described herein.",
"In block 806, merchant 108 matches the second information to the customer account.",
"The matching occurs via the payment system based at least in part on receiving the second information from module 410.The matching can be one-to-one correspondence, one-to-many correspondence, many-to-many correspondence, and/or many-to-one correspondence.",
"The matching can be based on precise matching and/or imprecise matching, such as accounting for capital alphanumeric characters.",
"The matching can be statistical, heuristic and/or deterministic based.",
"For example, when, in addition to actual payment data, the second information includes at least one of the customer account data, cardholder 104 personal identification data, cardholder 104 contact information data, and other data relevant to matching to the customer account, then merchant 108 uses such data to match to the customer account.",
"In block 808, merchant 108, based at least in part on successful matching, such as via identifying the account of cardholder 104 at merchant 108 based at least on part data received from card issuer 106, associates the second information with the account for subsequent charging according thereto.",
"For example, such association can include maintaining, as described herein.",
"Also for example, such association can include storing the second information in the account and replacing the first information in the account with the second information.",
"Merchant 108 can delete the first information from the account and/or choose to keep in the account for documentation/trail/security purposes.",
"Note that the first information can be visible to cardholder 104 and/or invisible to cardholder 104, whether selectively via merchant 108 and/or cardholder 104.In block 810, merchant 108 transacts with cardholder 104 based at least in part on the second information, as described herein.",
"The second information is stored in the account.",
"FIG.",
"9 shows an example embodiment of a process for transacting via a new account according to the present disclosure.",
"Some elements of this figure are described above.",
"Thus, same and/or similar reference characters identify identical and/or like components described above and any repetitive detailed description thereof will hereinafter be omitted or simplified in order to avoid complication.",
"A process 900 includes a plurality of blocks 902-908.Process 900 can be performed in sequential numerical order and/or non-sequential numerical order.",
"Process 900 is performed via merchant 108.However, whether domestically and/or internationally, process 900 can be performed, facilitated for performance, and/or assisted in such performance via at least one entity, such as cardholder 104, card issuer 106, the acquirer of merchant 108, an operator of the credit card transaction network, an independent sales organization reselling to merchant 108 services of the acquirer, an operator of a transaction network which implements electronic payment card transactions, an affinity partner, such as a retailer, a sports team, a university, a charity, a professional organization, lending its name to card issuer 106 for attracting a customer who has a strong relationship with the partner where the partner get paid a fee/balance percentage for each card issued using the partner name, and/or an insurance provider which underwriting various insurance protections offered as payment card perks, such as car rental insurance, hotel burglary insurance, and others.",
"In block 902, merchant 108 receives payment card information for cardholder 104 from card issuer 106, such as over network 102.Such receipt is as described herein.",
"For example, such receipt can be via module 410 and/or the logic.",
"Such information can include actual payment data, such as payment card number, expiration date, security code, and others.",
"Note that such data can vary based at least in part on payment card type.",
"Such payment data can include cardholder 104 personal identification data, cardholder 104 contact information data, shipping data, and other cardholder 104 identifying data, such as biometrics.",
"In block 904, merchant 108 creates a new customer account based on the received payment card information 408.Merchant 108 can communicate with card issuer 106, such as via the acquirer, via network 102, and/or others, to verify validity of the payment information data, check creditworthiness of cardholder 104, and confirm payment data sufficiency to charge cardholder 104 accordingly.",
"Note that merchant 108 can also access other entities for such verification, such as a credit score bureau.",
"When cardholder 104 already has a duplicate/preexisting account with merchant 108, then merchant 108 can mandate for account joining and updating payment information for latest payment information, as received in block 902 and as described herein, and/or keep the duplicate/preexisting account separate.",
"Merchant 108 can also request cardholder 104 via the preexisting account, such as via email, phone, text, and/or others, how cardholder 104 wants merchant 108 to proceed when a new account would be created.",
"When the duplicate/preexisting accounts are kept separately, then merchant 108 can synchronize both of them based at least in part on latest payment data such that both accounts can be transacted therethrough equally.",
"Also, such synchronization can allow for contact information synchronization, such as address synchronization, and/or signing-in information synchronization, such as email and password synchronization, which can be used if cardholder 104 forgot and/or misplaced such information.",
"Alternatively, when the duplicate/preexisting accounts are kept separately, then merchant 108 can allow for non-synchronization and keeping both accounts totally separately where the first account remains as is.",
"Note that merchant 108 can request for advice from cardholder 104 on a course of action when faced with the duplicate/preexisting account.",
"In block 906, merchant 108 enables cardholder 104 to access the account.",
"Such enabling is based at least in part on successful verification that the received payment information data is valid, cardholder 104 is creditworthy, and cardholder 104 can be charged according to the received payment information, such as payment sufficiency.",
"Such enabling includes configuring merchant 108 computer system for transacting, notifying cardholder 104 of successful account creation, providing login data for cardholder 104, and others.",
"Resultantly, cardholder 104 can access merchant 108 via the account to transact according to the payment card information.",
"Cardholder 104 can access the account without having to later input payment card information prior to, for example, purchasing an item and/or paying for a service at merchant 108.In block 908, merchant 108 transacts with cardholder 104 based at least in part on the received payment information, as described herein.",
"The received payment information is stored in the account.",
"In other embodiments, for greater security/fraud reduction, card issuer 106 can review/rate merchants 108, such as on a pass/fail scale, a tiered scale, and/or others.",
"Such review/rating is based at least in part on internal data and/or external data.",
"Such review/rating is based at least in part on security criteria, fraud criteria, and/or customer service reputation criteria.",
"Then, card issuer 106 can allow cardholder 104 to select for sending of the second information only to those merchants 108 who card issuer 106 approves based at least in part on such review/rating.",
"In other embodiments, the sending of the second information can be done from one card issuer 106 to another card issuer 106 when cardholder 104 desires that the latter card issuer 106 should be aware of payment information of the former card issuer 106, whether or not, cardholder 104 transacted with the latter card issuer 106 via the former card issuer 106.Aspects of the present disclosure may be embodied as a system, a method, and/or a computer program product.",
"Accordingly, some implementations of the present disclosure may be embodied in an entirely hardware embodiment, an entirely software embodiment (including firmware, resident software, micro-code, and so forth) and/or an embodiment combining software and hardware aspects that may all generally be referred to herein as a “circuit,” “module” or “system.” Furthermore, some implementations of the present disclosure may take the form of a computer program product embodied in at least one computer readable medium having computer readable program code embodied thereon.",
"Any combination of one or more computer readable medium(s) may be utilized.",
"The computer readable medium may be a computer readable signal medium or a computer readable storage medium (including, but not limited to, non-transitory computer readable storage media).",
"A computer readable storage medium may be, for example, but not limited to, an electronic, magnetic, optical, electromagnetic, infrared, or semiconductor system, apparatus, or device, or any suitable combination of the foregoing.",
"More specific examples (a non-exhaustive list) of the computer readable storage medium would include the following: an electrical connection having one or more wires, a portable computer diskette, a hard disk, a random access memory (RAM), a read-only memory (ROM), an erasable programmable read-only memory (EPROM or Flash memory), an optical fiber, a portable compact disc read-only memory (CD-ROM), an optical storage device, a magnetic storage device, or any suitable combination of the foregoing.",
"In the context of the present disclosure, a computer readable storage medium may be any tangible medium that can contain, or store a program for use by or in connection with an instruction execution system, apparatus, and/or device.",
"A computer readable signal medium may include a propagated data signal with computer readable program code embodied therein, for example, in baseband or as part of a carrier wave.",
"Such a propagated signal may take any of a variety of forms, including, but not limited to, electro-magnetic, optical, or any suitable combination thereof.",
"A computer readable signal medium may be any computer readable medium that is not a computer readable storage medium and that can communicate, propagate or transport a program for use by and/or in connection with an instruction execution system, an apparatus and/or a device.",
"Program code embodied on a computer readable medium may be transmitted using any appropriate medium, including but not limited to wireless, wired, optical fiber cable, radio frequency, and so forth, or any suitable combination of the foregoing.",
"Computer program code for carrying out operations for aspects of the present disclosure may be written in any combination of one or more programming languages, including an object-oriented programming language, such as Java, Smalltalk, C#, C++ or the like, and procedural programming languages, such as the “C” programming language or similar programming languages.",
"The program code may execute entirely on the user's computer, partly on the user's computer, as a stand-alone software package, partly on the user's computer and partly on a remote computer or entirely on the remote computer or server.",
"In the latter scenario, the remote computer may be connected to the user's computer through any type of network, including a local area network (LAN) or a wide area network (WAN), or the connection may be made to an external computer (for example, through the Internet using an Internet Service Provider).",
"Aspects of the present disclosure are described below with reference to flowchart illustrations and/or block diagrams of methods, apparatus (systems) and computer program products according to embodiments of the disclosure.",
"Each block of the flowchart illustrations and/or block diagrams, and combinations of blocks in the flowchart illustrations and/or block diagrams, can be implemented by computer program instructions.",
"These computer program instructions may be provided to a processor of a general-purpose computer, special purpose computer, or other programmable data processing apparatus to produce a machine, such that the instructions, which execute via the processor of the computer or other programmable data processing apparatus, create means for implementing the functions/acts specified in the flowchart and/or block diagram block or blocks.",
"These computer program instructions may also be stored in a computer readable medium that can direct a computer, other programmable data processing apparatus, or other devices to function in a particular manner, such that the instructions stored in the computer readable medium produce an article of manufacture including instructions which implement the function/act specified in the flowchart and/or block diagram block or blocks.",
"The computer program instructions may also be loaded onto a computer, other programmable data processing apparatus, or other devices to cause a series of operational steps to be performed on the computer, other programmable apparatus or other devices to produce a computer implemented process such that the instructions which execute on the computer or other programmable apparatus provide processes for implementing the functions/acts specified in the flowchart and/or block diagram block or blocks.",
"The flowchart and block diagrams in the Figures illustrate the architecture, functionality, and operation of possible implementations of systems, methods, and computer program products according to various embodiments of the present disclosure.",
"In this regard, each block in the flowchart or block diagrams may represent a module, segment, or portion of code, which comprises one or more executable instructions for implementing the specified logical function(s).",
"Note that, in some alternative implementations, the functions noted in the block may occur out of the order noted in the figures.",
"For example, two blocks shown in succession may be executed substantially concurrently, or the blocks may sometimes be executed in the reverse order, depending upon the functionality involved.",
"Each block of the block diagrams and/or flowchart illustration, and combinations of blocks in the block diagrams and/or flowchart illustration can be implemented by special purpose hardware-based systems that perform the specified functions or acts, or combinations of special purpose hardware and computer instructions.",
"The flow diagrams depicted herein are just one example.",
"There may be many variations to this diagram or the steps (or operations) described therein without departing from the spirit of the disclosure.",
"For instance, the steps may be performed in a differing order or steps may be added, deleted, and/or modified.",
"All of these variations are considered a part of the claimed disclosure.",
"The corresponding structures, materials, acts, and equivalents of all means or step plus function elements in the claims below are intended to include any structure, material, or act for performing the function in combination with other claimed elements as specifically claimed.",
"The description of the present disclosure has been presented for purposes of illustration and description, but is not intended to be fully exhaustive and/or limited to the disclosure in the form disclosed.",
"Many modifications and variations in techniques and structures are apparent to those of ordinary skill in the art without departing from the scope and spirit of the disclosure as set forth in the claims that follow.",
"Accordingly, such modifications and variations are contemplated as being a part of the present disclosure.",
"The scope of the present disclosure is defined by the claims, which includes known equivalents and unforeseeable equivalents at the time of filing of the present disclosure."
]
] |
Patent_15871342
|
[
[
"MODULAR AZIMUTH THRUSTER",
"The present invention is directed to a modular azimuth thruster for propelling a vessel, having a thruster housing around which water flows, and comprising: a standardized core unit having a core unit housing forming part of the thruster housing, a transmission line arranged within in the core unit housing, comprising a propeller shaft extending in a longitudinal direction of the thruster housing, and a propeller arranged outside the thruster housing and being operationally connected to the propeller shaft.",
"The present invention further relates to a vessel comprising an azimuth thruster and a method of configuring an azimuth thruster."
],
[
"1.An azimuth thruster for propelling a vessel, having a thruster housing around which water flows, and comprising: a standardized core unit having a core unit housing forming part of the thruster housing, a transmission line arranged within in the core unit housing, comprising a propeller shaft extending in a longitudinal direction of the thruster housing, and a propeller arranged outside the thruster housing and being operationally connected to the propeller shaft, wherein, the azimuth thruster is configurable as both a pulling azimuth thruster and a pushing azimuth thruster by comprising first and second hydrodynamic elements mounted on matching first and second core unit interfaces defined by exterior surface areas of the core unit housing, the hydrodynamic elements forming part of the thruster housing to control the flow of water around the thruster housing, and the core unit interfaces being adapted for receiving different hydrodynamic elements having different hydrodynamic properties.",
"2.An azimuth thruster according to claim 1, wherein the transmission line further comprises bearings and gears, all of which are fully contained within the core unit housing.",
"3.An azimuth thruster according to any of claims 1, wherein the thruster housing comprises a stub part, one end of which is adapted for being rotatably mounting on a vessel, and a torpedo part arranged at an opposite end of the stub part, and wherein the hydrodynamic elements constitute a part of both the stub part and of the torpedo part.",
"4.An azimuth thruster according to claim 3, wherein a torpedo section of the core unit housing forming part of the torpedo part, is wider than a stub section of the core unit housing forming part of the stub part in the longitudinal direction of the thruster housing.",
"5.An azimuth thruster according to claim 1, wherein each of the core unit interfaces are defined by one or more end faces of the core unit housing.",
"6.An azimuth thruster according to claim 1, wherein the core unit housing is symmetrical about a plane of symmetry intersecting a centre axis of the core unit housing and extending in a direction transversal to the longitudinal direction of the thruster housing.",
"7.An azimuth thruster according claim 1, wherein the core unit housing is adapted for providing the structural integrity of the azimuth thruster by absorbing structural loads and bearing loads induced by the weight and operation of the azimuth thruster itself and hydro induced forces acting on the thruster housing during use.",
"8.An azimuth thruster according to claim 1, wherein the hydrodynamic elements are made from non-metallic materials, such as composites, polymers, glass- or carbon fibre reinforced polymers or polyurethane.",
"9.An azimuth thruster according to claim 1, wherein the hydrodynamic elements partly overlap or enclose the standardized core unit.",
"10.An azimuth thruster according to claim 1, wherein a maximum width of the core unit housing in the longitudinal direction is ⅓ to ¼ of a maximum width of the thruster housing in the longitudinal direction.",
"11.An azimuth thruster according to claim 1, wherein a t/c-ration of the thruster housing is configurable in the range from 0.2 to 0.6.12.An azimuth thruster according to claim 3, wherein a width of the torpedo part of the core unit housing in the longitudinal direction is 12-17 times the diameter of the propeller shaft.",
"13.An azimuth thruster according to claim 1, wherein a driving means for driving the propeller is an electrical motor in the form of a permanent magnet motor.",
"14.An azimuth thruster according to claim 13, wherein the propeller is rim-driven by first permanent magnets being provided in the propeller nozzle and second permanent magnets being arranged in connection with the propeller thereby providing a bearing for the propeller able to absorb axial and radial loads, and wherein the permanent magnet motor is integrated in the propeller nozzle by the propeller nozzle comprising windings for providing a rotating magnetic field adapted rotate the propeller.",
"15.A vessel comprising an azimuth thruster according to claim 1.16.A method for configuring or re-configuring the hydrodynamic characteristics of an azimuth thruster according to claim 1, comprising the steps of: providing a standardized core unit specifying hydrodynamic characteristics of the azimuth thruster, mounting hydrodynamic elements on the standardized core unit to meet the specified hydrodynamic characteristics.",
"17.A method according to claim 16, further comprising the step of: replacing a first and/or a second hydrodynamic element already mounted on the standardized core unit with a third and/or a fourth hydrodynamic element having different hydrodynamic properties.",
"18.An azimuth thruster according to claim 1, wherein the thruster has a twisted leading edge."
],
[
"<SOH> BACKGROUND OF THE INVENTION <EOH>Azimuth thrusters, also known as pods, pod drives or gondola drives, are propulsion and steering units widely used in maritime vessels.",
"Various configurations of azimuth thrusters are known, and they may be operated as either pushing azimuth thrusters having the propeller mounted in a downstream position, or as pulling azimuth thrusters having the propeller mounted in an upstream direction.",
"Both pushing and pulling azimuth thrusters possess unique advantages and may be preferred in different situations, e.g.",
"dependable on the design and operation of the vessel.",
"Traditionally, azimuth thrusters are made of materials such as cast iron and steel, these materials making thrusters very heavy due to their often considerable size.",
"Heavy thrusters make assembly work and repair a cumbersome operation, often requiring that vessels are put in a dry dock.",
"Also, traditionally, azimuth thrusters are designed and manufactured according to the design and intended operation of a specific vessel.",
"However, during the lifetime of a vessel the design and intended operation may change, making the original azimuth thruster less suitable.",
"Further, as azimuth thrusters are often made to order for a specific vessel, standardization of components is difficult.",
"Consequently component quantities are low, resulting in inefficient production methods and higher production costs.",
"Hence, an improved azimuth thruster would be advantageous, and in particular an azimuth thruster enabling more efficient manufacturing processes, having a reduced weight and providing a more flexible area of use would be advantageous."
],
[
"<SOH> SUMMARY OF THE INVENTION <EOH>Thus, the above described object and several other objects are intended to be obtained in a first aspect of the invention by providing an azimuth thruster for propelling a vessel, having a thruster housing around which water flows, and comprising: a standardized core unit having a core unit housing forming part of the thruster housing, a transmission line arranged within the core unit housing, comprising a propeller shaft extending in a longitudinal direction of the thruster housing, and a propeller arranged outside the thruster housing and being operationally connected to the propeller shaft, wherein, the azimuth thruster is configurable as both a pulling azimuth thruster and a pushing azimuth thruster by comprising first and second hydrodynamic elements mounted on matching first and second core unit interfaces defined by exterior surface areas of the core unit housing, the hydrodynamic elements forming part of the thruster housing to controlling the flow of water around the thruster housing, and the core unit interfaces are adapted for receiving different hydrodynamic elements having different hydrodynamic properties.",
"The invention is particularly, but not exclusively, advantageous for obtaining an azimuth thruster which may be configured as either a pulling azimuth thruster or a pushing azimuth thruster.",
"To achieve this, it is desirable to have hydrodynamic elements on both a downstream facing side and an upstream facing side of the standardized core unit to be able to control the hydrodynamic properties of the thruster housing.",
"In this regard it should be noted that the desired hydrodynamic properties of pulling azimuth thrusters may be very divergent from those of pushing azimuth thrusters.",
"Thus, to be able to control the hydrodynamic properties of the thruster housing by changing the hydrodynamic elements is advantageous.",
"A further advantage in this respect is that the hydrodynamic characteristics of the thruster may be specified late in the production process by only changing hydrodynamic elements.",
"Hereby, a modular thruster concept is achieved, which increases component quantities and ensures an efficient production of tailored azimuth thrusters.",
"In one embodiment of the azimuth thruster, the transmission line further comprises bearings and gears, all of which are fully contained within the core unit housing.",
"By providing an azimuth thruster wherein the propeller shaft is the only part of the transmission line extending from the core unit housing into the surrounding water when the azimuth thruster is mounted on a vessel, only the imperviousness of the standardized core unit has to be ensured.",
"Hereby the design of the connection between the hydrodynamic element and the standardized core unit may be subject to fewer requirements and the hydrodynamic elements may be replaced without concern for the imperviousness of the core unit of the azimuth thruster.",
"Furthermore, the thruster housing may comprise a stub part, one end of which is adapted for being mounting on a vessel, and a torpedo part arranged at an opposite end of the stub part, and wherein the hydrodynamic elements constitute part of both the stub part and part of the torpedo part.",
"Additionally, a torpedo section of the core unit housing forming part of the torpedo part may be wider than a stub section of the core unit housing forming part of the stub part in the longitudinal direction of the thruster housing.",
"By increasing the width of the torpedo section of the core unit housing, the distance between bearings carrying the propeller shaft may be increased, thereby improving the suspension of the propeller shaft.",
"Also, each of the core unit interfaces may be defined by one or more end faces of the core unit housing.",
"Further, the first core unit interface and the second core unit interface may be arranged on opposite sides of the thruster housing, facing in an upstream and a downstream direction, respectively.",
"In addition, the first core unit interface facing in the upstream direction may be substantially parallel with the second core unit interface facing in the downstream direction.",
"Also, the first and the second core unit interface may cover both the part of the core unit housing forming part of the stub part of the thruster housing and the part forming part of the torpedo part of the thruster housing.",
"Additionally, each of the core unit interfaces may be defined by multiple end faces of the core unit housing, the multiple end faces being offset in relation to one another in the longitudinal direction of the thruster housing.",
"In one embodiment of the azimuth thruster, the core unit housing is symmetrical about a plane of symmetry intersecting a centre axis of the core unit housing and extending in a direction transversal to the longitudinal direction of the thruster housing.",
"Furthermore, the core unit housing may be adapted for providing the structural integrity of the azimuth thruster by absorbing structural loads and bearing loads induced by the weight and operation of the azimuth thruster itself and hydro induced forces acting on the thruster housing during use.",
"By the core unit housing absorbing structural loads, bearing loads induced by the weight and operation of the azimuth thruster and hydro induced forces, great flexibility is achieved for the design of the hydrodynamic elements.",
"Also, the core unit housing may be made from cast iron.",
"Moreover, in one embodiment the hydrodynamic elements are made from non-metallic materials, such as composites, polymers, glass- or carbon fibre reinforced polymers or polyurethane.",
"By using materials other than the traditional cast iron and steel a reduction in weight is achieved and the shaping of the hydrodynamic elements is easier.",
"Hereby the implementation of more advanced shapes of hydro dynamic elements is possible.",
"The azimuth thruster described above may further comprise a propeller nozzle encircling the propeller to improve operation and propeller effect.",
"Additionally, the core unit housing may form a minor part of the thruster housing and the hydrodynamic elements may form a major part of the thruster housing.",
"Also, a maximum width of the core unit housing in the longitudinal direction may be ⅓ to ¼ of a maximum width of the thruster housing in the longitudinal direction.",
"By implementing a core unit housing having a relative short width and/or size, the shape of the core unit housing has little impact on the overall hydrodynamic properties of the thruster.",
"Hereby, a common standardized core unit housing for use in various thruster configurations may be achieved.",
"Moreover, a t/c-ration of the thruster housing may be configurable in the range from 0.2 to 0.6.Still further, a width of the torpedo part of the core unit housing in the longitudinal direction may be in the range of 12-17 times a diameter of the propeller shaft.",
"The invention also relates to a vessel comprising an azimuth thruster.",
"Further, the invention relates to a method for configuring or for re-configuring the above described azimuth thruster, the method comprising the steps of: providing a standardized core unit, specifying hydrodynamic characteristics of the azimuth thruster, mounting hydrodynamic elements on the standardized core unit to meet the specified hydrodynamic characteristics.",
"Furthermore, the method may comprise the step of replacing a first and/or a second hydrodynamic element already mounted on the standardized core unit with a third and/or a fourth hydrodynamic element having different hydrodynamic properties.",
"The method for configuring the azimuth thruster clearly illustrates the beneficial effects of the proposed modular azimuth thruster.",
"By using a standardized core unit, the hydrodynamic properties of the entire azimuth thruster may be specified and fixed at a relatively late stage in the manufacturing process.",
"This should be compared to traditional thrusters wherein the hydrodynamic properties are determined earlier by the design of a common thruster housing.",
"Also, the hydrodynamic properties of an already installed azimuth thruster according to the invention, may be re-configured by changing the hydrodynamic elements.",
"The above described aspects of the present invention may each be combined with any of the other aspects.",
"These and other aspects of the invention will be apparent from and elucidated with reference to the embodiments described hereinafter."
],
[
"CROSS-REFERENCE TO RELATED APPLICATIONS This application is a continuation application of U.S. patent application Ser.",
"No.",
"15/024,162 filed Mar.",
"23, 2016, which was the U.S. national stage application of International Patent Application No.",
"PCT/EP2014/070295, filed Sep. 24, 2014, which claims priority of European Patent Application No.",
"13185723.7, filed Sep. 24, 2013, which are all hereby incorporated by reference.",
"FIELD OF THE INVENTION The present invention relates to an azimuth thruster for propelling a vessel, having a thruster housing around which water flows, and comprising: a standardized core unit having a core unit housing forming part of the thruster housing, a transmission line arranged within the core unit housing, comprising a propeller shaft extending in a longitudinal direction of the thruster housing, and a propeller arranged outside the thruster housing and being operationally connected to the propeller shaft.",
"The present invention further relates to a vessel comprising an azimuth thruster and a method of configuring an azimuth thruster.",
"BACKGROUND OF THE INVENTION Azimuth thrusters, also known as pods, pod drives or gondola drives, are propulsion and steering units widely used in maritime vessels.",
"Various configurations of azimuth thrusters are known, and they may be operated as either pushing azimuth thrusters having the propeller mounted in a downstream position, or as pulling azimuth thrusters having the propeller mounted in an upstream direction.",
"Both pushing and pulling azimuth thrusters possess unique advantages and may be preferred in different situations, e.g.",
"dependable on the design and operation of the vessel.",
"Traditionally, azimuth thrusters are made of materials such as cast iron and steel, these materials making thrusters very heavy due to their often considerable size.",
"Heavy thrusters make assembly work and repair a cumbersome operation, often requiring that vessels are put in a dry dock.",
"Also, traditionally, azimuth thrusters are designed and manufactured according to the design and intended operation of a specific vessel.",
"However, during the lifetime of a vessel the design and intended operation may change, making the original azimuth thruster less suitable.",
"Further, as azimuth thrusters are often made to order for a specific vessel, standardization of components is difficult.",
"Consequently component quantities are low, resulting in inefficient production methods and higher production costs.",
"Hence, an improved azimuth thruster would be advantageous, and in particular an azimuth thruster enabling more efficient manufacturing processes, having a reduced weight and providing a more flexible area of use would be advantageous.",
"OBJECT OF THE INVENTION In particular, it may be seen as a further object of the present invention to provide an azimuth thruster that solves the above mentioned problems of the prior art with regard to production, flexibility of use and weight.",
"SUMMARY OF THE INVENTION Thus, the above described object and several other objects are intended to be obtained in a first aspect of the invention by providing an azimuth thruster for propelling a vessel, having a thruster housing around which water flows, and comprising: a standardized core unit having a core unit housing forming part of the thruster housing, a transmission line arranged within the core unit housing, comprising a propeller shaft extending in a longitudinal direction of the thruster housing, and a propeller arranged outside the thruster housing and being operationally connected to the propeller shaft, wherein, the azimuth thruster is configurable as both a pulling azimuth thruster and a pushing azimuth thruster by comprising first and second hydrodynamic elements mounted on matching first and second core unit interfaces defined by exterior surface areas of the core unit housing, the hydrodynamic elements forming part of the thruster housing to controlling the flow of water around the thruster housing, and the core unit interfaces are adapted for receiving different hydrodynamic elements having different hydrodynamic properties.",
"The invention is particularly, but not exclusively, advantageous for obtaining an azimuth thruster which may be configured as either a pulling azimuth thruster or a pushing azimuth thruster.",
"To achieve this, it is desirable to have hydrodynamic elements on both a downstream facing side and an upstream facing side of the standardized core unit to be able to control the hydrodynamic properties of the thruster housing.",
"In this regard it should be noted that the desired hydrodynamic properties of pulling azimuth thrusters may be very divergent from those of pushing azimuth thrusters.",
"Thus, to be able to control the hydrodynamic properties of the thruster housing by changing the hydrodynamic elements is advantageous.",
"A further advantage in this respect is that the hydrodynamic characteristics of the thruster may be specified late in the production process by only changing hydrodynamic elements.",
"Hereby, a modular thruster concept is achieved, which increases component quantities and ensures an efficient production of tailored azimuth thrusters.",
"In one embodiment of the azimuth thruster, the transmission line further comprises bearings and gears, all of which are fully contained within the core unit housing.",
"By providing an azimuth thruster wherein the propeller shaft is the only part of the transmission line extending from the core unit housing into the surrounding water when the azimuth thruster is mounted on a vessel, only the imperviousness of the standardized core unit has to be ensured.",
"Hereby the design of the connection between the hydrodynamic element and the standardized core unit may be subject to fewer requirements and the hydrodynamic elements may be replaced without concern for the imperviousness of the core unit of the azimuth thruster.",
"Furthermore, the thruster housing may comprise a stub part, one end of which is adapted for being mounting on a vessel, and a torpedo part arranged at an opposite end of the stub part, and wherein the hydrodynamic elements constitute part of both the stub part and part of the torpedo part.",
"Additionally, a torpedo section of the core unit housing forming part of the torpedo part may be wider than a stub section of the core unit housing forming part of the stub part in the longitudinal direction of the thruster housing.",
"By increasing the width of the torpedo section of the core unit housing, the distance between bearings carrying the propeller shaft may be increased, thereby improving the suspension of the propeller shaft.",
"Also, each of the core unit interfaces may be defined by one or more end faces of the core unit housing.",
"Further, the first core unit interface and the second core unit interface may be arranged on opposite sides of the thruster housing, facing in an upstream and a downstream direction, respectively.",
"In addition, the first core unit interface facing in the upstream direction may be substantially parallel with the second core unit interface facing in the downstream direction.",
"Also, the first and the second core unit interface may cover both the part of the core unit housing forming part of the stub part of the thruster housing and the part forming part of the torpedo part of the thruster housing.",
"Additionally, each of the core unit interfaces may be defined by multiple end faces of the core unit housing, the multiple end faces being offset in relation to one another in the longitudinal direction of the thruster housing.",
"In one embodiment of the azimuth thruster, the core unit housing is symmetrical about a plane of symmetry intersecting a centre axis of the core unit housing and extending in a direction transversal to the longitudinal direction of the thruster housing.",
"Furthermore, the core unit housing may be adapted for providing the structural integrity of the azimuth thruster by absorbing structural loads and bearing loads induced by the weight and operation of the azimuth thruster itself and hydro induced forces acting on the thruster housing during use.",
"By the core unit housing absorbing structural loads, bearing loads induced by the weight and operation of the azimuth thruster and hydro induced forces, great flexibility is achieved for the design of the hydrodynamic elements.",
"Also, the core unit housing may be made from cast iron.",
"Moreover, in one embodiment the hydrodynamic elements are made from non-metallic materials, such as composites, polymers, glass- or carbon fibre reinforced polymers or polyurethane.",
"By using materials other than the traditional cast iron and steel a reduction in weight is achieved and the shaping of the hydrodynamic elements is easier.",
"Hereby the implementation of more advanced shapes of hydro dynamic elements is possible.",
"The azimuth thruster described above may further comprise a propeller nozzle encircling the propeller to improve operation and propeller effect.",
"Additionally, the core unit housing may form a minor part of the thruster housing and the hydrodynamic elements may form a major part of the thruster housing.",
"Also, a maximum width of the core unit housing in the longitudinal direction may be ⅓ to ¼ of a maximum width of the thruster housing in the longitudinal direction.",
"By implementing a core unit housing having a relative short width and/or size, the shape of the core unit housing has little impact on the overall hydrodynamic properties of the thruster.",
"Hereby, a common standardized core unit housing for use in various thruster configurations may be achieved.",
"Moreover, a t/c-ration of the thruster housing may be configurable in the range from 0.2 to 0.6.Still further, a width of the torpedo part of the core unit housing in the longitudinal direction may be in the range of 12-17 times a diameter of the propeller shaft.",
"The invention also relates to a vessel comprising an azimuth thruster.",
"Further, the invention relates to a method for configuring or for re-configuring the above described azimuth thruster, the method comprising the steps of: providing a standardized core unit, specifying hydrodynamic characteristics of the azimuth thruster, mounting hydrodynamic elements on the standardized core unit to meet the specified hydrodynamic characteristics.",
"Furthermore, the method may comprise the step of replacing a first and/or a second hydrodynamic element already mounted on the standardized core unit with a third and/or a fourth hydrodynamic element having different hydrodynamic properties.",
"The method for configuring the azimuth thruster clearly illustrates the beneficial effects of the proposed modular azimuth thruster.",
"By using a standardized core unit, the hydrodynamic properties of the entire azimuth thruster may be specified and fixed at a relatively late stage in the manufacturing process.",
"This should be compared to traditional thrusters wherein the hydrodynamic properties are determined earlier by the design of a common thruster housing.",
"Also, the hydrodynamic properties of an already installed azimuth thruster according to the invention, may be re-configured by changing the hydrodynamic elements.",
"The above described aspects of the present invention may each be combined with any of the other aspects.",
"These and other aspects of the invention will be apparent from and elucidated with reference to the embodiments described hereinafter.",
"BRIEF DESCRIPTION OF THE FIGURES The azimuth thruster according to the invention will now be described in more detail with regard to the accompanying figures.",
"The figures show one way of implementing the present invention and is not to be construed as being limiting to other possible embodiments falling within the scope of the attached claim set.",
"FIG.",
"1 shows a schematic drawing of an azimuth thruster according to one embodiment of the invention, FIG.",
"2a shows a schematic drawing of a pushing azimuth thruster according to one embodiment of the invention, FIG.",
"2b shows a schematic drawing of a pulling azimuth thruster according to another embodiment of the invention, FIG.",
"3a shows one embodiment of a standardized core unit of an azimuth thruster, FIG.",
"3b shows another embodiment of a standardized core unit of an azimuth thruster, FIG.",
"4 shows a transmission line contained within the core unit housing, FIG.",
"5 shows a pushing azimuth thruster according to one embodiment of the invention, FIG.",
"6 shows a pulling azimuth thruster according to another embodiment of the invention, FIG.",
"7 shows a schematic drawing illustrating an azimuth thruster having a twisted leading edge, FIGS.",
"8a and 8b show different principles for mounting hydrodynamic elements on the core unit, and FIG.",
"9 shows a cross section of a propeller nozzle incorporating a permanent magnet motor.",
"DETAILED DESCRIPTION OF EMBODIMENTS With reference to FIG.",
"1, the figure shows an azimuth thruster 1 for propelling a vessel 17, such as a ship, a floating production platform or the like.",
"The azimuth thruster has a thruster housing 11 around which water flows, and comprises a standardized core unit 2 provided with first and second hydrodynamic elements 4,5 and a propeller 3.The thruster housing 11 comprises a stub part 7 which is adapted for being rotatably mounting on a vessel, and a torpedo part 8 arranged at an opposite end of the stub part.",
"The azimuth thruster 1 is rotatable about a centre axis 12 by one or more operating steering engines 18 provided above the azimuth thruster.",
"Hereby a pulling or pushing force vector of the azimuth thruster can be orientated in a 360 degrees interval about the centre axis 12 The standardized core unit 2 has a core unit housing 21 forming part of the thruster housing 11.A transmission line comprising a propeller shaft 61 and a drive shaft 64 is arranged inside the core unit housing.",
"The transmission line is shown in isolation in FIG.",
"4.The drive shaft 64 extends through the stub part of the thruster housing and into the vessel where it may be operably connected to driving means of the vessel (not shown), such as an onboard combustion engine.",
"The propeller shaft 61 extends in a longitudinal direction 13 of the thruster housing and the propeller 3 is mounted on the drive shaft outside the thruster housing.",
"The propeller shaft 61 is driven by a pinion gear 632 provided on the drive shaft 64, cooperating with a drive gear 631 arranged on the propeller shaft.",
"In another embodiment (not shown) driving means for driving the propeller, such as an electrical motor, may be arranged in the thruster housing of the azimuth thruster.",
"Hereby, the propeller shaft may be directly associated with the driving means, making the drive shaft redundant.",
"As shown in FIG.",
"9, the electrical motor may be a permanent magnet motor arranged in or in connection with the thruster housing.",
"The permanent magnet motor may be integrated in a propeller nozzle 15 of the azimuth thrusters thereby providing a rim-driven propeller.",
"Alternatively, the permanent magnet motor may be arranged in the thruster housing providing an azimuth thruster with a shaft driven propeller.",
"A rim-driven propeller may be implemented by arranging the propeller 3 in a propeller housing 161 provided with second permanent magnets 162 and rotatable arranged inside the propeller nozzle.",
"Along an inner circumference of the propeller nozzle first permanent magnets 163 are arranged, and together the first and second permanent magnets provide a bearing for the propeller housing able to absorb both axial and radial loads.",
"Further, the propeller nozzle constitutes a stator 164 comprising windings for providing a rotating magnetic field adapted to rotate the propeller housing, which constitutes a rotor by comprising permanent magnets.",
"By controlling the current running through the windings, the propeller housing may be rotated and a permanent magnet motor for driving the propeller is provided.",
"The standardized core unit shown in further detail in FIG.",
"2a and FIG.",
"3b, comprises first 9a and second 9b core unit interfaces defined by exterior surface areas of the core unit housing 21.The hydrodynamic elements 4,5 are mounted on the core unit housing at the at first 9a and second 9b core unit interfaces, thereby forming part of the thruster housing.",
"The core unit interfaces are adapted for receiving different hydrodynamic elements having different hydrodynamic properties, i.e.",
"varying shape and size as shown in FIG.",
"2a and FIG.",
"2b.",
"Various principles for the design of the core unit interfaces and for the mounting of the hydrodynamic elements 4, 5 on the core unit housing 21 may be envisaged by the skilled person.",
"For example, the hydrodynamic elements may simply abut on the core unit interfaces 9a, 9b or alternatively partly or fully overlap the core unit housing as shown in FIGS.",
"8a and 8b.",
"FIG.",
"8a shows an azimuth thruster wherein the hydrodynamic elements partly overlap the core unit housing 21.FIG.",
"8b shows an embodiment of the azimuth thruster wherein the standardized core unit 2 and thus the core unit housing 21 are enclosed by the hydrodynamic elements 4,5.The core unit housing 21 may be either partly of fully enclosed by the hydrodynamic elements, whereby the hydrodynamic elements may be joined to one another in one exemplary embodiment.",
"The hydrodynamic elements may be chosen such that the desired hydrodynamic properties of the thruster housing is achieved, but also in accordance with whether the azimuth thruster is a pulling or a pushing azimuth thruster.",
"Hereby, the azimuth thruster is configurable as both a pulling and a pushing azimuth thruster.",
"As shown in the figures, the hydrodynamic elements 4, 5 constitute a part of both the stub part 7 and the torpedo part 8 of the thruster housing, thereby having a substantial impact on the hydrodynamic properties of the azimuth thruster.",
"By varying the shape of the hydrodynamic elements 4, 5, length and surface areas of the thruster housing may thus be controlled.",
"Referring to FIG.",
"7, the hydrodynamic elements may also be used for controlling the t/c-ration of the thruster housing, which is the relationship between the cord length, i.e.",
"the maximum width, Wth of the thruster housing in the longitudinal direction, and the thickness of the thruster housing, i.e.",
"the maximum width of the thruster housing in a transversal direction.",
"A further effect of the modular design is that the hydrodynamic elements may be used to control the twist of the thruster housing, i.e.",
"the position of a leading edge 224 of the thruster housing with respect to a centre axis 131 extending in the longitudinal direction of the thruster housing, as shown in FIG.",
"7.The necessary twist may depend on whether the thruster is a pulling or a pushing thruster, intended speed of the vessel, direction of rotation of the propeller, propeller load, etc.",
"Referring again to FIG.",
"2, it is shown that a torpedo section 81 of the core unit housing forming part of the torpedo part 8, is wider in the longitudinal direction, than a stub section 71 of the core unit housing forming part of the stub part 7.By using such configuration a distance between bearings 62 carrying the propeller shaft 61 may be increased while keeping the width of the stub part of the core unit housing at a minimum.",
"From FIG.",
"2b it is also seen that a maximum width, Wcu of the core unit housing in the longitudinal direction is ⅓ to ¼ of a maximum width, Wth of the thruster housing in the longitudinal direction.",
"Reducing the width of the core unit housing in general, reduces the impact of the core unit housing on the overall hydrodynamic properties of the thruster housing.",
"A further advantageous effect of the increased width of the torpedo section 81 of the standardized core unit is that each of the core unit interfaces 9a, 9b are defined by multiple end faces 222 of the core unit housing being offset in relation to one another.",
"This configuration of the core unit interfaces may result in the creation of an improved connection between the core unit housing and the hydrodynamic elements.",
"FIG.",
"2a and FIG.",
"5 show azimuth thrusters configured as a pushing azimuth thruster indicated by the direction of the arrow.",
"The pushing azimuth thruster has the propeller mounted on a downstream side of the thruster housing.",
"In the embodiment shown in FIG.",
"5, the thruster further comprises a propeller nozzle 15 encircling the propeller to improve operation and propeller effect.",
"FIG.",
"2b and FIG.",
"6 both show azimuth thrusters configured as a pulling azimuth thruster indicated by the direction of the arrow.",
"The pulling azimuth thruster has the propeller mounted on an upstream side of the thruster housing and the thruster may further be provided with a fin element 16 extending from the torpedo part in order to increase a total exterior surface area of the thruster housing.",
"As shown in FIG.",
"1 and described above, the azimuth thruster extends from a vessel 17 comprising one or more steering engines 18 for turning the thruster.",
"In one embodiment the steering engine(s) may be an electrical of hydraulic motor cooperating with a gear rim (not shown) provided at an end of the stub part 7 rotatably mounted on the vessel.",
"When dimensioning the mounting for the azimuth thruster including the steering engine, the torque required for turning the azimuth thruster should be considered.",
"The torque required to turn the azimuth thruster depends on several variables such as the hydrodynamic properties of the thruster housing, thruster rotation rate, propeller rotation and vessel speed.",
"In this regard EP1847455A1 discloses an azimuth thruster wherein a pinion gear driving the propeller axis, produces a torque that acts against a resistance torque of the azimuth thruster associated with turning the thruster during operation.",
"Hereby, the torque generated by rotation of the pinion gear is used to counter act the torque resistance of the thruster, thereby reducing the torque required to turn the azimuth thruster during operation.",
"This, in turn, may result in a reduction in the size and/or number of steering engines required to turn the azimuth thruster.",
"Further, if an azimuth thruster according to the invention is to be used as both a pulling and a pushing azimuth thruster, the skilled person will know that the mounting should be dimensioned according to the forces action on the azimuth thruster when in pull configuration.",
"This is due to the general observation that the torque required to turn a pulling azimuth thruster is larger than the torque required for turning a corresponding pushing azimuth thruster.",
"In the following, a method for configuring, i.e.",
"manufacturing from standardized components, embodiments of the above described azimuth thruster will be described in further detail.",
"Various embodiments of both pushing and pulling azimuth thrusters having unique hydrodynamic properties may be configured based on the same standardized core unit 2.To produce an azimuth thruster according to the invention a standardized core unit 2 is provided.",
"Variations of a standardized core unit may exist in that the mount for the propeller 3 may be provided on either side of the core unit housing 21, and the composition and dimensioning of the transmission line may vary.",
"Secondly, it is determined whether the specific azimuth thruster 1 should be of the pushing or the pulling type, and the desired hydrodynamic characteristics are specified.",
"Based on the specified hydrodynamic characteristics of the azimuth thruster, the appropriate hydrodynamic elements 4, 5 are chosen and mounted on the standardized core unit.",
"A considerable advantageous effect in this respect is that a customised azimuth thruster 1 may be build based on standardized components.",
"One advantage of using standardized components is that product variation is introduced late in the end product process.",
"Standardized components can thus be produced before the exact specifications of the future azimuth thrusters are known.",
"Hereby, the production time from order to delivery may be reduced and the use of standardized components may increase quantities.",
"By increasing quantities, a more efficient production process may be utilized.",
"Especially, when it comes to the use of composite or non-metallic materials for the hydrodynamic elements, efficient productions processes are of crucial importance.",
"Making customised azimuth thrusters from composite material without the use of standardized components is very cost ineffective and uncompetitive.",
"In order to be able to use composite or non-metallic materials in azimuth thrusters, it is therefore crucial that standardized components are integrated in the design.",
"A further advantage of an azimuth thruster 1 according to the invention is that the azimuth thruster may be re-configured by replacing one or both of the hydrodynamic elements 4, 5 already mounted on the standardized core unit.",
"If for example the design is altered of a vessel on which the azimuth thruster 1 is mounted, or the pattern of use changes, it may be advantageous to change the hydrodynamic properties of the azimuth thruster 1.In particular, an azimuth thruster according to an embodiment of the invention may be re-configured to alter the twist or the t/c-ration of the thruster housing.",
"Instead of having to install a completely new azimuth thruster on the vessel, the hydrodynamic properties of an azimuth thruster according to the present invention may be changed by simply changing the hydrodynamic elements 4, 5.As would be readily understood by the person skilled in the art, for an azimuth thruster to be configurable as both a pushing and a pulling azimuth thruster, both the shape of a leading part and a trailing part of the thruster housing must be controllable to arrive at an azimuth thruster having optimal hydrodynamic properties.",
"This is achieved by the present invention by the use of hydrodynamic elements arranged on both sides of the core unit housing.",
"Although the present invention has been described in connection with the specified embodiments, it should not be construed as being in any way limited to the presented examples.",
"The scope of the present invention is set out by the accompanying claim set.",
"In the context of the claims, the terms “comprising” or “comprises” do not exclude other possible elements or steps.",
"Also, the mentioning of references such as “a” or “an” etc.",
"should not be construed as excluding a plurality.",
"The use of reference signs in the claims with respect to elements indicated in the figures shall also not be construed as limiting the scope of the invention.",
"Furthermore, individual features mentioned in different claims, may possibly be advantageously combined, and the mentioning of these features in different claims does not exclude that a combination of features is not possible and advantageous."
]
] |
Patent_15871355
|
[
[
"Conductivity Modulated Drain Extended MOSFET",
"An integrated circuit is fabricated on a semiconductor substrate.",
"An insulated gate bipolar transistor (IGBT) is formed upon the semiconductor substrate in which the IGBT has an anode terminal, a cathode terminal, and a gate terminal, and a drift region.",
"A diode is also formed on the s5emiconductor substrate and has an anode terminal and a cathode terminal, in which the anode of the diode is coupled to the anode terminal of the IGBT and the cathode of the diode is coupled to the drift region of the IGBT."
],
[
"1.An integrated circuit comprising: a semiconductor substrate an insulated gate bipolar transistor (IGBT) formed upon the semiconductor substrate in which the IGBT has an anode terminal, a cathode terminal, and a gate terminal, and an extension region; and a diode having an anode terminal and a cathode terminal, in which the anode of the diode is coupled to the anode terminal of the IGBT and the cathode of the diode is coupled to the drift region of the IGBT.",
"2.The integrated circuit of claim 1, further including a resistive element coupled between the anode terminal of the IGBT and the anode terminal of the diode.",
"3.The integrated circuit of claim 1, further including an n+ region formed in the extension region, in which the cathode of the diode is connected to the n+ region.",
"4.The integrated circuit of claim 1, in which the diode is formed by a p+ region formed within a deep n-type ring formed in the semiconductor substrate and surrounding the IGBT.",
"5.The integrated circuit of claim 4, further including a buried n-type layer, in which the deep n-type ring is in contact with the buried n-type layer.",
"6.The integrated circuit of claim 1, further including control circuitry that lies within the semiconductor material substrate with at least one output signal coupled to the gate terminal of the IGBT.",
"7.The integrated circuit of claim 1, in which the IGBT is a lateral IGBT.",
"8.The integrated circuit of claim 1, in which the IGBT has at least one finger, in which the at least one finger has a linear topology.",
"9.A method for fabricating a transistor in an integrated circuit, the method comprising: forming an extended n-type region in an epitaxial layer of a semiconductor substrate; diffusing a p-type region stripe into the epitaxial layer of a semiconductor substrate, and a substantially parallel n-type region stripe into the extended n-type region such that a channel region stripe is located substantially parallel to and between the p-type region stripe and the n-type region stripe; forming a p+ region in the n-type region; fabricating a diode element upon the semiconductor substrate; and forming an interconnect to couple an anode of the diode to the p+ region.",
"10.The method of claim 9, further including fabricating a resistive element upon the semiconductor substrate; and in which the interconnect is formed to couple the resistive element in series with the anode of the diode and the p+ region of the transistor.",
"11.A transistor comprising: a semiconductor substrate; an n-type extended region adjacent a p-type dwell region within the semiconductor substrate; an n-type region formed within the p-type dwell region; an insulated conductive gate lying above the dwell region configured to control a channel region in the p-type dwell region; a deep n-type layer buried in the semiconductor substrate below the n-type extended region; a heavily doped deep n-type region adjacent the n-type extended region, in which the deep n-type region is in contact with the buried n-type layer; and a p+ region formed in the deep n-type layer."
],
[
"<SOH> BACKGROUND <EOH>An insulated-gate bipolar transistor (IGBT) is a three-terminal power semiconductor device primarily used as an electronic switch.",
"It combines high efficiency and fast switching.",
"IGBTs switch electric power in many modern appliances: variable-frequency drives (VFDs), electric cars, trains, variable speed refrigerators, lamp ballasts, air-conditioners, and even stereo systems with switching amplifiers, etc.",
"Since it is designed to turn on and off rapidly, amplifiers that use it often synthesize complex waveforms with pulse-width modulation and low-pass filters.",
"In switching applications, modern devices feature pulse repetition rates well into the ultrasonic range—frequencies which are at least ten times the highest audio frequency handled by the device when used as an analog audio amplifier.",
"The IGBT combines the simple gate-drive characteristics of a metal oxide semiconductor field effect transistor (MOSFET) with the high-current and low-saturation-voltage capability of a bipolar transistor.",
"The IGBT combines an isolated-gate FET for the control input and a bipolar power transistor as a switch in a single device.",
"Large IGBT modules typically include many devices in parallel and can have very high current-handling capabilities in the order of hundreds of amperes with blocking voltages of 6000 V. These IGBTs can control loads of hundreds of kilowatts.",
"Various structures for IGBTs, such as: planar IGBTs, trench IGBTs, and lateral IGBTs, have been designed to customize the operational properties of the device for particular applications.",
"For example, planar or vertical IGBTs utilize a convenient structure for a high power (e.g., high voltage and high current) switch.",
"The planar IGBT includes a collector at a bottom side, a gate at a top side, and an emitter surrounding the gate at the top side.",
"Trench gate IGBTs have a similar general structure to the planar IGBTs.",
"However, trench IGBTs include a trench within which the gate is situated.",
"The trench reduces the on-state voltage drop of the device.",
"The current path of planar and trench IGBTs is vertical from the collector to the emitter.",
"Lateral IGBTs (LIGBT) are often employed in lower power control and detection circuits.",
"Lateral IGBTs do not utilize the vertical structure of the planar and trench IGBTs, where collector and emitter contacts are provided on the top and on the bottom of the semiconductor material.",
"Instead, lateral IGBTs generally include a substrate contact at a bottom side, a collector at one side of a top side, an emitter at the other side of the top side, and a gate disposed between the emitter and the collector at the top side.",
"The current path of lateral IGBTs is horizontal (e.g., lateral) within the device from the collector to the emitter."
],
[
"<SOH> BRIEF DESCRIPTION OF THE DRAWINGS <EOH>Particular embodiments in accordance with the disclosure will now be described, by way of example only, and with reference to the accompanying drawings: FIG.",
"1 is a schematic of an IGBT; FIGS.",
"2-5 are top views and cross sections of embodiments of an LIGBT with a n+ injection region in the anode; FIG.",
"6 is a plot illustrating improvements in saturation current flow through the LIGBT of FIG.",
"5 ; FIGS.",
"7-9 illustrate a schematic, a top view, and a cross sectional view of another embodiment of an LIGBT with a p+ injection region; FIG.",
"10 is a cross sectional view of another embodiment of an LIGBT; FIG.",
"11 is a flow chart illustrating a method for fabricating an LIGBT; and FIG.",
"12 is a block diagram of an integrated circuit that includes an LIGBT.",
"detailed-description description=\"Detailed Description\" end=\"lead\"?",
"Other features of the present embodiments will be apparent from the accompanying drawings and from the detailed description that follows."
],
[
"CROSS REFERENCE TO RELATED APPLICATIONS Under 35 U.S.C.",
"§§ 120, 121, this divisional application claims priority to and benefits of U.S. patent application Ser.",
"No.",
"15/387,992 (TI-77434), filed on Dec. 22, 2016, the entirety of which are hereby incorporated herein by reference.",
"TECHNICAL FIELD OF THE DISCLOSURE This disclosure relates drain extended MOSFETS, and in particular to insulated-gate bipolar transistors.",
"BACKGROUND An insulated-gate bipolar transistor (IGBT) is a three-terminal power semiconductor device primarily used as an electronic switch.",
"It combines high efficiency and fast switching.",
"IGBTs switch electric power in many modern appliances: variable-frequency drives (VFDs), electric cars, trains, variable speed refrigerators, lamp ballasts, air-conditioners, and even stereo systems with switching amplifiers, etc.",
"Since it is designed to turn on and off rapidly, amplifiers that use it often synthesize complex waveforms with pulse-width modulation and low-pass filters.",
"In switching applications, modern devices feature pulse repetition rates well into the ultrasonic range—frequencies which are at least ten times the highest audio frequency handled by the device when used as an analog audio amplifier.",
"The IGBT combines the simple gate-drive characteristics of a metal oxide semiconductor field effect transistor (MOSFET) with the high-current and low-saturation-voltage capability of a bipolar transistor.",
"The IGBT combines an isolated-gate FET for the control input and a bipolar power transistor as a switch in a single device.",
"Large IGBT modules typically include many devices in parallel and can have very high current-handling capabilities in the order of hundreds of amperes with blocking voltages of 6000 V. These IGBTs can control loads of hundreds of kilowatts.",
"Various structures for IGBTs, such as: planar IGBTs, trench IGBTs, and lateral IGBTs, have been designed to customize the operational properties of the device for particular applications.",
"For example, planar or vertical IGBTs utilize a convenient structure for a high power (e.g., high voltage and high current) switch.",
"The planar IGBT includes a collector at a bottom side, a gate at a top side, and an emitter surrounding the gate at the top side.",
"Trench gate IGBTs have a similar general structure to the planar IGBTs.",
"However, trench IGBTs include a trench within which the gate is situated.",
"The trench reduces the on-state voltage drop of the device.",
"The current path of planar and trench IGBTs is vertical from the collector to the emitter.",
"Lateral IGBTs (LIGBT) are often employed in lower power control and detection circuits.",
"Lateral IGBTs do not utilize the vertical structure of the planar and trench IGBTs, where collector and emitter contacts are provided on the top and on the bottom of the semiconductor material.",
"Instead, lateral IGBTs generally include a substrate contact at a bottom side, a collector at one side of a top side, an emitter at the other side of the top side, and a gate disposed between the emitter and the collector at the top side.",
"The current path of lateral IGBTs is horizontal (e.g., lateral) within the device from the collector to the emitter.",
"BRIEF DESCRIPTION OF THE DRAWINGS Particular embodiments in accordance with the disclosure will now be described, by way of example only, and with reference to the accompanying drawings: FIG.",
"1 is a schematic of an IGBT; FIGS.",
"2-5 are top views and cross sections of embodiments of an LIGBT with a n+ injection region in the anode; FIG.",
"6 is a plot illustrating improvements in saturation current flow through the LIGBT of FIG.",
"5; FIGS.",
"7-9 illustrate a schematic, a top view, and a cross sectional view of another embodiment of an LIGBT with a p+ injection region; FIG.",
"10 is a cross sectional view of another embodiment of an LIGBT; FIG.",
"11 is a flow chart illustrating a method for fabricating an LIGBT; and FIG.",
"12 is a block diagram of an integrated circuit that includes an LIGBT.",
"Other features of the present embodiments will be apparent from the accompanying drawings and from the detailed description that follows.",
"DETAILED DESCRIPTION OF EMBODIMENTS OF THE DISCLOSURE Specific embodiments of the disclosure will now be described in detail with reference to the accompanying figures.",
"Like elements in the various figures are denoted by like reference numerals for consistency.",
"In the following detailed description of embodiments of the disclosure, numerous specific details are set forth in order to provide a more thorough understanding of the disclosure.",
"However, it will be apparent to one of ordinary skill in the art that the disclosure may be practiced without these specific details.",
"In other instances, well-known features have not been described in detail to avoid unnecessarily complicating the description.",
"Drain extended MOS devices may show compression in the output characteristics at low drain currents due to high injection effects in the drain extension regions.",
"Drain extended devices may have limited saturated drain current (IDSAT) due to the low doping in the drain extension.",
"The drain extension region also affects die size for large current drivers.",
"An IGBT device may enhance the ON-current of the drain extended devices by injecting minority carriers into the drain extension region by introducing a p+ region into the drain extension.",
"Conductivity modulation may be obtained by effectively using the p+ region in the drain extension as the drain.",
"Experiments have demonstrated a 3× improvement in IDSAT using this configuration.",
"A lateral IGBT construction is disclosed herein that allows for independently improving the inherent diode for performance optimization.",
"Another embodiment allows for adjusting the injection levels and PNP gain for improving safe operating area (SOA).",
"In another embodiment, robustness against SCR (silicon controlled rectifier) action may be provided by controlling the amount of minority carrier injection into the drain extension region.",
"In effect, the gain of the pnp portion of the IGBT may be reduced in order to inhibit SCR action and allow safe operation over a wider range of voltage and current.",
"The solution is highly area efficient and widely applicable.",
"Embodiments of this disclosure may provide smaller devices, particularly with regards to electro-static discharge (ESD) circuits.",
"FIG.",
"1 is a schematic of a well known IGBT 100.The general operation of an IGBT is well known and need not be described in detail herein, see, for example: “Novel Power Devices for Smart Power Applications,” Jong Mun Park, 2004.A brief description will be included herein in order to explain the improvements disclosed herein.",
"A major limitation of a laterally diffused MOSFET (LDMOSFET) is their relatively high specific on-resistance (Rsp) due to the majority carrier conduction mechanism.",
"The IGBT is a relatively new power device which is designed to overcome the high on-state loss of power MOSFETs.",
"The device is essentially a combination of a pnp bipolar structure 101 which provides high current handling capability, and an n-channel MOSFET 102 which gives a high-impedance voltage control over the bipolar base current.",
"It can be fabricated as either a high-power discrete vertical IGBT or a low-power lateral IGBT (LIGBT).",
"LIGBTs may be integrated together with low voltage control circuitry on a single integrated circuit.",
"The structure of LIGBT 100 is similar to that of an LDMOSFET in that the gate is also formed by double diffusion.",
"The main difference between an LIGBT structure and an LDMOSFET is that the LIGBT has a p+ anode 103 instead of the n+ drain of an LDMOSFET.",
"In this structure, current flow cannot occur when a negative voltage is applied to the anode with respect to the cathode 105, because the emitter junction J1 becomes reverse biased.",
"Emitter junction J1 is the junction between emitter anode (E) and the n-buffer base region (B).",
"This provides the device with its reverse blocking state, and the depletion region extends in the n-drift region.",
"When a positive voltage is applied to the anode 103 with the gate shorted to the cathode, a collector junction J2 (n-drift and p-well junction) becomes reverse biased and the device operates in its forward blocking state.",
"Generally, the substrate is electrically connected to the source contact.",
"When a positive gate voltage above the threshold voltage is applied to gate 104 with respect to the cathode (source) 105, an inversion channel is formed that connects the n+ cathode 105 to the n drift region.",
"This creates the base current of the lateral pnp structure 101 in the LIGBT structure.",
"If a positive voltage is applied between the p+ anode 103 and cathode 105, most of the voltage drops across J1, until the junction becomes forward biased.",
"Under forward bias any additional increase in voltage drops across the channel and the drift region.",
"The holes from the anode are injected into the n drift region and electrons flow into the drift region from the source through the channel.",
"Because of the injected electrons and holes, the n drift region becomes conductivity modulated.",
"With further increase in the anode voltage, more voltage drops across the inversion channel and the electron current increases to compensate for the increased hole current.",
"If the hole concentration exceeds the background doping level of the n drift region, the device characteristics are similar to those of a forward biased pin diode.",
"As a result, it can be operated at a higher current density compared to conventional LDMOSFETs.",
"If the inversion layer conductivity is reduced by the gate bias close to the threshold voltage, a significant voltage drop occurs across the channel.",
"When this voltage drop becomes comparable to the difference between the gate bias and the threshold voltage, the channel is pinched-off.",
"At this point, the electron current saturates.",
"As a result, the device operates with current saturation in its active region with a gate controlled output current.",
"In order to switch off the device, it is necessary to discharge the gate by shorting it to the cathode.",
"When the gate to cathode voltage is reduced to zero, the device is switched from its on-state to off-state; the current will fall to a fraction of the steady state value due to the cut-off of the electron current.",
"LIGBTs are susceptible to latch-up in the same way as discrete IGBTs because of an inherent parasitic pnpn thyristor in the device.",
"At high current levels, the voltage drop across the cathode-body junction is sufficient to turn the parasitic npn structure on.",
"The collector current of the npn structure forms the base current for the lateral pnp structure.",
"When the sum of the current gains of the two structures reaches unity, latch-up occurs and gate control is lost.",
"A known method to suppress latch-up is aimed at lowering the gain of the npn structure by using a p+ buried layer and a deep p+ sinker together with the n buffer layer at the cathode region.",
"This n buffer can help to reduce charge injection by controlling the emitter efficiency of the device.",
"FIG.",
"2 is a schematic of an embodiment of an LIGBT 200 with an n+ injection region in the anode.",
"LIGBT 200 is similar to LIGBT 100 of FIG.",
"1.LIGBT 200 is essentially a combination of a pnp bipolar structure 201 which provides high current handling capability, and an n-channel MOSFET 202 which gives a high-impedance voltage control over the bipolar base current.",
"Current flow cannot occur when a negative voltage is applied to the anode 203 with respect to the cathode 205, because the emitter junction J1 becomes reverse biased.",
"Emitter junction J1 is the junction between emitter anode (E) and the n-buffer base region (B).",
"A control voltage applied to gate 204 controls current flow through LIGBT 200 in a similar manner as described with reference to FIG.",
"1 for LIGBT 100.A problem with LIGBTs is that current flow may be limited by the voltage drop across intrinsic diode J1.In this case, it may be desirable to increase the size of the J1 diode, but this would in turn increase the size of the entire LIGBT 200.In this embodiment, an n+region is added to the drain region to allow a contact point 212 for an additional external diode 211 that may be added essentially in parallel with intrinsic diode J1.The other end of diode 211 may be coupled to a pad 210 that is also coupled to anode 203.Pad 210 may then be coupled to a supply voltage, for example.",
"Diode 211 may be sized to handle a portion of a load current, in which case a portion 11 flows through the anode 203 and intrinsic junction J1 and a portion 12 flows through external diode 211.Total voltage drop across the two parallel diodes is less because current density is lower.",
"FIG.",
"3 is a cross sectional view of LIGBT 200.Semiconductor substrate 320 may be derived from a silicon wafer, for example.",
"The growing and processing of silicon wafers is well known, so only a brief summary will be provided herein.",
"An epitaxial (“epi”) layer 321 may be grown across the top surface of substrate 321.Epi layer 321 and substrate 320 are typically doped to be p-type, with a dopant concentration typically in a range of 1E16-5E17/cm3.A buried n-type layer 322 may be implanted in epi 321.A deep n-type well (dnwell) 323 may be formed in epi 321 by diffusion or implantation, for example.",
"Dnwell 323 forms the drain extension region for LIGBT 200.Dnwell 323 is a part of the drift region consistent with the above description.",
"Alternatively, the epi layer 321 may be doped n-type and function as the drain extension for LIGBT 200.A heavier doped shallow nwell (SNW) 331 may be formed in dnwell 323 to form the drain region.",
"SNW 331 may also be a part of the drift region consistent with the above description.",
"P+ region 334 is formed in SNW 331 and it may serve as the anode 203, referring back to FIG.",
"2.P+ region 334 may be doped at a concentration of greater than 1E19/cm3, for example.",
"SNW 331 may be doped at a concentration of approximately 3-5E17/cm3, for example.",
"Deep n-type well 323 may be doped at a concentration of approximately 1-2E16/cm3, for example.",
"Double diffused well (dwell) 333 is a p-type diffusion and may be doped at a concentration of approximately 1E18, for example.",
"N-type region 335 is formed within dwell 333 and may serve as the source region for the MOS structure 202, referring back to FIG.",
"2.P+ type contact region 337 is formed in n-type region 335 and in contact with p-type dwell 333 and it may serve as the cathode 205, referring back to FIG.",
"2.P+ region 334 may also serve as an emitter, whereas the n-type region 331 and n-type extension region 323 may act as a base, and whereas p-type dwell 333 may serve as a collector to form pnp structure 201, referring back to FIG.",
"2.P+ region 334 and n-type region 331 form intrinsic diode junction J1, referring back to FIG.",
"1.A channel region 324 lies between drain extension region 323 and source region 335 and is covered by a thin gate oxide.",
"Polysilicon gate structure 325 is formed over channel region 324 to form MOSFET 202, referring back to FIG.",
"2.In this example, LIGBT 200 is a double sided device, in that there is a second SNW drain 332 with p+ anode 339 formed in dnwell 323 as another parallel drain.",
"Polysilicon gate structure 326 may be a mirror image of gate 325.In this embodiment, an n+ contact 336, 338 is provided in drain/base regions 331, 332 to allow an external diode 211 to be coupled to pad 210 in parallel with the intrinsic emitter junction J1, as discussed above with regard to FIG.",
"2.N+ contact 336, 338 may be doped at a concentration of greater than 1E19/cm3, for example.",
"FIG.",
"4 is a top view of an example multi-finger LIGBT transistor 200.In this example, metal interconnect layers have been removed in order to more clearly see an aspect of the underlying structure.",
"A first finger of transistor 200 includes a source region stripe 335 and a substantially parallel drain region stripe 331 with p+ anode region 334 (see FIG.",
"3) that lie within semiconductor substrate material 320.In this example, a second substantially parallel drain region stripe 332 with p+ anode region 339 (see FIG.",
"3) shares source region stripe 335 In some embodiments, there may be only one finger that may include only one source region stripe 335 and one drain region stripe 331, for example.",
"In other embodiments, there may be only one finger that may include only one source region stripe 335 and two drain region stripes 331, 332, for example.",
"In yet other embodiments, there may be multiple fingers in which additional substantially parallel source region stripes 435 and drain region stripes 439 are included.",
"In the case of multiple source and drain region stripes, conductive interconnects may be used to connect the drain region stripes 331, 332, 439, etc in parallel and to connect the source region stripes 335, 435, etc in parallel to form a single transistor with multiple parallel fingers.",
"The conductive interconnects may be metallic, for example.",
"In other embodiments, the conductive interconnects may be polysilicon, silicide, or other known or later developed conductive interconnect materials.",
"Semiconductor substrate material 320 is typically silicon; however other embodiments of the disclosure may be applied to other semiconductor materials, such as germanium, etc.",
"A channel region stripe is located substantially parallel to and between each of the source region stripes and the drain region stripes.",
"Each channel region has a width 401, and the total effective channel width of device 200 is the sum of the widths of all of the channel regions of all of the fingers.",
"As described above with regard to FIG.",
"2, a set of n+ contacts 336, 338 may be provided in each drain region 331, 332, 432 to allow coupling to an external diode, such as diode 211 of FIG.",
"2.FIG.",
"5 is a schematic of another embodiment in which LIGBT 200 has a resistor 540 coupled in series with anode 203.Resistor 540 may allow a reduction in SCR latching action and therefore allow safe operation over a wider range of voltage and current.",
"As mentioned with regard to FIG.",
"1, one way to reduce SCR action is to provide heavy p-type doping in the source region dwell.",
"In this embodiment, resistor 540 allows a reduction in the current that flows through anode 203 and that contributes to SCR action.",
"This current reduction may be compensated by an extra current that is allowed to flow through external diode 211 that does not contribute to SCR action.",
"Resistor 540 may be implemented using known integrated circuit fabrication techniques, such as an element using a bulk resistance of a doped semiconductor region, a polysilicon element, an MOS device biased in the ohmic region, a metallic element, etc.",
"FIG.",
"6 is a plot illustrating improvements in current flow through LIGBT 200 of FIG.",
"5.In this example, the term “anode current” includes both the current that flows through anode contact 203 and the current that flows through second diode 211.Plot lines 601 illustrate anode current Ianode for gate to source voltages of 5 v and 6 v, but with no resistor 540.Plot line 602 illustrates anode current Idrain for gate to source voltages of 6 v with a 50 ohm resistor 540.Plot lines 603 illustrate anode current Idrain for gate to source voltages of 6 v and 7 v with a 10 ohm resistor 540.Plot lines 603 illustrate approximately a 30% increase in anode saturation current over plot lines 601.FIG.",
"7 is a schematic of an embodiment of an LIGBT 700 with a p+ injection region 712 in a deep n-type ring that surrounds LIGBT 700.In this case, second diode 711 may be included as part of LIGBT 700.This approach may require less space than using a separate diode; however, this embodiment may not be amenable to using a resistor in series with the anode to reduce SCR action, as described above in FIG.",
"5.FIG.",
"8 is a cross sectional view of LIGBT 700.In this embodiment, the n+contact regions may be removed from drift/base region 331, 332.A heavily doped deep n-type ring 840 may be implemented that goes down and joins buried n layer 321.Deep n ring 840 may surround LIGBT 700, for example.",
"A p+ contact 836 is then formed in deep n ring 840 and may be coupled to pad 210, for example.",
"In this manner, second diode 711 is formed by the junction of p+ 836 and heavily doped deep n ring 840.In this case, current 841 may be injected into deep n ring 840, flow down to buried n layer 321, then flow up into drain/base region 331 and then to source/cathode 335.FIG.",
"9 is a top view of LIGBT 700 illustrating deep n ring 840 with p+ contact 836 which surrounds the multi-finger LIGBT device.",
"FIG.",
"10 is a cross sectional view of another embodiment of an LIGBT 1000.As mentioned earlier with regard to FIG.",
"5, added resistance 540 does not work for controlling SCR action with the integrated approach in which the second diode is formed in the deep n ring, as described with regard to FIG.",
"7.The drain extension region 323 is by necessity low doped to support voltage; therefore the pnp portion of an LIGBT with an integrated second diode may have a high gain and cause more scr formation.",
"In the embodiment of FIG.",
"10, the p+ anode is removed from the drain extension and placed in a heavily doped deep n-type region 1031, 1032 that goes down and joins deep n layer 321.The effective gain of the intrinsic pnp structure may be controlled by how much the deep n region overlaps the p+ region 1034, 1039, as indicated by arrow 1042.If it overlaps just a little bit, then there is only a small base region that results in a higher gain pnp structure.",
"However, if the deep n region 1031, 1032 overlaps the p+ regions 1034, 1039 by a lot, then the effective gain of the intrinsic pnp structure is reduced and SCR action is thereby reduced and SOA is improved.",
"For example, since the deep n-type region 1031 diffuses a lot, coincidence with p+ 1034 by using a same mask for both diffusions may provide a sufficient overlap.",
"In an 0.18 um process, a 2 um overlap may be effective to prevent SCR action.",
"In this case, all of the anode current 1041 goes down to the nbl 321, and then gets collected by cathode 1037 in dwell 333.This can be done without reducing performance of LIGBT 1000 because the benefit of modulating the conductance of the drain extension region under control of the gate is still realized, which is what is limiting the current, but at the same time the tendency to turn on SCR action is reduced.",
"FIG.",
"11 is a flow chart illustrating a method for forming a second diode in an LIGBT transistor, such as LIGBT transistor 700 of FIGS.",
"7-9.As mentioned above, the general operation of LIGBT transistors is well known.",
"Similarly, the semiconductor process for fabricating an LIGBT transistor is well known.",
"Therefore, only the key fabrication steps based on this disclosure will be described in detail herein.",
"Initially, a semiconductor wafer is processed to form an epitaxial layer on top of the semiconductor wafer in step 1101.Nwell, pwell, and dwell regions are then patterned and diffused into the epi layer, as illustrated in FIG.",
"8, using known or later developed fabrication techniques.",
"A mask is then applied in step 1102 to form field oxide regions.",
"An oxidation step is then performed to grow the thick field oxide in the drift regions and source regions as illustrated in FIG.",
"8.A thin gate oxide layer may then be grown over the wafer.",
"A p+ region, such as 836 in FIG.",
"8, may then be formed in step 1103 in a deep n well region such as 840, which surrounds the LIGBT device to form a second diode junction such as diode 711 of FIG.",
"7.Additional diffusions may be performed in step 1104 to form the p+ and n+ drain and source region stripes described in more detail above with regards to FIGS.",
"8, 9.Additional fabrication steps may then be performed in step 1105 to deposit a polysilicon layer and etch it to form the polysilicon gate structures, followed by one or more insulative layers and conductive layers that are patterned and etched to form interconnects, etc.",
"Vias and contacts may be formed between the metal interconnects and the polysilicon gate structures.",
"After the semiconductor processing is completed, wafer testing is performed in step 1106, followed by a sawing operation to separate the die, packaging, and final testing of the integrated circuit.",
"System Example FIG.",
"12 is a block diagram of an example system with integrated circuit (IC) 1200 that includes an LIGBT device.",
"In this example, two LIGBT devices 1201, 1202 are included, each of which may be similar to the LIGBT devices described with regard to FIGS.",
"1-10.Control logic 1203 may also be included within IC 1200.Control logic may be tailored to perform a particular control task, or may be implemented as a processor core that may include memory for holding software and firmware instructions that may be executed by the processor to control the operation of LIGBT device 1201, 1202, for example.",
"Additional interface logic, etc may be included within IC 1200.Various types of systems may be implemented by connecting a load such as load device 1210 to be powered under control of IC 1200.Systems such as microwave and radio frequency (RF) power amplifiers may be implemented for example.",
"Various types of industrial, residential, commercial, medical, etc.",
"systems may be implemented using power transistors that are fabricated using the techniques disclosed herein to control motors, actuators, lights, etc.",
"Other Embodiments While the disclosure has been described with reference to illustrative embodiments, this description is not intended to be construed in a limiting sense.",
"Various other embodiments of the disclosure will be apparent to persons skilled in the art upon reference to this description.",
"For example, while a LIGBT device was described herein, other embodiments may include other commonly known or later developed power transistors, such as planar IGBTs, trench IGBTs, discrete IGBTs, etc.",
"While a multi-finger power transistor was described herein, other embodiments may include a single finger power transistor.",
"In some embodiments, there may only be a single drain stripe and a single source stripe.",
"While a linear transistor finger was described herein, in some embodiments, the finger topology may be other shapes than linear.",
"For example, each finger may be configured as a circle, a square, a rectangle, u-shaped, etc.",
"Certain terms are used throughout the description and the claims to refer to particular system components.",
"As one skilled in the art will appreciate, components in digital systems may be referred to by different names and/or may be combined in ways not shown herein without departing from the described functionality.",
"This document does not intend to distinguish between components that differ in name but not function.",
"In the following discussion and in the claims, the terms “including” and “comprising” are used in an open-ended fashion, and thus should be interpreted to mean “including, but not limited to .",
".",
".",
".” Also, the term “couple” and derivatives thereof are intended to mean an indirect, direct, optical, and/or wireless electrical connection.",
"Thus, if a first device couples to a second device, that connection may be through a direct electrical connection, through an indirect electrical connection via other devices and connections, through an optical electrical connection, and/or through a wireless electrical connection.",
"Although method steps may be presented and described herein in a sequential fashion, one or more of the steps shown and described may be omitted, repeated, performed concurrently, and/or performed in a different order than the order shown in the figures and/or described herein.",
"Accordingly, embodiments of the disclosure should not be considered limited to the specific ordering of steps shown in the figures and/or described herein.",
"It is therefore contemplated that the appended claims will cover any such modifications of the embodiments as fall within the true scope and spirit of the disclosure."
]
] |
Patent_15871356
|
[
[
"Infrared Light Emitting Diode",
"An infrared light-emitting diode includes, from up to bottom, a P-type ohmic electrode, a contact layer, a P-type cladding layer, an active layer, an N-type cladding layer, a buffer layer, a GaAs substrate and an N-type ohmic electrode.",
"The N-type cladding layer and the P-type cladding layer or either of them is InxGa1-xAs.",
"The cladding layer of InxGa1-xAs, due to low resistance, can improve current expansion, reduce voltage and improve light-emitting efficiency."
],
[
"1.An infrared light-emitting diode, comprising: a first cladding layer; an active layer; and a second cladding layer; wherein: the first cladding layer is InxGa1-xAs, where, In component is 0%≤X≤5%, and a difference of lattice match between layers Δa0 is <3,800 ppm.",
"2.The infrared light-emitting diode of claim 1, wherein, the first cladding layer and the second cladding layer is 1-20 μm thick.",
"3.The infrared light-emitting diode of claim 1, wherein, In component of the first cladding layer of InxGa1-xAs is 2%.",
"4.The infrared light-emitting diode of claim 1, wherein, the second cladding layer is InyGa1-yAs, wherein, In component is 0%≤y≤5%, and difference of lattice match between layers Δa0 is <3,800 ppm.",
"5.The infrared light-emitting diode of claim 4, wherein, In component of the second cladding layer of InyGa1-yAs is 2%.",
"6.The infrared light-emitting diode of claim 1, wherein, the first cladding layer is InGaAs, and the light-emitting peak wavelength of the active layer is above 930 nm.",
"7.The infrared light-emitting diode of claim 1, wherein, the active layer is a multiple-quantum well structure, wherein, well layers and barrier layers have strains with opposite directions, and total strain is coincided.",
"8.The infrared light-emitting diode of claim 7, wherein, difference of lattice match between layers Δa0 is <1,500 ppm.",
"9.The infrared light-emitting diode of claim 1, from up to bottom, comprises: a first ohmic electrode; a contact layer; a first cladding layer; an active layer; a second cladding layer; a buffer layer; a GaAs substrate; and a second-type ohmic electrode.",
"10.The infrared light-emitting diode of claim 1, from up to bottom, comprises: a second type ohmic electrode; a contact layer; a second cladding layer; an active layer; a second type cladding layer; a contact layer; a metal bonding layer; a Si substrate; and a first-type ohmic electrode.",
"11.An infrared light-emitting system comprising a plurality of infrared light-emitting diodes, each infrared light-emitting diode further comprises: a first cladding layer; an active layer; and a second cladding layer; wherein: the first cladding layer is InxGa1-xAs, where, In component is 0%≤X≤5%, and a difference of lattice match between layers Δa0 is <3,800 ppm.",
"12.The infrared light-emitting system of claim 11, wherein, the first cladding layer and the second cladding layer is 1-20 μm thick.",
"13.The infrared light-emitting system of claim 11, wherein, In component of the first cladding layer of InxGa1-xAs is 2%.",
"14.The infrared light-emitting system of claim 11, wherein, the second cladding layer is InyGa1-yAs, wherein, In component is 0%≤y≤5%, and difference of lattice match between layers Δa0 is <3,800 ppm.",
"15.The infrared light-emitting system of claim 14, wherein, In component of the second cladding layer of InyGa1-yAs is 2%.",
"16.The infrared light-emitting system of claim 11, wherein, the first cladding layer is InGaAs, and the light-emitting peak wavelength of the active layer is above 930 nm.",
"17.The infrared light-emitting system of claim 11, wherein, the active layer is a multiple-quantum well structure, wherein, well layers and barrier layers have strains with opposite directions, and total strain is coincided.",
"18.The infrared light-emitting system of claim 17, wherein, difference of lattice match between layers Δa0 is <1,500 ppm.",
"19.The infrared light-emitting system of claim 11, from up to bottom, comprises: a first ohmic electrode; a contact layer; a first cladding layer; an active layer; a second cladding layer; a buffer layer; a GaAs substrate; and a second-type ohmic electrode.",
"20.The infrared light-emitting system of claim 11, from up to bottom, comprises: a second type ohmic electrode; a contact layer; a second cladding layer; an active layer; a second type cladding layer; a contact layer; a metal bonding layer; a Si substrate; and a first-type ohmic electrode."
],
[
"<SOH> BACKGROUND <EOH>Infrared light-emitting diodes, with specific wave bands, low power consumption and high reliability, are widely applied in fields such as security monitoring, wearable devices, space communication, remote control, medical appliances, sensor light sources and night lighting.",
"In general, an infrared light-emitting diode with light-emitting peak wavelength above 900 nm is used, having an active layer of InGaAs and a cladding layer of AlGaAs with indirect energy gap."
],
[
"<SOH> SUMMARY <EOH>The inventors of the present disclosure have recognized that, as Al atom is highly active and easily oxidized, and the material is of high resistivity, this structure has poor current spreading and low antistatic resistance.",
"To solve the above problems, the present disclosure provides an infrared light-emitting diode with a low-band gap cladding layer, wherein, the cladding layer is GaAs or In x Ga 1-x As.",
"Compared with AlGaAs material, GaAs or InGaAs has low resistivity and is free of easy-oxidized Al component, which can improve horizontal conduction of current and show good current spreading effect if applied in the cladding layer.",
"According to a first aspect of the present disclosure, the technical scheme to solve the above problems is provided: an infrared light-emitting diode includes a first cladding layer, an active layer and a second cladding layer, wherein, the first cladding layer is In x Ga 1-x As, where, In component is 0%≤x≤5%, and difference of lattice match between layers Δa 0 is <3,800 ppm.",
"In some embodiments, the first cladding layer is 1-20 μm thick.",
"In some embodiments, the second cladding layer is In y Ga 1-y As, wherein, In component is 0%≤y≤5%, and difference of lattice match between layers Δa 0 is <3,800 ppm.",
"According to a preferred embodiment, an infrared light-emitting diode, from up to bottom, includes: a P-type ohmic electrode, a contact layer, a P-type cladding layer, an active layer, an N-type cladding layer, a buffer layer, a GaAs substrate and an N-type ohmic electrode, wherein, the N-type cladding layer and the P-type cladding layer or either of them is In x Ga 1-x As.",
"The advantage is that the cladding layer of In x Ga 1-x As, due to low resistance, can improve current expansion, reduce voltage and improve light-emitting efficiency.",
"According to another preferred embodiment of the present disclosure, an infrared light-emitting diode, from up to bottom, includes: an N-type ohmic electrode, an N-type contact layer, an N-type cladding layer, a quantum well active layer, a P-type cladding layer, a P-type contact layer, a metal bonding layer, a Si substrate and an N-type ohmic electrode, wherein, the N-type cladding layer and the P-type cladding layer or either of them is In x Ga 1-x As.",
"In some embodiments, the N-type cladding layer and the P-type cladding layer are 1-20 μm thick.",
"Within this thickness range, the component has good antistatic resistance.",
"In some embodiments, when the P-type cladding layer and/or the N-type cladding layer is InGaAs, light-emitting peak wavelength of the active layer is above 930 nm, which is higher than the maximum light absorption wavelength of the InGaAs material, which is 910 nm.",
"In some embodiments, the active layer is a multi-quantum well structure, wherein, the well layer is (In x Ga 1-X )As or (Al X1 Ga 1-X1 ) Y1 In 1-Y1 As, which provides compressive strain when compared to that of the substrate.",
"The thickness of the well layer is d1.Then, the barrier layer (Al X1 Ga 1-X1 )As X2 P 1-X2 or (Al X1 Ga 1-X1 ) Y2 In 1-Y2 P applies strain opposite to that of the well layer.",
"The thickness of the barrier layer is d2.By stacking two kinds of materials with different strains, a quantum well structure is formed.",
"When d1 and d2 are controlled respectively, total strain can be coincided to achieve mutual matching of the quantum well lattice and the substrate GaAs.",
"This effectively improves lattice dislocation and reduces dislocation defects, thus improving light-emitting efficiency of the structure.",
"According to a second aspect of the present disclosure, an infrared light-emitting system including a plurality of light-emitting diodes is provided.",
"Each infrared light-emitting diode further includes a first cladding layer, an active layer, and a second cladding layer.",
"The first cladding layer is In x Ga 1-x As, where, In component is 0%≤X≤5%, and a difference of lattice match between layers Δa 0 is <3,800 ppm.",
"In another aspect, a light-emitting system is provided including a plurality of the LEDs.",
"The system can be used in the applications of night lighting, security, medical applications, communications, etc.",
"Various embodiments of the present disclosure can have one or more of the following advantageous effects: (I) GaAs and InGaAs materials have low energy gap and low resistivity, which can reduce serial resistance of the component.",
"In addition, with low voltage value, GaAs and InGaAs materials can enhance horizontal spreading of current and improve light-emitting efficiency.",
"(II) GaAs and InGaAs materials can block visible light from being emitted from the component, appearing no weak red light when the component is lighted on, thus eliminating red dot effect of infrared light-emitting diodes.",
"The other features and advantages of embodiments of the present disclosure will be described in detail in the following specification, and it is believed that such features and advantages will become more obvious in the specification or through implementations of this disclosure.",
"The purposes and other advantages of the present disclosure can be realized and obtained in the structures specifically described in the specifications, claims and drawings."
],
[
"CROSS-REFERENCE TO RELATED APPLICATIONS The present application is a continuation of, and claims priority to, PCT/CN2017/087712 filed on Jun.",
"9, 2017, which claims priority to Chinese Patent Application No.",
"201610403930.0 filed on Jun.",
"12, 2016.The disclosures of these applications are hereby incorporated by reference in their entirety.",
"BACKGROUND Infrared light-emitting diodes, with specific wave bands, low power consumption and high reliability, are widely applied in fields such as security monitoring, wearable devices, space communication, remote control, medical appliances, sensor light sources and night lighting.",
"In general, an infrared light-emitting diode with light-emitting peak wavelength above 900 nm is used, having an active layer of InGaAs and a cladding layer of AlGaAs with indirect energy gap.",
"SUMMARY The inventors of the present disclosure have recognized that, as Al atom is highly active and easily oxidized, and the material is of high resistivity, this structure has poor current spreading and low antistatic resistance.",
"To solve the above problems, the present disclosure provides an infrared light-emitting diode with a low-band gap cladding layer, wherein, the cladding layer is GaAs or InxGa1-xAs.",
"Compared with AlGaAs material, GaAs or InGaAs has low resistivity and is free of easy-oxidized Al component, which can improve horizontal conduction of current and show good current spreading effect if applied in the cladding layer.",
"According to a first aspect of the present disclosure, the technical scheme to solve the above problems is provided: an infrared light-emitting diode includes a first cladding layer, an active layer and a second cladding layer, wherein, the first cladding layer is InxGa1-xAs, where, In component is 0%≤x≤5%, and difference of lattice match between layers Δa0 is <3,800 ppm.",
"In some embodiments, the first cladding layer is 1-20 μm thick.",
"In some embodiments, the second cladding layer is InyGa1-yAs, wherein, In component is 0%≤y≤5%, and difference of lattice match between layers Δa0 is <3,800 ppm.",
"According to a preferred embodiment, an infrared light-emitting diode, from up to bottom, includes: a P-type ohmic electrode, a contact layer, a P-type cladding layer, an active layer, an N-type cladding layer, a buffer layer, a GaAs substrate and an N-type ohmic electrode, wherein, the N-type cladding layer and the P-type cladding layer or either of them is InxGa1-xAs.",
"The advantage is that the cladding layer of InxGa1-xAs, due to low resistance, can improve current expansion, reduce voltage and improve light-emitting efficiency.",
"According to another preferred embodiment of the present disclosure, an infrared light-emitting diode, from up to bottom, includes: an N-type ohmic electrode, an N-type contact layer, an N-type cladding layer, a quantum well active layer, a P-type cladding layer, a P-type contact layer, a metal bonding layer, a Si substrate and an N-type ohmic electrode, wherein, the N-type cladding layer and the P-type cladding layer or either of them is InxGa1-xAs.",
"In some embodiments, the N-type cladding layer and the P-type cladding layer are 1-20 μm thick.",
"Within this thickness range, the component has good antistatic resistance.",
"In some embodiments, when the P-type cladding layer and/or the N-type cladding layer is InGaAs, light-emitting peak wavelength of the active layer is above 930 nm, which is higher than the maximum light absorption wavelength of the InGaAs material, which is 910 nm.",
"In some embodiments, the active layer is a multi-quantum well structure, wherein, the well layer is (InxGa1-X)As or (AlX1Ga1-X1)Y1In1-Y1As, which provides compressive strain when compared to that of the substrate.",
"The thickness of the well layer is d1.Then, the barrier layer (AlX1Ga1-X1)AsX2P1-X2 or (AlX1Ga1-X1)Y2In1-Y2P applies strain opposite to that of the well layer.",
"The thickness of the barrier layer is d2.By stacking two kinds of materials with different strains, a quantum well structure is formed.",
"When d1 and d2 are controlled respectively, total strain can be coincided to achieve mutual matching of the quantum well lattice and the substrate GaAs.",
"This effectively improves lattice dislocation and reduces dislocation defects, thus improving light-emitting efficiency of the structure.",
"According to a second aspect of the present disclosure, an infrared light-emitting system including a plurality of light-emitting diodes is provided.",
"Each infrared light-emitting diode further includes a first cladding layer, an active layer, and a second cladding layer.",
"The first cladding layer is InxGa1-xAs, where, In component is 0%≤X≤5%, and a difference of lattice match between layers Δa0 is <3,800 ppm.",
"In another aspect, a light-emitting system is provided including a plurality of the LEDs.",
"The system can be used in the applications of night lighting, security, medical applications, communications, etc.",
"Various embodiments of the present disclosure can have one or more of the following advantageous effects: (I) GaAs and InGaAs materials have low energy gap and low resistivity, which can reduce serial resistance of the component.",
"In addition, with low voltage value, GaAs and InGaAs materials can enhance horizontal spreading of current and improve light-emitting efficiency.",
"(II) GaAs and InGaAs materials can block visible light from being emitted from the component, appearing no weak red light when the component is lighted on, thus eliminating red dot effect of infrared light-emitting diodes.",
"The other features and advantages of embodiments of the present disclosure will be described in detail in the following specification, and it is believed that such features and advantages will become more obvious in the specification or through implementations of this disclosure.",
"The purposes and other advantages of the present disclosure can be realized and obtained in the structures specifically described in the specifications, claims and drawings.",
"BRIEF DESCRIPTION OF THE DRAWINGS The accompanying drawings, which are included to provide a further understanding of the disclosure and constitute a part of this specification, together with the embodiments, are therefore to be considered in all respects as illustrative and not restrictive.",
"In addition, the drawings are merely illustrative, which are not drawn to scale.",
"FIG.",
"1 illustrates a sectional view of an infrared light-emitting diode structure according to some embodiments of the present disclosure.",
"FIG.",
"2 illustrates a sectional view of another infrared light-emitting diode structure according to some embodiments of the present disclosure.",
"In the drawings: 101: GaAs substrate; 102: Buffer layer; 103: N-type cladding layer; 104: Quantum well active layer; 105: P-type cladding layer; 106: Contact layer; 107: N-type ohmic electrode; 108: P-type ohmic electrode; 201: Si substrate; 202: Metal bonding layer; 203: P-type contact layer; 204: P-type cladding layer; 205: Quantum well active layer; 206: N-type cladding layer; 207: N-type contact layer; 208: P-type ohmic electrode; 209: N-type ohmic electrode.",
"DETAILED DESCRIPTION The embodiments of the present disclosure will be described in detail with reference to the accompanying drawings and examples, to help understand and practice the disclosed embodiments, regarding how to solve technical problems using technical approaches for achieving the technical effects.",
"It should be understood that the embodiments and their characteristics described in this disclosure may be combined with each other and such technical proposals are deemed to be within the scope of this disclosure without departing from the spirit of this disclosure.",
"In the present disclosure, the first cladding layer and the second cladding layer are semiconductor layers of opposite types.",
"For example, when the first cladding layer is an N-type semiconductor layer, the second cladding layer is a P-type semiconductor layer; if the first cladding layer is a P-type semiconductor layer, the second cladding layer is an N-type semiconductor layer.",
"Embodiment 1 As shown in FIG.",
"1, an infrared light-emitting diode chip with low-band gap cladding layer, from up to bottom, includes: a P-type ohmic electrode 108, a contact layer 106, a P-type cladding layer 105, a quantum well active layer 104, an N-type cladding layer 103, a buffer layer 102, a GaAs substrate 101 and an N-type ohmic electrode 107.In this embodiment, a multi-quantum well active layer is formed via organic metal vapor phase epitaxy (OMVPE) having a well layer of InGaAs and a barrier layer of AlGaAsP, wherein, light-emitting peak wavelength is above 900 nm, and number of quantum well pairs is 3-25.Specifically, the GaAs substrate 101 is a Si-doped single crystal N-type GaAs substrate with concentration of 8E17-3E18 atoms/cm3 and preferred concentration of 1.2E18 atoms/cm3; the buffer layer 102 is GaAs with concentration of 8E17-5E18 atoms/cm3 and preferred concentration of 1.5E18 atoms/cm3; the N-type cladding layer is InxGa1-xAs, wherein, In component X is 0%-5%, and preferred X is 2%; concentration is 5E17-2E18 atoms/cm3, and preferred concentration is 7E17 atoms/cm3; and thickness is 1-20 μm; the active layer 104 is an active layer of non-doped multiple-quantum well structure, wherein, the well layer is AlInGaAs with thickness of 3-80 nm, and the barrier layer is AlGaAsP with thickness of 5-90 nm and preferred thickness of 24 nm; number of quantum well pairs is 3-25, and preferred number of pairs is 12; the P-type cladding layer 105 is C-doped InxGa1-xAs, wherein, In component X is 0%-5%, and preferred X is 2%; concentration is 8E17-6E18 atoms/cm, and preferred concentration is 1E18 atoms/cm3; the P-type contact layer 106 is highly C-doped GaAs, wherein, concentration is higher than 5E18 atoms/cm3, and preferred concentration is 8E18 atoms/cm3.In this embodiment, the active layer 104 is a multiple-quantum well structure, wherein, number of quantum well pairs is 12; the well layer is (In0.15Ga0.75)As with thickness of 8 nm, wherein, the material applies compression strain on the GaAs, and the barrier layer is (Al0.1Ga0.9)As0.85P0.15 with thickness of 24 nm, wherein, the material applies tensile strain on the GaAs.",
"At this thickness, the total strain is coincided and consistent with the substrate, achieving lattice matching.",
"Difference of lattice match between layers Δa0 is <1,500 ppm, causing no mismatch defect.",
"In the above infrared light-emitting diode, when 20 mA forward current is input, the forward voltage is 1.27 V, light-emitting wavelength is 956 nm and light-emitting output power is 4.9 mW.",
"The cladding layer of InxGa1-xAs, with maximum light absorption wavelength of 910 nm, can block invisible light, appearing no weak red light when the component is lighted on.",
"Embodiment 2 As shown in FIG.",
"2, an infrared light-emitting diode chip with a low-band gap cladding layer, from up to bottom, includes: an N-type ohmic electrode 209, an N-type contact layer 207, an N-type cladding layer 206, an active layer 205, a P-type cladding layer 204, a P-type contact layer 203, a metal bonding layer 202, a Si substrate 201 and a P-type ohmic electrode 208.In this embodiment, a Si substrate is used, and the metal bonding layer reflects the light emitted downward from the active layer, which effectively improves light extraction and light-emitting efficiency.",
"Specifically, the N-type cladding layer 206 and the P-type cladding layer 204 are InxGa1-xAs, wherein, In component X is 0%-5%, and preferred X is 2%; and concentration is 5E17-2E18 atoms/cm3, and preferred concentration is 7E17 atoms/cm3.The active layer 205 is a multi-quantum well layer, including alternative well layers and barrier layers, wherein, number of quantum well pairs is 12; the well layer is (In0.15Ga0.85)As with thickness of 8 nm, and the material applies compressive strain on the growth substrate GaAs; the barrier layer is (Al0.05Ga0.95)0.65In0.35P, with thickness of 20 nm, and the material applies tensile strain on the growth substrate GaAs.",
"At this thickness, the total strain is coincided and consistent with the substrate, achieving lattice matching.",
"In addition, the Al component X of the cladding layer is controlled between 0%-5%, thus guaranteeing that difference of lattice match between layers Δa0 is <1,500 ppm, causing no mismatch defect.",
"In the above infrared light-emitting diode, when 50 mA forward current is input, the forward voltage is 1.42 V, light-emitting wavelength is 950 nm and light-emitting output power is 16.5 mW.",
"The cladding layer of InGaAs, with maximum light absorption wavelength of 910 nm, can block invisible light, appearing no weak red light when the component is lighted on.",
"Although specific embodiments have been described above in detail, the description is merely for purposes of illustration.",
"It should be appreciated, therefore, that many aspects described above are not intended as required or essential elements unless explicitly stated otherwise.",
"Various modifications of, and equivalent acts corresponding to, the disclosed aspects of the exemplary embodiments, in addition to those described above, can be made by a person of ordinary skill in the art, having the benefit of the present disclosure, without departing from the spirit and scope of the disclosure defined in the following claims, the scope of which is to be accorded the broadest interpretation so as to encompass such modifications and equivalent structures."
]
] |
Patent_15871358
|
[
[
"Refrigerated Container and Duct Extension",
"A duct (100) comprises the molded combination of: an inlet flange (110) surrounding an inlet (102), the inlet having a height and a width; and body (112) extending from the inlet to an outlet (104) and having a body interior that laterally outwardly diverges and upwardly shifts from the inlet toward the outlet."
],
[
"1.A duct (100) comprising the molded combination of: an inlet flange (110) surrounding an inlet (102), the inlet having a height and a width; and body (112) extending from the inlet to an outlet (104) and having a body interior that laterally outwardly diverges and upwardly shifts from the inlet toward the outlet, wherein: the duct comprises a proximal trunk (130) and a plurality of distal branches (132A-132D); and a plurality of walls (134A-134C) divide the distal branches, each wall comprising at least one portion protruding upward from a bottom of the body and at least one portion protruding downward from a top of the body and meeting.",
"2.The duct of claim 1 wherein: the duct comprises thermoplastic polyolefin.",
"3.The duct of claim 1 being twin-sheet thermoformed.",
"4.",
"(canceled) 5.",
"(canceled) 6.The duct of claim 1 wherein: one or more of the walls includes an interrupted portion (186) wherein the wall protrudes upward from the bottom of the duct to a non-recessed location on the top of the duct.",
"7.The duct of claim 6 wherein: the interrupted portion includes a mounting hole (188).",
"8.The duct of claim 1 further comprising: a plurality of tabs (142) at the outlet, each tab includes a mounting a hole (144).",
"9.A transport refrigeration system (20) including the duct of claim 1 and further comprising: a container (22); and a refrigeration system (30) including: a fan (42) for driving air along a flowpath from an inlet (62) to an outlet (64); and a heat exchanger (38) along the flowpath for cooling the air, wherein: the duct is mounted so that its inlet (102) receives air from the refrigeration system outlet.",
"10.The system of claim 9 wherein: the refrigeration system is mounted along a front wall of the container.",
"11.The system of claim 9 wherein: the duct comprises a proximal trunk (130) and a plurality of distal branches (132A-132D).",
"12.A method for making the duct of claim 1, the method comprising: providing a first sheet and a second sheet; vacuum thermoforming the first sheet and the second sheet; and pressing the thermoformed first sheet and thermoformed second sheet together so as to fuse the first and second sheets together.",
"13.A method for using the duct of claim 1, the method comprising: attaching the flange (110) to an outlet (64) of a refrigeration system (30) of a transport container (22).",
"14.The method of claim 13 further comprising: attaching the duct body (112) to a ceiling (70) of the container.",
"15.The method of claim 14 wherein: the attaching the duct body to the ceiling comprises screwing through tabs protruding from an upper portion of the duct at the outlet.",
"16.The method of claim 14 wherein: the attaching of the duct body to the ceiling comprises screwing through upwardly-projecting pockets."
],
[
"<SOH> BACKGROUND <EOH>The disclosure relates to transport refrigeration.",
"More particularly, the disclosure relates to air handling in transport refrigeration systems.",
"Transport refrigeration systems include cargo/shipping containers, trailers, and trucks.",
"Each involves one or more refrigerated compartment and a refrigeration system positioned to cool a recirculating airflow within the compartment.",
"Depending upon the implementation, refrigeration equipment may be mounted to an exterior of the container or within a subcompartment in the container.",
"Many truck and trailer configurations mount the equipment to the front of the container, often high on the front wall so that the outlet for discharging cooled air into the compartment is near the compartment ceiling.",
"It has been proposed to use a duct extension or chute (duct) to discharge cooled air further back in the container.",
"In one example, a blow-molded open-top duct has a forward flange that mates to the equipment compartment and an upper flange that mates to the ceiling.",
"The duct body transitions from a rectangular (bottom and two sides) portion near the inlet flange to an arcuate cross-section near a rear rim."
],
[
"<SOH> SUMMARY <EOH>One aspect of the disclosure involves a duct comprising the molded combination of an inlet flange and a body.",
"The inlet flange surrounds an inlet having a height and a width.",
"The body extends from the inlet to an outlet and has a body interior that laterally outwardly diverges and upwardly shifts from the inlet toward the outlet.",
"In one or more embodiments of any of the foregoing embodiments, the duct comprises thermoplastic polyolefin.",
"In one or more embodiments of any of the foregoing embodiments, the duct is twin-sheet thermoformed.",
"In one or more embodiments of any of the foregoing embodiments, the duct comprises a proximal trunk and a plurality of distal branches.",
"In one or more embodiments of any of the foregoing embodiments, a plurality of walls divide the distal branches, each wall comprising at least one portion protruding upward from a bottom of the body and at least one portion protruding downward from a top of the body and meeting.",
"In one or more embodiments of any of the foregoing embodiments, one or more of the walls includes an interrupted portion wherein the wall protrudes upward from the bottom of the duct to a non-recessed location on the top of the duct.",
"In one or more embodiments of any of the foregoing embodiments, the interrupted portion includes a mounting hole.",
"In one or more embodiments of any of the foregoing embodiments, the duct further comprises a plurality of tabs at the outlet, each tab includes a mounting a hole.",
"Another aspect of the disclosure involves a transport refrigeration system including the duct of any of the foregoing embodiments and further comprising: a container and a refrigeration system.",
"The refrigeration system includes: a fan for driving air along a flowpath from an inlet to an outlet; and a heat exchanger along the flowpath for cooling the air.",
"The duct is mounted so that its inlet receives air from the refrigeration system outlet.",
"In one or more embodiments of any of the foregoing embodiments, the refrigeration system is mounted along a front wall of the container.",
"In one or more embodiments of any of the foregoing embodiments, the duct comprises a proximal trunk and a plurality of distal branches.",
"Another aspect of the disclosure involves a method for making the duct of any of the foregoing embodiments.",
"The method comprises: providing a first sheet and a second sheet; vacuum thermoforming the first sheet and the second sheet; and pressing the thermoformed first sheet and thermoformed second sheet together so as to fuse the first and second sheets together.",
"Another aspect of the disclosure involves a method for using the duct of any of the foregoing embodiments.",
"The method comprises attaching the flange to an outlet of a refrigeration system of a transport container.",
"In one or more embodiments of any of the foregoing embodiments, the method further comprises attaching the duct body to a ceiling of the container.",
"In one or more embodiments of any of the foregoing embodiments, the attaching the duct body to the ceiling comprises screwing through tabs protruding from an upper portion of the duct at the outlet.",
"In one or more embodiments of any of the foregoing embodiments, the attaching of the duct body to the ceiling comprises screwing through upwardly projecting pockets.",
"The details of one or more embodiments are set forth in the accompanying drawings and the description below.",
"Other features, objects, and advantages will be apparent from the description and drawings, and from the claims."
],
[
"CROSS-REFERENCE TO RELATED APPLICATION Benefit is claimed of U.S. Patent Application Ser.",
"No.",
"61/814,699, filed Apr.",
"22, 2013, and entitled “Refrigerated Container and Duct Extension”, the disclosure of which is incorporated by reference herein in its entirety as if set forth at length.",
"BACKGROUND The disclosure relates to transport refrigeration.",
"More particularly, the disclosure relates to air handling in transport refrigeration systems.",
"Transport refrigeration systems include cargo/shipping containers, trailers, and trucks.",
"Each involves one or more refrigerated compartment and a refrigeration system positioned to cool a recirculating airflow within the compartment.",
"Depending upon the implementation, refrigeration equipment may be mounted to an exterior of the container or within a subcompartment in the container.",
"Many truck and trailer configurations mount the equipment to the front of the container, often high on the front wall so that the outlet for discharging cooled air into the compartment is near the compartment ceiling.",
"It has been proposed to use a duct extension or chute (duct) to discharge cooled air further back in the container.",
"In one example, a blow-molded open-top duct has a forward flange that mates to the equipment compartment and an upper flange that mates to the ceiling.",
"The duct body transitions from a rectangular (bottom and two sides) portion near the inlet flange to an arcuate cross-section near a rear rim.",
"SUMMARY One aspect of the disclosure involves a duct comprising the molded combination of an inlet flange and a body.",
"The inlet flange surrounds an inlet having a height and a width.",
"The body extends from the inlet to an outlet and has a body interior that laterally outwardly diverges and upwardly shifts from the inlet toward the outlet.",
"In one or more embodiments of any of the foregoing embodiments, the duct comprises thermoplastic polyolefin.",
"In one or more embodiments of any of the foregoing embodiments, the duct is twin-sheet thermoformed.",
"In one or more embodiments of any of the foregoing embodiments, the duct comprises a proximal trunk and a plurality of distal branches.",
"In one or more embodiments of any of the foregoing embodiments, a plurality of walls divide the distal branches, each wall comprising at least one portion protruding upward from a bottom of the body and at least one portion protruding downward from a top of the body and meeting.",
"In one or more embodiments of any of the foregoing embodiments, one or more of the walls includes an interrupted portion wherein the wall protrudes upward from the bottom of the duct to a non-recessed location on the top of the duct.",
"In one or more embodiments of any of the foregoing embodiments, the interrupted portion includes a mounting hole.",
"In one or more embodiments of any of the foregoing embodiments, the duct further comprises a plurality of tabs at the outlet, each tab includes a mounting a hole.",
"Another aspect of the disclosure involves a transport refrigeration system including the duct of any of the foregoing embodiments and further comprising: a container and a refrigeration system.",
"The refrigeration system includes: a fan for driving air along a flowpath from an inlet to an outlet; and a heat exchanger along the flowpath for cooling the air.",
"The duct is mounted so that its inlet receives air from the refrigeration system outlet.",
"In one or more embodiments of any of the foregoing embodiments, the refrigeration system is mounted along a front wall of the container.",
"In one or more embodiments of any of the foregoing embodiments, the duct comprises a proximal trunk and a plurality of distal branches.",
"Another aspect of the disclosure involves a method for making the duct of any of the foregoing embodiments.",
"The method comprises: providing a first sheet and a second sheet; vacuum thermoforming the first sheet and the second sheet; and pressing the thermoformed first sheet and thermoformed second sheet together so as to fuse the first and second sheets together.",
"Another aspect of the disclosure involves a method for using the duct of any of the foregoing embodiments.",
"The method comprises attaching the flange to an outlet of a refrigeration system of a transport container.",
"In one or more embodiments of any of the foregoing embodiments, the method further comprises attaching the duct body to a ceiling of the container.",
"In one or more embodiments of any of the foregoing embodiments, the attaching the duct body to the ceiling comprises screwing through tabs protruding from an upper portion of the duct at the outlet.",
"In one or more embodiments of any of the foregoing embodiments, the attaching of the duct body to the ceiling comprises screwing through upwardly projecting pockets.",
"The details of one or more embodiments are set forth in the accompanying drawings and the description below.",
"Other features, objects, and advantages will be apparent from the description and drawings, and from the claims.",
"BRIEF DESCRIPTION OF THE DRAWINGS FIG.",
"1 is a simplified side sectional view of a refrigerated transport system.",
"FIG.",
"1A is an enlarged view of an equipment box region on the system of FIG.",
"1.FIG.",
"2 is an aft oblique view of the equipment box.",
"FIG.",
"3 is a first view of a duct extension.",
"FIG.",
"4 is a second view of the duct extension.",
"FIG.",
"5 is a third view of the duct extension.",
"FIG.",
"6 is a bottom view of the duct extension.",
"FIG.",
"7 is a front view of the duct extension.",
"FIG.",
"8 is a side view of the duct extension.",
"Like reference numbers and designations in the various drawings indicate like elements.",
"DETAILED DESCRIPTION FIG.",
"1 shows a refrigerated transport system in the form of a trailer 20 having a container in the form of box 22 with an interior 24.In the exemplary box, a pair of doors 26 are formed at a rear of the box.",
"An equipment compartment 28 is located along a front of the box and contains the refrigeration system 30.The exemplary refrigeration system 30 includes a vapor compression system comprising a compressor 32.Sequentially downstream of the compressor along the refrigerant flowpath are a heat rejection heat exchanger 34 (e.g., condenser or gas cooler), an expansion device 36 (e.g., electronic expansion valve (EEV)), and a heat absorption heat exchanger (evaporator) 38.These are connected via an appropriate refrigerant line.",
"The exemplary heat exchangers are refrigerant-air heat exchangers and may have associated fans 40, 42 driving air flows thereacross.",
"An exemplary air flow across the condenser 34 is shown as 500 and an exemplary air flow across the evaporator is shown as 502.In various implementations, the box may also contain a power source such as an internal combustion engine driving an electric generator to, in turn, power the compressor and fan(s).",
"Alternative implementations, may involve use of vehicle electric power.",
"An exemplary box 22 is formed of an insulated wall structure 50 on the front, top, bottom, and left and right sides with the doors 26 also being insulated.",
"The exemplary wall 50 has at least one penetration associated with the refrigeration system.",
"In the exemplary embodiment, the penetration involves a rear protrusion or bay 52 of the equipment box extending from a lower end 54 to an upper end 56 within an aperture 58 of the front wall.",
"The bay 52 defines a duct 60 extending from an inlet 62 low along an aft wall of the bay to an outlet 64 high along the aft wall.",
"Within the duct, along an air flowpath are the evaporator and its associated fan.",
"The exemplary outlet 64 is rectangular having a height and a width.",
"The upper end of the outlet 64 is downwardly spaced from the ceiling 70 of the box.",
"To better distribute the air discharged from the outlet 64, a duct extension (duct) 100 is provided having an inlet 102 at the outlet 64 and an outlet 104 spaced forwardly and upwardly therefrom (e.g., adjacent to the ceiling surface 70).",
"FIG.",
"2 shows a forward portion of the box schematically.",
"In many typical implementations, the box may be taller and wider relative to the refrigeration unit.",
"The outlet 104 has a height and a width.",
"In the exemplary embodiment, the outlet 104's height is less than the height of the outlet 64 and its width is greater than the width of the outlet 64 so that the duct causes an outward fanning or lateral divergence of the outlet flow.",
"This serves to get the flow farther back and more evenly distributed within the compartment.",
"The exemplary duct 100 (FIG.",
"3) comprises a mounting flange 110 at the inlet 102 and a duct body 112 extending downstream therefrom to the outlet.",
"The exemplary flange has a perimeter array of mounting holes 114 for securing to the rear wall of the bay 52.FIG.",
"3 is a perspective view of the duct looking generally downward and rearward from the right front (right and front being viewed from the point of view of the vehicle).",
"FIG.",
"4 is a generally forward and downward view from the left rear.",
"FIG.",
"5 is a generally upward and forward view from the right rear.",
"The duct body has an upper wall portion 120 (FIG.",
"3) and a lower wall portion 122 (FIG.",
"5) joined by respective left and right wall portions 124 and 126 (FIG.",
"4).",
"The exemplary duct has a proximal trunk portion 130 which extends downstream from the inlet 102 and flange 110 and branches off into a plurality of branches (e.g., four ultimate branches 132A, 132B, 132C, and 132D being shown from left-to-right).",
"The branches are separated by walls 134A, 134B, and 134C.",
"At a downstream/rear edge 140 of the duct forming the outlet, the duct upper wall portion 120 includes a plurality of mounting tabs 142 each having an associated mounting hole 144 for receiving a screw to fasten the duct to the ceiling.",
"The exemplary duct also includes a plurality of reinforcing structures including streamwise externally protruding ribs 150 and circumscribing transverse externally protruding ribs 152.A rearmost of the ribs 152 at the downstream/rear edge 140 extends only along the lower wall portion 122 and left and right wall portions 126 but not along the upper wall portion.",
"This allows a downstream region 156 of the upper surface of the upper wall portion to fit flat against the ceiling near the outlet.",
"FIG.",
"7 shows an inlet width WI and an inlet height HI.",
"FIG.",
"7 further shows a flange width WF and flange height HF.",
"FIG.",
"6 shows an outlet width WO and FIG.",
"8 shows an outlet height HO.",
"Due to the fanning and divergence, the exemplary WO is at least 50% greater than WI (e.g., 150%-300% of WI, more narrowly, 180%-250% or an exemplary about 200%).",
"The outlet height HO may be smaller than the inlet height HI in approximately the same proportion to maintain flow cross-sectional area.",
"FIG.",
"8 further shows the amount of upward offsetting of the outlet relative to the inlet.",
"A lower end of the inlet is at a height H1 below the ceiling 70 and an upper end of inlet is at a height H2 below the ceiling 70 whereas the upper end of the outlet is essentially at the ceiling.",
"The exemplary center of the outlet is shifted upward relative to the center of the inlet by an amount H3 which may exceed the outlet height and may exceed the inlet height.",
"The exact offset will depend upon the particular refrigeration system being adapted.",
"The exemplary duct extension 100 is formed by a twin-sheet vacuum thermo-forming process.",
"In one such process, one sheet generally forms a lower half of the duct and another sheet generally forms an upper half.",
"In an exemplary process, there is an upper mold and a lower mold.",
"These have interior profiles complementary to upper and lower portions of the duct to be molded.",
"An upper sheet and a lower sheet are placed into a space between the molds and may be contacted to the molds.",
"The sheets are heated and drawn against the mold surfaces by vacuum applied through the molds.",
"Thereafter, the molds are brought together to locally contact adjacent portions of the two formed sheets and thermally fuse them.",
"The molded part may then be cooled to harden.",
"The mold may be opened and the part ejected.",
"There may be trimming of flash before and/or after mold separation and part ejection.",
"The twin sheet vacuum thermoforming facilities a surprisingly robust yet lightweight and inexpensive configuration.",
"For example, the exemplary walls 134A-134C may be formed by deformations in one or both sheets.",
"In this example, along a forward portion 180 of each wall and an aft portion 182, the wall is formed by deformations of both sheets (the lower sheet protruding upward and the upper sheet protruding downward) so that, within the wall, the sheets are fused to form a transverse web at an intermediate height between adjacent portions of the two sheets and their respective associated upper and lower wall portions.",
"In the exemplary embodiment, however, there is an interruption in the wall between the portions 180 and 182.The exemplary interruption is formed by locally having the wall substantially entirely formed by deformation of the lower sheet so that the two sheets fuse at a location (small local region) 186 (FIG.",
"4) locally coplanar with the upper wall.",
"This location 186 is along the flat end portion 156 of the upper wall near a forward end thereof.",
"This allows the locations 186 to provide further attachment points for fastening the duct to the ceiling.",
"Turning to FIG.",
"7, it is seen that each wall extends from a leading edge 190 to a trailing edge 192 (FIG.",
"4).",
"Each wall includes a left side 192 and a right side 194.These sides 192 and 194 can extend continuously across the portions or regions 180, 186, and 182.Viewed from the top in FIG.",
"4, the regions 180 and 182 are upwardly directed recesses while the region 186 is flat and unrecessed.",
"Viewed, however, from the bottom in FIGS.",
"5 and 6, there is one continuous recess spanning all three regions/portions 180, 182, and 186 with region 186 representing an upward deepening.",
"At the regions 186, the web of joined material may have a mounting hole 188 (FIG.",
"4) to receive an additional screw.",
"The screw may be inserted upwardly into the deepened area of the compartment and threaded into the ceiling.",
"This provides a robust attachment of the duct while minimizing internal interruptions in flow or otherwise compromising the structural integrity provided by the walls.",
"The walls provide structural integrity by maintaining spacing of the upper and lower wall portions.",
"The use of “first”, “second”, and the like in the following claims is for differentiation only and does not necessarily indicate relative or absolute importance or temporal order.",
"Where a measure is given in English units followed by a parenthetical containing SI or other units, the parenthetical's units are a conversion and should not imply a degree of precision not found in the English units.",
"The same “upper” and “lower” orientations are used to describe the duct in its final condition and/or when being molded.",
"This is not a requirement.",
"One or more embodiments have been described.",
"Nevertheless, it will be understood that various modifications may be made.",
"For example, when applied to an existing basic system, details of such configuration or its associated use may influence details of particular implementations.",
"Accordingly, other embodiments are within the scope of the following claims."
]
] |
Patent_15871366
|
[
[
"THREE-DIMENSIONAL SEMICONDUCTOR MEMORY DEVICES",
"Three-dimensional (3D) nonvolatile memory devices include a substrate having a well region of second conductivity type (e.g., P-type) therein and a common source region of first conductivity type (e.g., N-type) on the well region.",
"A recess extends partially (or completely) through the common source region.",
"A vertical stack of nonvolatile memory cells on the substrate includes a vertical stack of spaced-apart gate electrodes and a vertical active region, which extends on sidewalls of the vertical stack of spaced-apart gate electrodes and on a sidewall of the recess.",
"Gate dielectric layers extend between respective ones of the vertical stack of spaced-apart gate electrodes and the vertical active region.",
"The gate dielectric layers may include a composite of a tunnel insulating layer, a charge storage layer, a relatively high bandgap barrier dielectric layer and a blocking insulating layer having a relatively high dielectric strength."
],
[
"1.A nonvolatile memory device, comprising: a substrate having a well region of second conductivity type therein and a common source region of first conductivity type on the well region; a recess in said substrate, said recess extending at least partially through the common source region; and a vertical stack of nonvolatile memory cells on said substrate, said vertical stack of nonvolatile memory cells comprising: a vertical stack of spaced-apart gate electrodes on said substrate; a vertical active region on sidewalls of the vertical stack of spaced-apart gate electrodes and on a sidewall of the recess; and gate dielectric layers extending between respective ones of the vertical stack of spaced-apart gate electrodes and said vertical active region."
],
[
"<SOH> BACKGROUND <EOH>The present disclosure herein relates to a semiconductor device and a method of fabricating the same and, more particularly, to a three-dimensional (3D) semiconductor memory device and a method of fabricating the same.",
"Due to characteristics such as miniaturization, multifunction and/or low-fabricating cost, semiconductor devices are getting the spotlight as an important factor in electronic industries.",
"With the advance of electronic industries, requirements for the superior performances and/or low costs of semiconductor devices are increasing.",
"For satisfying such requirements, high-integrating of semiconductor devices is growing.",
"Particularly, high-integrating of semiconductor memory devices storing logical data is growing more.",
"In a degree of integration of typical Two-Dimensional (2D) semiconductor memory devices, planar areas that unit memory cells occupy may be main factors for deciding the degree of integration.",
"Therefore, a degree of integration of the typical 2D semiconductor memory devices may be largely affected by the level of a technology for forming fine patterns.",
"However, the technology for forming the fine patterns may be gradually reaching limitations, and also, the fabricating costs of semiconductor memory devices may increase because high-cost equipment is required.",
"For solving such limitations, 3D semiconductor memory devices including three dimensionally-arranged memory cells have been proposed."
],
[
"<SOH> SUMMARY <EOH>Three-dimensional (3D) nonvolatile memory devices according to embodiments of the invention include a substrate having a well region of second conductivity type (e.g., P-type) therein and a common source region of first conductivity type (e.g., N-type) on the well region.",
"A recess is provided in the substrate.",
"In some embodiments of the invention, the recess extends partially through the common source region.",
"A vertical stack of nonvolatile memory cells are provided on the substrate.",
"This vertical stack of nonvolatile memory cells includes a vertical stack of spaced-apart gate electrodes and a vertical active region, which extends on sidewalls of the vertical stack of spaced-apart gate electrodes and on a sidewall of the recess.",
"Gate dielectric layers are provided, which extend between respective ones of the vertical stack of spaced-apart gate electrodes and the vertical active region.",
"In other embodiments of the invention, the recess extends entirely through the common source region, which forms a P-N rectifying junction with the well region, and a sidewall of the recess defines an interface between the vertical active region and the well region.",
"In addition, each of the gate dielectric layers may include a composite of: (i) a tunnel insulating layer in contact with the vertical active region, (ii) a charge storage layer on the tunnel insulating layer, (iii) a barrier dielectric layer on the charge storage layer; and (iv) a blocking insulating layer extending between the barrier dielectric layer and a respective gate electrode.",
"In some of these embodiments of the invention, the barrier dielectric layer may be formed of a material having a greater bandgap relative to the blocking insulating layer.",
"According to still further embodiments of the invention, a protective dielectric layer is provided on a sidewall of the recess.",
"This protective dielectric layer extends between the vertical active region and the common source region.",
"A bottom of the recess may also define an interface between the vertical active region and the well region.",
"This vertical active region, which may have a cylindrical shape, may include a plurality of concentrically-arranged semiconductor layers of first conductivity type having equivalent or different dopant concentrations therein.",
"According to additional embodiments of the invention, the vertical stack of spaced-apart gate electrodes has an opening extending therethrough that is aligned to the recess.",
"In addition, the gate dielectric layers may have a cylindrical shape, and may be concentrically-arranged relative to the plurality of concentrically-arranged semiconductor layers.",
"According to still further embodiments of the invention, the vertical active region includes an active region plug filling the recess and a cylindrically-shaped active layer on the active region plug.",
"The cylindrically-shaped active layer includes a plurality of concentrically-arranged semiconductor layers of first conductivity type having equivalent or different doping concentrations therein.",
"A vertical stack of at least two spaced-apart gate electrodes of respective ground selection transistors may also be provided, which extend opposite the active region plug.",
"These ground selection transistors include respective gate dielectric layers that extend on sidewalls of the active region plug.",
"The gate dielectric layers of the vertical stack of nonvolatile memory cells may be formed of different materials relative to the gate dielectric layers of the stacked ground selection transistors.",
"Methods of forming three-dimensional (3D) nonvolatile memory devices according to embodiments of the invention may include forming a vertical stack of a plurality of sacrificial layers and a plurality of insulating layers arranged in an alternating sequence, on a substrate.",
"A selective etching step is then performed to etch through the vertical stack to define a first opening therein and a recess in the substrate.",
"The recess is filled with an electrically conductive active region plug, which is electrically connected to a well region in the substrate.",
"A sidewall of the first opening is then lined with a first vertical active layer before the first opening is filled with a dielectric pattern that extends on the first vertical active layer.",
"Another selective etching step is performed to selectively etch through the vertical stack to define a second opening therein that exposes the substrate.",
"Portions of the sacrificial layers extending between each of the plurality of insulating layers in the vertical stack are then replaced with gate dielectric layers and gate electrodes of respective memory cells.",
"The step of lining a sidewall of the first opening may include lining a sidewall of the first opening with a first vertical active layer that contacts an upper surface of the active region plug.",
"The step of filling the recess with an active region plug may also include filling the recess with an active region plug having an upper surface that is elevated relative to surface of the substrate.",
"In particular, the substrate may include a well region of second conductivity type and a common source region of first conductivity type extending between the well region and a surface of the substrate, and the recess containing the active region plug may extend entirely through the common source region.",
"According to still further embodiments of the invention, the step of lining a sidewall of the first opening with a first vertical active layer may be preceded by a step of lining the sidewall of the first opening with a first electrically insulating sub-layer that contacts an upper surface of the active region plug.",
"A step may also be performed to selectively etching through the first vertical active layer and the first electrically insulating sub-layer in sequence to expose the upper surface of the active region plug.",
"In addition, the step of filling the first opening with a dielectric pattern may be preceded by lining an inner sidewall of the first vertical active layer with a second vertical active layer that contacts the upper surface of the active region plug.",
"These first and second vertical active layers may be formed as doped or undoped cylindrically-shaped silicon layers."
],
[
"CROSS REFERENCE TO RELATED APPLICATIONS This U.S. non-provisional patent application is a continuation of Ser.",
"No.",
"15/602,886, filed May 23, 2017, which is a continuation of Ser.",
"No.",
"15/142,533, filed Apr.",
"29, 2016; which is a continuation of U.S. patent application Ser.",
"No.",
"14/830,299, filed Aug. 19, 2015, now U.S. Pat.",
"No.",
"9,356,159; which is a continuation of U.S. patent application Ser.",
"No.",
"14/057,380, filed Oct. 18, 2013, now U.S. Pat.",
"No.",
"9,136,395, which is a divisional of U.S. patent application Ser.",
"No.",
"13/220,376, filed Aug. 29, 2011, now U.S. Pat.",
"No.",
"8,569,827, which claims the benefit of Korean Patent Application 10-2010-0091140, filed Sep. 16, 2010, the entire contents of which are hereby incorporated herein by reference.",
"BACKGROUND The present disclosure herein relates to a semiconductor device and a method of fabricating the same and, more particularly, to a three-dimensional (3D) semiconductor memory device and a method of fabricating the same.",
"Due to characteristics such as miniaturization, multifunction and/or low-fabricating cost, semiconductor devices are getting the spotlight as an important factor in electronic industries.",
"With the advance of electronic industries, requirements for the superior performances and/or low costs of semiconductor devices are increasing.",
"For satisfying such requirements, high-integrating of semiconductor devices is growing.",
"Particularly, high-integrating of semiconductor memory devices storing logical data is growing more.",
"In a degree of integration of typical Two-Dimensional (2D) semiconductor memory devices, planar areas that unit memory cells occupy may be main factors for deciding the degree of integration.",
"Therefore, a degree of integration of the typical 2D semiconductor memory devices may be largely affected by the level of a technology for forming fine patterns.",
"However, the technology for forming the fine patterns may be gradually reaching limitations, and also, the fabricating costs of semiconductor memory devices may increase because high-cost equipment is required.",
"For solving such limitations, 3D semiconductor memory devices including three dimensionally-arranged memory cells have been proposed.",
"SUMMARY Three-dimensional (3D) nonvolatile memory devices according to embodiments of the invention include a substrate having a well region of second conductivity type (e.g., P-type) therein and a common source region of first conductivity type (e.g., N-type) on the well region.",
"A recess is provided in the substrate.",
"In some embodiments of the invention, the recess extends partially through the common source region.",
"A vertical stack of nonvolatile memory cells are provided on the substrate.",
"This vertical stack of nonvolatile memory cells includes a vertical stack of spaced-apart gate electrodes and a vertical active region, which extends on sidewalls of the vertical stack of spaced-apart gate electrodes and on a sidewall of the recess.",
"Gate dielectric layers are provided, which extend between respective ones of the vertical stack of spaced-apart gate electrodes and the vertical active region.",
"In other embodiments of the invention, the recess extends entirely through the common source region, which forms a P-N rectifying junction with the well region, and a sidewall of the recess defines an interface between the vertical active region and the well region.",
"In addition, each of the gate dielectric layers may include a composite of: (i) a tunnel insulating layer in contact with the vertical active region, (ii) a charge storage layer on the tunnel insulating layer, (iii) a barrier dielectric layer on the charge storage layer; and (iv) a blocking insulating layer extending between the barrier dielectric layer and a respective gate electrode.",
"In some of these embodiments of the invention, the barrier dielectric layer may be formed of a material having a greater bandgap relative to the blocking insulating layer.",
"According to still further embodiments of the invention, a protective dielectric layer is provided on a sidewall of the recess.",
"This protective dielectric layer extends between the vertical active region and the common source region.",
"A bottom of the recess may also define an interface between the vertical active region and the well region.",
"This vertical active region, which may have a cylindrical shape, may include a plurality of concentrically-arranged semiconductor layers of first conductivity type having equivalent or different dopant concentrations therein.",
"According to additional embodiments of the invention, the vertical stack of spaced-apart gate electrodes has an opening extending therethrough that is aligned to the recess.",
"In addition, the gate dielectric layers may have a cylindrical shape, and may be concentrically-arranged relative to the plurality of concentrically-arranged semiconductor layers.",
"According to still further embodiments of the invention, the vertical active region includes an active region plug filling the recess and a cylindrically-shaped active layer on the active region plug.",
"The cylindrically-shaped active layer includes a plurality of concentrically-arranged semiconductor layers of first conductivity type having equivalent or different doping concentrations therein.",
"A vertical stack of at least two spaced-apart gate electrodes of respective ground selection transistors may also be provided, which extend opposite the active region plug.",
"These ground selection transistors include respective gate dielectric layers that extend on sidewalls of the active region plug.",
"The gate dielectric layers of the vertical stack of nonvolatile memory cells may be formed of different materials relative to the gate dielectric layers of the stacked ground selection transistors.",
"Methods of forming three-dimensional (3D) nonvolatile memory devices according to embodiments of the invention may include forming a vertical stack of a plurality of sacrificial layers and a plurality of insulating layers arranged in an alternating sequence, on a substrate.",
"A selective etching step is then performed to etch through the vertical stack to define a first opening therein and a recess in the substrate.",
"The recess is filled with an electrically conductive active region plug, which is electrically connected to a well region in the substrate.",
"A sidewall of the first opening is then lined with a first vertical active layer before the first opening is filled with a dielectric pattern that extends on the first vertical active layer.",
"Another selective etching step is performed to selectively etch through the vertical stack to define a second opening therein that exposes the substrate.",
"Portions of the sacrificial layers extending between each of the plurality of insulating layers in the vertical stack are then replaced with gate dielectric layers and gate electrodes of respective memory cells.",
"The step of lining a sidewall of the first opening may include lining a sidewall of the first opening with a first vertical active layer that contacts an upper surface of the active region plug.",
"The step of filling the recess with an active region plug may also include filling the recess with an active region plug having an upper surface that is elevated relative to surface of the substrate.",
"In particular, the substrate may include a well region of second conductivity type and a common source region of first conductivity type extending between the well region and a surface of the substrate, and the recess containing the active region plug may extend entirely through the common source region.",
"According to still further embodiments of the invention, the step of lining a sidewall of the first opening with a first vertical active layer may be preceded by a step of lining the sidewall of the first opening with a first electrically insulating sub-layer that contacts an upper surface of the active region plug.",
"A step may also be performed to selectively etching through the first vertical active layer and the first electrically insulating sub-layer in sequence to expose the upper surface of the active region plug.",
"In addition, the step of filling the first opening with a dielectric pattern may be preceded by lining an inner sidewall of the first vertical active layer with a second vertical active layer that contacts the upper surface of the active region plug.",
"These first and second vertical active layers may be formed as doped or undoped cylindrically-shaped silicon layers.",
"BRIEF DESCRIPTION OF THE DRAWINGS The accompanying drawings are included to provide a further understanding of the inventive concept, and are incorporated in and constitute a part of this specification.",
"The drawings illustrate exemplary embodiments of the inventive concept and, together with the description, serve to explain principles of the inventive concept.",
"In the drawings: FIG.",
"1A is a plan view illustrating a three-dimensional (3D) semiconductor memory device according to an embodiment of the inventive concept; FIG.",
"1B is a cross-sectional view taken along line I-P of FIG.",
"1A; FIG.",
"1C is a magnified view of a portion A of FIG.",
"1B; FIG.",
"2A is a cross-sectional view taken along line I-I′ of FIG.",
"1A for describing a modification example of a 3D semiconductor memory device according to an embodiment of the inventive concept; FIG.",
"2B is a cross-sectional view taken along line I-I′ of FIG.",
"1A for describing other modification example of a 3D semiconductor memory device according to an embodiment of the inventive concept; FIG.",
"3A is a cross-sectional view taken along line I-I′ of FIG.",
"1A for describing still other modification example of a 3D semiconductor memory device according to an embodiment of the inventive concept; FIG.",
"3B is a magnified view of a portion B of FIG.",
"3A; FIG.",
"3C is a magnified view of a portion B of FIG.",
"3A for describing even other modification example of a 3D semiconductor memory device according to an embodiment of the inventive concept; FIG.",
"3D is a magnified view of a portion B of FIG.",
"3A for describing yet other modification example of a 3D semiconductor memory device according to an embodiment of the inventive concept; FIG.",
"4A is a cross-sectional view taken along line I-I′ of FIG.",
"1A for describing further modification example of a 3D semiconductor memory device according to an embodiment of the inventive concept; FIG.",
"4B is a magnified view of a portion C of FIG.",
"4A; FIG.",
"5A is a plan view illustrating still further modification example of a 3D semiconductor memory device according to an embodiment of the inventive concept; FIG.",
"5B is a cross-sectional view taken along line II-II′ of FIG.",
"5A; FIGS.",
"6A to 6H are cross-sectional views taken along line I-I′ of FIG.",
"1A for describing a method of fabricating 3D semiconductor memory device according to an embodiment of the inventive concept; FIGS.",
"7A to 7D are cross-sectional views taken along line I-I′ of FIG.",
"1A for describing a modification example of a method of fabricating 3D semiconductor memory device according to an embodiment of the inventive concept; FIGS.",
"8A to 8F are cross-sectional views taken along line I-I′ of FIG.",
"1A for describing other modification example of a method of fabricating 3D semiconductor memory device according to an embodiment of the inventive concept; FIGS.",
"9A to 9D are cross-sectional views taken along line I-I′ of FIG.",
"1A for describing still other modification example of a method of fabricating 3D semiconductor memory device according to an embodiment of the inventive concept; FIGS.",
"10A to 10C are cross-sectional views taken along line I-I′ of FIG.",
"1A for describing even other modification example of a method of fabricating 3D semiconductor memory device according to an embodiment of the inventive concept; FIG.",
"11 is a cross-sectional view illustrating a 3D semiconductor memory device according to another embodiment of the inventive concept; FIG.",
"12A is a cross-sectional view illustrating a modification example of a 3D semiconductor memory device according to another embodiment of the inventive concept; FIG.",
"12B is a cross-sectional view illustrating other modification example of a 3D semiconductor memory device according to another embodiment of the inventive concept; FIG.",
"12C is a cross-sectional view illustrating still other modification example of a 3D semiconductor memory device according to another embodiment of the inventive concept; FIG.",
"12D is a cross-sectional view illustrating even other modification example of a 3D semiconductor memory device according to another embodiment of the inventive concept; FIG.",
"12E is a cross-sectional view illustrating yet other modification example of a 3D semiconductor memory device according to another embodiment of the inventive concept; FIG.",
"12F is a cross-sectional view illustrating further modification example of a 3D semiconductor memory device according to another embodiment of the inventive concept; FIGS.",
"13A to 13E are cross-sectional views for describing a method of fabricating 3D semiconductor memory device according to another embodiment of the inventive concept; FIG.",
"14 is a cross-sectional view illustrating a modification example of a method of fabricating 3D semiconductor memory device according to another embodiment of the inventive concept; FIGS.",
"15A to 15F are cross-sectional views illustrating other modification example of a method of fabricating 3D semiconductor memory device according to another embodiment of the inventive concept; FIGS.",
"16A and 16B are cross-sectional views illustrating still other modification example of a method of fabricating 3D semiconductor memory device according to another embodiment of the inventive concept; FIG.",
"17 is a block diagram schematically illustrating an example of an electronic system including a 3D semiconductor memory device according to an embodiment of the inventive concept; and FIG.",
"18 is a block diagram schematically illustrating an example of a memory card including a 3D semiconductor memory device according to an embodiment of the inventive concept.",
"DETAILED DESCRIPTION OF THE EMBODIMENTS The present invention now will be described more fully with reference to the accompanying drawings, in which preferred embodiments of the invention are shown.",
"This invention may, however, be embodied in many different forms and should not be construed as being limited to the embodiments set forth herein; rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the scope of the invention to those skilled in the art.",
"Like reference numerals refer to like elements throughout.",
"It will be understood that when an element or layer is referred to as being “on,” “connected to” or “coupled to” another element or layer (and variants thereof), it can be directly on, connected or coupled to the other element or layer or intervening elements or layers may be present.",
"In contrast, when an element is referred to as being “directly on,” “directly connected to” or “directly coupled to” another element or layer (and variants thereof), there are no intervening elements or layers present.",
"Like reference numerals refer to like elements throughout.",
"It will be understood that, although the terms first, second, third, etc.",
"may be used herein to describe various elements, components, regions, layers and/or sections, these elements, components, regions, layers and/or sections should not be limited by these terms.",
"These terms are only used to distinguish one element, component, region, layer or section from another region, layer or section.",
"Thus, a first element, component, region, layer or section discussed below could be termed a second element, component, region, layer or section without departing from the teachings of the present invention.",
"Spatially relative terms, such as “beneath,” “below,” “lower,” “above,” “upper” and the like, may be used herein for ease of description to describe one element or feature's relationship to another element(s) or feature(s) as illustrated in the figures.",
"It will be understood that the spatially relative terms are intended to encompass different orientations of the device in use or operation in addition to the orientation depicted in the figures.",
"For example, if the device in the figures is turned over, elements described as “below” or “beneath” other elements or features would then be oriented “above” the other elements or features.",
"Thus, the term “below” can encompass both an orientation of above and below.",
"The device may be otherwise oriented (rotated 90 degrees or at other orientations) and the spatially relative descriptors used herein interpreted accordingly.",
"The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the present invention.",
"As used herein, the singular forms “a,” “an” and “the” are intended to include the plural forms as well, unless the context clearly indicates otherwise.",
"It will be further understood that the terms “comprising”, “including”, having” and variants thereof, when used in this specification, specify the presence of stated features, steps, operations, elements, and/or components, but do not preclude the presence or addition of one or more other features, steps, operations, elements, components, and/or groups thereof.",
"In contrast, the term “consisting of” when used in this specification, specifies the stated features, steps, operations, elements, and/or components, and precludes additional features, steps, operations, elements and/or components.",
"Embodiments of the present invention are described herein with reference to cross-section and perspective illustrations that are schematic illustrations of idealized embodiments (and intermediate structures) of the present invention.",
"As such, variations from the shapes of the illustrations as a result, for example, of manufacturing techniques and/or tolerances, are to be expected.",
"Thus, embodiments of the present invention should not be construed as limited to the particular shapes of regions illustrated herein but are to include deviations in shapes that result, for example, from manufacturing.",
"For example, a sharp angle may be somewhat rounded due to manufacturing techniques/tolerances.",
"Unless otherwise defined, all terms (including technical and scientific terms) used herein have the same meaning as commonly understood by one of ordinary skill in the art to which the present invention belongs.",
"It will be further understood that terms, such as those defined in commonly used dictionaries, should be interpreted as having a meaning that is consistent with their meaning in the context of the relevant art and will not be interpreted in an idealized or overly formal sense unless expressly so defined herein.",
"FIG.",
"1A is a plan view illustrating a 3D semiconductor memory device according to an embodiment of the inventive concept.",
"FIG.",
"1B is a cross-sectional view taken along line I-P of FIG.",
"1A.",
"FIG.",
"1C is a magnified view of a portion A of FIG.",
"1B.",
"Referring to FIGS.",
"1A and 1B, a well region 102 doped with a first conductive dopant may be disposed in a semiconductor substrate 100 (hereinafter referred to as a substrate).",
"The substrate 100 may be a silicon substrate, a germanium substrate or a silicon-germanium substrate, for example a common source region 105 doped with a second conductive dopant may be formed in the well region 102.An upper surface of the common source region 105 may be disposed on the substantially same level as that of the upper surface of the substrate 100.A lower surface of the common source region 105 may be disposed on a level higher than that of a lower surface of the well region 102.One of the first and second conductive dopants may be an n-type dopant, and the other may be a p-type dopant.",
"For example, the well region 102 may be doped with a p-type dopant, and the common source region 105 may be doped with an n-type dopant.",
"A stack-structure, including insulation patterns 110a and gate patterns 155L, 155a1, 155a and 155U that are stacked alternately and repeatedly, may be disposed on the common source region 105.A plurality of the stack-structures may be disposed on the common source region 105.As illustrated in FIG.",
"1A, the stack-structures may be extended side by side in a first direction.",
"The stack-structures may be spaced apart in a second direction perpendicular to the first direction.",
"The first and second directions may be parallel with the upper surface of the substrate 100.A vertical active pattern 130 may pass through the stack-structure.",
"The vertical active pattern 130 may be extended into a recess region 120 that is formed in the common source region 105 under the vertical active pattern 130.Therefore, the vertical active pattern 130 may be connected to the well region 102 under the vertical active pattern 130.As illustrated in FIG.",
"1B, the recess region 120 may vertically pass through the common source region 105.A bottom surface of the recess region 120 may be disposed on a level lower than that of the lower surface of the common source region 105.The vertical active pattern 130 may contact the bottom surface of the recess region 120.Accordingly, the vertical active pattern 130 may contact the well region 102.Also, the vertical active pattern 130 may contact a sidewall of the recess region 120.As a result, the vertical active pattern 130 may directly contact the common source region 105.According to an embodiment of the inventive concept, a portion 122 of the well region 102 just under the bottom surface of the recess region 120 may have a high dopant concentration.",
"In other words, the first conductive dopant concentration of the portion 122 of the well region 102 may be higher than the first conductive dopant concentration of another portion of the well region 102.According to an embodiment of the inventive concept, the vertical active pattern 130 may have a hollow pipe shape or a macaroni shape.",
"Herein, the lower end of the vertical active pattern 130 may be in a closed state.",
"The inside of the vertical active pattern 130 may be filled with a filling dielectric pattern 132.A gate dielectric layer 150 may be disposed between a sidewall of the vertical active pattern 130 and each of the gate patterns 155L, 155a1, 155a and 155U.",
"According to an embodiment of the inventive concept, as illustrated in FIG.",
"1B, the gate dielectric layer 150 may be extended to cover an upper surface and a lower surface of each of the gate patterns 155L, 155a1, 155a and 155U.",
"That is, the extended portion of the gate dielectric layer 150 may be disposed between each of the gate patterns 155L, 155a1, 155a and 155U and the insulation pattern 110a adjacent to each of the gate patterns 155L, 155a1, 155a and 155U.",
"The gate dielectric layer 150 will be described below in more detail with reference to FIG.",
"1C.",
"Referring to FIG.",
"1C, according to an embodiment of the inventive concept, the gate dielectric layer 150 may include a tunnel dielectric layer 141, a charge storage layer 142 and a blocking dielectric layer 143.The tunnel dielectric layer 141 may be adjacent to the sidewall of the vertical active pattern 130, and the blocking dielectric layer 143 may be adjacent to each of the gate patterns 155L, 155a1, 155a and 155U.",
"The charge storage layer 142 may be disposed between the tunnel dielectric layer 141 and the blocking dielectric layer 143.According to an embodiment of the inventive concept, as illustrated in FIG.",
"1C, the entirety of the gate dielectric layer 150 (i.e., the tunnel dielectric layer 141, the charge storage layer 142 and the blocking dielectric layer 143) may be extended to cover the upper and lower surfaces of each of the gate patterns 155L, 155a1, 155a and 155U.",
"The tunnel dielectric layer 141 may include oxide and/or oxynitride.",
"The tunnel dielectric layer 141 may be single-layered or multi-layered.",
"The charge storage layer 142 may include a dielectric material having traps for storing electric charges, for example, the charge storage layer 142 may include nitride and/or metal-oxide.",
"The blocking dielectric layer 143 may include a high-k dielectric layer having a dielectric constant higher than that of the tunnel dielectric layer 141.For example, the high-k dielectric layer in the blocking dielectric layer 143 may include metal-oxide such as aluminum-oxide or hafnium-oxide.",
"Furthermore, the blocking dielectric layer 143 may further include a barrier dielectric layer.",
"The barrier dielectric layer in the blocking dielectric layer 143 may include a dielectric material having a greater band gap than the high-k dielectric layer in the blocking dielectric layer 143.For example, the barrier dielectric layer may include oxide.",
"The barrier dielectric layer may be disposed between the high-k dielectric layer and the charge storage layer 142.A lowermost gate pattern 155L in the stack-structure may correspond to a ground selection gate.",
"A ground selection transistor including the lowermost gate pattern 155L may include a vertical channel region that is defined in the sidewall of the vertical active pattern 130.As illustrated in FIGS.",
"1A and 1B, the entire lower surface of the lowermost gate pattern 155L may substantially overlap with the common source region 105.An uppermost gate pattern 155U in the stack-structure may correspond to a string selection gate.",
"Gate patterns 155a1 and 155a between the uppermost gate pattern 155U and the lowermost gate pattern 155L may correspond to cell gates.",
"A string selection transistor including the uppermost gate pattern 155U and cell transistors including the cell gates may also include vertical channel regions that are defined in the sidewall of the vertical active pattern 130a.",
"The vertical channel regions of the ground selection transistor, the cell transistor and the string selection transistor configuring one cell string may be defined in the vertical active pattern 130.According to an embodiment of the inventive concept, among gate patterns used as the cell gates in the stack-structure, a gate pattern most adjacent to the lowermost gate pattern 155L may correspond to a dummy cell gate.",
"For example, the gate pattern 1551a disposed just on the lowermost gate pattern 155L may be a dummy gate pattern.",
"For example, the gate pattern 155a1 that is stacked secondly from the substrate 100 may be a dummy cell gate.",
"Naturally, one of the insulation pattern 110a is disposed between the lowermost gate pattern 155L and the secondly-stacked gate pattern 155a1.For example, a dummy cell transistor including the secondly-stacked gate pattern 155a1 may have the same shape as that of a cell transistor storing data, but may not serve as the cell transistor.",
"For example, the dummy cell transistor may perform only a turn-on/off function.",
"Thus, the secondly-stacked gate pattern 155a1 may be a second ground selection gate.",
"In this case, the cell string may include a plurality of stacked ground selection transistors.",
"A plurality of the vertical active patterns 130 may pass through each of the stack-structures.",
"As illustrated in FIG.",
"1A, the vertical active patterns 130 passing though each of the stack-structures may be arranged in the first direction to form one column.",
"Alternatively, the vertical active patterns 130 passing though each of the stack-structures may be arranged in a zigzag shape in the first direction.",
"The vertical active pattern 130 may include a semiconductor material.",
"For example, the vertical active pattern 130 may include the same semiconductor material as that of the substrate 100.The vertical active pattern 130 may have an undoped state, or may be doped with the first conductive dopant.",
"The vertical active pattern 130 may have a poly-crystalline state or a single crystalline state.",
"The gate patterns 155L, 155a1, 155a and 155U include a conductive material.",
"For example, the gate patterns 155L, 155a1, 155a and 155U may include at least one of a doped semiconductor (for example, doped silicon and others), a metal (for example, tungsten, aluminum, copper and others), a transition metal (for example, titanium, tantalum and others) or a conductive metal nitride (for example, a titanium nitride, a tantalum nitride and others).",
"The insulation patterns 110a may include oxide.",
"A device isolation pattern 160a may be disposed between the stack-structures.",
"An upper surface of the device isolation pattern 160a and an upper surface of the stack-structure may substantially be coplanar.",
"An interlayer dielectric 165 may be disposed on the substrate 100.A contact plug 167 may be connected to an upper end of the vertical active pattern 130 through the interlayer dielectric 165.A drain being doped with the second conductive dopant may be formed in the upper portion of the vertical active pattern 130.A lower surface of the drain may be disposed on a level adjacent to an upper surface of the uppermost gate pattern 155U.",
"A bit line 170 may be disposed on the interlayer dielectric 165, and may be connected to the contact plug 167.The bit line 170 may be extended in the second direction and cross over the stack-structure.",
"The interlayer dielectric 165 may include oxide.",
"The contact plug 167 includes a conductive material.",
"For example, the contact plug 167 may include tungsten.",
"The bit line 170 also includes a conductive material.",
"As an example, the bit line 170 may include tungsten, copper, aluminum or the like.",
"According to the above-described 3D semiconductor memory device, the vertical active pattern 130 may be disposed in the recess region 120 passing though the common source region 105 and be connected to the well region 102.Moreover, the common source region 105 may be disposed under the lowermost gate pattern 155L.",
"Therefore, a distance between the vertical active pattern 130 and the common source region can be minimized, and also the vertical active pattern 130 can be connected to the well region 102.Consequently, a current flowing through the vertical active pattern 130 can quickly flow to the common source region 105.Accordingly, the reduction of an amount of current in a cell transistor can be minimized.",
"Also, the vertical active pattern 130 is connected to the well region 102, such that the erasing operation of cell transistors is very easy.",
"As a result, the 3D semiconductor memory device can be implemented which has excellent reliability and is optimized for high integration.",
"Next, the modification examples of the 3D semiconductor memory device according to an embodiment of the inventive concept will be described below with reference to the accompanying drawings.",
"In the modification examples, a description on the same elements as the above-described elements will be omitted for avoiding a repetitive description.",
"FIG.",
"2A is a cross-sectional view taken along line I-I′ of FIG.",
"1A for describing a modification example of a 3D semiconductor memory device according to an embodiment of the inventive concept.",
"Referring to FIG.",
"2A and according to the modification example, protection dielectric patterns 173a may be disposed between the insulation patterns 110a and the vertical active pattern 130 and between the inner sidewall of the recess region 120 and the vertical active pattern 130.The protection dielectric pattern 173a may include a dielectric material for protecting the vertical active pattern 130 in a fabricating process.",
"For example, the protection dielectric pattern 173a may include oxide.",
"According to the modification example, a capping semiconductor pattern 175 may be disposed on the vertical active pattern 130.The capping semiconductor pattern 175 may also be disposed on the protection dielectric pattern 173a that is disposed between an uppermost insulation pattern 110a and the vertical active pattern 130.The upper end of the vertical active pattern 130 may be disposed on a level lower than an upper surface of the uppermost insulation pattern 110a.",
"The upper surface of the capping semiconductor pattern 175 and the upper surface of the uppermost insulation pattern 110a may be substantially coplanar.",
"The capping semiconductor pattern 175 may include the same semiconductor material as that of the vertical active pattern 130.The capping semiconductor pattern 175 may be doped with the second conductive dopant.",
"The contact plug 167 may be connected to the capping semiconductor pattern 175.FIG.",
"2B is a cross-sectional view taken along line I-I′ of FIG.",
"1A for describing other modification example of a 3D semiconductor memory device according to an embodiment of the inventive concept.",
"Referring to FIG.",
"2B and according to the modification example, a bottom surface of the recess region 120 may be disposed on a level higher than the lower surface of the common source region 105.In this case, a region 122a being counter-doped with the first conductive dopant may be disposed under the bottom surface of the recess region 120a.",
"The counter-doped region 122a may contact the vertical active pattern 130 and the well region 102.Therefore, the vertical active pattern 130 may be connected to the well region 102 through the counter-doped region 122a.",
"FIG.",
"3A is a cross-sectional view taken along line I-I′ of FIG.",
"1A for describing still other modification example of a 3D semiconductor memory device according to an embodiment of the inventive concept.",
"FIG.",
"3B is a magnified view of a portion B of FIG.",
"3A.",
"Referring to FIG.",
"3A, a gate dielectric layer 150a according to the modification example may be disposed between a vertical active pattern 130a and each of the gate patterns 155L, 155a1, 155a and 155U.",
"The gate dielectric layer 150a may include a first sub-layer 147 and a second sub-layer 149.The first sub-layer 147 may be substantially extended vertically and be disposed between the vertical active pattern 130a and the insulation pattern 110a.",
"The second sub-layer 149 may be substantially extended horizontally and cover the lower surface and upper surface of each of the gate patterns 155L, 155a1, 155a and 155U.",
"The gate dielectric layer 150a may include the tunnel dielectric layer, the charge storage layer and the blocking dielectric layer.",
"Herein, the first sub-layer 147 may include at least a portion of the tunnel dielectric layer, and the second sub-layer 149 may include at least a portion of the blocking dielectric layer.",
"One of the first and second sub-layers 147 and 149 may include the charge storage layer.",
"In other words, a portion of the gate dielectric layer 150a including the tunnel dielectric layer, the charge storage layer and the blocking dielectric layer may be extended vertically, and another portion of the gate dielectric layer 150a may be extended horizontally.",
"The vertical active pattern 130a may include first and second semiconductor patterns 123 and 124.The first semiconductor pattern 123 may be disposed between the second semiconductor pattern 124 and the first sub-layer 147.The first semiconductor pattern 123 may contact the first sub-layer 147.According to an embodiment of the inventive concept, the first semiconductor pattern 123 may have a macaroni shape or a pipe shape where an upper end and a lower end are opened.",
"The first semiconductor pattern 123 may not contact the inner surface of the recess region 120 by the first sub-layer 147.The second semiconductor pattern 124 may contact the first semiconductor pattern 123 and the inner surface of the recess region 120.The second semiconductor pattern 124 may have a macaroni shape or a pipe shape where a lower end is closed.",
"A filling dielectric pattern 132 may fill the inside of the second semiconductor pattern 124.The first and second semiconductor patterns 123 and 124 may have an undoped state or be doped with a dopant (i.e., the first conductive dopant) having the same type as that of the well region 102.According to an embodiment of the inventive concept, as illustrated in FIG.",
"3B, the first sub-layer 147 of the gate dielectric layer 150a may include a tunnel dielectric layer 141, a charge storage layer 142 and a barrier dielectric layer 144.In this case, the second sub-layer 149 may include a high-k dielectric material (for example, metal-oxide such as aluminum oxide or hafnium oxide) having a dielectric constant higher than that of the tunnel dielectric layer 141.The barrier dielectric layer 144 may include a dielectric material having a greater band gap than that of the high-k dielectric material.",
"For example, the barrier dielectric layer 144 may include oxide.",
"The second sub-layer 149 and the barrier dielectric layer 144, disposed between the charge storage layer 142 and each of the gate patterns 155L, 155a1, 155a and 155U, may included in the blocking dielectric layer.",
"In other words, the first sub-layer 147 may include the tunnel dielectric layer 141, the charge storage layer 142 and a portion (i.e., the barrier dielectric layer 144) of the blocking dielectric layer, and the second sub-layer 149 may include another portion (i.e., the high-k dielectric layer) of the blocking dielectric layer.",
"However, an embodiment of the inventive concept is not limited thereto.",
"The first and second sub-layers of the gate dielectric layer may be combined differently.",
"FIG.",
"3C is a magnified view of a portion B of FIG.",
"3A for describing even other modification example of a 3D semiconductor memory device according to an embodiment of the inventive concept.",
"Referring to FIG.",
"3C, a first sub-layer 147a of a gate dielectric layer 150b according to the modification example may include a tunnel dielectric layer 141 and a charge storage layer 142, and a second sub-layer 149a of the gate dielectric layer 150b may include a barrier dielectric layer 144 and a high-k dielectric layer 146.The high-k dielectric layer 146 may be formed of the same material as the high-k dielectric material that has been described above with reference to FIG.",
"3B.",
"According to the modification example, the second sub-layer 149b may correspond to a blocking dielectric layer.",
"According to the modification example, the first sub-layer 147a may include the tunnel dielectric layer 141 and the charge storage layer 142, and the second sub-layer 149a may include the blocking dielectric layer.",
"FIG.",
"3D is a magnified view of a portion B of FIG.",
"3A for describing yet other modification example of a 3D semiconductor memory device according to an embodiment of the inventive concept.",
"Referring to FIG.",
"3D, a first sub-layer 147b of a gate dielectric layer 150c according to the modification example may include the tunnel dielectric layer, and a second sub-layer 149b of the gate dielectric layer 150c may include the charge storage layer 142 and the blocking dielectric layer 143.According to the modification example, the tunnel dielectric layer in the gate dielectric layer 150c may be extended vertically and be disposed between the vertical active pattern 130a and the insulation pattern 110a, and the charge storage layer 142 and the blocking dielectric layer 143 in the gate dielectric layer 150c may be extended horizontally and cover the upper surface and lower surface of each of the gate patterns 155L, 155a1, 155a and 155U.",
"The first and second sub-layers according to an embodiment of the inventive concept are not limited to the modification examples that have been described above with reference to FIGS.",
"3B, 3C and 3D.",
"The first and second sub-layers may be combined differently.",
"FIG.",
"4A is a cross-sectional view taken along line I-I′ of FIG.",
"1A for describing further modification example of a 3D semiconductor memory device according to an embodiment of the inventive concept.",
"FIG.",
"4B is a magnified view of a portion C of FIG.",
"4A.",
"Referring to FIGS.",
"4A and 4B, the entirety of a gate dielectric layer 150d between the vertical active pattern 130a and each of the gate patterns 155L, 155a1, 155a and 155U may be substantially extended vertically.",
"That is, the tunnel dielectric layer 141, charge storage layer 142 and blocking dielectric layer 143 of the gate dielectric layer 150d may be substantially extended vertically.",
"An extended portion of the gate dielectric layer 150d may be disposed between the vertical active pattern 130a and the insulation pattern 110a.",
"The stack-structure of FIGS.",
"1A and 1B may have a line shape that is extended in the first direction.",
"Unlike this, the stack-structure may include gate patterns having a flat plate shape.",
"This will be described below with reference to the accompanying drawings.",
"FIG.",
"5A is a plan view illustrating still further modification example of a 3D semiconductor memory device according to an embodiment of the inventive concept.",
"FIG.",
"5B is a cross-sectional view taken along line II-II′ of FIG.",
"5A.",
"Referring to FIGS.",
"5A and 5B, a stack-structure according to the modification example may include gate patterns 220L, 220a, 220 and 220U and insulation patterns 210 and 210U that are stacked alternately and repeatedly.",
"A lowermost gate pattern 220L in the stack-structure may be a ground selection gate, and an uppermost gate pattern 220U in the stack-structure may be a string selection gate.",
"The gate pattern 220a just on the lowermost gate pattern 220L may be used as a cell gate, a dummy cell gate or a second ground selection gate.",
"The gate patterns 220 between the gate pattern 220a just on the lowermost gate pattern 220L and the upper gate pattern 220U may be used as cell gates.",
"The gate patterns 220L, 220a and 220 under a string selection gate, as illustrated in FIGS.",
"5A and 5B, may have a flat plate shape.",
"The uppermost gate pattern 220U corresponding to the string selection gate may have a line shape that is extended in the first direction.",
"The uppermost gate pattern 220U may be provided in plurality, and the uppermost gate patterns 220U may be extended side by side in the first direction.",
"The bit line 170 may be extended in the second direction and cross over the uppermost gate pattern 220U.",
"Like the uppermost gate pattern 220U, an uppermost insulation pattern 210U on the uppermost gate pattern 220U may also be extended in the first direction.",
"The vertical active pattern 130a may pass through the stack-structure and be extended into the recess region 120 under it.",
"The lowermost gate pattern 220L corresponding to the ground selection gate may be disposed on the common source region 105 in the substrate 100.The entire lower surface of the lowermost gate pattern 220L may substantially overlap with the common source region 105.According to the modification example, the gate dielectric layer 150d may be disposed between the vertical active pattern 130a and the inner sidewall of an opening 115 passing through the stack-structure.",
"The gate dielectric layer 150d may be substantially extended vertically.",
"The opening 115 and the recess region 120 may be self-aligned.",
"The gate dielectric layer 150d may be extended into the recess region 120.According to an embodiment of the inventive concept, the lower end of the gate dielectric layer 150d in the recess region 120 may be disposed on a level higher than the lower surface of the recess region 120.A lower interlayer dielectric 163 may be disposed between the uppermost gate patterns 220U.",
"An upper surface of the lower interlayer dielectric 163 may be coplanar with an upper surface of the uppermost insulation pattern 210U.",
"An upper interlayer dielectric 165 may be disposed on the lower interlayer dielectric 163 and the uppermost gate patterns 220U.",
"The insulation patterns 210 and 210U may include oxide, nitride and/or oxynitride.",
"The gate patterns 220L, 220a, 220 and 220U may include at least one of a doped semiconductor (for example, doped silicon), a metal (for example, tungsten and others) or a conductive metal nitride (for example, a titanium nitride, a tantalum nitride and others).",
"The elements of the above-described modification examples may be combined or replaced.",
"For example, the capping semiconductor pattern 175 of FIG.",
"2A may be disposed on the vertical active pattern 130 or 130a that has been disclosed in FIG.",
"1B, 3A, 4A or 5B.",
"FIGS.",
"6A to 6H are cross-sectional views taken along line I-I′ of FIG.",
"1A for describing a method of fabricating 3D semiconductor memory device according to an embodiment of the inventive concept.",
"Referring to FIG.",
"6A, a well region 102 may be formed by providing a first conductive dopant into the substrate 100.A common source region 105 may be formed by providing a second conductive dopant into the upper portion of the well region 102.Insulation layers 110 and sacrificial layers 112 may be alternately and repeatedly stacked on the common source region 105.For example, the insulation layers 110 may be formed as oxide layers.",
"The sacrificial layers 112 may be formed of materials having an etch selectivity with respect to the insulation layers 112.For example, the sacrificial layers 112 may be formed as nitride layers.",
"Referring to FIG.",
"6B, an opening 115 and a recess region 120 may be formed by sequentially patterning the insulation layers 110, sacrificial layers 112 and the substrate 100.The opening 115 may pass through the insulation layers 110 and sacrificial layers 112, and the recess region 120 may be formed in the common source region 102 under the opening 115 (i.e., in a portion of the substrate 100).",
"The recess region 120 is self-aligned in the opening 115 by sequentially patterning the insulation layers 110 and sacrificial layers 112 and the substrate 100.The recess region 120 may pass through the common source region 105, and the bottom surface of the recess region 120 may be disposed on a level lower than the lower surface of the common source region 105.Therefore, the well region 102 may be exposed to the bottom surface of the recess region 120, and the common source region 105 may be exposed to the inner sidewall of the recess region 120.A high concentration region 122 may be formed by providing the first conductive dopant into the well region 102 through the bottom surface of the recess region 120.The high concentration region 122 of the first conductive dopant may be higher than another portion of the well region 102.That is, due to the high concentration region 122, the well region 102 may partially have a high dopant concentration.",
"Referring to FIG.",
"6C, a semiconductor layer may be conformally formed on the substrate 100 having the opening 115 and the recess region 120.Therefore, the semiconductor layer may be formed to have a substantially uniform thickness on the inner surface of the recess region 120 and an inner sidewall of the opening 115.The semiconductor layer may contact the inner surface (i.e., an inner sidewall and a bottom surface) of the recess region 120.The semiconductor layer may be formed in a chemical vapor deposition process and/or an atomic layer deposition process.",
"A filling dielectric layer may be formed on the semiconductor layer to fill the opening 115.For example, the filling dielectric layer may be formed as an oxide layer.",
"By planarizing the filling dielectric layer and the semiconductor layer until the uppermost insulation layer 110 is exposed, a vertical active pattern 130 and a filling dielectric pattern 132 may be formed in the opening 115 and the recess region 120.Referring to FIG.",
"6D, a trench 135 may be formed by sequentially patterning the insulation layers 110 and sacrificial layers 112, such that insulation patterns 110a and the sacrificial patterns 112a being alternately and repeatedly stacked may be formed at a side of the trench 135.The insulation patterns 110a and sacrificial patterns 112a may include the opening 115.That is, the vertical active patterns 130 may sequentially pass through the insulation patterns 110a and the sacrificial patterns 112a being alternately and repeatedly stacked on the substrate 100.Sidewalls of the sacrificial patterns 112a and the insulation patterns 110a are exposed to the trench 135.Referring to FIG.",
"6E, empty regions 140 may be formed by removing the sacrificial patterns 112a exposed to the trench 135.Each of the empty regions 140 corresponds to a region from which the each sacrificial pattern 112a is removed.",
"The empty regions 140 may expose some portions of the sidewall of the vertical active pattern 130, respectively.",
"Referring to FIG.",
"6F, a gate dielectric layer 150 may be conformally formed on the substrate 100 having the empty regions 140.Therefore, the gate dielectric layer 150 may be conformally formed on the inner surfaces of the empty regions 140.The gate dielectric layer 150, as described above with reference to FIGS.",
"1B and 1C, may include the tunnel dielectric layer, the charge storage layer and the blocking dielectric layer.",
"A gate conductive layer 155 filling the empty regions 140 may be formed on the substrate 100 having the gate dielectric layer 150.The gate conductive layer 155 may also be formed in the trench 135.Herein, the gate conductive layer 155 may partially fill the trench 135.Therefore, a space surrounded by the gate conductive layer 155 may be formed in the trench 135.A bottom surface of the space may be lower than an inner-upper surface of the lowermost empty region 140.Referring to FIG.",
"6G, the gate patterns 155L, 155a1, 155a and 155U respectively filling the empty regions 140 may be formed by etching the gate conductive layer 155.The gate patterns 155L, 155a1, 155a and 155U are separated by the etching process of the gate conductive layer 155.According to an embodiment of the inventive concept, the etching process of the gate conductive layer 155 may be an isotropic etching process.",
"The insulation patterns 110a and the gate patterns 155L, 155a1, 155a and 155U, being alternately and repeatedly stacked on the substrate 100, may be included in a stack-structure.",
"Subsequently, a device isolation insulation layer 160 may be formed to fill the trench 135.Referring to FIG.",
"6H, the device isolation insulation layer 160 and the gate dielectric layer 150 may be planarized until the uppermost insulation pattern among the insulation patterns 110a is exposed.",
"Therefore, a device isolation pattern 160a may be formed in the trench 135.Subsequently, by forming the interlayer dielectric 165, contact plug 167 and bit line 170 of the FIG.",
"1B on the substrate 100, the 3D semiconductor memory device that has disclosed in FIGS.",
"1A, 1B and 1C may be implemented.",
"According to the above-described 3D semiconductor memory device, the opening 115 and the recess region 120 can be formed in self-alignment by sequentially patterning the insulation layers 110, the sacrificial layers 112 and the substrate 100 (i.e.",
"the common source region 105).",
"Therefore, the 3D semiconductor memory device can be implemented which has excellent reliability and is optimized for high integration.",
"Next, a method of fabricating the 3D semiconductor memory device that has been disclosed in FIG.",
"2A will be described below with reference to the accompanying drawings.",
"The method may include the methods that have been described above with reference to FIGS.",
"6A and 6B.",
"FIGS.",
"7A to 7D are cross-sectional views taken along line I-I′ of FIG.",
"1A for describing a modification example of a method of fabricating 3D semiconductor memory device according to an embodiment of the inventive concept.",
"Referring to FIGS.",
"6B and 7A, a protection dielectric layer 173 may be conformally formed on the substrate 100 having the opening 115 and the recess region 120, and the protection dielectric layer 173 may be etched by a blanket anisotropic etching process until the bottom surface of the recess region 120 is exposed.",
"As illustrated in FIG.",
"7A, therefore, the protection dielectric layer 173 may be formed on the sidewalls of the recess region 120 and the opening 115.The protection dielectric layer 173 may include a dielectric material having an etch selectivity with respect to the sacrificial layer 112.For example, the protection dielectric layer 173 may be formed of oxide.",
"Subsequently, a semiconductor layer may be formed, a filling dielectric layer may be formed on the semiconductor layer, and the filling dielectric layer and the semiconductor layer may be planarized.",
"Therefore, the vertical active pattern 130 and the filling dielectric pattern 132 may be formed in the opening 115 and the recess region 120.The vertical active pattern 130 may contact the bottom surface of the recess region 120.The protection dielectric layer 173 may be disposed between the vertical active pattern 130 and the inner sidewalls of the opening 115 and the recess region 120.Referring to FIG.",
"7B, the upper ends of the vertical active pattern 130, filling dielectric pattern 132 and protection dielectric layer 175 may be recessed lower than the upper surface of the uppermost insulation layer 110.Subsequently, a capping semiconductor layer filling the opening 110 may be formed on the substrate 100, and a capping semiconductor pattern 175 may be formed by planarizing the capping semiconductor layer until the uppermost insulation layer 110 is exposed.",
"The capping semiconductor pattern 175 may cover the recessed upper ends of the vertical active pattern 130, filling dielectric pattern 132 and protection dielectric layer 175.Subsequently, the trench 135 may be formed by sequentially patterning the insulation layers 110 and the sacrificial layers 112.In this case, as described above, the insulation patterns 110 and the sacrificial patterns 112a that are alternately and repeatedly stacked may be formed at a side of the trench 135.Referring to FIG.",
"7C, the sacrificial patterns 112a exposed to the trench 135 may be removed.",
"Therefore, the empty regions 140 may be formed which respectively exposes some portions of the protection dielectric layer 173 disposed on the sacrificial patterns 112a and the vertical active patterns 130.As described above, the protection dielectric layer 173 has an etch selectivity with respect to the sacrificial patterns 112a, and thus it can protect the vertical active pattern 130 from a process of removing the sacrificial patterns 112a.",
"The protection dielectric layer 173 may be used as an etch stop layer in the process of removing the sacrificial patterns 112a.",
"Subsequently, the exposed portions of the protection dielectric layer 173 may be removed.",
"Therefore, the empty regions 140 may expose some portions of the side wall of the vertical active pattern 130, respectively.",
"When removing the exposed portions of the protection dielectric layer 173, the protection dielectric patterns 173a may be formed between the vertical active pattern 130 and the insulation patterns 110a and between the vertical active pattern 130 and the inner sidewall of the recess region 120.The protection dielectric patterns 173a correspond to remaining portions of protection dielectric layer 173.Referring to FIG.",
"7D, the gate dielectric layer 150 may be conformally formed on the substrate 100 having the empty regions 140, and the gate patterns 155L, 155a1, 155a and 155U respectively filling the empty regions 140 may be formed.",
"Afterwards, the device isolation pattern 160a filling the trench 135 may be formed.",
"Subsequently, by forming the interlayer dielectric 165, contact plug 167 and bit line 170 of FIG.",
"2A, the 3D semiconductor memory device of FIG.",
"2A can be implemented.",
"The features of a method, that fabricates the 3D semiconductor memory device that has been disclosed in FIG.",
"2B, may have a process of forming the lower surface of the recess region 120 higher than the lower surface of the common source region 105 and a process of forming the counter-doped region 122a by counter-doping the common source region 105 under the bottom surface of the recess region 120 with the first conductive dopant.",
"Other processes may be the same as the processes that have been described above with reference to FIGS.",
"7A to 7D.",
"Next, a method of fabricating the 3D semiconductor memory device that has been disclosed in FIG.",
"3A will be described below with reference to the accompanying drawings.",
"The method may include the methods that have been described above with reference to FIGS.",
"6A and 6B.",
"FIGS.",
"8A to 8F are cross-sectional views taken along line I-I′ of FIG.",
"1A for describing other modification example of a method of fabricating 3D semiconductor memory device according to an embodiment of the inventive concept.",
"Referring to FIGS.",
"6B and 8A, a first sub-layer 147 may be conformally formed on the substrate 100 having the opening 115 and the recess region 120.The first sub-layer 147 may be conformally formed on the inner sidewall of the opening 115 and the inner surface of the recess region 120.A first semiconductor layer 121 may be conformally formed on the substrate 100 having the first sub-layer 147.Referring to FIG.",
"8B, portions of the first sub-layer 147 and the first semiconductor layer 121 disposed on the bottom surface of the recess region 120 may be removed.",
"At this point, portions of the first sub-layer 147 and the first semiconductor layer 121 disposed outside opening 115 may also be removed.",
"Therefore, the first sub-layer 147 and the first semiconductor pattern 123 that are sequentially stacked on the sidewalls of the recess region 120 and opening 115 may be formed.",
"The first semiconductor pattern 123 corresponds to a portion of the first semiconductor layer 121.According to an embodiment of the inventive concept, by blanket-anisotropic-etching the first semiconductor layer 121 and the first sub-layer 147 until the bottom surface of the recess region 120 is exposed, the first semiconductor pattern 123 may be formed.",
"The first semiconductor pattern 123 may not contact the inner surface of the recess region 120 by the first sub-layer 147.Referring to FIG.",
"8C, subsequently, by isotropic-etching the first sub-layer 147, at least one portion of the inner sidewall of the recess region 120 may be exposed.",
"At this point, a portion of the first semiconductor pattern 123 in the recess region 120 may also be etched.",
"Referring to FIG.",
"8D, subsequently, a second semiconductor layer may be conformally formed on the substrate 100, a filling dielectric layer filling the opening 115 may be formed on the second semiconductor layer.",
"The second semiconductor layer may contact the first semiconductor pattern 123, and also the second semiconductor layer may contact the bottom surface and exposed inner sidewall of the recess region 120.By planarizing the second semiconductor layer and the filling dielectric layer, a second semiconductor pattern 124 and a filling dielectric pattern 132 may be formed in the opening 115 and the recess region 120.The second semiconductor pattern 124 may contact the bottom surface and inner sidewall of the recess region 120 and the first semiconductor pattern 123.The first and second semiconductor patterns 123 and 124 may configure a vertical active pattern 130a.",
"Referring to FIG.",
"8E, subsequently, the trench 135, the insulation patterns 110a and the sacrificial patterns 112 may be formed by sequentially patterning the insulation layers 110 and the sacrificial layers 112.The empty regions 140 may be formed by removing the sacrificial patterns 112.At this point, the empty regions 140 may expose some portions of the first sub-layer 147, respectively.",
"Referring to FIG.",
"8F, a second sub-layer 149 may be conformally formed on the substrate 100 having the empty regions 140.The second sub-layer 149 may be conformally formed on the inner surfaces of the empty regions 140.The second sub-layer 149 may contact the first sub-layer 147 exposed to the empty regions 140.The first and second sub-layers 147 and 149 may be included in the gate dielectric layer 150a.",
"The first sub-layer 147 may include at least a portion of the tunnel dielectric layer, and the second sub-layer 149 may include at least a portion of the blocking dielectric layer.",
"Herein, one of the first and second sub-layers 147 and 149 may include the charge storage layer.",
"According to an embodiment of the inventive concept, the first and second sub-layers 147 and 149 may be the same as the layers that have been described above with reference to FIG.",
"3B.",
"Unlike this, the first and second sub-layers 147 and 149 may be replaced with the first and second sub-layers 147a and 149a of the FIG.",
"3C, respectively.",
"Unlike this, the first and second sub-layers 147 and 149 may be replaced with the first and second sub-layers 149b and 149c of the FIG.",
"3C, respectively.",
"Subsequently, the gate patterns 155L, 155a1, 155a and 155U respectively filling the empty regions 140 may be formed, and the device isolation pattern 160a filling the trench 135 may be formed.",
"Subsequently, the interlayer dielectric 165, the contact plug 167 and the bit line 170 that have been disclosed in FIG.",
"3A may be funned.",
"Next, a method of fabricating the 3D semiconductor memory device that has been disclosed in FIGS.",
"4A and 4B will be described below with reference to the accompanying drawings.",
"The method may include the methods that have been described above with reference to FIGS.",
"6A and 6B.",
"FIGS.",
"9A to 9D are cross-sectional views taken along line I-I′ of FIG.",
"1A for describing still other modification example of a method of fabricating 3D semiconductor memory device according to an embodiment of the inventive concept.",
"Referring to FIGS.",
"6B to 9A, a gate dielectric layer 150d may be conformally formed on the substrate 100 having the opening 115 and the recess region 120.A first semiconductor layer may be conformally formed on the gate dielectric layer 150d.",
"Subsequently, the first semiconductor layer and the gate dielectric layer 150d may be etched by a blanket-anisotropic-etching process until the bottom of the recess region 120 is exposed, such that a first semiconductor pattern 123 may be formed in the opening 115 and the recess region 120.At this point, the gate dielectric layer 150d may also be restrictively disposed in the opening 115 and the recess region 120.The first semiconductor pattern 123 may not contact the side wall of the opening 115 and the inner surface of the recess region 120 by the gate dielectric layer 150d.",
"Referring to FIG.",
"9B, subsequently, a second semiconductor may be conformally formed over the substrate 100, and a filling dielectric layer may be formed on the second semiconductor layer.",
"By planarizing the filling dielectric layer and the second semiconductor layer, a second semiconductor pattern 124 and a filling dielectric pattern 132 may be formed in the opening 115 and the recess region 120.The first and second semiconductor patterns 123 and 124 may configure a vertical active pattern 130a.",
"Subsequently, a trench 135, insulation patterns 110a and sacrificial patterns 112a may be formed by sequentially patterning the insulation layers 110 and the sacrificial layers 112.According to the modification example, a portion of the lowermost insulation layer among the insulation layers 110 may remain under the trench 135.Referring to FIG.",
"9C, empty regions 140 may be formed by removing the sacrificial patterns 112a.",
"The empty regions 140 may expose the gate dielectric layer 150d.",
"Particularly, the blocking dielectric layer 143 (see FIG.",
"4B) in the gate dielectric layer 150d may be exposed.",
"Subsequently, a gate conductive layer 155 filling the empty regions 140 may be formed on the substrate 100.Referring to FIG.",
"9D, by removing the gate conductive layer outside the empty regions 140, gate patterns 155L, 155a1, 155a and 155U filling the empty regions 140 may be formed.",
"Subsequently, the device isolation pattern 160a filling the trench 135 may be formed, and the interlayer dielectric 165, contact plug 167 and bit line 170 of FIG.",
"4A may be formed.",
"Thus, the 3D semiconductor memory device of FIGS.",
"4A and 4B can be implemented.",
"Next, a method of fabricating the 3D semiconductor memory device of FIGS.",
"5A and 5B will be described below with reference to the accompanying drawings.",
"FIGS.",
"10A to 10C are cross-sectional views taken along line I-I′ of FIG.",
"1A for describing even other modification example of a method of fabricating 3D semiconductor memory device according to an embodiment of the inventive concept.",
"Referring to FIG.",
"10A, insulation layers 210 and gate layers 220 may be alternately and repeatedly stacked on the common source region 105 in the substrate 100.The insulation layers 210 and gate layers 220L, 220a and 220 may have a flat plate shape.",
"Referring to FIG.",
"10B, an uppermost gate pattern 220U and an uppermost insulation pattern 210U may be formed by patterning an uppermost insulation layer and an uppermost gate layer.",
"The uppermost gate pattern 220U and the uppermost insulation pattern 210U may have a line shape that is extended in one direction as illustrated in FIG.",
"5A.",
"A lower interlayer dielectric 163 may be formed on the substrate 100, and the lower interlayer dielectric 163 may be planarized.",
"An opening 115 and a recess region 120 may be formed by sequentially patterning the uppermost insulation pattern 210U, the uppermost gate pattern 220U, the insulation layers 210, the gate layers 220L, 220a and 220 and the common source region 105.The recess region 120 may be formed in self-alignment in the opening 115.By providing a first conductive dopant through the bottom surface of the recess region 120, a high concentration region 122 may be formed.",
"Subsequently, a gate dielectric layer 150d may be conformally formed over the substrate 100, and a first semiconductor layer may be conformally formed on the gate dielectric layer 150d.",
"By blanket-isotropic-etching the first semiconductor layer and the gate dielectric layer 150d until the bottom surface of the recess region 120 is exposed, a first semiconductor pattern 123 may be formed in the opening 115 and the recess region 120.Referring to FIG.",
"10C, a second semiconductor layer may be conformally formed over the substrate 100, and a filling dielectric layer may be formed on the second semiconductor.",
"By planarizing the filling dielectric layer and the second semiconductor layer, a second semiconductor pattern 124 and a filling dielectric pattern 132 may be formed in the opening 115 and the recess region 120.The first and second semiconductor patterns 123 and 124 may configure a vertical active pattern 130a.",
"Subsequently, the upper dielectric layer 165, contact plug 167 and bit line 170 of FIG.",
"5B may be formed.",
"Thus, the 3D semiconductor memory device of FIGS.",
"5A and 5B can be implemented.",
"According to the above-described method, the uppermost gate pattern 220U may be formed, and thereafter the vertical active pattern 130a may be formed.",
"Unlike this, after the opening 115, the recess region 120 and the vertical active pattern 130a may be formed, and then the uppermost gate pattern 220U may be formed.",
"When forming the uppermost gate pattern 220U, a stack-structure having a line shape may be formed by sequentially patterning the gate layers 220, 220a and 220L and insulation layers 110 under the uppermost gate pattern 220U.",
"In this case, the 3D semiconductor memory device of FIGS.",
"4A and 4B can be implemented.",
"In other words, the 3D semiconductor memory device of FIGS.",
"4A and 4B may be implemented in the method that has been described above with reference to FIGS.",
"9A to 9D or a modified method of a portion of the fabricating method of FIGS.",
"10A to 10C.",
"FIG.",
"11 is a cross-sectional view illustrating a 3D semiconductor memory device according to another embodiment of the inventive concept.",
"Referring to FIG.",
"11, a well region 102 doped with a first conductive dopant may be disposed in a substrate 100.A stack-structure may be disposed on the well region 102.The stack-structure may include insulation patterns 110a and gate patterns 155L, 155a1, 155a and 155U that are alternately and repeatedly stacked on the well region 102.A plurality of the stack-structures may be disposed on the well region 102.The stack-structures may be spaced apart from each other.",
"As illustrated in FIG.",
"1a, the stack-structures may be extended in parallel.",
"A vertical active pattern 280 may pass through the stack-structure.",
"Also, the vertical active pattern 280 may be extended into a recess region 120 that is formed in the substrate 100 under the vertical active pattern 280.The vertical active pattern 280 may include a lower active pattern 250 and an upper active pattern 270 that are sequentially stacked.",
"The lower active pattern 250 may fill the recess region 120.The upper active pattern 270 may contact the inner surface (i.e., inner sidewall and bottom surface) of the recess region 120.The lower active pattern 250 is disposed in the recess region 120 and contacts the well region 102.The upper surface of the lower active pattern 250 may be disposed on a level higher than that of the upper surface of the substrate 100.According to an embodiment of the inventive concept, as illustrated in FIG.",
"11, the upper surface of the lower active pattern 250 may be higher than the lower surface of the lowermost gate pattern 155L and lower than the upper surface of the lowermost gate pattern 155L.",
"However, the inventive concept is not limited thereto.",
"The upper active pattern 270 contacts the upper surface of the lower active pattern 250.According to an embodiment of the inventive concept, the lower active pattern 250 may have a pillar shape, and the upper active pattern 270 may have a pipe shape or a macaroni shape.",
"In this case, the inside of the upper active pattern 270 may be filled with a filling dielectric pattern 132.The lower and upper active patterns 250 and 270 may include a semiconductor material.",
"For example, the lower and upper active patterns 250 and 270 may include the same semiconductor material as that of the substrate 100.As an example, when the substrate 100 is a silicon substrate, the lower and upper active patterns 250 and 270 may include silicon.",
"According to an embodiment of the inventive concept, the lower active pattern 250 may have a single crystalline state.",
"The upper active pattern 270 may have a poly-crystalline state.",
"The lower active pattern 250 may be doped with a dopant having the same type as that of the well region 102.The upper active pattern 270 may be doped with a dopant having the same type as that of the well region 102, or may have an undoped state.",
"A high concentration region 122 may be disposed under the bottom surface of the recess region 120.The high concentration region 122 may correspond to a portion of the well region 102, and it may have a higher dopant concentration than another portion of the well region 102.A gate dielectric layer 150 may be disposed between a sidewall of the vertical active pattern 280 and each of the gate patterns 155L, 155a1, 155a and 155U.",
"As described above in first embodiment of the inventive concept, the gate dielectric layer 150 may be extended horizontally and cover the upper surface and lower surface of each of the gate patterns 155L, 155a1, 155a and 155U.",
"According to an embodiment of the inventive concept, a common source region 105a may be disposed in the substrate 100 of the both sides of the stack-structure, respectively.",
"The common source region 105a may be laterally separated from the lower active pattern 250.The common source region 105a is doped with a second conductive dopant.",
"A device isolation pattern 160a may be disposed between the stack-structures.",
"The common source region 105a may be disposed under the device isolation pattern 160a.",
"In operating of the 3D semiconductor memory device, a horizontal channel may be generated in the well region 102 under the lowermost gate pattern 155L.",
"The common source region 105a may be electrically connected to vertical channels that are formed in the vertical active pattern 280 by the horizontal channel in the well region 102.A contact plug 167 passing through the interlayer dielectric 165 may be connected to the upper end of the upper active pattern 270.A drain doped with the second conductive dopant may be disposed in the upper portion of the upper active pattern 270.The lower surface of the drain may be disposed on a level adjacent to the upper surface of the uppermost gate pattern 155U in the stack-structure.",
"According to the above-described 3D semiconductor memory device, the lower active pattern 250 included in the vertical active pattern 280 fills the recess region 120 to contact the well region 102.Therefore, reliability for the operations of a vertical cell string can be improved.",
"Particularly, reliability for the erasing operation of cell transistors can be enhanced.",
"Also, the vertical active pattern 280 may be divided into the lower active pattern 250 and the upper active pattern 270.Accordingly, an independent and additional process may be performed in the lower active pattern 250.For example, a dopant concentration may be adjusted in the lower active pattern 250.Thus, it is very easy to control the characteristic of the 3D semiconductor memory device.",
"As a result, the 3D semiconductor memory device can be implemented which has excellent reliability and is optimized for high integration.",
"Next, the modification examples of the 3D semiconductor memory device will be described below with reference to the accompanying drawings.",
"FIG.",
"12A is a cross-sectional view illustrating a modification example of a 3D semiconductor memory device according to another embodiment of the inventive concept.",
"Referring to FIG.",
"12A, a common source region 105 may be extended to the substrate 100 under the stack-structures.",
"For example, the entire lower surface of the lowermost gate pattern 155L may substantially overlap with the common source region 105.In this case, the bottom of the recess region 120 may be disposed on a level lower than the lower surface of the common source region 105.The common source region 105 may contact a sidewall of the lower active pattern 250.FIG.",
"12B is a cross-sectional view illustrating other modification example of a 3D semiconductor memory device according to another embodiment of the inventive concept.",
"Referring to FIG.",
"12B, a vertical active pattern 280a may include a lower active pattern 250 and an upper active pattern 270a that are sequentially stacked.",
"A gate dielectric layer 150a may be disposed between the upper active pattern 270a and each of the gate patterns 155a1, 155a and 155U disposed next to the upper active pattern 270a.",
"The gate dielectric layer 150a may include a first and a second sub-layers 147 and 149.As described above in first embodiment of the inventive concept, the first sub-layer 147 may be extended vertically and be disposed between the upper active pattern 270a and the insulation pattern 110a.",
"The second sub-layer 149 may be extended horizontally and cover the lower surface and upper surface of each of the gate patterns 155a1, 155a and 155U.",
"When the upper surface of the lower active pattern 250 is disposed on a level between the levels of the lower and upper surfaces of the lowermost gate pattern 155L, the first sub-layer 147 may not exist between the lower active pattern 250 and the lowermost gate pattern 155L.",
"The upper active pattern 270a may include a first semiconductor pattern 265 and a second semiconductor pattern 267.The first semiconductor pattern 265 may be disposed between the first sub-layer 147 and the second semiconductor pattern 267.The first semiconductor pattern 265 may be separated from the upper surface of the lower active pattern 250 by a portion of the first sub-layer 147.The second semiconductor pattern 267 contacts the first semiconductor pattern 265.Also, the second semiconductor pattern 267 contacts the upper surface of the lower active pattern 250.The upper surface of the lower active pattern 250 may be divided into a center portion 252c contacting the second semiconductor pattern 267 and an edge portion 252e contacting the first sub-layer 147.Herein, the center portion 252c of the upper surface of the lower active pattern 250 may be disposed on a level lower than that of the edge portion 252e.",
"The upper active pattern 270a including the first and second semiconductor patterns 265 and 267 may have a pipe shape or a macaroni shape.",
"In this case, the inside of the upper active pattern 270a may be filled with a filling dielectric pattern 132.The first and second semiconductor patterns 265 and 267 may have a poly-crystalline state.",
"In the modification example, the first and second sub-layers 147 and 149 may be replaced by the first and second sub-layers 147a and 149a of FIG.",
"3C or the first and second sub-layers 147b and 149b of FIG.",
"3C.",
"Unlike this, as described above in first embodiment of the inventive concept, the first and second sub-layers 147 and 149 may be formed by another combination of a tunnel dielectric layer, a charge storage layer and a blocking dielectric layer.",
"FIG.",
"12C is a cross-sectional view illustrating still other modification example of a 3D semiconductor memory device according to another embodiment of the inventive concept.",
"Referring to FIG.",
"12C, at least edge portion of the upper surface of the lower active pattern 250 may be disposed on a level higher than the upper surface of the lowermost gate pattern 155L.",
"In this case, an oxide layer 255 may be disposed between the sidewall of the lower active pattern 250 and the lowermost gate pattern 155L.",
"The oxide layer 255 may include oxide formed by oxidizing the sidewall of the lower active pattern 250.Therefore, the width of a first portion of the lower active pattern 250 next to the oxide layer 255 may be less than that of a second portion of the lower active pattern 250 disposed in the recess region 120.When the gate dielectric layer 150a includes the first and second sub-layers 147 and 149, the oxide layer 255 and a portion of the second sub-layer 149 may be disposed between the sidewall of the lower active pattern 250 and the lowermost gate pattern 155L.",
"In other words, the first sub-layer 147 may not exist between the sidewall of the lower active pattern 250 and the lowermost gate pattern 155L.",
"According to an embodiment of the inventive concept, when the first sub-layer 147 includes a charge storage layer, the charge storage layer may not exist between the sidewall of the lower active pattern 250 and the lowermost gate pattern 155L.",
"Therefore, the reliability of a ground selection transistor including the lowermost gate pattern 155L can be improved.",
"Moreover, the lower active pattern 250 may have a single crystalline state.",
"Accordingly, the reliability of the ground selection transistor can be more enhanced.",
"FIG.",
"12D is a cross-sectional view illustrating even other modification example of a 3D semiconductor memory device according to another embodiment of the inventive concept.",
"Referring to FIG.",
"12D, at least the edge portion of the upper surface of a lower active pattern 250 may be disposed on a level higher than the upper surface of a gate pattern 155a1 that is stacked secondarily from the substrate 100 and lower than the lower surface of a gate pattern that is stacked thirdly from the substrate 100.The secondarily-stacked gate pattern 155a1 and the thirdly-stacked gate pattern are disposed over the lowermost gate pattern 155L.",
"In this case, an oxide layer 255 may also be disposed between the secondarily-stacked gate pattern 155a1 and the side wall of the lower active pattern 250.According to the modification example, a transistor including the secondarily-stacked gate pattern 155a1 may be used as a dummy transistor or a second ground selection transistor.",
"In this case, a cell gate (for example, the thirdly-stacked gate pattern 155a) adjacent to the secondarily-stacked gate pattern 155a1 may correspond to a dummy cell gate.",
"As described above, a dummy cell transistor including the dummy cell gate has the same type as that of a cell transistor storing data, but it may not serve as a cell transistor.",
"As an example, in operating of the cell string, the dummy cell transistor may perform only a turn-on/off function.",
"However, the inventive concept is not limited thereto.",
"The thirdly-stacked gate pattern may be used as a cell transistor.",
"FIG.",
"12E is a cross-sectional view illustrating yet other modification example of a 3D semiconductor memory device according to another embodiment of the inventive concept.",
"Referring to FIG.",
"12E, the entirety of a gate dielectric layer 150d between the sidewall of the upper active pattern 270a and each of the gate patterns 155a1, 155a and 155U may be substantially extended vertically and be disposed between an upper active pattern 270a and an insulation pattern 110a.",
"In this case, only an oxide layer 255 may be disposed between the sidewall of the lower active pattern 250 and the lowermost gate pattern 155L.",
"FIG.",
"12F is a cross-sectional view illustrating further modification example of a 3D semiconductor memory device according to another embodiment of the inventive concept.",
"Referring to FIG.",
"12F, protection dielectric patterns 173a may be disposed between the upper active pattern 270a and the insulation patterns 110a.",
"In a fabricating process, the protection dielectric pattern 173a may include a dielectric material for protecting the upper active pattern 270.According to an embodiment of the inventive concept, the protection dielectric pattern 173a may not exist between the lower active pattern 250 and the inner sidewall of the recess region 120.The elements of the above-described modification examples may be combined without clash or replaced.",
"For example, the common source region 105a of FIG.",
"11 may be replaced with the common source region 105 of FIGS.",
"12B to 12F.",
"For example, in the 3D semiconductor memory devices of FIGS.",
"11 and 12A to 12F, the heights of the upper surfaces of the lower active patterns 250 may be replaced.",
"FIGS.",
"13A to 13E are cross-sectional views for describing a method of fabricating 3D semiconductor memory device according to another embodiment of the inventive concept.",
"Referring to FIG.",
"13A, a well region 102 may be formed by providing a first conductive dopant to the substrate 100.Insulation layers 110 and sacrificial layers 112 that are alternately and repeatedly stacked may be formed on the well region 102.A recess region 120 and an opening 115 that are sequentially stacked may be formed by sequentially patterning the insulation layers 110, the sacrificial layers 112 and the substrate 100.The opening 115 may pass through the insulation layers 110 and the sacrificial layers 112, and the recess region 120 may be self-aligned in the opening 115 and be formed in the substrate 100.The recess region 120 may expose the well region 102.Referring to FIG.",
"13B, a high concentration region 122 may be formed by providing the first conductive dopant through the bottom of the recess region 120.A lower active pattern 250 filling the recess region 120 may be formed.",
"The upper surface of the lower active pattern 250 may be higher than the upper surface of the substrate 100.Therefore, a portion of the lower active pattern 250 may fill the lower portion of the opening 115.The lower active pattern 250 contacts the well region 102.The lower active pattern 250 may be formed in a selective epitaxial growth process that uses the substrate 100 exposed by the recess region 120 as a seed layer.",
"Therefore, the lower active pattern 250 may be formed in a single crystalline state.",
"The lower active pattern 250 may be formed in a pillar shape.",
"The lower active pattern 250 may be doped with the first conductive dopant.",
"The lower active pattern 250 may be doped by an in-situ process when the selective epitaxial growth process is performed.",
"Unlike this, the lower active layer 250 may be doped by an ion-implanting process.",
"Referring to FIG.",
"13C, a semiconductor layer may be conformally formed on the substrate 100 having the lower active pattern 250, and a filling dielectric layer filling the opening 115 may be formed on the semiconductor layer.",
"The semiconductor layer may be conformally formed on the inner sidewall of the opening 115 and the upper surface of the lower active pattern 250.The semiconductor layer may contact the lower active pattern 250.The semiconductor layer may be formed in a chemical vapor deposition process and/or an atomic layer deposition process.",
"Therefore, the semiconductor layer may be formed in a poly-crystalline state.",
"By planarizing the filling dielectric layer and the semiconductor layer, an upper active pattern 270 and a filling dielectric pattern 132 may be formed in the opening 115.The lower and upper active patterns 250 and 270 may configure a vertical active pattern 280.Subsequently, a trench 135, insulation patterns 110a and sacrificial patterns 110a may be formed by sequentially patterning the insulation layers 110 and the sacrificial layers 112.The vertical active pattern 280 passes through the insulation patterns 110a and the sacrificial patterns 112a.",
"Subsequently, by providing a second conductive dopant into the well region 102 under the trench 135, a common source region 105a may be formed.",
"Referring to FIG.",
"13D, by removing sacrificial patterns 112a exposed to the trench 135, empty regions 140 may be formed.",
"According to an embodiment of the inventive concept, at least a portion of a lowermost empty regions 140 may expose a portion of the sidewall of the lower active pattern 250.A gate dielectric layer 150 may be conformally formed on the substrate 100 having the empty regions 140, and a gate conductive layer 155 filling the empty regions 140 may be formed.",
"Referring to FIG.",
"13E, gate patterns 155L, 155a1, 155a and 155U, that are respectively disposed in the empty regions 140, may be formed by etching the gate conductive layer 155.Subsequently, a device isolation pattern 160a filling the trench 135 may be formed.",
"The 3D semiconductor memory device of FIG.",
"11 may be implemented by forming the interlayer dielectric 165, contact plug 167 and bit line 170 of FIG.",
"11.According to the above-described 3D semiconductor memory device, the opening 115 and the recess region 120 are formed in self-alignment, and the lower active pattern 250 fills the recess region 120 to contact the well region 102.After, the lower active pattern 250 is formed, and then the upper active pattern 270 may be formed.",
"Therefore, the doping concentration of the lower active pattern 250 may be independently adjusted.",
"As a result, the 3D semiconductor memory device having superior reliability can be implemented.",
"The features of the method of fabricating 3D semiconductor memory device that is illustrated in FIG.",
"12A will be described below with reference to FIG.",
"14.FIG.",
"14 is a cross-sectional view illustrating a modification example of a method of fabricating 3D semiconductor memory device according to another embodiment of the inventive concept.",
"Referring to FIG.",
"14, a second conductive dopant is injected into a substrate 100 having a well region 102, such that a common source region 105 may be formed.",
"Insulation layers 110 and sacrificial layers 112 that are alternately and repeatedly stacked may be formed on the common source region 105.An opening 115 and a recess region 120 may be formed by sequentially patterning the insulation layers 110, the sacrificial layers 112 and the substrate 100.The recess region 120 may pass through the common source region 105, and thus the bottom surface of the recess region 120 may be lower than the lower surface of the common source region 105.The bottom surface of the recess region 120 may expose the well region 102, and the inner sidewall of the recess region 120 may expose the common source region 105.Successive processes may be performed identically to the process that has been described above with reference to FIG.",
"13A through FIG.",
"13E.",
"However, the process of forming the common source region 105a that has been described above with reference to FIG.",
"13C may be omitted.",
"FIGS.",
"15A to 15F are cross-sectional views illustrating other modification example of a method of fabricating 3D semiconductor memory device according to another embodiment of the inventive concept.",
"A fabricating method according to the modification example may include the method that has been described above with reference to FIG.",
"14.Referring to FIGS.",
"14 and 15A, a lower active pattern 250 filling the recess region 120 may be formed on the substrate 100 having the opening 115 and the recess region 120.The lower active pattern 250 may be formed identically to the process that has been described above with reference to FIG.",
"13B.",
"The level of the upper surface of the lower active pattern 250 may be adjusted.",
"In FIG.",
"15A, the upper surface of the lower active pattern 250 may be higher than the level of the upper surface of a lowermost sacrificial layer and lower than the level of the lower surface of a sacrificial layer just on the lowermost sacrificial layer.",
"A first sub-layer 147 may be conformally formed on the substrate 100 having the lower active pattern 250.A first semiconductor layer 264 may be conformally formed on the first sub-layer 147.The first semiconductor layer 264 may be formed in a chemical vapor deposition process and/or an atomic layer deposition process.",
"The first semiconductor layer 264 may be formed in a poly-crystalline state.",
"Referring to FIG.",
"15B, the first semiconductor layer 264 and the first sub-layer 147 may be blanket-anisotropic-etched until the upper surface of the lower active pattern 250 is exposed.",
"Therefore, a first semiconductor pattern 265 may be formed in the opening 115.According to an embodiment of the inventive concept, the center portion of the exposed upper surface of the lower active pattern 250 may be recessed lower than the edge portion of the upper surface of the lower active pattern 250.Referring to FIG.",
"15C, a second semiconductor layer may be conformally formed on the substrate 100 having the first semiconductor pattern 265, and a filling dielectric layer may be formed on the second semiconductor layer.",
"The second semiconductor layer may contact the first semiconductor pattern 265 and the center portion of the upper surface of the lower active pattern 250.By planarizing the filling dielectric layer and the second semiconductor layer, a second semiconductor pattern 267 and a filling dielectric pattern 132 may be formed in the opening 115.The first and second semiconductor patterns 265 and 267 may configure an upper active pattern 270a, and the lower and upper active patterns 250 and 270a may configure a vertical active pattern 280a.",
"Subsequently, a trench 135, insulation patterns 110a and sacrificial patterns 112a may be formed by sequentially patterning the insulation layers 110 and the sacrificial layers 112.Referring to FIG.",
"15D, empty regions 140 may be formed by removing the sacrificial patterns 112a.",
"According to an embodiment of the inventive concept, the lowermost empty region of the empty regions 140 may expose the sidewall of the lower active pattern 250, and empty regions on the lowermost empty region may expose the first sub-layer 147.However, the inventive concept is not limited thereto.",
"The number of empty regions for exposing the sidewall of the lower active pattern 250 may vary with the height of the edge portion of the upper surface of the lower active pattern 250.Referring to FIG.",
"15E, an oxide layer 255 may be formed by performing an oxidizing process in the exposed sidewall of the lower active pattern 250.When the lower active pattern 250 is formed of silicon, the oxide layer 255 may be formed of a silicon oxide.",
"The sidewall of the upper active pattern 270a may not be oxidized by the first sub-layer 147.Referring to FIG.",
"15F, subsequently, a second sub-layer 149 may be conformally formed over the substrate 100, and gate patterns 155L, 155a1, 155a and 155U respectively filling the empty regions 140 may be formed.",
"Subsequently, an isolation pattern 160a, an interlayer dielectric layer 165, a contact plug 167 and a bit line 170 may be formed.",
"Therefore, the 3D semiconductor memory device of FIG.",
"12C can be implemented.",
"In the fabricating method of FIGS.",
"15A to 15F, the level of the upper surface of the lower active pattern 250 may be higher than the level of the upper surface of a sacrificial layer that is stacked secondarily from the upper surface of the substrate 100 and lower than the level of the lower surface of a thirdly-stacked sacrificial layer.",
"In this case, the 3D semiconductor memory device of FIG.",
"12D can be implemented.",
"In the fabricating method of FIGS.",
"15A to 15F, when the level of the upper surface of the lower active pattern 250 is disposed between the levels of the upper and lower surfaces of the lowermost sacrificial layer and the oxidizing process is omitted, the 3D semiconductor memory device of FIG.",
"12B can be implemented.",
"In the fabricating method of FIGS.",
"15A to 15F, when the first sub-layer 147 is replaced by the gate dielectric layer 150d and forming of the second sub-layer 149 is omitted, the 3D semiconductor memory device of FIG.",
"12E can be implemented.",
"Next, a method of fabricating the 3D semiconductor memory device that is illustrated in FIG.",
"12F will be described below with reference to the accompanying drawings.",
"The method may include the method that has been described above with reference to FIG.",
"14.FIGS.",
"16A and 16B are cross-sectional views illustrating still other modification example of a method of fabricating 3D semiconductor memory device according to another embodiment of the inventive concept.",
"Referring to FIGS.",
"14 and 16A, after a lower active pattern 250 may be formed, a protection dielectric layer may be conformally formed on the substrate 100.The protection dielectric layer may be blanket-anisotropic-etched until the upper surface of the lower active pattern 250 is exposed.",
"Therefore, a protection dielectric layer 173 may be3 formed to have a spacer shape in the sidewall of the opening 115.Subsequently, a semiconductor layer may be conformally formed, and a filling dielectric layer may be formed.",
"The filling dielectric layer and the semiconductor layer may be planarized, such that an upper active pattern 270 and a filling dielectric pattern 132 may be formed in the opening 115.Subsequently, the upper ends of the protection dielectric layer 173, upper active pattern 270 and filling dielectric pattern 132 may be recessed, and then a capping semiconductor pattern 175 may be formed.",
"The capping semiconductor pattern 175 may be formed in the same process as the process that has been described above with reference to FIG.",
"7B.",
"Referring to FIG.",
"16B, a trench 135, insulation patterns 110a and sacrificial patterns 112a may be formed by sequentially patterning insulation layers 110 and sacrificial layers 112.Empty regions 140 may be formed by removing the sacrificial patterns 112a.",
"At this point, the protection dielectric layer 173 may be used an etch stop layer.",
"Subsequently, by removing some portions of the protection dielectric layer 173 exposed to the empty regions 140, some portions of the sidewall of the upper active pattern 270 may be exposed.",
"Subsequently, the 3D semiconductor memory device of FIG.",
"12F can be implemented by performing the method that has been described above with reference to FIGS.",
"13D and 13E.",
"According to an embodiment of the inventive concept, after forming the empty regions 140 of FIG.",
"16B and before forming a gate dielectric layer, an oxidizing process may be performed in the exposed sidewall of the lower active pattern 250.The 3D semiconductor memory devices according to embodiments of the inventive concept may be implemented as various types of packages.",
"For example, the 3D semiconductor memory devices according to embodiments of the inventive concept may be packaged in a package type such as Package on Package (PoP), Ball Grid Arrays (BGAs), Chip Scale Packages (CSPs), Plastic Leaded Chip Carrier (PLCC), Plastic Dual In-Line Package (PDIP), Die In Waffle Pack (DIWP), Die In Wafer Form (DIWF), Chip On Board (COB), Ceramic Dual In-Line Package (CERDIP), Plastic Metric Quad Flat Pack (MQFP), Thin Quad Flat Pack (TQFP), Small Outline Package (SOP), Shrink Small Outline Package (SSOP), Thin Small Outline Package (TSOP), Thin Quad Flat Pack (TQFP), System In Package (SIP), Multi Chip Package (MCP), Wafer Level Stack Package (WLSP), Die In Wafer Form (DIWF), Die On Waffle Package (DOWP), Wafer-level Fabricated Package (WFP) and Wafer-Level Processed Stack Package (WSP).",
"A package on which the 3D semiconductor memory device according to embodiments of the inventive concept is mounted may further include at least one semiconductor device (for example, a controller, a memory device and/or a hybrid device) performing another function.",
"FIG.",
"17 is a block diagram schematically illustrating an example of an electronic system including a 3D semiconductor memory device according to an embodiment of the inventive concept.",
"Referring to FIG.",
"17, an electronic system 1100 according to an embodiment of the inventive concept may include a controller 1110, an input/output (I/O) unit 1120, a memory device 1130, an interface 1140, and a bus 1150.The controller 1110, the input/output (I/O) unit 1120, the memory device 1130 and/or the interface 1140 may be connected through the bus 1150.The bus 1150 corresponds to a path for transferring data.",
"The controller 1110 may include at least one of a microprocessor, a digital signal processor, a microcontroller, and logical devices for performing a function similar to the functions of the elements.",
"The input/output unit 1120 may include a keypad, a keyboard, a display device and others.",
"The memory device 1130 may store data and/or commands.",
"The memory device 1130 may include at least one of the 3D semiconductor memory devices according to embodiments of the inventive concept.",
"Also, the memory device 1130 may further include another type of semiconductor memory device (for example, Phase-change Random Access Memory (PRAM), Magnetoresistive Random Access Memory (MRAM), Dynamic Random Access Memory (DRAM) and/or Static Random Access Memory (SRAM)).",
"The interface 1140 may transmit data to a communication network or receive data from the communication network.",
"The interface 1140 may have a wired type or a wireless type.",
"For example, the interface 1140 may include an antenna or a wired/wireless transceiver.",
"Although not shown, the electronic system 1100 is a working memory device for improving the function of the controller 1110, and may further include a high-speed DRAM and/or a high-speed SRAM.",
"The electronic system 1100 may be applied to Personal Digital Assistants (PDAs), portable computers, web tablets, wireless phones, mobile phones, digital music players, memory cards, and all electronic devices for transmitting/receiving information at a wireless environment.",
"FIG.",
"18 is a block diagram schematically illustrating an example of a memory card including a 3D semiconductor memory device according to an embodiment of the inventive concept.",
"Referring to FIG.",
"18, a memory card 1200 according to an embodiment of the inventive concept may include a memory device 1210.The memory device 1210 may include at least one of the 3D semiconductor memory devices according to embodiments of the inventive concept.",
"Also, the memory device 1210 may further include another type of semiconductor memory device (for example, PRAM, MRAM, DRAM and/or SRAM).",
"The memory card 1200 may include a memory controller 1220 for controlling data exchange between a host and the memory device 1210.The memory controller 1220 may include a processing unit 1222 for controlling the overall operation of the memory card 1200.Also, the memory controller 1220 may include an SRAM 1221 that is used as the working memory of the processing unit 1222.Furthermore, the memory controller 1220 may further include a host interface 1223 and a memory interface 1225.The host interface 1223 may include a data exchange protocol between the memory card 1200 and the host.",
"The memory interface 1225 may connect the memory controller 1220 and the memory device 1210.In addition, the memory controller 1220 may further include an error correction block (ECC) 1224.The error correction block 1224 may detect and correct the error of data that is read from the memory device 1210.Although not shown, the memory card 1200 may further include a ROM that stores code data for interfacing with the host.",
"The memory card 1200 may be used as a portable data memory card.",
"On the contrary, the memory card 1200 may be implemented as a Solid State Disk (SSD) that may replace the hard disk of a computer system.",
"According to the above-described 3D semiconductor memory device, the vertical active pattern can be disposed in the recess region of the common source region and be connected to the well region.",
"Therefore, the distance between the vertical active pattern and the common source region can be minimized, and also, the vertical active pattern can be connected to the well region.",
"As a result, the 3D semiconductor memory device which has excellent reliability and is optimized for high integration can be implemented.",
"The above-disclosed subject matter is to be considered illustrative and not restrictive, and the appended claims are intended to cover all such modifications, enhancements, and other embodiments, which fall within the true spirit and scope of the inventive concept.",
"Thus, to the maximum extent allowed by law, the scope of the inventive concept is to be determined by the broadest permissible interpretation of the following claims and their equivalents, and shall not be restricted or limited by the foregoing detailed description."
]
] |
Patent_15871375
|
[
[
"TOOLS FOR ASSISTING IN OSTEOTOMY PROCEDURES, AND METHODS FOR DESIGNING AND MANUFACTURING OSTEOTOMY TOOLS",
"The present invention relates to a surgical kit, a saw guide and other related tools used in the osteotomy for temporary removal of a piece of a first bone structure to gain temporary access for treatment of defects of a second bone structure, as well as methods for designing and manufacturing said tools"
],
[
"1.A surgical saw guide suitable for use in osteotomy and the temporary osteotomic removal of a bone fragment of a tibia for exposing the talus dome for treatment, comprising: a slit configured to receive a saw cutting tool and to guide the saw cutting tool to form a single cut in a straight direction at an angle to at least a portion of an inner engagement surface of said saw guide; and, a drill guide having at least one hole configured to guide the drilling of a hole in a straight direction at an angle relative to the saw cutting direction provided by the guidance of said slit.",
"2.The surgical saw guide of claim 1, further comprising: at least one pin hole adapted to receive a fixation means to guide the temporary fixation of the saw guide to the tibia of a patient, wherein said at least a portion of an inner engagement surface is adapted to at least partly conform to the lower portion of the tibia of a patient.",
"3.The surgical saw guide of claim 1, wherein said at least one hole of the drill guide is configured to guide the predrilling of at least one hole past a single saw cutting plane provided by the guidance of said slit and into the inner portions of the tibia bone therebehind, thereby being adapted to provide for the predrilling of at least one fixation hole in the inner portions of the tibia bone to be used for facilitating correct refixation of the removed bone fragment in its original, or substantially original, position after performed surgical treatment.",
"4.The surgical saw guide of claim 1, wherein said at least one hole of the drill guide is configured to guide the drilling along a straight line at a specific angle direction with respect to at least one of: the at least a portion of the inner engagement surface adapted to conform to the lower portion of the tibia of a patient, the longitudinal tibial axis of the patient, and the direction for forming said single saw cut.",
"5.The surgical saw guide of claim 4, wherein the at least one hole of said drill guide is configured to guide the drilling in a direction at an angle β or within an angle range to the longitudinal tibial axis of a patient, and wherein said angle β or angle range is within the angle range of 50-70 degrees to the longitudinal tibial axis of a patient.",
"6.The surgical saw guide of claim 4, wherein the at least one hole of said drill guide is configured to guide the drilling in a direction along a straight line at an angle β at 60 degrees, or close to 60 degrees, to the longitudinal tibial axis of a patient.",
"7.The surgical saw guide of claim 1, wherein the at least one hole of the drill guide is configured to guide drilling in a direction at an angle β or within an angle range to the direction for forming said single saw cut, and wherein said angle β or angle range is within the angle range of 80-100 degrees to the direction for forming said single saw cut.",
"8.The surgical saw guide of claim 1, wherein the at least one hole is configured to guide drilling in a perpendicular direction, or close to 90 degrees, with respect to the direction for forming said single saw cut.",
"9.The surgical saw guide of claim 1, wherein said inner engagement surface is adapted to conform to the lower portion of the tibia of a patient.",
"10.The surgical saw guide of claim 1, wherein said single saw cut has a pre-determined angle relationship to at least a portion of said inner engagement surface, and wherein said at least a portion of said inner engagement surface is patient customized to be adapted to conform to the lower portion of the tibia of a patient.",
"11.The surgical saw guide of claim 1, wherein said slit is further configured to guide a saw cutting tool to form a single saw cut at an angle or within an angle range to the longitudinal tibial axis of a patient, and wherein said angle φ or angle range is within the angle range of 15-50 degrees to the longitudinal tibial axis of a patient.",
"12.The surgical saw guide of claim 1, wherein said slit is further configured to guide a saw cutting tool to form a single saw cut in a direction at an angle of 30 degrees angle, or close to 30 degrees, to the longitudinal tibial axis of a patient.",
"13.The surgical saw guide of claim 1, further comprising: an opening which forms an inspection window adapted to allow visual inspection of how well the saw guide conforms lower portion of the tibia of a patient to facilitate adjustment of the positioning of the saw guide to provide for a correct positioning of the saw guide to the lower portion of the tibia of the patient.",
"14.The surgical saw guide of claim 1, wherein a portion of the saw guide comprising said slit is configured to have a height that matches, or corresponds to, the length of a sawblade to be used during saw cutting to make a powertool used during saw cutting stop against the top surface of the portion.",
"15.A method for designing the surgical saw guide according to claim 1, comprising: designing a saw guide having as integral parts both a slit designed for guiding the saw cutting in a first direction and a drill guide having at least one hole designed for guiding the drilling in a second direction different from the first direction.",
"16.The method of claim 15, wherein the at least portion of the inner engagement surface is adapted to conform to the lower portion of the tibia of a patient and is individually patient customized on the basis of radiologically obtained patient data.",
"17.The method of claim 15, wherein the at least one hole of the drill guide is individually patient customized on the basis of radiologically obtained patient data in that the drilling direction provided by said at least one hole is designed to have a patient customized angle relationship to at least one of the lower portion of the tibia of a patient and the longitudinal tibial axis of the patient.",
"18.The method of claim 15, wherein the slit is individually patient customized on the basis of radiologically obtained patient data in that the saw cutting direction provided by said slit is designed to have a patient customized angle relationship to at least one of the lower portion of the tibia of a patient and the longitudinal tibial axis of the patient.",
"19.The method according to claim 15, wherein both the slit and the at least one hole of the drill guide are individually patient customized on the basis of radiologically obtained patient data in that both the saw cutting direction provided by said slit and the drilling direction provided by the at least one hole of the drill guide are each designed to have a patient customized angle relationship to at least one of the lower portion of the tibia of a patient and the longitudinal tibial axis of the patient.",
"20.The method of designing a surgical saw guide, comprising: a. identifying at least one of a bone and a cartilage damage of the talus dome through radiological images; b. planning the size and the location of an osteotomy needed to get access to the talus dome in the treatment of said at least one of a bone and a cartilage damage of the talus; c. creating a virtual 3D model of at least a portion of at least one of the tibial bone and the talus bone from radiological images; and d. designing a patient specific osteotomy saw guide based on the 3D model and the size and location of the osteotomy needed.",
"21.A surgical kit comprising: the saw guide according to claim 1; and fixation means with dimensions adapted for insertion through the at least one hole of the drill guide and having a certain length for providing fixation of the saw guide to the tibia by use of the at least one fixation hole in the inner portions of the tibia, wherein said surgical kit is designed to provide for the remounting of the temporarily removed bone fragment in its original, or substantially original, position by using the pre-drilled at least one hole in the inner portions of the tibia.",
"22.The surgical kit of claim 21, wherein said fixation means includes at least a screw designed to be screwed through and past the at least portion of the bone fragment of the tibia to be removed and into a pre-drilled fixation hole in the inner portion of the tibia bone, and wherein said fixation means is configured to provide for the remounting of the temporarily removed bone fragment in its original, or substantially original, position by using the pre-drilled at least one fixation hole in the inner portions of the tibia.",
"23.The surgical kit according to claim 21, further comprising a surgical implant having a cap with an outer surface conforming to a talus dome surface and a hollow tubular shell suitable for vertical drilling to prepare the talus dome for implantation of an implant.",
"24.The surgical kit of claim 23, further comprising a pin socket adapted to be positioned in said hollow tubular shell and which is configured with a steering hole in the form of a through hole, wherein said pin socket, when positioned in said hollow tubular shell, provides mechanical support and the directional guidance for vertical drilling through said steering hole and into the dome of the talus to form a steering hole in the dome of the talus for further drilling to remove cartilage and bone to prepare the site for implantation of an implant of the talus dome.",
"25.",
"(canceled) 26.A surgical kit comprising: the saw guide according to claim 1; and a surgical implant having a cap with an outer surface conforming to a talus dome surface and a hollow tubular shell suitable for providing support to the vertical drilling to prepare the talus dome for implantation of an implant.",
"27.The surgical kit of claim 26, further comprising a pin socket adapted to be positioned in said hollow tubular shell and which is configured with a steering hole in the form of a through hole, wherein said pin socket, when positioned in said hollow tubular shell, provides mechanical support and the directional guidance for vertical drilling through said steering hole and into the dome of the talus to form a steering hole in the dome of the talus for further drilling to remove cartilage and bone to prepare the site for implantation of an implant of the talus dome.",
"28.The surgical kit of claim 26, further comprising at least one fixation means designed with dimensions and a length adapted for insertion of said fixation means through the at least one hole of the drill guide and to provide fixation of the saw guide to the tibia and having a certain length adapted to enable insertion into the at least one fixation hole into the inner portions of the tibia, wherein said surgical kit is designed to provide for the remounting of the temporarily removed bone fragment in its original, or substantially original, position by using the pre-drilled at least one hole in the inner portions of the tibia.",
"29-37.",
"(canceled) 38.A method of manufacturing the surgical saw guide according to claim 1, comprising 3D printing by joining or solidifying material under computer control to create the surgical saw guide.",
"39.The method of manufacturing of claim 38, wherein said 3D printing includes building the surgical saw guide from computer-aided design (CAD) data by successively adding material layer by layer.",
"40.The method of manufacturing of claim 39, wherein the CAD data is based on a virtually designed patient specific osteotomy saw guide based on the 3D model of the at least portion of the first bone structure and the size and location of the osteotomy needed.",
"41.The method of manufacturing of claim 40, wherein the 3D printing is preceded by the following steps of virtually designing a patient specific osteotomy saw guide: a. identifying at least one of a bone and a cartilage damage of the second bone structure through radiological images; b. planning the size and the location of an osteotomy of a first bone structure needed to get access to the second bone structure in the treatment of said at least one of a bone and cartilage damage of the second bone structure; c. creating a virtual 3D model of at least a portion of at least one of the first and second bone structure from radiological images; and d. designing a patient specific osteotomy saw guide based on the 3D model and the size and location of the osteotomy needed.",
"42.",
"(canceled) 43.A surgical method for use in osteotomy and the temporary osteotomic removal of a bone fragment of a tibia for exposing the talus dome for treatment, comprising: a. identifying at least one of a bone and a cartilage damage of the talus dome through radiological images; b. planning the size and the location of an osteotomy needed to get access to the talus dome in the treatment of said at least one of a bone and a cartilage damage of the talus; c. creating a virtual 3D model of at least a portion of at least one of the tibial bone and the talus bone from radiological images; d. designing a patient specific osteotomy saw guide based on the 3D model and the size and location of the osteotomy needed; e. positioning and fixing the patient customized saw guide so that the saw guide is conforming and fixable to the lower medial anterior portion of the tibia; f. making a saw cut along the saw guide surface excising a lower medial anterior piece of the tibia; g. removing said lower medial anterior piece, or folding said lower medial anterior piece forward and outward preserving the attachment of medial deltoid ligaments, and exposing the damaged condylar area of the talus dome; h. performing treatment of said at least one of a bone and cartilage damage of the at least one of a bone and a cartilage damage of the talus; and i. replacing said excised lower medial anterior piece of the tibia into its original, or substantially original, position and fixing it in place."
],
[
"<SOH> BACKGROUND <EOH>Generally, the technology disclosed relates to surgical tools used in the temporary removal of a piece of a first bone structure to gain temporary access for surgical treatment of defects of a second bone structure.",
"The defects of the second bone structure may e.g.",
"be damage in the bone, cartilage or cartilage and underlying bone of the second bone structure.",
"In certain aspects, the technology disclosed relates to joint defects, such as osteochondral defects, of the talar dome which are mostly caused by a traumatic event.",
"They may lead to deep ankle pain on weight bearing, prolonged swelling, diminished range of motion, and synovitis.",
"The mean cartilage thickness of the talar dome is in the range 1.2 to 1.4 mm.",
"Cartilage defects are strongly linked to damage in the subchondral bone.",
"An important target in the treatment of talar osseochondral defects (OCDs) is repair of the subchondral bone.",
"A healthy restored subchondral bone plate would decrease the pain, improve the load-bearing capacity of the ankle, and improve chondrocyte survival in the remaining cartilage.",
"Treatment options for talar osteochondral defects (OCDs) are numerous.",
"High success rates have been reported for bone marrow stimulation techniques and osteochondral autograft transfer.",
"Because osteochondral autograft transfer can cause knee morbidity at the donor site, debridement and bone marrow stimulation often remains the treatment of choice for primary OCDs, i.e., those without previous surgery, up to 15 mm in diameter.",
"During debridement and bone marrow stimulation, the OCD is preferably approached by anterior ankle arthroscopy with the ankle in full plantar flexion for adequate exposure of the defect.",
"However, the ankle is a congruent joint with limited surgical access.",
"Some defects are located so far posteriorly that they may not be accessible by anterior ankle arthroscopy.",
"During debridement and bone marrow stimulation, the OCD may for example be approached by anterior ankle arthroscopy with the ankle in full plantar flexion for adequate exposure of the defect.",
"However, the ankle is a congruent joint with limited surgical access.",
"Some defects are located so far posteriorly that they may not be accessible by anterior ankle arthroscopy.",
"If the lesion is located on the medial side of the talar dome (ca 60% of cases), most of these treatment options require an osteotomy, e.g.",
"a medial malleolar osteotomy, to obtain sufficient access to the talar dome.",
"There are different varieties of osteotomy to get access to the talar dome, but a medial malleolar osteotomy is an established approach for the operative treatment of medial osteochondral defects of the talar dome and fractures of the talar body.",
"Lesions after failed previous surgery or large lesions can be treated by various alternative surgical methods, including autologous cancellous bone grafting, osteochondral autograft transfer, osteochondral allograft transfer and autologous chondrocyte implantation (ACI) or treatment with resurfacing implants.",
"These techniques are generally more complicated and require more bulky tools compared to debridement and bone marrow stimulation, thus requiring better access to the talar dome, especially for larger lesions.",
"Disadvantages of these secondary methods include pain at the donor site, limited availability of graft material, and two surgical procedures in the case of ACI.",
"An alternative without these disadvantages would be desirable.",
"The methods mentioned above are sometimes combined with osteotomy for better access to the talar dome.",
"Because of the disadvantages of current secondary treatment methods, metal resurfacing inlay implants have been developed and started to reach the market.",
"A precise surgical technique is required in terms of implantation depth, position, and orientation because of the biomechanical properties of the ankle joint.",
"A protruding implant may damage the opposite cartilage by causing excessive contact pressures during loading, which is thought to be due to “plowing” of the cartilage.",
"On the other hand, a deep implant might result in collapse of the adjacent cartilage due to insufficient support.",
"If the lesion is located on the medial side of the talar dome (ca 60% of cases), most of these treatment options require a medial malleolar osteotomy in order to obtain access to the talar dome.",
"A medial malleolar osteotomy is an established approach for the operative treatment of medial osteochondral defects of the talar dome and fractures of the talar body.",
"There are different varieties of osteotomy to get access to the talar dome.",
"A commonly used osteotomy is the oblique medial malleolar osteotomy, which is a crucial step in the surgical implantation of the resurfacing inlay implants.",
"To obtain a congruent joint surface after refixation, the osteotomy should be directed perpendicularly to the articular surface of the tibia at the intersection between the tibial plafond and medial malleolus.",
"At an instructional course on the metallic implantation technique, surgeons experienced technical difficulties performing a successful medial malleolar osteotomy.",
"The difficulties included sawing at an angle that allowed refixation of the distal fragment without creating an articular incongruence, as well as identifying the intersection between the tibial plafond and medial malleolus.",
"Thus, knowledge of the angle of the osteotomy relative to an anatomic landmark such as the long tibial axis would be helpful for use during surgery, as well as surgical tricks to identify the intersection.",
"It has been reported that a medial malleolar osteotomy frequently led to local osteoarthritis and less favorable clinical findings than arthrotomy without osteotomy.",
"The advantages of implants over complete replacement of the joint have stimulated a further development of smaller implants that can be implanted with less invasive surgery.",
"In this development there has also been an effort to achieve small joint implants, suitable for repair of a small bone and/or cartilage injury that have a minimal influence on the surrounding parts of the joint.",
"In the current development, such small implants are designed with an implant body that may be formed as a mushroom cap with a hard surface to face the articulating side of the joint and a bone contacting surface engaging the bone below the damaged part of cartilage.",
"The shape and the curvature of the articulating surface of the implant may be designed to be a reconstitution of the shape and the curvature of the part of the joint when it was undamaged.",
"Such implants are usually designed as mushrooms with an implant body or head and with a peg or a rod projecting from the bone contacting side of the implant body for anchoring the implant into the bone.",
"The cap of the mushroom for repair of the talus dome is often slanted or irregular to conform to the shape of the original undamaged ridge or dome of the talus.",
"There is a lack of talar metal resurfacing implants with an exact match of the undamaged talar anatomy, as well as metal resurfacing implants that can be placed not only at the edge of the medial talar dome, but placed more centrally on the medial talar dome."
],
[
"<SOH> SUMMARY <EOH>The entire complex of problems listed above finds its solution in the invention as defined in the appended patent claims.",
"The technology disclosed can generally be applied for any osteotomy followed by fixation of an anatomical part or a device.",
"In some embodiments, the technology can be applied for temporary osteotomy of a part of the distal tibia for access to the medial talar dome of the ankle joint.",
"In other embodiments, the technology can be applied for access to the lateral part of the talus through osteotomy of the lateral part of the distal tibia, or osteotomy of the fibula.",
"In example embodiments, the joint can be a wrist where osteotomy of radius is performed.",
"In yet other embodiments, the joint can be an elbow where an olecranon osteotomy is performed for access to humerus.",
"The inventors have identified a need for an improved osteotomy procedure including a faster and more precise and reliable pre-drilling and refixation procedure which would first of all increase the likelihood of a congruent joint surface after refixation but also increase the likelihood of preserving the deltoid ligament that originates more distally, yet reducing the risk for a drilling that can cause severing of any muscles, tendons and ligaments, or a screw placement causing disruption of the deltoid ligament.",
"Thus, it is important that the drilling, or predrilling, of the fixation holes is performed in a precise and reliable manner.",
"Generally, the technology disclosed proposes a surgical saw guide, and a method for designing a surgical saw guide suitable for use in osteotomy and the temporary osteotomic removal of a bone fragment of a first bone structure of a patient for exposing a second bone structure for surgical treatment.",
"The saw guide may comprise a slit, or opening, configured to receive a saw cutting tool and to guide the saw cutting tool to form a single saw cut in a straight direction at an angle to an inner engagement surface of the saw guide.",
"The inner engagement surface of the saw guide may be adapted to at least partly conform to the surface of the first bone structure of a patient.",
"The saw guide may further comprise, as an integral part, a drill guide having at least one hole with a certain diameter, thickness or depth, orientation and position on the saw guide to thereby be configured to guide the drilling, or pre-drilling, of a hole in a straight direction at an angle relative to the saw cutting direction provided by the guidance of the slit, or opening.",
"The slit, or opening, and the portion of the saw guide comprising said slit, may be configured to be used to form a single saw cut in the removal of a bone fragment of a first bone structure to gain access to a second bone structure for medical treatment of damage to the cartilage and/or bone of that second bone structure.",
"The portion of the saw guide comprising said slit, or opening, may be designed and configured with a height that matches, or corresponds to, the length of the sawblade to be used during sawing to thereby make the powertool used during sawing stop against the top surface of the portion of the saw guide, thereby minimizing the risk of unintentionally sawing too far.",
"In certain example embodiment of and method for designing the saw guide, the dimensions, e.g.",
"the height, of the portion of the saw guide may be customized, e.g.",
"via imagery of the patient's bone structure through e.g.",
"MRI, CT or X-ray and/or based on the sawblade selected.",
"As an example, the length of the sawblade and/or the thickness of the malleolus of a specific patient may be used to determine the height of the portion of the saw guide.",
"The at least one hole of the drill guide of the above saw guide may be configured to guide the drilling, or pre-drilling, of at least one hole past the single saw cutting plane provided by the guidance of said slit and into the inner portions of the first bone structure therebehind, thereby being adapted to provide for the pre-drilling of at least one fixation hole through the bone fragment to be removed, past the saw cutting plane and into the inner portions of the first bone structure that can be used for facilitating correct refixation of the removed bone fragment in its original, or substantially original, position after performed treatment, e.g.",
"surgical treatment, by the use of fixation means, e.g.",
"in the form of at least one screw.",
"The use of the word substantially in substantially original position relates to that a small portion of the first bone structure is pulverized in the saw cutting procedure which, in turn, implies that the bone fragment, when remounted, is fixed to the inner portions of the first bone structure in a position which deviates slightly from its original position.",
"The fixation means are inserted into the first bone structure through the pre-drilled at least one fixation hole, thereby fixing the temporarily removed bone fragment to the first bone structure.",
"In non-limiting embodiments of the technology disclosed, a plurality of screws are used as fixation means for the refixation of the removed bone fragment in its original, or substantially original, position after performed treatment.",
"The plurality of screws are screwed into the first bone structure through a plurality of fixation holes created by the pre-drilling, thereby fixing the temporarily removed bone fragment to the first bone structure.",
"In alternative embodiments, the fixation means used for the refixation of the removed bone fragment may be a plurality of nails, which are driven into the first bone structure through a plurality of fixation holes, thereby fixing the temporarily removed bone fragment to the first bone structure.",
"In yet other alternative embodiments, the fixation means used for the refixation of the removed bone fragment may be a plurality of fixation pins, e.g.",
"self-tapping threaded pins, which are driven into the first bone structure through a plurality of fixation holes, thereby fixing the temporarily removed bone fragment to the first bone structure.",
"According to certain aspects of the technology disclosed, the surgical saw guide is suitable for use in oblique osteotomy and the temporary osteotomic removal of a bone fragment of a tibia for exposing the talus dome for surgical treatment.",
"The saw guide may comprise at least one first opening, or pin hole, adapted to receive a fixation means, such as a pin, where the at least one hole has an orientation adapted to guide the temporary fixation of the saw guide to the tibia.",
"The saw guide may comprise a slit, or opening, configured to receive a saw cutting tool and to guide the saw cutting tool to form a single saw cut in a straight direction at an angle to an inner engagement surface of the saw guide.",
"The inner engagement surface of the saw guide may be adapted to at least partly conform to the distal or lower portion of the tibia of a patient.",
"The saw guide may further comprise, as an integral part, a drill guide having at least one hole having a certain diameter, thickness/depth, orientation and position on the saw guide to thereby be configured to guide the drilling of a hole in a straight direction and at a certain angle relative to the saw cutting direction provided by the guidance of the slit, or opening.",
"The at least one hole of the drill guide may also be designed to have a certain diameter adapted to be suitable for a certain type of drill having certain dimensions, including a certain diameter, so as to achieve a fit upon insertion of the drill into the at least one hole for optimal drilling, or pre-drilling, of the fixation holes into the tibia.",
"The slit, or opening, and the portion of the saw guide comprising said slit, may be configured to be used to form a single saw cut in the removal of a bone fragment of the tibia to gain access to the medial talar dome of the ankle joint for a specific treatment of damage to the cartilage and/or bone of the talus.",
"The at least one hole of the drill guide of the above saw guide may be configured to guide the drilling, or pre-drilling, of at least one hole through the bone fragment, or piece of the tibia, to be removed, past the single saw cutting plane provided by the guidance of said slit and into the inner portions of the tibia therebehind, thereby being adapted to provide for the pre-drilling of at least one fixation hole which can be used for facilitating correct refixation of the removed bone fragment in its original position, or substantially original, after performed treatment, e.g.",
"surgical treatment, by the use of fixation means, e.g.",
"in the form of at least one screw.",
"The fixation means are inserted through the bone fragment to be removed and into the inner portions of the tibia through the pre-drilled of at least one fixation hole fixation, thereby fixing the temporarily removed bone fragment to the inner portions of the tibia.",
"The use of the word substantially in substantially original position relates to that a small portion of the tibia is pulverized in the saw cutting procedure which, in turn, implies that the bone fragment, when remounted, is fixed to the inner portions of the tibia in a position which deviates slightly from its original position.",
"In example embodiments, the portion of the saw guide comprising said slit, or opening, may be designed and configured with a height that matches, or corresponds to, the length of the sawblade to be used during sawing to thereby make the powertool used during sawing stop against the top surface of the portion of the saw guide, thereby minimizing the risk of unintentionally sawing too far, e.g.",
"into the articular surface of the talus.",
"In certain example embodiment of a method for designing the saw guide, the dimensions, e.g.",
"the height, of the portion of the saw guide may be customized, e.g.",
"via imagery of the patient's bone structure through e.g.",
"MRI, CT or X-ray and/or based on the sawblade selected.",
"As an example, the length of the sawblade to be used and/or the thickness of the malleolus of a specific patient may be used to determine the height of the portion of the saw guide.",
"In non-limiting embodiments of the technology disclosed, a plurality of screws are used as fixation means for the refixation of the removed bone fragment in its original, or substantially original, position after performed treatment.",
"The plurality of screws are then screwed into the tibia through a plurality of fixation holes created by the pre-drilling, thereby fixing the temporarily removed bone fragment to the tibia.",
"In alternative embodiments, the fixation means used for the refixation of the removed bone fragment to the inner portions of the tibia may be a plurality of nails, which are driven through the bone fragment into a plurality of fixation holes created in the inner portions of the tibia, where the fixation holes are created by the pre-drilling, thereby fixing the temporarily removed bone fragment to the tibia.",
"In alternative embodiments, the fixation means used for the refixation of the removed bone fragment may be a plurality of fixation pins, e.g.",
"self-tapping threaded pins, which are driven into the tibia through a plurality of fixation holes, thereby fixing the temporarily removed bone fragment to the tibia.",
"In certain embodiments of the technology disclosed, the at least one hole of the drill guide has a certain orientation and position on the saw guide to thereby be configured to guide the drilling, or pre-drilling, of at least one hole past the single saw cutting plane provided by the guidance of said slit and into the inner portions of the tibia bone therebehind, thereby being adapted to provide for the pre-drilling of at least one fixation hole in the inner portions of the tibia bone that can be used for facilitating correct refixation of the removed bone fragment in its original, or substantially original, position after performed surgical treatment, e.g.",
"by the use of fixation means in the form of at least one screw.",
"In certain embodiments, the at least one hole of the drill guide is configured to guide the drilling along a straight line at a specific angle direction with respect to at least one of: at least a portion of the inner engagement surface adapted to conform to the distal or lower portion of the tibia of a patient, the longitudinal axis of the patient, and the direction for forming said single saw cut.",
"According to certain embodiments, the at least one hole of said drill guide is configured to guide the drilling in a direction at an angle or within an angle range to the longitudinal tibial axis of a patient, wherein said angle or angle range is within the angle range of 50-70 degrees to the longitudinal tibial axis of a patient.",
"According to certain embodiments, the at least one hole of said drill guide is configured to guide the drilling in a direction along a straight line at an angle 3 at 60 degrees, or close to 60 degrees, to the longitudinal tibial axis of a patient.",
"According to certain embodiments, the at least one hole of the drill guide is configured to guide drilling in a direction at an angle or within an angle range to the direction for forming said single saw cut, wherein said angle or angle range is within the angle range of 80-100 degrees to the direction for forming said single saw cut.",
"According to certain embodiments, the at least one hole of the drill guide is configured to guide drilling in a perpendicular direction, or close to 90 degrees, with respect to the direction for forming said single saw cut.",
"According to certain embodiments, the slit, or opening, for guiding a saw cutting tool is configured to guide a saw cutting tool to form a single saw cut at an angle or within an angle range to the longitudinal tibial axis of a patient, wherein said angle or angle range is within the angle range of 15-50 degrees to the longitudinal tibial axis of a patient.",
"According to certain embodiments, the slit, or opening, for guiding a saw cutting tool is configured to guide a saw cutting tool to form a single saw cut in a direction at a 30 degrees angle, or close to 30 degrees, to the longitudinal tibial axis of a patient.",
"In certain example embodiments, the saw guide further comprises an opening forming an inspection window adapted to allow visual inspection of how well the saw guide conforms to the distal or lower portion of the tibia of a patient, thereby facilitating adjustment of the positioning of the saw guide to provide for a correct positioning of the saw guide to the distal or lower portion of the tibia of the patient, to provide for both a more precise saw cutting procedure and a more precise drilling procedure.",
"The technology disclosed further provides a surgical kit including the saw guide according to any of the embodiments described above.",
"In certain aspects, the surgical kit includes fixation means in form of e.g.",
"screws such as e.g.",
"titanium screws, which have dimensions and a certain length configured to allow for a correct refixation of the temporarily removed bone fragment, e.g.",
"the fixation means have a length corresponding to, or adapted to, the depth of the holes pre-drilled through the bone fragment and beyond the saw cutting plane into the inner portions of the tibia.",
"In other example embodiments, the surgical kit of the present disclosure may include a verification tool, or depth meter tool, having a depth stop designed to be engaging a powertool, used for the saw cutting procedure, at a specific depth, to prevent insertion of saw cutting blades into the slit of the saw guide that cut beyond a certain length.",
"In the verification process, the saw attachment and sawblade are first attached to the powertool and the depth meter is used for verifying that the selected sawblade has the correct dimension for a designed saw guide.",
"In other embodiments related to the example use of the technology disclosed in the surgical treatment by the implantation of an implant into a second bone structure, e.g.",
"by resurfacing of an implant into the dome of the talus, the surgical kit of the present disclosure may include a hollow tubular shell suitable for guiding correct preparations such as implant pre-drilling at the surgical site of the talus dome.",
"In these embodiments, the surgical kit of the present disclosure may also include different sockets adapted to be positioned in the hollow tubular shell.",
"One such socket is a pin socket configured with a steering hole in the form of a through hole.",
"The pin socket, when positioned in said hollow tubular shell, provides mechanical support and directional guidance for vertical drilling through said steering hole and into the articular surface of the second bone structure, creating a steering hole for further drilling to remove cartilage and bone to prepare the site for implantation of an implant.",
"In some embodiments, the pin socket, when positioned in said hollow tubular shell, may provide mechanical support and the directional guidance for vertical drilling through the steering hole of the pin socket and into the articular surface of a joint to form a steering hole in the articular surface of a joint for further drilling to remove cartilage and bone to prepare the site for implantation of an implant.",
"In example embodiments, the pin socket, when positioned in said hollow tubular shell, provides mechanical support and directional guidance for vertical drilling through said steering hole and into the dome of the talus, creating a steering hole for further drilling to remove cartilage and bone to prepare the site for implantation of an implant into the dome of the talus.",
"Two other sockets; a drilling socket and an adjustment socket, may further be used in the process of removing a portion of the talus bone for creating a recess for the implant, preceding hammering of the surgical implant into place in the talus dome.",
"When the pre-drilling through the steering hole of the pin socket has been performed, the drilling socket is mounted into the hollow tubular shell and the drilling operation continues until the drill stops at the top of the drilling socket.",
"The drilling guide is removed and the adjustment socket is instead inserted into the hollow tubular shell.",
"When inserting the drill into the adjustment socket, the drill is inserted into the pre-drilled hole.",
"Preferably, the drill body should not be in contact with the cartilage surface when the drilling starts.",
"The drilling into the talar dome continues until the drill stops at the top of the adjustment socket.",
"A flushing device and suction may be used to cleanse the drilled hole.",
"For the final placement of the implant into the drilled hole, a mandrel and/or a hammer may be used to gently tap down the surgical implant into the bone until bottomed.",
"In certain example embodiments, the surgical kit may, in addition to the various embodiment of a saw guide described in this disclosure, also include at least one of a surgical implant, a dummy implant, a drill, a mandrel and a hollow tubular shell used for drilling of the damaged area on the articular surface of a second bone structure in the surgical procedure of implantation of resurfacing inlay implants.",
"The technology disclosed further proposes a method for designing a saw guide comprising the above-mentioned technical features.",
"The method for designing the saw guide includes the designing of a saw guide which comprises as integral parts both a slit configured to guide the saw cutting in a first direction and a drill guide having at least one hole configured to guide the pre-drilling in a second direction different from the first direction.",
"In certain embodiments, the technology disclosed proposes a method for designing any of the above-mentioned embodiments of a saw guide which includes a step for designing the at least portion of the surface of the inner engagement surface adapted to conform to the distal or lower portion of the tibia of a patient to be individually patient customized on the basis of radiologically obtained patient data, such as MR, CT or X-ray imaging.",
"In certain embodiments, the technology disclosed proposes a method for designing any of the above-mentioned embodiments of a saw guide which includes a step for designing the placement and orientation of the at least one hole of the drill guide to be individually patient customized on the basis of radiologically obtained patient data, such as MR, CT or X-ray imaging.",
"In certain embodiments, the technology disclosed proposes a method for designing any of the above-mentioned embodiments of a saw guide which includes a step for designing the placement and orientation of the slit, or opening, to be individually patient customized on the basis of radiologically obtained patient data, such as MR, CT or X-ray imaging.",
"In other embodiments, the technology disclosed proposes a method for designing any of the above-mentioned embodiments of a saw guide which includes a step for designing the at least one hole of the drill guide, said at least one hole having a certain orientation and position on the saw guide, to be individually patient customized on the basis of radiologically obtained patient data, such as MR, CT or X-ray imaging, in that the drilling direction provided by the position and orientation of the at least one hole is designed to have a patient customized angle relationship to at least one of the distal or lower portion of the tibia of a patient and the longitudinal axis of the patient.",
"In yet other embodiments, the technology disclosed proposes a method for designing any of the above-mentioned embodiments of a saw guide which includes a step for designing the slit, or opening, to be individually patient customized on the basis of radiologically obtained patient data, such as MR, CT or X-ray imaging, in that the saw cutting direction, and thereby also the saw cutting plane, provided by the position and orientation of said slit is designed to have a patient customized angle relationship to at least one of the distal or lower portion of the tibia of a patient and the longitudinal axis of the patient.",
"In yet other embodiments, the technology disclosed proposes a method for designing any of the above-mentioned embodiments of a saw guide which includes at least one step for designing both the saw cutting direction provided by the position and orientation of said slit, or opening, and the drilling direction provided by position and orientation of the at least one hole of the drill guide to have a patient customized angular relationship to at least one of the distal or lower portion of the tibia of a patient and the longitudinal axis of the patient.",
"Thus, the above-mentioned saw guide comprises as integral parts both a slit configured to guide the saw cutting in a first direction and a drill guide having at least one hole configured to guide the predrilling in a second direction different from the first direction.",
"The technology disclosed enables the design of a saw guide comprising at least one hole of a drill guide having a fixed physical relationship to a slit suitable to be used for saw cutting, i.e.",
"both a positional and angular relationship between the at least one holes of the drill guide and the saw cutting slit, thereby enabling the design of a saw guide having a fixed angular relationship between the angle direction of the saw cutting provided by the guidance direction of the slit and the angle direction for predrilling of the at least one fixation hole provided by the guidance direction of the at least one hole of the drill guide.",
"In certain embodiments of the technology disclosed, this fixed angular relationship (between the guidance direction for the saw cutting direction provided by the orientation of the slit and the guidance direction of the predrilling of the at least one fixation hole provided by the at least one hole of the drill guide of the at least one fixation hole) is individually patient customized on the basis of radiologically obtained patient data, such as MR, CT or X-ray imaging.",
"The thickness, or depth, of the slit and the dimensions and/or shape of the slit area of the slit, i.e.",
"the longitudinal length and width of the slit area, may also be designed to be adapted and optimized to the length, width, and/or shape of a certain type of sawblade selected for the saw cutting procedure.",
"The dimensions and/or depth/height of the portion of the saw guide which comprises the slit may be customized based on the sawblade selected.",
"In certain embodiments, the osteotomy and the surgical tools used, e.g.",
"the design of the saw guide, can be adapted to the selected treatment of the damage, e.g.",
"the damaged portions of a talus.",
"The design of the saw guide may be based on both radiologically obtained patient data, such as MR, CT or X-ray imaging, and at least one of the selected type of treatment of the damaged area and, optionally, the size and location of the osteotomy.",
"As an example, a drill guide, e.g.",
"in form of a hollow tubular shell used for the implantation of a surgical implant, which has larger dimensions or a larger diameter, may require more space which in turn may require a larger osteotomy and the use of a saw guide that is designed for a larger osteotomy.",
"A hollow tubular shell is designed to cover with its hollow part the damaged area of the talus to be repaired and is used for supporting the drilling on the talus dome, providing for a bore which is used for insertion of a surgical implant into the talus.",
"In certain embodiments, the technology disclosed may generally provide for patient-specific surgical kits including patient-specific saw guides and associated tools and components for use in osteotomy, low tibial or medial malleolar osteotomy, for example.",
"The patient-specific saw guides can be used either with conventional or patient-specific implant components prepared with computer-assisted image methods.",
"Computer modeling for obtaining three dimensional images of the patient's anatomy using MRI or CT scans of the patient's anatomy, and the patient-specific guides and templates can be provided by various CAD programs and/or software available.",
"In example embodiments, the patient-specific saw guides and associated patient-specific openings, holes and/or slits disclosed herein can be generally formed using computer modelling based on the patient's three-dimensional anatomic image generated from image scans.",
"In specific embodiments, the design of the patient-specific saw guide and associated patient-specific openings, holes and/or slits disclosed herein may also be determined partly based on the patients three-dimensional anatomic image generated from image scans and partly on other requests, e.g.",
"concerning the size and location of the osteotomy, which may be requested by the surgeon performing the osteotomy.",
"The patient-specific saw guides can have a three-dimensional inner engagement surface that is made to at least partly conformingly contact and match a three-dimensional image of the patient's bone surface, by the computer methods discussed above.",
"In certain aspects of the technology disclosed, the patient-specific saw guide may also include customized guiding formations, such as a patient-customized drill guide and/or a patient-customized slit, or opening.",
"In various embodiments, the patient-specific saw guide comprises a slit, e.g.",
"a patient-specific slit, for receiving and guiding a cutting blade at certain cutting plane orientations, e.g.",
"relative to a selected anatomic axis for the specific patient.",
"The patient-specific saw guide can also include drill guide formations and at least one hole for guiding the drilling, or predrilling, associated with the osteotomy procedure, at specific drilling orientations, e.g.",
"relative to a selected anatomic axis of a specific patient.",
"The geometry, shape and orientation of the various features of the patient-specific saw guide, as well as various patient-specific implants and other patient-specific tools that optionally may be used together with the saw guide according to certain example embodiments of the technology disclosed, can be determined during the pre-operative planning stage of the procedure in connection with the computer-assisted modelling of the patients anatomy.",
"In example embodiments of the technology disclosed, the saw guide may be individually made specific to the patient's specific anatomy and to the specific damage to the second bone structure, possibly through the following saw guide design steps: a. identifying a damage of a second bone structure through radiological images such as MR, CT or X-ray images or through arthroscopy; b. planning the size and the location of an osteotomy needed to get access to the second bone structure to perform a specific treatment of the damage; c. creating a virtual 3D model of at least one of a first and the second bone structure from radiological images such as MR, CT or X-ray images; and d. virtually designing a patient specific osteotomy guide based on the 3D model of at least one of the first and second bone structure and the size and location of the osteotomy needed.",
"In various embodiments, the surgical saw guide may be manufactured by a 3D printing process in which material is joined or solidified under computer control to create the surgical saw guide.",
"The method of manufacturing by a 3D printing process may include building the surgical saw guide from computer-aided design (CAD) data by successively adding material layer by layer.",
"The CAD data may further be based on a virtually designed patient specific osteotomy saw guide based on the 3D model of the at least portion of the first bone structure and the size and location of the osteotomy needed.",
"According to example embodiment, the above method of manufacturing the saw guide in a 3D printing process may be preceded by the following steps of virtually designing a patient specific osteotomy saw guide: a. identifying at least one of a bone and a cartilage damage of the second bone structure through radiological images such as MR, CT or X-ray images; b. planning the size and the location of an osteotomy needed to get access to the second bone structure in the surgical treatment of said at least one of a bone and cartilage damage of the second bone structure; c. creating a 3D model of at least portions of at least one of a first bone structure and the second bone structure from radiological images such as MR, CT or X-ray images; and d. virtually designing a patient specific osteotomy saw guide based on the 3D model and the size and location of the osteotomy needed.",
"In various embodiments, a surgical saw guide configured to be used for an osteotomy of a part of distal tibia for access to the medial talar dome of the ankle joint is manufactured by a 3D printing process in which material is joined or solidified under computer control to create the surgical saw guide.",
"The method of manufacturing of the saw guide for an osteotomy of a part of distal tibia by a 3D printing process may include building the surgical saw guide from computer-aided design (CAD) data by successively adding material layer by layer.",
"The CAD data may further be based on a virtually designed patient specific osteotomy saw guide based on the 3D model of the at least portion of the first bone structure and the size and location of the osteotomy needed.",
"According to example embodiment, the above method of manufacturing a saw guide suitable for an osteotomy of a part of distal tibia in a 3D printing process may be preceded by the following steps of virtually designing a patient specific osteotomy saw guide: a. identifying at least one of a bone and a cartilage damage of the talus through radiological images such as MR, CT or X-ray images; b. planning the size and the location of an osteotomy needed to get access to the dome of the talus in the treatment, e.g.",
"surgical treatment, of said at least one of a bone and cartilage damage of the talus; c. creating a 3D model of at least portions of at least one of the tibia and talus from radiological images such as MR, CT or X-ray images; and d. virtually designing a patient specific osteotomy saw guide based on the 3D model and/or the size and location of the osteotomy needed.",
"In example embodiments, the technology disclosed may be used with a surgical method comprising at least some of the following steps: a. attaching a three-dimensional engagement surface of a patient-specific saw guide to a corresponding surface of a tibia of a patient for whom the saw guide is customized by computer imaging during a pre-operative planning stage, the three-dimensional engagement surface conforming as a negative surface to the corresponding surface of the patient's tibia; b. drilling, or predrilling, at least one fixation hole through the tibia bone; c. making a partial bone cut in the tibia through an opening of the saw guide, the slot oriented at a patient-specific angle relative to an anatomic axis of the patient, the angle custom-selected during the pre-operative planning stage for correcting the patient's anatomy; d. loosening, by use of an osteotome, a bone segment defined by the partial bone cut; e. removing the bone segment, or cut out piece of the tibia, to obtain access to the dome of the talus; f. drilling a hole in the dome of the talus for the peg and the shallow hole for the cap of an implant; g. inserting an implant into the dome of the talus; and h. refixating the bone fragment in its original position with the aid of surgical screws inserted into the pre-drilled holes.",
"The patient-specific osteotomy kit of the technology disclosed may also include patient-specific fixation means in form of e.g.",
"screws such as titanium screws, which have a certain diameter and a certain length configured to allow for a correct, or predetermined, refixation of the temporarily removed bone fragment, e.g.",
"a length corresponding or adapted to the depth of the holes predrilled through the bone fragment and beyond the saw cutting plane into the inner portions of the tibia.",
"The osteotomy surgical kit can also include saw blades configured to allow for a predetermined cutting length corresponding to a cutting depth, in order to avoid unintentionally sawing too deep and thereby damaging the articular surface of the talar dome.",
"The cutting depth can be determined at the pre-operative planning stage.",
"In various other embodiments, the cutting depth of the selected sawblade can be verified using a separate verification tool, e.g.",
"a depth meter tool, which may e.g.",
"have a depth stop.",
"The cutting depth can also be verified by a separate depth meter verification tool having a depth stop with a certain depth adapted to be engaging a powertool at a specific depth and.",
"preventing insertion of sawblades that cut beyond a certain depth.",
"Thus, the depth meter verification tool can be used for verifying that the sawblade is restricted to saw cutting to a pre-determined cutting depth which may be patient-specific and determined on the basis of radiologically obtained patient data, such as MR, CT or X-ray imaging.",
"In the verification process, the saw attachment and sawblade are first attached to the powertool and a verification tool, or depth meter tool, is used to verify that the selected sawblade has the correct dimension for the saw guide.",
"The verification tool is configured with a depth stop designed to be engaging the powertool at a specific depth to prevent insertion of sawblades into the slit of the saw guide that cut beyond a certain length.",
"In example embodiments, the verification process using the depth meter verification tool includes at least some of the following steps: The surgeon selects a sawblade that is either commonly used for a specific osteotomy procedure, and/or the surgeon believes have the desired dimensions, The dimensions of the sawblade selected by the surgeon are uploaded together with radiologically obtained patient data to the system used for designing the saw guide, The saw guide is designed based on the uploaded dimensions of the sawblade and the radiologically obtained patient data, Prior to performing surgery, the surgeon uses a verification tool in form of an osteotomy depth meter to verify that the selected sawblade has the correct or desired dimensions for the designed saw guide.",
"The size and dimension of the portion of the saw guide which comprises the saw cutting slit, and which may correspond to or define the depth of the slit, may be designed to be adapted to the length of the sawblade as the powertool, to which the sawblade is attached, engages and stops at the upper surface of the portion of the saw guide.",
"In certain example embodiment of the method for designing the saw guide, the dimensions, e.g.",
"the depth/height, of the portion of the saw guide comprising the slit may be customized based on the sawblade selected."
],
[
"CROSS-REFERENCE TO PRIOR APPLICATIONS This application is a continuation-in-part application of U.S. patent application Ser.",
"No.",
"15/526,539 filed May 12, 2017, which is a § 371 National Stage Application of PCT International Application No.",
"PCT/EP2014/074533 filed Nov. 13, 2014, each of which are herein incorporated by reference in its entirety.",
"TECHNICAL FIELD The present disclosure relates to a surgical kit, a saw guide and other related tools used in the osteotomy for temporary removal of a piece of the bone of a first bone structure to gain temporary access for treatment of defects of the cartilage and/or bone of a second bone structure, as well as methods for designing and manufacturing said tools.",
"BACKGROUND Generally, the technology disclosed relates to surgical tools used in the temporary removal of a piece of a first bone structure to gain temporary access for surgical treatment of defects of a second bone structure.",
"The defects of the second bone structure may e.g.",
"be damage in the bone, cartilage or cartilage and underlying bone of the second bone structure.",
"In certain aspects, the technology disclosed relates to joint defects, such as osteochondral defects, of the talar dome which are mostly caused by a traumatic event.",
"They may lead to deep ankle pain on weight bearing, prolonged swelling, diminished range of motion, and synovitis.",
"The mean cartilage thickness of the talar dome is in the range 1.2 to 1.4 mm.",
"Cartilage defects are strongly linked to damage in the subchondral bone.",
"An important target in the treatment of talar osseochondral defects (OCDs) is repair of the subchondral bone.",
"A healthy restored subchondral bone plate would decrease the pain, improve the load-bearing capacity of the ankle, and improve chondrocyte survival in the remaining cartilage.",
"Treatment options for talar osteochondral defects (OCDs) are numerous.",
"High success rates have been reported for bone marrow stimulation techniques and osteochondral autograft transfer.",
"Because osteochondral autograft transfer can cause knee morbidity at the donor site, debridement and bone marrow stimulation often remains the treatment of choice for primary OCDs, i.e., those without previous surgery, up to 15 mm in diameter.",
"During debridement and bone marrow stimulation, the OCD is preferably approached by anterior ankle arthroscopy with the ankle in full plantar flexion for adequate exposure of the defect.",
"However, the ankle is a congruent joint with limited surgical access.",
"Some defects are located so far posteriorly that they may not be accessible by anterior ankle arthroscopy.",
"During debridement and bone marrow stimulation, the OCD may for example be approached by anterior ankle arthroscopy with the ankle in full plantar flexion for adequate exposure of the defect.",
"However, the ankle is a congruent joint with limited surgical access.",
"Some defects are located so far posteriorly that they may not be accessible by anterior ankle arthroscopy.",
"If the lesion is located on the medial side of the talar dome (ca 60% of cases), most of these treatment options require an osteotomy, e.g.",
"a medial malleolar osteotomy, to obtain sufficient access to the talar dome.",
"There are different varieties of osteotomy to get access to the talar dome, but a medial malleolar osteotomy is an established approach for the operative treatment of medial osteochondral defects of the talar dome and fractures of the talar body.",
"Lesions after failed previous surgery or large lesions can be treated by various alternative surgical methods, including autologous cancellous bone grafting, osteochondral autograft transfer, osteochondral allograft transfer and autologous chondrocyte implantation (ACI) or treatment with resurfacing implants.",
"These techniques are generally more complicated and require more bulky tools compared to debridement and bone marrow stimulation, thus requiring better access to the talar dome, especially for larger lesions.",
"Disadvantages of these secondary methods include pain at the donor site, limited availability of graft material, and two surgical procedures in the case of ACI.",
"An alternative without these disadvantages would be desirable.",
"The methods mentioned above are sometimes combined with osteotomy for better access to the talar dome.",
"Because of the disadvantages of current secondary treatment methods, metal resurfacing inlay implants have been developed and started to reach the market.",
"A precise surgical technique is required in terms of implantation depth, position, and orientation because of the biomechanical properties of the ankle joint.",
"A protruding implant may damage the opposite cartilage by causing excessive contact pressures during loading, which is thought to be due to “plowing” of the cartilage.",
"On the other hand, a deep implant might result in collapse of the adjacent cartilage due to insufficient support.",
"If the lesion is located on the medial side of the talar dome (ca 60% of cases), most of these treatment options require a medial malleolar osteotomy in order to obtain access to the talar dome.",
"A medial malleolar osteotomy is an established approach for the operative treatment of medial osteochondral defects of the talar dome and fractures of the talar body.",
"There are different varieties of osteotomy to get access to the talar dome.",
"A commonly used osteotomy is the oblique medial malleolar osteotomy, which is a crucial step in the surgical implantation of the resurfacing inlay implants.",
"To obtain a congruent joint surface after refixation, the osteotomy should be directed perpendicularly to the articular surface of the tibia at the intersection between the tibial plafond and medial malleolus.",
"At an instructional course on the metallic implantation technique, surgeons experienced technical difficulties performing a successful medial malleolar osteotomy.",
"The difficulties included sawing at an angle that allowed refixation of the distal fragment without creating an articular incongruence, as well as identifying the intersection between the tibial plafond and medial malleolus.",
"Thus, knowledge of the angle of the osteotomy relative to an anatomic landmark such as the long tibial axis would be helpful for use during surgery, as well as surgical tricks to identify the intersection.",
"It has been reported that a medial malleolar osteotomy frequently led to local osteoarthritis and less favorable clinical findings than arthrotomy without osteotomy.",
"The advantages of implants over complete replacement of the joint have stimulated a further development of smaller implants that can be implanted with less invasive surgery.",
"In this development there has also been an effort to achieve small joint implants, suitable for repair of a small bone and/or cartilage injury that have a minimal influence on the surrounding parts of the joint.",
"In the current development, such small implants are designed with an implant body that may be formed as a mushroom cap with a hard surface to face the articulating side of the joint and a bone contacting surface engaging the bone below the damaged part of cartilage.",
"The shape and the curvature of the articulating surface of the implant may be designed to be a reconstitution of the shape and the curvature of the part of the joint when it was undamaged.",
"Such implants are usually designed as mushrooms with an implant body or head and with a peg or a rod projecting from the bone contacting side of the implant body for anchoring the implant into the bone.",
"The cap of the mushroom for repair of the talus dome is often slanted or irregular to conform to the shape of the original undamaged ridge or dome of the talus.",
"There is a lack of talar metal resurfacing implants with an exact match of the undamaged talar anatomy, as well as metal resurfacing implants that can be placed not only at the edge of the medial talar dome, but placed more centrally on the medial talar dome.",
"Problems with the Prior Art An osteotomy, which includes cutting out and temporarily removing a bone fragment of a first bone structure to gain access to a second bone structure for medical treatment of damage to the cartilage and/or bone of that second bone structure, can be a crucial step for any kind of treatment of various second bone structures.",
"e.g.",
"for the treatment with bone marrow stimulation, osteochondral grafting or the surgical implantation of resurfacing inlay implants into the second bone structure.",
"A commonly used osteotomy for the treatment of defects of the talar dome of the ankle joint is the oblique osteotomy, such as the medial malleolar osteotomy, which is a crucial step for obtaining access to the talar dome for treatment of the talus, e.g.",
"the treatment with bone marrow stimulation, treatment through osteochondral grafting or the surgical implantation of resurfacing inlay implants.",
"To obtain a congruent joint surface after refixation of the temporarily removed bone fragment, the osteotomy in state of the art solutions is often directed essentially perpendicularly to the articular surface of the tibia at the intersection between the tibial plafond and the medial malleolus.",
"Failure to direct the osteotomy properly may lead to limited exposure of the defect site (too medial), or violate the weight-bearing cartilage on the tibial plafond (too lateral).",
"Implants having a top cap surface customized to each patient to replicate the surface of the talus dome before it was injured, must be implanted so that the forces, applied during standing and walking via the lower condylar surfaces of the tibia against the new implant will act axially in relation to the implantation peg, for optimum force absorption and length of life.",
"The anatomy of the talocrural area differs from that of the knee in that it is very difficult for the surgeon to access the dome of the talus.",
"It is covered by the lower condylar surface of the tibia, as well as being encased by a many different muscles, tendons and ligaments extending between the tibia and the calcaneus, the navicular and the talus, particular the medial (deltoid) ligaments and flexor digitorum longus and the tibialis posterior muscles.",
"Any severing of these muscles and tendons to gain access to the talus dome will create exceptional and sometimes permanent problems as regards repair and rehabilitation.",
"In this osteotomy procedure aimed at gaining access to the treatment area, e.g.",
"the dome of the talus, a drilling, or predrilling, through the saw cutting plane of the piece of the tibia to be removed to create fixation holes in the inner portions of the tibia may be performed.",
"The drilling, or pre-drilling, of the fixation holes is preferably performed before the saw cutting and the created fixation holes through the malleolus and into the inner portions of the tibia are later used for refixation of the temporarily removed bone fragment.",
"In this connection, there is a need for an improved osteotomy procedure including a faster and more precise and reliable pre-drilling and refixation procedure which would first of all increase the likelihood of a congruent joint surface after refixation but also increase the likelihood of preserving the deltoid ligament that originates more distally, yet reducing the risk for a drilling that can cause severing of any muscles, tendons and ligaments, or a screw placement causing disruption of the deltoid ligament.",
"Any significant improvement to the osteotomy procedure, including a faster and more precise and reliable pre-drilling and refixation, would be almost impossible to achieve with the currently used methods and tools for free-hand drilling of the fixation holes, or with an osteotomy where the saw cutting procedure and the pre-drilling and refixation procedure are essentially separate procedures which are not strongly linked to each other.",
"If a bone fragment in form of a piece of the lower tibia, or malleolus, is sawn out to gain access to the talus dome, it is necessary that the bone be sawn precisely on the first try, so that the bone fragment, or bone segment, will fit precisely in place when put back and screwed in place.",
"For better healing and alignment, the single saw cut is preferably a partial cut, not a through cut.",
"The last part of the bone fragment is generally loosened with aid of a surgical tool referred to as osteotome, tapped down to create breakage of the last part of bone.",
"It is also important that the drilling, or predrilling, of the fixation holes is performed in a precise and reliable manner.",
"It is thus necessary to expose the talus dome by cutting out a corner of the lower medial tibia, under a number of difficult constrictions: avoiding all important tendons, muscles and ligaments and leaving them attached and intact, avoiding the anterior tibial artery, providing enough exposed space to correctly perform a surgical treatment of at least one of a bone and a cartilage damage of the talus dome, and correctly drill for and drive in the implant at the correct angle, making the drilling of the fixation holes and the sawing of the bone cut precise and correct on the first try, facilitating a correct refixation of the temporarily removed bone fragment in form of a piece of the lower tibia, e.g.",
"a piece of the malleolus, in its correct position for healing and for creating a congruent joint surface, avoiding cutting through the bone fragment and into the cartilage of the talar dome, damaging the articular surface.",
"A kit according to the disclosure makes this possible in a precise and reproducible manner, providing for an operation which would be almost impossible to achieve with free-hand cutting, and placement of the implant.",
"SUMMARY The entire complex of problems listed above finds its solution in the invention as defined in the appended patent claims.",
"The technology disclosed can generally be applied for any osteotomy followed by fixation of an anatomical part or a device.",
"In some embodiments, the technology can be applied for temporary osteotomy of a part of the distal tibia for access to the medial talar dome of the ankle joint.",
"In other embodiments, the technology can be applied for access to the lateral part of the talus through osteotomy of the lateral part of the distal tibia, or osteotomy of the fibula.",
"In example embodiments, the joint can be a wrist where osteotomy of radius is performed.",
"In yet other embodiments, the joint can be an elbow where an olecranon osteotomy is performed for access to humerus.",
"The inventors have identified a need for an improved osteotomy procedure including a faster and more precise and reliable pre-drilling and refixation procedure which would first of all increase the likelihood of a congruent joint surface after refixation but also increase the likelihood of preserving the deltoid ligament that originates more distally, yet reducing the risk for a drilling that can cause severing of any muscles, tendons and ligaments, or a screw placement causing disruption of the deltoid ligament.",
"Thus, it is important that the drilling, or predrilling, of the fixation holes is performed in a precise and reliable manner.",
"Generally, the technology disclosed proposes a surgical saw guide, and a method for designing a surgical saw guide suitable for use in osteotomy and the temporary osteotomic removal of a bone fragment of a first bone structure of a patient for exposing a second bone structure for surgical treatment.",
"The saw guide may comprise a slit, or opening, configured to receive a saw cutting tool and to guide the saw cutting tool to form a single saw cut in a straight direction at an angle to an inner engagement surface of the saw guide.",
"The inner engagement surface of the saw guide may be adapted to at least partly conform to the surface of the first bone structure of a patient.",
"The saw guide may further comprise, as an integral part, a drill guide having at least one hole with a certain diameter, thickness or depth, orientation and position on the saw guide to thereby be configured to guide the drilling, or pre-drilling, of a hole in a straight direction at an angle relative to the saw cutting direction provided by the guidance of the slit, or opening.",
"The slit, or opening, and the portion of the saw guide comprising said slit, may be configured to be used to form a single saw cut in the removal of a bone fragment of a first bone structure to gain access to a second bone structure for medical treatment of damage to the cartilage and/or bone of that second bone structure.",
"The portion of the saw guide comprising said slit, or opening, may be designed and configured with a height that matches, or corresponds to, the length of the sawblade to be used during sawing to thereby make the powertool used during sawing stop against the top surface of the portion of the saw guide, thereby minimizing the risk of unintentionally sawing too far.",
"In certain example embodiment of and method for designing the saw guide, the dimensions, e.g.",
"the height, of the portion of the saw guide may be customized, e.g.",
"via imagery of the patient's bone structure through e.g.",
"MRI, CT or X-ray and/or based on the sawblade selected.",
"As an example, the length of the sawblade and/or the thickness of the malleolus of a specific patient may be used to determine the height of the portion of the saw guide.",
"The at least one hole of the drill guide of the above saw guide may be configured to guide the drilling, or pre-drilling, of at least one hole past the single saw cutting plane provided by the guidance of said slit and into the inner portions of the first bone structure therebehind, thereby being adapted to provide for the pre-drilling of at least one fixation hole through the bone fragment to be removed, past the saw cutting plane and into the inner portions of the first bone structure that can be used for facilitating correct refixation of the removed bone fragment in its original, or substantially original, position after performed treatment, e.g.",
"surgical treatment, by the use of fixation means, e.g.",
"in the form of at least one screw.",
"The use of the word substantially in substantially original position relates to that a small portion of the first bone structure is pulverized in the saw cutting procedure which, in turn, implies that the bone fragment, when remounted, is fixed to the inner portions of the first bone structure in a position which deviates slightly from its original position.",
"The fixation means are inserted into the first bone structure through the pre-drilled at least one fixation hole, thereby fixing the temporarily removed bone fragment to the first bone structure.",
"In non-limiting embodiments of the technology disclosed, a plurality of screws are used as fixation means for the refixation of the removed bone fragment in its original, or substantially original, position after performed treatment.",
"The plurality of screws are screwed into the first bone structure through a plurality of fixation holes created by the pre-drilling, thereby fixing the temporarily removed bone fragment to the first bone structure.",
"In alternative embodiments, the fixation means used for the refixation of the removed bone fragment may be a plurality of nails, which are driven into the first bone structure through a plurality of fixation holes, thereby fixing the temporarily removed bone fragment to the first bone structure.",
"In yet other alternative embodiments, the fixation means used for the refixation of the removed bone fragment may be a plurality of fixation pins, e.g.",
"self-tapping threaded pins, which are driven into the first bone structure through a plurality of fixation holes, thereby fixing the temporarily removed bone fragment to the first bone structure.",
"According to certain aspects of the technology disclosed, the surgical saw guide is suitable for use in oblique osteotomy and the temporary osteotomic removal of a bone fragment of a tibia for exposing the talus dome for surgical treatment.",
"The saw guide may comprise at least one first opening, or pin hole, adapted to receive a fixation means, such as a pin, where the at least one hole has an orientation adapted to guide the temporary fixation of the saw guide to the tibia.",
"The saw guide may comprise a slit, or opening, configured to receive a saw cutting tool and to guide the saw cutting tool to form a single saw cut in a straight direction at an angle to an inner engagement surface of the saw guide.",
"The inner engagement surface of the saw guide may be adapted to at least partly conform to the distal or lower portion of the tibia of a patient.",
"The saw guide may further comprise, as an integral part, a drill guide having at least one hole having a certain diameter, thickness/depth, orientation and position on the saw guide to thereby be configured to guide the drilling of a hole in a straight direction and at a certain angle relative to the saw cutting direction provided by the guidance of the slit, or opening.",
"The at least one hole of the drill guide may also be designed to have a certain diameter adapted to be suitable for a certain type of drill having certain dimensions, including a certain diameter, so as to achieve a fit upon insertion of the drill into the at least one hole for optimal drilling, or pre-drilling, of the fixation holes into the tibia.",
"The slit, or opening, and the portion of the saw guide comprising said slit, may be configured to be used to form a single saw cut in the removal of a bone fragment of the tibia to gain access to the medial talar dome of the ankle joint for a specific treatment of damage to the cartilage and/or bone of the talus.",
"The at least one hole of the drill guide of the above saw guide may be configured to guide the drilling, or pre-drilling, of at least one hole through the bone fragment, or piece of the tibia, to be removed, past the single saw cutting plane provided by the guidance of said slit and into the inner portions of the tibia therebehind, thereby being adapted to provide for the pre-drilling of at least one fixation hole which can be used for facilitating correct refixation of the removed bone fragment in its original position, or substantially original, after performed treatment, e.g.",
"surgical treatment, by the use of fixation means, e.g.",
"in the form of at least one screw.",
"The fixation means are inserted through the bone fragment to be removed and into the inner portions of the tibia through the pre-drilled of at least one fixation hole fixation, thereby fixing the temporarily removed bone fragment to the inner portions of the tibia.",
"The use of the word substantially in substantially original position relates to that a small portion of the tibia is pulverized in the saw cutting procedure which, in turn, implies that the bone fragment, when remounted, is fixed to the inner portions of the tibia in a position which deviates slightly from its original position.",
"In example embodiments, the portion of the saw guide comprising said slit, or opening, may be designed and configured with a height that matches, or corresponds to, the length of the sawblade to be used during sawing to thereby make the powertool used during sawing stop against the top surface of the portion of the saw guide, thereby minimizing the risk of unintentionally sawing too far, e.g.",
"into the articular surface of the talus.",
"In certain example embodiment of a method for designing the saw guide, the dimensions, e.g.",
"the height, of the portion of the saw guide may be customized, e.g.",
"via imagery of the patient's bone structure through e.g.",
"MRI, CT or X-ray and/or based on the sawblade selected.",
"As an example, the length of the sawblade to be used and/or the thickness of the malleolus of a specific patient may be used to determine the height of the portion of the saw guide.",
"In non-limiting embodiments of the technology disclosed, a plurality of screws are used as fixation means for the refixation of the removed bone fragment in its original, or substantially original, position after performed treatment.",
"The plurality of screws are then screwed into the tibia through a plurality of fixation holes created by the pre-drilling, thereby fixing the temporarily removed bone fragment to the tibia.",
"In alternative embodiments, the fixation means used for the refixation of the removed bone fragment to the inner portions of the tibia may be a plurality of nails, which are driven through the bone fragment into a plurality of fixation holes created in the inner portions of the tibia, where the fixation holes are created by the pre-drilling, thereby fixing the temporarily removed bone fragment to the tibia.",
"In alternative embodiments, the fixation means used for the refixation of the removed bone fragment may be a plurality of fixation pins, e.g.",
"self-tapping threaded pins, which are driven into the tibia through a plurality of fixation holes, thereby fixing the temporarily removed bone fragment to the tibia.",
"In certain embodiments of the technology disclosed, the at least one hole of the drill guide has a certain orientation and position on the saw guide to thereby be configured to guide the drilling, or pre-drilling, of at least one hole past the single saw cutting plane provided by the guidance of said slit and into the inner portions of the tibia bone therebehind, thereby being adapted to provide for the pre-drilling of at least one fixation hole in the inner portions of the tibia bone that can be used for facilitating correct refixation of the removed bone fragment in its original, or substantially original, position after performed surgical treatment, e.g.",
"by the use of fixation means in the form of at least one screw.",
"In certain embodiments, the at least one hole of the drill guide is configured to guide the drilling along a straight line at a specific angle direction with respect to at least one of: at least a portion of the inner engagement surface adapted to conform to the distal or lower portion of the tibia of a patient, the longitudinal axis of the patient, and the direction for forming said single saw cut.",
"According to certain embodiments, the at least one hole of said drill guide is configured to guide the drilling in a direction at an angle or within an angle range to the longitudinal tibial axis of a patient, wherein said angle or angle range is within the angle range of 50-70 degrees to the longitudinal tibial axis of a patient.",
"According to certain embodiments, the at least one hole of said drill guide is configured to guide the drilling in a direction along a straight line at an angle 3 at 60 degrees, or close to 60 degrees, to the longitudinal tibial axis of a patient.",
"According to certain embodiments, the at least one hole of the drill guide is configured to guide drilling in a direction at an angle or within an angle range to the direction for forming said single saw cut, wherein said angle or angle range is within the angle range of 80-100 degrees to the direction for forming said single saw cut.",
"According to certain embodiments, the at least one hole of the drill guide is configured to guide drilling in a perpendicular direction, or close to 90 degrees, with respect to the direction for forming said single saw cut.",
"According to certain embodiments, the slit, or opening, for guiding a saw cutting tool is configured to guide a saw cutting tool to form a single saw cut at an angle or within an angle range to the longitudinal tibial axis of a patient, wherein said angle or angle range is within the angle range of 15-50 degrees to the longitudinal tibial axis of a patient.",
"According to certain embodiments, the slit, or opening, for guiding a saw cutting tool is configured to guide a saw cutting tool to form a single saw cut in a direction at a 30 degrees angle, or close to 30 degrees, to the longitudinal tibial axis of a patient.",
"In certain example embodiments, the saw guide further comprises an opening forming an inspection window adapted to allow visual inspection of how well the saw guide conforms to the distal or lower portion of the tibia of a patient, thereby facilitating adjustment of the positioning of the saw guide to provide for a correct positioning of the saw guide to the distal or lower portion of the tibia of the patient, to provide for both a more precise saw cutting procedure and a more precise drilling procedure.",
"The technology disclosed further provides a surgical kit including the saw guide according to any of the embodiments described above.",
"In certain aspects, the surgical kit includes fixation means in form of e.g.",
"screws such as e.g.",
"titanium screws, which have dimensions and a certain length configured to allow for a correct refixation of the temporarily removed bone fragment, e.g.",
"the fixation means have a length corresponding to, or adapted to, the depth of the holes pre-drilled through the bone fragment and beyond the saw cutting plane into the inner portions of the tibia.",
"In other example embodiments, the surgical kit of the present disclosure may include a verification tool, or depth meter tool, having a depth stop designed to be engaging a powertool, used for the saw cutting procedure, at a specific depth, to prevent insertion of saw cutting blades into the slit of the saw guide that cut beyond a certain length.",
"In the verification process, the saw attachment and sawblade are first attached to the powertool and the depth meter is used for verifying that the selected sawblade has the correct dimension for a designed saw guide.",
"In other embodiments related to the example use of the technology disclosed in the surgical treatment by the implantation of an implant into a second bone structure, e.g.",
"by resurfacing of an implant into the dome of the talus, the surgical kit of the present disclosure may include a hollow tubular shell suitable for guiding correct preparations such as implant pre-drilling at the surgical site of the talus dome.",
"In these embodiments, the surgical kit of the present disclosure may also include different sockets adapted to be positioned in the hollow tubular shell.",
"One such socket is a pin socket configured with a steering hole in the form of a through hole.",
"The pin socket, when positioned in said hollow tubular shell, provides mechanical support and directional guidance for vertical drilling through said steering hole and into the articular surface of the second bone structure, creating a steering hole for further drilling to remove cartilage and bone to prepare the site for implantation of an implant.",
"In some embodiments, the pin socket, when positioned in said hollow tubular shell, may provide mechanical support and the directional guidance for vertical drilling through the steering hole of the pin socket and into the articular surface of a joint to form a steering hole in the articular surface of a joint for further drilling to remove cartilage and bone to prepare the site for implantation of an implant.",
"In example embodiments, the pin socket, when positioned in said hollow tubular shell, provides mechanical support and directional guidance for vertical drilling through said steering hole and into the dome of the talus, creating a steering hole for further drilling to remove cartilage and bone to prepare the site for implantation of an implant into the dome of the talus.",
"Two other sockets; a drilling socket and an adjustment socket, may further be used in the process of removing a portion of the talus bone for creating a recess for the implant, preceding hammering of the surgical implant into place in the talus dome.",
"When the pre-drilling through the steering hole of the pin socket has been performed, the drilling socket is mounted into the hollow tubular shell and the drilling operation continues until the drill stops at the top of the drilling socket.",
"The drilling guide is removed and the adjustment socket is instead inserted into the hollow tubular shell.",
"When inserting the drill into the adjustment socket, the drill is inserted into the pre-drilled hole.",
"Preferably, the drill body should not be in contact with the cartilage surface when the drilling starts.",
"The drilling into the talar dome continues until the drill stops at the top of the adjustment socket.",
"A flushing device and suction may be used to cleanse the drilled hole.",
"For the final placement of the implant into the drilled hole, a mandrel and/or a hammer may be used to gently tap down the surgical implant into the bone until bottomed.",
"In certain example embodiments, the surgical kit may, in addition to the various embodiment of a saw guide described in this disclosure, also include at least one of a surgical implant, a dummy implant, a drill, a mandrel and a hollow tubular shell used for drilling of the damaged area on the articular surface of a second bone structure in the surgical procedure of implantation of resurfacing inlay implants.",
"The technology disclosed further proposes a method for designing a saw guide comprising the above-mentioned technical features.",
"The method for designing the saw guide includes the designing of a saw guide which comprises as integral parts both a slit configured to guide the saw cutting in a first direction and a drill guide having at least one hole configured to guide the pre-drilling in a second direction different from the first direction.",
"In certain embodiments, the technology disclosed proposes a method for designing any of the above-mentioned embodiments of a saw guide which includes a step for designing the at least portion of the surface of the inner engagement surface adapted to conform to the distal or lower portion of the tibia of a patient to be individually patient customized on the basis of radiologically obtained patient data, such as MR, CT or X-ray imaging.",
"In certain embodiments, the technology disclosed proposes a method for designing any of the above-mentioned embodiments of a saw guide which includes a step for designing the placement and orientation of the at least one hole of the drill guide to be individually patient customized on the basis of radiologically obtained patient data, such as MR, CT or X-ray imaging.",
"In certain embodiments, the technology disclosed proposes a method for designing any of the above-mentioned embodiments of a saw guide which includes a step for designing the placement and orientation of the slit, or opening, to be individually patient customized on the basis of radiologically obtained patient data, such as MR, CT or X-ray imaging.",
"In other embodiments, the technology disclosed proposes a method for designing any of the above-mentioned embodiments of a saw guide which includes a step for designing the at least one hole of the drill guide, said at least one hole having a certain orientation and position on the saw guide, to be individually patient customized on the basis of radiologically obtained patient data, such as MR, CT or X-ray imaging, in that the drilling direction provided by the position and orientation of the at least one hole is designed to have a patient customized angle relationship to at least one of the distal or lower portion of the tibia of a patient and the longitudinal axis of the patient.",
"In yet other embodiments, the technology disclosed proposes a method for designing any of the above-mentioned embodiments of a saw guide which includes a step for designing the slit, or opening, to be individually patient customized on the basis of radiologically obtained patient data, such as MR, CT or X-ray imaging, in that the saw cutting direction, and thereby also the saw cutting plane, provided by the position and orientation of said slit is designed to have a patient customized angle relationship to at least one of the distal or lower portion of the tibia of a patient and the longitudinal axis of the patient.",
"In yet other embodiments, the technology disclosed proposes a method for designing any of the above-mentioned embodiments of a saw guide which includes at least one step for designing both the saw cutting direction provided by the position and orientation of said slit, or opening, and the drilling direction provided by position and orientation of the at least one hole of the drill guide to have a patient customized angular relationship to at least one of the distal or lower portion of the tibia of a patient and the longitudinal axis of the patient.",
"Thus, the above-mentioned saw guide comprises as integral parts both a slit configured to guide the saw cutting in a first direction and a drill guide having at least one hole configured to guide the predrilling in a second direction different from the first direction.",
"The technology disclosed enables the design of a saw guide comprising at least one hole of a drill guide having a fixed physical relationship to a slit suitable to be used for saw cutting, i.e.",
"both a positional and angular relationship between the at least one holes of the drill guide and the saw cutting slit, thereby enabling the design of a saw guide having a fixed angular relationship between the angle direction of the saw cutting provided by the guidance direction of the slit and the angle direction for predrilling of the at least one fixation hole provided by the guidance direction of the at least one hole of the drill guide.",
"In certain embodiments of the technology disclosed, this fixed angular relationship (between the guidance direction for the saw cutting direction provided by the orientation of the slit and the guidance direction of the predrilling of the at least one fixation hole provided by the at least one hole of the drill guide of the at least one fixation hole) is individually patient customized on the basis of radiologically obtained patient data, such as MR, CT or X-ray imaging.",
"The thickness, or depth, of the slit and the dimensions and/or shape of the slit area of the slit, i.e.",
"the longitudinal length and width of the slit area, may also be designed to be adapted and optimized to the length, width, and/or shape of a certain type of sawblade selected for the saw cutting procedure.",
"The dimensions and/or depth/height of the portion of the saw guide which comprises the slit may be customized based on the sawblade selected.",
"In certain embodiments, the osteotomy and the surgical tools used, e.g.",
"the design of the saw guide, can be adapted to the selected treatment of the damage, e.g.",
"the damaged portions of a talus.",
"The design of the saw guide may be based on both radiologically obtained patient data, such as MR, CT or X-ray imaging, and at least one of the selected type of treatment of the damaged area and, optionally, the size and location of the osteotomy.",
"As an example, a drill guide, e.g.",
"in form of a hollow tubular shell used for the implantation of a surgical implant, which has larger dimensions or a larger diameter, may require more space which in turn may require a larger osteotomy and the use of a saw guide that is designed for a larger osteotomy.",
"A hollow tubular shell is designed to cover with its hollow part the damaged area of the talus to be repaired and is used for supporting the drilling on the talus dome, providing for a bore which is used for insertion of a surgical implant into the talus.",
"In certain embodiments, the technology disclosed may generally provide for patient-specific surgical kits including patient-specific saw guides and associated tools and components for use in osteotomy, low tibial or medial malleolar osteotomy, for example.",
"The patient-specific saw guides can be used either with conventional or patient-specific implant components prepared with computer-assisted image methods.",
"Computer modeling for obtaining three dimensional images of the patient's anatomy using MRI or CT scans of the patient's anatomy, and the patient-specific guides and templates can be provided by various CAD programs and/or software available.",
"In example embodiments, the patient-specific saw guides and associated patient-specific openings, holes and/or slits disclosed herein can be generally formed using computer modelling based on the patient's three-dimensional anatomic image generated from image scans.",
"In specific embodiments, the design of the patient-specific saw guide and associated patient-specific openings, holes and/or slits disclosed herein may also be determined partly based on the patients three-dimensional anatomic image generated from image scans and partly on other requests, e.g.",
"concerning the size and location of the osteotomy, which may be requested by the surgeon performing the osteotomy.",
"The patient-specific saw guides can have a three-dimensional inner engagement surface that is made to at least partly conformingly contact and match a three-dimensional image of the patient's bone surface, by the computer methods discussed above.",
"In certain aspects of the technology disclosed, the patient-specific saw guide may also include customized guiding formations, such as a patient-customized drill guide and/or a patient-customized slit, or opening.",
"In various embodiments, the patient-specific saw guide comprises a slit, e.g.",
"a patient-specific slit, for receiving and guiding a cutting blade at certain cutting plane orientations, e.g.",
"relative to a selected anatomic axis for the specific patient.",
"The patient-specific saw guide can also include drill guide formations and at least one hole for guiding the drilling, or predrilling, associated with the osteotomy procedure, at specific drilling orientations, e.g.",
"relative to a selected anatomic axis of a specific patient.",
"The geometry, shape and orientation of the various features of the patient-specific saw guide, as well as various patient-specific implants and other patient-specific tools that optionally may be used together with the saw guide according to certain example embodiments of the technology disclosed, can be determined during the pre-operative planning stage of the procedure in connection with the computer-assisted modelling of the patients anatomy.",
"In example embodiments of the technology disclosed, the saw guide may be individually made specific to the patient's specific anatomy and to the specific damage to the second bone structure, possibly through the following saw guide design steps: a. identifying a damage of a second bone structure through radiological images such as MR, CT or X-ray images or through arthroscopy; b. planning the size and the location of an osteotomy needed to get access to the second bone structure to perform a specific treatment of the damage; c. creating a virtual 3D model of at least one of a first and the second bone structure from radiological images such as MR, CT or X-ray images; and d. virtually designing a patient specific osteotomy guide based on the 3D model of at least one of the first and second bone structure and the size and location of the osteotomy needed.",
"In various embodiments, the surgical saw guide may be manufactured by a 3D printing process in which material is joined or solidified under computer control to create the surgical saw guide.",
"The method of manufacturing by a 3D printing process may include building the surgical saw guide from computer-aided design (CAD) data by successively adding material layer by layer.",
"The CAD data may further be based on a virtually designed patient specific osteotomy saw guide based on the 3D model of the at least portion of the first bone structure and the size and location of the osteotomy needed.",
"According to example embodiment, the above method of manufacturing the saw guide in a 3D printing process may be preceded by the following steps of virtually designing a patient specific osteotomy saw guide: a. identifying at least one of a bone and a cartilage damage of the second bone structure through radiological images such as MR, CT or X-ray images; b. planning the size and the location of an osteotomy needed to get access to the second bone structure in the surgical treatment of said at least one of a bone and cartilage damage of the second bone structure; c. creating a 3D model of at least portions of at least one of a first bone structure and the second bone structure from radiological images such as MR, CT or X-ray images; and d. virtually designing a patient specific osteotomy saw guide based on the 3D model and the size and location of the osteotomy needed.",
"In various embodiments, a surgical saw guide configured to be used for an osteotomy of a part of distal tibia for access to the medial talar dome of the ankle joint is manufactured by a 3D printing process in which material is joined or solidified under computer control to create the surgical saw guide.",
"The method of manufacturing of the saw guide for an osteotomy of a part of distal tibia by a 3D printing process may include building the surgical saw guide from computer-aided design (CAD) data by successively adding material layer by layer.",
"The CAD data may further be based on a virtually designed patient specific osteotomy saw guide based on the 3D model of the at least portion of the first bone structure and the size and location of the osteotomy needed.",
"According to example embodiment, the above method of manufacturing a saw guide suitable for an osteotomy of a part of distal tibia in a 3D printing process may be preceded by the following steps of virtually designing a patient specific osteotomy saw guide: a. identifying at least one of a bone and a cartilage damage of the talus through radiological images such as MR, CT or X-ray images; b. planning the size and the location of an osteotomy needed to get access to the dome of the talus in the treatment, e.g.",
"surgical treatment, of said at least one of a bone and cartilage damage of the talus; c. creating a 3D model of at least portions of at least one of the tibia and talus from radiological images such as MR, CT or X-ray images; and d. virtually designing a patient specific osteotomy saw guide based on the 3D model and/or the size and location of the osteotomy needed.",
"In example embodiments, the technology disclosed may be used with a surgical method comprising at least some of the following steps: a. attaching a three-dimensional engagement surface of a patient-specific saw guide to a corresponding surface of a tibia of a patient for whom the saw guide is customized by computer imaging during a pre-operative planning stage, the three-dimensional engagement surface conforming as a negative surface to the corresponding surface of the patient's tibia; b. drilling, or predrilling, at least one fixation hole through the tibia bone; c. making a partial bone cut in the tibia through an opening of the saw guide, the slot oriented at a patient-specific angle relative to an anatomic axis of the patient, the angle custom-selected during the pre-operative planning stage for correcting the patient's anatomy; d. loosening, by use of an osteotome, a bone segment defined by the partial bone cut; e. removing the bone segment, or cut out piece of the tibia, to obtain access to the dome of the talus; f. drilling a hole in the dome of the talus for the peg and the shallow hole for the cap of an implant; g. inserting an implant into the dome of the talus; and h. refixating the bone fragment in its original position with the aid of surgical screws inserted into the pre-drilled holes.",
"The patient-specific osteotomy kit of the technology disclosed may also include patient-specific fixation means in form of e.g.",
"screws such as titanium screws, which have a certain diameter and a certain length configured to allow for a correct, or predetermined, refixation of the temporarily removed bone fragment, e.g.",
"a length corresponding or adapted to the depth of the holes predrilled through the bone fragment and beyond the saw cutting plane into the inner portions of the tibia.",
"The osteotomy surgical kit can also include saw blades configured to allow for a predetermined cutting length corresponding to a cutting depth, in order to avoid unintentionally sawing too deep and thereby damaging the articular surface of the talar dome.",
"The cutting depth can be determined at the pre-operative planning stage.",
"In various other embodiments, the cutting depth of the selected sawblade can be verified using a separate verification tool, e.g.",
"a depth meter tool, which may e.g.",
"have a depth stop.",
"The cutting depth can also be verified by a separate depth meter verification tool having a depth stop with a certain depth adapted to be engaging a powertool at a specific depth and.",
"preventing insertion of sawblades that cut beyond a certain depth.",
"Thus, the depth meter verification tool can be used for verifying that the sawblade is restricted to saw cutting to a pre-determined cutting depth which may be patient-specific and determined on the basis of radiologically obtained patient data, such as MR, CT or X-ray imaging.",
"In the verification process, the saw attachment and sawblade are first attached to the powertool and a verification tool, or depth meter tool, is used to verify that the selected sawblade has the correct dimension for the saw guide.",
"The verification tool is configured with a depth stop designed to be engaging the powertool at a specific depth to prevent insertion of sawblades into the slit of the saw guide that cut beyond a certain length.",
"In example embodiments, the verification process using the depth meter verification tool includes at least some of the following steps: The surgeon selects a sawblade that is either commonly used for a specific osteotomy procedure, and/or the surgeon believes have the desired dimensions, The dimensions of the sawblade selected by the surgeon are uploaded together with radiologically obtained patient data to the system used for designing the saw guide, The saw guide is designed based on the uploaded dimensions of the sawblade and the radiologically obtained patient data, Prior to performing surgery, the surgeon uses a verification tool in form of an osteotomy depth meter to verify that the selected sawblade has the correct or desired dimensions for the designed saw guide.",
"The size and dimension of the portion of the saw guide which comprises the saw cutting slit, and which may correspond to or define the depth of the slit, may be designed to be adapted to the length of the sawblade as the powertool, to which the sawblade is attached, engages and stops at the upper surface of the portion of the saw guide.",
"In certain example embodiment of the method for designing the saw guide, the dimensions, e.g.",
"the depth/height, of the portion of the saw guide comprising the slit may be customized based on the sawblade selected.",
"BRIEF DESCRIPTION OF DRAWINGS Embodiments of the disclosure will now be described in more detail with reference to the appended drawings, wherein: FIG.",
"1 shows a skeletal view of the foot with ligaments, to illustrate the area of use of the disclosure.",
"FIG.",
"2 shows the same skeletal view as FIG.",
"1 with a saw guide mounted in place.",
"FIG.",
"3 shows the saw guide of the disclosure and which is included in the kit according to the disclosure.",
"FIG.",
"4 shows different views of the saw guide according to the disclosure mounted in place on the distal medial end of the left tibia.",
"FIG.",
"5 shows a view from another angle with the saw guide 1 mounted in place and more clearly showing the three guide surfaces 2, 3, 4 used for precision cutting a quadrant section of the tibia.",
"FIG.",
"6 shows the saw guide in use in making a transverse cut with surgical saw.",
"FIG.",
"7 shows a view of the talocrural area with the sawn out corner block of the tibia folded out to expose the talus dome.",
"FIGS.",
"8A and 8B show the hollow drill guide included in the surgical kit according to the disclosure.",
"FIG.",
"9 shows the drill guide mounted in place on the talus dome.",
"FIG.",
"10 shows a patient customized talus implant.",
"FIG.",
"11 shows the talus implant hammered into place in the talus dome, replacing the damaged surface of the talus joint.",
"FIG.",
"12 shows a visualization of a saw guide placed on the distal tibia of a patient, according to one or more embodiments.",
"FIG.",
"13 shows the same example saw guide placed on the distal end of the tibia as FIG.",
"12, but from a different angle, according to one or more embodiments.",
"FIG.",
"14 shows the same example saw guide placed on the distal end of the tibia as FIG.",
"12, but from a different angle, according to one or more embodiments.",
"FIG.",
"15a illustrates an example embodiment of the technology disclosed where the osteotomy saw cut is made at a 30 degrees angle to the longitudinal tibial axis and the drilling of fixation holes is made at a 60 degrees angle to the longitudinal tibial axis.",
"FIG.",
"15b illustrate the example embodiment of an osteotomy of FIG.",
"15a and the refixation of the temporarily removed bone fragment at approximately a 60 degrees angle to the longitudinal tibial axis, by the use of fixation means such as e.g.",
"at least one screw.",
"FIG.",
"16a shows a saw guide attached and secured to its position on the tibia, according to one or more embodiments of the technology disclosed.",
"FIG.",
"16b shows the saw guide where the chuck and designated drill are attached to the power tool, for drilling of the drill holes, according to one or more embodiments.",
"FIG.",
"16c shows the saw guide where a sagittal saw attachment and sawblade are attached to the powertool and the sawblade is inserted into the saw guide, according to one or more embodiments.",
"FIG.",
"16d illustrates a later stage in the osteotomic procedure when both the surgical pins and the saw guide have been removed, and an osteotome is applied for final loosening of the bone segment, according to one or more embodiments.",
"FIG.",
"17 shows a pin socket positioned in said hollow tubular shell, according to one or more embodiments of the technology disclosed.",
"FIG.",
"18 shows a verification tool, or depth meter tool, for verifying that the correct sawblade has been selected, according to one or more embodiments.",
"FIG.",
"19 is a process flow diagram showing the steps of an osteotomic procedure used, according to one or more embodiments of the technology disclosed.",
"DETAILED DESCRIPTION The inventors have identified a need for an improved procedure and improved tools aimed at addressing problems related to the technical difficulties of performing a successful oblique osteotomy, such as an oblique medial malleolar osteotomy.",
"These difficulties include sawing at a precise angle that allowed refixation of the distal fragment without creating an articular incongruence, and, for the example embodiment of a medial malleolar osteotomy, identifying the intersection between the tibial plafond and medial malleolus.",
"The technical difficulties that the inventors have identified need to be addressed also include the difficulty of reduction and potential for malunion because apposition may not be collinear with respect to the osteotomy cut.",
"In the example embodiment of a medial malleolar osteotomy, an incongruent joint fixation after refixation of the removed piece of the tibia could lead to secondary osteoarthritis of the ankle joint.",
"The longitudinal, or long, tibial axis can serve as an intraoperative reference to direct the osteotomy.",
"This axis is commonly used for several orthopedic procedures, including total knee arthroplasty and high tibial osteotomy.",
"The technology disclosed is aimed at providing a more reliable osteotomy procedure by providing the surgical tools enabling a more precise and reliable alignment and identification of desired, or optimal, angles for saw cutting and refixation of the bone fragment, which would be helpful for use during surgery.",
"In this connection, the inventors of the technology disclosed have identified a need for improved surgical tools designed for aiding the surgeon in properly performing the saw cutting and refixation of the removed bone fragment at the desired angles relative certain anatomic landmarks, e.g.",
"the long tibial axis A, including improved tools for aiding the surgeon to perform these tasks in a precise and reliable manner, for optimized resulting osteotomy and to minimize the risks for complications.",
"FIG.",
"1 shows, to show the area of use of the present disclosure, the skeletal foot of a patient to receive a customized surgical implant to repair the condylar dome surface of the talus.",
"The bones and ligaments of the area of the foot where the kit according to the disclosure is to be used constitute, of course, no part of the present disclosure and are therefore labelled with letters.",
"The lower medial end of the tibia a is shown as well as the talus b and, schematically, the medial deltoid ligaments c covering this joint and attached to the malleolus a1.0 indicates purely schematically the tendons of the flexor digitorum longus and the flexor hallucis longus.",
"d indicates the superior extensor retinaculum.",
"FIG.",
"2 shows the same view as FIG.",
"1 but with a saw guide 1 in a surgical kit according to the disclosure mounted in place on the distal end of the tibia a using pins 5a.",
"The superior extensor retinaculum d shown in FIG.",
"1 is not shown in this figure.",
"It has been pulled down out of the way of the saw guide using a surgical hook, without any need to cut into this retinaculum.",
"FIG.",
"3 shows alone the saw guide 1 of the kit according to the disclosure.",
"Each saw guide is customized via imagery of the patient's tibia through e.g.",
"MRI, CT or X-ray.",
"Each saw guide has surfaces 6a-c conforming to the particular patient's tibia.",
"One of the surfaces 6a is longer to cover the malleolus.",
"In this embodiment, the saw guide 1 provides three saw guide surfaces 2, 3, 4, respectively, in the sagittal, coronal and transverse planes respectively.",
"Two pin holes 5 are provided for securing the saw guide in place on the tibia.",
"The saw guide is individually made specific to the patient's specific anatomy and to the specific damage to the talus, possibly through the following saw guide design steps: a. identifying a subchondral damage of the talus dome through radiological images such as MR, CT or X-ray images or through arthroscopy.",
"b. planning the size and the location of an osteotomy needed to get access to the talar dome in order to treat the subchondral damage c. creating a 3D model of the tibial bone from radiological images such as MR, CT or X-ray images d. virtually designing a patient specific osteotomy guide based on the 3D model of the tibial bone and the size and location of the osteotomy needed.",
"FIG.",
"4 is a close-up view of the saw guide put in place on the lower end of the tibia in an initial stage of the procedure utilizing the kit according to the disclosure.",
"The skin has first been pulled away exposing the anterior medial area of the tibia where the patient customized saw guide is to be mounted.",
"Pins 5a are driven into the bone through the pin holes 5 at different angles to fix the saw guide securely in place.",
"FIG.",
"5 shows a view from another angle with the saw guide 1 mounted in place and more clearly showing the three guide surfaces 2, 3, 4 used for precision cutting a quadrant section of the tibia to expose the dome of the talus.",
"FIG.",
"6 shows use of a surgical saw 7 to make a transverse cut along the guide surface 4 using inserted pins 5a to prevent the cut from penetrating deeper than intended.",
"A form-fitting thin talus guide (not shown) is slipped in between the tibia and the talus to protect the talus as cuts are made along the guide surfaces 2 and 3.The quadrant section of the tibia is finally removed by a flat surgical chisel cutting any remaining bone material in the inner corner.",
"Referring now to FIG.",
"7, the sawn out bone quadrant of the tibia is then folded forwardly and outwardly taking care not to damage the medial deltoid ligaments c continually attached between the bone quadrant of the tibia and the talus b.",
"The talus dome is thus exposed.",
"The dome area to be repaired with the implant is labelled b1.FIGS.",
"8A and 8B show alone one exemplary drill guide 10 in the kit according to the disclosure.",
"A drill sleeve (not shown) is inserted into the hollow center of the drill guide, fitting into the height adjustment sprockets 12 at the top of the interior 11 of the drill guide.",
"The lower surfaces of the drill guide conform to the condylar surfaces of the talus which are to be provided with a replacement implant.",
"A saddle shaped flange 15 conforming to the ridge of the talus dome of the particular patient extends from the drill guide cylinder.",
"The flange has medial and lateral pin holes, 14a and 14b respectively, for securely mounting the drill guide in place on the talus dome.",
"It is also possible, in a non-limiting embodiment, to provide the saddle shaped flange 15 with a downwardly bent corner portion or hook 16, disposed at the lateral pin hole 14b.",
"This corner hook portion 16, which is most visible in FIG.",
"8B, is designed to help in correctly positioning and anchoring the drill guide on the neck of the talus b.",
"The entire drill guide and in particular the surface of the saddle shaped flange 15 is individually dimensioned to the patient's talus.",
"The saw guide 1 is dimensioned to provide, with only three saw cuts a tibia quadrant piece which when folded out provides enough space for the drill guide 10 and for vertical downward drilling so that the peg will be mounted coaxial or close to coaxial to the downward forces exerted, when walking, by the end of the tibia against the implant, with no lateral forces tending to dislodge the implant over time.",
"FIG.",
"9 shows the drill guide fixed in place on the dome of the talus.",
"Just a large enough quadrant section of the tibia has been sawn out to make room for the drill guide and the room needed to use the guide, now placed directly over the area of the talus to be repaired.",
"The drill guide is also directed so as to provide the correct angle for the peg of the implant so that the angle of the peg ideally is aligned with the forces exerted by the tibia when walking.",
"FIG.",
"10 shows in detail a patient customized implant 20 made in a biocompatible metal, metal alloy or ceramic.",
"More specifically it may comprise any metal or metal alloy used for structural applications in the human or animal body, such as stainless steel, cobalt-based alloys, chrome-based alloys, titanium-based alloys, pure titanium, zirconium-based alloys, tantalum, niobium and precious metals and their alloys.",
"If a ceramic is used as the biocompatible material, it can be a biocompatible ceramic such as aluminium oxide, silicon nitride or yttria-stabilized zirconia.",
"The implant has typically a cap diameter of 12 or 17 mm or even 20 mm, but may also assume other diameters within this range.",
"The implant has a cap 21 having a top surface 22, comprises a cobalt chrome alloy (CoCr) or stainless steel, diamond-like carbon or a ceramic and the top surface 22 has been custom surfaced to match the undamaged talus dome of the particular patient.",
"The implant has a cap 21 with on its outside a new joint surface and on its inside, in this particular embodiment, a bone facing surface with a ridge 24 which lodges in a drilled groove as will be explained below.",
"Extending downwardly perpendicularly and centrally from the cap 21 is a mounting peg 23, for insertion into a hole drilled in the talus dome.",
"This individually shaped implant can be made on the basis of CT-scans, MR-imaging or X-ray images, by the method described in Application No.",
"PCT/EP2014/064749.FIG.",
"11 shows the implant 20 in its final placement after being hammered down into its hole, whereby the peripheral rim around the lower surface of the cap lodges in a groove in the hole in the talus.",
"The cut out tibia bone quadrant piece g is still folded out.",
"The quadrant piece g is then folded back into its original position and screwed into place preferably using two titanium screws into either vertical surface.",
"According to a preferred operational method, the two screw holes are pre-drilled through the quadrant piece and into the tibia, before the saw cuts are made to make sure that the tibia quadrant piece will be remounted in exactly its original position.",
"FIG.",
"12 shows a saw guide 100 placed on an example area of use of the technology disclosed in form of the lower tibia of a patient to receive surgical treatment to repair the condylar dome surface of the talus.",
"The bones and ligaments of the area of the foot where the kit and saw guide according to the disclosure is to be used constitute, of course, no part of the present disclosure and are therefore labelled with letters.",
"The lower medial end of the tibia 200 is shown as well as the malleolus 300.FIGS.",
"13 and 14 show the same example saw guide 100 placed on the distal end of the tibia as FIG.",
"12, but from a different angle.",
"FIGS.",
"15a and 15b illustrate an example embodiment of the technology disclosed aiming at avoiding an articular step off after refixation through predrilled fixation holes 410, screw holes.",
"FIG.",
"15a illustrates that, after predrilling the fixation holes 410, or screw holes, at 60 degrees angle β in relation to the long tibial axis A, the osteotomy is made at 30 degrees angle in relation to the long tibial axis A.",
"In FIG.",
"15a, the single saw cut is made in a direction B, or axis B, at an angle φ relative to the reference axis A in form of the longitudinal tibial axis, and the drilling is made in a direction C, at an angle β relative to the longitudinal tibial axis.",
"FIG.",
"15b illustrates that the introduction of the compression screws through the predrilled holes, which are illustrated in FIG.",
"15a, will result in a smooth joint surface.",
"The single saw cut may be selected at an angle φ relative to a selected reference axis A, another angle direction defined by the saw guide or at least a portion of surface of the saw guide or the patient.",
"In the example embodiment of the technology disclosed illustrated in FIGS.",
"15a and 15b, the reference axis A is in form of the longitudinal tibial axis of a patient and, in this example, the single saw cut is made in a first direction B at an angle φ which is 30 degrees in relation to the longitudinal tibial axis A.",
"In this example, the drilling, or pre-drilling, of the at least one fixation hole is made in a second direction C at a second angle which is 60 degrees in relation to the long tibial axis A.",
"In this example of the technology disclosed, the first angle φ and the second angle β to the longitudinal axis A have a sum of 90 degrees.",
"The saw guide according to example embodiments of the technology disclosed is provided with a drill guide comprising at least one hole which is configured with an orientation adapted to guide drilling in a perpendicular direction, or close to 90 degrees, with respect to the direction for forming said single saw cut.",
"The first reference axis A can also be another selected anatomic axis.",
"Other anatomic axes, such as axes having significantly different orientations than the orientation of axis A illustrated in FIGS.",
"15a and 15b, can be used as reference axes.",
"The saw guide 100 according to embodiments of the technology disclosed comprises, as an integral part, a drill guide 130 having at least one hole 140 with a certain diameter, depth, orientation and position on the saw guide to thereby be adapted for guiding the drilling in a direction at a precise and desired or optimal angle, e.g.",
"relative the long tibial axis A, and which thereby has the additional advantage of preserving the deltoid ligament that originates more distally yet avoiding screw placement that can cause disruption of the deltoid ligament.",
"A surgical kit including a saw guide comprising a drill guide 130 according to the technology disclosed makes this possible in a precise and reliable manner, providing for a precise and reliable predrilling operation which would be almost impossible to achieve with a free-hand predrilling procedure, or when the saw cutting procedure and the predrilling and refixation procedure are essentially two separate procedures which are not strongly linked to each other.",
"The surgical kit according to the disclosure may, in addition to the saw guide 100, be comprised of fixation screws 420 with dimensions, a diameter and a length configured to be used for screwing through the at least one hole 140 of the drill guide 130 and sawblades 190 with dimensions, a diameter and a length suitable for saw cutting through the slit 120.In certain example embodiments, the surgical kit may, in addition to the saw guide 100 for assisting the surgeon in osteotomy procedure of a first bone structure, also include at least one of a surgical implant, a dummy implant, a drill, a mandrel and a second drill guide in form of a hollow tubular shell 620 used for drilling of the damaged area on the articular surface of a second bone structure in the surgical procedure of implantation of resurfacing inlay implants.",
"The mandrel may be used to gently tap down the surgical implant into the bone until bottomed.",
"The at least one hole 140 of the drill guide 130 may be used to guide the predrilling of at least one fixation hole to be used for refixation of the removed bone fragment after surgical treatment of e.g.",
"a bone fracture, a damaged cartilage and/or a tissue.",
"The predrilling of the at least one fixation hole has the purpose of facilitating the correct refixation of the bone fragment to the first bone structure.",
"The saw guide may further comprise at least one pin hole 150, or first opening, adapted to receive a fixation means 510, such as a pin, where the at least one pin hole 150 have an orientation adapted to guide the temporary fixation of the saw guide to the first bone structure of a patient.",
"The at least one pin hole 150, or first opening, is provided for securing the saw guide in place on the first bone structure during both the predrilling and the saw cutting.",
"The at least one hole 140 of the drill guide 130 may be used to guide the pre-drilling of at least one fixation hole 410 to be used for refixation of the removed bone fragment after surgical treatment.",
"The pre-drilling of the at least one fixation hole 410 has the purpose of facilitating the correct refixation of the bone fragment.",
"The at least one pin hole 150, or first opening 150, is provided for securing the saw guide 100 in place on the tibia during both the pre-drilling and the saw cutting.",
"In example embodiments of a method for designing the saw guide 100 suitable for use in osteotomy and the temporary osteotomic removal of a bone fragment of a first bone structure of a patient for exposing a second bone structure for surgical treatment, the portion 180 of the saw guide comprising said slit 120, or opening may be designed with a height that matches, or corresponds to, the length of the sawblade 190 to be used during sawing to thereby make the powertool 520 used during sawing stop against the top surface of the portion 180, thereby minimizing the risk of unintentionally sawing too far, e.g.",
"into the articular surface of the second bone structure.",
"In certain example embodiments, the dimensions of the portion 180 of the saw guide, e.g.",
"the height, may be customized, e.g.",
"via imagery of at least one of a first and second bone structure of the patient through e.g.",
"MRI, CT or X-ray and/or based on the sawblade selected.",
"As an example, the length of the sawblade and/or the thickness of the malleolus of a specific patient may be used to determine the height of the portion of the saw guide.",
"In accordance with certain aspects and in a preferred osteotomy procedure aimed at gaining access to the dome of the talus, a predrilling to create fixation holes to be used for refixation of the removed bone fragment is preferably performed before the saw cutting.",
"The pre-drilling is performed through and past the saw cutting plane B defining the bone fragment to be cut out and removed and into the bone therebehind, thereby creating predrilled fixation holes in the inner portions of the tibia bone which will remain in the inner portion of the tibia bone when the bone fragment is temporarily removed.",
"As of today, the saw cutting procedure and the predrilling procedure are essentially two separate procedures which are not strongly linked or interrelated to each other.",
"The slit, or opening, and the portion 180 of the saw guide comprising said slit, may be configured to be used to form a single saw cut in the removal of a bone fragment of the tibia to gain access to the medial talar dome of the ankle joint for a specific treatment of damage to the cartilage and/or bone of the talus.",
"In example embodiments of the technology disclosed, the portion 180 of the saw guide comprising said slit 120, or opening is designed with a height that matches, or corresponds to, the length of the sawblade 190 to be used during sawing to thereby make the powertool 520 used during sawing stop against said portion 180, thereby minimizing the risk of unintentionally sawing too far, e.g.",
"sawing into the articular surface of the talus.",
"The at least one hole of the drill guide of the above saw guide may be configured to guide the drilling, or pre-drilling, of at least one hole through the bone fragment, or piece of the tibia, to be removed, past the single saw cutting plane provided by the guidance of said slit 120 and into the inner portions of the tibia therebehind, thereby being adapted to provide for the pre-drilling of at least one fixation hole 410 which can be used for facilitating correct refixation of the removed bone fragment in its original, or substantially original, position after performed treatment, e.g.",
"surgical treatment, by the use of fixation means 420, e.g.",
"in the form of at least one screw.",
"The fixation means 420 are inserted through the bone fragment to be removed and into the inner portions of the tibia through the pre-drilled at least one fixation hole 410, thereby fixing the temporarily removed bone fragment to the inner portions of the tibia.",
"The size and dimension of the portion 180 of the saw guide 100 which comprises the saw cutting slit, and which may correspond to or define the depth of the slit 120, may be designed to be adapted to length of the sawblade 190 as the powertool 520, to which the sawblade 190 is attached, engages and stops at the top surface of the portion 180 of the saw guide.",
"In certain example embodiment of the method for designing the saw guide, the dimensions of the portion 180 of the saw guide 100 may be customized based on the sawblade selected.",
"The saw guide 100 is designed to improve the procedure for refixation of the bone fragment by providing improved surgical tools for a more precise and reliable procedure for the predrilling of at least one fixation holes past the bone fragment to be removed and into the bone therebehind.",
"The drilling, or predrilling, of the at least one fixation hole 410 has the purpose of facilitating the correct refixation of the temporarily removed bone fragment, thereby increasing the likelihood of preserving the deltoid ligament that originates more distally, yet reducing the risk for a drilling that can cause severing of any muscles, tendons and ligaments.",
"If the at least one fixation hole 410 is predrilled at a less desirable angle relative certain anatomic landmarks in a direction so that the at least one screw 420 is inserted either more horizontally or more vertically than optimal, an intra-articular step off might result.",
"A screw placement which is too vertical may also cause disruption of the deltoid ligament.",
"In this connection, an important aspect of the technology disclosed is that the predrilling of the at least one fixation hole 410 enables a correct positioning of the removed bone fragment in its correct original, or substantially original, position to create a congruent joint surface for better healing.",
"According to the technology disclosed, the predrilling at a desired position and angle direction relative an anatomy landmark of a patient is determined by the position for the placement of the saw guide 100 on the surface of a first bone structure, e.g.",
"the distal end of the tibia, and the fixed angular and positional relationship between the position and orientation of the slit 120 on the saw guide 100 and the position and orientation of the at least one hole 140 of the drill guide 130 on the saw guide 100.The saw guide 100 according to the technology disclosed, having a drill guide 130 with its at least one hole 140 as an integral part, thereby enables a precise and reliable positioning of the removed bone fragment in its original, or substantially original, position to create a congruent joint surface for better healing.",
"In certain embodiments of the technology disclosed, the inner engagement surface 160 and/or the fixed angular and positional relationship between the position and orientation of the slit 120 and the at least one hole 140 of the drill guide 130 of the saw guide 100 is patient-customized on the basis of radiologically obtained patient data, such as MR, CT or X-ray imaging.",
"The improved saw guide according to the technology disclosed comprises, as an integral part, a drill guide 130 having at least one hole 140 with a certain diameter, orientation and a position configured for guiding the drilling in a direction at a precise and optimum angle, e.g.",
"relative the long tibial axis A.",
"The introduction of a saw guide which comprises a drill guide as an integral part and thereby provides a fixed angular relationship between the orientation and position of the at least one hole of the drill guide and the engagement surface 160 of the saw guide and the orientation of the slit 120, or opening, for guiding the saw cutting enables a fast osteotomy procedure including a more precise and reliable predrilling operation.",
"A more precise and reliable predrilling operation gives the advantage of increasing the likelihood of preserving the deltoid ligament that originates more distally, yet avoiding screw placement that may cause disruption of the deltoid ligament.",
"The present disclosure further provides different method for designing a saw guide 100 having a drill guide 130 as an integral part and with a fixed angular and positional relationship between orientation and position of the at least one hole 140 of the drill guide 130 for guiding the direction of the drilling, or predrilling, and the orientation of the slot 120, or opening, for guiding the direction of the saw cutting.",
"Certain embodiments provide for a saw guide which comprises as integral parts both a slit configured to guide the saw cutting in a first direction and a drill guide having at least one hole configured to guide the predrilling in a second direction different from the first direction, where at least some of the features of the saw guide is individually patient customized on the basis of radiologically obtained patient data, such as MR, CT or X-ray imaging.",
"In certain embodiments, a method for designing a saw guide 100 is provided which comprises as integral parts both a slit 120 configured to guide the saw cutting in a first direction and a drill guide 130 having at least one hole 140 configured to guide the pre-drilling in a second direction different from the first direction, where at least some of the features of the saw guide are individually patient customized on the basis of radiologically obtained patient data, such as MR, CT or X-ray imaging.",
"In example embodiments, the method for designing the saw guide comprises designing the inner engagement surface 160 and/or the fixed angular and positional relationship between the position and orientation of the slit 120 and the at least one hole 140 of the drill guide 130 of the saw guide 100 to be patient-customized on the basis of radiologically obtained patient data, such as MR, CT or X-ray imaging.",
"According to certain example embodiments, the method includes designing the at least one hole 140 of the drill guide 130 to have a position and orientation on the saw guide 100 that guide the drilling, or pre-drilling, to be performed at a desired position and angle relative to other features of the saw guide and/or an anatomy landmark of a patient.",
"The method for designing a patient customized saw guide 100 based on radiologically obtained patient data, such as MR, CT or X-ray imaging may be used for at least one of determining a patient-unique inner engagement surface of the saw guide, the position for the placement of the saw guide 100 on the surface of a first bone structure, e.g.",
"the distal end of the tibia, and/or the fixed angular and positional relationship between the position and orientation on the saw guide 100 for the slit 120 and the position and orientation on the saw guide 100 for the at least one hole 140 of the drill guide 130.The patient-customized design of the saw guide 100 according of the technology disclosed, having a drill guide 130 with its at least one hole 140 as an integral part, thereby enables a precise and reliable positioning of the removed bone fragment in its original, or substantially original, position to create a congruent joint surface for better healing.",
"In certain embodiments of the technology disclosed, the inner engagement surface 160 and/or the fixed angular and positional relationship between the position and orientation of the slit 120 and the at least one hole 140 of the drill guide 130 of the saw guide 100 are patient-customized.",
"In certain embodiments, the present disclosure provides a surgical kit including a saw guide designed to improve the precision and reliability of the combined predrilling, saw cutting and refixation procedures of osteotomy used in surgical treatment.",
"In order to obtain a congruent joint surface after refixation, the osteotomy is preferably directed at an essentially perpendicular angle relation, or at least within an angle range of 60 to 90 degrees, to the articular surface of the tibia at the intersection between the tibial plafond and medial malleolus so that the saw cutting avoids all important tendons, muscles and ligaments as well as the anterior tibial artery.",
"According to certain aspects of the technology disclosed, the saw guide 100 is designed so that the osteotomy is aimed at 30 degrees relative to the long tibial axis, or at least within an angle range of 15-50 degrees relative to the long tibial axis A.",
"The saw cutting direction is then preferably essentially perpendicular, or at least within an angle range of 60 to 90 degrees, to the articular surface of the tibia and directed at the intersection of between tibial plafond and articular facet of the medial malleolus.",
"Applying this osteotomy direction minimizes the occurrence of a step off at the articular surface after reduction.",
"A medial malleolar osteotomy directed at 30 degrees relative to the tibial axis A enters the joint perpendicular to the tibial cartilage, and will likely result in a congruent joint surface after reduction.",
"The inventors of the technology disclosed have identified shortcomings associated with the currently used procedure of free-hand drilling and sawing cutting in that these two operations are not strongly linked to each other.",
"The osteotomy procedure used today therefore does not allow for sufficiently precise and reliable drilling and sawing cutting operations at desired positions and angles that allow for a sufficiently accurate refixation of the temporarily removed distal fragment without creating an articular incongruence.",
"An improved accuracy in the angle of the osteotomy and the direction of drilling relative to an anatomic landmark, e.g.",
"to the longitudinal tibial axis A or the articular surface of the tibia, would be helpful for use during surgery.",
"Currently used surgical tools for osteotomy do not provide for sufficiently precise and reproducible accuracy in the saw cutting and direction of drilling for fixating the saw guide 100, which can lead to severing of muscles and tendons creating exceptional and sometimes permanent problems.",
"Specifically, damage to muscles and tendons caused by the currently used surgical tools and inaccurate osteotomic procedure of free-hand drilling, i.e.",
"where the drilling direction for fixating the saw guide is not directly linked to the saw cutting plane B and/or the anatomy of the patient, may lead to severe problems as regard to repair and rehabilitation.",
"A saw guide 100 according to the technology disclosed, which in addition to a saw cut opening 120 adapted for providing saw cutting also comprises a drill guide that is an integral part of the saw guide, is configured to enable a precise and reproducible accuracy in the angle direction of drilling of the at least one fixation screw 420 along a straight line which would be almost impossible to achieve with prior art solutions where the drilling of the fixation screws is made by free-hand, or with an osteotomy where the saw cutting procedure and the predrilling and refixation procedure are essentially separate procedures which are not strongly linked to each other.",
"The inventive concept of the present disclosure, where the drill guide 130 with its at least one hole 140 is made an integral part of the saw guide 100 and thereby provides for a fixation of the saw guide at a fixed angle direction with respect to the saw cutting plane B provided by the saw cutting opening of said same saw guide, mitigates the risk for the osteomtomic procedure causing disruption of the deltoid ligament, or result in an incongruent joint surface after reduction.",
"According to certain embodiments, the saw guide 100 is patient customized via imagery of the patient's tibia through at least one radiological image, e.g.",
"an MRI, CT or X-ray image, thereby providing for a patient customized saw guide that have a surface conforming to a certain patient's tibia.",
"This patient customized saw guide may then preferably comprise both a saw cut opening adapted to guide the saw cutting in one saw cutting plane B only and a drill guide with at least one hole configured to provide for drilling in a direction, or along an axis C, at an angle to the one saw cutting plane B.",
"Because the surface of the saw guide is designed based on radiological images of the patient's tibia and both the saw cutting plane B and the direction for drilling provided by the saw guide may be set to be in a fixed angle relation to the patient customized saw guide surface, both the saw cutting plane B and the drilling direction may therefore be determined based on said at least one radiological image of the individual patient's tibia when said saw guide is placed in position and conforms to the articular surface.",
"In certain other aspects of the technology disclosed, at least one of the saw cutting opening providing for the saw cutting plane B and the at least one drilling hole 410 of the drilling guide providing for the direction for drilling at least one fixation means 420, or screw, for refixation of the saw guide to the tibia 200, may be determined based on at least one radiological image of the patient's tibia, e.g.",
"an MRI, CT or X-ray image.",
"In certain configurations of a patient customized saw guide and methods for designing such a saw guide, the saw cutting opening and the at least one drilling hole are both designed based on at least one radiological image of the patient's tibia in that a patient customized angle relationship between at least one of the one saw cutting plane B and the drilling direction along a straight line, or axis C, for fixating the saw guide to the tibia 200, is determined based on said at least one radiological image.",
"In yet another example of a saw guide and method for designing the saw guide according to the technology disclosed, at least one of the angle relation between the saw cutting plane B provided by the saw cutting opening to the longitudinal axis of the patient's tibia and the angle relation of the drilling direction to the longitudinal axis of the patient is determined based on said at least one radiological image of the patient.",
"Any severing of muscles and tendons to gain access to a second bone structure through an osteotomic procedure of a first bone structure will create exceptional and sometimes permanent problems as regards repair and rehabilitation.",
"It is thus necessary to expose the second bone structure by drilling the fixation holes and cutting out a portion of the first bone structure, under a number of difficult constrictions: avoiding all important tendons, muscles and ligaments and leaving them attached and intact, avoiding any arteries of the first bone structure, providing enough exposed space to correctly perform a surgical treatment of at least one of a bone and a cartilage damage of the second bone structure, making the drilling of the fixation holes and the sawing of the bone cut precise and correct on the first try, facilitating a correct refixation of the temporarily removed bone fragment in its original position for healing.",
"The anatomy of the talocrural area differs from that of e.g.",
"the knee in that it is very difficult for the surgeon to access the dome of the talus.",
"It is covered by the lower condylar surface of the tibia, as well as being encased by a many different muscles, tendons and ligaments.",
"Any severing of these muscles and tendons to gain access to the talus dome will create exceptional and sometimes permanent problems as regards repair and rehabilitation.",
"The longitudinal tibial axis A can serve as an intraoperative reference to direct the medial malleolar osteotomy.",
"This axis is commonly used for several orthopedic procedures, including total knee arthroplasty and high tibial osteotomy.",
"If a bone fragment in form of a piece of a first bone structure is sawn out to gain access for surgical treatment of a second bone structure, it is necessary that the bone be sawn precisely on the first try, so that the bone fragment, or bone segment, will fit precisely in place when put back and screwed in place.",
"For better healing and alignment, the single saw cut is preferably a partial cut, not a through cut.",
"It is also important that the drilling, or predrilling, of the fixation holes 410 is performed in a precise and reliable manner.",
"If a bone fragment in form of a piece of the lower tibia, or malleolus 300, is sawn out to gain access to the talus dome, it is necessary that the bone be sawn precisely on the first try, so that the bone fragment, or bone segment, will fit precisely in place when put back and screwed in place.",
"For better healing and alignment, the single saw cut is preferably a partial cut, not a through cut.",
"It is also important that the drilling, or predrilling, of the fixation holes is performed in a precise and reliable manner.",
"It is thus necessary to expose the talus dome by cutting out a portion of the lower medial tibia, under a number of difficult constrictions: avoiding all important tendons, muscles and ligaments and leaving them attached and intact, avoiding the anterior tibial artery, providing enough exposed space to correctly perform a surgical treatment of at least one of a bone and a cartilage damage of the talus dome, making the drilling of the fixation holes and the sawing of the bone cut precise and correct on the first try, facilitating a correct refixation of the temporarily removed bone fragment in form of a piece of the lower tibia, e.g.",
"a piece of the malleolus, in its correct position for healing.",
"As regards to the above-mentioned aspect of facilitating the replacement and fixation of the bone fragment, the inventors have identified that it is increasingly important to provide for a more precise and reliable procedure for the predrilling past the bone fragment to be removed and into the bone therebehind to thereby create fixation holes having the purpose of facilitating the correct refixation of the bone fragment after surgical treatment.",
"If the at least one fixation hole is predrilled at a less desirable angle relative certain anatomic landmarks in a direction so that the at least one screw 420 is inserted either more horizontally or more vertically than optimal, an intra-articular step off might result.",
"Vertical screw placement may also cause disruption of the deltoid ligament.",
"In order to obtain a congruent joint surface after fixation, the osteotomy cut is best directed perpendicular, or at least within an angle range of 60 to 90 degrees, to the articular surface of the tibia.",
"An osteotomy which is too vertical or horizontal may result in an incongruent joint surface or shortening of the malleolus 300 after fixation.",
"Furthermore, the fixation screws 420 should be directed essentially perpendicular, or within an angle range of 80-100 degrees, to the osteotomy plane.",
"The saw guide according to example embodiments is designed to achieve optimal compression and a congruent joint surface after surgical treatment of a damaged talus dome, i.e.",
"when the removed bone fragment of a tibia is remounted, the at least one screw 420 needs to be inserted at a precise angle relative to e.g.",
"the long tibial axis.",
"As mentioned above, the osteotomy may then preferably be directed essentially perpendicularly, or at least within an angle range of 60 to 90 degrees, to the articular surface of the tibia at the intersection between the tibial plafond and medial malleolus.",
"Furthermore, the fixation screws 420 should be directed essentially perpendicular, or within an angle range of 80-100 degrees, to the osteotomy plane.",
"According to a preferred method using the surgical kit and saw guide of the technology disclosed, the at least one screw hole 410, or fixation hole 410, is pre-drilled through the piece of the tibia and into the inner portions of the tibia, before the saw cuts are made to make sure that the tibia bone fragment will be remounted to its original, or substantially original, position.",
"Certain aspects of the technology disclosed is aimed at providing the guiding tools facilitating a more precise saw cutting and a predrilling which are both performed in directions at desired, or optimal, angles relative certain anatomic landmarks of a patient, e.g.",
"the long tibial axis.",
"In order to achieve optimal compression and a congruent joint surface after surgical treatment of the damaged talus dome, i.e.",
"when the removed bone fragment of the tibia is remounted, the at least one screw 420 needs to be inserted at a precise angle relative to e.g.",
"the long tibial axis.",
"According to a preferred method using the surgical kit and saw guide of the technology disclosed, the at least one screw hole 410, or fixation hole 410, is pre-drilled through the piece of the tibia and into the inner portions of the tibia, before the saw cuts are made to make sure that the tibia bone fragment will be remounted to its original, or substantially original, position.",
"An example surgical kit according to the technology disclosed, which is suitable for repair of articular surfaces in the talocrural joint, comprises: a.",
"A surgical implant having a cap with an outer surface conforming to a talus dome surface and an inner surface having a central implant anchoring peg extending perpendicularly from said inner surface, b.",
"A drilling guide, conforming to a talus dome surface, comprising a hollow tubular shell 620 suitable for supporting vertical drilling into the dome, c. A saw guide 100 configured to conform to the lower portion of a tibia and comprising an opening 120 suitable for insertion of a cutting saw and directed at an angle providing for only one single saw cut and a single saw guide surface in one plane, wherein said saw guide, when conforming to the lower portion of the tibia, is configured to provide for saw cutting at an angle direction to the longitudinal axis of the tibia suitable for osteotomy of a lower portion of a tibia to expose the dome of the talus, thereby providing access for a surgeon implanting said surgical implant into the talar dome, and wherein said saw guide further comprises, as integral part, a drill guide 130 having at least one hole(s) 140 configured to guide and provide for drilling by a drilling tool at an angle direction which is within a range of 80-100 degrees to the saw cutting direction provided by said opening.",
"The above surgical kit may further comprise at least one screw(s) 420 which is adapted to be used for drilling through said drill hole(s) 410, said screw hole(s) having a shape, dimensions and a length adapted for drilling through and past the at least portion of the malleolus 300 to be removed and into the inner portions of the tibia before the single saw cut is made so that at least one hole remains in the inner portions of the tibia after removal of both the at least portion of the malleolus 300 and the saw guide 100, wherein a portion of the at least one hole 410 remaining in the inner portions of the tibia made by the drilling operation can be used for remounting the temporarily removed at least portion of the malleolus 300 in its original, or substantially original, position.",
"The above surgical kit may further be designed so that said saw guide is individually patient customized to conform to the lower portion of the tibia of a patient and is further configured so that the orthogonal direction to the plane of said opening for inserting a cutting saw is at an angle direction which is less than 45 degrees to the longitudinal tibial axis of the patient, thereby providing for said one saw cut through said at least portion of the malleolus 300 used for osteotomy of a lower portion of a tibia to expose the dome of the talus.",
"The above surgical kit may further be designed so that said saw guide is individually patient customized to conform to the lower portion of the tibia of a patient and further configured so that the saw cutting direction provided by said opening is at an angle direction within a range between 15 and 45 degrees to the longitudinal tibial axis of the patient, thereby providing for said one saw cut through said at least a portion of the malleolus used for osteotomy of a lower portion of a tibia to expose the dome of the talus.",
"The above surgical kit may further be designed so that said saw guide is individually patient customized to conform to the lower portion of the tibia of a patient and further configured so that the saw cutting direction provided by said opening is at an angle direction of 30 degrees to the longitudinal tibial axis of the patient, thereby providing for said one saw cut through said at least a portion of the malleolus used for osteotomy of a lower portion of a tibia to expose the dome of the talus.",
"The above surgical kit may further be designed so that at least a portion of the inner engagement surface 160 of said saw guide conforms to the lower medial anterior portion of the tibia.",
"In certain aspects, the at least a portion of the inner engagement surface 160 of the saw guide is patient uniquely customized with a surface and dimensions designed to conform to the lower medial anterior portion of the tibia.",
"The surgical implant of the above surgical kit may be customized to an undamaged talus dome of a specific patient to be treated.",
"FIGS.",
"12 to 14 show the saw guide 100 of a kit according to the disclosure.",
"In this example embodiment related to defects of the talar dome, each saw guide may be customized via imagery of the patient's tibia through e.g.",
"MRI, CT or X-ray.",
"The saw guide has a slit 120, or first opening 120, providing for a single saw cutting plane B.",
"This example saw guide also has two pin holes 150 provided for securing the saw guide in place on the tibia.",
"The portion 180 of the saw guide in FIG.",
"12 to 130 which comprises the saw cutting slit 120, and which may have dimensions corresponding to or defining the depth of the slit, may be designed with a depth or height which is adapted to a specific length of the sawblade 190 as the powertool 520, to which the sawblade is attached, engages and stops at the upper surface of this portion 180 of the saw guide 100.The portion 180 of the saw guide comprising said slit 120, or opening may be designed with a height that matches, or corresponds to, the length of the sawblade 190 to be used during sawing to thereby make the powertool 520 used during sawing stop against the top surface of the portion 180, thereby minimizing the risk of unintentionally sawing too far.",
"In certain example embodiment of the method for designing the saw guide 100, the dimensions of the portion 180 of the saw guide may be customized, e.g.",
"via imagery of the patient's bone structure through e.g.",
"MRI, CT or X-ray and/or based on the sawblade selected.",
"According to certain aspects of this example embodiment illustrated in FIGS.",
"12 to 14, the saw guide may be individually made specific to the patient's specific anatomy and to the specific damage to the talus, possibly through the following saw guide design steps: a. identifying a subchondral damage of the talus dome through radiological images such as MR, CT or X-ray images or through arthroscopy; b. planning the size and the location of an osteotomy needed to get access to the talar dome to treat the damage; c. creating a virtual 3D model of at least portions of at least one of the tibial bone and the talus bone from radiological images such as MR, CT or X-ray images; and d. virtually designing a patient specific osteotomy guide based on the 3D model and the size and location of the osteotomy needed.",
"According to certain of the example embodiment illustrated in FIGS.",
"12 to 14, the surgical saw guide 100 may be manufactured by a 3D printing process in which material is joined or solidified under computer control to create the surgical saw guide.",
"The method of manufacturing by a 3D printing process may include building the surgical saw guide from computer-aided design (CAD) data by successively adding material layer by layer.",
"The CAD data may further be based on a virtually designed patient specific osteotomy saw guide based on the 3D model of the at least portion of the first bone structure and the size and location of the osteotomy needed.",
"According to example embodiment, the above method of manufacturing the saw guide in a 3D printing process may preceded by the following steps of virtually designing a patient specific osteotomy saw guide: a. identifying at least one of a bone and a cartilage damage of the second bone structure through radiological images such as MR, CT or X-ray images; b. planning the size and the location of an osteotomy needed to get access to the second bone structure in the surgical treatment of said at least one of a bone and cartilage damage of the second bone structure; c. creating a 3D model of at least a portion of at least one of the first and the second bone structure from radiological images such as MR, CT or X-ray images; and d. virtually designing a patient specific osteotomy saw guide based on the 3D model and the size and location of the osteotomy needed.",
"According to example embodiments, the technology disclosed proposes a method for designing a saw guide and a surgical method for use in osteotomy and the temporary osteotomic removal of a bone fragment of a first bone structure for exposing a portion of a second bone structure for treatment, comprising the steps of: a. identifying at least one of a bone and a cartilage damage of the second bone structure through radiological images such as MR, CT or X-ray images; b. planning the size and the location of an osteotomy of the first bone structure needed to get access to the second bone structure in the treatment, e.g.",
"surgical treatment, of the at least one of a bone and cartilage damage of the second bone structure; c. creating a virtual 3D model of at least a portion of at least one of the first and second bone structure from radiological images such as MR, CT or X-ray images; d. designing a patient specific osteotomy saw guide based on the 3D model and the size and location of the osteotomy needed; e. positioning and fixing the designed patient customized saw guide 100 so that the saw guide is conforming and fixable to the surface of the first bone structure; f. making a saw cut along the saw guide surface excising a bone fragment in form of a piece of the first bone structure; g. removing said bone fragment, or folding said bone fragment forward and outward preserving the attachment, and exposing the damaged area of the second bone structure; h. performing treatment of said at least one of a bone and cartilage damage of the second bone structure; and i. replacing said excised bone fragment into its original, or substantially original, position and fixing it in place.",
"With reference to the angle relationships and angles φ and β illustrated in FIGS.",
"15a and 15b and in example embodiments, the saw guide 100 of the technology disclosed can be designed with at least one hole 140 of an integrated drill guide 130 where the at least one hole 140 is configured to have an orientation adapted to guide the drilling at an angle β, or within an angle range, to the longitudinal tibial axis A of a patient, where the angle β, or angle range, is within the angle range of 50-70 degrees to the longitudinal tibial axis A of a patient.",
"At least one the angles φ and β can be determined during the pre-operative planning stage of the osteotomy and may be determined in relation to other features, angle direction and surfaces of the saw guide or a patient.",
"In certain aspects of the technology disclosed, the determination of at least one of the angles φ and β is individually patient customized on the basis of radiologically obtained patient data, such as MR, CT or X-ray imaging.",
"FIG.",
"16a shows a saw guide 100, e.g.",
"a talus osteotomy guide, in its unique position on the tibia.",
"The saw guide 100 is attached and secured to the bone by inserting two pins 510 in the pin holes 150 on the proximal side of the saw guide.",
"FIG.",
"16b shows the saw guide 100 where the chuck and designated drill are attached to the power tool.",
"The distal guiding holes 140 of the drilling guide 130 on the saw guide 100 are used for pre-drilling the fixation holes 410, or channels, which are used to refixate the temporarily removed bone fragment of the tibia after performing the surgical treatment of the talus.",
"FIG.",
"16c shows the saw guide 100 where the sagittal saw attachment and sawblade 190 are attached to the powertool 520.The saw guide will guide the sawing and controls the depth of the cut.",
"In certain aspects of the technology disclosed, the sawing will continue until the saw bottoms on the top of the saw guide.",
"FIG.",
"16d illustrates a later stage in the osteotomic procedure when both the surgical pins 510 and the saw guide 100 have been removed.",
"In this example, the osteotomy is continued by using an osteotome 530 to make sure to keep surrounding tissues away.",
"In this example of procedure, a slight amount of bone is left intact to allow a final break-off by hand to reduce the risk of damaging the talus surface.",
"This slight amount of bone left intact is then preferably broken off by hand and, as illustrated in FIG.",
"16d, a scalpel or chisel 530 is used to free the bone fragment of the last tibia adjoining tissue to remove the bone fragment in one piece, thereby providing temporary access to the dome of the talus for the surgeon to perform treatment such as e.g.",
"surgical treatment.",
"FIG.",
"17 illustrates the pin socket 610 positioned in a hollow tubular shell 620.The pin socket 610 comprises a through hole in form of a steering hole 630.The pin socket, when positioned in said hollow tubular shell 620, provides mechanical support and the directional guidance for vertical drilling through said steering hole 630 and into the articular surface of a joint to form a steering hole in the articular surface of a joint for further drilling to remove cartilage and bone to prepare the site for implantation of an implant.",
"FIG.",
"18 shows the depth meter verification tool 710.The verification tool 710, or depth meter tool, comprises a depth stop which is designed to be engaging a powertool used for the saw cutting procedure, a ta specific depth to prevent insertion of saw cutting blades into the slit 120 of the saw guide that cut beyond a certain length.",
"In the verification process, the saw attachment and sawblade 190 are first attached to the powertool 520 and the depth meter 710 is used to verify that the selected sawblade has the correct dimension for the designed saw guide.",
"The verification process selected sawblade 190 has the correct dimensions and length for the designed saw guide 100 using the depth meter verification tool 710 in FIG.",
"18 includes verifying that the tip of the sawblade 190 is visible within the MIN/MAX markings 720 of the depth meter verification tool.",
"FIG.",
"19 is a process flow diagram showing the steps of an osteotomic procedure used according to example embodiments of the technology disclosed, the example osteotomic procedure comprises at least a plurality of the following steps: 810: inserting at least one pin 510 in the at least one pin hole 150 on the proximal side of the saw guide 100 to secure the saw guide to the bone; 820: drilling the at least one fixation holes 410 by use of the directional guidance of the at least one hole 140 of the drill guide 130 of the saw guide 100; 830: attaching the saw attachment and sawblade 190 to a powertool 520 and inserting the sawblade 190 into the saw guide 100 to start sawing the saw cut; 840: removing the pins 510 and the saw guide 100 from the surgical field; 850: removing a bone fragment, or piece of the tibia, defined by the saw cut by breaking-off the bone fragment by the aid of an osteotome 530, e.g.",
"a scalpel or chisel 530, to free the bone fragment of the last tibia adjoining tissue; 860: performing surgical treatment of the talar dome; and 870: refixating the removed bone fragment by use of fixation means 420 in form of e.g.",
"screws which are screwed into the at least one fixation hole 410.In certain embodiments of the above procedure and the technology disclosed, the cut out piece of the tibia bone, or malleolus, is not completely removed but is removed by still being attached to the tibia bone via the last tibia adjoining tissue and is only folded out when performing surgery treatment of the talar dome.",
"After performed surgery, the cut out piece of the tibia is then folded back into its original, or substantially original, position and screwed into place preferably by the use of fixation means, e.g.",
"by the use of two titanium screws.",
"According to example embodiments, the technology disclosed proposes a surgical method for use in osteotomy and the temporary osteotomic removal of a bone fragment of a tibia for exposing the talus dome for treatment, comprising the steps of: 1) identifying at least one of a bone and a cartilage damage of the talus dome through radiological images such as MR, CT or X-ray images; 2) planning the size and the location of an osteotomy needed to get access to the talus dome in the treatment of said at least one of a bone and a cartilage damage of the talus; 3) creating a virtual 3D model of at least a portion of at least one of the tibial bone and the talus bone from radiological images such as MR, CT or X-ray images; 4) designing a patient specific osteotomy saw guide based on the 3D model and the size and location of the osteotomy needed; 5) positioning and fixing the patient customized saw guide 100 so that the saw guide is conforming and fixable to the lower medial anterior portion of the tibia; 6) making a saw cut along the saw guide surface excising a lower medial anterior piece of the tibia; 7) removing said lower medial anterior piece, or folding said lower medial anterior piece forward and outward preserving the attachment of medial deltoid ligaments, and exposing the damaged condylar area of the talus dome; 8) performing treatment of said at least one of a bone and cartilage damage of the at least one of a bone and a cartilage damage of the talus; and 9) replacing said excised lower medial anterior piece of the tibia into its original, or substantially original, position and fixing it in place.",
"Certain aspects and embodiments of the technology disclosed the surgical procedure in which the kit and the saw guide of the disclosure are used could be defined in the following definitional points: Method of joint implant surgery for repair of articular surfaces in the talocrural joint, comprising: a) Fixing a patient customized saw guide (1) conforming and fixable to the lower medial anterior portion of the tibia and providing saw guide surfaces (2,3,4) in three different planes, suitable for osteotomy of a lower medial anterior piece of a tibia to expose the dome of the talus, b) Making cuts along each of said three saw guide surfaces excising a lower medial anterior quadrant of the tibia, c) Folding said lower medial anterior quadrant piece forward and outward, preserving the attachment of medial deltoid ligaments and exposing the damaged condylar area of the talus dome, d) Mounting a patient customized form fitting hollow drill guide comprising a tubular shell in place on the talus dome, covering with its hollow part the damaged area of the talus to be repaired, e) Drilling in said drill guide with a double drill having a narrow diameter deeper drill and a larger diameter shallower drill providing a bore for a talus implant, f) Removing said drill guide, g) Inserting into said bore a surgical implant (20) having a cap (21) with an outer surface (22) conforming to a talus dome surface and an inner surface having a central implant anchoring peg (23) extending perpendicularly from said inner surface, h) Replacing said excised lower medial anterior quadrant piece into its original position and fixing it in place.",
"One Exemplary Surgical Procedure: In the following one exemplary procedure is described for the use of the kit and the saw guide according to the disclosure.",
"This description is of course not at all limiting of the invention.",
"Rather other procedures may be used, for example with a block of the tibia removed with surfaces at other angles than the orthogonal angles described below.",
"According to the technology disclosed, the patient customized saw guide only provides for a cut in one plane, e.g.",
"for severing a portion of the malleolus, straight off, if, thereby only the medial portion of the talus dome need be exposed.",
"The surgical saw guide can further be used for other treatments than the surgical implantation of implants according to certain embodiments of the present disclosure.",
"The saw guide can for example be used for access to the talus dome for osteochondral treatment through biological procedures or for implantation of artificial plugs.",
"1.Incision: Wiberg surgical raspatory file.",
"Hohmann retractors used to separate the skin after incision.",
"White positioner.",
"2.A Hintermann distractor is used for separation.",
"a.",
"The patient customized saw guide is placed on the tibia after the bone has been exposed.",
"Two 1.6 mm pins are inserted through pin holes in a form fitting flange on the saw guide and are driven into the tibia, holding the saw guide securely in place for all three orthogonal saw cuts to follow.",
"3.Two bore holes of 3.5-4 mm are first drilled through the intended osteotomic tibial quandrant and past the sagittal and coronal guide planes into the bone therebehind.",
"These holes are drilled at this time to assure exact replacement and fixation of the removed bone quadrant in its exact original position.",
"4.First the saw cuts in the transverse plane and in the coronal plane are made up to stop pins driven in to prevent cutting into the tibia beyond the quadrant block form to be removed.",
"5.A form fitting talus protector shield is slipped in anteriorly from between the talus dome and the malleolus and the lower condylar surface of the tibia, while avoiding the medial ligaments and the flexor digitorum longus and the tibialis posterior muscles.",
"It is now possible to make the final cut in the sagittal plane without damaging the talus surface.",
"6.A flat and broad surgical chisel is used to remove any remaining bone holding the quadrant to the rest of the tibia.",
"7.The saw guide is removed.",
"8.The bone quadrant is pulled out and folded forward and downward all the while preserving the vital attachment of the medial (deltoid) ligaments to the removed tibia quadrant and to the calcaneus and the navicular.",
"9.The patient customized form fitting drill guide (Epiguide®) in the form of a tubular shell is mounted in place on the talus dome, covering with its hollow part the damaged area of the talus to be repaired.",
"It extends with a saddle shaped mounting flange forward along the ridge of the talus.",
"Pins through the mounting flange securely fix the drill guide to the talus.",
"10.The patient customized saw guide has assured that a bone quadrant has been sawn and removed in one try, which is large enough to provide access to the damaged area of the talus dome, to allow for vertical mounting and anchoring of the drill guide, to allow for vertical drilling into the talus through the drill guide, and to allow for hammering the implant into place in the drilled hole in the talus.",
"11.A drill sleeve is inserted into the drill guide.",
"Cartilage is cut away and a double drill (12-17 mm/4 mm) is used to drill the deeper (4 mm diameter) hole for the peg and the shallow hole for the cap, which may have a slight peripheral rim on its underside.",
"12.A second drill sleeve (height adjustment sleeve) which is adjustable to the correct depth is inserted and fine-tuning of the drilling depth is performed.",
"13.A dummy implant (Epidummy®) with a handle and of slightly smaller diameter than the real implant (Episealer®) is inserted into the drilled double hole to check for correct depth and position of the hole.",
"The dummy is then pulled out.",
"14.The drill guide is then removed.",
"15.The patient customized implant (Episealer®) is then pushed into place and then tapped finally into place using a mandril.",
"The tibias quadrant piece which has been folded out exposes enough space within the tibia and above the talus dome to enable drilling for and insertion of the implant peg in the proper direction so that downward forces exerted by the tibia, when walking for example will be exerted largely in the direction of the peg so that no lateral forces will be exerted tending to dislodge the implant over time.",
"16.The excised tibia quadrant is then folded up into its original position and two screws screw it precisely into its original position by virtue of the fact that the deep screw holes were drilled into the intact tibia before the sawing operation.",
"17.The Hohmann skin retractors are removed and the tissue is sutured together.",
"Exemplary Surgical Procedures for Use Together with the Technology Disclosed In the following one exemplary procedure is described for the use of the kit and the saw guide 100 according to the disclosure.",
"This description is of course not at all limiting of the invention.",
"Rather other procedures may be used, for example with a piece of the tibia removed with surfaces at other angles than the orthogonal angles described below.",
"According to the technology disclosed, the patient customized saw guide only provides for a cut in one plane, e.g.",
"for severing a portion of the malleolus, straight off, if, thereby only the medial portion of the talus dome need be exposed.",
"The surgical saw guide can further be used for other treatments than the surgical implantation of implants according to certain embodiments of the present disclosure.",
"The saw guide can for example be used for access to the talus dome for osteochondral treatment through biological procedures or for implantation of artificial plugs.",
"The osteotomy procedure may comprise at least a plurality of the following actions of a surgical treatment comprising the implantation of an implant into the dome of the talus: 1.The patient customized saw guide is placed on the tibia after the bone has been exposed.",
"Two pins 510 are inserted through pin holes 150 on the saw guide 100 and are driven into the tibia 200, holding the saw guide securely in place for the single saw cut to follow.",
"2.Two bore holes 410 are first drilled through the intended osteotomic tibial piece and past the saw cutting plane B into the bone therebehind.",
"These holes 410 are drilled at this time to assure exact replacement and fixation of the removed bone fragment in its original, or substantially original, position.",
"3.A single saw cut, preferably not a through cut but a partial cut, is made in a saw cutting plane B.",
"4.An osteotome 530, e.g.",
"in form of a flat and broad surgical chisel or scalpel, is used to remove any remaining bone holding the bone fragment to the rest of the tibia 200.5.The saw guide is removed.",
"6.The bone fragment is pulled out and folded forward and downward all the while preserving the vital attachment of the medial (deltoid) ligaments to the removed tibia fragment and to the calcaneus and the navicular.",
"7.The patient customized saw guide has assured that a bone fragment has been sawn and removed in one try, which is large enough to provide access to the damaged area of the talus dome, to allow for surgical treatment of the talus, e.g.",
"the vertical mounting and anchoring of a second drill guide, to allow for vertical drilling into the talus through the drill guide to prepare for an implant 8.Perform surgical treatment of at least one medial osteochondral defect of the talar dome.",
"A drill sleeve may be used and inserted into the second drill guide.",
"A drill, e.g.",
"a double drill, may be used to drill the deeper hole for an implant peg and the shallow hole for the implant cap, which may have a slight peripheral rim on its underside.",
"9.A drill sleeve which is adjustable to the correct depth is inserted and fine-tuning of the drilling depth is performed.",
"10.A dummy implant is inserted into the drilled hole to check for correct depth and position of the hole.",
"The dummy is then pulled out.",
"11.The drill guide is then removed.",
"12.The patient customized implant is then pushed into place.",
"13.After performed surgical treatment, the excised tibia fragment is then fixated, or folded up, into its original, or substantially original, position and two screws 420 are used for screwing the removed piece of the tibia, or malleolus, precisely into its original, or substantially original, position by virtue of the fact that the deep screw holes 410 were drilled into the intact tibia before the sawing operation.",
"In step 13 above, the patient customized implant may be pushed into place and then tapped finally into place using a mandrel.",
"The cut out tibia piece which has been removed or folded out exposes enough space within the tibia and above the talus dome to enable drilling for and insertion of the implant peg in the proper direction so that downward forces exerted by the tibia, when walking for example will be exerted largely in the direction of the peg so that no lateral forces will be exerted tending to dislodge the implant over time.",
"The surgical kit according to the disclosure makes it possible to perform the above described surgical implant procedure which will make it possible to: avoid all important tendons, muscles and ligaments and leaving them attached and intact, provide enough exposed space for medical treatment, e.g.",
"a surgical treatment which includes correctly drill for and drive in the implant at the correct angle, make the bone cuts precise and correct on the first try, make possible precise reattachment of the tibia piece to its original, or substantially original, position for healing and correct alignment of the joint.",
"Certain aspects and embodiments of the technology disclosed the surgical procedure in which the kit and the saw guide of the disclosure are used could be defined in the following definitional points: Method of joint implant surgery for repair of articular surfaces in the talocrural joint, comprising: i) Positioning and fixing a patient customized saw guide 100 so that the saw guide is conforming and fixable to the lower medial anterior portion of the tibia and is further providing a saw guide surface in one plane, thereby being suitable for osteotomy of a lower medial anterior piece of a tibia to expose the dome of the talus, j) Making a saw cut along the saw guide surface excising a lower medial anterior piece of the tibia, k) Removing said lower medial anterior piece, or folding said lower medial anterior piece forward and outward preserving the attachment of medial deltoid ligaments, and exposing the damaged condylar area of the talus dome, l) Mounting a patient customized form fitting hollow drill guide comprising a tubular shell in place on the talus dome, covering with its hollow part the damaged area of the talus to be repaired, m) Drilling in said drill guide with a double drill having a narrow diameter deeper drill and a larger diameter shallower drill providing a bore for a talus implant, n) Removing said drill guide, o) Inserting into said bore a surgical implant having a cap with an outer surface conforming to a talus dome surface and an inner surface having a central implant anchoring peg extending perpendicularly from said inner surface, p) Replacing said excised lower medial piece into its original, or substantially original, position and fixing it in place.",
"Certain Embodiments Related to Surgical Treatment and the Implantation of Metal Implants Implants having a top cap surface customized to each patient to replicate the surface of the talus dome before it was injured, must be implanted so that the forces, applied during standing and walking via the lower condylar surfaces of the tibia against the new implant will act axially in relation to the implantation peg, for optimum force absorption and length of life.",
"Because of the disadvantages of current secondary treatment methods for OCDs, metal resurfacing inlay implants have been developed and started to reach the market.",
"A precise surgical technique is required in terms of implantation depth, position, and orientation because of the biomechanical properties of the ankle joint.",
"A protruding implant may damage the opposite cartilage by causing excessive contact pressures during loading, which is thought to be due to “plowing” of the cartilage.",
"On the other hand, a deep implant might result in collapse of the adjacent cartilage due to insufficient support.",
"The advantages of implants over complete replacement of the joint, see e.g.",
"patent applications WO2014/020562 and US2010/0262150, have stimulated a further development of smaller implants that can be implanted with less invasive surgery.",
"In this development, there has also been an effort to achieve small joint implants, suitable for repair of a small bone and/or cartilage injury that have a minimal influence on the surrounding parts of the joint.",
"In the current development, such small implants are designed with an implant body that may be formed as a mushroom cap with a hard surface to face the articulating side of the joint and a bone contacting surface engaging the bone below the damaged part of cartilage.",
"The shape and the curvature of the articulating surface of the implant may be designed to be a reconstitution of the shape and the curvature of the part of the joint when it was undamaged.",
"Such implants are usually designed as mushrooms with an implant body or head and with a peg or a rod projecting from the bone contacting side of the implant body for anchoring the implant into the bone.",
"The cap of the mushroom for repair of the talus dome is often slanted or irregular to conform to the shape of the original undamaged ridge or dome of the talus.",
"The talar metal resurfacing implants preferably have an exact match to the undamaged talar anatomy."
]
] |
Patent_15871376
|
[
[
"Self-Latch Sense Timing in a One-Time-Programmable Memory Architecture",
"A programmable memory including a self-latching read data path.",
"A sense amplifier senses the voltage level at a bit line, the bit line communicating the data state of a selected memory cell in its associated column.",
"A data latch coupled to the output of the sense amplifier passes the sensed data state.",
"Set-reset logic is provided that receives the output of the data latch in the read data path and, in response to a transition of the data state in a read cycle, latches the data latch and isolates it from the sense amplifier.",
"The set-reset logic resets the data latch at the start of the next read cycle.",
"In some embodiments, a timer is provided so that the latch is reset after a time-out period in a long read cycle in which no data transition occurs."
],
[
"1.A method of reading a data state from a programmable solid-state memory, comprising: at a beginning of a read cycle, resetting each of a plurality of bit lines to a first level; applying the data state of a selected one of a plurality of programmable memory cells to the bit line, each memory cell programmable from a first data state to a second data state, the applying of a memory cell at the second data state causing a transition to a second level at the bit line; at a sense amplifier, sensing the level at the bit line and presenting the sensed level at an output; passing the output of the sense amplifier through a data latch to an output data path; and responsive to sensing the second bit line level: setting the data latch to store the sensed data state; and isolating the data latch from the output of the sense amplifier.",
"2.The method of claim 1, further comprising: starting a timer from a beginning of a read cycle; and responsive to the timer reaching a maximum cycle time, coupling the data latch to the output of the sense amplifier.",
"3.The method of claim 1, wherein the data latch comprises: a storage element having an input and an output; and a first pass gate coupled between the output of the sense amplifier and the input of the storage element; wherein the step of isolating the data latch comprises opening the first pass gate.",
"4.The method of claim 3, wherein the storage element of the data latch comprises: a first inverter having an input coupled to the first pass gate and an output; a second inverter having an input coupled to the output of the first inverter and an output; and a second pass gate coupled between the output of the second inverter and the input of the first inverter; and wherein the step of setting the data latch comprises closing the second pass gate.",
"5.The method of claim 4, further comprising, at the beginning of a read cycle, closing the first pass gate and opening the second pass gate.",
"6.The method of claim 5, further comprising: starting a timer from a beginning of a read cycle; and responsive to the timer reaching a maximum cycle time, closing the first pass gate and opening the second pass gate.",
"7.The method of claim 1, wherein: the first data state corresponds to an unprogrammed memory cell state; and the second data state corresponds to a programmed memory cell state.",
"8.The method of claim 1, wherein: the plurality of memory cells are arranged in rows and columns, each column of memory cells associated with a bit line; and the applying step comprises: applying the data states of memory cells in a selected row of the memory array to their associated bit lines; and coupling a selected one of a plurality of bit lines to the sense amplifier responsive to a column address.",
"9.A method of reading data stored in a memory element of a memory device comprising: receiving a signal corresponding to the data stored in the memory element at an input of a sense amplifier; outputting, at an output of the sense amplifier, a sensed output signal indicating a logic state of the data stored in the memory element; operating a data latch having an input in a reset state in response to a latch signal indicating a first value to pass the sensed output signal sense amplifier to an output of the data latch, wherein the data latch has an input coupled to the output of the sense amplifier to receive the sensed output signal; and operating a data latch in a set state in response to the latch signal indicating a second value to store a data state of the sensed output signal and isolate the input of the data latch from the output of the sense amplifier.",
"10.The method of claim 9, further comprising producing the sensed output signal in response to a sense amplifier enable signal.",
"11.The method of claim 10, further comprising, generating the latch signal using a set-reset control circuit.",
"12.The method of claim 11, wherein the set-reset control circuit has an input receiving the sense amplifier enable signal, and wherein generating the latch signal is at least partially in response to the sense amplifier enable signal.",
"13.The method of claim 9, wherein the data latch is operated in the set state in response to the sensed output signal indicating the logic state of the data stored in the memory element corresponds to a programmed state.",
"14.The method of claim 13, wherein the data latch is operated in the reset state in response to the sensed output signal indicating the logic state of the data stored in the memory element corresponds to an un-programmed state.",
"15.The method of claim 14, wherein the programmed state has a logic value of 1 and the un-programmed state has a logic value of 0.16.The method of claim 9, wherein operating the data latch in the reset state comprises: turning off a first pass gate coupled between the input of the data latch and the output of the data latch; and turning on a second pass gate coupled between an output of the first data latch and a storage element of the data latch."
],
[
"<SOH> BACKGROUND OF THE INVENTION <EOH>This invention is in the field of solid-state memories.",
"Embodiments of this invention are more specifically directed to the sensing of stored data states in one-time programmable non-volatile memory.",
"Non-volatile solid-state read/write memory devices are commonplace in many modern electronic systems, particularly in portable electronic devices and systems.",
"Conventional types of non-volatile solid-state memory devices include those referred to as electrically programmable read-only memory (EPROM) devices.",
"Modern EPROM memory cells include one or more “floating-gate” transistors that store the data state.",
"In a general sense, these floating-gate transistors are “programmed” by the application of a bias that enables holes or electrons to tunnel or be injected through a thin dielectric film onto an electrically isolated transistor gate element, which is the floating gate of the transistor.",
"This trapped charge on the floating gate will modulate the apparent threshold voltage of the memory cell transistor, as compared with the threshold voltage with no charge trapped on the floating gate.",
"This difference in threshold voltage can be detected by sensing the resulting difference in source-drain conduction, under normal transistor bias conditions, between the programmed and unprogrammed states.",
"Some EPROM devices are “erasable” in that the trapped charge can be removed from the floating gate, for example by exposure of the memory cells to ultraviolet light (such memories referred to as “UV EPROMS”) or by application of a particular electrical bias condition that enables tunneling of the charge from the floating gate (such memories referred to as electrically-erasable or electrically-alterable, i.e., EEPROMs and EAPROMS, respectively).",
"“Flash” memory devices are typically realized by EEPROM memory arrays in which the erase operation is applied simultaneously to a “block” of memory cells.",
"Because of the convenience and efficiency of modern EPROM and EEPROM functions, it is now commonplace to embed non-volatile memory arrays within larger scale integrated circuits, such as modern complex microprocessors, digital signal processors, and other large-scale logic circuitry.",
"Such embedded non-volatile memories can be used as non-volatile program memory storing software routines executable by the processor, and also as non-volatile data storage.",
"On a smaller scale, non-volatile memory cells can realize control registers by way of which a larger scale logic circuit can be configured, or can be used to “trim” analog levels after electrical measurement.",
"As known in the art, “one-time programmable” (“OTP”) memories are also popular, especially in embedded non-volatile memory applications as mentioned above.",
"The memory cells of OTP memories are constructed similarly or identically as UV EPROM cells, and as such are not electrically erasable.",
"But when mounted in an opaque package, without a window through which the memory can be exposed to ultraviolet light, the UV EPROM cells may be programmed one and only one time.",
"In embedded applications, OTP memories are useful for storing the program code to be executed by the embedding microcontroller or microprocessor.",
"In any type of solid-state semiconductor memory, data path timing for the read operation is critical in the performance of the memory device.",
"As fundamental in the art, memory cells in conventional OTP and other solid-state memories are typically accessed by selecting a row of cells in the array according to a row address, coupling the storage device in each of those cells to a corresponding bit line to establish a voltage or current on each bit line according to the data state stored in its corresponding cell.",
"Sense amplifiers sense the state of the bit lines to determine the data states of the accessed cells, and these sensed data states are then latched and communicated along the output data path of the memory.",
"Accurate sensing of the stored memory cell state must be maintained over varying voltage and temperature conditions, variations in manufacturing parameters, and in the presence of system noise.",
"As known in the art, the noise margin of the read operation, which depends on timing precision in the read circuitry, in large part determines the minimum memory cell size required to provide the necessary read current and thus the memory density in bits per unit “chip” area.",
"This precision of the sense circuitry is due in large part to the timing at which the sense amplifiers operate to amplify and latch the data state represented by the bit line signals.",
"In each cycle, time must be provided to allow the accessed memory cells to develop a voltage or current on the bit lines, before the amplification and latching of those bit line levels as the data states read from the accessed cells.",
"On one hand, if the data are latched too early in the cycle, before the bit line signal has fully developed, the data read is vulnerable to error from noise.",
"On the other hand, latching the data later than is necessary for reliable sensing will unduly lengthen the read cycle time and thus limit the performance of the device.",
"It has been observed that the optimization of data path timing for read cycles in modern memory architectures can be quite difficult.",
"One conventional technique for setting the read path timing is to generate a sense amplifier enable signal from a row enable control signal that gates the word line drivers, but with a delay element such as a chain of logic inverters establishing the desired delay time following the driving of the selected word line before the sense amplifiers are enabled or sensed data are latched.",
"It has been observed, however, that the construction and thus the electrical characteristics of the memory cell transistors typically differ from that of the logic transistors making up the delay element.",
"Significant device mismatch can result which, along with localized variations in device behavior of these minimum size cell transistors, necessitates additional design margin (i.e., lengthened delay between the word line drive and the sense amplifier enable signal) to be built into the timing circuit.",
"This additional margin adversely impacts read cycle times.",
"Another conventional approach to determining sense amplifier timing in modern solid-state memories uses a “tracking” circuit based on replica, or “dummy”, memory cells that are constructed using the same transistor sizes as the cell transistors.",
"This approach is especially common in those memory technologies for which the replica cells can closely match the cell transistors in the main array, such as static random access memories (SRAMs).",
"Arslan et al., “Variation-Tolerant SRAM Sense-Amplifier Timing Using Configurable Replica Bitlines”, Custom Integrated Circuits Conference (IEEE, 2008), pp.",
"415-418, describes the incorporation of a replica column of memory cells implemented in or adjacent to the main memory array, in which the discharge of the replica bit line by a configurable number of dummy memory cells in that column drives the sense amplifier enable signal.",
"Amrutur et al., “A Replica Technique for Wordline and Sense Control in Low-Power SRAM's”, J.",
"Solid State Circuits, Vol.",
"33, No.",
"8 (IEEE, 1998), pp.",
"1208-19, describes a row of replica cells implemented in or adjacent to the main memory array, for which a dummy global word line is driven along with the global word line for the main array.",
"In some memory architectures, such as those used in conventional one-time-programmable (OTP) memory, the tracking circuit determines the time at which a data latch receiving the output of the sense amplifiers is enabled.",
"In one conventional OTP architecture, the sense amplifier responds asynchronously to the bit line levels to produce an output level that is latched into a read data latch at a point in the cycle determined by the tracking circuit.",
"FIG.",
"1 illustrates the functional architecture of a conventional OTP memory including a tracking circuit for timing the latching of the data sensed by sense amplifiers.",
"In this conventional architecture, the OTP bit cells are arranged as rows and columns in main array 2 , with the cells in the same row sharing a word line and those in the same column sharing a bit line BL, coupled to a corresponding one of main sense amplifiers 4 .",
"Control logic 5 represents timing logic circuitry that generates a word line enable signal WL_EN that gates the row decoder and word line drivers (not shown) to energize the selected word line in main array 2 in the read cycle (indicated by read enable signal READ), at the appropriate time responsive to a clock signal CLK.",
"In the manner discussed above, main sense amplifiers 4 asynchronously sense the state of bit lines BL and present corresponding output signals indicating the sensed data states to read data latches 6 .",
"In this conventional OTP architecture, read data latches 6 latch the output data D_OUT presented by main sense amplifiers 4 in response to a LATCH_DATA signal.",
"Tracking circuit 8 also generates a reset signal RESET to control logic 5 at this time, to allow the memory to prepare for the next cycle once the output data are latched at interval t 2 -t 1 from read data latches 6 .",
"According to this conventional OTP architecture, the timing of the LATCH_DATA signal is derived from a tracking circuit 8 that tracks the sensing of a data level stored at one or more replica memory cells 2 R following the energizing of the word line enable signal WL_EN.",
"Each replica cell 2 R is typically hard-wired to a particular data state, and is coupled to replica bit line RBL as word line enable signal WL_EN is energized.",
"If multiple replica cells 2 R are used, these cells 2 R are typically ganged together along one or more replica bit lines RBL to minimize the effects of local device variation.",
"Replica sense amplifier 4 R issues a signal to tracking circuit 8 in response to a transition at replica bit line RBL.",
"Tracking circuit 8 in turn generates the LATCH_DATA signal, which is (theoretically) at the time that replica sense amplifier 4 R produces a stable D_OUT state from the levels at replica bit lines RBL, plus an additional time margin to allow for variation over main array 2 .",
"For the reasons discussed above, the timing of this LATCH_DATA signal is critical in the overall performance of this OTP memory.",
"If the LATCH_DATA signal is applied to latches 6 too early in the cycle, the noise margin of the read operation is poor; if it is applied too late in the cycle, the cycle time of the memory is degraded.",
"It has been observed, however, that conventional tracking circuit approaches are limited in the precision with which sense amplifier or data latch timing can be attained in one-time programmable (OTP) memories.",
"As known in the art, the electrical behavior of OTP memory cells changes over the life of the device, for example because the charge stored at the floating gate of the bit cell transistor leaks or is otherwise weakened.",
"This change in behavior is typically reflected in degradation of the read performance of a programmed (i.e., “1” data state) cell over time.",
"Unfortunately, referring to FIG.",
"1 , replica OTP cells 2 R will degrade differently over time than will the average cells in main array 2 , if for no other reason because replica cells 2 R are accessed in each and every read cycle, while cells in main array 2 are accessed much less frequently, on average.",
"To avoid the resulting variation in read performance over time, many conventional OTP memories realize replica cells 2 R as non-programmable transistors, for example as p-channel MOS load transistors, so that the timing of the LATCH_DATA signal is invariant over the device life.",
"However, the use of different transistor types and arrangements for replica cells 2 R from those of the cells in main array 2 results in the tracking circuit and the actual data path exhibiting different behavior over variations in power supply voltage, temperature, and process parameters.",
"FIG.",
"2 a qualitatively illustrates the effect of variations in these parameters on the timing determination in the OTP memory of FIG.",
"1 .",
"In this example of FIG.",
"2 a , plot VBL BC exhibits the bit line voltage VBL BC for a “0” to “1” transition following energizing of the selected word line in main array 2 for a “best case” condition of power supply voltage, temperature, and process parameters.",
"As shown in FIG.",
"2 a, this bit line voltage VBL BC reaches a trip voltage Vtrip at a time t 0 , at which time the LATCH_DATA signal may be issued to read data latches 6 to accurately latch the output D_OUT of sense amplifiers 4 .",
"The “worst case” condition of voltage, temperature, and process on the development of the bit line voltage in this OTP memory is shown by plot VBL WC , which reaches the trip voltage Vtrip at a later time t 1 .",
"While the tracking circuit may be arranged to issue the LATCH_DATA signal at any time following worst case time t 1 , the construction of replica cells 2 R from different transistors than the memory cell devices in the main array 2 necessitates the implementation of some timing margin to account for the eventual degradation of the main array cells over system life.",
"Accordingly, the arrangement of replica cells 2 R, replica sense amplifier 4 R, and tracking circuit 8 in this conventional OTP memory is typically arranged so that the time at which the reference bit line voltage VRBL reaches the trip voltage Vtrip is later than the worst case time t 1 for main array 2 .",
"FIG.",
"2 a shows an example of this slower development of the reference bit line voltage VRBL, reaching trip voltage Vtrip at time t 2 .",
"This margin provided by the interval t 2 -t 1 directly impacts the cycle time of the memory.",
"FIG.",
"2 b illustrates the generation of a stable “1” level at the output D_OUT of sense amplifiers 4 following the issuance of the clock signal CLK to control logic 5 in this architecture.",
"The timing margin indicated by time interval t 2 -t 1 , after the worst case time at which the reference bit line voltage VRBL reaches the trip voltage Vtrip, accounts for degradation of the main array cells over device life.",
"In current-day OTP memories, this t 2 -t 1 margin can range from 30 nsec to as much as 100 nsec, depending on memory size.",
"This margin interval t 2 -t 1 can be a significant fraction of the overall cycle time Tcyc of the memory, and thus can affect the overall performance of the device."
],
[
"<SOH> SUMMARY <EOH>Disclosed embodiments provide a timing architecture for the read data path in one-time programmable (OTP) memories in which memory cycle time is minimized.",
"Disclosed embodiments provide such a memory architecture in which the timing of the read data path adjusts with changes in bit cell performance over the operating life of the memory.",
"Disclosed embodiments provide such a memory architecture requiring minimal timing margin to account for cell degradation.",
"Disclosed embodiments provide such a memory architecture in which the read power consumption is reduced.",
"Disclosed embodiments provide such a memory architecture that can be realized by less complex circuitry than in conventional memories.",
"Other objects and advantages of the disclosed embodiments will be apparent to those of ordinary skill in the art having reference to the following specification together with its drawings.",
"According to certain embodiments, a programmable memory includes a read data path in which a transition in the data path itself is used to latch the data state sensed from an accessed memory cell.",
"Latch set-reset logic is provided so that, in a read operation, a transition at the output of a sense amplifier caused by a selected memory cell storing a programmed cell state, clocks a data latch to store that data state and to isolate its input from the sense amplifier.",
"The latch set-reset logic resets the data latch at the start of the next read cycle.",
"In some embodiments, a timer is provided so that the latch is reset after a time-out period in a long read cycle in which no data transition occurs."
],
[
"CROSS-REFERENCE TO RELATED APPLICATIONS This application is a divisional of and claims priority to U.S. patent application Ser.",
"No.",
"15/247,352, filed Aug. 25, 2016, which claims priority, under 35 U.S.C.",
"§ 119(e), of Provisional Application No.",
"62/269,737, filed Dec. 18, 2015, all of which are incorporated herein by this reference.",
"STATEMENT REGARDING FEDERALLY SPONSORED RESEARCH OR DEVELOPMENT Not applicable.",
"BACKGROUND OF THE INVENTION This invention is in the field of solid-state memories.",
"Embodiments of this invention are more specifically directed to the sensing of stored data states in one-time programmable non-volatile memory.",
"Non-volatile solid-state read/write memory devices are commonplace in many modern electronic systems, particularly in portable electronic devices and systems.",
"Conventional types of non-volatile solid-state memory devices include those referred to as electrically programmable read-only memory (EPROM) devices.",
"Modern EPROM memory cells include one or more “floating-gate” transistors that store the data state.",
"In a general sense, these floating-gate transistors are “programmed” by the application of a bias that enables holes or electrons to tunnel or be injected through a thin dielectric film onto an electrically isolated transistor gate element, which is the floating gate of the transistor.",
"This trapped charge on the floating gate will modulate the apparent threshold voltage of the memory cell transistor, as compared with the threshold voltage with no charge trapped on the floating gate.",
"This difference in threshold voltage can be detected by sensing the resulting difference in source-drain conduction, under normal transistor bias conditions, between the programmed and unprogrammed states.",
"Some EPROM devices are “erasable” in that the trapped charge can be removed from the floating gate, for example by exposure of the memory cells to ultraviolet light (such memories referred to as “UV EPROMS”) or by application of a particular electrical bias condition that enables tunneling of the charge from the floating gate (such memories referred to as electrically-erasable or electrically-alterable, i.e., EEPROMs and EAPROMS, respectively).",
"“Flash” memory devices are typically realized by EEPROM memory arrays in which the erase operation is applied simultaneously to a “block” of memory cells.",
"Because of the convenience and efficiency of modern EPROM and EEPROM functions, it is now commonplace to embed non-volatile memory arrays within larger scale integrated circuits, such as modern complex microprocessors, digital signal processors, and other large-scale logic circuitry.",
"Such embedded non-volatile memories can be used as non-volatile program memory storing software routines executable by the processor, and also as non-volatile data storage.",
"On a smaller scale, non-volatile memory cells can realize control registers by way of which a larger scale logic circuit can be configured, or can be used to “trim” analog levels after electrical measurement.",
"As known in the art, “one-time programmable” (“OTP”) memories are also popular, especially in embedded non-volatile memory applications as mentioned above.",
"The memory cells of OTP memories are constructed similarly or identically as UV EPROM cells, and as such are not electrically erasable.",
"But when mounted in an opaque package, without a window through which the memory can be exposed to ultraviolet light, the UV EPROM cells may be programmed one and only one time.",
"In embedded applications, OTP memories are useful for storing the program code to be executed by the embedding microcontroller or microprocessor.",
"In any type of solid-state semiconductor memory, data path timing for the read operation is critical in the performance of the memory device.",
"As fundamental in the art, memory cells in conventional OTP and other solid-state memories are typically accessed by selecting a row of cells in the array according to a row address, coupling the storage device in each of those cells to a corresponding bit line to establish a voltage or current on each bit line according to the data state stored in its corresponding cell.",
"Sense amplifiers sense the state of the bit lines to determine the data states of the accessed cells, and these sensed data states are then latched and communicated along the output data path of the memory.",
"Accurate sensing of the stored memory cell state must be maintained over varying voltage and temperature conditions, variations in manufacturing parameters, and in the presence of system noise.",
"As known in the art, the noise margin of the read operation, which depends on timing precision in the read circuitry, in large part determines the minimum memory cell size required to provide the necessary read current and thus the memory density in bits per unit “chip” area.",
"This precision of the sense circuitry is due in large part to the timing at which the sense amplifiers operate to amplify and latch the data state represented by the bit line signals.",
"In each cycle, time must be provided to allow the accessed memory cells to develop a voltage or current on the bit lines, before the amplification and latching of those bit line levels as the data states read from the accessed cells.",
"On one hand, if the data are latched too early in the cycle, before the bit line signal has fully developed, the data read is vulnerable to error from noise.",
"On the other hand, latching the data later than is necessary for reliable sensing will unduly lengthen the read cycle time and thus limit the performance of the device.",
"It has been observed that the optimization of data path timing for read cycles in modern memory architectures can be quite difficult.",
"One conventional technique for setting the read path timing is to generate a sense amplifier enable signal from a row enable control signal that gates the word line drivers, but with a delay element such as a chain of logic inverters establishing the desired delay time following the driving of the selected word line before the sense amplifiers are enabled or sensed data are latched.",
"It has been observed, however, that the construction and thus the electrical characteristics of the memory cell transistors typically differ from that of the logic transistors making up the delay element.",
"Significant device mismatch can result which, along with localized variations in device behavior of these minimum size cell transistors, necessitates additional design margin (i.e., lengthened delay between the word line drive and the sense amplifier enable signal) to be built into the timing circuit.",
"This additional margin adversely impacts read cycle times.",
"Another conventional approach to determining sense amplifier timing in modern solid-state memories uses a “tracking” circuit based on replica, or “dummy”, memory cells that are constructed using the same transistor sizes as the cell transistors.",
"This approach is especially common in those memory technologies for which the replica cells can closely match the cell transistors in the main array, such as static random access memories (SRAMs).",
"Arslan et al., “Variation-Tolerant SRAM Sense-Amplifier Timing Using Configurable Replica Bitlines”, Custom Integrated Circuits Conference (IEEE, 2008), pp.",
"415-418, describes the incorporation of a replica column of memory cells implemented in or adjacent to the main memory array, in which the discharge of the replica bit line by a configurable number of dummy memory cells in that column drives the sense amplifier enable signal.",
"Amrutur et al., “A Replica Technique for Wordline and Sense Control in Low-Power SRAM's”, J.",
"Solid State Circuits, Vol.",
"33, No.",
"8 (IEEE, 1998), pp.",
"1208-19, describes a row of replica cells implemented in or adjacent to the main memory array, for which a dummy global word line is driven along with the global word line for the main array.",
"In some memory architectures, such as those used in conventional one-time-programmable (OTP) memory, the tracking circuit determines the time at which a data latch receiving the output of the sense amplifiers is enabled.",
"In one conventional OTP architecture, the sense amplifier responds asynchronously to the bit line levels to produce an output level that is latched into a read data latch at a point in the cycle determined by the tracking circuit.",
"FIG.",
"1 illustrates the functional architecture of a conventional OTP memory including a tracking circuit for timing the latching of the data sensed by sense amplifiers.",
"In this conventional architecture, the OTP bit cells are arranged as rows and columns in main array 2, with the cells in the same row sharing a word line and those in the same column sharing a bit line BL, coupled to a corresponding one of main sense amplifiers 4.Control logic 5 represents timing logic circuitry that generates a word line enable signal WL_EN that gates the row decoder and word line drivers (not shown) to energize the selected word line in main array 2 in the read cycle (indicated by read enable signal READ), at the appropriate time responsive to a clock signal CLK.",
"In the manner discussed above, main sense amplifiers 4 asynchronously sense the state of bit lines BL and present corresponding output signals indicating the sensed data states to read data latches 6.In this conventional OTP architecture, read data latches 6 latch the output data D_OUT presented by main sense amplifiers 4 in response to a LATCH_DATA signal.",
"Tracking circuit 8 also generates a reset signal RESET to control logic 5 at this time, to allow the memory to prepare for the next cycle once the output data are latched at interval t2-t1 from read data latches 6.According to this conventional OTP architecture, the timing of the LATCH_DATA signal is derived from a tracking circuit 8 that tracks the sensing of a data level stored at one or more replica memory cells 2R following the energizing of the word line enable signal WL_EN.",
"Each replica cell 2R is typically hard-wired to a particular data state, and is coupled to replica bit line RBL as word line enable signal WL_EN is energized.",
"If multiple replica cells 2R are used, these cells 2R are typically ganged together along one or more replica bit lines RBL to minimize the effects of local device variation.",
"Replica sense amplifier 4R issues a signal to tracking circuit 8 in response to a transition at replica bit line RBL.",
"Tracking circuit 8 in turn generates the LATCH_DATA signal, which is (theoretically) at the time that replica sense amplifier 4R produces a stable D_OUT state from the levels at replica bit lines RBL, plus an additional time margin to allow for variation over main array 2.For the reasons discussed above, the timing of this LATCH_DATA signal is critical in the overall performance of this OTP memory.",
"If the LATCH_DATA signal is applied to latches 6 too early in the cycle, the noise margin of the read operation is poor; if it is applied too late in the cycle, the cycle time of the memory is degraded.",
"It has been observed, however, that conventional tracking circuit approaches are limited in the precision with which sense amplifier or data latch timing can be attained in one-time programmable (OTP) memories.",
"As known in the art, the electrical behavior of OTP memory cells changes over the life of the device, for example because the charge stored at the floating gate of the bit cell transistor leaks or is otherwise weakened.",
"This change in behavior is typically reflected in degradation of the read performance of a programmed (i.e., “1” data state) cell over time.",
"Unfortunately, referring to FIG.",
"1, replica OTP cells 2R will degrade differently over time than will the average cells in main array 2, if for no other reason because replica cells 2R are accessed in each and every read cycle, while cells in main array 2 are accessed much less frequently, on average.",
"To avoid the resulting variation in read performance over time, many conventional OTP memories realize replica cells 2R as non-programmable transistors, for example as p-channel MOS load transistors, so that the timing of the LATCH_DATA signal is invariant over the device life.",
"However, the use of different transistor types and arrangements for replica cells 2R from those of the cells in main array 2 results in the tracking circuit and the actual data path exhibiting different behavior over variations in power supply voltage, temperature, and process parameters.",
"FIG.",
"2a qualitatively illustrates the effect of variations in these parameters on the timing determination in the OTP memory of FIG.",
"1.In this example of FIG.",
"2a, plot VBLBC exhibits the bit line voltage VBLBC for a “0” to “1” transition following energizing of the selected word line in main array 2 for a “best case” condition of power supply voltage, temperature, and process parameters.",
"As shown in FIG.",
"2a, this bit line voltage VBLBC reaches a trip voltage Vtrip at a time t0, at which time the LATCH_DATA signal may be issued to read data latches 6 to accurately latch the output D_OUT of sense amplifiers 4.The “worst case” condition of voltage, temperature, and process on the development of the bit line voltage in this OTP memory is shown by plot VBLWC, which reaches the trip voltage Vtrip at a later time t1.While the tracking circuit may be arranged to issue the LATCH_DATA signal at any time following worst case time t1, the construction of replica cells 2R from different transistors than the memory cell devices in the main array 2 necessitates the implementation of some timing margin to account for the eventual degradation of the main array cells over system life.",
"Accordingly, the arrangement of replica cells 2R, replica sense amplifier 4R, and tracking circuit 8 in this conventional OTP memory is typically arranged so that the time at which the reference bit line voltage VRBL reaches the trip voltage Vtrip is later than the worst case time t1 for main array 2.FIG.",
"2a shows an example of this slower development of the reference bit line voltage VRBL, reaching trip voltage Vtrip at time t2.This margin provided by the interval t2-t1 directly impacts the cycle time of the memory.",
"FIG.",
"2b illustrates the generation of a stable “1” level at the output D_OUT of sense amplifiers 4 following the issuance of the clock signal CLK to control logic 5 in this architecture.",
"The timing margin indicated by time interval t2-t1, after the worst case time at which the reference bit line voltage VRBL reaches the trip voltage Vtrip, accounts for degradation of the main array cells over device life.",
"In current-day OTP memories, this t2-t1 margin can range from 30 nsec to as much as 100 nsec, depending on memory size.",
"This margin interval t2-t1 can be a significant fraction of the overall cycle time Tcyc of the memory, and thus can affect the overall performance of the device.",
"SUMMARY Disclosed embodiments provide a timing architecture for the read data path in one-time programmable (OTP) memories in which memory cycle time is minimized.",
"Disclosed embodiments provide such a memory architecture in which the timing of the read data path adjusts with changes in bit cell performance over the operating life of the memory.",
"Disclosed embodiments provide such a memory architecture requiring minimal timing margin to account for cell degradation.",
"Disclosed embodiments provide such a memory architecture in which the read power consumption is reduced.",
"Disclosed embodiments provide such a memory architecture that can be realized by less complex circuitry than in conventional memories.",
"Other objects and advantages of the disclosed embodiments will be apparent to those of ordinary skill in the art having reference to the following specification together with its drawings.",
"According to certain embodiments, a programmable memory includes a read data path in which a transition in the data path itself is used to latch the data state sensed from an accessed memory cell.",
"Latch set-reset logic is provided so that, in a read operation, a transition at the output of a sense amplifier caused by a selected memory cell storing a programmed cell state, clocks a data latch to store that data state and to isolate its input from the sense amplifier.",
"The latch set-reset logic resets the data latch at the start of the next read cycle.",
"In some embodiments, a timer is provided so that the latch is reset after a time-out period in a long read cycle in which no data transition occurs.",
"BRIEF DESCRIPTION OF THE DRAWING FIG.",
"1 is an electrical diagram, in block form, of the functional architecture of a conventional one-time programmable (OTP) memory.",
"FIG.",
"2a is a plot illustrating sense amplifier response to bit line voltage in a conventional OTP memory.",
"FIG.",
"2b is a timing diagram illustrating the sense amplifier and data latch timing in a conventional OTP memory.",
"FIG.",
"3 is an electrical diagram, in block form, of a large scale integrated circuit including an OTP memory constructed according to embodiments.",
"FIG.",
"4 is an electrical diagram, in block form, of the OTP memory in the integrated circuit of FIG.",
"3, constructed according to an embodiment.",
"FIG.",
"5 is an electrical diagram, in block form, of the functional architecture of the OTP memory of FIG.",
"4 according to that embodiment.",
"FIG.",
"6 is an electrical diagram, in block and schematic form, of the data path in the OTP memory of FIG.",
"5 according to that embodiment.",
"FIGS.",
"7a and 7b are electrical diagrams, in schematic form, of the sense amplifier, data latch, and logic circuitry in the OTP memory of FIG.",
"5 according to an embodiment.",
"FIG.",
"8 is a timing diagram illustrating the sense amplifier and data latch timing of the OTP memory of FIG.",
"5 according to an embodiment.",
"DETAILED DESCRIPTION The one or more embodiments described in this specification are implemented into a one-time programmable (OTP), electrically programmable, read only memory, such as may be implemented into a microcontroller or other large scale integrated circuits, as it is contemplated that such implementation is particularly advantageous in that context.",
"However, it is also contemplated that concepts of this invention may be beneficially applied to other applications, for example stand-alone OTP memory devices, as well as other memory technologies, particularly those for which tracking cells may not match the main memory cells in electrical characteristics and performance.",
"Accordingly, it is to be understood that the following description is provided by way of example only, and is not intended to limit the true scope of this invention as claimed.",
"FIG.",
"3 illustrates an example of large-scale integrated circuit 10 in the form of a so-called “system-on-a-chip” (“SoC”), as now popular in many electronic systems.",
"Integrated circuit 10 is a single-chip integrated circuit into which an entire computer architecture is realized.",
"As such, in this example, integrated circuit 10 includes microprocessor 12, which is connected to system bus SBUS and serves as the central processing unit of the device.",
"Various memory resources, including random access memory (RAM) 18 and one-time programmable read-only memory (OTP) 19, reside on system bus SBUS and are thus accessible to microprocessor 12.In this example, OTP 19 is of a type that may be erasable by exposure to ultraviolet light, namely as a UV EPROM.",
"In this example, if integrated circuit 10 is packaged in a conventional opaque package, OTP 19 may be programmed once after being packaged but cannot be erased.",
"Alternatively, as will be mentioned below, if integrated circuit 10 is packaged with a window by way of which the memory array of OTP 19 is visible, OTP 19 may serve as a UV EPROM.",
"Other implementations of this non-volatile memory shown in FIG.",
"3 as OTP 19 are contemplated, including electrically-erasable and flash implementations.",
"In any case, OTP 19 in FIG.",
"3 is contemplated to typically serve as program memory storing the program instructions executable by microprocessor 12, while RAM 18 serves as data memory.",
"In some cases, program instructions may reside in RAM 18 for recall and execution by microprocessor 12.Other system functions are shown in integrated circuit 10 in a generic sense, by way of system control 14 and input/output interface 17.Those skilled in the art having reference to this specification will recognize that integrated circuit 10 may include additional or alternative functions to those shown in FIG.",
"3, or may have its functions arranged according to a different architecture from that shown in FIG.",
"3.The architecture and functionality of integrated circuit 10 is thus provided only by way of example, and is not intended to limit the scope of the claims.",
"FIG.",
"4 illustrates an example of the architecture of OTP 19 according to embodiments of this invention.",
"While FIG.",
"2 illustrates OTP 19 as embedded memory within larger-scale integrated circuit 10, OTP 19 may alternatively correspond to a stand-alone memory integrated circuit.",
"Those skilled in the art having reference to this specification will also comprehend that the memory architecture of OTP 19 in FIG.",
"3 is provided by way of example only, and that the memory architecture of other embodiments may vary significantly from that shown in FIG.",
"3.In this example, OTP 19 includes memory array 20 containing programmable read-only memory cells arranged in rows and columns.",
"While a single instance of memory array 20 is shown in FIG.",
"3, it is to be understood that OTP 19 may include multiple memory arrays 20, each corresponding to a memory block within the address space of OTP 19.In the example shown in FIG.",
"3, memory array 20 includes m rows and n columns of floating-gate memory cells, each of which stores one data bit.",
"In these embodiments, cells in the same column share a single bit line BL[n-1:0], and cells in the same row share one of word lines WL[m-1:0].",
"Memory array 20 may be alternatively arranged to include multiple array blocks or sub-arrays of cells, depending on the addressing space or memory architecture.",
"Predecoder and control logic block 25 includes decoder logic and other control logic for controlling the access of selected cells in memory array 20.In this embodiment, predecoder and control logic block 25 receives a memory address from external to OTP 19, for example from microprocessor 12 via bus SBUS (FIG.",
"3), along with a clock signal CLK, and one of enable signals READ or PROG that indicates whether a read or program operation, respectively, is to be performed.",
"Clock signal CLK may be provided by a clock generator circuit (not shown) in integrated circuit 10, while the applicable READ and PROG signals are typically provided by the particular function in integrated circuit 10 that is accessing OTP 19 (e.g., microprocessor 12).",
"In a general sense, predecoder and control logic block 25 operates to at least partially decode row and column portions of the received memory address upon receiving an instance of clock signal CLK, and will control the various functions within OTP 19 to carry out the desired read or program function.",
"In read cycles, word line driver 24 receives, from predecoder and control logic block 25, row address signals that indicate the particular row of memory array 20 to be accessed along with the appropriate timing signal.",
"In response, word line driver 24 energizes the one of word lines WL[m-1:0] corresponding to the decoded row address value, which causes the cells in that corresponding row to present a voltage or current dependent on the data state stored in each of those cells to its corresponding bit line BL[n-1:0] for its column.",
"In the architecture of FIG.",
"4, column select circuit 26 is constructed essentially as a multiplexer to select one or more of bit lines BL[n-1:0] for coupling to sense amplifiers 28, in response to the column address (as may be at least partially decoded by predecoder and control logic block 25).",
"The number of sense amplifiers 28 typically corresponds to the width of the output data word.",
"Sense amplifiers 28 essentially digitize the voltage or current on the selected bit lines BL[n-1:0], and forward the result to data latches 30, for eventual buffering and presentation on data output lines Q_OUT.",
"As will be described in further detail below, the enabling and timing of sense amplifiers 28 and data latches 30 will be based in large part on the data transitions along the data path itself.",
"Write circuitry (not shown) will also be provided in OTP 19 to program selected memory cells with data presented on data input bus D_IN in the conventional manner, specifically by the selective application of the proper programming voltages to selected bit lines BL[n-1:0].",
"It is contemplated that this write circuitry and the programming operation may be implemented in any one of a number of conventional techniques for electrically programmable memory, as known in the art.",
"Other circuitry, including precharge and bias circuitry for precharging and biasing bit lines BL[n-1:0], generating programming voltages, control signals, and the like, will be included within OTP 19, as typical for electrically-programmable memories as will be understood by those skilled in the art having reference to this specification.",
"FIG.",
"5 illustrates the functional architecture of OTP 19 in connection with the timing of the latching of sensed data in its read data path.",
"According to these embodiments, OTP bit cells are arranged as rows and columns in main array 22, with the cells in the same row sharing a word line and the cells in the same column sharing a bit line BL in the conventional manner.",
"At the beginning of each read cycle, bit lines BL are initialized to a particular logic level, such as the logic level exhibited by a bit cell in its unprogrammed state.",
"Control logic 25 represents timing logic circuitry that, at the appropriate time in a read cycle (indicated by read enable signal READ) and responsive to a clock signal CLK, generates a word line enable signal WL_EN that in turn causes the energizing of a selected word line in main array 22.In the conventional manner, the cells in the selected row apply their data states to corresponding bit lines BL, selected ones of which are applied to corresponding sense amplifiers 28.Sense amplifiers 28 sense the levels at the selected bit lines BL, and present the sensed data states to corresponding data latches 30 on lines SA_OUT.",
"According to this embodiment, each data latch 30 latches the sensed data state in response to a transition at its output D_OUT (e.g., a low-to-high transition, indicating that the corresponding cell was programmed to a “1” data state).",
"Additionally, according to these embodiments, that same transition at the output of each data latch 30 also operates to isolate its input from its corresponding sense amplifier 28.The output data states on respective output lines D_OUT are forwarded to the destination, for example via an output buffer.",
"Conversely, according to these embodiments, if no transition occurs at output D_OUT (i.e., the corresponding selected memory cell in main array 22 being in its un-programmed state), data latch 30 does not latch its data state, but remains in its initialized condition.",
"In any case, control logic 25 resets sense amplifiers 28 and data latches 30 in advance of the next read operation, for example in response to the rising edge of clock signal CLK at the beginning of the next cycle.",
"In those instances in which the selected cell in a read cycle is in its unprogrammed state such that no transition at the output of sense amplifier 28 occurs, leakage current may flow from the bit cell through its sense amplifier 28.According to some of these embodiments, timer 27 is provided in OTP memory 19 to measure a time out period from the initiation of a previous cycle and, upon reaching the end of that period without a new cycle starting, to cause control logic 25 to issue a sense amplifier reset signal on line SA_RST and also a reset signal to data latch 30; this time-out ensures the resetting of those sense amplifiers 28 that did not sense a data level transition in the previous cycle, eliminating this leakage path and undesired power consumption.",
"As a result of this operation, the latching of data in the read data path is essentially “self-timed”, in the sense that a data transition in the data path itself clocks the latching of the output data.",
"No tracking circuit or replica cells are required, avoiding the timing inaccuracies in one-time programmable memories in which the replica cells either do not match the actual cells in electrical characteristics at the time of manufacture or degrade differently from the actual cells over the operating life of the device.",
"Indeed, the self-timing of the data path results in faster read cycle times than in the conventional memories utilizing tracking circuits, considering that the excess timing margin (t2-t1 margin in FIG.",
"2b) necessitated by the differences in replica cells is not needed.",
"The construction of OTP 19 according to an embodiment will now be described in further detail with reference to FIG.",
"6 for the example of four representative bit cells 32 (i.e., bit cells 320,0, 320,1, 321,0, 321,1 as shown in FIG.",
"6) in array 22.It is of course contemplated that many more bit cells 32 will typically be included in a given instance of array 22, as appropriate for the program code or other contents of that memory resource in integrated circuit 10.In addition, while the arrangement of FIG.",
"6 illustrates a single instance of sense amplifier 28 and of data latch 30 in this read data path, by way of example, it is of course contemplated that multiple sense amplifiers 28 and data latches 30 will simultaneously be operating in the same manner in those memories in which the data word width is greater than a single bit.",
"Those skilled in the art having reference to this specification will understand that the construction shown in FIG.",
"6 will be representative of that for each of the multiple instances of that circuitry.",
"In this embodiment, each bit cell 32j,k includes p-channel floating-gate MOS transistor 31 with its source/drain path connected in series with that of p-channel MOS select transistor 33 between a power supply voltage (e.g., the Vdd power supply voltage) and its corresponding bit line BLk.",
"The gate of select transistor 33 in each bit cell 32j,k receives the word line WLj for its row; in this example, because select transistor 33 is a p-channel MOS device, word line WLj will be energized when driven to a low logic level by word line drivers 24.Word line drivers 24 energize the selected word line WLj in response to the row address signals X_DEC, which have been at least partially decoded by pre-decoder 37.The data state of a given bit cell 32j,k depends on whether its floating gate transistor 31 is programmed to have charge trapped on its floating-gate electrode.",
"In this embodiment, the unprogrammed state of a bit cell 32j,k is that state in which its floating-gate transistor 31 is not conductive, and the programmed state is that in which sufficient electrons are trapped at the floating gate electrode to render that transistor 31 conductive upon application of sufficient source-drain voltage.",
"Accordingly, the state of floating-gate transistor 31 of bit cell 32j,k determines the voltage at bit line BLk when its word line WLj is energized so as to turn on select transistor 33.If cell 32j,k is programmed, conduction through transistor 31 will apply a high voltage (Vcc) to bit line BLj when word line WLj is energized and its select transistor 33 is on.",
"Conversely, if cell 32j,k is unprogrammed and thus non-conductive when select transistor 33 is turned on by word line WLj, the Vcc voltage will not be applied to that bit line BLj.",
"In this unprogrammed state, a selected bit cell 32j,k will thus not consume any power other than that resulting from leakage current; this effect is used to advantage in this embodiment.",
"Bit lines BLk are coupled to column select circuitry 26, which receives decoded column address signals Y_DEC from pre-decoder 37 and selects one of those bit lines BLk for application to sense amplifier 28 via line BL_OUT.",
"Sense amplifier 28 compares the voltage or read current at the selected bit line BL_OUT with a reference level, and presents a corresponding data state on line SA_OUT to data latch 30 as described above relative to FIG.",
"5.In this embodiment, data latch 30 is transparent during the sensing of the addressed memory cell 32j,k, and as such the sensed data level at line SA_OUT is communicated through data latch 30 to its output on line D_OUT.",
"Output buffer 38 in turn presents that data state at its output Q_OUT, for communication to the appropriate destination in integrated circuit 10.As shown in FIG.",
"6, predecoder and control logic 25 includes clock generator 36 that produces internal clock signals for OTP 19 from clock signal CLK.",
"Clock signal CLK may be produced by clock circuitry (not shown) elsewhere in integrated circuit 10.In the read circuitry of OTP 19 according to this embodiment, the internal clock signals produced by clock generator 36 include clock signal ACLK that is applied to predecoder 37 and control logic 35, and reset signal RESET applied to timer 27, both produced, for example, after suitable times following a rising edge of clock signal CLK.",
"As mentioned above, predecoder 37 receives the desired memory address from the requesting function in integrated circuit 10 (e.g., via bus SBUS of FIG.",
"3) and, in response to the clock signal ACLK from clock generator 36, at least partially decodes that memory address for use by word line drivers 24 and column select circuit 26.Timer 27 is a conventional timer circuit that, in this embodiment, measures a maximum cycle time period beginning from the reset signal RESET from clock generator 36 at the beginning of the cycle.",
"As will be described below in connection with its operation, OTP 19 according to these embodiments is initialized at the beginning of a read cycle, rather than at the end of the read operation as may be indicated by a tracking circuit in conventional memories.",
"Because the data latch timing is based on a one-way transition in the read path according to the self-timing operation, reset will not otherwise occur in read cycles in which no data transition is detected, particularly if that cycle is not soon followed by another read operation.",
"Accordingly, the operation of timer 27 ensures reset of sense amplifiers 28 and initialization of bit lines BL in array 22 after some specified maximum time-out period.",
"For example, if the nominal read cycle period of OTP 19 is on the order of 50 nsec, a suitable time-out period measured by timer 27 may be on the order of 200 nsec or longer.",
"Upon the expiration of the time-out period, timer 27 issues a signal EOC to control logic 35.Control logic 35 is constructed as logic circuitry that issues control signals to various circuits in the read path according to these embodiments.",
"As mentioned above, control logic 35 receives internal clock signal ACLK from clock generator 36, end-of-cycle signal EOC from timer 27, and the read and program control signals READ and PRGM, respectively, from microprocessor 12 or another function in integrated circuit 10, indicating the type of cycle to be performed by OTP 19.According to the embodiment of FIG.",
"6, control logic 35 issues an enable signal ENSAZ to latch set-reset logic 34 and to sense amplifiers 28 in response to the internal clock signal ACLK at the beginning of a read cycle (as indicated by the READ control signal); enable signal ENSAZ is also issued by control logic 35 in response to the end-of-cycle signal EOC from timer 27.According to this embodiment, and as will be described in further detail below, enable signal ENSAZ operates to reset sense amplifiers 28 and initiate reset of data latches 30.In addition to enable signal ENSAZ, line D_OUT from the output of data latch 30 is communicated to latch set-reset logic 34.As discussed above and as will be described in further detail below, latch set-reset logic 34 issues a latch signal LAT to data latch 30 in response to a transition at line D_OUT, latching that data state into data latch 30 to allow sense amplifier 28 and the remainder of the upstream circuitry can be reset for the next cycle.",
"As shown in FIG.",
"6, latch signal LAT is also applied to sense amplifier 28 to disable it responsive to the transition at line D_OUT.",
"FIGS.",
"7a and 7b illustrate the data path circuitry of OTP 19 according to the embodiment of FIG.",
"6 in further detail.",
"In FIG.",
"7a, a single bit cell 32j,k is illustrated for the sake of clarity; it will of course be understood that the particular bit cell 32j,k coupled to this instance of sense amplifier 28 will be the one corresponding to the decoded memory address.",
"As shown in FIG.",
"7a, bit line BLk is associated with a corresponding precharge transistor 42k having its source/drain path connected between bit line BLk and ground, and its gate receiving control signal BLDIS from control logic 35 or other appropriate circuitry in OTP 19.According to this embodiment, each bit line BLk will be initialized by its associated precharge transistor 42k to a voltage corresponding to the unprogrammed state for bit cells 32, prior to the initiation of a read operation.",
"As such, if the selected bit cell 32j,k for bit line BLk is in the unprogrammed state, no transition will occur at bit line BLk.",
"Conversely, if selected bit cell 32j,k is in its programmed state, bit line BLk will make a transition from its precharged level, in this embodiment from ground to a high voltage (e.g., approaching Vcc).",
"Column select transistor 26k has its source/drain path connected between bit line BLk and its associated sense amplifier 28, and receives decoded column select signal CSELk at its gate.",
"If bit line BLk corresponds to the column indicated by the received column address, decoded signal CSELk is energized, turning on transistor 26k to connect bit line BLk to sense amplifier 28, at sense node SN.",
"Sense amplifier 28 in this embodiment is essentially a current comparator, comparing the current conducted from bit line BLk to a reference current.",
"The reference current in sense amplifier 28 is established by reference transistor 45, which has its source/drain path connected in series with that of transistor 46 between sense node SN and ground.",
"The gate of reference transistor 45 receives a bias voltage NBIAS from a reference circuit elsewhere in OTP 19 or integrated circuit 10, while transistor 46 receives the latch signal LAT from latch set-reset logic 34 as will be described below.",
"Bias voltage NBIAS establishes the reference current conducted by transistors 45 and 46 in the read cycle, such that the voltage at sense node SN depends on whether the current from the selected cell 32j,k via bit line BLk exceeds the reference current.",
"For bit cell 32j,k in the unprogrammed state, bit line BLk will conduct at most a leakage current, and transistors 45 and 46 will pull sense node SN to ground.",
"For bit cell 32j,k in its programmed (i.e., conductive) state, the bit line current will be sufficient to overcome the smaller reference current established by reference transistor 45, and the voltage of sense node SN will rise toward Vcc.",
"Inverters 40a, 40b, connected in series between sense node SN and data latch 30, produce a logic level at the output SA OUT of sense amplifier 28 corresponding to the voltage at sense node SN and thus to the state of selected bit cell 32j,k.",
"According to this embodiment, data latch 30 includes a first pass gate 50a coupled to the output SA OUT of sense amplifier 28 and controlled by latch signal LAT from latch set-reset logic 34.Pass gate 50a may be constructed as a pair of complementary MOS transistors with their source/drain paths in parallel and receiving complementary signals at their respective gates (i.e., latch signal LAT and its complement LATZ, in this example) as known in the art, or alternatively may be a single pass transistor.",
"The opposite side of pass gate 50a is connected to the input of inverter 52a, which has its output connected to an input of each of inverters 52b, 52c.",
"Pass gate 50b connects the output of inverter 52b to the input of inverter 52a to form a latch when pass gate 50b is conductive.",
"In this embodiment, pass gate 50b receives complement latch signal LATZ, generated from latch signal LAT by inverter 49.As such, pass gate 50b is off when pass gate 50a is on (with latch signal LAT at a high logic level), and pass gate 50a is off when pass gate 50b is on (with latch signal LAT at a low logic level).",
"Latch output D_OUT at the output of inverter 52c is applied to output buffer 38 and to latch set-reset logic 34.FIG.",
"7b illustrates the construction of latch set-reset logic 34 according to this embodiment.",
"Latch set-reset logic 34 includes a pair of cross-coupled NAND gates 54a, 54b, each having an input receiving the output of the other.",
"The other input of NAND gate 54a receives the logical complement (via inverter 55a) of enable signal ENSAZ from control logic 35 (FIG.",
"6).",
"The other input of NAND gate 54b receives the logical complement (via inverter 55b) of latch output D_OUT.",
"Accordingly, latch set-reset logic 34 is operable to assert latch signal LAT in response to a high logic level at either enable signal ENSAZ or at latch output D_OUT.",
"Of course, latch set-reset logic 34 may be realized by other logic circuit arrangements to carry out the functions of control logic 25 according to these embodiments.",
"For example, in the embodiment shown in FIG.",
"7a, latch signal LAT from latch set-reset logic 34 is applied to the gate of transistor 46 in sense amplifier 28, simplifying the logic arrangement of this circuitry for efficient implementation.",
"Alternatively, control logic 25 may be arranged to disable sense amplifier 28 (e.g., by turning off its transistor 46) separately from the setting and resetting of data latch 30.It is contemplated that those skilled in the art will be readily able to realize the particular arrangement of control logic 25, including latch set-reset logic 34, in the manner desired for each specific implementation of these embodiments.",
"Referring now to FIG.",
"8, an example the operation of the read path architecture of OTP 19 according to the embodiment of FIGS.",
"6, 7a, and 7b in carrying out a read cycle will now be described, specifically for the case of an OTP cell 32j,k programmed to a “1” data state (i.e., having charge trapped at the floating-gate of transistor 31 to render it conductive).",
"As will be apparent from this description, in the previous read cycle and thus prior to the beginning of the read cycle at time t0, latch set-reset logic 34 has issued latch signal LAT at a logic low level.",
"In data latch 30, pass transistor 50a is thus off and pass transistor 50b is on, such that data latch 30 is retaining the previous data state D_OUT and presenting the corresponding logic level at its output D_OUT.",
"In this example, the read cycle begins with a rising edge of clock signal CLK applied to clock generator 36 (FIG.",
"6), in response to which clock generator 36 issues a trailing edge of internal clock signal ACLK to predecoder 37 and control logic 35 to initiate the cycle.",
"As described above relative to FIG.",
"7a, bit lines BLk are each precharged to ground, for example by control circuitry briefly asserting signal BLDIS to turn on transistors 42k in response to this transition of internal clock signal ACLK.",
"The high-to-low transition of internal clock signal ACLK also causes predecoder 37 to begin the decoding of the received row and column addresses, for example from system bus SBUS, for application to word line drivers 24 and column select circuit 26, which in turn respectively initiate the access of the selected row of cells and the selection of those bit lines BLk that are to be sensed.",
"In this example, the selected cell 32j,k in row j and column k is in its programmed (“1”) state, and as such will pull its selected bit line BLk to a high voltage for sensing.",
"In a read cycle (i.e., with read signal READ asserted) and in response to internal clock signal ACLK, control logic 35 issues a pulse of enable signal ENSAZ to sense amplifier 28 and latch set-reset logic 34.In this embodiment of the invention, this enable signal ENSAZ pulse initializes each sense node SN to a low level by turning on transistor 44 in each sense amplifier 28.In addition, as shown in FIG.",
"8, the rising edge of the ENSAZ pulse causes latch set-reset logic 34 to issue a rising edge of latch signal LAT to sense amplifier 28 and data latch 30 according to this embodiment.",
"The high level of latch signal LAT turns on transistor 46 in sense amplifier 28, allowing conduction of the reference current from sense node SN through transistor 45, under the control of bias voltage NBIAS.",
"In addition, latch signal LAT “resets” data latch 30 by turning on its pass gate 50a and turning off its pass gate 50b.",
"In this “reset” state, the previous state stored in data latch 30 is no longer latched, and the current level at sense amplifier output SA OUT passes through data latch 30 via inverters 50a, 50c.",
"At the end of the pulse of enable signal ENSAZ, as determined by control logic 35, transistor 44 is turned off so that sense node SN is no longer held at ground except through reference transistor 45.Accordingly, the voltage at selected bit line BLk, as determined by the data state of the selected cell 32j,k, will be reflected at sense node SN to the extent that the read current through selected cell 32j,k exceeds the reference current through transistor 45.For the “1” state, as described above, the read current will exceed the reference current, and sense node SN will be pulled up to a high level with bit line BLk.",
"Referring to FIG.",
"8, in response to bit line BLk (and thus sense node SN) reaching the trip voltage Vtrip of inverter 40a of sense amplifier 28, sense amplifier output SA OUT makes a transition to a high logic level as driven by inverter 40b.",
"With pass gate 50a in data latch 30 turned on (latch signal LAT being high at this time), the high logic level at sense amplifier SA OUT is reflected at latch output D_OUT following the propagation delay through inverters 52a, 52c.",
"Access time Tacc shown in FIG.",
"8 refers to the time interval between the rising edge of clock signal CLK and the low-to-high transition at latch output D_OUT.",
"Because data latch 30 is transparent during the sense operation, this access time Tacc essentially depends on the read current supplied by the addressed memory cell 32j,k in its “1” data state.",
"Buffer 38 then presents that high logic level on line Q_OUT in the data path of OTP 19.According to this embodiment, latch set-reset logic 34 terminates the pulse of latch signal LAT in response to the low-to-high transition at latch output D_OUT.",
"Specifically, the trailing edge of latch signal LAT “sets” data latch 30 by turning off pass gate 50a and turning on pass gate 50b, such that the output of inverter 52b is coupled to the input of inverter 52a.",
"The sensed “1” data state is latched into and retained by data latch 30 in this “set” state, and is no longer influenced by the level at sense amplifier output SA_OUT.",
"In addition, also according to this embodiment, transistor 46 in sense amplifier 28 is turned off, ending the sense operation for this cycle.",
"In this state, as described above, the low level of latch signal LAT maintains sense amplifier 28 off and data latch 30 de-coupled from sense amplifier SA_OUT.",
"Precharge transistor 42k is turned on to initialize bit line BLk in the next cycle, and as such the programmed selected cell 32j,k draws no current other than leakage current.",
"Data latch 30 maintains the “1” data state at data output line Q for the remainder of the cycle.",
"This state is maintained until the next rising edge of clock signal CLK, which starts the next cycle for OTP 19.For the case of a unprogrammed (“0”) cell 32j,k, the operation of OTP 19 is similar to that described above relative to FIG.",
"8, except that no transition occurs at sense amplifier output SA_OUT, and therefore no transition occurs at latch output D_OUT.",
"No pulse of latch signal LAT is thus generated by latch set-reset logic 34.Data latch 30 remains unlatched in this case (pass gate 50b remains off), and simply passes the low logic level at sense amplifier output SA_OUT to buffer 38 for presentation at data output Q_OUT.",
"Since the pulse of latch signal LAT is not terminated for this “0” data state case, transistor 46 remains on and thus sense amplifier 28 remains on for the duration of the cycle.",
"Any leakage current through the “0” state cell 32j,k will thus be conducted along bit line BLk and through transistors 45 and 46 to ground.",
"Because floating-gate transistor 33 in the selected cell 32j,k is not held off with a hard gate voltage, however, it is contemplated that some leakage current can occur from some of the cells 32 in array 22.While this leakage may not be significant over relatively short cycle times (i.e., between rising edges of clock signal CLK, shown as Tcyc in FIG.",
"8), the leakage power consumed can be significant in long cycle times, which can frequently occur for OTP 19 given its static nature.",
"For example, the last cycle in a burst read of OTP 19 can be quite long, extending from the end of one burst until the beginning of the next.",
"According to this embodiment, timer 27 is provided within control logic 25 to initiate a reset of sense amplifiers 28 and data latches 30, if not occurring in response to a data transition, after a maximum allowable cycle time interval elapses.",
"Timer 27 may be constructed in the conventional manner, for example as a countdown (or count-up) timer that advances its stored contents with each cycle of a periodic clock signal.",
"In the embodiment of FIG.",
"6, timer 27 receives a reset clock RESET from clock generator 36 in response to each rising edge of clock signal CLK.",
"This transition of reset clock RESET causes timer 27 to begin measuring a time interval corresponding to a maximum cycle time, for example by executing a countdown (or up-count) of clock pulses.",
"An example of the maximum cycle time may be on the order of 200 nsec; typical cycle times in normal operation of an OTP are typically on the order 50 nsec or less.",
"Typically, timer 27 will be clocked by a higher frequency clock, for example as may be generated by clock generator 36.Upon reaching the pre-programmed or selected maximum time interval, timer 27 then issues an end-of-cycle signal EOC to control logic 35, which in turn issues a pulse of enable signal ENSAZ to latch set-reset logic 34.In response to the ENSAZ pulse, as described above latch set-reset logic 34 issues a pulse of latch signal LAT, setting data latch 30 to store the “0” data state at sense amplifier output SA_OUT, and turning off sense amplifier 28 by turning off transistor 46.With sense amplifier 28 disabled in this manner, any leakage current through unprogrammed “0” cell 32j,k will be blocked by the off-state transistor 46 from communication to ground, and excess power consumption will be minimized.",
"Accordingly, these embodiments operate to “self-latch” the sensed data state of the selected OTP cell, at a timing corresponding to transition of the sensed data state itself.",
"No tracking circuit or replica cells are required for controlling the timing of the data latch, as in conventional OTP memories.",
"As a result, the self-timing of the data latch can essentially be as fast as the operation of the memory itself, and need not include the excessive timing margin of conventional tracking circuits that must allow for variations between the replica cells or other delay circuits with the performance of the OTP cells over the operating life of the device.",
"Rather, as the OTP cell performance may degrade over the operating life, the self-latching operation according to these embodiments will precisely follow any such degradation.",
"Referring to FIG.",
"2a, the cycle time Tcyc of OTP 19 according to these embodiments can be minimized, because the need to include “t2-t1 margin” as shown in FIGS.",
"2a and 2b is eliminated according to these embodiments.",
"In addition, these embodiments implement the self-latching read data path in a manner that minimizes excessive power consumption, and that can be efficiently realized, from the standpoint of chip area and circuit complexity, in modern integrated circuits.",
"While one or more embodiments have been described in this specification, it is of course contemplated that modifications of, and alternatives to, these embodiments, such modifications and alternatives capable of obtaining one or more the advantages and benefits of this invention, will be apparent to those of ordinary skill in the art having reference to this specification and its drawings.",
"It is contemplated that such modifications and alternatives are within the scope of this invention as subsequently claimed herein."
]
] |
Patent_15871381
|
[
[
"GLASS SHEET FORMING AND ANNEALING SYSTEM PROVIDING EDGE STRESS CONTROL",
"A glass sheet forming and annealing system disclosed provides control of edge stresses by maintaining a press formed glass sheet on an annealing ring (72) below a heated upper forming mold (58) within a forming station (12) for slow cooling toward the glass strain point temperature."
],
[
"1.A system for glass sheet forming and annealing comprising: a furnace for heating a glass sheet to its forming temperature; a forming station located adjacent the furnace; a conveyor for conveying the heated glass sheet from the furnace to the forming station; the forming station having an upper forming mold which is heated and has a downwardly facing forming face, the forming station also having a lower forming mold that is movable upwardly to lift the heated glass sheet from the conveyor to the upper forming mold for pressing that provides the glass sheet with a formed shape, and a source of vacuum for drawing a vacuum at the upper forming mold to maintain the formed glass sheet on the upper forming mold as the lower mold is moved downwardly after the press forming; an annealing ring that is movable under the heated upper forming mold and the formed glass sheet supported thereon to receive the formed glass sheet upon termination of the vacuum drawn at the upper forming mold; and a controller that controls operation of the forming station, the conveyor, and the annealing ring, and after the formed glass sheet is received by the annealing ring the controller is configured to maintain the annealing ring and the formed glass sheet thereon in the forming station below the heated upper forming mold for at least three seconds prior to movement from the forming station for slow cooling of the formed glass sheet toward the strain point temperature to control edge stresses upon final cooling to ambient temperature.",
"2.A system for glass sheet forming and annealing as in claim 1 wherein the furnace includes a preforming end section having inclined bending rolls that preform the heated glass sheet prior to movement to the forming station for the press forming.",
"3.A method for glass sheet forming and annealing as in claim 1 wherein the system includes a roll conveyor having a flat plane of conveyance for conveying flat heated glass sheets to the forming station for the press forming.",
"4.A system for glass sheet forming and annealing as in claim 1 wherein the lower forming mold has four sides defining a ring shape and each side having a T-shaped cross section including a vertical stem and a crossbar supported on the vertical stem and having an upwardly facing forming surface, each side of the lower forming mold having a pair of electrical heating elements at lower locations below its crossbar where it is supported on its vertical stem, and the forming face of the crossbar of each side having three grooves and three electrical heating elements respectively received within the three grooves to limit heat loss from the glass sheet to control edge stresses upon final cooling to ambient temperature.",
"5.A system for glass sheet forming and annealing as in claim 4 wherein the lower forming mold has insulation within the interior and around the exterior of its ring shape.",
"6.A system for glass sheet forming and annealing as in claim 1 wherein the annealing ring includes vertically extending baffles at upstream and downstream locations relative to the direction of movement of the annealing ring from the forming station to limit cooling from air flow across the formed glass sheet during that movement.",
"7.A system for glass sheet forming and annealing as in claim 6 wherein the vertically extending baffles extend both upwardly and downwardly from the annealing ring.",
"8.A system for glass sheet forming and annealing as in claim 1 wherein the annealing ring further includes heaters and also includes insulation within its interior and around its exterior to limit heat flow from the formed glass sheet to slow its cooling.",
"9.A system for glass sheet forming and annealing as in claim 1 wherein the controller maintains the annealing ring and the formed glass sheet thereon in the forming station below the heated upper forming mold for at least five seconds, and for some glass sheets at least 6.5 seconds, prior to movement from the forming station for the slow cooling of the formed glass sheet toward the strain point temperature to control edge stresses upon final cooling to ambient temperature.",
"10.A system for glass sheet forming and annealing comprising: a furnace for heating a glass sheet to its forming temperature; the furnace including a preforming end section having inclined bending rolls for preforming the heated glass sheet with an upwardly concave shape; a forming station located adjacent the furnace; a conveyor for conveying the preformed glass sheet from the furnace to the forming station; the forming station having an upper forming mold which is heated and has a downwardly facing forming face; the forming station also having a lower forming mold that is movable upwardly to lift the preformed glass sheet from the conveyor to the upper forming mold for pressing that provides the glass sheet with a formed shape, the lower forming mold having four sides defining a ring shape and each side having a T-shaped cross section including a vertical stem and a crossbar supported on the vertical stem and having an upwardly facing forming surface, each side of the lower forming mold having a pair of electrical heating elements at lower locations below its crossbar where it is supported on its vertical stem, the forming face of the crossbar of each side having three grooves and three electrical heating elements respectively received within the three grooves to limit heat loss from the glass sheet, and the ring shape of the forming mold having insulation within its interior and around its exterior to also limit heat loss from the glass sheet; a source of vacuum for drawing a vacuum at the upper forming mold to maintain the formed glass sheet on the upper forming mold as the lower mold is moved downwardly after the press forming; an annealing ring that is movable under the heated upper forming mold and the formed glass sheet supported thereon to receive the formed glass sheet upon termination of the vacuum drawn at the upper forming mold, the annealing ring including heaters and also including upwardly and downwardly extending baffles at upstream and downstream locations relative to the direction of subsequent movement of the annealing ring from the forming station to limit cooling from air flow across the formed glass sheet during that movement, and insulation within the annealing ring and around its exterior to limit heat flow from the formed glass sheet to slow its cooling; and a controller that controls operation of the forming station, the conveyor, and the annealing ring, and that after the formed glass sheet is received by the annealing ring the controller is configured to maintain the annealing ring and the formed glass sheet thereon in the forming station below the heated upper forming mold for at least five seconds, and for some glass sheets at least 6.5 seconds, prior to movement from the forming station so as to provide the slow cooling of the formed glass sheet to the strain point temperature and thereby control edge stresses upon final cooling to ambient temperature."
],
[
"<SOH> BACKGROUND <EOH>When glass sheets are heated for forming and annealing, the glass sheet peripheral edge portions have oppositely facing surfaces and an edge surface that affect cooling and resultant tensile and compressive stresses after the annealing is completed.",
"To meet certain manufacturing specifications for formed glass sheets that are annealed, these tensile and compressive stresses must be in a controlled range which can be difficult to achieve because of increased heating and cooling that takes place at the edge portions of the glass sheet as opposed to the central regions where there are effectively only two oppositely facing surfaces from which the glass is heated and cooled.",
"See U.S. Pat.",
"Nos.",
"5,385,786 Shetterly et al.",
"; 5,536,581 Shetterly et al.",
"; 5,679,124 Schnabel, Jr. et al.",
"; 5,865,866 Schnabel, Jr. et al.",
"; 6,015,619 Schnabel, Jr. et al.",
"; 6,543,255 Bennett et al.",
"; and 6,578,383 Bennett et al., the entire disclosures of which are hereby incorporated by reference."
],
[
"<SOH> SUMMARY <EOH>An object of the present invention is to provide an improved system for glass sheet forming and annealing to control edge stresses.",
"In carrying out the above object, the system for glass sheet forming and annealing according to the invention includes a furnace for heating a glass sheet to its forming temperature, a forming station located adjacent the furnace, and a conveyor for conveying the heated glass sheet from the furnace to the forming station.",
"The forming station has an upper forming mold which is heated and has a downwardly facing forming face.",
"The forming station also has a lower forming mold that is movable upwardly to lift the heated glass sheet from the conveyor to the upper forming mold for pressing that provides the glass sheet with a formed shape, and a source of vacuum for drawing a vacuum at the upper forming mold to maintain the formed glass sheet on the upper forming mold as the lower mold is moved downwardly after the press forming.",
"An annealing ring of the system is movable under the heated upper forming mold and the formed glass sheet supported thereon to receive the formed glass sheet upon termination of the vacuum drawn at the upper forming mold.",
"A controller of the system controls operation of the forming station, the conveyor, and the annealing ring, and after the formed glass sheet is received by the annealing ring the controller is configured to maintain the annealing ring and the formed glass sheet thereon in the forming station below the heated upper forming mold for at least three seconds prior to movement from the forming station so as to provide slow cooling of the formed glass sheet toward the strain point temperature and thereby control edge stresses upon final cooling to ambient temperature.",
"The system is disclosed in one embodiment as having its furnace including a preforming end section having inclined bending rolls that preform the heated glass sheet prior to movement of the forming station for the press forming.",
"In another embodiment, the system is disclosed as including a roll conveyor having a flat plane of conveyance for conveying flat heated glass sheets to the forming station for the press forming.",
"As disclosed, the lower forming mold has four sides defining a ring shape and each side has a T-shaped cross section including a vertical stem and a crossbar supported on the vertical stem and having an upwardly facing forming surface.",
"Each side of the lower forming mold has a pair of electrical heating elements at lower locations below its crossbar where it is supported on its vertical stem, and the forming face of the crossbar of each side has three grooves and three electrical heating elements respectively received within the three grooves to limit heat loss from the glass sheet to control edge stresses upon final cooling to ambient temperature.",
"As disclosed, the lower forming mold has insulation within the interior and around the exterior of its ring shape.",
"Also, the disclosed annealing ring includes vertically extending baffles at upstream and downstream locations relative to the direction of movement of the annealing ring from the forming station to limit cooling from air flow across the formed glass sheet during that movement.",
"The vertically extending baffles as disclosed extend both upwardly and downwardly from the annealing ring.",
"The annealing ring includes heaters and also includes insulation within and around its exterior to limit heat flow from the formed glass sheet to provide its slow cooling.",
"The controller of the system maintains the annealing ring and the formed glass sheet thereon in the forming station below the heated upper forming mold for at least five seconds, and for some glass sheets at least 6.5 seconds, prior to movement from the forming station for the slow cooling of the formed glass sheet toward the strain point temperature to control edge stresses upon final cooling to ambient temperature."
],
[
"CROSS-REFERENCE TO RELATED APPLICATIONS This application is a divisional of U.S. patent application Ser.",
"No.",
"14/551,226 filed on Nov. 24, 2014 by Terry A. Bennett under the title GLASS SHEET FORMING AND ANNEALING PROVIDING EDGE STRESS CONTROL, the disclosure of which is hereby incorporated in its entirety by reference herein.",
"TECHNICAL FIELD This application discloses a glass sheet forming and annealing system that provides edge stress control.",
"BACKGROUND When glass sheets are heated for forming and annealing, the glass sheet peripheral edge portions have oppositely facing surfaces and an edge surface that affect cooling and resultant tensile and compressive stresses after the annealing is completed.",
"To meet certain manufacturing specifications for formed glass sheets that are annealed, these tensile and compressive stresses must be in a controlled range which can be difficult to achieve because of increased heating and cooling that takes place at the edge portions of the glass sheet as opposed to the central regions where there are effectively only two oppositely facing surfaces from which the glass is heated and cooled.",
"See U.S. Pat.",
"Nos.",
"5,385,786 Shetterly et al.",
"; 5,536,581 Shetterly et al.",
"; 5,679,124 Schnabel, Jr. et al.",
"; 5,865,866 Schnabel, Jr. et al.",
"; 6,015,619 Schnabel, Jr. et al.",
"; 6,543,255 Bennett et al.",
"; and 6,578,383 Bennett et al., the entire disclosures of which are hereby incorporated by reference.",
"SUMMARY An object of the present invention is to provide an improved system for glass sheet forming and annealing to control edge stresses.",
"In carrying out the above object, the system for glass sheet forming and annealing according to the invention includes a furnace for heating a glass sheet to its forming temperature, a forming station located adjacent the furnace, and a conveyor for conveying the heated glass sheet from the furnace to the forming station.",
"The forming station has an upper forming mold which is heated and has a downwardly facing forming face.",
"The forming station also has a lower forming mold that is movable upwardly to lift the heated glass sheet from the conveyor to the upper forming mold for pressing that provides the glass sheet with a formed shape, and a source of vacuum for drawing a vacuum at the upper forming mold to maintain the formed glass sheet on the upper forming mold as the lower mold is moved downwardly after the press forming.",
"An annealing ring of the system is movable under the heated upper forming mold and the formed glass sheet supported thereon to receive the formed glass sheet upon termination of the vacuum drawn at the upper forming mold.",
"A controller of the system controls operation of the forming station, the conveyor, and the annealing ring, and after the formed glass sheet is received by the annealing ring the controller is configured to maintain the annealing ring and the formed glass sheet thereon in the forming station below the heated upper forming mold for at least three seconds prior to movement from the forming station so as to provide slow cooling of the formed glass sheet toward the strain point temperature and thereby control edge stresses upon final cooling to ambient temperature.",
"The system is disclosed in one embodiment as having its furnace including a preforming end section having inclined bending rolls that preform the heated glass sheet prior to movement of the forming station for the press forming.",
"In another embodiment, the system is disclosed as including a roll conveyor having a flat plane of conveyance for conveying flat heated glass sheets to the forming station for the press forming.",
"As disclosed, the lower forming mold has four sides defining a ring shape and each side has a T-shaped cross section including a vertical stem and a crossbar supported on the vertical stem and having an upwardly facing forming surface.",
"Each side of the lower forming mold has a pair of electrical heating elements at lower locations below its crossbar where it is supported on its vertical stem, and the forming face of the crossbar of each side has three grooves and three electrical heating elements respectively received within the three grooves to limit heat loss from the glass sheet to control edge stresses upon final cooling to ambient temperature.",
"As disclosed, the lower forming mold has insulation within the interior and around the exterior of its ring shape.",
"Also, the disclosed annealing ring includes vertically extending baffles at upstream and downstream locations relative to the direction of movement of the annealing ring from the forming station to limit cooling from air flow across the formed glass sheet during that movement.",
"The vertically extending baffles as disclosed extend both upwardly and downwardly from the annealing ring.",
"The annealing ring includes heaters and also includes insulation within and around its exterior to limit heat flow from the formed glass sheet to provide its slow cooling.",
"The controller of the system maintains the annealing ring and the formed glass sheet thereon in the forming station below the heated upper forming mold for at least five seconds, and for some glass sheets at least 6.5 seconds, prior to movement from the forming station for the slow cooling of the formed glass sheet toward the strain point temperature to control edge stresses upon final cooling to ambient temperature.",
"BRIEF DESCRIPTION OF THE DRAWINGS FIG.",
"1 is a schematic side elevational view of one embodiment of a system for glass sheet forming and annealing according to the invention.",
"FIG.",
"2 is a schematic cross sectional view through the system taken along the direction of line 2-2 in FIG.",
"1 through a furnace preforming end section having horizontal and inclined rolls at which heated glass sheets are conveyed for initial roll forming prior to exiting the furnace in preparation for further forming.",
"FIG.",
"3 is a schematic cross sectional view taken through the system along line 3-3 in FIG.",
"1 at a forming station thereof to illustrate the construction of a lower press ring assembly having a press ring and also illustrating the construction of an upper forming mold, which press ring and upper forming mold are movable as disclosed by the solid and phantom line indicated positions to press form the initially roll formed glass sheet.",
"FIG.",
"4 is a schematic side elevational view similar to FIG.",
"1 of another embodiment of the glass sheet forming and annealing system according to the invention whose forming station forms and anneals a heated flat glass sheet received from the furnace.",
"FIG.",
"5 is a cross sectional view taken along the direction of line 5-5 in FIG.",
"4 to further illustrate the flat shape of the glass sheet prior to its press forming and annealing as shown by phantom line representation.",
"FIG.",
"6 is a schematic side elevational view similar to FIGS.",
"1 and 4 and illustrating the manner in which the formed glass sheet is released from the upper forming mold onto the annealing ring and then maintained within the forming station for a dwell time that slows cooling thereof toward the strain point temperature to provide control of the final edge stresses upon cooling to ambient temperature.",
"FIG.",
"7 is a view similar to FIG.",
"6 at a later stage after the formed glass sheet has been moved from the forming station to a cooling station for further cooling to the ambient temperature.",
"FIG.",
"8 is a flow chart that illustrates the steps involved in the forming and annealing with the embodiment of FIG.",
"1.FIG.",
"9 is a top plan view illustrating the lower forming mold which has a ring shape as disclosed with insulation both within its interior and around its exterior.",
"FIG.",
"10 is a cross sectional view taken through the lower forming mold along the direction of line 10-10 in FIG.",
"9 to illustrate the construction of heaters that maintain the glass edge portion heated during the press forming.",
"FIG.",
"11 is a top plan view of the annealing ring taken along the direction of line 11-11 in FIG.",
"6 to illustrate its construction including insulation within its interior and around its exterior as well as upstream and downstream baffles that after the dwell time limit cooling during movement of the glass sheet from the forming station.",
"FIG.",
"12 is a side elevational view taken along the direction of line 12-12 in FIG.",
"11 to further illustrate the upstream and downstream baffles.",
"FIG.",
"13 is a sectional view taken along the direction of arrows 13-13 in FIG.",
"11 to illustrate the construction of the annealing ring along each of its four sides.",
"DETAILED DESCRIPTION As required, detailed embodiments of the present invention are disclosed herein; however, it is to be understood that the disclosed embodiments are merely exemplary of the invention that may be embodied in various and alternative forms.",
"The figures are not necessarily to scale; some features may be exaggerated or minimized to show details of particular components.",
"Therefore, specific structural and functional details disclosed herein are not to be interpreted as limiting, but merely as a representative basis for teaching one skilled in the art to variously employ the present invention.",
"With reference to FIG.",
"1 of the drawings, one embodiment of the system for forming and annealing glass sheets according to the invention is generally indicated by 10.The construction and method of operation of the system will be described in an integrated manner to facilitate an understanding of different aspects of the invention.",
"The system 10 includes a forming and annealing station 12 and also includes a furnace 14 that has a preforming end section 16 just upstream along a direction of conveyance C from the forming and annealing station 12.Downstream from the forming and annealing station 12 along the direction of conveyance C, the system 10 is illustrated as including a final cooling station 18 to which the formed glass sheet after initial cooling in the forming and annealing station is further cooled to ambient temperature.",
"As illustrated by continuing reference to FIG.",
"1, the furnace 14 has entry and exit ends 20 and 22 and includes a heating chamber 24 (FIG.",
"2) having a conveyor 26 for conveying glass sheets along the direction of conveyance through the furnace from the entry end to the exit end.",
"The conveyor 26 on which the glass sheets are heated can be either a conventional gas hearth or a roll conveyor on which the glass sheets are conveyed during heating from ambient temperature to a sufficiently high temperature to permit bending.",
"The furnace exit end 22 includes the preforming end section 16 which is illustrated in FIG.",
"2 as having horizontally extending conveyor rolls 28 that are rotatively driven and spaced horizontally within the heating chamber along the direction of conveyance extending laterally with respect thereto to support and convey the heated glass sheets.",
"The preforming end section 16 also includes a pair of sets 30 of bending rolls 32, with the bending roll sets 30 spaced laterally with respect to each other within the heating chamber 24 along the direction of conveyance.",
"Each set of bending rolls 30 is supported and rotatively driven by a drive mechanism 34 with the bending rolls at progressively increasing inclinations along the direction of conveyance as illustrated by reference numerals 32a, 32b, 32c and 32d in FIG.",
"2.The conveyance of each heated glass sheet G along the direction of conveyance in cooperation with the bending rolls 32 provides bending or preforming of the heated glass sheet with an upwardly concave shape as illustrated in FIG.",
"2 along a direction transverse to the direction of conveyance.",
"With combined reference to FIGS.",
"1 and 3-5, the forming and annealing station 12 as previously mentioned is located externally of the furnace 14 downstream from its exit end 22 to receive the preformed glass sheets from the preforming end section 16.More specifically, the forming and annealing station 12 includes a conveyor 36 for receiving a heated glass sheet to be press bent.",
"The conveyor 36 includes a lower support structure 38 and a bed of a plurality of conveyor assemblies 40 specifically indicated as 40w and 40r on the support structure.",
"Each conveyor assembly 40, includes a horizontally extending elongated roller 41 located laterally at a central location of the conveyor.",
"Each conveyor assembly 40w has an upper wheel 44 for supporting and conveying upwardly formed portions of the preformed glass sheet within the press bending station.",
"A drive mechanism provides rotational driving of the roller 41 and rotational driving of the wheel 44 of each wheel assembly 40, specifically 40r or 40w, upon connection thereof to the lower support structure 38.For a more detailed description of the conveyor and the drive mechanism, refer to U.S. Pat.",
"No.",
"6,543,255 and United States patent application Publication No.",
"2011/0247367, the entire disclosures of both of which are hereby incorporated by reference.",
"As illustrated in FIG.",
"3, a lower mount of the forming and annealing station 12 is schematically illustrated at 50 and supports a lower forming mold that is disclosed as a lower press ring 52 having a concave curved shape 54 facing upwardly and being received within the conveyor 36 below the upper extremities of the horizontal rollers 41 and the wheels 44 of the conveyor assemblies 40r or 40w in a ring shape thereof where no conveyor assemblies are located.",
"As further illustrated in FIG.",
"3, an upper mount 56 of the press station 12 supports an upper forming mold 58 having a downwardly facing curved forming face 60 complementary to the upwardly curved shape 54 of the lower press ring 52.An actuator assembly collectively indicated by 62 in FIGS.",
"3 and 4 includes lower and upper actuators 62l and 62u that provide vertical movement of the lower press ring 52 and upper forming mold 58 between the solid and phantom line positions of FIG.",
"3.This vertical movement lifts the preformed glass sheet upwardly from the conveyor 36 and provides press forming of the preformed glass sheet between the lower press ring 52 and the forming face 60 of the upper forming mold 58.After the press forming, the actuators 62l and 62u respectively move the lower press ring 52 downwardly and the upper forming mold 58 upwardly.",
"The conveyor 36 has a curved shape transverse to the direction of conveyance along which the conveyor assemblies receive the preformed glass sheet, with the curved shape corresponding to its preformed curved shape provided by the preforming end station 16 illustrated in FIG.",
"2.More specifically, the support structure 38 of the conveyor 36 includes a plurality of elongated supports or rails 64 that extend along the direction of conveyance and have different elevations as shown in FIG.",
"3 along a direction transverse to the direction of conveyance to provide the support and curved shape of the conveyor assemblies 40r or 40w of the conveyor 36.With reference to FIGS.",
"4 and 5, another embodiment of the glass sheet forming and annealing system 10′ is similar to the embodiment of FIGS.",
"1-3 but operates to provide positioning and forming of flat glass sheets without any preforming as with the previously described embodiment.",
"Thus, like components thereof have the same reference numerals and same structures and much of the prior description is thus applicable except as will be noted.",
"The furnace 14 may have its conveyor 26 use the same horizontal conveyor rolls 28 as those of the FIG.",
"1-3 embodiment but without the inclined bending rolls 32 that provide the preforming, and the conveyor 36 thus has its conveyor assemblies 40 receiving a heated flat glass sheet from the furnace.",
"Thus, the furnace 16 may include the capability of installing or removing the inclined bending rolls depending upon which version is to be utilized.",
"With reference to FIGS.",
"1 and 4, the forming and annealing station 12 may have the lower press ring 52 and the forming face 60 of the upper press mold 58 provided with a straight shape along the direction of conveyance C or with a curved shape as shown along that direction in order to provide bending both along and transverse to the direction of conveyance.",
"The upper press mold 58 has its forming face 60 provided with a vacuum through vacuum holes 61 from a vacuum source 66 so as to support the bent glass sheet after the press bending.",
"The upper forming mold is heated by electric resistance heaters 67 that maintain the formed glass sheet hot as its annealing begins.",
"The upper forming mold may also have: different areas supplied with different levels of vacuum by different chambers and/or distribution tubes; and positive pressure air supplied to the forming face to provide release of glass sheets supporting thereby, see U.S. Pat.",
"Nos.",
": 4,222,763 McMaster; 4,877,437 Nitschke.",
"; 5,376,158 Shetterly et al.",
"; 5,951,733 Clark et al.",
"; and 6,227,008 Shetterly et al., the entire disclosures of which are hereby incorporated by reference.",
"With reference to FIGS.",
"6 and 7, each embodiment of the forming and annealing system includes an annealing shuttle 68 having an actuator 70 and an annealing ring 72 that is moved by the actuator into the forming station 12 as shown in FIG.",
"6 and subsequently out of the forming station to the cooling station 18 as shown in FIG.",
"7.After the press forming of the glass sheet G as illustrated by the phantom line portions of FIGS.",
"3 and 5 of the two embodiments, the source of vacuum 66 draws a vacuum in the upper forming mold 58 at its forming face 60 and the actuator assembly 62 by its lower and upper actuators 62l and 62u respectively move the lower press ring 52 downwardly and the upper forming mold upwardly to the position shown in FIG.",
"6.The annealing shuttle 68 by its actuator 70 then moves the annealing ring 72 into the forming station 12 below the upper forming mold 58 whose vacuum is then terminated and positive pressure air is supplied thereto to release the formed glass sheet G from its phantom line indicated position to its solid line indicated position on the annealing ring.",
"Then, contrary to normal processing of press formed glass sheets which are normally immediately transferred from the forming station to the cooling station, the annealing ring 72 is maintained for a dwell time within the forming station below the heated upper forming mold 58 for at least three seconds and preferably for at least five seconds for slow cooling.",
"It has been found that this slow cooling as the glass sheet cools toward and to its strain point temperature advantageously controls edge stresses upon final cooling to ambient.",
"After the slow cooling time, the annealing shuttle 68 as is hereinafter described moves the glass sheet G on the annealing ring 72 from the forming station 12 as shown in FIG.",
"6 to the cooling station 18 as shown in FIG.",
"7 for final cooling to ambient, which will normally take place after unloading of the formed glass sheet from the annealing ring onto a cooling conveyor so the annealing ring can move back to the forming station to begin the next cycle.",
"The length of dwell time the annealing ring 72 must be maintained in the forming station to provide the slow cooling of the formed glass sheet to control the edge stress will vary with different glass thickness, shapes, sizes, curvatures and glass compositions, etc.",
"As previously stated, this dwell time must be at least three seconds and for most applications at least five seconds with at least six and one half seconds for some applications.",
"The processing involved provides edge stresses in a 20 mm band at the periphery of the glass with compression in the range of about 8 to 33 megapascals (≈1160 psi to ≈480 psi) and tension no greater than about 7 megapascals (≈1015 psi).",
"Thus for purposes of this application, “slow” cooling means processing as described which provides edge stresses in a 20 mm peripheral band of the formed glass sheet with the above range of compression and the maximum tension specified.",
"As illustrated in FIGS.",
"1, 3 and 4, 5 as well as FIGS.",
"6 and 7, each embodiment of the system includes a controller 74 that is configured to control operation of the forming station, the conveyor 26, and the annealing ring movement by the annealing shuttle 68 as well as controlling all of the operations described to provide the slow cooling that produces the controlled edge stresses previously described.",
"In FIG.",
"8, the illustrated flow chart describes the forming and annealing operation.",
"More specifically, the glass sheet is initially heated in the furnace as shown at 76.Thereafter the glass sheet is preformed as described in connection with the embodiment of FIGS.",
"1-3 and illustrated in step 78; however, this preforming step will of course be eliminated with the embodiment of FIGS.",
"4 and 5 as previously described.",
"The next step 80 moves the glass sheet to the forming station followed by the press forming step 82.Thereafter, the formed glass sheet is supported by vacuum on the upper mold as shown by step 84, and the annealing ring is then moved as shown by step 86 to below the upper mold and the glass sheet is released onto the annealing ring.",
"After the annealing ring receives the formed glass sheet, it is maintained for the dwell time during step 88 below the upper mold for slow cooling toward the strain point temperature as previously described contrary to normal practice where the glass sheet is immediately moved to the cooling station for the annealing.",
"Rather, the movement of the annealing ring from the forming station after the dwell time as shown by step 90 enables the formed glass sheet to have controlled edge stresses after cooling to ambient temperature as described above.",
"With reference to FIG.",
"9, the lower forming mold 52 as previously described is embodied by a press ring that has four sides, specifically downstream and upstream sides 92 and 94 and a pair of lateral sides 96.At each of these press ring sides, the press ring has a T-shaped cross section as shown in FIG.",
"10 including a vertical stem 98 and an upper cross bar 100 supported on the vertical stem and having an upwardly facing forming surface 102.Each side of the press ring has a pair of electrical heating elements 104 at lower locations below its cross bar 100 where it is supported on the vertical stem 98 as well as having a thermocouple 106 adjacent one of these heating elements.",
"A shaft 108 extends through a hole in the vertical stem and has ends that receive washers 110 secured by clips 112 to position the heating elements 104.The upwardly facing forming surface 102 has three electrical heating elements 114, 116 and 118 respectively received within grooves in the forming surface 102 along its entire length and is covered by stainless steel felt 102a covered by a thin stainless steel layer 102b that is secured by tack welds 103c to the sides of the upper cross bar 100.The two heating elements 114 and 116 are located below the glass sheet to heat the glass sheet by conduction and radiation and the one heating element 118 is located adjacent the glass sheet edge 120 to provide radiant heating of the glass during the press forming.",
"These heating elements 114, 116 and 118 thus limit heat loss from the glass sheet and thereby control edge stresses upon final cooling to ambient temperature.",
"More specifically, the increased compression in the peripheral 20 mm.",
"band extending inwardly from the edge 120 must be equal to adjacent tension.",
"With the annealing herein disclosed, that tension is distributed more away from the edge 120 than with conventional forming and annealing.",
"Thus there is less tension immediately adjacent the edge 120.The controller 74 as shown in FIG.",
"9 has control wire bundles 122 that extend from the controller 74 to the lower press ring 52 at diagonally opposite corners as shown in FIG.",
"9 to provide the control of the heating elements 104, 114, 116 and 118 as well as the thermocouple 106.Thus, each bundle controls those components at two adjacent sides, either the downstream or upstream side 92 or 94 and the adjacent lateral side 96.As also shown in FIG.",
"9, the lower press ring 52 has insulation 124 provided within its interior at each of its downstream and upstream sides 92 and 94 and at each of its two lateral sides 96 as well as having insulation 126 at the exterior of each of these sides.",
"This insulation also maintains the glass sheet edge 120 and the adjacent glass sheet edge portion heated during the forming so as to aid in the slow cooling.",
"With reference to FIGS.",
"11 and 12, the annealing ring 72 like the lower press ring has four sides including a downstream side 128, an upstream side 130 and two lateral sides 132.Upwardly and downwardly extending downstream and upstream baffles 134 and 136 limit cooling from air flow across the formed glass sheet during its movement from the forming station to also prevent heat loss and thereby provide slower cooling to further control the final edge stresses.",
"Furthermore, the annealing ring also has insulation 138 within its interior at each of its downstream and upstream sides 128 and 130 and at each of its two lateral sides 132 as well as having insulation 140 at its exterior along each of these sides to limit heat flow from the glass sheet.",
"The insulation 124 and 126 of the lower press ring 52 and the insulation 138 and 140 of the annealing ring 72 as well as insulation below each of these rings may be supported in the manner disclosed by Patent Application Publication US 2013/0186138, the entire disclosure of which is hereby incorporated by reference.",
"As shown in FIG.",
"13, the annealing ring 72 has each of its sides 128, 130 and 132 mounted on a mold support 142 of the shuttle 68 by a plurality of threaded adjusters 144 that control its elevation as required.",
"A pair of electrical resistance heating elements 146 provide heaters that extend along each of the sides and are supported by a clip 148 and a nut 150 threaded onto a stud 152 that extends downwardly from the ring 72.Electrical control wire bundles 154 extend from the controller 74 to diagonally opposite corners of the annealing ring as shown in FIG.",
"11 to the heating elements and to unshown thermocouples to power and control the heating.",
"While exemplary embodiments are described above, it is not intended that these embodiments describe all possible forms of the invention.",
"Rather, the words used in the specification are words of description rather than limitation, and it is understood that various changes may be made without departing from the spirit and scope of the invention.",
"Additionally, the features of various implementing embodiments may be combined to form further embodiments of the invention."
]
] |
Patent_15871385
|
[
[
"TUNABLE ANTENNA SYSTEMS",
"An electronic device has wireless communications circuitry including an adjustable antenna system coupled to a radio-frequency transceiver.",
"The adjustable antenna system may include one or more adjustable electrical components that are controlled by storage and processing circuitry in the electronic device.",
"The adjustable electrical components may include switches and components that can be adjusted between numerous different states.",
"The adjustable electrical components may be coupled between antenna system components such as transmission line elements, matching network elements, antenna elements and antenna feeds.",
"By adjusting the adjustable electrical components, the storage and processing circuitry can tune the adjustable antenna system to ensure that the adjustable antenna system covers communications bands of interest."
],
[
"1.An electronic device having a periphery, comprising: radio-frequency transceiver circuitry; an antenna having an antenna feed and ground plane structures; a transmission line path coupled between the radio-frequency transceiver circuitry and the antenna feed; peripheral conductive housing structures that run along the periphery and surround the ground plane structures, wherein the peripheral conductive housing structures include a portion that forms at least part of the antenna; storage and processing circuitry configured to generate a control signal; and an adjustable electrical component coupled to the peripheral conductive housing structures, wherein the adjustable electrical component has a control input that receives the control signal and the adjustable electrical component is configured to adjust a frequency response of the antenna based on the control signal.",
"2.The electronic device defined in claim 1, wherein the peripheral conductive housing structures include a dielectric-filled gap that divides the peripheral conductive housing structures.",
"3.The electronic device defined in claim 2, wherein the peripheral conductive housing structures include an additional dielectric-filled gap that divides the peripheral conductive housing structures.",
"4.The electronic device defined in claim 3, wherein the dielectric-filled gap and the additional dielectric-filled gap are formed at different sides of the electronic device.",
"5.The electronic device defined in claim 2, wherein the adjustable electrical component comprises first and second terminals coupled to the peripheral conductive housing structures at opposing sides of the dielectric-filled gap.",
"6.The electronic device defined in claim 1, wherein the adjustable electrical component comprises an adjustable electrical component selected from the group consisting of an adjustable capacitor and an adjustable inductor.",
"7.The electronic device defined in claim 1, wherein the antenna comprises an inverted-F antenna and the portion of the peripheral conductive housing structures that forms at least part of the antenna forms an antenna resonating element for the inverted-F antenna.",
"8.The electronic device defined in claim 1, wherein the electronic device has a length, a width that is less than the length, and a height that is less than the width, and the peripheral conductive housing structures extend across the height of the electronic device.",
"9.The electronic device defined in claim 8, wherein the peripheral conductive housing structures extend across the length and the width of the electronic device.",
"10.The electronic device defined in claim 1, wherein the antenna feed comprises a signal feed terminal coupled to the portion of the peripheral conductive housing structures and a ground feed terminal coupled to the ground plane structures.",
"11.An electronic device having a periphery and opposing first and second faces, the electronic device comprising: ground plane structures; peripheral conductive housing structures that run along the periphery of the electronic device and surround the ground plane structures; a dielectric-filled gap in the peripheral conductive housing structures that divides the peripheral conductive housing structures into first and second segments, wherein the second segment is separated from the ground plane structures by a dielectric-filled opening, the dielectric-filled gap having a first end at the dielectric-filled opening and a second end at the first face of the electronic device; and an antenna formed from at least the second segment and the ground plane structures.",
"12.The electronic device defined in claim 11, wherein the first segment is coupled to the ground plane structures.",
"13.The electronic device defined in claim 12, wherein the ground plane structures comprise a conductive housing wall on the second face of the electronic device.",
"14.The electronic device defined in claim 13, further comprising a display on the first face of the electronic device.",
"15.The electronic device defined in claim 11, further comprising: an additional dielectric-filled gap in the peripheral conductive housing structures that separates the second segment from a third segment of the peripheral conductive housing structures, the additional dielectric-filled gap having a first end at the dielectric-filled opening and a second end at the first face of the electronic device.",
"16.The electronic device defined in claim 11, wherein the antenna comprises an antenna feed having a first feed terminal coupled to the ground plane structures and a second feed terminal coupled to the second segment.",
"17.The electronic device defined in claim 11, further comprising: an adjustable electrical component coupled to the second segment; and storage and processing circuitry configured to provide a control signal to a control input of the adjustable electronic component that tunes a frequency response of the antenna.",
"18.An electronic device having a periphery, a length, a width that is less than the length, and a height that is less than the width, comprising: ground plane structures; peripheral conductive housing structures that surround the ground plane structures, wherein the peripheral conductive housing structures comprise a first sidewall extending across the width of the electronic device, a second sidewall extending from a first end of the first sidewall along the length of the electronic device, and a third sidewall extending from a second end of the first sidewall along the length of the electronic device; a dielectric-filled opening having a first portion extending from the second sidewall to the third sidewall and having a second portion that extends from an end of the first portion and that is interposed between the second sidewall and a portion of the ground plane structures, wherein the portion of the ground plane structures is interposed between the second portion of the dielectric-filled opening and the third sidewall; and an antenna that includes a portion of the peripheral conductive housing structures.",
"19.The electronic device defined in claim 18, further comprising: an adjustable electronic component that bridges the second portion of the dielectric filled opening and that is configured to tune a frequency response of the antenna.",
"20.The electronic device defined in claim 18, wherein the peripheral conductive housing structures extend across the height of the electronic device and include a fourth sidewall that extends between the second and third sidewalls, and the ground plane structures include an additional portion that extends from the second sidewall to the third sidewall."
],
[
"<SOH> BACKGROUND <EOH>This relates generally to wireless communications circuitry, and more particularly, to electronic devices that have tunable antenna systems.",
"Electronic devices such as computers and handheld electronic devices are often provided with wireless communications capabilities.",
"For example, electronic devices may use long-range wireless communications circuitry such as cellular telephone circuitry to communicate using cellular telephone bands.",
"Electronic devices may use short-range wireless communications links to handle communications with nearby equipment.",
"For example, electronic devices may communicate using the WiFi® (IEEE 802.11) bands at 2.4 GHz and 5 GHz and the Bluetooth® band at 2.4 GHz.",
"To satisfy consumer demand for small form factor wireless devices, manufacturers are continually striving to implement wireless communications circuitry such as antenna components using compact structures.",
"However, it can be difficult to fit conventional antenna structures into small devices.",
"For example, antennas that are confined to small volumes often exhibit narrower operating bandwidths than antennas that are implemented in larger volumes.",
"If the bandwidth of an antenna becomes too small, the antenna will not be able to cover all communications bands of interest.",
"In view of these considerations, it would be desirable to provide improved wireless circuitry for electronic devices."
],
[
"<SOH> SUMMARY <EOH>An electronic device may be provided with wireless communications circuitry including an adjustable antenna system coupled to a radio-frequency transceiver.",
"The adjustable antenna system may include one or more adjustable electrical components that are controlled by storage and processing circuitry in the electronic device.",
"By adjusting the adjustable electrical components, the storage and processing circuitry can tune the adjustable antenna system to ensure that the adjustable antenna system satisfactorily covers communications bands of interest.",
"The adjustable electrical components may include switches that can be placed in open or closed positions.",
"The adjustable electrical components may also include components that can be continuously or semicontinuously adjusted to produce various resistances, capacitances, and inductances.",
"Antenna system adjustments may be made to transmission line structures, matching networks, antenna resonating elements, antenna grounds, and antenna feeds.",
"An antenna may have portions that are formed from conductive electronic device housings.",
"An electronic device may have a rectangular periphery.",
"A conductive peripheral member such as a display bezel or housing sidewall member may surround the periphery of the housing.",
"One or more dielectric gaps may be interposed in the conductive peripheral member.",
"The adjustable electrical components may be used to bridge the gaps.",
"Control signals may be applied to the adjustable electrical components to adjust the size of the gap and other antenna system parameters and thereby tune the antenna system.",
"Further features of the invention, its nature and various advantages will be more apparent from the accompanying drawings and the following detailed description of the preferred embodiments."
],
[
"This application is a continuation of patent application Ser.",
"No.",
"14/737,394, filed Jun.",
"11, 2015, which is a continuation of patent application Ser.",
"No.",
"12/831,180, filed Jul.",
"6, 2010, now U.S. Pat.",
"No.",
"9,070,969, which is hereby incorporated by reference herein in its entirety.",
"This application claims the benefit of and claims priority to patent application Ser.",
"No.",
"14/737,394, filed Jun.",
"11, 2015 and patent application Ser.",
"No.",
"12/831,180, filed Jul.",
"6, 2010, now U.S. Pat.",
"No.",
"9,070,969.BACKGROUND This relates generally to wireless communications circuitry, and more particularly, to electronic devices that have tunable antenna systems.",
"Electronic devices such as computers and handheld electronic devices are often provided with wireless communications capabilities.",
"For example, electronic devices may use long-range wireless communications circuitry such as cellular telephone circuitry to communicate using cellular telephone bands.",
"Electronic devices may use short-range wireless communications links to handle communications with nearby equipment.",
"For example, electronic devices may communicate using the WiFi® (IEEE 802.11) bands at 2.4 GHz and 5 GHz and the Bluetooth® band at 2.4 GHz.",
"To satisfy consumer demand for small form factor wireless devices, manufacturers are continually striving to implement wireless communications circuitry such as antenna components using compact structures.",
"However, it can be difficult to fit conventional antenna structures into small devices.",
"For example, antennas that are confined to small volumes often exhibit narrower operating bandwidths than antennas that are implemented in larger volumes.",
"If the bandwidth of an antenna becomes too small, the antenna will not be able to cover all communications bands of interest.",
"In view of these considerations, it would be desirable to provide improved wireless circuitry for electronic devices.",
"SUMMARY An electronic device may be provided with wireless communications circuitry including an adjustable antenna system coupled to a radio-frequency transceiver.",
"The adjustable antenna system may include one or more adjustable electrical components that are controlled by storage and processing circuitry in the electronic device.",
"By adjusting the adjustable electrical components, the storage and processing circuitry can tune the adjustable antenna system to ensure that the adjustable antenna system satisfactorily covers communications bands of interest.",
"The adjustable electrical components may include switches that can be placed in open or closed positions.",
"The adjustable electrical components may also include components that can be continuously or semicontinuously adjusted to produce various resistances, capacitances, and inductances.",
"Antenna system adjustments may be made to transmission line structures, matching networks, antenna resonating elements, antenna grounds, and antenna feeds.",
"An antenna may have portions that are formed from conductive electronic device housings.",
"An electronic device may have a rectangular periphery.",
"A conductive peripheral member such as a display bezel or housing sidewall member may surround the periphery of the housing.",
"One or more dielectric gaps may be interposed in the conductive peripheral member.",
"The adjustable electrical components may be used to bridge the gaps.",
"Control signals may be applied to the adjustable electrical components to adjust the size of the gap and other antenna system parameters and thereby tune the antenna system.",
"Further features of the invention, its nature and various advantages will be more apparent from the accompanying drawings and the following detailed description of the preferred embodiments.",
"BRIEF DESCRIPTION OF THE DRAWINGS FIG.",
"1 is a perspective view of an illustrative electronic device with wireless communications circuitry in accordance with an embodiment of the present invention.",
"FIG.",
"2 is a schematic diagram of an illustrative electronic device with wireless communications circuitry in accordance with an embodiment of the present invention.",
"FIG.",
"3 is circuit diagram of illustrative wireless communications circuitry having fixed and adjustable antenna structures in an electronic device in accordance with an embodiment of the present invention.",
"FIG.",
"4 is a graph showing how antenna structures can be adjusted during operation to cover communications bands of interest in accordance with an embodiment of the present invention.",
"FIG.",
"5 is a graph showing how antenna structures can be adjusted during operation to fine tune antenna response during operation in accordance with an embodiment of the present invention.",
"FIG.",
"6 is a diagram of wireless communications circuitry in an electronic device showing how a transceiver circuit may feed an antenna using a transmission line and a matching network in accordance with an embodiment of the present invention.",
"FIG.",
"7 is a diagram of an illustrative antenna that may be used in wireless communications circuitry in an electronic device in accordance with an embodiment of the present invention.",
"FIG.",
"8 is a diagram of showing how wireless circuit components such as antenna system structures may be coupled using an adjustable electrical component in accordance with an embodiment of the present invention.",
"FIG.",
"9 is a diagram of showing how wireless circuit components such as antenna system structures may be coupled using an adjustable electrical component such as a switch in accordance with an embodiment of the present invention.",
"FIG.",
"10 is a diagram of showing how wireless circuit components such as antenna system structures may be coupled using an adjustable electrical component such as a circuit element with continuously or semicontinuously tunable electrical properties in accordance with an embodiment of the present invention.",
"FIG.",
"11 is a diagram of showing how wireless circuit components such as antenna system structures may be coupled using an adjustable electrical component such as a tunable capacitor with a continuously or semicontinuously tunable capacitance in accordance with an embodiment of the present invention.",
"FIG.",
"12 is a diagram of showing how wireless circuit components such as antenna system structures may be coupled using an adjustable electrical component such as semicontinuously a tunable electrical network with switches that provide the network with multiple selectable impedance values in accordance with an embodiment of the present invention.",
"FIG.",
"13 is a circuit diagram of an adjustable antenna system in an electronic device in accordance with an embodiment of the present invention.",
"FIG.",
"14 is a diagram of an adjustable antenna system in an electronic device showing how the antenna system may be adjusted by adjusting transmission line loading in accordance with an embodiment of the present invention.",
"FIG.",
"15 is an interior perspective view of an illustrative electronic device having a peripheral conductive member and an internal planar conductive member showing how an adjustable electrical component may bridge gaps in the peripheral conductive member in accordance with an embodiment of the present invention.",
"FIG.",
"16 is a perspective view of an interior portion of a peripheral conductive electronic device housing member showing how adjustable electrical components may be bridge gaps in the peripheral conductive member in accordance with an embodiment of the present invention.",
"FIG.",
"17 is a top view of an electronic device showing how an adjustable electrical component may be used to connect different parts of an internal planar conductive member in accordance with an embodiment of the present invention.",
"FIG.",
"18 is a diagram of an illustrative antenna in which an adjustable electrical component has been used to couple different parts of an antenna ground plane element in accordance with an embodiment of the present invention.",
"FIG.",
"19 is a diagram of an illustrative electronic device having a conductive peripheral housing member and an internal planar structure with multiple regions that have been coupled using an adjustable electrical component in accordance with an embodiment of the present invention.",
"FIG.",
"20 is a perspective view of an illustrative radio-frequency transceiver circuit that has been mounted to a rigid printed circuit board and that has been coupled to a flex circuit on which conductive antenna structures are coupled to conductive flex traces and an optional flex-mounted component by an adjustable electrical component in accordance with an embodiment of the present invention.",
"FIG.",
"21 is a diagram of an adjustable antenna system in which a component with conductive structures such as a flex circuit on which a camera or other device structure has been mounted may be coupled to portions of an antenna using adjustable electrical components in accordance with an embodiment of the present invention.",
"FIG.",
"22 is an exploded perspective view of an illustrative electronic device having components such as a radio-frequency transceiver circuit that uses an adjustable antenna system that includes conductive frame members and an adjustable electrical component in accordance with an embodiment of the present invention.",
"FIG.",
"23 is a top view of an illustrative electronic device showing how an adjustable antenna system may be formed using an adjustable electrical component that couples a conductive peripheral housing member to a conductive planar internal housing member in accordance with an embodiment of the present invention.",
"FIG.",
"24 is a flow chart of illustrative steps involved in operating an electronic device with an adjustable antenna system in accordance with an embodiment of the present invention.",
"DETAILED DESCRIPTION Electronic devices such as device 10 of FIG.",
"1 may be provided with wireless communications circuitry.",
"The wireless communications circuitry may be used to support wireless communications such as long-range wireless communications (e.g., communications in cellular telephone bands) and short-range communications (i.e., local area network links such as WiFi® links, Bluetooth® links, etc.).",
"The wireless communications circuitry may include one or more antennas.",
"The antennas and associated wireless communications circuits within the electronic devices may be adjustable.",
"Adjustable antenna systems may be tuned to adjust antenna response within a band (i.e., the antenna systems may be fine tuned).",
"Fine tuning may be used to ensure that signals in a desired communications band are received properly.",
"Adjustable antenna systems may also be tuned so that an antenna response curve that would otherwise only cover a single band or group of bands can be used to cover additional frequencies of interests (i.e., the antenna systems may be coarsely tuned to cover a different band or group of bands).",
"Coarse tuning may allow relatively narrow bandwidth antennas to be tuned to cover communications bands over a relatively wide range of frequencies.",
"Any suitable electronic devices (e.g., device 10 of FIG.",
"1) may be provided with adjustable antenna systems that have these types of fine and coarse tuning capabilities.",
"For example, adjustable antenna systems may be used in electronic devices such as desktop computers, game consoles, routers, laptop computers, computers embedded in a computer monitor or television, computers that are part of set-top boxes or other consumer electronics equipment, relatively compact electronic devices such as portable electronic devices, etc.",
"The use of portable electronic devices is sometimes described herein as an example.",
"This is, however, merely illustrative.",
"Adjustable antenna systems may be used in any electronic device.",
"Electronic devices such as illustrative electronic device 10 of FIG.",
"1 may be laptop computers, tablet computers, cellular telephones, media players, other handheld and portable electronic devices, smaller devices such as wrist-watch devices, pendant devices, headphone and earpiece devices, other wearable and miniature devices, or other electronic equipment.",
"As shown in FIG.",
"1, device 10 includes housing 12.Housing 12, which is sometimes referred to as a case, may be formed of materials such as plastic, glass, ceramics, carbon-fiber composites and other composites, metal, other materials, or a combination of these materials.",
"Device 10 may be formed using a unibody construction in which most or all of housing 12 is formed from a single structural element (e.g., a piece of machined metal or a piece of molded plastic) or may be formed from multiple housing structures (e.g., outer housing structures that have been mounted to internal frame elements or other internal housing structures).",
"Device 10 may, if desired, have a display such as display 14.Display 14 may, for example, be a touch screen that incorporates capacitive touch electrodes.",
"Display 14 may include image pixels formed from light-emitting diodes (LEDs), organic LEDs (OLEDs), plasma cells, electronic ink elements, liquid crystal display (LCD) components, or other suitable image pixel structures.",
"A cover glass member may cover the surface of display 14.Buttons such as button 16 may pass through openings in the cover glass.",
"Openings may also be formed in the cover glass of display 14 to form a speaker port such as speaker port 18.Openings in housing 12 may be used to form input-output ports, microphone ports, speaker ports, button openings, etc.",
"Wireless communications circuitry in device 10 may be used to form remote and local wireless links.",
"One or more antennas may be used during wireless communications.",
"Single band and multiband antennas may be used.",
"For example, a single band antenna may be used to handle Bluetooth® communications at 2.4 GHz (as an example).",
"As another example, a multiband antenna may be used to handle cellular telephone communications in multiple cellular telephone bands.",
"Other types of communications links may also be supported using single-band and multiband antennas.",
"If desired, device 10 may use multiple antennas.",
"Multiple antennas may, for example, be used to support an antenna diversity scheme.",
"With an antenna diversity scheme, control circuitry in device 10 may monitor signal quality or sensor data to determine which antenna or antennas are performing best or are otherwise desirable to use (e.g., to satisfy regulatory limits).",
"Based on these considerations, the control circuitry may then choose to use only a subset of the antennas or may otherwise adjust antenna use.",
"If, for example, a sensor or a signal quality measurement determines that one of two antennas in an antenna diversity arrangement has become blocked by an external object such as part of a human body, the control circuitry may temporarily inactivate that antenna.",
"Device 10 may also use multiple antennas to implement a multiple-input-multiple-output (MIMO) communications protocol.",
"In a MIMO scheme, each of the antennas in a system may handle an independent data stream, allowing overall data throughput to be increased.",
"The control circuitry in device 10 may use proximity data or other data to control operation of the multiple antennas in the MIMO setup.",
"For example, the control circuitry may temporarily switch from MIMO operation to a protocol that uses only a single antenna or may switch from a four-antenna MIMO scheme to a two-antenna MIMO scheme, etc.",
"Antennas may be located at any suitable locations in device 10.For example, one antenna may be located in an upper region such as region 22 and another antenna may be located in a lower region such as region 20.In a larger device, antennas may be located along device edges, in the center of a rear planar housing portion, in device corners, etc.",
"Antennas in device 10 may be used to support any communications bands of interest.",
"For example, device 10 may include antenna structures for supporting local area network communications (e.g., IEEE 802.11 communications at 2.4 GHz and 5 GHz for wireless local area networks), signals at 2.4 GHz such as Bluetooth® signals, voice and data cellular telephone communications (e.g., cellular signals in bands at frequencies such as 850 MHz, 900 MHz, 1800 MHz, 1900 MHz, 2100 MHz, etc.",
"), global positioning system (GPS) communications at 1575 MHz, signals at 60 GHz (e.g., for short-range links), etc.",
"Different antennas may handle different bands or a communications band or group of bands may be handled using a shared antenna.",
"One antenna in device 10 may, for example, be used in handling voice and data communications in one or more cellular telephone bands, whereas another antenna in device 10 may provide coverage in a first band for handling Global Positioning System (GPS) signals at 1575 MHz and a second band for handling Bluetooth® and IEEE 802.11 (wireless local area network) signals at 2.4 GHz (as examples).",
"Additional antennas may be provided to implement antenna diversity schemes, phased antenna arrays (e.g., at 60 GHz), additional bands, etc.",
"A schematic diagram showing illustrative components that may be used in device 10 of FIG.",
"1 is shown in FIG.",
"2.As shown in FIG.",
"2, device 10 may include storage and processing circuitry 28.Storage and processing circuitry 28 may include storage such as hard disk drive storage, nonvolatile memory (e.g., flash memory or other electrically-programmable-read-only memory configured to form a solid state drive), volatile memory (e.g., static or dynamic random-access-memory), etc.",
"Processing circuitry in storage and processing circuitry 28 may be used to control the operation of device 10.This processing circuitry may be based on one or more microprocessors, microcontrollers, digital signal processors, application specific integrated circuits, etc.",
"Storage and processing circuitry 28 may be used to run software on device 10, such as internet browsing applications, voice-over-internet-protocol (VOIP) telephone call applications, email applications, media playback applications, operating system functions, etc.",
"To support interactions with external equipment, storage and processing circuitry 28 may be used in implementing communications protocols.",
"Communications protocols that may be implemented using storage and processing circuitry 28 include internet protocols, wireless local area network protocols (e.g., IEEE 802.11 protocols—sometimes referred to as WiFi®), protocols for other short-range wireless communications links such as the Bluetooth® protocol, cellular telephone protocols, MIMO protocols, antenna diversity protocols, etc.",
"Antenna system tuning operations may be controlled using software stored and running on device 10 (i.e., stored and running on storage and processing circuitry 28 and/or input-output circuitry 30).",
"Input-output circuitry 30 may include input-output devices 32.Input-output devices 32 may be used to allow data to be supplied to device 10 and to allow data to be provided from device 10 to external devices.",
"Input-output devices 32 may include user interface devices, data port devices, and other input-output components.",
"For example, input-output devices may include touch screens, displays without touch sensor capabilities, buttons, joysticks, click wheels, scrolling wheels, touch pads, key pads, keyboards, microphones, cameras, buttons, speakers, status indicators, light sources, audio jacks and other audio port components, digital data port devices, light sensors, motion sensors (accelerometers), capacitance sensors, proximity sensors, etc.",
"Input-output circuitry 30 may include wireless communications circuitry 34 for communicating wirelessly with external equipment.",
"Wireless communications circuitry 34 may include radio-frequency (RF) transceiver circuitry formed from one or more integrated circuits, power amplifier circuitry, low-noise input amplifiers, passive RF components, one or more antennas, transmission lines, and other circuitry for handling RF wireless signals.",
"Wireless signals can also be sent using light (e.g., using infrared communications).",
"Wireless communications circuitry 34 may include radio-frequency transceiver circuitry 90 for handling various radio-frequency communications bands.",
"For example, circuitry 34 may include transceiver circuitry 36, 38, and 42.Transceiver circuitry 36 may handle 2.4 GHz and 5 GHz bands for WiFi® (IEEE 802.11) communications and may handle the 2.4 GHz Bluetooth® communications band.",
"Circuitry 34 may use cellular telephone transceiver circuitry 38 for handling wireless communications in cellular telephone bands at 850 MHz, 900 MHz, 1800 MHz, 1900 MHz, and 2100 MHz data band (as examples).",
"Circuitry 38 may handle voice data and non-voice data.",
"Wireless communications circuitry 34 can include circuitry for other short-range and long-range wireless links if desired.",
"For example, wireless communications circuitry 34 may include 60 GHz transceiver circuitry, circuitry for receiving television and radio signals, paging system transceivers, etc.",
"Wireless communications circuitry 34 may include global positioning system (GPS) receiver equipment such as GPS receiver circuitry 42 for receiving GPS signals at 1575 MHz or for handling other satellite positioning data.",
"In WiFi® and Bluetooth® links and other short-range wireless links, wireless signals are typically used to convey data over tens or hundreds of feet.",
"In cellular telephone links and other long-range links, wireless signals are typically used to convey data over thousands of feet or miles.",
"Wireless communications circuitry 34 may include antennas 40.Antennas 40 may be formed using any suitable antenna types.",
"For example, antennas 40 may include antennas with resonating elements that are formed from loop antenna structure, patch antenna structures, inverted-F antenna structures, slot antenna structures, planar inverted-F antenna structures, helical antenna structures, hybrids of these designs, etc.",
"Different types of antennas may be used for different bands and combinations of bands.",
"For example, one type of antenna may be used in forming a local wireless link antenna and another type of antenna may be used in forming a remote wireless link antenna.",
"With one suitable arrangement, device 10 may have antennas in regions of device 10 such as upper region 22 and lower region 20.One or more upper antennas for device 10 may be formed in region 22.One or more lower antennas for device 10 may be formed in region 20.In devices with other form factors such as laptop and tablet computers, wearable devices, computer monitors with integrated computers, etc., antennas may be located in other suitable regions (e.g., at the four corners of a rectangular device, on front and back surfaces, along edge regions of a device, in one or more arrays, etc.).",
"As shown in FIG.",
"3, transceiver circuitry 90 may be coupled to antennas 40 using transmission lines 140.Device 10 may have antennas 40 that include both fixed antenna structures (e.g., fixed antenna structures 40A) and adjustable antenna structures (e.g., adjustable antenna structures 40B).",
"A configuration that includes both fixed and adjustable antennas may be used, for example, when there is sufficient space available for only one broadband antenna.",
"In this type of arrangement, fixed antenna structures 40A may use a broadband design that covers multiple communications bands, whereas adjustable structures 40B may use a narrowband design that achieves multiband coverage through use of coarse antenna system tuning.",
"Other configurations may also be used.",
"For example, device 10 may be provided exclusively with adjustable antenna structures.",
"In general, any suitable number of adjustable antennas may be provided in device 10 (e.g., one adjustable antenna, two adjustable antennas, three adjustable antennas, four or more adjustable antennas, etc.).",
"When device 10 includes an adjustable antenna system (i.e., when antennas 40 and associated wireless circuitry 34 in device 10 is adjustable), antenna performance can be altered in real time.",
"For example, the resonance curve of the antenna system may be slightly altered to compensate for environmental factors such as temperature changes.",
"Relatively small adjustments to the frequency response of an antenna system are sometimes referred to as fine tuning adjustments or fine tuning.",
"If desired, the frequency response of the antenna system can be adjusted by larger amounts.",
"For example, the frequency response of an antenna may be altered sufficiently to cause the antenna to cover different communications bands.",
"A standing wave ratio (SWR) versus frequency plot for an illustrative antenna system in device 10 is shown in FIG.",
"4.In the FIG.",
"4 example, the antenna system operates in two modes.",
"In a first mode of operation, the antenna system is characterized by a frequency response of the type illustrated by solid line 142.As shown in FIG.",
"4, this frequency response allows the antenna system to cover two communications bands (i.e., a first communications band centered at frequency fa and a second communications band centered at frequency fb).",
"In a second mode of operation, the antenna system is characterized by a frequency response of the type illustrated by dashed line 144.When operating in the second mode of operation, the antenna system may cover one communications band at frequency fc and another communications band at frequency fd.",
"Frequency bands fa and fb may be, for example, 850 MHz and 900 MHz frequency bands, whereas frequency bands fc and fd may be, for example, 1900 MHz and 2100 MHz frequency bands (as examples).",
"During operation of device 10, device 10 can determine which communications bands are to be used and can adjust the adjustable antenna system accordingly (i.e., to cover the frequency range associated with curve 142 or to cover the frequency range associated with curve 144).",
"If desired, device 10 may include a fixed antenna such as the fixed antenna of FIG.",
"3 that covers both low bands (fa and fb) and high bands (fc and fd).",
"As described in connection with FIG.",
"4, device 10 may also have an adjustable antenna system that is adjusted between the first and second modes to selectively cover the same bands that are covered by the fixed antenna.",
"An illustrative fine tuning operation using an adjustable antenna system in device 10 is shown in FIG.",
"5.As shown in FIG.",
"5, the adjustable antenna system may initially exhibit a frequency response of the type shown by solid line 146.Due to changes in operating temperature or other effects, the frequency response of the antenna may need to be adjusted to ensure that signals are properly received and transmitted.",
"This can be accomplished by adjusting the adjustable antenna system in device 10 so that its frequency response shifts slightly to the frequency response shown by dashed line 148 (i.e., a frequency shift of Δf).",
"Real time adjustments such as the fine tuning adjustments of FIG.",
"5 and the coarse tuning adjustments of FIG.",
"4 may be made to ensure that device 10 performs as desired under a variety of wireless traffic and environmental scenarios.",
"FIG.",
"6 shows illustrative components that may be included in an adjustable antenna system in electronic device 10.As shown in FIG.",
"6, radio-frequency signals may be generated and received by radio-frequency transceiver circuitry 90.Circuitry 90 may include radio-frequency transmitters for transmitting radio-frequency signals and radio-frequency receivers for receiving radio-frequency signals.",
"Radio-frequency amplifier circuitry and other components (e.g., switches) may be included in transceiver circuit block 90.Adjustable antenna system 150 may include antennas 40, matching network 152, and transmission line 140.Antenna 40 may be include antenna ground structures and antenna resonating element structures such as loop antenna structures, patch antenna structures, inverted-F antenna structures, slot antenna structures, planar inverted-F antenna structures, helical antenna structures, hybrids of these designs, etc.",
"Transmission line 140 may be coupled to transceiver circuitry 90.Transmission line 140 may be based on a microstrip transmission line structure, a stripline transmission line structure, an edge coupled microstrip transmission line structure, an edge coupled stripline transmission line structure, transmission line structures formed on flexible printed circuits (“flex circuits”), structures formed on rigid printed circuit boards, a coaxial cable, other suitable transmission line structures, or combinations of these structures.",
"Matching network 152 may be used to help match the impedance of transmission line 140 to the impedance of antenna 40.Matching network 152 may include electrical components such as resistors, inductors, and capacitors, and conductive traces, pieces of metal, and other structures that have associated resistances, inductances, and capacitances.",
"Although shown as being interposed between transmission line 140 and antenna 40 in the example of FIG.",
"6, matching network components may, if desired, be interposed within transmission line 90 and/or within antenna 40.The arrangement of FIG.",
"6 is merely illustrative.",
"Antenna 40 may be fed using an antenna feed such as an antenna feed formed from positive antenna feed terminal 156 and ground antenna feed terminal 158.To provide antenna system 150 with adjustability, antenna system 150 may be provided with one or more adjustable electrical components.",
"These components may be incorporated into antenna 40 (including the antenna feed), matching network 152, and transmission line 140.FIG.",
"7 is a diagram of an illustrative antenna.",
"In the FIG.",
"7 example, antenna 40 has an inverted-F configuration.",
"This is, however, merely illustrative.",
"Antenna 40 may be formed using any suitable antenna design.",
"As shown in FIG.",
"7, antenna 40 may include an antenna ground (e.g., antenna ground element 160) and an antenna resonating element (antenna resonating element 162).",
"Antenna ground 160 and antenna resonating element 162 may be formed from conductive structures such as pieces of metal, metal traces on printed circuit boards, parts of an electronic device housing, conductive components, and other conductive elements in device 10.Antenna ground element 160 may be formed from one conductive structure or multiple conductive structures.",
"Antenna resonating element 162 may have a main resonating element branch such as branch 164 and additional branches.",
"Segment 166 of resonating element 162 may short arm 164 to ground 160.Transceiver 90 may be coupled to antenna feed terminals 156 and 158.Matching network components and transmission line structures are not shown in FIG.",
"7 to avoid over-complicating the drawing.",
"Antenna 40 and the other structures of antenna system 150 may be provided with adjustable electrical components such as switches and continuously and semicontinuously tunable electrical components.",
"For example, an adjustable electrical component may be coupled between portions of antenna resonating element arm 164 or between portions of ground plane 160 in an antenna of the type shown in FIG.",
"4.Adjustable electrical components may also be incorporated into matching network 152 or transmission line 140 of FIG.",
"6.The antenna feed for antenna 40 may be adjusted using adjustable electrical components (e.g., adjustable electrical components coupled to feed terminals).",
"The use of an adjustable electrical component to make adjustments to adjustable antenna system 150 is illustrated in FIG.",
"8.As shown in FIG.",
"8, adjustable antenna system 150 may include adjustable antenna system portions 150A and 150B.",
"Portions 150A and 150B may be antenna resonating element structures, antenna ground element structures, parasitic antenna structures (e.g., antenna structures that are near-field coupled to other antenna structures) antenna feed structures, other antenna structures, matching network structures, transmission line structures (e.g., a transmission line stub), other antenna system structures, or any combination of these structures.",
"Adjustable electrical component 168 may have a first terminal such as terminal 170 that is connected to antenna system portion 150A and a second terminal such as terminal 172 that is connected to antenna system portion 150B.",
"Adjustable electrical component 168 may be adjusted using control signals applied to control input 174 or may be implemented using a two-terminal arrangement in which control signals are applied over terminals 170 and 172.Examples of adjustable electrical components that may be used for adjustable electrical component 168 include switches, variable resistors, variable capacitors, variable inductors, and components that control multiple electrical parameters.",
"FIG.",
"9 shows how adjustable electrical component 168 may be implemented using a switch.",
"Switch 168 of FIG.",
"9 may be placed in an open state in which antenna system portion 150A is electrically isolated from antenna system portion 150B or may be placed in a closed state in which terminals 170 and 172 are shorted together so that portions 150A and 150B are electrically connected.",
"Switch 168 may be implemented using a gallium arsenide field-effect transistor (FET), a microelectromechanical systems (MEMs) switch, a metal-oxide-semiconductor field-effect transistor (MOSFET), a p-i-n diode, a high-electron mobility transistor (HEMT), a pseudomorphic HEMT (PHEMT), a transistor formed on a silicon-on-insulator (SOI) substrate, etc.",
"As shown in FIG.",
"10, adjustable electrical component 168 may be implemented using a component that can be placed in numerous different states (e.g., a component that is continuously variable or that is semicontinuously variable and can be placed in one of a number of different discrete states).",
"Component 168 may be, for example, a continuously variable capacitor, a semicontinuously adjustable capacitor that has 2-100 or more different capacitance values, a continuously variable resistor, a semicontinuously adjustable resistor that has 2-100 or more different resistance values, a continuously variable inductor, or a semicontinuously adjustable inductor that has 2-100 or more different inductance values.",
"FIG.",
"11 shows, for example, how adjustable electrical component 168 may include a continuously variable capacitor.",
"Semicontinuously adjustable components may be implemented using arrays of discrete components and switches configured to serve as multiplexers.",
"If desired, adjustable electrical component 168 may be formed from other adjustable electrical components.",
"As shown in FIG.",
"12, for example, semicontinuously adjustable electrical component 168 may be formed from an electrical network that includes inductors such as inductors L1 and L2.Switches (e.g., switches SWA and SWB in the FIG.",
"12 example) may be used to form desired patterns of electrical connections within the electrical network.",
"For example, components may be switched into or out of use or may be interconnected in different ways.",
"In the FIG.",
"12 example, the inductance that is exhibited between terminals 170 and 172 may be adjusted by opening and closing switches SWA and SWB in various patterns.",
"Networks with other patterns of electrical components (e.g., capacitors, resistors, inductors, and conductive and dielectric structures that have capacitance, inductance, and resistance and that serve as capacitors, resistors, and inductors), other patterns of switches or continuously or semicontinuously adjustable components may also be used in implementing adjustable electrical component 168.The example of FIG.",
"12 is merely illustrative.",
"An illustrative adjustable antenna system 150 that is based on an inverted-F antenna such as antenna 40 of FIG.",
"7 is shown in FIG.",
"13.Main resonating element arm 164 of antenna 40 may be connected to ground 160 through a short circuit path such as path 132A (if switch 176 is closed and switch 178 is open) or path 132B (if switch 176 is open and switch 178 is closed).",
"A feed path (see, e.g., terminals 158 and 108), and one or more optional paths such as the path formed by adjustable electrical component 120 (e.g., a switch), the path formed by element 122 (e.g., a semicontinuously or continuously adjustable component), and the path formed by adjustable electrical components 124 and 126 (e.g., a switch and a continuously adjustable component, respectively).",
"Optional antenna resonating element branches such as branch 130 may be coupled to antenna 40 (e.g., by connecting branch 130 to main resonating element arm 164 through adjustable electrical component 128).",
"Antenna 40 may be feed by transceiver 90 (i.e., transceiver circuitry such as transceiver circuitry 90 of FIG.",
"2).",
"Transmission line 140 may have paths such as positive antenna signal paths 94 and 104 and ground antenna signal paths such as paths 92 and 106 and may be used to convey radio-frequency antenna signals between transceiver 90 and antenna 40.Matching circuitry 152 may be interposed in the path between transceiver 90 and antenna 40.Matching circuitry 152 may include series-connected and shunt-connected adjustable electrical components such as components 102 and 100.One or more adjustable electrical components such as components 100 and 102 may be coupled between transmission line 140 and additional transmission line components and other electrical components.",
"For example, a component such as a transmission line stub (e.g., transmission line stub 140′), may be coupled to transmission line 140 via component 100.Any of the adjustable electrical components used in adjustable antenna system 150 may include transmission line structures, if desired.",
"Transmission line paths such as positive transmission line path 104 and ground transmission line path 106 may be used to interconnect matching circuitry 152 to the antenna feed of antenna 40.The antenna feed may have a fixed or tunable configuration.",
"In the example of FIG.",
"13, the antenna feed for antenna 40 is tunable between a first antenna feed configuration in which switch 118 (or other such adjustable electrical component) has a first position and a second antenna feed configuration in which switch 118 has a second position.",
"When switch 118 is in its first position, terminal 108 is connected to terminal 156A, so that terminal 156A serves as the positive antenna feed terminal for antenna 40.When switch 118 is in its second position, terminal 108 is connected to terminal 156B, so that terminal 156B serves as the positive antenna feed terminal for antenna 40.Feed terminals 156A and 156B are located at different positions along the length of main resonating element arm 164, so the impedance and therefore the frequency response of antenna 40 can be adjusted by using switch 118 to control the feed location in antenna 40.The arrangement of FIG.",
"13 is merely illustrative.",
"In general, antennas such as antenna 40 in device 10 may have tunable feeds formed from two or more feed points, tunable feeds that involve one, two, three, or more than three switches, feeds that are tuned by adjusting the ground antenna feed and/or the positive antenna feed, non-tunable feeds, etc.",
"By incorporating adjustable electronic components into antenna 40 (e.g., antenna resonating element 162), antenna 40 may be adjusted ad described in connection with FIGS.",
"4 and 5.For example, the size and shape of antenna structures such as resonating element 162 in antenna 40 can be controlled by storage and processing circuitry 28.In the FIG.",
"13 arrangement, adjustable electrical component 128 may be, for example, a switch with two states (e.g., an open state that electrically disconnects antenna resonating element portion 130 from antenna resonating element portion 164 and a closed state that electrically connects antenna resonating element portion 130 and antenna resonating element portion 164).",
"Component 128 may adjust the size and shape of the antenna resonating element and thereby adjust the frequency response of the antenna as described in connection with FIGS.",
"4 and 5.Additional resonating element structures and antenna structures may likewise be selectively connected and disconnected from the antenna resonating element in antenna 40 if desired.",
"Circuit components (e.g., resistors, inductors, and capacitors) may be interconnected with switches such as switch 128 (e.g., for impedance matching).",
"Antenna 40 may also be adjusted by controlling components such as adjustable components 120, 122, 124, and 126 (as examples).",
"The adjustable components of FIG.",
"13 are sometimes depicted as adjustable electronic component 168 in the other drawings.",
"FIG.",
"14 shows how adjustable antenna system 150 may include an adjustable transmission line.",
"Adjustable transmission line 140 may include one or more adjustable electronic components such as adjustable electronic component 168.Adjustable electronic component 168 may be used to selectively adjust the properties of transmission line 140.For example, component 168 may be used to connect transmission line stub 140′ to a main transmission line path in transmission line 140 and may be used to disconnect transmission line stub 140′ from the main transmission line path in transmission line 140.By adjusting the properties of transmission line 140, the frequency response of the antenna (i.e., adjustable antenna system 150) can be controlled as described in connection with FIGS.",
"4 and 5 (as examples).",
"FIG.",
"15 is an interior perspective view of electronic device 10 of FIG.",
"1 showing how electronic device 10 may include conductive structures such as conductive peripheral member 180.Device 10 may have a rectangular outline (periphery) when viewed from the front (i.e., when viewed from the face of device 10 that contains display 14).",
"Conductive peripheral member 180 may be implemented using metal or other conductive materials.",
"Conductive peripheral member 180 may surround substantially all of the rectangular periphery of device 10.Conductive peripheral member 180 may have the shape of a display bezel for display 14 or a trim structure for device 10 (i.e., a bezel or trim piece that runs around the upper rim on the front of device 10) or may be implemented using a flat or curved member that forms housing sidewalls that cover substantially all of the sides of housing 12 (as examples).",
"A gap or multiple gaps such as gaps 182 may be interposed in conductive peripheral member 180.Gaps 182 may be formed from dielectric (e.g., air, plastic, glass, ceramics, composites, other dielectrics, or combinations of these materials).",
"Gaps 182 may form part of the antennas in device 10 (e.g., antenna 40).",
"Transceiver 90 may be implemented using components such as one or more integrated circuits and other electrical components that are mounted on a substrate such as printed circuit board 194.Transmission line traces in board 194 (i.e., transmission line 140A may be coupled between transceiver 90 and radio-frequency connector 186.Connector 186 may be connected to a coaxial cable segment or other transmission line 104B.",
"Transmission line 104B may be coupled to a matching network (e.g., matching network 152 of FIG.",
"13) and an antenna feed (e.g., an antenna feed made up of antenna feed terminals 158 and 156).",
"The antenna feed may, for example, be coupled across one of gaps 182 or may be located elsewhere in device 10.Adjustable electrical components 168 may be included in antenna 40 to help provide adjustable antenna system 150 with adjustability.",
"As an example, an adjustable electrical component may bridge one of gaps 182 (e.g., by connecting one of components 168 between terminals 190 and 192 on opposing sides of a gap in peripheral conductive member 180).",
"Adjustable electrical components 168 may also be connected between the other conductive components in adjustable antenna system 150 (e.g., between a first terminal such as terminal 198 that is attached to peripheral conductive member 180 and a second terminal such as terminal 188 that is connected to a conductive trace in board 194 (e.g., a ground plane trace).",
"Devices such as device 10 of FIG.",
"15 may, if desired, have planar members such as illustrative planar structure 196.Structure 196 may form part of the rear housing surface (i.e., an external housing wall structure on the rear face of housing 12) or may form an internal planar member (e.g., an internal housing structure that spans the width of device 10 while creating closed or open slot-shaped openings such as dielectric-filled opening 184 at one or both ends of device 10 as shown in FIG.",
"15).",
"Structure 196 may be formed from metal (e.g., a metal plate) or other conductive structures and may, if desired, be used in forming an antenna ground plane for antenna 40.Adjustable electrical components 168 may be used to provide adjustability to the size of gaps 182 in conductive peripheral member 180.Consider, as an example, the illustrative arrangement shown in FIG.",
"16.As shown in FIG.",
"16, a peripheral conductive member in device 10 such as peripheral conductive member 180 may have multiple adjacent gaps 182.In the FIG.",
"16 example, peripheral conductive housing member 180 has two gaps 182 a first of which has a length (width) of G1 and a second of which has a length (width) of G2.Adjustable electrical components 168A and 168B may bridge gaps 182 (e.g., on the interior side of peripheral conductive member 180).",
"For example, adjustable electrical component 168A may have a first terminal that is electrically connected to portion 200 of peripheral conductive member 180 and a second terminal that is electrically connected to portion 202 of peripheral conductive member 180.Adjustable electrical component 168B may have a first terminal that is electrically connected to portion 202 of peripheral conductive member 180 and a second terminal that is electrically connected to portion 204 of peripheral conductive member 180.As with the other adjustable electrical components 168 for device 10, adjustable electrical components 168 of FIG.",
"16 may be implemented using switches, continuously or semicontinuously variable components such as variable capacitors, variable resistors, and variable inductors, continuously or semicontinuously adjustable circuit networks, etc.",
"Configurations of the type shown in FIG.",
"16 may be used to adjust the electrical properties of gaps 182 and/or to adjust effective gap length (i.e., to electrically adjust gap width).",
"As shown in FIG.",
"16, for example, there may be a gap length (width) G3 between the outermost (most distant) edges of gaps 182.Adjustable components 168 may be, for example, switches.",
"In this type of configuration, switch 168A may be opened to switch the leftmost gap 182 into use or may be closed to bypass the leftmost gap.",
"Switch 168B may be opened to switch the rightmost gap 182 into use or may be closed to bypass the rightmost gap.",
"When both switches 168A and 168B are open, antenna 40 has two gaps (of widths G1 and G2) connected in series within peripheral conductive member 180, so the gaps may be considered to have an effective width of G3.When switch 168A is closed and switch 168B is open, only the gap of width G2 is present.",
"When switch 168B is closed and switch 168A is open, only the gap of width G1 is present.",
"When both switches 168 are closed, no gap is present.",
"Adjustment of the states of switches 168A and 168B (e.g., by applying control signals from storage and processing circuitry 28 to switches 168) can therefore adjust the width of the gap in conductive peripheral member 180.When adjustable electrical components other than switches are used (e.g., variable capacitors, inductors, etc.)",
"a combination of impedance adjustments and effective gap width adjustments may be produced.",
"In the example of FIG.",
"16, adjustable electrical components 168 connect different portions of peripheral conductive member 180 to each other.",
"Adjustable electrical components 168 may also be used to connect other conductive portions of antenna system 150 together such as other conductive portions of housing 12.As an example, adjustable components 168 and may be used to couple together different portions of a planar structure such as structure 196 of FIG.",
"17.Structure 196 may be formed using all or some of a rear housing structure (e.g., a housing wall), an internal housing member, or other conductive structures.",
"Member 196 may, for example, have an opening such as opening 184′ of FIG.",
"17.Opening 184′ may be contiguous with opening 184 and may form an extension of opening 184.Opening 184 (and extension 184′) may form an opening for antenna 40 (e.g., an opening for a slot antenna, a loop antenna, a hybrid antenna, etc.).",
"Opening 184 may have an inner periphery P. The length of inner periphery P and other electrical properties of antenna 40 may be adjusted by adjusting electrical components 168.For example, by using switches for components 168, the size of opening 184′ and therefore the length of P may be adjusted.",
"If switch 168C and 168D are both open, the size of extension 184′ and length P will be maximized.",
"If switch 168C is open and switch 168D is closed, the size of opening 184′ will be halved (as an example).",
"Switch 168C (and, if desired switch 168D) may be closed to reduce the size of opening 184′ further (or even to bypass opening 184′ entirely).",
"Antenna 40 may exhibit a resonance peak when P is equal to about one wavelength of the radio-frequency antenna signals being handled by antenna 40.By adjusting P, the frequency response of antenna 40 can therefore be adjusted as described in connection with FIGS.",
"4 and 5 (i.e., by adjusting the center frequency of a slot antenna or loop antenna, etc.).",
"FIG.",
"18 shows how antenna 40 in adjustable antenna system 150 may be adjusted by providing one or more adjustable electrical components 168 between respective portions of ground plane 160.In the FIG.",
"18 example, ground plane 160 includes ground plane portion 160A and ground plane portion 160B.",
"Adjustable electrical component 168 bridges gap 206 between portions 160A and 160B.",
"By controlling adjustable electrical component 168, ground plane 160 can be altered (e.g., to include member 160A while member 160B is disconnected from antenna 40) or to include both members 160A and 160B (i.e., by coupling members 160A and 160B together by bridging gap 206.Component 168 may, for example, be a switch that can be opened to disconnect portion 160B from portion 160A and that can be closed to connect portions 160A and 160B together.",
"Component 168 may also be an adjustable component such as an adjustable capacitor, adjustable resistor, adjustable inductor, or other adjustable circuitry that can be adjusted to tune antenna 40.If desired, ground plane 160 may be implemented using a planar structure such as planar structure 196 of FIG.",
"19.Structure 196 may be, for example, an external housing structure (e.g., a planar rear housing wall in housing 12), an internal housing structure (e.g., an internal plate or other planer support structure), or other conductive structures.",
"Structure 196 may have a dielectric gap such as gap 208 that separates portions 160′ and 160″ of structure 196.Gap 208 may be bridged using adjustable electronic component 168 (e.g., a switch, a continuously adjustable component, etc.",
"), thereby tuning the performance of antenna 40.As shown in FIG.",
"20, transceiver 90 may be mounted on a substrate such as a printed circuit board and coupled to an antenna 40 on a flex circuit substrate (substrate 210) via transmission line 140.Transmission line 140 may, for example, include conductive traces in printed circuit board 194 and conductive traces in flex circuit 210.Flex circuit 210 may be formed from a sheet of polyimide or other flexible polymer sheet that serves as a printed circuit board.",
"Conductive traces for antenna 40 (e.g., conductive metal antenna resonating element traces such as traces 212 and 214) may be formed on the exposed outer surface of flex circuit substrate 210 or may be formed from internal conductive traces.",
"Adjustable electrical component 168 may bridge conductive antenna structures such as structures 212 and 214.Component 168 may be, for example, a switch that can be opened to disconnect structure 214 from structure 212 or that can be closed to connect structures 214 and 212.Structures 212 and 214 may form part of a ground plane element, part of antenna resonating element 162 (e.g., an arm such as arm 130 of FIG.",
"13), part of a parasitic element (e.g., an antenna element whose presence affects the frequency response of antenna system 150, but that is near-field coupled to the antenna rather than being directly fed by transmission line 140), etc.",
"If desired, flex circuit 210 may be used as a substrate for one or more electrical components such as component 216.Components such as component 216 may be, for example, camera modules, speaker parts, button structures, integrated circuits, connectors, or other components (e.g., components that include conductive structures that may be connected to trace 214).",
"These components may be mounted to flex circuit substrate 210 using parts of conductive traces 212 and 214 or using separate conductive traces.",
"Consider, as an example, an arrangement in which electronic device 10 includes a camera module.",
"The camera module (e.g., one of input-output devices 32 of FIG.",
"2) may be mounted to flex circuit 210.Traces in flex circuit 210 may be used to provide power and control signals to the camera module and may be used to gather data signals from the camera module.",
"Traces 214 and 212 may be formed on the same flex circuit as the camera module, reducing component count and saving space in device 10.Adjustable electrical component 168 may be adjusted to selectively switch into use conductive material on flex circuit 210 (e.g., traces such as traces 214 on flex circuit 210, conductive components associated with the camera module, conductive ground structures, etc.).",
"In this way, adjustments to adjustable electrical component 168 may be used to tune antenna 40 and adjustable antenna system 150.FIG.",
"21 is a diagram of adjustable antenna system 150 showing how a component such as component 218 may be coupled to antenna structures such as antenna resonating element 164 and antenna ground 160 using one or more adjustable electrical components 168.Component 218 may be, for example, a camera module (e.g., a camera module component on a flex circuit as described in connection with component 216 on flex circuit 210 of FIG.",
"20), a speaker, a button, a microphone, an input-output connector such as an audio jack or data connector, etc.",
"One or both of the adjustable electrical components may be used in controlling adjustable antenna system 150.If desired, adjustable electrical components 168 may be used to selectively couple component 218 to other adjustable antenna system structures (e.g., transmission line structures, matching circuit structures, feed structures, etc.).",
"FIG.",
"22 is a perspective view of an illustrative configuration that may be used for electronic device 10.As shown in FIG.",
"22, electronic device 10 may have a display such as display 14.Display 14 may include a display module 222 mounted beneath a transparent cover layer such as cover glass layer 220.Components such as transceiver 90 may be mounted within the interior of housing 12.Antenna 40 may include conductive structures such as frame members 224 and 226.Antenna 40 may also include conductive structures such as antenna resonating element structures (e.g., conductive traces on a flex circuit, etc.",
"), conductive structures such as ground plane elements (e.g., a ground plane formed from conductive plate 196 of FIG.",
"15 and overlapping conductive structures such as printed circuit boards, connectors, buttons, speakers, batteries, etc.",
"), and other conductive structures.",
"In the FIG.",
"22 example, frame members 224 and 226 are mounted to housing 12 using fasteners such as screws 228.If desired, other attachment mechanisms may be used to attach frame members within housing 12 (e.g., welds, adhesive, springs, engagement features such as protrusions and mating slots, etc.).",
"Frame members 224 and 226 may be formed from metal or other conductive materials.",
"Adjustable electrical component 168 may be used to control how many frame members such as members 224 and 226 are electrically connected within antenna 40 (e.g., to control the size of an antenna resonating element arm or ground plane) or may be used to control other electrical antenna properties.",
"This allows adjustable antenna system 150 to be tuned as described in connection with FIGS.",
"4 and 5.FIG.",
"23 shows how one or more adjustable electronic components such as adjustable electronic component 168 may be coupled between a ground plane element such as plate member 196 and a portion of peripheral conductive member 180 (e.g., a peripheral housing sidewall or bezel structure).",
"Adjustable component 168 of FIG.",
"23 may be, for example, a switch that can be placed in an open or closed position.",
"Portions of peripheral conductive member 180 and opposing portions of conductive structure 196 may define an opening such as opening 184 with an inner periphery.",
"Component 168 may bridge opening extension 184′.",
"Opening 184 (including extension 184′) may form a slot for a slot antenna or hybrid antenna.",
"The length of the inner periphery of opening 184 may be approximately equal to one wavelength at an operating frequency of interest.",
"Switch 168 may be closed to decrease the length of the inner periphery (to length P) or can be opened to increase the length of the inner periphery (to length P′).",
"Adjustments to component 168 may therefore be used to control the frequency response of antenna 40.The antenna system adjustment mechanisms described in connection with FIGS.",
"1-23 may, if desired, be used in any combination.",
"For example, antenna system adjustments may be made using any combination of transmission line adjustments, matching network adjustments, antenna adjustments, antenna feed adjustments, antenna resonating element adjustments, antenna ground adjustments, etc.",
"Adjustable electrical components 168 may be incorporated into any combination of the portions of antenna system 150 (e.g., to bridge ground gaps, to bridge portions of an antenna resonating element, to connect a ground plate to a peripheral conductive member in a device housing, to connect portions of a peripheral housing member together in various formations and thereby adjust the width of a dielectric gap in the peripheral housing member, to form connections between conductive antenna structures and housing frame members, to bridge any combination of these structures, etc.).",
"FIG.",
"24 is a flow chart of illustrative steps involved in operating an electronic device with an adjustable antenna system such as electronic device 10 of FIG.",
"1.At step 230, storage and processing circuitry 28 (FIG.",
"2) may be used to determine which communications bands are to be used by device 10.For example, if signals are being transmitted over a 2.4 GHz local WiFi link, storage and processing circuitry 28 may conclude that adjustable antenna system 150 will be covering (or should continue to cover) the 2.4 GHz communications band.",
"Wireless communications in various cellular telephone bands may also be supported.",
"The operations of step 230 may involve determination of the capabilities of device 10 (i.e., the capabilities of transceiver 90), the current geographic location of device 10 (e.g., the current country in which device 10 is located), current traffic being handled (e.g., determining what type of cellular traffic or local area network traffic is currently being received on a particular band), etc.",
"Information on currently active bands or bands that need to be covered to receive incoming data may be gathered by monitoring incoming traffic through a fixed antenna (e.g., in a system of the types shown in FIG.",
"3 in which some antennas are fixed and some are adjustable) or by periodically cycling an adjustable antenna system through all possible bands of interest.",
"Information on bands that are to be used for an upcoming activity (e.g., a data transmission activity) may be determined based on factors such as the last band used, geographic location, trial and error, look-up tables mapping device activities to required band usage, etc.",
"At step 232, after having determined which communications bands are to be covered by adjustable antenna system 150, storage and processing circuitry 28 may, in response, issue corresponding control signals to adjustable antenna system 150.If, for example, storage and processing circuitry 28 determines that adjustable antenna system 150 should cover the 1900 MHz band, control signals may be issued to the adjustable electrical components 168 in adjustable antenna system 150 to configure adjustable antenna system 150 to cover the 1900 MHz band (as an example).",
"At step 234, the adjustable electrical component(s) 168 in adjustable antenna system 150 may be controlled by the control signals that have been issued, thereby tuning adjustable antenna system 150 coarsely (e.g., to cover a desired band as described in connection with FIG.",
"4) and/or finely (e.g., to improve tuning accuracy within a particular communications band as described in connection with FIG.",
"5).",
"The operations of FIG.",
"24 (e.g., monitoring to determine which bands are of interest, determining how to adjust components 168, and issuing commands that adjust components 168 and therefore system 150) may be performed repeatedly in real time (e.g., in response to the satisfaction of appropriate trigger criteria, periodically according to a schedule, continuously, etc.).",
"The foregoing is merely illustrative of the principles of this invention and various modifications can be made by those skilled in the art without departing from the scope and spirit of the invention.",
"The foregoing embodiments may be implemented individually or in any combination."
]
] |
Patent_15871388
|
[
[
"Bromine-Facilitated Synthesis of Fluoro-Sulfur Compounds",
"Described herein are methods for the bromine-facilitated synthesis of fluoro-sulfur compounds, that include SF4, SF5Cl, SF5Br and SF6.",
"The methods described herein generally require lower temperature and pressure, produce higher yields, require less time, do not use corrosive or costly reactants and solvents that are commonly used in the synthesis of the fluoro-sulfur compounds, and do not produce deleterious waste products when compared to previously-used methods."
],
[
"1.-17.",
"(canceled) 18.A method comprising: admixing a Br2 reactant, an SF4 reactant, and a CoF3 reactant, thereby initiating a reaction that produces SF6.19.The method of claim 18, wherein the reaction takes place at temperatures from about 10° C. to about 400° C. 20.The method of claim 18, wherein the reaction takes place at temperatures from about 10° C. to about 100° C. 21.The method of claim 18, wherein the SF6 is produced at a yield from about 10% to less than about 100%.",
"22.The method of claim 18, wherein the SF6 is produced at a yield of greater than about 50%.",
"23.The method of claim 18, wherein the admixing occurs at a stoichiometric ratio of about 2 CoF3 to about 1 Br2 to about 1 SF4.24.The method of claim 18, wherein the SF6 is produced at a yield of at least about 10% within about 52 hours.",
"25.The method of claim 18, wherein the reaction occurs in the absence of F2, SF5Cl, IF5, ClF HF, or combinations thereof.",
"26.The method of claim 18, wherein the SF6 is produced at a yield from about 10% to less than 100% within about 52 hours at temperatures from about 10° C. to about 400° C. 27.A method comprising: admixing a Br2 reactant, an SF4 reactant, and a metal fluoride reactant, thereby initiating a reaction that produces SF6 at temperatures from about 10° C. to about 100° C. 28.The method of claim 27, wherein admixing the Br2 reactant, the SF4 reactant, and the metal fluoride reactant takes place in a single stage.",
"29.The method of claim 27, wherein the metal fluoride reactant is selected from CoF3, CeF4, MnF3, PbF4, AgF2, AgF, AuF, or combinations thereof.",
"30.The method of claim 27, wherein the reaction proceeds at temperatures from about 10° C. to about 27° C. 31.The method of claim 27, wherein the reaction proceeds at temperatures from about 27° C. to about 100° C. 32.The method of claim 27, wherein the reaction occurs in the absence of F2, SF5Cl, IF5, ClF HF, or combinations thereof.",
"33.The method of claim 27, wherein the SF6 is produced at a yield from about 10% to less than 100%.",
"34.The method of claim 27, wherein the SF6 is produced at a yield of at least about 10% to less than 100% within about 52 hours 35.The method of claim 27, wherein the SF6 is produced at a yield from about 10% to less than 100% in less than 3 days.",
"36.The method of claim 27, wherein the SF6 is produced at a yield from about 50% to less than 100%.",
"37.The method of claim 27, wherein the metal fluoride reactant is CoF3 and the mixing occurs at a stoichiometric ratio of about 2 CoF3 to about 1 Br2 to about 1 SF4."
],
[
"<SOH> BACKGROUND OF THE INVENTION <EOH>A number of fluoro-sulfur compounds have beneficial applications.",
"For example, sulfur tetrafluoride (SF 4 ) is a widely-used compound produced yearly at the metric ton level, which can be utilized as a deoxofluorinating reagent in converting carboxylic acids, aldehydes, some alcohols and ketones into their corresponding deoxofluorine derivatives (i.e.",
"R—CF 3 , R—CHF 2 , RF, RR′—CF 2 ).",
"SF 4 is also utilized as an etching agent in the electronics industry.",
"Moreover, SF 4 can be utilized as a precursor for the synthesis of other important fluorinated products such as, without limitation, pentafluorosulfur chloride (SF 5 Cl), pentafluorosulfur bromide (SF 5 Br), and sulfur hexafluoride (SF 6 ).",
"Sulfur hexafluoride (SF 6 ), is a compound that is produced by the thousands of metric tons each year, and its worldwide uses include: acting as a PCB replacement and an inert dielectric medium for electrical equipment, the etching of semiconductors, the casting of magnesium, the manufacture of thermal windows, a source of thrust in some rocket propulsion systems, the tracing of air flow through industrial systems, a tamponade for retinal holes of the eye and in medical imaging.",
"Compounds harboring fluoro-organic modifications such as R—CF 3 , R—CHF 2 , RF, RR′—CF 2 and RSF 5 , have been used in a variety of applications including fluorinated therapeutic and diagnostic drugs, pesticides, herbicides, antibiotics, perfluorinated blood substitutes, fungicides, polymer solvents, polymers, lubricants, liquid crystals, surface-active agents, high-boiling solvents, stable solvents, electrically conducting polymers and the like.",
"Utilizing an SF 5 group in the place of CF 3 offers many advantages.",
"Particularly, the SF 5 group possesses greater electronegativity than CF 3 .",
"Moreover, compounds containing SF 5 may be further distinguished by their outstanding chemical properties including high to extreme chemical and thermal stability, hydro- and oleophobicity, lipophilicity, high-density, reduction of shock sensitivity in explosives, low boiling point, low polarizability and low surface tension.",
"While SF 5 -derivatives offer these advantages, they have been difficult to synthesize.",
"The difficulty of obtaining such compounds is in part related to the difficulty of obtaining sufficient and affordable quantities of SF 5 Cl or SF 5 Br, which are the principal chemical reagents used to synthesize and obtain a number of organic or inorganic derivatives that bear the SF 5 -radical moiety.",
"SF 5 Cl, particularly, is a valuable reactant to produce SF 5 -radical bearing derivatives of (sulfur hexafluoride) SF 6 and may be reduced to disulfur decafluoride (S 2 F 10 ) with the latter being converted into pentafluorosulfur bromide (SF 5 Br).",
"SF 5 Cl can also be used in the synthesis of SF 6 .",
"It is of interest that SF 5 Cl can be particularly used in the manufacture of SF 6 by a pyrogenic route (e.g.",
"U.S. Pat.",
"No.",
"4,390,511), whereby a disproportionation occurs according to the following reaction: in-line-formulae description=\"In-line Formulae\" end=\"lead\"?",
"SF 5 Cl→½SF 6 +½SF 4 +½Cl 2 in-line-formulae description=\"In-line Formulae\" end=\"tail\"?",
"In this method, SF 6 is obtained that is free of S 2 F 10 , a compound believed to be highly toxic and a by-product of the manufacture of SF 6 by the reaction of sulfur with fluorine.",
"Accordingly, the use of SF 5 Cl can be used to produce high purity SF 6 .",
"Collectively, a variety of methods have been demonstrated as processes for the production of SF 6 and include U.S. Pat.",
"Nos.",
"2,883,267, 2,912,307, 3,054,661, 3,345,277, 3,399,036, 3,373,000, 4,390,511, 5,639,435 and Japanese Patent No.",
"7,625,497.These methods frequently employ electrochemical preparation, high reaction temperatures and pressures, and/or utilize highly-reactive and/or costly reactants that can include F 2 , SF 5 Cl, IF 5 , SF 4 , ClF and HF.",
"SF 5 Br is also a valuable chemical compound that has been demonstrated as a reactant for the efficient production of SF 5 -radical bearing chemicals; also known as derivatives of SF 6 .",
"Currently available methods of producing fluoro-sulfur compounds suffer a number of drawbacks.",
"The drawbacks generally include the use of excessive temperatures, electrochemical preparation, expensive and/or hazardous reactants, the requirement for numerous successive steps or long reaction times, the production of low or variable yields and/or the generation of toxic by-products.",
"Accordingly, there is room for improvement in the synthesis of fluoro-sulfur compounds."
],
[
"<SOH> SUMMARY OF THE INVENTION <EOH>Described herein are methods for the synthesis of fluoro-sulfur compounds, more specifically SF 4 , SF 5 Cl, SF 5 Br and SF 6 .",
"The methods described herein generally require lower temperatures and pressure, produce high yields, in some cases require less time, do not use highly reactive oxidants or costly reactants and solvents that are commonly used in the synthesis of fluoro-sulfur compounds, and do not produce deleterious waste products when compared to previously-used methods.",
"One embodiment disclosed herein includes a method of producing a fluoro-sulfur compound or a compound made using the produced fluoro-sulfur compound comprising: admixing Br 2 , a metal fluoride reactant, and a sulfur reactant thereby initiating a reaction that produces a yield of the fluoro-sulfur compound of greater than about 10%.",
"In another embodiment, the admixing further includes Cl 2 .",
"In another embodiment, the reaction proceeds at temperature of about 10 to about 400° C. In another embodiment, either S 2 F 10 or BrF, BrF 3 , BrF 5 , CsBrF 4 , CsBrF 2 , acetonitrile, Dioxane, ClF, ClF 3 , NOF, HF, F 2 , (HF) n .amine, IF 5 or combinations thereof are not added to the reaction.",
"Embodiments disclosed herein also include methods of producing SF 4 or a compound made using the produced SF 4 .",
"In one embodiment the method includes admixing a sulfur reactant, a metal fluoride reactant, and a Br 2 reactant thereby initiating a reaction that produces SF 4 at a yield of greater than about 10%.",
"In another embodiment of producing SF 4 or a compound made using the produced SF 4 , the reaction proceeds at a temperature of about 10 to about 400° C. In another embodiment of producing SF 4 or a compound made using the produced SF 4 , the sulfur reactant is S and the metal fluoride is KF and the admixing occurs at a stoichiometric ratio of about 4KF to about 2Br 2 to about 1 S and the reaction proceeds at a temperature of about 10 to about 400° C. In another embodiment of producing SF 4 or a compound made using the produced SF 4 , the metal fluoride is an alkaline earth metal fluoride, an alkali metal fluoride, CsF, RbF, KF, BaF 2 , SrF 2 or a combination thereof and/or the sulfur reactant is S, S 2 Cl 2 , SCl 2 , S 2 Br 2 , SBr 2 or a combination thereof.",
"In an additional embodiment of producing SF 4 or a compound made using the produced SF 4 , the method includes admixing a sulfur reactant, a metal fluoride reactant, a Cl 2 reactant and a Br 2 reagent thereby initiating a reaction that produces SF 4 at a yield of greater than about 10%.",
"In another embodiment of producing SF 4 or a compound made using the produced SF 4 , the reaction proceeds at a temperature of about 10 to about 400° C. In another embodiment of producing SF 4 or a compound made using the produced SF 4 , the sulfur reactant is S and the metal fluoride is KF and the admixing occurs at a stoichiometric ratio of about 4KF to about 1 Br 2 to about 1 S to about 2Cl 2 or the sulfur reactant is SCl 2 and the metal fluoride is KF and the admixing occurs at a stoichiometric ratio of about 4KF to about 1 Br 2 to about 1 SCl 2 to about 1 Cl 2 and the reaction proceeds at a temperature of about 10 to about 400° C. In another embodiment of producing SF4 or a compound made using the produced SF 4 , the metal fluoride is an alkaline earth metal fluoride, an alkali metal fluoride, CsF, RbF, KF, BaF 2 , NaF, SrF 2 or a combination thereof and/or the sulfur reactant is S, S 2 Cl 2 , SCl 2 , S 2 Br 2 , SBr 2 or a combination thereof.",
"Embodiments disclosed herein also include methods of producing SF 5 Cl or a compound made using the produced SF 5 Cl.",
"In one embodiment the method includes admixing a Cl 2 reactant, a sulfur reactant, a metal fluoride reactant, and Br 2 reagent thereby initiating a reaction that produces the SF 5 Cl at a yield of greater than about 50%.",
"In another embodiment of producing SF 5 Cl or a compound made using the produced SF 5 Cl, the reaction proceeds at a temperature of about 10 to about 200° C. In another embodiment of producing SF 5 Cl or a compound made using the produced SF 5 Cl, the sulfur reactant is S and the metal fluoride is KF and the admixing occurs at a stoichiometric ratio of about 5KF to about 1 Br 2 to about 1 S to about 3Cl 2 or the sulfur reactant is SF 4 and the metal fluoride is KF and the admixing occurs at a stoichiometric ratio of about 1KF to about 1 Br 2 to about 1 SF 4 to about 1Cl 2 or the sulfur reactant is SCl 2 and the metal fluoride is KF and the admixing occurs at a stoichiometric ratio of about 5KF to about 1 Br 2 to about 1 SCl 2 to about 2Cl 2 and the reaction proceeds at a temperature of about 10 to about 200° C. In another embodiment of producing SF 5 Cl or a compound made using the produced SF 5 Cl, the metal fluoride is an alkaline earth metal fluoride, an alkali metal fluoride, CsF, RbF, KF, BaF 2 , SrF 2 or a mixture thereof and/or the sulfur reactant S, S 2 Cl 2 , SCl 2 , SF 4 or a combination thereof.",
"Embodiments disclosed herein also include methods of producing SF 5 Br or a compound made using the produced SF 5 Br.",
"In one embodiment the method includes admixing a Br 2 reactant, a sulfur reactant, and a metal fluoride reactant thereby initiating a reaction that produces SF 5 Br at a yield of greater than about 50%.",
"In another embodiment of producing SF 5 Br or a compound made using the produced SF 5 Br, either S 2 F 10 or BrF, BrF 3 , BrF 5 , CsBrF 4 , CsBrF 2 or mixtures thereof are not added to the reaction.",
"In another embodiment of producing SF 5 Br or a compound made using the produced SF 5 Br, the reaction proceeds at a temperature of about 10 to about 140° C. In another embodiment of producing SF 5 Br or a compound made using the produced SF 5 Br, the sulfur reactant is SF 4 and the metal fluoride is AgF and the admixing occurs at a stoichiometric ratio of about 1 AgF to about 1 Br 2 to about 1 SF 4 or the sulfur reactant is SF 4 and the metal fluoride is AgF 2 and the admixing occurs at a stoichiometric ratio of about 2AgF 2 to about 3 Br 2 to about 4 SF 4 and the reaction proceeds at a temperature of about 10 to about 140° C. In another embodiment of producing SF 5 Br or a compound made using the produced SF 5 Br, the metal fluoride is an alkaline earth metal fluorides, an alkali metal fluorides, AgF 2 , AgF, AuF, MnF 3 , PbF 4 , CeF 4 or a mixture thereof.",
"Embodiments disclosed herein also include methods of producing SF 6 or a compound made using the produced SF 6 .",
"In one embodiment, the method includes: admixing a Br 2 reactant, an SF 4 reactant, and a metal fluoride reactant thereby initiating a reaction that produces SF 6 at a yield of greater than about 50%.",
"In another embodiment of producing SF 6 or a compound made using the produced SF 6 , the reaction proceeds at a temperature of about 10 to about 400° C. In another embodiment of producing SF 6 or a compound made using the produced SF 6 , the sulfur reactant is SF 4 and the metal fluoride is CoF 3 and the admixing occurs at a stoichiometric ratio of about 2 CoF 3 to about 1 Br 2 to about 1 SF 4 and the reaction proceeds at a temperature of about 10 to about 400° C. In another embodiment of producing SF 6 or a compound made using the produced SF 6 , the metal fluoride is selected from the group consisting of an alkaline earth metal fluoride, an alkali metal fluoride, CoF 3 , MnF 3 , PbF 4 , CeF4 or a mixture thereof.",
"detailed-description description=\"Detailed Description\" end=\"lead\"?"
],
[
"CROSS REFERENCE TO RELATED APPLICATIONS This application is a divisional of U.S. patent application Ser.",
"No.",
"12/746,717, filed Jun.",
"7, 2010 and claims the benefit of U.S.",
"Provisional Patent Application No.",
"61/060,642, filed Jun.",
"11, 2008, U.S.",
"Provisional Patent Application No.",
"61/153,180, filed Feb. 17, 2009, U.S.",
"Provisional Patent Application No.",
"61/176,674, filed May 8, 2009, and U.S. Non-Provisional patent application Ser.",
"No.",
"12/746,717, filed Jun.",
"7, 2010, which is a national stage application of PCT Patent Application No.",
"PCT/US09/47116, filed Jun.",
"11, 2009, the entire disclosures of which are incorporated herein by reference.",
"FIELD OF THE INVENTION Disclosed herein are methods of synthesizing fluoro-sulfur compounds.",
"The disclosed methods use bromine to promote the synthesis of fluoro-sulfur compounds while avoiding the use excessive temperatures, electrochemical preparation, or the use of traditionally used solvents or reactants generally deemed less desirable due to toxicity, excess reactivity or cost.",
"BACKGROUND OF THE INVENTION A number of fluoro-sulfur compounds have beneficial applications.",
"For example, sulfur tetrafluoride (SF4) is a widely-used compound produced yearly at the metric ton level, which can be utilized as a deoxofluorinating reagent in converting carboxylic acids, aldehydes, some alcohols and ketones into their corresponding deoxofluorine derivatives (i.e.",
"R—CF3, R—CHF2, RF, RR′—CF2).",
"SF4 is also utilized as an etching agent in the electronics industry.",
"Moreover, SF4 can be utilized as a precursor for the synthesis of other important fluorinated products such as, without limitation, pentafluorosulfur chloride (SF5Cl), pentafluorosulfur bromide (SF5Br), and sulfur hexafluoride (SF6).",
"Sulfur hexafluoride (SF6), is a compound that is produced by the thousands of metric tons each year, and its worldwide uses include: acting as a PCB replacement and an inert dielectric medium for electrical equipment, the etching of semiconductors, the casting of magnesium, the manufacture of thermal windows, a source of thrust in some rocket propulsion systems, the tracing of air flow through industrial systems, a tamponade for retinal holes of the eye and in medical imaging.",
"Compounds harboring fluoro-organic modifications such as R—CF3, R—CHF2, RF, RR′—CF2 and RSF5, have been used in a variety of applications including fluorinated therapeutic and diagnostic drugs, pesticides, herbicides, antibiotics, perfluorinated blood substitutes, fungicides, polymer solvents, polymers, lubricants, liquid crystals, surface-active agents, high-boiling solvents, stable solvents, electrically conducting polymers and the like.",
"Utilizing an SF5 group in the place of CF3 offers many advantages.",
"Particularly, the SF5 group possesses greater electronegativity than CF3.Moreover, compounds containing SF5 may be further distinguished by their outstanding chemical properties including high to extreme chemical and thermal stability, hydro- and oleophobicity, lipophilicity, high-density, reduction of shock sensitivity in explosives, low boiling point, low polarizability and low surface tension.",
"While SF5-derivatives offer these advantages, they have been difficult to synthesize.",
"The difficulty of obtaining such compounds is in part related to the difficulty of obtaining sufficient and affordable quantities of SF5Cl or SF5Br, which are the principal chemical reagents used to synthesize and obtain a number of organic or inorganic derivatives that bear the SF5-radical moiety.",
"SF5Cl, particularly, is a valuable reactant to produce SF5-radical bearing derivatives of (sulfur hexafluoride) SF6 and may be reduced to disulfur decafluoride (S2F10) with the latter being converted into pentafluorosulfur bromide (SF5Br).",
"SF5Cl can also be used in the synthesis of SF6.It is of interest that SF5Cl can be particularly used in the manufacture of SF6 by a pyrogenic route (e.g.",
"U.S. Pat.",
"No.",
"4,390,511), whereby a disproportionation occurs according to the following reaction: SF5Cl→½SF6+½SF4+½Cl2 In this method, SF6 is obtained that is free of S2F10, a compound believed to be highly toxic and a by-product of the manufacture of SF6 by the reaction of sulfur with fluorine.",
"Accordingly, the use of SF5Cl can be used to produce high purity SF6.Collectively, a variety of methods have been demonstrated as processes for the production of SF6 and include U.S. Pat.",
"Nos.",
"2,883,267, 2,912,307, 3,054,661, 3,345,277, 3,399,036, 3,373,000, 4,390,511, 5,639,435 and Japanese Patent No.",
"7,625,497.These methods frequently employ electrochemical preparation, high reaction temperatures and pressures, and/or utilize highly-reactive and/or costly reactants that can include F2, SF5Cl, IF5, SF4, ClF and HF.",
"SF5Br is also a valuable chemical compound that has been demonstrated as a reactant for the efficient production of SF5-radical bearing chemicals; also known as derivatives of SF6.Currently available methods of producing fluoro-sulfur compounds suffer a number of drawbacks.",
"The drawbacks generally include the use of excessive temperatures, electrochemical preparation, expensive and/or hazardous reactants, the requirement for numerous successive steps or long reaction times, the production of low or variable yields and/or the generation of toxic by-products.",
"Accordingly, there is room for improvement in the synthesis of fluoro-sulfur compounds.",
"SUMMARY OF THE INVENTION Described herein are methods for the synthesis of fluoro-sulfur compounds, more specifically SF4, SF5Cl, SF5Br and SF6.The methods described herein generally require lower temperatures and pressure, produce high yields, in some cases require less time, do not use highly reactive oxidants or costly reactants and solvents that are commonly used in the synthesis of fluoro-sulfur compounds, and do not produce deleterious waste products when compared to previously-used methods.",
"One embodiment disclosed herein includes a method of producing a fluoro-sulfur compound or a compound made using the produced fluoro-sulfur compound comprising: admixing Br2, a metal fluoride reactant, and a sulfur reactant thereby initiating a reaction that produces a yield of the fluoro-sulfur compound of greater than about 10%.",
"In another embodiment, the admixing further includes Cl2.In another embodiment, the reaction proceeds at temperature of about 10 to about 400° C. In another embodiment, either S2F10 or BrF, BrF3, BrF5, CsBrF4, CsBrF2, acetonitrile, Dioxane, ClF, ClF3, NOF, HF, F2, (HF)n.amine, IF5 or combinations thereof are not added to the reaction.",
"Embodiments disclosed herein also include methods of producing SF4 or a compound made using the produced SF4.In one embodiment the method includes admixing a sulfur reactant, a metal fluoride reactant, and a Br2 reactant thereby initiating a reaction that produces SF4 at a yield of greater than about 10%.",
"In another embodiment of producing SF4 or a compound made using the produced SF4, the reaction proceeds at a temperature of about 10 to about 400° C. In another embodiment of producing SF4 or a compound made using the produced SF4, the sulfur reactant is S and the metal fluoride is KF and the admixing occurs at a stoichiometric ratio of about 4KF to about 2Br2 to about 1 S and the reaction proceeds at a temperature of about 10 to about 400° C. In another embodiment of producing SF4 or a compound made using the produced SF4, the metal fluoride is an alkaline earth metal fluoride, an alkali metal fluoride, CsF, RbF, KF, BaF2, SrF2 or a combination thereof and/or the sulfur reactant is S, S2Cl2, SCl2, S2Br2, SBr2 or a combination thereof.",
"In an additional embodiment of producing SF4 or a compound made using the produced SF4, the method includes admixing a sulfur reactant, a metal fluoride reactant, a Cl2 reactant and a Br2 reagent thereby initiating a reaction that produces SF4 at a yield of greater than about 10%.",
"In another embodiment of producing SF4 or a compound made using the produced SF4, the reaction proceeds at a temperature of about 10 to about 400° C. In another embodiment of producing SF4 or a compound made using the produced SF4, the sulfur reactant is S and the metal fluoride is KF and the admixing occurs at a stoichiometric ratio of about 4KF to about 1 Br2 to about 1 S to about 2Cl2 or the sulfur reactant is SCl2 and the metal fluoride is KF and the admixing occurs at a stoichiometric ratio of about 4KF to about 1 Br2 to about 1 SCl2 to about 1 Cl2 and the reaction proceeds at a temperature of about 10 to about 400° C. In another embodiment of producing SF4 or a compound made using the produced SF4, the metal fluoride is an alkaline earth metal fluoride, an alkali metal fluoride, CsF, RbF, KF, BaF2, NaF, SrF2 or a combination thereof and/or the sulfur reactant is S, S2Cl2, SCl2, S2Br2, SBr2 or a combination thereof.",
"Embodiments disclosed herein also include methods of producing SF5Cl or a compound made using the produced SF5Cl.",
"In one embodiment the method includes admixing a Cl2 reactant, a sulfur reactant, a metal fluoride reactant, and Br2 reagent thereby initiating a reaction that produces the SF5Cl at a yield of greater than about 50%.",
"In another embodiment of producing SF5Cl or a compound made using the produced SF5Cl, the reaction proceeds at a temperature of about 10 to about 200° C. In another embodiment of producing SF5Cl or a compound made using the produced SF5Cl, the sulfur reactant is S and the metal fluoride is KF and the admixing occurs at a stoichiometric ratio of about 5KF to about 1 Br2 to about 1 S to about 3Cl2 or the sulfur reactant is SF4 and the metal fluoride is KF and the admixing occurs at a stoichiometric ratio of about 1KF to about 1 Br2 to about 1 SF4 to about 1Cl2 or the sulfur reactant is SCl2 and the metal fluoride is KF and the admixing occurs at a stoichiometric ratio of about 5KF to about 1 Br2 to about 1 SCl2 to about 2Cl2 and the reaction proceeds at a temperature of about 10 to about 200° C. In another embodiment of producing SF5Cl or a compound made using the produced SF5Cl, the metal fluoride is an alkaline earth metal fluoride, an alkali metal fluoride, CsF, RbF, KF, BaF2, SrF2 or a mixture thereof and/or the sulfur reactant S, S2Cl2, SCl2, SF4 or a combination thereof.",
"Embodiments disclosed herein also include methods of producing SF5Br or a compound made using the produced SF5Br.",
"In one embodiment the method includes admixing a Br2 reactant, a sulfur reactant, and a metal fluoride reactant thereby initiating a reaction that produces SF5Br at a yield of greater than about 50%.",
"In another embodiment of producing SF5Br or a compound made using the produced SF5Br, either S2F10 or BrF, BrF3, BrF5, CsBrF4, CsBrF2 or mixtures thereof are not added to the reaction.",
"In another embodiment of producing SF5Br or a compound made using the produced SF5Br, the reaction proceeds at a temperature of about 10 to about 140° C. In another embodiment of producing SF5Br or a compound made using the produced SF5Br, the sulfur reactant is SF4 and the metal fluoride is AgF and the admixing occurs at a stoichiometric ratio of about 1 AgF to about 1 Br2 to about 1 SF4 or the sulfur reactant is SF4 and the metal fluoride is AgF2 and the admixing occurs at a stoichiometric ratio of about 2AgF2 to about 3 Br2 to about 4 SF4 and the reaction proceeds at a temperature of about 10 to about 140° C. In another embodiment of producing SF5Br or a compound made using the produced SF5Br, the metal fluoride is an alkaline earth metal fluorides, an alkali metal fluorides, AgF2, AgF, AuF, MnF3, PbF4, CeF4 or a mixture thereof.",
"Embodiments disclosed herein also include methods of producing SF6 or a compound made using the produced SF6.In one embodiment, the method includes: admixing a Br2 reactant, an SF4 reactant, and a metal fluoride reactant thereby initiating a reaction that produces SF6 at a yield of greater than about 50%.",
"In another embodiment of producing SF6 or a compound made using the produced SF6, the reaction proceeds at a temperature of about 10 to about 400° C. In another embodiment of producing SF6 or a compound made using the produced SF6, the sulfur reactant is SF4 and the metal fluoride is CoF3 and the admixing occurs at a stoichiometric ratio of about 2 CoF3 to about 1 Br2 to about 1 SF4 and the reaction proceeds at a temperature of about 10 to about 400° C. In another embodiment of producing SF6 or a compound made using the produced SF6, the metal fluoride is selected from the group consisting of an alkaline earth metal fluoride, an alkali metal fluoride, CoF3, MnF3, PbF4, CeF4 or a mixture thereof.",
"DETAILED DESCRIPTION OF THE INVENTION Described herein are methods for the synthesis of fluoro-sulfur compounds in the presence of Br2.In certain exemplary embodiments the fluoro-sulfur compounds are SF4, SF5Cl SF5Br and SF6.The methods disclosed herein involve the mixing of readily available and relatively inexpensive reactants.",
"When compared to previously-used approaches, the methods described herein generally require lower temperatures and pressure, produce high yields, require less time, do not use excessively reactive or costly reactants and solvents that are frequently utilized in the synthesis of the fluoro-sulfur compounds, do not produce deleterious waste products or one or more of the above in various combinations.",
"Disclosed methods of synthesizing SF4 utilize Br2 in both the presence and absence of Cl2, whereas disclosed methods of synthesizing SF5Cl utilize Br2 in the presence of Cl2.Disclosed methods of synthesizing SF4 and SF5Cl can utilize Br2 in the absence of excessive temperature and pressure, and, in certain embodiments, in the absence of acetonitrile, Dioxane, ClF, ClF3, NOF, HF, F2, (HF)n.amine and/or IF5.Disclosed methods of synthesizing SF5Br utilize Br2 and can be carried out in the absence of high reaction temperatures and pressures, and in certain embodiments, in the absence of S2F10, BrF3, BrF5, CsBrF4 and/or CsBrF2.Disclosed methods of synthesizing SF6 utilize Br2 and can be carried out in the absence of electrochemical preparation, high reaction temperatures and/or pressures, and, in certain embodiments, in the absence of F2, SF5Cl, IF5, SF4, ClF and/or HF.",
"As used herein “metal fluoride (MF)” encompasses a variety of mono or multivalent MFs including, without limitation, alkaline earth fluorides and alkali metal fluorides and can particularly include, without limitation, CoF3, CeF4, MnF3, PbF4, CsF, RbF, KF, BaF2, SrF2, AgF2, AgF and AuF.",
"As used herein, the term “about” is used to indicate that a value includes the standard deviation of error for the device or method being employed to determine the value.",
"In one example embodiment, the synthesis of SF4 is described.",
"One example synthesis reaction for SF4 can proceed as follows in reaction I: 4KF+S+2Br2→SF4+4KBr I.",
"In reaction I, the SF4-producing reaction can proceed at autogenous or elevated reaction pressures at ambient temperatures of about 10 to about 27° C., or at a mildly-elevated temperatures of up to about 80° C., or even at higher temperatures that are below those (about 400 to about 500° C.) which promote SF4 to disproportionate into S and SF6.Accordingly, the described methods do not require excessive temperatures or pressures or require the use of unusually reactive or costly reactants or solvents that are commonly used in the synthesis of SF4, such as, but not limited to acetonitrile, Dioxane, HF, F2, Cl2, (HF)n.amine and IF5.The described reaction I can produce yields ranging from about 57 to about 96% or greater, in a time frame of several hours to several days.",
"Due to the low cost of the reagents used, modifying the reaction to produce lower yields can also be commercially advantageous.",
"In one embodiment, yields of 10% or higher can be produced.",
"This reaction does not create or leave behind undesirable side products.",
"Only Br2, MFs and sulfur bromides that can easily be removed and discarded or recycled into subsequent production runs of SF4 or other unrelated chemical reactions, are created.",
"Moreover, the disclosed reaction produces little or no gases, other than SF4, making purification of the SF4 end-product a simple process.",
"Particularly, low boiling constituents (SF4) or excess unused Br2 can be separated by lowering the temperature and transferring into a cold trap.",
"This described reaction I provides a method for synthesizing SF4 employing Br2 in the absence of Cl2.The absence of Cl2 in this reaction prevents the formation of SF5Cl when SF4 is the desired SF4 end-product.",
"In another example embodiment, either S, Br2, or both S and Br2 can be replaced by sulfur bromides (e.g.",
"S2Br2, SBr2) in the production of SF4.In one embodiment, specifically relating to reaction I, S to Br2 molar ratios of greater than about 1.00:2.00 can be used.",
"In alternative embodiments, ratios ranging from about 1.00:0.44 to about 1.00:5.33 can also be used.",
"In another example embodiment, particularly useful MFs in the production of SF4 and SF5Cl include, without limitation, CsF, RbF, KF, BaF2, SrF2 or a combination thereof.",
"Further described herein are methods for the production of SF5Cl, and optionally SF4 (in the presence of Cl2), utilizing Br2 as a solvent and/or reactive solvent.",
"In the case of S as a reactant, when SF4 is the desired product, slightly more than about four equivalents of the MF can be used.",
"If SF5Cl is the desired product, slightly more than about five equivalents of the MF can be used.",
"When SF4 is used as a reactant to produce SF5Cl, an equivalent or slightly larger amount of the MF can be utilized to efficiently produce the SF5Cl.",
"The minimum amount of Cl2 in the reactions can easily be determined by the stoichiometry of the reaction itself.",
"In the present example embodiment, KF is used as the MF, however, a variety of other mono or multivalent MFs can be used.",
"Example synthesis reactions for SF4 and SF5Cl in the presence of Cl2 as described above proceed as follows in reactions II-IV: 4KF+S+2Cl2+(Br2)→SF4+4KCl+(Br2) II.",
"5KF+S+3Cl2+(Br2)→SF5Cl+5KCl+(Br2) III.",
"KF+SF4+Cl2+(Br2)→SF5Cl+KCl+(Br2) IV.",
"In reactions II-IV above, the SF5Cl- and SF4-producing reactions can proceed at autogenous or elevated reaction pressures, at ambient temperatures of about 10 to about 27° C., or at a mildly-elevated temperatures of up to about 115° C., or, even at higher temperatures that are below those which promote decomposition of SF5Cl (about 200 to about 400° C.), or cause SF4 to disproportionate into S and SF6 (about 400 to about 500° C.).",
"Accordingly, the described methods do not require excessive temperatures or pressures or require the use of unusually reactive or costly reactants or solvents that are commonly used in the synthesis of SF4 and SF5Cl, such as, but not limited to acetonitrile, Dioxane, ClF, ClF3, NOF, HF, F2, (HF)n.amine and IF5.The described reaction III above can produce yields of about 88 to about 95% or greater and can theoretically approach 100%, in a time frame of several hours to several weeks.",
"Due to the low cost of the reagents used, modifying the reaction to produce lower yields can also be commercially advantageous.",
"In one embodiment, yields of 50% or higher can be produced.",
"Other lower yields, such as yields as low as 10%, are also within the scope of embodiments disclosed herein.",
"This reaction does not create or leave behind undesirable side products.",
"Br2 can be easily separated from the reaction products and then SF5Cl and any excess Cl2 can be collected by cooling the reaction vessel to approximately −80° C. and condensing out SF5Cl and any excess Cl2 at reduced pressure.",
"Cl2 can be removed from the mixture by storage over elemental sulfur and the recovered sulfur chlorides can be used for a new production batch of either SF4 or SF5Cl.",
"One function of the chlorine in the procedure is to oxidize sulfur to sulfur chlorides (e.g.",
"S2Cl2, SCl2) as the predominant sulfur species, which exchange chlorine for fluorine with a fluoride.",
"Thus, it will not be necessary to dispose of sulfur chlorides as waste.",
"Collectively, the recovered Cl2 as well as the recovered sulfur chlorides and Br2, may be used in a near quantitative fashion, as outlined in the following reactions: 4KF+SCl2+Cl2+(Br2)→SF4+4KCl+(Br2) V. 5KF+SCl2+2Cl2+(Br2)→SF5Cl+5KCl+(Br2) VI.",
"In the SF4-producing reaction, a small amount of SF5Cl may be formed as a by-product.",
"In each of the reactions, the function of Br2 may be to provide an improved reaction environment with Br2 possibly acting as a solvent, a reactive solvent or with Cl2 forming BrCl from the Br2+Cl2 upon mixing.",
"Interestingly, it has been shown previously, that without the addition of Br2, KF+SF4+Cl2 yields, upon intense heating (about 75 to about 150° C. or about 220 to about 300° C.) only variable amounts (about 5 to about 80%) of SF5Cl (Bekker et al., Isw.",
"Akad.",
"Nauk U.S.S.R., Bull.",
"Ser.",
"Chim.",
"2575, 1970; U. Jonethal, R. Kuschel, K. Seppelt, J. Fl.",
"Chem.",
"88, 3, 1998).",
"Thus, the Br2 utilized in the present methods alleviates the requirement for excessive temperature (energy input), and also improves both the yield and the consistency of the yield, as well as the overall ease of production.",
"Moreover, when using S instead of SF4 as the sulfur source to produce SF5Cl, the use of Br2 alleviates both the requirement for SF4 and excessive temperature, as other methods which do not utilize Br2 (excess CsF+S+3 Cl2 at about 175° C.) do not produce meaningful amounts of SF5Cl.",
"The methods described herein employ the use of Br2 as a solvent or reactive solvent in the production of SF5Cl and SF4, which in turn promotes the transfer of both fluorine and chlorine into the production of the SF5Cl and SF4 end-products.",
"Alternatively, in the SF5Cl-producing reaction, S and Cl2 may be replaced by sulfur chlorides (e.g.",
"S2Cl2, SCl2) or SF4, if desired.",
"In both the SF5Cl- and SF4-producing reactions described herein, when there is insufficient Br2 present, the reactions are either extremely slow or do not progress at all.",
"Further, in both the SF5Cl- and SF4-producing reactions that utilize Cl2 as a reactant, a Br2 to S molar ratio greater than about 1:1 can be used.",
"Ratios of from about 1:2 to about 2:1 can also be used.",
"Particularly useful MFs in the production of SF5Cl and SF4 include, without limitation, CsF, RbF, KF, BaF2, SrF2 and combinations thereof.",
"In another example embodiment disclosed herein, the synthesis of SF5Br is described.",
"In the case where SF4 and Br2 are reactants, more than about 1 equivalent of a metal monofluoride (AgF) can be used or about 2 equivalents can be used in the case of a metal difluoride (AgF2).",
"Example synthesis reactions for SF5Br can proceed as follows: AgF+SF4+Br2→SF5Br+AgBr VII.",
"2AgF2+4SF4+3Br2→4SF5Br+2AgBr VIII.",
"These reactions can be run at ambient temperatures (about 10 to about 27° C.) or at temperatures up to those at which SF5Br begins to decompose (about 140 to about 150° C.) and at the autogenous pressures generated in closed reactor vessels.",
"Highly-reactive and/or costly reactants that are commonly used to synthesize SF5Br, such as, without limitation, S2F10, BrF3, BrF5, CsBrF4 and CsBrF2 are not necessary.",
"The described reaction can produce yields of about 75% and can theoretically approach 100%, in a time frame of several hours to several days.",
"Due to the low cost of the reagents used, modifying the reaction to produce lower yields can also be commercially advantageous.",
"In one embodiment, yields of 50% or higher can be produced.",
"Other lower yields, such as yields as low as 10%, are also within the scope of embodiments disclosed herein.",
"The reaction does not create or leave behind undesirable side products.",
"SF5Br and any excess Br2 can be collected by cooling the reaction vessel to approximately −78° C. and condensing out the SF5Br.",
"The Br2 can be easily recycled into subsequent reactions including, without limitation, the production of SF5Br, whereas AgBr can be readily reutilized in subsequent reactions including, without limitation, SF5Br reactions by reforming the metal fluoride (without limitation, AgF or AgF2).",
"In one example embodiment, the present SF5Br production methods can employ only SF4, a MF, for example and without limitation, AgF or AgF2, and Br2 as reactants.",
"Particularly useful MFs in the production of SF5Br include, without limitation, CeF4, MnF3, PbF4, AgF2, AgF, AuF or a mixture thereof.",
"Further, the methods described herein for producing SF5Br eliminate inefficient multi-step production protocols that are currently used.",
"In another example embodiment disclosed herein, the synthesis of SF6 is described.",
"In the case where SF4 and Br2 are reactants, more than about 2 equivalents of a MF capable of transferring about one fluorine equivalent, such as CoF3, can be used.",
"An example synthesis reaction for SF6 can proceed as follows: 2CoF3+SF4+(Br2)→SF6+2CoF2+(Br2) IX.",
"Reaction IX shown above can be run at ambient temperatures or theoretically up to temperatures at which SF4 begins to decompose (about 400 to about 500° C.), and at the autogenous pressures generated in closed reactor vessels.",
"Electrochemical preparation, high temperatures and pressures as well as highly-reactive and/or costly reactants (without limitation, F2, SF5Cl, IF5, SF4, ClF and HF) that are commonly used to synthesize SF6 can be avoided.",
"Due to the low cost of the reagents used, modifying the reaction to produce lower yields can also be commercially advantageous.",
"In one embodiment, yields of 50% or higher can be produced.",
"Other lower yields, such as yields as low as 10%, are also within the scope of embodiments disclosed herein.",
"In the described reaction IX, the Br2 can be easily recycled into subsequent reactions including, without limitation, the production of additional SF6, whereas CoF2 can be readily re-fluorinated to CoF3 and reutilized in subsequent SF6 reactions as well as other reactions.",
"In one example embodiment, the present SF6 production methods can employ only SF4, a MF, for example and without limitation, CeF4, MnF3, PbF4, AgF2, AgF, AuF and mixtures thereof as reactants.",
"Further, the methods described herein for producing SF6 eliminate inefficient multi-step production protocols that are currently used.",
"The reactions described herein for producing SF4, SF5Cl, SF5Br and SF6 can be performed at temperatures below those commonly used in the art.",
"In one example embodiment, the reactions are carried out at or near room (ambient) temperature (about 10 to about 27° C.).",
"In other embodiments, the temperature is from about 10° C. to about 27° C. (ambient), or from about 27° C. to about 115° C. Higher temperatures can theoretically be used, for example, up to about 250° C. to about 500° C. (up to temperatures at which SF4, SF5Cl and SF5Br decompose).",
"Additionally, lower temperatures can be used, for example down to about −10° C.; a temperature at which Br2 would solidify.",
"While permissible, however, these more extreme reaction temperatures are not required.",
"The reactions described herein for producing SF4, SF5Cl, SF5Br and SF6 can be performed at pressures below those commonly used in the art.",
"In one example embodiment, the reactions are carried out just above atmospheric pressure, at autogenous pressures that are estimated of only up to about 10 atms.",
"In other embodiments, at higher temperatures, the pressure is estimated to be from about 10 atm to about 40 atm.",
"Slightly higher pressures can also be used.",
"For example, it is estimated that up to about 100 atm could be used.",
"Additionally, lower pressures can be used, for example down to about 0.5 atms, or about 0.01 atms, or about 0.001 atms.",
"While permissible, however, these more extreme pressures are not required.",
"Further, in some embodiments, the reactions for producing SF4, SF5Cl, SF5Br and SF6 described herein can be carried out in one or more physical configuration that increases the reaction surface area of the solid phase reactants.",
"For example, the solid phase reactants can be spray-dried, finely dispersed, or otherwise subjected to commonly used methods which increase the surface area.",
"In some example embodiments, the reactants for producing SF4, SF5Cl, SF5Br and SF6 can be physically or mechanically agitated to aid the reactions.",
"For example, inversion, milling/grinding, ball-milling, stirring, rotation, and the like can be used.",
"Such mechanical agitation methods can minimize MFBr or MFCl formation that can mask the effective MF reaction surface area and slow the progression of desired reactions.",
"The methods described herein theoretically can generate SF4, SF5Cl, SF5Br and SF6 at near 100% yields.",
"In one example embodiment, the yield is between about 57% and about 96%.",
"In another embodiment the yield is about 95% In another embodiment, the yield is about 75%.",
"As will be understood by one of ordinary skill in the art, depending on the reactants used and the desired end-products, the conditions of the reaction and the like, the time for a reaction to be substantially complete varies.",
"Substantially complete means a particular reaction is within about 10% of completion, within about 5% of completion or within about 1% or less of completion.",
"Reaction times can be as short as about a few hours to as long as about several days or weeks.",
"In some embodiments, the reactions are substantially complete within less than about 30 days, less than about 17 days, less than about 14 days, less than about 6 days, less than about 4 days, less than about 3 days, less than about 2 days or less than about 1 day.",
"In other embodiments, the reactions are substantially complete within less than about 8 hours, less than about 4 hours or less than about 3 hours.",
"Reactions described herein can be modified by those skilled in the art.",
"As such, altering the order of adding and mixing of reactants and reagents, adjusting relative molar ratios of reactants, as well as altering reaction times, temperatures and pressures, to more precisely control specific reaction outcomes, and maximizing the ease and production of the desired end product are within the scope of the present description.",
"The following examples are included to demonstrate embodiments of the disclosed methods and processes.",
"It should be appreciated by those of ordinary skill in the art that the techniques disclosed in the examples which follow represent techniques discovered by the inventor to function well in the practice of the present disclosure, and thus can be considered to constitute preferred modes for its practice.",
"However, those of ordinary skill in the art should, in light of the present disclosure, appreciate that many changes can be made in the specific embodiments which are disclosed and still obtain a like or similar result.",
"Example 1.Formation of SF4 Anhydrous fine grain KF powder (about 5.09 g) was dried in a stainless steel 100-ml Hoke bomb tube reactor at about 150° C. to about 200° C., for about 1 hour, at high vacuum (about 0.05 to about 0.1 torr).",
"The reactor was allowed to cool to ambient temperature, opened, and fine-grain S powder (about 0.69 g) was added.",
"Cl2 (about 3.13 g) and Br2 (about 1.5 g) were then added to the reactor vessel by condensation to produce a molar ratio of S:Cl2:KF:Br2 of about 1.0:2.0:4.1:0.44.The vessel was kept at ambient temperature overnight and little or no SF5Cl and SF4 were detected from the infrared (IR) spectrum of the gaseous phase.",
"IR spectrometry was performed using a Model 4020 Galaxy FTIR spectrophotometer (Mattson Instruments, Madison, Wis. 53711, USA).",
"No change in the IR spectrum was noticed after about four more days.",
"More Br2 (about 5.5 g) was added to the reactor vessel by condensation to produce a new molar ratio of: S:Cl2:KF:Br2 of about 1:2.0:4.1:2.0.After about 4 days at ambient temperature, a very strong SF4-specific spectral signal was observed (e.g.",
"band groups centered at about 876 cm−1 and about 730 cm−1), which was accompanied by a very weak SF5Cl IR spectral signal (e.g.",
"band groups centered at about 909 cm−1, about 855 cm−1 and about 602 cm−1), The reaction displayed a high degree of conversion to SF4, as indicated by the IR spectrum.",
"This example illustrates that: 1.)",
"increasing the molar ratio of Br2 appears to promote the formation of SF4, and 2.)",
"SF4 can be efficiently synthesized within about 4 days at ambient temperatures in the reaction: 4KF+S+2Cl2+(Br2)→SF4+4KCl+(Br2).",
"Example 2.Formation of SF4 at an Elevated Temperature Anhydrous fine-grain KF powder (about 10.50 g) was dried in a stainless steel 100-ml Hoke bomb tube reactor at about 150° C. to 200° C., for about 1 hour, at high vacuum.",
"The reactor was allowed to cool to ambient temperature, opened, and fine-grain S powder (about 1.37 g) was added.",
"Cl2 (about 6.1 g) and Br2 (about 14.3 g) were then added to the reactor vessel by condensation to produce a molar ratio of S:Cl2:KF:Br2 of about 1.00:2.00:4.23:2.09.The vessel was then kept at a temperature of 65-70° C. for 30 days.",
"Initially, some SF5Cl besides SF4 was detected in the IR spectrum of the gaseous constituents of the reactor bomb tube, but it disappeared in the course of time and no SF5Cl was detected after 30 days, only SF4.",
"(IR spectrometry was performed).",
"The reactor vessel bomb tube was cooled to −78° C., and pumped on through a liquid-nitrogen cooled cold trap for two hours.",
"The crude product (4.6 g) was stored in a reactor vessel bomb tube over sulfur (20 g) for 20 hours to remove excess chlorine that might be present.",
"After cooling the sulfur-treatment vessel to −78° C., the product was collected in a cold trap (liquid nitrogen) as before.",
"A yellow tinge was removed by treatment with Hg.",
"The final mass of the recovered SF4 end product was about 4.08 g for a calculated yield of about 88% (based upon sulfur).",
"The final SF4 product appeared as a colorless liquid (when cold), showing the characteristic bands of SF4 in the IR spectrum.",
"This example illustrates that: 1.)",
"increasing the temperature appears to promote the formation of SF4, and 2.)",
"SF4, free of SF5Cl, can be efficiently synthesized in the reaction: 4KF+S+2Cl2+(Br2)→SF4+4KCl+(Br2) Example 3.Alternate Formation of SF4 in the Absence of Cl2 Anhydrous fine-grain KF (about 24.2 g) was dried in a stainless steel 300-ml Hoke bomb tube reactor at about 150° C. to about 200° C., for about 1 hour, at high vacuum.",
"The reactor was allowed to cool to ambient temperature, opened, and fine-grain S powder (about 3.24 g) was added.",
"Br2, representing a molar ratio of S to Br2 of greater than about two (about 86.4 g), was then added to the reactor vessel by condensation to produce a final molar ratio of S:KF:Br2 of about 1.00:4.10:5.30.After about 3 days at ambient temperature, a strong SF4IR spectral signal was observed and the reaction displayed a high degree of conversion to SF4.After an additional 3 days at ambient temperature, no significant change was noticed in the IR spectrum.",
"The final SF4 product was isolated as follows: The reaction vessel was cooled on a dry ice bath (about −78° C.) and connected via a liquid nitrogen cold trap (about −196° C.) to a vacuum pump.",
"After about 1.5 hours, about 11.5 grams of a light brown, presumably bromine-contaminated crude product was obtained.",
"To remove residual contaminants (e.g.",
"Br2, Sulfur Bromides), the crude product was condensed into a large glass pressure vessel containing about 10 grams of Hg to remove trace amounts of any discoloring contaminants (i.e.",
"e.g.",
"Br2).",
"After brief shaking at about 0° C., the product was condensed into a cold trap and obtained as a colorless liquid.",
"The final mass of the recovered end product was about 10.5 g for a calculated yield of about 96% (based upon sulfur).",
"The IR spectrum of the end product revealed a substantially pure sample of SF4, with a small contamination by SOF2 (e.g.",
"band groups centered at about 1340 cm−1 and about 808 cm−1 and about 750 cm−1).",
"This example illustrates that: SF4 can be efficiently synthesized in the absence of Cl2 within about 3 days at ambient temperatures, in the reaction: 4KF+S+2Br2→SF4+4KBr Example 4.Alternate Formation of SF4 Using Coarse-Grain KF and Agitation by Ball-Milling Anhydrous coarse grain KF (about 28.1 g) was dried in a stainless steel 300-ml Hoke bomb tube reactor containing 19, ½ inch 316 grade stainless steel balls, at about 150° C. to about 200° C., for about 1 hour, at high vacuum.",
"The reactor was allowed to cool to ambient temperature, opened, and fine-grain S powder (about 3.8 g) was added.",
"Bromine, (about 63.1 g), was then added to the reactor vessel to produce a final molar ratio of S:KF:Br2 of about 1.00:4.10:3.30.After rotating the reaction vessel for about 4 days at ambient temperature, a strong SF4 IR spectral signal was observed and the reaction displayed a high degree of conversion to SF4.The final SF4 product was isolated as follows: The reaction vessel was cooled to about −78° C. and connected via a cold trap (about −196° C.) to a vacuum pump.",
"After about 5 hours, about 9.8 grams of a light brown, presumably bromine-contaminated crude product was obtained.",
"A low temperature vacuum transfer was performed, yielding a very light brown liquid.",
"The final mass of the recovered SF4 end product was estimated about 7.3 g for a calculated yield of about 57% (based upon sulfur).",
"The IR spectrum of the end product revealed a substantially pure sample of SF4, with a small contamination by SOF2.This example illustrates that: SF4 can be efficiently synthesized in the absence of Cl2 using coarse-grain KF and ball-milling agitation within about 4 days at ambient temperatures, in the reaction: 4KF+S+2Br2→SF4+4KBr Example 5.Alternate Formation of SF4 at Elevated Temperature Anhydrous fine-grain KF (about 17.1 g) was dried in a stainless steel 300-ml Hoke bomb tube reactor at about 150° C. to about 200° C., for about 1 hour under high vacuum.",
"The reactor was allowed to cool to ambient temperature, opened, and fine-grain S powder (about 2.3 g) was added.",
"Br2 (about 36.3 g), was then added to the reactor vessel to produce a final molar ratio of S:KF:Br2 of about 1.00:4.10:3.20.The reactor vessel was heated to about 60° C. for about 3 hours and the formation SF4 product was monitored by IR spectroscopy.",
"The reaction vessel was cooled to about −78° C. and the SF4 product was pumped into a liquid nitrogen cold trap.",
"The mass of the crude SF4 product indicated about 50% chemical yield.",
"After recondensation of the SF4 product into the reaction vessel, it was heated for another about 2 hours at about 72° C., and another about 4 hours at about 80 to about 86° C. Isolation of the SF4 product was accomplished by cooling the reaction vessel to about −78° C. and pumping under high vacuum for about 1.5 hours into a liquid nitrogen cold trap.",
"Debromination was performed by brief shaking in large Carius tube containing about 20 g. of Hg at about 0° C. About 6.7 grams of purified SF4 was recovered containing a small amount of SOF2, as judged by IR spectroscopy.",
"The final calculated yield was about 86% (based upon sulfur).",
"This example illustrates that SF4 can be efficiently synthesized at mildly elevated temperature, within about 9 hours, in the reaction: 4KF+S+2Br2→SF4+4KBr Example 6.Alternate Formation of SF4 while Limiting Br2 Anhydrous fine grain KF (about 24.12 g) was dried in a stainless steel 300-ml Hoke bomb tube reactor at about 150° C. to about 200° C., for about 1 hour, at high vacuum.",
"The reactor was allowed to cool to ambient temperature, opened, and fine-grain S powder (about 3.16 g) was added.",
"Br2 (about 31.1 g), was then added to the reactor vessel to produce a final molar ratio of S:KF:Br2 of about 1.00:4.21:1.97.The reaction vessel was then cooled with liquid nitrogen and evacuated.",
"The reaction vessel was kept at ambient temperature for about 6 days, and then heated at about 80° C. for about 8 hours.",
"The reaction vessel was cooled to about −78° C. and the volatile material was pumped into a liquid nitrogen cooled cold trap until transfer apparently ceased.",
"The contents of the cold trap were transferred to a second cold trap, leaving a brown residue in the first cold trap.",
"The transferred material was condensed into a large glass pressure vessel containing about 10 grams of Hg to remove trace amounts of.",
"Br2.About 7.31 g of colorless product was again condensed into a liquid nitrogen cooled cold trap.",
"The recovered end product appeared as colorless product of about 7.31 g mass, for a calculated yield of about 70% (based upon Br2).",
"The IR spectrum of the end product revealed a substantially pure sample of SF4.This example illustrates that it is advantageous to use more than the required stoichiometric amount of bromine in the reaction: 4KF+S+2Br2→SF4+4KBr Example 7.Formation of SF5Cl Anhydrous fine grain CsF (about 10.95 g) was dried under high vacuum at about 100° C. in a stainless steel 300-ml Hoke bomb tube reactor, whereupon SF4 (about 9.17 g), Cl2 (about 3.20 g) and bromine (about 36.8 g) were added consecutively by vacuum condensation at liquid-nitrogen temperature (about −196° C.) to produce a molar ratio of SF4:CsF:Cl2:Br2 of about 1.00:0.85:0.53:2.71.The vessel was set aside at ambient temperature for about 5 days, and an IR spectrum of the gaseous constituents showed very strong bands or band groups corresponding to SF5Cl.",
"This example illustrates that SF5Cl can be efficiently synthesized within about 5 days at ambient temperatures using Cl2, Br2, and SF4, in the reaction: CsF+SF4+Cl2+(Br2)→SF5Cl+CsCl+(Br2).",
"Example 8.Alternate Formation of SF5Cl Using a Different Metal Fluoride KF (about 5.0 g) was dried at about 150° C. to about 200° C. in a stainless steel 100-ml Hoke bomb tube reactor, for about 1 hour, at high vacuum.",
"Br2 (about 9.71 g), Cl2 (about 3.54 g) and SF4 (about 4.71 g) were added to the bomb tube reactor by condensation to produce a molar ratio of: SF4:Cl2:KF:Br2 of about 1.00:1.14:1.98:1.39.The reaction appeared almost complete after about 2 days at ambient temperature, as determined from the IR spectrum (i.e.",
"a strong SF5Cl to SF4 IR spectral signals was observed).",
"The reactants were then heated for about 2 days at about 115° C., and an IR spectrum of the gaseous phase showed very little signal corresponding to SF4.This example illustrates that SF5Cl can be efficiently synthesized within about 2 to about 4 days at ambient or mildly elevated temperatures using Cl2, Br2, and SF4, in the reaction: KF+SF4+Cl2+(Br2)→SF5Cl+KCl+(Br2).",
"Example 9.Alternate Formation of SF5Cl Using S Instead of SF4 KF (about 15.60 g) was added to a stainless steel 300-ml Hoke bomb tube reactor and dried at about 150° C. to about 200° C., for about 1 hour, at high vacuum.",
"The bomb reactor was opened and fine-grain S powder (about 1.50 g) was added.",
"After resealing the reactor, Cl2 (about 9.03 g) and Br2 (about 8.59 g) were added by condensation to produce a molar ratio of: S:Cl2:KF:Br2 of about 1.00:2.71:5.71:1.15.The pressure reactor was kept at ambient temperature overnight and both SF5Cl and SF4 were detected from the IR spectrum.",
"No change in the IR spectrum was noticed after about three days.",
"More Cl2 was added (about 1.20 g), bringing the molar ratio to: S:Cl2:KF:Br2 of about 1.00:3.26:5.72:1.15.The reaction was occasionally monitored by IR spectroscopy.",
"After about two more weeks at ambient temperature, the reaction was substantially complete as judged by IR spectrometry.",
"This example illustrates that 1.)",
"compared to other SF4-producing reactions, increasing the molar ratios of Cl2 and KF promotes the production of SF5Cl over SF4 in this reaction, and 2.)",
"SF5Cl can be efficiently synthesized, at ambient temperatures within weeks, in the reaction: 5KF+S+3Cl2+(Br2)→SF5Cl+5KCl.",
"Example 10.Formation of SF5Cl KF (about 10.55 g) was dried under high vacuum in a stainless steel 100-ml Hoke bomb tube reactor and dried for about 1 hour at about 150° C. to about 200° C. The reactor was opened and fine-grain S powder (about 1.13 g) was added.",
"After resealing the reactor, Cl2 (about 8.15 g) and Br2 (about 7.99 g) were added by condensation to produce a stoichiometric ratio of S:Cl2:KF:Br2 of about 1.00:3.25:5.15:1.41 (reaction “A”).",
"A second, similar reaction was prepared utilizing about 1.58 g of fine-grain S powder and the same molar ratios of the other constituents (reaction “B”).",
"The reaction “A” and “B” vessels were placed at ambient temperature for about 3 days and the successful production of SF4 and SF5Cl was noted by IR spectroscopy.",
"Thereafter, SF4 and SF5Cl were monitored every 2 to about 3 days by IR spectroscopy, and by about day 13, it was evident that the reaction was not at completion, and that the production of SF4 and SF5Cl had slowed significantly.",
"The volatile components of both reaction vessels were then condensed and combined into a third vessel containing about 7.94 grams of KF.",
"After about 4 more days at ambient temperature, IR spectroscopy revealed that all the remaining SF4 appeared to have been consumed, leaving SF5Cl as the apparent sole product.",
"The final product was isolated in the following manner: 1.)",
"The reaction vessel was cooled to about −78° C. and connected via a cold trap (about −196° ° C.) to a vacuum pump.",
"After about 6 hours, about 15.5 grams of a light yellowish crude product was obtained.",
"To remove residual contaminants (e.g.",
"Cl2, Br2, Sulfur Chlorides), the crude product was kept overnight in a pressure reactor, over about 3 grams of S. The product was pumped out of this vessel, cooled to about −78° C. and connected via a cold trap (about −196° C.) to a pump and then condensed into a large cold trap containing a small amount of mercury to remove trace amounts of any discoloring contaminants (e.g.",
"Br2, Sulfur Chlorides).",
"The product was obtained as a colorless liquid.",
"The final mass of the recovered end product was about 13.10 g for a calculated yield of about 95% (based upon Sulfur).",
"The IR spectrum of the end product revealed a pure sample of SF5Cl.",
"This example illustrates that 1.)",
"Additional KF may be required to recharge the SF5Cl-producing reaction and drive it to completion or near completion.",
"2.)",
"The production of SF5Cl may be slowed by a reduction of reaction-accessible KF, perhaps due to the buildup of unreactive KCl on the exposed surfaces of the KF; which may be rectified by the addition of fresh KF, agitation of the reaction vessel, or other methods that may increase reactive surface area of the KF over the reaction time.",
"3.)",
"From the reaction: 5KF+S+3Cl2+(Br2)→SF5Cl+5KCl+(Br2) it is possible to reach complete, or substantially complete SF5Cl production within about 2 to about 3 weeks at ambient temperature, yielding substantially pure SF5Cl.",
"Example 11.Formation of SF5Cl KF (about 10.58 g) was dried under high vacuum for about 1 hour at about 150° C. to about 200° C., in a stainless steel 300-ml Hoke bomb tube pressure reactor.",
"The reactor was opened and S (about 1.1 g) was added.",
"After resealing the reactor, Cl2 (about 9.0 g) was added by condensation to produce a stoichiometric ratio of S:Cl2:KF of about 1.00:3.70:5.30.The reaction vessel was set aside at ambient temperature and no production of either SF4 or SF5Cl was detected by IR spectroscopy after about 30 days.",
"Br2 (about 7.54 g) was then added by condensation to produce a new stoichiometric ratio of S:Cl2:KF:Br2 of about 1.00:3.70:5.30:1.37.After about 3 days at ambient temperature, production of both SF4 and SF5Cl was noted by IR spectroscopy.",
"This example illustrates that 1.)",
"Although all the chemical elements required for production of SF4 and SF5Cl were present in the reaction vessel for a duration of about 30 days, no production of SF4 or SF5Cl was noted in the absence of Br2 at ambient temperature.",
"2.)",
"After the necessary components (S, Cl2, KF) of the reaction remained unreactive for 30 days, the subsequent addition of Br2, within days, promoted the efficient formation of SF4 and SF5Cl at ambient temperatures.",
"3.)",
"Br2 appears to be required for the efficient ambient temperature production of SF4 and SF5Cl from the reactants KF, S and Cl2.Example 12.Formation of SF5Br AgF (about 11.02 g) was dried under high vacuum at about 150 to about 200° C. Br2 (about 35.5 g) and SF4 (about 7.3 g) were added to a 300-ml Hoke bomb tube pressure reactor by condensation to produce a molar ratio of: SF4:AgF:Br2 of about 1.00:1.28:3.30.The reaction vessel was then placed into an about 100° C. boiling water bath and subsequently monitored by IR spectroscopy at about 2, about 6.5, about 15 and about 79 hours.",
"The IR spectra indicated a progressive accumulation of SF5Br (e.g.",
"band groups centered at about 891 cm−1 and about 854 cm−1 and about 594 cm−1), and a reduction in SF4, as exemplified by observing an increasing ratio of SF5Br to SF4 IR spectral signals over time.",
"The final product was isolated in the following manner: The reaction vessel was cooled to about −78° C. and connected via a cold trap (about −196° C.) to a vacuum pump.",
"After about 3 hours, about 9.3 grams of a light yellowish crude product was obtained in the cold trap.",
"The product was vacuum transferred from the cold trap to a Carius tube containing a small amount of mercury to remove trace amounts of any discoloring contaminants (e.g.",
"Br2).",
"The product was obtained as a pale straw-yellow liquid.",
"The final mass of the recovered end product was about 8.55 g for a calculated yield of about 75.4% (based upon SF4).",
"The IR spectrum of the end product revealed a substantially pure sample of SF5Br.",
"This example illustrates that: 1.)",
"SF5Br can be efficiently synthesized within about 79 hours at 100° C. in the reaction: AgF+SF4+Br2→SF5Br+AgBr Example 13.Formation of SF5Br Using an Alternate Metal Fluoride AgF2 (about 2.33 g) was dried under high vacuum at about 150 to about 200° C. in a 100-ml Hoke bomb tube pressure reactor.",
"Br2 (about 12.95 g) and SF4 (about 3.14 g) were added to the reactor by condensation to produce a molar ratio of: SF4: AgF2: Br2 of about 1.00:0.55:2.78.The reaction vessel was then placed at 100° C. and subsequently monitored by IR spectroscopy at about 52 hours.",
"The IR spectrum indicated very strong bands or band groups indicative of SF5Br, very weak bands or band groups corresponding to SF4 and SOF2 and medium-strength bands or band groups corresponding to SF6 (e.g.",
"medium-strength band centered at about 947 cm−1).",
"This example illustrates that: 1.)",
"SF5Br can be efficiently synthesized within about 52 hours at about 100° C. in the reaction: 2AgF2+4SF4+3Br2→4SF5Br+2AgBr Example 14.Formation of SF6 CoF3 (about 4.2 g) was dried under high vacuum at about 150 to about 200° C. in a 100-ml Hoke bomb tube pressure reactor.",
"Br2 (about 22.0 g) and SF4 (about 4.63 g) were added to the pressure reactor by condensation to produce a molar ratio of: SF4: CoF3: Br2 of about 1.00:0.84:3.21.The reaction vessel was then placed at about 100° C. and subsequently monitored by IR spectroscopy at about 52 hours.",
"The IR spectrum indicated strong bands or band groups indicative of SF6 moderate-strength bands or band groups corresponding to SF4 and weak bands or band groups corresponding to SOF2.No indication of SF5Br was evident form the IR spectrum.",
"This example indicates that: 1.)",
"SF6 can be efficiently synthesized within about 52 hours at about 100° C. in the reaction: 2CoF3+SF4+(Br2)→SF6+2CoF2+(Br2) Example 15.Comparative Example To determine if an alternate MF could efficiently replace KF as a reactant in the production of SF4, anhydrous fine-grain NaF (about 16.94 g) was dried in a stainless steel Hoke bomb tube pressure reactor at about 150° C. to about 200° C., for about 1 hour, at high vacuum.",
"The reactor was allowed to slowly cool to ambient temperature, opened, and sulfur (about 2.17 g) was added.",
"Br2 (about 29.5 g), was then added to the reactor vessel to produce a final molar ratio of S:NaF:Br2 of about 1.00:5.90:2.70.After about 2 days at ambient temperature, no SF4 was evident as measured by IR spectroscopy of the gaseous constituents removed from the reaction vessel.",
"The reaction vessel was then heated to about 80° C. for about 18 hours, IR spectroscopy of the gaseous constituents again revealed that no reaction products (SF4, SOF2) were present.",
"The reaction vessel was subsequently heated to about 155° C. for about 18 hours, IR spectroscopy of the gaseous constituents revealed very low levels SOF2 and no SF4, suggesting the formation of only traces of SF4, which were apparently hydrolyzed by the minuscule amount of water introduced into the reaction vessel.",
"Example 16.Comparative Example To determine if an alternate MF could efficiently replace KF as reactant in the production of SF5Cl from SF4, a 100-ml stainless steel Hoke bomb tube reactor was charged with NaF (about 10.19 g), and after drying under high vacuum as described above, the reactor was then charged with chlorine (about 4.77 g), bromine (about 11.57 g) and SF4 (about 14.61 g), consecutively, by vacuum condensation.",
"The molar ratio of SF4:NaF:Cl2:Br2 equaled about 1.00:1.79:1.10:1.50.The reaction was allowed to occur without agitation at ambient temperature for about 11 days, after which time no reaction was apparent from the IR spectrum.",
"Heating of the reaction vessel for an additional about 9 days at about 115 to about 125° C. did not result in the formation of SF5Cl, as indicated by IR spectroscopy.",
"Example 17.Comparative Example CuF2 (about 4.59 g) was dried for about 1 hour under high vacuum at about 150 to about 200° C. Br2 (about 18.9 g) and SF4 (about 3.21 g) were added to the pressure reactor by condensation to produce a molar ratio of: SF4: CuF2: Br2 of about 1.00:1.54:3.72.The reaction vessel was then placed at about 100° C. and subsequently monitored by IR spectroscopy at about 52 hours.",
"The IR spectrum indicated that no reaction had occurred.",
"Example 18.Comparative Example TlF (about 4.23 g) was dried under high vacuum at about 150 to about 200° C., for about 1 hour.",
"Br2 (about 7.6 g) and SF4 (about 1.38 g) were added to the pressure reactor by condensation to produce a molar ratio of: SF4:TlF:Br2 of about 1.00:1.49:3.86.The reaction vessel was then placed at 100° C. and subsequently monitored by IR spectroscopy at about 52 hours.",
"The IR spectrum indicated that no reaction had occurred.",
"Unless otherwise indicated, all numbers expressing quantities of ingredients, properties such as molecular weight, reaction conditions, and so forth used in the specification and claims are to be understood as being modified in all instances by the term “about.” Accordingly, unless indicated to the contrary, the numerical parameters set forth in the specification and attached claims are approximations that may vary depending upon the desired properties sought to be obtained by the present invention.",
"At the very least, and not as an attempt to limit the application of the doctrine of equivalents to the scope of the claims, each numerical parameter should at least be construed in light of the number of reported significant digits and by applying ordinary rounding techniques.",
"Notwithstanding that the numerical ranges and parameters setting forth the broad scope of the invention are approximations, the numerical values set forth in the specific examples are reported as precisely as possible.",
"Any numerical value, however, inherently contains certain errors necessarily resulting from the standard deviation found in their respective testing measurements.",
"The terms “a,” “an,” “the” and similar referents used in the context of describing the invention (especially in the context of the following claims) are to be construed to cover both the singular and the plural, unless otherwise indicated herein or clearly contradicted by context.",
"Recitation of ranges of values herein is merely intended to serve as a shorthand method of referring individually to each separate value falling within the range.",
"Unless otherwise indicated herein, each individual value is incorporated into the specification as if it were individually recited herein.",
"All methods described herein can be performed in any suitable order unless otherwise indicated herein or otherwise clearly contradicted by context.",
"The use of any and all examples, or exemplary language (e.g., “such as”) provided herein is intended merely to better illuminate the invention and does not pose a limitation on the scope of the invention otherwise claimed.",
"No language in the specification should be construed as indicating any non-claimed element essential to the practice of the invention.",
"Groupings of alternative elements or embodiments of the invention disclosed herein are not to be construed as limitations.",
"Each group member may be referred to and claimed individually or in any combination with other members of the group or other elements found herein.",
"It is anticipated that one or more members of a group may be included in, or deleted from, a group for reasons of convenience and/or patentability.",
"When any such inclusion or deletion occurs, the specification is deemed to contain the group as modified thus fulfilling the written description of all Markush groups used in the appended claims.",
"Certain embodiments of this invention are described herein, including the best mode known to the inventors for carrying out the invention.",
"Of course, variations on these described embodiments will become apparent to those of ordinary skill in the art upon reading the foregoing description.",
"The inventor expects skilled artisans to employ such variations as appropriate, and the inventors intend for the invention to be practiced otherwise than specifically described herein.",
"Accordingly, this invention includes all modifications and equivalents of the subject matter recited in the claims appended hereto as permitted by applicable law.",
"Moreover, any combination of the above-described elements in all possible variations thereof is encompassed by the invention unless otherwise indicated herein or otherwise clearly contradicted by context.",
"Furthermore, numerous references have been made to patents and printed publications throughout this specification.",
"Each of the above-cited references and printed publications are individually incorporated herein by reference in their entirety.",
"In closing, it is to be understood that the embodiments of the invention disclosed herein are illustrative of the principles of the present invention.",
"Other modifications that may be employed are within the scope of the invention.",
"Thus, by way of example, but not of limitation, alternative configurations of the present invention may be utilized in accordance with the teachings herein.",
"Accordingly, the present invention is not limited to that precisely as shown and described."
]
] |
Patent_15871389
|
[
[
"Item and Luggage Loss Prevention System",
"Novel tools and techniques are provided for implementing item or luggage loss prevention, which, in some cases, is based on weight measurement.",
"In some embodiments, a device with a processor can be placed under a bag's handle, within an interior compartment of the bag, below or in the feet or wheels of the bag, and/or the like.",
"The device can allow a user to lock in a weight of the bag.",
"If any item is subsequently removed from (and not returned to) the bag, the device will notify the user, using one or more of audio notification, visual notification, and/or mobile device notification (e.g., via e-mail, text message, SMS, MMS, chat message, and/or the like) that the weight of the bag has changed.",
"In some cases, location detection devices may be implemented to allow the user to backtrack where the missing item might have been left behind."
],
[
"1.A method, comprising: receiving, with a device, a first user input from a user to lock-in a first weight supported by a car seat, wherein the first weight corresponds to an occupant in the car seat; measuring, with the device, the first weight of the occupant in the car seat, in response to receiving the first user input; storing, with the device and in a local data storage device, the measured first weight; measuring, with the device, a second weight of supported by the car seat; determining, with the device, whether the second weight matches the stored first weight; based on a determination that the second weight does not match the first weight, notifying, with the device, the user.",
"2.The method of claim 1 further comprising attaching the device to the car seat.",
"3.The method of claim 2 further comprising attaching the device to one or more handles of the car seat.",
"4.The method of claim 1, further comprising placing the device at a bottom portion of the car seat.",
"5.The method of claim 4, wherein the bottom portion includes one of under a bottom shell portion, within or on a bottom inner cushion, or between the bottom shell portion and the bottom inner cushion.",
"6.The method of claim 1, further comprising placing the device below one or more feet of the car seat.",
"7.The method of claim 1, further comprising affixing the device between the car seat and each of one or more wheel casters coupled to the car seat.",
"8.The method of claim 1, wherein measuring each of the first weight and the second weight comprises measuring using a weight measurement device comprising a load cell selected from a group consisting of a strain gauge load cell, a piezoelectric load cell, a capacitive load cell, a compression load cell, a compression/tension load cell, an S-beam load cell, a bending beam load cell, a platform load cell, a single point load cell, a canister load cell, and a low profile load cell.",
"9.The method of claim 8, further comprising: determining that the car seat is being moved by determining, with the device, that the load cell of the weight measurement device is being actuated.",
"10.The method of claim 1, wherein measuring each of the first weight and the second weight comprises measuring using a weight measurement device comprising a contact surface and a contact sensor, wherein the weight measurement device has a structure that causes the contact surface to be brought into contact with the contact sensor when a first portion of the weight measurement device is lifted with respect to a second portion of the weight measurement device, which is coupled to the car seat.",
"11.The method of claim 10, wherein the contact sensor comprises at least one of a flex sensor, a piezoelectric-based sensor, a compression-based sensor, or a spring-based sensor.",
"12.The method of claim 1, further comprising: determining, with a location detection device of the device, a first location of the car seat when measuring the first weight of the car seat; storing, with the device, the first location in the local data storage device; determining that the car seat is being moved by determining, with the location detection device, that a present location of the device is different from the first location of the device; and based on the determination by the location detection device that the car seat is being moved, measuring, with the device, the second weight.",
"13.The method of claim 12, further comprising: determining, responsive to the determination that the car seat is being moved, that the car seat is empty.",
"14.The method of claim 12, further comprising: determining, responsive to the determination that the car seat is being moved, that the occupant is still in the car seat.",
"15.The method of claim 12, further comprising determining that the car seat is being moved by determining, with the location detection device, that a present location of the device is different from the first location of the device.",
"16.The method of claim 1, further comprising, receiving second user input, wherein measuring a second weight of the car seat comprises measuring a second weight of the car seat in response to the second user input.",
"17.An apparatus, comprising: at least one processor; a weight measurement device; a user interface device; a computer readable storage medium in communication with the at least one processor, the computer readable storage medium having stored thereon computer software, the computer software comprising a set of instructions executable by the at least one processor to: receive, with the weight measurement device, a first user input from a user to lock-in a first weight supported by a car seat, wherein the first weight corresponds to an occupant in the car seat; measure, with the weight measurement device, the first weight of the occupant in the car seat, in response to receiving the first user input; store, with the weight measurement device and in a local data storage device, the measured first weight; measure, with the weight measurement device, a second weight of supported by the car seat; determine, with the weight measurement device, whether the second weight matches the stored first weight; based on a determination that the second weight does not match the first weight, notify, with the device, the user.",
"18.The apparatus of claim 17, wherein the set of instructions are further executable to: determine that the car seat is being moved by determining, with the weight measuring device, that the load cell of the weight measurement device is being actuated.",
"19.The apparatus of claim 17, further comprising a location detection device, wherein the set of instructions are further executable to: determine, with a location detection device of the device, a first location of the car seat when measuring the first weight of the car seat; store, with the device, the first location in the local data storage device; determine that the car seat is being moved by determining, with the location detection device, that a present location of the device is different from the first location of the device; and based on the determination by the location detection device that the car seat is being moved, determining whether the occupant is in the car seat.",
"20.A system comprising: a car seat comprising a bottom portion and seat back; a car seat monitoring device coupled to car seat, the car seat monitoring device comprising: a processor; a computer readable storage medium in communication with the processor, the computer readable storage medium having stored thereon computer software, the computer software comprising a set of instructions executable by the processor to: receive, with the weight measurement device, a first user input from a user to lock-in a first weight supported by a car seat, wherein the first weight corresponds to an occupant in the car seat; measure, with the weight measurement device, the first weight of the occupant in the car seat, in response to receiving the first user input; store, with the weight measurement device and in a local data storage device, the measured first weight; measure, with the weight measurement device, a second weight of supported by the car seat; determine, with the weight measurement device, whether the second weight matches the stored first weight; based on a determination that the second weight does not match the first weight, notify, with the device, the user."
],
[
"<SOH> BACKGROUND <EOH>Airports around the world have an epidemic.",
"People are losing valuable items every time they go through the security checkpoint(s) at airports.",
"This is because one of the requirements of airport security is that travelers must remove their laptops from their bags.",
"Another requirement is that travelers remove phones and other metallic objects from their persons before passing through the scanners.",
"As a consequence, there is a natural tendency for travelers to walk away without collecting their items (including, without limitation, laptops, smart phones, tablet computers, cellular phones, media players, and/or the like).",
"Approximately 1.7 million people travel through U.S. airports each day.",
"Items are lost everywhere in the airports, including, but not limited to, on planes, in terminal gates, in lounges, and/or the like.",
"It is estimated that over 16,000 laptops are left at U.S. airports each year.",
"The laptop loss alone is estimated to be around $700 million.",
"Travelers' items left in airports also put a significant strain on the already over-worked security personnel such as Transportation Security Administration (“TSA”) personnel in the U.S.",
"It requires that such personnel retain and manage custody of such lost items.",
"Currently, such lost items are collected by TSA agents and held for 30 days.",
"After the 30-day period expires, the hard drives and/or memory are removed and the items are put on auction.",
"All the information in the computing devices is subsequently destroyed.",
"This process requires man-hours for collecting the lost items, tracking how long the lost items have been held, removing data storage drives, destroying information stored in the devices, and auctioning the items.",
"Third party non-governmental Lost and Found web sites have been established in an effort to help people recover their lost items.",
"It is unclear, however, how successful these sites are.",
"But, for such sites to be useful, the travelers would have to know about a particular site in order to be able to post that they have lost something at a particular airport.",
"It would also require that the person who has possession of the lost item(s) know about the site so that they can contact the person that lost such item(s).",
"In general, such web sites only serve to work on the recovery of lost items, but cannot help to prevent loss of the items in the first place.",
"In terms of the use of weight measurement of luggage, existing travel scales provide weighing functionality, but such devices are incapable of alerting a traveler of a change in weight (such as when an item has not been put back in the luggage, or the like).",
"Hence, there is a need for more robust and scalable solutions for preventing item and luggage loss."
],
[
"<SOH> BRIEF SUMMARY <EOH>Various embodiments provide techniques for implementing item or luggage loss prevention, which, in some cases, is based on weight measurements.",
"According to some embodiments, a device containing a processor might be configured to be placed under a bag's handle.",
"The device might contain a small display (including, without limitation, a liquid crystal display (“LCD”), a light emitting diode (“LED”) display, an organic LED (“oLED”) display, and/or the like) and a processor.",
"The device might allow the user to lock in a weight of a bag.",
"If any item is then removed from (and not returned to) the bag, the device might notify the user (e.g., using audio notification (e.g., recorded voice notification, beeps, and/or the like), visual notification (e.g., blinking lights, flashing icons, written messages, and/or the like), and/or mobile device notification (e.g., e-mail notification, text message notification, small message service (“SMS”) notification, multi-media messaging service (“MMS”) notification, chat message notification, and/or the like) that the weight of the bag has changed (from the locked-in weight).",
"In some embodiments, the device might comprise an LCD display for the weight and notification, an on or off button, and one or more button(s) to store/lock-in a weight (or to change the lock-in weight) and to release or delete any locked-in or stored weights.",
"The tools provided by various embodiments include, without limitation, methods, systems, and/or software products.",
"Merely by way of example, a method might comprise one or more procedures, any or all of which might be executed by a computer system.",
"Correspondingly, an embodiment might provide a computer system configured with instructions to perform one or more procedures in accordance with methods provided by various other embodiments.",
"Similarly, a computer program might comprise a set of instructions that are executable by a computer system, or by a processor located in the computer system, to perform such operations.",
"In many cases, such software programs are encoded on physical, tangible, and/or non-transitory computer readable media.",
"Such computer readable media might include, to name but a few examples, optical media, magnetic media, and the like.",
"In an aspect, a method might comprise receiving, with a device, a first user input from a user to lock-in a first weight of a bag, measuring, with the device, the first weight of the bag, in response to receiving the first user input, and storing, with the device and in a local data storage device, the measured first weight of the bag, prior to the user removing one or more items from the bag.",
"The method might further comprise measuring, with the device, a second weight of the bag, for example, in response to second user input, in response to determining that the bag is being moved, etc.",
"The method, then, might include determining, with the device, whether the second weight of the bag matches the stored first weight of the bag.",
"The method might also comprise, based on a determination that the second weight does not match the first weight, notifying, with the device, the user.",
"According to some embodiments, measuring each of the first weight and the second weight might comprise measuring using a weight measurement device comprising a contact surface and a contact sensor.",
"The weight measurement device might have a structure that causes the contact surface to be brought into contact with the contact sensor when a first portion of the weight measurement device is lifted with respect to a second portion of the weight measurement device, which is coupled to the bag.",
"In some cases, the contact sensor might comprise at least one of a flex sensor, a piezoelectric-based sensor, a compression-based sensor, and/or a spring-based sensor.",
"In some embodiments, the device might be attached to the bag.",
"The bag, according to some embodiments, might comprise one or more of a purse, a handbag, a tote, a briefcase, a satchel, laptop bag, travel bag, or carry-on luggage.",
"In some cases, the device might be attached to one or more handles of the bag.",
"The device, in some instances, might be placed in an interior compartment of the bag.",
"In some embodiments, the device might be placed at a bottom portion of the interior compartment of the bag (ideally, below the one or more items when the one or more items are placed in the bag).",
"According to some embodiments, the device might be placed below one or more feet of the bag.",
"In some cases, the device might be affixed to a position between the bag and each of one or more wheel casters of the bag.",
"In alternative cases, the device might be positioned within one or more wheel casters of the bag.",
"In some aspects, measuring each of the first weight and the second weight might comprise measuring using a weight measurement device comprising a load cell selected from a group consisting of a strain gauge load cell, a piezoelectric load cell, a capacitive load cell, a compression load cell, a compression/tension load cell, an S-beam load cell, a bending beam load cell, a platform load cell, a single point load cell, a canister load cell, and a low profile load cell.",
"Determining that the bag is being moved might, in some embodiments, comprise determining, with the device, that the load cell of the weight measurement device is being actuated (which might indicate that the bag is being lifted).",
"In some cases, determining that the second weight does not match the first weight might comprise determining that the second weight is less than the first weight.",
"In some instances, determining that the second weight does not match the first weight might comprise determining that the second weight is greater than the first weight.",
"In either case, notifying the user might comprise reminding the user to check that the one or more items that were removed from the bag have been returned to the bag.",
"According to some embodiments, the method might further comprise determining, with a location detection device of the device, a first location of the device when measuring the first weight of the bag, and storing, with the device, the first location in the local data storage device.",
"Notifying the user might comprise sending a message containing the first location.",
"In some embodiments, the method might also comprise determining, with the location detection device of the device, a second location of the device when measuring the second weight of the bag, and storing, with the device, the second location in the local data storage device.",
"Notifying the user might comprise sending a message containing each location where a weight of the bag was measured (this might allow the user to retrace where a lost item might be located, i.e., by retracing where the item might have been removed from the bag).",
"In embodiments in which the device comprises a location detection device, determining that the bag is being moved might comprise determining, with the location detection device, that a present location of the device is different from the first location of the device.",
"In some embodiments, the method might further comprise determining, with the device, which of one or more items is missing from the bag based on a difference between the first weight and the second weight.",
"This might include pre-storing a plurality of weights of the bag, with and without each of the one or more items.",
"Notifying the user might further comprise indicating which of the one or more items might be missing based on the determination.",
"Merely by way of example, in some cases, notifying the user might comprise one or more of playing a recorded voice notification, emitting one or more audio tones, displaying one or more light sequences, displaying one or more icons, displaying a written message, sending an e-mail notification, sending a text message notification, sending a small message service (“SMS”) notification, sending a multi-media messaging service (“MMS”) notification, or sending a chat message notification.",
"In another aspect, an apparatus might comprise at least one processor, a weight measurement device, a user interface device, and a computer readable storage medium in communication with the at least one processor.",
"The computer readable storage medium might have stored thereon computer software.",
"The computer software might comprise a set of instructions that, when executed by the at least one processor, causes the apparatus to perform one or more operations.",
"The set of instructions might comprise instructions to receive a first user input from a user to lock-in a first weight of a bag, instructions to measure the first weight of the bag, in response to receiving the first user input, and instructions to store the measured first weight of the bag in the computer readable storage medium, prior to the user removing one or more items from the bag.",
"The set of instructions might further comprise instructions to determine that the bag is being moved, instructions to measure a second weight of the bag, and instructions to determine whether the second weight of the bag matches the stored first weight of the bag.",
"The set of instructions might also comprise instructions to, based on a determination that the second weight does not match the first weight, notify the user.",
"According to some embodiments, the apparatus might further comprise a location detection device (including, without limitation, a global positioning system (“GPS”), position triangulation transceivers, and/or the like).",
"In some cases, the apparatus might further comprise a network interface device (including, but not limited to, Bluetooth™ device, an 802.11 device, a WiFi device, a WiMax device, a WWAN device, cellular communication devices, and/or the like).",
"The user interface device, in some embodiments, might comprise one or more of one or more display devices, one or more audio speakers, one or more touchscreen display devices, one or more buttons, one or more switches, or one or more light emitting devices.",
"In yet another aspect, a method might comprise determining, with a device, that a weight of a bag has changed, and in response to such determination, notifying, with the device, that one or more items may be missing from the bag based on the determined change in weight.",
"Various modifications and additions can be made to the embodiments discussed without departing from the scope of the invention.",
"For example, while the embodiments described above refer to particular features, the scope of this invention also includes embodiments having different combination of features and embodiments that do not include all of the above described features."
],
[
"CROSS-REFERENCE TO RELATED APPLICATIONS This application is a continuation of U.S. patent application Ser.",
"No.",
"14/605,590 (the “'590 application”), filed Jan. 26, 2015 by Faisal Shah et al.",
"(attorney docket no.",
"0837.02) and titled “Item and Luggage Loss Prevention System” which claims priority to U.S. Patent Application Ser.",
"No.",
"61/943,765 (the “'765 application”), filed Feb. 24, 2014 by Faisal Shah (attorney docket no.",
"0562.01PR) and titled “Item and Luggage Loss Prevention System” and U.S. Patent Application Ser.",
"No.",
"62/046,690 (the “'690 application”), filed Sep. 5, 2014 by Faisal Shah et al.",
"(attorney docket no.",
"0562.02PR) and titled “Item and Luggage Loss Prevention System.” The respective disclosures of these applications/patents (which this document refers to collectively as the “Related Applications”) are incorporated herein by reference in their entirety for all purposes.",
"COPYRIGHT STATEMENT A portion of the disclosure of this patent document contains material that is subject to copyright protection.",
"The copyright owner has no objection to the facsimile reproduction by anyone of the patent document or the patent disclosure as it appears in the Patent and Trademark Office patent file or records, but otherwise reserves all copyright rights whatsoever.",
"FIELD The present disclosure relates, in general, to a device, system, and method for preventing loss of items or luggage, and, more particularly, to a device, system, and method for preventing loss of items or luggage based on weight measurements.",
"BACKGROUND Airports around the world have an epidemic.",
"People are losing valuable items every time they go through the security checkpoint(s) at airports.",
"This is because one of the requirements of airport security is that travelers must remove their laptops from their bags.",
"Another requirement is that travelers remove phones and other metallic objects from their persons before passing through the scanners.",
"As a consequence, there is a natural tendency for travelers to walk away without collecting their items (including, without limitation, laptops, smart phones, tablet computers, cellular phones, media players, and/or the like).",
"Approximately 1.7 million people travel through U.S. airports each day.",
"Items are lost everywhere in the airports, including, but not limited to, on planes, in terminal gates, in lounges, and/or the like.",
"It is estimated that over 16,000 laptops are left at U.S. airports each year.",
"The laptop loss alone is estimated to be around $700 million.",
"Travelers' items left in airports also put a significant strain on the already over-worked security personnel such as Transportation Security Administration (“TSA”) personnel in the U.S.",
"It requires that such personnel retain and manage custody of such lost items.",
"Currently, such lost items are collected by TSA agents and held for 30 days.",
"After the 30-day period expires, the hard drives and/or memory are removed and the items are put on auction.",
"All the information in the computing devices is subsequently destroyed.",
"This process requires man-hours for collecting the lost items, tracking how long the lost items have been held, removing data storage drives, destroying information stored in the devices, and auctioning the items.",
"Third party non-governmental Lost and Found web sites have been established in an effort to help people recover their lost items.",
"It is unclear, however, how successful these sites are.",
"But, for such sites to be useful, the travelers would have to know about a particular site in order to be able to post that they have lost something at a particular airport.",
"It would also require that the person who has possession of the lost item(s) know about the site so that they can contact the person that lost such item(s).",
"In general, such web sites only serve to work on the recovery of lost items, but cannot help to prevent loss of the items in the first place.",
"In terms of the use of weight measurement of luggage, existing travel scales provide weighing functionality, but such devices are incapable of alerting a traveler of a change in weight (such as when an item has not been put back in the luggage, or the like).",
"Hence, there is a need for more robust and scalable solutions for preventing item and luggage loss.",
"BRIEF SUMMARY Various embodiments provide techniques for implementing item or luggage loss prevention, which, in some cases, is based on weight measurements.",
"According to some embodiments, a device containing a processor might be configured to be placed under a bag's handle.",
"The device might contain a small display (including, without limitation, a liquid crystal display (“LCD”), a light emitting diode (“LED”) display, an organic LED (“oLED”) display, and/or the like) and a processor.",
"The device might allow the user to lock in a weight of a bag.",
"If any item is then removed from (and not returned to) the bag, the device might notify the user (e.g., using audio notification (e.g., recorded voice notification, beeps, and/or the like), visual notification (e.g., blinking lights, flashing icons, written messages, and/or the like), and/or mobile device notification (e.g., e-mail notification, text message notification, small message service (“SMS”) notification, multi-media messaging service (“MMS”) notification, chat message notification, and/or the like) that the weight of the bag has changed (from the locked-in weight).",
"In some embodiments, the device might comprise an LCD display for the weight and notification, an on or off button, and one or more button(s) to store/lock-in a weight (or to change the lock-in weight) and to release or delete any locked-in or stored weights.",
"The tools provided by various embodiments include, without limitation, methods, systems, and/or software products.",
"Merely by way of example, a method might comprise one or more procedures, any or all of which might be executed by a computer system.",
"Correspondingly, an embodiment might provide a computer system configured with instructions to perform one or more procedures in accordance with methods provided by various other embodiments.",
"Similarly, a computer program might comprise a set of instructions that are executable by a computer system, or by a processor located in the computer system, to perform such operations.",
"In many cases, such software programs are encoded on physical, tangible, and/or non-transitory computer readable media.",
"Such computer readable media might include, to name but a few examples, optical media, magnetic media, and the like.",
"In an aspect, a method might comprise receiving, with a device, a first user input from a user to lock-in a first weight of a bag, measuring, with the device, the first weight of the bag, in response to receiving the first user input, and storing, with the device and in a local data storage device, the measured first weight of the bag, prior to the user removing one or more items from the bag.",
"The method might further comprise measuring, with the device, a second weight of the bag, for example, in response to second user input, in response to determining that the bag is being moved, etc.",
"The method, then, might include determining, with the device, whether the second weight of the bag matches the stored first weight of the bag.",
"The method might also comprise, based on a determination that the second weight does not match the first weight, notifying, with the device, the user.",
"According to some embodiments, measuring each of the first weight and the second weight might comprise measuring using a weight measurement device comprising a contact surface and a contact sensor.",
"The weight measurement device might have a structure that causes the contact surface to be brought into contact with the contact sensor when a first portion of the weight measurement device is lifted with respect to a second portion of the weight measurement device, which is coupled to the bag.",
"In some cases, the contact sensor might comprise at least one of a flex sensor, a piezoelectric-based sensor, a compression-based sensor, and/or a spring-based sensor.",
"In some embodiments, the device might be attached to the bag.",
"The bag, according to some embodiments, might comprise one or more of a purse, a handbag, a tote, a briefcase, a satchel, laptop bag, travel bag, or carry-on luggage.",
"In some cases, the device might be attached to one or more handles of the bag.",
"The device, in some instances, might be placed in an interior compartment of the bag.",
"In some embodiments, the device might be placed at a bottom portion of the interior compartment of the bag (ideally, below the one or more items when the one or more items are placed in the bag).",
"According to some embodiments, the device might be placed below one or more feet of the bag.",
"In some cases, the device might be affixed to a position between the bag and each of one or more wheel casters of the bag.",
"In alternative cases, the device might be positioned within one or more wheel casters of the bag.",
"In some aspects, measuring each of the first weight and the second weight might comprise measuring using a weight measurement device comprising a load cell selected from a group consisting of a strain gauge load cell, a piezoelectric load cell, a capacitive load cell, a compression load cell, a compression/tension load cell, an S-beam load cell, a bending beam load cell, a platform load cell, a single point load cell, a canister load cell, and a low profile load cell.",
"Determining that the bag is being moved might, in some embodiments, comprise determining, with the device, that the load cell of the weight measurement device is being actuated (which might indicate that the bag is being lifted).",
"In some cases, determining that the second weight does not match the first weight might comprise determining that the second weight is less than the first weight.",
"In some instances, determining that the second weight does not match the first weight might comprise determining that the second weight is greater than the first weight.",
"In either case, notifying the user might comprise reminding the user to check that the one or more items that were removed from the bag have been returned to the bag.",
"According to some embodiments, the method might further comprise determining, with a location detection device of the device, a first location of the device when measuring the first weight of the bag, and storing, with the device, the first location in the local data storage device.",
"Notifying the user might comprise sending a message containing the first location.",
"In some embodiments, the method might also comprise determining, with the location detection device of the device, a second location of the device when measuring the second weight of the bag, and storing, with the device, the second location in the local data storage device.",
"Notifying the user might comprise sending a message containing each location where a weight of the bag was measured (this might allow the user to retrace where a lost item might be located, i.e., by retracing where the item might have been removed from the bag).",
"In embodiments in which the device comprises a location detection device, determining that the bag is being moved might comprise determining, with the location detection device, that a present location of the device is different from the first location of the device.",
"In some embodiments, the method might further comprise determining, with the device, which of one or more items is missing from the bag based on a difference between the first weight and the second weight.",
"This might include pre-storing a plurality of weights of the bag, with and without each of the one or more items.",
"Notifying the user might further comprise indicating which of the one or more items might be missing based on the determination.",
"Merely by way of example, in some cases, notifying the user might comprise one or more of playing a recorded voice notification, emitting one or more audio tones, displaying one or more light sequences, displaying one or more icons, displaying a written message, sending an e-mail notification, sending a text message notification, sending a small message service (“SMS”) notification, sending a multi-media messaging service (“MMS”) notification, or sending a chat message notification.",
"In another aspect, an apparatus might comprise at least one processor, a weight measurement device, a user interface device, and a computer readable storage medium in communication with the at least one processor.",
"The computer readable storage medium might have stored thereon computer software.",
"The computer software might comprise a set of instructions that, when executed by the at least one processor, causes the apparatus to perform one or more operations.",
"The set of instructions might comprise instructions to receive a first user input from a user to lock-in a first weight of a bag, instructions to measure the first weight of the bag, in response to receiving the first user input, and instructions to store the measured first weight of the bag in the computer readable storage medium, prior to the user removing one or more items from the bag.",
"The set of instructions might further comprise instructions to determine that the bag is being moved, instructions to measure a second weight of the bag, and instructions to determine whether the second weight of the bag matches the stored first weight of the bag.",
"The set of instructions might also comprise instructions to, based on a determination that the second weight does not match the first weight, notify the user.",
"According to some embodiments, the apparatus might further comprise a location detection device (including, without limitation, a global positioning system (“GPS”), position triangulation transceivers, and/or the like).",
"In some cases, the apparatus might further comprise a network interface device (including, but not limited to, Bluetooth™ device, an 802.11 device, a WiFi device, a WiMax device, a WWAN device, cellular communication devices, and/or the like).",
"The user interface device, in some embodiments, might comprise one or more of one or more display devices, one or more audio speakers, one or more touchscreen display devices, one or more buttons, one or more switches, or one or more light emitting devices.",
"In yet another aspect, a method might comprise determining, with a device, that a weight of a bag has changed, and in response to such determination, notifying, with the device, that one or more items may be missing from the bag based on the determined change in weight.",
"Various modifications and additions can be made to the embodiments discussed without departing from the scope of the invention.",
"For example, while the embodiments described above refer to particular features, the scope of this invention also includes embodiments having different combination of features and embodiments that do not include all of the above described features.",
"BRIEF DESCRIPTION OF THE DRAWINGS A further understanding of the nature and advantages of particular embodiments may be realized by reference to the remaining portions of the specification and the drawings, in which like reference numerals are used to refer to similar components.",
"In some instances, a sub-label is associated with a reference numeral to denote one of multiple similar components.",
"When reference is made to a reference numeral without specification to an existing sub-label, it is intended to refer to all such multiple similar components.",
"FIG.",
"1 is a general schematic diagram illustrating a system for implementing item or luggage loss prevention, in accordance with various embodiments.",
"FIGS.",
"2A and 2B are general block diagrams illustrating various apparatuses for implementing item or luggage loss prevention, in accordance with various embodiments.",
"FIGS.",
"3A-3F are general schematic diagrams illustrating various placement and configurations for an apparatus for implementing item or luggage loss prevention, in accordance with various embodiments.",
"FIGS.",
"4A-4F are general schematic diagrams illustrating various views and configurations of an apparatus for implementing item or luggage loss prevention, in accordance with various embodiments.",
"FIG.",
"5 is a general schematic flow diagram illustrating a method for implementing item or luggage loss prevention, in accordance with various embodiments.",
"FIG.",
"6 is a block diagram illustrating an exemplary computer architecture, in accordance with various embodiments.",
"FIG.",
"7 is a block diagram illustrating a networked system of computers, which can be used in accordance with various embodiments.",
"DETAILED DESCRIPTION OF CERTAIN EMBODIMENTS While various aspects and features of certain embodiments have been summarized above, the following detailed description illustrates a few exemplary embodiments in further detail to enable one of skill in the art to practice such embodiments.",
"The described examples are provided for illustrative purposes and are not intended to limit the scope of the invention.",
"In the following description, for the purposes of explanation, numerous specific details are set forth in order to provide a thorough understanding of the described embodiments.",
"It will be apparent to one skilled in the art, however, that other embodiments of the present invention may be practiced without some of these specific details.",
"In other instances, certain structures and devices are shown in block diagram form.",
"Several embodiments are described herein, and while various features are ascribed to different embodiments, it should be appreciated that the features described with respect to one embodiment may be incorporated with other embodiments as well.",
"By the same token, however, no single feature or features of any described embodiment should be considered essential to every embodiment of the invention, as other embodiments of the invention may omit such features.",
"Unless otherwise indicated, all numbers used herein to express quantities, dimensions, and so forth used should be understood as being modified in all instances by the term “about.” In this application, the use of the singular includes the plural unless specifically stated otherwise, and use of the terms “and” and “or” means “and/or” unless otherwise indicated.",
"Moreover, the use of the term “including,” as well as other forms, such as “includes” and “included,” should be considered non-exclusive.",
"Also, terms such as “element” or “component” encompass both elements and components comprising one unit and elements and components that comprise more than one unit, unless specifically stated otherwise.",
"Various embodiments provide techniques for implementing item or luggage loss prevention, which, in some cases, is based on weight measurements.",
"According to some embodiments, a device containing a processor might be configured to be placed under a bag's handle.",
"The device might contain a small display (including, without limitation, a liquid crystal display (“LCD”), a light emitting diode (“LED”) display, an organic LED (“oLED”) display, and/or the like) and a processor.",
"The device might allow the user to lock in a weight of a bag.",
"If any item is then removed from (and not returned to) the bag, the device might notify the user (e.g., using audio notification (e.g., recorded voice notification, audio tones, beeps, and/or the like), visual notification (e.g., blinking lights, flashing icons, written messages, and/or the like), and/or mobile device notification (e.g., e-mail notification, text message notification, small message service (“SMS”) notification, multi-media messaging service (“MMS”) notification, chat message notification, and/or the like) that the weight of the bag has changed (from the locked-in weight).",
"In some embodiments, the device might comprise an LCD display for the weight and notification, an on or off button, and one or more button(s) to store/lock-in a weight (or to change the lock-in weight) and to release or delete any locked-in or stored weights.",
"In operation, prior to purposefully removing an item(s) (including, without limitation, a laptop computer, a smart phone, a mobile phone, a portable gaming device, a portable media player, a tablet computer, an e-book reader, and/or the like) from a bag (including, but not limited to, a purse, a handbag, a tote, a briefcase, a satchel, laptop bag, travel bag, carry-on luggage, and/or the like), the user can lock-in a weight of the bag using the device described above.",
"This is applicable, for example, during security check-in at an airport terminal, during a meal in a restaurant, during a meeting, during a typical workday at the office, during school hours, and/or the like.",
"If the user starts to walk away without the item(s) being returned to the bag, the device will issue a notification, which may take one or more forms, including, without limitation, audio notifications (e.g., recorded voice notification, beeps, and/or the like), visual notifications (e.g., blinking lights, flashing icons, written messages, and/or the like), and/or mobile device notifications (e.g., e-mail notification, text message notification, SMS notification, MMS notification, chat message notification, and/or the like).",
"We now turn to the embodiments as illustrated by the drawings.",
"FIGS.",
"1-7 illustrate some of the features of the method, system, and apparatus for implementing item or luggage loss prevention, as referred to above.",
"The methods, systems, and apparatuses illustrated by FIGS.",
"1-7 refer to examples of different embodiments that include various components and steps, which can be considered alternatives or which can be used in conjunction with one another in the various embodiments.",
"The description of the illustrated methods, systems, and apparatuses shown in FIGS.",
"1-7 is provided for purposes of illustration and should not be considered to limit the scope of the different embodiments.",
"With reference to the figures, FIG.",
"1 is a general schematic diagram illustrating a system 100 for implementing item or luggage loss prevention, in accordance with various embodiments.",
"In FIG.",
"1, system 100 might comprise one or more user devices 105, a bag 110, and device 115.The one or more user devices 105 might comprise one or more tablet computers 105a, one or more smart phones 105b, one or more mobile phones 105c, or one or more portable gaming devices 105d, one or more e-book readers 105e, one or more media players 105f (such as an MP3 audio player, or the like), and/or the like.",
"The bag 110 might include one of a purse, a handbag, a tote, a briefcase, a satchel, laptop bag, travel bag, carry-on luggage, and/or the like.",
"Device 115 is an item or luggage loss prevention device as described in greater detail below with respect to FIGS.",
"2 and 3.System 100 might further comprise server 120 communicatively coupled to the device 115 via network 125 (which might be an access network), and in some cases via one or more telecommunications relay systems 130.The one or more telecommunications relay systems 130 might include, without limitation, one or more wireless network interfaces (e.g., wireless modems, wireless access points, and the like), one or more towers, one or more satellites, and the like.",
"System 100 might further comprise database 135 in communication with server 120.In some embodiments, system 100 might further comprise a plurality of user devices 140, which might include, without limitation, one or more tablet computers 140a, one or more smart phones 140b, one or more mobile phones 140c, or one or more portable gaming devices 140d, one or more e-book readers 140e, one or more media players 140f (such as an MP3 audio player, or the like), one or more desktop computers 140g, one or more laptop computers 140h, and/or the like.",
"In some cases, the one or more tablet computers 140a, one or more smart phones 140b, one or more mobile phones 140c, or one or more portable gaming devices 140d, one or more e-book readers 140e, one or more media players 140f might be the same as the one or more tablet computers 105a, one or more smart phones 105b, one or more mobile phones 105c, or one or more portable gaming devices 105d, one or more e-book readers 105e, one or more media players 105f.",
"In operation, device 115 might allow a user to lock-in a first weight of bag 110 containing the one or more user devices 105.When the user removes at least one of the one or more user devices 105 (e.g., during airport security check-in, during the work day, during a meal, during school, and/or the like), the first weight will have been stored in memory (either on the device 115 locally, or in database 135 via server 120 and network 125).",
"When the user moves the bag, the device 115 might determine that the bag is being moved.",
"In some instances, this might be accomplished by sensing, using a weight measurement device of device 115, that the bag is being lifted.",
"Alternatively, or additionally, the device 115 might comprise a location detection device (e.g., a GPS device, a location triangulation transceiver, and/or the like), which might be used to determine a change in location of the device 115 and/or the bag 110.Once it is determined that the bag 110 is being moved, the device 115 might measure a second weight of the bag 110, and might determine whether the second weight is different from the first weight.",
"If so, the device 115 might notify the user that the weight of bag 110 has changed.",
"Notification, in some cases, might take the form of audio notification, visual notification, and/or wireless notification.",
"Audio notification might include, without limitation, recorded voice notification, audio tones, beeps, and/or the like).",
"Visual notification might include, but is not limited to, blinking lights, flashing icons, written messages, and/or the like.",
"Wireless notification might include, without limitation, e-mail notification, text message notification, small message service (“SMS”) notification, multi-media messaging service (“MMS”) notification, chat message notification, and/or the like.",
"In the case of wireless notification, a network interface device of the device 115 might communicate with server 120 via network 125 (and, in some instances, via the one or more telecommunications relay systems 130).",
"The server 120 might send the e-mail, text, SMS, MMS, and/or chat notifications via network 125 (and, in some instances, via the one or more telecommunications relay systems 130) to the one or more user devices 140.Alternatively, device 115 might directly send the e-mail, text, SMS, MMS, and/or chat notifications via network 125 (and, in some instances, via the one or more telecommunications relay systems 130) to the one or more user devices 140.In some embodiments, the one or more user devices 140 might be associated with the user (or owner of bag 110), while in other cases, the one or more user devices 140 might be associated with a family member or friend (e.g., a travelling companion) of the user (or owner of bag 110).",
"Such preferences for sending the notification can be set up by the user on the device 115 itself and/or at the server 120 (e.g., via a user interface (such as a web user interface, or an App interface, or the like)).",
"In some cases, a spouse (or boyfriend or girlfriend), or a parent, of the owner of the bag 110 might set up the device 115 to notify him- or herself (and/or to notify the owner of the bag 110).",
"We now turn to FIGS.",
"2 and 3, which are directed to apparatuses 200 and/or configurations for implementing item or luggage loss prevention, in accordance with various embodiments.",
"In particular, FIGS.",
"2A and 2B (collectively, “FIG.",
"2”) are general block diagrams illustrating various apparatuses 200 for implementing item or luggage loss prevention, in accordance with various embodiments.",
"FIGS.",
"3A-3F (collectively, “FIG.",
"3”) are general schematic diagrams illustrating various placement and configurations for an apparatus for implementing item or luggage loss prevention, in accordance with various embodiments.",
"In FIG.",
"2A, apparatus 205, which corresponds to device 115 in FIG.",
"1 (as described in detail above), might comprise processor 210, memory 215, user interface device 220, weight measurement device 225, audio device 230, and/or display device 235.Memory 215 might store the notification preferences as well as one or more weights (or lock-in weights).",
"User interface device 220 might comprise one or more touchscreen display devices, one or more buttons, one or more switches, or one or more light emitting devices.",
"Weight measurement device 225 might comprise a load cell selected from a group consisting of a strain gauge load cell, a piezoelectric load cell, a capacitive load cell, a compression load cell, a compression/tension load cell, an S-beam load cell, a bending beam load cell, a platform load cell, a single point load cell, a canister load cell, and/or a low profile load cell.",
"Audio device 230 might comprise, without limitation, one or more speakers, one or more tone generation devices, and/or the like.",
"Display device 235 might comprise one or more light emitting devices, one or more touchscreen devices, one or more liquid crystal displays (“LCDs”), one or more light emitting diode (“LED”) displays, one or more organic LED (“oLED”) displays, and/or the like.",
"In FIG.",
"2B, another embodiment of apparatus 205 might further comprise one or more location detection devices 240 (which might include, without limitation, a GPS device, a location triangulation transceiver, and/or the like), one or more network interface devices 245 (which might include, but is not limited to, Bluetooth™ device, an 802.11 device, a WiFi device, a WiMax device, a WWAN device, cellular communication devices, and/or the like).",
"Apparatuses 200 might function in a manner similar to device 115 described in detail above with respect to FIG.",
"1.In FIG.",
"3, various different configurations and placement of a device 325 corresponding to device 115 or apparatus 200 are shown.",
"As shown in FIG.",
"3, bag 205 might comprise one or more handles 310, one or more feet 315, and/or one or more wheel casters 320.Although FIG.",
"3 shows a particular type of bag, the various embodiments are not so limited, and the bag 305 can be any suitable bag including, without limitation, a purse, a handbag, a tote, a briefcase, a satchel, laptop bag, travel bag, carry-on luggage, and/or the like.",
"In the embodiment of FIG.",
"3A, device 325 might be affixed to at least an underside of the one or more handles 310.In particular, the weight measurement device 225 (shown in FIG.",
"2) might be placed under the one or more handles 310.In some embodiments, some portion of the device 325 (e.g., one or more of processor 210, memory 215, user interface device 220, audio device 230, display device 235, location detection device 240, and/or network interface device 245) might be positioned above the handles 310.In such a manner, these components may be protected against damage from constant lifting.",
"Also, having the display device and the audio device on the upper side of the handles 310 might allow the user to better see and hear notifications through these components.",
"In the embodiment of FIG.",
"3B, device 325 might be placed at a bottom portion of an interior of the bag 305, ideally below where the one or more user devices (e.g., user devices 105 of FIG.",
"1) might be placed.",
"In the embodiment of FIG.",
"3C, device 325 might be affixed or attached to the bag 305 between the bag 305 and the one or more handles 310.In the embodiment of FIG.",
"3D, device 325 might be affixed to the bottom of the one or more feet 315, while in the embodiment of FIG.",
"3E, the devices 325 might be affixed or attached to the bag 305 between the bag 305 and the one or more wheel casters 320.Alternatively, as shown in the embodiment of FIG.",
"3F, device 325 might be part of each of the wheel casters 320, where each device 325 might be positioned between the base 320a and the body 320b of each wheel casters 320, above the wheels 320c.",
"In the case of embodiments shown in FIGS.",
"3A and 3C, weight measurements must be taken while the corresponding bags 305 are being lifted.",
"In the embodiment of FIG.",
"3B, weight measurements may be taken when the bag 305 is being lifted and when it is resting on a surface (e.g., ground, seat, table, etc.).",
"For the embodiments shown in FIGS.",
"3D-3F, weight measurements may be taken when the bags are resting on a surface (e.g., ground, seat, table, etc.).",
"With reference to FIGS.",
"4A-4F (collectively, “FIG.",
"4”), which are general schematic diagrams illustrating various views and configurations of an apparatus 400 for implementing item or luggage loss prevention, in accordance with various embodiments.",
"FIGS.",
"4A-4C show side views of apparatus 400, in which FIGS.",
"4A and 4C show partial cut-out views of portions of the apparatus 400.FIG.",
"4D shows a partial sectional view of portions of the apparatus 400 as seen along the direction of the A-A arrows in FIG.",
"4B, while FIG.",
"4E shows a partial sectional view of portions of the apparatus 400 as seen along the direction of the B-B arrows in FIG.",
"4B; in FIG.",
"4E, partial sectional view of contact surface 440 is shown as a small circle for ease of illustration particularly as compared with surrounding components and elements of the apparatus 400 (and not intended as an accurate sectional or partial section view of contact surface 440).",
"FIG.",
"4F shows a different embodiment of apparatus 400.In FIG.",
"4, dash-lines or dotted-lines might denote cut-out or partial cut-out portions.",
"In FIG.",
"4, apparatus 400 might comprise a main body portion 405 and a piston portion 410.The main body portion 405 might comprise a shell portion 415 and first attachment portion 420.The shell portion 415 might comprise a first cap portion 415a and a second cap portion 415b.",
"The first attachment portion 420 might attach to the first cap portion.",
"The second cap portion is shown in greater detail in FIGS.",
"4D and 4E (and is described further below).",
"According to some embodiments, the first attachment portion 420 might comprise one of a strap, a handle, and/or a resilient loop, each of which might be made of any suitable material including, but not limited to, metal, rubber, cloth, plastic, silicone, wood, or the like, and/or any combination of these materials.",
"The piston portion 410 might comprise a first attachment brace 425a, a second attachment brace 425b, a second attachment portion 430, and at least one rod 435.The first attachment brace 425a might include contact surface 440, which might comprise any suitable contact point including, but not limited to, a hemispheric contact point, a cubic contact point, a rectangular box contact point, a ball contact point, and/or the like.",
"In some embodiments, the second attachment portion 430 might comprise one of a strap, a handle, and/or a resilient loop, each of which might be made of any suitable material including, but not limited to, metal, rubber, cloth, plastic, silicone, wood, or the like, and/or any combination of these materials.",
"The apparatus 400 might further comprise a contact sensor 445, which may be either integrally formed with the second cap portion 415b or separately formed with respect to the second cap portion 415b (but later affixed to the second cap portion 415b, before assembly of the piston portion 410 within the main body portion 405).",
"The apparatus 400 might further comprise a sensor cable 450 and an interface device 455.The sensor cable 450 might, in some cases, communicatively couple the contact sensor 445 with the interface device 455.The processing or calculation of the weight based on the applied force (and changes in units of measurement, taring (i.e., the process of accounting for weight of the luggage and/or other components from the gross weight to measure weight of specific item(s) in the luggage), and/or the like) may be performed by a processor that is either located in the contact sensor 445 and/or the interface device 455.According to some embodiments, the contact sensor 445 might include, without limitation, at least one of a flex sensor, a piezoelectric-based sensor, a compression-based sensor, a spring-based sensor, and/or the like.",
"The contact surface 440 may be made of any suitable material, including, without limitation, metal, rubber, cloth, plastic, silicone, wood, or the like, and/or any combination of these materials, so long as the material does not deform so much that accurate measurement of force of contact between the contact surface 440 and the contact sensor 445 cannot be made.",
"In some cases, the contact surface 440 might be integrally formed with the first attachment brace 425a (and might be of the same material or different material from the material of the first attachment brace 425a).",
"In some instances, the contact surface 440 might be separately formed from the first attachment brace 425a (and might be of the same material or different material from the material of the first attachment brace 425a), and might be assembled with the first attachment brace 425a prior to assembly in the main body portion 405.In operation, one of the main body portion 405 or the piston portion 410 might be (removably or permanently) attached or affixed to a piece of luggage (e.g., bag 305 as shown in FIG.",
"3, or any other suitable type of baggage, or the like), while the other of the main body portion 405 or the piston portion 410 might be carried (i.e., manipulated) by a user.",
"When no force is applied (or when not fully lifted), the contact surface 440 and the contact sensor 445 might be spaced apart (as shown in FIG.",
"4A).",
"When the user-manipulated portion (i.e., one of the main body portion 405 or the piston portion 410) is lifted, however, the first attachment brace 425a (and the contact surface 440 that is attached thereto or is otherwise part thereof) might move toward the second cap portion 415b (and the contact sensor 445 that is attached thereto or is otherwise part thereof), until the contact surface 440 makes contact with the contact sensor 445 (as shown in FIG.",
"4C).",
"When the relative positions of the main body portion 405 and the piston portion 410 have stabilized (i.e., as weight of the luggage and contents therein are applied), the contact surface 440 applies a proportional amount of force to the contact sensor 445, which is measured and eventually registered as weight (in a manner similar to that described with respect to FIGS.",
"1-3 and 5).",
"The weight may, in some cases, be displayed on a display screen or display device of the interface device 455.In some embodiments, the weight might be sent wirelessly as a data packet (from the interface device 455 and/or from the contact sensor 445) to a user device (e.g., smart phone, laptop, television, and/or the like) to be displayed on a display screen of the user device.",
"In some embodiments, the interface device 455 might comprise one or more of a display screen to display computed/measured weight, a voice output device (e.g., a speaker or the like) to provide vocal (or simulated vocal) outputs of the computed/measured weight, buttons to allow the user to select options (e.g., to turn on/off the display, to turn on/off the vocal output device, to select unit of weight, to select options for storing weights, to send computed/measured weights or other stored values or data to another user device (including, but not limited to, a smart phone, a mobile phone, a tablet computer, a laptop computer, a desktop computer, a television, and/or the like), to a server, and/or the like)).",
"In some cases, such as in embodiments where the one of the main body portion 405 or the piston portion 410 is (removably or permanently) attached or affixed to the piece of luggage, the interface device 455 might comprise attachment mechanisms that allow the interface device 455 to also be (removably or permanently) attached or affixed to the piece of luggage (ideally in a manner so as to be easily viewed and/or manipulated by the user).",
"In some instances, the interface device 455 might be (removably or permanently) attached or affixed to some portion of the apparatus 400, including, without limitation, the first attachment portion 420, the second attachment portion 430, the first cap portion 415a, the second cap portion 415b, an exterior part of the shell portion 415, and/or the like.",
"In a non-limiting example, FIG.",
"4F shows the interface device 455 (removably or permanently) attached or affixed to an exterior portion of the first cap portion 415a (along the side of the shell portion 415).",
"According to some embodiments, where the interface device 455 is permanently attached or affixed to an exterior portion of the apparatus 400 (including, without limitation, the first attachment portion 420, the second attachment portion 430, the first cap portion 415a, the second cap portion 415b, an exterior part of the shell portion 415, and/or the like), the sensor cable 450 might be routed within the shell portion 415.In some embodiments, where the interface device 455 is (removably or permanently) attached or affixed to a portion of the piece of luggage, or removably attached or affixed to an exterior portion of the apparatus 400 (including, without limitation, the first attachment portion 420, the second attachment portion 430, the first cap portion 415a, the second cap portion 415b, an exterior part of the shell portion 415, and/or the like), the sensor cable 450 might be routed through slot 460 (as shown in FIG.",
"4B).",
"In some cases, the at least one rod 435 might include one of two rods (as shown in FIG.",
"4), three rods (not shown), four rods (not shown), or any suitable number of rods.",
"In some instances, the first attachment brace 425a and each of the at least one rod 435 might form a U-shaped brace (not shown), the “legs” of which might fit through the openings 465 in the second attachment brace 425b, while the “top” of the U-shaped brace might include contact surface 440.In some embodiments, the U-shaped brace might include, without limitation, one of a curved U-shaped brace, a flat U-shaped brace, or a curved W-shaped brace, and/or the like.",
"The curved U-shaped brace might comprise a “top” of the U-shaped brace that is curved outward toward first cap portion 415a when the U-shaped brace is installed in the main body portion 405.The flat U-shaped brace might include a “top” of the U-shaped brace that is substantially perpendicular with the “legs” of the U-shaped brace.",
"The curved W-shaped brace might have a “top” of the U-shaped brace that first curves outward toward the first cap portion 415a (when the U-shaped brace is installed in the main body portion 405) from each of the “legs,” then curved inward away from the first cap portion 415a and toward the second cap portion 415b to meet in the middle (the overall shape of which evokes or resembles the letter W that has curvy connections).",
"In some instances, the U-shaped brace might have a flat profile (i.e., instead of “rods” for legs, the “legs” might be flat rectangular pieces).",
"In other cases, the U-shaped brace might have circular or oval cross-sections throughout (i.e., the “legs” and/or the “top” might be cylindrical or a bent cylinder, or the like).",
"FIGS.",
"4D and 4E show partial sectional views of apparatus 400 (along the A-A and B-B directions in FIG.",
"4B) that show how the piston portion 410 is connected or assembled with the main body portion 405.In particular, openings 465 (two in the case of the embodiment of FIG.",
"4D) are shown in the second cap portion 415b.",
"The openings 465 (shown as being circular in FIGS.",
"4D and 4E) may be of whatever shape that matches with the shape of the at least one rod 435, so as to allow each of the at least one rod 435 to pass through each corresponding opening 465.The contact sensor 445, although shown as having circular cross section, can have a cross section having any suitable shape, including, but not limited to, circle, square, triangle, rectangle, any polygon, or any irregular shape, and/or the like.",
"Likewise, the contact surface 440, although shown as having circular cross section, can have a cross section having any suitable shape, including, but not limited to, circle, square, triangle, rectangle, any polygon, or any irregular shape, and/or the like.",
"In general, however, the shapes of the contact sensor 445 and the contact surface 440 are chosen to complement each other (although not necessarily having the same shape) to ensure proper mutual contact to afford accurate force/weight measurements.",
"In some instances, one of the first attachment portion 420 or the second attachment portion 430 might include, without limitation, a handle, strap, or bar that is configured to be held with a user's hand(s), while the other of the first attachment portion 420 or the second attachment portion 430 might include, but is not limited to, a handle, strap, or bar that is configured to be (removably or permanently) attached or affixed to a piece of luggage.",
"In some embodiments, the other of the first attachment portion 420 or the second attachment portion 430 (i.e., the luggage-side attachment portion) might include, without limitation, a releasable engagement device 470, which might include (but is not limited) to one of a clasp, a buckle, a carabiner, a clip, or any other suitable fastener, or the like.",
"The releasable engagement device 470 might be made of any suitable material including, without limitation, metal, plastic, and/or the like.",
"In operation, the clasp-type or buckle-type engagement devices 470 might be separable into two portions, a first portion attached or affixed to a first part of the luggage-side attachment portion and a second portion attached or affixed to a second part of the luggage-side attachment portion.",
"In some cases, as shown in the non-limiting example of FIG.",
"4F, the first part 430′ of the luggage-side portion might be longer than the second part 430″ of the luggage-side portion, with the engagement device 470 removably coupling the first part 430′ to the second part 430″.",
"The longer first part 430′ allows the luggage-side portion to loop about a handle or other loop-type structure on the piece of luggage, and to allow the weight of the handle or other loop-type structure on the piece of luggage to be held against the first part 430′ without the weight of the luggage pressing against (and potentially damaging) the engagement device 470.In some cases, the apparatus 400 (including each of the main body portion 405 and the piston portion 410) might be cylindrical in shape.",
"In other cases, the apparatus 400 (including each of the main body portion 405 and the piston portion 410) might be rectangular in shape.",
"While in still other cases, the apparatus 400 (including each of the main body portion 405 and the piston portion 410) might be any suitable shape.",
"In some embodiments, any edges and/or any corners may be made to be rounded.",
"Although FIG.",
"4 shows the contact surface 440 attached or affixed to the piston portion 410 while the contact sensor 445 is shown attached or affixed to the main body portion 405, the various embodiments are not so limited, and the contact surface 440 attached or affixed to the main body portion 405 while the contact sensor 445 is shown attached or affixed to the piston portion 410.We now turn to FIG.",
"5, which is a general schematic flow diagram illustrating a method 500 for implementing item or luggage loss prevention, in accordance with various embodiments.",
"While the techniques and procedures of the method 500 is depicted and/or described in a certain order for purposes of illustration, it should be appreciated that certain procedures may be reordered and/or omitted within the scope of various embodiments.",
"Moreover, while the method illustrated by FIG.",
"5 can be implemented by (and, in some cases, are described below with respect to) systems 100 of FIG.",
"1 (or components thereof), apparatus 200 of FIG.",
"2, apparatus 325 of FIG.",
"3, and/or apparatus 400 of FIG.",
"4, the method may also be implemented using any suitable hardware implementation.",
"Similarly, while system 100 (and/or components thereof) can operate according to the method illustrated by FIG.",
"5 (e.g., by executing instructions embodied on a computer readable medium), system 100 can also operate according to other modes of operation and/or perform other suitable procedures.",
"In FIG.",
"5, method 500 might comprise, at block 505, determining, with a device, a first user input from a user to lock-in a first weight of a bag.",
"Method 500 might further comprise measuring, with the device, the first weight of the bag, in response to receiving the first user input (block 510).",
"At block 515, method 500 might comprise storing, with the device and in a local data storage device, the measured first weight of the bag, prior to the user removing one or more items from the bag.",
"In some embodiments, particular where the device might comprise a location detection device (such as location detection device 240 shown in FIG.",
"2), method 500 might, at block 520, comprise determining, with the location detection device of the device, a first location of the device (e.g., when measuring the first weight of the bag).",
"At block 525, method 500 might comprise storing, with the device, the first location in the local data storage device.",
"Method 500 might further comprise determining, with the device, that the bag is being moved (block 530).",
"In some cases, this might comprise determining, with the location detection device of the device, a second location of the device when measuring the second weight of the bag (block 535), storing, with the device, the second location in the local data storage device (block 540), and determining, with the device, that the second location is different from the first location.",
"At block 545, method 500 might comprise measuring, with the device, a second weight of the bag.",
"In some cases, this second measurement might be performed in response to determining that the bag is being moved.",
"In other cases, the second measurement might be performed in response to another triggering event (e.g., user input requesting the weight of the bag) and/or the measurement might be performed periodically.",
"Method 500, at block 550, might comprise determining, with the device, whether the second weight of the bag matches the stored first weight of the bag.",
"In some embodiments, method 500 might comprise, at block 555, determining, with the device, which of one or more items (including, without limitation, laptops, smart phones, tablet computers, cellular phones, media players, and/or the like) is missing from the bag based on a difference between the first weight and the second weight.",
"This might include pre-storing a plurality of weights of the bag, with and without each of the one or more items.",
"Based on a determination that the second weight does not match the first weight, method 500 might comprise notifying, with the device, the user (block 560).",
"In some embodiments, notifying the user might comprise one or more of playing a recorded voice notification, emitting one or more audio tones, displaying one or more light sequences, displaying one or more icons, displaying a written message, sending an e-mail notification, sending a text message notification, sending a small message service (“SMS”) notification, sending a multi-media messaging service (“MMS”) notification, or sending a chat message notification.",
"We now turn to FIG.",
"6, which is a block diagram illustrating an exemplary computer architecture.",
"FIG.",
"6 provides a schematic illustration of one embodiment of a computer system 600 that can perform the methods provided by various other embodiments, as described herein, and/or can perform the functions of local computer system 115, 205, 325, or 400, or remote computer system 120, or other computer systems as described above.",
"It should be noted that FIG.",
"6 is meant only to provide a generalized illustration of various components, of which one or more, or none, of each may be utilized as appropriate.",
"FIG.",
"6, therefore, broadly illustrates how individual system elements may be implemented in a relatively separated or relatively more integrated manner.",
"The computer system 600 is shown comprising hardware elements that can be electrically coupled via a bus 605, or may otherwise be in communication, as appropriate.",
"The hardware elements may include one or more processors 610, including without limitation one or more general-purpose processors, or one or more special-purpose processors such as digital signal processing chips, graphics acceleration processors, or the like; one or more input devices 615, which can include without limitation a mouse, a keyboard, or the like; and one or more output devices 620, which can include without limitation a display device, a printer, or the like.",
"The computer system 600 may further include, or be in communication with, one or more storage devices 625.The one or more storage devices 625 can comprise, without limitation, local and/or network accessible storage, or can include, without limitation, a disk drive, a drive array, an optical storage device, a solid-state storage device.",
"The solid-state storage device can include, but is not limited to, one or more of a random access memory (“RAM”) or a read-only memory (“ROM”), which can be programmable, flash-updateable, or the like.",
"Such storage devices may be configured to implement any appropriate data stores, including without limitation various file systems, database structures, or the like.",
"The computer system 600 might also include a communications subsystem 630, which can include without limitation a modem, a network card (wireless or wired), an infra-red communication device, a wireless communication device or chipset, or the like.",
"The wireless communication device might include, but is not limited to, a Bluetooth™ device, an 802.11 device, a WiFi device, a WiMax device, a WWAN device, cellular communication facilities, or the like.",
"The communications subsystem 630 may permit data to be exchanged with a network (such as network 125, to name an example), with other computer systems, with any other devices described herein, or with any combination of network, systems, and devices.",
"According to some embodiments, network 125 might include a local area network (“LAN”), including without limitation a fiber network, an Ethernet network, a Token-Ring™ network, and the like; a wide-area network (“WAN”); a wireless wide area network (“WWAN”); a virtual network, such as a virtual private network (“VPN”); the Internet; an intranet; an extranet; a public switched telephone network (“PSTN”); an infra-red network; a wireless network, including without limitation a network operating under any of the IEEE 802.11 suite of protocols, the Bluetooth™ protocol, or any other wireless protocol; or any combination of these or other networks.",
"In many embodiments, the computer system 600 will further comprise a working memory 635, which can include a RAM or ROM device, as described above.",
"The computer system 600 may also comprise software elements, shown as being currently located within the working memory 635, including an operating system 640, device drivers, executable libraries, or other code.",
"The software elements may include one or more application programs 645, which may comprise computer programs provided by various embodiments, or may be designed to implement methods and/or configure systems provided by other embodiments, as described herein.",
"Merely by way of example, one or more procedures described with respect to the methods discussed above might be implemented as code or instructions executable by a computer or by a processor within a computer.",
"In an aspect, such code or instructions can be used to configure or adapt a general purpose computer, or other device, to perform one or more operations in accordance with the described methods.",
"A set of these instructions or code might be encoded and/or stored on a non-transitory computer readable storage medium, such as the storage devices 625 described above.",
"In some cases, the storage medium might be incorporated within a computer system, such as the system 600.In other embodiments, the storage medium might be separate from a computer system—that is, a removable medium, such as a compact disc, or the like.",
"In some embodiments, the storage medium might be provided in an installation package, such that the storage medium can be used to program, configure, and/or adapt a general purpose computer with the instructions/code stored thereon.",
"These instructions might take the form of executable code, which is executable by the computer system 600, or might take the form of source or installable code.",
"The source or installable code, upon compilation, installation, or both compilation and installation, on the computer system 600 might take the form of executable code.",
"Compilation or installation might be performed using any of a variety of generally available compilers, installation programs, compression/decompression utilities, or the like.",
"It will be apparent to those skilled in the art that substantial variations may be made in accordance with specific requirements.",
"For example, customized hardware—such as programmable logic controllers, field-programmable gate arrays, application-specific integrated circuits, or the like—might also be used.",
"In some cases, particular elements might be implemented in hardware, software (including portable software, such as applets, etc.",
"), or both.",
"Further, connection to other computing devices such as network input/output devices may be employed.",
"As mentioned above, in one aspect, some embodiments may employ a computer system, such as the computer system 600, to perform methods in accordance with various embodiments of the invention.",
"According to a set of embodiments, some or all of the procedures of such methods might be performed by the computer system 600 in response to processor 610 executing one or more sequences of one or more instructions.",
"The one or more instructions might be incorporated into the operating system 640 or other code that may be contained in the working memory 635, such as an application program 645.Such instructions may be read into the working memory 635 from another computer readable medium, such as one or more of the storage devices 625.Merely by way of example, execution of the sequences of instructions contained in the working memory 635 might cause the one or more processors 610 to perform one or more procedures of the methods described herein.",
"The terms “machine readable medium” and “computer readable medium,” as used herein, refer to any medium that participates in providing data that causes a machine to operate in a specific fashion.",
"In an embodiment implemented using the computer system 600, various computer readable media might be involved in providing instructions or code to the one or more processors 610 for execution, might be used to store and/or carry such instructions/code such as signals, or both.",
"In many implementations, a computer readable medium is a non-transitory, physical, or tangible storage medium.",
"Such a medium may take many forms, including, but not limited to, non-volatile media, volatile media, and transmission media.",
"Non-volatile media includes, for example, optical disks, magnetic disks, or both, such as the storage devices 625.Volatile media includes, without limitation, dynamic memory, such as the working memory 635.Transmission media includes, without limitation, coaxial cables, copper wire and fiber optics, including the wires that comprise the bus 605, as well as the various components of the communication subsystem 630, or the media by which the communications subsystem 630 provides communication with other devices.",
"Hence, transmission media can also take the form of waves, including without limitation radio, acoustic, or light waves, such as those generated during radio-wave and infra-red data communications.",
"Common forms of physical or tangible computer readable media include, for example, a floppy disk, a flexible disk, a hard disk, magnetic tape, or any other magnetic medium; a CD-ROM, DVD-ROM, or any other optical medium; punch cards, paper tape, or any other physical medium with patterns of holes; a RAM, a PROM, an EPROM, a FLASH-EPROM, or any other memory chip or cartridge; a carrier wave; or any other medium from which a computer can read instructions or code.",
"As noted above, a set of embodiments comprises methods and systems for implementing item or luggage loss prevention.",
"FIG.",
"7 illustrates a schematic diagram of a system 700 that can be used in accordance with one set of embodiments.",
"The system 700 can include one or more user computers or user devices 705.A user computer or user device 705 can be a general purpose personal computer (including, merely by way of example, desktop computers, tablet computers, laptop computers, handheld computers, and the like, running any appropriate operating system, several of which are available from vendors such as Apple, Microsoft Corp., and the like) and/or a workstation computer running any of a variety of commercially-available UNIX™ or UNIX-like operating systems.",
"A user computer or user device 705 can also have any of a variety of applications, including one or more applications configured to perform methods provided by various embodiments (as described above, for example), as well as one or more office applications, database client and/or server applications, and/or web browser applications.",
"Alternatively, a user computer or user device 705 can be any other electronic device, such as a thin-client computer, Internet-enabled mobile telephone, and/or personal digital assistant, capable of communicating via a network (e.g., the network 710 described below) and/or of displaying and navigating web pages or other types of electronic documents.",
"Although the exemplary system 700 is shown with two user computers or user devices 705, any number of user computers or user devices can be supported.",
"Certain embodiments operate in a networked environment, which can include a network 710.The network 710 can be any type of network familiar to those skilled in the art that can support data communications using any of a variety of commercially-available (and/or free or proprietary) protocols, including without limitation TCP/IP, SNA™, IPX™, AppleTalk™, and the like.",
"Merely by way of example, the network 710 can include a local area network (“LAN”), including without limitation a fiber network, an Ethernet network, a Token-Ring™ network and/or the like; a wide-area network (“WAN”); a wireless wide area network (“WWAN”); a virtual network, such as a virtual private network (“VPN”); the Internet; an intranet; an extranet; a public switched telephone network (“PSTN”); an infra-red network; a wireless network, including without limitation a network operating under any of the IEEE 802.11 suite of protocols, the Bluetooth™ protocol known in the art, and/or any other wireless protocol; and/or any combination of these and/or other networks.",
"In a particular embodiment, the network might include an access network of the service provider (e.g., an Internet service provider (“ISP”)).",
"In another embodiment, the network might include a core network of the service provider, and/or the Internet.",
"Embodiments can also include one or more server computers 715.Each of the server computers 715 may be configured with an operating system, including without limitation any of those discussed above, as well as any commercially (or freely) available server operating systems.",
"Each of the servers 715 may also be running one or more applications, which can be configured to provide services to one or more clients 705 and/or other servers 715.Merely by way of example, one of the servers 715 might be a data server, as described above.",
"The data server might include (or be in communication with) a web server, which can be used, merely by way of example, to process requests for web pages or other electronic documents from user computers 705.The web server can also run a variety of server applications, including HTTP servers, FTP servers, CGI servers, database servers, Java servers, and the like.",
"In some embodiments of the invention, the web server may be configured to serve web pages that can be operated within a web browser on one or more of the user computers 705 to perform methods of the invention.",
"The server computers 715, in some embodiments, might include one or more application servers, which can be configured with one or more applications accessible by a client running on one or more of the client computers 705 and/or other servers 715.Merely by way of example, the server(s) 715 can be one or more general purpose computers capable of executing programs or scripts in response to the user computers 705 and/or other servers 715, including without limitation web applications (which might, in some cases, be configured to perform methods provided by various embodiments).",
"Merely by way of example, a web application can be implemented as one or more scripts or programs written in any suitable programming language, such as Java™, C, C#™ or C++, and/or any scripting language, such as Perl, Python, or TCL, as well as combinations of any programming and/or scripting languages.",
"The application server(s) can also include database servers, including without limitation those commercially available from Oracle™, Microsoft™, Sybase™, IBM™ and the like, which can process requests from clients (including, depending on the configuration, dedicated database clients, API clients, web browsers, etc.)",
"running on a user computer or user device 705 and/or another server 715.In some embodiments, an application server can perform one or more of the processes for implementing automated cloud expansion and ordering, or the like, as described in detail above.",
"Data provided by an application server may be formatted as one or more web pages (comprising HTML, JavaScript, etc., for example) and/or may be forwarded to a user computer 705 via a web server (as described above, for example).",
"Similarly, a web server might receive web page requests and/or input data from a user computer 705 and/or forward the web page requests and/or input data to an application server.",
"In some cases a web server may be integrated with an application server.",
"In accordance with further embodiments, one or more servers 715 can function as a file server and/or can include one or more of the files (e.g., application code, data files, etc.)",
"necessary to implement various disclosed methods, incorporated by an application running on a user computer 705 and/or another server 715.Alternatively, as those skilled in the art will appreciate, a file server can include all necessary files, allowing such an application to be invoked remotely by a user computer or user device 705 and/or server 715.It should be noted that the functions described with respect to various servers herein (e.g., application server, database server, web server, file server, etc.)",
"can be performed by a single server and/or a plurality of specialized servers, depending on implementation-specific needs and parameters.",
"In certain embodiments, the system can include one or more databases 720.The location of the database(s) 720 is discretionary: merely by way of example, a database 720a might reside on a storage medium local to (and/or resident in) a server 715a (and/or a user computer or user device 705).",
"Alternatively, a database 720b can be remote from any or all of the computers 705, 715, so long as it can be in communication (e.g., via the network 710) with one or more of these.",
"In a particular set of embodiments, a database 720 can reside in a storage-area network (“SAN”) familiar to those skilled in the art.",
"(Likewise, any necessary files for performing the functions attributed to the computers 705, 715 can be stored locally on the respective computer and/or remotely, as appropriate.)",
"In one set of embodiments, the database 720 can be a relational database, such as an Oracle database, that is adapted to store, update, and retrieve data in response to SQL-formatted commands.",
"The database might be controlled and/or maintained by a database server, as described above, for example.",
"According to some embodiments, the system can further include device 725, which is configured to be attached to and/or placed in a bag (including, without limitation, a purse, a handbag, a tote, a briefcase, a satchel, laptop bag, travel bag, carry-on luggage, and/or the like).",
"In some cases, device 725 is an item or luggage loss prevention device that is weight-measurement-based, as described in detail above with respect to FIGS.",
"1-5.In other words, device 725 might correspond with, and might have functionalities that are similar to, devices 115, 205, 325, and 400 as described in detail with respect to FIGS.",
"1-4.Although the above embodiments specifically identify electronics components as items that can be tracked (by weight) to prevent loss, the various embodiments are not so limited, and other items may be similarly tracked.",
"Such other items might include, without limitation, eye wear, time pieces (e.g., watches, stopwatches, etc.",
"), jewelry, clothing (ideally, heavier articles of clothing), gifts, toiletry, personal hygiene products, and/or the like.",
"In some embodiments, the systems, apparatuses, and/or methods described above may be applied to child safety seats or child seats.",
"For example, with reference to the embodiments of FIG.",
"3, device 325 (or similar device) may be affixed to at least an underside of a handle of the child seat (so that when positioned from a stored position to a carrying position, relative to the body of the child seat, the device is positioned on at least the underside of the handle), not unlike the relative positioning as shown in FIG.",
"3A.",
"In some cases, some portion of the device 325 (e.g., one or more of processor 210, memory 215, user interface device 220, audio device 230, display device 235, location detection device 240, and/or network interface device 245) might be positioned above the handles, not unlike the embodiment of FIG.",
"3A.",
"In some instances, device 325 (or similar device) might be affixed or attached to the child seat between the child seat and the handle (e.g., a hinge joint or other suitable connection joint, or the like), not unlike the embodiment of FIG.",
"3C.",
"In some cases, device 325 (or similar device) might be placed at a bottom portion of a child seat—for example, between a bottom shell portion and bottom inner cushions (i.e., the part on which a baby's body may be set to rest) of the child seat, not unlike the embodiment of FIG.",
"3B.",
"Alternatively, device 325 (or similar device) might be placed below the bottom shell portion of the child seat (i.e., below the feet of the child seat, if any), not unlike the embodiment of FIG.",
"3D.",
"In some instances, if the child seat has feet or wheels, device 325 (or similar device) might be placed between the bottom shell portion of the child seat and the feet or wheels of the child seat, not unlike the embodiment of FIG.",
"3E, or as part of the feet or wheels of the child seat, not unlike the embodiment of FIG.",
"3F.",
"Merely by way of example, for compression-based weight sensing, such as shown in the embodiments of FIG.",
"3A, 3B, or 3D-3F, the device 325 (or similar device) might comprise a contact surface (e.g., contact surface 440, or the like) and a contact sensor (e.g., contact sensor 445, or the like).",
"The contact surface and the contact sensor are configured so as to be spaced apart when not sensing—which, in some embodiments, may be accomplished with the use of springs, gravity, or the like.",
"Where springs are used, the sensor might be calibrated to take into account the spring constant and other properties of the spring and/or connection configurations when calculating or measuring weight.",
"The contact sensor, like that in the embodiment of FIG.",
"4, might communicatively couple to an interface device (e.g., interface device 455) via a cable (e.g., sensor cable 450).",
"A processor (located either in the contact sensor or the interface device) might perform processing or calculation of the weight based on the applied force.",
"In some cases, the interface device might couple to a network interface device and/or location detection device, and might allow sending of notifications, alerts, or messages to user devices associated with the parents or guardians of the baby if the baby is missing, in danger, or otherwise.",
"The location detection might help parents or guardians in determining where the child was last in the child seat, which may help in locating a missing baby.",
"In some embodiments, multiple devices may be used for each child seat, e.g., to provide more nuanced weight measurements (e.g., for detecting problems or issues that the baby might encounter, as described below).",
"For tension-based weight sensing, such as shown in the embodiments of FIG.",
"3C or 4, the apparatus 400 (or similar apparatus) may be used, in a manner as described above with respect to FIGS.",
"3C and 4.In some cases, the child seat might have an outer shell housing and an inner shell housing.",
"The inner shell housing might have the cushion and the like on which the baby may be set to rest, while the outer shell housing is designed to rest on a surface (e.g., seat of a car, a table, a bed, a ground surface, or a frame for a baby stroller, and/or the like).",
"In some embodiments, the outer shell housing might have a lip or wall that extends upward to encompass at least a portion of an exterior lip or wall of the inner shell housing, and the child seat might comprise two or more (e.g., three or four) connection apparatuses, not unlike apparatus 400 that connects or couples the inner shell housing to the outer shell housing.",
"In some cases, the outer shell housing lip or wall might be vertically aligned with the at least a portion of the exterior lip or wall of the inner shell housing, although such configuration is not necessary for achieving the functionalities described herein.",
"In one set of embodiments, for each of the connection apparatuses, the outer shell housing might be connected to first attachment portion (e.g., first attachment portion 420 or the like), while the inner shell housing might be connected to second attachment portion (e.g., second attachment portion 430 or the like).",
"In this manner, the inner shell housing is almost always hanging from the outer shell housing.",
"The tension-based weight sensing embodiments are otherwise similar, if not identical, to the compression-based weight sensing embodiments, and descriptions of the compression-based weight sensing embodiments are similarly applicable to those of the tension-based weight sensing embodiments.",
"With the systems, apparatuses, and methods described above, it is made possible to ensure that a baby is not left behind, such as when absent-minded and rushed parents or guardians are packing luggage and/or other children for a trip and potentially, accidentally leaving the baby behind (thinking that the baby is securely fastened in the child seat).",
"This might be exacerbated by child seat covers or blankets for keeping the baby warm (such covers or blankets might obscure one's view of the presence or absence of the baby).",
"With the systems, apparatuses, and methods described above, it may easily be determined that the baby is absent, and, in some cases, a notification (e.g., sound notification, e-mail notification, text/chat message notification, voice recording notification, and/or the like) might alert the parents or guardians of this fact (in some cases, by sending such notification to a mobile device(s) associated with the parents or guardians).",
"In some instances, a proximity or motion sensor on the child seat might determine whether a parent or other persons are moving away from the child seat, and might send such information to a processor (e.g., processor 210).",
"In some cases, the proximity sensor might track proximity (and/or movement relative) to a mobile device(s) associated with the parents or guardians of the child.",
"If the processor determines that the proximity or motion sensor data indicate that a parent or other persons have moved away from the child seat by a certain (predetermined or preset) distance while the child seat is occupied by a child (e.g., by receiving weight and weight change data indicating that the child is in the child seat, etc.",
"), regardless of whether the child seat is in a vehicle, at home, or in some other location, then the processor might send a notification (e.g., sound notification, e-mail notification, text/chat message notification, voice recording notification, and/or the like) of such fact to the mobile device(s) associated with the parents or guardians.",
"In some instances, such notification can warn the parents or guardians when the child seat with the child in it has been moved away from them (either inadvertently or purposefully) by some other person.",
"In other embodiments, the systems, apparatuses, and methods described above might determine that the baby has somehow gotten out of the child seat, and may alert the parents or guardians of such an event (in some cases, by sending a notification to the mobile device(s) associated with the parents or guardians).",
"In yet other embodiments, systems, apparatuses, and methods described above might determine that something is amiss with the baby (including, but not limited to, the baby is too still for too long, the weight distribution of the baby is not normal, excess weight is detected, and/or the like), which might indicate urgent (and potentially serious or dangerous) issues have arisen with respect to the baby (e.g., the baby is either in deep sleep or not breathing, the baby is in an odd position that might harm the baby, something has fallen on the child seat and/or the baby, and/or the like).",
"In some cases, with the constant or near constant weight measurement, and with appropriate storage devices installed or frequent sending of weight information to an external storage device, the baby's weight can be tracked over time to give the parents, guardians, or pediatrician a record of the baby's growth.",
"Although applications related to babies are described above with respect to child seats, other appliances or such may also be configured to use the systems, apparatuses, and/or methods described herein.",
"For example, bassinets (where stationary, rocking, hanging, or the like) may be modified (or designed) to utilize the systems, apparatuses, and/or methods herein, in a manner similar to those as described above with respect to the child seats.",
"With such modified (or designed) bassinets, it can be determined when and if the baby has fallen out, has crawled out, has climbed out, or has been taken out, or the like.",
"It can also be determined if, when, and for how long the baby has not been too still for too long, or if, when, and for how long an abnormal weight distribution of the baby is detected.",
"It can be determined if, when, and for how long an excess weight is detected (e.g., suddenly detected).",
"And so on.",
"These and other weight-based or weight determined issues may be determined, and notifications of such may be sent to parents, guardians, and/or pediatricians (or the parents, guardians, and/or pediatricians are otherwise alerted of such issues) as necessary or desired.",
"As with the child seat, the baby's weight can be tracked to allow recording of the baby's growth over time.",
"These and other similar systems, apparatuses, and methods may be similarly applicable to pet carriers, pet mats (or mattresses) in vehicles, pet mats (or mattresses) at home, and/or the like, in order to provide similar information to pet owners about their pets.",
"For outdoor sports enthusiasts, similar technology may be applied to vehicle parts to alert people of missing bicycles, kayaks, canoes, rafts, snowboards, skis, trailers, and/or the like.",
"The various embodiments are not limited to these specific embodiments described herein, and may be applied to other situations and uses, as ordinary (or skilled) person can appreciate.",
"While certain features and aspects have been described with respect to exemplary embodiments, one skilled in the art will recognize that numerous modifications are possible.",
"For example, the methods and processes described herein may be implemented using hardware components, software components, and/or any combination thereof.",
"Further, while various methods and processes described herein may be described with respect to particular structural and/or functional components for ease of description, methods provided by various embodiments are not limited to any particular structural and/or functional architecture but instead can be implemented on any suitable hardware, firmware and/or software configuration.",
"Similarly, while certain functionality is ascribed to certain system components, unless the context dictates otherwise, this functionality can be distributed among various other system components in accordance with the several embodiments.",
"Moreover, while the procedures of the methods and processes described herein are described in a particular order for ease of description, unless the context dictates otherwise, various procedures may be reordered, added, and/or omitted in accordance with various embodiments.",
"Moreover, the procedures described with respect to one method or process may be incorporated within other described methods or processes; likewise, system components described according to a particular structural architecture and/or with respect to one system may be organized in alternative structural architectures and/or incorporated within other described systems.",
"Hence, while various embodiments are described with—or without—certain features for ease of description and to illustrate exemplary aspects of those embodiments, the various components and/or features described herein with respect to a particular embodiment can be substituted, added and/or subtracted from among other described embodiments, unless the context dictates otherwise.",
"Consequently, although several exemplary embodiments are described above, it will be appreciated that the invention is intended to cover all modifications and equivalents within the scope of the following claims."
]
] |
Patent_15871393
|
[
[
"SHOOTING LONG FIBER SPANS WITH HIGH LOSS FIBER",
"A method of tracing a complete span of a fiber includes inferring a reference point on the fiber based on a measured length of the fiber, setting a pulse width and a measurement range based on the inferred reference point, shooting a fiber from a master unit, attached to one end of the fiber, to collect trace past the inferred reference point, shooting a fiber from a slave unit, attached to an opposite end of the fiber, to collect trace past the inferred reference point, cropping the collected traces captured by the master unit and the slave unit past the inferred reference point, inverting a slope of the trace of the slave unit using measurement loss information and combining the trace of the master unit and the trace of the slave unit, with the inverted slope, to obtain a complete and accurate trace of the fiber."
],
[
"1-6.",
"(canceled) 7.A method of tracing a complete span of a fiber, the method comprising: determining a reference point along an end-to-end length of the fiber, wherein the reference point is specified at a location between the ends of the fiber along the end-to-end length of the fiber; setting a pulse width and a measurement range to be greater than a distance from each end of the fiber to the reference point; shooting a fiber from a master unit, attached to one end of the fiber, to collect trace past the reference point; shooting the fiber from a slave unit, attached to an opposite end of the fiber, to collect trace past the reference point; and combining the trace of the master unit and the trace of the slave unit.",
"8.The method of claim 7, further comprising measuring an end-to-end length of the fiber; 9.The method of claim 7, further comprising cropping the collected traces captured by the master unit and the slave unit past the reference point.",
"10.The method of claim 7, further comprising inverting a slope of the trace of the slave unit using measurement loss information.",
"11.The method of claim 7, wherein the setting the pulse width and the measurement range comprises setting the pulse width and the measurement range to be greater than half the measured length of the fiber.",
"12.The method of claim 7, wherein the reference point is at a midpoint of the fiber.",
"13.The method of claim 7, wherein setting the pulse width and the measurement range comprises setting the pulse width and the measurement range of the master unit and the slave unit, the master unit and the slave unit respectively connected to the opposing ends of the fiber, wherein the master unit is configured to collect trace data from the one end of the fiber to a first point beyond the reference point in a first direction along the end-to-end length of the fiber, and wherein the slave unit is configured to collect trace data from the opposite end of the fiber to a second point beyond the reference point in a second opposite direction along the end-to-end length of the fiber.",
"14.The method of claim 7, wherein the first point beyond the reference point is determined by adding a buffer length to the reference point in the first direction, and wherein the second point beyond the reference point is determined by adding a buffer length to the reference point in the second opposite direction.",
"15.A method of tracing a complete span of a fiber, the method comprising: determining a reference point along an end-to-end length of the fiber, wherein the reference point is specified at a location between the ends of the fiber along the end-to-end length of the fiber; setting a pulse width and the measurement range of the master unit and the slave unit, the master unit and the slave unit respectively connected to the opposing ends of the fiber, wherein the master unit is configured to collect trace data from the one end of the fiber to a first point beyond the reference point in a first direction along the end-to-end length of the fiber, and wherein the slave unit is configured to collect trace data from the opposite end of the fiber to a second point beyond the reference point in a second opposite direction along the end-to-end length of the fiber; shooting a fiber from the master unit to collect trace past the reference point; shooting the fiber from the slave unit to collect trace past the reference point; and combining the trace of the master unit and the trace of the slave unit.",
"16.The method of claim 15, further comprising measuring an end-to-end length of the fiber; 17.The method of claim 15, further comprising cropping the collected traces captured by the master unit and the slave unit past the reference point.",
"18.The method of claim 15, further comprising inverting a slope of the trace of the slave unit using measurement loss information.",
"19.The method of claim 15, wherein the setting the pulse width and the measurement range comprises setting the pulse width and the measurement range to be greater than half the measured length of the fiber.",
"20.The method of claim 15, wherein the reference point is at a midpoint of the fiber.",
"21.The method of claim 15, wherein the first point beyond the reference point is determined by adding a buffer length to the reference point in the first direction, and wherein the second point beyond the reference point is determined by adding a buffer length to the reference point in the second opposite direction."
],
[
"<SOH> BACKGROUND <EOH>"
],
[
"<SOH> SUMMARY <EOH>Exemplary implementations of the present invention address at least the above problems and/or disadvantages and other disadvantages not described above.",
"Also, the present invention is not required to overcome the disadvantages described above, and an exemplary implementation of the present invention may not overcome any of the problems listed above.",
"According to an aspect of an exemplary embodiment, a method of tracing a complete span of a fiber includes inferring a reference point on the fiber based on a measured length of the fiber, setting a pulse width and a measurement range based on the inferred reference point, shooting a fiber from a master unit, attached to one end of the fiber, to collect trace past the inferred reference point, shooting a fiber from a stave unit, attached to an opposite end of the fiber, to collect trace past the inferred reference point, cropping the collected traces captured by the master unit and the slave unit past the inferred reference point, inverting a slope of the trace of the slave unit using measurement loss information, and combining the trace of the master unit and the trace of the Slave Unit, with the inverted slope, to obtain a complete and accurate trace of the fiber.",
"According to another exemplary embodiment, the pulse width and the measurement range are set to be greater than half the measured length of the fiber.",
"According to an aspect of another exemplary embodiment, a non-transitory computer readable recording medium storing a program used in an apparatus, including at least one processor, for tracing a complete span of a fiber, causes said at least one processor to infer a reference point on the fiber based on a measured length of the fiber, set a pulse width and a measurement range based on the inferred reference point, shoot a fiber from a master unit, attached to one end of the fiber, to collect trace past the inferred reference point, shoot a fiber from a slave unit, attached to an opposite end of the fiber, to collect trace past the inferred reference point, crop the collected traces captured by the roaster unit and the slave unit past the inferred reference point, invert a slope of the trace of the slave unit using measurement loss information, and combine the trace of the master unit and the trace of the slave unit, with the inverted slope, to obtain a complete and accurate trace of the fiber.",
"According to another exemplary embodiment, the program further causes the said at least one processor to set the pulse width and the measurement range to be greater than half the measured length of the fiber.",
"According to an as of another exemplary embodiment, an apparatus for tracing a complete span of a fiber the apparatus includes at least one memory operable to store program code, at least one processor operable to read the program code and operate as instructed by the program code, the program code including inferring code configured to cause the at least one processor to infer a reference point on the fiber based on a measured length of the fiber, setting code configured to cause the at least one processor to set a pulse width and a measurement range based on the inferred reference point, first shooting code configured to cause the at least one processor to shoot a fiber from a master unit, attached to one end of the fiber, to collect trace past the interred reference point, second shooting code configured to cause the at least one processor to shoot a fiber from a slave unit, attached to an opposite end of the fiber, to collect trace past the inferred reference point, cropping code configured to cause the at least one processor to crop the collected traces captured by the master unit and the slave unit past the inferred reference point, inverting code configured to cause the at least one processor to invert a slope of the trace of the slave unit using measurement loss information, and combining code configured to cause the at least one processor to combine the trace of the master unit and the trace of the slave unit, with the inverted slope, to obtain a complete and accurate trace of the fiber.",
"According to another exemplary embodiment, the setting code is further configured to cause the at least one processor to set the pulse width and the measurement range to be greater than half the measured length of the fiber."
],
[
"CROSS-REFERENCE TO RELATED APPLICATIONS This application is based upon and claims the benefit of priority from U.S.",
"Provisional Application No.",
"61/934,174, tiled Jan. 31, 2014 in the United States Patent and Trademark Office, the disclosures of which are incorporated herein in its entirety by reference.",
"BACKGROUND 1.Field The invention is related to event detection and mapping across the complete span of a fiber, and more particularly to measurement of the complete span distance of a fiber, measurement of complete loss across the span of the fiber, event detection and mapping across the complete span of a fiber and achieving trace showing the complete span of the fiber.",
"2.Related Art The background information provided herein is for the purpose of generally presenting the context of the disclosure.",
"Work of the presently named inventor, to the extent it is described in this background section, as well as aspects of the description that may not otherwise qualify as prior art at the time of filing, are neither expressly nor impliedly admitted as prior art against the present disclosure.",
"Long spans of fiber—on the order of 200 km—with splices every 5 km made up of fiber with 0.3 dB/km loss and 0.1 dB per-splice loss drives the need for over 64 dB of dynamic range.",
"To detect events on such a span—across the complete span an optical time-domain reflectometer (OTDR) would require 70 dB of dynamic range.",
"This is far beyond the capability of products in the field today.",
"In the current optical technology, no OTDR can shoot the complete span and measure the length of the fiber described above as it would require over 64 dB of dynamic range.",
"While high loss spans can be difficult to shoot, long spans in general are difficult to shoot for the same reasons as described above.",
"While OTDRs can shoot 200 Kilometers (km) low loss spans, the event spacing/resolution can be poor due to the wide pulse widths required to do so.",
"Accordingly, using shorter pulse widths on some long spans for better event location/resolution.",
"Use of a 20 uS pulse width gives up to a 2 km location uncertainty as well as burying any events spaced closer than 2 km apart.",
"Therefore, there is a need for the ability to shoot a long fiber span for measurement of complete span distance, which cannot be simply estimated, measurement of complete loss across span, event detection and mapping across complete span and for acquiring a trace showing complete span of the fiber, so that the customer has confidence the fiber has not be tampered with or modified.",
"SUMMARY Exemplary implementations of the present invention address at least the above problems and/or disadvantages and other disadvantages not described above.",
"Also, the present invention is not required to overcome the disadvantages described above, and an exemplary implementation of the present invention may not overcome any of the problems listed above.",
"According to an aspect of an exemplary embodiment, a method of tracing a complete span of a fiber includes inferring a reference point on the fiber based on a measured length of the fiber, setting a pulse width and a measurement range based on the inferred reference point, shooting a fiber from a master unit, attached to one end of the fiber, to collect trace past the inferred reference point, shooting a fiber from a stave unit, attached to an opposite end of the fiber, to collect trace past the inferred reference point, cropping the collected traces captured by the master unit and the slave unit past the inferred reference point, inverting a slope of the trace of the slave unit using measurement loss information, and combining the trace of the master unit and the trace of the Slave Unit, with the inverted slope, to obtain a complete and accurate trace of the fiber.",
"According to another exemplary embodiment, the pulse width and the measurement range are set to be greater than half the measured length of the fiber.",
"According to an aspect of another exemplary embodiment, a non-transitory computer readable recording medium storing a program used in an apparatus, including at least one processor, for tracing a complete span of a fiber, causes said at least one processor to infer a reference point on the fiber based on a measured length of the fiber, set a pulse width and a measurement range based on the inferred reference point, shoot a fiber from a master unit, attached to one end of the fiber, to collect trace past the inferred reference point, shoot a fiber from a slave unit, attached to an opposite end of the fiber, to collect trace past the inferred reference point, crop the collected traces captured by the roaster unit and the slave unit past the inferred reference point, invert a slope of the trace of the slave unit using measurement loss information, and combine the trace of the master unit and the trace of the slave unit, with the inverted slope, to obtain a complete and accurate trace of the fiber.",
"According to another exemplary embodiment, the program further causes the said at least one processor to set the pulse width and the measurement range to be greater than half the measured length of the fiber.",
"According to an as of another exemplary embodiment, an apparatus for tracing a complete span of a fiber the apparatus includes at least one memory operable to store program code, at least one processor operable to read the program code and operate as instructed by the program code, the program code including inferring code configured to cause the at least one processor to infer a reference point on the fiber based on a measured length of the fiber, setting code configured to cause the at least one processor to set a pulse width and a measurement range based on the inferred reference point, first shooting code configured to cause the at least one processor to shoot a fiber from a master unit, attached to one end of the fiber, to collect trace past the interred reference point, second shooting code configured to cause the at least one processor to shoot a fiber from a slave unit, attached to an opposite end of the fiber, to collect trace past the inferred reference point, cropping code configured to cause the at least one processor to crop the collected traces captured by the master unit and the slave unit past the inferred reference point, inverting code configured to cause the at least one processor to invert a slope of the trace of the slave unit using measurement loss information, and combining code configured to cause the at least one processor to combine the trace of the master unit and the trace of the slave unit, with the inverted slope, to obtain a complete and accurate trace of the fiber.",
"According to another exemplary embodiment, the setting code is further configured to cause the at least one processor to set the pulse width and the measurement range to be greater than half the measured length of the fiber.",
"BRIEF DESCRIPTION OF THE DRAWING FIG.",
"1 illustrates a fiber with a master and slave connected to opposite ends to determine the length of the fiber, according to an exemplary embodiment.",
"FIG.",
"2 illustrates a fiber going through a process of tracing a complete span and event detection, according to an exemplary embodiment.",
"FIG.",
"3 is a flowchart describing a method of determining the length of a fiber currently used by other OTDRs available in the market, according to another exemplary embodiment.",
"FIG.",
"4 is a flowchart describing a method of tracing a complete span and event detection in a fiber, according to another exemplary embodiment.",
"FIG.",
"5 illustrates a fiber with a master and slave connected to opposite ends to determine the length of the fiber while incorporating the errors in the time of flights of light pulses, according to an exemplary embodiment.",
"FIG.",
"6 illustrates a functional block diagram of an embodiment of an apparatus which determines a length of a fiber, traces a complete span of a fiber, and performs event detection in a fiber, according to an exemplary embodiment.",
"DETAILED DESCRIPTION The following detailed description is provided to assist the reader in gaining a comprehensive understanding of the methods, apparatuses and/or systems described herein.",
"Various changes, modifications, and equivalents of the systems, apparatuses and/or methods described herein will suggest themselves to those of ordinary skill in the art.",
"Descriptions of well-known functions and structures are omitted to enhance clarity and conciseness.",
"The terms used in the description are intended to describe embodiments only, and shall by no means be restrictive.",
"Unless clearly used otherwise, expressions in a singular form include a meaning of a plural form.",
"In the present description, an expression such as “comprising” or “including” is intended to designate a characteristic, a number, a step, an operation, an element, a part or combinations thereof, and shall not be construed to preclude any presence or possibility of one or more other characteristics, numbers, steps, operations, elements, parts or combinations thereof.",
"Referring to the drawings, FIG.",
"1 illustrates a fiber with a master and slave connected to opposite ends to determine the length of the fiber, according to an exemplary embodiment.",
"According to an exemplary embodiment, the two ends attached to the fiber may be made up of two units.",
"One may function in a master mode and the other may function in a slave mode.",
"The terms master mode and slave mode are merely used as exemplary embodiments and are interchangeable with main mode/remote mode and other terminology well known to one of ordinary skill in the art.",
"The master unit may be attached to one end of the fiber.",
"The slave may be attached to the opposite end of the fiber.",
"To measure the length of the fiber, the master unit sends a light pulse or a set of light pulses, as shown by the arrows in FIG.",
"1, with a time stamp encoded in the pulse train, according to exemplary embodiments.",
"The slave unit receives the light pulse or the set of light pulses with the encoded time stamp and rebroadcasts the pulse/pulses to the master.",
"If using the single light pulse method, the master calculates the time it took from firing the pulse to receiving the pulse back from the slave, thereby calculating the round-trip time.",
"If using the train of light pulses with the time stamp of the master encoded in the pulse train, the master subtracts the time stamp from the it's current time reference, thereby again calculating the total round-trip time.",
"Accordingly, the length of the fiber can be calculated using the following formula for calculating the time of flight in one direction: Time of Flight in one direction=(Calculated Round−Trip-Time in seconds)/2.Thus, the length of the fiber can be calculated using the time of flight calculation using the above formula.",
"The conversion to meters is based on the Fiber Index of Refraction.",
"Accordingly, using the above describes exemplary embodiments, an accurate length measurement of the fiber can be achieved.",
"FIG.",
"2 illustrates a fiber going through a process of tracing a complete span and event detection, according to an exemplary embodiment.",
"No OTDR today can shoot the complete span of a fiber.",
"Therefore an accurate trace cannot be created and all events cannot be detected.",
"With today's OTDRs, one can shoot from either side of the span; however, without having some known reference point, you cannot attach the traces from either end of the span into a single, coherent, accurate trace of the complete span of the fiber.",
"According to an exemplary embodiment described in FIG.",
"1, the Length can be accurately measured as described above.",
"Therefore, a known reference point can be inferred by using the mid-point of the span as the known reference point.",
"For example, if the span is 200 km long, then the mid-point is exactly 100 km from either end.",
"The Master unit sets its pulse width (PW) and measurement range to 0.5*measure length+25%((the 25% being added as buffer).",
"This means it sets the appropriate PW to shoot 120 km and chooses the appropriate range to measure 120 km, according to the exemplary embodiment.",
"Accordingly, after knowing the known reference point and performing the calculation, the Master unit shoots the fiber and collects the trace.",
"At some point beyond 120 km, the trace enters the noise floor.",
"However, the length of interest is the first 100 km which has been clearly captured and therefore, accurate event detection can be performed on it.",
"In the same manner, the Slave unit shoots the fiber and collects the trace.",
"At some point beyond 120 km, the trace enters the noise floor.",
"However, the length of interest is the first 100 km which has been clearly captured and therefore, accurate event detection can be performed on it.",
"In the exemplary embodiment of FIG.",
"2, if A is considered the master end of the fiber, the trace captured on the Master unit is cropped to remove anything occurring after the midpoint X.",
"In the same manner, the trace captured on the Slave unit B is cropped to remove anything occurring after the midpoint X.",
"The remaining trace of the slave end B-X is then inverted.",
"Specifically, by taking the measurement loss information, the slope of the trace is inverted, as shown in FIG.",
"2.Now a complete and accurate trace of the span is provided with complete event analysis.",
"Using the same analysis, the complete loss can also be determined.",
"FIG.",
"3 is a flowchart describing a method of determining the length of a fiber, according to another exemplary embodiment.",
"The method first includes sending a light pulse or a set of light pulses from the Master Unit at one end of the fiber to the slave unit at the opposite end of the fiber 301.Following that the master unit receives the light pulse or the set of light pulses back from the slave unit 302.Step 303 incorporated calculating the total round-trip travel time of the light pulse or the set of light pulses.",
"Finally, step 304 incorporates calculating the length of the fiber using the calculated total round-trip travel time, according to an exemplary embodiment.",
"The above described method for measuring length of the fiber is used by the T400 and C840 optical loss test sets (OLTS) and the C850 OLTS/OTDR for length measurement.",
"FIG.",
"4 is a flowchart describing a method of tracing a complete span and event detection in a fiber, according to another exemplary embodiment.",
"The method first includes Inferring a known reference point based on the measured length of the fiber 401.Following that a pulse width and measurement range is set based on the inferred reference point 402.Step 403 incorporated shooting a fiber from the master unit to collect trace past the inferred reference point.",
"Step 404 incorporates shooting a fiber from the slave unit to collect trace past the inferred reference point.",
"In step 405, traces captured by both the master unit and the Slave Unit are cropped past the inferred reference point.",
"In step 406, by taking the measurement loss information, the slope of the trace of the slave unit is inverted.",
"Finally, step 407 incorporates combining the traces of the master unit and the slave unit to achieve a complete and accurate trace of the fiber, according to an exemplary embodiment, as described with reference to FIG.",
"2 above.",
"FIG.",
"5 illustrates a fiber with a master and slave connected to opposite ends to determine the length of the fiber while incorporating the errors in the time of flights of light pulses, according to art exemplary embodiment.",
"As depicted in FIG.",
"5, the error in the time of flight for a light pulse sent from A to B will be Ea1+Eb2.Similarly, the error in the time of flight from B to A will he Eb1+Ea2.Accordingly, the total time of flight from A to B incorporating the errors can be calculated by the following formula: Time of Flight 1=Time of Flight A−B+Ea1+Eb2 Similarly, the total time of flight from B to A incorporating the errors can be calculated by the following formula: Time of Flight 2=Time of Flight B−A+Ea2+Eb1 As the time of flight from A to B is the same as the time of flight B to A, the error term can be calculated using the following formula: Time of flight 1−Time of flight 2=(Ea1+Eb2)−(Eb1+Ea2)=Eab Furthermore, the following formula uses the error term to provides us with the average time of flight: Average time of flight=(Time of flight 1+Time of flight 2−Eab)/2 FIG.",
"6 illustrates a functional block diagram of an embodiment of an apparatus which determines a length of a fiber, traces a complete span of a fiber, and performs event detection in a fiber, according to an exemplary embodiment.",
"The apparatus 601 includes a memory 603, a processor 602, and an Optics/Electronics unit 604, according to an exemplary embodiment.",
"An example of a processor is an ARM Xscale 806 Mhz processor.",
"An example of a memory is an 8 Gbit NAND flash memory.",
"Accordingly, the memory may store a program code/operating software which in-turn instructs the processor 602/Optics/Electronics 604 to measure the complete span distance, which cannot be simply estimated, measure the complete loss across span, perform event detection and map across complete span to acquire a trace showing complete span of the fiber, as described in FIGS.",
"1-5 above.",
"The program code/operating software can also be stored on a non-transitory computer readable medium.",
"The different exemplary embodiments described above provide a more accurate trace and event profile compared to a single side shot with a high power OTDR.",
"They further allow use of shorter PW than required to shoot a complete span and use a shorter range than required to shoot the complete span thereby providing increased resolution.",
"Furthermore, they allow use of a less dynamic range OTDR providing a more cost effective and practical solution.",
"Although certain benefits of the described embodiments are listed above, the benefits are riot limited thereto.",
"As mentioned above, the embodiments described above are merely exemplary and the general inventive concept should not be limited thereto.",
"While this specification contains many features, the features should not be construed as limitations on the scope of the disclosure or the appended claims.",
"Certain features described in the context of separate embodiments can also be implemented in combination.",
"Conversely, various features described in the context of a single embodiment can also be implemented in multiple embodiments separately or in any suitable sub-combination."
]
] |
Patent_15871398
|
[
[
"Catheter Connector Insert",
"The present invention relates to a catheter connector assembly having an insert for use during packaging, shipping, and handling of a catheter connector.",
"The assembly includes a catheter connector having a body with a first half axially aligned with a second half.",
"The first half is rotatable relative to the second half between an open position and a closed position.",
"The first half defines a distal end of the body and the second half defines a proximal end of the body.",
"A proximal end port is configured with the proximal end of the second half for mating communication with a fluid delivery device.",
"The insert is configured with the body when the body is in the open position such that the insert maintains the catheter connector in the open position during packaging, shipping, and handling of the catheter connector."
],
[
"1.An insert for a catheter connector for use during packaging, shipping, and handling of the catheter connector, said insert comprising: a rod-shaped member configured to fit within the catheter connector, the catheter connector having a body with a first half axially aligned with a second half, the first half rotatable relative to the second half between an open position and a closed position, the rod-shaped member configured to fit within the first and second halves when the catheter connector is in the open position such that said insert maintains the catheter connector in the open position during packaging, shipping, and handling of the catheter connector.",
"2.The insert of claim 1, further comprising a tab member configured with said rod-shaped member, said tab member extending outside of the catheter connector when said rod-shaped member is inserted within the first and second halves of the catheter connector, said tab member configured to assist a user with removing said insert from the catheter connector.",
"3.The insert of claim 1, wherein the open position comprises the first half being rotated relative to the second half at an approximately 45-degree angle.",
"4.The insert of claim 1, wherein said insert comprises a rigid material.",
"5.The insert of claim 4, wherein said rigid material comprises at least one of or a combination of the following: a plastic material, polycarbonate, polypropylene, polyurethane, polyester, epoxy resins, phenolic resins, polyvinyl chloride (PVC), or metal.",
"6.An insert for a catheter connector for use during packaging, shipping, and handling of the catheter connector, said insert comprising: a housing configured to fit at least partially around an exterior surface of the catheter connector, the catheter connector having a body with a first half axially aligned with a second half, the first half rotatable relative to the second half between an open position and a closed position, said housing comprising a hollow interior, said hollow interior comprising a shape corresponding to an exterior shape of the catheter connector in the open position, wherein at least a portion of the catheter connector is configured to fit within said housing when the catheter connector is in the open position such said insert maintains the catheter connector in the open position during packaging, shipping, and handling of the catheter connector.",
"7.The insert of claim 6, wherein the open position comprises the first half being rotated relative to the second half at an approximately 45-degree angle.",
"8.The insert of claim 6, wherein said insert further comprises one or more locking features configured to secure said insert at least partially around the exterior surface of the first half of the catheter connector.",
"9.The insert of claim 8, wherein said locking features comprise at least one of or a combination of the following: molded snaps, add-on grips, ridges, protrusions, or an adhesive.",
"10.The insert of claim 6, wherein said insert comprises rigid material.",
"11.The insert of claim 10, wherein said rigid material comprises at least one of or a combination of the following: a plastic material, polycarbonate, polypropylene, polyurethane, polyester, epoxy resins, phenolic resins, polyvinyl chloride (PVC), or metal."
],
[
"<SOH> BACKGROUND <EOH>The use of catheters to deliver or withdraw fluids from a patient for various medical procedures is well known.",
"For example, U.S. Pat.",
"No.",
"7,959,623 describes a pain management system that uses various embodiments of infusion catheters to deliver fluid medication from a pump, through tubing, to a wound site.",
"With such configurations, catheter connectors are typically used to connect the catheter to various devices, such as tubing, a fluid reservoir or other fluid delivery device, and so forth.",
"In the system of the '623 patent, a conventional Tuohy-Borst connector is used to connect the distal end of a medical tube to the proximal end of the catheter.",
"In addition to Tuohy-Borst connectors, various other configurations of catheter connectors are available.",
"For example, Epimed International of Farmers Branch, Tex., U.S.A., manufactures a low profile twist-lock catheter connector known as the “Stingray™” connector.",
"This device has axially aligned halves that twist to an open position to allow insertion of the catheter in a first half, and subsequently twist to a closed position with an audible and tactile click that indicates complete engagement with the catheter.",
"The second half connects to a tube or other fluid delivery device for delivering fluid through the connector to the catheter.",
"Further, between the two halves is a molded bushing that includes an inner elastomeric tube that compresses and grips the catheter when the connector is in a closed position.",
"During packaging, shipping, and handling of the Stingray™ connector, as well as other connectors having a similar configuration, it is important for the connector to remain in an open position because, if the connector closes, the locking jaws will stay in the closed position and will not allow the catheter to be inserted therethrough.",
"More specifically, when the connector is in a closed position, the two halves push inward to squeeze the inner elastomeric tube over the catheter.",
"Since, the connector is typically made of a soft plastic, the molded bushing and inner elastomeric tube can lose their strength when in the closed position.",
"As such, even when the load is removed, the inner diameter of the elastomeric tube may be smaller, which can inhibit the catheter from being inserted easily therethrough.",
"Accordingly, an insert designed to keep a catheter connector, such as a Stingray™ connector, in the open position during packaging, shipping, and handling would be welcomed in the art."
],
[
"<SOH> SUMMARY OF THE INVENTION <EOH>Objects and advantages of the invention will be set forth in part in the following description, or may be obvious from the description, or may be learned through practice of the invention.",
"In certain aspects, the present invention relates to a catheter connector assembly for use during packaging, shipping, and handling of a catheter connector.",
"The assembly includes a catheter connector having a body with a first half axially aligned with a second half.",
"The first half is rotatable relative to the second half between an open position and a closed position.",
"The first half defines a distal end of the body and the second half defines a proximal end of the body.",
"A proximal end port is configured with the proximal end of the second half for mating communication with a fluid delivery device.",
"An insert is configured with the body when the body is in the open position such that the insert maintains the catheter connector in the open position during packaging, shipping, and handling of the catheter connector.",
"In one embodiment, the insert is configured to fit within the first and second halves of the body when the first half is in the open position such that the insert maintains the catheter connector in the open position.",
"More specifically, in a particular embodiment, the insert may include a rod-shaped member configured to fit within the first and second halves when the first half is in the open position such that the insert maintains the catheter connector in the open position.",
"In addition, the insert may also include a tab member configured with the rod-shaped member.",
"The tab member is configured to extend outside of the catheter connector when the rod-shaped member is inserted within the first and second halves of the body.",
"As such, the tab member is configured to assist a user with removing the insert from the catheter connector.",
"In additional embodiments, the open position is defined by the first half being rotated relative to the second half at an approximately 45-degree angle.",
"In another embodiment, the insert may be configured to fit at least partially around an exterior surface of the body of the connector when the body is in the open position such that the insert maintains the catheter connector in the open position.",
"More specifically, in a particular embodiment, the insert may further include a housing having a hollow interior.",
"The hollow interior has a shape that corresponds to an exterior shape of the catheter connector in the open position.",
"Thus, at least a portion of the catheter connector is configured to fit within the housing of the insert when the catheter connector is in the open position such the insert maintains the catheter connector in the open position during packaging, shipping, and handling.",
"In such an embodiment, the insert may also include one or more locking features configured to secure the insert at least partially around the exterior surface of the connector.",
"For example, in various embodiments, the locking features may include at least one of or a combination of the following: molded snaps, add-on grips, ridges, protrusions, an adhesive, or similar.",
"In additional embodiments, the insert may be constructed of a rigid material.",
"In various embodiments, the rigid material includes at least one of or a combination of the following: a plastic material, polycarbonate, polypropylene, polyurethane, polyester, epoxy resins, phenolic resins, polyvinyl chloride (PVC), a metal, or any other rigid or semi-rigid material.",
"In further aspects, the present invention relates to an insert for a catheter connector for use during packaging, shipping, and handling of the catheter connector.",
"The insert includes a rod-shaped member configured to fit within the catheter connector.",
"The catheter connector has a body with a first half axially aligned with a second half.",
"The first half is rotatable relative to the second half between an open position and a closed position.",
"Thus, the rod-shaped member is configured to fit within the first and second halves when the catheter connector is in the open position such that the insert maintains the catheter connector in the open position during packaging, shipping, and handling of the catheter connector.",
"It should be understood that the insert may also include any of the additional features as described herein.",
"In still additional aspects, the present invention relates to an insert for a catheter connector for use during packaging, shipping, and handling of the catheter connector.",
"The insert includes a housing configured to fit at least partially around an exterior surface of the catheter connector.",
"Further, the catheter connector has a body with a first half axially aligned with a second half.",
"The first half is rotatable relative to the second half between an open position and a closed position.",
"The housing includes a hollow interior having a shape that corresponds to an exterior shape of the catheter connector in the open position.",
"Thus, at least a portion of the catheter connector is configured to fit within the housing of the insert when in the open position such the insert maintains the catheter connector in the open position during packaging, shipping, and handling of the catheter connector.",
"It should be understood that the insert may also include any of the additional features as described herein.",
"These and other features, aspects and advantages of the present invention will become better understood with reference to the following description and appended claims.",
"The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate embodiments of the invention and, together with the description, serve to explain the principles of the invention."
],
[
"RELATED APPLICATIONS The present application is a divisional of and claims priority to U.S. application Ser.",
"No.",
"14/279,969 filed on May 16, 2014, which is incorporated herein in its entirety by reference hereto.",
"FIELD OF THE INVENTION The present invention relates generally to the field of medical catheters and more particularly to inserts for catheter connectors for using during packaging, shipping, and handling.",
"BACKGROUND The use of catheters to deliver or withdraw fluids from a patient for various medical procedures is well known.",
"For example, U.S. Pat.",
"No.",
"7,959,623 describes a pain management system that uses various embodiments of infusion catheters to deliver fluid medication from a pump, through tubing, to a wound site.",
"With such configurations, catheter connectors are typically used to connect the catheter to various devices, such as tubing, a fluid reservoir or other fluid delivery device, and so forth.",
"In the system of the '623 patent, a conventional Tuohy-Borst connector is used to connect the distal end of a medical tube to the proximal end of the catheter.",
"In addition to Tuohy-Borst connectors, various other configurations of catheter connectors are available.",
"For example, Epimed International of Farmers Branch, Tex., U.S.A., manufactures a low profile twist-lock catheter connector known as the “Stingray™” connector.",
"This device has axially aligned halves that twist to an open position to allow insertion of the catheter in a first half, and subsequently twist to a closed position with an audible and tactile click that indicates complete engagement with the catheter.",
"The second half connects to a tube or other fluid delivery device for delivering fluid through the connector to the catheter.",
"Further, between the two halves is a molded bushing that includes an inner elastomeric tube that compresses and grips the catheter when the connector is in a closed position.",
"During packaging, shipping, and handling of the Stingray™ connector, as well as other connectors having a similar configuration, it is important for the connector to remain in an open position because, if the connector closes, the locking jaws will stay in the closed position and will not allow the catheter to be inserted therethrough.",
"More specifically, when the connector is in a closed position, the two halves push inward to squeeze the inner elastomeric tube over the catheter.",
"Since, the connector is typically made of a soft plastic, the molded bushing and inner elastomeric tube can lose their strength when in the closed position.",
"As such, even when the load is removed, the inner diameter of the elastomeric tube may be smaller, which can inhibit the catheter from being inserted easily therethrough.",
"Accordingly, an insert designed to keep a catheter connector, such as a Stingray™ connector, in the open position during packaging, shipping, and handling would be welcomed in the art.",
"SUMMARY OF THE INVENTION Objects and advantages of the invention will be set forth in part in the following description, or may be obvious from the description, or may be learned through practice of the invention.",
"In certain aspects, the present invention relates to a catheter connector assembly for use during packaging, shipping, and handling of a catheter connector.",
"The assembly includes a catheter connector having a body with a first half axially aligned with a second half.",
"The first half is rotatable relative to the second half between an open position and a closed position.",
"The first half defines a distal end of the body and the second half defines a proximal end of the body.",
"A proximal end port is configured with the proximal end of the second half for mating communication with a fluid delivery device.",
"An insert is configured with the body when the body is in the open position such that the insert maintains the catheter connector in the open position during packaging, shipping, and handling of the catheter connector.",
"In one embodiment, the insert is configured to fit within the first and second halves of the body when the first half is in the open position such that the insert maintains the catheter connector in the open position.",
"More specifically, in a particular embodiment, the insert may include a rod-shaped member configured to fit within the first and second halves when the first half is in the open position such that the insert maintains the catheter connector in the open position.",
"In addition, the insert may also include a tab member configured with the rod-shaped member.",
"The tab member is configured to extend outside of the catheter connector when the rod-shaped member is inserted within the first and second halves of the body.",
"As such, the tab member is configured to assist a user with removing the insert from the catheter connector.",
"In additional embodiments, the open position is defined by the first half being rotated relative to the second half at an approximately 45-degree angle.",
"In another embodiment, the insert may be configured to fit at least partially around an exterior surface of the body of the connector when the body is in the open position such that the insert maintains the catheter connector in the open position.",
"More specifically, in a particular embodiment, the insert may further include a housing having a hollow interior.",
"The hollow interior has a shape that corresponds to an exterior shape of the catheter connector in the open position.",
"Thus, at least a portion of the catheter connector is configured to fit within the housing of the insert when the catheter connector is in the open position such the insert maintains the catheter connector in the open position during packaging, shipping, and handling.",
"In such an embodiment, the insert may also include one or more locking features configured to secure the insert at least partially around the exterior surface of the connector.",
"For example, in various embodiments, the locking features may include at least one of or a combination of the following: molded snaps, add-on grips, ridges, protrusions, an adhesive, or similar.",
"In additional embodiments, the insert may be constructed of a rigid material.",
"In various embodiments, the rigid material includes at least one of or a combination of the following: a plastic material, polycarbonate, polypropylene, polyurethane, polyester, epoxy resins, phenolic resins, polyvinyl chloride (PVC), a metal, or any other rigid or semi-rigid material.",
"In further aspects, the present invention relates to an insert for a catheter connector for use during packaging, shipping, and handling of the catheter connector.",
"The insert includes a rod-shaped member configured to fit within the catheter connector.",
"The catheter connector has a body with a first half axially aligned with a second half.",
"The first half is rotatable relative to the second half between an open position and a closed position.",
"Thus, the rod-shaped member is configured to fit within the first and second halves when the catheter connector is in the open position such that the insert maintains the catheter connector in the open position during packaging, shipping, and handling of the catheter connector.",
"It should be understood that the insert may also include any of the additional features as described herein.",
"In still additional aspects, the present invention relates to an insert for a catheter connector for use during packaging, shipping, and handling of the catheter connector.",
"The insert includes a housing configured to fit at least partially around an exterior surface of the catheter connector.",
"Further, the catheter connector has a body with a first half axially aligned with a second half.",
"The first half is rotatable relative to the second half between an open position and a closed position.",
"The housing includes a hollow interior having a shape that corresponds to an exterior shape of the catheter connector in the open position.",
"Thus, at least a portion of the catheter connector is configured to fit within the housing of the insert when in the open position such the insert maintains the catheter connector in the open position during packaging, shipping, and handling of the catheter connector.",
"It should be understood that the insert may also include any of the additional features as described herein.",
"These and other features, aspects and advantages of the present invention will become better understood with reference to the following description and appended claims.",
"The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate embodiments of the invention and, together with the description, serve to explain the principles of the invention.",
"BRIEF DESCRIPTION OF THE DRAWINGS FIG.",
"1 illustrates a perspective view of one embodiment of a catheter connector of conventional construction in a closed position; FIG.",
"2 illustrates a perspective view of the catheter connector of FIG.",
"1 in an open position; FIG.",
"3 illustrates a perspective view of the catheter connector of FIG.",
"1 separated into two halves to illustrate various internal components of the connector; FIG.",
"4 illustrates a perspective view of one embodiment of an insert for a catheter connector in accordance with aspects of the invention; FIG.",
"5 illustrates a perspective view of one embodiment of the insert of FIG.",
"4 configured with a catheter connector in accordance with aspects of the invention; FIG.",
"6 illustrates a perspective view of another embodiment of an insert for a catheter connector in accordance with aspects of the invention; and FIG.",
"7 illustrates a perspective view of one embodiment of the insert of FIG.",
"6 configured with a catheter connector in accordance with aspects of the invention.",
"DETAILED DESCRIPTION OF THE INVENTION Reference will now be made in detail to one or more embodiments of the invention, examples of the invention, examples of which are illustrated in the drawings.",
"Each example and embodiment is provided by way of explanation of the invention, and is not meant as a limitation of the invention.",
"For example, features illustrated or described as part of one embodiment may be used with another embodiment to yield still a further embodiment.",
"It is intended that the invention include these and other modifications and variations as coming within the scope and spirit of the invention.",
"The positional terms “proximal” and “distal” are used herein to orient the various components relative to each other and to the patient.",
"“Distal” refers to the direction that is closest to the wound site (e.g., the distal end of the connector is the end oriented towards a catheter insertion site), and “proximal” refers to the opposite direction (e.g., the proximal end of the catheter is inserted into the distal end of the connector).",
"Generally, the present disclosure is directed to a catheter connector assembly having an insert that maintains a catheter connector in an open position during packaging, shipping, and handling.",
"More specifically, the assembly includes a catheter connector, e.g.",
"a Stingray™ connector, having a body with a first half axially aligned with a second half.",
"The first half is rotatable relative to the second half between an open position and a closed position.",
"The first half defines a distal end of the body and the second half defines a proximal end of the body.",
"A proximal end port is configured with the proximal end of the second half for mating communication with a fluid delivery device.",
"The insert is configured with the body when the body is in the open position such that the insert maintains the catheter connector in the open position during packaging, shipping, and handling of the catheter connector.",
"The present disclosure has many advantages not present in the prior art.",
"For example, the insert provides a simple, easy-to-use component that maintains a catheter connector in an open position during packaging, shipping, and handling.",
"As such, the internal components of the catheter connector are not compromised before being used for a patient.",
"In addition, the insert is relatively inexpensive to manufacture and can be used in conjunction with many catheter connectors, such as the Stingray™ connector as described herein.",
"Referring now to the drawings, FIGS.",
"1-3 illustrate various views of one embodiment of a catheter connector 10 that can be used in conjunction with the insert of the present disclosure.",
"As shown, the catheter connector 10 includes a body 16 having a proximal end 18 and distal end 20.The body 16 has a first half 22 axially aligned with a second half 24.The first half 22 defines a distal end 20 of the body 16 and the second half 24 defines a proximal end 18 of the body 16.A proximal end port 14 is configured with the proximal end 18 of the second half 24 for mating communication with a fluid delivery device (not shown).",
"As mentioned, the fluid delivery device may be any suitable device known in the art, such as a pump, reservoir, syringe, or the like.",
"Further, the proximal end port 14 may have any conventional configuration, such as a Luer-lock fitting.",
"The first half 22 is rotatable relative to the second half 24 between an open position (FIG.",
"2) and a closed position (FIG.",
"1).",
"More specifically, as shown in FIG.",
"3, the first half 22 may include a bushing 25 extending from an interior surface 23 thereof.",
"In certain embodiments, an elastomeric tube 27 may be configured within the bushing 25.Further, the second half 24 may include a corresponding cavity 29 configured to receive the bushing 25 therein.",
"Thus, the axially aligned halves 22, 24 of the connector 10 are configured to twist to the open position (FIG.",
"2) to allow insertion of a catheter through a catheter insertion hole 15 in the first half 22, and subsequently twist to a closed position (FIG.",
"1) with an audible and tactile click that indicates complete engagement with the catheter.",
"More specifically, the elastomeric tube 27 within the bushing 25 compresses and grips the catheter when the connector 10 is in the closed position (FIG.",
"1).",
"In certain embodiments, the open position is defined by the first half 22 being rotated relative to the second half 24 at an approximately 45-degree angle.",
"In further embodiments, the first half 22 may be rotated to any suitable angle relative to the second half 24.Referring to FIG.",
"4, one embodiment of an insert 26 configured to maintain the catheter connector 10 of FIGS.",
"1-3 in an open position during packaging, shipping, and handling is illustrated.",
"As shown, the insert 26 includes a rod-shaped member 28 and a tab member 30.The rod-shaped member 28 has proximal end 31 and a distal end 33.Further, the rod-shaped member 28 is shaped such that the proximal end 31 can be inserted through the catheter connector 10 when the connector 10 is in an open position.",
"For example, in one embodiment, the rod-shaped member 28 may have a substantially circular cross-section so as to correspond with the cross-sectional shape of a catheter.",
"Thus, as shown in FIG.",
"5, a portion of the rod-shaped member 28 may be inserted through the first and second halves 22, 24 of the catheter connector 10 through the catheter insertion hole 15 so as to maintain the connector 10 in an open position.",
"In addition, as shown, the tab member 30 is configured with the distal end 33 of the rod-shaped member 28 such that the tab member 30 extends outside of the distal end 20 of the catheter connector 10 when the rod-shaped member 28 is inserted within the first and second halves 22, 24 of the connector 10.Thus, the tab member 30 is configured to assist a user with removing the insert 26 from within the catheter connector 10 (e.g.",
"after the connector 10 has been shipping and is ready to be used with a catheter that is inserted into a patient).",
"Referring now to FIG.",
"6, another embodiment of an insert 46 configured to maintain the catheter connector 10 of FIGS.",
"1-3 in an open position during packaging, shipping, and handling is illustrated.",
"As shown, the insert 46 is configured to fit at least partially around an exterior surface of the body 16 of the connector 10 when the body 16 is in the open position such that the insert 46 maintains the catheter connector 10 in the open position.",
"For instance, as shown in the illustrated embodiment, the insert 46 includes a housing 32 having a hollow interior 34 that is shaped so as to correspond to an exterior shape of the catheter connector 10 when the connector 10 is in the open position.",
"More specifically, in certain embodiments, the housing 32 includes a plurality of compartments 38 that correspond to the rotated first and second halves 22, 24 in the open position.",
"Thus, as shown in FIG.",
"7, at least a portion of the catheter connector 10 is configured to fit within the housing 32 when the connector 10 is in the open position such that the insert 46 maintains the catheter connector 10 in the open position during packaging, shipping, and handling.",
"Still referring to FIGS.",
"6 and 7, the insert 46 may also include one or more locking features 36 configured to secure the insert 46 at least partially around the exterior surface of the body 16 of the connector 10.For example, in certain embodiments, the locking features 36 may include any one of or combination of the following: molded snaps, add-on grips, ridges, protrusions, an adhesive, or similar.",
"It should also be understood that the inserts 26, 46 as described herein may be constructed of any suitable material.",
"For example, in certain embodiments, the inserts 26, 46 may be constructed of a rigid or semi-rigid material, such as a metal or a hard plastic.",
"More specifically, the inserts 26, 46 may be constructed of polypropylene, polycarbonate, polyurethane, polyester, epoxy resins, phenolic resins, polyvinyl chloride (PVC), or any other suitable polymer material.",
"In addition, the inserts 26, 46 may be constructed of aluminum, copper, stainless steel, or any other suitable metal.",
"In some embodiments, the inserts 26, 46 may also be constructed of a flexible or semi-flexible material, such as a rubber material, a polymeric material, a silicone material, an elastomeric material, or similar.",
"More specifically, in various embodiments, the inserts 26, 46 may be constructed of polyisoprene, polyurethane, styrene butadiene, and/or any other suitable flexible material.",
"While the present invention has been described in connection with certain preferred embodiments it is to be understood that the subject matter encompassed by way of the present invention is not to be limited to those specific embodiments.",
"On the contrary, it is intended for the subject matter of the invention to include all alternatives, modifications and equivalents as can be included within the spirit and scope of the following claims."
]
] |
Patent_15871406
|
[
[
"HEAT-EXCHANGING DEVICE",
"The condenser of the heat-exchanging device is provided with a flow passage through which a high-pressure refrigerant flows.",
"The flow passage is structured by openings formed in the plurality of plates.",
"Inside the flow passage, an inner pipe having an outer diameter smaller than the diameter of the openings is disposed.",
"The part inside the flow passage but outside the inner pipe serves as a passage in which the refrigerant that has flown into the condenser flows, and the part inside the inner pipe serves as a passage in which the refrigerant that has passed through the component section flows."
],
[
"1.A heat-exchanging device comprising a plate-stacked section of a plurality of plates continuously stacked one on another, the plate-stacked section comprising: a condenser having a structure where a refrigerant passage through which a high-pressure refrigerant flows and a heat-carrier passage through which a heat carrier that absorbs heat from the high-pressure refrigerant flows are stacked one on another between a part of the plurality of plates; and a component section having a structure where the refrigerant that has passed through the condenser flows between a part of the plurality of plates or via a part of the plates, wherein, in the condenser, openings respectively disposed in the plurality of plates forms a flow passage through which the refrigerant flows, inside the flow passage, a first pipe having outer diameter smaller than a diameter of each of the openings is disposed, and the first pipe is disposed such that the refrigerant that has flown into the condenser flows inside the flow passage but outside the first pipe and the refrigerant that has passed through the component section flows inside the first pipe.",
"2.The heat-exchanging device according to claim 1 further comprising a second pipe which carries the high-pressure refrigerant into the condenser, wherein the first pipe and the second pipe are integrally provided.",
"3.The heat-exchanging device according to claim 2, wherein the component section includes an evaporator having a structure where a flow passage through which a low-pressure refrigerant flows and a flow passage through which a heat carrier that applies heat to the low-pressure refrigerant flows are stacked one on another between a part of the plurality of plates.",
"4.The heat-exchanging device according to claim 3, wherein, the component section includes an intermediate heat-exchanger that performs heat exchange between the high-pressure refrigerant that has passed through the condenser and the low-pressure refrigerant that has passed through the evaporator, in the evaporator, a flow passage through which the low-pressure refrigerant flows is formed by openings respectively disposed in the plurality of plates, inside the flow passage, a third pipe having an outer diameter smaller than a diameter of each of the openings is disposed, and the third pipe is disposed such that the refrigerant that has flown into the evaporator flows inside the flow passage but outside the third pipe and the refrigerant that has passed through the intermediate heat-exchanger flows inside the third pipe.",
"5.The heat-exchanging device according to claim 4 further comprising a fourth pipe which carries the low-pressure refrigerant into the evaporator, wherein the third pipe and the fourth pipe are integrally provided.",
"6.The heat-exchanging device according to claim 4 further comprising a fourth pipe which carries the low-pressure refrigerant into the evaporator, wherein the third pipe and the fourth pipe are individually provided.",
"7.The heat-exchanging device according to claim 1 further comprising a second pipe which carries the high-pressure refrigerant into the condenser, wherein the first pipe and the second pipe are independently provided.",
"8.The heat-exchanging device according to claim 1, wherein the component section includes at least one liquid tank which retains the high-pressure refrigerant between a part of the plurality of plates or via a part of the plates.",
"9.The heat-exchanging device according to claim 1, wherein the component section includes an intermediate heat-exchanger having a structure where a flow passage through which the high-pressure refrigerant flows and a flow passage through which a low-pressure refrigerant flows are stacked one on another between a part of the plurality of plates.",
"10.The heat-exchanging device according to claim 1, wherein the component section includes a subcool condenser having a structure where a flow passage through which the high-pressure refrigerant flows and a flow passage through which a heat carrier that further absorbs heat from the high-pressure refrigerant flows are stacked one on another between a part of the plurality of plates.",
"11.The heat-exchanging device according to claim 1, wherein the component section includes an evaporator having a structure where a flow passage through which a low-pressure refrigerant flows and a flow passage through which a heat carrier that applies heat to the low-pressure refrigerant flows are stacked one on another between a part of the plurality of plates."
],
[
"<SOH> BACKGROUND <EOH>"
],
[
"<SOH> SUMMARY <EOH>The heat-exchanging device of an aspect of the present disclosure has a plate-stacked section in which a plurality of plates is continuously stacked one on another.",
"The plate-stacked section includes a condenser and a component section.",
"The condenser has a structure where a refrigerant passage through which a high-pressure refrigerant flows and a heat-carrier passage through which a heat carrier that absorbs heat from the high-pressure refrigerant flows are stacked one on another between some plates of the plurality of plates.",
"The component section has a structure where the refrigerant that has passed through the condenser flows between some plates of the plurality of plates or via some plates.",
"In the condenser, openings respectively formed in the plurality of plates form a flow passage through which the refrigerant flows.",
"Inside the flow passage, a first pipe having an outer diameter smaller than the diameter of each of the openings is disposed.",
"The first pipe is disposed such that the refrigerant that has come into the condenser flows inside the flow passage but outside the first pipe and the refrigerant that has passed through the component section flows inside the first pipe.",
"According to the present disclosure, the heat-exchanging device formed of a plurality of plates stacked one on another enhances durability of the structure."
],
[
"CROSS-REFERENCE TO RELATED APPLICATIONS This application is a continuation of the PCT International Application No.",
"PCT/JP2016/003551 filed on Aug. 2, 2016, which claims the benefit of foreign priority of Japanese patent application No.",
"2015-155265 filed on Aug. 5, 2015, the contents all of which are incorporated herein by reference.",
"BACKGROUND 1.Technical Field The present disclosure relates to a heat-exchanging device.",
"2.Description of the Related Art A conventionally known heat-exchanging device, which is used for a heat-pump system, exchanges heat between a refrigerant and coolant.",
"For example, Japanese Patent Unexamined Publication No.",
"2013-119373 discloses a heat-exchanging device with a structure where a plate on which a refrigerant flows and a plate on which coolant flows are alternately stacked.",
"According to the heat-exchanging device, a plurality of components (such as a condenser, a liquid tank, and an evaporator) is formed into an integral structure, thereby eliminating piping between the components, by which the heat-exchanging device has a compact structure and is easily assembled.",
"SUMMARY The heat-exchanging device of an aspect of the present disclosure has a plate-stacked section in which a plurality of plates is continuously stacked one on another.",
"The plate-stacked section includes a condenser and a component section.",
"The condenser has a structure where a refrigerant passage through which a high-pressure refrigerant flows and a heat-carrier passage through which a heat carrier that absorbs heat from the high-pressure refrigerant flows are stacked one on another between some plates of the plurality of plates.",
"The component section has a structure where the refrigerant that has passed through the condenser flows between some plates of the plurality of plates or via some plates.",
"In the condenser, openings respectively formed in the plurality of plates form a flow passage through which the refrigerant flows.",
"Inside the flow passage, a first pipe having an outer diameter smaller than the diameter of each of the openings is disposed.",
"The first pipe is disposed such that the refrigerant that has come into the condenser flows inside the flow passage but outside the first pipe and the refrigerant that has passed through the component section flows inside the first pipe.",
"According to the present disclosure, the heat-exchanging device formed of a plurality of plates stacked one on another enhances durability of the structure.",
"BRIEF DESCRIPTION OF DRAWINGS FIG.",
"1 is a block diagram showing a structure of a heat pump system in accordance with a first exemplary embodiment.",
"FIG.",
"2 is a perspective view showing the structure of the heat-exchanging device in accordance with the first exemplary embodiment.",
"FIG.",
"3 is an exploded perspective view showing the structure of the heat-exchanging device in accordance with the first exemplary embodiment.",
"FIG.",
"4 is a schematic view illustrating an internal structure of the heat-exchanging device in accordance with the first exemplary embodiment.",
"FIG.",
"5 is a schematic view illustrating an internal structure of a heat-exchanging device in accordance with a second exemplary embodiment.",
"FIG.",
"6 is a block diagram showing a structure of a heat pump system in accordance with a third exemplary embodiment.",
"FIG.",
"7 is a schematic view illustrating an internal structure of the heat-exchanging device in accordance with the third exemplary embodiment.",
"FIG.",
"8 is a block diagram showing a structure of a heat pump system in accordance with a fourth exemplary embodiment.",
"FIG.",
"9 is a schematic view illustrating an internal structure of the heat-exchanging device in accordance with the fourth exemplary embodiment.",
"FIG.",
"10 is a schematic view illustrating an internal structure of a heat-exchanging device in accordance with a fifth exemplary embodiment.",
"FIG.",
"11 is a perspective view showing a structure of a heat-exchanging device in accordance with a sixth exemplary embodiment.",
"FIG.",
"12 is an exploded perspective view showing the structure of the heat-exchanging device in accordance with the sixth exemplary embodiment.",
"FIG.",
"13 is a schematic view showing an internal structure of the heat-exchanging device in accordance with the sixth exemplary embodiment.",
"FIG.",
"14 is a schematic view showing an internal structure of a heat-exchanging device in accordance with a seventh exemplary embodiment.",
"FIG.",
"15 is a schematic view showing an internal structure of a heat-exchanging device in accordance with an eighth exemplary embodiment.",
"FIG.",
"16 is a schematic view showing an internal structure of a heat-exchanging device in accordance with a ninth exemplary embodiment.",
"DETAILED DESCRIPTION OF PREFERRED EMBODIMENTS Prior to describing exemplary embodiments of the present disclosure, problems in the device of the related art are described briefly.",
"In the heat-exchanging device of a stacked structure formed of a plurality of plates, the following flow passages are formed: a flow passage through which a refrigerant flows in the vertically downward direction; a flow passage through which the refrigerant flows in the vertically upward direction; a flow passage through which coolant flows in the vertically downward direction; and a flow passage through which the coolant flows in the vertically upward direction.",
"Each of these flow passages is formed of a plurality of openings overlapped with each other and respectively formed in an end section of each plate.",
"However, forming a plurality of openings lowers the strength of the plates, degrading durability of the heat-exchanging device.",
"The present disclosure targets on enhancing the durability of a heat-exchanging device of a stacked structure formed of a plurality of plates.",
"Hereinafter, an exemplary embodiment of the present disclosure is described in detail with reference to accompanying drawings.",
"First Exemplary Embodiment Hereinafter, a first exemplary embodiment according to the present disclosure is described.",
"First, a structure of heat pump system 10 of the embodiment is described with reference to FIG.",
"1.FIG.",
"1 is a block diagram showing the structure of heat pump system 10 of the embodiment.",
"Heat pump system 10 has condenser 110, liquid tank 120 (as an example of the component section), expansion valve 20, evaporator 130, and compressor 30.In heat pump system 10 shown in FIG.",
"1, heat-exchanging device 100 has an all-in-one structure, having condenser 110 and liquid tank 120 integrally.",
"Compressor 30 is disposed on the upstream side of an inlet for the refrigerant of condenser 110.Compressor 30 compresses the refrigerant sucked from evaporator 130 to change it into a high-temperature and high-pressure refrigerant and then feeds the refrigerant to condenser 110.Condenser 110 performs heat exchange between coolant and the high-temperature and high-pressure refrigerant from compressor 30 to condense the refrigerant.",
"The coolant is an anti-freezing solution for transferring heat, such as LLC (Long Life Coolant).",
"Liquid tank 120 retains the refrigerant fed from condenser 110, performs vapor-liquid separation on the refrigerant, and controls the amount of the refrigerant.",
"Expansion valve 20 is disposed on the upstream side of an inlet for the refrigerant of evaporator 130.Expansion valve 20 expands the refrigerant received from liquid tank 120 to change it into a low-temperature and low-pressure refrigerant and then feeds it to evaporator 130.Evaporator 130 is disposed on the downstream side of expansion valve 20 and on the upstream side of compressor 30.Evaporator 130 performs heat exchange between the refrigerant fed from expansion valve 20 and the coolant to evaporate the refrigerant and then feeds the refrigerant to compressor 30.Heat pump system 10 has the structure above.",
"Next, the structure of heat-exchanging device 100 of the embodiment is described with reference to FIG.",
"2 through FIG.",
"4.FIG.",
"2 is a perspective view showing the structure of heat-exchanging device 100 used for heat pump system 10 shown in FIG.",
"1.FIG.",
"2 shows a cross section of pipe 3.FIG.",
"3 is a perspective view showing a disassembled state of a plurality of plates forming heat-exchanging device 100 of FIG.",
"2.FIG.",
"4 is a cross-sectional view showing the structure of heat-exchanging device 100 of FIG.",
"2.FIG.",
"4 also shows flowing directions of the refrigerant and the coolant in heat-exchanging device 100.Apart of each plate is omitted in FIG.",
"4.As shown in FIG.",
"2 and FIG.",
"3, heat-exchanging device 100 has a plate-stacked section formed of a plurality of plates continuously stacked one on another.",
"Each of condenser 110 and liquid tank 120 is formed of some plates of the plurality of plates of the plate-stacked section.",
"Specifically, condenser 110 is formed of condenser plates 111 through 113, and liquid tank 120 is formed of liquid-tank plates 121, 122.The plurality of plates above is substantially equal in dimension in the stacking direction.",
"That is, in heat-exchanging device 100, each of condenser plates 111 through 113 and each of liquid-tank plates 121, 122 are substantially equal in dimension in the stacking direction.",
"In addition, the plurality of plates above is equal in size and in outer shape.",
"For example, each of condenser plates 111 through 113 is equal to each of liquid-tank plates 121, 122 in profile line and dimensions orthographically projected on a plane perpendicular to the stacking direction.",
"In heat-exchanging device 100, as shown in FIG.",
"2 through FIG.",
"4, pipe 1 and pipe 2 are connected to condenser plate 111.Pipe 1 feeds the coolant into condenser 110 and pipe 2 discharges the coolant having undergone heat exchange in condenser 110.In heat-exchanging device 100, as shown in FIG.",
"2 through FIG.",
"4, pipe 3 is connected to condenser plate 111.Pipe 3 feeds high-temperature and high-pressure refrigerant compressed by compressor 30 into condenser 110.After heat exchange in condenser 110, the refrigerant undergoes vapor-liquid separation by liquid tank 120.Pipe 3 discharges the refrigerant after the vapor-liquid separation to expansion valve 20.As shown in FIG.",
"2 through FIG.",
"4, pipe 3 has a double-pipe structure of outer-side pipe (hereinafter, outer pipe) 31 and inner-side pipe (hereinafter, inner pipe) 32.Outer pipe 31 is connected to opening ‘d’ of condenser plate 112.Inner pipe 32 is connected to openings ‘f’ of liquid-tank plates 121.Inner pipe 32 is connected to openings ‘f’ of liquid-tank plates 121.Inner pipe 32 runs through the inside of outer pipe 31 and protrudes from a side surface of outer pipe 31.Outer pipe 31 carries high-temperature and high-pressure refrigerant compressed by compressor 30 into condenser 110.After heat exchange in condenser 110, the refrigerant undergoes vapor-liquid separation by liquid tank 120.Inner pipe 32 discharges the refrigerant after the vapor-liquid separation to expansion valve 20.Next, the structure of condenser 110 of the embodiment is described.",
"As shown in FIG.",
"3, condenser 110 has condenser plates 111 through 113 stacked one on another.",
"Under condenser plate 111 to which pipes 1 through 3 are connected, condenser plate 112 and condenser plate 113, which are different in shape, are alternately stacked.",
"Condenser plate 112 is provided with openings ‘a’ through ‘d’ at its four corners.",
"Bump section A is disposed around each of openings ‘b’ and ‘c’.",
"Condenser plate 113 is provided with openings ‘a’ through ‘d’ at its four corners.",
"Bump section A is disposed around each of openings ‘a’ and ‘d’.",
"The alternately stacked structure of condenser plates 112, 113 alternately forms, between condenser plates 111 through 113, a refrigerant passage through which a high-pressure refrigerant flows and a coolant passage through which coolant for absorbing heat from the high-pressure refrigerant flows.",
"The refrigerant and the coolant, without being mixed, flow through the refrigerant passage and the coolant passage, respectively.",
"The refrigerant and the coolant flow the refrigerant passage and the coolant passage, respectively, in opposite directions from each other.",
"In FIG.",
"3, the broken-line arrow shows the flowing direction of the refrigerant, and the solid-line arrow shows the flowing direction of the coolant.",
"In condenser 110, as described above, the refrigerant flows through the refrigerant passage and the coolant flows through the coolant passage, thereby the refrigerant and the coolant exchange heat therebetween, and the refrigerant is condensed.",
"In addition, the alternately stacked structure of condenser plates 112, 113 allows openings ‘a’ through ‘d’ to form the following flow passages.",
"A plurality of openings ‘b’ forms a flow passage through which the coolant coming from pipe 1 flows through condenser 110 in the vertically downward direction.",
"A plurality of openings ‘c’ forms a flow passage in which coolant that has passed the coolant passage flows through condenser 110 in the vertically upward direction.",
"After that, the coolant is discharged from pipe 2.A plurality of openings ‘a’ forms a flow passage in which refrigerant that has passed the refrigerant passage flows through condenser 110 in the vertically downward direction.",
"The flow passage joins a flow passage formed of openings ‘e’ of liquid tank plates 121 (which will be described later).",
"With the structure above, the refrigerant that has passed the refrigerant passage flows into liquid tank 120.A plurality of openings ‘d’ forms flow passage P in which the refrigerant flows through condenser 110.In flow passage P, as shown in FIG.",
"2, inner pipe 32 having an outer diameter smaller than the diameter of opening ‘d’ (substantially the same as the inner diameter of outer pipe 31) is disposed.",
"That is, flow passage P has a double-passage structure: one is the flow passage that runs inside flow passage P but outside inner pipe 32; and the other is the flow passage that runs inside inner pipe 32.The flow passage, which runs inside flow passage P but outside inner pipe 32, serves as the flow passage in which the refrigerant fed from outer pipe 31 flows through condenser 110 in the vertically downward direction.",
"The flow passage inside inner pipe 32 serves as the flow passage in which the refrigerant that has passed liquid tank 120 flows through condenser 110 in the vertically upward direction.",
"At the design phase of heat-exchanging device 100, the number of alternately stacked condenser plates 112, 113 determines the volume (efficiency in heat exchange) of condenser 110.FIG.",
"3 and FIG.",
"4 show an example where the refrigerant and the coolant flow the refrigerant passage and the coolant passage, respectively, in opposite directions from each other, but it is not limited to; the refrigerant and the coolant may flow the refrigerant passage and the coolant passage, respectively, in the same direction.",
"Next, the structure of liquid tank 120 of the embodiment is described.",
"As shown in FIG.",
"3, liquid tank 120 has a plurality of liquid-tank plates 121 stacked one on another.",
"At the bottom of liquid tank 120, liquid-tank plate 122 is disposed.",
"Each of the plurality of liquid-tank plates 121 is substantially equal to liquid-tank plate 122 in dimension in the stacking direction.",
"Each of liquid-tank plates 121, 122 and each of condenser plates 111 through 113 are substantially equal in dimension in the stacking direction.",
"In addition, each of the plurality of liquid-tank plates 121 is substantially equal to liquid-tank plate 122 in size and in outer shape.",
"Each of liquid-tank plates 121 and liquid-tank plate 122 are equal to each of condenser plates 111 through 113 in profile line and dimensions orthographically projected on a plane perpendicular to the stacking direction.",
"The plurality of liquid-tank plates 121 is continuously stacked together with and to be contact with the plurality of condenser plates 111 through 113.As shown in FIG.",
"2, liquid tank 120 is disposed under condenser 110.Between adjacent two of the plurality of liquid-tank plates 121, the refrigerant passage in which the refrigerant fed from condenser 110 flows is formed.",
"As shown in FIG.",
"3, each of liquid-tank plates 121 has openings ‘e’, ‘f’ in two of the four corners.",
"Opening ‘e’ is so formed that meets with the position of openings ‘a’ of condenser plates 112, 113.The diameter of opening ‘e’ is the same with that of opening ‘a’.",
"Opening ‘f’ is so formed that meets with the position of openings ‘d’ of condenser plates 112, 113.The diameter of opening ‘f’ is the same with the inner diameter of inner pipe 32.Openings ‘e’, ‘f’ are not formed in liquid-tank plate 122.The stacked structure of the plurality of liquid-tank plates 121 forms the following flow passages.",
"A plurality of openings ‘e’ forms the flow passage in which the refrigerant fed from condenser 110 flows through liquid tank 120 in the vertically downward direction.",
"The flow passage, as described above, joins the flow passage formed of the plurality of openings ‘a’.",
"A plurality of openings ‘f’ forms the flow passage in which the refrigerant that has passed liquid tank 120 (i.e., the refrigerant passage between liquid-tank plates 121) flows through liquid tank 120 in the vertically upward direction.",
"This flow passage joins the flow passage inside inner pipe 32, thereby the refrigerant that has passed liquid tank 120 is discharged from inner pipe 32 to expansion vale 20.At the design phase of heat-exchanging device 100, the number of alternately stacked liquid-tank plates 121 determines the volume (capacity) of liquid tank 120.Heat-exchanging device 100 is thus structured.",
"In heat-exchanging device 100 with the structure above, the coolant and the refrigerant flow as follows.",
"As shown in FIG.",
"4, the coolant fed from pipe 1 passes through condenser 110 and is discharged from pipe 2.As shown in FIG.",
"4, the refrigerant, which has flown into outer pipe 31, flows through the inside of outer pipe 31 but the outside of inner pipe 32.After passing through condenser 110 and liquid tank 120, the refrigerant flows inside inner pipe 32 and is discharged from inner pipe 32 into expansion valve 20.As described above, according to heat-exchanging device 100 of the embodiment, condenser 110 has flow passage P formed of a plurality of openings ‘d’ respectively formed in the plurality of condenser plates 111 through 113.A high-pressure refrigerant flows through flow passage P. Inside flow passage P, inner pipe 32 (as an example of the first pipe) having an outer diameter smaller than the diameter of opening ‘d’ is disposed.",
"Inner pipe 32 is structured such that the refrigerant that has flown into condenser 110 flows inside flow passage P but outside inner pipe 32; at the same time, the refrigerant that has passed liquid tank 120 flows inside inner pipe 32.In general, a heat-exchanging device having a condenser and a liquid tank has the following flow passages for refrigerant: a flow passage in which the refrigerant fed from the compressor flows through the condenser in the vertically downward direction; a flow passage in which the refrigerant that has passed the refrigerant passage of the condenser flows through the condenser and the liquid tank in the vertically downward direction; and a flow passage in which the refrigerant that has passed the refrigerant passage of the liquid tank flows through the condenser in the vertically upward direction.",
"To form the three flow passages above, each plate has to be provided with three openings.",
"In contrast, according to the embodiment, inner pipe 32 is disposed in flow passage P formed of openings ‘d’.",
"With the above structure, the refrigerant fed from the compressor flows inside flow passage P but outside inner pipe 32, and the refrigerant that has passed the refrigerant passage of the liquid tank flows inside inner pipe 32.The structure of the embodiment allows the openings, which are to be formed in each plate for forming the refrigerant passages, to be decreased to two: openings ‘a’ and ‘d’ for condenser plates 111 through 113; and openings ‘e’ and ‘f’ for liquid-tank plates 121.According to the embodiment, the openings in each plate can be decreased in number, thereby ensuring strength of the plates.",
"That is, the structure enhances durability of the heat-exchanging device.",
"As described above, the structure of the embodiment achieves decrease in number of the openings to be formed in each plate.",
"When each opening is disposed in the short-side direction of the plate, as shown in FIG.",
"2 and FIG.",
"3, the structure allows the plate to have a decreased length of the short side, contributing to a downsized structure of a heat-exchanging device.",
"Second Exemplary Embodiment A second exemplary embodiment of the present disclosure is now described.",
"The description of the first exemplary embodiment shows an example of a heat-exchanging device having the condenser and the liquid tank.",
"The heat-exchanging device may further include an evaporator.",
"The embodiment describes heat-exchanging device 101 having condenser 110, liquid tank 120, and evaporator 130 (as an example of the component section) in heat pump system 10 shown in FIG.",
"1.The structure of heat-exchanging device 101 of the embodiment is described with reference to FIG.",
"5.FIG.",
"5 is a cross-sectional view showing the structure of heat-exchanging device 101 of the embodiment.",
"FIG.",
"5 also shows a flowing direction of refrigerant and coolant in heat-exchanging device 101.Apart of each plate is omitted in FIG.",
"5.In FIG.",
"5, like parts are identified by the same reference marks as in FIG.",
"4, and the detailed description thereof is omitted.",
"As shown in FIG.",
"5, condenser 110 and liquid tank 120 in heat-exchanging device 101 are the same with the structure in the first exemplary embodiment.",
"As shown in FIG.",
"5, heat-exchanging device 101 has evaporator 130 under liquid tank 120.Evaporator 130 is formed of a plurality of evaporator plates 131 stacked one on another.",
"Evaporator plates 131 are substantially equal in dimension in the stacking direction, and they are equal in size and in outer shape.",
"Each of evaporator plates 131 is substantially equal to each of condenser plates 111 through 113 and each of liquid-tank plates 121, 122 in dimension in the stacking direction.",
"In addition, each of evaporator plates 131 is substantially equal to each of condenser plates 111 through 113 and each of liquid-tank plates 121, 122 in profile line and dimensions orthographically projected on a plane perpendicular to the stacking direction.",
"As shown in FIG.",
"5, pipe 4 and pipe 5 are connected to the lowermost one of evaporator plates 131.Pipe 4 carries the coolant into evaporator 130 and pipe 5 discharges the coolant that has undergone heat exchange in evaporator 130.Further, pipe 6 and pipe 7 are connected to the lowermost one of evaporator plates 131.Pipe 6 carries the low-temperature and low-pressure refrigerant that has been expanded at expansion valve 20 into evaporator 130.Pipe 7 discharges the refrigerant that has undergone heat exchange in evaporator 130 into compressor 30.The plurality of evaporator plates 131 is continuously stacked (with no space) under the plurality of condenser plates 111 through 113 and the plurality of liquid-tank plates 121, 122.Thus, evaporator 130 is disposed under liquid tank 120.In evaporator 130, between adjacent two of the plurality of evaporator plates 131 stacked one on another, a refrigerant passage through which a low-pressure refrigerant flows and a coolant passage through which coolant that provides the low-pressure refrigerant with heat flows are stacked one on another.",
"To be specific, differently-shaped evaporator plates 131 (for example, one is the same in shape with condenser plate 112, and the other is the same in shape with condenser plate 113) are alternately stacked.",
"This allows the refrigerant passages and the coolant passages to be alternately formed between the plurality of evaporator plates 131.By virtue of the structure, the refrigerant and the coolant, without being mixed, flow the refrigerant passage and the coolant passage, respectively.",
"The refrigerant and the coolant pass through the refrigerant passage and the coolant passage, respectively, in opposite directions from each other.",
"In evaporator 130, as described above, the refrigerant flows through the refrigerant passage and the coolant flows through the coolant passage, thereby the refrigerant and the coolant exchange heat therebetween, and the refrigerant is evaporated.",
"At the design phase of heat-exchanging device 101, the number of differently-shaped evaporator plates 131 alternately stacked one on another determines the volume (efficiency in heat exchange) of evaporator 130.FIG.",
"5 shows an example where the refrigerant and the coolant flow the refrigerant passage and the coolant passage, respectively, in opposite directions from each other, but it is not limited to; the refrigerant and the coolant may flow the refrigerant passage and the coolant passage, respectively, in the same direction.",
"Heat-exchanging device 101 is thus structured.",
"In heat-exchanging device 101 with the structure above, the coolant and the refrigerant flow as follows.",
"As shown in FIG.",
"5, the coolant fed from pipe 1 passes through condenser 110 and is discharged from pipe 2.As shown in FIG.",
"5, the refrigerant, which has flown into outer pipe 31, flows through the inside of outer pipe 31 but the outside of inner pipe 32.After passing through condenser 110 and liquid tank 120, the refrigerant flows through the inside of inner pipe 32 and is discharged into expansion valve 20.In addition, as shown in FIG.",
"5, the coolant fed from pipe 4 passes through evaporator 130 and is discharged from pipe 5.As shown in FIG.",
"5, the refrigerant fed from pipe 6 passes through evaporator 130 and is discharged from pipe 7 into compressor 130.Heat-exchanging device 101 of the embodiment, as described above, has condenser 110, liquid tank 120, and evaporator 130.Such structured heat-exchanging device 101 of the embodiment produces the effect similar to the structure described in the first exemplary embodiment.",
"Third Exemplary Embodiment A third exemplary embodiment of the present disclosure is described.",
"The description of the second exemplary embodiment shows an example of the heat-exchanging device including the condenser, the liquid tank, and the evaporator.",
"The heat-exchanging device may further include an intermediate heat-exchanger (IHX).",
"The embodiment describes heat-exchanging device 102 including condenser 110, liquid tank 120, evaporator 130, and intermediate heat-exchanger 140 (as an example of the component section).",
"First, the structure of heat pump system 10a of the embodiment is described with reference to FIG.",
"6.FIG.",
"6 is a block diagram showing the structure of heat pump system 10a of the embodiment.",
"In FIG.",
"6, like parts are identified by the same reference marks as in FIG.",
"1, and the detailed description thereof is omitted.",
"Heat pump system 10a has heat-exchanging device 102, expansion valve 20, and compressor 30.Heat-exchanging device 102 has condenser 110, liquid tank 120, evaporator 130, and intermediate heat-exchanger 140.Intermediate heat-exchanger 140 performs heat exchange between a high-temperature and high-pressure refrigerant fed from condenser 110 via liquid tank 120 (shown by the broken line) and a low-temperature and low-pressure refrigerant fed from expansion valve 20 (shown by the dashed-dotted line).",
"After the heat exchange in intermediate heat-exchanger 140, the refrigerant that has been fed from condenser 110 via liquid tank 120 is discharged to expansion valve 20.Meanwhile, the refrigerant that has been fed from expansion valve 20 joins with the heat-exchanged refrigerant at evaporator 130 and is sucked into compressor 30.In this way, intermediate heat-exchanger 140 performs heat exchange between the high-temperature and high-pressure refrigerant fed from condenser 110 via liquid tank 120 and the low-temperature and low-pressure refrigerant fed from expansion valve 20.Heat pump system 10a of the embodiment is thus structured.",
"Next, the structure of heat-exchanging device 102 of the embodiment will be described with reference to FIG.",
"7.FIG.",
"7 is a cross-sectional view showing the structure of heat-exchanging device 102 of the embodiment.",
"FIG.",
"7 also shows flowing directions of the refrigerant and the coolant in heat-exchanging device 102.Apart of each plate is omitted in FIG.",
"7.In FIG.",
"7, like parts are identified by the same reference marks as in FIG.",
"5, and the detailed description thereof is omitted.",
"The structure of FIG.",
"7 differs from the structure of FIG.",
"5 in the followings: pipe 1 for feeding the coolant (coolant-IN) is oppositely disposed from pipe 2 for discharging the coolant (coolant-OUT) and pipe 3 for feeding and discharging the refrigerant (refrigerant-IN/OUT): pipe 4 for feeding the coolant (coolant-IN) is oppositely disposed from pipe 5 for discharging the coolant (coolant-OUT); and pipe 6 for feeding the refrigerant (refrigerant-IN) is oppositely disposed from pipe 7 for discharging the refrigerant (refrigerant-OUT).",
"As shown in FIG.",
"7, heat-exchanging device 102 has intermediate heat-exchanger 140 disposed at a position lower than liquid tank 120 and higher than evaporator 130.Intermediate heat-exchanger 140 is formed of a plurality of IHX plates 141 stacked one on another.",
"The plurality of IHX plates 141 is substantially equal in dimension in the stacking direction and is equal in size and in outer shape.",
"Each of the plurality of IHX plates 141 is substantially equal to each of condenser plates 111 through 113, each of liquid-tank plates 121, and each of evaporator plates 131 in dimension in the stacking direction.",
"In addition, each of the plurality of IHX plates 141 is substantially equal to each of condenser plates 111 through 113, each of liquid-tank plates 121, 122, and each of evaporator plates 131 in profile line and dimensions orthographically projected on a plane perpendicular to the stacking direction.",
"The plurality of IHX plates 141 is continuously stacked with the plurality of condenser plates 111 through 113 and the plurality of liquid-tank plates 121, so that intermediate heat-exchanger 140 is located under liquid tank 120.Liquid tank 120 of the embodiment has no liquid-tank plate 122 shown in FIG.",
"3 at the bottom.",
"Similarly, the plurality of evaporator plates 131 is continuously stacked with the plurality of condenser plates 111 through 113, the plurality of liquid-tank plates 121, and the plurality of IHX plates 141, so that evaporator 130 is located under intermediate heat-exchanger 140.Intermediate heat-exchanger 140 is structured such that first refrigerant-passages each in which a high-pressure refrigerant fed from condenser 110 flows and second refrigerant-passages each in which a low-pressure refrigerant fed from expansion valve 20 flows are disposed between the plurality of IHX plates 141 stacked one on another.",
"Specifically, differently-shaped IHX plates 141 (for example, one is equal to condenser plate 112 in shape, and the other is equal to condenser plate 113 in shape) are alternately stacked, thereby the first refrigerant-passages and the second refrigerant-passages are alternately formed between the plurality of IHX plates 141.The refrigerant coming from condenser 110 and the refrigerant coming from expansion valve 20, without being mixed, pass through the first refrigerant-passage and the second refrigerant-passage, respectively.",
"In addition, the refrigerant coming from condenser 110 and the refrigerant coming from expansion valve 20 pass through the first refrigerant-passage and the second refrigerant-passage, respectively, in opposite directions from each other.",
"In intermediate heat-exchanger 140, as described above, the refrigerant fed from condenser 110 flows through the first refrigerant-passage and the refrigerant fed from expansion valve 20 flows through the second refrigerant-passage, thus the high-pressure refrigerant and the low-pressure refrigerant exchange heat therebetween.",
"As shown in FIG.",
"7, inner pipe 32 of the embodiment is connected to the opening where liquid tank 120 communicates with intermediate heat-exchanger 140 in liquid-tank plates 121.The structure allows the refrigerant that has passed the first refrigerant-passage of intermediate heat-exchanger 140 to be discharged from inner pipe 32 to expansion valve 20.Meanwhile, the refrigerant that has passed the second refrigerant-passage of intermediate heat-exchanger 140 joins the refrigerant coming from evaporator 130 and is discharged from pipe 7 to compressor 30.At the design phase of heat-exchanging device 102, the number of differently-shaped IHX plates 141 to be alternately stacked determines the volume (efficiency in heat exchange) of intermediate heat-exchanger 140.FIG.",
"7 shows an example where the refrigerant and the coolant flow the refrigerant passage and the coolant passage, respectively, in opposite directions from each other, but it is not limited to; the refrigerant and the coolant may flow the refrigerant passage and the coolant passage, respectively, in the same direction.",
"Similarly, FIG.",
"7 shows an example where the refrigerant from condenser 110 and the refrigerant from expansion valve 20 pass through the first refrigerant-passage and the second refrigerant-passage, respectively, in opposite directions from each other, but it is not limited to; the refrigerant from condenser 110 and the refrigerant from expansion valve 20 may pass through the first refrigerant-passage and the second refrigerant-passage, respectively, in the same direction.",
"Heat-exchanging deice 102 is thus structured.",
"In heat-exchanging device 102 with the structure above, the coolant and the refrigerant flow as follows.",
"As shown in FIG.",
"7, the coolant fed from pipe 1 passes through condenser 110 and is discharged from pipe 2.As shown in FIG.",
"7, the refrigerant, which has flown into outer pipe 31, flows through the inside of outer pipe 31 but the outside of inner pipe 32.After passing through condenser 110, the refrigerant branches into liquid tank 120 and intermediate heat-exchanger 140.The refrigerant that has passed intermediate heat-exchanger 140 flows through the inside of inner pipe 32 and is discharged from inner pipe 32 into expansion valve 20.Besides, as shown in FIG.",
"7, the coolant fed from pipe 4 passes through evaporator 130 and is discharged from pipe 5.As shown in FIG.",
"7, the refrigerant fed from pipe 6 branches into evaporator 130 and intermediate heat-exchanger 140.The refrigerant that has passed evaporator 130 and the refrigerant that has passed intermediate heat-exchanger 140 join again, and it is discharged from pipe 7 to compressor 30.Heat-exchanging device 102 of the embodiment, as described above, has condenser 110, liquid tank 120, evaporator 130, and intermediate heat-exchanger 140.Such structured heat-exchanging device 102 of the embodiment produces the effect similar to the structure described in the first exemplary embodiment.",
"Fourth Exemplary Embodiment A fourth exemplary embodiment of the present disclosure is described.",
"Although the third exemplary embodiment has described an example of a parallel structure where the refrigerant fed from the expansion valve branches in parallel into the intermediate heat-exchanger and the evaporator, the refrigerant from the expansion valve may flow into the intermediate heat-exchanger via the evaporator in series.",
"The exemplary embodiment describes heat-exchanging device 103 with such a series structure in which the refrigerant fed from the expansion valve passes through the evaporator and flows into the intermediate heat-exchanger.",
"First, the structure of heat pump system 10b of the embodiment is described with reference to FIG.",
"8.FIG.",
"8 is a block diagram showing the structure of heat pump system 10b of the embodiment.",
"In FIG.",
"8, like parts are identified by the same reference marks as in FIG.",
"6, and the detailed description thereof is omitted.",
"Intermediate heat-exchanger 140 performs heat exchange between a high-temperature and high-pressure refrigerant fed from condenser 110 via liquid tank 120 (shown by the broken line) and low-temperature and a low-pressure refrigerant fed from evaporator 130 (shown by the dashed-dotted line).",
"After the heat exchange in intermediate heat-exchanger 140, the refrigerant fed from condenser 110 via liquid tank 120 is discharged to expansion valve 20.Meanwhile, the refrigerant fed from evaporator 130 is sucked into compressor 30.In this way, intermediate heat-exchanger 140 performs heat exchange between the high-temperature and high-pressure refrigerant fed from condenser 110 and the low-temperature and low-pressure refrigerant fed from expansion valve 20.Heat pump system 10b of the embodiment is thus structured.",
"Next, the structure of heat-exchanging device 103 of the embodiment is described with reference to FIG.",
"9.FIG.",
"9 is a cross-sectional view showing the structure of heat-exchanging device 103 of the embodiment.",
"FIG.",
"9 also shows flowing directions of the refrigerant and the coolant in heat-exchanging device 103.Apart of each plate is omitted in FIG.",
"9.In FIG.",
"9, like parts are identified by the same reference marks as in FIG.",
"7, and the detailed description thereof is omitted.",
"As shown in FIG.",
"9, pipe 4 for refrigerant-IN, pipe 5 for coolant-OUT, and pipe 8 for refrigerant-IN/OUT are connected to the lowermost plate of evaporator plates 131 of evaporator 130.Like pipe 3, pipe 8 has a double-pipe structure of outer pipe 81 and inner pipe 82.The inner diameter of outer pipe 81 is greater than the outer diameter of inner pipe 82.Inner pipe 82 is connected to the openings formed in IHX plates 141.The openings connect intermediate heat-exchanger 140 with evaporator 130.Inner pipe 82 runs through the inside of outer pipe 81 and protrudes from a side surface of outer pipe 81.Outer pipe 81 carries the low-temperature and low-pressure refrigerant expanded by expansion valve 20 into evaporator 130.Inner pipe 82 discharges the refrigerant having undergone heat exchange in intermediate heat-exchanger 140 to compressor 30.As shown in FIG.",
"9, the part that is the inside of outer pipe 81 but is the outside of inner pipe 82 serves as a flow passage in which the refrigerant that has flown into evaporator 130 flows through evaporator 130 in the vertically upward direction.",
"As shown in FIG.",
"9, the inside of inner pipe 82 serves as a flow passage in which the refrigerant that has passed intermediate heat-exchanger 140 flows through evaporator 130 in the vertically downward direction.",
"Heat-exchanging device 103 is thus structured.",
"In heat-exchanging device 103 with the structure above, the coolant and the refrigerant flow as follows.",
"As shown in FIG.",
"9, the coolant fed from pipe 1 passes through condenser 110 and is discharged from pipe 2.As shown in FIG.",
"9, the refrigerant, which has flown from outer pipe 31, flows through the inside of outer pipe 31 but the outside of inner pipe 32.After passing through condenser 110, the refrigerant branches into liquid tank 120 and intermediate heat-exchanger 140.The refrigerant that has passed through intermediate heat-exchanger 140 flows through the inside of inner pipe 32 and is discharged from pipe 32 to expansion valve 20.As shown in FIG.",
"9, the coolant fed from pipe 4 passes through evaporator 130 and is discharged from pipe 5.As shown in FIG.",
"9, the refrigerant fed from outer pipe 81 runs through the inside of outer pipe 81 but the outside of inner pipe 82.After passing through evaporator 130, the refrigerant flows into intermediate heat-exchanger 140.After passing through intermediate heat-exchanger 140, the refrigerant flows through the inside of inner pipe 82 and is discharged from inner pipe 82 to compressor 130.Heat-exchanging device 103 of the embodiment, as described above, has condenser 110, liquid tank 120, evaporator 130, and intermediate heat-exchanger 140.Such structured heat-exchanging device 103 of the embodiment produces the effect similar to the structure described in the first exemplary embodiment.",
"Fifth Exemplary Embodiment A fifth exemplary embodiment according to the present disclosure is described.",
"Although the first exemplary embodiment described an example of a heat-exchanging device having a condenser and a liquid tank, the heat-exchanging device may include a subcool condenser.",
"The embodiment describes heat-exchanging device 104 having condenser 110, liquid tank 120, and subcool condenser 150 (as an example of the component section).",
"The structure of heat-exchanging device 104 of the embodiment is described with reference to FIG.",
"10.FIG.",
"10 is a cross-sectional view showing the structure of heat-exchanging device 104 of the embodiment.",
"FIG.",
"10 also shows flowing directions of the refrigerant and the coolant in heat-exchanging device 104.Apart of each plate is omitted in FIG.",
"10.In FIG.",
"10, like parts are identified by the same reference marks as in FIG.",
"4, and the detailed description thereof is omitted.",
"The structure of FIG.",
"10 differs from that of FIG.",
"4 in that pipe 1 for coolant-IN is oppositely disposed from pipe 2 for coolant-OUT and pipe 3 for refrigerant-IN/OUT.",
"As shown in FIG.",
"10, heat-exchanging device 104 has subcool condenser 150 under liquid tank 120.Subcool condenser 150 is formed of a plurality of subcool-condenser plates 151 stacked one on another.",
"Subcool-condenser plates 151 are substantially equal in dimension in the stacking direction and are equal in size and in outer shape.",
"Each of the plurality of subcool-condenser plates 151 is substantially equal to each of condenser plates 111 through 113 and each of liquid-tank plates 121 in dimensions in the stacking direction.",
"In addition, each of the plurality of subcool-condenser plates 151 is equal to each of condenser plates 111 through 113 and each of liquid-tank plates 121 in profile line and dimensions orthographically projected on a plane perpendicular to the stacking direction.",
"The plurality of subcool-condenser plates 151 is continuously stacked with the plurality of condenser plates 111 through 113 and the plurality of liquid-tank plates 121.That is, subcool condenser 150 is located under liquid tank plates 121.Liquid tank 120 of the embodiment has no liquid-tank plate 122 shown in FIG.",
"3 at the bottom.",
"In subcool condenser 150, a refrigerant passage through which the low-pressure refrigerant flows and a coolant passage through which the coolant that applies the low-pressure refrigerant with heat flows are disposed between the plurality of subcool-condenser plates 151 of the stacked structure.",
"Specifically, differently-shaped subcool-condenser plates 151 (for example, one is equal to condenser plate 112 in shape, and the other is equal to condenser plate 113 in shape) are alternately stacked, thereby the refrigerant passage and the coolant passage are alternately formed between the plurality of subcool-condenser plates 151.The refrigerant and the coolant, without being mixed, pass through the refrigerant passage and the refrigerant passage, respectively, in the same direction.",
"In subcool condenser 150, as described above, the refrigerant flows through the refrigerant passage and the coolant flows through the coolant passage, thus the refrigerant and the coolant exchange heat therebetween, and the refrigerant is further compressed.",
"At the design phase of heat-exchanging device 104, the number of alternately stacked subcool-condenser plates 151 of a different shape determines the volume (efficiency in heat exchange) of subcool condenser 150.FIG.",
"10 shows an example where the refrigerant and the coolant flow the refrigerant passage and the coolant passage, respectively, in the same direction, but it is not limited to; the refrigerant and the coolant may flow the refrigerant passage and the coolant passage, respectively, in opposite directions from each other.",
"Heat-exchanging device 104 of the embodiment is thus structured.",
"In heat-exchanging device 104 with the structure above, the coolant and the refrigerant flow as follows.",
"As shown in FIG.",
"10, the coolant fed from pipe 1 branches into condenser 110 and subcool condenser 150.The coolant that has passed through condenser 110 and the coolant that has passed through subcool condenser 150 join together and the joined coolant is discharged from pipe 2.As shown in FIG.",
"10, the refrigerant, which has flown from outer pipe 31, flows through the inside of outer pipe 31 but the outside of inner pipe 32.After passing through condenser 110, the refrigerant branches into liquid tank 120 and subcool condenser 150.The refrigerant that has passed through subcool condenser 150 flows through the inside of inner pipe 32 and is discharged from pipe 32.Heat-exchanging device 104 of the embodiment, as described above, has condenser 110, liquid tank 120, and subcool condenser 150.Such structured heat-exchanging device 104 of the embodiment produces the effect similar to the structure described in the first exemplary embodiment.",
"The descriptions above are on heat-exchanging devices 100 through 104 in which the pipe for refrigerant-IN and the pipe for refrigerant-OUT are integrally formed.",
"In contrast, the descriptions hereinafter are on heat-exchanging devices 200, 202, and 203 in which a pipe for refrigerant-IN and a pipe for refrigerant-OUT are individually formed.",
"Sixth Exemplary Embodiment A sixth exemplary embodiment of the present disclosure is described.",
"The structure of heat-exchanging device 200 of the embodiment is described with reference to FIG.",
"11 though FIG.",
"13.FIG.",
"11 is a perspective view showing the structure of heat-exchanging device 200.FIG.",
"11 also shows a cross section of pipe 12.FIG.",
"12 is a perspective view showing the state where the plurality of plates forming heat-exchanging device 200 of FIG.",
"11 is disassembled.",
"FIG.",
"13 is a cross-sectional view showing the structure of heat-exchanging device 200 of FIG.",
"11.FIG.",
"13 also shows flowing directions of refrigerant and coolant in heat-exchanging device 200.A part of each plate is omitted in FIG.",
"13.In FIGS.",
"11 to 13, like parts are identified by the same reference marks as in FIGS.",
"2 to 4, respectively, and the detailed description thereof is omitted.",
"As shown in FIG.",
"11 through FIG.",
"13, in heat-exchanging device 200, liquid tank 120a (as an example of the component section) and liquid tank 120b (as an example of the component section) are disposed under condenser 110.Liquid tank 120a is formed of a plurality of liquid-tank plates 121 stacked one on another.",
"Liquid tank 120b, which is also formed of a plurality of liquid-tank plates 121 stacked one on another, has liquid-tank plate 122 at the bottom.",
"As shown in FIG.",
"12, each of liquid-tank plates 121 that form liquid tank 120a is provided with opening ‘g’.",
"The diameter of opening ‘g’ is the same with that of opening ‘d’ of each of condenser plates 111 through 113.The flow passage formed by the plurality of openings ‘g’ communicates the flow passage formed by the plurality of openings A′, thereby forming flow-passage P in which refrigerant flows through condenser 110 and liquid tank 120a, as shown in FIG.",
"11.As shown in FIG.",
"11 and FIG.",
"12, in addition to pipe 1 for coolant-IN and pipe 2 for coolant-OUT, pipe 11 and pipe 12 are connected to condenser plate 111.The high-temperature and high-pressure refrigerant compressed by compressor 30 flows through pipe 11 into condenser 110.After performing heat exchange in condenser 110, the refrigerant undergoes vapor-liquid separation in liquid tanks 120a and 120b.",
"Through pipe 12, the refrigerant is discharged to expansion valve 20.In FIG.",
"12, a broken-line arrow shows the flowing direction of refrigerant, and a solid-line arrow shows the flowing direction of coolant.",
"As shown in FIG.",
"12, the outer diameter of pipe 12 is smaller than the diameter of openings ‘d’ and ‘g’.",
"As shown in FIG.",
"11, pipe 12 is disposed in flow passage P formed of openings ‘d’ and ‘g’.",
"That is, flow passage P has a double-pipe structure having a flow passage formed of the inside of flow passage P but the outside of pipe 12 and a flow passage formed of the inside of pipe 12.The flow passage that runs the inside of flow passage P but the outside of pipe 12 serves as the flow passage in which the refrigerant fed from pipe 11 flows through condenser 110 and liquid tank 120a in the vertically downward direction.",
"The flow passage that runs the inside of pipe 12 serves as the flow passage in which the refrigerant that has passed condenser 110 and liquid tanks 120a, 120b flows through condenser 110 and liquid tank 120 in the vertically upward direction.",
"Heat-exchanging device 200 is thus structured.",
"In heat-exchanging device 200 with the structure above, the coolant and the refrigerant flow as follows.",
"As shown in FIG.",
"13, the coolant fed from pipe 1 passes through condenser 110 and is discharged from pipe 2.As shown in FIG.",
"13, the refrigerant fed from pipe 11 flows through condenser 110 and then the outside of pipe 12 into liquid tank 120a.",
"After passing through liquid tank 120a, the refrigerant flows through liquid tank 120b and the inside of pipe 12 and is discharged from pipe 12 into expansion valve 20.As described above, according to heat-exchanging device 200 of the embodiment, condenser 110 and liquid tank 120a have flow passage P formed of openings ‘d’ and ‘g’, and high-pressure refrigerant flows therethrough.",
"Pipe 12 (as an example of the first pipe) is disposed inside flow passage P. The outer diameter of pipe 12 is smaller than the diameter of openings ‘d’ and ‘g’.",
"Pipe 12 is disposed in flow passage P so that the refrigerant that has flown into condenser 110 flows inside flow passage P but outside pipe 12; at the same time, the refrigerant that has passed through liquid tank 120b flows inside pipe 12.As described in the first exemplary embodiment, in a conventional heat-exchanging device having condenser 110 and a liquid tank, each plate has to be provided with three openings to form the flow passage for refrigerant.",
"In contrast, according to the embodiment, pipe 12 is disposed in flow passage P formed of openings ‘d’ and ‘g’.",
"The structure allows the refrigerant fed from the compressor to flow the inside of flow passage P but the outside of pipe 12 and the refrigerant that has passed through the refrigerant passage of the liquid tank to flow the inside of pipe 12.By virtue of the structure of the embodiment, the number of the openings for forming the refrigerant passages is decreased to two (i.e., opening ‘a’ and opening ‘d’ in condenser plates 111 through 113, and opening ‘e’ and opening ‘g’ or ‘f’ in liquid-tank plate 121).",
"According to the embodiment, the openings in each plate can be decreased in number, thereby ensuring strength of the plates.",
"That is, the structure enhances durability of the heat-exchanging device.",
"As described above, the structure of the embodiment achieves decrease in number of the openings to be formed in each plate.",
"When each opening is disposed in the short-side direction of the plate, as shown in FIG.",
"11 and FIG.",
"12, the structure allows the plate to have a decreased length of the short side, contributing to a downsized structure of a heat-exchanging device.",
"Seventh Exemplary Embodiment A seventh exemplary embodiment of the present disclosure is described with reference to FIG.",
"14.FIG.",
"14 is a cross-sectional view showing the structure of heat-exchanging device 202 of the embodiment.",
"As shown in FIG.",
"14, heat-exchanging device 202 has a structure basically the same as that of heat-exchanging device 102 (see FIG.",
"7) described in the third exemplary embodiment, except that condenser plate 111 has pipe 11 and pipe 12 instead of pipe 3 shown in FIG.",
"7.In FIG.",
"14, like parts are identified by the same reference marks as in FIG.",
"7, and the detailed description thereof is omitted.",
"In heat-exchanging device 202, the coolant and the refrigerant flow as follows.",
"As shown in FIG.",
"14, the coolant fed from pipe 1 passes through condenser 110 and is discharged from pipe 2.As shown in FIG.",
"14, the refrigerant fed from pipe 11 passes through condenser 110 and flows through the outside of pipe 12 into liquid tank 120.After passing through liquid tank 120, the refrigerant passes through intermediate heat-exchanger 140 then flows inside pipe 12 and is discharged from pipe 12 into expansion valve 20.As shown in FIG.",
"14, the coolant fed from pipe 4 passes through evaporator 130 and is discharged from pipe 5.As shown in FIG.",
"14, the refrigerant fed from pipe 6 branches into evaporator 130 and intermediate heat-exchanger 140.The refrigerant that has passed through evaporator 130 and the refrigerant that has passed through intermediate heat-exchanger 140 join again, and the joined refrigerant is discharged from pipe 7 to compressor 30.Heat-exchanging device 202 of the embodiment, as described above, has condenser 110, liquid tank 120, evaporator 130, and intermediate heat-exchanger 140.Such structured heat-exchanging device 202 of the embodiment produces the effect similar to the structure described in the sixth exemplary embodiment above.",
"Eighth Exemplary Embodiment An eighth exemplary embodiment of the present disclosure is described with reference to FIG.",
"15.FIG.",
"15 is a cross-sectional view showing the structure of heat-exchanging device 203 of the embodiment.",
"As shown in FIG.",
"15, heat-exchanging device 203 has a structure basically the same as that of heat-exchanging device 103 (see FIG.",
"9) described in the fourth exemplary embodiment, except that condenser plate 111 has pipe 11 and pipe 12 instead of pipe 3 shown in FIG.",
"9.In addition, the structure of FIG.",
"15 differs from that of FIG.",
"9 in that pipe 1 for coolant-IN is oppositely disposed from pipe 2 for coolant-OUT.",
"In FIG.",
"15, like parts are identified by the same reference marks as in FIG.",
"9, and the detailed description thereof is omitted.",
"In heat-exchanging device 203, the coolant and the refrigerant flow as follows.",
"As shown in FIG.",
"15, the coolant fed from pipe 1 passes through condenser 110 and is discharged from pipe 2.As shown in FIG.",
"15, the refrigerant fed from pipe 11 passes through condenser 110 and flows outside pipe 12 into liquid tank 120.After passing through liquid tank 120, the refrigerant passes through intermediate heat-exchanger 140 then flows inside pipe 12 and is discharged from pipe 12 into expansion valve 20.As shown in FIG.",
"15, the coolant fed from pipe 4 passes through evaporator 130 and is discharged from pipe 5.As shown in FIG.",
"15, the refrigerant that has flown from outer pipe 81 flows inside outer pipe 81 but outside inner pipe 82 and then passes through evaporator 130 into intermediate heat-exchanger 140.After passing through intermediate heat-exchanger 140, the refrigerant flows inside inner pipe 82 and is discharged from inner pipe 82 into compressor 30.Heat-exchanging device 203 of the embodiment, as described above, has condenser 110, liquid tank 120, evaporator 130, and intermediate heat-exchanger 140.Such structured heat-exchanging device 203 of the embodiment produces the effect similar to the structure described in the sixth exemplary embodiment above.",
"Ninth Exemplary Embodiment A ninth exemplary embodiment of the present invention is described with reference to FIG.",
"16.FIG.",
"16 is a cross-sectional view showing the structure of heat-exchanging device 204 of the embodiment.",
"As shown in FIG.",
"16, heat-exchanging device 204 has a structure basically the same as that of heat-exchanging device 104 (see FIG.",
"10) described in the fifth exemplary embodiment, except that condenser plate 111 has pipe 11 and pipe 12 instead of pipe 3 shown in FIG.",
"10.In addition, the structure of FIG.",
"16 differs from that of FIG.",
"10 in that pipe 1 for coolant-IN is oppositely disposed from pipe 2 for coolant-OUT.",
"In FIG.",
"16, like parts are identified by the same reference marks as in FIG.",
"10, and the detailed description thereof is omitted.",
"In heat-exchanging device 204, the coolant and the refrigerant flow as follows.",
"As shown in FIG.",
"16, the coolant fed from pipe 1 branches into condenser 110 and subcool condenser 150.The coolant that has passed through condenser 110 and the coolant that has passed through subcool condenser 150 join again and the joined coolant is discharged from pipe 12.As shown in FIG.",
"16, the refrigerant fed from pipe 11 passes through condenser 110 and flows outside pipe 12 into liquid tank 120.After passing through liquid tank 120, the refrigerant passes through subcool condenser 150 then flows inside pipe 12 and is discharged from pipe 12.Heat-exchanging device 204 of the embodiment, as described above, has condenser 110, liquid tank 120, and subcool condenser 150.Such structured heat-exchanging device 204 of the embodiment produces the effect similar to the structure described in the sixth exemplary embodiment above.",
"The description above is on heat-exchanging devices 200, 202, and 203 each in which the pipe for refrigerant-IN and the pipe for refrigerant-OUT are individually formed.",
"The structures of the first through the ninth exemplary embodiments of the present disclosure have been described so far.",
"However, the present disclosure is not limited to the structures described in the first through ninth exemplary embodiments above, allowing various modifications without departing from the spirit and scope of the disclosure.",
"Hereinafter, modification examples will be described.",
"For example, the plurality of plates forming the heat-exchanging device in the first through ninth exemplary embodiments may differ from each other in shape of visible outline, in size, and in dimension in the stacking direction as long as the plates are stackable.",
"Further, for example, the components of the heat-exchanging device described in the first through ninth exemplary embodiments (for example, condenser 110, liquid tank 120, liquid tank 120a, liquid tank 120b, evaporator 130, intermediate heat-exchanger 140, and subcool condenser 150) are not necessarily stacked in the order described in the first through ninth exemplary embodiments.",
"Further, for example, the first through ninth exemplary embodiments have described a positioning state where the upper section of condenser 110 is directed vertically upward, whereas each lower section of liquid tank 120, liquid tank 120b, and evaporator 130 or subcool condenser 150 is directed vertically downward.",
"However, the positioning state of the heat-exchanging device in use is not limited to the above.",
"Further, for example, the first through ninth exemplary embodiments have described an example where coolant (water) is employed for a heat carrier that exchanges heat with refrigerant, but it is not limited to; instead of coolant, oil or air may be used as the heat carrier.",
"Further, for example, the first through ninth exemplary embodiments have described an example where liquid tank 120, liquid tank 120a, or liquid tank 120b retain the refrigerant fed from condenser 110 by the flow passage formed of openings ‘e’, but it is not limited to.",
"For example, a refrigerant-retaining section may be formed by forming each of the plurality of liquid-tank plates 121 into a window-flame shape having an opening in the center.",
"For example, the first through ninth exemplary embodiments have described that liquid tank 120, liquid tank 120a, and liquid tank 120b have a structure of a plurality of liquid-tank plates 121 stacked one on another.",
"However, instead of the stacking structure of the plurality of plates, liquid tanks 120, 120a, 120b may be formed as an integrally-structured block having an accommodating space (corresponding to the refrigerant-retaining section) inside the structure.",
"Furthermore, seen in the stacking direction, liquid tanks 120, 120a, 120b of a block-shaped structure may differ in shape of visible outline and in size from condenser 110, evaporator 130, intermediate heat-exchanger 140, or subcool condenser 150.Further, for example, in the first through ninth exemplary embodiments, each of condenser 110, evaporator 130, intermediate heat-exchanger 140, or subcool condenser 150 may differ in shape of visible outline and in size, seen in the stacking direction, from each other.",
"Further, for example, the sixth through ninth exemplary embodiments have described that the inner diameter and the outer diameter of pipe 12 are smaller than those of pipe 11, but pipe 12 may be equal to pipe 11 in inner diameter and outer diameter.",
"Further, for example, in the third, fourth, and eighth exemplary embodiments, the pipe through which refrigerant flows into condenser 110 and the pipe through which the refrigerant is discharged after passing through condenser 110 and intermediate heat-exchanger 140 may not be formed as a double-pipe structure of outer pipe 31 and inner pipe 32.Further, for example, the fourth and eighth exemplary embodiments have described an example in which outer pipe 81 and inner pipe 82 are integrally structured.",
"However, they may be individually structured, like pipe 11 and pipe 12 shown in FIG.",
"13 through FIG.",
"16.The present disclosure is applicable to air-conditioning and heating equipment mountable to vehicles."
]
] |
Patent_15871408
|
[
[
"TRAILER BACKUP OFFSET DETERMINATION",
"A system for calibrating a backup assist system for a trailer attached to a vehicle is provided which includes a hitch sensor continuously measuring a hitch angle between the vehicle and the trailer.",
"A controller is configured to determine an offset of the measured hitch angle.",
"The controller is configured to calculate and store in memory a forward offset if no reverse offset is stored."
],
[
"1.A system for calibrating a backup assist system for a trailer attached to a vehicle, comprising: a hitch sensor continuously measuring a hitch angle between the vehicle and the trailer; and a controller configured to determine an offset of the measured hitch angle, wherein the controller is configured to calculate and store in memory a forward offset if no reverse offset is stored.",
"2.The system of claim 1, wherein the offset is determined between the measured hitch angle and an actual hitch angle when the actual hitch angle is substantially zero.",
"3.The system of claim 1, wherein the controller is further configured to not calculate a forward offset if the reverse offset is stored.",
"4.The system of claim 1, wherein the forward and reverse offsets are determined during a steady state condition of the vehicle and the trailer.",
"5.The system of claim 1, further comprising: a knob sensor continuously sensing a knob angle, wherein the knob angle is substantially zero when the vehicle and trailer are in a substantially standing state, and wherein the reverse offset is determined when the knob angle is substantially zero over a threshold time while the vehicle is driving above a threshold speed.",
"6.The system of claim 3 further comprising: a yaw sensor continuously sensing a yaw rate of the vehicle, wherein the yaw rate of the vehicle is substantially zero when the vehicle is steered straight, and wherein the forward and reverse offsets are determined when the angle rate is substantially zero over a threshold time while the vehicle is driving above a threshold speed.",
"7.The system of claim 3, wherein the controller determines an approximate distance the vehicle must travel straight to place the actual hitch angle at zero based on a length of the trailer and the measured hitch angle.",
"8.A system for calibrating a backup assist system for a trailer attached to a vehicle, comprising: a hitch sensor continuously measuring a hitch angle between the vehicle and the trailer; and a controller configured to determine an offset of the measured hitch angle, wherein the controller is configured to prioritize the offset determined while the vehicle and the trailer are moving reverse over the offset determined while the vehicle and the trailer are moving forward.",
"9.The system of claim 8, wherein the offset is determined between the measured hitch angle and an actual hitch angle when the actual hitch angle is substantially zero.",
"10.The system of claim 8, wherein the controller is further configured to not calculate a forward offset if the reverse offset is stored.",
"11.The system of claim 8, wherein the forward and reverse offsets are determined during a steady state condition of the vehicle and the trailer.",
"12.The system of claim 8, further comprising: a knob sensor continuously sensing a knob angle, wherein the knob angle is substantially zero when the vehicle and trailer are in a substantially standing state, and wherein the reverse offset is determined when the knob angle is substantially zero over a threshold time while the vehicle is driving above a threshold speed.",
"13.The system of claim 10 further comprising: a yaw sensor continuously sensing a yaw rate of the vehicle, wherein the yaw rate of the vehicle is substantially zero when the vehicle is steered straight, and wherein the forward and reverse offsets are determined when the angle rate is substantially zero over a threshold time while the vehicle is driving above a threshold speed.",
"14.The system of claim 10, wherein the controller determines an approximate distance the vehicle must travel straight to place the actual hitch angle at zero based on a length of the trailer and the measured hitch angle.",
"15.A system for calibrating a backup assist system for a trailer attached to a vehicle, comprising: a hitch sensor continuously measuring a hitch angle between the vehicle and the trailer; and a controller configured to determine an offset of the measured hitch angle, wherein the controller is configured to replace a forward offset when a reverse offset is determined.",
"16.The system of claim 15, wherein the controller is further configured to not calculate a forward offset if the reverse offset is stored.",
"17.The system of claim 15, wherein the forward and reverse offsets are determined during a steady state condition of the vehicle and the trailer.",
"18.The system of claim 15, further comprising: a knob sensor continuously sensing a knob angle, wherein the knob angle is substantially zero when the vehicle and trailer are in a substantially standing state, and wherein the reverse offset is determined when the knob angle is substantially zero over a threshold time while the vehicle is driving above a threshold speed.",
"19.The system of claim 16 further comprising: a yaw sensor continuously sensing a yaw rate of the vehicle, wherein the yaw rate of the vehicle is substantially zero when the vehicle is steered straight, and wherein the forward and reverse offsets are determined when the angle rate is substantially zero over a threshold time while the vehicle is driving above a threshold speed.",
"20.The system of claim 16, wherein the controller determines an approximate distance the vehicle must travel straight to place the actual hitch angle at zero based on a length of the trailer and the measured hitch angle."
],
[
"<SOH> BACKGROUND OF THE INVENTION <EOH>Reversing a vehicle while towing a trailer is very challenging for many drivers.",
"This is particularly true for drivers that are unskilled at backing vehicles with attached trailers, which may include those that drive with a trailer on an infrequent basis (e.g., have rented a trailer, use a personal trailer on an infrequent basis, etc.).",
"One reason for such difficulty is that backing a vehicle with an attached trailer requires steering inputs that are opposite to normal steering when backing the vehicle without a trailer attached and/or requires braking to stabilize the vehicle-trailer combination before a jackknife condition occurs.",
"Another reason for such difficulty is that small errors in steering while backing a vehicle with an attached trailer are amplified thereby causing the trailer to depart from a desired path.",
"To assist the driver in steering a vehicle with a trailer attached, a trailer backup assist system needs to know the driver's intention.",
"One common assumption with known trailer backup assist systems is that a driver of a vehicle with an attached trailer wants to backup straight and the system either implicitly or explicitly assumes a zero curvature path for the vehicle-trailer combination.",
"Unfortunately most of the real-world use cases of backing a trailer involve a curved path and, thus, assuming a path of zero curvature would significantly limit usefulness of the system.",
"Some known systems assume that a path is known from a map or path planner.",
"To this end, some known trailer backup assist systems operate under a requirement that a trailer backup path is known before backing of the trailer commences such as, for example, from a map or a path-planning algorithm.",
"Undesirably, such implementations of the trailer backup assist systems are known to have a relatively complex human machine interface (HMI) device to specify the path, obstacles and/or goal of the backup maneuver.",
"Furthermore, such systems also require some way to determine how well the desired path is being followed and to know when the desired goal, or stopping point and orientation, has been met, using approaches such as cameras, inertial navigation, or high precision global positioning system (GPS).",
"These requirements lead to a relatively complex and costly system.",
"Another reason backing a trailer can prove to be difficult is the need to control the vehicle in a manner that limits the potential for a jackknife condition to occur.",
"A trailer has attained a jackknife condition when a hitch angle cannot be reduced (i.e., made less acute) while continuously backing up a trailer by application of a maximum steering input for the vehicle such as, for example, by moving steered front wheels of the vehicle to a maximum steered angle at a maximum rate of steering angle change.",
"In the case of the jackknife angle being achieved, the vehicle must be pulled forward to relieve the hitch angle in order to eliminate the jackknife condition and, thus, allow the hitch angle to be controlled via manipulation of the steered wheels of the vehicle.",
"However, in addition to the jackknife condition creating the inconvenient situation where the vehicle must be pulled forward, it can also lead to damage to the vehicle and/or trailer if certain operating conditions of the vehicle relating to its speed, engine torque, acceleration, and the like are not detected and counteracted.",
"For example, if the vehicle is travelling at a suitably high speed in reverse and/or subjected to a suitably high longitudinal acceleration when the jackknife condition is achieved, the relative movement of the vehicle with respect to the trailer can lead to contact between the vehicle and trailer thereby damaging the trailer and/or the vehicle."
],
[
"<SOH> SUMMARY OF THE INVENTION <EOH>According to at least one feature of the present disclosure, a system for calibrating a backup assist system for a trailer attached to a vehicle is provided which includes a hitch sensor continuously measuring a hitch angle between the vehicle and the trailer.",
"A controller is configured to determine an offset of the measured hitch angle.",
"The controller is configured to calculate and store in memory a forward offset if no reverse offset is stored.",
"According to another feature of the present disclosure, a system for calibrating a backup assist system for a trailer attached to a vehicle is provided which includes a hitch sensor continuously measuring a hitch angle between the vehicle and the trailer.",
"A controller is configured to determine an offset of the measured hitch angle.",
"The controller is configured to prioritize the offset determined while the vehicle and the trailer are moving reverse over the offset determined while the vehicle and the trailer are moving forward.",
"According to a further feature of the present disclosure, a system for calibrating a backup assist system for a trailer attached to a vehicle is provided which includes a hitch sensor continuously measuring a hitch angle between the vehicle and the trailer.",
"A controller is configured to determine an offset of the measured hitch angle.",
"The controller is configured to replace a forward offset when a reverse offset is determined.",
"These and other aspects, objects, and features of the present invention will be understood and appreciated by those skilled in the art upon studying the following specification, claims, and appended drawings."
],
[
"CROSS-REFERENCE TO RELATED APPLICATIONS This patent application is a division of U.S. patent application Ser.",
"No.",
"14/886,668, which was filed on Oct. 19, 2015, entitled “TRAILER BACKUP OFFSETDETERMINATION”, which is a continuation-in-part of U.S. patent application Ser.",
"No.",
"14/201,130, which was filed on Mar.",
"7, 2014, entitled “SYSTEM AND METHOD OF CALIBRATING A TRAILER BACKUP ASSIST SYSTEM,” and issued as U.S. Pat.",
"No.",
"9,290,202 on Mar.",
"22, 2016, which is a continuation-in-part of U.S. patent application Ser.",
"No.",
"14/068,387, which was filed on Oct. 31, 2013, entitled “TRAILER MONITORING SYSTEM AND METHOD,” and issued as U.S. Pat.",
"No.",
"9,102,271 on Aug. 11, 2015, which is a continuation-in-part of U.S. patent application Ser.",
"No.",
"14/059,835, which was filed on Oct. 22, 2013, entitled “TRAILER BACKUP ASSIST SYSTEM,” and issued as U.S. Pat.",
"No.",
"9,248,858 on Feb. 2, 2016, which is a continuation-in-part of U.S. patent application Ser.",
"No.",
"13/443,743 which was filed on Apr.",
"10, 2012, entitled “DETECTION OF AND COUNTERMEASURES FOR JACKKNIFE ENABLING CONDITIONS DURING TRAILER BACKUP ASSIST,” and issued as U.S. Pat.",
"No.",
"8,825,328 on Sep. 2, 2014, which is a continuation-in-part of U.S. patent application Ser.",
"No.",
"13/336,060, which was filed on Dec. 23, 2011, entitled “TRAILER PATH CURVATURE CONTROL FOR TRAILER BACKUP ASSIST,” and issued as U.S. Pat.",
"No.",
"8,909,426 on Dec. 9, 2014, which claims benefit from U.S.",
"Provisional Patent Application No.",
"61/477,132, which was filed on Apr.",
"19, 2011, entitled “TRAILER BACKUP ASSIST CURVATURE CONTROL,” which have a common Applicant herewith and are being incorporated herein in their entirety by reference.",
"FIELD OF THE INVENTION The disclosure made herein relates generally to driver assist and active safety technologies in vehicles, and more particularly to a trailer backup assist system.",
"BACKGROUND OF THE INVENTION Reversing a vehicle while towing a trailer is very challenging for many drivers.",
"This is particularly true for drivers that are unskilled at backing vehicles with attached trailers, which may include those that drive with a trailer on an infrequent basis (e.g., have rented a trailer, use a personal trailer on an infrequent basis, etc.).",
"One reason for such difficulty is that backing a vehicle with an attached trailer requires steering inputs that are opposite to normal steering when backing the vehicle without a trailer attached and/or requires braking to stabilize the vehicle-trailer combination before a jackknife condition occurs.",
"Another reason for such difficulty is that small errors in steering while backing a vehicle with an attached trailer are amplified thereby causing the trailer to depart from a desired path.",
"To assist the driver in steering a vehicle with a trailer attached, a trailer backup assist system needs to know the driver's intention.",
"One common assumption with known trailer backup assist systems is that a driver of a vehicle with an attached trailer wants to backup straight and the system either implicitly or explicitly assumes a zero curvature path for the vehicle-trailer combination.",
"Unfortunately most of the real-world use cases of backing a trailer involve a curved path and, thus, assuming a path of zero curvature would significantly limit usefulness of the system.",
"Some known systems assume that a path is known from a map or path planner.",
"To this end, some known trailer backup assist systems operate under a requirement that a trailer backup path is known before backing of the trailer commences such as, for example, from a map or a path-planning algorithm.",
"Undesirably, such implementations of the trailer backup assist systems are known to have a relatively complex human machine interface (HMI) device to specify the path, obstacles and/or goal of the backup maneuver.",
"Furthermore, such systems also require some way to determine how well the desired path is being followed and to know when the desired goal, or stopping point and orientation, has been met, using approaches such as cameras, inertial navigation, or high precision global positioning system (GPS).",
"These requirements lead to a relatively complex and costly system.",
"Another reason backing a trailer can prove to be difficult is the need to control the vehicle in a manner that limits the potential for a jackknife condition to occur.",
"A trailer has attained a jackknife condition when a hitch angle cannot be reduced (i.e., made less acute) while continuously backing up a trailer by application of a maximum steering input for the vehicle such as, for example, by moving steered front wheels of the vehicle to a maximum steered angle at a maximum rate of steering angle change.",
"In the case of the jackknife angle being achieved, the vehicle must be pulled forward to relieve the hitch angle in order to eliminate the jackknife condition and, thus, allow the hitch angle to be controlled via manipulation of the steered wheels of the vehicle.",
"However, in addition to the jackknife condition creating the inconvenient situation where the vehicle must be pulled forward, it can also lead to damage to the vehicle and/or trailer if certain operating conditions of the vehicle relating to its speed, engine torque, acceleration, and the like are not detected and counteracted.",
"For example, if the vehicle is travelling at a suitably high speed in reverse and/or subjected to a suitably high longitudinal acceleration when the jackknife condition is achieved, the relative movement of the vehicle with respect to the trailer can lead to contact between the vehicle and trailer thereby damaging the trailer and/or the vehicle.",
"SUMMARY OF THE INVENTION According to at least one feature of the present disclosure, a system for calibrating a backup assist system for a trailer attached to a vehicle is provided which includes a hitch sensor continuously measuring a hitch angle between the vehicle and the trailer.",
"A controller is configured to determine an offset of the measured hitch angle.",
"The controller is configured to calculate and store in memory a forward offset if no reverse offset is stored.",
"According to another feature of the present disclosure, a system for calibrating a backup assist system for a trailer attached to a vehicle is provided which includes a hitch sensor continuously measuring a hitch angle between the vehicle and the trailer.",
"A controller is configured to determine an offset of the measured hitch angle.",
"The controller is configured to prioritize the offset determined while the vehicle and the trailer are moving reverse over the offset determined while the vehicle and the trailer are moving forward.",
"According to a further feature of the present disclosure, a system for calibrating a backup assist system for a trailer attached to a vehicle is provided which includes a hitch sensor continuously measuring a hitch angle between the vehicle and the trailer.",
"A controller is configured to determine an offset of the measured hitch angle.",
"The controller is configured to replace a forward offset when a reverse offset is determined.",
"These and other aspects, objects, and features of the present invention will be understood and appreciated by those skilled in the art upon studying the following specification, claims, and appended drawings.",
"BRIEF DESCRIPTION OF THE DRAWINGS In the drawings: FIG.",
"1 shows a vehicle-trailer combination, the vehicle being configured for performing trailer backup assist functionality in accordance with an embodiment; FIG.",
"2 shows one embodiment of the trailer backup steering input apparatus discussed in reference to FIG.",
"1; FIG.",
"3 shows an example of a trailer backup sequence implemented using the trailer backup steering input apparatus discussed in reference to FIG.",
"2; FIG.",
"4 shows a method for implementing trailer backup assist functionality in accordance with an embodiment; FIG.",
"5 is a diagrammatic view showing a kinematic model configured for providing information utilized in providing trailer backup assist functionality in accordance with one embodiment; FIG.",
"6 is a graph showing an example of a trailer path curvature function plot for a rotary-type trailer backup steering input apparatus configured in accordance with the disclosed subject matter; FIG.",
"7 is a diagrammatic view showing a relationship between hitch angle and steered angle as it relates to determining a jackknife angle for a vehicle/trailer system in reverse or backing up; FIG.",
"8 shows a method for implementing jackknife countermeasures functionality in accordance with an embodiment; FIG.",
"9 shows a human machine interface (HMI) device associated with the trailer backup assist; FIG.",
"10 shows a flow diagram associated with the trailer backup assist; FIG.",
"11 shows a flow diagram of the setup module according to one embodiment; FIG.",
"12 shows an example of an image displayed at the HMI device in accordance with one embodiment; FIG.",
"13 is a block diagram illustrating the vehicle trailer backup assist system employing a target monitor controller, according to one embodiment; FIG.",
"14 is a schematic diagram illustrating user placement of the target on a trailer towed by a vehicle; FIG.",
"15 is an enlarged view of the front portion of the trailer further illustrating the target placement zone in relation to the target sticker; FIG.",
"16 is a front view of a portable device having a display illustrating the overlay of a target onto a target placement zone on the trailer; FIG.",
"17 is a flow diagram illustrating a method of assisting a user with the placement of the target on the trailer; FIG.",
"18 is a flow diagram illustrating a method of monitoring placement of the target on the trailer and generating feedback alert; FIG.",
"19 is a schematic view of a front portion of the trailer having a target mounting system assembled thereto, according to one embodiment; FIG.",
"20 is an exploded view of the target mounting system and trailer shown in FIG.",
"19; FIG.",
"21 is a flow diagram illustrating an initial set up routine for monitoring the trailer connection for target changes and resetting trailer selection; FIG.",
"22 is a flow diagram illustrating a target moved detection routine for monitoring presence of trailer changes and resetting trailer selection; FIG.",
"23A is an image of the trailer showing the target in a first position; FIG.",
"23B is an image of the trailer showing movement of the target to a second position, according to one example; FIG.",
"24 is a flow diagram illustrating a trailer connection monitoring routine for monitoring trailer disconnection; FIG.",
"25A is an image of a tow vehicle showing a keylock hole defined in a tailgate handle assembly of the tow vehicle; FIG.",
"25B is an enlarged partial rear perspective view of a tailgate handle assembly defining a keylock hole; FIG.",
"25C is an enlarged partial front perspective view of the tailgate handle assembly showing the customary use of a keylock cylinder with the keylock hole; FIG.",
"25D shows the keylock cylinder mounted to the tailgate handle, according to one embodiment; FIG.",
"26A is a front perspective view of a light assembly, according to one embodiment; FIG.",
"26B is a rear perspective view of the light assembly; FIG.",
"26C is an exploded view of the light assembly shown in FIGS.",
"26A and 26B; FIG.",
"26D is a cross sectional view of the light assembly taken along line XXVI D-XXVI D of FIG.",
"26A; FIG.",
"27A is a light assembly mounted to the tailgate handle assembly shown in FIG.",
"25B, according to one embodiment; FIG.",
"27B is an enlarged partial front perspective view of the tailgate handle assembly equipped with the light assembly shown in FIG.",
"27A; FIG.",
"28 is a schematic diagram illustrating a supplemental vehicle lighting system being implemented in the tow vehicle shown in FIG.",
"25A, wherein the tow vehicle is attached to a trailer and features a trailer backup assist system employing vision based target detection; FIG.",
"29 is a top plan view of a trailer attached to a vehicle having a sensor system, according to one embodiment; FIG.",
"30 is a block diagram illustrating the trailer backup assist system employing a sensor system that has a primary sensor and a secondary sensor, according to one embodiment; FIG.",
"31 is a flow diagram illustrating a method for estimating an actual hitch angle of a trailer attached to a vehicle with a sensor system; FIG.",
"32 is an automotive vehicle having a hitch angle estimating system of the disclosed subject matter; FIG.",
"33 is a block diagram of a vehicle having a trailer coupled thereto and a relationship to the law of cosines; FIG.",
"34 is a flow chart of a method of estimating a hitch angle; FIG.",
"35 is a block diagram illustrating one embodiment of the trailer backup assist system having the trailer backup assist control module with a hitch angle calibration routine; FIG.",
"36 is a diagram that illustrates the geometry of a vehicle and a trailer overlaid with a two-dimensional x-y coordinate system that identifies variables used to calculate kinematic information of the vehicle and trailer system; FIG.",
"37 is a flow diagram illustrating one embodiment of the hitch angle calibration routine; FIG.",
"38 is a flow diagram illustrating an initiating routine that is performed prior to calculating the trailer angle offset, according to one embodiment; FIG.",
"39 is a flow diagram illustrating an additional embodiment of the hitch angle calibration routine; FIG.",
"40 is a flow diagram illustrating a method of calibrating a trailer backup assist system before determining an offset of the measured hitch angle; and FIG.",
"41 is a flow diagram illustrating an offset prioritization method, according to one embodiment.",
"DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS While various aspects of the inventive subject matter are described with reference to a particular illustrative embodiment, the inventive subject matter is not limited to such embodiments, and additional modifications, applications, and embodiments may be implemented without departing from the inventive subject matter.",
"In the figures, like reference numbers will be used to illustrate the same components.",
"Those skilled in the art will recognize that the various components set forth herein may be altered without varying from the scope of the inventive subject matter.",
"The disclosed subject matter is directed to providing trailer backup assist functionality in a manner that is relatively low cost and that offers an intuitive user interface.",
"In particular, such trailer backup assist functionality provides for controlling curvature of a path of travel of a trailer attached to a vehicle (i.e., trailer path curvature control) by allowing a driver of the vehicle to specify a desired path of the trailer by inputting a desired trailer path curvature as the backup maneuver of the vehicle and trailer progresses.",
"Although a control knob, a set of virtual buttons, or a touch screen can each be implemented for enabling trailer path curvature control, the disclosed subject matter is not unnecessarily limited to any particular configuration of interface through which a desired trailer path curvature is inputted.",
"Furthermore, in the case where a steering wheel can be mechanically decoupled from steered wheels of the vehicle, the steering wheel can also be used as an interface through which a desired trailer path curvature is inputted.",
"As will be discussed herein in greater detail, kinematical information of a system defined by the vehicle and the trailer are used to calculate a relationship (i.e., kinematics) between the trailer's curvature and the steering angle of the vehicle for determining steering angle changes of the vehicle for achieving the specified trailer path.",
"Steering commands corresponding to the steering angle changes are used for controlling a steering system of the tow vehicle (e.g., electric power assisted steering (EPAS) system) for implementing steering angle changes of steered wheels of the vehicle to achieve (e.g., to approximate) the specified path of travel of the trailer.",
"The trailer backup assist system automatically steers the vehicle-trailer combination as a driver uses the vehicle transmission, accelerator and brake to reverse the vehicle-trailer combination.",
"The driver inputs a desired trailer curvature command by using an input device such as a trailer steering knob.",
"Trailer backup assist functionality may be directed to implementing one or more countermeasures for limiting the potential of a jackknife condition being attained between a vehicle and a trailer being towed by the vehicle while backing up.",
"In certain embodiments, curvature of a path of travel of the trailer (i.e., trailer path curvature control) can be controlled by allowing a driver of the vehicle to specify a desired path of the trailer by inputting a desired trailer path curvature as the backup maneuver of the vehicle and trailer progresses.",
"Although a control knob, a set of virtual buttons, or a touch screen can each be implemented for enabling trailer path curvature control, the disclosed subject matter is not unnecessarily limited to any particular configuration of interface through which a desired trailer path curvature is inputted.",
"Furthermore, in the case where a steering wheel can be mechanically decoupled from steered wheels of the vehicle, the steering wheel can also be used as an interface through which a desired trailer path curvature is inputted.",
"As will be discussed herein in greater detail, kinematic information of a system defined by the vehicle and the trailer are used to calculate a relationship (i.e., kinematics) between the trailer's curvature and the steering angle of the vehicle for determining steering angle changes of the vehicle for achieving the specified trailer path.",
"Steering commands corresponding to the steering angle changes are used for controlling a steering system of the tow vehicle (e.g., electric power assisted steering (EPAS) system) for implementing steering angle changes of steered wheels of the vehicle to achieve (e.g., to approximate) the specified path of travel of the trailer.",
"Embodiments of the disclosed subject matter are directed to trailer backup assist functionality that provides for a user interface for a system that controls curvature of a path of a trailer being backed by a vehicle.",
"More specifically, trailer backup assist functionality configured in accordance with embodiments of the disclosed subject matter provide for such trailer path curvature control by allowing a driver of the vehicle to specify a desired path of the trailer by inputting a desired trailer path curvature as the backup maneuver of the vehicle and trailer progresses.",
"In response to such path of the trailer being specified by the driver, embodiments of the disclosed subject matter control a power assisted steering system (e.g., electric power assisted steering (EPAS) system) of the vehicle for implementing steering angle changes of steered wheels of the vehicle to achieve the specified trailer path.",
"Kinematics of the vehicle and the trailer are used to determine the steering angle changes that are required for achieving the specified trailer path.",
"Accordingly, embodiments of the disclosed subject matter provide for implementation of trailer backup assist functionality in a manner that is relatively simple and that enables use of an intuitive vehicle operator interface for specifying trailer path curvature control.",
"The disclosed subject matter, furthermore, includes embodiments directed to determining a hitch angle of trailer attached to the vehicle.",
"In one such embodiment, the vehicle trailer backup assist system may utilize a target placed on the trailer, allowing the trailer backup assist system to employ information acquired via image acquisition and processing of the target.",
"According to other embodiments, the target may be used to identify if a connected trailer has changed, trailer connection or disconnection, and other trailer related information.",
"The target is an identifiable visual target that can be captured in an image by the video imaging camera and detected and processed via image processing.",
"According to one embodiment, the target may attached to the trailer, preferably within a target placement zone, such that the camera and image processing may detect the target and its location on the trailer to determine trailer related information, such as the hitch angle between the trailer and the towing vehicle.",
"The trailer backup assist system may provide to the user one or more image(s) of the trailer target zone for proper placement of the target to assist with placement of the target on the trailer.",
"Additionally, the vehicle trailer backup assist system may monitor the target to determine if the target has been correctly placed within a desired target placement zone and provide feedback alert(s) to the user.",
"Further, the trailer backup assist system may monitor the trailer connection by monitoring the target to determine if the target has moved to determine whether the same trailer remains connected to the tow vehicle, and may initiate action in response thereto.",
"Further, the trailer backup assist system may monitor the hitch angle or the target to determine if the trailer may have been changed out (i.e., disconnected and replaced with another trailer), and may initiate action in response thereto.",
"The disclosed subject matter also provides a supplemental vehicle lighting system that is responsive to a trailer backup assist system.",
"The system includes a rear vehicle fixture defining a keylock hole customarily used in conjunction with a corresponding keylock cylinder.",
"A light assembly is provided in the place of a keylock cylinder and operably coupled to the keylock hole.",
"The light assembly includes a housing having a barrel that is concentrically aligned with the keylock hole and includes a distal end and a proximal end.",
"A lighting device is disposed inside the housing and operable to emit light through the barrel beginning from the proximal end.",
"A lens is coupled to the distal end of the barrel and is disposed to at least partially coincide with the keylock hole, wherein the lens is configured to disperse light emitted from the lighting device to illuminate a rear vehicle area.",
"In some embodiments of the disclosed trailer backup assist system, it can be advantageous to use information that is representative of a hitch angle between the vehicle and a trailer attached to the vehicle.",
"The disclosed subject matter provides embodiments directed to estimating an actual hitch angle of a trailer attached to a vehicle, as in some situations sensor information may become unavailable or may otherwise not provide an accurate measurement of the hitch angle.",
"A hitch angle that is not accurate may introduce a potential for inadequate or improper vehicle system control, especially when the hitch angle information is important to controlling the vehicle system, such as a trailer backup assist system or a trailer brake controller.",
"According to one embodiment, a sensor system for estimating an actual hitch angle of a trailer attached to a vehicle includes a primary sensor having a camera monitoring a target on the trailer to determine a measured hitch angle and a secondary sensor that monitors the trailer to determine an indicator of the actual hitch angle.",
"The trailer backup assist system may then operate the vehicle when the measured hitch angle correlates with the indicator of the actual hitch angle, confirming that the measured hitch angle is a generally accurate estimate of the actual hitch angle.",
"According to an additional embodiment of the disclosed subject matter, a system for estimating a hitch angle between a vehicle and a trailer coupled thereto has a wireless receiver on the vehicle located a predetermined distance from a trailer mount and a wireless transmitter located at an end of the trailer opposite the trailer mount.",
"According to one embodiment, a controller monitors power returns of a signal transmitted from the transmitter to the receiver and thereby estimates a distance between the transmitter and the receiver as a function of a path loss propagation of the transmitted signal.",
"The hitch angle is then estimated using the estimated distance, the predetermined distance, and a trailer length.",
"To further ensure the accuracy of the measured hitch angle, in additional embodiments the trailer back assist system may include a hitch angle calibration routine for determining any offset between the measured hitch angle and the actual hitch angle, based on certain vehicle and/or trailer characteristics.",
"In one of these embodiments, a method provides for sensing a measured hitch angle with at least one hitch angle sensor on the vehicle and sensing a steering angle of the steered wheels of the vehicle.",
"The method further provides for reversing the vehicle, and thereby determining an offset between the measured hitch angle and the actual hitch angle when the measured hitch angle and the steering angle are substantially consistent while the vehicle is reversing.",
"Another one of these embodiments provides driving the vehicle forward substantially straight above a threshold speed while sensing a yaw rate of the vehicle and sensing a measured hitch angle of the trailer.",
"Further, the method provides for determining an angle rate based on the measured hitch angle, and then determining an offset between the measured hitch angle and the actual hitch angle when the yaw rate and the angle rate are substantially zero.",
"The offset may then be used to more accurately manipulate the actual hitch angle with the trailer backup assist system.",
"Trailer Backup Assist System Referring to FIG.",
"1, an embodiment of a vehicle 100 configured for performing trailer backup assist functionality is shown.",
"A trailer backup assist system 105 of the vehicle 100 controls the curvature of path of travel of a trailer 110 that is attached to the vehicle 100.Such control is accomplished through interaction of a power assisted steering system 115 of the vehicle 100 and the trailer backup assist system 105.During operation of the trailer backup assist system 105 while the vehicle 100 is being reversed, a driver of the vehicle 100 is sometimes limited in the manner in which he/she can make steering inputs via a steering wheel of the vehicle 100.This is because in certain vehicles the trailer backup assist system 105 is in control of the power assisted steering system 115 and the power assisted steering system 115 is directly coupled to the steering wheel (i.e., the steering wheel of the vehicle 100 moves in concert with steered wheels of the vehicle 100).",
"As is discussed below in greater detail, a human machine interface (HMI) device of the backup assist system 105 is used for commanding changes in curvature of a path of the trailer 110 such as a knob, thereby decoupling such commands from being made at the steering wheel of the vehicle 100.However, some vehicles configured to provide trailer backup assist functionality in accordance with the disclosed subject matter will have the capability to selectively decouple steering movement from movement of steerable wheels of the vehicle, thereby allowing the steering wheel to be used for commanding changes in curvature of a path of a trailer during such trailer backup assist.",
"The trailer backup assist system 105 includes a trailer backup assist control module 120, a trailer backup steering input apparatus 125, and a hitch angle detection apparatus 130.The trailer backup assist control module 120 is connected to the trailer backup steering input apparatus 125 and the hitch angle detection apparatus 130 for allowing communication of information therebetween.",
"It is disclosed herein that the trailer backup steering input apparatus can be coupled to the trailer backup assist control module 120 in a wired or wireless manner.",
"The trailer backup assist system control module 120 is attached to a power steering assist control module 135 of the power steering assist system 115 for allowing information to be communicated therebetween.",
"A steering angle detection apparatus 140 of the power steering assist system 115 is connected to the power steering assist control module 135 for providing information thereto.",
"The trailer backup assist system is also attached to a brake system control module 145 and a powertrain control module 150 for allowing communication of information therebetween.",
"Jointly, the trailer backup assist system 105, the power steering assist system 115, the brake system control module 145, the powertrain control module 150, and the gear selection device (PRNDL), define a trailer backup assist architecture configured in accordance with an embodiment.",
"The trailer backup assist control module 120 is configured for implementing logic (i.e., instructions) for receiving information from the trailer backup steering input apparatus 125, the hitch angle detection apparatus 130, the power steering assist control module 135, the brake system control module 145, and the powertrain control module 150.The trailer backup assist control module 120 (e.g., a trailer curvature algorithm thereof) generates vehicle steering information as a function of all or a portion of the information received from the trailer backup steering input apparatus 125, the hitch angle detection apparatus 130, the power steering assist control module 135, the brake system control module 145, and the powertrain control module 150.Thereafter, the vehicle steering information is provided to the power steering assist control module 135 for affecting steering of the vehicle 100 by the power steering assist system 115 to achieve a commanded path of travel for the trailer 110.The trailer backup steering input apparatus 125 provides the trailer backup assist control module 120 with information defining the commanded path of travel of the trailer 110 to the trailer backup assist control module 120 (i.e., trailer steering information).",
"The trailer steering information can include information relating to a commanded change in the path of travel (e.g., a change in radius of path curvature) and information relating to an indication that the trailer is to travel along a path defined by a longitudinal centerline axis of the trailer (i.e., along a substantially straight path of travel).",
"As will be discussed below in detail, the trailer backup steering input apparatus 125 preferably includes a rotational control input device for allowing a driver of the vehicle 100 to interface with the trailer backup steering input apparatus 125 to command desired trailer steering actions (e.g., commanding a desired change in radius of the path of travel of the trailer and/or commanding that the trailer travel along a substantially straight path of travel as defined by a longitudinal centerline axis of the trailer).",
"In a preferred embodiment, the rotational control input device is a knob rotatable about a rotational axis extending through a top surface/face of the knob.",
"In other embodiments, the rotational control input device is a knob rotatable about a rotational axis extending substantially parallel to a top surface/face of the knob.",
"Some vehicles (e.g., those with active front steer) have a power steering assist system configuration that allows a steering wheel to be partially decoupled from movement of the steered wheels of such a vehicle.",
"Accordingly, the steering wheel can be rotated independent of the manner in which the power steering assist system of the vehicle controls the steered wheels (e.g., as commanded by vehicle steering information provided by a power steering assist system control module from a trailer backup assist system control module configured in accordance with one embodiment).",
"As such, in these types of vehicles where the steering wheel can be selectively decoupled from the steered wheels to allow independent operation thereof, trailer steering information of a trailer backup assist system configured in accordance with the disclosed subject matter can be provided through rotation of the steering wheel.",
"Accordingly, it is disclosed herein that in certain embodiments, the steering wheel is an embodiment of a rotational control input device in the context of the disclosed subject matter.",
"In such embodiments, the steering wheel would be biased (e.g., by an apparatus that is selectively engageable/activatable) to an at-rest position between opposing rotational ranges of motion.",
"The hitch angle detection apparatus 130, which operates in conjunction with a hitch angle detection component 155 of the trailer 110, provides the trailer backup assist control module 120 with information relating to an angle between the vehicle 100 and the trailer 110 (i.e., hitch angle information).",
"In a preferred embodiment, the hitch angle detection apparatus 130 is a camera-based apparatus such as, for example, an existing rear view camera of the vehicle 100 that images (i.e., visually monitors) a target (i.e., the hitch angle detection component 155) attached the trailer 110 as the trailer 110 is being backed by the vehicle 100.Preferably, but not necessarily, the hitch angle detection component 155 is a dedicated component (e.g., an item attached to/integral with a surface of the trailer 110 for the express purpose of being recognized by the hitch angle detection apparatus 130).",
"Alternatively, the hitch angle detection apparatus 130 can be a device that is physically mounted on a hitch component of the vehicle 100 and/or a mating hitch component of the trailer 110 for determining an angle between centerline longitudinal axes of the vehicle 100 and the trailer 110.The hitch angle detection apparatus 130 can be configured for detecting a jackknife enabling condition and/or related information (e.g., when a hitch angle threshold has been met).",
"The power steering assist control module 135 provides the trailer backup assist control module 120 with information relating to a rotational position (e.g., angle) of the steering wheel angle and/or a rotational position (e.g., turning angle(s)) of steered wheels of the vehicle 100.In certain embodiments, the trailer backup assist control module 120 can be an integrated component of the power steering assist system 115.For example, the power steering assist control module 135 can include a trailer backup assist algorithm for generating vehicle steering information as a function of all or a portion of information received from the trailer backup steering input apparatus 125, the hitch angle detection apparatus 130, the power steering assist control module 135, the brake system control module 145, and the powertrain control module 150.The brake system control module 145 provides the trailer backup assist control module 120 with information relating to vehicle speed.",
"Such vehicle speed information can be determined from individual wheel speeds as monitored by the brake system control module 145 or may be provided by an engine control module with signal plausibility.",
"Vehicle speed may also be determined from an engine control module.",
"In some instances, individual wheel speeds can also be used to determine a vehicle yaw rate and such yaw rate can be provided to the trailer backup assist control module 120 for use in determining the vehicle steering information.",
"In certain embodiments, the trailer backup assist control module 120 can provide vehicle braking information to the brake system control module 145 for allowing the trailer backup assist control module 120 to control braking of the vehicle 100 during backing of the trailer 110.For example, using the trailer backup assist control module 120 to regulate speed of the vehicle 100 during backing of the trailer 110 can reduce the potential for unacceptable trailer backup conditions.",
"Examples of unacceptable trailer backup conditions include, but are not limited to, a vehicle over speed condition, a high hitch angle rate, trailer angle dynamic instability, a calculated theoretical trailer jackknife condition (defined by a maximum vehicle steering angle, drawbar length, tow vehicle wheelbase and an effective trailer length), or physical contact jackknife limitation (defined by an angular displacement limit relative to the vehicle 100 and the trailer 110), and the like.",
"It is disclosed herein that the backup assist control module 120 can issue a signal corresponding to a notification (e.g., a warning) of an actual, impending, and/or anticipated unacceptable trailer backup condition.",
"The powertrain control module 150 interacts with the trailer backup assist control module 120 for regulating speed and acceleration of the vehicle 100 during backing of the trailer 110.As mentioned above, regulation of the speed of the vehicle 100 is necessary to limit the potential for unacceptable trailer backup conditions such as, for example, jackknifing and trailer angle dynamic instability.",
"Similar to high-speed considerations as they relate to unacceptable trailer backup conditions, high acceleration and high dynamic driver curvature requests can also lead to such unacceptable trailer backup conditions.",
"Steering Input Apparatus Referring now to FIG.",
"2, an embodiment of the trailer backup steering input apparatus 125 discussed in reference to FIG.",
"1 is shown.",
"A rotatable control element in the form of a knob 170 is coupled to a movement sensing device 175.The knob 170 is biased (e.g., by a spring return) to an at-rest position P(AR) between opposing rotational ranges of motion R(R), R(L).",
"A first one of the opposing rotational ranges of motion R(R) is substantially equal to a second one of the opposing rotational ranges of motion R(L), R(R).",
"To provide a tactile indication of an amount of rotation of the knob 170, a force that biases the knob 170 toward the at-rest position P(AR) can increase (e.g., non-linearly) as a function of the amount of rotation of the knob 170 with respect to the at-rest position P(AR).",
"Additionally, the knob 170 can be configured with position indicating detents such that the driver can positively feel the at-rest position P(AR) and feel the ends of the opposing rotational ranges of motion R(L), R(R) approaching (e.g., soft end stops).",
"The movement sensing device 175 is configured for sensing movement of the knob 170 and outputting a corresponding signal (i.e., movement sensing device signal) to the trailer assist backup input apparatus 125 shown in FIG.",
"1.The movement sensing device signal is generated as a function of an amount of rotation of the knob 170 with respect to the at-rest position P(AR), a rate movement of the knob 170, and/or a direction of movement of the knob 170 with respect to the at-rest position P(AR).",
"As will be discussed below in greater detail, the at-rest position P(AR) of the knob 170 corresponds to a movement sensing device signal indicating that the vehicle 100 should be steered such that the trailer 110 is backed along a substantially straight path (zero trailer curvature request from the driver) as defined by a centerline longitudinal axis of the trailer 110 when the knob 170 was returned to the at-rest position P(AR) and a maximum clockwise and anti-clockwise position of the knob 170 (i.e., limits of the opposing rotational ranges of motion R(R), R(L)) each correspond to a respective movement sensing device signal indicating a tightest radius of curvature (i.e., most acute trajectory) of a path of travel of the trailer 110 that is possible without the corresponding vehicle steering information causing a jackknife condition.",
"In this regard, the at-rest position P(AR) is a zero curvature commanding position with respect to the opposing rotational ranges of motion R(R), R(L).",
"It is disclosed herein that a ratio of a commanded curvature of a path of a trailer (e.g., radius of a trailer trajectory) and a corresponding amount of rotation of the knob can vary (e.g., non-linearly) over each one of the opposing rotational ranges of motion P(L), P(R) of the knob 170.It is also disclosed therein that the ratio can be a function of vehicle speed, trailer geometry, vehicle geometry, hitch geometry and/or trailer load.",
"Use of the knob 170 decouples trailer steering inputs from being made at a steering wheel of the vehicle 100.In use, as a driver of the vehicle 100 backs the trailer 110, the driver can turn the knob 170 to indicate a desired curvature of a path of the trailer 110 to follow and returns the knob 170 to the at-rest position P(AR) for causing the trailer 110 to be backed along a straight line.",
"Accordingly, in embodiments of trailer backup assist systems where the steering wheel remains physically coupled to the steerable wheels of a vehicle during backup of an attached trailer, a rotatable control element configured in accordance with the disclosed subject matter (e.g., the knob 170) provides a simple and user-friendly means of allowing a driver of a vehicle to input trailer steering commands.",
"It is disclosed herein that a rotational control input device configured in accordance with embodiments of the disclosed subject matter (e.g., the knob 170 and associated movement sensing device) can omit a means for being biased to an at-rest position between opposing rotational ranges of motion.",
"Lack of such biasing allows a current rotational position of the rotational control input device to be maintained until the rotational control input device is manually moved to a different position.",
"Preferably, but not necessarily, when such biasing is omitted, a means is provided for indicating that the rotational control input device is positioned in a zero curvature commanding position (e.g., at the same position as the at-rest position in embodiments where the rotational control input device is biased).",
"Examples of means for indicating that the rotational control input device is positioned in the zero curvature commanding position include, but are not limited to, a detent that the rotational control input device engages when in the zero curvature commanding position, a visual marking indicating that the rotational control input device is in the zero curvature commanding position, an active vibratory signal indicating that the rotational control input device is in or approaching the zero curvature commanding position, an audible message indicating that the rotational control input device is in of approaching the zero curvature commanding position, and the like.",
"It is also disclosed herein that embodiments of the disclosed subject matter can be configured with a control input device that is not rotational (i.e., a non-rotational control input device).",
"Similar to a rotational control input device configured in accordance with embodiments of the disclosed subject matter (e.g., the knob 170 and associated movement sensing device), such a non-rotational control input device is configured to selectively provide a signal causing a trailer to follow a path of travel segment that is substantially straight and to selectively provide a signal causing the trailer to follow a path of travel segment that is substantially curved.",
"Examples of such a non-rotational control input device include, but are not limited to, a plurality of depressible buttons (e.g., curve left, curve right, and travel straight), a touch screen on which a driver traces or otherwise inputs a curvature for path of travel commands, a button that is translatable along an axis for allowing a driver to input path of travel commands, or joystick type input and the like.",
"The trailer backup steering input apparatus 125 can be configured to provide various feedback information to a driver of the vehicle 100.Examples of situation that such feedback information can include, but are not limited to, a status of the trailer backup assist system 105 (e.g., active, in standby (e.g., when driving forward to reduce the hitch angle and zero hitch angle to remove bias), faulted, inactive, etc.",
"), that a curvature limit has been reached (i.e., maximum commanded curvature of a path of travel of the trailer 110), and/or a graphical representation of the vehicle and trailer orientation state.",
"To this end, the trailer backup steering input apparatus 125 can be configured to provide a tactile feedback signal (e.g., a vibration through the knob 170) as a warning if any one of a variety of conditions occur.",
"Examples of such conditions include, but are not limited to, the trailer 110 approaching jackknife, the trailer backup assist system 105 has had a failure, the trailer backup assist system 105 has detected a fault, the trailer backup assist system 105 or other system of the vehicle 100 has predicted a collision on the present path of travel of the trailer 110, the trailer backup system 105 has restricted a commanded curvature of a trailer's path of travel (e.g., due to excessive speed or acceleration of the vehicle 100), and the like.",
"Still further, it is disclosed that the trailer backup steering input apparatus 125 can use illumination (e.g., an LED 180) and/or an audible signal output (e.g., an audible output device 185 or through attached vehicle audio speakers) to provide certain feedback information (e.g., notification/warning of an unacceptable trailer backup condition).",
"Referring now to FIGS.",
"2 and 3, an example of using the trailer backup steering input apparatus 125 for dictating a curvature of a path of travel (POT) of a trailer (i.e., the trailer 110 shown in FIG.",
"1) while backing up the trailer with a vehicle (i.e., the vehicle 100 in FIGS.",
"1 and 2) is shown.",
"In preparation of backing the trailer 110, the driver of the vehicle 100 drives the vehicle 100 forward along a pull-thru path (PTP) to position the vehicle 100 and trailer 110 at a first backup position B1.In the first backup position B1, the vehicle 100 and trailer 110 are longitudinally aligned with each other such that a longitudinal centerline axis L1 of the vehicle 100 is aligned with (e.g., parallel with or coincidental with) a longitudinal centerline axis L2 of the trailer 110.It is disclosed herein that such alignment of the longitudinal axes L1, L2 at the onset of an instance of trailer backup functionality is not a requirement for operability of a trailer backup assist system configured in accordance with the disclosed subject matter.",
"After activating the trailer backup assist system 105 (e.g., before, after, or during the pull-thru sequence), the driver begins to back the trailer 110 by reversing the vehicle 100 from the first backup position B1.So long as the knob 170 of the trailer backup steering input apparatus 125 remains in the at-rest position P(AR), the trailer backup assist system 105 will steer the vehicle 100 as necessary for causing the trailer 110 to be backed along a substantially straight path of travel as defined by the longitudinal centerline axis L2 of the trailer 110 at the time when backing of the trailer 110 began.",
"When the trailer reaches the second backup position B2, the driver rotates the knob 170 to command the trailer 110 to be steered to the right (i.e., a knob position R(R) clockwise rotation).",
"Accordingly, the trailer backup assist system 105 will steer the vehicle 100 for causing the trailer 110 to be steered to the right as a function of an amount of rotation of the knob 170 with respect to the at-rest position P(AR), a rate movement of the knob 170, and/or a direction of movement of the knob 170 with respect to the at-rest position P(AR).",
"Similarly, the trailer 110 can be commanded to steer to the left by rotating the knob 170 to the left.",
"When the trailer reaches backup position B3, the driver allows the knob 170 to return to the at-rest position P(AR) thereby causing the trailer backup assist system 105 to steer the vehicle 100 as necessary for causing the trailer 110 to be backed along a substantially straight path of travel as defined by the longitudinal centerline axis L2 of the trailer 110 at the time when the knob 170 was returned to the at-rest position P(AR).",
"Thereafter, the trailer backup assist system 105 steers the vehicle 100 as necessary for causing the trailer 110 to be backed along this substantially straight path to the fourth backup position B4.In this regard, arcuate portions of a path of travel POT of the trailer 110 are dictated by rotation of the knob 170 and straight portions of the path of travel POT are dictated by an orientation of the centerline longitudinal axis L2 of the trailer when the knob 170 is in/returned to the at-rest position P(AR).",
"In order to activate the trailer backup assist system described above in FIGS.",
"1-3, the driver interacts with the trailer backup assist system and the trailer backup assist system interacts with the vehicle environment.",
"The trailer backup assist system automatically steers as the driver reverses the vehicle.",
"As discussed above, the driver controls the trailer trajectory by using a steering knob to input desired trailer curvature.",
"The trailer backup assist algorithm determines the vehicle steering angle to achieve the desired trailer curvature, and the driver controls the throttle and brake while the trailer backup assist system controls the steering.",
"FIG.",
"4 shows a method 200 for implementing trailer backup assist functionality in accordance with one embodiment.",
"In a preferred embodiment, the method 200 for implementing trailer backup assist functionality can be carried out using the trailer backup assist architecture discussed above in reference to the vehicle 100 and trailer 110 of FIG.",
"1.Accordingly, trailer steering information is provided through use of a rotational control input device (e.g., the knob 170 discussed in reference to FIG.",
"2).",
"An operation 202 is performed for receiving a trailer backup assist request.",
"Examples of receiving the trailer backup assist request include activating the trailer backup assist system and providing confirmation that the vehicle and trailer are ready to be backed.",
"After receiving a trailer backup assist request (i.e., while the vehicle is being reversed), an operation 204 is performed for receiving a trailer backup information signal.",
"Examples of information carried by the trailer backup information signal include, but are not limited to, information from the trailer backup steering input apparatus 125, information from the hitch angle detection apparatus 130, information from the power steering assist control module 135, information from the brake system control module 145, and information from the powertrain control module 150.It is disclosed herein that information from the trailer backup steering input apparatus 125 preferably includes trailer path curvature information characterizing a desired curvature for the path of travel of the trailer, such as provided by the trailer backup steering input apparatus 125 discussed above in reference to FIGS.",
"1 and 2.In this manner, the operation 204 for receiving the trailer backup information signal can include receiving trailer path curvature information characterizing the desired curvature for the path of travel of the trailer.",
"If the trailer backup information signal indicates that a change in curvature of the trailer's path of travel is requested (i.e., commanded via the knob 170), an operation 206 is performed for determining vehicle steering information for providing the requested change in curvature of the trailer's path of travel.",
"Otherwise, an operation 208 is performed for determining vehicle steering information for maintaining a current straight-line heading of the trailer (i.e., as defined by the longitudinal centerline axis of the trailer).",
"Thereafter, an operation 210 is performed for providing the vehicle steering information to a power steering assist system of the vehicle, followed by an operation 212 being performed for determining the trailer backup assist status.",
"If it is determined that trailer backup is complete, an operation 214 is performed for ending the current trailer backup assist instance.",
"Otherwise the method 200 returns to the operation 204 for receiving trailer backup information.",
"Preferably, the operation for receiving the trailer backup information signal, determining the vehicle steering information, providing the vehicle steering information, and determining the trailer backup assist status are performed in a monitoring fashion (e.g., at a high rate of speed of a digital data processing device).",
"Accordingly, unless it is determined that reversing of the vehicle for backing the trailer is completed (e.g., due to the vehicle having been successfully backed to a desired location during a trailer backup assist instance, the vehicle having to be pulled forward to begin another trailer backup assist instance, etc.",
"), the method 200 will continually be performing the operations for receiving the trailer backup information signal, determining the vehicle steering information, providing the vehicle steering information, and determining the trailer backup assist status.",
"It is disclosed herein that the operation 206 for determining vehicle steering information for providing the requested change in curvature of the trailer's path of travel preferably includes determining vehicle steering information as a function of trailer path curvature information contained within the trailer backup information signal.",
"As will be discussed below in greater detail, determining vehicle steering information can be accomplished through a low order kinematic model defined by the vehicle and the trailer.",
"Through such a model, a relationship between the trailer path curvature and commanded steering angles of steered wheels of the vehicle can be generated for determining steering angle changes of the steered wheels for achieving a specified trailer path curvature.",
"In this manner, the operation 206 for determining vehicle steering information can be configured for generating information necessary for providing trailer path curvature control in accordance with the disclosed subject matter.",
"In some embodiments of the disclosed subject matter, the operation 210 for providing the vehicle steering information to the power steering assist system of the vehicle causes the steering system to generate a corresponding steering command as a function of the vehicle steering information.",
"The steering command is interpretable by the steering system and is configured for causing the steering system to move steered wheels of the steering system for achieving a steered angle as specified by the vehicle steering information.",
"Alternatively, the steering command can be generated by a controller, module or computer external to the steering system (e.g., a trailer backup assist control module) and be provided to the steering system.",
"In parallel with performing the operations for receiving the trailer backup information signal, determining the vehicle steering information, providing the vehicle steering information, and determining the trailer backup assist status, the method 200 performs an operation 216 for monitoring the trailer backup information for determining if an unacceptable trailer backup condition exists.",
"Examples of such monitoring include, but are not limited to assessing a hitch angle to determine if a hitch angle threshold is exceeded, assessing a backup speed to determine if a backup speed threshold is exceeded, assessing vehicle steering angle to determine if a vehicle steering angle threshold is exceeded, assessing other operating parameters (e.g., vehicle longitudinal acceleration, throttle pedal demand rate and hitch angle rate) for determining if a respective threshold value is exceeded, and the like.",
"Backup speed can be determined from wheel speed information obtained from one or more wheel speed sensors of the vehicle.",
"If it is determined that an unacceptable trailer backup condition exists, an operation 218 is performed for causing the current path of travel of the trailer to be inhibited (e.g., stopping motion of the vehicle), followed by the operation 214 being performed for ending the current trailer backup assist instance.",
"It is disclosed herein that prior to and/or in conjunction with causing the current trailer path to be inhibited, one or more actions (e.g., operations) can be implemented for providing the driver with feedback (e.g., a warning) that such an unacceptable hitch angle condition is impending or approaching.",
"In one example, if such feedback results in the unacceptable hitch angle condition being remedied prior to achieving a critical condition, the method can continue with providing trailer backup assist functionality in accordance with operations 204-212.Otherwise, the method can proceed to operation 214 for ending the current trailer backup assist instance.",
"In conjunction with performing the operation 214 for ending the current trailer backup assist instance, an operation can be performed for controlling movement of the vehicle to correct or limit a jackknife condition (e.g., steering the vehicle, decelerating the vehicle, limiting magnitude and/or rate of driver requested trailer curvature input, limiting magnitude and/or rate of the steering command, and/or the like to preclude the hitch angle from being exceeded).",
"Curvature Control Algorithm Turning now to a discussion of a kinematic model used to calculate a relationship between a curvature of a path of travel of a trailer and the steering angle of a vehicle towing the trailer, a low order kinematic model can be desirable for a trailer backup assist system configured in accordance with some embodiments.",
"To achieve such a low order kinematic model, certain assumptions are made with regard to parameters associated with the vehicle/trailer system.",
"Examples of such assumptions include, but are not limited to, the trailer being backed by the vehicle at a relatively low speed, wheels of the vehicle and the trailer having negligible (e.g., no) slip, tires of the vehicle having negligible (e.g., no) lateral compliance, tires of the vehicle and the trailer having negligible (e.g., no) deformation, actuator dynamics of the vehicle being negligible, the vehicle and the trailer exhibiting negligible (e.g., no) roll or pitch motions.",
"As shown in FIG.",
"5, for a system defined by a vehicle 302 and a trailer 304, the kinematic model 300 is based on various parameters associated with the vehicle 302 and the trailer 304.These kinematic model parameters include: δ: steering angle at steered front wheels 306 of the vehicle 302; α: yaw angle of the vehicle 302; β: yaw angle of the trailer 304; γ: hitch angle (γ=β−α); W: wheel base of the vehicle 302; L: length between hitch point 308 and rear axle 310 of the vehicle 302; D: length between hitch point 308 and axle length 312 of the trailer 304 (axle length 312 may be an effective, or equivalent, axle length for a trailer having a multiple axle configuration; and r2: curvature radius for the trailer 304.The kinematic model 300 of FIG.",
"5 reveals a relationship between trailer path radius of curvature r2 at the midpoint 314 of an axle 312 of the trailer 304, steering angle δ of the steered wheels 306 of the vehicle 302, and the hitch angle γ.",
"As shown in the equation below, this relationship can be expressed to provide the trailer path curvature κ2 such that, if γ is given, the trailer path curvature κ2 can be controlled based on regulating the steering angle δ (where β is trailer yaw rate and η is trailer velocity).",
"κ 2 - 1 r 2 - β • η • - ( W + KV 2 g ) sin γ + L cos γ tan δ D ( ( W + KV 2 g ) cos γ - L sin γ tan δ ) Or, this relationship can be expressed to provide the steering angle δ as a function of trailer path curvature κ2 and hitch angle γ. δ = tan - 1 ( ( W + KV 2 g ) [ κ 2 D cos γ - sin γ ] DL κ 2 sin γ + L cos γ ) = F ( γ , κ 2 , K ) Accordingly, for a particular vehicle and trailer combination, certain kinematic model parameters (e.g., D, W and L) are constant and assumed known.",
"V is the vehicle longitudinal speed and g is the acceleration due to gravity.",
"K is a speed dependent parameter which when set to zero makes the calculation of steering angle independent of vehicle speed.",
"For example, vehicle-specific kinematic model parameters can be predefined in an electronic control system of a vehicle and trailer-specific kinematic model parameters can be inputted by a driver of the vehicle.",
"Trailer path curvature κ2 is determined from the driver input via a trailer backup steering input apparatus.",
"Through the use of the equation for providing steering angle, a corresponding steering command can be generated for controlling a steering system (e.g., an actuator thereof) of the vehicle.",
"FIG.",
"6 shown an example of a trailer path curvature function plot 400 for a rotary-type trailer backup steering input apparatus (e.g., the trailer backup steering input apparatus 125 discussed above in reference to FIGS.",
"1 and 2).",
"A value representing trailer path curvature (e.g., trailer path curvature κ2) is provided as an output signal from the rotary-type trailer backup steering input apparatus as a function of user input movement.",
"In this example, a curve 402 specifying trailer path curvature relative to user input (e.g., amount of rotation) at a rotary input device (e.g., a knob) is defined by a cubic function.",
"However, a skilled person will appreciate that embodiments of the disclosed subject matter are not limited to any particular function between a magnitude and/or rate of input at a trailer backup steering input apparatus (e.g., knob rotation) and a resulting trailer path curvature value.",
"Jackknife Detection Referring to FIG.",
"5, in preferred embodiments of the disclosed subject matter, it is desirable to limit the potential for the vehicle 302 and the trailer 304 to attain a jackknife angle (i.e., the vehicle/trailer system achieving a jackknife condition).",
"A jackknife angle γ(j) refers to a hitch angle γ that while backing cannot be overcome by the maximum steering input for a vehicle such as, for example, the steered front wheels 306 of the vehicle 302 being moved to a maximum steered angle δ at a maximum rate of steering angle change.",
"The jackknife angle γ(j) is a function of a maximum wheel angle for the steered wheel 306 of the vehicle 302, the wheel base W of the vehicle 302, the distance L between hitch point 308 and the rear axle 310 of the vehicle 302, and the length D between the hitch point 308 and the effective axle 312 of the trailer 304 when the trailer has multiple axles.",
"The effective axle 312 may be the actual axle for a single axle trailer or an effective axle location for a trailer with multiple axles.",
"When the hitch angle γ for the vehicle 302 and the trailer 304 achieves or exceeds the jackknife angle γ(j), the vehicle 302 must be pulled forward to reduce the hitch angle γ.",
"Thus, for limiting the potential for a vehicle/trailer system attaining a jackknife angle, it is preferable to control the yaw angle of the trailer while keeping the hitch angle of the vehicle/trailer system relatively small.",
"Referring to FIGS.",
"5 and 7, a steering angle limit for the steered front wheels 306 requires that the hitch angle γ cannot exceed the jackknife angle γ (j), which is also referred to as a critical hitch angle.",
"Thus, under the limitation that the hitch angle γ cannot exceed the jackknife angle γ (j), the jackknife angle γ (j) is the hitch angle γ that maintains a circular motion for the vehicle/trailer system when the steered wheels 306 are at a maximum steering angle δ(max).",
"The steering angle for circular motion with hitch angle is defined by the following equation.",
"tan δ max = w sin γ max D + L cos γ max Solving the above equation for hitch angle allows jackknife angle γ(j) to be determined.",
"This solution, which is shown in the following equation, can be used in implementing trailer backup assist functionality in accordance with the disclosed subject matter for monitoring hitch angle in relation to jackknife angle.",
"cos γ _ = - b ± b 2 - 4 a c 2 a where, a=L2 tan2 δ(max)+W2; b=2 LD tan2 δ(max); and c=D2 tan2 δ(max)−W2.In certain instances of backing a trailer, a jackknife enabling condition can arise based on current operating parameters of a vehicle in combination with a corresponding hitch angle.",
"This condition can be indicated when one or more specified vehicle operating thresholds are met while a particular hitch angle is present.",
"For example, although the particular hitch angle is not currently at the jackknife angle for the vehicle and attached trailer, certain vehicle operating parameters can lead to a rapid (e.g., uncontrolled) transition of the hitch angle to the jackknife angle for a current commanded trailer path curvature and/or can reduce an ability to steer the trailer away from the jackknife angle.",
"One reason for a jackknife enabling condition is that trailer curvature control mechanisms (e.g., those in accordance with the disclosed subject matter) generally calculate steering commands at an instantaneous point in time during backing of a trailer.",
"However, these calculations will typically not account for lag in the steering control system of the vehicle (e.g., lag in a steering EPAS controller).",
"Another reason for the jackknife enabling condition is that trailer curvature control mechanisms generally exhibit reduced steering sensitivity and/or effectiveness when the vehicle is at relatively high speeds and/or when undergoing relatively high acceleration.",
"Jackknife Countermeasures FIG.",
"8 shows a method 500 for implementing jackknife countermeasures functionality in accordance with an embodiment of the disclosed subject matter for a vehicle and attached trailer.",
"Trailer backup assist functionality in accordance with the disclosed subject matter can include jackknife countermeasures functionality.",
"Alternatively, jackknife countermeasures functionality in accordance with one embodiment can be implemented separately from other aspects of trailer backup assist functionality.",
"The method 500 begins when operation 502 is performed for receiving jackknife determining information characterizing a jackknife enabling condition of the vehicle-trailer combination at a particular point in time (e.g., at the point in time when the jackknife determining information was sampled).",
"Examples of the jackknife determining information includes, but are not limited to, information characterizing a hitch angle, information characterizing a vehicle accelerator pedal transient state, information characterizing a speed of the vehicle, information characterizing longitudinal acceleration of the vehicle, information characterizing a brake torque being applied by a brake system of the vehicle, information characterizing a powertrain torque being applied to driven wheels of the vehicle, and information characterizing the magnitude and rate of driver requested trailer curvature.",
"The operation 502 for receiving jackknife determining information can be the first operation in a sampling process where jackknife determining information is sampled upon initiation of an instance of implementing jackknife countermeasures functionality.",
"In this regard, jackknife determining information would be continually monitored such as, for example, by an electronic control unit (ECU) that carries out trailer backup assist (TBA) functionality.",
"As discussed above in reference to FIG.",
"5, a kinematic model representation of the vehicle and the trailer can be used to determine a jackknife angle for the vehicle-trailer combination.",
"However, the disclosed subject matter is not unnecessarily limited to any specific approach for determining the jackknife angle.",
"After receiving the jackknife determining information, an operation 504 is performed for assessing the jackknife determining information for determining if the vehicle-trailer combination attained the jackknife enabling condition at the particular point in time.",
"The objective of the operation 504 for assessing the jackknife determining information is determining if a jackknife enabling condition has been attained at the point in time defined by the jackknife determining information.",
"If it is determined that a jackknife enabling condition is not present at the particular point in time, the method 500 returns to the operation 502 for receiving another instance of the jackknife determining information.",
"If it is determined that a jackknife enabling condition is present at the particular point in time, an operation 506 is performed for determining an applicable countermeasure or countermeasures to implement.",
"Accordingly, in some embodiments, an applicable countermeasure will be selected dependent upon a parameter identified as being a key influencer of the jackknife enabling condition.",
"However, in other embodiments, an applicable countermeasure will be selected as being most able to readily alleviate the jackknife enabling condition.",
"In still other embodiment, a predefined countermeasure or predefined set of countermeasures may be the applicable countermeasure(s).",
"The objective of a countermeasure in the context of the disclosed subject matter (i.e., a jackknife reduction countermeasure) is to alleviate a jackknife enabling condition.",
"To this end, such a countermeasure can be configured to alleviate the jackknife enabling condition using a variety of different strategies.",
"In a vehicle speed sensitive countermeasure strategy, actions taken for alleviating the jackknife enabling condition can include overriding and/or limiting driver requested trailer radius of curvature (e.g., being requested via a trailer backup steering input apparatus configured in accordance with the disclosed subject matter) as a function of vehicle speed (e.g., via a lookup table correlating radius of curvature limits to vehicle speed as shown in FIG.",
"6).",
"In a countermeasure strategy where trailer curvature requests are limited as a function of speed and driver curvature command transient rates, actions taken for alleviating the jackknife enabling condition can include rate limiting trailer curvature command transients as requested by a driver above a predefined vehicle speed whereas, under the predefined vehicle speed, the as-requested trailer curvature are not rate limited.",
"In a torque limiting countermeasure strategy, actions taken for alleviating the jackknife enabling condition can include application of full available powertrain torque being inhibited when the jackknife enabling condition is present while the vehicle is above a predefined speed and application of full available powertrain torque being allowed when the vehicle speed is reduced below the predefined speed while in the torque inhibiting mode.",
"As opposed to a fixed predefined speed, the torque limiting countermeasure strategy can utilize a speed threshold that is a function of hitch angle (i.e., speed threshold inversely proportional to hitch angle acuteness).",
"In a driver accelerator pedal transient detection countermeasure strategy, actions taken for alleviating the jackknife enabling condition can include overriding and/or limiting driver requested trailer radius of curvature as a function of transient accelerator pedal requests (e.g., requested trailer radius of curvature limited when a large accelerator pedal transient is detected).",
"In a hitch angle rate sensitive countermeasure strategy, actions taken for alleviating the jackknife enabling condition can include using hitch angle rate in a predefined or calculated mapping with current hitch angle position to limit driver requested trailer radius of curvature.",
"Accordingly, in view of the disclosures made herein, a skilled person will appreciate that embodiments of the disclosed subject matter are not unnecessarily limited to a countermeasure strategy of any particular configuration.",
"As disclosed above, implementation of trailer backup assist functionality in accordance with the disclosed subject matter can utilize a kinematic model for determining steering control information, jackknife enabling conditions, and jackknife angle.",
"Such a kinematic model has many parameters than can influence trailer curvature control effectiveness.",
"Examples of these parameters include, but are not limited to, the vehicle wheelbase, understeer gradient gain, vehicle track width, maximum steer angle at the vehicle front wheels, minimum turning radius of vehicle, maximum steering rate able to be commanded by the steering system, hitch ball to trailer axle length, and vehicle rear axle to hitch ball length.",
"Sensitivity analysis for a given kinematic model can be used to provide an understanding (e.g., sensitivity) of the relationships between such parameters, thereby providing information necessary for improving curvature control performance and for reducing the potential for jackknife enabling conditions.",
"For example, through an understanding of the sensitivity of the parameters of a kinematic model, scaling factors can be used with speed dependent jackknife countermeasures to reduce jackknife potential (e.g., for special applications such as short wheelbase conditions).",
"Still referring to FIG.",
"8, after determining the applicable countermeasure(s), an operation 508 is performed for implementing the chosen jackknife countermeasure(s) and an operation 510 is performed for initiating a jackknife warning.",
"As discussed above in regard to countermeasure strategies, implementing the jackknife countermeasure(s) can include commanding a speed controlling system of the vehicle to transition to an altered state of operation in which a speed of the vehicle is reduced, commanding the steering control system of the vehicle to transition to an altered state of operation in which a radius of curvature of a path of the trailer is increased, command the steering control system of the vehicle to transition to an altered state of operation in which a decrease in the radius of the curvature of the path of the trailer is inhibited, commanding a brake control system of the vehicle to apply brake torque to reduce vehicle speed/inhibit vehicle acceleration, and/or commanding a powertrain control system of the vehicle to inhibit full available powertrain torque from being delivered to driven wheels of the vehicle until another jackknife enabling parameter (e.g., vehicle speed) is below a defined threshold.",
"In certain embodiments of the disclosed subject matter, the jackknife warning is provided to the driver using at least one vehicle control system through which the jackknife countermeasure is implemented.",
"Speed reduction, in addition to applying the brakes, can be accomplished by any number of means such as, for example, limiting throttle inputs (e.g., via a terrain management feature) and/or transitioning a transmission to a reverse low gear if the vehicle is equipped with a multi-range reverse gear transmission.",
"Examples of such system-specific warning approach include, but are not limited to, providing a warning through an accelerator pedal of the vehicle (e.g., via haptic feedback) if the countermeasure includes limiting speed of the vehicle and/or providing a warning through an input element (e.g., knob) of a trailer backup steering input apparatus of the vehicle (e.g., via haptic feedback if the countermeasure includes limiting driver requested trailer radius of curvature), through haptic seat vibration warning, through a visual warning (e.g., through a visual display apparatus of the towing vehicle) and/or through audible warnings (e.g., through an audio output apparatus of the towing vehicle), or the like.",
"One embodiment of utilizing warnings relating to vehicle speed as it relates to onset or presence of a jackknife enabling condition includes implementation of a dual stage warning.",
"For example, when a backing speed of the vehicle increases sufficiently for causing a speed of the vehicle to reach a lower (i.e., first) speed threshold during backing of the trailer, a driver of the vehicle would be provided with a first warning indication (e.g., via haptic, audible, and/or visual means as implemented by the trailer backup assist system) for informing the driver that there is the need to reduce the speed of the vehicle to alleviate or preclude the jackknife enabling condition.",
"If the driver does not correspondingly respond by causing a speed of the vehicle to be reduced (or not to further increase) and the vehicle continues to gain speed such that it passes a higher (i.e., a second) speed threshold, the driver of the vehicle would be provided with a second warning indication (e.g., a more severe haptic, audible, and/or visual means as implemented by the trailer backup assist system) for informing the driver that there is an immediate need to reduce the speed of the vehicle to alleviate or preclude the jackknife enabling condition.",
"The first and/or the second speed indication warnings can be implemented in conjunction with a respective speed limiting countermeasure measures (e.g., the trailer backup assist system causing activation of a brake system of the vehicle and/or reducing a throttle position of the vehicle).",
"Human Machine Interface In order to implement the control features discussed above with respect to methods described in FIG.",
"5 and FIG.",
"8, a driver must interact with the trailer backup assist system 105 to configure the system 105.The vehicle 100 is also equipped, as shown in FIG.",
"9, with a human machine interface (HMI) device 102 to implement trailer backup assist functionality through driver interaction with the HMI device 102.FIG.",
"9 shows an example of an HMI device 102 in the vehicle that a driver uses to interact with the trailer backup assist system 105.The driver is presented with multiple menus 104 (only one example menu is shown in FIG.",
"9) displayed by way of the HMI 102.The HMI menus 104 assist the driver through modules (shown in FIGS.",
"10 and 11) that setup 600, calibrate 700, and activate 800 the trailer backup assist system 105 so that control methods 200, 500 may be implemented to assist the driver with the backup of the trailer shown generally as a flow diagram in FIGS.",
"10 and 11, and to be discussed in greater detail later herein.",
"Each module is directed to particular elements, or features, which are used to configure the trailer backup assist system to accurately implement control methods 200, 500.While each module is described with reference to particular features of the disclosed subject matter, it should be noted that each module is not necessarily limited to the particular features described in the examples herein.",
"It is possible to rearrange the modules or to replace elements or features of a module without departing from the scope of the disclosed subject matter.",
"The trailer backup assist system 105 will guide a driver through the steps necessary to connect a trailer and attach a target.",
"The driver may activate the setup by way of the backup steering input apparatus 125, for example by turning or pushing the rotary knob, or my merely making a selection for the trailer backup assist system from a menu on the HMI device 102.Referring to FIG.",
"10, a driver initiates the trailer backup assist system through the trailer backup assist steering input apparatus.",
"In the case of a rotary knob, the driver presses or rotates the knob to initiate the trailer backup assist system.",
"The system will guide the driver through the steps of connecting 580 a compatible trailer 110.A compatible trailer is one that pivots at a single point relative to the vehicle and behind the rear axle of the vehicle.",
"Once the system is selected by either the trailer backup steering input apparatus 125 or the HMI device 102, the system will guide the driver to prepare the vehicle and vehicle trailer combination as necessary.",
"The vehicle 100 should be turned “on” and the vehicle 100 should be in “park” 590.In the event the vehicle 100 is on but is traveling at a speed that is greater than a predetermined limit, for example five miles per hour, the trailer backup assist system 105 will become inactive and inaccessible to the driver.",
"The trailer backup assist system 105 setup module 600 will not begin or will be exited 585.If the type of trailer 110 selected by the driver is a trailer 110 that is not compatible with the trailer backup assist system 105, the setup module 600 will be exited 585 or will not begin.",
"In the event, the trailer 110 is compatible with the trailer backup assist system 105, the setup module 600 verifies that the vehicle 100 gear shift mechanism is in “park.” Again, in the event the vehicle is not “on” and the gear shift mechanism is not on “park,” the setup module will not begin 585.Upon connection 580 of a compatible trailer 110, the vehicle 100 being “on” 590 and the vehicle 100 being in “park” 590, the HMI 102 will present a menu 104 that has a “Towing” mode option to be selected by the driver.",
"The driver selects “Towing” mode and a menu 104 is presented that provides a “Trailer Options” selection.",
"The driver then selects a “Trailer Options” mode from the “Towing” menu.",
"The driver is prompted to either “add a trailer” or “select a trailer” from a menu 104 presented on the HMI device and the “Setup” module 600 has begun.",
"For certain camera-based hitch angle detection systems, an operation 602 is performed wherein a warning menu may be presented to the driver, by way of the HMI, informing the driver that the trailer must be in a straight line, meaning there is no angle at the hitch between the vehicle and the trailer.",
"The warning indicates that the driver may need to take corrective action, for example, pull the vehicle forward in order to align the trailer and the vehicle as required for the setup 600.A generic or static graphic may be presented by way of the HMI 102 to assist the driver in visually recognizing the alignment between the trailer 110 and the vehicle 100 that is necessary in order to properly setup and calibrate the trailer backup assist system 105.The driver applies any corrections 603 in that the driver makes any necessary adjustment he has been alerted to and indicates, by acknowledging that corrective actions have been applied 603 and that the trailer is in line with the vehicle.",
"Other hitch angle detection systems may not need the driver to straighten the trailer during setup mode.",
"To aid the driver in the setup process, the reverse back lights, or any other supplemental lighting that may be available on the vehicle, are illuminated 604.In the event the trailer is a new trailer, one that has not been attached to the vehicle before or has not been previously stored in the trailer backup assist system, the driver is presented 606 with an option to either name the trailer or select a previously stored trailer configuration.",
"Naming the trailer 608 allows the trailer to be easily identified the next time it is attached to the vehicle so that the driver does not have to repeat the setup process.",
"The driver either enters a unique name to identify the trailer that is to be stored in the trailer backup assist system or selects a previously stored trailer configuration associated with the attached trailer.",
"The trailer backup assist system will not allow more than one trailer to have the same name.",
"Therefore, if a driver attempts to name a trailer using a name that has already been applied to a previously stored trailer configuration, the HMI will display a message to the driver indicating so and requesting the driver enter a different name for the trailer configuration.",
"In the case where a previously stored trailer configuration is available and selected 610 by the driver, certain steps in the setup process may be skipped.",
"The following discussion is directed to a first time trailer configuration for a camera-based hitch angle detection system.",
"The driver is instructed 612 to place a hitch angle target on the trailer that is used for calibration purposes.",
"A generic static image may be displayed on the HMI that provides direction to the driver as to placement of a target on the trailer that is used for hitch angle detection.",
"The target placement is dependent upon the type of trailer being towed and therefore, options may be presented to the driver to aid the driver in selecting an appropriate trailer type.",
"The static image may indicate areas that are acceptable for target placement as well as areas that are unacceptable for target placement.",
"The static image indicating the appropriate areas for attaching the target may be an overlay of the rear view of the trailer hitch.",
"Once the driver attaches the target to the trailer and indicates by way of the HMI that the target has been attached to the trailer the setup mode provides 614 visual feedback to the driver identifying that the target has been located, or acquired.",
"The driver acknowledges 616, by way of the HMI, that the target has been properly identified by the trailer backup assist system.",
"Similarly, for a previously stored trailer configuration, the trailer will already have a target placed thereon.",
"The trailer backup assist system will acquire the target and provide 614 visual feedback to the driver confirming acquisition of the target.",
"In the event the target is not acquired 614 after a predetermined amount of time lapses, the driver is notified 618 of the need to reposition the target and presented with possible corrective measures that may be taken.",
"Possible corrective measures may be presented to the driver such as cleaning the camera lens, cleaning the target, replacing the target if it has been damaged or faded, pulling the vehicle-trailer combination forward to improve lighting conditions around the camera and/or target, and moving the target to an acceptable location.",
"The driver applies the necessary corrections 603.As mentioned above, some hitch angle detection systems may not require the driver to attach a target to the trailer during set up mode.",
"The target and acquisition of the target are directed to camera-based hitch angle detection systems.",
"When the target is acquired 614 by the trailer backup assist system and the driver has acknowledged 616 the acquisition, the driver is then prompted through a series of menus to input 620 trailer measurement information that may be stored in the trailer backup assist system for a trailer configuration that is to be associated with the named trailer.",
"The next time the same trailer is attached to the vehicle, its unique trailer configuration will already be stored and progress through the setup module will be faster or, in some cases, may be skipped entirely.",
"Generic static images may be displayed at the HMI screen in order to assist the driver with the measurement information.",
"Visual examples, see FIG.",
"12, may be provided to aid the driver in identifying the location on the vehicle, the trailer or between the vehicle and trailer that the driver is being prompted to enter.",
"In addition, numerical limits for the driver entered measurements are set within the trailer backup assist system and may be displayed to the driver.",
"The driver may be warned about entered measurements that exceed the numerical limits.",
"Additionally, the measurement information requests that the driver is prompted to enter may be presented to the driver in the order that the measurements should be entered into the trailer backup assist system.",
"It should be noted that while measurement information is discussed above as being entered by the driver, various methods of entering measurement information may also be employed without departing from the scope of the disclosed subject matter.",
"For example, a system to automatically detect measurements using existing vehicle and trailer data including, but not limited to, vehicle speed, wheel rotation, steering wheel angle, vehicle to trailer relative angle, and a rate of change of the vehicle to hitch angle.",
"Examples of the measurement information may include a horizontal distance from the rear of the vehicle to the center of a hitch ball, a horizontal distance from the rear of the vehicle to a center of the target, a vertical distance from the target to the ground, and a horizontal offset of the target from a centerline of the hitch ball.",
"In the event the target is attached at other than the centerline of the hitch ball, then the trailer backup assist system must know which side of the vehicle the target is attached to, the passenger side or the driver side.",
"A menu on the HMI may be presented for the driver to indicate passenger side or driver side for the placement of the target.",
"The trailer backup assist system also needs to know the horizontal distance from the rear of the vehicle to a center of the axle or axles of the trailer.",
"The measurements may be entered in either English or metric units.",
"The driver is presented 622 with the option to revise any of the measurements before proceeding with the setup process.",
"Otherwise, the setup module 600 is complete 624 and the calibration module 700 begins.",
"The calibration module 700 is designed to calibrate the curvature control algorithm with the proper trailer measurements and calibrate the trailer backup assist system for any hitch angle offset that may be present.",
"After completing the setup module 600, the calibration module begins 700 and the driver is instructed 702 to pull the vehicle-trailer combination straight forward until a hitch angle sensor calibration is complete.",
"The HMI may notify 704 the driver, by way of a pop up or screen display that the vehicle-trailer combination needs to be pulled forward until calibration is complete.",
"When calibration is complete, the HMI may notify 704 the driver.",
"Any hitch angle offset value is stored 706 in memory, accessed as necessary by the curvature control algorithm, and the calibration module 700 ends 704.It should be noted that while hitch angle calibration is described above as may be requesting the driver pull forward information, various other methods of hitch angle calibration may also be employed without departing from the scope of the embodiment.",
"Upon completion of the setup module 600 and the calibration module 700, the activation module 800 may begin.",
"The activation module 800 is described with reference to FIG.",
"11.The activation module 800 is designed to activate automatic steering of the vehicle during trailer backup assist operations.",
"The driver is instructed 802 to place the vehicle in reverse.",
"Upon activation of the trailer backup assist system, the steering system will not accept any steering angle commands from any source other than the trailer backup assist system 804.The trailer setup 600 and calibration 700 modules must be completed and a current hitch angle must be within a predetermined operating range for the trailer backup assist system 806.The vehicle speed must also be less than a predetermined activation speed 808.In the event any one, or all, of these conditions 804, 806, 808 are not met, the driver is prompted to apply a corrective measure 810.The driver must confirm 814 that the corrective action has been taken in order for the control module to begin.",
"If a corrective action is taken, but the activation module deems it unacceptable, the driver will be instructed 810 to try another corrective action.",
"For steering systems where the steering wheel is directly coupled to the steered wheels of the vehicle, the driver cannot engage with the steering wheel during trailer backup assist.",
"If any steering wheel motion is obstructed, by the driver or otherwise, the trailer backup assist system will present instructions 810 to the driver to remove their hands from the steering wheel.",
"Activation 800 will be suspended or discontinued until the obstruction is removed.",
"If the vehicle speed exceeds a threshold speed or if the vehicle hitch angle is not acceptable, the driver will be prompted 810 to take corrective action.",
"Until corrective action is taken, accepted and acknowledged, the activation 800 and control 200, 500 modules will be interrupted.",
"When the driver moves the gear shift from “park” to “reverse” 802 and presses or turns a trailer backup steering input apparatus 125 a rear view camera image may appear in a display of the HMI.",
"If at any time during the reversing process the hitch angle becomes too large for the system to control the curvature of the trailer, the TBA will provide a warning to the driver to pull forward to reduce the hitch angle.",
"If at any time during the reversing process the system is unable to track the hitch angle target, the driver is presented with instructions to correct the problem.",
"If at any time the vehicle speed exceeds that predetermined activation speed, the driver is visually and audibly warned to stop or slow down.",
"When all of the conditions of the activation module are met and maintained, the control module may begin.",
"The control module executes the directives described above with reference to FIGS.",
"5 and 7.However, the activation module 800 includes a monitoring function 816 so that, if at any time during execution of the control module 200, 500 the control is interrupted, the driver is instructed to make necessary corrections.",
"In the event any one of the necessary corrections is not made, the control of the vehicle by way of the trailer backup assist system will end.",
"The driver may also intentionally end the control by exiting the system through a menu selection on the HMI or placing the vehicle in a gear setting that is other than park or reverse.",
"Referring now to instructions processible by a data processing device, it will be understood from the disclosures made herein that methods, processes and/or operations adapted for carrying out trailer backup assist functionality as disclosed herein are tangibly embodied by non-transitory computer readable medium having instructions thereon that are configured for carrying out such functionality.",
"The instructions are tangibly embodied for carrying out the method 200, 500, 600, 700 and 800 disclosed and discussed above and can be further configured for limiting the potential for a jackknife condition such as, for example, by monitoring jackknife angle through use of the equations discussed in reference to FIGS.",
"5 and 7 and/or by implementing jackknife countermeasures functionality discussed above in reference to FIG.",
"8.The instructions may be accessible by one or more data processing devices from a memory apparatus (e.g.",
"RAM, ROM, virtual memory, hard drive memory, etc.",
"), from an apparatus readable by a drive unit of a data processing system (e.g., a diskette, a compact disk, a tape cartridge, etc.)",
"or both.",
"Accordingly, embodiments of computer readable medium in accordance with the disclosed subject matter include a compact disk, a hard drive, RAM or other type of storage apparatus that has imaged thereon a computer program (i.e., instructions) configured for carrying out trailer backup assist functionality in accordance with the disclosed subject matter.",
"In a preferred embodiment of the disclosed subject matter, a trailer backup assist control module (e.g., the trailer backup assist control module 120 discussed above in reference to FIG.",
"1) comprises such a data processing device, such a non-transitory computer readable medium, and such instructions on the computer readable medium for carrying out trailer backup assist functionality (e.g., in accordance with the method 200 discussed above in reference to FIG.",
"2) and/or the method 500 discussed above in reference to FIG.",
"8 and/or the methods 600, 700 and 800 discussed above in reference to FIGS.",
"10 and 11.To this end, the trailer backup assist control module can comprise various signal interfaces for receiving and outputting signals.",
"For example, a jackknife enabling condition detector can include a device providing hitch angle information and hitch angle calculating logic of the trailer backup assist control module.",
"A trailer backup assist control module in the context of the disclosed subject matter can be any control module of an electronic control system that provides for trailer backup assist control functionality in accordance with the disclosed subject matter.",
"Furthermore, it is disclosed herein that such a control functionality can be implemented within a standalone control module (physically and logically) or can be implemented logically within two or more separate but interconnected control modules (e.g., of an electronic control system of a vehicle) In one example, trailer backup assist control module in accordance with the disclosed subject matter is implemented within a standalone controller unit that provides only trailer backup assist functionality.",
"In another example, trailer backup assist functionality in accordance with the disclosed subject matter is implemented within a standalone controller unit of an electronic control system of a vehicle that provides trailer backup assist functionality as well as one or more other types of system control functionality of a vehicle (e.g., anti-lock brake system functionality, steering power assist functionality, etc.).",
"In still another example, trailer backup assist functionality in accordance with the disclosed subject matter is implemented logically in a distributed manner whereby a plurality of control units, control modules, computers, or the like (e.g., an electronic control system) jointly carry out operations for providing such trailer backup assist functionality.",
"Trailer Target Placement and Monitoring The vehicle trailer backup assist system may utilize a target placed on the trailer to serve as the hitch angle detection component 155.In doing so, the trailer backup assist system may employ information acquired via image acquisition and processing of the target for use in the hitch angle detection apparatus 130, according to one embodiment.",
"According to other embodiments, the target may be used to identify if a connected trailer has changed, trailer connection or disconnection, and other trailer related information.",
"The target is an identifiable visual target that can be captured in an image by the video imaging camera and detected and processed via image processing.",
"According to one embodiment, the target may include an adhesive target, also referred to as a sticker, that may be adhered via adhesive on one side onto the trailer, preferably within a target placement zone, such that the camera and image processing may detect the target and its location on the trailer to determine trailer related information, such as the hitch angle between the trailer and the towing vehicle.",
"The trailer backup assist system may provide to the user one or more image(s) of the trailer target zone for proper placement of the target to assist with placement of the target on the trailer.",
"Additionally, the vehicle trailer backup assist system may monitor the target to determine if the target has been correctly placed within a desired target placement zone and provide feedback alert(s) to the user.",
"Further, the trailer backup assist system may monitor the trailer connection by monitoring the target to determine if the target has moved to determine whether the same trailer remains connected to the tow vehicle, and may initiate action in response thereto.",
"Further, the trailer backup assist system may monitor the hitch angle or the target to determine if the trailer may have been changed out (i.e., disconnected and replaced with another trailer), and may initiate action in response thereto.",
"Referring to FIG.",
"13, the vehicle trailer backup assist system 105 is shown including the hitch angle detection apparatus 130 and a target monitor controller 10 for monitoring the target, assisting with placement of the target, monitoring connection of the trailer, determining if the trailer has moved, and initiating certain actions.",
"The target monitor controller 10 may include a microprocessor 12 and/or other analog and/or digital circuitry for processing one or more routines.",
"Additionally, the target monitor controller 10 may include memory 14 for storing one or more routines including image processing routine(s) 16, a target placement assist routine 900, a target monitoring routine 920, an initial setup for target moved detection routine 940, a target moved detection routine 960, and a trailer connection monitoring routine 990.It should be appreciated that the target monitor controller 10 may be a standalone dedicated controller or may be a shared controller integrated with other control functions, such as integrated with the hitch angle detection apparatus 130, to process the images of the trailer and target and perform related functionality.",
"In one embodiment, the hitch angle detection apparatus 130 processes the acquired images of the target from the target monitor controller 10 and other information such as trailer length for use in determining the hitch angle between the trailer and the towing vehicle.",
"A camera 20 is shown as an input for providing video images to the target monitor controller 10 of the vehicle trailer backup assist system 105.The camera 20 may be a rearview camera mounted on the tow vehicle in a position and orientation to acquire images of the trailer towed by the vehicle rearward of the vehicle.",
"The camera 20 may include an imaging camera that generates one or more camera images of the trailer including the region where a target placement zone is expected to be located on the trailer.",
"The camera 20 may include a video imaging camera that repeatedly captures successive images of the trailer for processing by the target monitor controller 10.The target monitor controller 10 processes the one or more images from the camera 20 with one or more image processing routine(s) 16 to identify the target and its location on the trailer.",
"The target monitor controller 10 further processes the processed images in connection with one or more of routines 900, 920, 940, 960 and 990.The trailer monitor controller 10 may communicate with one or more devices including vehicle exterior alerts 24 which may include vehicle brake lights and vehicle emergency flashers for providing a visual alert and a vehicle horn for providing an audible alert.",
"Additionally, the trailer monitor controller may communicate with one or more vehicle human machine interfaces (HMIs) 25 including a vehicle display such as a center stack mounted navigation/entertainment display.",
"Further, the trailer monitor controller 10 may communicate via wireless communication 22 with one or more handheld or portable devices 26, such as one or more smartphones.",
"The portable device 26 may include a display 28 for displaying one or more images and other information to a user.",
"The portable device 26 may display one or more images of the trailer and the target location within a desired target placement zone on display 28.In addition, the portable device 26 may provide feedback information about the vehicle target connection including visual and audible alerts.",
"Referring to FIGS.",
"14-17, the placement of the target 30 onto trailer 110 using the target monitor controller 10 processing the target placement assist routine 900 is illustrated according to one exemplary embodiment.",
"In FIGS.",
"14 and 15, a tow vehicle 100 is shown towing a trailer 110.The trailer 110 has a trailer hitch connector in the form of a coupler assembly 114 connected to a vehicle hitch connector in the form of a receiver hitch and ball 15.The coupler assembly 114 latches onto the hitch ball 15 to provide a pivoting ball joint.",
"The trailer 110 is shown having a frame including a longitudinally extending bar or trailer tongue 112.A top horizontal surface of trailer tongue 112 is shown providing a desired target placement zone 32 for receiving the target 30.It should be appreciated that the trailer 110 may be configured in various shapes and sizes and may offer one or more other suitable target placement zones 32 for receiving the target 30.The target placement zone 32 defines the desired location for placement of the target 30.The vehicle 100 is equipped with a video imaging camera 20 shown located in an upper region of the vehicle tailgate at the rear of the vehicle 100.The video imaging camera 20 is elevated relative to the target placement zone(s) and has an imaging field of view and is located and oriented to capture one or more images of the trailer 110 including a region containing one or more desired target placement zone(s).",
"It should be appreciated that one or more cameras may be located at other locations on the vehicle 100 to acquire images of the trailer 110 and the target placement zone(s) 32.In order to utilize a target on a trailer that is not currently equipped with a suitable pre-existing target, a user 2 may be instructed or directed to place the target 30 onto the trailer 110 within a desired target placement zone 32 so that the camera 20 may capture one or more images of the target 30 to determine trailer related information for the trailer backup assist system, such as hitch angle information for the hitch angle detection apparatus 130.In doing so, a user 2 may be prompted by an audible or visual message on an HMI such as the vehicle HMI 25 or portable device 26 to place the target 30 on the trailer 110.The vehicle HMI 25 may include visual and/or audible outputs generating instructions for proper target placement.",
"To allow for efficient and proper placement of the target 30 onto the trailer 110, the trailer backup assist system employs a target placement assist method or routine 900 shown in FIG.",
"17 that is processed by the target monitor controller 10.The target placement assist method 900 includes step 902 in which a user may connect a portable device having an image display to communicate with the vehicle.",
"The user may connect the device electronically to the vehicle which can be achieved by way of a wireless protocol, according to one embodiment.",
"The device may be a wireless device that may communicate via Wi-Fi, BLUETOOTH® or other wireless protocol.",
"Alternatively, the device could be connected via a wired connection.",
"Next, at step 904, the user initiates the hitch angle detection system setup which requires initiating the setup procedure for the hitch angle detection system.",
"As part of this procedure, the user will be required to place a target onto the trailer of the vehicle within a target placement zone.",
"At step 906, the system generates with the camera one or more images of the towed trailer which include a region where the desired target placement zone(s) is expected to be located.",
"There may be more than one target placement zone and one zone may be preferred over another zone.",
"At step 908, the system processes the generated images and determines the desired target placement zone on the trailer.",
"The desired target placement zone may be determined based on camera location and orientation, desired distance of the target from the hitch connection and the physical structure of the trailer.",
"At step 910, the system generates a target overlay on the one or more generated images.",
"The target overlay is a visual indication of the desired location of the target within the target placement zone upon which the user is instructed to place the target.",
"The target overlay may include border lines marking the target placement zone or other identifier.",
"The target overlay may be shown by flashing colored (e.g., red) lines on a displayed image.",
"Target overlays of a plurality target placement zones may be generated and shown.",
"At step 912, the system communicates the one or more images and the target overlay to the vehicle's display and if connected in step 902, the user's display on the portable device by utilizing the wireless or wired connection.",
"Next, at step 914, the user's display on the portable device displays an image of the target placement zone indicated by the target overlay.",
"At step 916, the user is then prompted by an HMI to place the target on the trailer within the target placement zone with assistance from the displayed image and target overlay on the vehicle's display and/or the portable display.",
"One example of a displayed image on the display 28 of a portable device 26 showing an overlay of the target location for the target to be placed on the trailer is illustrated in FIG.",
"16.The image displayed on the display 28 includes an image of the trailer 110 as captured by the camera and further includes an overlay of the desired target placement zone 32.The user 2 may view the image on the display 28 of the portable device 28 to determine where to place the target relative to the trailer 110.In this example, the user may place the target 30 onto the target placement zone 32 as indicated by the target overlay.",
"Placement of the target may be achieved by adhering a target sticker onto a surface of the trailer.",
"As a result, the user may employ a portable device with a display, such as a phone, a tablet, or a computer to view the proper location for placement of the target on the trailer prior to and during application of the target onto the trailer.",
"Accordingly, the target placement assist method 900 advantageously assists the user with placement of the target 30 onto the trailer 110 in a manner that is simple to use, accurate and efficient.",
"The user 2 may easily transport a portable device having a display to communicate with the vehicle and view the correct placement location for the target prior to and during the target placement procedure without having to return to the vehicle or otherwise be prompted for target placement.",
"The trailer backup assist system 105 further includes a target monitoring method or routine for monitoring placement of the target on the trailer and providing feedback to the user as to whether the target has been placed within a proper target placement zone.",
"A user may place a target on the trailer in various ways.",
"In some situations, the user may be prompted by the TBA system via a vehicle HMI to place a target on the trailer and may be given instructions as to the location.",
"The user may employ the target placement assist method 900 to assist with placement of the target on the trailer.",
"In other situations, the user may place the target on the trailer using their best judgment or following instructions printed on the target or packaging provided therewith.",
"In any event, once the target is placed on the trailer, the target monitoring method 920 will monitor the location of the target relative to the trailer and provide feedback to the user as to correct or incorrect placement of the target on the trailer.",
"The target monitoring method 920 is illustrated in FIG.",
"18, according to one embodiment.",
"At step 922, method 920 requires attaching the trailer to the vehicle onto the ball and hitch if it is not already attached.",
"Next, at step 924, setup for the hitch angle detection is initiated.",
"At step 926, the user is prompted via an interface to place the target on the trailer.",
"The user may place a target on the trailer based on predefined criteria or the user's best judgment or knowledge, according to one embodiment.",
"The user may be instructed on where to place the target on the trailer by use of a user's manual, an instruction sheet, or other visual or audible communication of instructions, according to other embodiments.",
"Generally, the target should be placed in a region that is unobstructed from view by the camera and that allows for the acquisition of an image and determination of desired trailer related information, such as the hitch angle.",
"Depending on the trailer configuration and camera orientation and height, the target may be required to be placed within a certain region of the trailer, within a distance range from the trailer hitch connection having a minimum distance from the hitch connection, such as 7 inches (17.78 centimeters), within a range from the tow vehicle bumper, and within a range of height from the ground.",
"The target placement may require a location within a certain distance from a centerline of the longitudinal axis of the trailer, and may require a vertical or horizontal angle or some angle in between the vertical and horizontal positions.",
"According to another embodiment, the user may utilize the target placement assist method 900 to place the target on the trailer.",
"At step 928, the system generates one or more images of the target placement zone on the towed trailer.",
"The system then processes the one or more images to determine the presence of a target within a desired target placement zone at step 930.The desired target placement zone may be determined by criteria, such as distance from the trailer hitch connection formed by the coupler assembly 114, distance from a centerline of the longitudinal axis of the trailer, height of the camera relative to the trailer, and distance of the camera from the trailer.",
"At decision step 932, method 900 determines if the target has been detected by the processed image(s) and, if not, returns to step 926 to prompt the user via an HMI to place the target on the trailer.",
"If the target has been detected by the processed images, the vehicle trailer backup assist system provides a feedback alert to the user at step 934.The feedback alert may include one or more of vehicle exterior alerts including visual alerts, such as flashing the vehicle brake lights and/or flashing the vehicle emergency flashers, and/or audible alerts, such as sounding the vehicle horn.",
"Additionally, the feedback alerts may include providing a message via the portable device 26, providing an audible tone via the portable device 26 or a visual lighted indication via the portable device 26.Further, feedback alerts may include sending a text message or audible instructions to a user via a portable device, such as a phone or computer.",
"It should be appreciated that other vehicle exterior and alternative feedback alerts may be communicated to the user to indicate that proper placement of the target has been detected on the trailer.",
"Alternatively, the feedback alerts could be used to indicate improper placement of the target on the trailer.",
"Once the trailer is properly equipped with the target in the proper location, the trailer backup assist system may process information by monitoring the target to determine the hitch angle and other trailer towing related functionality.",
"The target 30 may include a sticker having adhesive on the bottom surface and a predetermined image pattern of a certain size and shape provided on the top surface for capture by the video camera and recognition by the image processing.",
"The target 30 may have a rectangular shape, according to one embodiment, and may have a camera image recognizable pattern such as the checker pattern shown.",
"The image processing may include known image pattern recognition routines for identifying a target pattern and its location on a trailer.",
"However, it should be appreciated that other target shapes, sizes and patterns may be employed.",
"It should further be appreciated that the target may otherwise be connected to the trailer using connectors, such as fasteners, which may connect to the trailer or to an attachment to the trailer.",
"It should further be appreciated that the target can be attached via magnet, glued on, painted on, or any number of other suitable means.",
"It should be appreciated that not all trailers are necessarily configured to provide a well-suited location for placement of a target sticker on the trailer.",
"Accordingly, a target location may be added to a given trailer by use of a target mounting system 40 as shown in FIGS.",
"19 and 20, according to one embodiment.",
"The target mounting system 40 is shown installed onto trailer 110 to present a target 30 that is viewable by the camera within a desired target placement zone.",
"The target mounting system 40 includes a vertical mounting post or bracket 44 having a plurality of bolt receiver holes 46 extending vertically to allow for a desired vertical height adjustment.",
"The bracket 44 may be assembled onto the trailer via holes 54 using bolts 48, washers 52 and nuts 50.The height of the bracket 44 may be adjusted depending on which holes 46 are aligned with the trailer holes 54.Mounted to the top of the bracket 44 is a target plate 42 having a top target placement zone 32 onto which the target 30 is located.",
"The plate 42 likewise has a plurality of holes 46 that align horizontally with the holes in the bracket 44 and may be assembled thereto via bolts 48, washers 52 and nuts 50.Accordingly, the plate 42 may be adjusted both vertically and horizontally to a desired position so as place the target 30 adjustably within a desired location so that the target is easily acquired by the camera and processed by the image processing.",
"It should be appreciated that assistance in mounting the target mounting system 40 along with the target 30 and verification of proper location of the target mounting system 40 and target 30 may be achieved by utilizing the target placement assist method 900 and target monitoring method 920 discussed above.",
"The target moved detection method includes an initial setup routine 940 and subsequent processing routine 960 for target moved detection used for prompting the entry of trailer information.",
"The target moved detection method determines if the location of a hitch angle target on a trailer, such as a trailer tongue, has moved and may also determine if the distance has changed.",
"Images of the target in a previously stored image and a newly acquired image are compared to determine if the location and/or distance to the target has changed.",
"The comparison may include comparing camera image pixel sizes of the images.",
"If either the location or the distance changes, the user is then prompted by an HMI to reenter new trailer information for subsequent processing of the trailer backup assist system.",
"The initial setup routine 940 is illustrated in FIG.",
"21.Initially, the trailer must be attached to the vehicle at step 942.At step 944, the attached trailer is setup for hitch angle tracking.",
"For a vision-based system, this may include applying a target sticker to the trailer, such as in the vicinity of the tongue of the trailer, so that the vehicle-based camera can detect motion of the target as the trailer maneuvers and swings around curves.",
"In addition, a number of parameters associated with the location of the target that are used to properly calculate the hitch angle based on the vision processing may be entered.",
"These parameters may include the distance of the target to the ground and the distance from the target to the bumper of the vehicle.",
"At step 946, the vehicle and the trailer are directed to be driven straight, which may be achieved by driving the vehicle and towed trailer in the forward direction.",
"This is to ensure that there is about zero hitch angle between the vehicle and trailer with the trailer in-line with the vehicle and that the image generated in subsequent steps will be taken in the same orientation and will be valid for image comparisons.",
"At step 948, a picture (image) of the target and trailer are acquired with the use of the camera while the vehicle and the trailer are in a straight line at a hitch angle of about zero degrees.",
"At step 950, the image processing performs vision processing on the image.",
"The vision processing may first detect a target and then compute the size and location of the target based on processing the pixels of the image.",
"At step 952, the image acquired in step 948 is stored in memory and the information calculated in step 950 is stored in memory.",
"The image and calculated information are then subsequently used to determine if the target has moved.",
"If the target has moved, the system may assume that the trailer may have been changed or replaced with a different trailer, and hence prompts the user via an HMI to enter trailer information.",
"Referring to FIG.",
"22, the target moved detection routine 960 is shown beginning at step 962 in which the driver is instructed to reattach to the vehicle a trailer that was previously set up and used in the initial setup routine 940.At step 964, the user is prompted by the hitch angle detection system to select the trailer that was previously setup and stored, rather than selecting a new trailer.",
"At step 966, the user is prompted to drive the trailer and vehicle combination forward in a straight line to achieve a hitch angle of about zero degrees.",
"Next, at step 968, a new image of the target and the trailer are acquired by the camera.",
"At step 970, vision processing is performed on the image to detect the target and compute the size and location of the target by processing the pixels of the image.",
"At step 972, the target location and size as calculated above are compared to the location and size of the target taken in the prior image from the initial setup.",
"At step 974, a determination is made to determine if the new target information is a match or within tolerance of the original target information.",
"If the newly acquired target is still a similar size and in the similar location on the image as compared to the prior image from the initial setup, then the target is likely to be in the same location and will allow for a proper hitch angle detection if determination of such is made in step 980.If the target has a different location or has a different size, then the target is presumed to have moved and routine 960 proceeds to step 976.Detected movement of the target may occur when the trailer is a different trailer as compared to the trailer last selected by the user.",
"The use of the prior selected trailer configuration may provide erroneous results for hitch angle target tracking.",
"As such, method 960 proceeds to step 978 to prompt the user (e.g., driver) to reselect or re-setup the trailer configuration with new target and trailer information.",
"Accordingly, the target moved detection routine 960 advantageously detects movement of the target which may indicate potential connection of a new trailer to the vehicle, such that the user is prompted via an HMI to select new trailer configuration information.",
"Additionally, the target moved routine could also detect that a target has moved due to a different sized drawbar being installed than what was installed when the trailer was initially setup.",
"Examples of images of the trailer and the target moved to a different position are illustrated in FIGS.",
"23A and 23B.",
"As shown in FIG.",
"23A, an image of the trailer and the target 30 is shown aligned on the trailer in a first position as compared to the subsequent image in FIG.",
"23B showing the target 30 moved to a new second closer position.",
"The change in location of the target may be an indication that the trailer has been changed out with a new trailer or that the target has otherwise been moved on the trailer.",
"When this occurs, the target move detection routine 960 requires the user to re-enter trailer configuration information so that the wrong information is not used to provide incorrect hitch angle data.",
"Furthermore, it is possible that the right (correct) trailer has been selected and the target is still in the same location on the trailer, but the system still indicates that the target has moved.",
"This could occur if the drawbar length on the vehicle has changed.",
"Target monitor controller 10 further processes a trailer connection monitoring routine 990 to determine whether a trailer is connected to the vehicle and whether a new trailer may have been connected.",
"When the trailer is disconnected from the vehicle, the target information and the hitch angle information may be unavailable for a period of time.",
"Accordingly, the trailer connection monitoring method 990 monitors the availability of the hitch angle data and/or the detection of the target to determine if the hitch angle data or target data is lost for a substantial period of time.",
"If this occurs, the driver is then prompted via an HMI to reselect the attached trailer or to re-enter trailer configuration data to ensure that the wrong trailer information is not employed.",
"The trailer connection monitoring routine 990 is illustrated in FIG.",
"24.At step 992, a trailer is connected to the vehicle.",
"At step 994, the trailer is setup for hitch angle detection and monitoring.",
"If a vision based system is employed, this may include placing a target on the trailer for the vision-based system to detect as well as entering pertinent parameters.",
"Alternatively, if the trailer has been previously setup for hitch angle monitoring, it may be possible to select the previously stored setup configuration for that trailer.",
"At step 996, once the trailer has been setup for hitch angle detection, the hitch angle detection system will continuously monitor the hitch angle or target.",
"At decision step 998, routine 990 determines if the hitch angle or the target has been dropped for a time period greater than X seconds.",
"Depending on the type of hitch angle system, the hitch angle signal may drop or become unavailable for different reason, but one potential reason is that the trailer has been disconnected from the vehicle.",
"A disconnected trailer may also result in the target detection being unavailable.",
"As such, a check is made to see how much time has expired since the hitch angle signal or target detected has been dropped.",
"If the hitch angle or target detection has been dropped for a time period of less than X seconds, then routine 990 returns to track the hitch angle or target at step 996.If the hitch angle or target detection has been dropped for a time period greater than X seconds, then the user is prompted via an HMI to reselect or re-setup the trailer configuration in step 1000.The time period X is set to represent a reasonable amount of time needed to swap or change-out trailers.",
"For example, for extremely small, lightweight trailers, it may be possible to swap trailers out in less than sixty (60) seconds, so this could be a reasonable time period.",
"According to one embodiment, the time period X is set for thirty (30) seconds.",
"While the hitch angle is monitored to determine disconnection of a trailer from the vehicle, it should be appreciated that the trailer connection monitoring routine 990 may monitor detection of the target as an alternative, such that if the target is no longer detected for X seconds, then the vehicle driver may be prompted to reselect or reconfigure the trailer.",
"Supplemental Vehicle Lighting System As previously described, the trailer backup assist system 105 may employ a vision based target detection system, wherein the hitch angle detection component 155 is an identifiable visual target located on a trailer attached to a towing vehicle.",
"The towing vehicle may be equipped with a rear view camera, which functions as the hitch angle detection apparatus 130, and is configured to image the target and process acquired image data to generate trailer related information used in a variety of applications associated with the trailer backup assist system 105.By following the previously described target placement assist method 900 and/or other suitable methods, a vision based target detection system can be readily configured for accurate target detection.",
"Nevertheless, there may be some circumstances that hinder target detection accuracy.",
"One such circumstance involves performing target detection under dark conditions when existing vehicle lights, such as taillights, provide insufficient target lighting.",
"While aftermarket lighting assemblies are available, such assemblies may appear unsightly and may lack the ability to be integrated with the trailer backup assist system 105.Thus, it is desired to provide a supplemental vehicle lighting system that not only cooperates with the trailer backup assist system 105, but also confers a styling advantage to vehicles in which it is featured.",
"As will be described in greater detail below, a supplemental vehicle lighting system is disclosed herein that utilizes an existing keylock hole of a rear vehicle closure member or other rear vehicle fixture.",
"For purposes of illustration, FIG.",
"25A exemplarily shows a tow vehicle 1005 having a rear vehicle closure member embodied as a tailgate 1010 that includes a keylock hole 1015 defined in a tailgate handle assembly 1020.As exemplarily shown in FIGS.",
"25B-25D, the keylock hole 1015 is customarily used in conjunction with a corresponding keylock cylinder 1025 that includes a keyhole 1030 that is accessible through the keylock hole 1015.It should be appreciated that the keylock cylinder 1025 may be supported inside the tailgate 1010 in a variety of ways.",
"For purposes of illustration, the keylock cylinder 1025 is shown engaged to protrusions 1035, 1038, and 1040 of the tailgate handle assembly 1020 and is secured to the tailgate handle assembly 1020 with mechanical fastener 1045.When a corresponding key is inserted into the keyhole 1030 and turned in the proper direction, a locking tab 1050 of the keylock cylinder 1025 is moved to an unlocked position to enable the tailgate 1010 to be lowered so that a rear vehicle cargo area can be accessed.",
"While the rear closure member has been generally described herein as a tailgate 1010, it should be appreciated that the rear closure member may also include a liftgate, a trunk lid, a swing door, a sliding door, and the like, depending on the type and/or make of the selected vehicle 1005.Likewise, it should also be appreciated that the configuration and/or location of the keylock hole 1015 and keylock cylinder 1025 may vary across vehicle types and/or makes.",
"Therefore, the keylock hole 1015 may be defined in other parts and/or areas of the rear vehicle closure member or in some other rear vehicle fixture altogether.",
"While many current vehicles are equipped with a keylock hole and a keylock cylinder, seldom is a key used to unlock a rear vehicle closure member given the proliferation of vehicles having power lock systems or other means of entry.",
"Thus, with respect to some vehicles, the inclusion of a keylock cylinder produces added cost and consumes space that could otherwise be used to implement other devices.",
"Recognizing this, a supplemental vehicle lighting system is provided herein that advantageously replaces a keylock cylinder with a light assembly operably coupled to a rear keylock hole of a selected vehicle, through which the light assembly is able to illuminate a rear vehicle area.",
"In so doing, little to no modification need be made to existing rear vehicle fixtures since the light assembly may be fashioned to be mounted to in the same way as the keylock cylinder.",
"In this manner, vehicle manufacturers can offer vehicles equipped with a light assembly without having to perform substantial retooling.",
"Similarly, an existing keylock cylinder may be easily swapped for a light assembly in vehicles desiring the benefits bestowed by the supplemental vehicle lighting system described herein.",
"Referring to FIGS.",
"26A-26D, a light assembly 1055 is shown according to one embodiment and includes a housing 1060 having an open top defined by an upper edge 1065.The light assembly 1055 also includes a barrel 1070 having a distal end 1075 and a proximal end 1080.A lighting device 1085 including one or more light emitting diodes (LEDs) 1087 is disposed inside the housing 1060 and is configured to emit light through the barrel 1070 beginning from the proximal end 1080.The barrel 1070 may be constructed from a reflective material to trap the emitted light inside the barrel 1070 as it propagates towards the distal end 1075 of the barrel 1070.The emitted light is then dispersed from the barrel 1070 via a lens 1090 that is coupled to the distal end 1075 of the barrel 1070.In the illustrated embodiment, the lens 1090 includes a first section 1091, a second section 1092, and an intermediate section 1093 therebetween.",
"The second section 1092 is configured to be inserted into the barrel 1070 through the distal end 1075 such that the intermediate section 1093 abuts against the distal end 1075 and may be adhered thereto using an adhesive.",
"In this arrangement, the first section 1091 is most distal to the lighting device 1085.Additionally, the first section 1091 may be curved and optically configured to disperse the emitted light in a variety of directions including a forward, upward, downward, and/or sideways direction.",
"As best shown in FIGS.",
"26C and 26D, the lighting device 1085 has an L-shaped configuration and is electrically coupled to an electrical connector 1095 provided at the bottom of the housing 1060.The lighting device 1085 includes a first end 1097 that abuts against the proximal end 1080 of the barrel 1070 and supports a heat sink board 1100 on which the LEDs 1087 are mounted.",
"The lighting device 1085 also includes a plug 1102 disposed at a second end having pins 1107 that plug into a corresponding socket 1109 of the electrical connector 1095.To supply power to the lighting device 1085, the electrical connector 1095 may be configured to make an electrical connection with an onboard vehicle power source or other power source.",
"To assist the heat sink board 1100 with heat dissipation, the light assembly 1055 may include a heat management member 1115 positioned proximate to the lighting device 1085.The heat management member 1115 may be a straight heat sink (as shown), or other heat sink type, such as, but not limited to, a pinned heat sink or a flared heat sink, and may be mounted to the upper edge 1065 of the housing 1060 via threaded fasteners 1120.Optionally, a thin plate 1122 may be provided for distributing the load of the threaded fasteners 1120.As shown in FIG.",
"26C, the thin plate 1122 is contiguous with the upper edge 1065 of the housing 1060 and is disposed between the upper edge 1065 of the housing 1060 and the heat management member 1115.Referring to FIGS.",
"27A and 27B, the light assembly 1055 is exemplarily shown mounted to the tailgate handle assembly 1020 previously shown in FIGS.",
"25A-25D.",
"The light assembly 1055 is configured to be engaged to protrusions 1035, 1038, and 1040 and is secured to the tailgate handle assembly 1020 with mechanical fastener 1045 to mirror the mounting scheme of the keylock cylinder 1025 previously shown in FIG.",
"25D.",
"In this manner, the keylock cylinder 1025 and light assembly 1055 are easily interchanged.",
"However, it should be appreciated that other mounting schemes may be employed for mounting the light assembly 1055 to the tailgate handle assembly 1020 or other rear vehicle fixture.",
"With respect to the presently illustrated embodiment, mounting of the light assembly 1055 to the tailgate handle assembly 1020 results in the intermediate section 1093 of the lens 1090 abutting against an interior surface 1125 of the tailgate handle assembly 1020.In this arrangement, the barrel 1070 is concentrically aligned with the keylock hole 1015 such that the first section 1091 of the lens 1090 at least partially coincides with the keylock hole 1015 while the tailgate handle assembly 1020 shields the rest of the light assembly 1055.Once the light assembly 1055 is secured, an electrical connection may be made between the electrical connector 1095 of the light assembly 1055 and a plug 1127 stemming from an onboard vehicle power supply or other power source such that power may be supplied to the lighting device 1085.In operation, the lighting device 1085 may be activated using a variety of means.",
"For example, the lighting device 1085 may be manually activated via a user input mechanism, such as a button located on a human machine interface (e.g.",
"HMI 102), or elsewhere in the selected vehicle.",
"Additionally, or alternatively, the lighting device 1085 may be automatically activated via an onboard vehicle system such as the trailer backup assist system 105 and/or other vehicle system.",
"For instance, when performing a backup maneuver, the trailer backup assist system 105 may activate the lighting device 1085 under dark conditions.",
"In another instance, the lighting device 1085 may be automatically activated during set up of the trailer backup assist system 105, as described previously in step 604 of FIG.",
"10.Referring to FIG.",
"28, a supplemental vehicle lighting system 1130 is implemented in the vehicle 1005 previously shown in FIG.",
"25A.",
"For purposes of illustration, the vehicle 1005 features the trailer backup assist system 105 and employs vision based target detection.",
"As shown, the vehicle 1005 is attached to a trailer 1135, which may be variously configured and may offer one or more suitable target placement zones for receiving a target 1140.In the illustrated embodiment, the target 1140 is placed on a trailer tongue 1145 of the trailer 1135 and is imaged by a rear view camera 1150 mounted in an upper region of the tailgate 1010.By virtue of its positioning in the tailgate 1010, the rear view camera 1150 is shown imaging a scene 1155 that is to the rear of the vehicle 1005 and points slightly downwards therefrom so that the target 1140 is present in the scene 1155.To assist the camera 1150 in accurately imaging the target 1140 in dark conditions, the light assembly 1055 described previously herein is mounted inside the tailgate 1010 and is operable to illuminate a rear vehicle area 1160 that includes the target 1140 and at least partially overlaps with scene 1155.With respect to the illustrated embodiment, it can be seen that the rear vehicle area 1160 can include the area behind a rear bumper 1165 of the vehicle 1005.Since the keylock hole 1015 is defined in the tailgate handle assembly 1020, the light assembly 1055 may be mounted to the tailgate handle assembly 1020 in the manner described in reference to FIG.",
"27A or other suitable manner.",
"Although the supplemental vehicle lighting system 1130 has been described herein as being featured in a tow vehicle 1005 generally embodied as a pickup truck, it should be appreciated that the supplemental vehicle lighting system 1130 may be featured in other tow and non-tow vehicles alike, which may include, but are not limited to, buses, sports utility vehicles, vans, station wagons, sedans, and coupes.",
"Furthermore, while the supplemental vehicle lighting system 1130 is intended for use with the trailer backup assist system 105, it should be appreciated that the vehicle lighting system 1130 may additionally, or alternatively, be adapted for use with other vehicle related applications.",
"For example, the additional lighting provided by the light assembly 1055 will enable a vehicle equipped with a rear view camera system to render clearer images on a display screen when it's dark outside.",
"This may prove especially useful when performing a backup maneuver in low visibility situations.",
"At the most basic level, the supplemental vehicle lighting system 1130 may simply be used as a utility light.",
"For example, the light assembly 1055 may be activated to aid an operator with attaching/detaching a trailer to/from a tow vehicle in low light conditions.",
"Secondary Hitch Angle Sensor System For the trailer backup assist system 105, as previously described, it is advantageous to use information that is representative of an angle between the vehicle and a trailer attached to the vehicle, also known as the hitch angle γ or trailer angle.",
"In addition to the trailer backup assist system 105, it is contemplated that other vehicle systems may utilize hitch angle information as an input to the system, whereby the hitch angle information may be manipulated by a controller or microprocessor associated with the vehicle 100.In some embodiments, a measured hitch angle γ(m) may not provide an accurate measurement of the actual hitch angle γ(a) to a requesting system, which may introduce a potential for inadequate or improper vehicle system control, especially in situations where the hitch angle information may be important to the vehicle system being controlled, such as the trailer backup assist system 105.Furthermore, as previous mentioned, the hitch angle signal may drop-out or become unavailable for different reasons, such as the hitch angle detection apparatus 130 momentarily being unable to sense the relative position of trailer 110, or more specifically, the camera 20 being unable to track the hitch angle target 30 or other hitch sensors, such as a potentiometer, magnetic, optical, or mechanical based sensors, being unable to provide a constant hitch angle measurement, which may similarly cause errors or other disruption in operating the trailer backup assist system 105.Accordingly, an accurate and consistent estimate of the actual hitch angle γ(a) is desired, including for a means to confirm the accuracy of a measured hitch angle γ(m).",
"Referring to FIGS.",
"29-31, a sensor system 1200 for estimating a hitch angle of a trailer 110 attached to a vehicle 100 is shown according to one embodiment, which includes a primary sensor 1202 having a camera 20 monitoring a target 30 on the trailer 110 to determine a measured hitch angle γ(m) and a secondary sensor 1204 that monitors the trailer 110 to determine an indicator 1206 of the actual hitch angle γ(a).",
"In this embodiment, the trailer backup assist system 105 operates the vehicle 100 when the measured hitch angle γ(m) correlates with the indicator 1206 of the actual hitch angle γ(a).",
"This and other embodiments of the sensor system 1200 are described in more detail below.",
"In the embodiment illustrated in FIG.",
"29, the vehicle 100 is a pickup truck that employs vision based target detection as the primary sensor 1202 to determine the measured hitch angle γ(m).",
"Accordingly, the primary sensor 1202 on the vehicle 100 includes a hitch angle detection apparatus 130 that has a camera 20 as an input for providing video images to a target monitor controller 10 of the primary sensor 1202.The camera 20 (e.g.",
"video imaging camera) is located proximate an upper region of the vehicle tailgate at the rear of the vehicle 100, such that the camera 20 is elevated relative to the target placement zone(s) and has an imaging field of view located and oriented to capture one or more images of the trailer 110, including a region containing one or more desired target placement zone(s) 32.It should be appreciated that the camera 20 may include one or more video imaging cameras and may be located at other locations on the vehicle 100 to acquire images of the trailer 110 and the desired target placement zone(s) 32.As also shown in FIG.",
"29, the tow vehicle 100 is pivotally attached to one embodiment of a trailer 110.The trailer 110 has a trailer hitch connector in the form of a coupler assembly 114 connected to a vehicle hitch connector in the form of a receiver hitch and ball 15.The coupler assembly 114 latches onto the hitch ball 15 to provide a pivoting ball joint connection 117.The trailer 110 is shown having a frame 1208 that includes a longitudinally extending bar or trailer tongue 112 that is coupled with opposing front frame members 1210 that angle laterally away from the trailer tongue 112 and extend rearward to couple with side frame members 1212 that extend longitudinally in parallel alignment and are supported by a rotatable wheel axle 1214 of the trailer 110.The forward facing surfaces of the trailer frame 1208, including the trailer tongue 112 and the front and side frame members, 1210, 1212 provide surfaces for the secondary sensor 1204 to monitor the position of the trailer 110.Again, it should be appreciated that the trailer 110 may be configured in various shapes and sizes, may include more than one axle, and may have additional or alternative surfaces for the secondary sensor 1204 (FIG.",
"30) to monitor.",
"With further reference to FIG.",
"29, the vehicle 100 has additional onboard proximity sensors, including but not limited to, a reverse aid system 1220, a blind spot system 1216, and a cross traffic alert system 1218.In one embodiment, the reverse aid system 1220 includes a pair of energy transducers coupled with the rear of the vehicle 100 below the vehicle tailgate on opposing sides of the pivoting ball joint connection 117 between the vehicle 100 and the trailer 110.The energy transducers of the reverse aid system 1220, in the illustrated embodiment, comprise ultrasonic sensors that are directed rearward in the general vicinity of the trailer 110 for monitoring the position of the trailer 110 by measuring a difference in return signals from the ultrasonic sensors on opposing sides of the pivoting ball joint connection 117.The difference in the return signals is used to determine the indicator 1206 (FIG.",
"30) of the actual hitch angle γ(a).",
"The indicator 1206 may be a second measured hitch angle γ(m2), which can be used to define an acceptable tolerance range of hitch angles.",
"The indicator 1206 may also be another conceivable type of indicator, as described in further detail herein.",
"The reverse aid system 1220 may include additional sensors, including other types of sensors, such as radar sensors, located at several locations at the rear of the vehicle 100, such as laterally spaced along the bumper.",
"The blind spot system 1216, according to one embodiment shown in FIG.",
"29, includes an energy transducer 1222 coupled with each of the side rear view mirrors that generate a sensor field adjacent to the sides of the vehicle 100 and rearward therefrom in the general vicinity of the trailer 110.The energy transducers 1222 of the blind spot system 1216 may be ultrasonic sensors that monitor the general position of the trailer 110 to determine an indicator 1206 of the actual hitch angle γ(a).",
"Accordingly, it is conceivable that the blind spot system 1216 may be used to determine when the trailer 110 is roughly centered behind the vehicle 100 or in line with the vehicle 100 when the return signals from both energy transducers 1222 are both low and/or relatively equal.",
"Also, the blind spot system 1216 may provide an indicator 1206 (FIG.",
"30) of the actual hitch angle γ(a) based on the magnitude of return signal from the respective energy transducer 1222 receiving the greater return signal.",
"For instance, a set of ranges of ascending magnitudes may be set to correspond with a general hitch angle (e.g.",
"10-20 Hz for 5 degrees, 20-30 Hz for 10 degrees, etc.)",
"or ranges of hitch angles (e.g.",
"0-40 degrees, 40-70 degrees, 70-100 degrees), such that the return signal may be an indicator 1206 (FIG.",
"30) of the actual hitch angle γ(a) for use with the sensor system 1200 or for use as a primary sensor 1202 in an alternative embodiment.",
"The cross traffic alert system 1218, as shown in FIG.",
"29, also incorporates energy transducers 1224 on the rear of the vehicle 100 to generate sensor fields for monitoring the general position of the trailer.",
"Specifically, the cross traffic alert system 1218 in the illustrated embodiment includes energy transducers 1224 comprising a pair of ultrasonic sensors directed rearward and laterally outward from the rear of the vehicle 100, such that the ultrasonic sensors may determine when the trailer 110 has reached a large hitch angle or is approaching a critical angle indicative of a jackknife condition or jackknife angle γ(j).",
"In addition, the secondary sensor 1204 may comprise an auxiliary hitch angle sensor 1226 (FIG.",
"30) attached to the trailer 110 and/or the vehicle 100, such as mechanical sensor mechanisms or other conceivable hitch angle sensors.",
"It is also contemplated that any of the onboard proximity sensors (FIG.",
"32), including, but not limited to, the reverse aid system 1220, blind spot system 1216, the cross traffic alert system 1218, and the auxiliary sensor 1226, may have an ultrasonic sensor, a radar sensor, or a combination of the two.",
"These secondary sensors 1204 for determining the position of the trailer 30 may also include other cameras located on the vehicle, cameras located on the trailer, or other sensing devices generally understood by one having ordinary skill in the art.",
"It is also conceivable that more than one onboard sensor system may be incorporated into the secondary sensor 1204, offering multiple individual sensors that contribute to the indicator 1206 of the actual hitch angle γ(a).",
"Referring to FIG.",
"30, the sensor system 1200 of the trailer backup assist system 105 (FIG.",
"1) has the primary sensor 1202 for determining a first measured hitch angle γ(m) and the secondary sensor 1204 for determining an indicator 1206 of the actual hitch angle γ(a), such as a second measured hitch angle γ(m2).",
"In one embodiment, the secondary sensor 1204 may be used in place of the primary sensor 1202 when the signal of the first measured hitch angle γ(m) becomes unavailable or unreliable, thereby using the second measured hitch angle γ(m2) in place of the first measured hitch angle γ(m).",
"Additionally or alternatively, the secondary sensor 1204 may be used in conjunction with the primary sensor 1202 to confirm that the first measured hitch angle γ(m) correlates with the indicator 1206 of the actual hitch angle γ(a).",
"In one embodiment, as described above, the primary sensor 1202 may include the hitch angle detection apparatus 130 and the target monitor controller 10 for monitoring the target 30 on trailer 110 to determine the first measured hitch angle γ(m).",
"The secondary sensor 1204 includes a trailer monitoring apparatus 1228 and a trailer monitoring controller 1230 for monitoring the trailer 110 to determine the indicator 1206 of the actual hitch angle γ(a).",
"The trailer monitoring controller 1230 may include a microprocessor 1232 and/or other analog and/or digital circuitry for processing one or more routines.",
"Also, the trailer monitoring controller 1230 may include memory 1234 for storing one or more routines including sensor signal processing routines 1236 and hitch angle confirmation routines 1238.It should be appreciated that the trailer monitoring controller 1230 may be a standalone dedicated controller or may be a shared controller integrated with other control functions, such as integrated with the trailer monitoring apparatus 1228 and/or the primary sensor 1202, to process the return signals of the onboard proximity sensors or other secondary sensors and perform related functionality.",
"The trailer monitoring controller 1230 illustrated in FIG.",
"30 receives and processes return signals from at least one of the camera 20, the blind spot system 1216, the reverse aid system 1220, the cross traffic alert system 1218, and the auxiliary hitch angle sensor 1226, which may include additional processing from the trailer monitoring apparatus 1228.The secondary sensor 1204 processes the return signals to determine the indicator 1206 of the actual hitch angle γ(a), such as using the reverse aid system 1220 to determine a second measured hitch angle γ(m2) as the indicator 1206 and/or using the blind spot system 1216 to determine a range of hitch angles as the indicator 1206.The hitch angle confirmation routine 1238 further processes the indicator 1206 in connection with the first measured hitch angle γ(m) to determine if the first measured hitch angle γ(m) correlates with the indicator 1206.For instance, the indicator 1206 may include the second measured hitch angle γ(m2) that defines a tolerance range of acceptable hitch angles (e.g.",
"+/−3 degrees of the second measured hitch angle, or a wider or narrower tolerance range), such that the first measured hitch angle γ(m) correlates with the indicator 1206 when the first measured hitch angle γ(m) is within the tolerance range.",
"It is contemplated that in one exemplary embodiment, the hitch angle confirmation routine 1238 may also process the first measured hitch angle γ(m) to define an average measurement thereof over an interval of time (e.g.",
"2 seconds, or a longer or shorter interval) to reduce instability and variance of the first measured hitch angle γ(m).",
"As also illustrated in FIG.",
"30, the sensor system 1200 may communicate with one or more devices including, the vehicle HMI 25, the vehicle exterior alerts 24, and the vehicle interior alerts 1240, which may include a blind spot indicator light 1242 that provides a visual alert.",
"It is contemplated that the blind spot indicator light 1242 may be on an interior or exterior of the vehicle 100, such as on or proximate a side rear view mirror, to alert the driver that the primary sensor 1202 does not correlate with the indicator 1206 of the actual hitch angle γ(a), the trailer 110 is approaching or is in a jackknife condition, or other conceivable warnings that may not be able to be displayed on the center stack screen when reversing the vehicle 100.Additional warnings that may be provided with the blind spot indicator light 1242 include overspeed warning that alerts the driver that they are approaching a speed greater than the speed configured for operating the trailer backup assist system 105, a steering override warning that alerts the driver that steering has exceeded the acceptable steering torque configured for operating the trailer backup assist system 105, or an internal fault warning that alerts the driver that the trailer backup assist system 105 has become inoperative and has to canceled out for other conceivable errors.",
"As previously described, the sensor system 1200 may communicate via wireless communication 22 to various types of mobile devices or via onboard communication to one or more vehicle human machine interfaces (HMIs) 25, including a vehicle display, such as a center stack mounted navigation/entertainment display.",
"The method for estimating the actual hitch angle γ(a) using the sensor system 1200 of the trailer backup assist system 105 is illustrated in FIG.",
"31 according to one embodiment.",
"Initially, at step 202 the system may receive an initiation request to activate the trailer backup assist system 105 for tracking the hitch angle.",
"Before proceeding to monitor the hitch angle, at step 1244 the system confirms that the attached trailer 110 has been calibrated and setup for operation with the trailer backup assist system 105, and if not, the calibration and setup process 600, 700 are initiated, as previously described.",
"Although the calibration and setup processes 600, 700 may involve gathering the kinematic information for the attached trailer 110, at step 1246, the sensor system receives this information for use with the primary and/or secondary sensors 1202, 1204, if necessary.",
"For instance, if a vision based target detection system is included as the primary sensor 1202, the kinematic information will provide parameters from the target setup information in addition to the input or otherwise determined dimensions of the trailer 110.The trailer kinematic information may also be used by the sensor system 1200 to modify the tolerance range of acceptable first measured hitch angles and to modify the magnitudes of sensor return signals or corresponding ranges of hitch angles.",
"Still referring to FIG.",
"31, once the trailer backup assist system 105 is generally setup and calibrated with the trailer 110 attached to the vehicle 100, at step 1248, an input is made with the input device, such as selecting the desired hitch angle between the vehicle 100 and trailer 110 by manipulating the steering input apparatus 125, as previously described.",
"At step 1250, the sensor system 1200 begins to monitor the trailer 110 with the primary sensor 1202 to determine the first measured hitch angle γ(m) at step 1252.In conjunction with the operation of the primary sensor, at step 1254, the secondary sensor similarly monitors the trailer 110 to determine the indicator 1206 of the actual hitch angle γ(a) at step 1256.At step 1258, the first measured hitch angle γ(m) is compared with the indicator 1206 to determine if the measured hitch angle γ(m) of the primary sensor 1202 correlates therewith, and if so, thereby reflecting a generally accurate measurement of the actual hitch angle γ(a).",
"If the measured hitch angle γ(m) is determined to not correlate with the indicator 1206, the user may be prompted at step 1260, such as being alerted with any of the interior or exterior alerts 1240, 24, being alerted and/or requested with the vehicle HMI to direct whether the trailer backup assist system 105 should proceed to operate the vehicle 100, and similarly being alerted and/or prompted with a mobile device via wireless communication 22, as described above.",
"If the measured hitch angle γ(m) of the primary sensor 1202 correlates with the indicator 1206 of the actual hitch angle γ(a), then, at step 1262, the trailer backup assist system 105 may operate to achieve the desired input made with the input device, such as steering the vehicle 100 with the power-steering assist system 115 to achieve the desired hitch angle input with the steering input apparatus 125.While the illustrated embodiment of the sensor system 1200 includes a primary sensor 1202 and a secondary sensor 1204, it should be appreciated that the sensor system 1200 may include addition sensors (tertiary sensor, quaternary sensor, etc.)",
"with additional corresponding indicators for confirming the accuracy of the indicator 1206 from the secondary sensor 1204 and the measured angle γ(m) from the primary sensor 1202.It is also be understood that the sensor system 1200 may additionally, or alternatively, be adapted for use with other vehicle related applications, such as trailer sway limiters or other conceivable applications relying upon the accuracy of the measured hitch angle γ(m).",
"Hitch Angle Estimation and Verification According to an additional embodiment for estimating the actual hitch angle, a system uses an estimated distance between a wireless receiver on the vehicle and a wireless transmitter on the trailer.",
"The wireless receiver on the vehicle is located at a predetermined distance from a trailer mount and the wireless transmitter on the trailer is located at an end of the trailer opposite the trailer mount.",
"With respect to this embodiment, the system includes a controller for monitoring power returns of a signal transmitted from the transmitter to the receiver and for estimating the distance between the transmitter and the receiver as a function of a path loss propagation of the transmitted signal.",
"The actual hitch angle is then estimated using the estimated distance, the predetermined distance, and a trailer length.",
"Referring now to FIGS.",
"32-34, one embodiment the system for estimating the actual hitch angle is shown to include a wireless receiver 1270 on a vehicle 100 with a trailer backup assist system 105.The wireless receiver 1270 is mounted at a known vehicle location, such as a central vehicle body position.",
"In the illustrated embodiment, the vehicle 100 also has a controller 1272 for receiving information from the wireless receiver 1270, which may be a single centralized vehicle controller or a combination of controllers.",
"The controller 1272 may be programmed to perform various functions and control various outputs and may have a memory 1274 associated therewith.",
"The memory 1274 may store various parameters, thresholds, patterns, tables, or maps; for example, parameters may include known, fixed vehicle measurements such as wheel base, vehicle length, trailer length and distances from known parts of the vehicle.",
"The controller 1272 receives information from a number of sensors on or around the vehicle 100 associated with one or more sensing systems 1276, which may include, but are not limited to, speed sensors, yaw rate sensor, lateral acceleration sensor, roll rate sensor, vertical acceleration sensor, a longitudinal acceleration sensor, a pitch rate sensor, and a steering angle position sensor.",
"These sensors may also be part of an inertial measurement unit that would most likely be located at the center of the vehicle body.",
"As shown in FIGS.",
"32-33, a trailer 110 may be towed behind the vehicle 100.The trailer 110 may include a tongue 112 and trailer wheels, as well as a trailer brake and electrical components such as lights.",
"A wiring harness 1278 may be used to couple the trailer 110 to the electrical system of the vehicle 100 and ultimately to the controller 1272.The trailer 110 is coupled to the vehicle 100, as by a hitch ball 15 or other mount on the vehicle 100, through a coupler assembly 114 located at the end of the trailer tongue 112.A distance dr defines a reference distance which is the distance between the wireless receiver 1270 on the vehicle 100 and the hitch ball 15 or other mount on the vehicle 100.This is a fixed distance and may be stored in memory 1274.The coupler assembly 114 may have a hitch angle sensor 1226 associated therewith.",
"Alternatively, the hitch angle sensor 1226 may be associated with the mount on the vehicle 100.The hitch angle sensor 1226 is used to determine the angle position of the trailer 110 relative to the vehicle 100.Various types of hitch angle sensors, such as resistive, inductive, ultrasonic, or capacitive type sensors may be used, in addition to other hitch angle sensor system disclosed herein.",
"A wireless transmitter 1280 is positioned on the trailer 110 at a known location, preferably at the end of the trailer.",
"This wireless transmitter 1280 is in communication with the wireless receiver 1270 that is located on the vehicle 100.The wireless receiver 1270 has been placed at a known location of the vehicle 100 such that a reference distance, dr, from the receiver 1270 to the hitch ball 15 at the rear of the vehicle 100 is known and stored in memory 1274.Examples of wireless transmitting and receiving devices that may be used are Radio Frequency Identification (RFID), Bluetooth, and the like.",
"As discussed above, the wireless receiver 1270 is positioned at a location on the vehicle 100 the predetermined distance, dr, from the vehicle's trailer mount or hitch ball 15.The wireless transmitter 1280 and the wireless receiver 1270 are compatible units that transmit and receive signals between the vehicle 100 and the trailer 110.The controller 1272 monitors the power returns of the transmitted signals.",
"By monitoring the power returns of signals sent by the transmitter to the receiver, the controller 1272 may estimate a distance, d, between the vehicle 100 and the trailer 110.The disclosed subject matter also uses a trailer length, lT.",
"This value may be a known value entered by the driver, stored in controller memory, or otherwise sensed, calculated or estimated.",
"For example, an accurate estimate of trailer length, lT, is possible using measurements of the signal transmitted from the wireless transmitter 1280 on the trailer 110 to the wireless receiver 1270 on the vehicle 100 when the hitch angle is zero.",
"It is also possible to estimate the trailer length when the measurements are taken while the vehicle yaw rate is zero for a predetermined period of time.",
"The hitch angle is thereby estimated using the trailer length, lT, and path loss propagation of a signal transmitted from the transmitter on the trailer 110 to the receiver 1270 on the vehicle 100.The hitch angle estimate may then be used as an input for control algorithms associated with a variety of vehicle systems 1281 such as trailer sway, trailer backup assist, stability control and other systems.",
"Alternatively, the hitch angle estimate may be used to verify, or validate, the measurement taken by a hitch angle sensor.",
"Referring to FIG.",
"33, a block diagram of a vehicle 100 and trailer 110 combination, where a hitch angle is non-zero, is shown with respect to the law of cosines: A2=B2+C2−2BC cos(a) The vehicle 100 has the trailer 110 attached thereto with the receiver 1270 located on the vehicle a predetermined reference distance, dr from the trailer hitch ball 15, which corresponds to B for the triangle reflecting the law of cosines in FIG.",
"33.The trailer length, lT, is shown and the transmitter 1280 is located at the end of the trailer 110.The trailer length, lT, corresponds to C in the law of cosines.",
"The distance, d, between the transmitter 1280 and the receiver 1270 is shown, which corresponds to A in the law of cosines.",
"The reference distance, dr, is a known distance that may be stored in memory 1274.The trailer length, lT, may also be a known distance that is stored in memory 1274 or it may be estimated or calculated as described later herein.",
"The distance, d, is calculated as described hereinafter with reference to FIG.",
"34.Referring to FIG.",
"34, a flow chart of the method 1282 for estimating a hitch angle in accordance with the disclosed subject matter is shown.",
"The method 1282 can be carried out using the vehicle and trailer architecture discussed above in reference to the vehicle 100 and trailer 110 for FIG.",
"32.Accordingly the hitch angle estimate may be supplied to any vehicle system 1281 requesting the information.",
"An operation 1284 is performed for requesting hitch angle estimation.",
"A request for hitch angle estimation may come from a vehicle control system 1281 that requires the information as an input to the control algorithm associated therewith or it may come from a control system 1281 that wants to validate or verify a hitch angle provided by a hitch angle sensor.",
"Examples of vehicle control systems 1281 that may request hitch angle information may be a trailer backup assist system 105, a trailer sway control system, a trailer brake control system, and a vehicle dynamic control system such as roll stability control or yaw stability control.",
"These are only a few examples of systems 1281 that may utilize hitch angle information as an input to a control algorithm.",
"An operation 1286 is performed to monitor power returns of signals transmitted from the trailer 110 to the vehicle 100.Path loss is proportional to the square of the distance between the transmitter and the receiver and power returns of signals transmitted may be used to estimate a distance between the transmitter and the receiver.",
"The power returns are measured, at the receiver, at predetermined time intervals and stored in controller memory over a predetermined period of time.",
"The power returns may be accessed by the controller for various operations and/or functions that use the values to estimate hitch angle.",
"An operation 1288 is performed to estimate the distance, d, between the transmitter and the receiver.",
"Estimating the distance, d, between the wireless transmitter and the wireless receiver 1270 is accomplished by using the, measured power returns or measured path loss of the signal being transmitted.",
"Path loss is proportional to the square of the distance between the transmitter and the receiver, and also to the square of the frequency of the transmitted signal.",
"Signal propagation may be represented by Friis transmission formula: P r ( d ) = P t G t G t λ 2 ( 4 π ) 2 d 2 L where, Pt is the transmission power in Watts, Gt and Gr are gains associated with the receiver and the transmitter respectively, λ is the wavelength, L are system losses, and d is the distance between the transmitter and the receiver.",
"Accordingly, transmission power decreases at a rate proportional to d2.Therefore, knowing the path loss, PL, associated with the transmitted signal will provide an estimate of the distance, d, between the transmitter and the receiver.",
"Path loss (PL) is represented by the following equations: PL dB = 10 log P t P r = - 10 log ( G t G t λ 2 4 π 2 d 2 L ) PL dB = - 10 log ( G t G t λ 2 ( 4 π ) 2 L ) + 10 log ( d 2 ) PL dB = - 10 log ( G t G t λ 2 ( 4 π ) 2 L ) + 20 log ( d ) Pr decreases at a rate that is proportional to d2.The power of the signal received at the receiver may be represented as: P r ( d ) = P r ( d 0 ) ( d 0 d ) 2 for d > d 0 > d r The distance, d, may be derived from this formula and represents the overall distance between the transmitter on the trailer and the receiver on the vehicle.",
"The distance, d0, is a known received power reference point and the distance, df, is a far-field distance.",
"The reference distance, dr, is known.",
"If the trailer length, lT is known, then an operation 1289, using the distance, d, the trailer length, lT, the known reference distance, dr, between the receiver and the trailer hitch, and the law of cosines, is performed to calculate the hitch angle.",
"From the law of cosines, provided above, the hitch angle is given by: a = cos - 1 [ A 2 - B 2 - C 2 - 2 BC ] An operation 1290 is performed in which the vehicle system that is requesting the information receives the hitch angle estimation.",
"The disclosed subject matter provides an estimate of hitch angle even when a hitch angle sensor is unavailable.",
"If a system relies on a hitch angle sensor, the disclosed subject matter may provide verification, as a redundant sensor, that the hitch angle sensor is operating properly.",
"As discussed above, the trailer length, lT, may be a known value stored in memory or it may be a value that is calculated according to the disclosed subject matter.",
"The trailer length may be calculated 1292 by comparing distances, d, between the transmitter and the receiver that have been estimated and stored in memory over a period of time.",
"A predetermined number of distance estimates may be stored in controller memory.",
"A comparison of the stored distances may result in a largest distance may be identified.",
"The largest distance estimate may be associated with a zero hitch angle.",
"This identified largest distance, less the known reference distance, dr will be representative of, and may be stored as, the trailer length, lT. As an alternative, the trailer length, lT, may be estimated using a yaw rate provided by a yaw rate sensor on the vehicle to determine when the trailer is a zero hitch angle.",
"A yaw rate sensor is typically available as part of the sensor system 1200 on the vehicle.",
"A zero yaw rate is an indicator that a vehicle is travelling along a straight path, i.e., the vehicle is not turning.",
"The fact that the yaw rate is zero alone is not adequate to identify a zero hitch angle because the vehicle may have just stopped turning even though a non-zero hitch angle exists.",
"However, monitoring yaw rate over time will provide confirmation that the vehicle has driven straight forward for a sufficient predetermined period of time while maintaining a zero or near zero yaw rate.",
"A zero yaw rate, sensed over time, provides an indication that the trailer has straightened out and it can be inferred that the hitch angle is zero at that point.",
"Upon verification of zero hitch angle, the operation to calculate trailer length 1292 is performed.",
"The estimated distance between the transmitter and the receiver when the hitch angle is zero less the predetermined distance, dr, defines the trailer length, lT.",
"The predetermined period of time that the yaw rate should remain at zero before the assumption that the hitch angle is zero will be associated with an actual distance the vehicle trailer combination needs to travel to ensure that the hitch angle is zero.",
"This may be determined through testing and stored in the controller memory.",
"The disclosed subject matter is advantageous in that it provides an estimate of hitch angle whether or not a hitch angle sensor is present on a vehicle.",
"The disclosed subject matter is even advantageous for a vehicle that has a hitch angle sensor in that it provides a method for verifying, or validating, the accuracy of a hitch angle sensed by a hitch angle sensor.",
"This is especially important for vehicle systems that rely critically on the value of the hitch angle being sensed, for example, trailer backup assist systems, trailer sway control systems and trailer brake control systems.",
"Hitch Angle Calibration As previously mentioned with reference to FIG.",
"10 and a driver's interaction with the human machine interface (HMI) device 102, after the trailer setup module 600 is complete at step 620, the calibration module 700, according to one embodiment, calibrates the curvature control algorithm with the proper trailer measurements and calibrates the trailer backup assist system for any hitch angle offset that may be present.",
"In the one embodiment, the calibration module 700 may instruct the driver to pull the vehicle-trailer combination straightforward until a hitch angle sensor calibration is complete, which may be notified to the driver via the HMI device 102.Depending on any error resulting from the trailer measurements or the potential inability of the vehicle to be pulled straight forward, additional and alternative embodiments of calibrating the trailer backup assist system are described herein.",
"With reference to FIG.",
"35, the vehicle trailer backup assist system 105 is illustrated having the trailer backup assist control module 120 in communication with the sensor system 1200 and the trailer backup steering input apparatus 125 as part of the trailer backup assist system 105.The trailer backup assist system 105 in the illustrated embodiment, receives sensor information from the one or more hitch angle sensors 1312, a vehicle yaw rate sensor 1314, and a vehicle speed sensor 1316, and may communicate with other conceivable sensors on the vehicle 100 or trailer 110.For instance, the illustrated embodiment of the trailer backup assist system 105 also communicates with the vehicle transmission controller 1318, such as receiving the presently engaged transmission gear.",
"Furthermore, the trailer backup assist control module 120 is also in direct communication with the power steering assist system 115, which has the power steering assist control module 135 for communicating with the steering angle detection apparatus 140 and a servo steering motor 1300, or servomotor, for operating the steered wheels 1302 of the towing vehicle 100 (FIG.",
"36).",
"The illustrated embodiment of the trailer backup assist control module 120 includes a microprocessor 1304 for processing one or more routines stored in the corresponding memory 1306 of the trailer backup assist control module 120.The memory in one embodiment includes a hitch angle calibration routine 1308 and an initiating routine 1310.It should be appreciated that the trailer backup assist control module 120 may be a standalone dedicated controller or may be a shared controller integrated with other control functions, such as integrated with the sensor system 1200, the trailer backup steering input apparatus 125, or other systems of the towing vehicle.",
"As shown in FIG.",
"36, a schematic illustration of the vehicle 100 and trailer 110 combination are overlaid with an x-y coordinate system showing kinematic variables and angles, including the steering angle δ, trailer length D, and hitch angle γ, which may be affected by the dynamics of the vehicle 100 and trailer 110 combination and representable in kinematic equations, as similarly discussed with reference to FIG.",
"5.Referring to FIGS.",
"37-38, a method is shown for estimating the actual hitch angle γ(a) between the vehicle 100 and the trailer 110, according to one embodiment.",
"The method provides for sensing a measured hitch angle γ(m) with at least one hitch angle sensor 1312 (FIG.",
"35) on the vehicle 100 and sensing a steering angle δ of the steered wheels 1302 (FIG.",
"36) of the vehicle 100.Further, the method provides for reversing the vehicle 100, and thereby determining an offset γ(o) between the measured hitch angle γ(m) and the actual hitch angle γ(a) when the measured hitch angle γ(m) and the steering angle δ are substantially constant while the vehicle 100 is reversing.",
"As defined herein, the offset γ(o) is the difference between the measured hitch angle γ(m) and the actual hitch angle γ(a).",
"As reflected in the diagram shown in FIG.",
"36, when the hitch angle γ and steering angle δ are substantially constant, the yaw rate of the vehicle 100 is also substantially constant and equal to the yaw rate of the trailer 110.This interaction is used to formulate kinematic equations that can be solved for determining the offset γ(o) between the measured hitch angle γ(m) and the actual hitch angle γ(a).",
"Specifically, the yaw rate of the vehicle 100, as measured by the vehicle yaw rate sensor 1314 (FIG.",
"35) or another conceivable onboard vehicle sensor that may be configured to sense the yaw rate, provides the following equation: d α dt = - v w tan δ Furthermore, the yaw rate of the trailer can be represented with the following equation: d β dt = v D sin γ + Lv DW cos γ tan δ where, δ is the steering angle of the front wheels D is the distance from the hitch to the trailer axle W is the vehicle wheelbase (distance between both axles) L is the distance from the vehicle rear axle and hitch γ is the hitch angle Accordingly, when the yaw rate of the vehicle 100 and the trailer 110 become equal, the actual hitch angle γ(a) will likely be constant, such that the desired hitch angle provided by the trail backup steering input apparatus 125, such as the previously described rotatable input control device shown in FIG.",
"2, is also constant and substantially achieved.",
"For example, the desired hitch angle received from the trailer backup steering input apparatus 125 may be constant when the driver attempts to reverse the trailer 110 in a straight line with the vehicle 100 (i.e.",
"a zero curvature command) or when the driver inputs a maximum knob angle command.",
"The resulting constant hitch angle results in the following equation: c=a cos γ+b sin γ This equation can be rewritten as follows: c=a√{square root over (1−sin2γ)}+b sin γ The above equation can be solved with the quadratic equation that solves for the hitch angle γ.",
"Thereafter, when breaking up the hitch angle γ into a measured hitch angle γ(m) and an offset angle γ(o), the equation can be rewritten as follows: γ o = arcsin bc ± a b 2 + a 2 - c 2 b 2 + a 2 - γ m γ m where , c = - 1 W tan δ b = 1 D a = L DW tan δ Accordingly, the hitch angle offset γ(o) may be determined as a function of the length D of the trailer 110, the wheelbase length W of the vehicle 100, and the distance L from a rear axle of the vehicle 100 to the trailer 110 as shown in FIG.",
"36, while meeting the conditions provided above to use such an equation.",
"Specifically, the conditions generally include that the vehicle 100 and trailer 110 are reversing and that the measured hitch angle γ(m) and the steering angle δ are substantially constant during the reversing motion for at least a threshold period of time or over a threshold distance of motion.",
"As illustrated in FIG.",
"37, the calibration module 700 processes one embodiment of the hitch angle calibration routine 1308 to provide the method according to the following steps.",
"At step 1320, the system receives generally fixed characteristics of the vehicle 100 and the trailer 110, including the trailer length D, the vehicle wheelbase length W, and the distance L from the vehicle's rear axle to the hitch connection.",
"These generally fixed characteristics are described as such because the vehicle 100 and trailer 110 dimensions can be preloaded or looked up in product specifications, and if these dimensions are not known or otherwise already determined by the system, they can be measured and input into the memory 1306 or other vehicle memory prior to operating the vehicle 100 with the trailer backup assist system 105.The hitch angle calibration routine 1308 shown in FIG.",
"37, also provides at step 1322, confirming that the vehicle 100 is reversing when the sensors of the sensor system 1200 are taking continuous measurements of the vehicle 100 and trailer 110 variables.",
"Specifically, the system may confirm that the vehicle 100 is reversing with use of directional speed sensors, the gear position of the transmission controller 1318, GPS inputs, or other conceivable indicators of vehicle 100 direction.",
"At step 1324, the system conducts the initiating routine 1310 to further confirm that the vehicle 100 and trailer 110 combination are in a condition to determine the offset γ(o) between the measured hitch angle γ(m) and the actual hitch angle γ(a).",
"As shown in FIG.",
"38, one embodiment of the initiating routine 1310 includes determining a compensated steering wheel angle 1326 which is an indication of the steerable road wheel angle, calculating a filtered steering wheel angle rate 1328, and then determining at step 1330 whether the filtered steering wheel angle rate is less than a maximum allowable steering angle rate for the offset calculation.",
"Also, the initiating routine 1310 takes the measured trailer angle γ(m) at step 1332 and calculates a filtered trailer angle rate over time at step 1334.The initiating routine then at step 1336 determines whether the filtered trailer angle rate is less than a maximum allowable trailer angle rate for determining the offset calculation.",
"Further, the initiating routine 1310 takes the sensed or otherwise calculated vehicle speed from step 1338 and further calculates a filtered vehicle speed at step 1340.The filtered vehicle speed is then processed at step 1342 to determine whether it is less than a maximum allowable vehicle speed for determining the offset calculation.",
"If the conditions of the initiating routine 1310 are met at step 1344, the trailer backup assist system 105 allows the hitch angle calibration routine 1308 to continue towards determining the offset γ(o).",
"The initiating routine 1310 further includes step 1420 of compensating for a knob angle, calculating a filtered knob angle rate in step 1424, and determining if the filtered knob angle rate is less than a maximum allowable knob angle rate for the offset calculation in step 1428.The maximum allowable knob angle rate may be a tunable value of between about 0 and about 10°, and in a specific example about 1°.",
"The maximum allowable trailer angle rate may be a tunable value of between about 0° per second and about 2° per second, and in a specific example, about 0.5° per second.",
"The maximum allowable steering angle rate may be a tunable value of between about 0° per second and about 10° per second, and in a specific example, about 0.5° per second.",
"The maximum allowable vehicle speed may be a tunable value of between about 0° km/h and about 100 km/h, and in a specific example, about 3 km/h.",
"With further reference to FIG.",
"37, when the initiating routine 1310 is complete, the hitch angle calibration routine at step 1346 determines whether the hitch angle rate and the steering angle rate are both substantially zero, or alternatively stated, whether the hitch angle and the steering angles are substantially constant.",
"If the hitch angle rate and the steering angle rate are both not substantially zero, the hitch angle calibration routine 1308 continues to conduct the initiating routine 1310 at step 1324 and continues to take measurements with the sensor system 1200 until the hitch angle rate and steering angle rate are substantially zero.",
"Once they are both substantially zero, the hitch angle calibration routine 1308 then determines the actual hitch angle at step 1348 based on the vehicle 100 and trailer 110 generally fixed characteristics, as identified in the equations above.",
"With the actual hitch angle γ(a), the hitch angle calibration routine 1308 may then determine the offset γ(o) between the actual hitch angle γ(a) and the measured hitch angle γ(m) at step 1350.Upon determination of the offset γ(o), the calibration module is complete and the trailer backup assist system 105 may proceed for operation.",
"In an additional embodiment of the hitch angle calibration routine 1308, as illustrated in FIG.",
"39, a method is provided for calibrating the trailer backup assist system 105 for the trailer 110 attached to the vehicle 100, which provides driving the vehicle 100 forward substantially straight above a threshold speed.",
"The method also provides sensing a yaw rate of the vehicle 100 and sensing a measured hitch angle γ(m) of the trailer 110.Further, the method provides for determining an angle rate based on the measured hitch angle γ(m), and then determining an offset γ(o) between the measured hitch angle γ(m) and the actual hitch angle γ(a) when the yaw rate and the angle rate are substantially zero.",
"In the previously described embodiment of the hitch angle calibration routine 1308 with reference to FIG.",
"37, the vehicle 100 is reversing and therefore such an embodiment is configured for situations when the vehicle 100 may not be able to drive forward far enough to calibrate the trailer backup assist system 105.However, when space is available to drive the vehicle 100 forward, an alternative method may be used to determine the offset γ(o) between the actual hitch angle γ(a) and the measured hitch angle γ(m) that does not rely upon the accuracy of the measured or otherwise determined trailer geometry and dimensions.",
"Specifically, when setting up the trailer 110 with the vehicle 100, in one embodiment, the user may be instructed to measure various dimensions of the trailer 110, including the trailer length D. The dimensions of the vehicle 100, however, may be measured with a high degree of accuracy upon assembly of the vehicle or otherwise supplied in an accurate manner to the trailer backup assist system 105, such as with a hookup table provided by the vehicle manufacture.",
"With reference to FIG.",
"39, at step 700 the trailer backup assist system 105 again begins to calibrate the system for the trailer 110 attached to the vehicle 100.At step 1352, the system receives the vehicle characteristic including the dimensions of the vehicle 100 and the operating characteristics, such as the present gear of the transmission.",
"Then at step 1354, the system confirms that the vehicle is driving forward while the sensors of the sensor system 1200 take measurements and other readings.",
"Notably, in this illustrated embodiment, the sensors utilized include a sensor for determining the vehicle yaw rate, such as an onboard yaw rate sensor 1314 or a separate sensor configured to determine the yaw rate of the vehicle.",
"Also, the sensors being utilized by this embodiment of the hitch angle calibration routine include at least one hitch angle sensor 1312, as previously described with reference to the sensor system 1200.Still referring to FIG.",
"39, at step 1356, the steered wheels 1302 of the vehicle 100 are steered straight while the vehicle 100 is traveling forward.",
"It is contemplated that in one embodiment the user may be instructed to steer the vehicle straight by manually controlling the steering wheel.",
"In an additional embodiment, the vehicle 100 may automatically steer the vehicle 100 straight using the powering steering assist system 115.More specifically, the trailer backup assist system 105 may operate the steered wheels 1302 of the vehicle 100 using the servo steering motor 1300 in conjunction with the steering angle detection apparatus 140.Once the sensor readings are being received and the vehicle is being steered straight and driving forward, the illustrated embodiment of the hitch angle calibration routine 1308 then proceeds to process an initiating routine 1310 at step 1358.The initiating routine 1310 of the present embodiment may, similar to the initiating routine illustrated in FIG.",
"38, calculate filtered values for the steering wheel angle rate, the hitch angle rate, and the vehicle speed.",
"Furthermore, these filtered values may be compared against threshold values to ensure the hitch angle calibration routine is performed when vehicle conditions are acceptable for such calculation.",
"Specifically, the filtered steering angle rate may be less than a maximum allowable steering angle rate, the trailer angle rate may be less than the maximum allowable trailer angle rate, and the filtered vehicle speed may be less than the maximum allowable vehicle speed, such as 10 mph, 15 mph, or other conceivable threshold speed.",
"When these or more or fewer conditions are met, the system may proceed to the following step of the hitch angle calibration routine.",
"As also illustrated in FIG.",
"39, at step 1360 the hitch angle calibration routine 1308 determines whether the hitch angle rate and the yaw rate are both substantially zero.",
"Specifically, the determination of reaching a value of substantially zero may be one or a combination of the value being within a close proximity to zero or the value being zero or substantially zero over a predetermined period of time.",
"It is contemplated that the increment of time may be proportional to the filtered vehicle speed, such that increasing speed of the vehicle results in decreasing the increment of time the measured hitch angle γ(m) and the steering angle must be substantially constant to determine the offset γ(o).",
"It is also contemplated that the offset may be determined when the measured hitch angle and the steering angle are substantially constant while the vehicle and the trailer are reversing over a threshold distance, such as a distance greater than half a circumference of a steered wheel of the vehicle or other conceivable distances.",
"When the system makes a determination that both values are substantially zero, the system, at step 1362 is then able to determine the actual hitch angle γ(a) based upon the vehicle characteristics.",
"In one embodiment, when the above conditions are met the actual hitch angle γ(a) will be zero.",
"However, some vehicle characteristics, such as an offset hitch location, may result in the actual hitch angle γ(a) deviating from zero with these conditions met.",
"At step 1364 the system then determines the offset γ(o) between the actual hitch angle γ(a) and the measured hitch angle γ(m) for purposes of operating the trailer backup assist system 105.Again, at step 704 the trailer backup assist system 105 may notify the driver that the calibration is complete and may store the hitch angle offset value in memory to be associated with the attached trailer 110.Referring now to FIG.",
"40, an additional embodiment of the hitch angle calibration routine 1308 is illustrated that may consider the vehicle's direction of movement or potential direction of movement before choosing a method for determining the offset γ(o) of the measured hitch angle γ(m).",
"The vehicle's direction of movement may be based upon the presently engaged gear of the transmission, such as drive or reverse for automatic transmissions.",
"The vehicle's potential direction of movement, however, may be based upon the available space in front of or behind the vehicle and trailer combination.",
"At step 1366, if the vehicle 100 is moving in either the forward or rearward directions, the system may determine if enough available space exists for the vehicle 100 to continue moving in such direction and complete the calibration of the trailer backup assist system 105.If enough available space is not present, the hitch angle calibration routine 1308 of the illustrated embodiment may instruct the driver to move the vehicle 100 in the opposite or an alternative direction, provided enough available space exists in such direction to complete the calibration.",
"Also, if the vehicle 100 is not moving, the system may determine the preferred direction of movement for the vehicle 100 and trailer 110 to move to have enough space for the vehicle 100 to complete the calibration of the trailer backup assist system 105.At step 1368 the system may instruct the driver, such as through the HMI, to drive either forward or in reverse, as determined in the previous step 1366.Based on which direction the vehicle is instructed to move, this embodiment of the hitch angle calibration routine 1308 may employ one of two alternative methods to determine the actual hitch angle γ(a) for completing the calibration.",
"Specifically, if the vehicle 100 is traveling forward, at step 1370, the system then proceeds to ensure that the vehicle is steered straight 1372, while sensing the yaw rate of the vehicle 1374 and sensing the hitch angle rate 1376.The sensed hitch angle γ(m) is used by the system to determine the hitch angle rate at step 1378 and then continue on to step 1380 to determine when the hitch angle rate and the yaw rate of the vehicle are substantially zero, similar to the method previously described with reference to the embodiment disclosed in FIG.",
"39.When the hitch angle rate and the yaw rate of the vehicle are substantially zero, at step 1380 the hitch angle calibration routine 1308 may determine the actual hitch angle γ(a) to be substantially zero, which may then be used in conjunction with the measured hitch angle γ(m) to determine the offset γ(o) at step 1382.Alternatively, if the vehicle 100 is reversing or instructed to reverse, at step 1384, once the vehicle 100 is reversing, the system proceeds to sense the steering angle δ of the vehicle 100 at step 1386 and sense the hitch angle γ(m) at step 1388 to then determine the hitch angle rate and the steering angle rate at step 1390.The steering angle δ is the angle of the road wheels that steer the vehicle.",
"The steering wheel angle δ may be the angle of the steering wheel for a vehicle in which the steering wheel is mechanically coupled to the road wheels.",
"For a steer by wire arrangement, the steering angle δ may be measured by the angle of the steerable road wheels.",
"At step 1392 the system determines when both the hitch angle rate and the steering angle rate are substantially zero.",
"When both these values are substantially zero, the hitch angle calibration routine 1308 may determine the offset γ(o) of the measured hitch angle γ(m) based upon the length D of the trailer 110, the wheelbase length W of the vehicle 100, and the distance L from the rear axle of the vehicle 100 to the trailer 110, as generally set forth in the embodiment of the hitch angle calibration routine 1308 described with reference to FIGS.",
"37 and 38.In the embodiment disclosed in FIG.",
"40, once the hitch angle offset γ(o) is determined at step 1382, the calibration routine commences at step 704 and may notify the driver, such as via the HMI or another similar notification.",
"The hitch angle calibration routine 1308 illustrated in FIG.",
"40 illustrates one embodiment for calibrating the hitch angle both in the forward direction of travel based on the hitch angle rate and yaw rate being substantially zero and in the reverse vehicle direction based on the hitch angle rate and steering angle rate being substantially zero.",
"However, it should be appreciated that use of the hitch angle rate, the yaw rate, and the steering angle rate is one embodiment for determining a steady state condition during which the offset calibration may be performed.",
"The hitch angle calibration routine 1308 determines offset of the measured hitch angle when the vehicle and trailer are in a steady state condition.",
"The steady state condition may be when at least one steady state indicator on the trailer and at least one steady state indicator on the vehicle are constant in either the forward or reverse vehicle direction.",
"When this steady state condition is met, the expected trailer angle is calculated and the difference between the expected trailer angle and the measured trailer angle is determined as the offset.",
"The vehicle steady state indicator may include one or more of the following: the vehicle yaw rate is constant, the steering wheel or road wheel angle is constant, or the steering wheel or road wheel angle rate is substantially zero.",
"The trailer steady state indicator may include one or more of the following: the trailer yaw rate is constant, or the trailer hitch angle is constant, or the trailer hitch angle rate is substantially zero.",
"When the curvature command is zero while the vehicle is driven in reverse, the expected trailer angle is zero, and the offset is calculated from the difference from zero to the measured angle.",
"However, it should be appreciated that the offset may be calculated when the curvature command is not at zero during a non-straight travel path.",
"Referring now to FIG.",
"41, although the offset γ(o) generally may be determined while the vehicle 100 is moving forward or in reverse, there may be differences in accuracy of the offset γ(o) when depending on the direction of travel of the vehicle 100.Accordingly, the offset γ(o) may be determined separately as a reverse offset γ(or) or a forward offset γ(of).",
"In various embodiments, the reverse offset γ(or) determined while the vehicle 100 is reversing may be more accurate than the forward offset γ(of) determined while the vehicle 100 is moving forward.",
"While the vehicle 100 is towing the trailer 110 in the forward direction, the natural stability of the system may lead to the calculation of the forward offset γ(of) to be less accurate than the reverse offset γ(or) which is calculated during the more sensitive motion of backing the vehicle 100 and the trailer 110.Accordingly, prioritization of the reverse offset γ(or) over the forward offset γ(of) may be desirable.",
"In such an instance, a prioritization method 1400 may be used to prioritize the reverse offset γ(or) over the forward offset γ(of).",
"The prioritization method 1400 may be run at the same time as the hitch angle calibration routine 1308 and includes several of the same steps of the hitch angle calibration routine 1308 and may be run on the same controller or a different controller than the hitch angle calibration routine 1308.The prioritization method 1400 may include steps 1366, 1384, 1382A, 1382B, 1370, 1404, 1408, and 1412.Step 1366 detects that the vehicle 100 is moving.",
"Determination of the movement of the vehicle 100 may be accomplished via signals from wheel count encoders, a controller area network, a parking assist controller, a vehicle electronic control unit, a gear sensor or various other controllers and modules around the vehicle 100.Next, step 1384 determines whether the vehicle 100 is reversing.",
"If the vehicle 100 is reversing, the method 1400 proceeds to step 1382B and if the vehicle 100 is not moving in the reverse direction, the method 1400 proceeds to step 1370 of determining if the vehicle 100 is moving in a generally forward direction.",
"The vehicle 100 may be determined to be moving in the forward direction using any of the signals or controllers explained above.",
"In the event the vehicle 100 is determined to be moving in a forward direction in step 1370, the method 1400 proceeds to step 1382A of determining the forward offset γ(of).",
"The forward offset γ(of) is calculated in substantially the same manner as the offset γ(o) is calculated while the vehicle 100 is traveling in the forward direction, as explained above.",
"Once the forward offset γ(of) is calculated, the method 1400 proceeds to step 1404 of determining if a forward offset flag has been set.",
"If the forward offset flag has been set (e.g., logically expressed as true), the forward offset γ(of) the method 1400 is advanced to step 1412.If the forward offset flag is not set to true, the method 1400 returns to step 1366 of detecting which direction the vehicle 100 is moving in.",
"Step 1412 of the method 1400 stores the forward offset γ(of) for use during the hitch angle calibration or for later use with forward and reverse movement of the vehicle 100 and trailer 110.The forward offset flag is set to true if the reverse offset γ(or) is not yet stored or if the forward offset γ(of) is stored.",
"It will be understood that in various embodiments, the forward offset flag may not be set to true if the forward offset γ(of) is already stored.",
"Returning to step 1384, if the vehicle 100 is determined to be traveling in the reverse direction, the method 1400 advances to step 1382B of determining the reverse offset γ(or).",
"Similarly to the forward offset γ(of), the reverse offset γ(or) is calculated as the offset γ(o) when the vehicle 100 is traveling in the reverse direction, as described above.",
"Once the reverse offset γ(or) is determined, the method advances to step 1408 of determining if a reverse offset flag is set to true.",
"If yes, the method 1400 advances to step 1412 of storing the reverse offset γ(or).",
"Step 1412 may store the forward or reverse offsets γ(of), γ(or) in random-access memory, or may transfer the offsets γ(of), γ(or) to non-volatile random-access memory upon the shutting down of the vehicle 100.In various embodiments, if a forward offset γ(of) is calculated and stored prior to the reverse offset γ(or), the reverse offset γ(or) may substitute, exchange or otherwise replace the forward offset γ(of).",
"After the storing of the reverse offset γ(or) the method 1400 may not calculate the forward offset γ(of).",
"In some embodiments, if the reverse offset γ(or) is calculated again and is a different value than the stored value (e.g., due to a different trailer 110 being attached to the vehicle 100 or a new asymmetry of the trailer 110 and/or vehicle 100 being present) the stored reverse offset γ(or) may be substituted, exchanged, or otherwise replaced for the new value of the reverse offset γ(or).",
"In various embodiments, multiple forward and reverse offsets γ(of), γ(or) may be stored, which correspond to different trailers 110 or different typical asymmetries.",
"It will be understood that calculations of the forward and reverse offsets γ(of), γ(or) calculated after the storing of the forward and/or reverse offsets γ(of), γ(or) may not necessarily be discarded, but may be used to enhance the accuracy of the stored value by averaging the calculations together, regardless if it is a forward or reverse offset γ(of), γ(or), or by providing more than one data point for the method 1400 or routine 1308 to work from.",
"Use of the prioritization method 1400 may offer several advantages.",
"For example, by prioritizing the reverse offset γ(or) over the forward offset γ(of), a more accurate offset may be used when backing the vehicle 100 and trailer 110.Additionally, by storing the more accurate of the offsets, future calibration maneuvers may not need to be performed until a new asymmetry is detected with the vehicle 100 and/or trailer.",
"It is to be understood that variations and modifications can be made on the aforementioned structure without departing from the concepts of the present invention, and further it is to be understood that such concepts are intended to be covered by the following claims unless these claims by their language expressly state otherwise."
]
] |
Patent_15871409
|
[
[
"BATH SHOWER WITH DISPOSABLE FILTRATION UNIT",
"The present invention provides a water shower filter unit to provide clean treated water substantially free from chlorine, organic contaminants, and suspended solids by the use of primary filter, secondary filter and tertiary filter.",
"The primary filter constructed from polymer material capable of filtering particle of 10 microns and above for eliminating suspended solid.",
"The primary filter further comprises of chlorine removal material for removal of chlorine and contaminants.",
"The secondary filter made of multiple layers of activated balls.",
"Tertiary filter made of magnetic energy ceramics balls and mineral stones reside in elongated, hollow internal chamber of shower head is for water activation."
],
[
"1.A water shower filter unit having: at least one water storage tank; a shower head; a first flexible hose having a first end connected to a water inlet of a first water storage tank; a second flexible hose having a first end connected to a water outlet of a second water storage tank and a second end connected to the shower head; characterized in that the at least one water storage tank further comprises: a primary filter mounted within the first water storage tank; and a secondary filter embedded within the second water storage tank.",
"2.The water shower filter unit according to claim 1, wherein the primary filter is constructed from polymer material of high density fabric which includes FILTRON™.",
"3.The water shower filter unit according to claim 1, wherein the polymer material is able to filter particle of 10 microns and above.",
"4.The water shower filter unit according to claim 2 wherein the primary filter is disposable.",
"5.The water shower filter unit according to claim 1, wherein the primary filter comprises chlorine removal material to remove chlorine and contaminants from a water source.",
"6.The water shower filter unit according to claim 1, wherein the shower head is affixed with a hollow filter handle having elongated internal chamber for holding a tertiary filter.",
"7.The water shower filter unit according to claim 6, wherein the tertiary filter is embedded within the elongated internal chamber of the hollow filter handle.",
"8.The water shower filter unit according to claim 6, wherein the tertiary filter is made of magnetic energy ceramics balls and mineral stones.",
"9.The water shower filter unit according to claim 6, wherein the shower head is hand held."
],
[
"<SOH> BACKGROUND OF ART <EOH>Municipal water usually contains particles such as excessive chlorine, mud, clay, soil particle and rusty water is conveyed using steel pipes.",
"Untreated water supplies are being polluted by contaminants may result merely in an unpleasant odour or taste in the water or may cause severe consequences such as eyes irritation, skin rashes, and hair damage.",
"Therefore, water filter is used to purify the water and provide safer and raise the quality of the water supply.",
"One example of shower water filter is disclosed in the U.S. Pat.",
"No.",
"6,016,977 (US 977 Patent) entitled “Hand Held Shower Head and Filter Housing” having a filing date of 29 Jul.",
"1998 (Applicant: David K. Farley) disclosed a hand held shower head and filter assembly using non-soluble calcium sulfite for filtering contaminants from hot water passing there through at high flow rates.",
"As disclosed in the US 977 Patent, the hand held shower head and filter having an elongated, hollow handle.",
"The filter element of the US 977 Patent may have a filter media, such as non-soluble calcium sulphite, alone or combined with a copper-zinc medium therein.",
"Another example of shower water filter is disclosed in the U.S. Pat.",
"No.",
"6,537,455 (US 455 Patent) entitled “Elongated Hand-held Shower Head and Filter” having a grant date of 25 Mar.",
"2003 (Applicant: David K. Farley) disclosed a combination of hand held shower head and water filter assembly for filtering contaminants from hot water passing there through at high flow rates.",
"It is further provided in the US 455 Patent to provide an improved elongated combination hand held shower head and water filter having a swivel shower head attached to an elongated in line hose filter that is sized and dimensioned to it into a holding bracket in two positions.",
"A further example of shower water filter is disclosed in the U.S. Pat.",
"No.",
"6,096,197 (US 197 Patent) entitled “Shower Filter For Chlorine Removal and Scale Deposit Prevention” having a filing date of 11 Dec. 1997 (Applicant: Douglas E. Hughes) disclosed dual-purpose shower and bath filter to reduce chlorine in shower water through absorption, reduce or eliminate scale deposits.",
"The filter unit enables a single device to simultaneously prevent scale deposits from forming on plumbing and wall surfaces while also reducing or eliminating the chlorine from shower spray.",
"It is further disclosed in US 197 Patent that the filter cartridge accomplishes the scale reduction or prevention by treating water with a specially designed phosphate that coats scale (comprising calcium and magnesium) so that it will not stick to plumbing or wall surfaces.",
"Further, the filter cartridge accomplishes the reduction or elimination of chlorine in the water through the absorption capabilities of a superfine mesh powdered activated carbon, formed into a carbon block.",
"It is the general object of the invention to provide an improved water shower filter unit that effectively removes chlorine, organic contaminants and suspended solid from shower water through multi-layer filter which can further enhance the water quality during bathing and showering."
],
[
"<SOH> SUMMARY OF INVENTION <EOH>The present invention relates to a water shower unit with disposable filtration unit.",
"One aspect of the invention is to provide a water shower filter unit having at least one water storage tank; a shower head; a first flexible hose having a first end connected to a water inlet of a first water storage tank; a second flexible hose having a first end connected to a water outlet of a second water storage tank and a second end connected to the shower head.",
"The at least one water storage tank comprises a primary filter mounted within the first water storage tank and a secondary filter embedded within the second water storage tank.",
"Another aspect of the invention is to provide a primary filter is constructed from polymer material of high density fabric which includes FILTRON™.",
"A further aspect of the invention is to provide the polymer material is able to filter particle of 10 microns and above.",
"Another aspect of the present invention is to provide the primary filter is disposable.",
"Another aspect of the invention is to provide the primary filter comprises chlorine removal material to remove chlorine and contaminants from a water source.",
"Another aspect of the invention is to provide the shower head is affixed with a hollow filter handle having elongated internal chamber for holding a tertiary filter.",
"A further aspect of the invention is to provide the tertiary filter is embedded within the elongated internal chamber of the hollow filter handle.",
"Yet another aspect of the invention is to provide the tertiary filter is made of magnetic energy ceramics balls and mineral stones.",
"Another aspect of the invention provides that the shower head is hand held.",
"The present invention consists of features and a combination of parts hereinafter fully described and illustrated in the accompanying drawings, it being understood that various changes in the details may be made without departing from the scope of the invention or sacrificing any of the advantages of the present invention."
],
[
"CROSS-REFERENCE This patent application is a continuation-in-part of U.S. application Ser.",
"No.",
"15/349,321 filed Nov. 11, 2016, which is incorporated herein by reference.",
"FIELD OF INVENTION The present invention relates to a bath shower unit with disposable filtration unit.",
"BACKGROUND OF ART Municipal water usually contains particles such as excessive chlorine, mud, clay, soil particle and rusty water is conveyed using steel pipes.",
"Untreated water supplies are being polluted by contaminants may result merely in an unpleasant odour or taste in the water or may cause severe consequences such as eyes irritation, skin rashes, and hair damage.",
"Therefore, water filter is used to purify the water and provide safer and raise the quality of the water supply.",
"One example of shower water filter is disclosed in the U.S. Pat.",
"No.",
"6,016,977 (US 977 Patent) entitled “Hand Held Shower Head and Filter Housing” having a filing date of 29 Jul.",
"1998 (Applicant: David K. Farley) disclosed a hand held shower head and filter assembly using non-soluble calcium sulfite for filtering contaminants from hot water passing there through at high flow rates.",
"As disclosed in the US 977 Patent, the hand held shower head and filter having an elongated, hollow handle.",
"The filter element of the US 977 Patent may have a filter media, such as non-soluble calcium sulphite, alone or combined with a copper-zinc medium therein.",
"Another example of shower water filter is disclosed in the U.S. Pat.",
"No.",
"6,537,455 (US 455 Patent) entitled “Elongated Hand-held Shower Head and Filter” having a grant date of 25 Mar.",
"2003 (Applicant: David K. Farley) disclosed a combination of hand held shower head and water filter assembly for filtering contaminants from hot water passing there through at high flow rates.",
"It is further provided in the US 455 Patent to provide an improved elongated combination hand held shower head and water filter having a swivel shower head attached to an elongated in line hose filter that is sized and dimensioned to it into a holding bracket in two positions.",
"A further example of shower water filter is disclosed in the U.S. Pat.",
"No.",
"6,096,197 (US 197 Patent) entitled “Shower Filter For Chlorine Removal and Scale Deposit Prevention” having a filing date of 11 Dec. 1997 (Applicant: Douglas E. Hughes) disclosed dual-purpose shower and bath filter to reduce chlorine in shower water through absorption, reduce or eliminate scale deposits.",
"The filter unit enables a single device to simultaneously prevent scale deposits from forming on plumbing and wall surfaces while also reducing or eliminating the chlorine from shower spray.",
"It is further disclosed in US 197 Patent that the filter cartridge accomplishes the scale reduction or prevention by treating water with a specially designed phosphate that coats scale (comprising calcium and magnesium) so that it will not stick to plumbing or wall surfaces.",
"Further, the filter cartridge accomplishes the reduction or elimination of chlorine in the water through the absorption capabilities of a superfine mesh powdered activated carbon, formed into a carbon block.",
"It is the general object of the invention to provide an improved water shower filter unit that effectively removes chlorine, organic contaminants and suspended solid from shower water through multi-layer filter which can further enhance the water quality during bathing and showering.",
"SUMMARY OF INVENTION The present invention relates to a water shower unit with disposable filtration unit.",
"One aspect of the invention is to provide a water shower filter unit having at least one water storage tank; a shower head; a first flexible hose having a first end connected to a water inlet of a first water storage tank; a second flexible hose having a first end connected to a water outlet of a second water storage tank and a second end connected to the shower head.",
"The at least one water storage tank comprises a primary filter mounted within the first water storage tank and a secondary filter embedded within the second water storage tank.",
"Another aspect of the invention is to provide a primary filter is constructed from polymer material of high density fabric which includes FILTRON™.",
"A further aspect of the invention is to provide the polymer material is able to filter particle of 10 microns and above.",
"Another aspect of the present invention is to provide the primary filter is disposable.",
"Another aspect of the invention is to provide the primary filter comprises chlorine removal material to remove chlorine and contaminants from a water source.",
"Another aspect of the invention is to provide the shower head is affixed with a hollow filter handle having elongated internal chamber for holding a tertiary filter.",
"A further aspect of the invention is to provide the tertiary filter is embedded within the elongated internal chamber of the hollow filter handle.",
"Yet another aspect of the invention is to provide the tertiary filter is made of magnetic energy ceramics balls and mineral stones.",
"Another aspect of the invention provides that the shower head is hand held.",
"The present invention consists of features and a combination of parts hereinafter fully described and illustrated in the accompanying drawings, it being understood that various changes in the details may be made without departing from the scope of the invention or sacrificing any of the advantages of the present invention.",
"BRIEF DESCRIPTION OF THE ACCOMPANYING DRAWING To further clarify various aspects of some embodiments of the present invention, a more particular description of the invention will be rendered by references to specific embodiments thereof, which are illustrated in the appended drawings.",
"It is appreciated that these drawings depict only typical embodiments of the invention and are therefore not to be considered limiting of its scope.",
"The invention will be described and explained with additional specificity and detail through the accompanying drawings.",
"FIG.",
"1 illustrates the exploded perspective view of the shower water filter unit.",
"DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS The present invention relates to a water shower unit with disposable filtration unit.",
"Hereinafter, this specification will describe the present invention according to the preferred embodiments.",
"It is to be understood that limiting the description to the preferred embodiments of the invention is merely to facilitate discussion of the present invention and it is envisioned without departing from the scope of the appended claims.",
"FIG.",
"1 illustrates a water shower filter unit of the present invention.",
"As illustrated in FIG.",
"1, the water shower filter unit comprises a housing (104), a water storage tank (108a, 108b) having a water inlet and a water outlet, a shower head (120); a first flexible hose having a first end connected to a water inlet (180a) of a first water storage tank (108a); a second flexible hose having a first end connected to a water outlet (180d) of a second water storage tank (108b) and a second end connected to the shower head (120).",
"The water storage tank (108a, 108b) comprises a primary filter (112) and a secondary filter (114).",
"The housing (104) of the water shower filter unit having a cover (102) and an interior space for enclosing at least one water storage tanks (108a, 108b).",
"The water storage tanks (108a, 108b) comprises a first water storage tank (108a) and a second water storage tank (108b) whereby each of the water storage tank having a water inlet (180a, 180c) and a water outlet (180b, 180d) at bottom of the water storage tank.",
"Each of the water storage tanks (108a, 108b) includes a tank cover (106).",
"The first water storage tank (108a) having a water inlet (180a) which is connected to a flexible hose (150) for receiving incoming water from the water source (i.e.",
"municipal water) and a water outlet (180b) connected to a central pipe of a primary filter's holder (111) to allow filtered water to flow to a water inlet (180c) of the second water storage tank (108b) through a coupling member (122).",
"A water outlet (180d) of the second water storage tank is connected to a central pipe (140) whereby a first end of a flexible hose is connected to the water outlet (180d) of the second water storage tank and a second end of a flexible hose is connected to a hollow filter handle (117) of a shower head.",
"The shower head (120) may be constructed in any conventional or known manner from any acceptable material, such as a high strength plastic or the like.",
"The shower head (120) is affixed to a hollow filter handle (117) having elongated internal chamber to hold a tertiary filter (116).",
"The hollow filter handle (117) may be used as a handle for grasping or holding the shower head (120).",
"The first end of a flexible hose (150) connected to the water outlet (180d) of the second water storage tank (108) and the second end of the flexible hose connected to the hollow filter handle (117) of a shower head.",
"The first stage of filtration is the primary filter (112).",
"The primary filter (112) is mounted within the first water storage tank (108a).",
"The primary filter (112) is made of disposable polymer material preferably high density fabric (143) which includes FILTRON™ whereby the filtration medium wrapped around a filter holder (111).",
"The filter holder (111) having a central pipe which allows overflow of filtered water to flow to the water inlet (180c) of the second water storage tank (108b).",
"The central pipe comprises of chlorine removal material to remove residual chlorine and contaminants from the municipal water source and supply.",
"Preferably, the polymer material of the primary filter may be selected from the group consisting of Polyester, Polyethylene (PE), Polypropylene (PP) or high density fabric (i.e.",
"FILTRON™) due to its ability to remove suspended solid, rust and filter off particles of 10 microns and above.",
"FILTRON™ filter fabric is a high density-type fabric with small pore size of 10 microns and air permeability rate of ˜20%.",
"Other filtration medium that can achieve this can also be used instead.",
"The second stage of filtration is the secondary filter (114).",
"The secondary filter (114) comprises of multiple layers of activated balls (145, 147) arranged within a second storage tank (108b), whereby the multiple layers of balls are divided by a spacer (130).",
"An end cap (132) is affixed to a top portion of a central pipe (140) to prevent the activated balls from flowing into the central pipe during the filtration process.",
"The balls are energy balls preferably made of ceramic (145, 147) with the presence of ceramic mineral which emits a large amount of anions and far-infrared rays.",
"The energy balls can treat water to produce smaller water cluster, removes bad odors, and increases dissolved oxygen in water.",
"The third stage of filtration is the tertiary filter.",
"The tertiary filter (116) contains magnetic energy ceramics balls and mineral stones held in elongated cylindrical filter cartridge which is aligned to be coaxial with longitudinal axis of the hollow filter handle (117).",
"The magnetic energy ceramic balls are made of mineral materials (i.e.",
"ferrite) and other functional materials such as silicon nitride and zirconium dioxide through high temperature sintering which combines with a permanent magnetic particulate.",
"The magnetic energy ceramics balls and mineral stones of the tertiary filter (116) activates the water molecules in such a way that the water changes to magnetized water upon flowing through the magnetic energy ceramic balls results in changes of physical and chemical properties of water due to electromagnetic induction in the magnetic field.",
"The water molecules that undergo activation treatment by magnetic field or bio-ceramic stones will transform into smaller clusters of water molecules.",
"Such water molecules can easily absorb by the human body and magnetized water may activate certain enzyme activity.",
"In use, the water flows from the water inlet (180a) at the bottom of the first water storage tank (108a) and subsequently the water flows upwards through the primary filter (112) for removal of chlorine and suspended solid.",
"The filtered water is then overflows within the first water storage tank (108a) causing the filtered water to flow down through the central pipe of the primary filter's holder which is connected to the water inlet (180c) of the second water storage tank (108b) through a coupling member (122).",
"Next, the filtered water flows upward through multiple layers of activated balls of the secondary filter (114).",
"The overflow of filtered water within the second water storage tank (108b) directs the filtered water to flow downwards through the central pipe (140) to a water outlet (180d) at the bottom of the second water storage tank (108b).",
"The filtered water is flowed through the flexible hose (150) for further filtration by tertiary filter (116) which is embedded within the hollow filter handle (117) before exiting through the shower head (120).",
"The present embodiments are considered as merely illustrative and not restrictive, the description to the preferred embodiments of the invention is merely to facilitate discussion of the present invention and it is envisioned without departing from the scope of the appended claims.",
"Unless the context requires otherwise or specifically stated to the contrary, integers, steps or elements of the invention recited herein as singular integers, steps or elements clearly encompass both singular and plural forms of the recited integers, steps or elements.",
"Throughout this specification, unless the context requires otherwise, the word “comprise”, or variations such as “comprises” or “comprising”, will be understood to imply the inclusion of a stated step or element or integer or group of steps or elements or integers, but not the exclusion of any other step or element or integer or group of steps, elements or integers.",
"Thus, in the context of this specification, the term “comprising” is used in an inclusive sense and thus should be understood as meaning “including principally, but not necessarily solely”."
]
] |
Patent_15871410
|
[
[
"VEHICULAR COMMUNICATIONS NETWORK AND METHODS OF USE AND MANUFACTURE THEREOF",
"Some embodiments are directed to a computer-implemented method for controlling a vehicle and includes determining a current environment of the vehicle based on a current location of the vehicle, and detecting vulnerable road users (VRUs) disposed in proximity to the vehicle based on messages communicated using a vehicular communications network.",
"The method includes modifying a collision warning system of the vehicle according to the current environment of the vehicle and a number of the detected VRUs."
],
[
"1.A computer-implemented method for controlling a vehicle, comprising: determining a current environment of the vehicle based on a current location of the vehicle; detecting vulnerable road users (VRUs) disposed in proximity to the vehicle based on messages communicated using a vehicular communications network; and modifying a collision warning system of the vehicle according to the current environment of the vehicle and a number of the detected VRUs.",
"2.The computer-implemented method of claim 1, including setting a warning mode of the collision warning system based on the current environment of the vehicle.",
"3.The computer-implemented method of claim 1, wherein the current environment of the vehicle is a classification of a path on which the vehicle is traveling.",
"4.The computer-implemented method of claim 1, wherein the current environment of the vehicle is at least one of a rural zone, a suburban zone, and an urban zone.",
"5.The computer-implemented method of claim 1, including sensing entity movement of the detected VRUs relevant to a path on which the vehicle is traveling, and modifying the collision warning system of the vehicle according to the entity movement.",
"6.The computer-implemented method of claim 1, including determining whether the number of the detected VRUs indicates high pedestrian traffic according to the current environment of the vehicle.",
"7.The computer-implemented method of claim 1, including determining a predetermined threshold number of VRUs for the current environment of the vehicle.",
"8.The computer-implemented method of claim 7, wherein the predetermined threshold number of VRUs indicates high pedestrian traffic for the current environment of the vehicle either simultaneously or over a predefined time period.",
"9.The computer-implemented method of claim 1, wherein upon determining the number of detected VRUs exceeds a predetermined threshold number of VRUs, modifying the collision warning system includes adjusting a frequency of alerts thereby generating the alerts less frequently.",
"10.The computer-implemented method of claim 1, wherein upon determining the number of detected VRUs exceeds a predetermined threshold number of VRUs, modifying the collision warning system includes changing a type of alert to display information about the VRUs on a driver vehicle interface.",
"11.The computer-implemented method of claim 1, including detecting a transition from the current environment to a new environment, and modifying the collision warning system of the vehicle according to the new environment.",
"12.A vehicle system of a vehicle traveling along a path, comprising: a geographic position component that is configured to detect vehicle location data of the vehicle; at least one transceiver operably connected for communication with a vehicular communications network, the transceiver configured to receive vehicle-to-pedestrian (V2P) signals from vulnerable road users (VRUs); a driver vehicle interface that is configured to communicate information to a vehicle operator; and a processor that is configured to: determine a current environment and a current location of the vehicle based on the vehicle location data, determine a number of VRUs disposed in proximity to the vehicle based on the V2P signals, and modify the vehicle system according to the current environment of the vehicle and the number of VRUs.",
"13.The vehicle system of claim 12, including at least one sensor that is configured to sense current path data relevant to current conditions of the path, wherein the current path data includes entity movement of the VRUs relevant to the path, wherein the processor is configured to determine an event pattern of entity movement of the VRUs relevant to the current location of the vehicle, and modify the vehicle system according to the event pattern.",
"14.The vehicle system of claim 12, wherein the current environment of the vehicle is at least one of a rural zone, a suburban zone, and an urban zone.",
"15.The vehicle system of claim 12, wherein the processor is configured to determine a predetermined threshold number of VRUs indicating high pedestrian traffic for the current environment of the vehicle.",
"16.The vehicle system of claim 15, wherein the processor is configured to modify a frequency of alerts of the vehicle system communicated by the driver vehicle interface based on the predetermined threshold number of VRUs and the determined number of VRUs.",
"17.A vehicular communications network for use with a vehicle configured for travel along a path, at least one source of vehicle location data, and at least one source of current path data relevant to current conditions of the path, the vehicular communications network comprising: a processor that is configured to: access the vehicle location data and the current path data; determine a current environment of the vehicle based on the vehicle location data; detect vulnerable road users (VRUs) disposed in proximity to the vehicle based on the current path data; and modify a driver vehicle interface according to the current environment of the vehicle and a number of the detected VRUs.",
"18.The vehicular communications network of claim 17, wherein the processor is configured to determine an event pattern of entity movement of the detected VRUs indicating a potential of the detected VRUs to move onto the path based on the current path data, and wherein the processor is configured to modify the driver vehicle interface according to the event pattern.",
"19.The vehicular communications network of claim 17, wherein the processor is configured to set a warning mode of a collision warning system of the vehicle based on the current environment of the vehicle.",
"20.The vehicular communications network of claim 17, wherein the processor is configured to modify the driver vehicle interface by adjusting a frequency of alerts provided by the driver vehicle interface as a function of the number of the detected VRUs."
],
[
"<SOH> BACKGROUND <EOH>The disclosed subject matter relates to vehicular communications networks and methods of use and manufacture thereof.",
"In particular, some embodiments relate to methods and apparatus for generating, transmitting, and/or receiving data along a vehicular communications network relating to a vehicle's location and/or path or route of travel.",
"Various conditions may be relevant to a vehicle's travel along a path or route.",
"For example, in the context of vehicles that travel over land, such as an automobile configured for travel along a road, a vast array of circumstances may arise that can affect or otherwise be relevant to the vehicle's travel.",
"An entity, such as another vehicle, pedestrian, bicyclist, etc., may move to a location immediately in front of the vehicle on the road, causing the vehicle to contact the entity unless the vehicle stops, changes course, etc.",
"As another example, other types of circumstances may arise making it preferable to change the vehicle's path or route of travel, such as to enable the vehicle to arrive at a certain destination more safely, quickly, efficiently, etc.",
"Changing traffic patterns may make a vehicle's current path of travel more congested, and thus a different path may be preferable.",
"Vehicles may be provided with methods and apparatus for addressing the above conditions.",
"For example, sensors can be mounted on vehicles to detect entities currently disposed in the vehicle's immediate path of travel for the purpose of warning the vehicle's operator to take action to avoid crashing into the entity.",
"Vehicular operators may also utilize global positioning systems (GPSs) to determine currently effective routes of travel, and even modify these routes based on changing traffic conditions.",
"In other words, current conditions can be monitored for the purpose of benefitting vehicular operators."
],
[
"<SOH> SUMMARY <EOH>The monitoring and use of data other than currently sensed or real time data may further benefit vehicular operators.",
"For example, historical data may be used to provide further guidance, such as to advise vehicular operators to change travel routes.",
"As one example, a certain route may be very congested at certain times and/or days of the week (such as during a weekday rush hour), making it more effective to take another (albeit longer) route that is less congested at the relevant time, day, etc.",
"Historical data relating to the physical conditions of certain roads, bridges, etc.",
"at certain times, days of the week, etc.",
"may also affect route selection.",
"Historical data may be used to select enhanced routes of travel based on safety issues that may arise at certain times of day, days of the week, times of the year, etc., such as to avoid certain roads during times of the year where treacherous conditions may exist, e.g., ice, snow, flooding, etc.",
"Historical data by itself may be used to determine that a trend or pattern at a certain time, day of the week, time of the year, etc., at a certain location along a vehicle's path or route is likely to occur.",
"As one example, pedestrians, bicyclists, etc., may tend to illegally cross a street at certain times of day (such as when a local school releases its students), or automobiles may tend to illegally fail to stop for a red light of an intersection at certain times of day (such as near the time when workers need to arrive at a local office).",
"This trend or pattern may be used to alert a vehicle operator of these potentially dangerous conditions if the vehicle will be traveling proximate these locations at the relevant times, etc.",
"However, the trend or pattern that is determined based solely on the historical data may frequently be inaccurate, and thus may result in unnecessarily alerting the vehicle operator and thus needlessly annoying or distracting the vehicle operator.",
"In addition, the effectiveness of historical data alone may be limited to predictable events, such as the regular closure of roads, bridges, etc., or regular traffic patterns.",
"However, some traffic patterns or road hazards do not follow regular or predictable schedules, and may change periodically.",
"It may therefore be beneficial to combine historical data with other data, or otherwise use historical data more dynamically, such as to address less predictable events.",
"For example, trends or patterns can be determined based on historical data collected from one or multiple sources, and the relevance of these trends or patterns can be predicted based on other types of data, such as data relating to current conditions.",
"It may therefore be even more beneficial to supplement the trends or patterns that are determined based on historical data with more relevant or current data.",
"In other words, it may be beneficial to warn a vehicle operator where both of the following occur: 1) historical data indicates that a certain trend exists that may be relevant to the vehicle's travel along the path or route; and 2) currently sensed or other data indicates an increased likelihood that the trend will occur.",
"For example, using data indicating the existence of an entity relevant to the trend, such as an actual bicycle or pedestrian approaching a road where bicyclists or pedestrians trend to cross illegally, or the approach of an actual automobile to an intersection where automobiles tend to fail to stop at red lights, may provide vehicular operators with even better or more effective information.",
"Some embodiments are therefore directed to ascertaining a potential road hazard or collision with another entity, such as a vehicle, pedestrian, or wildlife, and sharing the information within a vehicle communication network.",
"Some embodiments are directed to data logging of unexpected or incompliant actual or potential road hazards and scenarios into a database for integration with a vehicle collision warning system.",
"Embodiments include making a determination of a potential road hazard that could become a collision event, data logging potential road hazards, vehicle data, traffic and vehicle data from other vehicles and users, and environmental data external to a vehicle, predicting a road hazard based on patterns of collected data, and methods of sharing alert information with other vehicles and users in a vehicle communication network.",
"More particularly, some embodiments are directed to a computer-implemented method for controlling a vehicle, and includes determining a current environment of the vehicle based on a current location of the vehicle, and detecting vulnerable road users (VRUs) disposed in proximity to the vehicle based on messages communicated using a vehicular communications network.",
"The method includes modifying a collision warning system of the vehicle according to the current environment of the vehicle and a number of the detected VRUs.",
"Some other embodiments are directed to a vehicle system of a vehicle traveling along a path.",
"The vehicle system includes a geographic position component that is configured to detect vehicle location data of the vehicle, at least one transceiver operably connected for communication with a vehicular communications network that is configured to receive vehicle-to-pedestrian (V2P) signals from vulnerable road users (VRUs), and a driver vehicle interface that is configured to communicate information to a vehicle operator.",
"Further, the vehicle system includes a processor that is configured to determine a current environment and a current location of the vehicle based on the vehicle location data, and determine a number of VRUs disposed in proximity to the vehicle based on the V2P signals.",
"The processor is configured to modify the vehicle system according to the current environment of the vehicle and the number of VRUs.",
"Still other embodiments are directed to a vehicular communications network for use with a vehicle configured for travel along a path, at least one source of vehicle location data, and at least one source of current path data relevant to current conditions of the path.",
"The vehicular communications network includes a processor that is configured to access the vehicle location data and the current path data, determine a current environment of the vehicle based on the vehicle location data, and detect vulnerable road users (VRUs) disposed in proximity to the vehicle based on the current path data.",
"The processor is configured to modify a driver vehicle interface according to the current environment of the vehicle and a number of the detected VRUs."
],
[
"This application is a continuation U.S. application Ser.",
"No.",
"15/073,598 filed on Mar.",
"17, 2016, which is expressly incorporated herein by reference.",
"BACKGROUND The disclosed subject matter relates to vehicular communications networks and methods of use and manufacture thereof.",
"In particular, some embodiments relate to methods and apparatus for generating, transmitting, and/or receiving data along a vehicular communications network relating to a vehicle's location and/or path or route of travel.",
"Various conditions may be relevant to a vehicle's travel along a path or route.",
"For example, in the context of vehicles that travel over land, such as an automobile configured for travel along a road, a vast array of circumstances may arise that can affect or otherwise be relevant to the vehicle's travel.",
"An entity, such as another vehicle, pedestrian, bicyclist, etc., may move to a location immediately in front of the vehicle on the road, causing the vehicle to contact the entity unless the vehicle stops, changes course, etc.",
"As another example, other types of circumstances may arise making it preferable to change the vehicle's path or route of travel, such as to enable the vehicle to arrive at a certain destination more safely, quickly, efficiently, etc.",
"Changing traffic patterns may make a vehicle's current path of travel more congested, and thus a different path may be preferable.",
"Vehicles may be provided with methods and apparatus for addressing the above conditions.",
"For example, sensors can be mounted on vehicles to detect entities currently disposed in the vehicle's immediate path of travel for the purpose of warning the vehicle's operator to take action to avoid crashing into the entity.",
"Vehicular operators may also utilize global positioning systems (GPSs) to determine currently effective routes of travel, and even modify these routes based on changing traffic conditions.",
"In other words, current conditions can be monitored for the purpose of benefitting vehicular operators.",
"SUMMARY The monitoring and use of data other than currently sensed or real time data may further benefit vehicular operators.",
"For example, historical data may be used to provide further guidance, such as to advise vehicular operators to change travel routes.",
"As one example, a certain route may be very congested at certain times and/or days of the week (such as during a weekday rush hour), making it more effective to take another (albeit longer) route that is less congested at the relevant time, day, etc.",
"Historical data relating to the physical conditions of certain roads, bridges, etc.",
"at certain times, days of the week, etc.",
"may also affect route selection.",
"Historical data may be used to select enhanced routes of travel based on safety issues that may arise at certain times of day, days of the week, times of the year, etc., such as to avoid certain roads during times of the year where treacherous conditions may exist, e.g., ice, snow, flooding, etc.",
"Historical data by itself may be used to determine that a trend or pattern at a certain time, day of the week, time of the year, etc., at a certain location along a vehicle's path or route is likely to occur.",
"As one example, pedestrians, bicyclists, etc., may tend to illegally cross a street at certain times of day (such as when a local school releases its students), or automobiles may tend to illegally fail to stop for a red light of an intersection at certain times of day (such as near the time when workers need to arrive at a local office).",
"This trend or pattern may be used to alert a vehicle operator of these potentially dangerous conditions if the vehicle will be traveling proximate these locations at the relevant times, etc.",
"However, the trend or pattern that is determined based solely on the historical data may frequently be inaccurate, and thus may result in unnecessarily alerting the vehicle operator and thus needlessly annoying or distracting the vehicle operator.",
"In addition, the effectiveness of historical data alone may be limited to predictable events, such as the regular closure of roads, bridges, etc., or regular traffic patterns.",
"However, some traffic patterns or road hazards do not follow regular or predictable schedules, and may change periodically.",
"It may therefore be beneficial to combine historical data with other data, or otherwise use historical data more dynamically, such as to address less predictable events.",
"For example, trends or patterns can be determined based on historical data collected from one or multiple sources, and the relevance of these trends or patterns can be predicted based on other types of data, such as data relating to current conditions.",
"It may therefore be even more beneficial to supplement the trends or patterns that are determined based on historical data with more relevant or current data.",
"In other words, it may be beneficial to warn a vehicle operator where both of the following occur: 1) historical data indicates that a certain trend exists that may be relevant to the vehicle's travel along the path or route; and 2) currently sensed or other data indicates an increased likelihood that the trend will occur.",
"For example, using data indicating the existence of an entity relevant to the trend, such as an actual bicycle or pedestrian approaching a road where bicyclists or pedestrians trend to cross illegally, or the approach of an actual automobile to an intersection where automobiles tend to fail to stop at red lights, may provide vehicular operators with even better or more effective information.",
"Some embodiments are therefore directed to ascertaining a potential road hazard or collision with another entity, such as a vehicle, pedestrian, or wildlife, and sharing the information within a vehicle communication network.",
"Some embodiments are directed to data logging of unexpected or incompliant actual or potential road hazards and scenarios into a database for integration with a vehicle collision warning system.",
"Embodiments include making a determination of a potential road hazard that could become a collision event, data logging potential road hazards, vehicle data, traffic and vehicle data from other vehicles and users, and environmental data external to a vehicle, predicting a road hazard based on patterns of collected data, and methods of sharing alert information with other vehicles and users in a vehicle communication network.",
"More particularly, some embodiments are directed to a computer-implemented method for controlling a vehicle, and includes determining a current environment of the vehicle based on a current location of the vehicle, and detecting vulnerable road users (VRUs) disposed in proximity to the vehicle based on messages communicated using a vehicular communications network.",
"The method includes modifying a collision warning system of the vehicle according to the current environment of the vehicle and a number of the detected VRUs.",
"Some other embodiments are directed to a vehicle system of a vehicle traveling along a path.",
"The vehicle system includes a geographic position component that is configured to detect vehicle location data of the vehicle, at least one transceiver operably connected for communication with a vehicular communications network that is configured to receive vehicle-to-pedestrian (V2P) signals from vulnerable road users (VRUs), and a driver vehicle interface that is configured to communicate information to a vehicle operator.",
"Further, the vehicle system includes a processor that is configured to determine a current environment and a current location of the vehicle based on the vehicle location data, and determine a number of VRUs disposed in proximity to the vehicle based on the V2P signals.",
"The processor is configured to modify the vehicle system according to the current environment of the vehicle and the number of VRUs.",
"Still other embodiments are directed to a vehicular communications network for use with a vehicle configured for travel along a path, at least one source of vehicle location data, and at least one source of current path data relevant to current conditions of the path.",
"The vehicular communications network includes a processor that is configured to access the vehicle location data and the current path data, determine a current environment of the vehicle based on the vehicle location data, and detect vulnerable road users (VRUs) disposed in proximity to the vehicle based on the current path data.",
"The processor is configured to modify a driver vehicle interface according to the current environment of the vehicle and a number of the detected VRUs.",
"BRIEF DESCRIPTION OF THE DRAWINGS The disclosed subject matter of the present application will now be described in more detail with reference to exemplary embodiments of the apparatus and method, given by way of example, and with reference to the accompanying drawings, in which: FIG.",
"1 is a schematic of a traffic scenario that involves an intersection.",
"FIG.",
"2 is a schematic of a vehicle communication network according to aspects of the embodiments.",
"FIG.",
"3 is a schematic of an embodiment for a service provider of the vehicle communication network of FIG.",
"2.FIG.",
"4 is a schematic of a collision warning system of the vehicle communications network shown in FIG.",
"2.FIG.",
"5 is a schematic of vehicle systems that can be associated with the collision warning system of FIG.",
"4.FIG.",
"6 is a schematic of an exemplary design of a vehicle interior associated with the collision warning system of FIG.",
"4.FIG.",
"7 is a flowchart of an exemplary method to inform a vehicle of potential collision events in conjunction with the collision warning system of FIG.",
"4.FIG.",
"8 is a flowchart of an exemplary method to predict potential collision events and alert a vehicle in conjunction with the collision warning system of FIG.",
"4.FIG.",
"9 is a flowchart of an exemplary method for receiving and classifying new event data in conjunction with the collision warning system of FIG.",
"4.FIG.",
"10 is a functional flowchart of an exemplary method for comparing new event data with patterns of prior event data events in conjunction with the collision warning system of FIG.",
"4.FIG.",
"11 illustrates an embodiment of the collision warning system of FIG.",
"4 alerting a vehicle of potential collision scenarios with pedestrians.",
"FIG.",
"12 illustrates an embodiment of the collision warning system of FIG.",
"4 alerting a vehicle of a potential collision scenario with a bicycle.",
"FIG.",
"13 illustrates an embodiment of the collision warning system of FIG.",
"4 alerting a vehicle of a potential collision scenario with wildlife.",
"FIG.",
"14 is a flowchart of a method for configuring the collision warning system of FIG.",
"4 based on an environment.",
"FIG.",
"15 is a flowchart of a method to update event data at the collision warning system of FIG.",
"4 by the service provider of FIG.",
"3.FIG.",
"16 is a flowchart of an exemplary method for transmitting event data to the service provider of FIG.",
"3.DETAILED DESCRIPTION OF EXEMPLARY EMBODIMENTS A few inventive aspects of the disclosed embodiments are explained in detail below with reference to the various figures.",
"Exemplary embodiments are described to illustrate the disclosed subject matter, not to limit its scope, which is defined by the claims.",
"Those of ordinary skill in the art will recognize a number of equivalent variations of the various features provided in the description that follows.",
"I.",
"Overall Vehicle Communication Network Some of the disclosed embodiments relate to a vehicle communication network that is disclosed below in the context of a traffic scenario 100.This scenario may involve one or more users and vulnerable road users (VRUs).",
"The users can include vehicles, and the VRUs can include pedestrians, automobiles, trucks, vans, minivans, sport utility vehicles (SUVs), busses, recreational vehicles, amusement park vehicles, trams, golf carts, robotically controlled vehicles, automated drive vehicles, remote controlled vehicles, drones, motorcycles, scooters, mopeds, bicycles, ATVs, roadside units, transportable objects, trains, trams, light rail trains, boats, personal watercraft, aircraft, helicopters, or any transport related entity or infrastructure.",
"In fact, the various disclosed methods and apparatus are intended to be usable with any type of user and/or mode of transport that can travel along, or can be located in proximity to, any improved, unimproved, and/or unmarked path.",
"The disclosed vehicle communication network is intended to be implemented with any known, related art or later developed technologies.",
"For example, the implemented technologies can involve ad hoc networks, Dedicated Short Range Communications (DSRC) networks (including but not limited to those types of networks currently used by some transport and traffic systems, such as for automatic toll collection), wireless access in vehicular environments (WAVE), cellular networks, Wi-Fi networks, and/or any other network protocol that can provide the desired functionalities.",
"Some of the embodiments are disclosed below in the context of a DSRC, which is a short to medium range communications service that provides communications links with high data transfer rates with acceptable or minimal latency.",
"Vehicles, users, and infrastructure equipped with DSRC systems may communicate with each other, with remote DSRC compatible transceivers over a network, or with road side equipment (such as transport related infrastructure).",
"The range of DSRC is typically about 300 meters, with some systems having a maximum range of about 1000 meters.",
"DSRC in the United States typically operates in the 5.9 GHz range, from about 5.85 GHz to about 5.925 GHz, and the typical latency for DSRC is about 50 ms.",
"Some DSRC systems communicate with vehicles operating at 100 miles per hour or less, but embodiments are intended to cover communications with vehicles traveling at any speed.",
"FIG.",
"1 is a schematic of a traffic scenario 100 that involves an intersection 102.Various users, VRUs, and vehicle communication network components can be disposed at or proximate the disclosed intersection 102, including a vehicle 104, a remote vehicle 110, road side equipment (RSE) 112 and 116, a bicycle 120, a single pedestrian 126, a school bus 134, a group of pedestrians 138, and a motorcycle 130.However, the above users, VRUs, and components are merely provided for exemplary purposes to facilitate explanation of the disclosed vehicle communication network, and alternative or additional features may be provided.",
"For example, FIG.",
"1 also shows a bicycle lane 124 along which the bicycle 120 travels.",
"In addition, FIG.",
"1 shows a cellular network antenna 142 for use with the vehicle communication network.",
"The vehicle 104 can transmit, receive and/or exchange communications including data, images, messages, and other information with other vehicles and VRUs using the DSRC network, which can be implemented with DSRC compatible transceivers, such as V2X compatible transceivers.",
"“V2X” is used in the present disclosure to cover “vehicle-to-everything” communications, and variations of V2X designations may depend on the intended user that is transmitting V2X signals.",
"As shown in FIG.",
"1, vehicle 104 may be equipped with a vehicle to vehicle (V2V) transceiver 106 that can exchange messages and information with other users equipped with DSRC compatible transceivers.",
"For example, the V2V transceiver 106 can communicate with remote vehicle 110 via a V2V (vehicle to vehicle) transceiver 108, bicycle 120 via a V2B (vehicle to bicycle) transceiver 122, pedestrian 126 via a V2P (vehicle to pedestrian) transceiver 128, motorcycle 130 via a V2M (vehicle to motorcycle) transceiver 132, school bus 134 via a V2V transceiver 136, and pedestrians 138 via V2P transceivers 140.RSEs 112 and 116 are each equipped with V2I transceivers 114 and 118, respectively, which can be used to transmit information from any type of traffic infrastructure, such as traffic signals, or traffic sensors for speed or road conditions, etc.",
"The V2V transceiver 106 may include components for communicating various types of information between vehicle 104 and other network connected vehicles, VRUs, infrastructure, and networks.",
"In some embodiments, V2V transceiver 106 is intended to be used with one or more vehicle safety systems.",
"Examples of vehicle safety systems include, but are not limited to, collision warning systems, lane departure warning systems, integrated vehicle-based safety systems, automatic guided vehicle systems, other types of safety systems, etc.",
"In some embodiments, vehicle 104 may exchange information between one or more remote vehicles 110.For example, vehicle 104 V2V transceiver 106 and remote vehicle 110 V2V transceiver 108 may be configured to exchange vehicle information that can include, but is not limited to, the type of user or vehicle, navigation data, road hazard data, collision warning data, course heading data, course history data, projected course data, kinematic data, current position data, range or distance data, speed and acceleration data, location data, vehicle sensory data, vehicle subsystem data, and/or any other vehicle information.",
"In various embodiments, vehicle 104 may exchange information using V2X protocols with any number of vehicles, pedestrians, or any other V2X users with an operational V2X transceiver.",
"For example, vehicle 104, remote vehicle 110, motorcycle 130, and school bus 134 may be configured to exchange information over V2X protocols.",
"FIG.",
"2 is a schematic of a vehicle communication network 200 according to some the embodiments.",
"Each V2X compatible user can exchange messages with any or all other V2X compatible users.",
"As an example, vehicle 104 V2V transceiver 106 may exchange messages with V2V transceiver 108 installed in remote vehicle 110 and/or with V2P transceiver 128 carried by pedestrian 126.V2X messages can describe any collection or packet of information and/or data that can be transmitted over vehicle communication network 200.Messages may take the form of basic safety messages and/or may contain more information than basic safety messages, such as commands that can control another vehicle's automated driving system.",
"V2X messages may include any number of bytes of information or data.",
"Some of the embodiments are intended to include exchanging information and messages between networked vehicles and VRUs that may be useful in facilitating vehicle safety.",
"For example, the information may be useful for a particular vehicle in order to warn a vehicle or broadcast a warning to a group of V2X users.",
"Vehicle 104 includes a collision warning system (CWS) 202 that can receive and assess safety information and data.",
"The CWS 202 can constitute an implementation of a collision avoidance technology to assess the risk of a collision of the subject vehicle with another vehicle, pedestrian, entity, etc., and can alert a driver through visual and audible warnings.",
"Components of CWS 202 can exchange safety messages, warnings and alerts, and/or other useful information with V2X users via V2V transceiver 106.CWS 202 may transmit and receive information directly or indirectly to and from a service provider 212 over a wireless communication network 204.In one embodiment, vehicle 104 is connected with the service provider 212 by way of a one-to-many communication network 222.In an embodiment, the service provider 212 includes a remote server 214, a remote transmitter 216, a remote receiver 218, and a remote memory 220 that are configured to be in communication with one another.",
"The one-to-many communication network 222 can include systems that can send information from one source to a plurality of receivers.",
"Examples of one-to-many communication networks can include television, radio, satellite networks, etc.",
"In FIG.",
"2, V2V transmitter 106 can be used by the CWS 202 to receive and transmit information to and from the service provider 212 and other information providers through wireless communication network 204 and broadband network 210, such as the Internet.",
"In alternative embodiments, an RF transceiver 224 can be used by the CWS 202 to receive and transmit information to and from the service provider 212 through wireless communication network 204 and broadband network 210, such as the Internet.",
"RF transmitter 224 can include, but is not limited to, a wireless phone, a wireless modem, a Wi-Fi compatible transceiver, and/or any other device that communicates with other networks using a wireless communication network 204.V2V transmitter 106 can also receive and transmit information to and from traffic data supplier 206 and/or other information supplier 208.This information can include, but is not limited to, train schedules, high-traffic event schedules, other transport related data, etc.",
"Traffic data supplier 206 and other information supplier 208 can communicate with service provider 212 through network 210.In an embodiment, service provider 212 may be linked to vehicles through a network connection, such as via cellular network antenna 142 (see FIG.",
"1), and/or other network connection.",
"Further, any other wireless communication system capable of delivering data may be used such as satellite Wi-Fi, WiMAX, microwave, etc.",
"Service provider 212 may also be linked by a wired connection, such as broadband cable or fiber optic connections, Ethernet, DSL, ADSL, telephone modems, and/or any other wired communication system capable of delivering data.",
"Some of the embodiments are intended to include each V2X transceiver configured to communicate with wireless communication network 204 through cellular network antenna 142, or I2V (infrastructure-to-vehicle) network connection.",
"II.",
"Service Provider FIG.",
"3 is a schematic of an embodiment of service provider 212 of the vehicle communication network 200.In FIG.",
"3, service provider 212 may include a computer controlled service provider network 300, a forward collision warning (FCW) server 302, and a forward collision warning (FCW) database 306.FWC server 302 and FCW database 306 may communicate, through service provider network connections 304 and 308, respectively, to service provider network 300.Alternatively, this communication can be performed directly.",
"The service provider network 300 can be capable of communicating with one or more internal and external computer or communication networks, computer systems, or controller systems.",
"In some embodiments, FCW database 306 is stored on FCW server 302.However in other embodiments, FCW database 306 may be partially or fully located remote from service provider 212.FCW server 302 and FCW database 306 can include processors, memory, and instructions to operate as a computer.",
"FCW server 302 may interact with FCW database 306 to access collision event data and/or information, such as graphics, maps, images, videos, navigational data, or any other data that can be useful to collision warning system 202.FCW database 306 may be organized using any known, related art and/or later developed data storage method and/or structure.",
"FCW database 306 may include hard drives, flash drives, magnetic drives with removable storage media, such as disks or tape, or optical drives with removable storage media, such as discs, memory sticks, memory cards, embedded or discrete flash memory, and/or any other type of memory.",
"Event data may be transmitted to service provider 212 either wirelessly or through wired connections in any manner known or presently unknown the art, such as via transmitter/receiver 322 shown in FIG.",
"3.Event data may be received wirelessly via first, second, and third data providers 310, 312, 314, which can be users in vehicle communication network 200 transmitting event data.",
"For example, vehicle 104, remote vehicle 110, bicycle 120, pedestrian 126, and motorcycle 130 can transmit real time event data that is received and processed by FCW server 302.The embodiments are intended to also include event data provided via fourth, fifth, and sixth data providers 316, 318, 320, which may include data from commercial information providers, traffic data providers, web cams, or government agencies (such as a state or federal departments of transportation).",
"Fourth, fifth, and sixth data providers 316, 318, 320 can provide location and traffic information to service provider 212, such as school locations and schedules, bicycle zones, construction projects, temporary road closings, train locations and schedules, weather updates, major events, such as concerts and athletic competitions, and/or navigation map feature updates.",
"III.",
"Collision Warning System FIG.",
"4 is a schematic of the CWS 202 of the vehicle 104 of FIG.",
"2.However, the disclosed CWS 202 may be associated with other vehicles or used in other applications.",
"Other collision warning systems associated with some vehicles may include different elements and/or arrangements as configured to collision warning system 202, but may be configured to communicate over vehicle communication network 200 with one or more other collision warning systems 202.The CWS shown in FIG.",
"4 is designated with reference number 400 to clearly express the intention to also or alternatively use the system by other entities or in other applications.",
"The vehicle 104 may have one or more computers, such as a collision warning computer system 404 (“computer system”) containing a processor 406, a memory 408 and other components typically present in general or special purpose computers.",
"In some embodiments, the CWS 400 may include programmable logic circuits and/or pre-configured logic circuits for executing collision warning system functions.",
"The memory 408 stores information accessible by processor 406 including instructions 410 and data 412 that may be executed or otherwise used by the processor 406.The control logic (in this example, software instructions or computer program code), when executed by processor 406, causes processor 406 to perform the functions of the embodiments as described herein.",
"The memory 408 may be of any type capable of storing information accessible by the processor, including a computer-readable medium, or other medium that stores data that may be read with the aid of an electronic device, such as a hard-drive, flash drive, memory card, ROM, RAM, DVD or other optical disks, as well as other write-capable and read-only memories.",
"Systems and methods may include different combinations of the foregoing, whereby different portions of the instructions and data are stored on different types of media.",
"The instructions 410 may be any set of instructions to be executed directly (such as machine code) or indirectly (such as scripts) by the processor 406.For example, the instructions may be stored as computer code on the computer-readable medium.",
"In this regard, the terms “instructions” and “programs” may be used interchangeably herein.",
"The instructions may be stored in object code format for direct processing by the processor, or in any other computer language including scripts or collections of independent source code modules that are interpreted on demand or compiled in advance.",
"Functions, methods and routines of the instructions are explained in more detail below.",
"Data 412 may be retrieved, stored or modified by processor 406 in accordance with the instructions 410.For instance, although the system is not limited by any particular data structure, the data may be stored in computer registers, in a relational database as a table having a plurality of different fields and records, XML documents or flat files.",
"The data may also be formatted in any computer-readable format.",
"The data may include any information sufficient to identify the relevant information, such as numbers, descriptive text, proprietary codes, references to data stored in other areas of the same memory or different memories (including other network locations) or information that is used by a function to calculate the relevant data.",
"The processor 406 may be any known, related art or later developed processor.",
"Alternatively, the processor may be a dedicated device, such as an ASIC or DSP.",
"Although FIG.",
"4 illustrates the processor 406, memory 408, and other elements of computer system 404 as being within the same block, it will be understood by those of ordinary skill in the art that the processor 406 and memory 408 may actually include multiple processors and memories that may or may not be stored within the same physical housing.",
"For example, memory 408 may be a hard drive or other storage media located in a housing that is different from that of computer system 404.Accordingly, references to a processor or computer will be understood to include references to a collection of processors, computers or memories that may or may not operate in parallel.",
"Rather than using a single processor to perform the steps described herein, some of the components, such as steering components and deceleration components, may each have their own processor that only performs calculations related to the component's specific function.",
"In an alternative embodiment, the processor 406 may be located remote from the vehicle 104 and communicate with the vehicle wirelessly.",
"In the embodiments, some of the processes described herein are executed on a processor disposed within the vehicle 104, and others by a remote processor.",
"Computer system 404 may include all of the components normally used in connection with a computer, such as a central processing unit (CPU) (e.g.",
"processor 406), the memory 408 (e.g., RAM and internal hard drives) storing data 412 and instructions 410, such as a web browser, a display device 426 (e.g., a monitor having a screen, a small LCD touch-screen or any other electrical device that is operable to display information), user input device 424 (e.g., a mouse, keyboard, touch screen and/or microphone), as well as various sensors (e.g.",
"a video camera) for gathering sensor data as collision event data.",
"The computer system 404 can also include components not normally associated with general purpose computers, such as object detection component 428.The computer system 404 may be capable of communicating with various components of the vehicle 104.For example, computer system 404 may be in communication with the vehicle's electronic control unit (ECU) 402 and may send and receive information from the various systems of vehicle 104, for example a vehicle subsystem sensor system 430, a vehicle communication system 432, a vehicle event sensor system 434, and a vehicle navigation system 436.When engaged, computer system 404 may control some or all of these functions of vehicle 104.It will be understood that, although various systems and computer system 404 are shown within vehicle 104, these elements may be external to vehicle 104 and/or physically separated by large distances.",
"As indicated above, the vehicle 104 may also include the vehicle subsystem sensor system 430.The computer system 404 may communicate with sensors in one or more vehicle subsystems in order to calculate levels of potential collision risks based on speed, direction, acceleration, braking, and/or other factors.",
"The vehicle subsystem sensor system 430 may include, but is not limited to, engine oil/coolant sensing systems, transmission oil sensing systems, brake sensing systems, steering and control sensing systems, fuel storage sensing systems, torque sensors, and speed and acceleration/deceleration sensors, and inertia (yaw) sensor systems.",
"As indicated above, the vehicle 104 may also include the vehicle communication system 432.The computer system 404 may communicate with external communication apparatus for sending and receiving collision event data.",
"For instance, the vehicle communication system 432 includes vehicle V2V transceiver 106 that can communicate with compatible V2X transceivers in the vehicle communication network 200.As described previously in relation to FIG.",
"2, the vehicle communication system 432 can include the RF transceiver 224 for communicating wirelessly to service provider 212 or traffic data supplier 206 through wireless network 204.As further indicated above, the vehicle 104 may also include the vehicle event sensor system 434 for collecting event data.",
"Event data can include detecting the location, orientation, heading, etc., of entities external to the vehicle 104, such as other vehicles, bicycles, and motorcycles, pedestrians, obstacles in the roadway, traffic signals, signs, wildlife, trees, or any entity that can provide information to collision warning system 400.The phrases “event data” and “collision event data” can include any data related to an entity or situation, such as a vehicle, person, environmental scenario, or wildlife that is a road hazard, potential road hazard, predicted road hazard, probably road hazard, or unknown road hazard that can be a danger to a moving vehicle or other entity.",
"In alternative embodiments, the phrases “event data” and “collision event data” can include any data related to entities or sensed data a vehicle's environment that is useful for the collision warning system 202.A vehicle event sensor system 434 may collect sensor data from sensor apparatus including radar, lidar, sonar, cameras, V2X transceivers or any other detection devices which can record event data that can be processed by the computer system 404.Vehicle sensor systems and V2X communication systems can provide data that is processed by the computer system 404 in real-time.",
"In other words, the sensors may continuously update their output to reflect the environment being sensed at or over a range of time, and continuously or as-demanded to provide updated output to the computer system 404.An event pattern comparison calculator can perform statistical and predictive calculations to determine if, based on two or more users' current position data, course heading data, course history data, projected course data, kinematic data, range or distance data, speed and acceleration data, and/or location data, there is a potential risk of collision events in the real-time traffic scenario.",
"Examples of such collision events include, but are not limited to, motorcycle and vehicular traffic, bicycle traffic, pedestrian traffic, objects falling or felled in a roadway (such as rocks or trees), wildlife, domestic animals, flooded roads, or any other condition or environmental situation that could cause an unexpected road hazard.",
"Further, collision event data can include any static or dynamic data and information that are provided in prepared traffic hazard models that could be relevant to the functions of the computer system 404.Data for a potential collision event can be classified as location based, time based, scenario based, hazard or risk based, or another classification or a combination of classifications.",
"Event data from various sources within and external to vehicle 104 can be saved in a data logger in a vehicle collision event database 422.In addition to processing data provided by the various sensors, the computer system 404 may rely on environmental data that was obtained at a previous point in time and previous location either by vehicle 104, remote vehicle 110 or other vehicles in vehicle communication network 200, and is expected to persist regardless of the vehicle's presence in the environment.",
"As shown in FIG.",
"4, a memory 408 component for data 412 may include components for commercial collision event data 414, a collision event map component 416, an event detection component 418, the event comparison calculator (comparison calculator) and the collision event database 422.Collision event map information can be generated by collision event map component 416.Collision event map information can include maps identifying the shape and elevation of roadways, lane lines, intersections, crosswalks, bicycle lanes, school zones, speed limits, traffic signals, buildings, signs, real time traffic information, or other transport information.",
"For example, the map information may include one or more mapped networks of information, such as roads, lanes, intersections, and the connections between these features.",
"Each feature may be stored as map data, and may be associated with information, such as a geographic location, and whether or not it is linked to other related features, e.g., a stop sign may be linked to a road and an intersection, etc.",
"Data 412 may also include commercial collision event data 414, which can include commercially-available databases of transport data, traffic data, traffic schedules, and any other data that could be useful for the embodiments.",
"The event detection component 418 can include processes and instructions 410 for detecting event characteristics or information from data and information collected by the CWS 400.The event detection component can include an image recognition component that can match image and video collected from the CWS 400 with prior images and video that have been identified as related to a potential collision event.",
"The vehicle navigation system 436 can be interoperable with computer system 404 to provide navigation maps and information to vehicle 104.Vehicle navigation system 436 may be any type of known, related or later developed navigational system.",
"The phrase “navigation information” refers to any information that can be used to assist vehicle 104 in navigating a road or path.",
"Navigation information may include traffic data, map data, and road classification information data.",
"Examples of navigation information can include street addresses, street names, street or address numbers, intersection information, points of interest, parks, bodies of water, any political or geographical subdivision including town, township, province, prefecture, city, state, district, ZIP or postal code, and country.",
"Navigation information can also include commercial information including business and restaurant names, commercial districts, shopping centers, and parking facilities.",
"Navigation information can also include geographical information, including information obtained from any Global Navigational Satellite infrastructure (GNSS), including Global Positioning System or Satellite (GPS), Glonass (Russian) and/or Galileo (European).",
"The vehicle 104 may also include a geographic position component 438 as part of vehicle navigation system 436 for determining the geographic location of vehicle 104.For example, the geographic position component 438 may include a GPS receiver 510 (see FIG.",
"5) to determine the device's latitude, longitude and/or altitude position.",
"Other location systems, such as laser-based localization systems, inertial-aided GPS, or camera-based localization may also be used to identify the location of the vehicle.",
"The location of the vehicle 104 may include an absolute geographical location, such as latitude, longitude, and altitude as well as relative location information, such as location relative to other vehicles in an immediately vicinity.",
"A GPS receiver 510 may be used for gathering additional information associated with vehicle 104 that includes, but is not limited to, speed, location, trajectory, distance traveled, acceleration, and other dynamic vehicle information.",
"In alternative embodiments, the vehicle 104 may also include other features in communication with the computer system 404, such as an accelerometer, a gyroscope, or another direction/speed detection device to determine the direction and speed of the vehicle or changes thereto.",
"Vehicle 104 may include other apparatus for communicating, and in some cases controlling, the various components associated with vehicle subsystems.",
"ECU 402 may be configured to communicate with, and/or control, various components of vehicle 104.ECU 402 may communication with a vehicle subsystem 504 (shown in FIG.",
"5) through appropriate wired or wireless communication channels.",
"IV.",
"Vehicle Systems Associated with the Collision Warning System FIG.",
"5 is a schematic showing vehicle systems 500 that can be associated with the collision warning system 400 of FIG.",
"4.As shown in FIG.",
"5, ECU 402 can communicate with a data logger system 502, the vehicle subsystem 504, an automated driving system 506, a navigation system 508, a vehicle sensor system 516, the vehicle V2V transceiver 106, RF transceiver 224, a camera 522, and a laser 524.In the embodiments, data logger system 502 may communicate with ECU 402 in vehicle 104.Data logger system 502 can acquire and log data collected from any of the vehicle systems and subsystems for use by the computer system 404.Data relevant to collision warning system 202 includes, but is not limited to, navigation data, sensor data, multimedia data, such as images or video streams, audio information, scanner data, and other type of data useful for collision warning system 202.ECU 402 may communicate with a vehicle subsystem 504 through appropriate wired or wireless communication channels.",
"The automated driving system 506 can be in communication with ECU 402.In some embodiments, ECU 402 may be configured to control components of vehicle subsystems, for example, to activate a brake actuator prior to an imminent collision.",
"In other embodiments, automated driving system 506 can be configured to mechanically alert a driver of vehicle 104 of a potential collision, or assist the driver of vehicle 104 or another vehicle in communication with vehicle 104 to avoid a road hazard or potential collision.",
"Vehicle 104 can include navigation system 508 that is configured to be in communication with ECU 402, and perform the functions of vehicle navigation system 436.Navigation system 508 may include a navigation system display 512, and can store map and location information in a navigation database 514.Navigation system display 512 may display navigational maps and information to a user of vehicle 104 using any type of display technology known or presently unknown in the art.",
"Navigation system display 512 may also communicate information to a vehicle 104 user using any type of known, related art or later developed audio technology, such as by using predetermined sounds or electronically generated speech.",
"In an embodiment, vehicle sensor system 516 can communicate with ECU 402 and various event data sensor devices, such as sensor 518, radar system 520, camera 522, and laser 524, disposed at the interior or exterior of vehicle 104.The sensors 518, 520, 522, 524 can be located in any beneficial area of vehicle 104.The embodiments are intended to include or otherwise cover any number the sensors that can be placed at any location of vehicle 104 in any configuration.",
"Sensor system 516 may communicate with multiple devices that assist in collecting data including, but not limited to, sensors 518 that can collect data for vehicle speed, steering, and inertia (yaw) relative to gravity or a perpendicular plane to gravity.",
"Although one sensor 518 is shown in FIG.",
"5, it is understood that sensor 518 is a representation of one or more sensors installed within or outside of vehicle 104.Other embodiments of sensors 518 can collect proximity data using rear, front, and side proximity detection sensors 518.The vehicle sensor system 516 can include devices to detect one or more characteristics of a road hazard, such as the presence of a vehicle, pedestrian, entity, or traffic-related situation.",
"Characteristics can include identity, speed, direction, location, acceleration, orientation, size, etc.",
"Examples of sensor system detection devices include, but are not limited to, one or more cameras, radar, sonar, range finding lasers, or any detection devices that can be useful for collecting collision event data in collision event database 422 that can be processed by the computer system 404.Sensor system 516 devices can be advantageous by collecting data for identification and tracking the movement of entities such as motorcycle and vehicular traffic, bicycle traffic, pedestrian traffic, objects fallen in a roadway, such as rocks or trees, wildlife, domestic animals, or any other condition, entity, or vehicle that could provide useful data for processing as collision event data.",
"One or more of the radar systems 520 may be mounted on a front, rear, top, or side of vehicle 104.The radar system 520 can be beneficial by detecting the presence and movement of entities in proximity to vehicle 152, especially when an entity is within a driver's blind spot or obscured by darkness.",
"One or more of the cameras 522 may be mounted internal or external to vehicle 104.FIG.",
"5 illustrates camera 522 at a certain location of vehicle 104 that is merely exemplary.",
"The embodiments are intended to include or otherwise cover any number of one or more cameras 522 that can be placed in any location and/or configuration on vehicle 104 that includes, but is not limited to, a front grill, front and rear bumpers, underneath a vehicle, on a side of vehicle 104, inside vehicle 104, or on a top of vehicle 104.In some embodiments, camera 522 may rotate vertically and horizontally to provide a wide degree of coverage area.",
"A variety of cameras 522 may be used in the embodiments to capture still images and video images in color, infrared, black and white, in two dimensions, or in three dimensions.",
"The camera 522 may capture images, video, and data on any type of medium known in the art, including digital media or film.",
"The captured images and related data may be saved to data logger system 502 for image recognition and movement characteristics processing by computer system 404.An object detection component 428 can compare images from image recognition processing with a database of images, maps, graphics, videos, etc.",
"to identify entities, read text, or determine locations based on the image comparisons.",
"One or more of the lasers 524 may be mounted external to vehicle 104.Laser 524 can capture event data for processing by determining range and intensity of a vehicle, pedestrian, entity, etc., for processing by computer system 404.Laser 524 is capable of capturing range and intensity information of an entity, which can be used to determine the location and distance of the entity.",
"FIG.",
"5 also shows the vehicle 104 V2V transceiver 106 for communicating with other V2X compatible transceivers.",
"In an embodiment, V2V transceiver 106 can collect event data from other V2X transceivers that can be configured for a pedestrian, bicycle, vehicle, building, tower, billboard, traffic signal, road sign, or any transport related entity or user.",
"V2X transceivers can be configured to broadcast the transceiver's location, obtained from an internal GPS receiver, to any V2X transceiver within transmission range.",
"A display on each V2X transceiver can also display any messages, images, alerts, and warnings transmitted received by V2X users in vehicle communication network 200.A communications link between V2X transceivers may be initiated by any user.",
"In the embodiments, a V2X transceiver may continuously search for other V2X transceivers, such as by emitting a periodic signal that searches for a reply.",
"In other embodiments, a V2X transceiver may emit periodic signals searching for a reply from an in-range V2X transceiver.",
"If V2X transceiver replies, then a communications link may be established.",
"Information and data received by V2V transceiver 106 related to V2X communications can be saved to data logger system 502 and processed by computer system 404.V.",
"Vehicle Interior FIG.",
"6 is a schematic of an exemplary design of a vehicle interior 600 associated with the collision warning system 400 of FIG.",
"4.The vehicle interior 600 may include, for example, a dashboard 602, a steering apparatus such as a steering wheel 604, an instrument panel 606, and a center portion 608.Center portion 608 can include one or more devices associated with the interior of the vehicle, including but are not limited to: audio devices, video devices, navigation devices, as well as any other types of devices.",
"In addition, center portion 608 can be associated with controls for one or more systems of vehicle 104 including, but not limited to: climate control systems, radio and sound systems, and other types of systems.",
"The vehicle 104 may also have a display device 610 for displaying information from CWS 400, and/or other related or unrelated vehicular systems.",
"In some embodiments, vehicle 104 can include a driver vehicle interface 612 that may include the display device 610.Examples of display device 610 include, but are not limited to, LCDs, CRTs, ELDs, LEDs, OLEDs, or electronic paper displays each with or without a touchscreen, as well as other types of displays.",
"Display device 610 can include a touchscreen for use as the user input device 424 for activating or deactivating one or more vehicle collision system modes, and for enabling a user to provide information, such as navigation destination or event information, to the computer system 404.In alternative embodiments, driver vehicle interface 612 can include buttons, a keypad, or other types of input devices 424.In another embodiment, driver vehicle interface 612 can include a projection type display that is configured to project an image onto one or more surfaces of vehicle 104, such as windshield 614.Vehicle 104 may also include one or more additional display devices in various locations.",
"In some embodiments, display device 610 can be disposed within center portion 608.However, in other embodiments, display device 610 can be located in any portion of vehicle 104, or can be a portable device.",
"For example, display device 610 can be located within instrument panel 606.In addition, while display device 610 can be configured to present visual information for computer system 404, display device 610 can be shared with other devices or systems within vehicle 104 such as vehicle navigation system 436.In an example, display device 610 may display collision event information, warning alerts, informing alerts, and navigation maps to a user.",
"A driver vehicle interface may inform a driver with auditory warnings or alerts a predicted potential collision.",
"Warnings and alerts may be configured to correspond to the level of road hazard or level of potential collision risk.",
"For example, warnings and alerts may be classified as low, medium, high, or information.",
"Display device 610 can be configured to display no image when no alert or information has been issued by computer system 404.In an embodiment, display device 610 displays a default screen, such as a blank screen, when no alert is issued.",
"However, in embodiments where display device 610 is used for displaying information from other systems, a default screen cannot remain a blank screen with no image.",
"For example, in embodiments where display device 610 is shared with vehicle navigational system 436, display device 610 can continue to display maps and information received from the vehicle navigation system 436 until a warning is issued.",
"Likewise, once a warning has expired, display device 610 can return to displaying maps from navigation system 436.VI.",
"Methods of Operation FIG.",
"1 shows an overhead view of the traffic scenario 100.The users, locations, and other data related to potential road hazard scenarios at intersection 102 can be the subject of digital navigation maps generated by the collision event map component 416 for integration with digital navigation system 436 that can be displayed on display device 610.The intersection 102 is merely provided as an exemplary location in order to illustrate embodiments of CWS 400 and is not intended to be limiting.",
"The embodiments of the disclosure are intended to cover any road, highway, path, lane, course, track, navigable waterway, and paved or unpaved areas that a vehicle, bicycle, motorcycle, pedestrian, boat, train, etc.",
"could move on, along, or through.",
"Exemplary aspects of intersection 102 include two lanes in multiple directions and bicycle lane 124 that traverses only one direction.",
"The embodiments, however, are not limited by a number of lanes, directions, or to an intersection.",
"Any configuration of a road, highway, path, lane, course, track, navigable waterway, and paved or unpaved areas may be used to operate and implement the embodiments.",
"CWS 400 can collect collision event data at or near intersection 102 from multiple sources in vehicle 104, for example V2X signals from other vehicles and users, vehicle event sensor system 434, navigation system 508, and user input on input device 424.CWS 400 activation enables collection of new event data while vehicle 104 approaches and passes through intersection 102.Computer system 404 can process the new event data, compare the new event data from one vehicle to historical event data that the same vehicle or other vehicles collected at the same or proximate location, and generate a prediction as to whether the vehicle should be provided with information relating to a potential collision or provided an alert of a potential collision scenario.",
"The operations of the CWS 400 are described in conjunction with embodiments of the disclosure below.",
"In an embodiment, an event pattern comparison calculator (comparison calculator) 420 may be utilized by computer system 404 to compare new event data with prior event data in collision event database 422 and prior event patterns.",
"If the comparison calculator 420 determines the new event data meets a comparison threshold to a prior event pattern, the new event data is determined to be updated data for the prior event, and the new event data can be combined with data for a prior event pattern.",
"In the embodiments, the comparison calculator 420 can utilize one or more comparison models of statistical analysis to classify patterns of road hazards or potential road hazards as potential collision events.",
"Comparison calculator 420 can compare event data to one or more patterns including, but not limited to, statistical models, data clusters, regression analysis, or any other type of data analysis which can perform the functions of the embodiments.",
"Comparison calculator 420 may provide at least one weighting factor in the comparison models to weight various probabilities associated with road hazards determined from event data collected in real-time or historical event data.",
"The comparison calculator 420 can analyze new event data to determine a statistical match with existing, or prior, road hazard event data.",
"In an embodiment, the comparison calculator 420 may determine a statistical match using probabilities calculated from the data.",
"Comparison calculator 420 may further calculate statistical matches based on dates and times, road hazard characteristics, environmental conditions, traffic conditions, locations, entity headings, or any other condition or data analysis relevant for the embodiments.",
"In an embodiment, comparison calculator 420 may use a single equation that is derived using Bayes' Theorem or Bayesian Rule.",
"Generally, Bayes' Theorem relates the conditional and marginal probabilities of various random events.",
"Using a Bayesian Rule, probabilities of different events occurring may be determined given certain observed scenarios.",
"As a result, the probability of an event occurring generally increases as more prior information from observed scenarios is provided.",
"The comparison calculator 420 may use a Bayesian Rule to combine the various probabilities determined based on conditions associated with any of the ranges or patterns of event data in collision event database 422.If comparison calculator 420 determines that newly-collected event data has a statistical match to historical event data, then the comparison calculator 420 stores the new event data into collision event database 422 with the matched prior event data.",
"If the comparison calculator 420 determines that the new event data is not a statistical match to historical event data, new event data is stored into collision event database 422 as a single event.",
"Single event data in collision event database 422 can be further analyzed by the comparison calculator 420 in future statistical analysis to determine if any statistically significant matches occur with other event data obtained from the same vehicle and/or other vehicles.",
"While some of the embodiments are based on an application of Bayes' Theorem, other embodiments are intended to include or otherwise cover other comparison methods by the comparison calculator 420.The comparison calculator 420 may utilize fuzzy logic, neural network applications, analysis of variance (ANOVA), discriminant analysis, or any other appropriate analytical and/or statistical methods to perform data analysis.",
"FIG.",
"7 is a flowchart of an exemplary method 700 to inform a vehicle of potential collision events in association with the CWS 400.In some embodiments, warnings and alerts may be generated not only on signals from V2X signals but also on probabilities of an event analyzed by the comparison calculator 420.For example, if the vehicle 104 approaches the intersection 102, the V2V transceiver 106 should receive a V2P signal from the single pedestrian 126.However, multiple scenarios can occur where V2P signals may not be present and/or detected due to, for example, a malfunction in the V2P transceiver 128 or radio frequency interference.",
"However, CWS 400 may generate a low level and/or information alert regarding a predicted potential for pedestrian 126 crossing the intersection 102 based on statistical analysis of historical pedestrian data by comparison calculator 420.In FIG.",
"7, the method to inform a vehicle may include step 702 where a user, driver or passenger of vehicle 104 can activate a vehicle collision warning mode for the CWS 400.The method may include step 704 to determine the vehicle 104 location.",
"A location may be determined using geographic position component 438.After a location is determined, in step 706 the computer system 404 can search collision event database 422 for prior events in a predetermined proximity to the location of vehicle 104.If in decision 708, to determine if prior events occurred, no prior events occurred in proximity to the current vehicle 104 location, then the method proceeds to step 712 to monitor for new road hazards.",
"If in decision 708, to determine if prior collision events occurred, there are prior events within the predetermined proximity to vehicle 104, the method can include step 710 to inform vehicle 104 of the prior events.",
"The step 710 to inform vehicle 104 includes the collision event map component 416 integrating potential road hazard data from collision event database 422 into detailed maps that can be used by the computer system 404 for generating alerts as well as used by the vehicle navigation system 436 for displaying on display device 426 the locations and types of road hazards onto a digital navigation map.",
"FIG.",
"8 is a flowchart of an exemplary method 800 to predict potential collision events and alert a vehicle in conjunction with the collision warning system 212.The method illustrated in FIG.",
"8 can monitor for new event data in step 802 that can be a continuation of step 712, to monitor for new event data, of FIG.",
"7.Monitoring for road hazards using new event data can be performed automatically, manually, or a combination of automatic and manual identification of event data.",
"As stated previously, event data can include, but is not limited to, V2X signals, type of user or vehicle, navigation data, road hazard data, collision warning data, course heading data, course history data, projected course data, kinematic data, current position data, range or distance data, speed and acceleration data, location data, vehicle sensory data, vehicle subsystem data, or any type and quantity of data useful for processing by computer system 404.If new event data is not detected at step 804, to detect new event data, then the method returns to step 802 to continue to monitor for new event data.",
"If a new event, and therefore new event data, is detected in 804, the method can include step 806 to save new event data into collision event database 422.New event data may also include a new road hazard that has been identified by a vehicle or received from an external database.",
"However, new event data can also include a repeated entry of a road hazard by a vehicle 104 or other vehicles at or in a predetermined proximity to an event location that already exists in collision event database 422.A repeated sighting or entry of a road hazard or potential road hazard can add confidence to collision event data collected for the road hazard.",
"For example, an event location can be identified by geographic position component 438 and a road hazard can be recognized from camera 522.The event location and road hazard can be automatically saved into collision event database 422.In another embodiment, a driver of vehicle 104 may observe a traffic scenario, for example a school bus stop, and use input device 424 to manually save the event location into collision event database 422.While the example describes a school bus stop, it is understood that any type of event scenario, road hazard, traffic data, image, or location can be automatically or manually saved into collision event database 422.The method, therefore, can collect data for a potential road hazard and the event location, regardless of whether the event was previously identified and saved.",
"The method in FIG.",
"8 may also include decision 808 to determine if prior road hazard events occurred in a predetermined proximity to the vehicle location.",
"After new event data is detected in step 804, to detect new event data, the computer system 404 can search collision event database 422 for prior events in a predetermined proximity to the location of vehicle 104.In step 808, to determine if prior event occurred, no prior events occurred in proximity to the current vehicle 104 location, then the method will return at 810 to monitor for new event data.",
"If prior events did occur, then the method proceeds to step 812 to compare, using comparison calculator 420, new event data to prior event data for the same location from collision event database 422.Comparison of new event data to prior event data in collision event database 422 can be performed by any of the comparison or statistical models and methods described above, which include but are not limited to statistical models, data clusters, regression analysis, correlations, or any other type of appropriate data analysis technique.",
"In an exemplary embodiment, the new event data is compared with prior event data and patterns in collision event database 422 using Baysian Networks.",
"If the comparison calculator 420 determines in step 814, to determine if new event data matches a prior event data pattern, that new event data does not match a prior event data pattern, then the method may return at 816 to monitor for new event data.",
"If comparison calculator determines, in step 814 to determine if new event data matches a prior and/or historical event data pattern, that new event data matches and/or correlates to a prior event data pattern, then the method can include step 818 to add new event data to the matching and/or correlating prior event data in collision event database 422.Further, if the comparison calculator 420 determines, in step 814 to determine if new event data matches a prior event data pattern, that new event data matches and/or correlates to a prior and/or historical event data pattern, then the method optionally proceeds in step 820 to determine if new event data meets a condition and/or characteristic of the prior and/or historical event data.",
"In step 820, the new event data should meet a threshold condition and/or characteristic of event data to qualify as a potential collision risk and/or road hazard.",
"A condition and/or data characteristic can include, but is not limited to, a temporal component including a relevant time frame, a direction of movement and/or heading of an entity, and heading of the vehicle 104 approaching the entity, etc.",
"A time frame can be any time frame including, but not limited to, a time of day, a range of time within a day, a calendar day or range of days, a week or range of weeks, a month, a range of months, etc.",
"A time frame can also be periodic, such as an event occurring certain days of every month between certain hours of the day.",
"For example, if event data at intersection 102 correlates with a present location of vehicle 104 and statistical analysis of historical event data result in identifying an event occurring between the hours of 4:00 pm and 6:00 pm, and the vehicle 104 is at the location at 11:00 pm, then no conditional match occurs within the relevant time frame.",
"Real-time event data collected by the vehicle 104 at the event location can still be used, however, to give further confidence to the pattern of event data characteristics or conditions, e.g., that no event occurred at the location at 11:00 pm, therefore the conditional time frame of 4:00 pm-6:00 pm remains valid.",
"If, in step 820 to determine if new event data meets a condition, the comparison calculator 420 determines the new event data meets a condition and/or characteristic of prior and/or historical event data, then the method may include step 824 to warn vehicle 104 of a predicted potential collision event and/or road hazard.",
"Computer system 404 can generate an alert to a driver of vehicle 104 of the nature, location, and severity of a potential collision event using visual, audible, or mechanical indicators.",
"A potential collision event can be a potential road hazard in the path of, or in proximity to, the location and heading of the vehicle 104 or other vehicles or users.",
"The potential collision event may not generate an immediate road hazard alert to the vehicle 104, in which case an information alert may be appropriate.",
"For example, if the event data analysis results in a scenario, such as a bus stop, in or near the current or intended path of vehicle 104, then an information alert can be useful to warn vehicle 104 to take caution near the bus stop location.",
"Visual alerts and information alerts can display on display device 610 or other display devices including, but not limited to, a smart phone, a tablet computer, or any device that can be linked by wire or wirelessly to collision warning system 400.Audible alerts and information can be provided to vehicle 104 through a speaker in the display device 610 or through other devices that include, but are not limited to, a vehicle sound system, a smart phone, a tablet computer, etc.",
"Mechanical indicators can inform a driver of vehicle 104 through vibrations in steering wheel 604, vibrations of a brake pedal (not shown), vibrations of an accelerator pedal (not shown).",
"Some embodiments to warn vehicle 824 of potential road hazards and information are intended to include or otherwise cover one or more alert levels.",
"In the embodiments, information alerts and road hazard alerts that display on display device 610 can include, but are not limited to, one or more navigation maps, symbols, icons, graphics, colors, images, photographs, videos, text, audible information, etc.",
"Exemplary alert levels may include warning alerts, informing alerts, high, medium, and low alerts, proximity alerts, trajectory alerts, location alerts, or any alert method that can inform a driver of information, a potential road hazard, collision risk, etc.",
"In particular, informing alerts are used to inform the vehicle 104 or other users of information or data relevant to the vehicle's intended current or intended path.",
"Low-level hazard alerts can inform a driver of relatively low collision threats, while mid-level or high level hazard alerts can inform the vehicle 104 of medium-to-high level collision risks and/or road hazards.",
"Information can be provided to vehicle 104 with alerts displayed on display device 610 or audible or mechanical alerts, as described above.",
"After generating an alert, the method may include step 826 to save the notice of the warning to the vehicle collision event database 422 with the event data relevant to the alert.",
"If, in step 820 to determine if new event data meets a condition, the comparison calculator 420 determines the new event data does not meet a condition of prior and/or historical event data, then the method returns at 822 to monitor for new event data in real-time.",
"FIG.",
"9 is a flowchart of an exemplary method 900 for receiving and classifying new event data by the CWS 400.The method in FIG.",
"9 may include step 902 where computer system 404 can receive new event data.",
"New event data may be uploaded to computer system 404 from any vehicle system including the vehicle subsystem sensor system 430, the vehicle communication system 432, the vehicle event sensor system 434, the vehicle navigation system 436, and/or manually from a driver and/or passenger of vehicle 104.In step 906, classifying new event data can include the comparison calculator 420 determining event patterns 904 using any of the comparison or statistical methods described above or another known, relevant or later developed method.",
"In step 906, to classify new event data, the comparison calculator 420 can search and analyze historical event data in collision event database 422 to determine if prior and/or historical road hazards and/or potential collision events occurred within a predetermined proximity to the vehicle 104 location.",
"Comparison calculator 420 can compare current or new event data collected from vehicle 104 or other vehicles to prior and/or historical event data by any of the comparison or statistical methods described above.",
"If new event data is a comparative or statistical match to one or more prior event data patterns, comparison calculator 420 may then classify new event data 906 according to one or more prior event data patterns.",
"The method may further include step 908, where computer system 404 may store the new and/or current event data into the collision event database 422 with the matched or correlated prior and/or historical event data.",
"In an alternative embodiment, the exemplary method 900 for receiving and classifying new event data is performed by the service provider 212.To perform method 900 for receiving and classifying new event data, the FCW server 302 can include corresponding functionality and hardware as computer system 404.For example, at step 902 the FCW server 302 can receive new event data, determine event patterns 904, classify new event data 906, and save new event data in the FCW database 306.FIG.",
"10 is a functional flowchart of an exemplary method for comparing new event data with patterns of prior and/or historical event data by CWS 400.In an alternative embodiment, new event data 1000 is received by the CWS 400 as described above.",
"New event data 1000 may also receive commercial collision event data via commercial collision event data component 414 from transportation agencies, commercial service providers, or from other vehicles.",
"The method may correlate or statistically analyze new event data 1000 using an event pattern classifier 1002.The event pattern classifier 1002 can be a function of comparison calculator 420.Event pattern classifier 1002 can compare new or historical event data to one or more event patterns 1004 using comparison and/or statistical methods described above.",
"Alternatively, other comparison and/or statistical models can be generated, and event data matched and/or correlated to one or more of the comparison or statistical models.",
"Additionally, event pattern classifier 1002 can compare new event data 1000 to one or more event patterns 1004 using comparison and statistical methods described above.",
"In an alternative embodiment, event patterns 1004 may be generated by statistical analysis of event data according to a data characteristic such as location and/or time interval of the event.",
"In some embodiments, a time interval used for determining whether new event data 1000 fits one or more event patterns 1004 may be fixed.",
"In other embodiments, the time interval may vary.",
"One or more event patterns 1004 can be stored in an event pattern library in collision event database 422.If the event pattern classifier 1002 determines the new event data 1000 matches or correlates to one or more event patterns 1004, the new event data 1000 can be combined with the data associated with the one or more event patterns 1004, such as a first event pattern 1006 or a second event pattern 1008.Although two event patterns are illustrated in FIG.",
"10, the embodiments are intended to include, and otherwise cover, any number of event patterns.",
"The new event data 1000 that is associated with the first event pattern 1006 may be stored with event data for the first event pattern 1006 in a first event database 1010 that is part of the collision event database 422.Likewise, the new event data 1000 that is associated with the second event pattern 1008 may be stored with event data associated with the second event pattern 1010 a second event database 1012 that is part of collision event database 422.In an alternative embodiment, the comparing new event data 1000 with event patterns 1004 may be performed by FCW server 302.FIGS.",
"11-13 illustrate examples of collision event maps displayed on device 610 that are generated by collision event map component 416.The scenarios should be considered as specific embodiments and should not be considered as limiting.",
"Other embodiments are intended to include, or otherwise cover, any visual displays of information and maps that are useful for the functionality of the embodiments.",
"FIG.",
"11 illustrates an embodiment of the CWS 400 alerting a vehicle of potential collision scenarios with pedestrians.",
"FIG.",
"11 shows the display device 610 displaying informing alert image 1100 that is generated by collision event map component 416.Informing alert image 1100 shows some features of the intersection 102 (see FIG.",
"1) from a navigation perspective of vehicle 104.In the embodiment, the computer system 404 can include prior and/or historical event data that was collected in proximity to intersection 102.Entities in proximity to intersection 102 include remote vehicle 110 that is equipped with the CWS 400 and V2V transceiver 108, the single pedestrian 126 who is equipped with V2P transceiver 128, the school bus 134 that is equipped with the CWS 400 and V2V transceiver 136, the group of pedestrians 138 who are each equipped with V2P transceivers 140, and the motorcycle 130 that is equipped with the CWS 400 and V2M transceiver 132.In the scenario, school bus 134 blocks the view of the group of pedestrians from the perspective of vehicle 104.The group of pedestrians 138 is visible to remote vehicle 110 and motorcycle 130.Therefore, the group of pedestrians 138 is a potential unseen road hazard to vehicle 104.In the exemplary scenario, as vehicle 104 approaches intersection 102, computer system 404 searches prior event data for events based on the current location and heading of vehicle 104, provided by geographic position component 438.Computer system 404 can locate historical data for prior events in proximity to intersection 102.The prior event data indicates patterns of unexpected pedestrian movements across the intersection 102.The prior events have a data characteristic occurring weekdays between 3:00 pm to 6:00 pm.",
"The computer system 404 detects from an internal clock that the current time is 4:00 pm and the day is a weekday.",
"Computer system 404 therefore determines the current time falls within the time frame characteristic for the prior events.",
"Computer system 404 can detect V2P, V2V, and V2M signals received through vehicle 104 V2V transceiver 106.Computer system 404 can analyze and translate V2X signals as to source, location, and telemetry, and collision event map component 416 can map the signals onto informing alert image 1100.Using GPS location information from the V2X messages, computer system 404 can direct sensor system 516 to activate camera 522 to collect images of the V2X transmitting entities.",
"The images can be transmitted to computer system 404 for image recognition.",
"In some embodiments, informing alert image 1100 can display icons corresponding to a type of V2X signal received, e.g., a pedestrian icon for a V2P signal or a motorcycle icon for a V2M signal.",
"In an alternative embodiment, where images of V2X objects have been recognized, actual images of pedestrians, vehicles, motorcycles, etc.",
"could be displayed on informing alert image 1100.Based on the V2P messages from single pedestrian 126, computer system 404 can detect movement of the V2P transceiver towards the intersection 102.Comparison calculator 420 can analyze the real time data of the V2P movement and determine, based on comparisons with prior event V2P data patterns, that the pedestrian 126 has a statistical likelihood of crossing the intersection 102 in outside of crosswalks and in the current path of vehicle 104.To inform vehicle 104 of a potential collision event, computer system 404 can display an alert symbol 1102 on display device 610.To predict the nature of the potential collision event, computer system 404 can display movement of pedestrian 126 along a trajectory indicated by direction arrow 1104 towards intersection 102.To predict a potential movement of pedestrian 126, a pedestrian symbol 1106 can be displayed in front of direction arrow 1104.The outline of pedestrian symbol 1106 is a dashed line indicating symbol 1106 is only a predicted movement of pedestrian 126.The alert symbol 1102 and pedestrian symbol 1106 indicates that computer system 404 has determined there is a probability of pedestrian 126 crossing intersection 102 that can be a collision risk to vehicle 104.The determination is based on V2P signals combined with a calculated pattern of pedestrians crossing intersection 102 within the current time frame.",
"By displaying informing alert image 1100 with pedestrian symbol 1106, a driver can be alerted to a potential collision risk if pedestrian 126 follows the predicted pattern of travel indicated.",
"A second event at the intersection 102 is determined where V2P signals from V2P transceivers 140 indicate a gathering of the group of pedestrians 138 near intersection 102.Computer system 404 can analyze movement of V2P transceivers 140 although the group of pedestrians 138 is blocked from the view of vehicle 104 by school bus 134.Comparison calculator 420 can analyze the real time data of the V2P messages and determine, based on comparisons with prior event V2P data patterns, that the group of pedestrians 138 has a statistical likelihood of crossing the intersection 102 in outside of crosswalks and in the current path of vehicle 104.To inform vehicle 104 of a potential collision event, computer system 404 displays alert symbol 1102 on display device 610.To predict the nature of the potential collision event, computer system 404 displays movement of one of the group of pedestrians 138 along a trajectory indicated by direction arrow 1108 towards intersection 102.To predict a potential movement of one of the pedestrians 138, a pedestrian symbol 1110 is displayed in front of direction arrow 1108.The outline of pedestrian symbol 1110 is a dashed line indicating the pedestrian symbol 1110 is only a predicted movement of one of the pedestrians 138.The alert symbol 1102 and pedestrian symbol 1110 indicate that computer system 404 has determined there is a probability of one of the pedestrians 138 crossing intersection 102 that could be a road hazard to vehicle 104.By displaying informing alert image 1100 with pedestrian symbol 1110, a driver can be alerted to a potential road hazard if one of the group of pedestrians 138 follows the predicted pattern of travel indicated.",
"Computer system 404 can also inform other vehicles or entities within the vehicle communications network 200 of the potential collision risks.",
"Computer system 404 can broadcast the potential collision risk data from informing alert image 1100 and alert information using V2V communication protocols.",
"Remote vehicle 110 and motorcycle 130 can receive the V2V messages from vehicle 104 and display the informing alert image 1100 according to each vehicle's perspective and display device.",
"In the embodiment, computer system 404 can also collect event data regarding a school bus stop.",
"The event can be determined automatically from comparison calculator 404 analyzing the school bus 134 from V2V signals and/or a driver in vehicle 104 can manually enter the school bus stop event into computer system 404 via input device 424.Computer system 404 can determine to add the images, time, location, and V2X data from all events at the intersection 102 to the existing event data for intersection 102 in collision event database 422.FIG.",
"12 illustrates an embodiment of the CWS 400 alerting a vehicle of a potential collision scenario with a bicycle.",
"FIG.",
"12 includes display device 610 displaying informing alert image 1200 generated by collision event map component 416.Informing alert image 1200 displays some features of the intersection 102 from a navigation perspective of vehicle 104.In the embodiment, computer system 404 can include prior and/or historical event data for intersection 102.Vehicle communication network 200 users in proximity to intersection 102 include the remote vehicle 110 that is equipped with the CWS 400 and V2V transceiver 108, the bicycle 120 equipped with V2B transceiver 122, and the motorcycle 130 that is equipped with the CWS 400 and V2M transceiver 132.The bicycle 120 is traveling in bicycle lane 124 in close proximity to vehicle 104.In the scenario, as vehicle 104 approaches intersection 102, computer system 404 searches and locates historical and/or prior event data for events based on vehicle 104 location, provided by geographic position component 438.The prior event data indicates patterns of unexpected V2B movements across the intersection 102 in the path of vehicle 104.The prior events have a conditional time frame for weekdays between 5:00 pm to 7:00 pm.",
"The computer system 404 detects from an internal clock that the current time is 6:00 pm on a weekday and determines the current event data meets the conditional threshold for the prior events.",
"Computer system 404 analyzes and translates V2X signals as to source, location, and telemetry, and collision event map component 416 maps the signals onto informing alert image 1200.Using GPS location information from the V2X messages, computer system 404 can direct sensor system 516 to activate camera 522 to collect images of transmitting V2X entities.",
"The images can be transmitted to computer system 404 for image recognition.",
"In some embodiments, informing alert image 1200 can display icons corresponding to a type of V2X signal received, e.g., a motorcycle icon for a V2M signal.",
"In an alternative embodiment, where images of V2X entities have been recognized, actual images of pedestrians, vehicles, motorcycles, etc.",
"can be displayed on informing alert image 1200.Computer system 404 can detect movement of the V2B transceiver 122 towards the intersection 102.Comparison calculator 420 can analyze the real time data of the V2B movement and determines a statistical match between current event data and historical V2B data patterns that the bicycle 120 has a likelihood of crossing the intersection 102 outside of bicycle lane 124 and in the path of vehicle 104.To inform vehicle 104 of a potential collision event, computer system 404 displays an alert symbol 1206 on display device 610.To predict the nature of the potential collision event, computer system 404 displays movement of bicycle 120 along a trajectory indicated by direction arrow 1202 towards intersection 102.To predict a potential movement of bicycle 120, a bicycle symbol 1204 can be displayed in front of direction arrow 1202.The outline of bicycle symbol 1204 is a dashed line indicating that the bicycle symbol 1204 is only a predicted movement of bicycle 120.The alert symbol 1206 and bicycle symbol 1204 indicate that computer system 404 has determined a likely probability of bicycle 120 crossing intersection 102 that could be a collision risk to vehicle 104.The determination can be based on V2B signals combined with a calculated pattern of bicycles crossing intersection 102 outside of bicycle lane 124 within the current time frame.",
"By displaying informing alert image 1200 with bicycle symbol 1204, a driver can be alerted to a potential road hazard if bicycle 120 follows the predicted pattern of travel indicated.",
"FIG.",
"13 illustrates an embodiment of the CWS 400 alerting vehicle 104 of a potential collision scenario with wildlife.",
"In FIG.",
"13, informing alert image 1300 displays on display device 610 some features of the intersection 102 from a navigation perspective of vehicle 104.In the embodiment, the computer system 404 can include prior and/or historical event data that was collected in proximity to intersection 102.Vehicle communication network 200 users with near intersection 102 include remote vehicle 110 that is equipped with the CWS 400 and V2V transceiver 108, and motorcycle 130 that is equipped with the CWS 400 and V2M transceiver 132.As vehicle 104 approaches intersection 102, computer system 404 searches and locates prior event data for events based on vehicle 104 location, provided by geographic position component 438.The prior event data indicates patterns of unexpected wildlife movements across the intersection 102 within a time frame of 8:00 pm to 8:00 am.",
"The computer system 404 detects from an internal clock that the current time is 10:00 pm and determines the current event data meets the conditional data patterns.",
"Computer system 404 also detects V2V and V2M signals received through vehicle V2V transceiver 106.Computer system 404 analyzes and translates V2X signals as to source, location, and telemetry, and collision event map component 416 maps the signals onto informing alert image 1300.Computer system 404 receives from vehicle radar system 520 that indicate movement of an unknown entity 1302 in proximity to vehicle 104.Based on the detected movement, collision event map component 416 maps unknown entity 1302 onto informing alert image 1300.Computer system 404 can direct sensor system 516 to activate camera 522 and attempt to collect images of the unknown entity 1302.Comparison calculator 420 can analyze the current event data of the entity's movement and determine, based on comparisons with image recognition of images from camera 522, and prior event patterns, that the unknown entity 1302 has a statistical likelihood of being wildlife crossing the intersection 102 in the path of vehicle 104.To inform vehicle 104 of a potential collision event, computer system 404 displays an alert symbol 1308 on display device 610.To predict the nature of the potential collision event, computer system 404 displays movement of entity 1302 along a trajectory indicated by direction arrow 1304 towards intersection 102.To predict a potential movement of unknown entity 1302, a deer symbol 1306 can be displayed in front of direction arrow 1304.The outline of the deer symbol 1306 is a dashed line indicating a predicted path of unknown entity 1302.The alert symbol 1308 and deer symbol 1306 indicate a probability of unknown entity 1302 crossing intersection 102 that can be a road hazard to vehicle 104.The determination is based on radar signals from radar system 520 combined with one or more patterns of wildlife crossing intersection 102 within the conditional time frame.",
"By displaying alert symbol 1308 with deer symbol 1306, a driver of vehicle 104 can be alerted to a potential road hazard if unknown entity 1302 moves in a heading indicated by the predicted pattern of travel.",
"To warn other V2X users in proximity to intersection 102, computer system 404 can broadcast the potential collision event data and alerts via V2V signals that can be received and displayed by the CWS 400 in remote vehicle 110 and the CWS 400 in motorcycle 130.In the figures, although a single image is shown for each type of alert, other embodiments can include one or more images for each type of alert.",
"In particular, an arrow used to indicate position and heading of a road hazard or potential collision risk can be changed from a direction arrow to any type of indication of entity, movement, direction, etc.",
"that can help inform a driver of the potential road hazards and/or potential collision events.",
"In the embodiments, multiple images can distinguish between the types of alerts.",
"For example, an alert symbol can be used to distinguish between informing alerts and warning/hazard alerts.",
"Likewise, informing alerts can be associated with a different color or symbol than warning alerts.",
"In other embodiments, alerts can indicate multiple levels of threats of potential road hazards.",
"FIG.",
"14 is a flowchart of a method 1400 for configuring the CWS 400 based on an environment.",
"In some cases, a driver can have an opinion that a computer system 404 generates too many alerts, especially in a case of informing alerts about situations already known to a driver.",
"For example, in situations where vehicle 104 is located in an urban environment, such as business district of a city, many pedestrians similar to group of pedestrians 138 may be walking along sidewalks in proximity to vehicle 104.In such a situation, a visual or audible alert of every pedestrian in proximity to vehicle 104 can be deemed a nuisance.",
"It can therefore be beneficial for computer system 404 to adjust the number of alerts generated to vehicle 104 according a specific type of environment.",
"In the embodiments, computer system 404 can be configured to generate alerts based on different driving environments external to vehicle 104.In the embodiments, a frequency and/or type of alert can be adjusted between at least two different driving environments.",
"In an alternative embodiment, the frequency and/or type of alert can be adjusted between three or more different driving environments.",
"Some of the embodiments are intended to include driving environments that can include a road classification or a mapped boundary, such as a geographic, legal, or demographic boundary.",
"Examples of boundaries include urban, suburban, or rural areas or zones.",
"However, other embodiments for driving environments are intended to include or otherwise cover alert adjustments based on boundaries for a city, a county, a state or province, or a country, areas defined by population, areas near attractions, demographic areas, or any type of area or boundary.",
"Alerts can be adjusted for any type of environment or classification appropriate for the functionality of the embodiments to distinguish between the driving environments.",
"The first step for configuring the CWS 400 based on an environment is to activate an enhanced warning mode at step 1402.In the embodiment, a first environment mode can be selected when a configuration is a default mode of operation.",
"A second, or enhanced, environment mode of computer system 404 can perform automatic adjustments of alerts based on a driving environment.",
"In second step 1404, the computer system 404 can monitor and identify a current environment of vehicle 104.It can be beneficial for computer system 404 to interact with vehicle navigation system 436 to identify different road environments and vehicle locations.",
"In an embodiment, environments can be determined using functional road classification data.",
"Functional classification is a method used by state and federal transportation agencies to group highways, roads, and streets by the character of service they provide.",
"Some agencies can classify roads and highways according to urban and rural services based on specific criteria.",
"Some agencies may use other classifications, such as local, major and minor collector, minor arterial, and principal arterial.",
"In step 1404, to monitor and identify the current environment, GPS receiver 510 can determine a current location of vehicle 104, and navigation system 508 can provide computer system 404 the data resources to determine if the current road has a functional classification.",
"Although functional classification of roads is described, the embodiments intend to include or otherwise cover any type of region, area, zone, or road classification system that can accomplish the features and functions of the embodiments.",
"For example, instead of a functional classification system, the method step 1404, to monitor and identify the current environment, can use city, county, state, province, or other boundaries as environmental zones.",
"In an alternative embodiment, environment classification can use terrain, natural land features, natural water features, etc.",
"FIG.",
"14 can include step 1406 to determine if vehicle 104 is located in a rural zone.",
"If the vehicle 104 is located in a rural zone, then the method continues to step 1408 where computer system 404 can be configured to a rural warning mode.",
"In the rural warning mode, a predetermined threshold number of pedestrians detected from V2P signals can be automatically configured by computer system 404.The threshold may be configured to any number of pedestrians that could indicate high pedestrian traffic such that frequent V2P warnings to a driver can be deemed a nuisance in a rural environment.",
"The method proceeds in step 1410 to determine if the number of detected V2P signals representing pedestrians as VRUs exceed the rural warning mode threshold either simultaneously or over a predefined time period.",
"In the case of falling below the threshold, the computer system 404 can remain in a default rural warning mode 1412.In the case of exceeding the threshold, in step 1414 computer system 404 can automatically adjust a frequency and/or type of V2P alerts.",
"In an embodiment, V2P alerts can be generated less frequently than in a default rural configuration.",
"In an alternative embodiment, alerts are changed to an “information” alert that displays V2P information to a display device 610.The vehicle 104 may be traveling on a road and/or path that will transition from the current environment zone to a new environment zone.",
"Therefore, the method automatically returns to step 1404 to monitor and identify the current environment.",
"If computer system 404 determines at step 1406, to determine if vehicle is located in a rural zone, that vehicle 104 is not located in a rural zone, the method continues to step 1416 to determine if the vehicle 104 is in a suburban zone.",
"If computer system 404 determines that vehicle 104 is located in a suburban zone, then the method continues to step 1418 where computer system 404 can be configured to a suburban warning mode.",
"In the suburban warning mode, a predetermined threshold number of detected V2P signals can be automatically configured by the computer system 404.The threshold may be configured to any number of pedestrians that can indicate high pedestrian traffic such that frequent V2P alerts can be a nuisance to a driver.",
"In the embodiment, a number of pedestrians are identified by computer system 404 by their V2P signals within proximity to vehicle 104.The method determines in decision step 1420 if the number of V2P signals exceed the suburban warning mode threshold.",
"If the numbers of pedestrians are below the threshold, the computer system 404 maintains the suburban warning mode at step 1422.If the number of V2P signals exceed the threshold, then step 1424 can automatically adjust a frequency and/or type of warning indicator/alert to a driver either at display device 610 or with an audible indicator.",
"In an embodiment, computer system 404 can generate pedestrian warnings less frequently than in a default suburban configuration.",
"In an alternative embodiment, computer system 404 changes warnings to an “information” mode of configuration that transmits information to a driver instead of a warning or alert.",
"The method automatically returns to step 1404 to monitor and identify the current environment.",
"At step 1404, to monitor and identify the current environment, if computer system 404 determines that vehicle 104 is not in a rural environment zone or a suburban environment zone, the method continues to 1426 to determine if the vehicle 104 is located within an urban zone.",
"If computer system 404 determines that vehicle 104 is located within an urban zone, then the computer system 404 can be configured to an urban warning mode in step 1428.In the urban warning mode, a predetermined threshold number of V2P signals can be automatically configured by the computer system 404.The threshold may be configured to any number of V2P signals that could indicate high pedestrian traffic such that frequent V2P alerts can be deemed a nuisance.",
"In decision step 1430, the computer system 404 determines if the number of V2P signals exceed the urban warning mode threshold.",
"In the case of the number of V2P signals falling below the threshold, step 1432 may maintain the urban warning mode.",
"In the case of exceeding the threshold, step 1434 may automatically adjust computer system 404 to configure the frequency and/or type of warning indicator/alert to a driver.",
"In an embodiment, computer system 404 can adjust the alerts to less frequent or not at all.",
"Further, the computer system 404 can generate an “information” mode of configuration that displays V2P information on display device 610 instead of an alert.",
"As a final step, the method automatically returns to step 1404 to monitor and identify the environment.",
"FIG.",
"15 is a flowchart of a method 1500 to update event data at the CWS 400 by service provider 212.At predetermined times, the event data in the CWS 400 may be updated, or new event data may be downloaded due to a new subscription or new features to an old subscription for a service associated with CWS 400.The downloaded collision event data may be provided by service provider 212 or another service provider.",
"In some embodiments, the download may occur upon the request from vehicle 104.In other embodiments, the download may occur upon request of the service provider 212.In still other embodiments, vehicle 104 may be programmed to request, or service provider 212 may be programmed to initiate, an automatic download on a predetermined basis.",
"The method 1500 to update event data may include a first step 1502 where the vehicle 104 CWS 400 initiates a download of updated event data from service provider 212.Computer system 404 may initiate the download of event data by transmitting a request to FCW server 302.A second step 1504 may include the service provider 212 receives the request for the updated event data.",
"A third step 1506 may include the vehicle 104 sending user or vehicle credentials to the service provider 212 in order to identify CWS 400.A fourth step 1508 may include the service provider packaging the next event update.",
"A fifth step 1510 may include the service provider sending the event data update to computer system 404.A sixth step 1512 may include the CWS 400 receiving and updating the CWS 400 with the received event data.",
"FIG.",
"16 is a flowchart of an exemplary method 1600 for transmitting event data to the service provider 212.A first step 1602 may include the CWS 400 storing event data in the collision event database 422.A second step 1604 may include the CWS 400 transmitting the event data to the service provider 212.A third step 1606 may include the service provider 212 updating the FCW database 306 with the new event data.",
"A fourth step 1608 may include the service provider 212 providing the updated FCW database 306 to other vehicles using the vehicle communication network 200.The above described techniques may take the form of computer or controller implemented processes and apparatuses for practicing those methods.",
"The disclosure can also be embodied in the form of computer program code containing instructions embodied in tangible media, such as floppy diskettes, CD-ROMs, hard drives, or any other computer-readable storage medium, wherein, when the computer program code is loaded into and executed by a computer or controller, the computer becomes an apparatus for practicing the embodiments.",
"The disclosure may also be embodied in the form of computer program code or signal, for example, whether stored in a storage medium, loaded into and/or executed by a computer or controller, or transmitted over some transmission medium, such as over electrical wiring or cabling, through fiber optics, or via electromagnetic radiation, wherein, when the computer program code is loaded into and executed by a computer, the computer becomes an apparatus for practicing the embodiments.",
"When implemented on a general-purpose microprocessor, the computer program code segments configure the microprocessor to create specific logic circuits.",
"VII.",
"Alternative Embodiments While certain embodiments of the invention are described above, and FIGS.",
"1-16 disclose the best mode for practicing the various inventive aspects, it should be understood that the invention can be embodied and configured in many different ways without departing from the spirit and scope of the invention.",
"Exemplary embodiments are intended to include or otherwise cover any type of vehicle-to-vehicle, vehicle-to-external, or one-to-many communication network.",
"In other words, exemplary embodiments are intended to cover any application of a communications network between vehicles, bicycles, motorcycles, pedestrians, processors, servers, controllers, etc.",
"and infrastructure disclosed above.",
"Exemplary embodiments are intended to include or otherwise cover identification and warning for any type of event or scenario that could be a hazard to a moving vehicle 104 either on a road or off-road.",
"Weather patterns and forces of nature can be identified and saved as potential collision events, such as flooding roads or areas, snowy or icy roads or areas, storm-hit or windy roads or areas, including road hazards, such as fallen rocks or trees caused by forces of nature.",
"Exemplary embodiments are also intended to cover execution of method steps on any appropriate specialized or general purpose server, computer device, or processor in any order relative to one another.",
"Some of the steps in the embodiments can be omitted, as desired.",
"A computer architecture of the embodiments may be a general purpose computer or a special purpose computer.",
"A computer can be used to implement any components of the CWS 400 or the methods of the embodiments.",
"For example, components of computer system 404 can be implemented on a computer via its hardware, software program, firmware, or a combination thereof.",
"Although individual computers or servers are shown in the embodiments, the computer functions relating to computer system 404 may be implemented in a distributed fashion on a number of similar platforms, to distribute the processing and/or functional load.",
"Embodiments are also intended to include or otherwise cover methods of using and methods of manufacturing the collision warning system disclosed above.",
"The methods of manufacturing include or otherwise cover processors and computer programs implemented by processors used to design various elements of the CWS 400 above.",
"For example, embodiments are intended to cover processors and computer programs used to design or test the CWS 400.Exemplary embodiments are intended to cover all software or computer programs capable of enabling processors to implement the above operations, designs and determinations.",
"Exemplary embodiments are also intended to cover any and all currently known, related art or later developed non-transitory recording or storage mediums (such as a CD-ROM, DVD-ROM, hard drive, RAM, ROM, floppy disc, magnetic tape cassette, etc.)",
"that record or store such software or computer programs.",
"Exemplary embodiments are further intended to cover such software, computer programs, systems and/or processes provided through any other currently known, related art, or later developed medium (such as transitory mediums, carrier waves, etc.",
"), usable for implementing the exemplary operations disclosed above.",
"These computer programs can be executed in many exemplary ways, such as an application that is resident in the memory of a device or as a hosted application that is being executed on a server and communicating with the device application or browser via a number of standard protocols, such as TCP/IP, HTTP, XML, SOAP, REST, JSON and other sufficient protocols.",
"The disclosed computer programs can be written in exemplary programming languages that execute from memory on the device or from a hosted server, such as BASIC, COBOL, C, C++, Java, Pascal, or scripting languages such as JavaScript, Python, Ruby, PHP, Perl or other sufficient programming languages.",
"Embodiments are amenable to a variety of modifications and/or enhancements.",
"For example, although the implementation of various components described above may be embodied in a hardware device, it can also be implemented as a software-only solution, e.g., an installation on an existing server.",
"In addition, systems and their components as disclosed herein can be implemented as a firmware, firmware/software combination, firmware/hardware combination, or a hardware/firmware/software combination.",
"Some of the disclosed embodiments include or otherwise involve data transfer over a network, such as communicating various inputs over the network.",
"The network may include, for example, one or more of the Internet, Wide Area Networks (WANs), Local Area Networks (LANs), analog or digital wired and wireless telephone networks (e.g., a PSTN, Integrated Services Digital Network (ISDN), a cellular network, and Digital Subscriber Line (xDSL)), radio, television, cable, satellite, and/or any other delivery or tunneling mechanism for carrying data.",
"Network may include multiple networks or sub networks, each of which may include, for example, a wired or wireless data pathway.",
"The network may include a circuit-switched voice network, a packet-switched data network, or any other network able to carry electronic communications.",
"For example, the network may include networks based on the Internet protocol (IP) or asynchronous transfer mode (ATM), and may support voice using, for example, VoIP, Voice-over-ATM, or other comparable protocols used for voice data communications.",
"In one implementation, the network includes a cellular telephone network configured to enable exchange of text or SMS messages.",
"Examples of a network include, but are not limited to, a personal area network (PAN), a storage area network (SAN), a home area network (HAN), a campus area network (CAN), a local area network (LAN), a wide area network (WAN), a metropolitan area network (MAN), a virtual private network (VPN), an enterprise private network (EPN), Internet, a global area network (GAN), and so forth.",
"While the subject matter has been described in detail with reference to exemplary embodiments thereof, it will be apparent to one skilled in the art that various changes can be made, and equivalents employed, without departing from the scope of the invention."
]
] |
Patent_15871412
|
[
[
"MULTI-FUNCTION POWER STRIP",
"Embodiments of a multi-function power strip are shown, said strip including a first endcap and a second endcap; at least one rail, said rail being adapted to engage with at least one outlet module; the rail also being engaged with a transformer module, said transformer module in electrical connection with the at least one outlet module, and adapted to receive electrical power therefrom, said transformer module further comprising a transformer adapted to transform electrical power into a plurality of voltages suitable for powering a plurality of different models of electronic accessories, and a connector forming a circuit to provide a suitable one of the plurality of voltages to an electronic accessory; and wherein the at least one outlet module and the transformer module are releasably joined together."
],
[
"1.A module connector for a multi-function power strip comprising: a module connector body with a first end and a second end, the second end being a mirror image of first end; at least one aperture provided in the first end of the module connector body and extending all the way through the module connector body to the second end; a first contact disposed within the at least one aperture at the first end of the module connector body and a second contact disposed in the at least one aperture at the second end of the module connector body, wherein the first and second contacts are electrically connected; and wherein the first and second contacts mate with blades disposed in a first module of the multi-function power strip and a second module of the multi-function power strip thereby forming an electrical connection between the adjacent first and second modules.",
"2.The module connector of claim 1, wherein the blades are disposed in an opening in the first module and the second module.",
"3.The module connector of claim 2, wherein the blades do not protrude past the side of the first module and the second module to prevent the blades from making accidental contact with persons or things which may cause an electrical shock or short circuit.",
"4.The module connector of claim 1, wherein the module connector is adapted to slide into an opening in the first module and the second module.",
"5.The module connector of claim 1, wherein at least three apertures are provided in the module connector body.",
"6.The module connector of claim 1, wherein the module connector body further comprises an alignment boss.",
"7.The module connector of claim 6, wherein the first module and the second module are both provided with alignment grooves to receive the alignment boss on the module connector body.",
"8.The module connector of claim 1, wherein the contacts are made from copper.",
"9.The module connector of claim 1, Therein the contacts are made from any material suitable for conducting electricity."
],
[
"<SOH> BRIEF DESCRIPTION OF THE DRAWINGS <EOH>FIG.",
"1 is a top view of an embodiment of the multi-function power strip.",
"FIG.",
"2 is a top exploded view of an embodiment of the multi-function power strip.",
"FIG.",
"3 is an isometric exploded view of an embodiment of the multi-function power strip.",
"FIG.",
"4 is a block diagram showing the inter-relation of parts in an embodiment of the multi-function power strip.",
"FIG.",
"5 is a side perspective view of the module connector and module used in an embodiment of the multi-function power strip.",
"detailed-description description=\"Detailed Description\" end=\"lead\"?"
],
[
"CROSS-REFERENCE TO RELATED APPLICATIONS The present application is a continuation of U.S. application Ser.",
"No.",
"15/380,766 filed Dec. 15, 2016, now U.S. Pat.",
"No.",
"9,876,325, which is a continuation of U.S. application Ser.",
"No.",
"15/073,257 filed Mar.",
"17, 2016, now abandoned, which is a continuation of U.S. application Ser.",
"No.",
"14/856,782 filed Sep. 17, 2015, now U.S. Pat.",
"No.",
"9,300,097, which is a continuation of U.S. application Ser.",
"No.",
"14/147,314, filed Jan. 3, 2014, now U.S. Pat.",
"No.",
"9,147,982, which is a continuation of U.S. application Ser.",
"No.",
"13/110,644, filed May 18, 2011, now U.S. Pat.",
"No.",
"8,622,756, all having the same title, and all of which are incorporated herein by this reference.",
"BRIEF DESCRIPTION OF THE DRAWINGS FIG.",
"1 is a top view of an embodiment of the multi-function power strip.",
"FIG.",
"2 is a top exploded view of an embodiment of the multi-function power strip.",
"FIG.",
"3 is an isometric exploded view of an embodiment of the multi-function power strip.",
"FIG.",
"4 is a block diagram showing the inter-relation of parts in an embodiment of the multi-function power strip.",
"FIG.",
"5 is a side perspective view of the module connector and module used in an embodiment of the multi-function power strip.",
"DETAILED DESCRIPTION OF THE DRAWINGS Embodiments of a multi-function power strip are shown and described.",
"Generally, the multi-function power strip comprises a cord for connection to an electrical power source; a plurality of outlet modules in electrical connection with the cord, wherein said plurality of outlet modules are in electrical connection with each other; and a transformer module, said transformer module in electrical connection with at least one of the outlet modules, and adapted to receive electrical power therefrom, said transformer module further comprising, a transformer adapted to transform electrical power into a plurality of voltages suitable for powering a plurality of different models of electronic accessories, and a connector electrically connected to the transformer, and having a plurality of pins, each of the plurality of pins having a designated one of the plurality of voltages supplied thereto, and wherein the connector is configured to engage with a plurality of plugs, each of the plugs forming an electrical connection with a designated one of the plurality of pins and a ground pin, thereby forming a circuit to provide a suitable one of the plurality of voltages to an electronic accessory; and wherein the outlet modules and the transformer module are releasably joined together.",
"Thus, embodiments of the multi-function power strip are assembled by combining together and electrically connecting a number of modular components into a single assembly.",
"FIG.",
"1 shows a top view of a first embodiment of the multi-function power strip.",
"As can be seen in FIG.",
"1, multi-function power strip 100 is comprised of endcaps 101 and rail 102.Various modular components (which will be discussed in greater detail infra) are engaged with rail 102 and retained in engagement with rail 102 by end caps 101.Endcaps 101 may attach to rail 102 by means of screws or other fasteners commonly used in the art.",
"Alternatively, endcaps 101 may engage with rail 102 by means of a friction-fit or snap-fit, and thereby be retained in connection to the rail 102.First endcap 101a is provided with a coupler (not shown) into which a cord (not shown) can be received.",
"The cord (not shown) provides standard household electrical power, which one of skill in the art would appreciate can be between 110 and 240 volts, alternating current, with a frequency between 50 and 60 Hz.",
"The cord is received in the endcap, and the endcap is electrically connected to the first modular component in the multi-function power strip, thereby providing household electrical power to the first modular component, and all other modular components that are joined thereto.",
"Referring again to FIG.",
"1, it will be appreciated that a number of modular components are engaged with rail 102.All of the modular components are electrically connected together, and each receives electrical power from the previous component in the chain.",
"The structure and function of each will now be explained in greater detail.",
"As shown in FIG.",
"1, an embodiment of multi-function power strip 100 may include a switch module 110.Switch module 110 is provided with switch 111.Switch 111 may be a single pole, single throw switch.",
"As one of ordinary skill in the art will readily appreciate, switch 111 may be any type of switch known to the art which is capable of operating under the load conditions imposed by the transmission and handling of ordinary household electrical power, as referenced above.",
"Switch module 110 is electrically coupled to the first end cap 101a, and in such way it receives household electrical power from the cord (not shown) through the first endcap 101a.",
"Switch module 110 is also electrically coupled to the next modular component in the chain, which in FIG.",
"1 is fuse module 120.Electrical power flows into switch module 110, through switch 111, and out of switch module 110 into the next modular component in the chain.",
"An indicator light (not shown) may be provided on the housing of switch module 110, or it may be incorporated into the switch 111, as in the case of a rocker switch with light to indicate it is in the “ON” position, thereby alerting a user to the status of the power strip.",
"By manipulating switch 111, a user may selectively turn on and off the flow of electrical power through switch module 110 to other modular components further down the chain electrically connected to switch module 110.For this reason, switch module 110 may be provided near the beginning of the chain of modular components but it need not be.",
"As with all of the modular components disclosed herein, the order of the components is not critical to the operation of the multi-function power strip.",
"As long as the modular components are in electrical connection with each other, the order in which they are assembled is a matter of convenience to suit the nature of the area being serviced by the multi-function power strip.",
"Referring again to FIG.",
"1, the next modular component in the chain following the switch module 110 is the fuse module 120.As with all of the modular components described, fuse module 120 is electrically connected to and receives electrical power from the component in the chain before it (i.e.",
"in this case, the switch module).",
"Electrical power then passes through a fuse 121 and then flows out of fuse module 120 into the next component in the chain.",
"As one of ordinary skill in the art will readily appreciate, fuse 121 may be any type of fuse known to the art which is capable of operating under the load conditions imposed by the transmission and handling of ordinary household electrical power.",
"Alternatively, fuse 121 may be a circuit breaker, a ground fault circuit interrupter or any other device designed to protect an electrical circuit from damage caused by overload or short circuit by detecting a fault condition and interrupting continuity to discontinue electrical flow.",
"The fuse 121 may be completely enclosed in the housing of fuse module 120, such that it is not accessible by a user.",
"Alternatively, in cases where a circuit breaker or other device that must be reset by a user after a fault occurs are used, the fuse 121 may be mounted so that it protrudes from the housing of fuse module 120, so as to be accessible by a user.",
"Also shown in FIG.",
"1 is a first outlet module 130.As with all of the modular components described, first outlet module 130 is electrically connected to and receives electrical power from the component in the chain before it (i.e.",
"in this case, the fuse module).",
"The flow of electrical power is then split, and is sent both to outlet receptacles 131 and out of first outlet module 130 into the next component in the chain.",
"One of ordinary skill in the art will appreciate that many different configurations of outlet receptacles 131 have been developed and implemented in various countries throughout the world.",
"For example, Type A and Type B outlet configurations are commonly used in North America.",
"The Type C outlet configuration is commonly used in continental Europe.",
"The Type G outlet configuration is commonly used in the United Kingdom and the Type I configuration is commonly used in Australia and New Zealand.",
"The following outlet configurations are recognized by those of ordinary skill in the art: a Type A outlet, a Type B outlet, a Type C outlet, a Type D outlet, a Type E outlet, a Type F outlet, a Type E/F hybrid outlet, a Type G outlet, a Type H outlet, a Type I outlet, a Type J outlet, a Type K outlet, a Type L outlet, and a Type M outlet.",
"Outlet receptacles 131 may take the form of any of the outlet configurations recited above.",
"For example, in FIG.",
"1, the outlet configuration of first outlet module 130 is a Type G outlet.",
"In this way, the power strip may be adapted to function in various countries using different outlet configurations.",
"Within the housing of first outlet module 130 may be provided a fuse 132 in the electrical power supply line ahead of outlet receptacles 131, to protect any electrical circuits plugged into the outlet receptacles from overload or short circuit.",
"Fuse 132 may be used in addition to or in place of a fuse module 120.Also shown in FIG.",
"1 is a second outlet module 140.Second outlet module 140 is the same in all respects as first outlet module 130, except that second outlet module 140 may have a different outlet configuration than first outlet module 130.Alternatively, second outlet module 140 may have the same outlet configuration as first outlet module 130.For example, in FIG.",
"1, second outlet module 130 has a Type B outlet configuration, which is different than first outlet module 130, which has a Type G outlet configuration.",
"As with all of the modular components described, second outlet module 140 is electrically connected to and receives electrical power from the component in the chain before it (i.e.",
"in this case, the first outlet module).",
"The flow of electrical power is then split, and is sent both to outlet receptacles 141 and out of second outlet module 140 into the next component in the chain.",
"Although not shown, within the housing of second outlet module 140 may be provided a fuse in the electrical power supply line ahead of outlet receptacles 141, to protect any electrical circuits plugged into the outlet receptacles from overload or short circuit.",
"The fuse may be used in addition to or in place of a fuse module 120.The transformer module 150 is also shown in FIG.",
"1.As with all of the modular components described, transformer module 150 is electrically connected to and receives electrical power from the component in the chain before it (i.e.",
"in this case, the second outlet module).",
"Disposed within the transformer module is a transformer (not shown).",
"The transformer receives household electrical power from the previous component in the chain.",
"The transformer is adapted to transform the household electrical power into a plurality of voltages suitable for powering a plurality of different models of electronic accessories.",
"By way of example and without limitation, the transformer may be one of those supplied by the Trade Management Group Ltd. One of ordinary skill in the art will readily appreciate that any transformer capable of operating under the load conditions imposed by the transmission and handling of ordinary household electrical power and capable of producing a plurality of output voltages may be suitable for use in transformer module 150.By way of example, and without limitation, the transformer may be adapted to produce the following output voltages: 16V, 18V, 20V, 22V and 24V.",
"All of the preceding voltages may be provided at a current of approximately 5 A or less.",
"Transformer module 150 may include a primary output connection 151.Primary output connection 151 may be provided with a plurality of pins (not shown).",
"Each of the plurality of pins may have a designated one of the plurality of voltages produced by the transformer supplied thereto.",
"Additionally, a ground pin may be provided as one of the plurality of pins in the primary connector.",
"In use, a plurality of cords with plugs may be provided to the user.",
"Each of the plurality of plugs will fit into the primary output connector 151 in such a way as to form an electrical connection with a designated one of the plurality of pins and the ground pin, thereby forming a circuit to provide a suitable one of the plurality of voltages to an electronic accessory.",
"Each of the plurality of plugs will only fit into the primary output connector 151 in a specified way, thus each of the cords and associated plugs supplies one of the designated voltages to an electronic accessory.",
"The user determines which plug and cord combination to use to power a specified electronic accessory.",
"Transformer module 150 may also be provided with a secondary output connector 152.In addition to the voltages produced by the transformer and output to the primary output connector 151, the transformer may be adapted to produce certain secondary output voltages.",
"By way of example and without limitation, the secondary output voltages produced by the transformer may be: 5V, 12V, 15V, and 22V.",
"All of the preceding voltages may be provided at a current of approximately 5 A or less.",
"In a similar fashion as described above, secondary output connection 152 may be provided with a plurality of pins (not shown).",
"Each of the plurality of pins may have a designated one of the plurality of secondary output voltages produced by the transformer supplied thereto.",
"Additionally, a ground pin may be provided as one of the plurality of pins in the secondary connector.",
"In use, a plurality of cords with plugs may be provided to the user.",
"Each of the plurality of plugs will fit into the secondary output connector 152 in such a way as to form an electrical connection with a designated one of the plurality of pins and the ground pin, thereby forming a circuit to provide a suitable one of the plurality of secondary output voltages to secondary electronic accessory.",
"Each of the plurality of plugs will only fit into the secondary output connector 152 in a specified way, thus each of the cords and associated plugs supplies one of the designated secondary output voltages to a secondary electronic accessory.",
"The user determines which plug and cord combination to use to power a specified secondary electronic accessory.",
"Also shown in FIG.",
"1 is USB module 160.As with all of the modular components described, USB module 160 is electrically connected to and receives electrical power from the component in the chain before it (i.e.",
"in this case, the transformer module).",
"USB module is provided with USB ports 161, which are standard Universal Serial Bus (USB) ports.",
"Power may be provided to USB ports 161 in two ways.",
"ln a first embodiment, the transformer in transformer module 150 may produce a USB electrical power output.",
"By way of example and without limitation, such USB electrical power output may be a 5V 2 A power output.",
"The USB electrical power output is then sent from the transformer module 150 to the USB module 160 and distributed through the USB ports 161.In an alternate embodiment, a USB transformer may be provided within USB module 160.In this embodiment, the USB module receives household electrical power from the prior component in the chain (i.e.",
"the transformer module) and steps it down to a voltage suitable for distribution through the USB ports 161.Several other aspects of the USB module 160 will now be further explained.",
"Universal Serial Bus (USB) is a specification to establish communication between devices and a host controller (usually a personal computer), and can be used to connect computer peripherals to a personal computer.",
"USB connections can also be used with other devices such as smartphones, PDAs and video game consoles.",
"USB connectors supply electric power to the devices connected thereto, so devices connected by USB may not require a power source of their own.",
"One of ordinary skill in the art will readily appreciate that the parameters of the output from the USB ports 161 is governed by the USB standard.",
"The USB 2.0 standard is commonly used in many applications, and USB module 160 and the output of USB ports 161 may be selected to conform to that standard.",
"Alternatively, the USB 3.0 standard has recently introduced, and USB module 160 and the output of USB ports 161 may be selected to conform to that standard.",
"As noted above, USB connections may be used to supply power to a device or to recharge the batteries contained in a portable device.",
"When used for charging, the electrical power supplied to the USB ports 161 may be 5V and 0.5 A.",
"One of ordinary skill in the art will readily appreciate that certain electronic accessories, most notably Apple® products, require a higher charging amperage than those of devices which comply with the USB standards.",
"Such devices requiring higher charging amperages may require as much as 2 A for proper charging.",
"It should appreciated that the power supplied to all or a portion of USB ports 161 could be standard USB power or higher amperage charging power to accommodate devices which require higher charging amperages.",
"Additionally, it should be appreciated that charging electronic devices and providing USB power are not the only functions that the USB module 160 can perform.",
"USB module 160 may also serve as a USB hub.",
"A USB hub is a device that expands a single USB port into several so that there are more ports available to connect devices to a host system.",
"In such an arrangement, one of the USB ports 161a may be designated a USB hub port and may be connected via a USB cable (not shown) to a USB port on a personal computer.",
"USB module 160 may contain electronic circuitry required to allow USB module 160 to act as a USB hub.",
"Most USB hubs use one or more integrated controller (IC's), of which several designs are available from various manufacturers and are well known to persons of skill in the art.",
"The IC's control the flow of data between the USB hub port 161a and the remaining USB ports 161, and thereby allows the remaining USB ports 161 to act as additional USB ports connected to the personal computer connected to the USB hub.",
"Also shown in FIG.",
"1 is network module 170.Depending on the functionality implemented, network module 170 may or may not require a source of electrical power.",
"In an embodiment where network module 170 does require electrical power, network module 170 is electrically connected to and receives electrical power from the component in the chain before it (i.e.",
"in this case, the USB module).",
"The power received by network module 170 may be standard household electrical power, and network module 170 may contain a transformer (not shown) for stepping down the household electrical power to a voltage suitable for use in the network module.",
"Alternatively, the component in the chain before the network module 170 (in this case, the USB module) may transform the household electrical power into a voltage suitable for use in the network module 170 and then pass that voltage on to the network module 170.Network module 170 is provided with network ports 171.Network ports 171 may be RJ45 connectors for receiving LAN (Local Area Network) data signals.",
"Alternatively, network ports 171 may be RJ11 connectors for receiving telephone signals, or BNC connectors for receiving cable TV signals or other data signals.",
"One of ordinary skill will appreciate that network ports 171 may take the form of any connector necessary to connect the required data stream to the network module 170.Inside network module 170 is provided a fuse, circuit breaker or the like (not shown).",
"The fuse, circuit breaker or the like is electrically connected between first network port 171a and second network port 171b, and provides voltage and current surge protection between the two ports.",
"In operation, a data feed cable (not shown) is connected to first network port 171a.",
"A personal computer or other device may then be connected via a data cable to second network port 171b.",
"In the event of a voltage or current spike in the data circuit, the fuse, circuit breaker or the like provided in network module 170 will trip, thereby preventing said voltage or current spike from reaching the personal computer or other device connected to second network port 171b.",
"In this way, network module 170 may act as pass-through surge suppressor for LAN, telephone, CATV or other data feeds.",
"It should be appreciated that network module 170 may also have more advanced features.",
"For instance, network module 170 may function as a network switch.",
"A network switch serves as a controller, enabling networked devices to exchange data with each other efficiently.",
"Network switches are capable of inspecting data packets as they are received, determining the source and destination device of each packet, and forwarding them appropriately.",
"By delivering messages only to the connected device intended, a network switch conserves network bandwidth.",
"If network module 170 is to be configured as a network switch, electrical power may be provided to the network module 170 as described supra.",
"If network module 170 is to be configured as a network switch, network module 170 may be provided with more network ports than shown in FIG.",
"1, for example, network module 170 may be provided with four network ports.",
"One of the network ports may be designated a LAN input port and may be connected via a LAN cable (not shown) to a local area network.",
"Network module 170 may be provided with electronic circuitry required to allow network module 170 to act as a network switch.",
"Most network switches use one or more integrated controller (IC's), of which several designs are available from various manufacturers and are well known to persons of skill in the art.",
"The IC's control the flow of data between the LAN input port and the remaining network ports, and thereby allows the remaining network ports to act as additional network ports for connecting additional devices to the local area network.",
"The network switch electronic circuitry inside the network module 170 directs data on the LAN to the appropriate devices connected to the network ports.",
"Thus, the switch allows multiple devices to be connected to a single LAN connection, and provides for the accurate routing of data to the devices so connected.",
"FIG.",
"2 shows a top exploded view of an embodiment of a multi-function power strip 100.Like numbers will be used to designate components already described with respect to FIG.",
"1.As can be seen in FIG.",
"2, first endcap 101a and endcap 101 are provided, as is rail 102.Additionally, switch module 110, fuse module 120, first outlet module 130, second outlet module 140, transformer module 150, USB module 160 and network module 170 are provided.",
"As can be readily seen in the exploded view, all of the aforementioned modules are slidably engaged with the rail 102, and retained in engagement with the rail 102 by the endcaps 101.As has been previously pointed out, it should be appreciated that not all of the aforementioned modules need be provided in every embodiment of the power strip.",
"For example, only a single outlet module may be provided, or the USB and/or network modules may be left out of the configuration.",
"Thus, depending on the customer's desire for the functionality of the device, certain modules may be excluded from the assembly, or certain modules may be included in numbers in excess of what has been shown in FIG.",
"2, as in the case where a customer desires numerous outlet modules in addition to all the other modules.",
"It should be readily appreciated that rail 102, as an extruded part, may be cut to any length and therefore may accommodate any number of modules as requested by the customer.",
"The only limitation on the number of modules, and hence the overall length of rail 102 and relatedly the assembly 100 is that the maximum power that can be drawn by the combination of all of the modules in the power strip is 4000 Watts.",
"As long as the combined modules draw less than the aforementioned maximum power, any combination of modules, and any length of rail 102 necessary to accommodate those modules may be used.",
"Also shown in FIG.",
"2 are module connectors 210.Module connectors 210 electrically connect the various modules in the power strip assembly together.",
"Module connectors 210 mate with electrical contacts formed in the housings of the various modules (not shown) and thereby electrically connect two adjacent modules together.",
"The structure of the module connectors 210 will be explained in greater detail with reference to FIG.",
"5.Referring again to FIG.",
"2, note that certain modules do not employ module connectors 210.As shown in FIG.",
"2, USB module 160 and network module 170 use attached connectors 220 to electrically connect those modules to the previous component in the chain.",
"Attached connectors 220 have essentially the same structure as module connectors 210 with the exception being that attached connectors 220 are permanently attached to the module that they connect to the previous component in the chain.",
"One of ordinary skill will readily appreciate either module connectors 210 or attached connectors 220 could be used to electrically connect any or all of the modules in the power strip together, and the selection of either module connector 210 or attached connector 220 is simply a matter of preference or improvement of the manufacturability of the power strip.",
"FIG.",
"3 shows an isometric exploded view of an embodiment of the multi-function power strip 100.Like numbers will be used to designate components already described with respect to FIG.",
"1.As can be seen in FIG.",
"3, first endcap 101a and endcap 101 are provided, as is rail 102.Additionally, switch module 110, fuse module 120, first outlet module 130, second outlet module 140, transformer module 150, USB module 160 and network module 170 are provided.",
"FIG.",
"3 illustrates the manner in which the various modules engage with rail 102.As can be in FIG.",
"3 all of the modules are provided with tabs 310.Tabs 310 slidably engage with groove 320 in rail 102, and thereby retain the modules in the rail.",
"Endcaps 101 and 101a engage with the ends of rail 102, and have holes 330 provided therein for attachment means (not shown) to secure the endcaps 101, 101a to the rail 102.The modules can be slid into and out of engagement with rail easily for assembly and for disassembly in the event it becomes necessary to replace one of the modules.",
"FIG.",
"4 shows a block diagram showing the inter-relation of parts in an embodiment of the multi-function power strip.",
"As shown in FIG.",
"4, power source 400 is a standard household electrical power source and is the power input into the multi-function power strip.",
"The electric power may then pass through components 410 which may be an on/off switch, a circuit breaker or a fuse.",
"The electrical power may pass through a single one, two or all three of these components, depending on the configuration of the multi-function power strip.",
"Electrical power may then pass through an optional timer or occupancy sensor 420.If component 420 is a timer module, it may be a standard programmable timer that is configured to permit the flow of electrical power to components down the chain for certain periods of the day, and to block the flow of electrical power to components down the chain for certain other periods of the day.",
"Such timers are well known to those of skill in the art, as is their inclusion in a circuit of this type.",
"If component 420 is an occupancy sensor module, it may contain an occupancy sensor adapted to detect the presence of a person in the area adjacent to the power strip and to turn off electrical power to components down the chain of the power strip when a person is not present in the area adjacent to the power strip.",
"One of ordinary skill in the art will readily appreciate that any occupancy sensor switch suitable for use in the area around a power strip would be suitable for use as an occupancy sensor in occupancy sensor module 420.Occupancy sensor module 420 may operate by detecting infrared radiation in the area surrounding the power strip that is produced by the presence of a person.",
"In operation, when occupancy sensor module 420 detects the presence of a person in the area surrounding the power, it allows the flow of electrical power to modules down the chain of the power strip.",
"If the occupancy sensor does not detect the presence of a person in the area surrounding the power strip, it interrupts the flow of electrical power to the components down the chain.",
"As shown in FIG.",
"4, electrical power then passes into outlet modules 430, 440, 450 and 460.The dashed lines in FIG.",
"4 show possible routes for the electrical power, showing that it may travel through one, two, three or all four of the outlet modules, depending on the configuration of the power strip.",
"As shown in FIG.",
"4, the outlet modules are all of different configurations, outlet module 430 is a United States configuration outlet; outlet module 440 is a European configuration outlet; outlet module 450 is a United Kingdom configuration outlet; and outlet module 460 is a Chinese configuration outlet.",
"One of ordinary skill will appreciate that the outlet modules may all have different configurations as shown or they may all be of a single configuration, or they may be a combination of two or more configurations.",
"Each of the outlet modules is configured so that electrical power may be transferred to a device plugged into the outlet module, and also that electrical power is transferred to the next component in the chain.",
"From the last outlet module, electrical power is then flows into the transformer module 470.As discussed with respect to FIG.",
"1, transformer module 470 steps down household electrical power to a plurality of voltages suitable for powering electronic accessories and outputs those voltages though a multi-pinned connector adapted to mate with a plurality of plugs and thereby supply the appropriate voltages to electronic accessories.",
"Electrical power then flows into USB module 480.As shown in FIG.",
"4, transformer module 470 may step household electrical power down to a 5V 2 A output for USB module 480.Alternatively, USB module 480 may contain a transformer which transforms electrical power into a voltage suitable for use in USB module 480.In such an embodiment, household electrical power would flow from transformer module 470 to USB module 480.USB module 480 may receive data from and transmit data to a personal computer or other device in the case where USB module 480 acts as a USB hub.",
"USB module 480 may provide a source of power to network module 490.Network module 490 may act as a pass-through surge suppressor or network cables, phone cables or other data feeds.",
"Alternatively, network module 490 may act as a network switch and may receive data from and transmit data to a personal computer or other device.",
"FIG.",
"5 shows a side perspective view of the module connector and module used in an embodiment of the multi-function power strip.",
"Shown in FIG.",
"5 is a switch module 110 with tabs 310 (as described with reference to FIG.",
"3), however, as set forth in the description of FIG.",
"2, module connectors 210 can be used with any of the modules described in the various embodiments of the multi-function power strip.",
"Module connector 210 has a body 500 with a first end 500a.",
"The opposite end of body 500 (not shown) is a mirror image of first end 500a.",
"Body 500 of module connector 210 can be fabricated from any suitable material known in the art, for example, plastic.",
"Apertures 510 are provided in first end body 500a and extend all the way through the body to the opposite end (not shown).",
"In such a way, the body 500 has a hollow interior formed by the apertures 510.Three apertures 510 are shown in FIG.",
"5, however, it should be apparent to one of ordinary skill in the art that any number of apertures could be used, depending on the number of connections that must be made between the modules.",
"By way of example and without limitation, the three apertures shown in FIG.",
"5 may accommodate positive, negative and ground connections between modules.",
"In applications where an additional number of connections are required, as for example in cases where data or transformed voltages are also to be transferred between modules, more apertures may be provided.",
"Body 500 may also be provided with an alignment boss 512.Alignment boss 512 mates with alignment groove 513 on the module.",
"Alignment boss 512 and alignment groove 513 ensure that the module connector 210 and the module are connected in the appropriate orientation.",
"Disposed within the apertures 510 are contacts 511.Similar contacts (not shown) are disposed on the opposite end of body 500 (not shown).",
"The contacts 511 may be made from copper or any material suitable for conducting electricity.",
"The contacts 511 mate with and form an electrical connection with the blades 514 disposed on the module.",
"The contacts 511, and the similar contacts (not shown) on the opposite end of body 500 are electrically connected.",
"The similar contacts (not shown) on the opposite end of body 500 are likewise adapted to mate with blades (not shown) on an adjacent module.",
"In this way, the contacts in the module connector 210 form an electrical connection between two adjacent modules.",
"It, will be appreciated by those of ordinary skill in the art that, while the forgoing disclosure has been set forth in connection with particular embodiments and examples, the disclosure is not intended to be necessarily so limited, and that numerous other embodiments, examples, uses, modifications and departures from the embodiments, examples and uses described herein are intended to be encompassed by the claims attached hereto.",
"Various features of the disclosure are set forth in the following claims."
]
] |
Patent_15871413
|
[
[
"SEMICONDUCTOR DEVICES AND METHODS OF MAKING THE SAME",
"In one embodiment, methods for making semiconductor devices are disclosed."
],
[
"1.A method for making a semiconductor device, the method comprising: providing a conductive substrate, the conductive substrate comprising one or more elevated regions on a first side of the conductive substrate, wherein each of the elevated regions comprises a planar surface on the first side of the conductive substrate; disposing a solder paste between at least one of the planar surfaces on the elevated regions on the conductive substrate and one or more contact pads of a semiconductor die such that each of the contacts pads has two or more linear edges that are each laterally aligned and parallel with at least one edge of the planar surfaces on the elevated regions; and reflowing the solder paste to solder at least a portion of the elevated regions to the contact pads.",
"2.The method of claim 1, wherein disposing the solder paste between at least one of the planar surfaces on the elevated regions on the conductive substrate and the one or more contact pads of the semiconductor die comprises disposing the solder paste between two or more planar surfaces on the elevated regions on the conductive substrate and the one or more contact pads.",
"3.The method of claim 1, wherein a number of the elevated regions on the first side of the conductive substrate is greater than a number of the elevated regions soldered to the contact pads of the semiconductor die.",
"4.The method of claim 1, wherein a number of the elevated regions on the first side of the conductive substrate is at least 10.5.The method of claim 1, wherein a number of the elevated regions on the first side of the conductive substrate is at least two, and wherein at least a portion of the elevated regions on the first side of the conductive substrate have different sizes.",
"6.The method of claim 1, wherein a number of the elevated regions on the first side of the conductive substrate is at least two, and wherein the elevated regions are evenly spaced along a first direction.",
"7.The method of claim 1, wherein providing the conductive substrate comprises providing a lead frame comprising the conductive substrate electrically coupled to a first lead.",
"8.The method of claim 1, wherein the elevated regions on the first side of the conductive substrate are arranged in a grid having rows and columns, each of the rows having the same number of elevated regions and each of the columns having the same number of elevated regions.",
"9.The method of claim 1, wherein the semiconductor die is a metal-oxide field-effect transistor (MOSFET).",
"10.A method for making a semiconductor device, the method comprising: providing a conductive substrate, the conductive substrate comprising a first elevated region on a first side of the conductive substrate and a second elevated region on the first side of the conductive substrate, wherein the first elevated region comprises a first planar surface on the first side of the conductive substrate, and wherein the second elevated region comprises a second planar surface on the first side of the conductive substrate; and attaching at least the first planar surface of the first elevated region to a first contact pad of a semiconductor die such that the conductive substrate is electrically coupled to the contact pad, wherein at least a portion of the second planar surface on the second elevated region is not attached to any contact pad of the semiconductor die.",
"11.The method of claim 10, wherein the first planar surface of the first elevated region has a first corner that is laterally aligned with a first corner of the first contact pad.",
"12.The method of claim 10, wherein the first planar surface of the first elevated region has different dimensions than the second planar surface of the second elevated region.",
"13.The method of claim 10, wherein the conductive substrate comprises at least 10 elevated regions.",
"14.The method of claim 10, wherein the semiconductor die is a metal-oxide field-effect transistor (MOSFET).",
"15.The method of claim 10, wherein the second planar surface of the second elevated region is not attached to the semiconductor die.",
"16.The method of claim 10, wherein only a portion of the second planar surface of the second elevated region is attached to the first contact pad of the semiconductor die, and wherein the second planar surface of the second elevated region is electrically coupled to the first contact pad of the semiconductor die.",
"17.The method of claim 10, wherein the first planar surface comprises a curved edge, and wherein the second planar surface has a polygonal shape.",
"18.The method of claim 10, wherein a first portion of the second planar surface of the second elevated region is attached to the first contact pad of the semiconductor die, and a second portion of the second planar surface of the second elevated region is attached to a second contact pad of the semiconductor die.",
"19.The method of claim 10, wherein the second planar surface of the second elevated region is laterally positioned away from a footprint of the semiconductor die.",
"20.A method for making semiconductor devices, the method comprising: providing a first conductive substrate, the first conductive substrate comprising one or more elevated regions on a first side of the first conductive substrate, wherein each of the one or more elevated regions of the first conductive substrate comprises a planar surface on the first side of the first conductive substrate; providing a second conductive substrate, the second conductive substrate comprising one or more elevated regions on a first side of the second conductive substrate, wherein each of the one or more elevated regions of the second conductive substrate comprises a planar surface on the first side of the second conductive substrate, wherein the first conductive substrate has substantially the same structure as the second conductive substrate; attaching one or more contact pads of a first semiconductor die to at least one of said one or more elevated regions on the first side of the first conductive substrate; and attaching one or more contact pads of a second semiconductor die to at least one of said one or more elevated regions on the first side of the second conductive substrate, wherein said one or more contact pads of the first semiconductor die have a different configuration than said one or more contact pads of the second semiconductor die."
],
[
"<SOH> BACKGROUND <EOH>The present application relates, in general, to electronics, and more particularly, to methods of forming packaging structure for semiconductor devices.",
"The semiconductor industry typically utilizes various methods and structures to form packages that encapsulate a semiconductor die and provide leads for electrically connecting to the semiconductor die.",
"In one type of semiconductor package, the semiconductor die is mounted between a lead frame and a clip.",
"The lower lead frame has a continuous flat surface on which the die is mounted then a clip is used to complete the electrical circuit on the top of the die.",
"This configuration may provide inaccurate positioning of the semiconductor die to the lower lead frame.",
"In addition, the same inaccurate positioning can occur with the clip.",
"During mounting of both the die and clip, solder paste is typically used between the die to lead frame and clip to die.",
"During reflow, both the die and clip may move, drift, tilt, and/or rotate, which can lower the quality and performance of the semiconductor device.",
"Accordingly, it is desirable to have techniques for mounting a semiconductor die that can reduce or eliminate drifting, tilting, or rotation.",
"It is also desirable to have techniques for mounting different semiconductor dies using the same lead frame design."
],
[
"<SOH> BRIEF DESCRIPTION OF THE DRAWINGS <EOH>Embodiments of present application will become more fully understood from the detailed description and the accompanying drawings, which are not intended to limit the scope of the present application.",
"FIG.",
"1A is a perspective view illustrating one example of a lead frame in accordance with some embodiments of the present application.",
"FIG.",
"1B is a top view one example of a lead frame in accordance with some embodiments of the present application.",
"FIG.",
"1C is a cross-sectional view of source contact pad of a lead frame in accordance with some embodiments of the present application.",
"FIGS.",
"2A and 2B are bottom and top views, respectively, illustrating one example of semiconductor die 200 in accordance with some embodiments of the present application.",
"FIG.",
"3A is a top view illustrating one example of semiconductor die 200 positioned on lead frame 100 in accordance with some embodiments of the present application.",
"FIG.",
"3B is a cross-sectional view illustrating semiconductor die 200 positioned on lead frame 100 in accordance with some embodiments of the present application.",
"FIG.",
"3C is a cross-sectional view illustrating semiconductor die 200 positioned on lead frame 100 which is orthogonal to the cross-sectional view in FIG.",
"3B in accordance with some embodiments of the present application.",
"FIG.",
"4 is a perspective view illustrating one example of semiconductor device 400 in accordance with some embodiments of the present application.",
"FIG.",
"5A is a bottom view showing one example of universal conductive clip 500 including a plurality of pedestals 510 that extend towards semiconductor die 520 in accordance with some embodiments of the present application.",
"FIG.",
"5B is a bottom view of one example of semiconductor die 521 soldered to universal conductive clip 500 in accordance with some embodiments of the present application.",
"FIG.",
"5C is a bottom view of one example of semiconductor die 522 soldered to universal conductive clip 500 in accordance with some embodiments of the present application.",
"FIG.",
"5D is a bottom view of one example of semiconductor die 523 soldered to universal conductive clip 500 in accordance with some embodiments of the present application.",
"FIG.",
"5E is a bottom view of one example of semiconductor die 524 soldered to universal conductive clip 500 in accordance with some embodiments of the present application.",
"FIG.",
"5F is a bottom view of one example of semiconductor die 525 soldered to universal conductive clip 500 in accordance with some embodiments of the present application.",
"FIG.",
"5G is a bottom view of one example of semiconductor die 526 soldered to universal conductive clip 500 in accordance with some embodiments of the present application.",
"FIG.",
"5H is a bottom view of one example of semiconductor die 527 soldered to universal conductive clip 500 in accordance with some embodiments of the present application.",
"FIG.",
"5I is a bottom view of one example of semiconductor die 528 soldered to universal conductive clip 500 in accordance with some embodiments of the present application.",
"FIG.",
"5J is a bottom view of one example of semiconductor die 529 soldered to universal conductive clip 500 in accordance with some embodiments of the present application.",
"FIG.",
"6 shows examples of the design considerations when configuring a universal conductive clip for family of semiconductor dies in accordance with some embodiments of the present application.",
"detailed-description description=\"Detailed Description\" end=\"lead\"?",
"For simplicity and clarity of the illustration, elements in the figures are not necessarily to scale, and the same reference numbers in different figures denote the same elements.",
"Additionally, descriptions and details of well-known steps and elements are omitted for simplicity of the description.",
"As used herein current carrying electrode means an element of a device that carries current through the device such as a source or a drain of an MOS transistor or an emitter or a collector of a bipolar transistor or a cathode or anode of a diode, and a control electrode means an element of the device that controls current through the device such as a gate of an MOS transistor or a base of a bipolar transistor.",
"Although the devices are explained herein as certain N-channel or P-Channel devices, or certain N-type of P-type doped regions, a person of ordinary skill in the art will appreciate that complementary devices are also possible in accordance with the present invention.",
"It will be appreciated by those skilled in the art that the words during, while, and when as used herein are not exact terms that mean an action takes place instantly upon an initiating action but that there may be some small but reasonable delay, such as a propagation delay, between the reaction that is initiated by the initial action.",
"The use of the word approximately or substantially means that a value of element has a parameter that is expected to be very close to a stated value or position.",
"However, as is well known in the art there are always minor variances that prevent the values or positions from being exactly as stated.",
"It is well established in the art that variances of up to about ten percent (10%) (and up to twenty percent (20%) for semiconductor doping concentrations) are regarded as reasonable variances from the ideal goal of exactly as described.",
"For clarity of the drawings, doped regions of device structures are illustrated as having generally straight line edges and precise angular corners.",
"However, those skilled in the art understand that due to the diffusion and activation of dopants the edges of doped regions generally may not be straight lines and the corners may not be precise angles."
],
[
"CROSS-REFERENCE TO RELATED APPLICATION This application is a continuation of U.S. application Ser.",
"No.",
"15/421,515, filed Feb. 1, 2017, which is a continuation of U.S. application Ser.",
"No.",
"15/204,117, filed Jul.",
"7, 2016, now U.S. Pat.",
"No.",
"9,576,883, which is a continuation of U.S. application Ser.",
"No.",
"14/729,234, filed Jun.",
"3, 2015, now U.S. Pat.",
"No.",
"9,397,028, which is a continuation of U.S. application Ser.",
"No.",
"13/834,612, filed Mar.",
"15, 2013, now U.S. Pat.",
"No.",
"9,070,721, which are hereby incorporated by reference in their entirety.",
"BACKGROUND The present application relates, in general, to electronics, and more particularly, to methods of forming packaging structure for semiconductor devices.",
"The semiconductor industry typically utilizes various methods and structures to form packages that encapsulate a semiconductor die and provide leads for electrically connecting to the semiconductor die.",
"In one type of semiconductor package, the semiconductor die is mounted between a lead frame and a clip.",
"The lower lead frame has a continuous flat surface on which the die is mounted then a clip is used to complete the electrical circuit on the top of the die.",
"This configuration may provide inaccurate positioning of the semiconductor die to the lower lead frame.",
"In addition, the same inaccurate positioning can occur with the clip.",
"During mounting of both the die and clip, solder paste is typically used between the die to lead frame and clip to die.",
"During reflow, both the die and clip may move, drift, tilt, and/or rotate, which can lower the quality and performance of the semiconductor device.",
"Accordingly, it is desirable to have techniques for mounting a semiconductor die that can reduce or eliminate drifting, tilting, or rotation.",
"It is also desirable to have techniques for mounting different semiconductor dies using the same lead frame design.",
"BRIEF DESCRIPTION OF THE DRAWINGS Embodiments of present application will become more fully understood from the detailed description and the accompanying drawings, which are not intended to limit the scope of the present application.",
"FIG.",
"1A is a perspective view illustrating one example of a lead frame in accordance with some embodiments of the present application.",
"FIG.",
"1B is a top view one example of a lead frame in accordance with some embodiments of the present application.",
"FIG.",
"1C is a cross-sectional view of source contact pad of a lead frame in accordance with some embodiments of the present application.",
"FIGS.",
"2A and 2B are bottom and top views, respectively, illustrating one example of semiconductor die 200 in accordance with some embodiments of the present application.",
"FIG.",
"3A is a top view illustrating one example of semiconductor die 200 positioned on lead frame 100 in accordance with some embodiments of the present application.",
"FIG.",
"3B is a cross-sectional view illustrating semiconductor die 200 positioned on lead frame 100 in accordance with some embodiments of the present application.",
"FIG.",
"3C is a cross-sectional view illustrating semiconductor die 200 positioned on lead frame 100 which is orthogonal to the cross-sectional view in FIG.",
"3B in accordance with some embodiments of the present application.",
"FIG.",
"4 is a perspective view illustrating one example of semiconductor device 400 in accordance with some embodiments of the present application.",
"FIG.",
"5A is a bottom view showing one example of universal conductive clip 500 including a plurality of pedestals 510 that extend towards semiconductor die 520 in accordance with some embodiments of the present application.",
"FIG.",
"5B is a bottom view of one example of semiconductor die 521 soldered to universal conductive clip 500 in accordance with some embodiments of the present application.",
"FIG.",
"5C is a bottom view of one example of semiconductor die 522 soldered to universal conductive clip 500 in accordance with some embodiments of the present application.",
"FIG.",
"5D is a bottom view of one example of semiconductor die 523 soldered to universal conductive clip 500 in accordance with some embodiments of the present application.",
"FIG.",
"5E is a bottom view of one example of semiconductor die 524 soldered to universal conductive clip 500 in accordance with some embodiments of the present application.",
"FIG.",
"5F is a bottom view of one example of semiconductor die 525 soldered to universal conductive clip 500 in accordance with some embodiments of the present application.",
"FIG.",
"5G is a bottom view of one example of semiconductor die 526 soldered to universal conductive clip 500 in accordance with some embodiments of the present application.",
"FIG.",
"5H is a bottom view of one example of semiconductor die 527 soldered to universal conductive clip 500 in accordance with some embodiments of the present application.",
"FIG.",
"5I is a bottom view of one example of semiconductor die 528 soldered to universal conductive clip 500 in accordance with some embodiments of the present application.",
"FIG.",
"5J is a bottom view of one example of semiconductor die 529 soldered to universal conductive clip 500 in accordance with some embodiments of the present application.",
"FIG.",
"6 shows examples of the design considerations when configuring a universal conductive clip for family of semiconductor dies in accordance with some embodiments of the present application.",
"For simplicity and clarity of the illustration, elements in the figures are not necessarily to scale, and the same reference numbers in different figures denote the same elements.",
"Additionally, descriptions and details of well-known steps and elements are omitted for simplicity of the description.",
"As used herein current carrying electrode means an element of a device that carries current through the device such as a source or a drain of an MOS transistor or an emitter or a collector of a bipolar transistor or a cathode or anode of a diode, and a control electrode means an element of the device that controls current through the device such as a gate of an MOS transistor or a base of a bipolar transistor.",
"Although the devices are explained herein as certain N-channel or P-Channel devices, or certain N-type of P-type doped regions, a person of ordinary skill in the art will appreciate that complementary devices are also possible in accordance with the present invention.",
"It will be appreciated by those skilled in the art that the words during, while, and when as used herein are not exact terms that mean an action takes place instantly upon an initiating action but that there may be some small but reasonable delay, such as a propagation delay, between the reaction that is initiated by the initial action.",
"The use of the word approximately or substantially means that a value of element has a parameter that is expected to be very close to a stated value or position.",
"However, as is well known in the art there are always minor variances that prevent the values or positions from being exactly as stated.",
"It is well established in the art that variances of up to about ten percent (10%) (and up to twenty percent (20%) for semiconductor doping concentrations) are regarded as reasonable variances from the ideal goal of exactly as described.",
"For clarity of the drawings, doped regions of device structures are illustrated as having generally straight line edges and precise angular corners.",
"However, those skilled in the art understand that due to the diffusion and activation of dopants the edges of doped regions generally may not be straight lines and the corners may not be precise angles.",
"DETAILED DESCRIPTION The following description of embodiment(s) is merely illustrative in nature and is in no way intended to limit the invention, its application, or uses.",
"The present application includes, among other things, a method of making a semiconductor device including: providing a conductive substrate, the conductive substrate comprising one or more elevated regions on a first side of the conductive substrate, wherein each of the elevated regions comprises a planar surface on the first side of the conductive substrate; disposing a solder paste between at least one of the planar surfaces on the elevated regions on the conductive substrate and one or more contact pads of a semiconductor die such that each of the contacts pads has three or more linear edges that are each laterally aligned and parallel with at least one edge of the planar surfaces on the elevated regions; and reflowing the solder paste to solder at least a portion of the elevated regions to the contact pads.",
"FIG.",
"1A is a perspective view illustrating one example of lead frame 100 in accordance with some embodiments of the present application.",
"Lead frame 100 includes source contact 110, gate contact 120, and drain contact 130.Source contact 110 includes pedestals 140 (also referred to as standoffs or elevated regions) disposed on one side of source contact 110.Lead frame 100 may be formed, for example, by etching or stamping a copper or copper-alloy sheet.",
"FIG.",
"1B is a top view of lead frame 100.It will be appreciated that during typical packaging processes, the lead frame and its various contacts (e.g., source contact 110) may be interconnected in an array of lead frames that can be singulated into individual packages during processing.",
"The dashed line in FIG.",
"1B depicts cuttings lines where lead frame 100 can be separated using standard techniques, such as dicing or punching.",
"FIG.",
"1C is a cross-sectional view of source contact pad 110 in lead frame 100.Pedestals 140 can be isolated by trenches 150 between pedestals 140.Pedestals 140 each have planar surfaces on the same side of lead frame 100.As discussed further below, the pedestals can be configured to align with contact pads on a semiconductor die.",
"The height of the pedestals (e.g., pedestals 140) can be, in some embodiments, at least about 30% of a thickness of the contact.",
"For example, the source contact may be formed from a copper sheet having a thickness of about 10 mils, and therefore the height of the pedestals can be at least about 3 mils.",
"In some embodiments, the pedestals can have a height of at least about 50% of a thickness of the contact.",
"In some embodiments, the pedestals can, in some embodiments, have a height of at least about 3 mils or at least about 5 mils.",
"The distance between the pedestals (e.g., the width of trenches 150) can be, in some embodiments, at least about the height of the pedestals.",
"In some embodiments, the distance between the pedestals can be at least about 30% of a thickness of the contact or at least about 50% of a thickness of the contact.",
"The distance between the pedestals can be, for example, at least about 3 mils or at least about 5 mils.",
"The shape of the pedestals is not particularly limited.",
"The top surface of the pedestals may, for example, have a polygonal surface, such as a square, a rectangle, or a triangle.",
"In some embodiments, the top surface of each of the pedestals can include at least one linear edge (e.g., one, two, three, four or more linear edges).",
"For example, as shown in FIG.",
"1B pedestals 140 can be rectangular having four linear edges.",
"The pedestals may also include at least one curved edge, for example, to accommodate an adjacent gate contact.",
"FIGS.",
"2A and 2B are bottom and top views, respectively, illustrating one example of semiconductor die 200 in accordance with some embodiments of the present application.",
"Semiconductor die 200 includes source contact pads 210 and gate contact pad 220 on one side.",
"Semiconductor die 200 also includes drain contact pad 230 on a side of semiconductor die 200 opposite source contact pads 210.Semiconductor die 200 may be configured, for example, as a MOSFET.",
"Source contact pads 210 can be configured so that each of the contact pads can be soldered to a pedestal on a source contact of a lead frame (e.g., pedestals 140 on source contact 110 of lead frame 100).",
"For example, each of source contact pads 210 may have the same shape and dimensions as a corresponding pedestal in pedestals 140 on source contact 110.Semiconductor die 200 may have the bottom surface placed over lead frame 100 such that each of source contact pads 210 align with one of pedestals 140.Similarly, gate contact pad 210 on semiconductor die 200 may align with gate contact 120 of lead frame 100.FIG.",
"3A shows a top view illustrating one example of semiconductor die 200 positioned on lead frame 100 in accordance with some embodiments of the present application.",
"Semiconductor die 200 is shown with dashed lines and is positioned over lead frame 100 so that source contact pads 210 can be aligned over pedestals 140.Each of the pedestals from pedestals 140 include four linear edges that are laterally aligned and parallel with four linear edges of each contact pad in contact pads 210.",
"(The right-most pedestal of pedestals 140 also includes a curved edge that is laterally aligned with a curved edge of the right-most source contact pad of source contact pads 210.)",
"Gate contact pad 220 is also aligned over gate contact 120.The pedestals can be soldered to the source contact pads to electrically couple source contact 110 to source contact pads 220.FIG.",
"3B show a cross-sectional view illustrating semiconductor die 200 positioned on lead frame 100 in accordance with some embodiments of the present application.",
"Solder paste 300 can be disposed between each of contact source pads 220 and pedestals 140.The solder paste may be applied such that trenches 150 are substantially free of solder paste.",
"For example, solder paste 300 can be selectively applied to pedestals 140 before positioning semiconductor die 200 on lead frame 100 so that solder paste 300 is sandwiched between source contact pads 210 and pedestals 140.Solder paste may similarly be disposed between gate contact pad 220 and gate contact 120.The amount of solder paste applied between the pedestals and the contact pads is not particularly limited.",
"Generally, the amount of solder paste applied is effective to electrically couple the contact pad to the conductive surface (e.g., the lead frame) and also effective such that the solder paste does not bridge between the pedestals during reflow.",
"In some embodiments, the solder paste is evenly applied as a layer to the portions of the pedestal or contact pad to be soldered during reflow.",
"In some embodiments, the solder paste is applied as a layer having a thickness about 0.003 inches to about 0.006 inches.",
"Pedestals 140 can be soldered to source contact pads 210 by heating the semiconductor die and lead frame to perform reflow.",
"In some embodiments, during reflow, the solder paste is maintained between the pedestals and the contact pads.",
"That is, the solder paste does not flow into the trenches surrounding the pedestals.",
"Similarly, the separate layers of solder paste disposed between each pair of contact pad and pedestal can remain spaced apart during reflow.",
"In other words, layers of solder paste do not flow into a trench adjacent to both of the layers such that the solder paste from separate layers contact each other.",
"Applicants have discovered that by soldering the pedestals to the contact pads, drifting, tilting, or rotation during reflow can be reduced or eliminated.",
"Without being bound to any particular theory, it is believed that, by aligning edges of the pedestals with edges of the contact pads, the solder's surface tension and wet adhesion properties during reflow can maintain the pedestals aligned with the contact pads.",
"This in turn limits or prevents the semiconductor die from rotating, tilting, or drifting during reflow.",
"Accordingly, in some embodiments, each contact pad that is soldered to a pedestal will have two or more linear edges that are each laterally aligned and parallel with a linear of edge of a pedestal that is soldered to the contact pad.",
"In some embodiments, each contact pad that is soldered to a pedestal will have three or more linear edges that are each laterally aligned and parallel with a linear of edge of a pedestal that is soldered to the contact pad.",
"In some embodiments, each contact pad that is soldered to a pedestal will have four or more linear edges that are each laterally aligned and parallel with a linear of edge of a pedestal that is soldered to the contact pad.",
"In some embodiments, each contact pad that is soldered to a pedestal will have two or more corners that are each laterally aligned with a corner of a pedestal that is soldered to the contact pad.",
"In some embodiments, each contact pad that is soldered to a pedestal will have three or more corners that are each laterally aligned with a corner of a pedestal that is soldered to the contact pad.",
"In some embodiments, each contact pad that is soldered to a pedestal will have four or more corners that are each laterally aligned with a corner of a pedestal that is soldered to the contact pad.",
"As will be discussed further below, a single contact pad may optionally be soldered to two or more pedestals (e.g., two, three, four, five, six, or more pedestals).",
"Thus, different linear edges of the same contact pad can be laterally aligned and parallel to edges of different pedestals.",
"As an example, a rectangular contact pad can be soldered to two square pedestals.",
"The rectangular contact pad may have two linear edges that are laterally aligned and parallel with two linear edges of the first square pedestal.",
"The other two linear edges of the rectangular contact pad can be laterally aligned and parallel with two linear edges of the second square pedestal.",
"Thus, in this specific example, all four linear edges of the rectangular contact pad are laterally aligned and parallel with linear edges found in two different pedestals.",
"Moreover, each of the square pedestals includes two linear edges that are not laterally aligned with a linear edge of the rectangular contact pad.",
"This example configuration may provide suitable adhesion to prevent drifting, tilting, or rotation during reflow.",
"In some embodiments, at least two contact pads are each separately soldered to two or more pedestals.",
"For example, a first contact pad (e.g., a source contact pad) of a semiconductor die can be soldered to a first pedestal of a contact (e.g., a source contact) on a lead frame and a second pedestal of the contact on the lead frame, and a second contact pad of the semiconductor die can be soldered to a third pedestal of the contact on the lead frame and a fourth pedestal of the contact on the lead frame.",
"Drain contact pad 230 on semiconductor die 200 may be electrically coupled to drain contacts 130 on lead frame 100 using various techniques.",
"For example, drain contact pad 230 can be wire bonded to drain contacts 130.In some embodiments, drain contact pad 230 can be electrically coupled to drain contacts 130 by a conductive clip.",
"The conductive clip may be soldered to both drain contact pad 230 and drain contacts 130.FIG.",
"3C is a cross-sectional view illustrating semiconductor die 200 positioned between lead frame 100 and conductive clip 310.The cross-sectional view in FIG.",
"3C is orthogonal to the cross-sectional view in FIG.",
"3B.",
"The bottom face of conductive clip 310 can be soldered to drain contact pad 230 using solder paste 320.Conductive clip 310 has a U-shaped configuration such that both ends can be soldered to drain contacts 130 in lead frame 100 using solder paste 330.By soldering conductive clip 310 to both drain contacts 130 and drain contact pad 230, drain contact 130 can be electrically coupled to drain contact pad 230.As shown in FIG.",
"3C, gate contact 120 can be soldered to gate contact pad 210 using solder paste 340.Gate contact 120 may be soldered to gate contact pad 210 at about the same time as performing reflow to solder source contact pad 220 to source contact 110.The conductive clip can be soldered to the contact pad (e.g., a gate contact pad) and contact on the lead frame (e.g., a gate contact) using generally the same techniques as described above.",
"For example, solder paste can be applied to the gate contact pad and gate contacts, and then the conductive clip can positioned to contact the solder paste before performing reflow.",
"The reflow for soldering the conductive clip may be performed before, after, or at about the same time as performing reflow to solder the semiconductor die to the lead frame.",
"As discussed above, the pedestals on the lead frame can reduce or prevent drifting, tilting, or rotation during reflow.",
"The pedestals may also be used to prevent or reduce drifting, tilting, or rotation when soldering any conductive substrate (e.g., a conductive clip or a lead frame) to a contact pad on a semiconductor die.",
"FIG.",
"4 is a perspective view illustrating one example of semiconductor device 400 in accordance with some embodiments of the present application.",
"Semiconductor device 400 can include source contact 410 soldered to conductive clip 420.Conductive clip 420 has pedestals 425 which extend from the side of conductive clip 420 that faces semiconductor die 430.Pedestals 425 can be soldered to source contact pads 435 on semiconductor die 430 such that source contact 410 is electrically coupled to source contact pads 435.As shown, four linear edges of the contact pads that are soldered to the pedestals are each laterally aligned and parallel with a linear of edge of a pedestal that is soldered to the contact pad.",
"The pedestals on the conductive clip may therefore reduce or prevent drifting, tilting, or rotation during reflow.",
"Drain contact 440 can be soldered to drain contact pads (not shown) on a side of semiconductor die 430 opposite source contact pads 435.Gate contact 450 is soldered to conductive clip 460.Gate contact pad 470 on semiconductor die 430 is also soldered to conductive clip 460 such that gate contact 470 is electrically coupled to gate contact pad 470.The pedestals on a conductive substrate (e.g., pedestals 425 on conductive clip 420) can generally have the same characteristics as discussed above with regard to pedestals on a lead frame (e.g., pedestals 140 on lead frame 100).",
"For example, the height of the pedestals may be about half of the thickness of the conductive clip.",
"As another example, the number of pedestals on the conductive substrate is not limited, and may be, for example, one or more pedestals (e.g., one, two, three, four, five, ten, fifteen, twenty, or more pedestals on the conductive substrate).",
"In some embodiments, at least one contact pad (e.g., one, two, three, four, or more contact pads) on the semiconductor die is soldered to two or more pedestals (e.g., two, three, four, five, or more pedestals) on the conductive substrate.",
"Semiconductor device 400 may generally be assembled using the same techniques as described above.",
"Solder paste can be applied to the drain contact and then the drain contact is soldered to the drain contact pad on the semiconductor die by performing reflow.",
"Solder paste may then be applied to the source contact pad, gate contact pad, source contact, and gate contact before positioning the conductive clips over the semiconductor die and lead frame.",
"Reflow can be performed to solder the conductive clip.",
"In some embodiments, the semiconductor die's contact pads are soldered to the lead frame and conductive clips at about the same time.",
"The semiconductor devices disclosed in the present application (e.g., semiconductor device 400) may be at least partially encapsulated in a molding material (e.g., a resin).",
"In some embodiments, the molding material can fill the trenches between the pedestals.",
"Portions of the lead frame and/or conductive clip may be exposed for electrically coupling the semiconductor die to, for example, a printed circuit board.",
"Some embodiments disclosed herein relate to a conductive substrate that is configured to operably couple with two or more different semiconductor die designs (e.g., two, three, four, five, or more semiconductor die designs).",
"Typically, each lead frame or conductive clip is customized for soldering to a specific semiconductor die design.",
"Thus, each semiconductor die design requires a different lead frame design that must be manufactured or stocked at manufacturing facilities.",
"The present application includes a universal lead frame and/or universal conductive clip that may be used with various kinds of semiconductor die designs.",
"This may reduce the number of different lead frames that must be manufactured or stocked at manufacturing facilities.",
"FIGS.",
"5A-J are bottom views illustrating one example of universal conductive clip 500 soldered to various semiconductor dies in accordance with some embodiments of the present application.",
"Referring to FIG.",
"5A, universal conductive clip 500 includes a plurality of pedestals 510 that extend towards semiconductor die 520.Semiconductor die 520 has contact pads 530 on one side that are each soldered to two or more pedestals of pedestals 510.The upper-left contact pad is soldered to two pedestals.",
"The upper-left contact pad has two linear edges that are each laterally aligned and parallel with an edge on the upper-left pedestal that is soldered to the upper-left contact pad.",
"The upper-left contact pad and upper-left pedestal each have curved edges that are laterally aligned.",
"The curved edges are shaped to accommodate contact pad 540 which can be electrically coupled to a separate conductive clip (not shown).",
"The upper-left contact pad is also soldered to a second pedestal below the upper-left pedestal.",
"Only a portion of the top surface of the second pedestal is soldered to the upper-left contact pad.",
"Two edges of the second pedestal are each laterally aligned and parallel with an edge of the upper-left contact pad.",
"During manufacturing, solder paste can be selectively applied to the top surface of the second pedestal (and any other pedestal having only a portion of the top surface soldered to a contact pad) at portions that will contact a contact pad.",
"Each of contact pads 530 in FIG.",
"5A have two or more edges that are each laterally aligned and parallel with an edge of a pedestal.",
"The number of pedestals soldered to each contact pad varies: the upper-left and lower-left contact pads are each soldered to two pedestals, the upper-right and lower-right contact pads are each soldered to four pedestals.",
"Each of the contact pads has only a portion of their surface area soldered to the pedestals.",
"The portions of the contact pads disposed over trenches between the pedestal can, in some embodiments, be unsoldered.",
"The total surface area of each contact pad that is soldered to a pedestal can be, for example, at least about 40%, at least about 50%, at least about 75%, or at least about 90%.",
"The total surface area of each contact pad that is soldered to a pedestal can be, for example, no more than about 100%, no more than about 95%, no more than about 90%, no more than about 80%, or no more than about 70%.",
"In some embodiments, the total surface area of each contact pad that is soldered to a pedestal is about 40% to about 100%, or about 50% to about 95%.",
"Eight of the pedestals in pedestals 510 depicted in FIG.",
"5A are not soldered to a contact pad.",
"As will be discussed further below, these unsoldered pedestals are designed for a different semiconductor die.",
"Four of the pedestals are laterally positioned away from the footprint of semiconductor die 520.In other words, four of the pedestals are not covered by semiconductor die 520.Another four of the pedestals are only partially covered by semiconductor die 520.FIG.",
"5B shows semiconductor die 521 soldered to universal conductive clip 500.Semiconductor die 521 has a different footprint and contact pad configuration relative to semiconductor die 520.However, contact pad 540 (e.g., a gate contact pad) has the same configuration in both semiconductor dies.",
"Each of contact pads 531 are soldered to four pedestals of pedestals 510.As shown, each of contact pads 531 have four edges that are each laterally aligned and parallel with edges on the pedestals soldered to the contact pads.",
"Each of the eight pedestals that are soldered have their entire top surface soldered to the contact pads.",
"Twelve pedestals remain unsoldered to semiconductor die 531: ten are uncovered by the footprint of semiconductor die 531, while two are partially covered by the footprint of semiconductor die 531.FIG.",
"5C shows semiconductor die 522 soldered to universal conductive clip 500.Semiconductor die 522 has a different footprint and contact pad configuration.",
"However, contact pad 540 (e.g., a gate contact pad) has the same configuration relative to semiconductor die 520.The left contact pad of contact pads 532 is soldered to two pedestals of pedestals 510.The right contact pad of contact pads 532 is soldered to four pedestals of pedestals 510.The pedestals soldered to the left contact pad have their entire top surface soldered to the left contact pad.",
"Two of the pedestals soldered to the right contact pad have only a portion of their top surface soldered to the right contact pad.",
"Two of the pedestals soldered to the right contact pad have their entire top surface soldered to the right contact pad.",
"Fourteen pedestals remain unsoldered to semiconductor die 522: twelve are uncovered by the footprint of semiconductor die 522, while two are partially covered by the footprint of semiconductor die 522.FIG.",
"5D shows semiconductor die 523 soldered to universal conductive clip 500.Semiconductor die 523 has a different footprint and contact pad configuration.",
"However, contact pad 540 (e.g., a gate contact pad) has the same configuration relative to semiconductor die 520.The left-most contact pad of contact pads 533 is soldered to six pedestals of pedestals 510.The pedestals soldered to the left-most contact pad have their entire top surface soldered to the left-most contact pad.",
"The right-most contact pad of contact pads 533 is soldered to four pedestals of pedestals 510.Two of the pedestals soldered to the right-most contact pad have their entire top surface soldered to the right-most contact pad.",
"Two of the pedestals soldered to the right-most contact pad have only a portion of their top surface soldered to the right-most contact pad.",
"Fourteen pedestals remain unsoldered to semiconductor die 523: twelve are uncovered by the footprint of semiconductor die 523, while two are partially covered by the footprint of semiconductor die 523.FIG.",
"5E shows semiconductor die 524 soldered to universal conductive clip 500.Semiconductor die 524 has a different footprint and contact pad configuration.",
"However, contact pad 540 (e.g., a gate contact pad) has the same configuration relative to semiconductor die 520.Semiconductor die 524 has two contact pads in contact pads 534 which are each soldered to four pedestals.",
"FIG.",
"5F shows semiconductor die 525 soldered to universal conductive clip 500.Semiconductor die 525 has a different footprint and contact pad configuration.",
"However, contact pad 540 (e.g., a gate contact pad) has the same configuration relative to semiconductor die 520.Semiconductor die 525 has three contact pads in contact pads 534.All twenty of pedestals 510 are soldered to contact pads 535.In some embodiments, semiconductor die 535 may be the largest semiconductor die that can be accommodated on universal conductive clip 500.FIG.",
"5G shows semiconductor die 526 soldered to universal conductive clip 500.Semiconductor die 526 has a different footprint and contact pad configuration.",
"However, contact pad 540 (e.g., a gate contact pad) has the same configuration relative to semiconductor die 520.Semiconductor die 526 has two contact pads in contact pads 536 which are each soldered to two pedestals.",
"FIG.",
"5H shows semiconductor die 527 soldered to universal conductive clip 500.Semiconductor die 527 has a different footprint and contact pad configuration.",
"However, contact pad 540 (e.g., a gate contact pad) has the same configuration relative to semiconductor die 520.Semiconductor die 527 has contact pad 537 which is soldered to three pedestals.",
"FIG.",
"5I shows semiconductor die 528 soldered to universal conductive clip 500.Semiconductor die 528 has a different footprint and contact pad configuration.",
"However, contact pad 540 (e.g., a gate contact pad) has the same configuration relative to semiconductor die 520.Semiconductor die 528 has two contact pads in contact pads 538: a left-most contact pad soldered to six pedestals and a right-most contact pad soldered to nine pedestals.",
"The left-most and right-most contact pads are both soldered to three common pedestals positioned between the contact pads.",
"The portions of the common pedestals between the contact pads are not soldered.",
"For example, solder paste may be selectively applied to only portions of the top surfaces of the common pedestals that contact the contact pads.",
"The portions having soldering past applied can then be soldered by performing reflow.",
"FIG.",
"5J shows semiconductor die 529 soldered to universal conductive clip 500.Semiconductor die 529 has a different footprint and contact pad configuration.",
"However, contact pad 540 (e.g., a gate contact pad) has the same configuration relative to semiconductor die 520.Semiconductor die 529 has three contact pads in contact pads 539.The left-most contact pad is soldered to three pedestals, the middle contact pad is soldered to six pedestals, and the right-most contact pad is soldered to six pedestals.",
"The configuration of the conductive clip will vary depending on the family of semiconductor dies that are desired to be attached.",
"The size, shape, and spacing of the pedestals can be readily modified to accommodate a family of different semiconductors.",
"In some embodiments, the universal conductive clip can be configured to align certain corners on the contact pads in each semiconductor die in the family.",
"For example, the corners on the contact pads closest to a corner of the semiconductor die may be laterally aligned with corners on the pedestals.",
"In some embodiments, two, three, or four of the closest corners are laterally aligned with the pedestals.",
"Similarly, edges of the contact pads that form a corner closest to a corner of the semiconductor die can be laterally aligned and parallel with an edge of a pedestal.",
"In some embodiments, two, three, or four pairs of linear edges of the contact pads that form a corner closest to a corner of the semiconductor die can be laterally aligned and parallel with an edge of a pedestal.",
"FIGS.",
"5A-J each demonstrate a configuration where four corners of the contacts pads closest to the corners of the semiconductor die are laterally aligned.",
"FIGS.",
"5A-J each demonstrate having three pairs of linear edges of the contact pads that form a corner closest to a corner of the semiconductor die that are laterally aligned and parallel with an edge of a pedestal (the corners closest to contact pad 540 are not formed by two linear edges).",
"FIG.",
"6 shows examples of the design consideration when configuring a universal conductive clip in accordance with some embodiments of the present application.",
"Conductive clip 600 can have first pedestal 605, second pedestal 610, third pedestal 615, and fourth pedestal 620 at the outer corners of the array of pedestals.",
"The positioning at outer corners can be selected to accommodate the largest contact pad footprint in the semiconductor die family.",
"The pedestals at the outer corners may be configured so that the outer edges are laterally aligned and parallel with contact pads (e.g., as depicted in FIG.",
"5F the outer corner pedestals on conductive clip 500 are soldered to contact pads 535 on semiconductor die 525 so that the outer edges are laterally aligned and parallel).",
"Width 625 of the left-most column of pedestals (including first pedestal 605 and fourth pedestal 620) can be based on the smallest width of a contact pad in the family.",
"For example, the width of the left-most column of pedestals in universal conductive clip 500 corresponds to the width of the left-most contact pads in semiconductor die 525 and semiconductor die 529.Height 630 of the upper-most row of pedestals can be based on the smallest height of a contact pad in the family.",
"For example, the height of the upper-most row of pedestals in universal conductive clip 500 corresponds to the height of contact pads 536 and contact pads 537 in semiconductor die 526 and semiconductor die 527, respectively.",
"Pitch 635 and height 640 can be determined by analyzing the intermediate-sized semiconductor dies in the family (e.g., semiconductor die 523 and the like for conductive clip 500 as depicted in FIGS.",
"5A-J) The universal design for the universal conductive clip described above may similarly be applied to other conductive substrates, such as a lead frame.",
"Thus, some embodiments disclosed herein include a universal lead frame having two or more pedestals that can accommodate different-sized semiconductor dies.",
"The universal lead frame may generally have the same characteristics as the universal conductive clip described above (e.g., universal conductive clip 500 as depicted in FIGS.",
"5A-J).",
"In some embodiments, a semiconductor die can be soldered to the lead frame such that at least a portion of the pedestals are not soldered to a contact pad.",
"In some embodiments, a semiconductor die can be soldered to the lead frame such that at least a portion of the unsoldered pedestals are not covered by the footprint of the semiconductor die.",
"Some embodiments disclosed herein include a kit for manufacturing semiconductor devices.",
"The kit can include two or more different semiconductor dies having different contact pad configurations.",
"The kit can include a universal conductive substrate (e.g., a universal lead frame or a universal conductive clip) that is configured to be soldered to the semiconductor dies.",
"The universal conductive substrate can include pedestals configured so that each of the semiconductor dies can have contact pads operably coupled to the pedestals.",
"As an example, the kit can include conductive clip 500 and semiconductor dies 520-529 as depicted in FIGS.",
"5A-J.",
"In some embodiments, the pedestals on the universal conductive substrate are configured so that two, three, or four of the closest corners on the contact pads (the corners on the contacts pads closest to the corners on the semiconductor die) for each of the semiconductor dies are laterally aligned with the pedestals.",
"In some embodiments, two, three, or four pairs of linear edges of the contact pads that form the closest corners for each of the semiconductor dies can be laterally aligned and parallel with an edge pair of a pedestal.",
"Some embodiments disclosed herein include a method of making a semiconductor die.",
"The method may be used, for example, to prepare any of the semiconductor devices disclosed in the present application (e.g., semiconductor device 400 as depicted in FIG.",
"4).",
"The method can include providing a conductive substrate (e.g., lead frame 100 as depicted in FIG.",
"1A).",
"The conductive substrate can include one or more pedestals on a first side of the conductive substrate, wherein each of the pedestals comprises a planar surface on the first side of the conductive substrate (e.g., pedestals 140 as depicted in FIG.",
"1A).",
"The method may also include disposing a solder paste between at least one of the planar surfaces on the pedestals on the conductive substrate and one or more contact pads of a semiconductor die such that each of the contacts pads has two or more linear edges that are each laterally aligned and parallel with at least one edge of the planar surfaces on the pedestals (e.g., solder paste 300 and soldering past 340 are applied as depicted in FIGS.",
"3B-C).",
"The method can also include reflowing the solder paste to solder at least a portion of the pedestals to the contact pads.",
"From all the foregoing one skilled in the art can determine that according to one embodiment, a semiconductor device comprises: a lead frame comprising a first contact electrically coupled to a first lead, wherein the first contact comprises one or more elevated regions on a first side of the first contact, wherein each of the elevated regions comprises a planar surface on the first side of the first contact; a semiconductor die comprising one or more first contact pads, a second contact pad, and a third contact pad, wherein the first contact pads are disposed on a first side of the semiconductor die, and wherein each of the first contact pads are soldered to at least one of the elevated regions such that each of the first contacts pads has two or more linear edges that are each laterally aligned and parallel with at least one edge of the planar surfaces on the elevated regions; a second lead electrically coupled to the second contact pad of the semiconductor die; and a third lead electrically coupled to the third contact pad of the semiconductor die.",
"From all the foregoing one skilled in the art can determine that according to one embodiment, a semiconductor device comprises: a lead frame comprising a first contact electrically coupled to a first lead of the semiconductor device; a conductive clip electrically coupled to a second lead on the semiconductor device, wherein the conductive clip comprises one or more elevated regions on a first side of the conductive clip, wherein each of the elevated regions comprises a planar surface on the first side of the conductive clip; and a semiconductor die comprising: a first contact pad on a first side of the semiconductor die, wherein the first contact pad is soldered to the first contact on the lead frame; one or more second contact pads on a second a side of the semiconductor die, wherein each of the second contact pads are soldered to at least one of the elevated regions on the first side of the conductive clip such that each of the second contacts pads has two or more linear edges that are each laterally aligned and parallel with at least one edge of the planar surfaces on the elevated regions; and a third contact pad on the semiconductor die, wherein the third contact pad is electrically coupled to a third lead of the semiconductor device.",
"From all the foregoing one skilled in the art can determine that according to one embodiment, a method of making a semiconductor device comprises: providing a conductive substrate, the conductive substrate comprising one or more elevated regions on a first side of the conductive substrate, wherein each of the elevated regions comprises a planar surface on the first side of the conductive substrate; disposing a solder paste between at least one of the planar surfaces on the elevated regions on the conductive substrate and one or more contact pads of a semiconductor die such that each of the contacts pads has two or more linear edges that are each laterally aligned and parallel with at least one edge of the planar surfaces on the elevated regions; and reflowing the solder paste to solder at least a portion of the elevated regions to the contact pads.",
"In view of all of the above, it is evident that a novel device and method is disclosed.",
"Included, among other features, are conductive substrates, such as a lead frame or conductive clip, having elevated regions that can reduce or prevent drifting, tilting, or rotation during reflow.",
"Furthermore, universal conductive substrates configured to be operably soldered to different semiconductor dies are disclosed.",
"While the subject matter of the invention is described with specific preferred embodiments and example embodiments, the foregoing drawings and descriptions thereof depict only typical embodiments of the subject matter and are not therefore to be considered to be limiting of its scope, it is evident that many alternatives and variations will be apparent to those skilled in the art.",
"For example, the subject matter has been described with respect to particular transistor configurations for the semiconductor die, however various different integrated circuits may also be used.",
"As another example, the subject matter has been described with respect to soldering contact pads to conductive substrates, however other techniques for electrically coupling the contact pads to the conductive substrate may also be used.",
"As the claims hereinafter reflect, inventive aspects may lie in less than all features of a single foregoing disclosed embodiment.",
"Thus, the hereinafter expressed claims are hereby expressly incorporated into this Detailed Description, with each claim standing on its own as a separate embodiment of an invention.",
"Furthermore, while some embodiments described herein include some but not other features included in other embodiments, combinations of features of different embodiments are meant to be within the scope of the invention, and form different embodiments, as would be understood by those skilled in the art."
]
] |
Patent_15871414
|
[
[
"CONTENT DELIVERY NETWORK WITH DEEP CACHING INFRASTRUCTURE",
"Embodiments herein include methods and systems for use in delivering resources to a client device over a local network.",
"An exemplary system comprises a plurality of caching devices operable to cache resources on behalf of a plurality of content providers, and a local caching device communicatively situated between an access network and the client device, wherein the access network is communicably situated between the plurality of caching devices and the local caching device.",
"The local caching device is operable to retrieve a requested resource from at least one of the plurality of caching devices, deliver the requested resource to the client device over the local network, and store the requested resource for future requests by other client devices."
],
[
"1.A system comprising: a redirection server; and a plurality of caching devices situated within a wireless network, wherein the redirection server is operable to receive a request for a resource originating from a wireless client device connected to the wireless network, wherein the redirection server is further operable to select at least one of the plurality of caching devices to deliver the requested resource to the wireless client device, wherein the selected at least one caching device is operable to initiate delivery of the requested resource to the wireless client device from within the wireless network.",
"2.The system as recited in claim 1, wherein the plurality of caching devices are further operable to retrieve the requested resource from one or more content delivery network (CDN) caching devices communicatively coupled with the wireless network.",
"3.The system as recited in claim 1, wherein the step of selecting at least one of the plurality of caching devices to deliver the requested resource to the wireless client device is based on at least one of: whether a caching device has the requested resource; proximity of the caching device to the wireless client device; and wireless network conditions.",
"4.The system as recited in claim 1, wherein the redirection server is operable to redirect the wireless client to the at least one selected caching device for delivery of the requested resource.",
"5.The system as recited in claim 4, wherein the request is a Domain Name System (DNS) request.",
"6.The system as recited in claim 4, wherein the request is an application protocol request.",
"7.The system as recited in claim 6, wherein the application protocol request is a Hyper Text Transfer Protocol (HTTP) request.",
"8.The system as recited in claim 1, wherein the redirection server is situated within the wireless network.",
"9.The system as recited in claim 1, wherein at least one of the plurality of caching devices is locally proximate to the wireless client device and is operable to wirelessly delivery the requested resource to the wireless client device.",
"10.The system as recited in claim 9, wherein the locally proximate caching device is operable to retrieve the requested resource from one or more content delivery network (CDN) caching devices communicatively coupled with the wireless network.",
"11.The system as recited in claim 9, wherein the locally proximate caching device is a Wi-Fi hotspot.",
"12.The system as recited in claim 1, wherein at least one of the plurality of caching devices is situated within at least one of a cellular core network and a radio access network of the wireless network.",
"13.The system as recited in claim 1, wherein at least one of the plurality of caching devices is proximately situated with at least one of a radio network controller (RNC), a serving general packet radio service (GPRS) support node (SGSN), and a gateway GPRS support node (GGSN) of the wireless network.",
"14.A method comprising: at a redirection server, receiving a request for a resource originating from a wireless client device connected to a wireless network; selecting at least one caching device from a plurality of caching devices to deliver the requested resource to the wireless client device; and by the selected at least one caching device, initiating delivery of the requested resource to the wireless client device from within the wireless network.",
"15.The method as recited in claim 14, wherein the step of selecting at least one caching device from a plurality of caching devices to deliver the requested resource to the wireless client device is based on at least one of: whether a caching device has the requested resource; proximity of the caching device to the wireless client device; and wireless network conditions."
],
[
"<SOH> BACKGROUND <EOH>Networks that are engaged to deliver electronic resources, such as videos, images, audio files, documents, software, and the like, to end users on the Internet on behalf of owners and providers of those resources (“content providers”) are commonly referred to as Content Delivery Networks (CDNs).",
"A primary purpose of a CDN is to distribute resources efficiently to client devices on behalf of one or more content providers, preferably via a public Internet.",
"Both end-users (clients) and content providers benefit from using a CDN.",
"By using a CDN, a content provider is able to improve the speed and reliability of content delivery to its end-users, and delivery capability without deploying additional infrastructure.",
"Clients benefit by being able to obtain content with fewer delays."
],
[
"<SOH> SUMMARY <EOH>Embodiments herein include an example system for use in delivering resources to client devices in a local network, wherein the system comprises a plurality of caching devices operable to cache resources on behalf of a plurality of content providers, and a local caching device communicatively situated between an access network and the client device.",
"The access network is communicably situated between the plurality of caching devices and the local caching device.",
"The local caching device is operable to, in response to a request for a resource by a client device, retrieve the requested resource from at least one of the plurality of caching devices, wherein the requested resource is transmitted between the at least one plurality of caching devices and the local caching device over the access network.",
"The access network is further operable to deliver the requested resource to the client device over the local network and store the requested resource for future requests by other client devices.",
"In an example embodiment, at least one of the plurality of caching devices is part of a cluster of caching devices.",
"In an example embodiment, in response to the local caching device requesting the requested resource from the at least one of the plurality of caching devices, the at least one of the plurality of caching devices is operable to retrieve the requested resource from at least one of an origin server of the content provider associated with the requested resource and a peer caching device.",
"In an example embodiment, the local caching device is dedicated to the client device.",
"In an example embodiment, the local caching device is a master cache accessible by a community of local caching devices and the community of local caching devices is communicatively coupled via at least one of a shared wireless frequency and a shared powerline.",
"Furthermore, a second local caching device can be prompted to opt-in to join the community of local caching devices.",
"In an example embodiment, a proxy device operable to intercept a request for the requested resource.",
"In another example embodiment, the request is a Domain Name System (DNS) request and the proxy device is operable to redirect the client device to the local caching device for delivery of the requested resource over the local network.",
"In another example embodiment, the request is an application protocol request such as a Hyper Text Transfer Protocol (HTTP) request.",
"In yet another example embodiment, the proxy device is the local caching device and, in response to intercepting the request for the requested resource, the local caching device is operable to redirect the client device to a second local caching device communicatively situated between the access network and the client device.",
"The second local caching device is operable to, in response to the redirected request by the client device, retrieve the requested resource from at least one of the plurality of caching devices, wherein the requested resource is transmitted between the at least one plurality of caching devices and the second local caching device over the access network.",
"The second local caching device is also operable to deliver the requested resource to the client device over the local network and store the requested resource for future requests by other client devices.",
"In an example embodiment, the proxy device is operable to determine, based on certain criteria, to which of a plurality of local caching devices to redirect the client device for delivery of the requested resource.",
"For example, the certain criteria for each of the plurality of local caching devices can comprise availability, relative load, relative connectivity, availability, and whether a given local caching device has a copy of the requested resource.",
"The proxy device is operable to receive the certain criteria via a push or pull from the plurality of caching devices.",
"In another example embodiment, the certain criteria is locally generated at the proxy device and is based on a request history at the proxy device.",
"Embodiments herein include an example method for proactively loading resources on a local caching device associated with a community of local caching devices, wherein the community of local caching devices is communicatively coupled via an access network to at least one content delivery network (CDN) caching device.",
"The example method comprises steps for, in response to determining that a given resource meets certain popularity criteria and is not stored on the local caching device, determining whether the given resource is stored on at least one other local caching device in the community.",
"If so, method comprises steps for retrieving the given resource from the at least one other local caching device, wherein the at least one other local caching device has determined that the given resource meets certain popularity criteria and has retrieved the given resource from the at least one CDN caching device via the access network.",
"The example method further comprises steps for, in response to determining that the given resource is not stored on at least one other local caching device in the community, retrieving the given resource from the at least one CDN caching device via the access network.",
"The example method further comprises steps for prompting a given local caching device that is not already associated with the community of local caching devices to join the community of local caching devices, and, if the given local caching device affirmatively responds to the prompt to join the community of local caching devices, adding the given local caching device to the community of local caching devices.",
"In an example embodiment, the certain popularity criteria comprise a number of requests for the given resource that were received at the local caching device during a given time interval, availability of storage space on the local caching device, total capacity of the local caching device, type of storage on the local caching device, and popularity rankings of other resources stored on the local caching device.",
"Embodiments herein include an example system comprising a redirection server and a plurality of caching devices situated within a wireless network.",
"The redirection server is operable to receive a request for a resource originating from a wireless client device connected to the wireless network, wherein the redirection server is further operable to select at least one of the plurality of caching devices to deliver the requested resource to the wireless client device based on at whether a caching device has the requested resource, proximity of the caching device to the wireless client device, and wireless network conditions.",
"The selected at least one caching device is operable to initiate delivery of the requested resource to the wireless client device from within the wireless network.",
"In an example embodiment, the plurality of caching devices are operable to retrieve the requested resource from one or more content delivery network (CDN) caching devices communicatively coupled with the wireless network.",
"In an example embodiment, the redirection server is operable to intercept the request and determine whether to select at least one of the plurality of caching devices based on a popularity of the requested resource.",
"The redirection server is also operable to redirect the wireless client to the at least one selected caching device for delivery of the requested resource.",
"In an example embodiment, the redirection server is situated within the wireless network.",
"In an example embodiment, a caching device is locally proximate to the wireless client device and is operable to wirelessly delivery the requested resource to the wireless client device.",
"The locally proximate caching device is further operable to retrieve the requested resource from one or more content delivery network (CDN) caching devices communicatively coupled with the wireless network.",
"In another embodiment, the locally proximate caching device is a Wi-Fi hotspot.",
"In an example embodiment, a caching device is situated within a cellular core network and/or a radio access network of the wireless network.",
"In another embodiment, a caching device is proximately situated with at least one of a radio network controller (RNC), a serving general packet radio service (GPRS) support node (SGSN), and a gateway GPRS support node (GGSN) of the wireless network."
],
[
"RELATED APPLICATIONS This application is a continuation of and claims the benefit of priority from U.S. patent application Ser.",
"No.",
"14/537,733, filed Nov. 10, 2014, titled “Content Delivery Network with Deep Caching Infrastructure,” wherein the entire contents of which are fully incorporated by reference herein for all purposes.",
"Application Ser.",
"No.",
"14/537,733 is a divisional application of and claims the benefit of priority from U.S. patent application Ser.",
"No.",
"13/360,551, filed Jan. 27, 2012, titled “Content Delivery Network with Deep Caching Infrastructure,” now U.S. Pat.",
"No.",
"8,886,742, which claims priority to U.S.",
"Provisional Patent Application No.",
"61/437,544, filed Jan. 28, 2011 and U.S.",
"Provisional Patent Application No.",
"61/486,039, filed May 13, 2011, titled “Content Delivery Network with Deep Caching Infrastructure,” wherein the entire contents of each are fully incorporated by reference herein for all purposes.",
"BACKGROUND Networks that are engaged to deliver electronic resources, such as videos, images, audio files, documents, software, and the like, to end users on the Internet on behalf of owners and providers of those resources (“content providers”) are commonly referred to as Content Delivery Networks (CDNs).",
"A primary purpose of a CDN is to distribute resources efficiently to client devices on behalf of one or more content providers, preferably via a public Internet.",
"Both end-users (clients) and content providers benefit from using a CDN.",
"By using a CDN, a content provider is able to improve the speed and reliability of content delivery to its end-users, and delivery capability without deploying additional infrastructure.",
"Clients benefit by being able to obtain content with fewer delays.",
"SUMMARY Embodiments herein include an example system for use in delivering resources to client devices in a local network, wherein the system comprises a plurality of caching devices operable to cache resources on behalf of a plurality of content providers, and a local caching device communicatively situated between an access network and the client device.",
"The access network is communicably situated between the plurality of caching devices and the local caching device.",
"The local caching device is operable to, in response to a request for a resource by a client device, retrieve the requested resource from at least one of the plurality of caching devices, wherein the requested resource is transmitted between the at least one plurality of caching devices and the local caching device over the access network.",
"The access network is further operable to deliver the requested resource to the client device over the local network and store the requested resource for future requests by other client devices.",
"In an example embodiment, at least one of the plurality of caching devices is part of a cluster of caching devices.",
"In an example embodiment, in response to the local caching device requesting the requested resource from the at least one of the plurality of caching devices, the at least one of the plurality of caching devices is operable to retrieve the requested resource from at least one of an origin server of the content provider associated with the requested resource and a peer caching device.",
"In an example embodiment, the local caching device is dedicated to the client device.",
"In an example embodiment, the local caching device is a master cache accessible by a community of local caching devices and the community of local caching devices is communicatively coupled via at least one of a shared wireless frequency and a shared powerline.",
"Furthermore, a second local caching device can be prompted to opt-in to join the community of local caching devices.",
"In an example embodiment, a proxy device operable to intercept a request for the requested resource.",
"In another example embodiment, the request is a Domain Name System (DNS) request and the proxy device is operable to redirect the client device to the local caching device for delivery of the requested resource over the local network.",
"In another example embodiment, the request is an application protocol request such as a Hyper Text Transfer Protocol (HTTP) request.",
"In yet another example embodiment, the proxy device is the local caching device and, in response to intercepting the request for the requested resource, the local caching device is operable to redirect the client device to a second local caching device communicatively situated between the access network and the client device.",
"The second local caching device is operable to, in response to the redirected request by the client device, retrieve the requested resource from at least one of the plurality of caching devices, wherein the requested resource is transmitted between the at least one plurality of caching devices and the second local caching device over the access network.",
"The second local caching device is also operable to deliver the requested resource to the client device over the local network and store the requested resource for future requests by other client devices.",
"In an example embodiment, the proxy device is operable to determine, based on certain criteria, to which of a plurality of local caching devices to redirect the client device for delivery of the requested resource.",
"For example, the certain criteria for each of the plurality of local caching devices can comprise availability, relative load, relative connectivity, availability, and whether a given local caching device has a copy of the requested resource.",
"The proxy device is operable to receive the certain criteria via a push or pull from the plurality of caching devices.",
"In another example embodiment, the certain criteria is locally generated at the proxy device and is based on a request history at the proxy device.",
"Embodiments herein include an example method for proactively loading resources on a local caching device associated with a community of local caching devices, wherein the community of local caching devices is communicatively coupled via an access network to at least one content delivery network (CDN) caching device.",
"The example method comprises steps for, in response to determining that a given resource meets certain popularity criteria and is not stored on the local caching device, determining whether the given resource is stored on at least one other local caching device in the community.",
"If so, method comprises steps for retrieving the given resource from the at least one other local caching device, wherein the at least one other local caching device has determined that the given resource meets certain popularity criteria and has retrieved the given resource from the at least one CDN caching device via the access network.",
"The example method further comprises steps for, in response to determining that the given resource is not stored on at least one other local caching device in the community, retrieving the given resource from the at least one CDN caching device via the access network.",
"The example method further comprises steps for prompting a given local caching device that is not already associated with the community of local caching devices to join the community of local caching devices, and, if the given local caching device affirmatively responds to the prompt to join the community of local caching devices, adding the given local caching device to the community of local caching devices.",
"In an example embodiment, the certain popularity criteria comprise a number of requests for the given resource that were received at the local caching device during a given time interval, availability of storage space on the local caching device, total capacity of the local caching device, type of storage on the local caching device, and popularity rankings of other resources stored on the local caching device.",
"Embodiments herein include an example system comprising a redirection server and a plurality of caching devices situated within a wireless network.",
"The redirection server is operable to receive a request for a resource originating from a wireless client device connected to the wireless network, wherein the redirection server is further operable to select at least one of the plurality of caching devices to deliver the requested resource to the wireless client device based on at whether a caching device has the requested resource, proximity of the caching device to the wireless client device, and wireless network conditions.",
"The selected at least one caching device is operable to initiate delivery of the requested resource to the wireless client device from within the wireless network.",
"In an example embodiment, the plurality of caching devices are operable to retrieve the requested resource from one or more content delivery network (CDN) caching devices communicatively coupled with the wireless network.",
"In an example embodiment, the redirection server is operable to intercept the request and determine whether to select at least one of the plurality of caching devices based on a popularity of the requested resource.",
"The redirection server is also operable to redirect the wireless client to the at least one selected caching device for delivery of the requested resource.",
"In an example embodiment, the redirection server is situated within the wireless network.",
"In an example embodiment, a caching device is locally proximate to the wireless client device and is operable to wirelessly delivery the requested resource to the wireless client device.",
"The locally proximate caching device is further operable to retrieve the requested resource from one or more content delivery network (CDN) caching devices communicatively coupled with the wireless network.",
"In another embodiment, the locally proximate caching device is a Wi-Fi hotspot.",
"In an example embodiment, a caching device is situated within a cellular core network and/or a radio access network of the wireless network.",
"In another embodiment, a caching device is proximately situated with at least one of a radio network controller (RNC), a serving general packet radio service (GPRS) support node (SGSN), and a gateway GPRS support node (GGSN) of the wireless network.",
"BRIEF DESCRIPTION OF THE DRAWINGS Other objects, features, and characteristics of the present invention, as well as the methods of operation and functions of the related elements of structure, will become more apparent upon consideration of the following description and the appended claims with reference to the accompanying drawings, all of which form a part of this specification.",
"FIG.",
"1 illustrates an example network environment 100 suitable for implementing various embodiments disclosed herein, including a high level depiction of a content delivery network (CDN) in accordance with an embodiment of the present invention.",
"FIG.",
"2 illustrates the CDN of FIG.",
"1 having deep caching infrastructure in accordance with embodiments of the present invention.",
"FIG.",
"3 illustrates the CDN of FIG.",
"1 having deep caching infrastructure in accordance with embodiments of the present invention.",
"FIG.",
"4 illustrates an example process for retrieving a resource using the CDN of FIG.",
"2 in accordance with embodiments of the present invention.",
"FIG.",
"5 illustrates an example process for retrieving a resource using the CDN of FIG.",
"2 in accordance with embodiments of the present invention.",
"FIG.",
"6A illustrates an example process for initializing the deep caching infrastructure of FIG.",
"3 in accordance with embodiments of the present invention.",
"FIG.",
"6B illustrates an example process for proactively loading content in accordance with embodiments of the present invention.",
"FIG.",
"6C illustrates an example process for determining popularity in accordance with embodiments of the present invention.",
"FIG.",
"6D illustrates an example process for replicating objects in accordance with embodiments of the present invention.",
"FIG.",
"7 illustrates the CDN of FIG.",
"1 adapted for a wireless network in accordance with embodiments of the present invention.",
"FIG.",
"8 illustrates the CDN of FIG.",
"1 adapted for a wireless network in accordance with embodiments of the present invention.",
"FIG.",
"9 illustrates the CDN of FIG.",
"1 adapted for a wireless network in accordance with embodiments of the present invention.",
"FIG.",
"10 illustrates the CDN of FIG.",
"1 adapted for a wireless network in accordance with embodiments of the present invention.",
"DETAILED DESCRIPTION Although the present invention has been described with reference to various embodiments, it will be understood that the invention is not limited to the details thereof.",
"Various modifications and substitutions will occur to those of ordinary skill in the art.",
"Deep Caching with Access Networks FIG.",
"1 illustrates an example network environment 100 suitable for implementing various embodiments disclosed herein.",
"The example network environment 100 comprises the Internet 101 (i.e., a large and diverse public network comprising one or more interconnected asynchronous systems) communicably coupled to access networks 102, 104, and 106.Note that access networks 102, 104, and 106 can be under the control of or operated/maintained by one or more entities, such as, for example, one or more Internet Service Providers (ISPs) that provide access to the Internet 101 for consumers/end-users (e.g., residential, enterprise, etc.)",
"and/or content providers.",
"In the example network environment 100 of FIG.",
"1, each access network provides Internet access to several residential end-users, denoted as houses.",
"Network environment 100 further comprises one or more CDNs for delivery of electronic resources (e.g., video, images, music, software, games, cloud resources, etc.)",
"and other content from content providers to end-users across Internet 101.The one or more CDNs each have a number of CDN caches located in various strategic locations (both physical and logical) in Internet 101—e.g., CDN cache cluster 110 (DC), CDN cache cluster 112 (NYC), CDN cache cluster 114 (CHI), CDN cache cluster 116 (SEA), CDN cache cluster 118 (LA), and CDN cache cluster 120 (HOU).",
"At a high level, FIGS.",
"2 and 3 illustrate example network environments 200 and 300 suitable for implementing various embodiments disclosed herein.",
"These networks are used to deliver resources to clients that are communicatively connected to an access network, and each include embodiments of what are referred to interchangeably as “deep caches,” “shared caches” or “local caches,” which are intended to represent cache devices on the client-side (or subscriber-side) of the access networks.",
"For example, the client-side (or subscriber-side) of the access network can include cache devices that are topologically, physically, and/or logically closer to clients than an access network's Internet connection points.",
"Such so-called “deep caches,” “shared caches” or “local caches,” which are preferably operated by or on behalf of CDN providers, provide client devices the opportunity to retrieve resources without having to communicate with storage devices across the access networks.",
"More specifically, the network environment 200 in FIG.",
"2 represents an example of a deep cache infrastructure whereby deep caches 202, 204 and 206 are deployed outside of access networks at a relatively close proximity to the access networks' end-users/subscribers.",
"Likewise, the network environment 300 in FIG.",
"3 represents an example of a deep cache infrastructure whereby deep caches (e.g., 320a, 320b, 320c) are deployed outside of access networks at a relatively close proximity to the access networks' end-users/subscribers.",
"In the example configuration of FIG.",
"2, network environment 200 comprises Internet 101, access network 104, CDN caches (DC) 110, and CDN caches (HOU) 120.Although any number of CDNs can service and deliver content to any of the regions and houses shown in FIG.",
"2, assume that only a single CDN services and delivers content to the end-users/subscribers of access network 104.In network environment 200, the CDN comprises a CDN Domain Name System (DNS) 201 that resides, at least in part, within Internet 101 (and/or is communicably coupled to Internet 101) and is also communicably coupled across Internet 101 to CDN caches (DC) 110 and CDN caches (HOU) 120.CDN DNS 201 comprises one or more CDN DNS servers that are responsive to requests for content from end-users; and determines, based on several factors and parameters, at least one appropriate or suitable CDN cache for delivering the requested content to end-users.",
"Still referring to FIG.",
"2, shared caches 202, 204, and 206 are deployed on the client/subscriber-side of the access network 104.Each shared cache is shared amongst proximately located end-users (e.g., via wired access, Wi-Fi hotspot, powerlines, etc.).",
"In a preferred embodiment, communication amongst the clients is accomplished by way of a new technology being developed named White Space Wi-Fi (or by way of one or more of any other available and/or suitable wireless spectrums for that matter).",
"Access network 104 comprises a DNS 214 having one or more DNS servers.",
"In addition to providing conventional DNS services to end-users of access network 104, DNS 214 can interact with CDN DNS 201 in furtherance of providing CDN access to end-users of access network 104 (e.g., via redirection).",
"In embodiments described in FIG.",
"2, various functionality and techniques can be used to effectively override the need for the DNS 214 and DNS 201 in circumstances in which it is optimal for the shared caches 202, 204 and 206 to deliver a resource that is requested by a client.",
"FIG.",
"4 is a flow diagram illustrating a process for use in delivering a resource to a client in the network environment 200 in which a DNS resolver on a client (or otherwise accessible to a client) redirects the client to a shared cache 202, 204 and 206 as opposed to resolving the client to the CDN caches (e.g., 120), in accordance with embodiments of the present invention.",
"Such a circumstance occurs if the request (e.g., domain name or any other identifying information in the case of a proxy) meets certain “deep cache” criteria and/or thresholds.",
"Exemplary deep cache criteria and/or thresholds can be based on content-based characteristics such as popularity, size, type, genre, creation date, etc., and/or client-based characteristics such as client device type, connection type/speed, storage capacity/availability, etc., and/or any other distinguishing factor or characteristic (e.g., on a hostname basis for DNS requests).",
"If, however, a resource does not meet such criteria or thresholds, then the client engages in normal DNS resolution and is served the requested resource from either a CDN cache 120 or an origin server.",
"FIG.",
"5 is a flow diagram illustrating a similar process as in FIG.",
"4, but instead employs a proxy instead of a DNS resolver on a client.",
"For example, the proxy can be software executing on the client device or a separate device capable of performing proxy server/cache functionality.",
"In another embodiment, intelligent traffic management can be used to complement or supplement DNS processing.",
"Still referring to FIG.",
"2 and according to another example embodiment, each end-user (e.g., house) has access to its own domain name resolver (e.g., in conjunction with a PC, laptop, set-top box, Roku Box, smart phone, tablet, etc.).",
"These end-user name resolvers can be pre-populated and/or periodically/intermittently populated (via push and/or pull) with a list or mapping of specific domains that are determined to be popular, desirable, strategic, etc.",
"by one or more content providers, CDNs, third party entities, etc., or any combination thereof (or organically by the domain name resolver itself using, for example, historic/cached data, histograms of traffic patterns, etc.).",
"Additionally, end-user name resolvers can be pre-populated and/or periodically/intermittently populated (via push and/or pull) with a regular expression usable to identify specifically requested domains that are similarly determined to be popular, desirable, strategic, etc.",
"In this manner, content associated with popular (or desirable, strategic, etc.)",
"domains can be preemptively loaded (i.e., pre-fetched) into one or more shared caches so that the domain name resolver can immediately resolve the request for content to a shared cache directly connected (or indirectly connected, but in close proximity, that is, on the client-side of an access network) to the requesting end-user device.",
"For example, if an end-user requests content (e.g., via a web interface, set-top box, Roku℠ Box, etc.",
"), the associated end-user domain name resolver can determine if the domain associated with the requested content is deemed popular (e.g., by comparing with the list or mapping of domains, comparing against a regular expression, etc.)",
"and, if so, redirect the end-user device to request content from at least one shared cache.",
"Furthermore, CDN operators, content providers, etc., can employ a centralized and/or regional system to dynamically and strategically distribute such lists/mappings of domains or regular expressions to the various client devices.",
"Again referring to FIG.",
"2, another example embodiment employs one or more proxy devices 208, 210 (e.g., DNS proxies) situated between the client devices and DNS 214 of access network 104 whereby the proxies are operable to transparently intercept client requests.",
"Similar to the end-user name resolvers previously described, the proxies 208, 210 can be pre-populated and/or periodically/intermittently populated (via push and/or pull) with a list or mapping of specific domains that are determined to be popular, desirable, strategic, etc.",
"by one or more content providers, CDNs, third party entities, etc., or any combination thereof (or organically by the proxies themselves using, for example, historic/cached data, histograms of traffic patterns, etc.).",
"Additionally, proxies can be pre-populated and/or periodically/intermittently populated (via push and/or pull) with a regular expression usable to identify specifically requested domains that are similarly determined to be popular, desirable, strategic, etc.",
"In this manner, content associated with popular (or desirable, strategic, etc.)",
"domains can be preemptively loaded (i.e., pre-fetched) into one or more shared caches so that the proxy can redirect requests for content (e.g., via an HTTP redirect) to one or more shared caches directly connected (or indirectly connected, but in close proximity, that is, on the client-side of an access network) to the requesting end-user device.",
"For example, if an end-user requests content (e.g., via a web interface, set-top box, RokusM Box, etc.",
"), the proxy 208 or 210 can intercept that request and determine if the domain associated with the requested content is deemed popular (e.g., by comparing with the list or mapping of domains) and, if so, redirect the end-user device to request content from at least one shared cache.",
"Note that a proxy is not necessarily limited to analyzing the domain name associated with a request (as may be the case with a DNS device or agent) and can analyze additional information in the request's URL (e.g., at the HTTP level) such as paths, tokens, hashes, name-value pairs, etc.",
"Furthermore, CDN operators, content providers, etc., can employ a centralized and/or regional system to dynamically and strategically distribute such lists/mappings of domains (or paths, tokens, hashes, name-value pairs, etc.)",
"and/or regular expressions to the various proxies.",
"According to an example embodiment, the proxies and/or DNS agents/devices can extract additional information from the client request to better perform deep caching functionality (e.g., rendezvous) as described herein.",
"For example, a client request can contain specific information such as the client or end user IP address, in home cache IP address, master cache IP address, content classification data (e.g., title, type, encoding, etc.",
"), delivery protocol, and the like.",
"This specific information can be added to the client request by software executing on the client device, by content providers, by CDNs, or by any other suitable entity capable of modifying client requests.",
"It is also contemplated that one or more shared caches can perform the proxy functionality as described above.",
"In such a configuration, and assuming the shared cache determines that the requested resource should be served from at least one shared cache (e.g., based on popularity), the shared cache would: i) redirect the client to one or more other shared caches (e.g., if that shared cache does not have a copy or a substantial portion of the requested content and/or the other shared caches do, if network conditions favor delivery from other shared caches, etc.",
"); ii) “hand-off” the request to one or more other shared caches (e.g., transparently to the requesting client via Transmission Control Protocol “TCP”) so that the other shared cache(s) can take over the handling of the request and initiate delivery of the requested content in lieu of a redirect; or, iii) serve the content itself (e.g., if that shared cache has a copy or substantial portion of the requested content or can retrieve a copy of the requested resource from another CDN cache or shared cache).",
"Turning now to FIG.",
"3, the network environment 300 comprises Internet 101, access network 104, CDN caches (DC) 110, and CDN caches (HOU) 120.Although any number of CDNs can service and deliver content to any of the regions and houses shown in FIG.",
"3, assume that only a single CDN services and delivers content to the end-users/subscribers of access network 104.In network environment 300, the CDN comprises a CDN Domain Name System (DNS) 201 that resides, at least in part, within Internet 101 (and/or is communicably coupled to Internet 101) and is also communicably coupled across Internet 101 to CDN caches (DC) 110 and CDN caches (HOU) 120.CDN DNS 201 comprises one or more CDN DNS servers that are responsive to requests for content from end-users; and determines, based on several factors and parameters, at least one appropriate CDN cache for delivering the requested content to end-users.",
"Still referring to FIG.",
"3, the network environment 300 also comprises shared caches deployed on the client-side of the access network 104.As with FIG.",
"2, the shared caches shown in FIG.",
"3 are preferably operated by the CDN provider.",
"In contrast to the embodiments of FIG.",
"2, the shared caches reside as storage at a plurality of the client homes and are shared amongst the clients via a common network infrastructure 302, 304 and 306, such as, without limitation, wired access, Wi-Fi hotspot, powerlines, etc.",
"(also referred to as a “residential wireless cloud”).",
"In a preferred embodiment, communication amongst the clients is accomplished by way of White Space Wi-Fi or one or more of any other available and/or suitable wireless spectrums.",
"While shared caches 320a-320c in accordance with the embodiment of FIG.",
"3 are only shown at three clients, it should be appreciated that numerous clients include such shared caches 320a-320c and that an aggregate of such clients that operate shared caches (e.g., 320a and 320b) are referred to as a “community.” For example, each of common network infrastructure 302, 304 and 306 can represent such a community.",
"In accordance with various embodiments described herein, a shared cache 320a, 320b, 320c depicted in FIG.",
"3 (also referred to as an “in home cache”) can be a device situated in residential homes and on residential users' home networks.",
"Such a shared cache acts as a storage device for content that may be consumed by that residential user or other users that are reachable through a residential wireless cloud (e.g., common network infrastructure 302, 304, 306).",
"The storage within the device could be any type of storage including, for example, spinning disk, flash memory, and the like.",
"In addition to the storage, the shared cache has software that allows it to participate as part of a CDN with the ability to load content from the CDN and share content with other similar devices through the residential wireless cloud.",
"To support the exchange of data through the residential wireless cloud, the shared cache will have wireless transmission and receipt capabilities.",
"The shared cache can take on many forms including, for example, a standalone device that acts as an in-line cache in the home network, an end user PC with the CDN-specific software loaded thereon and at least some of the device's storage allocated to this function, or the shared cache can be integrated as a part of an in home appliance such as a television, gaming console or any other network connected devices.",
"FIG.",
"6A illustrates an example process for initializing the deep caching infrastructure of FIG.",
"3 in accordance with embodiments herein.",
"Upon initialization of a client device (e.g., boot-up, initialization of a process or application, installation of software, etc.",
"), the client device is prompted with an option to join a community.",
"For example, the prompt may be presented via a graphical user interface (GUI) to a user of the client device.",
"Then, if client device (e.g., via the GUI, a preconfigured setting, etc.)",
"returns an affirmative decision to join the community, the client device (and any in-home cache associated therewith) is added to the community.",
"In one embodiment, the client device (and/or its associated in-home cache) sends an “add me to the community” indication to the master cache, community-designated proxy, and/or one or more other members (e.g., shared caches, client devices, in-home caches, etc.)",
"of the community.",
"In response, the master cache, community-designated proxy, and/or one or more other members of the community update their respective community member lists to indicate inclusion of the newest member.",
"With regard to both network environment 200 and network environment 300, another embodiment of the present invention contemplates a capability for a shared cache deployed within an access network to preemptively (or proactively) download and store/cache (e.g., pre-fetch) content that is deemed popular (preferably occurring during off-peak hours for the access network and/or residential wireless cloud).",
"For example, a shared cache can receive popularity information from its CDN (or one or more content providers, third party entities, etc.)",
"and/or derive its own organic popularity data (e.g., using historical data such as histograms of traffic patterns, etc.)",
"in furtherance of preemptively downloading and storing content that has not yet been (or has been infrequently) requested from the shared cache—depending on the popularity algorithms and policies being employed and enforced.",
"For example, such popularity determinations may be used as a factor in connection with selection of an appropriate shared cache for a particular client.",
"Continuing with the example embodiment above, the in home cache sends a request (e.g., per a configured time and frequency) to a network based pro-active content loading application (e.g., predictive content engine 312).",
"The request to the predictive content engine 312 contains the usage and other data collected by the in home cache that would be useful in predicting content that may be requested by the end users in the home.",
"This request is preferably implemented using standard HTTP based protocols, although other protocols may be used as well.",
"In turn, the predictive content engine 312 analyzes the data sent from the in home cache and responds with a list of content that it believes the end-users at home may want to watch at a future date.",
"The in home cache then processes the list of content provided by the predictive content engine 312 and uses a proactive loading algorithm to determine which content in the list, if any, should be loaded.",
"For instance, the in home cache may have a configured set of times or network performance characteristics that specify an appropriate time for proactively loading the content.",
"FIG.",
"6B is a flow chart showing example processing steps of a proactive loading algorithm used by an in home cache.",
"Any number of techniques may be used to determine the popularity of a content object.",
"For example, popularity of an object can be determined based on the number of requests and/or the request rate.",
"Popular objects typically have higher request rates or higher number of requests than unpopular objects.",
"Popularity can also be determined by tracking the last X number of request times for an object and then using the difference between the current time and the X number of request times to calculate a running average for how often the object is requested.",
"Similarly, popularity can be gauged on the request rate for an object that is weighted for more recent requests for the object (which is a predictor that the object will be requested again).",
"As another example, an exponential decay method and an artificial neural network could be used to determine the popularity of an object.",
"According to an example embodiment of a popularity computation and referring to FIG.",
"6C, the popularity of an object is based on the request rate of the object which is computed over a sliding time window in a discrete manner.",
"As such, the variable I denotes the time interval over which the popularity of an object is measured.",
"The time interval is divided into N equal sub-intervals of duration I/N.",
"As will be apparent, the time interval is not required to be equally divided and may instead be divided in other manners.",
"Furthermore, a linked list P of size N is created for each object.",
"The value of N determines the quality of approximation (e.g., the smaller the value of N, the coarser the approximation).",
"The first element P[1] of the list records the number of requests that were received when the current time was within the first sub-interval, the second element P[2] records the number of requests that were received when the current time was within the 2nd interval, and so on.",
"When a new sub-interval is received, the list is rotated such that P[I] becomes P[I+1] (except for P[N] which becomes P[1]); so, for example, P[1] becomes P[2], P[2] becomes P[3], and P[N] becomes P[1].",
"After the rotation, the new P[1] is reset to zero.",
"Accordingly, only the end time of the first sub-interval needs to be recorded and compared against the current time to check if the list should be rotated.",
"For each new request within the sub-interval, P[1] is simply incremented by 1.In this way, the arrival time of each request need not be recorded.",
"In another example embodiment, the popularity of an object is simply the sum of all numbers in the list.",
"To make the computation more efficient, the sum of P[2]+P[3]+ .",
".",
".",
"+P[N] is stored in a register M. The popularity can then be computed by adding P[1] to M. When a rotation occurs, the new value of M becomes M+=P[1]−P[N].",
"Note that the popularity of an object may be queried constantly.",
"Thus, to avoid the extra addition involved for each such inquiry, the value of P[1] can be set to M after the rotation.",
"Then, the value of P[1] is the popularity of the object.",
"Referring to FIG.",
"6C, an example popularity computation algorithm may be summarized as follows.",
"The linked list P of size N for an object, wherein each of P[1] .",
".",
".",
"P[N] represents a time sub-interval, is initialized (at 605).",
"The popularity M is also initialized (at 610).",
"If there is a request for the object while the current time is within the current time sub-interval (at 615), then the value of P[1] is incremented by 1 (at 620).",
"If the current time is within a new time sub-interval (at 625), then the value of P[1] is decremented by the value of M, M is incremented by P[1]−P[N], the list P is rotated, and P[1] is set to the value of M (at 630).",
"Then, provided the popularity computation is continued (at 635), that is, the popularity computation is not terminated, the popularity computation algorithm repeats itself.",
"Furthermore, any number of techniques may be used to initiate replication of an object.",
"A cache server (or in home cache) might replicate an object on the first request by a client for the object.",
"Alternatively, the cache server (or in home cache) may be tuned to wait until a specific number or range of requests are received for the object.",
"In other implementations, the object may be pulled or replicated if the object is more popular (e.g., has a higher request rate) than the least popular object currently in storage.",
"In yet another alternative, the replicating decision can be a function of the popularity of the object, the cost of storing the object, the (available) storage capacity of the cache server (or in home cache) and/or the type of storage (e.g., spinning disk, flash memory, etc.",
"), the cost of pulling the object from the network (e.g., network capacity), as well as any other relevant cost factors.",
"Note that since the popularity of objects may change significantly with time, initiating a pull decision of an object based purely on a fixed threshold does not necessarily capture this dynamic nature of popularity.",
"A replication policy that compares against the least popular of replicated objects has its limitations, although the policy does not use a fixed threshold.",
"Consider where the storage is only half full but all the replicated objects are extremely popular.",
"Since only objects exceeding the least popular of the replicated objects will be replicated under this replication policy, objects with moderate popularity will be rejected despite the fact that there is plenty of storage space available and the objects are reasonably popular.",
"Accordingly, a replication scheme should be able to automatically adjust the replication threshold by taking into consideration the dynamic nature of popularity and the available storage capacity.",
"If there are more popular objects than the storage capacity allows, the replication scheme should raise the threshold.",
"If there is more available storage capacity, the replication scheme should decrease the threshold so that more objects can be stored.",
"According to an example embodiment of a replication scheme and referring to FIG.",
"6D, an object is replicated into storage (at 650) when the popularity P of the object is greater than the initial threshold PI (at 640) and when there is enough space in the storage to replicate the object (at 645).",
"If there is not enough storage to replicate the requested object, a replacement algorithm is performed in which the popularity P of the object is compared against the popularity PL of the least popular object in the storage (at 655).",
"If P is greater than PL, the current least popular object is added to a candidate list for removal (at 660).",
"If it is determined that upon removing the object(s) in the candidate list (initially only the most recent least popular object) there would be enough storage (at 670), then the object(s) in the candidate list are removed and PL is updated (at 690), and then the object is replicated into storage (at 650).",
"If, on the other hand, it is determined that upon removing the object(s) in the candidate list there would not be enough storage (at 670), then it is determined whether PL is PM (i.e., where PM is the current most popular object) (at 675) and, if so, PL is reset to the initial least popular object (at 685) and the operation ends without replication (i.e., there would not be enough storage if all PL through PM objects were removed).",
"If PL is not yet PM, then PL is updated (i.e., iterated) and the operation cycles again to step 655.Note that the candidate list mitigates the risk of removing one or more objects from storage before ever replicating an object since, as the case may be, the object may not even be replicated after performing the removal operations (e.g., because the object is larger than the overall storage capacity).",
"In an example embodiment, an in home cache (e.g., shared cache 320a, 320b, 320c) has the capability of collecting and storing usage data for the client devices that are requesting content from within the community or common network infrastructure to which it is connected.",
"For example, this data could be a record of actual content played on in home devices, information describing other internet usage occurring in the home, GPS information that provides physical location data, demographic or user preference data entered by users in the home through an interface provided by the software on the in home cache, etc.",
"Referring again to FIG.",
"3, the community of shared caches can use various techniques for request handling/processing, distributed storage, and delivery of content.",
"For example, in one example embodiment a particular shared cache in the community is designated as a master cache (e.g., shared cache 320a) while the other shared caches in the community function in a subordinate manner to this master cache.",
"The master/subordinate designations can be assigned by the CDN, content provider, and/or by the community of shared caches themselves.",
"Content requests originating within the community can be routed through the master cache or transparently intercepted similar to the proxy functionality previously discussed.",
"Upon receiving such a request, the master cache can determine whether or not the request should be serviced by one or more of the shared caches in the community (or, possibly, one or more shared caches in one or more separate communities) based on techniques previously described (e.g., popularity, filtering against domain lists/mappings or regular expressions, etc.).",
"Or, alternatively, the master cache can receive a request from a client device in the community that has already made such a determination via the client domain name server (i.e., wherein the client's domain name server resolved the request to the master cache).",
"Either way, if it is determined that the request should be serviced from within the community, the master cache can (initially or further) redirect the requesting client to one or more shared caches in the community, and/or service the request and initiate delivery of the content itself.",
"It should be noted that the master cache may or may not be associated with (or operated in conjunction with) a particular client or house within the community.",
"In other words, the master cache could be an independent or stand-alone shared cache as described above with respect to FIG.",
"2.It should be further noted that a community-designated proxy (e.g., proxy 310) may be substituted for the master cache in order to perform (transparent) interception and redirection of content requests that originate from within the community to other shared caches within the community.",
"Still further it should be noted that the functionality associated with a master cache or community-designated proxy is not necessarily limited to a single device.",
"As such, two or more devices within a community may share such master cache and/or proxy functionality (e.g., as a statically or dynamically designated secondary, tertiary, etc., master cache/proxy).",
"For example, such distributed or redundant master cache/proxy functionality can be useful for load-balancing, failover, scalability, etc.",
"Continuing with the example embodiment above, the master cache can monitor and maintain an awareness of the other subordinate shared servers and the content stored thereon.",
"For instance, the master cache can maintain a table or a mapping that includes, by way of non-limiting example, data associated with content stored on each shared cache (e.g., object names/titles, object/file sizes, partial object/file data, specific content location information such as URLs or portions thereof, etc.",
"), load and/or storage capacity of each shared cache, cache status information (e.g., whether or not a shared cache is functional or online), global popularity of stored content (i.e., per a CDN or content provider), local popularity of stored content (i.e., per one or more communities), and the like.",
"The master cache can periodically/intermittently pull this information from each subordinate shared cache and/or each shared cache can periodically/intermittently push this information to the master cache.",
"Having collected such community awareness information, the master cache can then use this information to redirect content requests originating within the community to the most appropriate or suitable shared cache(s) in the community.",
"Community awareness information can also be used in furtherance of traffic engineering techniques such as bandwidth throttling (due to the asymmetric nature of CDN traffic flows) and load shedding amongst the community of shared caches.",
"Note that a content request can be serviced by one or more caches that serve one or more different portions of the requested content to the requesting client (simultaneously and/or at different times).",
"In yet another example embodiment with reference to FIG.",
"3, a common addressing scheme is used to determine the most appropriate or suitable shared cache(s) in the community for servicing a request for content.",
"As such, each shared server in the community would be assigned a common address (e.g., IP address).",
"Assume, for example, that a client within the community makes a content request and it is determined that the requested content should be served from a shared cache within the community (i.e., the determination being made via the client's name server, master cache, or via a community-designated proxy, as previously discussed).",
"In such a case, the client's name resolver would resolve the request to the common address, or the proxy would redirect the request to the common address.",
"Thus, by using the common address the client would send (or broadcast) the request to each shared cache in the community and, in doing so, the client can select which shared cache(s) will ultimately serve the content (typically the first shared cache to respond with an indication that it is able and willing to service the request).",
"It is also contemplated that a master cache or community-designated proxy can further use this common addressing scheme on a more granular level.",
"For example, a master cache or community-designated proxy can associate a common address to particular content (thus assigning the common address to only those shared caches that have the particular content) such that requests will be redirected to only those shared servers that have the particular content.",
"In one example embodiment, a first set of shared caches in a community are designated for storing and servicing a first type of content/service, while a second set of shared caches are designated for storing and servicing a second type of content/service.",
"As such, the first set of shared caches could be assigned a first common address so that requests for a first type of content would be redirected (or resolved) to only the first set, while the second set of shared caches could be assigned a second common address so that requests for a second type of content would be redirected (or resolved) to only the second set, and so on.",
"According to yet another example embodiment, a client can issue a type of point-to-multipoint content request (e.g., per a redirect) to each shared cache in the community.",
"To do this, the client would be provided (e.g., by a CDN, content provider, master cache, community-designated proxy, etc.)",
"a list of addresses (e.g., IP addresses) of each shared cache in the community.",
"In this sense, the designation of the community of shared caches can be access network or ISP independent.",
"Note that the list can be dynamically updated and modified by whichever entity provides the list to the client.",
"In another example embodiment, the community of shared caches is based on one or more subnets of the access network or ISP.",
"In this configuration, a client can issue a content request (e.g., per a redirect) to each shard cache in the community by broadcasting the request to one or more access network or ISP subnet address.",
"A further embodiment contemplates the use of multicasting (e.g., IP multicasting) for content request routing/handling among a community of shared caches.",
"In such a configuration, each shared cache (e.g., upon going online) would register with a multicast address group associated with each of the other shared caches in the community (e.g., using Internet Group Management Protocol “IGMP”).",
"Thus, a client associated with a shared cache can issue a content request (e.g., per a redirect) to its multicast group to which each of the other shared caches in community have subscribed.",
"In an example embodiment, the master cache or community-designated proxy administers and manages the multicast groups by keeping track of which shared caches belong to the community.",
"Deep Caching with Wireless Networks At a high level, FIGS.",
"7-10 illustrate example network environments 700, 800, 900, and 1000, respectively, which are suitable for implementing various embodiments disclosed herein.",
"Similar to the configurations previously described, these networks are used to deliver resources to clients (also commonly referred to as user equipment “UE”) that are communicatively connected to a wireless network (examples of which are described below), and each include embodiments of what are referred to interchangeably as “deep caches,” “shared caches,” “local caches,” or “transparent caches,” (collectively referred to as “flex caches”) which are intended to represent cache devices situated within or around the wireless network.",
"Such so-called “flex caches,” which can be operated by or on behalf of CDN providers, wireless network providers, content providers, other third party entities, etc., and/or any combination thereof, provide client devices (or UEs) the opportunity to request and retrieve resources without having to necessarily communicate with storage devices/servers across the Internet (and/or any other wireline network to which the wireless network directly or indirectly connects).",
"In particular, the flex caches (and, in some example implementations, in connection with particular servers such as redirection/translation servers) provide deep caching functionality as previously described such that content can be stored/cached within the wireless network (e.g., preemptively or dynamically caching content, for example, from content providers associated with the CDN).",
"According to example embodiments, the flex caches can also provide transparent caching of content as the content is retrieved upstream from the CDN (or from other storage devices/servers either directly or indirectly connected to or located in the Internet).",
"In another example embodiment, the flex caches can pre-fetch content (e.g., when content becomes or is deemed popular or desirable), thus enabling faster and more efficient delivery of content to clients/UEs of the wireless network.",
"It should be noted that the wireless networks described herein are not limited to any particular wireless network configuration, standard, protocol, or generation.",
"For instance, wireless networks are contemplated to include second, third, or fourth generation (2G/3G/4G) mobile/cellular networks such as, for example, 3G UMTS/HSDPA/HSUPA networks (Universal Mobile Telecommunications System/High-Speed Downlink Packet Access/High-Speed Uplink Packet Access), GSM/GPRS networks (Global System for Mobile Communications/General Packet Radio Service), 4G LTE/WiMax networks (Long Term Evolution/Worldwide Interoperability for Microwave Access), CDMA networks (Code Division Multiplex Access), and the like, as well as Wi-Fi networks, satellite networks, and/or any other networks or wireless spectrums capable of directly or indirectly delivering content to wirelessly connected clients/UEs.",
"The embodiments described herein also contemplate integration and interoperability with future configurations, standards, protocols, and generations of wireless networks.",
"Turning now to FIG.",
"7, the example network environment 700 comprises Internet 101, CDN caches 120, at least one CDN DNS 201, cellular core network 705, and Radio Network Controller (RNC) backhaul network 710.Internet 101 is communicably coupled with cellular core network 705 via at least one Gateway GPRS Service Node (GGSN) 715, and cellular core network 705 is communicably coupled with RNC backhaul network 710 via at least one Serving GPRS Support Node (SGSN) 720.RNC backhaul network 710 is communicably coupled with one or more RNCs 725, and the RNCs 725 are communicably coupled with one or more Base Transceiver Stations (BTSs) or Node Bs 730 (the RNCs 725 and BTSs/Node Bs 730 collectively form a so-called Radio Access Network “RAN”).",
"Node Bs 730 are operable to wirelessly communicate with UEs 735 (e.g., clients using wireless devices such as smart phones, tablets, laptops, or any other devices suitable for wirelessly connecting to a network).",
"Example network environment 700 further comprises a cache hierarchy in the wireless network including zero or more flex caches 740 situated at or between GGSN 715 and SGSN 720 (e.g., within cellular core network 705), zero or more flex caches 745 situated at or between SGSN 720 and RNCs 725 (e.g., within RNC backhaul network 710), and zero or more flex caches 750 situated at or between RNCs 725 and their respective Node Bs 730.Although any number of CDNs can service and deliver content to wireless networks, it should be noted that as in the previous embodiments and figures, assume that only a single CDN services and delivers content to the clients/UEs 735 in FIGS.",
"7-10.Still referring to FIG.",
"7, and in general operation, the CDN is operable to deliver content to clients/UEs 735 via any of the flex caches in the cache hierarchy of the wireless network.",
"For example, and in conjunction with techniques previously described, content may be preemptively stored on any of the flex caches 740, 745, or 750, to anticipate requests for content from clients/UEs 735.Content may be stored on different caches within the hierarchy depending on the policies implemented by the CDN, content provider, and/or the wireless network provider (e.g., popularity computation algorithms and replications policies per FIGS.",
"6B-6D).",
"The policies can include factors such as, for example, content popularity, content type, content size, information associated with the client or the user equipment, transmission protocol, data format, network conditions, etc.",
"Example data flows (i.e., requests for content, inter-cache communications, redirection of requests, distributed storage schemes/protocols/communications, and delivery of content, etc.)",
"are discussed below with respect to FIGS.",
"8-10.FIG.",
"8 depicts an example network environment 800 similar to the example network environment 700 of FIG.",
"7, and further comprises one or more redirection/translation servers 805 situated at or between GGSN 715 and SGSN 720 (e.g., within the cellular core network 705).",
"Redirection/translation server 805 is configured to handle and redirect requests for content within the wireless network.",
"As conventional wireless networks (i.e., cellular/mobile networks) are currently not capable of (or are otherwise ineffective at) handling/processing traditional Layer 3 or higher communications (e.g., DNS name resolving, HTTP requests for content, File Transfer Protocol “FTP” or Peer-to-Peer “P2P” communications, etc.",
"), the redirection/translation server 805 can be used to translate requests (e.g., via decapsulation and re-encapsulation) from the wireless domain and then process those requests as if a traditional wireline network device (e.g., DNS server, CDN cache/server, proxy server, etc.)",
"were handling the request.",
"In an example embodiment, the redirect/translation server 805 is configured to transparently intercept and handle a request for content from a client/UE 735 before the request exits the wireless network (i.e., before the request is passed to the Internet for further handling/processing).",
"According to another example embodiment, redirection/translation server 805 is capable of redirecting sessions within the wireless network.",
"Using information about where or how content is stored within the CDN (i.e., either in the Internet 101 or within the cache hierarchy of the wireless network at the various flex caches), the redirection/translation server 805 can redirect a content request to a flex cache suitable for efficiently delivering content to the requesting client/UE 735.Similar to embodiments previously described, redirection/translation servers can be pre-populated and/or periodically/intermittently populated with a list or mapping of specific domains that are determined to be popular, desirable, strategic, etc.",
"by one or more content providers, CDNs, third party entities, etc., or any combination thereof (or by even the redirection/translation servers themselves using, for example, historic/cached data).",
"Note that regular expressions may be used in addition to the list or mapping of specific domains as previously described.",
"In this manner, content associated with popular (or desirable, strategic, etc.)",
"domains can be preemptively loaded into one or more flex caches so that the translation/redirection servers can redirect UE-initiated requests for content (e.g., via an HTTP redirect) to one or more flex caches.",
"For example, if a UE requests content, the redirection/translation server 805 can handle/process that request and determine if the domain associated with the requested content is deemed popular (e.g., by comparing with the list or mapping of domains, comparing against a regular expression, etc.)",
"and, if so, redirect the UE to request content from at least one flex cache.",
"Furthermore, CDN operators, content providers, etc., can employ a centralized and/or regional system to dynamically and strategically distribute such lists/mappings of domains (or regular expressions) to the various redirection/translation servers.",
"According to example embodiments, the suitability of the flex cache for delivering the content may be based on factors such as, for example, whether the flex cache already has a copy (or at least a portion) of the requested content, the proximity of the flex cache to the client/UE (physically and/or logically), network conditions within the wireless network, global or local popularity of the content, content size, content type, transmission protocol, data format, information associated with the client or user equipment, etc.",
"Redirect/translation server 805 can become aware of where or how content is stored within the wireless network via updates (e.g., push or pull) from the flex caches (e.g., either individually or via a hierarchical flow of information) or from the CDN devices in the Internet 101 (e.g., CDN DNS 201 or CDN caches 120).",
"FIG.",
"9 depicts an example network environment 900 similar to the example network environment 800 of FIG.",
"8, and further comprises one or more redirection/translation servers 905 situated at or between SGSN 720 and RNCs 725 (e.g., within the RNC backhaul network 710).",
"In addition to a flex cache hierarchical structure, example network environment 900 further represents a redirection/translation server hierarchical structure.",
"As such, redirection/translation server functionality can be utilized at various levels/tiers/depths/etc.",
"within the wireless network.",
"FIG.",
"9 additionally shows an on-air cache 910 in communication with a flex cache 750 associated with an RNC 725.According to an example embodiment, the on-air cache 910 serves as a sort of hotspot for UEs 735 (e.g., Wi-Fi at airports, stadiums, malls, hotels, office buildings, etc.",
"), wherein the on-air cache 910 can cache and serve various content in accordance with techniques described herein.",
"The on-air cache 910 has similar access network deep caching functionality and provides similar advantages as the shared caches and in home caches described above.",
"For example, in one embodiment the on-air cache 910 preemptively (or proactively) pre-fetches popular content using algorithms as previously described with respect to FIGS.",
"6B-6D.",
"In another example embodiment, UEs 735 send (e.g., broadcast) their content requests to both Node Bs 730 and on-air caches 910.If the request is serviceable by the on-air cache 910 (i.e., the on-air cache has a copy of the content or the content is deemed to be adequately popular to merit replication at the on-air cache), UEs 735 can bypass the cellular/mobile network (i.e., the request and/or content would not necessarily have to traverse most if not all of the cellular/mobile network) by having their requested content served locally via the on-air cache 910.An anycast scheme is further contemplated for request routing/handling among Node Bs 730 and on-air caches 910.Note that although the on-air cache 910 is depicted as being communicatively coupled to a flex cache 750 of an RNC 725 in this example embodiment, it is contemplated that the on-air cache 910 can also be communicatively coupled to the CDN via any other flex cache, CDN cache, or similar device over any part of a wireless and/or wireline network.",
"FIG.",
"10 depicts an example network environment 1000 that represents various data flows (e.g., data plane or content flows, control/service plane or inter-cache communications flows, etc.)",
"among respective flex cache hierarchical levels within the wireless network.",
"Although not shown in FIG.",
"10, assume that the example data flows (represented by the perforated lines) apply to redirection/translation server hierarchical levels within the wireless network as well.",
"Such data flows can include, for example, redirection of content requests, content request hand-offs among flex caches (e.g., transparent to UEs), peer requests/fills among flex caches, distribution/maintenance of CDN policies, awareness information (e.g., how or where content is stored, network conditions, etc.",
"), and the like.",
"Furthermore, Node Bs 730 may communicate with one another (e.g., peer requests/fills, distributed storage of content, etc.)",
"by way of a White Space Wi-Fi or one or more of any other available and/or suitable wireless spectrums.",
"Similar to the embodiments described with respect to FIG.",
"3, it is contemplated that a plurality of proximately situated flex caches (preferably in the same hierarchical tier) can form a community of shared caches having a master flex cache and subordinate flex caches.",
"Likewise, it is also contemplated that a plurality of proximately situated UEs (preferably associated/in communication with the same Node B 730) can form a community of shared caches having a master UE and subordinate UEs.",
"In such a configuration, the UEs could request, store, and serve/distribute content amongst one another (i.e., independent from the CDN or flex caches) in a similar fashion as the community of shared caches previously described.",
"Note that the placement/configuration of the flex caches and/or redirect/translation servers (or any device, system, module, software/executable code, etc., having functionality consistent with embodiments herein) within a wireless network is not limited to the example network environments of FIGS.",
"7-10, and it should be appreciated and understood that zero or more of such flex caches and/or redirection/translation servers (and/or functionality associated therewith) can be situated at/configured in any of the various logical and physical locations within a wireless, mobile, satellite, etc., network, or at any point where requests can be routed to an origin server.",
"It should also be appreciated and understood that the flex caches can additionally perform some or all of the functionality of the redirection/translation servers and/or CDN DNS servers as described herein.",
"Although the present invention has been described with reference to various embodiments, it will be understood that the invention is not limited to the details thereof.",
"Various modifications and substitutions will occur to those of ordinary skill in the art.",
"All such substitutions are intended to be embraced within the scope of the invention as defined in the appended claims."
]
] |
Patent_15871417
|
[
[
"METHODS AND SYSTEMS FOR HIGH RESOLUTION MELT ANALYSIS OF A NUCLEIC ACID SEQUENCE",
"Described herein are methods and systems for analyzing and visualizing HRM data from a double-stranded nucleic acid.",
"The HRM data is generally characterized by a plurality of data points each including a signal value associated with the concentration of a double-stranded nucleic acid in a sample and a temperature value associated with a the temperature of the sample.",
"Embodiments of the invention analyze the HRM curves from samples using the first negative derivative of the HRM curve or a virtual standard.",
"The first negative derivative plot method may be used to identify the melting temperature of a homogenous double-stranded nucleic acid in a sample, as well as the presence and melting temperature of heterogeneous double-stranded nucleic acids in the sample.",
"Data points associated with the melting temperature are plotted on a scatter plot for analysis.",
"The virtual standard allows for visualization of HRM data across data sets."
],
[
"1.A method of visualizing HRM data from one or more samples wherein the HRM data is characterized by a plurality of data points each including a signal value associated with the concentration of a double-stranded nucleic acid in a sample and a temperature value associated with a the temperature of the sample, the method comprising: generating a HRM curve from the HRM data for each sample; providing a virtual standard; and plotting the differences between the HRM curve for each sample and the virtual curve.",
"2.A method of visualizing HRM data from one or more samples wherein the HRM data is characterized by a plurality of data points each including a signal value associated with the concentration of a double-stranded nucleic acid in a sample and a temperature value associated with a the temperature of the sample, the method comprising: generating a HRM curve from the HRM data for each sample; providing a virtual standard; plotting the first negative derivative of the HRM curve for each sample and plotting the differences between the first negative derivative plot for each sample and the virtual curve.",
"3.The method of claim 1 wherein the virtual standard comprises: averaging the signal across the HRM curves for each sample to result in a virtual standard curve.",
"4.The method of claim 3 further comprising, prior to averaging the signal values across the HRM curves for each sample, at least one of smoothing the HRM for each sample, removing exponential decay from the HRM curve for each sample; and normalizing the HRM curves for each sample to one another.",
"5.The method of claim 1 wherein the virtual standard comprises calculating a theoretical melting profile of a target double-stranded nucleic acid to generate the virtual standard.",
"6.The method of claim 1 wherein the virtual standard comprises providing a formula to calculate the virtual standard wherein the variables in the formula are adjustable to define end points of the exponential region, a maximum slope for the exponential region, inclusion of desired inflection points in the exponential region, and combinations thereof.",
"7.The method of claim 1 wherein the providing the virtual standard comprises providing a spline curve in a sigmoidal shape, wherein the shape of the spline curve may be altered by the user using a computer interface."
],
[
"<SOH> BACKGROUND <EOH>High resolution melt (HRM) analysis allows for the detection of mutations, polymorphisms, and epigenetic differences in double-stranded nucleic acids in a sample without sequencing the nucleic acids.",
"Typically, for HRM analysis, a target nucleic acid sequence is amplified using the polymerase chain reaction (PCR) technique in the presence of a reporter molecule, such as a fluorescent dye, that selectively fluoresces when associated with a double-stranded nucleic acid.",
"It has been observed that the signal produced from monitoring the slow melt of a double-stranded nucleic acid, such as an amplified DNA sequence, follows a generally sigmoidal pattern in which the signal level decreases as a function of temperature.",
"The shape of the HRM curve and the melt temperature, i.e., the temperature at which the signal exhibits the greatest amount of change, is determined by the specific sequence of nucleotides composing double-stranded nucleic acid.",
"Samples having mixtures of double-stranded nucleic acids, such as occurs with a heterogeneous sample, or samples having one or more mutations, will exhibit changes in the shape of the HRM curve and/or a shift in the melting temperature.",
"Existing HRM analysis is done by use of difference plot visualization, in which the changes in signal level of a data set from a first sample is used as a baseline, and the difference from data sets from other samples to the baseline is plotted across the entire temperature range.",
"While this method can allow for the grouping of similar double-stranded nucleic acids, the results can be difficult to analyze, the view of the results is dependent upon the data chosen as the baseline, and automated grouping algorithms can be difficult to construct or can be confused by the baseline choice thus leading to different results.",
"A need for a better method of analyzing HRM data was thus identified."
],
[
"<SOH> BRIEF SUMMARY <EOH>Before HRM analysis was available, the temperature resolution of instruments was not able to distinguish small changes in double-stranded nucleic acid melt temperature such as those caused by single nucleotide changes.",
"Even after HRM capable instruments have become available, melt temperature information has not been considered informative enough as melt temperature of a heterozygote sample may be very close to homozygote melt temperature.",
"However, the when melt temperature data is combined with other information such as at least one of a peak height value, a peak width value, or an area under the curve value, discrimination between the melt temperatures from double stranded nucleic acids is greatly enhanced.",
"Described herein are methods and systems for analyzing and visualizing HRM data from a double-stranded nucleic acid utilizing data points associated with the HRM data that includes a combination of the melt temperature and at least one of a peak height value, a peak width value and/or an area under the curve value.",
"The HRM data is generally characterized by a plurality of data points each including a signal value associated with the concentration of a double-stranded nucleic acid in a sample and a temperature value associated with a the temperature of the sample.",
"Embodiments of the invention analyze the HRM curves of samples using the first negative derivative of the HRM curve or by difference plot visualization of the HRM data using a virtual standard.",
"In one embodiment, the method includes generating a HRM curve from the HRM data for each sample and plotting the first negative derivative of the HRM curves.",
"The melt peak for each sample is identified from the first negative derivative plot for each sample and analyzed.",
"In an embodiment, the melt peak, which represents the melt temperature for the sample, is identified as the data point along the first negative derivative plot having the greatest distance from the x-axis.",
"In an alternative embodiment, a Gaussian probability function is fit to the first negative derivative plot and the melt peak is the data point along the Gaussian probability function having the greatest distance from the x-axis.",
"In another alternative embodiment, the Gaussian probability function is subtracted from the first negative derivative curve and a second melt peak from the subtracted data set is identified.",
"Additional melt peaks can be identified with additional Gaussian probability subtraction steps.",
"In another alternative embodiment, HRM curves from at least two samples are normalized relative to one another.",
"The first negative derivative is then plotted for the normalized HRM curves for each sample and the melt peaks for each sample are identified and analyzed.",
"In an alternative embodiment, the melt peak is identified for a first negative derivative plot and the width of the plot is calculated at a fraction of the melt peak height.",
"A data point having a temperature value and at least one of a width value or a peak height value is then analyzed, such as by plotting on a scatter plot.",
"Another aspect of the invention is directed to improved methods of visualizing HRM data for one or more samples by generating a HRM curve for each sample, providing a virtual standard, and plotting the differences between the HRM curve for each sample and the virtual curve.",
"An alternative embodiment further includes plotting the first negative derivative of the HRM curve and the virtual standard and then plotting the differences between the first negative plot for each sample and the virtual curve.",
"The virtual curve can be provided using a number of techniques.",
"In one embodiment, the signal values for the virtual curve are derived from the averages of the signal values for the HRM curves from the samples.",
"In another embodiment, the virtual curve is a derived from the theoretical melting profile of a target double-stranded nucleic acid.",
"In yet another embodiment, the virtual curve is calculated from a formula with variables that may be adjusted by the user.",
"In a further embodiment, the virtual standard includes a spline curve in a sigmoidal shape that may be altered by the user using a computer interface."
],
[
"CROSS-REFERENCE TO RELATED APPLICATIONS This application is a divisional application of U.S. patent application Ser.",
"No.",
"13/799,139 filed Mar.",
"13, 2013, which claims the benefit of and priority to U.S.",
"Provisional Application No.",
"61/660,581 filed Jun.",
"15, 2012, all of which are incorporated herein by reference.",
"FIELD The present invention relates generally to the analysis of double-stranded nucleic acids and, more particularly, to the high resolution melt analysis of double-stranded nucleic acids.",
"BACKGROUND High resolution melt (HRM) analysis allows for the detection of mutations, polymorphisms, and epigenetic differences in double-stranded nucleic acids in a sample without sequencing the nucleic acids.",
"Typically, for HRM analysis, a target nucleic acid sequence is amplified using the polymerase chain reaction (PCR) technique in the presence of a reporter molecule, such as a fluorescent dye, that selectively fluoresces when associated with a double-stranded nucleic acid.",
"It has been observed that the signal produced from monitoring the slow melt of a double-stranded nucleic acid, such as an amplified DNA sequence, follows a generally sigmoidal pattern in which the signal level decreases as a function of temperature.",
"The shape of the HRM curve and the melt temperature, i.e., the temperature at which the signal exhibits the greatest amount of change, is determined by the specific sequence of nucleotides composing double-stranded nucleic acid.",
"Samples having mixtures of double-stranded nucleic acids, such as occurs with a heterogeneous sample, or samples having one or more mutations, will exhibit changes in the shape of the HRM curve and/or a shift in the melting temperature.",
"Existing HRM analysis is done by use of difference plot visualization, in which the changes in signal level of a data set from a first sample is used as a baseline, and the difference from data sets from other samples to the baseline is plotted across the entire temperature range.",
"While this method can allow for the grouping of similar double-stranded nucleic acids, the results can be difficult to analyze, the view of the results is dependent upon the data chosen as the baseline, and automated grouping algorithms can be difficult to construct or can be confused by the baseline choice thus leading to different results.",
"A need for a better method of analyzing HRM data was thus identified.",
"BRIEF SUMMARY Before HRM analysis was available, the temperature resolution of instruments was not able to distinguish small changes in double-stranded nucleic acid melt temperature such as those caused by single nucleotide changes.",
"Even after HRM capable instruments have become available, melt temperature information has not been considered informative enough as melt temperature of a heterozygote sample may be very close to homozygote melt temperature.",
"However, the when melt temperature data is combined with other information such as at least one of a peak height value, a peak width value, or an area under the curve value, discrimination between the melt temperatures from double stranded nucleic acids is greatly enhanced.",
"Described herein are methods and systems for analyzing and visualizing HRM data from a double-stranded nucleic acid utilizing data points associated with the HRM data that includes a combination of the melt temperature and at least one of a peak height value, a peak width value and/or an area under the curve value.",
"The HRM data is generally characterized by a plurality of data points each including a signal value associated with the concentration of a double-stranded nucleic acid in a sample and a temperature value associated with a the temperature of the sample.",
"Embodiments of the invention analyze the HRM curves of samples using the first negative derivative of the HRM curve or by difference plot visualization of the HRM data using a virtual standard.",
"In one embodiment, the method includes generating a HRM curve from the HRM data for each sample and plotting the first negative derivative of the HRM curves.",
"The melt peak for each sample is identified from the first negative derivative plot for each sample and analyzed.",
"In an embodiment, the melt peak, which represents the melt temperature for the sample, is identified as the data point along the first negative derivative plot having the greatest distance from the x-axis.",
"In an alternative embodiment, a Gaussian probability function is fit to the first negative derivative plot and the melt peak is the data point along the Gaussian probability function having the greatest distance from the x-axis.",
"In another alternative embodiment, the Gaussian probability function is subtracted from the first negative derivative curve and a second melt peak from the subtracted data set is identified.",
"Additional melt peaks can be identified with additional Gaussian probability subtraction steps.",
"In another alternative embodiment, HRM curves from at least two samples are normalized relative to one another.",
"The first negative derivative is then plotted for the normalized HRM curves for each sample and the melt peaks for each sample are identified and analyzed.",
"In an alternative embodiment, the melt peak is identified for a first negative derivative plot and the width of the plot is calculated at a fraction of the melt peak height.",
"A data point having a temperature value and at least one of a width value or a peak height value is then analyzed, such as by plotting on a scatter plot.",
"Another aspect of the invention is directed to improved methods of visualizing HRM data for one or more samples by generating a HRM curve for each sample, providing a virtual standard, and plotting the differences between the HRM curve for each sample and the virtual curve.",
"An alternative embodiment further includes plotting the first negative derivative of the HRM curve and the virtual standard and then plotting the differences between the first negative plot for each sample and the virtual curve.",
"The virtual curve can be provided using a number of techniques.",
"In one embodiment, the signal values for the virtual curve are derived from the averages of the signal values for the HRM curves from the samples.",
"In another embodiment, the virtual curve is a derived from the theoretical melting profile of a target double-stranded nucleic acid.",
"In yet another embodiment, the virtual curve is calculated from a formula with variables that may be adjusted by the user.",
"In a further embodiment, the virtual standard includes a spline curve in a sigmoidal shape that may be altered by the user using a computer interface.",
"BRIEF DESCRIPTION OF SEVERAL VIEWS OF THE DRAWINGS The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate various embodiments of the invention and, together with a general description of the invention given above and the detailed description of the embodiments given below, serve to explain the embodiments of the invention.",
"FIG.",
"1A is a graph illustrating an exemplary HRM curve in accordance with embodiments of the invention.",
"FIG.",
"1B is a graph illustrating an exemplary plot of the first negative derivative of the HRM curve of FIG.",
"1A in accordance with embodiments of the invention.",
"FIG.",
"1C is a graph illustrating a first and a second Gaussian distribution curve fit to the exemplary plot of the first negative derivative of a the HRM curve of FIG.",
"1B in accordance with embodiments of the invention.",
"FIG.",
"1D is a scatter plot of data points derived from a first negative derivative plot in accordance with embodiments of the invention.",
"FIG.",
"2 is a flow chart illustrating a process of analyzing HRM data in accordance with embodiments of the invention.",
"FIG.",
"3 is a flow chart illustrating a process for generating a HRM curve in accordance with embodiments of the invention.",
"FIG.",
"4 is a flow chart illustrating a process of analyzing HRM data in accordance with embodiments of the invention.",
"FIG.",
"5 is a flow chart illustrating a process of analyzing HRM data in accordance with embodiments of the invention.",
"FIG.",
"6 is a flow chart illustrating a process of analyzing HRM data in accordance with embodiments of the invention.",
"FIG.",
"7 is a flow chart illustrating a process of analyzing HRM data in accordance with embodiments of the invention.",
"FIG.",
"8A is a graph illustrating a process for visualizing HRM data in accordance with embodiments of the invention.",
"FIG.",
"8B is a graph illustrating a process for visualizing HRM data on a difference plot in accordance with embodiments of the invention.",
"FIG.",
"9 is a flow chart illustrating a process for visualizing HRM data in accordance with embodiments of the invention.",
"FIG.",
"10 is a flow chart illustrating a process for visualizing HRM data in accordance with embodiments of the invention.",
"FIG.",
"11 is a flow chart illustrating a process for generating a virtual standard in accordance with embodiments of the invention.",
"FIG.",
"12 is a flow chart illustrating a process for generating a virtual standard in accordance with embodiments of the invention.",
"FIG.",
"13 is a block diagram of a computer system in accordance with embodiments of the invention.",
"FIG.",
"14A is a graph illustrating HRM curves with the exponential decay removed in accordance with embodiments of the invention.",
"FIG.",
"14B is a graph illustrating the HRM curves of FIG.",
"14A after being normalized in accordance with embodiments of the invention.",
"FIG.",
"14C is a graph illustrating a plot of the first negative derivative of the normalized HRM curves of FIG.",
"14B in accordance with embodiments of the invention.",
"FIG.",
"14D is a scatter plot of data points derived from the graph of FIG.",
"14C in accordance with embodiments of the invention.",
"FIG.",
"15A is a graph illustrating a plot of the first negative derivative of the HRM curves from a homogenous and heterogeneous double-stranded nucleic acid in accordance with embodiments of the invention.",
"FIG.",
"15B is a scatter plot of melt peak data points derived from the graph of FIG.",
"15A in accordance with embodiments of the invention.",
"FIG.",
"15C is a scatter plot of peak width data points derived from the graph of FIG.",
"15A in accordance with embodiments of the invention.",
"DETAILED DESCRIPTION Complimentary strands of nucleic acids form relatively stable double strands of nucleic acids at lower temperatures.",
"As the temperature of a sample containing a double-stranded nucleic acid is increased, the double-stranded nucleic acid melts into two single strands.",
"Similarly, as the temperature of a sample containing complimentary single strands of nucleic acid is decreased, the complimentary nucleic acids will reassociate into double-stranded nucleic acids.",
"The melt temperature of a double-stranded nucleic acid, i.e., the temperature at which a nucleic acid transitions between a double-stranded nucleic acid and a pair of single strands, is determined by the length and sequence of the nucleic acid strands.",
"Differences between two or more double-stranded nucleic acids, such as double-stranded nucleic acids amplified using polymerase chain reaction (PCR), may be inferred by observing and analyzing the high resolution melting or high resolution reassociation of the double-stranded nucleic acids over a range of temperatures.",
"As used herein, the terms “high resolution melting” or “high resolution melt” are understood to include both high resolution melt and high resolution reassociation.",
"With reference to FIG.",
"1A, and in accordance with embodiments of the invention, an improved method of analyzing high resolution melt (HRM) data includes analyzing data collected from the high resolution melting of a sample that includes at least one amplified double-stranded nucleic acid wherein the data is characterized by an ascending HRM curve 10.Similarly, the HRM data may be collected from the high resolution reassociation of a sample that includes complimentary single strands of a double-stranded nucleic acid.",
"The HRM data from high resolution reassociation data is characterized by a descending HRM curve (not shown).",
"The HRM curve 10 includes a temperature value along the x-axis and a signal value representative of the concentration of double-stranded nucleic acid in the sample at a given temperature value along the y-axis.",
"In an exemplary embodiment, the temperature value is expressed in degrees Celsius and the signal value is expressed as relative fluorescent units (RFU's).",
"In an exemplary embodiment, the signal value for a sample is obtained with a reporter molecule that selectively fluoresces when associated with a doubled stranded nucleic acid.",
"Thus, the signal value, i.e., the level of fluorescence observed in a sample, is indicative of the concentration of double-stranded nucleic acid in the sample.",
"Reporter molecules useful with embodiments of the invention described herein are those that selectively provide a signal, such as a fluorescent signal, when associated with a double-stranded nucleic acid.",
"For example, fluorescent double-stranded nucleic dyes used in real time PCR reactions may be used.",
"Exemplary reporter molecules include SYBR® Green I, SYBR® Gold, PicoGreen 0 (each available from Invitrogen), and LC Green®, Eva Green, Melt Doctor, SYTO®-9, SYTO®-13, SYTO®-16, SYTO®-60, SYTO®-62, SYTO®-64, SYTO®-82, POPO-3, TOTO-3, PO-PRO-3, TO-PRO-3, YO-PRO®-1, SYTOX® Orange, BEBO, BOXTO, Chromofy, as well as other reporter molecules that selectively fluoresce when associated with double-stranded nucleic acids.",
"In addition to the use of reporter molecules that selectively associate with double stranded nucleic acids, the reporter molecules may also be associated with fluorescent probes or primer based systems.",
"As used herein, the term reporter molecule is understood to include any system, molecule, probe, dye, or combination thereof that is capable of generating a signal that corresponds to the concentration of double-stranded nucleic acid in a sample at a particular temperature.",
"For high resolution melting, the signal value is obtained from measurements taken at predetermined increments as the temperature of the sample is slowly increased from a temperature at which substantially all of the complementary nucleic acid strands in the sample are in the double-stranded state, to a temperature at which no double-stranded nucleic acid is detectable with the reporter molecule.",
"For high resolution reassociation, the signal value is obtained from measurements taken at predetermined increments as the temperature of the sample is slowly decreased from a temperature at which substantially all of the complementary nucleic acid strands in the sample are in the single-stranded state, to a temperature at which substantially all of the nucleic acid is in a double-stranded state as detected with the reporter molecule.",
"Typically, the signal value is measured over a range of temperatures from about 60 degrees Celsius to about 95 degrees Celsius; however, the temperature range may be increased or decreased as needed to analyze a specific nucleic acid sequence.",
"In accordance with embodiments of the invention, the signal value is obtained as the temperature increases by fractions of a degree over at least a portion of the melting temperature range.",
"In an embodiment, the signal value is obtained at about every 0.1 degrees Celsius over at least a portion of the melting temperature range.",
"In an alternative embodiment, the signal value is obtained at about every 0.2 degrees Celsius over at least a portion of the melting temperature range.",
"In an alternative embodiment, the signal value may be obtained at about every 0.04 degrees Celsius to about 5.0 degrees Celsius over at least a portion of the melting temperature range.",
"With reference to FIG.",
"1A, the data obtained from HRM analysis of a double-stranded nucleic acid generally forms a sigmoid shaped curve 10 having a saturation region 12, a region of exponential melting 14, and a background region 16.The saturation region 12 is a relatively flat region typically at lower temperature values in the curve 10 and characterized by high signal values because the double-stranded nucleic acid concentration in the sample is constant because at these temperatures the concentration of double-stranded nucleic acid in the sample does not change thus there is no change in the signal generated by the reporter molecule.",
"In some embodiments, the double-stranded nucleic acid is saturated with reporter molecules whereas in other embodiments, the double-stranded nucleic acid is not saturated.",
"The region of exponential melting 14 is the central region of the curve 10 wherein the signal value generated by the reporter molecule changes in relation to exponential changes in the concentration of double-stranded nucleic acid as the double-stranded nucleic acid melts or reassociates with changes in the temperature.",
"The background region 16 is a relatively flat region typically at higher temperature values.",
"In the background region 16, the concentration of double-stranded nucleic acids in the sample is reduced to levels that the signal from the reporter molecule associated with double-stranded nucleic acids cannot overcome the background signals in the reaction chamber.",
"HRM curves, such as shown in FIG.",
"1A, are generally analyzed to determine if two or more samples include identical or different double-stranded nucleic acid sequences.",
"To make this determination, HRM curves from two or more samples are typically analyzed for differences between the curves from the samples.",
"Differences between HRM curves generated from the samples may be observed as differences in the melt temperature of the double-stranded nucleic acids from the samples, differences in the shape of the HRM curves, or differences in both the melt temperatures and the shapes of the HRM curves.",
"The melt temperature is the temperature at which the greatest amount of double-stranded nucleic acid melts.",
"For HRM curve analysis, the melt temperature is the temperature at which the absolute value of the slope in the region of exponential melting 14 is the greatest.",
"In contrast to routine methods of analyzing HRM data, embodiments of the invention analyze the HRM curves of samples using a plot of the first negative derivative of the HRM curves or the visualization of HRM data using a virtual standard.",
"Embodiments of these methods are referred to herein as the “derivative plot methods” of FIGS.",
"1A-7 and the “virtual standard methods” of FIGS.",
"8A-12.With reference to FIG.",
"2, the derivative plot methods generally include the generation of a HRM curve (block 20), plotting the first negative derivative of the HRM curve (block 22), identifying a melt peak of the first negative derivative plot (block 24), and analyzing the melt peak (26).",
"FIG.",
"1A illustrates an exemplary HRM curve 10.FIG.",
"3 illustrates an exemplary method of generating an HRM curve for analysis in accordance with embodiments of the invention.",
"First, a HRM curve is plotted utilizing HRM data gather from the high resolution melting or high resolution reassociation of a sample containing a double-stranded nucleic acid and a reporter molecule (block 28).",
"The HRM data includes a series of data points having a signal value and a temperature value.",
"The HRM data may be obtained from an HRM analysis system, such as one that includes a thermal cycler for heating and/or cooling the sample in a controlled manner and an optical system for obtaining signal values as the sample is heated or cooled.",
"With continued reference to FIG.",
"3, the HRM data may optionally be internally smoothed (block 30), have the exponential decay removed (block 32), or may be both internally smoothed (block 30) and have the exponential decay removed (block 32).",
"The internal smoothing process (block 30) may employ any process that internally removes insignificant variations in the data that are not associated with changes in the concentration of double-stranded nucleic acid.",
"For example, in one embodiment, the smoothing process employs a rolling average method that averages the product values for a plurality of consecutive data points from the HRM data.",
"In another embodiment, the data are smoothed with a Savitzky-Golay smoothing filter by fitting an nth degree polynome to a plurality of consecutive data points and calculating a smoothed product value for one or several data points with the plurality of data points.",
"In one embodiment, the user may optionally designate the number of data points used for the rolling average.",
"The exponential decay removal (block 32) process removes decreasing signal value trends that are not related to changes in the double-stranded nucleic acid concentration.",
"Exponential decay can be removed by known processes, such as mathematical processes that calculate the amount of decay observed in the saturation region 12 (FIG.",
"1A).",
"For example, a line segment may be fit by linear regression to a subset of data points in the saturation region.",
"The slope of the line segment may then be used to correct the HRM curve 10.In another example, the exponential decay is removed from the curve directly by multiplying the measured melting curve by a correction function which is exponentially dependent on the temperature.",
"After generating the HRM curve, the first negative derivative is plotted for the HRM curve (block 32 of FIG.",
"2) and the first negative derivative plot is analyzed to identify its melt peak (block 46).",
"FIG.",
"1B an exemplary first negative derivative plot 34.The first negative derivative plot 34 of a homogenous sample, i.e., a sample that mostly contains complimentary double-stranded nucleic acids, has five regions: (1) a first background region 38, (2) a ascending region 40, (3) a melt peak 36, and (4) a descending region 42, and (5) a background region 44.The first negative derivative curve of a heterogeneous sample, i.e., a sample that includes two or more different nucleic acids, will have two or more melt peaks associate with the two or more nucleic acids, but the two or more melt peaks may mask one another such that the first negative derivative curve of the heterogeneous sample also appears to have the same five regions.",
"The first and second background regions 38, 44 of the first negative derivative plot 34 of FIG.",
"1B correspond to the saturation region 12 and background region 16, respectively, of the HRM curve 10 of FIG.",
"1A.",
"The ascending region 40 and the descending region 42 of the first negative derivative plot 34 of FIG.",
"1B correspond to portions of the exponential melting region 14 of the HRM curve 10 of FIG.",
"1A.",
"The melt peak 36 of the first negative derivative plot 34 of FIG.",
"1B corresponds to the point along the exponential melting region 14 of FIG.",
"1A having the steepest slope, i.e., the melt temperature.",
"As illustrated in FIG.",
"1B, in an embodiment, the melt peak 36 is represented in the first negative derivative plot 34 as the data point having the greatest amplitude, i.e., the greatest distance h from the x-axis where the x-axis value is zero.",
"The melt peak has a height value that corresponds to the first negative derivative of the signal value and a temperature value that corresponds with the melt temperature for the sample.",
"The melt peaks from one or more samples may then be analyzed (block 26 of FIG.",
"2), as discussed in greater detail below.",
"In an alternative embodiment, illustrated in FIGS.",
"1C and 4, the melt peak 36 is identified from a Gaussian probability function 52 that is fit to the first negative derivative curve 34.A HRM curve is generated with HRM data from a sample (block 20) and the first negative derivative of the HRM curve is plotted (block 22).",
"A Gaussian probability function 52 is then fit to the first negative derivative curve 34 (block 54).",
"The peak of the first Gaussian probability function 52 is identified as the melt peak 36, i.e., the point along the function 52 having the greatest amplitude, i.e., the greatest distance h from the x-axis where the x-axis value is zero (block 56).",
"The melt peak data point may then be analyzed (block 58), as discussed in greater detail below.",
"The melt peak data point from a first sample may be compared with the melt peak(s) of one or more other samples, or compared to known standard values, to determine if the sequences of the samples are the same or different.",
"If the melt peaks from the one or samples are different from one another, i.e., have a different signal value, a different temperature value, or both the signal value and the temperature value are different, then the sequences of the nucleic acids in the samples are not identical.",
"In contrast, if the melt peaks from the sample are the same, then the sequences of the nucleic acids in the samples are likely to be the same.",
"Processes for analyzing the melt peaks are discussed in greater detail below.",
"Comparing the peak values between samples can be difficult due to variability in the peak values that is not associated with the double-stranded nucleic acids in the samples.",
"For example, the melt peak values can vary due to the position of the reaction well on the thermal block or due to inaccuracies in measuring the reagents used in the analysis.",
"In an embodiment illustrated in FIG.",
"5, the HRM curves from a plurality of samples are normalized before plotting the first negative derivative for each HRM curve to account for at least a portion of the variability in the melt peaks that is not associated with the double-stranded nucleic acids in the samples.",
"Normalizing the HRM curves results in first negative derivative plots that have identical areas under the curves.",
"Because the area under the curve for the normalized plots are identical, any significant difference in the melt peaks for each plot indicates a difference in the shapes of the underlying HRM curves and, correspondingly, indicates a difference in the double-stranded nucleic acids from which the HRM curves originate.",
"For this embodiment, HRM curves are generated from the HRM data for each sample (block 60).",
"The HRM curves may optionally be internally smoothed and the exponential decay removed as previously described.",
"The HRM curves are then normalized relative to one another (block 62, as discussed below).",
"The first negative derivative is plotted for each of the normalized HRM curves (block 64) and the melt peaks are identified for the first negative derivative plot from the normalized HRM curves for each sample (block 66).",
"The melt peaks are plotted as data points on a scatter plot (block 68).",
"The melts peaks for each sample may then be analyzed to determine if they are the same or different (block 70).",
"This method has the advantage of distinguishing melt peaks that have very similar melt temperatures, but different HRM curve shapes.",
"In a variation of this embodiment, a Gaussian probability function is fit to the first negative derivative plot and the melt peak is identified as the peak of the Gaussian probability function, as described above with reference to FIG.",
"4.HRM data may be normalized by any process that normalizes the data along the thermal axis (x-axis), the signal axis (y-axis) or along both the thermal axis and the signal axis.",
"For thermal axis normalization, each HRM curve is shifted on the thermal axis based its location on the thermal block as determined by the thermal characteristics of the thermal block.",
"For example, the detected melt temperature for each well may be multiplied by a standard adjustment multiplier that corresponds to the typical variation of that well from the mean of the block.",
"The signal axis may be normalized based on user defined areas of interest in the saturation region and the background regions or preliminary areas of interest in these regions may be automatically calculated.",
"In one embodiment, the areas of interest are identified from a first negative derivative plot of the HRM curve.",
"The areas of interest are the areas of the first negative derivative plot having low values that correspond to areas of the HRM curves wherein the change in slope is small.",
"The same area of interest is used for all curves being normalized to one another.",
"The average signal value in the areas of interest across all curves being normalized are averaged and set to a first normalized signal value, such as 100, for the area of interest associated with the saturation region, and a second normalized value, such as 0, for the area of interest associated with the background region.",
"The remaining data points are normalized to relative to the first normalized signal value and the second normalized signal value.",
"In addition to providing insights into the similarities and differences of HRM curves generated from different samples, the first negative derivative plot from a sample may be analyzed to identify the presence of two or more peaks in the sample, indicating that the sample includes a heterogeneous mixture of double-stranded nucleic acids.",
"FIGS.",
"1C and 6 illustrates a method in accordance with embodiments of the invention to identify two or more melt peaks indicative of two or more double-stranded nucleic acid products in the sample, such as occurs with PCR reactions using primers that amplify multiple gene products.",
"First, a HRM curve is generated (block 20), as discussed above and a first negative derivative of the HRM curve is plotted (block 22).",
"A first Gaussian probability function 52 is fit to the first negative derivative plot (block 76).",
"The peak of the Gaussian probability function is identified as the melt peak data point (block 78).",
"The first Gaussian probability function is subtracted from the first negative derivative plot 34 (block 80) and a second Gaussian probability function 82 is fit (block 84) to subtracted curve.",
"In one embodiment, the second Gaussian probability function 82 has a second melt peak 85 if the peak of the second Gaussian probability function 82 is significantly different from the first and second background regions 38, 40 (block 86), and the process is repeated until no further peaks are detected (block 88).",
"In another embodiment, the second Gaussian probability function 82 has a second melt peak 85 if the peak of the second Gaussian probability function 82 is greater than a threshold that is calculated based on the saturation and background regions 38, 40.In an embodiment, up to four melt peaks may be identified with this process.",
"The melt peaks are then analyzed by plotting on a scatter plot (block 90).",
"In another embodiment illustrated in FIG.",
"7, the width of the first negative derivative plot at a fraction of the peak height is calculated and used to distinguish HRM curves between samples.",
"For example, a HRM curve is generated from HRM data for each sample (block 94).",
"The HRM curve 10 may be smoothed and the exponential decay removed as shown in FIG.",
"1A.",
"The HRM curves are normalized to one another (block 96) and the first negative derivative is plotted for the normalized HRM curves for each sample (block 98).",
"The melt peak is identified for each sample as discussed above (block 100).",
"The width of the first negative derivative plot at a specified fraction of the melt peak height is calculated or measured (block 102).",
"In one embodiment, the width is determined at about fifty percent of the melt peak height.",
"In an alternative embodiment, the width is determined at an optimum fraction of the melt peak height that is selected from the range between about 15 percent and about 85 percent of the melt peak height.",
"The same fraction of the melt peak height is used to calculate or measure the width of the HRM curves across all samples.",
"In one embodiment, the width of the first negative derivative plot and the melt temperature, i.e., the temperature value from the melt peak, is plotted on a two dimensional scatter plot (block 104).",
"In an alternative embodiment, the signal value from the melt peak is plotted along with the width value and the temperature value in a three dimensional scatter plot (block 104).",
"The data points on the scatter plots are then analyzed (block 106) as discussed below.",
"In another embodiment, also illustrated in FIG.",
"7, the area under the curve (AUC) of the first negative derivative plot is calculated at a fraction of the peak height and used to distinguish HRM curves between samples.",
"For example, a HRM curve is generated from HRM data for each sample.",
"The HRM curves may be smoothed and the exponential decay removed (not shown).",
"The HRM curves are normalized to one another (block 96) and the first negative derivative is plotted for the normalized HRM curves for each sample (block 98).",
"The melt peak is identified for each sample as discussed above (block 100).",
"The AUC of the first negative derivative plot is calculated or measured (block 102) at a specified fraction of the melt peak height.",
"In one embodiment, the AUC is determined at about fifty percent of the melt peak height.",
"In an alternative embodiment, the AUC is determined at an optimum fraction of the melt peak height that is selected from the range between about 15 percent and about 85 percent of the melt peak height.",
"The same fraction of the melt peak height is used to calculate or measure the AUC of the HRM curves across all samples.",
"In one embodiment, the AUC of the first negative derivative plot and the melt temperature, i.e., the temperature value from the melt peak is plotted on a two dimensional scatter plot (block 104).",
"In an alternative embodiment, the signal value from the melt peak is plotted along with the width value or the peak value and the temperature value in a three dimensional scatter plot (block 104).",
"The data points on the scatter plots are then analyzed (block 106) as discussed below.",
"In another embodiment, a Gaussian probability function is fit to the first negative derivative data and the AUC is calculated for the Gaussian probability function.",
"This technique is particularly useful to discriminate data wherein there are multiple peaks contained in the data, such as HRM data obtained from a heterogeneous mixture of double-stranded nucleic acids.",
"In this circumstance, the total AUC will include the AUC from each of the multiple peaks.",
"Thus, the total AUC from a heterogeneous mixture of double-stranded nucleic acids will be greater than the AUC for data from samples having a single peak.",
"Regardless of how the data points are identified in the embodiments described herein, the data points 107 are plotted on a scatter plot for analysis (FIG.",
"1D) and the scatter plot may be displayed on a display (214 of FIG.",
"13).",
"The data points 107 may be plotted on a scatter plot by a computer or other processing system.",
"The scatter plot has a first axis that corresponds to the melt temperature value and at least a second axis that corresponds to one of the peak height value, peak width value, and area under the curve value.",
"In another embodiment, the scatter plot has a third axis that differs from the second axis and corresponds to one of the peak height value, peak width value, and area under the curve value.",
"The data point 107 is plotted as an individual point and multiple data points may form clusters.",
"In some circumstances, different clusters of melt peak data points will be apparent.",
"Alternatively, the clusters of melt peak data points may be further analyzed using cluster grouping algorithms that are capable of distinguishing between different clusters of data points.",
"Cluster algorithm analysis is particularly useful for identifying which clusters to which each melt peak data point belongs or to identify clusters that are not otherwise apparent.",
"Exemplary cluster analysis algorithms include circle analysis algorithms for two-dimensional scatter plots and sphere analysis algorithms for three-dimensional scatter plots.",
"Cluster analysis algorithms allow for much more reliable automated calling of data points than is provided by traditional difference plot analysis.",
"In one embodiment, each melt peak data point on the scatter plot is compared with one or more standards.",
"The standards include known values for one or more target sequences, such as the known values such as temperature value, height value, width value and/or area under the curve for each genotype of a heterogeneous gene.",
"The Euclidian distance between the melt peak data point and the one or more standards is calculated.",
"For samples resulting in the identification of two or more melt peaks, the distances calculated between first identified melt peak data point and the standard value is weighted more heavily than the distances calculated for each subsequent melt peak data point.",
"For example, if a sample yields an HRM curve that results in three melt peaks being identified from the first negative derivative plot, the distance between the first melt peak data point and a standard value receives more weight during the subsequent analysis than the distances calculated for the second melt peak data point, which is subsequently weight more heavily than the distances calculated for the third melt peak data point.",
"In one embodiment, a multiplier is used to weight the first peak more heavily than subsequent peaks.",
"For example, the first peak may be multiplied by a value of four whereas the subsequent melt peaks are multiplied by multipliers decreasing in value, such as three, two, or one.",
"For each data point, a ratio of the weighted distances between the closest standard and the second closest standard may be calculated.",
"The ratio is used to indicate confidence with which a sample may be called as being like one of the first or the second closest standard.",
"The ratio may be converted to a percentage efficiency between 100 percent and about 50 percent to indicate from the standard is calculated.",
"Another aspect of the invention is directed to visualizing HRM data utilizing a virtual standard 110 (FIG.",
"8A).",
"For this aspect, HRM curves 112, 114, 116 (FIG.",
"8A) are generated from HRM data for each sample (FIG.",
"9, block 120).",
"A virtual standard 110 is provided as a baseline (block 122).",
"The virtual standard 110 is subtracted from the HRM curves 112, 114, 116 and the difference is plotted for each sample (block 124) and FIG.",
"8B.",
"Alterations in the virtual standard can result in the visualization of greater differences between the data curves 112, 112′, 114, 114′, 116, 116′ as illustrated in FIG.",
"8B.",
"In an alternative embodiment, the first negative derivative is plotted for the virtual standard and the HRM curves (FIG.",
"10, block 128) and the difference between the first negative derivatives is plotted (block 130) as a difference plot, and analyzed (block 126).",
"As mentioned above, the virtual standard contrasts with methods in routine use wherein an HRM curve from one sample in an experiment is used as a baseline against which other samples in the experiment are compared.",
"Embodiments of the virtual standard are useful when comparing HRM data across experiments and even across different platforms, which contrasts with the routine methods of analyzing HRM data which do not allow for such comparisons.",
"The virtual standard may be generated using a number of techniques as described in the various embodiments below.",
"In each of the virtual standard curve embodiments, the resulting virtual standard curve can then be saved and recalled for use with other data sets.",
"In one embodiment illustrated in FIG.",
"11, the raw HRM data from two or more samples are smoothed (block 136), the exponential decay is optionally removed (block 138), and the HRM data for the samples are normalized relative to one another (block 140).",
"Then, the signal values that correspond to a temperature values for the normalized HRM curves across all of the samples are averaged to generate the virtual standard (block 142).",
"The virtual standard can be used to generate a difference plot between each of the samples as described above.",
"In another embodiment, the virtual standard is a theoretical standardized curve based on the theoretical melting profile of the nucleic acid sequences being analyzed.",
"The theoretical melting profile of a nucleic acid sequence can be based on the known parameters affecting the melt temperature of a double-stranded nucleic acid, such as the percent of each type of nucleic acid, the sequence of the nucleic acids and the length of the nucleic acid strand.",
"For example, Visual OMP™ Nucleic Acid software from DNA Software could be used to generate a theoretical melt profile for a sequence of nucleic acids.",
"In an alternative embodiment, the virtual standards are user defined using a mathematical equation.",
"This is done by allowing the user to define where the exponential region starts or stops, a maximum slope, the inclusion of desired inflection points and combinations thereof for an equation describing a theoretical standard curve.",
"For example, in an embodiment, the user may generate a virtual standard by modifying an ideal melt curve defined by the Formula 1 below by setting the maximum signal value (RFUmax), the minimum signal value (RFUmin) and the melting temperature (Tm), wherein C is the curve parameter describing the steepness of the signal change and Ti is the x-axis value.",
"RFU=RFUmin+RFUmax(1−1/(1+e(C(Tm-Ti))) FORMULA 1: In an another embodiment, the user may generate a virtual standard by combining two weighted, ideal melt curves, such as two ideal curves generated by Formula 1 above.",
"The combined curve is defined by Formula 2 below.",
"In this embodiment, the user may set the maximum signal value (RFUmax), the minimum signal value (RFUmin), the melting temperatures for each curve (Tm1 and T m2) and the steepness of the signal change for each curve (C1 and C2) and the weight given to each curve (W1 and W2).",
"RFU=RFUmin+RFUmax(1−W1/(1+e(C1(Tm1-Ti)))−w2/(1+e(C2(Tm2-Ti)))) FORMULA 2: Virtual curves based on other modifications to ideal curves may be used as well.",
"In an alternative embodiment, a spline curve in a sigmoidal shape similar to a typical melt curve is provided that the user then forms into a desired shape such as by using a computer interface, such as a mouse, to click control the shape of the spline.",
"The user controlled virtual curves allow the user to match details from one or more of the sample HRM curves.",
"By making portions of the virtual standard match the details seen on one or more of the HRM curves generated from the HRM data, while other portions of the virtual standard match portions of other HRM curves, the differences between the HRM curves can be made more obvious than simply picking one curve as a standard could, as was previously done.",
"By allowing the user or the machine to adjust the shape of the virtual standard, some HRM curves in a data set may peak in the difference plot at one temperature, while the peak for other HRM curves would be at a different temperature or be in the negative direction from the first.",
"Additionally, HRM curves that are distinct from those used to construct the virtual standard would exhibit different shapes distinct from the others.",
"The analytical processes of the invention may be embodied as a method, a computer program product that includes program code 200 to execute the method, and/or a computer system 202 configured to execute the method FIG.",
"13.The method includes the steps described herein and illustrated in FIGS.",
"1 to 12 for analyzing HRM data of a nucleic acid.",
"The program code 200 includes instructions executable on a computer system for carrying out the steps of the method.",
"In one embodiment, the program code 200 includes instructions for analyzing HRM data and in particular, code for generating and displaying on a display 214 a scatter plot that includes the data points associated with the melting temperature.",
"The scatter plot has a first axis for plotting the melt value for each data point and a second axis for plotting one of a peak value, a width value, or an area under the curve value for each data point.",
"In another embodiment, the scatter plot has a third axis for plotting a third value for each data point that is the value remaining from the peak value, the width value, and the area under the curve value.",
"Embodiments of the invention, whether implemented as part of an operating system 204, application, component, program code 200, object, module or sequence of instructions executed by one or more processing units 206 are referred to herein as “program code.” The program code 200 typically comprises one or more instructions that are resident at various times in various memory 202 and storage devices 208 in the computer system 200 that, when read and executed by one or more processors 204 thereof cause that computer system 200 to perform the steps necessary to execute the instructions embodied in the program code 200 embodying the various aspects of the invention.",
"While embodiments of the invention are described in the context of fully functioning computing systems 200, those skilled in the art will appreciate that the various embodiments of the invention are capable of being distributed as a program product on a computer readable storage medium.",
"The program product may embody a variety of forms.",
"The invention applies equally regardless of the particular type of computer readable storage medium used to actually carry out the distribution of the program code 200.Examples of appropriate computer readable storage media for the program product include, but are not limited to, non-transitory recordable type media such as volatile and nonvolatile memory devices, floppy and other removable disks, hard disk drives, USB drives, optical disks (e.g.",
"CD-ROM's, DVD's, Blu-Ray discs, etc.",
"), among others.",
"Any of the individual processes described above or illustrated in FIGS.",
"1-12 may be formed into routines, procedures, methods, modules, objects, and the like, as is well known in the art.",
"It should be appreciated that embodiments of the invention are not limited to the specific organization and allocation of program functionality described herein.",
"In addition, the systems for analyzing HRM data may further include a module for collecting the HRM data (i.e.",
"a HRM data generator) 210 and a module for receiving HRM data 212.The HRM data collection module may include a thermal cycler and a device for detecting the signal value, that result from HRM analysis, such as a change in fluorescence from double-stranded nucleic acid over a range of temperatures.",
"HRM data collection modules as known in the art may be used in accordance with the invention.",
"The HRM data receiving module includes components and/or program code to receive HRM data from the HRM data collection module.",
"Example 1 A set of samples representing two homogenous samples types and one heterogeneous mix of the two was run in a PikoReal instrument and analyzed by the melt peak method.",
"For this example, olfactory receptor, family 10, subfamily J, member 5 (OR10J5) amplicons having a single nucleotide polymorphism (G or A) identified as rs4656837 were amplified using a standard PCR protocol in the presence of SYBR Green.",
"After amplification, the samples were slowly heated and fluorescence measured at regular intervals.",
"As shown in FIG.",
"14A, HRM curves 300 were generated for 18 samples and the exponential decay removed.",
"The HRM curves 300 were normalized based on user identified areas of the saturation region 302 and background region 304.FIG.",
"14B illustrates the normalized HRM curves 304.FIG.",
"14C illustrates the first negative derivative plots 320 from the normalized HRM curves of FIG.",
"14B.",
"FIG.",
"14D illustrates a scatter plot of the melt peak data points identified from the first negative derivative plots of FIG.",
"14C.",
"Clusters 330 of data points 332 are observed near each of the three standards 334 (larger circles, S1, S2, and S3 from left to right).",
"These data indicate that the samples include three different mixtures of double-stranded nucleic acids.",
"The first group of samples is homozygous for an amplicon having the G SNP.",
"The second group of sample is homozygous for an amplicon having the A SNP.",
"The third group is a heterozygous mixture of the A and G SNP amplicons.",
"As shown in Table 1, below, the analytical methods described herein clearly distinguish the difference between the homozygous and heterozygous clusters of data points.",
"Samples 1-6 clustered nearest to standard S1 in the upper left hand quadrant of the scatter plot.",
"Samples 7-12 clustered to standard S2 in the central lower region of the scatter plot and samples 13-18 clustered to standard S3 in the upper right region of the scatter plot.",
"By plotting the peak heights on the scatter plot as a function of the melt temperature, the clusters are easily further analyzed such as by determining their Euclidean distance from the first and second closest standards, and calculating the ratio of these distances.",
"The ratio was then used to calculate the percentage efficiency for the sample.",
"TABLE 1 Dist.",
"to Dist to 2d closest closest Ratio of Percentage Sample No.",
"Melt Temp.",
"Peak Height stand.",
"stand.",
"D1/D2 Efficiency 1 78.48 46.22 1 (S1) 111 (S2) 0.01 99.9% 2 78.51 46.33 1.5 (S1) 112 (S2) 0.01 98.7% 3 78.52 46.32 4 (S1) 110 (S2) 0.04 96% 4 78.57 46.34 15 (S1) 107 (S2) 0.14 96.5% 5 78.48 45.34 49 (S1) 72 (S2) 0.68 59.5 6 78.54 45.46 44 (S1) 65 (S2) 0.68 59.6 7 78.70 44.72 6 (S2) 101 (S1) 0.06 94.4 8 78.71 45.02 15 (S2) 87 (S1) 0.17 85.3 9 78.71 44.34 11 (S2) 119 (S1) 0.09 91.5 10 78.72 44.28 9 (S2) 123 (S1) 0.07 93.2 11 78.75 45.22 38 (S2) 87 (S1) 0.44 69.6 12 78.79 44.72 22 (S2) 102 (S3) 0.22 82.3 13 79.11 45.82 26 (S3) 132 (S2) 0.20 83.5 14 79.74 45.53 8 (S3) 125 (S2) 0.06 94 15 79.75 45.13 8 (S3) 119 (S2) 0.07 93.8 16 79.77 45.56 10 (S3) 133 (S2) 0.08 93 17 79.78 46.14 43 (S3) 152 (S2) 0.28 98 18 79.23 46.00 39 (S3) 158 (S2) 0.25 80.2 Example 2 In this example, the peak width was plotted to further discriminate the signal values of the HRM melt curves.",
"When mixed populations of double-stranded nucleic acids were present in the same sample undergoing HRM analysis, they tended to make the resulting HRM curve wider, especially when the difference in the melting temperatures of the individual probes were greater.",
"As observed with the data presented below, this method was found to be particularly useful when analyzing multiplexed reactions.",
"For this example, ToxA and ToxB were amplified using a standard PCR protocol in the presence two Solaris primers and fluorescent probes for ToxA and ToxB in c. difficile.",
"FIG.",
"15A shows data from a qPCR and HRM analysis experiment wherein each probe was used by itself or in combination with the other probe.",
"The data demonstrate that while the ToxA+ToxB curve had a similar melting temperature to the ToxA probe by itself, it is easily distinguished by the peak height (FIG.",
"15B) and the peak width (FIG.",
"15C).",
"While the present invention has been illustrated by the description of specific embodiments thereof, and while the embodiments have been described in considerable detail, it is not intended to restrict or in any way limit the scope of the appended claims to such detail.",
"The various features discussed herein may be used alone or in any combination.",
"Additional advantages and modifications will readily appear to those skilled in the art.",
"The invention in its broader aspects is therefore not limited to the specific details, representative apparatus and methods and illustrative examples shown and described.",
"Accordingly, departures may be made from such details without departing from the scope or spirit of the general inventive concept."
]
] |
Patent_15871420
|
[
[
"Growing III-V Compound Semiconductors from Trenches Filled with Intermediate Layers",
"A method of forming an integrated circuit structure includes forming an insulation layer over at least a portion of a substrate; forming a plurality of semiconductor pillars over a top surface of the insulation layer.",
"The plurality of semiconductor pillars is horizontally spaced apart by portions of the insulation layer.",
"The plurality of semiconductor pillars is allocated in a periodic pattern.",
"The method further includes epitaxially growing a III-V compound semiconductor film from top surfaces and sidewalls of the semiconductor pillars."
],
[
"1.A device comprising: a semiconductor substrate formed of a first semiconductor material; an isolation region over the semiconductor substrate; a first semiconductor region comprising: a first portion extending into the semiconductor substrate, wherein the first portion has a V-shaped bottom surface; a second portion in the isolation region; and a first III-V compound semiconductor region having a portion over the isolation region, wherein the first III-V compound semiconductor region contacts the first semiconductor region.",
"2.The device of claim 1, wherein the second portion of the first semiconductor region comprises: a lower portion formed of a first III-V compound semiconductor; and an upper portion over the lower portion, wherein the upper portion is formed of a second III-V compound semiconductor different from the first III-V compound semiconductor.",
"3.The device of claim 1, wherein a top end of the V-shaped bottom surface joins a top surface of the semiconductor substrate.",
"4.The device of claim 1, wherein the V-shaped bottom surface is lower than a top surface of the semiconductor substrate.",
"5.The device of claim 1, wherein the first III-V compound semiconductor region has a top surface higher than a top surface of the first semiconductor region, and the device further comprises: a patterned dielectric mask over the first III-V compound semiconductor region; and a second III-V compound semiconductor region having a portion over the patterned dielectric mask, wherein the second III-V compound semiconductor region penetrates through the patterned dielectric mask to contact the first III-V compound semiconductor region.",
"6.The device of claim 5, wherein the first III-V compound semiconductor region has a planar top surface, and the patterned dielectric mask contacts the planar top surface of the first III-V compound semiconductor region.",
"7.The device of claim 1, wherein the first semiconductor region further comprises a third portion protruding above the isolation region.",
"8.The device of claim 1, wherein the first semiconductor region has a V-shaped top surface.",
"9.The device of claim 8, wherein the V-shaped top surface has an inverted V-shape in a cross-sectional-view, and is higher than a top surface of the isolation region.",
"10.The device of claim 8, wherein the V-shaped top surface is lower than a top surface of the isolation region.",
"11.A device comprising: a substrate formed of a semiconductor material comprising a group-IV element; a first III-V compound semiconductor region, wherein a bottom portion of the first III-V compound semiconductor region extends into the substrate; an isolation region contacting a sidewall of an upper portion of the first III-V compound semiconductor region; and a second III-V compound semiconductor region over and contacting the first III-V compound semiconductor region to form a first V-shaped interface, wherein the second III-V compound semiconductor region further contacts the isolation region.",
"12.The device of claim 11, wherein the first III-V compound semiconductor region and the second III-V compound semiconductor region are formed of different III-V compound semiconductor materials.",
"13.The device of claim 11, wherein the substrate comprises a silicon substrate.",
"14.The device of claim 11, wherein the bottom portion of the first III-V compound semiconductor region forms a second V-shaped interface with the substrate.",
"15.The device of claim 14, wherein the first V-shaped interface has an inverted V-shape in a cross-sectional view, and has a top tip higher than the isolation region.",
"16.The device of claim 14, wherein the first V-shaped interface has a bottom tip lower than a top surface of the isolation region.",
"17.A device comprising: a semiconductor substrate; a dielectric isolation region overlying the semiconductor substrate; a first III-V compound semiconductor region having a bottom portion extending into the semiconductor substrate, and an upper portion in the dielectric isolation region; and a second III-V compound semiconductor region over the first III-V compound semiconductor region, wherein a bottom portion of the second III-V compound semiconductor region extends into the dielectric isolation region to contact the first III-V compound semiconductor region.",
"18.The device of claim 17, wherein the first III-V compound semiconductor region and the second III-V compound semiconductor region comprise different III-V compound semiconductor materials.",
"19.The device of claim 17, wherein the first III-V compound semiconductor region and the second III-V compound semiconductor region form a V-shaped interface in a cross-sectional view of the device.",
"20.The device of claim 17, wherein the first III-V compound semiconductor region and the semiconductor substrate form an additional V-shaped interface."
],
[
"<SOH> BACKGROUND <EOH>Group-III group-V compound semiconductors (often referred to as III-V compound semiconductors) such as gallium nitride (GaN) and their related alloys have been under intense research in recent years due to their promising applications in electronic and optoelectronic devices.",
"Particular examples of potential optoelectronic devices employing III-V compound semiconductors include blue light emitting diodes and laser diodes, and ultra-violet (UV) photo-detectors.",
"The large bandgap and high electron saturation velocity of many III-V compound semiconductors also make them excellent candidates for applications in high temperature and high-speed power electronics.",
"Epitaxially grown GaN films are widely used for in the fabrication of light-emitting diodes.",
"Unfortunately, epitaxial GaN films must be grown on substrates other than GaN because it is extremely difficult to obtain GaN bulk crystals due to the high equilibrium pressure of nitrogen at the temperatures typically used to grow bulk crystals.",
"Owing to the lack of feasible bulk growth methods for GaN substrates, GaN is commonly deposited epitaxially on dissimilar substrates such as silicon, SiC and sapphire (Al 2 O 3 ).",
"However, the growth of GaN films on dissimilar substrates is difficult because these substrates have lattice constants and thermal expansion coefficients different than that of GaN.",
"If the difficulties in the growth of GaN films on silicon substrates could be overcome, silicon substrates would be attractive for GaN growth given their low cost, large diameter, high crystal and surface quality, controllable electrical conductivity, and high thermal conductivity.",
"The use of silicon substrates would also provide easy integration of GaN based optoelectronic devices with silicon-based electronic devices.",
"Additionally, due to the lacking of appropriate substrates for growing GaN films thereon, the sizes of the GaN films are limited.",
"The high stresses created by growing a GaN film on a dissimilar substrate may cause the substrate to bow.",
"This may cause several adverse effects.",
"Firstly, a great number of defects (dislocations) will be generated in the supposedly crystalline GaN films.",
"Secondly, the thicknesses of the resulting GaN film will be less uniform, causing wavelength shifts of the light emitted by the optical devices formed on the GaN films.",
"Thirdly, cracks may be generated in large stressed GaN films."
],
[
"<SOH> SUMMARY <EOH>In accordance with one aspect of the embodiment, a method of forming an integrated circuit structure includes forming an insulation layer over at least a portion of a substrate; forming a plurality of semiconductor pillars over a top surface of the insulation layer.",
"The plurality of semiconductor pillars is horizontally spaced apart by portions of the insulation layer.",
"The plurality of semiconductor pillars is allocated in a periodic pattern.",
"The method further includes epitaxially growing a III-V compound semiconductor film from top surfaces and sidewalls of the semiconductor pillars.",
"Other embodiments are also disclosed."
],
[
"CROSS-REFERENCE TO RELATED APPLICATIONS This application is a continuation of U.S. patent application Ser.",
"No.",
"14/926,976, entitled “Growing III-V Compound Semiconductors from Trenches Filled with Intermediate Layers,” filed Oct. 29, 2015, which is a divisional of U.S. patent application Ser.",
"No.",
"14/260,713, entitled “Growing III-V Compound Semiconductors from Trenches Filled with Intermediate Layers,” filed Apr.",
"24, 2014, now U.S. Pat.",
"No.",
"9,209,023 issued Dec. 8, 2015, which application is a divisional of U.S. patent application Ser.",
"No.",
"12/842,221, entitled “Growing III-V Compound Semiconductors from Trenches Filled with Intermediate Layers,” filed on Jul.",
"23, 2010, now U.S. Pat.",
"No.",
"8,759,203 issued Jun.",
"24, 2014, which application claims the benefit of U.S.",
"Provisional Application No.",
"61/262,042 filed on Nov. 17, 2009, entitled “Growing III-V Compound Semiconductors from Trenches Filled with Intermediate Layers,” which applications are hereby incorporated herein by reference.",
"TECHNICAL FIELD This disclosure relates generally to integrated circuit manufacturing processes, and more particularly to forming group-III group-V (III-V) compound semiconductor films.",
"BACKGROUND Group-III group-V compound semiconductors (often referred to as III-V compound semiconductors) such as gallium nitride (GaN) and their related alloys have been under intense research in recent years due to their promising applications in electronic and optoelectronic devices.",
"Particular examples of potential optoelectronic devices employing III-V compound semiconductors include blue light emitting diodes and laser diodes, and ultra-violet (UV) photo-detectors.",
"The large bandgap and high electron saturation velocity of many III-V compound semiconductors also make them excellent candidates for applications in high temperature and high-speed power electronics.",
"Epitaxially grown GaN films are widely used for in the fabrication of light-emitting diodes.",
"Unfortunately, epitaxial GaN films must be grown on substrates other than GaN because it is extremely difficult to obtain GaN bulk crystals due to the high equilibrium pressure of nitrogen at the temperatures typically used to grow bulk crystals.",
"Owing to the lack of feasible bulk growth methods for GaN substrates, GaN is commonly deposited epitaxially on dissimilar substrates such as silicon, SiC and sapphire (Al2O3).",
"However, the growth of GaN films on dissimilar substrates is difficult because these substrates have lattice constants and thermal expansion coefficients different than that of GaN.",
"If the difficulties in the growth of GaN films on silicon substrates could be overcome, silicon substrates would be attractive for GaN growth given their low cost, large diameter, high crystal and surface quality, controllable electrical conductivity, and high thermal conductivity.",
"The use of silicon substrates would also provide easy integration of GaN based optoelectronic devices with silicon-based electronic devices.",
"Additionally, due to the lacking of appropriate substrates for growing GaN films thereon, the sizes of the GaN films are limited.",
"The high stresses created by growing a GaN film on a dissimilar substrate may cause the substrate to bow.",
"This may cause several adverse effects.",
"Firstly, a great number of defects (dislocations) will be generated in the supposedly crystalline GaN films.",
"Secondly, the thicknesses of the resulting GaN film will be less uniform, causing wavelength shifts of the light emitted by the optical devices formed on the GaN films.",
"Thirdly, cracks may be generated in large stressed GaN films.",
"SUMMARY In accordance with one aspect of the embodiment, a method of forming an integrated circuit structure includes forming an insulation layer over at least a portion of a substrate; forming a plurality of semiconductor pillars over a top surface of the insulation layer.",
"The plurality of semiconductor pillars is horizontally spaced apart by portions of the insulation layer.",
"The plurality of semiconductor pillars is allocated in a periodic pattern.",
"The method further includes epitaxially growing a III-V compound semiconductor film from top surfaces and sidewalls of the semiconductor pillars.",
"Other embodiments are also disclosed.",
"BRIEF DESCRIPTION OF THE DRAWINGS For a more complete understanding of the embodiments, and the advantages thereof, reference is now made to the following descriptions taken in conjunction with the accompanying drawings, in which: FIGS.",
"1A through 8 illustrate cross-sectional views, a perspective view, and a top view of intermediate stages in the manufacturing of a III-V semiconductor film in accordance with an embodiment; and FIG.",
"9 through 18 are cross-sectional views and a perspective view of intermediate stages in the manufacturing of III-V semiconductor films in accordance with alternative embodiments.",
"DETAILED DESCRIPTION OF ILLUSTRATIVE EMBODIMENTS The making and using of the embodiments of the disclosure are discussed in detail below.",
"It should be appreciated, however, that the embodiments provide many applicable inventive concepts that can be embodied in a wide variety of specific contexts.",
"The specific embodiments discussed are merely illustrative of specific ways to make and use the embodiments, and do not limit the scope of the disclosure.",
"A novel method for forming group-III group-V (referred to as III-V hereinafter) compound semiconductor films is provided.",
"Throughout the description, the term “III-V compound semiconductor” refers to compound semiconductor materials comprising at least one group-III element and one group-V element.",
"The term “III-N compound semiconductor” refers to a III-V compound semiconductor comprising nitrogen.",
"The required stages of manufacturing an illustrative embodiment are illustrated.",
"Those skilled in the art will recognize that other manufacturing steps may need to take place before or after the described stages in order to produce a complete device.",
"Throughout the various views and illustrative embodiments of the disclosure, like reference numbers are used to designate like elements.",
"Referring to FIG.",
"1A, substrate 20 is provided.",
"In an embodiment, substrate 20 is a bulk substrate comprising, for example, semiconductor material(s) such as silicon.",
"Substrate 20 may be formed of other commonly used materials such as sapphire, SiGe, SiC, Ge, or the like.",
"Insulation regions 22 (which may be considered as portions of an insulation layer) are formed in substrate 20.In an embodiment, the insulation regions may include shallow trench isolation (STI) region(s) 22, and hence are referred to as STI regions 22 throughout the description.",
"The formation process of STI regions 22 may include recessing portions of substrate 20, and filling the resulting recesses with a dielectric material, followed by a chemical mechanical polish (CMP) to remove excess dielectric material.",
"The remaining portions of the dielectric material form STI regions 22.In the resulting structure, substrate 20 may include portion 20_1 that is below the bottom surfaces of STI regions 22, and portions 20_2 that are between, and separated from each other by, STI regions 22.It is noted that although STI regions 22 were originally formed in substrate 20, substrate portion 20_1 may also be treated as a substrate, while STI regions 22 may be treated as being over substrate 20_1.FIG.",
"1B illustrates a top view of the structure shown in FIG.",
"1A, wherein the cross-sectional view in FIG.",
"1A is obtained from the plane crossing line 1A-1A in FIG.",
"1B.",
"From the top view, it is observed that substrate portions 20_2 are arranged in a periodic pattern.",
"In an exemplary embodiment as shown in FIG.",
"1B, substrate portions 20_2 are arranged as an array, in other embodiments, substrate portions 20_2 may be arranged in other patterns such as a hexagon pattern.",
"Distance D between neighboring substrate portions 20_2 may be less than about 5 μm, and may also be between about 20 nm and about 5 μm.",
"The length and/or width L of substrate portions 20_2 (which will also be the length and/or width of the resulting semiconductor re-growth regions 28 and (semiconductor) pillars 30, as shown in FIG.",
"5A) may be smaller than about 5 μm.",
"One skilled in the art will realize, however, that the dimensions recited throughout the description are merely examples, and will change if different formation technologies are used.",
"From the top view, substrate portions 20_2 may have the shape of square, rectangle, circle, hexagon, octagon, or the like.",
"Referring to FIG.",
"2, substrate portions 20_2 are removed partially or fully, forming recesses 26.In an embodiment as shown in FIG.",
"2, V-grooves may be formed at the bottom of recesses 26, so that the exposed surface of silicon substrate 20 in recesses 26 have (111) surface orientations.",
"In alternative embodiments, as shown with dotted lines, the bottom surfaces of recesses 26 may be substantially flat.",
"Next, as shown in FIG.",
"3, semiconductor re-growth regions 28 are epitaxially grown in recesses 26.Semiconductor re-growth regions 28 may be formed of a material having a lattice constant between the lattice constant of substrate 20 and the lattice constant of the overlying III-V semiconductor film 32 (not shown in FIG.",
"3, please refer to FIG.",
"6).",
"In an embodiment, semiconductor re-growth regions 28 comprise buffer regions 28_1 and top regions 28_2.Buffer regions 28_1 may be formed of AlN, low temperature GaAs, or a low temperature GaAs and a high temperature GaAs on the low temperature GaAs.",
"The low temperature GaAs may be epitaxially grown at a temperature lower than about 400° C., while the high temperature GaAs may be epitaxially grown at a temperature higher than about 600° C. Alternatively, buffer regions 28_1 may be formed of a low temperature GaN or AlN, which may be epitaxially grown at a temperature lower than about 850° C. Top regions 28_2 may be formed of GaN, which may be epitaxially grown at a temperature higher than about 1100° C. By growing semiconductor re-growth regions 28 in recesses 26, the threading dislocations may be blocked by the sidewalls of STI regions 22, so that fewer defects will occur in subsequently formed III-V semiconductor film 32 (FIG.",
"6).",
"Next, a CMP is performed to remove excess semiconductor re-growth regions 28.The resulting structure is shown in FIG.",
"4.FIG.",
"5A illustrates the recessing of STI regions 22.As a result, the portions of re-growth regions 28 over the top surfaces of remaining portions of STI regions 22 form pillars 30.The height H of pillars 30 may be greater than about 50 nm, or even greater than about 100 nm.",
"FIG.",
"5B illustrates a perspective view of the structure shown in FIG.",
"5A.",
"Referring to FIG.",
"6, III-V compound semiconductor film 32 is epitaxially grown.",
"In an embodiment, III-V compound semiconductor film 32 comprises GaAs, although it may also be formed of other III-V compound semiconductor materials such as GaN, InN, AlN, InP, or the like.",
"With III-V compound semiconductor film 32 grown from the top surface and sidewalls of pillars 30, the defect density in III-V compound semiconductor film 32 may be reduced.",
"A planarization (for example, a CMP) may then be performed to flatten the top surface of III-V compound semiconductor film 32.Optionally, as shown in FIG.",
"7, mask layer 34 is formed on III-V compound semiconductor film 32.Mask layer 34 may include a material selected from dielectric materials such as silicon nitride or silicon oxide.",
"Mask layer 34 may also include multi-layers of the above-discussed materials.",
"The applicable deposition methods for forming mask layer 34 include physical vapor deposition (PVD) and chemical vapor deposition (CVD).",
"Mask layer 34 is patterned so that the top surface of III-V compound semiconductor film 32 is selectively exposed through the gaps between remaining portions of mask layer 34.The patterning may be performed using a dry etch and/or a wet etch.",
"The remaining portions of mask layer 34 may have any pattern with controlled width and spacing, and may form parallel strips.",
"In other embodiments, the remaining portions of mask layer 34 may be arranged as an array or other periodic patterns, with each remaining portion having a square, a strip, or a polygon shape (in a top view).",
"In yet other embodiments, the remaining portions of mask layer 34 may form an interconnected grid structure, with windows therein for exposing the underlying III-V compound semiconductor film 32.The thickness T of mask layer 34 may be about 2 nm to about 6 μm.",
"Next, as shown in FIG.",
"8, an additional III-V semiconductor film 36 is grown on the exposed surface of III-V compound semiconductor film 32, for example, using epitaxial layer overgrowth (ELOG).",
"With the formation of mask layer 34 and the ELOG step, the defect density in III-V semiconductor film 36 is lower than in III-V compound semiconductor film 32.In an embodiment, III-V semiconductor film 36 may be formed of a same material as that of III-V compound semiconductor film 32, for example, GaN.",
"Alternatively, III-V semiconductor films 32 and 36 may be formed of different materials, for example, III-V compound semiconductor film 32 may be formed of GaAs, while III-V semiconductor films 36 may be formed of GaN.",
"In subsequent process steps, III-V semiconductor film 36 may be planarized.",
"Further, the underlying substrate 20 and STI regions 22 may be removed, for example, using CMP.",
"The resulting structure is thus a bulk III-V substrate (for example, a GaN substrate) with a low defect density.",
"FIGS.",
"9 through 11 illustrate an alternative embodiment.",
"Unless specified otherwise, like reference numerals in this embodiment (and subsequently discussed embodiments) represent like components in the embodiment shown in FIGS.",
"1A through 8.Accordingly, the process steps and applicable materials may not be repeated herein.",
"The initial steps of this embodiment are essentially the same as shown in FIGS.",
"1A through 2.Next, as shown in FIG.",
"9, semiconductor re-growth regions 28 are formed in the form of a single layer, with the top portions and the bottom portions formed of a same semiconductor material.",
"In an embodiment, semiconductor re-growth regions 28 are formed of epitaxial GaAs.",
"Referring to FIG.",
"10, STI regions 22 are recessed, so that pillars 30, which extend above the top surfaces of STI regions 22, are formed.",
"In subsequent steps, III-V compound semiconductor film 32 is formed, as shown in FIG.",
"11.Optionally, III-V semiconductor film 36 is formed.",
"The process steps and the materials of III-V semiconductor films 32 and 36 may be essentially the same as shown in FIGS.",
"7 and 8 and the respective discussion, and hence are not repeated herein.",
"FIGS.",
"12 through 14 illustrate yet another embodiment.",
"The initial steps of this embodiment are essentially the same as shown in FIGS.",
"1A through 2.Next, as shown in FIG.",
"12, semiconductor re-growth regions 28 are formed.",
"Semiconductor re-growth regions 28 may be composite regions comprising buffer regions 28_1 and top regions 28_2, as shown in FIG.",
"3, or regions formed of a single material, as shown in FIG.",
"9.In an embodiment, semiconductor re-growth regions 28 are formed of epitaxial GaAs, although other semiconductor materials such as GaN may be used.",
"Next, as shown in FIG.",
"13, an isotropic etch is performed to semiconductor re-growth regions 28, for example, using KOH, so that V-grooves 40 are formed.",
"The exposed surfaces of semiconductor re-growth regions 28 may have (111) surface planes.",
"In the embodiments in which re-growth regions 28 are formed of GaAs, the (111) surface planes may have a smaller lattice mismatch with the overlying III-V compound semiconductor film 32 (which may be formed of GaN, for example, see FIG.",
"14) than the flat top surfaces of semiconductor re-growth regions 28 as shown in FIG.",
"12.As a result, fewer defects may be generated in the subsequently formed III-V compound semiconductor film 32.Next, III-V compound semiconductor film 32 is formed, as shown in FIG.",
"14.Process steps as shown in FIGS.",
"7 and 8 may then be performed to form III-V semiconductor film 36.FIGS.",
"15A through 16 illustrate yet another embodiment.",
"The initial steps of this embodiment are essentially the same as shown in FIGS.",
"1A through 2.Next, as shown in FIG.",
"15A, semiconductor re-growth regions 28 are formed.",
"Semiconductor re-growth regions 28 may be composite regions comprising buffer regions 28_1 and top regions 28_2, as shown in FIG.",
"3, or a formed of a single layer, as shown in FIG.",
"9.In an embodiment, top regions 28_2 are formed of epitaxial GaN, although other materials such as GaAs may be used.",
"The partial pressures of process gases, temperature, and formation time may be adjusted, so that pyramids 42 are formed, wherein pyramids 42 may have bases substantially level with the top surfaces of STI regions 22.The exposed surfaces (slopes) of semiconductor re-growth regions 28 may have the (111) surface-planes.",
"FIG.",
"15B illustrates the perspective view of the structure shown in FIG.",
"15A.",
"Next, as shown in FIG.",
"16, III-V compound semiconductor film 32 is epitaxially grown.",
"III-V compound semiconductor film 32 and top regions 28_2 may be formed of a same material or different materials.",
"With III-V compound semiconductor film 32 grown starting from the slopes of pyramids 42, the threading dislocations in III-V compound semiconductor film 32 may bend toward, and end at, the top surfaces of STI regions 22.As a result, fewer defects will be generated in III-V compound semiconductor film 32.In the embodiment III-V compound semiconductor film 32 and top regions 28_2 are formed of a same material such as GaN, III-V compound semiconductor film 32 may be formed at a temperature higher than the temperature for forming top regions 28_2.FIGS.",
"17 and 18 illustrate yet another embodiment.",
"The initial steps of this embodiment are essentially the same as shown in FIGS.",
"1A and 1B.",
"Next, as shown in FIG.",
"17, STI regions 22 are recessed, so that the top portions 20_2 of substrate 20 form pillars 30.Next, III-V compound semiconductor film 32 is epitaxially grown, as shown in FIG.",
"18.The process steps as shown in FIGS.",
"7 and 8 may then be optionally performed.",
"In the above-discussed embodiments, by starting the growth of III-V compound semiconductor film 32 from periodic patterned semiconductor re-growth regions 28, the defect numbers in the resulting III-V compound semiconductor film 32 may be reduced.",
"Further, with the top surface of re-growth regions 28 being V-grooves 40 or pyramids 42, the defect numbers may be further reduced.",
"Although the embodiments and their advantages have been described in detail, it should be understood that various changes, substitutions and alterations can be made herein without departing from the spirit and scope of the embodiments as defined by the appended claims.",
"Moreover, the scope of the present application is not intended to be limited to the particular embodiments of the process, machine, manufacture, and composition of matter, means, methods and steps described in the specification.",
"As one of ordinary skill in the art will readily appreciate from the disclosure, processes, machines, manufacture, compositions of matter, means, methods, or steps, presently existing or later to be developed, that perform substantially the same function or achieve substantially the same result as the corresponding embodiments described herein may be utilized according to the disclosure.",
"Accordingly, the appended claims are intended to include within their scope such processes, machines, manufacture, compositions of matter, means, methods, or steps.",
"In addition, each claim constitutes a separate embodiment, and the combination of various claims and embodiments are within the scope of the disclosure."
]
] |
Patent_15871423
|
[
[
"AMPLITUDE LIMITING OSCILLATION CIRCUIT",
"An amplitude limiting oscillation circuit (100) is disclosed.",
"The amplitude limiting oscillation circuit (100) includes: an oscillation circuit (110), configured to generate an oscillation signal; a pulse width modulation circuit (120), configured to generate a pulse width modulation signal according to an amplitude of the oscillation signal; a low pass filtering circuit (130), configured to convert the pulse width modulation signal into a direct current control voltage signal, where the direct current control voltage signal is configured to control a voltage controlled resistance circuit (140); and the voltage controlled resistance circuit (140), configured to change a resistance value of the voltage controlled resistance circuit (140) according to under the direct current control voltage signal, to control the amplitude of the oscillation signal.",
"The amplitude limiting oscillation circuit (100), may improve performance of the amplitude limiting oscillation circuit (100)."
],
[
"1.An amplitude limiting oscillation circuit, comprising: an oscillation circuit (110), configured to generate an oscillation signal; a pulse width modulation circuit (120), configured to generate a pulse width modulation signal according to an amplitude of the oscillation signal; a low pass filtering circuit (130), configured to convert the pulse width modulation signal into a direct current control voltage signal; and a voltage controlled resistance circuit (140), configured to change a resistance value of the voltage controlled resistance circuit (140) under control of the direct current control voltage signal, to control the amplitude of the oscillation signal.",
"2.The amplitude limiting oscillation circuit according to claim 1, wherein the oscillation circuit (110) is an LC oscillation circuit, a crystal oscillation circuit or a relaxation oscillation circuit.",
"3.The amplitude limiting oscillation circuit according to claim 1, wherein the pulse width modulation circuit (120) comprises a comparator, configured to generate the pulse width modulation signal by comparing an amplitude of a reference signal with the amplitude of the oscillation signal.",
"4.The amplitude limiting oscillation circuit according to claim 1, wherein the low pass filtering circuit (130) is a passive filter or an active filter.",
"5.The amplitude limiting oscillation circuit according to claim 1, wherein resistance of the voltage controlled resistance circuit (140) is linear resistance or nonlinear resistance that operates in a linear region.",
"6.The amplitude limiting oscillation circuit according to claim 1, wherein the voltage controlled resistance circuit (140) comprises a metal oxide semiconductor field effect transistor.",
"7.The amplitude limiting oscillation circuit according to claim 1, wherein the oscillation circuit (110) comprises a positive output end and a negative output end.",
"8.The amplitude limiting oscillation circuit according to claim 7, wherein the oscillation circuit (110) comprises: an inductor (111), and a first capacitor (112), wherein the inductor (111) and the first capacitor (112) form a resonant circuit; and a first MOS transistor (113), a second MOS transistor (114), a third MOS transistor (115), and a fourth MOS transistor (116), wherein the first MOS transistor (113), the second MOS transistor (114), the third MOS transistor (115), and the fourth MOS transistor (116) provide negative resistance for the resonant circuit, a drain electrode of the first MOS transistor (113) and a gate electrode of the second MOS transistor (114) form a positive output end of the oscillation circuit (110), and a gate electrode of the third MOS transistor (115) and a drain electrode of the fourth MOS transistor (116) form a negative output end of the oscillation circuit (110).",
"9.The amplitude limiting oscillation circuit according to claim 7, wherein the pulse width modulation circuit (120) comprises: a first comparator (121), wherein a positive input end of the first comparator (121) is connected to the positive output end of the oscillation circuit (110), and a negative input end of the first comparator (121) is configured to input a first reference signal; and a second comparator (122), wherein a positive input end of the second comparator (122) is connected to the negative output end of the oscillation circuit (110), and a negative input end of the second comparator (122) is configured to input a second reference signal.",
"10.The amplitude limiting oscillation circuit according to claim 9, wherein the low pass filtering circuit (130) comprises: a first low pass filter, comprising a first resistor (131) and a second capacitor (132), wherein an input end of the first low pass filter is connected to an output end of the first comparator (121), and an output end of the first low pass filter is connected to a gate electrode of a fifth MOS transistor (141); and a second low pass filter, comprising a second resistor (133) and a third capacitor (134), wherein an input end of the second low pass filter is connected to an output end of the second comparator (122), and an output end of the second low pass filter is connected to a gate electrode of a sixth MOS transistor (142); and the voltage controlled resistance circuit (140) comprises: the fifth MOS transistor (141), wherein a source electrode of the fifth MOS transistor (141) is connected to a power supply, and a drain electrode of the fifth MOS transistor (141) is connected to a source electrode of the first MOS transistor (113) and a source electrode of the second MOS transistor (114); and the sixth MOS transistor (142), wherein a source electrode of the sixth MOS transistor (142) is connected to ground, and a drain electrode of the sixth MOS transistor (142) is connected to a source electrode of the third MOS transistor (115) and a source electrode of the fourth MOS transistor (116).",
"11.The amplitude limiting oscillation circuit according to claim 7, wherein the amplitude limiting oscillation circuit further comprises: a switching circuit (150), configured to switch a connection between the positive input end or the negative output end and the pulse width modulation circuit (120).",
"12.The amplitude limiting oscillation circuit according to claim 11, wherein the switching circuit (150) comprises: a third comparator (151), an inverter (152), a first switch (153), a second switch (154), a third switch (155) and a fourth switch (156); wherein a positive input end of the third comparator (151) is connected to the positive output end of the oscillation circuit (110), a negative input end of the third comparator (151) is connected to the negative output end of the oscillation circuit (110), an input end of the inverter (152) is connected to an output end of the third comparator (151), an output signal of the third comparator (151) is used to control the first switch (153) and the fourth switch (156), and an output signal of the inverter (152) is used to control the second switch (154) and the third switch (155).",
"13.The amplitude limiting oscillation circuit according to claim 12, wherein the pulse width modulation circuit (120) comprises: a first comparator (121), wherein a positive input end of the first comparator (121) is connected to the positive output end of the oscillation circuit (110) through the first switch (153), and connected to the negative output end of the oscillation circuit (110) through the second switch (154), and a negative input end of the first comparator (121) is configured to input a first reference signal; and a second comparator (122), wherein a positive input end of the second comparator (122) is connected to the positive output end of the oscillation circuit (110) through the third switch (155), and connected to the negative output end of the oscillation circuit (110) through the fourth switch (156), and a negative input end of the second comparator (122) is configured to input a second reference signal.",
"14.The amplitude limiting oscillation circuit according to claim 13, wherein the low pass filtering circuit (130) comprises: a first low pass filter, comprising a first resistor (131) and a second capacitor (132), wherein an input end of the first low pass filter is connected to an output end of the first comparator (121), and an output end of the first low pass filter is connected to a gate electrode of a fifth MOS transistor (141); and a second low pass filter, comprising a second resistor (133) and a third capacitor (134), wherein an input end of the second low pass filter is connected to an output end of the second comparator (122), and an output end of the second low pass filter is connected to a gate electrode of a sixth MOS transistor (142); and the voltage controlled resistance circuit (140) comprises: the fifth MOS transistor (141), wherein a source electrode of the fifth MOS transistor (141) is connected to a power supply, and a drain electrode of the fifth MOS transistor (141) is connected to a source electrode of the first MOS transistor (113) and a source electrode of the second MOS transistor (114); and the sixth MOS transistor (142), wherein a source electrode of the sixth MOS transistor (142) is connected to ground, and a drain electrode of the sixth MOS transistor (142) is connected to a source electrode of the third MOS transistor (115) and a source electrode of the fourth MOS transistor (116)."
],
[
"<SOH> BACKGROUND <EOH>If no amplitude limitation is performed on a common LC oscillation circuit, an amplitude of the oscillation circuit would eventually stabilize to a power supply voltage, and such oscillation circuit has several disadvantages as follows: 1.distortion of an oscillation waveform of the oscillation circuit occurs, and a rising edge and a falling edge thereof are dissymmetrical, such that a 1/f 3 noise inflection point of the oscillation circuit moves to a high frequency, resulting in worse low frequency phase noise; and 2.a large oscillation amplitude causes a very large current through an inductor, such that a magnetic core of the inductor is saturated, resulting in a change of an inductance value, ultimately affecting stability of a frequency.",
"Usually, an approach of limiting amplitude is to detect an oscillation amplitude by using an amplitude detection circuit or a peak detection circuit, and then output a control voltage to control a bias current of an oscillation circuit, so as to achieve an effect of limiting the amplitude of the oscillation circuit.",
"However, the approach also has several disadvantages as follows: 1.a loop gain of such approach is larger, easily resulting in instability of a control loop; 2.the control loop per se may introduce greater noise, resulting in worse phase noise of the oscillation circuit; and 3.most of the amplitude detection circuits cannot accurately control the oscillation amplitude, thereby limiting its utility.",
"Therefore, it becomes a technical problem to be solved urgently to improve performance of an amplitude limiting oscillation circuit."
],
[
"<SOH> SUMMARY <EOH>Embodiments of the present disclosure provide an amplitude limiting oscillation circuit, and performance of the amplitude limiting oscillation circuit may be improved.",
"According to a first aspect, an amplitude limiting oscillation circuit is provided, including: an oscillation circuit 110 , configured to generate an oscillation signal; a pulse width modulation circuit 120 , configured to generate a pulse width modulation signal according to an amplitude of the oscillation signal; a low pass filtering circuit 130 , configured to convert the pulse width modulation signal into a direct current control voltage signal, where the direct current control voltage signal is configured to control a voltage controlled resistance circuit 140 ; and the voltage controlled resistance circuit 140 , configured to change a resistance value of the voltage controlled resistance circuit 140 under control of the direct current control voltage signal, to control the amplitude of the oscillation signal.",
"According to the amplitude limiting oscillation circuit of the embodiments of the present disclosure, negative feedback is performed by using a voltage controlled resistance circuit, and a control loop may not introduce extra noise; therefore, phase noise of the amplitude limiting oscillation circuit is lower, and performance of the amplitude limiting oscillation circuit is improved.",
"In some possible implementation manners, the oscillation circuit 110 is an LC oscillation circuit, a crystal oscillation circuit or a relaxation oscillation circuit.",
"In some possible implementation manners, the pulse width modulation circuit 120 includes a comparator, configured to generate the pulse width modulation signal by comparing an amplitude of a reference signal with the amplitude of the oscillation signal.",
"When the comparator is used, the amplitude of the amplitude limiting oscillation circuit depends on a reference voltage of the comparator, that is, a final amplitude range of the amplitude limiting oscillation circuit is very close to the reference voltage of the comparator; therefore, it is easy to control the oscillation amplitude of the amplitude limiting oscillation circuit of the embodiments of the present disclosure.",
"In some possible implementation manners, the low pass filtering circuit 130 is a passive filter or an active filter.",
"In some possible implementation manners, resistance of the voltage controlled resistance circuit 140 is linear resistance or nonlinear resistance that operates in a linear region.",
"In some possible implementation manners, the voltage controlled resistance circuit 140 includes a metal oxide semiconductor field effect transistor MOS.",
"In some possible implementation manners, the oscillation circuit 110 includes a positive output end and a negative output end.",
"In some possible implementation manners, the oscillation circuit 110 includes: an inductor 111 , and a first capacitor 112 , where the inductor 111 and the first capacitor 112 form a resonant circuit; and a first MOS transistor 113 , a second MOS transistor 114 , a third MOS transistor 115 , and a fourth MOS transistor 116 , where the first MOS transistor 113 , the second MOS transistor 114 , the third MOS transistor 115 , and the fourth MOS transistor 116 provide negative resistance for the resonant circuit, a drain electrode of the first MOS transistor 113 and a gate electrode of the second MOS transistor 114 form a positive output end of the oscillation circuit 110 , and a gate electrode of the third MOS transistor 115 and a drain electrode of the fourth MOS transistor 116 form a negative output end of the oscillation circuit 110 .",
"In some possible implementation manners, the pulse width modulation circuit 120 includes: a first comparator 121 , where a positive input end of the first comparator 121 is connected to the positive output end of the oscillation circuit 110 , and a negative input end of the first comparator 121 is configured to input a first reference signal; and a second comparator 122 , where a positive input end of the second comparator 122 is connected to the negative output end of the oscillation circuit 110 , and a negative input end of the second comparator 122 is configured to input a second reference signal.",
"In some possible implementation manners, the amplitude limiting oscillation circuit further includes: a switching circuit 150 , configured to switch a connection between the positive input end or the negative output end and the pulse width modulation circuit 120 .",
"In some possible implementation manners, the switching circuit 150 includes: a third comparator 151 , an inverter 152 , a first switch 153 , a second switch 154 , a third switch 155 and a fourth switch 156 ; where a positive input end of the third comparator 151 is connected to the positive output end of the oscillation circuit 110 , a negative input end of the third comparator 151 is connected to the negative output end of the oscillation circuit 110 , an input end of the inverter 152 is connected to an output end of the third comparator 151 , an output signal of the third comparator 151 is used to control the first switch 153 and the fourth switch 156 , and an output signal of the inverter 152 is used to control the second switch 154 and the third switch 155 .",
"In some possible implementation manners, the pulse width modulation circuit 120 includes: a first comparator 121 , where a positive input end of the first comparator 121 is connected to the positive output end of the oscillation circuit 110 through the first switch 153 , and connected to the negative output end of the oscillation circuit 110 through the second switch 154 , and a negative input end of the first comparator 121 is configured to input a first reference signal; and a second comparator 122 , where a positive input end of the second comparator 122 is connected to the positive output end of the oscillation circuit 110 through the third switch 155 , and connected to the negative output end of the oscillation circuit 110 through the fourth switch 156 , and a negative input end of the second comparator 122 is configured to input a second reference signal.",
"According to the amplitude limiting oscillation circuit of the embodiments of the present disclosure, a switching circuit is used, and an adjustable range may be expanded.",
"In some possible implementation manners, the low pass filtering circuit 130 includes: a first low pass filter, including a first resistor 131 and a second capacitor 132 , where an input end of the first low pass filter is connected to an output end of the first comparator 121 , and an output end of the first low pass filter is connected to a gate electrode of a fifth MOS transistor 141 ; and a second low pass filter, including a second resistor 133 and a third capacitor 134 , where an input end of the second low pass filter is connected to an output end of the second comparator 122 , and an output end of the second low pass filter is connected to a gate electrode of a sixth MOS transistor 142 ; and the voltage controlled resistance circuit 140 includes: the fifth MOS transistor 141 , where a source electrode of the fifth MOS transistor 141 is connected to a power supply, and a drain electrode of the fifth MOS transistor 141 is connected to a source electrode of the first MOS transistor 113 and a source electrode of the second MOS transistor 114 ; and the sixth MOS transistor 142 , where a source electrode of the sixth MOS transistor 142 is connected to ground, and a drain electrode of the sixth MOS transistor 142 is connected to a source electrode of the third MOS transistor 115 and a source electrode of the fourth MOS transistor 116 .",
"Amplitude control of the amplitude limiting oscillation circuit of the embodiments of the present disclosure is mainly based on source electrode feedback; therefore, the manner of the amplitude control does not have a problem of stability, that is, the stability of the amplitude limiting oscillation circuit of the embodiments of the present disclosure is better.",
"According to a second aspect, a chip is provided, and the chip includes the amplitude limiting oscillation circuit of the first aspect or the amplitude limiting oscillation circuit of any one of possible implementation manners of the first aspect."
],
[
"CROSS REFERENCE TO RELATED APPLICATIONS The present application is a continuation of international application No.",
"PCT/CN2016/103225, filed on Oct. 25, 2016, which is hereby incorporated by reference in its entirety.",
"TECHNICAL FIELD The present disclosure relates to the field of information technologies, and in particular, to an amplitude limiting oscillation circuit.",
"BACKGROUND If no amplitude limitation is performed on a common LC oscillation circuit, an amplitude of the oscillation circuit would eventually stabilize to a power supply voltage, and such oscillation circuit has several disadvantages as follows: 1.distortion of an oscillation waveform of the oscillation circuit occurs, and a rising edge and a falling edge thereof are dissymmetrical, such that a 1/f3 noise inflection point of the oscillation circuit moves to a high frequency, resulting in worse low frequency phase noise; and 2.a large oscillation amplitude causes a very large current through an inductor, such that a magnetic core of the inductor is saturated, resulting in a change of an inductance value, ultimately affecting stability of a frequency.",
"Usually, an approach of limiting amplitude is to detect an oscillation amplitude by using an amplitude detection circuit or a peak detection circuit, and then output a control voltage to control a bias current of an oscillation circuit, so as to achieve an effect of limiting the amplitude of the oscillation circuit.",
"However, the approach also has several disadvantages as follows: 1.a loop gain of such approach is larger, easily resulting in instability of a control loop; 2.the control loop per se may introduce greater noise, resulting in worse phase noise of the oscillation circuit; and 3.most of the amplitude detection circuits cannot accurately control the oscillation amplitude, thereby limiting its utility.",
"Therefore, it becomes a technical problem to be solved urgently to improve performance of an amplitude limiting oscillation circuit.",
"SUMMARY Embodiments of the present disclosure provide an amplitude limiting oscillation circuit, and performance of the amplitude limiting oscillation circuit may be improved.",
"According to a first aspect, an amplitude limiting oscillation circuit is provided, including: an oscillation circuit 110, configured to generate an oscillation signal; a pulse width modulation circuit 120, configured to generate a pulse width modulation signal according to an amplitude of the oscillation signal; a low pass filtering circuit 130, configured to convert the pulse width modulation signal into a direct current control voltage signal, where the direct current control voltage signal is configured to control a voltage controlled resistance circuit 140; and the voltage controlled resistance circuit 140, configured to change a resistance value of the voltage controlled resistance circuit 140 under control of the direct current control voltage signal, to control the amplitude of the oscillation signal.",
"According to the amplitude limiting oscillation circuit of the embodiments of the present disclosure, negative feedback is performed by using a voltage controlled resistance circuit, and a control loop may not introduce extra noise; therefore, phase noise of the amplitude limiting oscillation circuit is lower, and performance of the amplitude limiting oscillation circuit is improved.",
"In some possible implementation manners, the oscillation circuit 110 is an LC oscillation circuit, a crystal oscillation circuit or a relaxation oscillation circuit.",
"In some possible implementation manners, the pulse width modulation circuit 120 includes a comparator, configured to generate the pulse width modulation signal by comparing an amplitude of a reference signal with the amplitude of the oscillation signal.",
"When the comparator is used, the amplitude of the amplitude limiting oscillation circuit depends on a reference voltage of the comparator, that is, a final amplitude range of the amplitude limiting oscillation circuit is very close to the reference voltage of the comparator; therefore, it is easy to control the oscillation amplitude of the amplitude limiting oscillation circuit of the embodiments of the present disclosure.",
"In some possible implementation manners, the low pass filtering circuit 130 is a passive filter or an active filter.",
"In some possible implementation manners, resistance of the voltage controlled resistance circuit 140 is linear resistance or nonlinear resistance that operates in a linear region.",
"In some possible implementation manners, the voltage controlled resistance circuit 140 includes a metal oxide semiconductor field effect transistor MOS.",
"In some possible implementation manners, the oscillation circuit 110 includes a positive output end and a negative output end.",
"In some possible implementation manners, the oscillation circuit 110 includes: an inductor 111, and a first capacitor 112, where the inductor 111 and the first capacitor 112 form a resonant circuit; and a first MOS transistor 113, a second MOS transistor 114, a third MOS transistor 115, and a fourth MOS transistor 116, where the first MOS transistor 113, the second MOS transistor 114, the third MOS transistor 115, and the fourth MOS transistor 116 provide negative resistance for the resonant circuit, a drain electrode of the first MOS transistor 113 and a gate electrode of the second MOS transistor 114 form a positive output end of the oscillation circuit 110, and a gate electrode of the third MOS transistor 115 and a drain electrode of the fourth MOS transistor 116 form a negative output end of the oscillation circuit 110.In some possible implementation manners, the pulse width modulation circuit 120 includes: a first comparator 121, where a positive input end of the first comparator 121 is connected to the positive output end of the oscillation circuit 110, and a negative input end of the first comparator 121 is configured to input a first reference signal; and a second comparator 122, where a positive input end of the second comparator 122 is connected to the negative output end of the oscillation circuit 110, and a negative input end of the second comparator 122 is configured to input a second reference signal.",
"In some possible implementation manners, the amplitude limiting oscillation circuit further includes: a switching circuit 150, configured to switch a connection between the positive input end or the negative output end and the pulse width modulation circuit 120.In some possible implementation manners, the switching circuit 150 includes: a third comparator 151, an inverter 152, a first switch 153, a second switch 154, a third switch 155 and a fourth switch 156; where a positive input end of the third comparator 151 is connected to the positive output end of the oscillation circuit 110, a negative input end of the third comparator 151 is connected to the negative output end of the oscillation circuit 110, an input end of the inverter 152 is connected to an output end of the third comparator 151, an output signal of the third comparator 151 is used to control the first switch 153 and the fourth switch 156, and an output signal of the inverter 152 is used to control the second switch 154 and the third switch 155.In some possible implementation manners, the pulse width modulation circuit 120 includes: a first comparator 121, where a positive input end of the first comparator 121 is connected to the positive output end of the oscillation circuit 110 through the first switch 153, and connected to the negative output end of the oscillation circuit 110 through the second switch 154, and a negative input end of the first comparator 121 is configured to input a first reference signal; and a second comparator 122, where a positive input end of the second comparator 122 is connected to the positive output end of the oscillation circuit 110 through the third switch 155, and connected to the negative output end of the oscillation circuit 110 through the fourth switch 156, and a negative input end of the second comparator 122 is configured to input a second reference signal.",
"According to the amplitude limiting oscillation circuit of the embodiments of the present disclosure, a switching circuit is used, and an adjustable range may be expanded.",
"In some possible implementation manners, the low pass filtering circuit 130 includes: a first low pass filter, including a first resistor 131 and a second capacitor 132, where an input end of the first low pass filter is connected to an output end of the first comparator 121, and an output end of the first low pass filter is connected to a gate electrode of a fifth MOS transistor 141; and a second low pass filter, including a second resistor 133 and a third capacitor 134, where an input end of the second low pass filter is connected to an output end of the second comparator 122, and an output end of the second low pass filter is connected to a gate electrode of a sixth MOS transistor 142; and the voltage controlled resistance circuit 140 includes: the fifth MOS transistor 141, where a source electrode of the fifth MOS transistor 141 is connected to a power supply, and a drain electrode of the fifth MOS transistor 141 is connected to a source electrode of the first MOS transistor 113 and a source electrode of the second MOS transistor 114; and the sixth MOS transistor 142, where a source electrode of the sixth MOS transistor 142 is connected to ground, and a drain electrode of the sixth MOS transistor 142 is connected to a source electrode of the third MOS transistor 115 and a source electrode of the fourth MOS transistor 116.Amplitude control of the amplitude limiting oscillation circuit of the embodiments of the present disclosure is mainly based on source electrode feedback; therefore, the manner of the amplitude control does not have a problem of stability, that is, the stability of the amplitude limiting oscillation circuit of the embodiments of the present disclosure is better.",
"According to a second aspect, a chip is provided, and the chip includes the amplitude limiting oscillation circuit of the first aspect or the amplitude limiting oscillation circuit of any one of possible implementation manners of the first aspect.",
"BRIEF DESCRIPTION OF DRAWINGS To illustrate a technical solution of embodiments of the present disclosure more clearly, the accompanying drawings which are needed in the embodiments of the present disclosure are introduced briefly below.",
"Apparently, the accompanying drawings described below are merely some of the embodiments of the present disclosure, based on which other drawings can be obtained by persons of ordinary skill in the art without any creative effort.",
"FIG.",
"1 is a schematic diagram of an amplitude limiting oscillation circuit according to an embodiment of the present disclosure.",
"FIG.",
"2 is a schematic diagram of an amplitude limiting oscillation circuit according to another embodiment of the present disclosure.",
"FIG.",
"3 is a schematic diagram of an amplitude limiting oscillation circuit according to a further embodiment of the present disclosure.",
"FIG.",
"4 is a schematic diagram of an amplitude limiting oscillation circuit according to still another embodiment of the present disclosure.",
"DESCRIPTION OF EMBODIMENTS The technical solution in the embodiments of the present disclosure will be described clearly and fully below in conjunction with the drawings in the embodiments of the present disclosure, and apparently, the embodiments described are only part of embodiments of the present disclosure, not all of them.",
"All of the other embodiments, obtained by those of ordinary skill in the art based on the embodiments of the present disclosure without any creative effort, fall into the protection scope of the present disclosure.",
"FIG.",
"1 illustrates a schematic diagram of an amplitude limiting oscillation circuit 100 according to an embodiment of the present disclosure.",
"As shown in FIG.",
"1, the amplitude limiting oscillation circuit 110 may include an oscillation circuit 110, a pulse width modulation circuit 120, a low pass filtering circuit 130, and a voltage controlled resistance circuit 140.The oscillation circuit 110 is configured to generate an oscillation signal.",
"The oscillation circuit 110 may be any type of oscillation circuit, such as LC oscillation circuit, crystal oscillation circuit or relaxation oscillation circuit, and the present disclosure does not limit the type of the oscillation circuit 110.Optionally, the oscillation circuit 110 may output two oscillation signals.",
"Phases of the two oscillation signals are opposite.",
"That is, the oscillation circuit 110 may have a positive output end and a negative output end, and the positive output end and the negative output end output oscillation signals with opposite phases, respectively.",
"The pulse width modulation circuit 120 is configured to generate a pulse width modulation signal according to an amplitude of an oscillation signal.",
"Optionally, the pulse width modulation circuit 120 may include a comparator, and the comparator generates the pulse width modulation signal by comparing an amplitude of a reference signal with the amplitude of the oscillation signal.",
"For example, if the amplitude of the oscillation signal is larger than the amplitude of the reference signal, a high level signal is generated; and if the amplitude of the oscillation signal is lower than the amplitude of the reference signal, a low level signal is generated.",
"It should be understood that, the pulse width modulation circuit 120 may also be implemented by another circuit, and the present disclosure does not limit that the pulse width modulation circuit 120 is implemented only by a comparator.",
"The low pass filtering circuit 130 is configured to convert the pulse width modulation signal into a direct current control voltage signal, where the direct current control voltage signal is configured to control the voltage controlled resistance circuit 140.The pulse width modulation signal generated by the pulse width modulation circuit 120 is input into the low pass filtering circuit 130, and is converted into the direct current control voltage signal by the low pass filtering circuit 130; and the direct current control voltage signal is input into a voltage controlled end of the voltage controlled resistance circuit 140, so as to control a change of a resistance value of the voltage controlled resistance circuit 140.Optionally, the low pass filtering circuit 130 may be a passive filter or an active filter, and the present disclosure is not limited hereto.",
"The voltage controlled resistance circuit 140 is configured to change the resistance value of the voltage controlled resistance circuit 140 under control of the direct current control voltage signal, to control the amplitude of the oscillation signal.",
"The resistance value of the voltage controlled resistance circuit 140 is changed under the control of the direct current control voltage signal.",
"Optionally, resistance of the voltage controlled resistance circuit 140 may be linear resistance or nonlinear resistance that operates in a linear region.",
"Optionally, the voltage controlled resistance circuit 140 may include metal oxide semiconductor field effect transistor (Metal-Oxide-Semiconductor, MOS).",
"That is, a voltage controlled resistor may be an MOS transistor, but the present disclosure is not limited hereto, and another voltage controlled resistor may also be used.",
"FIG.",
"2 illustrates a schematic diagram of a specific implementation manner of an amplitude limiting oscillation circuit 100 according to an embodiment of the present disclosure.",
"It should be understood that, FIG.",
"2 is only an example, which does not limit the scope of the embodiment of the present disclosure.",
"As shown in FIG.",
"2, the oscillation circuit 110 in FIG.",
"1 may be implemented by an inductor, a capacitor and an MOS transistor.",
"Particularly, the oscillation circuit 110 may include an inductor 111, a first capacitor 112, a first MOS transistor 113, a second MOS transistor 114, a third MOS transistor 115, and a fourth MOS transistor 116.The inductor 111 and the first capacitor 112 form a resonant circuit.",
"The first MOS transistor 113, the second MOS transistor 114, the third MOS transistor 115 and the fourth MOS transistor 116 provide negative resistance for the resonant circuit.",
"A drain electrode of the first MOS transistor 113 and a gate electrode of the second MOS transistor 114 form a positive output end of the oscillation circuit 110, and the positive output end outputs an oscillation signal Vop; and a gate electrode of the third MOS transistor 115 and a drain electrode of the fourth MOS transistor 116 form a negative output end of the oscillation circuit 110, and the negative output end outputs an oscillation signal Von.",
"Optionally, when the oscillation circuit 110 includes the positive output end and the negative output end, a pulse width modulation circuit 120 may be implemented by two comparators.",
"Particularly, the pulse width modulation circuit 120 may include a first comparator 121 and a second comparator 122.A positive input end of the first comparator 121 is connected to the positive output end of the oscillation circuit 110, that is, the oscillation signal Vop may be input into the positive input end of the first comparator 121; and a negative input end of the first comparator 121 is configured to input a first reference signal Vrp.",
"A positive input end of the second comparator 122 is connected to the negative output end of the oscillation circuit 110, that is, the oscillation signal Von may be input into positive input end of the second comparator 122; and a negative input end of the second comparator 122 is configured to input a second reference signal Vrn.",
"Optionally, Vrp and Vrn may be adjustable direct current voltage signals.",
"Optionally, Vdd>Vrp>Vrn>Vgd, where Vdd is a voltage of a power supply, and Vgd is a voltage of a ground end.",
"The first comparator 121 compares Vop with Vrp, and outputs a positive pulse width modulation signal Vp1; and The second comparator 122 compares Von with Vrn, and outputs a negative pulse width modulation signal Vp2.Optionally, when the pulse width modulation circuit 120 includes two comparators, the low pass filtering circuit 130 may be implemented by two low pass filters.",
"Particularly, the low pass filtering circuit 130 may include a first low pass filter and a second low pass filter.",
"As shown in FIG.",
"2, the first low pass filter may include a first resistor 131 and a second capacitor 132, where an input end of the first low pass filter is connected to an output end of the first comparator 121, and an output end of the first low pass filter is connected to a gate electrode of a fifth MOS transistor 141.An input of the first low pass filter is Vp1, and the first low pass filter outputs a direct current control voltage signal Vp2 to the gate electrode of the fifth MOS transistor 141.The second low pass filter may include a second resistor 133 and a third capacitor 134, where an input end of the second low pass filter is connected to an output end of the second comparator 122, and an output end of the second low pass filter is connected to a gate electrode of a sixth MOS transistor 142.An input of the second low pass filter is Vn1, and the second low pass filter outputs a direct current control voltage signal Vn2 to the gate electrode of the sixth MOS transistor 142.Correspondingly, the voltage controlled resistance circuit 140 also includes two parts.",
"As shown in FIG.",
"2, the voltage controlled resistance circuit 140 may include: the fifth MOS transistor 141, where a source electrode of the fifth MOS transistor 141 is connected to the power supply Vdd, and a drain electrode of the fifth MOS transistor 141 is connected to a source electrode of the first MOS transistor 113 and a source electrode of the second MOS transistor 114; and the sixth MOS transistor 142, where a source electrode of the sixth MOS transistor 142 is connected to ground Vgd, and a drain electrode of the sixth MOS transistor 142 is connected to a source electrode of the third MOS transistor 115 and a source electrode of the fourth MOS transistor 116.The gate electrode of the fifth MOS transistor 141 and the gate electrode of the sixth MOS 142 are voltage controlled ends of the voltage controlled resistance circuit 140.An upper loop in FIG.",
"2 may be called as a P-type feedback loop; and a lower loop in FIG.",
"2 may be called as an N-type feedback loop.",
"The P-type feedback loop and the N-type feedback loop are completely symmetrical, and working principles of the two are similar.",
"Taking the P-type feedback loop as an example, when the oscillation circuit starts oscillating, an amplitude of Vop gets larger gradually, and when the amplitude is larger than Vrp, the comparator 121 outputs a high pulse; since Vop is a sine wave signal, the larger the amplitude of Vop is, the wider the width of the high pulse output by the comparator 121 is.",
"A direct current voltage Vp2, that is proportional to the width of the pulse, is obtained after the pulse is passed through a low pass filter.",
"If Vp2 is higher, equivalent resistance of the fifth MOS transistor 141 is greater.",
"That is, if the amplitude of the oscillation circuit becomes larger, the width of the pulse becomes wider, Vp2 increases, the resistance of the fifth MOS transistor 141 increases, negative resistance of the first MOS transistor 113 and the second MOS transistor 114 reduces due to an effect of source electrode negative feedback, and thus the output amplitude begins to decrease.",
"Similarly, an operating principle of the N-type feedback loop may be known.",
"Optionally, as shown in FIG.",
"3, an amplitude limiting oscillation circuit 100 may further include: a switching circuit 150, configured to switch a connection between a positive input end or a negative output end and a pulse width modulation circuit 120.When an oscillation circuit 110 includes the positive output end and the negative output end, a connection between the positive output end or the negative output end and different input ends of the pulse width modulation circuit 120 may be switched through the switching circuit 150.Optionally, as shown in FIG.",
"4, a switching circuit 150 may include: a third comparator 151, an inverter 152, a first switch 153, a second switch 154, a third switch 155 and a fourth switch 156.A positive input end of the third comparator 151 is connected to a positive output end of an oscillation circuit 110, a negative input end of the third comparator 151 is connected to a negative output end of the oscillation circuit 110, an input end of the inverter 152 is connected to an output end of the third comparator 151, an output signal Vsp of the third comparator 151 is used to control the first switch 153 and the fourth switch 156, and an output signal Vsn of the inverter 152 is used to control the second switch 154 and the third switch 155.In this case, optionally, a pulse width modulation circuit 120 may include: a first comparator 121, where a positive input end of the first comparator 121 is connected to the positive output end of the oscillation circuit 110 through the first switch 153, and connected to the negative output end of the oscillation circuit 110 through the second switch 154, and a negative input end of the first comparator 121 is configured to input a first reference signal Vrp; and a second comparator 122, where a positive input end of the second comparator 122 is connected to the positive output end of the oscillation circuit 110 through the third switch 155, and connected to the negative output end of the oscillation circuit 110 through the fourth switch 156, and a negative input end of the second comparator 122 is configured to input a second reference signal Vrn.",
"When Vop is greater than Von, Vsp is a high level, the first switch 153 and the fourth switch 156 are switched on, and the second switch 154 and the third switch 155 are switched off; the first comparator 121 compares Vop with Vrp to outputs Vp1; and the second comparator 122 compares Von with Vrn to outputs Vn1; and Vsp is a low level and Vsn is a high level, the second switch 154 and the third switch 155 are switched on, and the first switch 153 and the fourth switch 156 are switched off; the first comparator 121 compares Von with Vrp to outputs Vp1; and the second comparator 122 compares Vop with Vrn to outputs Vn1.Therefore, whether Vop is greater than Von, or Vop is less than Von, the first comparator 121 may output Vp1, and the second comparator 122 may output Vn1; that is, ranges of duty cycle of Vp1 and Vn1 may both be changed to 0˜100%.",
"The parts oscillation circuit, the low pass filtering circuit and the voltage controlled resistance circuit in the FIG.",
"4 are similar to that in FIG.",
"2; and for concision, they will not be described redundantly herein.",
"An operating principle of the amplitude limiting oscillation circuit in FIG.",
"4 is similar to that in FIG.",
"2, and the difference lies in that the adjustable range is expanded since a switching circuit is used in FIG.",
"4.Taking the P-type feedback loop as an example, in FIG.",
"2, a range of duty cycle of Vp1 is 0˜50%, a voltage range of Vp2 after filtering is 0˜0.5Vdd, and the adjustable range is relatively narrow.",
"However, in FIG.",
"4, the range of duty cycle of Vp1 is changed to 0˜100%, thereby widening the adjustable range.",
"According to an amplitude limiting oscillation circuit of the embodiments of the present disclosure, negative feedback is performed by using a voltage controlled resistance circuit, and a control loop may not introduce extra noise; therefore, phase noise of the amplitude limiting oscillation circuit is lower.",
"Further, amplitude control of the amplitude limiting oscillation circuit of the embodiments of the present disclosure is mainly based on source electrode feedback; therefore, the manner of the amplitude control does not have a problem of stability, that is, the stability of the amplitude limiting oscillation circuit of the embodiments of the present disclosure is better.",
"In addition, when a comparator is used, amplitude of the amplitude limiting oscillation circuit depends on a reference voltage of the comparator, that is, a final amplitude range of the amplitude limiting oscillation circuit is very close to the reference voltage of the comparator; therefore, it is easy to control the oscillation amplitude of the amplitude limiting oscillation circuit of the embodiments of the present disclosure.",
"Therefore, with the technical solution of the embodiments of the present disclosure, performance of an amplitude limiting oscillation circuit may be improved.",
"Another embodiment of the present disclosure further provides a chip, and the chip may include the amplitude limiting oscillation circuit of the foregoing embodiments of the present disclosure.",
"It should be understood that, the specific examples in this text is for helping those skilled in the art to better understand the embodiments of the present disclosure, rather than limiting the scope of the embodiments of the present disclosure.",
"Those of ordinary skill in the art may realize that, units and algorithm steps in conjunction with the various examples described by the embodiments disclosed herein can be realized by electronic hardware, computer software or the combination thereof, and in order to clearly describe the interchangeability of hardware and software, the compositions and steps of the various examples are generally described according to functions in the foregoing description.",
"Whether these functions are executed in hardware or software mode depends on the specific applications and design constraint conditions of the technical solution.",
"Those skilled may implement the described functions by using different methods for each specific application, but this implementation should not be considered to be beyond the scope of the present disclosure.",
"In the several embodiments provided in the present application, it should be understood that, the disclosed system, apparatus and method may be implemented in other manners.",
"For example, the apparatus embodiments described above are merely exemplary, e.g., the division of the units is merely a logic function division, other division manners may exist in practical implementation, for example, a plurality of units or components may be combined or integrated to another system, or some features may be omitted or not implemented.",
"In addition, the displayed or discussed mutual coupling or direct coupling or communication connection may be indirect coupling or communication connection via some interfaces, apparatuses or units, and may also be in electrical, mechanical or other forms.",
"The units described as separate parts may be or may not be separated physically, and a component displayed as a unit may be or may not be a physical unit, namely, may be located in one place, or may be distributed on a plurality of network units.",
"A part of or all of the units may be selected to achieve the purposes of the solution in the embodiments of the present disclosure according to actual demands.",
"In addition, the respective functional units in the respective embodiments of the present disclosure may be integrated in one processing unit, or the respective units singly exist physically, or two or more units are integrated in one unit.",
"The foregoing integrated unit may be implemented in the form of hardware, or be implemented in a form of a software functional unit.",
"If the integrated unit is implemented in the form of the software functional unit and is sold or used as an independent product, it may be stored in a computer readable storage medium.",
"Based on such understanding, the technical solution of the present disclosure substantially, or the part of the present disclosure making contribution to the prior art, or all of or part of the technical solution may be embodied in the form of a software product, and the computer software product is stored in a storage medium, which includes multiple instructions enabling computer equipment (which may be a personal computer, a server, network equipment or the like) to execute all of or part of the steps in the methods of the embodiments of the present disclosure.",
"The foregoing storage medium includes a variety of media capable of storing program codes, such as a USB disk, a mobile hard disk, a read-only memory (ROM, Read-Only Memory), a random access memory (RAM, Random Access Memory), a magnetic disk, an optical disk or the like.",
"Described above is the specific embodiments of the present disclosure only, but the protection scope of the present disclosure is not limited to this, any skilled one who is familiar with this art could readily think of various equivalent modifications or substitutions within the disclosed technical scope of the present disclosure, and these modifications or substitutions shall fall within the protection scope of the present disclosure.",
"Therefore, the protection scope of the present disclosure shall be defined by the claims."
]
] |
Patent_15871427
|
[
[
"Tissue Adjustment Implant",
"Tissue adjustment implants useful for adjusting a position of tissue in a patient are described.",
"In an embodiment, a tissue adjustment implant includes a main body having a series of outwardly-extending projections.",
"The tissue adjustment implants can be used in a variety of treatments, such as in the treatment of Obstructive Sleep Apnea and snoring."
],
[
"1.A tissue adjustment implant, comprising: a main body extending along a lengthwise axis and having first and second opposing ends, first and second opposing sides, first and second opposing surfaces, and a first width extending from the first side to the second side orthogonally to the longitudinal axis and through the longitudinal midpoint; a first anchor portion disposed on the first end, the first anchor portion having a second width extending orthogonally to the longitudinal axis, the second width being greater than the first width; and a series of projections disposed on the first side, each projection of the series of projections extending away from the second end and the longitudinal axis of the main body.",
"2.The tissue adjustment implant of claim 1, further comprising a throat portion that transitions from the first width to the second width.",
"3.The tissue adjustment implant of claim 1, wherein the second side contains no projections.",
"4.The tissue adjustment implant of claim 1, wherein the first anchor portion defines an arrowhead having a first arrowhead side oriented at an angle to a second arrowhead side.",
"5.The tissue adjustment implant of claim 4, wherein the angle is an acute angle.",
"6.The tissue adjustment implant of claim 4, wherein the acute angle comprises an angle between about 35 degrees and about 90 degrees.",
"7.The tissue adjustment implant of claim 4, wherein the acute angle comprises an angle between about 45 degrees and about 90 degrees.",
"8.The tissue adjustment implant of claim 4, wherein the acute angle comprises an angle of about 45 degrees.",
"9.The tissue adjustment implant of claim 4, wherein the acute angle comprises an angle of 45 degrees.",
"10.The tissue adjustment implant of claim 4, wherein the angle is an obtuse angle.",
"11.The tissue adjustment implant of claim 4, wherein the angle is a right angle.",
"12.The tissue adjustment implant of claim 4, wherein the arrowhead defines a terminal point; and wherein the terminal point comprises a rounded point.",
"13.The tissue adjustment implant of claim 1, wherein at least one projection of the series of projections comprises a wing-shaped member having a base and an end, the base having a base width that extends parallel to the longitudinal axis of the main body and the end having an end width that extends parallel to the longitudinal axis of the main body; and wherein the base width is greater than the end width.",
"14.The tissue adjustment implant of claim 1, wherein each projection of the series of projections comprises a wing-shaped member having a base and an end, the base having a base width that extends parallel to the longitudinal axis of the main body and the end having an end width that extends parallel to the longitudinal axis of the main body and that is less than the base width.",
"15.The tissue adjustment implant of claim 1, wherein said issue adjustment implant comprises a bioremodelable material.",
"16.The tissue adjustment implant of claim 15, wherein the bioremodelable material comprises an extracellular matrix (ECM) material.",
"17.The tissue adjustment implant of claim 16, wherein the extracellular matrix material comprises small intestine submucosa (SIS).",
"18.The tissue adjustment implant of claim 1, wherein said tissue adjustment implant comprises an integral, multi-laminate construct comprising layers of small intestine submucosa (SIS).",
"19.A tissue adjustment implant, comprising: a main body extending along a lengthwise axis and having first and second opposing ends, first and second opposing sides, first and second opposing surfaces, and a first width extending from the first side to the second side orthogonally to the longitudinal axis and through the longitudinal midpoint; a first anchor portion disposed on the first end, the first anchor portion defining an arrowhead having a first arrowhead side oriented at an angle to a second arrowhead side and having a second width extending orthogonally to the longitudinal axis; a throat portion that transitions from the first width to the second width; and a series of projections disposed on the first side, each projection of the series of projections extending away from the second end and the longitudinal axis of the main body.",
"20.A tissue adjustment implant, comprising: a main body extending along a lengthwise axis and having first and second opposing ends, first and second opposing sides, first and second opposing surfaces, and a first width extending from the first side to the second side orthogonally to the longitudinal axis and through the longitudinal midpoint; a first anchor portion disposed on the first end, the first anchor portion defining an arrowhead having a first arrowhead side oriented at an acute angle to a second arrowhead side and having a second width extending orthogonally to the longitudinal axis; a throat portion that transitions from the first width to the second width; and a series of projections disposed only on the first side, each projection of the series of projections extending away from the second end and the longitudinal axis of the main body and comprising a wing-shaped member having a base and an end, the base having a base width that extends parallel to the longitudinal axis of the main body and the end having an end width that extends parallel to the longitudinal axis of the main body and that is less than the base width."
],
[
"<SOH> BACKGROUND <EOH>It is sometimes necessary or desirable to secure a tissue or portion of a tissue within the body of an animal, such as a human, in a manner that temporarily or permanently adjusts a position or orientation of the tissue or portion of a tissue.",
"For example, in the treatment of Obstructive Sleep Apnea (OSA), it may be desirable to adjust the position of one or more tissues or portions of tissue, such as the soft palate.",
"OSA is a clinical disorder in which a partial or complete collapse of soft tissue occurs in the airway during sleep.",
"This leads to a blockage of the airway and impaired breathing during sleep.",
"Mild OSA can lead to fatigue, reduced alertness following sleep, and a general reduction in productivity for the affected individual.",
"Severe OSA can lead to sleep deprivation, hypoxemia, and depression.",
"The art provides various options for the treatment of OSA.",
"Continuous Positive Airway Pressure (CPAP) machines, which supply positive air pressure through a facemask and into the airway during sleep, are used most frequently.",
"The positive air pressure maintains an open airway to prevent apnea and snoring.",
"While these machines are generally considered effective, they are bulky, noisy, and cumbersome to use.",
"Furthermore, use of these machines can be socially awkward for some individuals.",
"Oral appliances that force the jaw forward to maintain an open airway can also be used.",
"These devices are generally considered to be not as effective as CPAP machines, and can be uncomfortable to use.",
"Furthermore, these devices are frequently ejected from the mouth during sleep, reducing their effectiveness over the entire course of a sleeping period.",
"Invasive surgical procedures can also be used to treat OSA.",
"Various techniques have been described, including uvulopalatopharyngoplasty (UPPP), maxillomandibular advancement (MMA), and even tracheostomy.",
"Surgical procedures are generally considered to have limited and potentially short-lived effectiveness.",
"Furthermore, many of the procedures require hospitalization and the use of general anesthesia.",
"As a result, these procedures are generally reserved for severe cases of OSA.",
"The AIRvance™ System from Medtronic, formerly known as the Repose System, provides a surgical-based tongue suspension procedure that can be performed with or without an adjunct hyoid suspension procedure.",
"These suspension procedures require a surgical incision and dissection of the neck below the mandible.",
"Following implantation of one or more necessary bone screws, sutures are lashed around the tongue and/or hyoid bone and secured with surgical knots.",
"While these procedures offer less complicated solutions than the surgical procedures above, they still require surgical intervention and suffer from the drawbacks associated with surgical procedures.",
"Furthermore, over time, the sutures used to suspend the tongue and/or hyoid bone may weaken or even snap, which may limit the effectiveness of the treatment over time.",
"Lastly, the use of sutures in these procedures necessitates the use of specialized knotting and securement techniques to complete the procedure, which adds an additional opportunity for error and failure in the device and the procedure.",
"Considering the disadvantages of the various available treatment options described above, a need exists for improved devices for adjustment of tissue within the body.",
"Furthermore, a need exists for additional options, including implantable medical devices, for the treatment of OSA."
],
[
"RELATED APPLICATION This application is a continuation of U.S. patent application Ser.",
"No.",
"14/449,195, filed on Aug. 1, 2014 and which claims the benefit of U.S.",
"Provisional Application No.",
"61/861,089, filed on Aug. 1, 2013.The disclosure of each of these related applications is hereby incorporated into this disclosure in its entirety.",
"FIELD The disclosure relates generally to the field of implantable medical devices.",
"Particular embodiments relate to tissue adjustment implants.",
"BACKGROUND It is sometimes necessary or desirable to secure a tissue or portion of a tissue within the body of an animal, such as a human, in a manner that temporarily or permanently adjusts a position or orientation of the tissue or portion of a tissue.",
"For example, in the treatment of Obstructive Sleep Apnea (OSA), it may be desirable to adjust the position of one or more tissues or portions of tissue, such as the soft palate.",
"OSA is a clinical disorder in which a partial or complete collapse of soft tissue occurs in the airway during sleep.",
"This leads to a blockage of the airway and impaired breathing during sleep.",
"Mild OSA can lead to fatigue, reduced alertness following sleep, and a general reduction in productivity for the affected individual.",
"Severe OSA can lead to sleep deprivation, hypoxemia, and depression.",
"The art provides various options for the treatment of OSA.",
"Continuous Positive Airway Pressure (CPAP) machines, which supply positive air pressure through a facemask and into the airway during sleep, are used most frequently.",
"The positive air pressure maintains an open airway to prevent apnea and snoring.",
"While these machines are generally considered effective, they are bulky, noisy, and cumbersome to use.",
"Furthermore, use of these machines can be socially awkward for some individuals.",
"Oral appliances that force the jaw forward to maintain an open airway can also be used.",
"These devices are generally considered to be not as effective as CPAP machines, and can be uncomfortable to use.",
"Furthermore, these devices are frequently ejected from the mouth during sleep, reducing their effectiveness over the entire course of a sleeping period.",
"Invasive surgical procedures can also be used to treat OSA.",
"Various techniques have been described, including uvulopalatopharyngoplasty (UPPP), maxillomandibular advancement (MMA), and even tracheostomy.",
"Surgical procedures are generally considered to have limited and potentially short-lived effectiveness.",
"Furthermore, many of the procedures require hospitalization and the use of general anesthesia.",
"As a result, these procedures are generally reserved for severe cases of OSA.",
"The AIRvance™ System from Medtronic, formerly known as the Repose System, provides a surgical-based tongue suspension procedure that can be performed with or without an adjunct hyoid suspension procedure.",
"These suspension procedures require a surgical incision and dissection of the neck below the mandible.",
"Following implantation of one or more necessary bone screws, sutures are lashed around the tongue and/or hyoid bone and secured with surgical knots.",
"While these procedures offer less complicated solutions than the surgical procedures above, they still require surgical intervention and suffer from the drawbacks associated with surgical procedures.",
"Furthermore, over time, the sutures used to suspend the tongue and/or hyoid bone may weaken or even snap, which may limit the effectiveness of the treatment over time.",
"Lastly, the use of sutures in these procedures necessitates the use of specialized knotting and securement techniques to complete the procedure, which adds an additional opportunity for error and failure in the device and the procedure.",
"Considering the disadvantages of the various available treatment options described above, a need exists for improved devices for adjustment of tissue within the body.",
"Furthermore, a need exists for additional options, including implantable medical devices, for the treatment of OSA.",
"DESCRIPTION OF FIGURES FIG.",
"1 is a perspective view of an embodiment of a tissue adjustment implant.",
"FIG.",
"2 is a perspective view of another embodiment of a tissue adjustment implant.",
"FIG.",
"2A is a magnified view of area I indicated in FIG.",
"2.FIG.",
"3A is a perspective view of another embodiment of a tissue adjustment implant.",
"FIG.",
"3B is a perspective view of another embodiment of a tissue adjustment implant.",
"FIG.",
"3C is a perspective view of another embodiment of a tissue adjustment implant.",
"FIG.",
"3D is a perspective view of another embodiment of a tissue adjustment implant.",
"FIG.",
"3E is a perspective view of another embodiment of a tissue adjustment implant.",
"FIG.",
"3F is a perspective view of a projection member isolated from the implant illustrated in FIG.",
"3E.",
"FIG.",
"4A is a perspective view of another embodiment of a tissue adjustment implant.",
"FIG.",
"4B is a perspective view of another embodiment of a tissue adjustment implant.",
"FIG.",
"4C is a perspective view of another embodiment of a tissue adjustment implant.",
"FIG.",
"4D is a perspective view of another embodiment of a tissue adjustment implant.",
"FIG.",
"4E is a perspective view of another embodiment of a tissue adjustment implant.",
"FIG.",
"5 is a schematic of an oral cavity of a patient within which two tissue adjustment implants have been placed.",
"FIG.",
"6 is a top view of another embodiment of a tissue adjustment implant.",
"FIG.",
"6A is an elevation view of the tissue adjustment implant illustrated in FIG.",
"6.FIG.",
"6B is another elevation view of the tissue adjustment implant illustrated in FIG.",
"6.FIG.",
"7 is a top view of another embodiment of a tissue adjustment implant.",
"FIG.",
"8 is an elevation view of a delivery device for implanting a tissue adjustment implant.",
"FIG.",
"9 is a magnified view of area II illustrated in FIG.",
"8.FIG.",
"10 is a sectional view of the cannula of the delivery device illustrated in FIG.",
"9, taken along line 10-10.FIG.",
"11 is a sectional view of the cannula of the delivery device illustrated in FIG.",
"9, taken along line 11-11.FIG.",
"12 is a partial top view of the delivery device illustrated in FIG.",
"9.A tissue adjustment implant is loaded in the cannula of the delivery device.",
"FIG.",
"13 is a schematic of an oral cavity of a patient within which two tissue adjustment implants have been placed.",
"DESCRIPTION OF EMBODIMENTS The following detailed description and the appended drawings describe and illustrate various example embodiments.",
"The description and illustration of these examples are provided to enable one skilled in the art to make and use a tissue adjustment implant.",
"They are not intended to limit the scope of the claims in any manner.",
"FIG.",
"1 illustrates an example of a tissue adjustment implant 10.The tissue adjustment implant 10 has a main body 12 comprising a substantially flat member extending from a first end 14 to an opposing second end 16 and having first 18 and second 20 opposing sides.",
"The main body 12 has a first 22 or upper surface and an opposing second 24 or lower surface.",
"The main body 12 has a lengthwise axis 26 and a transverse axis 28 that orthogonally intersects the lengthwise axis 26 at a longitudinal midpoint 30 disposed on the lengthwise axis 26.A first anchor portion 32 extends along the lengthwise axis 26 of the main body 12 from a point on the lengthwise axis 26 between the longitudinal midpoint 30 and the first end 14 to the first end 14.Similarly, a second anchor portion 34 extends along the lengthwise axis 26 of the main body 12 from a point on the lengthwise axis 26 between the longitudinal midpoint 30 and the second end 16 to the second end 16.A middle portion 36 extends along the lengthwise axis 26 of the main body 12 across the longitudinal midpoint 30 from an end of the first anchor portion 32 to an end of the second anchor portion 34.The first anchor portion 32 defines a first series of projections 38.Similarly, the second anchor portion 34 defines a second series of projections 40.Each of the first 38 and second 40 series of projections includes a series of projections that extend outwardly from the respective side 18, 20 of the main body 12, away from the longitudinal axis 26.The middle portion 36 is free of outwardly extending projections.",
"As used herein, the term “projection” refers to an outwardly-directed member or portion of a member that extends away from a surface of another member or another portion of a member.",
"An individual projection can have any suitable shape, including regular and irregular shapes, symmetrical and asymmetrical shapes, and any other suitable shape.",
"The term “series of projections” refers to two or more individual projections.",
"A series of projections includes multiple projections having the same shape, size and or/configurations, a series of projections having different sizes, shapes and configurations, a series of projections spaced at regular intervals, such as a toothed surface, a series of projections spaced at different intervals, and a series of projections spaced at irregular intervals.",
"The illustrated embodiment includes a series of projections extending away from each side 18, 20 of the main body in each series of projections 38, 40.It is understood, though, that any suitable number of projections can extend away from each side 18, 20 of the main body 12 in a series of projections, including one projection, two projections, three projections, or more.",
"Indeed, the number of projections that extend away from a side 18, 20 in a series of projections need only be at least one projection.",
"Furthermore, it is noted that a series of projections can include one or more projections that extend away from only one of the sides 18, 20 of the main body 12 or away from both of the sides 18, 20 of the main body 12.In the illustrated embodiment, each projection 42 of the first series of projections 38 is substantially triangular in shape and extends away from the longitudinal axis 26 and away from the first end 14 of the main body 12 toward the transverse axis 28.Similarly, each projection 44 of the second series of projections 40 is substantially triangular in shape and extends away from the longitudinal axis 26 and away from the first end 14 of the main body 12 toward the transverse axis 28.In the illustrated embodiment, a projection 46 of the first series of projections 38 that is farthest from the longitudinal midpoint 30 has a side 48 that is continuous with the first end 14 of the main body 12.Similarly, a projection 50 of the second series of projections 40 that is farthest from the longitudinal midpoint 30 has a side 52 that is continuous with the second end 16 of the main body 12.Inclusion of the opposing series of projections 38, 40 is considered advantageous at least because each series 38, 40 provides an anchor at an end of the tissue adjustment implant 10 that is opposite an end of the implant that is first inserted into the tissue.",
"Once the tissue adjustment implant 10 is then passed through the tissue, the series of projections at the opposite end are able to engage the tissue and, upon the application of additional force on the tissue engaging implant, such as tension, the position of the tissue can be adjusted, such as by lifting or otherwise moving the tissue, as described more fully below.",
"As an example, described in greater detail below, the tissue adjustment implant can be used to engage and adjust the position of the soft palate of a patient, such as in the treatment of Obstructive Sleep Apnea.",
"In the illustrated embodiment, the first 22 and second 24 surfaces of the main body 12 are substantially flat.",
"It is noted, though, that it may be advantages to include one or more bumps, projections or other surface modifications on one or both of the surfaces 22, 24.Inclusion of such modifications may improve the handling of the tissue adjustment implant 10 during use.",
"FIGS.",
"2 and 2A illustrate another tissue adjustment implant 110.In this embodiment, the tissue adjustment implant 110 comprises a main body 112 comprising a substantially flat member extending from a first end 114 to an opposing second end 116 and having first 118 and second 120 opposing sides.",
"The main body 112 has a first 122 or upper surface and an opposing second 124 or lower surface.",
"The main body 112 has a lengthwise axis 126 and a transverse axis 128 that orthogonally intersects the lengthwise axis 126 at a longitudinal midpoint 130 disposed on the lengthwise axis 126.An anchor portion 136 extends along the lengthwise axis 126 of the main body 112 across the longitudinal midpoint 130.A first end portion 132 extends from an end of the first anchor portion 132 to the first end 114 of the main body 112.A second end portion 134 extends from the opposite end of the anchor portion 132 to the second end 116 of the main body 112.In this embodiment, the anchor portion 136 defines a first series of projections 138 and a second series of projections 140.Each of the first 138 and second 140 series of projections includes a series of projections that extend outwardly from the respective side 118, 120 of the main body 112, away from the longitudinal axis 126.The first 132 and second 134 end portions are free of outwardly extending projections.",
"As best illustrated in FIG.",
"2A, each projection 142 of the first 138 and second 140 series of projections is a wing-shaped member that extends radially outward from a side 120 of the main body 112.The wing-shaped member has a relatively wide base 160 that lies along a hypothetical extension of the side 120 and a relatively narrow end 162 that lies on hypothetical line that is parallel to the side 120.As best illustrated in FIG.",
"2, each projection 142 of the first 138 and second 140 series or projections extends away from the respective side 118, 120 and away from the first end 114 of the main body.",
"In the illustrated embodiment, as best illustrated in FIG.",
"2A, each projection 142 of the first 138 and second 140 series of projections extends away from the respective side 118, 120 of the main body at an angle such that an obtuse angle a is formed on the side of the projection 142 that is closest the first end 114 of the main body 112 and such that an acute angle β is formed on the side of the projection 142 that is closest the second end 116 of the main body 112.While any suitable configuration can be used for the projections 142, this configuration facilitates placement and anchoring.",
"In this embodiment, the main body 112 defines a series of openings 164 positioned along the lengthwise axis 126.Each opening of the series of openings 164 extends through the thickness of the main body 112 from the first surface 122 to the second surface 124.As such, each opening defines a passageway that extends through the main body 112.In this embodiment, as best illustrated in FIG.",
"2, the series of openings 164 extends along the entire anchor portion 136 of the main body 112.It is noted that any opening in the series of openings 164 can have one or more dimensions that differ from the same dimension or dimensions of another opening in the series of openings 164 while also have one or more dimension that is the same or substantially similar to the same dimension or dimensions of the other openings of the series of openings 164.For example, each opening of the series of openings 164 may have a rectangular shape, with one or more opening having a length and width that differ from the length and width of one or more other rectangular-shaped openings.",
"Also, while the illustrated embodiment includes a series of openings 164, it is noted that any suitable number of openings can be included in a tissue adjustment implant according to a particular embodiment, including zero, one, two, three, or any other suitable number of openings.",
"Inclusion of one or more openings facilitates anchoring of a tissue adjustment implant following implantation.",
"In this embodiment, a lead 170 is attached to the first end 114 of the main body.",
"The lead 170 provides a leading structure that can be used to form an opening in and/or introduce the tissue adjustment implant into tissue.",
"As such, the lead 170 advantageously includes a portion that can cut into tissue.",
"For example, in the illustrated embodiment, the lead 170 comprises a needle 172 secured to a suture 174 that is attached to the main body 112 near the first end 114.It is noted, though, that any suitable lead structure can be used, including a cutting edge or point that is disposed in the first end of a main body of tissue adjustment implant.",
"In this embodiment, a plug 180 is disposed on the second end 116 of the main body 112.The plug 180 has a width 182 that is greater than a width 184 of the main body 112 measured from one side 118 to the other 120.In the illustrated embodiment, the plug 180 is a separate member that has been attached to the main body, such as by an adhesive or through mechanical attachment.",
"It is noted, though, that in other embodiments the plug can be integrally formed with the main body.",
"Inclusion of a plug on an end of the main body facilitates implantation of a tissue adjustment implant because it provides a mechanical stop that impedes further passage of the tissue adjustment implant into the tissue once the plug has reached the point of entry into the tissue, such as an opening through which the remainder of the tissue adjustment implant has been passed.",
"Also, by providing a mechanical stop that impedes further passage of the tissue adjustment implant, the inclusion of a plug facilitates the adjustment function of the tissue adjustment implant.",
"For example, once the plug has reached the point of entry into the tissue, a continued pulling on the tissue adjustment implant, such as a continued pulling on lead attached to the first end of the main body or on the first end of the main body itself, will produce a pulling force on the tissue surrounding the plug at the point of entry.",
"This can be used to lift, move or otherwise adjust the position of the tissue within the body through the application of a simple pulling force on the tissue adjustment implant.",
"Each of FIGS.",
"3A, 3B, 3C, 3D, and 3E illustrates a tissue adjustment implant that includes an alternative structure for a series of projections.",
"FIG.",
"3A illustrates a tissue adjustment implant 210 that includes a flat main body 212 into which a series of projections 290 has been formed by cutting through the thickness of the main body 212.This forms projections that can extend outward from one 222 or the other 224 surfaces of the main body 212.Any suitable technique can be used to form the projections in this manner, including die cutting and laser cutting techniques.",
"The specific technique selected for a particular embodiment with depend on various considerations, including the material of the main body and the size and configuration of the projections.",
"Laser cutting is a suitable technique for forming projections in a main body that comprises a flat sheet, such as a flat sheet of small intestine submucosa.",
"Additional projections extend radially outward from the sides 218, 220 of the main body 212.Any suitable angle, length, shape and configuration can be used for the projections.",
"FIG.",
"3B illustrates a tissue adjustment implant 310 that has projections that are similar in shape to those of the tissue adjustment implant 210 illustrated in FIG.",
"3A, but that are relatively larger.",
"In this embodiment, a series of projections 390 has been formed by cutting through the thickness of the main body 312.This forms projections that can extend outward from one 322 or the other 324 surfaces of the main body 312.Additional projections extend radially outward from the sides 318, 320 of the main body 312.FIG.",
"3C illustrates a tissue adjustment implant 410 that includes a substantially round, elongate main body 412.A series of projections 490 has been formed by cutting into the main body 412 at an angle to form a wedge-shaped projection.",
"Each projection of the series of projections has been pulled slightly away from the main body 412.FIG.",
"3D illustrates a tissue adjustment implant 510 that includes a series of projections 590 that is integrally formed with the main body 512.Each projection of the series of projections comprises a substantially circular-shaped body.",
"In this embodiment, along with other embodiments in which the projections are integrally formed with the main body, the projections can be formed during the process of forming the main body, such as in a molding technique.",
"FIG.",
"3E illustrates a tissue adjustment implant 610 in which a series of separate projection-defining members 690 have been passed over a main body 612.FIG.",
"3F illustrates a single projection-defining member 690 isolated from the tissue adjustment implant.",
"As best illustrated in that Figure, each projection-defining member 690 defines outwardly-extending projections 692 and an opening 694.The tissue adjustment implant 610 is formed by passing the main body 612 through the opening 694 of each of a series of projection-defining members 690.Once disposed on the main body 612, the projection-defining members can be rotated about its lengthwise axis to place the projections in an offsetting relationship with respect to each other.",
"While a series of projection-defining members 690 is illustrated, it is noted that any suitable number can be used, including one, two, three or any suitable number.",
"Also, while the illustrated projection-defining members 690 are star-shaped, any suitable shape, size and configuration can be used, including any configuration that provides the desired outwardly-extending projections.",
"It is noted that, while not illustrated in the Figures, any of the tissue adjustment implants illustrated in FIGS.",
"3A, 3B, 3C, 3D and 3E can include any suitable lead attached to the main body, as described above, as well as any suitable plug, as described above and below.",
"If included, the plug can have any suitable size, shape and configuration.",
"Indeed, the plug in a tissue adjustment implant according to a particular embodiment need only have sufficient structure to provide the desired mechanical stop, as described above.",
"Each of FIGS.",
"4A, 4B, 4C, 4D, and 4E illustrates a tissue adjustment implant that includes an example structure for a plug.",
"FIG.",
"4A illustrates a tissue adjustment implant 710 that includes a plug 780 that is integrally formed with the main body 712 of the tissue adjustment implant 710.In this embodiment, the plug 780 has a stopper configuration, with a base 782, an end 784, and a frustoconical wall 786 that extends between the base 782 and end 784.The base 782 and end 784 are flat and parallel with each other.",
"FIG.",
"4B illustrates a tissue adjustment implant 810 that includes a plug 880 that comprises a separate element that has been attached to the main body 812 of the tissue adjustment implant 810.In this embodiment, the plug 880 has a rounded button configuration, with a base 882 and a rounded end 884 that meets the base 882 at outer edge 886 of the base 882.The plug 880 can be attached to the main body 812 by forming an opening 888 in a section of material, such as excess material from the forming of the main body 812, and placing an end 816 of the main body into the opening 888.An adhesive or other suitable agent for securing the plug 880 to the main body 812, can be added to the connection, such as in the opening 882, around an interface between the plug 880 and main body 812, or both.",
"FIG.",
"4C illustrates a tissue adjustment implant 910 that includes a plug 980 that is integrally formed with the main body 912 of the tissue adjustment implant.",
"In this embodiment, the plug 980 has a flattened button configuration, with a base 982 and a rounded end 984 that meets the base 982 at a point that is radially inward from the outer edge 986 of the base 982.This forms a circumferential shoulder 988 that extends around the plug 980 slightly inward from the outer edge 986 of the base 982.The plug 980 can be formed with the main body 912 by including a partial spherical or other rounded chamber, adjacent a chamber of appropriate size and configuration for forming the base 982, in the forming of the main body 912.FIG.",
"4D illustrates a tissue adjustment implant 1010 that includes a main body 1012 formed of multiple sheets 1082, 1084 of material that have been attached to each other.",
"In this embodiment, the plug 1080 comprises an end portion 1086 of the first 1082 sheet and an end portion 1088 of the second 1084 sheet that have been separated from each other and coated with a stiffening or other suitable agent, such as PLGA, to maintain their separated position.",
"In the illustrated embodiment, the end portions 1086, 1088 have been positioned at orthogonal angles to the longitudinal axis of the main body 1012, but it is noted that any suitable angle can be used, including a substantially orthogonal angle, an obtuse angle, and an acute angle.",
"Also, it is noted that, while described as having been separated from each other after the sheets 1082, 1084 have been attached to each other, the end portions 1086, 1088 can also be positioned as described prior to other portions of the sheets 1082, 1084 being attached to each other.",
"Lastly, while described as first 1082 and second 1084 sheets, one or both of the sheets can comprise a group of two or more sheets, such as a series of sheets.",
"FIG.",
"4E illustrates a tissue adjustment implant 1110 that includes a plug 1180 that comprises a simple knot tied an end portion 1182 of the main body 1112.Thus, even if a tissue adjustment implant according to a particular embodiment doesn't initially include a plug, a user can form a plug at or near the time of use, if desired.",
"FIGS.",
"6, 6A and 6B illustrate another example of a tissue adjustment implant 1200.The tissue adjustment implant 1200 has a main body 1212 comprising a substantially flat member extending from a first end 1214 to an opposing second end 1216 and having first 1218 and second 1220 opposing sides.",
"The main body 1212 has a first 1222 or upper surface and an opposing second 1224 or lower surface.",
"The main body 1212 has a lengthwise axis 1226 and a transverse axis 1228 that orthogonally intersects the lengthwise axis 1226 at a longitudinal midpoint 1230 disposed on the lengthwise axis 1226.A first anchor portion 1232 is disposed on the first end 1214 of the main body 1212 and defines an arrowhead 1280 having a terminal point 1282.First 1284 and second 1286 sides of the arrowhead 1280 are oriented at angle 1288 with respect to each other.",
"In contrast to some of the examples described above, the second end 1216 in the example embodiment does not include a plug or other terminal structure, although inclusion of a plug or other suitable structure may be desirable in certain embodiments.",
"A series of projections 1238 extends from one side 1218 of the main body 1210.The other side 1220 is substantially flat and contains no projections.",
"Thus, in this embodiment, projections extend from only one side of the main body 1210.Also, each of the projections in the series of projections 1238 extends away from the main body 1210, away from the second end 1216.Also, the first 1284 and second 1286 sides of the arrowhead 1280 extend away from the main body 1210 and away from the first end 1214.The main body 1210 includes a throat portion 1290 that transitions from the width of the base of the arrowhead 1280 to the width of the main body 1210, taken from the first side 1218 to the second side 1220.The inventors have determined that inclusion of the throat portion 1290 provides desirable loading and implantation properties.",
"The inventors have determined that the inclusion of the arrowhead 1280 and the series of projections 1238 on one side 1218 on the tissue adjustment implant 1200 provides desirable anchoring characteristics while maintaining a low profile structure that facilitates implantation and retention.",
"The tissue adjustment implant 1200 can be formed as an integral unit that defines the main body, series of projections, first anchor portion, and throat portion.",
"In these embodiments, an integral unit formed as a multi-laminate construct, as described below, is considered advantageous.",
"Alternatively, the tissue adjustment implant 1200 can be formed as separate portions that are attached or otherwise secured to each other.",
"For example, a main body can be formed with the projections, and an anchor portion, such as an anchor portion that defines an arrowhead, can be attached or otherwise secured to an end of the main body to form a tissue adjustment implant.",
"FIG.",
"7 illustrates an alternate tissue adjustment implant 1200′.",
"The tissue adjustment implant 1210′ according to this embodiment is the same as the tissue adjustment implant 1200 described above and illustrated in FIGS.",
"6, 6A, and 6B, except as detailed below.",
"Thus, the tissue adjustment implant 1200′ has a main body 1212′ comprising a substantially flat member extending from a first end 1214′ to an opposing second end 1216′ and having first 1218′ and second 1220′ opposing sides.",
"The main body 1212′ has a first 1222′ or upper surface and an opposing second 1224′ or lower surface.",
"The main body 1212′ has a lengthwise axis 1226′ and a transverse axis 1228′ that orthogonally intersects the lengthwise axis 1226′ at a longitudinal midpoint 1230′ disposed on the lengthwise axis 1226′.",
"A first anchor portion 1232′ is disposed on the first end 1214′ of the main body 1212′ and defines an arrowhead 1280′ having a terminal point 1282′.",
"A series of projections 1238′ extends from one side 1218′ of the main body 1210′.",
"The other side 1220′ is substantially flat and contains no projections.",
"Thus, in this embodiment, projections extend from only one side of the main body 1210′.",
"Also, each of the projections in the series of projections 1238′ extends away from the main body 1210′, away from the second end 1216′.",
"Also, the first 1284′ and second 1286′ sides of the arrowhead 1280′ extend away from the main body 1210′ and away from the first end 1214′.",
"The main body 1210′ includes a throat portion 1290′ that transitions from the width of the base of the arrowhead 1280′ to the width of the main body 1210′, taken from the first side 1218′ to the second side 1220′.",
"In this embodiment, the terminal point 1282′ of the arrowhead 1280′ is a rounded point.",
"Also in this embodiment, the first 1284′ and second 1286′ sides of the arrowhead 1280′ are oriented at angle 1288′ with respect to each other.",
"The angle 1288′ of this embodiment is relatively broad, or obtuse, as compared to the angle 1288 in the embodiment illustrated in FIGS.",
"6, 6A, and 6B.",
"In a tissue adjustment implant according to a particular embodiment that includes an anchor portion that defines an arrowhead, the sides of the arrowhead can be oriented with respect to each other at any suitable angle.",
"A skilled artisan will be able to determine a suitable angle for a tissue adjustment implant according to a particular embodiment based on various considerations, including the nature of the tissue within which the tissue adjustment implant is intended to be used, the material forming the tissue adjustment implant, and other considerations.",
"The inventors have determined that an acute angle, such as angle 1288 illustrated in FIG.",
"6, facilitates initial passage of the tissue adjustment implant 1280 into tissue during implantation, but provides a relatively low degree of anchoring or resistance to reverse movement following implantation.",
"In contrast, the inventors have determined that an obtuse angle, such as angle 1288′ illustrated in FIG.",
"7, requires additional force to accomplish the initial passage of the tissue adjustment implant 1280′ into tissue during implantation, but provides a relatively high degree of anchoring or resistance to reverse movement following implantation.",
"Based on these considerations, the a skilled artisan will be able to select a suitable angle for inclusion in a tissue adjustment implant according to a particular embodiment.",
"Examples of suitable angles include an acute angle and an obtuse angle.",
"Acute angles between about 15 degrees and about 90 degrees are also considered suitable.",
"Acute angles between about 35 degrees and about 90 degrees are also considered suitable.",
"Acute angles between about 45 degrees and about 90 degrees are also considered suitable.",
"Acute angles between about 55 degrees and about 90 degrees are also considered suitable.",
"Acute angles between about 65 degrees and about 90 degrees are also considered suitable.",
"Acute angles between about 75 degrees and about 90 degrees are also considered suitable.",
"Acute angles between about 85 degrees and about 90 degrees are also considered suitable.",
"The inventors have determined that an acute angle of about 45 degrees provides a desirable balance between the force required to achieve initial passage of a tissue adjustment implant into tissue during implantation and the degree of anchoring or resistance to reverse movement following implantation.",
"Furthermore, the inventors have determined that an acute angle of 45 degrees provides a desirable balance between the force required to achieve initial passage of a tissue adjustment implant into tissue during implantation and the degree of anchoring or resistance to reverse movement following implantation.",
"Obtuse angles between about 90 degrees and about 105 degrees are also considered suitable.",
"Obtuse angles between about 90 degrees and about 115 degrees are also considered suitable.",
"Obtuse angles between about 90 degrees and about 125 degrees are also considered suitable.",
"Obtuse angles between about 90 degrees and about 135 degrees are also considered suitable.",
"Obtuse angles between about 90 degrees and about 145 degrees are also considered suitable.",
"Obtuse angles between about 90 degrees and about 155 degrees are also considered suitable.",
"Obtuse angles between about 90 degrees and about 165 degrees are also considered suitable.",
"The inventors have determined that an obtuse angle of about 135 degrees provides a desirable balance between the force required to achieve initial passage of a tissue adjustment implant into tissue during implantation and the degree of anchoring or resistance to reverse movement following implantation.",
"Furthermore, the inventors have determined that an obtuse angle of 135 degrees provides a desirable balance between the force required to achieve initial passage of a tissue adjustment implant into tissue during implantation and the degree of anchoring or resistance to reverse movement following implantation.",
"A right angle is also considered suitable.",
"The inventors have determined that an angle of about 90 degrees is suitable.",
"Furthermore, the inventors have determined that an angle of 90 degrees is suitable.",
"FIGS.",
"8, 9, 10, and 11 illustrate an example delivery device 1300 suitable for implanting a tissue adjustment implant in a tissue of a patient, such as the soft palate of a human being.",
"The delivery device 1300 comprises a main body 1310 defining a handle 1312 that can be gripped by a user.",
"The main body also defines a barrel 1314 that extends away from the handle 1312.A cannula 1350 is disposed in the distal end 1316 of the main body 1310 such that the cannula 1350 extends away from the main body 1310.In the illustrated embodiment, the cannula 1350 defines a bend 1352 such that a first portion 1354 of the cannula 1350 extends substantially along an axis of the barrel 1314 and a second portion 1356 of the cannula 1350 extends away from the axis of the barrel 1314.The second portion 1356 of the cannula 1350 defines a notch 1358.As best illustrated in FIG.",
"9, the notch 1358 provides an oblique opening to the lumen 1360 of the cannula 1350.As best illustrated in FIG.",
"10, a partial circumferential wall 1362 of the cannula 1350 exists in the notch 1358, which a full circumferential wall 1364 of the cannula 1350 exists in the portion of the cannula 1350 disposed axially inward from the notch 1358.Also, as best illustrated in FIG.",
"9, the notch 1358 defines a distal tip 1366 suitable for forming an initial puncture opening in tissue during an implantation procedure.",
"FIG.",
"12 illustrates the cannula 1350 of delivery device 1300 and the tissue adjustment implant 1200 of FIG.",
"6 disposed within the lumen 1360 of the cannula 1350.As illustrated in the figure, the tissue adjustment implant 1200 is positioned within the cannula 1350 such that the terminal point 1282 of the arrowhead 1280 of the tissue adjustment implant 1200 is disposed within the notch and axially inward from the distal tip 1366 of the cannula 1350.A portion of each of the sides 1284, 1286 of the arrowhead 1280 of the tissue adjustment implant extend laterally outward from the cannula 1350.With this configuration, the tissue adjustment implant can be implanted by pushing the cannula 1350, by applying force to the handle of the delivery device, for example, such that the distal tip 1366 punctures the tissue into which the tissue adjustment implant is to be implanted.",
"By continuing to apply force in this manner, the portions of the sides 1284, 1286 of the arrowhead are forced into the tunnel formed by the cannula 1350.Once the tissue adjustment implant 1200 has been advanced into the tissue to a desirable or suitable distance, the cannula 1350 can be retracted by applying a reverse force on the handle of the delivery device.",
"As this is performed, the sides 1284, 1286 of the arrowhead will engage the tissue and anchor the tissue adjustment implant 1200 in place, allowing the cannula 1350, and the delivery device, to be retracted while leaving the tissue adjustment implant in place.",
"The tissue adjustment implants can be formed of any suitable material or materials, and a skilled artisan will be able to select an appropriate material or materials for a tissue adjustment implant according to a particular embodiment based on various considerations, including the tissue with which the tissue adjustment implant is intended to be used, the technique by which the tissue adjustment implant will be implanted, and other considerations.",
"Both synthetic and natural materials are considered suitable.",
"Examples of suitable synthetic materials include polymeric materials, such as polyethylene, polypropylene and other flexible polymeric materials.",
"Examples of suitable natural materials include tissue and tissue-derived materials.",
"The inventors have determined that tissue adjustment implants formed of bioremodelable materials are particularly well-suited for implantation within and adjustment of various tissues in human and other animals at least because of the ability of such materials to remodel and become incorporated into adjacent tissues over time.",
"These materials can provide a scaffold onto which cellular in-growth can occur, eventually allowing the material to remodel into a structure of host cells, which aids in the effectiveness of the tissue adjustment implant as a long-term support of the tissue being secured.",
"Particular advantage can be provided by tissue adjustment implants that incorporate a remodelable collagenous material.",
"Such remodelable collagenous materials, whether reconstituted or naturally-derived, can be provided, for example, by collagenous materials isolated from a warm-blooded vertebrate, especially a mammal.",
"Such isolated collagenous material can be processed so as to have remodelable, angiogenic properties and promote cellular invasion and ingrowth.",
"Remodelable materials may be used in this context to stimulate ingrowth of adjacent tissues into an implanted construct such that the remodelable material gradually breaks down and becomes replaced by new patient tissue so as to generate a new, remodeled tissue structure.",
"Such materials are considered suitable for use in the main body, projections, and plug portions of tissue adjustment implants.",
"Suitable remodelable materials can be provided by collagenous extracellular matrix (ECM) materials possessing biotropic properties.",
"For example, suitable collagenous materials include ECM materials such as those comprising submucosa, renal capsule membrane, dermal collagen, dura mater, pericardium, fascia lata, serosa, peritoneum or basement membrane layers, including liver basement membrane.",
"Suitable submucosa materials for these purposes include, for instance, intestinal submucosa including small intestinal submucosa, stomach submucosa, urinary bladder submucosa, and uterine submucosa.",
"Collagenous matrices comprising submucosa (potentially along with other associated tissues) useful in the present invention can be obtained by harvesting such tissue sources and delaminating the submucosa-containing matrix from smooth muscle layers, mucosal layers, and/or other layers occurring in the tissue source.",
"For additional information as to some of the materials useful in the tissue adjustment implants, and their isolation and treatment, reference can be made, for example, to U.S. Pat.",
"Nos.",
"4,902,508, 5,554,389, 5,993,844, 6,206,931, and 6,099,567.Remodelable ECM tissue materials harvested as intact sheets from a mammalian source and processed to remove cellular debris advantageously retain at least a portion of and potentially all of the native collagen microarchitecture of the source extracellular matrix.",
"This matrix of collagen fibers provides a scaffold to facilitate and support tissue ingrowth, particularly in bioactive ECM implant materials, such as porcine small intestinal submucosa or SIS (Surgisis® Biodesign™, Cook Medical, Bloomington Ind.",
"), that are processed to retain an effective level of growth factors and other bioactive constituents from the source tissue.",
"In this regard, when a tissue adjustment implant incorporates this sort of material, cells will invade the remodelable material upon implantation eventually leading to the generation of a newly-remodeled, functional tissue structure.",
"Submucosa-containing or other ECM tissue used in the tissue adjustment implants is preferably highly purified, for example, as described in U.S. Pat.",
"No.",
"6,206,931 to Cook et al.",
"Thus, preferred ECM material will exhibit an endotoxin level of less than about 12 endotoxin units (EU) per gram, more preferably less than about 5 EU per gram, and most preferably less than about 1 EU per gram.",
"As additional preferences, the submucosa or other ECM material may have a bioburden of less than about 1 colony forming units (CFU) per gram, more preferably less than about 0.5 CFU per gram.",
"Fungus levels are desirably similarly low, for example less than about 1 CFU per gram, more preferably less than about 0.5 CFU per gram.",
"Nucleic acid levels are preferably less than about 5 μg/mg, more preferably less than about 2 μg/mg, and virus levels are preferably less than about 50 plaque forming units (PFU) per gram, more preferably less than about 5 PFU per gram.",
"These and additional properties of submucosa or other ECM tissue taught in U.S. Pat.",
"No.",
"6,206,931 may be characteristic of any ECM tissue used in the inventive tissue adjustment implants.",
"A typical layer thickness for an as-isolated submucosa or other ECM tissue layer used in the invention ranges from about 50 to about 250 microns when fully hydrated, more typically from about 50 to about 200 microns when fully hydrated, although isolated layers having other thicknesses may also be obtained and used.",
"These layer thicknesses may vary with the type and age of the animal used as the tissue source.",
"As well, these layer thicknesses may vary with the source of the tissue obtained from the animal source.",
"In a dry state, a typical layer thickness for an as-isolated submucosa or other ECM tissue layer used in the invention ranges from about 30 to about 160 microns when fully dry, more typically from about 30 to about 130 microns when fully dry.",
"Suitable bioactive agents may include one or more bioactive agents native to the source of the ECM tissue material.",
"For example, a submucosa or other remodelable ECM tissue material may retain one or more growth factors such as but not limited to basic fibroblast growth factor (FGF-2), transforming growth factor beta (TGF-beta), epidermal growth factor (EGF), cartilage derived growth factor (CDGF), and/or platelet derived growth factor (PDGF).",
"As well, submucosa or other ECM materials when used in the invention may retain other native bioactive agents such as but not limited to proteins, glycoproteins, proteoglycans, and glycosaminoglycans.",
"For example, ECM materials may include heparin, heparin sulfate, hyaluronic acid, fibronectin, cytokines, and the like.",
"Thus, generally speaking, a submucosa or other ECM material may retain one or more bioactive components that induce, directly or indirectly, a cellular response such as a change in cell morphology, proliferation, growth, protein or gene expression.",
"Submucosa-containing or other ECM materials used in a tissue adjustment implant can be derived from any suitable organ or other tissue source, usually sources containing connective tissues.",
"The ECM materials processed for use in the inventive tissue adjustment implants will typically include abundant collagen, most commonly being constituted at least about 80% by weight collagen on a dry weight basis.",
"Such naturally-derived ECM materials will for the most part include collagen fibers that are non-randomly oriented, for instance occurring as generally uniaxial or multi-axial but regularly oriented fibers.",
"When processed to retain native bioactive factors, the ECM material can retain these factors interspersed as solids between, upon and/or within the collagen fibers.",
"Particularly desirable naturally-derived ECM materials for use in the invention will include significant amounts of such interspersed, non-collagenous solids that are readily ascertainable under light microscopic examination with appropriate staining.",
"Such non-collagenous solids can constitute a significant percentage of the dry weight of the ECM material in certain inventive embodiments, for example at least about 1%, at least about 3%, and at least about 5% by weight in various embodiments of the invention.",
"The submucosa-containing or other ECM material used in the inventive tissue adjustment implants may also exhibit an angiogenic character and thus be effective to induce angiogenesis in a host engrafted with the material.",
"In this regard, angiogenesis is the process through which the body makes new blood vessels to generate increased blood supply to tissues.",
"Thus, angiogenic materials, when contacted with host tissues, promote or encourage the formation of new blood vessels into the materials.",
"Methods for measuring in vivo angiogenesis in response to biomaterial implantation have recently been developed.",
"For example, one such method uses a subcutaneous implant model to determine the angiogenic character of a material.",
"See, C. Heeschen et al., Nature Medicine 7 (2001), No.",
"7, 833-839.When combined with a fluorescence microangiography technique, this model can provide both quantitative and qualitative measures of angiogenesis into biomaterials.",
"C. Johnson et al., Circulation Research 94 (2004), No.",
"2, 262-268.Further, in addition or as an alternative to the inclusion of such native bioactive components, non-native bioactive components such as those synthetically produced by recombinant technology or other methods (e.g., genetic material such as DNA), may be incorporated into an ECM material used in an inventive tissue adjustment implant.",
"These non-native bioactive components may be naturally-derived or recombinantly produced proteins that correspond to those natively occurring in an ECM tissue, but perhaps of a different species.",
"These non-native bioactive components may also be drug substances.",
"Illustrative drug substances that may be added to materials include, for example, anti-clotting agents, e.g.",
"heparin, antibiotics, anti-inflammatory agents, thrombus-promoting substances such as blood clotting factors, e.g., thrombin, fibrinogen, and the like, and anti-proliferative agents, e.g.",
"taxol derivatives such as paclitaxel.",
"Such non-native bioactive components can be incorporated into and/or onto ECM material in any suitable manner, for example, by surface treatment (e.g., spraying) and/or impregnation (e.g., soaking), to name a few.",
"Also, these substances may be applied to the ECM material in a premanufacturing step, immediately prior to the procedure (e.g., by soaking the material in a solution containing a suitable antibiotic such as cefazolin), or during or after engraftment of the material in the patient.",
"Inventive devices can incorporate xenograft material (i.e., cross-species material, such as tissue material from a non-human donor to a human recipient), allograft material (i.e., interspecies material, with tissue material from a donor of the same species as the recipient), and/or autograft material (i.e., where the donor and the recipient are the same individual).",
"Further, any exogenous bioactive substances incorporated into an ECM material may be from the same species of animal from which the ECM material was derived (e.g.",
"autologous or allogeneic relative to the ECM material) or may be from a different species from the ECM material source (xenogeneic relative to the ECM material).",
"In certain embodiments, ECM material will be xenogeneic relative to the patient receiving the graft, and any added exogenous material(s) will be from the same species (e.g.",
"autologous or allogeneic) as the patient receiving the graft.",
"Illustratively, human patients may be treated with xenogeneic ECM materials (e.g.",
"porcine-, bovine- or ovine-derived) that have been modified with exogenous human material(s) as described herein, those exogenous materials being naturally derived and/or recombinantly produced.",
"The inventors have determined that SIS is particularly well-suited for use in the tissue adjustment implant devices described herein at least because of its well-characterized nature and ready availability.",
"Furthermore, the inventors have determined that vacuum-pressed SIS provides a particularly advantageous material from which to form tissue adjustment implant devices that include one or more pluralities of projections, such as the tissue adjustment implants described and illustrated herein.",
"Lyophilized SIS can also be used, and may be advantageous for tissue adjustment implants in which a relatively quicker remodeling time is desired.",
"Radiopaque SIS can also be used, and may be advantageous for tissue adjustment implants for which enhanced visualization characteristics are desired.",
"The inventors have determined that a tissue adjustment implant having a main body formed of multiple layers laminated together provides a particularly advantageous structure.",
"Thus, the main body can comprise a multilaminate construct.",
"In these embodiments, any suitable number of layers can be used, and a skilled artisan will be able to select an appropriate number of layers for a particular tissue adjustment implant based on various considerations, including the intended use of the tissue adjustment implant and nature of the tissue intended to be supported by the tissue adjustment implant.",
"The inventors have determined that a tissue adjustment implant having a main body formed of between 4 and 12 layers of an ECM material, such as SIS, provides a particularly advantageous structure for tissue adjustment implants intended for use in supporting the soft palate of a patient, such as in methods of treating Obstructive Sleep Apnea (OSA).",
"A main body formed of between 6 and 10 layers of an ECM material, such as SIS, is also considered particularly advantageous.",
"A main body formed of 8 layers of an ECM material, such as SIS, is also considered particularly advantageous.",
"A main body formed of up to 60 layers of an ECM material, such as SIS, is also considered particularly advantageous.",
"In these embodiments, the layers can be assembled together in any suitable manner and using any suitable technique or process.",
"For multilaminate SIS constructs, the inventors have determined that vacuum-pressing of multiple layers of SIS provides a suitable laminate structure for use as a tissue adjustment implant as described herein.",
"The layers in the multilaminate construct can be vacuum-pressed prior to assembly into the multilaminate construct.",
"Alternatively, the multilaminate construct can be vacuum-pressed after assembly of the layers.",
"Also alternatively, the layers can be vacuum-pressed prior to assembly and the assembly can be vacuum-pressed after assembly.",
"The inventors have determined that use of vacuum-pressed SIS provides desirable durability and profile characteristics.",
"When using a vacuum-pressed layers of an ECM material, such as SIS, any suitable number of vacuum-pressed layers can be used.",
"The inventors have determined that a tissue adjustment implant having a main body formed of between 4 and 60 layers provides a particularly advantageous structure for tissue adjustment implants intended for use in supporting the soft palate of a patient, such as in methods of treating OSA.",
"A main body formed of between 10 and 50 layers is also considered particularly advantageous.",
"A main body formed of between 20 and 40 layers is also considered particularly advantageous.",
"A main body formed of between 25 and 35 layers is also considered particularly advantageous.",
"A main body formed of about 30 layers is also considered particularly advantageous.",
"The inventors have determined that a tissue adjustment implant comprising a multilaminate construct comprised of 30 layers of vacuum-pressed SIS provides a suitable structure for use in methods of treating OSA.",
"The inventors have determined that a hybrid structure may provide a desirable balance between desired overall rigidity for the tissue adjustment implant and relative remodeling time.",
"In this embodiment, a middle portion of the tissue adjustment implant is formed of lyophilized SIS, which provides a relatively quicker remodeling time, and the perimeter sections, including the ribbed portions, are formed of vacuum-pressed SIS, which provides a relatively high degree of overall rigidity.",
"The middle portion in this embodiment is expected to remodel relatively quickly following implantation, enhancing the securement of the tissue adjustment implant.",
"An opposite structure is also considered suitable and may be advantageous in certain circumstances.",
"A hybrid structure in which a mesh is embedded inside an SIS or other composition or between layers of SIS or of other material is also considered suitable.",
"For example, a polymeric mesh, such as a mesh formed of polypropylene, can be disposed between layers of SIS during formation of the tissue adjustment implant.",
"In these embodiments, the polymeric mesh will remain in the body following completion of remodeling by the SIS, which may enhance the overall anchoring of the supported tissue over time.",
"A bioabsorable mesh, such as a mesh formed of polyglycolic acid or other bioabsorbable material, can also be included in the tissue adjustment implant in this manner and may be advantageous where supplemental support is desired that lasts beyond the remodeling time for the SIS, but that does not have the permanency associated with a polypropylene or other polymeric mesh.",
"Examples of suitable structural arrangements of polymer and remodelable layers can be found in United States Patent Application Publication No.",
"2011/0166673 to Patel et al., for QUILTED IMPLANTABLE GRAFT, the entire contents of which are hereby incorporated into this disclosure.",
"A tissue adjustment implant, or portions thereof, can also be coated with particular materials to provide a desired property or properties.",
"For example, the inventors have determined that coating a tissue adjustment implant with poly(lactic-co-glycolic acid) (PLGA) provides a desirable stiffening effect to the implant while also providing an agent that promotes an inflammatory response in tissue within which the tissue adjustment implant has been placed.",
"In tissue adjustment implants that comprise a multilaminate construct, as describe above, a coating can be applied between layers during fabrication.",
"For example, PLGA can be applied to or embedded within one, two, a plurality of, or all of the layers when making a main body that comprise a multilaminate construct.",
"The tissue adjustment implants are implanted by forming an opening in a target tissue, passing the first end of the tissue adjustment implant through the opening and into the tissue until the plug contacts the tissue surrounding the opening.",
"If desired, additional pulling force can be applied to the first end to lift or otherwise adjust the position of the tissue through interaction with the plug.",
"Once a desired position is achieved, a portion of the tissue adjustment implant, such as a portion near the first end of the tissue adjustment implant, can be sutured to the tissue.",
"This is beneficial for maintaining the adjusted position of the tissue.",
"After passing the first end of the tissue adjustment implant through the opening in the tissue and into the tissue, the first end of the tissue adjustment implant, or a lead attached to it, can be manipulated to exit the tissue, either through an existing opening or by forming an opening, at a point at a distance from the opening through with the tissue adjustment implant entered the tissue.",
"This is particularly advantageous for tissue adjustment implants that include a lead, such as a needle and suture attached to a first end of the tissue adjustment implant.",
"Also, if desired, the tissue adjustment implant can be trimmed of excess main body such that the remainder of the tissue adjustment implant is flush or substantially flush with the opening through which the tissue adjustment implant exits the tissue.",
"If this is performed, it is advantageously performed after the tissue adjustment implant is secured to the tissue, if performed, such that any desired adjusted position of the tissue is maintained after the trimming is completed.",
"The tissue adjustment implants are particularly well-suited for adjusting the position of the soft palate of a patient, such as a human being.",
"Such an adjustment may be beneficial in the treatment of Obstructive Sleep Apnea (OSA).",
"FIG.",
"5 illustrates a schematic of an oral cavity 1300 of a patient within which first 1310a and second 1310b tissue adjustment implants have been placed.",
"In this example, each of the tissue adjustment implants 1310a, 1310b comprises a tissue adjustment implant according to the embodiment illustrated in FIGS.",
"2 and 2A.",
"The first tissue adjustment implant 1310a has been implanted in the soft palate 1350 on a first side of the uvula 1352 and the second tissue adjustment implant 1310b has been implanted in the soft palate 1350 on a second, opposite side of the uvula 1352.Each tissue adjustment implant 1310a, 1310b has been implanted as described above, such that the respective plugs 1380a, 1380b have been buried just beneath the surface of the tissue of the soft palate 1350.Each tissue adjustment implant 1301a, 1301b was pulled taught after the respective plugs 1310a, 1310b had reached that position to achieve a desired lifting of the rear portion 1352 of the soft palate.",
"Subsequently, the leads (not illustrated in FIG.",
"5) were cut and removed from the tissue adjustment implants and the respective first ends 1314a, 1314b of the tissue adjustment implants 1310a, 1310b were sutured to the tissue of the soft palate 1350 to maintain the adjusted position of the soft palate 1350.In FIG.",
"5, the tissue adjustment implants 1310a, 1310b, were implanted by passing the tissue adjustment implants 1310a, 1310b through an opening made in the tissue toward the rear of the oral cavity 1300 and advancing them toward the front of the oral cavity 1300.While another approach can be used, this approach is suitable for tissue adjustment implants having a plug on their distal end, such as tissue adjustment implants 1310a, 1310b.",
"FIG.",
"13 illustrates another schematic of an oral cavity 1400 of a patient within which first 1410a and second 1410b tissue adjustment implants have been placed.",
"In this example, each of the tissue adjustment implants 1410a, 1410b comprises a tissue adjustment implant according to the embodiment illustrated in FIGS.",
"6, 6A and 6B.",
"The first tissue adjustment implant 1410a has been implanted in the soft palate 1450 on a first side of the uvula 1452 and the second tissue adjustment implant 1410b has been implanted in the soft palate 1450 on a second, opposite side of the uvula 1452.Each tissue adjustment implant 1410a, 1410b has been implanted as described above with respect to the delivery device illustrated in FIGS.",
"8 through 12.In FIG.",
"13, the tissue adjustment implants 1410a, 1410b, were implanted by passing the tissue adjustment implants 1410a, 1410b through an opening made in the tissue toward the front of the oral cavity 1400 and advancing them toward the rear of the oral cavity 1400.While another approach can be used, this approach is suitable for tissue adjustment implants that lack a plug on their distal end and/or that have an anchor portion, such as the arrowhead on each of tissue adjustment implants 1410a, 1410b, on their proximal end, such as tissue adjustment implants 1410a, 1410b.",
"Those with ordinary skill in the art will appreciate that various modifications and alternatives for the described and illustrated embodiments can be developed in light of the overall teachings of the disclosure.",
"Accordingly, the particular arrangements disclosed are intended to be illustrative only and not limiting as to the scope of the invention, which is to be given the full breadth of the appended claims and any and all equivalents thereof."
]
] |
Patent_15871435
|
[
[
"MODULAR ARRAY OF VERTICALLY INTEGRATED SUPERCONDUCTING QUBIT DEVICES FOR SCALABLE QUANTUM COMPUTING",
"A technique relates to an assembly for a quantum computing device.",
"A quantum bus plane includes a first set of recesses.",
"A readout plane includes a second set of recesses.",
"A block is positioned to hold the readout plane opposite the quantum bus plane, such that the first set of recesses opposes the second set of recesses.",
"A plurality of qubit chips are included where each has a first end positioned in the first set of recesses and has a second end positioned in the second set of recesses."
],
[
"1.An assembly for a quantum computing device comprising: a housing configured as an enclosure having a bottom part, a top part, and a block, the block connecting the top and bottom parts; a quantum bus plane including a first set of recesses; a readout plane including a second set of recesses, wherein the block is configured to position the readout plane opposite the quantum bus plane, such that the first set of recesses opposes the second set of recesses; and a plurality of qubit chips each having a first end positioned in the first set of recesses and having a second end positioned in the second set of recesses.",
"2.The assembly of claim 1, wherein the housing includes a readout plane housing slot through which the readout plane extends.",
"3.The assembly of claim 2, wherein the readout plane extends through the readout plane housing slot to connect to a circuit board, the circuit board connecting to a plurality of connectors.",
"4.The assembly of claim 1, further comprising a pushing mechanism configured to apply pressure to the readout plane.",
"5.The assembly of claim 4, wherein the pushing mechanism is configured such that the pressure applied to the readout plane forces the plurality of qubit chips to the quantum bus plane.",
"6.The assembly of claim 4, wherein the pushing mechanism comprises a pusher block positioned on top of the readout plane.",
"7.The assembly of claim 6, wherein the pushing mechanism comprises a spring mechanism pressing downward against the pusher block.",
"8.The assembly of claim 7, wherein the top part of the housing is configured to apply a compression force to the spring mechanism from above.",
"9.The assembly of claim 1, wherein the plurality of qubit chips extend vertically in a lengthwise direction by being positioned in both the first set of recesses and the second set of recesses.",
"10.The assembly of claim 1, wherein the first set of recesses secures the first end of the plurality of qubit chips in the readout plane.",
"11.The assembly of claim 1, wherein the second set of recesses secures the second end of the plurality of qubit chips in the quantum bus plane.",
"12.The assembly of claim 1, wherein the first end of the plurality of qubit chips is opposite the second end.",
"13.The assembly of claim 1, wherein the quantum bus plane comprises a substrate with interconnect wiring on top of the substrate.",
"14.The assembly of claim 13, wherein the interconnect wiring connects the plurality of qubit chips via a plurality of coupling bus resonators.",
"15.The assembly of claim 1, wherein the readout plane comprises a substrate with fan-out wiring on top of the substrate.",
"16.The assembly of claim 15, where the fan-out wiring individually connects each of the plurality of qubit chips to a circuit board.",
"17.The assembly of claim 16, wherein the circuit board individually connects each of the plurality of qubit chips to a plurality of connectors in a one-to-one relationship.",
"18.The assembly of claim 1, wherein the block is configured to receive a first assembly comb and a second assembly comb to form an intersection, the intersection of the first and second assembly combs forming a plurality of slots for individually accepting the plurality of qubit chips.",
"19.The assembly of claim 18, wherein the plurality of slots mechanically holds the plurality of qubit chips in a vertical position.",
"20.The assembly of claim 1, wherein the block is made of a superconducting material."
],
[
"<SOH> BACKGROUND <EOH>The present invention relates to quantum computing, and more specifically, to a modular array of vertically integrated superconducting qubit devices for scalable quantum computing.",
"In one approach called circuit quantum electrodynamics, quantum computing employs active superconducting devices called qubits to manipulate and store quantum information, and resonators (e.g., as a two-dimensional (2D) planar waveguide or as a three-dimensional (3D) microwave cavity) to read out and facilitate interaction among qubits.",
"Each superconducting qubit comprises one or more Josephson junctions shunted by capacitors in parallel with the junctions.",
"The qubits are capacitively coupled to 2D or 3D microwave cavities.",
"The energy associated with the qubit resides in the electromagnetic fields around the Josephson junction and especially in the vicinity of relatively larger shunt capacitance structures.",
"To date, a major focus has been on improving lifetimes of the qubits in order to allow calculations (i.e., manipulation and readout) to take place before the information is lost to decoherence of the qubits.",
"Currently, superconducting qubit coherence times can be as high as 100 microseconds, and efforts are being made to increase the coherence times.",
"One area of research with respect to increasing coherence times is focused on eliminating lossy materials from areas of relatively high electromagnetic field energy density such as in the vicinity of sharp corners and edges of the thin films of which the qubits are comprised.",
"Such materials in proximity to the qubit can include imperfections that support defects known as two-level systems (TLSs)."
],
[
"<SOH> SUMMARY <EOH>According to one embodiment, an assembly for a quantum computing device is provided.",
"The assembly includes a quantum bus plane including a first set of recesses, a readout plane including a second set of recesses, and a block positioned to hold the readout plane opposite the quantum bus plane, such that the first set of recesses opposes the second set of recesses.",
"Also, the assembly includes a plurality of qubit chips where each has a first end positioned in the first set of recesses and has a second end positioned in the second set of recesses.",
"According to one embodiment, an assembly for a quantum computing device is provided.",
"The assembly includes a housing configured as an enclosure having a bottom part, a top part, and a block, in which the block connects the top and bottom parts.",
"The assembly includes a quantum bus plane including a first set of recesses, and a readout plane including a second set of recesses.",
"The block is configured to position the readout plane opposite the quantum bus plane, such that the first set of recesses opposes the second set of recesses.",
"Also, the assembly includes a plurality of qubit chips where each has a first end positioned in the first set of recesses and has a second end positioned in the second set of recesses.",
"According to one embodiment, a method of configuring an assembly for a quantum computing device is provided.",
"The method includes providing a housing configured as an enclosure having a bottom part, a top part, and a block, in which the block connects the top and bottom parts.",
"The method includes providing a readout plane having a first set of recesses and a quantum bus plane having a second set of recesses, and assembling the readout plane opposite the quantum bus plane in a block, such that the first set of recesses opposes the second set of recesses.",
"Also, the method includes installing a plurality of qubit chips in the block, where each of the plurality of qubit chips has a first end positioned in the first set of recesses and has a second end positioned in the second set of recesses.",
"In one or more embodiments, the plurality of qubit chips extends vertically in a lengthwise direction by being positioned in both the first set of recesses and the second set of recesses.",
"The first set of recesses holds the first end of the plurality of qubit chips in the readout plane, and the second set of recesses holds the second end of the plurality of qubit chips in the quantum bus plane.",
"In one or more embodiments, the first end of the plurality of qubit chips is opposite the second end.",
"In one or more embodiments, the block is made of a superconducting material.",
"In one or more embodiments, the quantum bus plane comprises a substrate with interconnect wiring on top of the substrate, and the interconnect wiring connects the plurality of qubit chips via a plurality of coupling bus resonators.",
"In one or more embodiments, the readout plane comprises a substrate with fan-out wiring on top of the substrate, and the fan-out wiring individually connects each of the plurality of qubit chips to a circuit board.",
"The circuit board individually connects each of the plurality of qubit chips to a plurality of connectors in a one-to-one relationship.",
"In one or more embodiments, the block is configured to receive a first assembly comb and a second assembly comb to form an intersection, and the intersection of the first and second assembly combs forms a plurality of slots for individually accepting the plurality of qubit chips.",
"The plurality of slots mechanically holds the plurality of qubit chips in a vertical position.",
"Additional features and advantages are realized through the techniques of the present invention.",
"Other embodiments and aspects of the invention are described in detail herein and are considered a part of the claimed invention.",
"For a better understanding of the invention with the advantages and the features, refer to the description and to the drawings."
],
[
"DOMESTIC PRIORITY This application is a divisional application of and claims priority from U.S. patent application Ser.",
"No.",
"15/175,454, filed on Jun.",
"7, 2016, entitled “MODULAR ARRAY OF VERTICALLY INTEGRATED SUPERCONDUCTING QUBIT DEVICES FOR SCALABLE QUANTUM COMPUTING”, which is a divisional application of and claims priority from U.S. patent application Ser.",
"No.",
"14/737,707, filed on Jun.",
"12, 2015, entitled “MODULAR ARRAY OF VERTICALLY INTEGRATED SUPERCONDUCTING QUBIT DEVICES FOR SCALABLE QUANTUM COMPUTING”, the entire contents of which are incorporated herein by reference.",
"BACKGROUND The present invention relates to quantum computing, and more specifically, to a modular array of vertically integrated superconducting qubit devices for scalable quantum computing.",
"In one approach called circuit quantum electrodynamics, quantum computing employs active superconducting devices called qubits to manipulate and store quantum information, and resonators (e.g., as a two-dimensional (2D) planar waveguide or as a three-dimensional (3D) microwave cavity) to read out and facilitate interaction among qubits.",
"Each superconducting qubit comprises one or more Josephson junctions shunted by capacitors in parallel with the junctions.",
"The qubits are capacitively coupled to 2D or 3D microwave cavities.",
"The energy associated with the qubit resides in the electromagnetic fields around the Josephson junction and especially in the vicinity of relatively larger shunt capacitance structures.",
"To date, a major focus has been on improving lifetimes of the qubits in order to allow calculations (i.e., manipulation and readout) to take place before the information is lost to decoherence of the qubits.",
"Currently, superconducting qubit coherence times can be as high as 100 microseconds, and efforts are being made to increase the coherence times.",
"One area of research with respect to increasing coherence times is focused on eliminating lossy materials from areas of relatively high electromagnetic field energy density such as in the vicinity of sharp corners and edges of the thin films of which the qubits are comprised.",
"Such materials in proximity to the qubit can include imperfections that support defects known as two-level systems (TLSs).",
"SUMMARY According to one embodiment, an assembly for a quantum computing device is provided.",
"The assembly includes a quantum bus plane including a first set of recesses, a readout plane including a second set of recesses, and a block positioned to hold the readout plane opposite the quantum bus plane, such that the first set of recesses opposes the second set of recesses.",
"Also, the assembly includes a plurality of qubit chips where each has a first end positioned in the first set of recesses and has a second end positioned in the second set of recesses.",
"According to one embodiment, an assembly for a quantum computing device is provided.",
"The assembly includes a housing configured as an enclosure having a bottom part, a top part, and a block, in which the block connects the top and bottom parts.",
"The assembly includes a quantum bus plane including a first set of recesses, and a readout plane including a second set of recesses.",
"The block is configured to position the readout plane opposite the quantum bus plane, such that the first set of recesses opposes the second set of recesses.",
"Also, the assembly includes a plurality of qubit chips where each has a first end positioned in the first set of recesses and has a second end positioned in the second set of recesses.",
"According to one embodiment, a method of configuring an assembly for a quantum computing device is provided.",
"The method includes providing a housing configured as an enclosure having a bottom part, a top part, and a block, in which the block connects the top and bottom parts.",
"The method includes providing a readout plane having a first set of recesses and a quantum bus plane having a second set of recesses, and assembling the readout plane opposite the quantum bus plane in a block, such that the first set of recesses opposes the second set of recesses.",
"Also, the method includes installing a plurality of qubit chips in the block, where each of the plurality of qubit chips has a first end positioned in the first set of recesses and has a second end positioned in the second set of recesses.",
"In one or more embodiments, the plurality of qubit chips extends vertically in a lengthwise direction by being positioned in both the first set of recesses and the second set of recesses.",
"The first set of recesses holds the first end of the plurality of qubit chips in the readout plane, and the second set of recesses holds the second end of the plurality of qubit chips in the quantum bus plane.",
"In one or more embodiments, the first end of the plurality of qubit chips is opposite the second end.",
"In one or more embodiments, the block is made of a superconducting material.",
"In one or more embodiments, the quantum bus plane comprises a substrate with interconnect wiring on top of the substrate, and the interconnect wiring connects the plurality of qubit chips via a plurality of coupling bus resonators.",
"In one or more embodiments, the readout plane comprises a substrate with fan-out wiring on top of the substrate, and the fan-out wiring individually connects each of the plurality of qubit chips to a circuit board.",
"The circuit board individually connects each of the plurality of qubit chips to a plurality of connectors in a one-to-one relationship.",
"In one or more embodiments, the block is configured to receive a first assembly comb and a second assembly comb to form an intersection, and the intersection of the first and second assembly combs forms a plurality of slots for individually accepting the plurality of qubit chips.",
"The plurality of slots mechanically holds the plurality of qubit chips in a vertical position.",
"Additional features and advantages are realized through the techniques of the present invention.",
"Other embodiments and aspects of the invention are described in detail herein and are considered a part of the claimed invention.",
"For a better understanding of the invention with the advantages and the features, refer to the description and to the drawings.",
"BRIEF DESCRIPTION OF THE DRAWINGS The subject matter which is regarded as the invention is particularly pointed out and distinctly claimed in the claims at the conclusion of the specification.",
"The forgoing and other features, and advantages of the invention are apparent from the following detailed description taken in conjunction with the accompanying drawings in which: FIG.",
"1 is a schematic illustrating a transparent view of part of the modular array of vertically integrated superconducting qubit chips according to an embodiment; FIG.",
"2 is a schematic illustrating a quantum bus plane design according to an embodiment; FIG.",
"3 is a schematic illustrating the readout plane in an inverted view according to an embodiment; FIG.",
"4 is a schematic of an example qubit chip according to an embodiment.",
"FIGS.",
"5A through 5F illustrate an assembly and packaging technique for the modular array of vertically integrated superconducting qubit chips according to an embodiment, in which: FIG.",
"5A is a schematic of an assembly illustrating assembly combs for a block; FIG.",
"5B is a schematic of the assembly illustrating the assembly combs in place to form slots for orienting the superconducting qubit chips; FIG.",
"5C is a schematic of the assembly illustrating the installation of the superconducting qubit chips in the slots formed by the assembly combs; FIG.",
"5D is a schematic of the assembly illustrating installation of the readout plane in the block; FIG.",
"5E is a schematic of the assembly illustrating a view underneath the block; FIG.",
"5F is a schematic of the assembly illustrating that a pusher block applies pressure to hold the superconducting qubit chips in place; FIG.",
"6 is a method of configuring an assembly according to an embodiment; and FIG.",
"7 is a method of configuring an assembly according to an embodiment.",
"DETAILED DESCRIPTION Superconducting Josephson-junction based qubits are promising candidates for fault-tolerant quantum computing.",
"As a solid-state technology, it has always held the potential of simpler scalability via existing integration techniques.",
"Superconducting circuit and device fabrication can leverage well-known lithographic methods which can lead to quantum integrated processors with a high density of qubits.",
"Furthermore, superconducting qubits operate in the microwave frequency regime, allowing for all-electrical control of the qubits and other elements which might be in the system.",
"The other elements may include microwave resonators, active filters, quantum-limited amplifiers, etc.",
"A state-of-the-art fault-tolerant quantum computing architecture which has gathered interest recently is the surface code.",
"In the surface code, qubits are arranged in a lattice with only the nearest neighbor interactions required.",
"For superconducting qubits, the surface code is an attractive path forward as defining multiple qubits in a nearest-neighbor lattice.",
"Moreover, the error thresholds which are required for the surface code are within reach for superconducting qubits with the current levels of coherence.",
"One particular physical proposal in the state-of-the-art for realizing the surface code with superconducting qubits is the skew-symmetric layout.",
"In this lattice, each superconducting qubit is coupled to two separate linking bus resonators.",
"The coupling of superconducting qubits with microwave resonators is known as circuit quantum electrodynamics (cQED).",
"The microwave resonators are typically defined as planar stripline resonators but can also be modes within three-dimensional (3D) waveguide cavities.",
"Although it may appear simple to design a large lattice of many superconducting qubits and stripline resonators lithographically, getting every resonator mode and every qubit to work as desired together is a challenge.",
"For example, crosstalk between resonators and superconducting qubits as well as undesired spurious modes can result in stray couplings between quantum objects.",
"Crosstalk is defined here as any unwanted coupling of microwave signals between qubit or resonator channels, other than those desired and defined by wiring.",
"Furthermore, although it may appear easy to optimize parameters for a single qubit and a single cavity mode, once these individual qubits are re-arranged in a larger network and all defined on the same chip, their (collective) behavior can change and can be difficult to then debug.",
"According to embodiments discussed herein, a vertically integrated multi-chip architecture is provided, with discrete superconducting chip pieces comprised of superconducting qubits and their readout resonators.",
"The superconducting qubits, along with their readout resonators, are then all arranged to mate in a matrix sandwiched by two larger carrier chips.",
"These two larger carrier chips serve two purposes: one purpose is to integrate multiple resonator quantum buses to couple the superconducting qubits together (thereby coupling quantum information between qubits), and the other purpose permits physical connections via fan-out wiring to explicit microwave controls.",
"This embodiment realizes a scalable architecture for quantum computation using well-established technology, while obviating challenging silicon integration techniques, such as thru-silicon-vias (TSVs) and multi-level lithography.",
"There are two physically different methods for implementing superconducting quantum processors via the circuit quantum electrodynamics (cQED) architecture, which are a 2D planar lithographic method and a 3D waveguide cavity method.",
"The quantum processor refers to the entirety of the assembled components.",
"2D Planar Integration: The integration of qubits and resonators for 2D cQED is started via depositing superconducting films on silicon or sapphire substrates.",
"Some typical superconducting films used are niobium (Nb), aluminum (Al), titanium nitride (TiN), and niobium nitride (NbN).",
"Resonators (including readout resonators) are commonly defined in these superconducting films using coplanar waveguides, microstrips, coplanar striplines, or lumped element inductors and capacitors.",
"Subsequently, superconducting qubits with Josephson junctions, such as the transmons, phase-qubits, or flux-qubits are also lithographically patterned via either electron-beam or optical lithography.",
"Scaling up to larger quantum processors in this scheme requires a larger and larger chip to accommodate more resonators for coupling, more qubits, and more readout resonators.",
"Using this 2D integration technique, processors up to 9 qubits have been devised in a linear chain, and 8 qubits in a latticed architecture.",
"As the number of qubits in the 2D processor scales up, input-output (I/O) becomes increasingly challenging.",
"In order to avoid crosstalk and integrate appropriate fan-out, technologies such as 3D integrated flip-chips, air-bridge crossovers, thru-silicon vias, and multi-layer lithography are required.",
"As more and more of these different fabrication processes are required to scale up to larger quantum processors, the potential influence and degradation on the superconducting qubits increases rapidly.",
"Therefore using these advanced fabrication techniques can lead to many different sources of decoherence in the qubits.",
"For some of these processes, it could be necessary to perform them after Josephson junctions are lithographically defined.",
"The impact and losses on Josephson junction based superconducting qubits after these processing steps are then a particular concern as to whether high coherence can continue to be preserved.",
"Accordingly, this makes full-scale integration of a large system having a large number of qubits challenging.",
"Embodiments include various features: 1) An array of vertical superconducting qubit chips is mounted to a silicon quantum bus plane and mounted to a separate qubit addressing and readout plane.",
"2) A quantum bus (QB) plane lithographically is defined on silicon which permits the coupling of quantum information among individual vertical superconducting qubit chips.",
"3) A readout (RO) plane couples each superconducting qubit chip's readout resonator to an integrated microwave bandwidth transmission line which follows onto a flexible circuit board thus connecting each superconducting qubit chip's readout resonator a coaxial connector for input/output (I/O).",
"4) Vertical superconducting qubit chips each contain a single superconducting qubit (also referred to as a tunnel junction, such as a Josephson junction) and on-chip readout resonator, designed in a way to effectively couple to the quantum bus plane and the readout plane.",
"Each individual vertical superconducting qubit chip is designed to have a specific lithographically-defined coupling capacitance between the tunnel junction to the quantum bus plane on one end and between the readout resonator and the addressing transmission line of the readout plane on the other end.",
"5) All silicon elements are retained within a well-thermalized metal housing (e.g., copper) which provides mechanical support, alignment, and thermal contact.",
"According to embodiments, the technique discussed herein is an approach for assembling the modular array of superconducting qubit chips into a scalable quantum processor, commensurate with latticed architectures for quantum error correction, such as the surface code.",
"Now turning to the figures, FIG.",
"1 is a schematic illustrating a transparent view of part of the modular array of vertically integrated superconducting qubit devices according to an embodiment.",
"FIG.",
"1 shows a quantum bus plane 100, a readout plane 102, and superconducting vertical qubit chips 101.The superconducting vertical qubit chips 101 are also referred to as qubit dies, qubits, etc.",
"The readout plane 102 and the quantum bus plane 100 sandwich the qubit chips 101 in between.",
"FIG.",
"2 is a schematic illustrating a quantum bus plane design of the quantum bus plane 100 according to an embodiment.",
"The quantum bus plane design illustrates a surface code example.",
"The quantum bus plane 100 may be made of a semiconductor material as the substrate, such as, e.g., silicon, sapphire, etc.",
"The semiconductor material has interconnect wiring 202 deposited on top of the semiconductor material.",
"The interconnect wiring 202 is made of a superconducting material.",
"Superconducting material may be defined as a material that can conduct electricity or transport electrons from one atom to another with no resistance when the superconducting material has reached “critical temperature” (Tc), or the temperature at which the material becomes superconductive.",
"Conducting electricity or transporting electrons from one atom to another with no resistance means that no heat, sound, or any other form of energy would be released from the material as understood by one skilled in the art.",
"The quantum bus plane 100 connects each individual qubit chip 101 via interconnect wiring 202.The interconnect wiring 202 connects (e.g., capacitively) to each superconducting qubit chip 101 installed in the quantum bus plane 100.The interconnect wiring 202 includes coupling bus resonators 205 positioned between each superconducting vertical qubit chip 101.Particularly, superconducting vertical qubit chips 101 are configured to couple together through the coupling bus resonators 205.To assist with securing and positioning superconducting vertical qubit chips 101 on the quantum bus plane 100, the quantum bus plane 100 includes etched recesses 201 at the locations to insert each of the superconducting vertical qubit chips 101.The etched recesses 201 are pockets that individually fit the superconducting vertical qubit chips 101 into specific locations in the quantum bus plane 100.The etched recesses 201 in the quantum bus plane 100 help to define accurate capacitive coupling between the qubit chips 101 and the interconnect wiring 202.The etched recesses 201 determine how deeply the vertical qubit chips 101 sit into the quantum buss plane 100 and thus determine the vertical separation between the capacitor pads on the qubit chip 101 and those on the quantum buss plane 100.The etched recesses 201 are etched into the semiconductor substrate of the quantum bus plane 100.Accurate vertical separation of these coupling pads is a prerequisite for achieving a precise coupling capacitance value.",
"The coupling capacitor pad 404 is shown in FIG.",
"4 and the quantum bus plane 100 has coupling pad 250 in front of each etched recess 201.For the sake of clarity and so as not to obscure FIG.",
"2, only two superconducting vertical qubit chips 101 are shown in FIG.",
"2 although it is understood that each row, e.g., rows 1-4, are filled with superconducting vertical qubit chips 101.One superconducting vertical qubit chip 101 is shown as a code superconducting vertical qubit chip in row 1, and the other superconducting vertical qubit chip 101 is a syndrome superconducting vertical qubit chip in row 2.In one implementation, each row may be filled with the same type of superconducting vertical qubit chip 101.For example, row 1 may be filled with code superconducting vertical qubit chips 101, while row 2 is filled with syndrome superconducting vertical qubit chips 101.Row 3 may be filled with code superconducting vertical qubit chips 101, while row 4 is filled with syndrome superconducting vertical qubit chips 101.Although only 4 rows are shown for the sake of illustration, it is contemplated that M numerous rows may be included on the quantum bus plane 100, where M is the last row.",
"A code qubit stores quantum information for operation of the quantum processor.",
"A syndrome qubit measures and extracts any errors in the system without corrupting the information present in the code qubit.",
"These terms are commonly applied when discussing “surface code error correction.” According to an embodiment, FIG.",
"3 is a schematic illustrating the readout plane 102 in an inverted view.",
"FIG.",
"3 shows the backside of the readout plane 102, and the backside faces the quantum bus plane 100 (not shown in FIG.",
"3).",
"The readout plane 102 may be made of a semiconductor material as the substrate, such as, e.g., silicon, sapphire, etc.",
"The semiconductor material has fan-out wiring 302 deposited on top of the semiconductor material.",
"The fan-out wiring 302 may be made of a superconducting material.",
"The readout plane 102 includes etched recesses 301 at locations to insert each of the superconducting vertical qubit chips 101.Each etched recess 301 is a pocket that individually fits a single superconducting vertical qubit chip 101 into a specific location in the readout plane 102, analogous to the etched recesses 201 in the quantum bus plane 100 in FIG.",
"2.The etched recesses 301 in the readout plane 102 capacitively connect the superconducting vertical qubit chips 101 to the fan-out wiring 302 via the capacitor pads defined on the upper end of the vertical qubit chip 101 and on the readout plane 102.At the upper end, the vertical qubit chip 101 has coupling capacitor pad 401 as shown in FIG.",
"4, while the readout plane 102 has a coupling pad 350 in front of each etched recesses 301.The fan-out wiring 302 has transmission lines 320.Each transmission line 320 individually connects to a single superconducting vertical qubit chip 101 in a one-to-one relationship.",
"The etched recesses 301 serve both a mechanical purpose and an electrical purpose.",
"Mechanically, the etched recesses 301 serve as a slot/pocket to insert each superconducting vertical qubit chip 101.Electrically, the etched recesses 301 align each superconducting vertical qubit chip 101 to an individual transmission line 320 of the fan-out wiring 302.The fan-out wiring 302 individually couples to each superconducting vertical qubit chip 101.Also, the fan-out wiring 302 individually connects each superconducting vertical qubit chip 101 to a flexible circuit board 303.The fan-out wiring 302 does not affect quantum information on the superconducting vertical qubit chips 101.The fan-out wiring 302 connects the superconducting vertical qubit chips 101 to the outside environment (e.g., the 50 ohm (Ω) environment).",
"The flexible circuit board 303 individually connects each superconducting vertical qubit chip 101 to an individual connector 304 via the fan-out wiring 302.Although the flexible circuit board 303 is shown as one implementation, it is contemplated that other type of circuit boards or electrical connections may be utilized.",
"The connectors 304 individually connect the superconducting vertical qubit chips 101 to external electronics (not shown).",
"The connectors 304 may be microwave connectors in which microwave signals may be input and qubit states can be read.",
"Each connector 304 has a one-to-one relationship to a single superconducting vertical qubit chip 101 on the readout plane 102, such that each superconducting vertical qubit chip 101 is individually addressable through a single connector 304, through the flexible circuit board 303, through the fan-out wiring 302, a particular transmission line 320, and through an individual etched recess 301.In one implementation, the connectors 304 may coaxial cable connectors configured to connect to coaxial cables.",
"Although not shown so as not to obscure FIG.",
"3, it is understood that conductive wiring runs through the flexible circuit board 303 and that wiring connects the flexible circuit board 303 to each respective connector 304 as understood by one skilled in the art.",
"The conductive wiring of the flexible circuit board 303 may be made of superconducting or normal material.",
"FIG.",
"4 is a schematic of an example superconducting vertical qubit chip 101 according to an embodiment.",
"Various details of the superconducting vertical qubit chips 101 are shown in FIG.",
"4.The superconducting vertical qubit chips 101 may have a substrate made of a semiconductor material, such as, e.g., silicon, sapphire, etc.",
"Each qubit chip 101 is an integrated circuit.",
"Conductive material is deposited and patterned on the substrate of the superconducting vertical qubit chips 101 to form the integrated circuit.",
"The superconducting vertical qubit chips 101 are not a monolithic wafer.",
"Rather, the superconducting vertical qubit chips 101 are formed from a wafer (substrate) diced into individual qubit dies.",
"Each diced superconducting vertical qubit chip 101 includes a coupling capacitor pad 401.The coupling capacitor pad 401 is a capacitor that capacitively couples each superconducting vertical qubit chip 101 to the readout plane 102 via the fan-out wiring 302, when the superconducting vertical qubit chip 101 is inserted in its etched recess 201.Accordingly, on one end of the superconducting vertical qubit chip 101, that end is electrically connected to the readout plane 102 through the coupling capacitor pad 401 and coupling pad 350 on the readout plane 102.It is noted that, for coupling capacitor pads 401 and 350 and coupling capacitor pads 404 and 250, the coupling capacitors may be defined by metal pads that are at right angles to each other, with a well-defined vertical separation.",
"The two types of coupling capacitors are quantum buss plane to lower side of qubit chip, and upper side of vertical qubit chip to readout plane.",
"It should be understood that two metal surfaces (pads in this case) at right angles to each other, separated by some distance, define a capacitor.",
"Embodiments exploit this fact to permit accurate coupling between circuit elements without resorting to wire bonds across right angle connections.",
"Additionally, each superconducting vertical qubit chip 101 includes coupling capacitor pads 404.The coupling capacitor pads 404 form a capacitor, and between the two coupling capacitor pads 404 is a tunnel junction 403 (sometimes called the qubit), such as, e.g., a Josephson junction.",
"The coupling capacitor pads 404 form a capacitor that capacitively couples to the quantum bus plane 100 via the interconnecting wiring 202.Accordingly, on the opposite end to the coupling capacitor pad 401, the opposite end is electrically connected to the quantum bus plane 100 through the coupling capacitor pads 404.The superconducting vertical qubit chip 101 includes readout resonator 402.The readout resonator 402 is configured with a resonance frequency designed to read the state of the qubit tunnel junction 403.The readout resonator 402 is positioned between the coupling capacitor pad 401 and the coupling capacitor pads 404.The readout resonator 402 is formed of conductive material that connects the coupling capacitor pad 401 and the coupling capacitor pads 404.The conductive material is a superconducting material, which forms the circuit.",
"The superconducting vertical qubit chip 101 includes a ground plane 405 surrounding the circuit of the coupling capacitor pad 401, the coupling capacitor pads 404, and the readout resonator 402.The material of the substrate separates the ground plane 405 from the circuit.",
"According to an embodiment, an assembly and packaging technique for the modular array of vertically integrated superconducting qubit chips 101 is discussed below in FIGS.",
"5A, 5B, 5C, 5D, 5E, and 5F.",
"FIG.",
"5A illustrates part of an assembly 500.The assembly 500 has a copper block 502.The copper block 502 includes a readout plane slot 503.The readout plane 102 is to be inserted into the readout plane slot 503 as discussed further below.",
"Although a copper block 502 is illustrated, the block 502 may be made of other materials.",
"The block 502 can be constructed of a variety of materials provided they give high thermal conductivity.",
"Examples other than copper include brass, sapphire, silicon, silver, aluminum, and/or niobium.",
"Assembly combs 520A and 520B are utilized to orient alignment of the superconducting vertical qubit chips 101 for assembly with the readout plane 102 (in the etched recesses 201) and quantum bus plane 100 (in the etched recesses 301) within the copper block 502.Both assembly combs 520A and 520B have teeth with predefined spacing.",
"For example, the assembly comb 520A has teeth 525A and the assembly comb 520B has teeth 525B.",
"In one implementation, the spacing of the teeth 525A is larger than the spacing of the teeth 525B, and the spacing of the teeth 525A and 525B is based on accommodating the cross-section size of the superconducting vertical qubit chips 101.The copper block 502 includes assembly slots 501A and 501B.",
"The assembly comb 520A is inserted into the assembly slot 501A, and the assembly comb 520B is inserted into the assembly slot 501B.",
"One assembly slot is positioned higher than the other assembly slot such that the assembly combs 520A and 520B define the desired alignment slots where they cross over and under each other but do not interfere with each other when inserted into their respective assembly slots 501A and 501B.",
"FIG.",
"5B is a schematic of the assembly 500 showing the assembly combs 520A and 520B in place within the copper block 502 according to an embodiment.",
"Slots 525 are formed by the intersection of the assembly combs 520A and 520B while in the copper block 502.The slots 525 are utilized to orient the superconducting vertical qubit chip 101.In particular, the slots 525 are formed by the spacing of the teeth 525A and 525B such that the slots 525 can accommodate the size of the superconducting vertical qubit chips 101.In one implementation, the spacing of the slots 525 may be about 5 millimeters (mm) in the x-axis and may be about 5 mm in the y-axis.",
"In one implementation, each superconducting vertical qubit chip 101 may have approximate dimensions of 8 mm tall by 2 mm wide by 0.7 mm thick.",
"Also, to accommodate the size of the superconducting vertical qubit chips 101, the etched recesses 201 and 301 may be about 0.7 mm in the x-axis and about 2 mm in the y-axis.",
"The etched recessed 201 and 301 may have a depth of about 0.35 mm in the z-axis.",
"FIG.",
"5C is a schematic of the assembly 500 showing an abbreviated view inside the copper block 502 (not shown) which is part of a housing 550 (shown in FIG.",
"5F) according to an embodiment.",
"In FIG.",
"5C, the abbreviated view omits certain elements in order to simplify the assembly 500 for better understanding.",
"The walls of the housing copper block 502 are removed, and only a copper base 530 of the housing 550 is shown.",
"The quantum bus plane 100 is attached to and/or positioned on the copper base 530.The intersecting assembly combs 520A and 520B are in place (within the copper block 502) forming the slots 525.Aligned through the slots 525, a few example superconducting vertical qubit chips 101 are installed into (the etched recesses 201 in) the quantum bus plane 100.The slots 525 directly align to individual etched recesses 201 below and provide a guide during installation of the superconducting vertical qubit chips 101.FIG.",
"5D is a schematic of the assembly 500 showing a transparent view into the copper block 502 according to an embodiment.",
"FIG.",
"5D shows the readout plane 102 installed into the copper block 502 and extending outside of the copper block 502 through readout plane housing slot 585.In one implementation, the quantum bus plane 100 fits into the bottom of the copper block 502.In another implementation, the copper block 502 may sit on top of the quantum bus plane 100.The superconducting vertical qubit chips 101 are sandwiched between the readout plane 102 and the quantum bus plane 100, and the ends of the superconducting vertical qubit chips 101 fit into the etched recesses 201 and 301 of the quantum bus plane 100 and readout plane 102, respectively.",
"For simplicity and ease of understanding, only a few superconducting vertical qubit chips 101 are shown in FIG.",
"5D.",
"Also, so as not to obscure FIG.",
"5D, the assembly combs 520A and 520B are not shown in this figure.",
"A board clamp 555 holds and attaches to portion of the readout plane 102 extending outside of the housing.",
"The board clamp 555 holds and attaches the readout plane 102 to the flexible circuit board 303.Outside of the housing 550, the connectors 304 are on a rigid circuit board 330 and connected to the flexible circuit board 303.The circuit board 330 comprises circuits (not shown) individually connecting each connector 304 to an individual circuit within the flexible circuit board 303, as understood by one skilled in the art.",
"FIG.",
"5E is a schematic of the assembly 500 showing a view underneath the housing 500 according to an embodiment.",
"The copper base 530 of the housing is removed.",
"FIG.",
"5E allows the bottom of the quantum bus plane 100 to be viewed.",
"FIG.",
"5E also shows that wire bonds 578 connect the readout plane 102 to the board clamp 555.These wire bonds 578 create an electrical connection between the fan-out wiring 302 on the readout plane 102 and the conductors (of whatever type) on the flexible circuit board 303.Although it possible to mechanically bond the flexible circuit board 303 directly to the silicon readout plane 102, those two items, however, have extremely different thermal expansion coefficients which may cause the connections to break over time.",
"Wire bonds 578 being flexible permit long-term reliability over many thermal cycles.",
"In one implementation, the two readout planes are to be made of the same material so any dimensional changes from thermal expansion are the same for both planes.",
"FIG.",
"5F is a schematic of the assembly 500 according to an embodiment.",
"FIG.",
"5F shows that a pusher block 570 pushes the readout plane 102 firmly against the superconducting vertical qubit chips 101.The pusher block 570 is spring loaded.",
"The constant pressure of the pusher block 570 ensures that the superconducting vertical qubit chips 101 stay in the etched recesses 201 and 301.The force of the pusher block 570 is caused by a spring mechanism 575 attached to a top cap 582 of the housing 550.As can be seen in FIG.",
"5F, the housing 550 is an enclosure.",
"The housing 550 may be made of copper, silver, brass, silicon, sapphire, aluminum, and/or niobium.",
"The housing 550 includes the copper block 502, the copper base 530, the pusher block 570, and the top cap 582.In one implementation, the assembly combs 520A and 520B may remain in the copper block 502 after the superconducting vertical qubit chips 101 have been installed (i.e., inserted into the etched recesses 201 and 301 of the quantum bus and readout planes 100 and 102, respectively).",
"In another implementation, the assembly combs 520A and 520B may be removed from the copper block 502 after installing the superconducting vertical qubit chips 101, such that the assembly combs 520A and 520B are not in the housing 550.For ease of understanding, sub-headings are provided below.",
"The sub-headings are meant for explanation purposes and not limitation.",
"Standardized Fabrication of Elements: Each of the discussed silicon elements, such as, e.g., the quantum bus plane 100, superconducting vertical qubit chips 101, and readout plane 102, use well-established lithographic technology that is time tested in the superconducting qubit community and thus understood by one skilled in the art.",
"In one embodiment, the materials are standardized to niobium for the resonator and transmission line elements; the materials are aluminum and native aluminum oxide for the qubit junction fabrication (i.e., the qubit tunnel junction 403) via standard double-angle evaporation.",
"All lithography may be performed on high-resistivity silicon wafers with established loss parameters appropriate for qubit technology, as understood by one skilled in the art.",
"The readout resonator 402 is in on the vertical qubit chip 101, and transmission line elements are any other wiring on the quantum buss plane 100, the qubit chip 101, and the readout plane 102.In one implementation, the readout resonators 402 may be of a different material than the wiring.",
"In another implementation, the readout resonators 402 and wiring may be fabricated from a variety of all the same materials.",
"In yet another implementation, the readout resonators 402 and various different portions of the wiring may be fabricated from a variety of different materials for each sub-category of function.",
"Complete assembly of a scalable quantum processor with N qubits (i.e., N qubit chips 101) is achieved without resorting to any multi-level lithography, inserted ground planes, cross-overs, or thru-silicon-vias (TSVs).",
"Using current standard lithographic techniques, embodiments allow the straightforward integration of N=100 to 1000 superconducting vertical qubit chips 101, taking up a space roughly the size of a deck of playing cards (e.g., 2.5×3.5 inches or 64×89 mm).",
"Design of Individual Qubit Chips and Coupling Capacitance Choices: From electromagnetic simulations for reasonable parameters of qubit tunnel junctions 403, readout resonators 402, and quantum bus planes 100, it is possible to achieve the desired precise coupling capacitance values with the geometry described herein.",
"Each individual superconducting vertical qubit chip 101 contains a capacitor (i.e., coupling capacitor 404) that couples signal to the quantum bus traces (i.e., interconnect wiring 202) on the quantum bus plane 100.The capacitor (coupling capacitor 404) provides coupling that is appropriate for a specific universal two-qubit entangling gate.",
"The capacitor is formed by an electrode on the lower end of the vertical qubit chip 101 which couples to electrodes on the quantum buss plane 100.The approximate range in this implementation for the capacitor value is around 7 to 5 femto Farads.",
"The interconnection between the superconducting vertical qubit chip 101 and the etched recesses 201 (pocket) in the quantum bus plane 100 is designed to minimize stray coupling between the qubit signals and ground plane 405.On the other end of the superconducting vertical qubit chip 101, the interconnection with the readout plane 102 creates a specific capacitance between the readout resonator 402 and the control transmission line 320 (of the fan-out wiring 302) such that the readout resonator 402 has a well-defined quality factor and permits a high fidelity readout.",
"This capacitor (i.e., coupling capacitor pad 401) is formed by an electrode on the superconducting vertical qubit chip 101 (qubit die) which couples to an electrode (a portion of the control transmission line 320) on the readout plane 102.The approximate value of this capacitor in this implementation is around 5 to 7 femto Farads, for example.",
"Each superconducting vertical qubit chip 101 is metalized on the backside with superconductor material to control stray coupling and other electric fields within the processor housing 550.The backside of the superconducting vertical qubit chip 101 is opposite the circuit of the coupling capacitor pad 401, the coupling capacitor pads 404, and the readout resonator 402 on the front side.",
"Note that all capacitor values and uncertainty are determined by lithographic feature sizes and depth of etches.",
"These values are easily changed and provide for sufficient accuracy for the circuit tolerances required for embodiments.",
"Design of Quantum Bus Plane: The fabrication process of the quantum bus plane 100 can begin with standard 2D integration techniques.",
"In one implementation, niobium is electro-sputtered onto a silicon substrate 590.Multiple masks, having the quantum bus designs and having the etched recesses 201 (pockets) where qubit chips 101 are to be mounted, may be used for reactive ion etching (RIE) of the niobium.",
"The quantum bus design mask defines the coupling bus resonators 205 which couple quantum information among the superconducting vertical qubit chips 101.The pocket mask (for making the etched recesses 201) defines the locations to etch down into the silicon for the individual superconducting vertical qubit chips 101 to be mounted.",
"The process for the pocket mask etch may be similar to most 3D integration schemes, except in this case the sputtered niobium is used as a hardmask to first define the pockets (i.e., etched recesses 201).",
"Definition of the pocket (i.e., etched recess 201) in the silicon substrate 590 can be achieved using a deep silicon dry etch process, reactive ion etching (RIE), or a wet chemistry (tetramethyl ammonium hydroxide (TMAH)).",
"The pockets (i.e., etched recesses 201) of the quantum bus plane 100 are arranged in a grid structure where successive rows are offset, one corresponding to superconducting vertical code qubit chips, and the other row corresponding to superconducting vertical syndrome qubits chips 101 for error detection via measurement.",
"Each qubit chip pocket (i.e., etched recess 201) is arranged to couple to two coupling bus resonators 205 defined on the quantum bus plane 100 in one implementation.",
"Note that this arrangement is not the only way to realize the surface code, as one can also couple either three or four coupling bus resonators 205 to a single superconducting vertical qubit chip 101 in another implementation.",
"Location accuracy of the qubit chip pockets (etched recesses 201 (including etched recesses 301 in readout plane 102) is determined by the lithography and depth accuracy as determined by the etch time.",
"The pockets are formed with a chamfered or bell-mouthed opening to allow easy insertion of each superconducting vertical qubit chip 101 (qubit die).",
"Depending on results from scaling to larger N (i.e., a larger amount of superconducting vertical qubit chips 101), the quantum bus plane 100 may be admissible to more integration techniques such as TSVs for chip-mode reduction.",
"The nuance here is that no Josephson junctions (qubits) 403 need to be defined in this quantum bus plane 100, so there would be minimal effect on qubit coherence with further integration of the quantum bus plane 100.Design of Readout Plane: The readout plane 102 starts off similar to the quantum bus plane 100, with niobium conductors etched lithographically on a silicon substrate 595.Co-planar transmission lines 320 are patterned on the readout plane 102 in a fan-out configuration (i.e., fan-out wiring 302) so as to bring external signals into and out of each superconducting vertical qubit chip 101.These transmission lines 320 are defined in a coplanar waveguide, and support 50Ω microwave driving of both readout and qubit control signals.",
"All these transmission lines 320 meander through the readout plane 102 terminating on one edge in wire bond pads 370.The wire bond pads 370 are on the extreme right end of the fan-out wiring 302.Similar to the quantum bus plane, pockets (i.e., etched recesses 301) in the readout plane 102 are likewise defined via deep etching into the silicon substrate 595 of the readout plane 102, in corresponding locations as the etched recesses 201 in the quantum bus plane 100 so as to accept the mounting of the individual superconducting vertical qubit chips 101.These pockets (i.e., etched recesses 301) may be chamfered or otherwise bell-mouthed for ease of assembly and locating of structure.",
"The microwave signals for control and readout are carried off the readout plane 102 via wire bonds 578 to the flexible circuit board 303 which conducts to other transmission lines embedded in a separate rigid circuit board 330 populated with connectors 304 leading to external components.",
"Ground Planes in Quantum Bus Plane and Readout Plane Pockets: After etching qubit chip pockets (etched recesses 201, 301) in both the quantum bus and readout planes 100 and 102 respectively, these pockets (etched recesses 201, 301) are coated with niobium via sputtering to form continuous ground plane.",
"These ground planes are designed to mate to the ground planes 405 that exist on the extreme ends of each superconducting vertical qubit chip 101 to form a continuous electrostatic ground between the quantum bus and readout planes 100 and 102, respectively; the continuous electrostatic ground between the quantum bus and readout planes 100 and 102 (respectively) serves to (1) further isolate each qubit site (i.e., locations of etched recesses 201, 301) from spurious modes, (2) isolate each qubit site (i.e., locations of etched recesses 201, 301) from adjacent qubit superconducting vertical qubit chips 101, and (3) eliminate unwanted cross-talk coupling between superconducting vertical qubit chips 101.Assembly of Modular Array Elements: 1.Each individual superconducting vertical qubit chip 101 is located by an etched recess 201 formed in the quantum bus plane 100 and an etched recess 301 formed the readout plane 102.In one implementation, the etched recesses 201, 301 are accurately formed in the silicon substrates 590, 595 using a standard wet etch process.",
"2.Each individual superconducting vertical qubit chip 101 is chosen for desirable electrical characteristics such as transition frequency.",
"In some cases the syndrome qubits might be more strongly coupled to the readout wiring to enhance signal-to-noise.",
"This would reduce coherence times on the syndrome qubits which does not in any way degrade the quantum information in the code qubits.",
"3.A pair of crossed assembly combs 520A and 520B is mounted to the outer housing of the copper block 502 in order to temporarily provide alignment for the superconducting vertical qubit chips 101 (as shown in FIG.",
"5A).",
"The assembly combs 520A and 520B create a series of alignment slots 525 (as shown in FIG.",
"5B) to orient the superconducting vertical qubit chips 101 which are inserted vertically from above.",
"The superconducting vertical qubit chips 101 key into the etched recesses 201 in the quantum bus plane 100 (as shown in 5C) and are thereby (automatically) oriented to key into the corresponding etched recesses 301 in the readout plane 102 (as shown in FIG.",
"5D).",
"The readout plane 102 is inserted from the side via readout plane slot 503.FIG.",
"5E depicts the assembly 500 from below and shows the assembled components with the assembly combs 520A and 520B omitted.",
"Once assembled, the vertical organization of the superconducting vertical qubit chips 101 constrained (and sandwiched) between the two silicon quantum bus and readout planes 100 and 102 (respectively) is maintained with pressure applied by the pusher block 570.The pusher block 570 is spring-loaded from above via the springs 575 pressed down by the top cap 582 (as shown in FIG.",
"5F).",
"Expandable, Scalable and Replaceable Array: The figures associated with embodiments show a fourteen qubit chip array but the number of superconducting vertical qubit chips 101 can be expanded to any arbitrary number (N).",
"All that is required is that the quantum bus plane 100 should be enlarged and the niobium wiring be replicated at all qubit sites (i.e., locations at the etched recesses 201 to accommodate superconducting vertical qubit chips 101) as needed.",
"The readout plane 102 can support many signal transmission lines 320 interleaved between each qubit site (i.e., locations at the etched recesses 301 to accommodate superconducting vertical qubit chips 101) to bring the signals to one edge and may require integration of dielectric cross-overs to reduce crosstalk if desired.",
"Moreover, the further integration of the readout plane 102 and quantum bus planes 100 is a minimal issue as it will neither directly affect the qubit chip fabrication process nor the qubit coherence performance.",
"According to embodiments, the assembly 500 includes the desirable feature that each superconducting vertical qubit chip 101 may be hand-selected for the correct electrical characteristics; any member of the array of superconducting vertical qubit chips 101 may be individually replaced at any time if the qubit chip's performance degrades for any reason during operation.",
"Replacement of the superconducting vertical qubit chip 101 can be accomplished without removing wire bonds 578 and/or without having to unsolder any components.",
"Embodiments provide a clear separation of fabrication processing steps and avoid the need for all N qubit and circuit parameters to meet specification on a single superconducting vertical qubit chip 101.Qubit chips 101 from multiple different fabrication runs can be combined in this type of quantum processor so that parameters such as transition frequency may be easily tailored without having to achieve a full range of accurate parameters on one silicon wafer in just one fabrication run.",
"Individual qubit chips 101 may be chosen from various different fabrication runs (wafers) and combined in the processor assembly.",
"As understood by one skilled in the art, microwave signals are applied to the qubit chip 101 via the readout lines to excite it into a defined state.",
"After some later time the state of the qubits can be then read out by interrogating them at some other microwave frequency, again via the readout lines.",
"FIG.",
"6 is a method 600 of configuring an assembly 500 for a quantum computing device according to an embodiment.",
"Reference can be made to the figures discussed herein.",
"At block 605, the quantum bus plane 100 having a first set of recesses 201 are provided, as depicted in FIG.",
"2.At block 610, the quantum bus plane 100 is positioned in the block 502, on top of the copper base 530, as seen in FIG.",
"5D.",
"The alignment combs 520A and 520B are installed in the copper block 502 and fixed in place, creating a series of precisely aligned slots 535 to accept the qubit chips 101, as seen in FIG.",
"5B.",
"At block 615, a plurality of superconducting vertical qubit chips 101 are placed/installed in the block 502, each of the plurality of qubit chips 101 has a first end positioned in the first set of recesses 201 (as shown in FIG.",
"5C).",
"The plurality of qubit chips 101 extend vertically in a lengthwise direction by being positioned in the first set of recesses 201 and in the slots 525 created by the alignment combs.",
"The set of recesses 201 holds the lower end of the plurality of qubit chips 101 in the quantum bus plane 100.The first end of the plurality of qubit chips 101 is opposite the second end.",
"At block 620, the readout plane 102 with its recesses 301 is then installed into the copper block 502 such that the recesses 301 in the readout plane 102 are positioned to accept the upper end (i.e., second end) of the plurality of all the qubit chips 101 which have been aligned by the slots 525 created by both alignment combs 520A, 520B.",
"The readout plane 102 thus drops down over the ends of the qubit dies 101 a distance equal to the depth of the recesses in the readout plane 301 and the precise mechanical alignment of all the electrical circuit elements is achieved in all three axes simultaneously.",
"At this point the alignment combs 520A and 520B may either be left in place or may be removed.",
"The quantum bus plane 100 comprises a substrate 590 with interconnect wiring 202 on top of the substrate 590, and the interconnect wiring 202 connects the plurality of qubit chips 101 via a plurality of coupling bus resonators 205.The readout plane 102 comprises a substrate 595 with fan-out wiring 302 on top of the substrate 595, and the fan-out wiring 302 individually connects each of the plurality of qubit chips 101 to a circuit board 330.The circuit board 330 individually connects each of the plurality of qubit chips 101 to a plurality of connectors 304 in a one-to-one relationship.",
"The block 502 is configured to receive a first assembly comb 520A and a second assembly comb 520B to form an intersection, and the intersection of the first and second assembly combs 520A, 520B form a plurality of slots 525 for individually accepting the plurality of qubit chips 101.The plurality of slots 525 mechanically holds the plurality of qubit chips 101 in a vertical position.",
"FIG.",
"7 is a method 700 of configuring an assembly 500 for a quantum computing device according to an embodiment.",
"Reference can be made to the figures discussed herein.",
"At block 705, the following parts are assembled: copper base 530 and copper block 502.At block 710 the quantum buss plane 100 is installed into the copper block 502 such that the quantum buss plane 100 rests on top of the copper base 530, and the quantum bus plane 100 has a set of recesses 201 (the readout plane 102 has a different set of recesses 301).",
"Then, the assembly combs 520A and 520B are installed and fixed into the copper block 502 thereby creating alignment slots 525.At block 715, a plurality of qubit chips 101 are installed in the block 502, where each of the plurality of qubit chips 101 has a first end positioned in the first set of recesses 201 using the alignment slots 525 created by the assembly combs 520A, 520B to guide the qubit chips 101 into the correct locations.",
"The housing 550 includes a readout plane housing slot 585.At block 720, the readout plane 102 is installed into the slot 585 and the recesses 301 in the readout plane 102 accept the upper ends (i.e., second end) of the plurality of all the qubit chips 101 which have been put in the correct locations by the alignment combs 520A, 520B such that the readout plane 102 drops over all of them (qubit chips 101) simultaneously.",
"The bell-mouthed nature of the recesses 301 in the readout plane 102 assists in the final locating of the ends of the qubit dies 101 into the recesses 301.The readout plane 102 extends through the readout plane housing slot 585 to connect to the circuit board 330, and the circuit board 330 connects to a plurality of connectors 304.The housing 550 includes a pushing mechanism configured to apply pressure to the readout plane 102, and the pressure applied to the readout plane 102 forces the plurality of qubit chips 101 to the quantum bus plane 100.The pushing mechanism comprises: a pusher block 570 positioned on top of the readout plane 102, and a spring mechanism 575 pressing downward against the pusher block 570.The top part (top cap 582) of the housing 550 applying a compression force to the spring mechanism 575 from above.",
"It will be noted that various microelectronic device fabrication methods may be utilized to fabricate the components/elements discussed herein as understood by one skilled in the art.",
"In semiconductor device fabrication, the various processing steps fall into four general categories: deposition, removal, patterning, and modification of electrical properties.",
"Deposition is any process that grows, coats, or otherwise transfers a material onto the wafer.",
"Available technologies include physical vapor deposition (PVD), chemical vapor deposition (CVD), electrochemical deposition (ECD), molecular beam epitaxy (MBE) and more recently, atomic layer deposition (ALD) among others.",
"Removal is any process that removes material from the wafer: examples include etch processes (either wet or dry), and chemical-mechanical planarization (CMP), etc.",
"Patterning is the shaping or altering of deposited materials, and is generally referred to as lithography.",
"For example, in conventional lithography, the wafer is coated with a chemical called a photoresist; then, a machine called a stepper focuses, aligns, and moves a mask, exposing select portions of the wafer below to short wavelength light; the exposed regions are washed away by a developer solution.",
"After etching or other processing, the remaining photoresist is removed.",
"Patterning also includes electron-beam lithography.",
"Modification of electrical properties may include doping, such as doping transistor sources and drains, generally by diffusion and/or by ion implantation.",
"These doping processes are followed by furnace annealing or by rapid thermal annealing (RTA).",
"Annealing serves to activate the implanted dopants.",
"The flowchart and block diagrams in the Figures illustrate the architecture, functionality, and operation of possible implementations of systems, methods, and computer program products according to various embodiments of the present invention.",
"In this regard, each block in the flowchart or block diagrams may represent a module, segment, or portion of instructions, which comprises one or more executable instructions for implementing the specified logical function(s).",
"In some alternative implementations, the functions noted in the block may occur out of the order noted in the figures.",
"For example, two blocks shown in succession may, in fact, be executed substantially concurrently, or the blocks may sometimes be executed in the reverse order, depending upon the functionality involved.",
"It will also be noted that each block of the block diagrams and/or flowchart illustration, and combinations of blocks in the block diagrams and/or flowchart illustration, can be implemented by special purpose hardware-based systems that perform the specified functions or acts or carry out combinations of special purpose hardware and computer instructions."
]
] |
Patent_15871436
|
[
[
"GRAPHICAL USER INTERFACE FOR TISSUE BIOPSY SYSTEM",
"A screen providing a graphical user interface (GUI) for a tissue biopsy system includes a circular area and a plurality of GUI areas of variable size located in the circular area.",
"The plurality of GUI areas includes a first GUI area, a second GUI area, and a third GUI area.",
"The first GUI area is configured to represent a first region of the target site from which at least one tissue specimen has been separated from tissue at the target site by a tissue cutting member.",
"The second GUI area is configured to represent a second region from which the tissue cutting member may separate one or more additional tissue specimens from tissue at the target site.",
"The third GUI area is configured to represent a third region in which the tissue cutting member is deployed to separate a tissue specimen from tissue at the target site."
],
[
"1-41.",
"(canceled) 42.A screen providing a graphical user interface (GUI) for a tissue biopsy system having a tissue cutting member adapted for cutting one or more tissue specimens from tissue at a target site within a patient, the screen having the graphical user interface comprising: a circular area; and a plurality of GUI areas of variable size located in the circular area, the plurality of GUI areas including: a. a first GUI area configured to represent a first region of the target site from which at least one tissue specimen has been separated from tissue at the target site by the tissue cutting member, the first GUI area having a plurality of portions, wherein at least one portion of the plurality of portions is a curvy band portion; b. a second GUI area, visually distinguishable from the first GUI area, configured to represent a second region from which the tissue cutting member may separate one or more additional tissue specimens from tissue at the target site; and c. a third GUI area, visually distinguishable from the first and second GUI areas, configured to represent a third region in which the tissue cutting member is deployed to separate a tissue specimen from tissue at the target site.",
"43.The screen having the graphical user interface of claim 42, wherein the first GUI area includes a curvy band portion radially spaced from an arcuate fan-shaped portion.",
"44.The screen having the graphical user interface of claim 42, wherein the circular area defines a circumferential line, the first GUI area having a first curvy band portion adjacent to the circumferential line and a second curvy band portion radially separated from the first curvy band portion.",
"45.The screen having the graphical user interface of claim 44, wherein the first GUI area has a circular portion, and the second curvy band portion being interposed between the first curvy band portion and the circular portion.",
"46.The screen having the graphical user interface of claim 44, wherein the first GUI area has an arcuate fan-shaped portion, and the second curvy band portion being interposed between the first curvy band portion and the arcuate fan-shaped portion.",
"47.The screen having the graphical user interface of claim 42, wherein the circular area defines a circumferential line, the first GUI area having a curvy band portion adjacent to the circumferential line and a ring portion radially separated from the curvy band portion.",
"48.The screen having the graphical user interface of claim 47, wherein the first GUI area has a circular portion, and the ring portion being interposed between the curvy band portion and the circular portion.",
"49.The screen having the graphical user interface of claim 42, wherein the circular area defines a circumferential line, the first GUI area having a first curvy band portion adjacent to the circumferential line and the third GUI area having a second curvy band portion adjacent to the circumferential line.",
"50.The screen having the graphical user interface of claim 49, wherein the first GUI area includes a first arcuate fan-shaped portion radially spaced from the first curvy band portion and the third GUI area includes a second arcuate fan-shaped portion radially spaced from the second curvy band portion.",
"51.The screen having the graphical user interface of claim 42, wherein the circular area defines a circumferential line, the first GUI area having a first curvy band portion adjacent to the circumferential line and a ring portion radially separated from the first curvy band portion, and the third GUI area having a second curvy band portion adjacent to the circumferential line and radially separated from the ring portion of the first GUI area.",
"52.The graphical user interface of claim 51, wherein the first GUI area has a circular portion, and the ring portion being interposed between the first curvy band portion and the circular portion."
],
[
"<SOH> BACKGROUND OF THE INVENTION <EOH>In diagnosing and treating certain medical conditions, such as potentially cancerous tumors, it is usually desirable to perform a biopsy, in which a specimen of the suspicious tissue is removed for pathological examination and analysis.",
"In many instances, the suspicious tissue is located in a subcutaneous site, such as inside a human breast.",
"To minimize surgical intrusion into the patient's body, it is desirable to be able to insert a small instrument into the patient's body to access the targeted site and to extract the biopsy specimen therefrom.",
"Electrosurgical techniques have been used in a variety of biopsy procedures.",
"In electrosurgery, high frequency electrical energy is typically applied to patient tissue through an active electrode, the electrical circuit being completed by a return electrode in contact with the patient's tissue.",
"Electrical energy flowing through the tissue from the active electrode is effective to ablate tissue near the active electrode, forming an opening in the tissue and so allowing insertion of the instrument into a patient's body.",
"A return electrode may be placed on the exterior of the patient's body or may be incorporated into the device itself.",
"The return electrode is typically attached to the patient at a point remote from where the primary or active electrode contacts the tissue.",
"Conventionally, when an electrosurgical biopsy instrument inserts into a patient's body, it's cutting end cannot be readily seen from outside.",
"This makes it difficult for a surgeon to find out where the electrosurgical biopsy instrument is, in a biopsy operation.",
"Thus, it is desirable to have a display device visually showing the location of the electrosurgical biopsy instrument with respect to the patient's body in biopsy operation."
],
[
"<SOH> SUMMARY OF THE INVENTION <EOH>The invention is directed to a graphical user interface for a tissue biopsy system having a tissue cutting member adapted for cutting one or more tissue specimens from tissue at a target site within a patient.",
"In one embodiment, the graphical user interface includes at least a first GUI area and a second GUI area.",
"The first GUI area represents a first region of the target site from which the tissue cutting member has separated one or more tissue specimens.",
"The second GUI area, visually distinguishable from the first GUI area, represents a second region from which the tissue cutting member may separate one or more additional tissue specimens from tissue at the target site."
],
[
"RELATED APPLICATIONS This application is based on Provisional Application Ser.",
"No.",
"60/631,338, filed on Nov. 29, 2004, and claims priority therefrom.",
"The provisional application is incorporated by reference herein in its entirety.",
"FIELD OF THE INVENTION The present invention relates generally to tissue removing devices such as biopsy devices.",
"More specifically, it is directed to a graphical user interface (GUI) used in conjunction with the tissue removing devices.",
"BACKGROUND OF THE INVENTION In diagnosing and treating certain medical conditions, such as potentially cancerous tumors, it is usually desirable to perform a biopsy, in which a specimen of the suspicious tissue is removed for pathological examination and analysis.",
"In many instances, the suspicious tissue is located in a subcutaneous site, such as inside a human breast.",
"To minimize surgical intrusion into the patient's body, it is desirable to be able to insert a small instrument into the patient's body to access the targeted site and to extract the biopsy specimen therefrom.",
"Electrosurgical techniques have been used in a variety of biopsy procedures.",
"In electrosurgery, high frequency electrical energy is typically applied to patient tissue through an active electrode, the electrical circuit being completed by a return electrode in contact with the patient's tissue.",
"Electrical energy flowing through the tissue from the active electrode is effective to ablate tissue near the active electrode, forming an opening in the tissue and so allowing insertion of the instrument into a patient's body.",
"A return electrode may be placed on the exterior of the patient's body or may be incorporated into the device itself.",
"The return electrode is typically attached to the patient at a point remote from where the primary or active electrode contacts the tissue.",
"Conventionally, when an electrosurgical biopsy instrument inserts into a patient's body, it's cutting end cannot be readily seen from outside.",
"This makes it difficult for a surgeon to find out where the electrosurgical biopsy instrument is, in a biopsy operation.",
"Thus, it is desirable to have a display device visually showing the location of the electrosurgical biopsy instrument with respect to the patient's body in biopsy operation.",
"SUMMARY OF THE INVENTION The invention is directed to a graphical user interface for a tissue biopsy system having a tissue cutting member adapted for cutting one or more tissue specimens from tissue at a target site within a patient.",
"In one embodiment, the graphical user interface includes at least a first GUI area and a second GUI area.",
"The first GUI area represents a first region of the target site from which the tissue cutting member has separated one or more tissue specimens.",
"The second GUI area, visually distinguishable from the first GUI area, represents a second region from which the tissue cutting member may separate one or more additional tissue specimens from tissue at the target site.",
"BRIEF DESCRIPTION OF THE DRAWINGS FIG.",
"1 is an exploded view of the elongated tissue biopsy system embodying features of the invention.",
"FIG.",
"2 is a perspective view of the embodiment shown in FIG.",
"1 in an assembled condition without a housing cover for the probe component.",
"FIG.",
"3 is a side elevational view of the tissue biopsy device shown in the FIG.",
"2.FIG.",
"4A is a longitudinal cross-section of the probe shown in FIG.",
"3 taken along the lines 4-4 with the tissue cutting element in a withdrawn position.",
"FIG.",
"4B is a longitudinal cross-section of the probe shown in FIG.",
"3 taken along the lines 4-4 with the tissue cutting element in a forward or closed position.",
"FIG.",
"5 is a transverse cross-sectional view of the probe shown in FIG.",
"4B taken along the lines 5-5.FIG.",
"6 is a perspective view of the underside of the probe shown in FIG.",
"1.FIG.",
"7 is an enlarged perspective view of the distal end of the driver unit shown in FIG.",
"1.FIG.",
"8 is an enlarged perspective view of the distal end of the probe housing illustrating a marker element which depicts the orientation of the aperture in the tubular section of the biopsy device.",
"FIG.",
"9 is a perspective view of the tissue biopsy system shown in FIG.",
"1 assembled and mounted on a stereotactic frame.",
"FIG.",
"10 is a perspective view of the underside of the driver shown in FIG.",
"1.FIG.",
"11 is an elevational view of a marker delivery device with a flared guide on the distal end of the shaft which facilitates guiding the distal tip of a marker delivery device into the interior of the proximal end of the tissue cutter.",
"FIG.",
"12 is a longitudinal cross-sectional view of the distal end of the marker delivery device and flared guide disposed within the tissue collection component shown in FIG.",
"1.FIG.",
"13 is a longitudinal cross sectional view of the proximal end of the marker delivery device with the flared guide at the proximal end of the shaft and with the shaft deployed within the inner lumen of the tissue cutter.",
"FIG.",
"14 illustrates a screen providing information with respect to an operation of the tissue biopsy system.",
"FIGS.",
"15A through 15E illustrate a number of alternative circular graphical user interfaces, each having a first GUI area and second GUI area representing various parts of a target site within a patient from which one or more tissue specimens haven been or may be separated from tissue.",
"FIGS.",
"16A through 16E illustrate a number of alternative polygonal graphical user interfaces, each having a first GUI area and second GUI area representing various parts of a target site within a patient from which one or more tissue specimens haven been or may be separated from tissue.",
"FIGS.",
"17A through 17E illustrate a number of alternative circular graphical user interfaces, each having a first, second and third GUI area representing various parts of a target site within a patient from which one or more tissue specimens haven been or may be separated or in which the tissue cutting element is deployed.",
"FIGS.",
"18A through 18E illustrate a number of alternative polygonal graphical user interfaces, each having a first, second and third GUI area representing various parts of a target site within a patient from which one or more tissue specimens haven been or may be separated, or in which the tissue cutting element is deployed.",
"DETAILED DESCRIPTION OF EMBODIMENTS OF THE INVENTION FIGS.",
"1-3 illustrate a biopsy system 10 embodying features of the invention which includes a disposable probe component 11, a driver component 12 and specimen collector 13.The probe component 11 generally includes an elongated distal shaft 14 having a tubular section or cannula 15 with a tissue penetrating tip 16 on the distal end thereof and an open, tissue receiving aperture 17.The probe component 11 also includes a probe housing 18 with a housing cover 19 which is configured to interfit with the driver component 12.A tissue cutter 20 is slidably disposed within the probe and has a distal cutting surface 21 which severs tissue which extends through the tissue receiving aperture 17.Details of the probe component 11 are further shown in FIGS.",
"4A and 4B.",
"The probe housing 18 has a mechanical system for rotating the housing and the tubular section 15 secured thereto to control the angular position of the tissue receiving aperture 17 and for moving the tissue cutter 20 slidably disposed within the probe component 11.The mechanical system of the driver component 12 has first driving gear 22 that is configured to engage the probe gear 23 and rotate the probe housing 18 so as to adjust the orientation of aperture 17 in the distal extremity of the tubular section 15.The probe gear 23 is secured to the rotating connector body 24 by adhesive 25.The proximal extremity of the tubular section 15 is secured to the rotating connector body 24 by adhesive 26.An end cap 27 retains the connector body 24 within the probe housing 18.Rotation of the probe gear 23 rotates the connector body 24 and the attached tubular section 15.The rotation is preferably controlled so that the tubular section 15 rotates in discrete steps about the longitudinal axis 28 to adjust the angular orientation of the aperture 17 about the longitudinal axis.",
"Preferably these discrete orientations may be provided in increments of 30° which can be readily indicated by arrow 29 at the distal end of the probe housing 18 as shown in FIG.",
"8.The second driving gear 30 is configured to drive the tissue cutter 20 longitudinally.",
"The driving gear 30 engages probe gear 31 which drives cutter traverse nut 32 and cutter screw 33 threadably connected to the cutter traverse nut.",
"The distal end of the cutter screw 33 is provided with a recess 34 which receives the rib 35 of the cutter shuttle 36.The cutter shuttle 36 is secured to the tissue cutter 20 by adhesive 37.The probe gear 31 is secured to the cutter traverse nut 32 by adhesive 38.Rotation of the probe gear 31 adjusts the relative axial position of the cutter screw 33 with respect to the cutter traverse nut 32 which is secured to the cutter shuttle 36.Longitudinal movement of the tissue cutter 20 follows the longitudinal movement of the cutter shuttle 36 resulting from the movement of cutter screw 33.The length of the tissue receiving aperture 17, and as a result the length of the specimen, can be controlled by adjusting the initial longitudinal position of the distal end of the tissue cutter 20 within the aperture, before cutting.",
"The third driving gear 40 is configured to rotate or oscillate the tissue cutter 20 as the cutter moves along the longitudinal axis 28 to facilitate the cutting action of the cutting surface 21 on the distal end of the cutter.",
"The third driving gear 40 engages probe gear 41 which is secured to cutter oscillation shaft 42 by adhesive 43.The probe gear 41 may be oscillated back and forth about the longitudinal axis 28 or rotated continuously in a single direction about the longitudinal axis, or both depending upon the desired rotational movement of the tissue cutter.",
"A biased valve assembly 44 is provided in the distal end of the probe housing 18 to ensure sealing when a vacuum is developed within the interior 45 of the tissue cutter 20 while providing an atmospheric vent 46 between the interior surface 47 of the tubular section 15 and the exterior surface 48 of the tissue cutter 20.The valve assembly 44 includes a spring 49, valve body 50 and a valve collar 51 which is secured to the proximal end of the tubular section 15 by adhesive 52.The proximal end of the valve spring 49 rests against the shoulder 53 provided in the exterior of the valve body 50.A biased cutter shaft seal 54 slidably engages the exterior 48 of the tissue cutter 20.The tissue specimen collector 13 is secured to the proximal end of the housing of probe component 11 and has an interior 55 in fluid communication with the inner lumen 56 extending within the tissue cutter 20 and has a removable proximal wall 57 of specimen receiving cartridge 58 which gives access to the interior 55 and any tissue specimens which may have been drawn therein.",
"A vacuum is generated within the interior 55 to draw tissue specimens through the inner lumen 45 into the interior 55.Tubular member 59 has a distal end which is in fluid communication with the interior 55 of the tissue specimen collector 13 and has a proximal end (not shown) which is configured to be connected to a vacuum source.",
"Application of a vacuum within the tubular member 59 aids in pulling tissue into the interior 17 of the tubular section 15 and transfer of the severed tissue specimen through the inner lumen 45 of the tissue cutter 20 to the specimen cartridge 58.The driver 12 has a housing 60 with an upper concave surface 61 which is configured to receive the lower surface 62 of the probe housing 18.Three partially exposed driving gears 22, 30 and 40 are provided on the proximal end of the driver 12 which are configured to engage the probe gears 23, 31 and 41 respectively.",
"The drive 12 is provided with three separately operating drive motors (not shown) which drive the drive gears 22, 30 and 40.The separate drive motors (not shown) are connected to and the operation thereof controlled by a control module, such as described in copending application Ser.",
"No.",
"10/847,699, filed on May 17, 2004.The control module controls the motors which move the individual drive gears 22, 30 and 40.The gear 22 engages gear 23 in the probe 11 to control the rotation of the probe housing 18 and the location and orientation of the tissue receiving aperture 17.The drive gear 30 engages probe gear 31 to control the longitudinal position and motion of the tissue cutter 20 along the longitudinal axis 28.Drive gear 40 engages probe gear 41 to control the oscillation or rotation of the tissue cutter 20 about the longitudinal axis 28.As shown in FIG.",
"7, the front face of the driver component 12 is provided with light sources 66 and 67 and a manually activatable switch 68 to activate the light sources and enable the physician and other operating personnel to better view the operating site on the patient.",
"Other manual switches, e.g.",
"a foot activated switch, may be employed.",
"Alternatively, the light sources may be automatically activated when the probe component 11 is installed on the driver 12 or other events such as when electrical power is turned on.",
"The driver component 12 may have a battery pack for the light sources 66 and 67.The penetrating distal tip 16 may have a variety of tip shapes.",
"A particularly suitable distal tip shape is described in co-pending provisional application Ser.",
"No.",
"60/532,277, filed on Dec. 23, 2003.Alternatively, the distal tip may be provided with an arcuate RF electrode such as disclosed in U.S. Pat.",
"No.",
"6,261,241, and U.S. Pat.",
"No.",
"6,471,700, both assigned to the present assignee.",
"The separate driver component 12 allows the entire probe unit to be disposable.",
"The drive gears of the drive component 12 control the motion of the tissue cutting member 20 for cutting and the motion of the tubular section 15 to orient the aperture 17.Other means (not shown) may provide mechanical and electrical power, vacuum, and control to the probe device.",
"Examples of replaceable snap-in type probe units are disclosed in Burbank et al., U.S. patent application Ser.",
"No.",
"10/179,933, “Apparatus and Methods for Accessing a Body Site” hereby incorporated by reference in its entirety.",
"Drive units such as that described in WO 02/069808 (which corresponds to co-pending U.S. application Ser.",
"No.",
"09/707,022, filed Nov. 6, 2000 and U.S. application Ser.",
"No.",
"09/864,021, filed May 23, 2001), which are assigned to the present assignee, may be readily modified by those skilled in the art to accommodate the movement of the cutting member 20.The distal end of the probe component 11 is advanced within the patient with the tissue cutter 20 in a forward or closed position (FIG.",
"4B), until the aperture 17 of the tubular section 15 is located in a desired location for taking a tissue specimen.",
"The tissue cutter 20 is then withdrawn proximally to an open position to open the aperture 17.The withdrawal of the tissue cutter can be used to control the length of the aperture which is opened in order to control the length of the specimen which is severed.",
"A vacuum is applied to the interior 45 of the tissue cutter 20 to draw tissue at the site into the inner lumen of the tubular section 15 through the aperture 17.The tissue cutter 20 is then driven distally by rotation of probe gear 30 and rotated or oscillated by drive gear 40 engaging probe gear 41 to sever the aspirated tissue from the supporting tissue at the target site with the tissue cutting surface 21.The vacuum within the interior of the tissue cutter 20 causes the tissue specimen to be drawn through the inner lumen 45 of the tissue cutter 20 and into the cartridge 58 of specimen collector 13 shown in FIG.",
"2.Positive pressure or even ambient conditions distal to the tissue specimen can facilitate tissue passing through the interior 45 of tissue cutter 20.If another tissue specimen is desired, the tubular section 15 may be rotated by the drive gear 22 engaging the probe gear 23 in one or more steps to repeat obtaining another tissue specimen in the same manner without otherwise moving the probe component 11.Typically, a first tissue specimen is obtained with the aperture 17 of the probe 11 in the 12 o-clock position, the second at the 3 o-clock position, the third at the 9 o-clock position and the fourth at the 6 o-clock position.",
"The location of the second and third specimens may be reversed.",
"The position of the aperture 17 may be indicated by a marker arrow 29 at the end cap 27 so that the physician or other operating personnel can readily determine what the orientation of the aperture 17 within the patient.",
"The biopsy system 10 may be hand held for some biopsy procedures or the system may be mounted on a stereotactic mounting stage 80 as shown in FIG.",
"9.A shoe 81 is slidably mounted to a rail 82 of a Fisher stage.",
"The mounting member 83 is secured to the shoe 81 by a threaded post (not shown) secured to thumbwheel 84.As shown in FIG.",
"10, the bottom surface 85 of the driver component 12 is configured to conform at least in part to the upper surface of the mounting member 83.The sampling and vacuum switches 86 and 87 respectively on the driver component 12 are actuated by the optional sampling and vacuum actuating elements 88 and 89 on the mounting member 83.Alternatively, sampling and vacuum may be actuated with a foot pedal.",
"As shown in FIG.",
"10, the driver component has an operator dial 90 which when turned opens a threaded hole 91 for receiving a threaded post (not shown) secured to the thumbwheel 84 and the locating pin holes 92 and 93 which receive the complementary posts (not shown) in the mounting member 83.As mentioned above, positive pressure or even ambient conditions will aid in passing the severed tissue specimen through the inner lumen 45 of tissue cutter 20 into the cartridge 58 of specimen collector 13.As shown in FIGS.",
"4A and 4B venting valve can provide ambient pressure behind the tissue specimen in the cutter interior 45 from the interior of the tubular section 15.The valve body 50 is opened for atmospheric venting when the tissue cutter 20 is in the forward position upon the completion of severing the specimen from the tissue site.",
"However, when the tissue cutter 20 is pulled back proximally the valve spring 49 urges the valve body 50 back to a closed position.",
"While the tissue cutter 20 is shown with a tissue cutting surface 21 which is perpendicular to the longitudinal axis 28, the tissue cutting surface may be at an angle or even parallel to the longitudinal axis as described in co-pending application Ser.",
"No.",
"10/642,406, filed Aug. 15, 2003.The distal cutting edge 21 of the tissue cutter 20 may initially be located proximal to the aperture 17 to provide a full aperture for receiving tissue or it can be initially located within the aperture 17 in order to control the length of the specimen.",
"The cutting action of tissue cutter 20 preferably continues until the beveled cutting surface 21 has completely traversed the aperture 17 to ensure that the tissue drawn through the aperture is completely severed from supporting tissue at the biopsy site.",
"A vacuum may be applied to aspirate the severed tissue specimen through the inner lumen of the tissue cutter 20 to the cartridge in the specimen collector at the proximal end of the biopsy device.",
"Positive pressure or access to ambient conditions may be provided in the distal end of the tubular section to aid in the specimen transfer.",
"After the removable wall 57 of the specimen receiving cartridge 58 is removed and the specimens therein removed, it is frequently desirable to deliver one or more markers to the target site from which the specimens have been removed.",
"Such marker delivery devices are shown in co-pending application Ser.",
"No.",
"10/753,694, filed on Jan. 7, 2004 and co-pending application Ser.",
"No.",
"10/444,770, filed May 23, 2003.However, the distal ends of these marker delivery devices are very small and they can be difficult to insert into the proximal end of the tissue cutter 20 which is just slightly larger to accommodate the marker delivery shaft.",
"FIG.",
"11 illustrates a marker delivery device 100 which is particularly suitable to facilitate the introduction of the distal end of the shaft 101 into the inner lumen 45 of the tissue cutter 20 and the advancement therein.",
"As indicated into the inner lumen 45 of the tissue cutter 20 to eject one or more markers through the aperture 17 in the tubular section 15 before the biopsy device 10 is removed from the patient.",
"As shown in FIG.",
"12, to aid in the insertion of the small diameter distal tip 101 of a marker delivery device 100 into the slightly larger inner lumen 45 of the tubular cutter 20 at its proximal end, the distal tip is preferably provided with an outwardly flared guide 102 which is slidably mounted on the shaft 103 of the marker delivery device 100.The proximal end of the tubular cutter 20, the flared guide 102 and/or the distal tip 101 may be provided with mating guide elements which orient the marker delivery device so that one or more markers are discharged through the aperture 17 when the pusher element slidably disposed within the delivery device is urged distally to press at least one marker body out the discharge opening in the distal portion of the elongated shaft of the marker delivery device.",
"The delivery of markers to the target site after specimen removal, while the distal end of the biopsy device is still at the biopsy site, ensures that the markers are properly position at the biopsy site.",
"While the slidably mounted, flared proximal guide 102 is described with respect to being disposed on the shaft 103 of marker delivery device 101, the flared guide 102 has wide application within a variety of biopsy and other devices where one small diameter tubular member is to be inserted into a slightly larger, but still small diameter second tubular member.",
"The elongated probe component 11 of the biopsy system 10 has a length of about 3 to about 20 cm, preferably, about 5 to about 13 cm, and more specifically, about 8 to about 9 cm for breast biopsy use.",
"To assist in properly locating the probe 11 during advancement thereof into a patient's body, the distal extremity of the tubular section may be provided with a marker at a desirable location that provide enhanced visualization by eye, by ultrasound, by X-ray, MRI or other imaging or visualization means.",
"Manual palpation may also be employed.",
"An echogenic polymer coating that increases contrast resolution in ultrasound imaging devices (such as ECHOCOAT™ by STS Biopolymers, of Henrietta, N.Y.) is suitable for ultrasonic visualization.",
"Radiopaque markers may be made with, for example, stainless steel, platinum, gold, iridium, tantalum, tungsten, silver, rhodium, nickel, bismuth, other radiopaque metals, alloys and oxides of these metals.",
"In addition, the surfaces of the device in contact with tissue or other components of the device may be provided with a suitable lubricious coating such as a hydrophilic material or a fluoropolymer.",
"The tubular section and the tissue cutter are preferably formed of a surgical grade stainless steel.",
"However, other high strength materials such as MP35N, other cobalt-chromium alloys, NiTi alloys, ceramics, glasses, and high strength polymeric materials or combinations thereof may be suitable.",
"A patient's skin usually must be breached in order to gain access to a body site where a tissue specimen is to be obtained.",
"A scalpel or other surgical instrument may be used to make an initial incision in the skin.",
"After the specimens have been taken, the biopsy device may be removed from the patient.",
"The entire device may be removed; however, in some embodiments, the cartridge 58 may be removed from the system 10 and a delivery cannula may be inserted through the inner lumen of the cutter 20 to deliver markers to the biopsy site through the aperture 17.In addition, it will be readily appreciated that other types of instruments may be inserted into the tissue site through the tissue cutter in addition to or in place of the instruments described above.",
"Moreover, therapeutic or diagnostic agents may be delivered through the tissue cutter 20 or the tubular section 15.FIG.",
"14 illustrates a screen 104 providing certain useful information with respect to an operation of the tissue biopsy system, according to one embodiment of the present invention.",
"The screen 104 can be provided by any type of displays, such as liquid crystal displays (LCD's), cathode ray tube (CRT) monitors and plasma displays.",
"The displays can be used in association with a control module that controls electrosurgical instruments, such as the biopsy system in FIG.",
"1.For example, the screen 104 can be provided a CM3000 Display used in association with a CM3000 Control Module by SenoRx, Inc.",
"The screen 104 provides a first textual message 106 showing various states of operation for the biopsy system.",
"For example, the states of operation may include an initialization, calibration, closed, opening, sampling, indexing, indexing error, tool failure, vacuum failure, and tool exit state.",
"These states represent various stages of preparing the biopsy system, taking a tissue specimen from a patient with the biopsy system, and errors occurred during the preparing and taking processes.",
"A second textual message 108 on the screen 104 details the status of the particular state shown by the first textual message 106.For example, on the screen 104, the second textual message 108 tells a user to wait for the completion of an opening state, in which the biopsy system performs an open stroke.",
"At the bottom of the screen 104 are indicators 110 for indicating certain events or conditions.",
"For example, when the indicator 110 that labeled as VAC is on, it tells that a vacuum system is currently running.",
"The screen 104 further provides a graphical user interface 112 that represents various parts of a target site within a patient from which one or more tissue specimens have been taken or may be taken.",
"The graphical user interface 112 may further represent an angular position of the tissue cutting member 20 shown in FIG.",
"2.Since the tissue cutting member 20 positions its cutting tip in a target site of a patient's body in a rotational movement, the graphical user interface 112 is designed based on a circular shape.",
"However, it is noteworthy that other shapes capable of representing the angular positions of the tissue cutting member 20 can also be used as the basic shapes for the graphical user interface 112.For example, the graphical user interface 112 may be designed based on a polygonal shape.",
"Various designs for the graphical user interface 112 will be described in the following paragraphs.",
"FIGS.",
"15A through 15E illustrate various alternatives of the graphical user interface 112 in FIG.",
"14, according to one embodiment of the present invention.",
"In this embodiment, the graphical user interface 112 includes a first GUI area representing a first region of a target site from which at least one tissue specimen has been separated from tissue at the target site by the tissue cutting member.",
"The graphical user interface 112 further includes a second GUI area, visually distinguishable from the first GUI area, representing a second region from which the tissue cutting member may separate one or more additional tissue specimens from tissue at the target site.",
"The first and second GUI areas are marked with colors or patterns distinguishable from one another.",
"They visualize the part of the tissue at the target site that has been cut, and the rest of the tissue that may be cut by the biopsy system.",
"This helps a surgeon to better understand the progress of a biopsy operation.",
"FIG.",
"15A shows a first alternative of a graphical user interface 114 according to the embodiment.",
"The first GUI area 116 and second GUI area 118 are arranged within a circle.",
"The first GUI area 116 is of a fan shape, and the circle unoccupied by the first GUI area 116 represents the second GUI area 118.In this figure, a smaller angular portion of the tissue at the target site has been cut, while a larger angular portion of the tissue may be cut in a later process of operation.",
"FIG.",
"15B shows a second alternative of a graphical user interface 120 according to the embodiment.",
"The shaded part represents the first GUI area 122, and the unshaded part represents the second GUI area 124.The first GUI area 122 includes a first portion 126 of a fan shape at the centric point of the circular shaped graphical user interface 120.The arm of the first portion 126 is smaller than the radius of the graphical user interface 120.The first GUI area 122 further includes a second portion 128 that is shaped as a curvy band in alignment with an arc of the first portion 126.The angle of first portion 126 represents the angular portion of the tissue that has been cut.",
"FIG.",
"15C shows a third alternative of a graphical user interface 130 according to the embodiment.",
"The shaded part represents the first GUI area 132, and the unshaded part represents the second GUI area 134.The first GUI area includes a first portion 136 of a circular shape, and a second portion 138 shaped as a curvy band adjacent to a circumferential line of the first portion 136.The two side lines of the second portion 138 define an angle that represents the angular portion of the tissue that has been cut.",
"FIG.",
"15D shows a fourth alternative of a graphical user interface 140 according to the embodiment.",
"The shaded part represents the first GUI area 142, and the unshaded part represents the second GUI area 144.The first GUI area 142 includes a first portion 145 of a circular shape, a second portion 146 shaped as a curvy band adjacent to a circumferential line of the first portion, and a third portion 147 shaped as a curvy band in alignment with an outer peripheral line of the second portion 146.The side lines of the second portion 146 or the third portion 147 define an angle that represents the angular portion of the tissue that has been cut.",
"FIG.",
"15E shows a fifth alternative of a graphical user interface 150 according to the embodiment.",
"The shaded part represents the first GUI area 152, and the unshaded part represents the second GUI area 154.The first GUI area includes a first portion 155 of a circular shape, a second portion 156 of a ring shape surrounding the first portion 155, and a third portion 157 shaped as a curvy band adjacent to a circumferential line of the second portion 156.The side lines of the third portion 157 define an angle representing the angular portion of the tissue that has been cut.",
"FIGS.",
"16A through 16E show another set of alternatives of the graphical user interface 112 in FIG.",
"14 according to the embodiment of the present invention.",
"FIG.",
"16A shows a first alternative of a graphical user interface 160.The first GUI area 162 and second GUI area 164 are arranged within a regular polygon.",
"The first GUI area 162 is a divisional portion of the regular polygon with an angle defined at a geometrical center thereof.",
"The reset of the regular polygon unoccupied by the first GUI area 162 represents the second GUI area 164.As discussed above, the first GUI area 162 represents an angular portion of the tissue at the target site that has been cut, while the second GUI area 164 represent the portion of the tissue that may be cut in a later operation process.",
"FIG.",
"16B shows a second alternative of a graphical user interface 170 according to the embodiment.",
"The shaded part represents the first GUI area 172, and the unshaded part represents the second GUI area 174.The first GUI area 172 includes a first portion 176 of a polygonal shape with an angle defined at a geometrical center of the regular polygon 179.The first GUI area 174 further includes a second portion 178 shaped as a polygonal band along a peripheral line of the regular polygon 179, in alignment with the first portion 176.The angle of first portion 176 represents the angular portion of the tissue that has been cut.",
"FIG.",
"16C shows a third alternative of a graphical user interface 180 according to the embodiment.",
"The shaded part represents the first GUI area 182, and the unshaded part represents the second GUI area 184.The first GUI area 182 includes a first portion 186 of a polygonal shape having a geometrical center the same as that of the regular polygon 189.The first GUI area 180 further includes a second portion 188 shaped as a polygonal band along a peripheral line of the regular polygon 189, adjacent to an outer peripheral line of the first portion 186.The two side lines of the second portion 188 define an angle representing the angular portion of the tissue that has been cut.",
"FIG.",
"16D shows a fourth alternative of a graphical user interface 190 according to the embodiment.",
"The shaded part represents the first GUI area 192, and the unshaded part represents the second GUI area 194.The first GUI area 192 includes a first portion 195, second portion 196 and third portion 197.The first portion 195 is of a polygonal shape having a geometrical center the same as that of the regular polygon 198.The second portion 196 is shaped as a polygonal band adjacent to an outer peripheral line of the first portion 195.The third portion 197 is shaped as a polygonal band along a peripheral line of the regular polygon 198, in alignment with an outer peripheral line of the second portion 196.The two side lines of the second portion 196 or the third portion 197 define an angle representing the angular portion of the tissue that has been cut.",
"FIG.",
"16E shows a fifth alternative of a graphical user interface 200 according to the embodiment.",
"The shaded part represents the first GUI area 202, and the unshaded part represents the second GUI area 204.The first GUI area 202 includes a first portion 205, second portion 206 and third portion 207.The first portion 205 is of a polygonal shape having a geometrical center the same as that of the regular polygon 208.The second portion 206 is shaped as a polygonal ring surrounding the first portion 205.The third portion 207 is shaped as a polygonal band along a peripheral line of the regular polygon 208, adjacent to an outer peripheral line of the second portion 206.The two side lines of the third portion 207 define an angle representing the angular portion of the tissue that has been cut.",
"In the above embodiment, while none of the various graphical user interfaces shows a current angular position of the tissue cutting member, it can be known by an external indicator 29 shown in FIG.",
"8.FIGS.",
"17A through 17E illustrate various alternatives of the graphical user interface 112 in FIG.",
"14, according to another embodiment of the present invention.",
"In this embodiment, the graphical user interface 112 includes a first, second and third GUI areas.",
"The first GUI area represents a first region of a target site from which at least one tissue specimen has been separated from tissue at the target site by the tissue cutting member.",
"The second GUI area, visually distinguishable from the first GUI area, represents a second region from which the tissue cutting member may separate one or more additional tissue specimens from tissue at the target site.",
"The third GUI area, visually distinguishable from the first and second GUI areas, represents a third region in which the tissue cutting member is deployed to separate a tissue specimen from tissue at the target site.",
"The first, second and third GUI areas are marked with colors or patterns distinguishable from each other.",
"They visualize the part of the tissue at the target site that has been cut, the rest of the tissue that may be cut, and the angular position where the cutting member is at.",
"This helps a surgeon to better understand the progress of a biopsy operation.",
"FIG.",
"17A shows a first alternative of a graphical user interface 210 according to the embodiment.",
"The first GUI area 202, second GUI area 204 and third GUI area 206 are arranged within a circle 208.The first GUI area 202 and the third GUI area 206 are of a fan shape.",
"The circle unoccupied by the first GUI area 202 and third GUI area 206 represent the second GUI area 118.FIG.",
"17B shows a second alternative of a graphical user interface 220 according to the embodiment.",
"The graphical user interfere face 220 differs from that in FIG.",
"15B in having a third GUI area 222, which includes a first portion 223 and second portion 224.The first portion 223 of the third GUI area 222 is of a fan shape concentric with a first portion 225 of the first GUI area 226.The second portion 224 of the third GUI area 222 is shaped as a curvy band in alignment with an arc of the first portion 223 of the third GUI area 222.FIG.",
"17C shows a third alternative of a graphical user interface 230 according to the embodiment.",
"The graphical user interfere face 230 differs from that in FIG.",
"15C in having a third GUI area 232, which is shaped as a curvy band adjacent to the circumferential line of a first portion 234 of the first GUI area 236.FIG.",
"17D shows a fourth alternative of a graphical user interface 240 according to the embodiment.",
"The graphical user interfere face 240 differs from that in FIG.",
"15D in having a third GUI area 242, which includes a first portion 243 and second portion 244.The first portion 243 of the third GUI area 242 is shaped as a curvy band adjacent to the circumferential line of a first portion 245 of the first GUI area 246.The second portion 244 of the third GUI area 242 is also shaped as a curvy band in alignment with an outer peripheral line of the second portion 242.FIG.",
"17E shows a fifth alternative of a graphical user interface 250 according to the embodiment.",
"The graphical user interfere face 250 differs from that in FIG.",
"15E in having a third GUI area 252, which is shaped as a curvy band adjacent to the circumferential line of a ring 254 of the first GUI area 256.FIGS.",
"18A through 18E show another set of alternatives of the graphical user interface 112 in FIG.",
"14 according to the embodiment of the present invention.",
"FIG.",
"18A shows a first alternative of a graphical user interface 260.The graphical user interface 260 differs from that in FIG.",
"16A in having a third GUI area 262, which is a divisional portion of the regular polygon 264 with an angle defined at a geometrical center the regular polygon 265.FIG.",
"18B shows a second alternative of a graphical user interface 270.The graphical user interface 270 differs from that in FIG.",
"16B in having a third GUI area 272, which includes a first portion 273 and a second portion 274.The first portion 273 of the third GUI area 272 is of a polygonal shape with an angle defined at the geometrical center of the regular polygon 275.The second portion 274 of the third GUI area 272 is shaped as a polygonal band along the peripheral line of the regular polygon 275, in alignment with an outer peripheral line of the first portion 273.FIG.",
"18C shows a third alternative of a graphical user interface 280.The graphical user interface 280 differs from that in FIG.",
"16C in having a third GUI area 282, which is shaped as a polygonal band along a peripheral line of the regular polygon 284.FIG.",
"18D shows a fourth alternative of a graphical user interface 290.The graphical user interface 290 differs from that in FIG.",
"16D in having a third GUI area 292, which includes a first portion 293 and a second portion 294.The first portion 293 of the third GUI area 292 is shaped as a polygonal band adjacent to an outer peripheral line of an inner polygon 296.The second portion 294 of the third GUI area 292 is shaped as a polygonal band along the peripheral line of the regular polygon 295, adjacent to an outer peripheral line of the first portion 293.FIG.",
"18E shows a fifth alternative of a graphical user interface 300.The graphical user interface 300 differs from that in FIG.",
"16E in having a third GUI area 302, which is shaped as a polygonal band along a peripheral line of the regular polygon 304, adjacent to a polygonal ring 306.As discussed above, the first, second and third GUI areas visualize the part of the tissue at the target site that has been cut, the rest of the tissue that may be cut, and the current angular position where the tissue cutting member is at.",
"This helps a surgeon to better understand the progress of a biopsy operation.",
"While particular forms of the invention have been illustrated and described herein, it will be apparent that various modifications and improvements can be made to the invention.",
"For example, while the various embodiments of the invention have been described herein in terms of a biopsy device, it should be apparent that the devices and methods of utilizing the device may be employed to remove tissue for purposes other than for biopsy, i.e.",
"for treatment or other diagnoses.",
"Other modifications include, for example, a tissue cutter slidably mounted around the tubular section of the probe component rather than within the tubular section.",
"Moreover, individual features of embodiments of the invention may be shown in some drawings and not in others, but those skilled in the art will recognize that individual features of one embodiment of the invention can be combined with any or all the features of another embodiment.",
"Accordingly, it is not intended that the invention be limited to the specific embodiments illustrated.",
"It is therefore intended that this invention to be defined by the scope of the appended claims as broadly as the prior art will permit.",
"Terms such a “element”, “member”, “device”, “section”, “portion”, “component”, “means”, “step” and words of similar import, when used herein, shall not be construed as invoking the provisions of 35 U.S.C.",
"§ 112(6) unless the following claims expressly use the term “means” followed by a particular function without specific structure or the term “step” followed by a particular function without specific action.",
"All patents and patent applications referred to above are hereby incorporated by reference in their entirety."
]
] |
Patent_15871441
|
[
[
"MODULAR ARRAY OF VERTICALLY INTEGRATED SUPERCONDUCTING QUBIT DEVICES FOR SCALABLE QUANTUM COMPUTING",
"A technique relates to an assembly for a quantum computing device.",
"A quantum bus plane includes a first set of recesses.",
"A readout plane includes a second set of recesses.",
"A block is positioned to hold the readout plane opposite the quantum bus plane, such that the first set of recesses opposes the second set of recesses.",
"A plurality of qubit chips are included where each has a first end positioned in the first set of recesses and has a second end positioned in the second set of recesses."
],
[
"1.A quantum device, comprising: a first structure including a first set of couplings; a second structure including a second set of couplings; and at least one qubit chip coupled to the first set of couplings and the second set of couplings.",
"2.The quantum device of claim 1, wherein the first structure comprises a circuit.",
"3.The quantum device of claim 2, wherein the circuit is configured to couple at least two qubit chips.",
"4.The quantum device of claim 2, wherein the circuit comprises at least one coupling resonator.",
"5.The quantum device of claim 1, wherein the second structure comprises a circuit.",
"6.The quantum device of claim 5, wherein the circuit comprises transmission lines configured to couple to qubit chips.",
"7.The quantum device of claim 6, wherein the transmission lines are configured to couple the qubits chips to connectors.",
"8.The quantum device of claim 1, wherein the at least one qubit chip is positioned to the first and second structures for communication.",
"9.The quantum device of claim 1, wherein the at least one qubit chip comprises a superconducting qubit.",
"10.The quantum device of claim 1, wherein the at least one qubit chip comprises a readout resonator.",
"11.A quantum device, comprising: a quantum bus plane including a first set of couplings; a readout plane including a second set of couplings; and qubit chips positioned to the first set of couplings and positioned to the second set of couplings.",
"12.The quantum device of claim 11, wherein the qubit chips extend to the quantum bus plane and the readout plane.",
"13.The quantum device of claim 11, wherein the first set of couplings is configured to receive the qubit chips in the readout plane; and wherein the second set of couplings is configured to receive the qubit chips in the quantum bus plane.",
"14.The quantum device of claim 11, wherein the quantum bus plane comprises a substrate with interconnect wiring, the interconnect wiring connecting the qubit chips via coupling bus resonators.",
"15.The quantum device of claim 11, wherein the readout plane comprises a substrate with fan-out wiring, the fan-out wiring individually connecting each of the qubit chips to a circuit board.",
"16.The quantum device of claim 15, wherein the circuit board individually connects each of the qubit chips to connectors in a one-to-one relationship.",
"17.A quantum device comprising: a first coupling; a second coupling; and a qubit chip coupled to the first coupling and the second coupling, the qubit chip comprising a superconducting qubit and a readout resonator.",
"18.The quantum device of claim 17, wherein the first coupling is formed on a first structure comprising a first circuit.",
"19.The quantum device of claim 18, wherein the second coupling is formed on a second structure comprising a second circuit.",
"20.The quantum device of claim 19, wherein the first structure opposes the second structure so as to position the qubit chip."
],
[
"<SOH> BACKGROUND <EOH>The present invention relates to quantum computing, and more specifically, to a modular array of vertically integrated superconducting qubit devices for scalable quantum computing.",
"In one approach called circuit quantum electrodynamics, quantum computing employs active superconducting devices called qubits to manipulate and store quantum information, and resonators (e.g., as a two-dimensional (2D) planar waveguide or as a three-dimensional (3D) microwave cavity) to read out and facilitate interaction among qubits.",
"Each superconducting qubit comprises one or more Josephson junctions shunted by capacitors in parallel with the junctions.",
"The qubits are capacitively coupled to 2D or 3D microwave cavities.",
"The energy associated with the qubit resides in the electromagnetic fields around the Josephson junction and especially in the vicinity of relatively larger shunt capacitance structures.",
"To date, a major focus has been on improving lifetimes of the qubits in order to allow calculations (i.e., manipulation and readout) to take place before the information is lost to decoherence of the qubits.",
"Currently, superconducting qubit coherence times can be as high as 100 microseconds, and efforts are being made to increase the coherence times.",
"One area of research with respect to increasing coherence times is focused on eliminating lossy materials from areas of relatively high electromagnetic field energy density such as in the vicinity of sharp corners and edges of the thin films of which the qubits are comprised.",
"Such materials in proximity to the qubit can include imperfections that support defects known as two-level systems (TLSs)."
],
[
"<SOH> SUMMARY <EOH>According to one embodiment, an assembly for a quantum computing device is provided.",
"The assembly includes a quantum bus plane including a first set of recesses, a readout plane including a second set of recesses, and a block positioned to hold the readout plane opposite the quantum bus plane, such that the first set of recesses opposes the second set of recesses.",
"Also, the assembly includes a plurality of qubit chips where each has a first end positioned in the first set of recesses and has a second end positioned in the second set of recesses.",
"According to one embodiment, an assembly for a quantum computing device is provided.",
"The assembly includes a housing configured as an enclosure having a bottom part, a top part, and a block, in which the block connects the top and bottom parts.",
"The assembly includes a quantum bus plane including a first set of recesses, and a readout plane including a second set of recesses.",
"The block is configured to position the readout plane opposite the quantum bus plane, such that the first set of recesses opposes the second set of recesses.",
"Also, the assembly includes a plurality of qubit chips where each has a first end positioned in the first set of recesses and has a second end positioned in the second set of recesses.",
"According to one embodiment, a method of configuring an assembly for a quantum computing device is provided.",
"The method includes providing a housing configured as an enclosure having a bottom part, a top part, and a block, in which the block connects the top and bottom parts.",
"The method includes providing a readout plane having a first set of recesses and a quantum bus plane having a second set of recesses, and assembling the readout plane opposite the quantum bus plane in a block, such that the first set of recesses opposes the second set of recesses.",
"Also, the method includes installing a plurality of qubit chips in the block, where each of the plurality of qubit chips has a first end positioned in the first set of recesses and has a second end positioned in the second set of recesses.",
"In one or more embodiments, the plurality of qubit chips extends vertically in a lengthwise direction by being positioned in both the first set of recesses and the second set of recesses.",
"The first set of recesses holds the first end of the plurality of qubit chips in the readout plane, and the second set of recesses holds the second end of the plurality of qubit chips in the quantum bus plane.",
"In one or more embodiments, the first end of the plurality of qubit chips is opposite the second end.",
"In one or more embodiments, the block is made of a superconducting material.",
"In one or more embodiments, the quantum bus plane comprises a substrate with interconnect wiring on top of the substrate, and the interconnect wiring connects the plurality of qubit chips via a plurality of coupling bus resonators.",
"In one or more embodiments, the readout plane comprises a substrate with fan-out wiring on top of the substrate, and the fan-out wiring individually connects each of the plurality of qubit chips to a circuit board.",
"The circuit board individually connects each of the plurality of qubit chips to a plurality of connectors in a one-to-one relationship.",
"In one or more embodiments, the block is configured to receive a first assembly comb and a second assembly comb to form an intersection, and the intersection of the first and second assembly combs forms a plurality of slots for individually accepting the plurality of qubit chips.",
"The plurality of slots mechanically holds the plurality of qubit chips in a vertical position.",
"Additional features and advantages are realized through the techniques of the present invention.",
"Other embodiments and aspects of the invention are described in detail herein and are considered a part of the claimed invention.",
"For a better understanding of the invention with the advantages and the features, refer to the description and to the drawings."
],
[
"DOMESTIC PRIORITY This application is a continuation application of and claims priority from U.S. patent application Ser.",
"No.",
"15/175,454, filed on Jun.",
"7, 2016, entitled “MODULAR ARRAY OF VERTICALLY INTEGRATED SUPERCONDUCTING QUBIT DEVICES FOR SCALABLE QUANTUM COMPUTING”, which is a divisional application of and claims priority from U.S. patent application Ser.",
"No.",
"14/737,707, filed on Jun.",
"12, 2015, entitled “MODULAR ARRAY OF VERTICALLY INTEGRATED SUPERCONDUCTING QUBIT DEVICES FOR SCALABLE QUANTUM COMPUTING”, the entire contents of which are incorporated herein by reference.",
"BACKGROUND The present invention relates to quantum computing, and more specifically, to a modular array of vertically integrated superconducting qubit devices for scalable quantum computing.",
"In one approach called circuit quantum electrodynamics, quantum computing employs active superconducting devices called qubits to manipulate and store quantum information, and resonators (e.g., as a two-dimensional (2D) planar waveguide or as a three-dimensional (3D) microwave cavity) to read out and facilitate interaction among qubits.",
"Each superconducting qubit comprises one or more Josephson junctions shunted by capacitors in parallel with the junctions.",
"The qubits are capacitively coupled to 2D or 3D microwave cavities.",
"The energy associated with the qubit resides in the electromagnetic fields around the Josephson junction and especially in the vicinity of relatively larger shunt capacitance structures.",
"To date, a major focus has been on improving lifetimes of the qubits in order to allow calculations (i.e., manipulation and readout) to take place before the information is lost to decoherence of the qubits.",
"Currently, superconducting qubit coherence times can be as high as 100 microseconds, and efforts are being made to increase the coherence times.",
"One area of research with respect to increasing coherence times is focused on eliminating lossy materials from areas of relatively high electromagnetic field energy density such as in the vicinity of sharp corners and edges of the thin films of which the qubits are comprised.",
"Such materials in proximity to the qubit can include imperfections that support defects known as two-level systems (TLSs).",
"SUMMARY According to one embodiment, an assembly for a quantum computing device is provided.",
"The assembly includes a quantum bus plane including a first set of recesses, a readout plane including a second set of recesses, and a block positioned to hold the readout plane opposite the quantum bus plane, such that the first set of recesses opposes the second set of recesses.",
"Also, the assembly includes a plurality of qubit chips where each has a first end positioned in the first set of recesses and has a second end positioned in the second set of recesses.",
"According to one embodiment, an assembly for a quantum computing device is provided.",
"The assembly includes a housing configured as an enclosure having a bottom part, a top part, and a block, in which the block connects the top and bottom parts.",
"The assembly includes a quantum bus plane including a first set of recesses, and a readout plane including a second set of recesses.",
"The block is configured to position the readout plane opposite the quantum bus plane, such that the first set of recesses opposes the second set of recesses.",
"Also, the assembly includes a plurality of qubit chips where each has a first end positioned in the first set of recesses and has a second end positioned in the second set of recesses.",
"According to one embodiment, a method of configuring an assembly for a quantum computing device is provided.",
"The method includes providing a housing configured as an enclosure having a bottom part, a top part, and a block, in which the block connects the top and bottom parts.",
"The method includes providing a readout plane having a first set of recesses and a quantum bus plane having a second set of recesses, and assembling the readout plane opposite the quantum bus plane in a block, such that the first set of recesses opposes the second set of recesses.",
"Also, the method includes installing a plurality of qubit chips in the block, where each of the plurality of qubit chips has a first end positioned in the first set of recesses and has a second end positioned in the second set of recesses.",
"In one or more embodiments, the plurality of qubit chips extends vertically in a lengthwise direction by being positioned in both the first set of recesses and the second set of recesses.",
"The first set of recesses holds the first end of the plurality of qubit chips in the readout plane, and the second set of recesses holds the second end of the plurality of qubit chips in the quantum bus plane.",
"In one or more embodiments, the first end of the plurality of qubit chips is opposite the second end.",
"In one or more embodiments, the block is made of a superconducting material.",
"In one or more embodiments, the quantum bus plane comprises a substrate with interconnect wiring on top of the substrate, and the interconnect wiring connects the plurality of qubit chips via a plurality of coupling bus resonators.",
"In one or more embodiments, the readout plane comprises a substrate with fan-out wiring on top of the substrate, and the fan-out wiring individually connects each of the plurality of qubit chips to a circuit board.",
"The circuit board individually connects each of the plurality of qubit chips to a plurality of connectors in a one-to-one relationship.",
"In one or more embodiments, the block is configured to receive a first assembly comb and a second assembly comb to form an intersection, and the intersection of the first and second assembly combs forms a plurality of slots for individually accepting the plurality of qubit chips.",
"The plurality of slots mechanically holds the plurality of qubit chips in a vertical position.",
"Additional features and advantages are realized through the techniques of the present invention.",
"Other embodiments and aspects of the invention are described in detail herein and are considered a part of the claimed invention.",
"For a better understanding of the invention with the advantages and the features, refer to the description and to the drawings.",
"BRIEF DESCRIPTION OF THE DRAWINGS The subject matter which is regarded as the invention is particularly pointed out and distinctly claimed in the claims at the conclusion of the specification.",
"The forgoing and other features, and advantages of the invention are apparent from the following detailed description taken in conjunction with the accompanying drawings in which: FIG.",
"1 is a schematic illustrating a transparent view of part of the modular array of vertically integrated superconducting qubit chips according to an embodiment; FIG.",
"2 is a schematic illustrating a quantum bus plane design according to an embodiment; FIG.",
"3 is a schematic illustrating the readout plane in an inverted view according to an embodiment; FIG.",
"4 is a schematic of an example qubit chip according to an embodiment.",
"FIGS.",
"5A through 5F illustrate an assembly and packaging technique for the modular array of vertically integrated superconducting qubit chips according to an embodiment, in which: FIG.",
"5A is a schematic of an assembly illustrating assembly combs for a block; FIG.",
"5B is a schematic of the assembly illustrating the assembly combs in place to form slots for orienting the superconducting qubit chips; FIG.",
"5C is a schematic of the assembly illustrating the installation of the superconducting qubit chips in the slots formed by the assembly combs; FIG.",
"5D is a schematic of the assembly illustrating installation of the readout plane in the block; FIG.",
"5E is a schematic of the assembly illustrating a view underneath the block; FIG.",
"5F is a schematic of the assembly illustrating that a pusher block applies pressure to hold the superconducting qubit chips in place; FIG.",
"6 is a method of configuring an assembly according to an embodiment; and FIG.",
"7 is a method of configuring an assembly according to an embodiment.",
"DETAILED DESCRIPTION Superconducting Josephson-junction based qubits are promising candidates for fault-tolerant quantum computing.",
"As a solid-state technology, it has always held the potential of simpler scalability via existing integration techniques.",
"Superconducting circuit and device fabrication can leverage well-known lithographic methods which can lead to quantum integrated processors with a high density of qubits.",
"Furthermore, superconducting qubits operate in the microwave frequency regime, allowing for all-electrical control of the qubits and other elements which might be in the system.",
"The other elements may include microwave resonators, active filters, quantum-limited amplifiers, etc.",
"A state-of-the-art fault-tolerant quantum computing architecture which has gathered interest recently is the surface code.",
"In the surface code, qubits are arranged in a lattice with only the nearest neighbor interactions required.",
"For superconducting qubits, the surface code is an attractive path forward as defining multiple qubits in a nearest-neighbor lattice.",
"Moreover, the error thresholds which are required for the surface code are within reach for superconducting qubits with the current levels of coherence.",
"One particular physical proposal in the state-of-the-art for realizing the surface code with superconducting qubits is the skew-symmetric layout.",
"In this lattice, each superconducting qubit is coupled to two separate linking bus resonators.",
"The coupling of superconducting qubits with microwave resonators is known as circuit quantum electrodynamics (cQED).",
"The microwave resonators are typically defined as planar stripline resonators but can also be modes within three-dimensional (3D) waveguide cavities.",
"Although it may appear simple to design a large lattice of many superconducting qubits and stripline resonators lithographically, getting every resonator mode and every qubit to work as desired together is a challenge.",
"For example, crosstalk between resonators and superconducting qubits as well as undesired spurious modes can result in stray couplings between quantum objects.",
"Crosstalk is defined here as any unwanted coupling of microwave signals between qubit or resonator channels, other than those desired and defined by wiring.",
"Furthermore, although it may appear easy to optimize parameters for a single qubit and a single cavity mode, once these individual qubits are re-arranged in a larger network and all defined on the same chip, their (collective) behavior can change and can be difficult to then debug.",
"According to embodiments discussed herein, a vertically integrated multi-chip architecture is provided, with discrete superconducting chip pieces comprised of superconducting qubits and their readout resonators.",
"The superconducting qubits, along with their readout resonators, are then all arranged to mate in a matrix sandwiched by two larger carrier chips.",
"These two larger carrier chips serve two purposes: one purpose is to integrate multiple resonator quantum buses to couple the superconducting qubits together (thereby coupling quantum information between qubits), and the other purpose permits physical connections via fan-out wiring to explicit microwave controls.",
"This embodiment realizes a scalable architecture for quantum computation using well-established technology, while obviating challenging silicon integration techniques, such as thru-silicon-vias (TSVs) and multi-level lithography.",
"There are two physically different methods for implementing superconducting quantum processors via the circuit quantum electrodynamics (cQED) architecture, which are a 2D planar lithographic method and a 3D waveguide cavity method.",
"The quantum processor refers to the entirety of the assembled components.",
"2D Planar Integration: The integration of qubits and resonators for 2D cQED is started via depositing superconducting films on silicon or sapphire substrates.",
"Some typical superconducting films used are niobium (Nb), aluminum (Al), titanium nitride (TiN), and niobium nitride (NbN).",
"Resonators (including readout resonators) are commonly defined in these superconducting films using coplanar waveguides, microstrips, coplanar striplines, or lumped element inductors and capacitors.",
"Subsequently, superconducting qubits with Josephson junctions, such as the transmons, phase-qubits, or flux-qubits are also lithographically patterned via either electron-beam or optical lithography.",
"Scaling up to larger quantum processors in this scheme requires a larger and larger chip to accommodate more resonators for coupling, more qubits, and more readout resonators.",
"Using this 2D integration technique, processors up to 9 qubits have been devised in a linear chain, and 8 qubits in a latticed architecture.",
"As the number of qubits in the 2D processor scales up, input-output (I/O) becomes increasingly challenging.",
"In order to avoid crosstalk and integrate appropriate fan-out, technologies such as 3D integrated flip-chips, air-bridge crossovers, thru-silicon vias, and multi-layer lithography are required.",
"As more and more of these different fabrication processes are required to scale up to larger quantum processors, the potential influence and degradation on the superconducting qubits increases rapidly.",
"Therefore using these advanced fabrication techniques can lead to many different sources of decoherence in the qubits.",
"For some of these processes, it could be necessary to perform them after Josephson junctions are lithographically defined.",
"The impact and losses on Josephson junction based superconducting qubits after these processing steps are then a particular concern as to whether high coherence can continue to be preserved.",
"Accordingly, this makes full-scale integration of a large system having a large number of qubits challenging.",
"Embodiments include various features: 1) An array of vertical superconducting qubit chips is mounted to a silicon quantum bus plane and mounted to a separate qubit addressing and readout plane.",
"2) A quantum bus (QB) plane lithographically is defined on silicon which permits the coupling of quantum information among individual vertical superconducting qubit chips.",
"3) A readout (RO) plane couples each superconducting qubit chip's readout resonator to an integrated microwave bandwidth transmission line which follows onto a flexible circuit board thus connecting each superconducting qubit chip's readout resonator a coaxial connector for input/output (I/O).",
"4) Vertical superconducting qubit chips each contain a single superconducting qubit (also referred to as a tunnel junction, such as a Josephson junction) and on-chip readout resonator, designed in a way to effectively couple to the quantum bus plane and the readout plane.",
"Each individual vertical superconducting qubit chip is designed to have a specific lithographically-defined coupling capacitance between the tunnel junction to the quantum bus plane on one end and between the readout resonator and the addressing transmission line of the readout plane on the other end.",
"5) All silicon elements are retained within a well-thermalized metal housing (e.g., copper) which provides mechanical support, alignment, and thermal contact.",
"According to embodiments, the technique discussed herein is an approach for assembling the modular array of superconducting qubit chips into a scalable quantum processor, commensurate with latticed architectures for quantum error correction, such as the surface code.",
"Now turning to the figures, FIG.",
"1 is a schematic illustrating a transparent view of part of the modular array of vertically integrated superconducting qubit devices according to an embodiment.",
"FIG.",
"1 shows a quantum bus plane 100, a readout plane 102, and superconducting vertical qubit chips 101.The superconducting vertical qubit chips 101 are also referred to as qubit dies, qubits, etc.",
"The readout plane 102 and the quantum bus plane 100 sandwich the qubit chips 101 in between.",
"FIG.",
"2 is a schematic illustrating a quantum bus plane design of the quantum bus plane 100 according to an embodiment.",
"The quantum bus plane design illustrates a surface code example.",
"The quantum bus plane 100 may be made of a semiconductor material as the substrate, such as, e.g., silicon, sapphire, etc.",
"The semiconductor material has interconnect wiring 202 deposited on top of the semiconductor material.",
"The interconnect wiring 202 is made of a superconducting material.",
"Superconducting material may be defined as a material that can conduct electricity or transport electrons from one atom to another with no resistance when the superconducting material has reached “critical temperature” (Tc), or the temperature at which the material becomes superconductive.",
"Conducting electricity or transporting electrons from one atom to another with no resistance means that no heat, sound, or any other form of energy would be released from the material as understood by one skilled in the art.",
"The quantum bus plane 100 connects each individual qubit chip 101 via interconnect wiring 202.The interconnect wiring 202 connects (e.g., capacitively) to each superconducting qubit chip 101 installed in the quantum bus plane 100.The interconnect wiring 202 includes coupling bus resonators 205 positioned between each superconducting vertical qubit chip 101.Particularly, superconducting vertical qubit chips 101 are configured to couple together through the coupling bus resonators 205.To assist with securing and positioning superconducting vertical qubit chips 101 on the quantum bus plane 100, the quantum bus plane 100 includes etched recesses 201 at the locations to insert each of the superconducting vertical qubit chips 101.The etched recesses 201 are pockets that individually fit the superconducting vertical qubit chips 101 into specific locations in the quantum bus plane 100.The etched recesses 201 in the quantum bus plane 100 help to define accurate capacitive coupling between the qubit chips 101 and the interconnect wiring 202.The etched recesses 201 determine how deeply the vertical qubit chips 101 sit into the quantum buss plane 100 and thus determine the vertical separation between the capacitor pads on the qubit chip 101 and those on the quantum buss plane 100.The etched recesses 201 are etched into the semiconductor substrate of the quantum bus plane 100.Accurate vertical separation of these coupling pads is a prerequisite for achieving a precise coupling capacitance value.",
"The coupling capacitor pad 404 is shown in FIG.",
"4 and the quantum bus plane 100 has coupling pad 250 in front of each etched recess 201.For the sake of clarity and so as not to obscure FIG.",
"2, only two superconducting vertical qubit chips 101 are shown in FIG.",
"2 although it is understood that each row, e.g., rows 1-4, are filled with superconducting vertical qubit chips 101.One superconducting vertical qubit chip 101 is shown as a code superconducting vertical qubit chip in row 1, and the other superconducting vertical qubit chip 101 is a syndrome superconducting vertical qubit chip in row 2.In one implementation, each row may be filled with the same type of superconducting vertical qubit chip 101.For example, row 1 may be filled with code superconducting vertical qubit chips 101, while row 2 is filled with syndrome superconducting vertical qubit chips 101.Row 3 may be filled with code superconducting vertical qubit chips 101, while row 4 is filled with syndrome superconducting vertical qubit chips 101.Although only 4 rows are shown for the sake of illustration, it is contemplated that M numerous rows may be included on the quantum bus plane 100, where M is the last row.",
"A code qubit stores quantum information for operation of the quantum processor.",
"A syndrome qubit measures and extracts any errors in the system without corrupting the information present in the code qubit.",
"These terms are commonly applied when discussing “surface code error correction.” According to an embodiment, FIG.",
"3 is a schematic illustrating the readout plane 102 in an inverted view.",
"FIG.",
"3 shows the backside of the readout plane 102, and the backside faces the quantum bus plane 100 (not shown in FIG.",
"3).",
"The readout plane 102 may be made of a semiconductor material as the substrate, such as, e.g., silicon, sapphire, etc.",
"The semiconductor material has fan-out wiring 302 deposited on top of the semiconductor material.",
"The fan-out wiring 302 may be made of a superconducting material.",
"The readout plane 102 includes etched recesses 301 at locations to insert each of the superconducting vertical qubit chips 101.Each etched recess 301 is a pocket that individually fits a single superconducting vertical qubit chip 101 into a specific location in the readout plane 102, analogous to the etched recesses 201 in the quantum bus plane 100 in FIG.",
"2.The etched recesses 301 in the readout plane 102 capacitively connect the superconducting vertical qubit chips 101 to the fan-out wiring 302 via the capacitor pads defined on the upper end of the vertical qubit chip 101 and on the readout plane 102.At the upper end, the vertical qubit chip 101 has coupling capacitor pad 401 as shown in FIG.",
"4, while the readout plane 102 has a coupling pad 350 in front of each etched recesses 301.The fan-out wiring 302 has transmission lines 320.Each transmission line 320 individually connects to a single superconducting vertical qubit chip 101 in a one-to-one relationship.",
"The etched recesses 301 serve both a mechanical purpose and an electrical purpose.",
"Mechanically, the etched recesses 301 serve as a slot/pocket to insert each superconducting vertical qubit chip 101.Electrically, the etched recesses 301 align each superconducting vertical qubit chip 101 to an individual transmission line 320 of the fan-out wiring 302.The fan-out wiring 302 individually couples to each superconducting vertical qubit chip 101.Also, the fan-out wiring 302 individually connects each superconducting vertical qubit chip 101 to a flexible circuit board 303.The fan-out wiring 302 does not affect quantum information on the superconducting vertical qubit chips 101.The fan-out wiring 302 connects the superconducting vertical qubit chips 101 to the outside environment (e.g., the 50 ohm (Ω) environment).",
"The flexible circuit board 303 individually connects each superconducting vertical qubit chip 101 to an individual connector 304 via the fan-out wiring 302.Although the flexible circuit board 303 is shown as one implementation, it is contemplated that other type of circuit boards or electrical connections may be utilized.",
"The connectors 304 individually connect the superconducting vertical qubit chips 101 to external electronics (not shown).",
"The connectors 304 may be microwave connectors in which microwave signals may be input and qubit states can be read.",
"Each connector 304 has a one-to-one relationship to a single superconducting vertical qubit chip 101 on the readout plane 102, such that each superconducting vertical qubit chip 101 is individually addressable through a single connector 304, through the flexible circuit board 303, through the fan-out wiring 302, a particular transmission line 320, and through an individual etched recess 301.In one implementation, the connectors 304 may coaxial cable connectors configured to connect to coaxial cables.",
"Although not shown so as not to obscure FIG.",
"3, it is understood that conductive wiring runs through the flexible circuit board 303 and that wiring connects the flexible circuit board 303 to each respective connector 304 as understood by one skilled in the art.",
"The conductive wiring of the flexible circuit board 303 may be made of superconducting or normal material.",
"FIG.",
"4 is a schematic of an example superconducting vertical qubit chip 101 according to an embodiment.",
"Various details of the superconducting vertical qubit chips 101 are shown in FIG.",
"4.The superconducting vertical qubit chips 101 may have a substrate made of a semiconductor material, such as, e.g., silicon, sapphire, etc.",
"Each qubit chip 101 is an integrated circuit.",
"Conductive material is deposited and patterned on the substrate of the superconducting vertical qubit chips 101 to form the integrated circuit.",
"The superconducting vertical qubit chips 101 are not a monolithic wafer.",
"Rather, the superconducting vertical qubit chips 101 are formed from a wafer (substrate) diced into individual qubit dies.",
"Each diced superconducting vertical qubit chip 101 includes a coupling capacitor pad 401.The coupling capacitor pad 401 is a capacitor that capacitively couples each superconducting vertical qubit chip 101 to the readout plane 102 via the fan-out wiring 302, when the superconducting vertical qubit chip 101 is inserted in its etched recess 201.Accordingly, on one end of the superconducting vertical qubit chip 101, that end is electrically connected to the readout plane 102 through the coupling capacitor pad 401 and coupling pad 350 on the readout plane 102.It is noted that, for coupling capacitor pads 401 and 350 and coupling capacitor pads 404 and 250, the coupling capacitors may be defined by metal pads that are at right angles to each other, with a well-defined vertical separation.",
"The two types of coupling capacitors are quantum buss plane to lower side of qubit chip, and upper side of vertical qubit chip to readout plane.",
"It should be understood that two metal surfaces (pads in this case) at right angles to each other, separated by some distance, define a capacitor.",
"Embodiments exploit this fact to permit accurate coupling between circuit elements without resorting to wire bonds across right angle connections.",
"Additionally, each superconducting vertical qubit chip 101 includes coupling capacitor pads 404.The coupling capacitor pads 404 form a capacitor, and between the two coupling capacitor pads 404 is a tunnel junction 403 (sometimes called the qubit), such as, e.g., a Josephson junction.",
"The coupling capacitor pads 404 form a capacitor that capacitively couples to the quantum bus plane 100 via the interconnecting wiring 202.Accordingly, on the opposite end to the coupling capacitor pad 401, the opposite end is electrically connected to the quantum bus plane 100 through the coupling capacitor pads 404.The superconducting vertical qubit chip 101 includes readout resonator 402.The readout resonator 402 is configured with a resonance frequency designed to read the state of the qubit tunnel junction 403.The readout resonator 402 is positioned between the coupling capacitor pad 401 and the coupling capacitor pads 404.The readout resonator 402 is formed of conductive material that connects the coupling capacitor pad 401 and the coupling capacitor pads 404.The conductive material is a superconducting material, which forms the circuit.",
"The superconducting vertical qubit chip 101 includes a ground plane 405 surrounding the circuit of the coupling capacitor pad 401, the coupling capacitor pads 404, and the readout resonator 402.The material of the substrate separates the ground plane 405 from the circuit.",
"According to an embodiment, an assembly and packaging technique for the modular array of vertically integrated superconducting qubit chips 101 is discussed below in FIGS.",
"5A, 5B, 5C, 5D, 5E, and 5F.",
"FIG.",
"5A illustrates part of an assembly 500.The assembly 500 has a copper block 502.The copper block 502 includes a readout plane slot 503.The readout plane 102 is to be inserted into the readout plane slot 503 as discussed further below.",
"Although a copper block 502 is illustrated, the block 502 may be made of other materials.",
"The block 502 can be constructed of a variety of materials provided they give high thermal conductivity.",
"Examples other than copper include brass, sapphire, silicon, silver, aluminum, and/or niobium.",
"Assembly combs 520A and 520B are utilized to orient alignment of the superconducting vertical qubit chips 101 for assembly with the readout plane 102 (in the etched recesses 201) and quantum bus plane 100 (in the etched recesses 301) within the copper block 502.Both assembly combs 520A and 520B have teeth with predefined spacing.",
"For example, the assembly comb 520A has teeth 525A and the assembly comb 520B has teeth 525B.",
"In one implementation, the spacing of the teeth 525A is larger than the spacing of the teeth 525B, and the spacing of the teeth 525A and 525B is based on accommodating the cross-section size of the superconducting vertical qubit chips 101.The copper block 502 includes assembly slots 501A and 501B.",
"The assembly comb 520A is inserted into the assembly slot 501A, and the assembly comb 520B is inserted into the assembly slot 501B.",
"One assembly slot is positioned higher than the other assembly slot such that the assembly combs 520A and 520B define the desired alignment slots where they cross over and under each other but do not interfere with each other when inserted into their respective assembly slots 501A and 501B.",
"FIG.",
"5B is a schematic of the assembly 500 showing the assembly combs 520A and 520B in place within the copper block 502 according to an embodiment.",
"Slots 525 are formed by the intersection of the assembly combs 520A and 520B while in the copper block 502.The slots 525 are utilized to orient the superconducting vertical qubit chip 101.In particular, the slots 525 are formed by the spacing of the teeth 525A and 525B such that the slots 525 can accommodate the size of the superconducting vertical qubit chips 101.In one implementation, the spacing of the slots 525 may be about 5 millimeters (mm) in the x-axis and may be about 5 mm in the y-axis.",
"In one implementation, each superconducting vertical qubit chip 101 may have approximate dimensions of 8 mm tall by 2 mm wide by 0.7 mm thick.",
"Also, to accommodate the size of the superconducting vertical qubit chips 101, the etched recesses 201 and 301 may be about 0.7 mm in the x-axis and about 2 mm in the y-axis.",
"The etched recessed 201 and 301 may have a depth of about 0.35 mm in the z-axis.",
"FIG.",
"5C is a schematic of the assembly 500 showing an abbreviated view inside the copper block 502 (not shown) which is part of a housing 550 (shown in FIG.",
"5F) according to an embodiment.",
"In FIG.",
"5C, the abbreviated view omits certain elements in order to simplify the assembly 500 for better understanding.",
"The walls of the housing copper block 502 are removed, and only a copper base 530 of the housing 550 is shown.",
"The quantum bus plane 100 is attached to and/or positioned on the copper base 530.The intersecting assembly combs 520A and 520B are in place (within the copper block 502) forming the slots 525.Aligned through the slots 525, a few example superconducting vertical qubit chips 101 are installed into (the etched recesses 201 in) the quantum bus plane 100.The slots 525 directly align to individual etched recesses 201 below and provide a guide during installation of the superconducting vertical qubit chips 101.FIG.",
"5D is a schematic of the assembly 500 showing a transparent view into the copper block 502 according to an embodiment.",
"FIG.",
"5D shows the readout plane 102 installed into the copper block 502 and extending outside of the copper block 502 through readout plane housing slot 585.In one implementation, the quantum bus plane 100 fits into the bottom of the copper block 502.In another implementation, the copper block 502 may sit on top of the quantum bus plane 100.The superconducting vertical qubit chips 101 are sandwiched between the readout plane 102 and the quantum bus plane 100, and the ends of the superconducting vertical qubit chips 101 fit into the etched recesses 201 and 301 of the quantum bus plane 100 and readout plane 102, respectively.",
"For simplicity and ease of understanding, only a few superconducting vertical qubit chips 101 are shown in FIG.",
"5D.",
"Also, so as not to obscure FIG.",
"5D, the assembly combs 520A and 520B are not shown in this figure.",
"A board clamp 555 holds and attaches to portion of the readout plane 102 extending outside of the housing.",
"The board clamp 555 holds and attaches the readout plane 102 to the flexible circuit board 303.Outside of the housing 550, the connectors 304 are on a rigid circuit board 330 and connected to the flexible circuit board 303.The circuit board 330 comprises circuits (not shown) individually connecting each connector 304 to an individual circuit within the flexible circuit board 303, as understood by one skilled in the art.",
"FIG.",
"5E is a schematic of the assembly 500 showing a view underneath the housing 500 according to an embodiment.",
"The copper base 530 of the housing is removed.",
"FIG.",
"5E allows the bottom of the quantum bus plane 100 to be viewed.",
"FIG.",
"5E also shows that wire bonds 578 connect the readout plane 102 to the board clamp 555.These wire bonds 578 create an electrical connection between the fan-out wiring 302 on the readout plane 102 and the conductors (of whatever type) on the flexible circuit board 303.Although it possible to mechanically bond the flexible circuit board 303 directly to the silicon readout plane 102, those two items, however, have extremely different thermal expansion coefficients which may cause the connections to break over time.",
"Wire bonds 578 being flexible permit long-term reliability over many thermal cycles.",
"In one implementation, the two readout planes are to be made of the same material so any dimensional changes from thermal expansion are the same for both planes.",
"FIG.",
"5F is a schematic of the assembly 500 according to an embodiment.",
"FIG.",
"5F shows that a pusher block 570 pushes the readout plane 102 firmly against the superconducting vertical qubit chips 101.The pusher block 570 is spring loaded.",
"The constant pressure of the pusher block 570 ensures that the superconducting vertical qubit chips 101 stay in the etched recesses 201 and 301.The force of the pusher block 570 is caused by a spring mechanism 575 attached to a top cap 582 of the housing 550.As can be seen in FIG.",
"5F, the housing 550 is an enclosure.",
"The housing 550 may be made of copper, silver, brass, silicon, sapphire, aluminum, and/or niobium.",
"The housing 550 includes the copper block 502, the copper base 530, the pusher block 570, and the top cap 582.In one implementation, the assembly combs 520A and 520B may remain in the copper block 502 after the superconducting vertical qubit chips 101 have been installed (i.e., inserted into the etched recesses 201 and 301 of the quantum bus and readout planes 100 and 102, respectively).",
"In another implementation, the assembly combs 520A and 520B may be removed from the copper block 502 after installing the superconducting vertical qubit chips 101, such that the assembly combs 520A and 520B are not in the housing 550.For ease of understanding, sub-headings are provided below.",
"The sub-headings are meant for explanation purposes and not limitation.",
"Standardized Fabrication of Elements: Each of the discussed silicon elements, such as, e.g., the quantum bus plane 100, superconducting vertical qubit chips 101, and readout plane 102, use well-established lithographic technology that is time tested in the superconducting qubit community and thus understood by one skilled in the art.",
"In one embodiment, the materials are standardized to niobium for the resonator and transmission line elements; the materials are aluminum and native aluminum oxide for the qubit junction fabrication (i.e., the qubit tunnel junction 403) via standard double-angle evaporation.",
"All lithography may be performed on high-resistivity silicon wafers with established loss parameters appropriate for qubit technology, as understood by one skilled in the art.",
"The readout resonator 402 is in on the vertical qubit chip 101, and transmission line elements are any other wiring on the quantum buss plane 100, the qubit chip 101, and the readout plane 102.In one implementation, the readout resonators 402 may be of a different material than the wiring.",
"In another implementation, the readout resonators 402 and wiring may be fabricated from a variety of all the same materials.",
"In yet another implementation, the readout resonators 402 and various different portions of the wiring may be fabricated from a variety of different materials for each sub-category of function.",
"Complete assembly of a scalable quantum processor with N qubits (i.e., N qubit chips 101) is achieved without resorting to any multi-level lithography, inserted ground planes, cross-overs, or thru-silicon-vias (TSVs).",
"Using current standard lithographic techniques, embodiments allow the straightforward integration of N=100 to 1000 superconducting vertical qubit chips 101, taking up a space roughly the size of a deck of playing cards (e.g., 2.5×3.5 inches or 64×89 mm).",
"Design of Individual Qubit Chips and Coupling Capacitance Choices: From electromagnetic simulations for reasonable parameters of qubit tunnel junctions 403, readout resonators 402, and quantum bus planes 100, it is possible to achieve the desired precise coupling capacitance values with the geometry described herein.",
"Each individual superconducting vertical qubit chip 101 contains a capacitor (i.e., coupling capacitor 404) that couples signal to the quantum bus traces (i.e., interconnect wiring 202) on the quantum bus plane 100.The capacitor (coupling capacitor 404) provides coupling that is appropriate for a specific universal two-qubit entangling gate.",
"The capacitor is formed by an electrode on the lower end of the vertical qubit chip 101 which couples to electrodes on the quantum buss plane 100.The approximate range in this implementation for the capacitor value is around 7 to 5 femto Farads.",
"The interconnection between the superconducting vertical qubit chip 101 and the etched recesses 201 (pocket) in the quantum bus plane 100 is designed to minimize stray coupling between the qubit signals and ground plane 405.On the other end of the superconducting vertical qubit chip 101, the interconnection with the readout plane 102 creates a specific capacitance between the readout resonator 402 and the control transmission line 320 (of the fan-out wiring 302) such that the readout resonator 402 has a well-defined quality factor and permits a high fidelity readout.",
"This capacitor (i.e., coupling capacitor pad 401) is formed by an electrode on the superconducting vertical qubit chip 101 (qubit die) which couples to an electrode (a portion of the control transmission line 320) on the readout plane 102.The approximate value of this capacitor in this implementation is around 5 to 7 femto Farads, for example.",
"Each superconducting vertical qubit chip 101 is metalized on the backside with superconductor material to control stray coupling and other electric fields within the processor housing 550.The backside of the superconducting vertical qubit chip 101 is opposite the circuit of the coupling capacitor pad 401, the coupling capacitor pads 404, and the readout resonator 402 on the front side.",
"Note that all capacitor values and uncertainty are determined by lithographic feature sizes and depth of etches.",
"These values are easily changed and provide for sufficient accuracy for the circuit tolerances required for embodiments.",
"Design of Quantum Bus Plane: The fabrication process of the quantum bus plane 100 can begin with standard 2D integration techniques.",
"In one implementation, niobium is electro-sputtered onto a silicon substrate 590.Multiple masks, having the quantum bus designs and having the etched recesses 201 (pockets) where qubit chips 101 are to be mounted, may be used for reactive ion etching (RIE) of the niobium.",
"The quantum bus design mask defines the coupling bus resonators 205 which couple quantum information among the superconducting vertical qubit chips 101.The pocket mask (for making the etched recesses 201) defines the locations to etch down into the silicon for the individual superconducting vertical qubit chips 101 to be mounted.",
"The process for the pocket mask etch may be similar to most 3D integration schemes, except in this case the sputtered niobium is used as a hardmask to first define the pockets (i.e., etched recesses 201).",
"Definition of the pocket (i.e., etched recess 201) in the silicon substrate 590 can be achieved using a deep silicon dry etch process, reactive ion etching (RIE), or a wet chemistry (tetramethyl ammonium hydroxide (TMAH)).",
"The pockets (i.e., etched recesses 201) of the quantum bus plane 100 are arranged in a grid structure where successive rows are offset, one corresponding to superconducting vertical code qubit chips, and the other row corresponding to superconducting vertical syndrome qubits chips 101 for error detection via measurement.",
"Each qubit chip pocket (i.e., etched recess 201) is arranged to couple to two coupling bus resonators 205 defined on the quantum bus plane 100 in one implementation.",
"Note that this arrangement is not the only way to realize the surface code, as one can also couple either three or four coupling bus resonators 205 to a single superconducting vertical qubit chip 101 in another implementation.",
"Location accuracy of the qubit chip pockets (etched recesses 201 (including etched recesses 301 in readout plane 102) is determined by the lithography and depth accuracy as determined by the etch time.",
"The pockets are formed with a chamfered or bell-mouthed opening to allow easy insertion of each superconducting vertical qubit chip 101 (qubit die).",
"Depending on results from scaling to larger N (i.e., a larger amount of superconducting vertical qubit chips 101), the quantum bus plane 100 may be admissible to more integration techniques such as TSVs for chip-mode reduction.",
"The nuance here is that no Josephson junctions (qubits) 403 need to be defined in this quantum bus plane 100, so there would be minimal effect on qubit coherence with further integration of the quantum bus plane 100.Design of Readout Plane: The readout plane 102 starts off similar to the quantum bus plane 100, with niobium conductors etched lithographically on a silicon substrate 595.Co-planar transmission lines 320 are patterned on the readout plane 102 in a fan-out configuration (i.e., fan-out wiring 302) so as to bring external signals into and out of each superconducting vertical qubit chip 101.These transmission lines 320 are defined in a coplanar waveguide, and support 50Ω microwave driving of both readout and qubit control signals.",
"All these transmission lines 320 meander through the readout plane 102 terminating on one edge in wire bond pads 370.The wire bond pads 370 are on the extreme right end of the fan-out wiring 302.Similar to the quantum bus plane, pockets (i.e., etched recesses 301) in the readout plane 102 are likewise defined via deep etching into the silicon substrate 595 of the readout plane 102, in corresponding locations as the etched recesses 201 in the quantum bus plane 100 so as to accept the mounting of the individual superconducting vertical qubit chips 101.These pockets (i.e., etched recesses 301) may be chamfered or otherwise bell-mouthed for ease of assembly and locating of structure.",
"The microwave signals for control and readout are carried off the readout plane 102 via wire bonds 578 to the flexible circuit board 303 which conducts to other transmission lines embedded in a separate rigid circuit board 330 populated with connectors 304 leading to external components.",
"Ground Planes in Quantum Bus Plane and Readout Plane Pockets: After etching qubit chip pockets (etched recesses 201, 301) in both the quantum bus and readout planes 100 and 102 respectively, these pockets (etched recesses 201, 301) are coated with niobium via sputtering to form continuous ground plane.",
"These ground planes are designed to mate to the ground planes 405 that exist on the extreme ends of each superconducting vertical qubit chip 101 to form a continuous electrostatic ground between the quantum bus and readout planes 100 and 102, respectively; the continuous electrostatic ground between the quantum bus and readout planes 100 and 102 (respectively) serves to (1) further isolate each qubit site (i.e., locations of etched recesses 201, 301) from spurious modes, (2) isolate each qubit site (i.e., locations of etched recesses 201, 301) from adjacent qubit superconducting vertical qubit chips 101, and (3) eliminate unwanted cross-talk coupling between superconducting vertical qubit chips 101.Assembly of Modular Array Elements: 1.Each individual superconducting vertical qubit chip 101 is located by an etched recess 201 formed in the quantum bus plane 100 and an etched recess 301 formed the readout plane 102.In one implementation, the etched recesses 201, 301 are accurately formed in the silicon substrates 590, 595 using a standard wet etch process.",
"2.Each individual superconducting vertical qubit chip 101 is chosen for desirable electrical characteristics such as transition frequency.",
"In some cases the syndrome qubits might be more strongly coupled to the readout wiring to enhance signal-to-noise.",
"This would reduce coherence times on the syndrome qubits which does not in any way degrade the quantum information in the code qubits.",
"3.A pair of crossed assembly combs 520A and 520B is mounted to the outer housing of the copper block 502 in order to temporarily provide alignment for the superconducting vertical qubit chips 101 (as shown in FIG.",
"5A).",
"The assembly combs 520A and 520B create a series of alignment slots 525 (as shown in FIG.",
"5B) to orient the superconducting vertical qubit chips 101 which are inserted vertically from above.",
"The superconducting vertical qubit chips 101 key into the etched recesses 201 in the quantum bus plane 100 (as shown in 5C) and are thereby (automatically) oriented to key into the corresponding etched recesses 301 in the readout plane 102 (as shown in FIG.",
"5D).",
"The readout plane 102 is inserted from the side via readout plane slot 503.FIG.",
"5E depicts the assembly 500 from below and shows the assembled components with the assembly combs 520A and 520B omitted.",
"Once assembled, the vertical organization of the superconducting vertical qubit chips 101 constrained (and sandwiched) between the two silicon quantum bus and readout planes 100 and 102 (respectively) is maintained with pressure applied by the pusher block 570.The pusher block 570 is spring-loaded from above via the springs 575 pressed down by the top cap 582 (as shown in FIG.",
"5F).",
"Expandable, Scalable and Replaceable Array: The figures associated with embodiments show a fourteen qubit chip array but the number of superconducting vertical qubit chips 101 can be expanded to any arbitrary number (N).",
"All that is required is that the quantum bus plane 100 should be enlarged and the niobium wiring be replicated at all qubit sites (i.e., locations at the etched recesses 201 to accommodate superconducting vertical qubit chips 101) as needed.",
"The readout plane 102 can support many signal transmission lines 320 interleaved between each qubit site (i.e., locations at the etched recesses 301 to accommodate superconducting vertical qubit chips 101) to bring the signals to one edge and may require integration of dielectric cross-overs to reduce crosstalk if desired.",
"Moreover, the further integration of the readout plane 102 and quantum bus planes 100 is a minimal issue as it will neither directly affect the qubit chip fabrication process nor the qubit coherence performance.",
"According to embodiments, the assembly 500 includes the desirable feature that each superconducting vertical qubit chip 101 may be hand-selected for the correct electrical characteristics; any member of the array of superconducting vertical qubit chips 101 may be individually replaced at any time if the qubit chip's performance degrades for any reason during operation.",
"Replacement of the superconducting vertical qubit chip 101 can be accomplished without removing wire bonds 578 and/or without having to unsolder any components.",
"Embodiments provide a clear separation of fabrication processing steps and avoid the need for all N qubit and circuit parameters to meet specification on a single superconducting vertical qubit chip 101.Qubit chips 101 from multiple different fabrication runs can be combined in this type of quantum processor so that parameters such as transition frequency may be easily tailored without having to achieve a full range of accurate parameters on one silicon wafer in just one fabrication run.",
"Individual qubit chips 101 may be chosen from various different fabrication runs (wafers) and combined in the processor assembly.",
"As understood by one skilled in the art, microwave signals are applied to the qubit chip 101 via the readout lines to excite it into a defined state.",
"After some later time the state of the qubits can be then read out by interrogating them at some other microwave frequency, again via the readout lines.",
"FIG.",
"6 is a method 600 of configuring an assembly 500 for a quantum computing device according to an embodiment.",
"Reference can be made to the figures discussed herein.",
"At block 605, the quantum bus plane 100 having a first set of recesses 201 are provided, as depicted in FIG.",
"2.At block 610, the quantum bus plane 100 is positioned in the block 502, on top of the copper base 530, as seen in FIG.",
"5D.",
"The alignment combs 520A and 520B are installed in the copper block 502 and fixed in place, creating a series of precisely aligned slots 535 to accept the qubit chips 101, as seen in FIG.",
"5B.",
"At block 615, a plurality of superconducting vertical qubit chips 101 are placed/installed in the block 502, each of the plurality of qubit chips 101 has a first end positioned in the first set of recesses 201 (as shown in FIG.",
"5C).",
"The plurality of qubit chips 101 extend vertically in a lengthwise direction by being positioned in the first set of recesses 201 and in the slots 525 created by the alignment combs.",
"The set of recesses 201 holds the lower end of the plurality of qubit chips 101 in the quantum bus plane 100.The first end of the plurality of qubit chips 101 is opposite the second end.",
"At block 620, the readout plane 102 with its recesses 301 is then installed into the copper block 502 such that the recesses 301 in the readout plane 102 are positioned to accept the upper end (i.e., second end) of the plurality of all the qubit chips 101 which have been aligned by the slots 525 created by both alignment combs 520A, 520B.",
"The readout plane 102 thus drops down over the ends of the qubit dies 101 a distance equal to the depth of the recesses in the readout plane 301 and the precise mechanical alignment of all the electrical circuit elements is achieved in all three axes simultaneously.",
"At this point the alignment combs 520A and 520B may either be left in place or may be removed.",
"The quantum bus plane 100 comprises a substrate 590 with interconnect wiring 202 on top of the substrate 590, and the interconnect wiring 202 connects the plurality of qubit chips 101 via a plurality of coupling bus resonators 205.The readout plane 102 comprises a substrate 595 with fan-out wiring 302 on top of the substrate 595, and the fan-out wiring 302 individually connects each of the plurality of qubit chips 101 to a circuit board 330.The circuit board 330 individually connects each of the plurality of qubit chips 101 to a plurality of connectors 304 in a one-to-one relationship.",
"The block 502 is configured to receive a first assembly comb 520A and a second assembly comb 520B to form an intersection, and the intersection of the first and second assembly combs 520A, 520B form a plurality of slots 525 for individually accepting the plurality of qubit chips 101.The plurality of slots 525 mechanically holds the plurality of qubit chips 101 in a vertical position.",
"FIG.",
"7 is a method 700 of configuring an assembly 500 for a quantum computing device according to an embodiment.",
"Reference can be made to the figures discussed herein.",
"At block 705, the following parts are assembled: copper base 530 and copper block 502.At block 710 the quantum buss plane 100 is installed into the copper block 502 such that the quantum buss plane 100 rests on top of the copper base 530, and the quantum bus plane 100 has a set of recesses 201 (the readout plane 102 has a different set of recesses 301).",
"Then, the assembly combs 520A and 520B are installed and fixed into the copper block 502 thereby creating alignment slots 525.At block 715, a plurality of qubit chips 101 are installed in the block 502, where each of the plurality of qubit chips 101 has a first end positioned in the first set of recesses 201 using the alignment slots 525 created by the assembly combs 520A, 520B to guide the qubit chips 101 into the correct locations.",
"The housing 550 includes a readout plane housing slot 585.At block 720, the readout plane 102 is installed into the slot 585 and the recesses 301 in the readout plane 102 accept the upper ends (i.e., second end) of the plurality of all the qubit chips 101 which have been put in the correct locations by the alignment combs 520A, 520B such that the readout plane 102 drops over all of them (qubit chips 101) simultaneously.",
"The bell-mouthed nature of the recesses 301 in the readout plane 102 assists in the final locating of the ends of the qubit dies 101 into the recesses 301.The readout plane 102 extends through the readout plane housing slot 585 to connect to the circuit board 330, and the circuit board 330 connects to a plurality of connectors 304.The housing 550 includes a pushing mechanism configured to apply pressure to the readout plane 102, and the pressure applied to the readout plane 102 forces the plurality of qubit chips 101 to the quantum bus plane 100.The pushing mechanism comprises: a pusher block 570 positioned on top of the readout plane 102, and a spring mechanism 575 pressing downward against the pusher block 570.The top part (top cap 582) of the housing 550 applying a compression force to the spring mechanism 575 from above.",
"It will be noted that various microelectronic device fabrication methods may be utilized to fabricate the components/elements discussed herein as understood by one skilled in the art.",
"In semiconductor device fabrication, the various processing steps fall into four general categories: deposition, removal, patterning, and modification of electrical properties.",
"Deposition is any process that grows, coats, or otherwise transfers a material onto the wafer.",
"Available technologies include physical vapor deposition (PVD), chemical vapor deposition (CVD), electrochemical deposition (ECD), molecular beam epitaxy (MBE) and more recently, atomic layer deposition (ALD) among others.",
"Removal is any process that removes material from the wafer: examples include etch processes (either wet or dry), and chemical-mechanical planarization (CMP), etc.",
"Patterning is the shaping or altering of deposited materials, and is generally referred to as lithography.",
"For example, in conventional lithography, the wafer is coated with a chemical called a photoresist; then, a machine called a stepper focuses, aligns, and moves a mask, exposing select portions of the wafer below to short wavelength light; the exposed regions are washed away by a developer solution.",
"After etching or other processing, the remaining photoresist is removed.",
"Patterning also includes electron-beam lithography.",
"Modification of electrical properties may include doping, such as doping transistor sources and drains, generally by diffusion and/or by ion implantation.",
"These doping processes are followed by furnace annealing or by rapid thermal annealing (RTA).",
"Annealing serves to activate the implanted dopants.",
"The flowchart and block diagrams in the Figures illustrate the architecture, functionality, and operation of possible implementations of systems, methods, and computer program products according to various embodiments of the present invention.",
"In this regard, each block in the flowchart or block diagrams may represent a module, segment, or portion of instructions, which comprises one or more executable instructions for implementing the specified logical function(s).",
"In some alternative implementations, the functions noted in the block may occur out of the order noted in the figures.",
"For example, two blocks shown in succession may, in fact, be executed substantially concurrently, or the blocks may sometimes be executed in the reverse order, depending upon the functionality involved.",
"It will also be noted that each block of the block diagrams and/or flowchart illustration, and combinations of blocks in the block diagrams and/or flowchart illustration, can be implemented by special purpose hardware-based systems that perform the specified functions or acts or carry out combinations of special purpose hardware and computer instructions."
]
] |
Patent_15871443
|
[
[
"Methods and Apparatus for Superpixel Modulation",
"In illustrative implementations, a set of separate modulation signals simultaneously modulates a plurality of pixels in a superpixel by a set of separate modulation signals, such that each pixel in the superpixel is modulated by a modulation signal that causes sensitivity of the pixel to vary over time.",
"Each superpixel comprises multiple pixels.",
"In some implementations, the sensitivity of a pixel to incident light is controlled by storage modulation or by light modulation.",
"In some implementations, this invention is used for 3D scanning, i.e., for detection of the 3D position of points in a scene."
],
[
"1.A method comprising modulating, by a set of signals, a group of imaging pixels, wherein: (a) the modulating comprises, for each respective imaging pixel, modulating sensitivity of the respective imaging pixel to light incident on the respective imaging pixel, in such a way that the sensitivity varies over time during the modulating; (b) the group of imaging pixels consists of pixel sets, each imaging pixel being a member of one or more of the pixel sets; (c) the imaging pixels are located in imaging superpixels; (d) each imaging superpixel includes at least one imaging pixel from each of the pixel sets; (e) each respective signal, in the set of signals, modulates only one pixel set and thus modulates at least one imaging pixel in each of the imaging superpixels; and (f) each signal, in the set of signals, is different than the other signals in the set of signals.",
"2.The method of claim 1, wherein the modulating by each of the signals occurs simultaneously.",
"3.The method of claim 1, wherein each imaging pixel is a member of only one of the pixel sets.",
"4.The method of claim 1, wherein each imaging superpixel includes only one imaging pixel of each pixel set, respectively.",
"5.The method of claim 1, wherein: (a) each signal, in the set of signals, undergoes a temporal sequence of states; and (b) the frequency at which the states change is different for each signal in the set of signals.",
"6.The method of claim 1, wherein: (a) each signal, in the set of signals, undergoes a temporal sequence of states; and (b) different permutations of the states of the signals exist at different times during a temporal period, each permutation of the states, respectively, during the period representing a permutation of digits of a code.",
"7.The method of claim 1, wherein the method further comprises, for each respective imaging pixel: (a) at multiple times during a temporal period, transferring electric charge from a photodiode of the respective imaging pixel to a first storage device; (b) at multiple other times during the period, discharging accumulated electrical charge from the photodiode without measuring the accumulated electrical charge; and (c) throughout the period, not transferring electrical charge from the photodiode to any storage device other than the first storage device.",
"8.The method of claim 1, wherein the method further comprises, for each respective imaging pixel, transferring, at multiple times during a read-out frame, electric charge from a photodiode of the respective imaging pixel to a set of storage devices, one storage device at a time.",
"9.The method of claim 1, wherein: (a) each signal, in the set of signals, undergoes a temporal sequence of states; and (b) the method further comprises (i) illuminating a scene, in such a way that where intensity of light incident on the scene is greatest changes during a temporal period, and (ii) calculating, based on a permutation, a time at which intensity of light incident on a specific imaging superpixel is greatest during the period, the permutation being a permutation of states of the signals that occurs when intensity of light incident on the specific imaging superpixel is greatest during the period.",
"10.The method of claim 9, further comprising calculating, based on the time, 3D position of a point in the scene, which point in the scene corresponds to the specific imaging superpixel.",
"11.An apparatus comprising: (a) a group of imaging pixels; and (b) one or more signal generators; wherein (i) the group of imaging pixels consists of pixel sets, each imaging pixel being a member of one or more of the pixel sets, (ii) the imaging pixels are spatially arranged as, and comprise, imaging superpixels, (iii) each imaging superpixel includes at least one imaging pixel from each of the pixel sets, and (iv) the one or more signal generators are configured to output a set of signals that cause the group of imaging pixels to undergo modulation, in such a way that (A) each signal, in the set of signals, is different than the other signals in the set of signals, (B) the modulation comprises, for each respective imaging pixel, modulating sensitivity of the respective imaging pixel to light incident on the respective imaging pixel, in such a way that the sensitivity varies over time during the modulation, and (C) each respective signal, in the set of signals, modulates only one pixel set and thus modulates at least one imaging pixel in each of the imaging superpixels.",
"12.The apparatus of claim 11, wherein the signal generator is configured to output each of the signals simultaneously.",
"13.The apparatus of claim 11, wherein each imaging pixel is a member of only one of the pixel sets.",
"14.The apparatus of claim 11, wherein each imaging superpixel includes only one imaging pixel of each pixel set, respectively.",
"15.The apparatus of claim 11, wherein an imaging pixel, in the group of imaging pixels, comprises a CMOS pixel.",
"16.The apparatus of claim 11, wherein an imaging pixel, in the group of imaging pixels, comprises a CCD pixel.",
"17.The apparatus of claim 11, wherein: (a) each imaging pixel, respectively, includes a photodiode and a first storage device; and (b) the apparatus is configured to cause the photodiode (a) at multiple times during a temporal period, to transfer electric charge to the first storage device; (b) at multiple other times during the period, to discharge accumulated electrical charge without the accumulated electrical charge being measured; and (c) throughout the period, to not transfer electrical charge to any storage device other than the first storage device.",
"18.The apparatus of claim 11, wherein: (a) each imaging pixel, respectively, includes a photodiode and a set of storage devices; and (b) the apparatus is configured to cause the photodiode to transfer, at multiple times during a read-out frame, electric charge to the set of storage devices, one storage device at a time.",
"19.The apparatus of claim 11, wherein (a) the one or more signal generators are configured to output the set of signals in such a way that each signal, in the set of signals, undergoes a temporal sequence of states; and (b) the apparatus further comprises: (i) a light source configured to illuminate a scene, in such a way that where intensity of light incident on the scene is greatest changes during a temporal period, and (ii) a computer that is programmed to calculate, based on a permutation, a time at which intensity of light incident on a specific imaging superpixel is greatest during the period, the permutation being a permutation of states of the signals that occurs when intensity of light incident on the specific imaging superpixel is greatest during the period.",
"20.The apparatus of claim 19, wherein the computer is programmed to calculate, based on the time, 3D position of a point in the scene, which point in the scene corresponds to the specific imaging superpixel."
],
[
"<SOH> FIELD OF THE TECHNOLOGY <EOH>The present invention relates generally to superpixel modulation."
],
[
"<SOH> SUMMARY <EOH>In exemplary implementations of this invention, a light sensor includes superpixels.",
"Each superpixel comprises multiple pixels, such that each pixel in the superpixel is a horizontal, vertical or diagonal neighbor of at least one other pixel in the superpixel.",
"The pixels of the light sensor also include pixel sets.",
"Each pixel set comprises multiple pixels to which a single modulation signal is applied.",
"In many cases, the pixels of a given pixel set are not horizontal, vertical or diagonal neighbors of each other.",
"Each of the pixel sets is modulated by a separate modulation signal.",
"Each superpixel includes at least one pixel from each of the pixel sets.",
"Thus, different pixels in each superpixel are separately modulated.",
"For example, in some cases: (1) a light sensor includes n pixel sets; (2) each superpixel in the light sensor has n pixels, such that each pixel in the superpixel is an element of a different pixel set; and (3) n separate modulation signals are simultaneously applied to the pixels in the light sensor, one separate modulation signal per pixel set.",
"In this example, for each superpixel, n separate modulation signals are simultaneously applied to the n pixels of the superpixel, one modulation signal per pixel, In illustrative implementations, the n separate modulations signals together comprise an n-bit binary code, such as n-bit binary gray code.",
"Each of the modulation signals corresponds to a bit of the code.",
"For example, in some cases: (1) each superpixel has n pixels; (2) n separate modulation signals are applied to the n pixels, one modulation signal per pixel; (3) together the n modulations signals comprise an 9-bit binary gray code; and (4) each of the n modulation signals corresponds to a bit of the code.",
"All 2 n permutations of the n-bit code are applied during each camera frame.",
"Thus, each camera frame is divided into 2 n time intervals (timeslots).",
"Each permutation of the code corresponds to a unique timeslot during a single camera frame.",
"In illustrative implementations, a set of separate modulation signals simultaneously modulate a plurality of pixels in a superpixel, such that each pixel in the superpixel is modulated by a modulation signal that causes sensitivity of the pixel to vary over time.",
"In some implementations, this invention is used for 3D scanning, i.e., for detection of the 3D position of points in a scene.",
"In some cases, the 3D scanning is implemented as follows: A rotating mirror causes a plane of laser light to sweep across a scene during each camera frame.",
"Because the mirror rotates, the angle of the plane of laser light varies as a function of time during each sweep.",
"The mirror is at a particular angle when the plane of laser light hits the point in the scene from which light directly reflects to that pixel.",
"At this particular angle of the plane of laser light, the incident light intensity for that pixel reaches a maximum for that frame.",
"The modulation pattern affects the pixel's response to incident light, and thereby uniquely identifies (i) the timeslot during which the maximum intensity of incident light strikes the pixel and (ii) the angle of the plane of laser light during this timeslot.",
"A computer uses the timeslot to access a lookup table to determine the 3D position of the scene point.",
"The lookup table is computed for each pixel by triangulation, during earlier calibration.",
"Specifically, in some cases, the image sensor, rotational axis of the rotating mirror, and pixel ray for the superpixel are fixed relative to each other.",
"The pixel ray is the half-line along which light must travel in order to reach the center of the superpixel.",
"A computer calculates the angle of the plane of laser light for a given superpixel, based on the timeslot at which incident light for the given superpixel reaches a maximum.",
"The 3D scene point that reflects light to the given superpixel is positioned at the intersection of (i) the pixel ray for the given superpixel and (ii) the plane of laser light.",
"A computer calculates the 3D coordinates of this intersection by triangulation, based on the known position of the superpixel, pixel ray for the superpixel, and light source and based on the computed angle of the plane of laser light.",
"An advantage of the present invention is that, in illustrative implementations, all n modulation signals that comprise an n-bit code are recorded by an n-pixel superpixel during a single frame of a camera.",
"In contrast, during conventional time-multiplexed structured illumination: (a) light source is modulated by one modulation signal during each frame; and (b) the n separate modulation signals that comprise the n-bit code are applied during n separate frames of the camera, one modulation signal per frame.",
"Thus, in illustrative implementations, this invention captures in a single camera frame the same type of data as is captured during multiple camera frames with time-multiplexed structured illumination.",
"Capturing all of the data in a single frame (in illustrative implementations of the present invention) rather than in multiple frames (as in conventional time-multiplexed structured illumination) has the desirable effect of reducing distortion and artifacts in 3D sensing that are caused by motion.",
"In some implementations of this invention, the sensitivity of a pixel to incident light is controlled by storage modulation.",
"Storage modulation is achieved by using either a single storage device per pixel, or by using multiple storage devices per pixel.",
"In single storage cases, each pixel transfers charge to only one storage device during the exposure time of a single camera frame.",
"The storage device receives charge only from that pixel, and not from any other pixels, during the exposure time of a single camera frame.",
"Modulation signals cause a photodiode in each pixel to transfer charge to the single storage device multiple times during a single camera frame, and to drain charge, without saving it for later readout, at multiple other times during the same camera frame.",
"In multiple storage cases, each pixel transfers charge to multiple storage device during the exposure time of a single camera frame.",
"These multiple storage device receive charge only from that pixel, and not from any other pixels, during the exposure time of a single camera frame.",
"Modulation signals cause a photodiode in each pixel to transfer charge to transfer charge to different storage devices, out of the multiple storage devices, at multiple times during the exposure time of a single camera frame, or to drain charge, without saving it for later readout, at multiple other times during the same camera frame.",
"In some implementations of this invention, pixel modulation occurs by light modulation.",
"In light modulation implementations, the system includes an SLM (spatial light modulator) that is either transmissive or reflective.",
"The SLM selectively attenuates light from a scene, thereby selectively controlling the intensity of light incident on a pixel.",
"For example, in some cases: (a) a reflective SLM selectively reflects light from the scene, causing different sets of pixels in a superpixel to receive reflected light from the scene at different times during a single camera exposure; and (b) the reflective SLM comprises a DMD (digital micromirror device) or a reflective LCOS (liquid crystal on silicon) device.",
"For example, in other cases: (a) light passing through a transmissive SLM is selectively attenuated by the SLM, causing different sets of pixels in a superpixel to receive light from the scene at different times during a single camera exposure; and (b) the transmissive SLM comprises an LCD (liquid crystal device) or ferromagnetic shutters.",
"The description of the present invention in the Summary and Abstract sections hereof is just a summary.",
"It is intended only to give a general introduction to some illustrative implementations of this invention.",
"It does not describe all of the details of this invention.",
"This invention may be implemented in many other ways.",
"Likewise, the description of this invention in the Field of the Technology section is not limiting; instead it identifies, in a general, non-exclusive manner, a field of technology to which exemplary implementations of this invention generally relate."
],
[
"RELATED APPLICATIONS This application is a continuation of U.S. application Ser.",
"No.",
"15/115,270, which was the National Stage of International Application No.",
"PCT/IB2015/051551 filed Mar.",
"3, 2015, which claims the benefit of U.S.",
"Provisional Application No.",
"61/947,282, filed Mar.",
"3, 2014 (the “Provisional Application”).",
"FIELD OF THE TECHNOLOGY The present invention relates generally to superpixel modulation.",
"SUMMARY In exemplary implementations of this invention, a light sensor includes superpixels.",
"Each superpixel comprises multiple pixels, such that each pixel in the superpixel is a horizontal, vertical or diagonal neighbor of at least one other pixel in the superpixel.",
"The pixels of the light sensor also include pixel sets.",
"Each pixel set comprises multiple pixels to which a single modulation signal is applied.",
"In many cases, the pixels of a given pixel set are not horizontal, vertical or diagonal neighbors of each other.",
"Each of the pixel sets is modulated by a separate modulation signal.",
"Each superpixel includes at least one pixel from each of the pixel sets.",
"Thus, different pixels in each superpixel are separately modulated.",
"For example, in some cases: (1) a light sensor includes n pixel sets; (2) each superpixel in the light sensor has n pixels, such that each pixel in the superpixel is an element of a different pixel set; and (3) n separate modulation signals are simultaneously applied to the pixels in the light sensor, one separate modulation signal per pixel set.",
"In this example, for each superpixel, n separate modulation signals are simultaneously applied to the n pixels of the superpixel, one modulation signal per pixel, In illustrative implementations, the n separate modulations signals together comprise an n-bit binary code, such as n-bit binary gray code.",
"Each of the modulation signals corresponds to a bit of the code.",
"For example, in some cases: (1) each superpixel has n pixels; (2) n separate modulation signals are applied to the n pixels, one modulation signal per pixel; (3) together the n modulations signals comprise an 9-bit binary gray code; and (4) each of the n modulation signals corresponds to a bit of the code.",
"All 2n permutations of the n-bit code are applied during each camera frame.",
"Thus, each camera frame is divided into 2n time intervals (timeslots).",
"Each permutation of the code corresponds to a unique timeslot during a single camera frame.",
"In illustrative implementations, a set of separate modulation signals simultaneously modulate a plurality of pixels in a superpixel, such that each pixel in the superpixel is modulated by a modulation signal that causes sensitivity of the pixel to vary over time.",
"In some implementations, this invention is used for 3D scanning, i.e., for detection of the 3D position of points in a scene.",
"In some cases, the 3D scanning is implemented as follows: A rotating mirror causes a plane of laser light to sweep across a scene during each camera frame.",
"Because the mirror rotates, the angle of the plane of laser light varies as a function of time during each sweep.",
"The mirror is at a particular angle when the plane of laser light hits the point in the scene from which light directly reflects to that pixel.",
"At this particular angle of the plane of laser light, the incident light intensity for that pixel reaches a maximum for that frame.",
"The modulation pattern affects the pixel's response to incident light, and thereby uniquely identifies (i) the timeslot during which the maximum intensity of incident light strikes the pixel and (ii) the angle of the plane of laser light during this timeslot.",
"A computer uses the timeslot to access a lookup table to determine the 3D position of the scene point.",
"The lookup table is computed for each pixel by triangulation, during earlier calibration.",
"Specifically, in some cases, the image sensor, rotational axis of the rotating mirror, and pixel ray for the superpixel are fixed relative to each other.",
"The pixel ray is the half-line along which light must travel in order to reach the center of the superpixel.",
"A computer calculates the angle of the plane of laser light for a given superpixel, based on the timeslot at which incident light for the given superpixel reaches a maximum.",
"The 3D scene point that reflects light to the given superpixel is positioned at the intersection of (i) the pixel ray for the given superpixel and (ii) the plane of laser light.",
"A computer calculates the 3D coordinates of this intersection by triangulation, based on the known position of the superpixel, pixel ray for the superpixel, and light source and based on the computed angle of the plane of laser light.",
"An advantage of the present invention is that, in illustrative implementations, all n modulation signals that comprise an n-bit code are recorded by an n-pixel superpixel during a single frame of a camera.",
"In contrast, during conventional time-multiplexed structured illumination: (a) light source is modulated by one modulation signal during each frame; and (b) the n separate modulation signals that comprise the n-bit code are applied during n separate frames of the camera, one modulation signal per frame.",
"Thus, in illustrative implementations, this invention captures in a single camera frame the same type of data as is captured during multiple camera frames with time-multiplexed structured illumination.",
"Capturing all of the data in a single frame (in illustrative implementations of the present invention) rather than in multiple frames (as in conventional time-multiplexed structured illumination) has the desirable effect of reducing distortion and artifacts in 3D sensing that are caused by motion.",
"In some implementations of this invention, the sensitivity of a pixel to incident light is controlled by storage modulation.",
"Storage modulation is achieved by using either a single storage device per pixel, or by using multiple storage devices per pixel.",
"In single storage cases, each pixel transfers charge to only one storage device during the exposure time of a single camera frame.",
"The storage device receives charge only from that pixel, and not from any other pixels, during the exposure time of a single camera frame.",
"Modulation signals cause a photodiode in each pixel to transfer charge to the single storage device multiple times during a single camera frame, and to drain charge, without saving it for later readout, at multiple other times during the same camera frame.",
"In multiple storage cases, each pixel transfers charge to multiple storage device during the exposure time of a single camera frame.",
"These multiple storage device receive charge only from that pixel, and not from any other pixels, during the exposure time of a single camera frame.",
"Modulation signals cause a photodiode in each pixel to transfer charge to transfer charge to different storage devices, out of the multiple storage devices, at multiple times during the exposure time of a single camera frame, or to drain charge, without saving it for later readout, at multiple other times during the same camera frame.",
"In some implementations of this invention, pixel modulation occurs by light modulation.",
"In light modulation implementations, the system includes an SLM (spatial light modulator) that is either transmissive or reflective.",
"The SLM selectively attenuates light from a scene, thereby selectively controlling the intensity of light incident on a pixel.",
"For example, in some cases: (a) a reflective SLM selectively reflects light from the scene, causing different sets of pixels in a superpixel to receive reflected light from the scene at different times during a single camera exposure; and (b) the reflective SLM comprises a DMD (digital micromirror device) or a reflective LCOS (liquid crystal on silicon) device.",
"For example, in other cases: (a) light passing through a transmissive SLM is selectively attenuated by the SLM, causing different sets of pixels in a superpixel to receive light from the scene at different times during a single camera exposure; and (b) the transmissive SLM comprises an LCD (liquid crystal device) or ferromagnetic shutters.",
"The description of the present invention in the Summary and Abstract sections hereof is just a summary.",
"It is intended only to give a general introduction to some illustrative implementations of this invention.",
"It does not describe all of the details of this invention.",
"This invention may be implemented in many other ways.",
"Likewise, the description of this invention in the Field of the Technology section is not limiting; instead it identifies, in a general, non-exclusive manner, a field of technology to which exemplary implementations of this invention generally relate.",
"BRIEF DESCRIPTION OF THE DRAWINGS FIG.",
"1 is a diagram that shows a matrix of superpixels.",
"FIG.",
"2 is a diagram that shows individual pixels within superpixels.",
"FIG.",
"3 is a diagram that shows five different modulation signals that are simultaneously applied to five different pixel sets.",
"FIG.",
"4 is a conceptual diagram, illustrating how modulation signals control the response of pixels to incident light.",
"FIGS.",
"5, 7 and 9 are each a circuit schematic for a portion of a CMOS pixel, which pixel has one floating diffusion storage device.",
"FIGS.",
"6, 8 and 10 are timing diagrams for FIGS.",
"5, 7 and 9, respectively.",
"FIG.",
"11 is a conceptual diagram of a superpixel, in which each pixel has multiple storage devices.",
"FIG.",
"12 a circuit schematic for a portion of a CMOS pixel that has three storage devices.",
"FIG.",
"13 is a conceptual diagram of CCD pixels, in which each pixel has two storage devices.",
"FIG.",
"14 is a conceptual diagram of CCD pixels, in which each pixel has four storage devices.",
"FIG.",
"15 is a flowchart for modulation of storage using an n-ary code, such that all of the photodiode charge is stored for later readout.",
"FIG.",
"16 is a flowchart for modulation of storage using an n-ary code, such that only a portion of the photodiode charge is stored for later readout.",
"FIG.",
"17 is a flowchart for decoding an n-ary code, after storage modulation in which only a portion of the photodiode charge is stored for later readout.",
"FIG.",
"18 is a flowchart for decoding an n-ary code, after storage modulation in which all of the photodiode charge is stored for later readout.",
"FIG.",
"19 is diagram that illustrates three examples of analog modulation signals.",
"FIG.",
"20 is a conceptual diagram illustrating the use of a reflective SLM for modulating the intensity of light incident on photodiodes of pixels in a superpixel.",
"FIG.",
"21 is a ray diagram that shows a DMD selectively reflecting light from a scene at a particular time, such that reflected light is steered toward some, but not all, of the pixels in a superpixel of an image sensor.",
"FIG.",
"22 is a conceptual diagram illustrating the use of a transmissive SLM for modulating the intensity of light incident on photodiodes of pixels in a superpixel.",
"FIG.",
"23 is a ray diagram showing an LCD selectively attenuating light from a scene, such that light reaches some, but not all, of the pixels of a superpixel in an image sensor.",
"FIGS.",
"24A, 24B and 24C are each a diagram of an optical system that includes a transmissive SLM.",
"In FIG.",
"24A, the transmissive SLM is adjacent to the image sensor plane.",
"In FIG.",
"24B, an imaging lens is positioned between the transmissive SLM and the image sensor plane.",
"In FIG.",
"24C, a field lens and relay lens are positioned between the transmissive SLM and the image sensor plane.",
"FIG.",
"25 is a conceptual diagram that shows an example of prior art, time-multiplexed structured illumination.",
"FIG.",
"26 is a conceptual diagram that illustrates a moving line of light produced by controlled movement of a light source, in an illustrative implementation of this invention.",
"FIG.",
"27A is a diagram, which shows a rotating mirror that reflects a rotating line of light.",
"FIG.",
"27B is a diagram, which shows a projector that projects a moving line of light.",
"FIG.",
"27C is a diagram, which shows an array of directional light sources that, taken together, emit a moving line of light.",
"FIG.",
"28 is a block diagram of hardware components.",
"FIG.",
"29 is a diagram of a 3D scanning system.",
"FIG.",
"30 is a flowchart that shows steps in a method of 3D scanning, in which different pixel sets are separately modulated.",
"FIG.",
"31 is a flowchart that shows steps in a method of 3D scanning, in which a timeslot is calculated.",
"FIG.",
"32 is a flowchart that shows steps in a method of calibrating a 3D scanner.",
"FIG.",
"33 is a diagram that shows four examples of circles used in an optical calibration pattern.",
"FIG.",
"34 is a diagram that shows examples of use of calibration patterns.",
"The above Figures (except FIG.",
"25) show some illustrative implementations of this invention, or provide information that relates to those implementations.",
"However, this invention may be implemented in many other ways.",
"DETAILED DESCRIPTION Superpixels and Pixel Sets In illustrative implementations of this invention, a light sensor includes superpixels.",
"Separate modulation signals are applied to different sets of pixels in the light sensor.",
"As used herein, a set of pixels to which a particular modulation signal is applied is sometimes called a “modulation pixel set” or simply “pixel set”.",
"Each pixel set comprises multiple pixels.",
"Each superpixel includes at least one pixel from each of the pixel sets.",
"FIG.",
"1 is a diagram that shows a matrix of superpixels, in an illustrative implementation of this invention.",
"In the example shown in FIG.",
"1, a light sensor comprises matrix 100 of superpixels, such as superpixels 101, 102, 103, 104.The matrix 100 has r rows and c columns.",
"The total number of superpixels in the matrix is r*c=k.",
"FIG.",
"2 is a diagram that shows individual pixels within superpixels, in an illustrative implementation of this invention.",
"FIG.",
"2 shows four superpixels 251, 252, 253, 254 in the upper left corner of a matrix of superpixels.",
"Each of the four superpixels comprises 9 pixels.",
"For example, superpixel 251 comprises pixels 211, 212, 213, 214, 215, 216, 217, 218, 219.In the example shown in FIG.",
"2, there are nine pixel sets.",
"The pixels in the first pixel set are labeled “1”.",
"Likewise, the pixels in the second, third, fourth, fifth, sixth, seventh, eighth and ninth pixel sets are labeled “2”, “3”, “4′”, “5”, “6”, “7”, “8”, and “9”, respectively.",
"(These numerical labels are used in FIG.",
"2 to facilitate explanation; but in actual practice, the pixels are not labeled in this manner.)",
"In FIG.",
"2, each superpixel includes one pixel from each set.",
"In illustrative implementations, the pixels in each superpixel are sufficiently small and sufficiently close together that light incident on the photodiodes of the pixels in the superpixel is locally homogeneous—that is, within a single superpixel, spatial variation in intensity of incident light is not substantial.",
"(However, in some cases: (a) the light sensor itself includes spatial light modulators—such as an LCD—for selectively modulating the intensity of incoming light; and (b) the light incident on the photodiodes of the superpixel is locally homogeneous if the effect of the spatial light modulators is subtracted, but is not locally homogeneous if the effect of the spatial light modulators is taken into account.)",
"Depending on the particular implementation, the spatial distribution of pixel sets within a light sensor may vary.",
"In many cases, it is preferable for the pixel sets to be spatially distributed in a repeating pattern.",
"For example, in some cases, 9 pixel sets are used in a light sensor, and each superpixel is a 3×3 pixel square, which is an easily repeatable pattern.",
"For example, in FIG.",
"2, the following spatial pattern of 9 pixel sets occurs in superpixel 251: pixels from pixel sets 1, 2, 3 are in the top row of the superpixel, pixels for pixel sets 4, 5, 6 are in the middle row of the superpixel, and pixels for pixel sets 7, 8, 9 are in the bottom row of the superpixel.",
"This spatial pattern repeats in superpixels 252, 253, 254.Or, for example, in some cases, a 3-pixel superpixel in an “L” shape is used: stacking an upright “L” and a bottom-up “L” gives a rectangle and thus produces a repeatable pattern.",
"Depending on the particular implementation, any shape of superpixels may be used.",
"For example, in some cases, triangular or hexagonal superpixels are used.",
"In some cases, the superpixels has a linear shape, such as horizontal (e.g., [12345][12345][12345]), and vertical (e.g., [12345]T[12345]T[12345]T) However, in some cases, using a line-shaped superpixel has a disadvantage: if all “1”s are in one column; this tends in some cases to at least slightly increase the decoding error rate.",
"In some cases, the position of pixels from different pixel sets (within each superpixel) is rearranged from superpixel to superpixel (e.g.",
"using a few fixed patterns, completely randomizing the order, or using a mathematical permutation).",
"For example, in some implementations, the spatial distribution of pixels from different sets of pixel sets within each superpixel is randomized in design time, then the random distribution is hardwired.",
"For example, in some cases, randomization produces, for three line-shaped superpixels, a spatial arrangement of pixels from different pixel sets of [13452][35214][41253], rather than [12345][12345][12345].",
"Likewise, randomization of position of pixels from different pixel sets is applicable to any shape of superpixel, including square, rectangular, L-shaped, triangular or hexagonal.",
"In some cases, a multiplexer rearranges the shape or size of superpixels, such that superpixels with different sizes or shapes used at different times (e.g., for different applications, different frames, or at different times within a single frame) or at different regions within a single light sensor.",
"For example, in some cases, a multiplexer reconfigures different superpixel shapes, e.g., 3×3, 4×3, or another shape.",
"For example, in some implementations with CMOS pixels, a multiplexer is placed outside the pixel matrix area and directs separate TX/PD RST control signals to the pixels.",
"Likewise, in some cases, a multiplexer rearranges the position of pixels from different pixel sets within one or more of the superpixels.",
"As noted above, in some cases, the spatial distribution of different sets of pixels changes from frame to frame.",
"Alternatively, in some cases, the spatial distribution is fixed because of wiring of the pixel circuit.",
"In many implementations, the different sets of pixels in the imaging sensor are disjoint (i.e., no pixel belongs to more than one of the sets of pixels).",
"Alternatively, different sets of pixels are overlapping.",
"In some cases, a single pixel that is an element of two pixel sets A and B is subjected to a pixel modulation signal that comprises a superposition of the modulation signals for pixel sets A and B.",
"The size of the superpixel depends on the application.",
"If, for example, a 9 pixel superpixel is not enough for a specific application and a 16 pixel superpixel is too much, a 12 pixel superpixel (4×3 or 3×4) may be used for that specific application.",
"More pixel sets in a superpixel allows for more complicated coding strategies or code sharing.",
"For example, a modulation signal comprising 18-bit gray code may be applied to the pixels of a 6×3 pixel superpixel.",
"In some use scenarios, spatial compression is achieved by treating each large superpixel as if it comprises smaller superpixels, and then applying modulation signals as follows: Modulation signals corresponding to lower bits of a code are applied to only one pixel per large superpixel, but modulation signals corresponding to higher bits of the code are applied to one pixel per smaller superpixel.",
"For example, in some use scenarios, a 6×3 pixel superpixel is treated as if comprising two 3×3 pixel superpixels.",
"In these use scenarios, a modulation pattern corresponding to each of the 4 lower bits of the 11-bit gray code is applied to just one pixel in the 6×3 superpixel, while modulation patterns corresponding to each of the 7 higher bits of the 11-bit gray code are applied to one pixel in each of the 3×3 superpixels.",
"Spatial compression (by applying lower bits and higher bits in this manner) has many practical advantages.",
"For example, in some 3D depth sensing applications, this spatial compression allows for using multiple higher bit modulation signals to determine, for each large superpixel for each frame, the 3D coordinates for multiple points in a scene.",
"For example, in some implementations that use this spatial compression, a computer calculates 3D coordinates of four scene points, for each frame for each 6×3 superpixel.",
"In some cases, the actual spatial distribution of pixel sets is hardwired in a fixed pattern.",
"However, even then, in some cases, software is used to effectively vary the spatial distribution of pixel sets from frame to frame, by changing, from frame to frame, which bits of a modulation code are applied to which pixel set.",
"For example, in some cases: (a) in a first frame, software causes the x-th bit of a modulation signal to be applied to modulate pixel set x; and (b) in a second frame, software causes the x-th bit of a modulation signal to be applied to modulate pixel set y.",
"For example, in some use scenarios: (a) in a first frame, the modulation signal for the first bit of a code is applied to a first pixel set, the modulation signal for the second bit of the code is applied to the second pixel set, and so on, and (b) in a second frame, the first bit of a code is applied to the second pixel set, the modulation signal for the second bit of the code is applied to the third pixel set, and so on.",
"Thus, in this approach, the permutation of assignments (from code bits to pixel sets) varies from frame to frame.",
"In some cases, the same permutation of assignments (of code bits to pixel sets) is used in all frames.",
"In other cases, different permutations of assignments (of code bits to pixel sets) are applied in different frames in a fixed order.",
"In yet other cases, a different random permutation of assignments (of code bits to pixel sets) is used in each frame.",
"Here is a non-limiting example of varying the permutation of assignments (of code bits to pixel sets).",
"For a 5-bit code, there are 5!",
"(factorial) different permutations of assignments of code bits to pixel sets.",
"Different permutations are used in different frames.",
"For example, (a) in a first frame, a first permutation is used, which maps bit 1 to pixel set 1, bit 2 to pixel set 2, bit 3 to pixel set 3, bit 4 to pixel set 4, and bit 5 to pixel set 5; and (b) in a second frame, a second permutation is used, which maps bit 1 to pixel set 4, bit 2 to pixel set 2, bit 3 to pixel set 5, bit 4 to pixel set 3, and bit 5 to pixel set 1.In illustrative implementations, each superpixel comprises multiple imaging pixels.",
"Each pixel in the superpixel is a horizontal, vertical or diagonal neighbor of at least one other pixel in the superpixel.",
"In the example shown in FIG.",
"2, pixel 215 has only two vertical neighbors (pixels 212, 217), only two horizontal neighbors (pixels 214, 216), and only four diagonal neighbors (pixels 211, 213, 217, 219).",
"In many cases, the pixels of a given pixel set are not horizontal, vertical or diagonal neighbors of each other.",
"For example, in FIG.",
"2, pixels 216 and 226 are each members of the sixth pixel set.",
"None of the neighboring pixels (i.e.",
"horizontal, vertical or diagonal neighbors) of pixel 216 is a member of the sixth pixel set.",
"Likewise, none of the neighboring pixels (i.e.",
"horizontal, vertical or diagonal neighbors) of pixel 226 is a member of the sixth pixel set.",
"Modulation Signals FIG.",
"3 is a diagram that shows five different modulation signals that are simultaneously applied to five different pixel sets during a single frame.",
"In FIG.",
"3, the five signals 311, 312, 313, 314, 315 together comprise a binary 5-bit gray code.",
"The code is binary because each component of the code has only two allowed values.",
"In FIG.",
"3, the two allowed values are called “open” and “closed”.",
"However, the two allowed values may be called by any name, such as on and off, high and low, or 0 and 1.In FIG.",
"3, each of the five modulation signals 311, 312, 313, 314, 315 corresponds to a bit of a 5-bit gray code.",
"The 5-bit gray code has 25 (i.e., 32) permutations of open and closed states of the 5 component signals.",
"In FIG.",
"3, all 25 (i.e., 32) permutations of open and closed states of the 5 component signals are applied to the pixel sets, during a single frame of the camera.",
"For a 5-bit code (such as that shown in FIG.",
"3), a single frame of the camera has 25 (i.e., 32) subintervals, which are sometimes called “timeslots”.",
"Each timeslot corresponds to a single permutation of the code.",
"For example, during timeslot 321 in FIG.",
"3, the permutation is signal 315 closed, signal 314 closed, signal 313 open, signal 312 open and signal 311 closed.",
"In contrast, during timeslot 323 in FIG.",
"3, the permutation is signal 315 open, signal 314 open, signal 313 open, signal 312 open and signal 311 closed.",
"In FIG.",
"3, a unique permutation (of binary states of the 5 component signals of the 5-bit gray code) exists for each of the 32 timeslots.",
"Thus, each permutation (of states of the 5 component signals of the 5-bit gray code) is effectively a “timestamp” that uniquely identifies a timeslot within a frame.",
"In some implementations of this invention, a 9-bit binary gray code is used.",
"The nine bits of this code are represented by 9 modulation signals.",
"The 9-bit code has 29 (i.e., 512) permutations of open and closed states of the 9 modulation signals.",
"All 512 permutations are applied to pixels in each frame of the camera.",
"Thus, for this 9-bit code, each frame has 512 subintervals, sometimes called timeslots.",
"A unique permutation of the 9-bit code (and thus of the open and closed states of the 9 modulation signals) exists for each of the 512 timeslots.",
"In some cases in which a 9-bit code is used: (a) there are nine pixel sets; (b) the 9 modulation signals are applied to the 9 pixel sets, one signal per pixel set; and (c) each superpixel has 9 pixels, one pixel per pixel sets.",
"Thus, the 9 modulation signals are applied to the 9 pixels in a superpixel, one signal per pixel.",
"Gray codes are robust against noise, which is advantageous.",
"Depending on the particular implementation of this invention, the modulation signals are either (a) continuous time (analog), (b) discrete-time, or (c) digital (discrete in both amplitude and time).",
"For example, in many examples of this invention, digital modulation signals are used.",
"In that case, the amplitude of the modulation signal is treated as being in one of two binary states (e.g., 0 or 1), and the signal changes only at discrete time intervals.",
"Alternatively, modulation signals are treated as continuous in amplitude.",
"For example, in some cases, a computer normalizes the range of continuous values to an interval [0,1].",
"In that case, for example, a value of 0.241 may mean that 24.1% of electrons are moved to storage.",
"There is no limitation of when the signal change can occur in time.",
"In some implementations, the signal changes continuously in time.",
"In some cases, analog modulation signals are used, which are treated as continuous in both amplitude and time.",
"In some implementations, the modulation signals are non-periodic.",
"An example of such an aperiodic signal is 00110010101101000011010, which does not have one specific frequency or phase.",
"In other cases, the modulation signals are periodic.",
"Or, in some cases, a periodic signal such as 01010101010101 is applied to a first pixel set, and a second periodic or aperiodic signal (e.g., periodic signal 10000100001000) is applied to a second pixel set.",
"In some cases, the frequency, phase, or amplitude of the modulation signal for a pixel set changes over the duration of one frame.",
"In other cases, the frequency, phase, or amplitude of the modulation signal for a pixel set is constant within each single frame, but changes from frame to frame.",
"In illustrative implementations, each modulation signal is applied to only one pixel in each superpixel.",
"Alternatively, a single modulation signal is applied to multiple pixels within a single superpixel.",
"In illustrative implementations: (a) all pixels which belong to the same pixel set have the same modulation signal; and (b) different pixel sets receive different modulation signals.",
"Each pixel set receives its own, separate generated pixel modulation signal.",
"In many use scenarios, the amplitude of each modulation signal varies as a function of time during a single frame.",
"However, in other use scenarios: (a) the amplitude or phase of a modulation signal is constant over time within a single frame, where the constant is different for different pixel sets, or (b) the amplitude or phase of a modulation signal is the same constant for different pixel sets.",
"In other words, this invention is not limited to signals that change over time or that are different among different sets of pixels.",
"In some cases, the modulation functions for pixel sets changes frame to frame.",
"Depending on the particular implementation, the manner in which the modulation signals are physically implemented may vary.",
"For example, in some cases, the pixels are CMOS imaging pixels, an electrical modulation signal causes a charge transfer (TX) transistor to transfer charge from a photodiode to a storage device (e.g., floating diffusion).",
"In some cases: (a) each pixel has only one photodiode and more than more than one TX transistor; (b) more than one storage device (e.g., floating diffusion) is dedicated to only that pixel; and (c) each of the TX transistors in that pixel controls transfer to a different storage device.",
"In other cases, an electrical modulation signal causes electrodes to vary the position of mirrors in a DMD (digital micromirror device) by electrostatic attraction, thereby causing the DMD to selectively reflect light towards some pixels in the image sensor plane, and to reflect light away from some other pixels in the image sensor plane.",
"In other cases, an electrical modulation signal causes the properties of an SLM (spatial light modulator), such that the SLM selectively attenuates light before it reaches the image sensor plane.",
"Physical implementation of modulation signals is discussed in more detail below.",
"Effect of Modulation In some implementations, a modulation signal controls the response of a pixel to incident light.",
"FIG.",
"4 is a conceptual diagram, illustrating how modulation signals control the response of pixels to incident light.",
"In FIG.",
"4, plot 400 is a plot of Ix,y(t) 401 versus time.",
"Ix,y(t) is the intensity of light incident on the x, yth superpixel (i.e., the superpixel which has coordinates x, y on the sensor plane) as a function of time.",
"The time interval shown in plot 400 is a complete camera frame, from the start of the frame to the end of the frame.",
"(i.e., tframe_start to tframe_end).",
"The intensity of incident light due to ambient background illumination has a constant amplitude of a (402).",
"A small peak of intensity occurs at time 404 due to interreflections from the scene.",
"The highest peak of intensity 406 occurs at time thit.",
"For example, in some cases: (a) a line of laser light sweeps across the scene during each frame, and (b) the sweeping line of laser light reaches a point in the scene and reflects, such that the reflected light reaches the light sensor at time thit.",
"In FIG.",
"4, modulation functions G1(t) to Gn(t) 403 are applied to the n pixel sets in the superpixel, one modulation function per pixel set.",
"In the example shown in FIG.",
"4: (a) n=5; (b) a 5-bit gray code is employed; (c) G1(t) to Gn(t) are the five signals that comprise the 5-bit gray code, one signal per bit of the code, as illustrated in FIG.",
"3.In FIG.",
"4, vi(t) is a value for the ith pixel set in the superpixel.",
"Specifically, vi(t) is equal to the integral of the product of Ix,y(t) and Gi(t) (the ith modulation function).",
"This integral vi(t) is equal to the area of dark region under the curve in plots 408, 410, 412.In plots 408, 410, 412, the curve that defines the top of the dark region is equal to the product of the product of Ix,y(t) and Gi(t).",
"In plot 408, modulation signal G1(t) is signal 315 shown in FIG.",
"3.During the first half of the frame (shown in the left side of plot 408), signal 315 is closed (i.e., equal to 0), and thus the product of Ix,y(t) and G1(t) is equal to zero, and there is no dark region under the curve.",
"During the second half of the frame (shown in the right side of plot 408), signal 315 is open (i.e., equal to 1), and the product of Ix,y(t) and G1(t) is equal to Ix,y(t), and there is a dark region under the curve.",
"In plot 410, modulation signal G2(t) is signal 314 shown in FIG.",
"3.During the first and fourth quarters of the frame, signal 314 is closed (i.e., equal to 0), and thus the product of Ix,y(t) and G2(t) is equal to zero, and there is no dark region under the curve.",
"During the second and third quarters of the frame, signal 314 is open (i.e., equal to 1), and the product of Ix,y(t) and G2(t) is equal to of Ix,y(t), and there is a dark region under the curve.",
"In plot 412, modulation signal Gn(t) is G5(t), which is signal 311 shown in FIG.",
"3.The frame is divided into 32 timeslots.",
"During timeslots in which signal 311 is closed (i.e., equal to 0), the product of Ix,y(t) and G5(t) is equal to zero, and there is no dark region under the curve.",
"During timeslots in which signal 311 is open (i.e., equal to 1), and the product of Ix,y(t) and G5(t) is equal to of Ix,y(t), and there is a dark region under the curve.",
"In FIG.",
"4, the incident light function is identical for each of the pixel sets of the superpixel (that is, Ix,y(t) is the same for all of the pixels in a superpixel, due to their close proximity).",
"However separate modulation signals G1(t) to Gn(t) are applied to the n pixel sets in the superpixel.",
"Thus, each of the pixel sets in the superpixel receives a separate modulation signal.",
"A computer calculates vi(t) (the integral of the product of Ix,y(t) and Gi(t)) for each pixel set in the superpixel 405.For example, a computer calculates v1(t) for the first pixel set which received modulation signal G1(t), and calculates v2(t) for the second pixel set which received modulation signal G2(t), et cetera.",
"A computer also calculates a threshold 413.In some cases, the threshold 413 is equal to (max vi−min vi)/2, where i=1, 2, .",
".",
".",
", n, and max vi is the maximum vi(t) for all the pixels in the superpixel, and min vi is the minumum vi(t) for all the pixels in the superpixel.",
"A computer then calculates code Cx,y 409 for the x, yth superpixel (i.e., the superpixel which has coordinates x, y on the sensor plane).",
"Code Cx,y has the same number of bits as the number of pixel sets in the superpixel.",
"A computer sets the ith bit of code Cx,y to 1 if the vi(t) is greater than the threshold; otherwise the computer sets the ith bit of code Cx,y to 0.In the example shown in FIG.",
"4, the computer: (a) sets the first bit of code Cx,y to 1 because vi(t) is greater than the threshold; (b) sets the nth (in this example, the 5th) bit of code Cx,y to 0 because vn(t) is less than the threshold.",
"Each permutation of code Cx,y corresponds to a unique timeslot (time interval) within a single frame.",
"This unique timeslot is the timeslot within which time thit occurred.",
"Thus, each permutation of code Cx,y is effectively a timestamp that uniquely identifies a timeslot (time interval) within a single camera frame, such that incident light striking the pixel reached its maximum peak during this timeslot.",
"In some 3D depth-sensing implementations of this invention, a galvanometer mirror rotates, causing a plane of laser light to sweep across a scene during each camera frame.",
"The angle of the mirror (and thus the angle of the plane of laser light) is a function of time within the frame.",
"Thus, each permutation of code Cx,y corresponds to a unique timeslot (time interval) within a single camera frame, which in turn corresponds to a unique angle of the plane of laser light.",
"411.A computer uses this angle, and other factors determined during calibration, to compute the 3D position of the scene point that reflected the laser light to the superpixel.",
"The computer stores, for each superpixel and each angle, the 3D position of the corresponding scene point.",
"During subsequent operation of a depth sensor, a computer calculates a permutation of code Cx,y for each superpixel, as described above, and then uses the lookup table to compute the 3D position of the scene point that corresponds to that scene point.",
"In some implementations, each pixel stores charge to only one storage device, which storage device is dedicated to that pixel and does not store charge for any other pixels.",
"(Such an implementation is sometimes herein called “single storage device implementation”, and is also sometimes herein called a “partial illumination implementation”, because less than all of the incident illumination is measured.)",
"In the example shown in FIG.",
"4, each pixel stores charge to only one storage device, which storage device is dedicated to that pixel and does not store charge for any other pixels.",
"Thus, FIG.",
"4 illustrates a single storage device implementation.",
"In single storage device implementations, for each camera frame, the total photodiode charge measured by each pixel in the ith pixel set in a superpixel is equal to the value of vi(t) at the end of the frame (i.e., is equal to vi(tframe_end).",
"This value, in turn, depends on the modulation function Gn(t) that is applied to the ith pixel set.",
"Thus, the modulation function Gi(t) determines the response of the pixels in the ith pixel set to incident light.",
"(In most cases, each superpixel includes only one pixel from each pixel set.",
"In those cases, the ith pixel set is simply the ith pixel.)",
"In some single storage implementations in which a binary code is applied to the pixels, each pixel is turned “off” and “on” many times during the duration of a single camera frame.",
"In many implementations, a pixel is neither “on” during an entire frame, nor “off” during an entire frame.",
"(Putting a pixel with only a single storage device to constant “off” during an entire frame would cause the pixel not to measure any light during the frame.",
"Putting a pixel with only a single storage bin to constant “on” for the whole frame duration would cause the pixel to measure light normally during the entire frame.)",
"In case of the analog modulation, the response for the light measurement ranges from completely “off” to completely “on”, and this signal varies during the camera frame duration.",
"In cases where each pixel has multiple storage devices, the modulation signals also control the response of the pixel to incident light, as discussed below.",
"Modulation of Storage In some implementations, modulation signals control storage of charge in a CMOS pixel.",
"FIGS.",
"5, 7 and 9 show three examples of CMOS circuits, in illustrative implementations of this invention.",
"FIGS.",
"5, 7 and 9 are each a circuit schematic for a portion of a CMOS pixel.",
"The CMOS pixel has one floating diffusion storage device.",
"COL means column selector 507.FD means floating diffusion 509.The floating diffusion stores electric charge.",
"PD RST means photodiode reset transistor 513.ROW means row selector 511.TX means gate transistor 503 in FIGS.",
"5 and 7.TXi means gate transistor 523 in FIG.",
"9.TX ROW means row selector 505 for charge transfer.",
"PD RST ROW means photodiode row selector 521.RST means floating diffusion reset transistor 517.RST causes floating diffusion 509 to be reset (i.e., the charge in floating diffusion 509 to be drained) when RST is high.",
"SF means source follower 515.The source follower is used during the readout.",
"V means voltage source.",
"In FIGS.",
"5 and 6, TX causes charge to be transferred from the photodiode 501 to floating diffusion 509 when voltages at COL and TX ROW are simultaneously high.",
"In FIGS.",
"9 and 10, TXi causes charge to be transferred from the photodiode 501 to the storage FD 509 when TXi is high.",
"In FIGS.",
"7 and 8, PD RST causes photodiode 501 to be reset (that is, the charge in photodiode 501 to be drained) when COL and PD RST ROW are simultaneously high.",
"In FIGS.",
"5, 6, 9 and 10, PD RST causes photodiode 501 to be reset (that is, the charge in photodiode 501 to be drained) when PD RST is high.",
"In FIGS.",
"5, 6, 7, 8, 9 and 10, readout occurs when voltages at COL and ROW are simultaneously high.",
"FIGS.",
"6, 8 and 10 are timing diagrams for FIGS.",
"5, 7 and 9, respectively.",
"In FIGS.",
"6, 8 and 10, the entire exposure occurs during a single camera frame, and readout and floating diffusion reset occur after the frame.",
"In FIGS.",
"6, 8 and 10, ModExp 531 is a modulation signal that is one of the components of the n-bit code.",
"Certain other signals in these Figures are derived from ModExp, as discussed below.",
"At multiple times during the single camera frame, the then accumulated charge in photodiode 501 is transferred to floating diffusion 509 (i.e., each time that the voltages at COL and TX ROW are simultaneously high).",
"Also, at multiple other times during a single camera frame, the then accumulated charge in photodiode 501 is drained without being readout or measured (e.g., when PD RST is high during 551, 552, 553, 554, 555 in FIG.",
"6, when both PD RST ROW and COL are high during 561, 562, 563 in FIG.",
"8, and when PD RST is high during 571, 572, 573, 574, 575 in FIG.",
"10).",
"FIG.",
"11 is a conceptual diagram of a superpixel, in which each pixel has multiple storage devices.",
"Each pixel stores charge to multiple storage devices.",
"Each of these multiple storage devices is dedicated to only that pixel and does not store charge for any other pixel.",
"For example, pixel 1103 has a set of multiple storage devices 1125, and pixel 1105 has a non-overlapping set of multiple storage devices 1135.In the example shown in FIG.",
"11, light from a scene 1100 strikes the photodiode (e.g., 1107, 1109) of each pixel (e.g., 1103, 1105) in a superpixel 1101.For each pixel, modulation signals cause the then accumulated photodiode charge in the pixel to be transferred to one of the storage devices for that pixel.",
"Which storage device receives a particular transfer of charge is determined by the modulation signal.",
"For example, for pixel 1103, a modulation signal causes transfer gate 1111 to transfer charge from photodiode 1107 to storage device 1121 at some times during a single camera frame, and causes transfer gate 1113 to transfer charge from photodiode 1107 to storage device 1123 at some other times during the camera frame.",
"Likewise, for pixel 1105, a different modulation signal causes transfer gate 1115 to transfer charge from photodiode 1109 to storage device 1131 at some times during a single camera frame, and causes transfer gate 1117 to transfer charge from photodiode 1109 to storage device 1133 at some other times during the camera frame.",
"FIG.",
"12 is a circuit schematic for a portion of a CMOS pixel that has three floating diffusion storage devices.",
"In FIG.",
"12: COL means column selector 507.FD1 is floating diffusion 549.FD2 is floating diffusion 559.FD3 is floating diffusion 569.PD RST is photodiode reset transistor 513.In FIG.",
"12, PD RST causes photodiode 501 to be reset (that is, the charge in photodiode 501 to be drained) when PD RST is high.",
"ROW is row selector 511.RST1 is floating diffusion reset transistor 547.RST2 is floating diffusion reset transistor 557.RST3 is floating diffusion reset transistor 567.In FIG.",
"12: (a) RST1 causes floating diffusion 509 to be reset when RST1 is high; (b) RST2 causes floating diffusion 509 to be reset when RST2 is high; and (c) RST3 causes floating diffusion 509 to be reset when RST3 is high.",
"The reset causes charge in floating diffusion 509 to be drained.",
"SF is source follower 515.TXi1 is transfer gate 543.TXi2 is transfer gate 553.TXi3 is transfer gate 563.In FIG.",
"12: (a) TXi1 causes charge to be transferred from the photodiode 501 to the storage FD1 549 when TXi1 is high; (b) TXi2 causes charge to be transferred from the photodiode 501 to the storage FD2 559 when TXi2 is high; and (c) TXi3 causes charge to be transferred from the photodiode 501 to the storage FD3 569 when TXi3 is high.",
"In some implementations, modulation signals control storage of charge for CCD pixels.",
"FIG.",
"13 is a conceptual diagram of CCD pixels, in which each pixel has two storage devices.",
"During a single camera frame, for each pixel in the array, charge is transferred from the photodiode of the pixel at some times to one of the storage devices for the pixel, and at other times to the other storage device for the pixel.",
"For example, during a single camera frame: (a) a modulation signal causes the then accumulated photodiode charge in pixel 1312 to be transferred to a capacitive bin at position 1311 at some times, and to be transferred to a capacitive bin at position 1303 at some other times; and (b) a separate modulation signal causes the then accumulated photodiode charge in pixel 1315 to be transferred to a capacitive bin at position 1314 at some times, and to be transferred to a capacitive bin at position 1316 at some other time.",
"After the end of the frame, the charges are shifted down each column of the array in a conventional CCD manner.",
"For example, charge is read out from the capacitive bin at position 1316 at the edge of the array, then the charge in the capacitive bin at position 1315 is shifted to the capacitive bin at position 1316, then the charge in the capacitive bin at position 1314 is shifted to the capacitive bin at position 1315, then the charge in the capacitive bin at position 1313 is shifted to the capacitive bin at position 1314, then the charge in the capacitive bin at position 1312 is shifted to the capacitive bin at position 1313, then the charge in the capacitive bin at position 1311 is shifted to the capacitive bin at position 1312.Then the charge is read out again from the capacitive bin at position 1316 at the edge of the array, etc.",
"FIG.",
"14 is a conceptual diagram of CCD pixels, in which each pixel has four storage devices.",
"During a single camera frame, for each pixel in the array, charge is transferred from the photodiode of the pixel at some times to the first storage device for the pixel, at other times to the second storage device for the pixel, at yet other times to the third storage device for the pixel, and at yet other times to the fourth storage device for the pixel.",
"For example, during a single camera frame, a modulation signal causes the then accumulated photodiode charge in pixel 1411: (a) to be transferred to a capacitive bin at position 1453 at some times; (b) to be transferred to a capacitive bin at position 1455 at some other times; (c) to be transferred to a capacitive bin at position 1457 at some times; and (d) to be transferred to a capacitive bin at position 1459 at some other times.",
"After the end of the frame, the charges are shifted down each column of the array in a conventional CCD manner.",
"In a pixel with two storages, one storage is by convention considered to be the primary storage.",
"The “on” state of modulation of such a pixel means that the charge is transferred to the primary storage.",
"The “off” state of the modulation of such a pixel means that the charge is transferred to the secondary storage.",
"The image recovered from the primary storages is the “positive” image, accumulated during the “on” phases.",
"The image recovered from the secondary storages is the “negative” image, accumulated during the “off” phases.",
"Summing these two together gives the total image, i.e.",
"an image which would be captured by an ordinary (unmodulated) camera.",
"As used herein, a “multiple storage implementation” or “total charge implementation” means an implementation in which each pixel has multiple storage devices that receive charge only from that pixel during the exposure time of a frame.",
"Such an implementation is sometimes called a “total charge implementation” to emphasize that charge is not, by design, drained at some times during the frame without being measured.",
"1Multiple storage implementations are advantageous for at least two reasons.",
"First, in some multiple storage implementations, a computer calculates a dynamic threshold depending on the total illumination for a particular pixel.",
"For example, in some cases, instead of having a fixed threshold for deciding whether a pixel's value represents a logical 0 or logical 1 in code Cx,y (see discussion of FIG.",
"4), a computer compares the pixel's value to a threshold computed, for example, as 50% of the total value.",
"Second, in some multiple storage implementations, a computer calculates a total image for a single frame, by summing, for each pixel, the sum of the charges captured by the multiple storage devices for that pixel during that frame.",
"In most implementations, the modulation signals that comprise a code (such as signals 311-315 in FIG.",
"3) do not directly control timing within the pixel.",
"Instead, electronic circuitry in the image sensor, or in the camera circuitry, or in the control unit converts each modulation signal to one or more intermediate signals, which directly or indirectly control timing within each pixel or pixel set, such as the timing of (i) photodiode reset, (ii) floating diffusion reset, (iii) readout, (iv) transfer of charge from photodiode to floating diffusion or to a capacitive bin; or (v) CCD shifts, in the case of a CCD.",
"For example, in some implementations using CMOS pixels, the intermediate signals comprise high or low (binary values) of voltage applied to TX, TXi, TXi1, TXi2, TXi3, RST, RST1, RST2, RST3, TD ROW, PD RST, or PD RST ROW.",
"In some cases, changes in an intermediate signal are triggered by the rising edge, falling edge or both of the modulation signal.",
"In some cases, changes in an intermediate signal occur at a specified delay after the rising edge, falling edge or both of the modulation signal.",
"In some cases, changes in an intermediate signal are the logical complement of the modulation signal (i.e., 0 if the modulation signal is 1, or 1 if the modulation signal is 0).",
"In some cases, an intermediate signal that triggers transfer of charge from a photodiode to floating diffusion (i) becomes high when the modulation signal goes from high to low, stays there for a small amount of time necessary to transfer the charge, and goes low; and (ii) ignores the low-to-high transition of modulation signal.",
"Delayed signals are desirable in some cases when it is known that different elements of the pixel circuit have different latencies, or require different times to transfer the charge.",
"In some implementations, constraints imposed by the hardware implementation require that the modulation signals satisfy one or more logical conditions.",
"For example, in some multiple storage implementations, the following logical condition must be satisfied: at any one time, at most one modulation signal per pixel is in a state that triggers transfer of charge.",
"This is because if more than one transfer gate is open, the charge from photodiode splits between the storages, which is undesirable.",
"In some other implementations, a logical condition is that storage modulation signals add up to 1.This invention is not limited to binary coding.",
"As used herein, “n-ary code” means code in which the digits are expressed in base n, where n is an integer greater than 2.For example, 3-ary code is written in base 3, and is sometimes called ternary code.",
"In some embodiments of this invention, ternary code is used with pixels that each have two storage devices.",
"In that case, three values of the ternary code (“A”,“B”,“C”) signal causes the charge to be transferred into storage “A”, into storage “B”, or trashed, respectively.",
"In some cases: (a) each pixel has three storage devices; (b) ternary code is used; (c) instead of trashing the light in the “C” case, the charge is transferred into the third storage (“C”); and (d) A+B+C are summed to get the total amount of light.",
"In some implementations that employ n-ary code, each pixel has n−1 or n storages.",
"With n−1 storage devices per pixel, the n-ary code is recoverable.",
"With n storage devices per pixel, the n-ary code and total amount of light are recoverable.",
"In some implementations that employ n-ary code and that use n storage devices per pixel, the values 0, 1, .",
".",
".",
", n−1 of the n-ary code cause the charge to be transferred into the 1st, 2nd, .",
".",
".",
", nth storage, respectively.",
"The total illumination image is obtained by summing all values of the 1st, 2nd, .",
".",
".",
", nth storage.",
"In some implementations that employ n-ary code and that use n−1 storage devices per pixel, the value 0 causes the photodiode charge to be drained, in some cases without being saved for later readout.",
"The values 1, .",
".",
".",
", n−1 of the n-ary code cause the charge to be transferred into the 1st, 2nd, .",
".",
".",
", (n−1)th storage, respectively.",
"In some implementations, modulation of pixel storage is controlled by an n-ary code, such that all of the photodiode charge of each pixel is stored for later readout.",
"FIG.",
"15 shows an example of this approach.",
"In FIG.",
"15, each pixel has n storage devices, and storage modulation for the kth pixel in a superpixel includes the following steps: A computer evaluates x, which is the value of the kth digit of an n-ary code of length m (Step 1501), and causes the photodiode charge in the kth pixel to be transferred to the (x+1)th storage device for the kth pixel.",
"(Step 1503).",
"For example, if x equals 0, then the pixel's photodiode charge is transferred to the first storage device for the pixel.",
"For example, if x equals n−1, then the pixel's photodiode charge is transferred to the nth storage device for the pixel.",
"If a superpixel has more than one pixel that is a member of the kth pixel set and the method shown in FIG.",
"15 is used, then storage modulation for each of these pixels is done simultaneously, in the manner shown in FIG.",
"15.In some implementations, modulation of pixel storage is controlled by an n-ary code, such that only a portion of the photodiode charge of each pixel is stored for later readout.",
"FIG.",
"16 shows an example of this approach.",
"In FIG.",
"16, each pixel has multiple (e.g., n−1) storage devices, and storage modulation for the kth pixel in a superpixel includes the following steps: A computer evaluates x, which is the value of the kth digit of a modulation code.",
"(Step 1601) If x equals 0, then the photodiode charge in the kth pixel is drained, and is not saved for later readout.",
"(Step 1603) If x is not equal to 0, then the photodiode charge in the kth pixel is transferred to the (x+1)th storage device for the kth pixel.",
"(Step 1605).",
"If a superpixel has more than one pixel that is a member of the kth pixel set and the method shown in FIG.",
"16 is used, then storage modulation for each of these pixels is done simultaneously, in the manner shown in FIG.",
"16.FIG.",
"17 is a flowchart for decoding n-ary code, after storage modulation in which only a portion of the photodiode charge is stored for later readout.",
"In FIG.",
"17, the code that is being decoded has m digits, and each pixel has multiple (e.g., n−1) storage devices.",
"Decoding for each superpixel includes the following steps: A computer sets k equal to zero (Step 1701).",
"A computer evaluates if k is greater than m−1.",
"(Step 1703) If yes, then decoding stops for that superpixel, and the computer repeats the decoding for each of the superpixels, until all of the superpixels are decoded.",
"(Step 1715) If no, then a computer detects the storage value (i.e., level of charge stored in a storage device) for each of the multiple storage devices of the kth pixel.",
"(Step 1705) A computer determines if any of these storage values exceed a threshold.",
"(Step 1707).",
"If none of these storage values exceed the threshold, then a computer sets the kth digit of the code to zero.",
"(Step 1709) If at least one of these storage values exceeds the threshold, then a computer: (a) determines the maximum storage value, out of these storage values (Step 1711), (b) determines that the maximum storage value is stored in the xth storage device for the kth pixel (Step 1712), (c) sets the kth digit of the code to x (Step 1713) and (d) sets k equal to k+1 (Step 1714) If a superpixel has more than one pixel that is a member of the kth pixel set, then the method in FIG.",
"17 is modified for that superpixel so that: (a) in Step 1705, a computer determines storage values for each of the storage devices for each of the pixels in the superpixel that are members of the kth pixel set; and (b) in Step 1707, a computer determines that the maximum storage value, out of these storage values, is stored in the xth storage device of one of these pixels.",
"FIG.",
"18 is a flowchart for decoding n-ary code, after storage modulation in which all of the photodiode charge is stored for later readout.",
"In FIG.",
"18, the code that is being decoded has m digits, and each pixel has n storage devices.",
"Decoding for each superpixel includes the following steps: A computer sets k equal to zero (Step 1801).",
"A computer evaluates if k is greater than m−1.",
"(Step 1803) If yes, then decoding stops for that superpixel, and the computer repeats the decoding for each of the superpixels, until all of the superpixels are decoded.",
"(Step 1815) If no, then a computer detects the storage value (i.e., level of charge stored in a storage device) for each of the multiple storage devices of the kth pixel.",
"(Step 1805) A computer: (a) determines the maximum storage value, out of these storage values (Step 1807), (b) determines that the maximum storage value is stored in the xth storage device for the kth pixel (Step 1809), (c) sets the kth digit of the code to x−1 (Step 1811), and sets k equal to k+1 (Step 1813).",
"If a superpixel has more than one pixel that is a member of the kth pixel set, then the method in FIG.",
"17 is modified for that superpixel so that: (a) in Step 1705, a computer determines storage values for each of the storage devices for each of the pixels in the superpixel that are members of the kth pixel set; and (b) in Step 1707, a computer determines that the maximum storage value, out of these storage values, is stored in the xth storage device of one of these pixels.",
"Analog Modulation In some cases, the modulation signals are analog signals.",
"In some cases, modulations signals (either digital or analog) undergo at least one change between camera frames.",
"FIG.",
"19 is diagram that illustrates three examples of analog modulation signals that change from frame to frame.",
"Signal 1901 is an aperiodic signal in both frame 1 and frame 2.Signal 1903 is a periodic signal that is sinusoidal in frame 1 and non-sinusoidal in frame 2.In frame 1, signal 1905 is a periodic triangle wave that is shifted upward so that the minimum value is zero.",
"In frame 2, signal 1905 is aperiodic.",
"In some cases, an analog modulation signal is negative at times, such as signal 1901 at time 1907 in FIG.",
"19.In some cases, a “negative” value of a modulation signal is implemented as follows: the storage is pre-charged by a fixed amount of charge.",
"For a negative portion of the modulation signal, a transfer gate is opened to release an amount of charge from the storage device proportional to the absolute value of the modulation signal.",
"During the readout phase, a computer treats the pre-charged amount as the zero value, treats an amount of charge below this value as a negative readout; and treats an amount of charge larger than the pre-charge amount as a positive readout.",
"Light Modulation In some implementations, modulation signals control the intensity of light incident on the photodiode of a pixel.",
"FIG.",
"20 is a conceptual diagram illustrating the use of a reflective SLM (spatial light modulator) for modulating the intensity of light incident on the photodiodes of pixels in a superpixel.",
"In the example shown in FIG.",
"20, light from a scene 2001 strikes reflective SLM 2003 and is selectively reflected, such that which of the pixels, if any, of a superpixel 2005 are illuminated by reflected light from SLM 2003 at any given time during a camera frame is controllable.",
"For example, which pixels, out of 2007, 2009 and 2011, are illuminated by reflected light from SLM 2003 varies during a single camera frame.",
"For example, in some cases, during a single camera frame: (a) at some times pixel 2007 is illuminated by reflected light from SLM 2003 but pixels 2009 and 2011 are not; and (b) at other times pixels 2007 and 2009 are illuminated by reflected light from SLM 2003 but pixel 2011 is not.",
"In some cases, the reflective SLM comprises a DMD (digital micromirror device) or a reflective LCOS (liquid crystal on silicon) device.",
"FIG.",
"21 is a ray diagram that shows a DMD selectively reflecting light from a scene at a particular time, such that reflected light is steered toward some, but not all, of the pixels in a superpixel of an image sensor.",
"In the example shown in FIG.",
"21, the pixels in the image sensor and pixels of the DMD array are optically aligned, such that each pixel of the DMD corresponds to a pixel of the image sensor.",
"The pixels in the DMD array are switched between two states, “A” and “B”.",
"When the mirror for a DMD pixel is in the “A” state, the mirror reflects the light to the corresponding pixel in the image sensor.",
"When the mirror for a DMD pixel is in the “B” state, the light is reflected in another direction.",
"By switching a DMD pixel between these two states, the light incident on the corresponding pixel of the image sensor is modulated, and thus the response of the pixel to the light coming from the scene is modulated.",
"In the example shown in FIG.",
"21, pixels in a DMD array 2105 are optically aligned with pixels in image sensor 2103.For example, DMD pixels 2111, 2113 and 2115 correspond to image sensor pixels 2121, 2123 and 2125, respectively.",
"Light from a scene 2101 is striking DMD pixels 2111, 2113 and 2115.DMD pixels 2111 and 2113 are in state “A”, such that light reflects from these pixels to image sensors 2123 and 2123, respectively.",
"DMD pixel 2115 is in state “B”, such that light reflects from this DMD pixel in a direction away from image sensor 2125, thus causing the reflected light not to reach image sensor pixel 2125.Image sensor pixels 2111, 2113 and 2115 are all in the same superpixel.",
"FIG.",
"22 is a conceptual diagram illustrating the use of a transmissive SLM for modulating light incident on photodiodes of pixels in a superpixel.",
"In the example shown in FIG.",
"22, light from a scene 2201 passes through transmissive SLM 2203, and is selectively attenuated, such that which of the pixels, if any, of a superpixel 2005 are illuminated by light passing through the SLM at any given time during a camera frame is controllable.",
"For example, which pixels, out of 2207, 2209 and 2211, are illuminated by light passing through SLM 2203 varies during a single camera frame.",
"For example, in some cases, during a single camera frame: (a) at some times pixel 2207 is illuminated by light passing through SLM 2203 but pixels 2209 and 2211 are not; and (b) at other times pixels 2207 and 2209 are illuminated by light passing through SLM 2203 but pixel 2011 is not.",
"In some cases, the transmissive SLM comprises an LCD (liquid crystal display) or an array of ferromagnetic shutters.",
"FIG.",
"23 is a ray diagram showing an LCD selectively attenuating light from a scene at a particular time, such that light passing through the LCD reaches some, but not all, of the pixels of a superpixel in an image sensor.",
"In the example shown in FIG.",
"21, the pixels in the image sensor and pixels of the LCD are optically aligned, such that each pixel of the LCD corresponds to a pixel of the image sensor.",
"The pixels in the LCD array are switched between two states, “on” and “off”.",
"When an LCD pixel is in the “on” state, light from the scene passes through the LCD pixel and travels to the corresponding pixel in the image sensor.",
"When an LCD pixel is in the “off” state, the LCD pixel is opaque and blocks light.",
"By switching an LCD pixel between these two states, the light incident on the corresponding pixel of the image sensor is modulated, and thus the response of the pixel to the light coming from the scene is modulated.",
"In the example shown in FIG.",
"23, pixels in LCD 2303 are optically aligned with pixels in image sensor 2309.For example, LCD pixels 2311, 2313, 2315 and 2317 correspond to image sensor pixels 2321, 2323, 2325 and 2327, respectively.",
"Light from a scene 2301 is striking LCD pixels 2311, 2313, 2315 and 2317.LCD pixels 2311, 2313, 2315 are in the “on” state, such that light passes through these LCD pixels and travels to image sensors 2321, 2323 and 2325, respectively.",
"LCD pixel 2317 is in the “off” state, such that LCD pixel 2317 is opaque, thus preventing light from passing through LCD pixel 2317 and traveling to image sensor pixel 2327.Image sensor pixels 2321, 2323, 2325 and 2327 are all in the same superpixel.",
"In FIG.",
"23, a camera 2307 includes a lens 2305 and the image sensor 2309.The lens bends light from the LCD 2303.Similarly, in some cases: (a) a lens is interposed between a reflective SLM (such as a DMD or reflective LCOS) and the image sensor, and (b) the lens bends light rays that travel from the reflective SLM through the lens to the reflective SLM.",
"FIGS.",
"24A, 24B and 24C are each a diagram of an optical system that includes a transmissive SLM.",
"In each of FIGS.",
"24A, 24B and 24C, the SLM selectively attenuates light, such that at different times during a single camera frame, the SLM blocks light from reaching different sets of the pixels in the image sensor.",
"In FIG.",
"24A, a transmissive SLM 2401 is adjacent to the image sensor 2405.In FIG.",
"24A, light travels from an object in the scene 2403 through an imaging lens 2407, then through the SLM 2401, and then to the image sensor 2405.In FIG.",
"24B, an imaging lens 2407 is positioned between the transmissive SLM 2401 and the image sensor 2405.In FIG.",
"24B, light travels from an object in the scene 2403, then through the SLM 2401, then through an imaging lens 2407, and then to the image sensor 2405.In FIG.",
"24C, a field lens and relay lens are positioned between the transmissive SLM 2401 and the image sensor 2405.In FIG.",
"24C, light travels from an object in the scene 2403, then through an imaging lens 2407, then through the SLM 2401, then through a field lens 2411, then through a relay lens 2409, and then to the image sensor 2405.In some implementations in which an SLM is used, a computer separately controls each pixel in the SLM, and thus the computer controls the size and shape of a superpixel in the image sensor.",
"For example, in some cases, a computer sends signals to a reflective or transmissive SLM, such that 9 pixels comprise a 3×3 pixel superpixel, or such that 12 pixels comprise a 4×3 pixel superpixel, or such that 16 pixels comprise a 4×4 pixel superpixel.",
"In some cases, a reflective or transmissive SLM does not have the same size or shape as the image sensor.",
"In those cases: (a) some pixels in the image sensor do not correspond to pixels in the SLM; and (b) light modulation is applied only to pixels in the image sensor that are aligned with pixels in the SLM.",
"In some cases: (a) the pixels in the SLM and camera are not precisely aligned; and (b) pixels for which the imprecision exceeds a given threshold are ignored.",
"The value at that position is interpolated or returned as “unknown”.",
"In many cases where a reflective or transmissive SLM is used, each pixel has only storage device that is dedicated to that pixel and does not receive charge from any other pixel during the exposure time of a camera frame.",
"Comparison to Time-Multiplexed Structured Illumination It is interesting to compare this invention to conventional time-multiplexed structured illumination.",
"FIG.",
"25 is a conceptual diagram that shows a prior art example of conventional time-multiplexed structured illumination.",
"In FIG.",
"25, the camera 2511 sensitivity is not modulated.",
"The laser 2503 and a Powell lens (not shown) project a plane of laser light 2505.The line of laser light 2505 sweeps across the scene during each camera frame.",
"The intensity of the laser light is modulated by a binary modulation pattern, causing the laser light to turn on and off repeatedly during a single sweep.",
"The camera captures a single frame during the sweep of the laser light across the scene.",
"In the image 2517 captured during this frame, the dark stripes 2533, 2535, 2537, 2539 correspond to the times during the sweep at which the laser light is turned off.",
"In conventional time-multiplexed structured illumination (such as that shown in FIG.",
"25): (a) n separate modulation signals that comprise the n-bit code are applied during n separate frames of the camera, one modulation signal per frame, to modify illumination of the scene; and (b) the sensitivity of the camera to light is not modulated.",
"In contrast, in illustrative implementations of this invention: (a) all n separate modulation signals that comprise an n-bit code are applied during a single frame of a camera, to separately modify the response of n pixels in each superpixel to incident light; and (b) the intensity of the light source is kept constant during the sweep of the plane of light.",
"In illustrative implementations, this invention captures in a single camera frame the same type of data as is captured during multiple camera frames with time-multiplexed structured illumination.",
"Capturing all of the data in a single frame (in illustrative implementations of the present invention) rather than in multiple frames (as in conventional time-multiplexed structured illumination) has the desirable effect of reducing distortion and artifacts in 3D sensing that are caused by motion blur.",
"3D Scanning In illustrative implementations, this invention is used for 3D scanning—i.e., for detection of the 3D position of points in a scene.",
"In illustrative implementations, a system comprises at least one camera with a modulatable image sensor, an optional ordinary camera, a control unit, a processing unit, and at least one illumination unit.",
"Modulation of pixels of a superpixel during a camera frame creates a specific code in the pixels of the superpixel In this system, a light source emits light, such that the position of the intersection of the light and the scene changes over time.",
"In illustrative implementations, the spatio-temporal characteristics of the light source are such that the spatial position of a point of the scene captured by a superpixel is computationally recoverable from the camera calibration, the relative position of the light source and the camera, and the charge values recorded by the pixels of the superpixel during a single frame of a camera.",
"In illustrative implementations, the spatiotemporal characteristics of the light source are such that: (a) for a given point in the scene, the time function of the intensity of direct illumination from the light source in a point of the scene exhibits only one peak; and (b) the intersection of (1) the set of the points illuminated at time t and (2) the pixel ray of the superpixel has only one solution, given constraints consisting of the field of view of the camera, light source field of view, angle of the light emitted by the light source, and the relative position of camera and the light source.",
"FIG.",
"26 is a conceptual diagram that illustrates a moving line of light produced by controlled movement of a light source (not shown in FIG.",
"26).",
"For example, in some cases the light source comprises an object that emits light, such as a laser or directional LED.",
"In other cases, the light source comprises a specular surface (such as a galvanometer-actuated mirror) that reflects light.",
"In the example shown in FIG.",
"26, a line of light sweeps across a scene, such that it intersects the scene at different spatial positions at times 2601, 2603, 2605, 2607, 2609.FIGS.",
"27A, 27B and 27D show three examples of light sources that produce a line of light that sweeps across a scene, in some implementations of this invention.",
"FIG.",
"27A is a diagram, which shows a rotating mirror that reflects a rotating line of light.",
"The mirror 2701 rotates about axis of rotation 2703, which axis is perpendicular to FIG.",
"27A.",
"A laser 2705 shines a laser beam through a Powell lens (not shown in FIG.",
"27A).",
"The Powell lens transforms the laser beam into a plane of laser light.",
"As the mirror rotates, the angle of the plane of reflected laser light varies as a function of time.",
"For example, at one time during the sweep, the plane of the laser light is aligned with direction 2711, and at another time during the sweep the plane of the laser light is aligned with direction 2713.FIG.",
"27B is a diagram, which shows a projector 2721 that projects a moving line of light.",
"The line of light is aligned with different directions at different times.",
"For example, the line of light is aligned, at different times, with directions 2723, 2725, 2727.FIG.",
"27C is a diagram, which shows an array of directional light sources (e.g., 2731, 2733, 2735, 2737) that, taken together, emit a moving line of light.",
"The line of light is aligned with different directions at different times.",
"For example, the line of light is aligned, at different times, with directions 2741, 2743, 2745.In illustrative implementations, 3D scanning is implemented as follows, for each superpixel: (a) n modulation signals are applied to n separate sets of pixels in a superpixel during a single camera frame, one modulation signal per pixel set, such that at least pixel in the superpixel is a member of each pixel set; (b) each modulation signal modulates the response of pixels to light from a scene, which light is incident on the pixel unit; (c) a computer determines a unique permutation of the n modulation signals, which permutation occurred at a time (the “hit time”) when the intensity of light reflected from the scene and incident on the pixel unit reached a maximum for the frame; (d) a computer uses this unique permutation to perform a first algorithm to compute 3D coordinates of a point in the scene, which point is the position in the scene from which light reflected directly to the superpixel at the hit time; and (e) the first algorithm includes computing the 3D coordinates of the point by triangulation or includes accessing values from a lookup table, which lookup table was computed by a second algorithm that includes computing 3D depth by triangulation.",
"In some implementations, depth-sensing is implemented as follows: The n pixels in the superpixel record n separate modulation signals during a single frame of the camera, which correspond to the n bits of an n-bit code.",
"A rotating mirror causes a plane of laser light to sweep across a scene during each camera frame.",
"A complete sweep of the laser plane of light occurs during each camera frame.",
"There are 2n permutations of the n-bit code, corresponding to 2n timeslots in each camera frame.",
"The intensity of incident light at the superpixel is highest during a single timeslot in which the laser light reflects from the scene to the superpixel.",
"Based on the permutation of the n modulation signals that is recorded by the superpixel at the “hit point” (when the intensity of incident light is highest), a computer determines the timeslot during which the hitpoint occurred.",
"This timeslot in turn uniquely identifies the angle of rotation of the plane of laser light when the hitpoint occurred.",
"From the angle of rotation of the plane of laser light, and from the known positions of the light source and of the pixel ray for the pixel, a computer calculates the 3D coordinates of the intersection of the pixel ray and the plane of laser light.",
"This intersection is located at the scene point that directly reflected the laser light to the superpixel.",
"This process is repeated for each scene point, yielding a cloud of computed 3D points in the scene.",
"In some 3D scanning implementations of this invention, one or more processors (e.g., in processing unit 2805 in FIG.",
"28) perform calculations that take the camera output, calibration, and other static or dynamic parameters, and produce a description of the scene, including a 3D reconstruction of the surface geometry of the scene.",
"In some 3D scanning implementations of this invention, binary Gray code of length 9 is used for pixel set modulation.",
"The illumination subsystem projects a sweeping laser line.",
"The 9-bit vector represents the time t (within the frame 0<t<Tframe) at which the laser line passed that part of the image which contributes to the camera pixel illumination (under the assumption that the scene is consistent—i.e., that there is no excessive reflection and scattering).",
"The output of the camera pixels is used to decode the 9-bit vector and the time t within the frame.",
"The time t identifies the position of the laser line and therefore identifies a plane in the space (due to the fact that the optical system is aligned with known parameters).",
"With this information, one or more processors identify a point in 3D space using a triangulation technique FIG.",
"28 is a block diagram of hardware components of a 3D scanning system, which components comprise an illustrative implementation of this invention.",
"The scanning system comprises an illumination subsystem 2801, control unit 2803, processing unit 2805, and camera subsystem 2807.In this system, one or more signal generators (e.g., 2802, 2820, 2806) or one or more computers (e.g., control unit 2803 or processing unit 2805) causes separate modulation signals to be created, which modulation signals control the sensitivity of multiple sets of pixels in the imaging sensor 2809 in camera subsystem 2807.The signal generators (e.g., 2802, 2820, 2806) comprise one or more signal generators, function generators, digital pattern generators, frequency generators or any other electronic device that generates repeating or non-repeating electrical signals, including either digital or analog signals.",
"The system includes one or more computers (e.g., control unit 2803 or processing unit 2805), which include memory devices (e.g., 2804, 2810) The illumination subsystem 2801 comprises a laser 2921, optics 2923, and a galvanometer-actuated optical scanner 2925.The optics 2923 comprise a Powell lens 2927 (for changing a dot of laser light into a line of laser light), a mirror 2929, and another lens 2913.The camera subsystem 2807 comprises optical elements 2808 and image sensor 2809.The optical elements 2808 comprise any optical elements used to transfer or direct light from the scene to the sensor, or to filter the light from the scene.",
"The optical elements include lenses 2820 (e.g., adjustable lenses) arranged in an appropriate (static or dynamic) position, and other optical elements 2822.For example, in some cases, the other optical elements 2822 include (i) one or more spatial light modulators, mirrors, filters, optical fibers, or other light modulators or devices for attenuating, transferring, filtering, or directing light, and (ii) any adjustable optical elements that transfer, or direct light from the scene to the sensor (e.g., adjustable aperture shape, adjustable aperture size, adjustable aperture position, or other), or to filter the light from the scene (e.g.",
"wavelength, polarization, incident angle, incident position of other).",
"The adjustable optical elements are controlled by control unit 2803.The camera subsystem 2807 is a system for capturing images of the scene 2811 using image sensor 2809.The image sensor consists of plurality of pixels (e.g.",
"thousands of pixels, or millions of pixels, or billions of pixel, or any other number).",
"During 3D scanning, the galvanometer-actuated optical scanner 2925 controls mirror position and thus the direction of the projected line of laser light.",
"The position/orientation of camera subsystem and illumination subsystem is fixed for the life-time of the system.",
"The illumination subsystem comprises the controlled laser light deflection system.",
"The baseline is the distance between camera center and the light deflection system (the position of galvanometer-actuated mirror).",
"The control unit 2803 controls the orientation (angle) of the galvanometer-actuated mirror by applying of time-changing electrical signal.",
"The mirror reflects the laser line, which creates a continuous sweep of the plane illuminated by the laser line.",
"The value of the control signal is continuous and is any signal between minimal value (correspond to boundary angle of the mirror—αmin) and maximal value (correspond to second boundary angle of the mirror—αmax).",
"The angle of the mirror changes from αmin to αmax in linear fashion proportional to control signal.",
"The operator calibrates the system at least once.",
"During the calibration, the operator uses an automatic/semi-automatic calibration process to calibrate internal parameters of the camera.",
"To calibrate the mutual position/orientation of the camera subsystem and the laser plane in any given angle α, the operator performs triangulation The position/orientation is calibrated in predefined angles αi (iϵ0 .",
".",
".",
"n−1; α0=αmin, and αn−1=αmax).",
"The algorithm calculates the equation of the plane defined by the laser line for every angle of deflection mirror αi, as follows: nix*x+niy*y+niz*z+di=0, where x, y, z are Euclidian coordinates in world coordinate space; ni is the 3D normal vector of the plane (the angle between ni and ni+1≤π rad).",
"And di is the orthogonal distance between the plane and the center of the origin.",
"The computed equations are stored in memory.",
"In runtime, the algorithm computes the equation of the plane for any other a between αi and αi+1 (αi<αi+1) using interpolation.",
"While the angle of the mirror is controlled by linear signal, a computer calculates the exact plane equation for any α i (the algorithm computes new normal vectors n and d. At first, it uses binary search to find indexes i and i+1.The n lies in same plane as ni and ni+1.The angle |n; ni|:|n; ni+1|=|α−αi|:|αi+1−α| and |n; ni+1|+|n; ni+1|=|ni; ni+1| (symbol “|; |” means the angle between vectors, symbol “:” means the ratio between two real values).",
"The distance d=di+[(α−αi)/(αi+1−αi)]*(di+1−di)−(symbol “/” means division of real numbers and symbol “*” means multiplication of real numbers).",
"During operation, the control unit controls the angle of the deflection mirror and the modulation signals to individual sets of pixels.",
"The system works in cycles (frames).",
"One cycle comprises a setup phase, exposure phase, readout phase, processing phase and output phase.",
"The individual phases are processed in a pipeline, so that the exposure phase of the current frame is executed simultaneously with the processing phase of previous frame.",
"During the setup phase, the control unit prepares the illumination subsystem and the camera subsystem for the upcoming exposure phase.",
"This preparation includes image sensor reset, preparation of modulation signals (from the modulation functions), setting of image sensor exposure, setting the angle of deflection mirror to αmin, and adjusting the power of the laser.",
"In some implementations, control unit perform other preparatory steps.",
"During the exposure phase, the control unit sends the signal to illumination subsystem, to turn on the laser source and to change the angle of deflection mirror.",
"If T is the time of frame exposure in seconds (0≤t≤T s).",
"Control unit changes the angle α, such that=αmin+(t/T)*(αmax−αmin).",
"In some implementations, the dependency between angle of deflection and the time during exposure is nonlinear.",
"The control unit applies the modulation signals to individual pixel sets.",
"For example, in some cases, a 9-bit binary Gray code is used to drive the modulation of individual pixel sets.",
"The 9-bit Gray code can encodes 512 discrete codewords Cxy.",
"The time T is divided into 512 individual time periods Ti=<ti, ti+1) (iϵ0 .",
".",
".",
"511) of the same duration (|Ti|=T/512), so that, in succession of the coding, each time period have its own 9 bit codeword (000000000, 000000001, 000000011, 000000010, .",
".",
".",
").",
"During the frame, in any time t (thit) fits into some interval Ti.",
"During the interval Ti, the associate codeword is used by control unit to modulate response of the pixel sets.",
"The first pixel set is controlled by first bit of the codeword, the second set is controlled by second bit of the codeword, .",
".",
".",
", the ninth set is controlled by ninth bit of the associated codeword (if particular bit is 0, the all pixels from the particular pixel set are “off”, if the bit is 1, the pixels are “on”—responsive to light).",
"The method described here for a 9-bit gray code is the same as the method for a 5-bit gray code that is shown in FIG.",
"3, with appropriate modifications for the different number of bits in the code.",
"During the readout phase, the control unit sends control signals to the camera subsystem to read the image.",
"The image is send to the processing unit.",
"In processing phase, the raw image from the camera is split into 9 different sub-images.",
"This images have the same structure as superpixels.",
"First sub-images consists of image values captured by the pixels in first pixel set.",
"The second sub-image consists of image values captured by the pixels of second pixel set, .",
".",
".",
", the ninth sub-image consists of image values captured by the pixels of the ninth pixel set.",
"All nine sub-images have the same resolution.",
"The sub-image matrix P is an image, where every pixel have 9 values from particular sub-images (v1, .",
".",
".",
", v9).",
"The value of the sub-image matrix is an 9D intensity vector (the components of the vector corresponds to specific sub-image pixel value).",
"Because pixels in a superpixel are in proximity, the individual pixels in the superpixel captures the light from approximately the same area.",
"The centers of the superpixels are treated as centers of pixels in sub-image matrix (for purposes of geometric computations).",
"Each pixel in sub-image matrix P captures light from a part of the scene (either part of the object of interest, or the background of the area of interest).",
"If the illumination module does not illuminate the area of interest, the pixel captures no light, other than any ambient light.",
"If the illumination module illuminates the area of interest, it illuminates the area in unknown time t (it is in general a very short period of time giving the angular movement of the deflection mirror).",
"When this happens during exposure during a camera frame, tϵTi.",
"In time period Ti, the response of the pixel sets are modulated by i-th codeword.",
"Thus, the light hits the area of interest in time period Ti.",
"In this period, only a portion of the pixel sets are “on” based on the bits of the particular codeword.",
"The 9D intensity vector of P is (v1, v2, .",
".",
".",
", v8).",
"Intensity values that correspond to pixel sets that are “on” during Ti are higher that a threshold (while they receive the reflected illumination from the area of interest).",
"Intensity values that correspond to pixel sets that are “off” capture no light, so the values are below the threshold.",
"This binarization by the threshold creates an 9-bit codeword.",
"By decoding this codeword (e.g., GrayToBinary in FIG.",
"4), a computer calculates the index of the time interval i (Timeslot).",
"Thus, this algorithm decodes the time t—with the accuracy of up to T/512 (as the center of the timeslot Ti).",
"The codeword 000000000 is reserved for pixels that was not lit by the illumination subsystem.",
"The 3D coordinate of (0, 0, 0) is sent to output for such pixels.",
"For the time t, the processing units computes the plane equation of the plane of laser light that correspond to the particular angle α of the deflection mirror.",
"Using this plane equation and data gathered during calibration of the camera subsystem, a computer computes the intersection of the plane and the pixel ray for the superpixel.",
"The pixel ray is the half-line along which light from the scene travels to the center of the superpixel.",
"The intersection is a 3D coordinate in world coordinate system, and it is saved as an output value for the particular pixel P. The algorithm is executed for all pixels of the sub-image matrix.",
"In output phase, the control unit sends the computed 3D coordinates out of the system.",
"In an illustrative embodiment of the system, the projector space correspondence is encoded into code for pixel modulation.",
"Thus, the 3D coordinate is computed for every pixel of sub-image matrix separately.",
"FIG.",
"29 is a diagram of a 3D scanning system that includes modulatable superpixels, in an illustrative implementation of this invention.",
"The system includes a camera subsystem 2901 and an illumination subsystem 2903.In some implementations of the system, the illumination subsystem comprises a laser 2921, optics 2923, and a galvanometer-actuated optical scanner 2925.The optics 2923 comprise a Powell lens 2927, a mirror 2929, and another lens 2913.During scanning, the galvanometer-actuated optical scanner 2925 controls mirror position and thus the direction of the projected line of laser light.",
"In the example shown in FIG.",
"29, laser light 2928 is projected toward the scene 2929.The scene is within both the illumination subsystem's field of view 2931 and the camera subsystem's field of view 2933.The projected light is reflected 2935 from the objects in the scene or surrounding walls toward the camera subsystem.",
"In the example shown in FIG.",
"29, the illumination subsystem projects a laser line into its field of view.",
"The projected light 2928 is reflected from the scene 2929, and passes though the camera optics 2907.The camera optics 2907 include a filter 2909 and a lens 2911.The reflected light 2935 then falls onto image sensor 2905.The laser light 2928 completes a sweep of the scene during each frame.",
"In some embodiments, a mechanical deflection system is used to change the direction of the projected light.",
"For example, in some cases, the deflection system comprises a galvanometer-actuated optical scanner, MEMS mirror or polygonal mirror.",
"In some cases, a sensor for detecting the angle of rotation of the mirror is included in the illumination subsystem.",
"FIG.",
"30 is a flowchart that shows steps in a method of 3D scanning.",
"In the example shown in FIG.",
"30, desired timing parameters (such as the number of frames per second) are set.",
"(Step 3001).",
"The timer is activated; it triggers the frame capture at the desired frame rate.",
"(Step 3003).",
"The system sends signals to the control unit (Step 3005).",
"The control unit 3017 has a timer which is started at the beginning of each frame (Step 3019).",
"According to the time provided by the control unit timer, the control unit computes the modulation information for each of the pixel sets (Step 3025) and computes the position information for the illumination subsystem (Step 3021).",
"The modulation signals are sent to the respective pixel sets (Step 3027).",
"The positioning signal is sent to the illumination subsystem (Step 3023).",
"At the end of the frame (which is determined by the timer to be in sync with the desired frame rate), a processing unit receives data from the camera (Step 3007).",
"Using the data from the camera 3009 and previously gathered calibration data 3011, a computer calculates a 3D model (Step 3013) and sends it as output (Step 3015).",
"FIG.",
"31 is a flowchart that shows steps in a method of 3D scanning, in which a timeslot is calculated.",
"In the example shown in FIG.",
"31, the steps of the method include frame start 3101, illumination 3103, recording intensity 3105, reading values from camera pixels 3107, comparing to thresholds, producing code, decoding 3111, obtaining a timeslot and index 3113, according to index, retrieving a mathematical equation of the set of pixels illuminated during the timeslot 3115, computing pixel ray equation, which is the equation of a ray from the center of the camera pixel to the scene 3109, and computing an intersection of these two mathematical equations 3117.FIG.",
"32 is a flowchart that shows steps in a method of calibrating a 3D scanner.",
"These steps include: Calibrate parameters of a first camera 3201.Calibrate parameters of a second camera 3203.Calibrate camera pair distances 3205.Use a galvo-actuated light source to project single line parameters 3207.Calibrate position of the galvo-actuated light source and cameras and parameters of the light source 3209.Verify parameters (e.g., by 3D scanning a flat surface) 3211.For example, in some cases, a calibration method includes the following steps.",
"First, parameters of each single camera are determined using a calibration pattern.",
"A precisely printed or etched calibration pattern is placed at different locations in the view of camera.",
"The locations evenly cover the desired range and field of view of the camera.",
"In many cases, the camera takes at least 10 pictures of the calibration pattern.",
"Then a computer runs algorithm on this input to calculate the matrix in standard format, containing the determined parameters of a camera.",
"If the mathematical uncertainty indicated by the algorithm is not below a desired threshold, the process is repeated.",
"This is repeated for all cameras, one by one.",
"After all cameras all calibrated, the positions of the cameras relative to each other are determined.",
"One camera, the first one (#1), is selected as the primary reference point from which the relative position of other cameras is determined.",
"For each pair of camera #1-camera #x, at least 10 pictures of the calibration pattern, shot from both cameras, are taken.",
"The pattern is placed in different location, facing the cameras, so as to evenly cover the desired range and field of view of the cameras.",
"An algorithm takes the images as an input and computes the relative positions of the cameras.",
"If the mathematical uncertainty indicated by the algorithm is not below a desired threshold, the process of determining the positions of the cameras is repeated with newly taken images.",
"After this, the position and projection parameters of the light source(s) are determined.",
"A flat white object is placed in front of the system, so that the light from the source is reflected and the image of the projected line can be taken by the cameras.",
"The light source projects a number of single-line patterns, covering its whole range.",
"The flat white object is then placed in a different distance and the process is repeated.",
"The flat white object is placed in at least 5 positions at different distances so as to evenly cover the desired range of the system.",
"Images of the patterns are provided as input for algorithm computing the relative position of the galvo, and the parameters of the projection (mapping of numeric inputs given to galvo to the real angle of projected line).",
"If the mathematical uncertainty indicated by the algorithm is not below a desired threshold, the process of determining the position of the galvo and its parameters is repeated with newly taken images.",
"After this, a verification step is done.",
"The images collected in the previous step are provided to the triangulation algorithm which computes the 3D position of two points of each projected line.",
"A plane is mathematically computed to be the best fit for the lines taken while the flat white object is at one distance.",
"A next position of the flat white object produces another plane, etc.",
"In this method, if the system uses one camera, an additional second camera is temporarily, but rigidly attached to the system.",
"The additional camera is detached after the calibration process is accomplished Here is another non-limiting example of a calibration technique, used in some implementations of this invention.",
"In this example, the calibration parameters consist of an internal part and an external part.",
"The internal properties of the camera include local behavior of projection, the camera matrix and the parameters of lens distortion model.",
"The external properties include the position/rotation of the camera in respect to world coordinate system.",
"All parameters are calculated by an automatic or semiautomatic process.",
"In this process, the cameras captures known calibration pattern (e.g.",
"FIG.",
"33) in multiple different positions/orientations (FIG.",
"34).",
"The automatic algorithm computes the position of the individual circles of the pattern.",
"Each individual circle has encoded the position of its center in pattern coordinate space (in metric coordinates).",
"When the system knows the internal parameters of the camera and the position/orientation of the calibration pattern, the position of each individual center of circle (in world coordinate space) is projected to camera coordinate space (projected coordinate).",
"Position of each circle is computed (image coordinate).",
"The reprojection error is the difference between projected coordinate and the image coordinate for each circle.",
"At the beginning of the process, the internal parameters of the camera and the position/orientation of calibration patterns are unknown.",
"A computer calculates the parameters using an optimization technique to minimize reprojection error for all captured images of calibration pattern (e.g.",
"mean square error).",
"After the internal parameters of all cameras are calculated, the same captured patterns are used to determine the position of individual cameras with the optimization technique to minimize reprojection error.",
"Alternatively, other calibration techniques may be used, such as mechanical alignment of components to exact locations.",
"FIG.",
"33 is a diagram that shows four examples of circles used in an optical calibration pattern.",
"In some cases, an optical calibration pattern comprises a large number of such circles.",
"Each circle in calibration pattern (e.g., 3301, 3303, 3305, 3307) is encoded with a unique visual code, and thus each circle in the calibration pattern is uniquely identifiable.",
"FIG.",
"34 is a diagram that shows use of a calibration pattern.",
"A calibration pattern is precisely printed or etched on a planar surface.",
"The calibration pattern is placed at different locations 3402 in the view of a camera 3401.The locations evenly cover the desired range and field of view of the camera.",
"In some cases, the camera captures 10 or more pictures of the calibration pattern.",
"In FIG.",
"34, dashed lines 3403 indicate the projection 3403 of a plane of laser light 3404.Coordinate System In illustrative implementations, computations for 3D scanning involve use of coordinate systems.",
"A wide variety of coordinate systems may be used.",
"Here is a non-limiting example of a coordinate system that is used in some implementations of this invention, for purposes of triangulation and calibration.",
"In illustrative implementation, the image sensor consists of plurality of pixels (e.g.",
"thousands of pixels, or millions of pixels, or billions of pixel, or any other number).",
"The pixels are arranged in 2D matrix, forming an 2D coordinate system (u, v), which is the image coordinate system.",
"Every position on the image sensor is described by 2 real numbers (u, v)—2D vector from R2.The coordinates lies in interval (<0, U-Resolution, <0, V-Resolution>), where U-Resolution is the horizontal number of pixels in the image sensor, and V-Resolution is the vertical number of pixels in the image sensor.",
"In some cases, the image plane is a planar surface and the coordinate system consists of 2 orthogonal axes U and V. In another implementation of the invention, the image sensor is a curved surface.",
"Light reflects from the objects in the scene, passes through camera optics (including, in many case, a lens) and forms an image on the sensor surface.",
"The image captured by the image sensor has the same coordinate system as the image sensor.",
"The camera has a camera center and the image plane is in front of the camera center.",
"The perpendicular distance between camera center and image plane is equal to the focal distance) of the camera.",
"The line perpendicular to the image plane, which crosses the camera center is the principal axis.",
"The intersection of the principal axis with the image plane is called the principal point (p).",
"The camera coordinate system is a local Cartesian coordinate system with 3 orthonormal axes.",
"The origin of the coordinate system is in the camera center c. The x-axis has the same direction as the sensor's u-axis, the y-axis has the same direction as v-axis and the z-axis has the same orientation as principal axis).",
"Each camera subsystem has its own Camera coordinate system.",
"The coordinate system of the scene, the World Coordinate System, is a global coordinate system.",
"The coordinate transforms between any camera coordinate system and the world coordinate system are standard coordinate conversions (represented by a coordinate conversion matrix and its inverse transform).",
"The camera coordinate system is the same as camera subsystem coordinate system.",
"The coordinate conversion matrix Rt is R t = ( r 1 , 1 r 1 , 2 r 1 , 3 t 1 r 2 , 1 r 2 , 2 r 2 , 3 t 2 r 3 , 1 r 3 , 2 r 3 , 3 t 3 ) where, ri,j is rotation parameter, and ti is translation parameter.",
"The projection from world coordinates to image coordinates is performed as follows.",
"The world coordinate of a point in the scene is xh=(x, y, z, 1)T—in homogeneous coordinates.",
"World coordinates are converted to camera coordinate space by matrix multiplication, as follows: x=Rt*xh Point x is projected to a normalized image plane (which is located at a focal distance of 1 from the camera center).",
"The coordinates of Point x in the scene, as projected to the normalized image plane, are x n = ∏ * x , where ∏ = ( 1 0 0 0 0 1 0 0 0 0 1 0 ) To convert to image coordinates xi, the xn is multiplied by a Camera Matrix A (which represents camera intrinsic parameters) A = ( α x 0 x 0 0 α y y 0 0 0 1 ) x i = A * x n In some implementation of the system, a transformation E (mapping 2D homogeneous space to 2D homogeneous space) compensates (at least partially) for optical distortion of the lens system.",
"The image coordinate is computed as follows.",
"xi=A*e[Π*(Rt*xh)] Having specific location of the pixel xi, there exist a bijection between image coordinates of a point xi and a corresponding normalized coordinates xn, (coordinates on normalized image plane).",
"Having the normalized coordinates xn, there exists an infinite number of points, each projecting to xn on the normalized image plane.",
"All of these points lie on a half-line (ray).",
"The equation of the half line is x=c+(xn−c)*d where x is a vector of coordinates of a 3D point in space, c is a vector of a coordinates of the center of the camera (3D point), xn is a vector of normalized coordinates of the point xi and d>0 is a real number equal to the distance (parameter).",
"The symbol “*” is the multiplication of vector by scalar.",
"This relation between 2D image coordinate and the 3D half-line is called image point/coordinate re-projection.",
"In some alternative implementations of the invention, a more complex geometrical model is used.",
"In this model, the projection of a pixel into space is treated as a distribution function of possible light participation on a final pixel intensity.",
"In some cases, a 3D scanning system employs triangulation to determine depth and a plane of laser light to illuminate the scene.",
"In such a laser triangulation system, the calibration is sometimes performed as follows.",
"The calibration is done in iterations.",
"At first, the method for calibrating the camera subsystem(s) is performed as stated before.",
"For calibrating the surface in the space, which is lit by the laser, calibration pattern comprising of multiple circles (such as 3301, 3303, 3305, 3307) is used.",
"In the process, each of the camera subsystem captures images of the calibration pattern (the white areas comprise a diffuse surface with albedo near 1, the black areas comprise a diffuse surface with albedo near 0.5).",
"The calibration pattern is printed on a stable planar surface (e.g.",
"on top of glass table).",
"During the exposure of the camera, the mutual position of the camera subsystem(s), the laser and the calibration pattern is fixed.",
"At first, the camera(s) captures the image of a calibration pattern illuminated by ambient light, while the laser is off.",
"From this frame, for every camera, the algorithm computes the equation of plane, which corresponds (during this step of calibration) to the planar surface of the calibration pattern (This part of the process is a sub-part of the camera calibration).",
"The position/orientation of all elements of the system stays fixed, while camera(s) take image of the pattern lit by the laser (the laser is turned on before the second exposure).",
"The laser light projects image features (curve of highly illuminated points) on the captured image of the calibration pattern, which show multiple positions of the calibration pattern.",
"The algorithm detects these features using thresholding and finds the points of said curve with subpixel accuracy by finding the center of gravity of the intensity values in the cross-section of the said curve (a different sub-pixel strategy may be used).",
"For example, if the projection of the laser light in the image is a curve maintaining vertical direction, the algorithm processes the image row by row, analyzing the center of gravity of the laser light in all image rows (if there are points above the threshold).",
"The representation of the curve is a continuous (from a geometrical point of view) chain of 2D image coordinates.",
"The algorithm re-projects these coordinates into 3D, which gives a set of half-lines directing from camera center.",
"After that, the algorithm computes the 3D intersections of half-lines with the plane of the calibration patterns.",
"These 3D coordinates are stored in memory as the chain (sample), which is a 3D representation of the projection of the laser light.",
"The operator then changes the position of the calibration pattern (in some implementations, a robotic arm automatically changes the position of the calibration pattern), so that the new position of the calibration pattern defines a plane, that is different from all previous.",
"During the calibration process, the operator/robot places the calibration pattern to multiple positions to ensure homogeneous coverage of measured samples in the measurement range of the system.",
"After sufficient number of samples is captured (at least 2), a geometrical representation of the laser illuminated 3D surface (e.g.",
"ruled surface) is computed by minimizing the error (e.g.",
"mean square distance) of measured sample points and the geometrical representation of the surface.",
"Triangulation In some implementations, the system computes the 3D position of the surface points in the field of view of the camera subsystem.",
"For every pixel of the camera, the algorithm computes a pixel ray.",
"The pixel ray is the re-projection (the half-line from the camera center).",
"To compute the exact 3D position along the half-line, the algorithm computes d in the equation using an additional constraint.",
"Specifically, the additional constraint is that the plane and the half-line line going from the camera center through the pixel are never parallel, i.e.",
"there is always an intersection (as discussed below).",
"In some implementations, the distance d is computed directly and substituted into the equation.",
"In some implementations, the distance d is computed from triangulation principle.",
"The additional constraint is either a plane or second half-line where the specific point lies.",
"For the plane as additional constraint (the plane and the pixel's re-projection can not be parallel), the 3D point x for a specific pixel p has to satisfy 2 criteria: x=c+(xn−c)*d np·x+dp=0 where np, is a 3D normal vector of the plane, dp is the Euclidian distance between the plane and the origin of the coordinate system and symbol “·” is the dot product of two 3D vectors.",
"To get the exact 3D point x, the algorithm performs an algorithm to compute unknown d: d=(np·c+dp)/(np·(c−xn)) where symbol “/” is the division of real numbers.",
"Because the line and the plane are not parallel, it follows that (np·c−np·xn) is non-zero, and that d exists.",
"A computer calculates x if the d is >0.x=c+(xn−c)*(np·c+dp)/(np·(c−xn)) In some implementations, 3D position of a surface points in the scene is retrieved using laser light, camera and triangulation technique.",
"For example, the system shown in FIG.",
"28 uses laser triangulation.",
"Laser light emits from the illumination subsystem 2801 in form of laser line(s), laser dot(s) or different light shape (e.g.",
"Ruled surface in 3D).",
"The mutual position and orientation of every Illumination subsystem and every camera subsystem is known in any time t. In time t, the Illumination subsystem emits light on the scene 2811.For every pixel of the camera, if the laser illuminates a part of the scene that is observed by the pixel, the processing unit 2805 computes the 3D position of the illuminated part of the scene.",
"All points illuminated by the laser lies on a defined 3D surface in the scene.",
"The pixel of the camera collects light from a ray.",
"The 3D point lies on intersection of this ray and the surface defined by the laser.",
"In some cases, there is more that one such intersection and the processing unit chose the final 3D position by other regularization criteria.",
"In some implementations of laser triangulation, the simple equation of plane is chosen as the representation of the laser illuminated 3D surface.",
"In this case, the algorithm for plane fitting (based on principal components) is used.",
"In some implementations of laser triangulation, the mutual position and orientation of the laser and the camera does not change over time.",
"However, the position, and orientation of the laser source could change in time in a well controlled manner (e.g.",
"mechanical change in position, rotation, deflection by mirror).",
"In this case, the calibration is performed for fixed number of different laser source positions/orientations.",
"The equation of the laser illuminated surface for all other positions/orientations are computed using sufficient mathematical model and interpolation.",
"In many implementations of triangulation, profile inspection is performed.",
"In that case, the illumination subsystem comprises the laser line source.",
"During the measurement, the laser light illuminate single profile of the scene, the camera subsystem captures the projection of the laser light and the algorithm analyze the image with the approach used in part of calibration.",
"The 3D points represents a profile of the measurement.",
"Multiple Camera Subsystems In some implementations, the 3D scanning system includes two camera subsystems.",
"For each camera and each pixel, the algorithm computes time t of the light peak.",
"The values are stored in time images (the pixel of the images are the values of t).",
"The first camera subsystem is primary.",
"For every pixel of the primary camera, the algorithm computes the pixel re-projection.",
"The corresponding 3D points lies on epipolar lines in the image of the second camera.",
"On the time image of the second camera, the epipolar line cuts the image, which creates a 1D function of time values.",
"The algorithm computes any value on the epipolar line using bilinear interpolation from adjacent pixels.",
"The corresponding projection of the surface point lies on the epipolar line and have the same time t, as the pixel form the primary camera.",
"The algorithm computes the position of the value t in the 1D function (with subpixel accuracy using bilinear interpolation).",
"This position corresponds to pixel position on the second camera.",
"The algorithm re-projects the pixel position as a half-line in 3D.",
"The algorithm computes the 3D point as an intersection of two half-lines.",
"An advantage of this approach is higher robustness and accuracy, while the geometry calculations are not dependent on calibration of Illumination subsystem Alternative Implementations In some implementations of the system, the system comprises plurality of illumination subsystems.",
"In some implementations of this invention, the features in the scene are formed artificially by an illumination subsystem.",
"There are different coding strategies that create specific coding for different points in the scene.",
"This allows for more robust and accurate feature detection and position estimation.",
"In some implementations, this invention operates in multiple modes.",
"One such mode is a high spatial resolution mode, which uses the same modulation signal for all pixels.",
"The pixels from different sets are combined to produce one high spatial resolution image.",
"In this mode, all pixels in the imaging sensor act like one pixel set.",
"The ability to switch to this mode allows the scanner to select between real-time (lower resolution) mode and non-real-time (multiple sequential camera frames) high resolution mode for a more precise reconstruction.",
"Alternatively, this invention may be implemented as follows: An aluminum box may serve as a cover for a 3D scanning system.",
"Inside the box, each of the following components are placed: a camera with ability to regulate the response of its pixels (globally), a (visible) red light laser, rotating mirror, Powell lens, and electronics that drive the rotating mirror.",
"The Powell lens is a special kind of lens which transforms a laser dot to a line.",
"As the mirror rotates according to the signal from the computer, the laser line sweeps along the scene over an angle of about 30 degrees.",
"Instead of having multiple sets of pixels in the imaging sensor during a single frame, the scanner uses only one set of pixels and gathers multiple image frames.",
"This alternative embodiment is well suited to 3D scan with high spatial resolution, but is not well suited for scanning a moving object.",
"In some cases, a shape of illumination other than a straight line is used.",
"For example, in some cases: (a) the pattern is formed by a laser using a special lens (variation of Powell lens); (b) a light source projects a line to a non-flat mirror (e.g.",
"a spherical or parabolic mirror); or (c) the light source comprises LED lights that are arranged in a spherical, circular, elliptical, parabolic or hyperbolic shape, and that project a curved surface.",
"In some implementations of the system, the system operates either in realtime mode (with different pixel modulation signals), or in high-res mode.",
"In high-res mode, the scanning process consists of multiple exposures and laser sweeps in succession.",
"In every exposure, the Control units apply the modulation signals to whole image sensor.",
"The multiple pixel values consists of values captured in succession.",
"This allows to compute the time t of the light peak and appropriate 3D point for every pixel in the image sensor.",
"In some implementations of the invention, the system uses different coding strategies to encode the time of pixel illumination alongside Gray codes.",
"In a preferred embodiment, the control units creates a set of periodic sinusoidal functions with equal period and different phase shift (e.g.",
"4 sinusoidal functions shifted by π/2 rad each after another).",
"The set of modulation function (phase shifting modulation functions) is applied to appropriate number of image sets (in some cases, multiple image sets are modulated by the same function to collect more samples).",
"The corresponding pixel sets (and the corresponding pixels in every superpixels) are phase shifting pixels (for the simplicity of description).",
"The number of periods of the modulation functions increase the possible accuracy of the coding.",
"In general, the period of the function has to be at least 2 times longer that the time period Ts the laser line needs to swipe through the area of projection of individual pixels of the sensor.",
"In some implementations, the distance to measured surface does not affect time Ts.",
"While the time period Ts is short (due to given constraints), the received illumination (the collected pixel intensity), the values of phase shifting pixels in superpixels, encodes the phase (the position inside the period).",
"While the coding uses periodic function, the algorithm computes the index of period from the Gray coded pixels (the index time period Ti is shorter than the period of the used sinusoidal functions).",
"In some implementations, the system uses 4 sinusoidal functions shifted by π/2 rad each after another.",
"The values of corresponding phase shifting pixels are A0, A1, A2, A3.The algorithm computes the phase value φ using the following equation: ϕ = atan 2 ( A 0 - A 2 , A 1 - A 3 ) atan 2 ( y , x ) = { arctan y x x > 0 arctan y x + π y ≥ 0 , x < 0 arctan y x - π y < 0 , x < 0 + π 2 y > 0 , x = 0 - π 2 y < 0 , x = 0 undefined y = 0 , x = 0 The time t of the light peak is delivered as: t=PeriodIndex*Tperiod+[(φ+π)/(2*π)]*Tperiod where Tperiod is the length of the period of the sinusoidal function, and the PeriodIndex is the index of the period derived from time period Ti.",
"In some implementations, the system uses phase shifting modulation functions with different period.",
"For example, first set of phase shifting modulation signal have period of the same length as the exposure T, the second set has period of T/256.The algorithm decodes the phase value of the light peak (the time, when the laser sweeps across the projection of the individual pixel of the sensor) for both sets.",
"The second phase value represents accurate measurement of the time of the occurrence of the light peak (up to the period index), the first phase value represents unambiguous measurement (Because of the physical limitations of the sensor, such measurement is in the most cases less accurate, than the one from multiple periods phase shifting modulation functions), which the algorithm uses to set the right period index.",
"In some implementations, the system uses different modulation functions (e.g.",
"square waves).",
"In some implementations of the system, the pixels comprises multiple storages.",
"The modulation signals controls the allocation of the accumulated photo-electrons to different storages.",
"This allows for capturing multiple phase shifting values in single pixel.",
"Computers In exemplary implementations of this invention, one or more electronic computers (e.g.",
"2803, 2805) are programmed and specially adapted: (1) to control the operation of, or interface with, hardware components of an imaging system, including by modulating the transfer of charge in a pixel photodiode to one or more storage devices, and for controlling a reflective or transmissive SLM to control intensity of light incident on image sensor pixels; (2) to control the operation of, or interface with, hardware components of a 3D scanning system, including an illumination subsystem and a camera subsystem; (3) to process data captured by an image sensor; (4) to perform triangulation to reconstruct 3D surface geometry; (5) to perform calibration, including calibration of any camera or light source; (6) to output modulation signals for modifying the response of pixels to incident light; (7) to output control signals to synchronize illumination of a scene with modulation of pixels; (8) to perform any other calculation, computation, program, algorithm, computer function or computer task described or implied above, including any optimization algorithm; (9) to receive signals indicative of human input; (10) to output signals for controlling transducers for outputting information in human perceivable format; and (11) to process data, to perform computations, to execute any algorithm or software, and to control the read or write of data to and from memory devices.",
"The one or more computers may be in any position or positions within or outside of a 3D scanning system or imaging system.",
"For example, in some cases (a) at least one computer is housed in or together with other components of the system, and (b) at least one computer is remote from other components of the system.",
"The one or more computers are connected to each other or to other components in the system either: (a) wirelessly, (b) by wired connection, or (c) by a combination of wired and wireless connections.",
"In exemplary implementations, one or more computers are programmed to perform any and all calculations, computations, programs, algorithms, computer functions and computer tasks described or implied above.",
"For example, in some cases: (a) a machine-accessible medium has instructions encoded thereon that specify steps in a software program; and (b) the computer accesses the instructions encoded on the machine-accessible medium, in order to determine steps to execute in the program.",
"In exemplary implementations, the machine-accessible medium comprises a tangible non-transitory medium.",
"In some cases, the machine-accessible medium comprises (a) a memory unit or (b) an auxiliary memory storage device.",
"For example, in some cases, a control unit in a computer fetches the instructions from memory.",
"In illustrative implementations, one or more computers execute programs according to instructions encoded in one or more a tangible, non-transitory, computer-readable media.",
"For example, in some cases, these instructions comprise instructions for a computer to perform any calculation, computation, program, algorithm, computer function or computer task described or implied above.",
"For example, in some cases, instructions encoded in a tangible, non-transitory, computer-accessible medium comprise instructions for a computer to: (1) to control the operation of, or interface with, hardware components of an imaging system, including by modulating the transfer of charge in a pixel photodiode to one or more storage devices, and for controlling a reflective or transmissive SLM to control intensity of light incident on image sensor pixels; (2) to control the operation of, or interface with, hardware components of a 3D scanning system, including an illumination subsystem and a camera subsystem; (3) to process data captured by an image sensor; (4) to perform triangulation to reconstruct 3D surface geometry; (5) to perform calibration, including calibration of any camera or light source; (6) to output modulation signals for modifying the response of pixels to incident light; (7) to output control signals to synchronize illumination of a scene with modulation of pixels; (8) to perform any other calculation, computation, program, algorithm, computer function or computer task described or implied above, including any optimization algorithm; (9) to receive signals indicative of human input; (10) to output signals for controlling transducers for outputting information in human perceivable format; and (11) to process data, to perform computations, to execute any algorithm or software, and to control the read or write of data to and from memory devices.",
"Definitions The terms “a” and “an”, when modifying a noun, do not imply that only one of the noun exists.",
"To compute “based on” specified data means to perform a computation that takes the specified data as an input.",
"Here are some non-limiting examples of a “camera”: (a) an optical instrument that records images; (b) a digital camera; (c) a video camera; (d) a camera that uses photographic film or a photographic plate; (e) a light field camera; (f) an imaging system, (g) a light sensor; (h) a time-of-flight camera; (h) apparatus that includes a light sensor or an array of light sensors; and (i) apparatus for gathering data about light incident on the apparatus.",
"The term “camera” includes any computers that process data captured by the camera.",
"The term “comprise” (and grammatical variations thereof) shall be construed as if followed by “without limitation”.",
"If A comprises B, then A includes B and may include other things.",
"The term “computer” includes any computational device that performs logical and arithmetic operations.",
"For example, in some cases, a “computer” comprises an electronic computational device, such as an integrated circuit, a microprocessor, a mobile computing device, a laptop computer, a tablet computer, a personal computer, or a mainframe computer.",
"For example, in some cases, a “computer” comprises: (a) a central processing unit, (b) an ALU (arithmetic/logic unit), (c) a memory unit, and (d) a control unit that controls actions of other components of the computer so that encoded steps of a program are executed in a sequence.",
"For example, in some cases, the term “computer” also includes peripheral units, including an auxiliary memory storage device (e.g., a disk drive or flash memory).",
"However, a human is not a “computer”, as that term is used herein.",
"“Defined Term” means a term or phrase that is set forth in quotation marks in this Definitions section.",
"The term “e.g.” means for example.",
"The fact that an “example” or multiple examples of something are given does not imply that they are the only instances of that thing.",
"An example (or a group of examples) is merely a non-exhaustive and non-limiting illustration.",
"Unless the context clearly indicates otherwise: (1) a phrase that includes “a first” thing and “a second” thing does not imply an order of the two things (or that there are only two of the things); and (2) such a phrase is simply a way of identifying the two things, respectively, so that they each can be referred to later with specificity (e.g., by referring to “the first” thing and “the second” thing later).",
"For example, unless the context clearly indicates otherwise, if an equation has a first term and a second term, then the equation may (or may not) have more than two terms, and the first term may occur before or after the second term in the equation.",
"A phrase that includes a “third” thing, a “fourth” thing and so on shall be construed in like manner.",
"The term “for instance” means for example.",
"“Forward”, in the context of an SLM, means to reflect light from the SLM or to transmit light that passes through the SLM.",
"“Forwarding rate” of an SLM pixel relative to an imaging pixel means a ratio of (a) intensity of light incident on an SLM pixel and (b) intensity of light that is incident on the imaging pixel and forwarded by the SLM pixel.",
"In the context of a camera (or components of the camera), “front” is optically closer to the scene being imaged, and “rear” is optically farther from the scene, during normal operation of the camera.",
"In the context of a display device (or components of the display device), “front” is optically closer to a human viewer, and “rear” is optically farther from the viewer, when the viewer is viewing a display produced by the device during normal operation of the device.",
"The “front” and “rear” of a display device continue to be the front and rear, even when no viewer is present.",
"“Herein” means in this document, including text, specification, claims, abstract, and drawings.",
"“Imaging pixel” means a component of an imaging sensor, which component takes measurements of intensity of light incident on a region of the imaging sensor, such that the intensity is measured for the entire region and is not separately measured for any subregion of the region.",
"“Imaging superpixel” means a set of imaging pixels, such that each imaging pixel in the set is a horizontal, vertical or diagonal neighbor of another imaging pixel in the set.",
"As used herein: (1) “implementation” means an implementation of the present invention; (2) “embodiment” means an embodiment of the present invention; (3) “case” means an implementation of the present invention; and (4) “use scenario” means a use scenario of the present invention.",
"The term “include” (and grammatical variations thereof) shall be construed as if followed by “without limitation”.",
"“Intensity” means any measure of or related to intensity, energy or power.",
"For example, the “intensity” of light includes any of the following measures: irradiance, spectral irradiance, radiant energy, radiant flux, spectral power, radiant intensity, spectral intensity, radiance, spectral radiance, radiant exitance, radiant emittance, spectral radiant exitance, spectral radiant emittance, radiosity, radiant exposure or radiant energy density.",
"In the case of a ratio of two intensities, both of the intensities in the ratio have the same SI units.",
"“I/O device” means an input/output device.",
"For example, an I/O device includes any device for (a) receiving input from a human, (b) providing output to a human, or (c) both.",
"For example, an I/O device includes a user interface, graphical user interface, keyboard, mouse, touch screen, microphone, handheld controller, display screen, speaker, or projector for projecting a visual display.",
"Also, for example, an I/O device includes any device (e.g., button, dial, knob, slider or haptic transducer) for receiving input from, or providing output to, a human.",
"“Light” means electromagnetic radiation of any frequency.",
"For example, “light” includes, among other things, visible light and infrared light.",
"Likewise, any term that directly or indirectly relates to light (e.g., “imaging”) shall be construed broadly as applying to electromagnetic radiation of any frequency.",
"As used herein, (i) a single scalar is not a “matrix”, and (ii) one or more entries, all of which are zero (i.e., a so-called null matrix), is not a “matrix”.",
"The “maximum dimension” of an object means the longest Euclidian distance between any two points on the exterior surface of the object.",
"To “multiply” includes to multiply by an inverse.",
"Thus, to “multiply” includes to divide.",
"The term “n-ary” is defined elsewhere in this document.",
"Two pixels are “neighbors” if the two pixels are positioned such that (i) the two pixels are adjacent to each other in a matrix of pixels and (ii) no pixel is between the two pixels.",
"“Pixel set” means a set of pixels to which an identical modulation signal is applied.",
"The term “or” is inclusive, not exclusive.",
"For example A or B is true if A is true, or B is true, or both A or B are true.",
"Also, for example, a calculation of A or B means a calculation of A, or a calculation of B, or a calculation of A and B.",
"A parenthesis is simply to make text easier to read, by indicating a grouping of words.",
"A parenthesis does not mean that the parenthetical material is optional or can be ignored.",
"A “read-out frame” means a period of time that begins when an exposure of an imaging pixel to light starts and that ends when digital data is created that is indicative of charge accumulated during the exposure.",
"“Reflective SLM” means a device that (i) reflects light from the device, and (ii) attenuates the light, such that the amount of attenuation of a light ray incident at a point on a surface of the device depends on at least the 2D spatial position of the point on the surface.",
"To compute a term that “satisfies” an equation: (a) does not require that calculations involve terms, variables or operations that are in the equation itself, as long as a solution of the equation (subject to error, as described in part (b) of this sentence) is computed; and (b) includes computing a solution that differs from a correct solution of the equation by an error amount, which error amount arises from one or more of (i) rounding, (ii) other computational imprecision, including error due to modeling a continuous signal by a discrete signal or due to using an insufficiently small step size in calculations, and (iii) signal noise or other physical limitations of sensors or other physical equipment.",
"As used herein, the term “set” does not include a so-called empty set (i.e., a set with no elements) and does not include a set with only one element.",
"Mentioning a first set and a second set does not, in and of itself, create any implication regarding whether or not the first and second sets overlap (that is, intersect).",
"The term “signal generator” includes any signal generator, function generator, digital pattern generator, frequency generator and any other electronic device that generates repeating or non-repeating electrical signals, including either digital or analog signals.",
"“Some” means one or more.",
"A “spatial light modulator”, also called an “SLM”, means a device that (i) transmits light through the device or reflects light from the device, and (ii) attenuates the light, such that the amount of attenuation of a light ray incident at a point on a surface of the device depends on at least the 2D spatial position of the point on the surface.",
"A non-limiting example of changing the “sensitivity” of an imaging pixel is to change the state of a circuit so as to control which storage device, out of a set of storage devices, receives a particular electric charge, which electric charge (i) accumulated in a photodiode of the imaging pixel and (ii) will not be and has not been transferred to or from any other storage device in the set.",
"To say that a set of signals is “separate” means that no signal in the set is a function of any other signal in the set.",
"A “storage device” means any device for storing electric charge, including a capacitor, floating diffusion or capacitive bin.",
"“Subregion” of a first region means a part, but not all, of the first region.",
"As used herein, a “subset” of a set consists of less than all of the elements of the set.",
"“Substantially” means at least ten percent.",
"For example: (a) 112 is substantially larger than 100; and (b) 108 is not substantially larger than 100.To say that a thing is “substantially constant” means that the thing has a value that is always within a single range, such that: (a) the lowest value in the range is equal to a constant number minus ten percent of the constant number; and (b) the highest value in the range is equal to the constant number plus ten percent of the constant number.",
"The term “such as” means for example.",
"Spatially relative terms such as “under”, “below”, “above”, “over”, “upper”, “lower”, and the like, are used for ease of description to explain the positioning of one element relative to another.",
"The terms are intended to encompass different orientations of an object in addition to different orientations than those depicted in the figures.",
"“Transmissive SLM” means a device that (i) transmits light through the device, and (ii) attenuates the light, such that the amount of attenuation of a light ray incident at a point on a surface of the device depends on at least the 2D spatial position of the point on the surface.",
"A matrix may be indicated by a bold capital letter (e.g., D).",
"A vector may be indicated by a bold lower case letter (e.g., a).",
"However, the absence of these indicators does not indicate that something is not a matrix or not a vector.",
"Except to the extent that the context clearly requires otherwise, if steps in a method are described herein, then the method includes variations in which: (1) steps in the method occur in any order or sequence, including any order or sequence different than that described; (2) any step or steps in the method occurs more than once; (3) different steps, out of the steps in the method, occur a different number of times during the method, (4) any combination of steps in the method is done in parallel or serially; (5) any step or steps in the method is performed iteratively; (6) a given step in the method is applied to the same thing each time that the given step occurs or is applied to different things each time that the given step occurs; or (7) the method includes other steps, in addition to the steps described.",
"This Definitions section shall, in all cases, control over and override any other definition of the Defined Terms.",
"For example, the definitions of Defined Terms set forth in this Definitions section override common usage or any external dictionary.",
"If a given term is explicitly or implicitly defined in this document, then that definition shall be controlling, and shall override any definition of the given term arising from any source (e.g., a dictionary or common usage) that is external to this document.",
"If this document provides clarification regarding the meaning of a particular term, then that clarification shall, to the extent applicable, override any definition of the given term arising from any source (e.g., a dictionary or common usage) that is external to this document.",
"To the extent that any term or phrase is defined or clarified herein, such definition or clarification applies to any grammatical variation of such term or phrase, taking into account the difference in grammatical form.",
"For example, the grammatical variations include noun, verb, participle, adjective, or possessive forms, or different declensions, or different tenses.",
"In each case described in this paragraph, Applicant is acting as Applicant's own lexicographer.",
"Variations: This invention may be implemented in many different ways.",
"No claims are made in this section entitled “Variations”.",
"For example, no claims are made in paragraphs [A] to [BR] below.",
"Instead, this section entitled “Variations” helps to support claims.",
"Paragraphs [A] to [BR] below are descriptions of non-limiting examples of illustrative implementations of this invention [A] A method comprising simultaneously modulating a plurality of imaging pixels in an imaging superpixel by a set of separate modulation signals, such that each imaging pixel in the imaging superpixel is modulated by a modulation signal that causes sensitivity of the imaging pixel to vary over time.",
"[B] The method of paragraph [A], wherein: (a) the modulation signals each consist of a temporal sequence of modulation states; and (b) the number of times that each specific modulation state occurs, and the order in which the modulation states occur, varies from modulation signal to modulation signal.",
"[C] The method of paragraph [A], wherein the set of modulation signals, taken together, comprise a code, each of the modulation signals representing a digit of the code.",
"[D] The method of paragraph [C], wherein the code is a binary code and each of the modulations signals represents a bit of the code.",
"[E] The method of paragraph [C], wherein the code is a binary gray code.",
"[F] The method of paragraph [C], wherein the code is a 9-bit binary gray code.",
"[G] The method of paragraph [C], wherein the code is an n-ary code.",
"[H] The method of paragraph [A], wherein: (a) the modulating occurs during a readout-frame, which readout-frame includes an exposure period; and (b) each imaging pixel in the imaging superpixel includes a photodiode that, during the exposure period, transfers electric charge to only one storage device, such that at multiple times during the exposure period, electric charge is transferred from the photodiode to the storage device.",
"[I] The method of paragraph [H], wherein, at multiple other times during the exposure period, electric charge is drained from the photodiode, without being saved for later readout.",
"[J] The method of paragraph [H], wherein, during the exposure period, the storage device receives electric charge only from the photodiode.",
"[K] The method of paragraph [A], wherein: (a) the modulating occurs during a readout-frame, which readout-frame includes an exposure period; and (b) each imaging pixel in the imaging superpixel includes a photodiode that, at multiple times during the exposure period, transfers electric charge to a set of storage devices, such that: (i) at any given time at which a transfer of electric charge from the photodiode to a storage device occurs, electric charge is being transferred to only one of the storage devices, and electric charge is not being transferred to any other storage device, and (ii) electric charge is transferred from the photodiode to each of the storage devices during the exposure period.",
"[L] The method of paragraph [K], wherein, during the exposure period, the storage devices receive electric charge only from the photodiode.",
"[M] A method comprising simultaneously: (a) modulating a plurality of imaging pixels in an imaging superpixel by a set of separate modulation signals, such that each imaging pixel in the imaging superpixel is modulated by a modulation signal that causes sensitivity of the imaging pixel to vary over time; and (b) using one or more light sources to illuminate a scene by a pattern of light that changes over time.",
"[N] The method of paragraph [M], wherein: (a) the modulation signals each consist of a temporal sequence of modulation states; and (b) the number of times that each specific modulation state occurs, and the order in which the modulation states occur, varies from modulation signal to modulation signal.",
"[O] The method of paragraph [M], wherein the pattern of light changes in at least intensity over time.",
"[P] The method of paragraph [M], wherein the pattern of light changes in at least direction or position, relative to the scene, over time.",
"[Q] The method of paragraph [M], wherein the pattern of light changes in at least polarization over time.",
"[R] The method of paragraph [M], wherein the pattern of light changes in at least wavelength or electromagnetic spectrum over time.",
"[S] The method of paragraph [M], wherein: (a) the pattern of light sweeps across a scene, such that a point in the scene, when directly illuminated by the pattern of light, reflects light directly to the imaging superpixel; (b) the method further comprises using one or more computers to process data indicative of measurements recorded by the imaging superpixel and, based in part on the data, to calculate 3D spatial coordinates of the point.",
"[T] The method of paragraph [S], wherein the pattern of light comprises a plane of laser light.",
"[U] The method of paragraph [S], wherein the method includes using a galvanometer-actuated mirror to sweep a plane of laser light across a scene.",
"[V] The method of paragraph [S], wherein, when calculating 3D spatial coordinates of the point, the computer performs an algorithm that either: (a) involves triangulation; or (b) involves accessing data that was calculated by a computer using an algorithm that involves triangulation.",
"[W] The method of paragraph [M], wherein the set of modulation signals, taken together, comprise a code, each of the modulation signals representing a digit of the code.",
"[X] The method of paragraph [W], wherein the code is a binary code and each of the modulation signals represents a bit of the code.",
"[Y] The method of paragraph [W], wherein the code is a binary gray code.",
"[Z] The method of paragraph [W], wherein the code is a 9-bit binary gray code.",
"[AA] The method of paragraph [W], wherein at different times during each sweep of the pattern of light across the scene, the modulation signals, taken together, represent different permutations of the code.",
"[AB] The method of paragraph [W], wherein the modulation signals, taken together, represent each of the permutations of the code at different times during an entire sweep of the pattern of light across the scene, one permutation at a time.",
"[AC] The method of paragraph [W], wherein: (a) each entire sweep of the pattern of light across the scene occurs in a time period, which time period consists of a set of subintervals, the total number of subintervals being equal to the number of permutations of the code; (b) during each subinterval, the modulation signals, taken together, represent only one of the permutations of the code; (c) intensity of light incident on the imaging superpixel reaches a maximum value for the entire sweep during a specific subinterval; and (d) a computer analyzes data indicative of measurements taken by imaging pixels of the imaging superpixel and, based on that data, determines the permutation of the code represented by the modulation signals during the specific subinterval.",
"[AD] The method of paragraph [M], wherein: (a) the modulating occurs during a readout-frame, which readout-frame includes an exposure period; and (b) each imaging pixel in the imaging superpixel includes a photodiode that, during the exposure period, transfers electric charge to only one storage device, such that at multiple times during the exposure period, electric charge is transferred from the photodiode to the storage device.",
"[AE] The method of paragraph [AD], wherein, at multiple other times during the exposure period, electric charge is drained from the photodiode, without being saved for later readout.",
"[AF] The method of paragraph [AD], wherein, during the exposure period, the storage device receives electric charge only from the photodiode.",
"[AG] The method of paragraph [M], wherein: (a) the modulating occurs during a readout-frame, which readout-frame includes an exposure period; and (b) each imaging pixel in the imaging superpixel includes a photodiode that, at multiple times during the exposure period, transfers electric charge to a set of storage devices, such that: (i) at any given time at which a transfer of electric charge from the photodiode to a storage device occurs, electric charge is being transferred to only one of the storage devices, and electric charge is not being transferred to any other storage device, and (ii) electric charge is transferred from the photodiode to each of the storage devices during the exposure period.",
"[AH] The method of paragraph [AG], wherein, during the exposure period, the storage devices receive electric charge only from the photodiode.",
"[AI] A system comprising, in combination: (a) a camera, which camera includes an imaging superpixel; and (b) one or more signal generators for producing a set of separate modulation signals, such that each imaging pixel in the imaging superpixel is modulated by a modulation signal that causes sensitivity of the imaging pixel to vary over time.",
"[AJ] The system of paragraph [AI], wherein: (a) the modulation signals each consist of a temporal sequence of modulation states; and (b) the number of times that each specific modulation state occurs, and the order in which the modulation states occur, varies from modulation signal to modulation signal.",
"[AK] The system of paragraph [AI], wherein the set of modulation signals, taken together, comprise a code, each of the modulation signals representing a digit of the code.",
"[AL] The system of paragraph [AI], wherein the code is a binary code and each of the modulations signals represents a bit of the code.",
"[AM] The system of paragraph [AI], wherein the code is a binary gray code.",
"[AN] The system of paragraph [AI], wherein the code is a 9-bit binary gray code.",
"[AO] The system of paragraph [AI], wherein the code is an n-ary code.",
"[AP] A system comprising, in combination: (a) a camera, which camera includes an imaging superpixel; (b) one or more signal generators for producing a set of separate modulation signals, such that (i) each imaging pixel in the imaging superpixel is modulated by a modulation signal that causes sensitivity of the imaging pixel to vary over time, and (ii) a modulation signal, out of the set of modulation signals, causes each photodiode in the superpixel, at multiple times during an exposure period of a read-out frame, to transfer electric charge from the photodiode to only one storage device, which storage device does not receive electric charge from any other photodiode during the exposure period.",
"[AQ] A system comprising, in combination: (a) a camera, which camera includes an imaging superpixel; and (b) one or more signal generators for producing a set of separate modulation signals, such that (i) each imaging pixel in the imaging superpixel is modulated by a modulation signal that causes sensitivity of the imaging pixel to vary over time, and (ii) a modulation signal, out of the set of modulation signals, causes each photodiode in the superpixel, at multiple times during an exposure period of a read-out frame, to transfer electric charge from the photodiode to a set of storage devices, such that (1) at any given time at which a transfer of electric charge from the photodiode to a storage device occurs, electric charge is being transferred to only one of the storage devices, and electric charge is not being transferred to any other storage device, and (2) electric charge is transferred from the photodiode to each of the storage devices during the exposure period.",
"[AR] A system comprising, in combination: (a) a camera, which camera includes an imaging superpixel; (b) one or more light sources for illuminating a scene by a pattern of light that changes over time; and (c) one or more signal generators for producing a set of separate modulation signals, such that each imaging pixel in the imaging superpixel is modulated by a modulation signal that causes sensitivity of the imaging pixel to vary over time.",
"[AS] A system comprising, in combination: (a) a camera, which camera includes an imaging superpixel; (b) one or more light sources for illuminating a scene by a pattern of light that sweeps across the scene, such that a point in the scene, when directly illuminated by the pattern of light, reflects light directly to the imaging superpixel; and (c) one or more signal generators for producing a set of separate modulation signals that occur while the scene is illuminated by the pattern of light, such that each imaging pixel in the imaging superpixel is modulated by a modulation signal that causes sensitivity of the imaging pixel to vary over time; and (d) one or more computers for processing data indicative of measurements recorded by the imaging superpixel and for calculating, based on this data, 3D spatial coordinates of the point, by performing an algorithm that either (i) involves triangulation; or (ii) involves accessing data that was calculated by a computer using an algorithm that involves triangulation.",
"[AT] A system comprising, in combination: (a) a camera, which camera includes an imaging superpixel; and (b) one or more light sources for illuminating a scene by a pattern of light that sweeps across the scene, such that a point in the scene, when directly illuminated by the pattern of light, reflects light directly to the imaging superpixel; (c) one or more signal generators for producing a set of separate modulation signals, such that (i) each imaging pixel in the imaging superpixel is modulated by a modulation signal that causes sensitivity of the imaging pixel to vary over time; (ii) the set of modulation signals, taken together, comprise a code, each of the modulation signals representing a digit of the code.",
"(iii) each entire sweep of the pattern of light across the scene occurs in a time period, which time period consists of a set of subintervals, the total number of subintervals being equal to the number of permutations of the code; (iv) during each subinterval, the modulation signals, taken together, represent only one of the permutations of the code; (v) intensity of light incident on the imaging superpixel reaches a maximum value for the entire sweep during a specific subinterval; and (d) one or more computers for (i) processing data indicative of measurements recorded by the imaging superpixel, (ii) calculating the permutation of the code represented by the modulation signals during the specific subinterval, and (iii) calculating 3D spatial coordinates of the point.",
"[AU] A method comprising simultaneously modulating a plurality of SLM pixels in an SLM by a set of separate modulation signals, wherein: (a) the plurality of SLM pixels are optically aligned with an imaging superpixel, such that each respective SLM pixel, in one or more states of the respective SLM pixel, forwards light to an imaging pixel in the imaging superpixel; (b) each respective SLM pixel in the SLM is modulated by a modulation signal, out of the set of modulation signals, that causes a forwarding rate of the respective SLM pixel relative to a imaging pixel to vary over time; (c) the set of modulation signals, taken together, comprise a code, each of the modulation signals representing a digit of the code; (d) at any given time during the modulating, the modulation signals, taken together, represent only one of the permutations of a code; (e) the modulation signals, taken together over a time period that spans at least a portion of the modulating, comprise a temporal sequence of all of the permutations of the code.",
"[AV] The method of paragraph [AU], wherein the light that is forwarded comprises light reflected by the SLM.",
"[AW] The method of paragraph [AV], wherein the SLM comprises a digital micromirror device.",
"[AX] The method of paragraph [AV], wherein the SLM comprises a reflective liquid-crystal-on-silicon device.",
"[AY] The method of paragraph [AU], wherein the light that is forwarded comprises light that passes through the SLM.",
"[AZ] The system of paragraph [AY], wherein the SLM comprises a liquid crystal display device.",
"[BA] A system comprising (a) an SLM; and (b) a camera that includes an imaging superpixel; wherein (i) the plurality of SLM pixels are optically aligned with an imaging superpixel, such that each respective SLM pixel, in one or more states of the respective SLM pixel, forwards light to an imaging pixel in the imaging superpixel; (ii) the plurality of SLM pixels are modulated by a set of separate modulation signals, such that (1) each respective SLM pixel in the SLM is modulated by a specific modulation signal, out of the set of modulation signals, which specific modulation signal causes a forwarding rate of the respective SLM pixel relative to a imaging pixel to vary over time; (2) the set of modulation signals, taken together, comprise a code, each of the modulation signals representing a digit of the code, (3) at any given time during the modulating, the modulation signals, taken together, represent only one of the permutations of a code, and (4) the modulation signals, taken together over a time period that spans at least a portion of the modulating, comprise a temporal sequence of all of the permutations of the code; and (vi) the system also includes a signal generator for producing the set of modulation signals.",
"[BB] The system of paragraph [BA], wherein the light that is forwarded comprises light reflected by the SLM.",
"[BC] The system of paragraph [BB], wherein the SLM comprises a digital micromirror device.",
"[BD] The system of paragraph [BB], wherein the SLM comprises a reflective liquid-crystal-on-silicon device.",
"[BE] The system of paragraph [BA], wherein the light that is forwarded comprises light that passes through the SLM.",
"[BF] The system of paragraph [BE], wherein the SLM comprises a liquid crystal display device.",
"[BG] A system comprising, in combination: (a) a camera, which camera includes an imaging superpixel; and (b) one or more computers that are programmed to output a set of separate modulation signals, such that each imaging pixel in the imaging superpixel is modulated by a modulation signal that causes sensitivity of the imaging pixel to vary over time.",
"[BH] The system of paragraph [BG], wherein: (a) the modulation signals each consist of a temporal sequence of modulation states; and (b) the number of times that each specific modulation state occurs, and the order in which the modulation states occur, varies from modulation signal to modulation signal.",
"[BI] The system of paragraph [BG], wherein the set of modulation signals, taken together, comprise a code, each of the modulation signals representing a digit of the code.",
"[BJ] The system of paragraph [BG], wherein the code is a binary code and each of the modulations signals represents a bit of the code.",
"[BK] The system of paragraph [BG], wherein the code is a binary gray code.",
"[BL] The system of paragraph [BG], wherein the code is a 9-bit binary gray code.",
"[BM] The system of paragraph [BG], wherein the code is an n-ary code.",
"[BN] A system comprising, in combination: (a) a camera, which camera includes an imaging superpixel; (b) one or more computers that are programmed to output a set of separate modulation signals, such that (i) each imaging pixel in the imaging superpixel is modulated by a modulation signal that causes sensitivity of the imaging pixel to vary over time, and (ii) a modulation signal, out of the set of modulation signals, causes each photodiode in the superpixel, at multiple times during an exposure period of a read-out frame, to transfer electric charge from the photodiode to only one storage device, which storage device does not receive electric charge from any other photodiode during the exposure period.",
"[BO] A system comprising, in combination: (a) a camera, which camera includes an imaging superpixel; and (b) one or more computers that are programmed to output a set of separate modulation signals, such that (i) each imaging pixel in the imaging superpixel is modulated by a modulation signal that causes sensitivity of the imaging pixel to vary over time, and (ii) a modulation signal, out of the set of modulation signals, causes each photodiode in the superpixel, at multiple times during an exposure period of a read-out frame, to transfer electric charge from the photodiode to a set of storage devices, such that (1) at any given time at which a transfer of electric charge from the photodiode to a storage device occurs, electric charge is being transferred to only one of the storage devices, and electric charge is not being transferred to any other storage device, and (2) electric charge is transferred from the photodiode to each of the storage devices during the exposure period.",
"[BP] A system comprising, in combination: (a) a camera, which camera includes an imaging superpixel; (b) one or more light sources for illuminating a scene by a pattern of light that changes over time; and (c) one or more signal generators for producing a set of separate modulation signals, such that each imaging pixel in the imaging superpixel is modulated by a modulation signal that causes sensitivity of the imaging pixel to vary over time.",
"[BQ] A system comprising, in combination: (a) a camera, which camera includes an imaging superpixel; (b) one or more light sources for illuminating a scene by a pattern of light that sweeps across the scene, such that a point in the scene, when directly illuminated by the pattern of light, reflects light directly to the imaging superpixel; and (c) one or more computers that are programmed to output a set of separate modulation signals that occur while the scene is illuminated by the pattern of light, such that each imaging pixel in the imaging superpixel is modulated by a modulation signal that causes sensitivity of the imaging pixel to vary over time; and (d) one or more computers for processing data indicative of measurements recorded by the imaging superpixel and for calculating, based on this data, 3D spatial coordinates of the point, by performing an algorithm that either (i) involves triangulation; or (ii) involves accessing data that was calculated by a computer using an algorithm that involves triangulation.",
"[BR] A system comprising, in combination: (a) a camera, which camera includes an imaging superpixel; and (b) one or more light sources for illuminating a scene by a pattern of light that sweeps across the scene, such that a point in the scene, when directly illuminated by the pattern of light, reflects light directly to the imaging superpixel; (c) one or more computers that are programmed to output a set of separate modulation signals, such that (i) each imaging pixel in the imaging superpixel is modulated by a modulation signal that causes sensitivity of the imaging pixel to vary over time; (ii) the set of modulation signals, taken together, comprise a code, each of the modulation signals representing a digit of the code.",
"(iii) each entire sweep of the pattern of light across the scene occurs in a time period, which time period consists of a set of subintervals, the total number of subintervals being equal to the number of permutations of the code; (iv) during each subinterval, the modulation signals, taken together, represent only one of the permutations of the code; (v) intensity of light incident on the imaging superpixel reaches a maximum value for the entire sweep during a specific subinterval; and (d) one or more computers for (i) processing data indicative of measurements recorded by the imaging superpixel, (ii) calculating the permutation of the code represented by the modulation signals during the specific subinterval, and (iii) calculating 3D spatial coordinates of the point.",
"The above description (including without limitation any attached drawings and figures) describes illustrative implementations of the invention.",
"However, the invention may be implemented in other ways.",
"The methods and apparatus which are described above are merely illustrative applications of the principles of the invention.",
"Other arrangements, methods, modifications, and substitutions by one of ordinary skill in the art are therefore also within the scope of the present invention.",
"Numerous modifications may be made by those skilled in the art without departing from the scope of the invention.",
"Also, this invention includes without limitation each combination and permutation of one or more of the abovementioned implementations, embodiments and features."
]
] |
Patent_15871444
|
[
[
"Three-dimensional Printing System and Equipment Assembly",
"A three-dimensional printing system and equipment assembly for the manufacture of three-dimensionally printed articles is provided.",
"The equipment assembly includes a three-dimensional printing build system, an optional liquid removal system and an optional harvester system.",
"The build system includes a conveyor, plural build modules and at least one build station having a powder-layering system and a printing system.",
"The equipment assembly can be used to manufacture pharmaceutical, medical, and non-pharmaceutical/non-medical objects.",
"It can be used to prepare single or multiple articles."
],
[
"1-134.",
"(canceled) 135) A three-dimensional printing equipment assembly comprising: a circuitous or oscillating conveyor system; plural build modules comprising respective height adjustable platforms; at least one build station that forms respective one or more three-dimensionally printed articles on the plural build modules; a bed transfer system that transfers the one or more three-dimensionally printed articles away from the conveyor system; a control system that determines and specifies the location of one or more of the plural build modules relative to the conveyor system; wherein the conveyor system repeatedly conducts the plural build modules through the at least one build station.",
"136) The equipment assembly of claim 135 further comprising one or more build module positioning systems, one or more conveyor positioning systems or both.",
"137) The equipment assembly of claim 136, wherein the control system comprises a proximity sensor that specifies the location of one or more of the plural build modules relative to the conveyor system.",
"138) The equipment assembly of claim 137 further comprising a component that considers at least the linear speed of the conveyor or of the plural build modules when forming the respective one or more three-dimensionally printed articles.",
"139) The equipment assembly of claim 138 further comprising a control system that determines the location of respective ones of the plural build modules.",
"140) The equipment assembly of claim 139 further comprising a synchronizer that facilitates synchronization of operation of various components of the equipment assembly.",
"141) The equipment assembly of claim 135, wherein the control system comprises a proximity sensor that specifies the location of one or more of the plural build modules relative to the conveyor system.",
"142) The equipment assembly of claim 135 further comprising a component that considers at least the linear speed of the conveyor or of the plural build modules when forming the respective one or more three-dimensionally printed articles.",
"143) The equipment assembly of claim 135 further comprising a control system that determines the location of respective ones of the plural build modules.",
"144) The equipment assembly of claim 135 further comprising a synchronizer that facilitates synchronization of operation of various components of the equipment assembly.",
"145) The equipment assembly of claim 135 further comprising at least one of the following: a) at least one harvesting system; b) at least one liquid removal system; c) at least one packaging system; d) at least one powder recovery system for recovering, and optionally recycling, unprinted powder; e) at least one liquid detector; f) at least one inspection system; g) at least one dedusting system; or h) at least one build plate loading system.",
"146) A method for the preparation of three-dimensionally printed articles, the method comprising: with a conveyor system, repeatedly conveying plural build modules through at least one build station to form from build material respective one or more three-dimensionally printed articles in respective ones of the plural build modules; considering at least the linear speed of the conveyor system or of the plural build modules when forming the respective one or more three-dimensionally printed articles; determining the location of respective ones of the plural build modules and/or specifying the location of respective ones of the plural build modules relative to the conveyor system when forming the respective one or more three-dimensionally printed articles; transferring the one or more three-dimensionally printed articles away from the conveyor system; wherein: the plural build modules comprise respective height adjustable platforms; and the conveyor is a circuitous or reciprocating conveyor.",
"147) The method of claim 146 further comprising forming plural three-dimensionally printed incremental layers during formation of respective ones of the one or more three-dimensionally printed articles.",
"148) The method of claim 147, wherein the build material is powder material, and the step of forming plural three-dimensionally printed incremental layers comprises forming respective plural powder layers and binding particles of the plural powder layers according to one or more predetermined patterns.",
"149) The method of claim 148 further comprising charging powder onto respective ones of the plural build modules at a feed rate that takes into consideration the linear speed of the conveyor or the plural build modules.",
"150) The method of claim 149 further comprising creating print instructions specifying or considering one or more patterns to be printed on respective ones of the powder layers.",
"151) The method of claim 150, wherein the print instructions specify or consider at least the linear speed of respective ones of the plural build modules.",
"152) The method of claim 151, wherein the print instructions further specify or consider the intended print density of the one or more patterns to be printed.",
"153) The method of claim 150, wherein the print instructions further specify or consider the intended print density of the one or more patterns to be printed.",
"154) The method of claim 148 further comprising creating print instructions specifying or considering one or more patterns to be printed on respective ones of the powder layers.",
"155) The method of claim 146 further comprising at least one of the following steps: a) harvesting the one or more three-dimensionally printed articles; b) removing liquid from the one or more three-dimensionally printed articles; c) dedusting the one or more three-dimensionally printed articles; d) packaging the one or more three-dimensionally printed articles; e) recovering loose build material; f) detecting the presence, amount or concentration of liquid present in the one or more three-dimensionally printed articles; g) inspecting the one or more three-dimensionally printed articles; h) controlling one or more components of the equipment assembly with a control system comprising one or more computerized controllers, one or more computers, and one or more user interfaces for the one or more computers; i) providing printing instructions; j) providing one or more two-dimensional image files comprising pixels; k) forming plural stacked three-dimensionally printed incremental layers to form the one or more three-dimensionally printed articles; l) transferring surplus build material from one of said plural build modules to an adjacent one of said plural build modules; or m) creating print instructions specifying or considering one or more patterns to be printed."
],
[
"<SOH> BACKGROUND OF THE INVENTION <EOH>Rapid prototyping describes various techniques for fabricating a three-dimensional prototype of an object from a computer model of the object.",
"One technique is three-dimensional printing, whereby a printer is used to fabricate the 3-D prototype from a plurality of two-dimensional layers.",
"In particular, a digital representation of a 3-D object is stored in a computer memory.",
"Computer software sections the representation of the object into a plurality of distinct 2-D layers.",
"Alternatively, a stream (sequential series) of instructions for each incremental layer maybe entered directly, e.g.",
"a series of images.",
"A 3-D printer then fabricates a thin layer of bound material for each 2-D image layer sectioned by the software.",
"Together, the layers are printed one on top of the other and adhere to each other to form the desired prototype.",
"Three-dimensional powder-liquid printing technology has been used to prepare articles such as pharmaceutical dosage forms, mechanical prototypes and concept models, molds for casting mechanical parts, bone growth promoting implants, electronic circuit boards, scaffolds for tissue engineering, responsive biomedical composites, tissue growth promoting implants, dental restorations, jewelry, fluid filters and other such articles.",
"Three-dimensional printing is a solid freeform fabrication technique/rapid-prototyping technique in which thin layers of powder are spread onto a surface and selected regions of the powder are bound together by the controlled deposition (“printing”) of a fluid.",
"This basic operation is repeated layer-by-layer, with each new layer formed on top of and adhered to the previously printed layer, to eventually make three-dimensional objects within a bed of unbound powder.",
"When the printed objects have sufficient cohesion, they may be separated from the unbound powder.",
"Systems and equipment assemblies for three-dimensional printing of articles are commercially available or in use by others: Massachusetts Institute of Technology Three-Dimensional Printing Laboratory (Cambridge, Mass.",
"), Z Corporation's 3DP and HD3DP™ systems (Burlington, Mass.",
"), The Ex One Company, L.L.C.",
"(Irwin, Pa.), Soligen (Northridge, Calif.), Specific Surface Corporation (Franklin, Mass.",
"), TDK Corporation (Chiba-ken, Japan), Therics L.L.C.",
"(Akron, Ohio, now a part of Integra Lifesciences), Phoenix Analysis & Design Technologies (Tempe, Ariz.), Stratasys, Inc.'s Dimension™ system (Eden Prairie, Minn.), Objet Geometries (Billerica, Mass.",
"or Rehovot, Israel), Xpress3D (Minneapolis, Minn.), and 3D Systems' Invision™ system (Valencia, Calif.).",
"Some systems have been described in the patent literature: U.S. Publications No.",
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"1,631,440, which employs a cylindrical (radial or polar) coordinate-based system due to its construction.",
"Three-dimensional printing systems that employ radial or polar coordinate-based printing systems are disadvantageous because having each jetting position located at a different radial position requires that the surface speed of the substrate underneath each jetting position will vary.",
"The surface speed will be greatest for the jetting position furthest from the center of rotation.",
"This can be compensated for by normalizing the print density across all jetting positions by either adjusting the input images or possibly the drive frequency.",
"However, these methods of compensation simply cause objects printed radially to emulate each other as opposed to true replicates.",
"The angle of entry of the droplets into the powder bed will also vary with radial position again creating subtle differences in the objects printed at different locations.",
"Alignment and interleaving of multiple print heads is another disadvantage to radially printing.",
"Although feasible it is more complex than for Cartesian systems."
],
[
"<SOH> SUMMARY OF THE INVENTION <EOH>The present invention provides a manufacturing system and equipment assembly useful for the preparation of articles by three-dimensional printing.",
"The system and assembly can be used for high through-put continuous, semi-continuous, or batch manufacture with minimal product loss, high efficiency, and high product reproducibility in the context of flexible article design.",
"The invention provides a three-dimensional printing equipment assembly comprising: a) a three-dimensional printing build system comprising: a conveyor system adapted to conduct plural build modules; plural build modules engaged with the conveyor system, wherein the build modules are adapted to receive and temporarily retain powder from a powder layering system; and at least one build station comprising: 1) at least one powder layering system adapted to form incremental powder layers within build modules; and 2) at least one printing system adapted to apply a liquid according to a predetermined pattern to incremental powder layers within build modules; wherein the conveyor system repeatedly transports the build modules from the at least one powder layering system to the at least one printing system to form a three-dimensionally printed bed comprising one or more three-dimensionally printed articles in the build modules.",
"In some embodiments, the three-dimensional printing equipment assembly further comprises at least one liquid removal system adapted to receive one or more three-dimensionally printed beds and to remove liquid from one or more powder layers onto which the liquid has been applied and/or from the three-dimensionally printed bed.",
"In some embodiments, a build module comprises an incrementally height adjustable platform adapted to receive and temporarily retain at least one incremental layer or plural stacked incremental layers of powder.",
"In some embodiments, a build module comprises a body comprising an upper surface with a cavity, a height adjustable build platform disposed within the cavity, height adjuster engaged with the body and the platform, and engagement means.",
"In some embodiments, plural build modules are removably engaged with the conveyor system.",
"In some embodiments, the platform is adapted to lower (recess) and/or raise by one or more increments after placement of an incremental layer of powder thereon.",
"The platform displacement can occur prior to or after placement of a subsequent incremental layer of powder thereon, thereby press-rolling or removing a portion of powder from a powder layer that has already been laid down.",
"In some embodiments, the size of an increment is predetermined.",
"In some embodiments, the build module comprises one or more sidewalls surrounding the build plate and being adapted to retain powder on the height adjustable platform.",
"In some embodiments, the build module further comprises a removable build plate disposed below the upper surface of the build module.",
"In some embodiments, the removable build plate is disposed above the height adjustable platform and is adapted to receive and support one or more incremental layers of powder.",
"In some embodiments, the removable build plate is flat, porous, perforated, textured, coated, knurled, smooth or a combination thereof.",
"In some embodiments, engagement means are adapted to removably engage a build module with the conveyor system.",
"In some embodiments, the conveyor system conducts the plural build modules along a planar circuitous path, a horizontal circuitous path, a vertical circuitous path, or a combination thereof.",
"In some embodiments, the conveyor system is adapted to transport plural build modules along a path in a counterclockwise direction or clockwise direction.",
"In some embodiments, the path of the modular conveyor system is circular, ellipsoidal, rectangular, semicircular, square, triangular, pentagonal, hexagonal, octagon, oval, polygonal, parallelogram, quadrilateral, geometric, symmetrical, asymmetrical, or equivalents thereof with rounded corners and/or edges.",
"In some embodiments, the modular conveyor system comprises plural conveyor modules, at least one drive motor, at least one positioning controller, and a path along which plural build modules are conducted.",
"In some embodiments, a conveyor module comprises a body, one or more build module engagement means, and conveyor module engagement means by way of which plural conveyor modules are adapted to engage to form a modular conveyor.",
"In some embodiments, the conveyor system comprises plural attachments adapted to removably retain the plural build modules.",
"In some embodiments, the attachment comprises plural one or more metal links with cam followers or comprises wheels, plates and/or bearings attached to a build module and mounted on a rail system upon which the build module is conducted.",
"In some embodiments, the conveyor system further comprises one or more positioning-controllers.",
"In some embodiments, the conveyor system is a continuous or discontinuous loop system.",
"In some embodiments, the at least one build station is incrementally height adjustable with respect to the build modules, whereby the vertical space between the build module and the build station can be adjusted by one or more increments.",
"In some embodiments, an incrementally height adjustable build station is adapted to raise by one or more increments after placement of a layer of powder on a build module and prior to placement of a subsequent layer of powder the build module.",
"In some embodiments, a change in height is achieved by changing vertical position with respect to a prior position of the platform or with respect to an absolute position of the platform relative to the build module.",
"In some embodiments, the build station is vertically fixed with respect to the build modules and a build platform within a build module is vertically height adjustable with respect to the build module so that the vertical distance between the build station and the build module remains the same during a print lap or print cycle.",
"In some embodiments, the size of the increment is the same for each incremental layer of a build cycle, is different for one or more incremental layers of a build cycle or a combination thereof.",
"A build cycle comprises one or more build laps or plural build laps and is defined as the sum total of build laps required to form a 3DP article.",
"A build lap is defined as the process of forming a printed incremental layer, i.e.",
"placing an incremental layer of powdered build material and depositing (printing) liquid upon it.",
"Accordingly, a build cycle results in the formation of plural stacked printed incremental layers that adhere to one another to together form a three-dimensionally printed article.",
"In some embodiments, the at least one powder layering system comprises at least one powder fill head.",
"In some the embodiments, the powder fill head is stationary, meaning it does not move, either longitudinally or transversely with respect to the plane of the upper surface of a build module, when applying an incremental layer of powder onto the build module.",
"In some embodiments, a powder fill head comprises at least one powder fill head body, at least one powder spreader, and at least one powder-height controller.",
"In some embodiments, a powder layering system comprises a powder fill head, at least one powder reservoir and a powder feeder tube adapted to transfer powder from the powder reservoir to the powder fill head.",
"In some embodiments, the powder spreader is a cylindrical roller the axis of which has or defines a radial direction of motion opposite the linear direction of motion of a build module through the powder layering system.",
"In some embodiments, the powder spreader is a cylindrical roller, bar, rod, plate or straight smooth edge.",
"In some embodiments, the powder fill head comprises a hopper or chute.",
"In some embodiments, the at least one printing system is adapted to apply (deposit) liquid to the powder according to a Cartesian coordinate algorithm instead of a polar (radial) coordinate algorithm (cylindrical coordinate system, circular coordinate system, or spherical coordinate system).",
"In some embodiments, the printing system comprises at least one print head adapted to deposit liquid onto an incremental layer of powder in a build station and at least one liquid feed system.",
"A print head can comprise one or more print modules or plural print modules.",
"In some embodiments, the invention excludes a printing system adapted to apply liquid to the powder solely according to a polar (radial) coordinate system.",
"In some embodiments, the invention excludes an equipment assembly or a method wherein the powder fill head moves laterally or transversely or is not stationary, with respect to a build module, while depositing an incremental powder layer.",
"In some embodiments, the invention excludes an equipment assembly or a method wherein the print head moves laterally or transversely or is not stationary, with respect to a build module, while applying liquid to an incremental powder layer.",
"In some embodiments, the at least one printing system is adapted to apply (deposit) liquid as a three-dimensional pattern of droplets or as plural two-dimensional patterns of droplets defining one or more articles.",
"In some embodiments, the pattern comprises droplets placed at equal spacing within one or more articles.",
"In some embodiments, this pattern comprises droplets placed at unequal spacing within one or more articles.",
"In some embodiments, this pattern comprises droplets with different spacing within different regions of an article.",
"In some embodiments, this pattern comprises droplets with tighter spacing (i.e., higher print density) in a region defining the exterior of an article.",
"In some embodiments, this pattern comprises droplets with looser spacing (i.e., lower print density) in a region interior to an article.",
"In some embodiments, more than one pattern is used.",
"In some embodiments, more than one liquid is used.",
"In some embodiments, the liquid comprises a pure solvent, blend of solvents, solution, suspension, colloid, emulsion, melt or a combination thereof.",
"In some embodiments, both the print head and the powder fill head are stationary during formation of a printed incremental layer or are stationary as otherwise described herein.",
"In some embodiments, the equipment assembly further comprises a bed transfer system adapted to transfer three-dimensionally printed beds, one or more at a time, away from the three-dimensional printing build system.",
"In some embodiments, the bed transfer system is adapted to transfer three-dimensionally printed beds to one or more liquid removal systems and/or one or more harvesting systems.",
"In some embodiments, the transfer system is integrated with the conveyor system, the liquid removal system or both.",
"In some embodiments, the liquid removal system comprises at least one dryer.",
"In some embodiments, the liquid removal system is adapted to process two or more build plates and their contents at a time.",
"In some embodiments, the liquid removal system is adapted to process two or more printed beds at a time.",
"In some embodiments, the liquid removal system is adapted to process two or more printed articles at a time.",
"In some embodiments, the three-dimensionally printed powder bed comprises loose (unbound) powder and one or more three-dimensionally printed articles prior to harvesting of the printed article(s) from the loose powder.",
"In some embodiments, the equipment assembly comprises one or more harvesting systems adapted to separate loose powder from the one or more three-dimensionally printed articles.",
"In some embodiments, the harvesting system processes printed beds already processed by the liquid removal system.",
"In some embodiments, the harvesting system comprises loose powder collector and three-dimensionally printed article collector.",
"In some embodiments, the harvesting system comprises a vibrating or orbiting surface adapted to receive the three-dimensionally printed powder bed or the three-dimensionally printed articles.",
"In some embodiments, the harvesting system comprises a vacuum conveyor with a screen to separate articles from loose powder.",
"The vibrating surface can be perforated, non-perforated, corrugated, smooth or non-smooth to permit separation of loose powder from the printed articles.",
"In some embodiments, the equipment assembly further comprises a dedusting system adapted to remove loose particles from printed articles that have been harvested from a printed powder bed.",
"A dedusting system can comprise a housing defining a dedusting region, one or more air jets, e.g.",
"one or more air knives, that direct pressurized air into the dedusting region, one or more surfaces or retainers in the dedusting region for temporarily retaining one or more printed articles being dedusted, and one or more outlets through which air and removed particles exit the housing or dedusting region.",
"In some embodiments, the equipment assembly further comprises a build plate loading system adapted to place one or more build plates on the height adjustable platform(s) of the one or more build modules.",
"In some embodiments, the equipment assembly further comprises one or more powder recovery systems adapted to collect powder from the one or more systems of the equipment assembly and return it to a powder reservoir.",
"The recovery system can comprise one or more loose powder collectors and one or more conduits for conducting loose powder from the one or more collectors to a powder reservoir.",
"The recovery system can further comprise: a) one or more powder mixers for mixing recovered loose powder with virgin loose powder; b) one or more pressurized air powder handling systems that facilitate transfer of loose powder from one location to another; c) one or more vacuum powder handling systems that facilitate transfer of loose powder from one location to another; d) one or more mechanical powder handling systems that transfer loose powder from one location to another; e) one or more manual powder handling systems that transfer loose powder from one location to another; or f) a combination thereof.",
"In some embodiments, the equipment assembly further comprises a control system comprising one or more computerized controllers, one or more computers, and one or more user interfaces for one or more computers.",
"In some embodiments, one or more components of the equipment assembly are computer controlled.",
"In some embodiments, one or more components of the three-dimensional printing build system are computer controlled.",
"In some embodiments, the conveyor system, the height adjustable platforms of the build modules, the at least one powder layering system and the at least one printing system are computer controlled.",
"In some embodiments, the equipment assembly is adapted to spread layers of powder and deposit (print) droplets of liquid in a predetermined pattern on to the layers according to instructions provided by a computerized controller.",
"In some embodiments, the predetermined pattern is based on one or more two-dimensional image files comprising pixels.",
"In some embodiments, the two-dimensional image files are structured such that certain pixels indicate dispensing of droplets, and other pixels represent no dispensing of droplets.",
"In some embodiments, the two-dimensional image files include different colors of pixels to indicate dispensing of different liquids, or no dispensing of liquid.",
"In some embodiments, the predetermined pattern for applying the liquid is the same in each incremental layer, is the same in two or more incremental layers, is different in one or more incremental layers, is different in all incremental layers, or is the same for a first group of incremental layer and the same for a second group of incremental layers but the pattern for the first group is different than the pattern for the second group.",
"In some embodiments, the equipment assembly further comprises one or more working surfaces, tables, gantries, enclosures, and/or platforms.",
"The invention also provides a three-dimensional printing equipment assembly comprising: a) a three-dimensional printing build system comprising: a conveyor system adapted to conduct plural build modules and comprising positioning-controller and plural build module engagements; plural build modules engaged with the conveyor system, wherein the build modules are adapted to receive and temporarily retain powder from a powder layering system, and wherein a build module comprises an incrementally height adjustable platform, an optional build plate disposed above the platform, and one or more sidewalls defining a cavity within which the platform the optional build plate can be disposed; at least one build station comprising: 1) at least one powder layering system adapted to form incremental powder layers within the cavity of build modules and comprising at least one powder fill head, at least one powder spreader and at least one powder reservoir; and 2) at least one printing system adapted to apply a liquid according to a predetermined pattern to incremental powder layers within build modules and comprising at least one liquid feed system and at least one print head adapted to deposit liquid according to a predetermined pattern onto incremental layers of powder in a build module; wherein the conveyor system is adapted to repeatedly transport the plural build modules from the at least one powder layering system to the at least one printing system, whereby the three-dimensional printing build system forms a three-dimensionally printed bed comprising one or more three-dimensionally printed articles, and optionally loose (unbound or only partially bound) powder that has not been printed upon; b) at least one harvesting system adapted to separate loose powder from one or more three-dimensionally printed articles in a three-dimensionally printed bed; and c) optionally, at least one liquid removal system adapted to remove liquid from one or more incremental powder layers onto which the liquid has been applied and/or from the three-dimensionally printed bed, wherein the liquid removal system is adapted to process two or more build modules at a time.",
"Some embodiments of the invention include those wherein: 1) at least one liquid removal system is present; 2) the equipment assembly further comprises at least one packaging system adapted to package one or more three-dimensionally printed articles; 3) the conveyor system is adapted to repeatedly transport the plural build modules, from the at least one powder layering system to the at least one printing system, in a linear manner, and not a radial manner, thereby facilitating Cartesian coordinate printing and not radial (polar coordinate) printing; 4) the equipment assembly further comprises a powder recovery system for recovering, and optionally recycling, unprinted powder; 5) the equipment assembly further comprises a liquid detector; 6) a liquid detector detects the presence of liquid in one or more printed incremental layers and/or in one or more printed articles; 7) the equipment assembly further comprises an inspection system; 8) an inspection system is a printed powder inspection system that determines the integrity of printing in one or more printed incremental layers and/or one or more printed articles and/or determines whether or not powder was properly applied in one or more incremental layers; 9) determining the integrity of printing comprises at least one of determining whether or not liquid has been correctly applied to one or more incremental layers according to one or more predetermined patterns and/or determining whether or not liquid has been correctly applied to one or more incremental layers according to a predetermined amount; 10) the inspection system is a printed article inspection system that determines whether or not one or more printed articles have the correct size, shape, weight, appearance, density, content and/or color; 11) the inspection system is a liquid application inspection system that monitors droplets of liquid applied by the print head to powder; 12) the inspection system comprises one or more cameras; and/or 13) a camera is independently selected at each occurrence from the group consisting of a visible wavelength camera, an UV wavelength camera, a near infrared wavelength camera, an x-ray camera and an infrared wavelength camera.",
"The invention includes all combinations of the embodiments, subembodiments and aspects disclosed herein.",
"Accordingly, the invention includes the embodiments and aspects specifically disclosed, broadly disclosed, or narrowly disclosed herein, as well as combinations thereof and subcombinations of the individual elements of said embodiments and aspects.",
"Other features, advantages and embodiments of the invention will become apparent to those skilled in the art by the following description, accompanying examples."
],
[
"CROSS-REFERENCE TO EARLIER FILED APPLICATIONS This application is a continuation of and claims the benefit of U.S. Ser.",
"No.",
"15/422,969 filed Feb. 2, 2017, which is a continuation of U.S. Ser.",
"No.",
"15/077,112 filed Mar.",
"22, 2016, now U.S. Pat.",
"No.",
"9,517,592, issued Dec. 13, 2016, which is a continuation of U.S. Ser.",
"No.",
"15/046,714 filed Feb. 18, 2016, now U.S. Pat.",
"No.",
"9,517,591, issued Dec. 13, 2016, which is a continuation of U.S. Ser.",
"No.",
"14/501,716 filed Sep. 30, 2014, now U.S. Pat.",
"No.",
"9,610,735 issued Apr.",
"4, 2017, which is a continuation of U.S. Ser.",
"No.",
"14/016,697, filed Sep. 3, 2013, now U.S. Pat.",
"No.",
"8,888,480, issued Nov. 18, 2014, which is a continuation of and claims the benefit of PCT/US2013/057466 filed Aug. 30, 2013, which claims the benefit of provisional application 61/696,839 filed Sep. 5, 2012, and the application U.S. Ser.",
"No.",
"15/422,969 is a continuation of U.S. Ser.",
"No.",
"14/501,716 filed Sep. 30, 2014, now U.S. Pat.",
"No.",
"9,610,735 issued Apr.",
"4, 2017, the entire disclosures of which are hereby incorporated by reference.",
"FIELD OF THE INVENTION The present invention concerns a manufacturing system and equipment assembly and use thereof for the preparation three-dimensional printing of articles from one or more powders and one or more liquids applied to the powder.",
"BACKGROUND OF THE INVENTION Rapid prototyping describes various techniques for fabricating a three-dimensional prototype of an object from a computer model of the object.",
"One technique is three-dimensional printing, whereby a printer is used to fabricate the 3-D prototype from a plurality of two-dimensional layers.",
"In particular, a digital representation of a 3-D object is stored in a computer memory.",
"Computer software sections the representation of the object into a plurality of distinct 2-D layers.",
"Alternatively, a stream (sequential series) of instructions for each incremental layer maybe entered directly, e.g.",
"a series of images.",
"A 3-D printer then fabricates a thin layer of bound material for each 2-D image layer sectioned by the software.",
"Together, the layers are printed one on top of the other and adhere to each other to form the desired prototype.",
"Three-dimensional powder-liquid printing technology has been used to prepare articles such as pharmaceutical dosage forms, mechanical prototypes and concept models, molds for casting mechanical parts, bone growth promoting implants, electronic circuit boards, scaffolds for tissue engineering, responsive biomedical composites, tissue growth promoting implants, dental restorations, jewelry, fluid filters and other such articles.",
"Three-dimensional printing is a solid freeform fabrication technique/rapid-prototyping technique in which thin layers of powder are spread onto a surface and selected regions of the powder are bound together by the controlled deposition (“printing”) of a fluid.",
"This basic operation is repeated layer-by-layer, with each new layer formed on top of and adhered to the previously printed layer, to eventually make three-dimensional objects within a bed of unbound powder.",
"When the printed objects have sufficient cohesion, they may be separated from the unbound powder.",
"Systems and equipment assemblies for three-dimensional printing of articles are commercially available or in use by others: Massachusetts Institute of Technology Three-Dimensional Printing Laboratory (Cambridge, Mass.",
"), Z Corporation's 3DP and HD3DP™ systems (Burlington, Mass.",
"), The Ex One Company, L.L.C.",
"(Irwin, Pa.), Soligen (Northridge, Calif.), Specific Surface Corporation (Franklin, Mass.",
"), TDK Corporation (Chiba-ken, Japan), Therics L.L.C.",
"(Akron, Ohio, now a part of Integra Lifesciences), Phoenix Analysis & Design Technologies (Tempe, Ariz.), Stratasys, Inc.'s Dimension™ system (Eden Prairie, Minn.), Objet Geometries (Billerica, Mass.",
"or Rehovot, Israel), Xpress3D (Minneapolis, Minn.), and 3D Systems' Invision™ system (Valencia, Calif.).",
"Some systems have been described in the patent literature: U.S. Publications No.",
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"1,631,440, which employs a cylindrical (radial or polar) coordinate-based system due to its construction.",
"Three-dimensional printing systems that employ radial or polar coordinate-based printing systems are disadvantageous because having each jetting position located at a different radial position requires that the surface speed of the substrate underneath each jetting position will vary.",
"The surface speed will be greatest for the jetting position furthest from the center of rotation.",
"This can be compensated for by normalizing the print density across all jetting positions by either adjusting the input images or possibly the drive frequency.",
"However, these methods of compensation simply cause objects printed radially to emulate each other as opposed to true replicates.",
"The angle of entry of the droplets into the powder bed will also vary with radial position again creating subtle differences in the objects printed at different locations.",
"Alignment and interleaving of multiple print heads is another disadvantage to radially printing.",
"Although feasible it is more complex than for Cartesian systems.",
"SUMMARY OF THE INVENTION The present invention provides a manufacturing system and equipment assembly useful for the preparation of articles by three-dimensional printing.",
"The system and assembly can be used for high through-put continuous, semi-continuous, or batch manufacture with minimal product loss, high efficiency, and high product reproducibility in the context of flexible article design.",
"The invention provides a three-dimensional printing equipment assembly comprising: a) a three-dimensional printing build system comprising: a conveyor system adapted to conduct plural build modules; plural build modules engaged with the conveyor system, wherein the build modules are adapted to receive and temporarily retain powder from a powder layering system; and at least one build station comprising: 1) at least one powder layering system adapted to form incremental powder layers within build modules; and 2) at least one printing system adapted to apply a liquid according to a predetermined pattern to incremental powder layers within build modules; wherein the conveyor system repeatedly transports the build modules from the at least one powder layering system to the at least one printing system to form a three-dimensionally printed bed comprising one or more three-dimensionally printed articles in the build modules.",
"In some embodiments, the three-dimensional printing equipment assembly further comprises at least one liquid removal system adapted to receive one or more three-dimensionally printed beds and to remove liquid from one or more powder layers onto which the liquid has been applied and/or from the three-dimensionally printed bed.",
"In some embodiments, a build module comprises an incrementally height adjustable platform adapted to receive and temporarily retain at least one incremental layer or plural stacked incremental layers of powder.",
"In some embodiments, a build module comprises a body comprising an upper surface with a cavity, a height adjustable build platform disposed within the cavity, height adjuster engaged with the body and the platform, and engagement means.",
"In some embodiments, plural build modules are removably engaged with the conveyor system.",
"In some embodiments, the platform is adapted to lower (recess) and/or raise by one or more increments after placement of an incremental layer of powder thereon.",
"The platform displacement can occur prior to or after placement of a subsequent incremental layer of powder thereon, thereby press-rolling or removing a portion of powder from a powder layer that has already been laid down.",
"In some embodiments, the size of an increment is predetermined.",
"In some embodiments, the build module comprises one or more sidewalls surrounding the build plate and being adapted to retain powder on the height adjustable platform.",
"In some embodiments, the build module further comprises a removable build plate disposed below the upper surface of the build module.",
"In some embodiments, the removable build plate is disposed above the height adjustable platform and is adapted to receive and support one or more incremental layers of powder.",
"In some embodiments, the removable build plate is flat, porous, perforated, textured, coated, knurled, smooth or a combination thereof.",
"In some embodiments, engagement means are adapted to removably engage a build module with the conveyor system.",
"In some embodiments, the conveyor system conducts the plural build modules along a planar circuitous path, a horizontal circuitous path, a vertical circuitous path, or a combination thereof.",
"In some embodiments, the conveyor system is adapted to transport plural build modules along a path in a counterclockwise direction or clockwise direction.",
"In some embodiments, the path of the modular conveyor system is circular, ellipsoidal, rectangular, semicircular, square, triangular, pentagonal, hexagonal, octagon, oval, polygonal, parallelogram, quadrilateral, geometric, symmetrical, asymmetrical, or equivalents thereof with rounded corners and/or edges.",
"In some embodiments, the modular conveyor system comprises plural conveyor modules, at least one drive motor, at least one positioning controller, and a path along which plural build modules are conducted.",
"In some embodiments, a conveyor module comprises a body, one or more build module engagement means, and conveyor module engagement means by way of which plural conveyor modules are adapted to engage to form a modular conveyor.",
"In some embodiments, the conveyor system comprises plural attachments adapted to removably retain the plural build modules.",
"In some embodiments, the attachment comprises plural one or more metal links with cam followers or comprises wheels, plates and/or bearings attached to a build module and mounted on a rail system upon which the build module is conducted.",
"In some embodiments, the conveyor system further comprises one or more positioning-controllers.",
"In some embodiments, the conveyor system is a continuous or discontinuous loop system.",
"In some embodiments, the at least one build station is incrementally height adjustable with respect to the build modules, whereby the vertical space between the build module and the build station can be adjusted by one or more increments.",
"In some embodiments, an incrementally height adjustable build station is adapted to raise by one or more increments after placement of a layer of powder on a build module and prior to placement of a subsequent layer of powder the build module.",
"In some embodiments, a change in height is achieved by changing vertical position with respect to a prior position of the platform or with respect to an absolute position of the platform relative to the build module.",
"In some embodiments, the build station is vertically fixed with respect to the build modules and a build platform within a build module is vertically height adjustable with respect to the build module so that the vertical distance between the build station and the build module remains the same during a print lap or print cycle.",
"In some embodiments, the size of the increment is the same for each incremental layer of a build cycle, is different for one or more incremental layers of a build cycle or a combination thereof.",
"A build cycle comprises one or more build laps or plural build laps and is defined as the sum total of build laps required to form a 3DP article.",
"A build lap is defined as the process of forming a printed incremental layer, i.e.",
"placing an incremental layer of powdered build material and depositing (printing) liquid upon it.",
"Accordingly, a build cycle results in the formation of plural stacked printed incremental layers that adhere to one another to together form a three-dimensionally printed article.",
"In some embodiments, the at least one powder layering system comprises at least one powder fill head.",
"In some the embodiments, the powder fill head is stationary, meaning it does not move, either longitudinally or transversely with respect to the plane of the upper surface of a build module, when applying an incremental layer of powder onto the build module.",
"In some embodiments, a powder fill head comprises at least one powder fill head body, at least one powder spreader, and at least one powder-height controller.",
"In some embodiments, a powder layering system comprises a powder fill head, at least one powder reservoir and a powder feeder tube adapted to transfer powder from the powder reservoir to the powder fill head.",
"In some embodiments, the powder spreader is a cylindrical roller the axis of which has or defines a radial direction of motion opposite the linear direction of motion of a build module through the powder layering system.",
"In some embodiments, the powder spreader is a cylindrical roller, bar, rod, plate or straight smooth edge.",
"In some embodiments, the powder fill head comprises a hopper or chute.",
"In some embodiments, the at least one printing system is adapted to apply (deposit) liquid to the powder according to a Cartesian coordinate algorithm instead of a polar (radial) coordinate algorithm (cylindrical coordinate system, circular coordinate system, or spherical coordinate system).",
"In some embodiments, the printing system comprises at least one print head adapted to deposit liquid onto an incremental layer of powder in a build station and at least one liquid feed system.",
"A print head can comprise one or more print modules or plural print modules.",
"In some embodiments, the invention excludes a printing system adapted to apply liquid to the powder solely according to a polar (radial) coordinate system.",
"In some embodiments, the invention excludes an equipment assembly or a method wherein the powder fill head moves laterally or transversely or is not stationary, with respect to a build module, while depositing an incremental powder layer.",
"In some embodiments, the invention excludes an equipment assembly or a method wherein the print head moves laterally or transversely or is not stationary, with respect to a build module, while applying liquid to an incremental powder layer.",
"In some embodiments, the at least one printing system is adapted to apply (deposit) liquid as a three-dimensional pattern of droplets or as plural two-dimensional patterns of droplets defining one or more articles.",
"In some embodiments, the pattern comprises droplets placed at equal spacing within one or more articles.",
"In some embodiments, this pattern comprises droplets placed at unequal spacing within one or more articles.",
"In some embodiments, this pattern comprises droplets with different spacing within different regions of an article.",
"In some embodiments, this pattern comprises droplets with tighter spacing (i.e., higher print density) in a region defining the exterior of an article.",
"In some embodiments, this pattern comprises droplets with looser spacing (i.e., lower print density) in a region interior to an article.",
"In some embodiments, more than one pattern is used.",
"In some embodiments, more than one liquid is used.",
"In some embodiments, the liquid comprises a pure solvent, blend of solvents, solution, suspension, colloid, emulsion, melt or a combination thereof.",
"In some embodiments, both the print head and the powder fill head are stationary during formation of a printed incremental layer or are stationary as otherwise described herein.",
"In some embodiments, the equipment assembly further comprises a bed transfer system adapted to transfer three-dimensionally printed beds, one or more at a time, away from the three-dimensional printing build system.",
"In some embodiments, the bed transfer system is adapted to transfer three-dimensionally printed beds to one or more liquid removal systems and/or one or more harvesting systems.",
"In some embodiments, the transfer system is integrated with the conveyor system, the liquid removal system or both.",
"In some embodiments, the liquid removal system comprises at least one dryer.",
"In some embodiments, the liquid removal system is adapted to process two or more build plates and their contents at a time.",
"In some embodiments, the liquid removal system is adapted to process two or more printed beds at a time.",
"In some embodiments, the liquid removal system is adapted to process two or more printed articles at a time.",
"In some embodiments, the three-dimensionally printed powder bed comprises loose (unbound) powder and one or more three-dimensionally printed articles prior to harvesting of the printed article(s) from the loose powder.",
"In some embodiments, the equipment assembly comprises one or more harvesting systems adapted to separate loose powder from the one or more three-dimensionally printed articles.",
"In some embodiments, the harvesting system processes printed beds already processed by the liquid removal system.",
"In some embodiments, the harvesting system comprises loose powder collector and three-dimensionally printed article collector.",
"In some embodiments, the harvesting system comprises a vibrating or orbiting surface adapted to receive the three-dimensionally printed powder bed or the three-dimensionally printed articles.",
"In some embodiments, the harvesting system comprises a vacuum conveyor with a screen to separate articles from loose powder.",
"The vibrating surface can be perforated, non-perforated, corrugated, smooth or non-smooth to permit separation of loose powder from the printed articles.",
"In some embodiments, the equipment assembly further comprises a dedusting system adapted to remove loose particles from printed articles that have been harvested from a printed powder bed.",
"A dedusting system can comprise a housing defining a dedusting region, one or more air jets, e.g.",
"one or more air knives, that direct pressurized air into the dedusting region, one or more surfaces or retainers in the dedusting region for temporarily retaining one or more printed articles being dedusted, and one or more outlets through which air and removed particles exit the housing or dedusting region.",
"In some embodiments, the equipment assembly further comprises a build plate loading system adapted to place one or more build plates on the height adjustable platform(s) of the one or more build modules.",
"In some embodiments, the equipment assembly further comprises one or more powder recovery systems adapted to collect powder from the one or more systems of the equipment assembly and return it to a powder reservoir.",
"The recovery system can comprise one or more loose powder collectors and one or more conduits for conducting loose powder from the one or more collectors to a powder reservoir.",
"The recovery system can further comprise: a) one or more powder mixers for mixing recovered loose powder with virgin loose powder; b) one or more pressurized air powder handling systems that facilitate transfer of loose powder from one location to another; c) one or more vacuum powder handling systems that facilitate transfer of loose powder from one location to another; d) one or more mechanical powder handling systems that transfer loose powder from one location to another; e) one or more manual powder handling systems that transfer loose powder from one location to another; or f) a combination thereof.",
"In some embodiments, the equipment assembly further comprises a control system comprising one or more computerized controllers, one or more computers, and one or more user interfaces for one or more computers.",
"In some embodiments, one or more components of the equipment assembly are computer controlled.",
"In some embodiments, one or more components of the three-dimensional printing build system are computer controlled.",
"In some embodiments, the conveyor system, the height adjustable platforms of the build modules, the at least one powder layering system and the at least one printing system are computer controlled.",
"In some embodiments, the equipment assembly is adapted to spread layers of powder and deposit (print) droplets of liquid in a predetermined pattern on to the layers according to instructions provided by a computerized controller.",
"In some embodiments, the predetermined pattern is based on one or more two-dimensional image files comprising pixels.",
"In some embodiments, the two-dimensional image files are structured such that certain pixels indicate dispensing of droplets, and other pixels represent no dispensing of droplets.",
"In some embodiments, the two-dimensional image files include different colors of pixels to indicate dispensing of different liquids, or no dispensing of liquid.",
"In some embodiments, the predetermined pattern for applying the liquid is the same in each incremental layer, is the same in two or more incremental layers, is different in one or more incremental layers, is different in all incremental layers, or is the same for a first group of incremental layer and the same for a second group of incremental layers but the pattern for the first group is different than the pattern for the second group.",
"In some embodiments, the equipment assembly further comprises one or more working surfaces, tables, gantries, enclosures, and/or platforms.",
"The invention also provides a three-dimensional printing equipment assembly comprising: a) a three-dimensional printing build system comprising: a conveyor system adapted to conduct plural build modules and comprising positioning-controller and plural build module engagements; plural build modules engaged with the conveyor system, wherein the build modules are adapted to receive and temporarily retain powder from a powder layering system, and wherein a build module comprises an incrementally height adjustable platform, an optional build plate disposed above the platform, and one or more sidewalls defining a cavity within which the platform the optional build plate can be disposed; at least one build station comprising: 1) at least one powder layering system adapted to form incremental powder layers within the cavity of build modules and comprising at least one powder fill head, at least one powder spreader and at least one powder reservoir; and 2) at least one printing system adapted to apply a liquid according to a predetermined pattern to incremental powder layers within build modules and comprising at least one liquid feed system and at least one print head adapted to deposit liquid according to a predetermined pattern onto incremental layers of powder in a build module; wherein the conveyor system is adapted to repeatedly transport the plural build modules from the at least one powder layering system to the at least one printing system, whereby the three-dimensional printing build system forms a three-dimensionally printed bed comprising one or more three-dimensionally printed articles, and optionally loose (unbound or only partially bound) powder that has not been printed upon; b) at least one harvesting system adapted to separate loose powder from one or more three-dimensionally printed articles in a three-dimensionally printed bed; and c) optionally, at least one liquid removal system adapted to remove liquid from one or more incremental powder layers onto which the liquid has been applied and/or from the three-dimensionally printed bed, wherein the liquid removal system is adapted to process two or more build modules at a time.",
"Some embodiments of the invention include those wherein: 1) at least one liquid removal system is present; 2) the equipment assembly further comprises at least one packaging system adapted to package one or more three-dimensionally printed articles; 3) the conveyor system is adapted to repeatedly transport the plural build modules, from the at least one powder layering system to the at least one printing system, in a linear manner, and not a radial manner, thereby facilitating Cartesian coordinate printing and not radial (polar coordinate) printing; 4) the equipment assembly further comprises a powder recovery system for recovering, and optionally recycling, unprinted powder; 5) the equipment assembly further comprises a liquid detector; 6) a liquid detector detects the presence of liquid in one or more printed incremental layers and/or in one or more printed articles; 7) the equipment assembly further comprises an inspection system; 8) an inspection system is a printed powder inspection system that determines the integrity of printing in one or more printed incremental layers and/or one or more printed articles and/or determines whether or not powder was properly applied in one or more incremental layers; 9) determining the integrity of printing comprises at least one of determining whether or not liquid has been correctly applied to one or more incremental layers according to one or more predetermined patterns and/or determining whether or not liquid has been correctly applied to one or more incremental layers according to a predetermined amount; 10) the inspection system is a printed article inspection system that determines whether or not one or more printed articles have the correct size, shape, weight, appearance, density, content and/or color; 11) the inspection system is a liquid application inspection system that monitors droplets of liquid applied by the print head to powder; 12) the inspection system comprises one or more cameras; and/or 13) a camera is independently selected at each occurrence from the group consisting of a visible wavelength camera, an UV wavelength camera, a near infrared wavelength camera, an x-ray camera and an infrared wavelength camera.",
"The invention includes all combinations of the embodiments, subembodiments and aspects disclosed herein.",
"Accordingly, the invention includes the embodiments and aspects specifically disclosed, broadly disclosed, or narrowly disclosed herein, as well as combinations thereof and subcombinations of the individual elements of said embodiments and aspects.",
"Other features, advantages and embodiments of the invention will become apparent to those skilled in the art by the following description, accompanying examples.",
"BRIEF DESCRIPTION OF THE FIGURES The following figures form part of the present description and describe exemplary embodiments of the claimed invention.",
"These drawings are not necessarily drawn to scale, and are instead intended to illustrate the general principles of the invention as further described herein.",
"Although specific embodiments are described below with specific reference to the drawings provided, other embodiments are possible without deviating from the spirit and scope of the present invention.",
"The skilled artisan will, in light of these figures and the description herein, be able to practice the invention without undue experimentation.",
"FIG.",
"1 depicts a top plan view of an exemplary layout of a three-dimensional printing equipment assembly of the invention.",
"FIG.",
"2A depicts a front elevation view of an exemplary build module of the invention.",
"FIG.",
"2B depicts a partial perspective side view of the build module of FIG.",
"2A.",
"FIG.",
"2C depicts a front elevation view of three segments of a segmented or modular conveyor system.",
"FIG.",
"2D depicts a top plan view of the three segments of FIG.",
"2C.",
"FIG.",
"2E depicts a side elevation view of an optional exemplary aspirator.",
"FIG.",
"3A depicts a top plan view of an exemplary printing system of the invention.",
"FIG.",
"3B depicts a side elevation view of the exemplary printing system of FIG.",
"3A.",
"FIG.",
"3C depicts a front elevation view of the exemplary printing system of FIG.",
"3A.",
"FIG.",
"4 depicts a bottom perspective view of an exemplary layout of print modules in the print head of a printing system.",
"FIG.",
"5 depicts bottom plan views of alternate exemplary layouts for the print modules in different print heads.",
"FIG.",
"6 depicts alternate exemplary shapes of the build plates of the invention.",
"FIG.",
"7A depicts a top plan view of an exemplary build plate loading system of the invention.",
"FIG.",
"7B depicts a side elevation view of the exemplary build plate loading system of FIG.",
"7A.",
"FIG.",
"8A depicts a top plan view of an exemplary powder layering system of the invention.",
"FIG.",
"8B depicts a side elevation view of the exemplary powder layering system of FIG.",
"8A.",
"FIG.",
"8C depicts a front elevation view of the exemplary powder layering system of FIG.",
"8A.",
"FIG.",
"9 depicts a perspective view of an exemplary powder fill head of the invention.",
"FIG.",
"10A depicts a top plan view of an exemplary bed transfer system of the invention.",
"FIG.",
"10B depicts a side elevation view of the exemplary bed transfer system of FIG.",
"10A.",
"FIG.",
"10C depicts a partial top plan view of an alternated exemplary bed transfer system.",
"FIGS.",
"11A-11B depict partial sectional side elevation views of alternate embodiments of exemplary three-dimensional printing processes in a build module of the invention.",
"FIGS.",
"12A-12D depict top plan views of exemplary layouts of a three-dimensional printing build system of the invention.",
"FIG.",
"12E depicts a side elevation view of an exemplary layout of a three-dimensional printing build system of the invention.",
"FIG.",
"13A depicts a partial sectional side elevation view of an exemplary dryer or fluid removal system of the invention.",
"FIG.",
"13B depicts a partial sectional side elevation view of an alternate exemplary dryer or fluid removal system of the invention.",
"FIG.",
"14 depicts a side elevation view of an exemplary harvesting system of the invention.",
"FIG.",
"15 depicts a side elevation view of an exemplary packaging system of the invention.",
"FIG.",
"16 depicts a partial top plan view of an exemplary build station comprising a powder layering system and a print head.",
"FIGS.",
"17A-17D depict top plan views of various different embodiments of a print head and arrangements thereof.",
"FIG.",
"18 depicts a perspective view of a combination harvester system and deduster or dedusting system assembly.",
"FIGS.",
"19A-19C together depict an exemplary logic flow for operation of the equipment assembly of the invention.",
"FIG.",
"19A continues to FIG.",
"19B, which continues to FIG.",
"19C, which refers back to FIG.",
"19A.",
"FIG.",
"20 depicts an exemplary logic flow for operation of the powder layering system.",
"FIG.",
"21 depicts an exemplary logic flow for operation of the printing system.",
"FIG.",
"22 depicts an exemplary logic flow for design of a dosage form.",
"DETAILED DESCRIPTION OF THE INVENTION The invention provides an equipment assembly and system useful for the manufacture of articles via a three-dimensional printing process.",
"The assembly and system are suitable for small scale/volume, medium scale/volume and large scale/volume preparation of articles.",
"The three-dimensional printing process comprises forming an incremental layer of powder on a surface and subsequently printing/applying a liquid onto the layer, then repeating the steps of forming and printing a sufficient number of times to form a printed powder bed comprising one or more intended three-dimensionally printed articles and loose powder.",
"Any excess/undesired liquid remaining in the article(s) is removed and the loose powder is separated from the article, which is then collected.",
"Generally, a three-dimensional printing equipment assembly or system comprises various subsystems including one or more three-dimensional printing build systems, one or more harvesting systems, and optionally one or more liquid removal systems.",
"The equipment assembly can comprise one or more three-dimensional printing build systems, one or more harvesting systems, one or more liquid removal systems and optionally one or more other systems.",
"In some embodiments, the equipment assembly further comprises one or more (sub)systems selected from one or more build plate loading systems, one or more powder recovery systems, one or more control systems, one or more build module or conveyor positioning systems, one or more conveyor drive motors, one or more bed transfer systems, or a combination of systems thereof.",
"As used herein, a “three-dimensional printing build system” generally comprises a conveyor system, plural build modules, at least one build station, and optionally one or more other components.",
"The function of the three-dimensional printing build system is to form one or more three-dimensionally printed articles from a multilayered bed of powder in a build module.",
"Plural build modules are engaged with a conveyor system that is adapted to conduct the build modules along a predetermined path which passes through one or more build stations.",
"A build module is conducted to a powder layering system, and an incremental layer of powder is formed on the upper surface of a cavity of a build module.",
"The build module is then conducted to a printing system, and a liquid is applied to the incremental layer of powder according to a predetermined pattern thereby forming a partially or fully bound powder layer (a printed incremental layer).",
"The steps of conducting the build module, forming an incremental layer of powder and applying a liquid to the layer are considered to be a single build lap of the process.",
"Build laps are repeated in build modules such that a printed incremental layer from one lap adheres to a printed incremental layer from a prior or subsequent lap.",
"Build laps are repeated in build modules a sufficient number of times to form a three-dimensionally printed bed comprising one or more three-dimensionally printed articles and loose powder, wherein the three-dimensionally printed article comprises at least two printed incremental layers.",
"The liquid applied to the pattern may or may not dry sufficiently under ambient conditions between build laps; therefore, a liquid removal step can be included between build laps.",
"If, however, the liquid does not dry sufficiently between build laps, then an optional liquid removal step can be conducted following completion of all the build laps, i.e.",
"following completion of a build cycle, for an intended three-dimensionally printed article.",
"The conveyor system is adapted to conduct build modules through a predetermined course/path during and between build laps.",
"Substantially any system useful for conveying solid materials from a first location to a second location and back to the first location can be used.",
"In some embodiments, the conveyor system is a cyclic, linear or oscillating conveyor system.",
"In some embodiments, the cyclic conveyor system conducts build modules from the first location to a second location and then back to the first location.",
"In some embodiments, the conveyor system is a cyclic or iterative conveyor system that conducts build modules two or more times through the same build station(s).",
"In some embodiments, the linear conveyor system conducts build modules from a first build station to a second build station and optionally one or more other build stations.",
"In some embodiments, the oscillating system conducts one or more build modules through at least one build station in a first direction and then conducts the one or more build modules through the at least one build station in an opposite direction.",
"FIG.",
"1 depicts a top plan view of an exemplary three-dimensional printing equipment assembly (1) comprising a conveyor (2) adapted to conduct plural build modules (6) engaged with the conveyor system along a predetermined path through build regions in one or more build stations, respectively, comprising: a) at least one powder layering system (3) adapted to form incremental powder layers within build modules; and b) at least one printing system (4) adapted to apply a liquid according to a predetermined pattern to incremental powder layers within build modules.",
"The build modules are adapted to receive and temporarily retain powder from the powder layering system.",
"In the cyclic system depicted, the conveyor system is a continuous loop system that repeatedly transports/cycles the build modules from the at least one powder layering system to the at least one printing system to form a three-dimensionally printed bed comprising one or more three-dimensionally printed articles in the build modules.",
"The exemplary conveyor system (2) comprises at least one drive (12) and plural conveyor modules (2a), thereby forming a segmented or modular conveyor system.",
"A conveyor module is engaged with a corresponding build module and conducted along a predetermined pathway in the direction of Arrow A.",
"The equipment assembly in FIG.",
"1 is depicted finishing three-dimensional printing of a first batch of 3-D (three dimensional) articles and starting the 3-D printing of a second batch of 3-D articles.",
"A three-dimensionally printed bed from the end of a first build cycle is in build module (6a), and the beginning of the second batch starts with a printed incremental layer in build module (6L).",
"Build module (6a) includes six 3-D articles in a printed bed of powder.",
"As the build modules (6, 6a-6L) are conducted along the predetermined course, they pass through the bed transfer system (8), which transfers build plates containing completed three-dimensionally printed beds, one or more at a time, away from the three-dimensional printing build system.",
"A build module comprises a body (7a), and upper surface (7c) having a cavity with in which a height adjustable build platform (7b) is disposed.",
"An empty build module (6g) optionally receives a build plate (10) as it passes through the build plate loading region of an optional build plate loading system (9).",
"The build module (6h) is now ready to receive powder.",
"Build modules will pass through at least one build station comprising at least one powder layering system (3) and at least one printing system (4).",
"The build module (6j) is depicted passing through the powder dispensing region of a powder layering system (3).",
"The build module (6k) is depicted between the powder layering system (3) and the printing system (4) and in the recovery region of an optional powder recovery system (11), which pick ups loose powder from the upper surface of build modules.",
"The build module (6L), which is the first build module of the next build lap, is depicted passing through the printing region of the printing system (4).",
"A control system, comprising at least one or more computers and one or more use interfaces (5), can be used to control and integrate (coordinate) operation of the various components and systems of the equipment assembly (1).",
"In some embodiments, operation of each of the conveyor system, the height adjustable platforms of the build modules, the at least one powder layering system, and the at least one printing system are controlled by the control system.",
"In some embodiments, operation of one or more of the build plate loading system (9), optional powder recovery system (11) and bed transfer system is controlled by the control system.",
"An equipment assembly can further comprise a bed transfer system (8) adapted to transfer three-dimensionally printed beds, one or more at a time, away from the three-dimensional printing build system.",
"The exemplary bed transfer system (8) depicted is adapted to simultaneously remove two or more printed beds from respective build modules in a bed transfer region.",
"In some embodiments, the bed transfer system is adapted to transfer three-dimensionally printed beds and corresponding build plates (and/or build modules), one or more at a time, away from the three-dimensional printing build system.",
"In some embodiments, a three-dimensional printing equipment assembly comprises: a) a three-dimensional printing build system comprising: a conveyor system adapted to conduct plural build modules; plural build modules engaged with the conveyor system, wherein the build modules are adapted to receive and temporarily retain powder from a powder layering system; and at least one build station comprising: 1) at least one powder layering system adapted to form incremental powder layers within build modules temporarily disposed in a powder dispensing region of the build station; and 2) at least one printing system adapted to apply a liquid according to a predetermined pattern to incremental powder layers temporarily disposed within build modules in a printing region of the build station; wherein the conveyor system repeatedly transports the build modules from the powder dispensing region of the at least one powder layering system to the printing region of the at least one printing system to form a three-dimensionally printed bed comprising one or more three-dimensionally printed articles in the build modules; b) at least one bed transfer system adapted to transfer completed three-dimensionally printed beds, one or more at a time, away from the build region of the three-dimensional printing build system; c) at least one harvesting system adapted to separate loose powder from one or more three-dimensionally printed articles in a three-dimensionally printed bed; d) at least one control system adapted to control one or more systems of the equipment assembly; e) optionally, at least one liquid removal system; and f) optionally, at least one packaging system adapted to package one or more three-dimensionally printed articles.",
"A build module receives and retains powder deposited thereon by a powder layering system.",
"In some embodiments, the build module comprises a height adjustable platform disposed within a cavity in the upper surface of the build module, wherein the cavity is defined by sidewalls.",
"The height adjustable platform in combination with the sidewalls forms a cavity for the powder.",
"The platform can be adapted to raise or lower incrementally.",
"Powder is placed within the cavity and either directly or indirectly (such as by way of a build plate) onto the platform.",
"FIGS.",
"2A-2B depict an exemplary build module (15), wherein FIG.",
"2A is a front elevation view and FIG.",
"2B is a perspective side view.",
"The build module comprises a body (16a), a cavity (16b) in the upper surface (16d) as defined by the surrounding walls (16c), and height adjuster (19a, 19b) engaged with and adapted to raise and lower the height adjustable platform (17) disposed in the cavity.",
"The build module is depicted with a build plate (18) disposed above the platform, and engagement (20) by way of which it is engaged with the conveyor system.",
"A build module can be permanently or removably engaged with the conveyor system.",
"Although the body and cavity of the build module are depicted having a rectangular shape, they can be shaped as needed.",
"The height adjuster can comprise one or more height adjusters.",
"In some embodiments, the height adjuster is incrementally height adjustable thereby rendering the height adjustable platform also incrementally height adjustable.",
"In some embodiments, an incrementally height adjustable component or system is adapted to raise by one or more increments before and/or after placement of a layer of powder on a build module and prior to placement of a subsequent layer of powder the build module.",
"The height of an increment (thus the thickness of an incremental layer) can be controlled in different ways.",
"In some embodiments, the height adjuster is computer controlled, whereby the computer controls raising or lowering of the height adjusting means by the size of an increment and/or by the number of increments.",
"The size (vertical displacement) of an increment can vary from incremental layer to incremental layer, be the same from incremental layer to incremental layer or a combination thereof.",
"In some embodiments, the size of the increment is the same for each incremental layer (build lap) of a build cycle, is different for one or more incremental layers of a build cycle, or a combination thereof.",
"The size of a vertical increment can be relative to a prior initial position of the build platform or the height adjuster of the powder fill head or both.",
"For example, the platform is lowered within the cavity by a first increment to a first position relative to upper surface of the build module.",
"A printed incremental layer is formed on the platform at the first position during a first build lap.",
"The platform is then lowered by a second increment to a second position but relative to where it was at the first position.",
"Another printed incremental layer is formed on the platform while at the second position during a second build lap.",
"This process is repeated until completion of a build cycle.",
"The size of a vertical increment can be relative to one or more absolute positions of the platform in the cavity of a build module.",
"For example, the build module can comprise plural encoders distributed vertically within or adjacent the cavity.",
"The size of a first vertical increment, then, is defined by the absolute position (absolute vertical distance) of the platform with respect to a first encoder.",
"When the platform is lowered by a second increment to a target second vertical position, which is determined according to or defined by the absolute vertical distance of the platform with respect to a second decoder.",
"This type of absolute positioning can be exemplified as follows.",
"If the target increment is 0.50 mm below the upper surface of a build module, the platform is commanded to drop 0.50 mm.",
"If the next target increment is to be an additional 0.25 mm, then the platform is commanded to drop to a depth of 0.75 mm below the upper surface of the build module rather than to command it to drop by 0.25 mm relative to the initial 0.5 mm increment.",
"This approach is generally superior to using relative moves (0.500, then 0.250) as any minor positioning errors will be resolved or at least not accumulate.",
"The build plate is adapted to fit within the upper cavity of a build module and to superpose a height adjustable platform within the cavity.",
"The build plate receives and supports a powder bed and/or incremental powder layer(s).",
"In some embodiments, the removable build plate is flat, porous, perforated, textured, coated, knurled, smooth or a combination thereof.",
"Any regular and/or irregular geometric pattern for the arrangement of perforations can be used.",
"The shape of the build plate can be varied as needed.",
"FIG.",
"6 depicts build plates (40a-40h) shaped as a rectangle with rounded corners (40a), octagon (40b), cross (40c), circle (40d), hexagon (40e), pentagon (40f), half-rectangle/half-circle (40g, bullet-shaped profile), rectangle with one concave end and one convex end (40h); however, any other shape can be used.",
"The porosity (extent of perforation) of a build plate can be adapted as need to improve operation and manufacture.",
"The build plate (40a) comprises plural evenly spaced perforations.",
"The build plate (40b) comprises a lattice-type structure or mesh.",
"The build plate (400 comprises a rough surface with plural perforations.",
"The build plate (40g).",
"A build plate can be made of any material durable enough to withstand three-dimensional printing thereon.",
"In some embodiments, the build plate is adapted for single use or repeated use.",
"In some embodiments, the build plate comprises pressboard, paperboard, cardboard, cardstock, metal, rubber, plastic, silicone, Teflon (PVDF), coated metal, vinyl, nylon, polyethylene, polypropylene, thermoplastic or a combination thereof.",
"The optional build plate loading system is adapted to reload build plates onto the build modules engaged with the conveyor.",
"In some embodiments, the build plate loading system is adapted to place one or more build plates on the height adjustable platform(s) of the one or more build modules.",
"The build plate loading system (9) depicted in FIGS.",
"7A and 7B comprises a horizontally-telescopic arm (41) pivotally engaged (43) with a vertically-telescopic post (42) and a tray-loading arm (44).",
"The system (9) engages a build plate by a grasp comprised with the vertical tray loading arm (44).",
"The exemplary grasp comprises a plate (46) and an actuatable member (45) that biases/presses a build plate against the plate thereby grasping and temporarily retaining the tray.",
"Other grasps can be used to engage and temporarily retain the tray.",
"In some embodiments, the build plate loading system is a vacuum-based transfer system.",
"The build plate system can also be absent, in which case build plates can be loaded manually onto the build modules.",
"The powder-layering system (3) depicted in FIGS.",
"8A-8C is mounted on a support (table, frame, body, 54) and comprises at least one powder fill head (51), at least one powder reservoir (50) and at least one powder feeder tube (52) driven by a powder feeder drive (53) and adapted to transfer powder from the powder reservoir to the powder fill head.",
"The powder feeder tube can comprise a drive motor and screw-type shaft, e.g.",
"an auger or shaft with spiral blades/vanes, such as found in a Schenk feeder.",
"The powder-layering system forms the incremental powder layer when a build module passes through the powder dispensing region (55, also referred to as a layering region), for example in the direction of Arrow J (FIG.",
"8C).",
"In some embodiments, a powder fill head (51) depicted in FIG.",
"9 comprises a powder fill head body (60, box), at least one powder fill head hopper (61) and at least one powder spreader (64).",
"The hopper receives material from the powder feeder tube to form a temporary supply (63) of powder, which is optionally agitated by powder fill head agitator (62), which can be a powder fill head distribution plate instead.",
"In some embodiments, the hopper (61) is replaced with a chute (not shown, or distribution plate) having a channeled interior surface that distributes powder evenly across the width of the surface and downward onto a build module.",
"Powder exits the hopper (or chute which does not accumulate a substantial amount of powder) in the direction of Arrow K. In some embodiments, the powder fill head further comprises at least one powder-height controller adapted to control the relative distance between the powder spreader (64) and a surface (such as the build plate, the upper surface of the build module, the height adjustable platform, or a prior powder layer) below the powder spreader.",
"An optional distribution bar (or plate, not shown) can be placed between the outlet of the fill head body and the powder spreader (roller).",
"The distribution bar serves to better distribute powder across a layer of powder prior to being contacted by the powder spreader, whereby an incremental powder layer (65) is formed.",
"The powder-height controller can raise or lower the powder spreader so as increase or decrease the thickness of a layer of powder placed onto the platform or a prior layer of powder on the platform.",
"For example, if the platform is lowered by a first increment and the powder-height controller is raised by the same or another second increment, then the thickness of powder laid down will approximate the sum of the first and second increments.",
"If the platform is lowered by a first increment and the powder-height controller is lower by a second increment, then the thickness of powder laid down will approximate the difference of the first increment minus the second increment.",
"Alternatively, the powder spreader in combination with the powder-height controller can cooperate to compress a layer of powder that has been previously laid down.",
"This can be accomplished by first laying down a layer of powder having a first thickness during a first build lap, lowering the powder-height controller and powder spreader and then passing the layer of powder under the lowered powder spreader thereby compressing the layer of powder.",
"In some embodiments, the powder spreader is a cylindrical roller the axis of which has a radial direction of motion opposite the linear direction of motion of a build module through the powder layering system.",
"For example, the surface of the cylinder (64) has a linear direction (Arrow M) opposite the direction (Arrow J) of which an underlying build module (10) passes under the cylinder.",
"In some embodiments, the powder spreader is a cylindrical roller, bar, rod, plate or straight smooth edge.",
"Powder fill heads of other construction can be used.",
"The amount or rate of powder discharged from the powder fill head can be regulated with one or more controls.",
"A powder discharge feedback controller can monitor the accumulation of powder at the powder spreader as the powder is being discharged from the powder fill head and spread to form an incremental powder layer.",
"If the rate at which powder is released is too fast, an excessive amount of powder will accumulate at the powder spreader possibly causing it to spread the powder improperly.",
"The feedback controller then sends a signal thereby causing the rate of powder discharge from the powder fill head to decrease.",
"Conversely, if the feedback controller senses that the rate of powder discharge is too slow, it sends a signal thereby causing the rate of powder discharge to increase.",
"The feedback controller can employ one or more visual, laser, acoustic or mechanical sensors or a combination thereof.",
"FIGS.",
"2C-2D depict a portion of a modular (segmented) conveyor system (21) comprising plural conveyor modules (segments, links) (22) and corresponding engagement means (23) adapted to engage adjacent conveyor modules to each other.",
"FIG.",
"2C is a front elevation view, and FIG.",
"2D is a top plan view.",
"A conveyor module comprises a body (22a), female engagement means (22d), male engagement means (22c), and one or more build module engagement means (22b) adapted to removably or permanently engage build modules.",
"In this exemplary embodiment, adjacent segments (22) pivotally engaged by means of engagement means (23) and pin (22e) such that the segments can pivot about the axis of the pin (22e) in the direction of Arrow LX.",
"Although engagement means (23) is depicted as a hinge-type joint, other engagements can be used.",
"The equipment assembly (1) optionally comprises one or more powder recovery systems.",
"The powder recovery system (11) depicted in FIG.",
"1 and FIG.",
"2E is optional and is a vacuum-based system comprising a body (11a), aspirator bar (11c), vacuum source (11b), and one or more air inlets (11d, 11e) adapted to remove powder from one or more surfaces of a build module.",
"In some embodiments, the powder recovery system is adapted to remove loose powder from the upper surface of a build module.",
"The powder recovery system (11) can comprise engagement (110 by way of which it is removably or permanently engaged to a surface or support.",
"Additional powder recovery systems are described herein.",
"FIGS.",
"3A-3C depict an exemplary printing system (4) adapted to apply liquid to a powder in the printing region of a printing system.",
"FIG.",
"3A is a top plan view, FIG.",
"3B is a side elevation view and FIG.",
"3C is a front elevation view.",
"In some embodiments, the liquid is applied according to a Cartesian coordinate system instead of a polar coordinate system (radial system, cylindrical coordinate system, circular coordinate system, or spherical coordinate system).",
"In some embodiments, the invention excludes a printing system adapted to apply liquid to the powder according to a polar coordinate system.",
"An exemplary printing system comprises at least one print head (28) that deposits liquid onto an incremental layer of powder in a build module and at least one liquid feed system (28b) that conducts liquid from one or more liquid reservoirs (28c) to the at least one print head (28).",
"In some embodiments, the printing system comprises plural print heads, plural liquid feed systems, plural reservoirs or a combination thereof.",
"In some embodiments, the printing system comprises a single print head, plural liquid feed systems, and plural reservoirs.",
"The print head of FIG.",
"3B directs a stream of droplets of liquid into a printing region (29) through which build modules pass.",
"The exemplary system (4) comprises a frame or gantry (tracks 27a, 27b) by way of which the print head (28) can translate/move in the direction of Arrow D, which is transverse to the direction of motion of a build module during printing.",
"Translation of the print head can be performed manually or via computer controlled operation.",
"In some embodiments, the print head is stationary when applying liquid onto an incremental layer of powder, meaning that as liquid is being applied to a powder layer during a print lap, the print head (in particular the print modules) does not move in a direction which is transverse, with respect to the build plane, to the direction of motion of a build module during printing, i.e.",
"during the application of liquid.",
"Such a means of printing is different than prior systems wherein the print head (in particular the print module(s)) moves back and forth, in a direction which is transverse to the direction of motion of a build module, during printing.",
"A print head can comprise one or more print modules that deposit the liquid onto a layer of powder.",
"The print head (28) of FIG.",
"3C comprises four print modules that form corresponding printing regions (29a-29d).",
"When a print head comprises plural print modules, the arrangement/layout of the print modules can be as needed.",
"The print head (30) of FIG.",
"4 comprises plural print modules (4) arranged in plural columns with each column comprising plural print modules.",
"A powder can pass across the print modules in the direction of Arrow E such that print direction is transverse to the horizontal shape of the print module.",
"Other suitable arrangements for the print modules are depicted in FIG.",
"5.The print head (34) comprises a single print module.",
"The print head (35) comprises four print modules pared in groups (35a, 35b) of two offset horizontally from one another.",
"The print head (33) is somewhat similar to head (35) except that the print modules (35a, 35b) are wider horizontally and offset to a greater extent horizontally than are the print modules (33a); moreover, the print modules are horizontally offset from one another.",
"The print head (32) comprises two linearly and transversely offset groups (32a, 32b) of print modules.",
"When viewed in the direction of Arrow E, the adjacent edges of the two groups overlap (each group overlaps the dashed line).",
"By offsetting the print modules as depicted for module (33), the apparent overall print resolution of the print head can be increased.",
"The print modules can be offset in staggered, interlaced, sobered, or angled arrangements relative to the print head in order to increase overall print density/resolution.",
"For example, if the print resolution of each print module is 75 dpi (drops per inch), then the apparent overall print resolution of the print head (33) can be 75 dpi, 150 dpi, 225 dpi, 300 dpi, 375 dpi, 450 dpi or even higher.",
"If the print resolution of each print modules is 100 dpi, then the apparent overall print resolution of the print head (33) can be 100 dpi, 200 dpi, 300 dpi, 400 dpi or even higher.",
"In some embodiments, the print resolution of the print head is the same as or greater than the print resolution of a print module comprised within the print head.",
"In some embodiments, the print resolution of the print head is a multiple of the print resolution of one or more print modules comprised within the print head.",
"In some embodiments, the print resolution of the print head is the less than the print resolution of a print module comprised within the print head.",
"The arrangement of one or more print modules in the print head can be modified as needed to provide the desired printing result.",
"FIG.",
"16 depicts a partial print station comprising a powder fill head (176) and a print head (178) below which is a build module (175) moving in the direction of Arrow Q through a powder dispensing region and a printing region, respectively.",
"The fill head, which is disposed transverse to the direction of motion of the build module, remains transversely and longitudinally stationary (with respect to the plane defining the upper surface of the build module, even though it can move vertically toward or away from said plane) as it places an incremental layer of powder onto and across the width of a cavity of the build module.",
"The build module and incremental layer of unprinted powder moves in the direction of Arrow Q, whereby they pass through the printing region beneath the print module, which is disposed transverse to the direction of motion of the build module.",
"The print module remains transversely, longitudinally and vertically stationary with respect to the plane defining the upper surface of the build module.",
"The print module applies liquid onto the incremental layer of powder according to a predetermined pattern, thereby forming an incremental printed layer (180) comprising article(s) 181.The exemplary print head comprises a single print module (179; depicted in dashed line) that spans the width of a cavity of the build module.",
"The print head (185) depicted in FIG.",
"17A comprises four print modules (186) arranged in both transverse and longitudinal displacement (with respect to the direction of motion of the print head).",
"Together the four print modules span the width of the cavity of the build module.",
"The embodiment (187) of FIG.",
"17B differs from that of FIG.",
"17A in that the four print modules (188) are only transversely displaced but not longitudinally displaced.",
"In some embodiments, the one or more print heads is/are stationary when applying liquid onto an incremental layer, i.e.",
"when printing.",
"The one or more print heads can, in particular, be transversely and longitudinally stationary, with respect to the linear direction of motion of a build module (and thus an incremental layer of powder), when printing.",
"Particular embodiments include those wherein: a) the printing is performed according to a Cartesian coordinate algorithm; b) the build module moves during printing in a linear direction that is perpendicular to the disposition of the print module (and one or more print heads); c) the print head and one or more print modules are stationary when printing (when applying liquid to an incremental layer of powder) and do not move in a direction that is transverse or longitudinal with respect to the direction of motion of the build module; and/or d) printing is not performed solely according to a polar coordinate algorithm.",
"The three-dimensional printing system/assembly of the invention employs Cartesian coordinate based printing system and algorithms.",
"Unlike other systems that move the print heads transversely and/or longitudinally when printing, the print heads of the invention are substantially stationary during printing.",
"The term “transversely” is determined in relation to the direction of motion of a build module beneath a print head and means substantially perpendicular to the direction in which a build module is conducted through a printing area.",
"The term “longitudinally” is determined in relation to the direction of motion of a build module beneath a print head and means substantially parallel to the direction in which a build module is conducted through a printing area.",
"Application of liquid across the width of powder layer beneath a print head is accomplished by employing one or more print modules that individually or together traverse at least 75%, 80%, at least 85%, at least 90%, at least 95%, at least 97.5% or at least 99% the width of the powder layer.",
"In the present case, the “width” of the powder layer is determined along a direction transverse to the direction of motion of a build module beneath a print head, and the term “length” is determined along a direction parallel to the direction of motion of a build module beneath a print head.",
"In other words, a single print head can traverse the width or plural print heads transversely adjacent to each other can traverse the width of the powder layer.",
"In particular embodiments, the print head comprises plural print modules that individually do not but together do span the width of an incremental powder layer and/or of the cavity of a build module.",
"In some embodiments, one or more print modules together modules span at least 50%, at least 55%, at least 75%, at least 90%, at least 95%, at least 99% or all of the width of the cavity of the build module.",
"In particular embodiments, the build module moves in a first direction, and the print head is stationary when liquid is being applied to the incremental powder layer.",
"In particular embodiments, printing is performed primarily or solely according to a Cartesian coordinate algorithm.",
"For example, the algorithm controls application of the droplets of the printing fluid relative to the linear (non-radial, straight) direction of the conveyor such that the print head applies droplets in a direction that is parallel (longitudinal) or is perpendicular (transverse) with respect to the linear direction of motion of the conveyor.",
"The conveyor and corresponding build modules only move in a straight linear direction beneath the print head and build head.",
"An alternate embodiment of the invention is depicted in FIG.",
"17C, wherein the print head (189a) comprises one or more or plural print modules that do not span the width of an incremental powder layer and/or of the cavity of a build module.",
"This print head is either stationary when printing (when applying liquid to an incremental layer of powder) or moves transversely, with respect to the direction of motion of the build module, while applying liquid to the powder.",
"The print modules of the print heads (32, 33, 35, 189a, 189b of FIGS.",
"5 and 17C) are arranged such that the jets on multiple print heads are interleaved to increase the print density across the print bed.",
"For example, individual print modules having a native print density of 100 dpi are interleaved together such that four of the print heads together provide a 400 dpi print density.",
"In some embodiments, clusters of print modules, such as depicted in 17D, are arranged so their overall span covers only part of the width of a powder layer, such that plural print heads (each containing a cluster of print modules with interleaved jets) are required to cover the full width of the powder layer.",
"For example, three print heads (189b), each having a cluster of print modules which together spans only 2.5″, would need to be arranged in a horizontally offset manner in order to cover the width of a powder bed or layer that is between 5 to 7.5 inches wide.",
"The at least one printing system can apply liquid according to any predetermined print pattern or randomly onto an incremental layer of powder.",
"The pattern can be the same from incremental layer to incremental layer or can be different for one or more incremental layers of a printed article.",
"Generally, two adjacent print patterns will comprise at least two overlapping printed portions such that at least a portion of the printed/bound powder in one printed incremental layer will adhere (be bound) to at least a portion of the printed/bound powder of an adjacent printed incremental layer.",
"In this manner, plural stacked adjacent printed incremental layers adhere to each other thereby forming a three-dimensionally printed article comprising plural adjacent printed incremental layers of completely or partially bound powder.",
"Even though a three-dimensionally printed article can include undercuts, overhangs, cavities, holes and other such features, at least part of the printed portions of adjacent printed incremental layers must adhere to one another in order to form and fill the composite volume of the article.",
"The printing system employs a Cartesian coordinate-based printing algorithm when applying liquid to an incremental powder layer.",
"The system includes a computer and associated software that comprises one or more print jobs.",
"A print job includes, among other things, information on the thickness of incremental layers and the predetermined pattern to be printed on the incremental layers of a printed article.",
"The print job provides layer-by-layer instructions to the print head (print module(s)) about the creation and placement of droplets of liquid onto the incremental powder layer.",
"The print job is based upon the series of two-dimensional images (slices) that, when stacked, together form a predetermined three-dimensional image (object).",
"Without being held bound to a particular mechanism, a target three-dimensional article is designed, such as with a CAD program.",
"A virtual image of the target article is sliced virtually into plural stacked thinly-sliced images (which are referred to herein as “two-dimensional” images), wherein each two-dimensional image is actually the thickness of an incremental powder layer.",
"The sum total of thicknesses of the image slices equals the total “height” of a target article.",
"Each two-dimensional “image” is then converted into a subset of printing instructions, which together define a predetermined printing pattern for that image.",
"All of the subsets of printing instructions are joined together to form a final set of printing instructions that are used by the computer to control printing.",
"Aside from incremental layer thickness, two-dimensional shape of predetermined patterns, and shape of target article, the final set of print instructions also includes specification of or consideration of linear speed of the build module beneath the print head, rate of application of liquid to incremental powder layers, length and width of the incremental powder layer, dimensions of the cavity of a build module, incremental height adjustment of the height adjustable platform of the build module, rate of loading of powder into the powder fill head, rate of loading of powder into a build module to form an incremental layer, rate of transfer of powder from a feed reservoir to the fill head, resolution of the two dimensional image to be printed on each incremental layer, the number of applications of liquid to each incremental layer, application of one or more specific liquids to one or more specific locations of the incremental layer, starting and stopping of liquid application with respect to each build module, the number of articles to be printed, the number of build modules in the equipment assembly, the number of build modules to be printed upon, rate at which the platform of the build module moves down, timing for starting and stopping powder delivery relative to the entire build cycle, rotational speed of leveling device (roller) and other such parameters.",
"An equipment assembly comprises a control system comprising one or more controllers.",
"Without being held bound to a particular mechanism, a homing switch located at a fixed point of the conveyor (FIG.",
"1) provides a reference point as to the location of the “first” build module in a group of build modules.",
"From there, a computer is able to determine the location of the rest of the build modules in that group by knowing the size of the conveyor, the spacing of the build modules and the dimensions of the build modules.",
"The control system can also comprise a proximity sensor that specifies the location of one or more build modules relative to the conveyor.",
"The control system comprises a synchronizer that facilitates synchronization of operation of the various components of the equipment assembly.",
"By taking into consideration the track (linear) speed of the conveyor and the target thickness and width of an incremental layer, a computer is able to instruct the powder layering system to charge powder onto the build modules at a certain feed rate.",
"After part of a lap or after one or two calibration laps, the powder feed rate can be continuous.",
"Once a proper incremental powder layer is formed, deposition of liquid onto the incremental layer can begin.",
"A proximity sensor senses the leading edge of a build module and then sends instruction to the print system.",
"A computer controlling the print system takes into consideration a set of printing instructions (which can include among other things the target print resolution (density), the image(s) (pattern(s)) to be printed on the incremental layer, the target rate of liquid deposition, the number of liquids to be deposited, the dimension of the print head and print modules, track speed, the set of images (patterns) that are to be printed to form a target 3D printed article, target article porosity or density, or other such parameters) and the signal generated by a wheel encoder, for example, to provide a pulse that sets the print rate at which to consume the image files in the printing instructions and the resolution at which to print the image file(s).",
"Following completion of layering and printing per the printing instructions, a build cycle is completed.",
"As described herein, the powder system can comprise one or more feedback controllers that determine the proper powder feed rate into a powder feeder and into the build modules.",
"Likewise, the printing system can comprise one or more feedback controllers that determine the rate at which printing fluid (liquid) is being applied and/or consumed and can therefore control the liquid application rate and can also the reloading of liquid reservoir(s).",
"A liquid removal system, such as a dryer, can comprise one or more relative humidity controllers, temperature controllers and conveyor speed controllers.",
"The system is therefore capable of adjusting drying time and conditions to provide printed articles containing the desired level of moisture.",
"In some embodiments, one or more components of the equipment assembly are computer controlled.",
"A controller is independently selected at each occurrence from a computerized controller, electronic controller, mechanical controller or a combination thereof.",
"In some embodiments, the control system comprises one or more computerized controllers, one or more computers, one or more user interfaces for one or more computers.",
"In some embodiments, one or more components of the three-dimensional printing build system are computer controlled.",
"In some embodiments, the conveyor system, the height adjustable platforms of the build modules, the at least one powder layering system and the at least one printing system are computer controlled.",
"In some embodiments, the equipment assembly is adapted to spread layers of powder and print droplets of liquid in a predetermined pattern according to instructions provided by a computerized controller.",
"In some embodiments, the predetermined pattern is based on one or more two-dimensional image files comprising pixels.",
"In some embodiments, the two-dimensional image files are structured such that certain pixels indicate dispensing of droplets, and other pixels represent no dispensing of droplets.",
"In some embodiments, the two-dimensional image files include different colors of pixels to indicate dispensing of different liquids, or no dispensing of liquid.",
"FIGS.",
"19A-19C, depict a flow chart for operation of an exemplary embodiment of the invention.",
"The process is initiated, e.g.",
"by an operator or electronic component such as a computer.",
"An operator activates and checks the status of system and assembly components, which are then synchronized, after which time the system (assembly) is ready for operation.",
"Printing fluid and powder are loaded into their respective systems as required of the product to be three-dimensionally printed.",
"Build plates are loaded into build modules and a build cycle is initiated.",
"The level of printing fluid(s) and powder(s) are checked and when the required amount is present, conveyor operation is initiated.",
"Moving to FIG.",
"19B, the powder feed rate and transport speed (conveyor speed) for the build module is applied and a query is made to determine whether or not a build module is supposed to receive powder.",
"If so, the platform is lowered and a layer of powder is deposited onto the build module as it passes under the powder fill head.",
"If not, the build module does not receive powder.",
"A query is then made to determine whether or not the powder layer is supposed to receive a printed image.",
"If so, a two-dimensional pattern is printed onto the layer as the build module passes under the print head.",
"If not, the build module does not receive printing solution.",
"A query is made to determine whether or not all of the build modules mounted on the conveyor have been processed, i.e.",
"whether or not the build lap is completed or whether or not the build module is supposed to receive another layer of powder.",
"If not, any unprocessed build module is processed.",
"If all of the build modules have been processed, i.e.",
"the build lap is complete, a query is made to determine whether or not a build cycle is complete.",
"If not, one or more additional build laps are conducted.",
"If so, the build modules are prepared for unloading of build plates as described in FIG.",
"19C.",
"Completed build plates that bear three-dimensionally printed powder bed are unloaded and transferred to drying trays.",
"After a build plate has been removed from a build module, another build tray is placed in the empty build module.",
"After all build plates have been unloaded, a query is made according to FIG.",
"19A to determine whether or not additional build cycles will be conducted.",
"If not, the process is terminated.",
"If so, the next build cycle process is initiated.",
"FIG.",
"20 depicts an exemplary subroutine detailing how the platform layer increment is controlled within a build lap and a build cycle.",
"In this example, the layer thickness (increment) is provided by a product definition.",
"A cumulative thickness is calculated according to the number of powder layers already laid down.",
"The platform is dropped to the calculated thickness and a determination is made to confirm that it is at the correct position within a predefined tolerance.",
"A query is then made to determine whether or not the platform of all the build modules in a particular build lap have dropped to the correct position.",
"If not, the platforms are adjusted as required.",
"If so, a query is made to determine whether or not all layers of a build cycle are complete.",
"If so, the build plates are unloaded as described herein.",
"If not, the process of this figure is repeated for each of the build layers as needed until the build cycle is complete.",
"FIG.",
"21 describes an exemplary subroutine detailing operation of the printing system.",
"A build process is initiated and the necessary amount(s) of printing fluid is loaded into the reservoir(s).",
"A set of image files are identified and conveyor operation is begun.",
"During operation, the level of printing fluid(s) is monitored so that it can be replenished as needed.",
"When a build module passes beneath a printhead, a trigger signal is generated prompting a query to determine whether or not the build module is to receive a printed image.",
"If not, the trigger signal is ignored.",
"If so, an print image file is received and processed such that the columns of image pixels (pixels that are aligned along the axis of movement of the build module) are assigned to specific jets of the printhead.",
"In addition, rows of image pixels are sent to the printhead taking into consideration the linear speed of the conveyor and the intended print density of the image to be printed.",
"The printhead then delivers printing fluid droplets, as per the printing instructions, to the powder layer on a build module.",
"A query is then made to determine whether or not all build modules have been processed.",
"This query can be repeated for the build lap and/or build cycle level.",
"Upon completion of a build cycle, the process can be terminated.",
"If needed, the printhead can be retracted and cleaned.",
"FIG.",
"22 depicts a flow chart of an exemplary process for designing a dosage form and determining the layer thickness thereof and image files (two-dimensional printing patterns) there for.",
"The process can be conducted with or without a computer.",
"A dosage form having a specified three-dimensional structure and comprising a target dose of drug is designed.",
"The approximate target powder layer thickness is selected and the height of the dosage form is divided by the target incremental powder layer thickness to provide the number of powder layers required to prepare the dosage form.",
"Based upon the layer and its location within the dosage form, each layer is assigned as needed an initial two-dimensional pattern, i.e.",
"an image file, which ultimately results in a set of printing instructions employed by the printing system to create a corresponding printed increment layer.",
"The image file assigned to each layer can be input, or it can be retrieved from an image library.",
"In order to determine whether or not archived images from the image library are required, the system queries whether or not all layers have been assigned an image file as needed.",
"If so, the design of the dosage form is complete and the process is terminated.",
"If not, the system queries whether or not the image required for a specific layer exists in the image library.",
"If so, the image file is retrieved from the library and assigned to the respective powder layer.",
"The system then again queries whether or not all layers have been assigned an image file as needed and the loop of logic continues as needed until completion of design of the dosage form.",
"If the image file is not present in the image library, a new image file is created, optionally stored in the image library, and assigned to the respective layer, and the loop of logic continues as needed until completion of the dosage form design.",
"It should be understood that one or more layers might not require any image file at all, meaning that specific layer would not be printed during preparation of the dosage form.",
"The equipment assembly of the invention can comprise one or more bed transfer systems adapted to transfer three-dimensionally printed beds, one or more at a time, away from the three-dimensional printing build system.",
"FIG.",
"10A is a top plan view and FIG.",
"10B is a side elevation view of an exemplary bed transfer (unloading) system (8) comprising a frame (70), receiving platform (76), tray-loading platform (77), and bed transfer mechanism (71) moveably engaged with the frame and superposing a bed-transferring region (75).",
"The bed transfer mechanism (71) comprises mounts (71c) adapted to translate along tracks (72a, 72b) in the direction of Arrow N in a reciprocating manner.",
"The bed transfer mechanism also comprises a receptacle (71a) comprising a cavity (82) adapted to receive and temporarily retain a three-dimensionally printed bed (83) having an optional build plate (10).",
"In an alternate embodiment, the receptacle is a push plate or U-shaped coral (71d) comprising a receiving area adapted to receive and temporarily retain a three-dimensionally printed bed.",
"The receptacle (71a) reciprocates in a vertical manner in the direction of the Arrow P by means of reciprocator (71b) engaged with the receptacle (71a) and the body (71d) of the bed transfer mechanism (71).",
"During operation, a conveyor conducts and positions a build module (7a) beneath the receptacle (71a) and in the bed-transferring region (75) so as to align the three-dimensionally printed bed (83) and build plate with the cavity (82).",
"The receptacle then lowers in the direction of Arrow P an amount sufficient to retain substantially all of the three-dimensionally printed bed and build plate within the cavity.",
"The bed transfer mechanism (71) then slides/translates the printed bed and build plate in the direction of the Arrow N onto the receiving platform (76) and then onto a transport tray (74).",
"The receptacle is then raised in the direction of the Arrow P leaving the printed bed and build plate on the transport tray and translates back in the direction of Arrow N to the original position superposing a build module.",
"The transport tray (74) is then conducted in the direction of the Arrow B.",
"FIG.",
"10C depicts an alternate embodiment of a bed transfer system comprising a diverter (84) and a conveyor (86).",
"The diverter directs build modules or build plates comprising printed beds (87) from the conveyor (85) of the build system onto an adjoining conveyor (86), which optionally transfers the printed beds to a liquid removal system or other downstream processing apparatus (not shown).",
"The diverter can be adapted to raise and lower.",
"In a first position, it does not direct printed beds away from the build system and in a second position it does.",
"In some embodiments, the bed transfer system is adapted to transfer three-dimensionally printed beds to one or more liquid removal systems, one or more harvesting systems and/or one or more packaging systems.",
"In some embodiments, the transfer system is integrated with the conveyor system, the liquid removal system or both.",
"A liquid removal system is adapted to receive one or more build plates (containing a printed bed) and to remove liquid from one or more printed powder layers onto which the liquid has been applied and/or from the three-dimensionally printed bed.",
"A liquid removal system can be a process area through which one or more of the build modules are conducted.",
"For example, the liquid removal system in FIG.",
"1 can be the process area over the conveyor and excluding the region under the printing region.",
"Alternatively, a liquid removal system can be another process area not directly associated with the three-dimensional printing build system, such as a temporary retaining or storage area wherein three-dimensionally printed beds are placed and dried under ambient conditions.",
"In some embodiments, a liquid removal system is one or more dryers.",
"FIGS.",
"13A-13B depict exemplary liquid removal systems.",
"FIG.",
"13A is a partial sectional side elevation view of a dryer (130) adapted to remove or reduce the amount of liquid in a three-dimensionally printed bed (83) or article.",
"The dryer comprises a housing (131) within which are contained plural heating elements (137), a conveyor system (138) and one more exhaust ports (132).",
"The housing comprises an inlet (133) and an outlet (134) through which three-dimensionally printed beds (or articles) and their respective build plates are conducted by way of conveyors (135, 136, respectively).",
"During operation, the printed beds are conducted through the inlet (133) and carried by the conveyor system (138) through a predetermined path as they are exposed to the heating elements (137), which affect evaporation of liquid from the printed beds.",
"When the printed beds (or articles) exit the dryer, they comprise less liquid than they did when they entered the dryer.",
"Although not depicted in FIG.",
"13A, the dryer can comprise a vacuum system adapted to reduce the pressure within the dryer or air-handling system adapted to increase or otherwise control the flow of air through the dryer.",
"Although the path of the conveyors is depicted as “S-shaped” in FIG.",
"13A, the path can instead be any path desired, e.g.",
"U-shaped, Z-shaped, N-shaped, n-shaped, O-shaped, etc.",
"FIG.",
"13B depicts an alternate embodiment of a dryer (141) suitable as a liquid removal system.",
"The dryer comprises a housing (142), within which are contained plural heating elements (146) and a conveyor system (145).",
"The housing comprises an inlet (143) and an outlet (144) through which three-dimensionally printed beds and their respective build plates are conducted by way of the conveyor.",
"In some embodiments, the dryer comprises one or more covers (147) for the inlet and/or outlet.",
"In some embodiments, the three-dimensionally printed bed comprises loose powder and one or more three-dimensionally printed articles.",
"An equipment assembly of the invention can further comprise one or more harvesting systems adapted to separate loose powder from the one or more three-dimensionally printed articles.",
"In some embodiments, the harvester processes build plates already processed by the liquid removal system.",
"In some embodiments, the harvester comprises loose powder collection means and three-dimensionally printed article collection means.",
"In some embodiments, the harvester comprises a vibrating and/or orbiting surface adapted to receive the three-dimensionally printed bed.",
"In some embodiments, the harvester comprises one or more deagglomerators.",
"In some embodiments, the equipment assembly further comprises one or more dedusters adapted to remove loose powder from articles that have been harvested.",
"In some embodiments, a deduster comprises one or more air brushes.",
"The exemplary combination harvester and deduster system (150) depicted in side elevation view in FIG.",
"14 comprises a frame (151), a receiving platform having an air-dispenser (161), bed transfer mechanism (152) moveably engaged with the frame and superposing a bed transfer region, aspirator (154), deagglomerator (156), deduster (157), printed article collector (158), and powder collector (159).",
"The also comprises at least one air brush (161).",
"The bed transfer mechanism (152) comprises mounts adapted to translate along tracks (153) in the direction of Arrow N in a reciprocating manner.",
"The bed transfer mechanism also comprises a receptacle (167) comprising a cavity (166) adapted to receive and temporarily retain a three-dimensionally printed bed (83) having an optional build plate (10).",
"The receptacle (167) reciprocates in a vertical manner by means of reciprocator engaged with the receptacle and the body of the bed transfer mechanism (152).",
"During operation, a conveyor (155) conducts and positions a printed bed (83), build plate (10) and transport tray (74) beneath the receptacle (167) and in a bed transfer region so as to align the three-dimensionally printed bed, build plate and transport tray with the cavity (166).",
"The receptacle then lowers onto the transport tray an amount sufficient to retain substantially all of the three-dimensionally printed bed within the cavity.",
"An aspirator (154) then aspirates the printed bed (83) by way of a conduit (165) and a perforated plate in the cavity and above the bed, thereby removing a major portion of the loose powder contained within the bed while leaving behind one or more printed articles (160) within the cavity of the receptacle.",
"The bed transfer mechanism (152) then slides/translates the printed bed and build plate in the direction of the Arrow N over one or more airbrushes (161) adapted to direct a flow of air at the printed articles in the cavity to assist in releasing additional loose powder from the printed article(s).",
"The empty build plate (10) and transport tray (74) are conveyed away from the bed-transferring region.",
"A powder collector (159) is adapted to receive loose powder and other solid material not otherwise collected by the aspirator (154).",
"The bed transfer mechanism continues to move in the direction of the Arrow B until it superposes a deagglomerator (156).",
"The aspirator is then turned off and the printed particles fall onto of the process tray of the deagglomerator, which is adapted to remove and collect agglomerates from the printed article(s) to provide deagglomerated printed articles (162).",
"The bed transfer mechanism (152) then returns to its original position in preparation of loading and processing of additional printed beds.",
"The process tray of the deagglomerator vibrates (and/or orbits) and conducts the printed articles in the direction of Arrow B toward the deduster (157) while degglomerating the printed particles.",
"The deduster also comprises a vibrating process tray adapted to remove and collect dust from the deagglomerated printed articles to provide dedusted printed articles (163).",
"The finished printed articles (164) are conducted to a printed article collector (158).",
"The deduster and/or deagglomerator can further comprise solids collector for collecting loose powder and/or agglomerates.",
"FIG.",
"18 depicts an exemplary harvester system (190) and a deduster system (200).",
"The harvester system comprises a housing (191), a receptacle (192), a vibrating surface (193) within the receptacle and an outlet (194) for the receptacle.",
"A perforated build plate below a dry printed bed (loose powder and printed article) is placed on the vibrating surface.",
"Loose powder is dislodged from the printed bed as the surface vibrates.",
"The recovered loose powder falls and is collected in the receptacle, after which it is unloaded from the receptacle through the outlet.",
"The recovered loose powder is collected in a container (195).",
"Collection of the loose powder can be done manually, mechanically and/or with a vacuum system.",
"The deduster system (200) of FIG.",
"18 comprises a housing (201), receptacle (202), drawer (203), enclosure (204), one or more air jets, e.g.",
"air knives, (205, not depicted) within the enclosure, inlet (206, not depicted) for the enclosure, and an outlet (207) for the enclosure.",
"A perforated build tray having one or more printed articles that have been harvested is placed in the drawer which is subsequently pushed into the enclosure by way of the inlet, thereby forming a substantially enclosed dedusting area.",
"One or more air jets direct pressurized air toward the printed article(s), whereby both coarse and fine loose powder that has clung onto the printed article(s) is dislodged there from.",
"The loose powder falls into the receptacle and is conducted to the outlet along with the flow of air released by the air jet(s).",
"The dedusted printed article(s) is (are) are retrieved by opening of the drawer.",
"The recovered loose powder collected in a container.",
"Collection of the loose powder can be done manually, mechanically and/or with a vacuum system and/or air-handling system.",
"The deduster system and/or the harvester system can be placed within a larger enclosure (208) to minimize spreading of dust in a process area.",
"Loose powder, agglomerates or particulates collected during the build cycle, drying, harvesting, deagglomerating and/or dedusting can be disposed or can be blended to form recovered bulk material that can be milled (optionally) and recycled back into a feed supply of virgin unprinted bulk material.",
"Such a bulk material recovery system can comprise one or more vacuum systems, one or more pressurized air systems, one or more non-vacuum mechanical systems, one or more manual systems or a combination thereof for transferring bulk material from one location to another.",
"FIGS.",
"12A-12E depict exemplary generalized layouts for conveyor systems and build stations of a three-dimensional printing build system.",
"FIG.",
"12A depicts a top plan view of a three-dimensional printing build system (105) somewhat similar to the one depicted in FIG.",
"1.The system (105) comprises a cyclic and iterative conveyor system (110), a first build station (111), an optional second build station (115), and plural build modules.",
"The plural build modules are conducted through the first build station, and optionally the second build station if present, and then back through the first build station in the direction of the Arrow A.",
"The build station (111) comprises a powder-layering system (112) and a printing system (114).",
"FIG.",
"12B depicts a top plan view of a three-dimensional printing build system (106) comprising a linear conveyor system (118), a first build station (111), a second build station (115), and plural build modules.",
"The plural build modules are conducted from position X1 through the first build station to position X2 and then through the second build station to position X3 in the direction of Arrow A.",
"Further processing of printed articles is done downstream of the build system (106).",
"In some embodiments, the conveyor system is a linear conveyor system that conducts build modules from a first build station to a second build station and optionally to a third or other build station in a non-cyclic or non-iterative manner.",
"FIG.",
"12C depicts a top plan view of a linear and iterative three-dimensional printing build system (107) comprising a linear conveyor system (119), a first build station (111), an optional second build station (115), and plural build modules.",
"The plural build modules are conducted from position X1 through the first build station to position X2 and then through the second build station, if present, to position X3 and then, in reverse direction in the direction of Arrow AR, back through the second build station, if present, and the first build station.",
"A third or more other build stations can be included, and if present, the build modules are conducted through them.",
"FIG.",
"12D depicts a top plan view of a linear and iterative three-dimensional printing build system (108) comprising plural build stations (111, 115, 126, 127), plural build modules, and build module transfer means (124, 125).",
"Empty build modules on a conveyor (120) are transported from position Z1 to position X1.The conveyor (121) then conducts build modules consecutively from positions X1 to X2 to X3 and through the build stations (111, 115).",
"Build module transfer means (124) then transfer build modules in the direction of Arrow AZ from position X3 to position X4.A second conveyor then conducts build modules consecutively from positions X4 to X5 to X6 and through the build stations (126, 127, respectively).",
"Build module transfer means (125) then transfer build modules in the direction of Arrow AY from position X6 to position X1.This type of build lap is repeated as many times as necessary until the desired printed article is formed and unloaded from the printing build system (108) by way of the conveyor (122).",
"FIG.",
"12E depicts a side elevation view of a three-dimensional printing build system (109) somewhat similar to that of FIG.",
"12D.",
"In this embodiment, however, the conveyors (128, 129) are arranged vertically one above the other rather than side by side.",
"Moreover, the lower conveyor system (129) does not have a build station specifically associated with it.",
"As noted above, it takes plural build laps to construct a three-dimensionally printed article from a powder bed.",
"FIG.",
"11A depicts a partial cross-sectional view of a build module (90) comprising a body (91) having an upper surface (91a) and a height adjustable platform (92) having an upper surface (92a).",
"The hollow arrows indicate process steps, whereas the filled-in black arrows indicate direction of motion of the platform in the figure.",
"The build module (90) is depicted in starting position at Stage 0.In process steps A1 and A2, the platform is lowered thereby forming a cavity (93) defined by the inner surface (91b) of the build module and the upper surface of the platform.",
"A build plate (10) is then placed on top of the platform as depicted in Stage I.",
"In process step B1, a layer of powder (94) is placed in the cavity and over the build plate such that the position of upper surface (94a) of the layer substantially matches (or is at the same height of) the position of the upper surface (91a) of the build module as depicted in Stage II.",
"In process step C1, platform is lowered again by an increment thereby forming a new cavity (95) above the surface of the powder layer (94) as depicted in Stage III.",
"In process steps D1 and D2, another layer of powder is placed in the cavity and then printed upon to form one or more sections of bound powder as depicted in Stage IV.",
"In process step E1, the platform is lowered again and another cavity is formed above the previous layer of powder as depicted in Stage V. In process steps F1 and F2, another layer of powder is placed in the cavity and then printed upon to form one or more sections of bound powder as depicted in Stage VI.",
"The print pattern used in process step D2 is similar to the print pattern used in process step F2.In process step G1, the platform is lowered again as depicted in Stage VII.",
"In-process step H1, a layer of powder is placed in the just formed cavity over the prior layer of powder as depicted in Stage VIII thereby completing formation of a printed bed comprising loose powder (97) and plural printed articles (96).",
"In process step J1, the receptacle (71a) of a bed transfer means is placed above the printed bed such that the cavity of the receptacle superposes and is aligned with the printed bed as depicted in Stage IX.",
"In process step K1, the platform is raised such that the build plate and printed bed are disposed within the cavity as depicted in Stage X.",
"In process step L1, the receptacle is translated/slid in the direction of Arrow N thereby unloading the builds tray returning it to Stage 0.The print pattern used for individual print cycles can vary as needed and need not be the same for each build lap.",
"FIG.",
"11B depicts the build module of the FIG.",
"11A.",
"The process steps A1, A2, B1 and C1 in FIG.",
"11B are similar to those steps in FIG.",
"11A; however, the process of FIG.",
"11B includes the process step B2 whereby the first layer of powder is printed upon to form a layer comprising loose powder (100) and bound powder (101).",
"In process step D1, a layer of powder is placed within the cavity, and in process step D3, the layer is printed upon using a print pattern that is different than the print pattern used in process step B2 such that the cross-section of the bound powder (102) in Stage IV of FIG.",
"11B is different than the cross-section of the bound powder in Stage IV of FIG.",
"11A.",
"The pattern of step D3, however, overlaps with the pattern of step B2 sufficiently that the resulting printed layers adhere to one another.",
"The platform is lowered again according to process step E1.Powder is then layered into the cavity in process step F1 and printed upon in process step F3.Again, the print pattern used in process step F3 is different than the print pattern used in process steps D3 and B2, such that the cross-section of the bound powder (103) in stage VI comprises three different patterns, which patterns are different than those depicted in stage VI of FIG.",
"11A.",
"The pattern of step F3, however, overlaps with the pattern of step D3 sufficiently that the resulting printed layers adhere to one another.",
"The platform is lowered again according to process step G1 as depicted in stage VII.",
"In process step H1, a layer of powder is placed within the cavity, and in process step H2, the layer is printed upon using a print pattern that is different than any of the prior print patterns used such that the cross-section of the bound powder (104) in the printed bed in stage VIII comprises six different patterns, which patterns are different than those depicted in stage VIII of FIG.",
"11A.",
"The pattern of step H2, however, overlaps with the pattern of step F3 sufficiently that the resulting printed layers adhere to one another.",
"In process step J1, a perforated plate is placed above the printed bed and a receptacle of a bed transport means is placed above the plate as depicted in Stage X.",
"In process step K1, the perforated plate, printed bed and build plate are raised into the cavity of the receptacle.",
"In process step L1, the receptacle is translated away in the direction of Arrow N leaving behind the build module in its initial stage 0.Upon completion of the exemplary print cycle, the three-dimensionally printed bed can be further processed as described herein.",
"Conveyor systems useful for conducting solid articles from one location to another during manufacture include, by way of example, a modular conveyor, non-modular conveyor, continuous conveyor, contiguous conveyor, conveyor belt, cam, pallet conveyor or link conveyor.",
"Combinations thereof can be used.",
"FIG.",
"15 depicts a side elevation view of an exemplary packaging system (170) adapted to package one or more three-dimensionally printed articles (164).",
"The system comprises a hopper (171) that provides three-dimensionally printed articles which are placed onto a conveyor (173).",
"The articles are conducted through a packaging module (172) that places one or more articles into a package (174).",
"Suitable packaging systems can employs bottles, blister packs, tubes, boxes and other such containers.",
"The various components and systems of the equipment assembly will comprise parts made of durable materials such as metal, plastic, rubber or a combination thereof.",
"In some embodiments, components of the equipment assembly comprise 304 or 316 stainless steel where possible.",
"The powder can comprise one or more materials suitable for pharmaceutical or non-pharmaceutical use.",
"In some embodiments, the powder comprises one or more pharmaceutical excipients, one or more pharmaceutically active agents, or a combination thereof.",
"In some embodiments, the three-dimensionally printed article is a pharmaceutical dosage form, medical device, medical implant, or other such article as described.",
"Exemplary types of pharmaceutical excipients that can be included in a three-dimensionally printed article include, by way of example and without limitation, chelating agent, preservative, adsorbent, acidifying agent, alkalizing agent, antifoaming agent, buffering agent, colorant, electrolyte, flavorant, polishing agent, salt, stabilizer, sweetening agent, tonicity modifier, antiadherent, binder, diluent, direct compression excipient, disintegrant, glidant, lubricant, opaquant, polishing agent, plasticizer, other pharmaceutical excipient, or a combination thereof.",
"Exemplary types of non-pharmaceutical excipients that can be included in a three-dimensionally printed article include, by way of example and without limitation, ash, clay, ceramic, metal, polymer, biological material, plastic, inorganic material, salt, other such materials or a combination thereof.",
"In some embodiments, the powder comprises one or more, two or more, three or more, four or more, five or more, six or more, seven or more, eight or more, nine or more, ten or more or plural components, each component being independently selected at each occurrence.",
"In some embodiments, the equipment assembly comprises one or more, two or more, three or more, four or more, five or more, six or more, seven or more, eight or more, nine or more, ten or more or plural powder (or solid component) reservoirs.",
"Pharmaceutically active agents generally include physiologically or pharmacologically active substances that produce a systemic or localized effect or effects in animals, cells, non-humans and humans.",
"When an active agent is present, any such agent can be used.",
"Exemplary classes of active agents include, by way of example and without limitation, pesticides, herbicides, insecticides, antioxidants, plant growth instigators, sterilization agents, catalysts, chemical reagents, food products, nutrients, cosmetics, vitamins, sterility inhibitors, fertility instigators, microorganisms, flavoring agents, sweeteners, cleansing agents and other such compounds for pharmaceutical, veterinary, horticultural, household, food, culinary, agricultural, cosmetic, industrial, cleaning, confectionery and flavoring applications.",
"Whenever mentioned and unless otherwise specified, the term “active agent” includes all forms of the active agent including neutral, ionic, salt, basic, acidic, natural, synthetic, diastereomeric, isomeric, enantiomerically pure, racemic, hydrate, chelate, derivative, analog, optically active, optically enriched, free base, free acid, regioisomeric, amorphous, anhydrous and/or crystalline forms.",
"A three-dimensionally printed dosage form can comprise one, two or more different active agents.",
"Particular combinations of active agents can be provided.",
"Some combinations of active agents include: 1) a first drug from a first therapeutic class and a different second drug from the same therapeutic class; 2) a first drug from a first therapeutic class and a different second drug from a different therapeutic class; 3) a first drug having a first type of biological activity and a different second drug having about the same biological activity; 4) a first drug having a first type of biological activity and a different second drug having a different second type of biological activity.",
"Exemplary combinations of active agents are described herein.",
"The active agent can be independently selected at each occurrence from active agents such as an antibiotic agent, antihistamine agent, decongestant, anti-inflammatory agent, antiparasitic agent, antiviral agent, local anesthetic, antifungal agent, amoebicidal agent, trichomonocidal agent, analgesic agent, anti-arthritic agent, anti-asthmatic agent, anticoagulant agent, anticonvulsant agent, antidepressant agent, antidiabetic agent, antineoplastic agent, anti-psychotic agent, neuroleptic agent, antihypertensive agent, hypnotic agent, sedative agent, anxiolytic energizer agent, antiparkinson agent, muscle relaxant agent, antimalarial agent, hormonal agent, contraceptive agent, sympathomimetic agent, hypoglycemic agent, antilipemic agent, ophthalmic agent, electrolytic agent, diagnostic agent, prokinetic agent, gastric acid secretion inhibitor agent, anti-ulcerant agent, anti-flatulent agent, anti-incontinence agent, cardiovascular agent or a combination thereof.",
"A description of these and other classes of useful drugs and a listing of species within each class can be found in Martindale, The Extra Pharmacopoeia, 31ST Ed.",
"(The Pharmaceutical Press, London 1996), the disclosure of which is incorporated herein by reference in its entirety.",
"The above-mentioned lists should not be considered exhaustive and are merely exemplary of the many embodiments considered within the scope of the invention.",
"Many other active agents can be included in the powder of the invention.",
"The liquid applied to the powder can be a solution or suspension.",
"The liquid can comprise an aqueous carrier, nonaqueous carrier, organic carrier or a combination thereof.",
"The aqueous carrier can be water or an aqueous buffer.",
"The nonaqueous carrier can be an organic solvent, low molecular weight polymer, oil, silicone, other suitable material, alcohol, ethanol, methanol, propanol, isopropanol, poly(ethylene glycol), glycol, other such materials or a combination thereof.",
"In some embodiments, the equipment assembly comprises one or more, two or more, three or more, four or more or plural liquid reservoirs.",
"The liquid can be colored or non-colored.",
"The liquid can comprise pigment, paint, dye, tint, ink or a combination thereof.",
"The liquid can comprise one or more solutes dissolved therein.",
"The powder and/or liquid can comprise one or more binders.",
"The exemplary embodiments herein should not be considered exhaustive, but merely illustrative of only a few of the many embodiments contemplated by the present invention.",
"As used herein, the term “about” is taken to mean a value that is within ±10%, ±5% or ±1% of the indicated value.",
"The entire disclosures of all documents cited herein are hereby incorporated by reference in their entirety.",
"Example 1 The following materials and procedure are used to prepare three-dimensionally printed dosage forms that dissolve rapidly in saliva.",
"A powder comprising at least one pharmaceutical carrier is loaded into the powder reservoir.",
"A fluid comprising a liquid and at least one active ingredient is loaded into the fluid reservoir.",
"The equipment assembly is operated, whereby plural stacked incremental layers of printed powder are sequentially formed in build modules by repeatedly passing the build modules through one or more build stations.",
"Typically four to fifty incremental printed powder layers are formed and adhere to each other thereby forming a printed bed having one or more articles surrounded by or embedded in loose powder.",
"The printed beds are dried in a dryer.",
"The printed articles are separated from the loose powder with a harvester.",
"The printed articles are then optionally dedusted with a deduster.",
"The printed articles are then optionally packaged.",
"The above is a detailed description of particular embodiments of the invention.",
"It will be appreciated that, although specific embodiments of the invention have been described herein for purposes of illustration, various modifications may be made without departing from the spirit and scope of the invention.",
"Accordingly, the invention is not limited except as by the appended claims.",
"All of the embodiments disclosed and claimed herein can be made and executed without undue experimentation in light of the present disclosure."
]
] |
Patent_15871445
|
[
[
"ELECTROPHOTOGRAPHIC IMAGE FORMING DEVICE HAVING A REPLACEABLE UNIT THAT INCLUDES AN ENGAGEMENT MEMBER FOR POSITIONING A MAGNETIC SENSOR",
"An electrophotographic image forming device includes a replaceable unit having a housing that includes a top, a bottom, a front, and a rear positioned between a first side and a second side of the housing.",
"The housing has a reservoir for storing toner.",
"A rotatable shaft is positioned within the reservoir and has an axis of rotation.",
"A magnet in the reservoir is movable in response to rotation of the shaft.",
"An engagement member is positioned on an exterior of the top of the housing.",
"The engagement member is aligned with a point in a path of movement of the magnet in the reservoir.",
"The engagement member has a front surface that is unobstructed to contact and push a housing in the image forming device supporting a magnetic sensor to an operating position of the magnetic sensor during insertion of the replaceable unit into the image forming device."
],
[
"1.An electrophotographic image forming device, comprising: a replaceable unit including: a housing having a top, a bottom, a front, and a rear positioned between a first side and a second side of the housing, the housing having a reservoir for storing toner; a rotatable shaft positioned within the reservoir and having an axis of rotation; a magnet in the reservoir movable in response to rotation of the shaft; and an engagement member positioned on an exterior of the top of the housing, the engagement member is aligned with a point in a path of movement of the magnet in the reservoir, the engagement member has a front surface that is unobstructed to contact and push a housing in the image forming device supporting a magnetic sensor to an operating position of the magnetic sensor during insertion of the replaceable unit into the image forming device.",
"2.The electrophotographic image forming device of claim 1, wherein the magnet is rotatable around the axis of rotation of the shaft in response to rotation of the shaft.",
"3.The electrophotographic image forming device of claim 1, wherein the engagement member is axially aligned with the magnet relative to the axis of rotation of the shaft.",
"4.The electrophotographic image forming device of claim 1, wherein the magnet passes in close proximity to an inner surface of the housing forming the reservoir at a location where the engagement member is positioned on the exterior of the housing.",
"5.The electrophotographic image forming device of claim 1, wherein the engagement member projects upward from the top of the housing.",
"6.The electrophotographic image forming device of claim 1, wherein the front surface of the engagement member includes a pair of front engagement surfaces spaced axially apart from each other and aligned with each other along a front-to-rear dimension of the housing.",
"7.The electrophotographic image forming device of claim 1, wherein the engagement member includes a pair of side engagement surfaces that face each other, the side engagement surfaces are spaced axially apart from each other and aligned with each other along a front-to-rear dimension of the housing.",
"8.The electrophotographic image forming device of claim 1, wherein the replaceable unit includes a ramp positioned on the exterior of the housing in front of the engagement member and leading toward the engagement member, a top surface of the ramp inclines upward as the ramp extends toward the engagement member.",
"9.The electrophotographic image forming device of claim 8, wherein the replaceable unit includes a planar top surface that extends rearward from a rear end of the ramp to the engagement member, the planar top surface is substantially horizontal when the toner cartridge is in its operative orientation.",
"10.An electrophotographic image forming device, comprising: a replaceable unit including: a housing having a top, a bottom, a front, and a rear positioned between a first side and a second side of the housing, the housing having a reservoir for storing toner; a rotatable shaft positioned within the reservoir and having an axis of rotation; a magnet connected to the shaft and rotatable around the axis of rotation in response to rotation of the shaft; and an engagement member positioned on an exterior of the top of the housing, the engagement member is axially aligned with the magnet relative to the axis of rotation of the shaft, the engagement member has a frontward facing portion that is unobstructed to contact and align a housing in the image forming device supporting a magnetic sensor during insertion of the replaceable unit into the image forming device.",
"11.The electrophotographic image forming device of claim 10, wherein the magnet passes in close proximity to an inner surface of the housing forming the reservoir at a location where the engagement member is positioned on the exterior of the housing.",
"12.The electrophotographic image forming device of claim 10, wherein the engagement member projects upward from the top of the housing.",
"13.The electrophotographic image forming device of claim 10, wherein the front surface of the engagement member includes a pair of front engagement surfaces spaced axially apart from each other and aligned with each other along a front-to-rear dimension of the housing.",
"14.The electrophotographic image forming device of claim 10, wherein the engagement member includes a pair of side engagement surfaces that face each other, the side engagement surfaces are spaced axially apart from each other and aligned with each other along a front-to-rear dimension of the housing.",
"15.The electrophotographic image forming device of claim 10, wherein the replaceable unit includes a ramp positioned on the exterior of the housing in front of the engagement member and leading toward the engagement member, a top surface of the ramp inclines upward as the ramp extends toward the engagement member.",
"16.The electrophotographic image forming device of claim 15, wherein the replaceable unit includes a planar top surface that extends rearward from a rear end of the ramp to the engagement member, the planar top surface is substantially horizontal when the toner cartridge is in its operative orientation.",
"17.An electrophotographic image forming device, comprising: a replaceable unit including: a housing having a top, a bottom, a front, and a rear positioned between a first side and a second side of the housing, the housing having a reservoir for storing toner; a rotatable shaft positioned within the reservoir and having an axis of rotation; a magnet in the reservoir movable in response to rotation of the shaft; and an engagement member positioned on an exterior of the top of the housing, the engagement member is configured to align a magnetic sensor in the image forming device with a point in a path of movement of the magnet in the reservoir during insertion of the replaceable unit into the image forming device."
],
[
"<SOH> BACKGROUND <EOH>"
],
[
"<SOH> SUMMARY <EOH>A replaceable unit for an electrophotographic image forming device according to one example embodiment includes a housing having a top, a bottom, a front, and a rear positioned between a first side and a second side of the housing.",
"The housing has a reservoir for storing toner.",
"A rotatable shaft is positioned within the reservoir and has an axis of rotation.",
"A magnet in the reservoir is movable in response to rotation of the shaft.",
"An engagement member is positioned on an exterior of the top of the housing.",
"The engagement member is aligned with a point in a path of movement of the magnet in the reservoir.",
"The engagement member has a front surface that is unobstructed to contact and push a housing in the image forming device supporting a magnetic sensor to an operating position of the magnetic sensor during insertion of the replaceable unit into the image forming device.",
"In some embodiments, the magnet is rotatable around the axis of rotation of the shaft in response to rotation of the shaft.",
"In some embodiments, the engagement member is axially aligned with the magnet relative to the axis of rotation of the shaft.",
"Embodiments include those where the magnet passes in close proximity to an inner surface of the housing forming the reservoir at a location where the engagement member is positioned on the exterior of the housing.",
"In some embodiments, the engagement member projects upward from the top of the housing.",
"Embodiments include those where the front surface of the engagement member includes a pair of front engagement surfaces spaced axially apart from each other and aligned with each other along a front-to-rear dimension of the housing.",
"Embodiments also include those where the engagement member includes a pair of side engagement surfaces that face each other and that are spaced axially apart from each other and aligned with each other along a front-to-rear dimension of the housing.",
"In some embodiments, a ramp is positioned on the exterior of the housing in front of the engagement member and leading toward the engagement member.",
"A top surface of the ramp inclines upward as the ramp extends toward the engagement member.",
"A planar top surface may extend rearward from a rear end of the ramp to the engagement member.",
"The planar top surface may be substantially horizontal when the toner cartridge is in its operative orientation.",
"A replaceable unit for an electrophotographic image forming device according to another example embodiment includes a housing having a top, a bottom, a front, and a rear positioned between a first side and a second side of the housing.",
"The housing has a reservoir for storing toner.",
"A rotatable shaft is positioned within the reservoir and has an axis of rotation.",
"A magnet is connected to the shaft and rotatable around the axis of rotation in response to rotation of the shaft.",
"An engagement member is positioned on an exterior of the top of the housing.",
"The engagement member is axially aligned with the magnet relative to the axis of rotation of the shaft.",
"The engagement member has a frontward facing portion that is unobstructed to contact and align a housing in the image forming device supporting a magnetic sensor during insertion of the replaceable unit into the image forming device.",
"A replaceable unit for an electrophotographic image forming device according to another example embodiment includes a housing having a top, a bottom, a front, and a rear positioned between a first side and a second side of the housing.",
"The housing has a reservoir for storing toner.",
"A rotatable shaft is positioned within the reservoir and has an axis of rotation.",
"A magnet in the reservoir is movable in response to rotation of the shaft.",
"An engagement member is positioned on an exterior of the top of the housing.",
"The engagement member is configured to align a magnetic sensor in the image forming device with a point in a path of movement of the magnet in the reservoir during insertion of the replaceable unit into the image forming device."
],
[
"CROSS REFERENCES TO RELATED APPLICATIONS This patent application is a continuation application of U.S. patent application Ser.",
"No.",
"15/408,500, filed Jan. 18, 2017, entitled “Replaceable Unit for an Electrophotographic Image Forming Device Having an Engagement Member for Positioning a Magnetic Sensor,” which is a continuation application of U.S. patent application Ser.",
"No.",
"15/202,639, filed Jul.",
"6, 2016, issued as U.S. Pat.",
"No.",
"9,588,462 on Mar.",
"7, 2017, entitled “Replaceable Unit for an Electrophotographic Image Forming Device Having an Engagement Member for Positioning a Magnetic Sensor,” which is a continuation application of U.S. patent application Ser.",
"No.",
"15/019,277, filed Feb. 9, 2016, issued as U.S. Pat.",
"No.",
"9,417,600 on Aug. 16, 2016, entitled “Replaceable Unit for an Electrophotographic Image Forming Device Having an Engagement Member for Positioning a Magnetic Sensor,” which is a continuation application of U.S. patent application Ser.",
"No.",
"14/631,146, filed Feb. 25, 2015, issued as U.S. Pat.",
"No.",
"9,291,989 on Mar.",
"22, 2016, entitled “Replaceable Unit for an Electrophotographic Image Forming Device Having an Engagement Member for Positioning a Magnetic Sensor.” BACKGROUND 1.Field of the Disclosure The present disclosure relates generally to image forming devices and more particularly to a replaceable unit for an electrophotographic image forming device having an engagement member for positioning a magnetic sensor.",
"2.Description of the Related Art During the electrophotographic printing process, an electrically charged rotating photoconductive drum is selectively exposed to a laser beam.",
"The areas of the photoconductive drum exposed to the laser beam are discharged creating an electrostatic latent image of a page to be printed on the photoconductive drum.",
"Toner particles are then electrostatically picked up by the latent image on the photoconductive drum creating a toned image on the drum.",
"The toned image is transferred to the print media (e.g., paper) either directly by the photoconductive drum or indirectly by an intermediate transfer member.",
"The toner is then fused to the media using heat and pressure to complete the print.",
"The image forming device's toner supply is typically stored in one or more replaceable units that have a shorter lifespan than the image forming device.",
"It is desired to communicate various characteristics of the replaceable unit(s) to the image forming device for proper operation.",
"For example, as these replaceable units run out of toner, the units must be replaced or refilled in order to continue printing.",
"As a result, it may be desired to communicate the amount of toner remaining in the replaceable unit(s) to the image forming device in order to warn the user that the replaceable unit is near an empty state or to prevent printing after the unit is empty in order to prevent damage to the image forming device.",
"It may be desired to communicate other characteristics of the replaceable unit(s) to the image forming device such as toner type, toner color, toner capacity, replaceable unit serial number, replaceable unit type, etc.",
"SUMMARY A replaceable unit for an electrophotographic image forming device according to one example embodiment includes a housing having a top, a bottom, a front, and a rear positioned between a first side and a second side of the housing.",
"The housing has a reservoir for storing toner.",
"A rotatable shaft is positioned within the reservoir and has an axis of rotation.",
"A magnet in the reservoir is movable in response to rotation of the shaft.",
"An engagement member is positioned on an exterior of the top of the housing.",
"The engagement member is aligned with a point in a path of movement of the magnet in the reservoir.",
"The engagement member has a front surface that is unobstructed to contact and push a housing in the image forming device supporting a magnetic sensor to an operating position of the magnetic sensor during insertion of the replaceable unit into the image forming device.",
"In some embodiments, the magnet is rotatable around the axis of rotation of the shaft in response to rotation of the shaft.",
"In some embodiments, the engagement member is axially aligned with the magnet relative to the axis of rotation of the shaft.",
"Embodiments include those where the magnet passes in close proximity to an inner surface of the housing forming the reservoir at a location where the engagement member is positioned on the exterior of the housing.",
"In some embodiments, the engagement member projects upward from the top of the housing.",
"Embodiments include those where the front surface of the engagement member includes a pair of front engagement surfaces spaced axially apart from each other and aligned with each other along a front-to-rear dimension of the housing.",
"Embodiments also include those where the engagement member includes a pair of side engagement surfaces that face each other and that are spaced axially apart from each other and aligned with each other along a front-to-rear dimension of the housing.",
"In some embodiments, a ramp is positioned on the exterior of the housing in front of the engagement member and leading toward the engagement member.",
"A top surface of the ramp inclines upward as the ramp extends toward the engagement member.",
"A planar top surface may extend rearward from a rear end of the ramp to the engagement member.",
"The planar top surface may be substantially horizontal when the toner cartridge is in its operative orientation.",
"A replaceable unit for an electrophotographic image forming device according to another example embodiment includes a housing having a top, a bottom, a front, and a rear positioned between a first side and a second side of the housing.",
"The housing has a reservoir for storing toner.",
"A rotatable shaft is positioned within the reservoir and has an axis of rotation.",
"A magnet is connected to the shaft and rotatable around the axis of rotation in response to rotation of the shaft.",
"An engagement member is positioned on an exterior of the top of the housing.",
"The engagement member is axially aligned with the magnet relative to the axis of rotation of the shaft.",
"The engagement member has a frontward facing portion that is unobstructed to contact and align a housing in the image forming device supporting a magnetic sensor during insertion of the replaceable unit into the image forming device.",
"A replaceable unit for an electrophotographic image forming device according to another example embodiment includes a housing having a top, a bottom, a front, and a rear positioned between a first side and a second side of the housing.",
"The housing has a reservoir for storing toner.",
"A rotatable shaft is positioned within the reservoir and has an axis of rotation.",
"A magnet in the reservoir is movable in response to rotation of the shaft.",
"An engagement member is positioned on an exterior of the top of the housing.",
"The engagement member is configured to align a magnetic sensor in the image forming device with a point in a path of movement of the magnet in the reservoir during insertion of the replaceable unit into the image forming device.",
"BRIEF DESCRIPTION OF THE DRAWINGS The accompanying drawings incorporated in and forming a part of the specification, illustrate several aspects of the present disclosure, and together with the description serve to explain the principles of the present disclosure.",
"FIG.",
"1 is a block diagram of an imaging system according to one example embodiment.",
"FIG.",
"2 is a perspective view of a toner cartridge and an imaging unit according to one example embodiment.",
"FIG.",
"3 is a front perspective view of the toner cartridge shown in FIG.",
"2.FIG.",
"4 is a rear perspective view of the toner cartridge shown in FIGS.",
"2 and 3.FIG.",
"5 is an exploded view of the toner cartridge shown in FIGS.",
"2-4 showing a reservoir for holding toner therein.",
"FIG.",
"6 is a cross-sectional side view of the toner cartridge installed in an image forming device according to one example embodiment.",
"FIG.",
"7 is a bottom perspective view of a magnetic sensor housing according to one example embodiment.",
"FIG.",
"8 is a top perspective view of the magnetic sensor housing shown in FIG.",
"7.FIG.",
"9 is a front perspective view of the toner cartridge shown in FIGS.",
"2-5 with a portion of a front wall of the toner cartridge removed to illustrate a portion of the reservoir according to one example embodiment.",
"FIG.",
"10 is a top plan view of an engagement member of the toner cartridge shown in FIG.",
"9 according to one example embodiment.",
"FIG.",
"11 is a side elevation view of the toner cartridge as it enters the image forming device.",
"FIG.",
"12 is a side elevation view of the toner cartridge inserted further into the image forming device with the toner cartridge contacting the magnetic sensor housing.",
"FIG.",
"13 is a side elevation view of the toner cartridge inserted further into the image forming device with the toner cartridge having moved the magnetic sensor housing to its final vertical position.",
"FIGS.",
"14A and 14B are a side elevation view and a top cross sectional view, respectively, of the toner cartridge inserted further into the image forming device with the engagement member of the toner cartridge approaching the magnetic sensor housing.",
"FIGS.",
"15A and 15B are a side elevation view and a top cross sectional view, respectively, of the toner cartridge inserted further into the image forming device with engagement surfaces of the engagement member of the toner cartridge contacting corresponding engagement surfaces of the magnetic sensor housing.",
"FIG.",
"16 is a side elevation view of the toner cartridge fully installed in the image forming device and the magnetic sensor housing in its operating position.",
"FIG.",
"17A is a top plan view of a first engagement member of the toner cartridge according to one example embodiment.",
"FIG.",
"17B is a top plan view of a second engagement member of the toner cartridge according to one example embodiment.",
"FIG.",
"17C is a top plan view of a third engagement member of the toner cartridge according to one example embodiment.",
"FIG.",
"17D is front perspective view of a fourth engagement member of the toner cartridge according to one example embodiment.",
"FIG.",
"18 is a perspective view of a paddle assembly of the toner cartridge according to one example embodiment.",
"FIGS.",
"19A-19C are cross-sectional side views of the toner cartridge illustrating the operation of a sensing linkage at various toner levels according to one example embodiment.",
"FIG.",
"20 is a perspective view of a paddle assembly of the toner cartridge according to another example embodiment.",
"DETAILED DESCRIPTION In the following description, reference is made to the accompanying drawings where like numerals represent like elements.",
"The embodiments are described in sufficient detail to enable those skilled in the art to practice the present disclosure.",
"It is to be understood that other embodiments may be utilized and that process, electrical, and mechanical changes, etc., may be made without departing from the scope of the present disclosure.",
"Examples merely typify possible variations.",
"Portions and features of some embodiments may be included in or substituted for those of others.",
"The following description, therefore, is not to be taken in a limiting sense and the scope of the present disclosure is defined only by the appended claims and their equivalents.",
"Referring now to the drawings and particularly to FIG.",
"1, there is shown a block diagram depiction of an imaging system 20 according to one example embodiment.",
"Imaging system 20 includes an image forming device 22 and a computer 24.Image forming device 22 communicates with computer 24 via a communications link 26.As used herein, the term “communications link” generally refers to any structure that facilitates electronic communication between multiple components and may operate using wired or wireless technology and may include communications over the Internet.",
"In the example embodiment shown in FIG.",
"1, image forming device 22 is a multifunction machine (sometimes referred to as an all-in-one (AIO) device) that includes a controller 28, a print engine 30, a laser scan unit (LSU) 31, an imaging unit 32, a toner cartridge 35, a user interface 36, a media feed system 38, a media input tray 39 and a scanner system 40.Image forming device 22 may communicate with computer 24 via a standard communication protocol, such as for example, universal serial bus (USB), Ethernet or IEEE 802.xx.",
"Image forming device 22 may be, for example, an electrophotographic printer/copier including an integrated scanner system 40 or a standalone electrophotographic printer.",
"Controller 28 includes a processor unit and associated electronic memory 29.The processor may include one or more integrated circuits in the form of a microprocessor or central processing unit and may be formed as one or more Application-specific integrated circuits (ASICs).",
"Memory 29 may be any volatile or non-volatile memory or combination thereof such as, for example, random access memory (RAM), read only memory (ROM), flash memory and/or non-volatile RAM (NVRAM).",
"Alternatively, memory 29 may be in the form of a separate memory (e.g., RAM, ROM, and/or NVRAM), a hard drive, a CD or DVD drive, or any memory device convenient for use with controller 28.Controller 28 may be, for example, a combined printer and scanner controller.",
"In the example embodiment illustrated, controller 28 communicates with print engine 30 via a communications link 50.Controller 28 communicates with imaging unit 32 and processing circuitry 44 thereon via a communications link 51.Controller 28 communicates with toner cartridge 35 and processing circuitry 45 thereon via a communications link 52.Controller 28 communicates with media feed system 38 via a communications link 53.Controller 28 communicates with scanner system 40 via a communications link 54.User interface 36 is communicatively coupled to controller 28 via a communications link 55.Processing circuitry 44, 45 may provide authentication functions, safety and operational interlocks, operating parameters and usage information related to imaging unit 32 and toner cartridge 35, respectively.",
"Controller 28 processes print and scan data and operates print engine 30 during printing and scanner system 40 during scanning.",
"Computer 24, which is optional, may be, for example, a personal computer, including electronic memory 60, such as RAM, ROM, and/or NVRAM, an input device 62, such as a keyboard and/or a mouse, and a display monitor 64.Computer 24 also includes a processor, input/output (I/O) interfaces, and may include at least one mass data storage device, such as a hard drive, a CD-ROM and/or a DVD unit (not shown).",
"Computer 24 may also be a device capable of communicating with image forming device 22 other than a personal computer such as, for example, a tablet computer, a smartphone, or other electronic device.",
"In the example embodiment illustrated, computer 24 includes in its memory a software program including program instructions that function as an imaging driver 66, e.g., printer/scanner driver software, for image forming device 22.Imaging driver 66 is in communication with controller 28 of image forming device 22 via communications link 26.Imaging driver 66 facilitates communication between image forming device 22 and computer 24.One aspect of imaging driver 66 may be, for example, to provide formatted print data to image forming device 22, and more particularly to print engine 30, to print an image.",
"Another aspect of imaging driver 66 may be, for example, to facilitate collection of scanned data from scanner system 40.In some circumstances, it may be desirable to operate image forming device 22 in a standalone mode.",
"In the standalone mode, image forming device 22 is capable of functioning without computer 24.Accordingly, all or a portion of imaging driver 66, or a similar driver, may be located in controller 28 of image forming device 22 so as to accommodate printing and/or scanning functionality when operating in the standalone mode.",
"Print engine 30 includes a laser scan unit (LSU) 31, toner cartridge 35, imaging unit 32, and a fuser 37, all mounted within image forming device 22.Imaging unit 32 is removably mounted in image forming device 22 and includes a developer unit 34 that houses a toner sump and a toner delivery system.",
"In one embodiment, the toner delivery system utilizes what is commonly referred to as a single component development system.",
"In this embodiment, the toner delivery system includes a toner adder roll that provides toner from the toner sump to a developer roll.",
"A doctor blade provides a metered uniform layer of toner on the surface of the developer roll.",
"In another embodiment, the toner delivery system utilizes what is commonly referred to as a dual component development system.",
"In this embodiment, toner in the toner sump of developer unit 34 is mixed with magnetic carrier beads.",
"The magnetic carrier beads may be coated with a polymeric film to provide triboelectric properties to attract toner to the carrier beads as the toner and the magnetic carrier beads are mixed in the toner sump.",
"In this embodiment, developer unit 34 includes a magnetic roll that attracts the magnetic carrier beads having toner thereon to the magnetic roll through the use of magnetic fields.",
"Imaging unit 32 also includes a cleaner unit 33 that houses a photoconductive drum and a waste toner removal system.",
"Toner cartridge 35 is removably mounted in imaging forming device 22 in a mating relationship with developer unit 34 of imaging unit 32.An outlet port on toner cartridge 35 communicates with an entrance port on developer unit 34 allowing toner to be periodically transferred from toner cartridge 35 to resupply the toner sump in developer unit 34.The electrophotographic printing process is well known in the art and, therefore, is described briefly herein.",
"During a printing operation, laser scan unit 31 creates a latent image on the photoconductive drum in cleaner unit 33.Toner is transferred from the toner sump in developer unit 34 to the latent image on the photoconductive drum by the developer roll (in the case of a single component development system) or by the magnetic roll (in the case of a dual component development system) to create a toned image.",
"The toned image is then transferred to a media sheet received by imaging unit 32 from media input tray 39 for printing.",
"Toner may be transferred directly to the media sheet by the photoconductive drum or by an intermediate transfer member that receives the toner from the photoconductive drum.",
"Toner remnants are removed from the photoconductive drum by the waste toner removal system.",
"The toner image is bonded to the media sheet in fuser 37 and then sent to an output location or to one or more finishing options such as a duplexer, a stapler or a hole-punch.",
"Referring now to FIG.",
"2, a toner cartridge 100 and an imaging unit 200 are shown according to one example embodiment.",
"Imaging unit 200 includes a developer unit 202 and a cleaner unit 204 mounted on a common frame 206.As discussed above, imaging unit 200 and toner cartridge 100 are each removably installed in image forming device 22.Imaging unit 200 is first slidably inserted into image forming device 22.Toner cartridge 100 is then inserted into image forming device 22 and onto frame 206 in a mating relationship with developer unit 202 of imaging unit 200 as indicated by the arrow shown in FIG.",
"2.This arrangement allows toner cartridge 100 to be removed and reinserted easily when replacing an empty toner cartridge 100 without having to remove imaging unit 200.Imaging unit 200 may also be readily removed as desired in order to maintain, repair or replace the components associated with developer unit 202, cleaner unit 204 or frame 206 or to clear a media jam.",
"With reference to FIGS.",
"2-5, toner cartridge 100 includes a housing 102 having an enclosed reservoir 104 (FIG.",
"5) for storing toner.",
"Housing 102 may include a top or lid 106 mounted on a base 108.Base 108 includes first and second side walls 110, 112 connected to adjoining front and rear walls 114, 116 and a bottom 117.In one embodiment, top 106 is ultrasonically welded to base 108 thereby forming enclosed reservoir 104.First and second end caps 118, 120 may be mounted to side walls 110, 112, respectively, and may include guides 122 to assist the insertion of toner cartridge 100 into image forming device 22 for mating with developer unit 202.First and second end caps 118, 120 may be snap fitted into place or attached by screws or other fasteners.",
"Guides 122 travel in corresponding channels within image forming device 22.Legs 124 may also be provided on bottom 117 of base 106 or end caps 118, 120 to assist with the insertion of toner cartridge 100 into image forming device 22.Legs 124 are received by frame 206 to facilitate the mating of toner cartridge 100 with developer unit 202.A handle 126 may be provided on top 106 or base 108 of toner cartridge 100 to assist with insertion and removal of toner cartridge 100 from imaging unit 200 and image forming device 22.An outlet port 128 is positioned on front wall 114 of toner cartridge 100 for exiting toner from toner cartridge 100.With reference to FIG.",
"5, various drive gears are housed within a space formed between end cap 118 and side wall 110.A main interface gear 130 engages with a drive system in image forming device 22 that provides torque to main interface gear 130.A paddle assembly 140 is rotatably mounted within toner reservoir 104 with first and second ends of a drive shaft 132 of paddle assembly 140 extending through aligned openings in side walls 110, 112, respectively.",
"A drive gear 134 is provided on the first end of drive shaft 132 that engages with main interface gear 130 either directly or via one or more intermediate gears.",
"Bushings may be provided on each end of drive shaft 132 where it passes through side walls 110, 112.An auger 136 having first and second ends 136a, 136b and a spiral screw flight is positioned in a channel 138 extending along the width of front wall 114 between side walls 110, 112.Channel 138 may be integrally molded as part of front wall 114 or formed as a separate component that is attached to front wall 114.Channel 138 is generally horizontal in orientation along with toner cartridge 100 when toner cartridge 100 is installed in image forming device 22.First end 136a of auger 136 extends through side wall 110 and a drive gear (not shown) is provided on first end 136a that engages with main interface gear 130 either directly or via one or more intermediate gears.",
"Channel 138 may include an open portion 138a and an enclosed portion 138b.",
"Open portion 138a is open to toner reservoir 104 and extends from side wall 110 toward second end 136b of auger 136.Enclosed portion 138b of channel 138 extends from side wall 112 and encloses an optional shutter and second end 136b of auger 136.In this embodiment, outlet port 128 is positioned at the bottom of enclosed portion 138b of channel 138 so that gravity will assist in exiting toner through outlet port 128.The shutter is movable between a closed position blocking toner from exiting outlet port 128 and an open position permitting toner to exit outlet port 128.As paddle assembly 140 rotates, it delivers toner from toner reservoir 104 into open portion 138a of channel 138.As auger 136 rotates, it delivers toner received in channel 138 into enclosed portion 138b of channel 138 where the toner passes out of outlet port 128 into a corresponding entrance port 208 in developer unit 202 (FIG.",
"2).",
"In one embodiment, entrance port 208 of developer unit 202 is surrounded by a foam seal 210 that traps residual toner and prevents toner leakage at the interface between outlet port 128 and entrance port 208.The drive system in image forming device 22 includes a drive motor and a drive transmission from the drive motor to a drive gear that mates with main interface gear 130 when toner cartridge 100 is installed in image forming device 22.The drive system in image forming device 22 may include an encoded device, such as an encoder wheel, (e.g., coupled to a shaft of the drive motor) and an associated code reader, such as an infrared sensor, to sense the motion of the encoded device.",
"The code reader is in communication with controller 28 in order to permit controller 28 to track the amount of rotation of main interface gear 130, auger 136 and paddle assembly 140.Although the example embodiment shown in FIGS.",
"2-5 includes a pair of replaceable units in the form of toner cartridge 100 and imaging unit 200, it will be appreciated that the replaceable unit(s) of the image forming device may employ any suitable configuration as desired.",
"For example, in one embodiment, the main toner supply for the image forming device, the developer unit, and the cleaner unit are housed in one replaceable unit.",
"In another embodiment, the main toner supply for the image forming device and the developer unit are provided in a first replaceable unit and the cleaner unit is provided in a second replaceable unit.",
"Further, although the example image forming device 22 discussed above includes one toner cartridge and corresponding imaging unit, in the case of an image forming device configured to print in color, separate replaceable units may be used for each toner color needed.",
"For example, in one embodiment, the image forming device includes four toner cartridges and four corresponding imaging units, each toner cartridge containing a particular toner color (e.g., black, cyan, yellow and magenta) and each imaging unit corresponding with one of the toner cartridges to permit color printing.",
"FIG.",
"6 is a cross-sectional side view of toner cartridge 100 installed in image forming device 22 according to one example embodiment.",
"Paddle assembly 140 includes at least one permanent magnet, such as magnets 150, 168a and 168b shown in FIG.",
"6, that moves within reservoir 104 in response to the rotation of drive shaft 132 and paddle assembly 140.As discussed in greater detail below, the permanent magnet(s) communicate information about toner cartridge 100 to controller 28 of image forming device 22.Image forming device 22 includes a magnetic sensor 300 positioned to detect the motion of the permanent magnet(s) during rotation of shaft 132 when toner cartridge 100 is installed in image forming device 22.Magnetic sensor 300 is in electronic communication with controller 28.In the example embodiment illustrated, magnetic sensor 300 is positioned adjacent to top 106 of housing 102.In other embodiments, magnetic sensor 300 is positioned adjacent to bottom 117, front wall 114, rear wall 116 or side wall 110 or 112.In those embodiments where magnetic sensor 300 is positioned adjacent to top 106, bottom 117, front wall 114 or rear wall 116, the magnet(s) are positioned adjacent to the inner surfaces of top 106, bottom 117, front wall 114 or rear wall 116 as shaft 132 rotates.",
"In those embodiments where magnetic sensor 300 is positioned adjacent to side wall 110 or 112, the magnet(s) are positioned adjacent to the inner surface of side wall 110 or 112.Magnetic sensor 300 may be any suitable device capable of detecting the presence or absence of a magnetic field.",
"For example, magnetic sensor 300 may be a hall-effect sensor, which is a transducer that varies its electrical output in response to a magnetic field.",
"Magnetic sensor 300 is supported by a housing 302 that is movable within image forming device 22.As discussed in greater detail below, housing 302 is biased toward a home position that is in the insertion path of toner cartridge 100 such that as toner cartridge 100 is installed in image forming device 22, an engagement member (not shown in FIG.",
"6 for clarity) on toner cartridge 100 contacts and moves housing 302 into position to detect the permanent magnet(s) in reservoir 104.The positioning of housing 302 by toner cartridge 100 upon installation of toner cartridge 100 into image forming device 22 permits the accurate positioning of magnetic sensor 300 relative to the permanent magnet(s) of each individual toner cartridge 100 installed in image forming device 22 regardless of manufacturing variations between different toner cartridges 100.If instead housing 302 is positioned at a fixed location in image forming device 22, depending on physical variations between different toner cartridges 100, magnetic sensor 300 may not be properly positioned to detect the permanent magnet(s) of a given toner cartridge 100.FIGS.",
"7 and 8 show housing 302 according to one example embodiment.",
"In this embodiment, housing 302 is positioned adjacent to top 106 of housing 102 as shown in FIG.",
"6.Housing 302 includes a bottom 304 that faces toward top 106 of housing 102 when toner cartridge 100 is installed in image forming device 22 and a top 306 that faces away from toner cartridge 100.As shown in FIG.",
"7, in the embodiment illustrated, magnetic sensor 300 is exposed on bottom 304 of housing 302 to permit detection of the permanent magnet(s) of toner cartridge 100.Housing 302 includes a rear 310 that faces toward the direction from which toner cartridge 100 is inserted into image forming device 22 and a front 308 opposite rear 310.Housing 302 also includes a pair of sides 312, 314.Housing 302 is loosely mounted to a frame 316 that is fixedly positioned in image forming device 22.Housing 302 is slidable forward and rearward within an opening 322 in frame 316 between a front end 318 of frame 316 and a rear end 320 of frame 316.Housing 302 is biased toward rear end 320 such as, for example, by one or more extension springs 324.In the embodiment illustrated, extension springs 324 are attached at one end to housing 302 and at the opposite end to rear end 320 of frame 316.Other suitable biasing members may be used such as, for example, one or more compression springs or a material having resilient properties that bias housing 302 toward rear end 320.Housing 302 is movable vertically up and down relative to frame 316 and biased downward such as, for example, by one or more compression springs.",
"In the embodiment illustrated, a compression spring (not shown) is positioned between housing 302 and a plunger 328 that is loosely attached to housing 302 and movable up and down relative to housing 302.A top contact surface 330 of plunger 328 is in pressed contact with the bottom side of a frame 332 (FIG.",
"6) of image forming device 22.Other suitable biasing members may be used such as, for example, one or more extension springs or a material having resilient properties that bias housing 302 downward.",
"Housing 302 is also movable side-to-side within opening 322.In the example embodiment illustrated, frame 316 includes a pair of ledges 334, 335 on opposite sides of opening 322 that run from front end 318 to rear end 320.Housing 302 includes a corresponding pair of guides 336, 337 that run along sides 312, 314 of housing 302 along a front-to-rear dimension of housing 302.The downward bias on housing 302 (e.g., the force from the compression spring on housing 302 resulting from the contact between plunger 328 and frame 332) pushes the bottom surfaces of guides 336, 337 into contact with top surfaces 334a, 335a of ledges 334, 335, respectively.",
"Top surfaces 334a, 335a of ledges 334, 335 also guide the front-to-rear sliding movement of housing 302 when the bottom surfaces of guides 336, 337 are in contact with top surfaces 334a, 335a of ledges 334, 335.Inner surfaces 334b, 335b of ledges 334, 335 limit the side-to-side movement of housing 302 relative to frame 316.As shown in FIG.",
"7, in the embodiment illustrated, housing 302 includes a tapered nose 340 at its rear 310.A bottom surface 340a of nose 340 projects further downward as bottom surface 340a extends from rear 310 toward front 308.The side surfaces 340b, 340c of nose 340 project further outward as side surfaces 340b, 340c extend from rear 310 toward front 308.Nose 340 may include a planar rear surface 340d as illustrated or a curved or pointed rear surface 340d.",
"In the embodiment illustrated, housing 302 also includes a pair of rearward facing engagement surfaces 342, 343.In one embodiment, engagement surfaces 342, 343 receive contact from a corresponding engagement member on toner cartridge 100 to move housing 302 to its operating position where magnetic sensor 300 is aligned with the permanent magnet(s) in reservoir 104 as discussed in greater detail below.",
"With reference to FIGS.",
"9 and 10, toner cartridge 100 is shown with a portion of front wall 114 removed in order to illustrate a portion of reservoir 104.Toner cartridge 100 includes an engagement member 190 positioned on the exterior of housing 102 to contact and move housing 302 into position for magnetic sensor 300 to detect the permanent magnet(s) in reservoir 104.In the example embodiment illustrated, engagement member 190 projects upward from top 106 of housing 102; however, engagement member 190 may be positioned in other locations on housing 102 depending on the position of magnetic sensor 300 in image forming device 22 and the position(s) of the permanent magnet(s) in reservoir 104.In the example embodiment illustrated, engagement member 190 includes a U-shaped projection; however, engagement member 190 may take any suitable form.",
"In one embodiment, the permanent magnet(s) in reservoir 104 are positioned to pass in close proximity to the inner surface of housing 102 at the location where engagement member 190 is positioned on the exterior of housing 102.In some embodiments where magnetic sensor 300 is positioned adjacent to bottom 117, front wall 114, rear wall 116 or side wall 110 or 112, engagement member 190 is axially aligned relative to drive shaft 132 with the permanent magnet(s), e.g., magnets 150, 168a and 168b, of paddle assembly 140.A front surface 191 of engagement member 190 is unobstructed to allow front surface 191 to directly contact housing 302 during insertion of toner cartridge 100 into image forming device 22.In the example embodiment illustrated, engagement member 190 includes a rear portion 192 that forms the bottom of the “U” shape and a pair of forward extending portions 193 that are spaced axially apart from each other and form the upper portions of the “U” shape.",
"In the example embodiment illustrated, front surface 191 of engagement member 190 includes a pair of front engagement surfaces 194, 195 positioned at frontmost ends of forward extending portions 193.In one embodiment, front engagement surfaces 194, 195 are aligned with each other in the front-to-rear dimension of housing 102.Engagement surfaces 194, 195 are positioned to directly contact engagement surfaces 342, 343 of housing 302 as toner cartridge 100 is inserted into image forming device 22 to move housing 302 to its operating position as discussed in greater detail below.",
"In the example embodiment illustrated, forward extending portions 193 include inner side surfaces 193a, 193b that face each other and are aligned with each other in the front-to-rear dimension of housing 102.Toner cartridge 100 may also include a lead-in ramp 196 positioned in front of and leading toward engagement member 190 and axially aligned relative to drive shaft 132 with the permanent magnet(s) of paddle assembly 140.The top surface of ramp 196 inclines upward as ramp 196 extends toward engagement member 190.In one embodiment, the top surface of ramp 196 is substantially planar and includes a substantially constant slope.",
"Toner cartridge 100 may include a planar top surface 198 that extends forward from engagement member 190 and that is axially aligned relative to drive shaft 132 with the permanent magnet(s) of paddle assembly 140.In the embodiment illustrated, ramp 196 leads to planar top surface 198, which continues rearward along top 106 of housing 102 from ramp 196 to rear portion 192 of engagement member 190.In one embodiment, planar top surface 198 is substantially horizontal when toner cartridge 100 is in its operative orientation, i.e., the orientation of toner cartridge 100 when it is fully installed in image forming device 22.FIGS.",
"11-16 are sequential views that illustrate the interaction between engagement member 190 of toner cartridge 100 and housing 302 of magnetic sensor 300 when toner cartridge 100 is inserted into image forming device 22.FIG.",
"11 shows toner cartridge 100 as it enters image forming device 22 before contacting housing 302 of magnetic sensor 300.As shown in FIG.",
"11, housing 302 is biased rearward against rear end 320 of opening 322 in frame 316.Housing 302 is also biased downward against top surfaces 334a, 335a of ledges 334, 335 with top contact surface 330 of plunger 328 in contact with the bottom side of frame 332 of image forming device 22.FIG.",
"12 shows toner cartridge 100 inserted further into image forming device 22.As toner cartridge 100 first contacts housing 302, lead-in ramp 196 of toner cartridge 100 contacts tapered bottom surface 340a of nose 340 of housing 302.As toner cartridge 100 advances, lead-in ramp 196 slides across tapered bottom surface 340a of nose 340 applying an upward force on housing 302 that overcomes the downward bias on housing 302 causing housing 302 to gradually lift upward.",
"As shown in FIG.",
"13, housing 302 reaches its final vertical position once the rear end of ramp 196 reaches the bottom 304 of housing 302.As toner cartridge 100 advances further, planar top surface 198 slides across bottom 304 of housing 302 and engagement member 190 advances toward housing 302.With reference to FIGS.",
"14A and 14B, as toner cartridge 100 advances further, rear 310 of housing 302 reaches engagement member 190.If housing 302 is misaligned with toner cartridge 100 in the side-to-side direction, inner side surfaces 193a, 193b of forward extending portions 193 of engagement members 190 directly contact one or both of the tapered side surfaces 340b, 340c of nose 340.The contact between inner side surfaces 193a, 193b of forward extending portions 193 of engagement members 190 and side surfaces 340b, 340c of nose 340 align housing 302 with engagement member 190 in the side-to-side direction as toner cartridge 100 advances.",
"FIGS.",
"15A and 15B show housing 302 aligned in the side-to-side direction with engagement member 190 and toner cartridge 100 advanced to the point where engagement surfaces 194, 195 have begun to contact corresponding rearward facing engagement surfaces 342, 343 of housing 302.As toner cartridge 100 advances further, the contact between bottom 304 and planar top surface 198 maintains the vertical position of housing 302 relative to toner cartridge 100 and the inner side surfaces 193a, 193b of forward extending portions 193 of engagement members 190 ensure that the side-to-side alignment of housing 302 relative to toner cartridge 100 is maintained.",
"As toner cartridge 100 continues to advance to its operating position, the contact between engagement surfaces 194, 195 of engagement member 190 of toner cartridge 100 and rearward facing engagement surfaces 342, 343 of housing 302 overcomes the rearward bias on housing 302 causing housing 302 to slide in opening 322 toward front end 318 of frame 316.In this manner, engagement surfaces 194, 195 of engagement member 190 push against rearward facing engagement surfaces 342, 343 of housing 302 causing housing 302 to move forward with toner cartridge 100.Housing 302 reaches its operating position with magnetic sensor 300 positioned to detect the permanent magnet(s) in reservoir 104 once toner cartridge 100 is fully installed in image forming device 22 as shown in FIG.",
"16.The contact between engagement surfaces 194, 195 and rearward facing engagement surfaces 342, 343 of housing 302 maintains the front-to-rear position of housing 302 relative to toner cartridge 100.When toner cartridge 100 is removed from image forming device 22, this sequence is reversed and the downward and rearward bias on housing 302 returns housing 302 to the position shown in FIG.",
"11.While the example embodiment illustrated in FIGS.",
"11-16 shows engagement member 190 of toner cartridge 100 contacting housing 302 of magnetic sensor 300 directly, in other embodiments, engagement member 190 contacts an intermediate linkage that, in turn, moves housing 302 from its home position to its operating position.",
"As discussed above, engagement member 190 may take many suitable forms.",
"FIGS.",
"17A-17D illustrate several additional examples.",
"FIG.",
"17A shows an engagement member 1190 that includes a pair of cylinders 1192, 1193 that project from top 106 of housing 102.Engagement member 1190 has a front surface 1191 that includes a pair of front engagement surfaces 1194, 1195 positioned to contact corresponding engagement surfaces 342, 343 of housing 302.In one embodiment, front engagement surfaces 1194, 1195 are positioned at substantially the same locations as front engagement surfaces 194, 195 of engagement member 190 discussed above.",
"Side surfaces 1196, 1197 of cylinders 1192, 1193 are positioned to realign housing 302 in the side-to-side direction if housing 302 is misaligned upon insertion of toner cartridge 100 into image forming device 22 similar to inner side surfaces 193a, 193b discussed above.",
"FIG.",
"17B shows an engagement member 2190 that includes a pair of generally rectangular projections 2192, 2193 from top 106 of housing 102.Engagement member 2190 has a front surface 2191 that includes a pair of front engagement surfaces 2194, 2195 positioned to contact corresponding engagement surfaces 342, 343 of housing 302.In one embodiment, front engagement surfaces 2194, 2195 are positioned at substantially the same locations as front engagement surfaces 194, 195 of engagement member 190 discussed above.",
"Side surfaces 2196, 2197 of rectangular projections 2192, 2193 are positioned to realign housing 302 in the side-to-side direction if housing 302 is misaligned upon insertion of toner cartridge 100 into image forming device 22 similar to inner side surfaces 193a, 193b discussed above.",
"FIG.",
"17C shows an engagement member 3190 that includes a projection 3192 from top 106 of housing 102.Engagement member 3190 has a front surface 3191 that includes a front engagement surface 3194 positioned to contact rear 310 of housing 302, which serves as an engagement surface of housing 302 in this embodiment.",
"In one embodiment, engagement surface 3194 is positioned at substantially the same location as rear portion 192 of engagement member 190 discussed above.",
"FIG.",
"17D shows an engagement member 4190 that includes a cutout or recess 4191 in top 106 of housing 102.A top surface of housing 302 inside of recess 4191 forms a planar top surface 4196 similar to planar top surface 196 discussed above.",
"A rear wall 4192 is positioned at a rearmost end of recess 4191 and may be positioned at substantially the same location as rear portion 192 of engagement member 190 discussed above.",
"Side walls 4197, 4198 of recess 4191 are positioned to realign housing 302 in the side-to-side direction if housing 302 is misaligned upon insertion of toner cartridge 100 into image forming device 22 similar to inner side surfaces 193a, 193b discussed above.",
"A front engagement surface 4194, 4195 is positioned at the front of each side wall 4196, 4197.Front engagement surfaces 4194, 4195 are positioned to contact corresponding engagement surfaces 342, 343 of housing 302.In one embodiment, front engagement surfaces 4194, 4195 are positioned at substantially the same locations as front engagement surfaces 194, 195 of engagement member 190 discussed above.",
"In another embodiment, rear wall 4192 is positioned to contact rear 310 of housing 302, which serves as an engagement surface of housing 302 in this embodiment.",
"As discussed above, paddle assembly 140 includes at least one permanent magnet that moves within reservoir 104 in response to the rotation of drive shaft 132 and that communicates information about toner cartridge 100 to controller 28 of image forming device 22.FIG.",
"18 shows paddle assembly 140 having permanent magnets for toner level sensing in greater detail according to one example embodiment.",
"In operation, shaft 132 rotates in the direction shown by arrow A in FIG.",
"18.Paddle assembly 140 includes a fixed paddle 141 that is fixed to shaft 132 such that fixed paddle 141 rotates with shaft 132.In one embodiment shaft 132 extends from side wall 110 to side wall 112.In the embodiment illustrated, fixed paddle 141 includes a plurality of arms 142 extending radially from shaft 132.In the example embodiment illustrated, fixed paddle 141 includes two sets 142a, 142b of arms 142.In this embodiment, in the position illustrated in FIG.",
"18, arms 142 of first set 142a extend from shaft 132 toward rear wall 116 and arms 142 of second set 142b extend from shaft 132 toward front wall 114.Of course these positions change as shaft 132 rotates.",
"The arms 142 of each set 142a, 142b are radially aligned and axially offset from each other.",
"The arms 142 of first set 142a are offset circumferentially by approximately 180 degrees from the arms 142 of second set 142b.",
"Other embodiments include one set of arms 142 or more than two sets of arms 142 extending from shaft 132.In other embodiments, arms 142 are not arranged in sets.",
"Further, arms 142 may extend radially or non-radially from shaft 132 in any manner desired.",
"Fixed paddle 141 may include a cross member 144 connected to each set 142a, 142b of arms 142.Cross members 144 may extend across all or a portion of the arms 142 of sets 142a, 142b.",
"Cross members 144 help arms 142 stir and mix toner in reservoir 104 as shaft 132 rotates.",
"A breaker bar 146 that is generally parallel to shaft 132 may be positioned radially outward from each cross member 144 and connected to the distal ends of arms 142.Breaker bars 146 are positioned in close proximity to inner surfaces of housing 102 without making contact with the inner surfaces of housing 102 to help break apart toner clumped near the inner surfaces of housing 102.Scrapers 148 may extend in a cantilevered manner from cross members 144.Scrapers 148 are formed from a flexible material such as a polyethylene terephthalate (PET) material, e.g., MYLAR® available from DuPont Teijin Films, Chester, Va., USA.",
"Scrapers 148 form an interference fit with the inner surfaces of top 106, front wall 114, rear wall 116 and bottom 117 to wipe toner from the inner surfaces of reservoir 104.Scrapers 148 also push toner into open portion 138a of channel 138 as shaft 132 rotates.",
"Specifically, as cross member 144 rotates past open portion 138a of channel 138, from bottom 117 to top 106, the interference fit between scraper 148 and the inner surface of front wall 114 causes scraper 148 to have an elastic response as the scraper 148 passes open portion 138a of channel 138 thereby flicking or pushing toner toward open portion 138a of channel 138.Additional scrapers may be provided on arms 142 at the axial ends of shaft 132 to wipe toner from the inner surfaces of side walls 110 and 112 as desired.",
"The arrangement of fixed paddle 141 shown in FIG.",
"18 is not intended to be limiting.",
"Fixed paddle 141 may include any suitable combination of projections, agitators, paddles, scrapers and linkages to agitate and move the toner stored in reservoir 104 as desired.",
"In the example embodiment illustrated, a permanent magnet 150 is rotatable with shaft 132 and detectable by a magnetic sensor as discussed in greater detail below.",
"In one embodiment, magnet 150 is connected to shaft 132 by fixed paddle 141.In the example embodiment illustrated, first set 142a of arms 142 includes a pair of axially spaced arms 143 positioned at one axial end of shaft 132.Arms 143 initially extend radially outward from shaft 132 and then bend opposite the operative rotational direction of shaft 132 at the distal ends of arms 143.A cross member 145 connects the distal ends of arms 143 and extends substantially parallel to shaft 132.In the example embodiment shown, magnet 150 is positioned in a finger 152 that extends outward from cross member 145 toward the inner surfaces of housing 102.Finger 152 extends in close proximity to but does not contact the inner surfaces of housing 102 so that magnet 150 is positioned in close proximity to the inner surfaces of housing 102.In one embodiment, fixed paddle 141 is composed of a non-magnetic material and magnet 150 is held by a friction fit in a cavity in finger 152.Magnet 150 may also be attached to finger 152 using an adhesive or fastener(s) so long as magnet 150 will not dislodge from finger 152 during operation of toner cartridge 100.Magnet 150 may be any suitable size and shape so as to be detectable by a magnetic sensor.",
"For example, magnet 150 may be a cube, a rectangular, octagonal or other form of prism, a sphere or cylinder, a thin sheet or an amorphous object.",
"In another embodiment, finger 152 is composed of a magnetic material such that the body of finger 152 forms the magnet 150.Magnet 150 may be composed of any suitable material such as steel, iron, nickel, etc.",
"While the example embodiment illustrated in FIG.",
"18 shows magnet 150 mounted on finger 152 of fixed paddle 141, magnet 150 may be positioned on any suitable linkage to shaft 132 such as a cross member, arm, projection, finger, agitator, paddle, etc.",
"of fixed paddle 141 or separate from fixed paddle 141.A sensing linkage 160 is mounted to shaft 132.Sensing linkage 160 rotates with shaft 132 but is movable to a certain degree independent of shaft 132.Sensing linkage 160 is free to rotate forward and backward on shaft 132 relative to fixed paddle 141 and to magnet 150 between a forward rotational stop and a rearward rotational stop.",
"Sensing linkage 160 includes a leading paddle member 162.In the embodiment illustrated, leading paddle member 162 is connected to shaft 132 by a pair of arms 164 positioned between and next to arms 143 of fixed paddle 141.Leading paddle member 162 includes a paddle surface 166 that engages the toner in reservoir 104 as discussed in greater detail below.",
"In the example embodiment illustrated, paddle surface 166 is substantially planar and normal to the direction of motion of sensing linkage 160 to allow paddle surface 166 to strike toner in reservoir 104.Sensing linkage 160 also includes one or more permanent magnets 168.Magnet(s) 168 are mounted on one or more magnet support(s) 170 of sensing linkage 160 that are positioned in close proximity to but do not contact the inner surfaces of housing 102.In this manner, magnet(s) 168 are positioned in close proximity to the inner surfaces of housing 102 but the inner surfaces of housing 102 do not impede the motion of sensing linkage 160.In the example embodiment illustrated, magnet support 170 is connected to shaft 132 by a pair of arms 172 positioned between and next to arms 143 of fixed paddle 141.Arms 172 are connected to arms 164.In this embodiment, in the position illustrated in FIG.",
"18, arms 172 extend from shaft 132 toward top 106.Of course the position of arms 172 changes as shaft 132 rotates.",
"In this embodiment, magnet support 170 is relatively thin in the radial dimension and extends circumferentially relative to shaft 132 between distal ends of arms 172 along the rotational path of magnet(s) 168 to minimize the drag on magnet support 170 as it passes through toner in reservoir 104.Along the operative rotational direction A of shaft 132, leading paddle member 162 is positioned ahead of magnet 150 which is positioned ahead of magnet(s) 168.In the example embodiment illustrated in FIGS.",
"6 and 18, two magnets 168a, 168b are mounted on magnet support 170; however, one magnet 168 (as shown in FIG.",
"5) or more than two magnets 168 may be used as desired.",
"Magnets 168a, 168b are substantially radially and axially aligned and spaced circumferentially from each other relative to shaft 132.Magnet(s) 168 are also substantially radially and axially aligned and spaced circumferentially from magnet 150 relative to shaft 132.In one embodiment, magnet support 170 is composed of a non-magnetic material and magnet(s) 168 are held by a friction fit in one or more cavities in magnetic support 170.Magnet(s) 168 may also be attached to magnet support 170 using an adhesive or fastener(s) so long as magnet(s) 168 will not dislodge from magnet support 170 during operation of toner cartridge 100.As discussed above, magnet(s) 168 may be any suitable size and shape and composed of any suitable material.",
"Magnet support 170 may take many different forms including an arm, projection, linkage, cross member, etc.",
"In some embodiments, sensing linkage 160 is biased in the operative rotational direction toward a forward rotational stop by one or more biasing members.",
"In the example embodiment illustrated, sensing linkage 160 is biased by an extension spring 176 connected at one end to an arm 172 of magnet support 170 and at the other end to arm 143 of fixed paddle 141.However, any suitable biasing member may be used as desired.",
"For example, in another embodiment, a torsion spring biases sensing linkage 160 in the operative rotational direction.",
"In another embodiment, a compression spring is connected at one end to an arm 164 of leading paddle member 162 and at the other end to arm 143 of fixed paddle 141.In another embodiment, sensing linkage 160 is free to fall by gravity toward its forward rotational stop as sensing linkage 160 rotates past the uppermost point of its rotational path.",
"In the example embodiment illustrated, the forward rotational stop includes a stop 178 that extends axially from the side of one or both of the arms 172 of magnet support 170.Stop 178 is arched and includes a leading surface 180 that contacts arm 143 of fixed paddle 141 to limit the motion of sensing linkage 160 relative to magnet 150 in the operative rotational direction.",
"In the example embodiment illustrated, the rearward rotational stop includes a trailing portion 182 of leading paddle member 162.Trailing portion 182 of leading paddle member 162 contacts a leading portion 184 of cross member 145 to limit the motion of sensing linkage 160 relative to magnet 150 in a direction opposite the operative rotational direction.",
"It will be appreciated that the forward and rearward rotational stops may take other forms as desired.",
"FIGS.",
"19A-19C depict the operation of magnets 150 and 168 at various toner levels with engagement member 190 removed from toner cartridge 100 for clarity.",
"FIGS.",
"19A-19C depict a clock face in dashed lines along the rotational path of shaft 132 and paddle assembly 140 in order to aid in the description of the operation of magnets 150 and 168.In one embodiment, the poles of magnets 150, 168 are directed toward the position of magnetic sensor 300 in order to facilitate the detection of magnets 150, 168 by magnetic sensor 300.Magnetic sensor 300 may be configured to detect one of a north pole and a south pole or both.",
"Where magnetic sensor 300 detects one of a north pole and a south pole, magnets 150, 168 may be positioned such that the detected pole is directed toward magnetic sensor 300.The motion of sensing linkage 160 and magnet(s) 168 relative to magnet 150 as shaft 132 rotates may be used to determine the amount of toner remaining in reservoir 104.As shaft 132 rotates, in the embodiment illustrated, fixed paddle 141 rotates with shaft 132 causing magnet 150 to pass magnetic sensor 300 at the same point during each revolution of shaft 132.On the other hand, the motion of sensing linkage 160, which is free to rotate relative to shaft 132 between its forward and rearward rotational stops, depends on the amount of toner 105 present in reservoir 104.As a result, magnet(s) 168 pass magnetic sensor 300 at different points during the revolution of shaft 132 depending on the toner level in reservoir 104.Accordingly, variation in the angular separation or offset between magnet 150, which serves as a reference point, and magnet(s) 168, which provide(s) sense points, as they pass magnetic sensor 300 may be used to determine the amount of toner remaining in reservoir 104.In an alternative embodiment, the linkage connecting magnet 150 to shaft 132, such as fixed paddle 141, is movable to a certain degree independent of shaft 132; however, it is preferred that magnet 150 passes magnetic sensor 190 in the same position relative to shaft 132 during each revolution of shaft 132 so that the position(s) of magnet(s) 168 may be consistently evaluated relative to the position of magnet 150.When toner reservoir 104 is relatively full, toner 105 present in reservoir 104 prevents sensing linkage 160 from advancing ahead of its rearward rotational stop.",
"Instead, sensing linkage 160 is pushed through its rotational path by fixed paddle 141 when shaft 132 rotates.",
"Accordingly, when toner reservoir 104 is relatively full, the amount of rotation of shaft 132 between magnet 150 passing magnetic sensor 300 and magnets 168a, 168b on sensing linkage 160 passing magnetic sensor 300 is at its maximum.",
"In other words, because sensing linkage 160 is at its rearward rotational stop, the angular separation from magnet 168a to magnet 150 when magnet 168a reaches magnetic sensor 300 and from magnet 168b to magnet 150 when magnet 168b reaches magnetic sensor 300 are at their maximum limits.",
"As the toner level in reservoir 104 decreases as shown in FIG.",
"19A, sensing linkage 160 is positioned forward from its rearward rotational stop as leading paddle member 162 rotates forward from the “12 o'clock” position.",
"Leading paddle member 162 advances ahead of the rearward rotational stop of sensing linkage 160 until paddle surface 166 contacts toner 105, which stops the advance of sensing linkage 160.In one embodiment where paddle assembly 140 includes scrapers 148, scrapers 148 are not present on cross member 144 connected to set 142b of arms 142 along the axial portion of shaft 132 spanned by leading paddle member 162 so that toner 105 is not disturbed immediately before paddle surface 166 contacts toner 105 after leading paddle member 162 rotates forward from the “12 o'clock” position.",
"At higher toner levels, leading paddle member 162 is stopped by toner 105 before magnets 168a, 168b reach magnetic sensor 300 such that the amount of rotation of shaft 132 between magnet 150 passing magnetic sensor 300 and magnets 168a, 168b passing magnetic sensor 300 remains at its maximum.",
"Sensing linkage 160 then remains generally stationary on top of (or slightly below) toner 105 until fixed paddle 141 catches up to leading paddle member 162 at the rearward rotational stop of sensing linkage 160 and fixed paddle 141 resumes pushing sensing linkage 160.With reference to FIG.",
"19B, as the toner level in reservoir 104 continues to decrease, at the point where leading paddle member 162 encounters toner 105 magnet 168a is detected by magnetic sensor 300.As a result, the amount of rotation of shaft 132 between magnet 150 passing magnetic sensor 300 and magnet 168a passing magnetic sensor 300 decreases.",
"Sensing linkage 160 then remains generally stationary on top of (or slightly below) toner 105 with magnet 168a in the sensing window of magnetic sensor 300 until fixed paddle 141 catches up to leading paddle member 162 and resumes pushing sensing linkage 160.As a result, leading paddle member 162 is stopped by toner 105 before magnet 168b reaches magnetic sensor 300 such that the amount of rotation of shaft 132 between magnet 150 passing magnetic sensor 300 and magnet 168b passing magnetic sensor 300 remains at its maximum.",
"With reference to FIG.",
"19C, as the toner level in reservoir 104 decreases even further, at the point where leading paddle member 162 encounters toner 105 magnet 168a has passed magnetic sensor 300 and magnet 168b is detected by magnetic sensor 300.As a result, the amount of rotation of shaft 132 between magnet 150 passing magnetic sensor 300 and magnets 168a and 168b passing magnetic sensor 300 are both decreased relative to their maximums.",
"As a result, it will be appreciated that the motion of magnets 168a, 168b relative to the motion of magnet 150 relates to the amount of toner 105 remaining in reservoir 104.In one embodiment, the initial amount of toner 105 in reservoir 104 is recorded in memory associated with processing circuitry 45 upon filling the toner cartridge 100.Accordingly, upon installing toner cartridge 100 in image forming device 22, controller 28 is able to determine the initial toner level in reservoir 104.Alternatively, each toner cartridge 100 for a particular type of image forming device 22 may be filled with the same amount of toner so that the initial toner level in reservoir 104 used by controller 28 may be a fixed value for all toner cartridges 100.Controller 28 then estimates the amount of toner remaining in reservoir 104 as toner is fed from toner cartridge to imaging unit 200 based on one or more operating conditions of image forming device 22 and/or toner cartridge 100.In one embodiment, the amount of toner 105 remaining in reservoir 104 is approximated based on an empirically derived feed rate of toner 105 from toner reservoir 104 when shaft 132 and auger 136 are rotated to deliver toner from toner cartridge 100 to imaging unit 200.In this embodiment, the estimate of the amount of toner 105 remaining is decreased based on the amount of rotation of the drive motor of image forming device 22 that provides rotational force to main interface gear 130 as determined by controller 28.In another embodiment, the estimate of the amount of toner 105 remaining is decreased based on the number of printable elements (pels) printed using the color of toner contained in toner cartridge 100 while toner cartridge 100 is installed in image forming device 22.In another embodiment, the estimate of the amount of toner 105 remaining is decreased based on the number of pages printed.",
"The amount of toner 105 remaining in reservoir 104 where the amount of rotation of shaft 132 that occurs between magnet 150 passing magnetic sensor 300 and each of the magnets 168 passing magnetic sensor 300 decreases may be determined empirically for a particular toner cartridge design.",
"As a result, each time the amount of rotation of shaft 132 between the detection of magnet 150 and the detection of one of the magnets 168 decreases from its maximum value, controller 28 may adjust the estimate of the amount of toner remaining in reservoir 104 based on the empirically determined amount of toner associated with the decrease in the amount of rotation of shaft 132 between magnet 150 passing magnetic sensor 300 and the respective magnet 168 passing magnetic sensor 300.For example, the toner level in reservoir 104 can be approximated by starting with the initial amount of toner 105 supplied in reservoir 104 and reducing the estimate of the amount of toner 105 remaining in reservoir 104 as toner 105 from reservoir 104 is consumed.",
"As discussed above, the estimate of the toner remaining may be decreased based on one or more conditions such as the number of rotations of the drive motor, main interface gear 130 or shaft 132, the number of pels printed, the number of pages printed, etc.",
"The estimated amount of toner remaining may be recalculated when the amount of rotation of shaft 132 as determined by controller 28 between magnet 150 passing magnetic sensor 300 and magnet 168a of sensing linkage 160 passing magnetic sensor 300 decreases from its maximum value.",
"In one embodiment, this includes replacing the estimate of the amount of toner remaining with the empirical value associated with the decrease in the amount of rotation of shaft 132 between magnet 150 passing magnetic sensor 300 and magnet 168a passing magnetic sensor 300.In another embodiment, the recalculation gives weight to both the present estimate of the amount of toner remaining and the empirical value associated with the decrease in the amount of rotation of shaft 132 between magnet 150 passing magnetic sensor 300 and magnet 168a passing magnetic sensor 300.The revised estimate of the amount of toner 105 remaining in reservoir 104 is then decreased as toner 105 from reservoir 104 is consumed using one or more conditions as discussed above.",
"The estimated amount of toner remaining may be recalculated again when the amount of rotation of shaft 132 as determined by controller 28 between magnet 150 passing magnetic sensor 300 and magnet 168b of sensing linkage 160 passing magnetic sensor 300 decreases from its maximum value.",
"As discussed above, this may include replacing the estimate of the amount of toner remaining or recalculating the estimate giving weight to both the present estimate of the amount of toner remaining and the empirical value associated with the decrease in the amount of rotation of shaft 132 between magnet 150 passing magnetic sensor 300 and magnet 168b passing magnetic sensor 300.This process may be repeated until reservoir 104 is out of toner 105.In one embodiment, the present estimate of the amount of toner 105 remaining in reservoir 104 is stored in memory associated with processing circuitry 45 of toner cartridge 100 so that the estimate travels with toner cartridge 100 in case toner cartridge 100 is removed from one image forming device 22 and installed in another image forming device 22.In this manner, the detection of the motion of magnets 168 relative to the motion of magnet 150 may serve as a correction for an estimate of the toner level in reservoir 104 based on other conditions such as an empirically derived feed rate of toner or the number of pels or pages printed as discussed above to account for variability and to correct potential error in such an estimate.",
"For example, an estimate of the toner level based on conditions such as an empirically derived feed rate of toner or the number of pels or pages printed may drift from the actual amount of toner 105 remaining in reservoir 104 over the life of toner cartridge 100, i.e., a difference between an estimate of the toner level and the actual toner level may tend to increase over the life of toner cartridge 100.Recalculating the estimate of the amount of toner 105 remaining based on the motion of magnet(s) 168 relative to the motion of magnet 150 helps correct this drift to provide a more accurate estimate of the amount of toner 105 remaining in reservoir 104.It will be appreciated that sensing linkage 160 may include any suitable number of magnets 168 desired depending on how many recalculations of the estimate of the amount of toner remaining are desired.",
"For example, sensing linkage 160 may include more than two magnets 168 spaced circumferentially from each other where recalculation of the estimated toner level is desired more frequently.",
"Alternatively, sensing linkage 160 may include a single magnet 168 where recalculation of the estimated toner level is desired only once, such as near the point where reservoir 104 is nearly empty.",
"The positions of magnets 168 relative to leading paddle member 162 may be selected in order to sense particular toner levels desired (e.g., 300 grams of toner remaining, 100 grams of toner remaining, etc.).",
"Further, where shaft 132 rotates at a constant speed during operation of toner cartridge 100, time differences between the detection of magnet 150 and magnet(s) 168 by magnetic sensor 300 may be used instead of the amount of rotation of shaft 132.In this embodiment, time differences greater than a predetermined threshold between the detection of magnet 150 and one or more of magnet(s) 168 may be ignored by the processor to account for shaft 132 stopping between print jobs.",
"Sensing linkage 160 is not limited to the shape and architecture shown in FIG.",
"18 and may take many shapes and sizes as desired.",
"The leading paddle member 162 having paddle surface 166 that engages the toner in reservoir 104 may also take many shapes and sizes as desired.",
"For example, in one embodiment, paddle surface 166 is angled with respect to the direction of motion of the sensing linkage 160.For example, paddle surface 166 may be V-shaped and have a front face that forms a concave portion of the V-shaped profile.",
"In another embodiment, paddle surface 166 includes a comb portion with a series of teeth that are spaced axially from each other to decrease the friction between the sensing linkage and the toner.",
"The surface area of paddle surface 166 may also vary as desired.",
"While the example embodiments illustrated in FIGS.",
"19A-19C show magnetic sensor 300 positioned at about “12 o'clock” with respect to paddle assembly 140, magnetic sensor 300 may be positioned elsewhere in the rotational path of paddle assembly 140 as desired.",
"For example, magnetic sensor 300 may be positioned at about “6 o'clock” with respect to paddle assembly 140 by changing the positions of magnet 150 and magnet(s) 168 relative to leading paddle member 162 by 180 degrees.",
"Although the example embodiments discussed above utilize a sensing linkage and a fixed linkage in the reservoir of the toner cartridge, it will be appreciated that a sensing linkage and a fixed linkage each having a magnet may be used to determine the toner level in any reservoir or sump storing toner in image forming device 22 such as, for example, a reservoir of the imaging unit or a storage area for waste toner.",
"Further, the configuration of permanent magnet(s) for toner level sensing is not limited to the example embodiment shown in FIGS.",
"18 and 19A-19C.",
"For example, in another embodiment, a paddle having a permanent magnet is mounted on drive shaft 132 and rotatable independent of drive shaft 132 as described in United States Published Patent Application No.",
"2014/0169806, which is assigned to the same assignee as the present application.",
"In this embodiment, the paddle is pushed through its rotational path by a driving member mounted on drive shaft 132 and free to fall ahead of the driving member subject to resistance by toner present in reservoir 104.Accordingly, it will be appreciated that the motion of the paddle (and the permanent magnet attached thereto) is dependent on the amount of toner in reservoir 104.FIG.",
"20 shows another example embodiment of a paddle assembly 5140.In this embodiment, the toner cartridge includes a paddle 5141 that is fixed to a shaft 5132 such that paddle 5141 rotates with shaft 5132.Paddle 5141 includes one or more permanent magnet(s) 5168 mounted on one or more magnet support(s) 5170.Magnet(s) 5168 are positioned in close proximity to but do not contact the inner surfaces of the housing of the toner cartridge as discussed above.",
"In the example embodiment illustrated, magnet support 5170 is connected to shaft 5132 by a pair of arms 5172.In the example embodiment illustrated, two magnets 5168 are mounted on magnet support 5170; however, more or fewer than two magnets 5168 may be used as desired.",
"Magnets 5168 may be oriented, shaped and mounted to shaft 5132 in various ways as discussed above.",
"In this embodiment, magnetic sensor 300 detects magnets 5168 as shaft 5132 rotates.",
"In this manner, magnetic sensor 300 may be used to detect the presence of the toner cartridge in the image forming device and to confirm that shaft 5132 is rotating properly thereby eliminating the need for additional sensors to perform these functions.",
"Magnetic sensor 300 may also be used to determine the speed of rotation of shaft 5132 by measuring the time difference between the detection of the first magnet and the detection of the second magnet as shaft 5132 rotates.",
"The arrangement of magnet(s) 5168 may communicate additional characteristics of toner cartridge 100 as desired.",
"For example, the number of magnets 5168 attached to shaft 5132 may indicate a characteristic of toner cartridge 100.By way of example, one magnet 5186 may indicate a toner cartridge containing black toner, two magnets 5168 may indicate a toner cartridge containing cyan toner, three magnets 5168 may indicate a toner cartridge containing yellow toner and four magnets 5168 may indicate a toner cartridge containing magenta toner.",
"Further, the spacing between magnets 5168 may indicate a characteristic of toner cartridge 100.For example, a first spacing between magnets 5168 (e.g., 45 degrees) may indicate a low capacity toner cartridge and a second spacing between magnets 5168 (e.g., 90 degrees) may indicate a high capacity toner cartridge.",
"Various other aspects of the arrangement of magnet(s) 5168 may communicate characteristics of toner cartridge 100 and various other characteristics may be encoded in magnet(s) 5168 as desired.",
"The foregoing description illustrates various aspects of the present disclosure.",
"It is not intended to be exhaustive.",
"Rather, it is chosen to illustrate the principles of the present disclosure and its practical application to enable one of ordinary skill in the art to utilize the present disclosure, including its various modifications that naturally follow.",
"All modifications and variations are contemplated within the scope of the present disclosure as determined by the appended claims.",
"Relatively apparent modifications include combining one or more features of various embodiments with features of other embodiments."
]
] |
Patent_15871446
|
[
[
"Welding Assembly and Method",
"A welding assembly including a current generator, a first electrode electrically coupled to the current generator, the first electrode including a first engagement surface, a second electrode electrically coupled to the current generator, the second electrode including a second engagement surface, a width-determining fixture positioned between the first electrode and the second electrode to define a welding volume having a width, and an electrically nonconductive material positioned to electrically insulate at least one of the first electrode and the second electrode from an electrical conductor outside the width."
],
[
"1.A method for welding comprising: assembling a workpiece comprising a first member and a second member, wherein said first member comprises a plurality of strands; positioning a first electrode proximate said first member; positioning a second electrode proximate said second member; clamping said workpiece between said first electrode and said second electrode; positioning said workpiece within a welding volume of a width-determining fixture, said welding volume having a width, wherein a portion of said second member extends outside of said width; positioning an electrically nonconductive material between said second electrode and said portion of said second member; and passing a welding current between said first electrode and said second electrode.",
"2.The method of claim 1 further comprising providing a current generator, wherein said first electrode and said second electrode are electrically coupled with said current generator.",
"3.The method of claim 1 wherein said assembling said workpiece further comprises positioning an auxiliary member at least partially around said first member.",
"4.The method of claim 1 wherein said workpiece comprises aluminum or aluminum alloy.",
"5.The method of claim 1 wherein said width-determining fixture is electrically isolated from said first electrode.",
"6.The method of claim 1 wherein said electrically nonconductive material comprises a ceramic material.",
"7.The method of claim 1 wherein said positioning said electrically nonconductive material comprises securing said electrically nonconductive material to said second electrode with a mechanical fastener.",
"8.The method of claim 1 wherein said second electrode defines a first recess and a second recess, and wherein said positioning said electrically nonconductive material comprises positioning a first portion of said electrically nonconductive material in said first recess and a second portion of said electrically nonconductive material in said second recess.",
"9.The method of claim 8 wherein said width-determining fixture comprises a first side stop laterally opposed from a second side stop.",
"10.The method of claim 9 wherein said first side stop is axially aligned with said first recess and said second side stop is axially aligned with said second recess.",
"11.The method of claim 9 wherein said first side stop includes a first interior surface and said second side stop includes a second interior surface, wherein said first portion includes a first inner edge and said second portion includes a second inner edge, wherein said first inner edge is axially aligned with, or laterally inward of, said first interior surface, and wherein said second inner edge is axially aligned with, or laterally inward of, said second interior surface.",
"12.The method of claim 8 wherein said first portion has a first portion engagement surface and said second portion has a second portion engagement surface, and wherein said first portion engagement surface and said second portion engagement surface are coplanar with an engagement surface of said second electrode.",
"13.The method of claim 1 wherein an axial position of said width-determining fixture is adjustable.",
"14.A method for welding comprising: assembling a workpiece comprising a first member and a second member, wherein said first member comprises a plurality of strands; positioning a first electrode proximate said first member; positioning a second electrode proximate said second member; positioning said workpiece within a welding volume defined by said first electrode, said second electrode, a first side stop and a second side stop, said welding volume having a width between said first side stop and said second side stop, wherein a portion of said second member extends outside of said width; clamping said workpiece between said first electrode and said second electrode; positioning an electrically nonconductive material between said second electrode and said portion of said second member; and passing a welding current between said first electrode and said second electrode.",
"15.The method of claim 14 wherein said first side stop and said second side stop are configured to contain hot or molten metal within said width without inhibiting clamping movement of said first electrode relative to said second electrode.",
"16.The method of claim 14 wherein said assembling said workpiece further comprises positioning an auxiliary member at least partially around said first member.",
"17.The method of claim 14 wherein said workpiece comprises aluminum or aluminum alloy.",
"18.The method of claim 14 wherein said width-determining fixture is electrically isolated from said first electrode.",
"19.The method of claim 14 wherein said electrically nonconductive material comprises a ceramic material.",
"20.The method of claim 14 wherein said positioning said electrically nonconductive material comprises securing said electrically nonconductive material to said second electrode with a mechanical fastener."
],
[
"<SOH> BACKGROUND <EOH>Stranded metals and metal alloys (e.g., stranded cables and wires) find a wide variety of applications.",
"Particularly, stranded aluminum and aluminum alloys find a wide variety of applications due to their favorable combination of electrical conductivity properties and mechanical properties, including strength-to-weight ratio, low temperature (cryogenic) properties, corrosion resistance and notch toughness.",
"The challenge with stranded aluminum and aluminum alloys is joining (by welding) the stranded cables or wires to one another and/or to a connector.",
"During a welding operation (e.g., resistive welding), individual strands of the cable or wire may not consistently liquefy to form a solid welded workpiece.",
"For example, strands located proximate the periphery of the cable or wire may liquefy; while strands located proximate the center of the cable or wire may not liquefy sufficiently to form a suitably solid weld.",
"In order to sufficiently liquefy strands proximate the center of the cable or wire, the strands located proximate the periphery of the cable or wire may tend to burn and the whole welded assembly may tend to stick to the weld electrodes.",
"Accordingly, those skilled in the art continue with research and development efforts in the field of welding stranded metals and metal alloys."
],
[
"<SOH> SUMMARY <EOH>In one embodiment, the disclosed welding assembly may include a current generator, a first electrode electrically coupled to the current generator, the first electrode including a first engagement surface, a second electrode electrically coupled to the current generator, the second electrode including a second engagement surface, a width-determining fixture positioned between the first electrode and the second electrode to define a welding volume having a width, and an electrically nonconductive material positioned to electrically insulate at least one of the first electrode and the second electrode from an electrical conductor outside the width.",
"In another embodiment, the disclosed welding assembly may include a current generator, a first electrode electrically coupled to the current generator, the first electrode including a first engagement surface, a second electrode electrically coupled to the current generator, the second electrode including a second engagement surface, a width-determining fixture including a first side stop laterally opposed from a second side stop, the first and second side stops defining a welding volume between the first and second electrodes, the welding volume having a width, a workpiece at least partially positioned in the welding volume and clamped between the first and second electrodes, the workpiece including at least a first member and a second member, wherein the second member is supported on the second electrode, and wherein a portion of the second member protrudes outside of the width, and an electrically nonconductive material positioned to electrically insulate the second electrode from the portion of the second member that protrudes outside of the width.",
"In another embodiment, also disclosed is a method for welding.",
"The method may include the steps of (1) providing a current generator; (2) assembling a workpiece including a first member and a second member, wherein the second member includes strands; (3) positioning a first electrode proximate (at or near) the first member, the first electrode being electrically coupled to the current generator; (4) positioning a second electrode proximate (at or near) the second member, the second electrode being electrically coupled to the current generator; (5) clamping the workpiece between the first electrode and the second electrode; (6) confining the clamped workpiece within a welding volume of a width-determining fixture, the welding volume having a width, wherein a portion of the second member extends outside of the width; (7) electrically isolating the second electrode from the portion of the second member outside of the width; and (8) passing a welding current between the electrodes.",
"Other embodiments of the disclosed welding assembly and method will become apparent from the following detailed description, the accompanying drawings and the appended claims."
],
[
"PRIORITY This application is a divisional of U.S. Ser.",
"No.",
"14/225,641 filed on Mar.",
"26, 2014, which is a continuation-in-part of U.S. Ser.",
"No.",
"14/140,362 filed on Dec. 24, 2013.The entire contents of U.S. Ser.",
"Nos.",
"14/225,641 and 14/140,362 are incorporated herein by reference.",
"FIELD The present disclosure is generally related to welding apparatus, systems and methods and, more particularly, to resistance welding assemblies for welding metal and metal alloy stranded cables or wires.",
"BACKGROUND Stranded metals and metal alloys (e.g., stranded cables and wires) find a wide variety of applications.",
"Particularly, stranded aluminum and aluminum alloys find a wide variety of applications due to their favorable combination of electrical conductivity properties and mechanical properties, including strength-to-weight ratio, low temperature (cryogenic) properties, corrosion resistance and notch toughness.",
"The challenge with stranded aluminum and aluminum alloys is joining (by welding) the stranded cables or wires to one another and/or to a connector.",
"During a welding operation (e.g., resistive welding), individual strands of the cable or wire may not consistently liquefy to form a solid welded workpiece.",
"For example, strands located proximate the periphery of the cable or wire may liquefy; while strands located proximate the center of the cable or wire may not liquefy sufficiently to form a suitably solid weld.",
"In order to sufficiently liquefy strands proximate the center of the cable or wire, the strands located proximate the periphery of the cable or wire may tend to burn and the whole welded assembly may tend to stick to the weld electrodes.",
"Accordingly, those skilled in the art continue with research and development efforts in the field of welding stranded metals and metal alloys.",
"SUMMARY In one embodiment, the disclosed welding assembly may include a current generator, a first electrode electrically coupled to the current generator, the first electrode including a first engagement surface, a second electrode electrically coupled to the current generator, the second electrode including a second engagement surface, a width-determining fixture positioned between the first electrode and the second electrode to define a welding volume having a width, and an electrically nonconductive material positioned to electrically insulate at least one of the first electrode and the second electrode from an electrical conductor outside the width.",
"In another embodiment, the disclosed welding assembly may include a current generator, a first electrode electrically coupled to the current generator, the first electrode including a first engagement surface, a second electrode electrically coupled to the current generator, the second electrode including a second engagement surface, a width-determining fixture including a first side stop laterally opposed from a second side stop, the first and second side stops defining a welding volume between the first and second electrodes, the welding volume having a width, a workpiece at least partially positioned in the welding volume and clamped between the first and second electrodes, the workpiece including at least a first member and a second member, wherein the second member is supported on the second electrode, and wherein a portion of the second member protrudes outside of the width, and an electrically nonconductive material positioned to electrically insulate the second electrode from the portion of the second member that protrudes outside of the width.",
"In another embodiment, also disclosed is a method for welding.",
"The method may include the steps of (1) providing a current generator; (2) assembling a workpiece including a first member and a second member, wherein the second member includes strands; (3) positioning a first electrode proximate (at or near) the first member, the first electrode being electrically coupled to the current generator; (4) positioning a second electrode proximate (at or near) the second member, the second electrode being electrically coupled to the current generator; (5) clamping the workpiece between the first electrode and the second electrode; (6) confining the clamped workpiece within a welding volume of a width-determining fixture, the welding volume having a width, wherein a portion of the second member extends outside of the width; (7) electrically isolating the second electrode from the portion of the second member outside of the width; and (8) passing a welding current between the electrodes.",
"Other embodiments of the disclosed welding assembly and method will become apparent from the following detailed description, the accompanying drawings and the appended claims.",
"BRIEF DESCRIPTION OF THE DRAWINGS FIG.",
"1 is a schematic illustration of a first embodiment of the disclosed welding assembly; FIG.",
"2 is a side elevational view of a second embodiment of the disclosed welding assembly; FIGS.",
"3, 4 and 5 are side elevational views, in section, of a workpiece being welded by the welding assembly of FIG.",
"2 in accordance with one implementation of the second embodiment; FIG.",
"6 is a side elevational view, in section, of a workpiece being welded by the welding assembly of FIG.",
"2 in accordance with another implementation of the second embodiment; FIG.",
"7 is a side elevational view, in section, of a workpiece being welded by the welding assembly of FIG.",
"2 in accordance with yet another implementation of the second embodiment; FIGS.",
"8, 9 and 10 are side elevational views, in section, of a third embodiment of the disclosed welding assembly, shown welding a workpiece; FIG.",
"11 is a side elevational view, in section, of a workpiece being welded by the welding assembly of FIG.",
"8 in accordance with another implementation of the third embodiment; FIG.",
"12 is a schematic illustration of a fourth embodiment of the disclosed welding assembly; FIG.",
"13 is a side elevational view of a fifth embodiment of the disclosed welding assembly; FIGS.",
"14, 15 and 16 are side elevational views, in section, of a workpiece being welded by the welding assembly of FIG.",
"13 in accordance with one implementation of the fifth embodiment; FIG.",
"17 is a side elevational view, in section, of a workpiece being welded by the welding assembly of FIG.",
"13 in accordance with another implementation of the fifth embodiment; FIG.",
"18 is a side elevational view, in section, of a sixth embodiment of the disclosed welding assembly; and FIG.",
"19 is one embodiment of the disclosed method for welding metal and metal alloy stranded cable.",
"DETAILED DESCRIPTION The following detailed description refers to the accompanying drawings, which illustrate specific embodiments of the disclosure.",
"Other embodiments having different structures and operations do not depart from the scope of the present disclosure.",
"Like reference numerals may refer to the same element or component in the different drawings.",
"Referring to FIGS.",
"1, a first embodiment of the disclosed welding assembly, generally designated 10, may include a first (e.g., upper) electrode 12, a second (e.g., lower) electrode 14 and a current generator 16.The first electrode 12 and the second electrode 14 may be located at axially opposite positions relative to the longitudinal axis A of the welding assembly 10.The first electrode 12 may be electrically coupled to the current generator 16 and may include and a first engagement surface 18.The second electrode 14 may be electrically coupled to the current generator 16 and may include a second engagement surface 22.The first engagement surface 18 and the second engagement surface 22 may include size and shape suitable to engage (e.g., contact) at least a portion of an exterior surface of a workpiece 24 (FIG.",
"2).",
"For example, the first engagement surface 18 of the first electrode 12 and the second engagement surface 22 of the second electrode 14 may be configured to solidify a plurality of metal or metal alloy strands (e.g., a metal or metal alloy stranded cable or wire) and weld the solidified strands to a metal or metal alloy connector terminal.",
"The current generator 16 may be any source of electrical energy capable of supplying an electric current to the first electrode 12 and the second electrode 14 to achieve resistive heating in the workpiece 24 (FIG.",
"2).",
"The current generator 16 may include appropriate circuitry for supplying electric current to the first electrode 12 and the second electrode 14, as well as controlling the magnitude and timing of the electric current being supplied to the first electrode 12 and the second electrode 14.For example, the current generator 16 may be a direct current system, an alternating current system or a stored energy current system.",
"In an example construction, the current generator 16 may include a first terminal 112 and a second terminal 114, the second terminal 114 having a polarity opposite of a polarity of the first terminal 112.The first electrode 12 may be electrically coupled to the first terminal 112.The second electrode 14 may be electrically coupled to the second terminal 114.At this point, those skilled in the art will appreciate that the current generator 16 may be a commercially available resistance welding machine or a component taken from a commercially available resistance welding machine.",
"The first electrode 12 and the second electrode 14 may be formed from any electrically conductive material.",
"The first electrode 12 and the second electrode 14 may be formed from a material having a thermal conductivity (e.g., either relatively high thermal conductivity or relatively low thermal conductivity) selected based upon the type weld desired, the material (e.g., aluminum or aluminum alloy) of the workpiece 24, and/or the method for welding being performed by the first electrode 12 and the second electrode 14.For example, the first electrode 12 and/or the second electrodes 14 may be formed from copper or copper alloys (e.g., Resistance Welder Manufacturers Association (“RWMA”) copper alloys Classes 1-5 or 20) when relatively high thermal conductivity is desired.",
"Alternatively, the first electrode 12 and/or the second electrodes 14 may be formed from refractory materials, tungsten, tungsten/copper alloys or molybdenum (e.g., RWMA Classes 10-14) when relatively low thermal conductivity is desired.",
"In general, a more conducting electrode material may be used when a steeper thermal gradient is desired between the first electrode 12 and the second electrode 14 and a less conducting electrode material may be used when a less steep temperature gradient is desired between the first electrode 12 and the second electrode 14.The first electrode 12 and/or the second electrode 14 may be cooled.",
"For example, the first electrode 12 may include one or more first fluid channels 30 defined therein or connected thereto.",
"The second electrode 14 may include one or more second fluid channels 32 defined therein or connected thereto.",
"A cooling fluid (e.g., water or ethyl glycol) may flow through the first fluid channels 30 and/or the second fluid channels 32 to remove heat from the first electrode 12 and the second electrode 14, as well as from the workpiece 24 (FIG.",
"2) supported by (e.g., positioned between) the first electrode 12 and the second electrode 14.Referring to FIGS.",
"2 and 3, in a second embodiment, the first electrode 12 may be mounted to a first support structure 44 and the second electrode 14 may be mounted to a second support structure 46.For example, the first support structure 44 and/or the second support structure 46 may be an arm or a tong.",
"The first support structure 44 and the second support structure 46 may be capable of approximating the first electrode 12 and a second electrode 14 to clamp the workpiece 24 between the first electrode 12 and a second electrode 14.In an example implementation, the first electrode 12 and the second electrode 14 may exert a clamping force (e.g., a welding force) to the workpiece 24 positioned there between.",
"For example, the first electrode 12 and the second electrode 14 may exert a clamping force of approximately between 50 pounds and 100 pounds.",
"In one example, the first support structure 44 may be moveable such that the first electrode 12 exerts a welding force F1 to the workpiece 24 and the second support structure 44 may be movable such that the second electrode 14 exerts an opposing welding force F2 to the workpiece 24, as illustrated in FIG.",
"3.As another example, the first support structure 44 may be a movable such that the first electrode 12 exerts a welding force F1 to the workpiece 24 and the second support structure 46 may be stationary (e.g., an anvil).",
"In an example construction, the first support structure 44 may be connected to a first drive element 48 and/or the second support structure 46 may be connected to a second drive element 50.The first drive element 48 and/or the second drive element 50 may be any mechanism suitable to move (e.g., axially translate) the first support structure 44 and/or the second support structure 44 to approximate the first electrode 12 and the second electrode 14 and exert the clamping force to the workpiece 24.For example, the first drive element 48 and/or the second drive element 50 may be a hydraulic, pneumatic, servo-drive or mechanical drive mechanism (e.g., press).",
"A width-determining fixture 36 may be positioned between the first electrode 12 and the second electrode 14 to define a welding volume 56 around at least a portion of the workpiece 24.The width-determining fixture 36 may at least partially enclose the workpiece 24 to prevent the flow (e.g., outward flow) of molten or hot metal 72 (FIG.",
"4) during resistance welding of the workpiece 24.The width-determining fixture 36 may be capable of adjusting an axial position (e.g., parallel to the direction of the clamping force) with respect to the first electrode 12 and/or the second electrode 14 to ensure sides of the welding volume 56 between the first electrode 12 and the second electrode 14 are completely enclosed.",
"The position of the width-determining fixture 36 with respect to the workpiece 24 may define the width W of the welded workpiece 58 (FIG.",
"5).",
"The side stops (width-determining fixtures) may also be moved out sideways when not welding and moved in when welding, instead of being moved up and down.",
"Such in-and-out movements may also occur through tapered fitting tooling.",
"In one expression, the width-determining fixture 36 may be connected to or otherwise operably engaged with the first support structure 44 and/or the first drive mechanism 48 to approximate the second electrode 14 in response to the welding force F1 (FIG.",
"3).",
"In another expression, the width-determining fixture 36 may be connected to or otherwise operably engaged with the second support structure 46 and/or the second drive mechanism 50 to approximate the first electrode 12 in response to the welding force F2 (FIG.",
"3), such as illustrated in FIG.",
"8.Referring still to FIGS.",
"2 and 3, the workpiece 24 may include one or more members 38, 40 intended to be joined by resistive welding.",
"While two members 38, 40 of the workpiece 24 are shown in FIGS.",
"2 and 3, those skilled in the art will appreciate that additional members may be included in the workpiece 24 without departing from the scope of the present disclosure.",
"The members 38, 40 of the workpiece 24 may be formed from any material capable of being joined by resistive heating.",
"In one realization, the members 38, 40 of the workpiece 24 may be formed from any metals or metal alloys capable of being joined by resistive heating.",
"For example, members 38, 40 of the workpiece 24 may be formed from aluminum or aluminum alloys.",
"The member (e.g., a first member) 38 may include at least two strands 42.Each strand 42 may be formed from metal or metal alloy (e.g., aluminum or aluminum alloy).",
"For example, the member 38 may be formed from a plurality of elongated strands 42 bundled together and having a generally circular cross-sectional shape.",
"As a general, non-limiting example, the member 38 may be a metal wire, cable or rope.",
"As a specific, non-limiting example, the member 38 may be a 25 mm2, 40 mm2 or 50 mm2 stranded wire cable.",
"The member 40 (e.g., a second member) may be a terminal to which the member 38 (e.g., a stranded cable or wire) is joined by welding.",
"For example, the member 40 may be a connector terminal suitable for connection (e.g., mechanical and/or electrical connection) to another object (e.g., an aircraft frame, a vehicle frame or an electrical junction).",
"The first engagement surface 18 of the first electrode 12 may be formed into an arcuate (e.g., curved) surface defining a concave recess 20 configured to make flush contact with at least a portion of the exterior surface 26 of the member 38.For example, the first engagement surface 18 may be machined as a generally semicircular shape or an inverted U shape defining a generally semicircular recess 20 configured to make flush contact with at least a portion of the exterior surface 26 (e.g., a semi-circular portion of the circumferential exterior surface) of the member 38 (e.g., a stranded cable or wire).",
"The second engagement surface 22 may be formed into a substantially planar surface configured to make flush contact with at least a portion of the exterior surface 34 of the member 40.For example, the second engagement surface 22 may be machined as a substantially flat shape configured to make flush contact with a substantially planar portion of the exterior surface 34 (e.g., a portion of a bottom surface) of the member 40 (e.g., a connector terminal).",
"Referring to FIG.",
"4, the curved first engagement surface 18 of the first electrode 12 may create a larger contact surface area for electrical current to pass from the first electrode 12 to the member 38 (e.g., to the plurality of strands 42) as compared to a planar engagement surface.",
"This larger surface area may decrease the current density at a surface of the workpiece 24 (e.g., between the curved contact surfaces 18 and 26 of the first electrode 12 and the member 38) and increase the current density proximate a center of the workpiece 24.For example, the curved first engagement surface 18 may direct (e.g., focus) the current from the first electrode 12 toward the center of the member 38, as illustrated by directional arrows 60.The current density at an opposing surface of the workpiece 24 (e.g., between planar contact surfaces 22 and 34 of the second electrode 14 and the member 40) may be higher or lower.",
"For example, the planar second engagement surface 20 may direct the current from the second electrode 14 through the member 40 and through the member 38, as illustrated by directional arrows 62.Thus, when a voltage is applied between the first electrode 12 and the second electrode 14 (e.g., from the current generator 16), a current flows between the first engagement surface 18 and the second engagement surface 22 through the core of the workpiece 24 along the path indicated by arrows 60 and 62.By decreasing the current density at the exterior surface 26 of the member 38 (e.g., at the exterior surfaces of the strands 42) and increasing the current density toward the center of the member 38, the heat generated proximate (e.g., at or near) the center of the member 38 may become greater than the heat generated at any location on the exterior surface 26 of the member 38 tending to more consistently melt the plurality of strands 42 throughout the member 38.Those skilled in the art will appreciate that the first engagement surface 18 and the recess 20 may be provided in various sizes (e.g., length and width), shapes (e.g., curve radius) and configurations, for example, depending upon the diameter of the member 38, the number of strands 42 and the length of the member 38 (e.g., length of a portion of the plurality of strands 42) that is to be welded (e.g., solidified).",
"Referring to FIGS.",
"3 and 4, the width-determining fixture 36 may be positioned adjacent to the first electrode 12.In one construction, the width-determining fixture 36 may include a first (e.g., left) side stop 52 and a second (e.g., right) side stop 54.The first side stop 52 may be positioned adjacent to (e.g., to the left of) the first electrode 12 and the second side stop 54 may be positioned adjacent to (e.g., to the right of) the first electrode 12 such that the first side stop 52 and the second side stop 54 are positioned to the sides (e.g., the left side and the right side) of the member 38 when the clamping force is exerted to the workpiece 24.The first side stop 52 and the second side stop 54 may formed from a material having an electrical resistance greater than that of the first electrode 12 and the second electrode 14.For example, the first side stop 52 and the second side stop 54 may be formed from a high resistance metal.",
"As another example, the first side stop 52 and the second side stop 54 may be formed from an electrically insulating or non-conductive material, such as ceramic.",
"In general, the material of the first side stop 52 and the second side stop 54 may be selected to ensure the electrical current is directed through the workpiece 24, such as indicated by directional arrows 60 and 62 (FIG.",
"4).",
"In an example embodiment, the first side stop 52 may be housed within a first sleeve 64 and the second side stop 54 may be housed within a second sleeve 66.The first sleeve 64 and the second sleeve 66 may be connected to the first support structure 44 such that the first side stop 52 and the second side stop 54 define the welding volume 56 around (e.g., to the sides of) the member 38 as the first electrode 12 approximates the second electrode 14 in response to the welding force F1 (FIG.",
"3).",
"When the first electrode 12 approaches the second electrode 14 and exerts the clamping force to the member 38 therebetween, the first side stop 52 and the second side stop 54 may engage the member 40 (e.g., connector terminal) adjacent to the member 38 (e.g., stranded cable).",
"As such, the welding volume 56 may be defined by the first engagement surface 22 of the first electrode 12, an interior surface 68 of the first side stop 52, an interior surface 70 of the second side stop 54 and a portion of the exterior surface 34 (e.g., a top surface) of the member 40 positioned between the first side stop 52 and the second side stop 54.The position of the first side stop 52 and the second side stop 54 with respect to the first sleeve 64 and the second sleeve 66, respectively, may automatically adjust an axial position (e.g., parallel to the direction of the welding force F1) to constantly engage the exterior surface 34 of the member 40 and contain the flow of molten metal 72 within the welding volume 56, as illustrated in FIG.",
"4.The first side stop 52 may be outwardly biased from within the first sleeve 64 and the second side stop 54 may be outwardly biased from within the second sleeve 66.For example, the first side stop 52 may be connected within the first sleeve 64 by a first biasing element 74 (e.g., a spring) and the second side stop 54 may be connected within the second sleeve 66 by a second biasing element 76 (e.g., a spring).",
"A bottom surface 84 (FIG.",
"2) of the first side stop 52 and the second side stop 54 may be substantially planar to make flush contact with the substantially planar exterior surface 34 of the member 40.As the first support structure 48 approximates the second support structure 46 (e.g., via the first drive element 48), the first electrode 12 may move toward and exert a welding force F1 (e.g., clamping force) upon the member 38 and the first side stop 52 and the second side stop 54 may simultaneously move toward and engage the member 40.As the first support structure 48 further approximates the second support structure 46, the welding force F1 exerted to the member 38 by the first electrode 12 and the second electrode 14 may increase as the first electrode 12 approximates the second electrode 14; however, the first side stop 52 and the second side stop 54 may be at least partially pushed into the first sleeve 64 and the second sleeve 66, respectively, to prevent damage to the member 40 while maintaining flush contact with the member 40 and containing the outward flow of the molten metal 72 (FIG.",
"4).",
"Referring to FIG.",
"5, the welded workpiece 58 may have a shape substantially matching the shape of the welding volume 56.For example, welded workpiece 58 may include a curved upper end 78 substantially matching the curved first engagement surface 18 of the first electrode 12, a planar first (e.g., left) side 80 substantially matching the planar first interior surface 68 of the first side stop 52 and a planar second (e.g., right) side 82 substantially matching the planar second interior surface 70 of the second side stop 54.The welded workpiece 58 may include a solidified portion of the plurality of strands 42 of the member 38 (e.g., a stranded cable) joined to the member 40 (e.g., a connector terminal) through resistive welding.",
"Referring to FIGS.",
"6 and 7, the workpiece 24 may also include an auxiliary member 84.The auxiliary member 84 may have a size and shape sufficient to at least partially surround the workpiece 24.The auxiliary member 84 may be formed from a material having the same or similar chemistry as the members 38, 40, or from a material that is compatible with the material from which the members 38, 40 are formed.",
"For example, when the members 38, 40 are formed from aluminum alloys, the auxiliary member 84 may be formed from an aluminum alloy or appropriate aluminum alloy filler metal.",
"As illustrated in FIG.",
"6, in one implementation, the auxiliary member 84 may be a generally semi-circular band 86 having an arcuate (e.g.",
"curved) body (e.g., U-shaped) of sufficient size and shape to at least partially surround (e.g., cover) the exterior surface 26 of the member 38 (e.g., a stranded cable) and ends that extend to engage the exterior surface 34 of the member 40 (e.g., a connector terminal).",
"As illustrated in FIG.",
"7, in another implementation, the auxiliary member 84 may be a generally circular band 88 having a continuous body of sufficient size and shape to completely surround (e.g., cover) the exterior surface 26 of the member 38 (e.g., a stranded cable).",
"The curved first engagement surface 18 of the first electrode 12 may include a sufficient shaped and size to contact at least a portion of an exterior surface 26 the auxiliary member 84 and focus electrical current toward the center of the workpiece 24 (e.g., the member 38) in a similar manner as described above and illustrated in FIG.",
"4.The material of the auxiliary member 84 may melt during resistance welding and combine with the molten metal 72 (FIG.",
"4) within the welding volume 56 to further solidify the plurality of strands 42 of the member 38 into a solid welded workpiece 58, such as illustrated in FIG.",
"5.The first side stop 52 and the second side stop 54 may be positioned adjacent to (e.g., to the sides of) the auxiliary member 84 when the first electrode 12 exerts welding force F1 upon the workpiece 24.Referring to FIG.",
"8, the workpiece 24′ may include a member 38′ intended to be solidified by resistive welding.",
"The member 38′ may include a plurality of strands 42′.",
"Each strand 42′ may be formed from metal or metal alloy (e.g., aluminum or aluminum alloy).",
"For example, the member 38′ may be formed from a plurality of elongated strands 42′ bundled together and having a generally circular cross-sectional shape.",
"As a general, non-limiting example, the member 38′ may be a metal wire, cable or rope.",
"As a specific, non-limiting example, the member 38′ may be a 25 mm2, 40 mm2 or 50 mm2 stranded wire cable.",
"While four strands 42′ of the member 38′ of the workpiece 24 are shown in FIGS.",
"8, 9, 10 and 11, those skilled in the art will appreciate that additional strands 42′ of the member 38′ may be included in the workpiece 24′ without departing from the scope of the present disclosure.",
"In accordance with a third embodiment, the second engagement surface 22′ of the second electrode 14′ may be formed into an arcuate (e.g.",
"curved) surface defining a concave recess 28.For example, the second engagement surface 22′ may be machined as a generally semicircular shape defining a generally semicircular recess 28.The first engagement surface 18 and the second engagement surface 22′ may include size and shape suitable to engage (e.g., contact) at least a portion of an exterior surface 26′ of the workpiece 24′ (e.g., an exterior surface of the plurality of strands 42′ of the member 38′).",
"For example, the first engagement surface 18 of the first electrode 12 and the second engagement surface 22′ of the second electrode 14′ may be configured to solidify the plurality of metal strands 42′ of the member 38′ (e.g., a stranded cable).",
"Referring to FIG.",
"9, the curved first engagement surface 18 of the first electrode 12 and the curved second engagement surface 22′ of the second electrode 14′ may create a larger contact surface area for electrical current to pass from the first electrode 12 and the second electrode 14′ to the member 38′ as compared to a planar engagement surface.",
"This larger surface area may decrease the current density at a surface of the workpiece 24′ (e.g., between the curved contact surfaces 18, 22′ and 26′ of the first electrode 12 and the second electrode 14′ and the member 38′, respectively) and increase the current density at the center of the workpiece 24′.",
"For example, the curved first engagement surface 18 and the curved second engagement surface 22′ may direct (e.g., focus) the current from the first electrode 12 and the second electrode 14′ toward the center of the member 38′, as illustrated by directional arrows 60′ and 62′.",
"The width-determining fixture 36 may be positioned adjacent to the first electrode 12 and the second electrode 14′.",
"In an example embodiment, the width-adjusting fixture 36 may include a first (e.g., left) side stop 52 and an opposing second (e.g., right) side stop 54 adjacent the first electrode 12 and a third (e.g., left) side stop 94 and an opposing fourth (e.g., right) side stop 96 adjacent the second electrode 14′.",
"The first side stop 52, the second side stop 54, the third side stop 94 and the fourth side stop 96 may be positioned to the sides (e.g., the left side and the right side) of the member 38′ to at least partially define the welding volume 56′ around (e.g., to the sides of) the member 38′ as the first electrode 12 approximates the second electrode 14′ in response to the welding force F1 and/or F2.The third side stop 94 may be housed within a third sleeve 98 and the fourth side stop 96 may be housed within a fourth sleeve 102.The third sleeve 98 and the fourth sleeve 100 may be connected to the second support structure 44.When the first electrode 12 approximates the second electrode 14′ and exert a clamping force to the member 38′ therebetween, the first side stop 52 may engage (e.g., contact) the third side stop 98 and the second side stop 54 may engage the fourth side stop 100.As such, the welding volume 56′ may be defined by the first engagement surface 22 of the first electrode 12, the interior surface 68 of the first side stop 52, an interior surface 102 of the third side stop 98, the interior surface 70 of the second side stop 54, the interior surface 104 of the fourth side stop 100 and the second engagement surface 22′ of the second electrode 14′.",
"The position of the first side stop 52 and the third side stop 94 with respect to the first sleeve 64 and the third sleeve 98, respectively, may automatically adjust position an axial position (e.g., parallel to the direction of the welding force F1 and F2) to constantly engage each other and contain the flow of molten metal 72′ within the welding volume 56′, as illustrated in FIG.",
"9.Similarly, the position of the second side stop 54 and the fourth side stop 96 may automatically adjust an axial position with respect to the second sleeve 66 and the fourth sleeve 100, respectively, to constantly engage each other and contain the flow of molten metal 72′ within the welding volume 56′.",
"For example, the third side stop 94 may be outwardly biased from within the third sleeve 98 and the fourth side stop 96 may be outwardly biased from within the fourth sleeve 100.In an example construction, the third side stop 94 may be connected within the third sleeve 98 by a third biasing element 108 (e.g., a spring) and the fourth side stop 96 may be connected within the fourth sleeve 100 by a fourth biasing element 110 (e.g., a spring).",
"Engaging surfaces of the first side stop 52 and the third side stop 94 may be substantially planar to make flush contact with each other and engaging surfaces the second side stop 54 and the fourth side stop 96 may be substantially planar to make flush contact with each other.",
"Referring to FIG.",
"10, the welded workpiece 58′ may have a shape substantially matching the shape of the welding volume 56′.",
"For example, welded workpiece 58′ may include a curved upper end 78′ substantially matching the curved first engagement surface 18 of the first electrode 12, a planar first (e.g., left) side 80′ substantially matching the planar interior surface 68 of the first side stop 52 and the interior surface 102 of the third side stop 94, a planar second (e.g., right) side 82′ substantially matching the planar interior surface 70 of the second side stop 54 and interior surface 104 of the fourth side stop 96 and a curved lower end 106 substantially matching the curved second engagement surface 22′ of the second electrode 14′.",
"For example, the welded workpiece 58′ may include a solidified portion of the plurality of strands 42′ of the member 38′ (e.g., a stranded cable).",
"Referring to FIG.",
"11, in another implementation, the workpiece 24′ may also include an auxiliary member 84′.",
"The auxiliary member 84′ may have a size and shape sufficient to at least partially surround the workpiece 24′.",
"For example, the auxiliary member 84′ may be a generally circular band 88′ having a continuous body of sufficient size and shape to completely surround (e.g., cover) the exterior surface 26′ of the member 38′ (e.g., a stranded cable) For example, the curved first engagement surface 18 of the first electrode 12 may contact at least a portion (e.g., an upper portion) of the exterior surface 26′ of the auxiliary member 84′ and the curved second engagement surface 22′ of the second electrode 14′ may contact at least a portion (e.g., a lower portion) of the exterior surface 26′ of the auxiliary member 84′ to focus electrical current toward the center of the workpiece 24′ in a similar manner as described above and illustrated in FIG.",
"9.Referring to FIG.",
"12, a fourth embodiment of the disclosed welding assembly, generally designated 200, may include a first (e.g., upper) electrode 212, a second (e.g., lower) electrode 214, a current generator 216, a width-determining fixture 236 and an electrically nonconductive material 202.The electrically nonconductive material 202 may be present in the welding assembly 200 as a first portion 206 of electrically nonconductive material 202 and a second portion 208 of electrically nonconductive material 202.With the exception of the presence of electrically nonconductive material 202, the welding assembly 200 may be configured in the same or similar manner as the welding assembly 10 shown in FIG.",
"1.Specifically, the first electrode 212 may include a first engagement surface 218 and optionally one or more cooling channels 230, the second electrode 214 may by axially opposed from the first electrode 212 and may include a second engagement surface 222 and optionally one or more cooling channels 232, the current generator 216 may include first and second terminals 213, 215 electrically coupled to the first and second electrodes 212, 214, and the width-determining fixture 236 may include side stops 252, 254, which may be biased out of associated sleeves 264, 266 toward the second electrode 214.The electrically nonconductive material 202 may be substantially electrically nonconductive, particularly relative to the electrical conductivity of the second electrode 214.Therefore, when the electrically nonconductive material 202 is positioned between an electrical conductor (e.g., the width-determining fixture 236 and/or the workpiece 224 (see FIG.",
"13)) and the second electrode 214, the electrically nonconductive material 202 may function as an electrical insulator therebetween.",
"Thus, when the electrically nonconductive material 202 is properly positioned relative to the second electrode 214, such as vertically below the side stops 252, 254 of the width-determining fixture 236 and sufficiently laterally outside of the side stops 252, 254, shunting of the welding current from the first electrode 212, through the width-determining fixture 236, and to the second electrode 214 (or vice versa) may be substantially inhibited (if not eliminated), thereby focusing the welding current into the workpiece 224 (FIG.",
"13) that is between the electrodes 212, 214 and the width-determining fixture 236.The electrically nonconductive material 202 may have a composition that renders the electrically nonconductive material 202 sufficiently hard and durable to withstand the clamping forces applied during welding.",
"Additionally, the composition of the electrically nonconductive material 202 may render the electrically nonconductive material 202 capable of withstanding welding temperatures without melting, decomposing or otherwise degrading.",
"As one general, non-limiting example, the electrically nonconductive material 202 may be (or may include) a ceramic material.",
"As one specific, non-limiting example, the electrically nonconductive material 202 may be (or may include) titanium nitride.",
"As another specific, non-limiting example, the electrically nonconductive material 202 may be (or may include) a machinable ceramic, such as MACOR® machinable glass ceramic commercially available from Corning Incorporated of Corning, N.Y.",
"The electrically nonconductive material 202 may have a cross-sectional thickness T sufficient to impart the required physical properties.",
"Depending on composition, if the cross-sectional thickness T is too thin, then the electrically nonconductive material 202 may be brittle.",
"For example, when the electrically nonconductive material 202 is a ceramic, a cross-sectional thickness T ranging from about 2 mm to about 10 mm or more may be sufficient for the intended purpose, and may facilitate securing the electrically nonconductive material 202 to the second electrode 214 with a mechanical fastener 294, as shown in FIG.",
"14.Referring to FIGS.",
"13-16, a fifth embodiment of the welding assembly 200 may be configured in the same or similar manner as the welding assembly 10 shown in FIGS.",
"2-5, with the exception of the presence of first and second portions 206,208 of electrically nonconductive material 202.With reference to FIGS.",
"13 and 14, the first electrode 212 may be mounted to a first support structure 244 and the second electrode 214 may be mounted to a second support structure 246.For example, the first support structure 244 and/or the second support structure 246 may be an arm or a tong.",
"The first support structure 244 and the second support structure 246 may be capable of approximating the first electrode 212 and a second electrode 214 along the longitudinal axis L (FIG.",
"13) of the welding assembly 200 to clamp the workpiece 224 between the first electrode 212 and a second electrode 214.The first electrode 212 and the second electrode 214 may exert a clamping force (e.g., a welding force) to the workpiece 224 positioned there between.",
"For example, the first electrode 212 and the second electrode 214 may exert a clamping force of approximately between 50 pounds and 100 pounds.",
"In one construction, the first support structure 244 may be moveable such that the first electrode 212 exerts a welding force F1 to the workpiece 224 and the second support structure 244 may be movable such that the second electrode 214 exerts an opposing welding force F2 to the workpiece 224, as illustrated in FIG.",
"14.In another construction, the first support structure 244 may be a movable such that the first electrode 212 exerts a welding force F1 to the workpiece 224 and the second support structure 246 may be stationary (e.g., an anvil).",
"The first support structure 244 may be connected to a first drive element 248 and/or the second support structure 246 may be connected to a second drive element 250.The first drive element 248 and/or the second drive element 250 may be any mechanism suitable to move (e.g., axially translate) the first support structure 244 and/or the second support structure 246 to approximate the first electrode 212 and the second electrode 214 and exert the clamping force to the workpiece 224.For example, the first drive element 248 and/or the second drive element 250 may be a hydraulic, pneumatic, servo-drive or mechanical drive mechanism (e.g., press).",
"A width-determining fixture 236 may be positioned between the first electrode 212 and the second electrode 214 to define a welding volume 256 (FIG.",
"14) around at least a portion of the workpiece 224.The welding volume 256 may have a width W1 (FIG.",
"14) defined by the width-determining fixture 236.The width-determining fixture 236 may at least partially enclose the workpiece 224 to prevent the flow (e.g., laterally outward flow) of molten or hot metal 272 (FIG.",
"15) during resistance welding of the workpiece 224.The width-determining fixture 236 may be capable of adjusting an axial position (see longitudinal axis L in FIG.",
"13) with respect to the first electrode 212 and/or the second electrode 214 to ensure sides of the welding volume 256 (FIG.",
"14) between the first electrode 212 and the second electrode 214 are completely enclosed regardless of the axial spacing of the electrodes 212, 214 during welding.",
"The position of the width-determining fixture 236 with respect to the workpiece 224 may define the width W2 of the welded workpiece 258, as shown in FIG.",
"16.The width-determining fixture may optionally be moved out laterally (sideways) when not welding and moved in when welding, instead of being moved up and down.",
"Such lateral in-and-out movements may also occur through tapered fitting tooling.",
"In one expression, the width-determining fixture 236 may be connected to or otherwise operably engaged with the first support structure 244 and/or the first drive mechanism 248 to approximate the second electrode 214 in response to the welding force F1 (FIG.",
"14).",
"In another expression, the width-determining fixture 236 may be connected to or otherwise operably engaged with the second support structure 246 and/or the second drive mechanism 250 to approximate the first electrode 212 in response to the welding force F2 (FIG.",
"14).",
"The workpiece 224 may include one or more members 238, 240 intended to be joined by resistive welding.",
"While two members 238, 240 of the workpiece 224 are shown in FIGS.",
"13 and 14, those skilled in the art will appreciate that additional members, such as an auxiliary member 284 (FIG.",
"17), may be included in the workpiece 224 without departing from the scope of the present disclosure.",
"The members 238, 240 of the workpiece 224 may be formed from any material capable of being joined by resistive heating.",
"As one general example, the members 238, 240 of the workpiece 224 may be formed from any metals or metal alloys capable of being joined by resistive heating.",
"As one specific example, members 238, 240 of the workpiece 224 may be formed from aluminum or aluminum alloys.",
"The member (e.g., a first member) 238 may include at least two strands 242.Each strand 242 may be formed from metal or metal alloy (e.g., aluminum or aluminum alloy).",
"For example, the member 238 may be formed from a plurality of elongated strands 242 bundled together and having a generally circular cross-sectional shape.",
"As a general, non-limiting example, the member 238 may be a metal wire, cable or rope.",
"As a specific, non-limiting example, the member 238 may be a 25 mm2, 40 mm2 or 50 mm2 stranded wire cable.",
"The member 240 (e.g., a second member) may be a terminal to which the member 238 (e.g., a stranded cable or wire) is joined by welding.",
"For example, the member 240 may be a connector terminal suitable for connection (e.g., mechanical and/or electrical connection) to another object (e.g., an aircraft frame, a vehicle frame or an electrical junction).",
"The first engagement surface 218 of the first electrode 212 may be formed into an arcuate (e.g., curved) surface defining a concave recess 220 (FIG.",
"13) configured to make flush contact with at least a portion of the exterior surface 226 of the member 238.For example, the first engagement surface 218 may be machined as a generally semicircular shape or an inverted U shape defining a generally semicircular recess 220 configured to make flush contact with at least a portion of the exterior surface 226 (e.g., a semi-circular portion of the circumferential exterior surface) of the member 238 (e.g., a stranded cable or wire).",
"However, various contours, including flat/planar, are contemplated for the first engagement surface 218.Referring to FIGS.",
"14 and 15, the width-determining fixture 236 may be positioned adjacent to the first electrode 212.In one construction, the width-determining fixture 236 may include a first (e.g., left) side stop 252 and a second (e.g., right) side stop 254 laterally opposed from the first side stop 252.The first side stop 252 may be positioned adjacent to (e.g., to the left of) the first electrode 212 and the second side stop 254 may be positioned adjacent to (e.g., to the right of) the first electrode 212 such that the first side stop 252 and the second side stop 254 are positioned to the sides (e.g., the left side and the right side) of the member 238 when the clamping force is exerted to the workpiece 224.The first side stop 252 and the second side stop 254 may be formed from a material having an electrical resistance greater than that of the first electrode 212 and the second electrode 214.For example, the first side stop 252 and the second side stop 54 may be formed from a high resistance metal.",
"As another example, the first side stop 252 and the second side stop 254 may be formed from an electrically insulating or non-conductive material, such as ceramic.",
"In general, the material of the first side stop 252 and the second side stop 254 may be selected to ensure the electrical current is directed through the workpiece 224.The first side stop 252 may be housed within a first sleeve 264 and the second side stop 254 may be housed within a second sleeve 266.The first sleeve 264 and the second sleeve 266 may be connected to the first support structure 244 such that the first side stop 252 and the second side stop 254 define the welding volume 256 around (e.g., to the sides of) the member 238 as the first electrode 212 approximates the second electrode 214 in response to the welding force F1.When the first electrode 212 approaches the second electrode 214 and exerts the clamping force to the member 238 therebetween, the first side stop 252 and the second side stop 254 may engage the member 240 (e.g., connector terminal) adjacent to the member 238 (e.g., stranded cable).",
"As such, the welding volume 256 may be defined by the first engagement surface 218 of the first electrode 212, an interior surface 268 of the first side stop 252, an interior surface 270 of the second side stop 254 and a portion of the exterior surface 234 (e.g., a top surface) of the member 240 positioned between the first side stop 252 and the second side stop 254.The position of the first side stop 252 and the second side stop 254 with respect to the first sleeve 264 and the second sleeve 266, respectively, may automatically adjust an axial position (see longitudinal axis L in FIG.",
"13) to constantly engage the exterior surface 234 of the member 240 and contain the flow of molten metal 272 (FIG.",
"15) within the welding volume 256.The first side stop 252 may be outwardly biased from within the first sleeve 264 and the second side stop 254 may be outwardly biased from within the second sleeve 266.For example, the first side stop 252 may be connected within the first sleeve 264 by a first biasing element 274 (e.g., a spring) and the second side stop 254 may be connected within the second sleeve 266 by a second biasing element 276 (e.g., a spring).",
"A bottom surface 284 (FIG.",
"13) of the first side stop 252 and the second side stop 254 may be substantially planar to make flush contact with the substantially planar exterior surface 234 of the member 240.As the first support structure 244 approximates the second support structure 246 (e.g., via the first drive element 248), the first electrode 212 may move toward and exert a welding force F1 (e.g., clamping force) upon the member 238 and the first side stop 252 and the second side stop 254 may simultaneously move toward and engage the member 240.As the first support structure 248 further approximates the second support structure 246, the welding force F1 exerted to the member 238 by the first electrode 212 and the second electrode 214 may increase as the first electrode 212 approximates the second electrode 214; however, the first side stop 252 and the second side stop 254 may be at least partially pushed into the first sleeve 264 and the second sleeve 266, respectively, to prevent damage to the member 240 while maintaining flush contact with the member 240 and containing the outward flow of the molten metal 272 (FIG.",
"15).",
"The second engagement surface 222 of the second electrode 214 may be a substantially planar surface configured to make substantially flush contact with at least a portion of the exterior surface 234 of the member 240.For example, the second engagement surface 222 may be machined as a substantially flat shape configured to make substantially flush contact with a substantially planar portion of the exterior surface 234 (e.g., a portion of a bottom surface) of the member 240 (e.g., a connector terminal).",
"However, various contours, including curved, are contemplated for the second engagement surface 222.The second engagement surface 222 of the second electrode 214 may define a first recess 290 and a second recess 292.The first portion 206 of the electrically nonconductive material 202 may be inserted into the first recess 290 and the second portion 208 of the electrically nonconductive material 202 may be inserted into the second recess 292.Therefore, the sizes and shapes of the first and second portions 206, 208 may closely correspond to the sizes and shapes of the recesses 290, 292.Optionally, mechanical fasteners 294, such as screws, pins and the like, may secure the first and second portions 206, 208 of the electrically nonconductive material 202 in the recesses 290, 292 of the second electrode 214.Other techniques for securing portions 206, 208 within corresponding recesses 290, 292, such as press fitting and adhering, are also contemplated.",
"The cross-sectional thicknesses of the first and second portions 206, 208 of the electrically nonconductive material 202 may closely correspond to the depth of the recesses 290, 292 such that the engagement surfaces 296, 298 of the first and second portions 206, 208 are substantially co-planar with the engagement surface 222 of the second electrode 214.Therefore, the exterior surface 234 (e.g., bottom surface) of the member 240 may make substantially flush contact with both the engagement surface 222 of the second electrode 214 and the engagement surfaces 296, 298 of the first and second portions 206, 208.The first and second portions 206, 208 of the electrically nonconductive material 202 may be positioned relative to the second electrode 214 such that only a central portion 299 of the second electrode 214 is in electrical contact with the workpiece 224.For example, each of the first and second portions 206, 208 of the electrically nonconductive material 202 may include an inner edge 302 and an outer edge 304.The inner edge 302 of each portion 206, 208 of electrically nonconductive material 202 may be substantially vertically aligned with, or laterally inward of, the interior surfaces 268, 270 of the first and second side stops 252, 254 of the width-determining fixture 236.The outer edge 304 of each portion 206, 208 of electrically nonconductive material 202 may extend laterally outside of member 240 of the workpiece 224.Thus, portions of the workpiece 224 (e.g., member 240) that are laterally outside of the width W1 (FIG.",
"14) of the welding volume 256 (FIG.",
"14) may be electrically insulated from the underlying second electrode 214 by the first and second portions 206, 208 of the electrically nonconductive material 202, thereby focusing the welding current into the welding volume 256 rather than dissipating the welding current laterally outward.",
"Furthermore, if the side stops 252, 254 of the width-determining fixture 236 were electrically conductive and were to extend vertically downward toward the engagement surface 222 of the second electrode (e.g., if there were no member 240 therebetween), the side stops 252, 254 would contact the first and second portions 206, 208 of the electrically nonconductive material 202 and would be electrically insulated from the second electrode 214, thereby inhibiting (if not eliminating) the formation of a shunt path through the side stops 252, 254.Referring to FIG.",
"16, the welded workpiece 258 may have a shape substantially matching the shape of the welding volume 256 (FIG.",
"14).",
"For example, the welded workpiece 258 may include a curved upper end 278 substantially matching the curved first engagement surface 218 of the first electrode 212, a planar first (e.g., left) side 280 substantially matching the planar first interior surface 268 of the first side stop 252 and a planar second (e.g., right) side 282 substantially matching the planar second interior surface 270 of the second side stop 254.The welded workpiece 258 may include a solidified portion of the plurality of strands 242 of the member 238 (e.g., a stranded cable) joined to the member 240 (e.g., a connector terminal) through resistive welding.",
"Referring to FIG.",
"17, the workpiece 224 may also include an auxiliary member 284.The auxiliary member 284 may have a size and shape sufficient to at least partially surround member 238.The auxiliary member 284 may be formed from a material having the same or similar chemistry as the members 238, 240, or from a material that is compatible with the material from which the members 238, 240 are formed.",
"For example, when the members 238, 240 are formed from aluminum alloys, the auxiliary member 284 may be formed from an aluminum alloy or appropriate aluminum alloy filler metal.",
"As illustrated in FIG.",
"17, in one implementation, the auxiliary member 284 may be a generally semi-circular band 286 having an arcuate (e.g.",
"curved) body (e.g., U-shaped) of sufficient size and shape to at least partially surround (e.g., cover) the exterior surface 226 of the member 238 (e.g., a stranded cable) and ends that extend to engage the exterior surface 234 of the member 240 (e.g., a connector terminal).",
"In other implementations, the auxiliary member 284 may have other shapes, such as circular (see FIG.",
"7).",
"Referring to FIG.",
"18, a sixth embodiment of the disclosed welding assembly, generally designated 400, may be configured in the same or similar manner as the welding assemblies 200 shown in FIGS.",
"12-17.However, rather than inserting the electrically nonconductive material 402 into recesses (see recesses 290, 292 in FIG.",
"14) in the second electrode 414, the electrically nonconductive material 402 may be positioned adjacent to, and laterally outside of, the second electrode 414.Therefore, the electrically nonconductive material 402 may define an engagement surface 496 (or engagement surfaces 496, 498) that supports a portion of the workpiece 424 (e.g., member 438, member 440 and/or an auxiliary member (not shown in FIG.",
"18)), yet electrically isolates a portion of the workpiece 424 (e.g., the portion of the workpiece outside of the width of the welding volume) from the second electrode 414.As one example, the electrically nonconductive material 402 of the welding assembly 400 may include two wing portions 406, 408 secured to laterally opposed sides 449, 451 of the second electrode 414 with mechanical fasteners 494.As another example, the electrically nonconductive material 402 of the welding assembly 400 may be a sleeve that extends (e.g., circumferentially) around the second electrode 414.Referring to FIG.",
"19, one embodiment of the disclosed method, generally designated 500, for welding stranded metal and metal alloys (e.g., stranded cables of wires) may begin by positioning a workpiece between a first electrode and a second electrode of a welding assembly, as shown at block 502.An auxiliary member may optionally be included in the workpiece.",
"As shown at block 504, the first electrode and/or the second electrode may apply a clamping force to the workpiece.",
"As shown at block 506, a width-determining fixture may be positioned between the first electrode and the second electrode around the workpiece to define a welding volume having a lateral width.",
"As shown at block 508, a welding current may be passed through the workpiece for a sufficient amount of time to raise the temperature of the workpiece to a welding temperature to liquefy the workpiece.",
"The welding current may be contained within the lateral width of the welding volume to focus the welding current into the workpiece.",
"Optionally, a cooling step may be introduced between the various steps of the method 500 or combined with the various steps of the method 500, such as combined with the current passing step 508.For example, the welded workpiece may be cooled by circulating cooling fluid through the fluid channels in the first and second electrodes while one or more of the first and second electrodes are engaged with the welded workpiece.",
"Although various embodiments of the disclosed welding assembly and method have been shown and described, modifications may occur to those skilled in the art upon reading the specification.",
"The present application includes such modifications and is limited only by the scope of the claims."
]
] |
Patent_15871448
|
[
[
"SRAM Circuits with Aligned Gate Electrodes",
"A device includes a Static Random Access Memory (SRAM) array, and an SRAM cell edge region abutting the SRAM array.",
"The SRAM array and the SRAM cell edge region in combination include first gate electrodes having a uniform pitch.",
"A word line driver abuts the SRAM cell edge region.",
"The word line driver includes second gate electrodes, and the first gate electrodes have lengthwise directions aligned to lengthwise directions of respective ones of the second gate electrodes."
],
[
"1.A device comprising: a Static Random Access Memory (SRAM) array; an SRAM cell-edge region abutting the SRAM array, wherein the SRAM cell-edge region is free from transistors therein, and the SRAM array and the SRAM cell-edge region in combination comprise first gate electrodes having a uniform pitch; and a word line driver abutting the SRAM cell-edge region, wherein the word line driver comprises second gate electrodes, and the first gate electrodes have lengthwise directions aligned to lengthwise directions of respective ones of the second gate electrodes.",
"2.The device of claim 1, wherein pitches of the second gate electrodes are equal to the uniform pitch, and the first gate electrodes and the second gate electrodes have a same width.",
"3.The device of claim 1, wherein a first one of the first gate electrodes is physically connected to a second one of the second gate electrodes to form a continuous gate electrode.",
"4.The device of claim 1, wherein the SRAM cell-edge region comprises an edge cell free from active devices therein, and the edge cell comprises a well pickup region, and wherein the word line driver comprises a transistor therein, and a continuous gate electrode in the first gate electrodes comprises a first part in the edge cell, and a second portion as a gate electrode of the transistor.",
"5.The device of claim 1, wherein the first gate electrodes comprise a continuous gate electrode continuously extending from a first edge to a second edge of the SRAM cell-edge region, with the first edge and the second edge being on opposite sides of the SRAM array.",
"6.The device of claim 5, wherein the continuous gate electrode continuously extends into a plurality of SRAM edge cells that are in a same row of the SRAM cell-edge region.",
"7.The device of claim 1 further comprising an Input-Output (IO) block comprising third gate electrodes parallel to the first gate electrodes, wherein the first gate electrodes and the third gate electrodes in combination form an integral unit having the uniform pitch.",
"8.The device of claim 7, wherein the first gate electrodes comprise a first boundary gate electrode, the third gate electrodes comprise a second boundary gate electrode immediately neighboring the first boundary gate electrode, and the first boundary gate electrode and the second boundary gate electrode have a pitch equal to the uniform pitch.",
"9.The device of claim 7, wherein pitches of the third gate electrodes are equal to the uniform pitch.",
"10.A device comprising: a Static Random Access Memory (SRAM) array comprising a plurality of SRAM cells; an SRAM cell-edge region encircling the SRAM array; first gate electrodes extending into both the SRAM array and the SRAM cell-edge region, wherein the first gate electrodes have a uniform pitch; and an Input-Output (IO) block comprising second gate electrodes parallel to the first gate electrodes, wherein a first boundary gate electrode in the first gate electrodes and a second boundary gate electrode in the second gate electrodes have a pitch equal to the uniform pitch.",
"11.The device of claim 10, wherein pitches of the second gate electrodes are equal to the uniform pitch.",
"12.The device of claim 10, wherein the first boundary gate electrode extends from a first boundary to a second boundary of the IO block, and the first boundary and the second boundary are opposite boundaries of the IO block.",
"13.The device of claim 12, wherein the first boundary gate electrode is a dummy gate electrode.",
"14.The device of claim 10 further comprising a word line driver abutting the SRAM cell-edge region, wherein the word line driver comprises third gate electrodes, and the first gate electrodes and the third gate electrodes have a same pitch, a same width, and a same spacing.",
"15.The device of claim 14, wherein one of the first gate electrodes is physically connected to one of the third gate electrodes to form a continuous gate electrode.",
"16.The device of claim 10, wherein the first gate electrodes comprise a continuous gate electrode continuously extending from a first edge to a second edge of the SRAM cell-edge region, with the first edge and the second edge being opposite edges of the SRAM cell region.",
"17.A device comprising: a Static Random Access Memory (SRAM) array; an SRAM cell-edge region abutting the SRAM array; a word line driver abutting the SRAM array; and a plurality of gate electrodes parallel to each other and having a uniform pitch, wherein the plurality of gate electrodes extend into the SRAM array, the SRAM cell-edge region, and the word line driver, and wherein the plurality of gate electrodes comprises a continuous gate electrode continuously extending into the SRAM cell-edge region and the word line driver.",
"18.The device of claim 17, wherein portions of the plurality of gate electrodes in the SRAM array and the SRAM cell-edge region have a uniform pitch.",
"19.The device of claim 18, wherein pitches of the portions of the plurality of gate electrodes in the word line driver are equal to the uniform pitch.",
"20.The device of claim 17 further comprising an Input-Output (IO) block, with the plurality of gate electrodes comprising a portion extending into the IO block and having pitches equal to the uniform pitch."
],
[
"<SOH> BACKGROUND <EOH>Static Random Access Memory (SRAM) is commonly used in integrated circuits.",
"SRAM cells have the advantageous feature of holding data without a need of refreshing.",
"SRAM cells may include different numbers of transistors, and are often accordingly referred to by the number of transistors, for example, six-transistor (6-T) SRAM, eight-transistor (8-T) SRAM, and the like.",
"The transistors typically form a data latch for storing a bit.",
"Additional transistors may be added to improve the access to the transistors.",
"SRAM cells are typically arranged as an array having rows and columns.",
"Typically, each row of the SRAM cells is connected to a word-line, which determines whether the current SRAM cell is selected or not.",
"Each column of the SRAM cells is connected to a bit-line (or a pair of bit-lines), which is used for storing a bit into, or read from, the SRAM cell.",
"SRAM array are connected to a plurality of peripheral circuits, such as word line drivers and input/output circuits such as read/write circuits, which are used for writing data into the SRAM array, and reading data out of the SRAM array."
],
[
"<SOH> BRIEF DESCRIPTION OF THE DRAWINGS <EOH>Aspects of the present disclosure are best understood from the following detailed description when read with the accompanying figures.",
"It is noted that, in accordance with the standard practice in the industry, various features are not drawn to scale.",
"In fact, the dimensions of the various features may be arbitrarily increased or reduced for clarity of discussion.",
"FIG.",
"1 illustrates a schematic top view of an SRAM array, an SRAM edge cell region, an Input/output (IO) block, a word line driver, and respective gate electrodes in accordance with some embodiments.",
"FIG.",
"2 illustrates a schematic top view of an SRAM array and respective gate electrodes in accordance with some embodiments.",
"FIG.",
"3 illustrates an exemplary SRAM cell and respective gate electrodes in accordance with some embodiments.",
"FIG.",
"4 illustrates SRAM edge cells in an SRAM edge cell region and the respective gate electrodes in accordance with some embodiments.",
"FIG.",
"5 illustrates an exemplary SRAM edge cell and respective gate electrodes in accordance with some embodiments.",
"FIGS.",
"6 and 7 illustrate boundary regions between an IO block and an SRAM edge cell region in accordance with some embodiments.",
"FIGS.",
"8 and 9 illustrate boundary regions between a word line driver and an SRAM edge cell region in accordance with some embodiments.",
"FIG.",
"10 illustrates a schematic top view of an SRAM array, an IO block, a word line driver, and respective gate electrodes in accordance with some embodiments.",
"detailed-description description=\"Detailed Description\" end=\"lead\"?"
],
[
"PRIORITY CLAIM AND CROSS-REFERENCE This application is a continuation of U.S. patent application Ser.",
"No.",
"15/202,053, entitled “SRAM Circuits with Aligned Gate Electrodes,” filed Jul.",
"5, 2016, which claims the benefit of the following provisionally filed U.S. Patent application: Application Ser.",
"No.",
"62/299,247, filed Feb. 24, 2016, and entitled “SRAM & Logic Poly Fully Aligned,” which application is hereby incorporated herein by reference.",
"BACKGROUND Static Random Access Memory (SRAM) is commonly used in integrated circuits.",
"SRAM cells have the advantageous feature of holding data without a need of refreshing.",
"SRAM cells may include different numbers of transistors, and are often accordingly referred to by the number of transistors, for example, six-transistor (6-T) SRAM, eight-transistor (8-T) SRAM, and the like.",
"The transistors typically form a data latch for storing a bit.",
"Additional transistors may be added to improve the access to the transistors.",
"SRAM cells are typically arranged as an array having rows and columns.",
"Typically, each row of the SRAM cells is connected to a word-line, which determines whether the current SRAM cell is selected or not.",
"Each column of the SRAM cells is connected to a bit-line (or a pair of bit-lines), which is used for storing a bit into, or read from, the SRAM cell.",
"SRAM array are connected to a plurality of peripheral circuits, such as word line drivers and input/output circuits such as read/write circuits, which are used for writing data into the SRAM array, and reading data out of the SRAM array.",
"BRIEF DESCRIPTION OF THE DRAWINGS Aspects of the present disclosure are best understood from the following detailed description when read with the accompanying figures.",
"It is noted that, in accordance with the standard practice in the industry, various features are not drawn to scale.",
"In fact, the dimensions of the various features may be arbitrarily increased or reduced for clarity of discussion.",
"FIG.",
"1 illustrates a schematic top view of an SRAM array, an SRAM edge cell region, an Input/output (IO) block, a word line driver, and respective gate electrodes in accordance with some embodiments.",
"FIG.",
"2 illustrates a schematic top view of an SRAM array and respective gate electrodes in accordance with some embodiments.",
"FIG.",
"3 illustrates an exemplary SRAM cell and respective gate electrodes in accordance with some embodiments.",
"FIG.",
"4 illustrates SRAM edge cells in an SRAM edge cell region and the respective gate electrodes in accordance with some embodiments.",
"FIG.",
"5 illustrates an exemplary SRAM edge cell and respective gate electrodes in accordance with some embodiments.",
"FIGS.",
"6 and 7 illustrate boundary regions between an IO block and an SRAM edge cell region in accordance with some embodiments.",
"FIGS.",
"8 and 9 illustrate boundary regions between a word line driver and an SRAM edge cell region in accordance with some embodiments.",
"FIG.",
"10 illustrates a schematic top view of an SRAM array, an IO block, a word line driver, and respective gate electrodes in accordance with some embodiments.",
"DETAILED DESCRIPTION The following disclosure provides many different embodiments, or examples, for implementing different features of the invention.",
"Specific examples of components and arrangements are described below to simplify the present disclosure.",
"These are, of course, merely examples and are not intended to be limiting.",
"For example, the formation of a first feature over or on a second feature in the description that follows may include embodiments in which the first and second features are formed in direct contact, and may also include embodiments in which additional features may be formed between the first and second features, such that the first and second features may not be in direct contact.",
"In addition, the present disclosure may repeat reference numerals and/or letters in the various examples.",
"This repetition is for the purpose of simplicity and clarity and does not in itself dictate a relationship between the various embodiments and/or configurations discussed.",
"Further, spatially relative terms, such as “underlying,” “below,” “lower,” “overlying,” “upper” and the like, may be used herein for ease of description to describe one element or feature's relationship to another element(s) or feature(s) as illustrated in the figures.",
"The spatially relative terms are intended to encompass different orientations of the device in use or operation in addition to the orientation depicted in the figures.",
"The apparatus may be otherwise oriented (rotated 90 degrees or at other orientations) and the spatially relative descriptors used herein may likewise be interpreted accordingly.",
"Static Random Access Memory (SRAM) array and peripheral circuits of the SRAM array are provided in accordance with various exemplary embodiments.",
"Some variations of some embodiments are discussed.",
"Throughout the various views and illustrative embodiments, like reference numbers are used to designate like elements.",
"FIG.",
"1 illustrates a schematic top view of SRAM array 110, SRAM edge cell regions 100, Input/output (IO) block 200, and word line driver 300 in accordance with some embodiments of the present disclosure.",
"SRAM array 110 includes SRAM cells arranged as a plurality of rows and a plurality of columns.",
"More details of SRAM array 110 are provided in FIGS.",
"2 and 3 in accordance with some exemplary embodiments of the present disclosure.",
"SRAM edge cell region 100 abuts SRAM cell array 100 and include SRAM edge cells.",
"In accordance with some embodiments, as shown in FIG.",
"1, SRAM edge cell region 100 extends on all four sides (in +X, −X, +Y, and −Y directions) of SRAM array 110, and hence forms a ring-shaped region encircling SRAM array 110.The inner edges of the ring-shaped SRAM edge cell region 100 abut the respective outer edges of SRAM array 110.Accordingly, the inner edges of SRAM edge cell region 100 abut the edges of the SRAM cells 102 (FIG.",
"2) in SRAM array 110.In accordance with alternative embodiments, SRAM edge cell region 100 are formed on one side, two sides, or three sides of SRAM array 110 in any combination, while the remaining sides of SRAM array 110 has no SRAM edge cells abutting them.",
"For example, SRAM edge cell region 100 may extend on the +X and +Y sides of SRAM array 110, and not on the −X and/or −Y sides of SRAM array 110.In yet alternative embodiments, SRAM edge cell region 100 includes portions on the +X side, while there is no SRAM edge cells on the −X side, +Y side, and −Y side, of SRAM array 110.SRAM array 110 includes a plurality of SRAM cells 102 arranged as a plurality of rows and a plurality of columns, and exemplary SRAM cells 102 are schematically illustrated in FIGS.",
"2 and 3.SRAM edge cell region 100 may include edge cells 104 (FIGS.",
"4 and 5).",
"Edge cells 104 are sometimes referred to as strap cells 104, which include the pickup regions of p-well regions and n-well regions, and the metal lines (such as word lines, bit lines, VDD power lines, VSS power lines, etc.)",
"connected between SRAM cells 102 and peripheral circuits such as word line drivers 300.IO block 200, and power sources (not shown).",
"Referring back to FIG.",
"1, SRAM peripheral circuits for supporting SRAM array 110 include IO block 200 and word line driver 300.In accordance with some embodiments of the present disclosure, IO block 200 includes the circuits that are configured to read the data stored in SRAM array 110, and the circuits that are configured to write data into SRAM array 110.In accordance with some embodiments of the present disclosure, IO block 200 includes, and is not limited to, write driver(s), read sensing amplifier(s), multiplexers, and the like.",
"IO block 200 is electrically coupled to SRAM array 110 through metal lines that are formed in the metallization layers of the respective chips.",
"The metal lines include, and are not limited to, bit lines (not shown), wherein the data read from and written into SRAM array 110 are carried through the bit lines.",
"The bit lines may have lengthwise directions parallel to the +Y/−Y directions.",
"As also shown in FIG.",
"1, word line driver 300 is configured to provide word line signals to the word lines of SRAM array 110, so that a selected row of SRAM cells in SRAM array 110 may be selected or deselected for a read or write operation.",
"For example, when a specific row of SRAM array 110 is selected for a read or write operation, word line driver 300 may supply a positive voltage to the word line of the respective row in order to select the row.",
"Conversely, when a specific row of SRAM array 110 is not selected for the read or write operation, word line driver 300 may supply a low voltage (such as the electrical ground voltage) to the word line of the respective row in order to deselect the row.",
"Word line driver 300 is electrically coupled to SRAM cells in SRAM array 110 through metal lines that are formed in the metallization layers of the respective chips, wherein the metal lines include, and are not limited to, word lines (not shown).",
"The word lines may have lengthwise directions parallel to the +Y/−Y directions.",
"FIG.",
"1 also schematically illustrates a plurality of gate electrodes 112, 212, and 312, which include active gate electrodes of transistors and dummy gate electrodes that do not form the gate electrodes of any transistor.",
"In accordance with some embodiments of the present disclosure, gate electrodes 112, 212, and 312 are formed of polysilicon.",
"In accordance with alternative embodiments, gate electrodes 112, 212, and 312 are formed of other conductive materials such as metal or metal alloy, metal silicide, metal nitride, or the like.",
"Furthermore, some parts of the gate electrodes 112, 212, and 312 may be formed of polysilicon, while some other parts of the gate electrodes 112, 212, and 312 are replacement gates, wherein metals are used to replace the polysilicon.",
"It is appreciated that FIG.",
"1 illustrates the likely positions of gate electrodes 112, 212, and 312.To form functional circuits, the illustrated continuous gate electrodes 112, 212, and 312, which are illustrated as extending continuously throughout regions 100, 200, and 300, may actually be cut apart into shorter pieces.",
"For example, as shown in FIG.",
"3, gate electrodes 112 of the transistors in SRAM cell 102 have breaks therebetween, so that the gate electrodes of different transistors may be electrically decoupled from each other when needed.",
"Otherwise, the gate electrode of pass-gate transistor PG-1 will be undesirably connected to the gate electrodes of pull-up transistor PU-2 and pull-down transistor PD-2, and the gate electrode of pass-gate transistor PG-2 will be undesirably connected to the gate electrodes of pull-up transistor PU-1 and pull-down transistor PD-1, hence causing circuit failure.",
"For simplicity, in FIG.",
"1 and the subsequent figures, the breaks for breaking gate electrodes 112 are not illustrated, while they may exist.",
"Similarly, gate electrodes 212 and 312 may also be broken into shorter pieces to form functional circuits in regions 200 and 300.The gate electrodes that are broken into pieces, however, are allocated at the positions as illustrated in Figures of the present disclosure.",
"In the design and manufacturing process of the illustrated circuits on physical wafers, gate electrodes 112, 212, and 312 may be initially formed as long and continuous strips as illustrated in FIG.",
"1, and then etched (cut) into shorter pieces as needed in subsequent processes.",
"SRAM array 110 and SRAM edge cell region 100 have gate electrodes 112, which have a uniform pitch P1.Alternatively stated, all gate electrodes 112 of SRAM array 110 and SRAM edge cell region 100 may have an equal spacing and an equal width.",
"Gate electrodes 112 may have same or different lengths, and extend into various regions.",
"For example, some, but not all, gate electrodes 112 (such as 112′) may continuously extend from edge 100B to the opposite edge 100A of SRAM edge cell region 100, with no break therein.",
"Some of gate electrodes 112 may continuously (physically) extend from SRAM array 110 into SRAM edge cell region 100.Some other electrodes 112 may have breaks in regions 100 and/or 110.In addition, if some strap cells are embedded in SRAM array 110, there may also be some gate electrodes 112 (schematically illustrated as 112″ as an example) that continuously extend from the SRAM edge cell region 100 on the left side of SRAM array 110 into SRAM array 110, and further into the SRAM edge cell region 100 on the right side of SRAM array 110, with no break in gate electrodes 112″.",
"Clearly, those gate electrodes 112 that form the gate electrodes of the transistors in SRAM array 110 will have breaks therein.",
"Word line driver 300 has gate electrodes 312, which also have uniform pitch P1.The lengthwise directions of gate electrodes 312 are aligned to the respective lengthwise directions of gate electrodes 112.Furthermore, the spacings and the widths of gate electrodes 312 may also be the same as the corresponding ones of gate electrodes 112.SRAM edge cell region 100 abuts word line driver 300, with no spacing separates them from each other.",
"Accordingly, gate electrodes 112 and 312 may include various connecting schemes.",
"For example, some of gate electrodes 112 may continuously extend into word line driver 300 and hence are physically connected to the respective gate electrodes 312.Some of gate electrodes 312 may be physically connected to the gate electrodes 112 that continuously extend into SRAM edge cell 100.Some other gate electrodes 112 may be separate from the respective (aligning) gate electrodes 312 at the interface between SRAM edge cell region 100 and word line driver 300, as is shown in FIG.",
"8.Furthermore, some gate electrodes such 112′ are also connected to the gate electrodes 312 that extend from edge 300B to the opposite edge 300A.",
"Accordingly, these gate electrodes 112′ may penetrate through both regions 100 and 300.IO block 200 has gate electrodes 212, which have uniform pitch P2.In accordance with some embodiments of the present disclosure, uniform pitch P2 is equal to uniform pitch P1.In accordance with alternative embodiments, uniform pitch P2 is different from pitch P1.Also, the boundary gate electrode 112 and the boundary gate electrodes 212 that are immediately neighboring each other has a spacing equal to the spacings of gate electrodes 112 and/or the spacings of gate electrodes 212.Alternatively stated, the boundary gate electrode 112B and its immediate neighboring boundary gate electrode 212B also have the pitch (marked as P1/P2) equal to pitch P1 or pitch P2, which may be equal to, or different from, each other.",
"Accordingly, SRAM edge cell region 100 abuts IO block 200, with no spacing separating them from each other.",
"FIG.",
"2 illustrates an exemplary top view of SRAM array 110, which includes SRAM cells 102 arranged as a plurality of rows and columns.",
"FIG.",
"3 illustrates a part of the layout of an exemplary SRAM cell 102.It is appreciated that SRAM cells 102 may adopt many different designs, including and not limited to, six-transistor SRAM cell, eight-transistor SRAM cell, ten-transistor SRAM cell, single port SRAM cell, two port SRAM cell, dual-port SRAM cell, etc.",
"In accordance with some embodiments of the present disclosure, SRAM cell 102 includes pass-gate transistors PG-1 and PG-2, pull-up transistors PU-1 and PU-2, and pull-down transistors PD-1 and PD-2, wherein pull-up transistors PU-1 and PU-2 and pull-down transistors PD-1 and PD-2 are connected to form a latch storing a bit.",
"Gate electrodes 112 extend in the X direction, while active regions (which may be semiconductor fins) 114 extending in the Y direction.",
"As shown in FIG.",
"2, gate electrodes 112 are broken into short pieces, while the positions of the broken gate electrodes 112 are aligned to the positions of gate electrodes 112 as shown in FIG.",
"1, wherein all gate electrodes 112 throughout SRAM array 110 and edge cell region 100 have uniform pitch P1.Referring back to FIG.",
"2, SRAM cells 102 may have structures identical to each other (while some SRAM cells 102 may be mirrored/flipped from others).",
"The edges of SRAM array 110 are defined by the outmost edges of the edge SRAM cells.",
"For example, left edge 110B is defined by the left edges of the left-most SRAM cells 102, and right edge 110A is defined by the right edges of the right-most SRAM cells 102.In accordance with some exemplary embodiments of the present disclosure, the entire SRAM array 110 is occupied by SRAM cells 102, with no strap cells therein.",
"In accordance with alternative embodiments, strap cells are placed in SRAM array 110.The strap cells may be essentially the same as edge cell 104 as shown in FIG.",
"5.In accordance with some exemplary embodiments, a row of strap cells may be placed every 4 rows, 8 rows, or more rows of SRAM cells 102.The strap cells in SRAM array 110 may be used for well pickup, for running metal lines that don't fit into SRAM cells 102, which metal lines may include power mesh (such as for VDD and VSS power mesh).",
"FIG.",
"4 illustrates an exemplary top view of SRAM edge cell region 100, which includes SRAM edge cells 104 abutting (and possibly surrounding) SRAM array 110.Edge cells 104 may be used for various purposes such as forming well pickup regions for the p-well regions and n-well regions, on which the transistors of SRAM cells 102 (FIG.",
"2) are formed.",
"Edge cells 104 may not include any active device such as transistor and diode.",
"For example, FIG.",
"5 illustrates an exemplary edge cell 104, which includes well pickup regions 106 for the pickup of p-well regions (for example, the p-well region in FIG.",
"3), and well pickup region(s) 108 for the pickup of n-well regions.",
"Well pickup regions 106 and 108 are heavily doped active regions (which may be semiconductor fins).",
"The well pickup regions of n-well regions are heavily doped n-type regions, while the well pickup regions of p-well regions are heavily doped p-type regions.",
"In accordance with some embodiments, assuming the edge cell 104 shown in FIG.",
"5 is in a same column as the SRAM cell 102 as shown in FIG.",
"3, the left P-well region in FIG.",
"5 may be connected to the left P-well region in FIG.",
"3 as a continuous P-well region, and hence the well pickup region 106 (marked as 106A) is used for picking up the left P-well region of the SRAM cell 102 shown in FIG.",
"3.Similarly, the N-well region in FIG.",
"5 may be connected to the N-well region in FIG.",
"3 as a continuous N-well region, and hence the well pickup region 108 is used for picking up the N-well region of the SRAM cell 102 in FIG.",
"3.FIG.",
"5 also illustrates exemplary metal lines 116, which are in a metal layer.",
"Depending on where the edge cell 104 is located, metal lines 116 may be word lines, bit lines, VDD lines, and/or VSS lines.",
"The metal lines in edge cell 104 also include metal lines having lengthwise directions parallel to the X direction and metal lines (not shown) having lengthwise directions parallel to the Y direction, wherein the metal lines extending in different directions are allocated in different metal layers such as metal layer 1, metal layer 2, metal layer 3, etc..",
"In accordance with some embodiments of the present disclosure, some or all of SRAM edge cells 104 aligned to the same row may have the same structure (which may be aligned to the same direction or mirrored) or different structures, and some or all of SRAM edge cells 104 aligned to the same column may have the same structure (which may be aligned to the same direction or mirrored) or different structures.",
"FIG.",
"6 illustrates a top view of a boundary region of SRAM edge cell region 100 and IO block 200 in accordance with some embodiments of the present disclosure, wherein the boundary region is schematically illustrated as region 500 in FIG.",
"1.IO block 200 include transistor 214, which includes gate electrodes 212A and active region 214A.",
"Active region 216A forms the channel and the (common) source/drain regions of transistor 214.Transistor 214 includes the boundary gate electrode 212B as its gate.",
"Alternatively stated, transistor 214 includes the boundary gate electrode 212B that is closest to SRAM edge cells 104, with no additional gate electrode 212 between transistor 214 and edge cells 104.FIG.",
"7 illustrates a top view of a boundary region of SRAM edge cell region 100 and IO block 200 in accordance with some embodiments of the present disclosure, wherein the boundary region may be region 500 in FIG.",
"1.These embodiments are similar to the embodiments in FIG.",
"6, except dummy gate electrode 212B is located between transistor 214 and SRAM edge cells 104.Dummy gate electrode 212B may be considered as a part of IO block 200.In accordance with some embodiments, dummy gate electrode 212B extends all the way from edge 200A to the opposite edge 200B of IO block 200, with no break in dummy gate electrode 212B.",
"In accordance with some embodiments of the present disclosure, dummy gate electrode(s) 112′, which are parts of SRAM edge cells 104, also extend from edge 100A to the opposite edge 100B (FIG.",
"1) of SRAM edge cell region 100.In accordance with alternative embodiments, gate electrode 112′ is broken into pieces.",
"FIG.",
"8 illustrates some details of the structure shown in FIG.",
"1 in accordance with some embodiments, wherein gate electrodes 112 and 312 and the respective transistors are illustrated.",
"In accordance with some embodiments of the present disclosure, gate electrodes 112 are separated from gate electrodes 312 by space 10.Space 10 is formed by cutting the otherwise connected gate electrodes 112 and 312, and hence is sometimes referred to as cut-poly 10.Space 10 extends from edge 100C to edge 100D of SRAM edge cell region 100.It is observed that since space 10 is formed by cutting the originally interconnected gate electrodes 112 and 312, gate electrodes 112 and 312 have lengthwise directions aligned to each other, and have the same width, the same spacing, and the same pitch.",
"Word line driver 300 includes exemplary transistors 314A, 314B, and 314C.",
"Various allocation schemes of gate electrodes 312 relative to space 10 may be adopted.",
"For example, gate electrode 312A of transistor 314A may be spaced apart from space 10 by an additional space 14.Gate electrode 312B of transistor 314B may be spaced apart from space 10 by some discrete portions of dummy gate electrodes 312′.",
"Gate electrode 312C of transistor 314B, on the other hand, may extend all the way to space 10.In accordance with some embodiments of the present disclosure, in addition to space 10, space 12 may also be formed in SRAM edge cells 104, and extend in the Y direction.",
"Space 12 may also extend from edge 100C to edge 100D of SRAM edge cell region 100.FIG.",
"9 illustrates some details of the structure shown in FIG.",
"1 in accordance with some embodiments, wherein gate electrodes 112 and 312 and the respective transistors are illustrated.",
"Some gate electrodes 112 and the respective aligned gate electrodes 312 may be connected to each other with no breaking.",
"For example, the gate electrodes 312A of transistor 314A is connected to the respective gate electrodes 112A, wherein a break occurs inside edge cell region 100 in order to separate the gate electrode 312A from the rest of gate electrodes 112A.",
"On the other hand, break 320 is formed to separate the gate electrodes of transistor 314B from gate electrode portions 312D.",
"In accordance with some embodiments, some gate electrodes 314D and the respective connecting gate electrodes 112 form continuous gate electrodes that continuously extend from word line driver 300 all the way to SRAM array 110, as shown in FIG.",
"9.FIG.",
"10 illustrates an exemplary top view of SRAM array 110, IO block 200, and word line driver 300 in accordance with some embodiments.",
"These embodiments are similar to the embodiments shown in FIG.",
"1, except no SRAM edge cell region is formed.",
"Rather, SRAM array 110 abuts IO block 200 and word line driver 300.The details of gate electrodes 112, 212, and 312 are essentially the same as in the embodiments shown in FIGS.",
"1 through 9 (when applicable), and hence are not repeated herein.",
"In accordance with some embodiments, some gate electrodes 312 are continuously connected to some gate electrodes 112 (referring to FIG.",
"3) in SRAM cells 102.Furthermore, the boundary gate electrode 112 (neighboring IO block 200) are used to form the gate electrodes of the transistors (refer to FIG.",
"3) in SRAM cells.",
"In accordance with some embodiments, strap cells are formed between the rows and/or columns of the SRAM cells in SRAM array 110, and may be formed every repeated number of rows and/or columns.",
"The embodiments of the present disclosure have some advantageous features.",
"By abutting SRAM cell edge region 100 (or SRAM array 110) to word line driver 300 and IO block 200, the spaces between these regions, which spaces are adopted in conventional SRAM circuitry, are eliminated, and hence the chip area occupied by the entire SRAM circuity is reduced.",
"In addition, by forming gate electrodes in regions/circuits 100, 200, and 300 to have a uniform pitch, the pattern-loading effect in the formation of gate electrodes is reduced, resulting in an SRAM circuitry with more uniform performance.",
"In accordance with some embodiments of the present disclosure, a device includes an SRAM array, and an SRAM cell edge region abutting the SRAM array.",
"The SRAM array and the SRAM cell edge region in combination include first gate electrodes having a uniform pitch.",
"A word line driver abuts the SRAM cell edge region.",
"The word line driver includes second gate electrodes, and the first gate electrodes have lengthwise directions aligned to lengthwise directions of respective ones of the second gate electrodes.",
"In accordance with some embodiments of the present disclosure, a device includes an SRAM array including a plurality of SRAM cells.",
"An SRAM cell edge region abuts the SRAM array.",
"The SRAM array and the SRAM cell edge region in combination have first gate electrodes having a uniform pitch.",
"The first gate electrodes have a first boundary gate electrode.",
"An IO block includes second gate electrodes parallel to the first gate electrodes and having the uniform pitch.",
"The second gate electrodes include a second boundary gate electrode immediately neighboring the first boundary gate electrode, and the first boundary gate electrode and the second boundary gate electrode have a pitch equal to the uniform pitch.",
"In accordance with some embodiments of the present disclosure, a device includes an SRAM array including first gate electrodes having a uniform pitch.",
"The first gate electrodes have a first boundary gate electrode.",
"A word line driver abuts the SRAM cell edge region.",
"The word line driver includes second gate electrodes, and the first gate electrodes have lengthwise directions aligned to lengthwise directions of respective ones of the second gate electrodes.",
"An IO block includes third gate electrodes parallel to the first gate electrodes and having the uniform pitch.",
"The third gate electrodes include a second boundary gate electrode immediately neighboring the first boundary gate electrode.",
"A pitch of the first boundary gate electrode and the second boundary gate electrode is equal to a pitch of two neighboring ones of the first gate electrodes.",
"The foregoing outlines features of several embodiments so that those skilled in the art may better understand the aspects of the present disclosure.",
"Those skilled in the art should appreciate that they may readily use the present disclosure as a basis for designing or modifying other processes and structures for carrying out the same purposes and/or achieving the same advantages of the embodiments introduced herein.",
"Those skilled in the art should also realize that such equivalent constructions do not depart from the spirit and scope of the present disclosure, and that they may make various changes, substitutions, and alterations herein without departing from the spirit and scope of the present disclosure."
]
] |
Patent_15871450
|
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